WorldWideScience

Sample records for circuit boards assembled

  1. International standards for optical circuit board fabrication, assembly and measurement

    Science.gov (United States)

    Pitwon, Richard; Immonen, Marika; Wang, Kai; Itoh, Hideo; Shioda, Tsuyoshi; Wu, Jinhua; Zhu, Long Xiu; Yan, Hui Juan; Worrall, Alex

    2016-03-01

    The commercial adoption of electro-optical printed circuit board (EOCB) technology will be accelerated by the development of industrial and conformity standards for high volume fabrication, connector assembly and waveguide measurement. In this paper, we introduce international standardisation activities surrounding EOCBs and report on industrial processes developed for the high volume fabrication of complex EOCBs with embedded multimode polymer waveguides including a first connector standard for polymer waveguide termination. We focus on solving a serious historic problem with the measurement of optical waveguide systems, namely the lack of harmonised measurement conditions for optical waveguides, which to this day gives rise to strong inconsistencies in the results of measurements by different parties on the same waveguide. We report on the development of a standard to ensure repeatable measurement of optical waveguides, whereby we demonstrate how the application of a measurement identification system and proposed reference measurement conditions can bring variation in measurement results to within 5%, thereby serving as the basis for a formal reliable optical waveguide measurement methodology.

  2. Problem-Solving at a Circuit-Board Assembly Machine: A Microanalysis.

    Science.gov (United States)

    Kleifgen, Jo Anne; Frenz-Belken, Patricia

    A study described machine operators' problem-solving actions at a computerized circuit-board assembly machine in a small manufacturing plant located on the West Coast. Participants were a machine operator and his supervisor, both from Vietnam, who were building large prototype boards for a major computer corporation. Over a 6.5 minute interval,…

  3. An Integer Programming-Based Generalized Vehicle Routing Approach for Printed Circuit Board Assembly Optimization

    Science.gov (United States)

    Seth, Anupam

    2009-01-01

    Production planning and scheduling for printed circuit, board assembly has so far defied standard operations research approaches due to the size and complexity of the underlying problems, resulting in unexploited automation flexibility. In this thesis, the increasingly popular collect-and-place machine configuration is studied and the assembly…

  4. Contamination profile on typical printed circuit board assemblies vs soldering process

    DEFF Research Database (Denmark)

    Conseil, Helene; Jellesen, Morten Stendahl; Ambat, Rajan

    2014-01-01

    Purpose – The purpose of this paper was to analyse typical printed circuit board assemblies (PCBAs) processed by reflow, wave or selective wave soldering for typical levels of process-related residues, resulting from a specific or combination of soldering processes. Typical solder flux residue...... structure was identified by Fourier transform infrared spectroscopy, while the concentration was measured using ion chromatography, and the electrical properties of the extracts were determined by measuring the leak current using a twin platinum electrode set-up. Localized extraction of residue was carried...

  5. Workload Balancing in Printed Circuit Board Assembly Shops = Baskili Devre Karti Dizgi Atölyelerinde Hat Dengeleme

    Directory of Open Access Journals (Sweden)

    Ekrem DUMAN

    2005-01-01

    Full Text Available In assembling printed circuit boards (PCB, the use of numerically or computer controlled electronic component placement machines has become quite popular in the last decades. However, serious operations research problems arise through their use such as, allocation of component types to machines, board production schedule, feeder configuration and placement sequencing. In this study, the problem of allocation of component types to machines is taken up where two non-identical machines are deployed serially on a line to complete the assembly process of PCBs. For the solution of this problem three heuristic algorithms are suggested and their performances are investigated on experimental data.

  6. An Evaluation of Prototype Circuit Boards Assembled with a Sn-Ag Bi Solder

    International Nuclear Information System (INIS)

    An evaluation was performed which examined the aging of surface mount solder joints assembled with 91.84Sn-3.33Ag-4.83Bi solder. Defect analysis of the as-fabricated test vehicles revealed excellent solderability, good package alignment, and a minimum number of voids. Continuous DC electrical monitoring of the solder joints did not reveal opens during as many as 10,000 thermal cycles (0 C, 100 C). The solder joints exhibited no significant degradation through 2500 cycles, based upon an absence of microstructural damage and sustained shear and pull strengths of chip capacitors and J-leaded solder joints, respectively. Thermal cycles of 5000 and 10,000 resulted in some surface cracking of the solder fillets and coatings. In a few cases, deeper cracks were observed in the thinner reaches of several solder fillets. There was no deformation or cracking in the solder located in the gap between the package I/O and the circuit board pad nor in the interior of the fillets, both locations that would raise concerns of joint mechanical integrity. A drop in the chip capacitor shear strength was attributed to crack growth near the top of the fillet

  7. Training Circuit Boards

    Science.gov (United States)

    1986-01-01

    Young Electronics Company's new product is a testboard developed by the Jet Propulsion Laboratory as a tool for training and qualifying personnel in board assembly and in the art of soldering components without damaging boards or components. The boards are used for pre- employment testing and employee requalification.

  8. Impact of NaCl Contamination and Climatic Conditions on the Reliability of Printed Circuit Board Assemblies

    DEFF Research Database (Denmark)

    Verdingovas, Vadimas; Jellesen, Morten Stendahl; Ambat, Rajan

    2014-01-01

    The effect of climatic conditions and ionic contamination on the reliability of printed circuit board assembly has been investigated in terms of leakage current (LC) and electrochemical migration susceptibility. The change in LC as a function of relative humidity (RH) and temperature was measured...... using single components (size 0805) and surface insulation resistance comb patterns precontaminated with sodium chloride at levels adjacent to levels used in the IPC J-STD-001 standard. The potential bias of 5–10 V was applied during experiments, and the climatic conditions were in the range 60%–98% RH...... and 15 $^{\\circ}\\hbox{C}$ –65 $^{\\circ}\\hbox{C}$. The variation of RH at the surface of the test specimens was imposed by 1) increasing the RH of the surrounding air and 2) reducing the temperature of the printed circuit boards using a cooling stage, while maintaining a constant climatic condition in...

  9. Assembling surface mounted components on ink-jet printed double sided paper circuit board

    International Nuclear Information System (INIS)

    Printed electronics is a rapidly developing field where many components can already be manufactured on flexible substrates by printing or by other high speed manufacturing methods. However, the functionality of even the most inexpensive microcontroller or other integrated circuit is, at the present time and for the foreseeable future, out of reach by means of fully printed components. Therefore, it is of interest to investigate hybrid printed electronics, where regular electrical components are mounted on flexible substrates to achieve high functionality at a low cost. Moreover, the use of paper as a substrate for printed electronics is of growing interest because it is an environmentally friendly and renewable material and is, additionally, the main material used for many packages in which electronics functionalities could be integrated. One of the challenges for such hybrid printed electronics is the mounting of the components and the interconnection between layers on flexible substrates with printed conductive tracks that should provide as low a resistance as possible while still being able to be used in a high speed manufacturing process. In this article, several conductive adhesives are evaluated as well as soldering for mounting surface mounted components on a paper circuit board with ink-jet printed tracks and, in addition, a double sided Arduino compatible circuit board is manufactured and programmed. (paper)

  10. Assembling surface mounted components on ink-jet printed double sided paper circuit board

    Science.gov (United States)

    Andersson, Henrik A.; Manuilskiy, Anatoliy; Haller, Stefan; Hummelgård, Magnus; Sidén, Johan; Hummelgård, Christine; Olin, Håkan; Nilsson, Hans-Erik

    2014-03-01

    Printed electronics is a rapidly developing field where many components can already be manufactured on flexible substrates by printing or by other high speed manufacturing methods. However, the functionality of even the most inexpensive microcontroller or other integrated circuit is, at the present time and for the foreseeable future, out of reach by means of fully printed components. Therefore, it is of interest to investigate hybrid printed electronics, where regular electrical components are mounted on flexible substrates to achieve high functionality at a low cost. Moreover, the use of paper as a substrate for printed electronics is of growing interest because it is an environmentally friendly and renewable material and is, additionally, the main material used for many packages in which electronics functionalities could be integrated. One of the challenges for such hybrid printed electronics is the mounting of the components and the interconnection between layers on flexible substrates with printed conductive tracks that should provide as low a resistance as possible while still being able to be used in a high speed manufacturing process. In this article, several conductive adhesives are evaluated as well as soldering for mounting surface mounted components on a paper circuit board with ink-jet printed tracks and, in addition, a double sided Arduino compatible circuit board is manufactured and programmed.

  11. Primer printed circuit boards

    CERN Document Server

    Argyle, Andrew

    2009-01-01

    Step-by-step instructions for making your own PCBs at home. Making your own printed circuit board (PCB) might seem a daunting task, but once you master the steps, it's easy to attain professional-looking results. Printed circuit boards, which connect chips and other components, are what make almost all modern electronic devices possible. PCBs are made from sheets of fiberglass clad with copper, usually in multiplelayers. Cut a computer motherboard in two, for instance, and you'll often see five or more differently patterned layers. Making boards at home is relatively easy

  12. Effect of solder flux residue on the performance of silicone conformal coatings on printed circuit board assemblies

    DEFF Research Database (Denmark)

    Rathinavelu, Umadevi; Jellesen, Morten Stendahl; Ambat, Rajan

    2013-01-01

    is the focus of this paper. Different test substrates such as plain laminate surface and a test PCBA with and without conformal coatings were exposed to high humid environment at ambient temperature and the performance of the coating was evaluated using various parameters such as increase in leakage......Conformal coatings are applied on printed circuit board assemblies (PCBAs) in order to protect the assembly from environmental influence and silicone-based coating is commonly used. A systematic study on the performance of silicone conformal coating in connection with process-related contaminants...... current across the components, morphology of the coating, and analysis of dendrite formation due to electrochemical migration under the coating. The morphology of the coating before and after exposure was investigated using scanning electron microscopy, and energy dispersive X-ray spectroscopy. Results...

  13. An Investigation into the Package and Printed Circuit Board Assembly Solutions of an Ultrathin Coreless Flip-Chip Substrate

    Science.gov (United States)

    Chang, Jing-Yao; Chaung, Tung-Han; Chang, Tao-Chih

    2015-10-01

    Flip-chip technology has been widely accepted as a solution for electronic packaging of high-pin-count devices. Due to the demand for smaller and thinner package dimensions, coreless build-up substrates will be used in industry to carry the die by solder bumps due to the advantages of shorter transmission route and lower inductance and thermal resistance. However, coefficient of thermal expansion (CTE) mismatch between the Cu trace and the laminate often causes the coreless substrate to warp, which leads to failures such as nonwetted solder bumps and interfacial cracking during assembly and reliability tests. In a previous study, assembly of a six-layer polyimide-based coreless flip-chip package was achieved by a 17 mm × 17 mm die with 4355 Sn-37Pb solder bumps, an amide-based underfill, and 1521 Sn-3.0Ag-0.5Cu solder balls. For determination of its board-level reliability characteristics, the component was mounted on a printed circuit board (PCB) using a conventional surface mount technology, and 10 test vehicles were assembled for assessment of their reliability under a temperature cycling environment. The experimental results show that the characteristic life of the PCB assembly exceeded 1500 cycles and that failure resulted from fracture of the outermost solder balls on the substrate side. This was different from the failure mode of die cracking when the package experienced hundreds of temperature cycles at the component level because the rigid PCB, through solder balls, moderated the deformation of the coreless flip-chip package. Hence, the concentrated bending stress at the die edge region was lowered. Finally, the local CTE mismatch between the stiffener and the PCB dominated the fatigue fracture of the outermost solder balls to become the main failure mode.

  14. 混装电路板焊接工艺设计%Process Design of Soldering for Mix-assembled Circuit Board

    Institute of Scientific and Technical Information of China (English)

    徐冬霞; 韩飞

    2011-01-01

    Manual iron soldering of certain mix-assembled circuit board product was used as an example, process design of soldering for mix-assembled circuit board was introduced, including criteria of soldering procedure, choice of soldering method and key points of process design. It could serve as a basis and reference for process design of like products in future.%本文以某产品的混装电路板手工焊接为例,介绍了混装电路板焊接工艺设计的过程,包括工艺设计的依据、焊接方法的选择以及工艺设计的要点,可作为今后类似产品的设计依据和参考.

  15. COMPUTER MACHINE VISION INSPECTION ON PRINTED CIRCUIT BOARDS FLUX DEFECTS

    OpenAIRE

    Ang TeohOng; Zulkifilie Bin Ibrahim; Suzaimah Ramli

    2013-01-01

    The new visual inspection systems techniques using real time machine vision replace the human visual manual inspection on PCB flux defects, which brings harmful effects on the board which may come in the form of corrosion and can cause harm to the assembly. In short, it brings improvement in Printed Circuit Boards (PCB) production quality, principally concerning the acceptance or rejection of the PCB boards. To develop new algorithm in image processing which detects flux defect at PCB board d...

  16. CAD-CAM printed circuit board design

    Science.gov (United States)

    Agy, W. E.

    A step-by-step procedure for a printed circuit design achieved by CAD is presented. The operator at the interactive CRT station moves a stylus across a graphics tablet and intersperses commands which result in computer-generated pictorial forms on the screen that were drawn on the pad. Standard symbols are used for commands allowing, for instance, connections to be made of specific types in certain locations, which can be automatically edited from a materials list. An entire network of drawn lines can be referenced by a signal name for recall, and a finished circuit schematic can be checked for designs rules compliance, including fault reporting in terms of designator/pin number. A map may be present delineating the boundaries of the circuitry area, and previously completed circuitry segments can be recalled for piece-by-piece assembly of the circuit board.

  17. Digital circuit boards mach 1 GHz

    CERN Document Server

    Morrison, Ralph

    2012-01-01

    A unique, practical approach to the design of high-speed digital circuit boards The demand for ever-faster digital circuit designs is beginning to render the circuit theory used by engineers ineffective. Digital Circuit Boards presents an alternative to the circuit theory approach, emphasizing energy flow rather than just signal interconnection to explain logic circuit behavior. The book shows how treating design in terms of transmission lines will ensure that the logic will function, addressing both storage and movement of electrical energy on these lines. It cove

  18. Sustainability issues in circuit board recycling

    DEFF Research Database (Denmark)

    Legarth, Jens Brøbech; Alting, Leo; Baldo, Gian Luca

    1995-01-01

    The resource recovery and environmental impact issues of printed circuit board recycling by secondary copper smelters are discussed. Guidelines concerning material selection for circuit board manufacture and concerning the recycling processes are given to enhance recovery efficiency and to lower...... the impacts on the external environment from recycling...

  19. Optical printed circuit board and manufacturing method

    OpenAIRE

    Johnson, I. D.; Pitwon, R.C.A.; Selviah, D. R.; Papakonstantinou, I.

    2007-01-01

    The invention provides a method of manufacturing an optical printed circuit board and an optical printed circuit board. The method comprises providing a support layer; on the support layer, providing an optical core layer; forming optical channels from the optical core layer and surrounding the optical channels with cladding thereby forming optical waveguides; and during said step of forming the optical channels, forming one or more alignment features (e.g. projections) on the optical printed...

  20. A guide to printed circuit board design

    CERN Document Server

    Hamilton, Charles

    1984-01-01

    A Guide to Printed Circuit Board Design discusses the basic design principles of printed circuit board (PCB). The book consists of nine chapters; each chapter provides both text discussion and illustration relevant to the topic being discussed. Chapter 1 talks about understanding the circuit diagram, and Chapter 2 covers how to compile component information file. Chapter 3 deals with the design layout, while Chapter 4 talks about preparing the master artworks. The book also covers generating computer aided design (CAD) master patterns, and then discusses how to prepare the production drawing a

  1. Pyrolysis of Waste Printed Circuit Board Particles

    OpenAIRE

    Şule Atasever; Pınar A. Bozkurt; Muammer Canel

    2015-01-01

    Electrical and electronic apparatus and instruments which are obsolete value in use or completion of the life can be defined as e-waste. E-waste is one of the fastest growing types of hazardous waste. Printed circuit boards a major component of this waste. In this study, printed circuit board particles of mobile phone (MPCB) were used as electronic waste. MPCB waste was obtained from a local electronic waste factory. The elemental analysis and ICP-MS analysis were performed on these electroni...

  2. Vacuum pyrolysis of waste print circuit board

    Institute of Scientific and Technical Information of China (English)

    GAN Ge; CHEN Lie-qiang; PENG Shao-hong; CAI Ming-zhao

    2005-01-01

    Waste print circuit board containing 11.38% Br was pyrolyzed in vacuum.Thermal stability of waste print circuit board was studied under vacuum condition by thermo-gravimetry(TG). Vacuum pyrolysis of WPCB was studied emphasizing on the kinetics of WPCB pyrolysis reactions. Based on the TG results, a kinetic model was proposed. Kinetic parameters were calculated for reaction with this model including all stages of decomposition. The average activation energy is 68 k J/mol with reaction order 3. These findings provide new insights into the WPCB thermal decomposition and useful data for rational design and operation of pyrolysis.

  3. Improving Heat Transfer Performance of Printed Circuit Boards

    Science.gov (United States)

    Schatzel, Donald V.

    2009-01-01

    This paper will explore the ability of printed circuit boards laminated with a Carbon Core Laminate to transfer heat vs. standard printed circuit boards that use only thick layers of copper. The paper will compare the differences in heat transfer performance of printed circuit boards with and without CCL.

  4. Laser prototyping of printed circuit boards

    Science.gov (United States)

    Nowak, M. R.; Antończak, A. J.; Kozioł, P. E.; Abramski, K. M.

    2013-09-01

    This paper describes the application of laser micromachining to rapid prototyping of printed circuit boards (PCB) using nano-second lasers: the solid-state Nd:YAG (532/1064 nm) laser and the Yb:glass fiber laser (1060 nm). Our investigations included tests for various mask types (synthetic lacquer, light-sensitive emulsion and tin). The purpose of these tests was to determine some of the basic parameters such as the resolution of PCB prototyping, speed of processing and quality of PCB mapping with commonly available laser systems. Optimization of process parameters and the proposed conversion algorithm have allowed us to produce circuit boards with a resolution similar to that of the Laser Direct Imaging (LDI) technology.

  5. Developing 300°C Ceramic Circuit Boards

    Energy Technology Data Exchange (ETDEWEB)

    Normann, Randy A

    2015-02-15

    This paper covers the development of a geothermal ceramic circuit board technology using 3D traces in a machinable ceramic. Test results showing the circuit board to be operational to at least 550°C. Discussion on producing this type of board is outlined along with areas needing improvement.

  6. Packaging printed circuit boards: A production application of interactive graphics

    Science.gov (United States)

    Perrill, W. A.

    1975-01-01

    The structure and use of an Interactive Graphics Packaging Program (IGPP), conceived to apply computer graphics to the design of packaging electronic circuits onto printed circuit boards (PCB), were described. The intent was to combine the data storage and manipulative power of the computer with the imaginative, intuitive power of a human designer. The hardware includes a CDC 6400 computer and two CDC 777 terminals with CRT screens, light pens, and keyboards. The program is written in FORTRAN 4 extended with the exception of a few functions coded in COMPASS (assembly language). The IGPP performs four major functions for the designer: (1) data input and display, (2) component placement (automatic or manual), (3) conductor path routing (automatic or manual), and (4) data output. The most complex PCB packaged to date measured 16.5 cm by 19 cm and contained 380 components, two layers of ground planes and four layers of conductors mixed with ground planes.

  7. COMPUTER MACHINE VISION INSPECTION ON PRINTED CIRCUIT BOARDS FLUX DEFECTS

    Directory of Open Access Journals (Sweden)

    Ang TeohOng

    2013-01-01

    Full Text Available The new visual inspection systems techniques using real time machine vision replace the human visual manual inspection on PCB flux defects, which brings harmful effects on the board which may come in the form of corrosion and can cause harm to the assembly. In short, it brings improvement in Printed Circuit Boards (PCB production quality, principally concerning the acceptance or rejection of the PCB boards. To develop new algorithm in image processing which detects flux defect at PCB board during re-flow process and achieve good accuracy of the PCB quality checking. The machine will be designed and fabricated with the total automation control system with mechanical PCB loader/un-loader, pneumatic system handler with vacuum cap, vision inspection station and final classification station (accept or reject. The image processing system is based on shape (pattern and color image analysis techniques with Matrox Imaging Library. The shape/texture of the PCB pins is analyzed by using pattern matching technique to detect the PCB flux defect area. The color analysis of the flux defect in a PCB boards are processed based on their red color pixel percentage in Red, Green and Blue (RGB model. The red color filter band mean value of histogram is measured and compared to the value threshold to determine the occurring on the PCB flux defects. The system was tested with PCB boards from factory production line and achieved PCB board flux defects sorting accuracy at 86.0% based on proposed pattern matching technique combined with red color filter band histogram.

  8. Electro-optical circuit board with single-mode glass waveguide optical interconnects

    Science.gov (United States)

    Brusberg, Lars; Neitz, Marcel; Pernthaler, Dominik; Weber, Daniel; Sirbu, Bogdan; Herbst, Christian; Frey, Christopher; Queisser, Marco; Wöhrmann, Markus; Manessis, Dionysios; Schild, Beatrice; Oppermann, Hermann; Eichhammer, Yann; Schröder, Henning; Hâkansson, Andreas; Tekin, Tolga

    2016-03-01

    A glass optical waveguide process has been developed for fabrication of electro-optical circuit boards (EOCB). Very thin glass panels with planar integrated single-mode waveguides can be embedded as a core layer in printed circuit boards for high-speed board-level chip-to-chip and board-to-board optical interconnects over an optical backplane. Such singlemode EOCBs will be needed in upcoming high performance computers and data storage network environments in case single-mode operating silicon photonic ICs generate high-bandwidth signals [1]. The paper will describe some project results of the ongoing PhoxTroT project, in which a development of glass based single-mode on-board and board-to-board interconnection platform is successfully in progress. The optical design comprises a 500 μm thin glass panel (Schott D263Teco) with purely optical layers for single-mode glass waveguides. The board size is accommodated to the mask size limitations of the fabrication (200 mm wafer level process, being later transferred also to larger panel size). Our concept consists of directly assembling of silicon photonic ICs on cut-out areas in glass-based optical waveguide panels. A part of the electrical wiring is patterned by thin film technology directly on the glass wafer surface. A coupling element will be assembled on bottom side of the glass-based waveguide panel for 3D coupling between board-level glass waveguides and chip-level silicon waveguides. The laminate has a defined window for direct glass access for assembling of the photonic integrated circuit chip and optical coupling element. The paper describes the design, fabrication and characterization of glass-based electro-optical circuit board with format of (228 x 305) mm2.

  9. 重构印刷电路板的装配过程:一个案例研究%REENGINEERING THE ASSEMBLY PROCESSES OF PRINTED CIRCUIT BOARDS:A CASE STUDY

    Institute of Scientific and Technical Information of China (English)

    朱秀文; 左明健

    2000-01-01

    This paper reports the reengineering of the assembly processes of printed circuit boards (PCBs) used in computers.The new designed assembly processes are quite different from the traditional ones,and the business performance is dramatically improved through establishing parallel workstations,off-line workstation,merging workstations and organizing a small teamwork who cooperates in stations."ITHINK",a software package of business process reengineering (BPR),was used to analyze the current processes and create new processes.ITHINK is a powerful tool of BPR in modeling business processes,"soft" variables and conducting sensitivity analysis.The new assembly processes were tested over a period of 8 hours simulation.The results show that the new processes can increase throughput by 80% with only requiring less additional resources.The throughput can increase further by 17.5% when a small teamwork cooperates in some stations.%研究计算机用印刷电路板装配过程的重构.新设计的装配过程通过建立并行和线外工作站、合并某些工作站及组织联合操作的团队,显著地改善了企业绩效.在8 h的模拟周期内对新的装配过程进行了实验.结果表明,在增加少量资源的情况下,新的装配过程使产量增加80%.一个小团队在某些工作站联合操作,产量可进一步增加17.5%.

  10. Polymer circuit boards fabricated by ultrasonic hot embossing

    International Nuclear Information System (INIS)

    In this paper, a novel polymer circuit board fabricated by ultrasonic hot embossing is presented. Conductive paths are generated by ultrasonically embossing interruptions into a continuous metal layer coated onto a plastic substrate, and all electronic components are mounted onto the board in a single ultrasonic process step. With this process both the fabrication of a board and the interconnection of electronic components can be achieved in seconds. Overall dimensions of the board are determined by the size of the sonotrode of the ultrasonic machine. As a demonstrator a multivibrator circuit was built up from five resistors, two LEDs, two transistors and two capacitors. The multivibrator was tested successfully. (paper)

  11. Design and Implementation of A Circuit Board Calibration System

    Directory of Open Access Journals (Sweden)

    Bai Hang

    2016-01-01

    Full Text Available With the development of science and technology, the traditional artificial detection methods cannot meet the requirements of modern equipment testing and calibration. Combined with the actual demand, a kind of circuit boards calibration system are put forward. It can to realize automatic testing and calibration of the circuit boards. Many functions of the calibration system such as automatic testing, self-test and monitoring are summarized. The hardware is introduced which including the industrial computer system, calibration adapter and so on. Then, development platform, the thought of program design and the structure of the software are introduced in detail. The function of automatic calibration to specific circuit boards are realized. Because the system has good commonality and easy to extend to upgrade, the development ideas and experiences can be applied to similar circuit boards automatic testing system.

  12. WASTE PRINTED CIRCUIT BOARDS SEPARATION IN ELECTROSTATIC SEPARATOR

    OpenAIRE

    Branimir Fuk

    2012-01-01

    Printed circuit boards from electronic waste are very important source of precious metals by recycling. The biggest challenge is liberation and separation of useful components; thin film which contains copper, zinc, tin, lead and precious metals like silver, gold and palladium from non useful components; polymers, ceramics and glass fibbers. The paper presents results for separation of shredded printed circuit boards from TV sets in electrostatic separator. Testing where conducted with materi...

  13. Application of Pallet in Wave Soldering for Mix-assembled Circuit Board%托盘在混装电路板波峰焊接的应用

    Institute of Scientific and Technical Information of China (English)

    吴建生

    2011-01-01

    With the maturity of SMT(Surface Mount Technology) day by day, the application and performance requirement of wave solder pallet is higher in mix assembly and some problems of wave soldering technology are brought. Introduce the application and material selection of pallet. Put forward the solutions from manufacture process of pallet and requirements of PCB Designs. Improve quality of wave soldering by enhancing quantitative management and control.%随着表面贴装技术工艺的日趋成熟,对波峰焊托盘在混装电路板组装的应用要求也越来越高,托盘的使用也带来一些工艺问题,通过对托盘的选材及其应用的介绍,力求从托盘加工制作和PCB设计要求等方面提出解决方案,做出量化管理与控制,以提高波峰焊接质量,推进波峰托盘在电子产品组装焊接中的应用.

  14. Process produces accurate registry between circuit board prints

    Science.gov (United States)

    1966-01-01

    Tapes and quick-mount circles of contrasting colors aid in obtaining precise registry between the two circuits of two-sided printed circuit boards. The tapes and circles are mounted on opposite sides of transparent plastic film to define the conductive path and feed-through hole locations.

  15. Evaluation of building technology for mass producible millimetre-sized robots using flexible printed circuit boards

    International Nuclear Information System (INIS)

    Initial tests of a building technology for a compact three-dimensional mass producible microrobot are presented. The 3.9 × 3.9 × 3.3 mm3 sized prototype robot represents a microsystem with actuators, sensors, energy management and integrated electronics. The weight of a folded robot is 65 mg and the total volume is less than 23 mm3. The design of the interfaces of the different modules in the robot, as well as the building technology, is described. The modules are assembled using conductive adhesive with industrial surface mounting technology on a thin double-sided flexible printed circuit board. The final shape of the microrobots is achieved by folding the flexible printed circuit board twice. Electrical and mechanical studies are performed to evaluate the assembly and it is concluded that the technology can be used for this type of microsystem. Several issues using the presented assembly technique are identified and addressed

  16. Optical printed circuit board (O-PCB) for VLSI micro/nano-photonic application

    Science.gov (United States)

    Lee, El-Hang; Lee, S. G.; O, B. H.; Park, S. G.; Kim, K. H.; Kang, J. K.; Chin, I.; Kwon, Y. K.; Choi, Y. W.

    2005-01-01

    We present, in the form of review, the results of our study on the design, fabrication and assembly of optical printed circuit boards (O-PCBs) for VLSI micro/nano-photonic applications. The O-PCBs are designed to perform the functions of transporting, switching, routing and distributing optical signals on flat modular boards, substrates or chips, in a manner similar to the electrical printed circuit boards (E-PCBs). We have assembled and constructed O-PCBs using optical waveguide arrays and circuits made of polymer materials and have examined their information handling performances. We also designed power beam splitters and waveguide filters using nano-scale photonic band-gap crystals. We discuss scientific and technological issues concerning the processes of miniaturization, interconnection and integration of polymer optical waveguide devices and arrays for O-PCB and VLSI micro/nano-photonics as applicable to board-to-board, chip-to-chip, and intra-chip integration for computers, telecommunications, and transportation systems.

  17. Effective electromagnetic shielding in multilayer printed circuit boards

    Science.gov (United States)

    Wiles, K. G.; Moe, J. L.

    Multilayer printed circuit boards have proven to be recurrent abettors of electromagnetic coupling problems created by the incessantly faster response times in integrated circuit technologies. Coupling within multilayer boards has not only inhibited meeting certain EMI requirements but has also precipitated 'self-inflicted' malfunctions commonly experienced during development of avionic systems. A recent avionic system, interfacing two asynchronous processors through a fourteen-layer motherboard, permitted coupling through ground plane connector apertures of sufficient amplitude and duration as to cause unintentional intercommunication and system malfunctions. The coupling mechanism and ground plane modifications which reduced this coupling by 40 dB and eliminated the incompatibility are discussed in this paper

  18. Development and verification of printed circuit board toroidal transformer model

    DEFF Research Database (Denmark)

    Pejtersen, Jens; Mønster, Jakob Døllner; Knott, Arnold

    2013-01-01

    comparing calculated parameters with 3D finite element simulations and experimental measurement results. The developed transformer model shows good agreement with the simulated and measured results. The model can be used to predict the parameters of printed circuit board toroidal transformer configurations......An analytical model of an air core printed circuit board embedded toroidal transformer configuration is presented. The transformer has been developed for galvanic isolation of very high frequency switch-mode dc-dc power converter applications. The theoretical model is developed and verified by...

  19. Development and verification of printed circuit board toroidal transformer model

    DEFF Research Database (Denmark)

    Pejtersen, Jens; Mønster, Jakob Døllner; Knott, Arnold

    comparing calculated parameters with 3D finite element simulations and experimental measurement results. The developed transformer model shows good agreement with the simulated and measured results. The model can be used to predict the parameters of printed circuit board toroidal transformer configurations......An analytical model of an air core printed circuit board embedded toroidal transformer configuration is presented. The transformer has been developed for galvanic isolation of very high frequency switch-mode dc-dc power converter applications. The theoretical model is developed and verified by...

  20. Elemental analysis of printed circuit boards considering the ROHS regulations

    International Nuclear Information System (INIS)

    The EU RoHS Directive (2002/95/EC of the European Parliament and of the Council) bans the placing of new electrical and electronic equipment containing more than agreed levels of lead, cadmium, mercury, hexavalent chromium, polybrominated biphenyl (PBB) and polybrominated diphenyl ether (PBDE) flame retardants on the EU market. It necessitates methods for the evaluation of RoHS compliance of assembled electronic equipment. In this study mounted printed circuit boards from personal computers were analyzed on their content of the three elements Cd, Pb and Hg which were limited by the EU RoHS directive. Main focus of the investigations was the influence of sample pre-treatment on the precision and reproducibility of the results. The sample preparation steps used were based on the guidelines given in EN 62321. Five different types of dissolution procedures were tested on different subsequent steps of sample treatment like cutting and milling. Elemental analysis was carried out using ICP-OES, XRF and CV-AFS (Hg). The results obtained showed that for decision-making with respect to RoHS compliance a size reduction of the material to be analyzed to particles ≤1.5 mm can already be sufficient. However, to ensure analytical results with relative standard deviations of less than 20%, as recommended by the EN 62321, a much larger effort for sample processing towards smaller particle sizes might be required which strongly depends on the mass fraction of the element under investigation.

  1. Integrated optical and electronic interconnect printed circuit board manufacturing

    OpenAIRE

    Selviah, D. R.; Fernández, F. A.; Papakonstantinou, I.; Wang, K.; Bagshiahi, H.; Walker, A. C.; McCarthy, A.; Suyal, H; Hutt, D.A.; Conway, P. P.; Chappell, J.; Zakariyah, S. S.; Milward, D

    2008-01-01

    Introduction: At high bit rates copper tracks in printed circuit boards (PCBs) suffer severe loss and pulse distortion due to radiation of electromagnetic waves, dispersion and bandwidth limitations. The loss can be overcome to some extent by transmitting higher power pulses and by changing the dielectric constant and loss tangent of the PCB substrate material. However, high power pulses consume power and can cause electro-migration which reduces the board lifetime, although the copper tracks...

  2. Recycling process assessment of mechanical recycling of printed circuit board

    Institute of Scientific and Technical Information of China (English)

    PAN Jun-qi; LIU Zhi-feng; LIU Guang-fu; WANG Shu-wang; HUANG Hai-hong

    2005-01-01

    A comprehensive assessment index system was established. The mechanical recycling process of printed circuit board was evaluated according to the comprehensive evaluation index system using the fuzzy analytic hierarchy process. A process assessment software system of mechanical recycling was established to evaluate different recy cling technologies. And the software system was developed in the environment of VB 6.0 and Access 2000.

  3. Connector and electronic circuit assembly for improved wet insulation resistance

    Energy Technology Data Exchange (ETDEWEB)

    Reese, Jason A.; Teli, Samar R.; Keenihan, James R.; Langmaid, Joseph A.; Maak, Kevin D.; Mills, Michael E.; Plum, Timothy C.; Ramesh, Narayan

    2016-07-19

    The present invention is premised upon a connector and electronic circuit assembly (130) at least partially encased in a polymeric frame (200). The assembly including at least: a connector housing (230); at least one electrical connector (330); at least one electronic circuit component (430); and at least one barrier element (530).

  4. WASTE PRINTED CIRCUIT BOARDS SEPARATION IN ELECTROSTATIC SEPARATOR

    Directory of Open Access Journals (Sweden)

    Branimir Fuk

    2012-12-01

    Full Text Available Printed circuit boards from electronic waste are very important source of precious metals by recycling. The biggest challenge is liberation and separation of useful components; thin film which contains copper, zinc, tin, lead and precious metals like silver, gold and palladium from non useful components; polymers, ceramics and glass fibbers. The paper presents results for separation of shredded printed circuit boards from TV sets in electrostatic separator. Testing where conducted with material class 2/1 and 1/0.5 mm in laboratory on equipment for mineral processing. Results showed influence from independent variable; separation knife gradient, drum rotation speed and voltage on concentrate quality and recovery (the paper is published in Croatian.

  5. DC Arc Plasma Disposal of Printed Circuit Board

    Institute of Scientific and Technical Information of China (English)

    黄建军; 施嘉标; 孟月东; 刘正之

    2004-01-01

    A new solid waste disposal technology setup with DC arc plasma is presented. Being different from conventional combustion or burning such as incineration, it is based on a process called controlled high-temperature pyrolysis, the thermal destruction and recovery process. The results of vitrification of the circuit board is presented. The properties of vitrified product including hardness and leaching test results are presented. The final product (vitrified material) and air emission from the plasma treatment is environmentally acceptable.

  6. DC arc plasma disposal of printed circuit board

    International Nuclear Information System (INIS)

    A new solid waste disposal technology setup with DC arc plasma is presented. Being different from conventional combustion or burning such as incineration, it is based on a process called controlled high-temperature pyrolysis, the thermal destruction and recovery process. The results of vitrification of the circuit board are presented. The properties of vitrified product including hardness and leaching test results are presented. The final product (vitrified material) and air emission from the plasma treatment is environmentally acceptable. (authors)

  7. Ruggedizing Printed Circuit Boards Using a Wideband Dynamic Absorber

    Directory of Open Access Journals (Sweden)

    V.C. Ho

    2003-01-01

    Full Text Available The existing approaches to ruggedizing inherently fragile and sensitive critical components of electronic equipment such as printed circuit boards (PCB for use in hostile industrial and military environment are either insufficient or expensive. This paper addresses a novel approach towards ruggedizing commercial-off-the-shelf PCBs using a miniature wideband dynamic absorber. The optimisation technique used relies on the experimentally measured vibration spectra and complex receptance of the original PCB.

  8. A Novel Technique to Perform Plating on Printed Circuit Board

    Directory of Open Access Journals (Sweden)

    S. Jayapoorani

    2011-01-01

    Full Text Available Problem statement: This research attempts to optimize the parameters for pulse plating of silver on printed circuit board. The idea here is to use pulse plating technique which is metal deposition by pulsed electrolysis method. Approach: Printed Circuit Boards (PCB plays a major role in all communication and electronics industry. Silver is a ductile and malleable metal which has 7% higher conductivity than copper. Here the electro deposit is influenced by current density, silver concentration in the bath, applied current type. Pulse plating technique is used in double sided printed circuit board especially in the case of plated through hole technique. Here exist a necessity to do plating which will deposit a metal wall in the substrate and it will connect between the components. Results: This method of pulse plating proves that it avoids the disadvantage of rough deposition that is caused due to DC plating in PCB's. Conclusion: The surface morphology and the grain size is measured using XRD analysis and it proves that the number of pin holes is reduced.

  9. Pre-assembling electric circuits of braided conductors

    International Nuclear Information System (INIS)

    The present article has for object to give to know an innovative concept of pre-assembling electric circuits for distribution of normal and regulated power, to the work position like integral subsystems of the calls intelligent buildings

  10. A tool for errors detection in printed circuit boards production

    Directory of Open Access Journals (Sweden)

    A. de Luca Pennacchia

    2009-04-01

    Full Text Available The progressive implementation of software functions in Integrated Circuits (ICs has considerably increased the number oftransistors and pin connections of ICs. For that reason, Printed Circuit Boards (PCBs are fabricated with the Surface MountTechnology (SMT nowadays and IC mounting on PCB is a crucial process that requires high precision. An Automatic MechanicalMontage (AMM system is used to mount ICs on the sockets using a couple of reference points for every IC in order to find thecorrect positions for mounting the IC. Due to some factors in the process of PCB development, there are differences betweendesigned and manufactured PCBs, which could generate delays in their production. In this work, a software tool which allows towork with digital images of PCBs is described. This tool finds the differences generated in PCB development, especially thedifferences in IC reference points using Digital Image Processing (DIP techniques.

  11. Fractal Electronic Circuits Assembled From Nanoclusters

    Science.gov (United States)

    Fairbanks, M. S.; McCarthy, D.; Taylor, R. P.; Brown, S. A.

    2009-07-01

    Many patterns in nature can be described using fractal geometry. The effect of this fractal character is an array of properties that can include high internal connectivity, high dispersivity, and enhanced surface area to volume ratios. These properties are often desirable in applications and, consequently, fractal geometry is increasingly employed in technologies ranging from antenna to storm barriers. In this paper, we explore the application of fractal geometry to electrical circuits, inspired by the pervasive fractal structure of neurons in the brain. We show that, under appropriate growth conditions, nanoclusters of Sb form into islands on atomically flat substrates via a process close to diffusion-limited aggregation (DLA), establishing fractal islands that will form the basis of our fractal circuits. We perform fractal analysis of the islands to determine the spatial scaling properties (characterized by the fractal dimension, D) of the proposed circuits and demonstrate how varying growth conditions can affect D. We discuss fabrication approaches for establishing electrical contact to the fractal islands. Finally, we present fractal circuit simulations, which show that the fractal character of the circuit translates into novel, non-linear conduction properties determined by the circuit's D value.

  12. Leaching studies for metals recovery from printed circuit boards scrap

    OpenAIRE

    Oliveira, Paula C.; Cabral, Marta; Taborda, F. Charters; Margarido, F.; Nogueira, C. A.

    2009-01-01

    In this paper, the leaching behavior of the major metals present in printed circuit boards waste is evaluated, aiming at its recycling by hydrometallurgy. Several leachants were compared (sulfuric, hydrochloric and nitric acids, at 2 M H+ concentration), at temperatures of 25ºC and 90ºC and 4 hours of reaction time. Sulfuric acid leaching was not very promising concerning metals dissolution being only effective for iron. Hydrochloric acid allowed the leaching up to 60% of tin and about 50% of...

  13. Recycling of WEEE: Characterization of spent printed circuit boards from mobile phones and computers

    International Nuclear Information System (INIS)

    Highlights: → This paper presents new and important data on characterization of wastes of electric and electronic equipments. → Copper concentration is increasing in mobile phones and remaining constant in personal computers. → Printed circuit boards from mobile phones and computers would not be mixed prior treatment. - Abstract: This paper presents a comparison between printed circuit boards from computers and mobile phones. Since printed circuits boards are becoming more complex and smaller, the amount of materials is constantly changing. The main objective of this work was to characterize spent printed circuit boards from computers and mobile phones applying mineral processing technique to separate the metal, ceramic, and polymer fractions. The processing was performed by comminution in a hammer mill, followed by particle size analysis, and by magnetic and electrostatic separation. Aqua regia leaching, loss-on-ignition and chemical analysis (inductively coupled plasma atomic emission spectroscopy - ICP-OES) were carried out to determine the composition of printed circuit boards and the metal rich fraction. The composition of the studied mobile phones printed circuit boards (PCB-MP) was 63 wt.% metals; 24 wt.% ceramics and 13 wt.% polymers; and of the printed circuit boards from studied personal computers (PCB-PC) was 45 wt.% metals; 27 wt.% polymers and ceramics 28 wt.% ceramics. The chemical analysis showed that copper concentration in printed circuit boards from personal computers was 20 wt.% and in printed circuit boards from mobile phones was 34.5 wt.%. According to the characteristics of each type of printed circuit board, the recovery of precious metals may be the main goal of the recycling process of printed circuit boards from personal computers and the recovery of copper should be the main goal of the recycling process of printed circuit boards from mobile phones. Hence, these printed circuit boards would not be mixed prior treatment. The results

  14. Method of transformation of printed circuit boards regular interconnection into polygonal

    Directory of Open Access Journals (Sweden)

    Murov S. Yu.

    2010-08-01

    Full Text Available The described method allows to automate the polygonal interconnection process, which is essential for powerful radio transmitters designing, and also for multi-layer printed circuit boards designing, when the reference layer includes several different circuits.

  15. Method of transformation of printed circuit boards regular interconnection into polygonal

    OpenAIRE

    Murov S. Yu.

    2010-01-01

    The described method allows to automate the polygonal interconnection process, which is essential for powerful radio transmitters designing, and also for multi-layer printed circuit boards designing, when the reference layer includes several different circuits.

  16. Prototyping lead-free solders on hand-soldered, through-hole circuit boards

    Energy Technology Data Exchange (ETDEWEB)

    Vianco, P.T. [Sandia National Labs., Albuquerque, NM (United States); Mizik, P.M. [Allied-Signal Aerospace Co., Kansas City, MO (United States). Kansas City Div.

    1993-12-31

    The lead-free solders 96.5Sn-3.5Ag (wt %), 95.5Sn-4.0Cu-0.5Ag, 91. 84Sn-3.33Ag-4.83Bi were used in the assembly of a through-hole circuit board to determine the feasibility of their suitability in hand soldering processes. Prototypes assembled with 63Sn-37Pb solder were manufactured to serve as control units. Implementation of the lead-free alloys were performed with a rosin-based, mildly activated (RMA) flux and a 700{degree}F soldering tip. A procedure was developed to remove the tin-lead finish from the leaded components and replace it with a 100Sn hot dipped coating. Assembly feasibility was demonstrated for all three lead-free solders. Defect counts were greater than observed with the tin-lead control alloy; however, the number of defects diminished with experience gained by the operator. Visual examination of the solder joints indicated satisfactory wetting of both the device leads and circuit board land with no apparent damage to the underlying laminate nor to the device packages. Cross sections of the lead-free solder joints showed that the were more susceptible to void formation within the holes than was the case with the tin-lead solder. Some cracking was observed at the interface between the Sn-Ag-Bi solder and the copper lands; the relatively high strength of this solder and fast cooling rate of the hand assembly process was believed responsible for this defect.

  17. Research on Selective Shredding of Wasted Printed Circuit Boards

    Institute of Scientific and Technical Information of China (English)

    曹亦俊; 文学峰; 赵跃民

    2002-01-01

    Electronic scrap, especially wasted printed circuit boards (PCBs), is regarded as an environmental challenge. At present, the physical separation is thought to be the environmental friendly and economical method of treating and reutilizing electronic waste. An effective liberation of metals from non-metallic components is a crucial step towards mechanical separation and recycling of wasted PCBs. In this paper, the selective shredding theory and mechanics characteristics of wasted PCBs were analyzed, and the shredded experiments of wasted PCBs by hammer mill were investigated. The result shows that the selective shredding exists in the wasted PCBs shredded process by hammer mill. The shredding velocity of non-metallic components is far greater than that of metals in the wasted PCBs shredding, which makes the metals concentrate in the coarser fraction. And the impact force of hammer mill is superior to metal liberation from non-metallic components, a satisfied metal liberation degree can be achieved in the wasted PCBs shredding by hammer mill.

  18. A corrected method of distorted printed circuit board image

    Institute of Scientific and Technical Information of China (English)

    Qiao Nao-Sheng; Ye Yu-Tang; Huang Yong-Lin

    2011-01-01

    This paper proposes a corrected method of distorted image based on adaptive control. First, the adaptive control relationship of pixel point positions between distorted image and its corrected image is given by using polynomial fitting,thus control point pairs between the distorted image and its corrected image are found. Secondly, the value of both image distortion centre and polynomial coefficient is obtained with least square method, thus the relationship of each control point pairs is deduced. In the course of distortion image processing, the gray value of the corrected image is changed into integer with bilinear interpolation. Finally, the experiments are performed to correct two distorted printed circuit board images. The results are perfect and the mean square errors of residual error are tiny.

  19. Crushing performance and resource characteristic of printed circuit board scrap

    Institute of Scientific and Technical Information of China (English)

    WANG Hui; GU Guo-hua; QI Yun-feng

    2005-01-01

    The crushing performance of printed circuit board (PCB) was studied on several crushers. The results show that PCB is a material which is difficult to crush. The crushing performance of PCB with disk crusher, especially vibration grinding, which has cut or impact action, excels that of jaw crusher or roller crusher. The PCB scrap is worthwhile to recycle using variety of modern characterization methods. When compared with natural resources, this material stream remains a rich precious metal and nonferrous metals. In PCB scrap, metals account for 47% of the total material composition, in which there exists 19.66% copper, 11.47% iron, 3.93% lead, 300 g/t gold and 5-10 kg/t silver, etc. In addition, the PCB scrap contains 27% of plastics and 26% of refractory oxides.

  20. Size distribution of wet crushed waste printed circuit boards

    Institute of Scientific and Technical Information of China (English)

    Tan Zhihai; He Yaqun; Xie Weining; Duan Chenlong; Zhou Enhui; Yu Zheng

    2011-01-01

    A wet impact crusher was used to breakdown waste printed circuit boards (PCB's) in a water medium.The relationship between the yield of crushed product and the operating parameters was established.The crushing mechanism was analyzed and the effects of hammerhead style,rotation speed,and inlet water volume on particle size distribution were investigated.The results show that the highest yield of -1 + 0.75 mm sized product was obtained with an inlet water volume flow rate of 5.97 m3/h and a smooth hammerhead turning at 1246.15 r/min.Cumulative undersize-product yield curves were fitted to a nonlinear function:the fitting correlation coefficient was greater than 0.998.These research results provide a theoretical basis for the highly effective wet crushing of PCB's.

  1. Ion chromatography in the manufacture of multilayer circuit boards

    Science.gov (United States)

    Smith, Robert E.

    1990-09-01

    Ion chromatography (IC) has proven useful in analyzing chemical solutions used in the manufacture of multilayer circuit boards. The manufacturing process is described briefly and previously published IC methods are reviewed. Then, methods are described for determining chlorate and chlorite in a brown oxide solution; salicylic acid in an epoxy cure agent; formate, sulfate, and tartrate in an electroless copper bath; anionic detergents in a tin-lead brightener and in a cleaning solution; and aqueous photoresist and nonionic brightener in a tin-lead bath. Anion exchange, reverse phase HPLC on a poly(styrene/divinylbenzene), PS/DVB, column and 2-D liquid chromatography also are described. Chemically suppressed conductivity and photometric detection are used.

  2. Printed Circuit Board Integrated Toroidal Radio Frequency Inductors

    DEFF Research Database (Denmark)

    Kamby, Peter; Knott, Arnold; Andersen, Michael A. E.

    2012-01-01

    Modern power semiconductors allow for switching frequencies of power converters in the very high frequency (VHF) band (30 MHz to 300 MHz). The major advantage of this frequency increase is a remarkable reduction of the size of power converters due to smaller passive components. However crucial...... attention needs to be payed to switching losses, so that the size reduction in electrical components does not get consumed by a major increase in heatsink size. This paper is investigating the major size limiting component in power converters: the inductor. In the VHF range, inductors are typically...... implemented as solenoids, either in spiral or cylindrical form. Those have the disadvantage of excessive stray fields, which can cause losses and disturbances in adjacent circuitry. Therefore this paper presents the analysis, design and realization of a printed circuit board (PCB) integrated inductor under...

  3. Radiological characterization of printed circuit boards for future elimination.

    Science.gov (United States)

    Zaffora, Biagio; Magistris, Matteo

    2016-07-01

    Electronic components like printed circuit boards (PCBs) are commonly used in CERN's accelerator complex. During their lifetime some of these PCBs are exposed to a radiation field of protons, neutrons and pions and are activated. In view of their disposal towards the appropriate final repository, a radiological characterization must be performed. The present work proposes a general characterization procedure based on the definition of a reference chemical composition, on the calculation of the corresponding radionuclide inventory and on the measurement of a tracer radionuclide. This method has been validated with real-life cases of electronic boards which were exposed to the typical radiation fields in CERN's accelerators. The activation studies demonstrate that silver is the key element with respect to the radiological characterization of electronic waste due to the production of Ag-110m and Ag-108m. A sensitivity analysis shows that the waiting time is the main parameter affecting the radionuclide inventory. Results also indicate that, as is the case of other families of radioactive waste, an accurate assessment of the radiological inventory of PCBs would require the precise knowledge of their chemical composition, as well as the radiation field to which they were exposed. PMID:27129133

  4. Micro/nano-scale fabrication of integrated polymer optical wire circuit arrays for optical printed circuit board (O-PCB) application

    Science.gov (United States)

    Lee, El-Hang; Lee, Seung G.; Park, Se G.; Kim, Kyong H.; Kang, Jin K.; Chin, In J.; Kwon, Y. K.; Choi, Young W.

    2005-02-01

    We report on the results of our study on the micro/nano-scale design, fabrication and integration of waveguide arrays for optical printed circuit boards (O-PCBs) and VLSI micro/nano-photonic applications. The O-PCBs are designed to perform the functions of transporting, switching, routing and distributing optical signals on flat modular boards or substrates. We have assembled O-PCBs using optical waveguide arrays and circuits made of polymer materials and have examined information handling performances. We also designed power beam splitters and waveguide filters, using nano-scale photonic band-gap crystals, for VLSI photonic integration application. We discuss potential applications of polymer optical waveguide devices and arrays for O-PCB and VLSI micro/nano-photonics for computers, telecommunications, and transportation systems.

  5. Recovery Act: High-Temperature Circuit Boards for use in Geothermal Well Monitoring Applications

    Energy Technology Data Exchange (ETDEWEB)

    Hooker, Matthew [Composite Tehcnology Development, Inc., Lafayette, CO (United States); Fabian, Paul [Composite Tehcnology Development, Inc., Lafayette, CO (United States)

    2013-05-01

    depths. At present, the highest-temperature commercially available circuit boards are based on polyimide materials, and those have maximum use temperatures of 200 to 250°C. In addition to thermal stability, downhole electronics must also be fabricated into high-aspect-ratio packages. For example, the multilayer assemblies produced at SNL were approximately 2.5 cm wide and 50 cm long. Because of this very high form factor, glass-fiber-reinforced polymers are much more desirable than multilayer ceramic modules (MCM). MCMs have many advantages for some applications, but are susceptible to damage induced by the mechanical and vibrational loads commonly experienced by data-logging tools. Thus, as EGS technology continues to advance, there is a strong need for multilayer electronics that can provide the necessary thermal performance while also being compatible with high-form-factor circuit designs. This project involved the design and development of high-temperature circuit materials, as well as the fabrication and testing of circuit components. The material development included the evaluation of various polymer/fiberglass composites, whereas the circuit components were tested using conventional microelectronic evaluation techniques. This effort targeted development of a new class of high-temperature multilayer circuit boards for use in downhole data-logging applications where temperatures are on the order of 300°C. This is consistent with DOE’s multiyear plan for advancing technologies for use in enhanced geothermal systems. Organic and inorganic polymer systems, both with glass reinforcements, were considered to provide the following performance at elevated temperatures: • Mechanical strength and durability • High dielectric strength and electrical resistivity • Thermal stability • Strong adhesion to copper to ensure the reliability of the multilayer assemblies • Processing characteristics that are consistent with state-of-the-art multilayer circuit board

  6. A 5 Giga Samples Per Second 8-Bit Analog to Digital Printed Circuit Board for Radio Astronomy

    Science.gov (United States)

    Jiang, Homin; Liu, Howard; Guzzino, Kim; Kubo, Derek; Li, Chao-Te; Chang, Ray; Chen, Ming-Tang

    2014-08-01

    We have designed, manufactured, and characterized an 8-bit 5 Giga samples per second (Gsps) ADC printed circuit board assembly (PCBA). An e2v EV8AQ160 ADC chip was used in the design and the board is plug compatible with the field programmable gate array (FPGA) board developed by the Collaboration for Astronomy Signal Processing and Electronics Research (CASPER) community. Astronomical interference fringes were demonstrated across a single baseline pair of antennas using two ADC boards on the Yuan Tseh Lee Array for Microwave Background Anisotropy (AMiBA) telescope. Several radio interferometers are using this board for bandwidth expansion, such as Submillimeter Array; also, several experimental telescopes are building new spectrometers using the same board. The ADC boards were attached directly to the Reconfigurable Open Architecture Computing Hardware (ROACH-2) FPGA board for processing of the digital output signals. This ADC board provides the capability of digitizing radio frequency signals from DC to 2 GHz (3 dB bandwidth), and to an extended bandwidth of 2.5 GHz (5 dB) with derated performance. The following worst-case performance parameters were obtained over 2 GHz: spur free dynamic range (SFDR) of 44 dB, signal-to-noise and distortion (SINAD) of 35 dB, and effective number of bits (ENOB) of 5.5.

  7. Waste printed circuit board recycling techniques and product utilization

    Energy Technology Data Exchange (ETDEWEB)

    Hadi, Pejman; Xu, Meng [Chemical and Biomolecular Engineering Department, Hong Kong University of Science and Technology, Clear Water Bay Road, Hong Kong Special Administrative Region (Hong Kong); Lin, Carol S.K. [School of Energy and Environment, City University of Hong Kong, Tat Chee Avenue, Kowloon, Hong Kong Special Administrative Region (Hong Kong); Hui, Chi-Wai [Chemical and Biomolecular Engineering Department, Hong Kong University of Science and Technology, Clear Water Bay Road, Hong Kong Special Administrative Region (Hong Kong); McKay, Gordon, E-mail: kemckayg@ust.hk [Chemical and Biomolecular Engineering Department, Hong Kong University of Science and Technology, Clear Water Bay Road, Hong Kong Special Administrative Region (Hong Kong); Division of Sustainable Development, College of Science, Engineering and Technology, Hamad Bin Khalifa University, Qatar Foundation, Doha (Qatar)

    2015-02-11

    Highlights: • There is a major environmental issue about the printed circuit boards throughout the world. • Different physical and chemical recycling techniques have been reviewed. • Nonmetallic fraction of PCBs is the unwanted face of this waste stream. • Several applications of the nonmetallic fraction of waste PCBs have been introduced. - Abstract: E-waste, in particular waste PCBs, represents a rapidly growing disposal problem worldwide. The vast diversity of highly toxic materials for landfill disposal and the potential of heavy metal vapors and brominated dioxin emissions in the case of incineration render these two waste management technologies inappropriate. Also, the shipment of these toxic wastes to certain areas of the world for eco-unfriendly “recycling” has recently generated a major public outcry. Consequently, waste PCB recycling should be adopted by the environmental communities as an ultimate goal. This article reviews the recent trends and developments in PCB waste recycling techniques, including both physical and chemical recycling. It is concluded that the physical recycling techniques, which efficiently separate the metallic and nonmetallic fractions of waste PCBs, offer the most promising gateways for the environmentally-benign recycling of this waste. Moreover, although the reclaimed metallic fraction has gained more attention due to its high value, the application of the nonmetallic fraction has been neglected in most cases. Hence, several proposed applications of this fraction have been comprehensively examined.

  8. Waste printed circuit board recycling techniques and product utilization

    International Nuclear Information System (INIS)

    Highlights: • There is a major environmental issue about the printed circuit boards throughout the world. • Different physical and chemical recycling techniques have been reviewed. • Nonmetallic fraction of PCBs is the unwanted face of this waste stream. • Several applications of the nonmetallic fraction of waste PCBs have been introduced. - Abstract: E-waste, in particular waste PCBs, represents a rapidly growing disposal problem worldwide. The vast diversity of highly toxic materials for landfill disposal and the potential of heavy metal vapors and brominated dioxin emissions in the case of incineration render these two waste management technologies inappropriate. Also, the shipment of these toxic wastes to certain areas of the world for eco-unfriendly “recycling” has recently generated a major public outcry. Consequently, waste PCB recycling should be adopted by the environmental communities as an ultimate goal. This article reviews the recent trends and developments in PCB waste recycling techniques, including both physical and chemical recycling. It is concluded that the physical recycling techniques, which efficiently separate the metallic and nonmetallic fractions of waste PCBs, offer the most promising gateways for the environmentally-benign recycling of this waste. Moreover, although the reclaimed metallic fraction has gained more attention due to its high value, the application of the nonmetallic fraction has been neglected in most cases. Hence, several proposed applications of this fraction have been comprehensively examined

  9. Recovery of high purity precious metals from printed circuit boards

    International Nuclear Information System (INIS)

    Waste printed circuit boards (WPCB) have an inherent value because of the precious metal content. For an effective recycling of WPCB, it is essential to recover the precious metals. This paper reports a promising method to recover the precious metals. Aqua regia was used as a leachant and the ratio between metals and leachant was fixed at 1/20 (g/ml). Silver is relatively stable so the amount of about 98 wt.% of the input was recovered without an additional treatment. Palladium formed a red precipitate during dissolution, which were consisted of Pd(NH4)2Cl6. The amount precipitated was 93 wt.% of the input palladium. A liquid-liquid extraction with toluene was used to extract gold selectively. Also, dodecanethiol and sodium borohydride solution were added to make gold nanoparticles. Gold of about 97 wt.% of the input was recovered as nanoparticles which was identified with a high-resolution transmission electron microscopy through selected area electron diffraction and nearest-neighbor lattice spacing.

  10. PHYSICAL CHEMISTRY CHARACTERIZATION OF PRINTED CIRCUIT BOARD OF MOBILE PHONES

    Directory of Open Access Journals (Sweden)

    Hellington Bastos da Silva de Sant’ana

    2015-07-01

    Full Text Available Nowadays, electronics industry is the leading sector in developing new technologies. These new technologies lead to cheaper products increasing the consumption. The lifetime of such products is relatively short and soon it becomes waste, known as electronic waste. Cell phone is a common electronic waste. This waste represents an interesting raw material, because it contains large amount of base metals, considerable amount of valuable metals and also those dangerous. In this work, the electronic waste was submitted to mechanical processing: initially the devices were separated into two categories, as year of release (2002 and disassembled manually. The printed circuit boards were milled below 1 mm and then submitted to density and magnetic separation processes. The fractions obtained during the mechanical processing were characterized by chemical analysis. Using mechanical processing it was possible to obtain metal fractions of 80 wt%. A leaching test was carried out to determine if a waste needs to be managed as a hazardous; so that, cell phone waste must be considered in the category of hazardous residue because the lead concentration was above the limit established by Brazilian Standards

  11. A study of liberation and separation process of metals from printed circuit boards (PCBs) scrap

    International Nuclear Information System (INIS)

    Since the metallic elements are covered with or encapsulated by various plastic or ceramic materials on printed circuit boards, a mechanical pre-treatment process allowing their liberation and separation is first needed in order to facilitate their efficient extraction with hydrometallurgy route. Even though many studies have been performed on the mechanical pre-treatment processing for the liberation and separation of the metallic components of printed circuit boards scrap, further studies are required to pave the way for efficient recycling of waste printed circuit boards through a combination of mechanical pre-treatment and hydrometallurgical technology. In this work, a fundamental study has been carried out on the mechanical pre-treatment that is necessary to recover metallic concentrates from printed circuit boards scraps. The most important problem is to separate or release particles from the associated gangue minerals at the possible liberation particle size. The distribution of metallic elements has been also investigated in relation to the particle size of the milled printed circuit boards. The samples of printed circuit boards were separated into the magnetic and non-magnetic fractions by Rare-earth Roll Magnetic separator. Thereafter, the magnetic and non-magnetic fractions were separated to heavy fraction (metallic elements) and light fraction (plastic) by Mozley Laboratory Table Separator. The recovery ratios and the evaluation of the metallic concentrates recovered by each separation process were also investigated. This study is expected to provide useful data for the efficient mechanical separation of metallic components from printed circuit boards scraps. (author)

  12. Integration of polymer-based optical waveguide arrays and micro/nano-photonic devices for optical printed circuit board (O-PCB) application

    Science.gov (United States)

    Lee, El-Hang; Lee, Seung Gol; O, Beom Hoan; Park, Se-Geun; Kim, Kyong Heon; Kang, Jin Ku; Choi, Young Wan

    2005-03-01

    We report, in the form of review, on the results of our study on the fabrication and assembly of polymer-based optical waveguide arrays and micro/nano-photonic devices for optical printed circuit boards (O-PCBs) application. The O-PCBs are designed to perform the functions of transporting, switching, routing and distributing optical signals on flat modular boards, substrates or chips. We have assembled and constructed O-PCBs using optical waveguide arrays and circuits made of polymer materials and have examined their information handling performances. We also designed power beam splitters and waveguide filters using nano-scale photonic band-gap crystals. We discuss scientific and technological issues concerning the processes of miniaturization, interconnection and integration of polymer optical waveguide devices and arrays for the O-PCBs as applicable to board-to-board, chip-to-chip, and intra-chip integration for computers, telecommunications, and transportation systems.

  13. Polyimide Nanocomposite Circuit Board Materials to Mitigate Internal Electrostatic Discharge Project

    Data.gov (United States)

    National Aeronautics and Space Administration — In Sub-topic T8.02, NASA has identified a need for improved circuit boards to mitigate the hazards of internal electrostatic discharge (IESD) on missions where high...

  14. Research on Toxicity Evaluation of Waste Incineration Residues of Printed Circuit Boards

    OpenAIRE

    Rasa Volungevičienė; Violeta Bolutienė; Kęstutis Buinevičius

    2014-01-01

    Recycling waste printed circuit boards (PCB) is an extremely complicated process, because PCBs consist of a number of complex components – hazardous and non-hazardous materials sets. Pyrolysis and combustion are currently the most effective treatment technologies for waste printed circuit boards. Pyrolysis can be used for thermally decomposing PCBs allowing for the simultaneous recovery of valuable materials. Following the extraction of valuable materials, the problem of residual ash utilizat...

  15. Shielding properties of conductive plastic housings loaded with printed circuit boards

    OpenAIRE

    Lozano Guerrero, Antonio José; Robinson, Martin Paul; Díaz Morcillo, Alejandro Benedicto; Monzó Cabrera, Juan; Clemente Fernández, Francisco Javier; Balbastre Tejedor, Juan Vicente

    2012-01-01

    In this paper the benefits of using conductive plastics in enclosure configurations have been evaluated taking into account the influence of internal printed circuit boards. Conductive plastic enclosures are a very attractive alternative to traditional metallic enclosures to protect electronic systems against electromagnetic interference. A wide range of conductivities can be obtained with these materials to satisfy a required design. An equivalent model for the printed circuit board has b...

  16. Reducing Printed Circuit Board Emissions with Low-Noise Design Practices

    Science.gov (United States)

    Bradley, Arthur T.; Fowler, Jennifer; Yavoich, Brian J.; Jennings, Stephen A.

    2012-01-01

    This paper presents the results of an experiment designed to determine the effectiveness of adopting several low-noise printed circuit board (PCB) design practices. Two boards were designed and fabricated, each consisting of identical mixed signal circuitry. Several important differences were introduced between the board layouts: one board was constructed using recommended low-noise practices and the other constructed without such attention. The emissions from the two boards were then measured and compared, demonstrating an improvement in radiated emissions of up to 22 dB.

  17. Printed circuit board impedance matching step for microwave (millimeter wave) devices

    Science.gov (United States)

    Pao, Hsueh-Yuan; Aguirre, Jerardo; Sargis, Paul

    2013-10-01

    An impedance matching ground plane step, in conjunction with a quarter wave transformer section, in a printed circuit board provides a broadband microwave matching transition from board connectors or other elements that require thin substrates to thick substrate (>quarter wavelength) broadband microwave (millimeter wave) devices. A method of constructing microwave and other high frequency electrical circuits on a substrate of uniform thickness, where the circuit is formed of a plurality of interconnected elements of different impedances that individually require substrates of different thicknesses, by providing a substrate of uniform thickness that is a composite or multilayered substrate; and forming a pattern of intermediate ground planes or impedance matching steps interconnected by vias located under various parts of the circuit where components of different impedances are located so that each part of the circuit has a ground plane substrate thickness that is optimum while the entire circuit is formed on a substrate of uniform thickness.

  18. USB connection pulse generator using commercial available FPGA circuit board

    International Nuclear Information System (INIS)

    A number of examples have been reported on the NMR pulse generator. However some of them needed custom hardwares and the additional development of drivers. In this article, we report the USB connection NMR pulse generator using commercial available FPGA board. The system consists of only the commercial available FPGA board and free softwares. (author)

  19. All-semiconductor metamaterial-based optical circuit board at the microscale

    International Nuclear Information System (INIS)

    The newly introduced metamaterial-based optical circuit, an analogue of electronic circuit, is becoming a forefront topic in the fields of electronics, optics, plasmonics, and metamaterials. However, metals, as the commonly used plasmonic elements in an optical circuit, suffer from large losses at the visible and infrared wavelengths. We propose here a low-loss, all-semiconductor metamaterial-based optical circuit board at the microscale by using interleaved intrinsic GaAs and doped GaAs, and present the detailed design process for various lumped optical circuit elements, including lumped optical inductors, optical capacitors, optical conductors, and optical insulators. By properly combining these optical circuit elements and arranging anisotropic optical connectors, we obtain a subwavelength optical filter, which can always hold band-stop filtering function for various polarization states of the incident electromagnetic wave. All-semiconductor optical circuits may provide a new opportunity in developing low-power and ultrafast components and devices for optical information processing

  20. WindoWorks: A flexible program for computerized testing of accelerator control system electronic circuit boards

    International Nuclear Information System (INIS)

    Since most accelerator control system circuit boards reside in a commercial bus architecture, such as CAMAC or VMEbus, a computerized test station is needed for exercising the boards. This test station is needed for the development of newly designed prototypes, for commissioning newly manufactured boards, for diagnosing boards which have failed in service, and for long term testing of boards with intermittent failure problems. WindoWorks was created to address these needs. It is a flexible program which runs on a PC compatible computer and uses a PC to bus crate interface. WindoWorks was designed to give the user a flexible way to test circuit boards. Each test is incapsulated into a window. By bringing up several different windows the user can run several different tests simultaneously. The windows are sizable, and moveable. They have data entry boxes so that the test can be customized to the users preference. The windows can be used in conjunction with each other in order to create supertests. There are several windows which are generic. They can be used to test basic functions on any VME (or CAMAC) board. There are other windows which have been created to test specific boards. New windows for testing specific boards can be easily created by a Pascal programmer using the WindoWorks framework

  1. RECYCLING OF PRINTED CIRCUIT BOARDS AIMING SILVER RECOVERY: A HYDROMETALLURGICAL ROUTE STUDY

    Directory of Open Access Journals (Sweden)

    Marcos Paulo Kohler Caldas

    2015-06-01

    Full Text Available The aim of this paper is characterize printed circuit board of computers and propose a hydrometallurgical route for silver recovery present in its composition. Initially, the printed circuit board was comminuted in both knife and hammer mills. The comminuted material was characterized by sieve analysis, chemical analysis by inductively coupled plasma optical emission spectrometry (ICP-OES and loss on ignition. Leaching tests were conducted in sulfuric acid, sulfuric acid in an oxidizing medium and nitric acid. The results indicated that the printed circuit board is mainly composed of copper (19.42%. Silver content of 0.045% was found. The route for silver recovery was leaching in sulfuric acid at 75°C for 18 hours. Then, leaching in sulfuric acid at 75°C in an oxidizing medium for 6 hours and nitric acid leaching at room temperature for 2 hours. Through of this route, 96.6% of silver was recovered.

  2. A Method for Automatic Inspection of Printed Circuit Boards by Using the Thermal Signature

    International Nuclear Information System (INIS)

    This paper aims to design a system for automating inspection of the printed circuit boards (PCBs) by using the thermal signature of the different integrated circuits (I.C). The proposed inspection system consists of the inspection circuit, data acquisition system (DAS) and personal computer. Inspection is done by comparing the thermal signature of normally operated circuit with the thermal signature of circuit under test. One thermistor is assigned to each component in the circuit. The thermistor must touch tightly the surface of the I.C. to sense its temperature during the inspection process. Matlab software is used to represent the thermal signature through different colors. The Turbo C software is used to develop a program for acquiring and comparing the thermal signature of the circuit under the test with the reference circuit. If the colors of the two thermal signatures for the same I.C. are same then the circuit under test is fault free and does not contain any defect. On the other side, if the colors of the two thermal signatures for the same I.C. are different then the circuit under test is defective

  3. Preparing printed circuit boards for rapid turn-around time on a protomat plotter

    International Nuclear Information System (INIS)

    This document describes the use of the LPKF ProtoMat mill/drill unit circuit board Plotter, with the associated CAD/CAM software BoardMaster and CircuitCAM. At present its primarily use here at Fermilab's Particle Physics Department is for rapid-turnover of prototype PCBs double-sided and single-sided copper clad printed circuit boards (PCBs). (The plotter is also capable of producing gravure films and engraving aluminum or plastic although we have not used it for this.) It has the capability of making traces 0.004 inch wide with 0.004 inch spacings which is appropriate for high density surface mount circuits as well as other through-mounted discrete and integrated components. One of the primary benefits of the plotter is the capability to produce double-sided drilled boards from CAD files in a few hours. However to achieve this rapid turn-around time, some care must be taken in preparing the files. This document describes how to optimize the process of PCB fabrication. With proper preparation, researchers can often have a completed circuit board in a day's time instead of a week or two wait with usual procedures. It is assumed that the software and hardware are properly installed and that the machinist is acquainted with the Win95 operating system and the basics of the associated software. This paper does not describe its use with pen plotters, lasers or rubouts. The process of creating a PCB (printed circuit board) begins with the CAD (computer-aided design) software, usually PCAD or VeriBest. These files are then moved to CAM (computer-aided machining) where they are edited and converted to put them into the proper format for running on the ProtoMat plotter. The plotter then performs the actual machining of the board. This document concentrates on the LPKF programs CircuitCam BASIS and BoardMaster for the CAM software. These programs run on a Windows 95 platform to run an LPKF ProtoMat 93s plotter

  4. Endurance of lead-free assembly under board level drop test and thermal cycling

    International Nuclear Information System (INIS)

    The reliability of lead-free electronic assemblies under board level drop test and thermal cycling was investigated. TSOP (thin small outline package) devices with FeNi leads were reflow soldered on FR4 PCB (printed circuit board) with Sn3.0Ag0.5Cu (wt%) solder. The effects of different PCB finishes (organic solderability preservative (OSP) and electroless nickel immersion gold (ENIG)) on the reliability performance were studied. The results show that the assemblies with ENIG finishes reveal better reliability performance than its OSP counterparts under drop test, however, the OSP samples outperform those with ENIG finishes under thermal cycling. The failure mechanism is different under these two test conditions: the solder joints fracture into the intermetallic compounds (IMCs) layer under drop test, and cracks initiate in the bulk solder under thermal cycling. The surface finishes have an effect on the failure mode. The propagation of crack in the ENIG case is along the device/solder interface, while in the case of OSP, the crack extends parallel to the solder/PCB interface

  5. Laser ablated coupling structures for optical printed circuit boards

    Science.gov (United States)

    Van Steenberge, Geert; Geerinck, Peter; Riester, Markus; Pongratz, Siegfried; Van Daele, Peter

    2005-09-01

    We report on the cost effective fabrication of 45° micromirror couplers within single-mode polymer waveguides for achieving fully embedded board-level optoelectronic interconnections. Compatibility with existing board manufacturing technology is achieved by making use of polymers with high thermal stability. The sol-gel polymers behave as negative photo resist and waveguides are patterned by UV exposure. Micromirrors are fabricated using excimer laser ablation, a very flexible technology that is particularly well suited for structuring of polymers because of their excellent UV-absorption properties and highly non-thermal ablation behavior. A coupling structure based on total internal reflection (TIR) is enhanced by developing a process for embedding a metal coated 45° mirror in the optical layers. The mirrors are selectively metallized using a lift-off process. Filling up the angled via without the presence of air bubbles and providing a flat surface above the mirror is only possible by enhancing the cladding deposition process with ultrasound agitation. Surface roughness of both the mirrors and the upper cladding surface above the mirrors is investigated using a non-contact optical profiler. Initial loss measurements at 1.3 μm show a propagation loss of 0.62 dB/cm and an excess mirror loss of 1.55 dB. During most recent experiments mirror roughness has been reduced from 160 nm to 20 nm, which will seriously reduce the mirror loss.

  6. Radiation evaluation method of commercial off-the-shelf (COTS) electronic printed circuit boards (PCBs)

    International Nuclear Information System (INIS)

    We present a radiation evaluation methodology and proton ground test results for candidate COTS PCBs (commercial off-the-shelf electronic printed circuit boards) and their associated electronics for low-altitude, low-inclination orbits. We will also discuss the implications associated with mission orbit and duration. (authors)

  7. Printed Circuit Board Embedded Inductors for Very High Frequency Switch-Mode Power Supplies

    DEFF Research Database (Denmark)

    Madsen, Mickey Pierre; Knott, Arnold; Andersen, Michael A. E.;

    2013-01-01

    The paper describes the design of three different structures for printed circuit board embedded inductors. Direct comparison of spirals, solenoids and toroids are made with regard to inductance, dc and ac resistance, electromagnetic field and design flexibility. First the equations for the...

  8. Reduction of crosstalk on printed circuit board using genetic algorithm in switching power supply

    OpenAIRE

    Pong, MH; Wu, X; Lee, CM; Qian, Z.

    2001-01-01

    Crosstalk between printed circuit board (PCB) traces in switching power supplies may cause high electromagnetic interference emission. PCB layout plays an important part and a genetic algorithm (GA) is used to produce a layout with reduced crosstalk. A coupling index and a new way of representing a trace for the GA process is presented.

  9. An interactive system for the automatic layout of printed circuit boards (ARAIGNEE)

    International Nuclear Information System (INIS)

    A software package for the automatic layout of printed circuit boards is presented. The program permits an interaction of the user during the layout process. The automatic searching of paths can be interrupted at any step and convenient corrections can be inserted. This procedure improves strongly the performance of the program as far as the number of unresolved connections is concerned

  10. Reliability of CGA/LGA/HDI Package Board/Assembly (Final Report)

    Science.gov (United States)

    Ghaffaroam. Reza

    2014-01-01

    Package manufacturers are now offering commercial-off-the-shelf column grid array (COTS CGA) packaging technologies in high-reliability versions. Understanding the process and quality assurance (QA) indicators for reliability are important for low-risk insertion of these advanced electronics packages. The previous reports, released in January of 2012 and January of 2013, presented package test data, assembly information, and reliability evaluation by thermal cycling for CGA packages with 1752, 1517, 1509, and 1272 inputs/outputs (I/Os) and 1-mm pitch. It presented the thermal cycling (-55C either 100C or 125C) test results for up to 200 cycles. This report presents up to 500 thermal cycles with quality assurance and failure analysis evaluation represented by optical photomicrographs, 2D real time X-ray images, dye-and-pry photomicrographs, and optical/scanning electron Microscopy (SEM) cross-sectional images. The report also presents assembly challenge using reflowing by either vapor phase or rework station of CGA and land grid array (LGA) versions of three high I/O packages both ceramic and plastic configuration. A new test vehicle was designed having high density interconnect (HDI) printed circuit board (PCB) with microvia-in-pad to accommodate both LGA packages as well as a large number of fine pitch ball grid arrays (BGAs). The LGAs either were assembled onto HDI PCB as an LGA or were solder paste print and reflow first to form solder dome on pads before assembly. Both plastic BGAs with 1156 I/O and ceramic LGAs were assembled. It also presented the X-ray inspection results as well as failures due to 200 thermal cycles. Lessons learned on assembly of ceramic LGAs are also presented.

  11. Introduction of customized inserts for streamlined assembly and optimization of BioBrick synthetic genetic circuits

    OpenAIRE

    Gupta Saurabh; Derda Ratmir; Norville Julie E; Drinkwater Kelly A; Belcher Angela M; Leschziner Andres E; Knight Thomas F

    2010-01-01

    Abstract Background BioBrick standard biological parts are designed to make biological systems easier to engineer (e.g. assemble, manipulate, and modify). There are over 5,000 parts available in the Registry of Standard Biological Parts that can be easily assembled into genetic circuits using a standard assembly technique. The standardization of the assembly technique has allowed for wide distribution to a large number of users -- the parts are reusable and interchangeable during the assembly...

  12. Circuit board accident--organizational dimension hidden by prescribed safety.

    Science.gov (United States)

    de Almeida, Ildeberto Muniz; Buoso, Eduardo; do Amaral Dias, Maria Dionísia; Vilela, Rodolfo Andrade Gouveia

    2012-01-01

    This study analyzes an accident in which two maintenance workers suffered severe burns while replacing a circuit breaker panel in a steel mill, following model of analysis and prevention of accidents (MAPA) developed with the objective of enlarging the perimeter of interventions and contributing to deconstruction of blame attribution practices. The study was based on materials produced by a health service team in an in-depth analysis of the accident. The analysis shows that decisions related to system modernization were taken without considering their implications in maintenance scheduling and creating conflicts of priorities and of interests between production and safety; and also reveals that the lack of a systemic perspective in safety management was its principal failure. To explain the accident as merely non-fulfillment of idealized formal safety rules feeds practices of blame attribution supported by alibi norms and inhibits possible prevention. In contrast, accident analyses undertaken in worker health surveillance services show potential to reveal origins of these events incubated in the history of the system ignored in practices guided by the traditional paradigm. PMID:22317212

  13. An innovative approach to predict technology evolution for the desoldering of printed circuit boards: A perspective from China and America.

    Science.gov (United States)

    Wang, Chen; Zhao, Wu; Wang, Jie; Chen, Ling; Luo, Chun-Jing

    2016-06-01

    The printed circuit boards basis of electronic equipment have seen a rapid growth in recent years and played a significant role in modern life. Nowadays, the fact that electronic devices upgrade quickly necessitates a proper management of waste printed circuit boards. Non-destructive desoldering of waste printed circuit boards becomes the first and the most crucial step towards recycling electronic components. Owing to the diversity of materials and components, the separation process is difficult, which results in complex and expensive recovery of precious materials and electronic components from waste printed circuit boards. To cope with this problem, we proposed an innovative approach integrating Theory of Inventive Problem Solving (TRIZ) evolution theory and technology maturity mapping system to forecast the evolution trends of desoldering technology of waste printed circuit boards. This approach can be applied to analyse the technology evolution, as well as desoldering technology evolution, then research and development strategy and evolution laws can be recommended. As an example, the maturity of desoldering technology is analysed with a technology maturity mapping system model. What is more, desoldering methods in different stages are analysed and compared. According to the analysis, the technological evolution trends are predicted to be 'the law of energy conductivity' and 'increasing the degree of idealisation'. And the potential technology and evolutionary state of waste printed circuit boards are predicted, offering reference for future waste printed circuit boards recycling. PMID:27067430

  14. Enrichment of the metallic components from waste printed circuit boards by a mechanical separation process using a stamp mill

    International Nuclear Information System (INIS)

    Printed circuit boards incorporated in most electrical and electronic equipment contain valuable metals such as Cu, Ni, Au, Ag, Pd, Fe, Sn, and Pb. In order to employ a hydrometallurgical route for the recycling of valuable metals from printed circuit boards, a mechanical pre-treatment step is needed. In this study, the metallic components from waste printed circuit boards have been enriched using a mechanical separation process. Waste printed circuit boards shredded to 5.0 mm. The fractions of milled printed circuit boards of size 5.0 mm fraction and the heavy fraction were subjected to two-step magnetic separation. Through the first magnetic separation at 700 Gauss, 83% of the nickel and iron, based on the whole printed circuit boards, was recovered in the magnetic fraction, and 92% of the copper was recovered in the non-magnetic fraction. The cumulative recovery of nickel-iron concentrate was increased by a second magnetic separation at 3000 Gauss, but the grade of the concentrate decreased remarkably from 76% to 56%. The cumulative recovery of copper concentrate decreased, but the grade increased slightly from 71.6% to 75.4%. This study has demonstrated the feasibility of the mechanical separation process consisting of milling/size classification/gravity separation/two-step magnetic separation for enriching metallic components such as Cu, Ni, Al, and Fe from waste printed circuit boards

  15. Research on Toxicity Evaluation of Waste Incineration Residues of Printed Circuit Boards

    Directory of Open Access Journals (Sweden)

    Rasa Volungevičienė

    2014-10-01

    Full Text Available Recycling waste printed circuit boards (PCB is an extremely complicated process, because PCBs consist of a number of complex components – hazardous and non-hazardous materials sets. Pyrolysis and combustion are currently the most effective treatment technologies for waste printed circuit boards. Pyrolysis can be used for thermally decomposing PCBs allowing for the simultaneous recovery of valuable materials. Following the extraction of valuable materials, the problem of residual ash utilization is encountered. Determining the qualitative and quantitative characteristics of incineration residue helps with choosing effective ash management technologies. This paper analyzes PCB ash generated at three different temperatures of 400 °C, 500 °C and 600 °C. Ash residues have been analysed to determine the quantity and type of metals present. Furthermore, the experiment of leaching heavy metals from ash has been described.

  16. [Selective recovery of copper, zinc and nickel from printed circuit boards by ammonia leaching under pressure].

    Science.gov (United States)

    Wang, Meng; Cao, Hong-Bin; Zhang, Yi

    2011-02-01

    The ammonia/ammonium leaching process using oxygen as oxidant in autoclave was studied to extract copper, zinc and nickel from printed circuit board. Parameters such as leaching time, concentration of leaching reagents, stirring speed, oxygen pressure and temperature were optimized. The best results were achieved when the leaching was carried out at 55 degrees C for 150 minutes, using 4 mol/L NH4OH and 1 mol/L (NH4)2CO3 as leaching solution, with 700 r/min stirring speed and 0.2 MPa oxygen. With this method, Zn, Cu and Ni could be effectively recovered from printed circuit boards by 100%, more than 99% and more than 64%, respectively. The kinetics of Cu leaching behavior was studied and it was found that the shrinking core model described it well. It was a diffusion control process and the apparent activation energy was 14.68 kJ/mol. PMID:21528589

  17. Metals Recovery from Artificial Ore in Case of Printed Circuit Boards, Using Plasmatron Plasma Reactor

    Directory of Open Access Journals (Sweden)

    Jakub Szałatkiewicz

    2016-08-01

    Full Text Available This paper presents the investigation of metals production form artificial ore, which consists of printed circuit board (PCB waste, processed in plasmatron plasma reactor. A test setup was designed and built that enabled research of plasma processing of PCB waste of more than 700 kg/day scale. The designed plasma process is presented and discussed. The process in tests consumed 2 kWh/kg of processed waste. Investigation of the process products is presented with their elemental analyses of metals and slag. The average recovery of metals in presented experiments is 76%. Metals recovered include: Ag, Au, Pd, Cu, Sn, Pb, and others. The chosen process parameters are presented: energy consumption, throughput, process temperatures, and air consumption. Presented technology allows processing of variable and hard-to-process printed circuit board waste that can reach up to 100% of the input mass.

  18. Differential microfluidic sensor on printed circuit board for biological cells analysis.

    Science.gov (United States)

    Shi, Dongyuan; Guo, Jinhong; Chen, Liang; Xia, Chuncheng; Yu, Zhefeng; Ai, Ye; Li, Chang Ming; Kang, Yuejun; Wang, Zhiming

    2015-08-01

    Coulter principal based resistive pulse sensor has been demonstrated as an important platform in biological cell detection and enumeration since several decades ago. Recently, the miniaturized micro-Coulter counter has attracted much attention due to its advantages in point of care diagnostics for on chip detection and enumeration of rare cells, such as circulating tumor cells. In this paper, we present a microfluidic cytometer with differential amplifier based on Coulter principle on a SU-8 coated printed circuit board substrate. The electrical current changes induced by the blockage of the microparticles in the sensing aperture are calibrated by polystyrene particles of standard size. Finally, HeLa cells are used to evaluate the performance of the proposed device for enumeration of biological samples. The proposed cytometer is built upon the cheap and widely available printed circuit board substrate and shows its great potential as personalized healthcare monitor. PMID:25735615

  19. Separation and Recovery of Fine Particles from Waste Circuit Boards Using an Inflatable Tapered Diameter Separation Bed

    OpenAIRE

    2014-01-01

    Recovering particle materials from discarded printed circuit boards can enhance resource recycling and reduce environmental pollution. Efficiently physically separating and recovering fine metal particles (−0.5 mm) from the circuit boards are a key recycling challenge. To do this, a new type of separator, an inflatable tapered diameter separation bed, was developed to study particle motion and separation mechanisms in the bed’s fluid flow field. For 0.5–0.25 mm circuit board particles, metal ...

  20. A Novel Designed Bioreactor for Recovering Precious Metals from Waste Printed Circuit Boards

    OpenAIRE

    Ruan Jujun; Zheng Jie; Hu Jian; Jianwen Zhang

    2015-01-01

    For recovering precious metals from waste printed circuit boards (PCBs), a novel hybrid technology including physical and biological methods was developed. It consisted of crushing, corona-electrostatic separation, and bioleaching. Bioleaching process is the focus of this paper. A novel bioreactor for bioleaching was designed. Bioleaching was carried out using Pseudomonas chlororaphis. Bioleaching experiments using mixed particles of Au and Cu were performed and leachate contained 0.006 mg/L,...

  1. Influence of physical and chemical factors on biological leaching process of copper from printed circuit boards

    OpenAIRE

    Willner, J

    2013-01-01

    The article presents the results of the research regarding the biological leaching of this metal from electronic wastes components in the form of printed circuit boards. The purpose of the study was to evaluate the influence of some physical and chemical factors (e.g. pH, oxidation-reduction potential) on bioleaching process and efficiency of copper transfer from solid phase into solution. Bioleaching experiments were carried out with pure cultures of Acidithiobacillus ferrooxidans. The obtai...

  2. Influence Of Used Bacterial Culture On Zinc And Aluminium Bioleaching From Printed Circuit Boards

    OpenAIRE

    Mrazikova Anna; Marcincakova Renata; Kadukova Jana; Velgosova Oksana; Balintova Magdalena

    2015-01-01

    Bioleaching processes were used to solubilize metals (Cu, Ni, Zn and Al) from printed circuit boards (PCBs). In this study, a PCBs-adapted pure culture of Acidithiobacillus ferrooxidans, pure culture of Acidithiobacillus thiooxidans and PCBs-adapted mixed culture of A. ferrooxidans and A. thiooxidans were used for recovery of the metals. The study showed that the mixed bacterial culture has the greatest potential to dissolve metals. The maximum metal bioleaching efficiencies were found to be ...

  3. Catalytic Pyrolysis and a Pyrolysis Kinetic Study of Shredded Printed Circuit Board for Fuel Recovery

    OpenAIRE

    Salmiaton Ali; Chee Hoe Ng; Hizam Hashim

    2014-01-01

    Scrap printed circuit boards (PCBs) are the most abundant wastes that can be found in the landfills in Malaysia and this disposal certainly poses serious detrimental to the environment. This research aims to investigate optimum temperature for pyrolyzing waste PCBs, find out the best catalyst to be used in accelerating PCBs’ pyrolysis, select suitable ratio of catalyst to PCBs for higher oil yield and examine kinetics pyrolysis of the waste PCBs’ decomposition. Operating temperatures ranged f...

  4. Leaching of gold, silver and accompanying metals from circuit boards (PCBs) waste

    OpenAIRE

    Jana Ficeriová; Peter Baláž; Eberhard Gock

    2011-01-01

    Au-Ag noble metal wastes represent a wide range of waste types and forms, with various accompanying metallic elements.The presented leaching strategy for Au-Ag contained in circuit boards (PCBs) aims at gaining gold and silver in the metallic form.Application of the proposed ammonium thiosulphate leaching process for the treatment of the above mentioned Au-Ag containing wastesrepresents a practical, economic and at the same time an ecological solution. The ammonium thiosulphate based leaching...

  5. Characterization of Printed Circuit Boards for Metal and Energy Recovery after Milling and Mechanical Separation

    OpenAIRE

    Waldir A. Bizzo; Renata A. Figueiredo; Valdelis F. de Andrade

    2014-01-01

    The proper disposal of electrical and electronic waste is currently a concern of researchers and environmental managers not only because of the large volume of such waste generated, but also because of the heavy metals and toxic substances it contains. This study analyzed printed circuit boards (PCBs) from discarded computers to determine their metal content and characterized them as solid waste and fuel. The analysis showed that PCBs consist of approximately 26% metal, made up mainly of copp...

  6. EMC and the printed circuit board design theory and layout made simple

    CERN Document Server

    Montrose, Mark I

    1999-01-01

    "This reference text shows how and why RF energy is created within a printed circuit board, and the manner in which propagation occurs. With thorough explanations, this book enables engineers to grasp both the fundamentals of EMC theory and signal integrity, along with the mitigation process needed to prevent an EMC event while maintaining optimal functionality for low- and high-technology products. Mr. Montrose also shows the relationship between time and frequency domains, helping one meet mandatory compliance requirements."--Jacket.

  7. Products Made from Nonmetallic Materials Reclaimed from Waste Printed Circuit Boards

    Institute of Scientific and Technical Information of China (English)

    MOU Peng; XIANG Dong; DUAN Guanghong

    2007-01-01

    Printed circuit boards (PCBs) are in all electronic equipment, so with the sharp increase of electronic waste, the recovery of PCB components has become a critical research field. This paper presents a study of the reclaimation and reuse of nonmetallic materials recovered from waste PCBs. Mechanical processes, such as crushing, milling, and separation, were used to process waste PCBs. Nonmetallic materials in the PCBs were separated using density-based separation with separation rates in excess of 95%. The recovered nonmetals were used to make models, construction materials, composite boards, sewer grates,and amusement park boats. The PCB nonmetal products have better mechanical characteristics and durability than traditional materials and fillers. The flexural strength of the PCB nonmetallic material composite boards is 30% greater than that of standard products. Products derived from PCB waste processing have been brought into industrial production. The study shows that PCB nonmetals can be reused in profitable and environmentally friendly ways.

  8. Bioleaching of metals from printed circuit boards supported with surfactant-producing bacteria

    Energy Technology Data Exchange (ETDEWEB)

    Karwowska, Ewa, E-mail: ewa.karwowska@is.pw.edu.pl [Warsaw University of Technology, Faculty of Environmental Engineering, Biology Division, Nowowiejska 20, 00-653 Warsaw (Poland); Andrzejewska-Morzuch, Dorota; Łebkowska, Maria [Warsaw University of Technology, Faculty of Environmental Engineering, Biology Division, Nowowiejska 20, 00-653 Warsaw (Poland); Tabernacka, Agnieszka, E-mail: agnieszka.tabernacka@is.pw.edu.pl [Warsaw University of Technology, Faculty of Environmental Engineering, Biology Division, Nowowiejska 20, 00-653 Warsaw (Poland); Wojtkowska, Małgorzata; Telepko, Alicja; Konarzewska, Agnieszka [Warsaw University of Technology, Faculty of Environmental Engineering, Nowowiejska 20, 00-653 Warsaw (Poland)

    2014-01-15

    Highlights: • Bioleaching of metals from printed circuit boards by BSAC-producing bacteria was estimated. • Aeration increased the release of all metals in medium with sulphur and biosurfactant. • Increase in Cu, Pb, Ni and Cr removal rate was observed at 37 °C in acidic medium. -- Abstract: This study has evaluated the possibility of bioleaching zinc, copper, lead, nickel, cadmium and chromium from printed circuit boards by applying a culture of sulphur-oxidising bacteria and a mixed culture of biosurfactant-producing bacteria and sulphur-oxidising bacteria. It was revealed that zinc was removed effectively both in a traditional solution acidified by a way of microbial oxidation of sulphur and when using a microbial culture containing sulphur-oxidising and biosurfactant-producing bacteria. The average process efficiency was 48% for Zn dissolution. Cadmium removal was similar in both media, with a highest metal release of 93%. For nickel and copper, a better effect was obtained in the acidic medium, with a process effectiveness of 48.5% and 53%, respectively. Chromium was the only metal that was removed more effectively in the bioleaching medium containing both sulphur-oxidising and biosurfactant-producing bacteria. Lead was removed from the printed circuit boards with very low effectiveness (below 0.5%). Aerating the culture medium with compressed air increased the release of all metals in the medium with sulphur and biosurfactant, and of Ni, Cu, Zn and Cr in the acidic medium. Increasing the temperature of the medium (to 37 °C) had a more significant impact in the acidic environment than in the neutral environment.

  9. Bioleaching of metals from printed circuit boards supported with surfactant-producing bacteria

    International Nuclear Information System (INIS)

    Highlights: • Bioleaching of metals from printed circuit boards by BSAC-producing bacteria was estimated. • Aeration increased the release of all metals in medium with sulphur and biosurfactant. • Increase in Cu, Pb, Ni and Cr removal rate was observed at 37 °C in acidic medium. -- Abstract: This study has evaluated the possibility of bioleaching zinc, copper, lead, nickel, cadmium and chromium from printed circuit boards by applying a culture of sulphur-oxidising bacteria and a mixed culture of biosurfactant-producing bacteria and sulphur-oxidising bacteria. It was revealed that zinc was removed effectively both in a traditional solution acidified by a way of microbial oxidation of sulphur and when using a microbial culture containing sulphur-oxidising and biosurfactant-producing bacteria. The average process efficiency was 48% for Zn dissolution. Cadmium removal was similar in both media, with a highest metal release of 93%. For nickel and copper, a better effect was obtained in the acidic medium, with a process effectiveness of 48.5% and 53%, respectively. Chromium was the only metal that was removed more effectively in the bioleaching medium containing both sulphur-oxidising and biosurfactant-producing bacteria. Lead was removed from the printed circuit boards with very low effectiveness (below 0.5%). Aerating the culture medium with compressed air increased the release of all metals in the medium with sulphur and biosurfactant, and of Ni, Cu, Zn and Cr in the acidic medium. Increasing the temperature of the medium (to 37 °C) had a more significant impact in the acidic environment than in the neutral environment

  10. Estimation of Operating Condition of Appliances Using Circuit Current Data on Electric Distribution Boards

    Science.gov (United States)

    Iwafune, Yumiko; Ogimoto, Kazuhiko; Yagita, Yoshie

    The Energy management systems (EMS) on demand sides are expected as a method to enhance the capability of supply and demand balancing of a power system under the anticipated penetration of renewable energy generation such as Photovoltaics (PV). Elucidation of energy consumption structure in a building is one of important elements for realization of EMS and contributes to the extraction of potential energy saving. In this paper, we propose the estimation method of operating condition of household appliances using circuit current data on an electric distribution board. Circuit current data are broken down by their shape using a self-organization map method and aggregated by appliance based on customers' information of appliance possessed. Proposed method is verified using residential energy consumption measurement survey data.

  11. Recovery of gold from computer circuit board scrap using aqua regia.

    Science.gov (United States)

    Sheng, Peter P; Etsell, Thomas H

    2007-08-01

    Computer circuit board scrap was first treated with one part concentrated nitric acid and two parts water at 70 degrees C for 1 h. This step dissolved the base metals, thereby liberating the chips from the boards. After solid-liquid separation, the chips, intermixed with some metallic flakes and tin oxide precipitate, were mechanically crushed to liberate the base and precious metals contained within the protective plastic or ceramic chip cases. The base metals in this crushed product were dissolved by leaching again with the same type of nitric acid-water solution. The remaining solid constituents, crushed chips and resin, plus solid particles of gold, were leached with aqua regia at various times and temperatures. Gold was precipitated from the leachate with ferrous sulphate. PMID:17874665

  12. Influence of physical and chemical factors on biological leaching process of copper from printed circuit boards

    Directory of Open Access Journals (Sweden)

    J. Willner

    2013-04-01

    Full Text Available The article presents the results of the research regarding the biological leaching of this metal from electronic wastes components in the form of printed circuit boards. The purpose of the study was to evaluate the influence of some physical and chemical factors (e.g. pH, oxidation-reduction potential on bioleaching process and efficiency of copper transfer from solid phase into solution. Bioleaching experiments were carried out with pure cultures of Acidithiobacillus ferrooxidans. The obtained results were discussed.

  13. Kinetic Study of the Pyrolysis of Waste Printed Circuit Boards Subject to Conventional and Microwave Heating

    OpenAIRE

    Chunyuan Ma; Chao Zhao; Qingluan Ma; Zhen Liu; Wenlong Wang; Jing Sun

    2012-01-01

    This paper describes a kinetic study of the decomposition of waste printed circuit boards (WPCB) under conventional and microwave-induced pyrolysis conditions. We discuss the heating rates and the influence of the pyrolysis on the thermal decomposition kinetics of WPCB. We find that the thermal degradation of WPCB in a controlled conventional thermogravimetric analyzer (TGA) occurred in the temperature range of 300 °C–600 °C, where the main pyrolysis of organic matter takes place along wi...

  14. Separation of the metallic and non-metallic fraction from printed circuit boards employing green technology.

    Science.gov (United States)

    Estrada-Ruiz, R H; Flores-Campos, R; Gámez-Altamirano, H A; Velarde-Sánchez, E J

    2016-07-01

    The generation of electrical and electronic waste is increasing day by day; recycling is attractive because of the metallic fraction containing these. Nevertheless, conventional techniques are highly polluting. The comminution of the printed circuit boards followed by an inverse flotation process is a clean technique that allows one to separate the metallic fraction from the non-metallic fraction. It was found that particle size and superficial air velocity are the main variables in the separation of the different fractions. In this way an efficient separation is achieved by avoiding the environmental contamination coupled with the possible utilization of the different fractions obtained. PMID:26963241

  15. A Novel Metamaterial Structure to Reduce Far-End Crosstalk in Printed Circuit Boards

    OpenAIRE

    R.Azhagumurugan; Indumathi, P.

    2014-01-01

    Far-End crosstalk is a common problem in a printed circuit boards when two transmission lines are in close proximity. This paper proposes a newly designed method to reduce the far-end crosstalk using metamaterials as a complementary split ring resonator (CSRRs). The CSRRs are etched in the ground plane and are used to control the radiated electromagnetic fileds. Comparative analyses are taken for three cases with solid ground plane etching one CSRR and 2 CSRRs in the ground plane. Analysis sh...

  16. Comparative study of electromagnetic compatibility methods in printed circuit board design tools

    International Nuclear Information System (INIS)

    The paper considers the state-of-the art in electromagnetic compatibility (EMC) oriented printed circuit board (PCB) design. A general methodology of EMC oriented PCB design is synthesized. The main CAD tools available today are estimated and compared for their abilities to treat EMC oriented design. To help non experts a knowledge-base containing more than 50 basic rules for EMC-oriented PCB design is proposed. It can be applied in the PCB design CAD tools that possess rule-builders or it can help interactive design. Trends in this area of EMC-oriented PCB design are deduced. (Author)

  17. Investigation, development and verification of printed circuit board embedded air-core solenoid transformers

    DEFF Research Database (Denmark)

    Mønster, Jakob Døllner; Madsen, Mickey Pierre; Pedersen, Jeppe Arnsdorf; Knott, Arnold

    A new printed circuit board embedded air-core transformer/coupled inductor is proposed and presented. The transformer is intended for use in power converter applications operating at very high frequency between 30 MHz to 300 MHz. The transformer is based on two or more solenoid structures in...... prototypes. The analytical model shows good agreement with the measured results. The model can predict the inductive parameters of the transformer with a deviation range of approximately 3 % to 22 %. Lastly a prototype is used in a VHF converter to achieve a rise of 2.2% points in efficiency....

  18. Impaired activity-dependent neural circuit assembly and refinement in autism spectrum disorder genetic models

    OpenAIRE

    Caleb Andrew Doll; Kendal eBroadie

    2014-01-01

    Early-use activity during circuit-specific critical periods refines brain circuitry by the coupled processes of eliminating inappropriate synapses and strengthening maintained synapses. We theorize these activity-dependent developmental processes are specifically impaired in autism spectrum disorders (ASDs). ASD genetic models in both mouse and Drosophila have pioneered our insights into normal activity-dependent neural circuit assembly and consolidation, and how these developmental mechanism...

  19. Microwave assisted leaching and electrochemical recovery of copper from printed circuit boards of computer waste

    Directory of Open Access Journals (Sweden)

    Ivănuş R.C.

    2010-06-01

    Full Text Available Due to the rapid technological progress, the replacement of electronic equipment is very often necessary, leading to huge amounts that end up as waste. In addition, waste electrical and electronic equipment (WEEE contains metals of high commercial value and others that are supposed to be hazardous for the environment. Consequently, WEEE could be considered as a significant source for recovery of nonferrous metals. Among these wastes, computers appear to be distinctive, as far as further exploitation is concerned. The most ″useful″ parts of the computers are the printed circuit boards that contain many metals of interest. A study on microwave assisted electronic scrap (printed circuit boards of computer waste – PCBs leaching was carried out with a microwave hydrothermal reactor. The leaching was conducted with thick slurries (50-100 g/L. The leaching media is a mixed solution of CuCl2 and NaCl. Preliminary electrolysis from leaching solution has investigated the feasibility of electrodeposition of copper. The results were discussed and compared with the conventional leaching method and demonstrated the potential for selective extraction of copper from PCBs.

  20. Distribution of heavy metals during pyrolysis of waste printed circuit boards

    Institute of Scientific and Technical Information of China (English)

    PENG Shao-hong; CHEN Lie-qiang; CAI Ming-zhao; WANG Yun-yu

    2006-01-01

    The volatilization behavior of Cu, Pb, Sn, Sb, Ni, Zn, Mn, Co, Cr, Cd during pyrolysis of waste printed circuit boards was investigated in a bench-scale fixed-bed pyrolysis system. It was found that volatility of heavy metals increases with operating temperature elevating, and bromine and vacuum have an obvious promoting effect on volatility of most of heavy metals. Over 99% weight of Cu and Ni are still remained in solid residue after pyrolysis, about 20% weight of Sb, Zn and Cd are transfered into liquid and gas during a pyrolysis process at 600 ℃, volatilization fractions of Pb, Sn, Mn, Co, Cr are less than 10% at the same conditions. The contents of heavy metals in liquid and gas products depend on not only volatility of metals, but also their initial contents in printed circuit boards, pyrolysis liquid and gas are primarily contaminated by Cu, Pb, Sn,Sb and Zn, their contents in liquid vary from 102 to 103 μg/mL, Mn, Co, Cr, Cd were detected only at very low level, less than 10 μg/mL.

  1. Recovery of tin and copper by recycling of printed circuit boards from obsolete computers

    Directory of Open Access Journals (Sweden)

    L. A. Castro

    2009-12-01

    Full Text Available This paper presents the experimental results for the leaching of printed circuit boards (PCB from obsolete computers for extracting and recovering tin and copper by means of leaching followed by precipitation. Printed circuit boards were dismantled, cut into small pieces, and fed into a cylinder mill. The powder obtained was leached by using the aqueous solutions 2.18N H2SO4, 2.18N H2SO4 + 3.0N HCl, 3.0N HCl, and 3.0N HCl + 1.0N HNO3. The lowest values for the percentage of metal extraction were obtained with 2.18N H2SO4 (2.7% for Sn and lower than 0.01% for Cu, while the 3.0N HCl + 1.0N HNO3 leach system exhibited an extraction of 98% for Sn and 93% for Cu. Precipitates were obtained at different pH values by neutralizing the leach liquors using NaOH. The 3.0N HCl + 1.0N HNO3 leach system presented the highest recovery values from the powder feed (84.1% for Sn and 31.9% for Cu, as well as from the leach liquor (85.8% for Sn and 34.3% for Cu.

  2. Simultaneous detection of lactate and glucose by integrated printed circuit board based array sensing chip

    Energy Technology Data Exchange (ETDEWEB)

    Li, Xuelian [Institute for Clean Energy and Advanced Materials, Southwest University, Chongqing 400715 (China); School of Chemistry and Chemical Engineering, Southwest University, Chongqing 400715 (China); Zang, Jianfeng [Department of Mechanical Engineering and Materials Science, Duke University, Durham, NC 27708 (United States); Liu, Yingshuai; Lu, Zhisong [Institute for Clean Energy and Advanced Materials, Southwest University, Chongqing 400715 (China); Li, Qing, E-mail: Qli@swu.edu.cn [School of Chemistry and Chemical Engineering, Southwest University, Chongqing 400715 (China); Li, Chang Ming, E-mail: ecmli@swu.edu.cn [Institute for Clean Energy and Advanced Materials, Southwest University, Chongqing 400715 (China)

    2013-04-10

    Highlights: ► An integrated printed circuit board (PCB) based array sensing chip was developed. ► Simultaneous detection of lactate and glucose in serum has been demonstrated. ► The array electronic biochip has high signal to noise ratio and high sensitivity. ► Additional electrodes were designed on the chip to correct interferences. -- Abstract: An integrated printed circuit board (PCB) based array sensing chip was developed to simultaneously detect lactate and glucose in mouse serum. The novelty of the chip relies on a concept demonstration of inexpensive high-throughput electronic biochip, a chip design for high signal to noise ratio and high sensitivity by construction of positively charged chitosan/redox polymer Polyvinylimidazole-Os (PVI-Os)/carbon nanotube (CNT) composite sensing platform, in which the positively charged chitosan/PVI-Os is mediator and electrostatically immobilizes the negatively charged enzyme, while CNTs function as an essential cross-linker to network PVI-Os and chitosan due to its negative charged nature. Additional electrodes on the chip with the same sensing layer but without enzymes were prepared to correct the interferences for high specificity. Low detection limits of 0.6 μM and 5 μM were achieved for lactate and glucose, respectively. This work could be extended to inexpensive array sensing chips with high sensitivity, good specificity and high reproducibility for various sensor applications.

  3. Immobilization of Acidithiobacillus ferrooxidans on Cotton Gauze for the Bioleaching of Waste Printed Circuit Boards.

    Science.gov (United States)

    Nie, Hongyan; Zhu, Nengwu; Cao, Yanlan; Xu, Zhiguo; Wu, Pingxiao

    2015-10-01

    The bioleaching parameters of metal concentrates from waste printed circuit boards by Acidithiobacillus ferrooxidans immobilized on cotton gauze in a two-step reactor were investigated in this study. The results indicated that an average ferrous iron oxidation rate of 0.54 g/(L·h) and a ferrous iron oxidation ratio of 96.90 % were obtained after 12 h at aeration rate of 1 L/min in bio-oxidation reactor. After 96 h, the highest leaching efficiency of copper reached 91.68 % under the conditions of the content of the metal powder 12 g/L, the retention time 6 h, and the aeration rate 1 L/min. The bioleaching efficiency of copper could be above 91.12 % under repeated continuous batch operation. Meanwhile, 95.32 % of zinc, 90.32 % of magnesium, 86.31 % of aluminum, and 59.07 % of nickel were extracted after 96 h. All the findings suggested that the recovery of metal concentrates from waste printed circuit boards via immobilization of A. ferrooxidans on cotton gauze was feasible. PMID:26239442

  4. Mineralogical analysis of dust collected from typical recycling line of waste printed circuit boards.

    Science.gov (United States)

    Wang, Fangfang; Zhao, Yuemin; Zhang, Tao; Duan, Chenlong; Wang, Lizhang

    2015-09-01

    As dust is one of the byproducts originating in the mechanical recycling process of waste printed circuit boards such as crushing and separating, from the viewpoints of resource reuse and environmental protection, an effective recycling method to recover valuable materials from this kind of dust is in urgent need. In this paper, detailed mineralogical analysis on the dust collected from a typical recycling line of waste printed circuit boards is investigated by coupling several analytical techniques. The results demonstrate that there are 73.1wt.% organic matters, 4.65wt.% Al, 4.55wt.% Fe, 2.67wt.% Cu and 1.06wt.% Pb in the dust, which reveals the dust is worthy of reuse and harmful to environment. The concentration ratios of Fe, Mn and Zn can reach 12.35, 12.33 and 6.67 respectively by magnetic separation. The yield of dust in each size fraction is nonuniform, while the yield of -0.75mm size fraction is up to 51.15wt.%; as the particle size decreases, the content of liberated metals and magnetic materials increase, and metals are mainly in elemental forms. The F, Cl and Br elements combing to C in the dust would make thermal treatment dangerous to the environment. Based on these results, a flowsheet to recycle the dust is proposed. PMID:26117419

  5. Simultaneous detection of lactate and glucose by integrated printed circuit board based array sensing chip

    International Nuclear Information System (INIS)

    Highlights: ► An integrated printed circuit board (PCB) based array sensing chip was developed. ► Simultaneous detection of lactate and glucose in serum has been demonstrated. ► The array electronic biochip has high signal to noise ratio and high sensitivity. ► Additional electrodes were designed on the chip to correct interferences. -- Abstract: An integrated printed circuit board (PCB) based array sensing chip was developed to simultaneously detect lactate and glucose in mouse serum. The novelty of the chip relies on a concept demonstration of inexpensive high-throughput electronic biochip, a chip design for high signal to noise ratio and high sensitivity by construction of positively charged chitosan/redox polymer Polyvinylimidazole-Os (PVI-Os)/carbon nanotube (CNT) composite sensing platform, in which the positively charged chitosan/PVI-Os is mediator and electrostatically immobilizes the negatively charged enzyme, while CNTs function as an essential cross-linker to network PVI-Os and chitosan due to its negative charged nature. Additional electrodes on the chip with the same sensing layer but without enzymes were prepared to correct the interferences for high specificity. Low detection limits of 0.6 μM and 5 μM were achieved for lactate and glucose, respectively. This work could be extended to inexpensive array sensing chips with high sensitivity, good specificity and high reproducibility for various sensor applications

  6. Microfabricated field calibration assembly for analytical instruments

    Science.gov (United States)

    Robinson, Alex L.; Manginell, Ronald P.; Moorman, Matthew W.; Rodacy, Philip J.; Simonson, Robert J.

    2011-03-29

    A microfabricated field calibration assembly for use in calibrating analytical instruments and sensor systems. The assembly comprises a circuit board comprising one or more resistively heatable microbridge elements, an interface device that enables addressable heating of the microbridge elements, and, in some embodiments, a means for positioning the circuit board within an inlet structure of an analytical instrument or sensor system.

  7. Synthesis of Arbitrary Quantum Circuits to Topological Assembly

    Science.gov (United States)

    Paler, Alexandru; Devitt, Simon J.; Fowler, Austin G.

    2016-08-01

    Given a quantum algorithm, it is highly nontrivial to devise an efficient sequence of physical gates implementing the algorithm on real hardware and incorporating topological quantum error correction. In this paper, we present a first step towards this goal, focusing on generating correct and simple arrangements of topological structures that correspond to a given quantum circuit and largely neglecting their efficiency. We detail the many challenges that will need to be tackled in the pursuit of efficiency. The software source code can be consulted at https://github.com/alexandrupaler/tqec.

  8. Rapid construction of insulated genetic circuits via synthetic sequence-guided isothermal assembly

    OpenAIRE

    Torella, Joseph P.; Boehm, Christian R.; Lienert, Florian; Chen, Jan-Hung; Way, Jeffrey C.; Silver, Pamela A.

    2013-01-01

    In vitro recombination methods have enabled one-step construction of large DNA sequences from multiple parts. Although synthetic biological circuits can in principle be assembled in the same fashion, they typically contain repeated sequence elements such as standard promoters and terminators that interfere with homologous recombination. Here we use a computational approach to design synthetic, biologically inactive unique nucleotide sequences (UNSes) that facilitate accurate ordered assembly....

  9. Comparative Study of Crosstalk Reduction Techniques in RF Printed Circuit Board Using FDTD Method

    Directory of Open Access Journals (Sweden)

    Rajeswari Packianathan

    2015-01-01

    Full Text Available Miniaturization of the feature size in modern electronic circuits results from placing interconnections in close proximity with a high packing density. As a result, coupling between the adjacent lines has increased significantly, causing crosstalk to become an important concern in high-performance circuit design. In certain applications, microstriplines may be used in printed circuit boards for propagating high-speed signals, rather than striplines. Here, the electromagnetic coupling effects are analyzed for various microstrip transmission line structures, namely, microstriplines with a guard trace, double stub microstriplines, and parallel serpentine microstriplines using the finite-difference time-domain method. The numerical results are compared with simulation results, where the variants are simulated using an Ansoft high-frequency structure simulator. The analysis and simulation results are experimentally validated by fabricating a prototype and establishing a good correspondence between them. Numerical results are compared with simulation and experimental results, showing that double stub microstriplines reduce the far end crosstalk by 7 dB and increase the near end crosstalk by about 2 dB compared with the parallel microstriplines. Parallel serpentine microstriplines reduce the far end crosstalk by more than 10 dB and also reduce more than 15 mV of peak far end crosstalk voltage, compared with parallel microstriplines.

  10. Rapid construction of insulated genetic circuits via synthetic sequence-guided isothermal assembly

    Energy Technology Data Exchange (ETDEWEB)

    Torella, JP; Boehm, CR; Lienert, F; Chen, JH; Way, JC; Silver, PA

    2013-12-28

    In vitro recombination methods have enabled one-step construction of large DNA sequences from multiple parts. Although synthetic biological circuits can in principle be assembled in the same fashion, they typically contain repeated sequence elements such as standard promoters and terminators that interfere with homologous recombination. Here we use a computational approach to design synthetic, biologically inactive unique nucleotide sequences (UNSes) that facilitate accurate ordered assembly. Importantly, our designed UNSes make it possible to assemble parts with repeated terminator and insulator sequences, and thereby create insulated functional genetic circuits in bacteria and mammalian cells. Using UNS-guided assembly to construct repeating promoter-gene-terminator parts, we systematically varied gene expression to optimize production of a deoxychromoviridans biosynthetic pathway in Escherichia coli. We then used this system to construct complex eukaryotic AND-logic gates for genomic integration into embryonic stem cells. Construction was performed by using a standardized series of UNS-bearing BioBrick-compatible vectors, which enable modular assembly and facilitate reuse of individual parts. UNS-guided isothermal assembly is broadly applicable to the construction and optimization of genetic circuits and particularly those requiring tight insulation, such as complex biosynthetic pathways, sensors, counters and logic gates.

  11. Fabrication and integration of micro/nano-scale polymer optical waveguides and devices for optical printed circuit board (O-PCB) application

    Science.gov (United States)

    Lee, El-Hang; Lee, Seung Gol; O, Beom Hoan; Park, Se Geun; Kim, Kyong Heon; Kang, Jin Ku; Chin, I.; Kwon, Y. K.; Choi, Young Wan

    2005-04-01

    We report on the results of our study on the design, fabrication and integration of micro/nano-scale waveguide arrays and devices for applications for a modular system that we newly proposed and call "optical printed circuit board (O-PCB)," which we envision to use as a platform for VLSI micro/nano-photonic applications. The O-PCBs are designed to perform the functions of transporting, switching, routing and distributing optical signals on flat modular boards or substrates. We have designed and assembled O-PCBs using polymer-based optical waveguide arrays and circuits. We describe the procedures for the synthesis of polymers, procedures of forming masters and stamps, and procedures of forming waveguides using embossing techniques. We also describe the procedures of design, fabrication and construction of O-PCBs and describe the procedures for light coupling between light sources, detectors, waveguides and other functional devices. We also describe design of power beam splitters and waveguide filters using photonic band-gap crystals for VLSI photonic integration application. We also discuss the characteristics of the assembled O-PCBs and discuss their potential applications.

  12. Toward environmentally-benign utilization of nonmetallic fraction of waste printed circuit boards as modifier and precursor

    Energy Technology Data Exchange (ETDEWEB)

    Hadi, Pejman; Ning, Chao; Ouyang, Weiyi; Xu, Meng [Chemical and Biomolecular Engineering Department, Hong Kong University of Science and Technology, Clear Water Bay Road, Hong Kong Special Administrative Region (Hong Kong); Lin, Carol S.K. [School of Energy and Environment, City University of Hong Kong, Tat Chee Avenue, Kowloon Tong, Hong Kong Special Administrative Region (Hong Kong); McKay, Gordon, E-mail: kemckayg@ust.hk [Chemical and Biomolecular Engineering Department, Hong Kong University of Science and Technology, Clear Water Bay Road, Hong Kong Special Administrative Region (Hong Kong); Division of Sustainable Development, College of Science, Engineering and Technology, Hamad bin Khalifa University, Doha (Qatar)

    2015-01-15

    Highlights: • Environmental impacts of electronic waste and specifically waste printed circuit boards. • Review of the recycling techniques of waste printed circuit boards. • Advantages of physico-mechanical recycling techniques over chemical methods. • Utilization of nonmetallic fraction of waste printed circuit boards as modifier/filler. • Recent advances in the use of nonmetallic fraction of waste printed circuit boards as precursor. - Abstract: Electronic waste, including printed circuit boards, is growing at an alarming rate due to the accelerated technological progress and the shorter lifespan of the electronic equipment. In the past decades, due to the lack of proper economic and environmentally-benign recycling technologies, a major fraction of e-waste generated was either destined to landfills or incinerated with the sole intention of its disposal disregarding the toxic nature of this waste. Recently, with the increasing public awareness over their environment and health issues and with the enaction of more stringent regulations, environmentally-benign recycling has been driven to be an alternative option partially replacing the traditional eco-unfriendly disposal methods. One of the most favorable green technologies has been the mechanical separation of the metallic and nonmetallic fraction of the waste printed circuit boards. Although metallic fraction, as the most profitable component, is used to generate the revenue of the separation process, the nonmetallic fraction (NMF) has been left isolated. Herein, the recent developments in the application of NMF have been comprehensively reviewed and an eco-friendly emerging usage of NMF as a value-added material for sustainable remediation has been introduced.

  13. Toward environmentally-benign utilization of nonmetallic fraction of waste printed circuit boards as modifier and precursor

    International Nuclear Information System (INIS)

    Highlights: • Environmental impacts of electronic waste and specifically waste printed circuit boards. • Review of the recycling techniques of waste printed circuit boards. • Advantages of physico-mechanical recycling techniques over chemical methods. • Utilization of nonmetallic fraction of waste printed circuit boards as modifier/filler. • Recent advances in the use of nonmetallic fraction of waste printed circuit boards as precursor. - Abstract: Electronic waste, including printed circuit boards, is growing at an alarming rate due to the accelerated technological progress and the shorter lifespan of the electronic equipment. In the past decades, due to the lack of proper economic and environmentally-benign recycling technologies, a major fraction of e-waste generated was either destined to landfills or incinerated with the sole intention of its disposal disregarding the toxic nature of this waste. Recently, with the increasing public awareness over their environment and health issues and with the enaction of more stringent regulations, environmentally-benign recycling has been driven to be an alternative option partially replacing the traditional eco-unfriendly disposal methods. One of the most favorable green technologies has been the mechanical separation of the metallic and nonmetallic fraction of the waste printed circuit boards. Although metallic fraction, as the most profitable component, is used to generate the revenue of the separation process, the nonmetallic fraction (NMF) has been left isolated. Herein, the recent developments in the application of NMF have been comprehensively reviewed and an eco-friendly emerging usage of NMF as a value-added material for sustainable remediation has been introduced

  14. STUDY ON INFRARED PBS DETECTOR PREPARED USING COPPER ELECTRODES OF PRINTED CIRCUIT BOARD

    Directory of Open Access Journals (Sweden)

    Hariyadi Soetedjo

    2013-01-01

    Full Text Available Copper layers of Printed Circuit Board (PCB have been used as electrodes for PbS infrared structure detector to introduce low cost and simple in preparation. PbS deposition as an active layer detector has been prepared for a few micrometers in thickness using an evaporation technique under vacuum pressure at 10-6 Torr. Photoconductivity phenomenon has been observed from the measurement when IR radiation of a Tungsten lamp introduced to the detector. The sensitivity of the detector respects to the variation of radiation intensities was also observed. The results showed that the detector has good sensitivity indicated by rapid drop voltages at a short-wavelength IR region (1-3 µm. This phenomenon is encouraging for further applications of detector prepared using the electrodes from a commercialized PCB.

  15. Environmental friendly automatic line for recovering metal from waste printed circuit boards.

    Science.gov (United States)

    Li, Jia; Xu, Zhenming

    2010-02-15

    The technology industrialization was the final goal of the research. A set of automatic line without negative impact to environment for recycling waste printed circuit boards (PCB) in industry-scale was investigated in this study. The independent technologies were integrated and many problems in the process of technology industrialization were solved. The whole technology contained four parts: multiple scarping, material screening, multiple-roll corona electrostatic separator, and dust precipitation. The output of this automatic line reached 600 kg/h and the recovery rate of copper reached 95%. After separation, the metal and nonmetal products were totally reused. Compared with other production lines (traditional fluid bed production line and processing from developed countries), the automatic line has lower energy consumption and better technology rationality. The cost of this line was in acceptable level for local processors. PMID:20092305

  16. Influence Of Used Bacterial Culture On Zinc And Aluminium Bioleaching From Printed Circuit Boards

    Directory of Open Access Journals (Sweden)

    Mrazikova Anna

    2015-06-01

    Full Text Available Bioleaching processes were used to solubilize metals (Cu, Ni, Zn and Al from printed circuit boards (PCBs. In this study, a PCBs-adapted pure culture of Acidithiobacillus ferrooxidans, pure culture of Acidithiobacillus thiooxidans and PCBs-adapted mixed culture of A. ferrooxidans and A. thiooxidans were used for recovery of the metals. The study showed that the mixed bacterial culture has the greatest potential to dissolve metals. The maximum metal bioleaching efficiencies were found to be 100, 92, 89 and 20% of Cu, Ni, Zn and Al, respectively. The mixed culture revealed higher bacterial stability. The main factor responsible for high metal recovery was the ability of the mixed culture to maintain the low pH during the whole process. The pure culture of A. thiooxidans had no significant effect on metal bioleaching from PCBs.

  17. Vibration suppression of printed circuit boards using an external particle damper

    Science.gov (United States)

    Veeramuthuvel, P.; Sairajan, K. K.; Shankar, K.

    2016-03-01

    Particle damping is an effective method of passive vibration control, of recent research interest. The novel use of particle damper capsule on a Printed Circuit Board (PCB) and the development of Radial Basis Function neural network to accurately predict the acceleration response is presented here. The prediction of particle damping using this neural network is studied in comparison with the Back Propagation Neural network. Extensive experiments are carried out on a PCB for different combinations of particle damper parameters such as particle size, particle density, packing ratio, and the input force during the primary modes of vibration and the obtained results are used for training and testing of neural networks. Based on the prediction from the better trained network, useful design guidelines for the particle damper suitable for PCB are arrived at. The effectiveness of particle dampers for vibration suppression of PCB under random vibration environment is demonstrated based on these design guidelines.

  18. Bioleaching waste printed circuit boards by Acidithiobacillus ferrooxidans and its kinetics aspect.

    Science.gov (United States)

    Yang, Yuankun; Chen, Shu; Li, Shicheng; Chen, Mengjun; Chen, Haiyan; Liu, Bijun

    2014-03-10

    In this paper, H(+) consumption and metal recovery, during the process of bioleaching waste printed circuit boards (WPCBs) by Acidithiobacillus ferrooxidans (A. ferrooxidans), were discussed in detail. When the WPCBs concentration was 15g/L, Cu (96.8%), Zn (83.8%), and Al (75.4%) were recovered after 72h by A. ferrooxidans. Experimental results indicated that metal recovery rate was significantly influenced by acid. Based on experimental results, the kinetics of the H(+) consumption and metal recovery on bioleaching WPCBs were represented by reaction kinetic equations. The kinetic of H(+) consumption could be described by the second-order kinetic model. The metal recovery belongs to the second-order model with adding acid, which was changed to the shrinking core model with precipitate production. PMID:24445171

  19. A Novel Metamaterial Structure to Reduce Far-End Crosstalk in Printed Circuit Boards

    Directory of Open Access Journals (Sweden)

    R.Azhagumurugan

    2014-05-01

    Full Text Available Far-End crosstalk is a common problem in a printed circuit boards when two transmission lines are in close proximity. This paper proposes a newly designed method to reduce the far-end crosstalk using metamaterials as a complementary split ring resonator (CSRRs. The CSRRs are etched in the ground plane and are used to control the radiated electromagnetic fileds. Comparative analyses are taken for three cases with solid ground plane etching one CSRR and 2 CSRRs in the ground plane. Analysis shows that a significant reduction in the crosstalk is achieved when 2 CSRRs are etched in the ground plane. This design is made to reduce the crosstalk without additional components.

  20. Ductile electroless Ni-P coating onto flexible printed circuit board

    Science.gov (United States)

    Wang, Wenchang; Zhang, Weiwei; Wang, Yurong; Mitsuzak, Naotoshi; Chen, Zhidong

    2016-03-01

    In this study, a ductile electroless Ni-P coating on the flexible printed circuit board (FPCB) was prepared in an acidic nickel plating bath. The addition of dipropylamine (DPA) in electroless plating not only improves the ductility of the Ni-P coating, but also enhances the corrosion resistance. The further analysis reveals that the ductility improvement and enhancement of corrosion resistance for the Ni-P coating may be due to the fact that the addition of DPA significantly refines the volume of columnar nodule and reduce the porosity, thus leading to the released internal stress. In addition, it was found that the nodule within the Ni-P coating grew into a columnar structure, which may be also contribute to the improvement of ductility.

  1. Plated through-hole vias in a porous polyimide foil for flexible printed circuit boards

    International Nuclear Information System (INIS)

    A fabrication process for high aspect ratio plated through-hole vias is presented for flexible printed circuit boards. A 75 µm thick porous Kapton foil that allows direct definition of high aspect ratio through-hole vias by dry photoresist film lithography and electrodeposition is presented. Pretreatment with swift heavy ion irradiation and wet etching define the pore density and porosity of the foil, similar to ion-track-etched filter membranes. Thin film metallization of a seed layer and lithography of a laminated dry photoresist film define the via sizes and positions. Subsequent through-hole electrodeposition produces vias consisting of multiple wires, where each open pore defines one wire. The via geometries are characterized by scanning electron microscopy. The electrical properties of the vias are characterized by resistance measurements. Vias with an aspect ratio over 2 and a side length of 33 µm show high yield with low resistance and low variation in resistance. (note)

  2. Application of Printed Circuit Board Technology to FT-ICR MS Analyzer Cell Construction and Prototyping

    Science.gov (United States)

    Leach, Franklin E.; Norheim, Randolph; Anderson, Gordon; Pasa-Tolic, Ljiljana

    2014-12-01

    Although Fourier transform ion cyclotron resonance mass spectrometry (FT-ICR MS) remains the mass spectrometry platform that provides the highest levels of performance for mass accuracy and resolving power, there is room for improvement in analyzer cell design as the ideal quadrupolar trapping potential has yet to be generated for a broadband MS experiment. To this end, analyzer cell designs have improved since the field's inception, yet few research groups participate in this area because of the high cost of instrumentation efforts. As a step towards reducing this barrier to participation and allowing for more designs to be physically tested, we introduce a method of FT-ICR analyzer cell prototyping utilizing printed circuit boards at modest vacuum conditions. This method allows for inexpensive devices to be readily fabricated and tested over short intervals and should open the field to laboratories lacking or unable to access high performance machine shop facilities because of the required financial investment.

  3. Pollutant emissions during pyrolysis and combustion of waste printed circuit boards, before and after metal removal

    Energy Technology Data Exchange (ETDEWEB)

    Ortuño, Nuria; Conesa, Juan A., E-mail: ja.conesa@ua.es; Moltó, Julia; Font, Rafael

    2014-11-15

    The constant increase in the production of electronic devices implies the need for an appropriate management of a growing number of waste electrical and electronic equipment. Thermal treatments represent an interesting alternative to recycle this kind of waste, but particular attention has to be paid to the potential emissions of toxic by-products. In this study, the emissions from thermal degradation of printed circuit boards (with and without metals) have been studied using a laboratory scale reactor, under oxidizing and inert atmosphere at 600 and 850 °C. Apart from carbon oxides, HBr was the main decomposition product, followed by high amounts of methane, ethylene, propylene, phenol and benzene. The maximum formation of PAHs was found in pyrolysis at 850 °C, naphthalene being the most abundant. High levels of 2-, 4-, 2,4-, 2,6- and 2,4,6-bromophenols were found, especially at 600 °C. Emissions of PCDD/Fs and dioxin-like PCBs were quite low and much lower than that of PBDD/Fs, due to the higher bromine content of the samples. Combustion at 600 °C was the run with the highest PBDD/F formation: the total content of eleven 2,3,7,8-substituted congeners (tetra- through heptaBDD/Fs) was 7240 and 3250 ng WHO{sub 2005}-TEQ/kg sample, corresponding to the sample with and without metals, respectively. - Highlights: • Thermal decomposition of printed circuit boards (with and without metals) is studied. • Important differences were found at the different experimental conditions. • Emission of brominated pollutants is much higher than that of chlorinated. • Metal enhances emission of halogenated compounds. • An increase in the temperature produces the destruction of pollutants.

  4. Catalytic Pyrolysis and a Pyrolysis Kinetic Study of Shredded Printed Circuit Board for Fuel Recovery

    Directory of Open Access Journals (Sweden)

    Salmiaton Ali

    2014-10-01

    Full Text Available Scrap printed circuit boards (PCBs are the most abundant wastes that can be found in the landfills in Malaysia and this disposal certainly poses serious detrimental to the environment. This research aims to investigate optimum temperature for pyrolyzing waste PCBs, find out the best catalyst to be used in accelerating PCBs’ pyrolysis, select suitable ratio of catalyst to PCBs for higher oil yield and examine kinetics pyrolysis of the waste PCBs’ decomposition. Operating temperatures ranged from 200 to 350 ˚C of PCB’s pyrolysis were conducted with the optimum temperature obtained was 275 ˚C. Fluid cata-lytic cracking (FCC catalyst, zeolite socony mobil-5 (ZSM-5, H-Y-type zeolite and dolomite were used to accelerate PCB’s pyrolysis at 275 ˚C and FCC was identified as the best catalyst to be used. Differ-ent ratios of FCC to waste PCBs such as 10:90, 20:80, 30:70, 40:60 and 50:50 were applied in the pyro-lysis at 275 ˚C and ratio of 10:90 was selected as the suitable ratio to be utilized for maximum yield. The kinetic study was done through thermogravimetric analysis on waste PCBs under various heating rates and different particle sizes. The GC-MS analysis revealed that compounds detected in the pyro-oil have the potential to be used as fuel. © 2014 BCREC UNDIP. All rights reservedReceived: 23rd July 2014; Revised: 14th August 2014; Accepted: 14th August 2014 How to Cite: Ng, C.H., Salmiaton, A., Hizam, H. (2014. Catalytic Pyrolysis and a Pyrolysis Kinetic Study of Shredded Printed Circuit Board for Fuel Recovery. Bulletin of Chemical Reaction Engineering & Catalysis, 9 (3: 224-240. (doi:10.9767/bcrec.9.3.7148.224-240 Permalink/DOI: http://dx.doi.org/10.9767/bcrec.9.3.7148.224-240

  5. Pollutant emissions during pyrolysis and combustion of waste printed circuit boards, before and after metal removal

    International Nuclear Information System (INIS)

    The constant increase in the production of electronic devices implies the need for an appropriate management of a growing number of waste electrical and electronic equipment. Thermal treatments represent an interesting alternative to recycle this kind of waste, but particular attention has to be paid to the potential emissions of toxic by-products. In this study, the emissions from thermal degradation of printed circuit boards (with and without metals) have been studied using a laboratory scale reactor, under oxidizing and inert atmosphere at 600 and 850 °C. Apart from carbon oxides, HBr was the main decomposition product, followed by high amounts of methane, ethylene, propylene, phenol and benzene. The maximum formation of PAHs was found in pyrolysis at 850 °C, naphthalene being the most abundant. High levels of 2-, 4-, 2,4-, 2,6- and 2,4,6-bromophenols were found, especially at 600 °C. Emissions of PCDD/Fs and dioxin-like PCBs were quite low and much lower than that of PBDD/Fs, due to the higher bromine content of the samples. Combustion at 600 °C was the run with the highest PBDD/F formation: the total content of eleven 2,3,7,8-substituted congeners (tetra- through heptaBDD/Fs) was 7240 and 3250 ng WHO2005-TEQ/kg sample, corresponding to the sample with and without metals, respectively. - Highlights: • Thermal decomposition of printed circuit boards (with and without metals) is studied. • Important differences were found at the different experimental conditions. • Emission of brominated pollutants is much higher than that of chlorinated. • Metal enhances emission of halogenated compounds. • An increase in the temperature produces the destruction of pollutants

  6. Exhaust constituent emission factors of printed circuit board pyrolysis processes and its exhaust control

    Energy Technology Data Exchange (ETDEWEB)

    Chiang, Hung-Lung, E-mail: hlchiang@mail.cmu.edu.tw [Department of Health Risk Management, China Medical University, Taichung, Taiwan (China); Lin, Kuo-Hsiung [Department of Environmental Engineering and Science, Fooyin University, Kaohsiung, Taiwan (China)

    2014-01-15

    Highlights: • Recycling of waste printed circuit boards is an important issue. • Pyrolysis is an emerging technology for PCB treatment. • Emission factors of VOCs are determined for PCB pyrolysis exhaust. • Iron-Al{sub 2}O{sub 3} catalyst was employed for the exhaust control. -- Abstract: The printed circuit board (PCB) is an important part of electrical and electronic equipment, and its disposal and the recovery of useful materials from waste PCBs (WPCBs) are key issues for waste electrical and electronic equipment. Waste PCB compositions and their pyrolysis characteristics were analyzed in this study. In addition, the volatile organic compound (VOC) exhaust was controlled by an iron-impregnated alumina oxide catalyst. Results indicated that carbon and oxygen were the dominant components (hundreds mg/g) of the raw materials, and other elements such as nitrogen, bromine, and copper were several decades mg/g. Exhaust constituents of CO, H{sub 2}, CH{sub 4}, CO{sub 2}, and NOx, were 60–115, 0.4–4.0, 1.1–10, 30–95, and 0–0.7 mg/g, corresponding to temperatures ranging from 200 to 500 °C. When the pyrolysis temperature was lower than 300 °C, aromatics and paraffins were the major species, contributing 90% of ozone precursor VOCs, and an increase in the pyrolysis temperature corresponded to a decrease in the fraction of aromatic emission factors. Methanol, ethylacetate, acetone, dichloromethane, tetrachloromethane and acrylonitrile were the main species of oxygenated and chlorinated VOCs. The emission factors of some brominated compounds, i.e., bromoform, bromophenol, and dibromophenol, were higher at temperatures over 400 °C. When VOC exhaust was flowed through the bed of Fe-impregnated Al{sub 2}O{sub 3}, the emission of ozone precursor VOCs could be reduced by 70–80%.

  7. Exhaust constituent emission factors of printed circuit board pyrolysis processes and its exhaust control

    International Nuclear Information System (INIS)

    Highlights: • Recycling of waste printed circuit boards is an important issue. • Pyrolysis is an emerging technology for PCB treatment. • Emission factors of VOCs are determined for PCB pyrolysis exhaust. • Iron-Al2O3 catalyst was employed for the exhaust control. -- Abstract: The printed circuit board (PCB) is an important part of electrical and electronic equipment, and its disposal and the recovery of useful materials from waste PCBs (WPCBs) are key issues for waste electrical and electronic equipment. Waste PCB compositions and their pyrolysis characteristics were analyzed in this study. In addition, the volatile organic compound (VOC) exhaust was controlled by an iron-impregnated alumina oxide catalyst. Results indicated that carbon and oxygen were the dominant components (hundreds mg/g) of the raw materials, and other elements such as nitrogen, bromine, and copper were several decades mg/g. Exhaust constituents of CO, H2, CH4, CO2, and NOx, were 60–115, 0.4–4.0, 1.1–10, 30–95, and 0–0.7 mg/g, corresponding to temperatures ranging from 200 to 500 °C. When the pyrolysis temperature was lower than 300 °C, aromatics and paraffins were the major species, contributing 90% of ozone precursor VOCs, and an increase in the pyrolysis temperature corresponded to a decrease in the fraction of aromatic emission factors. Methanol, ethylacetate, acetone, dichloromethane, tetrachloromethane and acrylonitrile were the main species of oxygenated and chlorinated VOCs. The emission factors of some brominated compounds, i.e., bromoform, bromophenol, and dibromophenol, were higher at temperatures over 400 °C. When VOC exhaust was flowed through the bed of Fe-impregnated Al2O3, the emission of ozone precursor VOCs could be reduced by 70–80%

  8. Evaluation of gold and silver leaching from printed circuit board of cellphones

    International Nuclear Information System (INIS)

    Highlights: • Printed circuit boards (PCB) of mobile phones have large amounts of metals with high economic value such as gold and silver. • Dissolution of gold was done with a cyanide-based reagent and silver with nitric acid. • Leaching of PCB with Na2S2O3 and (NH4)2S2O3 to examine the feasibility of using these reagents was done. - Abstract: Electronic waste has been increasing proportionally with the technology. So, nowadays, it is necessary to consider the useful life, recycling, and final disposal of these equipment. Metals, such as Au, Ag, Cu, Sn and Ni can be found in the printed circuit boards (PCB). According to this, the aims of this work is to characterize the PCBs of mobile phones with aqua regia; obtaining “reference” values of leaching, to gold and silver, with cyanide and nitric acid, respectively; and study the process of leaching of these metals in alternative leaching with sodium thiosulfate and ammonium thiosulfate. The metals were characterized by digesting the sample with aqua regia for 1 and 2 h at 60 °C and 80 °C. The leaching of Au with a commercial reagent (cyanide) and the Ag with HNO3were made. The leaching of Au and Ag with alternative reagents: Na2S2O3, and (NH4)2S2O3 in 0.1 M concentration with the addition of CuSO4, NH4OH, and H2O2, was also studied. The results show that the digestion with aqua regia was efficient to characterize the metals present in the PCBs of mobile phones. However, the best method to solubilize silver was by digesting the sample with nitric acid. The leaching process using sodium thiosulfate was more efficient when an additional concentration of 0.015 and 0.030 M of the CuSO4 was added

  9. Preparation and characterization of superconductor thin films for application in printed circuit boards

    International Nuclear Information System (INIS)

    Full text: Since the discovery of high temperature superconductors (HTS) many studies have been performed, in terms to discover new materials with higher critical temperature and its potential applications. Technological advances have induced to use superconductor materials in the development of new devices that have higher processing speed, storage capacity and are miniaturized, what may imply in great evolution in the electronic area. Thinking about that advances and looking to supply some requirements, this work proposed to prepare a printed circuit board (PCB) with a superconductor thin film using an inexpensive and conventional photographic method. This work was divided in two steps: synthesis of the precursor solution and film preparation for superconductor printed circuit. In the preparation of superconductor thin film was considered to use the 2223 phase of the BSCCO system, which has been doped with Pb (BPSCCO) for stabilizing the same, and it presents a critical temperature around 110 K. This film was prepared from a precursor solution based on similar method developed by M. P. Pechini. The printed circuit was created by the photographic method of heat transfer which consisted of creation a circuit layout, with different dimensions and printed on photo paper (Epson S041140). The layout was transferred to the FR4 printed copper clad laminate was made with the household clothes iron. The precursor solution was deposited on Si substrate by spin-coating. The control of film thickness was performed by the deposition number that in this case was done five subsequent depositions to obtain an ideal thickness. Between each deposition the film was submitted to calcinations in order to eliminate organic matter. After that the film was submitted a heat treatment around 820 deg C / 5 minutes to obtain the expected superconducting phase and coupling and the grain growth. Film characterizations were made using optical microscopy, XRD and EDX, to check the dimensions and

  10. Thermal research of infrared sight signal processing circuit board under temperature shock environment

    Science.gov (United States)

    Gao, Youtang; Ding, Huang; Qiao, Jianliang; Xu, Yuan; Niu, Jun

    2015-10-01

    Thermal stability technology of signal processing circuit infrared sight is studied under temperature shock. Model parameters and geometry is configured for FPGA devices (EP1C20F400C8), solder material and PCB. Signal circuit boards of full array BGA distribution are simulated and analyzed by thermal shock and waveform through engineering finite element analysis software. Because solders of the whole model have strong stress along Y direction, initial stress constraints along Y direction are primarily considered when the partial model of single solder is imposed by thermal load. When absolute thermal loads stresses of diagonal nodes with maximum strains are separated from the whole model, interpolation is processed according to thermal loads circulation. Plastic strains and thermal stresses of nodes in both sides of partial model are obtained. The analysis results indicate that with thermal load circulation, maximum forces of each circulation along Y direction are increasingly enlarged and with the accumulation of plastic strains of danger point, the composition will become invalid in the end.

  11. Separation and recovery of fine particles from waste circuit boards using an inflatable tapered diameter separation bed.

    Science.gov (United States)

    Duan, Chenlong; Sheng, Cheng; Wu, Lingling; Zhao, Yuemin; He, Jinfeng; Zhou, Enhui

    2014-01-01

    Recovering particle materials from discarded printed circuit boards can enhance resource recycling and reduce environmental pollution. Efficiently physically separating and recovering fine metal particles (-0.5 mm) from the circuit boards are a key recycling challenge. To do this, a new type of separator, an inflatable tapered diameter separation bed, was developed to study particle motion and separation mechanisms in the bed's fluid flow field. For 0.5-0.25 mm circuit board particles, metal recovery rates ranged from 87.56 to 94.17%, and separation efficiencies ranged from 87.71 to 94.20%. For 0.25-0.125 mm particles, metal recovery rates ranged from 84.76 to 91.97%, and separation efficiencies ranged from 84.74 to 91.86%. For superfine products (-0.125 mm), metal recovery rates ranged from 73.11 to 83.04%, and separation efficiencies ranged from 73.00 to 83.14%. This research showed that the inflatable tapered diameter separation bed achieved efficient particle separation and can be used to recover fine particles under a wide range of operational conditions. The bed offers a new mechanical technology to recycle valuable materials from discarded printed circuit boards, reducing environmental pollution. PMID:25379546

  12. Separation and Recovery of Fine Particles from Waste Circuit Boards Using an Inflatable Tapered Diameter Separation Bed

    Directory of Open Access Journals (Sweden)

    Chenlong Duan

    2014-01-01

    Full Text Available Recovering particle materials from discarded printed circuit boards can enhance resource recycling and reduce environmental pollution. Efficiently physically separating and recovering fine metal particles (−0.5 mm from the circuit boards are a key recycling challenge. To do this, a new type of separator, an inflatable tapered diameter separation bed, was developed to study particle motion and separation mechanisms in the bed’s fluid flow field. For 0.5–0.25 mm circuit board particles, metal recovery rates ranged from 87.56 to 94.17%, and separation efficiencies ranged from 87.71 to 94.20%. For 0.25–0.125 mm particles, metal recovery rates ranged from 84.76 to 91.97%, and separation efficiencies ranged from 84.74 to 91.86%. For superfine products (−0.125 mm, metal recovery rates ranged from 73.11 to 83.04%, and separation efficiencies ranged from 73.00 to 83.14%. This research showed that the inflatable tapered diameter separation bed achieved efficient particle separation and can be used to recover fine particles under a wide range of operational conditions. The bed offers a new mechanical technology to recycle valuable materials from discarded printed circuit boards, reducing environmental pollution.

  13. Maze solving automatons for self-healing of open interconnects: Modular add-on for circuit boards

    Energy Technology Data Exchange (ETDEWEB)

    Nair, Aswathi; Raghunandan, Karthik; Yaswant, Vaddi; Sambandan, Sanjiv, E-mail: sanjiv@iap.iisc.ernet.in, E-mail: ssanjiv@isu.iisc.ernet.in [Department of Instrumentation and Applied Physics, Indian Institute of Science, Malleswaram, Bangalore 560012 (India); Pillai, Sreelal S. [Vikram Sarabhai Space Center, Indian Space Research Organization, Trivandrum 695022 (India)

    2015-03-23

    We present the circuit board integration of a self-healing mechanism to repair open faults. The electric field driven mechanism physically restores fractured interconnects in electronic circuits and has the ability to solve mazes. The repair is performed by conductive particles dispersed in an insulating fluid. We demonstrate the integration of the healing module onto printed circuit boards and the ability of maze solving. We model and perform experiments on the influence of the geometry of conductive particles as well as the terminal impedances of the route on the healing efficiency. The typical heal rate is 10 μm/s with healed route having mean resistance of 8 kΩ across a 200 micron gap and depending on the materials and concentrations used.

  14. Maze solving automatons for self-healing of open interconnects: Modular add-on for circuit boards

    International Nuclear Information System (INIS)

    We present the circuit board integration of a self-healing mechanism to repair open faults. The electric field driven mechanism physically restores fractured interconnects in electronic circuits and has the ability to solve mazes. The repair is performed by conductive particles dispersed in an insulating fluid. We demonstrate the integration of the healing module onto printed circuit boards and the ability of maze solving. We model and perform experiments on the influence of the geometry of conductive particles as well as the terminal impedances of the route on the healing efficiency. The typical heal rate is 10 μm/s with healed route having mean resistance of 8 kΩ across a 200 micron gap and depending on the materials and concentrations used

  15. Newnes electronics assembly handbook

    CERN Document Server

    Brindley, Keith

    2013-01-01

    Newnes Electronics Assembly Handbook: Techniques, Standards and Quality Assurance focuses on the aspects of electronic assembling. The handbook first looks at the printed circuit board (PCB). Base materials, basic mechanical properties, cleaning of assemblies, design, and PCB manufacturing processes are then explained. The text also discusses surface mounted assemblies and packaging of electromechanical assemblies, as well as the soldering process. Requirements for the soldering process; solderability and protective coatings; cleaning of PCBs; and mass solder/component reflow soldering are des

  16. Integration of an X-Y prober with CAD driven database and test generation software for the testing of printed circuit boards

    OpenAIRE

    Goad, Kenneth G.

    1987-01-01

    Guided probe testing of printed circuit boards is a technique that has been well developed by automatic test equipment manufacturers to pinpoint faults. Though the guided probe technique of testing printed circuit boards is a process capable of providing high diagnostic resolution, the technique is inefficient when it is performed manually. The throughput of board testing is bottlenecked because of the time required for an operator to manually move a probe to a specific location ...

  17. Connecting the ear to the brain: molecular mechanisms of auditory circuit assembly

    OpenAIRE

    Appler, Jessica M; Goodrich, Lisa V.

    2011-01-01

    Our sense of hearing depends on precisely organized circuits that allow us to sense, perceive, and respond to complex sounds in our environment, from music and language to simple warning signals. Auditory processing begins in the cochlea of the inner ear, where sounds are detected by sensory hair cells and then transmitted to the central nervous system by spiral ganglion neurons, which faithfully preserve the frequency, intensity, and timing of each stimulus. During the assembly of auditory c...

  18. High-efficiency thin and compact concentrator photovoltaics using micro-solar cells with via-holes sandwiched between thin lens-array and circuit board

    Science.gov (United States)

    Itou, Akihiro; Asano, Tetsuya; Inoue, Daijiro; Arase, Hidekazu; Matsushita, Akio; Hayashi, Nobuhiko; Futakuchi, Ryutaro; Inoue, Kazuo; Yamamoto, Masaki; Fujii, Eiji; Nakagawa, Tohru; Anda, Yoshiharu; Ishida, Hidetoshi; Ueda, Tetsuzo; Fidaner, Onur; Wiemer, Michael; Ueda, Daisuke

    2014-01-01

    We have developed a compact concentrator photovoltaic (CPV) module that comprises micro-solar cells with an area of ≈0.6 × 0.6 mm2 sandwiched between a 20-mm-thick lens array and a 1-mm-thick circuit board with no air gap. To establish electrical connections between the circuit board and the micro-solar cells, we developed a micro-solar cell with positive and negative electrodes on the lower face of the cell. In this study, we demonstrated the photovoltaic performance of the micro-solar cell closely approaches that of the standard solar cell measuring ≈5 × 5 mm2 commonly used in conventional CPVs under concentrated illumination. Our study showed that the negative effect on PV performance of perimeter carrier recombination in the micro-solar cell was insignificant under concentrated illumination. Finally, we assembled our micro-solar cells into a CPV module and achieved the module energy conversion efficiency of 34.7% under outdoor solar illumination.

  19. Generation of copper rich metallic phases from waste printed circuit boards

    International Nuclear Information System (INIS)

    Highlights: • Recycling and material recovery from waste printed circuit boards is very complex. • Thermoset polymers, ceramics and metals are present simultaneously in waste PCBs. • Heat treatment of PCBs was carried out at 1150 °C under inert conditions. • Various metallic phases could be segregated out as copper based metallic droplets. • Carbon and ceramics residues can be further recycled in a range of applications. - Abstract: The rapid consumption and obsolescence of electronics have resulted in e-waste being one of the fastest growing waste streams worldwide. Printed circuit boards (PCBs) are among the most complex e-waste, containing significant quantities of hazardous and toxic materials leading to high levels of pollution if landfilled or processed inappropriately. However, PCBs are also an important resource of metals including copper, tin, lead and precious metals; their recycling is appealing especially as the concentration of these metals in PCBs is considerably higher than in their ores. This article is focused on a novel approach to recover copper rich phases from waste PCBs. Crushed PCBs were heat treated at 1150 °C under argon gas flowing at 1 L/min into a horizontal tube furnace. Samples were placed into an alumina crucible and positioned in the cold zone of the furnace for 5 min to avoid thermal shock, and then pushed into the hot zone, with specimens exposed to high temperatures for 10 and 20 min. After treatment, residues were pulled back to the cold zone and kept there for 5 min to avoid thermal cracking and re-oxidation. This process resulted in the generation of a metallic phase in the form of droplets and a carbonaceous residue. The metallic phase was formed of copper-rich red droplets and tin-rich white droplets along with the presence of several precious metals. The carbonaceous residue was found to consist of slag and ∼30% carbon. The process conditions led to the segregation of hazardous lead and tin clusters in the

  20. Generation of copper rich metallic phases from waste printed circuit boards

    Energy Technology Data Exchange (ETDEWEB)

    Cayumil, R. [Centre for Sustainable Materials Research and Technology (SMaRT), School of Materials Science and Engineering, The University of New South Wales, Sydney, NSW 2052 (Australia); Khanna, R., E-mail: ritakhanna@unsw.edu.au [Centre for Sustainable Materials Research and Technology (SMaRT), School of Materials Science and Engineering, The University of New South Wales, Sydney, NSW 2052 (Australia); Ikram-Ul-Haq, M.; Rajarao, R. [Centre for Sustainable Materials Research and Technology (SMaRT), School of Materials Science and Engineering, The University of New South Wales, Sydney, NSW 2052 (Australia); Hill, A. [CSIRO Process Science and Engineering, Clayton, Melbourne, VIC 3168 (Australia); Sahajwalla, V. [Centre for Sustainable Materials Research and Technology (SMaRT), School of Materials Science and Engineering, The University of New South Wales, Sydney, NSW 2052 (Australia)

    2014-10-15

    Highlights: • Recycling and material recovery from waste printed circuit boards is very complex. • Thermoset polymers, ceramics and metals are present simultaneously in waste PCBs. • Heat treatment of PCBs was carried out at 1150 °C under inert conditions. • Various metallic phases could be segregated out as copper based metallic droplets. • Carbon and ceramics residues can be further recycled in a range of applications. - Abstract: The rapid consumption and obsolescence of electronics have resulted in e-waste being one of the fastest growing waste streams worldwide. Printed circuit boards (PCBs) are among the most complex e-waste, containing significant quantities of hazardous and toxic materials leading to high levels of pollution if landfilled or processed inappropriately. However, PCBs are also an important resource of metals including copper, tin, lead and precious metals; their recycling is appealing especially as the concentration of these metals in PCBs is considerably higher than in their ores. This article is focused on a novel approach to recover copper rich phases from waste PCBs. Crushed PCBs were heat treated at 1150 °C under argon gas flowing at 1 L/min into a horizontal tube furnace. Samples were placed into an alumina crucible and positioned in the cold zone of the furnace for 5 min to avoid thermal shock, and then pushed into the hot zone, with specimens exposed to high temperatures for 10 and 20 min. After treatment, residues were pulled back to the cold zone and kept there for 5 min to avoid thermal cracking and re-oxidation. This process resulted in the generation of a metallic phase in the form of droplets and a carbonaceous residue. The metallic phase was formed of copper-rich red droplets and tin-rich white droplets along with the presence of several precious metals. The carbonaceous residue was found to consist of slag and ∼30% carbon. The process conditions led to the segregation of hazardous lead and tin clusters in the

  1. Evaluation of gold and silver leaching from printed circuit board of cellphones

    Energy Technology Data Exchange (ETDEWEB)

    Petter, P.M.H., E-mail: patymhp@yahoo.com.br; Veit, H.M.; Bernardes, A.M.

    2014-02-15

    Highlights: • Printed circuit boards (PCB) of mobile phones have large amounts of metals with high economic value such as gold and silver. • Dissolution of gold was done with a cyanide-based reagent and silver with nitric acid. • Leaching of PCB with Na{sub 2}S{sub 2}O{sub 3} and (NH{sub 4}){sub 2}S{sub 2}O{sub 3} to examine the feasibility of using these reagents was done. - Abstract: Electronic waste has been increasing proportionally with the technology. So, nowadays, it is necessary to consider the useful life, recycling, and final disposal of these equipment. Metals, such as Au, Ag, Cu, Sn and Ni can be found in the printed circuit boards (PCB). According to this, the aims of this work is to characterize the PCBs of mobile phones with aqua regia; obtaining “reference” values of leaching, to gold and silver, with cyanide and nitric acid, respectively; and study the process of leaching of these metals in alternative leaching with sodium thiosulfate and ammonium thiosulfate. The metals were characterized by digesting the sample with aqua regia for 1 and 2 h at 60 °C and 80 °C. The leaching of Au with a commercial reagent (cyanide) and the Ag with HNO{sub 3}were made. The leaching of Au and Ag with alternative reagents: Na{sub 2}S{sub 2}O{sub 3,} and (NH{sub 4}){sub 2}S{sub 2}O{sub 3} in 0.1 M concentration with the addition of CuSO{sub 4}, NH{sub 4}OH, and H{sub 2}O{sub 2}, was also studied. The results show that the digestion with aqua regia was efficient to characterize the metals present in the PCBs of mobile phones. However, the best method to solubilize silver was by digesting the sample with nitric acid. The leaching process using sodium thiosulfate was more efficient when an additional concentration of 0.015 and 0.030 M of the CuSO{sub 4} was added.

  2. Integration of microelectronic chips in microfluidic systems on printed circuit board

    International Nuclear Information System (INIS)

    A new scheme for the integration of small semiconductor transducer chips with microfluidic structures on printed circuit board (PCB) is presented. The proposed approach is based on a packaging technique that yields a large and flat area with small and shallow (∼44 µm deep) openings over the chips. The photocurable encapsulant material used, based on a diacrylate bisphenol A polymer, enables irreversible bonding of polydimethylsiloxane microfluidic structures at moderate temperatures (80 °C). This integration scheme enables the insertion of transducer chips in microfluidic systems with a lower added volume than previous schemes. Leakage tests have shown that the bonded structures withstand more than 360 kPa of pressure. A prototype microfluidic system with two detection chips, including one inter-digitated electrode (IDE) chip for conductivity and one ion selective field effect transistor (ISFET) chip for pH, has been implemented and characterized. Good electrical insulation of the chip contacts and silicon edge surfaces from the solution in the microchannels has been achieved. This integration procedure opens the door to the low-cost fabrication of complex analytical microsystems that combine the extraordinary potential of both the microfluidics and silicon microtechnology fields. (paper)

  3. Electrostatic separation for recovering metals and nonmetals from waste printed circuit board: problems and improvements.

    Science.gov (United States)

    Wu, Jiang; Li, Jia; Xu, Zhenming

    2008-07-15

    Electrostatic separation is an effective and environmentally friendly method for recycling comminuted waste printed circuit boards (PCB). As a classical separator, the roll-type corona-electrostatic separator (RTS) has some advantages in this field. However, there are still some notable problems, such as the middling products and their further treatment, impurity of nonconductive products because of the aggregation of fine particles, and stability of the separation process and balance between the production capacity and the separation quality. To overcome these problems, a conception of two-step separation is presented, and a new two-roll type corona-electrostatic separator (T-RTS) was built As compared to RTS, the conductive products increase by 8.9%, the middling products decrease by 45%, and the production capacity increases by 50% in treating comminuted PCB wastes by T-RTS. In addition, the separation process in T-RTS is more stable. Therefore, T-RTS is a promising separator for recycling comminuted PCB. PMID:18754380

  4. Column bioleaching copper and its kinetics of waste printed circuit boards (WPCBs) by Acidithiobacillus ferrooxidans.

    Science.gov (United States)

    Chen, Shu; Yang, Yuankun; Liu, Congqiang; Dong, Faqin; Liu, Bijun

    2015-12-01

    Application of bioleaching process for metal recovery from electronic waste has received an increasing attention in recent years. In this work, a column bioleaching of copper from waste printed circuit boards (WPCBs) by Acidithiobacillus ferrooxidans has been investigated. After column bioleaching for 28d, the copper recovery reached at 94.8% from the starting materials contained 24.8% copper. Additionally, the concentration of Fe(3+) concentration varied significantly during bioleaching, which inevitably will influence the Cu oxidation, thus bioleaching process. Thus the variation in Fe(3+) concentration should be taken into consideration in the conventional kinetic models of bioleaching process. Experimental results show that the rate of copper dissolution is controlled by external diffusion rather than internal one because of the iron hydrolysis and formation of jarosite precipitates at the surface of the material. The kinetics of column bioleaching WPCBs remains unchanged because the size and morphology of precipitates are unaffected by maintaining the pH of solution at 2.25 level. In bioleaching process, the formation of jarosite precipitate can be prevented by adding dilute sulfuric acid and maintaining an acidic condition of the leaching medium. In such way, the Fe(2)(+)-Fe(3+) cycle process can kept going and create a favorable condition for Cu bioleaching. Our experimental results show that column Cu bioleaching from WPCBs by A. ferrooxidans is promising. PMID:26196406

  5. Kinetic Study of the Pyrolysis of Waste Printed Circuit Boards Subject to Conventional and Microwave Heating

    Directory of Open Access Journals (Sweden)

    Chunyuan Ma

    2012-08-01

    Full Text Available This paper describes a kinetic study of the decomposition of waste printed circuit boards (WPCB under conventional and microwave-induced pyrolysis conditions. We discuss the heating rates and the influence of the pyrolysis on the thermal decomposition kinetics of WPCB. We find that the thermal degradation of WPCB in a controlled conventional thermogravimetric analyzer (TGA occurred in the temperature range of 300 °C–600 °C, where the main pyrolysis of organic matter takes place along with an expulsion of volumetric volatiles. The corresponding activation energy is decreased from 267 kJ/mol to 168 kJ/mol with increased heating rates from 20 °C/min to 50 °C/min. Similarly, the process of microwave-induced pyrolysis of WPCB material manifests in only one stage, judging by experiments with a microwave power of 700 W. Here, the activation energy is determined to be only 49 kJ/mol, much lower than that found in a conventional TGA subject to a similar heating rate. The low activation energy found in microwave-induced pyrolysis suggests that the adoption of microwave technology for the disposal of WPCB material and even for waste electronic and electrical equipment (WEEE could be an attractive option.

  6. Printed circuit board recycling: Physical processing and copper extraction by selective leaching.

    Science.gov (United States)

    Silvas, Flávia P C; Correa, Mónica M Jiménez; Caldas, Marcos P K; de Moraes, Viviane T; Espinosa, Denise C R; Tenório, Jorge A S

    2015-12-01

    Global generation of waste electrical and electronic equipment (WEEE) is about 40 million tons per year. Constant increase in WEEE generation added to international legislations has improved the development of processes for materials recovery and sustainability of electrical and electronic industry. This paper describes a new hydrometallurgical route (leaching process) to recycle printed circuit boards (PCBs) from printers to recover copper. Methodology included PCBs characterization and a combined route of physical and hydrometallurgical processing. Magnetic separation, acid digestion and chemical analysis by ICP-OES were performed. On leaching process were used two stages: the first one in a sulfuric media and the second in an oxidant media. The results showed that the PCBs composition was 74.6 wt.% of non-magnetic material and 25.4 wt.% of magnetic one. The metallic fraction corresponded to 44.0 wt.%, the polymeric to 28.5 wt.% and the ceramic to 27.5 wt.%. The main metal was copper and its initial content was 32.5 wt.%. On sulfuric leaching 90 wt.% of Al, 40 wt.% of Zn and 8.6 wt.% of Sn were extracted, whereas on oxidant leaching tests the extraction percentage of Cu was 100 wt.%, of Zn 60 wt.% and of Al 10 wt.%. At the end of the hydrometallurgical processing was obtained 100% of copper extraction and the recovery factor was 98.46%, which corresponds to a 32 kg of Cu in 100 kg of PCB. PMID:26323203

  7. Application of glass-nonmetals of waste printed circuit boards to produce phenolic moulding compound

    International Nuclear Information System (INIS)

    The aim of this study was to investigate the feasibility of using glass-nonmetals, a byproduct of recycling waste printed circuit boards (PCBs), to replace wood flour in production of phenolic moulding compound (PMC). Glass-nonmetals were attained by two-step crushing and corona electrostatic separating processes. Glass-nonmetals with particle size shorter than 0.07 mm were in the form of single fibers and resin powder, with the biggest portion (up to 34.6 wt%). Properties of PMC with glass-nonmetals (PMCGN) were compared with reference PMC and the national standard of PMC (PF2C3). When the adding content of glass-nonmetals was 40 wt%, PMCGN exhibited flexural strength of 82 MPa, notched impact strength of 2.4 kJ/m2, heat deflection temperature of 175 deg. C, and dielectric strength of 4.8 MV/m, all of which met the national standard. Scanning electron microscopy (SEM) showed strong interfacial bonding between glass fibers and the phenolic resin. All the results showed that the use of glass-nonmetals as filler in PMC represented a promising method for resolving the environmental pollutions and reducing the cost of PMC, thus attaining both environmental and economic benefits

  8. Effects of Temperature on the Wave Soldering of Printed Circuit Boards: CFD Modeling Approach

    Directory of Open Access Journals (Sweden)

    M.S. Abdul Aziz

    2016-01-01

    Full Text Available ABSTRACT This study investigated the effects of temperature on the wave soldering of printed circuit boards (PCBs using three-dimensional finite volume analysis. A computational solder pot model consisting of a six-blade rotational propeller was developed and meshed using tetrahedral elements. The leaded molten solder (Sn63Pb37 distribution and PCB wetting profile were determined using the volume of fluid technique in the fluid flow solver, FLUENT. In this study, the effects of five different molten solder temperatures (456 K, 473 K, 523 K, 583 K, and 643 K on the wave soldering of a 70 mm × 146 mm PCB were considered. The effects of temperature on wetting area, wetting profile, velocity vector, and full wetting time were likewise investigated. Molten solder temperature significantly affected the wetting time and distribution of PCBs. The molten solder temperature at 523 K demonstrated desirable wetting distribution and yielded a stable fountain profile and was therefore considered the best temperature in this study. The simulation results were substantiated by the experimental results.

  9. Dissolution of brominated epoxy resins by dimethyl sulfoxide to separate waste printed circuit boards.

    Science.gov (United States)

    Zhu, Ping; Chen, Yan; Wang, Liangyou; Qian, Guangren; Zhang, Wei Jie; Zhou, Ming; Zhou, Jin

    2013-03-19

    Improved methods are required for the recycling of waste printed circuit boards (WPCBs). In this study, WPCBs (1-1.5 cm(2)) were separated into their components using dimethyl sulfoxide (DMSO) at 60 °C for 45 min and a metallographic microscope was used to verify their delamination. An increased incubation time of 210 min yielded a complete separation of WPCBs into their components, and copper foils and glass fibers were obtained. The separation time decreased with increasing temperature. When the WPCB size was increased to 2-3 cm(2), the temperature required for complete separation increased to 90 °C. When the temperature was increased to 135 °C, liquid photo solder resists could be removed from the copper foil surfaces. The DMSO was regenerated by rotary decompression evaporation, and residues were obtained. Fourier transform infrared spectroscopy (FT-IR), thermal analysis, nuclear magnetic resonance, scanning electron microscopy, and energy-dispersive X-ray spectroscopy were used to verify that these residues were brominated epoxy resins. From FT-IR analysis after the dissolution of brominated epoxy resins in DMSO it was deduced that hydrogen bonding may play an important role in the dissolution mechanism. This novel technology offers a method for separating valuable materials and preventing environmental pollution from WPCBs. PMID:23398278

  10. Fast copper extraction from printed circuit boards using supercritical carbon dioxide.

    Science.gov (United States)

    Calgaro, C O; Schlemmer, D F; da Silva, M D C R; Maziero, E V; Tanabe, E H; Bertuol, D A

    2015-11-01

    Technological development and intensive marketing support the growth in demand for electrical and electronic equipment (EEE), for which printed circuit boards (PCBs) are vital components. As these devices become obsolete after short periods, waste PCBs present a problem and require recycling. PCBs are composed of ceramics, polymers, and metals, particularly Cu, which is present in highest percentages. The aim of this study was to develop an innovative method to recover Cu from the PCBs of old mobile phones, obtaining faster reaction kinetics by means of leaching with supercritical CO2 and co-solvents. The PCBs from waste mobile phones were characterized, and evaluation was made of the reaction kinetics during leaching at atmospheric pressure and using supercritical CO2 with H2O2 and H2SO4 as co-solvents. The results showed that the PCBs contained 34.83 wt% of Cu. It was found that the supercritical extraction was 9 times faster, compared to atmospheric pressure extraction. After 20 min of supercritical leaching, approximately 90% of the Cu contained in the PCB was extracted using a 1:20 solid:liquid ratio and 20% of H2O2 and H2SO4 (2.5 M). These results demonstrate the efficiency of the process. Therefore the supercritical CO2 employment in the PCBs recycling is a promising alternative and the CO2 is environmentally acceptable and reusable. PMID:26022338

  11. Thermal analysis of a part of circuit board card by the photothermal deflection technique

    Science.gov (United States)

    Dhouib, A.; Yacoubi, N.

    2014-09-01

    Photothermal deflection which is a non-destructive technique is widely used to study defects in materials. However, high spatial resolution and high sensitivity are required to detect them. To validate the theoretical model that we developed in the case, the sample is immersed in a paraffin oil-filled cell and heated with a laser beam of a diameter less than the dimensions of defects and of power 2 mW instead of several 100 mW power frequently used. Our model was tested on a part of a circuit board card having copper strips spaced periodically and embedded in the resin. The experimental curves of amplitude and phase variations according to displacement of the sample are in good agreement with the corresponding theoretical ones; and their coincidence permit us to deduce several parameters such as the width of the copper and resin strips, their thicknesses and their thermal properties. These comparisons allowed also to detect some anomalies in the structure such as inhomogeneity in the width, the shape and the thicknesses of copper and resins strips.

  12. Copper recovery and gold enrichment from waste printed circuit boards by mediated electrochemical oxidation

    International Nuclear Information System (INIS)

    Highlights: • We developed a mediated electrochemical process for electronic waste treatment. • We achieved the simultaneous recovery of copper and gold enrichment. • Process scale up was realized based on the optimal values of operating parameters. • The waste does not require mechanical pretreatment in the scaled process. • The process proved to be efficient and eco-friendly as well. - Abstract: The present study aims to develop an eco-friendly chemical–electrochemical process for the simultaneous recovery of copper and separation of a gold rich residue from waste printed circuit boards (WPCBs). The process was carried out by employing two different types of reactors coupled in series: a leaching reactor with a perforated rotating drum, for the dissolution of base metals and a divided electrochemical reactor for the regeneration of the leaching solution with the parallel electrowinning of copper. The process performances were evaluated on the basis of the dissolution efficiency, current efficiency and specific energy consumptions. Finally a process scale up was realized taking into consideration the optimal values of the operating parameters. The laboratory scale leaching plant allowed the recovery of a high purity copper deposit (99.04 wt.%) at a current efficiency of 63.84% and specific energy consumption of 1.75 kW h/kg cooper. The gold concentration in the remained solid residue was 25 times higher than the gold concentration in the initial WPCB samples

  13. Development of a fabrication technology for integrating low cost optical interconnects on a printed circuit board

    Science.gov (United States)

    Van Steenberge, Geert; Hendrickx, Nina; Geerinck, Peter; Bosman, Erwin; Van Put, Steven; Van Erps, Jurgen; Thienpont, Hugo; Van Daele, Peter

    2006-02-01

    We present a fabrication technology for integrating polymer waveguides and 45° micromirror couplers into standard electrical printed circuit boards (PCBs). The most critical point that is being addressed is the low-cost manufacturing and the compatibility with current PCB production. The latter refers to the processes as well as material compatibility. Multimode waveguides are patterned by KrF excimer laser ablation in acrylate polymers with 0.13 dB/cm propagation loss at 850 nm. Single mode waveguides using inorganic-organic hybrid polymers show an attenuation loss of 0.62 +/- 0.08 dB/cm at 1.3 μm. A process for embedding metal coated 45° micromirrors in optical waveguiding layers is developed. Mirrors are selectively metallized using a lift-off process. Filling up the angled via without the presence of air bubbles and providing a flat surface above the mirror is only possible by enhancing the cladding deposition process with ultrasound agitation. Initial single mode coupling loss measurements at 1.3 μm show an excess mirror loss of 1.55 dB. Multimode coupling loss measurements will improve this excess loss, because of the lower surface roughness of the mirrors using the acrylate polymers for multimode waveguides.

  14. Characterization of Printed Circuit Boards for Metal and Energy Recovery after Milling and Mechanical Separation

    Directory of Open Access Journals (Sweden)

    Waldir A. Bizzo

    2014-06-01

    Full Text Available The proper disposal of electrical and electronic waste is currently a concern of researchers and environmental managers not only because of the large volume of such waste generated, but also because of the heavy metals and toxic substances it contains. This study analyzed printed circuit boards (PCBs from discarded computers to determine their metal content and characterized them as solid waste and fuel. The analysis showed that PCBs consist of approximately 26% metal, made up mainly of copper, lead, aluminum, iron and tin, as well as other heavy metals such as cadmium and nickel. Comparison with the results of other studies indicated that the concentration of precious metals (gold and silver has declined over time. Analysis of the leachate revealed high concentrations of cadmium and lead, giving the residue the characteristics of hazardous waste. After milling the PCBs, we found that larger amounts of metal were concentrated in smaller fractions, while the lightest fraction, obtained by density separation, had a gross calorific value of approximately 11 MJ/kg, although with a high ash content. Milling followed by density separation proved potentially useful for recovery of metals and energy-rich fractions.

  15. Modelling, analysis, and acceleration of a printed circuit board fabrication process

    Indian Academy of Sciences (India)

    K S Aithal; Y Narahari; E Manjunath

    2001-10-01

    Product design and fabrication constitute an important business activity in any manufacturing firm. Designing an optimized product fabrication process is an important problem in itself and is of significant practical and research interest. In this paper, we look into a printed circuit board (PCB) fabrication process and investigate ways in which the fabrication cycle time can be minimized. Single class queueing networks constitute the modelling framework for our study. The model developed in this paper and the analysis experiments carried out are based on extensive data collected on a PCB fabrication company located in Bangalore, India. This is a representative PCB fabrication company involving multiple, concurrent fabrication works with contention for human/technical resources. Our model seeks to capture faithfully the flow of the fabrication process in this company and such other organisations, using queueing networks. Using the model developed, we explore how the cycle times can be reduced using input control, load balancing, and variability reduction. The model presented is sufficiently generic and conceptual; its scope extends beyond that of a PCB fabrication organization.

  16. Converting Non-Metallic Printed Circuit Boards Waste Into A Value Added Product

    Directory of Open Access Journals (Sweden)

    Shantha Kumari Muniyandi

    2013-05-01

    Full Text Available The aim of this study was to investigate the feasibility of using nonmetallic printed circuit board (PCB waste as filler in recycled HDPE (rHDPE in production of rHDPE/PCB composites. Maleic anhydride modified linear low-density polyethylene (MAPE was used as compatibilizer. In particular, the effects of nonmetallic PCB and MAPE on mechanical properties of the composites were assessed through tensile, flexural and impact testing. Scanning electron microscope (SEM was used to study the dispersion of nonmetallic PCB and MAPE in the matrix. Nonmetallic PCB was blended with rHDPE from 0--30 wt% and prepared by counter-rotating twin screw extruder followed by molding into test samples via hot press for analysis. A good balance between stiffness, strength and toughness was achieved for the system containing 30 wt% PCB. Thus, this system was chosen in order to investigate the effect of the compatibilizer on the mechanical properties of the composites. The results indicate that MAPE as a compatiblizer can effectively promote the interfacial adhesion between nonmetallic PCB and rHDPE. The addition of 6 phr MAPE increased the flexural strength, tensile strength and impact strength by 71%, 98% and 44% respectively compared to the uncompatibilized composites.

  17. Study on characteristics of printed circuit board liberation and its crushed products.

    Science.gov (United States)

    Quan, Cui; Li, Aimin; Gao, Ningbo

    2012-11-01

    Recycling printed circuit board waste (PCBW) waste is a hot issue of environmental protection and resource recycling. Mechanical and thermo-chemical methods are two traditional recycling processes for PCBW. In the present research, a two-step crushing process combined with a coarse-crushing step and a fine-pulverizing step was adopted, and then the crushed products were classified into seven different fractions with a standard sieve. The liberation situation and particle shape in different size fractions were observed. Properties of different size fractions, such as heating value, thermogravimetric, proximate, ultimate and chemical analysis were determined. The Rosin-Rammler model was applied to analyze the particle size distribution of crushed material. The results indicated that complete liberation of metals from the PCBW was achieved at a size less than 0.59 mm, but the nonmetal particle in the smaller-than-0.15 mm fraction is liable to aggregate. Copper was the most prominent metal in PCBW and mainly enriched in the 0.42-0.25 mm particle size. The Rosin-Rammler equation adequately fit particle size distribution data of crushed PCBW with a correlation coefficient of 0.9810. The results of heating value and proximate analysis revealed that the PCBW had a low heating value and high ash content. The combustion and pyrolysis process of PCBW was different and there was an obvious oxidation peak of Cu in combustion runs. PMID:22956523

  18. Copper recovery and gold enrichment from waste printed circuit boards by mediated electrochemical oxidation

    Energy Technology Data Exchange (ETDEWEB)

    Fogarasi, Szabolcs [“Babeş-Bolyai” University, Faculty of Chemistry and Chemical Engineering, Department of Chemical Engineering, 11 Arany Janos Street, Cluj-Napoca RO-400028 (Romania); Imre-Lucaci, Florica [“Babeş-Bolyai” University, Interdisciplinary Research Institute on Bio-Nano-Sciences, 42 Treboniu Laurian Street, Cluj-Napoca RO-400271 (Romania); Imre-Lucaci, Árpád, E-mail: aimre@chem.ubbcluj.ro [“Babeş-Bolyai” University, Faculty of Chemistry and Chemical Engineering, Department of Chemical Engineering, 11 Arany Janos Street, Cluj-Napoca RO-400028 (Romania); Ilea, Petru [“Babeş-Bolyai” University, Faculty of Chemistry and Chemical Engineering, Department of Chemical Engineering, 11 Arany Janos Street, Cluj-Napoca RO-400028 (Romania)

    2014-05-01

    Highlights: • We developed a mediated electrochemical process for electronic waste treatment. • We achieved the simultaneous recovery of copper and gold enrichment. • Process scale up was realized based on the optimal values of operating parameters. • The waste does not require mechanical pretreatment in the scaled process. • The process proved to be efficient and eco-friendly as well. - Abstract: The present study aims to develop an eco-friendly chemical–electrochemical process for the simultaneous recovery of copper and separation of a gold rich residue from waste printed circuit boards (WPCBs). The process was carried out by employing two different types of reactors coupled in series: a leaching reactor with a perforated rotating drum, for the dissolution of base metals and a divided electrochemical reactor for the regeneration of the leaching solution with the parallel electrowinning of copper. The process performances were evaluated on the basis of the dissolution efficiency, current efficiency and specific energy consumptions. Finally a process scale up was realized taking into consideration the optimal values of the operating parameters. The laboratory scale leaching plant allowed the recovery of a high purity copper deposit (99.04 wt.%) at a current efficiency of 63.84% and specific energy consumption of 1.75 kW h/kg cooper. The gold concentration in the remained solid residue was 25 times higher than the gold concentration in the initial WPCB samples.

  19. Study on Metals Recovery from -0.074 mm Printed Circuit Boards by Enhanced Gravity Separation

    Institute of Scientific and Technical Information of China (English)

    赵跃民; 温雪峰; 施红霞; 焦红光; 陶有俊

    2006-01-01

    Nowadays study on reutilization of discarded printed circuit boards (PCBs) has great significance for achieving secondary resources recycling and preventing environmental pollution. Physical methods show great potential and advantages on discarded PCBs reutilization, compared with chemical and biological methods. However for the particles of -0.074 mm PCBs, little work has been done in the past because of lower separation efficiency and recovery. In this work, the conundrum of-0.074 mm PCBs reutilization was resolved successfully with the help of Falcon concentrator. Separation mechanism for fine particles with different mass densities in a Falcon centrifugal concentrator was analyzed. The main factors such as magnitude of rotation frequency (centrifugal acceleration), anti-charge water pressure and feeding concentration were studied,and interaction of different factors was analyzed using Design-Expert software. The experimental results show that metals grade of-0.074 mm PCBs and integration efficiency were obtained as 76.89% and 80.77% respectively when feeding concentration was 40 g/L with water pressure of 0.01 MPa and rotation frequency of 50 Hz.

  20. Synthesis of carbon nanotubes and porous carbons from printed circuit board waste pyrolysis oil

    International Nuclear Information System (INIS)

    The possibility and feasibility of using pyrolysis oil from printed circuit board (PCB) waste as a precursor for advanced carbonaceous materials is presented. The PCB waste was first pyrolyzed in a laboratory scale fixed bed reactor at 600 deg. C to prepare pyrolysis oil. The analysis of pyrolysis oil by gas chromatography-mass spectroscopy indicated that it contained a very high proportion of phenol and phenol derivatives. It was then polymerized in formaldehyde solution to synthesize pyrolysis oil-based resin which was used as a precursor to prepare carbon nanotubes (CNTs) and porous carbons. Scanning electron microscopy and transmission microscopy investigation showed that the resulting CNTs had hollow cores with outer diameter of ∼338 nm and wall thickness of ∼86 nm and most of them were filled with metal nanoparticles or nanorods. X-ray diffraction reveals that CNTs have an amorphous structure. Nitrogen adsorption isotherm analysis indicated the prepared porous carbons had a Brunauer-Emmett-Teller surface area of 1214 m2/g. The mechanism of the formation of the CNTs and porous carbons was discussed.

  1. An environmentally friendly technology of disassembling electronic components from waste printed circuit boards.

    Science.gov (United States)

    Wang, Jianbo; Guo, Jie; Xu, Zhenming

    2016-07-01

    Electronic components (ECs) disassembling from waste printed circuit boards (WPCBs) is the first and essential step in WPCBs recycling chain. Over the past decades, primitive methods like simply heating WPCBs on a coal-heated plate to melt solders are dominated in practice, causing serious environmental pollution and also putting a real threat to the human health. In order to solve this problem, in this article, an automatic system in pilot-scale for ECs disassembling from WPCBs is designed, manufactured, and investigated. This system contains two parts: ECs automatic disassembly and off-gas purification. Meanwhile, WPCBs from television (i.e., TV-WPCBs) and personal computer (i.e., PC-WPCBs) are used for disassembling tests, respectively. When the disassembling temperature, rotating speed, and incubation time are 265±5°C, 10rpm, and 8min, respectively, the solder can be completely removed from both TV-WPCBs and PC-WPCBs. No pollutant is discharged from this system. Finally, the disassembling procedures for ECs from both TV-WPCBs and PC-WPCBs are suggested to promote WPCBs disassembling in an environment-friendly way, without threaten the environment and human health. PMID:27026495

  2. Estimation of Relative Permittivity of Printed Circuit Board with Fiber Glass Epoxy as Dielectric for UHF Applications

    OpenAIRE

    Ronal D. Montoya-Montoya; Natalia Gaviria-Gómez

    2013-01-01

    This paper presents the results of measuring relative permittivity of fiber glass printed circuit board (PCB’s), using a rectangular resonant cavity. The relative permittivity is presented as function of frequency. To obtain resonant frequencies, the return loss was measured using a network analyzer. Relative permittivity was calculated by finding frequencies of resonant cavity modes. The results are presented in a frequency span of 1 to 3.5GHz. It was clearly shown the nonlinear behavior of ...

  3. The effect of shredding and particle size in physical and chemical processing of printed circuit boards waste

    OpenAIRE

    Oliveira, Paula C.; Taborda, F. Charters; Nogueira, C. A.; Margarido, F.

    2011-01-01

    Circuit boards present in most electric and electronic devices are very important components, which should be removed during sorting and dismantling operations in order to allow further adequate treatment for recovering valuable metals such as copper, nickel, zinc, lead, tin and rare elements. This recovery can be made by physical and chemical processes being size reduction by shredding the first step. In this paper, the effect of particle size in physical and chemical processing of printed c...

  4. Development of printed-circuit-board based industry-compatible point-of-care biosensing and bioprocessing technology with applications

    OpenAIRE

    Tseng, Hsiu-Yang

    2015-01-01

    This thesis presents the development of a technology employing printed circuit board (PCB) technology to facilitate the performance and translation of point-of-care (POC) biosensing and bioprocessing devices toward practical products. Key features of the proposed technology are a universal, standardized platform and a set of techniques, featuring integrated functional units, three-dimensional (3D) configurations, convenient device-instrumentation interconnections, and industry-compatible prec...

  5. Kinetic Analysis and Pollutant Evolution During Thermal Degradation of Printed Circuit Boards Considering the Effect of Metals

    OpenAIRE

    Ortuño García, Nuria; Conesa Ferrer, Juan Antonio (ed.); Moltó Berenguer, Julia; Font Montesinos, Rafael

    2013-01-01

    A kinetic study has been carried out by thermogravimetry in order to compare the thermal behavior of printed circuit boards of mobile phones before and after the removal of the metallic fraction. Experiments were performed in nitrogen atmosphere (pyrolysis runs) as well as in an oxidative atmosphere (10% and 20% oxygen in nitrogen). Several dynamic and dynamic + isothermal runs have been carried out at different heating rates (5, 10 and 20 K min−1), from room temperature to more than 900 K. M...

  6. Evaluation of a recycling process for printed circuit board by physical separation and heat treatment

    International Nuclear Information System (INIS)

    Highlights: • The parts mounted on printed circuit board (PCB) were liberated by underwater explosion and mechanical crushing. • The crushed PCB without surface-mounted parts was carbonized under inert atmosphere at 873 K to recover copper. • The multi-layered ceramic capacitors including nickel was carbonized at 873 K to recover nickel by the magnetic separation. • The tantalum powders were recovered from the molded resins by heat treatment at 723 and 823 K in air atmosphere and screening. • Energy and treatment cost of new process increased, however, the environmental burden decreased comparing conventional one. - Abstract: Printed circuit boards (PCBs) from discarded personal computer (PC) and hard disk drive were crushed by explosion in water or mechanical comminution in order to disintegrate the attached parts. More parts were stripped from PCB of PC, composed of epoxy resin; than from PCB of household appliance, composed of phenol resin. In an attempt to raise the copper grade of PCB by removing other components, a carbonization treatment was investigated. The crushed PCB without surface-mounted parts was carbonized under a nitrogen atmosphere at 873–1073 K. After screening, the char was classified by size into oversized pieces, undersized pieces and powder. The copper foil and glass fiber pieces were liberated and collected in undersized fraction. The copper foil was liberated easily from glass fiber by stamping treatment. As one of the mounted parts, the multi-layered ceramic capacitors (MLCCs), which contain nickel, were carbonized at 873 K. The magnetic separation is carried out at a lower magnetic field strength of 0.1 T and then at 0.8 T. In the +0.5 mm size fraction the nickel grade in magnetic product was increased from 0.16% to 6.7% and the nickel recovery is 74%. The other useful mounted parts are tantalum capacitors. The tantalum capacitors were collected from mounted parts. The tantalum-sintered bodies were separated from molded resins

  7. Combustion and inorganic bromine emission of waste printed circuit boards in a high temperature furnace

    International Nuclear Information System (INIS)

    Highlights: ► The combustion efficiency of waste printed circuit boards (PCBs) depends on temperature, excess air factor, and high temperature zone residence time. Temperature has the most significant impact. Under the proposed condition, combustion of waste PCBs alone is quite complete within the furnace. ► High temperature prompts a more complete bromine release and conversion. When temperature is high enough, 99.9% organobrominated compounds, the potential precursors for brominated dixoins formation, are destroyed efficiently and convert to inorganic bromine in flue gas, as HBr and Br2. ► Temperature has crucial influence over the inhibition of HBr conversion to Br2, while the oxygen partial pressure plays a reverse role in the conversion to a very small extent. Increasing temperature will decrease the volume percentage ratio of Br2/HBr in flue gas greatly. ► The thermodynamic equilibrium approach of bromine conversion was investigated. The two forms of inorganic bromine in flue gas substantially reach thermodynamic equilibrium within 0.25 s. Under the proposed operating condition, the reaction of Br transfer and conversion finish. - Abstract: High temperature combustion experiments of waste printed circuit boards (PCBs) were conducted using a lab-scale system featuring a continuously-fed drop tube furnace. Combustion efficiency and the occurrence of inorganic bromine (HBr and Br2) were systematically studied by monitoring the main combustion products continuously. The influence of furnace temperature (T) was studied from 800 to 1400 °C, the excess air factor (EAF) was varied from 1.2 to 1.9 and the residence time in the high temperature zone (RTHT) was set at 0.25, 0.5, or 0.75 s. Combustion efficiency depends on temperature, EAF and RTHT; temperature has the most significant effect. Conversion of organic bromine from flame retardants into HBr and Br2 depends on temperature and EAF. Temperature has crucial influence over the ratio of HBr to Br2

  8. Prioritizing material recovery for end-of-life printed circuit boards

    Energy Technology Data Exchange (ETDEWEB)

    Wang Xue, E-mail: xxw6590@rit.edu [Golisano Institute for Sustainability, Rochester Institute of Technology, 111 Lomb Memorial Drive, Rochester, NY 14623 (United States); Gaustad, Gabrielle, E-mail: gabrielle.gaustad@rit.edu [Golisano Institute for Sustainability, Rochester Institute of Technology, 111 Lomb Memorial Drive, Rochester, NY 14623 (United States)

    2012-10-15

    Highlights: Black-Right-Pointing-Pointer Material recovery driven by composition, choice of ranking, and weighting. Black-Right-Pointing-Pointer Economic potential for new recycling technologies quantified for several metrics. Black-Right-Pointing-Pointer Indicators developed for materials incurring high eco-toxicity costs. Black-Right-Pointing-Pointer Methodology useful for a variety of stakeholders, particularly policy-makers. - Abstract: The increasing growth in generation of electronic waste (e-waste) motivates a variety of waste reduction research. Printed circuit boards (PCBs) are an important sub-set of the overall e-waste stream due to the high value of the materials contained within them and potential toxicity. This work explores several environmental and economic metrics for prioritizing the recovery of materials from end-of-life PCBs. A weighted sum model is used to investigate the trade-offs among economic value, energy saving potentials, and eco-toxicity. Results show that given equal weights for these three sustainability criteria gold has the highest recovery priority, followed by copper, palladium, aluminum, tin, lead, platinum, nickel, zinc, and silver. However, recovery priority will change significantly due to variation in the composition of PCBs, choice of ranking metrics, and weighting factors when scoring multiple metrics. These results can be used by waste management decision-makers to quantify the value and environmental savings potential for recycling technology development and infrastructure. They can also be extended by policy-makers to inform possible penalties for land-filling PCBs or exporting to the informal recycling sector. The importance of weighting factors when examining recovery trade-offs, particularly for policies regarding PCB collection and recycling are explored further.

  9. Recovery of metals from waste printed circuit boards by a mechanical method using a water medium.

    Science.gov (United States)

    Duan, Chenlong; Wen, Xuefeng; Shi, Changsheng; Zhao, Yuemin; Wen, Baofeng; He, Yaqun

    2009-07-15

    Research on the recycling of waste printed circuit boards (PCB) is at the forefront of environmental pollution prevention and resource recycling. To effectively crush waste PCB and to solve the problem of secondary pollution from fugitive odors and dust created during the crushing process, a wet impacting crusher was employed to achieve comminution liberation of the PCB in a water medium. The function of water in the crushing process was analyzed. When using slippery hammerheads, a rotation speed of 1470 rpm, a water flow of 6m(3)/h and a sieve plate aperture of 2.2mm, 95.87% of the crushed product was sized less than 1mm. 94.30% of the metal was in this grade of product. Using smashed material graded -1mm for further research, a Falcon concentrator was used to recover the metal from the waste PCB. Engineering considerations were the liberation degree, the distribution ratio of the metal and a way to simplify the technology. The separation mechanism for fine particles of different densities in a Falcon concentrator was analyzed in detail and the separation process in the segregation and separation zones was deduced. Also, the magnitude of centrifugal acceleration, the back flow water pressure and the feed slurry concentration, any of which might affect separation results, were studied. A recovery model was established using Design-Expert software. Separating waste PCB, crushed to -1mm, with the Falcon separator gave a concentrated product graded 92.36% metal with a recovery of 97.05%. To do this the reverse water pressure was 0.05 MPa, the speed transducer frequency was set at 30 Hz and the feed density was 20 g/l. A flow diagram illustrating the new technique of wet impact crushing followed by separation with a Falcon concentrator is provided. The technique will prevent environmental pollution from waste PCB and allow the effective recovery of resources. Water was used as the medium throughout the whole process. PMID:19121892

  10. Liquid oil and residual characteristics of printed circuit board recycle by pyrolysis

    International Nuclear Information System (INIS)

    Highlights: • Pyrolysis is a technology for recycling of the non-metal fraction of PCBs. • Liquid product constituents were analyzed for PCB pyrolysis. • Water-soluble ionic species were determined for PCB pyrolysis exhaust. - Abstract: Non-metal fractions of waste printed circuit boards (PCBs) were thermally treated (200–500 °C) under nitrogen atmosphere. Carbon, hydrogen, and nitrogen were determined by elemental analyzer, bromine by instrumental neutron activation analysis (INAA), phosphorus by energy dispersive X-ray spectrometer (EDX), and 29 trace elements by inductively coupled plasma atomic emission spectrometer (ICP-AES) and mass spectrometry (ICP-MS) for raw material and pyrolysis residues. Organic compositions of liquid oil were identified by GC (gas chromatography)–MS, trace element composition by ICP system, and 12 water-soluble ions by IC (ionic chromatography). Elemental content of carbon was >450 mg/g, oxygen 300 mg/g, bromine and hydrogen 60 mg/g, nitrogen 30 mg/g, and phosphorus 28 mg/g. Sulfur was trace in PCBs. Copper content was 25–28 mg/g, iron 1.3–1.7 mg/g, tin 0.8–1.0 mg/g and magnesium 0.4–1.0 mg/g; those were the main metals in the raw materials and pyrolytic residues. In the liquid products, carbon content was 68–73%, hydrogen was 10–14%, nitrogen was 4–5%, and sulfur was less than 0.05% at pyrolysis temperatures from 300 to 500 °C. Phenol, 3-bromophenol, 2-methylphenol and 4-propan-2-ylphenol were major species in liquid products, accounting for >50% of analyzed organic species. Bromides, ammonium and phosphate were the main species in water sorption samples for PCB pyrolysis exhaust

  11. Prioritizing material recovery for end-of-life printed circuit boards

    International Nuclear Information System (INIS)

    Highlights: ► Material recovery driven by composition, choice of ranking, and weighting. ► Economic potential for new recycling technologies quantified for several metrics. ► Indicators developed for materials incurring high eco-toxicity costs. ► Methodology useful for a variety of stakeholders, particularly policy-makers. - Abstract: The increasing growth in generation of electronic waste (e-waste) motivates a variety of waste reduction research. Printed circuit boards (PCBs) are an important sub-set of the overall e-waste stream due to the high value of the materials contained within them and potential toxicity. This work explores several environmental and economic metrics for prioritizing the recovery of materials from end-of-life PCBs. A weighted sum model is used to investigate the trade-offs among economic value, energy saving potentials, and eco-toxicity. Results show that given equal weights for these three sustainability criteria gold has the highest recovery priority, followed by copper, palladium, aluminum, tin, lead, platinum, nickel, zinc, and silver. However, recovery priority will change significantly due to variation in the composition of PCBs, choice of ranking metrics, and weighting factors when scoring multiple metrics. These results can be used by waste management decision-makers to quantify the value and environmental savings potential for recycling technology development and infrastructure. They can also be extended by policy-makers to inform possible penalties for land-filling PCBs or exporting to the informal recycling sector. The importance of weighting factors when examining recovery trade-offs, particularly for policies regarding PCB collection and recycling are explored further.

  12. Metals recovering from waste printed circuit boards (WPCBs) using molten salts

    International Nuclear Information System (INIS)

    Highlights: ► Recovering of valuable metals from WPCBs. ► Low temperature treatment, i.e., 300 °C. ► Copper, and precious metals are recovered, without dissolution or melting. ► Many hazardous gases are dissolved and trapped in the molten salt. ► Under operation without oxygen the flue gas contains large quantities of hydrogen. - Abstract: Recycling of waste electrical and electronic equipments (WEEE) has been taken into consideration in the literature due to the large quantity of concerned wastes and their hazardous contents. The situation is so critical that EU published European Directives imposing collection and recycling with a minimum of material recovery . Moreover, WEEEs contain precious metals, making the recycling of these wastes economically interesting, but also some critical metals and their recycling leads to resource conservation. This paper reports on a new approach for recycling waste printed circuit boards (WPCBs). Molten salts and specifically molten KOH–NaOH eutectic is used to dissolve glasses, oxides and to destruct plastics present in wastes without oxidizing the most valuable metals. This method is efficient for recovering a copper-rich metallic fraction, which is, moreover, cleared of plastics and glasses. In addition, analyses of gaseous emission show that this method is environmentally friendly since most of the process gases, such as carbon monoxide and dioxide and halogens, are trapped in the highly basic molten salt. In other respects, under operation without oxygen, a large quantity of hydrogen is produced and might be used as fuel gas or as synthesis gas, leading to a favourable energy balance for this new process.

  13. Leaching characteristics of heavy metals and brominated flame retardants from waste printed circuit boards

    International Nuclear Information System (INIS)

    Highlights: ► Cu and Pb were the most leachable heavy metals in WPCBs according to TCLP and SPLP. ► Penta-BDE congeners were dominated in all extracts. ► High dissolved organic matter condition promoted the BFRs leaching rate. ► Leaching from WPCBs was a significant emission source of BFRs in landfill. -- Abstract: Leaching assessment on five heavy metals (copper, zinc, lead, nickel and cadmium) and two brominated flame retardants (BFRs), polybrominated diphenyl ethers (PBDEs) and tetrabromobisphenol A (TBBPA), from waste printed circuit boards (WPCBs) were conducted using various leaching methods. The mean leaching concentrations of copper were the highest in both toxicity characteristic leaching procedures (TCLP) and synthetic precipitation leaching procedures (SPLP) tests at 8.6 mg/L and 1.1 mg/L, while only lead (6.2 mg/L) exceeded the TCLP criteria and Chinese EPA regulatory limit (both 5.0 mg/L). However, PBDEs and TBBPA were not detected in TCLP and SPLP tests. Then the BFRs leaching trends and potential leachabilities were further investigated in actual landfill leachates using a modified method. Leaching characteristics that fast-leaching initially followed by slow-desorption over time were generally observed. In landfill leachate tests, the highest leaching concentrations of PBDEs and TBBPA were determined at 30.39 and 12.27 μg/L. Meanwhile, the highest leaching rates were estimated to reach 0.08% and 1.00%, respectively, which were significantly influenced by the dissolved organic carbon contents of extracts, the hydrophobicities of target BFRs and the specific surface areas of WPCBs materials. These results proved that leaching from WPCBs was a significant emission source of BFRs in landfill and electronic waste recycling dumpsite

  14. Using vacuum pyrolysis and mechanical processing for recycling waste printed circuit boards

    International Nuclear Information System (INIS)

    The constant growth in generation of waste printed circuit boards (WPCB) poses a huge disposal problem because they consist of a heterogeneous mixture of organic and metallic chemicals as well as glass fiber. Also the presence of heavy metals, such as Pb and Cd turns this scrap into hazardous waste. Therefore, recycling of WPCB is an important subject not only from the recovery of valuable materials but also from the treatment of waste. The aim of this study was to present a recycling process without negative impact to the environment as an alternative for recycling WPCB. In this work, a process technology containing vacuum pyrolysis and mechanical processing was employed to recycle WPCB. At the first stage of this work, the WPCB was pyrolyzed under vacuum in a self-made batch pilot-scale fixed bed reactor to recycle organic resins contained in the WPCB. By vacuum pyrolysis the organic matter was decomposed to gases and liquids which could be used as fuels or chemical material resources, however, the inorganic WPCB matter was left unaltered as solid residues. At the second stage, the residues obtained at the first stage were investigated to separate and recover the copper through mechanical processing such as crushing, screening, and gravity separation. The copper grade of 99.50% with recovery of 99.86% based on the whole WPCB was obtained. And the glass fiber could be obtained by calcinations in a muffle furnace at 600 deg. C for 10 min. This study had demonstrated the feasibility of vacuum pyrolysis and mechanical processing for recycling WPCB.

  15. Ion track enabled multiple wire microvia interconnects in printed circuit boards

    International Nuclear Information System (INIS)

    As the call for higher wiring density in packaging and vertical microvia interconnections (microvias) rapidly evolves, the need for smaller lateral dimensions in printed circuit boards (PCB) microvias must be met. The ion track lithography described in this paper allows for high throughput micromachining of small, deep, vertical microvias in flexible PCB and all-polymer laminates. Ion track lithography makes use of swift heavy ion irradiation to enhance the selectivity and directionality of chemical etching. Within the areas exposed to the ion irradiation, small sub-micron pores (capillaries) are created, one for every ion. If etching is prolonged, the pores become merged. Electrodeposition from a metallic seed layer is used to fill these structures with metal. The lithography masks define either the areas where the ion tracks are developed or where the tracks are metallized. The smallest achievable size of the microvias is only limited by the resolution of the mask; microvias below 10 μm in diameter can also be achieved also in thick polyimide foils. Since each impinging ion forms one track, the foil's porosity can be controlled by adjusting the irradiation dose, as well as by etching the pores to a suitable size. Depending on the porosity and material, the resultant metallized microvia consists of either individual or interlaced wires (like strands in a bundle wire), or is a solid. As an individual sub-micron wire may have an aspect ratio of several hundreds, this allows for the fabrication of truly vertical microvia structures, allowing ultra-high density microvia batch production. Demonstrator microstructures with highly vertical microvias have been fabricated in foils up to 125 μm thickness. Several components integrated in flexible PCB have been presented by us, e.g. magnetoresistive sensors, thermopile IR-sensors and microwave components like inductor elements

  16. Short-Circuit Withstand Current Rating for Low Voltage Switchgear : Short-Circuit Current Rating (SCCR)

    OpenAIRE

    Schütt, Matthias

    2016-01-01

    The subject of this thesis was to observe the short-circuit currents at electrical distribution boards. The purpose was to investigate different methods of protecting switchgears from dam-ages caused by short-circuit currents. Manufactures of switchgears need to indicate the rated short-circuit withstand current of their assembly. This thesis is presenting methods of defining the right value of the short-circuit withstand current. This thesis presents theoretical information about the cau...

  17. Reliability of CGA/LGA/HDI Package Board/Assembly (Revision A)

    Science.gov (United States)

    Ghaffarian, Reza

    2013-01-01

    This follow-up report presents reliability test results conducted by thermal cycling of five CGA assemblies evaluated under two extreme cycle profiles, representative of use for high-reliability applications. The thermal cycles ranged from a low temperature of 55 C to maximum temperatures of either 100 C or 125 C with slow ramp-up rate (3 C/min) and dwell times of about 15 minutes at the two extremes. Optical photomicrographs that illustrate key inspection findings of up to 200 thermal cycles are presented. Other information presented include an evaluation of the integrity of capacitors on CGA substrate after thermal cycling as well as process evaluation for direct assembly of an LGA onto PCB. The qualification guidelines, which are based on the test results for CGA/LGA/HDI packages and board assemblies, will facilitate NASA projects' use of very dense and newly available FPGA area array packages with known reliably and mitigation risks, allowing greater processing power in a smaller board footprint and lower system weight.

  18. Adult Competency Education Kit. Basic Skills in Speaking, Math, and Reading for Employment. Part P: ACE Competency Based Job Descriptions: #77--Secretary; #78--Keypunch Operator; Assembly Worker Core Job Description; #82--Electronics Assembler; #83--Printed Circuit Assembler; #84--Micro Electronics Assembler; #85--Chassis Assembler; #87--Machinist Apprentice.

    Science.gov (United States)

    San Mateo County Office of Education, Redwood City, CA. Career Preparation Centers.

    This thirteenth of fifteen sets of Adult Competency Education (ACE) Competency Based Job Descriptions in the ACE kit contains job descriptions for Secretary, Keypunch Operator, Electronics Assembler, Printed Circuit Assembler, Micro Electronincs Assembler, Chassis Assembler, and Machinist Apprentice. Each begins with a fact sheet that includes…

  19. Display glass for low-loss and high-density optical interconnects in electro-optical circuit boards with eight optical layers.

    Science.gov (United States)

    Brusberg, Lars; Whalley, Simon; Herbst, Christian; Schröder, Henning

    2015-12-14

    Parallel optical interconnects on-board level requires low propagation loss in wavelength range between 850 and 1550 nm to be compatible with datacom and telecom optical engines. For highest integration density tight waveguide bends and a scalable number of optical layers should be manufacturable for 2D interfaces to optical fiber array connectors and photonic assembly I/O's. We developed a glass waveguide panel process for double-sided processing of commercial available display glass by applying a two-step thermal ion-exchange process for low-loss multi-mode graded-index waveguides. Multiple glass waveguide panels can be embedded between electrical layers. The generic concept enables fabrication of high-density integration (HDI) electro-optical circuit boards (EOCB) with high number of optical and electrical layers. Waveguides with high NA of 0.3 for low bend losses could be achieved in glass with propagation loss of 0.05 dB/cm for all key wavelengths. Four of those glass waveguide panels were embedded in an EOCB demonstrator with size of 280 x 233 mm² providing eight optical layers with 96 channels in an area of 2.8 x 1.5 mm². To the best of our knowledge it's the highest number of layers that has ever been demonstrated for an EOCB. PMID:26699042

  20. Highly flexible self-powered sensors based on printed circuit board technology for human motion detection and gesture recognition.

    Science.gov (United States)

    Fuh, Yiin-Kuen; Ho, Hsi-Chun

    2016-03-01

    In this paper, we demonstrate a new integration of printed circuit board (PCB) technology-based self-powered sensors (PSSs) and direct-write, near-field electrospinning (NFES) with polyvinylidene fluoride (PVDF) micro/nano fibers (MNFs) as source materials. Integration with PCB technology is highly desirable for affordable mass production. In addition, we systematically investigate the effects of electrodes with intervals in the range of 0.15 mm to 0.40 mm on the resultant PSS output voltage and current. The results show that at a strain of 0.5% and 5 Hz, a PSS with a gap interval 0.15 mm produces a maximum output voltage of 3 V and a maximum output current of 220 nA. Under the same dimensional constraints, the MNFs are massively connected in series (via accumulation of continuous MNFs across the gaps ) and in parallel (via accumulation of parallel MNFs on the same gap) simultaneously. Finally, encapsulation in a flexible polymer with different interval electrodes demonstrated that electrical superposition can be realized by connecting MNFs collectively and effectively in serial/parallel patterns to achieve a high current and high voltage output, respectively. Further improvement in PSSs based on the effect of cooperativity was experimentally realized by rolling-up the device into a cylindrical shape, resulting in a 130% increase in power output due to the cooperative effect. We assembled the piezoelectric MNF sensors on gloves, bandages and stockings to fabricate devices that can detect different types of human motion, including finger motion and various flexing and extensions of an ankle. The firmly glued PSSs were tested on the glove and ankle respectively to detect and harvest the various movements and the output voltage was recorded as ∼1.5 V under jumping movement (one PSS) and ∼4.5 V for the clenched fist with five fingers bent concurrently (five PSSs). This research shows that piezoelectric MNFs not only have a huge impact on harvesting various external

  1. Highly flexible self-powered sensors based on printed circuit board technology for human motion detection and gesture recognition

    Science.gov (United States)

    Fuh, Yiin-Kuen; Ho, Hsi-Chun

    2016-03-01

    In this paper, we demonstrate a new integration of printed circuit board (PCB) technology-based self-powered sensors (PSSs) and direct-write, near-field electrospinning (NFES) with polyvinylidene fluoride (PVDF) micro/nano fibers (MNFs) as source materials. Integration with PCB technology is highly desirable for affordable mass production. In addition, we systematically investigate the effects of electrodes with intervals in the range of 0.15 mm to 0.40 mm on the resultant PSS output voltage and current. The results show that at a strain of 0.5% and 5 Hz, a PSS with a gap interval 0.15 mm produces a maximum output voltage of 3 V and a maximum output current of 220 nA. Under the same dimensional constraints, the MNFs are massively connected in series (via accumulation of continuous MNFs across the gaps ) and in parallel (via accumulation of parallel MNFs on the same gap) simultaneously. Finally, encapsulation in a flexible polymer with different interval electrodes demonstrated that electrical superposition can be realized by connecting MNFs collectively and effectively in serial/parallel patterns to achieve a high current and high voltage output, respectively. Further improvement in PSSs based on the effect of cooperativity was experimentally realized by rolling-up the device into a cylindrical shape, resulting in a 130% increase in power output due to the cooperative effect. We assembled the piezoelectric MNF sensors on gloves, bandages and stockings to fabricate devices that can detect different types of human motion, including finger motion and various flexing and extensions of an ankle. The firmly glued PSSs were tested on the glove and ankle respectively to detect and harvest the various movements and the output voltage was recorded as ∼1.5 V under jumping movement (one PSS) and ∼4.5 V for the clenched fist with five fingers bent concurrently (five PSSs). This research shows that piezoelectric MNFs not only have a huge impact on harvesting various external

  2. Disassembly and physical separation of electric/electronic components layered in printed circuit boards (PCB)

    International Nuclear Information System (INIS)

    Highlights: ► The disassembly of electric/electronic components (EECs) layered in PCB as the first-step in recycling process. ► The disassembling treatment was carried out by the new designed apparatus. ► Most of the EECs (over 95%) can be recovered in a nondestructive state. ► These EECs contain 17 groups and can be classified into 54 types based on their shapes and sizes. ► The successive 3 stages of physical separation would enables the recovery of minor ingredients. - Abstract: Although printed circuit boards (PCBs) contain various elements, only the major elements (i.e., those with content levels in wt% or over grade) of and precious metals (e.g., Ag, Au, and platinum groups) contained within PCBs can be recycled. To recover other elements from PCBs, the PCBs should be properly disassembled as the first step of the recycling process. The recovery of these other elements would be beneficial for efforts to conserve scarce resources, reuse electric/electronic components (EECs), and eliminate environmental problems. This paper examines the disassembly of EECs from wasted PCBs (WPCBs) and the physical separation of these EECs using a self-designed disassembling apparatus and a 3-step separation process of sieving, magnetic separation, and dense medium separation. The disassembling efficiencies were evaluated by using the ratio of grinding area (Earea) and the weight ratio of the detached EECs (Eweight). In the disassembly treatment, these efficiencies were improved with an increase of grinder speed and grinder height. 97.7% (Earea) and 98% (Eweight) could be accomplished ultimately by 3 repetitive treatments at a grinder speed of 5500 rpm and a grinder height of 1.5 mm. Through a series of physical separations, most groups of the EECs (except for the diode, transistor, and IC chip groups) could be sorted at a relatively high separation efficiency of about 75% or more. To evaluate the separation efficiency with regard to the elemental composition, the

  3. Recycling of non-metallic fractions from waste printed circuit boards: A review

    International Nuclear Information System (INIS)

    The major economic driving force for recycling of waste printed circuit boards (PCBs) is the value of the metallic fractions (MFs) of PCBs. The non-metallic fractions (NMFs), which take up almost 70 wt% of waste PCBs, were treated by combustion or land filling in the past. However, combustion of the NMFs will cause the formation of highly toxic polybrominated dibenzodioxins and dibenzofurans (PBDD/Fs) while land filling of the NMFs will lead to secondary pollution caused by heavy metals and brominated flame retardants (BFRs) leaching to the groundwater. Therefore, recycling of the NMFs from waste PCBs is drawing more and more attention from the public and the governments. Currently, how to recycle the NMFs environmental soundly has become a significant topic in recycling of waste PCBs. In order to fulfill the better resource utilization of the NMFs, the compositions and characteristics of the NMFs, methods and outcomes of recycling the NMFs from waste PCBs and analysis and treatment for the hazardous substances contained in the NMFs were reviewed in this paper. Thermosetting resin matrix composites, thermoplastic matrix composites, concrete and viscoelastic materials are main applications for physical recycling of the NMFs. Chemical recycling methods consisting of pyrolysis, gasification, supercritical fluids depolymerization and hydrogenolytic degradation can be used to convert the NMFs to chemical feedstocks and fuels. The toxicity characteristic leaching procedure (TCLP) and synthetic precipitation leaching procedure (SPLP) can be used to determine the toxicity characteristic (TC) of the NMFs and to evaluate the environmental safety of products made from the recycled NMFs. It is believed that physical recycling of the NMFs has been a promising recycling method. Much more work should be done to develop comprehensive and industrialized usage of the NMFs recycled by physical methods. Chemical recycling methods have the advantages in eliminating hazardous substances

  4. Encapsulation of nonmetallic fractions recovered from printed circuit boards waste with thermoplastic.

    Science.gov (United States)

    Muniyandi, Shantha Kumari; Sohaili, Johan; Hassan, Azman

    2014-09-01

    The present work includes a process for encapsulation by combining substantially simultaneously dry nonmetallic printed circuit boards (PCBs) powder and recycled high-density polyethylene (rHDPE) in an extruder to form a homogenous matrix. The extruded materials were then molded into standard tensile, flexural, and impact properties testing specimens. Nonmetallic PCB mainly consists of large amount of glass fiber-reinforced epoxy resin materials. Incorporation of 50 wt% nonmetallic PCB in rHDPE matrix had increased the flexural strength and modulus by 35% and 130%, respectively. Tensile strength reported to be constant without much improvement. However, the Young's modulus has increased by 180%, with incorporation of 50 wt% nonmetallic PCB. The addition of 6 phr (parts per hundred) maleated polyethylene (MAPE) resulted in 2-fold increase in tensile and flexural strength. Regarding the leaching properties, Cu was identified as the metal that leached at the highest level from the raw nonmetallic PCB, at 59.09 mg/L. However, after the nonmetallic PCB was filled in rHDPE/PCB composites, the concentration of Cu was reduced far below the regulatory limit, to only 3 mg/L. Thermal properties of composites were studied, and it was found out that incorporation of nonmetallic PCB fillers in rHDPE resulted in low thermal conductivity, whereas mechanical strength of the composites showed maximum improvements at 220 degrees C. Overall, the encapsulation technique using nonmetallic PCB waste has formed a monolithic waste form that provides a barrier to the dispersion of wastes into the environment. Implications: Nonmetallic materials reclaimed from waste PCBs were used to analyze the chemical composition, and it was found that nonmetalllic PCBs mainly consist of glass fiber-reinforced epoxy resin materials. With such millions of glass fibers in nonmetallic PCBs, there are mass-excellent supporting bodies that enhance the mechanical properties of composites. In fact, utilization

  5. Optimal production planning for PCB assembly

    CERN Document Server

    Ho, William

    2006-01-01

    Focuses on the optimization of the Printed circuit board (PCB) assembly lines' efficiency. This book integrates the component sequencing and the feeder arrangement problems together for the pick-and-place machine and the chip shooter machines.

  6. Recycling-oriented characterization of plastic frames and printed circuit boards from mobile phones by electronic and chemical imaging

    International Nuclear Information System (INIS)

    Highlights: • A recycling oriented characterization of end-of-life mobile phones was carried out. • Characterization was developed in a zero-waste-perspective, aiming to recover all the mobile phone materials. • Plastic frames and printed circuit boards were analyzed by electronic and chemical imaging. • Suitable milling/classification strategies were set up to define specialized-pre-concentrated-streams. • The proposed approach can improve the recovery of polymers, base/precious metals, rare earths and critical raw materials. - Abstract: This study characterizes the composition of plastic frames and printed circuit boards from end-of-life mobile phones. This knowledge may help define an optimal processing strategy for using these items as potential raw materials. Correct handling of such a waste is essential for its further “sustainable” recovery, especially to maximize the extraction of base, rare and precious metals, minimizing the environmental impact of the entire process chain. A combination of electronic and chemical imaging techniques was thus examined, applied and critically evaluated in order to optimize the processing, through the identification and the topological assessment of the materials of interest and their quantitative distribution. To reach this goal, end-of-life mobile phone derived wastes have been systematically characterized adopting both “traditional” (e.g. scanning electronic microscopy combined with microanalysis and Raman spectroscopy) and innovative (e.g. hyperspectral imaging in short wave infrared field) techniques, with reference to frames and printed circuit boards. Results showed as the combination of both the approaches (i.e. traditional and classical) could dramatically improve recycling strategies set up, as well as final products recovery

  7. Estimation of Relative Permittivity of Printed Circuit Board with Fiber Glass Epoxy as Dielectric for UHF Applications

    Directory of Open Access Journals (Sweden)

    Ronal D. Montoya-Montoya

    2013-11-01

    Full Text Available This paper presents the results of measuring relative permittivity of fiber glass printed circuit board (PCB’s, using a rectangular resonant cavity. The relative permittivity is presented as function of frequency. To obtain resonant frequencies, the return loss was measured using a network analyzer. Relative permittivity was calculated by finding frequencies of resonant cavity modes. The results are presented in a frequency span of 1 to 3.5GHz. It was clearly shown the nonlinear behavior of the relative permittivity for the dielectric laminate evaluated, even what happens respect to the frequency of the resonant modes below and above to frequency of 2 GHz.

  8. Impaired activity-dependent neural circuit assembly and refinement in autism spectrum disorder genetic models

    Directory of Open Access Journals (Sweden)

    Caleb Andrew Doll

    2014-02-01

    Full Text Available Early-use activity during circuit-specific critical periods refines brain circuitry by the coupled processes of eliminating inappropriate synapses and strengthening maintained synapses. We theorize these activity-dependent developmental processes are specifically impaired in autism spectrum disorders (ASDs. ASD genetic models in both mouse and Drosophila have pioneered our insights into normal activity-dependent neural circuit assembly and consolidation, and how these developmental mechanisms go awry in specific genetic conditions. The monogenic Fragile X syndrome (FXS, a common cause of heritable ASD and intellectual disability, has been particularly well linked to defects in activity-dependent critical period processes. The Fragile X Mental Retardation Protein (FMRP is positively activity-regulated in expression and function, in turn regulates excitability and activity in a negative feedback loop, and appears to be required for the activity-dependent remodeling of synaptic connectivity during early-use critical periods. The Drosophila FXS model has been shown to functionally conserve the roles of human FMRP in synaptogenesis, and has been centrally important in generating our current mechanistic understanding of the FXS disease state. Recent advances in Drosophila optogenetics, transgenic calcium reporters, highly-targeted transgenic drivers for individually-identified neurons, and a vastly improved connectome of the brain are now being combined to provide unparalleled opportunities to both manipulate and monitor activity-dependent processes during critical period brain development in defined neural circuits. The field is now poised to exploit this new Drosophila transgenic toolbox for the systematic dissection of activity-dependent mechanisms in normal versus ASD brain development, particularly utilizing the well-established Drosophila FXS disease model.

  9. Addressing Rural Library Technology Budgets with Single Board Computers: Testing the APC 8950 Rock Circuit Board Computer for Patron Access

    Directory of Open Access Journals (Sweden)

    Michael D. Wells

    2014-04-01

    Full Text Available Over the last decade, libraries have faced enormous budgetary challenges when it comes to implementing new technologies. These challenges are very pronounced in rural areas where libraries struggle to develop and define a path for purchasing and replacing systems that have become outdated. The author attempted to create a unit to replace aging OPAC terminals and to provide a low cost computing option for budget constrained rural libraries. The initial attempt detailed in this paper involved purchasing and configuring an APC 8950 Rock single board computer. Unfortunately, due to limitations of this APC unit’s existing Android based operating system, the initial effort failed to yield a computer that could be used in a library by average patrons. Future plans are outlined for the development of a second system using the more broadly accepted Raspberry Pi platform. The success of this technological endeavor may empower libraries and patrons in their communities to have more control of the technology they develop and use in the future.

  10. Development of Three-Ring Conductance Meter on Flexible Printed Circuit Board for Liquid Film Thickness Measurement

    International Nuclear Information System (INIS)

    Electrical methods which based on conductance of fluid film have been widely applied for many years. Recently, Damsohn developed a high speed liquid film sensor that has great time and spatial resolution by applying printed circuit board (PCB) and wire-mesh signal processing unit. However, the conductivity of the fluid can be affected by its temperature change and previous electrical methods have limitations of its applicability where a heat transfer is involved. In order to overcome this limitation, Kim proposed three-ring conductance method which can measure the liquid film thickness independent of the liquid temperature variation. In the present work, the three-ring conductance meter is improved by fabricating it on flexible printed circuit board (FPCB). Since the FPCB can be attached on a curved surface and can tolerate temperature up to 180 .deg. C, it is expected to be applied to more diverse experimental conditions of nuclear thermal-hydraulics. This paper introduces the three ring conductance meter on FPCB and a preliminary experimental result in order to show its feasibility for measuring liquid film thickness under temperature varying conditions. From this experimental research, the availability of three-ring conductance meter fabricated on FPCB for measuring film-thickness by using current output signal was proved. Besides, the necessity of customized electrode design depending on film-thickness was found. Also, it was confirmed that the manufactured three-ring conductance meter can measure the film-thickness regardless of temperature change

  11. Kinetics of the steam gasification of a phenolic circuit board in the presence of carbonates

    International Nuclear Information System (INIS)

    Highlights: ► The gasification was effective to produce clean hydrogen from plastic WEEE content. ► The reaction proceeded through an initial pyrolysis and latter gasification of char. ► Both the pyrolysis and the latter gasification were accelerated by the carbonate. ► Physical contact of steam, carbonate and char was important for the gasification. ► The gasification occurred mainly in outer layer of char infiltrated by the carbonate. -- Abstract: Steam gasification of a phenolic board in the presence of molten carbonate was studied as a means to recover useful metals effectively from electronic waste while also converting its plastic fraction into clean fuel gas. In the steam gasification of the phenolic board, the presence of carbonate considerably accelerated the conversion of tar and char into gaseous products. When pulverized phenolic board particles <0.15 mm were gasified, carbonate and steam permeated the sample particles, and the resulting gasification proceeded was well modeled by a homogeneous kinetic model. On the other hand relatively large phenolic board particles appeared to undergo two different hydrogen-producing gasification processes: the observed hydrogen formation rates suggest that an initial gasification occurred in the surface layer, which carbonate and steam were able to infiltrate into, and after this layer was consumed, the gasification proceeded only on the surface of the resulting char. The reactivity of char in the steam gasification depends sensitively on the conditions whereby the char is produced: rapid pyrolysis of the phenolic board produced highly reactive char, evidenced by markedly increased hydrogen formation rates in the steam gasification of chars formed under more rapid heating. However, once the char was pulverized finely, no obvious difference in reactivity was observed in the steam gasification based on the size of the phenolic board particles used to produce the char.

  12. Fabrication of a large-scale Ni stamp using a multi-level SU-8 photoresist mold for advanced printed circuit board manufacturing

    International Nuclear Information System (INIS)

    Recently, as integration density of electrical devices has increased, multi-layered, fine-patterned printed circuit board (PCB) technology has been advancing. As a high-volume, low-cost manufacturing method, PCB fabrication by imprinting has gained much attention. A large-sized Ni stamp plays a critical role in this method. We thus developed a novel fabrication method for a large-sized multi-level Ni stamp, which imprints patterns directly onto PCB resin, using multi-level patterning of an SU-8 photoresist. In this study, we focused on two aspects: (i) the property of SU-8 adhering to a large-sized glass substrate and (ii) neat and complete removal of SU-8 from the Ni stamp using a self-assembled monolayer. Using the processes we developed which will be described in detail in this paper, we successfully demonstrated a multi-level Ni stamp as large as 190 mm × 190 mm in size. The actual imprinting test exhibited successful results showing suitability of the developed method for large-scale, low-cost and high-volume manufacturing of the advanced PCBs

  13. Theoretic model and computer simulation of separating mixture metal particles from waste printed circuit board by electrostatic separator.

    Science.gov (United States)

    Li, Jia; Xu, Zhenming; Zhou, Yaohe

    2008-05-30

    Traditionally, the mixture metals from waste printed circuit board (PCB) were sent to the smelt factory to refine pure copper. Some valuable metals (aluminum, zinc and tin) with low content in PCB were lost during smelt. A new method which used roll-type electrostatic separator (RES) to recovery low content metals in waste PCB was presented in this study. The theoretic model which was established from computing electric field and the analysis of forces on the particles was used to write a program by MATLAB language. The program was design to simulate the process of separating mixture metal particles. Electrical, material and mechanical factors were analyzed to optimize the operating parameters of separator. The experiment results of separating copper and aluminum particles by RES had a good agreement with computer simulation results. The model could be used to simulate separating other metal (tin, zinc, etc.) particles during the process of recycling waste PCBs by RES. PMID:17981393

  14. Electrostatic separation for recycling waste printed circuit board: a study on external factor and a robust design for optimization.

    Science.gov (United States)

    Hou, Shibing; Wu, Jiang; Qin, Yufei; Xu, Zhenming

    2010-07-01

    Electrostatic separation is an effective and environmentally friendly method for recycling waste printed circuit board (PCB) by several kinds of electrostatic separators. However, some notable problems have been detected in its applications and cannot be efficiently resolved by optimizing the separation process. Instead of the separator itself, these problems are mainly caused by some external factors such as the nonconductive powder (NP) and the superficial moisture of feeding granule mixture. These problems finally lead to an inefficient separation. In the present research, the impacts of these external factors were investigated and a robust design was built to optimize the process and to weaken the adverse impact. A most robust parameter setting (25 kv, 80 rpm) was concluded from the experimental design. In addition, some theoretical methods, including cyclone separation, were presented to eliminate these problems substantially. This will contribute to efficient electrostatic separation of waste PCB and make remarkable progress for industrial applications. PMID:20518505

  15. New technology for separating resin powder and fiberglass powder from fiberglass-resin powder of waste printed circuit boards.

    Science.gov (United States)

    Li, Jia; Gao, Bei; Xu, Zhenming

    2014-05-01

    New recycling technologies have been developed lately to enhance the value of the fiberglass powder-resin powder fraction (FRP) from waste printed circuit boards. The definite aim of the present paper is to present some novel methods that use the image forces for the separation of the resin powder and fiberglass powder generated from FRP during the corona electrostatic separating process. The particle shape charactization and particle trajectory simulation were performed on samples of mixed non-metallic particles. The simulation results pointed out that particles of resin powder and particles of fiberglass powder had different detach trajectories at the conditions of the same size and certain device parameters. An experiment carried out using a corona electrostatic separator validated the possibility of sorting these particles based on the differences in their shape characteristics. The differences in the physical properties of the different types of particles provided the technical basis for the development of electrostatic separation technologies for the recycling industry. PMID:24678800

  16. Tailored benzoxazines as novel resin systems for printed circuit boards in high temperature e-mobility applications

    Energy Technology Data Exchange (ETDEWEB)

    Troeger, K., E-mail: altstaedt@uni-bayreuth.de; Darka, R. Khanpour, E-mail: altstaedt@uni-bayreuth.de; Neumeyer, T., E-mail: altstaedt@uni-bayreuth.de; Altstaedt, V., E-mail: altstaedt@uni-bayreuth.de [Polymer Engineering, University of Bayreuth, Germany and Polymer Engineering, Universitaetsstrasse 30, 95447 Bayreuth (Germany)

    2014-05-15

    This study focuses on the development of Bisphenol-F-benzoxazine resins blended with different ratios of a trifunctional epoxy resin suitable as matrix for substrates for high temperature printed circuit board (HT-PCB) applications. With the benzoxazine blends glass transition temperatures of more than 190 °C could be achieved in combination with a coefficient of thermal expansion in thickness direction (z-CTE) of less than 60 ppm/K without adding any fillers. This shows the high potential of the benzoxazine-epoxy blend systems as substrate materials for HT-PCBs. To understand the thermal behavior of the different formulations, the apparent crosslink density was calculated based on data from Dynamic Mechanical Analysis. Laminates in laboratory scale were prepared and characterized to demonstrate the transformation of the neat resin properties into real electronic substrate properties. The produced laminates exhibit a z-CTE below 40 ppm/K.

  17. Influence of nonmetals recycled from waste printed circuit boards on flexural properties and fracture behavior of polypropylene composites

    International Nuclear Information System (INIS)

    Flexural strength and flexural modulus of the composites can be successfully improved by filling nonmetals recycled from waste printed circuit boards (PCBs) into polypropylene (PP). By using scanning electron microscopy (SEM), the influence of nonmetals on fracture behavior of PP composites is investigated by in situ flexural test. Observation results show that the particles can effectively lead to mass micro cracks instead of the breaking crack. The process of the crack initiation, propagation and fiber breakage dissipate a great amount of energy. As a result, the flexural properties of the composites can be reinforced significantly. Results of the in situ SEM observation and analysis to the dynamic flexural process supply effective test evidence for the reinforcing mechanism of the nonmetals/PP composites on the basis of the energy dissipation theory

  18. New printed circuit boards magnetic coils in the vacuum vessel of J-TEXT tokamak for position measurement

    International Nuclear Information System (INIS)

    Four sets of magnetic diagnostic coils, which are printed on machinable ceramic printed circuit boards (PCB), are designed, fabricated, installed, and tested in the Joint Texas Experimental Tokamak (J-TEXT) vacuum vessel for detecting the plasma radial and vertical displacements relative to the geometric center of the vacuum vessel in Ohmic discharges. Each coordinate is determined by a pair of variable cross-section Rogowski and saddle coils, which measure the tangential and normal magnetic fields (relative to the coil surface). These coils are suitable for mass production and offer advantages in vacuum compatibility and temperature tolerance that are important for J-TEXT. Position measurements using PCB coils are compared with those from soft x-ray image system and match the position well.

  19. Influence of incorporation of powder of printed circuit boards on technological properties and microstructure of triaxial ceramics

    International Nuclear Information System (INIS)

    Using the methodology of experiments with mixtures, seven formulations of clay, phyllite, and printed circuit boards (PCB) were obtained to study the influence of this waste on triaxial ceramic tiles. Each formulation was processed under conditions similar to those used in the ceramic tiles industry, and characterized for fired modulus of rupture (FMoR) and water absorption (WA). The samples sintered at 1180°C were also subjected to analysis by XRD and SEM. The lowest resistance was observed in samples with 40% residue, while the highest strength occurred for samples with 14% residue, which reached average values of mechanical strength and water absorption of 35.0 MPa and 2.0%, respectively. The microstructure showed that it is possible to use waste of PCB in triaxial ceramic, which exhibits a fluxing behavior and it has an important effect on the sinterability and the development of appropriate microstructures. (author)

  20. Tailored benzoxazines as novel resin systems for printed circuit boards in high temperature e-mobility applications

    International Nuclear Information System (INIS)

    This study focuses on the development of Bisphenol-F-benzoxazine resins blended with different ratios of a trifunctional epoxy resin suitable as matrix for substrates for high temperature printed circuit board (HT-PCB) applications. With the benzoxazine blends glass transition temperatures of more than 190 °C could be achieved in combination with a coefficient of thermal expansion in thickness direction (z-CTE) of less than 60 ppm/K without adding any fillers. This shows the high potential of the benzoxazine-epoxy blend systems as substrate materials for HT-PCBs. To understand the thermal behavior of the different formulations, the apparent crosslink density was calculated based on data from Dynamic Mechanical Analysis. Laminates in laboratory scale were prepared and characterized to demonstrate the transformation of the neat resin properties into real electronic substrate properties. The produced laminates exhibit a z-CTE below 40 ppm/K

  1. Characterization of copper surfaces used in electronic circuit boards by reflectance FT-IR[Fouier Transform - Infrared

    Energy Technology Data Exchange (ETDEWEB)

    Sloan, J.M.; Pergantis, C.G.

    2000-07-01

    Organic and organo-metallic coatings are presently being applied over bare copper as an approach to improve the co-planarity of circuit boards. Conformal organic solderability preservative coatings (OSP) are environmentally and economically advantageous over the more commonly used lead based coatings. Problems arise in assessing the solderability of the bare copper and the integrity of the organic coating. Specular reflectance Fourier transform infrared spectroscopy (FT-IR) was utilized to monitor and evaluate the formation of Cu oxides occurring on copper substrates used in the manufacturing of electronic circuit boards. Previous studies reported the utility of this technique. By measuring the oxide and protective coating characteristics of these surfaces, their solderability performance can rapidly be evaluated in a manufacturing environment. OSP coated test specimens were subjected to hot-dry and hot-wet environmental conditions using MIL-STD-202F and MIL-STD-883E as guides. The resultant FT-IR spectra provided clear evidence for the formation of various Cu oxides at the Cu/OSP interface over exposure time, for the samples subjected to the hot-dry environment. IR spectral bands consistent with O-Cu-O and Cu{sub 2}O{sub 2} formation appear, while very minimal deterioration to the OSP coating was observed. The appearance of the Cu oxide layers grew steadily with increased environmental exposure. Specimens subjected to the hot-wet conditions showed no significant signs of deterioration. The IR data can be directly correlated to solderability performance as evaluated by wet balance testing.

  2. Contamination profile of Printed Circuit Board Assemblies in relation to soldering types and conformal coating

    DEFF Research Database (Denmark)

    Conseil, Helene; Jellesen, Morten Stendahl; Ambat, Rajan

    2014-01-01

    measuring the leak current using a twin platinum electrode setup. Localized extraction of residue was carried out using a commercial C3 extraction system. Results clearly show that the amount and distribution of flux residues are a function of the soldering process, and the level can be reduced by an...

  3. Radiation evaluation method of commercial off-the-shelf (COTS) electronic printed circuit boards (PCBs); Methode d'evaluation de la tenue aux radiations de circuits imprimes (PCBs) commerciaux (COTS)

    Energy Technology Data Exchange (ETDEWEB)

    LaBel, K.A.; Gruner, T.D.; Reed, R.A.; Settles, B.; Wilmot, J.; Dougherty, L.F.; Russo, A.; Yuknis, W.; Foster, M.G.; Garrisson-Darrin, A.; Marshall, P.W. [NASA/GSFC, Goddard Space Flight Center, Greenbelt (United States)

    1999-07-01

    We present a radiation evaluation methodology and proton ground test results for candidate COTS PCBs (commercial off-the-shelf electronic printed circuit boards) and their associated electronics for low-altitude, low-inclination orbits. We will also discuss the implications associated with mission orbit and duration. (authors)

  4. Evaluation of Cleanliness Test Methods for Spacecraft PCB Assemblies

    Science.gov (United States)

    Tegehall, P.-E.; Dunn, B. D.

    2006-10-01

    Ionic contamination on printed-circuit-board assemblies may cause current leakage and short-circuits. The present cleanliness requirement in ECSS-Q-70-08, "The manual soldering of high-reliability electrical connections", is that the ionic contamination shall be less than 1.56 fl-glcm2 NaCI equivalents. The relevance of the method used for measurement of the ionic contamination level, resistivity of solvent extract, has been questioned. Alternative methods are ion chromatography and measurement of surface insulation resistance, but these methods also have their drawbacks. These methods are first described and their advantages and drawbacks are discussed. This is followed by an experimental evaluation of the three methods. This was done by soldering test vehicles at four manufacturers of space electronics using their ordinary processes for soldering and cleaning printed board assemblies. The experimental evaluation showed that the ionic contamination added by the four assemblers was very small and well below the acceptance criterion in ECSS-Q-70-80. Ion-chromatography analysis showed that most of the ionic contamination on the cleaned assembled boards originated from the hot-oil fusing of the printed circuit boards. Also, the surface insulation resistance was higher on the assembled boards compared to the bare printed circuit boards. Since strongly activated fluxes are normally used when printed circuit boards are hot-oil fused, it is essential that they are thoroughly cleaned in order to achieve low contamination levels on the final printed-board assemblies.

  5. Infant phantom head circuit board for EEG head phantom and pediatric brain simulation

    Science.gov (United States)

    Almohsen, Safa

    The infant's skull differs from an adult skull because of the characteristic features of the human skull during early development. The fontanels and the conductivity of the infant skull influence surface currents, generated by neurons, which underlie electroencephalography (EEG) signals. An electric circuit was built to power a set of simulated neural sources for an infant brain activity simulator. Also, in the simulator, three phantom tissues were created using saline solution plus Agarose gel to mimic the conductivity of each layer in the head [scalp, skull brain]. The conductivity measurement was accomplished by two different techniques: using the four points' measurement technique, and a conductivity meter. Test results showed that the optimized phantom tissues had appropriate conductivities to simulate each tissue layer to fabricate a physical head phantom. In this case, the best results should be achieved by testing the electrical neural circuit with the sample physical model to generate simulated EEG data and use that to solve both the forward and the inverse problems for the purpose of localizing the neural sources in the head phantom.

  6. Using Mathematical Morphology to Detect the Imperfections of the Printed Circuit Boards

    Directory of Open Access Journals (Sweden)

    Ionut Balan

    2008-01-01

    Full Text Available Image processing is a form of signal processing(analysis, interpretation, and manipulation of signals forwhich the input is an image, such as photographs; the outputof image processing can be either an image or a set ofcharacteristics or parameters related to the image. Typicaloperations of image processing are geometrictransformations such as enlargement, reduction androtation, color corrections such as brightness and contrastadjustments, quantization, or conversion to a different colorspace, interpolation and recovery of a full image from a rawimage format, image editing, image differencing, imagestabilization, image segmentation and other. Applications ofthese operations are encountered in computer vision, facedetection, feature detection, medical image processing,microscope image processing, morphological imageprocessing, remote sensing and many other disciplines.Morphological image processing is a collection of techniquesfor digital image processing based on mathematicalmorphology. By combining these morphological operatorswe can obtain algorithms for many image processing tasks,such as feature detection, image segmentation, imagesharpening, image filtering, and granulometry. Likewise,using this technology we can detect some imperfections of theprinted circuits, imperfections that allow us to repair it,opportunely. So in this way, we can eliminate some costs inthe technological process.The paper presents an introduction in mathematicalmorphology, describes “hit and miss transform”, dilationand erosion and, after all, we present the usage of two ofthese operations in printed circuit error detection.

  7. A quick solution, made to measure; Big scientific experiments need big circuit boards and that's where East Kilbride's D-TACQ comes in

    CERN Multimedia

    Gardner, D

    2003-01-01

    D-TACQ is a small electronics company operating in a highly-specialised market with technological expertise that few can match worldwide. It specialises in designing and manufacturing bespoke printed circuit boards (PCBs) which handle data acquisition tasks linked to scientific instrumentation and control systems (1 page).

  8. Surface Breakdown of Printed Circuit Board under Magnetic Field with Reduced Pressure

    Institute of Scientific and Technical Information of China (English)

    杜伯学; 朱晓辉; 高宇; 卢欣

    2010-01-01

    Epoxy resin laminate onto which a pair of copper foil was printed was employed as test samples.The samples were placed in an artificial atmospheric chamber, which was vacuumed by a rotary pump from 100 kPa to 5 kPa.The magnetic field was produced by permanent magnets that were assembled to make E×B drift away from, into and parallel to the sample surface, respectively.Magnetic flux density was adjusted at 120 mT, 180 mT and 240 mT respectively.By applying a negative bias voltage between the electrodes, the ...

  9. Equivalent circuits of a self-assembled monolayer-based tunnel junction determined by impedance spectroscopy.

    Science.gov (United States)

    Sangeeth, C S Suchand; Wan, Albert; Nijhuis, Christian A

    2014-08-01

    The electrical characteristics of molecular tunnel junctions are normally determined by DC methods. Using these methods it is difficult to discriminate the contribution of each component of the junctions, e.g., the molecule-electrode contacts, protective layer (if present), or the SAM, to the electrical characteristics of the junctions. Here we show that frequency-dependent AC measurements, impedance spectroscopy, make it possible to separate the contribution of each component from each other. We studied junctions that consist of self-assembled monolayers (SAMs) of n-alkanethiolates (S(CH2)(n-1)CH3 ≡ SC(n) with n = 8, 10, 12, or 14) of the form Ag(TS)-SC(n)//GaO(x)/EGaIn (a protective thin (~0.7 nm) layer of GaO(x) forms spontaneously on the surface of EGaIn). The impedance data were fitted to an equivalent circuit consisting of a series resistor (R(S), which includes the SAM-electrode contact resistance), the capacitance of the SAM (C(SAM)), and the resistance of the SAM (R(SAM)). A plot of R(SAM) vs n(C) yielded a tunneling decay constant β of 1.03 ± 0.04 n(C)(-1), which is similar to values determined by DC methods. The value of C(SAM) is similar to previously reported values, and R(S) (2.9-3.6 × 10(-2) Ω·cm(2)) is dominated by the SAM-top contact resistance (and not by the conductive layer of GaO(x)) and independent of n(C). Using the values of R(SAM), we estimated the resistance per molecule r as a function of n(C), which are similar to values obtained by single molecule experiments. Thus, impedance measurements give detailed information regarding the electrical characteristics of the individual components of SAM-based junctions. PMID:25036915

  10. Rapid prototyping of interfacing microcomponents for printed circuit board-level optical interconnects

    Science.gov (United States)

    Van Erps, Jürgen; Vervaeke, Michael; Thienpont, Hugo

    2012-01-01

    One of the important challenges for the deployment of the emerging breed of nanotechnology components is interfacing them with the external world, preferably accomplished with low-cost micro-optical devices. For the fabrication of this kind of micro-optical components, we make use of deep proton writing (DPW) as a generic rapid prototyping technology. DPW consists of bombarding polymer samples with swift protons, which results after chemical processing steps in high quality micro-optical components. The strength of the DPW micro-machining technology is the ability to fabricate monolithic building blocks that include micro-optical and mechanical functionalities which can be precisely integrated into more complex photonic systems. In this paper we give an overview of the process steps of the technology and we present several examples of micro-optical and micro-mechanical components, fabricated through DPW, targeting applications in printed circuit baordlevel optical interconnections. These include: high-precision 2-D fiber connectors, discrete out-of-plane coupling structures featuring high-quality 45° and curved micro-mirrors, arrays of high aspect ratio micro-pillars and backplane connectors. While DPW is clearly not a mass fabrication technique as such, one of its assets is that once the master component has been prototyped, a metal mould can be generated from the DPW master by applying electroplating. After removal of the plastic master, this metal mould can be used as a shim in a final microinjection moulding or hot embossing step. This way, the master component can be mass-produced at low cost in a wide variety of high-tech plastics.

  11. Milk-run kanban system for raw printed circuit board withdrawal to surface-mounted equipment

    Directory of Open Access Journals (Sweden)

    Swee Li Chee

    2012-12-01

    Full Text Available Purpose:  The paper aims to present a case study and later simulation analysis on a kanban system that incorporating milk-run operation to draw in raw material to the process. Design/methodology/approach:  Data collection at the case study company for ten weeks followed by a process study called value stream mapping. The proposed kanban model is simulated to test its various performances including total output, average flow time, average work-in-process, SME utilization, and average waiting time. Response surface methodology is adopted to generate suitable representative regression models.  Findings: For all performance measures, simulation results showed that the proposed system consistently outperforms the push system currently practiced. Second, the system indicates the advantages of leveling, particularly in the event of machine failure and blockage. Third, operator in the proposed kanban system has a lower utilization, even with the additional material handling task.   Research limitations/implications: This study only begins to reveal the implication of leveling for production control on multi-machine scenario. The simulation of the system is solely based only the case study. The control parameters critical to the case study, were naturally used. The furtherance of the research should include generalizing the system and devising the respective methodology to facilitate wider applications. Practical implications: Originality/value:  The kanban system is proposed in the light of conflicting interests in handling the surface mounting and the related upstream processes. Such aspect is common to electronics assembly industry.

  12. Investigation of multilayer printed circuit board (PCB) film warpage using viscoelastic properties measured by a vibration test

    International Nuclear Information System (INIS)

    Woven glass fabric/BT (bismaleimide triazine) composite laminate (BT core), copper (Cu), and photoimageable solder resist (PSR) are the most widely used materials for semiconductors in electronic devices. Among these materials, BT core and PSR contain polymeric materials that exhibit viscoelastic behavior. For this reason, these materials are considered to have time- and temperature-dependent moduli during warpage analysis. However, the thin geometry of multilayer printed circuit board (PCB) film makes it difficult to identify viscoelastic characteristics. In this work, a vibration test method was proposed for measuring the viscoelastic properties of a multilayer PCB film at different temperatures. The beam-shaped specimens, composed of a BT core, Cu laminated on a BT core, and PSR and Cu laminated on a BT core, were used in the vibration test. The frequency-dependent variation of the complex bending stiffness was determined using a transfer function method. The storage modulus (E′) of the BT core, Cu, and PSR as a function of temperature and frequency were obtained, and their temperature-dependent variation was identified. The obtained properties were fitted using a viscoelastic model for the BT core and the PSR, and a linear elastic model for the Cu. Warpage of a line pattern specimen due to temperature variation was measured using a shadow Moiré analysis and compared to predictions using a finite element model. The results provide information on the mechanism of warpage, especially warpage due to temperature-dependent variation in viscoelastic properties. (paper)

  13. A novel reutilization method for waste printed circuit boards as flame retardant and smoke suppressant for poly (vinyl chloride).

    Science.gov (United States)

    Xiu, Fu-Rong; Weng, Huiwei; Qi, Yingying; Yu, Gending; Zhang, Zhigang; Zhang, Fu-Shen

    2016-09-01

    In this study, a novel reutilization method for waste printed circuit boards (PCBs) as flame retardant and smoke suppressant for poly (vinyl chloride) (PVC) was successfully testified. A supercritical water oxidation (SCWO) process was applied to treat waste PCBs before they could be used as flame retardants of PVC. The results indicated that SCWO conditions had a significant effect on the flame retarding and smoke suppressing properties of waste PCBs for PVC. Cu2O, CuO, and SnO2 were the main active ingredients in waste PCBs-derived flame retardants. A conversion of Cu elements (Cu(0)→Cu(+)→Cu(2+)) during SCWO process with the increase of reaction temperature was found to be the key influence factor for the flame retarding properties of SCWO-treated PCBs. The experiment results also showed that there was a synergistic effect of flame retardancy between Cu(+) and Cu(2+). After the optimized SCWO treatment, SCWO-treated PCBs significantly improved the flame retardancy and smoke suppression of PVC. Limiting oxygen index (LOI) and char yield (CY) increased with increasing SCWO-treated PCBs content in PVC, while smoke density rating (SDR) and maximum smoke density (MSD) decreased markedly. The mechanical properties of PVC samples were influenced in different degree by adding different content SCWO-treated PCBs. PMID:27179704

  14. Eco-friendly copper recovery process from waste printed circuit boards using Fe3+/Fe2+ redox system

    International Nuclear Information System (INIS)

    Highlights: • We developed an ecofriendly mediated electrochemical process for copper recovery. • The recovery of copper was achieved without mechanical pretreatment of the samples. • We identified the optimal flow rate for the leaching and electrowinning of copper. • The copper content of the obtained cathodic deposits was over 99.9%. - Abstract: The present study aimed at developing an original and environmentally friendly process for the recovery of copper from waste printed circuit boards (WPCBs) by chemical dissolution with Fe3+ combined with the simultaneous electrowinning of copper and oxidant regeneration. The recovery of copper was achieved in an original set-up consisting of a three chamber electrochemical reactor (ER) connected in series with a chemical reactor (CR) equipped with a perforated rotating drum. Several experiments were performed in order to identify the optimal flow rate for the dissolution of copper in the CR and to ensure the lowest energy consumption for copper electrodeposition in the ER. The optimal hydrodynamic conditions were provided at 400 mL/min, leading to the 75% dissolution of metals and to a low specific energy consumption of 1.59 kW h/kg Cu for the electrodeposition process. In most experiments, the copper content of the obtained cathodic deposits was over 99.9%

  15. Electrostatic separation for multi-size granule of crushed printed circuit board waste using two-roll separator

    International Nuclear Information System (INIS)

    The electrostatic separation is an effective method for recycle of crushed waste electrical and electronic equipment (WEEE). However, the robustness of the classical roll-type separator is vulnerable because of its sensitivity to variation of granule size. A new 'two-roll type corona-electrostatic separator' was built to overcome the limitation of the classical one considering the actual situation of the industrial application which always contains granule with different size. Multi-size granule of crushed printed circuit board (PCB) wastes was used for investigation and the results showed that the efficiency of the separation process was improved by using the new separator. Compared with the process (lower voltage) performed on the old separator, the metal products increased 34% while the middling products reduced 73%, respectively. Compared with the process (higher voltage) performed on the old separator, the metal products increased 22% while the middling products reduced 59%, respectively. In addition, the metal component of the middling products using new machine notably decreased, 33% (new machine) compared with 58% (lower voltage) and 66% (higher voltage). The efficiency of the separation process is enhanced compared with the classical one

  16. A new two-roll electrostatic separator for recycling of metals and nonmetals from waste printed circuit board

    International Nuclear Information System (INIS)

    The electrostatic separation is an effective method for recycling waste electrical and electronic equipment (WEEE). The efficiency of electrostatic separation processes depends on the ability of the separator. As a classical one, the roll-type corona-electrostatic separator has some advantages in recycling metals and plastics from waste printed circuit board (PCB). However, its industry application still faces some problems, such as: the further disposal of the middling products of the separation process; the balance of the production capacity and the good separation efficiency; the separation of the fine granular mixture and the stability of the separation process. A new 'two-roll-type corona-electrostatic separator' was built to overcome the limitation of the classical one. The experimental data were discussed and the results showed that the outcome of the separation process was improved by using the new separator. Compared with the classical machine, the mass of conductive products increases 8.9% (groups 2 and 3) and10.2% (group 4) while the mass of the middling products decreases 45% (groups 2 and 3) and 31.7% (group 4), respectively. The production capacity of the new machine increases, and the stability of the separation process is enhanced

  17. A new two-roll electrostatic separator for recycling of metals and nonmetals from waste printed circuit board.

    Science.gov (United States)

    Jiang, Wu; Jia, Li; Zhen-Ming, Xu

    2009-01-15

    The electrostatic separation is an effective method for recycling waste electrical and electronic equipment (WEEE). The efficiency of electrostatic separation processes depends on the ability of the separator. As a classical one, the roll-type corona-electrostatic separator has some advantages in recycling metals and plastics from waste printed circuit board (PCB). However, its industry application still faces some problems, such as: the further disposal of the middling products of the separation process; the balance of the production capacity and the good separation efficiency; the separation of the fine granular mixture and the stability of the separation process. A new "two-roll-type corona-electrostatic separator" was built to overcome the limitation of the classical one. The experimental data were discussed and the results showed that the outcome of the separation process was improved by using the new separator. Compared with the classical machine, the mass of conductive products increases 8.9% (groups 2 and 3) and10.2% (group 4) while the mass of the middling products decreases 45% (groups 2 and 3) and 31.7% (group 4), respectively. The production capacity of the new machine increases, and the stability of the separation process is enhanced. PMID:18554788

  18. Production and characterization of polypropylene composites filled with glass fibre recycled from pyrolysed waste printed circuit boards.

    Science.gov (United States)

    Li, Shenyong; Sun, Shuiyu; Liang, Haifeng; Zhong, Sheng; Yang, Fan

    2014-01-01

    Waste printed circuit boards (WPCBs) are composed of nearly 70% non-metals, which are generally recycled as low-value filling materials or even directly dumped in landfills. In this study, polypropylene (PP) composites reinforced by recycled pure glass fibres (RGF) from pyrolysed WPCBs were successfully produced. The manufacturing process, mechanical properties and thermal behaviour of the composites were investigated. The results showed that the appropriate addition of RGF in the composites can significantly improve the mechanical properties and thermal behaviour. When the added content of RGF was 30%, the maximum increment of tensile strength, impact strength, flexural strength and flexural modulus of the glass fibre (GF)/PP composites are 25.93%, 41.38%, 31.16% and 68.42%, respectively, and the vicat softening temperature could rise by 4.6°C. Furthermore, leaching of the GF/PP composites was also investigated. The GF/PP composites exhibited high performance and non-toxicity, offering a promising method to recycle RGF from pyrolysed WPCBs with high-value applications. PMID:25176309

  19. Determination of the potential gold electrowinning from an ammoniacal thiosulphate solution applied to recycling of printed circuit board scraps.

    Science.gov (United States)

    Kasper, Angela C; Carrillo Abad, Jordi; García Gabaldón, Montserrat; Veit, Hugo M; Pérez Herranz, Valentín

    2016-01-01

    The use of electrochemical techniques in the selective recovery of gold from a solution containing thiosulphate, ammonia, and copper, obtained from the leaching of printed circuit boards from mobile phones using ammoniacal thiosulphate, are shown in this work. First, cyclic voltammetry tests were performed to determine the potential of electrodeposition of gold and copper, and then, electrowinning tests at different potentials for checking the rates of recovery of these metals were performed. The results of the cyclic voltammetry show that copper deposition occurs at potentials more negative than -600 mV (Ag/AgCl), whereas the gold deposition can be performed at potentials more positives than -600 mV (Ag/AgCl). The results of electrowinning show that 99% of the gold present in solutions containing thiosulphate and copper can be selectively recovered in a potential range between -400 mV (vs Ag/AgCl) and -500 mV (vs Ag/AgCl). Furthermore, 99% of copper can be recovered in potentials more negative than -700 mV (vs Ag/AgCl). PMID:26437680

  20. Occurrences and inventories of heavy metals and brominated flame retardants in wastes from printed circuit board production.

    Science.gov (United States)

    Zhou, Xiaoyu; Guo, Jie; Zhang, Wei; Zhou, Peng; Deng, Jingjing; Lin, Kuangfei

    2014-09-01

    Pollutants including heavy metals and brominated flame retardant were detected in 10 types of production wastes from a typical printed circuit board manufacturing plant, and their inventories were estimated. Rinsing water from etching process had the highest concentrations of copper (665.51 mg/L), lead (1.02 mg/L), nickel (3.60 mg/L), chromium (0.97 mg/L), and tin (1.79 mg/L). Powdered solid waste (SW) from the cut lamination process contained the highest tetrabromobisphenol-A (TBBPA) levels (49.86 mg/kg). Polybrominated diphenyl ethers (PBDEs) were absent in this plant, in agreement with the international regulations of PBDE phase out. The pollutant inventories in the wastes exhibited in the order of copper > > zinc > tin ≈ nickel > lead > chromium > > TBBPA. The potential environmental impact of pollutants in SW during production and disposal were further investigated. A high partitioning of pollutant concentration between the total suspended particle and SW (-0.10 leaching procedure, drilling powder with the smallest particle diameter still showed high leachabilities of lead and tin which may lead to a negative environmental impact during disposal. PMID:24777328

  1. An advanced study on the hydrometallurgical processing of waste computer printed circuit boards to extract their valuable content of metals.

    Science.gov (United States)

    Birloaga, Ionela; Coman, Vasile; Kopacek, Bernd; Vegliò, Francesco

    2014-12-01

    This study refers to two chemical leaching systems for the base and precious metals extraction from waste printed circuit boards (WPCBs); sulfuric acid with hydrogen peroxide have been used for the first group of metals, meantime thiourea with the ferric ion in sulfuric acid medium were employed for the second one. The cementation process with zinc, copper and iron metal powders was attempted for solutions purification. The effects of hydrogen peroxide volume in rapport with sulfuric acid concentration and temperature were evaluated for oxidative leaching process. 2M H2SO4 (98% w/v), 5% H2O2, 25 °C, 1/10 S/L ratio and 200 rpm were founded as optimal conditions for Cu extraction. Thiourea acid leaching process, performed on the solid filtrate obtained after three oxidative leaching steps, was carried out with 20 g/L of CS(NH2)2, 6g/L of Fe(3+), 0.5M H2SO4, The cross-leaching method was applied by reusing of thiourea liquid suspension and immersing 5 g/L of this reagent for each other experiment material of leaching. This procedure has lead to the doubling and, respectively, tripling, of gold and silver concentrations into solution. These results reveal a very efficient, promising and environmental friendly method for WPCBs processing. PMID:25242605

  2. Preparation of hierarchical porous carbon from waste printed circuit boards for high performance electric double-layer capacitors

    Science.gov (United States)

    Du, Xuan; Wang, Li; Zhao, Wei; Wang, Yi; Qi, Tao; Li, Chang Ming

    2016-08-01

    Renewable clean energy and resources recycling have become inevitable choices to solve worldwide energy shortages and environmental pollution problems. It is a great challenge to recycle tons of waste printed circuit boards (PCB) produced every year for clean environment while creating values. In this work, low cost, high quality activated carbons (ACs) were synthesized from non-metallic fractions (NMF) of waste PCB to offer a great potential for applications of electrochemical double-layer capacitors (EDLCs). After recovering metal from waste PCB, hierarchical porous carbons were produced from NMF by carbonization and activation processes. The experimental results exhibit that some pores were formed after carbonization due to the escape of impurity atoms introduced by additives in NMF. Then the pore structure was further tailored by adjusting the activation parameters. Roles of micropores and non-micropores in charge storage were investigated when the hierarchical porous carbons were applied as electrode of EDLCs. The highest specific capacitance of 210 F g-1 (at 50 mA g-1) and excellent rate capability were achieved when the ACs possessing a proper micropores/non-micropores ratio. This work not only provides a promising method to recycle PCB, but also investigates the structure tailoring arts for a rational hierarchical porous structure in energy storage/conversion.

  3. A long-term static immersion experiment on the leaching behavior of heavy metals from waste printed circuit boards.

    Science.gov (United States)

    Zhao, Guo-Hua; Luo, Xing-Zhang; Chen, Gui; Zhao, Yong-Jun

    2014-08-01

    Printed circuit boards (PCBs) are the main components of electrical and electronic equipment (EEE). Waste PCBs contain several kinds of heavy metals, including Cu, Pb and Zn. We characterize the leaching of heavy metals (Cu, Pb, Zn and Ni) from waste PCBs in a pH range of 3.0 to 5.6 using a novel approach based on batch pH-static leaching experiments in this work. The results indicate that the leaching behavior of Cu, Pb, Zn and Ni is strongly dependent on pH. Leaching behavior also varies with different pH values and leaching times. The maximum concentrations of Cu, Pb, Zn and Ni in leachate from waste PCBs were 335.00, 17.57, 2.40 and 2.33 mg L(-1), respectively. The highest Pb, Ni, and Cu concentrations leached significantly exceeded the European Union waste-acceptance limit values with respect to inert waste landfills. The leaching of metals follows the shrinking core model with surface reaction control. PMID:24934650

  4. Leaching behavior of copper from waste printed circuit boards with Brønsted acidic ionic liquid.

    Science.gov (United States)

    Huang, Jinxiu; Chen, Mengjun; Chen, Haiyan; Chen, Shu; Sun, Quan

    2014-02-01

    In this work, a Brønsted acidic ionic liquid, 1-butyl-3-methyl-imidazolium hydrogen sulfate ([bmim]HSO4), was used to leach copper from waste printed circuit boards (WPCBs, mounted with electronic components) for the first time, and the leaching behavior of copper was discussed in detail. The results showed that after the pre-treatment, the metal distributions were different with the particle size: Cu, Zn and Al increased with the increasing particle size; while Ni, Sn and Pb were in the contrary. And the particle size has significant influence on copper leaching rate. Copper leaching rate was higher than 99%, almost 100%, when 1g WPCBs powder was leached under the optimum conditions: particle size of 0.1-0.25 mm, 25 mL 80% (v/v) ionic liquid, 10 mL 30% hydrogen peroxide, solid/liquid ratio of 1/25, 70°C and 2h. Copper leaching by [bmim]HSO4 can be modeled with the shrinking core model, controlled by diffusion through a solid product layer, and the kinetic apparent activation energy has been calculated to be 25.36 kJ/mol. PMID:24246577

  5. Optimization of low-temperature alkaline smelting process of crushed metal enrichment originated from waste printed circuit boards

    Institute of Scientific and Technical Information of China (English)

    GUO Xue-yi; LIU Jing-xin

    2015-01-01

    A novel low-temperature alkaline smelting process is proposed to convert and separate amphoteric metals in crushed metal enrichment originated from waste printed circuit boards. The central composite design was used to optimize the operating parameters, in which mass ratio of NaOH-to-CME, smelting temperature and smelting time were chosen as the variables, and the conversions of amphoteric metals tin, lead, aluminum and zinc were response parameters. Second-order polynomial models of high significance and 3D response surface plots were constructed to show the relationship between the responses and the variables. Optimum area of 80%-85% Pb conversion and over 95% Sn conversion was obtained by the overlaid contours at mass ratio of NaOH-to-CME of 4.5-5.0, smelting temperature of 653-723 K, smelting time of 90-120 min. The models were validated experimentally in the optimum area, and the results demonstrate that these models are reliable and accurate in predicting the smelting process.

  6. Performance of the heavy fraction of pyrolysis oil derived from waste printed circuit boards in modifying asphalt.

    Science.gov (United States)

    Yang, Fan; Sun, Shuiyu; Zhong, Sheng; Li, Shenyong; Wang, Yi; Wu, Jiaqi

    2013-09-15

    The focus of this research was the development of efficient and affordable asphalt modifiers. Pyrolysis oil was produced as a byproduct from the pyrolysis of waste printed circuit boards (WPCBs). The high boiling point fraction was separated from the pyrolysis oil through distillation and is referred to as the heavy fraction of pyrolysis oil (HFPO). The HFPO was tested as an asphalt modifier. Three asphalt modifiers were tested: HFPO; styrene-butadiene rubber (SBR); and HFPO + SBR (1:1). The physical properties and road performance of the three modified asphalts were measured and evaluated. The results have shown that when the amount of modifier was less than 10%, the HFPO modified asphalt had the highest softening point of the three. The dynamic stability (DS) and water resistance of the asphalt mixture with the HFPO modified asphalt was 10,161 cycles/mm and 87.2%, respectively. The DS was much larger than for the HFPO + SBR and SBR modified asphalt mixtures. These results indicate that using HFPO as an asphalt modifier has significant benefits not only for road engineering but also for resource recycling. PMID:23644664

  7. Recovery of copper and lead from waste printed circuit boards by supercritical water oxidation combined with electrokinetic process

    International Nuclear Information System (INIS)

    An effective and benign process for copper and lead recovery from waste printed circuit boards (PCBs) was developed. In the process, the PCBs was pre-treated in supercritical water, then subjected to electrokinetic (EK) process. Experimental results showed that supercritical water oxidation (SCWO) process was strong enough to decompose the organic compounds of PCBs, and XRD spectra indicated that copper and lead were oxidized into CuO, Cu2O and β-PbO2 in the process. The optimum SCWO treatment conditions were 60 min, 713 K, 30 MPa, and EK treatment time, constant current density were 11 h, 20 mA cm-2, respectively. The recovery percentages of copper and lead under optimum SCWO + EK treatment conditions were around 84.2% and 89.4%, respectively. In the optimized EK treatment, 74% of Cu was recovered as a deposit on the cathode with a purity of 97.6%, while Pb was recovered as concentrated solutions in either anode (23.1%) or cathode (66.3%) compartments but little was deposited on the electrodes. It is believed that the process is effective and practical for Cu and Pb recovery from waste electric and electronic equipments.

  8. Inhibition of polybrominated dibenzo-p-dioxin and dibenzofuran formation from the pyrolysis of printed circuit boards.

    Science.gov (United States)

    Lai, Yi-Chieh; Lee, Wen-Jhy; Li, Hsing-Wang; Wang, Lin-Chi; Chang-Chien, Guo-Ping

    2007-02-01

    Waste printed circuit boards containing brominated flame retardants were pyrolyzed in a high-temperature melting system to observe the formation behaviors of polybrominated dibenzo-p-dioxins (PBDDs) and dibenzofurans (PBDFs). In this study, the results showed that the formation of PBDD/ Fs during pyrolysis can be destroyed under controlled primary combustion conditions. There were two significant factors that influenced the extent of PBDD/F formation. The first factor was temperature. The results showed that, both the total PBDD/F content in the bottom ash and the total PBDD/F emission factor from the flue gas decrease by approximately 50% with an increase of the pyrolysis temperature from 850 to 1200 degrees C. The second factor was the addition of CaO. The possible mechanism involves the reaction between CaO and HBr to form the solid-phase product CaBr2. Thus, the addition of CaO is effective in adsorbing HBr and results in the inhibition of PBDD/F synthesis by more than 90% and further prevents the acid gases (HCl and HBr) that corrode the equipment. In conclusion, due to the persistence and toxicity of PBDD/Fs, a combined regulation for controlling both PCDD/Fs and PBDD/Fs is of great importance for environmental protection issues. PMID:17328209

  9. Investigation of multilayer printed circuit board (PCB) film warpage using viscoelastic properties measured by a vibration test

    Science.gov (United States)

    Joo, Sung-Jun; Park, Buhm; Kim, Do-Hyoung; Kwak, Dong-Ok; Song, In-Sang; Park, Junhong; Kim, Hak-Sung

    2015-03-01

    Woven glass fabric/BT (bismaleimide triazine) composite laminate (BT core), copper (Cu), and photoimageable solder resist (PSR) are the most widely used materials for semiconductors in electronic devices. Among these materials, BT core and PSR contain polymeric materials that exhibit viscoelastic behavior. For this reason, these materials are considered to have time- and temperature-dependent moduli during warpage analysis. However, the thin geometry of multilayer printed circuit board (PCB) film makes it difficult to identify viscoelastic characteristics. In this work, a vibration test method was proposed for measuring the viscoelastic properties of a multilayer PCB film at different temperatures. The beam-shaped specimens, composed of a BT core, Cu laminated on a BT core, and PSR and Cu laminated on a BT core, were used in the vibration test. The frequency-dependent variation of the complex bending stiffness was determined using a transfer function method. The storage modulus (E‧) of the BT core, Cu, and PSR as a function of temperature and frequency were obtained, and their temperature-dependent variation was identified. The obtained properties were fitted using a viscoelastic model for the BT core and the PSR, and a linear elastic model for the Cu. Warpage of a line pattern specimen due to temperature variation was measured using a shadow Moiré analysis and compared to predictions using a finite element model. The results provide information on the mechanism of warpage, especially warpage due to temperature-dependent variation in viscoelastic properties.

  10. An Overview of Surface Finishes and Their Role in Printed Circuit Board Solderability and Solder Joint Performance

    Energy Technology Data Exchange (ETDEWEB)

    Vianco, P.T.

    1998-10-15

    A overview has been presented on the topic of alternative surface finishes for package I/Os and circuit board features. Aspects of processability and solder joint reliability were described for the following coatings: baseline hot-dipped, plated, and plated-and-fused 100Sn and Sn-Pb coatings; Ni/Au; Pd, Ni/Pd, and Ni/Pd/Au finishes; and the recently marketed immersion Ag coatings. The Ni/Au coatings appear to provide the all-around best option in terms of solderability protection and wire bondability. Nickel/Pal ftishes offer a slightly reduced level of performance in these areas that is most likely due to variable Pd surface conditions. It is necessmy to minimize dissolved Au or Pd contents in the solder material to prevent solder joint embrittlement. Ancillary aspects that included thickness measurement techniques; the importance of finish compatibility with conformal coatings and conductive adhesives; and the need for alternative finishes for the processing of non-Pb bearing solders were discussed.

  11. Investigation of measuring hazardous substances in printed circuit boards using the micro-focus X-ray fluorescence screening

    CERN Document Server

    Fu, M L; Fakhrtdinov, R; Grigoriev, M; Quan, B S; Le, Z C; Roshchupkin, D

    2014-01-01

    Printed circuit boards (PCBs) are widely used in most electrical and electronic equipments or products. Hazardous substances such as Pb, Hg, Cd, etc, can be present in high concentrations in PCBs and the degradation and release of these substances poses a huge threat to humans and the environment. To investigation the chemical composition of PCBs in domestic market of China, a practical micro-focus X-ray fluorescence system is setup to make the elements analysis, especially for detecting hazardous substances. Collimator is adopted to focus the X-ray emitted from X-ray tube. BRUKER X-ray detector with proportional counter is used to detect the emitted fluorescence from the PCB samples. Both single layer PCB samples and double layers PCB samples made of epoxy glass fiber are purchased from the domestic market of China. Besides, a MC55 wireless communication module made by SIEMENS in Germany is used as the reference material. Experimental results from the fluorescence spectrums of the testing points of PCB sampl...

  12. Processamento de placas de circuito impresso de equipamentos eletroeletrônicos de pequeno porte Processing of printed circuit boards of small electrical and electronic devices

    Directory of Open Access Journals (Sweden)

    Sérgio de Souza Henrique Júnior

    2013-01-01

    Full Text Available A hydrometallurgical process applicable to printed circuit boards of small electrical and electronic devices was developed. This involved three leaching steps (60 ºC, 2 h: 6 mol L-1 NaOH, 6 mol L-1 HCl and aqua regia. NaOH removed the resin and flame retardant that covered the circuit boards. HCl dissolved the most electropositive metals and a small amount of copper (~0.3 wt%. Aqua regia dissolved the noble metals. Silver precipitated as AgCl. Gold and platinum were quantitatively extracted with pure methyl-isobutylketone and Alamine 336 (10 % vol. in kerosene, respectively. Slow evaporation of the raffinate crystallized CuCl2.4H2O (89% yield.

  13. Hydroxylated PBDEs and brominated phenolic compounds in particulate matters emitted during recycling of waste printed circuit boards in a typical e-waste workshop of South China

    International Nuclear Information System (INIS)

    The hydroxylated PBDEs (OH-PBDEs) and brominated phenolic compounds in aerosol samples from a printed circuit boards recycling workshop were characterized. The results show that OH-PBDEs, which are naturally occurring compounds or metabolism of PBDEs, could also be emitted from the e-waste recycling. Five OH-PBDEs, several unidentified mono-OH-PBDE and di-OH-PBDE congeners were detected. The concentration of ∑OH-PBDEs was 1.74–4.22 ng m−3 (average of 2.66 ng m−3), with 6-OH-BDE-47 (0.329 ng m−3) as the most abundant identified congener. The total concentration of di- to tri-brominated phenols (BPs) was 18.8–32.0 ng m−3 (average of 26.3 ng m−3) with 2,4,6-triBP as the most abundant congener. These findings suggest that the recycling of printed circuit boards represent a strong source of OH-PBDEs and BPs to the atmosphere. Additionally, some phenolic compounds including brominated bisphenol A, hydroxylated polybrominated biphenyl species and etc. were also identified. -- Highlights: ► OH-PBDEs and BPs were abundant in the PM from printed circuit boards recycling. ► The patterns of OH-PBDEs and BPs were different from that in biotic environment. ► 6-OH-BDE-47 was the most abundant identified OH-PBDE congener. ► 2,4,6-triBP was the most abundant BP congener. ► Possible formation mechanisms of OH-PBDEs and BPs were discussed. -- Recycling of waste printed circuit boards might represent a strong source of OH-PBDEs, BPs and other phenolic compounds

  14. Copper extraction from coarsely ground printed circuit boards using moderate thermophilic bacteria in a rotating-drum reactor

    International Nuclear Information System (INIS)

    Highlights: • Copper bioleaching from PCB (20 mm) by moderate thermophiles was demonstrated. • Larger PCB sheets enable a cost reduction due to the elimination of fine grinding. • Crushing generated cracks in PCB increasing the copper extraction. • A pre-treatment step was necessary to remove the lacquer coating. • High copper extractions (85%) were possible with pulp density of up to 25.0 g/L. - Abstract: The current work reports on a new approach for copper bioleaching from Printed Circuit Board (PCB) by moderate thermophiles in a rotating-drum reactor. Initially leaching of PCB was carried out in shake flasks to assess the effects of particle size (−208 μm + 147 μm), ferrous iron concentration (1.25–10.0 g/L) and pH (1.5–2.5) on copper leaching using mesophile and moderate thermophile microorganisms. Only at a relatively low solid content (10.0 g/L) complete copper extraction was achieved from the particle size investigated. Conversely, high copper extractions were possible from coarse-ground PCB (20 mm-long) working with increased solids concentration (up to 25.0 g/L). Because there was as the faster leaching kinetics at 50 °C Sulfobacillus thermosulfidooxidans was selected for experiments in a rotating-drum reactor with the coarser-sized PCB sheets. Under optimal conditions, copper extraction reached 85%, in 8 days and microscopic observations by SEM–EDS of the on non-leached and leached material suggested that metal dissolution from the internal layers was restricted by the fact that metal surface was not entirely available and accessible for the solution in the case of the 20 mm-size sheets

  15. Development of two-step process for enhanced biorecovery of Cu-Zn-Ni from computer printed circuit boards.

    Science.gov (United States)

    Shah, Monal B; Tipre, Devayani R; Purohit, Mamta S; Dave, Shailesh R

    2015-08-01

    Metal pollution due to the huge electronic waste (E-waste) accumulation is widespread across the globe. Extraction of copper, zinc and nickel from computer printed circuit boards (c-PCB) with a two-step bleaching process using ferric sulphate generated by Leptospirillum ferriphilum dominated consortium and the factors influencing the process were investigated in the present study. The studied factors with 10 g/L pulp density showed that pH 2.0 was optimum which resulted in 87.50-97.80% Cu-Zn-Ni extraction. Pre-treatment of PCB powder with acidified distilled water and NaCl solution showed 3.80-7.98% increase in metal extraction corresponding to 94.08% Cu, 99.80% Zn and 97.99% Ni extraction. Particle size of 75 μm for Cu and Zn while 1680 μm for Ni showed 2-folds increase in metal extraction, giving 97.35-99.80% Cu-Zn-Ni extraction in 2-6 days of reaction time. Whereas; 2.76-3.12 folds increase in Cu and Zn extraction was observed with the addition of 0.1% chelating agents. When the studies were carried out with high pulp density, ferric iron concentration of 16.57 g/L was found to be optimum for metal extraction from 75 g/L c-PCB and c-PCB addition in multiple installments resulted in 8.81-26.35% increase in metal extraction compared to single addition. The studied factors can be implemented for the scale-up aimed at faster recovery of multimetals from E-waste and thereby providing a secondary source of metal in an eco-friendly manner. PMID:25636979

  16. Copper extraction from coarsely ground printed circuit boards using moderate thermophilic bacteria in a rotating-drum reactor

    Energy Technology Data Exchange (ETDEWEB)

    Rodrigues, Michael L.M., E-mail: mitchel.marques@yahoo.com.br [Bio& Hydrometallurgy Laboratory, Department of Metallurgical and Materials Engineering, Universidade Federal de Ouro Preto, Campus Morro do Cruzeiro, Ouro Preto, MG 35400-000 (Brazil); Leão, Versiane A., E-mail: versiane@demet.em.ufop.br [Bio& Hydrometallurgy Laboratory, Department of Metallurgical and Materials Engineering, Universidade Federal de Ouro Preto, Campus Morro do Cruzeiro, Ouro Preto, MG 35400-000 (Brazil); Gomes, Otavio [Centre for Mineral Technology – CETEM, Av Pedro Calmon, 900, 21941-908 Rio de Janeiro (Brazil); Lambert, Fanny; Bastin, David; Gaydardzhiev, Stoyan [Mineral Processing and Recycling, University of Liege, SartTilman, 4000 Liege (Belgium)

    2015-07-15

    Highlights: • Copper bioleaching from PCB (20 mm) by moderate thermophiles was demonstrated. • Larger PCB sheets enable a cost reduction due to the elimination of fine grinding. • Crushing generated cracks in PCB increasing the copper extraction. • A pre-treatment step was necessary to remove the lacquer coating. • High copper extractions (85%) were possible with pulp density of up to 25.0 g/L. - Abstract: The current work reports on a new approach for copper bioleaching from Printed Circuit Board (PCB) by moderate thermophiles in a rotating-drum reactor. Initially leaching of PCB was carried out in shake flasks to assess the effects of particle size (−208 μm + 147 μm), ferrous iron concentration (1.25–10.0 g/L) and pH (1.5–2.5) on copper leaching using mesophile and moderate thermophile microorganisms. Only at a relatively low solid content (10.0 g/L) complete copper extraction was achieved from the particle size investigated. Conversely, high copper extractions were possible from coarse-ground PCB (20 mm-long) working with increased solids concentration (up to 25.0 g/L). Because there was as the faster leaching kinetics at 50 °C Sulfobacillus thermosulfidooxidans was selected for experiments in a rotating-drum reactor with the coarser-sized PCB sheets. Under optimal conditions, copper extraction reached 85%, in 8 days and microscopic observations by SEM–EDS of the on non-leached and leached material suggested that metal dissolution from the internal layers was restricted by the fact that metal surface was not entirely available and accessible for the solution in the case of the 20 mm-size sheets.

  17. Volatile organic compounds and metal leaching from composite products made from fiberglass-resin portion of printed circuit board waste.

    Science.gov (United States)

    Guo, Jie; Jiang, Ying; Hu, Xiaofang; Xu, Zhenming

    2012-01-17

    This study focused on the volatile organic compounds (VOCs) and metal leaching from three kinds of composite products made from fiberglass-resin portion (FRP) of crushed printed circuit board (PCB) waste, including phenolic molding compound (PMC), wood plastic composite (WPC), and nonmetallic plate (NMP). Released VOCs from the composite products were quantified by air sampling on adsorbent followed by thermal desorption and GC-MS analysis. The results showed that VOCs emitted from composite products originated from the added organic components during manufacturing process. Phenol in PMC panels came primarily from phenolic resin, and the airborne concentration of phenol emitted from PMC product was 59.4 ± 6.1 μg/m(3), which was lower than odor threshold of 100% response for phenol (180 μg/m(3)). VOCs from WPC product mainly originated from wood flour, e.g., benzaldehyde, octanal, and d-limonene were emitted in relatively low concentrations. For VOCs emitted from NMP product, the airborne concentration of styrene was the highest (633 ± 67 μg/m(3)). Leaching characteristics of metal ions from composite products were tested using acetic acid buffer solution and sulphuric acid and nitric acid solution. Then the metal concentrations in the leachates were tested by ICP-AES. The results showed that only the concentration of Cu (average = 893 mg/L; limit = 100 mg/L) in the leachate solution of the FRP using acetic acid buffer solution exceeded the standard limit. However, concentrations of other metal ions (Pb, Cd, Cr, Ba, and Ni) were within the standard limit. All the results indicated that the FRP in composite products was not a major concern in terms of environmental assessment based upon VOCs tests and leaching characteristics. PMID:22142243

  18. Leaching behavior of copper from waste printed circuit boards with Brønsted acidic ionic liquid

    International Nuclear Information System (INIS)

    Highlights: • A Brønsted acidic ILs was used to leach Cu from WPCBs for the first time. • The particle size of WPCBs has significant influence on Cu leaching rate. • Cu leaching rate was higher than 99% under the optimum leaching conditions. • The leaching process can be modeled with shrinking core model, and the Ea was 25.36 kJ/mol. - Abstract: In this work, a Brønsted acidic ionic liquid, 1-butyl-3-methyl-imidazolium hydrogen sulfate ([bmim]HSO4), was used to leach copper from waste printed circuit boards (WPCBs, mounted with electronic components) for the first time, and the leaching behavior of copper was discussed in detail. The results showed that after the pre-treatment, the metal distributions were different with the particle size: Cu, Zn and Al increased with the increasing particle size; while Ni, Sn and Pb were in the contrary. And the particle size has significant influence on copper leaching rate. Copper leaching rate was higher than 99%, almost 100%, when 1 g WPCBs powder was leached under the optimum conditions: particle size of 0.1–0.25 mm, 25 mL 80% (v/v) ionic liquid, 10 mL 30% hydrogen peroxide, solid/liquid ratio of 1/25, 70 °C and 2 h. Copper leaching by [bmim]HSO4 can be modeled with the shrinking core model, controlled by diffusion through a solid product layer, and the kinetic apparent activation energy has been calculated to be 25.36 kJ/mol

  19. An assessment of alternatives for replacing Freon 113 in bench type electrical circuit board cleaning at Fermi National Accelerator Laboratory

    Energy Technology Data Exchange (ETDEWEB)

    Isakson, K.; Vessell, A.L.

    1994-07-01

    Fermilab is presently phasing out all solvents containing Freon-113 (CFC-113) as part of the continuing Waste Minimization Program. These solvents are used primarily in cleaning the flux off of electronic circuit boards after soldering, specifically in bench type work. Title VI of the Clean Air Act mandates a production phase-out for ozone depleting substances, like CFC-113, by the year 2000. Our study addresses this issue by evaluating and choosing alternative non-CFC solvents to replace the CFC-1 13 solvents at Fermilab. Several potential non-CFC cleaning solvents were tested. The evaluation took place in three parts: controlled experimental evaluation, chemical composition evaluation, and employee performed evaluation. First, we performed a controlled nine-step procedure with the potential solvents where each was evaluated in categories such as cleaning effectiveness, odor, residue, type of output and drying time. Next, we listed the chemical composition of each solvent. We noted which solvents contained hydrochlorofluorocarbons because they are targeted for phase-out in the future and will be recognized as interim solutions only. Finally, after preliminary testing, five solvents were chosen as the best options. These solvents were sent to be tested by Fermilab employees who use such materials. Their opinions are valuable not only because they are knowledgeable in this field, but also because they will be using the solvents chosen to replace the CFC-113 solvents. The results favored two ``best alternatives``: Safezone Solvent Flux Remover by Miller-Stephenson and E-Series CFC Free Flux-Off 2000 by Chemtech. Another possible solution also pursued is the no-clean solder option. In our study, we were not able to thoroughly investigate the many types of no-clean solders because of time and financial constraints. The testing that was done, however, showed that no-clean solder was a viable alternative in many cases.

  20. Characterization and mechanical separation of metals from computer Printed Circuit Boards (PCBs) based on mineral processing methods.

    Science.gov (United States)

    Sarvar, Mojtaba; Salarirad, Mohammad Mehdi; Shabani, Mohammad Amin

    2015-11-01

    In this paper, a novel mechanical process is proposed for enriching metal content of computer Printed Circuit Boards (PCBs). The PCBs are crushed and divided into three different size fractions namely: -0.59, +0.59 to 1.68 and +1.68 mm. Wet jigging and froth flotation methods are selected for metal enrichment. The coarse size fraction (+1.68 mm) is processed by jigging. The plastic free product is grinded and screened. The oversized product is separated as the first concentrate. It was rich of metal because the grinding process was selective. The undersized product is processed by froth flotation. Based on the obtained results, the middle size fraction (+0.59 to 1.68 mm) and the small size fraction (-0.59 mm) are processed by wet jigging and froth flotation respectively. The wet jigging process is optimized by investigating the effect of pulsation frequency and water flow rate. The results of examining the effect of particle size, solid to liquid ratio, conditioning time and using apolar collector showed that collectorless flotation is a promising method for separating nonmetals of PCBs. 95.6%, 97.5% and 85% of metal content of coarse size, middle size and small size fraction are recovered. The grades of obtained concentrates were 63.3%, 92.5% and 75% respectively. The total recovery is calculated as 95.64% and the grade of the final concentrate was 71.26%. Determining the grade of copper and gold in the final product reveals that 4.95% of copper and 24.46% of gold are lost during the concentration. The major part of the lost gold is accumulated in froth flotation tail. PMID:26143534

  1. An assessment of alternatives for replacing Freon 113 in bench type electrical circuit board cleaning at Fermi National Accelerator Laboratory

    International Nuclear Information System (INIS)

    Fermilab is presently phasing out all solvents containing Freon-113 (CFC-113) as part of the continuing Waste Minimization Program. These solvents are used primarily in cleaning the flux off of electronic circuit boards after soldering, specifically in bench type work. Title VI of the Clean Air Act mandates a production phase-out for ozone depleting substances, like CFC-113, by the year 2000. Our study addresses this issue by evaluating and choosing alternative non-CFC solvents to replace the CFC-1 13 solvents at Fermilab. Several potential non-CFC cleaning solvents were tested. The evaluation took place in three parts: controlled experimental evaluation, chemical composition evaluation, and employee performed evaluation. First, we performed a controlled nine-step procedure with the potential solvents where each was evaluated in categories such as cleaning effectiveness, odor, residue, type of output and drying time. Next, we listed the chemical composition of each solvent. We noted which solvents contained hydrochlorofluorocarbons because they are targeted for phase-out in the future and will be recognized as interim solutions only. Finally, after preliminary testing, five solvents were chosen as the best options. These solvents were sent to be tested by Fermilab employees who use such materials. Their opinions are valuable not only because they are knowledgeable in this field, but also because they will be using the solvents chosen to replace the CFC-113 solvents. The results favored two ''best alternatives'': Safezone Solvent Flux Remover by Miller-Stephenson and E-Series CFC Free Flux-Off 2000 by Chemtech. Another possible solution also pursued is the no-clean solder option. In our study, we were not able to thoroughly investigate the many types of no-clean solders because of time and financial constraints. The testing that was done, however, showed that no-clean solder was a viable alternative in many cases

  2. Assembly and Thermal Hydraulic Test of a Stainless Steel Sodium-Potassium Circuit

    Science.gov (United States)

    Garber, A.; Godfroy, T.; Webster, K.

    2007-01-01

    Early Flight Fission Test Facilities (EFF-TF) team has been tasked by the NASA Marshall Space Flight Center Nuclear Systems Office to design, fabricate, and test an actively pumped alkali metal flow circuit. The system was originally built for use with lithium, but due to a shift in focus, it was redesigned for use with a eutectic mixture of sodium potassium (NaK). Basic circuit components include: reactor segment, NaK to gas heat exchanger, electromagnetic (EM) liquid metal pump, load/drain reservoir, expansion reservoir, instrumentation, and a spill reservoir. A 37-pin partial-array core (pin and flow path dimensions are the same as those in a full design) was selected for fabrication and test. This paper summarizes the first fill and checkout testing of the Stainless Steel NaK-Cooled Circuit (SNaKC).

  3. A Chiroptical Logic Circuit Based on Self-Assembled Soft Materials Containing Amphiphilic Spiropyran.

    Science.gov (United States)

    Liu, Changxia; Yang, Dong; Jin, Qingxian; Zhang, Li; Liu, Minghua

    2016-02-01

    A chiral logic circuit is proposed based on the multiple chiroptical responsiveness of a supramolecular gel material. The gel is fabricated by mixing a chiral gelator and a spiropyran derivative. Chiral responsiveness including the chiral switch and the logic gate is realized through the combined chirality transfer, photochromism, and acidichromism of the system. PMID:26677055

  4. Setup time reduction for electronics assembly: Combining simple (SMED) and IT-based methods

    OpenAIRE

    Trovinger, Sheri Coble; Bohn, Roger E.

    2005-01-01

    As much as 50% of effective capacity can be lost to setups in printed circuit board assembly. Shigeo Shingo showed that radical reductions in setup times are possible in metal fabrication using an approach he called "Single Minute Exchange of Dies" (SMED). We applied SMED to setups of high speed circuit board assembly tools. Its key concepts were valid in this very different industry, but while SMED typically emphasizes process simplification, we had to add modern information technology tools...

  5. Self-shielding flex-circuit drift tube, drift tube assembly and method of making

    Energy Technology Data Exchange (ETDEWEB)

    Jones, David Alexander

    2016-04-26

    The present disclosure is directed to an ion mobility drift tube fabricated using flex-circuit technology in which every other drift electrode is on a different layer of the flex-circuit and each drift electrode partially overlaps the adjacent electrodes on the other layer. This results in a self-shielding effect where the drift electrodes themselves shield the interior of the drift tube from unwanted electro-magnetic noise. In addition, this drift tube can be manufactured with an integral flex-heater for temperature control. This design will significantly improve the noise immunity, size, weight, and power requirements of hand-held ion mobility systems such as those used for explosive detection.

  6. Stainless Steel NaK-Cooled Circuit (SNaKC) Fabrication and Assembly

    Science.gov (United States)

    Godfroy, Thomas J.

    2007-01-01

    An actively pumped Stainless Steel NaK Circuit (SNaKC) has been designed and fabricated by the Early Flight Fission Test Facility (EFF-TF) team at NASA's Marshall Space Flight Center. This circuit uses the eutectic mixture of sodium and potassium (NaK) as the working fluid building upon the experience and accomplishments of the SNAP reactor program from the late 1960's The SNaKC enables valuable experience and liquid metal test capability to be gained toward the goal of designing and building an affordable surface power reactor. The basic circuit components include a simulated reactor core a NaK to gas heat exchanger, an electromagnetic (EM) liquid metal pump, a liquid metal flow meter, an expansion reservoir and a drain/fill reservoir To maintain an oxygen free environment in the presence of NaK, an argon system is utilized. A helium and nitrogen system are utilized for core, pump, and heat exchanger operation. An additional rest section is available to enable special component testing m an elevated temperature actively pumped liquid metal environment. This paper summarizes the physical build of the SNaKC the gas and pressurization systems, vacuum systems, as well as instrumentation and control methods.

  7. Simulation of electronic circuit sensitivity towards humidity using electrochemical data on water layer

    DEFF Research Database (Denmark)

    Joshy, Salil; Verdingovas, Vadimas; Jellesen, Morten Stendahl;

    2015-01-01

    the effect on circuit and PCBA (printed circuit board assembly) layout design. This paper elucidates a methodology for analyzing the sensitivity of an electronic circuit based on parasitic circuit analysis using data on electrical property of the water layer formed under humid as well as contaminated......Climatic conditions like temperature and humidity have direct influence on the operation of electronic circuits. The effects of temperature on the operation of electronic circuits have been widely investigated, while the effect of humidity and solder flux residues are not well understood including...

  8. 废弃电路板回收技术与方法研究进展%Research Development of Printed Circuit Board Recycling Technologies and Methods

    Institute of Scientific and Technical Information of China (English)

    唐德文; 邹树梁; 刘衣昌; 刘益强

    2014-01-01

    With view to the current situation of waste printed circuit board( PCB) disposi-tion in China,waste printed circuit boards will cause serious environmental pollution,and the use of waste printed circuit boards can be an enormous economic value. This paper in-troduced the great need and importance of PCB recovery and recycling,the main technolo-gies and equipments including mechanical separation,chemical,biological hydrometallurgi-cal technology,supercritical fluid technology. And for sustainable development,the author came up with a prospect on the further studies in this field.%随着电子制造业飞速发展,废弃电路板急剧增加,如何有效处理废弃电路板并提高它的利用率已成为大家所关注的热点问题。废弃电子线路板如果处理不当将会对环境造成严重的污染,综合利用好废弃电路板又可产生巨大的经济价值。本文阐述我国进行废弃电子线路板回收和处理的重要性和紧迫性,在此基础上,分别对废弃电路板机械处理法、化学法、生物湿法冶金技术、超临界流体技术等回收与处理技术与方法的研究现状进行了综述,并对其研究重点和发展趋势做出展望。

  9. Identification at the source of the primary circuit pollution fuel assembly: sipping system

    International Nuclear Information System (INIS)

    During operation of a PWR nuclear power plant, the radioactivity of the primary coolant is monitored. An increase of the levels of specific radio isotopes such as I 131, Xe 133, Kr 85, may indicate the appearance of a leaking fuel assembly. According to the importance of the level reached during the reactor cycle, it may or not be decided to discard the source of the primary coolant pollution. The decision is based on the criteria from the country regulatory body itself based on both experimental evidence and also efficiency and dimensioning of the waste station operation. At this point, it is necessary to have an instrument for identification of the leaking fuel assembly and even better to have an instrument to measure or characterize the importance of this leaking feature. Two sipping systems will be utilized successively: the online sipping system in the reactor building, and the sipping system located in the fuel building

  10. A dishwasher for circuits

    CERN Multimedia

    Rosaria Marraffino

    2014-01-01

    You have always been told that electronic devices fear water. However, at the Surface Mount Devices (SMD) Workshop here at CERN all the electronic assemblies are cleaned with a machine that looks like a… dishwasher.   The circuit dishwasher. Credit: Clara Nellist.  If you think the image above shows a dishwasher, you wouldn’t be completely wrong. Apart from the fact that the whole pumping system and the case itself are made entirely from stainless steel and chemical resistant materials, and the fact that it washes electrical boards instead of dishes… it works exactly like a dishwasher. It’s a professional machine (mainly used in the pharmaceutical industry) designed to clean everything that can be washed with a water-based chemical soap. This type of treatment increases the lifetime of the electronic boards and therefore the LHC's reliability by preventing corrosion problems in the severe radiation and ozone environment of the LHC tunn...

  11. The Performance of Calcium Silicate Board Partition Fireproof Drywall Assembly with Junction Box under Fire

    OpenAIRE

    Yinuo Wang; Ying-Ji Chuang; Ching-Yuan Lin

    2015-01-01

    This study uses a metal stud partition fireproof drywall measuring 83 mm in thickness as a test specimen to explore the impact of an embedded junction box on the firefighting performance of the wall through one time of standard fire test on a 300 cm × 300 cm area and five times of standard fire test on a 120 cm × 120 cm area. The results show that the quality of calcium silicate board plays a big role in the fireproof effectiveness. The embedded junction box located on the backside of the f...

  12. Effects of PCB Pad Metal Finishes on the Cu-Pillar/Sn-Ag Micro Bump Joint Reliability of Chip-on-Board (COB) Assembly

    Science.gov (United States)

    Kim, Youngsoon; Lee, Seyong; Shin, Ji-won; Paik, Kyung-Wook

    2016-03-01

    While solder bumps have been used as the bump structure to form the interconnection during the last few decades, the continuing scaling down of devices has led to a change in the bump structure to Cu-pillar/Sn-Ag micro-bumps. Cu-pillar/Sn-Ag micro-bump interconnections differ from conventional solder bump interconnections in terms of their assembly processing and reliability. A thermo-compression bonding method with pre-applied b-stage non-conductive films has been adopted to form solder joints between Cu pillar/Sn-Ag micro bumps and printed circuit board vehicles, using various pad metal finishes. As a result, various interfacial inter-metallic compounds (IMCs) reactions and stress concentrations occur at the Cu pillar/Sn-Ag micro bumps joints. Therefore, it is necessary to investigate the influence of pad metal finishes on the structural reliability of fine pitch Cu pillar/Sn-Ag micro bumps flip chip packaging. In this study, four different pad surface finishes (Thin Ni ENEPIG, OSP, ENEPIG, ENIG) were evaluated in terms of their interconnection reliability by thermal cycle (T/C) test up to 2000 cycles at temperatures ranging from -55°C to 125°C and high-temperature storage test up to 1000 h at 150°C. The contact resistances of the Cu pillar/Sn-Ag micro bump showed significant differences after the T/C reliability test in the following order: thin Ni ENEPIG > OSP > ENEPIG where the thin Ni ENEPIG pad metal finish provided the best Cu pillar/Sn-Ag micro bump interconnection in terms of bump joint reliability. Various IMCs formed between the bump joint areas can account for the main failure mechanism.

  13. Effects of PCB Pad Metal Finishes on the Cu-Pillar/Sn-Ag Micro Bump Joint Reliability of Chip-on-Board (COB) Assembly

    Science.gov (United States)

    Kim, Youngsoon; Lee, Seyong; Shin, Ji-won; Paik, Kyung-Wook

    2016-06-01

    While solder bumps have been used as the bump structure to form the interconnection during the last few decades, the continuing scaling down of devices has led to a change in the bump structure to Cu-pillar/Sn-Ag micro-bumps. Cu-pillar/Sn-Ag micro-bump interconnections differ from conventional solder bump interconnections in terms of their assembly processing and reliability. A thermo-compression bonding method with pre-applied b-stage non-conductive films has been adopted to form solder joints between Cu pillar/Sn-Ag micro bumps and printed circuit board vehicles, using various pad metal finishes. As a result, various interfacial inter-metallic compounds (IMCs) reactions and stress concentrations occur at the Cu pillar/Sn-Ag micro bumps joints. Therefore, it is necessary to investigate the influence of pad metal finishes on the structural reliability of fine pitch Cu pillar/Sn-Ag micro bumps flip chip packaging. In this study, four different pad surface finishes (Thin Ni ENEPIG, OSP, ENEPIG, ENIG) were evaluated in terms of their interconnection reliability by thermal cycle (T/C) test up to 2000 cycles at temperatures ranging from -55°C to 125°C and high-temperature storage test up to 1000 h at 150°C. The contact resistances of the Cu pillar/Sn-Ag micro bump showed significant differences after the T/C reliability test in the following order: thin Ni ENEPIG > OSP > ENEPIG where the thin Ni ENEPIG pad metal finish provided the best Cu pillar/Sn-Ag micro bump interconnection in terms of bump joint reliability. Various IMCs formed between the bump joint areas can account for the main failure mechanism.

  14. Evaluating the Effects of Aging on Electronic Instrument and Control Circuit Boards and Components in Nuclear Power Plants

    International Nuclear Information System (INIS)

    The report describes potentially useful techniques for monitoring the aging of I and C boards. The techniques have been grouped into: periodic testing, reliability modeling, resistance measures, signal comparison, eternal measures, and internal measures, each representing distinct theoretical approaches to detection and evaluation

  15. Evaluating the Effects of Aging on Electronic Instrument and Control Circuit Boards and Components in Nuclear Power Plants

    Energy Technology Data Exchange (ETDEWEB)

    G. William Hannaman; C. Dan Wilkinson

    2005-05-15

    The report describes potentially useful techniques for monitoring the aging of I&C boards. The techniques have been grouped into: periodic testing, reliability modeling, resistance measures, signal comparison, eternal measures, and internal measures, each representing distinct theoretical approaches to detection and evaluation.

  16. Hardware Design of a General Digital Circuit Board Testing System%通用数字电路板测试系统硬件设计

    Institute of Scientific and Technical Information of China (English)

    周博; 刘文波

    2012-01-01

    The conventional method of using an oscilloscope, muhimeter, logic analyzer or other equipment for digital circuit board testing is complex, time consuming and not reliable. In this paper, the hardware design of a general digital circuit board testing system is introduced. Unlike traditional digital circuit board testing systems, this design has better performance and parameters: the testing frequency can reach 50 MHz and can be set as integer di- vision of 100 MHz; the testing level is compatible to -6 V - + 9 V and can be programmed by 100 mV ; there are up to 32 channels, each channel having 1 Mbit memory depth and 50 mA current drive capability with overload pro- tection, and can work either as input or output for three-state synchronously.%针对传统依靠人工使用示波器、万用表、逻辑分析仪等设备对数字电路板进行测试具有过程复杂、工作量大、可靠性低等缺点,介绍一套通用数字电路板测试系统的硬件设计方案。跟传统数字电路板测试系统相比,文中的设计性能参数更优,主要包括:测试频率最高50MHz并可调为100MHz的整数分频;测试电平兼容-6~+9V且可编程步长为100mV;测试通道32路,每通道可设为输入输出三态可选且同步工作,存储深度1Mbit,电流驱动能力达50mA并有过载保护。

  17. Component-Level Electronic-Assembly Repair (CLEAR) Spacecraft Circuit Diagnostics by Analog and Complex Signature Analysis

    Science.gov (United States)

    Oeftering, Richard C.; Wade, Raymond P.; Izadnegahdar, Alain

    2011-01-01

    The Component-Level Electronic-Assembly Repair (CLEAR) project at the NASA Glenn Research Center is aimed at developing technologies that will enable space-flight crews to perform in situ component-level repair of electronics on Moon and Mars outposts, where there is no existing infrastructure for logistics spares. These technologies must provide effective repair capabilities yet meet the payload and operational constraints of space facilities. Effective repair depends on a diagnostic capability that is versatile but easy to use by crew members that have limited training in electronics. CLEAR studied two techniques that involve extensive precharacterization of "known good" circuits to produce graphical signatures that provide an easy-to-use comparison method to quickly identify faulty components. Analog Signature Analysis (ASA) allows relatively rapid diagnostics of complex electronics by technicians with limited experience. Because of frequency limits and the growing dependence on broadband technologies, ASA must be augmented with other capabilities. To meet this challenge while preserving ease of use, CLEAR proposed an alternative called Complex Signature Analysis (CSA). Tests of ASA and CSA were used to compare capabilities and to determine if the techniques provided an overlapping or complementary capability. The results showed that the methods are complementary.

  18. Checking a printed board

    CERN Multimedia

    1977-01-01

    An 'Interactive Printed Circuit Board Design System' has been developed by a company in a Member-State. Printed circuits are now produced at the SB's surface treatment workshop using a digitized photo-plotter.

  19. Development of Charge Sensitive Preamplifier and Readout Integrate Circuit Board for High Resolution Detector using ASIC Process

    International Nuclear Information System (INIS)

    - Design of discrete type charge sensitive amplifier for high resolution semi-conductor sensor - Design and develop the test board for the performance of charge sensitive amplifier with sensor - Performance of electrical test for the sensor and charge sensitive amplifier - Development of prototype 8 x 8 array type detector module - Noise equivalent charge test for the charge sensitive amplifier - Design and development of Micro SMD discrete type amplifier applying ASIC procedure - Development of Hybrid type charge sensitive amplifier including shape

  20. The Performance of Calcium Silicate Board Partition Fireproof Drywall Assembly with Junction Box under Fire

    Directory of Open Access Journals (Sweden)

    Yinuo Wang

    2015-01-01

    Full Text Available This study uses a metal stud partition fireproof drywall measuring 83 mm in thickness as a test specimen to explore the impact of an embedded junction box on the firefighting performance of the wall through one time of standard fire test on a 300 cm × 300 cm area and five times of standard fire test on a 120 cm × 120 cm area. The results show that the quality of calcium silicate board plays a big role in the fireproof effectiveness. The embedded junction box located on the backside of the fire can reduce the effectiveness of the wall, especially the area above the socket. The thickness of rock wool may increase the performance, but in a limited rate. External junction box may not impact the fireproofing performance of the wall but it still possesses some safety risks. An embedded junction box measuring 101 × 55 mm could already damage the fire compartment, and in reality there may be more complicated situations that should be noted and improved.

  1. Anisotropic viscoelastic shell modeling technique of copper patterns/photoimageable solder resist composite for warpage simulation of multi-layer printed circuit boards

    International Nuclear Information System (INIS)

    In this study, the warpage simulation of a multi-layer printed circuit board (PCB) was performed as a function of various copper (Cu) patterns/photoimageable solder resist (PSR) composite patterns and their anisotropic viscoelastic properties. The thermo-mechanical properties of Cu/PSR patterns were obtained from finite element analysis (virtual test) and homogenized with anisotropic composite shell models that considered the viscoelastic properties. The multi-layer PCB model was simplified based on the unit Cu/PSR patterns and the warpage simulation during the reflow process was performed by using ABAQUS combined with a user-defined subroutine. From these results, it was demonstrated that the proposed anisotropic viscoelastic composite shell simulation technique can be successfully used to predict warpage of multi-layer PCBs during the reflow process. (paper)

  2. Computer simulation of the pneumatic separator in the pneumatic-electrostatic separation system for recycling waste printed circuit boards with electronic components.

    Science.gov (United States)

    Xue, Mianqiang; Xu, Zhenming

    2013-05-01

    Technologies could be integrated in different ways into automatic recycling lines for a certain kind of electronic waste according to practical requirements. In this study, a new kind of pneumatic separator with openings at the dust hooper was applied combing with electrostatic separation for recycling waste printed circuit boards. However, the flow pattern and the particles' movement behavior could not be obtained by experimental methods. To better control the separation quantity and the material size distribution, computational fluid dynamics was used to model the new pneumatic separator giving a detailed understanding of the mechanisms. Simulated results showed that the tangential velocity direction reversed with a relatively small value. Axial velocity exhibited two sharp decreases at the x axis. It is indicated that the bottom openings at the dust hopper resulted in an enormous change in the velocity profile. A new phenomenon that was named dusting was observed, which would mitigate the effect of particles with small diameter on the following electrostatic separation and avoid materials plugging caused by the waste printed circuit boards special properties effectively. The trapped materials were divided into seven grades. Experimental results showed that the mass fraction of grade 5, grade 6, and grade 7 materials were 27.54%, 15.23%, and 17.38%, respectively. Grade 1 particles' mass fraction was reduced by 80.30% compared with a traditional separator. Furthermore, the monocrystalline silicon content in silicon element in particles with a diameter of -0.091 mm was 18.9%, higher than that in the mixed materials. This study could serve as guidance for the future material flow control, automation control, waste recycling, and semiconductor storage medium destruction. PMID:23560940

  3. Electrode assembly for combustion products detector

    International Nuclear Information System (INIS)

    This electrode assembly includes two relatively large-diameter, parallel conductive discs spaced apart by an annular insulator which has peripheral flanges respectively encompassing the perimeters of the discs. The assembly is adapted to be disposed in an ionization chamber formed by a printed circuit board and a conductive cup mounted thereon. One of the discs has conductive mounting legs adapted to be snap-fitted into complementary openings in the circuit board for spacing the disc from the board a distance sufficient to permit the mounting of associated electronic components therebetween. Both discs have pronged attachment apertures adapted for one-way press-fitting engagement with corresponding attachment posts on the insulating body, one disc having a central aperture for mounting an associated radioactive source thereon. The other disc cooperates with the one disc to define a reference zone therebetween and cooperates with the metal cup to define a sampling zone of the ionization

  4. 废弃电路板中非金属组分的回收利用%Recycling of non-metallic fractions from waste printed circuit boards

    Institute of Scientific and Technical Information of China (English)

    刘旸; 刘静欣; 江晓健; 郭学益

    2016-01-01

    废弃电路板是电子废弃物的重要组成部分。目前工业生产及工艺开发多针对极具经济回收价值的电路板金属组分。然而,占电路板质量分数70%的非金属组分却关注较少。文章分析了废弃电路板非金属组分的组成及其有害组分,其含有树脂及玻璃纤维等有价成分和溴、夹杂重金属等污染环境的物质,其回收利用对于资源循环利用及环境保护均有重要意义。非金属组分回收利用主要有物理处理和化学处理2种技术:物理处理技术主要将非金属组分用作结构材料填料、塑料改性剂和建筑材料改性剂;化学处理技术通过焚烧将非金属组分用作燃料和熔剂或通过热解回收或溶剂分解回收可将非金属组分转化为化工产品。这2种技术在非金属组分资源化利用上各有优势,都已有部分工业化应用。%Waste printed circuit boards (WPCBs) are important parts in the electronic waste. Nowadays, recov-ering metals from WPCBs are developed but non-metallic fractions which accounts for 70% of waste printed circuit boards have not been effectively utilized. The non-metallic fractions and hazards in waste printed cir-cuit boards were analyzed in this paper. The results show that resins and glass fiber in non-metallic fractions can be recycled and bromine and heavy metals could pollute environment. Recovering non-metallic fractions are important to recycling and environment, which can be divided into physical recycling technology and chemical recycling technology, with the formal using non-metallic fractions as the filler materials, plastic modifier or building material modifiers, and the latter using non-metallic fractions as the fuel and smelting flux through incineration or convert non-metallic fractions into chemical products through pyrolysis or solvent decomposition. Both technologies have their own advantages in resource utilization of non-metallic fractions, and partly

  5. Anti-vibration Optimization Design of Printed Circuit Board Based on Modal Analysis%基于模态分析的印制电路板抗振优化设计

    Institute of Scientific and Technical Information of China (English)

    陈康; 张雷; 胡晓吉

    2014-01-01

    To ensure a sufficiently high natural frequency of printed circuit board can effectively improve the anti -vibration capa-bility of the printed circuit board for .Two typical sizes of printed circuit board ( PCB) which are 3U and 6U are taken for exam-ple, their finite element models are established , and their natural frequencies are obtained by modal analysis .Optimal installation solutions are designed for 3U and 6U boards to solve their problems of low natural frequencies .The results show that the optimal installation solutions are easy to implement , they can significantly increase the natural frequencies for 3U and 6U boards and en-hance the anti-vibration reliability , at the same time the installation solutions meet the needs of circuit design .%保证印制电路板足够高的固有频率可有效提高印制电路板的抗振能力。以3U和6U两种典型尺寸的印制电路板为例,分别建立有限元模型,通过模态分析得到其各阶固有频率。针对印制电路板固有频率偏低的问题,分别对3U和6U板卡设计优化安装方案。模态分析表明,这些优化安装方案易于实现,可显著提高这2种板卡的固有频率,增强抗振能力,提高可靠性,同时考虑了电路设计的需要。

  6. Bi-directional homogenization equivalent modeling for the prediction of thermo-mechanical properties of a multi-layered printed circuit board (PCB)

    International Nuclear Information System (INIS)

    Warpage of multi-layered printed circuit boards (PCB) during the reflow process is a serious problem which affects the reliability of solder ball connections between the PCB and the mounted semi-conductor packages in electronic devices. It is essential to predict the warpage of the PCB accurately; however, the complicated copper patterns in multi-layered PCBs render a full modeling analysis impossible due to the excessive computing time required. To overcome this problem, we have developed analytical equations of three Cu patterns (line, square, and grid) for the application of thermo-mechanical properties simply by equivalent modeling of Cu patterns. In the proposed equations, the effect of thermo-viscoelastic properties as well as the influence of surrounding layers such as woven glass fabric/BT (bismaleimide triazine), composite laminate (BT core), and photoimageable solder resist (PSR) were considered. To verify the developed equations, vibration tests based on the wave propagation approach were performed at various temperatures. Good agreement was observed between the equivalent model and the experimental results. (paper)

  7. Optimizing the operating parameters of corona electrostatic separation for recycling waste scraped printed circuit boards by computer simulation of electric field.

    Science.gov (United States)

    Li, Jia; Lu, Hongzhou; Liu, Shushu; Xu, Zhenming

    2008-05-01

    The printed circuit board (PCB) has a metal content of nearly 28% metal, including an abundance of nonferrous metals such as copper, lead, and tin. The purity of precious metals in PCBs is more than 10 times that of rich-content minerals. Therefore, the recycling of PCBs is an important subject, not only from the viewpoint of waste treatment, but also with respect to the recovery of valuable materials. Compared with traditional process the corona electrostatic separation (CES) had no waste water or gas during the process and it had high productivity with a low-energy cost. In this paper, the roll-type corona electrostatic separator was used to separate metals and nonmetals from scraped waste PCBs. The software MATLAB was used to simulate the distribution of electric field in separating space. It was found that, the variations of parameters of electrodes and applied voltages directly influenced the distribution of electric field. Through the correlation of simulated and experimental results, the good separation results were got under the optimized operating parameter: U=20-30 kV, L=L(1)=L(2)=0.21 m, R(1)=0.114, R(2)=0.019 m, theta(1)=20 degrees and theta(2)=60 degrees . PMID:17900802

  8. A comparison of gold versus silver electrode contacts for high-resolution gastric electrical mapping using flexible printed circuit board arrays

    International Nuclear Information System (INIS)

    Stomach contractions are initiated and coordinated by electrical events termed slow waves, and slow wave abnormalities contribute to gastric motility disorders. Recently, flexible printed circuit board (PCB) multi-electrode arrays were introduced, facilitating high-resolution mapping of slow wave activity in humans. However PCBs with gold contacts have shown a moderately inferior signal quality to previous custom-built silver-wire platforms, potentially limiting analyses. This study determined if using silver instead of gold contacts improved flexible PCB performance. In a salt-bath test, modestly higher stimulus amplitudes were recorded from silver PCBs (mean 312, s.d. 89 µV) than those from gold (mean 281, s.d. 85 µV) (p < 0.001); however, the signal-to-noise ratio (SNR) was similar (p = 0.26). In eight in vivo experimental studies, involving gastric serosal recordings from five pigs, no silver versus gold differences were found in terms of slow wave amplitudes (mean 677 versus 682 µV; p = 0.91), SNR (mean 8.8 versus 8.8 dB; p = 0.94) or baseline drift (NRMS; mean 12.0 versus 12.1; p = 0.97). Under the prescribed conditions, flexible PCBs with silver or gold contacts provide comparable results in vivo, and contact material difference does not explain the performance difference between current-generation slow wave mapping platforms. Alternative explanations for this difference and the implications for electrode design are discussed. (note)

  9. A Study on Pyrolysis Behavior of Waste Printed Circuit Boards%不同废旧电路板的 TG 行为研究

    Institute of Scientific and Technical Information of China (English)

    王佐仑; 张航; 丁洁; 令狐文生

    2014-01-01

    The pyrolysis of different kinds of waste printed circuit boards ( PCBs ) was investigated through TG technology.The effects of pyrolysis temperature , flow rate of nitrogen and heating rate on the pyrolysis behavior of PCBs were studied.The results showed that the heating rate had remarkable effect on the pyrolysis process and lower heating rate was benefit of the pyrolyiss.The most pyrolysis process was occurred at about 330~700 ℃for all of PCBs.%用电路板做为研究对象,去除其电子元件和金属元件,用钳子分解为直径为3 mm左右的碎片。用热重-差热分析仪对其进行热解,考察了热解温度、气氛流速、升温速率对热解的影响。结果表明,升温速率为影响电路板热解最重要的因素,升温速率慢有利于电路板的热解,热解时间越久热解越完全,热解率随着气流速度的增大而先上升后下降。废旧电路板的主要热解温度在350~700℃。

  10. Bi-directional homogenization equivalent modeling for the prediction of thermo-mechanical properties of a multi-layered printed circuit board (PCB)

    Science.gov (United States)

    Joo, Sung-Jun; Park, Buhm; Kim, Do-Hyoung; Kwak, Dong-Ok; Park, Junhong; Kim, Hak-Sung

    2016-04-01

    Warpage of multi-layered printed circuit boards (PCB) during the reflow process is a serious problem which affects the reliability of solder ball connections between the PCB and the mounted semi-conductor packages in electronic devices. It is essential to predict the warpage of the PCB accurately; however, the complicated copper patterns in multi-layered PCBs render a full modeling analysis impossible due to the excessive computing time required. To overcome this problem, we have developed analytical equations of three Cu patterns (line, square, and grid) for the application of thermo-mechanical properties simply by equivalent modeling of Cu patterns. In the proposed equations, the effect of thermo-viscoelastic properties as well as the influence of surrounding layers such as woven glass fabric/BT (bismaleimide triazine), composite laminate (BT core), and photoimageable solder resist (PSR) were considered. To verify the developed equations, vibration tests based on the wave propagation approach were performed at various temperatures. Good agreement was observed between the equivalent model and the experimental results.

  11. Eco-friendly copper recovery process from waste printed circuit boards using Fe{sup 3+}/Fe{sup 2+} redox system

    Energy Technology Data Exchange (ETDEWEB)

    Fogarasi, Szabolcs [Babeş-Bolyai University, Faculty of Chemistry and Chemical Engineering, 11 Arany Janos Street, Cluj-Napoca RO-400028 (Romania); Imre-Lucaci, Florica [Babeş-Bolyai University, Interdisciplinary Research Institute on Bio-Nano-Sciences, 42 Treboniu Laurian Street, Cluj-Napoca RO-400271 (Romania); Egedy, Attila [University of Pannonia, Department of Process Engineering, Egyetem Str. 10, H-8200 Veszprém (Hungary); Imre-Lucaci, Árpád, E-mail: aimre@chem.ubbcluj.ro [Babeş-Bolyai University, Faculty of Chemistry and Chemical Engineering, 11 Arany Janos Street, Cluj-Napoca RO-400028 (Romania); Ilea, Petru [Babeş-Bolyai University, Faculty of Chemistry and Chemical Engineering, 11 Arany Janos Street, Cluj-Napoca RO-400028 (Romania)

    2015-06-15

    Highlights: • We developed an ecofriendly mediated electrochemical process for copper recovery. • The recovery of copper was achieved without mechanical pretreatment of the samples. • We identified the optimal flow rate for the leaching and electrowinning of copper. • The copper content of the obtained cathodic deposits was over 99.9%. - Abstract: The present study aimed at developing an original and environmentally friendly process for the recovery of copper from waste printed circuit boards (WPCBs) by chemical dissolution with Fe{sup 3+} combined with the simultaneous electrowinning of copper and oxidant regeneration. The recovery of copper was achieved in an original set-up consisting of a three chamber electrochemical reactor (ER) connected in series with a chemical reactor (CR) equipped with a perforated rotating drum. Several experiments were performed in order to identify the optimal flow rate for the dissolution of copper in the CR and to ensure the lowest energy consumption for copper electrodeposition in the ER. The optimal hydrodynamic conditions were provided at 400 mL/min, leading to the 75% dissolution of metals and to a low specific energy consumption of 1.59 kW h/kg Cu for the electrodeposition process. In most experiments, the copper content of the obtained cathodic deposits was over 99.9%.

  12. Effect of parameter variations on the static and dynamic behaviour of a self-assembled quantum-dot laser using circuit-level modelling

    International Nuclear Information System (INIS)

    We report a new circuit model for a self-assembled quantum-dot (SAQD) laser made of InGaAs/GaAs structures. The model is based on the excited state and standard rate equations, improves the previously suggested circuit models and also provides and investigates the performance of this kind of laser. The carrier dynamic effects on static and dynamic characteristics of a SAQD laser are analysed. The phonon bottleneck problem is simulated. Quantum-dot lasers are shown to be quite sensitive to the crystal quality outside and inside quantum dots. The effects of QD coverage factor, inhomogeneous broadening, the physical source of which is the size fluctuation of quantum dots formed by self-assembly of atoms, and cavity length on the SAQD laser characteristics are analysed. The results of simulation show that an increase in the cavity length and in the QD coverage factor results in the growth of the output power. On the other hand, an increase in the coverage factor and a degradation of inhomogeneous broadening lead to an increase in the modulation bandwidth. The effect of the QD height (cylindrical shape) and stripe width of the laser cavity on QD laser modulation is also analysed. (lasers)

  13. Effect of parameter variations on the static and dynamic behaviour of a self-assembled quantum-dot laser using circuit-level modelling

    Energy Technology Data Exchange (ETDEWEB)

    Razm-Pa, M [Electronic Department of Islamic Azad University, Boushehr (Iran, Islamic Republic of); Emami, F [Optoelectronic Research Centre, Electronic Department of Shiraz University of Technology, Shiraz (Iran, Islamic Republic of)

    2015-01-31

    We report a new circuit model for a self-assembled quantum-dot (SAQD) laser made of InGaAs/GaAs structures. The model is based on the excited state and standard rate equations, improves the previously suggested circuit models and also provides and investigates the performance of this kind of laser. The carrier dynamic effects on static and dynamic characteristics of a SAQD laser are analysed. The phonon bottleneck problem is simulated. Quantum-dot lasers are shown to be quite sensitive to the crystal quality outside and inside quantum dots. The effects of QD coverage factor, inhomogeneous broadening, the physical source of which is the size fluctuation of quantum dots formed by self-assembly of atoms, and cavity length on the SAQD laser characteristics are analysed. The results of simulation show that an increase in the cavity length and in the QD coverage factor results in the growth of the output power. On the other hand, an increase in the coverage factor and a degradation of inhomogeneous broadening lead to an increase in the modulation bandwidth. The effect of the QD height (cylindrical shape) and stripe width of the laser cavity on QD laser modulation is also analysed. (lasers)

  14. Printed circuit for ATLAS

    CERN Multimedia

    Laurent Guiraud

    1999-01-01

    A printed circuit board made by scientists in the ATLAS collaboration for the transition radiaton tracker (TRT). This will read data produced when a high energy particle crosses the boundary between two materials with different electrical properties.

  15. Design and realization of a certain type of radio power supply circuit board detecting and teaching platform%某型电台电源板检测示教平台的设计与实现

    Institute of Scientific and Technical Information of China (English)

    刘桂云; 邵智超

    2012-01-01

    为达到某型电台电路板形象直观的示教、检测和故障诊断的目的,研究开发了某型指挥系统的检测示教平台.文中介绍了某型电台电源板检测示教平台的设计与实现方法,平台主要包括适配器和示教软件两个部分.实际应用表明,该平台运行稳定可靠,能大幅提高装备电路板教学的效率和水平,也为电路板的检测和故障诊断提供了一个途径.%A certain type of command and control system detecting and teaching platform is designed in order to realize clear display of the operation and implement the capability teaching detecting and fault diagnosis conveniently. This thesis which is a part of the program introduces design and realization of a certain type of radio power supply circuit board detecting and teaching platform. The platform consists of adapter and teaching software. The experiments indicate that the platform is reliable in the operation, can improve efficiency of circuit board teaching and provide a method for circuit board detecting and fault diagnosis.

  16. Estimating the optimal number of membrane electrode assembly catalyst layers for proton exchange membrane fuel cell by considering open circuit voltage and polarization

    International Nuclear Information System (INIS)

    This paper reports on a thin polymer membrane with a self-humidifying membrane electrode assembly (MEA) using water generated from the cathode. However, the open circuit voltage was low because the activation and diffusion polarizations were high. Therefore, a multilayered MEA was prepared for a proton exchange membrane fuel cell by the screen-printing method to reduce the two polarizations and improve the open circuit voltage and power density. The MEA consists of a Nafion 115 membrane and a Vulcan XC-72 commercial catalyst (20 wt.% Pt/C) on the anode and cathode. The performances of the multilayered MEA were evaluated for the current-voltage (I-V) characteristics of single cells. In addition, the activation and diffusion polarizations and the open circuit voltage were analyzed for a prepared sample. Excellent characteristics were obtained for the MEA multilayered structure (anode: two layers; cathode: three layers). The activity of both electrodes was increased and a high power density was obtained compared to single-layered MEA.

  17. A new technology for separation and recovery of materials from waste printed circuit boards by dissolving bromine epoxy resins using ionic liquid

    International Nuclear Information System (INIS)

    Highlights: ► WPCBs were heated in [EMIM+][BF4−] for recovering solider at 240 °C. ► The bromine epoxy resins in WPCBs were all dissolved in [EMIM+][BF4−] at 260 °C. ► Used [EMIM+][BF4−] is treated by water to obtain regeneration. - Abstract: Recovery of valuable materials from waste printed circuit boards (WPCBs) is quite difficult because WPCBs is a heterogeneous mixture of polymer materials, glass fibers, and metals. In this study, WPCBs was treated using ionic liquid (1-ethyl-3-methylimizadolium tetrafluoroborate [EMIM+][BF4−]). Experimental results showed that the separation of the solders went to completion, and electronic components (ECs) were removed in WPCBs when [EMIM+][BF4−] solution containing WPCBs was heated to 240 °C. Meanwhile, metallographic observations verified that the WPCBs had an initial delamination. When the temperature increased to 260 °C, the separation of the WPCBs went to completion, and coppers and glass fibers were obtained. The used [EMIM+][BF4−] was treated by water to generate a solid–liquid suspension, which was separated completely to obtain solid residues by filtration. Thermal analyses combined with infrared ray spectra (IR) observed that the solid residues were bromine epoxy resins. NMR (nuclear magnetic resonance) showed that hydrogen bond played an important role for [EMIM+][BF4−] dissolving bromine epoxy resins. This clean and non-polluting technology offers a new way to recycle valuable materials from WPCBs and prevent environmental pollution from WPCBs effectively.

  18. Fault Detection and Diagnosis Technology Research for the Instrumentation and Control Circuit Board of the Nuclear Power Plant%核电厂仪控板件故障检测与诊断技术研究

    Institute of Scientific and Technical Information of China (English)

    王健; 王江波; 邱建文

    2014-01-01

    In the nuclear power plant , instrumentation and control circuit boards are important parts of the in-strumentation and control system .The performances of this kind of circuit boards have a direct impact on the safety ,reliability and economic efficiency of the nuclear power plant .Based on in-circuit test technology ,fault detection and diagnosis technology of the instrumentation and control circuit boards are discussed by this work . This paper introduces the overseas experience ,the main function and development process of ICT .In addition , theof the test data is also studied .This fault detection and diagnosis technology plays an important role in im -proving the safety level of the nuclear power plant operation .%仪控板件是核电厂仪控系统的重要组成部分,仪控板件的性能对核电厂能否安全、可靠、经济的运行有直接影响。本工作以在线测试为基础,对核电厂仪控板件的故障检测及其诊断技术进行了探讨;介绍了国外同行在该领域的相关经验和在线测试的主要功能、开发流程以及测试数据的分析方法,该故障检测与诊断技术对提高核电厂的安全运行水平有重要作用。

  19. 智能型电动机软起动器控制电路板测试系统设计%Design of Measurement System for Control Circuit Board of Intelligent Motor Soft Starter

    Institute of Scientific and Technical Information of China (English)

    李鑫; 戴梅; 顾启民; 谢启; 季绍陵

    2011-01-01

    The measurement of intelligent motor soft starter control circuit board performance parameter is an important means to develop a new product and guarantee product quality. Based on requirement analysis, an automatic measurement system of performance parameter for intelligent motor soft starter control circuit board based on virtual instrument technology was designed and implemented. This system was composed of industrial computer, data acquisition card and signal conditioning circuit, etc. Using LabVIEW virtual instrument technology plat-form, the related test and data processing program codes were developed, and its high speed data acquisition and data processing satisfied the needs of ex-factory performance parameter measurement for intelligent motor soft starter control circuit board. The hardware design was given and the working principles of this system were introduced; and the module design of system software was also introduced in detail. Practical application shows that the intelligent measurement system features high precision, strong disturbance attenuation, high efficiency, and easy operation and maintenance. Besides, it can improve the design and performance of products, which can be widely used. The system provides an effective way to design the performance parameter measurement system for intelligent motor soft starter control circuit board.%在需求分析基础上设计并实现了一种利用虚拟仪器技术构建的智能型电动机软起动器控制电路板性能参数自动测试系统.系统以工业控制计算机为核心,配置高精度数据采集卡和信号调理电路等硬件,采用先进的虚拟仪器技术——LabvIEw软件开发平台自行开发数据采集、分析、处理软件,实现了对智能型电动机软起动器控制电路板的自动测试.详细分析了系统总体方案设计,阐述了系统软件模块设计.经实际应用表明,该系统具有测试精度高、抗干扰能力强、检测效

  20. Design of Test System for Control Circuit Board of Residual Current Fire Monitoring Detector%剩余电流式电气火灾监控探测器控制电路板检测系统设计

    Institute of Scientific and Technical Information of China (English)

    陈景波; 谢启; 顾启民; 涂水林; 季绍陵

    2012-01-01

    Performance parameters test for control circuit board of residual current fire monitoring detector is an important means to develop new product and guarantee product quality. Based on requirement analysis , an automatic test system of performance parameter for residual current fire monitoring detector control circuit board based on virtual instrument technology was designed and implemented. The hardware was composed of industrial computer, data acquisition card and signal conditioning circuit, etc. Using LabVIEW virtual instrument technology platform, the related test and data processing program codes were developed, the system satisfied the needs of performance parameter test for residual current fire monitoring detector control circuit board. Practical application shows that the intelligent test system features with high precision, high efficiency, and can provide an effective way to design the performance parameter measurement system for residual current fire monitoring detector control circuit board.%剩余电流式电气火灾监控探测器控制电路板的性能参数检测是进行新产品研发和保证产品生产质量的重要手段;在需求分析基础上设计并实现了一种利用虚拟仪器技术构建的剩余电流式电气火灾监控探测器控制电路板性能参数自动检测系统;硬件由工业控制计算机、高精度数据采集卡和信号调理电路等构建,软件采用LabVIEW平台开发,完成数据采集、分析、处理和显示的功能,整体实现了对剩余电流式电气火灾监控探测器控制电路板的自动测试;实际应用证明,该系统具有高的测试精度和效率,为简单快速检测剩余电流式电气火灾监控探测器控制电路板提供了一种有效的方法.

  1. Leaching of Au, Ag, and Pd from waste printed circuit boards of mobile phone by iodide lixiviant after supercritical water pre-treatment

    Energy Technology Data Exchange (ETDEWEB)

    Xiu, Fu-Rong, E-mail: xiu_chem@hotmail.com [College of Ecological Environment and Urban Construction, Fujian University of Technology, Fuzhou 350108 (China); Qi, Yingying [College of Ecological Environment and Urban Construction, Fujian University of Technology, Fuzhou 350108 (China); Zhang, Fu-Shen [Research Center for Eco-Environmental Sciences, Chinese Academy of Sciences, Beijing 100085 (China)

    2015-07-15

    Highlights: • We report a novel process for recovering Au, Ag, and Pd from waste PCBs. • The effect of SCWO on the leaching of Au, Ag, and Pd in waste PCBs was studied. • SCWO was highly efficient for enhancing the leaching of Au, Ag, and Pd. • The optimum leaching parameters for Au, Ag, and Pd in iodine–iodide were studied. - Abstract: Precious metals are the most attractive resources in waste printed circuit boards (PCBs) of mobile phones. In this work, an alternative process for recovering Au, Ag, and Pd from waste PCBs of mobile phones by supercritical water oxidation (SCWO) pre-treatment combined with iodine–iodide leaching process was developed. In the process, the waste PCBs of mobile phones were pre-treated in supercritical water, then a diluted hydrochloric acid leaching (HL) process was used to recovery the Cu, whose leaching efficiency was approximately 100%, finally the resulting residue was subjected to the iodine–iodide leaching process for recovering the Au, Ag, and Pd. Experimental results indicated that SCWO pre-treatment temperature, time, and pressure had significant influence on the Au, Ag, and Pd leaching from (SCWO + HL)-treated waste PCBs. The optimal SCWO pre-treatment conditions were 420 °C and 60 min for Au and Pd, and 410 °C and 30 min for Ag. The optimum dissolution parameters for Au, Pd, and Ag in (SCWO + HL)-treated PCBs with iodine–iodide system were leaching time of 120 min (90 min for Ag), iodine/iodide mole ratio of 1:5 (1:6 for Ag), solid-to-liquid ratio (S/L) of 1:10 g/mL (1:8 g/mL for Ag), and pH of 9, respectively. It is believed that the process developed in this study is environment friendly for the recovery of Au, Ag, and Pd from waste PCBs of mobile phones by SCWO pre-treatment combined with iodine–iodide leaching process.

  2. Leaching of Au, Ag, and Pd from waste printed circuit boards of mobile phone by iodide lixiviant after supercritical water pre-treatment

    International Nuclear Information System (INIS)

    Highlights: • We report a novel process for recovering Au, Ag, and Pd from waste PCBs. • The effect of SCWO on the leaching of Au, Ag, and Pd in waste PCBs was studied. • SCWO was highly efficient for enhancing the leaching of Au, Ag, and Pd. • The optimum leaching parameters for Au, Ag, and Pd in iodine–iodide were studied. - Abstract: Precious metals are the most attractive resources in waste printed circuit boards (PCBs) of mobile phones. In this work, an alternative process for recovering Au, Ag, and Pd from waste PCBs of mobile phones by supercritical water oxidation (SCWO) pre-treatment combined with iodine–iodide leaching process was developed. In the process, the waste PCBs of mobile phones were pre-treated in supercritical water, then a diluted hydrochloric acid leaching (HL) process was used to recovery the Cu, whose leaching efficiency was approximately 100%, finally the resulting residue was subjected to the iodine–iodide leaching process for recovering the Au, Ag, and Pd. Experimental results indicated that SCWO pre-treatment temperature, time, and pressure had significant influence on the Au, Ag, and Pd leaching from (SCWO + HL)-treated waste PCBs. The optimal SCWO pre-treatment conditions were 420 °C and 60 min for Au and Pd, and 410 °C and 30 min for Ag. The optimum dissolution parameters for Au, Pd, and Ag in (SCWO + HL)-treated PCBs with iodine–iodide system were leaching time of 120 min (90 min for Ag), iodine/iodide mole ratio of 1:5 (1:6 for Ag), solid-to-liquid ratio (S/L) of 1:10 g/mL (1:8 g/mL for Ag), and pH of 9, respectively. It is believed that the process developed in this study is environment friendly for the recovery of Au, Ag, and Pd from waste PCBs of mobile phones by SCWO pre-treatment combined with iodine–iodide leaching process

  3. 废弃线路板中重金属形态分布特征%Speciation Distribution Characters of Heavy Metals in Waste Printed Circuit Boards

    Institute of Scientific and Technical Information of China (English)

    赵国华; 罗兴章; 黄卓辉; 冯景伟; 郑正; 高顺枝; 聂耳; 倪利晓

    2009-01-01

    The environmental availability of heavy metals from the waste printed circuit boards (PCBs) were studied through BCR's three-stage extraction procedures from EU and Tessier's five sequential extraction procedures. The results show that the heavy metal extraction rates with BCR's procedures are higher than that with Tessier' s from waste PCBs. There are significant differences in fraction distributions of heavy metals in PCBs. The speciation of Ni in the PCBs exists mainly in residual forms and has little effect on the environment. The percentage of acidic extractable forms with BCR's method and the total amount of exchangeable and carbonate which bound for Tessier's procedure of Pb and Zn are high, in the South China, the two metals are more easily released by acid rain. Acidic extractable forms of Cu is the main speciation in PCBs with BCR's extraction procedures, while the percentage of Fe-Mn oxides- bound of Cu is the highest with Tessier's procedures, though the result is not agree consistent, due to the high content of Cu in PCBs, the harm of Cu from PCBs could not be neglected.%通过BCR3态连续提取方法和Tessier 5步连续提取方法,对某废弃线路板中重金属的赋存形态进行研究.结果表明,BCR连续提取法对废弃线路板中重金属的提取率比Tessier连续提取方法高.废弃线路板中Cu、Pb、Zn和Ni各形态分布差别很大.BCR和Tessier连续提取方法结果均表明废弃线路板中Ni主要是以残渣态存在,对环境的污染风险小;而Pb和Zn主要以酸可提取态或者碳酸盐态和可交换态存在,在南方酸雨环境中容易溶出;BCR和Tessier连续提取方法对Cu的活性评价不一致,但是由于废弃线路板中Cu总量高,对环境的影响不可忽视.

  4. 生物湿法冶金技术回收废弃线路板中有价金属的研究进展%Review on recovering precious metals from wasted circuit board by bio-hydrometallurgy technology

    Institute of Scientific and Technical Information of China (English)

    曾伟民; 朱海珍; 叶子婕; 夏明晨; 喻子凌; 王新天

    2013-01-01

    The quantity of circuit board produced and abandoned has increased with the development of electronics industry. The characteristics of pyrometallurgical recovery, mechanical recovery and wet recovery, such as low recovery ratio, high cost and environmental pollution fails to recover the precious metals from wasted circuit board. This article discusses the feasibility and economic value of precious metals recovery from wasted circuit board by bio-hydrometallurgy by the sequence of dismantling-broken-biological leaching-follow-up treatment. The physiological and biochemical properties of the metallurgical microbials at the medium temperature, moderate thermophilic and moderate thermophilic are introduced respectively. The application prospect of the recovering precious metals from wasted circuit board by bio-hydrometallurgy technology is forecasted.%  随着电子工业的发展,线路板的生产量和废弃量日益增加。传统的火法回收、机械回收、湿法回收等废弃线路板的处理方法金属回收率低、成本高,且极易造成环境污染,不能很好地回收线路板中的有价金属。文中论述了采用生物湿法冶金技术通过拆解-破碎-生物浸出-后续处理4个步骤回收废弃线路板中有价金属的可行性以及该方法能够带来的巨大经济效益,介绍了常用的中温、中等嗜热、极度嗜热冶金微生物的生理生化性质。最后展望了生物湿法冶金技术在未来废弃线路板高效回收方面的应用前景。

  5. Results of water corrosion in static cell tests representing multi-metal assemblies in the hydraulic circuits of Tore Supra

    International Nuclear Information System (INIS)

    Full text of publication follows: Tore supra (TS) has used from the beginning of operation in 1989 actively cooled plasma facing components. Since the operation and baking temperature of all in vessel components has been defined to be up to 230 deg. C at 40 bars, a special water chemistry of the cooling water plant was suggested in order to avoid eventual water leaks due to corrosion (general corrosion, galvanic corrosion, stress corrosion, etc.) at relative high temperatures and pressures in tubes, pipes, bellows, water boxes, coils, etc. From the beginning of TS operation, in vessel components (e.g. wall protection panels, limiters, ergodic divertor coils, neutralisers and diagnostics) represented a unique combination of metals in the hydraulic circuit mainly such as stainless steel, Inconel, CuCrZr, Nickel and Copper. These different materials were joined together by welding (St to St, Inconel to Inconel, CuCrZr to CuCrZr and CuCrZr to St-St via a Ni sleeve adapter), brazing (St-St to Cu and Cu-LSTP), friction (CuCrZr and Cu to St-St), explosion (CuCrZr to St-St) and memory metal junction (Cryo-fit to Cu - only test sample). Following experiences obtained with steam generator tubes of nuclear power plants, a cooling water quality of AVT (all volatile treatment) has been defined based on demineralized water with adjustment of the pH value to about 9.0/ 7.0 (25 deg. C/ 200 deg. C) by addiction of ammoniac, and hydrazine in order to absorb oxygen dissolved in water. At that time, a simplified water corrosion test program has been performed using static (no circulation) test cell samples made of above mentioned TS metal combinations. All test cell samples, prepared and filled with AVT water, were performed at 280 deg. C and 65 bars in an autoclave during 3000 hours. The test cell water temperature has been chosen to be sufficient above the TS component working temperature, in order to accelerate an eventual corrosion process. Generally all above mentioned metal

  6. An Investigation on the Extraction and Quantitation of a Hexavalent Chromium in Acrylonitrile Butadiene Styrene Copolymer (ABS) and Printed Circuit Board (PCB) by Ion Chromatography Coupled with Inductively Coupled Plasma Atomic Emission Spectrometry

    International Nuclear Information System (INIS)

    A hexavalent chromium (Cr (VI)) is one of the hazardous substances regulated by the RoHS. The determination of Cr (VI) in various polymers and printed circuit board (PCB) has been very important. In this study, the three different analytical methods were investigated for the determination of a hexavalent chromium in Acrylonitrile Butadiene Styrene copolymer (ABS) and PCB. The results by three analytical methods were obtained and compared. An analytical method by UV-Visible spectrometer has been generally used for the determination of Cr (VI) in a sample, but a hexavalent chromium should complex with diphenylcarbazide for the detection in the method. The complexation did make an adverse effect on the quantitative analysis of Cr (VI) in ABS. The analytical method using diphenylcarbazide was also not applicable to printed circuit board (PCB) because PCB contained lots of irons. The irons interfered with the analysis of hexavalent chromium because those also could complex with diphenylcarbazide. In this study, hexavalent chromiums in PCB have been separated by ion chromatography (IC), then directly and selectively detected by inductively coupled plasma atomic emission spectrometry (ICP-AES). The quantity of Cr (VI) in PCB was 0.1 mg/kg

  7. Results of water corrosion in static cell tests representing multi-metal assemblies in the hydraulic circuits of Tore supra

    International Nuclear Information System (INIS)

    Following experiences obtained with steam generator tubes of nuclear power plants, a cooling water quality of AVT (all volatile treatment) has been defined based on demineralised water with adjustment of the pH value to about 9.0/7.0 (25 C/200 C) by addiction of ammoniac, and hydrazine in order to absorb oxygen dissolved in water. At that time, a simplified water corrosion test program has been performed using static (no circulation) test cell samples made of above mentioned TS metal combinations. All test cell samples, prepared and filled with AVT water, were performed at 280 C and 65 bars in an autoclave during 3000 hours. The test cell water temperature has been chosen to be sufficient above the TS component working temperature, in order to accelerate an eventual corrosion process. Generally all above mentioned metal combinations survived the test campaign without stress corrosion cracking, with the exception of the memory metal junction (creep in Cu) and the bellows made of St-St 316L and Inconel 625 while 316 Ti bellows survived. In contrary to the vacuum brazed Cu-LSTP to St-St samples, some of flame brazed Cu to St-St samples failed either in the braze joint or in the copper structure itself. For comparison, a spot weld of an inflated 316L panel sample, filled voluntary with a caustic solution of pH 11.5 (25 C), failed after 90 h of testing (intergranular cracking at the spot weld), while an identical sample containing AVT water of pH 9.0 (25 C) survived without damage. The results of these tests, performed during 1986 and 1997, have never been published and therefore are presented more in detail in this paper since corrosion in hydraulic circuits is also an issue of ITER. Up to day, the TS cooling water plant operates with an above mentioned water treatment and no water leaks have been detected on in-vessel components originating from water corrosion at high temperature and high pressure. (orig.)

  8. Study on Recycling of Non-metal Materials of Different Types of Waste Printed Circuit Boards%各类废弃印刷线路板非金属材料回收研究

    Institute of Scientific and Technical Information of China (English)

    管传金; 王景伟; 王静荣; 李秀丽; 周玉林

    2011-01-01

    The thermosetting epoxy resin contained in the non-metal powders of waste printed circuit boards could be decomposed in nitric acid.Seven types of non-metal powders of waste printed circuit boards were selected to measure the metal contents and glass fibers contents.The results revealed that the non-metal powders contained a small amount of metal residues and that the contents of glass fibers in seven types of PCBs non-metal powders were also different.Little glass fibers or no glass fibers were found in the paper-based PCBs.The relationship between the yields of recovered epoxy resins and reaction time was discussed.SEM and FT-IR were employed to characterize the recovering epoxy resins and glass fibers.%废弃印刷电路板(Printed Circuit Boards,简称PCBs)非金属粉末中热固性环氧树脂在热的无机酸中能完全分解成环氧树脂和玻璃纤维。选择了七种不同型号的废弃PCBs非金属粉末作为研究对象,研究了这些非金属粉末中金属残留物的含量以及玻璃纤维的含量。结果显示,在非金属粉末中含有一定量的金属残留物。在七种不同型号的废弃PCBs非金属粉末中,玻璃纤维的含量也不一样,在纸基线路板中玻璃纤维含量较小,甚至不含玻璃纤维。还研究了环氧树脂回收量与分解时间的关系,并分别用SEM和FTIR表征回收的玻璃纤维和环氧树脂。

  9. Thermal Diagnostics with the Atmospheric Imaging Assembly on board the Solar Dynamics Observatory: A Validated Method for Differential Emission Measure Inversions

    Science.gov (United States)

    Cheung, Mark C. M.; Boerner, P.; Schrijver, C. J.; Testa, P.; Chen, F.; Peter, H.; Malanushenko, A.

    2015-07-01

    We present a new method for performing differential emission measure (DEM) inversions on narrow-band EUV images from the Atmospheric Imaging Assembly (AIA) on board the Solar Dynamics Observatory. The method yields positive definite DEM solutions by solving a linear program. This method has been validated against a diverse set of thermal models of varying complexity and realism. These include (1) idealized Gaussian DEM distributions, (2) 3D models of NOAA Active Region 11158 comprising quasi-steady loop atmospheres in a nonlinear force-free field, and (3) thermodynamic models from a fully compressible, 3D MHD simulation of active region (AR) corona formation following magnetic flux emergence. We then present results from the application of the method to AIA observations of Active Region 11158, comparing the region's thermal structure on two successive solar rotations. Additionally, we show how the DEM inversion method can be adapted to simultaneously invert AIA and Hinode X-ray Telescope data, and how supplementing AIA data with the latter improves the inversion result. The speed of the method allows for routine production of DEM maps, thus facilitating science studies that require tracking of the thermal structure of the solar corona in time and space.

  10. LARGE-SCALE CORONAL PROPAGATING FRONTS IN SOLAR ERUPTIONS AS OBSERVED BY THE ATMOSPHERIC IMAGING ASSEMBLY ON BOARD THE SOLAR DYNAMICS OBSERVATORY—AN ENSEMBLE STUDY

    International Nuclear Information System (INIS)

    This paper presents a study of a large sample of global disturbances in the solar corona with characteristic propagating fronts as intensity enhancement, similar to the phenomena that have often been referred to as Extreme Ultraviolet Imaging Telescope (EIT) waves or extreme-ultraviolet (EUV) waves. Now EUV images obtained by the Atmospheric Imaging Assembly (AIA) on board the Solar Dynamics Observatory provide a significantly improved view of these large-scale coronal propagating fronts (LCPFs). Between 2010 April and 2013 January, a total of 171 LCPFs have been identified through visual inspection of AIA images in the 193 Å channel. Here we focus on the 138 LCPFs that are seen to propagate across the solar disk, first studying how they are associated with flares, coronal mass ejections (CMEs), and type II radio bursts. We measure the speed of the LCPF in various directions until it is clearly altered by active regions or coronal holes. The highest speed is extracted for each LCPF. It is often considerably higher than EIT waves. We do not find a pattern where faster LCPFs decelerate and slow LCPFs accelerate. Furthermore, the speeds are not strongly correlated with the flare intensity or CME magnitude, nor do they show an association with type II bursts. We do not find a good correlation either between the speeds of LCPFs and CMEs in a subset of 86 LCPFs observed by one or both of the Solar and Terrestrial Relations Observatory spacecraft as limb events

  11. Synergic chemical analysis - the coupling of TG with FTIR, MS and GC-MS; 1. The determination of the gases released during the thermal oxidation of a printed circuit board

    International Nuclear Information System (INIS)

    This contribution reports the coupling of TG with FTIR, MS and GC-MS (Synergic chemical analysis). During thermogravimetric analysis the gases evolved are analysed using 'real-time' FTIR and MS. Simultaneously the gases are collected on an absorbent trap (organic trap module, OTM) for subsequent analysis using GC-MS. As an example the technique has been used to identify the products evolved from a printed circuit board during thermal oxidation. The use of TG-FTIR-MS-OTM-GC-MS provided information that could not be available through single techniques alone. For example, it was possible to ascertain the temperature range over which bromophenol was released. (Copyright (c) 1999 Elsevier Science B.V., Amsterdam. All rights reserved.)

  12. Research review on the ways of disposal of waste printed circuit boards%废弃印刷线路板处置技术的研究进展

    Institute of Scientific and Technical Information of China (English)

    王波; 洪丽

    2013-01-01

    The present paper intends to provide a general review of the latest advances on how to dispose the ever-increasing waste placed or printed circuit boards in modern IT and other branches of electrical and electronic industries. The plastics, metals and fiberglass built-in such waste printed circuit boards make it a valuable secondary resource for recycle. On the other hand, if not properly handled, the components, such as heavy metals and brominated flame retardants, are inevitable to result in toxic damages which are extremely harmful to human health and pernicious to the environment. However, so far as we know, there have not been idealistic methods to do such disposal. Mechanical methods, like disassembly, crush and separation, though introduced as the most convenient practices, are still recommended as pretreatment means. Some other few primary technologies for this purpose, such as metallurgical methods, supercritical water oxidation, biological method, incineration, pyrolysis and gasification have also had their own advantages and disadvantages. Among them, it has to be pointed out that the molten salt gasification of such waste circuits has much greater advantages in performance in preventing secondary pollution due to its absorptive power for the bromine and other heavy metals by molten salts. The use of such molten salt technology in treating coal, biomass, organic waste, to name a few, has drawn vast attention in recent years. The experimental and theoretical research results in these areas also provide strong support for its application in disposing such waste printed circuits to be discarded. Nevertheless, since there is no reliable technology for large scale disposal of waste printed circuit boards for the time being, and only molten salt gasification method has nice pollution-control behaviors, we do believe it is urgent to put more thoughts to improve on the gasification process in molten salt reactor and optimize the device and amplify its design for

  13. RS-232 Led Board

    OpenAIRE

    Tskhvaradze, Vladimir

    2007-01-01

    This article demonstrates how to develop a Microchip PIC16F84 based device that supports RS-232 interface with PC. Circuit (LED Board) design and software development will be discussed. PicBasic Pro Compiler from microEngineering Labs, Inc. is used for PIC programming. Development of LED Board Control Console using C/C++ is also briefly discussed. The project requires basic work experience with Microchip PICs, serial communication and programming.

  14. Industrial Cleaning with ultra-clean water according to the Qlean-method – a case study of printed circuit boards

    OpenAIRE

    Svensson, Niclas; Sundin, Erik; Lindahl, Mattias

    2011-01-01

    The manufacturing industry today uses many kinds of chemicals in its cleaning processes. The industrial cleaners often contain some sort of degreasing chemical to clean parts and components before the main processes, for instance assembly or surface treatment. These types of cleaning methods are often expensive and involve hazardous handling of chemicals in manufacturing, as well as in the transportation of hazardous waste. In addition, the cleaning processes often use a substantial amount of...

  15. Readout boards for silicon detectors

    International Nuclear Information System (INIS)

    With ever increasing demands for greater miniaturization and the use of sophisticated circuitry in nuclear and particle physics experiments, the need for improved design of Printed Circuit Boards (PCBs) is becoming more important day by day. Interconnecting traces, parasitic components, grounding schemes and decoupling makes the design of the layout of PCBs as demanding as the design of the complex electrical circuit. An astute design of the readout boards is important in the success of the overall performance of the final system

  16. X-ray laminography analysis of ultra-fine-pitch solder connections on ultrathin boards

    Science.gov (United States)

    Adams, John A.

    1991-07-01

    As the demand increases for smaller, more powerful new products, design engineers are pressed to increase component densities while simultaneously reducing the size of interconnects. Almost every new product contains more solder joints per square inch than the previous one. New quad flatpack and TAB designs as small as 25 micron leads on 50 micron centers are in the prototype stage. Direct 'chip-on-board' (COB) components placed on a grid of solder bumps with a diameter of 75 microns and a grid of 200 microns are routinely being produced. Future plans include designs with a 25 micron diameter on 50 micron centers which are currently in development. Devices consisting of chips stacked upon chips and interconnected with solder or tungsten wires are increasingly included in new designs. Manufacturers have also begun to produce assemblies on very thin circuit boards with components on both sides. Several technologies have been applied in an effort to provide solder paste and post- reflow inspection. X-ray inspection has proven most effective at determining component placement and solder joint integrity. With its ability to pass freely through circuit board materials and extract detailed structural information from hidden and visible solder joints, the x-ray has proven more adept at assembled board inspection than other automated methods such as laser, ultrasonic, thermal and camera-based systems. This paper addresses the inspection and process control of ultra-thin boards with ultra fine pitch interconnects using x-ray laminography. In addition, the advantages and disadvantages of integrating various fine pitch technologies into the circuit board assembly process are reviewed.

  17. Measuring circuits

    CERN Document Server

    Graf, Rudolf F

    1996-01-01

    This series of circuits provides designers with a quick source for measuring circuits. Why waste time paging through huge encyclopedias when you can choose the topic you need and select any of the specialized circuits sorted by application?This book in the series has 250-300 practical, ready-to-use circuit designs, with schematics and brief explanations of circuit operation. The original source for each circuit is listed in an appendix, making it easy to obtain additional information.Ready-to-use circuits.Grouped by application for easy look-up.Circuit source listings

  18. Circuit theory

    International Nuclear Information System (INIS)

    This book is divided into fourteen chapters, which deals with circuit theory of basis, sinusoidal alternating current on cycle and frequency, basics current circuit about R.L, C circuit and resonant circuit, current power, general linear circuit, inductive coupling circuit and vector locus on an alternating current bridge and mutual inductance and coupling coefficient, multiphase alternating current and method of symmetrical coordinates, non-sinusoidal alternating current, two terminal network, four terminal network, transient of circuits, distributed line circuit constant, frequency characteristic and a filter and Laplace transformation.

  19. Ablation and carbon deposition induced by UV laser irradiation of polyimide: Application to the metallization of VIAs in high density printed circuit boards

    International Nuclear Information System (INIS)

    Polyimides are known to exhibit large ablation rates upon irradiation with excimer laser due to their high absorbance in the UV and low fluorescence yield. We have studied different regimes of laser ablation according to the fluence and studied the structures resulting from carbon products deposition. For fluences larger than the polyimide ablation threshold, but lower than the carbon one, the development of one structure is the dominant process, whereas large ablation rates lead to polyimide etching above the carbon ablation threshold. The deposition of a carbon layer on the walls of ablated slits has in particular been investigated using an original experimental technique. Optical microscopy and MEB have shown that this carbon layer covered the main height of the ablated holes whereas a threshold (bare polyimide) for carbon condensation was evidenced at the bottom of the ablated hole. Raman spectroscopy and conductivity measurements have shown that the carbon phase is mainly graphitic. A dependence of the carbon condensation threshold on the slit width has been evidenced and discussed in relation with the angle of ejection of ablation debris. A procedure has been developed to render the bare polyimide of the threshold region conductive. At last the conductive properties of the walls of the ablated holes have been exploited to perform an electrolytic metallization. Implications for the production of interconnection vertical interconnections (VIAs) in high density printed circuits are addressed

  20. Genetic circuit design automation.

    Science.gov (United States)

    Nielsen, Alec A K; Der, Bryan S; Shin, Jonghyeon; Vaidyanathan, Prashant; Paralanov, Vanya; Strychalski, Elizabeth A; Ross, David; Densmore, Douglas; Voigt, Christopher A

    2016-04-01

    Computation can be performed in living cells by DNA-encoded circuits that process sensory information and control biological functions. Their construction is time-intensive, requiring manual part assembly and balancing of regulator expression. We describe a design environment, Cello, in which a user writes Verilog code that is automatically transformed into a DNA sequence. Algorithms build a circuit diagram, assign and connect gates, and simulate performance. Reliable circuit design requires the insulation of gates from genetic context, so that they function identically when used in different circuits. We used Cello to design 60 circuits forEscherichia coli(880,000 base pairs of DNA), for which each DNA sequence was built as predicted by the software with no additional tuning. Of these, 45 circuits performed correctly in every output state (up to 10 regulators and 55 parts), and across all circuits 92% of the output states functioned as predicted. Design automation simplifies the incorporation of genetic circuits into biotechnology projects that require decision-making, control, sensing, or spatial organization. PMID:27034378

  1. Microelectrolysis / plate setter / biological contact oxidation process for treatment of printed circuit board wastewater%EGSB-CASS-生物滤池工艺处理天然橡胶加工废水

    Institute of Scientific and Technical Information of China (English)

    姚颋; 江丹丹; 李杰

    2012-01-01

    根据某天然橡胶加工企业生产废水的水质特点,采用EGSB-CASS-生物滤池工艺处理天然橡胶加工废水。工程运行结果表明,该工艺对CODCr、氨氮、SS平均去除率分别达到97%,94%,90%,出水水质符合GB8978-1996《污水综合排放标准》一级标准。%The wastewater from a plant of printed circuit board were collected and treated separately according to the wastewater quality. The integrated wastewater was treated by microelectrolysis/plate setter/biological contact oxidation process. The operation results showed that the effluent quality reached the first class of "Integrated Wastewater Discharge Standard" (GB8978-1996). This research obtained a feasible approach for PCB wastewater treatment.

  2. Microelectrolysis/plate setter/biological contact oxidation process for treatment of printed circuit board wastewater%微电解/斜板沉淀/生物接触氧化处理印刷电路板废水

    Institute of Scientific and Technical Information of China (English)

    姚颋; 王宏; 李杰

    2011-01-01

    根据某印刷电路板企业生产废水的水质特点,对废水进行分类收集处理后,采用微电解/斜板沉淀/生物接触氧化工艺处理综合废水。工程运行结果表明,该工艺处理效果稳定,出水水质符合《污水综合排放标准》(GB8978-1996)的一级排放标准。%The wastewater from a plant of printed circuit board were collected and treated separately according tothe wastewater quality. The integrated wastewater was treated by microelectrolysis/plate setter/biological contact oxidation process. The operation results showed that the effluent quality reached the first class of "Integrated Wastewater Discharge Standard" (GB8978-1996).This research obtained a feasible approach for PCB wastewater treatment.

  3. An innovative "ChemicalVia" process for the production of high density interconnect printed circuit boards The ATLAS muon chamber quality control with the X-ray tomograph at CERN

    CERN Document Server

    Da Silva, Vitor; Watts, David; Van der Bij, Erik; Banhidi, Z; Berbiers, Julien; Lampl, W; Marchesotti, M; Rangod, Stephane; Sbrissa, E; Schuh, S; Voss, Rüdiger; Zhuravlov, V

    2004-01-01

    The ChemicalVia process, patented by CERN, provides a new method of making microvias in high-density multilayer printed circuit boards of different types, such as sequential build-up (SBU), high density interconnected (HDI), or laminated multi-chip modules (MCM-L). The process uses chemical etching instead of laser, plasma or other etching techniques and can be implemented in a chain production line. This results in an overall reduced operation and maintenance cost and a much shorter hole production time as compared with other microvia processes. copy Emerald Group Publishing Limited. 4 Refs.4 An essential part of the Muon Spectrometer of the ATLAS experiment is based on the Monitored Drift Tube (MDT) technology. About 1200 muon drift chambers are being built at 13 institutes all over the world. The MDT chambers require an exceptional mechanical construction accuracy of better than 20 mu m. A dedicated X-ray tomograph has been developed at CERN since 1996 to control the mechanical quality of the chambers. The...

  4. Advanced circuit simulation using Multisim workbench

    CERN Document Server

    Báez-López, David; Cervantes-Villagómez, Ofelia Delfina

    2012-01-01

    Multisim is now the de facto standard for circuit simulation. It is a SPICE-based circuit simulator which combines analog, discrete-time, and mixed-mode circuits. In addition, it is the only simulator which incorporates microcontroller simulation in the same environment. It also includes a tool for printed circuit board design.Advanced Circuit Simulation Using Multisim Workbench is a companion book to Circuit Analysis Using Multisim, published by Morgan & Claypool in 2011. This new book covers advanced analyses and the creation of models and subcircuits. It also includes coverage of transmissi

  5. PUZZLE - A program for computer-aided design of printed circuit artwork

    Science.gov (United States)

    Harrell, D. A. W.; Zane, R.

    1971-01-01

    Program assists in solving spacing problems encountered in printed circuit /PC/ design. It is intended to have maximum use for two-sided PC boards carrying integrated circuits, and also aids design of discrete component circuits.

  6. The Advanced On-board Processor (AOP)

    Science.gov (United States)

    Hartenstein, R. G.; Trevathan, C. E.; Stewart, W. N.

    1971-01-01

    The goal of the Advanced On-Board Processor (AOP) development program is to design, build, and flight qualify a highly reliable, moderately priced, digital computer for application on a variety of spacecraft. Included in this development program is the preparation of a complete support software package which consists of an assembler, simulator, loader, system diagnostic, operational executive, and many useful subroutines. The AOP hardware/software system is an extension of the On-Board Processor (OBP) which was developed for general purpose use on earth orbiting spacecraft with its initial application being on-board the fourth Orbiting Astronomical Observatory (OAO-C). Although the OBP possesses the significant features that are required for space application, however, when operating at 100% duty cycle the OBP is too power-consuming for use on many smaller spacecraft. Computer volume will be minimized by implementing the processor and input/output portions of the machine with large scale integrated circuits. Power consumption will be reduced through the use of plated wire and, in some cases, semiconductor memory elements.

  7. 热应力-应变对线路板热物理改性影响研究%The effect of the thermal stress and strain on the heat physical modification of circuit board

    Institute of Scientific and Technical Information of China (English)

    易鸿

    2012-01-01

    文章根据废电路板材料热、力学性质差异,提出了加热改性预处理的技术方法.该方法基于物理改性和微观破坏,以提高破碎解离效率,实现金属与非金属的高度解离.通过加热改性处理,结合ANSYS有限元热应力模型,对改性作用进行分析;从环境风险管理的角度,评估热处理过程环境影响;从分离产物及其再生利用角度对加热改性处理后分离的非金属物料进行表征.研究结果可以为废电路板机械物理技术的提升和新工艺的开发提供理论基础,并为其他层压复合材料类废弃物资源化处理技术提供方法参考.%According to the difference of waste material thermal and mechanical properties circuit, a method of heating the pretreatment of modified technology is proposed. This method is based on physical modification and microscopic damage to increase crushing disintegrates efficiency and realizes disintegrating the metal and the non - metallic highly. Analyze the modification effect through the heating modification treatment com- bined with ANSYS finite element model; Assess the effect of the heat treatment process on environmental from the aspect of environmental risk management. Indicate characters of the modification of the heating sep- aration nonmetal materials by separation products and their recycling. The result provides the theoretical foundation for the waste circuit board mechanical and physical technology promotion and new process, and provides the reference method for other laminated composite material or wastes treatment technology.

  8. Bottom-up organic integrated circuits

    OpenAIRE

    Smits, Edsger C. P; Mathijssen, Simon G. J.; van Hal, Paul A.; Setayesh, Sepas; Geuns, Thomas C. T.; Mutsaers, Kees A. H. A.; Cantatore, Eugenio; Wondergem, Harry J.; Werzer, Oliver; Resel, Roland; Kemerink, Martijn; Kirchmeyer, Stephan; Muzafarov, Aziz M.; Ponomarenko, Sergei A.; de Boer, Bert

    2008-01-01

    Self- assembly - the autonomous organization of components into patterns and structures(1) - is a promising technology for the mass production of organic electronics. Making integrated circuits using a bottom- up approach involving self- assembling molecules was proposed(2) in the 1970s. The basic building block of such an integrated circuit is the self- assembled- monolayer field- effect transistor ( SAMFET), where the semiconductor is a monolayer spontaneously formed on the gate dielectric....

  9. Optomechanical details in injection-molded assemblies

    Science.gov (United States)

    Hebert, Raymond T.

    1995-12-01

    With the advent of low-cost electro-optic components such as LEDs, laser diodes and CCD imaging devices, the cost and performance demands now fall upon the optical subsystems in order to achieve realistic marketing targets for many emerging commercial and consumer products. One of the many benefits of injection-molded plastic optics is the diversity of features that are available to the design team. Once designed and incorporated into the tooling, many features are virtually free in high-volume production. These features can include mechanical details as well as optical functions. Registration features can be included for precisely positioning optical elements to one another or to other assemblies such as printed circuit boards or housings. Snaps, compression features, spring-loading elements, standoffs, self-tapping screws or ultrasonically weldable features can greatly facilitate ease of assembly.

  10. Printed circuit board designer's reference basics

    CERN Document Server

    Robertson, Chris

    2003-01-01

    PCB design instruction and reference manual, all in one book, with in- depth explanation of the processes and tools used in modern PCB design Standards, formulas, definitions, and procedures, plus software to tie it all together.

  11. Model Order Reduction for Electronic Circuits:

    DEFF Research Database (Denmark)

    Hjorth, Poul G.; Shontz, Suzanne

    Electronic circuits are ubiquitous; they are used in numerous industries including: the semiconductor, communication, robotics, auto, and music industries (among many others). As products become more and more complicated, their electronic circuits also grow in size and complexity. This increased...... the need for circuit simulators to evaluate potential designs before fabrication, as integrated circuit prototypes are expensive to build, and troubleshooting is difficult. In this report, we focus on the simulation of printed circuit boards (PCB’s) and interconnects both of which are of great importance...

  12. Autonomous parts assembly: comparison of ART and neocognitron

    Science.gov (United States)

    Rosandich, Ryan G.; Ozbayoglu, Murat A.; Roddiger, Eric W.; Dagli, Cihan H.

    1993-09-01

    In this paper, we present the performance analysis of three different neural network paradigms, ART-1, ARTMAP inspired ART-1 and Neocognitron, for part recognition in an autonomous assembly system. This intelligent manufacturing system integrates machine vision, neural networks and robotics in order to identify, locate and assemble randomly places components on printed circuit boards requiring precision assembly. The system uses an IBM 7547 robot controlled by an IBM PS/2 computer, a CCD camera and an image capture card. The electronic components are identified and located by using artificial neural networks. The system's component location and identification accuracy are tested on all test components. The results show that the neocognitron-based system performed better than the other two systems.

  13. Vacuum pyrolysis characteristics of waste printed circuit boards epoxy resin and analysis of liquid products%废弃电路板环氧树脂真空热解及产物分析

    Institute of Scientific and Technical Information of China (English)

    丘克强; 吴倩; 湛志华

    2009-01-01

    在真空条件下,应用程序升温的管式炉反应器对废弃电路板中环氧树脂热解规律进行研究,考察不同的热解终温、升温速率、真空度(压力)及保温时间等各种因素对产物产率的影响.此外,利用傅里叶红外(FT-IR)和气质联用(GC/MS)技术对热解油产物进行表征分析.实验结果表明:温度对产物产率的影响最大,升温速率、真空度及保温时间对热解产物产率也有重要影响.选择适当的热解温度(400~550 ℃)、升温速率(15~20 ℃/min)、真空度(压力15 kPa)及保温时间(30 min)有利于提高热解液体产品的产率;热解油的主要成分是酚类物质,其总含量为84.08%,其中,含溴化合物含量为15.34%.%The effect of pyrolysis conditions on the products yield of epoxy resin in waste printed circuit boards was investigated using the vacuum pyrolysis oven heated by temperature controller. The effects of temperature, heating rate, pressure and reaction time on the yield of vacuum pyrolysis production were analyzed. In addition, the compositions of liquid products were analyzed by FT-IR and GC/MS. The experimental results show that temperature is the key factor in the vacuum pyrolysis process. At the same time, heating rate, pressure and rest time cannot be neglected. The optimisation conditions for the liquid yield from the vacuum pyrolysis process are as follows: temperature 400-550 ℃, heating rate 15-20 ℃/min, pressure 15 kPa, and reaction time 30 min. The main composition in the product yield is Phenolic organic compounds with the total of 84.08%, while considerable amount of brominated products is up to 15.34%, which lowers the value of liquid products.

  14. 废旧印刷线路板的热重分析及热解动力学模型%Thermogravimetric Analysis and Pyrolysis Kinetics Models of Waste Printed Circuit Board

    Institute of Scientific and Technical Information of China (English)

    赵跃; 薛勇; 黄强; 邓欣逸; 张义烽

    2011-01-01

    The pyrolysis characteristics of waste FR4 type printed circuit board (PCB) was studied by thermogravimetric (TG) analysis method. The TG and differential thermogravimetry (DTG) curves of the waste PCB at different heating rate and their changing rules were explored. The activation energy (E) of the pyrolysis reaction was solved exactly by Starink method. The mechanism function and pre-exponential factor (A) were obtained by Malek method. The research results show that; The TG and DTG curves of waste FR4 type PCB move to the high-temperature zone progressively with the increase of heating rate; The initial pyrolysis temperature, the temperature corresponding to the maximum weight loss rate and the terminated pyrolysis temperature also increase with it; The E and A of the waste PCB are 105.75 kJ/mol and 7. 89 x 108 min-1 respectively.%采用热重(TG)分析法研究了废旧FR4型印刷线路板(PCB)的热解特性,探讨了不同升温速率下废旧PCB的TG和微分热重(DTG)曲线及变化规律,利用Starink法精确求解热解反应活化能(E),利用Malek法判断得出废旧PCB的热解动力学机理函数和指前因子(A).研究结果表明:废旧FR4型PCB的TG和DTG曲线随着升温速率的增大逐步向高温区移动;起始热解温度、最大失重速率对应温度以及终止热解温度也随着升温速率的增大而升高;废旧FR4型PCB的E和A分别为105.75 kJ/mol和7.89×108 min-1.

  15. Effect of additives on product of vacuum pyrolysis of waste epoxy printed circuit boards%添加物对废弃环氧电路板真空热解产物的影响

    Institute of Scientific and Technical Information of China (English)

    湛志华; 丘克强

    2011-01-01

    Printed circuit boards (PCBs) without metals and electronic components were pyrolysed in a pipe furnace to separate and recover the organic. The elemental composition of PCBs was analyzed by elemental analyzer and SEM-EDS. PCBs were pyrolysed under control with temperature controller with a series of additives respectively, and the pyrolysis products were analyzed using FT-IR, GC-MS. The results show Fe2O3 and metal additives lead the pyrolysis oil yield reduce to 30.0%. Twenty products in pyrolysis oil can be identified and the main components in the pyrolysis oil are phenol and 4-isopropylphenol. Iron and metal oxides can reduce the bromine content of pyrolyisis oil effectively.%采用程序升温控制的电阻炉,在自制的裂解反应器中对废弃电路板环氧树脂进行在真空条件下的热解实验,并考察金属、金属氧化物和分子筛共12种添加物对废弃电路板环氧树脂真空热解产物产率的影响.利用元素分析仪和SEM-EDS对环氧树脂电路板组成进行分析,对不同添加物与废弃电路板环氧树脂共热裂解得到的裂解油进行FT-IR和GC-MS检测,对其主要组分进行结构鉴定和分析.研究结果表明:Fe2O3和金属添加物(Cu和Fe)使热解油产率降到最低(30.0%);从热解油中鉴定出20种物质,其中主要成分为苯酚和异丙基苯酚;金属铁及其氧化物能有效降低裂解油中的溴化物含量.

  16. Interfacial microstructures and solder joint strengths of the Sn-8Zn-3Bi and Sn-9Zn-lAl Pb-free solder pastes on OSP finished printed circuit boards

    International Nuclear Information System (INIS)

    Two kinds of lead-free solders, Sn-8Zn-3Bi and Sn-9Zn-lAl, were used to mount passive components onto printed circuit boards via a re-flow soldering process. The samples were stored at 150 deg. C for 200, 400, 600, 800, and 1100 h. The microstructures of the samples after aged at 150 deg. C for various times were characterized using optical microscopy (OM), scanning electron microscopy (SEM), energy dispersive spectrometry (EDS) and the analyzed of solder joint shear strengths. The joint strength between Sn-8Zn-3Bi and Cu pad was about 4.0 ± 0.3 kg, while the strength between Sn-9Zn-lAl and Cu pad had values of 2.6 ± 0.1 kg. Both kinds of solder joints exhibited reduced strengths with increasing aging times. After aging at 150 deg. C for 1100 h, the joints strengths of Sn-8Zn-3Bi and Sn-9Zn-lAl were 1.8 ± 0.3 and 1.7 ± 0.3 kg, respectively. Both the Sn-8Zn-3Bi and Sn-9Zn-lAl joints showed brittle fracture behaviors. A flat layer of Cu5Zn8 intermetallic compound (IMC) was formed between Sn-8Zn-3Bi solder and Cu pad after reflow. When the aging time was increased to 400 h, Zn-depletion and formation of Cu6Sn5 IMC were observed in the solders due to the interaction between the tin and zinc compounds. The interaction between Sn-9Zn-lAl solder and Cu pad had similar behavior, however, Cu6Sn5 IMC formed in Sn-9Zn-lAl solder when after aging at 150 deg. C for 600 h. As the aging time increased, both types of solders generated clear IMC spalling layers with large and continuous voids. Those voids substantially decreased the joint strength

  17. Interfacial microstructures and solder joint strengths of the Sn-8Zn-3Bi and Sn-9Zn-lAl Pb-free solder pastes on OSP finished printed circuit boards

    Energy Technology Data Exchange (ETDEWEB)

    Lin, C.-T. [Department of Materials Science and Engineering, National United University, 1 Lein-Da, Kung-Ching Li, Miaoli 36003, Taiwan (China); Electronics and Optoelectronics Research Laboratories, Industrial Technology Research Institute, 195 Section 4, Chung-Hsing Road, Chutung, Hsinchu 31040, Taiwan (China); Hsi, C.-S. [Department of Materials Science and Engineering, National United University, 1 Lein-Da, Kung-Ching Li, Miaoli 36003, Taiwan (China); Wang, M.-C. [Faculty of Fragrance and Cosmetics, Kaohsiung Medical University, 100 Shih-Chuan 1st Road, Kaohsiung 807, Taiwan (China)], E-mail: mcwang@kmu.edu.tw; Chang, T.-C.; Liang, M.-K. [Electronics and Optoelectronics Research Laboratories, Industrial Technology Research Institute, 195 Section 4, Chung-Hsing Road, Chutung, Hsinchu 31040, Taiwan (China)

    2008-07-14

    Two kinds of lead-free solders, Sn-8Zn-3Bi and Sn-9Zn-lAl, were used to mount passive components onto printed circuit boards via a re-flow soldering process. The samples were stored at 150 deg. C for 200, 400, 600, 800, and 1100 h. The microstructures of the samples after aged at 150 deg. C for various times were characterized using optical microscopy (OM), scanning electron microscopy (SEM), energy dispersive spectrometry (EDS) and the analyzed of solder joint shear strengths. The joint strength between Sn-8Zn-3Bi and Cu pad was about 4.0 {+-} 0.3 kg, while the strength between Sn-9Zn-lAl and Cu pad had values of 2.6 {+-} 0.1 kg. Both kinds of solder joints exhibited reduced strengths with increasing aging times. After aging at 150 deg. C for 1100 h, the joints strengths of Sn-8Zn-3Bi and Sn-9Zn-lAl were 1.8 {+-} 0.3 and 1.7 {+-} 0.3 kg, respectively. Both the Sn-8Zn-3Bi and Sn-9Zn-lAl joints showed brittle fracture behaviors. A flat layer of Cu{sub 5}Zn{sub 8} intermetallic compound (IMC) was formed between Sn-8Zn-3Bi solder and Cu pad after reflow. When the aging time was increased to 400 h, Zn-depletion and formation of Cu{sub 6}Sn{sub 5} IMC were observed in the solders due to the interaction between the tin and zinc compounds. The interaction between Sn-9Zn-lAl solder and Cu pad had similar behavior, however, Cu{sub 6}Sn{sub 5} IMC formed in Sn-9Zn-lAl solder when after aging at 150 deg. C for 600 h. As the aging time increased, both types of solders generated clear IMC spalling layers with large and continuous voids. Those voids substantially decreased the joint strength.

  18. Design and implementation of a hybrid circuit system for micro sensor signal processing

    Energy Technology Data Exchange (ETDEWEB)

    Wang Zhuping; Chen Jing; Liu Ruqing, E-mail: wangzhuping169@163.com [School of Information and Electronics, Beijing Institute of Technology, Beijing 100081 (China)

    2011-04-15

    This paper covers a micro sensor analog signal processing circuit system (MASPS) chip with low power and a digital signal processing circuit board implementation including hardware connection and software design. Attention has been paid to incorporate the MASPS chip into the digital circuit board. The ultimate aim is to form a hybrid circuit used for mixed-signal processing, which can be applied to a micro sensor flow monitoring system. (semiconductor integrated circuits)

  19. Assembly Manual for the Berkeley Lab Cosmic Ray Detector

    CERN Document Server

    Collier, M

    2002-01-01

    The Berkeley Lab Cosmic Ray Detector consists of 3 main components that must be prepared separately before they can be assembled. These components are the scintillator, circuit board, and casing. They are described in the main sections of this report, which may be completed in any order. Preparing the scintillator paddles involves several steps--cutting the scintillator material to the appropriate size and shape, preparing and attaching Lucite cookies (optional), polishing the edges, gluing the end to the photomultiplier tube (optional), and wrapping the scintillator. Since the detector has 2 paddles, each of the sections needs to be repeated for the other paddle.

  20. Assembly Manual for the Berkeley Lab Cosmic Ray Detector

    International Nuclear Information System (INIS)

    The Berkeley Lab Cosmic Ray Detector consists of 3 main components that must be prepared separately before they can be assembled. These components are the scintillator, circuit board, and casing. They are described in the main sections of this report, which may be completed in any order. Preparing the scintillator paddles involves several steps--cutting the scintillator material to the appropriate size and shape, preparing and attaching Lucite cookies (optional), polishing the edges, gluing the end to the photomultiplier tube (optional), and wrapping the scintillator. Since the detector has 2 paddles, each of the sections needs to be repeated for the other paddle

  1. Assembly Manual for the Berkeley Lab Cosmic Ray Detector

    Energy Technology Data Exchange (ETDEWEB)

    Collier, Michael

    2002-12-17

    The Berkeley Lab Cosmic Ray Detector consists of 3 main components that must be prepared separately before they can be assembled. These components are the scintillator, circuit board, and casing. They are described in the main sections of this report, which may be completed in any order. Preparing the scintillator paddles involves several steps--cutting the scintillator material to the appropriate size and shape, preparing and attaching Lucite cookies (optional), polishing the edges, gluing the end to the photomultiplier tube (optional), and wrapping the scintillator. Since the detector has 2 paddles, each of the sections needs to be repeated for the other paddle.

  2. HIGH-RESOLUTION LABORATORY SPECTRA OF THE λ193 CHANNEL OF THE ATMOSPHERIC IMAGING ASSEMBLY INSTRUMENT ON BOARD SOLAR DYNAMICS OBSERVATORY

    International Nuclear Information System (INIS)

    Extreme ultraviolet spectra of C, O, F, Ne, S, Ar, Fe, and Ni have been excited in an electron beam ion trap and studied with much higher resolution than available on the Solar Dynamics Observatory (SDO) in order to ascertain the spectral composition of the SDO/Atmospheric Imaging Assembly (AIA) observations. We present our findings in the wavelength range 182-200 Å, which, overall, corroborate the working models of how to interpret the SDO/AIA data. We find, however, that the inclusion of a number of additional lines might improve the data interpretation

  3. Cosmic Ray Physics at a Community College: Assembly, Detection and Measurement

    Science.gov (United States)

    Fan, Sewan; Davis, Scott; Osornio, Leo; Haag, Brooke

    2012-03-01

    During an in-depth eight week summer research program at Hartnell Community College in Salinas, CA, we constructed two complementary experimental systems to measure cosmic rays. One system used NIM electronic modules configured for coincidence measurement. To detect the comic rays, two photomultiplier tubes each coupled to plastic scintillator paddles were assembled. The other system was build from a circuit board designed by the LBL Cosmic Ray Project. Extensive prototype and diagnosis for this board were done prior to final soldering of the parts. The dependence of the cosmic ray flux on the separation between scintillator paddles was measured and showed reasonable agreement with the accepted value. The flux dependence on the square of the cosine of the polar angle was also tested, and our result showed closely the expected cosine behavior using the NIM setup. As for the LBL Lab circuit board, it was difficult to obtain reliable coincidence counts for large polar angles probably due to the lack of an adjustable discriminator control. This was compensated for by operating the detectors at a lower high voltage which reduced the random counts, without affecting signals. This strategy gave a more reliable cosmic ray flux result using the Berkeley Lab circuit board.

  4. Research Progress of Gold Bio-leaching Technology from Waste Printed Circuit Board%电子垃圾中金的生物浸取技术研究进展

    Institute of Scientific and Technical Information of China (English)

    梁昌金

    2015-01-01

    With the continuous development of science and technology, electronic equipments renew fast-er and faster. If these waste equipments can be used environmentally friendly, not only can they reduce the envi-ronmental pressure, but also can make up for the shortage of resources. Biological metallurgy is a rapid develop-ment of technology, which can overcome the problems of traditional pyrometallurgy and hydrometallurgy exist-ing in the metal recycling, and is a promising green metallurgical method. As a means of biological metallurgy, using cyanide-generating bacteria to leach gold from waste printed circuit board powder it has attracted a great attention in recent years. This paper introduces research progress of gold bio-leaching technology, especially the gold leaching technology of cyanide-generating bacteria, then analyses its mechanism, gold leaching pro-cess, influencing factors, and the limitation of gold bio-leaching technology. Finally it points out that the biolog-ical method combined with physical and chemical methods, complement each other, is the development trend of gold bioleaching.%随着经济的增长和科技的进步,电子垃圾成为全球增长最快的垃圾。如果能用环境友好型的方式对电子垃圾中的有用资源进行回收,不仅可以减少环境压力,而且还可以弥补资源的短缺。生物冶金是一种快速发展的技术,它可以克服传统的湿法冶金和火法冶金在金属回收中存在的问题,是一种很有前途的绿色环保的冶金方法。作为生物冶金的一种方式,利用产氰细菌从废弃印刷线路板粉末中提取金,近年来更受到人们的关注。文章对生物浸金技术,尤其是产氰生物的浸金技术作了综述,分析了其在浸金过程中的机理、过程、影响因素,以及生物浸金技术的限制,最后指出将生物法与物理、化学方法相结合,取长补短,是未来生物浸金的发展趋势。

  5. 废弃印刷线路板资源化与无害化处理研究进展%Progress in Study of Recycling and Innocuous Treatment of Waste Printed Circuit Boards

    Institute of Scientific and Technical Information of China (English)

    刘维桥; 尚通明; 雷卫宁; 周全法

    2011-01-01

    From the viewpoints of renewable resource and environment protection, the recycling of waste printed circuit boards (PCBs) draw wide concerns as the amounts of waste PCBs increase dramatically. However recycling technology for waste PCBs in China is still immature. Current primary means for reusing waste PCBs were introduced, including incineration, chemical treatment, pyrolysis and mechanical treatment methods, with analysis of their advantages and disadvantages. New technologies being developed in recycling waste PCBs were described, including supercritical fluid process, biological process and plasma process. Directions for development of the technologies in recycling waste PCBs in future were discussed as well. It was proposed that technical transformation of existing methods should be continually strengthened. Efforts of study on new teehnologies and methods for recycling waste PCBs should be increased. Studies on recovery of NMFs from waste PCBs which included green recycling of flame retardants and development of new renewable and biodegradable materials should be concerned.%从资源再生的利用与环境保护的观点来看,随着废弃印刷线路板的迅速增加,回收废弃印刷线路板得到了越来越广泛的关注.然而,目前对废弃印刷线路板回收的技术还不够成熟.文章介绍了目前回收废弃印刷线路板的主要方法,包括焚烧法、化学处理法、热解法和机械处理法等,分析了各种方法的优缺点以及技术改进情况.综述了当前正在研究开发的回收废弃印刷线路板的新技术方法,包括超临界流体法、生物处理法和等离子体熔炼法等,总结了其研究进展情况.最后对回收废弃印刷线路板未来技术发展的方向进行了展望,指出了应加大在如下三个方面的研究力度.一是加强对目前已经采用的方法进行技术革新;二是增加对新方法新技术的研究投入;三是重视对废弃印刷线路板中非金属部分

  6. Single Event Transients in Linear Integrated Circuits

    Science.gov (United States)

    Buchner, Stephen; McMorrow, Dale

    2005-01-01

    On November 5, 2001, a processor reset occurred on board the Microwave Anisotropy Probe (MAP), a NASA mission to measure the anisotropy of the microwave radiation left over from the Big Bang. The reset caused the spacecraft to enter a safehold mode from which it took several days to recover. Were that to happen regularly, the entire mission would be compromised, so it was important to find the cause of the reset and, if possible, to mitigate it. NASA assembled a team of engineers that included experts in radiation effects to tackle the problem. The first clue was the observation that the processor reset occurred during a solar event characterized by large increases in the proton and heavy ion fluxes emitted by the sun. To the radiation effects engineers on the team, this strongly suggested that particle radiation might be the culprit, particularly when it was discovered that the reset circuit contained three voltage comparators (LM139). Previous testing revealed that large voltage transients, or glitches appeared at the output of the LM139 when it was exposed to a beam of heavy ions [NI96]. The function of the reset circuit was to monitor the supply voltage and to issue a reset command to the processor should the voltage fall below a reference of 2.5 V [PO02]. Eventually, the team of engineers concluded that ionizing particle radiation from the solar event produced a negative voltage transient on the output of one of the LM139s sufficiently large to reset the processor on MAP. Fortunately, as of the end of 2004, only two such resets have occurred. The reset on MAP was not the first malfunction on a spacecraft attributed to a transient. That occurred shortly after the launch of NASA s TOPEX/Poseidon satellite in 1992. It was suspected, and later confirmed, that an anomaly in the Earth Sensor was caused by a transient in an operational amplifier (OP-15) [KO93]. Over the next few years, problems on TDRS, CASSINI, [PR02] SOHO [HA99,HA01] and TERRA were also attributed

  7. Data-Acquisition Board For IBM PS/2 Computer

    Science.gov (United States)

    Hoang, Phuong-Dung T.

    1990-01-01

    Circuit board containing microprocessors designed to control acquisition of data by IBM PS/2 computer. Plugged into one of 16-bit slots on mother board of computer. Controls transfer of data from as many as 48 discrete channels to Micro Channel Interface. With expansion of software, board recognizes and filters specified kinds of signal patterns, possibly to detect errors.

  8. Developing Planetary Protection Technology: Microbial Diversity and Radiation Resistance of Microorganisms in a Spacecraft Assembly Facility.

    Science.gov (United States)

    Chen, F.; La Duc, M. T.; Baker, A.; Koukol, R.; Barengoltz, J.; Kern, R.; Venkateswaran, K.

    2001-12-01

    Europa has attracted much attention as evidence suggests the presence of a liquid ocean beneath this Jupiter moon's frozen crust. Such an environment might be conducive to the origins of life. Since robotic exploration of Europa is being planned, it becomes crucial to prepare for bio-burden reduction of hardware assembled for Europa missions to avoid contamination of Europa's pristine environment. In this study, we examined the microbial diversity of samples collected from two flight-ready circuit boards and their assembly facility. Also, because Jupiter's strong radiation environment may be able to reduce the viable microbial contamination on flight components, we have also studied the effects of radiation on microbial communities found to be associated with the space-flight hardware and/or present in the assembly facility. Surface samples thought to be representative of considerable human contact were collected from two circuit boards and various locations within the assembly facility using polyester swabs (swab samples). Likewise, sterile wipes were used to sample a shelf above the workstation where the circuit boards were assembled and the floor of the facility (wipe samples). The swab and wipe samples were pooled separately and divided into two halves, one of which was irradiated with 1Mrad gamma radiation for 5.5 hours, the other was not irradiated. About 1.2x104 and 6x104 CFUs/m2 cultivable microbes were detected in the swab and wipe samples, respectively. Radiation proved effective in inhibiting the growth of most microbes. Further characterization of the bacterial colonies observed in the irradiated swab and wipe samples is necessary to determine the degree of the radiation resistance. The16S rDNA sequence analysis of the cultivable microbes indicated that the assembly facility consists mostly of the members of actinobacteria, corynebacteria and pseudomonads. However, the swab samples that include the circuit boards were predominantly populated with

  9. Controllable circuit

    DEFF Research Database (Denmark)

    2010-01-01

    A switch-mode power circuit comprises a controllable element and a control unit. The controllable element is configured to control a current in response to a control signal supplied to the controllable element. The control unit is connected to the controllable element and provides the control...

  10. A Research on the Application of the Multi-stage Countercurrent Cleaning Process Principle during Circuit Board Production%电镀、线路板生产过程多级串联逆流清洗工艺的应用研究

    Institute of Scientific and Technical Information of China (English)

    余秋良

    2012-01-01

    文章通过对多级串联逆流清洗工艺原理,以及工艺中的清洗级数、清洗水量和清洗时间等影响因素的研究,结合某线路板企业清洁生产改造的应用进行实例分析,得到该工艺有利于电镀和线路板生产企业大幅度节水和节省成本的结论,并提出清洗级数、末级清洗槽浓度等有关参数控制的建议。%The paper mainly conducted a research on the multi-stage countercurrent cleaning process principle, as well as influencing factors of the process such as its cleaning stages, cleaning water quantity and cleaning time. Combined with a case study on the application of clean production reformation by a circuit board enterprise, the paper concluded that the process was in favor of water-saving and cost-saving for circuit board manufacturers. It also proposes suggestions on relevant parameters such as the cleaning series and the concentration of final stage cleaning.

  11. Discharge quenching circuit for counters

    International Nuclear Information System (INIS)

    A circuit for quenching discharges in gas-discharge detectors with working voltage of 3-5 kV based on transistors operating in the avalanche mode is described. The quenching circuit consists of a coordinating emitter follower, amplifier-shaper for avalanche key cascade control which changes potential on the counter electrodes and a shaper of discharge quenching duration. The emitter follower is assembled according to a widely used flowsheet with two transistors. The circuit permits to obtain a rectangular quenching pulse with front of 100 ns and an amplitude of up to 3.2 kV at duration of 500 μm-8 ms. Application of the quenching circuit described permits to obtain countering characteristics with the slope less than or equal to 0.02%/V and plateau extent greater than or equal to 300 V

  12. Design and implementation of a hybrid circuit system for micro sensor signal processing*

    Institute of Scientific and Technical Information of China (English)

    Wang Zhuping; Chen Jing; Liu Ruqing

    2011-01-01

    This paper covers a micro sensor analog signal processing circuit system (MASPS) chip with low power and a digital signal processing circuit board implementation including hardware connection and software design.Attention has been paid to incorporate the MASPS chip into the digital circuit board. The ultimate aim is to form a hybrid circuit used for mixed-signal processing, which can be applied to a micro sensor flow monitoring system.

  13. Evolvable designs of experiments applications for circuits

    CERN Document Server

    Iordache, Octavian

    2009-01-01

    Adopting a groundbreaking approach, the highly regarded author shows how to design methods for planning increasingly complex experiments. He begins with a brief introduction to standard quality methods and the technology in standard electric circuits. The book then gives numerous examples of how to apply the proposed methodology in a series of real-life case studies. Although these case studies are taken from the printed circuit board industry, the methods are equally applicable to other fields of engineering.

  14. Irradiation device for electronic circuits

    International Nuclear Information System (INIS)

    The device includes a radiation-tight vessel, a mobile carriage for a radioactive source, a vertically mobile plate carrying a circuit to be tested and an irradiation detector. It includes also a cover related to the vacuum vessel which prevents the source from emitting for a certain source position. It includes also means which prevents irradiation when the vessel is not assembled and which prevents the dismantling when the source is radiating. It includes also a device allowing to disconnect the translation displacement controls of the circuit and of the radiation detector when the source is radiating

  15. EDA circuit simulation

    International Nuclear Information System (INIS)

    EDA technique is used for circuit simulation. The circuit simulation and the analysis are made for a gate circuit one-shot multivibrator. The result shows: EDA circuit simulation is very useful technique

  16. Analog and VLSI circuits

    CERN Document Server

    Chen, Wai-Kai

    2009-01-01

    Featuring hundreds of illustrations and references, this book provides the information on analog and VLSI circuits. It focuses on analog integrated circuits, presenting the knowledge on monolithic device models, analog circuit cells, high performance analog circuits, RF communication circuits, and PLL circuits.

  17. Circuits courts

    OpenAIRE

    Dubuisson-Quellier, Sophie

    2015-01-01

    Si la notion de circuit court est aujourd’hui largement reprise par les médias comme un phénomène assez typique de la fin du 20ème siècle, il convient de considérer que la vente directe est aussi ancienne que l’agriculture elle-même. Au tournant des années 2000, elle est surtout devenu un moyen, pour ceux qui la promeuvent de souligner que les distances tant géographiques qu’organisationnelles entre ceux qui produisent et ceux qui consomment sont devenus trop longues et doivent être raccourci...

  18. Enhancing board effectiveness.

    Science.gov (United States)

    Curran, Connie R; Totten, Mary K

    2010-01-01

    Like any other job, board work is associated with specific competencies. Competencies are the combination of knowledge, skills, personal characteristics, and behaviors needed to perform a job or task effectively. Boards are only as strong as their weakest member. Board education should focus on improving the knowledge and skills of the board and individual members and on overall board performance. Assessment of individual board member performance is designed to evaluate the trustee's knowledge of board roles and responsibilities and the expectations of board members. Board effectiveness is built through competency-based board member recruitment and selection; board member education and development; and evaluation of board, board member, and meeting performance. PMID:21291066

  19. LOGIC CIRCUIT

    Science.gov (United States)

    Strong, G.H.; Faught, M.L.

    1963-12-24

    A device for safety rod counting in a nuclear reactor is described. A Wheatstone bridge circuit is adapted to prevent de-energizing the hopper coils of a ball backup system if safety rods, sufficient in total control effect, properly enter the reactor core to effect shut down. A plurality of resistances form one arm of the bridge, each resistance being associated with a particular safety rod and weighted in value according to the control effect of the particular safety rod. Switching means are used to switch each of the resistances in and out of the bridge circuit responsive to the presence of a particular safety rod in its effective position in the reactor core and responsive to the attainment of a predetermined velocity by a particular safety rod enroute to its effective position. The bridge is unbalanced in one direction during normal reactor operation prior to the generation of a scram signal and the switching means and resistances are adapted to unbalance the bridge in the opposite direction if the safety rods produce a predetermined amount of control effect in response to the scram signal. The bridge unbalance reversal is then utilized to prevent the actuation of the ball backup system, or, conversely, a failure of the safety rods to produce the predetermined effect produces no unbalance reversal and the ball backup system is actuated. (AEC)

  20. Short- circuit tests of circuit breakers

    OpenAIRE

    Chorovský, P.

    2015-01-01

    This paper deals with short-circuit tests of low voltage electrical devices. In the first part of this paper, there are described basic types of short- circuit tests and their principles. Direct and indirect (synthetic) tests with more details are described in the second part. Each test and principles are explained separately. Oscilogram is obtained from short-circuit tests of circuit breakers at laboratory. The aim of this research work is to propose a test circuit for performing indirect test.

  1. Grounding and shielding circuits and interference

    CERN Document Server

    Morrison, Ralph

    2016-01-01

    Applies basic field behavior in circuit design and demonstrates how it relates to grounding and shielding requirements and techniques in circuit design This book connects the fundamentals of electromagnetic theory to the problems of interference in all types of electronic design. The text covers power distribution in facilities, mixing of analog and digital circuitry, circuit board layout at high clock rates, and meeting radiation and susceptibility standards. The author examines the grounding and shielding requirements and techniques in circuit design and applies basic physics to circuit behavior. The sixth edition of this book has been updated with new material added throughout the chapters where appropriate. The presentation of the book has also been rearranged in order to reflect the current trends in the field.

  2. Editorial Board

    Institute of Scientific and Technical Information of China (English)

    2013-01-01

    2011-2015 The World Journal of Gastrointestinal Pharmacology and Therapeutics Editorial Board consists of 411 members, representing a team of worldwide experts in surgery research. They are from 47 countries, including Argentina (3), Australia (13), Austria (4), Belarus (1), Belgium (3), Brazil (10), Canada (10), China (41), Czech Republic (1), Denmark (1), Egypt (3), Estonia (1), Finland

  3. Editorial Board

    Institute of Scientific and Technical Information of China (English)

    2013-01-01

    2011-2015 The World Journal of Gastrointestinal Pharmacology and Therapeutics Editorial Board consists of 411 members,representing a team of worldwide experts in surgery research.They are from 47 countries,including Argentina(3),Australia(13),Austria(4),Belarus(1),Belgium(3),Brazil(10),Canada(10),China(41),Czech Republic(1),Denmark

  4. Multiplication circuit for particle identification

    International Nuclear Information System (INIS)

    After having commented some characteristics of the particles present in a cyclotron, and their interactions, this report addresses the development and the implementation of a method and a device for selecting and counting particles. The author presents the principle and existing techniques of selection. In comparison with an existing device, the proportional counter and the scintillator are replaced by junctions: a surface barrier type junction (a silicon N layer with a very thin oxygen layer playing the role of the P layer), and lithium-based junction (a silicon P type layer made intrinsic by migration of lithium). The author then describes the developed circuit and assembly (background of the choice of a multiplication circuit), and their operation. In the next part, he presents the performed tests and discuses the obtained results. He finally outlines the benefits of the herein presented circuit

  5. Collective of mechatronics circuit

    International Nuclear Information System (INIS)

    This book is composed of three parts, which deals with mechatronics system about sensor, circuit and motor. The contents of the first part are photo sensor of collector for output, locating detection circuit with photo interrupts, photo sensor circuit with CdS cell and lamp, interface circuit with logic and LED and temperature sensor circuit. The second part deals with oscillation circuit with crystal, C-R oscillation circuit, F-V converter, timer circuit, stability power circuit, DC amp and DC-DC converter. The last part is comprised of bridge server circuit, deformation bridge server, controlling circuit of DC motor, controlling circuit with IC for PLL and driver circuit of stepping motor and driver circuit of Brushless.

  6. Synthetic circuits, devices and modules

    OpenAIRE

    Zhang, Hong; Jiang, Taijiao

    2010-01-01

    The aim of synthetic biology is to design artificial biological systems for novel applications. From an engineering perspective, construction of biological systems of defined functionality in a hierarchical way is fundamental to this emerging field. Here, we highlight some current advances on design of several basic building blocks in synthetic biology including the artificial gene control elements, synthetic circuits and their assemblies into devices and modules. Such engineered basic buildi...

  7. Theoretical and experimental characterization of heat dissipation in a board-level microelectronic component

    International Nuclear Information System (INIS)

    In this study, the steady-state heat transfer characteristics of a board-level microelectronic component in natural convection are investigated through numerical modeling and experimental validation. A typical plastic ball grid array (PBGA) package assembled to a piece of printed circuit board (PCB) is considered as the test vehicle. To achieve the goal, a three-dimensional (3D) finite element (FE) modeling technique that utilizes an effective heat conduction FE model together with empirical heat transfer (HT) coefficient correlation models for describing surface heat transfer of the electronic assemblies is applied for theoretical characterization while an infrared thermography-based technique (IRT) that incorporates FE modeling and IR thermography measurement, and a thermal test die measurement (TTDM) technique are applied for experimental validation. To facilitate the IR thermography measurement, the black paint coating technique is applied. The emissivity and optimal thickness of the specific black paint are explored through simple experiments. Besides, the uncertainty in the TTDM for the chip junction temperature measurement is also assessed. By the validated theoretical analysis model, numerical investigation of heat transfer enhancements, such as thermal balls and thermal vias, in the board-level microelectronic component is also accomplished, and eventually, an extensive thermal design guideline is accordingly provided

  8. Buddy Board

    DEFF Research Database (Denmark)

    Enggaard, Helle; Moselund, Lene

    2015-01-01

    Projekt ’BuddyBoard’ er kommet i stand via et samarbejde mellem Frederikshavn kommune, Bunker43 og Lab. X. Afdeling en ’Havly’ på Sæby Ældrecenter fungerer som living lab, hvilket betyder, at det udgør et levende laboratorium for udvikling og afprøvning af teknologi (Schultz, 2013). Projektet er....... Bunker43 har udviklet en teknologi (BuddyBoard) til hurtig formidling af billeder fra pårørende og personale til beboere på institutioner. Pårørende og personale uploader billeder via en APP eller en hjemmeside og har mulighed for at tilføje en kort forklarende tekst til hvert billede. Beboeren ser...... billederne via en tablet. Systemet bygger på et simpelt og brugervenligt design, så ældre med kognitive og/eller fysiske funktionsnedsættelser kan anvende teknologien. BuddyBoard fungerer via internettet, og billederne gemmes på en sikret server hos udbyderen, som er Bunker43. Intentionerne med BuddyBoard er...

  9. Challenges for the introduction of board-level optical interconnect technology into product development roadmaps

    Science.gov (United States)

    Berger, Christoph; Offrein, Bert Jan; Schmatz, Martin

    2006-02-01

    Optical interconnects have gradually replaced electrical interconnects in the long-distance telecom, local-area, and rackto- rack link classes. We believe that this transition will also happen in the card-backplane-card datacom link class, both for bandwidth*length reasons and for density reasons. In analogy to the transition from individually wired boards to integrated printed circuit boards, we believe that eventually board-level optical interconnects will be based on an integrated technology such as board-embedded waveguides. In order to bring optical waveguide technology into mainstream product development plans, however, numerous challenges on many levels have to be met. Problems to be tackled span from the base level of materials (stability, processability) and devices (reliability, lifetime), over the subsystem level of packages (concepts, cost-efficient assembly and alignment) all the way up to the system level (link architecture, system packaging, heat management). A sustainable solution can only be reached if the development of all individual technology components is done with the whole system in mind. Important figures of merit are the cost per gigabit per second, the power per gigabit per second, and the maturity/reliability of the technology. We will give an overview of our optical interconnect activity, with respect to these challenges. We will discuss the options, explain our technology decisions and present some results of our multi-disciplinary activity.

  10. Analog circuit design designing dynamic circuit response

    CERN Document Server

    Feucht, Dennis

    2010-01-01

    This second volume, Designing Dynamic Circuit Response builds upon the first volume Designing Amplifier Circuits by extending coverage to include reactances and their time- and frequency-related behavioral consequences.

  11. Photomultiplier blanking circuit

    Science.gov (United States)

    Mcclenahan, J. O.

    1972-01-01

    Circuit for protecting photomultiplier equipment from current surges which occur when exposed to brilliant illumination is discussed. Components of circuit and details of operation are provided. Circuit diagram to show action of blanking pulse on zener diode is included.

  12. Analog circuit design designing waveform processing circuits

    CERN Document Server

    Feucht, Dennis

    2010-01-01

    The fourth volume in the set Designing Waveform-Processing Circuits builds on the previous 3 volumes and presents a variety of analog non-amplifier circuits, including voltage references, current sources, filters, hysteresis switches and oscilloscope trigger and sweep circuitry, function generation, absolute-value circuits, and peak detectors.

  13. Automatic Test Pattern Generation for Digital Circuits

    Directory of Open Access Journals (Sweden)

    S. Hemalatha

    2014-04-01

    Full Text Available Digital circuits complexity and density are increasing and at the same time it should have more quality and reliability. It leads with high test costs and makes the validation more complex. The main aim is to develop a complete behavioral fault simulation and automatic test pattern generation (ATPG system for digital circuits modeled in verilog and VHDL. An integrated Automatic Test Generation (ATG and Automatic Test Executing/Equipment (ATE system for complex boards is developed here. An approach to use memristors (resistors with memory in programmable analog circuits. The Main idea consists in a circuit design in which low voltages are applied to memristors during their operation as analog circuit elements and high voltages are used to program the memristor’s states. This way, as it was demonstrated in recent experiments, the state of memristors does not essentially change during analog mode operation. As an example of our approach, we have built several programmable analog circuits demonstrating memristor -based programming of threshold, gain and frequency. In these circuits the role of memristor is played by a memristor emulator developed by us. A multiplexer is developed to generate a class of minimum transition sequences. The entire hardware is realized as digital logical circuits and the test results are simulated in Model sim software. The results of this research show that behavioral fault simulation will remain as a highly attractive alternative for the future generation of VLSI and system-on-chips (SoC.

  14. Editorial Board

    Institute of Scientific and Technical Information of China (English)

    2014-01-01

    2012-2016 The World Journal of Gastrointestinal Surgery Editorial Board consists of 341 members,representing a team of worldwide experts in pediatrics.They are from 37 countries,including Australia(6),Austria(2),Belgium(6),Brazil(9),Bulgaria(2),Canada(8),China(29),Denmark(1),Finland(2),France(9),Germany(21),Greece(7),India(11),Ireland(3),Israel(3),Italy(50),Jamaica(1),Japan(47),Lithuania(1),Malaysia(1),Netherlands(11),Pakistan(1),Poland(1),Portugal(1),Russia(1),Saudi Arabia(1),Serbia(2),Singapore(5),South Korea(8),Spain(5),Sweden(2),Switzerland(3),Thailand(2),Tunisia(1),Turkey(8),United Kingdom(11),and United States(59).

  15. PC board mount corrosion sensitive sensor

    Science.gov (United States)

    Robinson, Alex L.; Casias, Adrian L.; Pfeifer, Kent B.; Laguna, George R.

    2016-03-22

    The present invention relates to surface mount structures including a capacitive element or a resistive element, where the element has a property that is responsive to an environmental condition. In particular examples, the structure can be optionally coupled to a printed circuit board. Other apparatuses, surface mountable structures, and methods of use are described herein.

  16. An EPLD-based time-of-arrival acquisition board for neutron coincidence counting

    International Nuclear Information System (INIS)

    A PC acquisition board for a new generation of passive assay neutron multiplicity counters is described. The board acquires the time-of-arrival of each digital pulse from a set of neutron counters together with the relevant detector identification number and stores these data in the PC memory. By statistical processing of the data safeguards verifications of plutonium bearing materials or nuclear wastes characterizations can be done. Simultaneous events from different detectors were processed sequentially (derandomized) without any data loss. A FIFO (First In First Out) bank on the board makes it possible to acquire data at a peak rate much higher than the PC bus bandwidth. All the logic circuits (input section with sequencer and channel encoder, 32-bit system clock, FIFO controller and PC bus interface) are implemented with EPLDs (Erasable Programmable Logic Devices), making it possible to fit up to 64 input channels in an AT full size board and up four boards in the PC bus. As a general rule the processing time increases with the number of input channels; exploiting the internal architecture of the EPLDs several solutions with different trade off between speed and number of inputs were analyzed. The 36 input, 100 ns speed version was built, fully Characterized and integrated in a multiplicity counting system. With an assembly driver up to 0.5 Mevents/s can be recorded with a 286 or higher based PC; the total number of events that can be continuously collected at maximum speed is limited only by the size of the PC extended memory. The board is also suited for time correlation analysis in other fields e.g. photon counting

  17. Utility design of electronic circuit

    International Nuclear Information System (INIS)

    This is comprised of eleven chapters about electronic circuit design and utility circuit for electronics, which includes the point of design on electronic circuit like logical circuit, sensor circuit and power circuit, acoustic system, image system, communication system like FSK demodulation circuit, measurement and control system, appliance, operating amplifier, conversion device, counter and timer, sensor circuit, motor control such as DC motor control circuit and stepping motor drive circuit and power device like electric current control circuit.

  18. Circuits and systems for wireless communications

    CERN Document Server

    Moschytz, George S

    2007-01-01

    Part I: RF System Integration. 1. RF System Integration; C. Toumazou. 2. RF System Board Level Integration for Mobile Phones; G.J. Aspin. 3. Integration of RF Systems on a Chip; P.J. Mole. 4. Towards the Full Integration of Wireless Front-End Circuits; M. Steyaert. 5. GSM Transceiver Front-End Circuits in 0.25 mum CMOS; Q. Huang, et al. Part II: RF Front-End Circuits. 6. RF Front-End Circuits; Q. Huang. 7. Phase-Noise-to-Carrier Ratio in LC Oscillators; Q. Huang. 8. Design Study of a 900 MHz/1.8 GHz CMOS Transceiver for Dual-Band Applications; B. Razavi. 9. Integrated Wireless Transc

  19. Low Noise Readout Circuit for Biosensor SoC

    Institute of Scientific and Technical Information of China (English)

    PAN Yin-song; KONG Mou-fu; LI Xiang-quan; WANG Li

    2008-01-01

    Presented is a low noise interface circuit that is tuned to the needs of self-assembly monolayers biosensor SoC. The correlated double sampling(CDS) unit of the readout circuit can reduce 1/f noise, KTC noise and fixed noise of micro arrays effectively. The circuit is simulated in a 0.6 μm/level 7 standard CMOS process, and the simulated results show the output voltage has a good linearity with the transducing current of the micro arrays. This is a novel circuit including four amplifiers sharing a common half-circuit and the noise reducing CDS unit. It could be widely used for micro array biosensors.

  20. New human resources policies, master of fine arts program among issues adopted by Board of Visitors

    OpenAIRE

    Hincker, Lawrence

    2008-01-01

    At today's Virginia Tech Board of Visitors meeting, the board acted upon several resolutions, including the approval of new human resources policies following the passage of the Virginia Higher Education Restructuring Act by the Virginia General Assembly in 2005.

  1. Effects of smoke on functional circuits

    Energy Technology Data Exchange (ETDEWEB)

    Tanaka, T.J.

    1997-10-01

    Nuclear power plants are converting to digital instrumentation and control systems; however, the effects of abnormal environments such as fire and smoke on such systems are not known. There are no standard tests for smoke, but previous smoke exposure tests at Sandia National Laboratories have shown that digital communications can be temporarily interrupted during a smoke exposure. Another concern is the long-term corrosion of metals exposed to the acidic gases produced by a cable fire. This report documents measurements of basic functional circuits during and up to 1 day after exposure to smoke created by burning cable insulation. Printed wiring boards were exposed to the smoke in an enclosed chamber for 1 hour. For high-resistance circuits, the smoke lowered the resistance of the surface of the board and caused the circuits to short during the exposure. These circuits recovered after the smoke was vented. For low-resistance circuits, the smoke caused their resistance to increase slightly. A polyurethane conformal coating substantially reduced the effects of smoke. A high-speed digital circuit was unaffected. A second experiment on different logic chip technologies showed that the critical shunt resistance that would cause failure was dependent on the chip technology and that the components used in the smoke exposures were some of the most smoke tolerant. The smoke densities in these tests were high enough to cause changes in high impedance (resistance) circuits during exposure, but did not affect most of the other circuits. Conformal coatings and the characteristics of chip technologies should be considered when designing circuitry for nuclear power plant safety systems, which must be highly reliable under a variety of operating and accident conditions. 10 refs., 34 figs., 18 tabs.

  2. Effects of smoke on functional circuits

    International Nuclear Information System (INIS)

    Nuclear power plants are converting to digital instrumentation and control systems; however, the effects of abnormal environments such as fire and smoke on such systems are not known. There are no standard tests for smoke, but previous smoke exposure tests at Sandia National Laboratories have shown that digital communications can be temporarily interrupted during a smoke exposure. Another concern is the long-term corrosion of metals exposed to the acidic gases produced by a cable fire. This report documents measurements of basic functional circuits during and up to 1 day after exposure to smoke created by burning cable insulation. Printed wiring boards were exposed to the smoke in an enclosed chamber for 1 hour. For high-resistance circuits, the smoke lowered the resistance of the surface of the board and caused the circuits to short during the exposure. These circuits recovered after the smoke was vented. For low-resistance circuits, the smoke caused their resistance to increase slightly. A polyurethane conformal coating substantially reduced the effects of smoke. A high-speed digital circuit was unaffected. A second experiment on different logic chip technologies showed that the critical shunt resistance that would cause failure was dependent on the chip technology and that the components used in the smoke exposures were some of the most smoke tolerant. The smoke densities in these tests were high enough to cause changes in high impedance (resistance) circuits during exposure, but did not affect most of the other circuits. Conformal coatings and the characteristics of chip technologies should be considered when designing circuitry for nuclear power plant safety systems, which must be highly reliable under a variety of operating and accident conditions. 10 refs., 34 figs., 18 tabs

  3. Demonstrating the Effect of Particle Impact Dampers on the Random Vibration Response and Fatigue Life of Printed Wiring Assemblies

    Science.gov (United States)

    Knight, Brent; Montgomery, Randall; Geist, David; Hunt, Ron; LaVerde, Bruce; Towner, Robert

    2013-01-01

    In a recent experimental study, small Particle Impact Dampers (PID) were bonded directly to the surface of printed circuit board (PCB) or printed wiring assemblies (PWA), reducing the random vibration response and increasing the fatigue life. This study provides data verifying practicality of this approach. The measured peak strain and acceleration response of the fundamental out of plane bending mode was significantly attenuated by adding a PID device. Attenuation of this mode is most relevant to the fatigue life of a PWA because the local relative displacements between the board and the supported components, which ultimately cause fatigue failures of the electrical leads of the board-mounted components are dominated by this mode. Applying PID damping at the board-level of assembly provides mitigation with a very small mass impact, especially as compared to isolation at an avionics box or shelf level of assembly. When compared with other mitigation techniques at the PWA level (board thickness, stiffeners, constrained layer damping), a compact PID device has the additional advantage of not needing to be an integral part of the design. A PID can simply be bonded to heritage or commercial off the shelf (COTS) hardware to facilitate its use in environments beyond which it was originally qualified. Finite element analysis and test results show that the beneficial effect is not localized and that the attenuation is not due to the simple addition of mass. No significant, detrimental reduction in frequency was observed. Side-by-side life testing of damped and un-damped boards at two different thicknesses (0.070" and 0.090") has shown that the addition of a PID was much more significant to the fatigue life than increasing the thickness. High speed video, accelerometer, and strain measurements have been collected to correlate with analytical results.

  4. Circuit analysis for dummies

    CERN Document Server

    Santiago, John

    2013-01-01

    Circuits overloaded from electric circuit analysis? Many universities require that students pursuing a degree in electrical or computer engineering take an Electric Circuit Analysis course to determine who will ""make the cut"" and continue in the degree program. Circuit Analysis For Dummies will help these students to better understand electric circuit analysis by presenting the information in an effective and straightforward manner. Circuit Analysis For Dummies gives you clear-cut information about the topics covered in an electric circuit analysis courses to help

  5. Solid-state circuits

    CERN Document Server

    Pridham, G J

    2013-01-01

    Solid-State Circuits provides an introduction to the theory and practice underlying solid-state circuits, laying particular emphasis on field effect transistors and integrated circuits. Topics range from construction and characteristics of semiconductor devices to rectification and power supplies, low-frequency amplifiers, sine- and square-wave oscillators, and high-frequency effects and circuits. Black-box equivalent circuits of bipolar transistors, physical equivalent circuits of bipolar transistors, and equivalent circuits of field effect transistors are also covered. This volume is divided

  6. Editorial Board

    Institute of Scientific and Technical Information of China (English)

    2014-01-01

    2011-2015The World Journal of Gastrointestinal Pharmacology and Therapeutics Editorial Board consists of 411 members,representing a team of worldwide experts in surgery research.They are from 47 countries,including Argentina(3),Australia(13),Austria(4),Belarus(1),Belgium(3),Brazil(10),Canada(10),China(41),Czech Republic(1),Denmark(1),Egypt(3),Estonia(1),Finland(1),France(5),Germany(21),Greece(6),Hungary(4),India(18),Iran(6),Ireland(1),Israel(4),Italy(35),Japan(34),Lebanon(1),Lithuania(3),Mexico(2),Netherlands(10),New Zealand(2),Norway(2),Pakistan(2),Philippines(1),Poland(3),Portugal(2),Romania(1),Russia(1),Saudi Arabia(2),Singapore(3),Slovenia(1),South Africa(1),South Korea(16),Spain(13),Sweden(3),Switzerland(1),Thailand(4),Turkey(7),United Kingdom(20),and United States(84).

  7. Simple modeling for conducted common-mode current in switching circuits

    OpenAIRE

    Kchikach, M; Yuan, YS; Qian, ZM; Pong, MH

    2001-01-01

    Common mode current strongly depends on stray capacitance of each circuit node, especially those with high dv/dt and di/dt. To build a simple model for conducted common mode current in switching circuit a computer software based on Partial Element Equivalent Circuit (PEEC) method is used to calculate the parasitic elements of the printed circuit board (PCB). Simulation results agree well with experimental results up to 10 MHz.

  8. Electronic devices and circuits

    CERN Document Server

    Pridham, Gordon John

    1972-01-01

    Electronic Devices and Circuits, Volume 3 provides a comprehensive account on electronic devices and circuits and includes introductory network theory and physics. The physics of semiconductor devices is described, along with field effect transistors, small-signal equivalent circuits of bipolar transistors, and integrated circuits. Linear and non-linear circuits as well as logic circuits are also considered. This volume is comprised of 12 chapters and begins with an analysis of the use of Laplace transforms for analysis of filter networks, followed by a discussion on the physical properties of

  9. The circuit designer's companion

    CERN Document Server

    Williams, Tim

    2013-01-01

    The Circuit Designer's Companion covers the theoretical aspects and practices in analogue and digital circuit design. Electronic circuit design involves designing a circuit that will fulfill its specified function and designing the same circuit so that every production model of it will fulfill its specified function, and no other undesired and unspecified function.This book is composed of nine chapters and starts with a review of the concept of grounding, wiring, and printed circuits. The subsequent chapters deal with the passive and active components of circuitry design. These topics are foll

  10. Intuitive analog circuit design

    CERN Document Server

    Thompson, Marc

    2013-01-01

    Intuitive Analog Circuit Design outlines ways of thinking about analog circuits and systems that let you develop a feel for what a good, working analog circuit design should be. This book reflects author Marc Thompson's 30 years of experience designing analog and power electronics circuits and teaching graduate-level analog circuit design, and is the ideal reference for anyone who needs a straightforward introduction to the subject. In this book, Dr. Thompson describes intuitive and ""back-of-the-envelope"" techniques for designing and analyzing analog circuits, including transistor amplifi

  11. Linear integrated circuits

    Science.gov (United States)

    Young, T.

    This book is intended to be used as a textbook in a one-semester course at a variety of levels. Because of self-study features incorporated, it may also be used by practicing electronic engineers as a formal and thorough introduction to the subject. The distinction between linear and digital integrated circuits is discussed, taking into account digital and linear signal characteristics, linear and digital integrated circuit characteristics, the definitions for linear and digital circuits, applications of digital and linear integrated circuits, aspects of fabrication, packaging, and classification and numbering. Operational amplifiers are considered along with linear integrated circuit (LIC) power requirements and power supplies, voltage and current regulators, linear amplifiers, linear integrated circuit oscillators, wave-shaping circuits, active filters, DA and AD converters, demodulators, comparators, instrument amplifiers, current difference amplifiers, analog circuits and devices, and aspects of troubleshooting.

  12. Electrical Circuits and Water Analogies

    Science.gov (United States)

    Smith, Frederick A.; Wilson, Jerry D.

    1974-01-01

    Briefly describes water analogies for electrical circuits and presents plans for the construction of apparatus to demonstrate these analogies. Demonstrations include series circuits, parallel circuits, and capacitors. (GS)

  13. Circuits on Cylinders

    DEFF Research Database (Denmark)

    Hansen, Kristoffer Arnsfelt; Miltersen, Peter Bro; Vinay, V

    2006-01-01

    We consider the computational power of constant width polynomial size cylindrical circuits and nondeterministic branching programs. We show that every function computed by a Pi2 o MOD o AC0 circuit can also be computed by a constant width polynomial size cylindrical nondeterministic branching...... program (or cylindrical circuit) and that every function computed by a constant width polynomial size cylindrical circuit belongs to ACC0....

  14. Electric circuits essentials

    CERN Document Server

    REA, Editors of

    2012-01-01

    REA's Essentials provide quick and easy access to critical information in a variety of different fields, ranging from the most basic to the most advanced. As its name implies, these concise, comprehensive study guides summarize the essentials of the field covered. Essentials are helpful when preparing for exams, doing homework and will remain a lasting reference source for students, teachers, and professionals. Electric Circuits I includes units, notation, resistive circuits, experimental laws, transient circuits, network theorems, techniques of circuit analysis, sinusoidal analysis, polyph

  15. Virginia Board of Education Student Code of Conduct Policy Guidelines

    Science.gov (United States)

    Virginia Department of Education, 2015

    2015-01-01

    The Virginia Board of Education's "Student Conduct Policy Guidelines" were first developed in 1994 in response to action by the 1993 General Assembly requiring the Virginia Board of Education to establish such guidelines. In 2004, the "Guidelines" underwent a major revision in response to requirements of § 22.1-279.6. of the…

  16. The Committee on Directors. Foundation Relations. Board Basics.

    Science.gov (United States)

    Wilson, E. B.; Lanier, James L., Jr.

    2002-01-01

    The purpose of this booklet is to reinforce the thesis that the committee on directors of a foundation board must perform with excellence if the board as a whole is to fulfill its responsibilities with distinction. The committees principal responsibilities include assembling the right mix of director talent, training and organizing that talent,…

  17. Composition and Characteristics of Volatile Organic Chemicals Emission from Printed Circuit Board Factories%印刷电路板(PCB)厂挥发性有机物(VOCs)排放指示物筛选

    Institute of Scientific and Technical Information of China (English)

    马英歌

    2012-01-01

    Volatile organic chemicals(VOCs) emission were sampled and analyzed from three printed circuit board(PCB) factories in an industrial area in Shanghai.VOCs concentrations,compositions and source profiles were investigated.In September and December,the highest concentration of VOCs from manufacturing spaces in factory A,B and H were(2.94/2.01)×10^-9,(3.18/1.11)×10^-6,(0.70/0.18)×10^-9,respectively;while for the VOCs from the vent of waste gases,they were(0.86/0.90)×10^-9,(31.2/12.0)×10^-6,(1.24/0.30)×10^-9,respectively.Factory A total of 67 VOCs compounds of seven classes were detected,such as alkanes and its chlorine substitutes,alkene and its chlorine substitutes,benzene and its chlorine substitutes,ketone group,as well as ester.The highest concentrations in workshop/vent in A,B and H factories were 2-butanone 6.73 mg·m^-3/2-methyl-n-hexane 5.93 mg·m^-3,ethyl acetate 8.90 mg·m^-3/propane 9.64 mg·m^-3,and propone 2.04 mg·m^-3/propone 1.69 mg·m^-3,respectively.With 100% detection rate,the highest and average concentrations of benzene,toluene and xylene of all sampling sites were 0.077 mg·m^-3/0.035 mg·m^-3,0.56 mg·m^-3/0.31 mg·m^-3,0.21 mg·m^-3/0.12 mg·m^-3(m-xylene+p-xylene)and 0.081 mg·m^-3/0.050 mg·m^-3(o-xylene),respectively.According to the results of source profiles and PCA analysis,benzene,toluene,xylene,acetone and 2-butanone could be defined as the molecular markers for A and B factories.For factory H,molecular markers were alkanes chlorine substitutes and alkene chlorine substitutes,as well as benzene and its chlorine substitutes.Non-point source was located in the workshops and the production lines.Point source pollution of VOCs was from the vent of waste gases.%采用VOCs快速测定仪和SUMMA罐采样、GC/MS分析方法,采样分析了上海某工业区3个印刷电路板厂生产车间和废气排放口的VOCs含量水平、组成特征和源成分谱.结果表明,在9月和12月2

  18. Load testing circuit

    DEFF Research Database (Denmark)

    2009-01-01

    A load testing circuit a circuit tests the load impedance of a load connected to an amplifier. The load impedance includes a first terminal and a second terminal, the load testing circuit comprising a signal generator providing a test signal of a defined bandwidth to the first terminal of the load...

  19. Piezoelectric drive circuit

    Science.gov (United States)

    Treu, Jr., Charles A.

    1999-08-31

    A piezoelectric motor drive circuit is provided which utilizes the piezoelectric elements as oscillators and a Meacham half-bridge approach to develop feedback from the motor ground circuit to produce a signal to drive amplifiers to power the motor. The circuit automatically compensates for shifts in harmonic frequency of the piezoelectric elements due to pressure and temperature changes.

  20. Signal sampling circuit

    NARCIS (Netherlands)

    Louwsma, Simon Minze; Vertregt, Maarten

    2010-01-01

    A sampling circuit for sampling a signal is disclosed. The sampling circuit comprises a plurality of sampling channels adapted to sample the signal in time-multiplexed fashion, each sampling channel comprising a respective track-and-hold circuit connected to a respective analogue to digital converte

  1. Signal sampling circuit

    NARCIS (Netherlands)

    Louwsma, Simon Minze; Vertregt, Maarten

    2011-01-01

    A sampling circuit for sampling a signal is disclosed. The sampling circuit comprises a plurality of sampling channels adapted to sample the signal in time-multiplexed fashion, each sampling channel comprising a respective track-and-hold circuit connected to a respective analogue to digital converte

  2. Circuit bridging of components by smoke

    International Nuclear Information System (INIS)

    Smoke can adversely affect digital electronics; in the short term, it can lead to circuit bridging and in the long term to corrosion of metal parts. This report is a summary of the work to date and component-level tests by Sandia National Laboratories for the Nuclear Regulatory Commission to determine the impact of smoke on digital instrumentation and control equipment. The component tests focused on short-term effects such as circuit bridging in typical components and the factors that can influence how much the smoke will affect them. These factors include the component technology and packaging, physical board protection, and environmental conditions such as the amount of smoke, temperature of burn, and humidity level. The likelihood of circuit bridging was tested by measuring leakage currents and converting those currents to resistance in ohms. Hermetically sealed ceramic packages were more resistant to smoke than plastic packages. Coating the boards with an acrylic spray provided some protection against circuit bridging. The smoke generation factors that affect the resistance the most are humidity, fuel level, and burn temperature. The use of CO2 as a fire suppressant, the presence of galvanic metal, and the presence of PVC did not significantly affect the outcome of these results

  3. Circuit bridging of components by smoke

    Energy Technology Data Exchange (ETDEWEB)

    Tanaka, T.J.; Nowlen, S.P.; Anderson, D.J. [Sandia National Labs., Albuquerque, NM (United States)

    1996-10-01

    Smoke can adversely affect digital electronics; in the short term, it can lead to circuit bridging and in the long term to corrosion of metal parts. This report is a summary of the work to date and component-level tests by Sandia National Laboratories for the Nuclear Regulatory Commission to determine the impact of smoke on digital instrumentation and control equipment. The component tests focused on short-term effects such as circuit bridging in typical components and the factors that can influence how much the smoke will affect them. These factors include the component technology and packaging, physical board protection, and environmental conditions such as the amount of smoke, temperature of burn, and humidity level. The likelihood of circuit bridging was tested by measuring leakage currents and converting those currents to resistance in ohms. Hermetically sealed ceramic packages were more resistant to smoke than plastic packages. Coating the boards with an acrylic spray provided some protection against circuit bridging. The smoke generation factors that affect the resistance the most are humidity, fuel level, and burn temperature. The use of CO{sub 2} as a fire suppressant, the presence of galvanic metal, and the presence of PVC did not significantly affect the outcome of these results.

  4. Circuit design techniques for non-crystalline semiconductors

    CERN Document Server

    Sambandan, Sanjiv

    2012-01-01

    Despite significant progress in materials and fabrication technologies related to non-crystalline semiconductors, fundamental drawbacks continue to limit real-world application of these devices in electronic circuits. To help readers deal with problems such as low mobility and intrinsic time variant behavior, Circuit Design Techniques for Non-Crystalline Semiconductors outlines a systematic design approach, including circuit theory, enabling users to synthesize circuits without worrying about the details of device physics. This book: Offers examples of how self-assembly can be used as a powerf

  5. Attachment method for stacked integrated circuit (IC) chips

    Science.gov (United States)

    Bernhardt, Anthony F.; Malba, Vincent

    1999-01-01

    An attachment method for stacked integrated circuit (IC) chips. The method involves connecting stacked chips, such as DRAM memory chips, to each other and/or to a circuit board. Pads on the individual chips are rerouted to form pads on the side of the chip, after which the chips are stacked on top of each other whereby desired interconnections to other chips or a circuit board can be accomplished via the side-located pads. The pads on the side of a chip are connected to metal lines on a flexible plastic tape (flex) by anisotropically conductive adhesive (ACA). Metal lines on the flex are likewise connected to other pads on chips and/or to pads on a circuit board. In the case of a stack of DRAM chips, pads to corresponding address lines on the various chips may be connected to the same metal line on the flex to form an address bus. This method has the advantage of reducing the number of connections required to be made to the circuit board due to bussing; the flex can accommodate dimensional variation in the alignment of chips in the stack; bonding of the ACA is accomplished at low temperature and is otherwise simpler and less expensive than solder bonding; chips can be bonded to the ACA all at once if the sides of the chips are substantially coplanar, as in the case for stacks of identical chips, such as DRAM.

  6. Practical microwave circuits

    CERN Document Server

    Maas, Stephen A

    2014-01-01

    This book differentiates itself by presenting microwave and RF technology from a circuit design viewpoint, rather than a set of electromagnetic problems. The emphasis is on gaining a practical understanding of often overlooked but vital physical processes.This resource provides microwave circuit engineers with analytical techniques for understanding and designing high-frequency circuits almost entirely from a circuit point of view. Electromagnetic concepts are not avoided, but they are employed only as necessary to support circuit-theoretical ones or to describe phenomena such as radiation and

  7. Single-mode glass waveguide technology for optical interchip communication on board level

    Science.gov (United States)

    Brusberg, Lars; Neitz, Marcel; Schröder, Henning

    2012-01-01

    The large bandwidth demand in long-distance telecom networks lead to single-mode fiber interconnects as result of low dispersion, low loss and dense wavelength multiplexing possibilities. In contrast, multi-mode interconnects are suitable for much shorter lengths up to 300 meters and are promising for optical links between racks and on board level. Active optical cables based on multi-mode fiber links are at the market and research in multi-mode waveguide integration on board level is still going on. Compared to multi-mode, a single-mode waveguide has much more integration potential because of core diameters of around 20% of a multi-mode waveguide by a much larger bandwidth. But light coupling in single-mode waveguides is much more challenging because of lower coupling tolerances. Together with the silicon photonics technology, a single-mode waveguide technology on board-level will be the straight forward development goal for chip-to-chip optical interconnects integration. Such a hybrid packaging platform providing 3D optical single-mode links bridges the gap between novel photonic integrated circuits and the glass fiber based long-distance telecom networks. Following we introduce our 3D photonic packaging approach based on thin glass substrates with planar integrated optical single-mode waveguides for fiber-to-chip and chip-to-chip interconnects. This novel packaging approach merges micro-system packaging and glass integrated optics. It consists of a thin glass substrate with planar integrated singlemode waveguide circuits, optical mirrors and lenses providing an integration platform for photonic IC assembly and optical fiber interconnect. Thin glass is commercially available in panel and wafer formats and characterizes excellent optical and high-frequency properties. That makes it perfect for microsystem packaging. The paper presents recent results in single-mode waveguide technology on wafer level and waveguide characterization. Furthermore the integration in a

  8. Unconventional methods of diagnostics and repair of electronic circuits

    OpenAIRE

    Voljč, Štefan

    2011-01-01

    Diploma thesis is dealing with problems and procedures of repairing electronic boards and other electric devices that are usually not repaired due to rather high repair costs. Service centers normally have expensive service equipment which consequently led to expensive service hour. To locate the fault on very complicated printed circuit boards many expensive service hours are used. The result is that it is cheaper to throw the broken device away and replace it with new one than repair it. Th...

  9. Feedback in analog circuits

    CERN Document Server

    Ochoa, Agustin

    2016-01-01

    This book describes a consistent and direct methodology to the analysis and design of analog circuits with particular application to circuits containing feedback. The analysis and design of circuits containing feedback is generally presented by either following a series of examples where each circuit is simplified through the use of insight or experience (someone else’s), or a complete nodal-matrix analysis generating lots of algebra. Neither of these approaches leads to gaining insight into the design process easily. The author develops a systematic approach to circuit analysis, the Driving Point Impedance and Signal Flow Graphs (DPI/SFG) method that does not require a-priori insight to the circuit being considered and results in factored analysis supporting the design function. This approach enables designers to account fully for loading and the bi-directional nature of elements both in the feedback path and in the amplifier itself, properties many times assumed negligible and ignored. Feedback circuits a...

  10. 电路板卡故障红外成像智能诊断的分析与应用%AppI ication and anaIysis of inteI I igent diagnosis of infrared imaging of circuit board fauIt

    Institute of Scientific and Technical Information of China (English)

    于敏; 马丽华; 卢朝梁

    2016-01-01

    针对电路板故障诊断精度低、误差大的问题,提出了一种红外智能诊断方法.首先利用红外成像技术计算出板卡固有温度成像图和故障温度成像图,根据温差成像得到异常区域初步定位;然后结合BP 神经网络中梯度下降算法局部搜索能力强、遗传算法全局搜索能力强的特点,形成2种算法于一体的ND GA-BP神经网络算法.引进“移民算子”增加种群多样性,构造新生代种群,将遗传操作和生物学“优胜劣汰”思想结合,发挥生物学的“顶端优势”,实现种群中最优个体的筛选.将 ND GA-BP 神经网络算法应用到电路板故障红外成像智能诊断,结果表明,其诊断精度提高了31.8%,误差降低了50.01%.%In order to solve the problems of low accuracy and large error in circuit board fault diagnosis,a method of infrared intelligent diagnosis was proposed.Firstly,infrared imaging technique was used to cal-culate the intrinsic temperature imaging and failure infrared imaging,and the initial identification of the abnormal areas was obtained according to the temperature differences between them.Then combining the strong local search ability of gradient descent in BP neural network algorithm with the strong global search ability of genetic algrithm(GA),a new double GA-BP(ND GA-BP)neural network algorithm was pro-posed.The algorithm introduced"immigration operator"to increase the diversity of population to con-struct new generation populations.Genetic manipulation was combined with biological"survival of the fit-test"to achieve the best individuals population screening.Both theory and practice prove that when the ND GA-BP neural network algorithm is applied to the infrared imaging intelligent diagnosis of circuit board fault,the diagnostic accuracy is increased by 31.8% and error is reduced by 50.01%.

  11. 78 FR 37203 - Authorization of Production Activity; Subzone 196A; TTI, Inc. (Electromechanical and Circuit...

    Science.gov (United States)

    2013-06-20

    ... comment (78 FR 15683, 03-12-2013). The FTZ Board has determined that no further review of the activity is... and Circuit Protection Devices Production/Kitting); Fort Worth, Texas On February 13, 2013, TTI,...

  12. Design of a channel board used in an electronic warfare target simulator

    OpenAIRE

    Andersson, Peter

    2006-01-01

    A channel board was designed for a DRFM circuit. The DRFM is implemented in a Virtex-4 FPGA from Xilinx. In the future a similar channel board is intended to be used for target echo generation in ELSI which is an electronic warfare simulator at Saab Bofors Dynamics in Linköping. Besides the DRFM circuit the channel board consists of analog-to-digital converters, digital-to-analog converters, Ethernet plug-in board with a microcontroller, voltage regulators, FPGA configuration memory, voltage ...

  13. Design and application of cotranscriptional non-enzymatic RNA circuits and signal transducers

    OpenAIRE

    Bhadra, Sanchita; Ellington, Andrew D.

    2014-01-01

    Nucleic acid circuits are finding increasing real-life applications in diagnostics and synthetic biology. Although DNA has been the main operator in most nucleic acid circuits, transcriptionally produced RNA circuits could provide powerful alternatives for reagent production and their use in cells. Towards these goals, we have implemented a particular nucleic acid circuit, catalytic hairpin assembly, using RNA for both information storage and processing. Our results demonstrated that the desi...

  14. Exact Threshold Circuits

    DEFF Research Database (Denmark)

    Hansen, Kristoffer Arnsfelt; Podolskii, Vladimir V.

    2010-01-01

    We initiate a systematic study of constant depth Boolean circuits built using exact threshold gates. We consider both unweighted and weighted exact threshold gates and introduce corresponding circuit classes. We next show that this gives a hierarchy of classes that seamlessly interleave with the...... well-studied corresponding hierarchies defined using ordinary threshold gates. A major open problem in Boolean circuit complexity is to provide an explicit super-polynomial lower bound for depth two threshold circuits. We identify the class of depth two exact threshold circuits as a natural subclass of...... these where also no explicit lower bounds are known. Many of our results can be seen as evidence that this class is a strict subclass of depth two threshold circuits - thus we argue that efforts in proving lower bounds should be directed towards this class....

  15. Board of Directors or Supervisory Board

    DEFF Research Database (Denmark)

    Werlauff, Erik

    2009-01-01

    The article analyses the legal consequences of the choice now available to Danish public limited companies, which can now opt for a two-tier management structure, in which the management board undertakes both the day-to-day and the overall management, while a supervisory board exercises control o...

  16. PHYSICAL CHEMISTRY CHARACTERIZATION OF PRINTED CIRCUIT BOARD OF MOBILE PHONES

    OpenAIRE

    Hellington Bastos da Silva de Sant’ana; Francisco José Moura; Hugo Marcelo Veit

    2015-01-01

    Nowadays, electronics industry is the leading sector in developing new technologies. These new technologies lead to cheaper products increasing the consumption. The lifetime of such products is relatively short and soon it becomes waste, known as electronic waste. Cell phone is a common electronic waste. This waste represents an interesting raw material, because it contains large amount of base metals, considerable amount of valuable metals and also those dangerous. In this work, ...

  17. Printed Circuit Board Integrated Toroidal Radio Frequency Inductors

    DEFF Research Database (Denmark)

    Kamby, Peter; Knott, Arnold; Andersen, Michael A. E.

    Modern power semiconductors allow for switching frequencies of power converters in the very high frequency (VHF) band (30 MHz to 300 MHz). The major advantage of this frequency increase is a remarkable reduction of the size of power converters due to smaller passive components. However crucial...

  18. 78 FR 23591 - Certain Prepregs, Laminates, and Finished Circuit Boards

    Science.gov (United States)

    2013-04-19

    ... SW., Washington, DC 20436, telephone (202) 205-3065. Copies of non- confidential documents filed in... October 28, 2008. 73 FR 66919 (November 12, 2008). The complaint alleged violations of section 337 of the... investigation as to respondents VENTEC Electronics (Suzhou) Co., Ltd., VENTEC Electronics (HK) Co., Ltd.,...

  19. Waste printed circuit board recycling techniques and product utilization.

    Science.gov (United States)

    Hadi, Pejman; Xu, Meng; Lin, Carol S K; Hui, Chi-Wai; McKay, Gordon

    2015-01-01

    E-waste, in particular waste PCBs, represents a rapidly growing disposal problem worldwide. The vast diversity of highly toxic materials for landfill disposal and the potential of heavy metal vapors and brominated dioxin emissions in the case of incineration render these two waste management technologies inappropriate. Also, the shipment of these toxic wastes to certain areas of the world for eco-unfriendly "recycling" has recently generated a major public outcry. Consequently, waste PCB recycling should be adopted by the environmental communities as an ultimate goal. This article reviews the recent trends and developments in PCB waste recycling techniques, including both physical and chemical recycling. It is concluded that the physical recycling techniques, which efficiently separate the metallic and nonmetallic fractions of waste PCBs, offer the most promising gateways for the environmentally-benign recycling of this waste. Moreover, although the reclaimed metallic fraction has gained more attention due to its high value, the application of the nonmetallic fraction has been neglected in most cases. Hence, several proposed applications of this fraction have been comprehensively examined. PMID:25285997

  20. Analog circuits cookbook

    CERN Document Server

    Hickman, Ian

    2013-01-01

    Analog Circuits Cookbook presents articles about advanced circuit techniques, components and concepts, useful IC for analog signal processing in the audio range, direct digital synthesis, and ingenious video op-amp. The book also includes articles about amplitude measurements on RF signals, linear optical imager, power supplies and devices, and RF circuits and techniques. Professionals and students of electrical engineering will find the book informative and useful.

  1. Analog circuit design

    CERN Document Server

    Dobkin, Bob

    2012-01-01

    Analog circuit and system design today is more essential than ever before. With the growth of digital systems, wireless communications, complex industrial and automotive systems, designers are being challenged to develop sophisticated analog solutions. This comprehensive source book of circuit design solutions aids engineers with elegant and practical design techniques that focus on common analog challenges. The book's in-depth application examples provide insight into circuit design and application solutions that you can apply in today's demanding designs. <

  2. Stochastic Switching Circuit Synthesis

    OpenAIRE

    Wilhelm, Daniel; Bruck, Jehoshua

    2009-01-01

    Shannon in his 1938 Masterpsilas Thesis demonstrated that any Boolean function can be realized by a switching relay circuit, leading to the development of deterministic digital logic. Here, we replace each classical switch with a probabilistic switch (pswitch). We present algorithms for synthesizing circuits closed with a desired probability, including an algorithm that generates optimal size circuits for any binary fraction. We also introduce a new duality property for series-parallel stocha...

  3. Electronic devices and circuits

    CERN Document Server

    Pridham, Gordon John

    1968-01-01

    Electronic Devices and Circuits, Volume 1 deals with the design and applications of electronic devices and circuits such as passive components, diodes, triodes and transistors, rectification and power supplies, amplifying circuits, electronic instruments, and oscillators. These topics are supported with introductory network theory and physics. This volume is comprised of nine chapters and begins by explaining the operation of resistive, inductive, and capacitive elements in direct and alternating current circuits. The theory for some of the expressions quoted in later chapters is presented. Th

  4. MOS integrated circuit design

    CERN Document Server

    Wolfendale, E

    2013-01-01

    MOS Integral Circuit Design aims to help in the design of integrated circuits, especially large-scale ones, using MOS Technology through teaching of techniques, practical applications, and examples. The book covers topics such as design equation and process parameters; MOS static and dynamic circuits; logic design techniques, system partitioning, and layout techniques. Also featured are computer aids such as logic simulation and mask layout, as well as examples on simple MOS design. The text is recommended for electrical engineers who would like to know how to use MOS for integral circuit desi

  5. CMOS circuits manual

    CERN Document Server

    Marston, R M

    1995-01-01

    CMOS Circuits Manual is a user's guide for CMOS. The book emphasizes the practical aspects of CMOS and provides circuits, tables, and graphs to further relate the fundamentals with the applications. The text first discusses the basic principles and characteristics of the CMOS devices. The succeeding chapters detail the types of CMOS IC, including simple inverter, gate and logic ICs and circuits, and complex counters and decoders. The last chapter presents a miscellaneous collection of two dozen useful CMOS circuits. The book will be useful to researchers and professionals who employ CMOS circu

  6. Circuits and filters handbook

    CERN Document Server

    Chen, Wai-Kai

    2003-01-01

    A bestseller in its first edition, The Circuits and Filters Handbook has been thoroughly updated to provide the most current, most comprehensive information available in both the classical and emerging fields of circuits and filters, both analog and digital. This edition contains 29 new chapters, with significant additions in the areas of computer-aided design, circuit simulation, VLSI circuits, design automation, and active and digital filters. It will undoubtedly take its place as the engineer's first choice in looking for solutions to problems encountered in the design, analysis, and behavi

  7. Timergenerator circuits manual

    CERN Document Server

    Marston, R M

    2013-01-01

    Timer/Generator Circuits Manual is an 11-chapter text that deals mainly with waveform generator techniques and circuits. Each chapter starts with an explanation of the basic principles of its subject followed by a wide range of practical circuit designs. This work presents a total of over 300 practical circuits, diagrams, and tables.Chapter 1 outlines the basic principles and the different types of generator. Chapters 2 to 9 deal with a specific type of waveform generator, including sine, square, triangular, sawtooth, and special waveform generators pulse. These chapters also include pulse gen

  8. Logic circuit and computer

    International Nuclear Information System (INIS)

    This book contains eight chapters, which are introduction of computer like history of computer, integrated circuit, micro processor and micro computer, number system and binary code such as complement and parity bit, boolean algebra and logic circuit like karnaugh map, Quine-Mclusky, and prime implicant, integrated logic circuit such as adder, subtractor, carry propagation and magnitude comparator, order logic circuit and memory like flip-flop, serial binary adder and counter, IC logic gate such as IC logic level and ECL, development of structure of micro processor and instruction and addressing mode.

  9. Security electronics circuits manual

    CERN Document Server

    MARSTON, R M

    1998-01-01

    Security Electronics Circuits Manual is an invaluable guide for engineers and technicians in the security industry. It will also prove to be a useful guide for students and experimenters, as well as providing experienced amateurs and DIY enthusiasts with numerous ideas to protect their homes, businesses and properties.As with all Ray Marston's Circuits Manuals, the style is easy-to-read and non-mathematical, with the emphasis firmly on practical applications, circuits and design ideas. The ICs and other devices used in the practical circuits are modestly priced and readily available ty

  10. Signal sampling circuit

    OpenAIRE

    Louwsma, Simon Minze; Vertregt, Maarten

    2011-01-01

    A sampling circuit for sampling a signal is disclosed. The sampling circuit comprises a plurality of sampling channels adapted to sample the signal in time-multiplexed fashion, each sampling channel comprising a respective track-and-hold circuit connected to a respective analogue to digital converter via a respective output switch. The output switch of each channel opens for a tracking time period when the track-and-hold circuit is in a tracking mode for sampling the signal, and closes for a ...

  11. Departmental Appeals Board Decisions

    Data.gov (United States)

    U.S. Department of Health & Human Services — Decisions issued by the Chair and Board Members of the Departmental Appeals Board concerning determinations in discretionary, project grant programs, including...

  12. Pilot Boarding Areas

    Data.gov (United States)

    National Oceanic and Atmospheric Administration, Department of Commerce — Pilot boarding areas are locations at sea where pilots familiar with local waters board incoming vessels to navigate their passage to a destination port. Pilotage...

  13. Strong managers, weak boards?

    OpenAIRE

    Renee B. Adams; Ferreira, Daniel

    2009-01-01

    Many governance reform proposals are based on the view that boards have been too friendly to executives, for example, by awarding them excessive pay. Although boards are often on friendly terms with executives, it is less clear that they have systematically failed to function in the interests of shareholders. Understanding board monitoring requires a theory of boards that takes into account how firms provide incentives for their Chief Executive Officer's (CEOs) through other means. We develop...

  14. Board independence and competence

    OpenAIRE

    Wagner, Alexander F

    2011-01-01

    This paper analyzes board independence and competence as distinct, but inextricably linked aspects of board effectiveness. Competent directors add shareholder value because they have better information about the quality of projects. While a CEO cares about shareholder value, he also wants his board to behave loyally to him by agreeing to projects that give him private benefits. Because many aspects of the CEO-board relationship are not contractible, the paper studies a model of relational con...

  15. Review of the independent pressure circuit assessment work

    International Nuclear Information System (INIS)

    The paper discusses the constitution, terms of reference and method of operation of the independent committee set up in 1984 to review the work being carried out to ensure the continued safety of the Primary pressure circuits of the Steel Pressure Vesselled Magnox Nuclear Reactors operated by the Central Electricity Generating Board. (author)

  16. Scrum Board Game

    Science.gov (United States)

    van den Oord, Stefan; van de Goor, Wim

    The Scrum Board Game is a workshop for beginners. It is for people with any role (customer, developer, tester, etc.), who don’t exactly know what a Scrum Board is, or how to create one themselves. The workshop teaches the benefits of a Scrum Board, how to use it, and how to introduce it in projects.

  17. Sequence assembly

    DEFF Research Database (Denmark)

    Scheibye-Alsing, Karsten; Hoffmann, S.; Frankel, Annett Maria;

    2009-01-01

    Despite the rapidly increasing number of sequenced and re-sequenced genomes, many issues regarding the computational assembly of large-scale sequencing data have remain unresolved. Computational assembly is crucial in large genome projects as well for the evolving high-throughput technologies and...... plays an important role in processing the information generated by these methods. Here, we provide a comprehensive overview of the current publicly available sequence assembly programs. We describe the basic principles of computational assembly along with the main concerns, such as repetitive sequences...... in genomic DNA, highly expressed genes and alternative transcripts in EST sequences. We summarize existing comparisons of different assemblers and provide a detailed descriptions and directions for download of assembly programs at: http://genome.ku.dk/resources/assembly/methods.html....

  18. MiBoard: Multiplayer Interactive Board Game

    CERN Document Server

    Dempsey, Kyle B; Jackson, G Tanner; Boonthum, Chutima; Levinstein, Irwin B; McNamara, Danielle S

    2010-01-01

    Serious games have recently emerged as an avenue for curriculum delivery. Serious games incorporate motivation and entertainment while providing pointed curriculum for the user. This paper presents a serious game, called MiBoard, currently being developed from the iSTART Intelligent Tutoring System. MiBoard incorporates a multiplayer interaction that iSTART was previously unable to provide. This multiplayer interaction produces a wide variation across game trials, while also increasing the repeat playability for users. This paper presents a demonstration of the MiBoard system and the expectations for its application.

  19. Synchronizing Hyperchaotic Circuits

    DEFF Research Database (Denmark)

    Tamasevicius, Arunas; Cenys, Antanas; Namajunas, Audrius;

    1997-01-01

    Regarding possible applications to secure communications the technique of synchronizing hyperchaotic circuits with a single dynamical variable is discussed. Several specific examples including the fourth-order circuits with two positive Lyapunov exponents as well as the oscillator with a delay line...

  20. A Virtual Circuits Lab

    Science.gov (United States)

    Vick, Matthew E.

    2010-01-01

    The University of Colorado's Physics Education Technology (PhET) website offers free, high-quality simulations of many physics experiments that can be used in the classroom. The Circuit Construction Kit, for example, allows students to safely and constructively play with circuit components while learning the mathematics behind many circuit…

  1. Synchronizing Hyperchaotic Circuits

    DEFF Research Database (Denmark)

    Tamasevicius, Arunas; Cenys, Antanas; Namajunas, Audrius; Mykolaitis, Gytis; Lindberg, Erik

    1997-01-01

    Regarding possible applications to secure communications the technique of synchronizing hyperchaotic circuits with a single dynamical variable is discussed. Several specific examples including the fourth-order circuits with two positive Lyapunov exponents as well as the oscillator with a delay line...... characterized by multiple positive Lyapunov exponents are reviewd....

  2. Amplifier improvement circuit

    Science.gov (United States)

    Sturman, J.

    1968-01-01

    Stable input stage was designed for the use with a integrated circuit operational amplifier to provide improved performance as an instrumentation-type amplifier. The circuit provides high input impedance, stable gain, good common mode rejection, very low drift, and low output impedance.

  3. ELECTRICAL SIMULATION METHODOLOGY DEDICATED TO EMC DIGITAL CIRCUITS EMISSIONS ANALYSIS ON PCB

    OpenAIRE

    Dienot, J.M.; Demarcq, Yves

    2002-01-01

    Electronic CAO tools are actually efficient and helpful for circuit designers separately in many domains : RF, low-signal circuits, electromagnetic, power circuits...Nevertheless, they have to take in account the reconciliation in the future of complex electronic commands boards associated to power energy converters system integrated on closer structures, and the upsurge of electric/electromagnetic couplings in a large frequency band . In this context, we present a global modelling methodolog...

  4. Detection of transient disturbing signals on PC boards

    Directory of Open Access Journals (Sweden)

    S. Korte

    2008-05-01

    Full Text Available This paper shows a possibility to visualize signal propagation in electronic circuits. Instead of using various galvanic measurement points all over the circuit, a test method is shown which measures the radiated field of the printed circuit board. By use of a 2-dimensional positionable field probe it is possible to get an overview over the signals running on the different parts of the PCB. In order to measure transient disturbing signals and distinguish them from normal device operation, problems of probe design and triggering need to be discussed.

  5. Toward a Genetic Dissection of Cortical Circuits in the Mouse

    OpenAIRE

    Huang, Z. Josh

    2014-01-01

    The mammalian neocortex gives rise to a wide range of mental activities and consists of a constellation of interconnected areas that are built from a set of basic circuit templates. Major obstacles to understanding cortical architecture include the diversity of cell types, their highly recurrent local and global connectivity, dynamic circuit operations, and a convoluted developmental assembly process rooted in the genome. With our increasing knowledge of gene expression and developmental gene...

  6. Circuit Design: An inquiry lab activity at Maui Community College

    OpenAIRE

    Morzinski, Katie; Azucena, Oscar; Downs, Cooper; Favaloro, Tela; Park, Jung; U, Vivian

    2010-01-01

    We present an inquiry lab activity on Circuit Design that was conducted in Fall 2009 with first-year community college students majoring in Electrical Engineering Technology. This inquiry emphasized the use of engineering process skills, including circuit assembly and problem solving, while learning technical content. Content goals of the inquiry emphasized understanding voltage dividers (Kirchoff's voltage law) and analysis and optimization of resistive networks (Thevenin equivalence). We as...

  7. Boards to combine

    Science.gov (United States)

    Maggs, William Ward

    The National Research Council's Board on Earth Sciences and the Board on Mineral and Energy Resources were eliminated during the summer by a decision of the Commission on Physical Sciences, Mathematics, and Resources, which oversees both bodies, and Frank Press, president of the National Academy of Sciences. The responsibilities of the two boards will be merged into a Board on Earth Sciences and Resources, not yet formed.Raphael Kasper, executive director of the Commission, said that the boards were dissolved for two reasons. “There's been a general trend within the Academy toward bringing together the pure and applied branches of particular sciences.” BES had dealt largely with basic Earth science research, while BMER had addressed questions related to mineral resources, land use, and public policy. The Space Science Board and the Space Applications Board, also under the jurisdiction of the Commission, were combined this fall into a single body (Eos, October 18, p. 961).

  8. The Example and Summary of Single-stage and Two-stage Reverse Osmosis System in the Printed Circuit Boards Wastewater Reuse%单段式排列和二段式排列反渗透系统在印制线路板废水回用工程的实例及总结

    Institute of Scientific and Technical Information of China (English)

    吴奕波

    2012-01-01

    The paper described an example of a single-stage arrangement and two-stage arrangement of reverse osmosis systems in printed circuit boards wastewater reuse,through the comparison of the two groups under the same conditions,the results showed that: in water the TDS ≤500 mg?L-1 conditions,system recovery between 75 % and 80 %,the temperature ≤30 ℃,the quality of water could meet the conductivity ≤100 μs?cm-1 reuse requirements.Single-stage arrangement of the system energy consumption,and the salt rate was higher than the two-stage,but due to the short process cycle design,the chemical cleaning cycle was more longer;if the replacement cycle of membrane components could be extended,the design might be more economical;As for what kind of design was more economical,should be combined analysis of the replacement cycle of poor and water quality requirements and other factors.%文章介绍了单段式排列和二段式排列反渗透系统在印制线路板废水回用的实例,通过两组系统在同等条件下的对比,结果表明:在进水TDS≤500 mg.L-1,系统回收率介于75%~80%,温度≤30℃的条件下,系统产水水质均能满足电导率≤100μs.cm-1的回用要求。单段式排列在能耗、透盐率方面比二段式高,但由于采用了短流程大循环设计,化学清洗周期长;如果能延长膜元件的更换周期,单段式的设计可能会更为经济;至于何种设计更为经济,应综合分析更换周期差和水质需求等因素。

  9. Ordinary General Assembly

    CERN Multimedia

    Staff Association

    2011-01-01

    Tuesday 12 April at 14.00 Council Chamber, Bldg 503 In conformity with the Statutes of the Staff Association, an ordinary General Assembly is organized once a year (article IV.2.1). Agenda   Adoption of the Agenda Approval of the Draft Minutes of the Ordinary General Assembly of 20 April 2010 Presentation and approval of the Activity Report 2010 Presentation and approval of the Financial Report 2010 Presentation and approval of the Auditors Report 2010 Programme for 2011 Presentation et and approval of the draft budget and subscription rate 2012 Election of the Election Committee Election of the Board of Auditors Miscellaneous We remind members of article IV.3.4 in the Statutes of the Association which reads: “After having dealt with all the items on the agenda, the members may, with the consent of the Assembly, have other matters discussed, but decisions may be taken only on the items listed on the agenda. Nevertheless, the Assembly ma...

  10. Ordinary General Assembly

    CERN Multimedia

    Staff Association

    2011-01-01

    Tuesday 12 April at 14.00 Council Chamber, Bldg 503 In conformity with the Statutes of the Staff Association, an ordinary General Assembly is organized once a year (article IV.2.1). Agenda   Adoption of the Agenda Approval of the Draft Minutes of the Ordinary General Assembly of 20 April 2010 Presentation and approval of the Activity Report 2010 Presentation and approval of the Financial Report 2010 Presentation and approval of the Auditors Report 2010 Programme for 2011 Presentation and approval of the draft budget and subscription rate 2012 Election of the Election Committee Election of the Board of Auditors Miscellaneous We remind members of article IV.3.4 in the Statutes of the Association which reads: “After having dealt with all the items on the agenda, the members may, with the consent of the Assembly, have other matters discussed, but decisions may be taken only on the items listed on the agenda. Nevertheless, the Assembly may r...

  11. Ordinary General Assembly

    CERN Multimedia

    Staff Association

    2010-01-01

    Tuesday 20 April at 10.00 Council Chamber, Bldg 503 In conformity with the Statutes of the Staff Association, an ordinary General Assembly is organized once a year (article IV.2.1). Agenda   Adoption of the Agenda Approval of the Draft Minutes of the Ordinary General Assembly of 12 May 2009 Presentation and approval of the Activity Report 2009 Presentation and approval of the Financial Report 2009 Presentation and approval of the Auditors Report 2009 Programme for 2010 Presentation et and approval of the draft budget and subscription rate 2010 Election of the Election Committee Election of the Board of Auditors Miscellaneous We remind members of article IV.3.4 in the Statutes of the Association which reads: “After having dealt with all the items on the agenda, the members may, with the consent of the Assembly, have other matters discussed, but decisions may be taken only on the items listed on the agenda. Nevertheless, the Assembly may require t...

  12. Approximate circuits for increased reliability

    Energy Technology Data Exchange (ETDEWEB)

    Hamlet, Jason R.; Mayo, Jackson R.

    2015-08-18

    Embodiments of the invention describe a Boolean circuit having a voter circuit and a plurality of approximate circuits each based, at least in part, on a reference circuit. The approximate circuits are each to generate one or more output signals based on values of received input signals. The voter circuit is to receive the one or more output signals generated by each of the approximate circuits, and is to output one or more signals corresponding to a majority value of the received signals. At least some of the approximate circuits are to generate an output value different than the reference circuit for one or more input signal values; however, for each possible input signal value, the majority values of the one or more output signals generated by the approximate circuits and received by the voter circuit correspond to output signal result values of the reference circuit.

  13. Approximate circuits for increased reliability

    Energy Technology Data Exchange (ETDEWEB)

    Hamlet, Jason R.; Mayo, Jackson R.

    2015-12-22

    Embodiments of the invention describe a Boolean circuit having a voter circuit and a plurality of approximate circuits each based, at least in part, on a reference circuit. The approximate circuits are each to generate one or more output signals based on values of received input signals. The voter circuit is to receive the one or more output signals generated by each of the approximate circuits, and is to output one or more signals corresponding to a majority value of the received signals. At least some of the approximate circuits are to generate an output value different than the reference circuit for one or more input signal values; however, for each possible input signal value, the majority values of the one or more output signals generated by the approximate circuits and received by the voter circuit correspond to output signal result values of the reference circuit.

  14. Measurements of the Effects of Smoke on Active Circuits

    International Nuclear Information System (INIS)

    Smoke has long been recognized as the most common source of fire damage to electrical equipment; however, most failures have been analyzed after the fire was out and the smoke vented. The effects caused while the smoke is still in the air have not been explored. Such effects have implications for new digital equipment being installed in nuclear reactors. The U.S. Nuclear Regulatory Commission is sponsoring work to determine the impact of smoke on digital instrumentation and control. As part of this program, Sandia National Laboratories has tested simple active circuits to determine how smoke affects them. These tests included the study of three possible failure modes on a functional board: (1) circuit bridging, (2) corrosion (metal loss), and (3) induction of stray capacitance. The performance of nine different circuits was measured continuously on bare and conformably coated boards during smoke exposures lasting 1 hour each and continued for 24 hours after the exposure started. The circuit that was most affected by smoke (100% change in measured values) was the one most sensitive to circuit bridging. Its high impedance (50 MOmega) was shorted during the exposure, but in some cases recovered after the smoke was vented. The other two failure modes, corrosion and induced stray capacitance, caused little change in the function of the circuits. The smoke permanently increased resistance of the circuit tested for corrosion, implying that the cent acts were corroded. However, the change was very small (< 2%). The stray-capacitance test circuit showed very little change after a smoke exposure in either the short or long term. The results of the tests suggest that conformal coatings and type of circuit are major considerations when designing digital circuitry to be used in critical control systems

  15. Measurements of the Effects of Smoke on Active Circuits

    Energy Technology Data Exchange (ETDEWEB)

    Tanaka, T.J.

    1999-02-09

    Smoke has long been recognized as the most common source of fire damage to electrical equipment; however, most failures have been analyzed after the fire was out and the smoke vented. The effects caused while the smoke is still in the air have not been explored. Such effects have implications for new digital equipment being installed in nuclear reactors. The U.S. Nuclear Regulatory Commission is sponsoring work to determine the impact of smoke on digital instrumentation and control. As part of this program, Sandia National Laboratories has tested simple active circuits to determine how smoke affects them. These tests included the study of three possible failure modes on a functional board: (1) circuit bridging, (2) corrosion (metal loss), and (3) induction of stray capacitance. The performance of nine different circuits was measured continuously on bare and conformably coated boards during smoke exposures lasting 1 hour each and continued for 24 hours after the exposure started. The circuit that was most affected by smoke (100% change in measured values) was the one most sensitive to circuit bridging. Its high impedance (50 M{Omega}) was shorted during the exposure, but in some cases recovered after the smoke was vented. The other two failure modes, corrosion and induced stray capacitance, caused little change in the function of the circuits. The smoke permanently increased resistance of the circuit tested for corrosion, implying that the cent acts were corroded. However, the change was very small (< 2%). The stray-capacitance test circuit showed very little change after a smoke exposure in either the short or long term. The results of the tests suggest that conformal coatings and type of circuit are major considerations when designing digital circuitry to be used in critical control systems.

  16. Measurements of the effects of smoke on active circuits

    International Nuclear Information System (INIS)

    Smoke has long been recognized as the most common source of fire damage to electrical equipment; however, most failures have been analyzed after the fire was out and the smoke vented. The effects caused while the smoke is still in the air have not been explored. Such effects have implications for new digital equipment being installed in nuclear reactors. The US Nuclear Regulatory Commission is sponsoring work to determine the impact of smoke on digital instrumentation and control. As part of this program, Sandia National Laboratories has tested simple active circuits to determine how smoke affects them. These tests included the study of three possible failure modes on a functional board: (1) circuit bridging, (2) corrosion (metal loss), and (3) induction of stray capacitance. The performance of nine different circuits was measured continuously on bare and conformally coated boards during smoke exposures lasting 1 hour each and continued for 24 hours after the exposure started. The circuit that was most affected by smoke (100% change in measured values) was the one most sensitive to circuit bridging. Its high impedance (50 Mohm) was shorted during the exposure, but in some cases recovered after the smoke was vented. The other two failure modes, corrosion and induced stray capacitance, caused little change in the function of the circuits. The smoke permanently increased resistance of the circuit tested for corrosion, implying that the contacts were corroded. However, the change was very small (< 2%). The stray capacitance test circuit showed very little change after a smoke exposure in either the short or long term. The results of the tests suggest that conformal coatings and type of circuit are major considerations when designing digital circuitry to be used in critical control systems

  17. Optical integrated circuits and networks on microscale/nanoscale

    Science.gov (United States)

    Lee, El-Hang; Lee, S. G.; O, B. H.; Park, S. G.; Kim, K. H.; Song, S. H.

    2007-02-01

    We present an overview of our work on the design and fabrication of micro/nano-scale photonic circuits and networks on what we call "optical printed circuit boards" (O-PCBs) and "VLSI photonic integrated circuit chips"(VLSI-PICs) of generic and application-specific nature. The O-PCBs and photonic chips consist of 2-dimensional planar arrays of optical wires, circuits, and networks of micro/nano-scale to perform the functions of sensing, storing, transporting, processing, switching, routing, and distributing optical signals on flat boards or chips. We describe and discuss scientific and technological issues concerning the miniaturization, interconnection and integration of micro/nano-scale photonic devices, circuits, and networks leading to small and very large scale integration in terms of photonic scaling rules and discuss their use for the design and fabrication of the photonic integrated circuits and networks. Design rules for the miniaturization and integration of the micro/nano-photonic systems are discussed in comparison with those of the micro/nano-electronic systems. Materials include polymer/organic materials and silicon materials. Structural bases include photonic crystals, ring resonators, and plasmonic structures. Compatibility issues between diverse materials and devices are discussed especially in regard to applications. Recent progresses and examples are presented.

  18. Optoelectronic circuits in nanometer CMOS technology

    CERN Document Server

    Atef, Mohamed

    2016-01-01

    This book describes the newest implementations of integrated photodiodes fabricated in nanometer standard CMOS technologies. It also includes the required fundamentals, the state-of-the-art, and the design of high-performance laser drivers, transimpedance amplifiers, equalizers, and limiting amplifiers fabricated in nanometer CMOS technologies. This book shows the newest results for the performance of integrated optical receivers, laser drivers, modulator drivers and optical sensors in nanometer standard CMOS technologies. Nanometer CMOS technologies rapidly advanced, enabling the implementation of integrated optical receivers for high data rates of several Giga-bits per second and of high-pixel count optical imagers and sensors. In particular, low cost silicon CMOS optoelectronic integrated circuits became very attractive because they can be extensively applied to short-distance optical communications, such as local area network, chip-to-chip and board-to-board interconnects as well as to imaging and medical...

  19. Transistor Level Circuit Experiments using Evolvable Hardware

    Science.gov (United States)

    Stoica, A.; Zebulum, R. S.; Keymeulen, D.; Ferguson, M. I.; Daud, Taher; Thakoor, A.

    2005-01-01

    The Jet Propulsion Laboratory (JPL) performs research in fault tolerant, long life, and space survivable electronics for the National Aeronautics and Space Administration (NASA). With that focus, JPL has been involved in Evolvable Hardware (EHW) technology research for the past several years. We have advanced the technology not only by simulation and evolution experiments, but also by designing, fabricating, and evolving a variety of transistor-based analog and digital circuits at the chip level. EHW refers to self-configuration of electronic hardware by evolutionary/genetic search mechanisms, thereby maintaining existing functionality in the presence of degradations due to aging, temperature, and radiation. In addition, EHW has the capability to reconfigure itself for new functionality when required for mission changes or encountered opportunities. Evolution experiments are performed using a genetic algorithm running on a DSP as the reconfiguration mechanism and controlling the evolvable hardware mounted on a self-contained circuit board. Rapid reconfiguration allows convergence to circuit solutions in the order of seconds. The paper illustrates hardware evolution results of electronic circuits and their ability to perform under 230 C temperature as well as radiations of up to 250 kRad.

  20. An Arduino Investigation of the RC Circuit

    Science.gov (United States)

    Galeriu, Calin; Letson, Cheryl; Esper, Geoffrey

    2015-05-01

    The experimental investigation of the charging or discharging of a capacitor through a resistor is of fundamental importance to the study of electricity. Students taking the Physics SAT or the AP Physics C: Electricity and Magnetism test have to prove their knowledge of time-varying behavior in RC circuits. While the classical experiment is done using a voltmeter and a stopwatch, this procedure is tedious and prone to human errors. We have developed an alternative procedure in which the voltage, the current, and the time are all measured electronically with the help of an Arduino Uno microcontroller board.

  1. A neuromime system for neural circuit analysis.

    Science.gov (United States)

    Mitchell, C E; Friesen, W O

    1981-01-01

    A system of electronic analog neurons (neuromimes) for modeling the activity in small neuronal networks is described. The system consists of sixteen analogs that simulate the integrative neuronal properties at the axon hillock and sixty-four analogs that serve to simulate synaptic interactions. The neuromime properties are based on a potential model incorporating the following properties: membrane potential, threshold, refractory period, adaptation, post-inhibitory rebound, accommodation and pacemaker potential. Use of matrix switch boards provides for convenient interconnection of the neuromime elements, allowing the construction of even complex circuits. PMID:7236753

  2. Circuit analysis with Multisim

    CERN Document Server

    Baez-Lopez, David

    2011-01-01

    This book is concerned with circuit simulation using National Instruments Multisim. It focuses on the use and comprehension of the working techniques for electrical and electronic circuit simulation. The first chapters are devoted to basic circuit analysis.It starts by describing in detail how to perform a DC analysis using only resistors and independent and controlled sources. Then, it introduces capacitors and inductors to make a transient analysis. In the case of transient analysis, it is possible to have an initial condition either in the capacitor voltage or in the inductor current, or bo

  3. Troubleshooting analog circuits

    CERN Document Server

    Pease, Robert A

    1991-01-01

    Troubleshooting Analog Circuits is a guidebook for solving product or process related problems in analog circuits. The book also provides advice in selecting equipment, preventing problems, and general tips. The coverage of the book includes the philosophy of troubleshooting; the modes of failure of various components; and preventive measures. The text also deals with the active components of analog circuits, including diodes and rectifiers, optically coupled devices, solar cells, and batteries. The book will be of great use to both students and practitioners of electronics engineering. Other

  4. Plasmonic Nanoguides and Circuits

    CERN Document Server

    Bozhevolnyi, Sergey

    2008-01-01

    Modern communication systems dealing with huge amounts of data at ever increasing speed try to utilize the best aspects of electronic and optical circuits. Electronic circuits are tiny but their operation speed is limited, whereas optical circuits are extremely fast but their sizes are limited by diffraction. Waveguide components utilizing surface plasmon (SP) modes were found to combine the huge optical bandwidth and compactness of electronics, and plasmonics thereby began to be considered as the next chip-scale technology. In this book, the authors concentrate on the SP waveguide configurati

  5. Nonlinear dynamics in circuits

    CERN Document Server

    Carroll, TL

    1995-01-01

    This volume describes the use of simple analog circuits to study nonlinear dynamics, chaos and stochastic resonance. The circuit experiments that are described are mostly easy and inexpensive to reproduce, and yet these experiments come from the forefront of nonlinear dynamics research. The individual chapters describe why analog circuits are so useful for studying nonlinear dynamics, and include theoretical as well as experimental results from some of the leading researchers in the field. Most of the articles contain some tutorial sections for the less experienced readers.The audience for thi

  6. Counting rate logarithmic circuits

    International Nuclear Information System (INIS)

    This paper describes the basic circuit and the design method for a multidecade logarithmic counting ratemeter. The method is based on the charging and discharging of several RC time constants. An F.E.T. switch is used and the drain current is converted into a proportional voltage by a current to voltage converter. The logarithmic linearity was estimated for 4 decades starting from 50 cps. This circuit can be used in several nuclear instruments like survey meters and counting systems. This circuits has been developed as part of campbell channel instrumentation. (author)

  7. Optoelectronics circuits manual

    CERN Document Server

    Marston, R M

    2013-01-01

    Optoelectronics Circuits Manual covers the basic principles and characteristics of the best known types of optoelectronic devices, as well as the practical applications of many of these optoelectronic devices. The book describes LED display circuits and LED dot- and bar-graph circuits and discusses the applications of seven-segment displays, light-sensitive devices, optocouplers, and a variety of brightness control techniques. The text also tackles infrared light-beam alarms and multichannel remote control systems. The book provides practical user information and circuitry and illustrations.

  8. Modern TTL circuits manual

    CERN Document Server

    Marston, R M

    2013-01-01

    Modern TTL Circuits Manual provides an introduction to the basic principles of Transistor-Transistor Logic (TTL). This book outlines the major features of the 74 series of integrated circuits (ICs) and introduces the various sub-groups of the TTL family.Organized into seven chapters, this book begins with an overview of the basics of digital ICs. This text then examines the symbology and mathematics of digital logic. Other chapters consider a variety of topics, including waveform generator circuitry, clocked flip-flop and counter circuits, special counter/dividers, registers, data latches, com

  9. In Vivo Quantification of Clot Formation in Extracorporeal Circuits

    CERN Document Server

    David, Omid

    2012-01-01

    Clot formation is a common complication in extracorporeal circuits. In this paper we describe a novel method for clot formation analysis using image processing. We assembled a closed extracorporeal circuit and circulated blood at varying speeds. Blood filters were placed in downstream of the flow, and clotting agents were added to the circuit. Digital images of the filter were subsequently taken, and image analysis was applied to calculate the density of the clot. Our results show a significant correlation between the cumulative size of the clots, the density measure of the clot based on image analysis, and flow duration in the system.

  10. Application of the DRS4 chip for GHz waveform digitizing circuits

    Science.gov (United States)

    Yang, Hai-Bo; Su, Hong; Kong, Jie; Cheng, Ke; Chen, Jin-Da; Du, Cheng-Ming; Zhang, Jing-Zhe

    2015-05-01

    A new fast waveform sampling digitizing circuit based on the domino ring sampler (DRS), a switched capacitor array (SCA) chip, is presented in this paper, which is different from the traditional waveform digitizing circuit constructed with an analog to digital converter (ADC) or time to digital converter. A DRS4 chip is used as a core device in our circuit, which has a fast sampling rate up to five gigabit samples per second (GSPS). Quite satisfactory results are acquired by the preliminary performance test for this circuit board. Eight channels can be provided by one board, which has a 1 V input dynamic range for each channel. The circuit linearity is better than 0.1%, the noise is less than 0.5 mV (root mean square, RMS), and its time resolution is about 50 ps. Several boards can be cascaded to construct a multi-board system. The advantages of high resolution, low cost, low power dissipation, high channel density and small size make the circuit board useful not only for physics experiments, but also for other applications. Supported by National Natural Science Foundation of China (11305233), Specific Fund Research Based on Large-scale Science Instrument Facilities of China (2011YQ12009604)

  11. Low thermal resistance power module assembly

    Science.gov (United States)

    Hassani, Vahab; Vlahinos, Andreas; Bharathan, Desikan

    2007-03-13

    A power module assembly with low thermal resistance and enhanced heat dissipation to a cooling medium. The assembly includes a heat sink or spreader plate with passageways or openings for coolant that extend through the plate from a lower surface to an upper surface. A circuit substrate is provided and positioned on the spreader plate to cover the coolant passageways. The circuit substrate includes a bonding layer configured to extend about the periphery of each of the coolant passageways and is made up of a substantially nonporous material. The bonding layer may be solder material which bonds to the upper surface of the plate to provide a continuous seal around the upper edge of each opening in the plate. The assembly includes power modules mounted on the circuit substrate on a surface opposite the bonding layer. The power modules are positioned over or proximal to the coolant passageways.

  12. Board of Education, Island Trees Union Free School District No. 26 et al., Petitioners, v. Steven A. Pico, by His Next Friend, Frances Pico et al. On Writ of Certiorari to the United States Court of Appeals for the Second Circuit. Supreme Court of the United States, No. 80-2043.

    Science.gov (United States)

    Supreme Court of the U. S., Washington, DC.

    The Supreme Court decision in the case of the Board of Education, Island Trees, New York, versus Steven A. Pico, addressed whether the First Amendment imposes limitations upon the exercise by a local school board of its discretion to remove library books from high school and junior high school libraries. Rejecting the recommendations of a…

  13. High temperature circuit breaker

    Science.gov (United States)

    Edwards, R. N.; Travis, E. F.

    1970-01-01

    Alternating current circuit breaker is suitable for reliable long-term service at 1000 deg F in the vacuum conditions of outer space. Construction materials are resistant to nuclear radiation and vacuum welding. Service test conditions and results are given.

  14. Latching overcurrent circuit breaker

    Science.gov (United States)

    Moore, M. L.

    1970-01-01

    Circuit breaker consists of a preset current amplitude sensor, and a lamp-photo-resistor combination in a feedback arrangement which energizes a power switching relay. The ac input power is removed from the load at predetermined current amplitudes.

  15. Synthetic in vitro circuits

    OpenAIRE

    Hockenberry, Adam J.; Jewett, Michael C.

    2012-01-01

    Inspired by advances in the ability to construct programmable circuits in living organisms, in vitro circuits are emerging as a viable platform for designing, understanding, and exploiting dynamic biochemical circuitry. In vitro systems allow researchers to directly access and manipulate biomolecular parts without the unwieldy complexity and intertwined dependencies that often exist in vivo. Experimental and computational foundations in DNA, DNA/RNA, and DNA/RNA/protein based circuitry have g...

  16. Overriding Faulty Circuit Breakers

    Science.gov (United States)

    Robbins, Richard L.; Pierson, Thomas E.

    1987-01-01

    Retainer keeps power on in emergency. Simple mechanical device attaches to failed aircraft-type push/pull circuit breaker to restore electrical power temporarily until breaker replaced. Device holds push/pull button in closed position; unnecessary for crewmember to hold button in position by continual finger pressure. Sleeve and plug hold button in, overriding mechanical failure in circuit breaker. Windows in sleeve show button position.

  17. Boards of Banks

    OpenAIRE

    Daniel Ferreira; Tom Kirchmaier; Daniel Metzger

    2011-01-01

    We show that country characteristics explain most of the cross-sectional variation in bank board independence. In contrast, country characteristics have little explanatory power for the fraction of outside bank directors with experience in the banking industry. Exploiting the time-series dimension of the sample, we show that changes in bank characteristics are not robustly associated with changes in board independence, while changes in board experience are positively related to changes in ban...

  18. Peak reading detector circuit

    International Nuclear Information System (INIS)

    The peak reading detector circuit serves for picking up the instants during which peaks of a given polarity occur in sequences of signals in which the extreme values, their time intervals, and the curve shape of the signals vary. The signal sequences appear in measuring the foetal heart beat frequence from amplitude-modulated ultrasonic, electrocardiagram, and blood pressure signals. In order to prevent undesired emission of output signals from, e. g., disturbing intermediate extreme values, the circuit consists of the series connections of a circuit to simulate an ideal diode, a strong unit, a discriminator for the direction of charging current, a time-delay circuit, and an electronic switch lying in the decharging circuit of the storage unit. The time-delay circuit thereby causes storing of a preliminary maximum value being used only after a certain time delay for the emission of the output signal. If a larger extreme value occurs during the delay time the preliminary maximum value is cleared and the delay time starts running anew. (DG/PB)

  19. Coupling Two Different Nucleic Acid Circuits in an Enzyme-Free Amplifier

    Directory of Open Access Journals (Sweden)

    Andrew D. Ellington

    2012-11-01

    Full Text Available DNA circuits have proven to be useful amplifiers for diagnostic applications, in part because of their modularity and programmability. In order to determine whether different circuits could be modularly stacked, we used a catalytic hairpin assembly (CHA circuit to initiate a hybridization chain reaction (HCR circuit. In response to an input nucleic acid sequence, the CHA reaction accumulates immobilized duplexes and HCR elongates these duplexes. With fluorescein as a reporter each of these processes yielded 10-fold signal amplification in a convenient 96-well format. The modular circuit connections also allowed the output reporter to be readily modified to a G-quadruplex-DNAzyme that yielded a fluorescent signal.

  20. 应用FCM算法的成组SMT PCB的装配线%Grouping SMT PCB Assembly using FCM Algorithm

    Institute of Scientific and Technical Information of China (English)

    2002-01-01

    This is a further development work on grouping of printed circuit boards (PCBs)For Surface Mount Assembly in the electronic industry.The arrangement of PCBsamong several surface mount machine lines in a typical kind of group technology (GT)problem./From,literatures,there are various clustering techniques developed to solve the clustering problems .In This paper,fuzzy c-means clustering (FCM) is used to solve the PCBs GROUPING PROBLEM,Applying them in a real problem compares the results of the two method.The result shows that there should be a systematic metold to arrange the scheduling of PCB assemblies in electronic industry to improve the operations planning process.

  1. Optical matrix for nuclear fuel assemblies

    International Nuclear Information System (INIS)

    In order to detect the presence of fuel rods, it was selected a reflection optical transducer, which provides a measurable electrical signal when the beam at a certain distance is interrupted then there is a reflection causing a excitation to the sensor that provides a change of state at the output of transducer. This step is coupled through an operational amplifier which drives the opto coupler circuit isolating this step of the interface and a personal computer. This work presents the description of components, designs, signal coupler and opto isolater circuit, interface circuit and tutorial assemble program. (Author)

  2. Synthesis, assembly and device of 1-dimentional nanostructures

    Institute of Scientific and Technical Information of China (English)

    2002-01-01

    Synthesis and assembly of 1-dimentional (1-D) nanostructures and measurement of their electrical and optical properties are very important in fabrication of nanodevices. Recent developments in this field are summarized in this review. The assembling methods can be divided into two classes: assembly using macroscopic field forces and microfluidic-assisted-template-integration. The former can assemble nanowires by controlling direction and intensity of electric or magnetic field, while the latter represents a general assembly strategy for any kind of 1-D nanostructures. The assembly of 1-D nanostructures will make it possible to fabricate nanosensors, nanolasers and nanoscale logic gate circuits for computation.

  3. Building better boards.

    Science.gov (United States)

    Nadler, David A

    2004-05-01

    Companies facing new requirements for governance are scrambling to buttress financial-reporting systems, overhaul board structures--whatever it takes to comply. But there are limits to how much good governance can be imposed from the outside. Boards know what they ought to be: seats of challenge and inquiry that add value without meddling and make CEOs more effective but not all-powerful. A board can reach that goal only if it functions as a high-performance team, one that is competent, coordinated, collegial, and focused on an unambiguous goal. Such entities don't just evolve; they must be constructed to an exacting blueprint--what the author calls board building. In this article, Nadler offers an agenda and a set of tools that boards can use to define and achieve their objectives. It's important for a board to conduct regular self-assessments and to pay attention to the results of those analyses. As a first step, the directors and the CEO should agree on which of the following common board models best fits the company: passive, certifying, engaged, intervening, or operating. The directors and the CEO should then analyze which business tasks are most important and allot sufficient time and resources to them. Next, the board should take inventory of each director's strengths to ensure that the group as a whole possesses the skills necessary to do its work. Directors must exert more influence over meeting agendas and make sure they have the right information at the right time and in the right format to perform their duties. Finally, the board needs to foster an engaged culture characterized by candor and a willingness to challenge. An ambitious board-building process, devised and endorsed both by directors and by management, can potentially turn a good board into a great one. PMID:15146740

  4. Microcontroller based Integrated Circuit Tester

    Directory of Open Access Journals (Sweden)

    Yousif Taha Yousif Elamin

    2015-02-01

    Full Text Available The digital integrated circuit (IC tester is implemented by using the ATmega32 microcontroller . The microcontroller processes the inputs and outputs and displays the results on a Liquid Crystal Display (LCD. The basic function of the digital IC tester is to test a digital IC for correct logical functioning as described in the truth table and/or function table. The designed model can test digital ICs having 14 pins. Since it is programmable, any number of ICs can be tested . This model applies the necessary signals to the inputs of the IC, monitoring the outputs at each stage and comparing them with the outputs in the truth table. Any discrepancy in the functioning of the IC results in a fail indication, displays the faulty and good gates on the LCD. The testing procedure is accomplished with the help of keypad keys present on the main board design. The test has been accomplished with most commonly used digital IC's, mainly belonging to the 74 series. Digital IC tester tests three samples of IC's ( NAND, NOT, NOR. The design is flexible . We can add extra IC bases and subroutines to test any other IC in the 74 series.

  5. Holding Effective Board Meetings.

    Science.gov (United States)

    American Association of School Administrators, Arlington, VA.

    Advice and tested methods for management of meetings from superintendents and board members are combined in this reference book on conducting effective school board meetings. Intended for a wide readership, it contains three chapters and an exhibit section comprising over one-third of the document. Following a brief introduction, chapter 1,…

  6. Board Performance Evaluation

    OpenAIRE

    Osborne, Simon

    2008-01-01

    This guidance is produced to assist companies in understanding, and consequently managing, some of the major issues involved when considering how to carry out board performance evaluation. Different issues will apply to different companies, thus this guidance should not be considered as exhaustive. Hopefully it will trigger the thought processes so that boards may consider for themselves t...

  7. Atomic Energy Control Board

    International Nuclear Information System (INIS)

    This paper has been prepared to provide an overview of the responsibilities and activities of the Atomic Energy Control Board. It is designed to address questions that are often asked concerning the establishment of the Atomic Energy Control Board, its enabling legislation, licensing and compliance activities, federal-provincial relationships, international obligations, and communications with the public

  8. Embracing an International Board

    Institute of Scientific and Technical Information of China (English)

    2011-01-01

    A new international stock board will soon be established in Shanghai,allowing foreign companies to list their businesses and tap into the China market China is moving closer to launching its own international stock board,a market for foreign companies to list their stocks in China,said Shang Fulin,

  9. Solder fused interconnections in multilayer circuits

    Energy Technology Data Exchange (ETDEWEB)

    Voida, G.

    1977-02-01

    A new solder fusion process has been developed for production of multi-layer cables and multilayer printed wiring boards. The multilayer process consists of three steps: (1) the photo-etching fabrication of the basic flexcircuit, (2) the lamination bonding of several flexcircuit layers together, and (3) solder fusion interjoining of the exposed lands to provide electrical continuity. Solder fusion is the unique feature of the process. In the solder fusion process the multilayer assembly is never in contact with highly reactive chemicals which, if entrapped, can lead to corrosion and dielectric breakdown of the assembly. Accurate layer to layer registration can be accomplished with the solder fusion process. A multilayer assembly produced by solder fusion can be shaped into three-dimensional configurations. The repeatable electrical continuity of solder fused interconnections in multilayer assemblies has been confirmed by microhm resistance testing. The solder fused multilayer assembly can be used very advantageously in highly sophisticated instruments and apparatus where portability, weight, bulk, environmental stability, and high reliability are critical requirements.

  10. High-accuracy measurements on biperiodical circuits

    International Nuclear Information System (INIS)

    Coupled resonators in an assembled structure lose their individuality and in co-operation contribute to the generation of structure modes (resonant frequencies). The resonant frequencies of these modes are the only measurable quantities. In order to predict structural behaviour in a variety of cases, the problem that arises is the extraction of all the parameters characterizing the structure from the measurements mentioned here. If all the modes are confined in a bandwidth that is small with respect to the central frequency, the total coupled resonator system is well represented by a circuit of unknown lumped constants.The structure modes are the solutions of the equation obtained by equating to zero the determinant relevant to the lumped circuit representation. The equation is a polynomial of the squared frequency variable, the degree of which is equal to the number M of circuits.The analysis method described in this paper consists in varying, by an unknown amount, the frequency of a single resonator in the chain. This variation will produce a change in the frequencies of all structure modes. It is possible to find certain invariants linearly dependent on all the unchanged parameters of the circuit. These invariants have an algebraic representation that allows the extraction of the structure parameter values with extremely high accuracy. The proposed method is quite general and, in the present work, we give an example applying the method to the characterization of a side-coupled linac (SCL). (paper)

  11. Fabrication, electrical characterization, and detection application of graphene-sheet-based electrical circuits

    OpenAIRE

    Peng, Yitian; Lei, Jianping

    2014-01-01

    The distribution of potential, electric field, and gradient of square of electric field was simulated via a finite element method for dielectrophoresis (DEP) assembly. Then reduced graphene oxide sheets (RGOS)- and graphene oxide sheets (GOS)-based electrical circuits were fabricated via DEP assembly. The mechanically exfoliated graphene sheets (MEGS)-based electrical circuit was also fabricated for comparison. The electrical transport properties of three types of graphene-based electrical ci...

  12. Parallel Computation Using Active Self-assembly

    OpenAIRE

    Chen, Moya; Xin, Doris; Woods, Damien

    2013-01-01

    We study the computational complexity of the recently proposed nubot model of molecular-scale self-assembly. The model generalises asynchronous cellular automata to have non-local movement where large assemblies of molecules can be pushed and pulled around, analogous to millions of molecular motors in animal muscle effecting the rapid movement of macroscale arms and legs. We show that the nubot model is capable of simulating Boolean circuits of polylogarithmic depth and polynomial size, in on...

  13. Ordinary General Assembly

    CERN Multimedia

    Association du personnel

    2010-01-01

    Tuesday 20 April at 10.00 Council Chamber, Bldg 503 In conformity with the Statutes of the Staff Association, an ordinary General Assembly is organized once a year (article IV.2.1). Agenda Adoption of the Agenda Approval of the Draft Minutes of the Ordinary General Assembly of 12 May 2009 Presentation and approval of the Activity Report 2009 Presentation and approval of the Financial Report 2009 Presentation and approval of the Auditors Report 2009 Programme for 2010 Presentation et and approval of the draft budget and subscription rate 2010 Modifications to the statutes of the association Election of the Election Committee Election of the Board of Auditors Miscellaneous We remind members of article IV.3.4 in the Statutes of the Association which reads: “After having dealt with all the items on the agenda, the members may, with the consent of the Assembly, have other matters discussed, but decisions may be taken only on the items listed on the agenda...

  14. The Mind Grows Circuits

    CERN Document Server

    Panigrahy, Rina

    2012-01-01

    There is a vast supply of prior art that study models for mental processes. Some studies in psychology and philosophy approach it from an inner perspective in terms of experiences and percepts. Others such as neurobiology or connectionist-machines approach it externally by viewing the mind as complex circuit of neurons where each neuron is a primitive binary circuit. In this paper, we also model the mind as a place where a circuit grows, starting as a collection of primitive components at birth and then builds up incrementally in a bottom up fashion. A new node is formed by a simple composition of prior nodes when we undergo a repeated experience that can be described by that composition. Unlike neural networks, however, these circuits take "concepts" or "percepts" as inputs and outputs. Thus the growing circuits can be likened to a growing collection of lambda expressions that are built on top of one another in an attempt to compress the sensory input as a heuristic to bound its Kolmogorov Complexity.

  15. 导向管喷动流化床中废弃印刷线路板的非金属颗粒包覆改性%Coating modification of non-metal particles of waste printed circuit boards in spout-fluid bed with draft tube

    Institute of Scientific and Technical Information of China (English)

    谢恒来; 吴曼; 赵军; 陈义忠; 郭庆杰

    2015-01-01

    以3-氨基丙基三乙氧基硅烷(KH-550)为改性剂,在导向管喷动流化床内对废弃印刷线路板的非金属颗粒(NPWPCB)进行包覆改性,研究了颗粒包覆过程中KH-550溶液(体积分数20%)用量、喷雾速率、雾化气速、床层温度及喷动气速等操作参数对NPWPCB改性效果的影响。以聚丙烯(PP)为基体、改性NPWPCB为填料,采用挤出注塑工艺制备了PP/NPWPCB复合材料。通过红外光谱图和扫描电子显微镜对改性前后NPWPCB表面官能团及复合材料冲击断面微观形貌的分析表明,KH-550可以增加NPWPCB与PP基体之间的界面黏结强度,提高PP/NPWPCB复合材料的力学性能。当KH-550溶液用量为75 ml、喷雾速率为3.2 cm·s−1、雾化气速为58.98 m·s−1、床层温度为80℃、喷动气速为29.49 m·s−1时,复合材料的弯曲、拉伸和冲击强度较改性前分别提高了15.07%、17.52%和16.32%。%Non-metal particles of waste printed circuit boards (NPWPCB) were modified with 3-aminopropyltriethoxysilane (KH-550) by coating in a spout-fluid bed with draft tube. To obtain the range of operating parameters for the modification, the effects of KH-550 solution (20%(vol)) volume, spray rate, atomizing gas velocity, bed temperature, and spouting gas velocity on modification were evaluated. The modified NPWPCB were used as filler to fabricate PP/NPWPCB composites by extrusion and injection molding. The variations of the surface functional groups and the cross-section morphology were characterized by infrared spectroscopy and scanning electron microscopy. Modified NPWPCB improved the interface bonding between NPWPCB and PP, which enhanced the mechanical properties of PP/NPWPCB composites. At KH-550 solution (20%(vol)) volume of 75 ml, spray rate of 3.2 cm·s−1, atomizing gas velocity of 58.98 m·s−1, bed temperature of 80℃, and spouting gas velocity of 29.49 m·s−1, flexural strength, tensile strength, and impact

  16. Fabrication of Nanoscale Circuits on Inkjet-Printing Patterned Substrates.

    Science.gov (United States)

    Chen, Shuoran; Su, Meng; Zhang, Cong; Gao, Meng; Bao, Bin; Yang, Qiang; Su, Bin; Song, Yanlin

    2015-07-01

    Nanoscale circuits are fabricated by assembling different conducting materials (e.g., metal nanoparticles, metal nano-wires, graphene, carbon nanotubes, and conducting polymers) on inkjet-printing patterned substrates. This non-litho-graphy strategy opens a new avenue for integrating conducting building blocks into nanoscale devices in a cost-efficient manner. PMID:26011403

  17. Network on chip master control board for neutron acquisition

    International Nuclear Information System (INIS)

    The acquisition master control board is designed to assemble the various acquisition modes in use at the Institut Laue-Langevin (ILL). The main goal is to make the card common for all the ILL's instruments in a simple, modular and open way, giving the possibility to add new functionalities in order to follow the evolving demand. It has been necessary to define a central element to provide synchronization to the rest of the units. The backbone of the proposed acquisition control system is the denominated master acquisition board. The master board consists on a VME64X configurable high density I/O connection carrier board based on the latest Xilinx Virtex-6T FPGA. The internal architecture of the FPGA is designed as a Network on Chip (NoC) approach. The complete system also includes a display board and n histogram modules for live display of the data from the detectors. (authors)

  18. Hardware Architecture and Cutting-Edge Assembly Process of a Tiny Curved Compound Eye

    Directory of Open Access Journals (Sweden)

    Stéphane Viollet

    2014-11-01

    Full Text Available The demand for bendable sensors increases constantly in the challenging field of soft and micro-scale robotics. We present here, in more detail, the flexible, functional, insect-inspired curved artificial compound eye (CurvACE that was previously introduced in the Proceedings of the National Academy of Sciences (PNAS, 2013. This cylindrically-bent sensor with a large panoramic field-of-view of \\(180^\\circ\\ \\(\\times\\ \\(60^\\circ\\composed of 630 artificial ommatidia weighs only 1.75 g, is extremely compact and power-lean (0.9 W, while it achieves unique visual motion sensing performance (1950 frames per second in a five-decade range of illuminance. In particular, this paper details the innovative Very Large Scale Integration (VLSI sensing layout, the accurate assembly fabrication process, the innovative, new fast read-out interface, as well as the auto-adaptive dynamic response of the CurvACE sensor. Starting from photodetectors and microoptics on wafer substrates and flexible printed circuit board, the complete assembly of CurvACE was performed in a planar configuration, ensuring high alignment accuracy and compatibility with state-of-the art assembling processes. The characteristics of the photodetector of one artificial ommatidium have been assessed in terms of their dynamic response to light steps. We also characterized the local auto-adaptability of CurvACE photodetectors in response to large illuminance changes: this feature will certainly be of great interest for future applications in real indoor and outdoor environments.

  19. The design of an electron gun grid pulse circuit for a single bunch mode operation

    International Nuclear Information System (INIS)

    Siam Photon Source (Thailand) operates multiple bunch system at Booster. For the single bunch mode operation, the electron gun will emit a bunch of electron at pulse width 4 ns. A gun grid circuit is designed by using a pulse forming network and an avalanche technique. The circuit is tested with a high bandwidth oscilloscope and the circuit is then connected to the gun assembly.

  20. MTI Focal Plane Assembly Design and Performance

    Energy Technology Data Exchange (ETDEWEB)

    Ballard, M.; Rienstra, J.L.

    1999-06-17

    The focal plane assembly for the Multispectral Thermal Imager (MTI) consists of sensor chip assemblies, optical filters, and a vacuum enclosure. Sensor chip assemblies, composed of linear detector arrays and readout integrated circuits, provide spatial resolution in the cross-track direction for the pushbroom imager. Optical filters define 15 spectral bands in a range from 0.45 {micro}m to 10.7 {micro}m. All the detector arrays are mounted on a single focal plane and are designed to operate at 75 K. Three pairs of sensor chip assemblies (SCAs) are required to provide cross-track coverage in all 15 spectral bands. Each pair of SCAs includes detector arrays made from silicon, iridium antimonide, and mercury cadmium telluride. Read out integrated circuits multiplex the signals from the detectors to 18 separate video channels. Optical filter assemblies defining the spectral bands are mounted over the linear detector arrays. Each filter assembly consists of several filter strips bonded together side-by-side. The MTI focal plane assembly has been integrated with the rest of the payload and has undergone detailed testing and calibration. This paper includes representative test data for the various spectral bands and the overall performance of the focal plane assembly.