WorldWideScience

Sample records for bonded silicon nitride

  1. Low temperature anodic bonding to silicon nitride

    DEFF Research Database (Denmark)

    Weichel, Steen; Reus, Roger De; Bouaidat, Salim;

    2000-01-01

    Low-temperature anodic bonding to stoichiometric silicon nitride surfaces has been performed in the temperature range from 3508C to 4008C. It is shown that the bonding is improved considerably if the nitride surfaces are either oxidized or exposed to an oxygen plasma prior to the bonding. Both bulk...

  2. Fusion bonding of silicon nitride surfaces

    DEFF Research Database (Denmark)

    Reck, Kasper; Østergaard, Christian; Thomsen, Erik Vilain;

    2011-01-01

    While silicon nitride surfaces are widely used in many micro electrical mechanical system devices, e.g. for chemical passivation, electrical isolation or environmental protection, studies on fusion bonding of two silicon nitride surfaces (Si3N4–Si3N4 bonding) are very few and highly application...... results on bonding of thin and thick Si3N4 layers. The new results include high temperature bonding without any pretreatment, along with improved bonding ability achieved by thermal oxidation and chemical pretreatment. The bonded wafers include both unprocessed and processed wafers with a total silicon...... nitride thickness of up to 440 nm. Measurements of bonding strength, void characterization, oxidation rate and surface roughness are also presented. Bonding strengths for stoichiometric low pressure chemical vapor deposition Si3N4–Si3N4 direct fusion bonding in excess of 2 J cm−2 are found...

  3. Molecular dynamics studies of the bonding properties of amorphous silicon nitride coatings on crystalline silicon

    OpenAIRE

    Butler, K.T.; Lamers, M.P.W.E.; Weeber, A. W.; Harding, J. H.

    2011-01-01

    In this paper we present molecular dynamics simulations of silicon nitride, both in bulk and as an interface to crystalline silicon. We investigate, in particular, the bonding structure of the silicon nitride and analyze the simulations to search for de- fective geometries which have been identified as potential charge carrier traps when silicon nitride forms an interface with silicon semiconductors. The simulations reveal how the bonding patterns in silicon nitride are dependent upon the sto...

  4. MEASUREMENT OF THERMAL DIFFUSIVITY OF REACTION BONDED SILICON NITRIDE

    OpenAIRE

    Serra, J.-J.; Jaymes, M.; Cantarel, M.

    1986-01-01

    The thermal diffusivity of samples of reaction bonded silicon nitride from different sources, was measured using the ETCA solar furnace. Two measurement methods, suitable for use with this type of equipment, allowed the different material origins to be determined. This installation accepts relatively large samples which are therefore representative of the bulk material.

  5. Reaction sintering of a clay-containing silicon nitride bonded silicon carbide refractory

    International Nuclear Information System (INIS)

    Aspects of the reaction sequence for the reaction bonding of a cast refractory, which in the green state was composed of 79 wt-% SiC grit, 16 wt-% Si powder and 5 wt-% clay were established. As it was fired up to 1600 deg C in flowing N2(g), weight gains were noted and phase evolution was monitored by X-ray diffraction. However, details of the reaction sequence were not determined directly from this material because several reaction-bonding processes occurred simultaneously. Reaction features were ascertained by contrasting the weight changes and phase evolution in the refractory with those observed during reaction-bonding of (a) Si and clay without the SiC and (b) SiC and clay without the Si. In addition to silicon nitridation and the development of sialon phases by silicothermal and carbothermal reduction-nitridation processes, indirect evidence suggested that α-Si3N4 formed by the carbothermal reduction-nitridation (CRN) of SiO(g). Copyright (1998) Australasian Ceramic Society

  6. Geometrical Deviation and Residual Strain in Novel Silicon-on-Aluminium-Nitride Bonded Wafers

    Institute of Scientific and Technical Information of China (English)

    门传玲; 徐政; 吴雁军; 安正华; 谢欣云; 林成鲁

    2002-01-01

    Aluminium nitride (AlN), with much higher thermal conductivity, is considered to be an excellent alternative to the SiO2 layer in traditional silicon-on-insulator (SOI) materials. The silicon-on-aluminium-nitride (SOAN) structure was fabricated by the smart-cut process to alleviate the self-heating effects for traditional SOI. The convergent beam Kikuchi line diffraction pattern results show that some rotational misalignment exists when two wafers are bonded, which is about 3°. The high-resolution x-ray diffraction result indicates that, before annealing at high temperature, the residual lattice strain in the top silicon layer is tensile. After annealing at 1100° C for an hour, the strain in the top Si decreases greatly and reverses from tensile to slightly compressive as a result of viscous flow of AlN.

  7. Effect of hot isostatic pressing on reaction-bonded silicon nitride

    Science.gov (United States)

    Watson, G. K.; Moore, T. J.; Millard, M. L.

    1984-01-01

    Specimens of nearly theoretical density have been obtained through the isostatic hot pressing of reaction-bonded silicon nitride under 138 MPa of pressure for two hours at 1850, 1950, and 2050 C. An amorphous phase that is introduced by the hot isostatic pressing partly accounts for the fact that while room temperature flexural strength more than doubles, the 1200 C flexural strength increases significantly only after pressing at 2050 C.

  8. Processing development for ceramic structural components: the influence of a presintering of silicon on the final properties of reaction bonded silicon nitride. Final technical report

    Energy Technology Data Exchange (ETDEWEB)

    1982-03-01

    The influence of a presintering of silicon on the final properties of reaction bonded silicon nitride has been studied using scanning electron and optical microscopy, x-ray diffraction analysis, 4 pt. bend test, and mecury intrusion porosimetry. It has been shown that presintering at 1050/sup 0/C will not affect the final nitrided properties. At 1200/sup 0/C, the oxide layer is removed, promoting the formation of B-phase silicon nitride. Presintering at 1200/sup 0/C also results in compact weight loss due to the volatilization of silicon, and the formation of large pores which severely reduce nitrided strength. The development of the structure of sintered silicon compacts appears to involve a temperature gradient, with greater sintering observed near the surface.

  9. Silicon nitride-fabrication, forming and properties

    International Nuclear Information System (INIS)

    This article, which is a literature survey of the recent years, includes description of several methods for the formation of silicone nitride, and five methods of forming: Reaction-bonded silicon nitride, sintering, hot pressing, hot isostatic pressing and chemical vapour deposition. Herein are also included data about mechanical and physical properties of silicon nitride and the relationship between the forming method and the properties. (author)

  10. Effect of microstructure on the high temperature strength of nitride bonded silicon carbide composite

    Indian Academy of Sciences (India)

    J Rakshit; P K Das

    2002-10-01

    Four compositions of nitride bonded SiC were fabricated with varying particle size of SiC of ∼ 9.67, ∼ 13.79, ∼ 60 and their mixture with Si of ∼ 4.83 particle size. The green density and hence the open porosity of the shapes were varied between 1.83 to 2.09 g/cc and 33.3 to 26.8 vol.%, respectively. The effect of these parameters on room temperature and high temperature strength of the composite up to 1300°C in ambient condition were studied. The high temperature flexural strength of the composite of all compositions increased at 1200 and 1300°C because of oxidation of Si3N4 phase and blunting crack front. Formation of Si3N4 whisker was also observed. The strength of the mixture composition was maximum.

  11. Durable ultrathin silicon nitride/carbon bilayer overcoats for magnetic heads: The role of enhanced interfacial bonding

    Energy Technology Data Exchange (ETDEWEB)

    Yeo, Reuben J.; Dwivedi, Neeraj; Bhatia, Charanjit S., E-mail: elebcs@nus.edu.sg [Department of Electrical and Computer Engineering, National University of Singapore, Singapore, Singapore 117583 (Singapore); Zhang, Lu [Institute of Microelectronics (IME), A*STAR (Agency for Science, Technology, and Research), 11 Science Park Road, Singapore Science Park II, Singapore, Singapore 117685 (Singapore); Zhang, Zheng; Tripathy, S. [Institute of Materials Research and Engineering (IMRE), A*STAR (Agency for Science, Technology, and Research), 3 Research Link, Singapore, Singapore 117602 (Singapore); Lim, Christina Y. H. [Department of Mechanical Engineering, National University of Singapore, Singapore, Singapore 117575 (Singapore)

    2015-01-28

    Pole tip recession (PTR) is one of the major issues faced in magnetic tape storage technology, which causes an increase in the magnetic spacing and hence signal loss during data readback. Despite efforts to reduce the magnetic spacing, PTR, and surface wear on the heads by using protective overcoats, most of them either employ complex fabrication processes and approaches do not provide adequate protection to the head or are too thick (∼10–20 nm), especially for future high density tape storage. In this work, we discuss an approach to reduce the PTR and surface wear at the head by developing an ultrathin ∼7 nm bilayer overcoat of silicon/silicon nitride (Si/SiN{sub x}) and carbon (C), which is totally fabricated by a cost-effective and industrial-friendly magnetron sputtering process. When compared with a monolithic C overcoat of similar thickness, the electrically insulating Si/SiN{sub x}/C bilayer overcoat was found to provide better wear protection for commercial tape heads, as demonstrated by Auger electron spectroscopic analyses after wear tests with commercial tape media. Although the microstructures of carbon in the monolithic and bilayer overcoats were similar, the improved wear durability of the bilayer overcoat was attributed to the creation of extensive interfacial bonding of Si and N with the C overcoat and the alumina-titanium carbide composite head substrate, as predicted by time-of-flight secondary ion mass spectrometry and confirmed by in-depth X-ray photoelectron spectroscopy analyses. This study highlights the pivotal role of enhanced interfaces and interfacial bonding in developing ultrathin yet wear-durable overcoats for tape heads.

  12. Role of interfacial carbon layer in the thermal diffusivity/conductivity of silicon carbide fiber-reinforced reaction-bonded silicon nitride matrix composites

    Science.gov (United States)

    Bhatt, Hemanshu; Donaldson, Kimberly Y.; Hasselman, D. P. H.; Bhatt, Ramakrishna T.

    1992-01-01

    Experiments were carried out on samples of reaction-bonded silicon nitride uniaxially reinforced by SiC monofilaments with and without a 3-micron-thick carbon-rich coating. It is found that a combination of a carbon coatings on the fibers and an interfacial gap due to the thermal expansion mismatch in the composite can significantly (by a factor of 2) lower the effective thermal diffusivity in the direction transverse to the fiber. At atmospheric pressure, gaseous conduction across the interfacial gap makes a significant contribution to the heat transfer across the interface, indicated by significantly lower values of the effective thermal diffusivity under vacuum than in nitrogen or helium at atmospheric pressure.

  13. Role of the interfacial thermal barrier in the effective thermal diffusivity/conductivity of SiC-fiber-reinforced reaction-bonded silicon nitride

    Science.gov (United States)

    Bhatt, Hemanshu; Donaldson, Kimberly Y.; Hasselman, D. P. H.; Bhatt, R. T.

    1990-01-01

    Experimental thermal diffusivity data transverse to the fiber direction for composites composed of a reaction bonded silicon nitride matrix reinforced with uniaxially aligned carbon-coated silicon carbide fibers indicate the existence of a significant thermal barrier at the matrix-fiber interface. Calculations of the interfacial thermal conductances indicate that at 300 C and 1-atm N2, more than 90 percent of the heat conduction across the interface occurs by gaseous conduction. Good agreement is obtained between thermal conductance values for the oxidized composite at 1 atm calculated from the thermal conductivity of the N2 gas and those inferred from the data for the effective composite thermal conductivity.

  14. The role of N-Si-O bonding configurations in tunable photoluminescence of oxygenated amorphous silicon nitride films

    Science.gov (United States)

    Zhang, Pengzhan; Chen, Kunji; Lin, Zewen; Dong, Hengping; Li, Wei; Xu, Jun; Huang, Xinfan

    2015-06-01

    Last year, we have reported that the internal quantum efficiency of photoluminescence (PL) from amorphous silicon oxynitride (a-SiNxOy) films has been achieved as high as 60%. The present work intensively investigated the mechanisms for tunable PL in the 2.05-2.95 eV range from our a-SiNx:O films, by using a combination of optical characterizations, X-ray photoelectron spectroscopy (XPS) and electron paramagnetic resonance (EPR) measurements. The results of XPS, EPR, and photoluminescence excited measurements indicated that the incorporation of oxygen atoms into silicon nitride (a-SiNx) networks not only reduced the band tail structure disorder (Urbach tail width EU) but also created N-Si-O (Nx) defect states in the band gap. We have discovered the distinctive PL characteristics from a-SiNx:O films with various NH3/SiH4 ratios. The PL peak energy (EPL) is independent of the excitation energy (Eexc) and the PL intensity (IPL) is regardless of the optical band gap (Eopt) but is proportional to the Nx defects concentration, both of which are completely different from the PL characteristics by band tail states recombination mechanism, in which the EPL is proportional to Eexc (when Eexc ≤ Eopt) and the IPL is dependent on the relative position of Eexc and Eopt. Based on the N-Si-O bonding configurations and the distinctive PL characteristics, the radiative recombination mechanism through the N-Si-O defect states has been proposed, by which the performance of stimulated emission may be realized in this kind of a-SiNx:O films.

  15. A high Tc superconductor bolometer on a silicon nitride membrane

    OpenAIRE

    Sanchez, Stefan; Elwenspoek, Miko; Gui, Chengqun; Nivelle, de, M.J.M.E.; De, Vries; Korte, de, N.; Bruijn, Marcel P.; Wijnbergen, Jan J.; Michalke, Wolfgang; Steinbeiss, Erwin; Heidenblut, Torsten; Schwierzi, Bernard

    1998-01-01

    In this paper, we describe the design, fabrication, and performance of a high-Tc GdBa2Cu3O7-¿ superconductor bolometer positioned on a 2× 2-mm2 1-¿m-thick silicon nitride membrane. The bolometer structure has an effective area of 0.64 mm2 and was grown on a specially developed silicon-on-nitride (SON) layer. This layer was made by direct bonding of silicon nitride to silicon after chemical mechanical polishing. The operation temperature of the bolometer is 85 K. A thermal conductance G=3.3·10...

  16. PECVD silicon nitride diaphragms for condenser microphones

    NARCIS (Netherlands)

    Scheeper, P.R.; Voorthuyzen, J.A.; Bergveld, P.

    1991-01-01

    The application of plasma-enhanced chemical vapour deposited (PECVD) silicon nitride as a diaphragm material for condenser microphones has been investigated. By means of adjusting the SiH4/NH3 gas-flow composition, silicon-rich silicon nitride films have been obtained with a relatively low tensile s

  17. Ultrasonic and micromechanical study of damage and elastic properties of SiC/RBSN ceramic composites. [Reaction Bonded Silicon Nitride

    Science.gov (United States)

    Chu, Y. C.; Hefetz, M.; Rokhlin, S. I.; Baaklini, G. Y.

    1992-01-01

    Ultrasonic techniques are employed to develop methods for nondestructive evaluation of elastic properties and damage in SiC/RBSN composites. To incorporate imperfect boundary conditions between fibers and matrix into a micromechanical model, a model of fibers having effective anisotropic properties is introduced. By inverting Hashin's (1979) microstructural model for a composite material with microscopic constituents the effective fiber properties were found from ultrasonic measurements. Ultrasonic measurements indicate that damage due to thermal shock is located near the surface, so the surface wave is most appropriate for estimation of the ultimate strength reduction and critical temperature of thermal shock. It is concluded that bonding between laminates of SiC/RBSN composites is severely weakened by thermal oxidation. Generally, nondestructive evaluation of thermal oxidation effects and thermal shock shows good correlation with measurements previously performed by destructive methods.

  18. Highly porous silicon membranes fabricated from silicon nitride/silicon stacks.

    Science.gov (United States)

    Qi, Chengzhu; Striemer, Christopher C; Gaborski, Thomas R; McGrath, James L; Fauchet, Philippe M

    2014-07-23

    Nanopore formation in silicon films has previously been demonstrated using rapid thermal crystallization of ultrathin (15 nm) amorphous Si films sandwiched between nm-thick SiO2 layers. In this work, the silicon dioxide barrier layers are replaced with silicon nitride, resulting in nanoporous silicon films with unprecedented pore density and novel morphology. Four different thin film stack systems including silicon nitride/silicon/silicon nitride (NSN), silicon dioxide/silicon/silicon nitride (OSN), silicon nitride/silicon/silicon dioxide (NSO), and silicon dioxide/silicon/silicon dioxide (OSO) are tested under different annealing temperatures. Generally the pore size, pore density, and porosity positively correlate with the annealing temperature for all four systems. The NSN system yields substantially higher porosity and pore density than the OSO system, with the OSN and NSO stack characteristics fallings between these extremes. The higher porosity of the Si membrane in the NSN stack is primarily due to the pore formation enhancement in the Si film. It is hypothesized that this could result from the interfacial energy difference between the silicon/silicon nitride and silicon/silicon dioxide, which influences the Si crystallization process. PMID:24623562

  19. Studies on Dielectric Properties of Silicon Nitride at High Temperature

    Institute of Scientific and Technical Information of China (English)

    Ting Zhang; Shu-Ren Zhang; Meng-Qiang Wu; Wei-Jun Sang; Zheng-Ping Gao; Zhong-Ping Li

    2007-01-01

    In this paper, the dielectric properties of silicon nitride are studied using the dielectric polarization theories. According to the developed dielectric models, the temperature dependence of dielectric constant and loss of silicon nitride is mainly analyzed. In addition, the impact of Li+, K+, Ca2+, Al3+ and Mg2+ doping on the dielectric properties of silicon nitride are also estimated.

  20. Pressureless sintered silicon carbide tailored with aluminium nitride sintering agent

    International Nuclear Information System (INIS)

    This study reports the influence of aluminium nitride on the pressureless sintering of cubic phase silicon carbide nanoparticles (β-SiC). Pressureless sintering was achieved at 2000 degrees C for 5 min with the additions of boron carbide together with carbon of 1 wt% and 6 wt%, respectively, and a content of aluminium nitride between 0 and 10 wt%. Sintered samples present relative densities higher than 92%. The sintered microstructure was found to be greatly modified by the introduction of aluminium nitride, which reflects the influence of nitrogen on the β-SiC to α-SiC transformation. The toughness of sintered sample was not modified by AlN incorporation and is relatively low (around 2.5 MPa m1/2). Materials exhibited transgranular fracture mode, indicating a strong bonding between SiC grains. (authors)

  1. Atomic-layer deposition of silicon nitride

    CERN Document Server

    Yokoyama, S; Ooba, K

    1999-01-01

    Atomic-layer deposition (ALD) of silicon nitride has been investigated by means of plasma ALD in which a NH sub 3 plasma is used, catalytic ALD in which NH sub 3 is dissociated by thermal catalytic reaction on a W filament, and temperature-controlled ALD in which only a thermal reaction on the substrate is employed. The NH sub 3 and the silicon source gases (SiH sub 2 Cl sub 2 or SiCl sub 4) were alternately supplied. For all these methods, the film thickness per cycle was saturated at a certain value for a wide range of deposition conditions. In the catalytic ALD, the selective deposition of silicon nitride on hydrogen-terminated Si was achieved, but, it was limited to only a thin (2SiO (evaporative).

  2. Vibrational Spectroscopy of Chemical Species in Silicon and Silicon-Rich Nitride Thin Films

    Directory of Open Access Journals (Sweden)

    Kirill O. Bugaev

    2012-01-01

    Full Text Available Vibrational properties of hydrogenated silicon-rich nitride (SiN:H of various stoichiometry (0.6≤≤1.3 and hydrogenated amorphous silicon (a-Si:H films were studied using Raman spectroscopy and Fourier transform infrared spectroscopy. Furnace annealing during 5 hours in Ar ambient at 1130∘C and pulse laser annealing were applied to modify the structure of films. Surprisingly, after annealing with such high-thermal budget, according to the FTIR data, the nearly stoichiometric silicon nitride film contains hydrogen in the form of Si–H bonds. From analysis of the FTIR data of the Si–N bond vibrations, one can conclude that silicon nitride is partly crystallized. According to the Raman data a-Si:H films with hydrogen concentration 15% and lower contain mainly Si–H chemical species, and films with hydrogen concentration 30–35% contain mainly Si–H2 chemical species. Nanosecond pulse laser treatments lead to crystallization of the films and its dehydrogenization.

  3. Silicon Nitride Balls For Cryogenic Bearings

    Science.gov (United States)

    Butner, Myles F.; Ng, Lillian W.

    1990-01-01

    Resistance to wear greater than that of 440C steel. Experiments show lives of ball bearings immersed in liquid nitrogen or liquid oxygen increased significantly when 440C steel balls (running on 440C steel races) replaced by balls of silicon nitride. Developed for use at high temperatures, where lubrication poor or nonexistent. Best wear life of any bearing tested to date and ball material spalls without fracturing. Plans for future tests call for use of liquid oxygen as working fluid.

  4. Silicon Nitride Antireflection Coatings for Photovoltaic Cells

    Science.gov (United States)

    Johnson, C.; Wydeven, T.; Donohoe, K.

    1984-01-01

    Chemical-vapor deposition adapted to yield graded index of refraction. Silicon nitride deposited in layers, refractive index of which decreases with distance away from cell/coating interface. Changing index of refraction allows adjustment of spectral transmittance for wavelengths which cell is most effective at converting light to electric current. Average conversion efficiency of solar cells increased from 8.84 percent to 12.63 percent.

  5. Effects of Aqueous Vapour Consistence in Nitriding Furnace on the Quality of the Sintered Nitride

    Institute of Scientific and Technical Information of China (English)

    WANGZijiang

    1998-01-01

    If the aqueous vapour consistence is too high(>0.7%),it is very disadvantageous to the sintered products in the nitriding furnace,when silcon nitride bonded silicon carbide products are synthesized by nitridation of silicon.

  6. Characterization of nitrided silicon-silicon dioxide interfaces

    Energy Technology Data Exchange (ETDEWEB)

    Polignano, M.L.; Alessandri, M.; Brazzelli, D. [and others

    2000-07-01

    A newly-developed technique for the simultaneous characterization of the oxide-silicon interface properties and of bulk impurities was used for a systematic study of the nitridation process of thin oxides. This technique is based upon surface recombination velocity measurements, and does not require the formation of a capacitor structure, so it is very suitable for the characterization of as-grown interfaces. Oxides grown both in dry and in wet environments were considered, and nitridation processes in N{sub 2}O and in NO were compared to N{sub 2} annealing processes. The effect of nitridation temperature and duration were also studied, and RTO/RTN processes were compared to conventional furnace nitridation processes. Surface recombination velocity was correlated with nitrogen concentration at the oxide-silicon interface obtained by Secondary Ion Mass Spectroscopy (SIMS) measurements. Surface recombination velocity (hence surface state density) decreases with increasing nitrogen pile-up at the oxide-silicon interface, indicating that in nitrided interfaces surface state density is limited by nitridation. NO treatments are much more effective than N{sub 2}O treatments in the formation of nitrogen-rich interface layer and, as a consequence, in surface state reduction. Surface state density was measured in fully processed wafers before and after constant current stress. After a complete device process surface states are annealed out by hydrogen passivation, however they are reactivated by the electrical stress, and surface state results after stress were compared with data of surface recombination velocity in as-processed wafers.

  7. Compressibility and thermal expansion of cubic silicon nitride

    DEFF Research Database (Denmark)

    Jiang, Jianzhong; Lindelov, H.; Gerward, Leif;

    2002-01-01

    The compressibility and thermal expansion of the cubic silicon nitride (c-Si3N4) phase have been investigated by performing in situ x-ray powder-diffraction measurements using synchrotron radiation, complemented with computer simulations by means of first-principles calculations. The bulk...... compressibility of the c-Si3N4 phase originates from the average of both Si-N tetrahedral and octahedral compressibilities where the octahedral polyhedra are less compressible than the tetrahedral ones. The origin of the unit cell expansion is revealed to be due to the increase of the octahedral Si-N and N-N bond...

  8. Studies of silicon carbide and silicon carbide nitride thin films

    Science.gov (United States)

    Alizadeh, Zhila

    Silicon carbide semiconductor technology is continuing to advance rapidly. The excellent physical and electronic properties of silicon carbide recently take itself to be the main focused power device material for high temperature, high power, and high frequency electronic devices because of its large band gap, high thermal conductivity, and high electron saturation drift velocity. SiC is more stable than Si because of its high melting point and mechanical strength. Also the understanding of the structure and properties of semiconducting thin film alloys is one of the fundamental steps toward their successful application in technologies requiring materials with tunable energy gaps, such as solar cells, flat panel displays, optical memories and anti-reflecting coatings. Silicon carbide and silicon nitrides are promising materials for novel semiconductor applications because of their band gaps. In addition, they are "hard" materials in the sense of having high elastic constants and large cohesive energies and are generally resistant to harsh environment, including radiation. In this research, thin films of silicon carbide and silicon carbide nitride were deposited in a r.f magnetron sputtering system using a SiC target. A detailed analysis of the surface chemistry of the deposited films was performed using x-ray photoelectron spectroscopy (XPS), Fourier Transform Infrared Spectroscopy (FTIR) and Raman spectroscopy whereas structure and morphology was studied atomic force microscopy (AFM), and nonoindentation.

  9. Four-Wave Mixing in Silicon-Rich Nitride Waveguides

    DEFF Research Database (Denmark)

    Mitrovic, Miranda; Guan, Xiaowei; Ji, Hua;

    2015-01-01

    We demonstrate four-wave mixing wavelength conversion in silicon-rich nitride waveguides which are a promising alternative to silicon for nonlinear applications. The obtained conversion efficiency reaches -13.6 dB while showing no significant nonlinear loss.......We demonstrate four-wave mixing wavelength conversion in silicon-rich nitride waveguides which are a promising alternative to silicon for nonlinear applications. The obtained conversion efficiency reaches -13.6 dB while showing no significant nonlinear loss....

  10. Compositional analysis of silicon oxide/silicon nitride thin films

    Directory of Open Access Journals (Sweden)

    Meziani Samir

    2016-06-01

    Full Text Available Hydrogen, amorphous silicon nitride (SiNx:H abbreviated SiNx films were grown on multicrystalline silicon (mc-Si substrate by plasma enhanced chemical vapour deposition (PECVD in parallel configuration using NH3/SiH4 gas mixtures. The mc-Si wafers were taken from the same column of Si cast ingot. After the deposition process, the layers were oxidized (thermal oxidation in dry oxygen ambient environment at 950 °C to get oxide/nitride (ON structure. Secondary ion mass spectroscopy (SIMS, Rutherford backscattering spectroscopy (RBS, Auger electron spectroscopy (AES and energy dispersive X-ray analysis (EDX were employed for analyzing quantitatively the chemical composition and stoichiometry in the oxide-nitride stacked films. The effect of annealing temperature on the chemical composition of ON structure has been investigated. Some species, O, N, Si were redistributed in this structure during the thermal oxidation of SiNx. Indeed, oxygen diffused to the nitride layer into Si2O2N during dry oxidation.

  11. Indentation fatigue in silicon nitride, alumina and silicon carbide ceramics

    Indian Academy of Sciences (India)

    A K Mukhopadhyay

    2001-04-01

    Repeated indentation fatigue (RIF) experiments conducted on the same spot of different structural ceramics viz. a hot pressed silicon nitride (HPSN), sintered alumina of two different grain sizes viz. 1 m and 25 m, and a sintered silicon carbide (SSiC) are reported. The RIF experiments were conducted using a Vicker’s microhardness tester at various loads in the range 1–20 N. Subsequently, the gradual evolution of the damage was characterized using an optical microscope in conjunction with the image analysing technique. The materials were classified in the order of the decreasing resistance against repeated indentation fatigue at the highest applied load of 20 N. It was further shown that there was a strong influence of grain size on the development of resistance against repeated indentation fatigue on the same spot. Finally, the poor performance of the sintered silicon carbide was found out to be linked to its previous thermal history.

  12. Analytical and Experimental Evaluation of Joining Silicon Carbide to Silicon Carbide and Silicon Nitride to Silicon Nitride for Advanced Heat Engine Applications Phase II

    Energy Technology Data Exchange (ETDEWEB)

    Sundberg, G.J.

    1994-01-01

    Techniques were developed to produce reliable silicon nitride to silicon nitride (NCX-5101) curved joins which were used to manufacture spin test specimens as a proof of concept to simulate parts such as a simple rotor. Specimens were machined from the curved joins to measure the following properties of the join interlayer: tensile strength, shear strength, 22 C flexure strength and 1370 C flexure strength. In parallel, extensive silicon nitride tensile creep evaluation of planar butt joins provided a sufficient data base to develop models with accurate predictive capability for different geometries. Analytical models applied satisfactorily to the silicon nitride joins were Norton's Law for creep strain, a modified Norton's Law internal variable model and the Monkman-Grant relationship for failure modeling. The Theta Projection method was less successful. Attempts were also made to develop planar butt joins of siliconized silicon carbide (NT230).

  13. Combination of silicon nitride and porous silicon induced optoelectronic features enhancement of multicrystalline silicon solar cells

    Energy Technology Data Exchange (ETDEWEB)

    Rabha, Mohamed Ben; Dimassi, Wissem; Gaidi, Mounir; Ezzaouia, Hatem; Bessais, Brahim [Laboratoire de Photovoltaique, Centre de Recherches et des Technologies de l' Energie, Technopole de Borj-Cedria, BP 95, 2050 Hammam-Lif (Tunisia)

    2011-06-15

    The effects of antireflection (ARC) and surface passivation films on optoelectronic features of multicrystalline silicon (mc-Si) were investigated in order to perform high efficiency solar cells. A double layer consisting of Plasma Enhanced Chemical Vapor Deposition (PECVD) of silicon nitride (SiN{sub x}) on porous silicon (PS) was achieved on mc-Si surfaces. It was found that this treatment decreases the total surface reflectivity from about 25% to around 6% in the 450-1100 nm wavelength range. As a result, the effective minority carrier diffusion length, estimated from the Laser-beam-induced current (LBIC) method, was found to increase from 312 {mu}m for PS-treated cells to about 798 {mu}m for SiN{sub x}/PS-treated ones. The deposition of SiN{sub x} was found to impressively enhance the minority carrier diffusion length probably due to hydrogen passivation of surface, grain boundaries and bulk defects. Fourier Transform Infrared Spectroscopy (FTIR) shows that the vibration modes of the highly suitable passivating Si-H bonds exhibit frequency shifts toward higher wavenumber, depending on the x ratio of the introduced N atoms neighbors. (copyright 2011 WILEY-VCH Verlag GmbH and Co. KGaA, Weinheim) (orig.)

  14. Photoluminescence and carrier transport mechanisms of silicon-rich silicon nitride light emitting device

    Energy Technology Data Exchange (ETDEWEB)

    Liao, Wugang [School of Optical and Electronic Information, Huazhong University of Science and Technology, Wuhan, Hubei 430074 (China); Zeng, Xiangbin, E-mail: eexbzeng@mail.hust.edu.cn [School of Optical and Electronic Information, Huazhong University of Science and Technology, Wuhan, Hubei 430074 (China); Yao, Wei [Shenzhen Institute of Huazhong University of Science and Technology, Shenzhen 518000 (China); Wen, Xixing [School of Optical and Electronic Information, Huazhong University of Science and Technology, Wuhan, Hubei 430074 (China)

    2015-10-01

    Highlights: • Amorphous silicon quantum dots (a-Si QDs) embedded in silicon nitride were fabricated using plasma-enhanced chemical vapor deposition (PECVD). • Two different excitation sources were used to investigate the PL mechanisms. • Light emitting diode (LED) with ITO/SiNx/p-Si/Al structure was fabricated and the carrier transport mechanisms were investigated. - Abstract: Silicon-rich silicon nitride (SRSN) films were prepared on p-type silicon substrates using plasma-enhanced chemical vapor deposition (PECVD). Small size (∼3 nm) amorphous silicon quantum dots (a-Si QDs) were obtained after 1100 °C annealing. Two different excitation sources, namely 325 nm and 532 nm lasers, were introduced to investigate the photoluminescence (PL) properties. The PL bands pumped by 325 nm laser at ∼2.90 eV and ∼1.80 eV were contributed to the radiative centers from N dangling bonds (DBs), while the dominant PL bands at 2.10 eV were ascribed to the instinct PL centers in the nitride matrix. However, PL emissions from band tail luminescence and quantum confined effect (QCE) in a-Si QDs were found under the excitation of 532 nm laser. Light emitting diode (LED) with ITO/SiNx/p-Si/Al structure was fabricated. Intensely red light emission was observed by naked eyes at room temperature under forward 20 V. Three different carrier transport mechanisms, namely Poole–Frenkel (P–F) tunneling, Fowler–Nordheim (F–N) tunneling and space charge limited current (SCLC), were found to fit different electric field regions. These results help to understand the PL mechanisms and to optimize the fabrication of a-Si QD LED.

  15. Photoluminescence and carrier transport mechanisms of silicon-rich silicon nitride light emitting device

    International Nuclear Information System (INIS)

    Highlights: • Amorphous silicon quantum dots (a-Si QDs) embedded in silicon nitride were fabricated using plasma-enhanced chemical vapor deposition (PECVD). • Two different excitation sources were used to investigate the PL mechanisms. • Light emitting diode (LED) with ITO/SiNx/p-Si/Al structure was fabricated and the carrier transport mechanisms were investigated. - Abstract: Silicon-rich silicon nitride (SRSN) films were prepared on p-type silicon substrates using plasma-enhanced chemical vapor deposition (PECVD). Small size (∼3 nm) amorphous silicon quantum dots (a-Si QDs) were obtained after 1100 °C annealing. Two different excitation sources, namely 325 nm and 532 nm lasers, were introduced to investigate the photoluminescence (PL) properties. The PL bands pumped by 325 nm laser at ∼2.90 eV and ∼1.80 eV were contributed to the radiative centers from N dangling bonds (DBs), while the dominant PL bands at 2.10 eV were ascribed to the instinct PL centers in the nitride matrix. However, PL emissions from band tail luminescence and quantum confined effect (QCE) in a-Si QDs were found under the excitation of 532 nm laser. Light emitting diode (LED) with ITO/SiNx/p-Si/Al structure was fabricated. Intensely red light emission was observed by naked eyes at room temperature under forward 20 V. Three different carrier transport mechanisms, namely Poole–Frenkel (P–F) tunneling, Fowler–Nordheim (F–N) tunneling and space charge limited current (SCLC), were found to fit different electric field regions. These results help to understand the PL mechanisms and to optimize the fabrication of a-Si QD LED

  16. Study on coefficient of thermal conductivity of silicon carbide material bonded with silicon nitride determined with laser flash method%激光闪射法测试氮化硅结合碳化硅材料导热系数的研究

    Institute of Scientific and Technical Information of China (English)

    王东; 刘宗奎; 张斌; 赵维平

    2012-01-01

    Laser flash method is widely studied and applied in the aspect of determination of coefficient of thermal conductivity of materials.The thermal conductivity of silicon carbide material bonded with silicon nitride is determined with laser flash method,the factors that have influence on accuracy are analyzed and the corresponding measures are put forward.%激光闪射法在材料导热系数的测量方面已得到广泛研究和应用。利用激光闪射法测试了氮化硅结合碳化硅材料的导热系数,分析了影响结果准确性的因素,并提出了相应措施。

  17. Electroless plating of thin gold films directly onto silicon nitride thin films and into micropores.

    Science.gov (United States)

    Whelan, Julie C; Karawdeniya, Buddini Iroshika; Bandara, Y M Nuwan D Y; Velleco, Brian D; Masterson, Caitlin M; Dwyer, Jason R

    2014-07-23

    A method to directly electrolessly plate silicon-rich silicon nitride with thin gold films was developed and characterized. Films with thicknesses coating planar, curved, and line-of-sight-obscured silicon nitride surfaces. PMID:24999923

  18. Fabrication of silicon nitride-silicon carbide nanocomposite ceramics

    International Nuclear Information System (INIS)

    Silicon nitride-silicon carbide nanocomposites have so far been fabricated by hot-pressing fine amorphous Si-C-N powder produced by CVD. This composite exhibited excellent strength and fracture toughness and maintained high strength to temperatures above 1200 C. The current work deals with the fabrication of nanocomposites produced using mixtures of Si3N4 and nanosize SiC powders. Conventional processing techniques were used to optimise the dispersion of the SiC particles. Densification was achieved by pressureless sintering, gas pressure sintering and sinter/HIPping. Mechanical properties such as hardness, fracture toughness and strength at room temperature were assessed. The nanocomposites produced were compared with composites produced using alternative starting materials. (orig.)

  19. Thermal tuners on a Silicon Nitride platform

    CERN Document Server

    Pérez, Daniel; Baños, Rocío; Doménech, José David; Sánchez, Ana M; Cirera, Josep M; Mas, Roser; Sánchez, Javier; Durán, Sara; Pardo, Emilio; Domínguez, Carlos; Pastor, Daniel; Capmany, José; Muñoz, Pascual

    2016-01-01

    In this paper, the design trade-offs for the implementation of small footprint thermal tuners on silicon nitride are presented, and explored through measurements and supporting simulations of a photonic chip based on Mach-Zehnder Interferometers. Firstly, the electrical properties of the tuners are assessed, showing a compromise between compactness and deterioration. Secondly, the different variables involved in the thermal efficiency, switching power and heater dimensions, are analysed. Finally, with focus on exploring the limits of this compact tuners with regards to on chip component density, the thermal-cross talk is also investigated. Tuners with footprint of 270x5 {\\mu}m 2 and switching power of 350 mW are reported, with thermal-cross talk, in terms of induced phase change in adjacent devices of less than one order of magnitude at distances over 20 {\\mu}m. Paths for the improvement of thermal efficiency, power consumption and resilience of the devices are also outlined

  20. Infrared Dielectric Properties of Low-stress Silicon Nitride

    Science.gov (United States)

    Cataldo, Giuseppe; Beall, James A.; Cho, Hsiao-Mei; McAndrew, Brendan; Niemack, Michael D.; Wollack, Edward J.

    2012-01-01

    Silicon nitride thin films play an important role in the realization of sensors, filters, and high-performance circuits. Estimates of the dielectric function in the far- and mid-IR regime are derived from the observed transmittance spectra for a commonly employed low-stress silicon nitride formulation. The experimental, modeling, and numerical methods used to extract the dielectric parameters with an accuracy of approximately 4% are presented.

  1. Optical loss analysis of silicon rich nitride waveguides

    DEFF Research Database (Denmark)

    Mertens, Hans; Andersen, Karin Nordström; Svendsen, Winnie Edith

    2002-01-01

    An analysis of the propagation loss in high-index LPCVD-grown silicon rich nitride (SRN) slab waveguides and channel waveguides is presented. A propagation loss as low as 0.6 dB/cm has been achieved.......An analysis of the propagation loss in high-index LPCVD-grown silicon rich nitride (SRN) slab waveguides and channel waveguides is presented. A propagation loss as low as 0.6 dB/cm has been achieved....

  2. Hydroxide catalysis bonding of silicon carbide

    NARCIS (Netherlands)

    Veggel, A.A. van; Ende, D.A. van den; Bogenstahl, J.; Rowan, S.; Cunningham, W.; Gubbels, G.H.M.; Nijmeijer, H.

    2008-01-01

    For bonding silicon carbide optics, which require extreme stability, hydroxide catalysis bonding is considered [Rowan, S., Hough, J. and Elliffe, E., Silicon carbide bonding. UK Patent 040 7953.9, 2004. Please contact Mr. D. Whiteford for further information: D.Whiteford@admin.gla.ac.uk]. This techn

  3. Bond length variation in hydronitride molecules and nitride crystals

    Science.gov (United States)

    Buterakos, L. A.; Gibbs, G. V.; Boisen, M. B.

    1992-08-01

    Bond lengths calculated for the coordination polyhedra in hydronitride molecules match average values observed for XN bonds involving main group X-cations in nitride crystals to within ˜0.04 Å. As suggested for oxide and sulfide molecules and crystals, the forces that determine the average bond lengths recorded for coordinated polyhedra in hydronitride molecules and nitride crystals appear to be governed in large part by the atoms that comprise the polyhedra and those that induce local charge balance. The forces exerted on the coordinated polyhedra by other parts of the structure seem to play a small if not an insignificant role in governing bond length variations. Bonded radii for the nitride ion obtained from theoretical electron density maps calculated for the molecules increase linearly with bond length as observed for nitride crystals with the rock salt structure. Promolecule radii calculated for the molecules correlate with bonded and ionic radii, indicating that the electron density distributions in hydronitride molecules possess a significant atomic component, despite bond type.

  4. Evaluation of bonding between oxygen plasma treated polydimethyl siloxane and passivated silicon

    Energy Technology Data Exchange (ETDEWEB)

    Tang, K C [Bioelectronics/BioMEMS Laboratory, Institute of Microelectronics, 11 Science Park Road, Singapore Science Park II, Singapore 117685 (Singapore); Liao, E [Semiconductor Process Technologies Laboratory, Institute of Microelectronics, 11 Science Park Road, Singapore Science Park II, Singapore 117685 (Singapore); Ong, W L [Bioelectronics/BioMEMS Laboratory, Institute of Microelectronics, 11 Science Park Road, Singapore Science Park II, Singapore 117685 (Singapore); Wong, J D S [Semiconductor Process Technologies Laboratory, Institute of Microelectronics, 11 Science Park Road, Singapore Science Park II, Singapore 117685 (Singapore); Agarwal, A [Bioelectronics/BioMEMS Laboratory, Institute of Microelectronics, 11 Science Park Road, Singapore Science Park II, Singapore 117685 (Singapore); Nagarajan, R [Semiconductor Process Technologies Laboratory, Institute of Microelectronics, 11 Science Park Road, Singapore Science Park II, Singapore 117685 (Singapore); Yobas, L [Bioelectronics/BioMEMS Laboratory, Institute of Microelectronics, 11 Science Park Road, Singapore Science Park II, Singapore 117685 (Singapore)

    2006-04-01

    Oxygen plasma treatment has been used extensively to bond polydimethyl siloxane to polydimethyl siloxane or glass in the rapid prototyping of microfluidic devices. This study aimed to improve the bonding quality of polydimethyl siloxane to passivated silicon using oxygen plasma treatment, and also to evaluate the bonding quality. Four types of passivated silicon were used: phosphosilicate glass, undoped silicate glass, silicon nitride and thermally grown silicon dioxide. Bonding strength was evaluated qualitatively and quantitatively using manual peel and mechanical shear tests respectively. Through peel tests we found that the lowering of plasma pressure from 500 to 30 mTorr and using a plasma power between 20 to 60 W helped to improve the bond quality for the first three types of passivation. Detailed analysis and discussion were conducted to explain the discrepancy between the bonding strength results and peeling results. Our results suggested that polydimethyl siloxane can be effectively bonded to passivated silicon, just as to polydimethyl siloxane or glass.

  5. Modelling structure and properties of amorphous silicon boron nitride ceramics

    Directory of Open Access Journals (Sweden)

    Johann Christian Schön

    2011-06-01

    Full Text Available Silicon boron nitride is the parent compound of a new class of high-temperature stable amorphous ceramics constituted of silicon, boron, nitrogen, and carbon, featuring a set of properties that is without precedent, and represents a prototypical random network based on chemical bonds of predominantly covalent character. In contrast to many other amorphous materials of technological interest, a-Si3B3N7 is not produced via glass formation, i.e. by quenching from a melt, the reason being that the binary components, BN and Si3N4, melt incongruently under standard conditions. Neither has it been possible to employ sintering of μm-size powders consisting of binary nitrides BN and Si3N4. Instead, one employs the so-called sol-gel route starting from single component precursors such as TADB ((SiCl3NH(BCl2. In order to determine the atomic structure of this material, it has proven necessary to simulate the actual synthesis route.Many of the exciting properties of these ceramics are closely connected to the details of their amorphous structure. To clarify this structure, it is necessary to employ not only experimental probes on many length scales (X-ray, neutron- and electron scattering; complex NMR experiments; IR- and Raman scattering, but also theoretical approaches. These address the actual synthesis route to a-Si3B3N7, the structural properties, the elastic and vibrational properties, aging and coarsening behaviour, thermal conductivity and the metastable phase diagram both for a-Si3B3N7 and possible silicon boron nitride phases with compositions different from Si3N4: BN = 1 : 3. Here, we present a short comprehensive overview over the insights gained using molecular dynamics and Monte Carlo simulations to explore the energy landscape of a-Si3B3N7, model the actual synthesis route and compute static and transport properties of a-Si3BN7.

  6. Hexacoordinate bonding and aromaticity in silicon phthalocyanine.

    Science.gov (United States)

    Yang, Yang

    2010-12-23

    Si-E bondings in hexacoordinate silicon phthalocyanine were analyzed using bond order (BO), energy partition, atoms in molecules (AIM), electron localization function (ELF), and localized orbital locator (LOL). Bond models were proposed to explain differences between hexacoordinate and tetracoordinate Si-E bondings. Aromaticity of silicon phthalocyanine was investigated using nucleus-independent chemical shift (NICS), harmonic oscillator model of aromaticity (HOMA), conceptual density functional theory (DFT), ring critical point (RCP) descriptors, and delocalization index (DI). Structure, energy, bonding, and aromaticity of tetracoordinate silicon phthalocyanine were studied and compared with hexacoordinate one. PMID:21105726

  7. Second-harmonic generation in substoichiometric silicon nitride layers

    Science.gov (United States)

    Pecora, Emanuele; Capretti, Antonio; Miano, Giovanni; Dal Negro, Luca

    2013-03-01

    Harmonic generation in optical circuits offers the possibility to integrate wavelength converters, light amplifiers, lasers, and multiple optical signal processing devices with electronic components. Bulk silicon has a negligible second-order nonlinear optical susceptibility owing to its crystal centrosymmetry. Silicon nitride has its place in the microelectronic industry as an insulator and chemical barrier. In this work, we propose to take advantage of silicon excess in silicon nitride to increase the Second Harmonic Generation (SHG) efficiency. Thin films have been grown by reactive magnetron sputtering and their nonlinear optical properties have been studied by femtosecond pumping over a wide range of excitation wavelengths, silicon nitride stoichiometry and thermal processes. We demonstrate SHG in the visible range (375 - 450 nm) using a tunable 150 fs Ti:sapphire laser, and we optimize the SH emission at a silicon excess of 46 at.% demonstrating a maximum SHG efficiency of 4x10-6 in optimized films. Polarization properties, generation efficiency, and the second order nonlinear optical susceptibility are measured for all the investigated samples and discussed in terms of an effective theoretical model. Our findings show that the large nonlinear optical response demonstrated in optimized Si-rich silicon nitride materials can be utilized for the engineering of nonlinear optical functions and devices on a Si chip.

  8. Gas phase separation of silicon carbide and silicon nitride

    International Nuclear Information System (INIS)

    Pure silicon carbide and silicon nitride in compact, pore-free form have valuable properties which only could never be fully utilized so far. The two compounds cannot be melted or sintered in their pure form, additives are required for hot-pressing or pressureless sintering, and only porous material is obtained by reaction sintering, where only Si and C or Si and N are used. - The new technique of chemical gas phase separation might help to overcome the drawbacks of present techniques. In the new technique SiC is produced e.g., by pyrolysis of CH3SiCl3 and Si3N4, e.g. by reacting SiCl4 with NH3. With this techniques, the pores in SiC and Si3N4 bodies can be filled later (gas phase impregnation), very fine SiC and Si3N4 powders can be produced as well as SiC monofilaments suitable as components for SiC compound bodies. In addition fibre compound bodies can be obtained by gas phase impregnation. (orig.)

  9. Optical and passivating properties of hydrogenated amorphous silicon nitride deposited by plasma enhanced chemical vapour deposition for application on silicon solar cells

    Energy Technology Data Exchange (ETDEWEB)

    Wight, Daniel Nilsen

    2008-07-01

    quality, etch rate. The response of these parameters to high temperature anneals were correlated with structural changes in the silicon nitride films as measured by using the hydrogen bond concentration. Plasma enhanced chemical vapour deposition allows continuous variation in nearly all deposition parameters. The parameters studied in this work are the gas flow ratios and excitation power. In both direct and remote deposition systems, the increase in deposition power density lead to higher activation of ammonia which in turn lead to augmented incorporation of nitrogen into the films and thus lower refractive index. For a direct system, the same parameter change lead to a drastic fall in passivation quality of Czochralski silicon attributed to an increase in ion bombardment as well as the general observation that as deposited passivation tends to increase with refractive index. Silicon nitride films with variations in refractive index were also made by varying the silane-to-ammonia gas flow ratio. This simple parameter adjustment makes plasma enhanced chemical vapour deposited silicon nitride applicable to double layer anti-reflective coatings simulated in this work. The films were found to have an etch rate in 5% hydrofluoric acid that decreased with increasing refractive index. This behaviour is attributed to the decreasing concentration of nitrogen-to-hydrogen bonds in the films. Such bonds at the surface of silicon nitride have been suggested to be involved in the main reaction mechanism when etching silicon nitride in hydrofluoric acid. Annealing the films lead to a drastic fall in etch rates and was linked to the release of hydrogen from the nitrogen-hydrogen bonds. (author). 115 refs., 35 figs., 6 tabs

  10. Preparation of silicon carbide nitride films on Si substrate by pulsed high-energy density plasma

    Institute of Scientific and Technical Information of China (English)

    2006-01-01

    Thin films of silicon carbide nitride (SiCN) were prepared on (111) oriented silicon substrates by pulsed high-energy density plasma (PHEDP). The evolution of the chemical bonding states between silicon, nitrogen and carbon was investigated as a function of discharge voltage using X-ray photoelectron spectroscopy. With an increase in discharge voltage both the C1s and N 1s spectra shift to lower binding energy due to the formation of C-Si and N-Si bonds. The Si-C-N bonds were observed in the deconvolved C1s and N 1s spectra. The X-ray diffractometer (XRD) results show that there were no crystals in the films. The thickness of the films was approximately 1-2 μm with scanning electron microscopy (SEM).

  11. Nano-ridge fabrication by local oxidation of silicon edges with silicon nitride as a mask

    NARCIS (Netherlands)

    Haneveld, Jeroen; Berenschot, Erwin; Maury, Pascale; Jansen, Henri

    2005-01-01

    A method to fabricate nano-ridges over a full wafer is presented. The fabrication method uses local oxidation of silicon, with silicon nitride as a mask, and wet anisotropic etching of silicon. The realized structures are 7-20 nm wide, 40-100 nm high and centimeters long. All dimensions are easily a

  12. Nano-ridge fabrication by local oxidation of silicon edges with silicon nitride as a mask

    NARCIS (Netherlands)

    Haneveld, Jeroen; Berenschot, Erwin; Maury, Pascale; Jansen, Henri

    2006-01-01

    A method to fabricate nano-ridges over a full wafer is presented. The fabrication method uses local oxidation of silicon, with silicon nitride as a mask, and wet anisotropic etching of silicon. The realized structures are 7–20 nm wide, 40–100 nm high and centimeters long. All dimensions are easily a

  13. Fabrication of sinterable silicon nitride by injection molding

    Science.gov (United States)

    Quackenbush, C. L.; French, K.; Neil, J. T.

    1982-01-01

    Transformation of structural ceramics from the laboratory to production requires development of near net shape fabrication techniques which minimize finish grinding. One potential technique for producing large quantities of complex-shaped parts at a low cost, and microstructure of sintered silicon nitride fabricated by injection molding is discussed and compared to data generated from isostatically dry-pressed material. Binder selection methodology, compounding of ceramic and binder components, injection molding techniques, and problems in binder removal are discussed. Strength, oxidation resistance, and microstructure of sintered silicon nitride fabricated by injection molding is discussed and compared to data generated from isostatically dry-pressed material.

  14. Plasma-Enhanced Atomic Layer Deposition of Silicon Nitride Using a Novel Silylamine Precursor.

    Science.gov (United States)

    Park, Jae-Min; Jang, Se Jin; Yusup, Luchana L; Lee, Won-Jun; Lee, Sang-Ick

    2016-08-17

    We report the plasma-enhanced atomic layer deposition (PEALD) of silicon nitride thin film using a silylamine compound as the silicon precursor. A series of silylamine compounds were designed by replacing SiH3 groups in trisilylamine by dimethylaminomethylsilyl or trimethylsilyl groups to obtain sufficient thermal stability. The silylamine compounds were synthesized through redistribution, amino-substitution, lithiation, and silylation reactions. Among them, bis(dimethylaminomethylsilyl)trimethylsilyl amine (C9H29N3Si3, DTDN2-H2) was selected as the silicon precursor because of the lowest bond dissociation energy and sufficient vapor pressures. The energies for adsorption and reaction of DTDN2-H2 with the silicon nitride surface were also calculated by density functional theory. PEALD silicon nitride thin films were prepared using DTDN2-H2 and N2 plasma. The PEALD process window was between 250 and 400 °C with a growth rate of 0.36 Å/cycle. The best film quality was obtained at 400 °C with a RF power of 100 W. The PEALD film prepared showed good bottom and sidewall coverages of ∼80% and ∼73%, respectively, on a trench-patterned wafer with an aspect ratio of 5.5. PMID:27447839

  15. Plasma-Enhanced Atomic Layer Deposition of Silicon Nitride Using a Novel Silylamine Precursor.

    Science.gov (United States)

    Park, Jae-Min; Jang, Se Jin; Yusup, Luchana L; Lee, Won-Jun; Lee, Sang-Ick

    2016-08-17

    We report the plasma-enhanced atomic layer deposition (PEALD) of silicon nitride thin film using a silylamine compound as the silicon precursor. A series of silylamine compounds were designed by replacing SiH3 groups in trisilylamine by dimethylaminomethylsilyl or trimethylsilyl groups to obtain sufficient thermal stability. The silylamine compounds were synthesized through redistribution, amino-substitution, lithiation, and silylation reactions. Among them, bis(dimethylaminomethylsilyl)trimethylsilyl amine (C9H29N3Si3, DTDN2-H2) was selected as the silicon precursor because of the lowest bond dissociation energy and sufficient vapor pressures. The energies for adsorption and reaction of DTDN2-H2 with the silicon nitride surface were also calculated by density functional theory. PEALD silicon nitride thin films were prepared using DTDN2-H2 and N2 plasma. The PEALD process window was between 250 and 400 °C with a growth rate of 0.36 Å/cycle. The best film quality was obtained at 400 °C with a RF power of 100 W. The PEALD film prepared showed good bottom and sidewall coverages of ∼80% and ∼73%, respectively, on a trench-patterned wafer with an aspect ratio of 5.5.

  16. Silicon nitride coated silicon thin film on three dimensions current collector for lithium ion battery anode

    Science.gov (United States)

    Wu, Cheng-Yu; Chang, Chun-Chi; Duh, Jenq-Gong

    2016-09-01

    Silicon nitride coated silicon (N-Si) has been synthesized by two-step DC sputtering on Cu Micro-cone arrays (CMAs) at ambient temperature. The electrochemical properties of N-Si anodes with various thickness of nitride layer are investigated. From the potential window of 1.2 V-0.05 V, high rate charge-discharge and long cycle test have been executed to investigate the electrochemical performances of various N-Si coated Si-based lithium ion batteries anode materials. Higher specific capacity can be obtained after 200 cycles. The cycling stability is enhanced via thinner nitride layer coating as silicon nitride films are converted to Li3N with covered Si thin films. These N-Si anodes can be cycled under high rates up to 10 C due to low charge transfer resistance resulted from silicon nitride films. This indicates that the combination of silicon nitride and silicon can effectively endure high current and thus enhance the cycling stability. It is expected that N-Si is a potential candidate for batteries that can work effectively under high power.

  17. Nitridation Behaviour,Microstructure and Proerties of Si—SiC Compostites Seeded with Morphologically Regulated β—Silicon Nitride Crystals

    Institute of Scientific and Technical Information of China (English)

    K.Amoako-Appiagyei; SooYoungLee; 等

    1999-01-01

    Nitridation of Si-SiC compacts ,containing β-Si3N4 single crystals as seed ,showed a higher yield of nitride with increase of the seed content,Samples containing seed with the largest aspect-ratio gave the best nitridation results.The evolution of the large epitaxially-grown grains,from the seed( as nucleus),during the subsequent liquid phase sintering process,gave ,rise to a bi-modal microstructure,The population of large grains was found to inrease with the volume of added seed.Samples containing 3 volume % exhibited the best mechanical properties,Fracture toughness of the sintered reaction bonded silicon nitride showed improvement in excess of 35% compared to the baselince Si3N4.

  18. Dispersion engineering silicon nitride waveguides for broadband nonlinear frequency conversion

    NARCIS (Netherlands)

    Epping, J.P.

    2015-01-01

    In this thesis, we investigated nonlinear frequency conversion of optical wavelengths using integrated silicon nitride (Si3N4) waveguides. Two nonlinear conversion schemes were considered: seeded four-wave mixing and supercontinuum generation. The first—seeded four-wave mixing—is investigated by a n

  19. Single-layer graphene on silicon nitride micromembrane resonators

    DEFF Research Database (Denmark)

    Schmid, Silvan; Bagci, Tolga; Zeuthen, Emil;

    2014-01-01

    Due to their low mass, high quality factor, and good optical properties, silicon nitride (SiN) micromembrane resonators are widely used in force and mass sensing applications, particularly in optomechanics. The metallization of such membranes would enable an electronic integration with the prospect...

  20. Atomistic models of hydrogenated amorphous silicon nitride from first principles

    NARCIS (Netherlands)

    Jarolimek, K.; De Groot, R.A.; De Wijs, G.A.; Zeman, M.

    2010-01-01

    We present a theoretical study of hydrogenated amorphous silicon nitride (a-SiNx:H), with equal concentrations of Si and N atoms (x=1), for two considerably different densities (2.0 and 3.0 g/cm3). Densities and hydrogen concentration were chosen according to experimental data. Using first-principle

  1. Atomistic models of hydrogenated amorphous silicon nitride from first principles

    NARCIS (Netherlands)

    Jarolimek, K.; Groot, R.A. de; Wijs, G.A. de; Zeman, M.

    2010-01-01

    We present a theoretical study of hydrogenated amorphous silicon nitride (a-SiNx:H), with equal concentrations of Si and N atoms (x=1), for two considerably different densities (2.0 and 3.0 g/cm3). Densities and hydrogen concentration were chosen according to experimental data. Using first-principle

  2. The design, fabrication, and testing of corrugated silicon nitride diaphragms

    NARCIS (Netherlands)

    Scheeper, Patrick R.; Olthuis, Wouter; Bergveld, Piet

    1994-01-01

    Silicon nitride corrugated diaphragms of 2 mm×2 mm×1 ¿m have been fabricated with 8 circular corrugations, having depths of 4, 10, or 14 ¿m. The diaphragms with 4-¿m-deep corrugations show a measured mechanical sensitivity (increase in the deflection over the increase in the applied pressure) which

  3. Proportional control valves integrated in silicon nitride surface channel technology

    NARCIS (Netherlands)

    Groen, Maarten S.; Groenesteijn, Jarno; Meutstege, Esken; Brookhuis, Robert A.; Brouwer, Dannis M.; Lötters, Joost C.; Wiegerink, Remco J.

    2015-01-01

    We have designed and realized two types of proportional microcontrol valves in a silicon nitride surface channel technology process. This enables on-die integration of flow controllers with other surface channel devices, such as pressure sensors or thermal or Coriolis-based (mass) flow sensors, to o

  4. Quantum Cavity Optomechanics with Phononic Bandgap Shielded Silicon Nitride Membranes

    DEFF Research Database (Denmark)

    Nielsen, William Hvidtfelt Padkær

    .In this work, we report on the progress of bringing a cavity optomechanicalsystem “up to speed” for the later integration into a hybrid atomic-opticalmechanicalentanglement experiment. The optomechanical system in considerationconsists of a highly stressed stoichiometric silicon-nitride membrane placedbetween...

  5. Silicon nitride Micromesh Bolometer Array for Submillimeter Astrophysics.

    Science.gov (United States)

    Turner, A D; Bock, J J; Beeman, J W; Glenn, J; Hargrave, P C; Hristov, V V; Nguyen, H T; Rahman, F; Sethuraman, S; Woodcraft, A L

    2001-10-01

    We present the design and performance of a feedhorn-coupled bolometer array intended for a sensitive 350-mum photometer camera. Silicon nitride micromesh absorbers minimize the suspended mass and heat capacity of the bolometers. The temperature transducers, neutron-transmutation-doped Ge thermistors, are attached to the absorber with In bump bonds. Vapor-deposited electrical leads address the thermistors and determine the thermal conductance of the bolometers. The bolometer array demonstrates a dark noise-equivalent power of 2.9 x 10(-17) W/ radicalHz and a mean heat capacity of 1.3 pJ/K at 390 mK. We measure the optical efficiency of the bolometer and feedhorn to be 0.45-0.65 by comparing the response to blackbody calibration sources. The bolometer array demonstrates theoretical noise performance arising from the photon and the phonon and Johnson noise, with photon noise dominant under the design background conditions. We measure the ratio of total noise to photon noise to be 1.21 under an absorbed optical power of 2.4 pW. Excess noise is negligible for audio frequencies as low as 30 mHz. We summarize the trade-offs between bare and feedhorn-coupled detectors and discuss the estimated performance limits of micromesh bolometers. The bolometer array demonstrates the sensitivity required for photon noise-limited performance from a spaceborne, passively cooled telescope. PMID:18364768

  6. Formation and characterization of DNA microarrays at silicon nitride substrates.

    Science.gov (United States)

    Manning, Mary; Redmond, Gareth

    2005-01-01

    A versatile method for direct, covalent attachment of DNA microarrays at silicon nitride layers, previously deposited by chemical vapor deposition at silicon wafer substrates, is reported. Each microarray fabrication process step, from silicon nitride substrate deposition, surface cleaning, amino-silanation, and attachment of a homobifunctional cross-linking molecule to covalent immobilization of probe oligonucleotides, is defined, characterized, and optimized to yield consistent probe microarray quality, homogeneity, and probe-target hybridization performance. The developed microarray fabrication methodology provides excellent (high signal-to-background ratio) and reproducible responsivity to target oligonucleotide hybridization with a rugged chemical stability that permits exposure of arrays to stringent pre- and posthybridization wash conditions through many sustained cycles of reuse. Overall, the achieved performance features compare very favorably with those of more mature glass based microarrays. It is proposed that this DNA microarray fabrication strategy has the potential to provide a viable route toward the successful realization of future integrated DNA biochips.

  7. Optical stability of silicon nitride MIS inversion layer solar cells

    Science.gov (United States)

    Jaeger, K.; Hezel, R.

    1985-09-01

    For MIS inversion layer solar cells with silicon nitride as an AR coating, accelerated optical stress tests were performed. Degradation of the cell characteristics occurred which was found to be caused by photons with energies equal to or greater than 3.7 eV (wavelength of 335 nm or less). Generation of interface states at the silicon-insulator interface by UV light is shown to be the mechanism responsible. The original cell data could be completely restored by heat treatment (activation energy 0.5 eV) and partially by illumination with short-wavelength light. As the most striking result, however, it is demonstrated that the UV light-induced instability can be drastically improved by incorporation of cesium ions into the silicon nitride layer. An interpretation is given for this effect.

  8. Amorphous silicon rich silicon nitride optical waveguides for high density integrated optics

    DEFF Research Database (Denmark)

    Philipp, Hugh T.; Andersen, Karin Nordström; Svendsen, Winnie Edith;

    2004-01-01

    Amorphous silicon rich silicon nitride optical waveguides clad in silica are presented as a high-index contrast platform for high density integrated optics. Performance of different cross-sectional geometries have been measured and are presented with regards to bending loss and insertion loss. A ...

  9. Development of a continuous spinning process for producing silicon carbide - silicon nitride precursor fibers

    Science.gov (United States)

    1985-01-01

    An apparatus was designed for the continuous production of silicon carbide - silicon nitride precursor fibers. The precursor polymer can be fiberized, crosslined and pyrolyzed. The product is a metallic black fiber with the composition of the type C sub x Si sub y n sub z. Little, other than the tensile strength and modulus of elasticity, is known of the physical properties.

  10. Modification of silicon nitride and silicon carbide surfaces for food and biosensor applications

    NARCIS (Netherlands)

    Rosso, M.

    2009-01-01

    Silicon-rich silicon nitride (SixN4, x > 3) is a robust insulating material widely used for the coating of microdevices: its high chemical and mechanical inertness make it a material of choice for the reinforcement of fragile microstructures (e.g. suspended microcantilevers, micro-fabricated memb

  11. Thin film silicon on silicon nitride for radiation hardened dielectrically isolated MISFET's

    International Nuclear Information System (INIS)

    The permanent ionizing radiation effects resulting from charge trapping in a silicon nitride isolation dielectric have been determined for a total ionizing dose up to 107 rads (Si). Junction FET's, whose active channel region is directly adjacent to the silicon-silicon nitride interface, were used to measure the effects of the radiation induced charge trapping in the Si3N4 isolation dielectric. The JFET saturation current and channel conductance versus junction gate voltage and substrate voltage were characterized as a function of the total ionizing radiation dose. The experimental results on the Si3N4 are compared to results on similar devices with SiO2 dielectric isolation. The ramifications of using the silicon nitride for fabricating radiation hardened dielectrically isolated MIS devices are discussed

  12. Hardness and thermal stability of cubic silicon nitride

    DEFF Research Database (Denmark)

    Jiang, Jianzhong; Kragh, Flemming; Frost, D. J.;

    2001-01-01

    The hardness and thermal stability of cubic spinel silicon nitride (c-Si3N4), synthesized under high-pressure and high-temperature conditions, have been studied by microindentation measurements, and x-ray powder diffraction and scanning electron microscopy, respectively The phase at ambient...... temperature has an average hardness of 35.31 GPa, slightly larger than SiO2 stishovite, which is often referred to as the third hardest material after diamond and cubic boron nitride. The cubic phase is stable up to 1673 K in air. At 1873 K, alpha -and beta -Si3N4 phases are observed, indicating a phase...

  13. Analytical and experimental evaluation of joining silicon carbide to silicon carbide and silicon nitride to silicon nitride for advanced heat engine applications Phase 2. Final report

    Energy Technology Data Exchange (ETDEWEB)

    Sundberg, G.J.; Vartabedian, A.M.; Wade, J.A.; White, C.S. [Norton Co., Northboro, MA (United States). Advanced Ceramics Div.

    1994-10-01

    The purpose of joining, Phase 2 was to develop joining technologies for HIP`ed Si{sub 3}N{sub 4} with 4wt% Y{sub 2}O{sub 3} (NCX-5101) and for a siliconized SiC (NT230) for various geometries including: butt joins, curved joins and shaft to disk joins. In addition, more extensive mechanical characterization of silicon nitride joins to enhance the predictive capabilities of the analytical/numerical models for structural components in advanced heat engines was provided. Mechanical evaluation were performed by: flexure strength at 22 C and 1,370 C, stress rupture at 1,370 C, high temperature creep, 22 C tensile testing and spin tests. While the silicon nitride joins were produced with sufficient integrity for many applications, the lower join strength would limit its use in the more severe structural applications. Thus, the silicon carbide join quality was deemed unsatisfactory to advance to more complex, curved geometries. The silicon carbide joining methods covered within this contract, although not entirely successful, have emphasized the need to focus future efforts upon ways to obtain a homogeneous, well sintered parent/join interface prior to siliconization. In conclusion, the improved definition of the silicon carbide joining problem obtained by efforts during this contract have provided avenues for future work that could successfully obtain heat engine quality joins.

  14. Antifuse with a single silicon-rich silicon nitride insulating layer

    Science.gov (United States)

    Habermehl, Scott D.; Apodaca, Roger T.

    2013-01-22

    An antifuse is disclosed which has an electrically-insulating region sandwiched between two electrodes. The electrically-insulating region has a single layer of a non-hydrogenated silicon-rich (i.e. non-stoichiometric) silicon nitride SiN.sub.X with a nitrogen content X which is generally in the range of 0silicon. Arrays of antifuses can also be formed.

  15. Electrical Characterization of Amorphous Silicon Nitride Passivation Layers for Crystalline Silicon Solar Cells

    OpenAIRE

    Helland, Susanne

    2011-01-01

    High quality surface passivation is important for the reduction of recombination losses in solar cells. In this work, the passivation properties of amorphous hydrogenated silicon nitride for crystalline silicon solar cells were investigated, using electrical characterization, lifetime measurements and spectroscopic ellipsometry. Thin films of varying composition were deposited on p-type monocrystalline silicon wafers by plasma enhanced chemical vapor deposition (PECVD). Highest quality surfac...

  16. Preparation and evaluation of silicon nitride matrices for silicon nitride-SiC fiber composites. M.S. Thesis Final Technical Report

    Science.gov (United States)

    Axelson, Scott R.

    1988-01-01

    Continuous silicon carbide (SiC) fiber was added to three types of silicon nitride (Si3N4) matrices. Efforts were aimed at producing a dense Si3N4 matrix from reaction-bonded silicon nitride (RBSN) by hot-isostatic-pressing (HIP) and pressureless sintering, and from Si3N4 powder by hot-pressing. The sintering additives utilized were chosen to allow for densification, while not causing severe degradation of the fiber. The ceramic microstructures were evaluated using scanning optical microscopy. Vickers indentation was used to determine the microhardness and fracture toughness values of the matrices. The RBSN matrices in this study did not reach more than 80 percent of theoretical density after sintering at various temperatures, pressures, and additive levels. Hot-pressing Si3N4 powder produced the highest density matrices; hardness and toughness values were within an order of magnitude of the best literature values. The best sintering aid composition chosen included Y2O3, SiO2, and Al2O3 or AlN. Photomicrographs demonstrate a significant reduction of fiber attack by this additive composition.

  17. Avoiding silicon/glass bonding damage with fusion bonding method

    Institute of Scientific and Technical Information of China (English)

    Daohong Yang(杨道虹); Chen Xu(徐晨); Guangdi Shen(沈光地)

    2004-01-01

    A novel fusion bonding method between silicon and glass with Nd:YAG laser is described.This method overcomes the movable mechanical parts damage caused by the electrostatics force in micro-electronic machine-system(MEMS)device during the anodic bonding. The diameter of laser spot is 300 μm,the power of laser is 100 W,the laser velocity for bonding is 0.05 m/s,the average bonding tension is 6.3 MPa.It could distinctly reduce and eliminate the defects and damage,especially in movable sensitive mechanical parts of MEMS device.

  18. DC conductivity of silicon nitride based carbon-ceramic composites

    Directory of Open Access Journals (Sweden)

    B. Fényi

    2007-12-01

    Full Text Available The silicon nitride ceramics are usually known as strongly refractory and enduring materials and have typical electrically insulating properties. If the reinforcing phase of ceramic composite (that is mainly put in the material to improve mechanical properties is a good electrical conductor, it is worth to investigate the composite in electrical aspect. In this work carbon nanotubes, black-carbon and graphite were added to the basic silicon nitride ceramic and the electrical conductivity of the prepared carbon-ceramic composites was determined. The conductivity of the ceramic composites with different type and concentration of the carbon additives was observed by applying four point DC resistance measurements. Insulator and conductor composites in a wide conductivity range can be produced depending on the type and quantity of the additives. The additive types as well as the sintering parameters have influence on the basic electrical properties of the conductor composites.

  19. Silicon Nitride: A Synthetic Mineral for Vertebrate Biology

    Science.gov (United States)

    Pezzotti, Giuseppe; McEntire, Bryan J.; Bock, Ryan; Boffelli, Marco; Zhu, Wenliang; Vitale, Eleonora; Puppulin, Leonardo; Adachi, Tetsuya; Yamamoto, Toshiro; Kanamura, Narisato; Bal, B. Sonny

    2016-08-01

    The remarkable stoichiometric flexibility of hydroxyapatite (HAp) enables the formation of a variety of charged structural sites at the material’s surface which facilitates bone remodeling due to binding of biomolecule moieties in zwitterionic fashion. In this paper, we report for the first time that an optimized biomedical grade silicon nitride (Si3N4) demonstrated cell adhesion and improved osteoconductivity comparable to highly defective, non-stoichiometric natural hydroxyapatite. Si3N4’s zwitterionic-like behavior is a function of the dualism between positive and negative charged off-stoichiometric sites (i.e., N-vacancies versus silanols groups, respectively). Lattice defects at the biomaterial’s surface greatly promote interaction with positively- and negatively-charged functional groups in biomolecules, and result in the biologically effective characteristics of silicon nitride. These findings are anticipated to be a starting point for further discoveries of therapeutic bone-graft substitute materials.

  20. Silicon Nitride Waveguides for Plasmon Optical Trapping and Sensing Applications

    CERN Document Server

    Zhao, Qiancheng; Huang, Yuewang; Capolino, Filippo; Boyraz, Ozdal

    2015-01-01

    We demonstrate a silicon nitride trench waveguide deposited with bowtie antennas for plasmonic enhanced optical trapping. The sub-micron silicon nitride trench waveguides were fabricated with conventional optical lithography in a low cost manner. The waveguides embrace not only low propagation loss and high nonlinearity, but also the inborn merits of combining micro-fluidic channel and waveguide together. Analyte contained in the trapezoidal trench channel can interact with the evanescent field from the waveguide beneath. The evanescent field can be further enhanced by plasmonic nanostructures. With the help of gold nano bowtie antennas, the studied waveguide shows outstanding trapping capability on 10 nm polystyrene nanoparticles. We show that the bowtie antennas can lead to 60-fold enhancement of electric field in the antenna gap. The optical trapping force on a nanoparticle is boosted by three orders of magnitude. A strong tendency shows the nanoparticle is likely to move to the high field strength region,...

  1. Research on Abrasives in the Chemical Mechanical Polishing Process for Silicon Nitride Balls

    Institute of Scientific and Technical Information of China (English)

    2002-01-01

    Silicon nitride (Si 3N 4) has been the main material for balls in ceramic ball bearings, for its lower density, high strength, high hardness, fine thermal stability and anticorrosive, and is widely used in various fields, such as high speed and high temperature areojet engines, precision machine tools and chemical engineer machines. Silicon nitride ceramics is a kind of brittle and hard material that is difficult to machining. In the traditional finishing process of silicon nitride balls, balls are lapped...

  2. Structure analysis of aluminium silicon manganese nitride precipitates formed in grain-oriented electrical steels

    Energy Technology Data Exchange (ETDEWEB)

    Bernier, Nicolas, E-mail: n.bernier@yahoo.fr [OCAS N.V., ArcelorMittal Global R and D Gent, Pres. J.F. Kennedylaan 3, 9060 Zelzate (Belgium); Xhoffer, Chris [OCAS N.V., ArcelorMittal Global R and D Gent, Pres. J.F. Kennedylaan 3, 9060 Zelzate (Belgium); Van De Putte, Tom, E-mail: tom.vandeputte@arcelormittal.com [OCAS N.V., ArcelorMittal Global R and D Gent, Pres. J.F. Kennedylaan 3, 9060 Zelzate (Belgium); Galceran, Montserrat [Université Libre de Bruxelles, 4MAT (Materials Engineering, Characterization, Synthesis and Recycling), Avenue F.D. Roosevelt 50, 1050 Brussels (Belgium); CIC Energigune, Albert Einstein 48, 01510 Miñano (Álava) (Spain); Godet, Stéphane [Université Libre de Bruxelles, 4MAT (Materials Engineering, Characterization, Synthesis and Recycling), Avenue F.D. Roosevelt 50, 1050 Brussels (Belgium)

    2013-12-15

    We report a detailed structural and chemical characterisation of aluminium silicon manganese nitrides that act as grain growth inhibitors in industrially processed grain-oriented (GO) electrical steels. The compounds are characterised using energy dispersive X-ray spectrometry (EDX) and energy filtered transmission electron microscopy (EFTEM), while their crystal structures are analysed using X-ray diffraction (XRD) and TEM in electron diffraction (ED), dark-field, high-resolution and automated crystallographic orientation mapping (ACOM) modes. The chemical bonding character is determined using electron energy loss spectroscopy (EELS). Despite the wide variation in composition, all the precipitates exhibit a hexagonal close-packed (h.c.p.) crystal structure and lattice parameters of aluminium nitride. The EDX measurement of ∼ 900 stoichiometrically different precipitates indicates intermediate structures between pure aluminium nitride and pure silicon manganese nitride, with a constant Si/Mn atomic ratio of ∼ 4. It is demonstrated that aluminium and silicon are interchangeably precipitated with the same local arrangement, while both Mn{sup 2+} and Mn{sup 3+} are incorporated in the h.c.p. silicon nitride interstitial sites. The oxidation of the silicon manganese nitrides most likely originates from the incorporation of oxygen during the decarburisation annealing process, thus creating extended planar defects such as stacking faults and inversion domain boundaries. The chemical composition of the inhibitors may be written as (AlN){sub x}(SiMn{sub 0.25}N{sub y}O{sub z}){sub 1−x} with x ranging from 0 to 1. - Highlights: • We study the structure of (Al,Si,Mn)N inhibitors in grain oriented electrical steels. • Inhibitors have the hexagonal close-packed symmetry with lattice parameters of AlN. • Inhibitors are intermediate structures between pure AlN and (Si,Mn)N with Si/Mn ∼ 4. • Al and Si share the same local arrangement; Mn is incorporated in both Mn

  3. Silicon nitride gate dielectrics and bandgap engineering in graphene layers

    OpenAIRE

    Zhu, Wenjuan; Neumayer, Deborah; Perebeinos, Vasili; Avouris, Phaedon

    2010-01-01

    We show that silicon nitride can provide uniform coverage of graphene in field-effect transistors while preserving the channel mobility. This insulator allowed us to study the maximum channel resistance at the Dirac (neutrality) point as a function of the strength of a perpendicular electric field in top-gated devices with different numbers of graphene layers. Using a simple model to account for surface potential variations (electron-hole puddles) near the Dirac point we estimate the field-in...

  4. Corrosion of silicon nitride in high temperature alkaline solutions

    Science.gov (United States)

    Qiu, Liyan; Guzonas, Dave A.; Qian, Jing

    2016-08-01

    The corrosion of silicon nitride (Si3N4) in alkaline solutions was studied at temperatures from 60 to 300 °C. Si3N4 experienced significant corrosion above 100 °C. The release rates of silicon and nitrogen follow zero order reaction kinetics and increase with increasing temperature. The molar ratio of dissolved silicon and nitrogen species in the high temperature solutions is the same as that in the solid phase (congruent dissolution). The activation energy for silicon and nitrogen release rates is 75 kJ/mol which agrees well with that of silica dissolution. At 300 °C, the release of aluminum is observed and follows first order reaction kinetics while other minor constituents including Ti and Y are highly enriched on the corrosion films due to the low solubility of their oxides.

  5. Behavior of incorporated nitrogen in plasma-nitrided silicon oxide formed by chemical vapor deposition

    Science.gov (United States)

    Shinoda, Nao; Itokawa, Hiroshi; Fujitsuka, Ryota; Sekine, Katsuyuki; Onoue, Seiji; Tonotani, Junichi

    2016-04-01

    The behavior of nitrogen (N) atoms in plasma-nitrided silicon oxide (SiO2) formed by chemical vapor deposition (CVD) was characterized by physical analysis and from electrical properties. The changes in the chemical bonding and distribution of N in plasma-nitrided SiO2 were investigated for different subsequent processes. N-Si3, N-Si2O, and N2 are formed in a SiO2 film by plasma nitridation. N2 molecules diffuse out during annealing at temperatures higher than 900 °C. NH species are generated from N2 molecules and H in the SiO2 film with subsequent oxide deposition using O3 as an oxidant. The capacitance-voltage (C-V) curves of metal-oxide-semiconductor (MOS) capacitors are obtained. The negative shift of the C-V curve is caused by the increase in the density of positive fix charge traps in CVD-SiO2 induced by plasma nitridation. The C-V curve of plasma-nitrided SiO2 subjected to annealing shifts to the positive direction and that subjected to the subsequent oxide deposition shifts markedly to the negative direction. It is clarified that the density of positive charge fixed traps in plasma-nitrided SiO2 films decrease because the amount of N2 molecules is decreased by annealing, and that the density of traps increases because NH species are generated and move to the interface between SiO2 and the Si substrate with the subsequent oxide deposition.

  6. Silicon waveguides produced by wafer bonding

    DEFF Research Database (Denmark)

    Poulsen, Mette; Jensen, Flemming; Bunk, Oliver;

    2005-01-01

    X-ray waveguides are successfully produced employing standard silicon technology of UV photolithography and wafer bonding. Contrary to theoretical expectations for similar systems even 100 mu m broad guides of less than 80 nm height do not collapse and can be used as one dimensional waveguides...

  7. Low noise high-Tc superconducting bolometers on silicon nitride membranes for far-infrared detection

    NARCIS (Netherlands)

    Nivelle, de M.J.M.E.; Bruijn, M.P.; Vries, de R.; Wijnbergen, J.J.; Korte, de P.A.J.; Sanchez, S.; Elwenspoek, M.; Heidenblut, T.; Schwierzi, B.; Michalke, W.; Steinbeiss, E.

    1997-01-01

    High-Tc GdBa2Cu3O7 – delta superconductor bolometers with operation temperatures near 89 K, large receiving areas of 0.95 mm2 and very high detectivity have been made. The bolometers are supported by 0.62 µm thick silicon nitride membranes. A specially developed silicon-on-nitride layer was used to

  8. Tensile creep behavior in an advanced silicon nitride

    International Nuclear Information System (INIS)

    Tensile creep behavior and changes in the microstructure of the advanced silicon nitride, SN 88M, were studied at temperatures from 1250 to 1400 C to reveal the creep resistance and lifetime-controlling processes. Assuming power law dependence of the minimum strain rate on stress, stress exponents from 6 to 8 and an apparent activation energy of 780 kJ/mol were obtained. Extensive electron microscopy observations revealed significant changes in the crystalline secondary phases and creep damage development. Creep damage was classified in two groups: 'inter-granular' defects in the amorphous boundary phases, and 'intra-granular' defects in silicon nitride grains. The inter-granular defects involved multigrain junction cavities, two-grain junction cavities, microcracks and cracks. The intra-granular defects included broken large grains, small symmetrical and asymmetrical cavities, and crack-like intragranular cavities. Cavities are generated continuously during the whole deformation starting from the threshold strain of ∝0.1%, and they contribute linearly to the tensile strain. Cavities produce more than 90% of the total tensile strain, and it is concluded that cavitation is the main creep mechanism in silicon nitride ceramics. The multigrain junction cavities are considered to be the most important for generating new volume and producing tensile strain. The Luecke and Wiederhorn (L and W) creep model, based on cavitation at multigrain junctions according to an exponential law, was proven to correspond to the stress dependence of the minimum strain rate. A qualitative model based on the L and W model was suggested and expanded to include intragranular cavitation. The basic mechanisms involve a repeating of the sequence grain boundary sliding (GBS) => cavitation at multigrain junctions => viscous flow and dissolution-precipitation. (orig.)

  9. Nanostructured silicon nitride from wheat and rice husks

    Science.gov (United States)

    Qadri, S. B.; Rath, B. B.; Gorzkowski, E. P.; Wollmershauser, J. A.; Feng, C. R.

    2016-04-01

    Nanoparticles, submicron-diameter tubes, and rods of Si3N4 were synthesized from the thermal treatment of wheat and rice husks at temperatures at and above 1300 °C in a nitrogen atmosphere. The whole pattern Rietveld analysis of the observed diffraction data from treatments at 1300 °C showed the formation of only hexagonal α-phase of Si3N4 with an R-factor of 1%, whereas samples treated at 1400 °C and above showed both α- and β-phases with an R-factor of 2%. Transmission electron microscopy showed the presence of tubes, rods, and nanoparticles of Si3N4. In a two-step process, where pure SiC was produced first from rice or wheat husk in an argon atmosphere and subsequently treated in a nitrogen atmosphere at 1450 °C, a nanostructured composite material having α- and β-phases of Si3N4 combined with cubic phase of SiC was formed. The thermodynamics of the formation of silicon nitride is discussed in terms of the solid state reaction between organic matter (silica content), which is inherently present in the wheat and rice husks, with the nitrogen from the furnace atmosphere. Nanostructures of silicon nitride formed by a single direct reaction or their composites with SiC formed in a two-step process of agricultural byproducts provide an uncomplicated sustainable synthesis route for silicon nitride used in mechanical, biotechnology, and electro-optic nanotechnology applications.

  10. Atomistic models of hydrogenated amorphous silicon nitride from first principles

    OpenAIRE

    Jarolimek, K.; de Groot, R. A.; de Wijs, G. A.; Zeman, M.

    2010-01-01

    We present a theoretical study of hydrogenated amorphous silicon nitride (a-SiNx:H), with equal concentrations of Si and N atoms (x=1), for two considerably different densities (2.0 and 3.0 g/cm3). Densities and hydrogen concentration were chosen according to experimental data. Using first-principles molecular-dynamics within density-functional theory the models were generated by cooling from the liquid. Where both models have a short-range order resembling that of crystalline Si3N4 because o...

  11. Eigenmode Splitting in all Hydrogenated Amorphous Silicon Nitride Coupled Microcavity

    Institute of Scientific and Technical Information of China (English)

    ZHANG Xian-Gao; HUANG Xin-Fan; CHEN Kun-Ji; QIAN Bo; CHEN San; DING Hong-Lin; LIU Sui; WANG Xiang; XU Jun; LI Wei

    2008-01-01

    Hydrogenated amorphous silicon nitride based coupled optical microcavity is investigated theoretically and experimentally. The theoretical calculation of the transmittance spectra of optical microcavity with one cavity and coupled microcavity with two-cavity is performed.The optical eigenmode splitting for coupled microcavity is found due to the interaction between the neighbouring localized cavities.Experimentally,the coupled cavity samples are prepared by plasma enhanced chemical vapour deposition and characterized by photoluminescence measurements.It is found that the photoluminescence peak wavelength agrees well with the cavity mode in the calculated transmittance spectra.This eigenmode splitting is analogous to the electron state energy splitting in diatom molecules.

  12. The Silicon-To-Silicon Anodic Bonding Using Sputter Deposited Intermediate Glass Layer

    OpenAIRE

    TIWARI, R; Chandra, S.

    2011-01-01

    Glass-to-silicon anodic bonding is an attractive process for packaging of microelectronics devices and Micro-electro-mechanical Systems (MEMS). Silicon to silicon anodic bonding can also be accomplished by incorporating an intermediate glass layer. In the present work, silicon-to-silicon anodic bonding has been studied with an intermediate borosilicate glass layer deposited by RF magnetron sputtering process. The bonding was carried out at low dc voltage of about 48 V at 400 °C. Surface rough...

  13. An Electromagnetically Excited Silicon Nitride Beam Resonant Accelerometer

    Directory of Open Access Journals (Sweden)

    2009-02-01

    Full Text Available A resonant microbeam accelerometer of a novel highly symmetric structure based on MEMS bulk-silicon technology is proposed and some numerical modeling results for this scheme are presented. The accelerometer consists of two proof masses, four supporting hinges, two anchors, and a vibrating triple beam, which is clamped at both ends to the two proof masses. LPCVD silicon rich nitride is chosen as the resonant triple beam material, and parameter optimization of the triple-beam structure has been performed. The triple beam is excited and sensed electromagnetically by film electrodes located on the upper surface of the beam. Both simulation and experimental results show that the novel structure increases the scale factor of the resonant accelerometer, and ameliorates other performance issues such as cross axis sensitivity of insensitive input acceleration, etc.

  14. Field Emission from Amorphous carbon Nitride Films Deposited on silicon Tip Arrays

    Institute of Scientific and Technical Information of China (English)

    李俊杰; 郑伟涛; 孙龙; 卞海蛟; 金曾孙; 赵海峰; 宋航; 孟松鹤; 赫晓东; 韩杰才

    2003-01-01

    Amorphous carbon nitride films (a-CNx) were deposited on silicon tip arrays by rf magnetron sputtering in pure nitrogen atmosphere. The field emission property of carbon nitride films on Si tips was compared with that of carbon nitride on silicon wafer. The results show that field emission property of carbon nitride films deposited on silicon tips can be improved significantly in contrast with that on wafer. It can be explained that field emission is sensitive to the local curvature and geometry, thus silicon tips can effectively promote field emission property of a-CNx films. In addition, the films deposited on silicon tips have a smaller effective work function ( F = 0.024 eV)of electron field emission than that on silicon wafer ( F = 0.060 e V), which indicates a significant enhancement of the ability of electron field emission from a-CNx films.

  15. Mechanical properties measurement of silicon nitride thin films using the bulge test

    Science.gov (United States)

    Lee, Hun Kee; Ko, Seong Hyun; Han, Jun Soo; Park, HyunChul

    2007-12-01

    The mechanical properties of silicon nitride films are investigated. Freestanding films of silicon nitride are fabricated using the MEMS technique. The films were deposited onto (100) silicon wafers by LPCVD (Low Pressure Chemical Vapor Deposition). Square and rectangular membranes are made by anisotropic etching of the silicon substrates. Then the bulge test for silicon nitride film was carried out. The thickness of specimens was 0.5, 0.75 and 1μm respectively. By testing both square and rectangular membranes, the reliability and valiant-ness of bulge test with regard to the shape of specimens was investigated. Also considering residual stress in the films, one can evaluate the Young's modulus from experimental load-deflection curves. Young's modulus of the silicon nitride films was about 232GPa. The residual stress is below 100MPa.

  16. Optimization of time–temperature schedule for nitridation of silicon compact on the basis of silicon and nitrogen reaction kinetics

    Indian Academy of Sciences (India)

    J Rakshit; P K Das

    2000-08-01

    A time–temperature schedule for formation of silicon–nitride by direct nitridation of silicon compact was optimized by kinetic study of the reaction, 3Si + 2N2 = Si3N4 at four different temperatures (1250°C, 1300°C, 1350°C and 1400°C). From kinetic study, three different temperature schedules were selected each of duration 20 h in the temperature range 1250°–1450°C, for complete nitridation. Theoretically full nitridation (100% i.e. 66.7% weight gain) was not achieved in the product having no unreacted silicon in the matrix, because impurities in Si powder and loss of material during nitridation would result in 5–10% reduction of weight gain. Green compact of density < 66% was fully nitrided by any one of the three schedules. For compact of density > 66%, the nitridation schedule was maneuvered for complete nitridation. Iron promotes nitridation reaction. Higher weight loss during nitridation of iron doped compact is the main cause of lower nitridation gain compared to undoped compact in the same firing schedule. Iron also enhances the amount of -Si3N4 phase by formation of low melting FeSi phase.

  17. The development of a porous silicon nitride crossflow filter; Final report, September 1988--September 1992

    Energy Technology Data Exchange (ETDEWEB)

    NONE

    1992-09-01

    This report summarizes the work performed in developing a permeable form of silicon nitride for application to ceramic crossflow filters for use in advanced coal-fired electric power plants. The program was sponsored by the Department of Energy Morgantown Energy Technology Center and consisted of a design analysis and material development phase and a filter manufacture and demonstration phase. The crossflow filter design and operating requirements were defined. A filter design meeting the requirements was developed and thermal and stress analyses were performed. Material development efforts focused initially on reaction-bonded silicon nitride material. This approach was not successful, and the materials effort was refocused on the development of a permeable form of sintered silicon nitride (SSN). This effort was successful. The SSN material was used for the second phase of the program, filter manufacture and evaluation. Four half-scale SAN filter modules were fabricated. Three of the modules were qualified for filter performance tests. Tests were performed on two of the three qualified modules in the High-Temperature, High-Pressure facility at the Westinghouse Science and Technology Center. The first module failed on test when it expanded into the clamping device, causing dust leakage through the filter. The second module performed well for a cumulative 150-hr test. It displayed excellent filtration capability during the test. The blowback pulse cleaning was highly effective, and the module apparently withstood the stresses induced by the periodic pulse cleaning. Testing of the module resumed, and when the flow of combustion gas through the filter was doubled, cracks developed and the test was concluded.

  18. Advanced optical modelling of dynamically deposited silicon nitride layers

    Science.gov (United States)

    Borojevic, N.; Hameiri, Z.; Winderbaum, S.

    2016-07-01

    Dynamic deposition of silicon nitrides using in-line plasma enhanced chemical vapor deposition systems results in non-uniform structure of the dielectric layer. Appropriate analysis of such layers requires the optical characterization to be performed as a function of the layer's depth. This work presents a method to characterize dynamically deposited silicon nitride layers. The method is based on the fitting of experimental spectroscopic ellipsometry data via grading of Tauc-Lorentz optical parameters through the depth of the layer. When compared with the standard Tauc-Lorentz fitting procedure, used in previous studies, the improved method is demonstrating better quality fits to the experimental data and revealing more accurate optical properties of the dielectric layers. The most significant advantage of the method is the ability to extract the depth profile of the optical properties along the direction of the layer normal. This is enabling a better understanding of layers deposited using dynamic plasma enhanced chemical vapor deposition systems frequently used in the photovoltaic industry.

  19. Research on the Fe-silicon nitride material self-producing N2 at high temperature

    Institute of Scientific and Technical Information of China (English)

    2006-01-01

    The Fe-silicon nitride synthesized by flashing combustion process was studied to determine the reaction temperature between Fe and silicon nitride, the account of N2 given out in the course of the reaction, and the change of the microstructure during calcination. The results showed that at 1127.2℃ the Fe-silicon nitride self-reacts and releases N2 and under 101.3 kPa the volume of N2 given out in the course of the reaction is 20 times more than that of the starting material. N2 is produced quickly, and completes in several decade seconds. With the producing of N2, the structure of Silicon Nitride around Fe becomes loose and porous, or cracks are formed by the reaction between Fe and silicon nitride. So if it is made use of that Fe-silicon nitride self-producing N2 at the high temperature, the performance of the material on a base of Fe-silicon nitride could be greatly improved.

  20. Similarities in the electrical conduction processes in hydrogenated amorphous silicon oxynitride and silicon nitride

    CERN Document Server

    Kato, H; Ohki, Y; Seol, K S; Noma, T

    2003-01-01

    Electrical conduction at high fields was examined in a series of hydrogenated amorphous silicon oxynitride and silicon nitride films with different nitrogen contents deposited by plasma-enhanced chemical vapour deposition. It was shown that the conduction is attributable to the Poole-Frenkel (PF) emission in the two materials. The energy depths of the PF sites and the dependences on the sample's chemical composition are quite similar for the two samples. It is considered that the PF sites in the two materials are identical.

  1. Degradation of a tantalum filament during the hot-wire CVD of silicon nitride thin films

    International Nuclear Information System (INIS)

    Electron backscatter diffraction revealed that during the hot-wire deposition of silicon nitride, a tantalum filament partially transformed to some of its nitrides and silicides. The deposition of an encapsulating silicon nitride layer occurred at the cooler filament ends. Time-of-flight secondary ion mass spectroscopy disclosed the presence of hydrogen, nitrogen and silicon containing ions within the aged filament bulk. Hardness measurements revealed that the recrystallized tantalum core experienced significant hardening, whereas the silicides and nitrides were harder but more brittle. Crack growth, porosity and the different thermal expansion amongst the various phases are all enhanced at the hotter centre regions, which resulted in failure at these areas. - Highlights: • Tantalum filament degrades and fails during hot-wire CVD of silicon nitride thin films. • An encapsulating silicon nitride layer is deposited at the cooler ends. • Electron backscatter diffraction reveals Ta-silicides and -nitrides with a Ta core. • Filament failure occurs at hot centre regions due to different mechanical properties of Ta, its silicides and nitrides

  2. Experimental Research on Residual Stress in Surface of Silicon Nitride Ceramic Balls

    Institute of Scientific and Technical Information of China (English)

    2002-01-01

    The influence of the residual stress in surface of ceramic balls on the fatigue life is large, because the life of silicon nitride ball bearings is more sensitive to the load acted on the bearings than the life of all-steel ball bearings. In this paper, the influence of thermal stress produced in sintering and mechanical stress formed in lapping process on residual stress in surface of silicon nitride ceramic balls was discussed. The residual compress stress will be formed in the surface of silicon nitride ...

  3. Selective Breaking of Hydrogen Bonds of Layered Carbon Nitride for Visible Light Photocatalysis.

    Science.gov (United States)

    Kang, Yuyang; Yang, Yongqiang; Yin, Li-Chang; Kang, Xiangdong; Wang, Lianzhou; Liu, Gang; Cheng, Hui-Ming

    2016-08-01

    Selective breaking of the hydrogen bonds of graphitic carbon nitride can introduce favorable features, including increased band tails close to the band edges and the creation of abundant pores. These features can simultaneously improve the three basic processes of photocatalysis. As a consequence, the photocatalytic hydrogen-generation activity of carbon nitride under visible light is drastically increased by tens of times.

  4. Solid-Liquid Interdiffusion Bonding of Silicon Carbide to Steel for High Temperature MEMS Sensor Packaging and Bonding

    Science.gov (United States)

    Chan, Matthew Wei-Jen

    Complex engineering systems ranging from automobile engines to geothermal wells require specialized sensors to monitor conditions such as pressure, acceleration and temperature in order to improve efficiency and monitor component lifetime in what may be high temperature, corrosive, harsh environments. Microelectromechanical systems (MEMS) have demonstrated their ability to precisely and accurately take measurements under such conditions. The systems being monitored are typically made from metals, such as steel, while the MEMS sensors used for monitoring are commonly fabricated from silicon, silicon carbide and aluminum nitride, and so there is a sizable thermal expansion mismatch between the two. For these engineering applications the direct bonding of MEMS sensors to the components being monitored is often required. This introduces several challenges, namely the development of a bond that is capable of surviving high temperature harsh environments while mitigating the thermally induced strains produced during bonding. This project investigates the development of a robust packaging and bonding process, using the gold-tin metal system and the solid-liquid interdiffusion (SLID) bonding process, to join silicon carbide substrates directly to type-316 stainless steel. The SLID process enables bonding at lower temperatures while producing a bond capable of surviving higher temperatures. Finite element analysis was performed to model the thermally induced strains generated in the bond and to understand the optimal way to design the bond. The cross-sectional composition of the bonds has been analyzed and the bond strength has been investigated using die shear testing. The effects of high temperature aging on the bond's strength and the metallurgy of the bond were studied. Additionally, loading of the bond was performed at temperatures over 415 °C, more than 100 °C, above the temperature used for bonding, with full survival of the bond, thus demonstrating the benefit of

  5. Nitride Bonded Refractory Products and Their Matching Mortars GB/T 23293-2009

    Institute of Scientific and Technical Information of China (English)

    Zhang Xiaohui

    2009-01-01

    @@ 1 Scope This standard specifies the definition, classification, brand, shape, dimension, technical requirements, test methods, quality appraisal procedures, packing, marking, storage, transportation and quality certificate of nitride bonded refractory products and their matching mortars.

  6. Single-layer graphene on silicon nitride micromembrane resonators

    Energy Technology Data Exchange (ETDEWEB)

    Schmid, Silvan; Guillermo Villanueva, Luis; Amato, Bartolo; Boisen, Anja [Department of Micro- and Nanotechnology, Technical University of Denmark, DTU Nanotech, Building 345 East, 2800 Kongens Lyngby (Denmark); Bagci, Tolga; Zeuthen, Emil; Sørensen, Anders S.; Usami, Koji; Polzik, Eugene S. [QUANTOP, Niels Bohr Institute, University of Copenhagen, 2100 Copenhagen (Denmark); Taylor, Jacob M. [Joint Quantum Institute/NIST, College Park, Maryland 20899 (United States); Herring, Patrick K.; Cassidy, Maja C. [School of Engineering and Applied Science, Harvard University, Cambridge, Massachusetts 02138 (United States); Marcus, Charles M. [Center for Quantum Devices, Niels Bohr Institute, University of Copenhagen, 2100 Copenhagen (Denmark); Cheol Shin, Yong; Kong, Jing [Department of Materials Science and Engineering, Massachusetts Institute of Technology, Cambridge, Massachusetts 02139 (United States)

    2014-02-07

    Due to their low mass, high quality factor, and good optical properties, silicon nitride (SiN) micromembrane resonators are widely used in force and mass sensing applications, particularly in optomechanics. The metallization of such membranes would enable an electronic integration with the prospect for exciting new devices, such as optoelectromechanical transducers. Here, we add a single-layer graphene on SiN micromembranes and compare electromechanical coupling and mechanical properties to bare dielectric membranes and to membranes metallized with an aluminium layer. The electrostatic coupling of graphene covered membranes is found to be equal to a perfectly conductive membrane, without significantly adding mass, decreasing the superior mechanical quality factor or affecting the optical properties of pure SiN micromembranes. The concept of graphene-SiN resonators allows a broad range of new experiments both in applied physics and fundamental basic research, e.g., for the mechanical, electrical, or optical characterization of graphene.

  7. Conductivity of materials made of aluminum nitride and silicon nitride mixtures

    Science.gov (United States)

    Gorbatov, A. G.; Kamyshov, V. M.

    1978-01-01

    To establish the possible mechanism for conductivity in aluminum nitride a study was made of the electric conductivity of pure AlN and its mixtures with silicon nitride at different temperatures and partial pressures of nitrogen in the gas phase. The thermoelectromotive force was also measured. The experiments used polycrystalline samples of cylindrical shape 18 mm in diameter made of powders by hot pressing in graphite press molds at a temperature of 1973-2273 K and pressure 1,470,000 n/sqm. The items obtained by this method had porosity not over 5%. After pressing, the samples were machined to remove carbon from the surface, and were annealed in a stream of dry ammonia for 10 h at a temperature of 1273-1373 K. Electric conductivity was measured according to the bridge scheme on an alternating current of frequency 10 kHz. In order to guarantee close contact of the platinum electrodes with the surface of the samples, a thin layer of platinum was sprayed on them. Experiments were conducted in the temperature interval 1273-1573 K with a half hour delay at each assigned temperature with heating and cooling.

  8. The influence of heterogenous porosity on silicon nitride/steel wear in lubricated rolling contact

    OpenAIRE

    KANG, J; Hadfield, M

    2000-01-01

    Heterogeneous porosity is detected on the surface and subsurface of hot isostatically pressed (HIPed) silicon nitride spherical rolling elements. The extent of the localised porosity accounts for an area of 6% of the rolling element surface and 4% of the material volume. An experimental investigation using a rotary tribometer is described to compare the lubricated rolling wear mechanisms and performance of HIPed silicon nitride with heterogeneous porosity defect in contact with steel. A brief...

  9. Nanomodeling of Nonlinear Thermoelastic Behavior of AA5454/ Silicon Nitride Nanoparticulate Metal Matrix Composites

    Directory of Open Access Journals (Sweden)

    Chennakesava R Alavala

    2016-01-01

    Full Text Available The aim of the present work was to estimate non-linear thermoelastic behavior of three-phase AA5454/silicon nitride nanoparticle metal matrix composites. The thermal loading was varied from subzero temperature to under recrystallization temperature. The RVE models were used to analyze thermo-elastic behavior. The AA5454/silicon nitride nanoparticle metal matrix composites have gained the elastic modulus below 0oC and lost at high temperatures.

  10. Bio-functionalization of silicon nitride-based piezo-resistive microcantilevers

    Indian Academy of Sciences (India)

    Nitin S Kale; Manoj Joshi; P Nageswara Rao; S Mukherji; V Ramgopal Rao

    2009-08-01

    Methods of bio-functionalize silicon nitride involve process steps to convert it into an oxynitride via plasma implantation techniques. Such methods can potentially damage microstructures such as cantilevers. In this paper, we report successful bio-functionalization of Hotwire CVD silicon nitride-based piezo-resistive cantilevers without any oxygen plasma treatment. Process to fabricate such structures and to bio-functionalize them is discussed in detail.

  11. Silicon nitride thin-films by RF sputtering : application on solid state lithium batteries

    OpenAIRE

    Sousa, R.; Ribeiro, J. F.; Sousa, J. A.; Montenegro, R. T.; L.M. Gonçalves; Correia, J.H.

    2013-01-01

    Silicon nitride is the most common barrier material to protect microsystems from atmosphere, usually deposited through CVD techniques. In this paper our aim is to highlight the advantages brought by using PVD techniques, namely RF sputtering, to deposit silicon nitride thin-films. In particular, we intend to protect microsystems fabricated only by PVD techniques and avoid the necessity of a second CVD chamber to do the microsystem coating. The influence of gases (Ar/N2) during deposition was ...

  12. Characteristics of Disorder and Defect in Hydrogenated Amorphous Silicon Nitride Thin Films Containing Silicon Nanograins

    Institute of Scientific and Technical Information of China (English)

    DING Wen-ge; YU Wei; ZHANG Jiang-yong; HAN Li; FU Guang-sheng

    2006-01-01

    The hydrogenated amorphous silicon nitride (SiNx) thin films embedded with nano-structural silicon were prepared and the microstructures at the interface of silicon nano-grains/SiNx were identified by the optical absorption and Raman scattering measurements. Characterized by the exponential tail of optical absorption and the band-width of the Raman scattering TO mode, the disorder in the interface region increases with the gas flow ratio increasing. Besides, as reflected by the sub-gap absorption coefficients, the density of interface defect states decreases, which can be attributed to the structural mismatch in the interface region and also the changes of hydrogen content in the deposited films. Additional annealing treatment results in a significant increase of defects and degree of disorder, for which the hydrogen out-diffusion in the annealing process would be responsible.

  13. Synthesis and characterization of nano silicon and titanium nitride powders using atmospheric microwave plasma technique

    Indian Academy of Sciences (India)

    S Mahendra Kumar; K Murugan; S B Chandrasekhar; Neha Hebalkar; M Krishna; B S Satyanarayana; Giridhar Madras

    2012-05-01

    We have demonstrated a simple, scalable and inexpensive method based on microwave plasma for synthesizing 5 to 10 g/h of nanomaterials. Luminescent nano silicon particles were synthesized by homogenous nucleation of silicon vapour produced by the radial injection of silicon tetrachloride vapour and nano titanium nitride was synthesized by using liquid titanium tetrachloride as the precursor. The synthesized nano silicon and titanium nitride powders were characterized by XRD, XPS, TEM, SEM and BET. The characterization techniques indicated that the synthesized powders were indeed crystalline nanomaterials.

  14. High temperature mechanical performance of a hot isostatically pressed silicon nitride

    Energy Technology Data Exchange (ETDEWEB)

    Wereszczak, A.A.; Ferber, M.K.; Jenkins, M.G.; Lin, C.K.J. [and others

    1996-01-01

    Silicon nitride ceramics are an attractive material of choice for designers and manufacturers of advanced gas turbine engine components for many reasons. These materials typically have potentially high temperatures of usefulness (up to 1400{degrees}C), are chemically inert, have a relatively low specific gravity (important for inertial effects), and are good thermal conductors (i.e., resistant to thermal shock). In order for manufacturers to take advantage of these inherent properties of silicon nitride, the high-temperature mechanical performance of the material must first be characterized. The mechanical response of silicon nitride to static, dynamic, and cyclic conditions at elevated temperatures, along with reliable and representative data, is critical information that gas turbine engine designers and manufacturers require for the confident insertion of silicon nitride components into gas turbine engines. This final report describes the high-temperature mechanical characterization and analyses that were conducted on a candidate structural silicon nitride ceramic. The high-temperature strength, static fatigue (creep rupture), and dynamic and cyclic fatigue performance were characterized. The efforts put forth were part of Work Breakdown Structure Subelement 3.2.1, {open_quotes}Rotor Data Base Generation.{close_quotes} PY6 is comparable to other hot isostatically pressed (HIPed) silicon nitrides currently being considered for advanced gas turbine engine applications.

  15. Use of additives to improve microstructures and fracture resistance of silicon nitride ceramics

    Science.gov (United States)

    Becher, Paul F.; Lin, Hua-Tay

    2011-06-28

    A high-strength, fracture-resistant silicon nitride ceramic material that includes about 5 to about 75 wt-% of elongated reinforcing grains of beta-silicon nitride, about 20 to about 95 wt-% of fine grains of beta-silicon nitride, wherein the fine grains have a major axis of less than about 1 micron; and about 1 to about 15 wt-% of an amorphous intergranular phase comprising Si, N, O, a rare earth element and a secondary densification element. The elongated reinforcing grains have an aspect ratio of 2:1 or greater and a major axis measuring about 1 micron or greater. The elongated reinforcing grains are essentially isotropically oriented within the ceramic microstructure. The silicon nitride ceramic exhibits a room temperature flexure strength of 1,000 MPa or greater and a fracture toughness of 9 MPa-m.sup.(1/2) or greater. The silicon nitride ceramic exhibits a peak strength of 800 MPa or greater at 1200 degrees C. Also included are methods of making silicon nitride ceramic materials which exhibit the described high flexure strength and fracture-resistant values.

  16. Molecular Surveillance of Viral Processes Using Silicon Nitride Membranes

    Directory of Open Access Journals (Sweden)

    Deborah F. Kelly

    2013-03-01

    Full Text Available Here we present new applications for silicon nitride (SiN membranes to evaluate biological processes. We determined that 50-nanometer thin films of SiN produced from silicon wafers were sufficiently durable to bind active rotavirus assemblies. A direct comparison of SiN microchips with conventional carbon support films indicated that SiN performs equivalent to the traditional substrate to prepare samples for Electron Microscopy (EM imaging. Likewise, SiN films coated with Ni-NTA affinity layers concentrated rotavirus particles similarly to affinity-coated carbon films. However, affinity-coated SiN membranes outperformed glow-discharged conventional carbon films 5-fold as indicated by the number of viral particles quantified in EM images. In addition, we were able to recapitulate viral uncoating and transcription mechanisms directed onto the microchip surfaces. EM images of these processes revealed the production of RNA transcripts emerging from active rotavirus complexes. These results were confirmed by the functional incorporation of radiolabeled nucleotides into the nascent RNA transcripts. Collectively, we demonstrate new uses for SiN membranes to perform molecular surveillance on life processes in real-time.

  17. Silicon-Nitride Platform for Narrowband Entangled Photon Generation

    CERN Document Server

    Ramelow, Sven; Clemmen, Stéphane; Orquiza, Daniel; Luke, Kevin; Lipson, Michal; Gaeta, Alexander L

    2015-01-01

    CMOS-compatible photonic chips are highly desirable for real-world quantum optics devices due to their scalability, robustness, and integration with electronics. Despite impressive advances using Silicon nanostructures, challenges remain in reducing their linear and nonlinear losses and in creating narrowband photons necessary for interfacing with quantum memories. Here we demonstrate the potential of the silicon nitride (Si3N4) platform by realizing an ultracompact, bright, entangled photon-pair source with selectable photon bandwidths down to 30 MHz, which is unprecedented for an integrated source. Leveraging Si3N4's moderate thermal expansion, simple temperature control of the chip enables precise wavelength stabilization and tunability without active control. Single-mode photon pairs at 1550 nm are generated at rates exceeding 107 s-1 with mW's of pump power and are used to produce time-bin entanglement. Moreover, Si3N4 allows for operation from the visible to the mid-IR, which make it highly promising fo...

  18. Studies on silicon nitrides; Chikka keiso ni kansuru kenkyu

    Energy Technology Data Exchange (ETDEWEB)

    NONE

    1997-10-31

    Sinters of silicon nitrides have excellent properties as a structural material, but their technological repercussion effect is not as much as has been expected. The cause is in insufficient understanding on the mutual relationship between microstructures and mechanical properties. Therefore, methods of controlling structures were first discussed in the studies on synthesis of high-tenacity ceramics. In order to achieve high reliability in material strength, discussions were given on means to have a structure developed with high reproducibility. Development was performed on {beta} powder which shows no abnormal grain growth and is stable at elevated temperatures. Then, quantitative evaluation was made on factors to manifest a self-compounding structure with columnar particles grown in ultrafine particles. The relationship between its chemical composition, microstructure and mechanical properties was also discussed. Particle shapes of silicon carbides and their fracture tenacity values were considered theoretically by using a drawing model. To evaluate the microstructure, it is important to determine the grain boundary composition, whereas an electric field radiation type high-performance electron microscope was developed. In discussing the fracture mechanism, a model was structured for behavior of covalent binding crystals against external stress. 164 refs., 95 figs., 10 tabs.

  19. Fabrication of porous silicon nitride ceramics using binder jetting technology

    Science.gov (United States)

    Rabinskiy, L.; Ripetsky, A.; Sitnikov, S.; Solyaev, Y.; Kahramanov, R.

    2016-07-01

    This paper presents the results of the binder jetting technology application for the processing of the Si3N4-based ceramics. The difference of the developed technology from analogues used for additive manufacturing of silicon nitride ceramics is a method of the separate deposition of the mineral powder and binder without direct injection of suspensions/slurries. It is assumed that such approach allows reducing the technology complexity and simplifying the process of the feedstock preparation, including the simplification of the composite materials production. The binders based on methyl ester of acrylic acid with polyurethane and modified starch were studied. At this stage of the investigations, the technology of green body's fabrication is implemented using a standard HP cartridge mounted on the robotic arm. For the coordinated operation of the cartridge and robot the specially developed software was used. Obtained green bodies of silicon powder were used to produce the ceramic samples via reaction sintering. The results of study of ceramics samples microstructure and composition are presented. Sintered ceramics are characterized by fibrous α-Si3N4 structure and porosity up to 70%.

  20. Nonlinear optical properties of low temperature annealed silicon-rich oxide and silicon-rich nitride materials for silicon photonics

    Energy Technology Data Exchange (ETDEWEB)

    Minissale, S. [Photonics Center, Boston University, 8 Saint Mary' s street, Boston, Massachusetts 02215-2421 (United States) and Division of Materials Science and Engineering, Boston University, 15 Saint Mary' s Street, Brookline, Massachusetts 02446 (United States); Yerci, S. [Department of Electrical and Computer Engineering, Boston University, 8 Saint Mary' s Street, Boston, Massachusetts 02215-2421 (United States); Dal Negro, L. [Photonics Center, Boston University, 8 Saint Mary' s street, Boston, Massachusetts 02215-2421 (United States) and Division of Materials Science and Engineering, Boston University, 15 Saint Mary' s Street, Brookline, Massachusetts 02446 (United States); Department of Electrical and Computer Engineering, Boston University, 8 Saint Mary' s Street, Boston, Massachusetts 02215-2421 (United States)

    2012-01-09

    We investigate the nonlinear optical properties of Si-rich silicon oxide (SRO) and Si-rich silicon nitride (SRN) samples as a function of silicon content, annealing temperature, and excitation wavelength. Using the Z-scan technique, we measure the non-linear refractive index n{sub 2} and the nonlinear absorption coefficient {beta} for a large number of samples fabricated by reactive co-sputtering. Moreover, we characterize the nonlinear optical parameters of SRN in the broad spectral region 1100-1500 nm and show the strongest nonlinearity at 1500 nm. These results demonstrate the potential of the SRN matrix for the engineering of compact devices with enhanced Kerr nonlinearities for silicon photonics applications.

  1. Study of stress in tensile nitrogen-plasma-treated multilayer silicon nitride films

    International Nuclear Information System (INIS)

    The authors conducted a physico-chemical analysis of tensile sequential-nitrogen-plasma-treated silicon nitride films, which function as stressor liners in complementary metal oxide semiconductor (CMOS) technologies. These films are made of stacked nanometer-thick, plasma-enhanced, chemical vapor-deposited layers which were individually treated with N2-plasma, to increase stress. This study allowed us to monitor the evolution of the films' chemical composition and stress as a function of process parameters such as deposition and post-N2-plasma duration. Consistent with secondary ion mass spectroscopy (SIMS), transmission electron microscopy (TEM) and other physico-chemical analysis results, it was shown that the elementary component of the films can be modeled with a bi-layer consisting of an untreated slice at the bottom that is covered by a more tensile post-treated film. In addition, we observed that longer plasma treatments increase residual stress, SiN bond concentration and layer density, while reducing hydrogen content. The stress increase induced by the plasma treatment was shown to correlate with the increase in SiN bonds following a percolation mechanism that is linked to hydrogen dissociation. Kinetics laws describing both SiN bond generation and stress increase are proposed and it is demonstrated that stress increase follows first-order kinetics.

  2. Ag doped silicon nitride nanocomposites for embedded plasmonics

    Energy Technology Data Exchange (ETDEWEB)

    Bayle, M.; Bonafos, C., E-mail: bonafos@cemes.fr; Benzo, P.; Benassayag, G.; Pécassou, B.; Carles, R. [CEMES-CNRS and Université de Toulouse, 29 rue J. Marvig, 31055 Toulouse, Cedex 04 (France); Khomenkova, L.; Gourbilleau, F. [CIMAP, CNRS/CEA/ENSICAEN/UCBN, 6 Boulevard Maréchal Juin, 14050 Caen, Cedex 4 (France)

    2015-09-07

    The localized surface plasmon-polariton resonance (LSPR) of noble metal nanoparticles (NPs) is widely exploited for enhanced optical spectroscopies of molecules, nonlinear optics, photothermal therapy, photovoltaics, or more recently in plasmoelectronics and photocatalysis. The LSPR frequency depends not only of the noble metal NP material, shape, and size but also of its environment, i.e., of the embedding matrix. In this paper, Ag-NPs have been fabricated by low energy ion beam synthesis in silicon nitride (SiN{sub x}) matrices. By coupling the high refractive index of SiN{sub x} to the relevant choice of dielectric thickness in a SiN{sub x}/Si bilayer for an optimum antireflective effect, a very sharp plasmonic optical interference is obtained in mid-range of the visible spectrum (2.6 eV). The diffusion barrier property of the host SiN{sub x} matrix allows for the introduction of a high amount of Ag and the formation of a high density of Ag-NPs that nucleate during the implantation process. Under specific implantation conditions, in-plane self-organization effects are obtained in this matrix that could be the result of a metastable coarsening regime.

  3. Ag doped silicon nitride nanocomposites for embedded plasmonics

    Science.gov (United States)

    Bayle, M.; Bonafos, C.; Benzo, P.; Benassayag, G.; Pécassou, B.; Khomenkova, L.; Gourbilleau, F.; Carles, R.

    2015-09-01

    The localized surface plasmon-polariton resonance (LSPR) of noble metal nanoparticles (NPs) is widely exploited for enhanced optical spectroscopies of molecules, nonlinear optics, photothermal therapy, photovoltaics, or more recently in plasmoelectronics and photocatalysis. The LSPR frequency depends not only of the noble metal NP material, shape, and size but also of its environment, i.e., of the embedding matrix. In this paper, Ag-NPs have been fabricated by low energy ion beam synthesis in silicon nitride (SiNx) matrices. By coupling the high refractive index of SiNx to the relevant choice of dielectric thickness in a SiNx/Si bilayer for an optimum antireflective effect, a very sharp plasmonic optical interference is obtained in mid-range of the visible spectrum (2.6 eV). The diffusion barrier property of the host SiNx matrix allows for the introduction of a high amount of Ag and the formation of a high density of Ag-NPs that nucleate during the implantation process. Under specific implantation conditions, in-plane self-organization effects are obtained in this matrix that could be the result of a metastable coarsening regime.

  4. Fabrication and properties of graphene reinforced silicon nitride composite materials

    Energy Technology Data Exchange (ETDEWEB)

    Yang, Yaping; Li, Bin, E-mail: libin@nudt.edu.cn; Zhang, Changrui; Wang, Siqing; Liu, Kun; Yang, Bei

    2015-09-17

    Silicon nitride (Si{sub 3}N{sub 4}) ceramic composites reinforced with graphene platelets (GPLs) were prepared by hot pressed sintering and pressureless sintering respectively. Adequate intermixing of the GPLs and the ceramic powders was achieved in nmethyl-pyrrolidone (NMP) under ultrasonic vibration followed by ball-milling. The microstructure and phases of the Si{sub 3}N{sub 4} ceramic composites were investigated by Field Emission Scanning Electron Microscopy (SEM) and X-ray diffraction (XRD). The effects of GPLs on the composites' mechanical properties were analyzed. The results showed that GPLs were well dispersed in the Si{sub 3}N{sub 4} ceramic matrix. β-Si{sub 3}N{sub 4,} O′-sialon and GPLs were present in the hot-pressed composites while pressureless sintered composites contain β-Si{sub 3}N{sub 4}, Si, SiC and GPLs. Graphene has the potential to improve the mechanical properties of both the hot pressed and pressureless sintered composites. Toughening effect of GPLs on the pressureless sintered composites appeared more effective than that on the hot pressed composites. Toughening mechanisms, such as pull-out, crack bridging and crack deflection induced by GPLs were observed in the composites prepared by the two methods.

  5. Plasma enhanced atomic layer deposition of silicon nitride using neopentasilane

    Energy Technology Data Exchange (ETDEWEB)

    Weeks, Stephen, E-mail: Stephen.Weeks@intermolecular.com; Nowling, Greg; Fuchigami, Nobi; Bowes, Michael; Littau, Karl [Intermolecular, 3011 North 1st Street, San Jose, California 95134 (United States)

    2016-01-15

    Progress in transistor scaling has increased the demands on the material properties of silicon nitride (SiN{sub x}) thin films used in device fabrication and at the same time placed stringent restrictions on the deposition conditions employed. Recently, low temperature plasma enhanced atomic layer deposition has emerged as a viable technique for depositing these films with a thermal budget compatible with semiconductor processing at sub-32 nm technology nodes. For these depositions, it is desirable to use precursors that are free from carbon and halogens that can incorporate into the film. Beyond this, it is necessary to develop processing schemes that minimize the wet etch rate of the film as it will be subjected to wet chemical processing in subsequent fabrication steps. In this work, the authors introduce low temperature deposition of SiN{sub x} using neopentasilane [NPS, (SiH{sub 3}){sub 4}Si] in a plasma enhanced atomic layer deposition process with a direct N{sub 2} plasma. The growth with NPS is compared to a more common precursor, trisilylamine [TSA, (SiH{sub 3}){sub 3 }N] at identical process conditions. The wet etch rates of the films deposited with NPS are characterized at different plasma conditions and the impact of ion energy is discussed.

  6. Passivation of c-Si surfaces by sub-nm amorphous silicon capped with silicon nitride

    Science.gov (United States)

    Wan, Yimao; Yan, Di; Bullock, James; Zhang, Xinyu; Cuevas, Andres

    2015-12-01

    A sub-nm hydrogenated amorphous silicon (a-Si:H) film capped with silicon nitride (SiNx) is shown to provide a high level passivation to crystalline silicon (c-Si) surfaces. When passivated by a 0.8 nm a-Si:H/75 nm SiNx stack, recombination current density J0 values of 9, 11, 47, and 87 fA/cm2 are obtained on 10 Ω.cm n-type, 0.8 Ω.cm p-type, 160 Ω/sq phosphorus-diffused, and 120 Ω/sq boron-diffused silicon surfaces, respectively. The J0 on n-type 10 Ω.cm wafers is further reduced to 2.5 ± 0.5 fA/cm2 when the a-Si:H film thickness exceeds 2.5 nm. The passivation by the sub-nm a-Si:H/SiNx stack is thermally stable at 400 °C in N2 for 60 min on all four c-Si surfaces. Capacitance-voltage measurements reveal a reduction in interface defect density and film charge density with an increase in a-Si:H thickness. The nearly transparent sub-nm a-Si:H/SiNx stack is thus demonstrated to be a promising surface passivation and antireflection coating suitable for all types of surfaces encountered in high efficiency c-Si solar cells.

  7. Elasticity and inelasticity of silicon nitride/boron nitride fibrous monoliths.

    Energy Technology Data Exchange (ETDEWEB)

    Smirnov, B. I.; Burenkov, Yu. A.; Kardashev, B. K.; Singh, D.; Goretta, K. C.; de Arellano-Lopez, A. R.; Energy Technology; Russian Academy of Sciences; Univer. de Sevilla

    2001-01-01

    A study is reported on the effect of temperature and elastic vibration amplitude on Young's modulus E and internal friction in Si{sub 3}N{sub 4} and BN ceramic samples and Si{sub 3}N{sub 4}/BN monoliths obtained by hot pressing of BN-coated Si{sub 3}N{sub 4} fibers. The fibers were arranged along, across, or both along and across the specimen axis. The E measurements were carried out under thermal cycling within the 20-600 C range. It was found that high-modulus silicon-nitride specimens possess a high thermal stability; the E(T) dependences obtained under heating and cooling coincide well with one another. The low-modulus BN ceramic exhibits a considerable hysteresis, thus indicating evolution of the defect structure under the action of thermoelastic (internal) stresses. Monoliths demonstrate a qualitatively similar behavior (with hysteresis). This behavior of the elastic modulus is possible under microplastic deformation initiated by internal stresses. The presence of microplastic shear in all the materials studied is supported by the character of the amplitude dependences of internal friction and the Young's modulus. The experimental data obtained are discussed in terms of a model in which the temperature dependences of the elastic modulus and their features are accounted for by both microplastic deformation and nonlinear lattice-atom vibrations, which depend on internal stresses.

  8. Thermal stability of boron nitride/silicon p-n heterojunction diodes

    Energy Technology Data Exchange (ETDEWEB)

    Teii, Kungen, E-mail: teii@asem.kyushu-u.ac.jp; Mizusako, Yusei; Hori, Takuro [Department of Applied Science for Electronics and Materials, Interdisciplinary Graduate School of Engineering Sciences, Kyushu University, Kasuga, Fukuoka 816-8580 (Japan); Matsumoto, Seiichiro [Department of Applied Science for Electronics and Materials, Interdisciplinary Graduate School of Engineering Sciences, Kyushu University, Kasuga, Fukuoka 816-8580 (Japan); Exploratory Materials Research Laboratory for Energy and Environment, National Institute for Materials Science, 1-2-1 Sengen, Tsukuba, Ibaraki 305-0047 (Japan)

    2015-10-21

    Heterojunctions of p-type cubic boron nitride (cBN) and n-type silicon with sp{sup 2}-bonded BN (sp{sup 2}BN) interlayers are fabricated under low-energy ion impact by plasma-enhanced chemical vapor deposition, and their rectification properties are studied at temperatures up to 573 K. The rectification ratio is increased up to the order of 10{sup 5} at room temperature by optimizing the thickness of the sp{sup 2}BN interlayer and the cBN fraction for suppressing the reverse leakage current. A highly rectifying p-type cBN/thick sp{sup 2}BN/n-type silicon junction diode shows irreversible rectification properties mainly characterized by a marked decrease in reverse current by an order of magnitude in an initial temperature ramp/down cycle. This irreversible behavior is much more reduced by conducting the cycle twice or more. The temperature-dependent properties confirm an overall increase in effective barrier heights for carrier injection and conduction by biasing at high temperatures, which consequently increases the thermal stability of the diode performance.

  9. Thermal stability of boron nitride/silicon p-n heterojunction diodes

    Science.gov (United States)

    Teii, Kungen; Mizusako, Yusei; Hori, Takuro; Matsumoto, Seiichiro

    2015-10-01

    Heterojunctions of p-type cubic boron nitride (cBN) and n-type silicon with sp2-bonded BN (sp2BN) interlayers are fabricated under low-energy ion impact by plasma-enhanced chemical vapor deposition, and their rectification properties are studied at temperatures up to 573 K. The rectification ratio is increased up to the order of 105 at room temperature by optimizing the thickness of the sp2BN interlayer and the cBN fraction for suppressing the reverse leakage current. A highly rectifying p-type cBN/thick sp2BN/n-type silicon junction diode shows irreversible rectification properties mainly characterized by a marked decrease in reverse current by an order of magnitude in an initial temperature ramp/down cycle. This irreversible behavior is much more reduced by conducting the cycle twice or more. The temperature-dependent properties confirm an overall increase in effective barrier heights for carrier injection and conduction by biasing at high temperatures, which consequently increases the thermal stability of the diode performance.

  10. Enhanced deposition of cubic boron nitride films on roughened silicon and tungsten carbide-cobalt surfaces

    Energy Technology Data Exchange (ETDEWEB)

    Teii, K., E-mail: teii@asem.kyushu-u.ac.j [Department of Applied Science for Electronics and Materials, Interdisciplinary Graduate School of Engineering Sciences, Kyushu University, Kasuga, Fukuoka 816-8580 (Japan); Hori, T. [Department of Applied Science for Electronics and Materials, Interdisciplinary Graduate School of Engineering Sciences, Kyushu University, Kasuga, Fukuoka 816-8580 (Japan); Matsumoto, S. [Exploratory Materials Research Laboratory for Energy and Environment, National Institute for Materials Science, 1-2-1 Sengen, Tsukuba, Ibaraki 305-0047 (Japan); Ceramic Forum Co. Ltd., 1-6-6 Taitoh, Taitoh-ku, Tokyo 110-0016 (Japan)

    2011-01-03

    We report the influence of substrate surface roughness on cubic boron nitride (cBN) film deposition under low-energy ion bombardment in an inductively coupled plasma. Silicon and cemented tungsten carbide-cobalt (WC-Co) surfaces are roughened by low-energy ion-assisted etching in a hydrogen plasma, followed by deposition in a fluorine-containing plasma. Infrared absorption coefficients are measured to be 22,000 cm{sup -1} and 17,000 cm{sup -1} for sp{sup 2}-bonded BN and cBN phases, respectively, for our films. For the silicon substrates, the film growth rate and the cBN content in the film increase with increasing the surface roughness, while the amount of sp{sup 2}BN phase in the film shows only a small increase. A larger surface roughness of the substrate results in a smaller contact angle of water, indicating that a higher surface free energy of the substrate contributes to enhancing growth of the cBN film. For the WC-Co substrates, the film growth rate and the cBN content in the film increase similarly by roughening the surface.

  11. Enhanced deposition of cubic boron nitride films on roughened silicon and tungsten carbide-cobalt surfaces

    International Nuclear Information System (INIS)

    We report the influence of substrate surface roughness on cubic boron nitride (cBN) film deposition under low-energy ion bombardment in an inductively coupled plasma. Silicon and cemented tungsten carbide-cobalt (WC-Co) surfaces are roughened by low-energy ion-assisted etching in a hydrogen plasma, followed by deposition in a fluorine-containing plasma. Infrared absorption coefficients are measured to be 22,000 cm-1 and 17,000 cm-1 for sp2-bonded BN and cBN phases, respectively, for our films. For the silicon substrates, the film growth rate and the cBN content in the film increase with increasing the surface roughness, while the amount of sp2BN phase in the film shows only a small increase. A larger surface roughness of the substrate results in a smaller contact angle of water, indicating that a higher surface free energy of the substrate contributes to enhancing growth of the cBN film. For the WC-Co substrates, the film growth rate and the cBN content in the film increase similarly by roughening the surface.

  12. Origin of rectification in boron nitride heterojunctions to silicon.

    Science.gov (United States)

    Teii, Kungen; Hori, Takuro; Mizusako, Yusei; Matsumoto, Seiichiro

    2013-04-10

    Cubic and hexagonal boron nitride (cBN and hBN) heterojunctions to n-type Si are fabricated under low-energy ion bombardment by inductively coupled plasma-enhanced chemical vapor deposition using the chemistry of fluorine. The sp2-bonded BN/Si heterojunction shows no rectification, while the cBN/sp2BN/Si heterojunction has rectification properties analogue to typical p-n junction diodes despite a large thickness (∼130 nm) of the sp2BN interlayer. The current-voltage characteristics at temperatures up to 573 K are governed by thermal excitation of carriers, and mostly described with the ideal diode equation and the Frenkel-Poole emission model at low and high bias voltages, respectively. The rectification in the cBN/sp2BN/Si heterojunction is caused by a bias-dependent change in the barrier height for holes arising from stronger p-type conduction in the cBN layer and enhanced with the thick sp2BN interlayer for impeding the reverse current flow at defect levels mainly associated with grain boundaries.

  13. Low temperature synthesis of silicon nitride thin films deposited by VHF/RF PECVD for gas barrier application

    Science.gov (United States)

    Lee, Jun S.; Shin, Kyung S.; Sahu, B. B.; Han, Jeon G.

    2015-09-01

    In this work, silicon nitride (SiNx) thin films were deposited on polyethylene terephthalate (PET) substrates as barrier layers by plasma enhanced chemical vapor deposition (PECVD) system. Utilizing a combination of very high-frequency (VHF 40.68 MHz) and radio-frequency (RF 13.56 MHz) plasmas it was possible to adopt PECVD deposition at low-temperature using the precursors: Hexamethyldisilazane (HMDSN) and nitrogen. To investigate relationship between film properties and plasma properties, plasma diagnostic using optical emission spectroscopy (OES) was performed along with the film analysis using Fourier transform infrared spectroscopy (FT-IR) and X-ray photoelectron spectroscopy (XPS). OES measurements show that there is dominance of the excited N2 and N2+ emissions with increase in N2 dilution, which has a significant impact on the film properties. It was seen that all the deposited films contains mainly silicon nitride with a small content of carbon and no signature of oxygen. Interestingly, upon air exposure, films have shown the formation of Si-O bonds in addition to the Si-N bonds. Measurements and analysis reveals that SiNx films deposited with high content of nitrogen with HMDSN plasma can have lower gas barrier properties as low as 7 . 3 ×10-3 g/m2/day. Also at Chiang Mai University.

  14. Tensile test of pressureless-sintered silicon nitride at elevated temperature

    Science.gov (United States)

    Matsusue, K.; Fujisawa, Y.; Takahara, K.

    1985-01-01

    Uniaxial tensile strength tests of pressureless sintered silicon nitride were carried out in air at temperatures ranging from room temperature up to 1600 C. Silicon nitrides containing Y2O3, Al2O3, Al2O3-MgO, or MgO-CeO2 additives were tested. The results show that the composition of the additive used influences the strength characteristics of the silicon nitride. The tensile strength rapidly decreased at temperatures above 1000 C for the materials containing MgO as the additive and above 1000 C for the material with Y2O3. When the temperature increased to as high as 1300 C, the strength decreased to about 10 percent of the room temperature strength in each case. Observations of the fracture origin and of the crack propagation on the fracture surfaces are discussed.

  15. Observation of second-harmonic generation in silicon nitride waveguides through bulk nonlinearities

    CERN Document Server

    Puckett, Matthew W; Lin, Hung-Hsi; Yang, Muhan; Vallini, Felipe; Fainman, Yeshaiahu

    2016-01-01

    We present experimental results on the observation of a bulk second-order nonlinear susceptibility derived from both free-space and integrated measurements in silicon nitride. Phase-matching is achieved through dispersion engineering of the waveguide cross-section, independently revealing multiple components of the nonlinear susceptibility, namely X(2)yyy and X(2)xxy. Additionally, we show how the generated second-harmonic signal may be actively tuned through the application of bias voltages across silicon nitride. The nonlinear material properties measured here are anticipated to allow for the practical realization of new nanophotonic devices in CMOS-compatible silicon nitride waveguides, adding to their viability for telecommunication, data communication, and optical signal processing applications.

  16. Processing and mechanical properties of silicon nitride/silicon carbide ceramic nanocomposites derived from polymer precursors

    Science.gov (United States)

    Gasch, Matthew Jeremy

    Creep deformation of silicon nitride and silicon carbide ceramics is dominated by a solution-precipitation process through the glassy interface phase at grain boundary regions, which is formed by the reaction of oxide additives with the silicon oxide surface layer of the ceramic powder particles during liquid phase sintering. The ultimate approach to increase the creep resistance of these materials is to decrease the oxide content at the grain boundaries, rendering the solution-precipitation process non-effective. This research presents a new method of enhancing the creep properties of silicon nitride/silicon carbide composites by forming micro-nano and nano-nano microstructures during sintering. Starting from amorphous Si-C-N powders of micrometric size particles, powders were consolidated in three ways: (1) Consolidation of pyrolyzed powders without additives, (2) Electric Field Assisted Sintering (EFAS) of pyrolyzed powders with and without additives and (3) High pressure sintering. In all three cases, nanocomposites with varied grain size were achieved. High temperature mechanical creep testing was performed on the samples sintered by EFAS. Creep rates ranged from 1 x 10-8/s to 1 x 10-11/s depending on method in which powders were prepared and total oxide additive amount. For samples with high oxide contents the stress exponent was found to be n ˜ 2 with an activation energy of Q ˜ 600kJ/mol*K, indicating the typical solution precipitation process of deformation. But for the nano-nano composites sintered with little to none oxide additive, the stress exponent was found to be n ˜ 1 with and activation energy of Q ˜ 200kJ/mol*K, hinting at a diffusion controlled mechanism of creep deformation. For the nano-nano composites sintered without oxide additives, oxygen was found in the microstructure. However, oxygen contamination was found to distribute at grain boundary regions especially triple junctions. It is suggested that this highly dispersed distribution of

  17. Si quantum dots in silicon nitride: Quantum confinement and defects

    Science.gov (United States)

    Goncharova, L. V.; Nguyen, P. H.; Karner, V. L.; D'Ortenzio, R.; Chaudhary, S.; Mokry, C. R.; Simpson, P. J.

    2015-12-01

    Luminescence of amorphous Si quantum dots (Si QDs) in a hydrogenated silicon nitride (SiNx:H) matrix was examined over a broad range of stoichiometries from Si3N2.08 to Si3N4.14, to optimize light emission. Plasma-enhanced chemical vapor deposition was used to deposit hydrogenated SiNx films with excess Si on Si (001) substrates, with stoichiometry controlled by variation of the gas flow rates of SiH4 and NH3 gases. The compositional and optical properties were analyzed by Rutherford backscattering spectroscopy, elastic recoil detection, spectroscopic ellipsometry, photoluminescence (PL), time-resolved PL, and energy-filtered transmission electron microscopy. Ultraviolet-laser-excited PL spectra show multiple emission bands from 400 nm (3.1 eV) to 850 nm (1.45 eV) for different Si3Nx compositions. There is a red-shift of the measured peaks from ˜2.3 eV to ˜1.45 eV as Si content increases, which provides evidence for quantum confinement. Higher N content samples show additional peaks in their PL spectra at higher energies, which we attribute to defects. We observed three different ranges of composition where Tauc band gaps, PL, and PL lifetimes change systematically. There is an interesting interplay of defect luminescence and, possibly, small Si QD luminescence observed in the intermediate range of compositions (˜Si3N3.15) in which the maximum of light emission is observed.

  18. Si quantum dots in silicon nitride: Quantum confinement and defects

    Energy Technology Data Exchange (ETDEWEB)

    Goncharova, L. V., E-mail: lgonchar@uwo.ca; Karner, V. L.; D' Ortenzio, R.; Chaudhary, S.; Mokry, C. R.; Simpson, P. J. [Department of Physics and Astronomy, The University of Western Ontario, London, Ontario N6A 3K7 (Canada); Nguyen, P. H. [Department of Physics, University of Alberta, Edmonton, Alberta T6G 2E1 (Canada)

    2015-12-14

    Luminescence of amorphous Si quantum dots (Si QDs) in a hydrogenated silicon nitride (SiN{sub x}:H) matrix was examined over a broad range of stoichiometries from Si{sub 3}N{sub 2.08} to Si{sub 3}N{sub 4.14}, to optimize light emission. Plasma-enhanced chemical vapor deposition was used to deposit hydrogenated SiN{sub x} films with excess Si on Si (001) substrates, with stoichiometry controlled by variation of the gas flow rates of SiH{sub 4} and NH{sub 3} gases. The compositional and optical properties were analyzed by Rutherford backscattering spectroscopy, elastic recoil detection, spectroscopic ellipsometry, photoluminescence (PL), time-resolved PL, and energy-filtered transmission electron microscopy. Ultraviolet-laser-excited PL spectra show multiple emission bands from 400 nm (3.1 eV) to 850 nm (1.45 eV) for different Si{sub 3}N{sub x} compositions. There is a red-shift of the measured peaks from ∼2.3 eV to ∼1.45 eV as Si content increases, which provides evidence for quantum confinement. Higher N content samples show additional peaks in their PL spectra at higher energies, which we attribute to defects. We observed three different ranges of composition where Tauc band gaps, PL, and PL lifetimes change systematically. There is an interesting interplay of defect luminescence and, possibly, small Si QD luminescence observed in the intermediate range of compositions (∼Si{sub 3}N{sub 3.15}) in which the maximum of light emission is observed.

  19. A Novel Bonding Method of Pure Aluminum and SUS304 Stainless Steel Using Barrel Nitriding

    Science.gov (United States)

    Kong, Jung Hyun; Okumiya, Masahiro; Tsunekawa, Yoshiki; Yun, Ky Youl; Kim, Sang Gweon; Yoshida, Masashi

    2014-09-01

    A great deal of research is being carried out on welding or bonding methods between iron and aluminum. However, it is not so easy to make Fe-Al bonding materials with both high strength and light weight. Recently, a new nitriding process has been proposed to produce aluminum nitride on an aluminum surface using a barrel. This study proposes a new concept in the production of a multilayer which has an AlN and Fe-Al intermetallic compound layer between the aluminum and steel using a barrel nitriding process. The bonding process was carried out from 893 K to 913 K (620 °C to 640 °C) for 18, 25.2, and 36 ks with Al2O3 powder and Al-Mg alloy powder. After the process, an aluminum nitride (AlN) layer and a Fe-Al intermetallic compound (Fe2Al5.4) layer were formed at the interface between the pure aluminum and SUS304 austenitic stainless steel. The thicknesses of the AlN layer and the intermetallic compound layer increased with increasing treatment temperature and time. The maximum hardnesses of the AlN layer and Fe2Al5.4 layers were found to be 377HV and 910HV, respectively, after barrel nitriding at 893 K (620 °C) for 18 ks.

  20. Atomic-resolution scanning transmission electron microscopy through 50-nm-thick silicon nitride membranes

    OpenAIRE

    Ramachandra, Ranjan; Demers, Hendrix; de Jonge, Niels

    2011-01-01

    Silicon nitride membranes can be used for windows of environmental chambers for in situ electron microscopy. We report that aberration corrected scanning transmission electron microscopy (STEM) achieved atomic resolution on gold nanoparticles placed on both sides of a 50-nm-thick silicon nitride membrane at 200 keV electron beam energy. Spatial frequencies of 1∕1.2 Å were visible for a beam semi-angle of 26.5 mrad. Imaging though a 100-nm-thick membrane was also tested. The achieved imaging c...

  1. Octave-spanning supercontinuum generation in a silicon-rich nitride waveguide.

    Science.gov (United States)

    Liu, Xing; Pu, Minhao; Zhou, Binbin; Krückel, Clemens J; Fülöp, Attila; Torres-Company, Victor; Bache, Morten

    2016-06-15

    We experimentally show octave-spanning supercontinuum generation in a nonstoichiometric silicon-rich nitride waveguide when pumped by femtosecond pulses from an erbium fiber laser. The pulse energy and bandwidth are comparable to results achieved in stoichiometric silicon nitride waveguides, but our material platform is simpler to manufacture. We also observe wave-breaking supercontinuum generation by using orthogonal pumping in the same waveguide. Additional analysis reveals that the waveguide height is a powerful tuning parameter for generating mid-infrared dispersive waves while keeping the pump in the telecom band. PMID:27304272

  2. Processing, mechanical and thermophysical properties of silicon nitride based composites with carbon nanotubes and graphene

    Directory of Open Access Journals (Sweden)

    O. Koszor

    2007-12-01

    Full Text Available Silicon nitride based composites with different amount (1, 2 and 3 wt% of multi-wall and single-wall carbon nanotubes, and graphene have been prepared. Optimisation of the manufacturing processes has been conducted to preserve the carbon nanotubes in composites and to avoid damaging during high temperature processing. The first results show that carbon nanotubes have a good contact to the surface of silicon nitride grains. In the case of increase of sintering pressure an increase of bending strength was achieved. It was found that microstructure features achieved by properly designed sintering parameters are the main responsible factors for the strength improvements.

  3. Octave-spanning supercontinuum generation in a silicon-rich nitride waveguide

    Science.gov (United States)

    Liu, Xing; Pu, Minhao; Zhou, Binbin; Krückel, Clemens J.; Fülöp, Attila; Torres-Company, Victor; Bache, Morten

    2016-06-01

    We experimentally show octave-spanning supercontinuum generation in a non-stoichiometric silicon-rich nitride waveguide when pumped by femtosecond pulses from an erbium fiber laser. The pulse energy and bandwidth are comparable to results achieved in stoichiometric silicon nitride waveguides, but our material platform is simpler to manufacture. We also observe wave-breaking supercontinuum generation by using orthogonal pumping in the same waveguide. Additional analysis reveals that the waveguide height is a powerful tuning parameter for generating mid-infrared dispersive waves while keeping the pump in the telecom band.

  4. Octave-spanning supercontinuum generation in a silicon-rich nitride waveguide

    DEFF Research Database (Denmark)

    Liu, Xing; Pu, Minhao; Zhou, Binbin;

    2016-01-01

    We experimentally show octave-spanning supercontinuum generation in a nonstoichiometric silicon-rich nitride waveguide when pumped by femtosecond pulses from an erbium fiber laser. The pulse energy and bandwidth are comparable to results achieved in stoichiometric silicon nitride waveguides, but...... our material platform is simpler to manufacture. We also observe wave-breaking supercontinuum generation by using orthogonal pumping in the same waveguide. Additional analysis reveals that the waveguide height is a powerful tuning parameter for generating mid-infrared dispersive waves while keeping...

  5. Processing study of injection molding of silicon nitride for engine applications

    Science.gov (United States)

    Rorabaugh, M. E.; Yeh, H. C.

    1985-01-01

    The high hardness of silicon nitride, which is currently under consideration as a structural material for such hot engine components as turbine blades, renders machining of the material prohibitively costly; the near net shape forming technique of injection molding is accordingly favored as a means for component fabrication. Attention is presently given to the relationships between injection molding processing parameters and the resulting microstructural and mechanical properties of the resulting engine parts. An experimental program has been conducted under NASA sponsorship which tests the quality of injection molded bars of silicon nitride at various stages of processing.

  6. Alternative Liquid Fuel Effects on Cooled Silicon Nitride Marine Gas Turbine Airfoils

    Energy Technology Data Exchange (ETDEWEB)

    Holowczak, J.

    2002-03-01

    With prior support from the Office of Naval Research, DARPA, and U.S. Department of Energy, United Technologies is developing and engine environment testing what we believe to be the first internally cooled silicon nitride ceramic turbine vane in the United States. The vanes are being developed for the FT8, an aeroderivative stationary/marine gas turbine. The current effort resulted in further manufacturing and development and prototyping by two U.S. based gas turbine grade silicon nitride component manufacturers, preliminary development of both alumina, and YTRIA based environmental barrier coatings (EBC's) and testing or ceramic vanes with an EBC coating.

  7. Octave-spanning supercontinuum generation in a silicon-rich nitride waveguide

    CERN Document Server

    Liu, Xing; Zhou, Binbin; Krückel, Clemens J; Fülöp, Attila; Torres-Company, Victor; Bache, Morten

    2016-01-01

    We experimentally show octave-spanning supercontinuum generation in a non-stoichiometric silicon-rich nitride waveguide when pumped by femtosecond pulses from an erbium fiber laser. The pulse energy and bandwidth are comparable to results achieved in stoichiometric silicon nitride waveguides, but our material platform is simpler to manufacture. We also observe wave-breaking supercontinuum generation by using orthogonal pumping in the same waveguide. Additional analysis reveals that the waveguide height is a powerful tuning parameter for generating mid-infrared dispersive waves while keeping the pump in the telecom band.

  8. The Effects of Silicone Contamination on Bond Performance of Various Bond Systems

    Science.gov (United States)

    Anderson, G. L.; Stanley, S. D.; Young, G. L.; Brown, R. A.; Evans, K. B.; Wurth, L. A.

    2012-01-01

    The sensitivity to silicone contamination of a wide variety of adhesive bond systems is discussed. Generalizations regarding factors that make some bond systems more sensitive to contamination than others are inferred and discussed. The effect of silane adhesion promoting primer on the contamination sensitivity of two epoxy/steel bond systems is also discussed.

  9. Process for the production of metal nitride sintered bodies and resultant silicon nitride and aluminum nitride sintered bodies

    Science.gov (United States)

    Yajima, S.; Omori, M.; Hayashi, J.; Kayano, H.; Hamano, M.

    1983-01-01

    A process for the manufacture of metal nitride sintered bodies, in particular, a process in which a mixture of metal nitrite powders is shaped and heated together with a binding agent is described. Of the metal nitrides Si3N4 and AIN were used especially frequently because of their excellent properties at high temperatures. The goal is to produce a process for metal nitride sintered bodies with high strength, high corrosion resistance, thermal shock resistance, thermal shock resistance, and avoidance of previously known faults.

  10. Passivation of c-Si surfaces by sub-nm amorphous silicon capped with silicon nitride

    Energy Technology Data Exchange (ETDEWEB)

    Wan, Yimao, E-mail: yimao.wan@anu.edu.au; Yan, Di; Bullock, James; Zhang, Xinyu; Cuevas, Andres [Research School of Engineering, The Australian National University, Canberra, Australian Capital Territory 0200 (Australia)

    2015-12-07

    A sub-nm hydrogenated amorphous silicon (a-Si:H) film capped with silicon nitride (SiN{sub x}) is shown to provide a high level passivation to crystalline silicon (c-Si) surfaces. When passivated by a 0.8 nm a-Si:H/75 nm SiN{sub x} stack, recombination current density J{sub 0} values of 9, 11, 47, and 87 fA/cm{sup 2} are obtained on 10 Ω·cm n-type, 0.8 Ω·cm p-type, 160 Ω/sq phosphorus-diffused, and 120 Ω/sq boron-diffused silicon surfaces, respectively. The J{sub 0} on n-type 10 Ω·cm wafers is further reduced to 2.5 ± 0.5 fA/cm{sup 2} when the a-Si:H film thickness exceeds 2.5 nm. The passivation by the sub-nm a-Si:H/SiN{sub x} stack is thermally stable at 400 °C in N{sub 2} for 60 min on all four c-Si surfaces. Capacitance–voltage measurements reveal a reduction in interface defect density and film charge density with an increase in a-Si:H thickness. The nearly transparent sub-nm a-Si:H/SiN{sub x} stack is thus demonstrated to be a promising surface passivation and antireflection coating suitable for all types of surfaces encountered in high efficiency c-Si solar cells.

  11. Flux stabilization of silicon nitride microsieves by backpulsing and surface modification with PEG moieties.

    Science.gov (United States)

    Gironès, M; Bolhuis-Versteeg, L A M; Lammertink, R G H; Wessling, M

    2006-07-15

    The influence of the surface properties of chemically modified silicon nitride microsieves on the filtration of protein solutions and defatted milk is described in this research. Prior to membrane filtrations, an antifouling polymer based on poly(ethylene glycol), poly(TMSMA-r-PEGMA) was synthesized and applied on silicon-based surfaces like silicon, silicon nitride, and glass. The ability of such coating to repel proteins like bovine serum albumin (BSA) was confirmed by ellipsometry and confocal fluorescence microscopy. In BSA and skimmed milk filtrations no differences could be seen between unmodified and PEG-coated membranes (decreasing permeability in time). On the other hand, reduced fouling was observed with PEG-modified microsieves in combination with backpulsing and air sparging. PMID:16603173

  12. Review: Silicon-based oxynitride and nitride phosphors for white LEDs

    Directory of Open Access Journals (Sweden)

    Rong-Jun Xie and Naoto Hirosaki

    2007-01-01

    Full Text Available As a novel class of inorganic phosphors, oxynitride and nitride luminescent materials have received considerable attention because of their potential applications in solid-state lightings and displays. In this review we focus on recent developments in the preparation, crystal structure, luminescence and applications of silicon-based oxynitride and nitride phosphors for white light-emitting diodes (LEDs. The structures of silicon-based oxynitrides and nitrides (i.e., nitridosilicates, nitridoaluminosilicates, oxonitridosilicates, oxonitridoaluminosilicates, and sialons are generally built up of networks of crosslinking SiN4 tetrahedra. This is anticipated to significantly lower the excited state of the 5d electrons of doped rare-earth elements due to large crystal-field splitting and a strong nephelauxetic effect. This enables the silicon-based oxynitride and nitride phosphors to have a broad excitation band extending from the ultraviolet to visible-light range, and thus strongly absorb blue-to-green light. The structural versatility of oxynitride and nitride phosphors makes it possible to attain all the emission colors of blue, green, yellow, and red; thus, they are suitable for use in white LEDs. This novel class of phosphors has demonstrated its superior suitability for use in white LEDs and can be used in bichromatic or multichromatic LEDs with excellent properties of high luminous efficacy, high chromatic stability, a wide range of white light with adjustable correlated color temperatures (CCTs, and brilliant color-rendering properties.

  13. Sol-gel preparation of low oxygen content, high surface area silicon nitride and imidonitride materials.

    Science.gov (United States)

    Sardar, Kripasindhu; Bounds, Richard; Carravetta, Marina; Cutts, Geoffrey; Hargreaves, Justin S J; Hector, Andrew L; Hriljac, Joseph A; Levason, William; Wilson, Felix

    2016-04-01

    Reactions of Si(NHMe)4 with ammonia are effectively catalysed by small ammonium triflate concentrations, and can be used to produce free-standing silicon imide gels. Firing at various temperatures produces amorphous or partially crystallised silicon imidonitride/nitride samples with high surface areas and low oxygen contents. The crystalline phase is entirely α-Si3N4 and structural similarities are observed between the amorphous and crystallised materials. PMID:26931152

  14. Silicon nitride membrane resonators at millikelvin temperatures with quality factors exceeding 10^8

    NARCIS (Netherlands)

    Yuan, M.; Cohen, M.A.; Steele, G.A.

    2015-01-01

    We study the mechanical dissipation of the fundamental mode of millimeter-sized, high quality-factor (Q) metalized silicon nitride membranes at temperatures down to 14 mK using a three-dimensional optomechanical cavity. Below 200 mK, high-Q modes of the membranes show a diverging increase of Q with

  15. Evaluation and silicon nitride internal combustion engine components. Final report, Phase I

    Energy Technology Data Exchange (ETDEWEB)

    Voldrich, W. [Allied-Signal Aerospace Co., Torrance, CA (United States). Garrett Ceramic Components Div.

    1992-04-01

    The feasibility of silicon nitride (Si{sub 3}N{sub 4}) use in internal combustion engines was studied by testing three different components for wear resistance and lower reciprocating mass. The information obtained from these preliminary spin rig and engine tests indicates several design changes are necessary to survive high-stress engine applications. The three silicon nitride components tested were valve spring retainers, tappet rollers, and fuel pump push rod ends. Garrett Ceramic Components` gas-pressure sinterable Si{sub 3}N{sub 4} (GS-44) was used to fabricate the above components. Components were final machined from densified blanks that had been green formed by isostatic pressing of GS-44 granules. Spin rig testing of the valve spring retainers indicated that these Si{sub 3}N{sub 4} components could survive at high RPM levels (9,500) when teamed with silicon nitride valves and lower spring tension than standard titanium components. Silicon nitride tappet rollers showed no wear on roller O.D. or I.D. surfaces, steel axles and lifters; however, due to the uncrowned design of these particular rollers the cam lobes indicated wear after spin rig testing. Fuel pump push rod ends were successful at reducing wear on the cam lobe and rod end when tested on spin rigs and in real-world race applications.

  16. On the intrinsic moisture permeation rate of remote microwave plasma-deposited silicon nitride layers

    NARCIS (Netherlands)

    Assche, F.J.H. Van; Unnikrishnan, S.; Michels, J.J.; Mol, A.M.B. van; Weijer, P. van de; Sanden, M.C.M. van de; Creatore, M.

    2014-01-01

    We report on a low substrate temperature (110°C) remote microwave plasma-enhanced chemical vapor deposition (PECVD) process of silicon nitride barrier layers against moisture permeation for organic light emitting diodes (OLEDs) and other moisture sensitive devices such as organic photovoltaic cells

  17. Silicon nitride at high growth rate using hot wire chemical vapor deposition

    NARCIS (Netherlands)

    Verlaan, V.

    2008-01-01

    Amorphous silicon nitride (SiNx) is a widely studied alloy with many commercial applications. This thesis describes the application of SiNx deposited at high deposition rate using hot wire chemical vapor deposition (HWCVD) for solar cells and thin film transistors (TFTs). The deposition process of H

  18. Size-dependent effective Young’s modulus of silicon nitride cantilevers

    NARCIS (Netherlands)

    Babaei Gavan, K.; Westra, H.J.R.; Van der Drift, E.W.J.M.; Venstra, W.J.; Van der Zant, H.S.J.

    2009-01-01

    The effective Young’s modulus of silicon nitride cantilevers is determined for thicknesses in the range of 20–684 nm by measuring resonance frequencies from thermal noise spectra. A significant deviation from the bulk value is observed for cantilevers thinner than 150 nm. To explain the observations

  19. Silicon-to-silicon wafer bonding using evaporated glass

    DEFF Research Database (Denmark)

    Weichel, Steen; Reus, Roger De; Lindahl, M.

    1998-01-01

    Anodic bending of silicon to silicon 4-in. wafers using an electron-beam evaporated glass (Schott 8329) was performed successfully in air at temperatures ranging from 200 degrees C to 450 degrees C. The composition of the deposited glass is enriched in sodium as compared to the target material. The...

  20. Fabrication of Silicon Nitride Dental Core Ceramics with Borosilicate Veneering material

    Science.gov (United States)

    Wananuruksawong, R.; Jinawath, S.; Padipatvuthikul, P.; Wasanapiarnpong, T.

    2011-10-01

    Silicon nitride (Si3N4) ceramic is a great candidate for clinical applications due to its high fracture toughness, strength, hardness and bio-inertness. This study has focused on the Si3N4 ceramic as a dental core material. The white Si3N4 was prepared by pressureless sintering at relative low sintering temperature of 1650 °C in nitrogen atmosphere. The coefficient of thermal expansion (CTE) of Si3N4 ceramic is lower than that of Zirconia and Alumina ceramic which are popular in this field. The borosilicate glass veneering was employed due to its compatibility in thermal expansion. The sintered Si3N4 specimens represented the synthetic dental core were paintbrush coated by a veneer paste composed of borosilicate glass powder (veneer on the Si3N4 specimens, the firing was performed in electric tube furnace between 1000-1200°C. The veneered specimens fired at 1100°C for 15 mins show good bonding, smooth and glossy without defect and crazing. The veneer has thermal expansion coefficient as 3.98×10-6 °C-1, rather white and semi opaque, due to zirconia addition, the Vickers hardness as 4.0 GPa which is closely to the human teeth.

  1. Ultra-short pulsed laser ablation of silicon nitride layers: Investigation near threshold fluence

    Energy Technology Data Exchange (ETDEWEB)

    Heinrich, Gerrit, E-mail: gheinrich@cismst.de [CIS Forschungsinstititut für Mikrosensorik und Photovoltaik GmbH, Konrad-Zuse-Straße 14, Erfurt 99099 (Germany); Technische Universität Ilmenau, Institut für Physik, Weimarer Str. 32, Ilmenau 98693 (Germany); Wollgarten, Markus [Helmholtz Zentrum Berlin für Materialien und Energie GmbH, Bereich Solarenergieforschung, Institut für Technologie, Hahn-Meitner-Platz 1, 14109 Berlin (Germany); Bähr, Mario; Lawerenz, Alexander [CIS Forschungsinstititut für Mikrosensorik und Photovoltaik GmbH, Konrad-Zuse-Straße 14, Erfurt 99099 (Germany)

    2013-08-01

    In this work, silicon nitride (SiN{sub x}) layers, deposited on a planar silicon wafer are locally irradiated by ultra short laser pulses with fluences near the threshold fluence. The irradiated areas are investigated by SEM and TEM in order to analyze the laser influence to silicon and to the SiN{sub x} layer. Thereby, a lift-off process is observed for this SiN{sub x} layer. The silicon absorbs the laser pulse energy. For low fluences, crystalline silicon is disordered below the SiN{sub x} layer. For high fluences, silicon evaporates below the SiN{sub x} layer and bulge the SiN{sub x} layer. If the pressure within the bulge is high enough, the SiN{sub x} layer will break down due to high mechanical stress.

  2. Bond strength between acrylic resin and maxillofacial silicone

    Directory of Open Access Journals (Sweden)

    Marcela Filié Haddad

    2012-12-01

    Full Text Available The development of implant dentistry improved the possibilities of rehabilitation with maxillofacial prosthesis. However, clinically it is difficult to bond the silicone to the attachment system. OBJECTIVES: This study aimed to evaluate the effect of an adhesive system on the bond strength between acrylic resin and facial silicone. MATERIAL AND METHODS: A total of 120 samples were fabricated with auto-polymerized acrylic resin and MDX 4-4210 facial silicone. Both materials were bonded through mechanical retentions and/or application of primers (DC 1205 primer and Sofreliner primer S and adhesive (Silastic Medical Adhesive Type A or not (control group. Samples were divided into 12 groups according to the method used to attach the silicone to the acrylic resin. All samples were subjected to a T-peel test in a universal testing machine. Failures were classified as adhesive, cohesive or mixed. The data were evaluated by the analysis of variance (ANOVA and the Tukey's HSD test (α=.05. RESULTS: The highest bond strength values (5.95 N/mm; 3.07 N/mm; 4.75 N/mm were recorded for the samples that received a Sofreliner primer application. These values were significantly higher when the samples had no scratches and did not receive the application of Silastic Medical Adhesive Type A. CONCLUSIONS: The most common type of failure was adhesive. The use of Sofreliner primer increased the bond strength between the auto-polymerized acrylic resin and the Silastic MDX 4-4210 facial silicone.

  3. Diffusion Bonding of Silicon Carbide for MEMS-LDI Applications

    Science.gov (United States)

    Halbig, Michael C.; Singh, Mrityunjay; Shpargel, Tarah P.; Kiser, J. Douglas

    2007-01-01

    A robust joining approach is critically needed for a Micro-Electro-Mechanical Systems-Lean Direct Injector (MEMS-LDI) application which requires leak free joints with high temperature mechanical capability. Diffusion bonding is well suited for the MEMS-LDI application. Diffusion bonds were fabricated using titanium interlayers between silicon carbide substrates during hot pressing. The interlayers consisted of either alloyed titanium foil or physically vapor deposited (PVD) titanium coatings. Microscopy shows that well adhered, crack free diffusion bonds are formed under optimal conditions. Under less than optimal conditions, microcracks are present in the bond layer due to the formation of intermetallic phases. Electron microprobe analysis was used to identify the reaction formed phases in the diffusion bond. Various compatibility issues among the phases in the interlayer and substrate are discussed. Also, the effects of temperature, pressure, time, silicon carbide substrate type, and type of titanium interlayer and thickness on the microstructure and composition of joints are discussed.

  4. Second-harmonic generation in periodically-poled thin film lithium niobate wafer-bonded on silicon

    CERN Document Server

    Rao, Ashutosh; Honardoost, Amirmahdi; Talukder, Javed Rouf; Rabiei, Rayam; Delfyett, Peter; Fathpour, Sasan

    2016-01-01

    Second-order optical nonlinear effects (second-harmonic and sum-frequency generation) are demonstrated in the telecommunication band by periodic poling of thin films of lithium niobate wafer-bonded on silicon substrates and rib-loaded with silicon nitride channels to attain ridge waveguide with cross-sections of ~ 2 {\\mu}m2. The compactness of the waveguides results in efficient second-order nonlinear devices. A nonlinear conversion of 8% is obtained with a pulsed input in 4 mm long waveguides. The choice of silicon substrate makes the platform potentially compatible with silicon photonics, and therefore may pave the path towards on-chip nonlinear and quantum-optic applications.

  5. High temperature and low pressure chemical vapor deposition of silicon nitride on AlGaN: Band offsets and passivation studies

    Science.gov (United States)

    Reddy, Pramod; Washiyama, Shun; Kaess, Felix; Hayden Breckenridge, M.; Hernandez-Balderrama, Luis H.; Haidet, Brian B.; Alden, Dorian; Franke, Alexander; Sarkar, Biplab; Kohn, Erhard; Collazo, Ramon; Sitar, Zlatko

    2016-04-01

    In this work, we employed X-ray photoelectron spectroscopy to determine the band offsets and interface Fermi level at the heterojunction formed by stoichiometric silicon nitride deposited on AlxGa1-xN (of varying Al composition "x") via low pressure chemical vapor deposition. Silicon nitride is found to form a type II staggered band alignment with AlGaN for all Al compositions (0 ≤ x ≤ 1) and present an electron barrier into AlGaN even at higher Al compositions, where Eg(AlGaN) > Eg(Si3N4). Further, no band bending is observed in AlGaN for x ≤ 0.6 and a reduced band bending (by ˜1 eV in comparison to that at free surface) is observed for x > 0.6. The Fermi level in silicon nitride is found to be at 3 eV with respect to its valence band, which is likely due to silicon (≡Si0/-1) dangling bonds. The presence of band bending for x > 0.6 is seen as a likely consequence of Fermi level alignment at Si3N4/AlGaN hetero-interface and not due to interface states. Photoelectron spectroscopy results are corroborated by current-voltage-temperature and capacitance-voltage measurements. A shift in the interface Fermi level (before band bending at equilibrium) from the conduction band in Si3N4/n-GaN to the valence band in Si3N4/p-GaN is observed, which strongly indicates a reduction in mid-gap interface states. Hence, stoichiometric silicon nitride is found to be a feasible passivation and dielectric insulation material for AlGaN at any composition.

  6. Plasma-enhanced growth, composition, and refractive index of silicon oxy-nitride films

    DEFF Research Database (Denmark)

    Mattsson, Kent Erik

    1995-01-01

    Secondary ion mass spectrometry and refractive index measurements have been carried out on silicon oxy-nitride produced by plasma-enhanced chemical vapor deposition (PECVD). Nitrous oxide and ammonia were added to a constant flow of 2% silane in nitrogen, to produce oxy-nitride films with atomic......-product. A model, that combine the chemical net reaction and the stoichiometric rules, is found to agree with measured deposition rates for given material compositions. Effects of annealing in a nitrogen atmosphere has been investigated for the 400 °C– 1100 °C temperature range. It is observed that PECVD oxy...

  7. A comparative study of three silicon nitride powders, obtained by three different syntheses

    International Nuclear Information System (INIS)

    Three silicon nitride powders are compared. The powder from H.C. Starck is produced by the direct nitridation, the UBE powder by the diimde and the A-L powder by the carbothermal process. The differences between the powders are related to the differences in syntheses. We looked at powder characterisation, mixing with sintering and organic additives, shaping, phase transformation, sintering, microstructure and some related properties of the sintered material. The UBE and A-L powder show similar behaviour. The H.C. Starck powder behaved different, which could be related to the broad particle size distribution, including particles > 0,5 μm. (orig.)

  8. Pused CO2 laser driven production of ultrafine Silicon, Silicon carbide, Silicon nitrides oxynitride powders

    International Nuclear Information System (INIS)

    Ultrafine Si, Si3N4, SiC and silicon oxynitride powders have been produced by irradiating gas-phase reactants by means of a CO2 laser. The mechanism of SiH4 CO2 laser induced absorption and dissociation is discussed on the basis of the results of the spectral and time resolved measurement of fragment chemiluminescence. The role played by the SiH2 radical in the powder formation is investigated. The quality of Si, Si3N4, SiC and silicon oxynitride powders is checked by means of several off-line diagnostics (IR spectroscopy, X-Ray diffraction at wide and small angle, BET analysis). The possibility of controlling powder stoichiometry and doping from the gas-phase reactant concetration is discussed

  9. Effect of helium ion beam treatment on the etching rate of silicon nitride

    Energy Technology Data Exchange (ETDEWEB)

    Petrov, Yu.V., E-mail: y.petrov@spbu.ru; Sharov, T.V.; Baraban, A.P.; Vyvenko, O.F.

    2015-04-15

    We investigated the effect of the helium ion implantation on the etching rate of silicon nitride in hydrofluoric acid. 30 keV helium ions were implanted into a 500-nm-thick silicon nitride film on silicon. Ion fluences from 10{sup 15} to 10{sup 17} cm{sup −2} were used. Etching was performed in a hydrofluoric acid solution. All samples were investigated with a scanning electron microscope and atomic force microscope. It was found that helium ion implantation can increase the etching rate by a factor of three. This results in the formation of a well in the implanted area after etching. The maximum depth of the well is about 180 nm and is limited by the penetration depth of 30 keV helium ions. Two possible reasons for enhanced etching are suggested: enhancement by ion-induced defects and electrostatic interaction of ions of the etchant with ion-induced space charge of silicon nitride. The recombination of ion-induced defects is also discussed.

  10. Effect of helium ion beam treatment on the etching rate of silicon nitride

    International Nuclear Information System (INIS)

    We investigated the effect of the helium ion implantation on the etching rate of silicon nitride in hydrofluoric acid. 30 keV helium ions were implanted into a 500-nm-thick silicon nitride film on silicon. Ion fluences from 1015 to 1017 cm−2 were used. Etching was performed in a hydrofluoric acid solution. All samples were investigated with a scanning electron microscope and atomic force microscope. It was found that helium ion implantation can increase the etching rate by a factor of three. This results in the formation of a well in the implanted area after etching. The maximum depth of the well is about 180 nm and is limited by the penetration depth of 30 keV helium ions. Two possible reasons for enhanced etching are suggested: enhancement by ion-induced defects and electrostatic interaction of ions of the etchant with ion-induced space charge of silicon nitride. The recombination of ion-induced defects is also discussed

  11. Bonding and Integration Technologies for Silicon Carbide Based Injector Components

    Science.gov (United States)

    Halbig, Michael C.; Singh, Mrityunjay

    2008-01-01

    Advanced ceramic bonding and integration technologies play a critical role in the fabrication and application of silicon carbide based components for a number of aerospace and ground based applications. One such application is a lean direct injector for a turbine engine to achieve low NOx emissions. Ceramic to ceramic diffusion bonding and ceramic to metal brazing technologies are being developed for this injector application. For the diffusion bonding, titanium interlayers (PVD and foils) were used to aid in the joining of silicon carbide (SiC) substrates. The influence of such variables as surface finish, interlayer thickness (10, 20, and 50 microns), processing time and temperature, and cooling rates were investigated. Microprobe analysis was used to identify the phases in the bonded region. For bonds that were not fully reacted an intermediate phase, Ti5Si3Cx, formed that is thermally incompatible in its thermal expansion and caused thermal stresses and cracking during the processing cool-down. Thinner titanium interlayers and/or longer processing times resulted in stable and compatible phases that did not contribute to microcracking and resulted in an optimized microstructure. Tensile tests on the joined materials resulted in strengths of 13-28 MPa depending on the SiC substrate material. Non-destructive evaluation using ultrasonic immersion showed well formed bonds. For the joining technology of brazing Kovar fuel tubes to silicon carbide, preliminary development of the joining approach has begun. Various technical issues and requirements for the injector application are addressed.

  12. Blue-to-Orange Tunable Luminescence from Europium Doped Yt trium-Silicon-Oxide-Nitride Phosphors

    Institute of Scientific and Technical Information of China (English)

    YANG Hu-Cheng; LI Cheng-Yu; PANG Ran; G. Lakshminarayana; ZHOU Shi-Feng; TENG Yu; QIU Jian-Rong

    2008-01-01

    Europium-doped yttrium-silicon-oxide-nitride phosphors are synthesized by carbothermal reduction and nitridation method. The crystal structure of the phosphors changed gradually from oxide Y2Si2 O7 to nitride YSi3N5state with increasing dosage of Si3N4 and carbon powder. The Y2Si2O7:Eu phosphor shows a blue emission at 465 nm with 300 nm excitation and a characteristic red emission of Eu3+ at 612 nm with 230 nm excitation. The YSi3N5 :Eu phosphor shows a broad emission band centred at 595 nm with some sharp peaks of Eu3+ with 325 nm excitation. The absorption of the studied phosphors increases from 450 to 700 nm with an increment in nitrogen content. Blue-to-orange tunable luminescence is observed with 390 nm excitation.

  13. Corrosion behavior of silicon nitride, magnesium oxide, and several metals in molten calcium chloride with chlorine

    International Nuclear Information System (INIS)

    In this paper corrosion studies are described in a molten calcium chloride environment sparged with chlorine gas at 850 degrees C, both in the melt and in the gas phase above the salt, in support of efforts at Westinghouse Savannah River Company to develop more resistant materials of construction for molten salt processing of plutonium. Corrosion rates and electron microscope analyses are reported for Inconel alloys 601 and 617, tantalum, tungsten, magnesium oxide, and silicon nitride. Silicon nitride exhibited the greatest resistance, showing 2 · h loss in both melt and vapor None of the metallic coupons withstood the chlorine vapor environment, although Inconel indicated resistance immersed in the melt if protected from chlorine gas

  14. Electrical behavior of multi-walled carbon nanotube network embedded in amorphous silicon nitride

    Directory of Open Access Journals (Sweden)

    Buiculescu Raluca

    2011-01-01

    Full Text Available Abstract The electrical behavior of multi-walled carbon nanotube network embedded in amorphous silicon nitride is studied by measuring the voltage and temperature dependences of the current. The microstructure of the network is investigated by cross-sectional transmission electron microscopy. The multi-walled carbon nanotube network has an uniform spatial extension in the silicon nitride matrix. The current-voltage and resistance-temperature characteristics are both linear, proving the metallic behavior of the network. The I-V curves present oscillations that are further analyzed by computing the conductance-voltage characteristics. The conductance presents minima and maxima that appear at the same voltage for both bias polarities, at both 20 and 298 K, and that are not periodic. These oscillations are interpreted as due to percolation processes. The voltage percolation thresholds are identified with the conductance minima.

  15. Swift Heavy Ion Beam-induced Recrystallisation of Buried Silicon Nitride Layer (Review Paper

    Directory of Open Access Journals (Sweden)

    T. Som

    2009-07-01

    Full Text Available Studies on MeV heavy ion beam-induced epitaxial crystallisation of a buried silicon nitride layer are reported. Transmission electron micrographs and selected area diffraction patterns have been used to study the recrystallisation of an ion beam-synthesised layer. Complete recrystallisation of the silicon nitride layer having good quality interfaces with the top- and the substrate-Si has been obsorved. Recrystallisation is achieved at significantly lower temperatures of 100 and 200OC for oxygen and silver ions, respectively. The fact that recrystallisation is achieved at the lowest temperature for the oxygen ions is discussed on the basis of energy loss processes.Defence Science Journal, 2009, 59(4, pp.351-355, DOI:http://dx.doi.org/10.14429/dsj.59.1533

  16. Effect of Additives on the Sintering of Amorphous Nano-sized Silicon Nitride Powders

    Institute of Scientific and Technical Information of China (English)

    LUO Junting; LIU Riping

    2009-01-01

    Amorphous nano-sized silicon nitride powders were sintered by liquid phase sin-tering.The influences of the additives of Y_2O_3 and Al_2O_3 prepared by two different ways,the poly-acrylamide gel method and the precipitation method,were investigated.The grain sizes of the additives prepared by the first method were finer than those of prepared by the latter method.When sintered at the same temperature,1700℃,the average grain size of the silicon nitride is 0.3 μm for the sample with the former additives,which is much finer than the one with the latter additives.The density of additives prepared by precipitation method is clearly lower than those of prepared by polyacrylamide gel method.

  17. Spin transport, magnetoresistance, and electrically detected magnetic resonance in amorphous hydrogenated silicon nitride

    Science.gov (United States)

    Mutch, Michael J.; Lenahan, Patrick M.; King, Sean W.

    2016-08-01

    We report on a study of spin transport via electrically detected magnetic resonance (EDMR) and near-zero field magnetoresistance (MR) in silicon nitride films. Silicon nitrides have long been important materials in solid state electronics. Although electronic transport in these materials is not well understood, electron paramagnetic resonance studies have identified a single dominating paramagnetic defect and have also provided physical and chemical descriptions of the defects, called K centers. Our EDMR and MR measurements clearly link the near-zero field MR response to the K centers and also indicate that K center energy levels are approximately 3.1 eV above the a-SiN:H valence band edge. In addition, our results suggest an approach for the study of defect mediated spin-transport in inorganic amorphous insulators via variable electric field and variable frequency EDMR and MR which may be widely applicable.

  18. Using fuzzy sets in the prediction of flexural strength and density of silicon nitride ceramics

    Energy Technology Data Exchange (ETDEWEB)

    Cios, K.J.; Baaklini, G.Y.; Vary, A. (National Aeronautics and Space Administration, Cleveland, OH (United States). Lewis Research Center); Sztandera, L.M. (Univ. of Toledo, OH (United States))

    1994-05-01

    In this work the authors use fuzzy sets theory to evaluate and predict flexural strength and density of NASA 6Y silicon nitride ceramic. Processing variables of milling time, sintering time, and sintering nitrogen pressure are used as an input to the fuzzy system. Flexural strength and density are the output parameters of the system. Data from 273 silicon nitride modulus of rupture bars tested at room temperature and 135 bars tested at 1,370 C (2,500 F) are used in this study. Generalized mean operator and Hamming distance are used to construct the fuzzy predictive model. The maximum test error for density does not exceed 3.3 percent, and for flexural strength 7.1 percent. These results demonstrate that fuzzy sets theory can be incorporated into the process of designing materials such as ceramics, especially for assessing more complex relationships between the processing variables and parameters like strength, which are governed by randomness of manufacturing processes.

  19. THERMODYNAMIC ANALYSIS AND EXPERIMENTAL VERIFICATION FOR SYNTHESIZING SILICON NITRIDE NANOPARTICLES USING RF PLASMA CVD

    Institute of Scientific and Technical Information of China (English)

    Ruoyu Hong; Jianmin Ding; Hongzhong Li

    2003-01-01

    Silicon nitride nanoparticles were synthesized by radio-frequency (RF) plasma chemical vapor deposition (PCVD) using silicon tetrachloride and ammonia as precursors, and argon as carrier gas. By assuming chemical thermodynamic equilibrium in the system, a computer program based on chemical thermodynamics was used to calculate the compositions of the system at different initial concentrations and final temperatures. At first, five elements and thirty-four species were considered. The effects of temperatures, and concentrations of ammonia, hydrogen and nitrogen on the equilibrium compositions were analyzed. It was found that the optimal reaction temperature range should be 1200 to 1500 K to obtain the highest conversion and yield of Si3N4. The inlet position of ammonia should be lower than that of silicon tetrachloride, and both should be located at the tail of the plasma torch. The best mole ratio of ammonia to silicon tetrachloride was found to be about 6. Later, the influences of water (and oxygen) were considered, and 17 additional species were included in the computations. It was found that oxygen or water content in the raw materials should be as low as possible in order to have high nitride content in the produced Si3N4. Nitrogen or hydrogen might be used to replace some or even all the argon to improve the yield of silicon nitride and reduce the cost. The ratio of ammonia to silicon tetrachloride should be high enough to obtain high conversion, but not excessively high to reduce the oxygen content due to the existence of water in ammonia. The simulated results were verified by experiments.

  20. Robust Environmental Barrier Coatings for Silicon Nitride Project

    Data.gov (United States)

    National Aeronautics and Space Administration — Silicon based ceramics are the leading candidates for the high temperature structural components of the advanced propulsion engines. For such applications, one key...

  1. Dynamic material properties and terminal ballistic behaviour of shock-loaded silicon-nitride ceramics

    International Nuclear Information System (INIS)

    The dynamic properties and microscopic material structure of shock loaded Silicon-Nitride ceramics of two different densities have been investigated by means of the planar plate impact and VISAR technique. In addition the terminal ballistic behaviour of both ceramics has been determined. The combined results of the tests performed suggest an important influence of the microstructure on the terminal ballistic behaviour and thus on the ceramics protection capability against impact processes. (orig.)

  2. The Effects of Thermal Cycling on Gallium Nitride and Silicon Carbide Semiconductor Devices for Aerospace Use

    Science.gov (United States)

    Patterson, Richard L.; Hammoud, Ahmad

    2012-01-01

    Electronics designed for use in NASA space missions are required to work efficiently and reliably under harsh environment conditions. These Include radiation, extreme temperatures, thermal cycling, to name a few. Preliminary data obtained on new Gallium Nitride and Silicon Carbide power devices under exposure to radiation followed by long term thermal cycling are presented. This work was done in collaboration with GSFC and JPL in support of the NASA Electronic Parts and Packaging (NEPP) Program

  3. Generic technological platform for microfabricating silicon nitride micro- and nanopipette arrays

    OpenAIRE

    Guenat, Olivier T.; Generelli, Silvia; Dadras, Mohammad-Mehdi; Berdondini, L.; De Rooij, Nicolaas F; Koudelka-Hep, Milena

    2007-01-01

    In this paper, the design and the characterization of batch fabricated SixNy micropipette arrays with diameters ranging from 6 µm down to 250 nm are described. The process used to fabricate the micromachined pipettes includes a deep reactive ion etching step, followed by the deposition of two successive layers, a thermal oxide layer and a low stress, low pressure chemical vapor deposited silicon nitride layer, respectively. The diameter of the micropipettes could be modulated simply by choosi...

  4. CVD diamond coated silicon nitride self-mated systems : tribological behaviour under high loads

    OpenAIRE

    Abreu, C. S.; Oliveira, F. J.; Belmonte, M.; Fernandes, A. J. S.; Gomes, J. R.; Silva, R. F.

    2006-01-01

    Friction and wear behaviour of self-mated chemical vapour deposited (CVD) diamond films coating silicon nitride ceramics (Si3N4) were investigated in ambient atmosphere. The tribological tests were conducted in a reciprocal motion ball-on-flat type tribometer under applied normal loads up to 80 N (~10 GPa). Several characterisation techniques - including scanning electron microscopy (SEM), atomic force microscopy (AFM) and micro-Raman studies - were used in order to assess the quality, stress s...

  5. Ab initio design of nanostructures for solar energy conversion: a case study on silicon nitride nanowire

    OpenAIRE

    Pan, Hui

    2014-01-01

    Design of novel materials for efficient solar energy conversion is critical to the development of green energy technology. In this work, we present a first-principles study on the design of nanostructures for solar energy harvesting on the basis of the density functional theory. We show that the indirect band structure of bulk silicon nitride is transferred to direct bandgap in nanowire. We find that intermediate bands can be created by doping, leading to enhancement of sunlight absorption. W...

  6. Correlated photon pair generation in low-loss double-stripe silicon nitride waveguides

    Science.gov (United States)

    Zhang, Xiang; Zhang, Yanbing; Xiong, Chunle; Eggleton, Benjamin J.

    2016-07-01

    We demonstrate correlated photon pair generation via spontaneous four-wave mixing in a low-loss double-stripe silicon nitride waveguide with a coincidence-to-accidental ratio over 10. The coincidence-to-accidental ratio is limited by spontaneous Raman scattering, which can be mitigated by cooling in the future. This demonstration suggests that this waveguide structure is a potential platform to develop integrated quantum photonic chips for quantum information processing.

  7. Correlated photon pair generation in low-loss double-stripe silicon nitride waveguides

    OpenAIRE

    Zhang, Xiang; Zhang, Yanbing; Xiong, Chunle; Eggleton, Benjamin J.

    2016-01-01

    We demonstrate correlated photon pair generation via spontaneous four-wave mixing in a low-loss double-stripe silicon nitride waveguide with a coincidence-to-accidental ratio over 10. The coincidence-to-accidental ratio is limited by spontaneous Raman scattering, which can be mitigated by cooling in the future. This demonstration suggests that this waveguide structure is a potential platform to develop integrated quantum photonic chips for quantum information processing.

  8. Dispersion engineered high-Q silicon Nitride Ring-Resonators via Atomic Layer Deposition

    CERN Document Server

    Riemensberger, Johann; Herr, Tobias; Brasch, Victor; Holzwarth, Ronald; Kippenberg, Tobias J

    2012-01-01

    We demonstrate dispersion engineering of integrated silicon nitride based ring resonators through conformal coating with hafnium dioxide deposited on top of the structures via atomic layer deposition (ALD). Both, magnitude and bandwidth of anomalous dispersion can be significantly increased. All results are confirmed by high resolution frequency-comb-assisted-diode-laser spectroscopy and are in very good agreement with the simulated modification of the mode spectrum.

  9. Silicon nitride nanoparticles for surface-assisted laser desorption/ionization of small molecules

    International Nuclear Information System (INIS)

    Conventional matrix-assisted laser desorption/ionization mass spectrometry is limited to analyses of higher molecular weight compounds due to high background noise generated by the matrix in the lower mass region. Surface-assisted laser desorption/ionization (SALDI) mass spectrometry is an alternative solution to this problem. Nanoparticles, structured silicon surfaces and carbon allotropes are commonly used as SALDI surfaces. Here, for the first time, we demonstrate the application of silicon nitride nanoparticles as a suitable medium for laser desorption/ionization of small drug molecules.

  10. Impedimetric immunosensor for human serum albumin detection on a direct aldehyde-functionalized silicon nitride surface

    International Nuclear Information System (INIS)

    Highlights: ► An impedimetric label-free immunosensor was developed for the specific detection of human serum albumin proteins. ► Anti-HSA antibodies were covalently immobilized on silicon nitride surfaces using a direct functionalization methodology. ► Silicon nitride offers multiple advantages compared to other common materials. ► The proposed sensor has high sensitivity and good selectivity for the detection of HSA proteins. - Abstract: In this work we report the fabrication and characterization of a label-free impedimetric immunosensor based on a silicon nitride (Si3N4) surface for the specific detection of human serum albumin (HSA) proteins. Silicon nitride provides several advantages compared with other materials commonly used, such as gold, and in particular in solid-state physics for electronic-based biosensors. However, few Si3N4-based biosensors have been developed; the lack of an efficient and direct protocol for the integration of biological elements with silicon-based substrates is still one of its the main drawbacks. Here, we use a direct functionalization method for the direct covalent binding of monoclonal anti-HSA antibodies on an aldehyde-functionalized Si-p/SiO2/Si3N4 structure. This methodology, in contrast with most of the protocols reported in literature, requires less chemical reagents, it is less time-consuming and it does not need any chemical activation. The detection capability of the immunosensor was tested by performing non-faradaic electrochemical impedance spectroscopy (EIS) measurements for the specific detection of HSA proteins. Protein concentrations within the linear range of 10−13–10−7 M were detected, showing a sensitivity of 0.128 Ω μM−1 and a limit of detection of 10−14 M. The specificity of the sensor was also addressed by studying the interferences with a similar protein, bovine serum albumin. The results obtained show that the antibodies were efficiently immobilized and the proteins detected specifically

  11. Impedimetric immunosensor for human serum albumin detection on a direct aldehyde-functionalized silicon nitride surface

    Energy Technology Data Exchange (ETDEWEB)

    Caballero, David, E-mail: caballero@unistra.fr [Nanobioengineering group-IBEC, Barcelona Science Park, C/ Baldiri Reixach 10-12, 08028 Barcelona (Spain); University of Barcelona, Department of Electronics, C/ Marti i Franques 1, 08028 Barcelona (Spain); Centro de Investigacion Biomedica en Red en Bioingenieria, Biomateriales y Nanomedicina (CIBER-BBN), 50018 Zaragoza (Spain); Martinez, Elena [Nanobioengineering group-IBEC, Barcelona Science Park, C/ Baldiri Reixach 10-12, 08028 Barcelona (Spain); Centro de Investigacion Biomedica en Red en Bioingenieria, Biomateriales y Nanomedicina (CIBER-BBN), 50018 Zaragoza (Spain); Bausells, Joan [Centre Nacional de Microelectronica (CNM-IMB), CSIC, Campus UAB, 08193 Bellaterra (Spain); Errachid, Abdelhamid, E-mail: abdelhamid.errachid-el-salhi@univ-lyon1.fr [Nanobioengineering group-IBEC, Barcelona Science Park, C/ Baldiri Reixach 10-12, 08028 Barcelona (Spain); Universite Claude Bernard - Lyon 1, LSA - UMR 5180, 43 Bd du 11 novembre 1918, 69622 Villeurbanne Cedex (France); Samitier, Josep [Nanobioengineering group-IBEC, Barcelona Science Park, C/ Baldiri Reixach 10-12, 08028 Barcelona (Spain); University of Barcelona, Department of Electronics, C/ Marti i Franques 1, 08028 Barcelona (Spain); Centro de Investigacion Biomedica en Red en Bioingenieria, Biomateriales y Nanomedicina (CIBER-BBN), 50018 Zaragoza (Spain)

    2012-03-30

    Highlights: Black-Right-Pointing-Pointer An impedimetric label-free immunosensor was developed for the specific detection of human serum albumin proteins. Black-Right-Pointing-Pointer Anti-HSA antibodies were covalently immobilized on silicon nitride surfaces using a direct functionalization methodology. Black-Right-Pointing-Pointer Silicon nitride offers multiple advantages compared to other common materials. Black-Right-Pointing-Pointer The proposed sensor has high sensitivity and good selectivity for the detection of HSA proteins. - Abstract: In this work we report the fabrication and characterization of a label-free impedimetric immunosensor based on a silicon nitride (Si{sub 3}N{sub 4}) surface for the specific detection of human serum albumin (HSA) proteins. Silicon nitride provides several advantages compared with other materials commonly used, such as gold, and in particular in solid-state physics for electronic-based biosensors. However, few Si{sub 3}N{sub 4}-based biosensors have been developed; the lack of an efficient and direct protocol for the integration of biological elements with silicon-based substrates is still one of its the main drawbacks. Here, we use a direct functionalization method for the direct covalent binding of monoclonal anti-HSA antibodies on an aldehyde-functionalized Si-p/SiO{sub 2}/Si{sub 3}N{sub 4} structure. This methodology, in contrast with most of the protocols reported in literature, requires less chemical reagents, it is less time-consuming and it does not need any chemical activation. The detection capability of the immunosensor was tested by performing non-faradaic electrochemical impedance spectroscopy (EIS) measurements for the specific detection of HSA proteins. Protein concentrations within the linear range of 10{sup -13}-10{sup -7} M were detected, showing a sensitivity of 0.128 {Omega} {mu}M{sup -1} and a limit of detection of 10{sup -14} M. The specificity of the sensor was also addressed by studying the

  12. Fabrication of Silicon Nitride Dental Core Ceramics with Borosilicate Veneering material

    Energy Technology Data Exchange (ETDEWEB)

    Wananuruksawong, R; Jinawath, S; Wasanapiarnpong, T [Research Unit of Advanced Ceramic, Department of Materials Science, Faculty of Science, Chulalongkorn University, Bangkok (Thailand); Padipatvuthikul, P, E-mail: raayaa_chula@hotmail.com [Faculty of Dentistry, Srinakharinwirot University, Bangkok (Thailand)

    2011-10-29

    Silicon nitride (Si{sub 3}N{sub 4}) ceramic is a great candidate for clinical applications due to its high fracture toughness, strength, hardness and bio-inertness. This study has focused on the Si{sub 3}N{sub 4} ceramic as a dental core material. The white Si{sub 3}N{sub 4} was prepared by pressureless sintering at relative low sintering temperature of 1650 deg. C in nitrogen atmosphere. The coefficient of thermal expansion (CTE) of Si{sub 3}N{sub 4} ceramic is lower than that of Zirconia and Alumina ceramic which are popular in this field. The borosilicate glass veneering was employed due to its compatibility in thermal expansion. The sintered Si{sub 3}N{sub 4} specimens represented the synthetic dental core were paintbrush coated by a veneer paste composed of borosilicate glass powder (<150 micrometer, Pyrex) with 5 wt% of zirconia powder (3 wt% Y{sub 2}O{sub 3} - partial stabilized zirconia) and 30 wt% of polyvinyl alcohol (5 wt% solution). After coating the veneer on the Si{sub 3}N{sub 4} specimens, the firing was performed in electric tube furnace between 1000-1200 deg. C. The veneered specimens fired at 1100 deg. C for 15 mins show good bonding, smooth and glossy without defect and crazing. The veneer has thermal expansion coefficient as 3.98x10{sup -6} deg. C{sup -1}, rather white and semi opaque, due to zirconia addition, the Vickers hardness as 4.0 GPa which is closely to the human teeth.

  13. Fabrication of silicon nitride nanoceramics—Powder preparation and sintering: A review

    Directory of Open Access Journals (Sweden)

    Toshiyuki Nishimura et al

    2007-01-01

    Full Text Available Fine-grained silicon nitride ceramics were investigated mainly for their high-strain-rate plasticity. The preparation and densification of fine silicon nitride powder were reviewed. Commercial sub-micrometer powder was used as raw powder in the "as-received" state and then used after being ground and undergoing classification operation. Chemical vapor deposition and plasma processes were used for fabricating nanopowder because a further reduction in grain size caused by grinding had limitations. More recently, nanopowder has also been obtained by high-energy milling. This process in principle is the same as conventional planetary milling. For densification, primarily hot pressing was performed, although a similar process known as spark plasma sintering (SPS has also recently been used. One of the advantages of SPS is its high heating rate. The high heating rate is advantageous because it reduces sintering time, achieving densification without grain growth. We prepared silicon nitride nanopowder by high-energy milling and then obtained nanoceramics by densifying the nanopowder by SPS.

  14. Annealing and deposition effects of the chemical composition of silicon rich nitride

    DEFF Research Database (Denmark)

    Andersen, Karin Nordström; Svendsen, Winnie Edith; Stimpel-Lindner, T.;

    2005-01-01

    investigated by Rutherford back scattering (RBS) and X-ray photoelectron spectroscopy (XPS). The influence of deposition parameters and annealing temperatures on the stoichiometry and the chemical bonds will be discussed. The origin of the clusters has been found to be silicon due to severe silicon out...

  15. Extreme strain rate and temperature dependence of the mechanical properties of nano silicon nitride thin layers in a basal plane under tension: a molecular dynamics study.

    Science.gov (United States)

    Lu, Xuefeng; Wang, Hongjie; Wei, Yin; Wen, Jiangbo; Niu, Min; Jia, Shuhai

    2014-08-01

    Molecular dynamics simulations are performed to clarify the extreme strain rate and temperature dependence of the mechanical behaviors of nano silicon nitride thin layers in a basal plane under tension. It is found that fracture stresses show almost no change with increasing strain rate. However, fracture strains decrease gradually due to the appearance of additional N(2c)-Si bond breaking defects in the deformation process. With increasing loading temperature, there is a noticeable drop in fracture stress and fracture strain. In the low temperature range, roughness phases can be observed owing to a combination of factors such as configuration evolution and energy change.

  16. Protein-repellent silicon nitride surfaces: UV-induced formation of oligoethylene oxide monolayers.

    Science.gov (United States)

    Rosso, Michel; Nguyen, Ai T; de Jong, Ed; Baggerman, Jacob; Paulusse, Jos M J; Giesbers, Marcel; Fokkink, Remko G; Norde, Willem; Schroën, Karin; van Rijn, Cees J M; Zuilhof, Han

    2011-03-01

    The grafting of polymers and oligomers of ethylene oxide onto surfaces is widely used to prevent nonspecific adsorption of biological material on sensors and membrane surfaces. In this report, we show for the first time the robust covalent attachment of short oligoethylene oxide-terminated alkenes (CH(3)O(CH(2)CH(2)O)(3)(CH(2))(11)-(CH═CH(2)) [EO(3)] and CH(3)O(CH(2)CH(2)O)(6)(CH(2))(11)-(CH═CH(2)) [EO(6)]) from the reaction of alkenes onto silicon-rich silicon nitride surfaces at room temperature using UV light. Reflectometry is used to monitor in situ the nonspecific adsorption of bovine serum albumin (BSA) and fibrinogen (FIB) onto oligoethylene oxide coated silicon-rich silicon nitride surfaces (EO(n)-Si(x)N(4), x > 3) in comparison with plasma-oxidized silicon-rich silicon nitride surfaces (SiO(y)-Si(x)N(4)) and hexadecane-coated Si(x)N(4) surfaces (C(16)-Si(x)N(4)). A significant reduction in protein adsorption on EO(n)-Si(x)N(4) surfaces was achieved, adsorption onto EO(3)-Si(x)N(4) and EO(6)-Si(x)N(4) were 0.22 mg m(-2) and 0.08 mg m(-2), respectively. The performance of the obtained EO(3) and EO(6) layers is comparable to those of similar, highly protein-repellent monolayers formed on gold and silver surfaces. EO(6)-Si(x)N(4) surfaces prevented significantly the adsorption of BSA (0.08 mg m(-2)). Atomic force microscopy (AFM), X-ray photoelectron spectroscopy (XPS), X-ray reflectivity and static water contact angle measurements were employed to characterize the modified surfaces. In addition, the stability of EO(6)-Si(x)N(4) surfaces in phosphate-buffered saline solution (PBS) and alkaline condition (pH 10) was studied. Prolonged exposure of the surfaces to PBS solution for 1 week or alkaline condition for 2 h resulted in only minor degradation of the ethylene oxide moieties and no oxidation of the Si(x)N(4) substrates was observed. Highly stable antifouling coatings on Si(x)N(4) surfaces significantly broaden the application potential of silicon

  17. Effect of Hydrogen Dilution on Growth of Silicon Nanocrystals Embedded in Silicon Nitride Thin Film bv Plasma-Enhanced CVD

    Institute of Scientific and Technical Information of China (English)

    DING Wenge; ZHEN Lanfang; ZHANG Jiangyong; LI Yachao; YU Wei; FU Guangsheng

    2007-01-01

    An investigation was conducted into the effect of hydrogen dilution on the mi-crostructure and optical properties of silicon nanograins embedded in silicon nitride (Si/SiNx) thin film deposited by the helicon wave plasma-enhanced chemical vapour deposition technique. With Ar-diluted SiH4 and N2 as the reactant gas sources in the fabrication of thin film, the film was formed at a high deposition rate. There was a high density of defect at the amorphous silicon (a-Si)/SiNx interface and a relative low optical gap in the film. An addition of hydrogen into the reactant gas reduced the film deposition rate sharply. The silicon nanograins in the SiNx matrix were in a crystalline state, and the density of defects at the silicon nanocrystals (nc-Si)/SiNx interface decreased significantly and the optical gap of the films widened. These results suggested that hydrogen activated by the plasma could not only eliminate in the defects between the interface of silicon nanograins and SiNx matrix, but also helped the nanograins transform from the amorphous into crystalline state. By changing the hydrogen dilution ratio in the reactant gas sources, a tunable band gap from 1.87 eV to 3.32 eV was obtained in the Si/SiNx film.

  18. Electrochemical characteristics of ternary and quadruple lithium silicon nitrides as anode material for lithium ion batteries: the influence of precursors

    Institute of Scientific and Technical Information of China (English)

    WEN Zhongsheng; TIAN Feng; SUN Juncai; JI Shijun; XIE Jingying

    2008-01-01

    Ternary and quadruple lithium silicon nitride anode materials for lithium ion batteries with different precursors were prepared by the simple process of high-energy ball milling.High capacity and excellent cyclability were obtained.The influence of precursor introduction on the electrochemical performance of products was investigated.This research reveals that the electrochemical performance of lithium silicon hiaide can be enhanced significantly by doping O.The cyclability of quadruple lithium silicon nitride can be optimized remarkably by controlling the introduction quantity of the precursors.It is possible for the composite to be used as a capacity compensator within a wide voltage cut-off window.

  19. Feasibility of Actively Cooled Silicon Nitride Airfoil for Turbine Applications Demonstrated

    Science.gov (United States)

    Bhatt, Ramakrishna T.

    2001-01-01

    Nickel-base superalloys currently limit gas turbine engine performance. Active cooling has extended the temperature range of service of nickel-base superalloys in current gas turbine engines, but the margin for further improvement appears modest. Therefore, significant advancements in materials technology are needed to raise turbine inlet temperatures above 2400 F to increase engine specific thrust and operating efficiency. Because of their low density and high-temperature strength and thermal conductivity, in situ toughened silicon nitride ceramics have received a great deal of attention for cooled structures. However, the high processing costs and low impact resistance of silicon nitride ceramics have proven to be major obstacles for widespread applications. Advanced rapid prototyping technology in combination with conventional gel casting and sintering can reduce high processing costs and may offer an affordable manufacturing approach. Researchers at the NASA Glenn Research Center, in cooperation with a local university and an aerospace company, are developing actively cooled and functionally graded ceramic structures. The objective of this program is to develop cost-effective manufacturing technology and experimental and analytical capabilities for environmentally stable, aerodynamically efficient, foreign-object-damage-resistant, in situ toughened silicon nitride turbine nozzle vanes, and to test these vanes under simulated engine conditions. Starting with computer aided design (CAD) files of an airfoil and a flat plate with internal cooling passages, the permanent and removable mold components for gel casting ceramic slips were made by stereolithography and Sanders machines, respectively. The gel-cast part was dried and sintered to final shape. Several in situ toughened silicon nitride generic airfoils with internal cooling passages have been fabricated. The uncoated and thermal barrier coated airfoils and flat plates were burner rig tested for 30 min without

  20. Numerical study of self-heating effects of small-size MOSFETs fabricated on silicon-on-aluminum nitride substrate

    Institute of Scientific and Technical Information of China (English)

    2006-01-01

    Compared with bulk-silicon technology, silicon-on-insulator (SOI) technology possesses many advantages but it is inevitable that the buried silicon dioxide layer also thermally insulates the metal-oxide-silicon field-effect transistors (MOSFETs) from the bulk due to the low thermal conductivity. One of the alternative insulator to replace the buried oxide layer is aluminum nitride (MN), which has a thermal conductivity that is about 200 times small-size MOSFETs fabricated on silicon-on-aluminum nitride (SOAN) substrate, a two-dimensional numerical analysis is performed by using a device simulator called MEDICI run on a Solaris workstation to simulate the electrical characteristics and temperature distribution by comparing with those of bulk and standard SOI MOSFETs. Our study suggests that AlN is a suitable alternative to silicon dioxide as a buried dielectric in SOI and expands the applications of SOI to high temperature conditions.

  1. Matrix density effects on the mechanical properties of SiC fiber-reinforced silicon nitride matrix properties

    Science.gov (United States)

    Bhatt, Ramakrishna T.; Kiser, Lames D.

    1990-01-01

    The room temperature mechanical properties were measured for SiC fiber reinforced reaction-bonded silicon nitride composites (SiC/RBSN) of different densities. The composites consisted of approx. 30 vol percent uniaxially aligned 142 micron diameter SiC fibers (Textron SCS-6) in a reaction-bonded Si3N4 matrix. The composite density was varied by changing the consolidation pressure during RBSN processing and by hot isostatically pressing the SiC/RBSN composites. Results indicate that as the consolidation pressure was increased from 27 to 138 MPa, the average pore size of the nitrided composites decreased from 0.04 to 0.02 microns and the composite density increased from 2.07 to 2.45 gm/cc. Nonetheless, these improvements resulted in only small increases in the first matrix cracking stress, primary elastic modulus, and ultimate tensile strength values of the composites. In contrast, HIP consolidation of SiC/RBSN resulted in a fully dense material whose first matrix cracking stress and elastic modulus were approx. 15 and 50 percent higher, respectively, and ultimate tensile strength values were approx. 40 percent lower than those for unHIPed SiC/RBSN composites. The modulus behavior for all specimens can be explained by simple rule-of-mixture theory. Also, the loss in ultimate strength for the HIPed composites appears to be related to a degradation in fiber strength at the HIP temperature. However, the density effect on matrix fracture strength was much less than would be expected based on typical monolithic Si3N4 behavior, suggesting that composite theory is indeed operating. Possible practical implications of these observations are discussed.

  2. Impact of interstitial oxygen trapped in silicon during plasma growth of silicon oxy-nitride films for silicon solar cell passivation

    Science.gov (United States)

    Saseendran, Sandeep S.; Saravanan, S.; Raval, Mehul C.; Kottantharayil, Anil

    2016-03-01

    Low temperature oxidation of silicon in plasma ambient is a potential candidate for replacing thermally grown SiO2 films for surface passivation of crystalline silicon solar cells. In this work, we report the growth of silicon oxy-nitride (SiOxNy) film in N2O plasma ambient at 380 °C. However, this process results in trapping of interstitial oxygen within silicon. The impact of this trapped interstitial oxygen on the surface passivation quality is investigated. The interstitial oxygen trapped in silicon was seen to decrease for larger SiOxNy film thickness. Effective minority carrier lifetime (τeff) measurements on n-type float zone silicon wafers passivated by SiOxNy/silicon nitride (SiNv:H) stack showed a decrease in τeff from 347 μs to 68 μs, for larger SiOxNy film thickness due to degradation in interface properties. From high frequency capacitance-voltage measurements, it was concluded that the surface passivation quality was governed by the interface parameters (fixed charge density and interface state density). High temperature firing of the SiOxNy/SiNv:H stack resulted in a severe degradation in τeff due to migration of oxygen across the interface into silicon. However, on using the SiOxNy/SiNv:H stack for emitter surface passivation in screen printed p-type Si solar cells, an improvement in short wavelength response was observed in comparison to the passivation by SiNv:H alone, indicating an improvement in emitter surface passivation quality.

  3. Low temperature glass bonding for sensor applications using boron oxide thin films

    NARCIS (Netherlands)

    Legtenberg, Rob; Bouwstra, Siebe; Elwenspoek, Miko

    1991-01-01

    Low-temperature glass bonding of silicon, silicon dioxide and silicon nitride is described. Boron oxide was used as the intermediate glass layer at a bonding temperature of 450 degrees C. First experiments indicate that due to reflow and deformation of the molten glass layer bonding over metal patte

  4. Novel junctionless silicon-oxide-nitride-oxide-silicon memory devices with field-enhanced poly-Si nanowire structure

    Science.gov (United States)

    Chou, Chia-Hsin; Chan, Wei-Sheng; Wu, Chun-Yu; Lee, I.-Che; Liao, Ta-Chuan; Wang, Chao-Lung; Wang, Kuang-Yu; Cheng, Huang-Chung

    2015-08-01

    In this work, a novel gate-all-around (GAA) low-temperature poly-Si (LTPS) junctionless (JL) silicon-oxide-nitride-oxide-silicon (SONOS) nonvolatile memory device with a field-enhanced nanowire (NW) structure has been proposed to improve the programing/erasing (P/E) performance. Each nanowire has three sharp corners fabricated by a sidewall spacer formation technique to obtain high local electrical fields. Owing to the higher carrier concentration in the channel and the high local electrical field from the three sharp corners, such a JL SONOS memory device exhibits a significantly enhanced P/E speed, a larger memory window, and better data retention properties than a conventional inversion mode NW-channel memory device.

  5. Resonant second harmonic generation in a gallium nitride two-dimensional photonic crystal on silicon

    Energy Technology Data Exchange (ETDEWEB)

    Zeng, Y.; Roland, I.; Checoury, X.; Han, Z.; El Kurdi, M.; Sauvage, S.; Boucaud, P., E-mail: philippe.boucaud@ief.u-psud.fr [Institut d' Electronique Fondamentale, CNRS - Univ. Paris Sud 11, Bâtiment 220, F-91405 Orsay (France); Gayral, B. [Univ. Grenoble Alpes, INAC-SP2M, CEA-CNRS group Nanophysique et Semiconducteurs, F-38000 Grenoble (France); CEA, INAC-SP2M, CEA-CNRS group Nanophysique et Semiconducteurs, F-38000 Grenoble (France); Brimont, C.; Guillet, T. [Université Montpellier 2, Laboratoire Charles Coulomb UMR 5221, F-34905 Montpellier (France); Mexis, M.; Semond, F. [CRHEA-CNRS, Rue Bernard Grégory, F-06560 Valbonne (France)

    2015-02-23

    We demonstrate second harmonic generation in a gallium nitride photonic crystal cavity embedded in a two-dimensional free-standing photonic crystal platform on silicon. The photonic crystal nanocavity is optically pumped with a continuous-wave laser at telecom wavelengths in the transparency window of the nitride material. The harmonic generation is evidenced by the spectral range of the emitted signal, the quadratic power dependence vs. input power, and the spectral dependence of second harmonic signal. The harmonic emission pattern is correlated to the harmonic polarization generated by the second-order nonlinear susceptibilities χ{sub zxx}{sup (2)}, χ{sub zyy}{sup (2)} and the electric fields of the fundamental cavity mode.

  6. Enhancement of polycrystalline silicon solar cells efficiency using indium nitride particles

    International Nuclear Information System (INIS)

    In this work, we present a hybrid indium nitride particle/polycrystalline silicon solar cell based on 230 nm size indium nitride particles (InN-Ps) obtained through laser ablation. The solar cell performance measurements indicate that there is an absolute 1.5% increase (Δη) in the overall solar cell efficiency due to the presence of InN-Ps. Within the spectral range 300–1100 nm, improvements of up to 8.26% are observed in the external quantum efficiency (EQE) and increases of up to 8.75% are observed in the internal quantum efficiency (IQE) values of the corresponding solar cell. The enhancement in power performance is due to the down-shifting properties of the InN-Ps. The electrical measurements are supplemented by TEM, Raman, UV/VIS and PL spectroscopy of the InN-Ps. (paper)

  7. Hard carbon nitride and method for preparing same

    Science.gov (United States)

    Haller, Eugene E.; Cohen, Marvin L.; Hansen, William L.

    1992-01-01

    Novel crystalline .alpha. (silicon nitride-like)-carbon nitride and .beta. (silicon nitride-like)-carbon nitride are formed by sputtering carbon in the presence of a nitrogen atmosphere onto a single crystal germanium or silicon, respectively, substrate.

  8. Nitrogen implantation effects on the chemical bonding and hardness of boron and boron nitride coatings

    Energy Technology Data Exchange (ETDEWEB)

    Anders, S; Felter, T; Hayes, J; Jankowski, A F; Patterson, R; Poker, D; Stamler, T

    1999-02-08

    Boron nitride (BN) coatings are deposited by the reactive sputtering of fully dense, boron (B) targets utilizing an argon-nitrogen (Ar-N{sub 2}) reactive gas mixture. Near-edge x-ray absorption fine structure analysis reveals features of chemical bonding in the B 1s photoabsorption spectrum. Hardness is measured at the film surface using nanoindentation. The BN coatings prepared at low, sputter gas pressure with substrate heating are found to have bonding characteristic of a defected hexagonal phase. The coatings are subjected to post-deposition nitrogen (N{sup +} and N{sub 2}{sup +}) implantation at different energies and current densities. The changes in film hardness attributed to the implantation can be correlated to changes observed in the B 1s NEXAFS spectra.

  9. Nanoscale structure and superhydrophobicity of sp(2)-bonded boron nitride aerogels.

    Science.gov (United States)

    Pham, Thang; Goldstein, Anna P; Lewicki, James P; Kucheyev, Sergei O; Wang, Cheng; Russell, Thomas P; Worsley, Marcus A; Woo, Leta; Mickelson, William; Zettl, Alex

    2015-06-21

    Aerogels have much potential in both research and industrial applications due to their high surface area, low density, and fine pore size distribution. Here we report a thorough structural study of three-dimensional aerogels composed of highly crystalline sp(2)-bonded boron nitride (BN) layers synthesized by a carbothermic reduction process. The structure, crystallinity and bonding of the as-prepared BN aerogels are elucidated by X-ray diffraction, (11)B nuclear magnetic resonance, transmission electron microscopy, and resonant soft X-ray scattering. The macroscopic roughness of the aerogel's surface causes it to be superhydrophobic with a contact angle of ∼155° and exhibit high oil uptake capacity (up to 1500 wt%). The oil can be removed from the BN aerogel by oxidizing in air without damaging the crystalline porous structure of the aerogel or diminishing its oil absorption capacity. PMID:26007693

  10. Remote PECVD silicon nitride films with improved electrical properties for GaAs P-HEMT passivation

    CERN Document Server

    Sohn, M K; Kim, K H; Yang, S G; Seo, K S

    1998-01-01

    In order to obtain thin silicon nitride films with excellent electrical and mechanical properties, we employed RPECVD (Remote Plasma Enhanced Chemical Vapor Deposition) process which produces less plasma-induced damage than the conventional PECVD. Through the optical and electrical measurements of the deposited films, we optimized the various RPECVD process parameters. The optimized silicon nitride films showed excellent characteristics such as small etch rate (approx 33 A/min by 7:1 BHF), high breakdown field (>9 MV/cm), and low compressive stress (approx 3.3x10 sup 9 dyne/cm sup 2). We successfully applied thin RPECVD silicon nitride films to the surface passivation of GaAs pseudomorphic high electron mobility transistors (P-HEMTs) with negligible degradations in DC and RF characteristics.

  11. High-Index Contrast Silicon Rich Silicon Nitride Optical Waveguides and Devices

    DEFF Research Database (Denmark)

    Philipp, Hugh Taylor

    2004-01-01

    This research focused on the realization of high-density integrated optical devices made with high-index contrast waveguides. The material platform used for to develop these devices was modeled after standard silicon on silicon technology. The high-index waveguide core material was silicon rich s...

  12. Estimation of crack closure stresses for in situ toughened silicon nitride with 8 wt pct scandia

    Science.gov (United States)

    Choi, Sung R.; Salem, Jonathan A.; Sanders, William A.

    1992-01-01

    An 8-wt pct-scandia silicon nitride with an elongated grain structure was fabricated. The material exhibited high fracture toughness and a rising R-curve as measured by the indentation strength technique. The 'toughening' exponent m was found to be m about 0.1. The high fracture toughness and R-curve behavior was attributed mainly to bridging of the crack faces by the elongated grains. The crack closure (bridging) stress distribution in the wake region of the crack tip was estimated as a function of crack size from the R-curve data, with an arbitrarily assumed distribution function.

  13. Strength and fatigue of NT551 silicon nitride and NT551 diesel exhaust valves

    Energy Technology Data Exchange (ETDEWEB)

    Andrews, M.J.; Werezczak, A.A.; Kirkland, T.P.; Breder, K.

    2000-02-01

    The content of this report is excerpted from Mark Andrew's Ph.D. Thesis (Andrews, 1999), which was funded by a DOE/OTT High Temperature Materials Laboratory Graduate Fellowship. It involves the characterization of NT551 and valves fabricated with it. The motivations behind using silicon nitride (Si{sub 3}N{sub 4}) as an exhaust valve for a diesel engine are presented in this section. There are several economic factors that have encouraged the design and implementation of ceramic components for internal combustion (IC) engines. The reasons for selecting the diesel engine valve for this are also presented.

  14. Silicon nitride membrane resonators at millikelvin temperatures with quality factors exceeding 10^8

    OpenAIRE

    Yuan, M; Cohen, M A; G. A. Steele

    2015-01-01

    We study the mechanical dissipation of the fundamental mode of millimeter-sized, high quality-factor (Q) metalized silicon nitride membranes at temperatures down to 14 mK using a three-dimensional optomechanical cavity. Below 200 mK, high-Q modes of the membranes show a diverging increase of Q with decreasing temperature, reaching Q=1.27×108Q=1.27×108 at 14 mK, an order of magnitude higher than that reported before. The ultra-low dissipation makes the membranes highly attractive for the study...

  15. Observation of Transparency of Erbium-doped Silicon nitride in photonic crystal nanobeam cavities

    CERN Document Server

    Gong, Yiyang; Yerci, Selcuk; Li, Rui; Stevens, Martin J; Baek, Burm; Nam, Sae Woo; Negro, Luca Dal; Vuckovic, Jelena

    2010-01-01

    One-dimensional nanobeam photonic crystal cavities are fabricated in an Er-doped amorphous silicon nitride layer. Photoluminescence from the cavities around 1.54 um is studied at cryogenic and room temperatures at different optical pump powers. The resonators demonstrate Purcell enhanced absorption and emission rates, also confirmed by time-resolved measurements. Resonances exhibit linewidth narrowing with pump power, signifying absorption bleaching and the onset of stimulated emission in the material at both 5.5 K and room temperature. We estimate from the cavity linewidths that Er has been pumped to transparency at the cavity resonance wavelength.

  16. Dual-pumped degenerate Kerr oscillator in a silicon nitride microresonator

    CERN Document Server

    Okawachi, Yoshitomo; Luke, Kevin; Carvalho, Daniel O; Ramelow, Sven; Farsi, Alessandro; Lipson, Michal; Gaeta, Alexander L

    2015-01-01

    We demonstrate a degenerate parametric oscillator in a silicon-nitride microresonator. We use two frequency-detuned pump waves to perform parametric four-wave mixing and operate in the normal group-velocity dispersion regime to produce signal and idler fields that are frequency degenerate. Our theoretical modeling shows that this regime enables generation of bimodal phase states, analogous to the \\c{hi}(2)-based degenerate OPO. Our system offers potential for realization of CMOS-chip-based coherent optical computing and an all-optical quantum random number generator.

  17. Dual-pumped degenerate Kerr oscillator in a silicon nitride microresonator.

    Science.gov (United States)

    Okawachi, Yoshitomo; Yu, Mengjie; Luke, Kevin; Carvalho, Daniel O; Ramelow, Sven; Farsi, Alessandro; Lipson, Michal; Gaeta, Alexander L

    2015-11-15

    We demonstrate a degenerate parametric oscillator in a silicon nitride microresonator. We use two frequency-detuned pump waves to perform parametric four-wave mixing and operate in the normal group-velocity dispersion regime to produce signal and idler fields that are frequency degenerate. Our theoretical modeling shows that this regime enables generation of bimodal phase states, analogous to the χ(2)-based degenerate OPO. Our system offers potential for realization of CMOS-chip-based coherent optical computing and an all-optical quantum random number generator. PMID:26565851

  18. The effect of argon plasma treatment on the permeation barrier properties of silicon nitride layers

    OpenAIRE

    Majee, Subimal; Cerqueira, M. F.; Tondelier, D.; Geffroy, B.; Bonnassieux, Y.; Alpuim, P.; Bourée, J. E.

    2013-01-01

    In this work we produce and study silicon nitride (SiNx) thin films deposited by Hot Wire Chemical Vapor Depo- sition (HW-CVD) to be used as encapsulation barriers for flexible organic photovoltaic cells fabricated on poly- ethylene terephthalate (PET) substrates in order to increase their shelf lifetime. We report on the results of SiNx double-layers and on the equivalent double-layer stack where an Ar-plasma surface treatment was performed on the first SiNx layer. The Ar-plasma treatment ma...

  19. Enhancement of oxidation resistance of NBD 200 silicon nitride ceramics by aluminum implantation

    Science.gov (United States)

    Mukundhan, Priya

    Silicon nitride (Si3N4) ceramics are leading candidates for high temperature structural applications. They have already demonstrated functional capabilities well beyond the limits of conventional metals and alloys in advanced diesel and turbine engines. However, the practical exploitation of these benefits is limited by their oxidation and associated degradation processes in chemically aggressive environments. Additives and impurities in Si3N4 segregate to the surface of Si3N 4 and accelerate its high temperature oxidation process. This study aims to investigate the oxidation behavior of Norton NBD 200 silicon nitride (hot isostatically pressed with ˜1 wt.% MgO) and its modification by aluminum surface alloying. NBD 200 samples tribochemically polished to a mirror finish (10 nm) were implanted with 5, 10, 20 and 30 at.% aluminum at multienergies and multi-doses to achieve a uniform implant depth distribution to 200 nm. Unimplanted and aluminum-implanted samples were oxidized at 800°--1100°C in 1 atm O2 for 0.5--10 hours. Oxidation kinetics was determined using profilometry in conjunction with etch patterning. The morphological, structural and chemical characteristics of the oxide were characterized by various analytical techniques such as scanning electron microscope and energy dispersive x-ray analysis, secondary ion mass spectrometry and x-ray photoelectron spectroscopy. Oxidation of NBD 200 follows parabolic kinetics in the temperature range investigated and the process is diffusion-controlled. The oxide layers are enriched with sodium and magnesium from the bulk of the Si3N 4. The much higher oxidation rate for NBD 200 silicon nitride than for other silicon nitride ceramics with a similar amount of MgO is attributed to the presence of sodium. The rate-controlling mechanism is the outward diffusion of Mg2+ from the grain boundaries to the oxide scale. Aluminum implantation alleviates the detrimental effects of Na+ and Mg2+; not only is the rate of oxidation

  20. Electric field enhancement with plasmonic colloidal nanoantennas excited by a silicon nitride waveguide

    CERN Document Server

    Darvishzadeh-Varcheie, Mahsa; Ragan, Regina; Boyraz, Ozdal; Capolino, Filippo

    2016-01-01

    We investigate the feasibility of CMOS-compatible optical structures to develop novel integrated spectroscopy systems. We show that local field enhancement is achievable utilizing dimers of plasmonic nanospheres that can be assembled from colloidal solutions on top of a CMOS-compatible optical waveguide. The resonant dimer nanoantennas are excited by modes guided in the integrated silicon nitride waveguide. Simulations show that 100 fold electric field enhancement builds up in the dimer gap as compared to the waveguide evanescent field amplitude at the same location. We investigate how the field enhancement depends on dimer location, orientation, distance and excited waveguide modes.

  1. Structural Analysis of a Magnetically Actuated Silicon Nitride Micro-Shutter for Space Applications

    Science.gov (United States)

    Loughlin, James P.; Fettig, Rainer K.; Moseley, S. Harvey; Kutyrev, Alexander S.; Mott, D. Brent; Obenschain, Arthur F. (Technical Monitor)

    2002-01-01

    Finite element models have been created to simulate the electrostatic and electromagnetic actuation of a 0.5gm silicon nitride micro-shutter for use in a spacebased Multi-object Spectrometer (MOS). The micro-shutter uses a torsion hinge to go from the closed, 0 degree, position, to the open, 90 degree position. Stresses in the torsion hinge are determined with a large deformation nonlinear finite element model. The simulation results are compared to experimental measurements of fabricated micro-shutter devices.

  2. Fabrication of Antireflective Sub-Wavelength Structures on Silicon Nitride Using Nano Cluster Mask for Solar Cell Application

    Directory of Open Access Journals (Sweden)

    Lin Men-Ku

    2009-01-01

    Full Text Available Abstract We have developed a simple and scalable approach for fabricating sub-wavelength structures (SWS on silicon nitride by means of self-assembled nickel nanoparticle masks and inductively coupled plasma (ICP ion etching. Silicon nitride SWS surfaces with diameter of 160–200 nm and a height of 140–150 nm were obtained. A low reflectivity below 1% was observed over wavelength from 590 to 680 nm. Using the measured reflectivity data in PC1D, the solar cell characteristics has been compared for single layer anti-reflection (SLAR coatings and SWS and a 0.8% improvement in efficiency has been seen.

  3. Elongated Silicon-Carbon Bonds at Graphene Edges.

    Science.gov (United States)

    Chen, Qu; Robertson, Alex W; He, Kuang; Gong, Chuncheng; Yoon, Euijoon; Kirkland, Angus I; Lee, Gun-Do; Warner, Jamie H

    2016-01-26

    We study the bond lengths of silicon (Si) atoms attached to both armchair and zigzag edges using aberration corrected transmission electron microscopy with monochromation of the electron beam. An in situ heating holder is used to perform imaging of samples at 800 °C in order to reduce chemical etching effects that cause rapid structure changes of graphene edges at room temperature under the electron beam. We provide detailed bond length measurements for Si atoms both attached to edges and also as near edge substitutional dopants. Edge reconstruction is also involved with the addition of Si dopants. Si atoms bonded to the edge of graphene are compared to substitutional dopants in the bulk lattice and reveal reduced out-of-plane distortion and bond elongation. An extended linear array of Si atoms at the edge is found to be energy-favorable due to inter-Si interactions. These results provide detailed structural information about the Si-C bonds in graphene, which may have importance in future catalytic and electronic applications.

  4. Design, analysis, and characterization of stress-engineered 3D microstructures comprised of PECVD silicon oxide and nitride

    Science.gov (United States)

    Pi, Chia-Hsing; Turner, Kevin T.

    2016-06-01

    Microelectromechanical systems (MEMS) are typically 2D or quasi-3D structures fabricated using surface and bulk micromachining processes. In this work, an approach for 3D structure fabrication based on stress engineering is demonstrated. Specifically, sub-mm 3D spherical cage-like structures are realized through the deformation of bilayers of residually-stressed silicon oxide and silicon nitride with micrometer-scale thicknesses. Analytical and finite models to predict the shape of stress-engineered structures based on geometry and residual stress are described and used for structure design. A systematic experimental study was performed to quantify residual stresses in silicon nitride films made by plasma-enhanced chemical vapor deposition (PECVD). The measurements show that the residual stress of PECVD silicon nitride can be tuned over a wide range of tensile stresses through the control of deposition parameters, such as flow rate and power. Stress engineered 3D cage-like structures comprised of PECVD silicon nitride and oxide films were fabricated. 3D structures with a range of curvatures were demonstrated. The measured geometry of the fabricated structures are in good agreement with predictions from analytical and finite element models.

  5. Synthesis of SiC Whiskers from Silicon Nitride in Argon Atmosphere

    Institute of Scientific and Technical Information of China (English)

    ZHANG Ying; JIANG Mingxue; ZHANG Junzhan; CUI Xiwen

    2009-01-01

    SiC whiskers were synthesized by carbothermal reduction of silicon nitride,a-Si3N4 and β-Si3N4 powders were used as silicon sources,and graphite,active carbon and black carbon as carbon sources,as well as boron oxide as catalyst. The synthesized SiC whiskers were characterized by XRD and SEM.The results showed that the synthesizing temperature should be above 1 716 K;the decomposition of Si3N4 was the limited step in the synthesis of SiC whiskers; and catalyst not only offered the liquid condition,but also restricted the growth of SiC whiskers along one dimension.LS mechanism seems to explain well the growth of SiC whiskers.

  6. Synthesis of Silicon Nitride and Silicon Carbide Nanocomposites through High Energy Milling of Waste Silica Fume for Structural Applications

    Science.gov (United States)

    Suri, Jyothi

    Nanocomposites have been widely used in a multitude of applications in electronics and structural components because of their improved mechanical, electrical, and magnetic properties. Silicon nitride/Silicon carbide (Si 3N4/SiC) nanocomposites have been studied intensively for low and high temperature structural applications, such as turbine and automobile engine components, ball bearings, turbochargers, as well as energy applications due to their superior wear resistance, high temperature strength, high oxidation resistance and good creep resistance. Silica fume is the waste material produced during the manufacture of silicon and ferro-silicon alloys, and contains 94 to 97 wt.% SiO2. In the present dissertation, the feasibility of using waste silica fume as the raw material was investigated to synthesize (I) advanced nanocomposites of Si3N4/SiC, and (2) porous silicon carbide (SiC) for membrane applications. The processing approach used to convert the waste material to advanced ceramic materials was based on a novel process called, integrated mechanical and thermal activation process (IMTA) process. In the first part of the dissertation, the effect of parameters such as carbothermic nitridation and reduction temperature and the graphite concentration in the starting silica fume plus graphite mixture, were explored to synthesize nanocomposite powders with tailored amounts of Si3N4 and SiC phases. An effective way to synthesize carbon-free Si3N 4/SiC composite powders was studied to provide a clear pathway and fundamental understanding of the reaction mechanisms. Si3N4/SiC nanocomposite powders were then sintered using two different approaches, based on liquid phase sintering and spark plasma sintering processes, with Al 2O3 and Y2O3 as the sintering aids. The nanocomposites were investigated for their densification behavior, microstructure, and mechanical properties. Si3N4/SiC nanocomposites thus obtained were found to possess superior mechanical properties at much

  7. Formation of boron nitride coatings on silicon carbide fibers using trimethylborate vapor

    Science.gov (United States)

    Yuan, Mengjiao; Zhou, Tong; He, Jing; Chen, Lifu

    2016-09-01

    High quality boron nitride (BN) coatings have been grown on silicon carbide (SiC) fibers by carbothermal nitridation and at atmospheric pressure. SiC fibers were first treated in chlorine gas to form CDC (carbide-derived carbon) film on the fiber surface. The CDC-coated SiC fibers were then reacted with trimethylborate vapor and ammonia vapor at high temperature, forming BN coatings by carbothermal reduction. The FT-IR, XPS, XRD, SEM, TEM and AES were used to investigate the formation of the obtained coatings. It has been found that the obtained coatings are composed of phase mixture of h-BN and amorphous carbon, very uniform in thickness, have smooth surface and adhere well with the SiC fiber substrates. The BN-coated SiC fibers retain ∼80% strength of the as-received SiC fibers and show an obvious interfacial debonding and fiber pullout in the SiCf/SiOC composites. This method may be useful for the large scale production of high quality BN coating on silicon carbide fiber.

  8. Friction and wear of plasma-deposited amorphous hydrogenated films on silicon nitride

    Science.gov (United States)

    Miyoshi, Kazuhisa

    1991-01-01

    An investigation was conducted to examine the friction and wear behavior of amorphous hydrogenated carbon (a-C:H) films in sliding contact with silicon nitride pins in both dry nitrogen and humid air environments. Amorphous hydrogenated carbon films approximately 0.06 micron thick were deposited on silicon nitride flat substrates by using the 30 kHz ac glow discharge of a planar plasma reactor. The results indicate that an increase in plasma deposition power gives an increase in film density and hardness. The high-density a-C:H films deposited behaved tribologically much like bulk diamond. In the dry nitrogen environment, a tribochemical reaction produced a substance, probably a hydrocarbon-rich layer, that decreased the coefficient of friction. In the humid air environment, tribochemical interactions drastically reduced the wear life of a-C:H films and water vapor greatly increased the friction. Even in humid air, effective lubrication is possible with vacuum-annealed a-C:H films. The vacuum-annealed high-density a-C:H film formed an outermost superficial graphitic layer, which behaved like graphite, on the bulk a-C:H film. Like graphite, the annealed a-C:H film with the superficial graphitic layer showed low friction when adsorbed water vapor was present.

  9. Review of corrosion behavior of ceramic heat exchanger materals: Corrosion characteristics of silicon carbide and silicon nitride. Final report, September 11, 1992--March 11, 1993

    Energy Technology Data Exchange (ETDEWEB)

    Munro, R.G.; Dapkunas, S.J.

    1993-09-01

    The present work is a review of the substantial effort that has been made to measure and understand the effects of corrosion with respect to the properties, performance, and durability of various forms of silicon carbide and silicon nitride. The review encompasses corrosion in diverse environments, usually at temperatures of 1000C or higher. The environments include dry and moist oxygen, mixtures of hot gaseous vapors, molten salts, molten metals, and complex environments pertaining to coal ashes and slags.

  10. Coupled fiber taper extraction of 1.53 um photoluminescence from erbium doped silicon nitride photonic crystal cavities

    OpenAIRE

    Shambat, Gary; Gong, Yiyang; Lu, Jesse; Yerci, Selcuk; Li, Rui; Negro, Luca Dal; Vuckovic, Jelena

    2010-01-01

    Optical fiber tapers are used to collect photoluminescence emission at ~1.5 um from photonic crystal cavities fabricated in erbium doped silicon nitride on silicon. Photoluminescence collection via fiber taper is enhanced 2.5 times relative to free space, with a total taper collection efficiency of 53%. By varying the fiber taper offset from the cavity, a broad tuning range of coupling strength is obtained. This material system combined with fiber taper collection is promising for building on...

  11. Density functional study of the bonding in small silicon clusters

    International Nuclear Information System (INIS)

    We report the ground electronic state, equilibrium geometry, vibrational frequencies, and binding energy for various isomers of Sin(n = 2--8) obtained with the linear combination of atomic orbitals-density functional method. We used both a local density approximation approach and one with gradient corrections. Our local density approximation results concerning the relative stability of electronic states and isomers are in agreement with Hartree--Fock and Moller--Plesset (MP2) calculations [K. Raghavachari and C. M. Rohlfing, J. Chem. Phys. 89, 2219 (1988)]. The binding energies calculated with the gradient corrected functional are in good agreement with experiment (Si2 and Si3) and with the best theoretical estimates. Our analysis of the bonding reveals two limiting modes of bonding and classes of silicon clusters. One class of clusters is characterized by relatively large s atomic populations and a large number of weak bonds, while the other class of clusters is characterized by relatively small s atomic populations and a small number of strong bonds

  12. Metalorganic chemical vapor deposition of few-layer sp2 bonded boron nitride films

    Science.gov (United States)

    Paduano, Qing; Snure, Michael; Weyburne, David; Kiefer, Arnold; Siegel, Gene; Hu, Jianjun

    2016-09-01

    A systematic study of the growth of atomically smooth few-layer sp2 bonded BN on 50 mm sapphire substrates by metalorganic chemical vapor deposition (MOCVD) using Triethylboron (TEB) and NH3 as precursors is described. Based on the experimental results obtained using Raman spectroscopy, atomic force microscopy (AFM), X-ray reflectance measurements and transmission electron microscopy, we explored the growth parameter space and identified three different growth modes: random three-dimensional (3D) growth, a self-terminating few-layer growth mode, and a very slow layer-by-layer mode. The growth mode depends on the temperature, pressure, V/III ratio, and surface nitridation conditions, as follows: 3D island growth is dominant in the low V/III range and is characterized by a decreasing growth rate with increasing deposition temperature. When the V/III ratio is increased this 3D island growth mode transitions to a self-terminating few-layer growth mode. An additional transition from self-terminating growth to 3D growth occurs when the growth pressure is increased. Very slow layer by layer growth is found at high temperature and low pressure. Finally, substrate surface nitridation promotes self-terminating growth that results in atomically smooth films.

  13. Flexible band gap tuning of hexagonal boron nitride sheets interconnected by acetylenic bonds.

    Science.gov (United States)

    Zhang, Hongyu; Luo, Youhua; Feng, Xiaojuan; Zhao, Lixia; Zhang, Meng

    2015-08-21

    The energetic and electronic properties of acetylenic-bond-interconnected hexagonal boron nitride sheets (BNyne), in which the number of rows of BN hexagonal rings (denoted as BN width) between neighboring arrays of acetylenic linkages increases consecutively, have been explored using first-principles calculations. Depending on the spatial position of B/N atoms with respect to the acetylenic linkages, there are two different types of configurations. The band structure features and band gap evolutions of BNyne structures as a function of the BN width can be categorized into two families, corresponding to two distinct types of configurations. In particular, for both types of BNyne structures, the band gap variations exhibit odd-even oscillating behavior depending on the BN width, which is related to the different symmetries of acetylenic chains in the unit cell. These results suggest that the embedded linear acetylenic chains can provide more flexibility for manipulation of the atomic and electronic properties of hexagonal boron nitride. These sp-sp(2) hybrid structures might promise importantly potential applications for developing nanoscale electronic and optoelectronic devices. PMID:26194068

  14. Simultaneous direct determination of aluminum, calcium and iron in silicon carbide and silicon nitride powders by slurry-sampling graphite furnace AAS.

    Science.gov (United States)

    Minami, Hirotsugu; Yada, Masako; Yoshida, Tomomi; Zhang, Qiangbin; Inoue, Sadanobu; Atsuya, Ikuo

    2004-03-01

    A fast and accurate analytical method was established for the simultaneous direct determination of aluminum, calcium and iron in silicon carbide and silicon nitride powders by graphite furnace atomic absorption spectrometry using a slurry sampling technique and a Hitachi Model Z-9000 atomic absorption spectrometer. The slurry samples were prepared by the ultrasonication of silicon carbide or silicon nitride powders with 0.1 M nitric acid. Calibration curves were prepared by using a mixed standard solution containing aluminum, calcium, iron and 0.1 M nitric acid. The analytical results of the proposed method for aluminum, calcium and iron in silicon carbide and silicon nitride reference materials were in good agreement with the reference values. The detection limits for aluminum, calcium and iron were 0.6 microg/g, 0.15 microg/g and 2.5 microg/g, respectively, in solid samples, when 200 mg of powdered samples were suspended in 20 ml of 0.1 M nitric acid and a 10 microl portion of the slurry sample was then measured. The relative standard deviation of the determination of aluminum, calcium and iron was 5 - 33%.

  15. Evaluation of silicon nitride as a substrate for culture of PC12 cells: an interfacial model for functional studies in neurons.

    Directory of Open Access Journals (Sweden)

    Johan Jaime Medina Benavente

    Full Text Available Silicon nitride is a biocompatible material that is currently used as an interfacial surface between cells and large-scale integration devices incorporating ion-sensitive field-effect transistor technology. Here, we investigated whether a poly-L-lysine coated silicon nitride surface is suitable for the culture of PC12 cells, which are widely used as a model for neural differentiation, and we characterized their interaction based on cell behavior when seeded on the tested material. The coated surface was first examined in terms of wettability and topography using contact angle measurements and atomic force microscopy and then, conditioned silicon nitride surface was used as the substrate for the study of PC12 cell culture properties. We found that coating silicon nitride with poly-L-lysine increased surface hydrophilicity and that exposing this coated surface to an extracellular aqueous environment gradually decreased its roughness. When PC12 cells were cultured on a coated silicon nitride surface, adhesion and spreading were facilitated, and the cells showed enhanced morphological differentiation compared to those cultured on a plastic culture dish. A bromodeoxyuridine assay demonstrated that, on the coated silicon nitride surface, higher proportions of cells left the cell cycle, remained in a quiescent state and had longer survival times. Therefore, our study of the interaction of the silicon nitride surface with PC12 cells provides important information for the production of devices that need to have optimal cell culture-supporting properties in order to be used in the study of neuronal functions.

  16. Application of FTIR spectrometry to determine the atomic composition of submicron silicon nitride layers HxSirNzHy

    International Nuclear Information System (INIS)

    Authors presents the developed software that allows to use the data from Fourier transform infrared spectrometry to calculate atomic composition in the silicon nitride HxSirNzHy layers of the submicron thickness. Autonomous and rapid method for the quantitative analysis of the IR spectra does not require prior measurement of thickness and density of the layers

  17. Copper-Free Click Biofunctionalization of Silicon Nitride Surfaces via Strain-Promoted Alkyne-Azide Cycloaddition Reactions

    NARCIS (Netherlands)

    Manova, R.K.; Pujari, S.P.; Weijers, C.A.G.M.; Zuilhof, H.; Beek, van T.A.

    2012-01-01

    Cu-free "click" chemistry is explored on silicon nitride (Si3N4) surfaces as an effective way for oriented immobilization of biomolecules. An omega-unsaturated ester was grafted onto Si3N4 using UV irradiation. Hydrolysis followed by carbodiimide-mediated activation yielded surface-bound active succ

  18. Effect of applied dc bias voltage on composition, chemical bonding and mechanical properties of carbon nitride films prepared by PECVD

    Institute of Scientific and Technical Information of China (English)

    LI Hong-xuan; XU Tao; HAO Jun-ying; CHEN Jian-min; ZHOU Hui-di; XUE Qun-ji; LIU Hui-wen

    2004-01-01

    Carbon nitride films were deposited on Si (100) substrates using plasma-enhanced chemical vapor deposition (PECVD) technique from CH4 and N2 at different applied dc bias voltage. The microstructure, composition and chemical bonding of the resulting films were characterized by Raman spectroscopy, Fourier transform infrared spectroscopy (FTIR), X-ray photoelectron spectroscopy (XPS) and X-ray diffraction (XRD). The mechanical properties such as hardness and elastic modulus of the films were evaluated using nano-indentation. As the results, the Raman spectra, showing the G and D bands, indicate the amorphous structure of the films. XPS and FTIR measurements demonstrate the existence of various carbon-nitride bonds in the films and the hydrogenation of carbon nitride phase. The composition ratio of N to C, the nano-hardness and the elastic modulus of the carbon nitride films increase with increasing dc bias voltage and reach the maximums at a dc bias voltage of 300 V, then they decrease with further increase of the dc bias voltage. Moreover, the XRD analyses indicate that the carbon nitride film contains some polycrystalline C3N4 phase embedded in the amorphous matrix at optimized deposition condition of dc bias voltage of 300 V.

  19. Formation of Silicon/Carbon Core-Shell Nanowires Using Carbon Nitride Nanorods Template and Gold Catalyst

    Directory of Open Access Journals (Sweden)

    Ilyani Putri Jamal

    2013-01-01

    Full Text Available In this experiment, silicon/carbon (Si/C core-shell nanowires (NWs were synthesized using gold nanoparticles (Au NPs coated carbon nitride nanorods (CN NRs as a template. To begin with, the Au NPs coated CN NRs were prepared by using plasma-enhanced chemical vapor deposition assisted with hot-wire evaporation technique. Fourier transform infrared spectrum confirms the C–N bonding of the CN NRs, while X-ray diffraction pattern indicates the crystalline structure of the Au NPs and amorphous structure of the CN NRs. The Au NPs coated CN NRs were thermally annealed at temperature of 800°C in nitrogen ambient for one hour to induce the growth of Si/C core-shell NWs. The growth mechanism for the Si/C core-shell NWs is related to the nitrogen evolution and solid-liquid-solid growth process which is a result of the thermal annealing. The formation of Si/C core-shell NWs is confirmed by electron spectroscopic imaging analysis.

  20. Fabrication of a full-size EUV pellicle based on silicon nitride

    Science.gov (United States)

    Goldfarb, Dario L.

    2015-10-01

    In this paper, the fabrication and initial characterization of an unsupported membrane composed of a single ultrathin silicon nitride (SiNx) layer with potential application as a EUV pellicle is described in detail. A full size free-standing pellicle with inner film area equal to 113x145mm and champion EUV transparency equal to 89.5% (single pass) is demonstrated utilizing the methodology presented in this study. The exemplary EUV transparency of the reported pellicle was achieved by limiting the membrane thickness to 16nm, while the intrinsic mechanical stability for the silicon nitride film was realized by adjusting the Si:N ratio to provide a non-stoichiometric layer featuring low tensile stress. The pellicle thickness, elemental composition and mass density were used to calculate the expected EUV transparency, which was found to be in good agreement with experimental EUV transmission measurements. Additionally, careful consideration was given to process-induced mechanical instabilities exerted on the ultrathin pellicle during the wet etch, rinsing and drying fabrication steps, and a unique yet simple set of ancillary hardware, materials and processing techniques was introduced to minimize such disturbances and yield large-area pellicles that are free of visible defects and wrinkles. In the absence of commercially available actinic inspection tools, a distinctive advantage of the SiNx membrane versus a Silicon-based EUV pellicle solution is the demonstrated ArF transmission, making it attractive for through-pellicle mask defect inspection and advanced metrology work utilizing available 193nm excimer laser and detection systems. A preliminary heat load test indicates that the SiNx-based EUV pellicle would be marginally compatible with an equivalent 80W EUV source.

  1. Co-implantation of carbon and nitrogen into silicon dioxide for synthesis of carbon nitride materials

    CERN Document Server

    Huang, M B; Nuesca, G; Moore, R

    2002-01-01

    Materials synthesis of carbon nitride has been attempted with co-implantation of carbon and nitrogen into thermally grown SiO sub 2. Following implantation of C and N ions to doses of 10 sup 1 sup 7 cm sup - sup 2 , thermal annealing of the implanted SiO sub 2 sample was conducted at 1000 degree sign C in an N sub 2 ambient. As evidenced in Fourier transform infrared measurements and X-ray photoelectron spectroscopy, different bonding configurations between C and N, including C-N single bonds, C=N double bonds and C=N triple bonds, were found to develop in the SiO sub 2 film after annealing. Chemical composition profiles obtained with secondary ion mass spectroscopy were correlated with the depth information of the chemical shifts of N 1s core-level electrons, allowing us to examine the formation of C-N bonding for different atomic concentration ratios between N and C. X-ray diffraction and transmission electron microscopy showed no sign of the formation of crystalline C sub 3 N sub 4 precipitates in the SiO ...

  2. Nanoscale structure and superhydrophobicity of sp2-bonded boron nitride aerogels

    Science.gov (United States)

    Pham, Thang; Goldstein, Anna P.; Lewicki, James P.; Kucheyev, Sergei O.; Wang, Cheng; Russell, Thomas P.; Worsley, Marcus A.; Woo, Leta; Mickelson, William; Zettl, Alex

    2015-06-01

    Aerogels have much potential in both research and industrial applications due to their high surface area, low density, and fine pore size distribution. Here we report a thorough structural study of three-dimensional aerogels composed of highly crystalline sp2-bonded boron nitride (BN) layers synthesized by a carbothermic reduction process. The structure, crystallinity and bonding of the as-prepared BN aerogels are elucidated by X-ray diffraction, 11B nuclear magnetic resonance, transmission electron microscopy, and resonant soft X-ray scattering. The macroscopic roughness of the aerogel's surface causes it to be superhydrophobic with a contact angle of ~155° and exhibit high oil uptake capacity (up to 1500 wt%). The oil can be removed from the BN aerogel by oxidizing in air without damaging the crystalline porous structure of the aerogel or diminishing its oil absorption capacity.Aerogels have much potential in both research and industrial applications due to their high surface area, low density, and fine pore size distribution. Here we report a thorough structural study of three-dimensional aerogels composed of highly crystalline sp2-bonded boron nitride (BN) layers synthesized by a carbothermic reduction process. The structure, crystallinity and bonding of the as-prepared BN aerogels are elucidated by X-ray diffraction, 11B nuclear magnetic resonance, transmission electron microscopy, and resonant soft X-ray scattering. The macroscopic roughness of the aerogel's surface causes it to be superhydrophobic with a contact angle of ~155° and exhibit high oil uptake capacity (up to 1500 wt%). The oil can be removed from the BN aerogel by oxidizing in air without damaging the crystalline porous structure of the aerogel or diminishing its oil absorption capacity. Electronic supplementary information (ESI) available: High resolution TEM images of different portions of sample, photos of aerogels in oil bath over time, thermal gravimetric analysis data of the aerogels, and

  3. Core-level photoabsorption study of defects and metastable bonding configurations in boron nitride

    Energy Technology Data Exchange (ETDEWEB)

    Jimenez, I.; Jankowski, A.F.; Terminello, L.J. [Lawrence Berkeley National Lab., CA (United States)] [and others

    1997-04-01

    Boron nitride is an interesting material for technological applications and for fundamental solid state physics investigations. It is a compound isoelectronic with carbon and, like carbon can possess sp{sup 2} and sp{sup 3} bonded phases resembling graphite and diamond. BN crystallizes in the sp{sup 2}-bonded hexagonal (h-BN), rhombohedral (r-BN) and turbostratic phases, and in the sp{sup 3}-bonded cubic (c-BN) and wurtzite (w-BN) phases. A new family of materials is obtained when replacing C-C pairs in graphite with isoelectronic B-N pairs, resulting in C{sub 2}BN compounds. Regarding other boron compounds, BN is exceptional in the sense that it has standard two-center bonds with conventional coordination numbers, while other boron compounds (e.g. B{sub 4}C) are based on the boron icosahedron unit with three-center bonds and high coordination numbers. The existence of several allotropic forms and fullerene-like structures for BN suggests a rich variety of local bonding and poses the questions of how this affects the local electronic structure and how the material accommodates the stress induced in the transition regions between different phases. One would expect point defects to play a crucial role in stress accommodation, but these must also have a strong influence in the electronic structure, since the B-N bond is polar and a point defect will thus be a charged structure. The study of point defects in relationship to the electronic structure is of fundamental interest in these materials. Recently, the authors have shown that Near-Edge X-ray Absorption Fine Structure (NEXAFS) is sensitive to point defects in h-BN, and to the formation of metastable phases even in amorphous materials. This is significant since other phase identification techniques like vibrational spectroscopies or x-ray diffraction yield ambiguous results for nanocrystalline and amorphous samples. Serendipitously, NEXAFS also combines chemical selectivity with point defect sensitivity.

  4. STUDY ON REDUCING THE CORE LOSS OF GRAIN ORIENTED SILICON STEEL AND IMPROVING ITS AGING PROPERTY BY LASER NITRIDING TECHNIQUE IN ATMOSPHERIC AMBIENT

    Institute of Scientific and Technical Information of China (English)

    Y.L Yang; C.S. Liu; F.J. Sun; D. Zhang

    2005-01-01

    CW-CO2 laser nitriding technique was applied to improve the properties (such as aging property and the core loss) of grain oriented silicon steel. The samples were nitrided with regular space.some laser irradiation, Fe4N and Fe3N were formed in the nitrided zone. The nitrided samples were annealed at the temperatures ranged from 100 to 900℃. The core loss of some interested samples was tested. The results show that the core loss of the nitrided samples with different thickness of 0.23 and 0.30mm decreased by 14.9% and 9.4% respectively, and the aging property were improved up to 800℃. The mechanism of laser nitriding to improve the properties of grain oriented silicon steel is discussed.

  5. Research on the direct doping effect of silicon on cubic boron nitride ceramics by UV-VIS diffuse reflectance

    International Nuclear Information System (INIS)

    Cubic boron nitride (cBN) micro-powders mixed with 1 wt% silicon were sintered at 1450 deg. C under a pressure of 5.0 GPa. The grain boundaries and silicon distribution in Si-cBN ceramics were studied by scanning electronic microscope (SEM) and energy-dispersive spectrometer (EDS). Optical properties of the ceramics were investigated by UV-VIS diffuse reflectance and photoluminescence spectra at room temperature. Some important parameters of studied ceramics such as absorption coefficient and defect levels were identified from reflection spectra by intercept method. The experimental results indicated the direct n-doped effect of silicon on cubic boron nitride ceramics. With a direct forbidden transition characteristic, the donor energy level of Si in forbidden zone of cBN ceramics was found to be 2.82 eV. The phonon energy related to the direct forbidden transition was 0.235 eV.

  6. Surface wet-ability modification of thin PECVD silicon nitride layers by 40 keV argon ion treatments

    Science.gov (United States)

    Caridi, F.; Picciotto, A.; Vanzetti, L.; Iacob, E.; Scolaro, C.

    2015-10-01

    Measurements of wet-ability of liquid drops have been performed on a 30 nm silicon nitride (Si3N4) film deposited by a PECVD reactor on a silicon wafer and implanted by 40 keV argon ions at different doses. Surface treatments by using Ar ion beams have been employed to modify the wet-ability. The chemical composition of the first Si3N4 monolayer was investigated by means of X-ray Photoelectron Spectroscopy (XPS). The surface morphology was tested by Atomic Force Microscopy (AFM). Results put in evidence the best implantation conditions for silicon nitride to increase or to reduce the wet-ability of the biological liquid. This permits to improve the biocompatibility and functionality of Si3N4. In particular experimental results show that argon ion bombardment increases the contact angle, enhances the oxygen content and increases the surface roughness.

  7. Single Photon Counting UV Solar-Blind Detectors Using Silicon and III-Nitride Materials.

    Science.gov (United States)

    Nikzad, Shouleh; Hoenk, Michael; Jewell, April D; Hennessy, John J; Carver, Alexander G; Jones, Todd J; Goodsall, Timothy M; Hamden, Erika T; Suvarna, Puneet; Bulmer, J; Shahedipour-Sandvik, F; Charbon, Edoardo; Padmanabhan, Preethi; Hancock, Bruce; Bell, L Douglas

    2016-01-01

    Ultraviolet (UV) studies in astronomy, cosmology, planetary studies, biological and medical applications often require precision detection of faint objects and in many cases require photon-counting detection. We present an overview of two approaches for achieving photon counting in the UV. The first approach involves UV enhancement of photon-counting silicon detectors, including electron multiplying charge-coupled devices and avalanche photodiodes. The approach used here employs molecular beam epitaxy for delta doping and superlattice doping for surface passivation and high UV quantum efficiency. Additional UV enhancements include antireflection (AR) and solar-blind UV bandpass coatings prepared by atomic layer deposition. Quantum efficiency (QE) measurements show QE > 50% in the 100-300 nm range for detectors with simple AR coatings, and QE ≅ 80% at ~206 nm has been shown when more complex AR coatings are used. The second approach is based on avalanche photodiodes in III-nitride materials with high QE and intrinsic solar blindness. PMID:27338399

  8. Microstructure and Phase Composition of Cold Isostatically Pressed and Pressureless Sintered Silicon Nitride.

    Science.gov (United States)

    Lukianova, O A; Krasilnikov, V V; Parkhomenko, A A; Sirota, V V

    2016-12-01

    The microstructure and physical properties of new Y2O3 and Al2O3 oxide-doped silicon nitride ceramics fabricated by cold isostatic pressing and free sintering were investigated. The phase composition of produced material was also studied by X-ray diffraction at room and elevated temperature. The fabricated ceramics featured a microstructure of Si5AlON7 grains with a fine-grained α-Si3N4 with a small amount of Y2SiAlON5. Described ceramics is attractive for many high-temperature structural applications due to beneficial combination of fine-grained structure with improved mechanical properties and small weight loss. PMID:26979726

  9. Design and optimization of optical modulators based on graphene-on-silicon nitride microring resonators

    CERN Document Server

    Wu, Zeru; Zhang, Tianyou; Shao, Zengkai; Wen, Yuanhui; Xu, Pengfei; Zhang, Yanfeng; Yu, Siyuan

    2016-01-01

    In order to overcome the challenge of obtaining high modulation depth due to weak graphene-light interaction, a graphene-on-silicon nitride (SiNx) microring resonator based on graphene's gate-tunable optical conductivity is proposed and studied. Geometrical parameters of graphene-on-SiNx waveguide are systematically analyzed and optimized, yielding a loss tunability of 0.04 dB/{\\mu}m and an effective index variation of 0.0022. We explicitly study the interaction between graphene and a 40-{\\mu}m-radius microring resonator, where electro-absorptive and electro-refractive modulation are both taken into account. By choosing appropriate graphene coverage and coupling coefficient, a high modulation depth of over 40 dB with large fabrication tolerance is obtained.

  10. Diamond and diamondlike carbon as wear-resistant, self-lubricating coatings for silicon nitride

    Science.gov (United States)

    Miyoshi, Kazuhisa

    1995-01-01

    Recent work on the friction and wear properties of as-deposited fine-grain diamond, polished coarse-grain diamond, and as-deposited diamondlike carbon (DLC) films in humid air at a relative humidity of approximately 40 percent and in dry nitrogen is reviewed. Two types of chemical vapor deposition (CVD) processes are used to deposit diamond films on silicon nitride (Si3N4) substrates: microwave-plasma and hot-filament. Ion beams are used to deposit DLC films of Si3N4 substrates. The diamond and DLC films in sliding contact with hemispherical bare Si3N4 pins have low steady-state coefficients of friction (less than 0.2) and low wear rates (less than 10(exp -7) mm(exp 2)/N-m), and thus, can be used effectively as wear-resistant, self-lubricating coatings for Si3N4 in the aforementioned two environments.

  11. Single Photon Counting UV Solar-Blind Detectors Using Silicon and III-Nitride Materials.

    Science.gov (United States)

    Nikzad, Shouleh; Hoenk, Michael; Jewell, April D; Hennessy, John J; Carver, Alexander G; Jones, Todd J; Goodsall, Timothy M; Hamden, Erika T; Suvarna, Puneet; Bulmer, J; Shahedipour-Sandvik, F; Charbon, Edoardo; Padmanabhan, Preethi; Hancock, Bruce; Bell, L Douglas

    2016-06-21

    Ultraviolet (UV) studies in astronomy, cosmology, planetary studies, biological and medical applications often require precision detection of faint objects and in many cases require photon-counting detection. We present an overview of two approaches for achieving photon counting in the UV. The first approach involves UV enhancement of photon-counting silicon detectors, including electron multiplying charge-coupled devices and avalanche photodiodes. The approach used here employs molecular beam epitaxy for delta doping and superlattice doping for surface passivation and high UV quantum efficiency. Additional UV enhancements include antireflection (AR) and solar-blind UV bandpass coatings prepared by atomic layer deposition. Quantum efficiency (QE) measurements show QE > 50% in the 100-300 nm range for detectors with simple AR coatings, and QE ≅ 80% at ~206 nm has been shown when more complex AR coatings are used. The second approach is based on avalanche photodiodes in III-nitride materials with high QE and intrinsic solar blindness.

  12. Octave-spanning coherent supercontinuum generation in a silicon nitride waveguide.

    Science.gov (United States)

    Johnson, Adrea R; Mayer, Aline S; Klenner, Alexander; Luke, Kevin; Lamb, Erin S; Lamont, Michael R E; Joshi, Chaitanya; Okawachi, Yoshitomo; Wise, Frank W; Lipson, Michal; Keller, Ursula; Gaeta, Alexander L

    2015-11-01

    We demonstrate the generation of a supercontinuum spanning more than 1.4 octaves in a silicon nitride waveguide using sub-100-fs pulses at 1 μm generated by either a 53-MHz, diode-pumped ytterbium (Yb) fiber laser or a 1-GHz, Yb:CaAlGdO(4) (Yb:CALGO) laser. Our numerical simulations show that the broadband supercontinuum is fully coherent, and a spectral interference measurement is used to verify that the supercontinuum generated with the Yb:CALGO laser possesses a high degree of coherence over the majority of its spectral bandwidth. This coherent spectrum may be utilized for optical coherence tomography, spectroscopy, and frequency metrology. PMID:26512533

  13. Observation of ultraslow stress release in silicon nitride films on CaF2

    International Nuclear Information System (INIS)

    Silicon nitride thin films are deposited by plasma-enhanced chemical vapor deposition on (100) and (111) CaF2 crystalline substrates. Delaminated wavy buckles formed during the release of internal compressive stress in the films and the stress releasing processes are observed macroscopically and microscopically. The stress release patterns start from the substrate edges and propagate to the center along defined directions aligned with the crystallographic orientations of the substrate. The stress releasing velocity of SiNx film on (111) CaF2 is larger than that of SiNx film with the same thickness on (100) CaF2. The velocities of SiNx film on both (100) and (111) CaF2 increase with the film thickness. The stress releasing process is initiated when the films are exposed to atmosphere, but it is not a chemical change from x-ray photoelectron spectroscopy

  14. Integrated CARS Source based on Seeded Four-wave Mixing in Silicon Nitride

    CERN Document Server

    Epping, Jörn P; van der Slot, Peter J M; Lee, Chris J; Fallnich, Carsten; Boller, Klaus-J

    2013-01-01

    We present a theoretical investigation of an integrated nonlinear light source for coherent anti-Stokes Raman scattering (CARS) based on silicon nitride waveguides. Wavelength tunable and temporally synchronized signal and idler pulses are obtained by using seeded four-wave mixing. We find that the calculated input pump power needed for nonlinear wavelength generation is more than one order of magnitude lower than in previously reported approaches based on optical fibers. The tuning range of the wavelength conversion was calculated to be 1418 nm to 1518 nm (idler) and 788 nm to 857 nm (signal), which corresponds to a coverage of vibrational transitions from 2350 cm$^{-1}$ to 2810 cm$^{-1}$. A maximum conversion efficiency of 19.1% at a peak pump power of 300 W was obtained.

  15. Microstructure and Phase Composition of Cold Isostatically Pressed and Pressureless Sintered Silicon Nitride.

    Science.gov (United States)

    Lukianova, O A; Krasilnikov, V V; Parkhomenko, A A; Sirota, V V

    2016-12-01

    The microstructure and physical properties of new Y2O3 and Al2O3 oxide-doped silicon nitride ceramics fabricated by cold isostatic pressing and free sintering were investigated. The phase composition of produced material was also studied by X-ray diffraction at room and elevated temperature. The fabricated ceramics featured a microstructure of Si5AlON7 grains with a fine-grained α-Si3N4 with a small amount of Y2SiAlON5. Described ceramics is attractive for many high-temperature structural applications due to beneficial combination of fine-grained structure with improved mechanical properties and small weight loss.

  16. Vertical coupling of laser glass microspheres to buried silicon nitride ellipses and waveguides

    CERN Document Server

    Navarro-Urrios, Daniel; Capuj, Nestor E; Berencen, Yonder; Garrido, Blas; Tredicucci, Alessandro

    2015-01-01

    We demonstrate the integration of Nd3+ doped Barium-Titanium-Silicate microsphere lasers with a Silicon Nitride photonic platform. Devices with two different geometrical configurations for extracting the laser light to buried waveguides have been fabricated and characterized. The first configuration relies on a standard coupling scheme, where the microspheres are placed over strip waveguides. The second is based on a buried elliptical geometry whose working principle is that of an elliptical mirror. In the latter case, the input of a strip waveguide is placed on one focus of the ellipse, while a lasing microsphere is placed on top of the other focus. The fabricated elliptical geometry (ellipticity=0.9) presents a light collecting capacity that is 50% greater than that of the standard waveguide coupling configuration and could be further improved by increasing the ellipticity. Moreover, since the dimensions of the spheres are much smaller than those of the ellipses, surface planarization is not required. On th...

  17. Single Photon Counting UV Solar-Blind Detectors Using Silicon and III-Nitride Materials

    Science.gov (United States)

    Nikzad, Shouleh; Hoenk, Michael; Jewell, April D.; Hennessy, John J.; Carver, Alexander G.; Jones, Todd J.; Goodsall, Timothy M.; Hamden, Erika T.; Suvarna, Puneet; Bulmer, J.; Shahedipour-Sandvik, F.; Charbon, Edoardo; Padmanabhan, Preethi; Hancock, Bruce; Bell, L. Douglas

    2016-01-01

    Ultraviolet (UV) studies in astronomy, cosmology, planetary studies, biological and medical applications often require precision detection of faint objects and in many cases require photon-counting detection. We present an overview of two approaches for achieving photon counting in the UV. The first approach involves UV enhancement of photon-counting silicon detectors, including electron multiplying charge-coupled devices and avalanche photodiodes. The approach used here employs molecular beam epitaxy for delta doping and superlattice doping for surface passivation and high UV quantum efficiency. Additional UV enhancements include antireflection (AR) and solar-blind UV bandpass coatings prepared by atomic layer deposition. Quantum efficiency (QE) measurements show QE > 50% in the 100–300 nm range for detectors with simple AR coatings, and QE ≅ 80% at ~206 nm has been shown when more complex AR coatings are used. The second approach is based on avalanche photodiodes in III-nitride materials with high QE and intrinsic solar blindness. PMID:27338399

  18. Photonic crystal dumbbell resonators in silicon and aluminum nitride integrated optical circuits

    CERN Document Server

    Pernice, W H P; Tang, H X

    2014-01-01

    Tight confinement of light in photonic cavities provides an efficient template for the realization of high optical intensity with strong field gradients. Here we present such a nanoscale resonator device based on a one-dimensional photonic crystal slot cavity. Our design allows for realizing highly localized optical modes with theoretically predicted Q factors in excess of 106. The design is demonstrated experimentally both in a high-contrast refractive index system (silicon), as well as in medium refractive index contrast devices made from aluminum nitride. We achieve extinction ratio of 21dB in critically coupled resonators using an on-chip readout platform with loaded Q factors up to 33,000. Our approach holds promise for realizing ultra-small opto-mechanical resonators for high-frequency operation and sensing applications.

  19. Self-referenced silicon nitride array microring biosensor for toxin detection using glycans at visible wavelength

    Science.gov (United States)

    Ghasemi, Farshid; Eftekhar, Ali A.; Gottfried, David S.; Song, Xuezheng; Cummings, Richard D.; Adibi, Ali

    2013-02-01

    We report on application of on-chip referencing to improve the limit-of-detection (LOD) in compact silicon nitride (SiN) microring arrays. Microring resonators, fabricated by e-beam lithography and fluorine-based etching, are designed for visible wavelengths (656nm) and have a footprint of 20 x 20 μm. GM1 ganglioside is used as the specific ligand for recognition of Cholera Toxin Subunit B (CTB), with Ricinus Communis Agglutinin I (RCA I) as a negative control. Using micro-cantilever based printing less than 10 pL of glycan solution is consumed per microring. Real-time data on analyte binding is extracted from the shifts in resonance wavelengths of the microrings.

  20. Design Evaluation Using Finite Element Analysis of Cooled Silicon Nitride Plates for a Turbine Blade Application

    Science.gov (United States)

    Abdul-Aziz, Ali; Baaklini, George Y.; Bhatt, Ramakrishna T.

    2001-01-01

    Two- and three-dimensional finite element analyses were performed on uncoated and thermal barrier coated (TBC) silicon nitride plates with and without internal cooling by air. Steady-state heat-transfer analyses were done to optimize the size and the geometry of the cooling channels to reduce thermal stresses, and to evaluate the thermal environment experienced by the plate during burner rig testing. The limited experimental data available were used to model the thermal profile exerted by the flame on the plate. Thermal stress analyses were performed to assess the stress response due to thermal loading. Contours for the temperature and the representative stresses for the plates were generated and presented for different cooling hole sizes and shapes. Analysis indicates that the TBC experienced higher stresses, and the temperature gradient was much reduced when the plate was internally cooled by air. The advantages and disadvantages of several cooling channel layouts were evaluated.

  1. Electromagnetically induced transparency and wide-band wavelength conversion in silicon nitride microdisk optomechanical resonators

    CERN Document Server

    Liu, Yuxiang; Aksyuk, Vladimir; Srinivasan, Kartik

    2013-01-01

    We demonstrate optomechanically-mediated electromagnetically-induced transparency and wavelength conversion in silicon nitride (Si3N4) microdisk resonators. Fabricated devices support whispering gallery optical modes with a quality factor (Q) of 10^6, and radial breathing mechanical modes with a Q=10^4 and a resonance frequency of 625 MHz, so that the system is in the resolved sideband regime. Placing a strong optical control field on the red (blue) detuned sideband of the optical mode produces coherent interference with a resonant probe beam, inducing a transparency (absorption) window for the probe. This is observed for multiple optical modes of the device, all of which couple to the same mechanical mode, and which can be widely separated in wavelength due to the large bandgap of Si3N4. These properties are exploited to demonstrate frequency upconversion and downconversion of optical signals between the 1300 nm and 980 nm bands.

  2. MgB2 thin films on silicon nitride substrates prepared by an in situ method

    International Nuclear Information System (INIS)

    Large-area MgB2 thin films were deposited on silicon nitride and sapphire substrates by co-deposition of Mg and B. After a post-annealing in Ar atmosphere at temperatures between 773 and 1173 K depending on the substrate, the films showed a critical temperature higher than 35 K with a transition width less than 0.5 K. The x-ray diffraction pattern suggested a c-axis preferential orientation in films deposited on amorphous substrate. The smooth surface and the good structural properties of these MgB2 films allowed their reproducible patterning by a standard photolithographic process down to dimensions of the order of 10 μm and without a considerable degradation of the superconducting properties

  3. 3D hierarchical architectures based on self-rolled-up silicon nitride membranes

    International Nuclear Information System (INIS)

    This study presents the superior structural versatility of strained silicon nitride (SiNx) membranes as a platform for three-dimensional (3D) hierarchical tubular architectures. The effects of compressive and tensile stressed SiNx layer thickness on the self-rolled-up tube curvature, the sacrificial layer etching anisotropy on rolling direction and chirality, and stress engineering by localized thickness control or thermal treatment, are explored systematically. Using strained SiNx membranes as an electrically insulating and optically transparent mechanical support, compact 3D hierarchical architectures involving carbon nanotube arrays and passive electronic components are demonstrated by releasing the functional structures deposited and patterned in 2D. These examples highlight the uniqueness of this platform that exploits 2D processing and self-assembly to achieve highly functional 3D structures. (paper)

  4. Fano resonances in a multimode waveguide coupled to a high-Q silicon nitride ring resonator.

    Science.gov (United States)

    Ding, Dapeng; de Dood, Michiel J A; Bauters, Jared F; Heck, Martijn J R; Bowers, John E; Bouwmeester, Dirk

    2014-03-24

    Silicon nitride (Si3N4) optical ring resonators provide exceptional opportunities for low-loss integrated optics. Here we study the transmission through a multimode waveguide coupled to a Si3N4 ring resonator. By coupling single-mode fibers to both input and output ports of the waveguide we selectively excite and probe combinations of modes in the waveguide. Strong asymmetric Fano resonances are observed and the degree of asymmetry can be tuned through the positions of the input and output fibers. The Fano resonance results from the interference between modes of the waveguide and light that couples resonantly to the ring resonator. We develop a theoretical model based on the coupled mode theory to describe the experimental results. The large extension of the optical modes out of the Si3N4 core makes this system promising for sensing applications. PMID:24664026

  5. Preparation and Properties of Macroporous Silicon Nitride Ceramics by Gelcasting and Carbonthermal Reaction

    Institute of Scientific and Technical Information of China (English)

    Wen ZHANG; Hongjie WANG; Zhihao JIN

    2005-01-01

    Macroporous silicon nitride (Si3N4) ceramics with high strength, uniform structure and relatively high porosity were obtained by gelcasting and carbonthermal reaction in a two-step sintering technique. Microstructure and composition were investigated by scanning electron microscopy (SEM), transmission electron microscopy (TEM), X-ray diffraction(XRD). Open porosity, pore size distribution and basic mechanical performance were measured by Archimedes method,mercury intrusion porosimetry and three-point bending methods, respectively. SEM and TEM results revealed that pores were formed by elongated β-Si3N4. SADP measurement proved the formation of SiC particles. The SiC granules were beneficial for the formation of high ratio elongated β-Si3N4, and at proper amount, they also acted as reinforcement phase. Thermodynamic analysis indicated that the mechanisms of the reactions were mainly associated with liquid-solid reaction and gas-liquid reaction.

  6. Si-H bond dynamics in hydrogenated amorphous silicon

    Science.gov (United States)

    Scharff, R. Jason; McGrane, Shawn D.

    2007-08-01

    The ultrafast structural dynamics of the Si-H bond in the rigid solvent environment of an amorphous silicon thin film is investigated using two-dimensional infrared four-wave mixing techniques. The two-dimensional infrared (2DIR) vibrational correlation spectrum resolves the homogeneous line shapes ( 4ps waiting times. The Si-H stretching mode anharmonic shift is determined to be 84cm-1 and decreases slightly with vibrational frequency. The 1→2 linewidth increases with vibrational frequency. Frequency dependent vibrational population times measured by transient grating spectroscopy are also reported. The narrow homogeneous line shape, large inhomogeneous broadening, and lack of spectral diffusion reported here present the ideal backdrop for using a 2DIR probe following electronic pumping to measure the transient structural dynamics implicated in the Staebler-Wronski degradation [Appl. Phys. Lett. 31, 292 (1977)] in a-Si:H based solar cells.

  7. Silicon Nitride Plates for Turbine Blade Application: FEA and NDE Assessment

    Science.gov (United States)

    Abdul-Aziz, Ali; Baaklini, George Y.; Bhatt, Ramakrishna T.

    2001-01-01

    Engine manufacturers are continually attempting to improve the performance and the overall efficiency of internal combustion engines. The thermal efficiency is typically improved by raising the operating temperature of essential engine components in the combustion area. This reduces the heat loss to a cooling system and allows a greater portion of the heat to be used for propulsion. Further improvements can be achieved by diverting part of the air from the compressor, which would have been used in the combustor for combustion purposes, into the turbine components. Such a process is called active cooling. Increasing the operating temperature, decreasing the cooling air, or both can improve the efficiency of the engine. Furthermore, lightweight, strong, tough hightemperature materials are required to complement efficiency improvement for nextgeneration gas turbine engines that can operate with minimum cooling. Because of their low-density, high-temperature strength, and thermal conductivity, ceramics are being investigated as potential materials for replacing ordinary metals that are currently used for engine hot section components. Ceramic structures can withstand higher operating temperatures and other harsh environmental factors. In addition, their low densities relative to metals helps condense component mass (ref. 1). The objectives of this program at the NASA Glenn Research Center are to develop manufacturing technology, a thermal barrier coating/environmental barrier coating (TBC/EBC), and an analytical modeling capability to predict thermomechanical stresses, and to do minimal burner rig tests of silicon nitride (Si3N4) and SiC/SiC turbine nozzle vanes under simulated engine conditions. Furthermore, and in support of the latter objectives, an optimization exercise using finite element analysis and nondestructive evaluation (NDE) was carried out to characterize and evaluate silicon nitride plates with cooling channels.

  8. The cost of silicon nitride powder: What must it be to compete

    Energy Technology Data Exchange (ETDEWEB)

    Das, S.; Curlee, T.R.

    1992-02-01

    The ability of advanced ceramic components to compete with similar metallic parts will depend in part on current and future efforts to reduce the cost of ceramic parts. This paper examines the potential reductions in part cost that could result from the development of less expensive advanced ceramic powders. The analysis focuses specifically on two silicon nitride engine components -- roller followers and turbocharger rotors. The results of the process-cost models developed for this work suggest that reductions in the cost of advanced silicon nitride powder from its current level of about $20 per pound to about $5 per pound will not in itself be sufficient to lower the cost of ceramic parts below the current cost of similar metallic components. This work also examines if combinations of lower-cost powders and further improvements in other key technical parameters to which costs are most sensitive could push the cost of ceramics below the cost of metallics. Although these sensitivity analyses are reflective of technical improvements that are very optimistic, the resulting part costs are estimated to remain higher than similar metallic parts. Our findings call into question the widely-held notion that the cost of ceramic components must not exceed the cost of similar metallic parts if ceramics are to be competitive. Economic viability will ultimately be decided not on the basis of which part is less costly, but on an assessment of the marginal costs and benefits provided by ceramics and metallics. This analysis does not consider the benefits side of the equation. Our findings on the cost side of the equation suggest that the competitiveness of advanced ceramics will ultimately be decided by our ability to evaluate and communicate the higher benefits that advanced ceramic parts may offer.

  9. The cost of silicon nitride powder: What must it be to compete?

    Energy Technology Data Exchange (ETDEWEB)

    Das, S.; Curlee, T.R.

    1992-02-01

    The ability of advanced ceramic components to compete with similar metallic parts will depend in part on current and future efforts to reduce the cost of ceramic parts. This paper examines the potential reductions in part cost that could result from the development of less expensive advanced ceramic powders. The analysis focuses specifically on two silicon nitride engine components -- roller followers and turbocharger rotors. The results of the process-cost models developed for this work suggest that reductions in the cost of advanced silicon nitride powder from its current level of about $20 per pound to about $5 per pound will not in itself be sufficient to lower the cost of ceramic parts below the current cost of similar metallic components. This work also examines if combinations of lower-cost powders and further improvements in other key technical parameters to which costs are most sensitive could push the cost of ceramics below the cost of metallics. Although these sensitivity analyses are reflective of technical improvements that are very optimistic, the resulting part costs are estimated to remain higher than similar metallic parts. Our findings call into question the widely-held notion that the cost of ceramic components must not exceed the cost of similar metallic parts if ceramics are to be competitive. Economic viability will ultimately be decided not on the basis of which part is less costly, but on an assessment of the marginal costs and benefits provided by ceramics and metallics. This analysis does not consider the benefits side of the equation. Our findings on the cost side of the equation suggest that the competitiveness of advanced ceramics will ultimately be decided by our ability to evaluate and communicate the higher benefits that advanced ceramic parts may offer.

  10. Effect of the stoichiometry of Si-rich silicon nitride thin films on their photoluminescence and structural properties

    Energy Technology Data Exchange (ETDEWEB)

    Torchynska, T.V., E-mail: ttorch@esfm.ipn.mx [ESFM—Instituto Politecnico Nacional, Mexico DF 07738 (Mexico); Casas Espinola, J.L. [ESFM—Instituto Politecnico Nacional, Mexico DF 07738 (Mexico); Vergara Hernandez, E. [UPIITA—Instituto Politecnico Nacional, Mexico DF 07320 (Mexico); Khomenkova, L., E-mail: khomen@ukr.net [V. Lashkaryov Institute of Semiconductor Physics, 45 Pr. Nauky, 03028 Kyiv (Ukraine); Delachat, F.; Slaoui, A. [ICube, 23 rue du Loess, BP 20 CR, 67037 Strasbourg Cedex 2 (France)

    2015-04-30

    Si-rich Silicon nitride films were grown on silicon substrates by plasma enhanced chemical vapor deposition. The film stoichiometry was controlled via the variation of NH{sub 3}/SiH{sub 4} ratio from 0.45 up to 1.0. Thermal annealing at 1100 °C for 30 min in the nitrogen flow was applied to form the Si nanocrystals in the films that have been investigated by means of photoluminescence and Raman scattering methods, as well as transmission electron microscopy. Several emission bands have been detected with the peak positions at: 2.8–3.0 eV, 2.5–2.7 eV, 2.10–2.25 eV, and 1.75–1.98 eV. The temperature dependences of photoluminescence spectra were studied with the aim to confirm the types of optical transitions and the nature of light emitting defects in silicon nitride. The former three bands were assigned to the defects in silicon nitride, whereas the last one (1.75–1.98 eV) was attributed to the exciton recombination inside of Si nanocrystals. The photoluminescence mechanism is discussed. - Highlights: • Substoichiometric silicon nitride films were grown by PECVD technique. • The variation of the NH{sub 3}/SiH{sub 4} ratio controls excess Si content in the films. • Both Si nanocrystals and amorphous Si phase were observed in annealed films. • Temperature evolution of carrier recombination via Si nanocrystals and host defects.

  11. Preparation and properties of bisphenol-F based boron-phenolic resin/modified silicon nitride composites and their usage as binders for grinding wheels

    Energy Technology Data Exchange (ETDEWEB)

    Lin, Chun-Te [Department of Polymer Engineering, National Taiwan University of Science and Technology, 43, Sec 4, Keelung Rd, Taipei 106, Taiwan (China); Lee, Hsun-Tsing [Department of Materials Science and Engineering, Vanung University, Chung-Li, Tao-Yuan, Taiwan (China); Chen, Jem-Kun, E-mail: jkchen@mail.ntust.edu.tw [Department of Polymer Engineering, National Taiwan University of Science and Technology, 43, Sec 4, Keelung Rd, Taipei 106, Taiwan (China)

    2015-03-01

    Highlights: • Bisphenol-F based boron-phenolic resins (B-BPF) with B−O bonds were synthesized. • The modified silicon nitride (m-SiN) was well dispersed and adhered in the B-BPF. • B-BPF/m-SiN composites have good thermal resistance and mechanical properties. • The grinding wheels bound by B-BPF/m-SiN have excellent grinding quality. - Abstract: In this study, phenolic resins based on bisphenol-F (BPF) were synthesized. Besides, ammonium borate was added in the synthesis process of BPF to form the bisphenol-F based boron-phenolic resins (B-BPF). The glass transition temperature, thermal resistance, flexural strength and hardness of B-BPF are respectively higher than those of BPF. This is due to the presence of new cross-link B−O bonds in the B-BPF. In addition, the 3-aminopropyltriethoxysilane modified silicon nitride powders (m-SiN) were fully mixed with B-BPF to form the B-BPF/m-SiN composites. The thermal resistance and mechanical properties of the B-BPF/m-SiN are promoted by the well-dispersed and well-adhered m-SiN in these novel polymer/ceramics composites. The results of grinding experiments indicate that the grinding wheels bound by the B-BPF/m-SiN have better grinding quality than those bound by the BPF. Thus the B-BPF/m-SiN composites are better binding media than the BPF resins.

  12. Preparation and properties of bisphenol-F based boron-phenolic resin/modified silicon nitride composites and their usage as binders for grinding wheels

    International Nuclear Information System (INIS)

    Highlights: • Bisphenol-F based boron-phenolic resins (B-BPF) with B−O bonds were synthesized. • The modified silicon nitride (m-SiN) was well dispersed and adhered in the B-BPF. • B-BPF/m-SiN composites have good thermal resistance and mechanical properties. • The grinding wheels bound by B-BPF/m-SiN have excellent grinding quality. - Abstract: In this study, phenolic resins based on bisphenol-F (BPF) were synthesized. Besides, ammonium borate was added in the synthesis process of BPF to form the bisphenol-F based boron-phenolic resins (B-BPF). The glass transition temperature, thermal resistance, flexural strength and hardness of B-BPF are respectively higher than those of BPF. This is due to the presence of new cross-link B−O bonds in the B-BPF. In addition, the 3-aminopropyltriethoxysilane modified silicon nitride powders (m-SiN) were fully mixed with B-BPF to form the B-BPF/m-SiN composites. The thermal resistance and mechanical properties of the B-BPF/m-SiN are promoted by the well-dispersed and well-adhered m-SiN in these novel polymer/ceramics composites. The results of grinding experiments indicate that the grinding wheels bound by the B-BPF/m-SiN have better grinding quality than those bound by the BPF. Thus the B-BPF/m-SiN composites are better binding media than the BPF resins

  13. Formation of Silicon-Gold Eutectic Bond Using Localized Heating Method

    Science.gov (United States)

    Lin, Liwei; Cheng, Yu-Ting; Najafi, Khalil

    1998-11-01

    A new bonding technique is proposed by using localized heating to supplythe bonding energy.Heating is achieved by applying a dc current through micromachined heaters made of gold which serves as both the heating and bonding material.At the interface of silicon and gold, the formation of eutectic bond takes place in about 5 minutes.Assembly of two substrates in microfabrication processescan be achieved by using this method.In this paper the following important results are obtained:1) Gold diffuses into silicon to form a strong eutectic bond by means of localized heating.2) The bonding strength reaches the fracture toughness of the bulk silicon.3) This bonding technique greatly simplifies device fabrication andassembly processes.

  14. Far IR Transmission Characteristics of Silicon Nitride Films using Fourier Transform Spectroscopy

    Science.gov (United States)

    Ferrusca, D.; Castillo-Domínguez, E.; Velázquez, M.; Hughes, D.; Serrano, A.; Torres-Jácome, A.

    2009-12-01

    We are fabricating amorphous Silicon (a-Si) bolometers doped with boron with a measured NEP˜1.5×10-16 W/Hz1/2 suitable for use in millimeter and sub-millimeter astronomy. In this paper we present the preliminary results of the absorber optimization for the a-Si bolometers. A film of Silicon Nitride (SiN), deposited by LPCVD (Low Pressure Chemical Vapor Deposition) process at INAOE, with or without metallic coating is used as a weak thermal link to the heat sink as well as an absorber. We have measured the transmission spectrum of thin films of SiN in the range of 200 to 1000 GHz using Fourier Transform Spectroscopy (FTS) and a bolometric system with a NEP˜1.26×10-13. The transmission of thin films of SiN with a thickness of 0.4 μn has been measured at temperatures of 290 K and 4 K. The uncoated SiN films have a transmission of 80% and we expect a 50% transmission for the metallic (e.g. Titanium) coated films.

  15. Remote plasma-enhanced chemical vapour deposition of silicon nitride at atmospheric pressure

    International Nuclear Information System (INIS)

    Silicon nitride films were deposited using an atmospheric pressure plasma source. The discharge was produced by flowing nitrogen and helium through two perforated metal electrodes that were driven by 13.56 MHz radio frequency power. Deposition occurred by mixing the plasma effluent with silane and directing the flow onto a rotating silicon wafer heated to between 100 deg. C and 500 deg. C. Film growth rates ranged from 90±10 to 1300±130 A min-1. Varying the N2/SiH4 feed ratio from 55.0 to 5.5 caused the film stoichiometry to shift from SiN1.45 to SiN1.2. Minimum impurity concentrations of 0.04% carbon, 3.6% oxygen and 13.6% hydrogen were achieved at 500 deg. C, and an N2/SiH4 feed ratio of 22.0. The growth rate increased with increasing silane and nitrogen partial pressures, but was invariant with respect to substrate temperature and rotational speed. The deposition rate also decreased sharply with distance from the plasma. These results combined with emission spectra taken of the afterglow suggest that gas-phase reactions between nitrogen atoms and silane play an important role in this process

  16. Low-temperature silicon nitride for thin-film electronics on polyimide foil substrates

    Science.gov (United States)

    Gleskova, H.; Wagner, S.; Gašparík, V.; Kováč, P.

    2001-05-01

    We optimized silicon nitride (SiN x) layers, deposited by 13.56 MHz plasma enhanced chemical vapor deposition (PECVD) at 150°C, to provide a high quality gate dielectric layer for the amorphous silicon thin film technology on polyimide foils. The layers were deposited from mixtures of silane, ammonia, and hydrogen. We varied the H 2 flow rate from 55 to 220 sccm and the rf power from 5 to 50 W, while the pressure was kept at 500 mTorr and the ratio of ammonia to silane flow at 10:1. The best film was obtained from the gas composition of SiH 4:NH 3:H 2=1:10:44 and the rf power of ˜20 W. This film grows at the rate of 1.5 Å/s, has a refractive index n=1.80, a dielectric constant ɛ=7.46, a dielectric breakdown field >3.4 MV/cm, a Si/N ratio of ˜0.67, and a hydrogen content of ˜2×10 22 cm -3, and etches in 10:1 buffered HF at a rate of 61 Å/s.

  17. Investigation of isochronal annealing on the optical properties of HWCVD amorphous silicon nitride deposited at low temperatures and low gas flow rates

    Science.gov (United States)

    Muller, T. F. G.; Jacobs, S.; Cummings, F. R.; Oliphant, C. J.; Malgas, G. F.; Arendse, C. J.

    2015-06-01

    Hydrogenated amorphous silicon nitride (a-SiNx:H) is used as anti-reflection coatings in commercial solar cells. A final firing step in the production of micro-crystalline silicon solar cells allows hydrogen effusion from the a-SiNx:H into the solar cell, and contributes to bulk passivation of the grain boundaries. In this study a-SiNx:H deposited in a hot-wire chemical vapour deposition (HWCVD) chamber with reduced gas flow rates and filament temperature compared to traditional deposition regimes, were annealed isochronally. The UV-visible reflection spectra of the annealed material were subjected to the Bruggeman Effective Medium Approximation (BEMA) treatment, in which a theoretical amorphous semiconductor was combined with particle inclusions due to the structural complexities of the material. The extraction of the optical functions and ensuing Wemple-DeDomenici analysis of the wavelength-dependent refractive index allowed for the correlation of the macroscopic optical properties with the changes in the local atomic bonding configuration, involving silicon, nitrogen and hydrogen.

  18. The effect of pressureless densification on mechanical and tribological properties of fine-grained silicon nitride ceramics

    International Nuclear Information System (INIS)

    The paper presents a new economic method of silicon nitride ceramic preparation for high wear resistant applications as sealing valves or the brake pad lining. The excellent mechanical properties and wear resistance of the resultant ceramic were improved by reduction of silicon nitride grain size to the one-two micrometer level as a result of mechanochemical processing and special procedure of compact densification. All experiments were conducted on specimens prepared from α-Si3N4-AlN-Y2O3 powders with application of mechanochemical processing (MCP). The chosen specimens were tested for hardness, elastic modulus, bending strength and wear resistance. The results showed mechanical properties in the range of hot-pressed ceramics and superior wear resistance due to micrometer-sized β-Si3N4 grains.

  19. Effect of Grinding and Polishing on the Residual Stress and Bending Strength of a Silicon Nitride Ceramic

    Institute of Scientific and Technical Information of China (English)

    GAO Ling; YANG Haitao; DU Daming; ZHAO Shikun; LI Huaping; YUAN Runzhang

    2005-01-01

    The residual stresses on the surface of the differently ground and polished silicon nitride ceramics were measured using X-ray diffraction and identified by SEM.The effect of the residual stress on the bending strength was investigated.The investigations show that the grinding process can introduce subatantial tensile residual stresses up to 290MPa on the surface of silicon nitride ceramics,which has a significant effect on reducing the bending strength of the ceramics after grinding.Thus,in comparison with the ceramics with a rough surface,the ceramics with a mirror image surface may have a lower strength.Polishing can smooth the residual stresses.When we evaluate the quality of the ceramic components after grinding,we must take residual stress into consideration. The grinding methods and grinding conditions must be carefully selected in order to get the favorite residual stress as well as the surface smoothness.

  20. The unexpected non-monotonic inter-layer bonding dependence of the thermal conductivity of bilayered boron nitride

    Science.gov (United States)

    Gao, Yufei; Zhang, Xiaoliang; Jing, Yuhang; Hu, Ming

    2015-04-01

    Hexagonal boron nitride (BN) and its bilayer form are very fascinating two-dimensional materials that have attracted tremendous interest recently. Their realistic applications in emerging nanoelectronics usually quest for manipulating the thermal transport properties in a precise manner. Using nonequilibrium molecular dynamics simulations, we herein studied the effect of inter-layer covalent bonding on the thermal conductivity of bilayered BN. We found that the in-plane thermal conductivity of bilayered BN, which can be largely tuned by introducing covalent bonding between the two BN layers, depends not only on the inter-layer bonding density, but also on the detailed topological configuration of the inter-layer bonds. For randomly distributed inter-layer bonding the thermal conductivity of bilayered BN decreases monotonically with inter-layer bonding density, the same behavior already found for bilayered graphene. However, for regularly arranged inter-layer bonding the thermal conductivity of bilayered BN surprisingly possesses a non-monotonic dependence on the inter-layer bonding density. This non-intuitive non-monotonic dependence is further explained by performing spectral energy density analysis, where the peak and valley values of the thermal conductivity are governed by different mechanisms. These results suggest the application of inter-layer covalent bonding in designing nanoscale devices with precisely tunable thermal conductivities.

  1. Electronic properties of interfaces produced by silicon wafer hydrophilic bonding

    Energy Technology Data Exchange (ETDEWEB)

    Trushin, Maxim

    2011-07-15

    The thesis presents the results of the investigations of electronic properties and defect states of dislocation networks (DNs) in silicon produced by wafers direct bonding technique. A new insight into the understanding of their very attractive properties was succeeded due to the usage of a new, recently developed silicon wafer direct bonding technique, allowing to create regular dislocation networks with predefined dislocation types and densities. Samples for the investigations were prepared by hydrophilic bonding of p-type Si (100) wafers with same small misorientation tilt angle ({proportional_to}0.5 ), but with four different twist misorientation angles Atw (being of < , 3 , 6 and 30 , respectively), thus giving rise to the different DN microstructure on every particular sample. The main experimental approach of this work was the measurements of current and capacitance of Schottky diodes prepared on the samples which contained the dislocation network at a depth that allowed one to realize all capabilities of different methods of space charge region spectroscopy (such as CV/IV, DLTS, ITS, etc.). The key tasks for the investigations were specified as the exploration of the DN-related gap states, their variations with gradually increasing twist angle Atw, investigation of the electrical field impact on the carrier emission from the dislocation-related states, as well as the establishing of the correlation between the electrical (DLTS), optical (photoluminescence PL) and structural (TEM) properties of DNs. The most important conclusions drawn from the experimental investigations and theoretical calculations can be formulated as follows: - DLTS measurements have revealed a great difference in the electronic structure of small-angle (SA) and large-angle (LA) bonded interfaces: dominating shallow level and a set of 6-7 deep levels were found in SA-samples with Atw of 1 and 3 , whereas the prevalent deep levels - in LA-samples with Atw of 6 and 30 . The critical twist

  2. Void formation at silicon nitride/silicon interfaces studied by variable-energy positrons

    Energy Technology Data Exchange (ETDEWEB)

    Halec, A.; Schultz, P.J. [University of Western Ontario, London, ON (Canada). Dept. of Physics; Boudreau, M.; Boumerzoug, M.; Mascher, P. [McMaster Univ., Hamilton, ON (Canada). Dept. of Engineering Physics; McCaffrey, J.P.; Jackman, T.E. [National Research Council of Canada, Ottawa, ON (Canada)

    1994-12-31

    Variable-energy positrons (VEP) were used to study the depth distribution of defects in SiN {sub x}/Si structures fabricated using ditertiary butyl silane (CONSI 4000) as the silicon precursor in an electron cyclotron resonance plasma chemical vapour deposition system. Films were grown to thicknesses ranging from 500 to 3500 A at substrate temperatures between room temperature and 400{sup o}C and under various plasma conditions. The VEP results give evidence for differing concentrations of very large open-volume defects at several of the SiN {sub x}/Si interfaces, confirmed by transmission and scanning electron microscopy. Their presence was correlated with non-reactive organosilicon adsorption on the substrates prior to the thin film deposition. (author).

  3. A high-Tc superconductor bolometer on a silicon nitridemembrane

    OpenAIRE

    Sanchez, S.; Elwenspoek, M.C.; Gui, C; Nivelle, de, M.J.M.E.; De, Vries; Korte, de, N.; Bruijn, M.P.; Schwierzi, B.

    1997-01-01

    In this paper we describe the design, fabrication and performance of a high-Tc GdBa2Cu3O7-δ superconductor bolometer positioned on a 2×2 mm2, 1 μm thick silicon nitride membrane. The bolometer structure has an effective area of 0.64 mm2 and was grown on a specially developed silicon-on-nitride layer. This layer was made by direct bonding of silicon nitride to silicon after chemical mechanical polishing. The operation temperature of the bolometer is 85 K. A thermal conductance G=3.3·10-5 W/K w...

  4. Development of an aluminum nitride-silicon carbide material set for high-temperature sensor applications

    Science.gov (United States)

    Griffin, Benjamin A.; Habermehl, Scott D.; Clews, Peggy J.

    2014-06-01

    A number of important energy and defense-related applications would benefit from sensors capable of withstanding extreme temperatures (>300°C). Examples include sensors for automobile engines, gas turbines, nuclear and coal power plants, and petroleum and geothermal well drilling. Military applications, such as hypersonic flight research, would also benefit from sensors capable of 1000°C. Silicon carbide (SiC) has long been recognized as a promising material for harsh environment sensors and electronics because it has the highest mechanical strength of semiconductors with the exception of diamond and its upper temperature limit exceeds 2500°C, where it sublimates rather than melts. Yet today, many advanced SiC MEMS are limited to lower temperatures because they are made from SiC films deposited on silicon wafers. Other limitations arise from sensor transduction by measuring changes in capacitance or resistance, which require biasing or modulation schemes that can with- stand elevated temperatures. We are circumventing these issues by developing sensing structures directly on SiC wafers using SiC and piezoelectric aluminum nitride (AlN) thin films. SiC and AlN are a promising material combination due to their high thermal, electrical, and mechanical strength and closely matched coefficients of thermal expansion. AlN is also a non-ferroelectric piezoelectric material, enabling piezoelectric transduction at temperatures exceeding 1000°C. In this paper, the challenges of incorporating these two materials into a compatible MEMS fabrication process are presented. The current progress and initial measurements of the fabrication process are shown. The future direction and the need for further investigation of the material set are addressed.

  5. Preservation of atomically clean silicon surfaces in air by contact bonding

    DEFF Research Database (Denmark)

    Grey, Francois; Ljungberg, Karin

    1997-01-01

    When two hydrogen-passivated silicon surfaces are placed in contact under cleanroom conditions, a weak bond is formed. Cleaving this bond under ultrahigh vacuum (UHV) conditions, and observing the surfaces with low energy electron diffraction and scanning tunneling microscopy, we find that the or......When two hydrogen-passivated silicon surfaces are placed in contact under cleanroom conditions, a weak bond is formed. Cleaving this bond under ultrahigh vacuum (UHV) conditions, and observing the surfaces with low energy electron diffraction and scanning tunneling microscopy, we find...... that the ordered atomic structure of the surfaces is protected from oxidation, even after the bonded samples have been in air for weeks. Further, we show that silicon surfaces that have been cleaned and hydrogen-passivated in UHV can be contacted in UHV in a similarly hermetic fashion, protecting the surface...

  6. Performance of GaN-on-Si-based vertical light-emitting diodes using silicon nitride electrodes with conducting filaments: correlation between filament density and device reliability.

    Science.gov (United States)

    Kim, Kyeong Heon; Kim, Su Jin; Lee, Tae Ho; Lee, Byeong Ryong; Kim, Tae Geun

    2016-08-01

    Transparent conductive electrodes with good conductivity and optical transmittance are an essential element for highly efficient light-emitting diodes. However, conventional indium tin oxide and its alternative transparent conductive electrodes have some trouble with a trade-off between electrical conductivity and optical transmittance, thus limiting their practical applications. Here, we present silicon nitride transparent conductive electrodes with conducting filaments embedded using the electrical breakdown process and investigate the dependence of the conducting filament density formed in the transparent conductive electrode on the device performance of gallium nitride-based vertical light-emitting diodes. Three gallium nitride-on-silicon-based vertical light-emitting diodes using silicon nitride transparent conductive electrodes with high, medium, and low conducting filament densities were prepared with a reference vertical light-emitting diode using metal electrodes. This was carried to determine the optimal density of the conducting filaments in the proposed silicon nitride transparent conductive electrodes. In comparison, the vertical light-emitting diodes with a medium conducting filament density exhibited the lowest optical loss, direct ohmic behavior, and the best current injection and distribution over the entire n-type gallium nitride surface, leading to highly reliable light-emitting diode performance.

  7. Performance of GaN-on-Si-based vertical light-emitting diodes using silicon nitride electrodes with conducting filaments: correlation between filament density and device reliability.

    Science.gov (United States)

    Kim, Kyeong Heon; Kim, Su Jin; Lee, Tae Ho; Lee, Byeong Ryong; Kim, Tae Geun

    2016-08-01

    Transparent conductive electrodes with good conductivity and optical transmittance are an essential element for highly efficient light-emitting diodes. However, conventional indium tin oxide and its alternative transparent conductive electrodes have some trouble with a trade-off between electrical conductivity and optical transmittance, thus limiting their practical applications. Here, we present silicon nitride transparent conductive electrodes with conducting filaments embedded using the electrical breakdown process and investigate the dependence of the conducting filament density formed in the transparent conductive electrode on the device performance of gallium nitride-based vertical light-emitting diodes. Three gallium nitride-on-silicon-based vertical light-emitting diodes using silicon nitride transparent conductive electrodes with high, medium, and low conducting filament densities were prepared with a reference vertical light-emitting diode using metal electrodes. This was carried to determine the optimal density of the conducting filaments in the proposed silicon nitride transparent conductive electrodes. In comparison, the vertical light-emitting diodes with a medium conducting filament density exhibited the lowest optical loss, direct ohmic behavior, and the best current injection and distribution over the entire n-type gallium nitride surface, leading to highly reliable light-emitting diode performance. PMID:27505739

  8. Surface toughness of silicon nitride bioceramics: II, Comparison with commercial oxide materials.

    Science.gov (United States)

    McEntire, Bryan J; Enomoto, Yuto; Zhu, Wenliang; Boffelli, Marco; Marin, Elia; Pezzotti, Giuseppe

    2016-02-01

    Raman microprobe-assisted indentation, a micromechanics method validated in a companion paper, was used to compare the surface toughening behaviors of silicon nitride (Si3N4) and alumina-based bioceramics employed in joint arthroplasty (i.e., monolithic alumina, Al2O3, and yttria-stabilized zirconia (ZrO2)-toughened alumina, ZTA). Quantitative assessments of microscopic stress fields both ahead and behind the tip of Vickers indentation cracks propagated under increasing indentation loads were systematically made using a Raman microprobe with spatial resolution on the order of a single micrometer. Concurrently, crack opening displacement (COD) profiles were monitored on the same microcracks screened by Raman spectroscopy. The Raman eye clearly visualized different mechanisms operative in toughening Si3N4 and ZTA bioceramics (i.e., crack-face bridging and ZrO2 polymorphic transformation, respectively) as compared to the brittle behavior of monolithic Al2O3. Moreover, emphasis was placed on assessing not only the effectiveness but also the durability of such toughening effects when the biomaterials were aged in a hydrothermal environment. A significant degree of embrittlement at the biomaterial surface was recorded in the transformation-toughened ZTA, with the surface toughness reduced by exposure to the hydrothermal environment. Conversely, the Si3N4 biomaterial experienced a surface toughness value independent of hydrothermal attack. Crack-face bridging thus appears to be a durable surface toughening mechanism for biomaterials in joint arthroplasty. PMID:26437609

  9. Multi-element characterization of silicon nitride powders by instrumental and radiochemical neutron activation analysis

    Energy Technology Data Exchange (ETDEWEB)

    Franek, M.; Krivan, V. (Ulm Univ. (Germany). Sektion Analytik und Hoechstreinigung)

    1992-07-15

    An optimized instrumental neutron activation analysis method was applied to the comprehensive trace characterization of good- and high- purity silicon nitride powders of different origins. Experimental modes are given for 55 elements leading to limits of detection below 1 ng g[sup -] [sup 1] for 28 elements, between 1 and 100 ng g[sup -1] for 19 elements and higher than 100 ng g[sup -1] for 8 elements. For the removal of the radionuclides [sup 140]La, [sup 182]Ta and [sup 187]W, which cause the major activity in certain types of materials, radiochemical procedures based in cation exchange from 2 M HCl and anion exchange from 2 M HF were developed. [sup 64]Cu was selectively extracted with dithizone from 10 M HF for counting the 511-keV line. By radiochemical neutron activation analysis, the limits of detection were improved by up to three orders of magnitude. Comparison with results obtained by inductively coupled plasma (ICP) atomic emission spectrometry and ICP mass spectrometry shows satisfactory agreement and demonstrates the advantages of neutron activation analysis especially when low elements contents are to be determined. (author). 30 refs.; 2 figs.; 6 tabs.

  10. Temperature sensitivity of silicon nitride nanocoated long-period gratings working in various surrounding media

    Science.gov (United States)

    Smietana, M.; Bock, W. J.; Mikulic, P.

    2011-11-01

    This paper presents the temperature sensing properties of a silicon nitride (SiNx) nanocoated long-period grating (LPG). A high-temperature, radio-frequency plasma-enhanced chemical-vapor-deposited SiNx nanocoating was applied to tune the external refractive index (RI) sensitivity of LPGs written with UV and electric arc techniques in boron co-doped and standard germanium doped fibers, respectively. The technique allows for deposition of good quality, hard and wear-resistant nanofilms as are required for optical sensors. Thanks to the high-RI SiNx nanocoating, which is less than 90 nm thick, it is possible to reduce RI sensitivity over a wide range (from nD = 1.333 to 1.479), simultaneously decreasing its cross-sensitivity to temperature. For the presented nanocoated LPGs, the temperature effect on resonance wavelength is linear and slightly dependent on the thermo-optic coefficient of the surrounding liquid. The other advantage of the nanocoating is that it makes the resonance clearly visible in the whole investigated external RI range. To the best of our knowledge, this work presents for the first time a nanocoating able to simultaneously tune the RI sensitivity and enable temperature measurements in high-RI liquids applied to LPGs.

  11. Temperature sensitivity of silicon nitride nanocoated long-period gratings working in various surrounding media

    International Nuclear Information System (INIS)

    This paper presents the temperature sensing properties of a silicon nitride (SiNx) nanocoated long-period grating (LPG). A high-temperature, radio-frequency plasma-enhanced chemical-vapor-deposited SiNx nanocoating was applied to tune the external refractive index (RI) sensitivity of LPGs written with UV and electric arc techniques in boron co-doped and standard germanium doped fibers, respectively. The technique allows for deposition of good quality, hard and wear-resistant nanofilms as are required for optical sensors. Thanks to the high-RI SiNx nanocoating, which is less than 90 nm thick, it is possible to reduce RI sensitivity over a wide range (from nD = 1.333 to 1.479), simultaneously decreasing its cross-sensitivity to temperature. For the presented nanocoated LPGs, the temperature effect on resonance wavelength is linear and slightly dependent on the thermo-optic coefficient of the surrounding liquid. The other advantage of the nanocoating is that it makes the resonance clearly visible in the whole investigated external RI range. To the best of our knowledge, this work presents for the first time a nanocoating able to simultaneously tune the RI sensitivity and enable temperature measurements in high-RI liquids applied to LPGs

  12. High-Responsivity Graphene-Boron Nitride Photodetector and Autocorrelator in a Silicon Photonic Integrated Circuit

    CERN Document Server

    Shiue, Ren-Jye; Wang, Yifei; Peng, Cheng; Robertson, Alexander D; Efetov, Dimitri; Assefa, Solomon; Koppens, Frank H L; Hone, James; Englund, Dirk

    2015-01-01

    Graphene and other two-dimensional (2D) materials have emerged as promising materials for broadband and ultrafast photodetection and optical modulation. These optoelectronic capabilities can augment complementary metal-oxide-semiconductor (CMOS) devices for high-speed and low-power optical interconnects. Here, we demonstrate an on-chip ultrafast photodetector based on a two-dimensional heterostructure consisting of high-quality graphene encapsulated in hexagonal boron nitride. Coupled to the optical mode of a silicon waveguide, this 2D heterostructure-based photodetector exhibits a maximum responsivity of 0.36 A/W and high-speed operation with a 3 dB cut-off at 42 GHz. From photocurrent measurements as a function of the top-gate and source-drain voltages, we conclude that the photoresponse is consistent with hot electron mediated effects. At moderate peak powers above 50 mW, we observe a saturating photocurrent consistent with the mechanisms of electron-phonon supercollision cooling. This nonlinear photorespo...

  13. Single Photon Counting UV Solar-Blind Detectors Using Silicon and III-Nitride Materials

    Directory of Open Access Journals (Sweden)

    Shouleh Nikzad

    2016-06-01

    Full Text Available Ultraviolet (UV studies in astronomy, cosmology, planetary studies, biological and medical applications often require precision detection of faint objects and in many cases require photon-counting detection. We present an overview of two approaches for achieving photon counting in the UV. The first approach involves UV enhancement of photon-counting silicon detectors, including electron multiplying charge-coupled devices and avalanche photodiodes. The approach used here employs molecular beam epitaxy for delta doping and superlattice doping for surface passivation and high UV quantum efficiency. Additional UV enhancements include antireflection (AR and solar-blind UV bandpass coatings prepared by atomic layer deposition. Quantum efficiency (QE measurements show QE > 50% in the 100–300 nm range for detectors with simple AR coatings, and QE ≅ 80% at ~206 nm has been shown when more complex AR coatings are used. The second approach is based on avalanche photodiodes in III-nitride materials with high QE and intrinsic solar blindness.

  14. Dispersion engineered silicon nitride waveguides by geometrical and refractive-index optimization

    CERN Document Server

    Boggio, J M Chavez; Fremberg, T; Haynes, R; Roth, M M; Eisermann, R; Lisker, M; Zimmermann, L; Boehm, M

    2014-01-01

    Dispersion engineering in silicon nitride (SiX NY ) waveguides is investigated through the optimization of the waveguide transversal dimensions and refractive indices in a multi-cladding arrangement. Ultra-flat dispersion of -84.0 +/- 0.5 ps/nm/km between 1700 and 2440 nm and 1.5 +/- 3 ps/nm/km between 1670 and 2500 nm is numerically demonstrated. It is shown that typical refractive index fluctuations as well as dimension fluctuations during the fabrication of the SiX NY waveguides are a limitation for obtaining ultra-flat dispersion profiles. Single- and multi-cladding waveguides are fabricated and their dispersion profiles measured (over nearly 1000 nm) using a low-coherence frequency domain interferometric technique. By appropriate thickness optimization, the zero-dispersion wavelength is tuned over a large spectral range in both single-cladding waveguides and multi-cladding waveguides with small refractive index contrast (3 %). A flat dispersion profile with 3.2 ps/nm/km variation over 500 nm is obtained ...

  15. The stopping power and energy straggling of heavy ions in silicon nitride and polypropylene

    International Nuclear Information System (INIS)

    The stopping power and energy straggling of 12C3+ and 16O3+ ions with energies between 4.5 and 7.8 MeV in a 0.166-μm-thin silicon nitride and in 4-μm-thin polypropylene foils were measured by means of an indirect transmission method using a half-covered PIPS detector. Ions scattered from a thin gold layer under a scattering angle of 150° were used. The energy spectra of back-scattered and decelerated ions were registered and evaluated simultaneously. The measured stopping powers were compared with the theoretical predictions simulated by SRIM-2008 and MSTAR codes. SRIM prediction of energy stopping is reasonably close to the experimentally obtained values comparing to MSTAR values. Better agreement between experimental and predicted data was observed for C3+ ion energy losses comparing to O3+ ions. The experimental data from Paul’s database and our previous experimental data were also discussed. The obtained experimental energy-straggling data were compared to those calculated by using Bohr’s, Yang’s models etc. The predictions by Yang are in good agreement with our experiment within a frame of uncertainty of 25%

  16. Fabrication and secondary-phase crystallization of rare-earth disilicate-silicon nitride ceramics

    Energy Technology Data Exchange (ETDEWEB)

    Cinibulk, M.K.; Thomas, G. (Lawrence Berkeley Lab., CA (United States). Center for Advanced Materials); Johnson, S.M. (SRI International, Menlo Park, CA (United States). Materials Research Lab.)

    1992-08-01

    In this paper, the fabrication and intergranular-phase devitrification of silicon nitride densified with rare-earth (RE) oxide additives is investigated. The additions of the oxides of Sm, Gd, Dy, Er, and Yb, having high melting points and behaving similarly to Y[sub 2]O[sub 3], were compositionally controlled to tailor a microstructure with a crystalline secondary phase of RE[sub 2]Si[sub 2]O[sub 7]. The lanthanide oxides were found to be ass effective as Y[sub 2]O[sub 3] in densifying Si[sub 3]N[sub 4], resulting in identical microstructures and densities of 98-99% of theoretical density. The crystallization behavior of all six disilicates was similar, characterized by a limited nucleation and rapid growth mechanism resulting in large single crystals. Complete crystallization of the intergranular phase was obtained with the exception of a thin residual amorphous film which was observed at interfaces and believed to be rich in impurities, the cause of incomplete devitrification.

  17. Fuzzy sets predict flexural strength and density of silicon nitride ceramics

    Energy Technology Data Exchange (ETDEWEB)

    Cios, K.J.; Sztandera, L.M.; Baaklini, G.Y.; Vary, A.

    1993-05-01

    In this work, the authors utilize fuzzy sets theory to evaluate and make predictions of flexural strength and density of NASA 6Y silicon nitride ceramic. Processing variables of milling time, sintering time, and sintering nitrogen pressure are used as an input to the fuzzy system. Flexural strength and density are the output parameters of the system. Data from 273 Si3N4 modulus of rupture bars tested at room temperature and 135 bars tested at 1370 C are used in this study. Generalized mean operator and Hamming distance are utilized to build the fuzzy predictive model. The maximum test error for density does not exceed 3.3 percent, and for flexural strength 7.1 percent, as compared with the errors of 1.72 percent and 11.34 percent obtained by using neural networks, respectively. These results demonstrate that fuzzy sets theory can be incorporated into the process of designing materials, such as ceramics, especially for assessing more complex relationships between the processing variables and parameters, like strength, which are governed by randomness of manufacturing processes.

  18. Ultra-thin superconducting film coated silicon nitride nanowire resonators for low-temperature applications

    Science.gov (United States)

    Sebastian, Abhilash; Zhelev, Nikolay; de Alba, Roberto; Parpia, Jeevak

    We demonstrate fabrication of high stress silicon nitride nanowire resonators with a thickness and width of less than 50 nm intended to be used as probes for the study of superfluid 3He. The resonators are fabricated as doubly-clamped wires/beams using a combination of electron-beam lithography and wet/dry etching techniques. We demonstrate the ability to suspend (over a trench of depth ~8 µm) wires with a cross section as small as 30 nm, covered with a 20 nm superconducting film, and having lengths up to 50 µm. Room temperature resonance measurements were carried out by driving the devices using a piezo stage and detecting the motion using an optical interferometer. The results show that metalizing nano-mechanical resonators not only affects their resonant frequencies but significantly reduce their quality factor (Q). The devices are parametrically pumped by modulating the system at twice its fundamental resonant frequency, which results in observed amplification of the signal. The wires show self-oscillation with increasing modulation strength. The fabricated nanowire resonators are intended to be immersed in the superfluid 3He. By tracking the resonant frequency and the Q of the various modes of the wire versus temperature, we aim to probe the superfluid gap structure.

  19. Characteristics of laser assisted machining for silicon nitride ceramic according to machining parameters

    International Nuclear Information System (INIS)

    This paper describes the Laser Assisted Machining (LAM) that cuts and removes softened parts by locally heating the ceramic with laser. Silicon nitride ceramics can be machined with general machining tools as well, because YSiAlON, which was made up ceramics, is soften at about 1,000 .deg. C. In particular, the laser, which concentrates on highly dense energy, can locally heat materials and very effectively control the temperature of the heated part of specimen. Therefore, this paper intends to propose an efficient machining method of ceramic by deducing the machining governing factors of laser assisted machining and understanding its mechanism. While laser power is the machining factor that controls the temperature, the CBN cutting tool could cut the material more easily as the material gets deteriorated from the temperature increase by increasing the laser power, but excessive oxidation can negatively affect the quality of the material surface after machining. As the feed rate and cutting depth increase, the cutting force increases and tool lifespan decreases, but surface oxidation also decreases. In this experiment, the material can be cut to 3 mm of cutting depth. And based on the results of the experiment, the laser assisted machining mechanism is clarified

  20. A Monolithic Radiation-Pressure Driven, Low Phase Noise Silicon Nitride Opto-Mechanical Oscillator

    CERN Document Server

    Tallur, Siddharth; Bhave, Sunil A

    2011-01-01

    Cavity opto-mechanics enabled radiation pressure (RP) driven oscillators shown in the past offer an all optical Radio Frequency (RF) source without the need for external electrical feedback. However these oscillators require external tapered fiber or prism coupling and non-standard fabrication processes. In this work, we present a CMOS compatible fabrication process to design high optical quality factor opto-mechanical resonators in silicon nitride. The ring resonators designed in this process demonstrate low phase noise RP driven oscillations. Using integrated grating couplers and waveguide to couple light to the micro-resonator eliminates 1/f^3 and other higher order phase noise slopes at close-to-carrier frequencies present in previous demonstrations. We present an RP driven OMO operating at 41.97MHz with a signal power of -11dBm and phase noise of -85dBc/Hz at 1kHz offset with only 1/f^2 noise down to 10Hz offset from carrier.

  1. High-Responsivity Graphene-Boron Nitride Photodetector and Autocorrelator in a Silicon Photonic Integrated Circuit.

    Science.gov (United States)

    Shiue, Ren-Jye; Gao, Yuanda; Wang, Yifei; Peng, Cheng; Robertson, Alexander D; Efetov, Dmitri K; Assefa, Solomon; Koppens, Frank H L; Hone, James; Englund, Dirk

    2015-11-11

    Graphene and other two-dimensional (2D) materials have emerged as promising materials for broadband and ultrafast photodetection and optical modulation. These optoelectronic capabilities can augment complementary metal-oxide-semiconductor (CMOS) devices for high-speed and low-power optical interconnects. Here, we demonstrate an on-chip ultrafast photodetector based on a two-dimensional heterostructure consisting of high-quality graphene encapsulated in hexagonal boron nitride. Coupled to the optical mode of a silicon waveguide, this 2D heterostructure-based photodetector exhibits a maximum responsivity of 0.36 A/W and high-speed operation with a 3 dB cutoff at 42 GHz. From photocurrent measurements as a function of the top-gate and source-drain voltages, we conclude that the photoresponse is consistent with hot electron mediated effects. At moderate peak powers above 50 mW, we observe a saturating photocurrent consistent with the mechanisms of electron-phonon supercollision cooling. This nonlinear photoresponse enables optical on-chip autocorrelation measurements with picosecond-scale timing resolution and exceptionally low peak powers.

  2. Effect of cyclic loading on the creep performance of silicon nitride

    Energy Technology Data Exchange (ETDEWEB)

    Wereszczak, A.A.; Ferber, M.K.; Kirkland, T.P. [Oak Ridge National Lab., TN (United States). High Temperature Materials Lab.; Lin, C.K.J. [National Central Univ., Chung-Li (Taiwan, Province of China). Dept. of Mechanical Engineering

    1995-04-01

    Tension-tension cyclic fatigue tests (triangular waveform, {sigma}{sub max} = 100 MPa, R = 0.1) were conducted on hot isostatically pressed (HIPed) silicon nitride at frequencies spanning several orders of magnitude (5.6 {times} 10{sup {minus}6} to 0.1 Hz or 10{sup {minus}3} MPa/s to 18 MPa/s) at 1,370 C in air. The amount of cyclic creep strain was found to be a function of the frequency or stressing rate with greater strains to failure observed as the frequency or stressing rate decreased. The total strain was viewed as the sum of elastic, anelastic (or transient recoverable), and plastic (viscous or non-recoverable) strain contributions, after the empirical Pao and Marin model. The plastic strain was found to be the dominant component of the total creep and was unsatisfactorily represented by the Pao and Marin model. To circumvent this, a time exponent was introduced in the plastic strain term in the Pao and Marin model. This modification resulted in good correlation between model and experiment at the slower frequencies examined but over-predicted the cyclic creep strain at the faster frequencies. The utility of using the modified Pao and Marin model to predict cyclic creep response from static creep and strain relaxation tests is described.

  3. The stopping power and energy straggling of heavy ions in silicon nitride and polypropylene

    Energy Technology Data Exchange (ETDEWEB)

    Mikšová, R., E-mail: miksova@ujf.cas.cz [Nuclear Physics Institute of the Academy of Science of the Czech Republic v.v. i., 250 68 Rez (Czech Republic); Department of Physics, Faculty of Science, J. E. Purkinje University, Ceske Mladeze 8, 400 96 Usti nad Labem (Czech Republic); Hnatowicz, V. [Nuclear Physics Institute of the Academy of Science of the Czech Republic v.v. i., 250 68 Rez (Czech Republic); Macková, A.; Malinský, P. [Nuclear Physics Institute of the Academy of Science of the Czech Republic v.v. i., 250 68 Rez (Czech Republic); Department of Physics, Faculty of Science, J. E. Purkinje University, Ceske Mladeze 8, 400 96 Usti nad Labem (Czech Republic); Slepička, P. [Department of Solid State Engineering, Institute of Chemical Technology, 166 28 Prague (Czech Republic)

    2015-07-01

    The stopping power and energy straggling of {sup 12}C{sup 3+} and {sup 16}O{sup 3+} ions with energies between 4.5 and 7.8 MeV in a 0.166-μm-thin silicon nitride and in 4-μm-thin polypropylene foils were measured by means of an indirect transmission method using a half-covered PIPS detector. Ions scattered from a thin gold layer under a scattering angle of 150° were used. The energy spectra of back-scattered and decelerated ions were registered and evaluated simultaneously. The measured stopping powers were compared with the theoretical predictions simulated by SRIM-2008 and MSTAR codes. SRIM prediction of energy stopping is reasonably close to the experimentally obtained values comparing to MSTAR values. Better agreement between experimental and predicted data was observed for C{sup 3+} ion energy losses comparing to O{sup 3+} ions. The experimental data from Paul’s database and our previous experimental data were also discussed. The obtained experimental energy-straggling data were compared to those calculated by using Bohr’s, Yang’s models etc. The predictions by Yang are in good agreement with our experiment within a frame of uncertainty of 25%.

  4. Stress engineering with silicon nitride stressors for Ge-on-Si lasers

    CERN Document Server

    Ke, Jiaxin; Guangrui,; Xia,

    2016-01-01

    Side and top silicon nitride stressors were proposed and shown to be effective ways to reduce the threshold current Ith and improve the wall-plug efficiency {\\eta}wp of Ge-on-Si lasers. Side stressors only turned out to be a more efficient way to increase {\\eta}wp than using top and side stressors together. With the side stressors only and geometry optimizations, a {\\eta}wp of 30.5% and an Ith of 50 mA (Jth of 37 kA/cm2) can be achieved with the defect limited carrier lifetime of 1 nsec. With the defect limited carrier lifetime of 10 nsec, an Ith of 7.8 mA (Jth of 5.8 kA/cm2) and a wall-plug efficiency of 38.7% can be achieved. These are tremendous improvements from the case without any stressors. These results give strong support to the Ge-on-Si laser technology and provide an effective way to improve the Ge laser performance.

  5. Vertical coupling of laser glass microspheres to buried silicon nitride ellipses and waveguides

    Energy Technology Data Exchange (ETDEWEB)

    Navarro-Urrios, D., E-mail: daniel.navarrourrios@nano.cnr.it [NEST, Istituto Nanoscienze—CNR and Scuola Normale Superiore, Piazza San Silvestro 12, Pisa I-56127 (Italy); Ramírez, J. M.; Berencén, Y.; Garrido, B. [Departament d' Electrònica, Universitat de Barcelona, Barcelona 08028 (Spain); Capuj, N. E. [Depto. Física, Universidad de la Laguna, 38206, La Laguna (Spain); Tredicucci, A. [NEST, Istituto Nanoscienze and Dipartimento di Fisica, Università di Pisa, Largo Pontecorvo 3, Pisa I-56127 (Italy)

    2015-09-07

    We demonstrate the integration of Nd{sup 3+} doped barium-titanium-silicate microsphere lasers with a silicon nitride photonic platform. Devices with two different geometrical configurations for extracting the laser light to buried waveguides have been fabricated and characterized. The first configuration relies on a standard coupling scheme, where the microspheres are placed over strip waveguides. The second is based on a buried elliptical geometry whose working principle is that of an elliptical mirror. In the latter case, the input of a strip waveguide is placed on one focus of the ellipse, while a lasing microsphere is placed on top of the other focus. The fabricated elliptical geometry (ellipticity = 0.9) presents a light collecting capacity that is 50% greater than that of the standard waveguide coupling configuration and could be further improved by increasing the ellipticity. Moreover, since the dimensions of the spheres are much smaller than those of the ellipses, surface planarization is not required. On the contrary, we show that the absence of a planarization step strongly damages the microsphere lasing performance in the standard configuration.

  6. Two color DNA barcode detection in photoluminescence suppressed silicon nitride nanopores.

    Science.gov (United States)

    Assad, Ossama N; Di Fiori, Nicolas; Squires, Allison H; Meller, Amit

    2015-01-14

    Optical sensing of solid-state nanopores is a relatively new approach that can enable high-throughput, multicolor readout from a collection of nanopores. It is therefore highly attractive for applications such as nanopore-based DNA sequencing and genotyping using DNA barcodes. However, to date optical readout has been plagued by the need to achieve sufficiently high signal-to-noise ratio (SNR) for single fluorophore sensing, while still maintaining millisecond resolution. One of the main factors degrading the optical SNR in solid-state nanopores is the high photoluminescence (PL) background emanating from the silicon nitride (SiNx) membrane in which pores are commonly fabricated. Focusing on the optical properties of SiNx nanopores we show that the local membrane PL intensity is substantially reduced, and its spectrum is shifted toward shorter wavelengths with increasing e-beam dose. This phenomenon, which is correlated with a marked photocurrent enhancement in these nanopores, is utilized to perform for the first time single molecule fluorescence detection using both green and red laser excitations. Specifically, the reduction in PL and the concurrent measurement of the nanopore photocurrent enhancement allow us to maximize the background suppression and to detect a dual color, five-unit DNA barcode with high SNR levels. PMID:25522780

  7. Atomic Layer Deposition of Silicon Nitride from Bis(tert-butylamino)silane and N2 Plasma.

    Science.gov (United States)

    Knoops, Harm C M; Braeken, Eline M J; de Peuter, Koen; Potts, Stephen E; Haukka, Suvi; Pore, Viljami; Kessels, Wilhelmus M M

    2015-09-01

    Atomic layer deposition (ALD) of silicon nitride (SiNx) is deemed essential for a variety of applications in nanoelectronics, such as gate spacer layers in transistors. In this work an ALD process using bis(tert-butylamino)silane (BTBAS) and N2 plasma was developed and studied. The process exhibited a wide temperature window starting from room temperature up to 500 °C. The material properties and wet-etch rates were investigated as a function of plasma exposure time, plasma pressure, and substrate table temperature. Table temperatures of 300-500 °C yielded a high material quality and a composition close to Si3N4 was obtained at 500 °C (N/Si=1.4±0.1, mass density=2.9±0.1 g/cm3, refractive index=1.96±0.03). Low wet-etch rates of ∼1 nm/min were obtained for films deposited at table temperatures of 400 °C and higher, similar to that achieved in the literature using low-pressure chemical vapor deposition of SiNx at >700 °C. For novel applications requiring significantly lower temperatures, the temperature window from room temperature to 200 °C can be a solution, where relatively high material quality was obtained when operating at low plasma pressures or long plasma exposure times.

  8. Evaluation of Bonding Orbitals in Amorphous Silicon by Means of the Chemical Pseudopotential Method

    OpenAIRE

    Grado Caffaro, M. A.; Grado Caffaro, M.

    1994-01-01

    The chemical pseudopotential method has been used by a number of workers in order to study the valence bands of amorphous tetrahedrally bonded semiconductors. However, various problems related to this method are unsolved. In this paper, a theoretical formulation tending to clarify some of these. problems is presented. This formulation concerns bonding orbitals and is valid, in principle, for amorphous silicon.

  9. The fabrication of all-silicon micro gas chromatography columns using gold diffusion eutectic bonding

    Science.gov (United States)

    Radadia, A. D.; Salehi-Khojin, A.; Masel, R. I.; Shannon, M. A.

    2010-01-01

    Temperature programming of gas chromatography (GC) separation columns accelerates the elution rate of chemical species through the column, increasing the speed of analysis, and hence making it a favorable technique to speedup separations in microfabricated GCs (micro-GC). Temperature-programmed separations would be preferred in an all-silicon micro-column compared to a silicon-Pyrex® micro-column given that the thermal conductivity and diffusivity of silicon is 2 orders of magnitude higher than Pyrex®. This paper demonstrates how to fabricate all-silicon micro-columns that can withstand the temperature cycling required for temperature-programmed separations. The columns were sealed using a novel bonding process where they were first bonded using a gold eutectic bond, then annealed at 1100 °C to allow gold diffusion into silicon and form what we call a gold diffusion eutectic bond. The gold diffusion eutectic-bonded micro-columns when examined using scanning electron microscopy (SEM), scanning acoustic microscopy (SAM) and blade insertion techniques showed bonding strength comparable to the previously reported anodic-bonded columns. Gas chromatography-based methane injections were also used as a novel way to investigate proper sealing between channels. A unique methane elution peak at various carrier gas inlet pressures demonstrated the suitability of gold diffusion eutectic-bonded channels as micro-GC columns. The application of gold diffusion eutectic-bonded all-silicon micro-columns to temperature-programmed separations (120 °C min-1) was demonstrated with the near-baseline separation of n-C6 to n-C12 alkanes in 35 s.

  10. The fabrication of all-silicon micro gas chromatography columns using gold diffusion eutectic bonding

    International Nuclear Information System (INIS)

    Temperature programming of gas chromatography (GC) separation columns accelerates the elution rate of chemical species through the column, increasing the speed of analysis, and hence making it a favorable technique to speedup separations in microfabricated GCs (micro-GC). Temperature-programmed separations would be preferred in an all-silicon micro-column compared to a silicon-Pyrex® micro-column given that the thermal conductivity and diffusivity of silicon is 2 orders of magnitude higher than Pyrex®. This paper demonstrates how to fabricate all-silicon micro-columns that can withstand the temperature cycling required for temperature-programmed separations. The columns were sealed using a novel bonding process where they were first bonded using a gold eutectic bond, then annealed at 1100 °C to allow gold diffusion into silicon and form what we call a gold diffusion eutectic bond. The gold diffusion eutectic-bonded micro-columns when examined using scanning electron microscopy (SEM), scanning acoustic microscopy (SAM) and blade insertion techniques showed bonding strength comparable to the previously reported anodic-bonded columns. Gas chromatography-based methane injections were also used as a novel way to investigate proper sealing between channels. A unique methane elution peak at various carrier gas inlet pressures demonstrated the suitability of gold diffusion eutectic-bonded channels as micro-GC columns. The application of gold diffusion eutectic-bonded all-silicon micro-columns to temperature-programmed separations (120 °C min−1) was demonstrated with the near-baseline separation of n-C6 to n-C12 alkanes in 35 s

  11. Preparation of β-Sialon/ZrN bonded corundum composites from zircon by nitridation reaction sintering process

    Institute of Scientific and Technical Information of China (English)

    MA Bei-yue; YU Jing-kun; LIU Tao; YAN Zheng-guo

    2009-01-01

    β-Sialon/ZrN bonded corundum composites were synthesized using fused white corundum, alumina micro powder, zircon and carbon black by nitridation reaction sintering process. Phase composition and microstructure of the synthesized composites were investigated by X-ray powder diffraction and scanning electronic microscope, and the formation process of the composites was discussed. The results show that the composites with different compositions can be obtained by controlling the heating temperature and contents of zircon and carbon black. The proper temperature to synthesize the composites is 1 773 K.

  12. Bonding distances as Exact Sums of the Radii of the Constituent Atoms in Nanomaterials - Boron Nitride and Coronene

    CERN Document Server

    Heyrovska, Raji

    2010-01-01

    This paper presents for the first time the exact structures at the atomic level of two important nanomaterials, boron nitride and coronene. Both these compounds are hexagonal layer structures similar to graphene in two dimensions and to graphite in three-dimensions. However, they have very different properties: whereas graphene is a conductor, h-BN is an electrical insulator and coronene is a polycyclic aromatic hydrocarbon of cosmological interest. The atomic structures presented here are based on bond lengths as the sums of the atomic radii.

  13. Efficient continuous-wave nonlinear frequency conversion in high-Q Gallium Nitride photonic crystal cavities on Silicon

    CERN Document Server

    Mohamed, Mohamed Sabry; Carlin, Jean-François; Minkov, Momchil; Gerace, Dario; Savona, Vincenzo; Grandjean, Nicolas; Galli, Matteo; Houdré, Romuald

    2016-01-01

    We report on nonlinear frequency conversion from the telecom range via second harmonic generation (SHG) and third harmonic generation (THG) in suspended gallium nitride slab photonic crystal (PhC) cavities on silicon, under continuous-wave resonant excitation. Optimized two-dimensional PhC cavities with augmented far-field coupling have been characterized with quality factors as high as 4.4$\\times10^{4}$, approaching the computed theoretical values. The strong enhancement in light confinement has enabled efficient SHG, achieving normalized conversion efficiency of 2.4$\\times10^{-3}$ $W^{-1}$, as well as simultaneous THG. SHG emission power of up to 0.74 nW has been detected without saturation. The results herein validate the suitability of gallium nitride for integrated nonlinear optical processing.

  14. Electrical properties of laser-bonded Silicon-On-Diamond samples

    Energy Technology Data Exchange (ETDEWEB)

    Sciortino, S., E-mail: silvio.sciortino@gmail.com [National Institute for Nuclear Physics, INFN, Florence (Italy); Department of Physics and Astronomy, University of Florence (Italy); Brandi, F.; Carzino, R. [Nanophysics, Istituto Italiano di Tecnologia, Genova (Italy); Citroni, M. [European Laboratory for Non-Linear Spectroscopy, LENS, Florence (Italy); De Sio, A. [Department of Physics and Astronomy, University of Florence (Italy); Fanetti, S. [European Laboratory for Non-Linear Spectroscopy, LENS, Florence (Italy); Lagomarsino, S. [National Institute for Nuclear Physics, INFN, Florence (Italy); Department of Physics and Astronomy, University of Florence (Italy); Pace, E. [Department of Physics and Astronomy, University of Florence (Italy); Parrini, G. [National Institute for Nuclear Physics, INFN, Florence (Italy); Department of Physics and Astronomy, University of Florence (Italy); Passeri, D.; Scorzoni, A.; Servoli, L. [Dipartimento di Ingegneria Elettronica e della Informazione and INFN Sez. Perugia, Perugia (Italy); Tozzetti, L. [Department of Physics and Astronomy, University of Florence (Italy)

    2013-12-01

    In this work we report preliminary tests aimed at the implementation of a Silicon-On-Diamond (SOD) radiation sensor. SOD materials have been prepared by continuously scanning a 20 ps pulsed 355 nm laser beam on the silicon–diamond interface. A pixel monolithic sensor has also been bonded to diamond with the same technique and tested to show that a complex electronic chip can undergo the process without any damage. Through silicon vias have been fabricated by laser drilling on the silicon side of the SOD samples and their insulation from the silicon bulk has been tested. The charge collection efficiency of a diamond sensor with laser-written graphitic contacts has been measured, to demonstrate a reliable and simple way to fabricate ohmic contacts on the diamond side of the SOD devices. Finally, a SOD material with electric contacts on the silicon and on the diamond sides has been tested as a particle sensor to demonstrate the electrical continuity of the silicon–diamond interface after the bonding. -- Highlights: •The steps necessary to fabricate a monolithic Silicon-On-Diamond detector have been carried out. •These steps involve the bonding, by a laser technique, of an electronic chip on diamond without damage, the growth of insulated Through Silicon Vias in silicon, the fabrication of ohmic contacts by laser graphitization. •In conclusion: the feasibility of a SOD detector with the readout silicon electronics bonded to the diamond sensitive volume has been demonstrated. •Graphitic contacts compare favorably with standard metallic ones. •Charge is collected by a SOD material. That is, the silicon–diamond bonding interface does not prevent charge collection.

  15. Combined Poisson and soft-particle DLVO analysis of the specific and nonspecific adhesion forces measured between L. monocytogenes grown at various temperatures and silicon nitride.

    Science.gov (United States)

    Gordesli, F Pinar; Abu-Lail, Nehal I

    2012-09-18

    Adhesion forces between pathogenic L. monocytogenes EGDe and silicon nitride (Si(3)N(4)) were measured using atomic force microscopy (AFM) under water and at room temperature for cells grown at five different temperatures (10, 20, 30, 37, and 40 °C). Adhesion forces were then decoupled into specific (hydrogen bonding) and nonspecific (electrostatic and Lifshitz-van der Waals) force components using Poisson statistical analysis. The strongest specific and nonspecific attraction forces were observed for cells grown at 30 °C, compared to those observed for cells grown at higher or lower temperatures, respectively. By combining the results of Poisson analysis with the results obtained through soft-particle Derjaguin-Landau-Verwey-Overbeek (DLVO) analysis, the contributions of the Lifshitz-van der Waals and electrostatic forces to the overall nonspecific interaction forces were determined. Our results showed that the Lifshitz-van der Waals attraction forces dominated the total nonspecific adhesion forces for all investigated thermal conditions. However, irrespective of the temperature of growth investigated, hydrogen bonding forces were always stronger than the nonspecific forces. Finally, by combining Poisson analysis with soft-particle analysis of DLVO forces, the closest separation distances where the irreversible bacterial adhesion takes place can be determined relatively easily. For all investigated thermal conditions, the closest separation distances were <1 nm.

  16. Galvanic corrosion of structural non-stoichiometric silicon nitride thin films and its implications on reliability of microelectromechanical devices

    Energy Technology Data Exchange (ETDEWEB)

    Broas, M., E-mail: mikael.broas@aalto.fi; Mattila, T. T.; Paulasto-Kröckel, M. [Department of Electrical Engineering and Automation, Aalto University, Espoo, P.O. Box 13500, FIN-00076 Aalto (Finland); Liu, X.; Ge, Y. [Department of Materials Science and Engineering, Aalto University, Espoo, P.O. Box 16200, FIN-00076 Aalto (Finland)

    2015-06-28

    This paper describes a reliability assessment and failure analysis of a poly-Si/non-stoichiometric silicon nitride thin film composite structure. A set of poly-Si/SiN{sub x} thin film structures were exposed to a mixed flowing gas (MFG) environment, which simulates outdoor environments, for 90 days, and an elevated temperature and humidity (85 °C/95% R.H.) test for 140 days. The mechanical integrity of the thin films was observed to degrade during exposure to the chemically reactive atmospheres. The degree of degradation was analyzed with nanoindentation tests. Statistical analysis of the forces required to initiate a fracture in the thin films indicated degradation due to the exposure to the MFG environment in the SiN{sub x} part of the films. Scanning electron microscopy revealed a porous-like reaction layer on top of SiN{sub x}. The morphology of the reaction layer resembled that of galvanically corroded poly-Si. Transmission electron microscopy further clarified the microstructure of the reaction layer which had a complex multi-phase structure extending to depths of ∼100 nm. Furthermore, the layer was oxidized two times deeper in a 90 days MFG-tested sample compared to an untested reference. The formation of the layer is proposed to be caused by galvanic corrosion of elemental silicon in non-stoichiometric silicon nitride during hydrofluoric acid etching. The degradation is proposed to be due uncontrolled oxidation of the films during the stress tests.

  17. Tribological and cutting behavior of silicon nitride tools coated with monolayer- and multilayer-microcrystalline HFCVD diamond films

    Science.gov (United States)

    Chen, Naichao; Shen, Bin; Yang, Guodong; Sun, Fanghong

    2013-01-01

    Monolayer-micrometric (MN-MCD), monolayer-submicrometric (MN-SMCD) and multilayer-micrometric (MT-MCD) diamond films are grown on silicon nitride substrates by hot filament chemical vapor deposition (HFCVD) technique. The as-deposited diamond films are characterized with scanning electron microscope (SEM), X-ray diffraction (XRD), energy-dispersive X-ray spectrometer (EDS), Raman spectrum and 3D surface topography. Tribological properties are assessed by the sliding tests using a reciprocal motion ball-on-flat (BOF) configuration. The friction coefficients are measured as 0.126 for the MN-MCD films, 0.076 for the MN-SMCD films and 0.071 for the MT-MCD films during dry sliding against silicon nitride counterface. The different carbon content of the films may result in the visible diminution of friction coefficient for the MT-MCD films relative to the MN-MCD films. The results show that the MN-MCD and MT-MCD films present the much higher wear resistance than the MN-SMCD films. Meanwhile, the cutting performances of as-deposited diamond films are evaluated by machining aluminum-silicon alloy material. The experimental results show that the MT-MCD insert presents the best behavior regarding the tool wear.

  18. Galvanic corrosion of structural non-stoichiometric silicon nitride thin films and its implications on reliability of microelectromechanical devices

    Science.gov (United States)

    Broas, M.; Liu, X.; Ge, Y.; Mattila, T. T.; Paulasto-Kröckel, M.

    2015-06-01

    This paper describes a reliability assessment and failure analysis of a poly-Si/non-stoichiometric silicon nitride thin film composite structure. A set of poly-Si/SiNx thin film structures were exposed to a mixed flowing gas (MFG) environment, which simulates outdoor environments, for 90 days, and an elevated temperature and humidity (85 °C/95% R.H.) test for 140 days. The mechanical integrity of the thin films was observed to degrade during exposure to the chemically reactive atmospheres. The degree of degradation was analyzed with nanoindentation tests. Statistical analysis of the forces required to initiate a fracture in the thin films indicated degradation due to the exposure to the MFG environment in the SiNx part of the films. Scanning electron microscopy revealed a porous-like reaction layer on top of SiNx. The morphology of the reaction layer resembled that of galvanically corroded poly-Si. Transmission electron microscopy further clarified the microstructure of the reaction layer which had a complex multi-phase structure extending to depths of ˜100 nm. Furthermore, the layer was oxidized two times deeper in a 90 days MFG-tested sample compared to an untested reference. The formation of the layer is proposed to be caused by galvanic corrosion of elemental silicon in non-stoichiometric silicon nitride during hydrofluoric acid etching. The degradation is proposed to be due uncontrolled oxidation of the films during the stress tests.

  19. A nanoporous silicon nitride membrane using a two-step lift-off pattern transfer with thermal nanoimprint lithography

    Science.gov (United States)

    Nabar, Bhargav P.; Çelik-Butler, Zeynep; Dennis, Brian H.; Billo, Richard E.

    2012-04-01

    Nanoimprint lithography is emerging as a viable contender for fabrication of large-scale arrays of 5-500 nm features. A fabrication process for the realization of thin nanoporous membranes using thermal nanoimprint lithography is presented. Suspended silicon nitride membranes were fabricated by low-pressure chemical vapor deposition (LPCVD) in conjunction with a potassium hydroxide-based bulk micromachining process. Nanoscale features were imprinted into a commercially available thermoplastic polymer resist using a prefabricated silicon mold. The pattern was reversed and transferred to a thin aluminum oxide layer by means of a novel two-stage lift-off technique. The patterned aluminum oxide was used as an etch mask in a CHF3/He-based reactive ion etch process to transfer the pattern to silicon nitride. Highly directional etch profiles with near vertical sidewalls and excellent Si3N4/Al2O3 etch selectivity were observed. One micrometer thick porous membranes with varying dimensions of 250 × 250 µm2 to 450 × 450 µm2 and a pore diameter of 400 nm have been engineered and evaluated. Results indicate that the membranes have consistent nanopore dimensions and precisely defined porosity, which makes them ideal as gas exchange interfaces in blood oxygenation systems as well as other applications such as dialysis.

  20. Galvanic corrosion of structural non-stoichiometric silicon nitride thin films and its implications on reliability of microelectromechanical devices

    International Nuclear Information System (INIS)

    This paper describes a reliability assessment and failure analysis of a poly-Si/non-stoichiometric silicon nitride thin film composite structure. A set of poly-Si/SiNx thin film structures were exposed to a mixed flowing gas (MFG) environment, which simulates outdoor environments, for 90 days, and an elevated temperature and humidity (85 °C/95% R.H.) test for 140 days. The mechanical integrity of the thin films was observed to degrade during exposure to the chemically reactive atmospheres. The degree of degradation was analyzed with nanoindentation tests. Statistical analysis of the forces required to initiate a fracture in the thin films indicated degradation due to the exposure to the MFG environment in the SiNx part of the films. Scanning electron microscopy revealed a porous-like reaction layer on top of SiNx. The morphology of the reaction layer resembled that of galvanically corroded poly-Si. Transmission electron microscopy further clarified the microstructure of the reaction layer which had a complex multi-phase structure extending to depths of ∼100 nm. Furthermore, the layer was oxidized two times deeper in a 90 days MFG-tested sample compared to an untested reference. The formation of the layer is proposed to be caused by galvanic corrosion of elemental silicon in non-stoichiometric silicon nitride during hydrofluoric acid etching. The degradation is proposed to be due uncontrolled oxidation of the films during the stress tests

  1. Surface wet-ability modification of thin PECVD silicon nitride layers by 40 keV argon ion treatments

    International Nuclear Information System (INIS)

    Measurements of wet-ability of liquid drops have been performed on a 30 nm silicon nitride (Si3N4) film deposited by a PECVD reactor on a silicon wafer and implanted by 40 keV argon ions at different doses. Surface treatments by using Ar ion beams have been employed to modify the wet-ability. The chemical composition of the first Si3N4 monolayer was investigated by means of X-ray Photoelectron Spectroscopy (XPS). The surface morphology was tested by Atomic Force Microscopy (AFM). Results put in evidence the best implantation conditions for silicon nitride to increase or to reduce the wet-ability of the biological liquid. This permits to improve the biocompatibility and functionality of Si3N4. In particular experimental results show that argon ion bombardment increases the contact angle, enhances the oxygen content and increases the surface roughness. - Highlights: • Measurements of wet-ability of liquid drops on a 30 nm Si3N4 film were performed. • Chemical composition was investigated by X-ray Photoelectron Spectroscopy (XPS). • Surface morphology was tested by Atomic Force Microscopy (AFM). • Ar+ bombardment increases the contact angle, oxygen content and surface roughness

  2. The selection of phase composition of silicon nitride ceramics for shaping with the use of EDM machining

    Directory of Open Access Journals (Sweden)

    P. Putyra

    2011-09-01

    Full Text Available Purpose: The purpose of this study is the selection of phase composition of Si3N4 matrix ceramics with the addition of conducting phases so as to make shaping of those materials possible by means of electro discharge machining (EDM. Silicon nitride matrix materials with the addition of oxide phases (Al2O3, MgO, ZrO2 and conducting phases (TiB2, TiN were sintered by the method of SPS (Spark Plasma Sintering. Additionally the effect of oxide phases on silicon nitride sintering capacity, the value of electric resistance of nitride ceramics depending on the addition of a conducting phase and the effect of sintering parameters on selected features of produced materials were determined.Design/methodology/approach: Materials were sintered with the use of a SPS device marked with FCT-HP D 5. Apparent density ρp was measured by the hydrostatic method. Hardness was determined by the Vicker’s method at the load of 980.7 mN with the use of a Future Tech Corp digital hardness tester FM7. For the purpose of those tests a surface was prepared with the use of a Struers cutting grinder ACUTOM. Measurements of Young’s modulus for sintered samples were carried out using a ultrasonic method of transverse and longitudinal wave speed measurement with the use of a Panametrics Epoch III detector. Resistance measurement was done with the use of Wheatstone and Thomson technical bridges.Findings: The addition of titanium nitride had no effect on the reduction of electric resistance of Si3N4 matrix ceramics. The lack of electric conductivity of those materials is the result of used additions influencing sintering capacity, mainly magnesium oxide. Si3N4 matrix materials with the addition of titanium diboride are characterised by low electrical resistance with high physical and mechanical features maintained. Electric conductivity of those materials and the initial electro discharge cutting attempts prove that it is possible to shape Si3N4 matrix ceramic materials with

  3. Design of a polymer-filled silicon nitride strip/slot asymmetric hybrid waveguide for realizing both flat dispersion and athermal operation.

    Science.gov (United States)

    Bian, Dandan; Chen, Shaowu; Lei, Xun; Qin, Guanshi; Chen, Zhanguo

    2016-06-20

    An asymmetric strip/slot hybrid silicon nitride waveguide is designed to simultaneously realize athermal operation and flat dispersion. The slot filling and upper cladding materials are negative thermal-optical coefficient (TOC), low refractive index polyurethane acrylate, while the left and right cladding layers are positive TOC, high refractive index silicon nitride. With suitable waveguide parameter selection, an optimum strip/slot hybrid silicon nitride waveguide exhibits an effective TOC of 1.263×10-7/K at 1550 nm, flattened dispersion in the wavelength range from 1200 to 1800 nm with the maximum dispersion of 30.51 ps/(nm·km), and a minimum of 10.89 ps/(nm·km). The proposed hybrid waveguide has great potential in building up broadband athermal microresonator optical frequency combs.

  4. Thermal Response of Cooled Silicon Nitride Plate Due to Thermal Conductivity Effects Analyzed

    Science.gov (United States)

    Baaklini, George Y.; Abdul-Aziz, Ali; Bhatt, Ramakrishna

    2003-01-01

    Lightweight, strong, tough high-temperature materials are required to complement efficiency improvements for next-generation gas turbine engines that can operate with minimum cooling. Because of their low density, high-temperature strength, and high thermal conductivity, ceramics are being investigated as materials to replace the nickelbase superalloys that are currently used for engine hot-section components. Ceramic structures can withstand higher operating temperatures and a harsh combustion environment. In addition, their low densities relative to metals help reduce component mass (ref. 1). To complement the effectiveness of the ceramics and their applicability for turbine engine applications, a parametric study using the finite element method is being carried out. The NASA Glenn Research Center remains very active in conducting and supporting a variety of research activities related to ceramic matrix composites through both experimental and analytical efforts (ref. 1). The objectives of this work are to develop manufacturing technology, develop a thermal and environmental barrier coating (TBC/EBC), develop an analytical modeling capability to predict thermomechanical stresses, and perform a minimal burner rig test on silicon nitride (Si3N4) and SiC/SiC turbine nozzle vanes under simulated engine conditions. Moreover, we intend to generate a detailed database of the material s property characteristics and their effects on structural response. We expect to offer a wide range of data since the modeling will account for other variables, such as cooling channel geometry and spacing. Comprehensive analyses have begun on a plate specimen with Si3N4 cooling holes.

  5. Design, microstructure, and high-temperature behavior of silicon nitride sintered with rate-earth oxides

    Energy Technology Data Exchange (ETDEWEB)

    Ciniculk, M.K. (California Univ., Berkeley, CA (United States). Dept. of Materials Science and Mineral Engineering)

    1991-08-01

    The processing-microstructure-property relations of silicon nitride ceramics sintered with rare-earth oxide additives have been investigated with the aim of improving their high-temperature behavior. The additions of the oxides of Y, Sm, Gd, Dy, Er, or Yb were compositionally controlled to tailor the intergranular phase. The resulting microstructure consisted of {beta}-Si{sub 3}N{sub 4} grains and a crystalline secondary phase of RE{sub 2}Si{sub 2}O{sub 7}, with a thin residual amorphous phase present at grain boundaries. The lanthanide oxides were found to be as effective as Y{sub 2}O{sub 3} in densifying Si{sub 3}N{sub 4}, resulting in identical microstructures. The crystallization behavior of all six disilicates was similar, characterized by a limited nucleation and rapid growth mechanism resulting in large single crystals. Complete crystallization of the intergranular phase was obtained with the exception of a residual amorphous, observed at interfaces and believed to be rich in impurities, the cause of incomplete devitrification. The low resistance to oxidation of these materials was attributed to the minimization of amorphous phases via devitrification to disilicates, compatible with SiO{sub 2}, the oxidation product of Si{sub 3}N{sub 4}. The strength retention of these materials at 1300{degrees}C was found to be between 80% and 91% of room-temperature strength, due to crystallization of the secondary phase and a residual but refractory amorphous grain-boundary phase. The creep behavior was found to be strongly dependent on residual amorphous phase viscosity as well as on the oxidation behavior, as evidenced by the nonsteady-state creep rates of all materials. 122 refs., 51 figs., 12 tabs.

  6. Silicon-Nitride-based Integrated Optofluidic Biochemical Sensors using a Coupled-Resonator Optical Waveguide

    Directory of Open Access Journals (Sweden)

    Jiawei eWANG

    2015-04-01

    Full Text Available Silicon nitride (SiN is a promising material platform for integrating photonic components and microfluidic channels on a chip for label-free, optical biochemical sensing applications in the visible to near-infrared wavelengths. The chip-scale SiN-based optofluidic sensors can be compact due to a relatively high refractive index contrast between SiN and the fluidic medium, and low-cost due to the complementary metal-oxide-semiconductor (CMOS-compatible fabrication process. Here, we demonstrate SiN-based integrated optofluidic biochemical sensors using a coupled-resonator optical waveguide (CROW in the visible wavelengths. The working principle is based on imaging in the far field the out-of-plane elastic-light-scattering patterns of the CROW sensor at a fixed probe wavelength. We correlate the imaged pattern with reference patterns at the CROW eigenstates. Our sensing algorithm maps the correlation coefficients of the imaged pattern with a library of calibrated correlation coefficients to extract a minute change in the cladding refractive index. Given a calibrated CROW, our sensing mechanism in the spatial domain only requires a fixed-wavelength laser in the visible wavelengths as a light source, with the probe wavelength located within the CROW transmission band, and a silicon digital charge-coupled device (CCD / CMOS camera for recording the light scattering patterns. This is in sharp contrast with the conventional optical microcavity-based sensing methods that impose a strict requirement of spectral alignment with a high-quality cavity resonance using a wavelength-tunable laser. Our experimental results using a SiN CROW sensor with eight coupled microrings in the 680nm wavelength reveal a cladding refractive index change of ~1.3 × 10^-4 refractive index unit (RIU, with an average sensitivity of ~281 ± 271 RIU-1 and a noise-equivalent detection limit (NEDL of 1.8 ×10^-8 RIU ~ 1.0 ×10^-4 RIU across the CROW bandwidth of ~1 nm.

  7. Scanning capacitance microscopy and spectroscopy applied to local charge modifications and characterization of nitride-oxide-silicon heterostructures

    Science.gov (United States)

    Dreyer, M.; Wiesendanger, R.

    1995-10-01

    We have combined a home-built capacitance sensor with a commercial scanning force microscope to obtain a Scanning Capacitance Microscope (SCM). The SCM has been used to study Nitride-Oxide-Silicon (NOS) heterostructures which offer potential applications in charge storage technology. Charge writing and reading on a submicrometer scale is demonstrated with our SCM setup. In addition, SCM appears to be very useful for the characterization of subsurface defects in semiconductor devices which are inaccessible by most of the other scanning probe microscopies. Finally, we introduce a novel spectroscopic mode of SCM operation which offers combined voltage-dependent and spatially resolved information about inhomogeneous charge distributions in semiconductor devices.

  8. A Monolithically Integrated Gallium Nitride Nanowire/Silicon Solar Cell Photocathode for Selective Carbon Dioxide Reduction to Methane.

    Science.gov (United States)

    Wang, Yichen; Fan, Shizhao; AlOtaibi, Bandar; Wang, Yongjie; Li, Lu; Mi, Zetian

    2016-06-20

    A gallium nitride nanowire/silicon solar cell photocathode for the photoreduction of carbon dioxide (CO2 ) is demonstrated. Such a monolithically integrated nanowire/solar cell photocathode offers several unique advantages, including the absorption of a large part of the solar spectrum and highly efficient carrier extraction. With the incorporation of copper as the co-catalyst, the devices exhibit a Faradaic efficiency of about 19 % for the 8e(-) photoreduction to CH4 at -1.4 V vs Ag/AgCl, a value that is more than thirty times higher than that for the 2e(-) reduced CO (ca. 0.6 %). PMID:27128407

  9. A Monolithically Integrated Gallium Nitride Nanowire/Silicon Solar Cell Photocathode for Selective Carbon Dioxide Reduction to Methane.

    Science.gov (United States)

    Wang, Yichen; Fan, Shizhao; AlOtaibi, Bandar; Wang, Yongjie; Li, Lu; Mi, Zetian

    2016-06-20

    A gallium nitride nanowire/silicon solar cell photocathode for the photoreduction of carbon dioxide (CO2 ) is demonstrated. Such a monolithically integrated nanowire/solar cell photocathode offers several unique advantages, including the absorption of a large part of the solar spectrum and highly efficient carrier extraction. With the incorporation of copper as the co-catalyst, the devices exhibit a Faradaic efficiency of about 19 % for the 8e(-) photoreduction to CH4 at -1.4 V vs Ag/AgCl, a value that is more than thirty times higher than that for the 2e(-) reduced CO (ca. 0.6 %).

  10. An aluminum-germanium eutectic structure for silicon wafer bonding technology

    Science.gov (United States)

    Perez-Quintana, I.; Ottaviani, G.; Tonini, R.; Felisari, L.; Garavaglia, M.; Oggioni, L.; Morin, D.

    2005-08-01

    An aluminum-germanium eutectic bonding technology has been used to uniformly bond two silicon wafers for MEMS packaging at temperatures as low as 450 °C, well below the aluminum-silicon eutectic temperature (577 °C). A device silicon wafer has been put in contact with a cap wafer where an aluminum film covered by a germanium film has been thermally evaporated. The annealing has been performed in a vacuum furnace under uniaxial pressure variable from 1.8 up to 30 kbar. The samples have been analyzed with various analytical techniques. 4He+ MeV Rutherford Backscattering Spectrometry (RBS) has been used to measure the thicknesses of the deposited films and to follow the aluminum-germanium intermixing, Scanning Acoustic Microscope (SAM) to control the uniformity of the bonding, Scanning Electron Microscope (SEM) associated with electron induced X-ray fluorescence to analyze composition, morphology and elements distribution in the film between the two bonded wafers. The temperatures for the annealing were selected above and below the Ge-Al the eutectic temperature. At temperatures below the eutectic no-bonding has been obtained for any applied pressure. Above the eutectic bonding occurs. The formation of a liquid film is mandatory to obtain a reproducible and robust bonding. The pressure is necessary to improve the contacts between the two wafers; its role in the metallurgy of the bonding needs to be explored.

  11. Role of fluorine atoms in the oxidation-hydrolysis process of plasma assisted chemical vapor deposition fluorinated silicon nitride film

    Energy Technology Data Exchange (ETDEWEB)

    Sanchez, O.; Gomez-Aleixandre, C.; Palacio, C. (Universidad Autonoma de Madrid (Spain))

    The oxidation and/or hydrolysis of a plasma assisted chemical vapor deposition fluorinated silicon nitride film in a moisture atmosphere has been studied. The film presents fluorine atoms incorporated as -SiF, -SiF[sub 2], -SiF[sub 3], and [-SiF[sub 2]-][sub n] groups. The open structure of the film, due to the high fluorine content as [-SiF[sub 2]-][sub n], favors the penetration of oxygen and water molecules in the network. The evolution of the film has been explained by the different reactivity of the silicon atoms depending on their chemical environment. The role of fluorine atoms incorporated into the film has been established. 12 refs., 3 figs., 1 tab.

  12. The structure and bonding of iron-acceptor pairs in silicon

    Energy Technology Data Exchange (ETDEWEB)

    Zhao, S.; Assali, L.V.C.; Kimerling, L.C. [Massachusetts Inst. of Technology, Cambridge, MA (United States)

    1995-08-01

    The highly mobile interstitial iron and Group III impurities (B, Al, Ga, In) form iron-acceptor pairs in silicon. Based on the migration kinetics and taking host silicon as a dielectric medium, we have simulated the pairing process in a static silicon lattice. Different from the conventional point charge ionic model, our phenomenological calculations include (1) a correction that takes into account valence electron cloud polarization which adds a short range, attractive interaction in the iron-acceptor pair bonding; and (2) silicon lattice relaxation due to the atomic size difference which causes a local strain field. Our model explains qualitatively (1) trends among the iron-acceptor pairs revealing an increase of the electronic state hole emission energy with increasing principal quantum number of acceptor and decreasing pair separation distance; and (2) the stable and metastable sites and configurational symmetries of the iron-acceptor pairs. The iron-acceptor pairing and bonding mechanism is also discussed.

  13. Improvement of silicon direct bonding using surfaces activated by hydrogen plasma treatment

    CERN Document Server

    Choi, W B; Lee Jae Sik; Sung, M Y

    2000-01-01

    The plasma surface treatment, using hydrogen gas, of silicon wafers was studied as a pretreatment for silicon direct bonding. Chemical reactions of the hydrogen plasma with the surfaces were used for both surface activation and removal of surface contaminants. Exposure of the silicon wafers to the plasma formed an active oxide layer on the surface. This layer was hydrophilic. The surface roughness and morphology were examined as functions of the plasma exposure time and power. The surface became smoother with shorter plasma exposure time and lower power. In addition, the plasma surface treatment was very efficient in removing the carbon contaminants on the silicon surface. The value of the initial surface energy, as estimated by using the crack propagation method, was 506 mJ/M sup 2 , which was up to about three times higher than the value for the conventional direct bonding method using wet chemical treatments.

  14. RF sputtering for controlling dihydride and monohydride bond densities in amorphous silicon hydride

    Science.gov (United States)

    Jeffery, F.R.; Shanks, H.R.

    1980-08-26

    A process is described for controlling the dihydride and monohydride bond densities in hydrogenated amorphous silicone produced by reactive rf sputtering of an amorphous silicon target. There is provided a chamber with an amorphous silicon target and a substrate therein with the substrate and the target positioned such that when rf power is applied to the target the substrate is in contact with the sputtering plasma produced thereby. Hydrogen and argon are fed to the chamber and the pressure is reduced in the chamber to a value sufficient to maintain a sputtering plasma therein, and then rf power is applied to the silicon target to provide a power density in the range of from about 7 watts per square inch to about 22 watts per square inch to sputter an amorphous solicone hydride onto the substrate, the dihydride bond density decreasing with an increase in the rf power density. Substantially pure monohydride films may be produced.

  15. Electronic Structure of Dangling Bonds in Amorphous Silicon Studied via a Density-Matrix Functional Method

    OpenAIRE

    Hennig, R. G.; Fedders, P. A.; Carlsson, A. E.

    2002-01-01

    A structural model of hydrogenated amorphous silicon containing an isolated dangling bond is used to investigate the effects of electron interactions on the electronic level splittings, localization of charge and spin, and fluctuations in charge and spin. These properties are calculated with a recently developed density-matrix correlation-energy functional applied to a generalized Anderson Hamiltonian, consisting of tight-binding one-electron terms parametrizing hydrogenated amorphous silicon...

  16. Fabrication of a Carbon Nanotube-Embedded Silicon Nitride Membrane for Studies of Nanometer-Scale Mass Transport

    Energy Technology Data Exchange (ETDEWEB)

    Holt, J K; Noy, A; Huser, T; Eaglesham, D; Bakajin, O

    2004-08-25

    A membrane consisting of multiwall carbon nanotubes embedded in a silicon nitride matrix was fabricated for fluid mechanics studies on the nanometer scale. Characterization by tracer diffusion and scanning electron microscopy suggests that the membrane is free of large voids. An upper limit to the diffusive flux of D{sub 2}O of 2.4x10-{sup 8} mole/m{sup 2}-s was determined, indicating extremely slow transport. By contrast, hydrodynamic calculations of water flow across a nanotube membrane of similar specifications predict a much higher molar flux of 1.91 mole/m{sup 2}-s, suggesting that the nanotubes produced possess a 'bamboo' morphology. The carbon nanotube membranes were used to make nanoporous silicon nitride membranes, fabricated by sacrificial removal of the carbon. Nitrogen flow measurements on these structures give a membrane permeance of 4.7x10{sup -4} mole/m{sup 2}-s-Pa at a pore density of 4x10{sup 10} cm{sup -2}. Using a Knudsen diffusion model, the average pore size of this membrane is estimated to be 66 nm, which agrees well with TEM observations of the multiwall carbon nanotube outer diameter. These membranes are a robust platform for the study of confined molecular transport, with applications inseparations and chemical sensing.

  17. Embedded nonvolatile memory devices with various silicon nitride energy band gaps on glass used for flat panel display applications

    International Nuclear Information System (INIS)

    Nonvolatile memory (NVM) devices with a nitride–nitride–oxynitride stack structure on a rough poly-silicon (poly-Si) surface were fabricated using a low-temperature poly-Si (LTPS) thin film transistor technology on glass substrates for application of flat panel display (FPD). The plasma-assisted oxidation/nitridation method is used to form a uniform oxynitride with an ultrathin tunneling layer on a rough LTPS surface. The NVMs, using a Si-rich silicon nitride film as a charge-trapping layer, were proposed as one of the solutions for the improvement of device performance such as the program/erase speed, the memory window and the charge retention characteristics. To further improve the vertical scaling and charge retention characteristics of NVM devices, the high-κ high-density N-rich SiNx films are used as a blocking layer. The fabricated NVM devices have outstanding electrical properties, such as a low threshold voltage, a high ON/OFF current ratio, a low subthreshold swing, a low operating voltage of less than ±9 V and a large memory window of 3.7 V, which remained about 1.9 V over a period of 10 years. These characteristics are suitable for electrical switching and data storage with in FPD application

  18. Bonding of the Inner Tracker Silicon Microstrip Modules

    CERN Document Server

    Bosi, Filippo; Brianzi, Mirko; Cariola, P; Costa, Salvatore; Demaria, Natale; Dumitrache, Floarea; Farano, R; Fiore, Luigi; Galet, G; Giudice, Nunzio; Kaminski, A; Mammini, Paolo; Manolescu, Florentina; Pantano, Devis; Profeti, Alessandro; Raimondo, F S; Saizu, Mirela Angela; Scarlini, Enrico; Tempesta, Paolo; Tessaro, Mario

    2008-01-01

    Microbonding of the CMS Tracker Inner Barrel (TIB) and Tracker Inner Disks (TID) modules was shared among six different Italian Institutes. The organization devised and the infrastructure deployed to handle this task is illustrated. Microbonding specifications and procedures for the different types of TIB and TID modules are given. The tooling specially designed and developed for these types of modules is described. Experience of production is presented. Attained production rates are given. An analysis of the microbonding quality achieved is presented, based on bond strengths measured in sample bond pull tests as well as on rates of bonding failures. Italian Bonding Centers routinely performed well above minimum specifications and a very low global introduced failure rate, at the strip level, of only $\\sim$0.015 \\% is observed.

  19. Evaluation of the Effect of Silicone Contamination on Various Bond Systems and the Feasibility of Removing the Contamination

    Science.gov (United States)

    Stanley, Stephanie D.

    2008-01-01

    Silicone is a contaminant that can cause catastrophic failure of a bond system depending on the materials and processes used to fabricate the bond system, Unfortunately, more and more materials are fabricated using silicone. The purpose of this testing was to evaluate which bond systems are sensitive to silicone contamination and whether or not a cleaning process could be utilized to remove the silicone to bring the bond system performance back to baseline. Due to the extensive nature of the testing attempts will be made to generalize the understanding within classes of substrates, bond systems, and surface preparation and cleaning methods. This study was done by contaminating various meta! (steel, inconel, and aluminum), phenolic (carbon cloth phenolic and glass cloth phenolic), and rubber (natural rubber, asbestos-silicone dioxide filled natural butyldiene rubber, silica-filled ethylene propylenediene monomer, and carbon-filled ethylene propylenediene monomer) substrates which were then bonded using various adhesives and coatings (epoxy-based adhesives, paints, ablative compounds, and Chemlok adhesives) to determine the effect silicone contamination has on a given bond system's performance. The test configurations depended on the bond system being evaluated. The study also evaluated the feasibility of removing the silicone contamination by cleaning the contaminated substrate prior to bonding. The cleaning processes also varied depending on bond system.

  20. Improving the Microstructure and Electrical Properties of Aluminum Induced Polysilicon Thin Films Using Silicon Nitride Capping Layer

    Directory of Open Access Journals (Sweden)

    Min-Hang Weng

    2014-01-01

    Full Text Available We investigated the capping layer effect of SiNx (silicon nitride on the microstructure, electrical, and optical properties of poly-Si (polycrystalline silicon prepared by aluminum induced crystallization (AIC. The primary multilayer structure comprised Al (30 nm/SiNx (20 nm/a-Si (amorphous silicon layer (100 nm/ITO coated glass and was then annealed in a low annealing temperature of 350°C with different annealing times, 15, 30, 45, and 60 min. The crystallization properties were analyzed and verified by X-ray diffraction (XRD and Raman spectra. The grain growth was analyzed via optical microscope (OM and scanning electron microscopy (SEM. The improved electrical properties such as Hall mobility, resistivity, and dark conductivity were investigated by using Hall and current-voltage (I-V measurements. The results show that the amorphous silicon film has been effectively induced even at a low temperature of 350°C and a short annealing time of 15 min and indicate that the SiNx capping layer can improve the grain growth and reduce the metal content in the induced poly-Si film. It is found that the large grain size is over 20 μm and the carrier mobility values are over 80 cm2/V-s.

  1. Creep of heat treated silicon nitride with neodymium and yttrium oxides additions

    International Nuclear Information System (INIS)

    Research highlights: → In all cases, microstructural examination of crept samples showed that existing phases at grain boundaries were associated to the deformation processes. This highlights the importance of the presence and the amount of grain boundary glass. → Crystallization of the remnant phase during heat treatment in nitrogen atmosphere gives rise to further crystallization of the new phases in the Nd-Si-O-N system such as Nd4Si3O12 and Nd2Si3O3N4. A consequence of this crystallization is a significant reduction in stress exponents and creep rates for the heat treated samples. → Diffusional creep may prevail for lower temperatures, low glass content and stresses. Cavitation would start to operate and become increasingly prevalent with increase in stress, temperature and decrease in crystallinity of the grain boundary phase. - Abstract: At the present work, samples of silicon nitride with 12 wt% of yttrium/neodymium oxides mixture were formed by gas-pressure sintering. Pos sintering heat treatments in nitrogen with a stepwise temperature variation were performed in some samples. The short term compressive creep tests were undertaken in an argon atmosphere, over a stress range of 50-300 MPa and temperature range of 1200-1400 deg. C. Values of stress exponents near unity for (i) low temperature testing in all materials and (ii) all temperatures for heat treated samples suggest diffusion accommodation processes, involving ambipolar diffusion of ionic species in the grain boundary phases. Crystallization of the remnant phase during heat treatment in a nitrogen atmosphere gives rise to further formation of new phases in the Nd-Si-O-N system such as Nd4Si3O12 and Nd2Si3O3N4. A consequence of this crystallization is a significant reduction in stress exponents and creep rates for the heat treated samples. The wedge crack observed after creep testing at specimens in its as-sintered condition may be related to the increased probability of cavitation in the

  2. Creep of heat treated silicon nitride with neodymium and yttrium oxides additions

    Energy Technology Data Exchange (ETDEWEB)

    Moreira da Silva, Cosme Roberto, E-mail: cosmeroberto@gmail.com [Universidade de Brasilia, UNB, Brasilia-DF 70910-900 (Brazil); Aparecida Pereira Reis, Danieli [Instituto Tecnologico de Aeronautica - Sao Jose dos Campos CEP (Brazil); Santos, Claudinei dos [Faculdade de Engenharia Quimica de Lorena, DEMAR, Lorena 12600-000 (Brazil)

    2010-10-15

    Research highlights: {yields} In all cases, microstructural examination of crept samples showed that existing phases at grain boundaries were associated to the deformation processes. This highlights the importance of the presence and the amount of grain boundary glass. {yields} Crystallization of the remnant phase during heat treatment in nitrogen atmosphere gives rise to further crystallization of the new phases in the Nd-Si-O-N system such as Nd{sub 4}Si{sub 3}O{sub 12} and Nd{sub 2}Si{sub 3}O{sub 3}N{sub 4}. A consequence of this crystallization is a significant reduction in stress exponents and creep rates for the heat treated samples. {yields} Diffusional creep may prevail for lower temperatures, low glass content and stresses. Cavitation would start to operate and become increasingly prevalent with increase in stress, temperature and decrease in crystallinity of the grain boundary phase. - Abstract: At the present work, samples of silicon nitride with 12 wt% of yttrium/neodymium oxides mixture were formed by gas-pressure sintering. Pos sintering heat treatments in nitrogen with a stepwise temperature variation were performed in some samples. The short term compressive creep tests were undertaken in an argon atmosphere, over a stress range of 50-300 MPa and temperature range of 1200-1400 deg. C. Values of stress exponents near unity for (i) low temperature testing in all materials and (ii) all temperatures for heat treated samples suggest diffusion accommodation processes, involving ambipolar diffusion of ionic species in the grain boundary phases. Crystallization of the remnant phase during heat treatment in a nitrogen atmosphere gives rise to further formation of new phases in the Nd-Si-O-N system such as Nd{sub 4}Si{sub 3}O{sub 12} and Nd{sub 2}Si{sub 3}O{sub 3}N{sub 4}. A consequence of this crystallization is a significant reduction in stress exponents and creep rates for the heat treated samples. The wedge crack observed after creep testing at specimens

  3. Influence of Cooling Channel Geometry on the Thermal Response in Silicon Nitride Plates Studied

    Science.gov (United States)

    Abdul-Aziz, Ali; Bhatt, Ramakrishna T.; Baaklini, George Y.

    2002-01-01

    Engine manufacturers are continually attempting to improve the performance and efficiency of internal combustion engines. Usually they raise the operating temperature or reduce the cooling air requirement for the hot section turbine components. However, the success of these attempts depends on finding materials that are lightweight, are strong, and can withstand high temperatures. Ceramics are among the top candidate materials considered for such harsh applications. They hold low-density, high-temperature strength, and thermal conductivity, and they are undergoing investigation as potential materials for replacing nickel-base alloys and superalloys that are currently used for engine hot-section components. Ceramic structures can withstand higher operating temperatures and a harsh combustion environment. In addition, their low densities relative to metals help reduce component mass. The long-term objectives of the High Temperature Propulsion Components (HOTPC) Project are to develop manufacturing technology, thermal and environmental barrier coatings (TBC/EBC), and the analytical modeling capability to predict thermomechanical stresses in minimally cooled silicon nitride turbine nozzle vanes under simulated engine conditions. Two- and three-dimensional finite element analyses with TBC were conducted at the NASA Glenn Research Center. Nondestructive evaluation was used to determine processing defects. The study included conducting preliminary parametric analytical runs of heat transfer and stress analyses under steady-state conditions to demonstrate the feasibility of using cooled Si3N4 parts for turbine applications. The influence of cooling-channel shapes (such as circular, square, and ascending-order cooling channels) on cooling efficiency and thermal stresses was investigated. Temperature distributions were generated for all cases considered under both cooling and no-cooling conditions, with air being the cooling medium. The table shows the magnitude of the

  4. The influence of wafer dimensions on the contact wave velocity in silicon wafer bonding

    DEFF Research Database (Denmark)

    Bengtsson, S.; Ljungberg, Karin; Vedde, Jan

    1996-01-01

    The contact wave velocity in silicon wafer bonding is experimentally found to decrease with wafer thickness and to be only weakly dependent on wafer diameter. Wafers of different thicknesses ranging from 270 to 5000 mu m, were dipped in HF:H2O before bonding to give the surfaces hydrophobic...... stored in the material is increased, and the contact wave velocity is decreased. (C) 1996 American Institute of Physics....

  5. Preparation and properties of bisphenol-F based boron-phenolic resin/modified silicon nitride composites and their usage as binders for grinding wheels

    Science.gov (United States)

    Lin, Chun-Te; Lee, Hsun-Tsing; Chen, Jem-Kun

    2015-03-01

    In this study, phenolic resins based on bisphenol-F (BPF) were synthesized. Besides, ammonium borate was added in the synthesis process of BPF to form the bisphenol-F based boron-phenolic resins (B-BPF). The glass transition temperature, thermal resistance, flexural strength and hardness of B-BPF are respectively higher than those of BPF. This is due to the presence of new cross-link Bsbnd O bonds in the B-BPF. In addition, the 3-aminopropyltriethoxysilane modified silicon nitride powders (m-SiN) were fully mixed with B-BPF to form the B-BPF/m-SiN composites. The thermal resistance and mechanical properties of the B-BPF/m-SiN are promoted by the well-dispersed and well-adhered m-SiN in these novel polymer/ceramics composites. The results of grinding experiments indicate that the grinding wheels bound by the B-BPF/m-SiN have better grinding quality than those bound by the BPF. Thus the B-BPF/m-SiN composites are better binding media than the BPF resins.

  6. Tribological and cutting behavior of silicon nitride tools coated with monolayer- and multilayer-microcrystalline HFCVD diamond films

    International Nuclear Information System (INIS)

    Highlights: ► Multilayer-MCD film shows lower friction coefficient compared monolayer-MCD film. ► Multilayer-MCD film is similar in friction coefficient to monolayer-SMCD film. ► Multilayer-MCD film presents the higher wear resistance than monolayer-SMCD film. ► Multilayer-MCD diamond insert presents the perfect behavior regarding tool wear. - Abstract: Monolayer-micrometric (MN-MCD), monolayer-submicrometric (MN-SMCD) and multilayer-micrometric (MT-MCD) diamond films are grown on silicon nitride substrates by hot filament chemical vapor deposition (HFCVD) technique. The as-deposited diamond films are characterized with scanning electron microscope (SEM), X-ray diffraction (XRD), energy-dispersive X-ray spectrometer (EDS), Raman spectrum and 3D surface topography. Tribological properties are assessed by the sliding tests using a reciprocal motion ball-on-flat (BOF) configuration. The friction coefficients are measured as 0.126 for the MN-MCD films, 0.076 for the MN-SMCD films and 0.071 for the MT-MCD films during dry sliding against silicon nitride counterface. The different carbon content of the films may result in the visible diminution of friction coefficient for the MT-MCD films relative to the MN-MCD films. The results show that the MN-MCD and MT-MCD films present the much higher wear resistance than the MN-SMCD films. Meanwhile, the cutting performances of as-deposited diamond films are evaluated by machining aluminum–silicon alloy material. The experimental results show that the MT-MCD insert presents the best behavior regarding the tool wear.

  7. First-principles study of bonding mechanisms in the series of Ti, V, Cr, Mo, and their carbides and nitrides

    Energy Technology Data Exchange (ETDEWEB)

    Zaoui, A. [Modelling and Simulation in Materials Science Laboratory, Physics Department, University of Sidi Bel-Abbes, 24 med bouzidi, 22000 Sidi Bel-Abbes (Algeria)]. E-mail: ali_zaoui@yahoo.fr; Kacimi, S. [Modelling and Simulation in Materials Science Laboratory, Physics Department, University of Sidi Bel-Abbes, 24 med bouzidi, 22000 Sidi Bel-Abbes (Algeria); Bouhafs, B. [Modelling and Simulation in Materials Science Laboratory, Physics Department, University of Sidi Bel-Abbes, 24 med bouzidi, 22000 Sidi Bel-Abbes (Algeria); Roula, A. [Laboratoire d' etude sur les interactions materiaux-environnements, Universite de Jijel, 18000 Jijel, Algerie (Algeria)

    2005-04-15

    The electronic structure and chemical bonding mechanism in the series of transition metals, those formed with 3d metals (Ti, V, Cr), and 4d metal (Mo), and their carbides and nitrides in the rocksalt structure are studied by means of a first-principles full potential linearized augmented plane waves method within the local density approximation (LDA). Results are given for lattice constant, bulk modulus, charge density and total and partial density of states. Our calculations demonstrate that increasing the number of valence d electrons in the core lead to larger (B) and the relativistic effects on the structural and electronic properties of MoC and MoN, if qualitatively not unexpected, are, however, surprisingly large, despite the relatively light atoms (C and N)

  8. Silicon dioxide and aluminium nitride as gate dielectric for high temperature and high power silicon carbide MOSFETs

    OpenAIRE

    Zetterling, Carl-Mikael

    1997-01-01

    Silicon carbide (SIC) is a wide bandgap semiconductor thathas been suggested as a replacement for silicon in applicationsusing high voltages, high frequencies, high temperatures orcombinations thereof. Several basic process steps need to bedeveloped for reliable manufacturing of long-term stableelectronic devices. One important process step is the formationof an insulator on the silicon carbide surface that may be usedas a) a gate dielectric, b) for device isolation or c) forpassivation of th...

  9. Non-silicon substrate bonding mediated by poly(dimethylsiloxane) interfacial coating

    Energy Technology Data Exchange (ETDEWEB)

    Zhang, Hainan [Department of BioNano Technology, Gachon University, Gyeonggi-do 461-701 (Korea, Republic of); Lee, Nae Yoon, E-mail: nylee@gachon.ac.kr [Department of BioNano Technology, Gachon University, Gyeonggi-do 461-701 (Korea, Republic of); Gachon Medical Research Institute, Gil Medical Center, Inchon 405-760 (Korea, Republic of)

    2015-02-01

    Graphical abstract: Low-molecular-weight PDMS coating on the surfaces of non-silicon substrates such as thermoplastics ensures permanent sealing with a silicone elastomer, PDMS, simply by surface oxidization followed by ambient condition bonding, mediated by a robust siloxane bond formation at the interface. - Highlights: • Non-silicon thermoplastic was bonded with poly(dimethylsiloxane) silicone elastomer. • Low-molecular-weight PDMS interfacial layer was chemically coated on thermoplastic. • Bonding was realized by corona treatment and physical contact under ambient condition. • Bonding is universally applicable regardless of thermoplastic type and property. • Homogeneous PDMS-like microchannel was obtained inside the thermoplastic-PDMS microdevice. - Abstract: In this paper, we introduce a simple and robust strategy for bonding poly(dimethylsiloxane) (PDMS) with various thermoplastic substrates to fabricate a thermoplastic-based closed microfluidic device and examine the feasibility of using the proposed method for realizing plastic–plastic bonding. The proposed bonding strategy was realized by first coating amine functionality on an oxidized thermoplastic surface. Next, the amine-functionalized surface was reacted with a monolayer of low-molecular-weight PDMS, terminated with epoxy functionality, by forming a robust amine-epoxy bond. Both the PDMS-coated thermoplastic and PDMS were then oxidized and permanently assembled at 25 °C under a pressure of 0.1 MPa for 15 min, resulting in PDMS-like surfaces on all four inner walls of the microchannel. Surface characterizations were conducted, including water contact angle measurement, X-ray photoelectron spectroscopy (XPS), and fluorescence measurement, to confirm the successful coating of the thin PDMS layer on the plastic surface, and the bond strength was analyzed by conducting a peel test, burst test, and leakage test. Using the proposed method, we could successfully bond various thermoplastics such

  10. Silicon Carbide Tiles for Sidewall Lining in Aluminium Electrolysis Cells

    Institute of Scientific and Technical Information of China (English)

    RUANBo; ZHAOJunguo; 等

    1999-01-01

    The paper introduces the nitride bonded silicon carbide used for sidewall lining in aluminium eletrolysis cells ,including technical process,main properties and application results.Comparison tests on various physical properties of silicon carbide products made by LIRR and other producers worldwide have also been conducted in an independent laboratory.

  11. Eutectic bonding of contacts to silicon solar cells

    Science.gov (United States)

    Giuliano, M. N.

    A process of eutectic wetting and bonding of contact preforms is described which can serve as weld points for interconnection of solar cells. The procedure obviates the need for welding too close to the shallow diffused junction of a solar cell and therefore minimizes mechanical or electrical degradation that is likely when welding directly to the cell metallization. In addition, control of welding parameters is simplified because the weld interconnection is now made to a relatively thick metal preform which is firmly attached to the solar cell. Gold clad kovar was used in this preliminary study. Bond strength was excellent and survived temperature cycling to liquid nitrogen temperature. Electrical performance degradation after alloying was erratic and varied from little or no degradation to severe shunting. The reasons for the loss in fill-factor which is frequently encountered with the present process and choice of materials are not clear at this time. Possible explanations and recommendations for future work are discussed.

  12. Approaching Defect-free Amorphous Silicon Nitride by Plasma-assisted Atomic Beam Deposition for High Performance Gate Dielectric.

    Science.gov (United States)

    Tsai, Shu-Ju; Wang, Chiang-Lun; Lee, Hung-Chun; Lin, Chun-Yeh; Chen, Jhih-Wei; Shiu, Hong-Wei; Chang, Lo-Yueh; Hsueh, Han-Ting; Chen, Hung-Ying; Tsai, Jyun-Yu; Lu, Ying-Hsin; Chang, Ting-Chang; Tu, Li-Wei; Teng, Hsisheng; Chen, Yi-Chun; Chen, Chia-Hao; Wu, Chung-Lin

    2016-01-01

    In the past few decades, gate insulators with a high dielectric constant (high-k dielectric) enabling a physically thick but dielectrically thin insulating layer, have been used to replace traditional SiOx insulator and to ensure continuous downscaling of Si-based transistor technology. However, due to the non-silicon derivative natures of the high-k metal oxides, transport properties in these dielectrics are still limited by various structural defects on the hetero-interfaces and inside the dielectrics. Here, we show that another insulating silicon compound, amorphous silicon nitride (a-Si3N4), is a promising candidate of effective electrical insulator for use as a high-k dielectric. We have examined a-Si3N4 deposited using the plasma-assisted atomic beam deposition (PA-ABD) technique in an ultra-high vacuum (UHV) environment and demonstrated the absence of defect-related luminescence; it was also found that the electronic structure across the a-Si3N4/Si heterojunction approaches the intrinsic limit, which exhibits large band gap energy and valence band offset. We demonstrate that charge transport properties in the metal/a-Si3N4/Si (MNS) structures approach defect-free limits with a large breakdown field and a low leakage current. Using PA-ABD, our results suggest a general strategy to markedly improve the performance of gate dielectric using a nearly defect-free insulator. PMID:27325155

  13. Approaching Defect-free Amorphous Silicon Nitride by Plasma-assisted Atomic Beam Deposition for High Performance Gate Dielectric

    Science.gov (United States)

    Tsai, Shu-Ju; Wang, Chiang-Lun; Lee, Hung-Chun; Lin, Chun-Yeh; Chen, Jhih-Wei; Shiu, Hong-Wei; Chang, Lo-Yueh; Hsueh, Han-Ting; Chen, Hung-Ying; Tsai, Jyun-Yu; Lu, Ying-Hsin; Chang, Ting-Chang; Tu, Li-Wei; Teng, Hsisheng; Chen, Yi-Chun; Chen, Chia-Hao; Wu, Chung-Lin

    2016-06-01

    In the past few decades, gate insulators with a high dielectric constant (high-k dielectric) enabling a physically thick but dielectrically thin insulating layer, have been used to replace traditional SiOx insulator and to ensure continuous downscaling of Si-based transistor technology. However, due to the non-silicon derivative natures of the high-k metal oxides, transport properties in these dielectrics are still limited by various structural defects on the hetero-interfaces and inside the dielectrics. Here, we show that another insulating silicon compound, amorphous silicon nitride (a-Si3N4), is a promising candidate of effective electrical insulator for use as a high-k dielectric. We have examined a-Si3N4 deposited using the plasma-assisted atomic beam deposition (PA-ABD) technique in an ultra-high vacuum (UHV) environment and demonstrated the absence of defect-related luminescence; it was also found that the electronic structure across the a-Si3N4/Si heterojunction approaches the intrinsic limit, which exhibits large band gap energy and valence band offset. We demonstrate that charge transport properties in the metal/a-Si3N4/Si (MNS) structures approach defect-free limits with a large breakdown field and a low leakage current. Using PA-ABD, our results suggest a general strategy to markedly improve the performance of gate dielectric using a nearly defect-free insulator.

  14. Low-loss, silicon integrated, aluminum nitride photonic circuits and their use for electro-optic signal processing.

    Science.gov (United States)

    Xiong, Chi; Pernice, Wolfram H P; Tang, Hong X

    2012-07-11

    Photonic miniaturization requires seamless integration of linear and nonlinear optical components to achieve passive and active functions simultaneously. Among the available material systems, silicon photonics holds immense promise for optical signal processing and on-chip optical networks. However, silicon is limited to wavelengths above 1.1 μm and does not provide the desired lowest order optical nonlinearity for active signal processing. Here we report the integration of aluminum nitride (AlN) films on silicon substrates to bring active functionalities to chip-scale photonics. Using CMOS-compatible sputtered thin films we fabricate AlN-on-insulator waveguides that exhibit low propagation loss (0.6 dB/cm). Exploiting AlN's inherent Pockels effect we demonstrate electro-optic modulation up to 4.5 Gb/s with very low energy consumption (down to 10 fJ/bit). The ultrawide transparency window of AlN devices also enables high speed modulation at visible wavelengths. Our low cost, wideband, carrier-free photonic circuits hold promise for ultralow power and high-speed signal processing at the microprocessor chip level.

  15. Low-loss, silicon integrated, aluminum nitride photonic circuits and their use for electro-optic signal processing

    CERN Document Server

    Xiong, Chi; Tang, Hong X

    2014-01-01

    Photonic miniaturization requires seamless integration of linear and nonlinear optical components to achieve passive and active functions simultaneously. Among the available material systems, silicon photonics holds immense promise for optical signal processing and on-chip optical networks. However, silicon is limited to wavelengths above 1100 nm and does not provide the desired lowest order optical nonlinearity for active signal processing. Here we report the integration of aluminum nitride (AlN) films on silicon substrates to bring active functionalities to chip-scale photonics. Using CMOS-compatible sputtered thin films we fabricate AlN-on-insulator waveguides that exhibit low propagation loss (0.6 dB/cm). Exploiting AlN's inherent Pockels effect we demonstrate electro-optic modulation up to 4.5 Gb/s with very low energy consumption (down to 10 fJ/bit). The ultra-wide transparency window of AlN devices also enables high speed modulation at visible wavelengths. Our low cost, wideband, carrier-free photonic ...

  16. Role of silicon dangling bonds in the electronic properties of epitaxial graphene on silicon carbide.

    Science.gov (United States)

    Ridene, Mohamed; Kha, Calvin S; Flipse, Cees F J

    2016-03-29

    In this paper, we study the electronic properties of epitaxial graphene (EG) on silicon carbide by means of ab initio calculations based on the local spin density approximation + U method taking into account the Coulomb interaction between Si localized electrons. We show that this interaction is not completely suppressed but is screened by carbon layers grown on-top of silicon carbide. This finding leads to a good qualitative understanding of the experimental results reported on EG on silicon carbide. Our results highlight the presence of the Si localized states and might explain the anomalous Hanle curve and the high values of spin relaxation time in EG.

  17. Optical trapping of microparticles using silicon nitride waveguide junctions and tapered-waveguide junctions on an optofluidic chip.

    Science.gov (United States)

    Cai, Hong; Poon, Andrew W

    2012-10-01

    We study optical trapping of microparticles on an optofluidic chip using silicon nitride waveguide junctions and tapered-waveguide junctions. We demonstrate the trapping of single 1 μm-sized polystyrene particles using the evanescent field of waveguide junctions connecting a submicrometer-sized input-waveguide and a micrometer-sized output-waveguide. Particle trapping is localized in the vicinity of the junction. We also demonstrate trapping of one and two 1μm-sized polystyrene particles using tapered-waveguide junctions connecting a submicrometer-sized singlemode input-waveguide and a micrometer-sized multimode output-waveguide. Particle trapping occurs near the taper output end, the taper center and the taper input end, depending on the taper aspect ratio.

  18. Fabrication and characterization of high performance AIGaN/GaN HEMTs on sapphire with silicon nitride passivation

    Institute of Scientific and Technical Information of China (English)

    Zhang Renping; Yan Wei; Wang Xiaoliang; Yang Fuhua

    2011-01-01

    AIGaN/GaN high electron mobility transistors (HEMTs) with high performance were fabricated and characterized. A variety of techniques were used to improve device performance, such as AIN interlayer, silicon nitride passivation, high aspect ratio T-shaped gate, Iow resistance ohmic contact and short drain-source distance.DC and RF performances of as-fabricated HEMTs were characterized by utilizing a semiconductor characterization system and a vector network analyzer, respectively. As-fabricated devices exhibited a maximum drain current density of 1.41 A/mm and a maximum peak extrinsic transconductance of 317 mS/mm. The obtained current density is larger than those reported in the literature to date, implemented with a domestic wafer and processes. Furthermore, a unity current gain cut-off frequency of 74.3 GHz and a maximum oscillation frequency of 112.4 GHz were obtained on a device with an 80 nm gate length.

  19. Effects of precoating and calcination on microstructure of 3D silica fiber reinforced silicon nitride based composites

    Institute of Scientific and Technical Information of China (English)

    QI Gong-jin; ZHANG Chang-rui; HU Hai-feng

    2006-01-01

    Three-dimensional silica fiber reinforced silicon nitride based composites were fabricated by preceramic polymer infiltration and pyrolysis method using perhydropolysilazane as a precursor. The effects of precoating and high temperature calcination on the microstructures of the composites were investigated by scanning electron microscopy. For the composite without a precoating, the fracture surface is plain, and the fiber/matrix interfaces become very unclear after calcination at 1 600 ℃ due to intense interfacial reactions. The composite with a precoating shows tough fracture surface with distinct fiber pull-outs, and the fiber/matrix interfaces are still clear after calcination at 1 600 ℃. It is the appropriate precoating process that contributes to the good interfacial microstructures for the composite.

  20. Functionalization and bioimmobilization of silicon surfaces with Si–N bonded monolayer

    Energy Technology Data Exchange (ETDEWEB)

    Masood, Muhammad Nasir, E-mail: chemnasir_76@yahoo.com [Bios Lab on a Chip Group, MESA+ Institute for Nanotechnology, University of Twente, Enschede (Netherlands); Department of Physics and Applied Mathematics, Pakistan Institute of Engineering and Applied Sciences (PIEAS), Nilore, Islamabad (Pakistan); Carlen, Edwin T.; Berg, Albert van den [Bios Lab on a Chip Group, MESA+ Institute for Nanotechnology, University of Twente, Enschede (Netherlands)

    2015-05-15

    Highlights: • Chemistry of Ethylene diamine (EDA) studied by X-ray photoelectron spectroscopy (XPS) on hydrogen terminated Si (1 1 1) surface under UV-irradiation. • Fast, efficient and selective surface modification via symmetric functional molecule. • Do not involve protection and deprotection steps which deteoriate the monolayer integrity, time consuming and expensive. • Si–N bond remain intact on sub-oxidized silicon surface. • Free amine groups availability for bioimmobilization. • Selectivity and sensitivity was demonstrated by SEM, fluorscence and electrochemical (C–V) measurements. - Abstract: A new method for selective surface functionalization of silicon with a silicon–nitrogen bonded (Si–N) monolayer and subsequent bioimmobilization is presented. The Si–N monolayer was studied using X-ray photoelectron spectroscopy (XPS), scanning electron microscopy (SEM), fluorescence spectroscopy, and capacitance–voltage (C–V) measurements using an electrolyte insulator semiconductor (EIS) sensor. A symmetric ethylene diamine (EDA, C{sub 2}H{sub 4} (NH{sub 2}){sub 2}) molecule was used as a precursor compound for monolayer formation in an inert environment in the liquid phase. XPS results show the attachment of EDA molecules proceeds via dissociative and dative bond formation whereas free amine groups on the surface were used for further immobilization of biomolecules. SEM shows selective functionalization and bioimmobilization on a patterned surface such as a silicon nanowire on silicon oxide substrate. Biosensing experiments with bioimmobilized surfaces were carried out in aqueous buffer and show high sensitivity for biosensing.

  1. Preparation and characterization of silicon nitride (Si−N)-coated carbon fibers and their effects on thermal properties in composites

    Energy Technology Data Exchange (ETDEWEB)

    Kim, Hyeon-Hye [R& D Division, Korea Institute of Carbon Convergence Technology, Jeonju 561-844 (Korea, Republic of); Nano& Advanced Materials Engineering, Jeonju University, Jeonju 560-759 (Korea, Republic of); Han, Woong [R& D Division, Korea Institute of Carbon Convergence Technology, Jeonju 561-844 (Korea, Republic of); Lee, Hae-seong [Nano& Advanced Materials Engineering, Jeonju University, Jeonju 560-759 (Korea, Republic of); Min, Byung-Gak [Department of Polymer Science & Engineering, Korea National University of Transportation, Chungju 380-702 (Korea, Republic of); Kim, Byung-Joo, E-mail: ap2-kbj@hanmail.net [R& D Division, Korea Institute of Carbon Convergence Technology, Jeonju 561-844 (Korea, Republic of)

    2015-10-15

    Graphical abstract: We report preparation and characterization of silicon nitride (Si−N)-coated carbon fibers and their effects on thermal properties in composites. Thermally composites showed enhanced thermal conductivity increasing from up to 59% by the thermal network. - Highlights: • A new method of Si−N coating on carbon fibers was reported. • Silane layer were successfully converted to Si−N layer on carbon fiber surface. • Si−N formation was confirmed by FT-IR, XPS, and EDX. • Thermal conductivity of Si−N coated CF composites were enhanced to 0.59 W/mK. - Abstract: This study investigates the effect of silicon nitride (Si−N)-coated carbon fibers on the thermal conductivity of carbon-fiber-reinforced epoxy composite. The surface properties of the Si−N-coated carbon fibers (SiNCFs) were observe using Fourier transform infrared spectroscopy, scanning electron microscopy, energy dispersive spectroscopy, and X-ray photoelectron spectroscopy, and the thermal stability was analyzed using thermogravimetric analysis. SiNCFs were fabricated through the wet thermal treatment of carbon fibers (Step 1: silane finishing of the carbon fibers; Step 2: high-temperature thermal treatment in a N{sub 2}/NH{sub 3} environment). As a result, the Si−N belt was exhibited by SEM. The average thickness of the belt were 450–500 nm. The composition of Si−N was the mixture of Si−N, Si−O, and C−Si−N as confirmed by XPS. Thermal residue of the SiNCFs in air was enhanced from 3% to 50%. Thermal conductivity of the composites increased from 0.35 to 0.59 W/mK after Si−N coating on carbon surfaces.

  2. An Experimental Investigation of Silicone-to-Metal Bond Strength in Composite Space Docking System Seals

    Science.gov (United States)

    Gaier, James R.; Siamidis, John; Larkin, Elizabeth M. G.

    2010-01-01

    The National Aeronautics and Space Administration (NASA) is currently developing a new universal docking mechanism for future space exploration missions called the Low Impact Docking System (LIDS). A candidate LIDS main interface seal design is a composite assembly of silicone elastomer seals vacuum molded into grooves in an electroless nickel plated aluminum retainer. The strength of the silicone-tometal bond is a critical consideration for the new system, especially due to the presence of small areas of disbond created during the molding process. In the work presented herein, seal-to-retainer bonds of subscale seal specimens with different sizes of intentional disbond were destructively tensile tested. Nominal specimens without intentional disbonds were also tested. Tension was applied either uniformly on the entire seal circumference or locally in one short circumferential length. Bond failure due to uniform tension produced a wide scatter of observable failure modes and measured load-displacement behaviors. Although the preferable failure mode for the seal-to-retainer bond is cohesive failure of the elastomer material, the dominant observed failure mode under the uniform loading condition was found to be the less desirable adhesive failure of the bond in question. The uniform tension case results did not show a correlation between disbond size and bond strength. Localized tension was found to produce failure either as immediate tearing of the elastomer material outside the bond region or as complete peel-out of the seal in one piece. The obtained results represent a valuable benchmark for comparison in the future between adhesion loads under various separation conditions and composite seal bond strength.

  3. Fabrication of a high aspect ratio thick silicon wafer mold and electroplating using flipchip bonding for MEMS applications

    Science.gov (United States)

    Kim, Bong-Hwan; Kim, Jong-Bok

    2009-06-01

    We have developed a microfabrication process for high aspect ratio thick silicon wafer molds and electroplating using flipchip bonding with THB 151N negative photoresist (JSR micro). This fabrication technique includes large area and high thickness silicon wafer mold electroplating. The process consists of silicon deep reactive ion etching (RIE) of the silicon wafer mold, photoresist bonding between the silicon mold and the substrate, nickel electroplating and a silicon removal process. High thickness silicon wafer molds were made by deep RIE and flipchip bonding. In addition, nickel electroplating was developed. Dry film resist (ORDYL MP112, TOK) and thick negative-tone photoresist (THB 151N, JSR micro) were used as bonding materials. In order to measure the bonding strength, the surface energy was calculated using a blade test. The surface energy of the bonding wafers was found to be 0.36-25.49 J m-2 at 60-180 °C for the dry film resist and 0.4-1.9 J m-2 for THB 151N in the same temperature range. Even though ORDYL MP112 has a better value of surface energy than THB 151N, it has a critical disadvantage when it comes to removing residue after electroplating. The proposed process can be applied to high aspect ratio MEMS structures, such as air gap inductors or vertical MEMS probe tips.

  4. Fabrication of a high aspect ratio thick silicon wafer mold and electroplating using flipchip bonding for MEMS applications

    International Nuclear Information System (INIS)

    We have developed a microfabrication process for high aspect ratio thick silicon wafer molds and electroplating using flipchip bonding with THB 151N negative photoresist (JSR micro). This fabrication technique includes large area and high thickness silicon wafer mold electroplating. The process consists of silicon deep reactive ion etching (RIE) of the silicon wafer mold, photoresist bonding between the silicon mold and the substrate, nickel electroplating and a silicon removal process. High thickness silicon wafer molds were made by deep RIE and flipchip bonding. In addition, nickel electroplating was developed. Dry film resist (ORDYL MP112, TOK) and thick negative-tone photoresist (THB 151N, JSR micro) were used as bonding materials. In order to measure the bonding strength, the surface energy was calculated using a blade test. The surface energy of the bonding wafers was found to be 0.36–25.49 J m−2 at 60–180 °C for the dry film resist and 0.4–1.9 J m−2 for THB 151N in the same temperature range. Even though ORDYL MP112 has a better value of surface energy than THB 151N, it has a critical disadvantage when it comes to removing residue after electroplating. The proposed process can be applied to high aspect ratio MEMS structures, such as air gap inductors or vertical MEMS probe tips

  5. Hydrogen-induced rupture of strained Si─O bonds in amorphous silicon dioxide

    OpenAIRE

    El-Sayed, Al-Moatasem; Watkins, Matthew B.; Grasser, Tibor; Afanas'ev, Valery; Shluger, Alexander L

    2015-01-01

    Using ab initio modeling we demonstrate that H atoms can break strained Si─O bonds in continuous amorphous silicon dioxide (a-SiO(2)) networks, resulting in a new defect consisting of a threefold-coordinated Si atom with an unpaired electron facing a hydroxyl group, adding to the density of dangling bond defects, such as E' centers. The energy barriers to form this defect from interstitial H atoms range between 0.5 and 1.3 eV. This discovery of unexpected reactivity of atomic hydrogen may hav...

  6. A bonding study toward the quality assurance of Belle-II silicon vertex detector modules

    Science.gov (United States)

    Kang, K. H.; Jeon, H. B.; Park, H.; Uozumi, S.; Adamczyk, K.; Aihara, H.; Angelini, C.; Aziz, T.; Babu, V.; Bacher, S.; Bahinipati, S.; Barberio, E.; Baroncelli, T.; Basith, A. K.; Batignani, G.; Bauer, A.; Behera, P. K.; Bergauer, T.; Bettarini, S.; Bhuyan, B.; Bilka, T.; Bosi, F.; Bosisio, L.; Bozek, A.; Buchsteiner, F.; Casarosa, G.; Ceccanti, M.; Červenkov, D.; Chendvankar, S. R.; Dash, N.; Divekar, S. T.; Doležal, Z.; Dutta, D.; Forti, F.; Friedl, M.; Hara, K.; Higuchi, T.; Horiguchi, T.; Irmler, C.; Ishikawa, A.; Joo, C. W.; Kandra, J.; Kato, E.; Kawasaki, T.; Kodyš, P.; Kohriki, T.; Koike, S.; Kolwalkar, M. M.; Kvasnička, P.; Lanceri, L.; Lettenbicher, J.; Mammini, P.; Mayekar, S. N.; Mohanty, G. B.; Mohanty, S.; Morii, T.; Nakamura, K. R.; Natkaniec, Z.; Negishi, K.; Nisar, N. K.; Onuki, Y.; Ostrowicz, W.; Paladino, A.; Paoloni, E.; Pilo, F.; Profeti, A.; Rao, K. K.; Rashevskaia, I.; Rizzo, G.; Rozanska, M.; Sandilya, S.; Sasaki, J.; Sato, N.; Schultschik, S.; Schwanda, C.; Seino, Y.; Shimizu, N.; Stypula, J.; Tanaka, S.; Tanida, K.; Taylor, G. N.; Thalmeier, R.; Thomas, R.; Tsuboyama, T.; Urquijo, P.; Vitale, L.; Volpi, M.; Watanuki, S.; Watson, I. J.; Webb, J.; Wiechczynski, J.; Williams, S.; Würkner, B.; Yamamoto, H.; Yin, H.; Yoshinobu, T.

    2016-09-01

    A silicon vertex detector (SVD) for the Belle-II experiment comprises four layers of double-sided silicon strip detectors (DSSDs), assembled in a ladder-like structure. Each ladder module of the outermost SVD layer has four rectangular and one trapezoidal DSSDs supported by two carbon-fiber ribs. In order to achieve a good signal-to-noise ratio and minimize material budget, a novel chip-on-sensor "Origami" method has been employed for the three rectangular sensors that are sandwiched between the backward rectangular and forward (slanted) trapezoidal sensors. This paper describes the bonding procedures developed for making electrical connections between sensors and signal fan-out flex circuits (i.e., pitch adapters), and between pitch adapters and readout chips as well as the results in terms of the achieved bonding quality and pull force.

  7. Electronic structure and transport in silicon nano-structures with non-ideal bonding environments

    OpenAIRE

    Palaria, Amritanshu; Klimeck, Gerhard; Strachan, Alejandro

    2008-01-01

    As semiconductor devices scale down, the role of surfaces and interfaces becomes increasingly important. This effort seeks to develop methods for analysis of nano-structures, including the effect of surfaces, which represent a broader family of non-ideal bonding environments in the material, and evaluate the effects of such environments on device behavior. The presented work focuses on surfaces in 1-D silicon nanostructures. While a lot of theory and computational methods, particularly the e...

  8. Silicon nitride and intrinsic amorphous silicon double antireflection coatings for thin-film solar cells on foreign substrates

    International Nuclear Information System (INIS)

    Hydrogenated intrinsic amorphous silicon (a-Si:H) was investigated as a surface passivation method for crystalline silicon thin film solar cells on graphite substrates. The results of the experiments, including quantum efficiency and current density-voltage measurements, show improvements in cell performance. This improvement is due to surface passivation by an a-Si:H(i) layer, which increases the open circuit voltage and the fill factor. In comparison with our previous work, we have achieved an increase of 0.6% absolute cell efficiency for a 40 μm thick 4 cm2 aperture area on the graphite substrate. The optical properties of the SiNx/a-Si:H(i) stack were studied using spectroscopic ellipsometer techniques. Scanning transmission electron microscopy inside a scanning electron microscope was applied to characterize the cross section of the SiNx/a-Si:H(i) stack using focus ion beam preparation. - Highlights: • We report a 10.8% efficiency for thin-film silicon solar cell on graphite. • Hydrogenated intrinsic amorphous silicon was applied for surface passivation. • SiNx/a-Si:H(i) stacks were characterized by spectroscopic ellipsometer techniques. • Cross-section micrograph was obtained by scanning transmission electron microscopy. • Quantum efficiency and J-V measurements show improvements in the cell performance

  9. In situ metalation of free base phthalocyanine covalently bonded to silicon surfaces

    Directory of Open Access Journals (Sweden)

    Fabio Lupo

    2014-11-01

    Full Text Available Free 4-undecenoxyphthalocyanine molecules were covalently bonded to Si(100 and porous silicon through thermic hydrosilylation of the terminal double bonds of the undecenyl chains. The success of the anchoring strategy on both surfaces was demonstrated by the combination of X-ray photoelectron spectroscopy with control experiments performed adopting the commercially available 2,3,9,10,16,17,23,24-octakis(octyloxy-29H,31H-phthalocyanine, which is not suited for silicon anchoring. Moreover, the study of the shape of the XPS N 1s band gave relevant information on the interactions occurring between the anchored molecules and the substrates. The spectra suggest that the phthalocyanine ring interacts significantly with the flat Si surface, whilst ring–surface interactions are less relevant on porous Si. The surface-bonded molecules were then metalated in situ with Co by using wet chemistry. The efficiency of the metalation process was evaluated by XPS measurements and, in particular, on porous silicon, the complexation of cobalt was confirmed by the disappearance in the FTIR spectra of the band at 3290 cm−1 due to –NH stretches. Finally, XPS results revealed that the different surface–phthalocyanine interactions observed for flat and porous substrates affect the efficiency of the in situ metalation process.

  10. Silicon strain gages bonded on stainless steel using glass frit for strain sensor applications

    International Nuclear Information System (INIS)

    In this paper, a steel pressure sensor using strain gages bonded on a 17–4 PH stainless steel (SS) diaphragm based on glass frit technology is proposed. The strain gages with uniform resistance are obtained by growing an epi-silicon layer on a single crystal silicon wafer using epitaxial deposition technique. The inorganic glass frits are used as the bonding material between the strain gages and the 17–4 PH SS diaphragm. Our results show that the output performances of sensors at a high temperature of 125 °C are almost equal those at room temperature, which indicates that the glass frit bonding is a good method and may lead to a significant advance in the high temperature applicability of silicon strain gage sensors. Finally, the microstructure of the cured organic adhesive and the fired glass frit are compared. It may be concluded that the defects of the cured organic adhesive deteriorate the hysteresis and repeatability errors of the sensors. (paper)

  11. Silicon strain gages bonded on stainless steel using glass frit for strain sensor applications

    Science.gov (United States)

    Zhang, Zongyang; Cheng, Xingguo; Leng, Yi; Cao, Gang; Liu, Sheng

    2014-05-01

    In this paper, a steel pressure sensor using strain gages bonded on a 17-4 PH stainless steel (SS) diaphragm based on glass frit technology is proposed. The strain gages with uniform resistance are obtained by growing an epi-silicon layer on a single crystal silicon wafer using epitaxial deposition technique. The inorganic glass frits are used as the bonding material between the strain gages and the 17-4 PH SS diaphragm. Our results show that the output performances of sensors at a high temperature of 125 °C are almost equal those at room temperature, which indicates that the glass frit bonding is a good method and may lead to a significant advance in the high temperature applicability of silicon strain gage sensors. Finally, the microstructure of the cured organic adhesive and the fired glass frit are compared. It may be concluded that the defects of the cured organic adhesive deteriorate the hysteresis and repeatability errors of the sensors.

  12. Surface bonding on silicon surfaces as probed by tip-enhanced Raman spectroscopy

    Institute of Scientific and Technical Information of China (English)

    2010-01-01

    Tip-enhanced Raman spectroscopy (TERS) has been used to obtain the Raman signal of surface species on silicon single crystal surfaces without the necessity for surface enhancement by addition of Ag nanoparticles. By illuminating the hydrogen terminated silicon surface covered with a droplet of 4-vinylpyridine with UV light, a 4-ethylpyridine modified silicon surface can be easily obtained. By bringing a scanning tunneling microscope (STM) Au tip with a nanoscale tip apex to a distance of ca. 1 nm from the modified silicon surface, enhanced Raman signals of the silicon phonon vibrations and the surface-bonded 4-ethylpyridine were obtained. The Raman enhancement factor was estimated to be close to 107. By comparing the surface enhanced Raman scattering (SERS) signal obtained after surface enhancement with Ag nanoparticles and the TERS signal of the surface, the advantage of TERS over SERS for characterizing the surface species on substrates becomes apparent: TERS readily affords vibrational information about the system without disturbing it by surface enhancement. In this sense, TERS can be considered a truly non-invasive tool which is ideal for characterizing the actual surface species on substrates.

  13. Silver-catalyzed silicon-hydrogen bond functionalization by carbene insertion.

    Science.gov (United States)

    Iglesias, M José; Nicasio, M Carmen; Caballero, Ana; Pérez, Pedro J

    2013-01-28

    The catalytic functionalization of silicon-hydrogen bonds by means of the insertion of carbene units :CHCO(2)Et from ethyl diazoacetate (EDA) has been achieved using a silver-based catalyst, constituting the first example of this metal to promote this transformation. Competition experiments have revealed that the relative reactivity of substituted silanes depends on the bond dissociation energy of the Si-H bond (tertiary > secondary > primary for ethyl substituted). In the presence of bulky substituents such order reverts to secondary > primary ≈ tertiary (for phenyl substituted). Screening with other diazo compounds has shown that N(2)C(Ph)CO(2)Et displays similar reactivity to that of EDA, whereas other N(2)C(R)CO(2)Et (R = Me, CO(2)Et) gave lower conversions. PMID:23114570

  14. Damage Mechanisms and Controlled Crack Propagation in a Hot Pressed Silicon Nitride Ceramic. Ph.D. Thesis - Northwestern Univ., 1993

    Science.gov (United States)

    Calomino, Anthony Martin

    1994-01-01

    The subcritical growth of cracks from pre-existing flaws in ceramics can severely affect the structural reliability of a material. The ability to directly observe subcritical crack growth and rigorously analyze its influence on fracture behavior is important for an accurate assessment of material performance. A Mode I fracture specimen and loading method has been developed which permits the observation of stable, subcritical crack extension in monolithic and toughened ceramics. The test specimen and procedure has demonstrated its ability to generate and stably propagate sharp, through-thickness cracks in brittle high modulus materials. Crack growth for an aluminum oxide ceramic was observed to be continuously stable throughout testing. Conversely, the fracture behavior of a silicon nitride ceramic exhibited crack growth as a series of subcritical extensions which are interrupted by dynamic propagation. Dynamic initiation and arrest fracture resistance measurements for the silicon nitride averaged 67 and 48 J/sq m, respectively. The dynamic initiation event was observed to be sudden and explosive. Increments of subcritical crack growth contributed to a 40 percent increase in fracture resistance before dynamic initiation. Subcritical crack growth visibly marked the fracture surface with an increase in surface roughness. Increments of subcritical crack growth loosen ceramic material near the fracture surface and the fracture debris is easily removed by a replication technique. Fracture debris is viewed as evidence that both crack bridging and subsurface microcracking may be some of the mechanisms contributing to the increase in fracture resistance. A Statistical Fracture Mechanics model specifically developed to address subcritical crack growth and fracture reliability is used together with a damaged zone of material at the crack tip to model experimental results. A Monte Carlo simulation of the actual experiments was used to establish a set of modeling input

  15. Correlation of film density and wet etch rate in hydrofluoric acid of plasma enhanced atomic layer deposited silicon nitride

    Science.gov (United States)

    Provine, J.; Schindler, Peter; Kim, Yongmin; Walch, Steve P.; Kim, Hyo Jin; Kim, Ki-Hyun; Prinz, Fritz B.

    2016-06-01

    The continued scaling in transistors and memory elements has necessitated the development of atomic layer deposition (ALD) of silicon nitride (SiNx), particularly for use a low k dielectric spacer. One of the key material properties needed for SiNx films is a low wet etch rate (WER) in hydrofluoric (HF) acid. In this work, we report on the evaluation of multiple precursors for plasma enhanced atomic layer deposition (PEALD) of SiNx and evaluate the film's WER in 100:1 dilutions of HF in H2O. The remote plasma capability available in PEALD, enabled controlling the density of the SiNx film. Namely, prolonged plasma exposure made films denser which corresponded to lower WER in a systematic fashion. We determined that there is a strong correlation between WER and the density of the film that extends across multiple precursors, PEALD reactors, and a variety of process conditions. Limiting all steps in the deposition to a maximum temperature of 350 °C, it was shown to be possible to achieve a WER in PEALD SiNx of 6.1 Å/min, which is similar to WER of SiNx from LPCVD reactions at 850 °C.

  16. Effect of oxygen on structural stability of nitrogen-doped germanium telluride films with and without silicon nitride layer

    Energy Technology Data Exchange (ETDEWEB)

    Kim, Ki-Hong [AE group, Corporate Technology Operations SAIT, Samsung Electronics Co. Ltd. Yongin, 446-712 (Korea, Republic of); Choi, Sang-Jun, E-mail: sangjun5545.choi@samsung.com [System LSI, Samsung Electronics Co. Ltd., Yong-In, 446-712 (Korea, Republic of); Kyoung, Yong-Koo; Lee, Jun-Ho [AE group, Corporate Technology Operations SAIT, Samsung Electronics Co. Ltd. Yongin, 446-712 (Korea, Republic of)

    2012-03-30

    Nitrogen-doped germanium telluride (N-GeTe) films with and without silicon nitride (SiN) layer were thermally annealed in an air atmosphere. The SiN layer prevented the oxidation of GeTe films despite the massive in-diffusion of oxygen atoms. The phase transition from cubic to rhombohedral phase occurred only in the air-annealed samples, not in the samples annealed at 2.0 mPa. The in-diffused oxygen is probably the leading cause of this phase transition. N-GeTe films without SiN layer showed an increase in sheet resistance after 1000 min of air annealing; this could be attributable to a phase transition from the cubic GeTe phase to the amorphous germanium oxide and metallic tellurium phases. - Highlights: Black-Right-Pointing-Pointer SiN layer prevented oxidation of GeTe despite the massive in-diffusion of oxygen. Black-Right-Pointing-Pointer The in-diffused oxygen have a critical role in the changes of crystal structure. Black-Right-Pointing-Pointer N-GeTe exhibited phase transition into amorphous Ge oxide and metallic Te phase.

  17. Density functional theory study of ultrasmall diameter (2,2) boron nitride, silicon carbide, and carbon nanotubes

    Energy Technology Data Exchange (ETDEWEB)

    Fakhrabad, Davoud Vahedi; Shahtahmassebi, Nasser [Nano Research Center, Department of Physics, Ferdowsi University of Mashhad, Mashhad (Iran, Islamic Republic of); Movlarooy, Tayebeh [Department of Physics, Shahrood University of Technology, Shahrood (Iran, Islamic Republic of)

    2012-05-15

    We present a first principles calculation on the electronic structure and optical properties of ultrasmall-diameter (2,2) boron nitride, silicon carbide, and carbon nanotubes (BNNT, SiCNT, and CNT) by using full potential linear augmented plane wave (FP-LAPW) and pseudo potential plane wave (PP-PW) methods. The atomic geometries of all considered models are optimized. Calculations of optical spectra are performed under electric fields polarized both parallel and perpendicular with respect to the nanotube (NT) axis. Our results show that the dielectric function is anisotropic and it is revealed that (2,2) SiCNT would be better dielectric material than (2,2) BNNT. We have calculated the first, second and third optical transitions for the considered models. The value of the optical gap for (2,2) BNNT is obtained much larger than that of (2,2) SiCNT and (2,2) CNT. The results show that contrary to the (2,2) CNT being metallic, the (2,2) BNNT, and (2,2) SiCNT are wide indirect gap semiconductors. We also present the energy loss function; in this case the intertube interactions play an important role with respect to the optical spectroscopy. Our results revealed that unlike the dielectric function, the calculated energy loss function show rather weak anisotropy. (Copyright copyright 2012 WILEY-VCH Verlag GmbH and Co. KGaA, Weinheim)

  18. Formation of ion tracks in amorphous silicon nitride films with MeV C{sub 60} ions

    Energy Technology Data Exchange (ETDEWEB)

    Kitayama, T.; Morita, Y.; Nakajima, K. [Department of Micro Engineering, Kyoto University, Kyoto 606-8501 (Japan); Narumi, K.; Saitoh, Y. [Takasaki Advanced Radiation Research Institute, Japan Atomic Energy Agency, 1233 Watanuki-machi, Takasaki, Gunma 370-1292 (Japan); Matsuda, M.; Sataka, M. [Nuclear Science Research Institute, Japan Atomic Energy Agency, Tokai, Naka, Ibaraki 319-1195 (Japan); Tsujimoto, M.; Isoda, S. [Institute for Integrated Cell-Material Sciences, Kyoto University, Kyoto 606-8501 (Japan); Toulemonde, M. [CIMAP-GANIL (CEA-CNRS-ENSICAEN-Université de Caen Basse Normandie), Bd. H. Becquerel, 14070 Caen (France); Kimura, K., E-mail: kimura@kues.kyoto-u.ac.jp [Department of Micro Engineering, Kyoto University, Kyoto 606-8501 (Japan)

    2015-08-01

    Amorphous silicon nitride (a-SiN) films (thickness 5–100 nm) were irradiated with 0.12–5 MeV C{sub 60}, 100 MeV Xe, 200 MeV Kr, and 200 and 420 MeV Au ions. Ion tracks were clearly observed using high-angle annular dark field scanning transmission electron microscopy (HAADF-STEM) except for 100 MeV Xe and 200 MeV Kr. The observed HAADF-STEM images showed that the ion tracks consist of a low density core (0.5–2 nm in radius) and a high density shell (several nm in radius). The observed core and shell radii are not simply correlated with the electronic energy loss indicating that the nuclear energy loss plays an important role in the both core and shell formations. The observed track radii were well reproduced by the unified thermal spike model with two thresholds for shell and core formations.

  19. Fabrication and characterization of high performance AlGaN/GaN HEMTs on sapphire with silicon nitride passivation

    Energy Technology Data Exchange (ETDEWEB)

    Zhang Renping; Yan Wei; Yang Fuhua [State Key Laboratory for Superlattices and Microstructures, Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083 (China); Wang Xiaoliang, E-mail: zhangrenping@semi.ac.cn [Key Laboratory of Semiconductor Materials Science, Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083 (China)

    2011-06-15

    AlGaN/GaN high electron mobility transistors (HEMTs) with high performance were fabricated and characterized. A variety of techniques were used to improve device performance, such as AlN interlayer, silicon nitride passivation, high aspect ratio T-shaped gate, low resistance ohmic contact and short drain-source distance. DC and RF performances of as-fabricated HEMTs were characterized by utilizing a semiconductor characterization system and a vector network analyzer, respectively. As-fabricated devices exhibited a maximum drain current density of 1.41 A/mm and a maximum peak extrinsic transconductance of 317 mS/mm. The obtained current density is larger than those reported in the literature to date, implemented with a domestic wafer and processes. Furthermore, a unity current gain cut-off frequency of 74.3 GHz and a maximum oscillation frequency of 112.4 GHz were obtained on a device with an 80 nm gate length. (semiconductor devices)

  20. Controlled translocation of DNA through nanopores in carbon nano-, silicon-nitride- and lipid-coated membranes.

    Science.gov (United States)

    Sischka, Andy; Galla, Lukas; Meyer, Andreas J; Spiering, Andre; Knust, Sebastian; Mayer, Michael; Hall, Adam R; Beyer, André; Reimann, Peter; Gölzhäuser, Armin; Anselmetti, Dario

    2015-07-21

    We investigated experimentally and theoretically the translocation forces when a charged polymer is threaded through a solid-state nanopore and found distinct dependencies on the nanopore diameter as well as on the nano membrane material chemistry. For this purpose we utilized dedicated optical tweezers force mechanics capable of probing the insertion of negatively charged double-stranded DNA inside a helium-ion drilled nanopore. We found that both the diameter of the nanopore and the membrane material itself have significant influences on the electroosmotic flow through the nanopore and thus on the threading force. Compared to a bare silicon-nitride membrane, the threading of DNA through only 3 nm thin carbon nano membranes as well as lipid bilayer-coated nanopores increased the threading force by 15% or 85%, respectively. This finding was quantitatively described by our recently developed theoretical model that also incorporates hydrodynamic slip effects on the translocating DNA molecule and the force dependence on the membrane thickness. The additional measurements presented in this paper further support our model.

  1. Pressure Sensing in High-Refractive-Index Liquids Using Long-Period Gratings Nanocoated with Silicon Nitride

    Directory of Open Access Journals (Sweden)

    Jiahua Chen

    2010-12-01

    Full Text Available The paper presents a novel pressure sensor based on a silicon nitride (SiNx nanocoated long-period grating (LPG. The high-temperature, radio-frequency plasma-enhanced chemical-vapor-deposited (RF PECVD SiNx nanocoating was applied to tune the sensitivity of the LPG to the external refractive index. The technique allows for deposition of good quality, hard and wear-resistant nanofilms as required for optical sensors. Thanks to the SiNx nanocoating it is possible to overcome a limitation of working in the external-refractive-index range, which for a bare fiber cannot be close to that of the cladding. The nanocoated LPG-based sensing structure we developed is functional in high-refractive-index liquids (nD > 1.46 such as oil or gasoline, with pressure sensitivity as high as when water is used as a working liquid. The nanocoating developed for this experiment not only has the highest refractive index ever achieved in LPGs (n > 2.2 at λ = 1,550 nm, but is also the thinnest (

  2. Laser ablation of titanium nitride coated on silicon wafer substrate for depth profiling using ICP-MS

    Science.gov (United States)

    Lee, Jin Sook; Lim, H. B.

    2015-02-01

    Depth profiling of titanium nitride coated on silicon substrate at a thickness of 1 μm as a diffusion barrier for semiconductor application was studied using laser ablation (LA)-ICP-MS. The ablated particles and craters were characterized by SEM, TEM and a surface mapping microscope. Several unique characteristics were observed in this work. Although the laser beam had a short wavelength of 213 nm with flat energy, the ablated craters showed an inverse triangular shape, rather than a rectangular shape, with severe thermal degradation at the brink. In addition, the crater shape and depth were strongly dependent on the structure and thermal properties of the target. Since the TiN had a columnar structure with lower thermal conductivity and a higher melting point, it showed clear craters with less thermal degradation compared to Si substrate. The average rate of depth profiling was 40 nm per pulse. In addition, the repetition rate of the laser also significantly influenced the shape and depth of the craters. A low repetition rate produced deep craters due to high residual stress and providing sufficient time for energy concentration and heat dissipation, indicating that the repetition rate should be optimized for each material.

  3. Correlation of film density and wet etch rate in hydrofluoric acid of plasma enhanced atomic layer deposited silicon nitride

    Directory of Open Access Journals (Sweden)

    J. Provine

    2016-06-01

    Full Text Available The continued scaling in transistors and memory elements has necessitated the development of atomic layer deposition (ALD of silicon nitride (SiNx, particularly for use a low k dielectric spacer. One of the key material properties needed for SiNx films is a low wet etch rate (WER in hydrofluoric (HF acid. In this work, we report on the evaluation of multiple precursors for plasma enhanced atomic layer deposition (PEALD of SiNx and evaluate the film’s WER in 100:1 dilutions of HF in H2O. The remote plasma capability available in PEALD, enabled controlling the density of the SiNx film. Namely, prolonged plasma exposure made films denser which corresponded to lower WER in a systematic fashion. We determined that there is a strong correlation between WER and the density of the film that extends across multiple precursors, PEALD reactors, and a variety of process conditions. Limiting all steps in the deposition to a maximum temperature of 350 °C, it was shown to be possible to achieve a WER in PEALD SiNx of 6.1 Å/min, which is similar to WER of SiNx from LPCVD reactions at 850 °C.

  4. Annealing effects on recombinative activity of nickel at direct silicon bonded interface

    Energy Technology Data Exchange (ETDEWEB)

    Kojima, Takuto, E-mail: tkojima@toyota-ti.ac.jp; Ohshita, Yoshio; Yamaguchi, Masafumi [Toyota Technological Institute, 2-12-1 Hisakata, Tempaku-ku, Nagoya, 468-8511 (Japan)

    2015-09-15

    By performing capacitance transient analyses, the recombination activity at a (110)/(100) direct silicon bonded (DSB) interface contaminated with nickel diffused at different temperatures, as a model of grain boundaries in multicrystalline silicon, was studied. The trap level depth from the valence band, trap density of states, and hole capture cross section peaked at an annealing temperature of 300 °C. At temperatures ⩾400 °C, the hole capture cross section increased with temperature, but the density of states remained unchanged. Further, synchrotron-based X-ray analyses, microprobe X-ray fluorescence (μ-XRF), and X-ray absorption near edge structure (XANES) analyses were performed. The analysis results indicated that the chemical phase after the sample was annealed at 200 °C was a mixture of NiO and NiSi{sub 2}.

  5. Structural, hydrogen bonding and in situ studies of the effect of hydrogen dilution on the passivation by amorphous silicon of n-type crystalline (100) silicon surfaces

    OpenAIRE

    Meddeb, H.; Bearda, T.; Abdelraheem, Y.; Ezzaouia, H.; Gordon, I.; Szlufcik, J.; Poortmans, Jef

    2015-01-01

    Hydrogenated amorphous silicon (a-Si : H) layers deposited by chemical vapour deposition provide an attractive route to achieve high-performance crystalline silicon (c-Si) solar cells due to their deposition at low temperatures and their superior passivation quality. Hydrogen certainly plays an additional crucial role by passivating the dangling bonds, and thus improving the electrical and optical properties. In this work, we present the variation of the effective lifetime with the hydrogen d...

  6. Early stages of plasma induced nitridation of Si (111) surface and study of interfacial band alignment

    Energy Technology Data Exchange (ETDEWEB)

    Shetty, Satish; Shivaprasad, S. M., E-mail: smsprasad@jncasr.ac.in [International Centre for Materials Science, Jawaharlal Nehru Centre for Advanced Scientific Research, Bangalore 560064 (India)

    2016-02-07

    We report here a systematic study of the nitridation of the Si (111) surface by nitrogen plasma exposure. The surface and interface chemical composition and surface morphology are investigated by using RHEED, X-ray photoelectron spectroscopy, and atomic force microscopy (AFM). At the initial stage of nitridation two superstructures—“8 × 8” and “8/3 × 8/3”—form, and further nitridation leads to 1 × 1 stoichiometric silicon nitride. The interface is seen to have the Si{sup 1+} and Si{sup 3+} states of silicon bonding with nitrogen, which suggests an atomically abrupt and defect-free interface. The initial single crystalline silicon nitride layers are seen to become amorphous at higher thicknesses. The AFM image shows that the nitride nucleates at interfacial dislocations that are connected by sub-stoichiometric 2D-nitride layers, which agglomerate to form thick overlayers. The electrical properties of the interface yield a valence band offset that saturates at 1.9 eV and conduction band offset at 2.3 eV due to the evolution of the sub-stoichiometric interface and band bending.

  7. Conformal Titanium Nitride in a Porous Silicon Matrix: a Nanomaterial for In-Chip Supercapacitors

    OpenAIRE

    Grigoras, Kestutis; Keskinen, Jari; Grönberg, Leif; Yli-Rantala, Elina; Laakso, Sampo; Välimäki, Hannu; Kauranen, Pertti; Ahopelto, Jouni; Prunnila, Mika

    2016-01-01

    Today's supercapacitor energy storages are typically discrete devices aimed for printed boards and power applications. The development of autonomous sensor networks and wearable electronics and the miniaturisation of mobile devices would benefit substantially from solutions in which the energy storage is integrated with the active device. Nanostructures based on porous silicon (PS) provide a route towards integration due to the very high inherent surface area to volume ratio and compatibility...

  8. Single Photon Counting UV Solar-Blind Detectors Using Silicon and III-Nitride Materials

    OpenAIRE

    Nikzad, Shouleh; Hoenk, Michael; Jewell, April D.; John J. Hennessy; Alexander G. Carver; Jones, Todd J.; Goodsall, Timothy M.; Hamden, Erika T.; Suvarna, Puneet; Bulmer, J.; Shahedipour-Sandvik, F.; Charbon, Edoardo; Padmanabhan, Preethi; Hancock, Bruce; Bell, L. Douglas

    2016-01-01

    Ultraviolet (UV) studies in astronomy, cosmology, planetary studies, biological and medical applications often require precision detection of faint objects and in many cases require photon-counting detection. We present an overview of two approaches for achieving photon counting in the UV. The first approach involves UV enhancement of photon-counting silicon detectors, including electron multiplying charge-coupled devices and avalanche photodiodes. The approach used here employs molecular bea...

  9. Wire-bonded through-silicon vias with low capacitive substrate coupling

    International Nuclear Information System (INIS)

    Three-dimensional integration of electronics and/or MEMS-based transducers is an emerging technology that vertically interconnects stacked dies with through-silicon vias (TSVs). They enable the realization of circuits with shorter signal path lengths, smaller packages and lower parasitic capacitances, which results in higher performance and lower costs. This paper presents a novel technique for fabricating TSVs from bonded gold wires. The wires are embedded in a polymer, which acts both as an electrical insulator, resulting in low capacitive coupling toward the substrate and as a buffer for thermo-mechanical stress

  10. Hydrogen-induced rupture of strained Si─O bonds in amorphous silicon dioxide.

    Science.gov (United States)

    El-Sayed, Al-Moatasem; Watkins, Matthew B; Grasser, Tibor; Afanas'ev, Valery V; Shluger, Alexander L

    2015-03-20

    Using ab initio modeling we demonstrate that H atoms can break strained Si─O bonds in continuous amorphous silicon dioxide (a-SiO(2)) networks, resulting in a new defect consisting of a threefold-coordinated Si atom with an unpaired electron facing a hydroxyl group, adding to the density of dangling bond defects, such as E' centers. The energy barriers to form this defect from interstitial H atoms range between 0.5 and 1.3 eV. This discovery of unexpected reactivity of atomic hydrogen may have significant implications for our understanding of processes in silica glass and nanoscaled silica, e.g., in porous low-permittivity insulators, and strained variants of a-SiO(2). PMID:25839289

  11. Spontaneously-acoustic hypersound long-range stimulation of silicon nitride synthesis in silicon at argon ion irradiation

    CERN Document Server

    Demidov, E S; Markov, K A; Sdobnyakov, V V

    2001-01-01

    The work is dedicated to the nature of the average energy ions implantation process effect on the crystal defective system at the distances, exceeding by three-four orders the averagely projected ions run value. It is established that irradiation by the argon ions stimulated the Si sub 3 N sub 4 phase formation in the preliminarily nitrogen-saturated layers at the distances of approximately 600 mu m from the ions deceleration zone. It is supposed that there appear sufficiently effective pulse sources of the hypersonic shock waves in the area of the Ar sup + deceleration zone. These waves are the result of the jump-like origination and grid evolution of the loop-shaped dislocations and argon blisters as well as of the blisters explosion, The evaluations show that the peak pressure in wave due to the synchronized explosion of blisters in the nitrogen-saturated area on the reverse side of the silicon plate 600 mu m thick may exceed 10 sup 8 Pa and cause experimentally observed changes

  12. Silicon surface and bulk defect passivation by low temperature PECVD oxides and nitrides

    Energy Technology Data Exchange (ETDEWEB)

    Chen, Z.; Rohatgi, A. [Georgia Institute of Technology, Atlanta, GA (United States). Univ. Center of Excellence for Photovoltaics Research and Education; Ruby, D. [Sandia National Labs., Albuquerque, NM (United States)

    1995-01-01

    The effectiveness of PECVD passivation of surface and bulk defects in Si, as well as phosphorous diffused emitters, Is investigated and quantified. Significant hydrogen incorporation coupled with high positive charge density in the PECVD SiN layer is found to play an important role in bulk and surface passivation. It is shown that photo-assisted anneal in a forming gas ambient after PECVD depositions significantly improves the passivation of emitter and bulk defects. PECVD passivation of phosphorous doped emitters and boron doped bare Si surfaces is found to be a strong function of doping concentration. Surface recombination velocity of less than 200 cm/s for 0.2 Ohm-cm and less than 1 cm/s for high resistivity substrates ({approximately} Ohm-cm) were achieved. PECVD passivation improved bulk lifetime in the range of 30% to 70% in multicrystalline Si materials. However, the degree of the passivation was found to be highly material specific. Depending upon the passivation scheme, emitter saturation current density (J{sub oe}) can be reduced by a factor of 3 to 9. Finally, the stability of PECVD oxide/nitride passivation under prolonged UV exposure is established.

  13. Electrical and optical properties of silicon-doped gallium nitride polycrystalline films

    Indian Academy of Sciences (India)

    S R Bhattacharyya; A K Pal

    2008-02-01

    Si-doped GaN films in polycrystalline form were deposited on quartz substrates at deposition temperatures ranging from 300–623 K using r.f. sputtering technique. Electrical, optical and microstructural properties were studied for these films. It was observed that films deposited at room temperature contained mainly hexagonal gallium nitride (ℎ-GaN) while films deposited at 623 K were predominantly cubic (-GaN) in nature. The films deposited at intermediate temperatures were found to contain both the hexagonal and cubic phases of GaN. Studies on the variation of conductivity with temperature indicated Mott’s hopping for films containing -GaN while Efros and Shklovskii (E–S) hopping within the Coulomb gap was found to dominate the carrier transport mechanism in the films containing ℎ-GaN. A crossover from Mott’s hopping to E–S hopping in the `soft’ Coulomb gap was noticed with lowering of temperature for films containing mixed phases of GaN. The relative intensity of the PL peak at ∼ 2.73 eV to that for peak at ∼ 3.11 eV appearing due to transitions from deep donor to valence band or shallow acceptors decreased significantly at higher temperature. Variation of band gap showed a bowing behaviour with the amount of cubic phase present in the films.

  14. Selective layer disordering in intersubband Al0.028Ga0.972N/AlN superlattices with silicon nitride capping layer

    Science.gov (United States)

    Wierer, Jonathan J., Jr.; Allerman, Andrew A.; Skogen, Erik J.; Tauke-Pedretti, Anna; Vawter, Gregory A.; Montaño, Ines

    2015-06-01

    Selective layer disordering in an intersubband Al0.028Ga0.972N/AlN superlattice using a silicon nitride (SiNx) capping layer is demonstrated. The SiNx capped superlattice exhibits suppressed layer disordering under high-temperature annealing. Additionally, the rate of layer disordering is reduced with increased SiNx thickness. The layer disordering is caused by Si diffusion, and the SiNx layer inhibits vacancy formation at the crystal surface and ultimately, the movement of Al and Ga atoms across the heterointerfaces. Patterning of the SiNx layer results in selective layer disordering, an attractive method to integrate active and passive III-nitride-based intersubband devices.

  15. Liquid Phase Sintering (LPS) and Dielectric Constant of α-Silicon Nitride Ceramic

    Institute of Scientific and Technical Information of China (English)

    CHEN Changlian; CHEN Fei; SHEN Qiang; ZHANG Lianmeng; YAN Faqiang

    2006-01-01

    The spark plasma sintering (SPS) was applied to prepare α-Si3N4 ceramics of different densities with magnesia, silicon dioxide, alumina as the sintering aids. The mechanism of liquid phase sintering (LPS) was discussed and the factors influencing the density of the prepared samples were analyzed. The dielectric constant of sintered samples was tested. The experimental results show that the density can be controlled from 2.48 g/cm3 to 3.09 g/cm3 while the content of the sintering aids and the sintering temperature alter and the dielectric constant is closely dependent on the density of obtained samples.

  16. Effect of Silicon Nitride Incorporation on Microstructure and Hardness of Ni-Co Metal Matrix Nanocomposite

    OpenAIRE

    Ridwan; Marita Yusrini; ., Nurdin

    2015-01-01

    Ni-Co-Si3N4 nanocomposite coatings were prepared by electrodeposition technique. The deposition was performed at 50 mA cm-2 on copper substrate. The working temperature of electrodepostion was constant at 500C in an acidic environment of pH 4. The effects of silicon in the nickel-cobalt metal matrix composite were investigated. Energy dispersive X-ray spectroscopy was used to determine the composition. The Co content in the coatings is in the range 27-49 at.%. The phase present in the Ni-Co-S...

  17. A crystalline anionic complex of scandium nitride endometallofullerene: experimental observation of single-bonded (Sc3N@Ih-C80(-))2 dimers.

    Science.gov (United States)

    Konarev, Dmitri V; Zorina, Leokadiya V; Khasanov, Salavat S; Popov, Alexey A; Otsuka, Akihiro; Yamochi, Hideki; Saito, Gunzi; Lyubovskaya, Rimma N

    2016-09-14

    Reduction of scandium nitride clusterfullerene, Sc3N@Ih-C80, by sodium fluorenone ketyl in the presence of cryptand[2,2,2] allows the crystallization of the {cryptand[2,2,2](Na(+))}2(Sc3N@Ih-C80(-))2·2.5C6H4Cl2 (1) salt. The Sc3N@Ih-C80˙(-) radical anions are dimerized to form single-bonded (Sc3N@Ih-C80(-))2 dimers. PMID:27511304

  18. Fabrication and characterization of reaction bonded silicon carbide/carbon nanotube composites

    International Nuclear Information System (INIS)

    Carbon nanotubes have generated considerable excitement in the scientific and engineering communities because of their exceptional mechanical and physical properties observed at the nanoscale. Carbon nanotubes possess exceptionally high stiffness and strength combined with high electrical and thermal conductivities. These novel material properties have stimulated considerable research in the development of nanotube-reinforced composites (Thostenson et al 2001 Compos. Sci. Technol. 61 1899, Thostenson et al 2005 Compos. Sci. Technol. 65 491). In this research, novel reaction bonded silicon carbide nanocomposites were fabricated using melt infiltration of silicon. A series of multi-walled carbon nanotube-reinforced ceramic matrix composites (NT-CMCs) were fabricated and the structure and properties were characterized. Here we show that carbon nanotubes are present in the as-fabricated NT-CMCs after reaction bonding at temperatures above 1400 deg. C. Characterization results reveal that a very small volume content of carbon nanotubes, as low as 0.3 volume %, results in a 75% reduction in electrical resistivity of the ceramic composites. A 96% decrease in electrical resistivity was observed for the ceramics with the highest nanotube volume fraction of 2.1%

  19. The role of isovalency in the reactions of the cyano (CN), boron monoxide (BO), silicon nitride (SiN), and ethynyl (C2H) radicals with unsaturated hydrocarbons acetylene (C2H2) and ethylene (C2H4).

    Science.gov (United States)

    Parker, D S N; Mebel, A M; Kaiser, R I

    2014-04-21

    The classification of chemical reactions based on shared characteristics is at the heart of the chemical sciences, and is well exemplified by Langmuir's concept of isovalency, in which 'two molecular entities with the same number of valence electrons have similar chemistries'. Within this account we further investigate the ramifications of the isovalency of four radicals with the same X(2)Σ(+) electronic structure - cyano (CN), boron monoxide (BO), silicon nitride (SiN), and ethynyl (C2H), and their reactions with simple prototype hydrocarbons acetylene (C2H2) and ethylene (C2H4). The fact that these four reactants own the same X(2)Σ(+) electronic ground state should dictate the outcome of their reactions with prototypical hydrocarbons holding a carbon-carbon triple and double bond. However, we find that other factors come into play, namely, atomic radii, bonding orbital overlaps, and preferential location of the radical site. These doublet radical reactions with simple hydrocarbons play significant roles in extreme environments such as the interstellar medium and planetary atmospheres (CN, SiN and C2H), and combustion flames (C2H, BO). PMID:24418936

  20. Effect of Silicon Nitride Incorporation on Microstructure and Hardness of Ni-Co Metal Matrix Nanocomposite

    Directory of Open Access Journals (Sweden)

    Ridwan

    2015-01-01

    Full Text Available Ni-Co-Si3N4 nanocomposite coatings were prepared by electrodeposition technique. The deposition was performed at 50 mA cm-2 on copper substrate. The working temperature of electrodepostion was constant at 500C in an acidic environment of pH 4. The effects of silicon in the nickel-cobalt metal matrix composite were investigated. Energy dispersive X-ray spectroscopy was used to determine the composition. The Co content in the coatings is in the range 27-49 at.%. The phase present in the Ni-Co-Si3N4 were examined with an X-ray diffraction analysis. All the reflection patterns indicate that the coatings are having face-centered cubic (fcc structure. The microhardness of the Ni-Co-Si3N4 nanocomposite coating increases with increasing silicon content. The microhardness of the Ni-Co-Si3N4 nanocomposite coating increased from 549 HV for Nickel-cobalt alloy coating to 641 HV for Ni-Co-Si3N4 nanocomposite coating with 5.47 at.% Si.

  1. Effect of boron nitride coating on fiber-matrix interactions

    International Nuclear Information System (INIS)

    Coatings can modify fiber-matrix reactions and consequently interfacial bond strengths. Commercially available mullite, silicon carbide, and carbon fibers were coated with boron nitride via low pressure chemical vapor deposition and incorporated into a mullite matrix by hot-pressing. The influence of fiber-matrix interactions for uncoated fibers on fracture morphologies was studied. These observations are related to the measured values of interfacial shear strengths

  2. Redeposition in plasma-assisted atomic layer deposition: Silicon nitride film quality ruled by the gas residence time

    Energy Technology Data Exchange (ETDEWEB)

    Knoops, Harm C. M., E-mail: h.c.m.knoops@tue.nl, E-mail: w.m.m.kessels@tue.nl [Department of Applied Physics, Eindhoven University of Technology, P.O. Box 513, 5600 MB Eindhoven (Netherlands); Oxford Instruments Plasma Technology, North End, Bristol BS49 4AP (United Kingdom); Peuter, K. de; Kessels, W. M. M., E-mail: h.c.m.knoops@tue.nl, E-mail: w.m.m.kessels@tue.nl [Department of Applied Physics, Eindhoven University of Technology, P.O. Box 513, 5600 MB Eindhoven (Netherlands)

    2015-07-06

    The requirements on the material properties and growth control of silicon nitride (SiN{sub x}) spacer films in transistors are becoming ever more stringent as scaling of transistor structures continues. One method to deposit high-quality films with excellent control is atomic layer deposition (ALD). However, depositing SiN{sub x} by ALD has turned out to be very challenging. In this work, it is shown that the plasma gas residence time τ is a key parameter for the deposition of SiN{sub x} by plasma-assisted ALD and that this parameter can be linked to a so-called “redeposition effect”. This previously ignored effect, which takes place during the plasma step, is the dissociation of reaction products in the plasma and the subsequent redeposition of reaction-product fragments on the surface. For SiN{sub x} ALD using SiH{sub 2}(NH{sup t}Bu){sub 2} as precursor and N{sub 2} plasma as reactant, the gas residence time τ was found to determine both SiN{sub x} film quality and the resulting growth per cycle. It is shown that redeposition can be minimized by using a short residence time resulting in high-quality films with a high wet-etch resistance (i.e., a wet-etch rate of 0.5 nm/min in buffered HF solution). Due to the fundamental nature of the redeposition effect, it is expected to play a role in many more plasma-assisted ALD processes.

  3. Characterization of in-depth cavity distribution after thermal annealing of helium-implanted silicon and gallium nitride

    Energy Technology Data Exchange (ETDEWEB)

    Fodor, B., E-mail: fodor.balint@ttk.mta.hu [Institute for Technical Physics and Materials Science, Research Centre for Natural Sciences (MTA TTK MFA), 1121 Budapest, Konkoly Thege u. 29-33 (Hungary); Faculty of Science, University of Pécs, 7624 Pécs, Ifjúság útja 6 (Hungary); Cayrel, F. [GREMAN, pôle MTECH, Université François Rabelais, 16 rue Pierre et Marie Curie, B.P. 7155, F37071 Tours Cedex (France); Agocs, E. [Institute for Technical Physics and Materials Science, Research Centre for Natural Sciences (MTA TTK MFA), 1121 Budapest, Konkoly Thege u. 29-33 (Hungary); Doctoral School of Molecular- and Nanotechnologies, Faculty of Information Technology, University of Pannonia, Egyetem u. 10, Veszprem 8200 (Hungary); Alquier, D. [GREMAN, pôle MTECH, Université François Rabelais, 16 rue Pierre et Marie Curie, B.P. 7155, F37071 Tours Cedex (France); Fried, M.; Petrik, P. [Institute for Technical Physics and Materials Science, Research Centre for Natural Sciences (MTA TTK MFA), 1121 Budapest, Konkoly Thege u. 29-33 (Hungary); Doctoral School of Molecular- and Nanotechnologies, Faculty of Information Technology, University of Pannonia, Egyetem u. 10, Veszprem 8200 (Hungary)

    2014-11-28

    Single-crystalline silicon wafers covered with sacrificial oxide layer and epitaxially grown gallium nitride layers were implanted with high-fluence helium ions (2–6 × 10{sup 16} cm{sup −2}) at energies of 20–30 keV. Thermal annealings at 650–1000 °C, 1 h were performed on the Si samples and rapid thermal annealings at 600–1000 °C, 120 s under N{sub 2} were performed on the GaN samples. The as-implanted samples and the near-surface cavity distributions of the annealed samples were investigated with variable angle spectroscopic ellipsometry. In-depth defect profiles and cavity profiles can be best described with multiple independent effective medium sublayers of varying ratio of single-crystal/void. The number of sublayers was chosen to maximize the fit quality without a high parameter cross-correlation. The dependence of the implantation fluence, oxide layer thickness and annealing temperature on the cavity distribution was separately investigated. The ellipsometric fitted distributions were compared and cross-checked with analyses of transmission electron micrographs where the average surface cavity was determined sublayer by sublayer. The in-depth profiles were also compared with simulations of He and vacancy distributions. - Highlights: • He implanted and annealed Si and GaN measured by spectroscopic ellipsometry • Effective medium approximation models developed • Cavity formation as function of oxide thickness, ion dose, annealing temperature • Cavity in-depth distributions compared with transmission electron micrographs.

  4. Mechanical and Tribological Performance of Graphite/Silicon Nitride Composites: A Comparison between Pressureless and Spark Plasma Sinter Processing

    Science.gov (United States)

    Maiti, Subrata Kr.; Sarkar, Soumya; Wani, Md. Farooq; Das, Probal Kumar

    2015-12-01

    Graphite particle (GP)-reinforced silicon nitride (Si3N4) composites were fabricated using pressureless sintering (PLS) and spark plasma sintering (SPS) in the presence of Y2O3-AlN-SiO2 ternary system. Different densification behaviors of the specimens fabricated by PLS and SPS were observed. While increasing GP content drastically reduced matrix densification during PLS at 2023 K (1750 °C) with 2 hours dwell, SPS at 1923 K (1650 °C) for only 10 minute under 50 MPa pressure resulted in much dense composites even up to 3.5 wt pct GP loading. Mechanical and tribological characterizations revealed that SPS-ed composites can offer improved performance compared to pure Si3N4. SPS-ed 1.5 wt pct GP/Si3N4 composite offered the highest resistance to wear up to 20 N normal load. Wear rate ( W R) of that composite reduced by ~24 pct than that obtained for pure Si3N4 ( W R ≈ 1.14 × 10-3 mm3/N m). Furthermore, W R of SPS-ed 2.5 wt pct GP/Si3N4 composite at F N = 10 to 20 N was found to be only ~1/8th of W R values of PLS-ed 2.5 wt pct GP/Si3N4 composite (10N W R ≈ 6.61 × 10-3 mm3/Nm; 20N W R ≈ 9.45 × 10-3 mm3/Nm). Present study indicated promising opportunity of SPS for fabricating improved Si3N4 composites through GP addition. The reinforcing particles not only rendered its self-lubrication effect to SPS consolidated composites but also significantly promoted the rate of matrix densification during SPS cycle by the virtue of its high thermal and electrical conducting nature.

  5. Specific Neuron Placement on Gold and Silicon Nitride-Patterned Substrates through a Two-Step Functionalization Method.

    Science.gov (United States)

    Mescola, Andrea; Canale, Claudio; Prato, Mirko; Diaspro, Alberto; Berdondini, Luca; Maccione, Alessandro; Dante, Silvia

    2016-06-28

    The control of neuron-substrate adhesion has been always a challenge for fabricating neuron-based cell chips and in particular for multielectrode array (MEA) devices, which warrants the investigation of the electrophysiological activity of neuronal networks. The recent introduction of high-density chips based on the complementary metal oxide semiconductor (CMOS) technology, integrating thousands of electrodes, improved the possibility to sense large networks and raised the challenge to develop newly adapted functionalization techniques to further increase neuron electrode localization to avoid the positioning of cells out of the recording area. Here, we present a simple and straightforward chemical functionalization method that leads to the precise and exclusive positioning of the neural cell bodies onto modified electrodes and inhibits, at the same time, cellular adhesion in the surrounding insulator areas. Different from other approaches, this technique does not require any adhesion molecule as well as complex patterning technique such as μ-contact printing. The functionalization was first optimized on gold (Au) and silicon nitride (Si3N4)-patterned surfaces. The procedure consisted of the introduction of a passivating layer of hydrophobic silane molecules (propyltriethoxysilane [PTES]) followed by a treatment of the Au surface using 11-amino-1-undecanethiol hydrochloride (AT). On model substrates, well-ordered neural networks and an optimal coupling between a single neuron and single micrometric functionalized Au surface were achieved. In addition, we presented the preliminary results of this functionalization method directly applied on a CMOS-MEA: the electrical spontaneous spiking and bursting activities of the network recorded for up to 4 weeks demonstrate an excellent and stable neural adhesion and functional behavior comparable with what expected using a standard adhesion factor, such as polylysine or laminin, thus demonstrating that this procedure can be

  6. High resolution medium energy ion scattering study of silicon oxidation and oxy nitridation

    International Nuclear Information System (INIS)

    Full text: Silicon oxide is likely to remain the material of choice for gate oxides in microelectronics for the foreseeable future. As device become ever smaller and faster, the thickness of these layers in commercial products is predicted to be less than 50 Angstroms in just a few years. An understanding of such devices will therefore likely to be based on microscopic concepts and should now be investigated by atomistic techniques. With medium energy ion scattering (MEIS) using an electrostatic energy analyzer, depth profiling of thin (<60 Angstroms) silicon oxide films on Si(100) with 3 - 5 Angstroms depth resolution in the near region has been done. The growth mechanism of thin oxide films on Si(100) has been studied, using sequential oxygen isotope exposures. It is found that the oxide films are stoichiometric to within approx. 10 Angstroms of the interface. It is also found that the oxidation reactions occur at the surface, in the transition region and at interface, with only the third region being included in the conventional (Deal-Grove) model for oxide formation. Nitrogen is sometimes added to gate oxides, as it has been found empirically that his improves some of the electrical properties. The role, location and even the amount of nitrogen that exists in such films are poorly understood, and represent interesting analytical challenges. MEIS data will be presented that address these questions, measured for a number of different processing conditions. We have recently demonstrated how to perform nitrogen nano-engineering in such ultrathin gate dielectrics, and these results will also be discussed

  7. A Fabrication Route for Arrays of Ultra-low-Noise MoAu Transition Edge Sensors on Thin Silicon Nitride for Space Applications

    OpenAIRE

    Glowacka, D. M.; Crane, M.; Goldie, D. J.; Withington, S.

    2014-01-01

    We describe a process route to fabricate arrays of Ultra-low-Noise MoAu Transition Edge Sensors (TESs). The low thermal conductance required for space applications is achieved using 200 nm-thick Silicon Nitride (SiNx ) patterned to form long-thin legs with widths of 2.1 {\\mu}m. Using bilayers formed on SiNx islands from films with 40 nm-thick Mo and Au thicknesses in the range 30 to 280 nm deposited by dc-sputtering in ultra-high vacuum we can obtain tunable transition temperatures in the ran...

  8. Nature of traps responsible for the memory effect in silicon nitride

    Science.gov (United States)

    Gritsenko, V. A.; Perevalov, T. V.; Orlov, O. M.; Krasnikov, G. Ya.

    2016-08-01

    Nature of traps responsible for the memory effect in Si3N4 still remains the subject matter of much discussion. Based on our quantum chemical simulation results, Si-Si bonds can be identified as traps for electrons and holes with localization energies falling within the ranges of Wt e = 1.2 - 1.7 eV and Wt h = 0.9 - 1.4 eV . Within the multiphonon trap ionization model, our experimental data on Si3N4 conductivity have allowed us to evaluate the thermal ionization energies of electron and hole traps in Si3N4 as Wt e = Wt h = 1.4 eV . The same value of 1.4 eV was obtained as half the Stokes shift of the 2.4 eV green photoluminescence line observed in Si3N4 films under excitation with 5.2 eV. Thus, the data obtained in the present study strongly suggest that Si-Si bonds are responsible for localization of electrons and holes in Si3N4.

  9. Microstructure and mechanical behavior of 6061Al reinforced with silicon nitride particles, processed by powder metallurgy

    Energy Technology Data Exchange (ETDEWEB)

    Amigo, V.; Ortiz, J.L.; Salvador, M.D.

    2000-01-31

    A critical step in the processing of Metal Matrix Composites (MMCs) reinforced with ceramic particles is the insertion of these particles into the metal matrix alloy. This greatly influences the strength of the composite since it is controlled by the metal-particle interfacial bond strength. Because of the difficulty in wetting ceramic particles with molten metal, the Powder Metallurgy or PM route was developed. Powder Extrusion consolidates the composite to over 98% dense, and can be carried out below the Solidus Temperature of the alloy. The most important aspect of the microstructure is the distribution of the reinforcing particles, and this depends on the processing and fabrication routes involved, as well as the relative size of the matrix and reinforcing particles. Extrusion can homogenize the structure to some extent, but minimizing reinforcement inhomogeneity during initial processing is important to achieve optimum properties.

  10. Experimental investigation on material migration phenomena in micro-EDM of reaction-bonded silicon carbide

    Energy Technology Data Exchange (ETDEWEB)

    Liew, Pay Jun [Department of Mechanical Systems and Design, Tohoku University, Aramaki Aoba 6-6-01, Aoba-ku, Sendai, 980-8579 (Japan); Manufacturing Process Department, Faculty of Manufacturing Engineering, Universiti Teknikal Malaysia Melaka, Hang Tuah Jaya, 76100, Durian Tunggal, Melaka (Malaysia); Yan, Jiwang, E-mail: yan@mech.keio.ac.jp [Department of Mechanical Engineering, Faculty of Science and Technology, Keio University, Hiyoshi 3-14-1, Kohoku-ku, Yokohama, 223-8522 (Japan); Kuriyagawa, Tsunemoto [Department of Mechanical Systems and Design, Tohoku University, Aramaki Aoba 6-6-01, Aoba-ku, Sendai, 980-8579 (Japan)

    2013-07-01

    Material migration between tool electrode and workpiece material in micro electrical discharge machining of reaction-bonded silicon carbide was experimentally investigated. The microstructural changes of workpiece and tungsten tool electrode were examined using scanning electron microscopy, cross sectional transmission electron microscopy and energy dispersive X-ray under various voltage, capacitance and carbon nanofibre concentration in the dielectric fluid. Results show that tungsten is deposited intensively inside the discharge-induced craters on the RB-SiC surface as amorphous structure forming micro particles, and on flat surface region as a thin interdiffusion layer of poly-crystalline structure. Deposition of carbon element on tool electrode was detected, indicating possible material migration to the tool electrode from workpiece material, carbon nanofibres and dielectric oil. Material deposition rate was found to be strongly affected by workpiece surface roughness, voltage and capacitance of the electrical discharge circuit. Carbon nanofibre addition in the dielectric at a suitable concentration significantly reduced the material deposition rate.

  11. Structural, dynamical, electronic, and bonding properties of laser-heated silicon: An ab initio molecular-dynamics study

    NARCIS (Netherlands)

    Silvestrelli, P.-L.; Alavi, A.; Parrinello, M.; Frenkel, D.

    1997-01-01

    The method of ab initio molecular dynamics, based on finite-temperature density-functional theory, is used to simulate laser heating of crystalline silicon. We found that a high concentration of excited electrons dramatically weakens the covalent bonding. As a result the system undergoes a melting t

  12. PECVD synthesis, optical and mechanical properties of silicon carbon nitride films

    Energy Technology Data Exchange (ETDEWEB)

    Ermakova, Evgeniya; Rumyantsev, Yurii [Nikolaev Institute of Inorganic Chemistry SB RAS, 630090 Novosibirsk (Russian Federation); Shugurov, Artur [Institute of Strength Physics and Materials Science SB RAS, 634021 Tomsk (Russian Federation); Panin, Alexey [Institute of Strength Physics and Materials Science SB RAS, 634021 Tomsk (Russian Federation); National Research Tomsk Polytechnic University, 634050 Tomsk (Russian Federation); Kosinova, Marina, E-mail: marina@niic.nsc.ru [Nikolaev Institute of Inorganic Chemistry SB RAS, 630090 Novosibirsk (Russian Federation)

    2015-06-01

    Highlights: • SiC{sub x}/SiC{sub x}N{sub y}/SiN{sub y} films were prepared by PECVD from trimethylphenylsilane and NH{sub 3} mixture. • By varying the ammonia dilution, films changing from SiC{sub x}-like to SiN{sub x}-like were synthesized. • The SiN{sub x}-like films deposited at elevated temperature under ammonia dilution possessed high transmittance, hardness of 23 GPa and Young's modulus of 180 GPa. - Abstract: SiC{sub x}N{sub y} thin films were synthesized at a temperature of 700 °C by the PECVD process, using trimethylphenylsilane C{sub 6}H{sub 5}Si(CH{sub 3}){sub 3} (TMPhS) and ammonia as a reactive mixture. The effect of NH{sub 3} dilution on the structure and chemical bonding of SiC{sub x}N{sub y} films was investigated by Fourier transform infrared spectroscopy, X-ray photoelectron spectroscopy, Raman spectroscopy, high-resolution transmission electron microscopy and energy-dispersive X-ray analysis. The influence of deposition conditions on the transmittance, the optical band gap, the hardness and the Young's modulus of SiC{sub x}N{sub y} films was studied. It was shown that the chemical composition and the functional properties of the films are governed by the initial pressure ratio of NH{sub 3} to TMPhS. The variation of the ratio enables the film of different composition to be deposited, e.g. SiC{sub x}, SiC{sub x}N{sub y} and SiN{sub y}. It was shown that the films deposited from a reactive mixture with the highest ammonia dilution had a transmittance comparable to that of SiO{sub 2} and hardness of 23 GPa.

  13. Development and Characterization of the Bonding and Integration Technologies Needed for Fabricating Silicon Carbide Based Injector Components

    Science.gov (United States)

    Halbig,Michael C.; Singh, Mrityunjay

    2008-01-01

    Advanced ceramic bonding and integration technologies play a critical role in the fabrication and application of silicon carbide based components for a number of aerospace and ground based applications. One such application is a lean direct injector for a turbine engine to achieve low NOx emissions. Ceramic to ceramic diffusion bonding and ceramic to metal brazing technologies are being developed for this injector application. For the diffusion bonding technology, titanium interlayers (coatings and foils) were used to aid in the joining of silicon carbide (SiC) substrates. The influence of such variables as surface finish, interlayer thickness, and processing time were investigated. Electron microprobe analysis was used to identify the reaction formed phases. In the diffusion bonds, an intermediate phase, Ti5Si3Cx, formed that is thermally incompatible in its thermal expansion and caused thermal stresses and cracking during the processing cool-down. Thinner interlayers of pure titanium and/or longer processing times resulted in an optimized microstructure. Tensile tests on the joined materials resulted in strengths of 13-28 MPa depending on the SiC substrate material. Nondestructive evaluation using ultrasonic immersion showed well formed bonds. For the joining technology of brazing Kovar fuel tubes to silicon carbide, preliminary development of the joining approach has begun. Various technical issues and requirements for the injector application are addressed.

  14. Electron transport through dangling-bond silicon wires on H-passivated Si(100)

    International Nuclear Information System (INIS)

    We compute the electron transmission through different types of dangling-bond wire on Si(100)-H (2 × 1). Recent progress in the construction of atomic-size interconnects (Weber et al 2012 Science 335 64) shows the possibility to achieve atomic-size circuits via atomic-size wires using silicon surfaces. Hence, electron transport through quasi-1D Si-based structures is a compelling reality. Prior to these achievements, wires formed by controlled desorption of passivating H atoms off the monohydride Si(100) surface have been shown to be subject to 1D correlations and instabilities (Hitosugi et al 1999 Phys. Rev. Lett. 82 4034). The present calculations are based on density functional theory and evaluate the electron transmission though the minimum-energy 1D structures that can be formed when creating dangling-bonds on Si(100)-(2 × 1)-H. The purpose of this study is twofold: (i) to assess the transport properties of these atomic-size wires in the presence of 1D instabilities; (ii) to provide a fingerprint for experimental identification of the instability through the transport characteristics of the wires. To these aims, we evaluate the electron transport through the wires in the absence of instabilities, in the presence of distortions (Jahn-Teller instabilities) and in the presence of magnetic instabilities (ferro- and antiferro-ordering). We find that instabilities substantially reduce the transport capabilities of dangling-bond wires leading to transmissions that vary so differently with electron energy that an unambiguous identification of the wire type should be accessible in transport experiments.

  15. Glass frit bonding with controlled width and height using a two-step wet silicon etching procedure

    Science.gov (United States)

    Yifang, Liu; Daner, Chen; Liwei, Lin; Gaofeng, Zheng; Jianyi, Zheng; Lingyun, Wang; Daoheng, Sun

    2016-03-01

    A simple and versatile two-step silicon wet etching technique for the control of the width and height of the glass frit bonding layer has been developed to improve bonding strength and reliability in wafer-level microelectromechanical systems (MEMS) packaging processes. The height of the glass frit bonding layer is set by the design of a vertical reference wall which regulates the distance between the silicon wafer and the encapsulation capping substrate. On the other hand, the width of the bonding layer is constrained between two micro grooves which are used to accommodate the spillages of extra glass frit during the bonding process. An optimized thermal bonding process, including the formation of glass liquid, removal of gas bubbles under vacuum and the filling of voids under normal atmospheric condition has been developed to suppress the formation of the bubbles/voids. The stencil printing and pre-sintering processes for the glass frit have been characterized before the thermal bonding process under different magnitudes of bonding pressure. The bonding gap thickness is found to be equal to the height of the reference wall of 10 μm in the prototype design. The bubbles/voids are found to be suppressed effectively and the bonding strength increases from 10.2 to 19.1 MPa as compared with a conventional thermal annealing process in air. Experimentally, prototype samples are measured to have passed the high hermetic sealing leakage tests of 5  ×  10-8 atm cc s-1.

  16. Influence of additive system (Al2O3-RE2O3 , RE = Y, La, Nd, Dy, Yb on microstructure and mechanical properties of silicon nitride-based ceramics

    Directory of Open Access Journals (Sweden)

    Juliana Marchi

    2009-06-01

    Full Text Available Silicon nitride based ceramics have been widely used as structural ceramics, due mainly to their thermo-mechanical properties such as high density, high thermal shock resistance, corrosion resistance and chemical stability. The aim of this study was to determine the influence of rare earth and aluminum oxide additions as sintering aids on densification, microstructure and mechanical properties of silicon nitride. Silicon nitride mixtures with 91 wt. (% Si3N4 and 9% wt. (% additives were prepared and sintered. The density, microstructure and mechanical properties of the sintered specimens of these mixtures were determined. In most specimens, scanning electron microscopic examination and X ray diffraction analysis revealed elongated grains of β-Si3N4 with aspect ratio of about 2.0 and dispersed in a glassy phase. The density of the sintered specimens was higher than 94% of the theoretical density (td and specimens with La2O3 and Al2O3 additions exhibited the highest value. The results of this investigation indicate that the rare earth ion size influences densification of silicon nitride, but this correlation was not observed in specimens containing two different rare earth oxides. The hardness values varied in direct proportion to the density of the specimens and the fracture toughness values were influenced by the composition of the intergranular glassy phase.

  17. Bonding distances as Exact Sums of the Radii of the Constituent Atoms in Nanomaterials - Boron Nitride and Coronene

    OpenAIRE

    Heyrovska, Raji

    2010-01-01

    This paper presents for the first time the exact structures at the atomic level of two important nanomaterials, boron nitride and coronene. Both these compounds are hexagonal layer structures similar to graphene in two dimensions and to graphite in three-dimensions. However, they have very different properties: whereas graphene is a conductor, h-BN is an electrical insulator and coronene is a polycyclic aromatic hydrocarbon of cosmological interest. The atomic structures presented here for bo...

  18. Wafer-level integration of NiTi shape memory alloy on silicon using Au-Si eutectic bonding

    Science.gov (United States)

    Gradin, Henrik; Bushra, Sobia; Braun, Stefan; Stemme, Göran; van der Wijngaart, Wouter

    2013-01-01

    This paper reports on the wafer level integration of NiTi shape memory alloy (SMA) sheets with silicon substrates through Au-Si eutectic bonding. Different bond parameters, such as Au layer thicknesses and substrate surface treatments were evaluated. The amount of gold in the bond interface is the most important parameter to achieve a high bond yield; the amount can be determined by the barrier layers between the Au and Si or by the amount of Au deposition. Deposition of a gold layer of more than 1 μm thickness before bonding gives the most promising results. Through patterning of the SMA sheet and by limiting bonding to small areas, stresses created by the thermal mismatch between Si and NiTi are reduced. With a gold layer of 1 μm thickness and bond areas between 200 × 200 and 800 × 800 μm2 a high bond strength and a yield above 90% is demonstrated.

  19. Manufacture of Φ1.2m reaction bonded silicon carbide mirror blank CFID

    Science.gov (United States)

    Zhang, Ge; Zhao, Rucheng; Zhao, Wenxing; Bao, Jianxun

    2010-05-01

    Silicon carbide (SiC) is a new type candidate material for large-scale lightweight space mirror. Its low thermal distortion, high stiffness, fine optical quality and dimensional stability, make SiC an ideal material for large space born telescope. Since ten years Changchun institute optics, fine mechanics and physics (CIOMP) has developed reaction bonded SiC (RB-SiC) technology for space application, and can fabricate RB-SiC mirror with scale less than 1.0 meter for telescope. The green body is prepared with gel-casting method which is an attractive new ceramic forming process for making high-quality, complex-shaped ceramic parts. And then unmolding, drying, binder burning out, reacting bonded, the RB-SiC can be obtained. But with the development of space-born or ground telescope, the scale of primary mirror has exceeded 1.0 meter. So CIOMP has developed an assembly technique which called novel reaction-formed joint technology for larger RB-SiC mirror blank. The steps include joining of green bodies with mixture comprised of SiC particles and phenolic resin etc, firing, machining and sintering. Joining the Φ1.2 meter RB-SiC mirror blank by the novel reaction-formed joint technology. And testing the welding layer's performance, the results show that the thickness of 54-77μm, the microstructure and thermal property can be comparable to the substrate and the mechanical property are excellent in bending strength of 307MPa.

  20. Reduced stability of copper interconnects due to wrinkles and steps on hexagonal boron nitride substrates

    Science.gov (United States)

    Gao, Jian; Chow, Philippe K.; Thomas, Abhay V.; Lu, Toh-Ming; Borca-Tasciuc, Theodorian; Koratkar, Nikhil

    2014-09-01

    There is great scientific and technological interest in the use of chemical-vapor-deposition grown hexagonal boron nitride dielectric substrates for microelectronics applications. This interest stems from its superior heat spreading capability compared to silicon dioxide as well as the lack of surface dangling bonds or charge traps in hexagonal boron nitride which results in superior performance for graphene based electronics devices. However, surface heterogeneities, such as wrinkles or steps, are ubiquitous in such devices due to the fabrication and processing of chemical vapor deposition grown hexagonal boron nitride. In this study, we characterize the effect of such surface heterogeneities on the stability of copper interconnects used in microelectronics devices. Based on the theoretical thermo-physical properties of the constituent thin film layers, our simulations predict that copper interconnects deposited on hexagonal boron nitride can withstand ˜1.9 times more power than on a silicon dioxide substrate, due to its superior in-plane thermal conductivity. However, our electrical measurements reveal that copper wires melt and fail at consistently lower current densities on hexagonal boron nitride than on silicon dioxide. This was verified by testing in air as well as under vacuum. Scanning electron microscopy and atomic force microscopy characterization of the hexagonal boron nitride surface indicates that this contradictory result is due to nanoscale surface non-uniformities (i.e., wrinkles and steps) which are omnipresent in chemical-vapor-deposition grown and transferred hexagonal boron nitride films. Our results highlight the critical need for improved processing methods before large-scale microelectronics applications of chemical vapor deposition grown hexagonal boron nitride can be realized.

  1. Effect of Sintering Additives on the Nitridation and Densification Behavior of Si—SiC Composite

    Institute of Scientific and Technical Information of China (English)

    K.Amoako-Appiagyei; SooYoungLee; 等

    1999-01-01

    Most of the thermo-mechanical properties of reaction bonded silicon nitride,including a second phase such as SiC depend on the final denstiy and the grain boundary glass phase of the sintered material .Thus it is necessary to know the sintering aid system most effective for the Si0-SiC compostie system ,Sintering experiments carried out using different combinations of sintering aids has indicated that two combinations,i.e.,(a) yttria with alumina and (b) yttia with aluminium nitride are effective sintering aid systems for the reation bonded Si-SiC composites.Adensity of 98.5% theoretical was obtained with yttria and aluminium nitride system.

  2. A Fabrication Route for Arrays of Ultra-low-Noise MoAu Transition Edge Sensors on Thin Silicon Nitride for Space Applications

    CERN Document Server

    Glowacka, D M; Goldie, D J; Withington, S

    2014-01-01

    We describe a process route to fabricate arrays of Ultra-low-Noise MoAu Transition Edge Sensors (TESs). The low thermal conductance required for space applications is achieved using 200 nm-thick Silicon Nitride (SiNx ) patterned to form long-thin legs with widths of 2.1 {\\mu}m. Using bilayers formed on SiNx islands from films with 40 nm-thick Mo and Au thicknesses in the range 30 to 280 nm deposited by dc-sputtering in ultra-high vacuum we can obtain tunable transition temperatures in the range 700 to 70 mK. The sensors use large-area absorbers fabricated from high resistivity, thin-film beta-phase Ta to provide impedance-matching to incident radiation. The absorbers are patterned to reduce the heat capacity associated with the nitride support structure and include Au thermalizing features to assist the heat flow into the TES. Arrays of 400 detectors at the pixel spacing required for the long-wavelength band of the far-infrared instrument SAFARI are now being fabricated. Device yields approaching 99% are achi...

  3. Using nano hexagonal boron nitride particles and nano cubic silicon carbide particles to improve the thermal conductivity of electrically conductive adhesives

    Science.gov (United States)

    Cui, Hui-wang; Li, Dong-sheng; Fan, Qiong

    2013-01-01

    To satisfy the high electrical and thermal conductivity required for the continuous development of electronic products, nano hexagonal boron nitride (BN) particles and nano cubic silicon carbide (SiC) particles were added into electrically conductive adhesives (ECAs) to improve the thermal conductivity. BN and SiC had little negative effect on the electrical conductivity, but improved the thermal conductivity significantly. When their content was 1.5 wt. %, the thermal conductivity at 100°C, 150°C and 200°C was increased by 71% (100°C), 78% (150°C) and 70% (200°C), and 114% (100°C), 110% (150°C) and 98% (200°C) respectively for BN and SiC comparing with those of the ECAs with no thermal conductive fillers. This method is simple, easy to do, and can be used practically in electronic packaging.

  4. Preliminary study on the use of ceramic nozzle arrays in gas dynamic lasers. Final report, 1 Jan--1 Dec 1974. [Silicon nitride

    Energy Technology Data Exchange (ETDEWEB)

    Jacobson, L.A.; Drewry, J.E.

    1975-04-01

    One of the more difficult and costly problem areas in the development of high energy gas dynamic lasers (GDL) has been the nozzle array which is used to achieve 'freezing' of the vibrational energy mode via rapid expansion of nitrogen from high temperature plenum conditions. A model gas dynamic laser nozzle array fabricated from hot-pressed silicon nitride components has been successfully tested under thermal cycling air flow conditions to temperatures of 1150 K. Excellent dimensional stability was shown by the center nozzle of the three nozzle assembly, and post-test examination of the components revealed no degradation of the materials. These findings suggest that ceramic materials offer important benefits to GDL systems.

  5. Deposition of thin layers of boron nitrides and hydrogenated microcrystalline silicon assisted by high current direct current arc plasma; Deposition assistee par un plasma a arc a haut courant continu de couches minces de Nitrure de Bore et de Silicium microcristallin hydrogene

    Energy Technology Data Exchange (ETDEWEB)

    Franz, D. [Ecole Polytechnique Federale de Lausanne, Centre de Recherches en Physique des Plasmas (CRPP), CH-1015 Lausanne (Switzerland)

    1999-09-01

    In the frame of this thesis, a high current direct current arc (HCDCA) used for the industrial deposition of diamond, has been adapted to study the deposition of two types of coatings: a) boron nitride, whose cubic phase is similar to diamond, for tribological applications, b) hydrogenated microcrystalline silicon, for applications in the semiconductor fields (flat panel displays, solar cells,...). For the deposition of these coatings, the substrates were placed in the diffusion region of the arc. The substrate heating is mainly due to atomic species recombining on its surface. The deposition temperature, varying from 300 to 900 {sup o}C according to the films deposited, is determined by the substrate position, the arc power and the injected gas fluxes, without the use of any external heating or cooling system. Measurements performed on the arc plasma show that the electronic temperature is around 2 eV (23'000 K) while the gas temperature is lower than 5500 K. Typical electronic densities are in the range of 10{sup 12}-10{sup 1'}3 cm{sup -3}. For the deposition of boron nitride films, different boron precursors were used and a wide parameter range was investigated. The extreme difficulty of synthesising cubic boron nitride films by chemical vapour deposition (CVD) did not allow to stabilize the cubic phase of boron nitride in HCDCA. Coatings resulted in hexagonal or amorphous boron nitride with a chemical composition close to stoichiometric. The presence of hydrogen leads to the deposition of rough and porous films. Negative biasing of the samples, for positive ion bombardment, is commonly used to stabilize the cubic phase. In HCDCA and in our biasing range, only a densification of the films could be observed. A boron nitride deposition plasma study by infrared absorption spectroscopy in a capacitive radio frequency reactor has demonstrated the usefulness of this diagnostic for the understanding of the various chemical reactions which occur in this kind

  6. 氮化锰硅合金中氮含量的测定%THE DETERMINATION OF NITROGEN CONTENT IN THE NITRIDED MANGANESE SILICON ALLOY

    Institute of Scientific and Technical Information of China (English)

    姜霞

    2015-01-01

    It studies N content test in nitrided ferromanganese-silicon by adopting high pressure sample dissolution method with K1302 automatic azotometer. The sample decomposed employs high pressure sample dissolution method, and its N converts to ammonia salt. Under excess alkali, it absorbs boric acid solution which distilled by azotometer. Methyl-red and methylene blue solution as the indicator, it calculates N content uses titrated hydrochloric acid standard solution. The operation is simple with high precision, good stability, and accurate result. All of the relative standard deviation results are less than 0.41%averagely. It can satisfy N analysis in nitrided ferromanganese-silicon.%研究了采用高压溶样法后,K1302型自动定氮仪快速测定新型氮化合金材料氮化锰硅合金中氮的方法。试样采用高压溶样法分解,其中的氮转变成相应的胺盐,在过量碱的作用下,用定氮仪蒸馏出的氮用硼酸溶液吸收,以甲基红—次甲基蓝溶液为指示剂,用盐酸标准溶液滴定后计算氮的含量。该方法操作简单、精密度高、稳定性好,结果准确,结果的相对标准偏差(RSD,n=6)均小于0.41%,完全满足氮化锰硅合金中氮元素的分析要求。

  7. Enzyme mediated silicon-oxygen bond formation; the use of Rhizopus oryzae lipase, lysozyme and phytase under mild conditions.

    Science.gov (United States)

    Abbate, Vincenzo; Bassindale, Alan R; Brandstadt, Kurt F; Lawson, Rachel; Taylor, Peter G

    2010-10-21

    The potential for expanding the variety of enzymic methods for siloxane bond formation is explored. Three enzymes, Rhizopus oryzae lipase (ROL), lysozyme and phytase are reported to catalyse the condensation of the model compound, trimethylsilanol, formed in situ from trimethylethoxysilane, to produce hexamethyldisiloxane in aqueous media at 25 °C and pH 7. Thermal denaturation and reactant inhibition experiments were conducted to better understand the catalytic role of these enzyme candidates. It was found that enzyme activities were significantly reduced following thermal treatment, suggesting a potential key-role of the enzyme active sites in the catalysis. Similarly, residue-specific modification of the key-amino acids believed to participate in the ROL catalysis also had a significant effect on the silicon bio-catalysis, indicating that the catalytic triad of the lipase may be involved during the enzyme-mediated formation of the silicon-oxygen bond. E. coli phytase was found to be particularly effective at catalysing the condensation of trimethylsilanol in a predominantly organic medium consisting of 95% acetonitrile and 5% water. Whereas the use of enzymes in silicon chemistry is still very much a developing and frontier activity, the results presented herein give some grounds for optimism that the variety of enzyme mediated reactions will continue to increase and may one day become a routine element in the portfolio of the synthetic silicon chemist. PMID:20683529

  8. Wafer-level packaging and laser bonding as an approach for silicon-into-lab-on-chip integration

    Science.gov (United States)

    Brettschneider, T.; Dorrer, C.; Bründel, M.; Zengerle, R.; Daub, M.

    2013-05-01

    A novel approach for the integration of silicon biosensors into microfluidics is presented. Our approach is based on wafer-level packaging of the silicon die and a laser-bonding process of the resulting mold package into a polymer-multilayer stack. The introduction of a flexible and 40 μm thin hot melt foil as an intermediate layer enables laser bonding between materials with different melting temperatures, where standard laser welding processes cannot be employed. All process steps are suitable for mass production, e.g. the approach does not involve any dispensing steps for glue or underfiller. The integration approach was demonstrated and evaluated regarding process technology by wafer-level redistribution of daisy chain silicon dies representing a generic biosensor. Electrical connection was successfully established and laser-bonding tensile strength of 5.7 N mm-2 and burst pressure of 587 kPa at a temperature of 100 °C were achieved for the new material combination. The feasibility of the complete packaging approach was shown by the fabrication of a microfluidic flow cell with embedded mold package.

  9. Comparative evaluation of tensile bond strength of silicone-based denture liners after thermocycling and surface treatment

    Directory of Open Access Journals (Sweden)

    Harsimran Kaur

    2015-01-01

    Full Text Available Purpose: To examine, evaluate, and compare the tensile bond strength of two silicone-based liners; one autopolymerizing and one heat cured, when treated with different chemical etchants to improve their adhesion with denture base resin. Materials and Methods: Hundred and sixty test specimens of heat-cured polymethyl methacrylate (PMMA were fabricated; out of which 80 specimens were tested for tensile bond strength after bonding it to autopolymerizing resilient liner (Ufigel P and rest 80 to heat-cured resilient liner (Molloplast B. Each main group was further divided into four subgroups of 20 specimens each, one to act as a control and three were subjected to surface treatment with different chemical etchants namely dichloromethane, MMA monomer, and chloroform. The two silicone-based denture liners were processed between 2 PMMA specimens (10 mm × 10 mm × 40 mm in the space provided by a spacer of 3 mm, thermocycled (5-55°C for 500 cycles, and then their tensile strength measurements were done in the universal testing machine. Results: One-way ANOVA technique showed a highly significant difference in the mean tensile bond strength values for all the groups. The Student′s t-test computed values of statistics for the compared groups were greater than the critical values both at 5% and at 1% levels. Conclusion: Surface treatment of denture base resin with chemical etchants prior to the application of silicone-based liner (Ufigel P and Molloplast-B increased the tensile bond strength. The increase was the highest with specimens subjected to 180 s of MMA surface treatment and the lowest with control group specimens.

  10. Light-induced changes in silicon nanocrystal based solar cells: Modification of silicon–hydrogen bonding on silicon nanocrystal surface under illumination

    Science.gov (United States)

    Kim, Ka-Hyun; Johnson, Erik V.; Cabarrocas, Pere Roca i.

    2016-07-01

    Hydrogenated polymorphous silicon (pm-Si:H) is a material consisting of a small volume fraction of nanocrystals embedded in an amorphous matrix. pm-Si:H solar cells demonstrate interesting initial degradation behaviors such as rapid initial change in photovoltaic parameters and self-healing after degradation during light-soaking. The precise dynamics of the light-induced degradation was studied in a series of light-soaking experiments under various illumination conditions such as AM1.5G and filtered 570 nm yellow light. Hydrogen effusion experiment before and after light-soaking further revealed that the initial degradation of pm-Si:H solar cells originate from the modification of silicon–hydrogen bonding on the surface of silicon nanocrystals in pm-Si:H.

  11. Facile fabrication of boron nitride nanosheets-amorphous carbon hybrid film for optoelectronic applications

    KAUST Repository

    Wan, Shanhong

    2015-01-01

    A novel boron nitride nanosheets (BNNSs)-amorphous carbon (a-C) hybrid film has been deposited successfully on silicon substrates by simultaneous electrochemical deposition, and showed a good integrity of this B-C-N composite film by the interfacial bonding. This synthesis can potentially provide the facile control of the B-C-N composite film for the potential optoelectronic devices. This journal is

  12. Calorimetry of dehydrogenation and dangling-bond recombination in several hydrogenated amorphous silicon materials

    OpenAIRE

    Roura Grabulosa, Pere; Farjas Silva, Jordi; Rath, Chandana; Serra-Miralles, J.; Bertrán Serra, Enric; Roca I Cabarrocas, Pere

    2006-01-01

    Differential scanning calorimetry (DSC) was used to study the dehydrogenation processes that take place in three hydrogenated amorphous silicon materials: nanoparticles, polymorphous silicon, and conventional device-quality amorphous silicon. Comparison of DSC thermograms with evolved gas analysis (EGA) has led to the identification of four dehydrogenation processes arising from polymeric chains (A), SiH groups at the surfaces of internal voids (A'), SiH groups at interfaces (B), and in the b...

  13. Effect of deposition reactive gas ratio, RF power and substrate temperature on the charging/discharging processes in PECVD silicon nitride films based on induced surface potential and adhesive force measurements using atomic force microscopy

    OpenAIRE

    Zaghloul, Heiba; Papaioannou, George; Bhushan, Bharat; Wang, Haixia; Coccetti, Fabio; Pons, Patrick; Plana, Robert

    2011-01-01

    International audience The dependence of the electrical properties of silicon nitride, which is a commonly used dielectric in nanoand micro-electromechanical systems (NEMS and MEMS), on the deposition conditions used to prepare it and, consequently, on material stoichiometry has not been fully understood. In this paper, the influence of plasma-enhanced chemical vapor deposition conditions on the dielectric charging of SiNx films is investigated. The work targets mainly the dielectricchargi...

  14. Improved piezoelectric constants of sputtered aluminium nitride thin films by pre-conditioning of the silicon surface

    Science.gov (United States)

    Schneider, M.; Bittner, A.; Schmid, U.

    2015-10-01

    The group III-V material aluminium nitride (AlN) is frequently used in micro-electromechanical devices and systems (MEMS) due to its piezoelectric properties, its high thermal and electrical stability as well as its compatibility with CMOS technology. But, the trend towards miniaturization of MEMS devices requests a continuous decrease in geometrical dimensions of the active AlN thin film, thus demanding at least the same piezoelectric properties at lower film thickness. In this work, two different approaches are applied to measure the piezoelectric coefficients, using the direct as well as the converse piezoelectric effect. The first approach utilizes laser doppler vibrometry measurements in combination with finite element analysis, allowing the determination of d 33 and d 31. For the second method, an oscillating force is applied to the thin film and the generated charge is measured. A surface-near substrate conditioning step applying sputter etching is used in order to improve the piezoelectric coefficients over a wide thickness range (i.e. 40 nm to 400 nm) by about 20% compared to samples without pre-treatment. Basically, the coefficients remain constant for a film thickness of 100 nm and above, thus allowing the application of thin active layers of aluminium nitride without any reduction in the sensing and actuation potential.

  15. Coordination compounds of tetravalent silicon, germanium and tin: the structure, chemical bonding and intermolecular interactions in them

    Science.gov (United States)

    Korlyukov, A. A.

    2015-04-01

    The review is devoted to analysis and generalization of the results of (i) quantum chemical studies on the structure, chemical bonding and intermolecular interactions in coordination compounds of tetravalent silicon, germanium and tin in crystals, in solutions and in the gas phase and (ii) experimental investigations of the electron density distribution in these systems. The bibliography includes 147 references. In memoriam of Corresponding Member of the Russian Academy of Sciences M Yu Antipin (1951 - 2013), Academician of the Russian Academy of Sciences M G Voronkov (1921 - 2014) and Dr. S P Knyazev, Lomonosov Moscow University of Fine Chemical Technology (1949 - 2012).

  16. Analysis of recovery process of low-dose neutron irradiation-induced defects in silicon nitride-based ceramics by thermal annealing

    Energy Technology Data Exchange (ETDEWEB)

    Rueanngoen, Areerak, E-mail: areerak_k@yahoo.com [Department of Nuclear Engineering, Graduate School of Science and Engineering, Tokyo Institute of Technology, O-okayama, Meguro-ku, Tokyo 152-8550 (Japan); Kanazawa, Koumei [Department of Nuclear Engineering, Graduate School of Science and Engineering, Tokyo Institute of Technology, O-okayama, Meguro-ku, Tokyo 152-8550 (Japan); Imai, Masamitsu; Yoshida, Katsumi; Yano, Toyohiko [Research Laboratory for Nuclear Reactors, Tokyo Institute of Technology, O-okayama, Meguro-ku, Tokyo 152-8550 (Japan)

    2014-12-15

    Two kinds of silicon nitride ceramics consisting of different polymorphs were neutron-irradiated up to 8.5 × 10{sup 24} n/m{sup 2} (E > 0.1 MeV) at 563 K, and their annealing behaviors were compared to those of previously reported SiAlON polymorphs subjected to the same irradiation condition. The macroscopic length change of α- and β-Si{sub 3}N{sub 4} and α- and β-SiAlON were 0.11%, 0.06%, 0.12% and 0.14%, respectively. Based on swelling data and microstructural observations, the low dose neutron irradiation-induced defects in silicon nitride-based ceramics were considered to be primarily point defects. In order to investigate the kinetics of defect recovery, these irradiated specimens were isothermally and isochronally annealed continuously up to 1473 K. Macroscopic length change decreased gradually with increasing annealing temperature. Recovery curves of isochronal annealing of α-Si{sub 3}N{sub 4} and α-SiAlON were similar, and those of β-Si{sub 3}N{sub 4} and β-SiAlON were also similar. The recombination rate constant as a first-order reaction increased with the increasing of the isothermal annealing temperature. A two-stage recovery process was considered between the irradiation temperature and 1473 K. The activation energies at higher temperatures were almost double those at lower temperatures in both Si{sub 3}N{sub 4} and SiAlON. At lower temperatures range the recovery should occur by annihilation of close-spaced Frenkel pairs. On the other hand, at higher temperatures, the recovery process may be governed by the annihilation of separated Frenkel pairs. In addition, the activation energies for defect recovery in Si{sub 3}N{sub 4} were larger than defects in SiAlON. Recovery characteristics of α- and β-phases were different in both crystals that are suggested to be due to differences in crystal structures.

  17. Cryogenic optical measurements of 12-segment-bonded carbon-fiber-reinforced silicon carbide composite mirror with support mechanism

    Science.gov (United States)

    Kaneda, Hidehiro; Nakagawa, Takao; Onaka, Takashi; Enya, Keigo; Makiuti, Sin'itirou; Takaki, Junji; Haruna, Masaki; Kume, Masami; Ozaki, Tsuyoshi

    2008-03-01

    A 720 mm diameter 12-segment-bonded carbon-fiber-reinforced silicon carbide (C/SiC) composite mirror has been fabricated and tested at cryogenic temperatures. Interferometric measurements show significant cryogenic deformation of the C/SiC composite mirror, which is well reproduced by a model analysis with measured properties of the bonded segments. It is concluded that the deformation is due mostly to variation in coefficients of thermal expansion among segments. In parallel, a 4-degree-of-freedom ball-bearing support mechanism has been developed for cryogenic applications. The C/SiC composite mirror was mounted on an aluminum base plate with the support mechanism and tested again. Cryogenic deformation of the mirror attributed to thermal contraction of the aluminum base plate via the support mechanism is highly reduced by the support, confirming that the newly developed support mechanism is promising for its future application to large-aperture cooled space telescopes.

  18. Sintering Manufacture Process Research on Special Ceramics Fe-Si3N4 Bonded SiC

    Institute of Scientific and Technical Information of China (English)

    PENG Dayan; ZHANG Yong

    2003-01-01

    By the method of TG-DSC ( thermo gravimetric analysis -differential scanning calorimeter), the chemical reactions of Fe -Si3 N4 bonded SiC during the sintering process in nitriding furnace have been studied. Analyses have been conducted on the reason of disintegration of specimens when ferro-silicon was added greater than 15% and on the method to reduce damage. The result indicated that there are mainly three important reactions occurred during the nitriding process of samples, they are: the oxidation of carbon, the melting of ferro-silicon and the nitriding of ferro -silicon. Controlling the balance of partial pressure of N2 and slowing down the rate of temperature rising can reduce the disintegration of samples.

  19. Sintering Manufacture Process Research on Special Ceramics Fe—Si3N4 Bonded SiC

    Institute of Scientific and Technical Information of China (English)

    PENGDayan; ZHANGYong

    2003-01-01

    By the method of TG-DSC (thermo gravimetric analysis-differential scanning calorimeter), the chemical reactions of Fe-Si3N4 bonded SiC during the sintering process in nitriding furnace have been studied. Analyses have been conducted on the reason of disintegration of specimens when ferro-silicon was added greater than 15% and on the method to reduce damage. The result indicated that there are mainly three important reactions occurred during the nitriding process of samples, they are: the oxidation of carbon, the melting of ferro-silicon and the nitriding of feero-silicon. Controlling the balance of partial pressure of N2 and slowing down the rate of temperature rising can reduce the disintegration of samples.

  20. III-nitride disk-in-nanowire 1.2 μm monolithic diode laser on (001)silicon

    KAUST Repository

    Hazari, Arnab

    2015-11-12

    III-nitride nanowirediodeheterostructures with multiple In0.85Ga0.15N disks and graded InGaN mode confining regions were grown by molecular beam epitaxy on (001)Si substrates. The aerial density of the 60 nm nanowires is ∼3 × 1010 cm−2. A radiative recombination lifetime of 1.84 ns in the disks is measured by time-resolved luminescence measurements. Edge-emitting nanowire lasers have been fabricated and characterized. Measured values of Jth, T0, and dg/dn in these devices are 1.24 kA/cm2, 242 K, and 5.6 × 10−17 cm2, respectively. The peak emission is observed at ∼1.2 μm.

  1. Fabrication of Fine-Grained Si3N4-Si2N2O Composites by Sintering Amorphous Nano-sized Silicon Nitride Powders

    Institute of Scientific and Technical Information of China (English)

    LUO Junting; ZHANG Kaifeng; WANG Guofeng; HAN Wenbo

    2006-01-01

    Si3N4-Si2N2O composites were fabricated with amorphous nano-sized silicon nitride powders by the liquid phase sintering (LPS). The Si2N2O phase was generated by an in-situ reaction 2Si3N4(s)+1.5O2(g)=3Si2N2O(s)+N2(g). The content of Si2N2O phase up to 60% in the volume was obtained at a sintering temperature of 1 650 ℃ and reduced when the sintering temperature increased or decreased, indicating the reaction is reversible. The mass loss, relative density and average grain size increased with increasing the sintering temperature. The average grain size was less than 500 nm when the sintering temperature was below 1 700 ℃. The sintering procedure contains a complex crystallization and a phase transition: amorphous silicon nitride→equiaxial α-Si3N4→equiaxial β-Si3N4→rod-like Si2N2O→needle-like β-Si3N4. Small round-shaped β-Si3N4 particles were entrapped in the Si2N2O grains and a high density of staking faults was situated in the middle of Si2N2O grains at a sintering temperature of 1 650 ℃. The toughness increased from 3.5 MPa·m1/2 at 1 600 ℃ to 7.2 MPa·m1/2 at 1 800 ℃. The hardness was as high as 21.5 GPa (Vickers) at 1 600 ℃.

  2. Technical assistance for development of thermally conductive nitride filler for epoxy molding compounds

    Energy Technology Data Exchange (ETDEWEB)

    Ryu, Ho Jin; Song, Kee Chan; Jung, In Ha

    2005-07-15

    Technical assistance was carried out to develop nitride filler for thermally conductive epoxy molding compounds. Carbothermal reduction method was used to fabricate silicon nitride powder from mixtures of silica and graphite powders. Microstructure and crystal structure were observed by using scanning electron microscopy and x-ray diffraction technique. Thermal properties of epoxy molding compounds containing silicon nitride were measured by using laser flash method. Fabrication process of silicon nitride nanowire was developed and was applied to a patent.

  3. High performance InAs quantum dot lasers on silicon substrates by low temperature Pd-GaAs wafer bonding

    Energy Technology Data Exchange (ETDEWEB)

    Wang, Zihao; Preble, Stefan F. [Microsystems Engineering, Rochester Institute of Technology, Rochester, New York 14623 (United States); Yao, Ruizhe; Lee, Chi-Sen; Guo, Wei, E-mail: wei-guo@uml.edu [Physics and Applied Physics Department, University of Massachusetts Lowell, Lowell, Massachusetts 01854 (United States); Lester, Luke F. [Bradley Department of Electrical and Computer Engineering, Virginia Polytechnic Institute and State University, Blacksburg, Virginia 24061 (United States)

    2015-12-28

    InAs quantum dot (QD) laser heterostructures have been grown by molecular beam epitaxy system on GaAs substrates, and then transferred to silicon substrates by a low temperature (250 °C) Pd-mediated wafer bonding process. A low interfacial resistivity of only 0.2 Ω cm{sup 2} formed during the bonding process is characterized by the current-voltage measurements. The InAs QD lasers on Si exhibit comparable characteristics to state-of-the-art QD lasers on silicon substrates, where the threshold current density J{sub th} and differential quantum efficiency η{sub d} of 240 A/cm{sup 2} and 23.9%, respectively, at room temperature are obtained with laser bars of cavity length and waveguide ridge of 1.5 mm and 5 μm, respectively. The InAs QD lasers also show operation up to 100 °C with a threshold current density J{sub th} and differential quantum efficiency η{sub d} of 950 A/cm{sup 2} and 9.3%, respectively. The temperature coefficient T{sub 0} of 69 K from 60 to 100 °C is characterized from the temperature dependent J{sub th} measurements.

  4. Development of the anode bipolar plate/membrane assembly unit for air breathing PEMFC stack using silicone adhesive bonding

    Science.gov (United States)

    Kim, Minkook; Lee, Dai Gil

    2016-05-01

    Polymer electrolyte membrane fuel cells (PEMFC) exhibit a wide power range, low operating temperature, high energy density and long life time. These advantages favor PEMFC for applications such as vehicle power sources, portable power, and backup power applications. With the push towards the commercialization of PEMFC, especially for portable power applications, the overall balance of plants (BOPs) of the systems should be minimized. To reduce the mass and complexity of the systems, air-breathing PEMFC stack design with open cathode channel configuration is being developed. However, the open cathode channel configuration incurs hydrogen leakage problem. In this study, the bonding strength of a silicon adhesive between the Nafion membrane and the carbon fiber/epoxy composite bipolar plate was measured. Then, an anode bipolar plate/membrane assembly unit which was bonded with the silicone adhesive was developed to solve the hydrogen leakage problem. The reliability of the anode bipolar plate/membrane assembly unit was estimated under the internal pressure of hydrogen by the FE analysis. Additionally, the gas sealability of the developed air breathing PEMFC unit cell was experimentally measured. Finally, unit cell performance of the developed anode bipolar plate/membrane assembly unit was tested and verified under operating conditions without humidity and temperature control.

  5. Temperature of thermal spikes in amorphous silicon nitride films produced by 1.11 MeV C{sub 60}{sup 3+} impacts

    Energy Technology Data Exchange (ETDEWEB)

    Kitayama, T.; Nakajima, K.; Suzuki, M. [Department of Micro Engineering, Kyoto University, Kyoto 615-8540 (Japan); Narumi, K.; Saitoh, Y. [Takasaki Advanced Radiation Research Institute, Japan Atomic Energy Agency, 1233 Watanuki-machi, Takasaki, Gunma 370-1292 (Japan); Matsuda, M.; Sataka, M. [Nuclear Science Research Institute, Japan Atomic Energy Agency, Tokai, Naka, Ibaraki 319-1195 (Japan); Tsujimoto, M.; Isoda, S. [Institute for Integrated Cell-Material Sciences, Kyoto University, Kyoto 606-8501 (Japan); Kimura, K., E-mail: kimura@kues.kyoto-u.ac.jp [Department of Micro Engineering, Kyoto University, Kyoto 615-8540 (Japan)

    2015-07-01

    Gold nanoparticles with an average diameter of 3.6 nm were deposited on amorphous silicon nitride (a-SiN) films. These samples were irradiated with 1.11 MeV C{sub 60}{sup 3+} ions to a fluence of ∼5 × 10{sup 10} ions/cm{sup 2} and observed using transmission electron microscopy (TEM). The ion tracks were clearly seen as bright spots and the gold nanoparticles disappeared from a surface area with a diameter of ∼20 nm around each ion track. The disappeared nanoparticles were collected by a foil placed in front of the sample. Gold particles of circular shape with a diameter of several nm were observed on the collector foil using TEM, suggesting that the gold nanoparticles were emitted as liquid droplets from the a-SiN film upon impact of the C{sub 60} ion. In view of the previous molecular dynamics simulations (Anders et al., 2009), this indicates that the surface temperature rises above the melting point of gold in the region with a diameter of ∼20 nm around the ion impact position.

  6. Effect of plasma parameters on characteristics of silicon nitride film deposited by single and dual frequency plasma enhanced chemical vapor deposition

    Science.gov (United States)

    Sahu, B. B.; Yin, Yongyi; Han, Jeon G.

    2016-03-01

    This work investigates the deposition of hydrogenated amorphous silicon nitride films using various low-temperature plasmas. Utilizing radio-frequency (RF, 13.56 MHz) and ultra-high frequency (UHF, 320 MHz) powers, different plasma enhanced chemical vapor deposition processes are conducted in the mixture of reactive N2/NH3/SiH4 gases. The processes are extensively characterized using different plasma diagnostic tools to study their plasma and radical generation capabilities. A typical transition of the electron energy distribution function from single- to bi-Maxwellian type is achieved by combining RF and ultra-high powers. Data analysis revealed that the RF/UHF dual frequency power enhances the plasma surface heating and produces hot electron population with relatively low electron temperature and high plasma density. Using various film analysis methods, we have investigated the role of plasma parameters on the compositional, structural, and optical properties of the deposited films to optimize the process conditions. The presented results show that the dual frequency power is effective for enhancing dissociation and ionization of neutrals, which in turn helps in enabling high deposition rate and improving film properties.

  7. Transient, three-dimensional heat transfer model for the laser assisted machining of silicon nitride: 1. Comparison of predictions with measured surface temperature histories

    Energy Technology Data Exchange (ETDEWEB)

    Rozzi, J.C.; Pfefferkorn, F.E.; Shin, Y.C. [Purdue University, (United States). Laser Assisted Materials Processing Laboratory, School of Mechanical Engineering; Incropera, F.P. [University of Notre Dame, (United States). Aerospace and Mechanical Engineering Department

    2000-04-01

    Laser assisted machining (LAM), in which the material is locally heated by an intense laser source prior to material removal, provides an alternative machining process with the potential to yield higher material removal rates, as well as improved control of workpiece properties and geometry, for difficult-to-machine materials such as structural ceramics. To assess the feasibility of the LAM process and to obtain an improved understanding of governing physical phenomena, experiments have been performed to determine the thermal response of a rotating silicon nitride workpiece undergoing heating by a translating CO{sub 2} laser and material removal by a cutting tool. Using a focused laser pyrometer, surface temperature histories were measured to determine the effect of the rotational and translational speeds, the depth of cut, the laser-tool lead distance, and the laser beam diameter and power on thermal conditions. The measurements are in excellent agreement with predictions based on a transient, three-dimensional numerical solution of the heating and material removal processes. The temperature distribution within the unmachined workpiece is most strongly influenced by the laser power and laser-tool lead distance, as well as by the laser/tool translational velocity. A minimum allowable operating temperature in the material removal region corresponds to the YSiAlON glass transition temperature, below which tool fracture may occur. In a companion paper, the numerical model is used to further elucidate thermal conditions associated with laser assisted machining. (author)

  8. The role of plasma chemistry on functional silicon nitride film properties deposited at low-temperature by mixing two frequency powers using PECVD.

    Science.gov (United States)

    Sahu, B B; Yin, Y Y; Tsutsumi, T; Hori, M; Han, Jeon G

    2016-05-14

    Control of the plasma densities and energies of the principal plasma species is crucial to induce modification of the plasma reactivity, chemistry, and film properties. This work presents a systematic and integrated approach to the low-temperature deposition of hydrogenated amorphous silicon nitride films looking into optimization and control of the plasma processes. Radiofrequency (RF) and ultrahigh frequency (UHF) power are combined to enhance significantly the nitrogen plasma and atomic-radical density to enforce their effect on film properties. This study presents an extensive investigation of the influence of combining radiofrequency (RF) and ultrahigh frequency (UHF) power as a power ratio (PR = RF : UHF), ranging from 4 : 0 to 0 : 4, on the compositional, structural, and optical properties of the synthesized films. The data reveal that DF power with a characteristic bi-Maxwellian electron energy distribution function (EEDF) is effectively useful for enhancing the ionization and dissociation of neutrals, which in turn helps in enabling high rate deposition with better film properties than that of SF operations. Utilizing DF PECVD, a wide-bandgap of ∼3.5 eV with strong photoluminescence features can be achieved only by using a high-density plasma and high nitrogen atom density at room temperature. The present work also proposes the suitability of the DF PECVD approach for industrial applications. PMID:27109293

  9. Integrated approach for low-temperature synthesis of high-quality silicon nitride films in PECVD using RF-UHF hybrid plasmas

    Science.gov (United States)

    Sahu, B. B.; Shin, Kyung S.; Han, Jeon G.

    2016-02-01

    This study investigates low-temperature plasma nitriding of hydrogenated silicon (SiN x :H) film in radio frequency (RF) and RF-ultra-high frequency (UHF) hybrid plasmas. To study the optimized conditions for the deposition of SiN x :H film, this work adopts a systematic plasma diagnostic approach in the nitrogen-silane and nitrogen-silane-ammonia plasmas. This work also evaluates the capability of plasma and radical formation by utilizing different plasma sources in the PECVD process. For the plasma diagnostics, we have purposefully used the combination of optical emission spectroscopy (OES), intensified CCD (ICCD) camera, vacuum ultraviolet absorption spectroscopy (VUVAS), and RF compensated Langmuir probe (LP). Data reveal that there is significant enhancement in the atomic nitrogen radicals, plasma densities, and film properties using the hybrid plasmas. Measurements show that addition of a small amount of NH3 can significantly reduce the electron temperature, plasma, and radical density. Also, optical and chemical properties of the deposited films are investigated on the basis of plasma diagnostics. Good quality SiN x :H films, with atomic nitrogen to hydrogen ratio of 4:1, are fabricated. The plasma chemistry of the hybrid plasmas is also discussed for its utility for plasma applications.

  10. Silicon nitride ceramic material having an in-situ continuous gradient function, process for manufacture, properties and applications thereof

    OpenAIRE

    Belmonte, Manuel; González Julián, Jesús; Miranzo López, Pilar; Osendi, María Isabel

    2008-01-01

    [EN] The present invention relates to a silicon mitride ceramic material having a continuous gradient in the microstructural characteristics thereof and in the properties thereof, from one extremity to the other of the ceramic component. Furthermore a method is described for the manufacture in situ of said ceramic materials having a gradient function from a single homogenous composition of ceramic powders and employing a sintering process through electric discharge modifying the temperatu...

  11. Non-silicon substrate bonding mediated by poly(dimethylsiloxane) interfacial coating

    Science.gov (United States)

    Zhang, Hainan; Lee, Nae Yoon

    2015-02-01

    In this paper, we introduce a simple and robust strategy for bonding poly(dimethylsiloxane) (PDMS) with various thermoplastic substrates to fabricate a thermoplastic-based closed microfluidic device and examine the feasibility of using the proposed method for realizing plastic-plastic bonding. The proposed bonding strategy was realized by first coating amine functionality on an oxidized thermoplastic surface. Next, the amine-functionalized surface was reacted with a monolayer of low-molecular-weight PDMS, terminated with epoxy functionality, by forming a robust amine-epoxy bond. Both the PDMS-coated thermoplastic and PDMS were then oxidized and permanently assembled at 25 °C under a pressure of 0.1 MPa for 15 min, resulting in PDMS-like surfaces on all four inner walls of the microchannel. Surface characterizations were conducted, including water contact angle measurement, X-ray photoelectron spectroscopy (XPS), and fluorescence measurement, to confirm the successful coating of the thin PDMS layer on the plastic surface, and the bond strength was analyzed by conducting a peel test, burst test, and leakage test. Using the proposed method, we could successfully bond various thermoplastics such as poly(methylmethacrylate) (PMMA), polycarbonate (PC), polystyrene (PS), and poly(ethylene terephthalate) (PET) with PDMS without the collapse or deformation of the microchannel, and the proposed method was successfully extended to the bonding of two thermoplastics, PMMA, and PC.

  12. Tensile bond strength of silicone-based soft denture liner to two chemically different denture base resins after various surface treatments.

    Science.gov (United States)

    Akin, Hakan; Tugut, Faik; Guney, Umit; Kirmali, Omer; Akar, Turker

    2013-01-01

    This study evaluated the effect of various surface treatments on the tensile bond strength of a silicone-based soft denture liner to two chemically different denture base resins, heat-cured polymethyl methacrylate (PMMA), and light-activated urethane dimethacrylate or Eclipse denture base resin. PMMA test specimens were fabricated and relined with a silicone-based soft denture liner (group AC). Eclipse test specimens were prepared according to the manufacturer's recommendation. Before they were relined with a silicone-based soft denture liner, each received one of three surface treatments: untreated (control, group EC), Eclipse bonding agent applied (group EB), and laser-irradiated (group EL). Tensile bond strength tests (crosshead speed = 5 mm/min) were performed for all specimens, and the results were analyzed using the analysis of variance followed by Tukey's test (p = 0.05). Eclipse denture base and PMMA resins presented similar bond strengths to the silicone-based soft denture liner. The highest mean force was observed in group EL specimens, and the tensile bond strengths in group EL were significantly different (p < 0.05) from those in the other groups.

  13. Diffusion Bonding of Silicon Carbide Particulate Reinforced 2024 A1 Composites

    Institute of Scientific and Technical Information of China (English)

    2000-01-01

    @@A study has been made on diffusion bonding of SiCp/2024Al composites by means of pure Al interlayer. In the condition of TB=843 K, PB=16 MPa, tB=-60 min, the diffusion bonded joint,with a shear strength of 235 MPa, was obtained when a 15μm thick interlayer was used. The results of the shear testing and SEM indicate that fracture of the joint presented characteristics of ductile rupture.

  14. 二元混杂粒径氮化硅填充硅橡胶的性能%Properties of Silicone Rubber Filled with Silicone Nitride Particles with Binary Particle Size Distribution

    Institute of Scientific and Technical Information of China (English)

    周文英; 左晶

    2011-01-01

    Two kinds of hybrid silicone nitride (Si3N4) particles with binary particle size distribution, i.e.,(15μm+ 0.6μm), (3μm + 0.6μm), were used to reinforce silicone rubber at the 65% total fillers content. The properties of filled silicone rubber were investigated as a function of relative content of the 0.6μm small particles (Ws). The results indicate that thermal conductivity and tensile strength reach the maximum values at Ws being 20%, 25% for the ( 15μm + 0.6μm) reinforced system, and 40 %, 15 % for the (3μm + 0.6μm) reinforced system,respectively; dielectric constants reduce to the lowest values at the Ws of 20% and 30 %, respectively, and coefficient of thermal expansion reduces with increasing the Ws for the two systems. Furthermore, the Si3N4 particle size has the effect on the properties of silicone rubber.%在质量分数65%总氮化硅用量下,分别选取0.6 μm、3.0 μm、15 μm三种粒径氮化硅粒子,按照15 μm/0.6 μm=25、3.0 μm/0.6 μm=5两种组合所得混杂粒子来填充硅橡胶,研究两体系中的小粒子相对含量(Ws)变化对硅橡胶性能的影响.结果表明,硅橡胶热导率分别在Ws为20%及40%处达到最大值,拉伸强度分别在Ws为25%及15%处达到最大值,介电常数约在Ws为20%及30%处下降至最低值,热膨胀系数均随小粒子用量增加而下降.此外,氮化硅粒子大小对硅橡胶上述性能有一定影响.

  15. Surface Emitting, High Efficiency Near-Vacuum Ultraviolet Light Source with Aluminum Nitride Nanowires Monolithically Grown on Silicon.

    Science.gov (United States)

    Zhao, S; Djavid, M; Mi, Z

    2015-10-14

    To date, it has remained challenging to realize electrically injected light sources in the vacuum ultraviolet wavelength range (∼200 nm or shorter), which are important for a broad range of applications, including sensing, surface treatment, and photochemical analysis. In this Letter, we have demonstrated such a light source with molecular beam epitaxially grown aluminum nitride (AlN) nanowires on low cost, large area Si substrate. Detailed angle dependent electroluminescence studies suggest that, albeit the light is TM polarized, the dominant light emission direction is from the nanowire top surface, that is, along the c axis, due to the strong light scattering effect. Such an efficient surface emitting device was not previously possible using conventional c-plane AlN planar structures. The AlN nanowire LEDs exhibit an extremely large electrical efficiency (>85%), which is nearly ten times higher than the previously reported AlN planar devices. Our detailed studies further suggest that the performance of AlN nanowire LEDs is predominantly limited by electron overflow. This study provides important insight on the fundamental emission characteristics of AlN nanowire LEDs and also offers a viable path to realize an efficient surface emitting near-vacuum ultraviolet light source through direct electrical injection. PMID:26375576

  16. III-nitride disk-in-nanowire 1.2 μm monolithic diode laser on (001)silicon

    Energy Technology Data Exchange (ETDEWEB)

    Hazari, Arnab; Aiello, Anthony; Bhattacharya, Pallab [Center for Photonics and Multiscale Nanomaterials, Department of Electrical Engineering and Computer Science, University of Michigan, Ann Arbor, Michigan 48109 (United States); Ng, Tien-Khee; Ooi, Boon S. [Division of Computer, Electrical and Mathematical Sciences and Engineering, King Abdullah University of Science and Technology (KAUST), Thuwal 23955-6900 (Saudi Arabia)

    2015-11-09

    III-nitride nanowire diode heterostructures with multiple In{sub 0.85}Ga{sub 0.15}N disks and graded InGaN mode confining regions were grown by molecular beam epitaxy on (001)Si substrates. The aerial density of the 60 nm nanowires is ∼3 × 10{sup 10} cm{sup −2}. A radiative recombination lifetime of 1.84 ns in the disks is measured by time-resolved luminescence measurements. Edge-emitting nanowire lasers have been fabricated and characterized. Measured values of J{sub th}, T{sub 0}, and dg/dn in these devices are 1.24 kA/cm{sup 2}, 242 K, and 5.6 × 10{sup −17} cm{sup 2}, respectively. The peak emission is observed at ∼1.2 μm.

  17. Oxide-Free Bonding of III-V-Based Material on Silicon and Nano-Structuration of the Hybrid Waveguide for Advanced Optical Functions

    Directory of Open Access Journals (Sweden)

    Konstantinos Pantzas

    2015-10-01

    Full Text Available Oxide-free bonding of III-V-based materials for integrated optics is demonstrated on both planar Silicon (Si surfaces and nanostructured ones, using Silicon on Isolator (SOI or Si substrates. The hybrid interface is characterized electrically and mechanically. A hybrid InP-on-SOI waveguide, including a bi-periodic nano structuration of the silicon guiding layer is demonstrated to provide wavelength selective transmission. Such an oxide-free interface associated with the nanostructured design of the guiding geometry has great potential for both electrical and optical operation of improved hybrid devices.

  18. Spectral response of a silicon detector with 220 {mu}m pixel size bonded to MEDIPIX2

    Energy Technology Data Exchange (ETDEWEB)

    Froejdh, Erik, E-mail: erik.frojdh@miun.se [Department of Information Technology and Media, Mid-Sweden University, SE-85170 Sundsvall (Sweden); Froejdh, Anna; Norlin, Boerje; Froejdh, Christer [Department of Information Technology and Media, Mid-Sweden University, SE-85170 Sundsvall (Sweden)

    2011-05-15

    Pixellated radiation detectors with single photon processing can be used for spectral X-ray imaging. A problem using such detectors with small pixels is that the spectral information is distorted by charge sharing. In order to get images with good spectral resolution a number of silicon sensors with a pixel size of 220 {mu}m were fabricated and bonded to a MEDIPIX2 readout chip using only a limited number of pixels on the readout chip. The device was then used in an X-ray microscopy setup to obtain good spatial resolution as well. It is shown that spectral imaging can provide good contrast images of embedded structures by selecting an appropriate energy window.

  19. Effect of SiO2 on the Preparation and Properties of Pure Carbon Reaction Bonded Silicon Carbide Ceramics

    Institute of Scientific and Technical Information of China (English)

    WU Qi-de; GUO Bing-jian; YAN Yong-gao; ZHAO Xiu-jian; HONG Xiao-lin

    2004-01-01

    Effect of SiO2 content and sintering process on the composition and properties of Pure CarbonReaction Bonded Silicon Carbide (PCRBSC) ceramics prepared with C - SiO2 green body by infiltrating siliconwas presented. The infiltrating mechanism of C - SiO2 preform was also explored. The experimental results indicatethat the shaping pressure increases with the addition of SiO2 to the preform, and the pore size of the body turnedfiner and distributed in a narrower range, which is beneficial to decreasing the residual silicon content in the sin-tered materials and to avoiding shock off, thus increasing the conversion rate of SiC. SiO2 was deoxidized by car-bon at a high temperature and the gaseous SiO and CO produced are the main reason to the crack of the body atan elevated temperature. If the green body is deposited at 1800℃ in vacuum before infiltration crack will not beproduced in the preform and fully dense RBSC can be obtained. The ultimate material has the following properties:a density of3.05-3.12g/cm3 ,a strength of 580±32MPa and a hardness of (HRA)91-92.3.

  20. An X-ray diffraction study of direct-bonded silicon interfaces

    DEFF Research Database (Denmark)

    Howes, P.B.; Benamara, M.; Grey, F.;

    1998-01-01

    Semiconductor wafer bonding techniques have been used to create a giant twist grain boundary from two Si(001) wafers. We show, using X-ray diffraction measurements that after annealing the interface forms a highly ordered superstructure with relaxations extending to many layers into the crystals...

  1. Nature of bonding forces between two hydrogen-passivated silicon wafers

    DEFF Research Database (Denmark)

    Stokbro, Kurt; Nielsen, E.; Hult, E.;

    1998-01-01

    The nature and strength of the bonding forces between two II-passivated Si surfaces are studied with the density-functional theory, using an approach based on recent theoretical advances in understanding of van der Waals forces between two surfaces. Contrary to previous suggestions of van der Waa...

  2. Development of high-temperature resistant, noncorrodible, nonmetallic ceramic materials, especially silicon nitride in gas turbine application. Entwicklung von hochwarmfesten, korrosionsbestaendigen, nichtmetallischen keramischen Werkstoffen, insbesondere Siliciumnitrid fuer den Gasturbinenbau

    Energy Technology Data Exchange (ETDEWEB)

    Blecha, M.; Pohlmann, H.J.

    1985-03-01

    The report under review is part of the project 'Ceramic Materials for Automobile Gas Turbines', which has been sponsored by the Ministry for Research and Technology of the Federal Republic of Germany since 1974 and describes the works in the years from 1980 to 1983. Special effort has been made in the improvement of silicon nitride concerning oxidation resistance and strength, suitable production techniques such as foil casting, injection moulding, extrusion and isostatic pressing as well as the manufacturing of structural components with improved material data for test purposes. With this the tight connection of production techniques, construction and testing in simulated application conditions was proved.

  3. Surface-Mediated Hydrogen Bonding of Proteinogenic α-Amino Acids on Silicon.

    Science.gov (United States)

    Rahsepar, Fatemeh R; Moghimi, Nafiseh; Leung, K T

    2016-05-17

    Understanding the adsorption, film growth mechanisms, and hydrogen bonding interactions of biological molecules on semiconductor surfaces has attracted much recent attention because of their applications in biosensors, biocompatible materials, and biomolecule-based electronic devices. One of the most challenging questions when studying the behavior of biomolecules on a metal or semiconductor surface is "What are the driving forces and film growth mechanisms for biomolecular adsorption on these surfaces?" Despite a large volume of work on self-assembly of amino acids on single-crystal metal surfaces, semiconductor surfaces offer more direct surface-mediated interactions and processes with biomolecules. This is due to their directional surface dangling bonds that could significantly perturb hydrogen bonding arrangements. For all the proteinogenic biomolecules studied to date, our group has observed that they generally follow a "universal" three-stage growth process on Si(111)7×7 surface. This is supported by corroborating data obtained from a three-pronged approach of combining chemical-state information provided by X-ray photoelectron spectroscopy (XPS) and the site-specific local density-of-state images obtained by scanning tunneling microscopy (STM) with large-scale quantum mechanical modeling based on the density functional theory with van der Waals corrections (DFT-D2). Indeed, this three-stage growth process on the 7×7 surface has been observed for small benchmark biomolecules, including glycine (the simplest nonchiral amino acid), alanine (the simplest chiral amino acid), cysteine (the smallest amino acid with a thiol group), and glycylglycine (the smallest (di)peptide of glycine). Its universality is further validated here for the other sulfur-containing proteinogenic amino acid, methionine. We use methionine as an example of prototypical proteinogenic amino acids to illustrate this surface-mediated process. This type of growth begins with the formation of

  4. Bio-inspired co-catalysts bonded to a silicon photocathode for solar hydrogen evolution

    DEFF Research Database (Denmark)

    Hou, Yidong; Abrams, Billie; Vesborg, Peter Christian Kjærgaard;

    2011-01-01

    part of the spectrum is utilized for hydrogen evolution while the blue part is reserved for the more difficult oxygen evolution. The samples have been illuminated with a simulated red part of the solar spectrum i.e. long wavelength (" > 620 nm) part of simulated AM 1.5G radiation. The current densities...... at the reversible potential match the requirement of a photoelectrochemical hydrogen production system with a solar-to-hydrogen efficiency in excess of 10%. The experimental observations are supported by DFT calculations of the Mo3S4 cluster adsorbed on the hydrogen-terminated silicon surface...

  5. Technology for integrated circuit micropackages for neural interfaces, based on gold–silicon wafer bonding

    International Nuclear Information System (INIS)

    Progress in the development of active neural interface devices requires a very compact method for protecting integrated circuits (ICs). In this paper, a method of forming micropackages is described in detail. The active areas of the chips are sealed in gas-filled cavities of the cap wafer in a wafer-bonding process using Au–Si eutectic. We describe the simple additions to the design of the IC, the post-processing of the active wafer and the required features of the cap wafer. The bonds, which were made at pressure and temperature levels within the range of the tolerance of complementary metal–oxide–semiconductor ICs, are strong enough to meet MIL STD 883G, Method 2019.8 (shear force test). We show results that suggest a method for wafer-scale gross leak testing using FTIR. This micropackaging method requires no special fabrication process and is based on using IC compatible or conventional fabrication steps. (paper)

  6. Micro thermal shear stress sensor based on vacuum anodic bonding and bulk-micromachining

    Institute of Scientific and Technical Information of China (English)

    Yi Liang; Ou Yi; Shi Sha-Li; Ma Jin; Chen Da-Peng; Ye Tian-Chun

    2008-01-01

    This paper describes a micro thermal shear stress sensor with a cavity underneath, based on vacuum anodic bonding and bulk micromachined technology. A Ti/Pt alloy strip, 2μmx100μm, is deposited on the top of a thin silicon nitride diaphragm and functioned as the thermal sensor element. By using vacuum anodic bonding and bulk-si anisotropic wet etching process instead of the sacrificial-layer technique, a cavity, functioned as the adiabatic vacuum chamber, 200μm×200μm×400μm, is placed between the silicon nitride diaphragm and glass (Corning 7740). This method totally avoid adhesion problem which is a major issue of the sacrificial-layer technique.

  7. Evaluation of the indium gallium nitride/silicon broken-gap heterojunction and its potential application for solar cells

    Science.gov (United States)

    Yao, Yuan

    InGaN (especially In-rich alloy) has been actively studied for decades since the band gap of InN was revised downward from ˜2.0 eV to 0.64 eV. The potential applications for alloys of In-rich InGaN hence became apparent. Despite the promising potential, photovoltaic devices based on InGaN have struggled due to a number of key limitations and fundamental physical problems. Firstly, due to the deep excursion of the InN conduction band at the gamma point, defects in InN are almost universally n-type leading to unintentional degenerate doping. This also leads to the problem of electron accumulation at all surfaces and interfaces of InN. Secondly, p-type doping is problematic, partially due to the degenerate doping effect of defects, but it has also been observed that Mg-doping, while leading to a p-type layer, dramatically reduces the quantum efficiency. This thesis explores an alternative approach using n-type InGaN to form a heterojunction with a p-type Si substrate. One potential benefit to using p-type Si as a substrate material for InGaN is that the valence band of Si possibly lines up with the conduction band of InGaN for a specific mole fraction of indium. Such a band alignment is known as a broken gap heterojunction, an example of which is the interface between InAs and AlxGa 1--xSb. The benefits of this broken-gap junction include a low series resistance, high electron mobility, and mobility only weakly dependent on temperature. These properties enable new approach to photovoltaic devices. The InGaN/Si heterojunctions were fabricated by plasma-assisted molecular beam epitaxy under stoichiometric flux conditions. An ultra-thin SiN interface layer was introduced, by Si nitridation process, to passivate the substrate surface and prevent In-Si and Ga-Si eutectic problems. InGaN films with a variety of indium mole fractions were grown by calibrating the In/Ga flux ratio during the deposition. The chemical composition of as-grown films was characterized by x

  8. High-temperature tensile behavior of a boron nitride-coated silicon carbide-fiber glass-ceramic composite

    International Nuclear Information System (INIS)

    Tensile properties of a cross-ply glass-ceramic composite were investigated by conducting fracture, creep, and fatigue experiments at both room temperature and high temperatures in air. The composite consisted of a barium magnesium aluminosilicate (BMAS) glass-ceramic matrix reinforced with SiC fibers with a SiC/BN coating. The material exhibited retention of most tensile properties up to 1,200 C. Monotonic tensile fracture tests produced ultimate strengths of 230--300 MPa with failure strains of ∼1%, and no degradation in ultimate strength was observed at 1,100 and 1,200 C. In creep experiments at 1,100 C, nominal steady-state creep rates in the 10-9 s-1 range were established after a period of transient creep. Tensile stress rupture experiments at 1,100 and 1,200 C lasted longer than one year at stress levels above the corresponding proportional limit stresses for those temperatures. Tensile fatigue experiments were conducted in which the maximum applied stress was slightly greater than the proportional limit stress of the matrix, and, in these experiments, the composite survived 105 cycles without fracture at temperatures up to 1,200 C. Microscopic damage mechanisms were investigated by TEM, and microstructural observations of tested samples were correlated with the mechanical response. The SiC/BN fiber coatings effectively inhibited diffusion and reaction at the interface during high-temperature testing. The BN layer also provided a weak interfacial bond that resulted in damage-tolerant fracture behavior

  9. Si3N4/SiC/环氧树脂纳米导热复合材料的制备%Preparation of silicon nitride/silicon carbide whisker/epoxy resin thermal conductive nanocomposites

    Institute of Scientific and Technical Information of China (English)

    王明明; 张炜巍

    2012-01-01

    The epoxy resin thermal conductive composites were prepared with micro-silicon nitride/nano-silicon carbide whisker (Si3N4/SiC) hybrid fillers modified with silane coupling agent of KH -560.The influence of epoxy resin type, con tent and ratio of S3,N4/SiC,and surface modification on the thermal conductivity,mechanical ant! dielectric properties of the epoxy resin were investigated.The thermal conductivity of the epoxy resin composites increased with increasing the content of Si3N4/SIC hybrid fillers.And the thermal conductivity coefficient was 0.98 W/mK for 50 wt% Si3N4/SiC hybrid fillers (mass fraction, Si3N4/SiC =3/1).The dielectric constant of the epoxy resin composites increased with increasing the content of Si3/N4SiC hybrid fillers,however,the flexural and impact strength of the composites increased firstly,but decreased with excessive addition of Si3N4/SiC hybrid fillers.%以硅烷偶联剂KH-560改性的微米氮化硅/纳米碳化硅晶须(Si3N4/SiCw)为导热填料,浇注制备Si3N4/SiC/环氧树脂纳米导热复合材料.研究了环氧树脂种类、Si3N4/SiCw用量、复配比及表面改性对环氧树脂导热、力学和介电性能的影响.结果表明,环氧树脂的热导率随Si3N4/SiCw用量的增加而增大,当改性Si3N4/SiCw用量为50%[m(Si3N4) /m(SiCw)]=3/1时,环氧树脂的热导率为0.98 W/(m· K);复合材料的介电常数随Si3N4/SiCw用量的增加而增大,而力学性能则先增加后降低.

  10. Fabrication and test of reaction bond silicon carbide for optical applications

    Institute of Scientific and Technical Information of China (English)

    YAO Wang; ZHANG Yu-min; HAN Jie-cai; ZUO Hong-bo

    2006-01-01

    A reaction bonding fabrication process using various grain size of SiC powder was investigated. The properties such as mechanical, thermal and physic property were tested and analyzed. RBSiC produced using this process is a polycrystalline material and has high specific stiffness (density of 3.09 g/cm3 with elastic modulus of 362.39 GPa), strength (269.64 MPa) and hardness (19.43 GPa). At room temperature its low CTE (3.47×10-6/K), combined with relatively high thermal conductivity (161.14 W/mK)and specific heat capacity (593.86 J/kg.K) can minimize the bothersome thermal distortion. This advantage is outstanding even at higher temperature of test range. Two d250 mm RBSiC mirror were polished. Surface roughness value less than 5 nm was obtained.Results prove that this reaction bonding process is a feasible method to produced high quality RBSiC optical mirror.

  11. Prediction of plasma-induced damage distribution during silicon nitride etching using advanced three-dimensional voxel model

    International Nuclear Information System (INIS)

    The authors modeled SiN film etching with hydrofluorocarbon (CHxFy/Ar/O2) plasma considering physical (ion bombardment) and chemical reactions in detail, including the reactivity of radicals (C, F, O, N, and H), the area ratio of Si dangling bonds, the outflux of N and H, the dependence of the H/N ratio on the polymer layer, and generation of by-products (HCN, C2N2, NH, HF, OH, and CH, in addition to CO, CF2, SiF2, and SiF4) as ion assistance process parameters for the first time. The model was consistent with the measured C-F polymer layer thickness, etch rate, and selectivity dependence on process variation for SiN, SiO2, and Si film etching. To analyze the three-dimensional (3D) damage distribution affected by the etched profile, the authors developed an advanced 3D voxel model that can predict the time-evolution of the etched profile and damage distribution. The model includes some new concepts for gas transportation in the pattern using a fluid model and the property of voxels called “smart voxels,” which contain details of the history of the etching situation. Using this 3D model, the authors demonstrated metal–oxide–semiconductor field-effect transistor SiN side-wall etching that consisted of the main-etch step with CF4/Ar/O2 plasma and an over-etch step with CH3F/Ar/O2 plasma under the assumption of a realistic process and pattern size. A large amount of Si damage induced by irradiated hydrogen occurred in the source/drain region, a Si recess depth of 5 nm was generated, and the dislocated Si was distributed in a 10 nm deeper region than the Si recess, which was consistent with experimental data for a capacitively coupled plasma. An especially large amount of Si damage was also found at the bottom edge region of the metal–oxide–semiconductor field-effect transistors. Furthermore, our simulation results for bulk fin-type field-effect transistor side-wall etching showed that the Si fin (source/drain region) was directly damaged by high energy

  12. Silicon-carbon bond inversions driven by 60-keV electrons in graphene.

    Science.gov (United States)

    Susi, Toma; Kotakoski, Jani; Kepaptsoglou, Demie; Mangler, Clemens; Lovejoy, Tracy C; Krivanek, Ondrej L; Zan, Recep; Bangert, Ursel; Ayala, Paola; Meyer, Jannik C; Ramasse, Quentin

    2014-09-12

    We demonstrate that 60-keV electron irradiation drives the diffusion of threefold-coordinated Si dopants in graphene by one lattice site at a time. First principles simulations reveal that each step is caused by an electron impact on a C atom next to the dopant. Although the atomic motion happens below our experimental time resolution, stochastic analysis of 38 such lattice jumps reveals a probability for their occurrence in a good agreement with the simulations. Conversions from three- to fourfold coordinated dopant structures and the subsequent reverse process are significantly less likely than the direct bond inversion. Our results thus provide a model of nondestructive and atomically precise structural modification and detection for two-dimensional materials.

  13. Development of an Indium bump bond process for silicon pixel detectors at PSI

    International Nuclear Information System (INIS)

    The hybrid pixel detectors used in the high-energy physics experiments currently under construction use a vertical connection technique, the so-called bump bonding. As the pitch below 100μm, required in these applications, cannot be fulfilled with standard industrial processes (e.g. the IBM C4 process), an in-house bump bond process using reflowed indium bumps was developed at PSI as part of the R and D for the CMS-pixel detector. The bump deposition on the sensor is performed in two subsequent lift-off steps. As the first photolithographic step a thin under bump metalization (UBM) is sputtered onto bump pads. It is wettable by indium and defines the diameter of the bump. The indium is evaporated via a second photolithographic step with larger openings and is reflowed afterwards. The height of the balls is defined by the volume of the indium. On the readout chip only one photolithographic step is carried out to deposit the UBM and a thin indium layer for better adhesion. After mating both parts a second reflow is performed for self-alignment and obtaining high mechanical strength. For the placement of the chips a manual and an automatic machine were constructed. The former is very flexible in handling different chip and module geometries but has a limited throughput while the latter features a much higher grade of automatization and is therefore much more suited for producing hundreds of modules with a well-defined geometry. The reliability of this process was proven by the successful construction of the PILATUS detector. The construction of PILATUS 6M (60 modules) and the CMS pixel barrel (roughly 800 modules) has started in early 2006

  14. Prediction of plasma-induced damage distribution during silicon nitride etching using advanced three-dimensional voxel model

    Energy Technology Data Exchange (ETDEWEB)

    Kuboi, Nobuyuki, E-mail: Nobuyuki.Kuboi@jp.sony.com; Tatsumi, Tetsuya; Kinoshita, Takashi; Shigetoshi, Takushi; Fukasawa, Masanaga; Komachi, Jun; Ansai, Hisahiro [Device and Material Research Group, RDS Platform, Sony Corporation, 4-14-1 Asahi-cho, Atsugi, Kanagawa 243-0014 (Japan)

    2015-11-15

    The authors modeled SiN film etching with hydrofluorocarbon (CH{sub x}F{sub y}/Ar/O{sub 2}) plasma considering physical (ion bombardment) and chemical reactions in detail, including the reactivity of radicals (C, F, O, N, and H), the area ratio of Si dangling bonds, the outflux of N and H, the dependence of the H/N ratio on the polymer layer, and generation of by-products (HCN, C{sub 2}N{sub 2}, NH, HF, OH, and CH, in addition to CO, CF{sub 2}, SiF{sub 2}, and SiF{sub 4}) as ion assistance process parameters for the first time. The model was consistent with the measured C-F polymer layer thickness, etch rate, and selectivity dependence on process variation for SiN, SiO{sub 2}, and Si film etching. To analyze the three-dimensional (3D) damage distribution affected by the etched profile, the authors developed an advanced 3D voxel model that can predict the time-evolution of the etched profile and damage distribution. The model includes some new concepts for gas transportation in the pattern using a fluid model and the property of voxels called “smart voxels,” which contain details of the history of the etching situation. Using this 3D model, the authors demonstrated metal–oxide–semiconductor field-effect transistor SiN side-wall etching that consisted of the main-etch step with CF{sub 4}/Ar/O{sub 2} plasma and an over-etch step with CH{sub 3}F/Ar/O{sub 2} plasma under the assumption of a realistic process and pattern size. A large amount of Si damage induced by irradiated hydrogen occurred in the source/drain region, a Si recess depth of 5 nm was generated, and the dislocated Si was distributed in a 10 nm deeper region than the Si recess, which was consistent with experimental data for a capacitively coupled plasma. An especially large amount of Si damage was also found at the bottom edge region of the metal–oxide–semiconductor field-effect transistors. Furthermore, our simulation results for bulk fin-type field-effect transistor side-wall etching

  15. Reaction bonding and mechanical properties of mullite/silicon carbide composites

    International Nuclear Information System (INIS)

    Based on the RBAO technology, low-shrinkage mullite/SiC/Al2O3/ZrO2 composite were fabricated. A powder mixture of 40 vol% Al, 30 vol% Al2O3, and 30 vol% SiC was attrition milled in acetone with TZP balls which introduced a substantial ZrO2 wear debris into the mixture. The precursor powder was isopressed at 300--900 MPa and heat-treated in air by two different cycles resulting in various phase ratios in the final products. During heating, Al oxidizes to Al2O3 completely, while SiC oxidizes to SiO2 only on its surface. Fast densification (at > 1300 C) and mullite formation (at 1400 C) prevent further oxidation of the SiC particles. Because of the volume expansion associated with the oxidation of Al (28%), SiC (108%), and the mullitization (4.2%), sintering shrinkage is effectively compensated. The reaction-bonded composites exhibit low linear shrinkages and high strengths: shrinkages of 7.2%, 4.8%, and 3%, and strengths of 610, 580, and 490 MPa, corresponding to compaction pressure of 300, 600, and 900 MPa, respectively, were achieved in samples containing 49--55 vol% mullite. HIPing improved significantly the mechanical properties: a fracture strength of 490 MPa and a toughness of 4.1 MPa·m1/2 increased to 890 MPa and 6 MPa·m1/2, respectively

  16. Fracture toughness of hydroxide catalysis bonds between silicon carbide and Zerodur low thermal expansion glass-ceramic

    NARCIS (Netherlands)

    Ende, D.A. van den; Gubbels, G.H.M.

    2014-01-01

    In many optical and precision engineering applications, low thermal distortion materials need to be bonded together reliably. Since high temperature bonding process ultimately introduce stresses in the bond, rendering it dimensionally instable, room temperature or near room temperature processes are

  17. 低温阳极键合工艺研究%Effect of silicon wafer surface treatment on anodic bonding at low temperature

    Institute of Scientific and Technical Information of China (English)

    姚明秋; 李玉萍; 唐彬; 苏伟; 陈颖慧

    2014-01-01

    对低温阳极键合特性进行了研究。通过对硅片进行亲水、疏水和表面未处理3种不同处理方式研究其对键合的影响,键合前将硅片浸入去离子水(DIW)中不同时间,研究硅表面 H基和氧化硅分子数量对键合的影响。结果表明经亲水处理的硅片在水中浸泡1h 的键合效果最佳。并设计了不同烘烤时间下的阳极键合实验,表明在100°C 下烘烤30 min 可以有效减少气泡的数量和尺寸。由不同工艺条件下得到的键合形貌可知,通过控制硅片表面微观状态可以达到减小或消除键合气泡的目的。%The characteristics of anodic bonding at low temperature are researched. The effects on bonding for three different processing modes of silicon, including hydrophilic treatment, hydrophobic treatment and no surface treatment, are studied. The silicon wafers are dipped into Deionized Water(DIW) for different times to investigate the effect of the number of H-terminations and SiO2 molecules on silicon surface for bonding. The results show that the best bond quality is achieved by dropping the silicon wafer with hydrophilic treatment in DIW for 1 h. Anodic bonding experiments at different drying time are designed. The bubble amount and size will decrease at 100 °C after drying for 30 min. According to the results of bonding morphology obtained by different processing conditions, the bubbles can be minimized or eliminated through controlling the microscopic state on silicon surface.

  18. Instantaneous room temperature bonding of a wide range of non-silicon substrates with poly(dimethylsiloxane) (PDMS) elastomer mediated by a mercaptosilane.

    Science.gov (United States)

    Wu, Wenming; Wu, Jing; Kim, Jae-Heon; Lee, Nae Yoon

    2015-07-01

    This paper introduces an instantaneous and robust strategy for bonding a variety of non-silicon substrates such as thermoplastics, metals, an alloy, and ceramics to poly(dimethylsiloxane) (PDMS) irreversibly, mediated by one-step chemical modification using a mercaptosilane at room temperature followed by corona treatment to realize heterogeneous assembly also at room temperature. The mercapto functional group is one of the strongest nucleophiles, and it can instantaneously react with electrophiles of substrates, resulting in an alkoxysilane-terminated substrate at room temperature. In this way, prior oxidation of the substrate is dispensed with, and the alkoxysilane-terminated substrate can be readily oxidized and irreversibly bonded with oxidized PDMS at room temperature. A commercially available Tesla coil was used for surface oxidation, replacing a bulky and expensive plasma generator. Surface characterization was conducted by water contact angle measurement and X-ray photoelectron spectroscopy (XPS) analysis. A total of fifteen non-silicon substrates including polycarbonate (PC), two types of poly(vinylchloride) (PVC), poly(methylmethacrylate) (PMMA), polystyrene (PS), polyimide (PI), two types of poly(ethylene terephthalate) (PET), polypropylene (PP), iron (Fe), aluminum (Al), copper (Cu), brass, alumina (Al2O3), and zirconia (ZrO2) were bonded successfully with PDMS using this method, and the bond strengths of PDMS-PMMA, PDMS-PC, PDMS-PVC, PDMS-PET, PDMS-Al, and PDMS-Cu assemblies were measured to be approximately 335.9, 511.4, 467.3, 476.4, 282.2, and 236.7 kPa, respectively. The overall processes including surface modification followed by surface oxidation using corona treatment for bonding were realized within 12 to 17 min for most of the substrates tested except for ceramics which required 1 h for the bonding. In addition, large area (10 × 10 cm(2)) bonding was also successfully realized, ensuring the high reliability and stability of the introduced

  19. Emerging heterogeneous integrated photonic platforms on silicon

    Directory of Open Access Journals (Sweden)

    Fathpour Sasan

    2015-05-01

    Full Text Available Silicon photonics has been established as a mature and promising technology for optoelectronic integrated circuits, mostly based on the silicon-on-insulator (SOI waveguide platform. However, not all optical functionalities can be satisfactorily achieved merely based on silicon, in general, and on the SOI platform, in particular. Long-known shortcomings of silicon-based integrated photonics are optical absorption (in the telecommunication wavelengths and feasibility of electrically-injected lasers (at least at room temperature. More recently, high two-photon and free-carrier absorptions required at high optical intensities for third-order optical nonlinear effects, inherent lack of second-order optical nonlinearity, low extinction ratio of modulators based on the free-carrier plasma effect, and the loss of the buried oxide layer of the SOI waveguides at mid-infrared wavelengths have been recognized as other shortcomings. Accordingly, several novel waveguide platforms have been developing to address these shortcomings of the SOI platform. Most of these emerging platforms are based on heterogeneous integration of other material systems on silicon substrates, and in some cases silicon is integrated on other substrates. Germanium and its binary alloys with silicon, III–V compound semiconductors, silicon nitride, tantalum pentoxide and other high-index dielectric or glass materials, as well as lithium niobate are some of the materials heterogeneously integrated on silicon substrates. The materials are typically integrated by a variety of epitaxial growth, bonding, ion implantation and slicing, etch back, spin-on-glass or other techniques. These wide range of efforts are reviewed here holistically to stress that there is no pure silicon or even group IV photonics per se. Rather, the future of the field of integrated photonics appears to be one of heterogenization, where a variety of different materials and waveguide platforms will be used for

  20. Heterogeneously Integrated Distributed Feedback Quantum Cascade Lasers on Silicon

    Directory of Open Access Journals (Sweden)

    Alexander Spott

    2016-06-01

    Full Text Available Silicon integration of mid-infrared (MIR photonic devices promises to enable low-cost, compact sensing and detection capabilities that are compatible with existing silicon photonic and silicon electronic technologies. Heterogeneous integration by bonding III-V wafers to silicon waveguides has been employed previously to build integrated diode lasers for wavelengths from 1310 to 2010 nm. Recently, Fabry-Pérot Quantum Cascade Lasers integrated on silicon provided a 4800 nm light source for mid-infrared (MIR silicon photonic applications. Distributed feedback (DFB lasers are appealing for many high-sensitivity chemical spectroscopic sensing applications that require a single frequency, narrow-linewidth MIR source. While heterogeneously integrated 1550 nm DFB lasers have been demonstrated by introducing a shallow surface grating on a silicon waveguide within the active region, no mid-infrared DFB laser on silicon has been reported to date. Here we demonstrate quantum cascade DFB lasers heterogeneously integrated with silicon-on-nitride-on-insulator (SONOI waveguides. These lasers emit over 200 mW of pulsed power at room temperature and operate up to 100 °C. Although the output is not single mode, the DFB grating nonetheless imposes wavelength selectivity with 22 nm of thermal tuning.

  1. Vitreous bond CBN high speed and high material removal rate grinding of ceramics

    Energy Technology Data Exchange (ETDEWEB)

    Shih, A.J.; Grant, M.B.; Yonushonis, T.M. [Cummins Engine Co., Inc., Columbus, IN (United States); Morris, T.O.; McSpadden, S.B. [Oak Ridge National Lab., TN (United States)

    1998-08-01

    High speed (up to 127 m/s) and high material removal rate (up to 10 mm{sup 3}/s/mm) grinding experiments using a vitreous bond CBN wheel were conducted to investigate the effects of material removal rate, wheel speed, dwell time and truing speed ratio on cylindrical grinding of silicon nitride and zirconia. Experimental results show that the high grinding wheel surface speed can reduce the effective chip thickness, lower grinding forces, enable high material removal rate grinding and achieve a higher G-ratio. The radial feed rate was increased to as high as 0.34 {micro}m/s for zirconia and 0.25 {micro}m/s for silicon nitride grinding to explore the advantage of using high wheel speed for cost-effective high material removal rate grinding of ceramics.

  2. Effect of Aluminium Powder on Microstructure and Property of Corundum-Silicon Nitride Composites%铝粉对刚玉-氮化硅复合材料微观结构和性能的影响

    Institute of Scientific and Technical Information of China (English)

    魏军从; 涂军波

    2011-01-01

    借鉴"过渡塑性相工艺"思想,在刚玉-氮化砖复合材料中引入12.5%(质量分数)的铝粉,研究了铝粉对刚玉-氮化硅复合材料成型性能以及1 600℃空气中烧成后样品的体积密度、显气孔率和耐压强度的影响:利用X射线衍射仪和扫描电镜对材料的物相和微观结构进行了分析.结果表明:在刚玉-氮化硅复合材料中引入铝粉,有利于成型过程中孔隙的填充,坯体显气孔率由21.57%下降为20.42%,坯体致密度提高.样品在空气气氛中烧成后,未加铝粉样品表面形成的致密氧化膜厚度约为3mm,而加入铝粉样品表面氧化膜的厚度约为0.2mm;铝粉先于氮化硅粉发生原位氧化,降低了样品内部的氧分压,残留的铝粉发生氧化或氮化反应生成活性中间产物,促进了样品的烧结.%Corundum-silicon nitride samples were sintered at 1 600 ℃ in air by introduction of 12.5% (in mass) aluminium powder inspired by a transient plastic phase process. Effects of aluminium powder on the forming property as well as bulk density, apparent porosity, and compressive strength of the samples were investigated. The phase composition and microstructure of the reaction products were analysed by X-ray diffractometer and scanning electron microscope. The results indicate that the plasticity of aluminium favors the filling of the interstices during the forming process and improves the densification of the corundum-silicon nitride materials. The apparent porosity decreases from 21.75% to 20.42%. The samples without introduction of any aluminum powder have a compact superficial oxidized film of 3 mm, and the samples with the introduction of aluminum powder have the film of 0.2 mm after fired in air atmosphere. Aluminium precedes silicon nitride to be oxidized in situ, reducing the oxygen partial pressure inside the sample.The residual aluminium is oxidized or nitrided to form the active intermediate products, contributing to the sinter of the

  3. Universal solders for direct and powerful bonding on semiconductors, diamond, and optical materials

    Science.gov (United States)

    Mavoori, Hareesh; Ramirez, Ainissa G.; Jin, Sungho

    2001-05-01

    The surfaces of electronic and optical materials such as nitrides, carbides, oxides, sulfides, fluorides, selenides, diamond, silicon, and GaAs are known to be very difficult to bond with low melting point solders (<300 °C). We have achieved a direct and powerful bonding on these surfaces by using low temperature solders doped with rare-earth elements. The rare earth is stored in micron-scale, finely-dispersed intermetallic islands (Sn3Lu or Au4Lu), and when released, causes chemical reactions at the interface producing strong bonds. These solders directly bond to semiconductor surfaces and provide ohmic contacts. They can be useful for providing direct electrical contacts and interconnects in a variety of electronic assemblies, dimensionally stable and reliable bonding in optical fiber, laser, or thermal management assemblies.

  4. Compensation of the dangling-bond space charge in amorphous silicon solar cells by graded low-level doping in the intrinsic layer

    OpenAIRE

    Fischer, D.; Shah, Arvind

    2008-01-01

    The compensation of the dangling-bond space charge in amorphous silicon p-i-n solar cells by graded, low-level doping in the intrinsic layer is discussed and demonstrated experimentally. Carrier collection in p-i-n cells without doping indicates that the degraded state space charge is largely positive, and thus that boron doping should be beneficial. Solar cells with linearly decreasing boron doping profiles are shown to yield a homogeneous collection in the intrinsic layer, and a red light c...

  5. Control of Microstructural Development in Reaction—Bonded Silicon Nitride(RBSN) by Seeding With β—Si3N4 Single Crystals

    Institute of Scientific and Technical Information of China (English)

    K.Amoako-Appiagyei; ByungSeiJun; 等

    1998-01-01

    The addition of β-Si3N4 seed grains to a ceramic powder is an effective means of controlling the microstructural evolution,In this work addition of β-Si3N4 seed grains gave rise to a bi-modal microstructure made up of large rod-lkike grains that grew from the added seed during the liquid phase sintering process and the usua elongated grains which are developed from the α→β transformation process in silicon nitride,The morphology of te grains that were grown epitaxially from the seed was influenced by the size and shape of the seed crystals;the relatively large and elongated seed grains gave rise to large rod-like grains whilst those with equiaxed-like shape gave rise to large grains similar in shape to the seed from which they were grown.The evolution of the large rod-like grains and the resultant bi-modal microstructure led to a considerable improvement in the mechanical properties.

  6. Design, simulation and fabrication of a flexible bond pad with a hollow annular protuberance to improve the thermal fatigue lifetime for through-silicon vias

    International Nuclear Information System (INIS)

    This paper presents a flexible bond pad (FBP) with a hollow annular protuberance to improve the thermal fatigue lifetime for its application to through-silicon vias (TSVs). The hollow annular protuberance structure across the interface between the filled copper in TSV and silicon substrate not only isolates the FBP from stress/strain concentration regions (the corners of the TSV) but also disperses TSV-induced deformation. The plastic strain distributions of the FBP and conventional plate-type bond pad (CPBP) were simulated by finite element method (FEM) under the temperature cycles. Based on the simulation results, the thermal fatigue lifetimes of the CPBP and the FBP with different TSV diameters were predicted by the Coffin–Manson equation. The results indicate that thermal fatigue lifetimes of the FBP are significantly greater than those of the CPBP and their fatigue lifetimes both decrease with the increase of TSV diameter. To examine the reliability of the predicted results, the CPBP and the FBP with TSV diameter of 100 µm were fabricated by MEMS technology and temperature cycling tests (TCTs) were performed to obtain their thermal fatigue lifetimes. The test results are in good agreement with the numerical simulation results, and it shows that the proposed FBP can effectively improve the thermal fatigue lifetime for TSVs. (paper)

  7. Theoretical Analysis of Thermal Transport in Graphene Supported on Hexagonal Boron Nitride: The Importance of Strong Adhesion Due to π -Bond Polarization

    Science.gov (United States)

    Pak, Alexander J.; Hwang, Gyeong S.

    2016-09-01

    One important attribute of graphene that makes it attractive for high-performance electronics is its inherently large thermal conductivity (κ ) for the purposes of thermal management. Using a combined density-functional theory and classical molecular-dynamics approach, we predict that the κ of graphene supported on hexagonal boron nitride (h -BN) can be as large as 90% of the κ of suspended graphene, in contrast to the significant suppression of κ (more than 70% reduction) on amorphous silica. Interestingly, we find that this enhanced thermal transport is largely attributed to increased lifetimes of the in-plane acoustic phonon modes, which is a notable contrast from the dominant contribution of out-of-plane acoustic modes in suspended graphene. This behavior is possible due to the charge polarization throughout graphene that induces strong interlayer adhesion between graphene and h -BN. These findings highlight the potential benefit of layered dielectric substrates such as h -BN for graphene-based thermal management, in addition to their electronic advantages. Furthermore, our study brings attention to the importance of understanding the interlayer interactions of graphene with layered dielectric materials which may offer an alternative technological platform for substrates in electronics.

  8. Joining of SiC Fiber-Bonded Ceramics using Silver, Copper, Nickel, Palladium, and Silicon-Based Alloy Interlayers

    Energy Technology Data Exchange (ETDEWEB)

    Asthana, Rajiv [University of Wisconsin-Stout, Menomonie; Singh, Mrityunjay [NASA-Glenn Research Center, Cleveland; Lin, Hua-Tay [ORNL; Matsunaga, Kenji [Ube Industries, Ltd.; Ishikawa, Toshihiro [Ube Industries, Ltd.

    2013-01-01

    SiC fiber-bonded ceramics, SA-Tyrannohex, (SA-THX) with perpendicular and parallel fiber orientations were brazed using Ag-, Ni- and Pd-base brazes, and four Si X (X: Ti, Cr, Y, Ta) eutectics. Outcomes were variable, ranging from bonded joints through partially bonded to un-bonded joints. Prominent Ti- and Si-rich interfaces developed with Cusil-ABA, Ticusil, and Copper-ABA and Ni- and Si-rich layers with MBF-20. Stress rupture tests at 650 and 750 C on Cusil-ABA-bonded joints revealed a temperature-dependent behavior for the perpendicular joints but not for the parallel joints with failure occurring at brazed interface. Higher-use temperatures can be targeted with eutectic Si Ti and Si Cr alloys.

  9. Formation of organic monolayers on hydrogen-terminated silicon surfaces via silicon-carbon bond: effect of terminal groups on stability

    International Nuclear Information System (INIS)

    Full text: Functionalization of hydrogen-terminated silicon surfaces with stable and dense aryl-terminated alkyl self-assembled monolayers (SAMs) provides opportunities for the development of low cost organic field effect transistors. In this paper we present results for one such σ-π SAMs, 3-phenylpropyl (C6H5(CH2)3-) SAMs on porous silicon, and compare its stability with octyl (CH3(CH2)7-) SAMs on Si(100). The SAMs were prepared using the Grignard reagent method and characterized using X-ray photoelectron and FT-infrared spectroscopies and contact angle measurements Our results show the 3-phenylpropyl SAMs are not as susceptible to oxidation as the octyl SAMs, and we attribute the increased stability in the former to be due to its more dense structure arising from the π-π stacking of the phenyl rings. Copyright (2005) Australian Institute of Physics

  10. 聚酰亚胺树脂/立方氮化硼砂轮的制备及其磨削性能%Preparation and Grinding Performance of Polyimide Resin Bonded Cubic Boron Nitride Composite Grinding Wheels

    Institute of Scientific and Technical Information of China (English)

    陈建林; 万隆; 陈荐; 毛聪

    2013-01-01

    对立方氮化硼(CBN)磨粒和聚酰亚胺(PI)树脂进行热压固化成型和后续热处理,制备了PI树脂/CBN砂轮,用热重-差示扫描量热分析仪、红外光谱仪、扫描电子显微镜、磨削试验设备及力学性能试验机等研究了PI树脂的固化反应机理、PI树脂/CBN砂轮的制备工艺及磨削性能.结果表明;试验所用PI树脂的固化反应存在线型与体型聚合两个固化反应放热峰,峰值分别在140 ℃与235℃;PI树脂/CBN砂轮能够精密磨削淬火45钢,磨削后表面粗糙度达到0.19 μm,磨削比为775,在相同磨削条件下比酚醛树脂/CBN砂轮的耐用性更佳.%A polyimide resin (PI) bonded cubic boron nitride (CBN) abrasive grain grinding wheel was prepared by hot-pressing curing and forming and subsequent thermal treatment. The PI resin curing mechanism, the manufacturing process and grinding performance of the PI resin/CBN wheel were investigated by differential scanning calorimeter and thermogravimetry analysis, infrared spectroscopy, scanning electron microscopy, mechanical property test and grinding experiments. Results show that there were two exothermic peaks of 140℃ and 235℃ corresponding to chain and a cross-linking polymerization reaction, respectively in the PI resin curing process. Surface roughness of 0. 19 μm and grinding ratio of 775 were obtained when the PI resin bonded CBN wheel grinded the hardened steel 45. The PI resin bonded CBN wheel exhibited better durability than the phenolic resin bonded CBN grinding wheel under the same grinding conditioa.

  11. Composite of Barium Aluminosilicate Reinforced in situ with Silicon Nitride%原位生长β-Si3N4增强BAS基体复合材料

    Institute of Scientific and Technical Information of China (English)

    顾建成; 吴建生; 曹光宇; 周玉; 雷廷权

    2001-01-01

    BAS glass-ceramic powders were prepared by sol-gel processing. The procedure of transformation of BAS was investigated by DTA and XRD. Effects of additional Li2O with NH4F on transformation from H→M of Barium aluminosilicate were also studied. No evidence is found that the addition of BAS or Si3N4 can influence the transformation from α-Si3N4→β-Si3N4 or from H→M of Barium aluminosilicate. The results show that the flexural strength and fracture toughness value of the BAS glass-ceramic matrix composites can be effectively improved by in situ rod-like silicon nitride. The main toughening mechanism is crack deflection, pull-out and bridging. The increased value of flexural strength is contributed to the load transition effect from matrix to rod-like silicon nitride.%用溶胶-凝胶法合成化学定比BAS(BaO-Al2O3-2SiO2)粉末,并用差热分析和XRD法分析基相变过程、氧化锂对BAS相变过程影响、晶种对BAS相变过程的影响,考察了BAS对氮化硅相变的影响以及加入晶种后对氮化硅相变的影响.用热压氮气保护法制备了自生β-Si3N4增强BAS的复合材料,并比较了其力学性能与BAS的力学性能.结果表明,纯BAS相变产物是六方相,氧化锂与氟化物的加入,促进了BAS单斜相的形成,BAS单斜晶种能有效地促进BAS单斜相的形成;BAS能够促进氮化硅由α-Si3N4→β-Si3N4的相变,β-Si3N4能有效地提高BAS微晶玻璃的强度和断裂韧性,分析了增强和增韧机理.

  12. 三维打印结合反应烧结制备多孔氮化硅陶瓷%Porous Silicon Nitride Ceramics Prepared by 3D Printing and Reaction Sintering

    Institute of Scientific and Technical Information of China (English)

    翁作海; 曾庆丰; 谢聪伟; 彭军辉; 张瑾

    2013-01-01

    Using silicon powder as starting material and dextrin as binder, porous silicon green body was prepared via 3D printing technology, and then highly porous silicon nitride ceramic was obtained by reaction sintering. The influence of sintering process on the property of the 3DP porous Si3N4 was investigated. The results show that, when the silicon green body was prepared by the 3D printer followed by the step-by-step heating process, porous Si3N4 ceramic with flexural strength of (5. 1 + 0. 3) MPa and porosity of (74. 3 + 0. 6) % was obtained. After reaction sintering, the linear shrinkages of the samples were smaller than 2. 0%. Ceramic parts with complex shapes can be ma-nufactured by such hybrid 3DP and reaction sintering technology with free-form and near-net-shape features.%以硅粉(Si)为起始原料,糊精为粘结剂,采用三维打印(3DP)快速成型技术制备出多孔硅坯体,通过反应烧结得到高孔隙率的氮化硅(Si3N4)陶瓷.研究了反应烧结工艺对3DP多孔Si3N4陶瓷性能的影响.结果表明:3DP成型的硅坯体采用阶梯式升温机制,可得到抗弯强度为(5.1±0.3)MPa,孔隙率达(74.3±0.6)%的多孔Si3 N4陶瓷.反应烧结后,样品的线收缩率小于2.O%.三维打印结合反应烧结法实现了复杂形状陶瓷构件的无模制造与净尺寸成型.

  13. Nested potassium hydroxide etching and protective coatings for silicon-based microreactors

    Science.gov (United States)

    de Mas, Nuria; Schmidt, Martin A.; Jensen, Klavs F.

    2014-03-01

    We have developed a multilayer, multichannel silicon-based microreactor that uses elemental fluorine as a reagent and generates hydrogen fluoride as a byproduct. Nested potassium hydroxide etching (using silicon nitride and silicon oxide as masking materials) was developed to create a large number of channels (60 reaction channels connected to individual gas and liquid distributors) of significantly different depths (50-650 µm) with sloped walls (54.7° with respect to the (1 0 0) wafer surface) and precise control over their geometry. The wetted areas were coated with thermally grown silicon oxide and electron-beam evaporated nickel films to protect them from the corrosive fluorination environment. Up to four Pyrex layers were anodically bonded to three silicon layers in a total of six bonding steps to cap the microchannels and stack the reaction layers. The average pinhole density in as-evaporated films was 3 holes cm-2. Heating during anodic bonding (up to 350 °C for 4 min) did not significantly alter the film composition. Upon fluorine exposure, nickel films (160 nm thick) deposited on an adhesion layer of Cr (10 nm) over an oxidized silicon substrate (up to 500 nm thick SiO2) led to the formation of a nickel fluoride passivation layer. This microreactor was used to investigate direct fluorinations at room temperature over several hours without visible signs of film erosion.

  14. DFT Studies on Electronic Structures of Boro-Nitride-Carbon Nanotubes

    Institute of Scientific and Technical Information of China (English)

    YAN Ming; HUANG Chun-Hui

    2005-01-01

    In this paper, the configurations of Boro-Nitride-Carbon nanotubes with BNC2 composition were optimized by ROHF method. According to the density functional theory, the electronic structures of Boro-Nitride-Carbon nanotubes were calculated by DFT/ROB3LYP method. By analyzing the energy gap, density of electronic state and bonding maps of atoms, the conductive properties of Boro-Nitride-Carbon nanotubes were obtained, and compared with those of carbon nanotubes and other Boro-Nitride nanotubes.

  15. Synthesis and photoluminescence of heavily La-doped α-Si{sub 3}N{sub 4} nanowires via nitriding cyromilled nanocrystalline La-doped silicon powder

    Energy Technology Data Exchange (ETDEWEB)

    Wang, Zhihao; Huang, Zhifeng [State Key Lab of Advanced Technology for Materials Synthesis and Processing, Wuhan University of Technology, Wuhan 430070 (China); Chen, Fei, E-mail: chenfei027@gmail.com [State Key Lab of Advanced Technology for Materials Synthesis and Processing, Wuhan University of Technology, Wuhan 430070 (China); Key Laboratory of Advanced Technology for Specially Functional Materials, Ministry of Education, Wuhan University of Technology, Wuhan 430070 (China); Shen, Qiang [State Key Lab of Advanced Technology for Materials Synthesis and Processing, Wuhan University of Technology, Wuhan 430070 (China); Zhang, Lianmeng [State Key Lab of Advanced Technology for Materials Synthesis and Processing, Wuhan University of Technology, Wuhan 430070 (China); Key Laboratory of Advanced Technology for Specially Functional Materials, Ministry of Education, Wuhan University of Technology, Wuhan 430070 (China)

    2014-07-01

    In this paper, the synthesis of heavily La-doped α-Si{sub 3}N{sub 4} nanowires is firstly reported via nitriding the cryomilled La-doped nanocrystalline Si powder. The crystal structure, electronic structure and band structure of La-doped α-Si{sub 3}N{sub 4} are calculated by using the CASTEP program code based on the first principles plane-wave pseudo-potential method. The microstructure and photoluminescence of heavily La-doped α-Si{sub 3}N{sub 4} nanowires are investigated. The results suggest that La has been already incorporated into Si lattice after the cryomilling process and then successfully entered the lattice of α-Si{sub 3}N{sub 4} with the nitridation process. The as-synthesized heavily La-doped α-Si{sub 3}N{sub 4} nanowires show high purity and good crystallinity with 30–40 nm in diameter and several tens of micrometers in length. The optical property shows that there is an intense violet–blue visible emission from 350 nm to 450 nm with one peak at 388 nm due to the recombination between the valence band and the N{sub 4}{sup +} level at room temperature, which is in agreement with the calculated band structure of La-doped α-Si{sub 3}N{sub 4}. - Highlights: • Nanocrystalline La-doped Si powders are prepared by cryomilling with liquid nitrogen. • Heavily La-doped α-Si{sub 3}N{sub 4} nanowires are synthesized via nitriding La-doped Si powder. • Crystal structure and band structure of La-doped α-Si{sub 3}N{sub 4} are calculated. • La-doped α-Si{sub 3}N{sub 4} nanowires have an intense violet–blue visible emission at room temperature. • The photoluminescence mechanism of La-doped α-Si{sub 3}N{sub 4} nanowires is discussed.

  16. Quantum chemistry and atomistic simulations of solid nitrides

    OpenAIRE

    Eck, Bernhard

    2000-01-01

    The present thesis covers, at first, the binary nitrides of the the 3d transition metals. Based on their electronic band structures and bonding analyses for the sodium chloride as well as the zinc blend structure type it is then determined why the early nitrides crystallize in the NaCl structure while Fe- and Co-nitride adopt the ZnS structure. Thereafter all stoichiometrically well-defined iron nitrides are theoretically investigated, in particular with respect to the influence of the nitrog...

  17. 连续氮化硅陶瓷纤维的组成结构与性能研究∗%Composition,structure and properties of continuous silicon nitride fibers

    Institute of Scientific and Technical Information of China (English)

    胡暄; 纪小宇; 邵长伟; 王军; 王浩

    2016-01-01

    Amorphous silicon nitride fibers were prepared by nitridation of polycarbosilane fiber,and their com-position,structure and properties were characterized using popular methods.KD-SN fiber was produced by Na-tional University of Defense Technology (NUDT),given near chemical stoichiometric composition of Si3 N4 with traces oxygen and carbon.The volume density and linear density were 2.3 g/cm3 and 280 tex respectively. The dielectric constant was 6-8 and the tanδwas 0.01-0.08.The tensile strength and modulus of elasticity were 1.5 and 140 GPa respectively.The high temperature tests were taken in the nitrogen atmosphere at 1 300, 1 350,1 400 and 1450 ℃ with a holding time of 1 h.The tensile strength was kept above 90% of the original fi-ber.Over 1 350 ℃,the tensile strength and modulus decreased sharply,even though the composition changed little.The fibers could keep their amorphous state before 1 450 ℃ but nanopores’volume was increased signifi-cantly.Overall,the KD-SN silicon nitride fiber offers a promising choice for high temperature ceramic matrix composites.%连续氮化硅陶瓷纤维是透波/承载一体化陶瓷基复合材料的关键原材料,也是制约复合材料耐高温性能与力学性能的关键因素.系统研究了国防科技大学研制的连续氮化硅纤维的组成结构及其力学性能和介电性能,分析了纤维在氮气中高温处理后组成结构与单丝强度变化规律.结果表明,氮化硅纤维主要以Si3 N4结构存在,组成上接近化学计量比,介电常数为68,介电损耗为0.01~0.08,室温单丝强度约1.5 GPa,弹性模量140 GPa,在1350℃以下纤维强度保留率超过90%,在1400和1450℃氮气中处理1 h仍保持了非晶结构,强度保留率分别为75%和30%,综合性能满足了高温透波复合材料的基本要求.

  18. Microfabrication, separations, and detection by mass spectrometry on ultrathin-layer chromatography plates prepared via the low-pressure chemical vapor deposition of silicon nitride onto carbon nanotube templates.

    Science.gov (United States)

    Kanyal, Supriya S; Häbe, Tim T; Cushman, Cody V; Dhunna, Manan; Roychowdhury, Tuhin; Farnsworth, Paul B; Morlock, Gertrud E; Linford, Matthew R

    2015-07-24

    Microfabrication of ultrathin-layer chromatography (UTLC) plates via conformal deposition of silicon nitride by low-pressure chemical vapor deposition onto patterned carbon nanotube (CNT) scaffolds was demonstrated. After removal of the CNTs and hydroxylation, the resulting UTLC phase showed no expansion or distortion of their microfeatures and the absence/reduction of remaining nitrogenic species. Developing time of a mixture of lipophilic dyes on this UTLC plates was 86% shorter than on high-performance thin-layer chromatography (HPTLC) plates. A water-soluble food dye mixture was also separated resulting in low band broadening and reduced developing time compared to HPTLC. For the latter example, mobile phase optimization on a single UTLC plate consisted of 14 developments with different mobile phases, each preceded by a plate prewashing step. The same plate was again reused for additional 11 separations under varying conditions resulting in a development procedure with a mean separation efficiency of 233,000theoretical plates/m and a reduced mobile phase consumption of only 400μL. This repeated use proved the physical robustness of the ultrathin layer and its resistance to damage. The layer was highly suited for hyphenation to ambient mass spectrometry, including desorption electrospray ionization (DESI) mass spectrometry imaging and direct analysis in real time (DART) mass spectrometry.

  19. A first principles analysis of the effect of hydrogen concentration in hydrogenated amorphous silicon on the formation of strained Si-Si bonds and the optical and mobility gaps

    Energy Technology Data Exchange (ETDEWEB)

    Legesse, Merid; Nolan, Michael, E-mail: Michael.nolan@tyndall.ie; Fagas, Giorgos, E-mail: Georgios.fagas@tyndall.ie [Tyndall National Institute, University College Cork, Lee Maltings, Dyke Parade, Cork (Ireland)

    2014-05-28

    In this paper, we use a model of hydrogenated amorphous silicon generated from molecular dynamics with density functional theory calculations to examine how the atomic geometry and the optical and mobility gaps are influenced by mild hydrogen oversaturation. The optical and mobility gaps show a volcano curve as the hydrogen content varies from undersaturation to mild oversaturation, with largest gaps obtained at the saturation hydrogen concentration. At the same time, mid-gap states associated with dangling bonds and strained Si-Si bonds disappear at saturation but reappear at mild oversaturation, which is consistent with the evolution of optical gap. The distribution of Si-Si bond distances provides the key to the change in electronic properties. In the undersaturation regime, the new electronic states in the gap arise from the presence of dangling bonds and strained Si-Si bonds, which are longer than the equilibrium Si-Si distance. Increasing hydrogen concentration up to saturation reduces the strained bonds and removes dangling bonds. In the case of mild oversaturation, the mid-gap states arise exclusively from an increase in the density of strained Si-Si bonds. Analysis of our structure shows that the extra hydrogen atoms form a bridge between neighbouring silicon atoms, thus increasing the Si-Si distance and increasing disorder in the sample.

  20. Microstructures and mechanical properties of carbon fiber reinforced silicon nitride composites prepared by gel-casting%凝胶注模法制备碳纤维/氮化硅复合材料的微观结构与力学性能

    Institute of Scientific and Technical Information of China (English)

    黄龙; 肖鹏; 罗衡; 周伟

    2014-01-01

    通过化学气相沉积在短碳纤维表面制备C/SiC复合涂层,然后采用凝胶注模法制备纤维体积分数分别为2%和4%的Cf/Si3N4复合材料,利用X射线衍射与扫描电镜对该材料的物相与组织结构进行分析,研究短碳纤维对Si3N4陶瓷力学性能的影响。结果表明:随碳纤维体积分数增加,Cf/Si3N4复合材料的密度和抗弯强度降低,但断裂韧性明显提高。当纤维体积分数为4%时,材料的断裂韧性达到8.91 MPa·m1/2,比氮化硅陶瓷提高1.6倍,材料主要由长柱状的β-Si3N4基体、C/SiC涂层及碳纤维组成,碳纤维表面的C/SiC双涂层可防止高温下碳纤维与氮化硅基体发生反应,使碳纤维与氮化硅基体界面结合良好,以提高材料韧性并保证有合适的强度,满足功能材料在一定条件下的使用要求。%Carbon fiber reinforced silicon nitride matrix composites (Cf/Si3N4) with short carbon fibers of 0%,2% and 4%(volume fraction)were prepared by gel-casting . The phase composition and microstructure of Cf/Si3N4 were studied by XRD and SEM. The effect of volume fraction of short carbon fiber on mechanical properties of the composites was investigated. The results show that: with increasing the content of short carbon fiber, the density and bending strength of Cf/Si3N4composites decrease, while the fracture toughness increases obviously. The fracture toughness is 8.91 MPa·m1/2 which is 1.6 times higher than that of single phase silicon nitride ceramics when the volume fraction of short carbon fibers is 4%. The composite is mainly composed of long cylindricalβ-Si3N4 matrix, C/SiC coatings and carbon fiber. The C/SiC double coating can prevent the reaction between carbon fiber and SiC matrix, which is beneficial to the bonding of the interface, and then increasing toughness and providing suitable strength.