WorldWideScience

Sample records for cleaning packaged semiconductor

  1. NICE3 SO3 Cleaning Process in Semiconductor Manufacturing

    International Nuclear Information System (INIS)

    Blazek, Steve

    1999-01-01

    This fact sheet explains how Anon, Inc., has developed a novel method of removing photoresist--a light-sensitive material used to produce semiconductor wafers for computers--from the computer manufacturing process at reduced cost and greater efficiency. The new technology is technically superior to existing semiconductor cleaning methods and results in reduced use of hazardous chemicals

  2. Thermal Management of Power Semiconductor Packages - Matching Cooling Technologies with Packaging Technologies (Presentation)

    Energy Technology Data Exchange (ETDEWEB)

    Bennion, K.; Moreno, G.

    2010-04-27

    Heat removal for power semiconductor devices is critical for robust operation. Because there are different packaging options, different thermal management technologies, and a range of applications, there is a need for a methodology to match cooling technologies and package configurations to target applications. To meet this need, a methodology was developed to compare the sensitivity of cooling technologies on the overall package thermal performance over a range of power semiconductor packaging configurations. The results provide insight into the trade-offs associated with cooling technologies and package configurations. The approach provides a method for comparing new developments in power semiconductor packages and identifying potential thermal control technologies for the package. The results can help users select the appropriate combination of packaging configuration and cooling technology for the desired application.

  3. 78 FR 53479 - Certain Laundry and Household Cleaning Products and Related Packaging

    Science.gov (United States)

    2013-08-29

    ... INTERNATIONAL TRADE COMMISSION [Inv. No. 337-TA-891] Certain Laundry and Household Cleaning Products and Related Packaging AGENCY: U.S. International Trade Commission. ACTION: Notice. SUMMARY: Notice... certain laundry and household cleaning products and packaging thereof by reason of trademark infringement...

  4. REVIEW OF CLEANING SOLUTIONS FOR USE ON COMPONENTS OF THE 9975 SHIPPING PACKAGE

    Energy Technology Data Exchange (ETDEWEB)

    Daugherty, W.

    2013-09-30

    Several candidate cleaning products have been reviewed for use as a disinfectant on 9975 shipping package components which contain or have contacted mold. Following review of the compatibility of these products with each component, ammonia (ammonium hydroxide diluted to 1.5 wt% concentration) appears compatible with all package components that it might contact. Each of the other candidate products is incompatible with one or more package components. Accordingly, ammonia is recommended for this purpose. It is further recommended that all components which are disinfected be subsequently rinsed with di-ionized or distilled water.

  5. A study on the performance advancement of teat algorithm for defects in semiconductor packages

    Energy Technology Data Exchange (ETDEWEB)

    Kim, Jae Yeol; Kim, Chang Hyun; Yang, Dong Jo; Ko, Myung Soo [Chosun University, Gwangju (Korea, Republic of); You, Sin [Computer Added Mechanical Engineering, Mokpo Science College, Mokpo (Korea, Republic of)

    2002-11-15

    In this study, researchers classifying the artificial flaws in semiconductor packages are performed by pattern recognition technology. For this purposes, image pattern recognition package including the user made software was developed and total procedure including ultrasonic image acquisition, equalization filtration, binary process, edge detection and classifier design is treated by Backpropagation Neural Network. Specially, it is compared with various weights of Backpropagation Neural Network and it is compared with threshold level of edge detection in preprocessing method for entrance into Multi-Layer Perceptron(Backpropagation Neural network). Also, tile pattern recognition techniques is applied to the classification problem of defects in semiconductor packages as normal, crack, delamination. According to this results, it is possible to acquire the recognition rate of 100% for Backpropagation Neural Network.

  6. Aluminum-Scandium: A Material for Semiconductor Packaging

    Science.gov (United States)

    Geissler, Ute; Thomas, Sven; Schneider-Ramelow, Martin; Mukhopadhyay, Biswajit; Lang, Klaus-Dieter

    2016-10-01

    A well-known aluminum-scandium (Al-Sc) alloy, already used in lightweight sports equipment, is about to be established for use in electronic packaging. One application for Al-Sc alloy is manufacture of bonding wires. The special feature of the alloy is its ability to harden by precipitation. The new bonding wires with electrical conductivity similar to pure Al wires can be processed on common wire bonders for aluminum wedge/wedge (w/w) bonding. The wires exhibit very fine-grained microstructure. Small Al3Sc particles are the main reason for its high strength and prevent recrystallization and grain growth at higher temperatures (>150°C). After the wire-bonding process, the interface is well closed. Reliability investigations by active power cycling demonstrated considerably improved lifetime compared with pure Al heavy wires. Furthermore, the Al-Sc alloy was sputter-deposited onto silicon wafer to test it as chip metallization in copper (Cu) ball/wedge bonding technology. After deposition, the layers exhibited fine-grained columnar structure and small coherent Al3Sc particles with dimensions of a few nanometers. These particles inhibit softening processes such as Al splashing in fine wire bonding processes and increase the thickness of remnant Al under the copper balls to 85% of the initial thickness.

  7. Development of test algorithm for semiconductor package with defects by using probabilistic neural network

    International Nuclear Information System (INIS)

    Kim, Jae Yeol; Sim, Jae Gi; Ko, Myoung Soo; Kim, Chang Hyun; Kim, Hun Cho

    2001-01-01

    In this study, researchers developing the estimative algorithm for artificial defects in semiconductor packages and performing it by pattern recognition technology. For this purpose, the estimative algorithm was included that researchers made software with MATLAB. The software consists of some procedures including ultrasonic image acquisition, equalization filtering, Self-Organizing Map and Probabilistic Neural Network. Self-Organizing Map and Probabilistic Neural Network are belong to methods of Neural Networks. And the pattern recognition technology has applied to classify three kinds of detective patterns in semiconductor packages. This study presumes probability density function from a sample of learning and present which is automatically determine method. PNN can distinguish flaws very difficult distinction as well as. This can do parallel process to stand in a row we confirm that is very efficiently classifier if we applied many data real the process.

  8. Standard semiconductor packaging for high-reliability low-cost MEMS applications

    Science.gov (United States)

    Harney, Kieran P.

    2005-01-01

    Microelectronic packaging technology has evolved over the years in response to the needs of IC technology. The fundamental purpose of the package is to provide protection for the silicon chip and to provide electrical connection to the circuit board. Major change has been witnessed in packaging and today wafer level packaging technology has further revolutionized the industry. MEMS (Micro Electro Mechanical Systems) technology has created new challenges for packaging that do not exist in standard ICs. However, the fundamental objective of MEMS packaging is the same as traditional ICs, the low cost and reliable presentation of the MEMS chip to the next level interconnect. Inertial MEMS is one of the best examples of the successful commercialization of MEMS technology. The adoption of MEMS accelerometers for automotive airbag applications has created a high volume market that demands the highest reliability at low cost. The suppliers to these markets have responded by exploiting standard semiconductor packaging infrastructures. However, there are special packaging needs for MEMS that cannot be ignored. New applications for inertial MEMS devices are emerging in the consumer space that adds the imperative of small size to the need for reliability and low cost. These trends are not unique to MEMS accelerometers. For any MEMS technology to be successful the packaging must provide the basic reliability and interconnection functions, adding the least possible cost to the product. This paper will discuss the evolution of MEMS packaging in the accelerometer industry and identify the main issues that needed to be addressed to enable the successful commercialization of the technology in the automotive and consumer markets.

  9. Packaged semiconductor laser optical phase locked loop for photonic generation, processing and transmission of microwave signals

    DEFF Research Database (Denmark)

    Langley, L.N.; Elkin, M.D.; Edege, C.

    1999-01-01

    In this paper, we present the first fully packaged semiconductor laser optical phase-locked loop (OPLL) microwave photonic transmitter. The transmitter is based on semiconductor lasers that are directly phase locked without the use of any other phase noise-reduction mechanisms. In this transmitter......, the lasers have a free-running summed linewidth of 6 MHz and the OPLL has a feedback bandwidth of 70 MHz, A state-of-the-art performance is obtained, with a total phase-error variance of 0.05 rad(2) (1-GHz bandwidth) and a carrier phase-error variance of 7x10(-4) rad(2) in a 15-MHz bandwidth. Carriers...... are generated in the range of 7-14 GHz. The OPLL transmitter has been fully packaged for practical use in field trials. This is the first time this type of transmitter has been fabricated in a packaged state which is a significant advance on the route to practical application....

  10. Worker exposure to methanol vapors during cleaning of semiconductor wafers in a manufacturing setting.

    Science.gov (United States)

    Gaffney, Shannon; Moody, Emily; McKinley, Meg; Knutsen, Jeffrey; Madl, Amy; Paustenbach, Dennis

    2008-05-01

    An exposure simulation was conducted to characterize methanol exposure of workers who cleaned wafers in quality control departments within the semiconductor industry. Short-term (15 min) and long-term (2-4 hr) personal and area samples (at distances of 1 m and 3-6 m from the source) were collected during the 2-day simulation. On the first day, 45 mL of methanol were used per hour by a single worker washing wafers in a 102 m(3) room with a ventilation rate of about 10 air changes per hour (ACH). Virtually all methanol volatilized. To assess exposures under conditions associated with higher productivity, on the second day, two workers cleaned wafers simultaneously, together using methanol at over twice the rate of the first day (95 mL/hr). On this day, the ventilation rate was halved (5 ACH). Personal concentrations on the first day averaged 60 ppm (SD = 46 ppm) and ranged from 10-140 ppm. On the second day, personal concentrations for both workers averaged 118 ppm (SD = 50 ppm; range: 64-270 ppm). Area concentrations measured on the first day at 1 m from the source and throughout the balance of the room averaged 29 ppm (SD = 19 ppm; range: 4-83 ppm) and 18 ppm (SD = 12 ppm; range: 3-42 ppm), respectively. As expected, area concentrations measured on the second day were higher than the first and averaged 73 ppm (SD = 25 ppm; range: 27-140 ppm) at 1 meter and 48 ppm (SD = 13 ppm; range: 21-67 ppm) throughout the balance of the room. The results of this simulation suggest that the use of methanol to clean semiconductor wafers without the use of local exhaust ventilation and with relatively low room ventilation rates is unlikely to result in worker exposures exceeding the current ACGIH(R) threshold limit value of 200 ppm. This study also confirmed prior studies suggesting that when a relatively volatile chemical is located within arm's length (near field), breathing zone concentrations will be about two- to threefold greater than the room concentration when the air

  11. Semiconductor

    International Nuclear Information System (INIS)

    2000-01-01

    This book deals with process and measurement of semiconductor. It contains 20 chapters, which goes as follows; semiconductor industry, introduction of semiconductor manufacturing, yield of semiconductor process, materials, crystal growth and a wafer forming, PN, control pollution, oxidation, photomasking photoresist chemistry, photomasking technologies, diffusion and ion injection, chemical vapor deposition, metallization, wafer test and way of evaluation, semiconductor elements, integrated circuit and semiconductor circuit technology.

  12. Wafer-level chip-scale packaging analog and power semiconductor applications

    CERN Document Server

    Qu, Shichun

    2015-01-01

    This book presents a state-of-art and in-depth overview in analog and power WLCSP design, material characterization, reliability, and modeling. Recent advances in analog and power electronic WLCSP packaging are presented based on the development of analog technology and power device integration. The book covers in detail how advances in semiconductor content, analog and power advanced WLCSP design, assembly, materials, and reliability have co-enabled significant advances in fan-in and fan-out with redistributed layer (RDL) of analog and power device capability during recent years. Along with new analog and power WLCSP development, the role of modeling is a key to assure successful package design. An overview of the analog and power WLCSP modeling and typical thermal, electrical, and stress modeling methodologies is also provided. This book also: ·         Covers the development of wafer-level power discrete packaging with regular wafer-level design concepts and directly bumping technology ·    �...

  13. Research and Design on a Product Data Definition System of Semiconductor Packaging Industry

    Science.gov (United States)

    Shi, Jinfei; Ma, Qingyao; Zhou, Yifan; Chen, Ruwen

    2017-12-01

    This paper develops a product data definition (PDD) system for a semiconductor packaging and testing company with independent intellectual property rights. The new PDD system can solve the problems such as, the effective control of production plans, the timely feedback of production processes, and the efficient schedule of resources. Firstly, this paper introduces the general requirements of the PDD system and depicts the operation flow and the data flow of the PDD system. Secondly, the overall design scheme of the PDD system is put forward. After that, the physical data model is developed using the Power Designer15.0 tool, and the database system is built. Finally, the function realization and running effects of the PDD system are analysed. The successful operation of the PDD system can realize the information flow among various production departments of the enterprise to meet the standard of the enterprise manufacturing integration and improve the efficiency of production management.

  14. Packaging Glass with a Hierarchically Nanostructured Surface: A Universal Method to Achieve Self-Cleaning Omnidirectional Solar Cells

    KAUST Repository

    Lin, Chin An

    2015-12-01

    Fused-silica packaging glass fabricated with a hierarchical structure by integrating small (ultrathin nanorods) and large (honeycomb nanowalls) structures was demonstrated with exceptional light-harvesting solar performance, which is attributed to the subwavelength feature of the nanorods and an efficient scattering ability of the honeycomb nanowalls. Si solar cells covered with the hierarchically structured packaging glass exhibit enhanced conversion efficiency by 5.2% at normal incidence, and the enhancement went up to 46% at the incident angle of 60°. The hierarchical structured packaging glass shows excellent self-cleaning characteristics: 98.8% of the efficiency is maintained after 6 weeks of outdoor exposure, indicating that the nanostructured surface effectively repels polluting dust/particles. The presented self-cleaning omnidirectional light-harvesting design using the hierarchical structured packaging glass is a potential universal scheme for practical solar applications.

  15. Application of laser spot cutting on spring contact probe for semiconductor package inspection

    Science.gov (United States)

    Lee, Dongkyoung; Cho, Jungdon; Kim, Chan Ho; Lee, Seung Hwan

    2017-12-01

    A packaged semiconductor has to be electrically tested to make sure they are free of any manufacturing defects. The test interface, typically employed between a Printed Circuit Board and the semiconductor devices, consists of densely populated Spring Contact Probe (SCP). A standard SCP typically consists of a plunger, a barrel, and an internal spring. Among these components, plungers are manufactured by a stamping process. After stamping, plunger connecting arms need to be cut into pieces. Currently, mechanical cutting has been used. However, it may damage to the body of plungers due to the mechanical force engaged at the cutting point. Therefore, laser spot cutting is considered to solve this problem. The plunger arm is in the shape of a rectangular beam, 50 μm (H) × 90 μm (W). The plunger material used for this research is gold coated beryllium copper. Laser parameters, such as power and elapsed time, have been selected to study laser spot cutting. Laser material interaction characteristics such as a crater size, material removal zone, ablation depth, ablation threshold, and full penetration are observed. Furthermore, a carefully chosen laser parameter (Etotal = 1000mJ) to test feasibility of laser spot cutting are applied. The result show that laser spot cutting can be applied to cut SCP.

  16. The influence of in situ argon cleaning of GaAs on Schottky diodes and metal-semiconductor field-effect transistors

    NARCIS (Netherlands)

    Hassel, van J.G.; Heyker, H.C.; Kwaspen, J.J.M.

    1995-01-01

    The influence of in situ argon cleaning of GaAs on the electrical characteristics of Schottky diodes and metal–semiconductor field-effect transistors (MESFETs) is investigated. The beam energy was varied from 50 to 500 eV and the characteristics were compared to wet chemically cleaned devices. The

  17. Electronic properties of adsorbates and clean surfaces of metals and semiconductors

    International Nuclear Information System (INIS)

    Lecante, J.

    1980-01-01

    This paper surveys recent progress in experimental studies on electronic properties of adsorbates and clean metal surfaces. Electron spectroscopy and particularly angle resolved photoelectron spectroscopy appears to be a very powerful tool to get informations on electronic levels of adsorbates or clean surfaces. Moreover this technique may also give informations about the atomic geometry of the surface. Experimental investigation about surface plasmons, surface states, core level shifts are presented for clean surfaces. As examples of adsorbate covered surfaces two typical cases are chosen: two dimensional band structure and oriented molecules. Finally the photoelectron diffraction may be used for surface structure determination either in the case of an adsorbate or a clean metal surface [fr

  18. Synthesis of a nano-silver metal ink for use in thick conductive film fabrication applied on a semiconductor package.

    Directory of Open Access Journals (Sweden)

    Lai Chin Yung

    Full Text Available The success of printing technology in the electronics industry primarily depends on the availability of metal printing ink. Various types of commercially available metal ink are widely used in different industries such as the solar cell, radio frequency identification (RFID and light emitting diode (LED industries, with limited usage in semiconductor packaging. The use of printed ink in semiconductor IC packaging is limited by several factors such as poor electrical performance and mechanical strength. Poor adhesion of the printed metal track to the epoxy molding compound is another critical factor that has caused a decline in interest in the application of printing technology to the semiconductor industry. In this study, two different groups of adhesion promoters, based on metal and polymer groups, were used to promote adhesion between the printed ink and the epoxy molding substrate. The experimental data show that silver ink with a metal oxide adhesion promoter adheres better than silver ink with a polymer adhesion promoter. This result can be explained by the hydroxyl bonding between the metal oxide promoter and the silane grouping agent on the epoxy substrate, which contributes a greater adhesion strength compared to the polymer adhesion promoter. Hypotheses of the physical and chemical functions of both adhesion promoters are described in detail.

  19. All-metal coupling and package of semiconductor laser and amplifier with optical fiber

    International Nuclear Information System (INIS)

    Xu Fenglan; Li Lina; Zhang Yueqing

    1992-01-01

    The semiconductor laser and optical amplifier made by Changchun Institute of Physics coupled with optical fiber by use of all-metal coupling are represented. The net gain of semiconductor laser amplifier with optical fiber is 14 ∼18 dB

  20. Packaging-induced failure of semiconductor lasers and optical telecommunications components

    Energy Technology Data Exchange (ETDEWEB)

    Sharps, J.A. [Corning Inc., NY (United States)

    1996-12-31

    Telecommunications equipment for field deployment generally have specified lifetimes of > 100,000 hr. To achieve this high reliability, it is common practice to package sensitive components in hermetic, inert gas environments. The intent is to protect components from particulate and organic contamination, oxidation, and moisture. However, for high power density 980 nm diode lasers used in optical amplifiers, the authors found that hermetic, inert gas packaging induced a failure mode not observed in similar, unpackaged lasers. They refer to this failure mode as packaging-induced failure, or PIF. PIF is caused by nanomole amounts of organic contamination which interact with high intensity 980 nm light to form solid deposits over the emitting regions of the lasers. These deposits absorb 980 nm light, causing heating of the laser, narrowing of the band gap, and eventual thermal runaway. The authors have found PIF is averted by packaging with free O{sub 2} and/or a getter material that sequesters organics.

  1. Determination of Na and Al Ions in Semiconductor Cleaning Solution Using Capillary Electrophoresis

    International Nuclear Information System (INIS)

    Lee, H. P.; Lim, H. B.

    2003-01-01

    The most common process chemical used in the manufacturing process is a standard cleaning (SC) solution, a mixture of ammonia and hydrogen peroxide in deionized water. Since the purity of the SC solution used in the process has been required to the level of sub-ppb range, accurate and reliable determination of ionic contaminants becomes increasingly difficult. In order to satisfy the requirement of impurity control, inductively coupled plasma-mass spectrometer (ICP-MS), graphite furnace atomic absorption spectrometer (GFAAS), and ion chromatography (IC) are currently the most common analytical instruments used in the process. However, those instruments are not designed for on-line monitoring but rather for off-line analysis. Recently, separation and detection of various particles, such as cells and nanoparticles, with capillary electrophoresis (CE) was reported, although the application of CE has been mostly limited to organic or biological samples. Capillary electrophoresis has been emerging as an alternative to ICPAES and AAS for trace metal analysis

  2. Semiconductor cleaning liquid delivery system and its filter; Handotaiyo seijo yakueki kyokyu system to filter

    Energy Technology Data Exchange (ETDEWEB)

    Saito, T. [Kanto Chemical Co. Inc., Tokyo (Japan); Hayama, H.; Sakka, T. [Nitto Denko Corp., Osaka (Japan)

    1994-11-30

    Most of chemicals used for producing semiconductors are supplied automatically by a chemical delivery system to production devices. This paper explains the current status and the trends of the system. This system supplies the chemicals in the order of a tank lorry, a storage tank, a supply tank, a filter and a production device, and the transfer is performed receiving a supply signal from the supply tank and the production device. The transfer may be done through a dilution equipment. Filters currently used have membrane pore sizes of 0.2 to 0.1 microns as prefilters, and 0.1 to 0.05 microns as final filters. Chemicals used are diverse and can be divided into acid-, alkaline-, and solvent-based groups. Fluorine resin filters are used for acid- and alkaline-resistant applications, and SUS/fluorine resin filters for solvent-resistant applications. Use of large-sized filters of element construction with a membrane area of 1 m{sup 2} class is increasing recently in addition to selection from a performance viewpoint, including particle removing performance. 9 figs., 7 tabs.

  3. Fast Etching of Molding Compound by an Ar/O2/CF4 Plasma and Process Improvements for Semiconductor Package Decapsulation

    NARCIS (Netherlands)

    Tang, J.; Gruber, D.; Schelen, J.B.J.; Funke, H.J.; Beenakker, C.I.M.

    2012-01-01

    Decapsulation of a SOT23 semiconductor package with 23 um copper wire bonds is conducted with an especially designed microwave induced plasma system. It is found that a 30%-60% CF4 addition in the O2/CF4 etchant gas results in high molding compound etching rate. Si3N4 overetching which is

  4. Point Climat no. 15 'Australia's Clean Energy Future Package: How does it compare with the EU's approach?'

    International Nuclear Information System (INIS)

    Patay, Magali; Sartor, Oliver

    2012-01-01

    Among the publications of CDC Climat Research, 'Climate Briefs' presents, in a few pages, hot topics in climate change policy. This issue addresses the following points: On November 8, 2011, the Australian Government passed the so-called 'Clean Energy Future Package'. This set of 19 Acts includes a carbon tax of 23 AUD/tCO 2 , to come into force on 1 July 2012, which will transition, from 1 July 2015, to a system of emissions trading. While it is based on the European model, the Australian carbon market includes several important departures from the European Union Emissions Trading Scheme, particularly in terms of sectoral coverage, price controls, governance, support for low-carbon technologies, and the management of complementary policies. The design of the Australian carbon market is thus of interest not only to domestic stakeholders, but to the evolution of carbon markets and climate policy elsewhere

  5. Package

    Directory of Open Access Journals (Sweden)

    Arsić Zoran

    2013-01-01

    Full Text Available It is duty of the seller to pack the goods in a manner which assures their safe arrival and enables their handling in transit and at the place of destination. The problem of packing is relevant in two main respects. First of all the buyer is in certain circumstances entitled to refuse acceptance of the goods if they are not properly packed. Second, the package is relevant to calculation of price and freight based on weight. In the case of export trade, the package should conform to the legislation in the country of destination. The impact of package on environment is regulated by environment protection regulation of Republic if Serbia.

  6. Packaging Glass with a Hierarchically Nanostructured Surface: A Universal Method to Achieve Self-Cleaning Omnidirectional Solar Cells

    KAUST Repository

    Lin, Chin An; Tsai, Meng Lin; Wei, Wan-Rou; Lai, Kun Yu; He, Jr-Hau

    2015-01-01

    to the subwavelength feature of the nanorods and an efficient scattering ability of the honeycomb nanowalls. Si solar cells covered with the hierarchically structured packaging glass exhibit enhanced conversion efficiency by 5.2% at normal incidence

  7. Power Electronics Packaging Reliability | Transportation Research | NREL

    Science.gov (United States)

    Packaging Reliability Power Electronics Packaging Reliability A photo of a piece of power electronics laboratory equipment. NREL power electronics packaging reliability research investigates the electronics packaging around a semiconductor switching device determines the electrical, thermal, and

  8. Utilization of clean and safe delivery service package of health services extension program and associated factors in rural kebeles of Kafa Zone, Southwest Ethiopia.

    Science.gov (United States)

    Bayou, Negalign Berhanu; Gacho, Yohannes Haile Michael

    2013-07-01

    In Ethiopia, 94% of births take place at home unattended by trained persons. The government introduced an innovative strategy, Health Services Extension Program in 2003. Clean and safe delivery service is a component of maternal and child healthcare package of the program. However, little is known about the status of uptake of the service. This study thus aimed to assess utilization of clean and safe delivery service and associated factors in rural kebeles of Kafa Zone, Ethiopia. A community based cross sectional survey was conducted in rural kebeles of Kefa Zone from January 21(st) to February 25(th), 2009 using a sample of 229 mothers. Kafa Zone is located 465 kilometres away from Addis Ababa to southwest of Ethiopia. Data were collected using a structured questionnaire and analyzed using SPSS for windows version 16. OR and 95% CI were calculated. Phistory of abortion, knowledge of danger signs and antenatal care attendance. Educating women and improving their knowledge about danger signs of pregnancy and labor is recommended. Health extension workers should consider antenatal care visits as opportunities for this purpose.

  9. Health-related external cost assessment in Europe: methodological developments from ExternE to the 2013 Clean Air Policy Package.

    Science.gov (United States)

    van der Kamp, Jonathan; Bachmann, Till M

    2015-03-03

    "Getting the prices right" through internalizing external costs is a guiding principle of environmental policy making, one recent example being the EU Clean Air Policy Package released at the end of 2013. It is supported by impact assessments, including monetary valuation of environmental and health damages. For over 20 years, related methodologies have been developed in Europe in the Externalities of Energy (ExternE) project series and follow-up activities. In this study, we aim at analyzing the main methodological developments over time from the 1990s until today with a focus on classical air pollution-induced human health damage costs. An up-to-date assessment including the latest European recommendations is also applied. Using a case from the energy sector, we identify major influencing parameters: differences in exposure modeling and related data lead to variations in damage costs of up to 21%; concerning risk assessment and monetary valuation, differences in assessing long-term exposure mortality risks together with assumptions on particle toxicity explain most of the observed changes in damage costs. These still debated influencing parameters deserve particular attention when damage costs are used to support environmental policy making.

  10. Carbon pricing comes clean

    International Nuclear Information System (INIS)

    De Wit, Elisa

    2011-01-01

    Together with the Clean Energy Bill, the implications of the Australian Federal Government's climate change legislative package are far reaching. Norton Rose gives business a heads-up in this breakdown of the draft legislation underpinning the carbon pricing and clean energy scheme. It is a summary of Norton Rose's full analysis.

  11. Photolithography and Micro-Fabrication/ Packaging Laboratories

    Data.gov (United States)

    Federal Laboratory Consortium — The Photolithography and Micro-Fabrication/Packaging laboratories provide research level semiconductor processing equipment and facilities that do not require a full...

  12. Integration of a nonmetallic electrostatic precipitator and a wet scrubber for improved removal of particles and corrosive gas cleaning in semiconductor manufacturing industries.

    Science.gov (United States)

    Kim, Hak-Joon; Han, Bangwoo; Kim, Yong-Jin; Yoa, Seok-Jun; Oda, Tetsuji

    2012-08-01

    To remove particles in corrosive gases generated by semiconductor industries, we have developed a novel non-metallic, two-stage electrostatic precipitator (ESP). Carbon brush electrodes and grounded carbon fiber-reinforced polymer (CFRP) form the ionization stage, and polyvinyl chloride collection plates are used in the collection stage of the ESP The collection performance of the ESP downstream of a wet scrubber was evaluated with KC1, silica, and mist particles (0.01-10 pm), changing design and operation parameters such as the ESP length, voltage, and flow rate. A long-term and regeneration performance (12-hr) test was conducted at the maximum operation conditions of the scrubber and ESP and the performance was then demonstrated for 1 month with exhaust gases from wet scrubbers at the rooftop of a semiconductor manufacturing plant in Korea. The results showed that the electrical and collection performance of the ESP (16 channels, 400x400 mm2) was maintained with different grounded plate materials (stainless steel and CFRP) and different lengths of the ionization stage. The collection efficiency of the ESP at high air velocity was enhanced with increases in applied voltages and collection plate lengths. The ESP (16 channels with 100 mm length, 400x400 mm2x540 mm with a 10-mm gap) removed more than 90% of silica and mistparticles with 10 and 12 kV applied to the ESPat the air velocity of 2 m/s and liquid-to-gas ratio of 3.6 L/m3. Decreased performance after 13 hours ofcontinuous operation was recovered to the initial performance level by 5 min of water washing. Moreover during the 1-month operation at the demonstration site, the ESP showed average collection efficiencies of 97% based on particle number and 92% based on total particle mass, which were achieved with a much smaller specific corona power of 0.28 W/m3/hr compared with conventional ESPs.

  13. Plasma Cleaning

    Science.gov (United States)

    Hintze, Paul E.

    2016-01-01

    NASA's Kennedy Space Center has developed two solvent-free precision cleaning techniques: plasma cleaning and supercritical carbon dioxide (SCCO2), that has equal performance, cost parity, and no environmental liability, as compared to existing solvent cleaning methods.

  14. Semiconductor research capabilities at the Lawrence Berkeley Laboratory

    International Nuclear Information System (INIS)

    1987-02-01

    This document discusses semiconductor research capabilities (advanced materials, processing, packaging) and national user facilities (electron microscopy, heavy-ion accelerators, advanced light source)

  15. Advanced organics for electronic substrates and packages

    CERN Document Server

    Fletcher, Andrew E

    1992-01-01

    Advanced Organics for Electronic Substrates and Packages provides information on packaging, which is one of the most technologically intensive activities in the electronics industry. The electronics packaging community has realized that while semiconductor devices continue to be improved upon for performance, cost, and reliability, it is the interconnection or packaging of these devices that will limit the performance of the systems. Technology must develop packaging for transistor chips, with high levels of performance and integration providing cooling, power, and interconnection, and yet pre

  16. Semiconductor statistics

    CERN Document Server

    Blakemore, J S

    1987-01-01

    In-depth exploration of the implications of carrier populations and Fermi energies examines distribution of electrons in energy bands and impurity levels of semiconductors. Also: kinetics of semiconductors containing excess carriers, particularly in terms of trapping, excitation, and recombination.

  17. Semiconductor physics

    CERN Document Server

    Böer, Karl W

    2018-01-01

    This handbook gives a complete survey of the important topics and results in semiconductor physics. It addresses every fundamental principle and most research topics and areas of application in the field of semiconductor physics. Comprehensive information is provided on crystalline bulk and low-dimensional as well as amporphous semiconductors, including optical, transport, and dynamic properties.

  18. Clean data

    CERN Document Server

    Squire, Megan

    2015-01-01

    If you are a data scientist of any level, beginners included, and interested in cleaning up your data, this is the book for you! Experience with Python or PHP is assumed, but no previous knowledge of data cleaning is needed.

  19. Fire protection for clean rooms

    International Nuclear Information System (INIS)

    Kirson, D.

    1990-01-01

    The fire protection engineer often must decide what size fire can be tolerated before automatic fire suppression systems actuate. Is it a wastepaper basket fire, a bushel basket fire...? In the case of state-of-the-art clean rooms, the answer clearly is not even an incipient fire. Minor fires in clean rooms can cause major losses. This paper discusses what a clean room is and gives a brief overview of the unique fire protection challenges encountered. The two major causes of fire related to clean rooms in the semiconductor industry are flammable/pyrophoric gas fires in plastic ducts and polypropylene wet bench fires. This paper concentrates on plastic ductwork in clean rooms, sprinkler protection in ductwork, and protection for wet benches

  20. WWW expert system on producer gas cleaning

    Energy Technology Data Exchange (ETDEWEB)

    Schouten, E.J.; Lammers, G.; Beenackers, A.A.C.M. [University of Groningen (Netherlands)

    1999-07-01

    The University of Groningen (RUG) has developed an expert system on cleaning of biomass producer gas. This work was carried out in close co-operation with the Biomass Technology Group B.V. (BTG) in Enschede, The Netherlands within the framework of the EC supported JOR3-CT95-0084 project. The expert system was developed as a tool for the designer-engineer of downstream gas cleaning equipment and consists of an information package and a flowsheet package. The packages are integrated in a client/server system. The flowsheeting package of the expert system has been designed for the evaluation of different gas cleaning methods. The system contains a number of possible gas cleaning devices such as: cyclone, fabric filter, ceramic filter, venturi scrubber and catalytic cracker. The user can select up to five cleaning steps in an arbitrary order for his specific gas cleaning problem. After specification of the required design parameters, the system calculates the main design characteristics of the cleaning device. The information package is a collection of HTML{sup TM} files. It contains a large amount of information, tips, experience data, literature references and hyperlinks to other interesting Internet sites. This information is arranged per cleaning device. (orig.)

  1. Semiconductor Manufacturing equipment introduction

    International Nuclear Information System (INIS)

    Im, Jong Sun

    2001-02-01

    This book deals with semiconductor manufacturing equipment. It is comprised of nine chapters, which are manufacturing process of semiconductor device, history of semiconductor manufacturing equipment, kinds and role of semiconductor manufacturing equipment, construction and method of semiconductor manufacturing equipment, introduction of various semiconductor manufacturing equipment, spots of semiconductor manufacturing, technical elements of semiconductor manufacturing equipment, road map of technology of semiconductor manufacturing equipment and semiconductor manufacturing equipment in the 21st century.

  2. Semiconductor spintronics

    CERN Document Server

    Xia, Jianbai; Chang, Kai

    2012-01-01

    Semiconductor Spintronics, as an emerging research discipline and an important advanced field in physics, has developed quickly and obtained fruitful results in recent decades. This volume is the first monograph summarizing the physical foundation and the experimental results obtained in this field. With the culmination of the authors' extensive working experiences, this book presents the developing history of semiconductor spintronics, its basic concepts and theories, experimental results, and the prospected future development. This unique book intends to provide a systematic and modern foundation for semiconductor spintronics aimed at researchers, professors, post-doctorates, and graduate students, and to help them master the overall knowledge of spintronics.

  3. 49 CFR 174.57 - Cleaning cars.

    Science.gov (United States)

    2010-10-01

    ... 49 Transportation 2 2010-10-01 2010-10-01 false Cleaning cars. 174.57 Section 174.57... and Loading Requirements § 174.57 Cleaning cars. All hazardous material which has leaked from a package in any rail car or on other railroad property must be carefully removed. ...

  4. Packaging fluency

    DEFF Research Database (Denmark)

    Mocanu, Ana; Chrysochou, Polymeros; Bogomolova, Svetlana

    2011-01-01

    Research on packaging stresses the need for packaging design to read easily, presuming fast and accurate processing of product-related information. In this paper we define this property of packaging as “packaging fluency”. Based on the existing marketing and cognitive psychology literature on pac...

  5. Microelectronic packaging

    CERN Document Server

    Datta, M; Schultze, J Walter

    2004-01-01

    Microelectronic Packaging analyzes the massive impact of electrochemical technologies on various levels of microelectronic packaging. Traditionally, interconnections within a chip were considered outside the realm of packaging technologies, but this book emphasizes the importance of chip wiring as a key aspect of microelectronic packaging, and focuses on electrochemical processing as an enabler of advanced chip metallization.Divided into five parts, the book begins by outlining the basics of electrochemical processing, defining the microelectronic packaging hierarchy, and emphasizing the impac

  6. Semiconductor spintronics

    International Nuclear Information System (INIS)

    Fabian, J.; Abiague, A.M.; Ertler, Ch.; Stano, P.; Zutic, I.

    2007-01-01

    Spintronics refers commonly to phenomena in which the spin of electrons in a solid state environment plays the determining role. In a more narrow sense spintronics is an emerging research field of electronics: spintronics devices are based on a spin control of electronics, or on an electrical and optical control of spin of magnetism. While metal spintronics has already found its niche in the computer industry - giant magnetoresistance systems are used as hard disk read heads - semiconductor spintronics is vet demonstrate its full potential. This review presents selected themes of semiconductor spintronics, introducing important concepts in spin transport, spin transport, spin injection. Silsbee-Johnson spin-charge coupling, and spin-dependent tunneling, as well as spin relaxation and spin dynamics. The most fundamental spin-dependent interaction in nonmagnetic semiconductors is spin-orbit coupling. Depending on the crystal symmetries of the material, as well as on the structural properties of semiconductor based heterostructures, the spin-orbit coupling takes on different functional forms, giving a nice playground of effective spin-orbit Hamiltonians. The effective Hamiltonians for the most relevant classes of materials and heterostructures are derived here from realistic electronic band structure descriptions. Most semiconductor device systems are still theoretical concepts, waiting for experimental demonstrations. A review of selected proposed, and a few demonstrated devices is presented, with detailed description of two important classes: magnetic resonant tunnel structures and bipolar magnetic diodes and transistors. In view of the importance of ferromagnetic semiconductor material, a brief discussion of diluted magnetic semiconductors is included. In most cases the presentation is of tutorial style, introducing the essential theoretical formalism at an accessible level, with case-study-like illustrations of actual experimental results, as well as with brief

  7. Work on the ATLAS semiconductor tracker barrel

    CERN Multimedia

    Maximilien Brice

    2005-01-01

    Precision work is performed on the semiconductor tracker barrel of the ATLAS experiment. All work on these delicate components must be performed in a clean room so that impurities in the air, such as dust, do not contaminate the detector. The semiconductor tracker will be mounted in the barrel close to the heart of the ATLAS experiment to detect the path of particles produced in proton-proton collisions.

  8. Oxide semiconductors

    CERN Document Server

    Svensson, Bengt G; Jagadish, Chennupati

    2013-01-01

    Semiconductors and Semimetals has distinguished itself through the careful selection of well-known authors, editors, and contributors. Originally widely known as the ""Willardson and Beer"" Series, it has succeeded in publishing numerous landmark volumes and chapters. The series publishes timely, highly relevant volumes intended for long-term impact and reflecting the truly interdisciplinary nature of the field. The volumes in Semiconductors and Semimetals have been and will continue to be of great interest to physicists, chemists, materials scientists, and device engineers in academia, scient

  9. Semiconductor statistics

    CERN Document Server

    Blakemore, J S

    1962-01-01

    Semiconductor Statistics presents statistics aimed at complementing existing books on the relationships between carrier densities and transport effects. The book is divided into two parts. Part I provides introductory material on the electron theory of solids, and then discusses carrier statistics for semiconductors in thermal equilibrium. Of course a solid cannot be in true thermodynamic equilibrium if any electrical current is passed; but when currents are reasonably small the distribution function is but little perturbed, and the carrier distribution for such a """"quasi-equilibrium"""" co

  10. MEMS packaging

    CERN Document Server

    Hsu , Tai-Ran

    2004-01-01

    MEMS Packaging discusses the prevalent practices and enabling techniques in assembly, packaging and testing of microelectromechanical systems (MEMS). The entire spectrum of assembly, packaging and testing of MEMS and microsystems, from essential enabling technologies to applications in key industries of life sciences, telecommunications and aerospace engineering is covered. Other topics included are bonding and sealing of microcomponents, process flow of MEMS and microsystems packaging, automated microassembly, and testing and design for testing.The Institution of Engineering and Technology is

  11. Cleaning Services.

    Science.gov (United States)

    Sharpton, James L.

    This curriculum guide provides cleaning services instructional materials for a ninth- and tenth-grade Coordinated Vocational Education and Training: Home and Community Services program. It includes 2 sections and 11 instructional units. Each unit of instruction consists of eight basic components: performance objectives, teacher activities,…

  12. Semiconductor Detectors

    International Nuclear Information System (INIS)

    Cortina, E.

    2007-01-01

    Particle detectors based on semiconductor materials are among the few devices used for particle detection that are available to the public at large. In fact we are surrounded by them in our daily lives: they are used in photoelectric cells for opening doors, in digital photographic and video camera, and in bar code readers at supermarket cash registers. (Author)

  13. Clean energy utilization technology

    International Nuclear Information System (INIS)

    Honma, Takuya

    1992-01-01

    The technical development of clean energy including the utilization of solar energy was begun in 1973 at the time of the oil crisis, and about 20 years elapsed. Also in Japan, the electric power buying system by electric power companies for solar light electric power and wind electric power has been started in 1992, namely their value as a merchandise was recognized. As for these two technologies, the works of making the international standards and JIS were begun. The range of clean energy or natural energy is wide, and its kinds are many. The utilization of solar heat and the electric power generation utilizing waves, tide and geotherm already reached the stage of practical use. Generally in order to practically use new energy, the problem of price must be solved, but the price is largely dependent on the degree of spread. Also the reliability, durability and safety must be ensured, and the easiness of use, effectiveness and trouble-saving maintenance and operation are required. For the purpose, it is important to packaging those skillfully in a system. The cases of intelligent natural energy systems are shown. Solar light and wind electric power generation systems and the technology of transporting clean energy are described. (K.I.)

  14. Clean cars

    Energy Technology Data Exchange (ETDEWEB)

    Piffaretti, M.

    2008-07-01

    This well-illustrated presentation made at the Swiss 2008 research conference on traffic by the Protoscar company takes a look at research, design, engineering and communication topics in the area of 'clean cars'. The present situation with electrically driven and hybrid-drive cars is reviewed and the chances and problems of the present-day vehicles are examined. New developments and a number of vehicles that should be on the market in the period from 2012 to 2015 are presented. Also, 'clean' specialist vehicles such as trucks and buses are reviewed. Battery systems and associated problems and new developments are looked at. The promotion scheme in Mendrisio, Switzerland is reviewed. Bottom-up and top-down approaches are discussed and future market developments are looked at, as are promotional activities in various countries.

  15. TiO 2 Thin Films Prepared via Adsorptive Self-Assembly for Self-Cleaning Applications

    KAUST Repository

    Xi, Baojuan; Verma, Lalit Kumar; Li, Jing; Bhatia, Charanjit Singh; Danner, Aaron James; Yang, Hyunsoo; Zeng, Hua Chun

    2012-01-01

    oxidation processes for wastewater and bactericidal treatments, self-cleaning window glass for green intelligent buildings, dye-sensitized solar cells, solid-state semiconductor metal-oxide solar cells, self-cleaning glass for photovoltaic devices

  16. Semiconductor sensors

    International Nuclear Information System (INIS)

    Hartmann, Frank

    2011-01-01

    Semiconductor sensors have been around since the 1950s and today, every high energy physics experiment has one in its repertoire. In Lepton as well as Hadron colliders, silicon vertex and tracking detectors led to the most amazing physics and will continue doing so in the future. This contribution tries to depict the history of these devices exemplarily without being able to honor all important developments and installations. The current understanding of radiation damage mechanisms and recent R and D topics demonstrating the future challenges and possible technical solutions for the SLHC detectors are presented. Consequently semiconductor sensor candidates for an LHC upgrade and a future linear collider are also briefly introduced. The work presented here is a collage of the work of many individual silicon experts spread over several collaborations across the world.

  17. Semiconductor Optics

    CERN Document Server

    Klingshirn, Claus F

    2012-01-01

    This updated and enlarged new edition of Semiconductor Optics provides an introduction to and an overview of semiconductor optics from the IR through the visible to the UV, including linear and nonlinear optical properties, dynamics, magneto and electrooptics, high-excitation effects and laser processes, some applications, experimental techniques and group theory. The mathematics is kept as elementary as possible, sufficient for an intuitive understanding of the experimental results and techniques treated. The subjects covered extend from physics to materials science and optoelectronics. Significantly updated chapters add coverage of current topics such as electron hole plasma, Bose condensation of excitons and meta materials. Over 120 problems, chapter introductions and a detailed index make it the key textbook for graduate students in physics. The mathematics is kept as elementary as possible, sufficient for an intuitive understanding of the experimental results and techniques treated. The subjects covered ...

  18. Semiconductor annealing

    International Nuclear Information System (INIS)

    Young, J.M.; Scovell, P.D.

    1982-01-01

    A process for annealing crystal damage in ion implanted semiconductor devices in which the device is rapidly heated to a temperature between 450 and 900 0 C and allowed to cool. It has been found that such heating of the device to these relatively low temperatures results in rapid annealing. In one application the device may be heated on a graphite element mounted between electrodes in an inert atmosphere in a chamber. (author)

  19. Packaging microservices

    DEFF Research Database (Denmark)

    Montesi, Fabrizio; Thrane, Dan Sebastian

    2017-01-01

    We describe a first proposal for a new packaging system for microservices based on the Jolie programming language, called the Jolie Package Manager (JPM). Its main features revolve around service interfaces, which make the functionalities that a service provides and depends on explicit. For the f......We describe a first proposal for a new packaging system for microservices based on the Jolie programming language, called the Jolie Package Manager (JPM). Its main features revolve around service interfaces, which make the functionalities that a service provides and depends on explicit...

  20. The impact of packaging on product competition

    Directory of Open Access Journals (Sweden)

    Maryam Masoumi

    2012-09-01

    Full Text Available The primary objective of this paper is to detect important factors, which are influencing competitive advantage. The proposed model of this paper uses sampling technique to measure characteristics of society. There are eight independent variables for the proposed study of this paper including packaging endurance, easy distribution, customer promotion through packaging, packaging structure, packaging as silent advertiser, diversity of packaging, clean and healthy packaging and innovation in packaging. The proposed study uses structural equation modeling to either accept or reject all hypotheses associated with the proposed study of this paper. The population of this study includes all managers and experts who are involved in packaging products. We used simple sampling technique and chooses 300 from a population of 450 people who are considered as the population of this survey. Cronbach alpha was determined as 0.732, which is above the minimum acceptable level. The results confirm that all mentioned factors influence competitiveness, effectively.

  1. Semiconductor annealing

    International Nuclear Information System (INIS)

    Young, J.M.; Scovell, P.D.

    1981-01-01

    A process for annealing crystal damage in ion implanted semiconductor devices is described in which the device is rapidly heated to a temperature between 450 and 600 0 C and allowed to cool. It has been found that such heating of the device to these relatively low temperatures results in rapid annealing. In one application the device may be heated on a graphite element mounted between electrodes in an inert atmosphere in a chamber. The process may be enhanced by the application of optical radiation from a Xenon lamp. (author)

  2. 7 CFR 58.413 - Cutting and packaging rooms.

    Science.gov (United States)

    2010-01-01

    ... 7 Agriculture 3 2010-01-01 2010-01-01 false Cutting and packaging rooms. 58.413 Section 58.413....413 Cutting and packaging rooms. When small packages of cheese are cut and wrapped, separate rooms shall be provided for the cleaning and preparation of the bulk cheese and for the cutting and wrapping...

  3. Magnetic semiconductors

    Energy Technology Data Exchange (ETDEWEB)

    Bihler, Christoph

    2009-04-15

    In this thesis we investigated in detail the properties of Ga{sub 1-x}Mn{sub x}As, Ga{sub 1-x}Mn{sub x}P, and Ga{sub 1-x}Mn{sub x}N dilute magnetic semiconductor thin films with a focus on the magnetic anisotropy and the changes of their properties upon hydrogenation. We applied two complementary spectroscopic techniques to address the position of H in magnetic semiconductors: (i) Electron paramagnetic resonance, which provides direct information on the symmetry of the crystal field of the Mn{sup 2+} atoms and (ii) x-ray absorption fine structure analysis which allows to probe the local crystallographic neighborhood of the absorbing Mn atom via analysing the fine structure at the Mn K absorption edge. Finally, we discussed the obstacles that have to be overcome to achieve Curie temperatures above the current maximum in Ga{sub 1-x}Mn{sub x}As of 185 K. Here, we outlined in detail the generic problem of the formation of precipitates at the example of Ge:MN. (orig.)

  4. Fiscal 2000 achievement report. Research and development of semiconductor CVD chamber cleaning systems for electronic device manufacturing using new alternative gas instead of SF6, PFCs, and other gases; 2000 nendo sokkoteki kakushinteki energy kankyo gijutsu kaihatsu seika hokokusho. SF6 tou ni daitaisuru gasu wo riyo shita denshi debaisu seizo cleaning system no kenkyu kaihatsu

    Energy Technology Data Exchange (ETDEWEB)

    NONE

    2001-03-01

    The efforts aim to develop a CVD (chemical vapor deposition) mechanism cleaning gas with less environmental impact such as global warming and a CVD process using the same. The candidate gas synthesizing study for the development of such a gas continues from the preceding fiscal year. In addition, various candidate gases and tentatively synthesized gases are evaluated for their cleaning performance using a simplified experimental system. As the result, patent applications were filed for three novel alternative gases low in environmental impact and high in cleaning performance. In the research and development of CVD processes, a verification test process is developed for the evaluation of alternative gases at the real system level using a large CVD evaluation system. Studies are also made in which some existing gases are utilized to improve on CVD cleaning efficiency and to reduce greenhouse gas emissions. In relation to the process, one domestic patent application is made, and three essays are presented at an international conference on electrochemistry in the United States. (NEDO)

  5. Semiconductor Laser Measurements Laboratory

    Data.gov (United States)

    Federal Laboratory Consortium — The Semiconductor Laser Measurements Laboratory is equipped to investigate and characterize the lasing properties of semiconductor diode lasers. Lasing features such...

  6. Semiconductor laser shearing interferometer

    International Nuclear Information System (INIS)

    Ming Hai; Li Ming; Chen Nong; Xie Jiaping

    1988-03-01

    The application of semiconductor laser on grating shearing interferometry is studied experimentally in the present paper. The method measuring the coherence of semiconductor laser beam by ion etching double frequency grating is proposed. The experimental result of lens aberration with semiconductor laser shearing interferometer is given. Talbot shearing interferometry of semiconductor laser is also described. (author). 2 refs, 9 figs

  7. Chaotic bursting in semiconductor lasers

    Science.gov (United States)

    Ruschel, Stefan; Yanchuk, Serhiy

    2017-11-01

    We investigate the dynamic mechanisms for low frequency fluctuations in semiconductor lasers subjected to delayed optical feedback, using the Lang-Kobayashi model. This system of delay differential equations displays pronounced envelope dynamics, ranging from erratic, so called low frequency fluctuations to regular pulse packages, if the time scales of fast oscillations and envelope dynamics are well separated. We investigate the parameter regions where low frequency fluctuations occur and compute their Lyapunov spectra. Using the geometric singular perturbation theory, we study this intermittent chaotic behavior and characterize these solutions as bursting slow-fast oscillations.

  8. Clean tracks for ATLAS

    CERN Multimedia

    2006-01-01

    First cosmic ray tracks in the integrated ATLAS barrel SCT and TRT tracking detectors. A snap-shot of a cosmic ray event seen in the different layers of both the SCT and TRT detectors. The ATLAS Inner Detector Integration Team celebrated a major success recently, when clean tracks of cosmic rays were detected in the completed semiconductor tracker (SCT) and transition radiation tracker (TRT) barrels. These tracking tests come just months after the successful insertion of the SCT into the TRT (See Bulletin 09/2006). The cosmic ray test is important for the experiment because, after 15 years of hard work, it is the last test performed on the fully assembled barrel before lowering it into the ATLAS cavern. The two trackers work together to provide millions of channels so that particles' tracks can be identified and measured with great accuracy. According to the team, the preliminary results were very encouraging. After first checks of noise levels in the final detectors, a critical goal was to study their re...

  9. Solar photocatalytic cleaning of polluted water

    International Nuclear Information System (INIS)

    Bockelmann, D.

    1994-01-01

    Alternatively to biological, physical and chemical methods of waste water cleaning, photocatalysis can be employed. In this residue-free method, titanium dioxide particles are brought into contact with polluted water as photocatalysts. Under UV irradiation at wave-lengths below 400 nm, change carriers are generated in the semiconductor particles that act so intensely oxidizing as to completely degrade almost all organic pollutants in waste water. In this process, the ultra-violet part of the solar spectrum can be harnessed to generate oxidation equivalents. Thus, solar photocatalytic waste water cleaning is excellently suited for developing countries. (BWI) [de

  10. Clean Cities Fact Sheet

    Energy Technology Data Exchange (ETDEWEB)

    2004-01-01

    This fact sheet explains the Clean Cities Program and provides contact information for all coalitions and regional offices. It answers key questions such as: What is the Clean Cities Program? What are alternative fuels? How does the Clean Cities Program work? What sort of assistance does Clean Cities offer? What has Clean Cities accomplished? What is Clean Cities International? and Where can I find more information?

  11. The Ettention software package

    International Nuclear Information System (INIS)

    Dahmen, Tim; Marsalek, Lukas; Marniok, Nico; Turoňová, Beata; Bogachev, Sviatoslav; Trampert, Patrick; Nickels, Stefan; Slusallek, Philipp

    2016-01-01

    We present a novel software package for the problem “reconstruction from projections” in electron microscopy. The Ettention framework consists of a set of modular building-blocks for tomographic reconstruction algorithms. The well-known block iterative reconstruction method based on Kaczmarz algorithm is implemented using these building-blocks, including adaptations specific to electron tomography. Ettention simultaneously features (1) a modular, object-oriented software design, (2) optimized access to high-performance computing (HPC) platforms such as graphic processing units (GPU) or many-core architectures like Xeon Phi, and (3) accessibility to microscopy end-users via integration in the IMOD package and eTomo user interface. We also provide developers with a clean and well-structured application programming interface (API) that allows for extending the software easily and thus makes it an ideal platform for algorithmic research while hiding most of the technical details of high-performance computing. - Highlights: • Novel software package for “reconstruction from projections” in electron microscopy. • Support for high-resolution reconstructions on iterative reconstruction algorithms. • Support for CPU, GPU and Xeon Phi. • Integration in the IMOD software. • Platform for algorithm researchers: object oriented, modular design.

  12. The Ettention software package

    Energy Technology Data Exchange (ETDEWEB)

    Dahmen, Tim, E-mail: Tim.Dahmen@dfki.de [German Research Center for Artificial Intelligence GmbH (DFKI), 66123 Saarbrücken (Germany); Saarland University, 66123 Saarbrücken (Germany); Marsalek, Lukas [Eyen SE, Na Nivách 1043/16, 141 00 Praha 4 (Czech Republic); Saarland University, 66123 Saarbrücken (Germany); Marniok, Nico [Saarland University, 66123 Saarbrücken (Germany); Turoňová, Beata [Saarland University, 66123 Saarbrücken (Germany); IMPRS-CS, Max-Planck Institute for Informatics, Campus E 1.4, 66123 Saarbrücken (Germany); Bogachev, Sviatoslav [Saarland University, 66123 Saarbrücken (Germany); Trampert, Patrick; Nickels, Stefan [German Research Center for Artificial Intelligence GmbH (DFKI), 66123 Saarbrücken (Germany); Slusallek, Philipp [German Research Center for Artificial Intelligence GmbH (DFKI), 66123 Saarbrücken (Germany); Saarland University, 66123 Saarbrücken (Germany)

    2016-02-15

    We present a novel software package for the problem “reconstruction from projections” in electron microscopy. The Ettention framework consists of a set of modular building-blocks for tomographic reconstruction algorithms. The well-known block iterative reconstruction method based on Kaczmarz algorithm is implemented using these building-blocks, including adaptations specific to electron tomography. Ettention simultaneously features (1) a modular, object-oriented software design, (2) optimized access to high-performance computing (HPC) platforms such as graphic processing units (GPU) or many-core architectures like Xeon Phi, and (3) accessibility to microscopy end-users via integration in the IMOD package and eTomo user interface. We also provide developers with a clean and well-structured application programming interface (API) that allows for extending the software easily and thus makes it an ideal platform for algorithmic research while hiding most of the technical details of high-performance computing. - Highlights: • Novel software package for “reconstruction from projections” in electron microscopy. • Support for high-resolution reconstructions on iterative reconstruction algorithms. • Support for CPU, GPU and Xeon Phi. • Integration in the IMOD software. • Platform for algorithm researchers: object oriented, modular design.

  13. RASPLAV package

    International Nuclear Information System (INIS)

    1990-01-01

    The RASPLAV package for investigation of post-accident mass transport and heat transfer processes is presented. The package performs three dimensional thermal conduction calculations in space nonuniform and temperature dependent conductivities and variable heat sources, taking into account phase transformations. The processes of free-moving bulk material, mixing of melting fuel due to advection and dissolution, and also evaporation/adsorption are modelled. Two-dimensional hydrodynamics with self-consistent heat transfer are also performed. The paper briefly traces the ways the solution procedures are carried out in the program package and outlines the major results of the simulation of reactor vessel melting after a core meltdown. The theoretical analysis and the calculations in this case were carried out in order to define the possibility of localization of the zone reminders. The interactions between the reminders and the concrete are simulated and evaluation of the interaction parameters is carried out. 4 refs. (R.Ts)

  14. Performances in Tank Cleaning

    Directory of Open Access Journals (Sweden)

    Fanel-Viorel Panaitescu

    2018-03-01

    Full Text Available There are several operations which must do to maximize the performance of tank cleaning. The new advanced technologies in tank cleaning have raised the standards in marine areas. There are many ways to realise optimal cleaning efficiency for different tanks. The evaluation of tank cleaning options means to start with audit of operations: how many tanks require cleaning, are there obstructions in tanks (e.g. agitators, mixers, what residue needs to be removed, are cleaning agents required or is water sufficient, what methods can used for tank cleaning. After these steps, must be verify the results and ensure that the best cleaning values can be achieved in terms of accuracy and reliability. Technology advancements have made it easier to remove stubborn residues, shorten cleaning cycle times and achieve higher levels of automation. In this paper are presented the performances in tank cleaning in accordance with legislation in force. If tank cleaning technologies are effective, then operating costs are minimal.

  15. α-particle shielding of semiconductor device

    International Nuclear Information System (INIS)

    McKeown, P.J.A.; Perry, J.P.; Waddell, J.M.; Barker, K.D.

    1981-01-01

    Soft errors in semiconductor devices, e.g. random access memories, arising from the bombardment of the device by alpha particles produced by the disintegration of minute traces of uranium or thorium in the packaging materials are prevented by coating the active surface of the semiconductor chip with a thin layer, e.g. 20 to 100 microns of an organic polymeric material, this layer being of sufficient thickness to absorb the particles. Typically, the polymer is a poly-imide formed by u.v. electron-beam or thermal curing of liquid monomer applied to the chip surface. (author)

  16. Semiconductor nanostructures

    Energy Technology Data Exchange (ETDEWEB)

    Marstein Erik Stensrud

    2003-07-01

    This thesis presents a study of two material systems containing semiconductor nanocrystals, namely porous silicon (PSi) films and germanium (Ge) nanocrystals embedded in silicon dioxide (SiO2) films. The PSi films were made by anodic etching of silicon (Si) substrates in an electrolyte containing hydrofluoric acid. The PSi films were doped with erbium (Er) using two different doping methods. electrochemical doping and doping by immersing the PSi films in a solution containing Er. The resulting Er concentration profiles were investigated using scanning electron microscopy (SEN1) combined with energy dispersive X-ray analysis (EDS). The main subject of the work on PSi presented in this thesis was investigating and comparing these two doping methods. Ge nanocrystals were made by implanting Ge ions into Si02 films that were subsequently annealed. However. nanocrystal formation occurred only for certain sets of processing parameters. The dependence of the microstructure of the Ge implanted Si02 films on the processing parameters were therefore investigated. A range of methods were employed for these investigations, including transmission electron microscopy (TEM) combined with EDS, X-ray photoelectron spectroscopy (XPS) and secondary ion mass spectroscopy (SIMS). The observed structures, ranging from Ge nanocrystals to voids with diameters of several tens of nanometers and Ge rich Si02 films without any nanocrystals is described. A model explaining the void formation is also presented. For certain sets of processing parameters. An accumulation of Ge at the Si-Si02 interface was observed. The effect of this accumulation on the electrical properties of MOS structures made from Ge implanted SiO2 films was investigated using CV-measurements. (Author)

  17. Fundamentals of semiconductor devices

    CERN Document Server

    Lindmayer, Joseph

    1965-01-01

    Semiconductor properties ; semiconductor junctions or diodes ; transistor fundamentals ; inhomogeneous impurity distributions, drift or graded-base transistors ; high-frequency properties of transistors ; band structure of semiconductors ; high current densities and mechanisms of carrier transport ; transistor transient response and recombination processes ; surfaces, field-effect transistors, and composite junctions ; additional semiconductor characteristics ; additional semiconductor devices and microcircuits ; more metal, insulator, and semiconductor combinations for devices ; four-pole parameters and configuration rotation ; four-poles of combined networks and devices ; equivalent circuits ; the error function and its properties ; Fermi-Dirac statistics ; useful physical constants.

  18. Hybrid system of semiconductor and photosynthetic protein

    International Nuclear Information System (INIS)

    Kim, Younghye; Shin, Seon Ae; Lee, Jaehun; Yang, Ki Dong; Nam, Ki Tae

    2014-01-01

    Photosynthetic protein has the potential to be a new attractive material for solar energy absorption and conversion. The development of semiconductor/photosynthetic protein hybrids is an example of recent progress toward efficient, clean and nanostructured photoelectric systems. In the review, two biohybrid systems interacting through different communicating methods are addressed: (1) a photosynthetic protein immobilized semiconductor electrode operating via electron transfer and (2) a hybrid of semiconductor quantum dots and photosynthetic protein operating via energy transfer. The proper selection of materials and functional and structural modification of the components and optimal conjugation between them are the main issues discussed in the review. In conclusion, we propose the direction of future biohybrid systems for solar energy conversion systems, optical biosensors and photoelectric devices. (topical reviews)

  19. Protecting integrated circuits from excessive charge accumulation during plasma cleaning of multichip modules

    Science.gov (United States)

    Rodenbeck, Christopher T; Girardi, Michael

    2015-04-21

    Internal nodes of a constituent integrated circuit (IC) package of a multichip module (MCM) are protected from excessive charge during plasma cleaning of the MCM. The protected nodes are coupled to an internal common node of the IC package by respectively associated discharge paths. The common node is connected to a bond pad of the IC package. During MCM assembly, and before plasma cleaning, this bond pad receives a wire bond to a ground bond pad on the MCM substrate.

  20. Solid spectroscopy: semiconductors

    International Nuclear Information System (INIS)

    Silva, C.E.T.G. da

    1983-01-01

    Photoemission as technique of study of the semiconductor electronic structure is shortly discussed. Homogeneous and heterogeneous semiconductors, where volume and surface electronic structure, core levels and O and H chemisorption in GaAs, Schottky barrier are treated, respectively. Amorphous semiconductors are also discussed. (L.C.) [pt

  1. The Ettention software package.

    Science.gov (United States)

    Dahmen, Tim; Marsalek, Lukas; Marniok, Nico; Turoňová, Beata; Bogachev, Sviatoslav; Trampert, Patrick; Nickels, Stefan; Slusallek, Philipp

    2016-02-01

    We present a novel software package for the problem "reconstruction from projections" in electron microscopy. The Ettention framework consists of a set of modular building-blocks for tomographic reconstruction algorithms. The well-known block iterative reconstruction method based on Kaczmarz algorithm is implemented using these building-blocks, including adaptations specific to electron tomography. Ettention simultaneously features (1) a modular, object-oriented software design, (2) optimized access to high-performance computing (HPC) platforms such as graphic processing units (GPU) or many-core architectures like Xeon Phi, and (3) accessibility to microscopy end-users via integration in the IMOD package and eTomo user interface. We also provide developers with a clean and well-structured application programming interface (API) that allows for extending the software easily and thus makes it an ideal platform for algorithmic research while hiding most of the technical details of high-performance computing. Copyright © 2015 Elsevier B.V. All rights reserved.

  2. Lively package

    International Nuclear Information System (INIS)

    Jaremko, G.

    1997-01-01

    Progress on the Lloydminster Heavy Oil Interpretive Centre, sponsored by the Lloydminster Oilfield Technical Society and expected to open in late 1998, was discussed. Some $150,000 of the $750,000 budget is already in the bank, and another $150,000 is in the pipeline. The Centre will be added to an existing and well-established visitor's site. It is reported to contain a lively and imaginatively-designed exhibit package, and promises to become a combination of educational tool and tourist attraction for the town of Lloydminster, Saskatchewan, in the heart of heavy oil country

  3. Reflective Packaging

    Science.gov (United States)

    1994-01-01

    The aluminized polymer film used in spacecraft as a radiation barrier to protect both astronauts and delicate instruments has led to a number of spinoff applications. Among them are aluminized shipping bags, food cart covers and medical bags. Radiant Technologies purchases component materials and assembles a barrier made of layers of aluminized foil. The packaging reflects outside heat away from the product inside the container. The company is developing new aluminized lines, express mailers, large shipping bags, gel packs and insulated panels for the building industry.

  4. Clean Hands Count

    Medline Plus

    Full Text Available ... has been rented. This feature is not available right now. Please try again later. Published on May ... 34 How The Clean Hands - Safe Hands System Works - Duration: 3:38. Clean Hands-Safe Hands 5, ...

  5. Chemical cleaning review

    International Nuclear Information System (INIS)

    Dow, B.L.; Thomas, R.C.

    1995-01-01

    Three main chemical processes for cleaning steam generators have evolved from the early work of the industry. Of the more than 50 chemical cleanings carried out to date most have been considered a success by the utilities performing them. (author)

  6. Transient electro-thermal modeling of bipolar power semiconductor devices

    CERN Document Server

    Gachovska, Tanya Kirilova; Du, Bin

    2013-01-01

    This book presents physics-based electro-thermal models of bipolar power semiconductor devices including their packages, and describes their implementation in MATLAB and Simulink. It is a continuation of our first book Modeling of Bipolar Power Semiconductor Devices. The device electrical models are developed by subdividing the devices into different regions and the operations in each region, along with the interactions at the interfaces, are analyzed using the basic semiconductor physics equations that govern device behavior. The Fourier series solution is used to solve the ambipolar diffusio

  7. Compound Semiconductor Radiation Detector

    International Nuclear Information System (INIS)

    Kim, Y. K.; Park, S. H.; Lee, W. G.; Ha, J. H.

    2005-01-01

    In 1945, Van Heerden measured α, β and γ radiations with the cooled AgCl crystal. It was the first radiation measurement using the compound semiconductor detector. Since then the compound semiconductor has been extensively studied as radiation detector. Generally the radiation detector can be divided into the gas detector, the scintillator and the semiconductor detector. The semiconductor detector has good points comparing to other radiation detectors. Since the density of the semiconductor detector is higher than that of the gas detector, the semiconductor detector can be made with the compact size to measure the high energy radiation. In the scintillator, the radiation is measured with the two-step process. That is, the radiation is converted into the photons, which are changed into electrons by a photo-detector, inside the scintillator. However in the semiconductor radiation detector, the radiation is measured only with the one-step process. The electron-hole pairs are generated from the radiation interaction inside the semiconductor detector, and these electrons and charged ions are directly collected to get the signal. The energy resolution of the semiconductor detector is generally better than that of the scintillator. At present, the commonly used semiconductors as the radiation detector are Si and Ge. However, these semiconductor detectors have weak points. That is, one needs thick material to measure the high energy radiation because of the relatively low atomic number of the composite material. In Ge case, the dark current of the detector is large at room temperature because of the small band-gap energy. Recently the compound semiconductor detectors have been extensively studied to overcome these problems. In this paper, we will briefly summarize the recent research topics about the compound semiconductor detector. We will introduce the research activities of our group, too

  8. Semiconductor apparatus and method of fabrication for a semiconductor apparatus

    NARCIS (Netherlands)

    2010-01-01

    The invention relates to a semiconductor apparatus (1) and a method of fabrication for a semiconductor apparatus (1), wherein the semiconductor apparatus (1) comprises a semiconductor layer (2) and a passivation layer (3), arranged on a surface of the semiconductor layer (2), for passivating the

  9. Growth of high purity semiconductor epitaxial layers by liquid phase ...

    Indian Academy of Sciences (India)

    Unknown

    semiconductor materials in high purity form by liquid phase epitaxy (LPE) technique. Various possible sources of impurities in such ... reference to the growth of GaAs layers. The technique of growing very high purity layers ... the inner walls of the gas lines and (e) the containers for storing, handling and cleaning of the mate-.

  10. Semiconductor Physical Electronics

    CERN Document Server

    Li, Sheng

    2006-01-01

    Semiconductor Physical Electronics, Second Edition, provides comprehensive coverage of fundamental semiconductor physics that is essential to an understanding of the physical and operational principles of a wide variety of semiconductor electronic and optoelectronic devices. This text presents a unified and balanced treatment of the physics, characterization, and applications of semiconductor materials and devices for physicists and material scientists who need further exposure to semiconductor and photonic devices, and for device engineers who need additional background on the underlying physical principles. This updated and revised second edition reflects advances in semicondutor technologies over the past decade, including many new semiconductor devices that have emerged and entered into the marketplace. It is suitable for graduate students in electrical engineering, materials science, physics, and chemical engineering, and as a general reference for processing and device engineers working in the semicondi...

  11. Contacts to semiconductors

    International Nuclear Information System (INIS)

    Tove, P.A.

    1975-08-01

    Contacts to semiconductors play an important role in most semiconductor devices. These devices range from microelectronics to power components, from high-sensitivity light or radiation detectors to light-emitting of microwave-generating components. Silicon is the dominating material but compound semiconductors are increasing in importance. The following survey is an attempt to classify contact properties and the physical mechanisms involved, as well as fabrication methods and methods of investigation. The main interest is in metal-semiconductor type contacts where a few basic concepts are dealt with in some detail. (Auth.)

  12. Semiconductor Electrical Measurements Laboratory

    Data.gov (United States)

    Federal Laboratory Consortium — The Semiconductor Electrical Measurements Laboratory is a research laboratory which complements the Optical Measurements Laboratory. The laboratory provides for Hall...

  13. Decal Electronics: Printable Packaged with 3D Printing High-Performance Flexible CMOS Electronic Systems

    KAUST Repository

    Sevilla, Galo T.

    2016-10-14

    High-performance complementary metal oxide semiconductor electronics are flexed, packaged using 3D printing as decal electronics, and then printed in roll-to-roll fashion for highly manufacturable printed flexible high-performance electronic systems.

  14. Decal Electronics: Printable Packaged with 3D Printing High-Performance Flexible CMOS Electronic Systems

    KAUST Repository

    Sevilla, Galo T.; Cordero, Marlon D.; Nassar, Joanna M.; Hanna, Amir; Kutbee, Arwa T.; Carreno, Armando Arpys Arevalo; Hussain, Muhammad Mustafa

    2016-01-01

    High-performance complementary metal oxide semiconductor electronics are flexed, packaged using 3D printing as decal electronics, and then printed in roll-to-roll fashion for highly manufacturable printed flexible high-performance electronic systems.

  15. Science packages

    Science.gov (United States)

    1997-01-01

    Primary science teachers in Scotland have a new updating method at their disposal with the launch of a package of CDi (Compact Discs Interactive) materials developed by the BBC and the Scottish Office. These were a response to the claim that many primary teachers felt they had been inadequately trained in science and lacked the confidence to teach it properly. Consequently they felt the need for more in-service training to equip them with the personal understanding required. The pack contains five disks and a printed user's guide divided up as follows: disk 1 Investigations; disk 2 Developing understanding; disks 3,4,5 Primary Science staff development videos. It was produced by the Scottish Interactive Technology Centre (Moray House Institute) and is available from BBC Education at £149.99 including VAT. Free Internet distribution of science education materials has also begun as part of the Global Schoolhouse (GSH) scheme. The US National Science Teachers' Association (NSTA) and Microsoft Corporation are making available field-tested comprehensive curriculum material including 'Micro-units' on more than 80 topics in biology, chemistry, earth and space science and physics. The latter are the work of the Scope, Sequence and Coordination of High School Science project, which can be found at http://www.gsh.org/NSTA_SSandC/. More information on NSTA can be obtained from its Web site at http://www.nsta.org.

  16. Extreme temperature packaging: challenges and opportunities

    Science.gov (United States)

    Johnson, R. Wayne

    2016-05-01

    Consumer electronics account for the majority of electronics manufactured today. Given the temperature limits of humans, consumer electronics are typically rated for operation from -40°C to +85°C. Military applications extend the range to -65°C to +125°C while underhood automotive electronics may see +150°C. With the proliferation of the Internet of Things (IoT), the goal of instrumenting (sensing, computation, transmission) to improve safety and performance in high temperature environments such as geothermal wells, nuclear reactors, combustion chambers, industrial processes, etc. requires sensors, electronics and packaging compatible with these environments. Advances in wide bandgap semiconductors (SiC and GaN) allow the fabrication of high temperature compatible sensors and electronics. Integration and packaging of these devices is required for implementation into actual applications. The basic elements of packaging are die attach, electrical interconnection and the package or housing. Consumer electronics typically use conductive adhesives or low melting point solders for die attach, wire bonds or low melting solder for electrical interconnection and epoxy for the package. These materials melt or decompose in high temperature environments. This paper examines materials and processes for high temperature packaging including liquid transient phase and sintered nanoparticle die attach, high melting point wires for wire bonding and metal and ceramic packages. The limitations of currently available solutions will also be discussed.

  17. Noncontact COS charge analysis for in-line monitoring of wet cleaning processes

    Science.gov (United States)

    Zhang, Xiafang; Juang, Min; Tai, Sung-Shan; Chen, Kuo-in; Wossen, Ejigu; Horner, Gregory

    1998-08-01

    Contamination levels in chemical cleaning equipment and wafer cleanliness in general are very critical to semiconductor manufacturers. In this work, a Keithley Instruments non contact electrical tester (Quantox) is used to measure the mobile ion (Qm) contamination in a variety of cleaning processes. Results show that photoresist strip cleaning process has a higher mobile ion concentration than standard pre-diffusion cleaning process. RCA1, RCA2 and HF solutions mapping measured by the Quantox indicates some negative static charges on the surface after cleaning. This negative field appears to assist Qm removal during wet chemical cleaning. The dependence of flatband voltage and other oxide charges on various cleaning processes has also been investigated using the Quantox. The data suggests that a dipole layer has been formed by a surface reaction during chemical cleaning.

  18. Clean Energy Progress Report

    Energy Technology Data Exchange (ETDEWEB)

    NONE

    2011-07-01

    For the past several years, the IEA and others have been calling for a clean energy revolution to achieve global energy security, economic growth and climate change goals. This report analyses for the first time progress in global clean energy technology deployment against the pathways that are needed to achieve these goals. It provides an overview of technology deployment status, key policy developments and public spending on RDD&D of clean energy technologies.

  19. Ultra-clean

    International Nuclear Information System (INIS)

    Hergenroether, K.

    1987-01-01

    No other method guarantees such a thorough cleaning of contaminated materials' surfaces. Only ultrasound can reach those cavities crevices and corners where any manual cleaning fails. Furthermore there is no cumbersome and time-consuming manual decontamination which often has to be carried out in glove boxes and hot cells. Depending on the design the cleaning effect can reach from removing adhering dirt particles to removing complete surface layers. (orig./PW) [de

  20. Semiconductors data handbook

    CERN Document Server

    Madelung, Otfried

    2004-01-01

    This volume Semiconductors: Data Handbook contains frequently used data from the corresponding larger Landolt-Börnstein handbooks in a low price book for the individual scientist working in the laboratory. The Handbook contain important information about a large number of semiconductors

  1. Semiconductor radiation detection systems

    CERN Document Server

    2010-01-01

    Covers research in semiconductor detector and integrated circuit design in the context of medical imaging using ionizing radiation. This book explores other applications of semiconductor radiation detection systems in security applications such as luggage scanning, dirty bomb detection and border control.

  2. Spin physics in semiconductors

    CERN Document Server

    Dyakonov, Mikhail I

    2008-01-01

    This book describes beautiful optical and transport phenomena related to the electron and nuclear spins in semiconductors with emphasis on a clear presentation of the physics involved. Recent results on quantum wells and quantum dots are reviewed. The book is intended for students and researchers in the fields of semiconductor physics and nanoelectronics.

  3. Compound Semiconductor Radiation Detectors

    CERN Document Server

    Owens, Alan

    2012-01-01

    Although elemental semiconductors such as silicon and germanium are standard for energy dispersive spectroscopy in the laboratory, their use for an increasing range of applications is becoming marginalized by their physical limitations, namely the need for ancillary cooling, their modest stopping powers, and radiation intolerance. Compound semiconductors, on the other hand, encompass such a wide range of physical and electronic properties that they have become viable competitors in a number of applications. Compound Semiconductor Radiation Detectors is a consolidated source of information on all aspects of the use of compound semiconductors for radiation detection and measurement. Serious Competitors to Germanium and Silicon Radiation Detectors Wide-gap compound semiconductors offer the ability to operate in a range of hostile thermal and radiation environments while still maintaining sub-keV spectral resolution at X-ray wavelengths. Narrow-gap materials offer the potential of exceeding the spectral resolutio...

  4. Terahertz semiconductor nonlinear optics

    DEFF Research Database (Denmark)

    Turchinovich, Dmitry; Hvam, Jørn Märcher; Hoffmann, Matthias

    2013-01-01

    In this proceedings we describe our recent results on semiconductor nonlinear optics, investigated using single-cycle THz pulses. We demonstrate the nonlinear absorption and self-phase modulation of strong-field THz pulses in doped semiconductors, using n-GaAs as a model system. The THz...... nonlinearity in doped semiconductors originates from the near-instantaneous heating of free electrons in the ponderomotive potential created by electric field of the THz pulse, leading to ultrafast increase of electron effective mass by intervalley scattering. Modification of effective mass in turn leads...... to a decrease of plasma frequency in semiconductor and produces a substantial modification of THz-range material dielectric function, described by the Drude model. As a result, the nonlinearity of both absorption coefficient and refractive index of the semiconductor is observed. In particular we demonstrate...

  5. Organic semiconductor crystals.

    Science.gov (United States)

    Wang, Chengliang; Dong, Huanli; Jiang, Lang; Hu, Wenping

    2018-01-22

    Organic semiconductors have attracted a lot of attention since the discovery of highly doped conductive polymers, due to the potential application in field-effect transistors (OFETs), light-emitting diodes (OLEDs) and photovoltaic cells (OPVs). Single crystals of organic semiconductors are particularly intriguing because they are free of grain boundaries and have long-range periodic order as well as minimal traps and defects. Hence, organic semiconductor crystals provide a powerful tool for revealing the intrinsic properties, examining the structure-property relationships, demonstrating the important factors for high performance devices and uncovering fundamental physics in organic semiconductors. This review provides a comprehensive overview of the molecular packing, morphology and charge transport features of organic semiconductor crystals, the control of crystallization for achieving high quality crystals and the device physics in the three main applications. We hope that this comprehensive summary can give a clear picture of the state-of-art status and guide future work in this area.

  6. How clean is clean?---How clean is needed?

    International Nuclear Information System (INIS)

    Hays, A.K.

    1991-01-01

    This paper will provide an overview of cleaning qualifications used in a variety of industries: from small-scale manufacturer's of precision-machined products to large-scale manufacturer's of electronics (printed wiring boards and surface mount technology) and microelectronics. Cleanliness testing techniques used in the production of precision-machined products, will be described. The on-going DOD program to obtain high-reliability electronics, through the use of military specifications for cleaning and cleanliness levels, will be reviewed. In addition, the continually changing cleanroom/materials standards of the microelectronics industry will be discussed. Finally, we will speculate on the role that new and improved analytical techniques and sensor technologies will play in the factories of the future. 4 refs., 1 tab

  7. Power Electronic Packaging Design, Assembly Process, Reliability and Modeling

    CERN Document Server

    Liu, Yong

    2012-01-01

    Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic difference between IC fabrication and power electronic packaging, the book systematically introduces typical power electronic packaging design, assembly, reliability and failure analysis and material selection so readers can clearly understand each task's unique characteristics. Power electronic packaging is one of the fastest growing segments in the power electronic industry, due to the rapid growth of power integrated circuit (IC) fabrication, especially for applications like portable, consumer, home, computing and automotive electronics. This book also covers how advances in both semiconductor content and power advanced package design have helped cause advances in power device capability in recent years. The author extrapolates the most recent trends in the book's areas of focus to highlight where further improvement in materials and techniques can d...

  8. Mechanical cleaning of graphene

    NARCIS (Netherlands)

    Goossens, A.M.; Calado, V.E.; Barreiro, A.; Watanabe, K.; Taniguchi, T.; Vandersypen, L.M.K.

    2012-01-01

    Contamination of graphene due to residues from nanofabrication often introduces background doping and reduces electron mobility. For samples of high electronic quality, post-lithography cleaning treatments are therefore needed. We report that mechanical cleaning based on contact mode atomic force

  9. Green Cleaning Label Power

    Science.gov (United States)

    Balek, Bill

    2012-01-01

    Green cleaning plays a significant and supportive role in helping education institutions meet their sustainability goals. However, identifying cleaning products, supplies and equipment that truly are environmentally preferable can be daunting. The marketplace is inundated with products and services purporting to be "green" or environmentally…

  10. Laser surface cleaning

    International Nuclear Information System (INIS)

    Freiwald, J.G.; Freiwald, D.A.

    1994-01-01

    The objective of this work is a laboratory demonstration that red-lead primer and two-part epoxy paints can be stripped from concrete and metal surfaces using surface cleaning systems based on pulsed-repetition CO 2 lasers. The three goals are to: (1) demonstrate coatings removal, including surface pore cleaning; (2) demonstrate that there is negligible release of ablated contaminants to the environment; and (3) demonstrate that the process will generate negligible amounts of additional waste compared to competing technologies. Phase 1 involved site visits to RMI and Fernald to assess the cleaning issues for buildings and parts. In addition, Phase 1 included detailed designs of a more powerful system for industrial cleaning rates, including laser, articulating optics, ablated-material capture suction nozzle attached to a horizontal raster scanner for floor cleaning, and filtration system. Some concept development is also being done for using robots, and for parts cleaning. In Phase 2 a transportable 6 kW system will be built and tested, with a horizontal surface scanner for cleaning paint from floors. The laboratory tests will again be instrumented. Some concept development will continue for using robots, and for parts cleaning. This report describes Phase 1 results

  11. Atomic Level Cleaning of Poly Methyl Methacrylate Residues from the Graphene Surface Using Radiolized Water at High Temperatures (Postprint)

    Science.gov (United States)

    2017-09-05

    arbitrary substrates like oxides, semiconductors , or even on other 2-D materials in order to make 2-D heterostructures.11–19 Poly-methyl...Following approaches utilized in semiconductor manufacturing, where PMMA is cleaned from the surface of semiconductors after lithographic patterning, wet...of these suggest the presence of significant amount of PMMA residue and inorganic particles made of SiOx and carbon in different places of the chip

  12. Correlating Cleaning Thoroughness with Effectiveness and Briefly Intervening to Affect Cleaning Outcomes: How Clean Is Cleaned?

    Directory of Open Access Journals (Sweden)

    Robert Clifford

    Full Text Available The most efficient approach to monitoring and improving cleaning outcomes remains unresolved. We sought to extend the findings of a previous study by determining whether cleaning thoroughness (dye removal correlates with cleaning efficacy (absence of molecular or cultivable biomaterial and whether one brief educational intervention improves cleaning outcomes.Before-after trial.Newly built community hospital.90 minute training refresher with surface-specific performance results.Dye removal, measured by fluorescence, and biomaterial removal and acquisition, measured with culture and culture-independent PCR-based assays, were clandestinely assessed for eight consecutive months. At this midpoint, results were presented to the cleaning staff (intervention and assessments continued for another eight consecutive months.1273 surfaces were sampled before and after terminal room cleaning. In the short-term, dye removal increased from 40.3% to 50.0% (not significant. For the entire study period, dye removal also improved but not significantly. After the intervention, the number of rooms testing positive for specific pathogenic species by culturing decreased from 55.6% to 36.6% (not significant, and those testing positive by PCR fell from 80.6% to 53.7% (P = 0.016. For nonspecific biomaterial on surfaces: a removal of cultivable Gram-negatives (GN trended toward improvement (P = 0.056; b removal of any cultivable growth was unchanged but acquisition (detection of biomaterial on post-cleaned surfaces that were contaminant-free before cleaning worsened (P = 0.017; c removal of PCR-based detection of bacterial DNA improved (P = 0.046, but acquisition worsened (P = 0.003; d cleaning thoroughness and efficacy were not correlated.At this facility, a minor intervention or minimally more aggressive cleaning may reduce pathogen-specific contamination, but not without unintended consequences.

  13. Atomic hydrogen cleaning of GaAs photocathodes

    International Nuclear Information System (INIS)

    Poelker, M.; Price, J.; Sinclair, C.

    1997-01-01

    It is well known that surface contaminants on semiconductors can be removed when samples are exposed to atomic hydrogen. Atomic H reacts with oxides and carbides on the surface, forming compounds that are liberated and subsequently pumped away. Experiments at Jefferson lab with bulk GaAs in a low-voltage ultra-high vacuum H cleaning chamber have resulted in the production of photocathodes with high photoelectron yield (i.e., quantum efficiency) and long lifetime. A small, portable H cleaning apparatus also has been constructed to successfully clean GaAs samples that are later removed from the vacuum apparatus, transported through air and installed in a high-voltage laser-driven spin-polarized electron source. These results indicate that this method is a versatile and robust alternative to conventional wet chemical etching procedures usually employed to clean bulk GaAs

  14. Defects in semiconductors

    International Nuclear Information System (INIS)

    Pimentel, C.A.F.

    1983-01-01

    Some problems openned in the study of defects in semiconductors are presented. In particular, a review is made of the more important problems in Si monocrystals of basic and technological interest: microdefects and the presence of oxigen and carbon. The techniques usually utilized in the semiconductor material characterization are emphatized according its potentialities. Some applications of x-ray techniques in the epitaxial shell characterization in heterostructures, importants in electronic optics, are shown. The increase in the efficiency of these defect analysis methods in semiconductor materials with the use of synchrotron x-ray sources is shown. (L.C.) [pt

  15. Introduction to Semiconductor Devices

    Science.gov (United States)

    Brennan, Kevin F.

    2005-03-01

    This volume offers a solid foundation for understanding the most important devices used in the hottest areas of electronic engineering today, from semiconductor fundamentals to state-of-the-art semiconductor devices in the telecommunications and computing industries. Kevin Brennan describes future approaches to computing hardware and RF power amplifiers, and explains how emerging trends and system demands of computing and telecommunications systems influence the choice, design and operation of semiconductor devices. In addition, he covers MODFETs and MOSFETs, short channel effects, and the challenges faced by continuing miniaturization. His book is both an excellent senior/graduate text and a valuable reference for practicing engineers and researchers.

  16. Spin physics in semiconductors

    CERN Document Server

    2017-01-01

    This book offers an extensive introduction to the extremely rich and intriguing field of spin-related phenomena in semiconductors. In this second edition, all chapters have been updated to include the latest experimental and theoretical research. Furthermore, it covers the entire field: bulk semiconductors, two-dimensional semiconductor structures, quantum dots, optical and electric effects, spin-related effects, electron-nuclei spin interactions, Spin Hall effect, spin torques, etc. Thanks to its self-contained style, the book is ideally suited for graduate students and researchers new to the field.

  17. Physics of semiconductor lasers

    CERN Document Server

    Mroziewicz, B; Nakwaski, W

    2013-01-01

    Written for readers who have some background in solid state physics but do not necessarily possess any knowledge of semiconductor lasers, this book provides a comprehensive and concise account of fundamental semiconductor laser physics, technology and properties. The principles of operation of these lasers are therefore discussed in detail with the interrelations between their design and optical, electrical and thermal properties. The relative merits of a large number of laser structures and their parameters are described to acquaint the reader with the various aspects of the semiconductor l

  18. Semiconductors bonds and bands

    CERN Document Server

    Ferry, David K

    2013-01-01

    As we settle into this second decade of the twenty-first century, it is evident that the advances in micro-electronics have truly revolutionized our day-to-day lifestyle. The technology is built upon semiconductors, materials in which the band gap has been engineered for special values suitable to the particular application. This book, written specifically for a one semester course for graduate students, provides a thorough understanding of the key solid state physics of semiconductors. It describes how quantum mechanics gives semiconductors unique properties that enabled the micro-electronics revolution, and sustain the ever-growing importance of this revolution.

  19. Defects in semiconductors

    CERN Document Server

    Romano, Lucia; Jagadish, Chennupati

    2015-01-01

    This volume, number 91 in the Semiconductor and Semimetals series, focuses on defects in semiconductors. Defects in semiconductors help to explain several phenomena, from diffusion to getter, and to draw theories on materials' behavior in response to electrical or mechanical fields. The volume includes chapters focusing specifically on electron and proton irradiation of silicon, point defects in zinc oxide and gallium nitride, ion implantation defects and shallow junctions in silicon and germanium, and much more. It will help support students and scientists in their experimental and theoret

  20. Radiation emitter-detector package

    International Nuclear Information System (INIS)

    O'Brien, J.T.; Limm, A.C.; Nyul, P.; Tassia, V.S. Jr.

    1978-01-01

    Mounted on the metallic base of a radiation emitter-detector is a mounting block is a first projection, and a second projection. A radiation detector is on the first projection and a semiconductor electroluminescent device, i.e., a radiation emitter, is on the second projection such that the plane of the recombination region of the electroluminescent device is perpendicular to the radiation incident surface of the radiation detector. The electroluminescent device has a primary emission and a secondary emission in a direction different from the primary emission. A radiation emitter-detector package as described is ideally suited to those applications wherein the secondary radiation of the electroluminescent device is fed into a feedback circuit regulating the biasing current of the electroluminescent device

  1. Clean coal technologies

    International Nuclear Information System (INIS)

    Aslanyan, G.S.

    1993-01-01

    According to the World Energy Council (WEC), at the beginning of the next century three main energy sources - coal, nuclear power and oil will have equal share in the world's total energy supply. This forecast is also valid for the USSR which possesses more than 40% of the world's coal resources and continuously increases its coal production (more than 700 million tons of coal are processed annually in the USSR). The stringent environmental regulations, coupled with the tendency to increase the use of coal are the reasons for developing different concepts for clean coal utilization. In this paper, the potential efficiency and environmental performance of different clean coal production cycles are considered, including technologies for coal clean-up at the pre-combustion stage, advanced clean combustion methods and flue gas cleaning systems. Integrated systems, such as combined gas-steam cycle and the pressurized fluidized bed boiler combined cycle, are also discussed. The Soviet National R and D program is studying new methods for coal utilization with high environmental performance. In this context, some basic research activities in the field of clean coal technology in the USSR are considered. Development of an efficient vortex combustor, a pressurized fluidized bed gasifier, advanced gas cleaning methods based on E-beam irradiation and plasma discharge, as well as new catalytic system, are are presented. In addition, implementation of technological innovations for retrofitting and re powering of existing power plants is discussed. (author)

  2. Non-destructive testing of electronic component packages

    International Nuclear Information System (INIS)

    Anderle, C.

    1975-01-01

    A non-destructive method of investigating packaged parts of semiconductor components by X radiation is described and the relevant theoretical relations limiting this technique are derived. The application of the technique is demonstrated in testing several components. The described method is iNsimple and quick. (author)

  3. Biggest semiconductor installed

    CERN Multimedia

    2008-01-01

    Scientists and technicians at the European Laboratory for Particle Physics, commonly known by its French acronym CERN (Centre Europen pour la Recherche Nuclaire), have completed the installation of the largest semiconductor silicon detector.

  4. Compact semiconductor lasers

    CERN Document Server

    Yu, Siyuan; Lourtioz, Jean-Michel

    2014-01-01

    This book brings together in a single volume a unique contribution by the top experts around the world in the field of compact semiconductor lasers to provide a comprehensive description and analysis of the current status as well as future directions in the field of micro- and nano-scale semiconductor lasers. It is organized according to the various forms of micro- or nano-laser cavity configurations with each chapter discussing key technical issues, including semiconductor carrier recombination processes and optical gain dynamics, photonic confinement behavior and output coupling mechanisms, carrier transport considerations relevant to the injection process, and emission mode control. Required reading for those working in and researching the area of semiconductors lasers and micro-electronics.

  5. Diamond-cleaning investigations

    International Nuclear Information System (INIS)

    Derry, T.E.

    Four parcels of diamonds which either had or had not been cleaned using the usual techniques, chiefly involving etch in molten potassium nitrate were supplied by De Beers Diamond Research Laboratories. Each parcel contained about 40 stones, amounting to about 10 carats. Half the diamonds in each parcel were cleaned by a standard procedure involving half an hours ultrasonic agitation in a 20% solution of the commercial detergent 'Contrad' which is effectively a surfactant and chelating agent. Visual comparisons by a number of observers who were not told the stones' histories, established that these diamonds generally had a more sparkling appearance after the cleaning procedure had been applied

  6. Radiation effects in semiconductors

    CERN Document Server

    2011-01-01

    There is a need to understand and combat potential radiation damage problems in semiconductor devices and circuits. Written by international experts, this book explains the effects of radiation on semiconductor devices, radiation detectors, and electronic devices and components. These contributors explore emerging applications, detector technologies, circuit design techniques, new materials, and innovative system approaches. The text focuses on how the technology is being used rather than the mathematical foundations behind it. It covers CMOS radiation-tolerant circuit implementations, CMOS pr

  7. Market survey of semiconductors

    International Nuclear Information System (INIS)

    Mackintosh, I.M.; Diegel, D.; Brown, A.; Brinker, C.S. den

    1977-06-01

    Examination of technology and product trends over the range of current and future products in integrated circuits and optoelectronic displays. Analysis and forecast of major economic influences that affect the production costs of integrated circuits and optoelectronic displays. Forecast of the applications and markets for integrated circuits up to 1985 in West Europe, the USA and Japan. Historic development of the semiconductor industry and the prevailing tendencies - factors which influence success in the semiconductor industry. (orig.) [de

  8. Controlling the clean room atmosphere

    International Nuclear Information System (INIS)

    Meeks, R.F.

    1979-01-01

    Several types of clean rooms are commonly in use. They include the conventional clean room, the horizontal laminar flow clean room, the vertical laminar flow clean room and a fourth type that incorporates ideas from the previous types and is known as a clean air bench or hood. These clean rooms are briefly described. The origin of contamination and methods for controlling the contamination are discussed

  9. Electronic properties of semiconductor heterostructures

    International Nuclear Information System (INIS)

    Einevoll, G.T.

    1991-02-01

    Ten papers on the electronic properties of semiconductors and semiconductor heterostructures constitute the backbone of this thesis. Four papers address the form and validity of the single-band effective mass approximation for semiconductor heterostructures. In four other papers properties of acceptor states in bulk semiconductors and semiconductor heterostructures are studied using the novel effective bond-orbital model. The last two papers deal with localized excitions. 122 refs

  10. Waste package performance assessment

    International Nuclear Information System (INIS)

    Lester, D.H.

    1981-01-01

    This paper describes work undertaken to assess the life-expectancy and post-failure nuclide release behavior of high-level and waste packages in a geologic repository. The work involved integrating models of individual phenomena (such as heat transfer, corrosion, package deformation, and nuclide transport) and using existing data to make estimates of post-emplacement behavior of waste packages. A package performance assessment code was developed to predict time to package failure in a flooded repository and subsequent transport of nuclides out of the leaking package. The model has been used to evaluate preliminary package designs. The results indicate, that within the limitation of model assumptions and data base, packages lasting a few hundreds of years could be developed. Very long lived packages may be possible but more comprehensive data are needed to confirm this

  11. Clean Hands Count

    Medline Plus

    Full Text Available ... Clean Hands Count Centers for Disease Control and Prevention (CDC) Loading... Unsubscribe from Centers for Disease Control and Prevention (CDC)? Cancel Unsubscribe Working... Subscribe Subscribed Unsubscribe 65K ...

  12. Clean Hands Count

    Medline Plus

    Full Text Available ... Clean Hands Count Centers for Disease Control and Prevention (CDC) Loading... Unsubscribe from Centers for Disease Control and Prevention (CDC)? Cancel Unsubscribe Working... Subscribe Subscribed Unsubscribe 66K ...

  13. Clean Hands Count

    Medline Plus

    Full Text Available ... to promote or encourage adherence to CDC hand hygiene recommendations. It is a component of the Clean ... aims to address myths and misperceptions about hand hygiene and empower patients to play a role in ...

  14. Clean Hands Count

    Medline Plus

    Full Text Available ... intended to promote or encourage adherence to CDC hand hygiene recommendations. It is a component of the Clean ... also aims to address myths and misperceptions about hand hygiene and empower patients to play a role in ...

  15. Clean Hands Count

    Science.gov (United States)

    ... intended to promote or encourage adherence to CDC hand hygiene recommendations. It is a component of the Clean ... also aims to address myths and misperceptions about hand hygiene and empower patients to play a role in ...

  16. Clean Hands Count

    Medline Plus

    Full Text Available ... reminding healthcare providers to clean their hands. See: https://www.cdc.gov/handhygiene/campa... . Comments on this ... are allowed in accordance with our comment policy: http://www.cdc.gov/SocialMedia/Tools/... This video can ...

  17. Clean Water Act

    Data.gov (United States)

    National Oceanic and Atmospheric Administration, Department of Commerce — These data represent geographic terms used within the Clean Water Act (CWA). The CWA establishes the basic structure for regulating the addition of pollutants...

  18. 6 Home Cleaning Recipes

    Science.gov (United States)

    ... aluminum, brass, ceramics, chrome, copper, fiberglass, glass/quartz, plastic, and steel. GLASS CLEANER 1 cup vinegar 1 ... originally filled with commercial cleaning products. Instead, reuse plastic water bottles.  Always place a label on the ...

  19. Nuclear air cleaning

    International Nuclear Information System (INIS)

    Bellamy, R.R.

    1994-01-01

    This report briefly describes the history of the use of high- efficiency particulate air filters for air cleaning at nuclear installations in the United States and discusses future uses of such filters

  20. Clean Hands Count

    Medline Plus

    Full Text Available ... empower patients to play a role in their care by asking or reminding healthcare providers to clean ... It's in your hands - prevent sepsis in health care' A 5 May 2018 advocacy message from WHO - ...

  1. Clean Energy Finance Tool

    Science.gov (United States)

    State and local governments interested in developing a financing program can use this Excel tool to support energy efficiency and clean energy improvements for large numbers of buildings within their jurisdiction.

  2. Steam cleaning device

    International Nuclear Information System (INIS)

    Karaki, Mikio; Muraoka, Shoichi.

    1985-01-01

    Purpose: To clean complicated and long objects to be cleaned having a structure like that of nuclear reactor fuel assembly. Constitution: Steams are blown from the bottom of a fuel assembly and soon condensated initially at the bottom of a vertical water tank due to water filled therein. Then, since water in the tank is warmed nearly to the saturation temperature, purified water is supplied from a injection device below to the injection device above the water tank on every device. In this way, since purified water is sprayed successively from below to above and steams are condensated in each of the places, the entire fuel assembly elongated in the vertical direction can be cleaned completely. Water in the reservoir goes upward like the steam flow and is drained together with the eliminated contaminations through an overflow pipe. After the cleaning has been completed, a main steam valve is closed and the drain valve is opened to drain water. (Kawakami, Y.)

  3. Clean Hands Count

    Medline Plus

    Full Text Available ... why Close Clean Hands Count Centers for Disease Control and Prevention (CDC) Loading... Unsubscribe from Centers for Disease Control and Prevention (CDC)? Cancel Unsubscribe Working... Subscribe Subscribed ...

  4. Clean Hands Count

    Medline Plus

    Full Text Available ... Published on May 5, 2017 This video for healthcare providers is intended to promote or encourage adherence ... role in their care by asking or reminding healthcare providers to clean their hands. See: https://www. ...

  5. Report revision master: an energy analysis of consumer products packaging

    Energy Technology Data Exchange (ETDEWEB)

    1980-03-01

    This report serves as a foundation for quantifying the potential for energy conservation in the Canadian consumer products packaging sector. Investigation was made of energy consumption, waste management, and energy conservation potential in the various stages of the packaging and consumption process: raw material acquisition, material and packaging manufacture, package filling and distribution, consumer use, post-consumption options (energy recovery, disposal, recycling), and cleaning and transportation (if applicable) between each stage. The food and beverage industry was singled out as the most important sector because of its large consumption of packaging. Significant opportunities for energy conservation were found, although any savings accomplished through packaging changes appear to be difficult to implement. Packaging energy savings seem to be able to be achieved only through a product-by-product, industry-by-industry initiative by means of product and package standardization. An efficient example of this is the milk distribution system, where refillable plastic jugs require only 1.4 MBtu per 3000 quarts delivered (as compared with, for example, 68.9 MBtu for disposable aluminium soft drink cans). Other conclusions are made concerning the optimization of packaging energy, with respect to types of packaging, energy requirements related to use of packaged products, impact of government policies and of retailing techiques, consumer lifestyles, and the like. 95 refs., 3 figs., 54 tabs.

  6. Heat exchanger cleaning

    International Nuclear Information System (INIS)

    Gatewood, J.R.

    1980-01-01

    A survey covers the various types of heat-exchange equipment that is cleaned routinely in fossil-fired generating plants, the hydrocarbon-processing industry, pulp and paper mills, and other industries; the various types, sources, and adverse effects of deposits in heat-exchange equipment; some details of the actual procedures for high-pressure water jetting and chemical cleaning of some specific pieces of equipment, including nuclear steam generators. (DN)

  7. Packaging for Food Service

    Science.gov (United States)

    Stilwell, E. J.

    1985-01-01

    Most of the key areas of concern in packaging the three principle food forms for the space station were covered. It can be generally concluded that there are no significant voids in packaging materials availability or in current packaging technology. However, it must also be concluded that the process by which packaging decisions are made for the space station feeding program will be very synergistic. Packaging selection will depend heavily on the preparation mechanics, the preferred presentation and the achievable disposal systems. It will be important that packaging be considered as an integral part of each decision as these systems are developed.

  8. Waste Package Lifting Calculation

    International Nuclear Information System (INIS)

    H. Marr

    2000-01-01

    The objective of this calculation is to evaluate the structural response of the waste package during the horizontal and vertical lifting operations in order to support the waste package lifting feature design. The scope of this calculation includes the evaluation of the 21 PWR UCF (pressurized water reactor uncanistered fuel) waste package, naval waste package, 5 DHLW/DOE SNF (defense high-level waste/Department of Energy spent nuclear fuel)--short waste package, and 44 BWR (boiling water reactor) UCF waste package. Procedure AP-3.12Q, Revision 0, ICN 0, calculations, is used to develop and document this calculation

  9. Warpage behavior analysis in package processes of embedded copper substrates

    Directory of Open Access Journals (Sweden)

    Hwang Yeong-Maw

    2017-01-01

    Full Text Available With the advance of the semiconductor industry and in response to the demands of ultra-thin products, packaging technology has been continuously developed. Thermal bonding process of copper pillar flip chip packages is a new bonding process in packaging technology, especially for substrates with embedded copper trace. During the packaging process, the substrate usually warps because of the heating process. In this paper, a finite element software ANSYS is used to model the embedded copper trace substrate and simulate the thermal and deformation behaviors of the substrate during the heating package process. A fixed geometric configuration equivalent to the real structure is duplicated to make the simulation of the warpage behavior of the substrate feasible. An empirical formula for predicting the warpage displacements is also established.

  10. Safety Evaluation for Packaging (onsite) T Plant Canyon Items

    International Nuclear Information System (INIS)

    OBRIEN, J.H.

    2000-01-01

    This safety evaluation for packaging (SEP) evaluates and documents the ability to safely ship mostly unique inventories of miscellaneous T Plant canyon waste items (T-P Items) encountered during the canyon deck clean off campaign. In addition, this SEP addresses contaminated items and material that may be shipped in a strong tight package (STP). The shipments meet the criteria for onsite shipments as specified by Fluor Hanford in HNF-PRO-154, Responsibilities and Procedures for all Hazardous Material Shipments

  11. Safety Evaluation for Packaging (onsite) T Plant Canyon Items

    Energy Technology Data Exchange (ETDEWEB)

    OBRIEN, J.H.

    2000-07-14

    This safety evaluation for packaging (SEP) evaluates and documents the ability to safely ship mostly unique inventories of miscellaneous T Plant canyon waste items (T-P Items) encountered during the canyon deck clean off campaign. In addition, this SEP addresses contaminated items and material that may be shipped in a strong tight package (STP). The shipments meet the criteria for onsite shipments as specified by Fluor Hanford in HNF-PRO-154, Responsibilities and Procedures for all Hazardous Material Shipments.

  12. Ecological effectiveness of oil spill countermeasures: how clean is clean?

    International Nuclear Information System (INIS)

    Baker, J.M.

    1999-01-01

    This paper with 94 references examines background levels of hydrocarbons and the difficulty of defining clean. Processes and timescales for natural cleaning, and factors affecting natural cleaning timescales are considered. Ecological advantages and disadvantages of clean-up methods are highlighted, and five case histories of oil spills are summarised. The relationships between ecological and socio-economic considerations, and the need for a net environmental benefit analysis which takes into account the advantages and disadvantages of clean-up responses and natural clean-up are discussed. A decision tree for evaluating the requirement for shore clean-up is illustrated. (UK)

  13. Merganser Download Package

    Data.gov (United States)

    U.S. Environmental Protection Agency — This data download package contains an Esri 10.0 MXD, file geodatabase and copy of this FGDC metadata record. The data in this package are used in support of the...

  14. Creative Thinking Package

    Science.gov (United States)

    Jones, Clive

    1972-01-01

    A look at the latest package from a British managment training organization, which explains and demonstrates creative thinking techniques, including brainstorming. The package, designed for groups of twelve or more, consists of tapes, visuals, and associated exercises. (Editor/JB)

  15. Molecular coatings of nitride semiconductors for optoelectronics, electronics, and solar energy harvesting

    KAUST Repository

    Ng, Tien Khee; Zhao, Chao; Priante, Davide; Ooi, Boon S.; Hussein, Mohamed Ebaid Abdrabou

    2018-01-01

    Gallium nitride based semiconductors are provided having one or more passivated surfaces. The surfaces can have a plurality of thiol compounds attached thereto for enhancement of optoelectronic properties and/or solar water splitting properties. The surfaces can also include wherein the surface has been treated with chemical solution for native oxide removal and / or wherein the surface has attached thereto a plurality of nitrides, oxides, insulating compounds, thiol compounds, or a combination thereof to create a treated surface for enhancement of optoelectronic properties and / or solar water splitting properties. Methods of making the gallium nitride based semiconductors are also provided. Methods can include cleaning a native surface of a gallium nitride semiconductor to produce a cleaned surface, etching the cleaned surface to remove oxide layers on the surface, and applying single or multiple coatings of nitrides, oxides, insulating compounds, thiol compounds, or a combination thereof attached to the surface.

  16. Molecular coatings of nitride semiconductors for optoelectronics, electronics, and solar energy harvesting

    KAUST Repository

    Ng, Tien Khee

    2018-02-01

    Gallium nitride based semiconductors are provided having one or more passivated surfaces. The surfaces can have a plurality of thiol compounds attached thereto for enhancement of optoelectronic properties and/or solar water splitting properties. The surfaces can also include wherein the surface has been treated with chemical solution for native oxide removal and / or wherein the surface has attached thereto a plurality of nitrides, oxides, insulating compounds, thiol compounds, or a combination thereof to create a treated surface for enhancement of optoelectronic properties and / or solar water splitting properties. Methods of making the gallium nitride based semiconductors are also provided. Methods can include cleaning a native surface of a gallium nitride semiconductor to produce a cleaned surface, etching the cleaned surface to remove oxide layers on the surface, and applying single or multiple coatings of nitrides, oxides, insulating compounds, thiol compounds, or a combination thereof attached to the surface.

  17. Packaging Printing Today

    OpenAIRE

    Stanislav Bolanča; Igor Majnarić; Kristijan Golubović

    2015-01-01

    Printing packaging covers today about 50% of all the printing products. Among the printing products there are printing on labels, printing on flexible packaging, printing on folding boxes, printing on the boxes of corrugated board, printing on glass packaging, synthetic and metal ones. The mentioned packaging are printed in flexo printing technique, offset printing technique, intaglio halftone process, silk – screen printing, ink ball printing, digital printing and hybrid printing process. T...

  18. Genome packaging in viruses

    OpenAIRE

    Sun, Siyang; Rao, Venigalla B.; Rossmann, Michael G.

    2010-01-01

    Genome packaging is a fundamental process in a viral life cycle. Many viruses assemble preformed capsids into which the genomic material is subsequently packaged. These viruses use a packaging motor protein that is driven by the hydrolysis of ATP to condense the nucleic acids into a confined space. How these motor proteins package viral genomes had been poorly understood until recently, when a few X-ray crystal structures and cryo-electron microscopy structures became available. Here we discu...

  19. Method of doping a semiconductor

    International Nuclear Information System (INIS)

    Yang, C.Y.; Rapp, R.A.

    1983-01-01

    A method is disclosed for doping semiconductor material. An interface is established between a solid electrolyte and a semiconductor to be doped. The electrolyte is chosen to be an ionic conductor of the selected impurity and the semiconductor material and electrolyte are jointly chosen so that any compound formed from the impurity and the semiconductor will have a free energy no lower than the electrolyte. A potential is then established across the interface so as to allow the impurity ions to diffuse into the semiconductor. In one embodiment the semiconductor and electrolyte may be heated so as to increase the diffusion coefficient

  20. Trends in Food Packaging.

    Science.gov (United States)

    Ott, Dana B.

    1988-01-01

    This article discusses developments in food packaging, processing, and preservation techniques in terms of packaging materials, technologies, consumer benefits, and current and potential food product applications. Covers implications due to consumer life-style changes, cost-effectiveness of packaging materials, and the ecological impact of…

  1. Is dry cleaning all wet?

    International Nuclear Information System (INIS)

    Ryan, M.

    1993-01-01

    Chemical solvents from dry cleaning, particularly perchloroethylene (perc), have contributed to groundwater contamination, significant levels of air pollution in and around cleaners, and chemical accumulation in food. Questions are being raised about the process of cleaning clothes with chemical, and other less toxic cleaning methods are being explored. The EPA has focused attention on the 50 year old Friedburg method of cleaning, Ecoclean, which uses no dangerous chemicals and achieves comparable results. Unfortunately, the cleaning industry is resistant to change, so cutting back on amount of clothes that need dry cleaning and making sure labels aren't exaggerating when they say dry clean only, is frequently the only consumer option now

  2. Fundamentals of semiconductor lasers

    CERN Document Server

    Numai, Takahiro

    2015-01-01

    This book explains physics under the operating principles of semiconductor lasers in detail based on the experience of the author, dealing with the first manufacturing of phase-shifted DFB-LDs and recent research on transverse modes.   The book also bridges a wide gap between journal papers and textbooks, requiring only an undergraduate-level knowledge of electromagnetism and quantum mechanics, and helps readers to understand journal papers where definitions of some technical terms vary, depending on the paper. Two definitions of the photon density in the rate equations and two definitions of the phase-shift in the phase-shifted DFB-LD are explained, and differences in the calculated results are indicated, depending on the definitions.    Readers can understand the physics of semiconductor lasers and analytical tools for Fabry-Perot LDs, DFB-LDs, and VCSELs and will be stimulated to develop semiconductor lasers themselves.

  3. Coherent dynamics in semiconductors

    DEFF Research Database (Denmark)

    Hvam, Jørn Märcher

    1998-01-01

    enhanced in quantum confined lower-dimensional systems, where exciton and biexciton effects dominate the spectra even at room temperature. The coherent dynamics of excitons are at modest densities well described by the optical Bloch equations and a number of the dynamical effects known from atomic......Ultrafast nonlinear optical spectroscopy is used to study the coherent dynamics of optically excited electron-hole pairs in semiconductors. Coulomb interaction implies that the optical inter-band transitions are dominated, at least at low temperatures, by excitonic effects. They are further...... and molecular systems are found and studied in the exciton-biexciton system of semiconductors. At densities where strong exciton interactions, or many-body effects, become dominant, the semiconductor Bloch equations present a more rigorous treatment of the phenomena Ultrafast degenerate four-wave mixing is used...

  4. Hydrogen in semiconductors II

    CERN Document Server

    Nickel, Norbert H; Weber, Eicke R; Nickel, Norbert H

    1999-01-01

    Since its inception in 1966, the series of numbered volumes known as Semiconductors and Semimetals has distinguished itself through the careful selection of well-known authors, editors, and contributors. The "Willardson and Beer" Series, as it is widely known, has succeeded in publishing numerous landmark volumes and chapters. Not only did many of these volumes make an impact at the time of their publication, but they continue to be well-cited years after their original release. Recently, Professor Eicke R. Weber of the University of California at Berkeley joined as a co-editor of the series. Professor Weber, a well-known expert in the field of semiconductor materials, will further contribute to continuing the series' tradition of publishing timely, highly relevant, and long-impacting volumes. Some of the recent volumes, such as Hydrogen in Semiconductors, Imperfections in III/V Materials, Epitaxial Microstructures, High-Speed Heterostructure Devices, Oxygen in Silicon, and others promise that this tradition ...

  5. Photoelectronic properties of semiconductors

    CERN Document Server

    Bube, Richard H

    1992-01-01

    The interaction between light and electrons in semiconductors forms the basis for many interesting and practically significant properties. This book examines the fundamental physics underlying this rich complexity of photoelectronic properties of semiconductors, and will familiarise the reader with the relatively simple models that are useful in describing these fundamentals. The basic physics is also illustrated with typical recent examples of experimental data and observations. Following introductory material on the basic concepts, the book moves on to consider a wide range of phenomena, including photoconductivity, recombination effects, photoelectronic methods of defect analysis, photoeffects at grain boundaries, amorphous semiconductors, photovoltaic effects and photoeffects in quantum wells and superlattices. The author is Professor of Materials Science and Electrical Engineering at Stanford University, and has taught this material for many years. He is an experienced author, his earlier books having fo...

  6. Active Packaging Coatings

    Directory of Open Access Journals (Sweden)

    Luis J. Bastarrachea

    2015-11-01

    Full Text Available Active food packaging involves the packaging of foods with materials that provide an enhanced functionality, such as antimicrobial, antioxidant or biocatalytic functions. This can be achieved through the incorporation of active compounds into the matrix of the commonly used packaging materials, or by the application of coatings with the corresponding functionality through surface modification. The latter option offers the advantage of preserving the packaging materials’ bulk properties nearly intact. Herein, different coating technologies like embedding for controlled release, immobilization, layer-by-layer deposition, and photografting are explained and their potential application for active food packaging is explored and discussed.

  7. Clean utilization of coal

    International Nuclear Information System (INIS)

    Yueruem, Y.

    1992-01-01

    This volume contains 23 lectures presented at the Advanced Study Institute on 'Chemistry and Chemical Engineering of Catalytic Solid Fuel Conversion for the Production of Clean Synthetic Fuels', which was held at Akcay, Edremit, Turkey, between 21 July and August 3, 1991. Three main subjects: structure and reactivity of coal; cleaning of coal and its products, and factors affecting the environmental balance of energy usage and solutions for the future, were discussed in the Institute and these are presented under six groups in the book: Part 1. Structure and reactivity of coal; Part 2. Factors affecting environmental balance; Part 3. Pre-usage cleaning operations and processes; Part 4. Upgrading of coal liquids and gases; Part 5. Oxygen enriched processes; and Part 6. Probable future solution for energy and pollution problems. Separate abstracts have been prepared for all the lectures

  8. Clean room actuators

    Energy Technology Data Exchange (ETDEWEB)

    Higuchi, Toshiro

    1987-06-01

    This report explains on the present status of the clean room actuators including the author's research results. In a clean room, there exists a possibility of dust generation, even when a direct human work is eliminated by the use of robots or automatic machines, from the machines themselves. For this, it is important to develop such clean robots and transfer/positioning mechanism that do not generate dusts, and to develop an actuator and its control technique. Topics described in the report are as follows: 1. Prevention of dust diffusion by means of sealing. 2. Elimination of mechanical contact (Linear induction motor and pneumatic float, linear motor and magnetic attraction float, linear motor and air bearing, and magnetic bearing). 3. Contactless actuator having a positioning mechanism (Use of linear step motor and rotary contactless actuator). (15 figs, 11 refs)

  9. The Clean Air Act

    International Nuclear Information System (INIS)

    Coburn, L.L.

    1990-01-01

    The Clean Air Act amendments alter the complex laws affecting atmospheric pollution and at the same time have broad implications for energy. Specifically, the Clean Air Act amendments for the first time deal with the environmental problem of acid deposition in a way that minimizes energy and economic impacts. By relying upon a market-based system of emission trading, a least cost solution will be used to reduce sulfur dioxide (SO 2 ) emissions by almost 40 percent. The emission trading system is the centerpiece of the Clean Air Act (CAA) amendments effort to resolve energy and environmental interactions in a manner that will maximize environmental solutions while minimizing energy impacts. This paper will explore how the present CAA amendments deal with the emission trading system and the likely impact of the emission trading system and the CAA amendments upon the electric power industry

  10. Pool water cleaning facility

    Energy Technology Data Exchange (ETDEWEB)

    Yoshikawa, Kazuhiro; Kinoshita, Shoichiro [Hitachi Ltd., Tokyo (Japan); Asano, Takashi

    1998-05-29

    Only one system comprising a suppression poor water cleaning system (SPCU) and a filtration desalting tower (F/D) is connected for a plurality of nuclear power plants. Pipelines/valves for connecting the one system of the SPCU pump, the F/D and the plurality of nuclear power plants are disposed, and the system is used in common with the plurality of nuclear power plants. Pipelines/valves for connecting a pipeline for passing SP water to the commonly used SPCU pump and a skimmer surge tank are disposed, and fuel pool water is cooled and cleaned by the commonly used SPCU pump and the commonly used F/D. The number of SPCU pumps and the F/D facilities can be reduced, and a fuel pool water cooling operation mode and a fuel pool water cleaning operation mode which were conducted by an FPC pump so far are conducted by the SPCU pump. (N.H.)

  11. Keeping condensers clean

    Energy Technology Data Exchange (ETDEWEB)

    Wicker, K.

    2006-04-15

    The humble condenser is among the biggest contributors to a steam power plant's efficiency. But although a clean condenser can provide great economic benefit, a dirty one can raise plant heat rate, resulting in large losses of generation revenue and/or unnecessarily high fuel bills. Conventional methods for cleaning fouled tubes range form chemicals to scrapers to brushes and hydro-blasters. This article compares the available options and describes how one power station, Omaha Public Power District's 600 MW North Omaha coal-fired power station, cleaned up its act. The makeup and cooling water of all its five units comes from the Missouri River. 6 figs.

  12. Advances in semiconductor lasers

    CERN Document Server

    Coleman, James J; Jagadish, Chennupati

    2012-01-01

    Semiconductors and Semimetals has distinguished itself through the careful selection of well-known authors, editors, and contributors. Originally widely known as the ""Willardson and Beer"" Series, it has succeeded in publishing numerous landmark volumes and chapters. The series publishes timely, highly relevant volumes intended for long-term impact and reflecting the truly interdisciplinary nature of the field. The volumes in Semiconductors and Semimetals have been and will continue to be of great interest to physicists, chemists, materials scientists, and device engineers in academia, scien

  13. Superconductivity in doped semiconductors

    Energy Technology Data Exchange (ETDEWEB)

    Bustarret, E., E-mail: Etienne.bustarret@neel.cnrs.fr

    2015-07-15

    A historical survey of the main normal and superconducting state properties of several semiconductors doped into superconductivity is proposed. This class of materials includes selenides, tellurides, oxides and column-IV semiconductors. Most of the experimental data point to a weak coupling pairing mechanism, probably phonon-mediated in the case of diamond, but probably not in the case of strontium titanate, these being the most intensively studied materials over the last decade. Despite promising theoretical predictions based on a conventional mechanism, the occurrence of critical temperatures significantly higher than 10 K has not been yet verified. However, the class provides an enticing playground for testing theories and devices alike.

  14. Semiconductor opto-electronics

    CERN Document Server

    Moss, TS; Ellis, B

    1972-01-01

    Semiconductor Opto-Electronics focuses on opto-electronics, covering the basic physical phenomena and device behavior that arise from the interaction between electromagnetic radiation and electrons in a solid. The first nine chapters of this book are devoted to theoretical topics, discussing the interaction of electromagnetic waves with solids, dispersion theory and absorption processes, magneto-optical effects, and non-linear phenomena. Theories of photo-effects and photo-detectors are treated in detail, including the theories of radiation generation and the behavior of semiconductor lasers a

  15. Ternary chalcopyrite semiconductors

    CERN Document Server

    Shay, J L; Pamplin, B R

    2013-01-01

    Ternary Chalcopyrite Semiconductors: Growth, Electronic Properties, and Applications covers the developments of work in the I-III-VI2 and II-IV-V2 ternary chalcopyrite compounds. This book is composed of eight chapters that focus on the crystal growth, characterization, and applications of these compounds to optical communications systems. After briefly dealing with the status of ternary chalcopyrite compounds, this book goes on describing the crystal growth of II-IV-V2 and I-III-VI2 single crystals. Chapters 3 and 4 examine the energy band structure of these semiconductor compounds, illustrat

  16. Compound semiconductor device physics

    CERN Document Server

    Tiwari, Sandip

    2013-01-01

    This book provides one of the most rigorous treatments of compound semiconductor device physics yet published. A complete understanding of modern devices requires a working knowledge of low-dimensional physics, the use of statistical methods, and the use of one-, two-, and three-dimensional analytical and numerical analysis techniques. With its systematic and detailed**discussion of these topics, this book is ideal for both the researcher and the student. Although the emphasis of this text is on compound semiconductor devices, many of the principles discussed will also be useful to those inter

  17. Introductory semiconductor device physics

    CERN Document Server

    Parker, Greg

    2004-01-01

    ATOMS AND BONDINGThe Periodic TableIonic BondingCovalent BondingMetallic bondingvan der Waals BondingStart a DatabaseENERGY BANDS AND EFFECTIVE MASSSemiconductors, Insulators and MetalsSemiconductorsInsulatorsMetalsThe Concept of Effective MassCARRIER CONCENTRATIONS IN SEMICONDUCTORSDonors and AcceptorsFermi-LevelCarrier Concentration EquationsDonors and Acceptors Both PresentCONDUCTION IN SEMICONDUCTORSCarrier DriftCarrier MobilitySaturated Drift VelocityMobility Variation with TemperatureA Derivation of Ohm's LawDrift Current EquationsSemiconductor Band Diagrams with an Electric Field Presen

  18. Advancements in meat packaging.

    Science.gov (United States)

    McMillin, Kenneth W

    2017-10-01

    Packaging of meat provides the same or similar benefits for raw chilled and processed meats as other types of food packaging. Although air-permeable packaging is most prevalent for raw chilled red meat, vacuum and modified atmosphere packaging offer longer shelf life. The major advancements in meat packaging have been in the widely used plastic polymers while biobased materials and their integration into composite packaging are receiving much attention for functionality and sustainability. At this time, active and intelligent packaging are not widely used for antioxidant, antimicrobial, and other functions to stabilize and enhance meat properties although many options are being developed and investigated. The advances being made in nanotechnology will be incorporated into food packaging and presumably into meat packaging when appropriate and useful. Intelligent packaging using sensors for transmission of desired information and prompting of subsequent changes in packaging materials, environments or the products to maintain safety and quality are still in developmental stages. Copyright © 2017 Elsevier Ltd. All rights reserved.

  19. Edible packaging materials.

    Science.gov (United States)

    Janjarasskul, Theeranun; Krochta, John M

    2010-01-01

    Research groups and the food and pharmaceutical industries recognize edible packaging as a useful alternative or addition to conventional packaging to reduce waste and to create novel applications for improving product stability, quality, safety, variety, and convenience for consumers. Recent studies have explored the ability of biopolymer-based food packaging materials to carry and control-release active compounds. As diverse edible packaging materials derived from various by-products or waste from food industry are being developed, the dry thermoplastic process is advancing rapidly as a feasible commercial edible packaging manufacturing process. The employment of nanocomposite concepts to edible packaging materials promises to improve barrier and mechanical properties and facilitate effective incorporation of bioactive ingredients and other designed functions. In addition to the need for a more fundamental understanding to enable design to desired specifications, edible packaging has to overcome challenges such as regulatory requirements, consumer acceptance, and scaling-up research concepts to commercial applications.

  20. Tunable radiation emitting semiconductor device

    NARCIS (Netherlands)

    2009-01-01

    A tunable radiation emitting semiconductor device includes at least one elongated structure at least partially fabricated from one or more semiconductor materials exhibiting a bandgap characteristic including one or more energy transitions whose energies correspond to photon energies of light

  1. CLEANING OF FRENCH SITES

    CERN Multimedia

    Mauro Nonis

    2002-01-01

    In the last two weeks some cleaning problems have been remarked in several CERN buildings on the French part of CERN sites. This is mainly due to the start up of the new cleaning contract from the 1st July. These problems are not related to a budgetary reduction of the activity. We excuse for the malfunctions that have been created to CERN community and we assure you that we have taken all the needed measures to solve the problem in the shortest delay. Mauro Nonis (ST/FM)

  2. Environmental cleaning and disinfection.

    Science.gov (United States)

    Traverse, Michelle; Aceto, Helen

    2015-03-01

    The guidelines in this article provide veterinarians, veterinary technicians, and veterinary health care workers with an overview of evidence-based recommendations for the best practices associated with environmental cleaning and disinfection of a veterinary clinic that deals with small animals. Hospital-associated infections and the control and prevention programs necessary to alleviate them are addressed from an environmental perspective. Measures of hospital cleaning and disinfection include understanding mechanisms and types of contamination in veterinary settings, recognizing areas of potential concern, addressing appropriate decontamination techniques and selection of disinfectants, the management of potentially contaminated equipment, laundry, and waste management, and environmental surveillance strategies. Copyright © 2015 Elsevier Inc. All rights reserved.

  3. The development of intelligent expert system with SAT for semiconductor

    International Nuclear Information System (INIS)

    Kim, Jae Yeol; Shim, Jae Gi; Jeong, Hyun Jo; Cho, Young Tae; Kim, Chang Hyun; Ko, Myung Soo

    2001-01-01

    In this study, the researches classifying the artificial flaws in semiconductor packages are performed using pattern recognition technology. For this purposes image pattern recognition package including the user made software was developed and total procedure including ultrasonic image acquisition, equalization filtering, binary processing, edge detection and classifier selection is treated by BP(backpropagation). Specially, it is compared IP(image processing) and SOM(self-organizing map) as preprocessing method for dimensionality reduction for entrance into multi-layer perceptron(backpropagation). Also, the pattern recognition techniques is applied to the classification problem of semiconductor flaws as crack, delamination. According to this results, it is possible to acquire the recognition rate of 83.4% about delamination, 75.7% about crack for SOM, and to acquire the recognition rate of 100% for BP.

  4. Physical principles of semiconductor detectors

    International Nuclear Information System (INIS)

    Micek, S.L.

    1979-01-01

    The general properties of semiconductors with respect to the possibilities of their use as the ionization radiation detectors are discussed. Some chosen types of semiconductor junctions and their characteristics are briefly presented. There are also discussed the physical phenomena connected with the formation of barriers in various types of semiconductor counters. Finally, the basic properties of three main types of semiconductor detectors are given. (author)

  5. Metal semiconductor contacts and devices

    CERN Document Server

    Cohen, Simon S; Einspruch, Norman G

    1986-01-01

    VLSI Electronics Microstructure Science, Volume 13: Metal-Semiconductor Contacts and Devices presents the physics, technology, and applications of metal-semiconductor barriers in digital integrated circuits. The emphasis is placed on the interplay among the theory, processing, and characterization techniques in the development of practical metal-semiconductor contacts and devices.This volume contains chapters that are devoted to the discussion of the physics of metal-semiconductor interfaces and its basic phenomena; fabrication procedures; and interface characterization techniques, particularl

  6. Handbook of luminescent semiconductor materials

    CERN Document Server

    Bergman, Leah

    2011-01-01

    Photoluminescence spectroscopy is an important approach for examining the optical interactions in semiconductors and optical devices with the goal of gaining insight into material properties. With contributions from researchers at the forefront of this field, Handbook of Luminescent Semiconductor Materials explores the use of this technique to study semiconductor materials in a variety of applications, including solid-state lighting, solar energy conversion, optical devices, and biological imaging. After introducing basic semiconductor theory and photoluminescence principles, the book focuses

  7. Mathematical Modelling and Simulation of Electrical Circuits and Semiconductor Devices

    CERN Document Server

    Merten, K; Bulirsch, R

    1990-01-01

    Numerical simulation and modelling of electric circuits and semiconductor devices are of primal interest in today's high technology industries. At the Oberwolfach Conference more than forty scientists from around the world, in­ cluding applied mathematicians and electrical engineers from industry and universities, presented new results in this area of growing importance. The contributions to this conference are presented in these proceedings. They include contributions on special topics of current interest in circuit and device simulation, as well as contributions that present an overview of the field. In the semiconductor area special lectures were given on mixed finite element methods and iterative procedures for the solution of large linear systems. For three dimensional models new discretization procedures including software packages were presented. Con­ nections between semiconductor equations and the Boltzmann equation were shown as well as relations to the quantum transport equation. Other issues dis...

  8. The relationship between spontaneous abortion and female workers in the semiconductor industry.

    Science.gov (United States)

    Kim, Heechan; Kwon, Ho-Jang; Rhie, Jeongbae; Lim, Sinye; Kang, Yun-Dan; Eom, Sang-Yong; Lim, Hyungryul; Myong, Jun-Pyo; Roh, Sangchul

    2017-01-01

    This study investigated the relationship between job type and the risk for spontaneous abortion to assess the reproductive toxicity of female workers in the semiconductor industry. A questionnaire survey was administered to current female workers of two semiconductor manufacturing plants in Korea. We included female workers who became pregnant at least 6 months after the start of their employment with the company. The pregnancy outcomes of 2,242 female workers who experienced 4,037 pregnancies were investigated. Personnel records were used to assign the subjects to one of three groups: fabrication process workers, packaging process workers, and clerical workers. To adjust for within-person correlations between pregnancies, a generalized estimating equation was used. The logistic regression analysis was limited to the first pregnancy after joining the company to satisfy the assumption of independence among pregnancies. Moreover, we stratified the analysis by time period (pregnancy in the years prior to 2008 vs. after 2009) to reflect differences in occupational exposure based on semiconductor production periods. The risk for spontaneous abortion in female semiconductor workers was not significantly higher for fabrication and packaging process workers than for clerical workers. However, when we stratified by time period, the odds ratio for spontaneous abortion was significantly higher for packaging process workers who became pregnant prior to 2008 when compared with clerical workers (odds ratio: 2.21; 95% confidence interval: 1.01-4.81). When examining the pregnancies of female semiconductor workers that occurred prior to 2008, packaging process workers showed a significantly higher risk for spontaneous abortions than did clerical workers. The two semiconductor production periods in our study (prior to 2008 vs. after 2009) had different automated processes, chemical exposure levels, and working environments. Thus, the conditions prior to 2008 may have increased the

  9. Depletion field focusing in semiconductors

    NARCIS (Netherlands)

    Prins, M.W.J.; Gelder, Van A.P.

    1996-01-01

    We calculate the three-dimensional depletion field profile in a semiconductor, for a planar semiconductor material with a spatially varying potential upon the surface, and for a tip-shaped semiconductor with a constant surface potential. The nonuniform electric field gives rise to focusing or

  10. Nonlinear Elasticity of Doped Semiconductors

    Science.gov (United States)

    2017-02-01

    AFRL-RY-WP-TR-2016-0206 NONLINEAR ELASTICITY OF DOPED SEMICONDUCTORS Mark Dykman and Kirill Moskovtsev Michigan State University...2016 4. TITLE AND SUBTITLE NONLINEAR ELASTICITY OF DOPED SEMICONDUCTORS 5a. CONTRACT NUMBER FA8650-16-1-7600 5b. GRANT NUMBER 5c. PROGRAM...vibration amplitude. 15. SUBJECT TERMS semiconductors , microresonators, microelectromechanical 16. SECURITY CLASSIFICATION OF: 17. LIMITATION OF

  11. Semi-conductor rectifiers

    International Nuclear Information System (INIS)

    1981-01-01

    A method is described for treating a semiconductor rectifier, comprising: heating the rectifier to a temperature in the range of 100 0 C to 500 0 C, irradiating the rectifier while maintaining its temperature within the said range, and then annealing the rectifier at a temperature of between 280 0 C and 350 0 C for between two and ten hours. (author)

  12. Semiconductor detector physics

    International Nuclear Information System (INIS)

    Equer, B.

    1987-01-01

    Comprehension of semiconductor detectors follows comprehension of some elements of solid state physics. They are recalled here, limited to the necessary physical principles, that is to say the conductivity. P-n and MIS junctions are discussed in view of their use in detection. Material and structure (MOS, p-n, multilayer, ..) are also reviewed [fr

  13. Laser-assisted cleaning

    Indian Academy of Sciences (India)

    Experiments conducted with loose contamination on metal and transparent dielectric surfaces proved conclusively the dominant role played by the absorption of the incident radiation by the surface towards the generation of the cleaning force as against the absorption in the particulates alone. Further, the presence of ...

  14. Road-Cleaning Device

    Science.gov (United States)

    Roman, Harry T.

    2014-01-01

    Roadways are literally soaked with petrochemical byproducts, oils, gasoline, and other volatile substances that eventually run off into sewers and end up in rivers, waterways, and other undesirable places. Can the roads be cleaned of these wastes, with their proper disposal? Can vehicles, robots, or other devices be designed that could be driven…

  15. Clean energy microgrids

    CERN Document Server

    Obara, Shin'ya

    2017-01-01

    This book describes the latest technology in microgrids and economic, environmental and policy aspects of their implementation, including microgrids for cold regions, and future trends. The aim of this work is to give this complete overview of the latest technology around the world, and the interrelation with clean energy systems.

  16. Clean Hands Count

    Medline Plus

    Full Text Available ... starting stop Loading... Watch Queue Queue __count__/__total__ It’s YouTube. Uninterrupted. Loading... Want music and videos with ... ads? Get YouTube Red. Working... Not now Try it free Find out why Close Clean Hands Count ...

  17. WINDOW-CLEANING

    CERN Multimedia

    Environmental Section / ST-TFM

    2001-01-01

    The two-month window-cleaning session on the Meyrin, Prévessin and LEP sites will soon begin. The cleaning contractors will work from Monday to Saturday, every week from 4.00 a.m. to 8.00 p.m. The work will be organised so as to disturb users as little as possible. In any event, a work notice will be left in each office 24 hours beforehand. To prevent any damage to documents or items which could occur despite the precautions taken, please clear completely the window-sills and the area immediately around them. If, however, for valid reasons, the work cannot be done on the scheduled day, please inform the Environmental Section by telephoning: 73753 / 74233 / 72242 If you are going to be absent during this two-month period, we should be grateful if you would clear the above mentioned areas before your departure. REMINDER To allow more thorough cleaning of the entrance doors to buildings and also facilitate the weekly work of the cleaning contractors, we ask you to make use of the notice boards at the...

  18. Acrylic vessel cleaning tests

    International Nuclear Information System (INIS)

    Earle, D.; Hahn, R.L.; Boger, J.; Bonvin, E.

    1997-01-01

    The acrylic vessel as constructed is dirty. The dirt includes blue tape, Al tape, grease pencil, gemak, the glue or residue form these tapes, finger prints and dust of an unknown composition but probably mostly acrylic dust. This dirt has to be removed and once removed, the vessel has to be kept clean or at least to be easily cleanable at some future stage when access becomes much more difficult. The authors report on the results of a series of tests designed: (a) to prepare typical dirty samples of acrylic; (b) to remove dirt stuck to the acrylic surface; and (c) to measure the optical quality and Th concentration after cleaning. Specifications of the vessel call for very low levels of Th which could come from tape residues, the grease pencil, or other sources of dirt. This report does not address the concerns of how to keep the vessel clean after an initial cleaning and during the removal of the scaffolding. Alconox is recommended as the cleaner of choice. This acrylic vessel will be used in the Sudbury Neutrino Observatory

  19. Clean Hands Count

    Medline Plus

    Full Text Available ... is starting stop Loading... Watch Queue Queue __count__/__total__ It’s YouTube. Uninterrupted. Loading... Want music and videos ... empower patients to play a role in their care by asking or reminding healthcare providers to clean ...

  20. Lithium niobate packaging challenges

    International Nuclear Information System (INIS)

    Murphy, E.J.; Holmes, R.J.; Jander, R.B.; Schelling, A.W.

    1988-01-01

    The use of lithium niobate integrated optic devices outside of the research laboratory is predicated on the development of a sound packaging method. The authors present a discussion of the many issues that face the development of a viable, robust packaging technology. The authors emphasize the interaction of lithium niobate's physical properties with available packaging materials and technologies. The broad range of properties (i.e. electro-optic, piezo-electric, pyro-electric, photorefractive...) that make lithium niobate an interesting material in many device applications also make it a packaging challenge. The package design, materials and packaging technologies must isolate the device from the environment so that lithium niobate's properties do not adversely affect the device performance

  1. Packaged die heater

    Science.gov (United States)

    Spielberger, Richard; Ohme, Bruce Walker; Jensen, Ronald J.

    2011-06-21

    A heater for heating packaged die for burn-in and heat testing is described. The heater may be a ceramic-type heater with a metal filament. The heater may be incorporated into the integrated circuit package as an additional ceramic layer of the package, or may be an external heater placed in contact with the package to heat the die. Many different types of integrated circuit packages may be accommodated. The method provides increased energy efficiency for heating the die while reducing temperature stresses on testing equipment. The method allows the use of multiple heaters to heat die to different temperatures. Faulty die may be heated to weaken die attach material to facilitate removal of the die. The heater filament or a separate temperature thermistor located in the package may be used to accurately measure die temperature.

  2. Packaging for Sustainability

    CERN Document Server

    Lewis, Helen; Fitzpatrick, Leanne

    2012-01-01

    The packaging industry is under pressure from regulators, customers and other stakeholders to improve packaging’s sustainability by reducing its environmental and societal impacts. This is a considerable challenge because of the complex interactions between products and their packaging, and the many roles that packaging plays in the supply chain. Packaging for Sustainability is a concise and readable handbook for practitioners who are trying to implement sustainability strategies for packaging. Industry case studies are used throughout the book to illustrate possible applications and scenarios. Packaging for Sustainability draws on the expertise of researchers and industry practitioners to provide information on business benefits, environmental issues and priorities, environmental evaluation tools, design for environment, marketing strategies, and challenges for the future.

  3. Clean Energy Solutions Center: Assisting Countries with Clean Energy Policy

    Science.gov (United States)

    advice on financing instruments. In a recent keynote to the Climate and Clean Energy Investment Forum renewable energy technologies in the country. Informing Energy Access and Clean Energy Project Finance understanding and knowledge of how to design policies that enable financing and encourage investment in clean

  4. MARS software package status

    International Nuclear Information System (INIS)

    Azhgirej, I.L.; Talanov, V.V.

    2000-01-01

    The MARS software package is intended for simulating the nuclear-electromagnetic cascades and the secondary neutrons and muons transport in the heterogeneous medium of arbitrary complexity in the magnetic fields presence. The inclusive approach to describing the particle production in the nuclear and electromagnetic interactions and by the unstable particles decay is realized in the package. The MARS software package was actively applied for solving various radiation physical problems [ru

  5. Book of Knowledge (BOK) for NASA Electronic Packaging Roadmap

    Science.gov (United States)

    Ghaffarian, Reza

    2015-01-01

    The objective of this document is to update the NASA roadmap on packaging technologies (initially released in 2007) and to present the current trends toward further reducing size and increasing functionality. Due to the breadth of work being performed in the area of microelectronics packaging, this report presents only a number of key packaging technologies detailed in three industry roadmaps for conventional microelectronics and a more recently introduced roadmap for organic and printed electronics applications. The topics for each category were down-selected by reviewing the 2012 reports of the International Technology Roadmap for Semiconductor (ITRS), the 2013 roadmap reports of the International Electronics Manufacturing Initiative (iNEMI), the 2013 roadmap of association connecting electronics industry (IPC), the Organic Printed Electronics Association (OE-A). The report also summarizes the results of numerous articles and websites specifically discussing the trends in microelectronics packaging technologies.

  6. User friendly packaging

    DEFF Research Database (Denmark)

    Geert Jensen, Birgitte

    2010-01-01

    Most consumers have experienced occasional problems with opening packaging. Tomato sauce from the tinned mackerel splattered all over the kitchen counter, the unrelenting pickle jar lid, and the package of sliced ham that cannot be opened without a knife or a pair of scissors. The research project...... “User-friendly Packaging” aims to create a platform for developing more user-friendly packaging. One intended outcome of the project is a guideline that industry can use in development efforts. The project also points the way for more extended collaboration between companies and design researchers. How...... can design research help industry in packaging innovation?...

  7. The ZOOM minimization package

    International Nuclear Information System (INIS)

    Fischler, Mark S.; Sachs, D.

    2004-01-01

    A new object-oriented Minimization package is available for distribution in the same manner as CLHEP. This package, designed for use in HEP applications, has all the capabilities of Minuit, but is a re-write from scratch, adhering to modern C++ design principles. A primary goal of this package is extensibility in several directions, so that its capabilities can be kept fresh with as little maintenance effort as possible. This package is distinguished by the priority that was assigned to C++ design issues, and the focus on producing an extensible system that will resist becoming obsolete

  8. Plasma physics plotting package

    International Nuclear Information System (INIS)

    Hyman, D.H.

    1981-02-01

    We describe a package of plotting routines that do up to six two- or three-dimensional plots on a frame with minimal loss of resolution. The package now runs on a PDP-10 with PLOT-10 TCS primitives and on a Control Data Corporation-7600 and a Cray-1 with TV80LIB primitives on the National Magnetic Fusion Energy Computer Center network. The package is portable to other graphics systems because only the primitive plot calls are used from the underlying system's graphics package

  9. Active food packaging technologies.

    Science.gov (United States)

    Ozdemir, Murat; Floros, John D

    2004-01-01

    Active packaging technologies offer new opportunities for the food industry, in the preservation of foods. Important active packaging systems currently known to date, including oxygen scavengers, carbon dioxide emitters/absorbers, moisture absorbers, ethylene absorbers, ethanol emitters, flavor releasing/absorbing systems, time-temperature indicators, and antimicrobial containing films, are reviewed. The principle of operation of each active system is briefly explained. Recent technological advances in active packaging are discussed, and food related applications are presented. The effects of active packaging systems on food quality and safety are cited.

  10. Plasma cleaning for waste minimization

    Energy Technology Data Exchange (ETDEWEB)

    Ward, P.P.

    1993-07-01

    Although plasma cleaning is a recognized substitute for solvent cleaning in removing organic contaminants, some universal problems in plasma cleaning processes prevent wider use of plasma techniques. Lack of understanding of the fundamental mechanisms of the process, unreliable endpoint detection techniques, and slow process times make plasma cleaning processes less than desirable. Our approach to address these plasma cleaning problems is described. A comparison of plasma cleaning rates of oxygen and oxygen/sulfur hexafluoride gases shows that fluorine-containing plasmas can enhance etch rates by 400% over oxygen alone. A discussion of various endpoint indication techniques is discussed and compared for application suitability. Work toward a plasma cleaning database is discussed. In addition to the global problems of plasma cleaning, an experiment where the specific mixed-waste problem of removal of machine oils from radioactive scrap metal is discussed.

  11. Clean Energy Solutions Center Services

    Energy Technology Data Exchange (ETDEWEB)

    2016-03-01

    The Solutions Center offers no-cost expert policy assistance, webinars and training forums, clean energy policy reports, data, and tools provided in partnership with more than 35 leading international and regional clean energy organizations.

  12. Automated cleaning of electronic components

    International Nuclear Information System (INIS)

    Drotning, W.; Meirans, L.; Wapman, W.; Hwang, Y.; Koenig, L.; Petterson, B.

    1994-01-01

    Environmental and operator safety concerns are leading to the elimination of trichloroethylene and chlorofluorocarbon solvents in cleaning processes that remove rosin flux, organic and inorganic contamination, and particulates from electronic components. Present processes depend heavily on these solvents for manual spray cleaning of small components and subassemblies. Use of alternative solvent systems can lead to longer processing times and reduced quality. Automated spray cleaning can improve the quality of the cleaning process, thus enabling the productive use of environmentally conscious materials, while minimizing personnel exposure to hazardous materials. We describe the development of a prototype robotic system for cleaning electronic components in a spray cleaning workcell. An important feature of the prototype system is the capability to generate the robot paths and motions automatically from the CAD models of the part to be cleaned, and to embed cleaning process knowledge into the automatically programmed operations

  13. Enhanced thermaly managed packaging for III-nitride light emitters

    Science.gov (United States)

    Kudsieh, Nicolas

    In this Dissertation our work on `enhanced thermally managed packaging of high power semiconductor light sources for solid state lighting (SSL)' is presented. The motivation of this research and development is to design thermally high stable cost-efficient packaging of single and multi-chip arrays of III-nitrides wide bandgap semiconductor light sources through mathematical modeling and simulations. Major issues linked with this technology are device overheating which causes serious degradation in their illumination intensity and decrease in the lifetime. In the introduction the basics of III-nitrides WBG semiconductor light emitters are presented along with necessary thermal management of high power cingulated and multi-chip LEDs and laser diodes. This work starts at chip level followed by its extension to fully packaged lighting modules and devices. Different III-nitride structures of multi-quantum well InGaN/GaN and AlGaN/GaN based LEDs and LDs were analyzed using advanced modeling and simulation for different packaging designs and high thermal conductivity materials. Study started with basic surface mounted devices using conventional packaging strategies and was concluded with the latest thermal management of chip-on-plate (COP) method. Newly discovered high thermal conductivity materials have also been incorporated for this work. Our study also presents the new approach of 2D heat spreaders using such materials for SSL and micro LED array packaging. Most of the work has been presented in international conferences proceedings and peer review journals. Some of the latest work has also been submitted to well reputed international journals which are currently been reviewed for publication. .

  14. Sustainable development with clean coal

    Energy Technology Data Exchange (ETDEWEB)

    NONE

    1997-08-01

    This paper discusses the opportunities available with clean coal technologies. Applications include new power plants, retrofitting and repowering of existing power plants, steelmaking, cement making, paper manufacturing, cogeneration facilities, and district heating plants. An appendix describes the clean coal technologies. These include coal preparation (physical cleaning, low-rank upgrading, bituminous coal preparation); combustion technologies (fluidized-bed combustion and NOx control); post-combustion cleaning (particulate control, sulfur dioxide control, nitrogen oxide control); and conversion with the integrated gasification combined cycle.

  15. Canyon solvent cleaning

    International Nuclear Information System (INIS)

    Reif, D.J.

    1986-01-01

    The HM Process at the Savannah River Plant (SRP) uses 7.5% tributylphosphate in n-paraffin as an extraction solvent. During use, the solvent is altered due to hydrolysis and radiolysis, forming materials that influence product losses, produce decontamination, and separation efficiencies. Laboratory studies to improve online solvent cleaning have shown the carbonate washing, although removing residual solvent activity does not remove binding ligands that hold fission products in the solvent. Treatment of solvent by an alumina adsorption process removes binding ligands and significantly improves recycle solvent performance. Both laboratory work defining a full-scale alumina adsorption process and the use of the process to clean HM Process first cycle solvent are presented

  16. Solar panel cleaning robot

    Science.gov (United States)

    Nalladhimmu, Pavan Kumar Reddy; Priyadarshini, S.

    2018-04-01

    As the demand of electricity is increasing, there is need to using the renewable sources to produce the energy at present of power shortage, the use of solar energy could be beneficial to great extent and easy to get the maximum efficiency. There is an urgent in improving the efficiency of solar power generation. Current solar panels setups take a major power loss when unwanted obstructions cover the surface of the panels. To make solar energy more efficiency of solar array systems must be maximized efficiency evaluation of PV panels, that has been discussed with particular attention to the presence of dust on the efficiency of the PV panels have been highlighted. This paper gives the how the solar panel cleaning system works and designing of the cleaning system.

  17. Evaporator Cleaning Studies

    International Nuclear Information System (INIS)

    Wilmarth, W.R.

    1999-01-01

    Operation of the 242-16H High Level Waste Evaporator proves crucial to liquid waste management in the H-Area Tank Farm. Recent operational history of the Evaporator showed significant solid formation in secondary lines and in the evaporator pot. Additional samples remain necessary to ensure material identity in the evaporator pot. Analysis of these future samples will provide actinide partitioning information and dissolution characteristics of the solid material from the pot to ensure safe chemical cleaning

  18. Cleanly: trashducation urban system

    DEFF Research Database (Denmark)

    Reif, Inbal; Alt, Florian; Ramos, Juan David Hincapie

    Half the world's population is expected to live in urban areas by 2020. The high human density and changes in peoples' consumption habits result in an ever-increasing amount of trash that must be handled by governing bodies. Problems created by inefficient or dysfunctional cleaning services are e......, which not only motivates our research but also provides useful information on reasons and possible solutions for trash problems....

  19. Single frequency semiconductor lasers

    CERN Document Server

    Fang, Zujie; Chen, Gaoting; Qu, Ronghui

    2017-01-01

    This book systematically introduces the single frequency semiconductor laser, which is widely used in many vital advanced technologies, such as the laser cooling of atoms and atomic clock, high-precision measurements and spectroscopy, coherent optical communications, and advanced optical sensors. It presents both the fundamentals and characteristics of semiconductor lasers, including basic F-P structure and monolithic integrated structures; interprets laser noises and their measurements; and explains mechanisms and technologies relating to the main aspects of single frequency lasers, including external cavity lasers, frequency stabilization technologies, frequency sweeping, optical phase locked loops, and so on. It paints a clear, physical picture of related technologies and reviews new developments in the field as well. It will be a useful reference to graduate students, researchers, and engineers in the field.

  20. Basic semiconductor physics

    CERN Document Server

    Hamaguchi, Chihiro

    2017-01-01

    This book presents a detailed description of basic semiconductor physics. The text covers a wide range of important phenomena in semiconductors, from the simple to the advanced. Four different methods of energy band calculations in the full band region are explained: local empirical pseudopotential, non-local pseudopotential, KP perturbation and tight-binding methods. The effective mass approximation and electron motion in a periodic potential, Boltzmann transport equation and deformation potentials used for analysis of transport properties are discussed. Further, the book examines experiments and theoretical analyses of cyclotron resonance in detail. Optical and transport properties, magneto-transport, two-dimensional electron gas transport (HEMT and MOSFET) and quantum transport are reviewed, while optical transition, electron-phonon interaction and electron mobility are also addressed. Energy and electronic structure of a quantum dot (artificial atom) are explained with the help of Slater determinants. The...

  1. Semiconductor physics an introduction

    CERN Document Server

    Seeger, Karlheinz

    1999-01-01

    Semiconductor Physics - An Introduction - is suitable for the senior undergraduate or new graduate student majoring in electrical engineering or physics. It will also be useful to solid-state scientists and device engineers involved in semiconductor design and technology. The text provides a lucid account of charge transport, energy transport and optical processes, and a detailed description of many devices. It includes sections on superlattices and quantum well structures, the effects of deep-level impurities on transport, the quantum Hall effect and the calculation of the influence of a magnetic field on the carrier distribution function. This 6th edition has been revised and corrected, and new sections have been added to different chapters.

  2. Three dimensional strained semiconductors

    Science.gov (United States)

    Voss, Lars; Conway, Adam; Nikolic, Rebecca J.; Leao, Cedric Rocha; Shao, Qinghui

    2016-11-08

    In one embodiment, an apparatus includes a three dimensional structure comprising a semiconductor material, and at least one thin film in contact with at least one exterior surface of the three dimensional structure for inducing a strain in the structure, the thin film being characterized as providing at least one of: an induced strain of at least 0.05%, and an induced strain in at least 5% of a volume of the three dimensional structure. In another embodiment, a method includes forming a three dimensional structure comprising a semiconductor material, and depositing at least one thin film on at least one surface of the three dimensional structure for inducing a strain in the structure, the thin film being characterized as providing at least one of: an induced strain of at least 0.05%, and an induced strain in at least 5% of a volume of the structure.

  3. Compound semiconductor device modelling

    CERN Document Server

    Miles, Robert

    1993-01-01

    Compound semiconductor devices form the foundation of solid-state microwave and optoelectronic technologies used in many modern communication systems. In common with their low frequency counterparts, these devices are often represented using equivalent circuit models, but it is often necessary to resort to physical models in order to gain insight into the detailed operation of compound semiconductor devices. Many of the earliest physical models were indeed developed to understand the 'unusual' phenomena which occur at high frequencies. Such was the case with the Gunn and IMPATI diodes, which led to an increased interest in using numerical simulation methods. Contemporary devices often have feature sizes so small that they no longer operate within the familiar traditional framework, and hot electron or even quantum­ mechanical models are required. The need for accurate and efficient models suitable for computer aided design has increased with the demand for a wider range of integrated devices for operation at...

  4. Optically coupled semiconductor device

    Energy Technology Data Exchange (ETDEWEB)

    Kumagaya, Naoki

    1988-11-18

    This invention concerns an optically coupled semiconductor device using the light as input signal and a MOS transistor for the output side in order to control on-off of the output side by the input signal which is insulated from the output. Concerning this sort of element, when a MOS transistor and a load resistance are planned to be accumulated on the same chip, a resistor and control of impurity concentration of the channel, etc. become necessary despite that the only formation of a simple P-N junction is enough, for a solar cell, hence cost reduction thereof cannot be done. In order to remove this defect, this invention offers an optically coupled semiconductor device featuring that two solar cells are connected in reverse parallel between the gate sources of the output MOS transistors and an operational light emitting element is individually set facing a respective solar cell. 4 figs.

  5. Laser cleaning of Rakowicze sandstone

    NARCIS (Netherlands)

    Nijland, T.G.; Wijffels, T.J.

    2003-01-01

    Decisions about the cleaning of natural stone should always be made within the awareness of direct and indirect damage that may be the result of cleaning. During the last decade, laser cleaning of objects and monuments of natural stone has become increasingly popular. Whereas a considerable amount

  6. Clean steels for fusion

    International Nuclear Information System (INIS)

    Gelles, D.S.

    1995-03-01

    Fusion energy production has an inherent advantage over fission: a fuel supply with reduced long term radioactivity. One of the leading candidate materials for structural applications in a fusion reactor is a tungsten stabilized 9% chromium Martensitic steel. This alloy class is being considered because it offers the opportunity to maintain that advantage in the reactor structure as well as provide good high temperature strength and radiation induced swelling and embrittlement resistance. However, calculations indicate that to obtain acceptable radioactivity levels within 500 years after service, clean steel will be required because the niobium impurity levels must be kept below about 2 appm and nickel, molybdenum, nitrogen, copper, and aluminum must be intentionally restricted. International efforts are addressing the problems of clean steel production. Recently, a 5,000 kg heat was vacuum induction melted in Japan using high purity commercial raw materials giving niobium levels less than 0.7 appm. This paper reviews the need for reduced long term radioactivity, defines the advantageous properties of the tungsten stabilized Martensitic steel class, and describes the international efforts to produce acceptable clean steels

  7. Doping of organic semiconductors

    Energy Technology Data Exchange (ETDEWEB)

    Luessem, B.; Riede, M.; Leo, K. [Institut fuer Angewandte Photophysik, TU Dresden (Germany)

    2013-01-15

    The understanding and applications of organic semiconductors have shown remarkable progress in recent years. This material class has been developed from being a lab curiosity to the basis of first successful products as small organic LED (OLED) displays; other areas of application such as OLED lighting and organic photovoltaics are on the verge of broad commercialization. Organic semiconductors are superior to inorganic ones for low-cost and large-area optoelectronics due to their flexibility, easy deposition, and broad variety, making tailor-made materials possible. However, electrical doping of organic semiconductors, i.e. the controlled adjustment of Fermi level that has been extremely important to the success of inorganic semiconductors, is still in its infancy. This review will discuss recent work on both fundamental principles and applications of doping, focused primarily to doping of evaporated organic layers with molecular dopants. Recently, both p- and n-type molecular dopants have been developed that lead to efficient and stable doping of organic thin films. Due to doping, the conductivity of the doped layers increases several orders of magnitude and allows for quasi-Ohmic contacts between organic layers and metal electrodes. Besides reducing voltage losses, doping thus also gives design freedom in terms of transport layer thickness and electrode choice. The use of doping in applications like OLEDs and organic solar cells is highlighted in this review. Overall, controlled molecular doping can be considered as key enabling technology for many different organic device types that can lead to significant improvements in efficiencies and lifetimes. (Copyright copyright 2013 WILEY-VCH Verlag GmbH and Co. KGaA, Weinheim)

  8. Images through semiconductors

    International Nuclear Information System (INIS)

    Anon.

    1986-01-01

    Improved image processing techniques are constantly being developed for television and for scanners using X-rays or other radiation for industrial or medical applications, etc. As Erik Heijne of CERN explains here, particle physics too has its own special requirements for image processing. The increasing use of semiconductor techniques for handling measurements down to the level of a few microns provides another example of the close interplay between scientific research and technological development. (orig.).

  9. Muonium states in semiconductors

    International Nuclear Information System (INIS)

    Patterson, B.D.

    1987-01-01

    There is a brief summary of what is known about the muonium states isotropic, anisotropic and diamagnetic in diamond and zincblende semiconductors. The report deals with muonium spectroscopy, including the formation probabilities, hyperfine parameters and electronic g-factors of the states. The dynamics of the states is treated including a discussion of the transition from isotropic Mu to anisotropic Mu in diamond, temperature-dependent linewidthes in silicon and germanium and effects of daping and radiation damage

  10. Nonradiative recombination in semiconductors

    CERN Document Server

    Abakumov, VN; Yassievich, IN

    1991-01-01

    In recent years, great progress has been made in the understandingof recombination processes controlling the number of excessfree carriers in semiconductors under nonequilibrium conditions. As a result, it is now possible to give a comprehensivetheoretical description of these processes. The authors haveselected a number of experimental results which elucidate theunderlying physical problems and enable a test of theoreticalmodels. The following topics are dealt with: phenomenological theory ofrecombination, theoretical models of shallow and deep localizedstates, cascade model of carrier captu

  11. Doping of organic semiconductors

    International Nuclear Information System (INIS)

    Luessem, B.; Riede, M.; Leo, K.

    2013-01-01

    The understanding and applications of organic semiconductors have shown remarkable progress in recent years. This material class has been developed from being a lab curiosity to the basis of first successful products as small organic LED (OLED) displays; other areas of application such as OLED lighting and organic photovoltaics are on the verge of broad commercialization. Organic semiconductors are superior to inorganic ones for low-cost and large-area optoelectronics due to their flexibility, easy deposition, and broad variety, making tailor-made materials possible. However, electrical doping of organic semiconductors, i.e. the controlled adjustment of Fermi level that has been extremely important to the success of inorganic semiconductors, is still in its infancy. This review will discuss recent work on both fundamental principles and applications of doping, focused primarily to doping of evaporated organic layers with molecular dopants. Recently, both p- and n-type molecular dopants have been developed that lead to efficient and stable doping of organic thin films. Due to doping, the conductivity of the doped layers increases several orders of magnitude and allows for quasi-Ohmic contacts between organic layers and metal electrodes. Besides reducing voltage losses, doping thus also gives design freedom in terms of transport layer thickness and electrode choice. The use of doping in applications like OLEDs and organic solar cells is highlighted in this review. Overall, controlled molecular doping can be considered as key enabling technology for many different organic device types that can lead to significant improvements in efficiencies and lifetimes. (Copyright copyright 2013 WILEY-VCH Verlag GmbH and Co. KGaA, Weinheim)

  12. Isotopically controlled semiconductors

    Energy Technology Data Exchange (ETDEWEB)

    Haller, Eugene E.

    2006-06-19

    The following article is an edited transcript based on the Turnbull Lecture given by Eugene E. Haller at the 2005 Materials Research Society Fall Meeting in Boston on November 29, 2005. The David Turnbull Lectureship is awarded to recognize the career of a scientist who has made outstanding contributions to understanding materials phenomena and properties through research, writing, and lecturing, as exemplified by the life work of David Turnbull. Haller was named the 2005 David Turnbull Lecturer for his 'pioneering achievements and leadership in establishing the field of isotopically engineered semiconductors; for outstanding contributions to materials growth, doping and diffusion; and for excellence in lecturing, writing, and fostering international collaborations'. The scientific interest, increased availability, and technological promise of highly enriched isotopes have led to a sharp rise in the number of experimental and theoretical studies with isotopically controlled semiconductor crystals. This article reviews results obtained with isotopically controlled semiconductor bulk and thin-film heterostructures. Isotopic composition affects several properties such as phonon energies, band structure, and lattice constant in subtle, but, for their physical understanding, significant ways. Large isotope-related effects are observed for thermal conductivity in local vibrational modes of impurities and after neutron transmutation doping. Spectacularly sharp photoluminescence lines have been observed in ultrapure, isotopically enriched silicon crystals. Isotope multilayer structures are especially well suited for simultaneous self- and dopant-diffusion studies. The absence of any chemical, mechanical, or electrical driving forces makes possible the study of an ideal random-walk problem. Isotopically controlled semiconductors may find applications in quantum computing, nanoscience, and spintronics.

  13. Survey of semiconductor physics

    CERN Document Server

    Böer, Karl W

    1992-01-01

    Any book that covers a large variety of subjects and is written by one author lacks by necessity the depth provided by an expert in his or her own field of specialization. This book is no exception. It has been written with the encouragement of my students and colleagues, who felt that an extensive card file I had accumulated over the years of teaching solid state and semiconductor physics would be helpful to more than just a few of us. This file, updated from time to time, contained lecture notes and other entries that were useful in my research and permitted me to give to my students a broader spectrum of information than is available in typical textbooks. When assembling this material into a book, I divided the top­ ics into material dealing with the homogeneous semiconductor, the subject of the previously published Volume 1, and the inhomoge­ neous semiconductor, the subject of this Volume 2. In order to keep the book to a manageable size, sections of tutorial character which can be used as text for a g...

  14. Semiconductor Ion Implanters

    International Nuclear Information System (INIS)

    MacKinnon, Barry A.; Ruffell, John P.

    2011-01-01

    In 1953 the Raytheon CK722 transistor was priced at $7.60. Based upon this, an Intel Xeon Quad Core processor containing 820,000,000 transistors should list at $6.2 billion! Particle accelerator technology plays an important part in the remarkable story of why that Intel product can be purchased today for a few hundred dollars. Most people of the mid twentieth century would be astonished at the ubiquity of semiconductors in the products we now buy and use every day. Though relatively expensive in the nineteen fifties they now exist in a wide range of items from high-end multicore microprocessors like the Intel product to disposable items containing 'only' hundreds or thousands like RFID chips and talking greeting cards. This historical development has been fueled by continuous advancement of the several individual technologies involved in the production of semiconductor devices including Ion Implantation and the charged particle beamlines at the heart of implant machines. In the course of its 40 year development, the worldwide implanter industry has reached annual sales levels around $2B, installed thousands of dedicated machines and directly employs thousands of workers. It represents in all these measures, as much and possibly more than any other industrial application of particle accelerator technology. This presentation discusses the history of implanter development. It touches on some of the people involved and on some of the developmental changes and challenges imposed as the requirements of the semiconductor industry evolved.

  15. The Physics of Semiconductors

    Science.gov (United States)

    Brennan, Kevin F.

    1999-02-01

    Modern fabrication techniques have made it possible to produce semiconductor devices whose dimensions are so small that quantum mechanical effects dominate their behavior. This book describes the key elements of quantum mechanics, statistical mechanics, and solid-state physics that are necessary in understanding these modern semiconductor devices. The author begins with a review of elementary quantum mechanics, and then describes more advanced topics, such as multiple quantum wells. He then disusses equilibrium and nonequilibrium statistical mechanics. Following this introduction, he provides a thorough treatment of solid-state physics, covering electron motion in periodic potentials, electron-phonon interaction, and recombination processes. The final four chapters deal exclusively with real devices, such as semiconductor lasers, photodiodes, flat panel displays, and MOSFETs. The book contains many homework exercises and is suitable as a textbook for electrical engineering, materials science, or physics students taking courses in solid-state device physics. It will also be a valuable reference for practicing engineers in optoelectronics and related areas.

  16. CYPROS - Cybernetic Program Packages

    Directory of Open Access Journals (Sweden)

    Arne Tyssø

    1980-10-01

    Full Text Available CYPROS is an interactive program system consisting of a number of special purpose packages for simulation, identification, parameter estimation and control system design. The programming language is standard FORTRAN IV and the system is implemented on a medium size computer system (Nord-10. The system is interactive and program control is obtained by the use of numeric terminals. Output is rapidly examined by extensive use of video colour graphics. The subroutines included in the packages are designed and documented according to standardization rules given by the SCL (Scandinavian Control Library organization. This simplifies the exchange of subroutines throughout the SCL system. Also, this makes the packages attractive for implementation by industrial users. In the simulation package, different integration methods are available and it can be easily used for off-line, as well as real time, simulation problems. The identification package consists of programs for single-input/single-output and multivariablc problems. Both transfer function models and state space models can be handled. Optimal test signals can be designed. The control package consists of programs based on multivariable time domain and frequency domain methods for analysis and design. In addition, there is a package for matrix and time series manipulation. CYPROS has been applied successfully to industrial problems of various kinds, and parts of the system have already been implemented on different computers in industry. This paper will, in some detail, describe the use and the contents of the packages and some examples of application will be discussed.

  17. User friendly packaging

    DEFF Research Database (Denmark)

    Geert Jensen, Birgitte

    2010-01-01

    Most consumers have experienced occasional problems with opening packaging. Tomato sauce from the tinned mackerel splattered all over the kitchen counter, the unrelenting pickle jar lid, and the package of sliced ham that cannot be opened without a knife or a pair of scissors. The research project...

  18. NRF TRIGA packaging

    International Nuclear Information System (INIS)

    Clements, M.D.

    1995-11-01

    Training Reactor Isotopes, General Atomics (TRIGA reg-sign) Reactors are in use at four US Department of Energy (DOE) complex facilities and at least 23 university, commercial, or government facilities. The development of the Neutron Radiography Facility (NRF) TRIGA packaging system began in October 1993. The Hanford Site NRF is being shut down and requires an operationally user-friendly transportation and storage packaging system for removal of the TRIGA fuel elements. The NRF TRIGA packaging system is designed to remotely remove the fuel from the reactor and transport the fuel to interim storage (up to 50 years) on the Hanford Site. The packaging system consists of a cask and an overpack. The overpack is used only for transport and is not necessary for storage. Based upon the cask's small size and light weight, small TRIGA reactors will find it versatile for numerous refueling and fuel storage needs. The NRF TRIGA packaging design also provides the basis for developing a certifiable and economical packaging system for other TRIGA reactor facilities. The small size of the NRF TRIGA cask also accommodates placing the cask into a larger certified packaging for offsite transport. The Westinghouse Hanford Company NRF TRIGA packaging, as described herein can serve other DOE sites for their onsite use, and the design can be adapted to serve university reactor facilities, handling a variety of fuel payloads

  19. WASTE PACKAGE TRANSPORTER DESIGN

    International Nuclear Information System (INIS)

    Weddle, D.C.; Novotny, R.; Cron, J.

    1998-01-01

    The purpose of this Design Analysis is to develop preliminary design of the waste package transporter used for waste package (WP) transport and related functions in the subsurface repository. This analysis refines the conceptual design that was started in Phase I of the Viability Assessment. This analysis supports the development of a reliable emplacement concept and a retrieval concept for license application design. The scope of this analysis includes the following activities: (1) Assess features of the transporter design and evaluate alternative design solutions for mechanical components. (2) Develop mechanical equipment details for the transporter. (3) Prepare a preliminary structural evaluation for the transporter. (4) Identify and recommend the equipment design for waste package transport and related functions. (5) Investigate transport equipment interface tolerances. This analysis supports the development of the waste package transporter for the transport, emplacement, and retrieval of packaged radioactive waste forms in the subsurface repository. Once the waste containers are closed and accepted, the packaged radioactive waste forms are termed waste packages (WP). This terminology was finalized as this analysis neared completion; therefore, the term disposal container is used in several references (i.e., the System Description Document (SDD)) (Ref. 5.6). In this analysis and the applicable reference documents, the term ''disposal container'' is synonymous with ''waste package''

  20. WASTE PACKAGE TRANSPORTER DESIGN

    Energy Technology Data Exchange (ETDEWEB)

    D.C. Weddle; R. Novotny; J. Cron

    1998-09-23

    The purpose of this Design Analysis is to develop preliminary design of the waste package transporter used for waste package (WP) transport and related functions in the subsurface repository. This analysis refines the conceptual design that was started in Phase I of the Viability Assessment. This analysis supports the development of a reliable emplacement concept and a retrieval concept for license application design. The scope of this analysis includes the following activities: (1) Assess features of the transporter design and evaluate alternative design solutions for mechanical components. (2) Develop mechanical equipment details for the transporter. (3) Prepare a preliminary structural evaluation for the transporter. (4) Identify and recommend the equipment design for waste package transport and related functions. (5) Investigate transport equipment interface tolerances. This analysis supports the development of the waste package transporter for the transport, emplacement, and retrieval of packaged radioactive waste forms in the subsurface repository. Once the waste containers are closed and accepted, the packaged radioactive waste forms are termed waste packages (WP). This terminology was finalized as this analysis neared completion; therefore, the term disposal container is used in several references (i.e., the System Description Document (SDD)) (Ref. 5.6). In this analysis and the applicable reference documents, the term ''disposal container'' is synonymous with ''waste package''.

  1. The BINSYN Program Package

    Directory of Open Access Journals (Sweden)

    Albert P. Linnell

    2012-06-01

    Full Text Available The BINSYN program package, recently expanded to calculate synthetic spectra of cataclysmic variables, is being further extended to include synthetic photometry of ordinary binary stars in addition to binary stars with optically thick accretion disks. The package includes a capability for differentials correction optimization of eclipsing binary systems using synthetic photometry.

  2. The LCDROOT Analysis Package

    International Nuclear Information System (INIS)

    Abe, Toshinori

    2001-01-01

    The North American Linear Collider Detector group has developed simulation and analysis program packages. LCDROOT is one of the packages, and is based on ROOT and the C++ programing language to maximally benefit from object oriented programming techniques. LCDROOT is constantly improved and now has a new topological vertex finder, ZVTOP3. In this proceeding, the features of the LCDROOT simulation are briefly described

  3. Grooming. Learning Activity Package.

    Science.gov (United States)

    Stark, Pamela

    This learning activity package on grooming for health workers is one of a series of 12 titles developed for use in health occupations education programs. Materials in the package include objectives, a list of materials needed, information sheets, reviews (self evaluations) of portions of the content, and answers to reviews. These topics are…

  4. Alternative Packaging for Back-Illuminated Imagers

    Science.gov (United States)

    Pain, Bedabrata

    2009-01-01

    An alternative scheme has been conceived for packaging of silicon-based back-illuminated, back-side-thinned complementary metal oxide/semiconductor (CMOS) and charge-coupled-device image-detector integrated circuits, including an associated fabrication process. This scheme and process are complementary to those described in "Making a Back-Illuminated Imager With Back-Side Connections" (NPO-42839), NASA Tech Briefs, Vol. 32, No. 7 (July 2008), page 38. To avoid misunderstanding, it should be noted that in the terminology of imaging integrated circuits, "front side" or "back side" does not necessarily refer to the side that, during operation, faces toward or away from a source of light or other object to be imaged. Instead, "front side" signifies that side of a semiconductor substrate upon which the pixel pattern and the associated semiconductor devices and metal conductor lines are initially formed during fabrication, and "back side" signifies the opposite side. If the imager is of the type called "back-illuminated," then the back side is the one that faces an object to be imaged. Initially, a back-illuminated, back-side-thinned image-detector is fabricated with its back side bonded to a silicon handle wafer. At a subsequent stage of fabrication, the front side is bonded to a glass wafer (for mechanical support) and the silicon handle wafer is etched away to expose the back side. The frontside integrated circuitry includes metal input/output contact pads, which are rendered inaccessible by the bonding of the front side to the glass wafer. Hence, one of the main problems is to make the input/output contact pads accessible from the back side, which is ultimately to be the side accessible to the external world. The present combination of an alternative packaging scheme and associated fabrication process constitute a solution of the problem.

  5. Waste package performance analysis

    International Nuclear Information System (INIS)

    Lester, D.H.; Stula, R.T.; Kirstein, B.E.

    1982-01-01

    A performance assessment model for multiple barrier packages containing unreprocessed spent fuel has been applied to several package designs. The resulting preliminary assessments were intended for use in making decisions about package development programs. A computer model called BARIER estimates the package life and subsequent rate of release of selected nuclides. The model accounts for temperature, pressure (and resulting stresses), bulk and localized corrosion, and nuclide retardation by the backfill after water intrusion into the waste form. The assessment model assumes a post-closure, flooded, geologic repository. Calculations indicated that, within the bounds of model assumptions, packages could last for several hundred years. Intact backfills of appropriate design may be capable of nuclide release delay times on the order of 10 7 yr for uranium, plutonium, and americium. 8 references, 6 figures, 9 tables

  6. RH Packaging Operations Manual

    International Nuclear Information System (INIS)

    Washington TRU Solutions LLC

    2003-01-01

    This procedure provides operating instructions for the RH-TRU 72-B Road Cask, Waste Shipping Package. In this document, ''Packaging'' refers to the assembly of components necessary to ensure compliance with the packaging requirements (not loaded with a payload). ''Package'' refers to a Type B packaging that, with its radioactive contents, is designed to retain the integrity of its containment and shielding when subject to the normal conditions of transport and hypothetical accident test conditions set forth in 10 CFR Part 71. Loading of the RH 72-B cask can be done two ways, on the RH cask trailer in the vertical position or by removing the cask from the trailer and loading it in a facility designed for remote-handling (RH). Before loading the 72-B cask, loading procedures and changes to the loading procedures for the 72-B cask must be sent to CBFO at sitedocuments at wipp.ws for approval

  7. Advanced flip chip packaging

    CERN Document Server

    Lai, Yi-Shao; Wong, CP

    2013-01-01

    Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable. This book also: Offers broad-ranging chapters with a focus on IC-package-system integration Provides viewpoints from leading industry executives and experts Details state-of-the-art achievements in process technologies and scientific research Presents a clear development history and touches on trends in the industry while also discussing up-to-date technology information Advanced Flip Chip Packaging is an ideal book for engineers, researchers, and graduate students interested in the field of flip chip packaging.

  8. Process waste assessment: Petroleum jelly removal from semiconductor die using trichloroethylene

    International Nuclear Information System (INIS)

    Curtin, D.P.

    1993-05-01

    The process analyzed involves non-production, laboratory environment use of trichloroethylene for the cleaning of semiconductor devices. The option selection centered on the replacement of the trichloroethylene with a non-hazardous material. This process waste assessment was performed as part of a pilot project

  9. Semiconductor electrochemistry of coal pyrite. Final technical report, September 1990--September 1995

    Energy Technology Data Exchange (ETDEWEB)

    Osseo-Asare, K.; Wei, D.

    1996-01-01

    This project is concerned with the physiochemical processes occuring at the pyrite/aqueous interface, in the context of coal cleaning, desulfurization, and acid mine drainage. The use of synthetic particles of pyrite as model electrodes to investigate the semiconductor electrochemistry of pyrite is employed.

  10. Bubble size distribution analysis and control in high frequency ultrasonic cleaning processes

    International Nuclear Information System (INIS)

    Hauptmann, M; Struyf, H; Mertens, P; Heyns, M; Gendt, S De; Brems, S; Glorieux, C

    2012-01-01

    In the semiconductor industry, the ongoing down-scaling of nanoelectronic elements has lead to an increasing complexity of their fabrication. Hence, the individual fabrication processes become increasingly difficult to handle. To minimize cross-contamination, intermediate surface cleaning and preparation steps are inevitable parts of the semiconductor process chain. Here, one major challenge is the removal of residual nano-particulate contamination resulting from abrasive processes such as polishing and etching. In the past, physical cleaning techniques such as megasonic cleaning have been proposed as suitable solutions. However, the soaring fragility of the smallest structures is constraining the forces of the involved physical removal mechanisms. In the case of 'megasonic' cleaningcleaning with ultrasound in the MHz-domain – the main cleaning action arises from strongly oscillating microbubbles which emerge from the periodically changing tensile strain in the cleaning liquid during sonication. These bubbles grow, oscillate and collapse due to a complex interplay of rectified diffusion, bubble coalescence, non-linear pulsation and the onset of shape instabilities. Hence, the resulting bubble size distribution does not remain static but alternates continuously. Only microbubbles in this distribution that show a high oscillatory response are responsible for the cleaning action. Therefore, the cleaning process efficiency can be improved by keeping the majority of bubbles around their resonance size. In this paper, we propose a method to control and characterize the bubble size distribution by means of 'pulsed' sonication and measurements of acoustic cavitation spectra, respectively. We show that the so-obtained bubble size distributions can be related to theoretical predictions of the oscillatory responses of and the onset of shape instabilities for the respective bubbles. We also propose a mechanism to explain the enhancement of both acoustic and cleaning

  11. Packaging Printing Today

    Directory of Open Access Journals (Sweden)

    Stanislav Bolanča

    2015-12-01

    Full Text Available Printing packaging covers today about 50% of all the printing products. Among the printing products there are printing on labels, printing on flexible packaging, printing on folding boxes, printing on the boxes of corrugated board, printing on glass packaging, synthetic and metal ones. The mentioned packaging are printed in flexo printing technique, offset printing technique, intaglio halftone process, silk – screen printing, ink ball printing, digital printing and hybrid printing process. The possibilities of particular printing techniques for optimal production of the determined packaging were studied in the paper. The problem was viewed from the technological and economical aspect. The possible printing quality and the time necessary for the printing realization were taken as key parameters. An important segment of the production and the way of life is alocation value and it had also found its place in this paper. The events in the field of packaging printing in the whole world were analyzed. The trends of technique developments and the printing technology for packaging printing in near future were also discussed.

  12. Clean electricity from photovoltaics

    CERN Document Server

    Green, Martin A

    2015-01-01

    The second edition of Clean Electricity from Photovoltaics , first published in 2001, provides an updated account of the underlying science, technology and market prospects for photovoltaics. All areas have advanced considerably in the decade since the first edition was published, which include: multi-crystalline silicon cell efficiencies having made impressive advances, thin-film CdTe cells having established a decisive market presence, and organic photovoltaics holding out the prospect of economical large-scale power production. Contents: The Past and Present (M D Archer); Limits to Photovol

  13. Electrodes for Semiconductor Gas Sensors

    Science.gov (United States)

    Lee, Sung Pil

    2017-01-01

    The electrodes of semiconductor gas sensors are important in characterizing sensors based on their sensitivity, selectivity, reversibility, response time, and long-term stability. The types and materials of electrodes used for semiconductor gas sensors are analyzed. In addition, the effect of interfacial zones and surface states of electrode–semiconductor interfaces on their characteristics is studied. This study describes that the gas interaction mechanism of the electrode–semiconductor interfaces should take into account the interfacial zone, surface states, image force, and tunneling effect. PMID:28346349

  14. Consumer response to packaging design

    NARCIS (Netherlands)

    Steenis, Nigel D.; Herpen, van Erica; Lans, van der Ivo A.; Ligthart, Tom N.; Trijp, van Hans C.M.

    2017-01-01

    Building on theories of cue utilization, this paper investigates whether and how packaging sustainability influences consumer perceptions, inferences and attitudes towards packaged products. A framework is tested in an empirical study among 249 students using soup products varying in packaging

  15. Packaging Concerns/Techniques for Large Devices

    Science.gov (United States)

    Sampson, Michael J.

    2009-01-01

    This slide presentation reviews packaging challenges and options for electronic parts. The presentation includes information about non-hermetic packages, space challenges for packaging and complex package variations.

  16. Hermeticity of electronic packages

    CERN Document Server

    Greenhouse, Hal; Romenesco, Bruce

    2011-01-01

    This is a book about the integrity of sealed packages to resist foreign gases and liquids penetrating the seal or an opening (crack) in the packageùespecially critical to the reliability and longevity of electronics. The author explains how to predict the reliability and the longevity of the packages based on leak rate measurements and the assumptions of impurities. Non-specialists in particular will benefit from the author's long involvement in the technology. Hermeticity is a subject that demands practical experience, and solving one problem does not necessarily give one the background to so

  17. Hermeticity of electronic packages

    CERN Document Server

    Greenhouse, Hal

    2000-01-01

    This is a book about the integrity of sealed packages to resist foreign gases and liquids penetrating the seal or an opening (crack) in the package-especially critical to the reliability and longevity of electronics. The author explains how to predict the reliability and the longevity of the packages based on leak rate measurements and the assumptions of impurities. Non-specialists in particular will benefit from the author's long involvement in the technology. Hermeticity is a subject that demands practical experience, and solving one problem does not necessarily give one the background to so

  18. Development of semiconductor electronics

    International Nuclear Information System (INIS)

    Bardeen, John.

    1977-01-01

    In 1931, Wilson applied Block's theory about the energy bands for the motion of electrons in a crystal lattice to semiconductors and showed that conduction can take place in two different ways, by electrons and by holes. Not long afterwards Frenkel showed that these carriers can flow by diffusion in a concentration gradient as well as under the influence of an electric field and wrote down equations for the current flow. The third major contribution, in the late 1930's was the explanation of rectification at a metalsemiconductor contact by Mott and more completely by Schottky. In late 1947 the first transistor of the point contact type was invented by Brattin, Shockley and Bardeen. Then after single crystals of Ge were grown, the junction transistor was developed by the same group. The first silicon transistors appeared in 1954. Then an important step was discovery of the planar transistor by Hoenri in 1960 which led to development of integrated circuits by 1962. Many transistors are produced by batch processing on a slice of silicon. Then in 1965 Mos (Metal-Oxide Semiconductor) transistor and in 1968 LSI (Large Scale Intergration circuits) were developed. Aside from electronic circuits, there are many other applications of semiconductors, including junction power rectifiers, junction luminescence (including lasers), solar batteries, radiation detectors, microwave oscillators and charged-coupled devices for computer memories and devices. One of the latest developments is a microprocessor with thousands of transistors and associated circuitry on a single small chip of silicon. It can be programmed to provide a variety of circuit functions, thus it is not necessary to go through the great expense of LSI's for each desired function, but to use standard microprocessors and program to do the job

  19. Layered semiconductor neutron detectors

    Science.gov (United States)

    Mao, Samuel S; Perry, Dale L

    2013-12-10

    Room temperature operating solid state hand held neutron detectors integrate one or more relatively thin layers of a high neutron interaction cross-section element or materials with semiconductor detectors. The high neutron interaction cross-section element (e.g., Gd, B or Li) or materials comprising at least one high neutron interaction cross-section element can be in the form of unstructured layers or micro- or nano-structured arrays. Such architecture provides high efficiency neutron detector devices by capturing substantially more carriers produced from high energy .alpha.-particles or .gamma.-photons generated by neutron interaction.

  20. Basic properties of semiconductors

    CERN Document Server

    Landsberg, PT

    2013-01-01

    Since Volume 1 was published in 1982, the centres of interest in the basic physics of semiconductors have shifted. Volume 1 was called Band Theory and Transport Properties in the first edition, but the subject has broadened to such an extent that Basic Properties is now a more suitable title. Seven chapters have been rewritten by the original authors. However, twelve chapters are essentially new, with the bulk of this work being devoted to important current topics which give this volume an almost encyclopaedic form. The first three chapters discuss various aspects of modern band theory and the

  1. Electrowetting on semiconductors

    Science.gov (United States)

    Palma, Cesar; Deegan, Robert

    2015-01-01

    Applying a voltage difference between a conductor and a sessile droplet sitting on a thin dielectric film separating it from the conductor will cause the drop to spread. When the conductor is a good metal, the change of the drop's contact angle due to the voltage is given by the Young-Lippmann (YL) equation. Here, we report experiments with lightly doped, single crystal silicon as the conductive electrode. We derive a modified YL equation that includes effects due to the semiconductor and contact line pinning. We show that light induces a non-reversible wetting transition, and that our model agrees well with our experimental results.

  2. Semiconductor ionizino. radiation detectors

    International Nuclear Information System (INIS)

    1982-01-01

    Spectrometric semiconductor detectors of ionizing radiation with the electron-hole junction, based on silicon and germanium are presented. The following parameters are given for the individual types of germanium detectors: energy range of detected radiation, energy resolution given as full width at half maximum (FWHM) and full width at one tenth of maximum (FWTM) for 57 Co and 60 Co, detection sensitivity, optimal voltage, and electric capacitance at optimal voltage. For silicon detectors the value of FWHM for 239 Pu is given, the sensitive area and the depth of the sensitive area. (E.S.)

  3. Band structure of semiconductors

    CERN Document Server

    Tsidilkovski, I M

    2013-01-01

    Band Structure of Semiconductors provides a review of the theoretical and experimental methods of investigating band structure and an analysis of the results of the developments in this field. The book presents the problems, methods, and applications in the study of band structure. Topics on the computational methods of band structure; band structures of important semiconducting materials; behavior of an electron in a perturbed periodic field; effective masses and g-factors for the most commonly encountered band structures; and the treatment of cyclotron resonance, Shubnikov-de Haas oscillatio

  4. Active and intelligent packaging: The indication of quality and safety.

    Science.gov (United States)

    Janjarasskul, Theeranun; Suppakul, Panuwat

    2018-03-24

    The food industry has been under growing pressure to feed an exponentially increasing world population and challenged to meet rigorous food safety law and regulation. The plethora of media consumption has provoked consumer demand for safe, sustainable, organic, and wholesome products with "clean" labels. The application of active and intelligent packaging has been commercially adopted by food and pharmaceutical industries as a solution for the future for extending shelf life and simplifying production processes; facilitating complex distribution logistics; reducing, if not eliminating the need for preservatives in food formulations; enabling restricted food packaging applications; providing convenience, improving quality, variety and marketing features; as well as providing essential information to ensure consumer safety. This chapter reviews innovations of active and intelligent packaging which advance packaging technology through both scavenging and releasing systems for shelf life extension, and through diagnostic and identification systems for communicating quality, tracking and brand protection.

  5. Self-cleaning and surface chemical reactions during hafnium dioxide atomic layer deposition on indium arsenide.

    Science.gov (United States)

    Timm, Rainer; Head, Ashley R; Yngman, Sofie; Knutsson, Johan V; Hjort, Martin; McKibbin, Sarah R; Troian, Andrea; Persson, Olof; Urpelainen, Samuli; Knudsen, Jan; Schnadt, Joachim; Mikkelsen, Anders

    2018-04-12

    Atomic layer deposition (ALD) enables the ultrathin high-quality oxide layers that are central to all modern metal-oxide-semiconductor circuits. Crucial to achieving superior device performance are the chemical reactions during the first deposition cycle, which could ultimately result in atomic-scale perfection of the semiconductor-oxide interface. Here, we directly observe the chemical reactions at the surface during the first cycle of hafnium dioxide deposition on indium arsenide under realistic synthesis conditions using photoelectron spectroscopy. We find that the widely used ligand exchange model of the ALD process for the removal of native oxide on the semiconductor and the simultaneous formation of the first hafnium dioxide layer must be significantly revised. Our study provides substantial evidence that the efficiency of the self-cleaning process and the quality of the resulting semiconductor-oxide interface can be controlled by the molecular adsorption process of the ALD precursors, rather than the subsequent oxide formation.

  6. Safety Analysis Report - Packages, 9965, 9968, 9972-9975 Packages

    International Nuclear Information System (INIS)

    Blanton, P.

    2000-01-01

    This Safety Analysis Report for Packaging (SARP) documents the analysis and testing performed on four type B Packages: the 9972, 9973, 9974, and 9975 packages. Because all four packages have similar designs with very similar performance characteristics, all of them are presented in a single SARP. The performance evaluation presented in this SARP documents the compliance of the 9975 package with the regulatory safety requirements. Evaluations of the 9972, 9973, and 9974 packages support that of the 9975. To avoid confusion arising from the inclusion of four packages in a single document, the text segregates the data for each package in such a way that the reader interested in only one package can progress from Chapter 1 through Chapter 9. The directory at the beginning of each chapter identifies each section that should be read for a given package. Sections marked ''all'' are generic to all packages

  7. International Clean Energy Coalition

    Energy Technology Data Exchange (ETDEWEB)

    Erin Skootsky; Matt Gardner; Bevan Flansburgh

    2010-09-28

    In 2003, the National Association of Regulatory Utility Commissioners (NARUC) and National Energy Technology Laboratories (NETL) collaboratively established the International Clean Energy Coalition (ICEC). The coalition consisting of energy policy-makers, technologists, and financial institutions was designed to assist developing countries in forming and supporting local approaches to greenhouse gas mitigation within the energy sector. ICEC's work focused on capacity building and clean energy deployment in countries that rely heavily on fossil-based electric generation. Under ICEC, the coalition formed a steering committee consisting of NARUC members and held a series of meetings to develop and manage the workplan and define successful outcomes for the projects. ICEC identified India as a target country for their work and completed a country assessment that helped ICEC build a framework for discussion with Indian energy decisionmakers including two follow-on in-country workshops. As of the conclusion of the project in 2010, ICEC had also conducted outreach activities conducted during United Nations Framework Convention on Climate Change (UNFCCC) Ninth Conference of Parties (COP 9) and COP 10. The broad goal of this project was to develop a coalition of decision-makers, technologists, and financial institutions to assist developing countries in implementing affordable, effective and resource appropriate technology and policy strategies to mitigate greenhouse gas emissions. Project goals were met through international forums, a country assessment, and in-country workshops. This project focused on countries that rely heavily on fossil-based electric generation.

  8. Key techniques for space-based solar pumped semiconductor lasers

    Science.gov (United States)

    He, Yang; Xiong, Sheng-jun; Liu, Xiao-long; Han, Wei-hua

    2014-12-01

    In space, the absence of atmospheric turbulence, absorption, dispersion and aerosol factors on laser transmission. Therefore, space-based laser has important values in satellite communication, satellite attitude controlling, space debris clearing, and long distance energy transmission, etc. On the other hand, solar energy is a kind of clean and renewable resources, the average intensity of solar irradiation on the earth is 1353W/m2, and it is even higher in space. Therefore, the space-based solar pumped lasers has attracted much research in recent years, most research focuses on solar pumped solid state lasers and solar pumped fiber lasers. The two lasing principle is based on stimulated emission of the rare earth ions such as Nd, Yb, Cr. The rare earth ions absorb light only in narrow bands. This leads to inefficient absorption of the broad-band solar spectrum, and increases the system heating load, which make the system solar to laser power conversion efficiency very low. As a solar pumped semiconductor lasers could absorb all photons with energy greater than the bandgap. Thus, solar pumped semiconductor lasers could have considerably higher efficiencies than other solar pumped lasers. Besides, solar pumped semiconductor lasers has smaller volume chip, simpler structure and better heat dissipation, it can be mounted on a small satellite platform, can compose satellite array, which can greatly improve the output power of the system, and have flexible character. This paper summarizes the research progress of space-based solar pumped semiconductor lasers, analyses of the key technologies based on several application areas, including the processing of semiconductor chip, the design of small and efficient solar condenser, and the cooling system of lasers, etc. We conclude that the solar pumped vertical cavity surface-emitting semiconductor lasers will have a wide application prospects in the space.

  9. London 2012 packaging guidelines

    OpenAIRE

    2013-01-01

    These guidelines are intended to provide supplemental advice to suppliers and licensees regarding the provisions of the LOCOG Sustainable Sourcing Code that relate to packaging design and materials selection.

  10. Type B Drum packages

    International Nuclear Information System (INIS)

    Edwards, W.S.

    1995-11-01

    The Type B Drum package is a container in which a single drum containing Type B quantities of radioactive material will be packaged for shipment. The Type B Drum containers are being developed to fill a void in the packaging and transportation capabilities of the US Department of Energy (DOE), as no double containment packaging for single drums of Type B radioactive material is currently available. Several multiple-drum containers and shielded casks presently exist. However, the size and weight of these containers present multiple operational challenges for single-drum shipments. The Type B Drum containers will offer one unshielded version and, if needed, two shielded versions, and will provide for the option of either single or double containment. The primary users of the Type B Drum container will be any organization with a need to ship single drums of Type B radioactive material. Those users include laboratories, waste retrieval facilities, emergency response teams, and small facilities

  11. Materials for advanced packaging

    CERN Document Server

    Wong, CP

    2017-01-01

    This second edition continues to be the most comprehensive review on the developments in advanced electronic packaging technologies, with a focus on materials and processing. Recognized experts in the field contribute to 22 updated and new chapters that provide comprehensive coverage on various 3D package architectures, novel bonding and joining techniques, wire bonding, wafer thinning techniques, organic substrates, and novel approaches to make electrical interconnects between integrated circuit and substrates. Various chapters also address advances in several key packaging materials, including: Lead-free solders Flip chip underfills Epoxy molding compounds Conductive adhesives Die attach adhesives/films Thermal interface materials (TIMS) Materials for fabricating embedded passives including capacitors, inductors, and resistors Materials and processing aspects on wafer-level chip scale package (CSP) and MicroElectroMechanical system (MEMS) Contributors also review new and emerging technologies such as Light ...

  12. Food irradiation and packaging

    International Nuclear Information System (INIS)

    Kilcast, David

    1988-01-01

    This outline review was written for 'Food Manufacture'. It deals with the known effects of irradiation on current packaging materials (glass, cellulosics, organic polymers and metals), and their implications for the effective application of the process. (U.K.)

  13. FLEXIBLE FOOD PACKAGING LABORATORY

    Data.gov (United States)

    Federal Laboratory Consortium — This laboratory contains equipment to fabricate and test prototype packages of many types and sizes (e.g., bags, pouches, trays, cartons, etc.). This equipment can...

  14. BCRA R Package

    Science.gov (United States)

    BCRA is an R package that projects absolute risk of invasive breast cancer according to NCI’s Breast Cancer Risk Assessment Tool (BCRAT) algorithm for specified race/ethnic groups and age intervals.

  15. The ENSDF Java Package

    International Nuclear Information System (INIS)

    Sonzogni, A.A.

    2005-01-01

    A package of computer codes has been developed to process and display nuclear structure and decay data stored in the ENSDF (Evaluated Nuclear Structure Data File) library. The codes were written in an object-oriented fashion using the java language. This allows for an easy implementation across multiple platforms as well as deployment on web pages. The structure of the different java classes that make up the package is discussed as well as several different implementations

  16. Energy and packaging

    Energy Technology Data Exchange (ETDEWEB)

    Boustead, I; Hancock, G F

    1981-01-01

    Information is given on the energy and raw materials required in the production and use of containers used to package beer, cider, and carbonated soft drinks in the United Kingdom. Topics covered include: methodology of energy analysis, primary and secondary fuels, transport, packaging materials, including glass, aluminum, iron, steel, and tinplate, container production, including plastic bottles, distribution of empty containers, filling and packing, distribution, and disposal. (LEW)

  17. CH Packaging Program Guidance

    International Nuclear Information System (INIS)

    Washington TRU Solutions LLC

    2003-01-01

    The purpose of this document is to provide the technical requirements for preparation for use, operation, inspection, and maintenance of a Transuranic Package Transporter Model II (TRUPACT-II), a HalfPACT shipping package, and directly related components. This document complies with the minimum requirements as specified in the TRUPACT-II Safety Analysis Report for Packaging (SARP), HalfPACT SARP, and Nuclear Regulatory Commission (NRC) Certificates of Compliance (C of C) 9218 and 9279, respectively. In the event of a conflict between this document and the SARP or C of C, the C of C shall govern. The C of Cs state: ''each package must be prepared for shipment and operated in accordance with the procedures described in Chapter 7.0, Operating Procedures, of the application.'' They further state: ''each package must be tested and maintained in accordance with the procedures described in Chapter 8.0, Acceptance Tests and Maintenance Program of the Application.'' Chapter 9.0 of the SARP charges the WIPP management and operating (M and O) contractor with assuring packaging is used in accordance with the requirements of the C of C. Because the packaging is NRC-approved, users need to be familiar with 10 CFR 71.11. Any time a user suspects or has indications that the conditions of approval in the C of C were not met, the Carlsbad Field Office (CBFO) shall be notified immediately. CBFO will evaluate the issue and notify the NRC if required. This document provides the instructions to be followed to operate, maintain, and test the TRUPACT-II and HalfPACT packaging. The intent of these instructions is to standardize operations. All users will follow these instructions or equivalent instructions that assure operations are safe and meet the requirements of the SARPs

  18. CH Packaging Program Guidance

    International Nuclear Information System (INIS)

    Washington TRU Solutions LLC

    2002-01-01

    The purpose of this document is to provide the technical requirements for preparation for use, operation, inspection, and maintenance of a Transuranic Package Transporter Model II (TRUPACT-II), a HalfPACT Shipping Package, and directly related components. This document complies with the minimum requirements as specified in TRUPACT-II Safety Analysis Report for Packaging (SARP), HalfPACT SARP, and Nuclear Regulatory Commission (NRC) Certificates of Compliance (C of C) 9218 and 9279, respectively. In the event there is a conflict between this document and the SARP or C of C, the SARP and/or C of C shall govern. C of Cs state: ''each package must be prepared for shipment and operated in accordance with the procedures described in Chapter 7.0, Operating Procedures, of the application.'' They further state: ''each package must be tested and maintained in accordance with the procedures described in Chapter 8.0, Acceptance Tests and Maintenance Program of the Application.'' Chapter 9.0 of the SAR P charges the WIPP Management and Operation (M and O) contractor with assuring packaging is used in accordance with the requirements of the C of C. Because the packaging is NRC-approved, users need to be familiar with 10 CFR 71.11. Any time a user suspects or has indications that the conditions of approval in the C of C were not met, the Carlsbad Field Office (CBFO) shall be notified immediately. CBFO will evaluate the issue and notify the NRC if required. This document details the instructions to be followed to operate, maintain, and test the TRUPACT-II and HalfPACT packaging. The intent of these instructions is to standardize these operations. All users will follow these instructions or equivalent instructions that assure operations are safe and meet the requirements of the SARPs

  19. Single filament semiconductor laser

    International Nuclear Information System (INIS)

    Botez, D.

    1980-01-01

    A semiconductor laser comprising: a body of semiconductor material including a substrate having a surface and a pair of spaced, substantially parallel dove-tailed shaped grooves in said surface, said body having a pair of end surfaces between which said grooves extend, said end surfaces being reflective to light with at least one of said end surfaces being partially transparent to light a first epitaxial layer over said surface of the substrate and the surfaces of the grooves, said first epitaxial layer having a flat surface portion over the portion of the substrate surface between the grooves, a thin second epitaxial layer over said first epitaxial layer, a third epitaxial layer over said second epitaxial layer, said first and third epitaxial layers being of opposite conductivity types and the second epitaxial layer being the active recombination region of the laser with the light being generated therein in the vicinity of the portion which is over the flat surface portion of the first epitaxial layer, and a pair of contacts on said body with one contact being over said third epitaxial body and the other being on said substrate

  20. Study of ultra-clean surfaces for accelerator structures

    International Nuclear Information System (INIS)

    Saito, K.; Noguchi, S.; Kako, E.

    1994-01-01

    For a TeV energy physics R and D on electron/positron linear colliders has been conducted hard at many laboratories from technologies of both normal conducting and superconducting. The high field gradient issue is a key to realize such a machine. Field emission limits seriously field gradient of rf cavities. Its cure is to eliminate particle contamination on cavity surfaces. It is a common issue in both normal conducting and superconducting cavities. We have started to study ultra-clean surfaces of niobium and copper applying semiconductor technologies. In this paper several results by various rinsing methods are presented and its relation with cavity performance is discussed. (author)

  1. Comparative Packaging Study

    Science.gov (United States)

    Perchonok, Michele H.; Oziomek, Thomas V.

    2009-01-01

    Future long duration manned space flights beyond low earth orbit will require the food system to remain safe, acceptable and nutritious. Development of high barrier food packaging will enable this requirement by preventing the ingress and egress of gases and moisture. New high barrier food packaging materials have been identified through a trade study. Practical application of this packaging material within a shelf life test will allow for better determination of whether this material will allow the food system to meet given requirements after the package has undergone processing. The reason to conduct shelf life testing, using a variety of packaging materials, stems from the need to preserve food used for mission durations of several years. Chemical reactions that take place during longer durations may decrease food quality to a point where crew physical or psychological well-being is compromised. This can result in a reduction or loss of mission success. The rate of chemical reactions, including oxidative rancidity and staling, can be controlled by limiting the reactants, reducing the amount of energy available to drive the reaction, and minimizing the amount of water available. Water not only acts as a media for microbial growth, but also as a reactant and means by which two reactants may come into contact with each other. The objective of this study is to evaluate three packaging materials for potential use in long duration space exploration missions.

  2. Ceramic thermal wind sensor based on advanced direct chip attaching package

    International Nuclear Information System (INIS)

    Zhou Lin; Qin Ming; Chen Shengqi; Chen Bei

    2014-01-01

    An advanced direct chip attaching packaged two-dimensional ceramic thermal wind sensor is studied. The thermal wind sensor chip is fabricated by metal lift-off processes on the ceramic substrate. An advanced direct chip attaching (DCA) packaging is adopted and this new packaged method simplifies the processes of packaging further. Simulations of the advanced DCA packaged sensor based on computational fluid dynamics (CFD) model show the sensor can detect wind speed and direction effectively. The wind tunnel testing results show the advanced DCA packaged sensor can detect the wind direction from 0° to 360° and wind speed from 0 to 20 m/s with the error less than 0.5 m/s. The nonlinear fitting based least square method in Matlab is used to analyze the performance of the sensor. (semiconductor devices)

  3. II-VI semiconductor compounds

    CERN Document Server

    1993-01-01

    For condensed matter physicists and electronic engineers, this volume deals with aspects of II-VI semiconductor compounds. Areas covered include devices and applications of II-VI compounds; Co-based II-IV semi-magnetic semiconductors; and electronic structure of strained II-VI superlattices.

  4. Electronic structure of semiconductor interfaces

    Energy Technology Data Exchange (ETDEWEB)

    Herman, F

    1983-02-01

    The study of semiconductor interfaces is one of the most active and exciting areas of current semiconductor research. Because interfaces play a vital role in modern semiconductor technology (integrated circuits, heterojunction lasers, solar cells, infrared detectors, etc.), there is a strong incentive to understand interface properties at a fundamental level and advance existing technology thereby. At the same time, technological advances such as molecular beam epitaxy have paved the way for the fabrication of semiconductor heterojunctions and superlattices of novel design which exhibit unusual electronic, optical, and magnetic properties and offer unique opportunities for fundamental scientific research. A general perspective on this subject is offered treating such topics as the atomic and electronic structure of semiconductor surfaces and interfaces; oxidation and oxide layers; semiconductor heterojunctions and superlattices; rectifying metal-semiconductor contacts; and interface reactions. Recent progress is emphasized and some future directions are indicated. In addition, the role that large-scale scientific computation has played in furthering our theoretical understanding of semiconductor surfaces and interfaces is discussed. Finally, the nature of theoretical models, and the role they play in describing the physical world is considered.

  5. Quantum transport in semiconductor nanowires

    NARCIS (Netherlands)

    Van Dam, J.

    2006-01-01

    This thesis describes a series of experiments aimed at understanding the low-temperature electrical transport properties of semiconductor nanowires. The semiconductor nanowires (1-100 nm in diameter) are grown from nanoscale gold particles via a chemical process called vapor-liquid-solid (VLS)

  6. Semiconductor photocatalysis principles and applications

    CERN Document Server

    Kisch, Horst

    2014-01-01

    Focusing on the basic principles of semiconductor photocatalysis, this book also gives a brief introduction to photochemistry, photoelectrochemistry, and homogeneous photocatalysis. In addition, the author - one of the leading authorities in the field - presents important environmental and practical aspects. A valuable, one-stop source for all chemists, material scientists, and physicists working in this area, as well as novice researchers entering semiconductor photocatalysis.

  7. Progress in semiconductor drift detectors

    International Nuclear Information System (INIS)

    Rehak, P.; Walton, J.; Gatti, E.

    1985-01-01

    Progress in testing semiconductor drift detectors is reported. Generally better position and energy resolutions were obtained than resolutions published previously. The improvement is mostly due to new electronics better matched to different detectors. It is shown that semiconductor drift detectors are becoming versatile and reliable detectors for position and energy measurements

  8. Semiconductor materials and their properties

    NARCIS (Netherlands)

    Reinders, Angelina H.M.E.; Verlinden, Pierre; van Sark, Wilfried; Freundlich, Alexandre; Reinders, Angele; Verlinden, Pierre; van Sark, Wilfried; Freundlich, Alexandre

    2017-01-01

    Semiconductor materials are the basic materials which are used in photovoltaic (PV) devices. This chapter introduces solid-state physics and semiconductor properties that are relevant to photovoltaics without spending too much time on unnecessary information. Usually atoms in the group of

  9. Optical coherent control in semiconductors

    DEFF Research Database (Denmark)

    Østergaard, John Erland; Vadim, Lyssenko; Hvam, Jørn Märcher

    2001-01-01

    of quantum control including the recent applications to semiconductors and nanostructures. We study the influence of inhomogeneous broadening in semiconductors on CC results. Photoluminescence (PL) and the coherent emission in four-wave mixing (FWM) is recorded after resonant excitation with phase...

  10. Terahertz Nonlinear Optics in Semiconductors

    DEFF Research Database (Denmark)

    Turchinovich, Dmitry; Hvam, Jørn Märcher; Hoffmann, Matthias C.

    2013-01-01

    We demonstrate the nonlinear optical effects – selfphase modulation and saturable absorption of a single-cycle THz pulse in a semiconductor. Resulting from THz-induced modulation of Drude plasma, these nonlinear optical effects, in particular, lead to self-shortening and nonlinear spectral...... breathing of a single-cycle THz pulse in a semiconductor....

  11. Electronic structure of semiconductor interfaces

    International Nuclear Information System (INIS)

    Herman, F.

    1983-01-01

    The study of semiconductor interfaces is one of the most active and exciting areas of current semiconductor research. Because interfaces play a vital role in modern semiconductor technology (integrated circuits, heterojunction lasers, solar cells, infrared detectors, etc.), there is a strong incentive to understand interface properties at a fundamental level and advance existing technology thereby. At the same time, technological advances such as molecular beam epitaxy have paved the way for the fabrication of semiconductor heterojunctions and superlattices of novel design which exhibit unusual electronic, optical, and magnetic properties and offer unique opportunities for fundamental scientific research. A general perspective on this subject is offered treating such topics as the atomic and electronic structure of semiconductor surfaces and interfaces; oxidation and oxide layers; semiconductor heterojunctions and superlattices; rectifying metal-semiconductor contacts; and interface reactions. Recent progress is emphasized and some future directions are indicated. In addition, the role that large-scale scientific computation has played in furthering our theoretical understanding of semiconductor surfaces and interfaces is discussed. Finally, the nature of theoretical models, and the role they play in describing the physical world is considered. (Author) [pt

  12. Cleaning of boreholes

    International Nuclear Information System (INIS)

    Rautio, T.; Alaverronen, M.; Lohva, K.; Teivaala, V.

    2004-09-01

    In terms of long-term safety it is a risk that the boreholes can eventually function as short-circuits between the repository and ground surface. Therefore sealing of investigation boreholes is an important issue for the long- term safety of high-level nuclear waste repositories. In order to seal a borehole properly, the conditions of the borehole have to meet certain predetermined requirements. One of the requirements is that no instruments or materials endangering the plugging operation or the long-term function of the sealing materials, are allowed to be left in the borehole. Sometimes drilling equipment will be left in the hole or it cannot be recovered from the hole with the given constraints of time, cost and resources in spite of attempts. Additionally various measurements may be carried out in the holes after the drilling has been completed and measuring devices may get stuck in holes. Consequently cleaning of the borehole is carried out as an essential activity before sealing can be implemented. There are two common reasons identified for the drill strings to get stuck in holes. First the drill string may get stuck due to acute drilling problems. The second case is where rods are left as casing in a hole either based on the structure of the upper part of the hole or in order to support the hole. To remove the drilling or measuring equipment lost in a borehole, special techniques and professional skill must be applied. Removing measuring equipment from a hole is often demanding and time consuming work. A vital part of the cleaning operation is planning the work in advance. In order to make the plan and to select the suitable methods it is important to know the condition of the stuck material. It is also important to know the exact depth where the equipment are stuck and to have an estimate of the reasons why they have got stuck. It is also very important to know the correct dimensions of the equipment or drill string before commencing the cleaning work

  13. Organic semiconductors in a spin

    CERN Document Server

    Samuel, I

    2002-01-01

    A little palladium can go a long way in polymer-based light-emitting diodes. Inorganic semiconductors such as silicon and gallium arsenide are essential for countless applications in everyday life, ranging from PCs to CD players. However, while they offer unrivalled computational speed, inorganic semiconductors are also rigid and brittle, which means that they are less suited to applications such as displays and flexible electronics. A completely different class of materials - organic semiconductors - are being developed for these applications. Organic semiconductors have many attractive features: they are easy to make, they can emit visible light, and there is tremendous scope for tailoring their properties to specific applications by changing their chemical structure. Research groups and companies around the world have developed a wide range of organic-semiconductor devices, including transistors, light-emitting diodes (LEDs), solar cells and lasers. (U.K.)

  14. Cleaning the soil

    International Nuclear Information System (INIS)

    Stegmann, R.

    1993-01-01

    Volume 6 of the Hamburg Reports contains contributions from scientists from the Special Research Field 188 'Cleaning up Contaminated Soils' of the Technical University of Hamburg-Harburg and the University of Hamburg and of experts from science and from the practical field. The soil science and analytical aspects of the biological and chemical/physical treatment processes are shown and open questions specific to processes are dealt with. Scientific results are compared with practical experience here. The evaluation of treated soils for reuse in the environment is a very important question, which is explained in the first articles here. Examples of case studies are shown in the last part of the volume. (orig.) [de

  15. Flue gas cleaning chemistry

    Energy Technology Data Exchange (ETDEWEB)

    Gutberlet, H [VEBA Kraftwerke Ruhr AG, Gelsenkirchen (Germany)

    1996-12-01

    The introduction of modern flue gas cleaning technology into fossil-fueled power stations has repeatedly confronted the power station chemists with new and interesting problems over the last 15 - 20 years. Both flue gas desulphurization by lime washing and catalytic removal of nitrogen oxides are based on simple basic chemical reactions. Owing to the use of readily available starting materials, the production of safe, useful end products and, last but not least, the possibility of implementing all this on an industrial scale by means of efficient process engineering, limestone desulphurization and catalytic removal of nitrogen oxides dominate the world market and, little by little, are becoming still more widespread. The origin and thus the quality of fuels and starting materials, the firing method, the mode of operation and engineering peculiarities in each plant interact in a complex manner. Simple cause/effect relationships are frequently incapable of explaining phenomena; thinking in complex interrelationships is needed. (EG)

  16. Ultrasound cleaning of microfilters

    DEFF Research Database (Denmark)

    Hald, Jens; Bjørnø, Irina; Jensen, Leif Bjørnø

    1999-01-01

    The aim of the present work is to develop, design, and manufacture a high-power ultrasound transducer module to be used for preventing the blocking of plastic-based microfilters by organic materials, and possibly to prolong the lifetime of the filters in industry using the cavitation on the surface...... suitable for cleaning of microfilters without damaging the filter structure. The filter surface was studied using an optical microscope before and after the experiment. When high-power ultrasound (max. 75 W/cm2) was applied to the surface of some microfilters, no visible damage was found, while others...... of the filter. A numerical, FE- and BE-based model for calculation of the response of ultrasonic transducers of various geometries formed the basis for the design of such transducers. During laboratory experiments frequency and output power have been varied in order to find the optimal transducer design...

  17. CleanFleet. Final report: Executive summary

    Energy Technology Data Exchange (ETDEWEB)

    NONE

    1995-12-01

    CleanFleet, formally known as the South Coast Alternative Fuels Demonstration, was a comprehensive demonstration of alternative fuel vehicles (AFVs) in daily commercial service. Between April 1992 and September 1994, five alternative fuels were tested in 84 panel vans: compressed natural gas (CNG), propane gas, methanol as M-85, California Phase 2 reformulated gasoline (RFG), and electricity. The AFVs were used in normal FedEx package delivery service in the Los Angeles basin alongside 27 {open_quotes}control{close_quotes} vans operating on regular gasoline. The liquid and gaseous fuel vans were model year 1992 vans from Ford, Chevrolet, and Dodge. The two electric vehicles (EVs) were on loan to FedEx from Southern California Edison. The AFVs represented a snapshot in time of 1992 technologies that (1) could be used reliably in daily FedEx operations and (2) were supported by the original equipment manufacturers (OEMs). A typical van is shown in Figure 2. The objective of the project was to demonstrate and document the operational, emissions, and economic status of alternative fuel, commercial fleet delivery vans in the early 1990s for meeting air quality regulations in the mid to late 1990s. During the two-year demonstration, CleanFleet`s 111 vehicles travelled more than three million miles and provided comprehensive data on three major topics: fleet operations, emissions, and fleet economics. Fleet operations were examined in detail to uncover and resolve problems with the use of the fuels and vehicles in daily delivery service. Exhaust and evaporative emissions were measured on a subset of vans as they accumulated mileage. The California Air Resources Board (ARB) measured emissions to document the environmental benefits of these AFVs. At the same time, CleanFleet experience was used to estimate the costs to a fleet operator using AFVs to achieve the environmental benefits of reduced emissions.

  18. CH Packaging Program Guidance

    International Nuclear Information System (INIS)

    2008-01-01

    The purpose of this document is to provide the technical requirements for preparation for use, operation, inspection, and maintenance of a Transuranic Package Transporter Model II (TRUPACT-II), a HalfPACT shipping package, and directly related components. This document complies with the minimum requirements as specified in the TRUPACT-II Safety Analysis Report for Packaging (SARP), HalfPACT SARP, and U.S. Nuclear Regulatory Commission (NRC) Certificates of Compliance (C of C) 9218 and 9279, respectively. In the event of a conflict between this document and the SARP or C of C, the C of C shall govern. The C of Cs state: 'each package must be prepared for shipment and operated in accordance with the procedures described in Chapter 7.0, Operating Procedures, of the pplication.' They further state: 'each package must be tested and maintained in accordance with the procedures described in Chapter 8.0, Acceptance Tests and Maintenance Program of the Application.' Chapter 9.0 of the SARP charges the U.S. Department of Energy (DOE) or the Waste Isolation Pilot Plant (WIPP) management and operating (M and O) contractor with assuring packaging is used in accordance with the requirements of the C of C. Because the packaging is NRC-approved, users need to be familiar with Title 10 Code of Federal Regulations (CFR) 71.8. Any time a user suspects or has indications that the conditions of approval in the C of C were not met, the Carlsbad Field Office (CBFO) shall be notified immediately. The CBFO will evaluate the issue and notify the NRC if required. In accordance with 10 CFR Part 71, certificate holders, packaging users, and contractors or subcontractors who use, design, fabricate, test, maintain, or modify the packaging shall post copies of (1) 10 CFR Part 21 regulations, (2) Section 206 of the Energy Reorganization Act of 1974, and (3) NRC Form 3, Notice to Employees. These documents must be posted in a conspicuous location where the activities subject to these regulations

  19. CH Packaging Program Guidance

    International Nuclear Information System (INIS)

    2009-01-01

    The purpose of this document is to provide the technical requirements for preparation for use, operation, inspection, and maintenance of a Transuranic Package Transporter Model II (TRUPACT-II), a HalfPACT shipping package, and directly related components. This document complies with the minimum requirements as specified in the TRUPACT-II Safety Analysis Report for Packaging (SARP), HalfPACT SARP, and U.S. Nuclear Regulatory Commission (NRC) Certificates of Compliance (C of C) 9218 and 9279, respectively. In the event of a conflict between this document and the SARP or C of C, the C of C shall govern. The C of Cs state: 'each package must be prepared for shipment and operated in accordance with the procedures described in Chapter 7.0, Operating Procedures, of the application.' They further state: 'each package must be tested and maintained in accordance with the procedures described in Chapter 8.0, Acceptance Tests and Maintenance Program of the Application.' Chapter 9.0 of the SARP charges the U.S. Department of Energy (DOE) or the Waste Isolation Pilot Plant (WIPP) management and operating (M and O) contractor with assuring packaging is used in accordance with the requirements of the C of C. Because the packaging is NRC-approved, users need to be familiar with Title 10 Code of Federal Regulations (CFR) 71.8. Any time a user suspects or has indications that the conditions of approval in the C of C were not met, the Carlsbad Field Office (CBFO) shall be notified immediately. The CBFO will evaluate the issue and notify the NRC if required. In accordance with 10 CFR Part 71, certificate holders, packaging users, and contractors or subcontractors who use, design, fabricate, test, maintain, or modify the packaging shall post copies of (1) 10 CFR Part 21 regulations, (2) Section 206 of the Energy Reorganization Act of 1974, and (3) NRC Form 3, Notice to Employees. These documents must be posted in a conspicuous location where the activities subject to these regulations

  20. RH Packaging Program Guidance

    International Nuclear Information System (INIS)

    2006-01-01

    The purpose of this program guidance document is to provide the technical requirements for use, operation, inspection, and maintenance of the RH-TRU 72-B Waste Shipping Package and directly related components. This document complies with the requirements as specified in the RH-TRU 72-B Safety Analysis Report for Packaging (SARP), and Nuclear Regulatory Commission (NRC) Certificate of Compliance (C of C) 9212. If there is a conflict between this document and the SARP and/or C of C, the C of C shall govern. The C of C states: 'each package must be prepared for shipment and operated in accordance with the procedures described in Chapter 7.0, Operating Procedures, of the application.' It further states: 'each package must be tested and maintained in accordance with the procedures described in Chapter 8.0, Acceptance Tests and Maintenance Program of the Application.' Chapter 9.0 of the SARP tasks the Waste Isolation Pilot Plant (WIPP) Management and Operating (M and O) Contractor with assuring the packaging is used in accordance with the requirements of the C of C. Because the packaging is NRC-approved, users need to be familiar with 10 Code of Federal Regulations (CFR) 1.8, 'Deliberate Misconduct.' Any time a user suspects or has indications that the conditions of approval in the C of C were not met, the U.S. Department of Energy (DOE) Carlsbad Field Office (CBFO) shall be notified immediately. CBFO will evaluate the issue and notify the NRC if required. In accordance with 10 CFR Part 71, 'Packaging and Transportation of Radioactive Material,' certificate holders, packaging users, and contractors or subcontractors who use, design, fabricate, test, maintain, or modify the packaging shall post copies of (1) 10 CFR Part 21, 'Reporting of Defects and Noncompliance,' regulations, (2) Section 206 of the Energy Reorganization Act of 1974, and (3) NRC Form 3, Notice to Employees. These documents must be posted in a conspicuous location where the activities subject to these

  1. RH Packaging Program Guidance

    International Nuclear Information System (INIS)

    2008-01-01

    The purpose of this program guidance document is to provide the technical requirements for use, operation, inspection, and maintenance of the RH-TRU 72-B Waste Shipping Package (also known as the 'RH-TRU 72-B cask') and directly related components. This document complies with the requirements as specified in the RH-TRU 72-B Safety Analysis Report for Packaging (SARP), and Nuclear Regulatory Commission (NRC) Certificate of Compliance (C of C) 9212. If there is a conflict between this document and the SARP and/or C of C, the C of C shall govern. The C of C states: 'each package must be prepared for shipment and operated in accordance with the procedures described in Chapter 7.0, Operating Procedures, of the application.' It further states: 'each package must be tested and maintained in accordance with the procedures described in Chapter 8.0, Acceptance Tests and Maintenance Program of the Application.' Chapter 9.0 of the SARP tasks the Waste Isolation Pilot Plant (WIPP) Management and Operating (M and O) Contractor with assuring the packaging is used in accordance with the requirements of the C of C. Because the packaging is NRC-approved, users need to be familiar with Title 10 Code of Federal Regulations (CFR) 71.8, 'Deliberate Misconduct.' Any time a user suspects or has indications that the conditions of approval in the C of C were not met, the U.S. Department of Energy (DOE) Carlsbad Field Office (CBFO) shall be notified immediately. The CBFO will evaluate the issue and notify the NRC if required.In accordance with 10 CFR Part 71, 'Packaging and Transportation of Radioactive Material,' certificate holders, packaging users, and contractors or subcontractors who use, design, fabricate, test, maintain, or modify the packaging shall post copies of (1) 10 CFR Part 21, 'Reporting of Defects and Noncompliance,' regulations, (2) Section 206 of the Energy Reorganization Act of 1974, and (3) NRC Form 3, Notice to Employees. These documents must be posted in a conspicuous

  2. Cleaning fluid emulsions

    Energy Technology Data Exchange (ETDEWEB)

    Prikryl, J; Kotyza, R; Krulikovsky, J; Mjartan, V; Valisova, I

    1981-09-15

    Composition of cleaning fluid emulsion are presented for drilling small diameter wells in clay soils, at high drill bit rotation velocity. The emulsions have lubricating properties and the abilty to improve stability of the drilled soil. The given fluids have a high fatty acid content with 12-24 carbon atoms in a single molecule, with a predominance of resinous acids 1-5% in mass, and having been emulsified in water or clay suspension without additives, or in a clay suspension with high-molecular polymer additives (glycobate cellulose compounds and/or polysaccharides, and/or their derivatives) in an amount of 0.1-3% per mass; thinning agents - huminite or lignite compounds in the amount of 0.01 to 0.5% in mass; weighting material - barite or lime 0.01 to 50% per mass; medium stabilizers - organic poly-electrolyte with polyacrylate in the amount of 0.05 to 2% in mass, or alkaline chloride/alkaline-ground metals 1-10% per mass. A cleaning emulsion fluid was prepared in the laboratory according to the given method. Add 3 kg tall oil to a solution of 1 kg K/sub 2/CO/sub 3/ per 100 l of water. Dynamic viscosity was equal to 1.4 x 10-/sup 3/ Pa/s. When drilling in compacted clay soils, when the emulsions require improved stability, it is necessary to add the maximum amount of tall oil whose molecules are absorbed by the clay soil and increase its durability.

  3. Ion implantation for semiconductors

    International Nuclear Information System (INIS)

    Grey-Morgan, T.

    1995-01-01

    Full text: Over the past two decades, thousands of particle accelerators have been used to implant foreign atoms like boron, phosphorus and arsenic into silicon crystal wafers to produce special embedded layers for manufacturing semiconductor devices. Depending on the device required, the atomic species, the depth of implant and doping levels are the main parameters for the implantation process; the selection and parameter control is totally automated. The depth of the implant, usually less than 1 micron, is determined by the ion energy, which can be varied between 2 and 600 keV. The ion beam is extracted from a Freeman or Bernas type ion source and accelerated to 60 keV before mass analysis. For higher beam energies postacceleration is applied up to 200 keV and even higher energies can be achieved by mass selecting multiplycharged ions, but with a corresponding reduction in beam output. Depending on the device to be manufactured, doping levels can range from 10 10 to 10 15 atoms/cm 2 and are controlled by implanter beam currents in the range up to 30mA; continuous process monitoring ensures uniformity across the wafer of better than 1 % . As semiconductor devices get smaller, additional sophistication is required in the design of the implanter. The silicon wafers charge electrically during implantation and this charge must be dissipated continuously to reduce the electrical stress in the device and avoid destructive electrical breakdown. Electron flood guns produce low energy electrons (below 10 electronvolts) to neutralize positive charge buildup and implanter design must ensure minimum contamination by other isotopic species and ensure low internal sputter rates. The pace of technology in the semiconductor industry is such that implanters are being built now for 256 Megabit circuits but which are only likely to be widely available five years from now. Several specialist companies manufacture implanter systems, each costing around US$5 million, depending on the

  4. Application of GA package in functional packaging

    Science.gov (United States)

    Belousova, D. A.; Noskova, E. E.; Kapulin, D. V.

    2018-05-01

    The approach to application program for the task of configuration of the elements of the commutation circuit for design of the radio-electronic equipment on the basis of the genetic algorithm is offered. The efficiency of the used approach for commutation circuits with different characteristics for computer-aided design on radio-electronic manufacturing is shown. The prototype of the computer-aided design subsystem on the basis of a package GA for R with a set of the general functions for optimization of multivariate models is programmed.

  5. Limonene and tetrahydrofurfuryl alcohol cleaning agent

    Science.gov (United States)

    Bohnert, George W.; Carter, Richard D.; Hand, Thomas E.; Powers, Michael T.

    1996-05-07

    The present invention is a tetrahydrofurfuryl alcohol and limonene or terpineol cleaning agent and method for formulating and/or using the cleaning agent. This cleaning agent effectively removes both polar and nonpolar contaminants from various electrical and mechanical parts and is readily used without surfactants, thereby reducing the need for additional cleaning operations. The cleaning agent is warm water rinsable without the use of surfactants. The cleaning agent can be azeotropic, enhancing ease of use in cleaning operations and ease of recycling.

  6. Limonene and tetrahydrofurfurly alcohol cleaning agent

    Science.gov (United States)

    Bohnert, George W.; Carter, Richard D.; Hand, Thomas E.; Powers, Michael T.

    1997-10-21

    The present invention is a tetrahydrofurfuryl alcohol and limonene cleaning agent and method for formulating and/or using the cleaning agent. This cleaning agent effectively removes both polar and nonpolar contaminants from various electrical and mechanical parts and is readily used without surfactants, thereby reducing the need for additional cleaning operations. The cleaning agent is warm water rinsable without the use of surfactants. The cleaning agent can be azeotropic, enhancing ease of use in cleaning operations and ease of recycling.

  7. CH Packaging Program Guidance

    International Nuclear Information System (INIS)

    2005-01-01

    The purpose of this document is to provide the technical requirements for preparation for use, operation, inspection, and maintenance of a Transuranic Package Transporter Model II (TRUPACT-II), a HalfPACT shipping package, and directly related components. This document complies with the minimum requirements as specified in the TRUPACT-II Safety Analysis Report for Packaging (SARP), HalfPACT SARP, and U.S. Nuclear Regulatory Commission (NRC) Certificates of Compliance (C of C) 9218 and 9279, respectively. In the event of a conflict between this document and the SARP or C of C, the C of C shall govern. The C of Cs state: ''each package must be prepared for shipment and operated in accordance with the procedures described in Chapter 7.0, Operating Procedures, of the application.'' They further state: ''each package must be tested and maintained in accordance with the procedures described in Chapter 8.0, Acceptance Tests and Maintenance Program of the Application.'' Chapter 9.0 of the SARP charges the Waste Isolation Pilot Plant (WIPP) management and operating (M and O) contractor with assuring packaging is used in accordance with the requirements of the C of C. Because the packaging is NRC-approved, users need to be familiar with Title 10 Code of Federal Regulations (CFR) 71.8. Any time a user suspects or has indications that the conditions of approval in the C of C were not met, the Carlsbad Field Office (CBFO) shall be notified immediately. The CBFO will evaluate the issue and notify the NRC if required.

  8. Food Packaging Materials

    Science.gov (United States)

    1978-01-01

    The photos show a few of the food products packaged in Alure, a metallized plastic material developed and manufactured by St. Regis Paper Company's Flexible Packaging Division, Dallas, Texas. The material incorporates a metallized film originally developed for space applications. Among the suppliers of the film to St. Regis is King-Seeley Thermos Company, Winchester, Ma'ssachusetts. Initially used by NASA as a signal-bouncing reflective coating for the Echo 1 communications satellite, the film was developed by a company later absorbed by King-Seeley. The metallized film was also used as insulating material for components of a number of other spacecraft. St. Regis developed Alure to meet a multiple packaging material need: good eye appeal, product protection for long periods and the ability to be used successfully on a wide variety of food packaging equipment. When the cost of aluminum foil skyrocketed, packagers sought substitute metallized materials but experiments with a number of them uncovered problems; some were too expensive, some did not adequately protect the product, some were difficult for the machinery to handle. Alure offers a solution. St. Regis created Alure by sandwiching the metallized film between layers of plastics. The resulting laminated metallized material has the superior eye appeal of foil but is less expensive and more easily machined. Alure effectively blocks out light, moisture and oxygen and therefore gives the packaged food long shelf life. A major packaging firm conducted its own tests of the material and confirmed the advantages of machinability and shelf life, adding that it runs faster on machines than materials used in the past and it decreases product waste; the net effect is increased productivity.

  9. Food packages for Space Shuttle

    Science.gov (United States)

    Fohey, M. F.; Sauer, R. L.; Westover, J. B.; Rockafeller, E. F.

    1978-01-01

    The paper reviews food packaging techniques used in space flight missions and describes the system developed for the Space Shuttle. Attention is directed to bite-size food cubes used in Gemini, Gemini rehydratable food packages, Apollo spoon-bowl rehydratable packages, thermostabilized flex pouch for Apollo, tear-top commercial food cans used in Skylab, polyethylene beverage containers, Skylab rehydratable food package, Space Shuttle food package configuration, duck-bill septum rehydration device, and a drinking/dispensing nozzle for Space Shuttle liquids. Constraints and testing of packaging is considered, a comparison of food package materials is presented, and typical Shuttle foods and beverages are listed.

  10. Semiconductor radiation detector

    Science.gov (United States)

    Bell, Zane W.; Burger, Arnold

    2010-03-30

    A semiconductor detector for ionizing electromagnetic radiation, neutrons, and energetic charged particles. The detecting element is comprised of a compound having the composition I-III-VI.sub.2 or II-IV-V.sub.2 where the "I" component is from column 1A or 1B of the periodic table, the "II" component is from column 2B, the "III" component is from column 3A, the "IV" component is from column 4A, the "V" component is from column 5A, and the "VI" component is from column 6A. The detecting element detects ionizing radiation by generating a signal proportional to the energy deposited in the element, and detects neutrons by virtue of the ionizing radiation emitted by one or more of the constituent materials subsequent to capture. The detector may contain more than one neutron-sensitive component.

  11. Semiconductor testing method

    International Nuclear Information System (INIS)

    Brown, Stephen.

    1992-01-01

    In a method of avoiding use of nuclear radiation, eg gamma rays, X-rays, electron beams, for testing semiconductor components for resistance to hard radiation, which hard radiation causes data corruption in some memory devices and 'latch-up' in others, similar fault effects can be achieved using a xenon or other 'light' flash gun even though the penetration of light is significantly less than that of gamma rays. The method involves treating a device with gamma radiation, measuring a particular fault current at the onset of a fault event, repeating the test with light to confirm the occurrence of the fault event at the same measured fault current, and using the fault current value as a reference for future tests using light on similar devices. (author)

  12. Radial semiconductor drift chambers

    International Nuclear Information System (INIS)

    Rawlings, K.J.

    1987-01-01

    The conditions under which the energy resolution of a radial semiconductor drift chamber based detector system becomes dominated by the step noise from the detector dark current have been investigated. To minimise the drift chamber dark current attention should be paid to carrier generation at Si/SiO 2 interfaces. This consideration conflicts with the desire to reduce the signal risetime: a higher drift field for shorter signal pulses requires a larger area of SiO 2 . Calculations for the single shaping and pseudo Gaussian passive filters indicate that for the same degree of signal risetime sensitivity in a system dominated by the step noise from the detector dark current, the pseudo Gaussian filter gives only a 3% improvement in signal/noise and 12% improvement in rate capability compared with the single shaper performance. (orig.)

  13. Energy distribution in semiconductors

    International Nuclear Information System (INIS)

    Ance, C.

    1979-01-01

    For various semiconductors the dispersive energy Esub(d) defined in the Wemple-Didomenico model is connected with the covalent and ionic energies Esub(h) and C. A continuous curve of ionicity against the ratio of the two energies Esub(A) and Esub(B), connected to Esub(h) and C is reported. Afromowitz's model is applied to the ternary compounds Gasub(1-x)Alsub(x)Sb using optical decomposition. From these results the average energy gap Esub(g) is given by Esub(g) = D 0 M 0 sup((IB))/(epsilon 1 (0)-1) where M 0 sup((IB)) is the interband transition contribution to the optical moment M 0 . (author)

  14. Organic Semiconductor Photovoltaics

    Science.gov (United States)

    Sariciftci, Niyazi Serdar

    2005-03-01

    Recent developments on organic photovoltaic elements are reviewed. Semiconducting conjugated polymers and molecules as well as nanocrystalline inorganic semiconductors are used in composite thin films. The photophysics of such photoactive devices is based on the photoinduced charge transfer from donor type semiconducting molecules onto acceptor type molecules such as Buckminsterfullerene, C60 and/or nanoparticles. Similar to the first steps in natural photosynthesis, this photoinduced electron transfer leads to a number of potentially interesting applications which include sensitization of the photoconductivity and photovoltaic phenomena. Examples of photovoltaic architectures are discussed with their potential in terrestrial solar energy conversion. Several materials are introduced and discussed for their photovoltaic activities. Furthermore, nanomorphology has been investigated with AFM, SEM and TEM. The morphology/property relationship for a given photoactive system is found to be a major effect.

  15. Technological and organizational diversity and technical advance in the early history of the American semiconductor industry

    Science.gov (United States)

    Cohen, W.; Holbrook, D.; Klepper, S.

    1994-06-01

    This study examines the early years of the semiconductor industry and focuses on the roles played by different size firms in technologically innovative processes. A large and diverse pool of firms participated in the growth of the industry. Three related technological areas were chosen for in-depth analysis: integrated circuits, materials technology, and device packaging. Large business producing vacuum tubes dominated the early production of semiconductor devices. As the market for new devices grew during the 1950's, new firms were founded and existing firms from other industries, e.g. aircraft builders and instrument makers, began to pursue semiconductor electronics. Small firms began to cater to the emerging industry by supplying materials and equipment. These firms contributed to the development of certain aspects of one thousand firms that were playing some part in the semiconductor industry.

  16. CH Packaging Program Guidance

    International Nuclear Information System (INIS)

    2006-01-01

    The purpose of this document is to provide the technical requirements for preparation for use, operation, inspection, and maintenance of a Transuranic Package Transporter Model II (TRUPACT-II), a HalfPACT shipping package, and directly related components. This document complies with the minimum requirements as specified in the TRUPACT-II Safety Analysis Report for Packaging (SARP), HalfPACT SARP, and U.S. Nuclear Regulatory Commission (NRC) Certificates of Compliance (C of C) 9218 and 9279, respectively. In the event of a conflict between this document and the SARP or C of C, the C of C shall govern. The C of Cs state: 'each package must be prepared for shipment and operated in accordance with the procedures described in Chapter 7.0, Operating Procedures, of the application.' They further state: 'each package must be tested and maintained in accordance with the procedures described in Chapter 8.0, Acceptance Tests and Maintenance Program of the Application.' Chapter 9.0 of the SARP charges the U.S. Department of Energy (DOE) or the Waste Isolation Pilot Plant| (WIPP) management and operating (M and O) contractor with assuring packaging is used in accordance with the requirements of the C of C. Because the packaging is NRC-approved, users need to be familiar with Title 10 Code of Federal Regulations(CFR) 71.8. Any time a user suspects or has indications that the conditions of approval in the C of C were not met, the Carlsbad Field Office (CBFO) shall be notified immediately. The CBFO will evaluate the issue and notify the NRC if required.In accordance with 10 CFR Part 71, certificate holders, packaging users, and contractors or subcontractors who use, design, fabricate, test, maintain, or modify the packaging shall post copies of (1) 10 CFR Part 21 regulations, (2) Section 206 of the Energy Reorganization Act of 1974, and (3) NRC Form 3, Notice to Employees. These documents must be posted in a conspicuous location where the activities subject to these regulations

  17. CH Packaging Program Guidance

    International Nuclear Information System (INIS)

    2007-01-01

    The purpose of this document is to provide the technical requirements for preparation for use, operation, inspection, and maintenance of a Transuranic Package Transporter Model II (TRUPACT-II), a HalfPACT shipping package, and directly related components. This document complies with the minimum requirements as specified in the TRUPACT-II Safety Analysis Report for Packaging (SARP), HalfPACT SARP, and U.S. Nuclear Regulatory Commission (NRC) Certificates of Compliance (C of C) 9218 and 9279, respectively. In the event of a conflict between this document and the SARP or C of C, the C of C shall govern. The C of Cs state: 'each package must be prepared for shipment and operated in accordance with the procedures described in Chapter 7.0, Operating Procedures, of the application.' They further state: 'each package must be tested and maintained in accordance with the procedures described in Chapter 8.0, Acceptance Tests and Maintenance Program of the Application.' Chapter 9.0 of the SARP charges the U.S. Department of Energy (DOE) or the Waste Isolation Pilot Plant (WIPP) management and operating (M and O) contractor with assuring packaging is used in accordance with the requirements of the C of C. Because the packaging is NRC-approved, users need to be familiar with Title 10 Code of Federal Regulations (CFR) 71.8. Any time a user suspects or has indications that the conditions of approval in the C of C were not met, the Carlsbad Field Office (CBFO) shall be notified immediately. The CBFO will evaluate the issue and notify the NRC if required.In accordance with 10 CFR Part 71, certificate holders, packaging users, and contractors or subcontractors who use, design, fabricate, test, maintain, or modify the packaging shall post copies of (1) 10 CFR Part 21 regulations, (2) Section 206 of the Energy Reorganization Act of 1974, and (3) NRC Form 3, Notice to Employees. These documents must be posted in a conspicuous location where the activities subject to these regulations

  18. Simulation and Performance Test Technology Development for Semiconductor Radiation Detection Instrument Fabrication

    International Nuclear Information System (INIS)

    Kim, Jong Kyung; Lee, W. G.; Kim, S. Y.; Shin, C. H.; Kim, K. O.; Park, J. M.; Jang, D. Y.; Kang, J. S.

    2010-06-01

    - Analysis on the Absorbed Dose and Electron Generation by Using MCNPX Code - Analysis on the Change of Measured Energy Spectrum As a Function of Bias Voltage Applied in Semiconductor Detector - Comparison of Monte Carlo Simulation Considering the Charge Collection Efficiency and Experimental Result - Development of Semiconductor Sensor Design Code Based on the Graphic User Interface - Analysis on Depth Profile of Ion-implanted Semiconductor Wafer Surface and Naturally Generated SiO2 Insulation Layer Using Auger Electron Spectroscopy - Measurement of AFM Images and Roughness to Abalyze Surface of Semiconductor Wafer with respect to Annealing and Cleaning Process - Measurement of Physical Properties for Semiconductor Detector Surface after CZT Passivation Process - Evaluation of Crystal Structure and Specific Resistance of CZT - Measurement/Analysis on Band Structure of CZT Crystal - Evaluation of Neutron Convertor Layer with respect to Change in Temperature - Measurement/Evaluation of physical characteristics for lattice parameter, specific resistance, and band structure of CZT crystal - Measurement/Evaluation of lattice transition of SiC semiconductor detector after radiation irradiation - Measurement/Evaluation of performance of semiconductor detector with respect to exposure in high temperature environment

  19. Controlling semiconductor nanoparticle size distributions with tailored ultrashort pulses

    International Nuclear Information System (INIS)

    Hergenroeder, R; Miclea, M; Hommes, V

    2006-01-01

    The laser generation of size-controlled semiconductor nanoparticle formation under gas phase conditions is investigated. It is shown that the size distribution can be changed if picosecond pulse sequences of tailored ultra short laser pulses (<200 fs) are employed. By delivering the laser energy in small packages, a temporal energy flux control at the target surface is achieved, which results in the control of the thermodynamic pathway the material takes. The concept is tested with silicon and germanium, both materials with a predictable response to double pulse sequences, which allows deduction of the materials' response to complicated pulse sequences. An automatic, adaptive learning algorithm was employed to demonstrate a future strategy that enables the definition of more complex optimization targets such as particle size on materials less predictable than semiconductors

  20. Welding robot package; Arc yosetsu robot package

    Energy Technology Data Exchange (ETDEWEB)

    Nishikawa, S. [Yaskawa Electric Corp., Kitakyushu (Japan)

    1998-09-01

    For the conventional high-speed welding robot, the welding current was controlled mainly for reducing the spatters during short circuits and for stabilizing the beads by the periodic short circuits. However, an increase of deposition amount in response to the speed is required for the high-speed welding. Large-current low-spatter welding current region control was added. Units were integrated into a package by which the arc length is kept in short without dispersion of arc length for welding without defects such as undercut and unequal beads. In automobile industry, use of aluminum parts is extended for the light weight. The welding is very difficult, and automation is not so progressing in spite of the poor environment. Buckling of welding wire is easy to occur, and supply of wire is obstructed by the deposition of chipped powders on the torch cable, which stay within the contact chip resulting in the deposition. Dislocation of locus is easy to occur at the corner of rectangular pipe during the welding. By improving these troubles, an aluminum MIG welding robot package has been developed. 13 figs.

  1. Overview of shoreline cleaning agents

    International Nuclear Information System (INIS)

    Clayton, J.

    1992-01-01

    Chemical cleaning agents may be used to promote release of stranded oil from shorelines for reasons including biological sensitivity of indigenous fauna and flora to the oil, amenity considerations of the shoreline, or concern about refloating of the oil and subsequent stranding on adjacent shorelines. While use of chemical cleaning agents may be appropriate under proper toxic responses in circumstances, certain limitations should be recognized. The potential for toxic responses in indigenous fauna and flora to the cleaning agents must be considered. Enhanced penetration of oil into permeable shorelines following treatment with chemical cleaning agents also is not desirable. However, if conditions related to toxicity and substrate permeability are determined to be acceptable, the use of chemical cleaning agents for treatment of stranded oil can be considered. Chemical agents for cleaning oiled shorelines can be grouped into three categories: (1) non-surfactant-based solvents, (2) chemical dispersants, and (3) formulations especially designed to release stranded oil from shoreline substrates (i.e., shoreline-cleaning-agents). Depending on the specific circumstances present on an oiled shoreline, it is generally desirable that chemical agents used for cleaning will release oil from shoreline substrate(s) to surface waters. Recovery of the oil can then be accomplished by mechanical procedures such as booming and skimming operations

  2. Programmed Cleaning and Environmental Sanitation.

    Science.gov (United States)

    Gardner, John C., Ed.

    Maintenance of sanitation in buildings, plants, offices, and institutions; the selection of cleaning materials for these purposes; and the organization and supervision of the cleaning program are becoming increasingly complex and needful of a higher cost of handling. This book describes these problems and gives helpful information and guidance for…

  3. Waste package characterisation

    Energy Technology Data Exchange (ETDEWEB)

    Sannen, L.; Bruggeman, M.; Wannijn, J.P

    1998-09-01

    Radioactive wastes originating from the hot labs of the Belgian Nuclear Research Centre SCK-CEN contain a wide variety of radiotoxic substances. The accurate characterisation of the short- and long-term radiotoxic components is extremely difficult but required in view of geological disposal. This paper describes the methodology which was developed and adopted to characterise the high- and medium-level waste packages at the SCK-CEN hot laboratories. The proposed method is based on the estimation of the fuel inventory evacuated in a particular waste package; a calculation of the relative fission product contribution on the fuel fabrication and irradiation footing; a comparison of the calculated, as expected, dose rate and the real measured dose rate of the waste package. To cope with the daily practice an appropriate fuel inventory estimation route, a user friendly computer programme for fission product and corresponding dose rate calculation, and a simple dose rate measurement method have been developed and implemented.

  4. Waste package characterisation

    International Nuclear Information System (INIS)

    Sannen, L.; Bruggeman, M.; Wannijn, J.P.

    1998-09-01

    Radioactive wastes originating from the hot labs of the Belgian Nuclear Research Centre SCK-CEN contain a wide variety of radiotoxic substances. The accurate characterisation of the short- and long-term radiotoxic components is extremely difficult but required in view of geological disposal. This paper describes the methodology which was developed and adopted to characterise the high- and medium-level waste packages at the SCK-CEN hot laboratories. The proposed method is based on the estimation of the fuel inventory evacuated in a particular waste package; a calculation of the relative fission product contribution on the fuel fabrication and irradiation footing; a comparison of the calculated, as expected, dose rate and the real measured dose rate of the waste package. To cope with the daily practice an appropriate fuel inventory estimation route, a user friendly computer programme for fission product and corresponding dose rate calculation, and a simple dose rate measurement method have been developed and implemented

  5. Waste package reliability analysis

    International Nuclear Information System (INIS)

    Pescatore, C.; Sastre, C.

    1983-01-01

    Proof of future performance of a complex system such as a high-level nuclear waste package over a period of hundreds to thousands of years cannot be had in the ordinary sense of the word. The general method of probabilistic reliability analysis could provide an acceptable framework to identify, organize, and convey the information necessary to satisfy the criterion of reasonable assurance of waste package performance according to the regulatory requirements set forth in 10 CFR 60. General principles which may be used to evaluate the qualitative and quantitative reliability of a waste package design are indicated and illustrated with a sample calculation of a repository concept in basalt. 8 references, 1 table

  6. Packaged and hybrid integrated all-optical flip-flop memory

    NARCIS (Netherlands)

    Liu, Y.; McDougall, R.; Hill, M.T.; Maxwell, G.D.; Zhang, S.; Harmon, R.; Huijskens, Frans; Rivers, L.; Dorren, H.J.S.; Poustie, A.

    2006-01-01

    A fully-packaged hybrid-integrated all-optical flip-flop, where InP-based semiconductor optical amplifiers are assembled onto a planar silica waveguide board, is demonstrated. It is shown experimentally that the flip-flop can dynamically toggle between its two states by injecting 150 ps optical

  7. Magnetic excitations in ferromagnetic semiconductors

    International Nuclear Information System (INIS)

    Furdyna, J.K.; Liu, X.; Zhou, Y.Y.

    2009-01-01

    Magnetic excitations in a series of GaMnAs ferromagnetic semiconductor films were studied by ferromagnetic resonance (FMR). Using the FMR approach, multi-mode spin wave resonance spectra have been observed, whose analysis provides information on magnetic anisotropy (including surface anisotropy), distribution of magnetization precession within the GaMnAs film, dynamic surface spin pinning (derived from surface anisotropy), and the value of exchange stiffness constant D. These studies illustrate a combination of magnetism and semiconductor physics that is unique to magnetic semiconductors

  8. Semiconductor Nanocrystals for Biological Imaging

    Energy Technology Data Exchange (ETDEWEB)

    Fu, Aihua; Gu, Weiwei; Larabell, Carolyn; Alivisatos, A. Paul

    2005-06-28

    Conventional organic fluorophores suffer from poor photo stability, narrow absorption spectra and broad emission feature. Semiconductor nanocrystals, on the other hand, are highly photo-stable with broad absorption spectra and narrow size-tunable emission spectra. Recent advances in the synthesis of these materials have resulted in bright, sensitive, extremely photo-stable and biocompatible semiconductor fluorophores. Commercial availability facilitates their application in a variety of unprecedented biological experiments, including multiplexed cellular imaging, long-term in vitro and in vivo labeling, deep tissue structure mapping and single particle investigation of dynamic cellular processes. Semiconductor nanocrystals are one of the first examples of nanotechnology enabling a new class of biomedical applications.

  9. SPHINX experimenters information package

    International Nuclear Information System (INIS)

    Zarick, T.A.

    1996-08-01

    This information package was prepared for both new and experienced users of the SPHINX (Short Pulse High Intensity Nanosecond X-radiator) flash X-Ray facility. It was compiled to help facilitate experiment design and preparation for both the experimenter(s) and the SPHINX operational staff. The major areas covered include: Recording Systems Capabilities,Recording System Cable Plant, Physical Dimensions of SPHINX and the SPHINX Test cell, SPHINX Operating Parameters and Modes, Dose Rate Map, Experiment Safety Approval Form, and a Feedback Questionnaire. This package will be updated as the SPHINX facilities and capabilities are enhanced

  10. Nirex - The complete package

    International Nuclear Information System (INIS)

    Carr, N.A.; Rarok, M.

    2002-01-01

    Through continuous interaction with its customers, Nirex had identified the need for a comprehensive range of waste containers, reflecting the variety of wastes and operational undertakings. The current range consists of five standard containers. Standardisation is introduced across all waste packages to enable the safe and efficient operation of future waste management facilities. The practical lessons learned during the development of standard containers are in turn reflected in the container design work that Nirex has undertaken. They are also fed into the advice given to customers during evaluation of waste packaging proposals. (author)

  11. Ada Namelist Package

    Science.gov (United States)

    Klumpp, Allan R.

    1991-01-01

    Ada Namelist Package, developed for Ada programming language, enables calling program to read and write FORTRAN-style namelist files. Features are: handling of any combination of types defined by user; ability to read vectors, matrices, and slices of vectors and matrices; handling of mismatches between variables in namelist file and those in programmed list of namelist variables; and ability to avoid searching entire input file for each variable. Principle benefits derived by user: ability to read and write namelist-readable files, ability to detect most file errors in initialization phase, and organization keeping number of instantiated units to few packages rather than to many subprograms.

  12. Air-cleaning apparatus

    International Nuclear Information System (INIS)

    Howard, A.G.

    1981-01-01

    An air-cleaning, heat-exchange apparatus includes a main housing portion connected by means of an air inlet fan to the kitchen exhaust stack of a restaurant. The apparatus includes a plurality of heat exchangers through which a heat-absorptive fluid is circulated, simultaneously, by means of a suitable fluid pump. These heat exchangers absorb heat from the hot exhaust gas, out of the exhaust stack of the restaurant, which flows over and through these heat exchangers and transfers this heat to the circulating fluid which communicates with remote heat exchangers. These remote heat exchangers further transfer this heat to a stream of air, such as that from a cold-air return duct for supplementing the conventional heating system of the restaurant. Due to the fact that such hot exhaust gas is heavily grease laden , grease will be deposited on virtually all internal surfaces of the apparatus which this exhaust gas contacts. Consequently, means are provided for spraying these contacted internal surfaces , as well as the hot exhaust gas itself, with a detergent solution in which the grease is soluble, thereby removing grease buildup from these internal surfaces

  13. Clean coal technology

    International Nuclear Information System (INIS)

    Abelson, P.H.

    1990-01-01

    One of the major technology challenges in the next decade will be to develop means of using coal imaginatively as a source of chemicals and in a more energy-efficient manner. The Clean Air Act will help to diminish the acid rain but will not reduce CO 2 emissions. The Department of Energy (DOE) is fostering many innovations that are likely to have a positive effect on coal usage. Of the different innovations in the use of coal fostered by DOE, two are of particular interest. One is the new pressurized fluid bed combustion (PFBC) combined-cycle demonstration. The PFBC plant now becoming operational can reduce SO 2 emissions by more than 90% and NO x emissions by 50-70%. A second new technology co-sponsored by DOE is the Encoal mild coal gasification project that will convert a sub-bituminous low-BTU coal into a useful higher BTU solid while producing significant amounts of a liquid fuel

  14. Clean Metal Casting

    Energy Technology Data Exchange (ETDEWEB)

    Makhlouf M. Makhlouf; Diran Apelian

    2002-02-05

    The objective of this project is to develop a technology for clean metal processing that is capable of consistently providing a metal cleanliness level that is fit for a given application. The program has five tasks: Development of melt cleanliness assessment technology, development of melt contamination avoidance technology, development of high temperature phase separation technology, establishment of a correlation between the level of melt cleanliness and as cast mechanical properties, and transfer of technology to the industrial sector. Within the context of the first task, WPI has developed a standardized Reduced Pressure Test that has been endorsed by AFS as a recommended practice. In addition, within the context of task1, WPI has developed a melt cleanliness sensor based on the principles of electromagnetic separation. An industrial partner is commercializing the sensor. Within the context of the second task, WPI has developed environmentally friendly fluxes that do not contain fluorine. Within the context of the third task, WPI modeled the process of rotary degassing and verified the model predictions with experimental data. This model may be used to optimize the performance of industrial rotary degassers. Within the context of the fourth task, WPI has correlated the level of melt cleanliness at various foundries, including a sand casting foundry, a permanent mold casting foundry, and a die casting foundry, to the casting process and the resultant mechanical properties. This is useful in tailoring the melt cleansing operations at foundries to the particular casting process and the desired properties of cast components.

  15. Clean Metal Casting; FINAL

    International Nuclear Information System (INIS)

    Makhlouf M. Makhlouf; Diran Apelian

    2002-01-01

    The objective of this project is to develop a technology for clean metal processing that is capable of consistently providing a metal cleanliness level that is fit for a given application. The program has five tasks: Development of melt cleanliness assessment technology, development of melt contamination avoidance technology, development of high temperature phase separation technology, establishment of a correlation between the level of melt cleanliness and as cast mechanical properties, and transfer of technology to the industrial sector. Within the context of the first task, WPI has developed a standardized Reduced Pressure Test that has been endorsed by AFS as a recommended practice. In addition, within the context of task1, WPI has developed a melt cleanliness sensor based on the principles of electromagnetic separation. An industrial partner is commercializing the sensor. Within the context of the second task, WPI has developed environmentally friendly fluxes that do not contain fluorine. Within the context of the third task, WPI modeled the process of rotary degassing and verified the model predictions with experimental data. This model may be used to optimize the performance of industrial rotary degassers. Within the context of the fourth task, WPI has correlated the level of melt cleanliness at various foundries, including a sand casting foundry, a permanent mold casting foundry, and a die casting foundry, to the casting process and the resultant mechanical properties. This is useful in tailoring the melt cleansing operations at foundries to the particular casting process and the desired properties of cast components

  16. Canada's Clean Air Act

    International Nuclear Information System (INIS)

    2006-01-01

    This paper provided an outline of Canada's Clean Air Act and examined some of the regulatory changes that will occur as a result of its implementation. The Act is being introduced to strengthen the legislative basis for taking action on reducing air pollution and GHGs, and will allow the government to regulate both indoor and outdoor air pollutants and GHGs. The Act will require the Ministers of the Environment and Health to establish national air quality objectives, as well as to monitor and report on their attainment. The Canadian Environmental Protection Act will be amended to enable the government to regulate the blending of fuels and their components. The Motor Vehicle Fuel Consumption Standards Act will also be amended to enhance the government's authority to regulate vehicle fuel efficiency. The Energy Efficiency Act will also be expanded to allow the government to set energy efficiency standards and labelling requirements for a wider range of consumer and commercial products. The Act will commit to short, medium and long-term industrial air pollution targets. Regulations will be proposed for emissions from industry; on-road and off-road vehicles and engines; and consumer and commercial products. It was concluded that the Government of Canada will continue to consult with provinces, territories, industries and Canadians to set and reach targets for the reduction of both indoor and outdoor air pollutants and GHG emissions. 6 figs

  17. Power module packaging with double sided planar interconnection and heat exchangers

    Science.gov (United States)

    Liang, Zhenxian; Marlino, Laura D.; Ning, Puqi; Wang, Fei

    2015-05-26

    A double sided cooled power module package having a single phase leg topology includes two IGBT and two diode semiconductor dies. Each IGBT die is spaced apart from a diode semiconductor die, forming a switch unit. Two switch units are placed in a planar face-up and face-down configuration. A pair of DBC or other insulated metallic substrates is affixed to each side of the planar phase leg semiconductor dies to form a sandwich structure. Attachment layers are disposed on outer surfaces of the substrates and two heat exchangers are affixed to the substrates by rigid bond layers. The heat exchangers, made of copper or aluminum, have passages for carrying coolant. The power package is manufactured in a two-step assembly and heating process where direct bonds are formed for all bond layers by soldering, sintering, solid diffusion bonding or transient liquid diffusion bonding, with a specially designed jig and fixture.

  18. Packaging Solutions : Delivering customer value through Logistical Packaging: A Case Study at Stora Enso Packaging

    OpenAIRE

    Shan, Kun; Julius, Joezer

    2015-01-01

    AbstractBackground;Despite of the significant role of packaging within logistics and supply chain management, packaging is infrequently studied as focal point in supply chain. Most of the previous logistics research studies tend to explain the integration between packaging and logistics through logistical packaging. In very rare cases, the studies mentioned about customer value. Therefore the major disadvantage of these studies is that, they didn’t consider logistical packaging and customer v...

  19. State of the art in semiconductor detectors

    International Nuclear Information System (INIS)

    Rehak, P.; Gatti, E.

    1990-01-01

    The state of the art in semiconductor detectors for elementary particle physics and X-ray astronomy is briefly reviewed. Semiconductor detectors are divided into two groups; i) classical semiconductor diode detectors and ii) semiconductor memory detectors. Principles of signal formation for both groups of detectors are described and their performance is compared. New developments of silicon detectors are reported here. (orig.)

  20. State of the art in semiconductor detectors

    International Nuclear Information System (INIS)

    Rehak, P.; Gatti, E.

    1989-01-01

    The state of the art in semiconductor detectors for elementary particle physics and x-ray astronomy is briefly reviewed. Semiconductor detectors are divided into two groups; classical semiconductor diode detectors; and semiconductor memory detectors. Principles of signal formation for both groups of detectors are described and their performance is compared. New developments of silicon detectors are reported here. 13 refs., 8 figs

  1. Semiconductor device comprising a pn-heterojunction

    NARCIS (Netherlands)

    2007-01-01

    An electric device is disclosed comprising a pn-heterojunction ( 4 ) formed by a nanowire ( 3 ) of 111 -V semiconductor material and a semiconductor body ( 1 ) comprising a group IV semiconductor material. The nanowire ( 3 ) is positioned in direct contact with the surface ( 2 ) of the semiconductor

  2. Toward designing semiconductor-semiconductor heterojunctions for photocatalytic applications

    Science.gov (United States)

    Zhang, Liping; Jaroniec, Mietek

    2018-02-01

    Semiconductor photocatalysts show a great potential for environmental and energy-related applications, however one of the major disadvantages is their relatively low photocatalytic performance due to the recombination of electron-hole pairs. Therefore, intensive research is being conducted toward design of heterojunctions, which have been shown to be effective for improving the charge-transfer properties and efficiency of photocatalysts. According to the type of band alignment and direction of internal electric field, heterojunctions are categorized into five different types, each of which is associated with its own charge transfer characteristics. Since the design of heterojunctions requires the knowledge of band edge positions of component semiconductors, the commonly used techniques for the assessment of band edge positions are reviewed. Among them the electronegativity-based calculation method is applied for a large number of popular visible-light-active semiconductors, including some widely investigated bismuth-containing semiconductors. On basis of the calculated band edge positions and the type of component semiconductors reported, heterojunctions composed of the selected bismuth-containing semiconductors are proposed. Finally, the most popular synthetic techniques for the fabrication of heterojunctions are briefly discussed.

  3. AN ADA NAMELIST PACKAGE

    Science.gov (United States)

    Klumpp, A. R.

    1994-01-01

    The Ada Namelist Package, developed for the Ada programming language, enables a calling program to read and write FORTRAN-style namelist files. A namelist file consists of any number of assignment statements in any order. Features of the Ada Namelist Package are: the handling of any combination of user-defined types; the ability to read vectors, matrices, and slices of vectors and matrices; the handling of mismatches between variables in the namelist file and those in the programmed list of namelist variables; and the ability to avoid searching the entire input file for each variable. The principle user benefits of this software are the following: the ability to write namelist-readable files, the ability to detect most file errors in the initialization phase, a package organization that reduces the number of instantiated units to a few packages rather than to many subprograms, a reduced number of restrictions, and an increased execution speed. The Ada Namelist reads data from an input file into variables declared within a user program. It then writes data from the user program to an output file, printer, or display. The input file contains a sequence of assignment statements in arbitrary order. The output is in namelist-readable form. There is a one-to-one correspondence between namelist I/O statements executed in the user program and variables read or written. Nevertheless, in the input file, mismatches are allowed between assignment statements in the file and the namelist read procedure statements in the user program. The Ada Namelist Package itself is non-generic. However, it has a group of nested generic packages following the nongeneric opening portion. The opening portion declares a variety of useraccessible constants, variables and subprograms. The subprograms are procedures for initializing namelists for reading, reading and writing strings. The subprograms are also functions for analyzing the content of the current dataset and diagnosing errors. Two nested

  4. Method of manufacturing a semiconductor device and semiconductor device obtained with such a method

    NARCIS (Netherlands)

    2008-01-01

    The invention relates to a method of manufacturing a semiconductor device (10) with a semiconductor body (1) which is provided with at least one semiconductor element, wherein on the surface of the semiconductor body (1) a mesa- shaped semiconductor region (2) is formed, a masking layer (3) is

  5. Tantalum-based semiconductors for solar water splitting.

    Science.gov (United States)

    Zhang, Peng; Zhang, Jijie; Gong, Jinlong

    2014-07-07

    Solar energy utilization is one of the most promising solutions for the energy crises. Among all the possible means to make use of solar energy, solar water splitting is remarkable since it can accomplish the conversion of solar energy into chemical energy. The produced hydrogen is clean and sustainable which could be used in various areas. For the past decades, numerous efforts have been put into this research area with many important achievements. Improving the overall efficiency and stability of semiconductor photocatalysts are the research focuses for the solar water splitting. Tantalum-based semiconductors, including tantalum oxide, tantalate and tantalum (oxy)nitride, are among the most important photocatalysts. Tantalum oxide has the band gap energy that is suitable for the overall solar water splitting. The more negative conduction band minimum of tantalum oxide provides photogenerated electrons with higher potential for the hydrogen generation reaction. Tantalates, with tunable compositions, show high activities owning to their layered perovskite structure. (Oxy)nitrides, especially TaON and Ta3N5, have small band gaps to respond to visible-light, whereas they can still realize overall solar water splitting with the proper positions of conduction band minimum and valence band maximum. This review describes recent progress regarding the improvement of photocatalytic activities of tantalum-based semiconductors. Basic concepts and principles of solar water splitting will be discussed in the introduction section, followed by the three main categories regarding to the different types of tantalum-based semiconductors. In each category, synthetic methodologies, influencing factors on the photocatalytic activities, strategies to enhance the efficiencies of photocatalysts and morphology control of tantalum-based materials will be discussed in detail. Future directions to further explore the research area of tantalum-based semiconductors for solar water splitting

  6. Selective, electrochemical etching of a semiconductor

    Science.gov (United States)

    Dahal, Rajendra P.; Bhat, Ishwara B.; Chow, Tat-Sing

    2018-03-20

    Methods for facilitating fabricating semiconductor structures are provided which include: providing a multilayer structure including a semiconductor layer, the semiconductor layer including a dopant and having an increased conductivity; selectively increasing, using electrochemical processing, porosity of the semiconductor layer, at least in part, the selectively increasing porosity utilizing the increased conductivity of the semiconductor layer; and removing, at least in part, the semiconductor layer with the selectively increased porosity from the multilayer structure. By way of example, the selectively increasing porosity may include selectively, anodically oxidizing, at least in part, the semiconductor layer of the multilayer structure.

  7. Pickering Unit 1 chemical cleaning

    International Nuclear Information System (INIS)

    Smee, J.L.; Fiola, R.J.; Brennenstuhl, K.R.; Zerkee, D.D.; Daniel, C.M.

    1995-01-01

    The secondary sides of all 12 boilers at Pickering Unit 1 were chemically cleaned in 1994 by the team of Ontario Hydro, B and W International (Cambridge, Ontario) and B and W Nuclear Technologies (Lynchburg, Virginia). A multi-step EPRI/SGOG process was employed in a similar manner to previous clearings at Units 5 and 6 in 1992 and 1993, respectively. A major innovation with the Unit 1 cleaning was the incorporation of a crevice cleaning step, the first time this had been done on Ontario Hydro plants. In addition, six boilers were cleaned in parallel compared to three at a time in previous Pickering cleanings. This significantly reduced cleaning time. A total of 6,770 kg of sludge was removed through direct chemical dissolution. It consisted of 66% iron/nickel oxides and 28% copper metal. A total of 1,600,000 L (420,000 US gallons) of liquid waste was produced. It was processed through the spent solvent treatment facility located at the Bruce Nuclear Power Development site. Visual inspection performed after the cleaning indicated that the crevices between the boiler tubes and the tube support structure were completely clear of deposit and the general condition of the tubing and lattice bars appeared to be in 'as new' condition. (author)

  8. Metal-insulator-semiconductor photodetectors.

    Science.gov (United States)

    Lin, Chu-Hsuan; Liu, Chee Wee

    2010-01-01

    The major radiation of the sun can be roughly divided into three regions: ultraviolet, visible, and infrared light. Detection in these three regions is important to human beings. The metal-insulator-semiconductor photodetector, with a simpler process than the pn-junction photodetector and a lower dark current than the MSM photodetector, has been developed for light detection in these three regions. Ideal UV photodetectors with high UV-to-visible rejection ratio could be demonstrated with III-V metal-insulator-semiconductor UV photodetectors. The visible-light detection and near-infrared optical communications have been implemented with Si and Ge metal-insulator-semiconductor photodetectors. For mid- and long-wavelength infrared detection, metal-insulator-semiconductor SiGe/Si quantum dot infrared photodetectors have been developed, and the detection spectrum covers atmospheric transmission windows.

  9. Metal-Insulator-Semiconductor Photodetectors

    Directory of Open Access Journals (Sweden)

    Chu-Hsuan Lin

    2010-09-01

    Full Text Available The major radiation of the Sun can be roughly divided into three regions: ultraviolet, visible, and infrared light. Detection in these three regions is important to human beings. The metal-insulator-semiconductor photodetector, with a simpler process than the pn-junction photodetector and a lower dark current than the MSM photodetector, has been developed for light detection in these three regions. Ideal UV photodetectors with high UV-to-visible rejection ratio could be demonstrated with III-V metal-insulator-semiconductor UV photodetectors. The visible-light detection and near-infrared optical communications have been implemented with Si and Ge metal-insulator-semiconductor photodetectors. For mid- and long-wavelength infrared detection, metal-insulator-semiconductor SiGe/Si quantum dot infrared photodetectors have been developed, and the detection spectrum covers atmospheric transmission windows.

  10. Quantum optics with semiconductor nanostructures

    CERN Document Server

    Jahnke, Frank

    2012-01-01

    A guide to the theory, application and potential of semiconductor nanostructures in the exploration of quantum optics. It offers an overview of resonance fluorescence emission.$bAn understanding of the interaction between light and matter on a quantum level is of fundamental interest and has many applications in optical technologies. The quantum nature of the interaction has recently attracted great attention for applications of semiconductor nanostructures in quantum information processing. Quantum optics with semiconductor nanostructures is a key guide to the theory, experimental realisation, and future potential of semiconductor nanostructures in the exploration of quantum optics. Part one provides a comprehensive overview of single quantum dot systems, beginning with a look at resonance fluorescence emission. Quantum optics with single quantum dots in photonic crystal and micro cavities are explored in detail, before part two goes on to review nanolasers with quantum dot emitters. Light-matter interaction...

  11. Atomic layer deposition for semiconductors

    CERN Document Server

    Hwang, Cheol Seong

    2014-01-01

    This edited volume discusses atomic layer deposition (ALD) for all modern semiconductor devices, moving from the basic chemistry of ALD and modeling of ALD processes to sections on ALD for memories, logic devices, and machines.

  12. Semiconductor technology program. Progress briefs

    Science.gov (United States)

    Bullis, W. M.

    1980-01-01

    Measurement technology for semiconductor materials, process control, and devices is reviewed. Activities include: optical linewidth and thermal resistance measurements; device modeling; dopant density profiles; resonance ionization spectroscopy; and deep level measurements. Standardized oxide charge terminology is also described.

  13. Semiconductor radiation detectors. Device physics

    International Nuclear Information System (INIS)

    Lutz, G.

    2007-01-01

    Starting from basic principles, the author, whose own contributions to these developments have been significant, describes the rapidly growing field of modern semiconductor detectors used for energy and position measurement radiation. This development was stimulated by requirements in elementary particle physics where it has led to important scientific discoveries. It has now spread to many other fields of science and technology. The book is written in a didactic way and includes an introduction to semiconductor physics. The working principles of semiconductor radiation detectors are explained in an intuitive way, followed by formal quantitative analysis. Broad coverage is also given to electronic signal readout and to the subject of radiation damage. The book is the first to comprehensively cover the semiconductor radiation detectors currently in use. It is useful as a teaching guide and as a reference work for research and applications. (orig.)

  14. Self-assembling peptide semiconductors

    Science.gov (United States)

    Tao, Kai; Makam, Pandeeswar; Aizen, Ruth; Gazit, Ehud

    2017-01-01

    Semiconductors are central to the modern electronics and optics industries. Conventional semiconductive materials bear inherent limitations, especially in emerging fields such as interfacing with biological systems and bottom-up fabrication. A promising candidate for bioinspired and durable nanoscale semiconductors is the family of self-assembled nanostructures comprising short peptides. The highly ordered and directional intermolecular π-π interactions and hydrogen-bonding network allow the formation of quantum confined structures within the peptide self-assemblies, thus decreasing the band gaps of the superstructures into semiconductor regions. As a result of the diverse architectures and ease of modification of peptide self-assemblies, their semiconductivity can be readily tuned, doped, and functionalized. Therefore, this family of electroactive supramolecular materials may bridge the gap between the inorganic semiconductor world and biological systems. PMID:29146781

  15. Temperature controller of semiconductor laser

    Czech Academy of Sciences Publication Activity Database

    Matoušek, Vít; Číp, Ondřej

    2003-01-01

    Roč. 73, č. 3 (2003), s. 10 - 12 ISSN 0928-5008 Institutional research plan: CEZ:AV0Z2065902 Keywords : temperature controller * semiconductor laser * laser diode Subject RIV: BH - Optics, Masers, Lasers

  16. Radioactive waste disposal package

    Science.gov (United States)

    Lampe, Robert F.

    1986-11-04

    A radioactive waste disposal package comprising a canister for containing vitrified radioactive waste material and a sealed outer shell encapsulating the canister. A solid block of filler material is supported in said shell and convertible into a liquid state for flow into the space between the canister and outer shell and subsequently hardened to form a solid, impervious layer occupying such space.

  17. ROBATEL RS 24 packaging

    International Nuclear Information System (INIS)

    Robatel, M.; Bochard, C.

    1986-01-01

    The ROBATEL RS 24 packaging for light-water reactor fuel assemblies is discussed. The cask uses a strength frame of carbon steel sheets, lead gamma ray shielding, neutron shielding of aluminous concrete, a thermal protection system for the gamma shielding, and a natural convection thermal transfer system

  18. The Swarm Magnetometry Package

    DEFF Research Database (Denmark)

    Merayo, José M.G.; Jørgensen, John Leif; Friis-Christensen, Eigil

    2008-01-01

    The Swarm mission under the ESA's Living Planet Programme is planned for launch in 2010 and consists of a constellation of three satellites at LEO. The prime objective of Swarm is to measure the geomagnetic field with unprecedented accuracy in space and time. The magnetometry package consists...

  19. Learning Activity Package, Algebra.

    Science.gov (United States)

    Evans, Diane

    A set of ten teacher-prepared Learning Activity Packages (LAPs) in beginning algebra and nine in intermediate algebra, these units cover sets, properties of operations, number systems, open expressions, solution sets of equations and inequalities in one and two variables, exponents, factoring and polynomials, relations and functions, radicals,…

  20. Geothermal Greenhouse Information Package

    Energy Technology Data Exchange (ETDEWEB)

    Rafferty, K. [P.E.; Boyd, T. [ed.

    1997-01-01

    This package of information is intended to provide a foundation of background information for developers of geothermal greenhouses. The material is divided into seven sections covering such issues as crop culture and prices, operating costs for greenhouses, heating system design, vendors and a list of other sources of information.

  1. Openability of tamperproof packaging

    NARCIS (Netherlands)

    Del Castillo C., A.; Wever, R.; Buijs, P.J.; Stevels, A.

    2007-01-01

    Communication, product protection and presentation are three key aspects in the world of packaging nowadays. Due to a retail landscape consisting of large stores, displaying packed products on the shelves in self-service environments, these aspects become increasingly important, not only for Fast

  2. Packaging LLW and ILW

    International Nuclear Information System (INIS)

    Flowers, R.H.; Owen, R.G.

    1991-01-01

    Low level waste (LLW) accounts for 70-80% by volume of all radioactive wastes produced by the nuclear industry. It has low specific activity, negligible actinide content and requires little, if any, shielding to protect workers. Volume reduction for LLW of high volume but low density may be achieved by incineration and compaction as appropriate, before packaging for disposal by near surface burial. Intermediate level waste (ILW) is treated and packed to convert it into a stable form to minimize any release of activity and make handling easier. The matrix chosen for immobilization, usually cement, polymers or bitumen, depends on the nature of the waste and the acceptance criteria of the disposal facility. The special case of LLW and ILW which will arise from reactor decommissioning is discussed. Packaging methods adopted by individual countries are reviewed. The range of costs involved for packaging ILW is indicated. There is no international consensus on the performance required from packaged waste to ensure its suitability both for interim storage and final disposal. (UK)

  3. Aquaculture Information Package

    Energy Technology Data Exchange (ETDEWEB)

    Boyd, T.; Rafferty, K. [editors

    1998-01-01

    This package of information is intended to provide background to developers of geothermal aquaculture projects. The material is divided into eight sections and includes information on market and price information for typical species, aquaculture water quality issues, typical species culture information, pond heat loss calculations, an aquaculture glossary, regional and university aquaculture offices and state aquaculture permit requirements.

  4. CH Packaging Maintenance Manual

    International Nuclear Information System (INIS)

    Washington TRU Solutions

    2002-01-01

    This procedure provides instructions for performing inner containment vessel (ICV) and outer containment vessel (OCV) maintenance and periodic leakage rate testing on the following packaging seals and corresponding seal surfaces using a nondestructive helium (He) leak test. In addition, this procedure provides instructions for performing ICV and OCV structural pressure tests

  5. Printer Graphics Package

    Science.gov (United States)

    Blanchard, D. C.

    1986-01-01

    Printer Graphics Package (PGP) is tool for making two-dimensional symbolic plots on line printer. PGP created to support development of Heads-Up Display (HUD) simulation. Standard symbols defined with HUD in mind. Available symbols include circle, triangle, quadrangle, window, line, numbers, and text. Additional symbols easily added or built up from available symbols.

  6. Type B drum packages

    International Nuclear Information System (INIS)

    McCoy, J.C.

    1994-08-01

    The Type B drum packages (TBD) are conceptualized as a family of containers in which a single 208 L or 114 L (55 gal or 30 gal) drum containing Type B quantities of radioactive material (RAM) can be packaged for shipment. The TBD containers are being developed to fill a void in the packaging and transportation capabilities of the U.S. Department of Energy as no container packaging single drums of Type B RAM exists offering double containment. Several multiple-drum containers currently exist, as well as a number of shielded casks, but the size and weight of these containers present many operational challenges for single-drum shipments. As an alternative, the TBD containers will offer up to three shielded versions (light, medium, and heavy) and one unshielded version, each offering single or optional double containment for a single drum. To reduce operational complexity, all versions will share similar design and operational features where possible. The primary users of the TBD containers are envisioned to be any organization desiring to ship single drums of Type B RAM, such as laboratories, waste retrieval activities, emergency response teams, etc. Currently, the TBD conceptual design is being developed with the final design and analysis to be completed in 1995 to 1996. Testing and certification of the unshielded version are planned to be completed in 1996 to 1997 with production to begin in 1997 to 1998

  7. Waste disposal package

    Science.gov (United States)

    Smith, M.J.

    1985-06-19

    This is a claim for a waste disposal package including an inner or primary canister for containing hazardous and/or radioactive wastes. The primary canister is encapsulated by an outer or secondary barrier formed of a porous ceramic material to control ingress of water to the canister and the release rate of wastes upon breach on the canister. 4 figs.

  8. Wake fields in semiconductor plasmas

    International Nuclear Information System (INIS)

    Berezhiani, V.I.; Mahajan, S.M.

    1994-05-01

    It is shown that an intense short laser pulse propagating through a semiconductor plasma will generated longitudinal Langmuir waves in its wake. The measurable wake field can be used as a diagnostic to study nonlinear optical phenomena. For narrow gap semiconductors (for examples InSb) with Kane-type dispersion relation, the system can simulate, at currently available laser powers, the physics underlying wake-field accelerators. (author). 9 refs, 1 fig

  9. Semiconductor research with reactor neutrons

    International Nuclear Information System (INIS)

    Kimura, Itsuro

    1992-01-01

    Reactor neutrons play an important role for characterization of semiconductor materials as same as other advanced materials. On the other hand reactor neutrons bring about not only malignant irradiation effects called radiation damage, but also useful effects such as neutron transmutation doping and defect formation for opto-electronics. Research works on semiconductor materials with the reactor neutrons of the Kyoto University Reactor (KUR) are briefly reviewed. In this review, a stress is laid on the present author's works. (author)

  10. Semiconductor crystal high resolution imager

    Science.gov (United States)

    Levin, Craig S. (Inventor); Matteson, James (Inventor)

    2011-01-01

    A radiation imaging device (10). The radiation image device (10) comprises a subject radiation station (12) producing photon emissions (14), and at least one semiconductor crystal detector (16) arranged in an edge-on orientation with respect to the emitted photons (14) to directly receive the emitted photons (14) and produce a signal. The semiconductor crystal detector (16) comprises at least one anode and at least one cathode that produces the signal in response to the emitted photons (14).

  11. Dissipative chaos in semiconductor superlattices

    Directory of Open Access Journals (Sweden)

    F. Moghadam

    2008-03-01

    Full Text Available In this paper the motion of electron in a miniband of a semiconductor superlattice (SSL under the influence of external electric and magnetic fields is investigated. The electric field is applied in a direction perpendicular to the layers of the semiconductor superlattice, and the magnetic field is applied in different direction Numerical calculations show conditions led to the possibility of chaotic behaviors.

  12. Reducing leakage current in semiconductor devices

    Energy Technology Data Exchange (ETDEWEB)

    Lu, Bin; Matioli, Elison de Nazareth; Palacios, Tomas Apostol

    2018-03-06

    A semiconductor device includes a first region having a first semiconductor material and a second region having a second semiconductor material. The second region is formed over the first region. The semiconductor device also includes a current blocking structure formed in the first region between first and second terminals of the semiconductor device. The current blocking structure is configured to reduce current flow in the first region between the first and second terminals.

  13. Optical orientation in ferromagnet/semiconductor hybrids

    International Nuclear Information System (INIS)

    Korenev, V L

    2008-01-01

    The physics of optical pumping of semiconductor electrons in ferromagnet/semiconductor hybrids is discussed. Optically oriented semiconductor electrons detect the magnetic state of a ferromagnetic film. In turn, the ferromagnetism of the hybrid can be controlled optically with the help of a semiconductor. Spin–spin interactions near the ferromagnet/semiconductor interface play a crucial role in the optical readout and the manipulation of ferromagnetism

  14. Optical orientation in ferromagnet/semiconductor hybrids

    Science.gov (United States)

    Korenev, V. L.

    2008-11-01

    The physics of optical pumping of semiconductor electrons in ferromagnet/semiconductor hybrids is discussed. Optically oriented semiconductor electrons detect the magnetic state of a ferromagnetic film. In turn, the ferromagnetism of the hybrid can be controlled optically with the help of a semiconductor. Spin-spin interactions near the ferromagnet/semiconductor interface play a crucial role in the optical readout and the manipulation of ferromagnetism.

  15. Optical Orientation in Ferromagnet/Semiconductor Hybrids

    OpenAIRE

    Korenev, V. L.

    2008-01-01

    The physics of optical pumping of semiconductor electrons in the ferromagnet/semiconductor hybrids is discussed. Optically oriented semiconductor electrons detect the magnetic state of the ferromagnetic film. In turn, the ferromagnetism of the hybrid can be controlled optically with the help of the semiconductor. Spin-spin interactions near the interface ferromagnet/semiconductor play crucial role in the optical readout and the manipulation of ferromagnetism.

  16. Dry-cleaning of graphene

    International Nuclear Information System (INIS)

    Algara-Siller, Gerardo; Lehtinen, Ossi; Kaiser, Ute; Turchanin, Andrey

    2014-01-01

    Studies of the structural and electronic properties of graphene in its pristine state are hindered by hydrocarbon contamination on the surfaces. Also, in many applications, contamination reduces the performance of graphene. Contamination is introduced during sample preparation and is adsorbed also directly from air. Here, we report on the development of a simple dry-cleaning method for producing large atomically clean areas in free-standing graphene. The cleanness of graphene is proven using aberration-corrected high-resolution transmission electron microscopy and electron spectroscopy

  17. Dry-cleaning of graphene

    Energy Technology Data Exchange (ETDEWEB)

    Algara-Siller, Gerardo [Central Facility for Electron Microscopy, Group of Electron Microscopy of Materials Science, Ulm University, Albert-Einstein-Allee 11, Ulm 89081 (Germany); Department of Chemistry, Technical University Ilmenau, Weimarer Strasse 25, Ilmenau 98693 (Germany); Lehtinen, Ossi; Kaiser, Ute, E-mail: ute.kaiser@uni-ulm.de [Central Facility for Electron Microscopy, Group of Electron Microscopy of Materials Science, Ulm University, Albert-Einstein-Allee 11, Ulm 89081 (Germany); Turchanin, Andrey [Faculty of Physics, University of Bielefeld, Universitätsstr. 25, Bielefeld 33615 (Germany)

    2014-04-14

    Studies of the structural and electronic properties of graphene in its pristine state are hindered by hydrocarbon contamination on the surfaces. Also, in many applications, contamination reduces the performance of graphene. Contamination is introduced during sample preparation and is adsorbed also directly from air. Here, we report on the development of a simple dry-cleaning method for producing large atomically clean areas in free-standing graphene. The cleanness of graphene is proven using aberration-corrected high-resolution transmission electron microscopy and electron spectroscopy.

  18. Semiconductors for plasmonics and metamaterials

    DEFF Research Database (Denmark)

    Naik, G.V.; Boltasseva, Alexandra

    2010-01-01

    Plasmonics has conventionally been in the realm of metal-optics. However, conventional metals as plasmonic elements in the near-infrared (NIR) and visible spectral ranges suffer from problems such as large losses and incompatibility with semiconductor technology. Replacing metals with semiconduct......Plasmonics has conventionally been in the realm of metal-optics. However, conventional metals as plasmonic elements in the near-infrared (NIR) and visible spectral ranges suffer from problems such as large losses and incompatibility with semiconductor technology. Replacing metals...... with semiconductors can alleviate these problems if only semiconductors could exhibit negative real permittivity. Aluminum doped zinc oxide (AZO) is a low loss semiconductor that can show negative real permittivity in the NIR. A comparative assessment of AZO-based plasmonic devices such as superlens and hyperlens...... with their metal-based counterparts shows that AZO-based devices significantly outperform at a wavelength of 1.55 µm. This provides a strong stimulus in turning to semiconductor plasmonics at the telecommunication wavelengths. (© 2010 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim)....

  19. Ripening of Semiconductor Nanoplatelets.

    Science.gov (United States)

    Ott, Florian D; Riedinger, Andreas; Ochsenbein, David R; Knüsel, Philippe N; Erwin, Steven C; Mazzotti, Marco; Norris, David J

    2017-11-08

    Ostwald ripening describes how the size distribution of colloidal particles evolves with time due to thermodynamic driving forces. Typically, small particles shrink and provide material to larger particles, which leads to size defocusing. Semiconductor nanoplatelets, thin quasi-two-dimensional (2D) particles with thicknesses of only a few atomic layers but larger lateral dimensions, offer a unique system to investigate this phenomenon. Experiments show that the distribution of nanoplatelet thicknesses does not defocus during ripening, but instead jumps sequentially from m to (m + 1) monolayers, allowing precise thickness control. We investigate how this counterintuitive process occurs in CdSe nanoplatelets. We develop a microscopic model that treats the kinetics and thermodynamics of attachment and detachment of monomers as a function of their concentration. We then simulate the growth process from nucleation through ripening. For a given thickness, we observe Ostwald ripening in the lateral direction, but none perpendicular. Thicker populations arise instead from nuclei that capture material from thinner nanoplatelets as they dissolve laterally. Optical experiments that attempt to track the thickness and lateral extent of nanoplatelets during ripening appear consistent with these conclusions. Understanding such effects can lead to better synthetic control, enabling further exploration of quasi-2D nanomaterials.

  20. A semiconductor laser device

    Energy Technology Data Exchange (ETDEWEB)

    Takaro, K.; Naoki, T.; Satosi, K.; Yasutosi, K.

    1984-03-17

    A device is proposed which makes it possible to obtain single vertical mode emission in the absence of noise. Noise suppression is achieved by a method which determines the relationship between the donor densities in the second and third layers of an n type semiconductor laser, and the total output optical emission of layers with respect to the emission from the entire laser. The device consists of a photoresist film with a window applied to a 100 GaAs n type conductivity substrate using a standard method. Chemical etching through this window in the substrate is used to generate a slot approximately 1 micrometer in size. After the photoresist film is removed, the following layers are deposited from the liquid phase onto the substrate in the sequence indicated: a telurium doped protective layer of n type AlxGa(1-x) As; 2) an undoped active p type AlyGa(1-6) As layer and a tellurium doped upper protective n type conductivity GaAs layer.

  1. Semiconductor integrated circuits

    International Nuclear Information System (INIS)

    Michel, A.E.; Schwenker, R.O.; Ziegler, J.F.

    1979-01-01

    An improved method involving ion implantation to form non-epitaxial semiconductor integrated circuits. These are made by forming a silicon substrate of one conductivity type with a recessed silicon dioxide region extending into the substrate and enclosing a portion of the silicon substrate. A beam of ions of opposite conductivity type impurity is directed at the substrate at an energy and dosage level sufficient to form a first region of opposite conductivity within the silicon dioxide region. This impurity having a concentration peak below the surface of the substrate forms a region of the one conductivity type which extends from the substrate surface into the first opposite type region to a depth between the concentration peak and the surface and forms a second region of opposite conductivity type. The method, materials and ion beam conditions are detailed. Vertical bipolar integrated circuits can be made this way when the first opposite type conductivity region will function as a collector. Also circuits with inverted bipolar devices when this first region functions as a 'buried'' emitter region. (U.K.)

  2. Impurity gettering in semiconductors

    Science.gov (United States)

    Sopori, Bhushan L.

    1995-01-01

    A process for impurity gettering in a semiconductor substrate or device such as a silicon substrate or device. The process comprises hydrogenating the substrate or device at the back side thereof with sufficient intensity and for a time period sufficient to produce a damaged back side. Thereafter, the substrate or device is illuminated with electromagnetic radiation at an intensity and for a time period sufficient to cause the impurities to diffuse to the back side and alloy with a metal there present to form a contact and capture the impurities. The impurity gettering process also can function to simultaneously passivate defects within the substrate or device, with the defects likewise diffusing to the back side for simultaneous passivation. Simultaneously, substantially all hydrogen-induced damage on the back side of the substrate or device is likewise annihilated. Also taught is an alternate process comprising thermal treatment after hydrogenation of the substrate or device at a temperature of from about 500.degree. C. to about 700.degree. C. for a time period sufficient to cause the impurities to diffuse to the damaged back side thereof for subsequent capture by an alloying metal.

  3. Semiconductor acceleration sensor

    Science.gov (United States)

    Ueyanagi, Katsumichi; Kobayashi, Mitsuo; Goto, Tomoaki

    1996-09-01

    This paper reports a practical semiconductor acceleration sensor especially suited for automotive air bag systems. The acceleration sensor includes four beams arranged in a swastika structure. Two piezoresistors are formed on each beam. These eight piezoresistors constitute a Wheatstone bridge. The swastika structure of the sensing elements, an upper glass plate and a lower glass plate exhibit the squeeze film effect which enhances air dumping, by which the constituent silicon is prevented from breakdown. The present acceleration sensor has the following features. The acceleration force component perpendicular to the sensing direction can be cancelled. The cross-axis sensitivity is less than 3 percent. And, the erroneous offset caused by the differences between the thermal expansion coefficients of the constituent materials can be canceled. The high aspect ratio configuration realized by plasma etching facilitates reducing the dimensions and improving the sensitivity of the acceleration sensor. The present acceleration sensor is 3.9 mm by 3.9 mm in area and 1.2 mm in thickness. The present acceleration sensor can measure from -50 to +50 G with sensitivity of 0.275 mV/G and with non-linearity of less than 1 percent. The acceleration sensor withstands shock of 3000 G.

  4. Solar photocatalytic cleaning of polluted water. Solare Reinigung verschmutzter Waesser mittels Photokatalyse

    Energy Technology Data Exchange (ETDEWEB)

    Bockelmann, D

    1994-01-01

    Alternatively to biological, physical and chemical methods of waste water cleaning, photocatalysis can be employed. In this residue-free method, titanium dioxide particles are brought into contact with polluted water as photocatalysts. Under UV irradiation at wave-lengths below 400 nm, change carriers are generated in the semiconductor particles that act so intensely oxidizing as to completely degrade almost all organic pollutants in waste water. In this process, the ultra-violet part of the solar spectrum can be harnessed to generate oxidation equivalents. Thus, solar photocatalytic waste water cleaning is excellently suited for developing countries. (BWI)

  5. Hazardous materials package performance regulations

    International Nuclear Information System (INIS)

    Russell, N.A.; Glass, R.E.; McClure, J.D.; Finley, N.C.

    1992-01-01

    The hazardous materials (hazmat) packaging development and certification process is currently defined by two different regulatory philosophies, one based on specification packagings and the other based on performance standards. With specification packagings, a packaging is constructed according to an agreed set of design specifications. In contrast, performance standards do not specify the packaging design; they specify performance standards that a packaging design must be able to pass before it can be certified for transport. The packaging can be designed according to individual needs as long as it meets these performance standards. Performance standards have been used nationally and internationally for about 40 years to certify radioactive materials (RAM) packagings. It is reasonable to state that for RAM transport, performance specifications have maintained transport safety. A committee of United Nation's experts recommended the performance standard philosophy as the preferred regulation method for hazmat packaging. Performance standards for hazmat packagings smaller than 118 gallons have been adopted in 49CFR178. Packagings for materials that are classified as toxic-by-inhalation must comply with the performance standards by October 1, 1993, and packagings for all other classes of hazardous materials covered must comply by October 1, 1996. For packages containing bulk (in excess of 188 gallons) quantities of materials that are extremely toxic by inhalation, there currently are no performance requirements. This paper discusses a Hazmat Packaging Performance Evaluation (HPPE) project to look at the subset of bulk packagings that are larger than 2000 gallons. The objectives of this project are the evaluate current hazmat specification packagings and develop supporting documentation for determining performance requirements for packagings in excess of 2000 gallons that transport hazardous materials that have been classified as extremely toxic by inhalation (METBI)

  6. In-Package Chemistry Abstraction

    Energy Technology Data Exchange (ETDEWEB)

    P.S. Domski

    2003-07-21

    The work associated with the development of this model report was performed in accordance with the requirements established in ''Technical Work Plan for Waste Form Degradation Modeling, Testing, and Analyses in Support of SR and LA'' (BSC 2002a). The in-package chemistry model and in-package chemistry model abstraction are developed to predict the bulk chemistry inside of a failed waste package and to provide simplified expressions of that chemistry. The purpose of this work is to provide the abstraction model to the Performance Assessment Project and the Waste Form Department for development of geochemical models of the waste package interior. The scope of this model report is to describe the development and validation of the in-package chemistry model and in-package chemistry model abstraction. The in-package chemistry model will consider chemical interactions of water with the waste package materials and the waste form for commercial spent nuclear fuel (CSNF) and codisposed high-level waste glass (HLWG) and N Reactor spent fuel (CDNR). The in-package chemistry model includes two sub-models, the first a water vapor condensation (WVC) model, where water enters a waste package as vapor and forms a film on the waste package components with subsequent film reactions with the waste package materials and waste form--this is a no-flow model, the reacted fluids do not exit the waste package via advection. The second sub-model of the in-package chemistry model is the seepage dripping model (SDM), where water, water that may have seeped into the repository from the surrounding rock, enters a failed waste package and reacts with the waste package components and waste form, and then exits the waste package with no accumulation of reacted water in the waste package. Both of the submodels of the in-package chemistry model are film models in contrast to past in-package chemistry models where all of the waste package pore space was filled with water. The

  7. In-Package Chemistry Abstraction

    International Nuclear Information System (INIS)

    P.S. Domski

    2003-01-01

    The work associated with the development of this model report was performed in accordance with the requirements established in ''Technical Work Plan for Waste Form Degradation Modeling, Testing, and Analyses in Support of SR and LA'' (BSC 2002a). The in-package chemistry model and in-package chemistry model abstraction are developed to predict the bulk chemistry inside of a failed waste package and to provide simplified expressions of that chemistry. The purpose of this work is to provide the abstraction model to the Performance Assessment Project and the Waste Form Department for development of geochemical models of the waste package interior. The scope of this model report is to describe the development and validation of the in-package chemistry model and in-package chemistry model abstraction. The in-package chemistry model will consider chemical interactions of water with the waste package materials and the waste form for commercial spent nuclear fuel (CSNF) and codisposed high-level waste glass (HLWG) and N Reactor spent fuel (CDNR). The in-package chemistry model includes two sub-models, the first a water vapor condensation (WVC) model, where water enters a waste package as vapor and forms a film on the waste package components with subsequent film reactions with the waste package materials and waste form--this is a no-flow model, the reacted fluids do not exit the waste package via advection. The second sub-model of the in-package chemistry model is the seepage dripping model (SDM), where water, water that may have seeped into the repository from the surrounding rock, enters a failed waste package and reacts with the waste package components and waste form, and then exits the waste package with no accumulation of reacted water in the waste package. Both of the submodels of the in-package chemistry model are film models in contrast to past in-package chemistry models where all of the waste package pore space was filled with water. The current in-package

  8. Packaging design criteria for the Hanford Ecorok Packaging

    International Nuclear Information System (INIS)

    Mercado, M.S.

    1996-01-01

    The Hanford Ecorok Packaging (HEP) will be used to ship contaminated water purification filters from K Basins to the Central Waste Complex. This packaging design criteria documents the design of the HEP, its intended use, and the transportation safety criteria it is required to meet. This information will serve as a basis for the safety analysis report for packaging

  9. Tracking Clean Energy Progress 2013

    Energy Technology Data Exchange (ETDEWEB)

    NONE

    2013-06-01

    Tracking Clean Energy Progress 2013 (TCEP 2013) examines progress in the development and deployment of key clean energy technologies. Each technology and sector is tracked against interim 2020 targets in the IEA Energy Technology Perspectives 2012 2°C scenario, which lays out pathways to a sustainable energy system in 2050. Stark message emerge: progress has not been fast enough; large market failures are preventing clean energy solutions from being taken up; considerable energy efficiency remains untapped; policies need to better address the energy system as a whole; and energy-related research, development and demonstration need to accelerate. Alongside these grim conclusions there is positive news. In 2012, hybrid-electric vehicle sales passed the 1 million mark. Solar photovoltaic systems were being installed at a record pace. The costs of most clean energy technologies fell more rapidly than anticipated.

  10. Uniquely Strongly Clean Group Rings

    Institute of Scientific and Technical Information of China (English)

    WANG XIU-LAN

    2012-01-01

    A ring R is called clean if every element is the sum of an idempotent and a unit,and R is called uniquely strongly clean (USC for short) if every element is uniquely the sum of an idempotent and a unit that commute.In this article,some conditions on a ring R and a group G such that RG is clean are given.It is also shown that if G is a locally finite group,then the group ring RG is USC if and only if R is USC,and G is a 2-group.The left uniquely exchange group ring,as a middle ring of the uniquely clean ring and the USC ring,does not possess this property,and so does the uniquely exchange group ring.

  11. Emulsion type dry cleaning system

    International Nuclear Information System (INIS)

    Kohanawa, Osamu; Matsumoto, Hiroyo.

    1988-01-01

    Protective clothing against radioactive contamination used in the radiation controlled areas of nuclear plants has been washed by the same wet washing as used for underwear washing, but recently dry cleaning is getting used in place of wet washing, which generates a large quantity of laundry drain. However, it was required to use wet washing once every five to ten dry cleanings for washing protective clothing, because conventional dry cleaning is less effective in removing water-soluble soils. Therefore, in order to eliminate wet washing, and to decrease the quantity of laundry drains, the emulsion type dry cleaning system capable of removing both oil-soluble and water-soluble soils at a time has been developed. The results of developmental experiments and actual application are presented in this paper. (author)

  12. A photoemission study of interfaces between organic semiconductors and Co as well as Al2O3/Co contacts

    NARCIS (Netherlands)

    Grobosch, M.; Schmidt, C.; Naber, W.J.M.; van der Wiel, Wilfred Gerard; Knupfer, M.

    We have studied the energy-level alignment of ex situ, acetone cleaned Co and Al2O3/Co contacts to the organic semiconductors pentacene and rubrene by combined X-ray and ultraviolet photoemission spectroscopy. Our results demonstrate that the work function under these conditions is smaller than in

  13. Efficient methods of piping cleaning

    Directory of Open Access Journals (Sweden)

    Orlov Vladimir Aleksandrovich

    2014-01-01

    Full Text Available The article contains the analysis of the efficient methods of piping cleaning of water supply and sanitation systems. Special attention is paid to the ice cleaning method, in course of which biological foil and various mineral and organic deposits are removed due to the ice crust buildup on the inner surface of water supply and drainage pipes. These impurities are responsible for the deterioration of the organoleptic properties of the transported drinking water or narrowing cross-section of drainage pipes. The co-authors emphasize that the use of ice compared to other methods of pipe cleaning has a number of advantages due to the relative simplicity and cheapness of the process, economical efficiency and lack of environmental risk. The equipment for performing ice cleaning is presented, its technological options, terms of cleansing operations, as well as the volumes of disposed pollution per unit length of the water supply and drainage pipelines. It is noted that ice cleaning requires careful planning in the process of cooking ice and in the process of its supply in the pipe. There are specific requirements to its quality. In particular, when you clean drinking water system the ice applied should be hygienically clean and meet sanitary requirements.In pilot projects, in particular, quantitative and qualitative analysis of sediments adsorbed by ice is conducted, as well as temperature and the duration of the process. The degree of pollution of the pipeline was estimated by the volume of the remote sediment on 1 km of pipeline. Cleaning pipelines using ice can be considered one of the methods of trenchless technologies, being a significant alternative to traditional methods of cleaning the pipes. The method can be applied in urban pipeline systems of drinking water supply for the diameters of 100—600 mm, and also to diversion collectors. In the world today 450 km of pipelines are subject to ice cleaning method.Ice cleaning method is simple

  14. Reliability test and failure analysis of high power LED packages

    International Nuclear Information System (INIS)

    Chen Zhaohui; Zhang Qin; Wang Kai; Luo Xiaobing; Liu Sheng

    2011-01-01

    A new type application specific light emitting diode (LED) package (ASLP) with freeform polycarbonate lens for street lighting is developed, whose manufacturing processes are compatible with a typical LED packaging process. The reliability test methods and failure criterions from different vendors are reviewed and compared. It is found that test methods and failure criterions are quite different. The rapid reliability assessment standards are urgently needed for the LED industry. 85 0 C/85 RH with 700 mA is used to test our LED modules with three other vendors for 1000 h, showing no visible degradation in optical performance for our modules, with two other vendors showing significant degradation. Some failure analysis methods such as C-SAM, Nano X-ray CT and optical microscope are used for LED packages. Some failure mechanisms such as delaminations and cracks are detected in the LED packages after the accelerated reliability testing. The finite element simulation method is helpful for the failure analysis and design of the reliability of the LED packaging. One example is used to show one currently used module in industry is vulnerable and may not easily pass the harsh thermal cycle testing. (semiconductor devices)

  15. Clean Energy Solutions Center (Presentation)

    Energy Technology Data Exchange (ETDEWEB)

    Reategui, S.

    2012-07-01

    The Clean Energy Ministerial launched the Clean Energy Solutions Center in April, 2011 for major economy countries, led by Australia and U.S. with other CEM partners. Partnership with UN-Energy is extending scope to support all developing countries: 1. Enhance resources on policies relating to energy access, small to medium enterprises (SMEs), and financing programs; 2. Offer expert policy assistance to all countries; 3. Expand peer to peer learning, training, and deployment and policy data for developing countries.

  16. Clean Energy Application Center

    Energy Technology Data Exchange (ETDEWEB)

    Freihaut, Jim [Pennsylvania State Univ., University Park, PA (United States)

    2013-09-30

    The Mid Atlantic Clean Energy Application Center (MACEAC), managed by The Penn State College of Engineering, serves the six states in the Mid-Atlantic region (Pennsylvania, New Jersey, Delaware, Maryland, Virginia and West Virginia) plus the District of Columbia. The goals of the Mid-Atlantic CEAC are to promote the adoption of Combined Heat and Power (CHP), Waste Heat Recovery (WHR) and District Energy Systems (DES) in the Mid Atlantic area through education and technical support to more than 1,200 regional industry and government representatives in the region. The successful promotion of these technologies by the MACEAC was accomplished through the following efforts; (1)The MACEAC developed a series of technology transfer networks with State energy and environmental offices, Association of Energy Engineers local chapters, local community development organizations, utilities and, Penn State Department of Architectural Engineering alumni and their firms to effectively educate local practitioners about the energy utilization, environmental and economic advantages of CHP, WHR and DES; (2) Completed assessments of the regional technical and market potential for CHP, WHR and DE technologies application in the context of state specific energy prices, state energy and efficiency portfolio development. The studies were completed for Pennsylvania, New Jersey and Maryland and included a set of incentive adoption probability models used as a to guide during implementation discussions with State energy policy makers; (3) Using the technical and market assessments and adoption incentive models, the Mid Atlantic CEAC developed regional strategic action plans for the promotion of CHP Application technology for Pennsylvania, New Jersey and Maryland; (4) The CHP market assessment and incentive adoption model information was discussed, on a continuing basis, with relevant state agencies, policy makers and Public Utility Commission organizations resulting in CHP favorable incentive

  17. Dual Use Packaging, Phase I

    Data.gov (United States)

    National Aeronautics and Space Administration — NASA seeks down-weighted packaging compatible with microwave preparation and perhaps high hydrostatic pressure processing. New packaging must satisfy NASA's 3-year...

  18. Food packaging history and innovations.

    Science.gov (United States)

    Risch, Sara J

    2009-09-23

    Food packaging has evolved from simply a container to hold food to something today that can play an active role in food quality. Many packages are still simply containers, but they have properties that have been developed to protect the food. These include barriers to oxygen, moisture, and flavors. Active packaging, or that which plays an active role in food quality, includes some microwave packaging as well as packaging that has absorbers built in to remove oxygen from the atmosphere surrounding the product or to provide antimicrobials to the surface of the food. Packaging has allowed access to many foods year-round that otherwise could not be preserved. It is interesting to note that some packages have actually allowed the creation of new categories in the supermarket. Examples include microwave popcorn and fresh-cut produce, which owe their existence to the unique packaging that has been developed.

  19. A new cleaning process for the metallic contaminants on a post-CMP wafer's surface

    International Nuclear Information System (INIS)

    Gao Baohong; Liu Yuling; Wang Chenwei; Wang Shengli; Zhou Qiang; Tan Baimei; Zhu Yadong

    2010-01-01

    This paper presents a new cleaning process using boron-doped diamond (BDD) film anode electrochemical oxidation for metallic contaminants on polished silicon wafer surfaces. The BDD film anode electrochemical oxidation can efficiently prepare pyrophosphate peroxide, pyrophosphate peroxide can oxidize organic contaminants, and pyrophosphate peroxide is deoxidized into pyrophosphate. Pyrophosphate, a good complexing agent, can form a metal complex, which is a structure consisting of a copper ion, bonded to a surrounding array of two pyrophosphate anions. Three polished wafers were immersed in the 0.01 mol/L CuSO 4 solution for 2 h in order to make comparative experiments. The first one was cleaned by pyrophosphate peroxide, the second by RCA (Radio Corporation of America) cleaning, and the third by deionized (DI) water. The XPS measurement result shows that the metallic contaminants on wafers cleaned by the RCA method and by pyrophosphate peroxide is less than the XPS detection limits of 1 ppm. And the wafer's surface cleaned by pyrophosphate peroxide is more efficient in removing organic carbon residues than RCA cleaning. Therefore, BDD film anode electrochemical oxidation can be used for microelectronics cleaning, and it can effectively remove organic contaminants and metallic contaminants in one step. It also achieves energy saving and environmental protection. (semiconductor technology)

  20. Tools for Predicting Cleaning Efficiency in the LHC

    CERN Document Server

    Assmann, R W; Brugger, M; Hayes, M; Jeanneret, J B; Kain, V; Kaltchev, D I; Schmidt, F

    2003-01-01

    The computer codes SIXTRACK and DIMAD have been upgraded to include realistic models of proton scattering in collimator jaws, mechanical aperture restrictions, and time-dependent fields. These new tools complement long-existing simplified linear tracking programs used up to now for tracking with collimators. Scattering routines from STRUCT and K2 have been compared with one another and the results have been cross-checked to the FLUKA Monte Carlo package. A systematic error is assigned to the predictions of cleaning efficiency. Now, predictions of the cleaning efficiency are possible with a full LHC model, including chromatic effects, linear and nonlinear errors, beam-beam kicks and associated diffusion, and time-dependent fields. The beam loss can be predicted around the ring, both for regular and irregular beam losses. Examples are presented.

  1. Discharge cleaning for a tokamak

    International Nuclear Information System (INIS)

    Ishii, Shigeyuki

    1983-01-01

    Various methods of discharge cleaning for tokamaks are described. The material of the first walls of tokamaks is usually stainless steel, inconel, titanium and so on. Hydrogen is exclusively used as the discharge gas. Glow discharge cleaning (GDC), Taylor discharge cleaning (TDC), and electron cyclotron resonance discharge cleaning (ECR-DC) are discussed in this paper. The cleaning by GDC is made by moving a movable anode to the center of a tokamak vassel. Taylor found the good cleaning effect of induced discharge by high pressure and low power discharge. This is called TDC. When the frequency of high frequency discharge in a magnetic field is equal to that of the electron cyclotron resonance, the break down potential is lowered if the pressure is sufficiently low. The ECR-CD is made by using this effect. In TDC and ECR-DC, the electron temperature, which has a close relation to the production rate of H 0 , can be controlled by the pressure. In GDC, the operating pressure was improved by the radio frequency glow (RG) method. However, there is still the danger of arcing. In case of GDC and ECR-DC, the position of plasma can be controlled, but not in case of TDC. The TDC is accepted by most of takamak devices in the world. (Kato, T.)

  2. Gas plant cleaning case history

    Energy Technology Data Exchange (ETDEWEB)

    Woods, B

    1971-03-22

    Basic steps to be taken before using any cleaning method are select a responsible group and give it full responsibility; know the problem, what type of fouling, lab samples, amount of material, time and cost; sell the idea to management; maintain the cleaning equipment; and follow up each cleaning operation. These principles have been applied to advantage in the amine contractor at Taylor, a vessel 60 ft high with 78-in. OD, containing carbon steel deck trays with stainless steel caps. The original attempt to clean with wire scrapers manually involved much lost time and several crews. There was limited space in the tray vessels, design created areas difficult to clean, working conditions were unpleasant, equipment downtime was extended, labor cost was high, and the final result was not satisfactory. Chemical cleaning was substituted, preceded by a water wash. Five hours of caustic wash with a 3% solution at 170$F were followed by a water wash, an acid wash, 1-hr neutralization with a weak soda ash solution, and finally passivation to eliminate iron oxide. For the acid wash, sulfamic acid was found best, in 10% concentration for 4 hr. Cascading was most economical, but flooding has been employed sometimes at 2-1/2 times the cost, to reach all the dark corners.

  3. Measures of International Manufacturing and Trade of Clean Energy Technologies

    Energy Technology Data Exchange (ETDEWEB)

    Engel-Cox, Jill; Sandor, Debbie; Keyser, David; Mann, Margaret

    2017-05-25

    The technologies that produce clean energy, such as solar photovoltaic panels and lithium ion batteries for electric vehicles, are globally manufactured and traded. As demand and deployment of these technologies grows exponentially, the innovation to reach significant economies of scale and drive down energy production costs becomes less in the technology and more in the manufacturing of the technology. Manufacturing innovations and other manufacturing decisions can reduce costs of labor, materials, equipment, operating costs, and transportation, across all the links in the supply chain. To better understand the manufacturing aspect of the clean energy economy, we have developed key metrics for systematically measuring and benchmarking international manufacturing of clean energy technologies. The metrics are: trade, market size, manufacturing value-added, and manufacturing capacity and production. These metrics were applied to twelve global economies and four representative technologies: wind turbine components, crystalline silicon solar photovoltaic modules, vehicle lithium ion battery cells, and light emitting diode packages for efficient lighting and other consumer products. The results indicated that clean energy technologies are being developed via complex, dynamic, and global supply chains, with individual economies benefiting from different technologies and links in the supply chain, through both domestic manufacturing and global trade.

  4. Semiconductor lasers stability, instability and chaos

    CERN Document Server

    Ohtsubo, Junji

    2017-01-01

    This book describes the fascinating recent advances made concerning the chaos, stability and instability of semiconductor lasers, and discusses their applications and future prospects in detail. It emphasizes the dynamics in semiconductor lasers by optical and electronic feedback, optical injection, and injection current modulation. Applications of semiconductor laser chaos, control and noise, and semiconductor lasers are also demonstrated. Semiconductor lasers with new structures, such as vertical-cavity surface-emitting lasers and broad-area semiconductor lasers, are intriguing and promising devices. Current topics include fast physical number generation using chaotic semiconductor lasers for secure communication, development of chaos, quantum-dot semiconductor lasers and quantum-cascade semiconductor lasers, and vertical-cavity surface-emitting lasers. This fourth edition has been significantly expanded to reflect the latest developments. The fundamental theory of laser chaos and the chaotic dynamics in se...

  5. Fair Package Assignment

    Science.gov (United States)

    Lahaie, Sébastien; Parkes, David C.

    We consider the problem of fair allocation in the package assignment model, where a set of indivisible items, held by single seller, must be efficiently allocated to agents with quasi-linear utilities. A fair assignment is one that is efficient and envy-free. We consider a model where bidders have superadditive valuations, meaning that items are pure complements. Our central result is that core outcomes are fair and even coalition-fair over this domain, while fair distributions may not even exist for general valuations. Of relevance to auction design, we also establish that the core is equivalent to the set of anonymous-price competitive equilibria, and that superadditive valuations are a maximal domain that guarantees the existence of anonymous-price competitive equilibrium. Our results are analogs of core equivalence results for linear prices in the standard assignment model, and for nonlinear, non-anonymous prices in the package assignment model with general valuations.

  6. Anticounterfeit packaging technologies

    Directory of Open Access Journals (Sweden)

    Ruchir Y Shah

    2010-01-01

    Full Text Available Packaging is the coordinated system that encloses and protects the dosage form. Counterfeit drugs are the major cause of morbidity, mortality, and failure of public interest in the healthcare system. High price and well-known brands make the pharma market most vulnerable, which accounts for top priority cardiovascular, obesity, and antihyperlipidemic drugs and drugs like sildenafil. Packaging includes overt and covert technologies like barcodes, holograms, sealing tapes, and radio frequency identification devices to preserve the integrity of the pharmaceutical product. But till date all the available techniques are synthetic and although provide considerable protection against counterfeiting, have certain limitations which can be overcome by the application of natural approaches and utilization of the principles of nanotechnology.

  7. Package materials, waste form

    International Nuclear Information System (INIS)

    Anon.

    1980-01-01

    The schedules for waste package development for the various host rocks were presented. The waste form subtask activities were reviewed, with the papers focusing on high-level waste, transuranic waste, and spent fuel. The following ten papers were presented: (1) Waste Package Development Approach; (2) Borosilicate Glass as a Matrix for Savannah River Plant Waste; (3) Development of Alternative High-Level Waste Forms; (4) Overview of the Transuranic Waste Management Program; (5) Assessment of the Impacts of Spent Fuel Disassembly - Alternatives on the Nuclear Waste Isolation System; (6) Reactions of Spent Fuel and Reprocessing Waste Forms with Water in the Presence of Basalt; (7) Spent Fuel Stabilizer Screening Studies; (8) Chemical Interactions of Shale Rock, Prototype Waste Forms, and Prototype Canister Metals in a Simulated Wet Repository Environment; (9) Impact of Fission Gas and Volatiles on Spent Fuel During Geologic Disposal; and (10) Spent Fuel Assembly Decay Heat Measurement and Analysis

  8. RH Packaging Program Guidance

    International Nuclear Information System (INIS)

    Washington TRU Solutions, LLC

    2003-01-01

    The purpose of this program guidance document is to provide technical requirements for use, operation, inspection, and maintenance of the RH-TRU 72-B Waste Shipping Package and directly related components. This document complies with the requirements as specified in the RH-TRU 72-B Safety Analysis Report for Packaging (SARP), and Nuclear Regulatory Commission (NRC) Certificate of Compliance (C of C) 9212. If there is a conflict between this document and the SARP and/or C of C, the SARP and/or C of C shall govern. The C of C states: ''...each package must be prepared for shipment and operated in accordance with the procedures described in Chapter 7.0, ''Operating Procedures,'' of the application.'' It further states: ''...each package must be tested and maintained in accordance with the procedures described in Chapter 8.0, ''Acceptance Tests and Maintenance Program of the Application.'' Chapter 9.0 of the SARP tasks the Waste Isolation Pilot Plant (WIPP) Management and Operating (M and O) contractor with assuring the packaging is used in accordance with the requirements of the C of C. Because the packaging is NRC approved, users need to be familiar with 10 CFR (section) 71.11, ''Deliberate Misconduct.'' Any time a user suspects or has indications that the conditions of approval in the C of C were not met, the Carlsbad Field Office (CBFO) shall be notified immediately. CBFO will evaluate the issue and notify the NRC if required. This document details the instructions to be followed to operate, maintain, and test the RH-TRU 72-B packaging. This Program Guidance standardizes instructions for all users. Users shall follow these instructions. Following these instructions assures that operations are safe and meet the requirements of the SARP. This document is available on the Internet at: ttp://www.ws/library/t2omi/t2omi.htm. Users are responsible for ensuring they are using the current revision and change notices. Sites may prepare their own document using the word

  9. Irradiation of packaged food

    International Nuclear Information System (INIS)

    Kilcast, D.

    1990-01-01

    Food irradiation is used to improve the safety of food by killing insects and microorganisms, to inhibit sprouting in crops such as onions and potatoes and to control ripening in agricultural produce. In order to prevent re-infestation and re-contamination it is essential that the food is suitably packed. Consequently, the packaging material is irradiated whilst in contact with the food, and it is important that the material is resistant to radiation-induced changes. In this paper the nature of the irradiation process is reviewed briefly, together with the known effects of irradiation on packaging materials and their implications for the effective application of food irradiation. Recent research carried out at the Leatherhead Food RA on the possibility of taint transfer into food is described. (author)

  10. Technology transfer packages

    International Nuclear Information System (INIS)

    Mizon, G.A.; Bleasdale, P.A.

    1994-01-01

    Nuclear power is firmly established in many developed countries'energy policies and is being adopted by emerging nations as an attractive way of gaining energy self sufficiency. The early users of nuclear power had to develop the technology that they needed, which now, through increasing world wide experience, has been rationalised to meet demanding economic and environmental pressures. These justifiable pressures, can lead to existing suppliers of nuclear services to consider changing to more appropriate technologies and for new suppliers to consider licensing proven technology rather then incurring the cost of developing new alternatives. The transfer of technology, under license, is made more straight forward if the owner conveniently groups appropriate technology into packages. This paper gives examples of 'Technology Packages' and suggests criteria for the specification, selection and contractual requirements to ensure successful licensing

  11. Ultrasonic cleaning of conveyor belt materials using Listeria monocytogenes as a model organism.

    Science.gov (United States)

    Tolvanén, Riina; Lunden, Janne; Korkeala, Hannu; Wirtanen, Gun

    2007-03-01

    Persistent Listeria monocytogenes contamination of food industry equipment is a difficult problem to solve. Ultrasonic cleaning offers new possibilities for cleaning conveyors and other equipment that are not easy to clean. Ultrasonic cleaning was tested on three conveyor belt materials: polypropylene, acetal, and stainless steel (cold-rolled, AISI 304). Cleaning efficiency was tested at two temperatures (30 and 45 degrees C) and two cleaning times (30 and 60 s) with two cleaning detergents (KOH, and NaOH combined with KOH). Conveyor belt materials were soiled with milk-based soil and L. monocytogenes strains V1, V3, and B9, and then incubated for 72 h to attach bacteria to surfaces. Ultrasonic cleaning treatments reduced L. monocytogenes counts on stainless steel 4.61 to 5.90 log units; on acetal, 3.37 to 5.55 log units; and on polypropylene, 2.31 to 4.40 log units. The logarithmic reduction differences were statistically analyzed by analysis of variance using Statistical Package for the Social Sciences software. The logarithmic reduction was significantly greater in stainless steel than in plastic materials (P conveyor belt materials.

  12. Amdahl 470 Chip Package

    CERN Multimedia

    1975-01-01

    In the late 70s the larger IBM computers were water cooled. Amdahl, an IBM competitor, invented an air cooling technology for it's computers. His company worked hard, developing a computer that was faster and less expensive than the IBM System/360 mainframe computer systems. This object contains an actual Amdahl series 470 computer logic chip with an air cooling device mounted on top. The package leads and cooling tower are gold-plated.

  13. Aquaculture information package

    Energy Technology Data Exchange (ETDEWEB)

    Boyd, T.; Rafferty, K.

    1998-08-01

    This package of information is intended to provide background information to developers of geothermal aquaculture projects. The material is divided into eight sections and includes information on market and price information for typical species, aquaculture water quality issues, typical species culture information, pond heat loss calculations, an aquaculture glossary, regional and university aquaculture offices and state aquaculture permit requirements. A bibliography containing 68 references is also included.

  14. The CASA Software Package

    Science.gov (United States)

    Petry, Dirk

    2018-03-01

    CASA is the standard science data analysis package for ALMA and VLA but it can also be used for the analysis of data from other observatories. In this talk, I will give an overview of the structure and features of CASA, who develops it, and the present status and plans, and then show typical analysis workflows for ALMA data with special emphasis on the handling of single dish data and its combination with interferometric data.

  15. Ensuring socially responsible packaging design

    DEFF Research Database (Denmark)

    Geert Jensen, Birgitte

    Most consumers have experienced occasional problems with opening packaging. Tomato sauce from the tinned mackerel splattered all over the kitchen counter, the unrelenting pickle jar lid, and the package of sliced ham that cannot be opened without a knife or a pair of scissors. The research project...... "User‐friendly Packaging" aims to create a platform for developing more user‐friendly packaging. One intended outcome of the project is a guideline that industry can use in development efforts. The project also points the way for more extended collaboration between companies and design researchers. How...... can design research help industry in packaging innovation?...

  16. Packaging based on polymeric materials

    Directory of Open Access Journals (Sweden)

    Jovanović Slobodan M.

    2005-01-01

    Full Text Available In the past two years the consumption of common in the developed countries world wide (high tonnage polymers for packaging has approached a value of 50 wt.%. In the same period more than 50% of the packaging units on the world market were made of polymeric materials despite the fact that polymeric materials present 17 wt.% of all packaging materials. The basic properties of polymeric materials and their environmental and economical advantages, providing them such a position among packaging materials, are presented in this article. Recycling methods, as well as the development trends of polymeric packaging materials are also presented.

  17. Plutonium stabilization and packaging system

    International Nuclear Information System (INIS)

    1996-01-01

    This document describes the functional design of the Plutonium Stabilization and Packaging System (Pu SPS). The objective of this system is to stabilize and package plutonium metals and oxides of greater than 50% wt, as well as other selected isotopes, in accordance with the requirements of the DOE standard for safe storage of these materials for 50 years. This system will support completion of stabilization and packaging campaigns of the inventory at a number of affected sites before the year 2002. The package will be standard for all sites and will provide a minimum of two uncontaminated, organics free confinement barriers for the packaged material

  18. Semiconductor optoelectronic infrared spectroscopy

    International Nuclear Information System (INIS)

    Hollingworth, A.R.

    2001-08-01

    We use spectroscopy to study infrared optoelectronic inter and intraband semiconductor carrier dynamics. The overall aim of this thesis was to study both III-V and Pb chalcogenide material systems in order to show their future potential use in infrared emitters. The effects of bandstructure engineering have been studied in the output characteristics of mid-IR III-V laser diodes to show which processes (defects, radiative, Auger and phonon) dominate and whether non-radiative processes can be suppressed. A new three-beam pump probe experiment was used to investigate interband recombination directly in passive materials. Experiments on PbSe and theory for non-parabolic near-mirror bands and non-degenerate statistics were in good agreement. Comparisons with HgCdTe showed a reduction in the Auger coefficient of 1-2 orders of magnitude in the PbSe. Using Landau confinement to model spatial confinement in quantum dots (QDs) 'phonon bottlenecking' was studied. The results obtained from pump probe and cyclotron resonance saturation measurements showed a clear suppression in the cooling of carriers when Landau level separation was not resonant with LO phonon energy. When a bulk laser diode was placed in a magnetic field to produce a quasi quantum wire device the resulting enhanced differential gain and reduced Auger recombination lowered I th by 30%. This result showed many peaks in the light output which occurred when the LO phonon energy was a multiple of the Landau level separation. This showed for the first time evidence of the phonon bottleneck in a working laser device. A new technique called time resolved optically detected cyclotron resonance, was used as a precursor to finding the carrier dynamics within a spatially confined quantum dot. By moving to the case of a spatial QD using an optically detected intraband resonance it was possible to measure the energy separation interband levels and conduction and valence sublevels within the dot simultaneously. Furthermore

  19. Simulation of semiconductor devices

    International Nuclear Information System (INIS)

    Oriato, D.

    2001-09-01

    In this thesis a drift diffusion model coupled with self-consistent solutions of Poisson's and Schroedinger's equations, is developed and used to investigate the operation of Gunn diodes and GaN-based LEDs. The model also includes parameters derived from Monte Carlo calculations of the simulated devices. In this way the characteristics of a Monte Carlo approach and of a quantum solver are built into a fast and flexible drift-diffusion model that can be used for testing a large number of heterostructure designs in a time-effective way. The full model and its numerical implementation are described in chapter 2. In chapter 3 the theory of Gunn diodes is presented. A basic model of the dynamics of domain formation and domain transport is described with particular regard to accumulation and dipole domains. Several modes of operation of the Gunn device are described, varying from the resonance mode to the quenched mode. Details about transferred electron devices and negative differential resistance in semiconductor materials are given. In chapter 4 results from the simulation of a simple conventional gunn device confirm the importance of the doping condition at the cathode. Accumulation or dipole domains are achieved respectively with high and low doping densities. The limits of a conventional Gunn diode are explained and solved by introducing the heterostructure Gunn diode. This new design consists of a conventional GaAs transit region coupled with an electron launcher at the cathode, made using an AIGaAs heterostructure step. Simulations show the importance of the insertion of a thin highly-doped layer between the transit region and the electron launcher in order to improve device operation. Chapter 5 is an introduction to Ill-nitrides, in particular GaN and its alloy ln-GaN. We outline the discrepancy in the elastic and piezoelectric parameters found in the literature. Strain, dislocations and piezoelectricity are presented as the main features of a InGaN/GaN system

  20. High-resolution clean-sc

    NARCIS (Netherlands)

    Sijtsma, P.; Snellen, M.

    2016-01-01

    In this paper a high-resolution extension of CLEAN-SC is proposed: HR-CLEAN-SC. Where CLEAN-SC uses peak sources in “dirty maps” to define so-called source components, HR-CLEAN-SC takes advantage of the fact that source components can likewise be derived from points at some distance from the peak,

  1. High-Temperature Electronics: A Role for Wide Bandgap Semiconductors?

    Science.gov (United States)

    Neudeck, Philip G.; Okojie, Robert S.; Chen, Liang-Yu

    2002-01-01

    It is increasingly recognized that semiconductor based electronics that can function at ambient temperatures higher than 150 C without external cooling could greatly benefit a variety of important applications, especially-in the automotive, aerospace, and energy production industries. The fact that wide bandgap semiconductors are capable of electronic functionality at much higher temperatures than silicon has partially fueled their development, particularly in the case of SiC. It appears unlikely that wide bandgap semiconductor devices will find much use in low-power transistor applications until the ambient temperature exceeds approximately 300 C, as commercially available silicon and silicon-on-insulator technologies are already satisfying requirements for digital and analog very large scale integrated circuits in this temperature range. However, practical operation of silicon power devices at ambient temperatures above 200 C appears problematic, as self-heating at higher power levels results in high internal junction temperatures and leakages. Thus, most electronic subsystems that simultaneously require high-temperature and high-power operation will necessarily be realized using wide bandgap devices, once the technology for realizing these devices become sufficiently developed that they become widely available. Technological challenges impeding the realization of beneficial wide bandgap high ambient temperature electronics, including material growth, contacts, and packaging, are briefly discussed.

  2. Flexible, Photopatterned, Colloidal CdSe Semiconductor Nanocrystal Integrated Circuits

    Science.gov (United States)

    Stinner, F. Scott

    As semiconductor manufacturing pushes towards smaller and faster transistors, a parallel goal exists to create transistors which are not nearly as small. These transistors are not intended to match the performance of traditional crystalline semiconductors; they are designed to be significantly lower in cost and manufactured using methods that can make them physically flexible for applications where form is more important than speed. One of the developing technologies for this application is semiconductor nanocrystals. We first explore methods to develop CdSe nanocrystal semiconducting "inks" into large-scale, high-speed integrated circuits. We demonstrate photopatterned transistors with mobilities of 10 cm2/Vs on Kapton substrates. We develop new methods for vertical interconnect access holes to demonstrate multi-device integrated circuits including inverting amplifiers with 7 kHz bandwidths, ring oscillators with NFC) link. The device draws its power from the NFC transmitter common on smartphones and eliminates the need for a fixed battery. This allows for the mass deployment of flexible, interactive displays on product packaging.

  3. Clean coal technologies: A business report

    International Nuclear Information System (INIS)

    Anon.

    1993-01-01

    The book contains four sections as follows: (1) Industry trends: US energy supply and demand; The clean coal industry; Opportunities in clean coal technologies; International market for clean coal technologies; and Clean Coal Technology Program, US Energy Department; (2) Environmental policy: Clean Air Act; Midwestern states' coal policy; European Community policy; and R ampersand D in the United Kingdom; (3) Clean coal technologies: Pre-combustion technologies; Combustion technologies; and Post-combustion technologies; (4) Clean coal companies. Separate abstracts have been prepared for several sections or subsections for inclusion on the data base

  4. High pressure semiconductor physics I

    CERN Document Server

    Willardson, R K; Paul, William; Suski, Tadeusz

    1998-01-01

    Since its inception in 1966, the series of numbered volumes known as Semiconductors and Semimetals has distinguished itself through the careful selection of well-known authors, editors, and contributors. The "Willardson and Beer" Series, as it is widely known, has succeeded in publishing numerous landmark volumes and chapters. Not only did many of these volumes make an impact at the time of their publication, but they continue to be well-cited years after their original release. Recently, Professor Eicke R. Weber of the University of California at Berkeley joined as a co-editor of the series. Professor Weber, a well-known expert in the field of semiconductor materials, will further contribute to continuing the series' tradition of publishing timely, highly relevant, and long-impacting volumes. Some of the recent volumes, such as Hydrogen in Semiconductors, Imperfections in III/V Materials, Epitaxial Microstructures, High-Speed Heterostructure Devices, Oxygen in Silicon, and others promise indeed that this tra...

  5. Introduction to cathodoluminescence in semiconductors

    International Nuclear Information System (INIS)

    Dussac, M.

    1985-01-01

    The use of cathodoluminescence in a scanning electron microscope leads to acquire a spectrum in a place of the sample surface, or to register the intensity profile of a special emission band along a scanning line, or also to realize a map of the irradiated sample. Composition variations can then, at ambient temperature, be determined, also defects can be shown, together with grain joints and dislocations, radiative and non radiative regions can be distinguished and, at low temperature, elementary processes of luminescence can be studied and impurities identified in semiconductors. Through this analysis method is applicable to every insulating or semiconductor material (that is to say to every material having a gap), in this article only crystalline semi-conductor will be studied [fr

  6. Catalysts, Protection Layers, and Semiconductors

    DEFF Research Database (Denmark)

    Chorkendorff, Ib

    2015-01-01

    Hydrogen is the simplest solar fuel to produce and in this presentation we shall give a short overview of the pros and cons of various tandem devices [1]. The large band gap semiconductor needs to be in front, but apart from that we can chose to have either the anode in front or back using either...... acid or alkaline conditions. Since most relevant semiconductors are very prone to corrosion the advantage of using buried junctions and using protection layers offering shall be discussed [2-4]. Next we shall discuss the availability of various catalysts for being coupled to these protections layers...... and how their stability may be evaluated [5, 6]. Examples of half-cell reaction using protection layers for both cathode and anode will be discussed though some of recent examples under both alkaline and acidic conditions. Si is a very good low band gap semiconductor and by using TiO2 as a protection...

  7. High mobility emissive organic semiconductor

    Science.gov (United States)

    Liu, Jie; Zhang, Hantang; Dong, Huanli; Meng, Lingqiang; Jiang, Longfeng; Jiang, Lang; Wang, Ying; Yu, Junsheng; Sun, Yanming; Hu, Wenping; Heeger, Alan J.

    2015-01-01

    The integration of high charge carrier mobility and high luminescence in an organic semiconductor is challenging. However, there is need of such materials for organic light-emitting transistors and organic electrically pumped lasers. Here we show a novel organic semiconductor, 2,6-diphenylanthracene (DPA), which exhibits not only high emission with single crystal absolute florescence quantum yield of 41.2% but also high charge carrier mobility with single crystal mobility of 34 cm2 V−1 s−1. Organic light-emitting diodes (OLEDs) based on DPA give pure blue emission with brightness up to 6,627 cd m−2 and turn-on voltage of 2.8 V. 2,6-Diphenylanthracene OLED arrays are successfully driven by DPA field-effect transistor arrays, demonstrating that DPA is a high mobility emissive organic semiconductor with potential in organic optoelectronics. PMID:26620323

  8. Thiophene-Based Organic Semiconductors.

    Science.gov (United States)

    Turkoglu, Gulsen; Cinar, M Emin; Ozturk, Turan

    2017-10-24

    Thiophene-based π-conjugated organic small molecules and polymers are the research subject of significant current interest owing to their potential use as organic semiconductors in material chemistry. Despite simple and similar molecular structures, the hitherto reported properties of thiophene-based organic semiconductors are rather diverse. Design of high performance organic semiconducting materials requires a thorough understanding of inter- and intra-molecular interactions, solid-state packing, and the influence of both factors on the charge carrier transport. In this chapter, thiophene-based organic semiconductors, which are classified in terms of their chemical structures and their structure-property relationships, are addressed for the potential applications as organic photovoltaics (OPVs), organic field-effect transistors (OFETs) and organic light emitting diodes (OLEDs).

  9. Advances in telescope mirror cleaning

    Science.gov (United States)

    Blanken, Maarten F.; Chopping, Alan K.; Dee, Kevin M.

    2004-09-01

    Metrology and cleaning techniques for telescope mirrors are generally well established. CO2 cleaning and water washing are mainly used. Water washing has proven to be the best method of removing oil and water stains and restoring the aluminium to nearly fresh values. The risk of water getting to unwanted places such as electronics or other optics prevents this method from being employed more often. Recently the Isaac Newton Group introduced a new cleaning technique for their telescope mirrors, which reduces the risks discussed above. This technique uses water vapour instead of water to wash the mirror. The advantage of this method is that the amount of water needed is drastically reduced. In addition the pressure of the vapour will blow away any large dust particles on the mirror and the temperature shock between the vapour and the mirror will help to de-bond the dust particles. Adding a soapy solution will help to clean oil and watermarks of the mirror. This paper describes the vapour cleaning method, tests that have been done and the overall findings.

  10. Optimization of Ultrasonic Fabric Cleaning

    Energy Technology Data Exchange (ETDEWEB)

    Hand, T.E.

    1998-05-13

    The fundamental purpose of this project was to research and develop a process that would reduce the cost and improve the environmental efficiency of the present dry-cleaning industry. This second phase of research (see report KCP-94-1006 for information gathered during the first phase) was intended to allow the optimal integration of all factors of ultrasonic fabric cleaning. For this phase, Garment Care performed an extensive literature search and gathered data from other researchers worldwide. The Garment Care-AlliedSignal team developed the requirements for a prototype cleaning tank for studies and acquired that tank and the additional equipment required to use it properly. Garment Care and AlliedSignal acquired the transducers and generators from Surftran Martin-Walter in Sterling Heights, Michigan. Amway's Kelly Haley developed the test protocol, supplied hundreds of test swatches, gathered the data on the swatches before and after the tests, assisted with the cleaning tests, and prepared the final analysis of the results. AlliedSignal personnel, in conjunction with Amway and Garment Care staff, performed all the tests. Additional planning is under way for future testing by outside research facilities. The final results indicated repeatable performance and good results for single layered fabric swatches. Swatches that were cleaned as a ''sandwich,'' that is, three or more layers.

  11. Testing methodologies and systems for semiconductor optical amplifiers

    Science.gov (United States)

    Wieckowski, Michael

    Semiconductor optical amplifiers (SOA's) are gaining increased prominence in both optical communication systems and high-speed optical processing systems, due primarily to their unique nonlinear characteristics. This in turn, has raised questions regarding their lifetime performance reliability and has generated a demand for effective testing techniques. This is especially critical for industries utilizing SOA's as components for system-in-package products. It is important to note that very little research to date has been conducted in this area, even though production volume and market demand has continued to increase. In this thesis, the reliability of dilute-mode InP semiconductor optical amplifiers is studied experimentally and theoretically. The aging characteristics of the production level devices are demonstrated and the necessary techniques to accurately characterize them are presented. In addition, this work proposes a new methodology for characterizing the optical performance of these devices using measurements in the electrical domain. It is shown that optical performance degradation, specifically with respect to gain, can be directly qualified through measurements of electrical subthreshold differential resistance. This metric exhibits a linear proportionality to the defect concentration in the active region, and as such, can be used for prescreening devices before employing traditional optical testing methods. A complete theoretical analysis is developed in this work to explain this relationship based upon the device's current-voltage curve and its associated leakage and recombination currents. These results are then extended to realize new techniques for testing semiconductor optical amplifiers and other similarly structured devices. These techniques can be employed after fabrication and during packaged operation through the use of a proposed stand-alone testing system, or using a proposed integrated CMOS self-testing circuit. Both methods are capable

  12. Charge carrier mobility in thin films of organic semiconductors by the gated van der Pauw method

    Science.gov (United States)

    Rolin, Cedric; Kang, Enpu; Lee, Jeong-Hwan; Borghs, Gustaaf; Heremans, Paul; Genoe, Jan

    2017-01-01

    Thin film transistors based on high-mobility organic semiconductors are prone to contact problems that complicate the interpretation of their electrical characteristics and the extraction of important material parameters such as the charge carrier mobility. Here we report on the gated van der Pauw method for the simple and accurate determination of the electrical characteristics of thin semiconducting films, independently from contact effects. We test our method on thin films of seven high-mobility organic semiconductors of both polarities: device fabrication is fully compatible with common transistor process flows and device measurements deliver consistent and precise values for the charge carrier mobility and threshold voltage in the high-charge carrier density regime that is representative of transistor operation. The gated van der Pauw method is broadly applicable to thin films of semiconductors and enables a simple and clean parameter extraction independent from contact effects. PMID:28397852

  13. Mesoscopic spin Hall effect in semiconductor nanostructures

    Science.gov (United States)

    Zarbo, Liviu

    The spin Hall effect (SHE) is a name given to a collection of diverse phenomena which share two principal features: (i) longitudinal electric current flowing through a paramagnetic semiconductor or metallic sample leads to transverse spin current and spin accumulation of opposite sign at opposing lateral edges; (ii) SHE does not require externally applied magnetic field or magnetic ordering in the equilibrium state of the sample, instead it relies on the presence of spin-orbit (SO) couplings within the sample. This thesis elaborates on a new type of phenomenon within the SHE family, predicted in our recent studies [Phys. Rev. B 72, 075361 (2005); Phys. Rev. Lett. 95, 046601 (2005); Phys. Rev. B 72, 075335 (2005); Phys. Rev. B 73 , 075303 (2006); and Europhys. Lett. 77, 47004 (2007)], where pure spin current flows through the transverse electrodes attached to a clean finitesize two-dimensional electron gas (2DEG) due to unpolarized charge current injected through its longitudinal leads. If transverse leads are removed, the effect manifests as nonequilibrium spin Hall accumulation at the lateral edges of 2DEG wires. The SO coupling driving this SHE effect is of the Rashba type, which arises due to structural inversion asymmetry of semiconductor heterostructure hosting the 2DEG. We term the effect "mesoscopic" because the spin Hall currents and accumulations reach optimal value in samples of the size of the spin precession length---the distance over which the spin of an electron precesses by an angle pi. In strongly SO-coupled structures this scale is of the order of ˜100 nm, and, therefore, mesoscopic in the sense of being much larger than the characteristic microscopic scales (such as the Fermi wavelength, screening length, or the mean free path in disordered systems), but still much smaller than the macroscopic ones. Although the first theoretical proposal for SHE, driven by asymmetry in SO-dependent scattering of spin-up and spin-down electrons off impurities

  14. Organic semiconductors in sensor applications

    CERN Document Server

    Malliaras, George; Owens, Róisín

    2008-01-01

    Organic semiconductors offer unique characteristics such as tunability of electronic properties via chemical synthesis, compatibility with mechanically flexible substrates, low-cost manufacturing, and facile integration with chemical and biological functionalities. These characteristics have prompted the application of organic semiconductors and their devices in physical, chemical, and biological sensors. This book covers this rapidly emerging field by discussing both optical and electrical sensor concepts. Novel transducers based on organic light-emitting diodes and organic thin-film transistors, as well as systems-on-a-chip architectures are presented. Functionalization techniques to enhance specificity are outlined, and models for the sensor response are described.

  15. Semiconductors and semimetals epitaxial microstructures

    CERN Document Server

    Willardson, Robert K; Beer, Albert C; Gossard, Arthur C

    1994-01-01

    Newly developed semiconductor microstructures can now guide light and electrons resulting in important consequences for state-of-the-art electronic and photonic devices. This volume introduces a new generation of epitaxial microstructures. Special emphasis has been given to atomic control during growth and the interrelationship between the atomic arrangements and the properties of the structures.Key Features* Atomic-level control of semiconductor microstructures* Molecular beam epitaxy, metal-organic chemical vapor deposition* Quantum wells and quantum wires* Lasers, photon(IR)detectors, heterostructure transistors

  16. Introduction to semiconductor manufacturing technology

    CERN Document Server

    2012-01-01

    IC chip manufacturing processes, such as photolithography, etch, CVD, PVD, CMP, ion implantation, RTP, inspection, and metrology, are complex methods that draw upon many disciplines. [i]Introduction to Semiconductor Manufacturing Technologies, Second Edition[/i] thoroughly describes the complicated processes with minimal mathematics, chemistry, and physics; it covers advanced concepts while keeping the contents accessible to readers without advanced degrees. Designed as a textbook for college students, this book provides a realistic picture of the semiconductor industry and an in-depth discuss

  17. Wide gap semiconductor microwave devices

    International Nuclear Information System (INIS)

    Buniatyan, V V; Aroutiounian, V M

    2007-01-01

    A review of properties of wide gap semiconductor materials such as diamond, diamond-like carbon films, SiC, GaP, GaN and AlGaN/GaN that are relevant to electronic, optoelectronic and microwave applications is presented. We discuss the latest situation and perspectives based on experimental and theoretical results obtained for wide gap semiconductor devices. Parameters are taken from the literature and from some of our theoretical works. The correspondence between theoretical results and parameters of devices is critically analysed. (review article)

  18. Detection of radioactivity by semiconductors

    International Nuclear Information System (INIS)

    Anon.

    1991-01-01

    The class of detectors discussed in this chapter has a responsive component involving a diode, a junction between two types of semiconductor materials. Although diode detectors are not particularly efficient in counting radioactive emissions, they are superior to other commercially available detectors in spectroscopy. Consequently, diode detectors are used extensively for quanlitative purposes and for quantitative purposes when mixtures of radionuclides are present, not the usual situation with biological or medical research. Topics addressed in this chapter are as follows: Band Theory; Semiconductors and Junctions; and Radiation Detectors. 6 refs., 14 figs

  19. Modeling of semiconductor optical amplifiers

    DEFF Research Database (Denmark)

    Mørk, Jesper; Bischoff, Svend; Berg, Tommy Winther

    We discuss the modelling of semiconductor optical amplifiers with emphasis on their high-speed properties. Applications in linear amplification as well as ultrafast optical signal processing are reviewed. Finally, the possible role of quantum-dot based optical amplifiers is discussed.......We discuss the modelling of semiconductor optical amplifiers with emphasis on their high-speed properties. Applications in linear amplification as well as ultrafast optical signal processing are reviewed. Finally, the possible role of quantum-dot based optical amplifiers is discussed....

  20. Semiconductor X-ray spectrometers

    International Nuclear Information System (INIS)

    Muggleton, A.H.F.

    1978-02-01

    An outline is given of recent developments in particle and photon induced x-ray fluorescence (XRF) analysis. Following a brief description of the basic mechanism of semiconductor detector operation a comparison is made between semiconductor detectors, scintillators and gas filled proportional devices. Detector fabrication and cryostat design are described in more detail and the effects of various device parameters on system performance, such as energy resolution, count rate capability, efficiency, microphony, etc. are discussed. The main applications of these detectors in x-ray fluorescence analysis, electron microprobe analysis, medical and pollution studies are reviewed

  1. Integrating magnetism into semiconductor electronics

    Energy Technology Data Exchange (ETDEWEB)

    Zakharchenya, Boris P; Korenev, Vladimir L [A.F. Ioffe Physico-Technical Institute, Russian Academy of Sciences, St. Petersburg (Russian Federation)

    2005-06-30

    The view of a ferromagnetic-semiconducting hybrid structure as a single tunable system is presented. Based on an analysis of existing experiments it is shown that, contrary to a 'common sense', a nonmagnetic semiconductor is capable of playing an important role in controlling ferromagnetism. Magnetic properties of a hybrid (the hysteresis loop and the spatial orientation of magnetization) can be tuned both optically and electrically by utilizing semiconductor-making the hybrid an electronic-write-in and electronic-read-out elementary storage unit. (methodological notes)

  2. Integrating magnetism into semiconductor electronics

    International Nuclear Information System (INIS)

    Zakharchenya, Boris P; Korenev, Vladimir L

    2005-01-01

    The view of a ferromagnetic-semiconducting hybrid structure as a single tunable system is presented. Based on an analysis of existing experiments it is shown that, contrary to a 'common sense', a nonmagnetic semiconductor is capable of playing an important role in controlling ferromagnetism. Magnetic properties of a hybrid (the hysteresis loop and the spatial orientation of magnetization) can be tuned both optically and electrically by utilizing semiconductor-making the hybrid an electronic-write-in and electronic-read-out elementary storage unit. (methodological notes)

  3. Semiconductor lasers and herterojunction leds

    CERN Document Server

    Kressel, Henry

    2012-01-01

    Semiconductor Lasers and Heterojunction LEDs presents an introduction to the subject of semiconductor lasers and heterojunction LEDs. The book reviews relevant basic solid-state and electromagnetic principles; the relevant concepts in solid state physics; and the p-n junctions and heterojunctions. The text also describes stimulated emission and gain; the relevant concepts in electromagnetic field theory; and the modes in laser structures. The relation between electrical and optical properties of laser diodes; epitaxial technology; binary III-V compounds; and diode fabrication are also consider

  4. Surface cleaning in thin film technology

    International Nuclear Information System (INIS)

    Mattox, D.M.

    1978-01-01

    A ''clean surface'' is one that contains no significant amounts of undesirable material. This paper discusses the types and origin of various contaminants. Since cleaning is often equated with adhesion, the mechanisms of adhesion to oxide, metal, and organic surfaces are reviewed and cleaning processes for these surfaces are outlined. Techniques for monitoring surface cleaning are presented, and the importance of storage of clean surfaces is discussed. An extensive bibliography is given. 4 figs., 89 references

  5. Air cleaning using regenerative silica gel wheel

    DEFF Research Database (Denmark)

    Fang, Lei

    2011-01-01

    This paper discussed the necessity of indoor air cleaning and the state of the art information on gas-phase air cleaning technology. The performance and problems of oxidation and sorption air cleaning technology were summarized and analysed based on the literature studies. Eventually, based...... on an experimental study, a technology called clean air heat pump is proposed as a practical approach for indoor air cleaning....

  6. Towards high charge carrier mobilities by rational design of organic semiconductors

    Energy Technology Data Exchange (ETDEWEB)

    Andrienko, Denis; Ruehle, Victor; Baumeier, Bjoern; Vehoff, Thorsten; Lukyanov, Alexander; Kremer, Kurt [Max Planck Institute for Polymer Research, Mainz (Germany); Marcon, Valentina [Technische Universitaet Darmstadt (Germany); Kirkpatrick, James; Nelson, Jenny [Imperial College London (United Kingdom); Lennartz, Christian [BASF AG, Ludwigshafen (Germany)

    2010-07-01

    The role of material morphology on charge carrier mobility in partially disordered organic semiconductors is discussed for several classes of materials: derivatives of hexabenzocoronenens, perylenediimides, triangularly-shaped polyaromatic hydrocarbons, and Alq{sub 3}. Simulations are performed using a package developed by Imperial College, London and Max Planck Institute for Polymer Research, Mainz (votca.org). This package combines several techniques into one scheme: quantum chemical methods for the calculation of molecular electronic structures and reorganization energies; molecular dynamics and systematic coarse-graining approaches for simulation of self-assembly and relative positions and orientations of molecules on large scales; kinetic Monte Carlo and master equation for studies of charge transport.

  7. CURE: Clean use of reactor energy

    International Nuclear Information System (INIS)

    1990-05-01

    This paper presents the results of a joint Westinghouse Hanford Company (Westinghouse Hanford)-Pacific Northwest Laboratory (PNL) study that considered the feasibility of treating radioactive waste before disposal to reduce the inventory of long-lived radionuclides, making the waste more suitable for geologic disposal. The treatment considered here is one in which waste would be chemically separated so that long-lived radionuclides can be treated using specific processes appropriate for the nuclide. The technical feasibility of enhancing repository performance by this type of treatment is considered in this report. A joint Westinghouse Hanford-PNL study group developed a concept called the Clean Use of Reactor Energy (CURE), and evaluated the potential of current technology to reduce the long-lived radionuclide content in waste from the nuclear power industry. The CURE process consists of three components: chemical separation of elements that have significant quantities of long-lived radioisotopes in the waste, exposure in a neutron flux to transmute the radioisotopes to stable nuclides, and packaging of radionuclides that cannot be transmuted easily for storage or geologic disposal. 76 refs., 32 figs., 24 tabs

  8. Clean air in the Anthropocene.

    Science.gov (United States)

    Lelieveld, Jos

    2017-08-24

    In atmospheric chemistry, interactions between air pollution, the biosphere and human health, often through reaction mixtures from both natural and anthropogenic sources, are of growing interest. Massive pollution emissions in the Anthropocene have transformed atmospheric composition to the extent that biogeochemical cycles, air quality and climate have changed globally and partly profoundly. It is estimated that mortality attributable to outdoor air pollution amounts to 4.33 million individuals per year, associated with 123 million years of life lost. Worldwide, air pollution is the major environmental risk factor to human health, and strict air quality standards have the potential to strongly reduce morbidity and mortality. Preserving clean air should be considered a human right, and is fundamental to many sustainable development goals of the United Nations, such as good health, climate action, sustainable cities, clean energy, and protecting life on land and in the water. It would be appropriate to adopt "clean air" as a sustainable development goal.

  9. Clean-room robot implementation

    International Nuclear Information System (INIS)

    Comeau, J.L.

    1982-01-01

    A robot has been incorporated in a clean room operation in which vacuum tube parts are cleaned just prior to final assembly with a 60 lb/in 2 blast of argon gas. The robot is programmed to pick up the parts, manipulate/rotate them as necessary in the jet pattern and deposit them in a tray precleaned by the robot. A carefully studied implementation plan was followed in the procurement, installation, modification and programming of the robot facility. An unusual configuration of one tube part required a unique gripper design. A study indicated that the tube parts processed by the robot are 12% cleaner than those manually cleaned by an experienced operator

  10. Clean Coal Diesel Demonstration Project

    Energy Technology Data Exchange (ETDEWEB)

    Robert Wilson

    2006-10-31

    A Clean Coal Diesel project was undertaken to demonstrate a new Clean Coal Technology that offers technical, economic and environmental advantages over conventional power generating methods. This innovative technology (developed to the prototype stage in an earlier DOE project completed in 1992) enables utilization of pre-processed clean coal fuel in large-bore, medium-speed, diesel engines. The diesel engines are conventional modern engines in many respects, except they are specially fitted with hardened parts to be compatible with the traces of abrasive ash in the coal-slurry fuel. Industrial and Municipal power generating applications in the 10 to 100 megawatt size range are the target applications. There are hundreds of such reciprocating engine power-plants operating throughout the world today on natural gas and/or heavy fuel oil.

  11. Stethoscope Cleaning During Patient Care.

    Science.gov (United States)

    Ghumman, Ghazi Wahla; Ahmad, Nina; Pop-Vicas, Aurora; Iftikhar, Sadia

    2018-05-01

    We conducted a cross-sectional survey of healthcare workers in two community teaching hospitals to better understand clinicians' beliefs and practices related to cleaning of their stethoscopes. The study was conducted from September 2015 to May 2016. Among the total 358 responses received, 45%, 40%, 10% and 5% were from attending physicians, medical students, nurses, and resident physicians, respectively. Although the majority of the respondents (76%) frequently used a stethoscope at work, and almost all (93%) believed that stethoscopes can be involved in pathogen transmission, only 29% of participants reported cleaning their stethoscopes after every use. Hospitals should include stethoscope cleaning into their overall infection prevention efforts. [Full article available at http://rimed.org/rimedicaljournal-2018-05.asp].

  12. Cleaning and dewatering fine coal

    Science.gov (United States)

    Yoon, Roe-Hoan; Eraydin, Mert K.; Freeland, Chad

    2017-10-17

    Fine coal is cleaned of its mineral matter impurities and dewatered by mixing the aqueous slurry containing both with a hydrophobic liquid, subjecting the mixture to a phase separation. The resulting hydrophobic liquid phase contains coal particles free of surface moisture and droplets of water stabilized by coal particles, while the aqueous phase contains the mineral matter. By separating the entrained water droplets from the coal particles mechanically, a clean coal product of substantially reduced mineral matter and moisture contents is obtained. The spent hydrophobic liquid is separated from the clean coal product and recycled. The process can also be used to separate one type of hydrophilic particles from another by selectively hydrophobizing one.

  13. Controlling the cost of clean air - A new clean coal technology

    International Nuclear Information System (INIS)

    Kindig, J.K.; Godfrey, R.L.

    1991-01-01

    This article presents the authors' alternative to expensive coal combustion products clean-up by cleaning the coal, removing the sulfur, before combustion. Topics discussed include sulfur in coal and the coal cleaning process, the nature of a new coal cleaning technology, the impact on Clean Air Act compliance, and the economics of the new technology

  14. Effect of barrier height on friction behavior of the semiconductors silicon and gallium arsenide in contact with pure metals

    Science.gov (United States)

    Mishina, H.; Buckley, D. H.

    1984-01-01

    Friction experiments were conducted for the semiconductors silicon and gallium arsenide in contact with pure metals. Polycrystalline titanium, tantalum, nickel, palladium, and platinum were made to contact a single crystal silicon (111) surface. Indium, nickel, copper, and silver were made to contact a single crystal gallium arsenide (100) surface. Sliding was conducted both in room air and in a vacuum of 10 to the minus 9th power torr. The friction of semiconductors in contact with metals depended on a Schottky barrier height formed at the metal semiconductor interface. Metals with a higher barrier height on semiconductors gave lower friction. The effect of the barrier height on friction behavior for argon sputtered cleaned surfaces in vacuum was more specific than that for the surfaces containing films in room air. With a silicon surface sliding on titanium, many silicon particles back transferred. In contrast, a large quantity of indium transferred to the gallium arsenide surface.

  15. Waveguide based external cavity semiconductor lasers

    NARCIS (Netherlands)

    Oldenbeuving, Ruud; Klein, E.J.; Offerhaus, Herman L.; Lee, Christopher James; Verhaegen, M.; Boller, Klaus J.

    2012-01-01

    We report on progress of the project waveguide based external cavity semiconductor laser (WECSL) arrays. Here we present the latest results on our efforts to mode lock an array of tunable, external cavity semiconductor lasers.

  16. Influence of phonons on semiconductor quantum emission

    Energy Technology Data Exchange (ETDEWEB)

    Feldtmann, Thomas

    2009-07-06

    A microscopic theory of interacting charge carriers, lattice vibrations, and light modes in semiconductor systems is presented. The theory is applied to study quantum dots and phonon-assisted luminescence in bulk semiconductors and heterostructures. (orig.)

  17. Semiconductor structure and recess formation etch technique

    Energy Technology Data Exchange (ETDEWEB)

    Lu, Bin; Sun, Min; Palacios, Tomas Apostol

    2017-02-14

    A semiconductor structure has a first layer that includes a first semiconductor material and a second layer that includes a second semiconductor material. The first semiconductor material is selectively etchable over the second semiconductor material using a first etching process. The first layer is disposed over the second layer. A recess is disposed at least in the first layer. Also described is a method of forming a semiconductor structure that includes a recess. The method includes etching a region in a first layer using a first etching process. The first layer includes a first semiconductor material. The first etching process stops at a second layer beneath the first layer. The second layer includes a second semiconductor material.

  18. Fundamentals of semiconductors physics and materials properties

    CERN Document Server

    Yu, Peter Y

    2005-01-01

    Provides detailed explanations of the electronic, vibrational, transport, and optical properties of semiconductors. This textbook emphasizes understanding the physical properties of Si and similar tetrahedrally coordinated semiconductors and features an extensive collection of tables of material parameters, figures, and problems.

  19. Packaging - Materials review

    Energy Technology Data Exchange (ETDEWEB)

    Herrmann, Matthias [Hoppecke Advanced Battery Technology GmbH, 08056 Zwickau (Germany)

    2014-06-16

    Nowadays, a large number of different electrochemical energy storage systems are known. In the last two decades the development was strongly driven by a continuously growing market of portable electronic devices (e.g. cellular phones, lap top computers, camcorders, cameras, tools). Current intensive efforts are under way to develop systems for automotive industry within the framework of electrically propelled mobility (e.g. hybrid electric vehicles, plug-in hybrid electric vehicles, full electric vehicles) and also for the energy storage market (e.g. electrical grid stability, renewable energies). Besides the different systems (cell chemistries), electrochemical cells and batteries were developed and are offered in many shapes, sizes and designs, in order to meet performance and design requirements of the widespread applications. Proper packaging is thereby one important technological step for designing optimum, reliable and safe batteries for operation. In this contribution, current packaging approaches of cells and batteries together with the corresponding materials are discussed. The focus is laid on rechargeable systems for industrial applications (i.e. alkaline systems, lithium-ion, lead-acid). In principle, four different cell types (shapes) can be identified - button, cylindrical, prismatic and pouch. Cell size can be either in accordance with international (e.g. International Electrotechnical Commission, IEC) or other standards or can meet application-specific dimensions. Since cell housing or container, terminals and, if necessary, safety installations as inactive (non-reactive) materials reduce energy density of the battery, the development of low-weight packages is a challenging task. In addition to that, other requirements have to be fulfilled: mechanical stability and durability, sealing (e.g. high permeation barrier against humidity for lithium-ion technology), high packing efficiency, possible installation of safety devices (current interrupt device

  20. Packaging - Materials review

    Science.gov (United States)

    Herrmann, Matthias

    2014-06-01

    Nowadays, a large number of different electrochemical energy storage systems are known. In the last two decades the development was strongly driven by a continuously growing market of portable electronic devices (e.g. cellular phones, lap top computers, camcorders, cameras, tools). Current intensive efforts are under way to develop systems for automotive industry within the framework of electrically propelled mobility (e.g. hybrid electric vehicles, plug-in hybrid electric vehicles, full electric vehicles) and also for the energy storage market (e.g. electrical grid stability, renewable energies). Besides the different systems (cell chemistries), electrochemical cells and batteries were developed and are offered in many shapes, sizes and designs, in order to meet performance and design requirements of the widespread applications. Proper packaging is thereby one important technological step for designing optimum, reliable and safe batteries for operation. In this contribution, current packaging approaches of cells and batteries together with the corresponding materials are discussed. The focus is laid on rechargeable systems for industrial applications (i.e. alkaline systems, lithium-ion, lead-acid). In principle, four different cell types (shapes) can be identified - button, cylindrical, prismatic and pouch. Cell size can be either in accordance with international (e.g. International Electrotechnical Commission, IEC) or other standards or can meet application-specific dimensions. Since cell housing or container, terminals and, if necessary, safety installations as inactive (non-reactive) materials reduce energy density of the battery, the development of low-weight packages is a challenging task. In addition to that, other requirements have to be fulfilled: mechanical stability and durability, sealing (e.g. high permeation barrier against humidity for lithium-ion technology), high packing efficiency, possible installation of safety devices (current interrupt device

  1. Packaging - Materials review

    International Nuclear Information System (INIS)

    Herrmann, Matthias

    2014-01-01

    Nowadays, a large number of different electrochemical energy storage systems are known. In the last two decades the development was strongly driven by a continuously growing market of portable electronic devices (e.g. cellular phones, lap top computers, camcorders, cameras, tools). Current intensive efforts are under way to develop systems for automotive industry within the framework of electrically propelled mobility (e.g. hybrid electric vehicles, plug-in hybrid electric vehicles, full electric vehicles) and also for the energy storage market (e.g. electrical grid stability, renewable energies). Besides the different systems (cell chemistries), electrochemical cells and batteries were developed and are offered in many shapes, sizes and designs, in order to meet performance and design requirements of the widespread applications. Proper packaging is thereby one important technological step for designing optimum, reliable and safe batteries for operation. In this contribution, current packaging approaches of cells and batteries together with the corresponding materials are discussed. The focus is laid on rechargeable systems for industrial applications (i.e. alkaline systems, lithium-ion, lead-acid). In principle, four different cell types (shapes) can be identified - button, cylindrical, prismatic and pouch. Cell size can be either in accordance with international (e.g. International Electrotechnical Commission, IEC) or other standards or can meet application-specific dimensions. Since cell housing or container, terminals and, if necessary, safety installations as inactive (non-reactive) materials reduce energy density of the battery, the development of low-weight packages is a challenging task. In addition to that, other requirements have to be fulfilled: mechanical stability and durability, sealing (e.g. high permeation barrier against humidity for lithium-ion technology), high packing efficiency, possible installation of safety devices (current interrupt device

  2. Carbon dioxide cleaning pilot project

    International Nuclear Information System (INIS)

    Knight, L.; Blackman, T.E.

    1994-01-01

    In 1989, radioactive-contaminated metal at the Rocky Flats Plant (RFP) was cleaned using a solvent paint stripper (Methylene chloride). One-third of the radioactive material was able to be recycled; two-thirds went to the scrap pile as low-level mixed waste. In addition, waste solvent solutions also required disposal. Not only was this an inefficient process, it was later prohibited by the Resource Conservation and Recovery Act (RCRA), 40 CFR 268. A better way of doing business was needed. In the search for a solution to this situation, it was decided to study the advantages of using a new technology - pelletized carbon dioxide cleaning. A proof of principle demonstration occurred in December 1990 to test whether such a system could clean radioactive-contaminated metal. The proof of principle demonstration was expanded in June 1992 with a pilot project. The purpose of the pilot project was three fold: (1) to clean metal so that it can satisfy free release criteria for residual radioactive contamination at the Rocky Flats Plant (RFP); (2) to compare two different carbon dioxide cleaning systems; and (3) to determine the cost-effectiveness of decontamination process in a production situation and compare the cost of shipping the metal off site for waste disposal. The pilot project was completed in August 1993. The results of the pilot project were: (1) 90% of those items which were decontaminated, successfully met the free release criteria , (2) the Alpheus Model 250 was selected to be used on plantsite and (3) the break even cost of decontaminating the metal vs shipping the contaminated material offsite for disposal was a cleaning rate of 90 pounds per hour, which was easily achieved

  3. The simulation of charge sharing in semiconductor X-ray pixel detectors

    CERN Document Server

    Mathieson, K; O'Shea, V; Passmore, M S; Rahman, M; Smith, K M; Watt, J; Whitehill, C

    2002-01-01

    Two simulation packages were used to model the sharing of charge, due to the scattering and diffusion of carriers, between adjacent pixel elements in semiconductors X-ray detectors. The X-ray interaction and the consequent multiple scattering was modelled with the aid of the Monte Carlo package, MCNP. The resultant deposited charge distribution was then used to create the charge cloud profile in the finite element semiconductor simulation code MEDICI. The analysis of the current pulses induced on pixel electrodes for varying photon energies was performed for a GaAs pixel detector. For a pixel pitch of 25 mu m, the charge lost to a neighbouring pixel was observed to be constant, at 0.6%, through the energies simulated. Ultimately, a fundamental limit on the pixel element size for imaging and spectroscopic devices may be set due to these key physical principles.

  4. Laser paper cleaning: the method of cleaning historical books

    Science.gov (United States)

    Zekou, Evangelini; Tsilikas, Ioannis; Chatzitheodoridis, Elias; Serafetinides, Alexander A.

    2016-01-01

    Conservation of cultural heritage treasures is the most important issue for transferring knowledge to the public through the next generation of students, academics, and researchers. Although this century is authenticating e-books and information by means of electronic text, still historical manuscripts as content as well as objects are the main original recourses of keeping a record of this transformation. The current work focuses on cleaning paper samples by the application of pulsed light, which is interventional. Experiments carried out using paper samples that are artificially colonized with Ulocladium chartarum. Paper is treated by Nd:YAG laser light. The available wavelength is 1064 nm, at various fluences, repetition rates and number of pulses. Two types of paper are stained with fungi colonies, which grow on substrates of clean paper, as well as on paper with ink text. The first type of paper is Whatman No.1056, which is closer to pure cellulose. The second type of paper is a page of a cultural heritage book published in 1926. Cleaning is performed using laser irradiation, thus defining the damage threshold of each sample. The treatment on paper Watman showed a yellowing, especially on areas with high concentration of fungi. The second sample was more durable to the exposure, performing the best results at higher fluences. Eventually, the paper samples are characterized, with optical microscopy and SEM/EDX analyses, prior to and after cleaning.

  5. Condenser performance monitoring and cleaning

    International Nuclear Information System (INIS)

    Walden, J.V.

    1998-01-01

    The main condenser at Ginna Station was retubed from admiralty brass to 316 stainless steel. A condenser performance monitoring spreadsheet was developed using EPRI guidelines after fouling was discovered. PEPSE computer models were used to determine the power loss and confirm the spreadsheet results. Cleaning of the condenser was performed using plastic scrubbers. Condenser performance improved dramatically following the cleaning. PEPSE, condenser spreadsheet performance, and actual observed plant data correlated well together. The fouling mechanism was determined to be a common lake bacteria and fungus growth which was combined with silt. Chlorination of the circulating water system at the allowable limits is keeping the biofouling under control

  6. Nuclear radiation detection by a variband semiconductor

    International Nuclear Information System (INIS)

    Volkov, A.S.

    1981-01-01

    Possibilities of using a variband semiconductor for detecting nuclear radiations are considered. It is shown that the variaband quasielectric field effectively collects charges induced by a nuclear particle only at a small mean free path in the semiconductor (up to 100 μm), the luminescence spectrum of the variband semiconductor when a nuclear particle gets into it, in principle, permits to determine both the energy and mean free path in the semiconductor (even at large mean free paths) [ru

  7. Ultrafast THz Saturable Absorption in Doped Semiconductors

    DEFF Research Database (Denmark)

    Turchinovich, Dmitry; Hoffmann, Matthias C.

    2011-01-01

    We demonstrate ultrafast THz saturable absorption in n-doped semiconductors by nonlinear THz time-domain spectroscopy. This effect is caused by the semiconductor conductivity modulation due to electron heating and satellite-valley scattering in strong THz fields.......We demonstrate ultrafast THz saturable absorption in n-doped semiconductors by nonlinear THz time-domain spectroscopy. This effect is caused by the semiconductor conductivity modulation due to electron heating and satellite-valley scattering in strong THz fields....

  8. Laser semiconductor diode integrated with frequency doubler

    International Nuclear Information System (INIS)

    Tighineanu, I.; Dorogan, V.; Suruceanu, G.

    2003-01-01

    The invention relates to the technology of optoelectronic semiconductor devices and may be used in the production of laser semiconductor diodes integrated with optical nonlinear elements. The laser semiconductor diode integrated with frequency doubler includes a semiconductor substrate, a laser structure with waveguide. metal contacts in the waveguide of the laser structure it is formed a nanostructured field so that the nanostructure provides for the fulfillment of the phase synchronism conditions

  9. Diode having trenches in a semiconductor region

    Energy Technology Data Exchange (ETDEWEB)

    Palacios, Tomas Apostol; Lu, Bin; Matioli, Elison de Nazareth

    2016-03-22

    An electrode structure is described in which conductive regions are recessed into a semiconductor region. Trenches may be formed in a semiconductor region, such that conductive regions can be formed in the trenches. The electrode structure may be used in semiconductor devices such as field effect transistors or diodes. Nitride-based power semiconductor devices are described including such an electrode structure, which can reduce leakage current and otherwise improve performance.

  10. Components of Adenovirus Genome Packaging

    Science.gov (United States)

    Ahi, Yadvinder S.; Mittal, Suresh K.

    2016-01-01

    Adenoviruses (AdVs) are icosahedral viruses with double-stranded DNA (dsDNA) genomes. Genome packaging in AdV is thought to be similar to that seen in dsDNA containing icosahedral bacteriophages and herpesviruses. Specific recognition of the AdV genome is mediated by a packaging domain located close to the left end of the viral genome and is mediated by the viral packaging machinery. Our understanding of the role of various components of the viral packaging machinery in AdV genome packaging has greatly advanced in recent years. Characterization of empty capsids assembled in the absence of one or more components involved in packaging, identification of the unique vertex, and demonstration of the role of IVa2, the putative packaging ATPase, in genome packaging have provided compelling evidence that AdVs follow a sequential assembly pathway. This review provides a detailed discussion on the functions of the various viral and cellular factors involved in AdV genome packaging. We conclude by briefly discussing the roles of the empty capsids, assembly intermediates, scaffolding proteins, portal vertex and DNA encapsidating enzymes in AdV assembly and packaging. PMID:27721809

  11. Packaging-radiation disinfestation relationships

    International Nuclear Information System (INIS)

    Highland, H.A.

    1985-01-01

    Foods that are susceptible to insect infestation can be irradiated to destroy the infestation; however, the food must be kept essentially insect-free until consumed, or it must be disinfested again, perhaps repeatedly. Insect-resistant packages can be used to prevent reinfestation, but there are certain requirements that must be fulfilled before a package can be made insect resistant. These include the use of insect-light construction and packaging materials that resist boring insects. The relative insect resistance of various packages and packaging materials is discussed, as are behavior traits such as egressive boring that enables insects to escape from packages and the ability of insects to climb on various packaging materials. Some successful and unsuccessful attempts to make various types of packages insect resistant are discussed, as are factors that must be considered in the selection or development of insect-resistant packages for radiation disinfested foods. The latter factors include biological and physical environments, length of storage periods, stresses on packages during shipment, types of storage facilities, governmental regulations, health requirements, and others

  12. Radioactive material packaging performance testing

    International Nuclear Information System (INIS)

    Romano, T.; Cruse, J.M.

    1991-02-01

    To provide uniform packaging of hazardous materials on an international level, the United Nations has developed packaging recommendations that have been implemented worldwide. The United Nations packaging recommendations are performance oriented, allowing for a wide variety of package materials and systems. As a result of this international standard, efforts in the United States are being directed toward use of performance-oriented packaging and elimination of specification (designed) packaging. This presentation will focus on trends, design evaluation, and performance testing of radioactive material packaging. The impacts of US Department of Transportation Dockets HM-181 and HM-169A on specification and low-specific activity radioactive material packaging requirements are briefly discussed. The US Department of Energy's program for evaluating radioactive material packings per US Department of Transportation Specification 7A Type A requirements, is used as the basis for discussing low-activity packaging performance test requirements. High-activity package testing requirements are presented with examples of testing performed at the Hanford Site that is operated by Westinghouse Hanford Company for the US Department of Energy. 5 refs., 2 tabs

  13. Industrial packaging and assembly infrastructure for MOEMS

    Science.gov (United States)

    van Heeren, Henne

    2004-01-01

    , packaging and assembly is from nature application specific and solutions found are not always transferable from one product to another. But designers can often benefit from experience from other and general available technologies. A number of companies offer packaging and assembly services for MEMS/MST and this report give typical examples of those commercial services. The companies range from small start-ups, offering very specialized services, to large semiconductor packaging companies, having production lines for microsystem based products. Selecting the proper packaging method may tip the scales towards a product success or towards a product failure, while it nearly always present s a substantial part of the cost of the product. This is therefore is not a marginal concern, but a crucial part of the product design. The presentation will also address mayor trends and technologies. Finally, the article provides sufficient levels of classification and categorisation for various aspects for the technologies, in specific, and the industry, in general, to provide particularly useful insights into the activities and the developments in this market. With over 50 companies studied and assessed, it provides an up to date account of the state of this business and its future potential.

  14. Wafer-level packaging with compression-controlled seal ring bonding

    Science.gov (United States)

    Farino, Anthony J

    2013-11-05

    A device may be provided in a sealed package by aligning a seal ring provided on a first surface of a first semiconductor wafer in opposing relationship with a seal ring that is provided on a second surface of a second semiconductor wafer and surrounds a portion of the second wafer that contains the device. Forcible movement of the first and second wafer surfaces toward one another compresses the first and second seal rings against one another. A physical barrier against the movement, other than the first and second seal rings, is provided between the first and second wafer surfaces.

  15. Safety Analysis Report for packaging (onsite) steel waste package

    Energy Technology Data Exchange (ETDEWEB)

    BOEHNKE, W.M.

    2000-07-13

    The steel waste package is used primarily for the shipment of remote-handled radioactive waste from the 324 Building to the 200 Area for interim storage. The steel waste package is authorized for shipment of transuranic isotopes. The maximum allowable radioactive material that is authorized is 500,000 Ci. This exceeds the highway route controlled quantity (3,000 A{sub 2}s) and is a type B packaging.

  16. Safety Analysis Report for packaging (onsite) steel waste package

    International Nuclear Information System (INIS)

    BOEHNKE, W.M.

    2000-01-01

    The steel waste package is used primarily for the shipment of remote-handled radioactive waste from the 324 Building to the 200 Area for interim storage. The steel waste package is authorized for shipment of transuranic isotopes. The maximum allowable radioactive material that is authorized is 500,000 Ci. This exceeds the highway route controlled quantity (3,000 A 2 s) and is a type B packaging

  17. Automation and Integration in Semiconductor Manufacturing

    OpenAIRE

    Liao, Da-Yin

    2010-01-01

    Semiconductor automation originates from the prevention and avoidance of frauds in daily fab operations. As semiconductor technology and business continuously advance and grow, manufacturing systems must aggressively evolve to meet the changing technical and business requirements in this industry. Semiconductor manufacturing has been suffering pains from islands of automation. The problems associated with these systems are limited

  18. HPLOT: the graphics interface package for the HBOOK histogramming package

    International Nuclear Information System (INIS)

    Watkins, H.

    1978-01-01

    The subroutine package HPLOT described in this report, enables the CERN histogramming package HBOOK to produce high-quality pictures by means of high-resolution devices such as plotters. HPLOT can be implemented on any scientific computing system with a Fortran IV compiler and can be interfaced with any graphics package; spectral routines in addition to the basic ones enable users to embellish their histograms. Examples are also given of the use of HPLOT as a graphics package for plotting simple pictures without histograms. (Auth.)

  19. CH Packaging Operations Manual

    International Nuclear Information System (INIS)

    2008-01-01

    This document provides the user with instructions for assembling a payload. All the steps in Subsections 1.2, Preparing 55-Gallon Drum Payload Assembly; 1.3, Preparing 'Short' 85-Gallon Drum Payload Assembly (TRUPACT-II and HalfPACT); 1.4, Preparing 'Tall' 85-gallon Drum Payload Assembly (HalfPACT only); 1.5, Preparing 100-Gallon Drum Payload Assembly; 1.6, Preparing SWB Payload Assembly; and 1.7, Preparing TDOP Payload Assembly, must be completed, but may be performed in any order as long as radiological control steps are not bypassed. Transport trailer operations, package loading and unloading from transport trailers, hoisting and rigging activities such as ACGLF operations, equipment checkout and shutdown, and component inspection activities must be performed, but may be performed in any order and in parallel with other activities as long as radiological control steps are not bypassed. Steps involving OCA/ICV lid removal/installation and payload removal/loading may be performed in parallel if there are multiple operators working on the same packaging. Steps involving removal/installation of OCV/ICV upper and lower main O-rings must be performed in sequence.

  20. CH Packaging Operations Manual

    International Nuclear Information System (INIS)

    2009-01-01

    This document provides the user with instructions for assembling a payload. All the steps in Subsections 1.2, Preparing 55-Gallon Drum Payload Assembly; 1.3, Preparing 'Short' 85-Gallon Drum Payload Assembly (TRUPACT-II and HalfPACT); 1.4, Preparing 'Tall' 85-Gallon Drum Payload Assembly (HalfPACT only); 1.5, Preparing 100-Gallon Drum Payload Assembly; 1.6, Preparing Shielded Container Payload Assembly; 1.7, Preparing SWB Payload Assembly; and 1.8, Preparing TDOP Payload Assembly, must be completed, but may be performed in any order as long as radiological control steps are not bypassed. Transport trailer operations, package loading and unloading from transport trailers, hoisting and rigging activities such as ACGLF operations, equipment checkout and shutdown, and component inspection activities must be performed, but may be performed in any order and in parallel with other activities as long as radiological control steps are not bypassed. Steps involving OCA/ICV lid removal/installation and payload removal/loading may be performed in parallel if there are multiple operators working on the same packaging. Steps involving removal/installation of OCV/ICV upper and lower main O-rings must be performed in sequence, except as noted.

  1. CH Packaging Operations Manual

    Energy Technology Data Exchange (ETDEWEB)

    None, None

    2009-05-27

    This document provides the user with instructions for assembling a payload. All the steps in Subsections 1.2, Preparing 55-Gallon Drum Payload Assembly; 1.3, Preparing "Short" 85-Gallon Drum Payload Assembly (TRUPACT-II and HalfPACT); 1.4, Preparing "Tall" 85-Gallon Drum Payload Assembly (HalfPACT only); 1.5, Preparing 100-Gallon Drum Payload Assembly; 1.6, Preparing Shielded Container Payload Assembly; 1.7, Preparing SWB Payload Assembly; and 1.8, Preparing TDOP Payload Assembly, must be completed, but may be performed in any order as long as radiological control steps are not bypassed. Transport trailer operations, package loading and unloading from transport trailers, hoisting and rigging activities such as ACGLF operations, equipment checkout and shutdown, and component inspection activities must be performed, but may be performed in any order and in parallel with other activities as long as radiological control steps are not bypassed. Steps involving OCA/ICV lid removal/installation and payload removal/loading may be performed in parallel if there are multiple operators working on the same packaging. Steps involving removal/installation of OCV/ICV upper and lower main O-rings must be performed in sequence, except as noted.

  2. Packaging supplier inspection guide

    International Nuclear Information System (INIS)

    Stromberg, H.M.; Gregg, R.E.; Kido, C.; Boyle, C.D.

    1991-05-01

    This is document is a guide for conducting quality assurance inspections of transportations packaging suppliers, where suppliers are defined as designers, fabricators, distributors, users, or owners of transportation packaging. This document can be used during an inspection to determine regulatory compliance within the requirements of 10 Code of Federal Regulations, Part 71, Subpart H (10 CFR 71.101--71.135). The guidance described in this document provides a framework for an inspection. It provides the inspector with the flexibility to adapt the methods and concepts presented here to meet the needs of the particular facility being inspected. The guide was developed to ensure a structured and consistent approach for inspections. The method treats each activity at a supplier facility as a separate entity (or functional element), and combines the activities within the framework of an ''inspection tree.'' The method separates each functional element into several areas of performance and then identifies guidelines, based on regulatory requirements, to be used to qualitatively rate each area. This document was developed to serve as a field manual to facilitate the work of inspectors. 1 ref., 1 fig., 5 tabs

  3. Tamper indicating packaging

    International Nuclear Information System (INIS)

    Baumann, M.J.; Bartberger, J.C.; Welch, T.D.

    1994-01-01

    Protecting sensitive items from undetected tampering in an unattended environment is crucial to the success of non-proliferation efforts relying on the verification of critical activities. Tamper Indicating Packaging (TIP) technologies are applied to containers, packages, and equipment that require an indication of a tamper attempt. Examples include: the transportation and storage of nuclear material, the operation and shipment of surveillance equipment and monitoring sensors, and the retail storage of medicine and food products. The spectrum of adversarial tampering ranges from attempted concealment of a pin-hole sized penetration to the complete container replacement, which would involve counterfeiting efforts of various degrees. Sandia National Laboratories (SNL) has developed a technology base for advanced TIP materials, sensors, designs, and processes which can be adapted to various future monitoring systems. The purpose of this technology base is to investigate potential new technologies, and to perform basic research of advanced technologies. This paper will describe the theory of TIP technologies and recent investigations of TIP technologies at SNL

  4. Japan's electronic packaging technologies

    Science.gov (United States)

    Tummala, Rao R.; Pecht, Michael

    1995-02-01

    The JTEC panel found Japan to have significant leadership over the United States in the strategic area of electronic packaging. Many technologies and products once considered the 'heart and soul' of U.S. industry have been lost over the past decades to Japan and other Asian countries. The loss of consumer electronics technologies and products is the most notable of these losses, because electronics is the United States' largest employment sector and is critical for growth businesses in consumer products, computers, automobiles, aerospace, and telecommunications. In the past there was a distinction between consumer and industrial product technologies. While Japan concentrated on the consumer market, the United States dominated the industrial sector. No such distinction is anticipated in the future; the consumer-oriented technologies Japan has dominated are expected to characterize both domains. The future of U.S. competitiveness will, therefore, depend on the ability of the United States to rebuild its technological capabilities in the area of portable electronic packaging.

  5. Semiconductor nanostructures for infrared applications

    NARCIS (Netherlands)

    Zurauskiene, N.; Asmontas, S.; Dargys, A.; Kundrotas, J.; Janssen, G.; Goovaerts, E.; Marcinkevicius, S.; Koenraad, P.M.; Wolter, J.H.; Leon, R.

    2004-01-01

    We present the results of time-resolved photoluminescence (TRPL) and optically detected microwave resonance (ODMR) spectroscopy investigations of semiconductor quantum dots and quantum wells. The ODMR spectra of InAs/GaAs QDs were detected via modulation of the total intensity of the QDs emission

  6. A Brief History of ... Semiconductors

    Science.gov (United States)

    Jenkins, Tudor

    2005-01-01

    The development of studies in semiconductor materials is traced from its beginnings with Michael Faraday in 1833 to the production of the first silicon transistor in 1954, which heralded the age of silicon electronics and microelectronics. Prior to the advent of band theory, work was patchy and driven by needs of technology. However, the arrival…

  7. Semiconductor radiation detectors: device physics

    National Research Council Canada - National Science Library

    Lutz, Gerhard

    1999-01-01

    ..., including nuclear physics, elementary particle physics, optical and x-ray astronomy, medicine, and materials testing - and the number of applications is growing continually. Closely related, and initiated by the application of semiconductors, is the development of low-noise low-power integrated electronics for signal readout. The success of semicond...

  8. Towards filament free semiconductor lasers

    DEFF Research Database (Denmark)

    McInerney, John; O'Brien, Peter; Skovgaard, Peter M. W.

    2000-01-01

    We outline physical models and simulations for suppression of self-focusing and filamentation in large aperture semiconductor lasers. The principal technical objective is to generate multi-watt CW or quasi-CW outputs with nearly diffraction limited beams, suitable for long distance free space...... propagation structures in lasers and amplifiers which suppress lateral reflections....

  9. Ultrafast Spectroscopy of Semiconductor Devices

    DEFF Research Database (Denmark)

    Borri, Paola; Langbein, Wolfgang; Hvam, Jørn Marcher

    1999-01-01

    In this work we present an experimental technique for investigating ultrafast carrier dynamics in semiconductor optical amplifiers at room temperature. These dynamics, influenced by carrier heating, spectral hole-burning and two-photon absorption, are very important for device applications in inf...

  10. Radiation damage in semiconductor detectors

    International Nuclear Information System (INIS)

    Kraner, H.W.

    1981-12-01

    A survey is presented of the important damage-producing interactions in semiconductor detectors and estimates of defect numbers are made for MeV protons, neutrons and electrons. Damage effects of fast neutrons in germanium gamma ray spectrometers are given in some detail. General effects in silicon detectors are discussed and damage constants and their relationship to leakage current is introduced

  11. Fiscal 1998 achievement report on regional consortium research and development project. Venture business raising type regional consortium - Small business creation base type (Preparation of monodispersed spherical particles for solder materials for application to high density semiconductor packaging - 2nd year); 1998 nendo komitsudo handotai jisso no tame no tanbunsan kyukei handa ryushi no sakusei ni kansuru kenkyu seika hokokusho (dai 2 nendo)

    Energy Technology Data Exchange (ETDEWEB)

    NONE

    2000-03-01

    Fine solder grains have been developed, spherical in shape, uniform in diameter, high in dimensional precision, and high in surface cleanliness, which are necessary for the establishment of next-generation technologies of flip chip bonding and ball grid array which are indispensable for high-density high-reliability packaging of electronic devices such as LSI (large scale integration). Results attained in fiscal 1998 are described. A pulse pressure aided orifice injection method was used. Monodispersed grains are prepared for the Pb-63Sn solder and Sn-3.5Ag lead-free solder. In the case of a 200{mu}m-large orifice, the grain diameter was controlled to fall in the range of 190-210{mu}m and the accuracy was not lower than {+-}6{mu}m. The main goal of this project has been accomplished now that these figures were attained without a sorting process and satisfy the most rigorous conditions currently proposed by the industrial circle involved. The flow of hot liquid out of the orifice and the splitting process of grains were clarified by thermal hydraulic analysis. It was found that grains split and fly not because of instability due to Rayleigh surface waves but because of their liberation from surface tension when equipped with critical kinetic energy. (NEDO)

  12. Effective EUVL mask cleaning technology solutions for mask manufacturing and in-fab mask maintenance

    Science.gov (United States)

    Dietze, Uwe; Dress, Peter; Waehler, Tobias; Singh, Sherjang; Jonckheere, Rik; Baudemprez, Bart

    2011-03-01

    Extreme Ultraviolet Lithography (EUVL) is considered the leading lithography technology choice for semiconductor devices at 16nm HP node and beyond. However, before EUV Lithography can enter into High Volume Manufacturing (HVM) of advanced semiconductor devices, the ability to guarantee mask integrity at point-of-exposure must be established. Highly efficient, damage free mask cleaning plays a critical role during the mask manufacturing cycle and throughout the life of the mask, where the absence of a pellicle to protect the EUV mask increases the risk of contamination during storage, handling and use. In this paper, we will present effective EUVL mask cleaning technology solutions for mask manufacturing and in-fab mask maintenance, which employs an intelligent, holistic approach to maximize Mean Time Between Cleans (MBTC) and extend the useful life span of the reticle. The data presented will demonstrate the protection of the capping and absorber layers, preservation of pattern integrity as well as optical and mechanical properties to avoid unpredictable CD-linewidth and overlay shifts. Experiments were performed on EUV blanks and pattern masks using various process conditions. Conditions showing high particle removal efficiency (PRE) and minimum surface layer impact were then selected for durability studies. Surface layer impact was evaluated over multiple cleaning cycles by means of UV reflectivity metrology XPS analysis and wafer prints. Experimental results were compared to computational models. Mask life time predictions where made using the same computational models. The paper will provide a generic overview of the cleaning sequence which yielded best results, but will also provide recommendations for an efficient in-fab mask maintenance scheme, addressing handling, storage, cleaning and inspection.

  13. Transient photoconductivity in amorphous semiconductors

    International Nuclear Information System (INIS)

    Mpawenayo, P.

    1997-07-01

    Localized states in amorphous semiconductors are divided in disorder induced shallow trap levels and dangling bonds deep states. Dangling bonds are assumed here to be either neutral or charged and their energy distribution is a single gaussian. Here, it is shown analytically that transient photocurrent in amorphous semiconductors is fully controlled by charge carriers transitions between localized states for one part and tunneling hopping carriers on the other. Localized dangling bonds deep states act as non radiative recombination centres, while hopping tunnelling is assisted by the Coulomb interaction between defects sites. The half-width of defects distribution is the disorder parameter that determines the carrier hopping time between defects sites. The macroscopic time that explains the long decay response times observed will all types of amorphous semiconductors is duly thought to be temperature dependent. Basic equations developed by Longeaud and Kleider are solved for the general case of a semiconductor after photo-generation. It turns out that the transient photoconductivity decay has two components; one with short response times from carriers trap-release transitions between shallow levels and extended states and a hopping component made of inter-dependent exponentials whose time constants span in larger ranges depending on disorder. The photoconductivity hopping component appears as an additional term to be added to photocurrents derived from existing models. The results of the present study explain and complete the power law decay derived in the multiple trapping models developed 20 years ago only in the approximation of the short response time regime. The long response time regime is described by the hopping macroscopic time. The present model is verified for all samples of amorphous semiconductors known so far. Finally, it is proposed to improved the modulated photoconductivity calculation techniques by including the long-lasting hopping dark documents

  14. Cleaning Validation of Fermentation Tanks

    DEFF Research Database (Denmark)

    Salo, Satu; Friis, Alan; Wirtanen, Gun

    2008-01-01

    Reliable test methods for checking cleanliness are needed to evaluate and validate the cleaning process of fermentation tanks. Pilot scale tanks were used to test the applicability of various methods for this purpose. The methods found to be suitable for validation of the clenlinees were visula...

  15. Clean fuels from fossil sources

    International Nuclear Information System (INIS)

    Sanfilippo, D.

    2000-01-01

    Energy availability is determining to sustain the social development, but energy production involves environmental impacts at regional and global level. The central role of oil, natural gas, coal for energy supply will be kept for decades. The development of the engine-fuel combination to satisfy more stringent emissions limitations, is the challenge for an environmentally clean transportation system [it

  16. Portable sandblaster cleans small areas

    Science.gov (United States)

    Severin, H. J.

    1966-01-01

    Portable sandblasting unit rapidly and effectively cleans localized areas on a metal surface. The unit incorporates a bellows enclosure, masking plate, sand container, and used sand accummulator connected to a vacuum system. The bellows is equipped with an inspection window and light for observation of the sanding operation.

  17. Cleaning Massive Sonar Point Clouds

    DEFF Research Database (Denmark)

    Arge, Lars Allan; Larsen, Kasper Green; Mølhave, Thomas

    2010-01-01

    We consider the problem of automatically cleaning massive sonar data point clouds, that is, the problem of automatically removing noisy points that for example appear as a result of scans of (shoals of) fish, multiple reflections, scanner self-reflections, refraction in gas bubbles, and so on. We...

  18. Clean coal initiatives in Indiana

    Science.gov (United States)

    Bowen, B.H.; Irwin, M.W.; Sparrow, F.T.; Mastalerz, Maria; Yu, Z.; Kramer, R.A.

    2007-01-01

    Purpose - Indiana is listed among the top ten coal states in the USA and annually mines about 35 million short tons (million tons) of coal from the vast reserves of the US Midwest Illinois Coal Basin. The implementation and commercialization of clean coal technologies is important to the economy of the state and has a significant role in the state's energy plan for increasing the use of the state's natural resources. Coal is a substantial Indiana energy resource and also has stable and relatively low costs, compared with the increasing costs of other major fuels. This indigenous energy source enables the promotion of energy independence. The purpose of this paper is to outline the significance of clean coal projects for achieving this objective. Design/methodology/approach - The paper outlines the clean coal initiatives being taken in Indiana and the research carried out at the Indiana Center for Coal Technology Research. Findings - Clean coal power generation and coal for transportation fuels (coal-to-liquids - CTL) are two major topics being investigated in Indiana. Coking coal, data compilation of the bituminous coal qualities within the Indiana coal beds, reducing dependence on coal imports, and provision of an emissions free environment are important topics to state legislators. Originality/value - Lessons learnt from these projects will be of value to other states and countries.

  19. Meeting the clean air demand

    International Nuclear Information System (INIS)

    Hocker, C.

    1991-01-01

    This article addresses the impacts to the emissions control industry and the future of small independent projects of the Clean Air Act. Topics discussed include technological and market niche of pollution control companies, risk reduction by owning and operating the emission control portion of the plant as a separate entity, the diversity of technologies, and legislative effects

  20. Laser cleaning on Roman coins

    Science.gov (United States)

    Drakaki, E.; Karydas, A. G.; Klinkenberg, B.; Kokkoris, M.; Serafetinides, A. A.; Stavrou, E.; Vlastou, R.; Zarkadas, C.

    Ancient metal objects react with moisture and environmental chemicals to form various corrosion products. Because of the unique character and high value of such objects, any cleaning procedure should guarantee minimum destructiveness. The most common treatment used is mechanical stripping, in which it is difficult to avoid surface damage when employed. Lasers are currently being tested for a wide range of conservation applications. Since they are highly controllable and can be selectively applied, lasers can be used to achieve more effective and safer cleaning of archaeological artifacts and protect their surface details. The basic criterion that motivated us to use lasers to clean Roman coins was the requirement of pulsed emission, in order to minimize heat-induced damages. In fact, the laser interaction with the coins has to be short enough, to produce a fast removal of the encrustation, avoiding heat conduction into the substrate. The cleaning effects of three lasers operating at different wavelengths, namely a TEA CO2 laser emitting at 10.6 μm, an Er:YAG laser at 2.94 μm, and a 2ω-Nd:YAG laser at 532 nm have been compared on corroded Romans coins and various atomic and nuclear techniques have also been applied to evaluate the efficiency of the applied procedure.