Glass binder development for a glass-bonded sodalite ceramic waste form

International Nuclear Information System (INIS)

Riley, Brian J.; Vienna, John D.; Frank, Steven M.; Kroll, Jared O.; Peterson, Jacob A.

2017-01-01

This paper discusses work to develop Na_2O-B_2O_3-SiO_2 glass binders for immobilizing LiCl-KCl eutectic salt waste in a glass-bonded sodalite waste form following electrochemical reprocessing of used metallic nuclear fuel. In this paper, five new glasses with ~20 mass% Na_2O were designed to generate waste forms with high sodalite. The glasses were then used to produce ceramic waste forms with a surrogate salt waste. The waste forms made using these new glasses were formulated to generate more sodalite than those made with previous baseline glasses for this type of waste. The coefficients of thermal expansion for the glass phase in the glass-bonded sodalite waste forms made with the new binder glasses were closer to the sodalite phase in the critical temperature region near and below the glass transition temperature than previous binder glasses used. Finally, these improvements should result in lower probability of cracking in the full-scale monolithic ceramic waste form, leading to better long-term chemical durability.

The pricing of firm bonds with extendable maturity by the reduced form approach

Directory of Open Access Journals (Sweden)

REN Xuemin

2012-10-01

Full Text Available We associate credit events with market rates to price firm bonds with extendable maturity.We deal with the credit risk by the reduced form approach and obtain the pricing formula for firm bonds with extendable maturity by the PDE approach under the assumption of stochastic interest rate and compare its return rate with that of ordinary firm bonds.

32 CFR Appendix E to Part 623 - Surety Bond (DA Form 4881-3-R)

Science.gov (United States)

2010-07-01

... 32 National Defense 3 2010-07-01 2010-07-01 true Surety Bond (DA Form 4881-3-R) E Appendix E to Part 623 National Defense Department of Defense (Continued) DEPARTMENT OF THE ARMY SUPPLIES AND EQUIPMENT LOAN OF ARMY MATERIEL Pt. 623, App. E Appendix E to Part 623—Surety Bond (DA Form 4881-3-R...

Glass-bonded iodosodalite waste form for immobilization of 129I

Science.gov (United States)

Chong, Saehwa; Peterson, Jacob A.; Riley, Brian J.; Tabada, Diana; Wall, Donald; Corkhill, Claire L.; McCloy, John S.

2018-06-01

Immobilization of radioiodine is an important requirement for current and future nuclear fuel cycles. Iodosodalite [Na8(AlSiO4)6I2] was synthesized hydrothermally from metakaolin, NaI, and NaOH. Dried unwashed sodalite powders were used to synthesize glass-bonded iodosodalite waste forms (glass composite materials) by heating pressed pellets at 650, 750, or 850 °C with two types of sodium borosilicate glass binders. These heat-treated specimens were characterized with X-ray diffraction, Fourier-transform infrared spectroscopy, scanning electron microscopy, energy dispersive spectroscopy, thermal analysis, porosity and density measurements, neutron activation analysis, and inductively-coupled plasma mass spectrometry. For the best waste form produced (pellets mixed with 10 mass% of glass binder and heat-treated at 750 °C), the maximum possible elemental iodine loading was 19.8 mass%, but only ∼8-9 mass% waste loading of iodine was retained in the waste form after thermal processing. Other pellets with higher iodine retention either contained higher porosity or were incompletely sintered. ASTM C1308 and C1285 (product consistency test, PCT) experiments were performed to understand chemical durability under diffusive and static conditions. The C1308 test resulted in significantly higher normalized loss compared to the C1285 test, most likely because of the strong effect of neutral pH solution renewal and prevention of ion saturation in solution. Both experiments indicated that release rates of Na and Si were higher than for Al and I, probably due to a poorly durable Na-Si-O phase from the glass bonding matrix or from initial sodalite synthesis; however the C1308 test result indicated that congruent dissolution of iodosodalite occurred. The average release rates of iodine obtained from C1308 were 0.17 and 1.29 g m-2 d-1 for 80 or 8 m-1, respectively, and the C1285 analysis gave a value of 2 × 10-5 g m-2 d-1, which is comparable to or better than the durability of

FE modeling of Cu wire bond process and reliability

NARCIS (Netherlands)

Yuan, C.A.; Weltevreden, E.R.; Akker, P. van den; Kregting, R.; Vreugd, J. de; Zhang, G.Q.

2011-01-01

Copper based wire bonding technology is widely accepted by electronic packaging industry due to the world-wide cost reduction actions (compared to gold wire bond). However, the mechanical characterization of copper wire differs from the gold wire; hence the new wire bond process setting and new bond

Relating structural parameters to leachability in a glass-bonded ceramic waste form

International Nuclear Information System (INIS)

Frank, S. M.; Johnson, S. G.; Moschetti, T. L.

1998-01-01

Lattice parameters for a crystalline material can be obtained by several methods, notably by analyzing x-ray powder diffraction patterns. By utilizing a computer program to fit a pattern, one can follow the evolution or subtle changes in a structure of a crystalline species in different environments. This work involves such a study for an essential component of the ceramic waste form that is under development at Argonne National Laboratory. Zeolite 4A and zeolite 5A are used to produce two different types of waste forms: a glass-bonded sodalite and a glass-bonded zeolite, respectively. Changes in structure during production of the waste forms are discussed. Specific salt-loadings in the sodalite waste form are related to relative peak intensities of certain reflections in the XRD patterns. Structural parameters for the final waste forms will also be given and related to leachability under standard conditions

Translational vibrations between chains of hydrogen-bonded molecules in solid-state aspirin form I

Science.gov (United States)

Takahashi, Masae; Ishikawa, Yoichi

2013-06-01

We perform dispersion-corrected first-principles calculations, and far-infrared (terahertz) spectroscopic experiments at 4 K, to examine translational vibrations between chains of hydrogen-bonded molecules in solid-state aspirin form I. The calculated frequencies and relative intensities reproduce the observed spectrum to accuracy of 11 cm-1 or less. The stronger one of the two peaks assigned to the translational mode includes the stretching vibration of the weak hydrogen bond between the acetyl groups of a neighboring one-dimensional chain. The calculation of aspirin form II performed for comparison gives the stretching vibration of the weak hydrogen bond in one-dimensional chain.

MLKL forms disulfide bond-dependent amyloid-like polymers to induce necroptosis.

Science.gov (United States)

Liu, Shuzhen; Liu, Hua; Johnston, Andrea; Hanna-Addams, Sarah; Reynoso, Eduardo; Xiang, Yougui; Wang, Zhigao

2017-09-05

Mixed-lineage kinase domain-like protein (MLKL) is essential for TNF-α-induced necroptosis. How MLKL promotes cell death is still under debate. Here we report that MLKL forms SDS-resistant, disulfide bond-dependent polymers during necroptosis in both human and mouse cells. MLKL polymers are independent of receptor-interacting protein kinase 1 and 3 (RIPK1/RIPK3) fibers. Large MLKL polymers are more than 2 million Da and are resistant to proteinase K digestion. MLKL polymers are fibers 5 nm in diameter under electron microscopy. Furthermore, the recombinant N-terminal domain of MLKL forms amyloid-like fibers and binds Congo red dye. MLKL mutants that cannot form polymers also fail to induce necroptosis efficiently. Finally, the compound necrosulfonamide conjugates cysteine 86 of human MLKL and blocks MLKL polymer formation and subsequent cell death. These results demonstrate that disulfide bond-dependent, amyloid-like MLKL polymers are necessary and sufficient to induce necroptosis.

Mechanism of bonding and debonding using surface activated bonding method with Si intermediate layer

Science.gov (United States)

Takeuchi, Kai; Fujino, Masahisa; Matsumoto, Yoshiie; Suga, Tadatomo

2018-04-01

Techniques of handling thin and fragile substrates in a high-temperature process are highly required for the fabrication of semiconductor devices including thin film transistors (TFTs). In our previous study, we proposed applying the surface activated bonding (SAB) method using Si intermediate layers to the bonding and debonding of glass substrates. The SAB method has successfully bonded glass substrates at room temperature, and the substrates have been debonded after heating at 450 °C, in which TFTs are fabricated on thin glass substrates for LC display devices. In this study, we conducted the bonding and debonding of Si and glass in order to understand the mechanism in the proposed process. Si substrates are also successfully bonded to glass substrates at room temperature and debonded after heating at 450 °C using the proposed bonding process. By the composition analysis of bonding interfaces, it is clarified that the absorbed water on the glass forms interfacial voids and cause the decrease in bond strength.

The impact of processing parameters on the properties of Zn-bonded Nd-Fe-B magnets

Science.gov (United States)

Kelhar, Luka; Zavašnik, Janez; McGuiness, Paul; Kobe, Spomenka

2016-12-01

We report on the effect of loading factor and pressure on the density and the magnetic properties of Zn-bonded Nd-Fe-B magnets produced by pulsed-electric-current sintering (PECS). The idea behind this study is to fabricate bonded magnets with a metallic binder in order for the bonded magnet to operate at temperatures higher than 180 °C: the current upper-limit for polymer-bonded magnets. These composites are made of hard-magnetic powder in the form of melt-spun ribbons bonded with the low-melting-point metal Zn. The binder additions were varied from 10 to 30 wt%, and pressures of 50 and 500 MPa were applied. The high-pressure mode with 20 wt% Zn resulted in a 24% increase of Jr, compared to the low-pressure mode. The magnetic measurements revealed a maximum remanence of 0.64 T for 10 wt% Zn, while the coercivity is largely unaffected by the processing conditions. The density of the composites was up to 7.0 g/cm3, corresponding to 94% of the theoretical density. Compared to commercial polymer-bonded magnets, the Zn-bonded counterparts exhibit a slightly lower Jr, but the coercivity is retained. We show that there is a minor diffusion of Zn into the Nd-Fe-B, forming a 1 μm thin transition layer, but it does not harm the magnetic properties. These metal-bonded Nd-Fe-B magnets are ideal for use in high-temperature automotive applications like under-the-hood sensors and other magnet-based devices that are close to the engine.

The Influence of the Coating Deposition Process on the Interdiffusion Behavior Between Nickel-Based Superalloys and MCrAlY Bond Coats

Science.gov (United States)

Elsaß, M.; Frommherz, M.; Oechsner, M.

2018-02-01

In this work, interdiffusion between two nickel-based superalloys and two MCrAlY bond coats is investigated. The MCrAlY bond coats were applied using two different spraying processes, high velocity oxygen fuel spraying (HVOF) and low-pressure plasma spraying. Of primary interest is the evolution of Kirkendall porosity, which can form at the interface between substrate and bond coat and depends largely on the chemical compositions of the coating and substrate. Experimental evidence further suggested that the formation of Kirkendall porosity depends on the coating deposition process. Formation of porosity at the interface causes a degradation of the bonding strength between substrate and coating. After coating deposition, the samples were annealed at 1050 °C for up to 2000 h. Microstructural and compositional analyses were performed to determine and evaluate the Kirkendall porosity. The results reveal a strong influence of both the coating deposition process and the chemical compositions. The amount of Kirkendall porosity formed, as well as the location of appearance, is largely influenced by the coating deposition process. In general, samples with bond coats applied by means of HVOF show accelerated element diffusion. It is hypothesized that recrystallization of the substrate material is a main root cause for these observations.

Direct reciprocity in animals: The roles of bonding and affective processes.

Science.gov (United States)

Freidin, Esteban; Carballo, Fabricio; Bentosela, Mariana

2017-04-01

The presence of direct reciprocity in animals is a debated topic, because, despite its evolutionary plausibility, it is believed to be uncommon. Some authors claim that stable reciprocal exchanges require sophisticated cognition which has acted as a constraint on its evolution across species. In contrast, a more recent trend of research has focused on the possibility that direct reciprocity occurs within long-term bonds and relies on simple as well as more complex affective mechanisms such as emotional book-keeping, rudimentary and higher forms of empathy, and inequity aversion, among others. First, we present evidence supporting the occurrence of long-term reciprocity in the context of existing bonds in social birds and mammals. Second, we discuss the evidence for affective responses which, modulated by bonding, may underlie altruistic behaviours in different species. We conclude that the mechanisms that may underlie reciprocal exchanges are diverse, and that some act in interaction with bonding processes. From simple associative learning in social contexts, through emotional contagion and behavioural mimicry, to empathy and a sense of fairness, widespread and diverse social affective mechanisms may explain why direct reciprocity may not be a rare phenomenon among social vertebrates. © 2015 International Union of Psychological Science.

BONDING ALUMINUM METALS

Science.gov (United States)

Noland, R.A.; Walker, D.E.

1961-06-13

A process is given for bonding aluminum to aluminum. Silicon powder is applied to at least one of the two surfaces of the two elements to be bonded, the two elements are assembled and rubbed against each other at room temperature whereby any oxide film is ruptured by the silicon crystals in the interface; thereafter heat and pressure are applied whereby an aluminum-silicon alloy is formed, squeezed out from the interface together with any oxide film, and the elements are bonded.

Theoretical investigation on hydrogen bond interaction of diketo/keto-enol form uracil and thymine tautomers with intercalators.

Science.gov (United States)

Anithaa, V S; Vijayakumar, S; Sudha, M; Shankar, R

2017-11-06

The interaction of diketo and keto-enol form of thymine and uracil tautomers with acridine (Acr), phenazine (Phen), benzo[c]cinnoline (Ben), 1,10-phenanthroline (1,10-Phe), and 4,7-phenenthroline (4,7-Phe) intercalating drug molecules was studied using density functional theory at B3LYP/6-311++G** and M05-2×/6-311++G** levels of theory. From the interaction energy, it is found that keto-enol form tautomers have stronger interaction with intercalators than diketone form tautomers. On complex formation of thymine and uracil tautomers with benzo[c]cinnoline the drug molecules have high interaction energy values of -20.14 (BenT3) and -20.55 (BenU3) kcal mol -1 , while phenazine has the least interaction energy values of -6.52 (PhenT2) and -6.67 (PhenU2) kcal mol -1 . The closed shell intermolecular type interaction between the molecules with minimum elliptical value of 0.018 and 0.019 a.u at both levels of theory has been found from topological analysis. The benzo[c]cinnoline drug molecule with thymine and uracil tautomers has short range intermolecular N-H…N, C-H…O, and O-H...N hydrogen bonds (H-bonds) resulting in higher stability than other drug molecules. The proper hydrogen bonds N-H..N and O-H..N have the frequency shifted toward the lower side (red shifted) with the elongation in their bond length while the improper hydrogen bond C-H...O has the frequency shifted toward the higher side (blue shifted) of the spectral region with the contraction in their bond length. Further, the charge transfer between proton acceptor and donor along with stability of the bond is studied using natural bond orbital (NBO) analysis. Graphical abstract Hydrogen bond interaction of diketo/keto-enol form uracil and thymine tautomers with intercalators.

Bonding Be to Cu alloys using a proprietary Brush Wellman process and new results for bonding Be to AlBeMet

Energy Technology Data Exchange (ETDEWEB)

Dombrowski, D.E. [Brush Wellman Inc., Cleveland, OH (United States)

1998-01-01

A novel process has been investigated for bonding of beryllium to copper alloys. The process is compatible with current manufacturing capabilities and can be readily scaled up from laboratory to production scale. The effect of process variations on the bond are shown. Also shown are several new approaches for direct bonding of beryllium to an AlBeMet interlayer. Bond strengths of Be/AlBeMet 162/Cu alloy couples are presented. (author)

Mechanism of forming interfacial intermetallic compounds at interface for solid state diffusion bonding of dissimilar materials

International Nuclear Information System (INIS)

He, P.; Liu, D.

2006-01-01

The formation of brittle intermetallic compounds at the interfaces of diffusion bonds is the main cause which leads to poor bond strength. Therefore, it is very important to study and establish the formation and growth model of intermetallic compounds at the interfaces for the control process of diffusion bonding. In this paper, according to the diffusion kinetics and the thermodynamics, the principle of formation of intermetallic compounds at interfaces in the multi-component diffusion couple, the flux-energy principle, is put forward. In the light of diffusion theory, the formation capacity of the phase at the interfaces is determined by specific properties of the composition in the diffusion couple and the composition ratio of the formed phase is in agreement with the diffusion flux. In accordance with the flux-energy principle, the microstructure of the Ni/TC4 interface is Ni/TiNi 3 /TiNi/Ti 2 Ni/TC4, the microstructure of the TC4/00Cr18Ni9Ti interface is 00Cr18Ni9Ti/TiFe 2 /TiFe/Ti 2 Fe/TC4, and the microstructure of the TiAl/40Cr interface is 40Cr/TiC/Ti 3 Al + FeAl + FeAl 2 /TiAl. Multi-intermetallic compounds with the equivalent flux-energy can be formed at the interfaces at the same time

The study of forms of bonding marshmallow moisture with different composition by method of thermal analysis

Directory of Open Access Journals (Sweden)

G. O. Magomedov

2017-01-01

Full Text Available Marshmallow is a sugar confectionary product with increased sugar content and energy value because of the significant content of carbohydrates, in particular sugar-sand. The main drawback of marshmallow is the rapid process of its drying during storage due to the crystallization of sucrose and the gradual removal of moisture from the product. A method for obtaining marshmallow without sugar on the basis of high-conversion glucose syrup. In the work, experimental studies were carried out to determine the content and ratio of free and bound forms of moisture in marshmallow on the basis of sugars and on the basis of  high-conversion glucose syrup by Differential Scanning Calorimetry (DSC and Thermogravimetry (TG. To study the patterns of thermal effects on the properties of marshmallow samples, the non-isothermal analysis method and the synchronous thermal analysis instrument (TG-DTA / DSC of the STA 449 F3 Jupiter were used. In the process of thermal exposure, the samples decompose sugars and other organic compounds, as a result of which the sample weight decreases due to evaporation of moisture. The process of dehydration in a control sample of marshmallow using sugar occurs in a less wide temperature range than in a sample of marshmallow on the basis of  high-conversion glucose syrup, which indicates a greater degree of moisture bonding in the developed sample. A quantitative evaluation of the forms of moisture bonding in the samples was carried out using the experimental curves obtained by the TG method. From the temperature curves, the endothermic effects were determined, which correspond to the release of moisture with different forms and energies. Substitution of sugar for treacle in the formula of marshmallow reduces the share of free moisture and increases the safety of the product without signs of staling.

Development of Statistical Process Control Methodology for an Environmentally Compliant Surface Cleaning Process in a Bonding Laboratory

Science.gov (United States)

Hutchens, Dale E.; Doan, Patrick A.; Boothe, Richard E.

1997-01-01

Bonding labs at both MSFC and the northern Utah production plant prepare bond test specimens which simulate or witness the production of NASA's Reusable Solid Rocket Motor (RSRM). The current process for preparing the bonding surfaces employs 1,1,1-trichloroethane vapor degreasing, which simulates the current RSRM process. Government regulations (e.g., the 1990 Amendments to the Clean Air Act) have mandated a production phase-out of a number of ozone depleting compounds (ODC) including 1,1,1-trichloroethane. In order to comply with these regulations, the RSRM Program is qualifying a spray-in-air (SIA) precision cleaning process using Brulin 1990, an aqueous blend of surfactants. Accordingly, surface preparation prior to bonding process simulation test specimens must reflect the new production cleaning process. The Bonding Lab Statistical Process Control (SPC) program monitors the progress of the lab and its capabilities, as well as certifies the bonding technicians, by periodically preparing D6AC steel tensile adhesion panels with EA-91 3NA epoxy adhesive using a standardized process. SPC methods are then used to ensure the process is statistically in control, thus producing reliable data for bonding studies, and identify any problems which might develop. Since the specimen cleaning process is being changed, new SPC limits must be established. This report summarizes side-by-side testing of D6AC steel tensile adhesion witness panels and tapered double cantilevered beams (TDCBs) using both the current baseline vapor degreasing process and a lab-scale spray-in-air process. A Proceco 26 inches Typhoon dishwasher cleaned both tensile adhesion witness panels and TDCBs in a process which simulates the new production process. The tests were performed six times during 1995, subsequent statistical analysis of the data established new upper control limits (UCL) and lower control limits (LCL). The data also demonstrated that the new process was equivalent to the vapor

Underestimated Halogen Bonds Forming with Protein Backbone in Protein Data Bank.

Science.gov (United States)

Zhang, Qian; Xu, Zhijian; Shi, Jiye; Zhu, Weiliang

2017-07-24

Halogen bonds (XBs) are attracting increasing attention in biological systems. Protein Data Bank (PDB) archives experimentally determined XBs in biological macromolecules. However, no software for structure refinement in X-ray crystallography takes into account XBs, which might result in the weakening or even vanishing of experimentally determined XBs in PDB. In our previous study, we showed that side-chain XBs forming with protein side chains are underestimated in PDB on the basis of the phenomenon that the proportion of side-chain XBs to overall XBs decreases as structural resolution becomes lower and lower. However, whether the dominant backbone XBs forming with protein backbone are overlooked is still a mystery. Here, with the help of the ratio (R F ) of the observed XBs' frequency of occurrence to their frequency expected at random, we demonstrated that backbone XBs are largely overlooked in PDB, too. Furthermore, three cases were discovered possessing backbone XBs in high resolution structures while losing the XBs in low resolution structures. In the last two cases, even at 1.80 Å resolution, the backbone XBs were lost, manifesting the urgent need to consider XBs in the refinement process during X-ray crystallography study.

Indirect Versus Direct Heating of Sheet Materials: Superplastic Forming and Diffusion Bonding Using Lasers

Science.gov (United States)

Jocelyn, Alan; Kar, Aravinda; Fanourakis, Alexander; Flower, Terence; Ackerman, Mike; Keevil, Allen; Way, Jerome

2010-06-01

Many from within manufacturing industry consider superplastic forming (SPF) to be ‘high tech’, but it is often criticized as too complicated, expensive, slow and, in general, an unstable process when compared to other methods of manipulating sheet materials. Perhaps, the fundamental cause of this negative perception of SPF, and also of diffusion bonding (DB), is the fact that the current process of SPF/DB relies on indirect sources of heating to produce the conditions necessary for the material to be formed. Thus, heat is usually derived from the electrically heated platens of hydraulic presses, to a lesser extent from within furnaces and, sometimes, from heaters imbedded in ceramic moulds. Recent evaluations of these isothermal methods suggest they are slow, thermally inefficient and inappropriate for the process. In contrast, direct heating of only the material to be formed by modern, electrically efficient, lasers could transform SPF/DB into the first choice of designers in aerospace, automotive, marine, medical, architecture and leisure industries. Furthermore, ‘variable temperature’ direct heating which, in theory, is possible with a laser beam(s) may provide a means to control material thickness distribution, a goal of enormous importance as fuel efficient, lightweight structures for transportation systems are universally sought. This paper compares, and contrasts, the two systems and suggests how a change to laser heating might be achieved.

Characterization and durability testing of a glass-bonded ceramic waste form

International Nuclear Information System (INIS)

Johnson, S. G.

1998-01-01

Argonne National Laboratory is developing a glass bonded ceramic waste form for encapsulating the fission products and transuranics from the conditioning of metallic reactor fuel. This waste form is currently being scaled to the multi-kilogram size for encapsulation of actual high level waste. This paper will present characterization and durability testing of the ceramic waste form. An emphasis on results from application of glass durability tests such as the Product Consistency Test and characterization methods such as X-ray diffraction and scanning electron microscopy. The information presented is based on a suite of tests utilized for assessing product quality during scale-up and parametric testing

Oxidation study on as-bonded intermetallic of copper wire–aluminum bond pad metallization for electronic microchip

International Nuclear Information System (INIS)

Joseph Sahaya Anand, T.; Yau, Chua Kok; Huat, Lim Boon

2012-01-01

In this work, influence of Copper free air ball (FAB) oxidation towards Intermetallic Compound (IMC) at Copper wire–Aluminum bond pad metallization (Cu/Al) is studied. Samples are synthesized with different Copper FAB oxidation condition by turning Forming Gas supply ON and OFF. Studies are performed using Optical Microscope (OM), Scanning Electron Microscope (SEM), Transmission Electron Microscope (TEM) and line-scan Energy Dispersive X-ray (EDX). SEM result shows there is a cross-sectional position offset from center in sample synthesized with Forming Gas OFF. This is due to difficulty of determining the position of cross-section in manual grinding/polishing process and high occurrence rate of golf-clubbed shape of oxidized Copper ball bond. TEM inspection reveals that the Copper ball bond on sample synthesized with Forming Gas OFF is having intermediate oxidation. Besides, the presence of IMC at the bonding interface of Cu/Al for both samples is seen. TEM study shows voids form at the bonding interface of Forming Gas ON sample belongs to unbonded area; while that in Forming Gas OFF sample is due to volume shrinkage of IMC growth. Line-scan EDX shows the phases present in the interfaces of as-bonded samples are Al 4 Cu 9 (∼3 nm) for sample with Forming Gas ON and mixed CuAl and CuAl 2 (∼15 nm) for sample with Forming Gas OFF. Thicker IMC in sample with Forming Gas OFF is due to cross-section is positioned at high stress area that is close to edge of ball bond. Mechanical ball shear test shows that shear strength of sample with Forming Gas OFF is about 19% lower than that of sample with Forming Gas ON. Interface temperature is estimated at 437 °C for as-bonded sample with Forming Gas ON by using empirical parabolic law of volume diffusion. -- Highlights: ► 3 nm Al 4 Cu 9 are found in sample prepared with Forming Gas ON. ► 15 nm mixed CuAl + CuAl 2 are found in sample prepared with Forming Gas OFF. ► Voids are present at the bonding interfaces of both

Oxidation study on as-bonded intermetallic of copper wire-aluminum bond pad metallization for electronic microchip

Energy Technology Data Exchange (ETDEWEB)

Joseph Sahaya Anand, T., E-mail: anand@utem.edu.my [Faculty of Manufacturing Engineering, University Technical Malaysia Melaka, Hang Tuah Jaya, 76100 Durian Tunggal, Melaka (Malaysia); Yau, Chua Kok [Faculty of Manufacturing Engineering, University Technical Malaysia Melaka, Hang Tuah Jaya, 76100 Durian Tunggal, Melaka (Malaysia); University of Technical Malaysia Supported by Infineon Technology - Malaysia - Sdn. Bhd., Melaka (Malaysia); Huat, Lim Boon [Department of Innovation, Infineon Technology - Malaysia - Sdn. Bhd., FTZ Batu Berendam, 75350 Melaka (Malaysia)

2012-10-15

In this work, influence of Copper free air ball (FAB) oxidation towards Intermetallic Compound (IMC) at Copper wire-Aluminum bond pad metallization (Cu/Al) is studied. Samples are synthesized with different Copper FAB oxidation condition by turning Forming Gas supply ON and OFF. Studies are performed using Optical Microscope (OM), Scanning Electron Microscope (SEM), Transmission Electron Microscope (TEM) and line-scan Energy Dispersive X-ray (EDX). SEM result shows there is a cross-sectional position offset from center in sample synthesized with Forming Gas OFF. This is due to difficulty of determining the position of cross-section in manual grinding/polishing process and high occurrence rate of golf-clubbed shape of oxidized Copper ball bond. TEM inspection reveals that the Copper ball bond on sample synthesized with Forming Gas OFF is having intermediate oxidation. Besides, the presence of IMC at the bonding interface of Cu/Al for both samples is seen. TEM study shows voids form at the bonding interface of Forming Gas ON sample belongs to unbonded area; while that in Forming Gas OFF sample is due to volume shrinkage of IMC growth. Line-scan EDX shows the phases present in the interfaces of as-bonded samples are Al{sub 4}Cu{sub 9} ({approx}3 nm) for sample with Forming Gas ON and mixed CuAl and CuAl{sub 2} ({approx}15 nm) for sample with Forming Gas OFF. Thicker IMC in sample with Forming Gas OFF is due to cross-section is positioned at high stress area that is close to edge of ball bond. Mechanical ball shear test shows that shear strength of sample with Forming Gas OFF is about 19% lower than that of sample with Forming Gas ON. Interface temperature is estimated at 437 Degree-Sign C for as-bonded sample with Forming Gas ON by using empirical parabolic law of volume diffusion. -- Highlights: Black-Right-Pointing-Pointer 3 nm Al{sub 4}Cu{sub 9} are found in sample prepared with Forming Gas ON. Black-Right-Pointing-Pointer 15 nm mixed CuAl + CuAl{sub 2} are found

The impact of processing parameters on the properties of Zn-bonded Nd–Fe–B magnets

Energy Technology Data Exchange (ETDEWEB)

Kelhar, Luka, E-mail: luka.kelhar@ijs.si [Department for Nanostructured Materials, Jožef Stefan Institute, Jamova cesta 39, Ljubljana 1000 (Slovenia); Zavašnik, Janez [Centre for Electron Microscopy and Microanalysis (CEMM), Jamova cesta 39, Ljubljana 1000 (Slovenia); McGuiness, Paul; Kobe, Spomenka [Department for Nanostructured Materials, Jožef Stefan Institute, Jamova cesta 39, Ljubljana 1000 (Slovenia); Jožef Stefan International Postgraduate School, Jamova cesta 39, Ljubljana 1000 (Slovenia)

2016-12-01

We report on the effect of loading factor and pressure on the density and the magnetic properties of Zn-bonded Nd–Fe–B magnets produced by pulsed-electric-current sintering (PECS). The idea behind this study is to fabricate bonded magnets with a metallic binder in order for the bonded magnet to operate at temperatures higher than 180 °C: the current upper-limit for polymer-bonded magnets. These composites are made of hard-magnetic powder in the form of melt-spun ribbons bonded with the low-melting-point metal Zn. The binder additions were varied from 10 to 30 wt%, and pressures of 50 and 500 MPa were applied. The high-pressure mode with 20 wt% Zn resulted in a 24% increase of J{sub r}, compared to the low-pressure mode. The magnetic measurements revealed a maximum remanence of 0.64 T for 10 wt% Zn, while the coercivity is largely unaffected by the processing conditions. The density of the composites was up to 7.0 g/cm{sup 3}, corresponding to 94% of the theoretical density. Compared to commercial polymer-bonded magnets, the Zn-bonded counterparts exhibit a slightly lower J{sub r}, but the coercivity is retained. We show that there is a minor diffusion of Zn into the Nd–Fe–B, forming a 1 μm thin transition layer, but it does not harm the magnetic properties. These metal-bonded Nd–Fe–B magnets are ideal for use in high-temperature automotive applications like under-the-hood sensors and other magnet-based devices that are close to the engine. - Highlights: • Fabrication of Zn-bonded Nd–Fe–B magnets by pulsed electric current sintering. • Interesting for automotive applications with temperature exceeding 180 °C. • Variations of pressure and loading factor result in higher density and remanence. • Minor diffusion of Zn binder into the MQP-B ribbons is revealed, but does not decrease the magnetic properties. • More stable magnetic properties at high-temperature due to metallic Zn-binder.

Forming of superplastic ceramics

Energy Technology Data Exchange (ETDEWEB)

Lesuer, D.R.; Wadsworth, J.; Nieh, T.G.

1994-05-01

Superplasticity in ceramics has now advanced to the stage that technologically viable superplastic deformation processing can be performed. In this paper, examples of superplastic forming and diffusion bonding of ceramic components are given. Recent work in biaxial gas-pressure forming of several ceramics is provided. These include yttria-stabilized, tetragonal zirconia (YTZP), a 20% alumina/YTZP composite, and silicon. In addition, the concurrent superplastic forming and diffusion bonding of a hybrid ceramic-metal structure are presented. These forming processes offer technological advantages of greater dimensional control and increased variety and complexity of shapes than is possible with conventional ceramic shaping technology.

Mechanics of wafer bonding: Effect of clamping

Science.gov (United States)

Turner, K. T.; Thouless, M. D.; Spearing, S. M.

2004-01-01

A mechanics-based model is developed to examine the effects of clamping during wafer bonding processes. The model provides closed-form expressions that relate the initial geometry and elastic properties of the wafers to the final shape of the bonded pair and the strain energy release rate at the interface for two different clamping configurations. The results demonstrate that the curvature of bonded pairs may be controlled through the use of specific clamping arrangements during the bonding process. Furthermore, it is demonstrated that the strain energy release rate depends on the clamping configuration and that using applied loads usually leads to an undesirable increase in the strain energy release rate. The results are discussed in detail and implications for process development and bonding tool design are highlighted.

Effects of aqueous environment on long-term durability of phosphate-bonded ceramic waste forms

International Nuclear Information System (INIS)

Singh, D.; Wagh, A.S.; Jeong, S.Y.

1996-01-01

Over the last few years, Argonne National Laboratory has been developing room-temperature-setting chemically-bonded phosphate ceramics for solidifying and stabilizing low-level mixed wastes. This technology is crucial for stabilizing waste streams that contain volatile species and off-gas secondary waste streams generated by high-temperature treatment of such wastes. Magnesium phosphate ceramic has been developed to treat mixed wastes such as ash, salts, and cement sludges. Waste forms of surrogate waste streams were fabricated by acid-base reactions between the mixtures of magnesium oxide powders and the wastes, and phosphoric acid or acid phosphate solutions. Dense and hard ceramic waste forms are produced in this process. The principal advantage of this technology is that the contaminants are immobilized by both chemical stabilization and subsequent microencapsulation of the reaction products. This paper reports the results of durability studies conducted on waste forms made with ash waste streams spiked with hazardous and radioactive surrogates. Standard leaching tests such as ANS 16.1 and TCLP were conducted on the final waste forms. Fates of the contaminants in the final waste forms were established by electron microscopy. In addition, stability of the waste forms in aqueous environments was evaluated with long-term water-immersion tests

Modeling evolution of hydrogen bonding and stabilization of transition states in the process of cocaine hydrolysis catalyzed by human butyrylcholinesterase.

Science.gov (United States)

Gao, Daquan; Zhan, Chang-Guo

2006-01-01

Molecular dynamics (MD) simulations and quantum mechanical/molecular mechanical (QM/MM) calculations were performed on the prereactive enzyme-substrate complex, transition states, intermediates, and product involved in the process of human butyrylcholinesterase (BChE)-catalyzed hydrolysis of (-)-cocaine. The computational results consistently reveal a unique role of the oxyanion hole (consisting of G116, G117, and A199) in BChE-catalyzed hydrolysis of cocaine, compared to acetylcholinesterase (AChE)-catalyzed hydrolysis of acetylcholine. During BChE-catalyzed hydrolysis of cocaine, only G117 has a hydrogen bond with the carbonyl oxygen (O31) of the cocaine benzoyl ester in the prereactive BChE-cocaine complex, and the NH groups of G117 and A199 are hydrogen-bonded with O31 of cocaine in all of the transition states and intermediates. Surprisingly, the NH hydrogen of G116 forms an unexpected hydrogen bond with the carboxyl group of E197 side chain and, therefore, is not available to form a hydrogen bond with O31 of cocaine in the acylation. The NH hydrogen of G116 is only partially available to form a weak hydrogen bond with O31 of cocaine in some structures involved in the deacylation. The change of the estimated hydrogen-bonding energy between the oxyanion hole and O31 of cocaine during the reaction process demonstrates how the protein environment can affect the energy barrier for each step of the BChE-catalyzed hydrolysis of cocaine. These insights concerning the effects of the oxyanion hole on the energy barriers provide valuable clues on how to rationally design BChE mutants with a higher catalytic activity for the hydrolysis of (-)-cocaine. 2005 Wiley-Liss, Inc.

Two-Step Plasma Process for Cleaning Indium Bonding Bumps

Science.gov (United States)

Greer, Harold F.; Vasquez, Richard P.; Jones, Todd J.; Hoenk, Michael E.; Dickie, Matthew R.; Nikzad, Shouleh

2009-01-01

A two-step plasma process has been developed as a means of removing surface oxide layers from indium bumps used in flip-chip hybridization (bump bonding) of integrated circuits. The two-step plasma process makes it possible to remove surface indium oxide, without incurring the adverse effects of the acid etching process.

Low-cost bump-bonding processes for high energy physics pixel detectors

CERN Document Server

AUTHOR|(CDS)2069357; Blank, Thomas; Colombo, Fabio; Dierlamm, Alexander Hermann; Husemann, Ulrich; Kudella, Simon; Weber, M

2016-01-01

In the next generation of collider experiments detectors will be challenged by unprecedented particle fluxes. Thus large detector arrays of highly pixelated detectors with minimal dead area will be required at reasonable costs. Bump-bonding of pixel detectors has been shown to be a major cost-driver. KIT is one of five production centers of the CMS barrel pixel detector for the Phase I Upgrade. In this contribution the SnPb bump-bonding process and the production yield is reported. In parallel to the production of the new CMS pixel detector, several alternatives to the expensive photolithography electroplating/electroless metal deposition technologies are developing. Recent progress and challenges faced in the development of bump-bonding technology based on gold-stud bonding by thin (15 μm) gold wire is presented. This technique allows producing metal bumps with diameters down to 30 μm without using photolithography processes, which are typically required to provide suitable under bump metallization. The sh...

Dual hydrogen-bonding motifs in complexes formed between tropolone and formic acid

Science.gov (United States)

Nemchick, Deacon J.; Cohen, Michael K.; Vaccaro, Patrick H.

2016-11-01

The near-ultraviolet π*←π absorption system of weakly bound complexes formed between tropolone (TrOH) and formic acid (FA) under cryogenic free-jet expansion conditions has been interrogated by exploiting a variety of fluorescence-based laser-spectroscopic probes, with synergistic quantum-chemical calculations built upon diverse model chemistries being enlisted to unravel the structural and dynamical properties of the pertinent ground [X˜ 1A'] and excited [A˜ 1A'(" separators="π*π )] electronic states. For binary TrOH ṡ FA adducts, the presence of dual hydrogen-bond linkages gives rise to three low-lying isomers designated (in relative energy order) as INT, EXT1, and EXT2 depending on whether docking of the FA ligand to the TrOH substrate takes place internal or external to the five-membered reaction cleft of tropolone. While the symmetric double-minimum topography predicted for the INT potential surface mediates an intermolecular double proton-transfer event, the EXT1 and EXT2 structures are interconverted by an asymmetric single proton-transfer process that is TrOH-centric in nature. The A ˜ -X ˜ origin of TrOH ṡ FA at ν˜ 00=27 484 .45 cm-1 is displaced by δ ν˜ 00=+466 .76 cm-1 with respect to the analogous feature for bare tropolone and displays a hybrid type - a/b rotational contour that reflects the configuration of binding. A comprehensive analysis of vibrational landscapes supported by the optically connected X˜ 1A' and A˜ 1A'(" separators="π*π ) manifolds, including the characteristic isotopic shifts incurred by partial deuteration of the labile TrOH and FA protons, has been performed leading to the uniform assignment of numerous intermolecular (viz., modulating hydrogen-bond linkages) and intramolecular (viz., localized on monomer subunits) degrees of freedom. The holistic interpretation of all experimental and computational findings affords compelling evidence that an external-binding motif (attributed to EXT1), rather than the

Comparison of the corrosion behaviors of the glass-bonded sodalite ceramic waste form and reference HLW glasses

International Nuclear Information System (INIS)

Ebert, W. L.; Lewis, M. A.

1999-01-01

A glass-bonded sodalite ceramic waste form is being developed for the long-term immobilization of salt wastes that are generated during spent nuclear fuel conditioning activities. A durable waste form is prepared by hot isostatic pressing (HIP) a mixture of salt-loaded zeolite powders and glass frit. A mechanistic description of the corrosion processes is being developed to support qualification of the CWF for disposal. The initial set of characterization tests included two standard tests that have been used extensively to study the corrosion behavior of high level waste (HLW) glasses: the Material Characterization Center-1 (MCC-1) Test and the Product Consistency Test (PCT). Direct comparison of the results of tests with the reference CWF and HLW glasses indicate that the corrosion behaviors of the CWF and HLW glasses are very similar

Interstellar hydrogen bonding

Science.gov (United States)

Etim, Emmanuel E.; Gorai, Prasanta; Das, Ankan; Chakrabarti, Sandip K.; Arunan, Elangannan

2018-06-01

This paper reports the first extensive study of the existence and effects of interstellar hydrogen bonding. The reactions that occur on the surface of the interstellar dust grains are the dominant processes by which interstellar molecules are formed. Water molecules constitute about 70% of the interstellar ice. These water molecules serve as the platform for hydrogen bonding. High level quantum chemical simulations for the hydrogen bond interaction between 20 interstellar molecules (known and possible) and water are carried out using different ab-intio methods. It is evident that if the formation of these species is mainly governed by the ice phase reactions, there is a direct correlation between the binding energies of these complexes and the gas phase abundances of these interstellar molecules. Interstellar hydrogen bonding may cause lower gas abundance of the complex organic molecules (COMs) at the low temperature. From these results, ketenes whose less stable isomers that are more strongly bonded to the surface of the interstellar dust grains have been observed are proposed as suitable candidates for astronomical observations.

Nicotinamidase/pyrazinamidase of Mycobacterium tuberculosis forms homo-dimers stabilized by disulfide bonds.

Science.gov (United States)

Rueda, Daniel; Sheen, Patricia; Gilman, Robert H; Bueno, Carlos; Santos, Marco; Pando-Robles, Victoria; Batista, Cesar V; Zimic, Mirko

2014-12-01

Recombinant wild-pyrazinamidase from H37Rv Mycobacterium tuberculosis was analyzed by gel electrophoresis under differential reducing conditions to evaluate its quaternary structure. PZAse was fractionated by size exclusion chromatography under non-reducing conditions. PZAse activity was measured and mass spectrometry analysis was performed to determine the identity of proteins by de novo sequencing and to determine the presence of disulfide bonds. This study confirmed that M. tuberculosis wild type PZAse was able to form homo-dimers in vitro. Homo-dimers showed a slightly lower specific PZAse activity compared to monomeric PZAse. PZAse dimers were dissociated into monomers in response to reducing conditions. Mass spectrometry analysis confirmed the existence of disulfide bonds (C72-C138 and C138-C138) stabilizing the quaternary structure of the PZAse homo-dimer. Copyright © 2014 Elsevier Ltd. All rights reserved.

Low-temperature wafer-level gold thermocompression bonding: modeling of flatness deviations and associated process optimization for high yield and tough bonds

Science.gov (United States)

Stamoulis, Konstantinos; Tsau, Christine H.; Spearing, S. Mark

2005-01-01

Wafer-level, thermocompression bonding is a promising technique for MEMS packaging. The quality of the bond is critically dependent on the interaction between flatness deviations, the gold film properties and the process parameters and tooling used to achieve the bonds. The effect of flatness deviations on the resulting bond is investigated in the current work. The strain energy release rate associated with the elastic deformation required to overcome wafer bow is calculated. A contact yield criterion is used to examine the pressure and temperature conditions required to flatten surface roughness asperities in order to achieve bonding over the full apparent area. The results are compared to experimental data of bond yield and toughness obtained from four-point bend delamination testing and microscopic observations of the fractured surfaces. Conclusions from the modeling and experiments indicate that wafer bow has negligible effect on determining the variability of bond quality and that the well-bonded area is increased with increasing bonding pressure. The enhanced understanding of the underlying deformation mechanisms allows for a better controlled trade-off between the bonding pressure and temperature.

Fracture toughness measurements on a glass bonded sodalite high-level waste form

International Nuclear Information System (INIS)

DiSanto, T.; Goff, K. M.; Johnson, S. G.; O'Holleran, T. P.

1999-01-01

The electrometallurgical treatment of metallic spent nuclear fuel produces two high-level waste streams; cladding hulls and chloride salt. Argonne National Laboratory is developing a glass bonded sodalite waste form to immobilize the salt waste stream. The waste form consists of 75 Vol.% crystalline sodalite (containing the salt) with 25 Vol.% of an ''intergranular'' glassy phase. Microindentation fracture toughness measurements were performed on representative samples of this material using a Vickers indenter. Palmqvist cracking was confirmed by post-indentation polishing of a test sample. Young's modulus was measured by an acoustic technique. Fracture toughness, microhardness, and Young's modulus values are reported, along with results from scanning electron microscopy studies

Nondestructive testing of thermocompression bonds. Final report

International Nuclear Information System (INIS)

Hale, G.M.

1981-02-01

A Scanning Laser Acoustic Microscope (SLAM) was used to characterize hybrid microcircuit beam lead bonds formed on thin film networks by a thermocompression process. Results from subsequent pull testing show that the SLAM offered no significant advantage over visual inspection for detecting bad bonds. Infrared microscopy and resistance measurements were also reviewed and rejected as being ineffective inspection methods

Effect of forming process by using external magnetic field of bonded magnet made from NdFeB flakes to microstructure and magnetic properties

Science.gov (United States)

Suprapedi; Sardjono, P.; Muljadi; Djauhari, N. R.; Ramlan

2018-03-01

Research of fabricated bonded magnets NdFeB made from NdFeB flakes with variation of external magnetic field has been done. The materials preparation process begins with milling NdFeB flakes using High Energy Milling (HEM) for 60 minutes and mixing it with 5 wt % celuna binder and performing compaction to form pellet with a pressure of 40 Kgf/cm2 and then applying external magnetic field (0, 2000, 5000, 8000 and 11000 Gauss). The pellet samples were then dried using vacuum dryer with temperature of 100 °C for 1 hour. Characterization includes bulk density, measurement of magnetic properties with gauss meter, and Vibrating Sample Magnetometer (VSM). From the characterization results the best value was obtained on the external magnetic field orientation of 8000 to 11000 Gauss with a density value of 5.38 g/cm3, flux magnetic value of 465.9 – 467.1 Gauss, remanence value of 2.63–2.776 kGauss, and coercivity value of 1.905–1.925 kOe.

Bane of Hydrogen-Bond Formation on the Photoinduced Charge-Transfer Process in Donor–Acceptor Systems

KAUST Repository

Alsam, Amani Abdu

2017-03-14

Controlling the ultrafast dynamical process of photoinduced charge transfer at donor acceptor interfaces remains a major challenge for physical chemistry and solar cell communities. The process is complicated by the involvement of other complex dynamical processes, including hydrogen bond formation, energy transfer, and solvation dynamics occurring on similar time scales. In this study, we explore the remarkable impact of hydrogen-bond formation on the interfacial charge transfer between a negatively charged electron donating anionic porphyrin and a positively charged electron accepting pi-conjugated polymer, as a model system in solvents with different polarities and capabilities for hydiogen bonding using femtosecond transient absorption spectroscopy. Unlike the conventional understanding of the key role of hydrogen bonding in promoting the charge-transfer process, our steadystate and time-resolved results reveal that the intervening hydrogen-bonding environment and, consequently, the probable longer spacing between the donor and acceptor molecules significantly hinders the charge-transfer process between them. These results show that site-specific hydrogen bonding and geometric considerations between donor and acceptor can be exploited to control both the charge-transfer dynamics and its efficiency not only at donor acceptor interfaces but also in complex biological systems.

Simulation of Bimetallic Bush Hot Rolling Bonding Process

Directory of Open Access Journals (Sweden)

Yaqin Tian

2015-01-01

Full Text Available Three-dimensional model of bimetallic bush was established including the drive roller and the core roller. The model adopted the appropriate interface assumptions. Based on the bonding properties of bimetallic bush the hot rolling process was analyzed. The optimum reduction ratio of 28% is obtained by using the finite element simulation software MARC on the assumption of the bonding conditions. The stress-strain distribution of three dimensions was research assumptions to interface deformation of rolling. At the same time, based on the numerical simulation, the minimum reduction ratio 20% is obtained by using a double metal composite bush rolling new technology from the experiment research. The simulation error is not more than 8%.

Characterisation of the aqueous corrosion process in NdFeB melt spun ribbon and MQI bonded magnets

Science.gov (United States)

McCain, Stephen

A major factor limiting the use and longevity of rare earth based magnetic materials is their susceptibility to aqueous corrosion and associated detrimental effects upon the magnetic properties of the material. This process was investigated through a combination of exposure to simulated environmental conditions and hydrogen absorption/desorption studies (HADS) in conjunction with magnetic characterisation. This study utilises NdFeB MQP-B melt-spun ribbon manufactured by Magnequench, in the form of MQI bonded magnets and also in its unbonded state as MQ powder. Specifically, it was concerned with how effective a variety of bonding media (epoxy resin,PTFE, zinc) and surface coatings (PTFE, Qsil, zinc LPPS, Dex-Cool) were at limiting the impact of aqueous corrosion in MQI bonded magnets. To characterise the effect of hydrogen absorption upon the magnetic properties of the MQP-B, hydrogen uptake was induced followed by a series of outgassing heat treatments with subsequent magnetic characterisation accompanied by HADS techniques performed after each outgas. This allowed comparisons to be made between the effects of aqueous corrosion process and hydrogen absorption upon the magnetic properties of the alloy.. This study has clearly demonstrated the link between the abundance of environmental moisture and rate of Hci losses in MQI bonded magnets. In addition to this the key mechanism responsible for the degradation of magnetic properties has been identified. These losses have been attributed to the absorption of hydrogen generated by the dissociation of water in the presence of NdFeB during the aqueous corrosion process. It has been shown that the use of a bonding media that is impermeable to water can limit the effects of aqueous corrosion by limiting water access to the Magnequench particles (MQP) and also the positive effects of the use of suitable surface coatings has been shown to be effective for the same reason..

Properties of glass-bonded zeolite monoliths

International Nuclear Information System (INIS)

Lewis, M.A.; Fischer, D.F.; Murphy, C.D.

1994-01-01

It has been shown that mineral waste forms can be used to immobilize waste salt generated during the pyrochemical processing of spent fuel from the Integral Fast Reactor (IFR). Solid, leach resistant monoliths were formed by hot-pressing mixtures of salt-occluded zeolite A powders and glass frit at 990 K and 28 MPa. Additional samples have now been fabricated and tested. Normalized release rates for all elements, including iodide and chloride, were less than 1 g/m 2 d in 28-day tests in deionized water and in brine at 363 K (90 degrees C). Preliminary results indicate that these rates fall with time with both leachants and that the zeolite phase in the glass-bonded zeolite does not function as an ion exchanger. Some material properties were measured. The Poisson ratio and Young's modulus were slightly smaller in glass-bonded zeolite than in borosilicate glass. Density depended on zeolite fraction. The glass-bonded zeolite represents a promising mineral waste form for IFR salt

Forming processes and mechanics of sheet metal forming

NARCIS (Netherlands)

Burchitz, I.A.

2004-01-01

The report is dealing with the numerical analysis of forming processes. Forming processes is the large group of manufacturing processes used to obtain various product shapes by means of plastic deformations. The report is organized as follows. An overview of the deformation processes and the

Secondary waste form testing: ceramicrete phosphate bonded ceramics

International Nuclear Information System (INIS)

Singh, D.; Ganga, R.; Gaviria, J.; Yusufoglu, Y.

2011-01-01

The cleanup activities of the Hanford tank wastes require stabilization and solidification of the secondary waste streams generated from the processing of the tank wastes. The treatment of these tank wastes to produce glass waste forms will generate secondary wastes, including routine solid wastes and liquid process effluents. Liquid wastes may include process condensates and scrubber/off-gas treatment liquids from the thermal waste treatment. The current baseline for solidification of the secondary wastes is a cement-based waste form. However, alternative secondary waste forms are being considered. In this regard, Ceramicrete technology, developed at Argonne National Laboratory, is being explored as an option to solidify and stabilize the secondary wastes. The Ceramicrete process has been demonstrated on four secondary waste formulations: baseline, cluster 1, cluster 2, and mixed waste streams. Based on the recipes provided by Pacific Northwest National Laboratory, the four waste simulants were prepared in-house. Waste forms were fabricated with three filler materials: Class C fly ash, CaSiO 3 , and Class C fly ash + slag. Optimum waste loadings were as high as 20 wt.% for the fly ash and CaSiO 3 , and 15 wt.% for fly ash + slag filler. Waste forms for physical characterizations were fabricated with no additives, hazardous contaminants, and radionuclide surrogates. Physical property characterizations (density, compressive strength, and 90-day water immersion test) showed that the waste forms were stable and durable. Compressive strengths were >2,500 psi, and the strengths remained high after the 90-day water immersion test. Fly ash and CaSiO 3 filler waste forms appeared to be superior to the waste forms with fly ash + slag as a filler. Waste form weight loss was ∼5-14 wt.% over the 90-day immersion test. The majority of the weight loss occurred during the initial phase of the immersion test, indicative of washing off of residual unreacted binder components from

Secondary waste form testing : ceramicrete phosphate bonded ceramics.

Energy Technology Data Exchange (ETDEWEB)

Singh, D.; Ganga, R.; Gaviria, J.; Yusufoglu, Y. (Nuclear Engineering Division); ( ES)

2011-06-21

The cleanup activities of the Hanford tank wastes require stabilization and solidification of the secondary waste streams generated from the processing of the tank wastes. The treatment of these tank wastes to produce glass waste forms will generate secondary wastes, including routine solid wastes and liquid process effluents. Liquid wastes may include process condensates and scrubber/off-gas treatment liquids from the thermal waste treatment. The current baseline for solidification of the secondary wastes is a cement-based waste form. However, alternative secondary waste forms are being considered. In this regard, Ceramicrete technology, developed at Argonne National Laboratory, is being explored as an option to solidify and stabilize the secondary wastes. The Ceramicrete process has been demonstrated on four secondary waste formulations: baseline, cluster 1, cluster 2, and mixed waste streams. Based on the recipes provided by Pacific Northwest National Laboratory, the four waste simulants were prepared in-house. Waste forms were fabricated with three filler materials: Class C fly ash, CaSiO{sub 3}, and Class C fly ash + slag. Optimum waste loadings were as high as 20 wt.% for the fly ash and CaSiO{sub 3}, and 15 wt.% for fly ash + slag filler. Waste forms for physical characterizations were fabricated with no additives, hazardous contaminants, and radionuclide surrogates. Physical property characterizations (density, compressive strength, and 90-day water immersion test) showed that the waste forms were stable and durable. Compressive strengths were >2,500 psi, and the strengths remained high after the 90-day water immersion test. Fly ash and CaSiO{sub 3} filler waste forms appeared to be superior to the waste forms with fly ash + slag as a filler. Waste form weight loss was {approx}5-14 wt.% over the 90-day immersion test. The majority of the weight loss occurred during the initial phase of the immersion test, indicative of washing off of residual unreacted

Process Simulation of Resistance Weld Bonding and Automotive Light-weight Materials

DEFF Research Database (Denmark)

Zhang, Wenqi; Chergui, Azeddine; Nielsen, Chris Valentin

of mechanical, electrical, thermal and metallurgical processes, which are essential for simulation of resistance welding process to predict the welding results and evaluate the weldability of materials. These functions have been further extended with new functions for optimization of welding process parameters...... and predicting welding process window, for weld planning with optimal welding parameter settings, and for modeling microstructures and hardness distribution after welding. Latest developments have been made on simulation of resistance welding with nonconductive materials for applications in weld bonding......This paper presents the latest developments in numerical simulation of resistance welding especially with the new functions for simulation of microstructures, weld bonding and spot welding of new light-weight materials. The fundamental functions in SORPAS® are built on coupled modeling...

Physical mechanisms of Cu-Cu wafer bonding

International Nuclear Information System (INIS)

Rebhan, B.

2014-01-01

Modern manufacturing processes of complex integrated semiconductor devices are based on wafer-level manufacturing of components which are subsequently interconnected. When compared with classical monolithic bi-dimensional integrated circuits (2D ICs), the new approach of three-dimensional integrated circuits (3D ICs) exhibits significant benefits in terms of signal propagation delay and power consumption due to the reduced metal interconnection length and allows high integration levels with reduced form factor. Metal thermo-compression bonding is a process suitable for 3D interconnects applications at wafer level, which facilitates the electrical and mechanical connection of two wafers even processed in different technologies, such as complementary metal oxide semiconductor (CMOS) and microelectromechanical systems (MEMS). Due to its high electrical conductivity, copper is a very attractive material for electrical interconnects. For Cu-Cu wafer bonding the process requires typically bonding for around 1 h at 400°C and high contact pressure applied during bonding. Temperature reduction below such values is required in order to solve issues regarding (i) throughput in the wafer bonder, (ii) wafer-to-wafer misalignment after bonding and (iii) to minimise thermo-mechanical stresses or device degradation. The aim of this work was to study the physical mechanisms of Cu-Cu bonding and based on this study to further optimise the bonding process for low temperatures. The critical sample parameters (roughness, oxide, crystallinity) were identified using selected analytical techniques and correlated with the characteristics of the bonded Cu-Cu interfaces. Based on the results of this study the impact of several materials and process specifications on the bonding result were theoretically defined and experimentally proven. These fundamental findings subsequently facilitated low temperature (LT) metal thermo-compression Cu-Cu wafer bonding and even room temperature direct

Morphology, topography, and hardness of diffusion bonded sialon to AISI 420 at different bonding time

Science.gov (United States)

Ibrahim, Nor Nurulhuda Md.; Hussain, Patthi; Awang, Mokhtar

2015-07-01

Sialon and AISI 420 martensitic stainless steel were diffusion bonded in order to study the effect of bonding time on reaction layer's growth. Joining of these materials was conducted at 1200°C under a uniaxial pressure of 17 MPa in a vacuum ranging from 5.0 to 8.0×10-6 Torr with bonding time varied for 0.5, 2, and 3 h. Thicker reaction layer was formed in longer bonded sample since the elements from sialon could diffuse further into the steel. Sialon retained its microstructure but it was affected at the initial contact with the steel to form the new interface layer. Diffusion layer grew toward the steel and it was segregated with the parent steel as a result of the difference in properties between these regions. The segregation formed a stream-like structure and its depth decreased when the bonding time was increased. The microstructure of the steel transformed into large grain size with precipitates. Prolonging the bonding time produced more precipitates in the steel and reduced the steel thickness as well. Interdiffusions of elements occurred between the joined materials and the concentrations were decreasing toward the steel and vice versa. Silicon easily diffused into the steel because it possessed lower ionization potential compared to nitrogen. Formation of silicide and other compounds such as carbides were detected in the interface layer and steel grain boundary, respectively. These compounds were harmful due to silicide brittleness and precipitation of carbides in the grain boundary might cause intergranular corrosion cracking. Sialon retained its hardness but it dropped very low at the interface layer. The absence of crack at the joint in all samples could be contributed from the ductility characteristic of the reaction layer which compensated the residual stress that was formed upon the cooling process.

THE USE OF EXCHANGEABLE BONDS DURING THE PRIVATIZATION PROCESS

Directory of Open Access Journals (Sweden)

Damian Kaźmierczak

2014-04-01

Full Text Available In our article we present the use of hybrid securities in the privatization process. We show that exchangeable bonds may be successfully applied during privatization of state companies throughout the world. It may be profitable for many reasons. Firstly, the exchangeables offer a much lower coupon in comparison with the ordinary government bonds which may be crucial for highly indebted countries. Secondly, throughout the entire maturity period the state remains the owner of the privatized firm which means that the government can be a beneficiary of high dividends paid by the public enterprises and can actively manage them. Thirdly, in the case of unfavorable market conditions the authorities get an opportunity to wait for the end of economic turmoil in order to avoid selling the equity participations under their true value. Finally, the issue of certain types of exchangeables (e.g. callable exchangeables or mandatory exchangeables and adding several provisions (e.g. greenshoe option or clean-up call makes the instrument more flexible for the issuer. We also present a few examples of the privatization processes by means of exchangeable bonds i.a. in Germany and in Austria. Most of such operations, e.g. German Deutsche Post, Austrian Telekom Austria or Portuguese Galp Energia SGPS S.A. were completed with success.

Effect of Pd Surface Roughness on the Bonding Process and High Temperature Reliability of Au Ball Bonds

Science.gov (United States)

Huang, Y.; Kim, H. J.; McCracken, M.; Viswanathan, G.; Pon, F.; Mayer, M.; Zhou, Y. N.

2011-06-01

A 0.3- μm-thick electrolytic Pd layer was plated on 1 μm of electroless Ni on 1 mm-thick polished and roughened Cu substrates with roughness values ( R a) of 0.08 μm and 0.5 μm, respectively. The rough substrates were produced with sand-blasting. Au wire bonding on the Ni/Pd surface was optimized, and the electrical reliability was investigated under a high temperature storage test (HTST) during 800 h at 250°C by measuring the ball bond contact resistance, R c. The average value of R c of optimized ball bonds on the rough substrate was 1.96 mΩ which was about 40.0% higher than that on the smooth substrate. The initial bondability increased for the rougher surface, so that only half of the original ultrasonic level was required, but the reliability was not affected by surface roughness. For both substrate types, HTST caused bond healing, reducing the average R c by about 21% and 27%, respectively. Au diffusion into the Pd layer was observed in scanning transmission electron microscopy/ energy dispersive spectroscopy (STEM-EDS) line-scan analysis after HTST. It is considered that diffusion of Au or interdiffusion between Au and Pd can provide chemically strong bonding during HTST. This is supported by the R c decrease measured as the aging time increased. Cu migration was indicated in the STEM-EDS analysis, but its effect on reliability can be ignored. Au and Pd tend to form a complete solid solution at the interface and can provide reliable interconnection for high temperature (250°C) applications.

Simultaneous bond degradation and bond formation during phenol-formaldehyde curing with wood

Science.gov (United States)

Daniel J. Yelle; John Ralph

2016-01-01

Bonding of wood using phenol–formaldehyde adhesive develops highly durable bonds. Phenol– formaldehyde is believed to form primary bonds with wood cell wall polymers (e.g., lignin). However, it is unclear how this adhesive interacts and bonds to lignin. Through wood solubilisation methodologies, earlywood and latewood bonded assemblies were characterized using two-...

Ultrafast Hydrogen-Bonding Dynamics in Amyloid Fibrils.

Science.gov (United States)

Pazos, Ileana M; Ma, Jianqiang; Mukherjee, Debopreeti; Gai, Feng

2018-06-08

While there are many studies on the subject of hydrogen bonding dynamics in biological systems, few, if any, have investigated this fundamental process in amyloid fibrils. Herein, we seek to add insight into this topic by assessing the dynamics of a hydrogen bond buried in the dry interface of amyloid fibrils. To prepare a suitable model peptide system for this purpose, we introduce two mutations into the amyloid-forming Aβ(16-22) peptide. The first one is a lysine analog at position 19, which is used to help form structurally homogeneous fibrils, and the second one is an aspartic acid derivative (DM) at position 17, which is intended (1) to be used as a site-specific infrared probe and (2) to serve as a hydrogen-bond acceptor to lysine so that an inter-β-sheet hydrogen bond can be formed in the fibrils. Using both infrared spectroscopy and atomic force microscopy, we show that (1) this mutant peptide indeed forms well defined fibrils, (2) when bulk solvent is removed, there is no detectable water present in the fibrils, (3) infrared results obtained with the DM probe are consistent with a protofibril structure that is composed of two antiparallel β-sheets stacked in a parallel fashion, leading to formation of the expected hydrogen bond. Using two-dimensional infrared spectroscopy, we further show that the dynamics of this hydrogen bond occur on a timescale of ~2.3 ps, which is attributed to the rapid rotation of the -NH3+ group of lysine around its Cε-Nζ bond. Taken together, these results suggest that (1) DM is a useful infrared marker in facilitating structure determination of amyloid fibrils and (2) even in the tightly packed core of amyloid fibrils certain amino acid sidechains can undergo ultrafast motions, hence contributing to the thermodynamic stability of the system.

GeSn-on-insulator substrate formed by direct wafer bonding

Energy Technology Data Exchange (ETDEWEB)

Lei, Dian; Wang, Wei; Gong, Xiao, E-mail: elegong@nus.edu.sg, E-mail: yeo@ieee.org; Yeo, Yee-Chia, E-mail: elegong@nus.edu.sg, E-mail: yeo@ieee.org [Department of Electrical and Computer Engineering, National University of Singapore, Singapore 117576 (Singapore); Lee, Kwang Hong; Wang, Bing [Low Energy Electronic Systems (LEES), Singapore MIT Alliance for Research and Technology (SMART), 1 CREATE Way, #10-01 CREATE Tower, Singapore 138602 (Singapore); Bao, Shuyu [Low Energy Electronic Systems (LEES), Singapore MIT Alliance for Research and Technology (SMART), 1 CREATE Way, #10-01 CREATE Tower, Singapore 138602 (Singapore); School of Electrical and Electronic Engineering, Nanyang Technological University, 50 Nanyang Avenue, Singapore 639798 (Singapore); Tan, Chuan Seng [School of Electrical and Electronic Engineering, Nanyang Technological University, 50 Nanyang Avenue, Singapore 639798 (Singapore)

2016-07-11

GeSn-on-insulator (GeSnOI) on Silicon (Si) substrate was realized using direct wafer bonding technique. This process involves the growth of Ge{sub 1-x}Sn{sub x} layer on a first Si (001) substrate (donor wafer) followed by the deposition of SiO{sub 2} on Ge{sub 1-x}Sn{sub x}, the bonding of the donor wafer to a second Si (001) substrate (handle wafer), and removal of the Si donor wafer. The GeSnOI material quality is investigated using high-resolution transmission electron microscopy, high-resolution X-ray diffraction (HRXRD), atomic-force microscopy, Raman spectroscopy, and spectroscopic ellipsometry. The Ge{sub 1-x}Sn{sub x} layer on GeSnOI substrate has a surface roughness of 1.90 nm, which is higher than that of the original Ge{sub 1-x}Sn{sub x} epilayer before transfer (surface roughness is 0.528 nm). The compressive strain of the Ge{sub 1-x}Sn{sub x} film in the GeSnOI is as low as 0.10% as confirmed using HRXRD and Raman spectroscopy.

Process for forming unusually strong joints between metals and ceramics by brazing at temperatures that do no exceed 750 degree C.

Science.gov (United States)

Hammond, Joseph P.; David, Stan A.; Woodhouse, John J.

1986-01-01

This invention is a process for joining metals to ceramics to form very strong bonds using low brazing temperature, i.e., less than 750.degree. C., and particularly for joining nodular cast iron to partially stabilized zirconia. The process provides that the ceramic be coated with an active metal, such as titanium, that can form an intermetallic with a low melting point brazing alloy such as 60Ag-30Cu-10Sn. The nodular cast iron is coated with a noncarbon containing metal, such as copper, to prevent carbon in the nodular cast iron from dissolving in the brazing alloy. These coated surfaces can be brazed together with the brazing alloy between at less than 750.degree. C. to form a very strong joint. An even stronger bond can be formed if a transition piece is used between the metal and ceramic. It is preferred for the transition piece to have a coefficient of thermal compatible with the coefficient of thermal expansion of the ceramic, such as titanium.

46 CFR Sec. 10 - Bonds.

Science.gov (United States)

2010-10-01

... REPAIRS UNDER NATIONAL SHIPPING AUTHORITY MASTER LUMP SUM REPAIR CONTRACT-NSA-LUMPSUMREP Sec. 10 Bonds. (a... awarded work and the furnishing of the performance and payment bonds required by Article 14 of the NSA... of the NSA-LUMPSUMREP Contract, the standard form of individual performance bond (Standard Form 25...

Corrosion behaviors of a glass-bonded sodalite ceramic waste form and its constituents

International Nuclear Information System (INIS)

Lewis, M. A.; Ebert, W. L.; Morss, L.

1999-01-01

A ceramic waste form (CWF) of glass bonded sodalite is being developed as a waste form for the long-term immobilization of fission products and transuranic elements from the U.S. Department of Energy's activities on spent nuclear fuel conditioning. A durable waste form was prepared by hot isostatic pressing (HIP) a mixture of salt-loaded zeolite powders and glass frit. During HIP the zeolite is converted to sodalite, and the resultant CWF is been completed for durations of up to 182 days. Four dissolution modes were identified: dissolution of free salt, dissolution of the aluminosilicate matrix of sodalite and the accompanying dissolution of occluded salt, dissolution of the boroaluminosilicate matrix of the glass, and ion exchange. Synergies inherent to the CWF were identified by comparing the results of the tests with pure glass and sodalite with those of the composite CWF

7 CFR 1726.27 - Contractor's bonds.

Science.gov (United States)

2010-01-01

... 7 Agriculture 11 2010-01-01 2010-01-01 false Contractor's bonds. 1726.27 Section 1726.27... AGRICULTURE ELECTRIC SYSTEM CONSTRUCTION POLICIES AND PROCEDURES General § 1726.27 Contractor's bonds. (a) RUS Form 168b, Contractor's Bond, shall be used when a contractor's bond is required by RUS Forms 200, 257...

Copper wire bonding

CERN Document Server

Chauhan, Preeti S; Zhong, ZhaoWei; Pecht, Michael G

2014-01-01

This critical volume provides an in-depth presentation of copper wire bonding technologies, processes and equipment, along with the economic benefits and risks.  Due to the increasing cost of materials used to make electronic components, the electronics industry has been rapidly moving from high cost gold to significantly lower cost copper as a wire bonding material.  However, copper wire bonding has several process and reliability concerns due to its material properties.  Copper Wire Bonding book lays out the challenges involved in replacing gold with copper as a wire bond material, and includes the bonding process changes—bond force, electric flame off, current and ultrasonic energy optimization, and bonding tools and equipment changes for first and second bond formation.  In addition, the bond–pad metallurgies and the use of bare and palladium-coated copper wires on aluminum are presented, and gold, nickel and palladium surface finishes are discussed.  The book also discusses best practices and re...

Process and equipment qualification of the ceramic and metal waste forms for spent fuel treatment

International Nuclear Information System (INIS)

Marsden, Ken; Knight, Collin; Bateman, Kenneth; Westphal, Brian; Lind, Paul

2005-01-01

The electrometallurgical process for treating sodium-bonded spent metallic fuel at the Materials and Fuels Complex of the Idaho National Laboratory separates actinides and partitions fission products into two waste forms. The first is the metal waste form, which is primarily composed of stainless steel from the fuel cladding. This stainless steel is alloyed with 15w% zirconium to produce a very corrosion-resistant metal which binds noble metal fission products and residual actinides. The second is the ceramic waste form which stabilizes fission product-loaded chloride salts in a sodalite and glass composite. These two waste forms will be packaged together for disposal at the Yucca Mountain repository. Two production-scale metal waste furnaces have been constructed. The first is in a large argon-atmosphere glovebox and has been used for equipment qualification, process development, and process qualification - the demonstration of process reliability for production of the DOE-qualified metal waste form. The second furnace will be transferred into a hot cell for production of metal waste. Prototype production-scale ceramic waste equipment has been constructed or procured; some equipment has been qualified with fission product-loaded salt in the hot cell. Qualification of the remaining equipment with surrogate materials is underway. (author)

The chemical bond in inorganic chemistry the bond valence model

CERN Document Server

Brown, I David

2016-01-01

The bond valence model is a version of the ionic model in which the chemical constraints are expressed in terms of localized chemical bonds formed by the valence charge of the atoms. Theorems derived from the properties of the electrostatic flux predict the rules obeyed by both ionic and covalent bonds. They make quantitative predictions of coordination number, crystal structure, bond lengths and bond angles. Bond stability depends on the matching of the bonding strengths of the atoms, while the conflicting requirements of chemistry and space lead to the structural instabilities responsible for the unusual physical properties displayed by some materials. The model has applications in many fields ranging from mineralogy to molecular biology.

New type of bonding formed from an overlap between pi aromatic and pi C=O molecular orbitals stabilizes the coexistence in one molecule of the ionic and neutral meso-ionic forms of imidazopyridine.

Science.gov (United States)

Hoffmann, Marcin; Plutecka, Agnieszka; Rychlewska, Urszula; Kucybala, Zdzislaw; Paczkowski, Jerzy; Pyszka, Ilona

2005-05-26

New bis(imidazo)pyridine dye has been synthesized and tested as a potential photoinitaitor for free-radical polymerization induced with the visible emission of an argon ion laser. The X-ray analysis based on data collected at 170 and 130 K, as well as density functional theory (DFT) calculations, revealed the presence of two different forms of imidazopyridine rings within the same molecule. These two forms of the same moiety had not only different geometries but different electronic structures as well. One of the imidazopyridine rings was in the ionic form, while the other was in the meso-ionic form. DFT calculations provided an explanation for such an observed phenomena. The averaging of ionic and meso-ionic forms of imidazopyridine rings within the same molecule is hindered because of an attractive interaction between them. Analysis of electronic density revealed that, indeed, a new type of bonding is formed as the result of an overlap between pi aromatic and pi C=O molecular orbitals. This bonding, like the hydrogen bond, is primarily of electrostatic character, and its energy was estimated at 3.5 kcal/mol.

Creep effects in diffusion bonding of oxygen-free copper

CERN Document Server

Moilanen, Antti

Diffusion is the transport of atoms or particles through the surrounding material. Various microstructural changes in metals are based on the diffusion phenomena. In solid metals the diffusion is closely related to crystallographic defects. In single-component metals the dominant mechanism of diffusion is the vacancy mechanism. Diffusion bonding is a direct technological application of diffusion. It is an advanced solidstate joining process in which the surfaces of two components are brought to contact with each other and heated under a pressing load in a controlled environment. During the process, the contact surfaces are bonded by atomic diffusion across the interface and as a result, one solid piece is formed. The condition of high temperature and low applied stress combined with relatively long process duration enables the creep effects to take place in bonded metals. Furthermore, creep causes unwanted permanent deformations in the bonded components. Some authors suggest that there could be a threshold fo...

Binder Jetting: A Novel NdFeB Bonded Magnet Fabrication Process

Science.gov (United States)

Paranthaman, M. Parans; Shafer, Christopher S.; Elliott, Amy M.; Siddel, Derek H.; McGuire, Michael A.; Springfield, Robert M.; Martin, Josh; Fredette, Robert; Ormerod, John

2016-07-01

The goal of this research is to fabricate near-net-shape isotropic (Nd)2Fe14B-based (NdFeB) bonded magnets using a three dimensional printing process to compete with conventional injection molding techniques used for bonded magnets. Additive manufacturing minimizes the waste of critical materials and allows for the creation of complex shapes and sizes. The binder jetting process works similarly to an inkjet printer. A print-head passes over a bed of NdFeB powder and deposits a polymer binding agent to bind the layer of particles together. The bound powder is then coated with another layer of powder, building the desired shape in successive layers of bonded powder. Upon completion, the green part and surrounding powders are placed in an oven at temperatures between 100°C and 150°C for 4-6 h to cure the binder. After curing, the excess powder can be brushed away to reveal the completed "green" part. Green magnet parts were then infiltrated with a clear urethane resin to achieve the measured density of the magnet of 3.47 g/cm3 close to 46% relative to the NdFeB single crystal density of 7.6 g/cm3. Magnetic measurements indicate that there is no degradation in the magnetic properties. This study provides a new pathway for preparing near-net-shape bonded magnets for various magnetic applications.

Room temperature Cu-Cu direct bonding using surface activated bonding method

International Nuclear Information System (INIS)

Kim, T.H.; Howlader, M.M.R.; Itoh, T.; Suga, T.

2003-01-01

Thin copper (Cu) films of 80 nm thickness deposited on a diffusion barrier layered 8 in. silicon wafers were directly bonded at room temperature using the surface activated bonding method. A low energy Ar ion beam of 40-100 eV was used to activate the Cu surface prior to bonding. Contacting two surface-activated wafers enables successful Cu-Cu direct bonding. The bonding process was carried out under an ultrahigh vacuum condition. No thermal annealing was required to increase the bonding strength since the bonded interface was strong enough at room temperature. The chemical constitution of the Cu surface was examined by Auger electron spectroscope. It was observed that carbon-based contaminations and native oxides on copper surface were effectively removed by Ar ion beam irradiation for 60 s without any wet cleaning processes. An atomic force microscope study shows that the Ar ion beam process causes no surface roughness degradation. Tensile test results show that high bonding strength equivalent to bulk material is achieved at room temperature. The cross-sectional transmission electron microscope observations reveal the presence of void-free bonding interface without intermediate layer at the bonded Cu surfaces

Feasibility investigations on a novel micro-manufacturing process for fabrication of fuel cell bipolar plates: Internal pressure-assisted embossing of micro-channels with in-die mechanical bonding

Energy Technology Data Exchange (ETDEWEB)

Koc, Muammer [NSF I/UCR Center for Precision Forming (CPF), Department of Mechanical Engineering, Virginia Commonwealth University (VCU), Richmond, VA (United States); Mahabunphachai, Sasawat [NSF I/UCR Center for Precision Forming (CPF), Department of Mechanical Engineering, Virginia Commonwealth University (VCU), Richmond, VA (United States); Department of Mechanical Engineering, University of Michigan, Ann Arbor, MI (United States)

2007-10-25

In this paper, we present the results of our studies on conceptual design and feasibility experiments towards development of a novel hybrid manufacturing process to fabricate fuel cell bipolar plates that consists of multi-array micro-channels on a large surface area. The premises of this hybrid micro-manufacturing process stem from the use of an internal pressure-assisted embossing process (cold or warm) combined with mechanical bonding of double bipolar plates in a single-die and single-step operation. Such combined use of hydraulic and mechanical forming forces and in-process bonding will (a) enable integrated forming of micro-channels on both surfaces (as anode and cathode flow fields) and at the middle (as cooling channels), (b) reduce the process steps, (c) reduce variation in dimensional tolerances and surface finish, (d) increase the product quality, (e) increase the performance of fuel cell by optimizing flow-field designs and ensuring consistent contact resistance, and (f) reduce the overall stack cost. This paper explains two experimental investigations that were performed to characterize and evaluate the feasibility of the conceptualized manufacturing process. The first investigation involved hydroforming of micro-channels using thin sheet metals of SS304 with a thickness of 51 {mu}m. The width of the channels ranged from 0.46 to 1.33 mm and the height range was between 0.15 and 0.98 mm. Our feasibility experiments resulted in that different aspect ratios of micro-channels could be fabricated using internal pressure in a controllable manner although there is a limit to very sharp channel shapes (i.e., high aspect ratios with narrow channels). The second investigation was on the feasibility of mechanical bonding of thin sheet metal blanks. The effects of different process and material variables on the bond quality were studied. Successful bonding of various metal blanks (Ni201, Al3003, and SS304) was obtained. The experimental results from both

A slow-forming isopeptide bond in the structure of the major pilin SpaD from Corynebacterium diphtheriae has implications for pilus assembly

Energy Technology Data Exchange (ETDEWEB)

Kang, Hae Joo; Paterson, Neil G. [University of Auckland, Private Bag 92019, Auckland 1142 (New Zealand); Kim, Chae Un [Cornell University, Ithaca, NY 14853 (United States); Middleditch, Martin [University of Auckland, Private Bag 92019, Auckland 1142 (New Zealand); Chang, Chungyu; Ton-That, Hung [University of Texas–Houston Medical School, Houston, TX 77030 (United States); Baker, Edward N., E-mail: ted.baker@auckland.ac.nz [University of Auckland, Private Bag 92019, Auckland 1142 (New Zealand)

2014-05-01

Two crystal structures of the major pilin SpaD from C. diphtheriae have been determined at 1.87 and 2.5 Å resolution. The N-terminal domain is found to contain an isopeptide bond that forms slowly over time in the recombinant protein. Given its structural context, this provides insight into the relationship between internal isopeptide-bond formation and pilus assembly. The Gram-positive organism Corynebacterium diphtheriae, the cause of diphtheria in humans, expresses pili on its surface which it uses for adhesion and colonization of its host. These pili are covalent protein polymers composed of three types of pilin subunit that are assembled by specific sortase enzymes. A structural analysis of the major pilin SpaD, which forms the polymeric backbone of one of the three types of pilus expressed by C. diphtheriae, is reported. Mass-spectral and crystallographic analysis shows that SpaD contains three internal Lys–Asn isopeptide bonds. One of these, shown by mass spectrometry to be located in the N-terminal D1 domain of the protein, only forms slowly, implying an energy barrier to bond formation. Two crystal structures, of the full-length three-domain protein at 2.5 Å resolution and of a two-domain (D2-D3) construct at 1.87 Å resolution, show that each of the three Ig-like domains contains a single Lys–Asn isopeptide-bond cross-link, assumed to give mechanical stability as in other such pili. Additional stabilizing features include a disulfide bond in the D3 domain and a calcium-binding loop in D2. The N-terminal D1 domain is more flexible than the others and, by analogy with other major pilins of this type, the slow formation of its isopeptide bond can be attributed to its location adjacent to the lysine used in sortase-mediated polymerization during pilus assembly.

Bonded exciplex formation: electronic and stereoelectronic effects.

Science.gov (United States)

Wang, Yingsheng; Haze, Olesya; Dinnocenzo, Joseph P; Farid, Samir; Farid, Ramy S; Gould, Ian R

2008-12-18

As recently proposed, the singlet-excited states of several cyanoaromatics react with pyridine via bonded-exciplex formation, a novel concept in photochemical charge transfer reactions. Presented here are electronic and steric effects on the quenching rate constants, which provide valuable support for the model. Additionally, excited-state quenching in poly(vinylpyridine) is strongly inhibited both relative to that in neat pyridine and also to conventional exciplex formation in polymers, consistent with a restrictive orientational requirement for the formation of bonded exciplexes. Examples of competing reactions to form both conventional and bonded exciplexes are presented, which illustrate the delicate balance between these two processes when their reaction energetics are similar. Experimental and computational evidence is provided for the formation of a bonded exciplex in the reaction of the singlet excited state of 2,6,9,10-tetracyanoanthracene (TCA) with an oxygen-substituted donor, dioxane, thus expanding the scope of bonded exciplexes.

Hydrogen bonding in ionic liquids.

Science.gov (United States)

Hunt, Patricia A; Ashworth, Claire R; Matthews, Richard P

2015-03-07

Ionic liquids (IL) and hydrogen bonding (H-bonding) are two diverse fields for which there is a developing recognition of significant overlap. Doubly ionic H-bonds occur when a H-bond forms between a cation and anion, and are a key feature of ILs. Doubly ionic H-bonds represent a wide area of H-bonding which has yet to be fully recognised, characterised or explored. H-bonds in ILs (both protic and aprotic) are bifurcated and chelating, and unlike many molecular liquids a significant variety of distinct H-bonds are formed between different types and numbers of donor and acceptor sites within a given IL. Traditional more neutral H-bonds can also be formed in functionalised ILs, adding a further level of complexity. Ab initio computed parameters; association energies, partial charges, density descriptors as encompassed by the QTAIM methodology (ρBCP), qualitative molecular orbital theory and NBO analysis provide established and robust mechanisms for understanding and interpreting traditional neutral and ionic H-bonds. In this review the applicability and extension of these parameters to describe and quantify the doubly ionic H-bond has been explored. Estimating the H-bonding energy is difficult because at a fundamental level the H-bond and ionic interaction are coupled. The NBO and QTAIM methodologies, unlike the total energy, are local descriptors and therefore can be used to directly compare neutral, ionic and doubly ionic H-bonds. The charged nature of the ions influences the ionic characteristics of the H-bond and vice versa, in addition the close association of the ions leads to enhanced orbital overlap and covalent contributions. The charge on the ions raises the energy of the Ylp and lowers the energy of the X-H σ* NBOs resulting in greater charge transfer, strengthening the H-bond. Using this range of parameters and comparing doubly ionic H-bonds to more traditional neutral and ionic H-bonds it is clear that doubly ionic H-bonds cover the full range of weak

27 CFR 70.281 - Form of bond and security required.

Science.gov (United States)

2010-04-01

..., express or telegraph money order; (v) Secured by corporate bonds or stocks, or by bonds issued by a State... of business or legal residence of the primary obligor is located; (ii) The surety must have property... which the principal place of business or legal residence of the primary obligor is located; (iv) The...

Concentration-dependent multiple chirality transition in halogen-bond-driven 2D self-assembly process

Science.gov (United States)

Miao, Xinrui; Li, Jinxing; Zha, Bao; Miao, Kai; Dong, Meiqiu; Wu, Juntian; Deng, Wenli

2018-03-01

The concentration-dependent self-assembly of iodine substituted thienophenanthrene derivative (5,10-DITD) is investigated at the 1-octanic acid/graphite interface using scanning tunneling microscopy. Three kinds of chiral arrangement and transition of 2D molecular assembly mainly driven by halogen bonding is clearly revealed. At high concentration the molecules self-assembled into a honeycomb-like chiral network. Except for the interchain van der Waals forces, this pattern is stabilized by intermolecular continuous Cdbnd O⋯I⋯S halogen bonds in each zigzag line. At moderate concentration, a chiral kite-like nanoarchitecture are observed, in which the Cdbnd O⋯I⋯S and I⋯Odbnd C halogen bonds, along with the molecule-solvent Cdbnd O⋯I⋯H halogen bonds are the dominated forces to determine the structural formation. At low concentration, the molecules form a chiral cyclic network resulting from the solvent coadsorption mainly by molecule-molecule Cdbnd O⋯I⋯S halogen bonds and molecule-solvent Cdbnd O⋯I⋯H halogen bonds. The density of molecular packing becomes lower with the decreasing of the solution concentration. The solution-concentration dependent self-assembly of thienophenanthrene derivative with iodine and ester chain moieties reveals that the type of intermolecular halogen bond and the number of the co-adsorbing 1-octanic acids by molecule-solvent Cdbnd O⋯I⋯H halogen bonds determine the formation and transformation of chirality. This research emphasizes the role of different types of halogen (I) bonds in the controllable supramolecular structures and provides an approach for the fabrication of chirality.

Proposal of new bonding technique 'Instantaneous Liquid Phase (ILP) Bonding'

International Nuclear Information System (INIS)

Zhang, Yue-Chang; Nakagawa, Hiroji; Matsuda, Fukuhisa.

1987-01-01

A new bonding technique named ''Instantaneous Liquid Phase (ILP) bonding'' suitable mainly for welding dissimilar materials was proposed by which instantaneous melting of one or two of the faying surfaces is utilized. The processes of ILP bonding are mainly consisted of three stages, namely the first stage forming thin liquid layer by rapid heating, the second stage joining both specimens by thin liquid layer, and the third stage cooling the specimens rapidly to avoid the formation of brittle layer. The welding temperatures of the specimens to be welded in ILP bonding are generally differentiated from each other. ILP bonding was applied for a variety of combinations of dissimilar materials of aluminum, aluminum alloys, titanium, titanium alloy, carbon steel, austenitic stainless steel, copper and tungsten, and for similar materials of stainless steel and nickel-base alloy. There were no microvoids in these welding joints, and the formation of brittle layer at the bonding interface was suppressed. The welded joints of Al + Ti, Cu + carbon steel and Cu + austenitic stainless steel showed the fracture in base metal having lower tensile strength. Further, the welded joints of Al + carbon steel, Al alloy + Ti, Al alloy + carbon steel or + austenitic stainless steel, Ti + carbon steel or + austenitic stainless steel showed better tensile properties in the comparison with diffusion welding. Furthermore, ILP bonding was available for welding same materials susceptible to hot cracking. Because of the existence of liquid layer, the welding pressure required was extremely low, and preparation of faying surface by simple tooling or polishing by no.80 emery paper was enough. The change in specimen length before and after welding was relatively little, only depending on the thickness of liquid layer. The welding time was very short, and thus high welding efficiency was obtained. (author)

Theoretical and Experimental Study on Vibration Propagation in PMMA Components in Ultrasonic Bonding Process

Directory of Open Access Journals (Sweden)

Yibo Sun

2017-03-01

Full Text Available Ultrasonic bonding has an increasing application in the micro assembly of polymeric micro-electro mechanical systems (MEMS with high requirements for fusion precision. In the ultrasonic bonding process, the propagation of ultrasonic vibration in polymer components is related to the interfacial fusion, which can be used as a monitoring parameter to control ultrasonic energy. To study the vibration propagation in viscoelastic polymer components, finite element analysis on the bonding of poly methyl methacrylate (PMMA micro connector to substrate for microfluidic system is carried out. Curves of propagated vibration amplitude corresponding to interfacial temperatures are obtained. The ultrasonic vibration propagated in PMMA components are measured through experiments. The theoretical and experimental results are contrasted to analyze the change mechanism of vibration propagation related to temperature. Based on the ultrasonic bonding process controlled by the feedback of vibration propagation, interfacial fusions at different vibration propagation states are obtained through experiments. Interfacial fusion behavior is contrasted to the propagated vibration amplitude in theoretical and experimental studies. The relation between vibration propagation and fusion degree is established with the proper parameter range for the obtained high quality bonding.

Comparative assessment of TRU waste forms and processes. Volume I. Waste form and process evaluations

International Nuclear Information System (INIS)

Ross, W.A.; Lokken, R.O.; May, R.P.; Roberts, F.P.; Timmerman, C.L.; Treat, R.L.; Westsik, J.H. Jr.

1982-09-01

This study provides an assesses seven waste forms and eight processes for immobilizing transuranic (TRU) wastes. The waste forms considered are cast cement, cold-pressed cement, FUETAP (formed under elevated temperature and pressure) cement, borosilicate glass, aluminosilicate glass, basalt glass-ceramic, and cold-pressed and sintered silicate ceramic. The waste-immobilization processes considered are in-can glass melting, joule-heated glass melting, glass marble forming, cement casting, cement cold-pressing, FUETAP cement processing, ceramic cold-pressing and sintering, basalt glass-ceramic processing. Properties considered included gas generation, chemical durability, mechanical strength, thermal stability, and radiation stability. The ceramic products demonstrated the best properties, except for plutonium release during leaching. The glass and ceramic products had similar properties. The cement products generally had poorer properties than the other forms, except for plutonium release during leaching. Calculations of the Pu release indicated that the waste forms met the proposed NRC release rate limit of 1 part in 10 5 per year in most test conditions. The cast-cement process had the lowest processing cost, followed closely by the cold-pressed and FUETAP cement processes. Joule-heated glass melting had the lower cost of the glass processes. In-can melting in a high-quality canister had the highest cost, and cold-pressed and sintered ceramic the second highest. Labor and canister costs for in-can melting were identified. The major contributor to costs of disposing of TRU wastes in a defense waste repository is waste processing costs. Repository costs could become the dominant cost for disposing of TRU wastes in a commercial repository. It is recommended that cast and FUETAP cement and borosilicate glass waste-form systems be considered. 13 figures, 16 tables

Microstructure of Reaction Zone Formed During Diffusion Bonding of TiAl with Ni/Al Multilayer

Science.gov (United States)

Simões, Sónia; Viana, Filomena; Koçak, Mustafa; Ramos, A. Sofia; Vieira, M. Teresa; Vieira, Manuel F.

2012-05-01

In this article, the characterization of the interfacial structure of diffusion bonding a TiAl alloy is presented. The joining surfaces were modified by Ni/Al reactive multilayer deposition as an alternative approach to conventional diffusion bonding. TiAl substrates were coated with alternated Ni and Al nanolayers. The nanolayers were deposited by dc magnetron sputtering with 14 nm of period (bilayer thickness). Joining experiments were performed at 900 °C for 30 and 60 min with a pressure of 5 MPa. Cross sections of the joints were prepared for characterization of their interfaces by scanning electron microscopy (SEM), transmission electron microscopy (TEM), scanning transmission electron microscopy (STEM), high resolution TEM (HRTEM), energy dispersive x-ray spectroscopy (EDS), and electron backscatter diffraction (EBSD). Several intermetallic compounds form at the interface, assuring the bonding of the TiAl. The interface can be divided into three distinct zones: zone 1 exhibits elongated nanograins, very small equiaxed grains are observed in zone 2, while zone 3 has larger equiaxed grains. EBSD analysis reveals that zone 1 corresponds to the intermetallic Al2NiTi and AlNiTi, and zones 2 and 3 to NiAl.

Voltage-assisted polymer wafer bonding

International Nuclear Information System (INIS)

Varsanik, J S; Bernstein, J J

2012-01-01

Polymer wafer bonding is a widely used process for fabrication of microfluidic devices. However, best practices for polymer bonds do not achieve sufficient bond strength for many applications. By applying a voltage to a polymer bond in a process called voltage-assisted bonding, bond strength is shown to improve dramatically for two polymers (Cytop™ and poly(methyl methacrylate)). Several experiments were performed to provide a starting point for further exploration of this technique. An optimal voltage range is experimentally observed with a reduction in bonding strength at higher voltages. Additionally, voltage-assisted bonding is shown to reduce void diameter due to bond defects. An electrostatic force model is proposed to explain the improved bond characteristics. This process can be used to improve bond strength for most polymers. (paper)

An Alternative Cu-Based Bond Layer for Electric Arc Coating Process

Science.gov (United States)

Fadragas, Carlos R.; Morales, E. V.; Muñoz, J. A.; Bott, I. S.; Lariot Sánchez, C. A.

2011-12-01

A Cu-Al alloy has been used as bond coat between a carbon steel substrate and a final coating deposit obtained by applying the twin wire electric arc spraying coating technique. The presence of a copper-based material in the composite system can change the overall temperature profile during deposition because copper exhibits a thermal conductivity several times higher than that of the normally recommended bond coat materials (such as nickel-aluminum alloys or nickel-chromium alloys). The microstructures of 420 and 304 stainless steels deposited by the electric arc spray process have been investigated, focusing attention on the deposit homogeneity, porosity, lamellar structure, and microhardness. The nature of the local temperature gradient during deposition can strongly influence the formation of the final coating deposit. This study presents a preliminary study, undertaken to investigate the changes in the temperature profile which occur when a Cu-Al alloy is used as bond coat, and the possible consequences of these changes on the microstructure and adhesion of the final coating deposit. The influence of the thickness of the bond layer on the top coating temperature has also been also evaluated.

Wax-bonding 3D microfluidic chips

KAUST Repository

Gong, Xiuqing; Yi, Xin; Xiao, Kang; Li, Shunbo; Kodzius, Rimantas; Qin, Jianhua; Wen, Weijia

2013-01-01

We report a simple, low-cost and detachable microfluidic chip incorporating easily accessible paper, glass slides or other polymer films as the chip materials along with adhesive wax as the recycling bonding material. We use a laser to cut through the paper or film to form patterns and then sandwich the paper and film between glass sheets or polymer membranes . The hot-melt adhesive wax can realize bridge bonding between various materials, for example, paper, polymethylmethacrylate (PMMA) film, glass sheets, or metal plate. The bonding process is reversible and the wax is reusable through a melting and cooling process. With this process, a three-dimensional (3D) microfluidic chip is achievable by vacuating and venting the chip in a hot-water bath. To study the biocompatibility and applicability of the wax-based microfluidic chip, we tested the PCR compatibility with the chip materials first. Then we applied the wax-paper based microfluidic chip to HeLa cell electroporation (EP ). Subsequently, a prototype of a 5-layer 3D chip was fabricated by multilayer wax bonding. To check the sealing ability and the durability of the chip, green fluorescence protein (GFP) recombinant Escherichia coli (E. coli) bacteria were cultured, with which the chemotaxis of E. coli was studied in order to determine the influence of antibiotic ciprofloxacin concentration on the E. coli migration.

Wax-bonding 3D microfluidic chips

KAUST Repository

Gong, Xiuqing

2013-10-10

We report a simple, low-cost and detachable microfluidic chip incorporating easily accessible paper, glass slides or other polymer films as the chip materials along with adhesive wax as the recycling bonding material. We use a laser to cut through the paper or film to form patterns and then sandwich the paper and film between glass sheets or polymer membranes . The hot-melt adhesive wax can realize bridge bonding between various materials, for example, paper, polymethylmethacrylate (PMMA) film, glass sheets, or metal plate. The bonding process is reversible and the wax is reusable through a melting and cooling process. With this process, a three-dimensional (3D) microfluidic chip is achievable by vacuating and venting the chip in a hot-water bath. To study the biocompatibility and applicability of the wax-based microfluidic chip, we tested the PCR compatibility with the chip materials first. Then we applied the wax-paper based microfluidic chip to HeLa cell electroporation (EP ). Subsequently, a prototype of a 5-layer 3D chip was fabricated by multilayer wax bonding. To check the sealing ability and the durability of the chip, green fluorescence protein (GFP) recombinant Escherichia coli (E. coli) bacteria were cultured, with which the chemotaxis of E. coli was studied in order to determine the influence of antibiotic ciprofloxacin concentration on the E. coli migration.

Influence of heat-pretreatments on the microstructural and mechanical properties of galfan-coated metal bonds

Science.gov (United States)

Hordych, Illia; Rodman, Dmytro; Nürnberger, Florian; Schmidt, Hans Christian; Orive, Alejandro Gonzalez; Homberg, Werner; Grundmeier, Guido; Maier, Hans Jürgen

2018-05-01

In the present study, heat-treatment assisted bonding of galfan-coated low-carbon steel sheets was investigated. Steel sheets were bonded by cold rolling subsequently to a heat treatment in the temperature range from 400 °C to 550°C. The reduction ratio during cold rolling was varied in the range from 50% to 80%. Such high reduction ratios were achieved by splitting the bonding process into three stages. By employing heat-treatments, the mechanical properties of the bonds were improved. The heat-pretreatment allowed the formation of brittle intermetallic phases that were easily fractured in the rolling gap during the bonding process. Thus, juvenile non-oxidized surfaces were formed, which facilitated the bonding between the steel layers, and thus increased the bond strength. The intermetallic phases were actively formed at temperatures of 450 °C and above; however increasing temperatures resulted in decreasing mechanical properties due to oxidation processes. The local microstructure was analyzed by scanning electron microscopy in order to characterize the contact zone on the micro level with a focus on the formation of intermetallic phases. The mechanical properties were determined in tensile shear tests. Interestingly, it was found that the galfan coating allowed for bonding at room temperature, and the aluminum fraction was primarily responsible for the enhanced oxide formation during the heat-pretreatment.

Phenylacetylene and H bond

Indian Academy of Sciences (India)

... all resembling H bonds. Non-linear H bonds due to secondary interactions. C-H stretching frequency shows blue shift. Heavy atom distances are longer than the sum of van der Waals radii. Formed a task group through IUPAC to come up with a modern definition of H bond. 15 international experts including Desiraju.

Particle beam technology for control of atomic-bonding state in materials

Energy Technology Data Exchange (ETDEWEB)

Ishikawa, Junzo [Kyoto Univ. (Japan). Faculty of Engineering

1997-03-01

The atomic-bonding state in materials can be controlled through `kinetic bonding` process by energetic particle beams which have a sufficient atomic kinetic energy. In order to clarify the `kinetic bonding` process the negative-ion beam deposition is considered as an ideal method because the negative ion has no additional active energies. Sputter type heavy negative-ion sources can be used for this purpose. Carbon films prepared by carbon negative-ion beam deposition have a strong dependency of the film properties on ion beam kinetic energy and have a quite high thermal conductivity which is comparable to that of the IIb diamond at a kinetic energy of 50-100 eV/atom. It suggests that new or metastable materials could be formed through the `kinetic bonding` process. Negative-ion beams can also be used for ion implantation, in which charging problems are perfectly reduced. (author)

Cohesive zone model for direct silicon wafer bonding

Science.gov (United States)

Kubair, D. V.; Spearing, S. M.

2007-05-01

Direct silicon wafer bonding and decohesion are simulated using a spectral scheme in conjunction with a rate-dependent cohesive model. The cohesive model is derived assuming the presence of a thin continuum liquid layer at the interface. Cohesive tractions due to the presence of a liquid meniscus always tend to reduce the separation distance between the wafers, thereby opposing debonding, while assisting the bonding process. In the absence of the rate-dependence effects the energy needed to bond a pair of wafers is equal to that needed to separate them. When rate-dependence is considered in the cohesive law, the experimentally observed asymmetry in the energetics can be explained. The derived cohesive model has the potential to form a bridge between experiments and a multiscale-modelling approach to understand the mechanics of wafer bonding.

Brazing and diffusion bonding processes as available repair techniques for gas turbine blades and nozzles

International Nuclear Information System (INIS)

Mazur, Z.

1997-01-01

The conventionally welding methods are not useful for repair of heavily damaged gas turbine blades and nozzles. It includes thermal fatigue and craze cracks, corrosion, erosion and foreign object damage, which extend to the large areas. Because of required extensive heat input and couponing, it can cause severe distortion of the parts and cracks in the heat affected zone, and can made the repair costs high. For these cases, the available repair methods of gas turbine blades and nozzles, include brazing and diffusion bonding techniques are presented. Detailed analysis of the brazing and diffusion bonding processes applied for gas turbine blades repair with all elements which presented. Detailed analysis of the brazing and diffusion bonding processes applied for gas turbine blades repair with all elements which have influence to get sound joint is carried out. Depend of kind of blades and nozzle damage or deterioration registered a different methods of brazing and diffusion bonding applicability is presented. (Author) 65 refs

Competition of electron transfer, dissociation, and bond-forming reactions in collisions of CO22+ with neutral CO2

Czech Academy of Sciences Publication Activity Database

Ricketts, Claire; Schröder, Detlef; Roithová, Jana; Schwarz, H.; Thissen, R.; Dutuit, O.; Žabka, Ján; Herman, Zdeněk; Price, S. D.

2008-01-01

Roč. 10, č. 33 (2008), s. 5135-5143 ISSN 1463-9076 Institutional research plan: CEZ:AV0Z40550506; CEZ:AV0Z40400503 Keywords : carbon dioxide * bond -forming reactions * dications Subject RIV: CF - Physical ; Theoretical Chemistry Impact factor: 4.064, year: 2008

Enantioselective functionalization of allylic C-H bonds following a strategy of functionalization and diversification.

Science.gov (United States)

Sharma, Ankit; Hartwig, John F

2013-11-27

We report the enantioselective functionalization of allylic C-H bonds in terminal alkenes by a strategy involving the installation of a temporary functional group at the terminal carbon atom by C-H bond functionalization, followed by the catalytic diversification of this intermediate with a broad scope of reagents. The method consists of a one-pot sequence of palladium-catalyzed allylic C-H bond oxidation under neutral conditions to form linear allyl benzoates, followed by iridium-catalyzed allylic substitution. This overall transformation forms a variety of chiral products containing a new C-N, C-O, C-S, or C-C bond at the allylic position in good yield with a high branched-to-linear selectivity and excellent enantioselectivity (ee ≤97%). The broad scope of the overall process results from separating the oxidation and functionalization steps; by doing so, the scope of nucleophile encompasses those sensitive to direct oxidative functionalization. The high enantioselectivity of the overall process is achieved by developing an allylic oxidation that occurs without acid to form the linear isomer with high selectivity. These allylic functionalization processes are amenable to an iterative sequence leading to (1,n)-functionalized products with catalyst-controlled diastereo- and enantioselectivity. The utility of the method in the synthesis of biologically active molecules has been demonstrated.

Glass-bonded iodosodalite waste form for immobilization of 129 I

Energy Technology Data Exchange (ETDEWEB)

Chong, Saehwa; Peterson, Jacob A.; Riley, Brian J.; Tabada, Diana; Wall, Donald; Corkhill, Claire L.; McCloy, John S.

2018-06-01

Immobilization of radioiodine (e.g., 129I, 131I) is an important need for current and future nuclear fuel cycles. For the current work, iodosodalite [Na8(AlSiO4)6I2] was synthesized hydrothermally from metakaolin, NaI, and NaOH. Following hydrothermal treatment, dried unwashed powders were used to make glass-bonded iodosodalite waste forms by heating pressed pellets at 650, 750, or 850 °C with two different types of sodium borosilicate glass binders, i.e., NBS-4 and SA-800. These heat-treated specimens were characterized with X-ray diffraction, Fourier-transform infrared spectroscopy, scanning electron microscopy, energy dispersive spectroscopy, thermal analysis, porosity and density measurements, neutron activation analysis, and inductively-coupled plasma mass spectrometry. The pellets mixed with 10 mass% of NBS-4 or SA-800 and heat-treated at 750 °C contained relatively high percentage iodine retention (~44-47 % of the maximum iodine loading) with relatively low porosities, while other pellets with higher percentages iodine retention either contained higher porosity or were not completely sintered. ASTM C1308 chemical durability tests of monolithic specimens showed a large initial release of Na, Al, Si, and I on the first day, possibly from water-soluble salt crystals or non-durable amorphous phases. Release rates of Na and Si were higher than for Al and I, probably due to a poorly durable Na-Si-O phase from the glass bonding matrix. The cumulative normalized release of iodine was 12.5 g m-2 for the first 10 1-d exchanges, suggestive of coherent dissolution. The average release rate from 10-24 days during the 7-d exchange intervals was 0.2336 g m-2 d-1.

Films of covalently bonded gold nanoparticles synthesized by a sol–gel process

International Nuclear Information System (INIS)

Dell’Erba, Ignacio E.; Hoppe, Cristina E.; Williams, Roberto J. J.

2012-01-01

Gold nanoparticles (NPs) with a size close to 1.5 nm, coated with organic ligands bearing Si(OEt) 3 groups, were synthesized and used to obtain self-standing films by a sol–gel process catalyzed by formic acid. Using FESEM images, FTIR, and UV–visible spectra, it was observed that very small gold NPs self-assembled by Si–O–Si covalent bonds forming crosslinked clusters with sizes up to about 50 nm in which NPs preserve their individuality. The possibility of fixing very small gold NPs in a crosslinked film opens a variety of potential applications based on the specific properties of small-size particles. As an example, we illustrated the way in which one can take advantage of the low melting temperature of these NPs to generate tiny gold crystals partially embedded at the surface, a process that might be used for the development of catalysts or sensors. Besides, the shift and change in the intensity of the plasmon band produced by heating to 100 °C may be employed to develop an irreversible sensor of undesirable temperature excursions during the life-time of a specific product.

Effects of Processing Parameters on the Forming Quality of C-Shaped Thermosetting Composite Laminates in Hot Diaphragm Forming Process

Science.gov (United States)

Bian, X. X.; Gu, Y. Z.; Sun, J.; Li, M.; Liu, W. P.; Zhang, Z. G.

2013-10-01

In this study, the effects of processing temperature and vacuum applying rate on the forming quality of C-shaped carbon fiber reinforced epoxy resin matrix composite laminates during hot diaphragm forming process were investigated. C-shaped prepreg preforms were produced using a home-made hot diaphragm forming equipment. The thickness variations of the preforms and the manufacturing defects after diaphragm forming process, including fiber wrinkling and voids, were evaluated to understand the forming mechanism. Furthermore, both interlaminar slipping friction and compaction behavior of the prepreg stacks were experimentally analyzed for showing the importance of the processing parameters. In addition, autoclave processing was used to cure the C-shaped preforms to investigate the changes of the defects before and after cure process. The results show that the C-shaped prepreg preforms with good forming quality can be achieved through increasing processing temperature and reducing vacuum applying rate, which obviously promote prepreg interlaminar slipping process. The process temperature and forming rate in hot diaphragm forming process strongly influence prepreg interply frictional force, and the maximum interlaminar frictional force can be taken as a key parameter for processing parameter optimization. Autoclave process is effective in eliminating voids in the preforms and can alleviate fiber wrinkles to a certain extent.

49 CFR 594.9 - Fee for reimbursement of bond processing costs and costs for processing offers of cash deposits...

Science.gov (United States)

2010-10-01

... 49 Transportation 7 2010-10-01 2010-10-01 false Fee for reimbursement of bond processing costs and costs for processing offers of cash deposits or obligations of the United States in lieu of sureties on... indirect costs the agency incurs for receipt, processing, handling, and disbursement of cash deposits or...

26 CFR 301.7101-1 - Form of bond and security required.

Science.gov (United States)

2010-04-01

..., bank, express or telegraph money order; (v) Secured by corporate bonds or stocks, or by bonds issued by... legal residence of the primary obligor is located; (ii) He must have property subject to execution of a... or legal residence of the primary obligor is located; (iv) He must agree not to mortgage, or...

Strength of Al and Al-Mg/alumina bonds prepared using ultrahigh vacuum diffusion bonding

International Nuclear Information System (INIS)

King, W.E.; Campbell, G.H.; Wien, W.L.; Stoner, S.L.

1994-01-01

The authors have measured the cross-breaking strength of Al and Al-Mg alloys bonded with alumina. Diffusion bonding of Al and Al-Mg alloys requires significantly more bonding time than previously thought to obtain complete bonding. In contrast to previous diffusion bonding studies, fracture morphologies are similar to those obtained in bonds formed by liquid phase reaction; i.e., bonds are as strong or stronger than the ceramic; and fracture tends to propagate in the metal for pure Al and near the interface in the ceramic for the alloys. There are indications that the fracture morphology depends on Mg content and therefore on plasticity in the metal

Processes for production of alternative waste forms

International Nuclear Information System (INIS)

Ross, W.A.; Rusin, J.M.; McElroy, J.L.

1979-01-01

During the past 20 years, numerous waste forms and processes have been proposed for solidification of high-level radioactive wastes (HLW). The number has increased significantly during the past 3 to 4 years. At least five factors must be considered in selecting the waste form and process method: 1) processing flexibility, 2) waste loading, 3) canister size and stability, 4) waste form inertness and stability, and 5) processing complexity. This paper describes various waste form processes and operations, and a simple system is proposed for making comparisons. This system suggests that one goal for processes would be to reduce the number of process steps, thereby providing less complex processing systems

[Effect of sandblasting particle sizes on bonding strength between porcelain and titanium fabricated by rapid laser forming].

Science.gov (United States)

Zhang, Li-jun; Wang, Zhong-yi; Gao, Bo; Gao, Yang; Zhang, Chun-bao

2009-11-01

To evaluate the effect of sandblasting particle sizes of Al2O3 on the bonding strength between porcelain and titanium fabricated by laser rapid forming (LRF). The thermal expansion coefficient, roughness (Ra), contact angle, surface morphology of titanium surface and the bonding strength between titanium and porcelain were evaluated after the titanium surface being sandblasted using different sizes of Al2O3 (50 microm, 120 microm, 250 microm) at a pressure of 0.5 MPa. The cast titanium specimens were used as control, and were sandblasted with 50 microm Al2O3 at the same pressure. The thermal expansion coefficient of cast titanium [(9.84 +/- 0.42) x 10(-6)/ degrees C] and LRF Ti [(9.79 +/- 0.31) x 10(-6)/ degrees C) matched that of Noritake Ti-22 dentin porcelain [(8.93 +/- 0.36) x 10(-6)/ degrees C). When larger size of Al2O3 was used, the value of Ra and contact angle increased as well. There was no significant difference in bonding strength between the LRF Ti-50 microm [(25.91 +/- 1.02) MPa] and cast titanium [(26.42 +/- 1.65) MPa]. Significantly lower bonding strength was found in LRF Ti-120 microm [(21.86 +/- 1.64) MPa] and LRF Ti-250 microm [(19.96 +/- 1.03) MPa]. The bond strength between LRF Ti and Noritake Ti-22 dentin porcelain was above the lower limit value in the ISO 9693 (25 MPa) after using 50 microm Al2O3 sandblasting in 0.5MPa air pressure.

The Pd distribution and Cu flow pattern of the Pd-plated Cu wire bond and their effect on the nanoindentation

International Nuclear Information System (INIS)

Lin, Yu-Wei; Wang, Ren-You; Ke, Wun-Bin; Wang, I-Sheng; Chiu, Ying-Ta; Lu, Kuo-Chang; Lin, Kwang-Lung; Lai, Yi-Shao

2012-01-01

Highlights: ► Pd distribution in Pd-plated Cu wires reveals the whirlpool flow pattern of Cu. ► The mechanisms of the Cu flow behavior and Pd distribution are proposed. ► At Pd-rich phases, small voids formed and followed the direction of Cu flow. ► Nanoindentation studies show the Cu ball bond is harder in regions with Pd. - Abstract: The Pd plating on the 20 μm Cu wire dissolves in the free air ball (FAB) and the Cu ball bond during the wire bonding process without forming intermetallic compounds. The limiting supply of Pd and the short bonding process, 15 ms of thermosonic bonding, result in uneven distribution of Pd in the as produced Cu ball bond. Also, the Pd-rich phase may accompany small voids formed within the FAB and the wire bond, and following the direction of semi-solid Cu flow. The Pd distribution, as evidenced by the focused ion beam (FIB) and wavelength dispersive X-ray spectroscopy (WDS) mapping, reveals the whirlpool flow pattern of Cu within the FAB and the ball bond. Pd distributes within the copper ball through convective transport by the copper flow. Additionally, hardness measurements by nanoindentation testing show that the Cu ball bond is harder in the regions where Pd exists.

Extreme population inversion in the fragments formed by UV photoinduced S-H bond fission in 2-thiophenethiol.

Science.gov (United States)

Ingle, Rebecca A; Karsili, Tolga N V; Dennis, Gregg J; Staniforth, Michael; Stavros, Vasilios G; Ashfold, Michael N R

2016-04-28

H atom loss following near ultraviolet photoexcitation of gas phase 2-thiophenethiol molecules has been studied experimentally, by photofragment translational spectroscopy (PTS) methods, and computationally, by ab initio electronic structure calculations. The long wavelength (277.5 ≥ λ(phot) ≥ 240 nm) PTS data are consistent with S-H bond fission after population of the first (1)πσ* state. The partner thiophenethiyl (R) radicals are formed predominantly in their first excited Ã(2)A' state, but assignment of a weak signal attributable to H + R(X˜(2)A'') products allows determination of the S-H bond strength, D0 = 27,800 ± 100 cm(-1) and the Ã-X˜ state splitting in the thiophenethiyl radical (ΔE = 3580 ± 100 cm(-1)). The deduced population inversion between the à and X˜ states of the radical reflects the non-planar ground state geometry (wherein the S-H bond is directed near orthogonal to the ring plane) which, post-photoexcitation, is unable to planarise sufficiently prior to bond fission. This dictates that the dissociating molecules follow the adiabatic fragmentation pathway to electronically excited radical products. π* ← π absorption dominates at shorter excitation wavelengths. Coupling to the same (1)πσ* potential energy surface (PES) remains the dominant dissociation route, but a minor yield of H atoms attributable to a rival fragmentation pathway is identified. These products are deduced to arise via unimolecular decay following internal conversion to the ground (S0) state PES via a conical intersection accessed by intra-ring C-S bond extension. The measured translational energy disposal shows a more striking change once λ(phot) ≤ 220 nm. Once again, however, the dominant decay pathway is deduced to be S-H bond fission following coupling to the (1)πσ* PES but, in this case, many of the evolving molecules are deduced to have sufficiently near-planar geometries to allow passage through the conical intersection at extended S-H bond

Quadruple metal-metal bonds with strong donor ligands. Ultraviolet photoelectron spectroscopy of M{sub 2}(form){sub 4} (M = Cr, Mo, W; form = N,N{prime}-diphenylformamidinate)

Energy Technology Data Exchange (ETDEWEB)

Lichtenberger, D.L.; Lynn, M.A.; Chisholm, M.H.

1999-12-29

The He I photoelectron spectra of M{sub 2}(form){sub 4}(M = Cr, Mo, W; form - N,N{prime}-diphenylformamidinate) and Mo{sub 2}(cyform){sub 4} (cyform = N,N{prime}-dicyclohexylformamidinate) are presented. For comparison, the Ne I, He I, and He II photoelectron spectra of Mo{sub 2}(p-CH{sub 3}-form){sub 4} have also been obtained. The valence ionization features of these molecules are interpreted based on (1) the changes that occur with the metal and ligand substitutions, (2) the changes in photoelectron cross sections with excitation source, and (3) the changes from previously studied dimetal complexes. These photoelectron spectra are useful for revealing the effects that better electron donor ligands have on the valence electronic structure of M{sub 2}(L-L){sub 4} systems. Comparison with the He I spectra of the isoelectronic M{sub 2}(O{sub 2}CCH{sub 3}){sub 4} compounds is particularly revealing. Unlike with the more electron-withdrawing acetate ligand, several formamidinate-based ionizations derived from the nitrogen p{sub {pi}} orbitals occur among the metal-metal {sigma}, {pi}, and {delta} ionization bands. Although these formamidinate-based levels are close in energy to the occupied metal-metal bonds, they have little direct mixing interaction with them. The shift of the metal-metal bond ionizations to lower ionization energies for the formamidinate systems is primarily a consequence of the lower electronegativity of the ligand and the better {pi} donation into empty metal levels. The metal-metal {delta} orbital experiences some additional net bonding interaction with ligand orbitals of the same symmetry. Also, an additional bonding interaction from ligand-to-metal electron donation to the {delta}* orbital is identified. These spectra suggest a greater degree of metal-ligand covalency than in the related M{sub 2}(O{sub 2}CCH{sub 3}){sub 4} systems. Fenske-Hall molecular orbital and density functional (ADF) calculations agree with the assignment and

Mechanical properties of intermetallics formed during thermal aging of Cu-Al ball bonds

NARCIS (Netherlands)

Kouters, M.H.M.; Gubbels, G.H.M.; O'Halloran, O.; Rongen, R.; Weltevreden, E.R.

2011-01-01

In high power automotive electronics copper wire bonding is regarded as most promising alternative for gold wire bonding in 1st level interconnects and therefore subjected to severe functional requirements. In the Cu-Al ball bond interface the growth of intermetallic compounds may deteriorate the

Characterization of the effect generated by the preformed and formed processes applied to drainage catheters of Quadrathane"T"M, in the blistered defect

International Nuclear Information System (INIS)

Rodriguez Forero, Diana Catalina

2014-01-01

The effect generated by preformed and formed processes on drainage catheters is characterized in the blistered defect. The potential root causes generated from the blistered defect are identified by the experimental design of one factor at a time. The experimental phases performed on the blistered defect have been: chemical interaction, humidity, mechanical stress, parameters RO Bonding, parameters of temperature and time of retention in the forming process. The application of quality control process methodology is recommended to obtain robust information about the defect and the process in general. Polymeric extrusions and construction of drainage catheters processes are described. The processes of preformed, formed and blistered defect are explained. The incidence of blistered defect and the yields of each batch produced of catheters should be controlled by means of weekly records to avoid further complications at the level of yield or quality [es

Comparative assessment of TRU waste forms and processes. Volume II. Waste form data, process descriptions, and costs

International Nuclear Information System (INIS)

Ross, W.A.; Lokken, R.O.; May, R.P.; Roberts, F.P.; Thornhill, R.E.; Timmerman, C.L.; Treat, R.L.; Westsik, J.H. Jr.

1982-09-01

This volume contains supporting information for the comparative assessment of the transuranic waste forms and processes summarized in Volume I. Detailed data on the characterization of the waste forms selected for the assessment, process descriptions, and cost information are provided. The purpose of this volume is to provide additional information that may be useful when using the data in Volume I and to provide greater detail on particular waste forms and processes. Volume II is divided into two sections and two appendixes. The first section provides information on the preparation of the waste form specimens used in this study and additional characterization data in support of that in Volume I. The second section includes detailed process descriptions for the eight processes evaluated. Appendix A lists the results of MCC-1 leach test and Appendix B lists additional cost data. 56 figures, 12 tables

77 FR 10621 - Changes to the In-Bond Process

Science.gov (United States)

2012-02-22

... submit in-bond applications electronically using a CBP-approved electronic data interchange (EDI) system... electronically submit the in-bond application to CBP via a CBP-approved EDI system. \\6\\ Due to the unique... as the CBP-approved EDI system for submitting the in-bond application and other information that is...

Bonding pathways of high-pressure chemical transformations

International Nuclear Information System (INIS)

Hu Anguang; Zhang Fan

2013-01-01

A three-stage bonding pathway towards high-pressure chemical transformations from molecular precursors or intermediate states has been identified by first-principles simulations. With the evolution of principal stress tensor components in the response of chemical bonding to compressive loading, the three stages can be defined as the van der Waals bonding destruction, a bond breaking and forming reaction, and equilibrium of new bonds. The three-stage bonding pathway leads to the establishment of a fundamental principle of chemical bonding under compression. It reveals that during high-pressure chemical transformation, electrons moving away from functional groups follow anti-addition, collision-free paths to form new bonds in counteracting the local stress confinement. In applying this principle, a large number of molecular precursors were identified for high-pressure chemical transformations, resulting in new materials. (fast track communication)

Effect of laser parameters on the microstructure of bonding porcelain layer fused on titanium

Science.gov (United States)

Chen, Xiaoyuan; Guo, Litong; Liu, Xuemei; Feng, Wei; Li, Baoe; Tao, Xueyu; Qiang, Yinghuai

2017-09-01

Bonding porcelain layer was fused on Ti surface by laser cladding process using a 400 W pulse CO2 laser. The specimens were studied by field-emission scanning electron microscopy, X-ray diffraction and bonding tests. During the laser fusion process, the porcelain powders were heated by laser energy and melted on Ti to form a chemical bond with the substrate. When the laser scanning speed decreased, the sintering temperature and the extent of the oxidation of Ti surface increased accordingly. When the laser scanning speed is 12.5 mm/s, the bonding porcelain layers were still incomplete sintered and there were some micro-cracks in the porcelain. When the laser scanning speed decreased to 7.5 mm/s, vitrified bonding porcelain layers with few pores were synthesized on Ti.

Binding matter with antimatter: the covalent positron bond.

Science.gov (United States)

Charry, Jorge Alfonso; Varella, Marcio T Do N; Reyes, Andrés

2018-05-16

We report sufficient theoretical evidence of the energy stability of the e⁺H₂²⁻ molecule, formed by two H⁻ anions and one positron. Analysis of the electronic and positronic densities of the latter compound undoubtedly points out the formation of a positronic covalent bond between the otherwise repelling hydride anions. The lower limit for the bonding energy of the e⁺H₂²⁻ molecule is 74 kJ/mol (0.77 eV), accounting for the zero-point vibrational correction. The formation of a non electronic covalent bond is fundamentally distinct from positron attachment to stable molecules, as the latter process is characterized by a positron affinity, analogous to the electron affinity. © 2018 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

Fuel Pellets from Biomass. Processing, Bonding, Raw Materials

DEFF Research Database (Denmark)

Stelte, Wolfgang

in an increasing interest in biomass densification technologies, such as pelletization and briquetting. The global pellet market has developed quickly, and strong growth is to be expected for the coming years. Due to an increasing demand for biomass, the traditionally used wood residues from sawmills and pulp...... influence of the different processing parameters on the pressure built up in the press channel of a pellet mill. It showed that the major factor was the press channel length as well as temperature, moisture content, particle size and extractive content. Furthermore, extractive migration to the pellet...... surface at an elevated temperature played an important role. The second study presented a method of how key processing parameters can be estimated, based on a pellet model and a small number of fast and simple laboratory trials using a single pellet press. The third study investigated the bonding...

Morphology and stress at silicon-glass interface in anodic bonding

Energy Technology Data Exchange (ETDEWEB)

Tang, Jiali [Key Laboratory of Pressure Systems and Safety (MOE), School of Mechanical Engineering, East China University of Science and Technology, Shanghai 200237 (China); Cai, Cheng [State Key Laboratory of Chemical Engineering, East China University of Science and Technology, Shanghai (China); Ming, Xiaoxiang [Key Laboratory of Pressure Systems and Safety (MOE), School of Mechanical Engineering, East China University of Science and Technology, Shanghai 200237 (China); State Key Laboratory of Bioreactor Engineering, East China University of Science and Technology, Shanghai 200237 (China); State Key Laboratory of Chemical Engineering, East China University of Science and Technology, Shanghai (China); Yu, Xinhai, E-mail: yxhh@ecust.edu.cn [Key Laboratory of Pressure Systems and Safety (MOE), School of Mechanical Engineering, East China University of Science and Technology, Shanghai 200237 (China); State Key Laboratory of Bioreactor Engineering, East China University of Science and Technology, Shanghai 200237 (China); Zhao, Shuangliang, E-mail: szhao@ecust.edu.cn [State Key Laboratory of Chemical Engineering, East China University of Science and Technology, Shanghai (China); Tu, Shan-Tung [Key Laboratory of Pressure Systems and Safety (MOE), School of Mechanical Engineering, East China University of Science and Technology, Shanghai 200237 (China); Liu, Honglai [State Key Laboratory of Chemical Engineering, East China University of Science and Technology, Shanghai (China)

2016-11-30

Highlights: • Amorphous SiO{sub 2} is the most probable silica morphology generated in anodic bonding. • Amorphous SiO{sub 2} thickness at the interface is at least 2 nm for 90 min anodic bonding. • Silicon oxidation rate at the interface is 0.022 nm min{sup −1} from 30 to 90 min. - Abstract: The morphologies and structural details of formed silica at the interface of silicon-glass anodic bonding determine the stress at the interface but they have been rarely clarified. In this study, a miniaturized anodic bonding device was developed and coupled with a Raman spectrometer. The silicon-glass anodic bonding was carried out and the evolution of the stress at the bonding interface was measured in situ by a Raman spectrometer. In addition, large-scale atomistic simulations were conducted by considering the formed silica with different morphologies. The most conceivable silica morphology was identified as the corresponding silicon-glass interfacial stress presents qualitatively agreement with the experimental observation. It was found that amorphous SiO{sub 2} is the silica morphology generated in anodic bonding. The amorphous SiO{sub 2} thickness is at least 2 nm in the case of 90 min anodic bonding at 400 °C with the DC voltage of −1000 V. The combination of experimental and simulation results can ascertain the silicon oxidation reaction rate in anodic bonding process, and under the above-mentioned condition, the reaction rate was estimated as 0.022 nm min{sup −1} from 30 to 90 min.

Process and magnetic properties of cold pressed Ne Fe B bonded magnets

International Nuclear Information System (INIS)

Rodrigues, DAniel; Concilio, Gilberto Vicente; Landgraf, Fernando Jose Gomes; Zanchetta, Antonio Carlos

1996-01-01

Bonded magnets are polymer composites based on a mixture of a hard magnetic powder and a polymer. This mixture is processed as a traditional powder metallurgy material, cold pressed, or like a thermoplastic material, by injection molding. The polymeric phase to a large extent determines the mechanical properties of the composite, while magnetic powder determines its magnetic properties. They are less expensive and easier to produce, specially in the case of high complexity parts. This paper presents the relationship between process variables and magnetic properties of cold pressed Nd Fe B bonded magnets produced from melt spun flakes mixed with thermosetting resins. The experiments were done using Statistical Design of Experiments. The variables investigates were: uniaxial compaction pressure, binder type; binder content; size of Nd Fe B particles; addition of lubricant; and addition of small quantities of magnetic additives, particles of ferrites, iron, or alnico. (author)

48 CFR 53.301-25 - Performance Bond.

Science.gov (United States)

2010-10-01

... 48 Federal Acquisition Regulations System 2 2010-10-01 2010-10-01 false Performance Bond. 53.301-25 Section 53.301-25 Federal Acquisition Regulations System FEDERAL ACQUISITION REGULATION (CONTINUED) CLAUSES AND FORMS FORMS Illustrations of Forms 53.301-25 Performance Bond. ER18DE98.007 ER18DE98.008 [63...

Manufacture of thin-walled clad tubes by pressure welding of roll bonded sheets

Science.gov (United States)

Schmidt, Hans Christian; Grydin, Olexandr; Stolbchenko, Mykhailo; Homberg, Werner; Schaper, Mirko

2017-10-01

Clad tubes are commonly manufactured by fusion welding of roll bonded metal sheets or, mechanically, by hydroforming. In this work, a new approach towards the manufacture of thin-walled tubes with an outer diameter to wall thickness ratio of about 12 is investigated, involving the pressure welding of hot roll bonded aluminium-steel strips. By preparing non-welded edges during the roll bonding process, the strips can be zip-folded and (cold) pressure welded together. This process routine could be used to manufacture clad tubes in a continuous process. In order to investigate the process, sample tube sections with a wall thickness of 2.1 mm were manufactured by U-and O-bending from hot roll bonded aluminium-stainless steel strips. The forming and welding were carried out in a temperature range between RT and 400°C. It was found that, with the given geometry, a pressure weld is established at temperatures starting above 100°C. The tensile tests yield a maximum bond strength at 340°C. Micrograph images show a consistent weld of the aluminium layer over the whole tube section.

Processability analysis of candidate waste forms

International Nuclear Information System (INIS)

Gould, T.H. Jr.; Dunson, J.B. Jr.; Eisenberg, A.M.; Haight, H.G. Jr.; Mello, V.E.; Schuyler, R.L. III.

1982-01-01

A quantitative merit evaluation, or processability analysis, was performed to assess the relative difficulty of remote processing of Savannah River Plant high-level wastes for seven alternative waste form candidates. The reference borosilicate glass process was rated as the simplest, followed by FUETAP concrete, glass marbles in a lead matrix, high-silica glass, crystalline ceramics (SYNROC-D and tailored ceramics), and coated ceramic particles. Cost estimates for the borosilicate glass, high-silica glass, and ceramic waste form processing facilities are also reported

Nanograined Ti–Nb microalloy steel achieved by Accumulative Roll Bonding (ARB) process

International Nuclear Information System (INIS)

Tohidi, A.A.; Ketabchi, M.; Hasannia, A.

2013-01-01

Over the last decade, nanocrystalline and ultra-fine grained (UFG) materials with grain size less than 1 μm have aroused considerable interest due to their superior mechanical properties compared to conventionally grained materials. In this work Ti–Nb microalloy steel was processed by the severe plastic deformation (SPD) technique called Accumulative Roll Bonding (ARB) in order to produce an ultra-fine grained microstructure and improve the mechanical properties. After initial preparation to achieve good sheet bonding, 8 cycles of ARB at 550 °C were successfully performed. Observation of optical microstructure, scanning electron microscopy (SEM) micrographs, and X-Ray Diffraction (XRD) peak broadening analysis were used for the characterization of grain structure of the ARB processed sample. The mechanical attributes after rolling and cooling were examined. It was calculated that metal's yield and tensile strength increased by 334% and 215% respectively, while the ductility dropped from as-received value of 34% to 2.9%. Microhardness of the material was studied at room temperature. There was a continuous enhancement of hardness by increasing the pass number of the ARB process. At the 8th pass, the hardness values increased by 230%. The rolling process was stopped at 8th cycle when cracking of the edge became pronounced

The diffusion bonding of advanced material

International Nuclear Information System (INIS)

Khan, T.I.

2001-01-01

As a joining process diffusion bonding has been used since early periods, and artifacts have been found which date back to 3000 years. However, over the last 20 years this joining process has been rediscovered and research has been carried out to understand the mechanisms of the process, and the application of the technique to advanced materials. This paper will review some of the reasons to why diffusion bonding may be preferred over other more conventional welding processes to join advanced alloy systems. It also describes in brief the different types of bonding processes, namely, solid-state and liquid phase bonding techniques. The paper demonstrates the application of diffusion bonding processes to join a range of dissimilar materials for instance: oxide dispersion strengthened superalloys, titanium to duplex stainless steels and engineering ceramics such as Si/sub 3/N/sub 4/ to metal alloys. The research work highlights the success and limitations of the diffusion bonding process and is based on the experience of the author and his colleagues. (author)

Radial-rotation profile forming: A new processing technology of incremental sheet metal forming

Science.gov (United States)

Laue, Robert; Härtel, Sebastian; Awiszus, Birgit

2018-05-01

Incremental forming processes (i.e., spinning) of sheet metal blanks into cylindrical cups are suitable for lower lot sizes. The produced cups were frequently used as preforms to produce workpieces in further forming steps with additional functions like profiled hollow parts [1]. The incremental forming process radial-rotation profile forming has been developed to enable the production of profiled hollow parts with low sheet thinning and good geometrical accuracy. The two principal forming steps are the production of the preform by rotational swing-folding [2] and the subsequent radial profiling of the hollow part in one clamping position. The rotational swing-folding process is based on a combination of conventional spinning and swing-folding. Therefore, a round blank rotates on a profiled mandrel and due to the swinging of a cylindrical forming tool, the blank is formed to a cup with low sheet thinning. In addition, thickening results at the edge of the blank and wrinkling occurs. However, the wrinkles are formed into the indentation of the profiled mandrel and can be reshaped as an advantage in the second process step, the radial profiling. Due to the rotation and continuous radial feed of a profiled forming tool to the profiled mandrel, the axial profile is formed in the second process step. Because of the minor relative movement in axial direction between tool and blank, low sheet thinning occurs. This is an advantage of the principle of the process.

Effect of different glasses in glass bonded zeolite

International Nuclear Information System (INIS)

Lewis, M.A.; Ackerman, J.P.; Verma, S.

1995-01-01

A mineral waste form has been developed for chloride waste salt generated during the pyrochemical treatment of spent nuclear fuel. The waste form consists of salt-occluded zeolite powders bound within a glass matrix. The zeolite contains the salt and immobilizes the fission products. The zeolite powders are hot pressed to form a mechanically stable, durable glass bonded zeolite. Further development of glass bonded zeolite as a waste form requires an understanding of the interaction between the glass and the zeolite. Properties of the glass that enhance binding and durability of the glass bonded zeolite need to be identified. Three types of glass, boroaluminosilicate, soda-lime silicate, and high silica glasses, have a range of properties and are now being investigated. Each glass was hot pressed by itself and with an equal amount of zeolite. MCC-1 leach tests were run on both. Soda-lime silicate and high silica glasses did not give a durable glass bonded zeolite. Boroaluminosilicate glasses rich in alkaline earths did bind the zeolite and gave a durable glass bonded zeolite. Scanning electron micrographs suggest that the boroaluminosilicate glasses wetted the zeolite powders better than the other glasses. Development of the glass bonded zeolite as a waste form for chloride waste salt is continuing

Recent Advances in Adhesive Bonding - The Role of Biomolecules, Nanocompounds, and Bonding Strategies in Enhancing Resin Bonding to Dental Substrates.

Science.gov (United States)

Münchow, Eliseu A; Bottino, Marco C

2017-09-01

To present an overview on the main agents (i.e., biomolecules and nanocompounds) and/or strategies currently available to amplify or stabilize resin-dentin bonding. According to studies retrieved for full text reading (2014-2017), there are currently six major strategies available to overcome resin-dentin bond degradation: (i) use of collagen crosslinking agents, which may form stable covalent bonds with collagen fibrils, thus strengthening the hybrid layer; (ii) use of antioxidants, which may allow further polymerization reactions over time; (iii) use of protease inhibitors, which may inhibit or inactivate metalloproteinases; (iv) modification of the bonding procedure, which may be performed by using the ethanol wet-bonding technique or by applying an additional adhesive (hydrophobic) coating, thereby strengthening the hybrid layer; (v) laser treatment of the substrate prior to bonding, which may cause specific topographic changes in the surface of dental substrates, increasing bonding efficacy; and (vi) reinforcement of the resin matrix with inorganic fillers and/or remineralizing agents, which may positively enhance physico-mechanical properties of the hybrid layer. With the present review, we contributed to the better understanding of adhesion concepts and mechanisms of resin-dentin bond degradation, showing the current prospects available to solve that problematic. Also, adhesively-bonded restorations may be benefited by the use of some biomolecules, nanocompounds or alternative bonding strategies in order to minimize bond strength degradation.

Processing and Protection of Rare Earth Permanent Magnet Particulate for Bonded Magnet Applications

Energy Technology Data Exchange (ETDEWEB)

Sokolowski, Peter Kelly [Iowa State Univ., Ames, IA (United States)

2007-01-01

Rapid solidification of novel mixed rare earth-iron-boron, MRE₂Fe₁₄B (MRE = Nd, Y, Dy; currently), magnet alloys via high pressure gas atomization (HPGA) have produced similar properties and structures as closely related alloys produced by melt spinning (MS) at low wheel speeds. Recent additions of titanium carbide and zirconium to the permanent magnet (PM) alloy design in HPGA powder (using He atomization gas) have made it possible to achieve highly refined microstructures with magnetic properties approaching melt spun particulate at cooling rates of 10⁵-10⁶K/s. By producing HPGA powders with the desirable qualities of melt spun ribbon, the need for crushing ribbon was eliminated in bonded magnet fabrication. The spherical geometry of HPGA powders is more ideal for processing of bonded permanent magnets since higher loading fractions can be obtained during compression and injection molding. This increased volume loading of spherical PM powder can be predicted to yield a higher maximum energy product (BH)_max for bonded magnets in high performance applications. Passivation of RE-containing powder is warranted for the large-scale manufacturing of bonded magnets in applications with increased temperature and exposure to humidity. Irreversible magnetic losses due to oxidation and corrosion of particulates is a known drawback of RE-Fe-B based alloys during further processing, e.g. injection molding, as well as during use as a bonded magnet. To counteract these effects, a modified gas atomization chamber allowed for a novel approach to in situ passivation of solidified particle surfaces through injection of a reactive gas, nitrogen trifluoride (NF₃). The ability to control surface chemistry during atomization processing of fine spherical RE-Fe-B powders produced advantages over current processing methodologies. In particular, the capability to coat particles while 'in flight' may eliminate the

Fluxless Bonding Processes Using Silver-Indium System for High Temperature Electronics and Silver Flip-Chip Interconnect Technology

Science.gov (United States)

Wu, Yuan-Yun

In this dissertation, fluxless silver (Ag)-indium (In) binary system bonding and Ag solid-state bonding are used between different bonded pairs which have large thermal expansion coefficient (CTE) mismatch and flip-chip interconnect bonding application. In contrast to the conventional soldering process, fluxless bonding technique eliminates contamination and reliability problems caused by flux to fabricate high quality joints. There are two section are reported. In the first section, the reactions of Ag-In binary system are presented. In the second section, the high melting temperature, thermal and electrical conductivity joint materials bonding by either Ag-In binary system bonding or solid-state bonding processes for different bonded pairs and flip-chip application are designed, developed, and reported. Our group have studied Ag-In system for several years and developed the bonding processes successfully. However, the detailed reactions of Ag and In were seldom studied. To design a proper bonding structure, it is necessary to understand the reaction between Ag and In. The systematic experiments were performed to investigate these reactions. A 40 um Ag layer was electroplated on copper (Cu) substrates, followed by indium layers of 1, 3, 5, 10, and 15 um, respectively. The samples were annealed at 180 °C in 0.1 torr vacuum. For samples with In thickness less than 5 mum, the joint compositions are Ag2In only (1 um) or AgIn2, Ag2In, and Ag solid solution (Ag) after annealing. No indium is identified. For 10 and 15 um thick In samples, In covers almost over the entire sample surface after annealing. Later, an Ag layer was annealed at 450 °C for 3 hours to grow Ag grains, followed by plating 10 um In and annealing at 180 °C. By annealing Ag before plating In, more In is kept in the structure during annealing at 180 °C. Based on above results, for those designs with In thinner than 5 um, the Ag layer needs to be annealed, prior to In plating in order to make a

Titanium Insertion into CO Bonds in Anionic Ti-CO2 Complexes.

Science.gov (United States)

Dodson, Leah G; Thompson, Michael C; Weber, J Mathias

2018-03-22

We explore the structures of [Ti(CO 2 ) y ] - cluster anions using infrared photodissociation spectroscopy and quantum chemistry calculations. The existence of spectral signatures of metal carbonyl CO stretching modes shows that insertion of titanium atoms into C-O bonds represents an important reaction during the formation of these clusters. In addition to carbonyl groups, the infrared spectra show that the titanium center is coordinated to oxalato, carbonato, and oxo ligands, which form along with the metal carbonyls. The presence of a metal oxalato ligand promotes C-O bond insertion in these systems. These results highlight the affinity of titanium for C-O bond insertion processes.

Effect of Bonding Pressure and Bonding Time on the Tensile Properties of Cu-Foam / Cu-Plate Diffusion Bonded Joint

International Nuclear Information System (INIS)

Kim, Sang-Ho; Heo, Hoe-Jun; Kang, Chung-Yun; Yoon, Tae-Jin

2016-01-01

Open cell Cu foam, which has been widely utilized in various industries because of its high thermal conductivity, lightweight and large surface area, was successfully joined with Cu plate by diffusion bonding. To prevent excessive deformation of the Cu foam during bonding process, the bonding pressure should be lower than 500 kPa at 800 ℃ for 60 min and bonding pressure should be lowered with increasing holding time. The bonding strength was evaluated by tensile tests. The tensile load of joints increased with the bonding pressure and holding time. In the case of higher bonding pressure or time, the bonded length at the interface was usually longer than the cross-sectional length of the foam, so fracture occurred at the foam. For the same reason, base metal (foam) fracture mainly occurred at the node-plate junction rather than in the strut-plate junction because the bonded surface area of the node was relatively larger than that of the strut.

Development of an Indium Bump Bond Process for Silicon Pixel Detectors at PSI

CERN Document Server

Brönnimann, C; Gobrecht, J; Heising, S; Horisberger, M; Horisberger, R P; Kästli, H C; Lehmann, J; Rohe, T; Streuli, S; Broennimann, Ch.

2006-01-01

The hybrid pixel detectors used in the high energy physics experiments currently under construction use a three dimensional connection technique, the so-called bump bonding. As the pitch below 100um, required in these applications, cannot be fullfilled with standard industrial processes (e.g. the IBM C4 process), an in-house bump bond process using reflown indium bumps was developed at PSI as part of the R&D for the CMS-pixel detector. The bump deposition on the sensor is performed in two subsequent lift-off steps. As the first photolithographic step a thin under bump metalization (UBM) is sputtered onto bump pads. It is wettable by indium and defines the diameter of the bump. The indium is evaporated via a second photolithographic step with larger openings and is reflown afterwards. The height of the balls is defined by the volume of the indium. On the readout chip only one photolithographic step is carried out to deposit the UBM and a thin indium layer for better adhesion. After mating both parts a seco...

Low-temperature bonding process for the fabrication of hybrid glass-membrane organ-on-a-chip devices

Science.gov (United States)

Pocock, Kyall J.; Gao, Xiaofang; Wang, Chenxi; Priest, Craig; Prestidge, Clive A.; Mawatari, Kazuma; Kitamori, Takehiko; Thierry, Benjamin

2016-10-01

The integration of microfluidics with living biological systems has paved the way to the exciting concept of "organs-on-a-chip," which aims at the development of advanced in vitro models that replicate the key features of human organs. Glass-based devices have long been utilized in the field of microfluidics but the integration of alternative functional elements within multilayered glass microdevices, such as polymeric membranes, remains a challenge. To this end, we have extended a previously reported approach for the low-temperature bonding of glass devices that enables the integration of a functional polycarbonate porous membrane. The process was initially developed and optimized on specialty low-temperature bonding equipment (μTAS2001, Bondtech, Japan) and subsequently adapted to more widely accessible hot embosser units (EVG520HE Hot Embosser, EVG, Austria). The key aspect of this method is the use of low temperatures compatible with polymeric membranes. Compared to borosilicate glass bonding (650°C) and quartz/fused silica bonding (1050°C) processes, this method maintains the integrity and functionality of the membrane (Tg 150°C for polycarbonate). Leak tests performed showed no damage or loss of integrity of the membrane for up to 150 h, indicating sufficient bond strength for long-term cell culture. A feasibility study confirmed the growth of dense and functional monolayers of Caco-2 cells within 5 days.

Cerium, uranium, and plutonium behavior in glass-bonded sodalite, a ceramic nuclear waste form

International Nuclear Information System (INIS)

Lewis, M. A.; Lexa, D.; Morss, L. R.; Richmann, M. K.

1999-01-01

Glass-bonded sodalite is being developed as a ceramic waste form (CWF) to immobilize radioactive fission products, actinides, and salt residues from electrometallurgical treatment of spent nuclear reactor fuel. The CWF consists of about 75 mass % sodalite, 25 mass % glass, and small amounts of other phases. This paper presents some results and interpretation of physical measurements to characterize the CWF structure, and dissolution tests to measure the release of matrix components and radionuclides from the waste form. Tests have been carried out with specimens of the CWF that contain rare earths at concentrations similar to those expected in the waste form. Parallel tests have been carried out on specimens that have uranium or plutonium as well as the rare earths at concentrations similar to those expected in the waste forms; in these specimens UCl 3 forms UO 2 and PuCl 3 forms PuO 2 . The normalized releases of rare earths in dissolution tests were found to be much lower than those of matrix elements (B, Si, Al, Na). When there is no uranium in the CWF, the release of cerium is two to ten times lower than the release of the other rare earths. The low release of cerium may be due to its tetravalent state in uranium-free CWF. However, when there is uranium in the CWF, the release of cerium is similar to that of the other rare earths. This trivalent behavior of cerium is attributed to charge transfer or covalent interactions among cerium, uranium, and oxygen in (U,Ce)O 2

Influence of Laser Activated Irrigation with Erbium Lasers on Bond Strength of Inidividually Formed Fiber Reinforced Composite Posts to Root Canal Dentin

Directory of Open Access Journals (Sweden)

Ivana Miletić

2016-01-01

Full Text Available Objective: The aim of this in vitro study was to investigate the effect of laser activated irrigation (LAI using two erbium lasers on bond strength of individually formed fiber-reinforced composite (FRC posts to root canal dentin. Materials and methods: Twenty-seven single-rooted human teeth were endodontically treated and after post space preparation divided into three groups (n=9 per group, according to the pre-treatment of post space preparation: 1 Conventional syringe irrigation (CSI and saline; 2 Er.YAG photon-induced photoacoustic streaming (PIPS technique and saline; 3 Er,Cr:YSGG activated irrigation with RFT2 tip. Two specimens from each group were used for SEM analysis. The remaining specimens (n=7 per group received individually formed FRC post, everStick POST, luted with self-adhesive cement, G-CEM LinkAce. After cementation, the roots were perpendicularly sectioned into 1 mm thin sections and a push-out test was carried out (0.5 mm/min. The data were calculated as megapascals and were log transformed and statistically analysed using one-way ANOVA at the level of significance set at 5%. Results: In the control group, the smear layer was still present. In the Er:YAG group, the smear layer was removed. In the Er,Cr:YSGG group, the smear layer was partially removed. The Er,Cr:YSGG group achieved the highest bond strength values, followed by the control group and then the Er:YAG group, but no statistically significant difference was found in bond strength values in the tested group of post space pretreatment (p=0.564. Conclusions: LAI using two erbium lasers, with PIPS or RFT2 tip, did not affect the bond strength of individually formed FRC posts to root canal dentin.

Comparison of the effect of hydrogel and solution forms of sodium ascorbate on orthodontic bracket-enamel shear bond strength immediately after bleaching: An in vitro study

Directory of Open Access Journals (Sweden)

Kimyai Soodabeh

2010-01-01

Full Text Available Aim: This study compared the effects of hydrogel and solution forms of sodium ascorbate (SA with two different application times on bracket bond strength subsequent to bleaching. Materials and Methods: A total of 72 sound premolars were randomly divided into six groups (n = 12: An unbleached control group (group one and five experimental groups of carbamide peroxide. Specimens in group two were bonded immediately after bleaching; specimens in groups three and four were bleached, then treated with SA solution for ten minutes and three hours, respectively, and then bonded. In groups five and six, SA hydrogel was used and the specimens were prepared similar to groups three and four, respectively. Following debonding, bond strengths were recorded in MPa. To evaluate the amount of resin left on the enamel surfaces, adhesive remnant index (ARI scores were used. Statistical Analysis: The bond strength data were analyzed with ANOVA and pairwise comparisons were made by Tukey test. The ARI data were subjected to Kruskal-Wallis test and two-by-two comparisons were made by the Mann-Whitney U test. Results: There were significant differences in bond strengths between the groups ( P < 0.0005. However, the differences between groups three, four, five and six were not significant. Furthermore, there were no significant differences between group one and groups four and six, whereas the differences between the other groups were significant ( P < 0.05. Regarding ARI, there were significant differences among the groups ( P = 0.004. Conclusion: Bleaching significantly decreased the bracket bond strength. Compromised bonding was reversed with a three-hour application of both forms of SA.

Direct, CMOS In-Line Process Flow Compatible, Sub 100 °C Cu-Cu Thermocompression Bonding Using Stress Engineering

Science.gov (United States)

Panigrahi, Asisa Kumar; Ghosh, Tamal; Kumar, C. Hemanth; Singh, Shiv Govind; Vanjari, Siva Rama Krishna

2018-03-01

Diffusion of atoms across the boundary between two bonding layers is the key for achieving excellent thermocompression Wafer on Wafer bonding. In this paper, we demonstrate a novel mechanism to increase the diffusion across the bonding interface and also shows the CMOS in-line process flow compatible Sub 100 °C Cu-Cu bonding which is devoid of Cu surface treatment prior to bonding. The stress in sputtered Cu thin films was engineered by adjusting the Argon in-let pressure in such a way that one film had a compressive stress while the other film had tensile stress. Due to this stress gradient, a nominal pressure (2 kN) and temperature (75 °C) was enough to achieve a good quality thermocompression bonding having a bond strength of 149 MPa and very low specific contact resistance of 1.5 × 10-8 Ω-cm2. These excellent mechanical and electrical properties are resultant of a high quality Cu-Cu bonding having grain growth between the Cu films across the boundary and extended throughout the bonded region as revealed by Cross-sectional Transmission Electron Microscopy. In addition, reliability assessment of Cu-Cu bonding with stress engineering was demonstrated using multiple current stressing and temperature cycling test, suggests excellent reliable bonding without electrical performance degradation.

Direct, CMOS In-Line Process Flow Compatible, Sub 100 °C Cu-Cu Thermocompression Bonding Using Stress Engineering

Science.gov (United States)

Panigrahi, Asisa Kumar; Ghosh, Tamal; Kumar, C. Hemanth; Singh, Shiv Govind; Vanjari, Siva Rama Krishna

2018-05-01

Diffusion of atoms across the boundary between two bonding layers is the key for achieving excellent thermocompression Wafer on Wafer bonding. In this paper, we demonstrate a novel mechanism to increase the diffusion across the bonding interface and also shows the CMOS in-line process flow compatible Sub 100 °C Cu-Cu bonding which is devoid of Cu surface treatment prior to bonding. The stress in sputtered Cu thin films was engineered by adjusting the Argon in-let pressure in such a way that one film had a compressive stress while the other film had tensile stress. Due to this stress gradient, a nominal pressure (2 kN) and temperature (75 °C) was enough to achieve a good quality thermocompression bonding having a bond strength of 149 MPa and very low specific contact resistance of 1.5 × 10-8 Ω-cm2. These excellent mechanical and electrical properties are resultant of a high quality Cu-Cu bonding having grain growth between the Cu films across the boundary and extended throughout the bonded region as revealed by Cross-sectional Transmission Electron Microscopy. In addition, reliability assessment of Cu-Cu bonding with stress engineering was demonstrated using multiple current stressing and temperature cycling test, suggests excellent reliable bonding without electrical performance degradation.

Organometallic Methods for Forming and Cleaving Carbon-Carbon Bonds

DEFF Research Database (Denmark)

Christensen, Stig Holden

with concomitant C-C bond formation was studied with a number of Grignard reagents. The transformation was performed in a sealed vial by heating to about 160 °C in an aluminum block or at 180 °C in a microwave oven. Good yields of the product alcohols were obtained with allyl- and benzylmagnesium halides when...

Influence of chemical bonding of chlorides with aluminates in cement hidratation process on corrosion steel bars in concrete

Directory of Open Access Journals (Sweden)

Bikić Farzet H.

2010-01-01

Full Text Available The presence of chlorides in concrete is a permanent subject of research because they cause corrosion of steel bars. Chlorides added to the concrete during preparation, as accelerators of the bonding of cement minerals process, enter into reaction with aluminates, creating a phase known as chloroaluminate hydrates. In everyday conditions the product of chemical bonding between chlorides and aluminates is usually monochloridealuminate C3A·CaCl2·Hx, better known as Friedel's salt. In this paper, the influence of chemical bonding of chlorides with aluminates during the process of cement hydration on corrosion of steel bars in concrete was investigated. The process of chlorides bonding with aluminates yielding monochloride aluminate is monitored by XRD analyses. It was found that the amount of chlorides bonding with aluminates increases with an increase of temperature, and as a result, reduces the amount of 'free' chlorides in concrete. Potentiodynamic measurements have shown that increase in temperature of the heat treatment of working electrodes by chlorides leads to a reduction of steel bars corrosion as a result of either the increase of the monochloride-aluminate content or the decrease of free chlorides amount. Chlorides bound in chloroaluminate hydrates do not cause activation of steel bars corrosion in concrete. It was also proven that the increase of free chlorides concentration in the concrete leads to intensification of steel bars corrosion. This additionally approves that free chlorides are only the activators of process of steel bars corrosion in the concrete.

Experiment and simulation analysis of roll-bonded Q235 steel plate

International Nuclear Information System (INIS)

Zhao, G.; Huang, Q.; Zhou, C.; Zhang, Z.; Ma, L.; Wang, X.

2016-01-01

Heavy-gauge Q235 steel plate was roll bonded, and the process was simulated using MARC software. Ultrasonic testing results revealed the presence of cracks and lamination defects in an 80-mm clad steel sheet, especially at the head and tail of the steel plate. There were non-uniform ferrite + pearlite microstructures and unbound areas at a bond interface. Through scanning electron microscopy analysis, long cracks and additional inclusions in the cracks were observed at the interface. A fracture analysis revealed non-uniform inclusions that pervaded the interface. Moreover, MARC simulations demonstrated that there was little equivalent strain at the centre of the slab during the first rolling pass. The equivalent centre increased to 0.5 by the fourth rolling pass. Prior to the final pass, the equivalent strain was not consistent across the thickness direction, preventing bonding interfaces from forming consistent deformation and decreasing the residual stress. The initial rolling reduction rate should not be very small (e.g. 5%) as it is averse to the coordination of rolling deformation. Such rolling processes are averse to the rolling bond. (Author)

Controlling the electrical properties of ZnO films by forming zinc and oxide bridges by a plasma and electron-assisted process

Directory of Open Access Journals (Sweden)

Norihiro Shimoi

2012-06-01

Full Text Available A new method to produce electrically steady ZnO films without any heating process has been developed by using plasma and electron beams to facilitate bonding between the metallic component and the oxygen on coated ZnO films. Both plasma atmosphere and electron beams can function as sources of nonequilibrium bonding energy, forming bridges between the zinc present in the zinc complex and the oxygen in the ZnO particles to construct a zinc-oxide thin film. Our results confirm that it is possible to achieve low conductive characteristics by controlling the acceleration voltage of electrons used to irradiate the ZnO coating. The electrically steady films fabricated have various potential applications, being particularly well-suited to electrical devices on a plastic medium.

Controlling the electrical properties of ZnO films by forming zinc and oxide bridges by a plasma and electron-assisted process

Energy Technology Data Exchange (ETDEWEB)

Shimoi, Norihiro; Tanaka, Yasumitsu [Graduate School of Environmental Studies, Tohoku University, 6-6-20 Aoba, Aramaki, Aoba-ku, Sendai 980-8579 (Japan); Harada, Takamitsu [Sendai Technology Center, Consumer-Professional and Devices Group, Sony Corporation, 3-4-1 Sakuragi, Tagajo 985-0842 (Japan); Tanaka, Shun-ichiro [Institute of Multidisciplinary Research for Advanced Materials, Tohoku University, 2-1-1 Katahira, Aoba-ku, Sendai 980-8577 (Japan)

2012-06-15

A new method to produce electrically steady ZnO films without any heating process has been developed by using plasma and electron beams to facilitate bonding between the metallic component and the oxygen on coated ZnO films. Both plasma atmosphere and electron beams can function as sources of nonequilibrium bonding energy, forming bridges between the zinc present in the zinc complex and the oxygen in the ZnO particles to construct a zinc-oxide thin film. Our results confirm that it is possible to achieve low conductive characteristics by controlling the acceleration voltage of electrons used to irradiate the ZnO coating. The electrically steady films fabricated have various potential applications, being particularly well-suited to electrical devices on a plastic medium.

Method to improve commercial bonded SOI material

Science.gov (United States)

Maris, Humphrey John; Sadana, Devendra Kumar

2000-07-11

A method of improving the bonding characteristics of a previously bonded silicon on insulator (SOI) structure is provided. The improvement in the bonding characteristics is achieved in the present invention by, optionally, forming an oxide cap layer on the silicon surface of the bonded SOI structure and then annealing either the uncapped or oxide capped structure in a slightly oxidizing ambient at temperatures greater than 1200.degree. C. Also provided herein is a method for detecting the bonding characteristics of previously bonded SOI structures. According to this aspect of the present invention, a pico-second laser pulse technique is employed to determine the bonding imperfections of previously bonded SOI structures.

Manufacturing study of beryllium bonded structures

International Nuclear Information System (INIS)

Onozuka, M.; Hirai, S.; Kikuchi, K.; Oda, Y.; Shimizu, K.

2004-01-01

Manufacturing study has been conducted on Be-bonded structures employed in the first-wall panel of the blanket system for the ITER. For Be tiles bonded to the Cu-Cr-Zr alloy heat sink with stainless-steel cooling pipes, a one-axis hot press with two heating process has been used to bond the three materials. First, Cu-alloy and SS materials are bonded diffusively. Then, Be tiles are bonded to the pre-bonded structure under 20 MPa and at 560 degree C. An Al-Si base interlayer has been used to bond Be to the Cu-Alloy. Because of the limited heat processes using a conventional hot press, the manufacturing cost can be minimized. Using the above bonding techniques, a partial mockup of a blanket first-wall panel with 16 Be tiles (with 50 mm in size) has been successfully manufactured. (author)

Microstructure and properties of hot roll bonding layer of dissimilar metals. 2. Bonding interface microstructure of Zr/stainless steel by hot roll bonding and its controlling

International Nuclear Information System (INIS)

Yasuyama, Masanori; Ogawa, Kazuhiro; Taka, Takao; Nakasuji, Kazuyuki; Nakao, Yoshikuni; Nishimoto, Kazutoshi.

1996-01-01

The hot roll bonding of zirconium and stainless steel inserted with tantalium was investigated using the newly developed rolling mill. The effect of hot rolling temperatures of zirconium/stainless steel joints on bonding interface structure was evaluated. Intermetallic compound layer containing cracks was observed at the bonding interface between stainless steel and tantalium when the rolling temperature was above 1373K. The hardness of the bonding layer of zirconium and tantalium bonded above 1273K was higher than tantalium or zirconium base metal in spite of absence of intermetallic compound. The growth of reaction layer at the stainless steel and tantalium interface and at the tantalium and zirconium interface was conforming a parabolic low when that was isothermally heated after hot roll bonding, and the growth rate was almost same as that of static diffusion bonding without using hot roll bonding process. It is estimated that the strain caused by hot roll bonding gives no effect on the growth of reaction layer. It was confirmed that the dissimilar joint of zirconium and stainless steel with insert of tantalium having the sound bonding interface were obtained at the suitable bonding temperature of 1173K by the usage of the newly developed hot roll bonding process. (author)

Dynamics of Plug Formation in a Circular Cylinder Under Low Bond Number Conditions: Experiment and Simulation

Science.gov (United States)

Hallaby, Ghazi; Kizito, John P.

2016-08-01

The goal of the current study is to investigate the dynamics of two phase interface under a low Bond number condition. Silicone oil is injected into a cylinder under a Bond number of about 0.47 via a side tube forming a T-junction with the former. The time evolution of the interface of silicon oil in a cylinder is captured using a high speed camera. The volume at which the plug is formed is then determined using an image processing tool to analyze the captured images. A numerical simulation is carried out where fluid is injected into a cylinder, under a less than unity Bond number condition, via a side tube. Numerical and experimental results are then compared.

Controlling the Sn-C bonds content in SnO2@CNTs composite to form in situ pulverized structure for enhanced electrochemical kinetics.

Science.gov (United States)

Cheng, Yayi; Huang, Jianfeng; Qi, Hui; Cao, Liyun; Luo, Xiaomin; Li, Jiayin; Xu, Zhanwei; Yang, Jun

2017-12-07

The Sn-C bonding content between the SnO 2 and CNTs interface was controlled by the hydrothermal method and subsequent heat treatment. Electrochemical analysis found that the SnO 2 @CNTs with high Sn-C bonding content exhibited much higher capacity contribution from alloying and conversion reaction compared with the low content of Sn-C bonding even after 200 cycles. The high Sn-C bonding content enabled the SnO 2 nanoparticles to stabilize on the CNTs surface, realizing an in situ pulverization process of SnO 2 . The in situ pulverized structure was beneficial to maintain the close electrochemical contact of the working electrode during the long-term cycling and provide ultrafast transfer paths for lithium ions and electrons, which promoted the alloying and conversion reaction kinetics greatly. Therefore, the SnO 2 @CNTs composite with high Sn-C bonding content displayed highly reversible alloying and conversion reaction. It is believed that the composite could be used as a reference for design chemically bonded metal oxide/carbon composite anode materials in lithium-ion batteries.

Spring-back of flexible roll forming bending process

International Nuclear Information System (INIS)

Zhang, Y; Kim, D H; Jung, D W

2015-01-01

Simulations are now widely used in the field of roll forming because of their convenience. Simulations provide a low cost, secure and fast analysis tool. Flexible roll forming provides the desired shapes with a one time forming process. For roll forming, the velocity of the sheet and friction are important factors to attain an ideal shape. Because it is a complicated process, simulations provide a better understanding of the roll forming process. Simulations were peformed using ABAQUS software linked to elastic-plastic modules which we developed taking into account of interactions between these fields [1]. The application of this method makes it possible to highlight the strain-stress and mechanical behaviour laws and the spring-back. Thus, the flexible roll forming and bending process can be well described by the simulation software and guide the actual machine. (paper)

Single-crystal micromachining using multiple fusion-bonded layers

Science.gov (United States)

Brown, Alan; O'Neill, Garry; Blackstone, Scott C.

2000-08-01

Multi-layer structures have been fabricated using Fusion bonding. The paper shows void free layers of between 2 and 100 microns that have been bonded to form multi-layer structures. Silicon layers have been bonded both with and without interfacial oxide layers.

The influence of multiscale heterogeneity on recrystallization in nickel processed by accumulative roll bonding

DEFF Research Database (Denmark)

Mishin, Oleg; Zhang, Yubin; Godfrey, A.

2017-01-01

Microscopic and sample-scale heterogeneities have been characterized in nickel processed by accumulative roll bonding (ARB) to a von Mises strain of 4.8, and their influence on recrystallization have been analyzed. The microscopic deformation heterogeneities in this material are mostly associated...

Numerical investigations on the rebound phenomena and the bonding mechanisms in cold spray processes

Science.gov (United States)

Viscusi, A.

2018-05-01

Cold spray technology is a relatively new additive process allowing to create high quality metallic coatings, on both metallic and non-metallic substrates, without extensive heating of the powders sprayed. Upon impact with a target surface, conversion of kinetic energy to plastic deformation occurs, the solid particles deform and bond together. The actual bonding mechanism for cold spray particles is still not well understood, a high number of works has been carried out during the past two decades, several theories have been proposed to explain the adhesion/rebound mechanisms making the system ineffective for industrial applications. Therefore, the aim of this research activity is to better explain the complex adhesion/rebound phenomena into cold spray impact processes through numerical simulations; for this purpose, on the base of simplified hypothesis and results found in literature, an original 3D Finite Element Method (FEM) model of an aluminium particle impacting on an aluminium substrate was proposed. A cohesive behaviour algorithm was implemented in the particle-substrate contact regions aiming to simulate the bonding between the impacting particle and the substrate under specific working conditions. A rebound coefficient was also defined representing the particle residual energy. Different simulations were performed using a range of impact velocities and varying the interfacial cohesive strength. It was shown that at low impact velocities the rebound phenomenon is governed by the elastic energy stored in the system, meanwhile at high impact velocities, the rebound phenomenon is mainly due to the strain rate effects making the system mechanically stronger; therefore, a specific range of bonding velocities depending on substrate-particle contact area were found.

Diffusion bonding in compact heat exchangers

International Nuclear Information System (INIS)

Southall, David

2009-01-01

Heatric's diffusion bonding process is a solid-state joining technology that produces strong, compact, all-metal heat exchanger cores. Diffusion bonding allows for a large quantity of joints to be made in geometries that would normally be inaccessible for conventional welding techniques. Since Heatric's diffusion bonding process uses no interlayer or braze alloy, the resulting heat exchanger core has consistent chemistry throughout and, under carefully controlled conditions, a return to parent metal strength can be reached. This paper will provide an overview of the diffusion bonding process and its origins, and also its application to compact heat exchanger construction. The paper will then discuss recent work that has been done to compare mechanical properties of Heatric's diffusion bonded material with material that has been conventionally welded, as well as with material tested in the as-received condition. (author)

Energetics and chemical bonding of the 1,3,5-tridehydrobenzene triradical and its protonated form

International Nuclear Information System (INIS)

Hue Minh Thi Nguyen; Hoeltzl, Tibor; Gopakumar, G.; Veszpremi, Tamas; Peeters, Jozef; Minh Tho Nguyen

2005-01-01

Quantum chemical calculations were applied to investigate the electronic structure of the parent 1,3,5-tridehydrobenzene triradical (C 6 H 3 , TDB) and its anion (C 6 H 3 - ), cation (C 6 H 3 + ) and protonated form (C 6 H 4 + ). Our results obtained using the state-averaged complete active space self-consistent-field (CASSCF) followed by second-order multi-state multi-configuration perturbation theory, MS-CASPT2, and MRMP2 in conjunction with the large ANO-L and 6-311++G(3df,2p) basis set, confirm and reveal the followings: (i) TDB has a doublet 2 A 1 ground state with a 4 B 2 - 2 A 1 energy gap of 29kcal/mol, (ii) the ground state of the C 6 H 3 - anion in the triplet 3 B 2 being 4kcal/mol below the 1 A 1 state. (iii) the electron affinity (EA), ionization energy (IE) and proton affinity (PA) are computed to be: EA=1.6eV, IE=7.2eV, PA=227kcal/mol using UB3LYP/6-311++G(3df,2p)+ZPE; standard heat of formation ΔH f(298K,1atm) (TDB)=179+/-2kcal/mol was calculated with CBS-QB3 method. An atoms-in-molecules (AIM) analysis of the structure reveals that the topology of the electron density is similar in all compounds: hydrogens connect to a six-membered ring, except for the case of the 2 A 2 state of C 6 H 4 + (MBZ + ) which is bicyclic with fused five- and three-membered rings. Properties of the chemical bonds were characterized with Electron Localization Function (ELF) analysis, as well as Wiberg indices, Laplacian and spin density maps. We found that the radicals form separate monosynaptic basins on the ELF space, however its pair character remains high. In the 2 A 1 state of TDB, the radical center is mainly localized on the C1 atom, while in the 2 B 2 state it is equally distributed between the C3 and C5 atoms and, due to the symmetry, in the 4 B 2 state the C1, C2 and C3 atoms have the same radical character. There is no C3-C5 bond in the 2 A 1 state of TDB, but the interaction between these atoms is strong. The ground state of cation C 6 H 3 + (DHP), 1 A 1 , is

A full-wafer fabrication process for glass microfluidic chips with integrated electroplated electrodes by direct bonding of dry film resist

International Nuclear Information System (INIS)

Vulto, Paul; Urban, G A; Huesgen, Till; Albrecht, Björn

2009-01-01

A full-wafer process is presented for fast and simple fabrication of glass microfluidic chips with integrated electroplated electrodes. The process employs the permanent dry film resist (DFR) Ordyl SY300 to create microfluidic channels, followed by electroplating of silver and subsequent chlorination. The dry film resist is bonded directly to a second substrate, without intermediate gluing layers, only by applying pressure and moderate heating. The process of microfluidic channel fabrication, electroplating and wafer bonding can be completed within 1 day, thus making it one of the fastest and simplest full-wafer fabrication processes. (note)

Methyl group dynamics in paracetamol and acetanilide: probing the static properties of intermolecular hydrogen bonds formed by peptide groups

Science.gov (United States)

Johnson, M. R.; Prager, M.; Grimm, H.; Neumann, M. A.; Kearley, G. J.; Wilson, C. C.

1999-06-01

Measurements of tunnelling and librational excitations for the methyl group in paracetamol and tunnelling excitations for the methyl group in acetanilide are reported. In both cases, results are compared with molecular mechanics calculations, based on the measured low temperature crystal structures, which follow an established recipe. Agreement between calculated and measured methyl group observables is not as good as expected and this is attributed to the presence of comprehensive hydrogen bond networks formed by the peptide groups. Good agreement is obtained with a periodic quantum chemistry calculation which uses density functional methods, these calculations confirming the validity of the one-dimensional rotational model used and the crystal structures. A correction to the Coulomb contribution to the rotational potential in the established recipe using semi-emipircal quantum chemistry methods, which accommodates the modified charge distribution due to the hydrogen bonds, is investigated.

Data-based control of a multi-step forming process

Science.gov (United States)

Schulte, R.; Frey, P.; Hildenbrand, P.; Vogel, M.; Betz, C.; Lechner, M.; Merklein, M.

2017-09-01

The fourth industrial revolution represents a new stage in the organization and management of the entire value chain. However, concerning the field of forming technology, the fourth industrial revolution has only arrived gradually until now. In order to make a valuable contribution to the digital factory the controlling of a multistage forming process was investigated. Within the framework of the investigation, an abstracted and transferable model is used to outline which data have to be collected, how an interface between the different forming machines can be designed tangible and which control tasks must be fulfilled. The goal of this investigation was to control the subsequent process step based on the data recorded in the first step. The investigated process chain links various metal forming processes, which are typical elements of a multi-step forming process. Data recorded in the first step of the process chain is analyzed and processed for an improved process control of the subsequent process. On the basis of the gained scientific knowledge, it is possible to make forming operations more robust and at the same time more flexible, and thus create the fundament for linking various production processes in an efficient way.

Effects of Surface Treatment Processes of SiC Ceramic on Interfacial Bonding Property of SiC-AFRP

Directory of Open Access Journals (Sweden)

WEI Ru-bin

2016-12-01

Full Text Available To improve the interfacial bonding properties of SiC-aramid fiber reinforced polymer matrix composites (SiC-AFRP, the influences of etching process of SiC ceramic, coupling treatment process, and the adhesives types on the interfacial peel strength of SiC-AFRP were studied. The results show that the surface etching process and coupling treatment process of silicon carbide ceramic can effectively enhance interfacial bonding property of the SiC-AFRP. After soaked the ceramic in K3Fe(CN6 and KOH mixed etching solution for 2 hours, and coupled with vinyl triethoxy silane coupling agent, the interfacial peel strength of the SiC-AFRP significantly increases from 0.45kN/m to 2.20kN/m. EVA hot melt film with mass fraction of 15%VA is ideal for interface adhesive.

Spectroscopic Identification of the Au-C Bond Formation upon Electroreduction of an Aryl Diazonium Salt on Gold.

Science.gov (United States)

Guo, Limin; Ma, Lipo; Zhang, Yelong; Cheng, Xun; Xu, Ye; Wang, Jin; Wang, Erkang; Peng, Zhangquan

2016-11-08

Electroreduction of aryl diazonium salts on gold can produce organic films that are more robust than their analogous self-assembled monolayers formed from chemical adsorption of organic thiols on gold. However, whether the enhanced stability is due to the Au-C bond formation remains debated. In this work, we report the electroreduction of an aryl diazonium salt of 4,4'-disulfanediyldibenzenediazonium on gold forming a multilayer of Au-(Ar-S-S-Ar) n , which can be further degraded to a monolayer of Au-Ar-S - by electrochemical cleavage of the S-S moieties within the multilayer. By conducting an in situ surface-enhanced Raman spectroscopic study of both the multilayer formation/degradation and the monolayer reduction/oxidation processes, coupled to density functional theory calculations, we provide compelling evidence that an Au-C bond does form upon electroreduction of aryl diazonium salts on gold and that the enhanced stability of the electrografted organic films is due to the Au-C bond being intrinsically stronger than the Au-S bond for a given phenylthiolate compound by ca. 0.4 eV.

Imulation of polymer forming processes - addressing industrial needs

International Nuclear Information System (INIS)

Thibault, F.; DiRaddo, R.

2011-01-01

The objective of this paper is to present the development of simulation and design optimization capabilities, for polymer forming processes, in the context of addressing industrial needs. Accomplishments generated from close to twenty years of research in this field, at the National Research Council (NRC), are presented. Polymer forming processes such as extrusion blow moulding, stretch blow moulding and thermoforming have been the focus of the work, yet the research is extendable to similar polymer forming operations such as micro-blow moulding, sheet blow moulding and composites stamping. The research considers material models, process sequence integration and design optimization, derivative processes and 3D finite elements with multi-body contact.

Reaction sintering of a clay-containing silicon nitride bonded silicon carbide refractory

International Nuclear Information System (INIS)

Swenser, S.P.; Cheng, Y.B.

1998-01-01

Aspects of the reaction sequence for the reaction bonding of a cast refractory, which in the green state was composed of 79 wt-% SiC grit, 16 wt-% Si powder and 5 wt-% clay were established. As it was fired up to 1600 deg C in flowing N 2 (g), weight gains were noted and phase evolution was monitored by X-ray diffraction. However, details of the reaction sequence were not determined directly from this material because several reaction-bonding processes occurred simultaneously. Reaction features were ascertained by contrasting the weight changes and phase evolution in the refractory with those observed during reaction-bonding of (a) Si and clay without the SiC and (b) SiC and clay without the Si. In addition to silicon nitridation and the development of sialon phases by silicothermal and carbothermal reduction-nitridation processes, indirect evidence suggested that α-Si 3 N 4 formed by the carbothermal reduction-nitridation (CRN) of SiO(g). Copyright (1998) Australasian Ceramic Society

"Vibrational bonding": a new type of chemical bond is discovered.

Science.gov (United States)

Rhodes, Christopher J; Macrae, Roderick M

2015-01-01

A long-sought but elusive new type of chemical bond, occurring on a minimum-free, purely repulsive potential energy surface, has recently been convincingly shown to be possible on the basis of high-level quantum-chemical calculations. This type of bond, termed a vibrational bond, forms because the total energy, including the dynamical energy of the nuclei, is lower than the total energy of the dissociated products, including their vibrational zero-point energy. For this to be the case, the ZPE of the product molecule must be very high, which is ensured by replacing a conventional hydrogen atom with its light isotope muonium (Mu, mass = 1/9 u) in the system Br-H-Br, a natural transition state in the reaction between Br and HBr. A paramagnetic species observed in the reaction Mu +Br2 has been proposed as a first experimental sighting of this species, but definitive identification remains challenging.

Iterative solvers in forming process simulations

NARCIS (Netherlands)

van den Boogaard, Antonius H.; Rietman, Bert; Huetink, Han

1998-01-01

The use of iterative solvers in implicit forming process simulations is studied. The time and memory requirements are compared with direct solvers and assessed in relation with the rest of the Newton-Raphson iteration process. It is shown that conjugate gradient{like solvers with a proper

Supra-molecular hydrogen-bonding patterns in the N(9)-H protonated and N(7)-H tautomeric form of an N(6) -benzoyl-adenine salt: N (6)-benzoyl-adeninium nitrate.

Science.gov (United States)

Karthikeyan, Ammasai; Jeeva Jasmine, Nithianantham; Thomas Muthiah, Packianathan; Perdih, Franc

2016-02-01

In the title molecular salt, C12H10N5O(+)·NO3 (-), the adenine unit has an N (9)-protonated N(7)-H tautomeric form with non-protonated N(1) and N(3) atoms. The dihedral angle between the adenine ring system and the phenyl ring is 51.10 (10)°. The typical intra-molecular N(7)-H⋯O hydrogen bond with an S(7) graph-set motif is also present. The benzoyl-adeninium cations also form base pairs through N-H⋯O and C-H⋯N hydrogen bonds involving the Watson-Crick face of the adenine ring and the C and O atoms of the benzoyl ring of an adjacent cation, forming a supra-molecular ribbon with R 2 (2)(9) rings. Benzoyl-adeninum cations are also bridged by one of the oxygen atoms of the nitrate anion, which acts as a double acceptor, forming a pair of N-H⋯O hydrogen bonds to generate a second ribbon motif. These ribbons together with π-π stacking inter-actions between the phenyl ring and the five- and six-membered adenine rings of adjacent mol-ecules generate a three-dimensional supra-molecular architecture.

Zinc and resin bonded NdFeB magnets

International Nuclear Information System (INIS)

Leonowicz, M.; Kaszuwara, W.

2002-01-01

Zinc and resin bonded NdFeB magnets were processed. Basic magnetic parameters as well as compressive strength were evaluated versus annealing temperature and volume fraction of the bonding agent. For the zinc bonded magnets phase composition was investigated. The additional NdZn 5 phase was found in the Zn bonded magnets after annealing. Comparison of the Zn and resin bonded magnets reveals higher remanence for the former and higher coercivity for the latter. For the Zn and resin bonded magnets, 15 wt.% Zn / 370 o C and 7-10 wt.% resin were chosen as the optimal processing parameters. (author)

Waste Form Features, Events, and Processes

International Nuclear Information System (INIS)

R. Schreiner

2004-01-01

The purpose of this report is to evaluate and document the inclusion or exclusion of the waste form features, events and processes (FEPs) with respect to modeling used to support the Total System Performance Assessment for License Application (TSPA-LA). A screening decision, either Included or Excluded, is given for each FEP along with the technical bases for screening decisions. This information is required by the Nuclear Regulatory Commission (NRC) in 10 CFR 63.114 (d, e, and f) [DIRS 156605]. The FEPs addressed in this report deal with the issues related to the degradation and potential failure of the waste form and the migration of the waste form colloids. For included FEPs, this analysis summarizes the implementation of the FEP in TSPA-LA, (i.e., how the FEP is included). For excluded FEPs, this analysis provides the technical bases for exclusion from TSPA-LA (i.e., why the FEP is excluded). This revision addresses the TSPA-LA FEP list (DTN: MO0407SEPFEPLA.000 [DIRS 170760]). The primary purpose of this report is to identify and document the analyses and resolution of the features, events, and processes (FEPs) associated with the waste form performance in the repository. Forty FEPs were identified that are associated with the waste form performance. This report has been prepared to document the screening methodology used in the process of FEP inclusion and exclusion. The analyses documented in this report are for the license application (LA) base case design (BSC 2004 [DIRS 168489]). In this design, a drip shield is placed over the waste package and no backfill is placed over the drip shield (BSC 2004 [DIRS 168489]). Each FEP may include one or more specific issues that are collectively described by a FEP name and a FEP description. The FEP description may encompass a single feature, process or event, or a few closely related or coupled processes if the entire FEP can be addressed by a single specific screening argument or TSPA-LA disposition. The FEPs are

Waste Form Features, Events, and Processes

Energy Technology Data Exchange (ETDEWEB)

R. Schreiner

2004-10-27

The purpose of this report is to evaluate and document the inclusion or exclusion of the waste form features, events and processes (FEPs) with respect to modeling used to support the Total System Performance Assessment for License Application (TSPA-LA). A screening decision, either Included or Excluded, is given for each FEP along with the technical bases for screening decisions. This information is required by the Nuclear Regulatory Commission (NRC) in 10 CFR 63.114 (d, e, and f) [DIRS 156605]. The FEPs addressed in this report deal with the issues related to the degradation and potential failure of the waste form and the migration of the waste form colloids. For included FEPs, this analysis summarizes the implementation of the FEP in TSPA-LA, (i.e., how the FEP is included). For excluded FEPs, this analysis provides the technical bases for exclusion from TSPA-LA (i.e., why the FEP is excluded). This revision addresses the TSPA-LA FEP list (DTN: MO0407SEPFEPLA.000 [DIRS 170760]). The primary purpose of this report is to identify and document the analyses and resolution of the features, events, and processes (FEPs) associated with the waste form performance in the repository. Forty FEPs were identified that are associated with the waste form performance. This report has been prepared to document the screening methodology used in the process of FEP inclusion and exclusion. The analyses documented in this report are for the license application (LA) base case design (BSC 2004 [DIRS 168489]). In this design, a drip shield is placed over the waste package and no backfill is placed over the drip shield (BSC 2004 [DIRS 168489]). Each FEP may include one or more specific issues that are collectively described by a FEP name and a FEP description. The FEP description may encompass a single feature, process or event, or a few closely related or coupled processes if the entire FEP can be addressed by a single specific screening argument or TSPA-LA disposition. The FEPs are

The Nature of the Idealized Triple Bonds Between Principal Elements and the σ Origins of Trans-Bent Geometries-A Valence Bond Study.

Science.gov (United States)

Ploshnik, Elina; Danovich, David; Hiberty, Philippe C; Shaik, Sason

2011-04-12

We describe herein a valence bond (VB) study of 27 triply bonded molecules of the general type X≡Y, where X and Y are main element atoms/fragments from groups 13-15 in the periodic table. The following conclusions were derived from the computational data: (a) Single π-bond and double π-bond energies for the entire set correlate with the "molecular electronegativity", which is the sum of the X and Y electronegativites for X≡Y. The correlation with the molecular electronegativity establishes a simple rule of periodicity: π-bonding strength generally increases from left to right in a period and decreases down a column in the periodic table. (b) The σ frame invariably prefers trans bending, while π-bonding gets destabilized and opposes the trans distortion. In HC≡CH, the π-bonding destabilization overrides the propensity of the σ frame to distort, while in the higher row molecules, the σ frame wins out and establishes trans-bent molecules with 2(1)/2 bonds, in accord with recent experimental evidence based on solid state (29)Si NMR of the Sekiguchi compound. Thus, in the trans-bent molecules "less bonds pay more". (c) All of the π bonds show significant bonding contributions from the resonance energy due to covalent-ionic mixing. This quantity is shown to correlate linearly with the corresponding "molecular electronegativity" and to reflect the mechanism required to satisfy the equilibrium condition for the bond. The π bonds for molecules possessing high molecular electronegativity are charge-shift bonds, wherein bonding is dominated by the resonance energy of the covalent and ionic forms, rather than by either form by itself.

Representational Classroom Practices that Contribute to Students' Conceptual and Representational Understanding of Chemical Bonding

Science.gov (United States)

Hilton, Annette; Nichols, Kim

2011-11-01

Understanding bonding is fundamental to success in chemistry. A number of alternative conceptions related to chemical bonding have been reported in the literature. Research suggests that many alternative conceptions held by chemistry students result from previous teaching; if teachers are explicit in the use of representations and explain their content-specific forms and functions, this might be avoided. The development of an understanding of and ability to use multiple representations is crucial to students' understanding of chemical bonding. This paper draws on data from a larger study involving two Year 11 chemistry classes (n = 27, n = 22). It explores the contribution of explicit instruction about multiple representations to students' understanding and representation of chemical bonding. The instructional strategies were documented using audio-recordings and the teacher-researcher's reflection journal. Pre-test-post-test comparisons showed an improvement in conceptual understanding and representational competence. Analysis of the students' texts provided further evidence of the students' ability to use multiple representations to explain macroscopic phenomena on the molecular level. The findings suggest that explicit instruction about representational form and function contributes to the enhancement of representational competence and conceptual understanding of bonding in chemistry. However, the scaffolding strategies employed by the teacher play an important role in the learning process. This research has implications for professional development enhancing teachers' approaches to these aspects of instruction around chemical bonding.

Multibarrier waste forms. Part III: Process considerations

International Nuclear Information System (INIS)

Lokken, R.O.

1979-10-01

The multibarrier concept for the solidification and storage of radioactive waste utilizes up to three barriers to isolate radionuclides from the environment: a solidified waste inner core, an impervious coating, and a metal matrix. The coating and metal matrix give the composite waste form enhanced inertness with improvements in thermal stability, mechanical strength, and leach resistance. Preliminary process flow rates and material costs were evaluated for four multibarrier waste forms with the process complexity increasing thusly: glass marbles, uncoated supercalcine, glass-coated supercalcine, and PyC/Al 2 O 3 -coated supercalcine. This report discusses the process variables and their effect on optimization of product quality, processing simplicity, and material cost. 11 figures, 2 tables

R and D activities for the design of the MITICA Plasma Driver Plate manufacturing process via explosion bonding technique

International Nuclear Information System (INIS)

Pavei, M.; Dal Bello, S.; Groeneveld, H.; Rizzolo, A.

2013-01-01

Highlights: ► The work is focused on the manufacturing process of the Plasma Driver Plate of MITICA. ► A clad plate of molybdenum and copper has been manufactured. ► Simulations have been carried out to improve the design geometry of the component. ► The driver-hole rim have been machined and hot formed. ► No delamination were found in the molybdenum. -- Abstract: The back plate of the MITICA plasma source, named Plasma Driver Plate (PDP), will be protected from the impact of the highly energetic back-streaming positive ions (BSI+), generated inside the accelerator, by a 1.0 mm thick molybdenum layer that will be joined by Explosion Bonding (EB) technique to the copper heat sink. This technology has been investigated and used for manufacturing prototypes, demonstrating very high strength of the obtained molybdenum–copper interface. The production of the shaped edge profile of the driver-hole, after the EB, is an open point. In order to demonstrate the possibility to produce the PDP by explosion bonding, the manufacturing of a full scale prototype of the area just around one of the PDP driver-holes was identified as the road to address most of the manufacturing issues. Elasto-plastic finite element analyses have been carried out to improve the hole rim geometry and the process parameters of all the manufacturing steps. A full scale prototype of the PDP driver-hole has been manufactured and tested. This contribution gives an overview of the R and D activities carried out to address the main open issues, to define the PDP component detailed geometry and its manufacturing processes, via EB technique

A process to fabricate fused silica nanofluidic devices with embedded electrodes using an optimized room temperature bonding technique

Science.gov (United States)

Boden, Seth; Karam, P.; Schmidt, A.; Pennathur, S.

2017-05-01

Fused silica is an ideal material for nanofluidic systems due to its extreme purity, chemical inertness, optical transparency, and native hydrophilicity. However, devices requiring embedded electrodes (e.g., for bioanalytical applications) are difficult to realize given the typical high temperature fusion bonding requirements (˜1000 °C). In this work, we optimize a two-step plasma activation process which involves an oxygen plasma treatment followed by a nitrogen plasma treatment to increase the fusion bonding strength of fused silica at room temperature. We conduct a parametric study of this treatment to investigate its effect on bonding strength, surface roughness, and microstructure morphology. We find that by including a nitrogen plasma treatment to the standard oxygen plasma activation process, the room temperature bonding strength increases by 70% (0.342 J/m2 to 0.578 J/m2). Employing this optimized process, we fabricate and characterize a nanofluidic device with an integrated and dielectrically separated electrode. Our results prove that the channels do not leak with over 1 MPa of applied pressure after a 24 h storage time, and the electrode exhibits capacitive behavior with a finite parallel resistance in the upper MΩ range for up to a 6.3Vdc bias. These data thus allow us to overcome the barrier that has barred nanofluidic progress for the last decade, namely, the development of nanometer scale well-defined channels with embedded metallic materials for far-reaching applications such as the exquisite manipulation of biomolecules.

Solitons on H bonds in proteins

DEFF Research Database (Denmark)

d'Ovidio, F.; Bohr, H.G.; Lindgård, Per-Anker

2003-01-01

system shows that the solitons are spontaneously created and are stable and moving along the helix axis. A perturbation on one of the three H-bond lines forms solitons on the other H bonds as well. The robust solitary wave may explain very long-lived modes in the frequency range of 100 cm(-1) which...... are found in recent x-ray laser experiments. The dynamics parameters of the Toda lattice are in accordance with the usual Lennard-Jones parameters used for realistic H-bond potentials in proteins....

Connection between fragility, mean-squared displacement and shear modulus in two van der Waals bonded glass-forming liquids

DEFF Research Database (Denmark)

Hansen, Henriette Wase; Frick, Bernhard; Hecksher, Tina

2017-01-01

The temperature dependence of the high-frequency shear modulus measured in the kHz range is compared with the mean-squared displacement measured in the nanosecond range for the two van der Waals bonded glass-forming liquids cumene and 5-polyphenyl ether. This provides an experimental test for the...... for the assumption connecting two versions of the shoving model for the non-Arrhenius temperature dependence of the relaxation time in glass formers. The two versions of the model are also tested directly and both are shown to work well for these liquids....

46 CFR 540.6 - Surety bonds.

Science.gov (United States)

2010-10-01

... transportation. The requirements of Form FMC-132A, however, may be amended by the Commission in a particular case for good cause. (b) In the case of a surety bond which is to cover all passenger operations of the... shall be issued by a bonding company authorized to do business in the United States and acceptable to...

HARM processing techniques for MEMS and MOEMS devices using bonded SOI substrates and DRIE

Science.gov (United States)

Gormley, Colin; Boyle, Anne; Srigengan, Viji; Blackstone, Scott C.

2000-08-01

Silicon-on-Insulator (SOI) MEMS devices (1) are rapidly gaining popularity in realizing numerous solutions for MEMS, especially in the optical and inertia application fields. BCO recently developed a DRIE trench etch, utilizing the Bosch process, and refill process for high voltage dielectric isolation integrated circuits on thick SOI substrates. In this paper we present our most recently developed DRIE processes for MEMS and MOEMS devices. These advanced etch techniques are initially described and their integration with silicon bonding demonstrated. This has enabled process flows that are currently being utilized to develop optical router and filter products for fiber optics telecommunications and high precision accelerometers.

Product consistency test and toxicity characteristic leaching procedure results of the ceramic waste form from the electrometallurgical treatment process for spent fuel

International Nuclear Information System (INIS)

Johnson, S. G.; Adamic, M. L.: DiSanto, T.; Warren, A. R.; Cummings, D. G.; Foulkrod, L.; Goff, K. M.

1999-01-01

The ceramic waste form produced from the electrometallurgical treatment of sodium bonded spent fuel from the Experimental Breeder Reactor-II was tested using two immersion tests with separate and distinct purposes. The product consistency test is used to assess the consistency of the waste forms produced and thus is an indicator of a well-controlled process. The toxicity characteristic leaching procedure is used to determine whether a substance is to be considered hazardous by the Environmental Protection Agency. The proposed high level waste repository will not be licensed to receive hazardous waste, thus any waste forms destined to be placed there cannot be of a hazardous nature as defined by the Resource Conservation and Recovery Act. Results are presented from the first four fully radioactive ceramic waste forms produced and from seven ceramic waste forms produced from cold surrogate materials. The fully radioactive waste forms are approximately 2 kg in weight and were produced with salt used to treat 100 driver subassemblies of spent fuel

Numerical simulation of X90 UOE pipe forming process

Science.gov (United States)

Zou, Tianxia; Ren, Qiang; Peng, Yinghong; Li, Dayong; Tang, Ding; Han, Jianzeng; Li, Xinwen; Wang, Xiaoxiu

2013-12-01

The UOE process is an important technique to manufacture large-diameter welding pipes which are increasingly applied in oil pipelines and offshore platforms. The forming process of UOE mainly consists of five successive operations: crimping, U-forming, O-forming, welding and mechanical expansion, through which a blank is formed into a pipe in a UOE pipe mill. The blank with an appropriate edge bevel is bent into a cylindrical shape by crimping (C-forming), U-forming and O-forming successively. After the O-forming, there is an open-seam between two ends of the plate. Then, the blank is welded by automatic four-electrode submerged arc welding technique. Subsequently, the welded pipe is expanded with a mechanical expander to get a high precision circular shape. The multiple operations in the UOE mill make it difficult to control the quality of the formed pipe. Therefore, process design mainly relies on experience in practical production. In this study, the UOE forming of an API X90 pipe is studied by using finite element simulation. The mechanical properties tests are performed on the API X90 pipeline steel blank. A two-dimensional finite element model under the hypothesis of plane strain condition is developed to simulate the UOE process according to data coming from the workshop. A kinematic hardening model is used in the simulation to take the Bauschinger effect into account. The deformation characteristics of the blank during the forming processes are analyzed. The simulation results show a significant coherence in the geometric configurations comparing with the practical manufacturing.

Biofriendly bonding processes for nanoporous implantable SU-8 microcapsules for encapsulated cell therapy.

Science.gov (United States)

Nemani, Krishnamurthy; Kwon, Joonbum; Trivedi, Krutarth; Hu, Walter; Lee, Jeong-Bong; Gimi, Barjor

2011-01-01

Mechanically robust, cell encapsulating microdevices fabricated using photolithographic methods can lead to more efficient immunoisolation in comparison to cell encapsulating hydrogels. There is a need to develop adhesive bonding methods which can seal such microdevices under physiologically friendly conditions. We report the bonding of SU-8 based substrates through (i) magnetic self assembly, (ii) using medical grade photocured adhesive and (iii) moisture and photochemical cured polymerization. Magnetic self-assembly, carried out in biofriendly aqueous buffers, provides weak bonding not suitable for long term applications. Moisture cured bonding of covalently modified SU-8 substrates, based on silanol condensation, resulted in weak and inconsistent bonding. Photocured bonding using a medical grade adhesive and of acrylate modified substrates provided stable bonding. Of the methods evaluated, photocured adhesion provided the strongest and most stable adhesion.

Optimization and control of metal forming processes

NARCIS (Netherlands)

Havinga, Gosse Tjipke

2016-01-01

Inevitable variations in process and material properties limit the accuracy of metal forming processes. Robust optimization methods or control systems can be used to improve the production accuracy. Robust optimization methods are used to design production processes with low sensitivity to the

Editing disulphide bonds: error correction using redox currencies.

Science.gov (United States)

Ito, Koreaki

2010-01-01

The disulphide bond-introducing enzyme of bacteria, DsbA, sometimes oxidizes non-native cysteine pairs. DsbC should rearrange the resulting incorrect disulphide bonds into those with correct connectivity. DsbA and DsbC receive oxidizing and reducing equivalents, respectively, from respective redox components (quinones and NADPH) of the cell. Two mechanisms of disulphide bond rearrangement have been proposed. In the redox-neutral 'shuffling' mechanism, the nucleophilic cysteine in the DsbC active site forms a mixed disulphide with a substrate and induces disulphide shuffling within the substrate part of the enzyme-substrate complex, followed by resolution into a reduced enzyme and a disulphide-rearranged substrate. In the 'reduction-oxidation' mechanism, DsbC reduces those substrates with wrong disulphides so that DsbA can oxidize them again. In this issue of Molecular Microbiology, Berkmen and his collaborators show that a disulphide reductase, TrxP, from an anaerobic bacterium can substitute for DsbC in Escherichia coli. They propose that the reduction-oxidation mechanism of disulphide rearrangement can indeed operate in vivo. An implication of this work is that correcting errors in disulphide bonds can be coupled to cellular metabolism and is conceptually similar to the proofreading processes observed with numerous synthesis and maturation reactions of biological macromolecules.

Sibling bereavement and continuing bonds.

Science.gov (United States)

Packman, Wendy; Horsley, Heidi; Davies, Betty; Kramer, Robin

2006-11-01

Historically, from a Freudian and medical model perspective, emotional disengagement from the deceased was seen as essential to the successful adaptation of bereavement. A major shift in the bereavement literature has occurred and it is now generally accepted that despite the permanence of physical separation, the bereaved remains involved and connected to the deceased and can be emotionally sustained through continuing bonds. The majority of literature has focused on adults and on the nature of continuing bonds following the death of a spouse. In this article, the authors demonstrate how the continuing bonds concept applies to the sibling relationship. We describe the unique continued relationship formed by bereaved children and adolescents following a sibling loss, highlight the factors that influence the siblings continuing bonds expressions, and offer clinical interventions. In our view, mental health professionals can play an important role in helping parents encourage activities that may facilitate the creation and maintenance of continuing bonds in their children.

Deriving the bond pricing equation

Directory of Open Access Journals (Sweden)

Kožul Nataša

2014-01-01

Full Text Available Given the recent focus on Eurozone debt crisis and the credit rating downgrade not only of US debt, but that of other countries and many UK major banking institutions, this paper aims to explain the concept of bond yield, its different measures and bond pricing equation. Yields on capital market instruments are rarely quoted on the same basis, which makes direct comparison between different as investment choices impossible. Some debt instruments are quoted on discount basis, whilst coupon-bearing ones accrue interest differently, offer different compounding opportunities, have different coupon payment frequencies, and manage non-business day maturity dates differently. Moreover, rules governing debt vary across countries, markets and currencies, making yield calculation and comparison a rather complex issue. Thus, some fundamental concepts applicable to debt instrument yield measurement, with focus on bond equation, are presented here. In addition, bond equation expressed in annuity form and used to apply Newton-Raphson algorithm to derive true bond yield is also shown.

Effect of strain path on microstructure, deformation texture and mechanical properties of nano/ultrafine grained AA1050 processed by accumulative roll bonding (ARB)

Energy Technology Data Exchange (ETDEWEB)

Naseri, M.; Reihanian, M. [Department of Materials Science and Engineering, Faculty of Engineering, Shahid Chamran University of Ahvaz, Ahvaz (Iran, Islamic Republic of); Borhani, E., E-mail: e.borhani@semnan.ac.ir [Department of Nano Technology, Nano Materials Group, Semnan University, Semnan (Iran, Islamic Republic of)

2016-09-15

Commercial pure Al sheets were severe plastically deformed at room temperature by accumulative roll bonding (ARB) and cross accumulative roll bonding (CARB). Change in strain path was imposed during CARB by rotating the sheets with 90° around the normal direction axis between each cycle. Microstructural evolution of processed sheets was studied by electron back scattered diffraction (EBSD) analysis and revealed that nano/ultrafine grains (NG/UFG) with the average grain size of 380 nm and 155 nm were formed by both processing routes after eight cycles, respectively. The fraction of high angle grain boundaries and mean misorientation angle of the boundaries in the CARB were 49% and 40.20°, respectively, in comparison to that of ARB sample (41% and 37.37°). Deformation texture evolution demonstrated that the change in strain path leads to the formation of strong orientation along the β-fiber. The major texture components for ARB specimens were Brass {011}<211> and S {123}<634> while those for CARB were Brass {011}<211> and Goss {011}<100>. The CARB processed specimen exhibited the tensile strength, microhardness and elongation of about 230 MPa, 92 HV and 13% compared with ARB sample (180 MPa, 80 HV and 10.5%) after eight cycles. Scanning electron microscopy (SEM) observations of tensile fracture surface of specimens revealed ductile type fracture.

Transition Metal Free C-N Bond Forming Dearomatizations and Aryl C-H Aminations by in Situ Release of a Hydroxylamine-Based Aminating Agent.

Science.gov (United States)

Farndon, Joshua J; Ma, Xiaofeng; Bower, John F

2017-10-11

We outline a simple protocol that accesses directly unprotected secondary amines by intramolecular C-N bond forming dearomatization or aryl C-H amination. The method is dependent on the generation of a potent electrophilic aminating agent released by in situ deprotection of O-Ts activated N-Boc hydroxylamines.

Effect of Ni interlayer on diffusion bonding of a W alloy and a Ta alloy

Energy Technology Data Exchange (ETDEWEB)

Zhang, Jian; Liu, Ruxia; Wei, Qinqin; Luo, Guoqiang; Shen, Qiang; Zhang, Lianmeng [Wuhan Univ. of Technology (China). The State Key Lab. of Advanced Technology for Materials Synthesis and Processing

2017-11-01

The combination of W and Ta is expected to be highly beneficial for many applications from aerospace, weapons, military and nuclear industry. In this paper, W and Ta alloys were successfully diffusion bonded with Ni interlayer. The process of the formation of W/Ni/Ta diffusion bonded joints was investigated by means of scanning electron microscopy, X-ray diffraction system, electron probe micro-analyzer, energy dispersive spectrometry and shear strength measurement. The results show that the shear strength increases when the bonding temperature increases and exhibits a maximum value of 244 MPa at 930 C. The bonding of W/Ni can be attributed to the bonding of Ni to tungsten grains and the bonding of Ni to a Ni-Fe-binder mainly by elemental diffusion. The fracture takes place in the Ni/Ta interface and Ni{sub 3}Ta and Ni{sub 2}Ta intermetallic compounds are formed on the fracture surfaces.

Constitutive hybrid processes: A process-algebraic semantics for hybrid bond graphs

NARCIS (Netherlands)

Cuijpers, P.J.L.; Broenink, J.F.; Mosterman, P.J.

2008-01-01

Models of physical systems have to be based on physical principles such as conservation of energy and continuity of power. These principles are inherently enforced by the bond graph modeling formalism. Often, however, physical components may be best modeled as piecewise continuous with discrete mode

Constitutive Hybrid Processes: a Process-Algebraic Semantics for Hybrid Bond Graphs

NARCIS (Netherlands)

Cuijpers, P.J.L.; Broenink, Johannes F.; Mosterman, P.J.

Models of physical systems have to be based on physical principles such as conservation of energy and continuity of power. These principles are inherently enforced by the bond graph modeling formalism. Often, however, physical components may be best modeled as piecewise continuous with discrete mode

Constitutive Hybrid Processes: a Process-Algebraic Semantics for Hybrid Bond Graphs

NARCIS (Netherlands)

Cuijpers, Pieter J.L.; Broenink, Johannes F.; Mosterman, Pieter J.

2008-01-01

Models of physical systems have to be based on physical principles such as conservation of energy and continuity of power. These principles are inherently enforced by the bond graph modeling formalism. Often, however, physical components may be best modeled as piecewise continuous with discrete mode

Bonding mechanisms in spot welded three layer combinations

DEFF Research Database (Denmark)

Moghadam, Marcel; Tiedje, Niels Skat; Seyyedian Choobi, Mahsa

2016-01-01

this interface. It has been shown previously that such a joint can reach relatively high strength resulting in plug failure in tensileshear testing. Additional strength due to these bonding mechanisms is also obtained in common spot welds in the so-called corona band around the weld nugget.......The strength of a spot weld generally stems from fusion bonding of the metal layers, but other solid state bonding mechanisms also contribute to the overall strength. Metallographic analyses are presented to identify the phases formed near and across the weld interfaces and to identify...... the occurring bonding mechanisms. When welding a combination of three galvanized steel layers where one outer layer is a thin low-carbon steel it is a common challenge to obtain nugget penetration into the thin low-carbon steel. It therefore happens in real production that no nugget is formed across...

Bonding in [CuNRR′]4 type clusters

Institute of Scientific and Technical Information of China (English)

WANG Bingwu; XU Guangxian; CHEN Zhida

2004-01-01

Many polynuclear Cu(I) compounds have been synthesized, but the problem whether there is direct or no direct Cu-Cu bonding in these compounds is not clear. The electronic structure of [CuNRR′]4 type clusters was investigated by using density functional methods. The results of geometrical optimization are in good agreement with experiment, and the localization of MO's shows that there are four Cu-Cu ( bonds to form the square Cu4 ring in addition to the four bridging Cu-N-Cu bonds. A concept of the covalence of molecular fragments is proposed to describe the bonding in these clusters.

Application of continual annealing and roll bonding (CAR) process for manufacturing Al–Zn multilayered composites

International Nuclear Information System (INIS)

Dehsorkhi, Reza Nasiri; Qods, Fathallah; Tajally, Mohammad

2012-01-01

Highlights: ► CAR process was performed on Al–Zn composite. ► Good bonding between layers was achieved by increasing the number of CAR cycles. ► With increasing number of cycles, a good distribution of Zn fragmentations was achieved. ► The composites which were produced by CAR process, possess a higher tensile strength and elongation than ARB process. ► By EDX analysis it is proved that Al and Zn atoms would diffuse with each other. - Abstract: In this study, an aluminium–zinc composite was produced for the first time by using a continual annealing and roll-bonding (CAR) process. A composite with homogeneous distribution of fragmented zinc layers in aluminium matrix was produced after ten CAR cycles. The results demonstrate that tensile strength of the final composites increases up to 410 MPa, which is about 4 times higher than those of initial aluminium and zinc sheets. However, elongation of the composite reduced down to 4% after ten CAR cycles. The fracture surfaces of the tensile samples were observed by scanning electron microscope (SEM) to evaluate the failure mode. Observations reveal that the failure mode in CAR-processed composites is a typical ductile fracture which shows deep dimples in samples with few CAR cycles, while the failure mode was shear ductile fracture with shallow and elongated dimples in samples with ten CAR cycles.

Unusually short chalcogen bonds involving organoselenium: insights into the Se-N bond cleavage mechanism of the antioxidant ebselen and analogues.

Science.gov (United States)

Thomas, Sajesh P; Satheeshkumar, K; Mugesh, Govindasamy; Guru Row, T N

2015-04-27

Structural studies on the polymorphs of the organoselenium antioxidant ebselen and its derivative show the potential of organic selenium to form unusually short Se⋅⋅⋅O chalcogen bonds that lead to conserved supramolecular recognition units. Se⋅⋅⋅O interactions observed in these polymorphs are the shortest such chalcogen bonds known for organoselenium compounds. The FTIR spectral evolution characteristics of this interaction from solution state to solid crystalline state further validates the robustness of this class of supramolecular recognition units. The strength and electronic nature of the Se⋅⋅⋅O chalcogen bonds were explored using high-resolution X-ray charge density analysis and atons-in-molecules (AIM) theoretical analysis. A charge density study unravels the strong electrostatic nature of Se⋅⋅⋅O chalcogen bonding and soft-metal-like behavior of organoselenium. An analysis of the charge density around Se-N and Se-C covalent bonds in conjunction with the Se⋅⋅⋅O chalcogen bonding modes in ebselen and its analogues provides insights into the mechanism of drug action in this class of organoselenium antioxidants. The potential role of the intermolecular Se⋅⋅⋅O chalcogen bonding in forming the intermediate supramolecular assembly that leads to the bond cleavage mechanism has been proposed in terms of electron density topological parameters in a series of molecular complexes of ebselen with reactive oxygen species (ROS). © 2015 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

Competition of hydrogen bonds and halogen bonds in complexes of hypohalous acids with nitrogenated bases.

Science.gov (United States)

Alkorta, Ibon; Blanco, Fernando; Solimannejad, Mohammad; Elguero, Jose

2008-10-30

A theoretical study of the complexes formed by hypohalous acids (HOX, X = F, Cl, Br, I, and At) with three nitrogenated bases (NH 3, N 2, and NCH) has been carried out by means of ab initio methods, up to MP2/aug-cc-pVTZ computational method. In general, two minima complexes are found, one with an OH...N hydrogen bond and the other one with a X...N halogen bond. While the first one is more stable for the smallest halogen derivatives, the two complexes present similar stabilities for the iodine case and the halogen-bonded structure is the most stable one for the hypoastatous acid complexes.

Energetics and chemical bonding of the 1,3,5-tridehydrobenzene triradical and its protonated form

Energy Technology Data Exchange (ETDEWEB)

Hue Minh Thi Nguyen [Department of Chemistry, University of Leuven, Celestijnenlaan 200F, B-3001 Heverlee, Leuven (Belgium); Faculty of Chemistry, University of Education, Hanoi (Viet Nam); Hoeltzl, Tibor [Department of Chemistry, University of Leuven, Celestijnenlaan 200F, B-3001 Heverlee, Leuven (Belgium); Department of Inorganic Chemistry, University of Technology and Economics Gellert ter 4, H-1521-Budapest (Hungary); Gopakumar, G. [Department of Chemistry, University of Leuven, Celestijnenlaan 200F, B-3001 Heverlee, Leuven (Belgium); Veszpremi, Tamas [Department of Inorganic Chemistry, University of Technology and Economics Gellert ter 4, H-1521-Budapest (Hungary); Peeters, Jozef [Department of Chemistry, University of Leuven, Celestijnenlaan 200F, B-3001 Heverlee, Leuven (Belgium); Minh Tho Nguyen [Department of Chemistry, University of Leuven, Celestijnenlaan 200F, B-3001 Heverlee, Leuven (Belgium)], E-mail: minh.nguyen@chem.kuleuven.be

2005-09-19

Quantum chemical calculations were applied to investigate the electronic structure of the parent 1,3,5-tridehydrobenzene triradical (C{sub 6}H{sub 3}, TDB) and its anion (C{sub 6}H{sub 3}{sup -}), cation (C{sub 6}H{sub 3}{sup +}) and protonated form (C{sub 6}H{sub 4}{sup +}). Our results obtained using the state-averaged complete active space self-consistent-field (CASSCF) followed by second-order multi-state multi-configuration perturbation theory, MS-CASPT2, and MRMP2 in conjunction with the large ANO-L and 6-311++G(3df,2p) basis set, confirm and reveal the followings: (i) TDB has a doublet {sup 2}A{sub 1} ground state with a {sup 4}B{sub 2}-{sup 2}A{sub 1} energy gap of 29kcal/mol, (ii) the ground state of the C{sub 6}H{sub 3}{sup -} anion in the triplet {sup 3}B{sub 2} being 4kcal/mol below the {sup 1}A{sub 1} state. (iii) the electron affinity (EA), ionization energy (IE) and proton affinity (PA) are computed to be: EA=1.6eV, IE=7.2eV, PA=227kcal/mol using UB3LYP/6-311++G(3df,2p)+ZPE; standard heat of formation {delta}H{sub f(298K,1atm)}(TDB)=179+/-2kcal/mol was calculated with CBS-QB3 method. An atoms-in-molecules (AIM) analysis of the structure reveals that the topology of the electron density is similar in all compounds: hydrogens connect to a six-membered ring, except for the case of the {sup 2}A{sub 2} state of C{sub 6}H{sub 4}{sup +} (MBZ{sup +}) which is bicyclic with fused five- and three-membered rings. Properties of the chemical bonds were characterized with Electron Localization Function (ELF) analysis, as well as Wiberg indices, Laplacian and spin density maps. We found that the radicals form separate monosynaptic basins on the ELF space, however its pair character remains high. In the {sup 2}A{sub 1} state of TDB, the radical center is mainly localized on the C1 atom, while in the {sup 2}B{sub 2} state it is equally distributed between the C3 and C5 atoms and, due to the symmetry, in the {sup 4}B{sub 2} state the C1, C2 and C3 atoms have the same

New solid state forms of antineoplastic 5-fluorouracil with anthelmintic piperazine

Science.gov (United States)

Moisescu-Goia, C.; Muresan-Pop, M.; Simon, V.

2017-12-01

The aim of the present study was to asses the formation of solid forms between the 5-fluorouracil chemotherapy drug and the anthelmintic piperazine. Two new solid forms of antineoplastic agent 5-fluorouracil with anthelmintic piperazine were obtained by liquid assisted ball milling and slurry crystallization methods. The Nsbnd H hydrogen bonding donors and C = O hydrogen bonding acceptors of 5-fluorouracil allow to form co-crystals with other drugs delivering improved properties for medical applications, as proved for other compounds of pharmaceutical interest. Both new solid forms were investigated using X-ray powder diffraction (XRD), differential thermal analysis (DTA) and Fourier transform infrared (FTIR) spectroscopy. The XRD results show that by both methods were successfully synthesized new solid forms of 5-fluorouracil with piperazine. According to FTIR results the form prepared by lichid assisted grinding process was obtained as co-crystal and the other one, prepared by slurry method, resulted as a salt.

Non-hoop winding effect on bonding temperature of laser assisted tape winding process

Science.gov (United States)

Zaami, Amin; Baran, Ismet; Akkerman, Remko

2018-05-01

One of the advanced methods for production of thermoplastic composite methods is laser assisted tape winding (LATW). Predicting the temperature in LATW process is very important since the temperature at nip-point (bonding line through width) plays a pivotal role in a proper bonding and hence the mechanical performance. Despite the hoop-winding where the nip-point is the straight line, non-hoop winding includes a curved nip-point line. Hence, the non-hoop winding causes somewhat a different power input through laser-rays and-reflections and consequently generates unknown complex temperature profile on the curved nip-point line. Investigating the temperature at the nip-point line is the point of interest in this study. In order to understand this effect, a numerical model is proposed to capture the effect of laser-rays and their reflections on the nip-point temperature. To this end, a 3D optical model considering the objects in LATW process is considered. Then, the power distribution (absorption and reflection) from the optical analysis is used as an input (heat flux distribution) for the thermal analysis. The thermal analysis employs a fully-implicit advection-diffusion model to calculate the temperature on the surfaces. The results are examined to demonstrate the effect of winding direction on the curved nip-point line (tape width) which has not been considered in literature up to now. Furthermore, the results can be used for designing a better and more efficient setup in the LATW process.

Size effects in tin-based lead-free solder joints: Kinetics of bond formation and mechanical characteristics

Science.gov (United States)

Abdelhadi, Ousama Mohamed Omer

Continuous miniaturization of microelectronic interconnects demands smaller joints with comparable microstructural and structural sizes. As the size of joints become smaller, the volume of intermetallics (IMCs) becomes comparable with the joint size. As a result, the kinetics of bond formation changes and the types and thicknesses of IMC phases that form within the constrained region of the bond varies. This dissertation focuses on investigating combination effects of process parameters and size on kinetics of bond formation, resulting microstructure and the mechanical properties of joints that are formed under structurally constrained conditions. An experiment is designed where several process parameters such as time of bonding, temperature, and pressure, and bond thickness as structural chracteristic, are varied at multiple levels. The experiment is then implemented on the process. Scanning electron microscope (SEM) is then utilized to determine the bond thickness, IMC phases and their thicknesses, and morphology of the bonds. Electron backscatter diffraction (EBSD) is used to determine the grain size in different regions, including the bulk solder, and different IMC phases. Physics-based analytical models have been developed for growth kinetics of IMC compounds and are verified using the experimental results. Nanoindentation is used to determine the mechanical behavior of IMC phases in joints in different scales. Four-point bending notched multilayer specimen and four-point bending technique were used to determine fracture toughness of the bonds containing IMCs. Analytical modeling of peeling and shear stresses and fracture toughness in tri-layer four-point bend specimen containing intermetallic layer was developed and was verified and validated using finite element simulation and experimental results. The experiment is used in conjunction with the model to calculate and verify the fracture toughness of Cu6Sn5 IMC materials. As expected two different IMC phases

76 FR 66855 - United States Savings Bonds, Series EE, HH and I

Science.gov (United States)

2011-10-28

... registration of definitive series EE savings bonds? * * * If the bond was purchased as a gift or award and the... registered form. * * * * * * * * (c) Registration of bonds purchased as gifts. If the bonds were purchased as... savings bonds? * * * If the bond was purchased as a gift or award and the owner's TIN is not known, the...

An Attachment Perspective on the Child--Dog Bond: Interdisciplinary and International Research Findings

Science.gov (United States)

Jalongo, Mary Renck

2015-01-01

Understanding the process of attachment formation in young children has been a focal point in child development research for decades. However, young children's attachments are not only with human beings; they also form bonds with companion animals, particularly dogs ("Canis familiaris"). Given the number of dogs that are kept by families…

Solid state bonding of beryllium-copper for an ITER first wall application

International Nuclear Information System (INIS)

Odegard, B.C. Jr.; Cadden, C.H.

1998-02-01

Several different joint assemblies were evaluated in support of a manufacturing technology for diffusion bonding a beryllium armor tile to a copper alloy heat sink for fusion reactor applications. Because beryllium reacts with all but a few elements to form intermetallic compounds, this study considered several different surface treatments as a means of both inhibiting these reactions and promoting a good diffusion bond between the two substrates. A diffusion bonded assemblies used aluminum or an aluminum-beryllium composite (AlBeMet-150) as the interfacial material in contact with beryllium. In most cases, explosive bonding was utilized as a technique for joining the copper alloy heat sink to an aluminum or AlBeMet-150 substrate, which was subsequently diffusion bonded to an aluminum coated beryllium tile. In this approach, a 250 microm thick titanium foil was used as a diffusion barrier between the copper and aluminum to prevent the formation of Cu-Al intermetallic phases. In all cases, a hot isostatic pressing (HIP) furnace was used in conjunction with canned assemblies in order to minimize oxidation and apply sufficient pressure on the assembly for excellent metal-to-metal contact and subsequent bonding. Several different processing schedules were evaluated during the course of this study; bonded assemblies were produced that failed outside the bond area indicating a 100% joint efficiency

Solid state bonding of beryllium-copper for an ITER first wall application

Energy Technology Data Exchange (ETDEWEB)

Odegard, B.C. Jr.; Cadden, C.H. [Sandia National Labs., Livermore, CA (United States)

1998-01-01

Several different joint assemblies were evaluated in support of a manufacturing technology for diffusion bonding a beryllium armor tile to a copper alloy heat sink for fusion reactor applications. Because beryllium reacts with all but a few elements to form intermetallic compounds, this study considered several different surface treatments as a means of both inhibiting these reactions and promoting a good diffusion bond between the two substrates. All diffusion bonded assemblies used aluminum or an aluminum-beryllium composite (AlBeMet-150) as the interfacial material in contact with beryllium. In most cases, explosive bonding was utilized as a technique for joining the copper alloy heat sink to an aluminum or AlBeMet-150 substrate, which was subsequently diffusion bonded to an aluminum coated beryllium tile. In this approach, a 250 {mu}m thick titanium foil was used as a diffusion barrier between the copper and aluminum to prevent the formation of Cu-Al intermetallic phases. In all cases, a hot isostatic pressing (HIP) furnace was used in conjunction with canned assemblies in order to minimize oxidation and apply sufficient pressure on the assembly for excellent metal-to-metal contact and subsequent bonding. Several different processing schedules were evaluated during the course of this study; bonded assemblies were produced that failed outside the bond area indicating a 100% joint efficiency. (author)

Reversible Self-Assembly of Supramolecular Vesicles and Nanofibers Driven by Chalcogen-Bonding Interactions.

Science.gov (United States)

Chen, Liang; Xiang, Jun; Zhao, Yue; Yan, Qiang

2018-05-29

Chalcogen-bonding interactions have been viewed as new noncovalent forces in supramolecular chemistry. However, harnessing chalcogen bonds to drive molecular self-assembly processes is still unexplored. Here we report for the first time a novel class of supra-amphiphiles formed by Te···O or Se···O chalcogen-bonding interactions, and their self-assembly into supramolecular vesicles and nanofibers. A quasi-calix[4]chalcogenadiazole (C4Ch) as macrocyclic donor and a tailed pyridine N-oxide surfactant as molecular acceptor are designed to construct the donor-acceptor complex via chalcogen-chalcogen connection between the chalcogenadiazole moieties and oxide anion. The affinity of such chalcogen-bonding can dictate the geometry of supra-amphiphiles, driving diverse self-assembled morphologies. Furthermore, the reversible disassembly of these nanostructures can be promoted by introducing competing anions, such as halide ions, or by decreasing the systemic pH value.

Binding branched and linear DNA structures: From isolated clusters to fully bonded gels

Science.gov (United States)

Fernandez-Castanon, J.; Bomboi, F.; Sciortino, F.

2018-01-01

The proper design of DNA sequences allows for the formation of well-defined supramolecular units with controlled interactions via a consecution of self-assembling processes. Here, we benefit from the controlled DNA self-assembly to experimentally realize particles with well-defined valence, namely, tetravalent nanostars (A) and bivalent chains (B). We specifically focus on the case in which A particles can only bind to B particles, via appropriately designed sticky-end sequences. Hence AA and BB bonds are not allowed. Such a binary mixture system reproduces with DNA-based particles the physics of poly-functional condensation, with an exquisite control over the bonding process, tuned by the ratio, r, between B and A units and by the temperature, T. We report dynamic light scattering experiments in a window of Ts ranging from 10 °C to 55 °C and an interval of r around the percolation transition to quantify the decay of the density correlation for the different cases. At low T, when all possible bonds are formed, the system behaves as a fully bonded network, as a percolating gel, and as a cluster fluid depending on the selected r.

Method for producing components with internal architectures, such as micro-channel reactors, via diffusion bonding sheets

Science.gov (United States)

Alman, David E [Corvallis, OR; Wilson, Rick D [Corvallis, OR; Davis, Daniel L [Albany, OR

2011-03-08

This invention relates to a method for producing components with internal architectures, and more particularly, this invention relates to a method for producing structures with microchannels via the use of diffusion bonding of stacked laminates. Specifically, the method involves weakly bonding a stack of laminates forming internal voids and channels with a first generally low uniaxial pressure and first temperature such that bonding at least between the asperites of opposing laminates occurs and pores are isolated in interfacial contact areas, followed by a second generally higher isostatic pressure and second temperature for final bonding. The method thereby allows fabrication of micro-channel devices such as heat exchangers, recuperators, heat-pumps, chemical separators, chemical reactors, fuel processing units, and combustors without limitation on the fin aspect ratio.

Rhodium-Catalyzed C-C Bond Formation via Heteroatom-Directed C-H Bond Activation

Energy Technology Data Exchange (ETDEWEB)

Colby, Denise; Bergman, Robert; Ellman, Jonathan

2010-05-13

Once considered the 'holy grail' of organometallic chemistry, synthetically useful reactions employing C-H bond activation have increasingly been developed and applied to natural product and drug synthesis over the past decade. The ubiquity and relative low cost of hydrocarbons makes C-H bond functionalization an attractive alternative to classical C-C bond forming reactions such as cross-coupling, which require organohalides and organometallic reagents. In addition to providing an atom economical alternative to standard cross - coupling strategies, C-H bond functionalization also reduces the production of toxic by-products, thereby contributing to the growing field of reactions with decreased environmental impact. In the area of C-C bond forming reactions that proceed via a C-H activation mechanism, rhodium catalysts stand out for their functional group tolerance and wide range of synthetic utility. Over the course of the last decade, many Rh-catalyzed methods for heteroatom-directed C-H bond functionalization have been reported and will be the focus of this review. Material appearing in the literature prior to 2001 has been reviewed previously and will only be introduced as background when necessary. The synthesis of complex molecules from relatively simple precursors has long been a goal for many organic chemists. The ability to selectively functionalize a molecule with minimal pre-activation can streamline syntheses and expand the opportunities to explore the utility of complex molecules in areas ranging from the pharmaceutical industry to materials science. Indeed, the issue of selectivity is paramount in the development of all C-H bond functionalization methods. Several groups have developed elegant approaches towards achieving selectivity in molecules that possess many sterically and electronically similar C-H bonds. Many of these approaches are discussed in detail in the accompanying articles in this special issue of Chemical Reviews. One approach

Composite Laser Ceramics by Advanced Bonding Technology

Science.gov (United States)

Kamimura, Tomosumi; Honda, Sawao

2018-01-01

Composites obtained by bonding materials with the same crystal structure and different chemical compositions can create new functions that do not exist in conventional concepts. We have succeeded in bonding polycrystalline YAG and Nd:YAG ceramics without any interstices at the bonding interface, and the bonding state of this composite was at the atomic level, similar to the grain boundary structure in ceramics. The mechanical strength of the bonded composite reached 278 MPa, which was not less than the strength of each host material (269 and 255 MPa). Thermal conductivity of the composite was 12.3 W/mK (theoretical value) which is intermediate between the thermal conductivities of YAG and Nd:YAG (14.1 and 10.2 W/mK, respectively). Light scattering cannot be detected at the bonding interface of the ceramic composite by laser tomography. Since the scattering coefficients of the monolithic material and the composite material formed by bonding up to 15 layers of the same materials were both 0.10%/cm, there was no occurrence of light scattering due to the bonding. In addition, it was not detected that the optical distortion and non-uniformity of the refractive index variation were caused by the bonding. An excitation light source (LD = 808 nm) was collimated to 200 μm and irradiated into a commercial 1% Nd:YAG single crystal, but fracture damage occurred at a low damage threshold of 80 kW/cm2. On the other hand, the same test was conducted on the bonded interface of 1% Nd:YAG-YAG composite ceramics fabricated in this study, but it was not damaged until the excitation density reached 127 kW/cm2. 0.6% Nd:YAG-YAG composite ceramics showed high damage resistance (up to 223 kW/cm2). It was concluded that composites formed by bonding polycrystalline ceramics are ideal in terms of thermo-mechanical and optical properties. PMID:29425152

Composite Laser Ceramics by Advanced Bonding Technology.

Science.gov (United States)

Ikesue, Akio; Aung, Yan Lin; Kamimura, Tomosumi; Honda, Sawao; Iwamoto, Yuji

2018-02-09

Composites obtained by bonding materials with the same crystal structure and different chemical compositions can create new functions that do not exist in conventional concepts. We have succeeded in bonding polycrystalline YAG and Nd:YAG ceramics without any interstices at the bonding interface, and the bonding state of this composite was at the atomic level, similar to the grain boundary structure in ceramics. The mechanical strength of the bonded composite reached 278 MPa, which was not less than the strength of each host material (269 and 255 MPa). Thermal conductivity of the composite was 12.3 W/mK (theoretical value) which is intermediate between the thermal conductivities of YAG and Nd:YAG (14.1 and 10.2 W/mK, respectively). Light scattering cannot be detected at the bonding interface of the ceramic composite by laser tomography. Since the scattering coefficients of the monolithic material and the composite material formed by bonding up to 15 layers of the same materials were both 0.10%/cm, there was no occurrence of light scattering due to the bonding. In addition, it was not detected that the optical distortion and non-uniformity of the refractive index variation were caused by the bonding. An excitation light source (LD = 808 nm) was collimated to 200 μm and irradiated into a commercial 1% Nd:YAG single crystal, but fracture damage occurred at a low damage threshold of 80 kW/cm². On the other hand, the same test was conducted on the bonded interface of 1% Nd:YAG-YAG composite ceramics fabricated in this study, but it was not damaged until the excitation density reached 127 kW/cm². 0.6% Nd:YAG-YAG composite ceramics showed high damage resistance (up to 223 kW/cm²). It was concluded that composites formed by bonding polycrystalline ceramics are ideal in terms of thermo-mechanical and optical properties.

The noncovalent bonding of antibiotics to a polytetrafluoroethylene-benzalkonium graft

International Nuclear Information System (INIS)

Harvey, R.A.; Greco, R.S.

1981-01-01

This study evaluates the noncovalent bonding of anionic antibiotics to polytetrafluoroethylene grafts using benzalkonium chloride as a cationic anchor. The binding of radiolabeled surfactants and antibiotics was evaluated by liquid scintillation and in an in vitro microbiologic assay against Staphylococcus aureus. Significant quantities of antibiotic were bound when the grafts were pretreated with benzalkonium in ethanol or aqueous solution at elevated temperature. Bound antibiotic is stable in aqueous salt solutions, but slowly dissociates in the presence of blood or serum. The ionic nature of the bonding process is clarified by the use of a variety of antibiotics and surfactants with complementary charges. The ability of the benzalkonium treated grafts to adsorb antibiotic from blood is, likewise, demonstrated and the possibility of concomitantly binding heparin and antibiotic simultaneously is evaluated. These studies support the ability to noncovalently bond antibiotics to polytetrafluoroethylene surfaces and form the basis of eventually utilizing these surfaces in the prevention of vascular prosthetic infections

Recrystallization texture in nickel heavily deformed by accumulative roll bonding

Science.gov (United States)

Mishin, O. V.; Zhang, Y. B.; Godfrey, A.

2017-07-01

The recrystallization behavior of Ni processed by accumulative roll bonding to a total accumulated von Mises strain of 4.8 has been examined, and analyzed with respect to heterogeneity in the deformation microstructure. The regions near the bonding interface are found to be more refined and contain particle deformation zones around fragments of the steel wire brush used to prepare the surface for bonding. Sample-scale gradients are also observed, manifested as differences between the subsurface, intermediate and central layers, where the distributions of texture components are different. These heterogeneities affect the progress of recrystallization. While the subsurface and near-interface regions typically contain lower frequencies of cube-oriented grains than anywhere else in the sample, a strong cube texture forms in the sample during recrystallization, attributed to both a high nucleation rate and fast growth rate of cube-oriented grains. The observations highlight the sensitivity of recrystallization to heterogeneity in the deformation microstructure and demonstrate the importance of characterizing this heterogeneity over several length scales.

Composite interlayer for diffusion bonding

International Nuclear Information System (INIS)

1976-01-01

A ductile interlayer is described, which is useful for transient liquid phase diffusion bonding of metallic articles; the interlayer consisting of a melting point depressant and a plurality of ductile lamellae which are free from carbides, aluminides and borides. The composition and fabrication of the lamellae, and the process for bonding the metallic articles, depend on the composition of the metals to be bonded, and are exemplified in the specification. (U.K.)

Bonding in Sulfur-Oxygen Compounds-HSO/SOH and SOO/OSO: An Example of Recoupled Pair π Bonding.

Science.gov (United States)

Lindquist, Beth A; Takeshita, Tyler Y; Woon, David E; Dunning, Thom H

2013-10-08

The ground states (X(2)A″) of HSO and SOH are extremely close in energy, yet their molecular structures differ dramatically, e.g., re(SO) is 1.485 Å in HSO and 1.632 Å in SOH. The SO bond is also much stronger in HSO than in SOH: 100.3 kcal/mol versus 78.8 kcal/mol [RCCSD(T)-F12/AVTZ]. Similar differences are found in the SO2 isomers, SOO and OSO, depending on whether the second oxygen atom binds to oxygen or sulfur. We report generalized valence bond and RCCSD(T)-F12 calculations on HSO/SOH and OSO/SOO and analyze the bonding in all four species. We find that HSO has a shorter and stronger SO bond than SOH due to the presence of a recoupled pair bond in the π(a″) system of HSO. Similarly, the bonding in SOO and OSO differs greatly. SOO is like ozone and has substantial diradical character, while OSO has two recoupled pair π bonds and negligible diradical character. The ability of the sulfur atom to form recoupled pair bonds provides a natural explanation for the dramatic variation in the bonding in these and many other sulfur-oxygen compounds.

Study of ozone gas formed in the industrial radiation process with cobalt-60 and its impact on the environment

International Nuclear Information System (INIS)

Uzueli, Daniel Henrique

2013-01-01

The radiation processing is present in various products such as foods, medical disposable, electrical cables, gems, among others. This process aims to improve the properties, sterilize or sanitize irradiated products. In industrial irradiators facilities, electromagnetic radiation (gamma and X-rays) or electrons before they interact with the products in processing, there are a layer of air. To interact with this air layer, it causes radiolytic effects on the molecules present in the ambient atmosphere, and the main interaction are with the oxygen molecules that have their bonds broken, separating them into two highly reactive atoms that recombine with the other molecule of oxygen to form ozone gas. In this work it was studied the formation, decay and dispersion of ozone in industrial gamma irradiators facilities that use cobalt-60 as a source of radiation. The monitoring of ozone concentration was performed by optical absorption method in a commercial monitor. (author)

Halogen-bonded network of trinuclear copper(II 4-iodopyrazolate complexes formed by mutual breakdown of chloroform and nanojars

Directory of Open Access Journals (Sweden)

Stuart A. Surmann

2016-11-01

Full Text Available Crystals of bis(tetrabutylammonium di-μ3-chlorido-tris(μ2-4-iodopyrazolato-κ2N:N′tris[chloridocuprate(II] 1,4-dioxane hemisolvate, (C16H36N2[Cu3(C3H2IN23Cl5]·0.5C4H8O or (Bu4N2[CuII3(μ3-Cl2(μ-4-I-pz3Cl3]·0.5C4H8O, were obtained by evaporating a solution of (Bu4N2[{CuII(μ-OH(μ-4-I-pz}nCO3] (n = 27–31 nanojars in chloroform/1,4-dioxane. The decomposition of chloroform in the presence of oxygen and moisture provides HCl, which leads to the breakdown of nanojars to the title trinuclear copper(II pyrazolate complex, and possibly CuII ions and free 4-iodopyrazole. CuII ions, in turn, act as catalyst for the accelerated decomposition of chloroform, ultimately leading to the complete breakdown of nanojars. The crystal structure presented here provides the first structural description of a trinuclear copper(II pyrazolate complex with iodine-substituted pyrazoles. In contrast to related trinuclear complexes based on differently substituted 4-R-pyrazoles (R = H, Cl, Br, Me, the [Cu3(μ-4-I-pz3Cl3] core in the title complex is nearly planar. This difference is likely a result of the presence of the iodine substituent, which provides a unique, novel feature in copper pyrazolate chemistry. Thus, the iodine atoms form halogen bonds with the terminal chlorido ligands of the surrounding complexes [mean length of I...Cl contacts = 3.48 (1 Å], leading to an extended two-dimensional, halogen-bonded network along (-110. The cavities within this framework are filled by centrosymmetric 1,4-dioxane solvent molecules, which create further bridges via C—H...Cl hydrogen bonds with terminal chlorido ligands of the trinuclear complex not involved in halogen bonding.

27 CFR 28.286 - Receipt in customs bonded warehouse.

Science.gov (United States)

2010-04-01

... 27 Alcohol, Tobacco Products and Firearms 1 2010-04-01 2010-04-01 false Receipt in customs bonded... in Customs Bonded Warehouse § 28.286 Receipt in customs bonded warehouse. On receipt of the distilled spirits or wine and the related TTB Form 5100.11 or 5110.30 as the case may be, the customs officer in...

Apatite and sodalite based glass-bonded waste forms for immobilization of 129I and mixed halide radioactive wastes

Energy Technology Data Exchange (ETDEWEB)

Goel, Ashutosh [Rutgers Univ., New Brunswick, NJ (United States); McCloy, John S. [Washington State Univ., Pullman, WA (United States); Riley, Brian J. [Pacific Northwest National Lab. (PNNL), Richland, WA (United States); Matyas, Josef [Pacific Northwest National Lab. (PNNL), Richland, WA (United States)

2017-12-30

The goal of the project was to utilize the knowledge accumulated by the team, in working with minerals for chloride wastes and biological apatites, toward the development of advanced waste forms for immobilizing 129I and mixed-halide wastes. Based on our knowledge, experience, and thorough literature review, we had selected two minerals with different crystal structures and potential for high chemical durability, sodalite and CaP/PbV-apatite, to form the basis of this project. The focus of the proposed effort was towards: (i) low temperature synthesis of proposed minerals (iodine containing sodalite and apatite) leading to the development of monolithic waste forms, (ii) development of a fundamental understanding of the atomic-scale to meso-scale mechanisms of radionuclide incorporation in them, and (iii) understanding of the mechanism of their chemical corrosion, alteration mechanism, and rates. The proposed work was divided into four broad sections. deliverables. 1. Synthesis of materials 2. Materials structural and thermal characterization 3. Design of glass compositions and synthesis glass-bonded minerals, and 4. Chemical durability testing of materials.

Pressure-assisted reaction bonding between W and Si80Ge20 alloy with Ni as the interlayer

International Nuclear Information System (INIS)

Xu, Y.; Laabs, F.C.; Beaudry, B.J.; Gschneidner, K.A. Jr.

1991-01-01

The conditions and reaction mechanism of W/Ni/Si 80 Ge 20 hot-press bonding have been studied. It was found that a Ni/Si 80 Ge 20 bond can be formed using low pressure, 19.6 MPa, in the temperature range between 780 and 900 degree C in a short time. The kinetics follows a parabolic pattern, suggesting it is a diffusion-controlled process. The activation energy is 2.7 eV and the parabolic rate constant is given by K P = 4.0 x 10 14 exp(-3.2x10 4 /T) (μm 2 /min). The bonding interface has a multilayered structure. A phenomenological mechanism of the bonding formation has been proposed based on scanning electron microscopy observations and energy dispersive spectroscopy. The cracking problem due to thermal stress is discussed based on Oxx's equation. It was found that bonds free from cracks in the Si 80 Ge 20 alloy are formed when the Ni consumption (as measured by the thickness of the nickel layer) is sufficiently small ( 4 . As an interlayer, nickel can join the tungsten sheet and the Si 80 Ge 20 together. It has been also demonstrated that a thin nickel layer formed by vapor deposition on a tungsten sheet may be used as the interlayer in place of nickel sheet

On the photostability of the disulfide bond

DEFF Research Database (Denmark)

Stephansen, Anne Boutrup; Larsen, Martin Alex Bjørn; Klein, Liv Bærenholdt

2014-01-01

Photostability is an essential property of molecular building blocks of nature. Disulfides are central in the structure determination of proteins, which is in striking contradiction to the result that the S-S bond is a photochemically labile structural entity that cleaves to form free radicals upon...... on a sub 50 fs timescale without further ado. In a cyclic motif resembling the cysteine-disulfide bond in proteins, light can perturb the S-S bond to generate short-lived diradicaloid species, but the sulfur atoms are conformationally restricted by the ring that prevents the sulfur atoms from flying apart...... the photostability of disulfide-bonds must be ascribed a cyclic structural arrangement....

H2XP:OH2 Complexes: Hydrogen vs. Pnicogen Bonds

Directory of Open Access Journals (Sweden)

Ibon Alkorta

2016-02-01

Full Text Available A search of the Cambridge Structural Database (CSD was carried out for phosphine-water and arsine-water complexes in which water is either the proton donor in hydrogen-bonded complexes, or the electron-pair donor in pnicogen-bonded complexes. The range of experimental P-O distances in the phosphine complexes is consistent with the results of ab initio MP2/aug’-cc-pVTZ calculations carried out on complexes H2XP:OH2, for X = NC, F, Cl, CN, OH, CCH, H, and CH3. Only hydrogen-bonded complexes are found on the H2(CH3P:HOH and H3P:HOH potential surfaces, while only pnicogen-bonded complexes exist on H2(NCP:OH2, H2FP:OH2, H2(CNP:OH2, and H2(OHP:OH2 surfaces. Both hydrogen-bonded and pnicogen-bonded complexes are found on the H2ClP:OH2 and H2(CCHP:OH2 surfaces, with the pnicogen-bonded complexes more stable than the corresponding hydrogen-bonded complexes. The more electronegative substituents prefer to form pnicogen-bonded complexes, while the more electropositive substituents form hydrogen-bonded complexes. The H2XP:OH2 complexes are characterized in terms of their structures, binding energies, charge-transfer energies, and spin-spin coupling constants 2hJ(O-P, 1hJ(H-P, and 1J(O-H across hydrogen bonds, and 1pJ(P-O across pnicogen bonds.

Hydrogen bonding in tight environments

DEFF Research Database (Denmark)

Pirrotta, Alessandro; Solomon, Gemma C.; Franco, Ignacio

2016-01-01

The single-molecule force spectroscopy of a prototypical class of hydrogen-bonded complexes is computationally investigated. The complexes consist of derivatives of a barbituric acid and a Hamilton receptor that can form up to six simultaneous hydrogen bonds. The force-extension (F-L) isotherms...... of the host-guest complexes are simulated using classical molecular dynamics and the MM3 force field, for which a refined set of hydrogen bond parameters was developed from MP2 ab initio computations. The F-L curves exhibit peaks that signal conformational changes during elongation, the most prominent...... of which is in the 60-180 pN range and corresponds to the force required to break the hydrogen bonds. These peaks in the F-L curves are shown to be sensitive to relatively small changes in the chemical structure of the host molecule. Thermodynamic insights into the supramolecular assembly were obtained...

Relationship between surface area for adhesion and tensile bond strength--evaluation of a micro-tensile bond test.

Science.gov (United States)

Sano, H; Shono, T; Sonoda, H; Takatsu, T; Ciucchi, B; Carvalho, R; Pashley, D H

1994-07-01

The purpose of this study was to test the null hypothesis that there is no relationship between the bonded surface area of dentin and the tensile strength of adhesive materials. The enamel was removed from the occlusal surface of extracted human third molars, and the entire flat surface was covered with resin composite bonded to the dentin to form a flat resin composite crown. Twenty-four hours later, the bonded specimens were sectioned parallel to the long axis of the tooth into 10-20 thin sections whose upper part was composed of resin composite with the lower half being dentin. These small sections were trimmed using a high speed diamond bur into an hourglass shape with the narrowest portion at the bonded interface. Surface area was varied by altering the specimen thickness and width. Tensile bond strength was measured using custom-made grips in a universal testing machine. Tensile bond strength was inversely related to bonded surface area. At surface areas below 0.4 mm2, the tensile bond strengths were about 55 MPa for Clearfil Liner Bond 2 (Kuraray Co., Ltd.), 38 MPa for Scotchbond MP (3M Dental Products), and 20 MPa for Vitremer (3M Dental Products). At these small surface areas all of the bond failures were adhesive in nature. This new method permits measurement of high bond strengths without cohesive failure of dentin. It also permits multiple measurements to be made within a single tooth.

Solid Liquid Interdiffusion Bonding of (Pb, Sn)Te Thermoelectric Modules with Cu Electrodes Using a Thin-Film Sn Interlayer

Science.gov (United States)

Chuang, T. H.; Lin, H. J.; Chuang, C. H.; Yeh, W. T.; Hwang, J. D.; Chu, H. S.

2014-12-01

A (Pb, Sn)Te thermoelectric element plated with a Ni barrier layer and a Ag reaction layer has been joined with a Cu electrode coated with Ag and Sn thin films using a solid-liquid interdiffusion bonding method. This method allows the interfacial reaction between Ag and Sn such that Ag3Sn intermetallic compounds form at low temperature and are stable at high temperature. In this study, the bonding strength was about 6.6 MPa, and the specimens fractured along the interface between the (Pb, Sn)Te thermoelectric element and the Ni barrier layer. Pre-electroplating a film of Sn with a thickness of about 1 μm on the thermoelectric element and pre-heating at 250°C for 3 min ensures the adhesion between the thermoelectric material and the Ni barrier layer. The bonding strength is thus increased to a maximal value of 12.2 MPa, and most of the fractures occur inside the thermoelectric material. During the bonding process, not only the Ag3Sn intermetallics but also Cu6Sn5 forms at the Ag3Sn/Cu interface, which transforms into Cu3Sn with increases in the bonding temperature or bonding time.

Proton transfer in a short hydrogen bond caused by solvation shell fluctuations: an ab initio MD and NMR/UV study of an (OHO)(-) bonded system.

Science.gov (United States)

Pylaeva, Svetlana; Allolio, Christoph; Koeppe, Benjamin; Denisov, Gleb S; Limbach, Hans-Heinrich; Sebastiani, Daniel; Tolstoy, Peter M

2015-02-14

We present a joint experimental and quantum chemical study on the influence of solvent dynamics on the protonation equilibrium in a strongly hydrogen bonded phenol-acetate complex in CD2Cl2. Particular attention is given to the correlation of the proton position distribution with the internal conformation of the complex itself and with fluctuations of the aprotic solvent. Specifically, we have focused on a complex formed by 4-nitrophenol and tetraalkylammonium-acetate in CD2Cl2. Experimentally we have used combined low-temperature (1)H and (13)C NMR and UV-vis spectroscopy and showed that a very strong OHO hydrogen bond is formed with proton tautomerism (PhOH···(-)OAc and PhO(-)···HOAc forms, both strongly hydrogen bonded). Computationally, we have employed ab initio molecular dynamics (70 and 71 solvent molecules, with and without the presence of a counter-cation, respectively). We demonstrate that the relative motion of the counter-cation and the "free" carbonyl group of the acid plays the major role in the OHO bond geometry and causes proton "jumps", i.e. interconversion of PhOH···(-)OAc and PhO(-)···HOAc tautomers. Weak H-bonds between CH(CD) groups of the solvent and the oxygen atom of carbonyl stabilize the PhOH···(-)OAc type of structures. Breaking of CH···O bonds shifts the equilibrium towards PhO(-)···HOAc form.

Development of a copper alloy to beryllium HIP bonding technology for the ITER first wall

International Nuclear Information System (INIS)

Sherlock, P.; Peacock, A.T.; Mc Callum, A.D.

2005-01-01

The primary first wall (PFW) panels of the ITER blanket concept comprise a bi-metallic copper alloy/stainless steel water-cooled heatsink faced with a plasma facing material. Precipitation strengthened CuCrZr is one option for the copper alloy of the heatsink; beryllium, in the form of tiles is an option for the plasma facing material. Over recent years, the technology needed to HIP bond the beryllium tiles to CuCrZr alloy has been developed. This paper describes small samples and larger mock-ups produced during the development of this HIP bonding technology and outlines how structural analyses were used to gain an understanding of the bonding process and refine the design

[Bonding strength of resin and tooth enamel after teeth bleaching with cold plasma].

Science.gov (United States)

Zhu, Meng-meng; Wang, Guo-min; Sun, Ke; Li, Ying-long; Pan, Jie

2016-02-18

To investigate the immediate bond strength and surface structure of resin and the tooth enamel which treated by cold plasma. In the study, 40 bovine incisors were divided into two equal parts. In this sense, all enamel adhesive samples were prepared and then randomly divided into 4 groups (n =20). group 1: acid + single bond 2+resin composite (control group); group 2:beyond bleaching+ acid+single bond 2+resin composite; group 3: treated by cold plasma for 5 minutes+ acid+single bond 2+resin composite; group 4: treated by cold plasma for 5 minutes+single bond 2+resin composite. Single bond 2 bonding system and Filtek Z250 resin were used in this experiment. The shear bond strength was tested by universal testing machine. The surface of the enamel in different processes was observed by scanning electron microscope (SEM). Statistical analyses by the single factor analysis of variance and multiple pairwise comparisons were performed with SPSS 17.0 . The shear bond strength of group 4 (8.60 MPa) was significantly lower than that of the other three groups (Penamel treated by cold plasma had slight molten form, which was different from etched enamel surface.The fractured surface of group 3 was mix fracture, which was similar to the control group (group 1). Compared with the conventional clinic bleaching, immediate bond strength of resin-enamel that treated by cold plasma has not been affected.

Chemically bonded ceramic matrix composites: Densification and conversion to diffusion bonding

International Nuclear Information System (INIS)

Johnson, B.R.; Guelguen, M.A.; Kriven, W.M.

1995-01-01

Chemically bonded ceramics appear to be a promising alternative route for near-net shape fabrication of multi-phase ceramic matrix composites (CMC's). The hydraulic (and refractory) properties of fine mono-calcium aluminate (CaAl 2 O 4 ) powders were used as the chemically bonding matrix phase, while calcia stabilized zirconia powders were the second phase material. Samples containing up to 70 wt% (55 vol%) zirconia have been successfully compacted and sintered. Various processing techniques were evaluated. Processing was optimized based on material properties, dilatometry and simultaneous thermal analysis (DTA/TGA). The physical characteristics of this novel CMC were characterized by hardness, density, and fracture toughness testing. Microstructures were evaluated by SEM and phase identification was verified using XRD

Synergistic effect of displacement damage, helium and hydrogen on microstructural change of SiC/SiC composites fabricated by reaction bonding process

Energy Technology Data Exchange (ETDEWEB)

Taguchi, T.; Igawa, N.; Wakai, E.; Jitsukawa, S. [Japan Atomic Energy Agency, Naga-gun, Ibaraki-ken (Japan); Hasegawa, A. [Tohoku Univ., Dept. of Quantum Science and Energy Engr., Sendai (Japan)

2007-07-01

Full text of publication follows: Continuous silicon carbide (SiC) fiber reinforced SiC matrix (SiC/SiC) composites are known to be attractive candidate materials for first wall and blanket components in fusion reactors. In the fusion environment, helium and hydrogen are produced and helium bubbles can be formed in the SiC by irradiation of 14-MeV neutrons. Authors reported the synergistic effect of helium and hydrogen as transmutation products on swelling behavior and microstructural change of the SiC/SiC composites fabricated by chemical vapor infiltration (CVI) process. Authors also reported about the fabrication of high thermal conductive SiC/SiC composites by reaction bonding (RB) process. The matrix fabricated by RB process has different microstructures such as bigger grain size of SiC and including Si phase as second phase from that by CVI process. It is, therefore, investigated the synergistic effect of displacement damage, helium and hydrogen as transmutation products on the microstructure of SiC/SiC composite by RB process in this study. The SiC/SiC composites by RB process were irradiated by the simultaneous triple ion irradiation (Si{sup 2+}, He{sup +} and H{sup +}) at 800 and 1000 deg. C. The displacement damage was induced by 6.0 MeV Si{sup 2+} ion irradiation up to 10 dpa. The microstructures of irradiated SiC/SiC composites by RB process were observed by TEM. The double layer of carbon and SiC as interphase between fiber and matrix by a chemical vapor deposition (CVD) was coated on SiC fibers in the SiC/SiC composites by RB process. The TEM observation revealed that He bubbles were formed both in the matrix by RB and SiC interphase by CVD process. Almost all He bubbles were formed at the grain boundary in SiC interphase by CVD process. On the other hand, He bubbles were formed both at the grain boundary and in Si grain of the matrix by RB process. The average size of He bubbles in the matrix by RB was smaller than that in SiC interphase by CVD

Manufacturing and sustainability of bonding systems for grinding tools

OpenAIRE

Linke, B

2016-01-01

© 2016, German Academic Society for Production Engineering (WGP). Grinding and honing processes are quality-defining operations in the production of many modern products. Process performance and product quality are contingent on selecting the correct abrasive tool for a specific application. Thus, tools with different bonding systems are used, namely resin bonded tools, vitrified bonded tools, and metallic bonded tools. Tool manufacturers have great knowledge in the choice and intricate prod...

One period coupon bond valuation with revised first passage time approach and the application in Indonesian corporate bond

Science.gov (United States)

Maruddani, Di Asih I.; Rosadi, Dedi; Gunardic, Abdurakhman

2015-02-01

The value of a corporate bond is conventionally expressed in terms of zero coupon bond. In practice, the most common form of debt instrument is coupon bond and allows early default before maturity as safety covenant for the bondholder. This paper study valuation for one period coupon bond, a coupon bond that only give one time coupon at the bond period. It assumes that the model give bondholder the right to reorganize a firm if its value falls below a given barrier. Revised first passage time approach is applied for default time rule. As a result, formulas of equity, liability, and probability of default is derived for this specified model. Straightforward integration under risk neutral pricing is used for deriving those formulas. For the application, bond of Bank Rakyat Indonesia (BRI) as one of the largest bank in Indonesia is analyzed. R computing show that value of the equity is IDR 453.724.549.000.000, the liability is IDR 2.657.394.000.000, and the probability if default is 5.645305E-47 %.

Advanced Wear Simulation for Bulk Metal Forming Processes

Directory of Open Access Journals (Sweden)

Behrens Bernd-Arno

2016-01-01

Full Text Available In the recent decades the finite element method has become an essential tool for the cost-efficient virtual process design in the metal forming sector in order to counter the constantly increasing quality standards, particularly from the automotive industry as well as intensified international competition in the forging industry. An optimized process design taking precise tool wear prediction into account is a way to increase the cost-efficiency of the bulk metal forming processes. The main objective of the work presented in this paper is a modelling algorithm, which allows predicting die wear with respect to a geometry update during the forming simulation. Changes in the contact area caused by geometry update lead to the different die wear distribution. It primarily concerns the die areas, which undergo high thermal and mechanical loads.

Automatic centring and bonding of lenses

Science.gov (United States)

Krey, Stefan; Heinisch, J.; Dumitrescu, E.

2007-05-01

We present an automatic bonding station which is able to center and bond individual lenses or doublets to a barrel with sub micron centring accuracy. The complete manufacturing cycle includes the glue dispensing and UV curing. During the process the state of centring is continuously controlled by the vision software, and the final result is recorded to a file for process statistics. Simple pass or fail results are displayed to the operator at the end of the process.

Microstructural and microanalysis investigations of bond titanium grade1/low alloy steel st52-3N obtained by explosive welding

Energy Technology Data Exchange (ETDEWEB)

Gloc, Michal, E-mail: michalgloc@wp.pl [Warsaw University of Technology, Faculty of Materials Science and Engineering (Poland); Wachowski, Marcin [Military University of Technology in Warsaw, Faculty of Mechanical Engineering (Poland); Plocinski, Tomasz; Kurzydlowski, Krzysztof Jan [Warsaw University of Technology, Faculty of Materials Science and Engineering (Poland)

2016-06-25

Explosive welding is a solid state welding process that is used for the metallurgical joining of two or more dissimilar metals. In this process, forces of controlled detonations are utilized to accelerate one metal plate into another. As a result, an atomic bond is created. It is considered as a cold-welding process since it allows metals to be joined without losing their pre-bonding properties. The metal plates are joined under the influence of very high pressure which causes local plastic deformation and grain refining at the bond interface. Moreover, between the parent and flyer plate some local melting zones are formed. The explosively cladded steel plates are used in the chemical, petrochemical and nuclear industry due to their good corrosion resistance and mechanical properties. In this work, microstructural and chemical analyses of clad plates obtained by the explosive method are presented. The clad plates studied were made of titanium grade 1 explosively bonded with a thin layer of st52-3N low alloy steel. The microstructure was evaluated using light (LM) and scanning electron microscopes (SEM), while chemical composition was assessed using energy dispersive spectroscopy (EDS). It was found that the bond area had different microstructure, chemical composition and microhardness than the bonded materials. In the junction between the base steel and the cladding, a strongly defected transient zone with altered chemical composition in comparison with the bonded metals was revealed. - Highlights: • Explosive welding as an effective method for joining similar or dissimilar metals. • Slip brands, elongated grains and twins correlated with high plastic deformations. • Investigations of the local melted zones, formed at the interface of the clads. • Mechanical properties connected with microstructural changes and deformation.

A comparative study of ibuprofen and ketoprofen glass-forming liquids by molecular dynamics simulations

Science.gov (United States)

Ottou Abe, M. T.; Correia, N. T.; Ndjaka, J. M. B.; Affouard, F.

2015-10-01

In this paper, structural and dynamical properties of ibuprofen and ketoprofen glass-forming liquids have been investigated by means of molecular dynamics simulations. Molecular mobility of both materials is analyzed with respect to the different inter-molecular linear/cyclic hydrogen bonding associations. For ibuprofen, the dominant organization is found to be composed of small hydrogen bonding aggregates corresponding to cyclic dimers through the carboxyl group. For ketoprofen, the propensity of cyclic dimers is significantly reduced by the formation of hydrogen bonds with the ketone oxygen of the molecule altering the hydrogen bond (HB) associating structures that can be formed and thus molecular dynamics. The issue of the presence/absence of the peculiar low frequency Debye-type process in dielectric relaxation spectroscopy (DRS) data in these materials is addressed. Results obtained from simulations confirm that the Debye process originates from the internal cis-trans conversion of the —COOH carboxyl group. It is shown that the specific intermolecular HB structures associated to a given profen control the main dynamical features of this conversion, in particular its separation from the α-process, which make it detectable or not from DRS. For ibuprofen, the possible role of the —CCCO torsion motion, more "local" than the —COOH motion since it is less influenced by the intermolecular HBs, is suggested in the microscopic origin of the quite intense secondary γ-relaxation process detected from DRS.

A dense and strong bonding collagen film for carbon/carbon composites

Energy Technology Data Exchange (ETDEWEB)

Cao, Sheng; Li, Hejun, E-mail: lihejun@nwpu.edu.cn; Li, Kezhi; Lu, Jinhua; Zhang, Leilei

2015-08-30

Graphical abstract: - Highlights: • Significantly enhancement of biocompatibility on C/C composites by preparing a collagen film. • The dense and continuous collagen film had a strong bonding strength with C/C composites after dehydrathermal treatment (DHT) crosslink. • Numerous oxygen-containing functional groups formed on the surface of C/C composites without matrix damage. - Abstract: A strong bonding collagen film was successfully prepared on carbon/carbon (C/C) composites. The surface conditions of the modified C/C composites were detected by contact angle measurements, scanning electron microscope (SEM), X-ray photoelectron spectroscopy (XPS) and Raman spectra. The roughness, optical morphology, bonding strength and biocompatibility of collagen films at different pH values were detected by confocal laser scanning microscope (CLSM), universal test machine and cytology tests in vitro. After a 4-h modification in 30% H{sub 2}O{sub 2} solution at 100 °C, the contact angle on the surface of C/C composites was decreased from 92.3° to 65.3°. Large quantities of hydroxyl, carboxyl and carbonyl functional groups were formed on the surface of the modified C/C composites. Then a dense and continuous collagen film was prepared on the modified C/C substrate. Bonding strength between collagen film and C/C substrate was reached to 8 MPa level when the pH value of this collagen film was 2.5 after the preparing process. With 2-day dehydrathermal treatment (DHT) crosslinking at 105 °C, the bonding strength was increased to 12 MPa level. At last, the results of in vitro cytological test showed that this collagen film made a great improvement on the biocompatibility on C/C composites.

A dense and strong bonding collagen film for carbon/carbon composites

International Nuclear Information System (INIS)

Cao, Sheng; Li, Hejun; Li, Kezhi; Lu, Jinhua; Zhang, Leilei

2015-01-01

Graphical abstract: - Highlights: • Significantly enhancement of biocompatibility on C/C composites by preparing a collagen film. • The dense and continuous collagen film had a strong bonding strength with C/C composites after dehydrathermal treatment (DHT) crosslink. • Numerous oxygen-containing functional groups formed on the surface of C/C composites without matrix damage. - Abstract: A strong bonding collagen film was successfully prepared on carbon/carbon (C/C) composites. The surface conditions of the modified C/C composites were detected by contact angle measurements, scanning electron microscope (SEM), X-ray photoelectron spectroscopy (XPS) and Raman spectra. The roughness, optical morphology, bonding strength and biocompatibility of collagen films at different pH values were detected by confocal laser scanning microscope (CLSM), universal test machine and cytology tests in vitro. After a 4-h modification in 30% H 2 O 2 solution at 100 °C, the contact angle on the surface of C/C composites was decreased from 92.3° to 65.3°. Large quantities of hydroxyl, carboxyl and carbonyl functional groups were formed on the surface of the modified C/C composites. Then a dense and continuous collagen film was prepared on the modified C/C substrate. Bonding strength between collagen film and C/C substrate was reached to 8 MPa level when the pH value of this collagen film was 2.5 after the preparing process. With 2-day dehydrathermal treatment (DHT) crosslinking at 105 °C, the bonding strength was increased to 12 MPa level. At last, the results of in vitro cytological test showed that this collagen film made a great improvement on the biocompatibility on C/C composites

Radiation-induced cleavage of disulfide bonds in proteins. Clivage radiolytique des ponts disulfure des proteines

Energy Technology Data Exchange (ETDEWEB)

Favaudon, V; Tourbez, H; Lhoste, J M [Paris-11 Univ., 91 - Orsay (FR); Houee-Levin, C [Paris-5 Univ., 75 (FR)

1991-06-01

The reduction of the disulfide bonds in apo-Riboflavin-Binding Protein (apoRBP) by the CO{sub 2}{sup -}{center dot} radical occurred under {gamma}-ray irradiation as a chain reaction whose efficiency increased upon acidification of the medium. Pulse-radiolysis analysis showed a rapid one-electron oxidation of the disulfide bonds yielding the anionic or protonated form of the disulfide radical. The main decay path of this radical under acidic conditions consisted of the rapid formation of a thiyl radical intermediate in equilibrium with the closed, cyclic form. At pH 8 the disulfide radical anion decayed via intramolecular and/or intermolecular routes including disproportionation, protein-protein crosslinking, non-dismutative recombination processes, and reaction with sulfhydryl groups in pre-reduced systems.

Nickel-Catalyzed Alkoxy-Alkyl Interconversion with Alkylborane Reagents through C−O Bond Activation of Aryl and Enol Ethers

KAUST Repository

Guo, Lin

2016-11-07

A nickel-catalyzed alkylation of polycyclic aromatic methyl ethers as well as methyl enol ethers with B-alkyl 9-BBN and trialkylborane reagents that involves the cleavage of stable C(sp2)−OMe bonds is described. The transformation has a wide substrate scope and good chemoselectivity profile while proceeding under mild reaction conditions; it provides a versatile way to form C(sp2)−C(sp3) bonds that does not suffer from β-hydride elimination. Furthermore, a selective and sequential alkylation process by cleavage of inert C−O bonds is presented to demonstrate the advantage of this method.

Learning Probabilistic Models of Hydrogen Bond Stability from Molecular Dynamics Simulation Trajectories

KAUST Repository

Chikalov, Igor

2011-04-02

Hydrogen bonds (H-bonds) play a key role in both the formation and stabilization of protein structures. H-bonds involving atoms from residues that are close to each other in the main-chain sequence stabilize secondary structure elements. H-bonds between atoms from distant residues stabilize a protein’s tertiary structure. However, H-bonds greatly vary in stability. They form and break while a protein deforms. For instance, the transition of a protein from a nonfunctional to a functional state may require some H-bonds to break and others to form. The intrinsic strength of an individual H-bond has been studied from an energetic viewpoint, but energy alone may not be a very good predictor. Other local interactions may reinforce (or weaken) an H-bond. This paper describes inductive learning methods to train a protein-independent probabilistic model of H-bond stability from molecular dynamics (MD) simulation trajectories. The training data describes H-bond occurrences at successive times along these trajectories by the values of attributes called predictors. A trained model is constructed in the form of a regression tree in which each non-leaf node is a Boolean test (split) on a predictor. Each occurrence of an H-bond maps to a path in this tree from the root to a leaf node. Its predicted stability is associated with the leaf node. Experimental results demonstrate that such models can predict H-bond stability quite well. In particular, their performance is roughly 20% better than that of models based on H-bond energy alone. In addition, they can accurately identify a large fraction of the least stable H-bonds in a given conformation. The paper discusses several extensions that may yield further improvements.

INVESTMENTS IN BONDS ON ROMANIA’S CAPITAL MARKET

Directory of Open Access Journals (Sweden)

ILIE RĂSCOLEAN

2010-01-01

Full Text Available Capital market, both the primary and secondary record financial transactions not only through property titles, but also issues debt securities, designed to attract monetary funds in the form of loans or medium term. Bonds are securities, consisting of a long-term debt on a company giving the holder of Bonds (Bondholders claim equal rights, corresponding nominal value of the bond. Bonds can be bought either in the public offering period, from banks or corporations Brokerage Financial Services Distributors, or from the stock through a brokerage firm by a procedure similar to that for action. Investing in bonds also entails risks, among which include the risk of default, interest rate risks and currency risks.

Investigation of microstructural evolution and electrical properties for Ni-Sn transient liquid-phase sintering bonding

Science.gov (United States)

Feng, Hong-Liang; Huang, Ji-Hua; Yang, Jian; Zhou, Shao-Kun; Zhang, Rong; Wang, Yue; Chen, Shu-Hai

2017-11-01

Ni/Ni-Sn/Ni sandwiched simulated package structures were successfully bonded under low temperature and low pressure by Ni-Sn transient liquid-phase sintering bonding. The results show that, after isothermally holding for 240 min at 300 °C and 180 min at 340 °C, Sn was completely transformed into Ni3Sn4 intermetallic compounds. When the Ni3Sn4 phases around Ni particles were pressed together, the porosity of the bonding layer increased, which obviously differed from the normal sintering densification process. With further analysis of this phenomenon, it was found that large volume shrinkage (14.94% at 340 °C) occurred when Ni reacted with Sn to form Ni3Sn4, which caused void formation. A mechanistic model of the microstructural evolution in the bonding layer was proposed. Meanwhile, the resistivity of the bonding layer was measured and analyzed by using the four-probe method; the microstructural evolution was well reflected by the resistivity of the bonding layer. The relationship between the resistivity and microstructure was also discussed in detail.[Figure not available: see fulltext.

A novel bonding method for fabrication of PET planar nanofluidic chip with low dimension loss and high bonding strength

International Nuclear Information System (INIS)

Yin, Zhifu; Zou, Helin; Sun, Lei; Xu, Shenbo; Qi, Liping

2015-01-01

Plastic planar nanofluidic chips are becoming increasingly important for biological and chemical applications. However, the majority of the present bonding methods for planar nanofluidic chips suffer from high dimension loss and low bonding strength. In this work, a novel thermal bonding technique based on O 2 plasma and ethanol treatment was proposed. With the assistance of O 2 plasma and ethanol, the PET (polyethylene terephthalate) planar nanofluidic chip can be bonded at a low bonding temperature of 50 °C. To increase the bonding rate and bonding strength, the O 2 plasma parameters and thermal bonding parameters were optimized during the bonding process. The tensile test indicates that the bonding strength of the PET planar nanofluidic chip can reach 0.954 MPa, while the auto-fluorescence test demonstrates that there is no leakage or blockage in any of the bonded micro- or nanochannels. (paper)

Disulfide bond within mu-calpain active site inhibits activity and autolysis.

Science.gov (United States)

Lametsch, René; Lonergan, Steven; Huff-Lonergan, Elisabeth

2008-09-01

Oxidative processes have the ability to influence mu-calpain activity. In the present study the influence of oxidation on activity and autolysis of mu-calpain was examined. Furthermore, LC-MS/MS analysis was employed to identify and characterize protein modifications caused by oxidation. The results revealed that the activity of mu-calpain is diminished by oxidation with H2O2 in a reversible manner involving cysteine and that the rate of autolysis of mu-calpain concomitantly slowed. The LC-MS/MS analysis of the oxidized mu-calpain revealed that the amino acid residues 105-133 contained a disulfide bond between Cys(108) and Cys(115). The finding that the active site cysteine in mu-calpain is able to form a disulfide bond has, to our knowledge, not been reported before. This could be part of a unique oxidation mechanism for mu-calpain. The results also showed that the formation of the disulfide bond is limited in the control (no oxidant added), and further limited in a concentration-dependent manner when beta-mercaptoethanol is added. However, the disulfide bond is still present to some extent in all conditions indicating that the active site cysteine is potentially highly susceptible to the formation of this intramolecular disulfide bond.

Solid Liquid Interdiffusion Bonding of Zn4Sb3 Thermoelectric Material with Cu Electrode

Science.gov (United States)

Lin, Y. C.; Lee, K. T.; Hwang, J. D.; Chu, H. S.; Hsu, C. C.; Chen, S. C.; Chuang, T. H.

2016-10-01

The ZnSb intermetallic compound may have thermoelectric applications because it is low in cost and environmentally friendly. In this study, a Zn4Sb3 thermoelectric element coated with a Ni barrier layer and a Ag reaction layer was bonded with a Ag-coated Cu electrode using a Ag/Sn/Ag solid-liquid interdiffusion bonding process. The results indicated that a Ni5Zn21 intermetallic phase formed easily at the Zn4Sb3/Ni interface, leading to sound adhesion. In addition, Sn film was found to react completely with the Ag layer to form a Ag3Sn intermetallic layer having a melting point of 480°C. The resulting Zn4Sb3 thermoelectric module can be applied at the optimized operation temperature (400°C) of Zn4Sb3 material as a thermoelectric element. The bonding strengths ranged from 14.9 MPa to 25.0 MPa, and shear tests revealed that the Zn4Sb3/Cu-joints fractured through the interior of the thermoelectric elements.

Investigating Resulting Residual Stresses during Mechanical Forming Process

Science.gov (United States)

Akinlabi, Stephen A.; Fatoba, Olawale S.; Mashinini, Peter M.; Akinlabi, Esther T.

2018-03-01

Most manufacturing processes such as machining, welding, heat treatment, laser forming, laser cladding and, laser metal deposition, etc. are subjected to a form of heat or energy to change the geometrical shape thus changing the inherent engineering and structural properties of the material. These changes often cause the development of locked up stresses referred to as residual stresses as a result of these activities. This study reports on the residual stresses developed due to the mechanical forming process to maintain a suitable structural integrity for the formed components. The result of the analysis through the X-ray diffraction confirmed that residual stresses were induced in the manufactured parts and further revealed that residual stresses were compressive in nature as found in the parent material but with values less than the parent material.

Overview of friction modelling in metal forming processes

DEFF Research Database (Denmark)

Nielsen, Chris Valentin; Bay, Niels Oluf

2017-01-01

In metal forming processes, friction between tool and workpiece is an important parameter influencing the material flow, surface quality and tool life. Theoretical models of friction in metal forming are based on analysis of the real contact area in tool-workpiece interfaces. Several research...... groups have studied and modelled the asperity flattening of workpiece material against tool surface in dry contact or in contact interfaces with only thin layers of lubrication with the aim to improve understanding of friction in metal forming. This paper aims at giving a review of the most important...... future work in order to advance further in modelling of real contact area in relation to implementation of frictional conditions existing finite element codes for simulation of metal forming processes. © 2017 The Authors. Published by Elsevier Ltd....

Tensile and fatigue properties of weld-bonded and adhesive-bonded magnesium alloy joints

International Nuclear Information System (INIS)

Xu, W.; Liu, L.; Zhou, Y.; Mori, H.; Chen, D.L.

2013-01-01

The microstructures, tensile and fatigue properties of weld-bonded (WB) AZ31B-H24 Mg/Mg joints with different sizes of bonding area were evaluated and compared with the adhesive-bonded (AB) Mg/Mg joints. Typical equiaxed dendritic structures containing divorced eutectic Mg 17 Al 12 particles formed in the fusion zone of both WB-1 (with a bonding area of 35 mm×35 mm) and WB-0.5 (with a bonding area of 17.5 mm×35 mm) joints. Less solidification shrinkage cracking was observed in the WB-0.5 joints than WB-1 joints. While the WB-0.5 joints exhibited a slightly lower maximum tensile shear stress than the AB-0.5 joints (with a bonding area of 17.5 mm×35 mm), the energy absorption was equivalent. Although the AB-0.5 joints exhibited a higher fatigue resistance at higher cyclic stress levels, both the AB-0.5 and WB-0.5 joints showed an equivalent fatigue resistance at lower cyclic stress levels. A higher fatigue limit was observed in the WB-0.5 joints than in the WB-1 joints owing to the presence of fewer shrinkage pores. Cohesive failure mode along the adhesive layer in conjunction with partial nugget pull-out from the weld was observed at the higher cyclic loads, and fatigue failure occurred in the base metal at the lower cyclic loads

A study of laser surface treatment in bonded repair of composite aircraft structures.

Science.gov (United States)

Li, Shaolong; Sun, Ting; Liu, Chang; Yang, Wenfeng; Tang, Qingru

2018-03-01

Surface pre-treatment is one of the key processes in bonded repair of aircraft carbon fibre reinforced polymer composites. This paper investigates the surface modification of physical and chemical properties by laser ablation and conventional polish treatment techniques. Surface morphology analysed by laser scanning confocal microscopy and scanning electron microscopy showed that a laser-treated surface displayed higher roughness than that of a polish-treated specimen. The laser-treated laminate exhibited more functional groups in the form of O 1 s/C 1 s atomic ratio of 30.89% for laser-treated and 20.14% for polish-treated as evidenced by X-ray photoelectron spectroscopy observation. Contact angle goniometry demonstrated that laser treatment can provide increased surface free energy and wettability. In the light of mechanical interlocking, molecular bonding and thermodynamics theories on adhesion, laser etching process displayed enhanced bonding performance relative to the polishing surface treatment. These properties resulted in an increased single lap shear strength and a cohesive failure mode for laser etching while an adhesive failure mode occurred in polish-treated specimen.

Diffusionless bonding of aluminum to Zircaloy-2

International Nuclear Information System (INIS)

Watson, R.D.

1965-04-01

Aluminum can be bonded to zirconium without difficulty even when a thin layer of oxide is present on the surface of the zirconium . No detectable diffusion takes place during the bonding process. The bond layer can be stretched as much. as 8% without affecting the bond. The bond can be heated for 1000 hours at 260 o C (500 o F), and can be water quenched from 260 o C (500 o F) without any noticeable change in the bond strength. An extrusion technique has been devised for making transition sections of aluminum bonded to zirconium which can then be used to join these metals by conventional welding. Welding can be done close to the bond zone without seriously affecting the integrity of the bond. This method of bonding aluminum to Zircaloy-2 is covered by Canadian patent 702,438 January 26, 1965. (author)

Thai students' mental model of chemical bonding

Science.gov (United States)

Sarawan, Supawadee; Yuenyong, Chokchai

2018-01-01

This Research was finding the viewing about concept of chemical bonding is fundamental to subsequent learning of various other topics related to this concept in chemistry. Any conceptions about atomic structures that students have will be shown their further learning. The purpose of this study is to interviews conceptions held by high school chemistry students about metallic bonding and to reveal mental model of atomic structures show according to the educational level. With this aim, the questionnaire prepared making use of the literature and administered for analysis about mental model of chemical bonding. It was determined from the analysis of answers of questionnaire the 10th grade, 11th grade and 12th grade students. Finally, each was shown prompts in the form of focus cards derived from curriculum material that showed ways in which the bonding in specific metallic substances had been depicted. Students' responses revealed that learners across all three levels prefer simple, realistic mental models for metallic bonding and reveal to chemical bonding.

Electrometallurgical treatment of sodium-bonded spent nuclear fuel

International Nuclear Information System (INIS)

Benedict, R.W.; McFarlane, H.F.; Goff, K.M.

2001-01-01

For 20 years Argonne National Laboratory has been developing electrometallurgical technology for application to spent nuclear fuel. Progress has been rapid during the past 5 years as 1,6 tonnes spent fuel from the Experimental Breeder Reactor-II was treated and preparations were made for processing the remaining 25 tonnes of sodium-bonded fuel from the shutdown reactor. Two high level waste forms are being qualified for geologic disposal. Extension of the technology to oxide fuels or to actinide recycling has been on hold because of US policy on reprocessing. (author)

Visual form-processing deficits: a global clinical classification.

Science.gov (United States)

Unzueta-Arce, J; García-García, R; Ladera-Fernández, V; Perea-Bartolomé, M V; Mora-Simón, S; Cacho-Gutiérrez, J

2014-10-01

Patients who have difficulties recognising visual form stimuli are usually labelled as having visual agnosia. However, recent studies let us identify different clinical manifestations corresponding to discrete diagnostic entities which reflect a variety of deficits along the continuum of cortical visual processing. We reviewed different clinical cases published in medical literature as well as proposals for classifying deficits in order to provide a global perspective of the subject. Here, we present the main findings on the neuroanatomical basis of visual form processing and discuss the criteria for evaluating processing which may be abnormal. We also include an inclusive diagram of visual form processing deficits which represents the different clinical cases described in the literature. Lastly, we propose a boosted decision tree to serve as a guide in the process of diagnosing such cases. Although the medical community largely agrees on which cortical areas and neuronal circuits are involved in visual processing, future studies making use of new functional neuroimaging techniques will provide more in-depth information. A well-structured and exhaustive assessment of the different stages of visual processing, designed with a global view of the deficit in mind, will give a better idea of the prognosis and serve as a basis for planning personalised psychostimulation and rehabilitation strategies. Copyright © 2011 Sociedad Española de Neurología. Published by Elsevier Espana. All rights reserved.

Probing hydrogen bonding interactions and proton transfer in proteins

Science.gov (United States)

Nie, Beining

Scope and method of study. Hydrogen bonding is a fundamental element in protein structure and function. Breaking a single hydrogen bond may impair the stability of a protein. It is therefore important to probe dynamic changes in hydrogen bonding interactions during protein folding and function. Time-resolved Fourier transform infrared spectroscopy is highly sensitive to hydrogen bonding interactions. However, it lacks quantitative correlation between the vibrational frequencies and the number, type, and strength of hydrogen bonding interactions of ionizable and polar residues. We employ quantum physics theory based ab initio calculations to study the effects of hydrogen bonding interactions on vibrational frequencies of Asp, Glu, and Tyr residues and to develop vibrational spectral markers for probing hydrogen bonding interactions using infrared spectroscopy. In addition, proton transfer process plays a crucial role in a wide range of energy transduction, signal transduction, and enzymatic reactions. We study the structural basis for proton transfer using photoactive yellow protein as an excellent model system. Molecular dynamics simulation is employed to investigate the structures of early intermediate states. Quantum theory based ab initio calculations are used to study the impact of hydrogen bond interactions on proton affinity and proton transfer. Findings and conclusions. Our extensive density function theory based calculations provide rich structural, spectral, and energetic information on hydrogen bonding properties of protonated side chain groups of Asp/Glu and Tyr. We developed vibrational spectral markers and 2D FTIR spectroscopy for structural characterization on the number and the type of hydrogen bonding interactions of the COOH group of Asp/Glu and neutral phenolic group of Tyr. These developments greatly enhance the power of time-resolved FTIR spectroscopy as a major experimental tool for structural characterization of functionally important

Bonding and Bridging Forms of Social Capital in Wildlife Tourism Microentrepreneurship: An Application of Social Network Analysis

Directory of Open Access Journals (Sweden)

Birendra KC

2018-01-01

Full Text Available Tourism has been recognized as an important economic sector, requiring a high degree of involvement from the entrepreneurial sector to diversify tourism products and services to meet increasing demand. Tourism is often considered a tool for economic development and a strategy to improve the livelihoods of rural citizens. Specifically, nature-based tourism, such as wildlife tourism, is growing faster than tourism in general, providing a myriad of opportunities for small-scale entrepreneurial engagement. However, several obstacles exist for these small-scale tourism enterprises, such as a lack of social capital. This study examined a network of wildlife tourism microentrepreneurs for bonding and bridging forms of social capital using a social network analysis approach, where bonding and bridging social capital have their own interpretation. Thirty-seven in-person interviews were conducted with wildlife tourism microentrepreneurs from North Carolina’s Pamlico Sound Region. The study revealed that microentrepreneurs interacted with each other in a bridging network structure. The ability to reciprocate with other members of the network was essential for business success. The results identified four key bridging ties connecting potential sub-groups in the network, connected to each other in a redundant fashion. We concluded that the formation of a bridging network structure was a function of entrepreneurial phenomena that may not promote a highly trusted, well-connected network. The findings and implications are further discussed in the paper.

Bond strength and stress measurements in thermal barrier coatings

Energy Technology Data Exchange (ETDEWEB)

Gell, M.; Jordan, E. [Univ. of Connecticut, Storrs, CT (United States)

1995-10-01

Thermal barrier coatings have been used extensively in aircraft gas turbines for more than 15 years to insulate combustors and turbine vanes from the hot gas stream. Plasma sprayed thermal barrier coatings (TBCs) provide metal temperature reductions as much as 300{degrees}F, with improvements in durability of two times or more being achieved. The introduction of TBCs deposited by electron beam physical vapor deposition (EB-PVD) processes in the last five years has provided a major improvement in durability and also enabled TBCs to be applied to turbine blades for improved engine performance. To meet the aggressive Advanced Turbine Systems goals for efficiency, durability and the environment, it will be necessary to employ thermal barrier coatings on turbine airfoils and other hot section components. For The successful application of TBCs to ATS engines with 2600{degrees}F turbine inlet temperatures and required component lives 10 times greater than those for aircraft gas turbine engines, it is necessary to develop quantitative assessment techniques for TBC coating integrity with time and cycles in ATS engines. Thermal barrier coatings in production today consist of a metallic bond coat, such as an MCrAlY overlay coating or a platinum aluminide (Pt-Al) diffusion coating. During heat treatment, both these coatings form a thin, tightly adherent alumina (Al{sub 2}O{sub 3}) film. Failure of TBC coatings in engine service occurs by spallation of the ceramic coating at or near the bond coat to alumina or the alumina to zirconia bonds. Thus, it is the initial strength of these bonds and the stresses at the bond plane, and their changes with engine exposure, that determines coating durability. The purpose of this program is to provide, for the first time, a quantitative assessment of TBC bond strength and bond plane stresses as a function of engine time and cycles.

A facile route for irreversible bonding of plastic-PDMS hybrid microdevices at room temperature.

Science.gov (United States)

Tang, Linzhi; Lee, Nae Yoon

2010-05-21

Plastic materials do not generally form irreversible bonds with poly(dimethylsiloxane) (PDMS) regardless of oxygen plasma treatment and a subsequent thermal process. In this paper, we perform plastic-PDMS bonding at room temperature, mediated by the formation of a chemically robust amine-epoxy bond at the interfaces. Various plastic materials, such as poly(methylmethacrylate) (PMMA), polycarbonate (PC), polyimide (PI), and poly(ethylene terephthalate) (PET) were adopted as choices for plastic materials. Irrespective of the plastic materials used, the surfaces were successfully modified with amine and epoxy functionalities, confirmed by the surface characterizations such as water contact angle measurements and X-ray photoelectron spectroscopy (XPS), and chemically robust and irreversible bonding was successfully achieved within 1 h at room temperature. The bonding strengths of PDMS with PMMA and PC sheets were measured to be 180 and 178 kPa, respectively, and their assemblies containing microchannel structures endured up to 74 and 84 psi (510 and 579 kPa) of introduced compressed air, respectively, without destroying the microdevices, representing a robust and highly stable interfacial bonding. In addition to microchannel-molded PDMS bonded with flat plastic substrates, microchannel-embossed plastics were also bonded with a flat PDMS sheet, and both types of bonded assemblies displayed sufficiently robust bonding, tolerating an intense influx of liquid whose per-minute injection volume was nearly 1000 to 2000 times higher than the total internal volume of the microchannel used. In addition to observing the bonding performance, we also investigated the potential of surface amine and epoxy functionalities as durable chemical adhesives by observing their storage-time-dependent bonding performances.

Hydrogen bonds and heat diffusion in α-helices: a computational study.

Science.gov (United States)

Miño, German; Barriga, Raul; Gutierrez, Gonzalo

2014-08-28

Recent evidence has shown a correlation between the heat diffusion pathways and the known allosteric communication pathways in proteins. Allosteric communication in proteins is a central, yet unsolved, problem in biochemistry, and the study and characterization of the structural determinants that mediate energy transfer among different parts of proteins is of major importance. In this work, we characterized the role of hydrogen bonds in diffusivity of thermal energy for two sets of α-helices with different abilities to form hydrogen bonds. These hydrogen bonds can be a constitutive part of the α-helices or can arise from the lateral chains. In our in vacuo simulations, it was observed that α-helices with a higher possibility of forming hydrogen bonds also had higher rates of thermalization. Our simulations also revealed that heat readily flowed through atoms involved in hydrogen bonds. As a general conclusion, according to our simulations, hydrogen bonds fulfilled an important role in heat diffusion in structural patters of proteins.

A processing enzyme cleaving avian progastrin at post-Phe bonds

DEFF Research Database (Denmark)

Jensen, H; Ørskov, C; Rehfeld, J F

2001-01-01

Neuroendocrine peptides mature partly through endoproteolytic processing of long precursor forms. Best characterised is cleavage at mono- and dibasic residues, but additional sites also exist. Among these is post-Phe cleavage, first suggested to participate in the processing of chicken progastrin...

WATER BOND FORMS IN THE DOUGH AND SORBTION PROPERTIES OF GLUTEN-FREE MACARONI PRODUCTS MADE FROM CORN FLOUR

Directory of Open Access Journals (Sweden)

Olexandr ROZHNO

2017-09-01

Full Text Available Authors have developed macaroni products made from fine meal corn flour by structure forming additives of different nature and without them. The correlation between water of different bond forms in macaroni dough with different structural forming additives and without them has been investigated. Results show that water of macro and microcapillaries is prevalent in the corn dough – 39.40 - 54.69 % of overall amount of water. Osmotically bound water amounts 18.75 – 28.04 %, adsorbically bound water -18.49 – 23.13 % of overall amount of water. The absorbtion capability of the macaroni products and amount of adsorbed water has been determined. The micropore structure of these samples was characterized. The correlation between structures of macaroni products, both amount of adsorbed moisture and energy of sorption were proven. The amount of monomolecular layer’s moisture for gluten-free corn macaroni products is significantly higher – in 1.2 – 1.5 times – when compared to the wheat macaroni products. Due to this fact, corn samples obtained higher energy of moisture sorption. The correlation between structural characteristics of the macaroni samples and their quality was shown.

Ultrasonic friction power during thermosonic Au and Cu ball bonding

International Nuclear Information System (INIS)

Shah, A; Mayer, M; Zhou, Y; Qin, I; Huynh, C; Meyer, M

2010-01-01

The ultrasonic friction power during thermosonic ball bonding with Au and Cu wires, both 25 μm in diameter, is derived with an improved method from experimental measurements during the bonding process. Experimental data include the current delivered to the ultrasonic transducer and the tangential force measured using piezoresistive microsensors integrated close to the Al bonding pad. The improvement results from a new, more accurate method to derive the mechanical compliance of the ultrasonic system. The method employs a bond process modification in which the ultrasonic current is ramped up sequentially in three steps. In the first two steps, the ultrasonic current is set to levels that are too low to cause sliding. The bonding takes place during the third step, when the current is ramped up to the optimum value required for making good quality bonds. The ultrasonic compliance values are derived from the first two steps and are 8.2 ± 0.5 μm N -1 and 7.7 ± 0.5 μm N -1 for the Au and Cu processes, respectively. These values are determined within an average error estimate of ±6%, substantially lower than the ±10% estimated with a previously reported method. The ultrasonic compliance in the case of Au is 6% higher due to the lower elastic modulus of Au compared with that of Cu. Typical maximum values of relative sliding amplitude of ultrasonic friction at the interface are 655 nm and 766 nm for the Au and Cu processes. These values are 81% of the free-air vibration amplitude of the bonding capillary tip for the respective ultrasonic current settings. Due to bond growth, which damps relative motion between the ball and the pad, the final relative amplitude at the bond interface is reduced to 4% of the equivalent free-air amplitude. Even though the maximum value of relative amplitude is 17% higher in the Cu process compared with the Au process, the average total interfacial sliding is 519 μm in the Cu process, which is 31% lower than that in the Au process (759 �

Microstructural Evolution of Ni-Sn Transient Liquid Phase Sintering Bond during High-Temperature Aging

Science.gov (United States)

Feng, Hongliang; Huang, Jihua; Peng, Xianwen; Lv, Zhiwei; Wang, Yue; Yang, Jian; Chen, Shuhai; Zhao, Xingke

2018-05-01

For high-temperature-resistant packaging of new generation power chip, a chip packaging simulation structure of Ni/Ni-Sn/Ni was bonded by a transient liquid-phase sintering process. High-temperature aging experiments were carried out to investigate joint heat stability. The microstructural evolution and mechanism during aging, and mechanical properties after aging were analyzed. The results show that the 30Ni-70Sn bonding layer as-bonded at 340°C for 240 min is mainly composed of Ni3Sn4 and residual Ni particles. When aged at 350°C, because of the difficulty of nucleation for Ni3Sn and quite slow growth of Ni3Sn2, the bonding layer is stable and the strength of that doesn't change obviously with aging time. When aging temperature increased to 500°C, however, the residual Ni particles were gradually dissolved and the bonding layer formed a stable structure with dominated Ni3Sn2 after 36 h. Meanwhile, due to the volume shrinkage (4.43%) from Ni3Sn2 formation, a number of voids were formed. The shear strength shows an increase, resulting from Ni3Sn2 formation, but then it decreases slightly caused by voids. After aging at 500°C for 100 h, shear strength is still maintained at 29.6 MPa. In addition, the mechanism of void formation was analyzed and microstructural evolution model was also established.

Comparison of shear bond strength of stainless steel brackets bonded with three light- cured adhesives

Directory of Open Access Journals (Sweden)

Zahra Minaei Basharik

2015-09-01

Full Text Available Introduction: The bonding process of the brackets to enamel has been a critical issue in orthodontic research. The purpose of this study was to evaluate the shear bond strength of 3 light-cured adhesives (transbond XT, Z250, light bond. Materials &Methods: In this study sixty extracted human premolars were collected and randomly divided into 3 test groups. All teeth were etched by 37% phosphoric acid. In first group brackets were bonded by Transbond XT adhesive, in group two brackets were bonded by Light bond adhesive and in third group were bonded by filtek Z250 composite. All of them were cured with Ortholux xt for 40 seconds.24 hours after thermocycling, Shear Bond Strength (SBS values of these brackets were recorded using a Universal Testing Machine. Adhesive Remnant Index (ARI scores were determined after the failure of the brackets, using Stereo Microscope the data were analyzed using ANOVA and Chi-square tests. Results: Mean shear bond strength of Transbond XT, light bond and Z250 were 28.9±2.25 MPa, 25.06±1.98 MPa and 26.8±2.57 MPa, respectively. No significant difference was observed in the SBS among the groups and a clinically acceptable SBS was found for the three adhesives. ARI scores were not significantly different between the various groups (P>0.05. Conclusion: This study showed that the Z250 can be used as light bond and transbond xt to bond orthodontic brackets and ARI and SBS scores were not significantly different.

Shear Bond Strength of Orthodontic Brackets Bonded to Zirconium Crowns.

Science.gov (United States)

Mehmeti, Blerim; Azizi, Bleron; Kelmendi, Jeta; Iljazi-Shahiqi, Donika; Alar, Željko; Anić-Milošević, Sandra

2017-06-01

An increasing demand for esthetic restorations has resulted in an increased use of all-ceramic restorations, such as zirconium. However, one of the challenges the orthodontist must be willing to face is how to increase bond strength between the brackets and various ceramic restorations.Bond strength can beaffected bybracket type, by the material that bracketsaremade of, and their base surface design or retention mode. ​: A im: of this study was to perform a comparative analysis of the shear bond strength (SBS) of metallic and ceramic orthodontic brackets bonded to all-zirconium ceramic surfaces used for prosthetic restorations, and also to evaluate the fracture mode of these two types of orthodontic brackets. Twenty samples/semi-crowns of all-zirconium ceramic, on which orthodontic brackets were bonded, 10 metallic and 10 ceramic polycrystalline brackets, were prepared for this research. SBS has been testedby Universal Testing Machine, with a load applied using a knife edged rod moving at a fixed rate of 1 mm/min, until failure occurred. The force required to debond the brackets was recorded in Newton, then SBS was calculated to MPa. In addition, the samples were analyzed using a digital camera magnifier to determine Adhesive Remnant Index (ARI). Statistical data were processed using t-test, and the level of significance was set at α = 0.05. Higher shear bond strength values were observed in metallic brackets bonded to zirconium crowns compared tothoseof ceramic brackets, with a significant difference. During the test, two of the ceramic brackets were partially or totally damaged. Metallic brackets, compared to ceramic polycrystalline brackets, seemed tocreate stronger adhesion with all-zirconium surfaces due to their better retention mode. Also, ceramic brackets showed higher fragility during debonding.

Progress in cold roll bonding of metals

International Nuclear Information System (INIS)

Li Long; Nagai, Kotobu; Yin Fuxing

2008-01-01

Layered composite materials have become an increasingly interesting topic in industrial development. Cold roll bonding (CRB), as a solid phase method of bonding same or different metals by rolling at room temperature, has been widely used in manufacturing large layered composite sheets and foils. In this paper, we provide a brief overview of a technology using layered composite materials produced by CRB and discuss the suitability of this technology in the fabrication of layered composite materials. The effects of process parameters on bonding, mainly including process and surface preparation conditions, have been analyzed. Bonding between two sheets can be realized when deformation reduction reaches a threshold value. However, it is essential to remove surface contamination layers to produce a satisfactory bond in CRB. It has been suggested that the degreasing and then scratch brushing of surfaces create a strong bonding between the layers. Bonding mechanisms, in which the film theory is expressed as the major mechanism in CRB, as well as bonding theoretical models, have also been reviewed. It has also been showed that it is easy for fcc structure metals to bond compared with bcc and hcp structure metals. In addition, hardness on bonding same metals plays an important part in CRB. Applications of composites produced by CRB in industrial fields are briefly reviewed and possible developments of CRB in the future are also described. Corrections were made to the abstract and conclusion of this article on 18 June 2008. The corrected electronic version is identical to the print version. (topical review)

Monte Carlo simulation of AB-copolymers with saturating bonds

DEFF Research Database (Denmark)

Chertovich, A.C.; Ivanov, V.A.; Khokhlov, A.R.

2003-01-01

Structural transitions in a single AB-copolymer chain where saturating bonds can be formed between A- and B-units are studied by means of Monte Carlo computer simulations using the bond fluctuation model. Three transitions are found, coil-globule, coil-hairpin and globule-hairpin, depending...

Signal analysis approach to ultrasonic evaluation of diffusion bond quality

International Nuclear Information System (INIS)

Thomas, Graham; Chinn, Diane

1999-01-01

Solid state bonds like the diffusion bond are attractive techniques for joining dissimilar materials since they are not prone to the defects that occur with fusion welding. Ultrasonic methods can detect the presence of totally unbonded regions but have difficulty sensing poor bonded areas where the substrates are in intimate contact. Standard ultrasonic imaging is based on amplitude changes in the signal reflected from the bond interface. Unfortunately, amplitude alone is not sensitive to bond quality. We demonstrated that there is additional information in the ultrasonic signal that correlates with bond quality. In our approach, we interrogated a set of dissimilar diffusion bonded samples with broad band ultrasonic signals. The signals were digitally processed and the characteristics of the signals that corresponded to bond quality were determined. These characteristics or features were processed with pattern recognition algorithms to produce predictions of bond quality. The predicted bond quality was then compared with the destructive measurement to assess the classification capability of the ultrasonic technique

Hydrogen Bonds and Life in the Universe

Directory of Open Access Journals (Sweden)

Giovanni Vladilo

2018-01-01

Full Text Available The scientific community is allocating more and more resources to space missions and astronomical observations dedicated to the search for life beyond Earth. This experimental endeavor needs to be backed by a theoretical framework aimed at defining universal criteria for the existence of life. With this aim in mind, we have explored which chemical and physical properties should be expected for life possibly different from the terrestrial one, but similarly sustained by genetic and catalytic molecules. We show that functional molecules performing genetic and catalytic tasks must feature a hierarchy of chemical interactions operating in distinct energy bands. Of all known chemical bonds and forces, only hydrogen bonds are able to mediate the directional interactions of lower energy that are needed for the operation of genetic and catalytic tasks. For this reason and because of the unique quantum properties of hydrogen bonding, the functional molecules involved in life processes are predicted to have extensive hydrogen-bonding capabilities. A molecular medium generating a hydrogen-bond network is probably essential to support the activity of the functional molecules. These hydrogen-bond requirements constrain the viability of hypothetical biochemistries alternative to the terrestrial one, provide thermal limits to life molecular processes, and offer a conceptual framework to define a transition from a “covalent-bond stage” to a “hydrogen-bond stage” in prebiotic chemistry.

Hydrogen Bonds and Life in the Universe

Science.gov (United States)

2018-01-01

The scientific community is allocating more and more resources to space missions and astronomical observations dedicated to the search for life beyond Earth. This experimental endeavor needs to be backed by a theoretical framework aimed at defining universal criteria for the existence of life. With this aim in mind, we have explored which chemical and physical properties should be expected for life possibly different from the terrestrial one, but similarly sustained by genetic and catalytic molecules. We show that functional molecules performing genetic and catalytic tasks must feature a hierarchy of chemical interactions operating in distinct energy bands. Of all known chemical bonds and forces, only hydrogen bonds are able to mediate the directional interactions of lower energy that are needed for the operation of genetic and catalytic tasks. For this reason and because of the unique quantum properties of hydrogen bonding, the functional molecules involved in life processes are predicted to have extensive hydrogen-bonding capabilities. A molecular medium generating a hydrogen-bond network is probably essential to support the activity of the functional molecules. These hydrogen-bond requirements constrain the viability of hypothetical biochemistries alternative to the terrestrial one, provide thermal limits to life molecular processes, and offer a conceptual framework to define a transition from a “covalent-bond stage” to a “hydrogen-bond stage” in prebiotic chemistry. PMID:29301382

Hydrogen Bonds and Life in the Universe.

Science.gov (United States)

Vladilo, Giovanni; Hassanali, Ali

2018-01-03

The scientific community is allocating more and more resources to space missions and astronomical observations dedicated to the search for life beyond Earth. This experimental endeavor needs to be backed by a theoretical framework aimed at defining universal criteria for the existence of life. With this aim in mind, we have explored which chemical and physical properties should be expected for life possibly different from the terrestrial one, but similarly sustained by genetic and catalytic molecules. We show that functional molecules performing genetic and catalytic tasks must feature a hierarchy of chemical interactions operating in distinct energy bands. Of all known chemical bonds and forces, only hydrogen bonds are able to mediate the directional interactions of lower energy that are needed for the operation of genetic and catalytic tasks. For this reason and because of the unique quantum properties of hydrogen bonding, the functional molecules involved in life processes are predicted to have extensive hydrogen-bonding capabilities. A molecular medium generating a hydrogen-bond network is probably essential to support the activity of the functional molecules. These hydrogen-bond requirements constrain the viability of hypothetical biochemistries alternative to the terrestrial one, provide thermal limits to life molecular processes, and offer a conceptual framework to define a transition from a "covalent-bond stage" to a "hydrogen-bond stage" in prebiotic chemistry.

Effects of plasma pretreatment on the process of self-forming Cu–Mn alloy barriers for Cu interconnects

Directory of Open Access Journals (Sweden)

Jae-Hyung Park

2018-02-01

Full Text Available This study investigated the effect of plasma pretreatment on the process of a self-forming Cu–Mn alloy barrier on porous low-k dielectrics. To study the effects of plasma on the performance of a self-formed Mn-based barrier, low-k dielectrics were pretreated with H2 plasma or NH3 plasma. Cu–Mn alloy materials on low-k substrates that were subject to pretreatment with H2 plasma exhibited lower electrical resistivity values and the formation of thicker Mn-based interlayers than those on low-k substrates that were subject to pretreatment with NH3 plasma. Transmission electron microscopy (TEM, X-ray photoemission spectroscopy (XPS, and thermal stability analyses demonstrated the exceptional performance of the Mn-based interlayer on plasma-pretreated low-k substrates with regard to thickness, chemical composition, and reliability. Plasma treating with H2 gas formed hydrophilic Si–OH bonds on the surface of the low-k layer, resulting in Mn-based interlayers with greater thickness after annealing. However, additional moisture uptake was induced on the surface of the low-k dielectric, degrading electrical reliability. By contrast, plasma treating with NH3 gas was less effective with regard to forming a Mn-based interlayer, but produced a Si–N/C–N layer on the low-k surface, yielding improved barrier characteristics.

Characterization of diffusion bonded joint between titanium and 304 stainless steel using a Ni interlayer

International Nuclear Information System (INIS)

Kundu, S.; Chatterjee, S.

2008-01-01

Solid-state diffusion bonded joints were prepared between commercially pure titanium and 304 stainless steel with nickel as an intermediate material in the temperature range of 800-950 deg. C for 10.8 ks under a 3 MPa uniaxial pressure in vacuum. The interface microstructures and reaction products of the transition joints were investigated by optical and scanning electron microscopy. Up to 850 deg. C processing temperature, a 300-μm nickel interlayer completely restricts the diffusion of titanium to stainless steel. However, the nickel interlayer cannot block the diffusion of Ti to the stainless side and λ + χ + α-Fe, λ + FeTi and λ + FeTi + β-Ti phase mixtures are formed at the SS-Ni interface, when bonding was processed at 900 deg. C and above. These reaction products were confirmed by X-ray diffraction. A maximum tensile strength of ∼ 270 MPa and shear strength of ∼ 194 MPa, along with 6.2% ductility, were obtained for the diffusion bonded joint processed at 850 deg. C. Fracture surface observation in SEM using EDS demonstrates that failure occurred through the Ni-Ti interface of the joints when processed up to 850 deg. C and through the SS-Ni interface when processed at and above 900 deg. C

INFLUENCE OF QUARTZ CERAMICS SINGLE-STAGE PROCESSING BY GEL-FORMING WATER SOLUTIONS ON ITS STRENGTH

Directory of Open Access Journals (Sweden)

S. K. Evstropiev

2014-09-01

Full Text Available The main research results of the influence of quartz ceramics processing by silicon- and aluminum-containing gel- forming water solutions on its durability and porosity are given. Aqueous-alcoholic solutions based on tetraethoxysilane (TEOS, Si(C2H5O4 with additives of aluminum nitrate are proposed for impregnation of porous quartz ceramics samples. Ceramic samples are being impregnated with solutions at the room temperature for 12 minutes. After impregnation they are being exposed to drying at the room temperature for 24 hours and heat treatment in the electric muffle furnace. The made experiments show that impregnation of quartz ceramics porous samples by gel-forming solutions leads to durability growth of not burned samples by 6-7 times even without additional heat treatment. High-temperature heat treatment of previously impregnated ceramic samples leads to decomposition of aluminum nitrate and removal of fossils, and also to hardening of the formed additional bonds between material particles. It considerably improves strength characteristics of quartz ceramics as well. Thus, the possibility of considerable hardening of porous quartz ceramics and stability growth of its strength properties by preliminary impregnation of silicon- and aluminum-bearing gel-forming solutions even without additional heat treatment is experimentally shown. It is revealed that impregnation of porous quartz ceramic samples by these solutions leads only to insignificant reduction of porosity of samples. Subsequent heat treatment of the impregnated porous ceramic samples at the temperatures, equal to 900-1200oC, results in additional significant increase in their mechanical durability.

Process for protecting bonded components from plating shorts

Science.gov (United States)

Tarte, Lisa A.; Bonde, Wayne L.; Carey, Paul G.; Contolini, Robert J.; McCarthy, Anthony M.

2000-01-01

A method which protects the region between a component and the substrate onto which the components is bonded using an electrically insulating fillet of photoresist. The fillet protects the regions from subsequent plating with metal and therefore shorting the plated conductors which run down the sides of the component and onto the substrate.

Protection of MOS capacitors during anodic bonding

Science.gov (United States)

Schjølberg-Henriksen, K.; Plaza, J. A.; Rafí, J. M.; Esteve, J.; Campabadal, F.; Santander, J.; Jensen, G. U.; Hanneborg, A.

2002-07-01

We have investigated the electrical damage by anodic bonding on CMOS-quality gate oxide and methods to prevent this damage. n-type and p-type MOS capacitors were characterized by quasi-static and high-frequency CV-curves before and after anodic bonding. Capacitors that were bonded to a Pyrex wafer with 10 μm deep cavities enclosing the capacitors exhibited increased leakage current and interface trap density after bonding. Two different methods were successful in protecting the capacitors from such damage. Our first approach was to increase the cavity depth from 10 μm to 50 μm, thus reducing the electric field across the gate oxide during bonding from approximately 2 × 105 V cm-1 to 4 × 104 V cm-1. The second protection method was to coat the inside of a 10 μm deep Pyrex glass cavity with aluminium, forming a Faraday cage that removed the electric field across the cavity during anodic bonding. Both methods resulted in capacitors with decreased interface trap density and unchanged leakage current after bonding. No change in effective oxide charge or mobile ion contamination was observed on any of the capacitors in the study.

31 CFR 360.26 - Application for relief; after receipt of bond.

Science.gov (United States)

2010-07-01

... coowners, if living) authorized under the regulations in this part to request payment of the bond. In addition: (1) If the bond is in beneficiary form and the owner and beneficiary are both living, the... the application is approved, relief will be granted either by the issuance of a bond bearing the same...

Formability of fiber-reinforced thermoplastics in hot press forming process based on friction properties

NARCIS (Netherlands)

Sachs, Ulrich; Haanappel, Sebastiaan; Rietman, Bert; ten Thije, R.H.W.; Akkerman, Remko

2013-01-01

In this paper an advanced solid state cladding process, based on Friction Stir Welding, is presented. The Friction Surface Cladding (FSC) technology enables the deposition of a solid-state coating using filler material on a substrate with good metallurgical bonding. A relatively soft AA1050 filler

Recycling of Manganese Secondary Raw Material Via Cold-Bond Pelletizing Process

International Nuclear Information System (INIS)

Ahmed, Y.M.Z.; Mohamed, F.M.

2004-01-01

Large quantities of fines were produced during the shipping, transportation, handling and storage of manganese ore sinter imported from different countries to Sinai Company for ferromanganese production. These fines are generally considered as valuable secondary raw materials. Hence, they have a potential to be recycled back to the submerged arc furnace after having been agglomerated. For agglomerates to be considered as feed materials for submerged arc furnace they must have sufficient room temperature strength. Cold-bonded penalization process offers an economically attractive and environmentally viable method for achieving this. Ordinary Portland cement was used in this investigation for the purpose of producing a suitable cold-bonded pellet from such fines. In this investigation, the effect of adding different percentages of Portland cement on the mechanical properties of both green and pellet dried at room temperature for 1, 3, 7, 14, and 28 days of normal curing were studied. The results revealed that, although the compressive strength of green pellets improved with the increase of the amount of cement added. retardation in pellet drop strength was reported. Whereas, the increase in both the cement content and time of drying leads to increase in the mechanical properties of pellets normally cured at room temperature. pellets obtain with the addition of 9% cement shows reasonable mechanical properties to be charged in the submerged are furnace. ferromanganese alloy having a standard range composition was produced in a laboratory submerged are furnace using such pellets

Suppression of interfacial voids formation during silane (SiH4)-based silicon oxide bonding with a thin silicon nitride capping layer

Science.gov (United States)

Lee, Kwang Hong; Bao, Shuyu; Wang, Yue; Fitzgerald, Eugene A.; Seng Tan, Chuan

2018-01-01

The material properties and bonding behavior of silane-based silicon oxide layers deposited by plasma-enhanced chemical vapor deposition were investigated. Fourier transform infrared spectroscopy was employed to determine the chemical composition of the silicon oxide films. The incorporation of hydroxyl (-OH) groups and moisture absorption demonstrates a strong correlation with the storage duration for both as-deposited and annealed silicon oxide films. It is observed that moisture absorption is prevalent in the silane-based silicon oxide film due to its porous nature. The incorporation of -OH groups and moisture absorption in the silicon oxide films increase with the storage time (even in clean-room environments) for both as-deposited and annealed silicon oxide films. Due to silanol condensation and silicon oxidation reactions that take place at the bonding interface and in the bulk silicon, hydrogen (a byproduct of these reactions) is released and diffused towards the bonding interface. The trapped hydrogen forms voids over time. Additionally, the absorbed moisture could evaporate during the post-bond annealing of the bonded wafer pair. As a consequence, defects, such as voids, form at the bonding interface. To address the problem, a thin silicon nitride capping film was deposited on the silicon oxide layer before bonding to serve as a diffusion barrier to prevent moisture absorption and incorporation of -OH groups from the ambient. This process results in defect-free bonded wafers.

Weld bonding of stainless steel

DEFF Research Database (Denmark)

Santos, I. O.; Zhang, Wenqi; Goncalves, V.M.

2004-01-01

. The overall assessment of the weld bonding process is made using several commercial adhesives with varying working times under different surface conditions. The quality of the resulting joints is evaluated by means of macroetching observations, tension-shear tests and peel tests. The theoretical investigation......This paper presents a comprehensive theoretical and experimental investigation of the weld bonding process with the purpose of evaluating its relative performance in case of joining stainless steel parts, against alternative solutions based on structural adhesives or conventional spot-welding...... of the process consists of numerical predictions based on the commercial finite element program SORPAS with the purpose of establishing the most favourable parameters that allow spot-welding through the adhesives....

Hot granules medium pressure forming process of AA7075 conical parts

Science.gov (United States)

Dong, Guojiang; Zhao, Changcai; Peng, Yaxin; Li, Ying

2015-05-01

High strength aluminum alloy plate has a low elongation at room temperature, which leads to the forming of its components need a high temperature. Liquid or gas is used as the pressure-transfer medium in the existing flexible mould forming process, the heat resistance of the medium and pressurizing device makes the application of aluminum alloy plate thermoforming restricted. To solve this problem, the existing medium is replaced by the heat-resisting solid granules and the general pressure equipments are applied. Based on the pressure-transfer performance test of the solid granules medium, the feasibility that the assumption of the extended Drucker-Prager linear model can be used in the finite element analysis is proved. The constitutive equation, the yield function and the theoretical forming limit diagram(FLD) of AA7075 sheet are established. Through the finite element numerical simulation of hot granules medium pressure forming(HGMF) process, not only the influence laws of the process parameters, such as forming temperature, the blank-holder gap and the diameter of the slab, on sheet metal forming performance are discussed, but also the broken area of the forming process is analyzed and predicted, which are coincided with the technological test. The conical part whose half cone angle is 15° and relative height H/d 0 is 0.57, is formed in one process at 250°C. The HGMF process solves the problems of loading and seal in the existing flexible mould forming process and provides a novel technology for thermoforming of light alloy plate, such as magnesium alloy, aluminium alloy and titanium alloy.

Bonds broken and formed during the mixed-linkage glucan : xyloglucan endotransglucosylase reaction catalysed by Equisetum hetero-trans-β-glucanase.

Science.gov (United States)

Simmons, Thomas J; Fry, Stephen C

2017-03-08

Mixed-linkage glucan∶xyloglucan endotransglucosylase (MXE) is one of the three activities of the recently characterised hetero-trans-β-glucanase (HTG), which among land plants is known only from Equisetum species. The biochemical details of the MXE reaction were incompletely understood - details that would promote understanding of MXE's role in vivo and enable its full technological exploitation. We investigated HTG's site of attack on one of its donor substrates, mixed-linkage (1→3),(1→4)-β-d-glucan (MLG), with radioactive oligosaccharides of xyloglucan as the acceptor substrate. Comparing three different MLG preparations, we showed that the enzyme favours those with a high content of cellotetraose blocks. The reaction products were analysed by enzymic digestion, thin-layer chromatography (TLC), high-pressure liquid chromatography (HPLC) and gel-permeation chromatography (GPC). Equisetum HTG consistently cleaved the MLG at the third consecutive β-(1→4)-bond following (towards the reducing terminus) a β-(1→3)-bond. It then formed a β-(1→4)-bond between the MLG and the non-reducing terminal glucose residue of the xyloglucan oligosaccharide, consistent with its xyloglucan endotransglucosylase/hydrolase subfamily membership. Using size-homogeneous barley MLG as the donor substrate, we showed that HTG does not favour any particular region of the MLG chain relative to the polysaccharide's reducing and non-reducing termini; rather, it selects its target cellotetraosyl unit stochastically along the MLG molecule. This work improves our understanding of how enzymes can exhibit promiscuous substrate specificities and provides the foundations to explore strategies for engineering novel substrate specificities into transglycanases. © 2017 The Author(s).

Interactions between motion and form processing in the human visual system.

Science.gov (United States)

Mather, George; Pavan, Andrea; Bellacosa Marotti, Rosilari; Campana, Gianluca; Casco, Clara

2013-01-01

The predominant view of motion and form processing in the human visual system assumes that these two attributes are handled by separate and independent modules. Motion processing involves filtering by direction-selective sensors, followed by integration to solve the aperture problem. Form processing involves filtering by orientation-selective and size-selective receptive fields, followed by integration to encode object shape. It has long been known that motion signals can influence form processing in the well-known Gestalt principle of common fate; texture elements which share a common motion property are grouped into a single contour or texture region. However, recent research in psychophysics and neuroscience indicates that the influence of form signals on motion processing is more extensive than previously thought. First, the salience and apparent direction of moving lines depends on how the local orientation and direction of motion combine to match the receptive field properties of motion-selective neurons. Second, orientation signals generated by "motion-streaks" influence motion processing; motion sensitivity, apparent direction and adaptation are affected by simultaneously present orientation signals. Third, form signals generated by human body shape influence biological motion processing, as revealed by studies using point-light motion stimuli. Thus, form-motion integration seems to occur at several different levels of cortical processing, from V1 to STS.

Unexpected Hydration of a Triple Bond During DNA Synthesis

DEFF Research Database (Denmark)

Fatthalla, Maha I.; Pedersen, Erik B.

2016-01-01

acidic conditions, polarizes the triple bond in the intercalator and this makes hydration of the triple bond possible during the DNA synthesis and an oligonucleotide with 1-(indol-3-yl)-2-(pyren-1-yl)ethanone as the intercalator is formed. Insertion of the unhydrated and hydrated linker systems gave...

Phase formation at bonded vanadium and stainless steel interfaces

International Nuclear Information System (INIS)

Summers, T.S.E.

1992-01-01

The interface between vanadium bonded to stainless steel was studies to determine whether a brittle phase formed during three joining operations. Inertia friction welds between V and 21-6-9 stainless steel were examined using TEM. In the as-welded condition, a continuous, polygranular intermetallic layer about 0.25 μm thick was present at the interface. This layer grew to about 50 μm thick during heat treatment at 1000 degrees C for two hours. Analysis of electron diffraction patterns confirmed that this intermetallic was the ω phase. The interface between vanadium and type 304, SANDVIK SAF 2205, and 21-6-9 stainless steel bonded by a co-extrusion process had intermetallic particles at the interface in the as-extruded condition. Heat treatment at 1000 degrees C for two hours caused these particles to grow into continuous layers in all three cases. Based on the appearance, composition and hardness of this interfacial intermetallic, it was also concluded to be ω phase. Bonding V to type 430 stainless steel by co-extrusion caused V-rich carbides to form at the interface due to the higher concentration of C in the type 430 than in the other stainless steels investigated. The carbide particles initially present grew into a continuous layer during a two-hour heat treatment at 1000 degrees C. Co-hipping 21-6-9 stainless steel tubing with V rod resulted in slightly more concentric specimens than the co-extruded ones, but a continuous layer of the ω phase formed during the hipping operation. This brittle layer could initiate failure during subsequent forming operations. The vanadium near the stainless steel interface in the co-extruded and co-hipped tubing in some cases was harder than before heat treatment. It was concluded that this hardening was due to thermal straining during cooling following heat treatment and that thermal strains might present a greater problem than seen here when longer tubes are used in actual applications

Novel method for concentrating and drying polymeric nanoparticles: hydrogen bonding coacervate precipitation.

Science.gov (United States)

D'Addio, Suzanne M; Kafka, Concepcion; Akbulut, Mustafa; Beattie, Patrick; Saad, Walid; Herrera, Margarita; Kennedy, Michael T; Prud'homme, Robert K

2010-04-05

Nanoparticles have significant potential in therapeutic applications to improve the bioavailability and efficacy of active drug compounds. However, the retention of nanometer sizes during concentrating or drying steps presents a significant problem. We report on a new concentrating and drying process for poly(ethylene glycol) (PEG) stabilized nanoparticles, which relies upon the unique pH sensitive hydrogen bonding interaction between PEG and polyacid species. In the hydrogen bonding coacervate precipitation (HBCP) process, PEG protected nanoparticles rapidly aggregate into an easily filterable precipitate upon the addition various polyacids. When the resulting solid is neutralized, the ionization of the acid groups eliminates the hydrogen bonded structure and the approximately 100 nm particles redisperse back to within 10% of their original size when poly(acrylic acid) and citric acid are used and 45% when poly(aspartic acid) is used. While polyacid concentrations of 1-5 wt % were used to form the precipitates, the incorporation of the acid into the PEG layer is approximately 1:1 (acid residue):(ethylene oxide unit) in the final dried precipitate. The redispersion of dried beta-carotene nanoparticles protected with PEG-b-poly(lactide-co-glycolide) polymers dried by HBCP was compared with the redispersion of particles dried by freeze-drying with sucrose as a cryprotectant, spray freeze-drying, and normal drying. Freeze-drying with 0, 2, and 12 wt % sucrose solutions resulted in size increases of 350%, 50%, and 6%, respectively. Spray freeze-drying resulted in particles with increased sizes of 50%, but no cryoprotectant and only moderate redispersion energy was required. Conventional drying resulted in solids that could not be redispersed back to nanometer size. The new HBCP process offers a promising and efficient way to concentrate or convert nanoparticle dispersions into a stable dry powder form.

Palladium-Catalyzed Reductive Insertion of Alcohols into Aryl Ether Bonds

Energy Technology Data Exchange (ETDEWEB)

Wang, Meng [Institute for Integrated Catalysis, Pacific Northwest National Laboratory, P.O. Box 999 Richland WA 99352 USA; Gutiérrez, Oliver Y. [Institute for Integrated Catalysis, Pacific Northwest National Laboratory, P.O. Box 999 Richland WA 99352 USA; Camaioni, Donald M. [Institute for Integrated Catalysis, Pacific Northwest National Laboratory, P.O. Box 999 Richland WA 99352 USA; Lercher, Johannes A. [Institute for Integrated Catalysis, Pacific Northwest National Laboratory, P.O. Box 999 Richland WA 99352 USA; Department of Chemistry and Catalysis Research Institute, TU München, Lichtenbergstrasse 4 85748 Garching Germany

2018-03-06

Pd/C catalyzes C-O bond cleavage of aryl ethers (diphenyl ether and cyclohexyl phenyl ether) by methanol in H2. The aromatic C-O bond is cleaved by reductive methanolysis, which is initiated by Pd-catalyzed partial hydrogenation of one phenyl ring to form an enol ether. The enol ether reacts rapidly with methanol to form a ketal, which generates methoxycyclohexene by eliminating phenol or an alkanol. Subsequent hydrogenation leads to methoxycyclohexane.

Preservation of atomically clean silicon surfaces in air by contact bonding

DEFF Research Database (Denmark)

Grey, Francois; Ljungberg, Karin

1997-01-01

When two hydrogen-passivated silicon surfaces are placed in contact under cleanroom conditions, a weak bond is formed. Cleaving this bond under ultrahigh vacuum (UHV) conditions, and observing the surfaces with low energy electron diffraction and scanning tunneling microscopy, we find that the or...... reconstruction from oxidation in air, Contact bonding opens the way to novel applications of reconstructed semiconductor surfaces, by preserving their atomic structure intact outside of a UHV chamber. (C) 1997 American Institute of Physics.......When two hydrogen-passivated silicon surfaces are placed in contact under cleanroom conditions, a weak bond is formed. Cleaving this bond under ultrahigh vacuum (UHV) conditions, and observing the surfaces with low energy electron diffraction and scanning tunneling microscopy, we find...... that the ordered atomic structure of the surfaces is protected from oxidation, even after the bonded samples have been in air for weeks. Further, we show that silicon surfaces that have been cleaned and hydrogen-passivated in UHV can be contacted in UHV in a similarly hermetic fashion, protecting the surface...

27 CFR 28.133 - Disposition of forms.

Science.gov (United States)

2010-04-01

..., or Transportation to a Manufacturing Bonded Warehouse Return of Wines to Bonded Wine Cellar § 28.133 Disposition of forms. On receipt of the wines at the bonded wine cellar, the proprietor shall endorse, on each..., DEPARTMENT OF THE TREASURY LIQUORS EXPORTATION OF ALCOHOL Withdrawal of Wine Without Payment of Tax for...

Diffusion-bonded 16MND5-Inconel 690-316LN junction: elaboration and process residual stresses modeling

International Nuclear Information System (INIS)

Martinez, Michael

1999-01-01

The objective of this research thesis is, on the one hand, to elaborate and to characterise a bonded junction of 16MND5 and 316LN steels, and, on the other hand, to develop a simulation tool for the prediction of microstructures after bonding, as well as residual stresses related to this process. The author first reports the study of the use of diffusion bonding by hot isostatic pressing (HIP diffusion bonding) for the bonding of 16MND5 (steel used in French PWR vessel) and 316LN (austenitic stainless steel used in piping), in order to obtain junctions adapted to a use within PWRs. In this case, the use of an Inconel insert material appeared to be necessary to avoid stainless steel carburization. Thus, inserts in Inconel 600 and 690 have been tested. The objective has then been to develop a realistic calculation of residual stresses in this assembly. These stresses are stimulated by quenching. The author notably studied the simulation of temperature dependent phase transformations, and stress induced phase transformations. An existing model is validated and applied to HIP and quenching cycles. The last part reports the calculation of residual stresses by simulation of the mechanical response of the three-component material cooled from 900 C to room temperature and thus submitted to a loading of thermal origin (dilatation) and metallurgical origin (phase transformations in the 16MND5). The effect of carbon diffusion on mechanical properties has also been taken into account. The author discusses problems faced by existing models, and explains the choice of conventional macro-mechanical models. The three materials are supposed to have a plastic-viscoplastic behaviour with isotropic and kinematic strain hardening, and this behaviour is identified between 20 and 900 C [fr

Hencky's model for elastomer forming process

Science.gov (United States)

Oleinikov, A. A.; Oleinikov, A. I.

2016-08-01

In the numerical simulation of elastomer forming process, Henckys isotropic hyperelastic material model can guarantee relatively accurate prediction of strain range in terms of large deformations. It is shown, that this material model prolongate Hooke's law from the area of infinitesimal strains to the area of moderate ones. New representation of the fourth-order elasticity tensor for Hencky's hyperelastic isotropic material is obtained, it possesses both minor symmetries, and the major symmetry. Constitutive relations of considered model is implemented into MSC.Marc code. By calculating and fitting curves, the polyurethane elastomer material constants are selected. Simulation of equipment for elastomer sheet forming are considered.

Peptide bond-forming reagents HOAt and HATU are not mutagenic in the bacterial reverse mutation test.

Science.gov (United States)

Nicolette, John; Neft, Robin E; Vanosdol, Jessica; Murray, Joel

2016-04-01

The peptide bond-forming reagents 1-hydroxy-7-azabenzotriazole (HOAt, CAS 39968-33-7) and O-(7-Azabenzotriazol-1-yl)-N,N,N',N'-tetramethyluronium hexafluorophosphate (HATU, CAS 148893-10-1) either have structural alerts, unclassified features or are considered out of domain when evaluated for potential mutagenicity with in silico programs DEREK and CaseUltra. Since they are commonly used reagents in pharmaceutical drug syntheses, they may become drug substance or drug product impurities and would need to be either controlled to appropriately safe levels or tested for mutagenicity. Both reagents were tested in the bacterial reverse mutation (Ames) test at Covance, under GLP conditions, following the OECD test guideline and ICH S2(R1) recommendations and found to be negative. Our data show that HOAt and HATU-common pharmaceutical synthesis reagents-are not mutagenic, and can be treated as ordinary drug impurities. © 2016 Wiley Periodicals, Inc.

77 FR 37098 - Proposed Collection; Comment Request for Form 8038-CP

Science.gov (United States)

2012-06-20

... 8038-CP AGENCY: Internal Revenue Service (IRS), Treasury. ACTION: Notice and request for comments... Form 8038-CP, Return for Credit Payments to Issuers of Qualified Bonds. DATES: Written comments should... Issuers of Qualified Bonds. OMB Number: 1545-2142. Form Number: Form 8038-CP. Abstract: Form 8038-CP...

Bonding silicon nitride using glass-ceramic

International Nuclear Information System (INIS)

Dobedoe, R.S.

1995-01-01

Silicon nitride has been successfully bonded to itself using magnesium-aluminosilicate glass and glass-ceramic. For some samples, bonding was achieved using a diffusion bonder, but in other instances, following an initial degassing hold, higher temperatures were used in a nitrogen atmosphere with no applied load. For diffusion bonding, a small applied pressure at a temperature below which crystallisation occurs resulted in intimate contact. At slightly higher temperatures, the extent of the reaction at the interface and the microstructure of the glass-ceramic joint was highly sensitive to the bonding temperature. Bonding in a nitrogen atmosphere resulted in a solution-reprecipitation reaction. A thin layer of glass produced a ''dry'', glass-free joint, whilst a thicker layer resulted in a continuous glassy join across the interface. The chromium silicide impurities within the silicon nitride react with the nucleating agent in the glass ceramic, which may lead to difficulty in producing a fine glass-ceramic microstructure. Slightly lower temperatures in nitrogen resulted in a polycrystalline join but the interfacial contact was poor. It is hoped that one of the bonds produced may be developed to eventually form part of a graded joint between silicon nitride and a high temperature nickel alloy. (orig.)

Simulation of Glass Fiber Forming Processes

DEFF Research Database (Denmark)

Von der Ohe, Renate

Two glass fiber forming processes have been simulated using FEM, which are the drawing of continuous glass fibers for reinforcement purposes and the spinning of discontinuous glass fibers - stone wool for insulation. The aim of this work was to set up a numerical model for each process, and to use...... this model in finding relationships between the production conditions and the resulting fiber properties. For both processes, a free surface with large deformation and radiative and convective heat transfer must be taken into account. The continuous fiber drawing has been simulated successfully......, and parametric studies have been made. Several properties that characterize the process have been calculated, and the relationship between the fictive temperature and the cooling rate of the fibers has been found. The model for the discontinuous fiber spinning was brought to the limits of the commercial code...

An investigation on microstructure evolution and mechanical properties during liquid state diffusion bonding of Al2024 to Ti–6Al–4V

Energy Technology Data Exchange (ETDEWEB)

Samavatian, Majid, E-mail: m.samavatian@srbiau.ac.ir [Department of Materials Engineering, Tehran Science and Research Branch, Islamic Azad University, Tehran (Iran, Islamic Republic of); Halvaee, Ayoub; Amadeh, Ahmad Ali [School of Metallurgy and Materials Engineering, College of Engineering, University of Tehran, Tehran (Iran, Islamic Republic of); Khodabandeh, Alireza [Department of Materials Engineering, Tehran Science and Research Branch, Islamic Azad University, Tehran (Iran, Islamic Republic of)

2014-12-15

Joining mechanism of Ti/Al dissimilar alloys was studied during liquid state diffusion bonding process using Cu/Sn/Cu interlayer at 510 °C under vacuum of 7.5 × 10{sup −5} Torr for various bonding times. The microstructure and compositional changes in the joint zone were analyzed by scanning electron microscopy equipped with energy dispersive spectroscopy and X-ray diffraction. Microhardness and shear strength tests were also applied to study the mechanical properties of the joints. It was found that with an increase in bonding time, the elements of interlayer diffused into the parent metals and formed various intermetallic compounds at the interface. Diffusion process led to the isothermal solidification and the bonding evolution in the joint zone. The results from mechanical tests showed that microhardness and shear strength values have a straight relation with bonding time so that the maximum shear strength of joint was obtained for a bond made with 60 min bonding time. - Highlights: • Liquid state diffusion bonding of Al2024 to Ti–6Al–4V was performed successfully. • Diffusion of the elements caused the formation of various intermetallics at the interface. • Microhardness and shear strength values have a straight relation with bonding time. • The maximum shear strength reached to 36 MPa in 60 min bonding time.

An investigation on microstructure evolution and mechanical properties during liquid state diffusion bonding of Al2024 to Ti–6Al–4V

International Nuclear Information System (INIS)

Samavatian, Majid; Halvaee, Ayoub; Amadeh, Ahmad Ali; Khodabandeh, Alireza

2014-01-01

Joining mechanism of Ti/Al dissimilar alloys was studied during liquid state diffusion bonding process using Cu/Sn/Cu interlayer at 510 °C under vacuum of 7.5 × 10 −5 Torr for various bonding times. The microstructure and compositional changes in the joint zone were analyzed by scanning electron microscopy equipped with energy dispersive spectroscopy and X-ray diffraction. Microhardness and shear strength tests were also applied to study the mechanical properties of the joints. It was found that with an increase in bonding time, the elements of interlayer diffused into the parent metals and formed various intermetallic compounds at the interface. Diffusion process led to the isothermal solidification and the bonding evolution in the joint zone. The results from mechanical tests showed that microhardness and shear strength values have a straight relation with bonding time so that the maximum shear strength of joint was obtained for a bond made with 60 min bonding time. - Highlights: • Liquid state diffusion bonding of Al2024 to Ti–6Al–4V was performed successfully. • Diffusion of the elements caused the formation of various intermetallics at the interface. • Microhardness and shear strength values have a straight relation with bonding time. • The maximum shear strength reached to 36 MPa in 60 min bonding time

Interactions between motion and form processing in the human visual system

Directory of Open Access Journals (Sweden)

George eMather

2013-05-01

Full Text Available The predominant view of motion and form processing in the human visual system assumes that these two attributes are handled by separate and independent modules. Motion processing involves filtering by direction-selective sensors, followed by integration to solve the aperture problem. Form processing involves filtering by orientation-selective and size-selective receptive fields, followed by integration to encode object shape. It has long been known that motion signals can influence form processing in the well-known Gestalt principle of common fate; texture elements which share a common motion property are grouped into a single contour or texture region. However recent research in psychophysics and neuroscience indicates that the influence of form signals on motion processing is more extensive than previously thought. First, the salience and apparent direction of moving lines depends on how the local orientation and direction of motion combine to match the receptive field properties of motion-selective neurons. Second, orientation signals generated by ‘motion-streaks’ influence motion processing; motion sensitivity, apparent direction and adaptation are affected by simultaneously present orientation signals. Third, form signals generated by human body shape influence biological motion processing, as revealed by studies using point-light motion stimuli. Thus form-motion integration seems to occur at several different levels of cortical processing, from V1 to STS.

Alkyl Radicals as Hydrogen Bond Acceptors: Computational Evidence

DEFF Research Database (Denmark)

Hammerum, Steen

2009-01-01

Spectroscopic, energetic and structural information obtained by DFT and G3-type computational studies demonstrates that charged proton donors can form moderately strong hydrogen bonds to simple alkyl radicals. The presence of these bonds stabilizes the adducts and modifies their structure......, and gives rise to pronounced shifts of IR stretching frequencies and to increased absorption intensities. The hydrogen bond acceptor properties of alkyl radicals equal those of many conventional acceptors, e.g., the bond length changes and IR red-shifts suggest that tert-butyl radicals are slightly better...... acceptors than formaldehyde molecules, while propyl radicals are as good as H2O. The hydrogen bond strength appears to depend on the proton affinity of the proton donor and on the ionization energy of the acceptor alkyl radical, not on the donor-acceptor proton affinity difference, reflecting...

Redshift or adduct stabilization -- a computational study of hydrogen bonding in adducts of protonated carboxylic acids

DEFF Research Database (Denmark)

Olesen, Solveig Gaarn; Hammerum, Steen

2009-01-01

It is generally expected that the hydrogen bond strength in a D-H-A adduct is predicted by the difference between the proton affinities of D and A, measured by the adduct stabilization, and demonstrated by the IR redshift of the D-H bond stretching vibrational frequency. These criteria do...... not always yield consistent predictions, as illustrated by the hydrogen bonds formed by the E and Z OH groups of protonated carboxylic acids. The delta-PA and the stabilization of a series of hydrogen bonded adducts indicate that the E OH group forms the stronger hydrogen bonds, whereas the bond length...... carboxylic acids are different. The OH bond length and IR redshift afford the better measure of hydrogen bond strength....

Effects of Forming Process on Composite mode I Interlaminar Fracture Toughness

Directory of Open Access Journals (Sweden)

CHEN Xingyi

2016-10-01

Full Text Available In order to compare and analyse the effect of two different kinds of forming process on composite mode I interlaminar fracture toughness, the DCB specimens were tested by using hypothesis inspeetion method.A finite element model was also used to simulate the crack propagation process.The results demonstrate that the average of mode I interlaminar fracture toughness from silicon rubber flexible mold forming is a bit higher than that from metal rigid mold forming.Howevers the variance of mode I interlaminar fracture toughness from the two groups shows no significant difference.The crack propagation process of the two forming process is similar. The established finite element model, which is identical to the test results, can predict the process of the crack expansion effectively.

Electronic structure and interatomic bonding in Al10V

International Nuclear Information System (INIS)

Jahnatek, M; Krajci, M; Hafner, J

2003-01-01

On the basis of ab initio calculations we analysed the electron density distribution in the elementary cell of the compound Al 10 V. We found covalent bonding between certain atoms. The Al-V bonds of enhanced covalency are linked into -Al-V-Al-V- chains that extend over the whole crystal. The chains intersect at each V site and together form a Kagome network of corner-sharing tetrahedra. The large voids of this network are filled by Z 16 Friauf polyhedra consisting of Al atoms only. The skeleton of the Friauf polyhedron has the form of a truncated tetrahedron and consists of 12 strongly bonded Al atoms. These Al-Al bonds also have covalent character. The bonding is dominated by sp 2 hybridization. The centre of the Friauf polyhedron may be empty or occupied by an Al atom. The thermodynamic stability of the phase is investigated. The Al 21 V 2 phase with occupied voids is at low temperatures less stable than Al 10 V. The Al 10 V structure can be considered as a special case of the Al 18 Cr 2 Mg 3 structural class. We have found the same picture of bonding as we report here for Al 10 V for several other aluminium-rich alloys belonging to the Al 18 Cr 2 Mg 3 structural class also

Advanced waste forms from spent nuclear fuel

International Nuclear Information System (INIS)

Ackerman, J.P.; McPheeters, C.C.

1995-01-01

More than one hundred spent nuclear fuel types, having an aggregate mass of more than 5000 metric tons (2700 metric tons of heavy metal), are stored by the United States Department of Energy. This paper proposes a method for converting this wide variety of fuel types into two waste forms for geologic disposal. The method is based on a molten salt electrorefining technique that was developed for conditioning the sodium-bonded, metallic fuel from the Experimental Breeder Reactor-II (EBR-II) for geologic disposal. The electrorefining method produces two stable, optionally actinide-free, high-level waste forms: an alloy formed from stainless steel, zirconium, and noble metal fission products, and a ceramic waste form containing the reactive metal fission products. Electrorefining and its accompanying head-end process are briefly described, and methods for isolating fission products and fabricating waste forms are discussed

Designing Advanced Ceramic Waste Forms for Electrochemical Processing Salt Waste

International Nuclear Information System (INIS)

Ebert, W. L.; Snyder, C. T.; Frank, Steven; Riley, Brian

2016-01-01

This report describes the scientific basis underlying the approach being followed to design and develop ''advanced'' glass-bonded sodalite ceramic waste form (ACWF) materials that can (1) accommodate higher salt waste loadings than the waste form developed in the 1990s for EBR-II waste salt and (2) provide greater flexibility for immobilizing extreme waste salt compositions. This is accomplished by using a binder glass having a much higher Na_2O content than glass compositions used previously to provide enough Na+ to react with all of the Cl- in the waste salt and generate the maximum amount of sodalite. The phase compositions and degradation behaviors of prototype ACWF products that were made using five new binder glass formulations and with 11-14 mass% representative LiCl/KCl-based salt waste were evaluated and compared with results of similar tests run with CWF products made using the original binder glass with 8 mass% of the same salt to demonstrate the approach and select a composition for further studies. About twice the amount of sodalite was generated in all ACWF materials and the microstructures and degradation behaviors confirmed our understanding of the reactions occurring during waste form production and the efficacy of the approach. However, the porosities of the resulting ACWF materials were higher than is desired. These results indicate the capacity of these ACWF waste forms to accommodate LiCl/KCl-based salt wastes becomes limited by porosity due to the low glass-to-sodalite volume ratio. Three of the new binder glass compositions were acceptable and there is no benefit to further increasing the Na content as initially planned. Instead, further studies are needed to develop and evaluate alternative production methods to decrease the porosity, such as by increasing the amount of binder glass in the formulation or by processing waste forms in a hot isostatic press. Increasing the amount of binder glass to eliminate porosity will decrease the waste

Designing Advanced Ceramic Waste Forms for Electrochemical Processing Salt Waste

Energy Technology Data Exchange (ETDEWEB)

Ebert, W. L. [Argonne National Lab. (ANL), Argonne, IL (United States); Snyder, C. T. [Argonne National Lab. (ANL), Argonne, IL (United States); Frank, Steven [Argonne National Lab. (ANL), Argonne, IL (United States); Riley, Brian [Argonne National Lab. (ANL), Argonne, IL (United States)

2016-03-01

This report describes the scientific basis underlying the approach being followed to design and develop “advanced” glass-bonded sodalite ceramic waste form (ACWF) materials that can (1) accommodate higher salt waste loadings than the waste form developed in the 1990s for EBR-II waste salt and (2) provide greater flexibility for immobilizing extreme waste salt compositions. This is accomplished by using a binder glass having a much higher Na₂O content than glass compositions used previously to provide enough Na+ to react with all of the Cl– in the waste salt and generate the maximum amount of sodalite. The phase compositions and degradation behaviors of prototype ACWF products that were made using five new binder glass formulations and with 11-14 mass% representative LiCl/KCl-based salt waste were evaluated and compared with results of similar tests run with CWF products made using the original binder glass with 8 mass% of the same salt to demonstrate the approach and select a composition for further studies. About twice the amount of sodalite was generated in all ACWF materials and the microstructures and degradation behaviors confirmed our understanding of the reactions occurring during waste form production and the efficacy of the approach. However, the porosities of the resulting ACWF materials were higher than is desired. These results indicate the capacity of these ACWF waste forms to accommodate LiCl/KCl-based salt wastes becomes limited by porosity due to the low glass-to-sodalite volume ratio. Three of the new binder glass compositions were acceptable and there is no benefit to further increasing the Na content as initially planned. Instead, further studies are needed to develop and evaluate alternative production methods to decrease the porosity, such as by increasing the amount of binder glass in the formulation or by processing waste forms in a hot isostatic press. Increasing the amount of binder glass to eliminate porosity will decrease

Topology of charge density of flucytosine and related molecules and characteristics of their bond charge distributions.

Science.gov (United States)

Murgich, Juan; Franco, Héctor J; San-Blas, Gioconda

2006-08-24

The molecular charge distribution of flucytosine (4-amino-5-fluoro-2-pyrimidone), uracil, 5-fluorouracil, and thymine was studied by means of density functional theory calculations (DFT). The resulting distributions were analyzed by means of the atoms in molecules (AIM) theory. Bonds were characterized through vectors formed with the charge density value, its Laplacian, and the bond ellipticity calculated at the bond critical point (BCP). Within each set of C=O, C-H, and N-H bonds, these vectors showed little dispersion. C-C bonds formed three different subsets, one with a significant degree of double bonding, a second corresponding to single bonds with a finite ellipticity produced by hyperconjugation, and a third one formed by a pure single bond. In N-C bonds, a decrease in bond length (an increase in double bond character) was not reflected as an increase in their ellipticity, as in all C-C bonds studied. It was also found that substitution influenced the N-C, C-O, and C-C bond ellipticity much more than density and its Laplacian at the BCP. The Laplacian of charge density pointed to the existence of both bonding and nonbonding maxima in the valence shell charge concentration of N, O, and F, while only bonding ones were found for the C atoms. The nonbonding maxima related to the sites for electrophilic attack and H bonding in O and N, while sites of nucleophilic attack were suggested by the holes in the valence shell of the C atoms of the carbonyl groups.

Note: Anodic bonding with cooling of heat-sensitive areas

DEFF Research Database (Denmark)

Vesborg, Peter Christian Kjærgaard; Olsen, Jakob Lind; Henriksen, Toke Riishøj

2010-01-01

Anodic bonding of silicon to glass always involves heating the glass and device to high temperatures so that cations become mobile in the electric field. We present a simple way of bonding thin silicon samples to borosilicate glass by means of heating from the glass side while locally cooling hea......-sensitive areas from the silicon side. Despite the high thermal conductivity of silicon, this method allows a strong anodic bond to form just millimeters away from areas essentially at room temperature....

Photoinitiated reactions in weakly bonded complexes

International Nuclear Information System (INIS)

Wittig, C.

1993-01-01

This paper discusses photoinitiated reactions in weakly bonded binary complexes in which the constituents are only mildly perturbed by the intermolecular bond. Such complexes, with their large zero point excursions, set the stage for events that occur following electronic excitation of one of the constituents. This can take several forms, but in all cases, entrance channel specificity is imposed by the character of the complex as well as the nature of the photoinitiation process. This has enabled us to examine aspects of bimolecular processes: steric effects, chemical branching ratios, and inelastic scattering. Furthermore, monitoring reactions directly in the time domain can reveal mechanisms that cannot be inferred from measurements of nascent product excitations. Consequently, we examined several systems that had been studied previously by our group with product state resolution. With CO 2 /HI, in which reaction occurs via a HOCO intermediate, the rates agree with RRKM predictions. With N 2 O/HI, the gas phase single collision reaction yielding OH + N 2 has been shown to proceed mainly via an HNNO intermediate that undergoes a 1,3-hydrogen shift to the OH + N 2 channel. With complexes, ab initio calculations and high resolution spectroscopic studies of analogous systems suggest that the hydrogen, while highly delocalized, prefers the oxygen to the nitrogen. We observe that OH is produced with a fast risetime (< 250 fs) which can be attributed to either direct oxygen-side attack or rapid HNNO decomposition and/or a termolecular contribution involving the nearby iodine

Bismuth-boron multiple bonding in BiB_2O"- and Bi_2B"-

International Nuclear Information System (INIS)

Jian, Tian; Cheung, Ling Fung; Chen, Teng-Teng; Wang, Lai-Sheng

2017-01-01

Despite its electron deficiency, boron is versatile in forming multiple bonds. Transition-metal-boron double bonding is known, but boron-metal triple bonds have been elusive. Two bismuth boron cluster anions, BiB_2O"- and Bi_2B"-, containing triple and double B-Bi bonds are presented. The BiB_2O"- and Bi_2B"- clusters are produced by laser vaporization of a mixed B/Bi target and characterized by photoelectron spectroscopy and ab initio calculations. Well-resolved photoelectron spectra are obtained and interpreted with the help of ab initio calculations, which show that both species are linear. Chemical bonding analyses reveal that Bi forms triple and double bonds with boron in BiB_2O"- ([Bi≡B-B≡O]"-) and Bi_2B"- ([Bi=B=Bi]"-), respectively. The Bi-B double and triple bond strengths are calculated to be 3.21 and 4.70 eV, respectively. This is the first experimental observation of Bi-B double and triple bonds, opening the door to design main-group metal-boron complexes with multiple bonding. (copyright 2017 Wiley-VCH Verlag GmbH and Co. KGaA, Weinheim)

Copper-Catalyzed Oxidative Reaction of β-Keto Sulfones with Alcohols via C-S Bond Cleavage: Reaction Development and Mechanism Study.

Science.gov (United States)

Du, Bingnan; Wang, Wenmin; Wang, Yang; Qi, Zhenghang; Tian, Jiaqi; Zhou, Jie; Wang, Xiaochen; Han, Jianlin; Ma, Jing; Pan, Yi

2018-02-16

A Cu-catalyzed cascade oxidative radical process of β-keto sulfones with alcohols has been achieved by using oxygen as an oxidant. In this reaction, β-keto sulfones were converted into sulfinate esters under the oxidative conditions via cleavage of C-S bond. Experimental and computational studies demonstrate that a new pathway is involved in this reaction, which proceeds through the formation of the key four-coordinated Cu II intermediate, O-O bond homolysis induced C-S bond cleavage and Cu-catalyzed esterification to form the final products. This reaction provides a new strategy to sulfonate esters and enriches the research content of C-S bond cleavage and transformations. © 2018 Wiley-VCH Verlag GmbH & Co. KGaA, Weinheim.

Low-temperature Au/a-Si wafer bonding

International Nuclear Information System (INIS)

Jing, Errong; Xiong, Bin; Wang, Yuelin

2011-01-01

The Si/SiO 2 /Ti/Au–Au/Ti/a-Si/SiO 2 /Si bonding structure, which can also be used for the bonding of non-silicon material, was investigated for the first time in this paper. The bond quality test showed that the bond yield, bond repeatability and average shear strength are higher for this bonding structure. The interfacial microstructure analysis indicated that the Au-induced crystallization of the amorphous silicon process leads to big Si grains extending across the bond interface and Au filling the other regions of the bond interface, which result into a strong and void-free bond interface. In addition, the Au-induced crystallization reaction leads to a change in the IR images of the bond interface. Therefore, the IR microscope can be used to evaluate and compare the different bond strengths qualitatively. Furthermore, in order to verify the superiority of the bonding structure, the Si/SiO 2 /Ti/Au–a-Si/SiO 2 /Si (i.e. no Ti/Au layer on the a-Si surface) and Si/SiO 2 /Ti/Au–Au/Ti/SiO 2 /Si bonding structures (i.e. Au thermocompression bonding) were also investigated. For the Si/SiO 2 /Ti/Au–a-Si/SiO 2 /Si bonding structure, the poor bond quality is due to the native oxide layer on the a-Si surface, and for the Si/SiO 2 /Ti/Au–Au/Ti/SiO 2 /Si bonding structure, the poor bond quality is caused by the wafer surface roughness which prevents intimate contact and limits the interdiffusion at the bond interface.

Numerical Analysis of Warpage Induced by Thermo-Compression Bonding Process of Cu Pillar Bump Flip Chip Package

Energy Technology Data Exchange (ETDEWEB)

Kwon, Oh Young; Jung, Hoon Sun; Lee, Jung Hoon; Choa, Sung-Hoon [Seoul Nat’l Univ. of Science and Technology, Seoul (Korea, Republic of)

2017-06-15

In flip chip technology, the conventional solder bump has been replaced with a copper (Cu) pillar bump owing to its higher input/output (I/O) density, finer pitch, and higher reliability. However, Cu pillar bump technology faces several issues, such as interconnect shorting and higher low-k stress due to stiffer Cu pillar structure when the conventional reflow process is used. Therefore, the thermal compression bonding (TCB) process has been adopted in the flip chip attachment process in order to reduce the package warpage and stress. In this study, we investigated the package warpage induced during the TCB process using a numerical analysis. The warpage of the TCB process was compared with that of the reflow process.

Nucleophilicities of Lewis Bases B and Electrophilicities of Lewis Acids A Determined from the Dissociation Energies of Complexes B⋯A Involving Hydrogen Bonds, Tetrel Bonds, Pnictogen Bonds, Chalcogen Bonds and Halogen Bonds.

Science.gov (United States)

Alkorta, Ibon; Legon, Anthony C

2017-10-23

It is shown that the dissociation energy D e for the process B⋯A = B + A for 250 complexes B⋯A composed of 11 Lewis bases B (N₂, CO, HC≡CH, CH₂=CH₂, C₃H₆, PH₃, H₂S, HCN, H₂O, H₂CO and NH₃) and 23 Lewis acids (HF, HCl, HBr, HC≡CH, HCN, H₂O, F₂, Cl₂, Br₂, ClF, BrCl, H₃SiF, H₃GeF, F₂CO, CO₂, N₂O, NO₂F, PH₂F, AsH₂F, SO₂, SeO₂, SF₂, and SeF₂) can be represented to good approximation by means of the equation D e = c ' N B E A , in which N B is a numerical nucleophilicity assigned to B, E A is a numerical electrophilicity assigned to A, and c ' is a constant, conveniently chosen to have the value 1.00 kJ mol -1 here. The 250 complexes were chosen to cover a wide range of non-covalent interaction types, namely: (1) the hydrogen bond; (2) the halogen bond; (3) the tetrel bond; (4) the pnictogen bond; and (5) the chalcogen bond. Since there is no evidence that one group of non-covalent interaction was fitted any better than the others, it appears the equation is equally valid for all the interactions considered and that the values of N B and E A so determined define properties of the individual molecules. The values of N B and E A can be used to predict the dissociation energies of a wide range of binary complexes B⋯A with reasonable accuracy.

Vanadium dioxide formed by the sol-gel process

International Nuclear Information System (INIS)

Potember, R.S.; Speck, K.R.; Hu, H.S.

1990-01-01

This patent describes a process for the deposition of a crystalline vanadium dioxide thin film. It comprises: providing a solution comprising a vanadium tetraalkoxide and solvent; allowing hydrolysis and condensation reactions to progressively form a homogeneous sol from the solution, applying a coating of the sol to the substrate; allowing a gel to form from the sol on the substrate by evaporating the solvent; dehydrating the gel by heat treatment under an inert atmosphere to form the crystalline vanadium dioxide film

Preparation and properties of isotropic Nd-Fe-B bonded magnets with sodium silicate binder

Energy Technology Data Exchange (ETDEWEB)

Liu, W.Q.; Hu, R.J.; Yue, M., E-mail: yueming@bjut.edu.cn; Yin, Y.X.; Zhang, D.T.

2017-08-01

Graphical abstract: To improve the working temperature of bonded Nd-Fe-B magnets, the heat-resistant binder, sodium silicate, was used to prepare new type bonded Nd-Fe-B magnets. The three-dimensional Si-O-Si structure formed in the curing process has excellent strength; it can ensure that the bonded magnets have a certain shape and usable magnetic properties when working at 200 °C. - Highlights: • Sodium silicate enables bonded Nd-Fe-B magnets to be used for higher operation temperatures. • The sodium silicate bonded magnets exhibit usable maximum energy product of 4.057 MGOe at 200 °C. • The compressive strength of sodium silicate bonded magnets is twice bigger than that of epoxy resin bonded magnets. - Abstract: In present study, sodium silicate, a kind of heat-resistant binder, was used to prepare bonded Nd-Fe-B magnets with improved thermal stability and mechanical strength. Effect of curing temperature and curing time of the new binder to the magnetic properties, microstructure, and mechanical strength of the magnets was systematically investigated. Fracture surface morphology observation show that sodium silicate in bonded magnets could completely be cured at 175 °C for 40 min, and the magnets prepared under this condition exhibit optimal properties. They exhibit usable magnetic properties of B{sub r} of 4.66 kGs, H{sub cj} of 4.84 kOe, and (BH){sub max} of 4.06 MGOe at 200 °C. Moreover, the magnets possess high compressive strength of 63 MPa.

Formation of porous surface layers in reaction bonded silicon nitride during processing

Science.gov (United States)

Shaw, N. J.; Glasgow, T. K.

1979-01-01

Microstructural examination of reaction bonded silicon nitride (RBSN) has shown that there is often a region adjacent to the as-nitrided surfaces that is even more porous than the interior of this already quite porous material. Because this layer of large porosity is considered detrimental to both the strength and oxidation resistance of RBSN, a study was undertaken to determine if its formation could be prevented during processing. All test bars studied were made from a single batch of Si powder which was milled for 4 hours in heptane in a vibratory mill using high density alumina cylinders as the grinding media. After air drying the powder, bars were compacted in a single acting die and hydropressed.

Altering intra- to inter-molecular hydrogen bonding by dimethylsulfoxide: A TDDFT study of charge transfer for coumarin 343

Science.gov (United States)

Liu, Xiaochun; Yin, Hang; Li, Hui; Shi, Ying

2017-04-01

DFT and TDDFT methods were carried out to investigate the influences of intramolecular and intermolecular hydrogen bonding on excited state charge transfer for coumarin 343 (C343). Intramolecular hydrogen bonding is formed between carboxylic acid group and carbonyl group in C343 monomer. However, in dimethylsulfoxide (DMSO) solution, DMSO 'opens up' the intramolecular hydrogen bonding and forms solute-solvent intermolecular hydrogen bonded C343-DMSO complex. Analysis of frontier molecular orbitals reveals that intramolecular charge transfer (ICT) occurs in the first excited state both for C343 monomer and complex. The results of optimized geometric structures indicate that the intramolecular hydrogen bonding interaction is strengthened while the intermolecular hydrogen bonding is weakened in excited state, which is confirmed again by monitoring the shifts of characteristic peaks of infrared spectra. We demonstrated that DMSO solvent can not only break the intramolecular hydrogen bonding to form intermolecular hydrogen bonding with C343 but also alter the mechanism of excited state hydrogen bonding strengthening.

Apparatus for electrical-assisted incremental forming and process thereof

Science.gov (United States)

Roth, John; Cao, Jian

2018-04-24

A process and apparatus for forming a sheet metal component using an electric current passing through the component. The process can include providing an incremental forming machine, the machine having at least one arcuate tipped tool and at least electrode spaced a predetermined distance from the arcuate tipped tool. The machine is operable to perform a plurality of incremental deformations on the sheet metal component using the arcuate tipped tool. The machine is also operable to apply an electric direct current through the electrode into the sheet metal component at the predetermined distance from the arcuate tipped tool while the machine is forming the sheet metal component.

Ultrafast dynamics of hydrogen bond exchange in aqueous ionic solutions.

Science.gov (United States)

Park, Sungnam; Odelius, Michael; Gaffney, Kelly J

2009-06-04

The structural and dynamical properties of aqueous ionic solutions influence a wide range of natural and biological processes. In these solutions, water has the opportunity to form hydrogen bonds with other water molecules and anions. Knowing the time scale with which these configurations interconvert represents a key factor to understanding the influence of molecular scale heterogeneity on chemical events in aqueous ionic solutions. We have used ultrafast IR spectroscopy and Car-Parrinello molecular dynamics (CPMD) simulations to investigate the hydrogen bond (H-bond) structural dynamics in aqueous 6 M sodium perchlorate (NaClO4) solution. We have measured the H-bond exchange dynamics between spectrally distinct water-water and water-anion H-bond configurations with 2DIR spectroscopy and the orientational relaxation dynamics of water molecules in different H-bond configurations with polarization-selective IR pump-probe experiments. The experimental H-bond exchange time correlates strongly with the experimental orientational relaxation time of water molecules. This agrees with prior observations in water and aqueous halide solutions, and has been interpreted within the context of an orientational jump model for the H-bond exchange. The CPMD simulations performed on aqueous 6 M NaClO4 solution clearly demonstrate that water molecules organize into two radially and angularly distinct structural subshells within the first solvation shell of the perchlorate anion, with one subshell possessing the majority of the water molecules that donate H-bonds to perchlorate anions and the other subshell possessing predominantly water molecules that donate two H-bonds to other water molecules. Due to the high ionic concentration used in the simulations, essentially all water molecules reside in the first ionic solvation shells. The CPMD simulations also demonstrate that the molecular exchange between these two structurally distinct subshells proceeds more slowly than the H-bond

A novel methodology for in-process monitoring of flow forming

Science.gov (United States)

Appleby, Andrew; Conway, Alastair; Ion, William

2017-10-01

Flow forming (FF) is an incremental cold working process with near-net-shape forming capability. Failures by fracture due to high deformation can be unexpected and sometimes catastrophic, causing tool damage. If process failures can be identified in real time, an automatic cut-out could prevent costly tool damage. Sound and vibration monitoring is well established and commercially viable in the machining sector to detect current and incipient process failures, but not for FF. A broad-frequency microphone was used to record the sound signature of the manufacturing cycle for a series of FF parts. Parts were flow formed using single and multiple passes, and flaws were introduced into some of the parts to simulate the presence of spontaneously initiated cracks. The results show that this methodology is capable of identifying both introduced defects and spontaneous failures during flow forming. Further investigation is needed to categorise and identify different modes of failure and identify further potential applications in rotary forming.

Research on Lessening of Bonding Effects Between the Metallic and Non-Metallic Surfaces Through the Graphite Films Deposited with Pulsed Electrical Discharges Process

Science.gov (United States)

Marin, L.; Topala, P.

2017-06-01

The paper presents the results of experimental research on the physics of natural graphite film formation, the establishment of chemical composition and functional properties of the graphite films, formed on metal surfaces, as a result of the action of plasma in the air environment, at a normal pressure, under the electrical discharge in impulse conditions (EDI). The researchings were performed in the frame of doctoral thesis “Research on lessening of the bonding effects between the metallic and nonmetallic surfaces through the graphite films” and aimed to identify the phenomena that occur at the interface metal/ film of graphite, and to identify also the technological applications that it may have the surface treatment for submitting the films of graphite on metallic surfaces achieved through an innovative process of electrical pulsed discharges. After the research works from the PhD theme above mentioned, a number of interesting properties of graphite pellicle have been identified ie reducing of metal surface polarity. This led to drastic decreases for the values of adhesion when bonding of metal surfaces was performed using a structural polyurethane adhesive designed by ICECHIM. Following the thermo-gravimetric analysis, performed of the graphite film obtained by process of electrical pulsed discharges, have been also discovered other interesting properties for this, ie reversible mass additions at specific values of the working temperature Chemical and scanning electron microscopy analysis have revealed that on the metallic surface subjected to electrical pulsed discharges process, outside the graphite film, it is also obtained a series of spatial formation composed of carbon atoms fullerenes type which are responsible for the phenomenon of addition of mass.

Bond yield curve construction

Directory of Open Access Journals (Sweden)

Kožul Nataša

2014-01-01

Full Text Available In the broadest sense, yield curve indicates the market's view of the evolution of interest rates over time. However, given that cost of borrowing it closely linked to creditworthiness (ability to repay, different yield curves will apply to different currencies, market sectors, or even individual issuers. As government borrowing is indicative of interest rate levels available to other market players in a particular country, and considering that bond issuance still remains the dominant form of sovereign debt, this paper describes yield curve construction using bonds. The relationship between zero-coupon yield, par yield and yield to maturity is given and their usage in determining curve discount factors is described. Their usage in deriving forward rates and pricing related derivative instruments is also discussed.

TOPICAL REVIEW Progress in cold roll bonding of metals

Directory of Open Access Journals (Sweden)

Long Li, Kotobu Nagai and Fuxing Yin

2008-01-01

Full Text Available Layered composite materials have become an increasingly interesting topic in industrial development. Cold roll bonding (CRB, as a solid phase method of bonding same or different metals by rolling at room temperature, has been widely used in manufacturing large layered composite sheets and foils. In this paper, we provide a brief overview of a technology using layered composite materials produced by CRB and discuss the suitability of this technology in the fabrication of layered composite materials. The effects of process parameters on bonding, mainly including process and surface preparation conditions, have been analyzed. Bonding between two sheets can be realized when deformation reduction reaches a threshold value. However, it is essential to remove surface contamination layers to produce a satisfactory bond in CRB. It has been suggested that the degreasing and then scratch brushing of surfaces create a strong bonding between the layers. Bonding mechanisms, in which the film theory is expressed as the major mechanism in CRB, as well as bonding theoretical models, have also been reviewed. It has also been showed that it is easy for fcc structure metals to bond compared with bcc and hcp structure metals. In addition, hardness on bonding same metals plays an important part in CRB. Applications of composites produced by CRB in industrial fields are briefly reviewed and possible developments of CRB in the future are also described.

Intramolecular Hydrogen Bonding in (2-Hydroxybenzoyl)benzoylmethane Enol

DEFF Research Database (Denmark)

Hansen, Bjarke Knud Vilster; Winther, Morten; Spanget-Larsen, Jens

2014-01-01

, and the dienol form of 1,3-dibenzoylacetone. But in these examples the two H-bonds are equivalent, while in the case of OHDBM they are chemically different, involving one enolic and one phenolic hydroxy group. OHDBM is thus an interesting model compound with two competing H-bonds to the same carbonyl group......In the stable enol tautomer of the title compound (OHDBM), one carbonyl group is flanked by two β-hydroxy groups, giving rise to bifold intramolecular H-bonding. A similar situation is found in other β,β'-dihydroxy carbonyl compounds like chrysazin, anthralin, 2,2'-dihydroxybenzophenone...

PMMA to Polystyrene bonding for polymer based microfluidic systems

KAUST Repository

Fan, Yiqiang

2013-03-29

A thermal bonding technique for Poly (methylmethacrylate) (PMMA) to Polystyrene (PS) is presented in this paper. The PMMA to PS bonding was achieved using a thermocompression method, and the bonding strength was carefully characterized. The bonding temperature ranged from 110 to 125 C with a varying compression force, from 700 to 1,000 N (0.36-0.51 MPa). After the bonding process, two kinds of adhesion quantification methods were used to measure the bonding strength: the double cantilever beam method and the tensile stress method. The results show that the bonding strength increases with a rising bonding temperature and bonding force. The results also indicate that the bonding strength is independent of bonding time. A deep-UV surface treatment method was also provided in this paper to lower the bonding temperature and compression force. Finally, a PMMA to PS bonded microfluidic device was fabricated successfully. © 2013 Springer-Verlag Berlin Heidelberg.

Interactions between motion and form processing in the human visual system

OpenAIRE

Mather, G.; Pavan, A.; Bellacosa Marotti, R.; Campana, G.; Casco, C.

2013-01-01

The predominant view of motion and form processing in the human visual system assumes that these two attributes are handled by separate and independent modules. Motion processing involves filtering by direction-selective sensors, followed by integration to solve the aperture problem. Form processing involves filtering by orientation-selective and size-selective receptive fields, followed by integration to encode object shape. It has long been known that motion signals can influence form proce...

Comparison of shear bond strength of the stainless steel metallic brackets bonded by three bonding systems

Directory of Open Access Journals (Sweden)

Mehdi Ravadgar

2013-09-01

Full Text Available Introduction: In orthodontic treatment, it is essential to establish a satisfactory bond between enamel and bracket. After the self-etch primers (SEPs were introduced for the facilitation of bracket bonding in comparison to the conventional etch-and-bond system, multiple studies have been carried out on their shear bond strengths which have yielded different results. This study was aimed at comparing shear bond strengths of the stainless steel metallic brackets bonded by three bonding systems. Methods: In this experimental in vitro study, 60 extracted human maxillary premolar teeth were randomly divided into three equal groups: in the first group, Transbond XT (TBXT light cured composite was bonded with Transbond plus self-etching primer (TPSEP in the second group, TBXT composite was bonded with the conventional method of acid etching and in the third group, the self cured composite Unite TM bonding adhesive was bonded with the conventional method of acid etching. In all the groups, Standard edgewise-022 metallic brackets (American Orthodontics, Sheboygan, USA were used. Twenty-four hours after the completion of thermocycling, shear bond strength of brackets was measured by Universal Testing Machine (Zwick. In order to compare the shear bond strengths of the groups, the variance analysis test (ANOVA was adopted and p≤0.05 was considered as a significant level. Results: Based on megapascal, the average shear bond strength for the first, second, and third groups was 8.27±1.9, 9.78±2, and 8.92±2.5, respectively. There was no significant difference in the shear bond strength of the groups. Conclusions: Since TPSEP shear bond strength is approximately at the level of the conventional method of acid etching and within the desirable range for orthodontic brackets shear bond strength, applying TPSEP can serve as a substitute for the conventional method of etch and bond, particularly in orthodontic operations.

Comparison of shear bond strength of the stainless steel metallic brackets bonded by three bonding systems

Directory of Open Access Journals (Sweden)

Mehdi Ravadgar

2013-09-01

Full Text Available Introduction: In orthodontic treatment, it is essential to establish a satisfactory bond between enamel and bracket. After the self-etch primers (SEPs were introduced for the facilitation of bracket bonding in comparison to the conventional etch-and-bond system, multiple studies have been carried out on their shear bond strengths which have yielded different results. This study was aimed at comparing shear bond strengths of the stainless steel metallic brackets bonded by three bonding systems. Methods: In this experimental in vitro study, 60 extracted human maxillary premolar teeth were randomly divided into three equal groups: in the first group, Transbond XT (TBXT light cured composite was bonded with Transbond plus self-etching primer (TPSEP; in the second group, TBXT composite was bonded with the conventional method of acid etching; and in the third group, the self cured composite Unite TM bonding adhesive was bonded with the conventional method of acid etching. In all the groups, Standard edgewise-022 metallic brackets (American Orthodontics, Sheboygan, USA were used. Twenty-four hours after the completion of thermocycling, shear bond strength of brackets was measured by Universal Testing Machine (Zwick. In order to compare the shear bond strengths of the groups, the variance analysis test (ANOVA was adopted and p≤0.05 was considered as a significant level. Results: Based on megapascal, the average shear bond strength for the first, second, and third groups was 8.27±1.9, 9.78±2, and 8.92±2.5, respectively. There was no significant difference in the shear bond strength of the groups. Conclusions: Since TPSEP shear bond strength is approximately at the level of the conventional method of acid etching and within the desirable range for orthodontic brackets shear bond strength, applying TPSEP can serve as a substitute for the conventional method of etch and bond, particularly in orthodontic operations.

QuikForm: Intelligent deformation processing of structural alloys

Energy Technology Data Exchange (ETDEWEB)

Bourcier, R.J.; Wellman, G.W.

1994-09-01

There currently exists a critical need for tools to enhance the industrial competitiveness and agility of US industries involved in deformation processing of structural alloys. In response to this need, Sandia National Laboratories has embarked upon the QuikForm Initiative. The goal of this program is the development of computer-based tools to facilitate the design of deformation processing operations. The authors are currently focusing their efforts on the definition/development of a comprehensive system for the design of sheet metal stamping operations. The overall structure of the proposed QuikForm system is presented, and the focus of their thrust in each technical area is discussed.

Backbone conformation affects duplex initiation and duplex propagation in hybridisation of synthetic H-bonding oligomers.

Science.gov (United States)

Iadevaia, Giulia; Núñez-Villanueva, Diego; Stross, Alexander E; Hunter, Christopher A

2018-06-06

Synthetic oligomers equipped with complementary H-bond donor and acceptor side chains form multiply H-bonded duplexes in organic solvents. Comparison of the duplex forming properties of four families of oligomers with different backbones shows that formation of an extended duplex with three or four inter-strand H-bonds is more challenging than formation of complexes that make only two H-bonds. The stabilities of 1 : 1 complexes formed between length complementary homo-oligomers equipped with either phosphine oxide or phenol recognition modules were measured in toluene. When the backbone is very flexible (pentane-1,5-diyl thioether), the stability increases uniformly by an order of magnitude for each additional base-pair added to the duplex: the effective molarities for formation of the first intramolecular H-bond (duplex initiation) and subsequent intramolecular H-bonds (duplex propagation) are similar. This flexible system is compared with three more rigid backbones that are isomeric combinations of an aromatic ring and methylene groups. One of the rigid systems behaves in exactly the same way as the flexible backbone, but the other two do not. For these systems, the effective molarity for formation of the first intramolecular H-bond is the same as that found for the other two backbones, but additional H-bonds are not formed between the longer oligomers. The effective molarities are too low for duplex propagation in these systems, because the oligomer backbones cannot adopt conformations compatible with formation of an extended duplex.

Integration of adaptive process control with computational simulation for spin-forming

International Nuclear Information System (INIS)

Raboin, P. J. LLNL

1998-01-01

Improvements in spin-forming capabilities through upgrades to a metrology and machine control system and advances in numerical simulation techniques were studied in a two year project funded by Laboratory Directed Research and Development (LDRD) at Lawrence Livermore National Laboratory. Numerical analyses were benchmarked with spin-forming experiments and computational speeds increased sufficiently to now permit actual part forming simulations. Extensive modeling activities examined the simulation speeds and capabilities of several metal forming computer codes for modeling flat plate and cylindrical spin-forming geometries. Shape memory research created the first numerical model to describe this highly unusual deformation behavior in Uranium alloys. A spin-forming metrology assessment led to sensor and data acquisition improvements that will facilitate future process accuracy enhancements, such as a metrology frame. Finally, software improvements (SmartCAM) to the manufacturing process numerically integrate the part models to the spin-forming process and to computational simulations

The Impact of Premature Childbirth on Parental Bonding

Directory of Open Access Journals (Sweden)

Hannah N. Hoffenkamp

2012-07-01

Full Text Available The development of an affectionate parent-infant bond is essential for a newborn infant's survival and development. However, from evolutionary theory it can be derived that parental bonding is not an automatic process, but dependent on infants' cues to reproductive potential and parents' access to resources. The purpose of the present study was to examine the process of bonding in a sample of Dutch mothers (n = 200 and fathers (n = 193 of full-term (n = 69, moderately premature (n = 68, and very premature infants (n = 63. During the first month postpartum parents completed the Pictorial Representation of Attachment Measure (PRAM and Postpartum Bonding Questionnaire (PBQ. Longitudinal analyses revealed that mothers' PRAM scores decreased after moderately preterm delivery, whereas decreases in PRAM scores occurred in both parents after very preterm delivery. As lower PRAM scores represent stronger feelings of parent-infant connectedness, our findings suggest a higher degree of bonding after premature childbirth. Results of the PBQ analysis were in line with PRAM outcomes, as parents of preterm infants reported less bonding problems compared to parents of full-terms. These findings support the hypothesis that in affluent countries with adequate resources, bonding in parents of preterm infants on average may be higher than in parents of full-term infants.

Romanian government bond market

Directory of Open Access Journals (Sweden)

Cornelia POP

2012-12-01

Full Text Available The present paper aims to present the level of development reached by Romanian government bond market segment, as part of the country financial market. The analysis will be descriptive (the data series available for Romania are short, based on the secondary data offered by the official bodies involved in the process of issuing and trading the Romanian government bonds (Romanian Ministry of Public Finance, Romanian National Bank and Bucharest Stock Exchange, and also on secondary data provided by the Federation of European Stock Exchanges.To enhance the market credibility as a benchmark, a various combination of measures is necessary; among these measures are mentioned: the extension of the yield curve; the issuance calendars in order to improve transparency; increasing the disclosure of information on public debt issuance and statistics; holding regular meetings with dealers, institutional investors and rating agencies; introducing a system of primary dealers; establishing a repurchase (repo market in the government bond market. These measures will be discussed based on the evolution presented inside the paper.The paper conclude with the fact that, until now, the Romanian government bond market did not provide a benchmark for the domestic financial market and that further efforts are needed in order to increase the government bond market transparency and liquidity.

Fast Rotational Diffusion of Water Molecules in a 2D Hydrogen Bond Network at Cryogenic Temperatures

Science.gov (United States)

Prisk, T. R.; Hoffmann, C.; Kolesnikov, A. I.; Mamontov, E.; Podlesnyak, A. A.; Wang, X.; Kent, P. R. C.; Anovitz, L. M.

2018-05-01

Individual water molecules or small clusters of water molecules contained within microporous minerals present an extreme case of confinement where the local structure of hydrogen bond networks are dramatically altered from bulk water. In the zinc silicate hemimorphite, the water molecules form a two-dimensional hydrogen bond network with hydroxyl groups in the crystal framework. Here, we present a combined experimental and theoretical study of the structure and dynamics of water molecules within this network. The water molecules undergo a continuous phase transition in their orientational configuration analogous to a two-dimensional Ising model. The incoherent dynamic structure factor reveals two thermally activated relaxation processes, one on a subpicosecond timescale and another on a 10-100 ps timescale, between 70 and 130 K. The slow process is an in-plane reorientation of the water molecule involving the breaking of hydrogen bonds with a framework that, despite the low temperatures involved, is analogous to rotational diffusion of water molecules in the bulk liquid. The fast process is a localized motion of the water molecule with no apparent analogs among known bulk or confined phases of water.

Investigation of the deformation stability in the incremental sheet forming process

Directory of Open Access Journals (Sweden)

Ai S.

2015-01-01

Full Text Available Incremental sheet forming (ISF is a highly versatile and flexible process for rapid manufacturing of complex sheet metal parts. One of the unique characters of the ISF process is the improved formability comparing to conventional sheet forming process. This may be due to the localized deformation nature, which increases the deformation stability in the ISF process. Although many hypotheses have been proposed, there is no direct modelling and calculation of the ISF deformation stability. Aiming to obtain a better understanding of the ISF process, an analytical model was developed to investigate and analyse the material deformation stability in this work. Based on the analytical evaluation of stress variations and force equilibrium, a mathematical relationship between the maximum forming angle and the process stability condition was established. To validate the developed model, experiments were carried out by forming a hyperbolic part made of AA1100 material. The maximum forming angle, as an indicator to the ISF formability, was employed compare the analytical evaluation and experimental result. It was found that the ISF deformation stability is one of the key factors that affect the ISF formability.

75 FR 5855 - Proposed Collection; Comment Request for Form 8038-TC

Science.gov (United States)

2010-02-04

... 8038-TC AGENCY: Internal Revenue Service (IRS), Treasury. ACTION: Notice and request for comments... comments concerning Form 8038-TC, Information Return for Tax Credit Bonds. DATES: Written comments should...: Form 8038-TC. Abstract: Form 8038-TC will be used by issuers of qualified tax- exempt credit bonds...

Transport of chemically bonded nuclear energy in a closed cycle with special consideration to energy disconnection

International Nuclear Information System (INIS)

Ossami, S.

1976-01-01

The article describes the utilisation of nuclear energy in the form of 'nuclear long-distance energy'. Heat produced by nuclear fission is bonded to a reversible chemical reaction (cracking gas) which release the heat again at the place of comsumption by catalytic transformation. The article deals in particular with the process of methane cracking/methanisation, the disconnection of the energy (heat) by the methanisation process and the decisive role of the methanisation catalyzers. (orig.) [de

Computational study of the signature of hydrogen-bond strength on the infrared spectra of a hydrogen-bonded complex dissolved in a polar liquid

International Nuclear Information System (INIS)

Hanna, Gabriel; Geva, Eitan

2010-01-01

The signature of hydrogen-bond strength on the one- and two-dimensional infrared spectra of the hydrogen-stretch in a hydrogen-bonded complex dissolved in a polar liquid was investigated via mixed quantum-classical molecular dynamics simulations. Non-Condon effects were found to intensify with increasing hydrogen-bond strength and to shift oscillator strength from the stable configurations that correspond to the ionic and covalent tautomers into unstable configurations that correspond to the transition-state between them. The transition-state peak is observed to blue shift and increase in intensity with increasing hydrogen-bond strength, and to dominate the spectra in the case of a strong hydrogen-bond. It is argued that the application of multidimensional infrared spectroscopy in the region of the transition-state peak can provide a uniquely direct probe of the molecular events underlying breaking and forming of hydrogen-bonds in the condensed phase.

Evidence for a Proton Transfer Network and a Required Persulfide-Bond-Forming Cysteine Residue in Ni-Containing Carbon Monoxide Dehydrogenases

International Nuclear Information System (INIS)

Eun Jin Kim; Jian Feng; Bramlett, Matthew R.; Lindahl, Paul A.

2004-01-01

OAK-B135 Carbon monoxide dehydrogenase from Moorella thermoacetica catalyzes the reversible oxidation of CO to CO2 at a nickel-iron-sulfur active-site called the C-cluster. Mutants of a proposed proton transfer pathway and of a cysteine residue recently found to form a persulfide bond with the C-cluster were characterized. Four semi-conserved histidine residues were individually mutated to alanine. His116 and His122 were essential to catalysis, while His113 and His119 attenuated catalysis but were not essential. Significant activity was ''rescued'' by a double mutant where His116 was replaced by Ala and His was also introduced at position 115. Activity was also rescued in double mutants where His122 was replaced by Ala and His was simultaneously introduced at either position 121 or 123. Activity was also ''rescued'' by replacing His with Cys at position 116. Mutation of conserved Lys587 near the C-cluster attenuated activity but did not eliminate it. Activity was virtually abolished in a double mutant where Lys587 and His113 were both changed to Ala. Mutations of conserved Asn284 also attenuated activity. These effects suggest the presence of a network of amino acid residues responsible for proton transfer rather than a single linear pathway. The Ser mutant of the persulfide-forming Cys316 was essentially inactive and displayed no EPR signals originating from the C-cluster. Electronic absorption and metal analysis suggests that the C-cluster is absent in this mutant. The persulfide bond appears to be essential for either the assembly or stability of the C-cluster, and/or for eliciting the redox chemistry of the C-cluster required for catalytic activity

An investigation on diffusion bonding of aluminum to copper using equal channel angular extrusion process

OpenAIRE

Eslami, P.; Taheri, A. Karimi

2011-01-01

A new method for production of bimetallic rods, utilizing the equal channel angular extrusion (ECAE) process has been introduced before by previous researchers, but no attempt has been made to assess the effect of different temperatures and holding times in order to achieve a diffusional bond between the mating surfaces. In present research copper sheathed aluminum rods have been ECAEed at room temperature and subsequently held at a constant ECAE pressure, at different temperatures and holdin...

Bond portfolio's duration and investment term-structure management problem

OpenAIRE

Liu, Daobai

2006-01-01

In the considered bond market, there are N zero-coupon bonds transacted continuously, which will mature at equally spaced dates. A duration of bond portfolios under stochastic interest rate model is introduced, which provides a measurement for the interest rate risk. Then we consider an optimal bond investment term-structure management problem using this duration as a performance index, and with the short-term interest rate process satisfying some stochastic differential ...

The adsorption of acrolein on a Pt (1 1 1): A study of chemical bonding and electronic structure

Science.gov (United States)

Pirillo, S.; López-Corral, I.; Germán, E.; Juan, A.

2012-12-01

The adsorption of acrolein on a Pt (1 1 1) surface was studied using ab-initio and semiempirical calculations. Geometry optimization and densities of states (DOS) curves were carried out using the Vienna Ab-initio Simulation Package (VASP) code. We started our study with the preferential geometries corresponding to the different acrolein/Pt (1 1 1) adsorption modes previously reported. Then, we examined the evolution of the chemical bonding in these geometries, using the crystal orbital overlap population (COOP) and overlap population (OP) analysis of selected pairs of atoms. We analyzed the acrolein intramolecular bonds, Pt (1 1 1) superficial bonds and new moleculesbnd surface formed bonds after adsorption. We found that Ptsbnd Pt bonds interacting with the molecule and acrolein Cdbnd O and Cdbnd C bonds are weakened after adsorption; this last bond is significantly linked to the surface. The obtained Csbnd Pt and Osbnd Pt OP values suggest that the most stable adsorption modes are η3-cis and η4-trans, while the η1-trans is the less favored configuration. We also found that C pz orbital and Pt pz and d orbitals participate strongly in the adsorption process.

The social life of bonding theory.

Science.gov (United States)

Crouch, M; Manderson, L

1995-09-01

'Bonding' as a crucial factor of the early post-partum entered obstetric and paediatric practice after the publication of Maternal and Infant Bonding in 1976 by Klaus and Kennell. The concept has held its place since, as witnessed by medical textbook accounts of it, and the perception of 'instantaneous bonding' as a vital component of the ideal birth experience has dominated media representations of childbirth and, until very recently, feminist writing. Only during the last few years has this literature taken into account research findings concerning the guilt and anxiety experienced by women whose expectations regarding 'bonding' are not realised. While it is now generally acknowledged that maternal attachment develops over an extended period of time, 'bonding' as used extensively in both popular and scientific literature conflates a wide range of meanings and blurs the boundaries between process and outcome. This facilitates the entry of ideological elements into a field which is, by its very nature, deeply significant for human experience. We therefore argue for a continuing critical appraisal of the role of 'bonding' in both general and scientific research.

Bonding characteristics in NiAl intermetallics with O impurity: a first-principles computational tensile test

International Nuclear Information System (INIS)

Hu Xuelan; Zhang Ying; Lu Guanghong; Wang Tianmin

2009-01-01

We have performed a first-principles computational tensile test on NiAl intermetallics with O impurity along the [001] crystalline direction on the (110) plane to investigate the tensile strength and the bonding characteristics of the NiAl-O system. We show that the ideal tensile strength is largely reduced due to the presence of O impurity in comparison with pure NiAl. The investigations of the atomic configuration and bond-length evolution show that O prefers to bond with Al, forming an O-Al cluster finally with the break of O-Ni bonds. The O-Ni bonds are demonstrated to be weaker than the O-Al bonds, and the reduced tensile strength originates from such weaker O-Ni bonds. A void-like structure forms after the break of the O-Ni and some Ni-Al bonds. Such a void-like structure can act as the initial nucleation or the propagation path of the crack, and thus produce large effects on the mechanical properties of NiAl.

Chip bonding of low-melting eutectic alloys by transmitted laser radiation

Science.gov (United States)

Hoff, Christian; Venkatesh, Arjun; Schneider, Friedrich; Hermsdorf, Jörg; Bengsch, Sebastian; Wurz, Marc C.; Kaierle, Stefan; Overmeyer, Ludger

2017-06-01

Present-day thermode bond systems for the assembly of radio-frequency identification (RFID) chips are mechanically inflexible, difficult to control, and will not meet future manufacturing challenges sufficiently. Chip bonding, one of the key processes in the production of integrated circuits (ICs), has a high potential for optimization with respect to process duration and process flexibility. For this purpose, the technologies used, so far, are supposed to be replaced by a transmission laser-bonding process using low-melting eutectic alloys. In this study, successful bonding investigations of mock silicon chips and of RFID chips on flexible polymer substrates are presented using the low-melting eutectic alloy, 52In48Sn, and a laser with a wavelength of 2 μm.

Microstructure and bonding mechanism of Al/Ti bonded joint using Al-10Si-1Mg filler metal

International Nuclear Information System (INIS)

Sohn, Woong H.; Bong, Ha H.; Hong, Soon H.

2003-01-01

The microstructures and liquid state diffusion bonding mechanism of cp-Ti to 1050 Al using an Al-10.0wt.%Si-1.0wt.%Mg filler metal with 100 μm in thickness have been investigated at 620 deg. C under 1x10 -4 Torr. The effects of bonding process parameters on microstructure of bonded joint have been analyzed by using an optical microscope, AES, scanning electron microscopy and EDS. The interfacial bond strength of Al/Ti bonded joints was measured by the single lap shear test. The results show that the bonding at the interface between Al and filler metal proceeds by wetting the Al with molten filler metal, and followed by removal of oxide layer on surface of Al. The interface between Al and filler metal moved during the isothermal solidification of filler metal by the diffusion of Si from filler metal into Al layer. The interface between Al and filler metal became curved in shape with increasing bonding time due to capillary force at grain boundaries. The bonding at the interface between Ti and filler metal proceeds by the formation of two different intermetallic compound layers, identified as Al 5 Si 12 Ti 7 and Al 12 Si 3 Ti 5 , followed by the growth of the intermetallic compound layers. The interfacial bond strength at Al/Ti joint increased with increasing bonding time up to 25 min at 620 deg. C. However, the interfacial bond strength of Al/Ti joint decreased after bonding time of 25 min at 620 deg. C due to formation of cavities in Al near Al/intermetallic interfaces

Subtle differences in the hydrogen bonding of alcohol to divalent oxygen and sulfur

DEFF Research Database (Denmark)

Du, Lin; Tang, Shanshan; Hansen, Anne Schou

2017-01-01

complexes are more stable and form stronger hydrogen bonds compared to complexes with MeOH and EtOH, which are comparable, and only for the stronger hydrogen bond donor (TFE) are the small differences in acceptor molecules highlighted. The equilibrium constant for complex formation was determined from......The Osingle bondH⋯O and Osingle bondH⋯S hydrogen bonds were investigated by gas phase FTIR spectroscopy of alcohol–dimethylether and alcohol–dimethylsulfide complexes, with alcohols of increasing hydrogen bond donor strength; methanol (MeOH), ethanol (EtOH) and 2,2,2-trifluoroethanol (TFE). The TFE...

Persistent local chemical bonds in intermetallic phase formation

Energy Technology Data Exchange (ETDEWEB)

Bai, Yanwen [Key Laboratory for Liquid–Solid Structural Evolution and Processing of Materials, Ministry of Education, Shandong University, Jinan 250061 (China); Bian, Xiufang, E-mail: xfbian@sdu.edu.cn [Key Laboratory for Liquid–Solid Structural Evolution and Processing of Materials, Ministry of Education, Shandong University, Jinan 250061 (China); Qin, Xubo [Key Laboratory for Liquid–Solid Structural Evolution and Processing of Materials, Ministry of Education, Shandong University, Jinan 250061 (China); Zhang, Shuo; Huang, Yuying [Shanghai Synchrotron Radiation Facilities, Shanghai Institute of Applied Physics, Chinese Academy of Sciences, Shanghai 201204 (China)

2014-05-01

We found a direct evidence for the existence of the local chemical Bi–In bonds in the BiIn{sub 2} melt. These bonds are strong and prevail, dominating the structure evolution of the intermetallic clusters. From the local structure of the melt-quenched BiIn{sub 2} ribbon, the chemical Bi–In bonds strengthen compared with those in the equilibrium solidified alloy. The chemical bonds in BiIn{sub 2} melt retain to solid during a rapid quenching process. The results suggest that the intermetallic clusters in the melt evolve into the as-quenched intermetallic phase, and the intermetallic phase originates from the chemical bonds between unlike atoms in the melt. The chemical bonds preserve the chemical ordered clusters and dominate the clusters evolution.

Dangling bonds and crystalline inclusions in amorphous materials

Energy Technology Data Exchange (ETDEWEB)

Ferrari, L [Ferrara Univ. (Italy). Ist. di Matematica; Russo, G [Bologna Univ. (Italy). Ist. di Fisica

1981-02-07

It is suggested that on the surface of crystalline inclusions dangling bond formation is favoured due to unbalanced local stresses. The energy for bond tearings is probably originated from the exothermic process leading to the crystalline inclusion configuration which is more stable than the original amorphous one. A thermodynamical calculation is performed giving the ratio nsub(k) of crystalline inclusions having k dangling bonds on their surface.

Theoretical estimation of pnicogen bonds and hydrogen bonds in small heterocyclic complexes: Red-shifts and blue-shifts ruled by polarization effects

International Nuclear Information System (INIS)

Oliveira, Boaz G.

2014-01-01

Graphical abstract: - Highlights: • This paper definitively discusses the interaction strength. • Analyses of the red-shifts and blue-shift. • Stretch frequencies of the hydrogen bonds and pnicogen bonds in heterocyclic compounds. • Theoretical calculations derived from topological parameters of the Quantum Theory of Atoms in Molecules (QTAIM). • The analysis of the Natural Bond Orbital (NBO) in line with the Bent’s rule of the chemical bonding. - Abstract: The occurrence of pnicogen bonds (N⋯P) and hydrogen bonds (F⋯H or Cl⋯H) in heterocyclic complexes formed by C 2 H 5 N⋯PH 3 , C 2 H 5 N⋯PH 2 F and C 2 H 5 N⋯PH 2 Cl was investigated at the B3LYP/6-311++G(d,p) level of theory. Analysis of the infrared spectra revealed the appearance of both red and blue shifts for the P–H bonds. However, in the case of the P–F and P–Cl bonds only red shifts were observed. The phenomenology of these vibration modes was interpreted on the basis of the QTAIM atomic radii as well as the contributions of the s and p orbitals determined via NBO calculations. The results of this latter investigation are consistent with the rehybridization theory and the Bent rule for chemical bonding. The charge transfer between N and P was determined in order to verify whether these atoms present an acid or base profile upon the formation of the pnicogen bonds

27 CFR 24.107 - Designation as a bonded winery.

Science.gov (United States)

2010-04-01

... winery. 24.107 Section 24.107 Alcohol, Tobacco Products and Firearms ALCOHOL AND TOBACCO TAX AND TRADE... Designation as a bonded winery. Bonded wine premises which will be used for the production of wine or for production processes involving the use of wine will be designated a bonded winery unless the proprietor...

Development and analysis of diffusion bonding techniques for LBE-cooled spallation targets

Energy Technology Data Exchange (ETDEWEB)

Nelson, A.T., E-mail: atnelson@lanl.gov [Los Alamos National Laboratory, Los Alamos, NM 87545 (United States); Hosemann, P. [University of California - Berkeley, Berkeley, CA 94720 (United States); Maloy, S.A. [Los Alamos National Laboratory, Los Alamos, NM 87545 (United States)

2012-12-15

Spallation sources incorporating solid targets may be driven to utilize liquid metal coolants by neutronics or temperature concerns. If tungsten is chosen as the target material, it will require cladding given its poor performance under irradiation. One option to meet this need are ferritic/martensitic stainless steel alloys. This study investigates possible diffusion bonding techniques suitable to clad tungsten targets with HT9, a high chromium stainless steel familiar to the nuclear industry. A test bonding matrix was performed to identify bonding conditions and process parameters suitable for the three material systems of interest (HT9/Ta, HT9/W, and HT9/HT9). Temperatures of 900 and 1060 Degree-Sign C were investigated along with bonding pressures of 7 and 70 MPa. A nominal soak time of 3 h was used for all tests. Three interlayers were investigated: pure nickel, Ni-6P, and vanadium. Finally, different surface preparation techniques for the tungsten were explored in order to gage their effect on the bond quality. Following joining, the bonds were characterized using an array of microscopy and micromechanical techniques to determine the resulting interface character. The nickel and NiP coatings were found to stabilize austenite at the HT9 surface during bonding, while the vanadium remained generally inert given good solubility in each of the three systems. Intermetallic formation is also a significant concern at elevated bonding temperatures as FeTa, FeW, NiTa, and NiW each rapidly form during interdiffusion. Multiple failures were observed through crack propagation parallel to the interface along the intermetallic phases. Differing contraction rates among the base materials also resulted in brittle fracture within the tungsten during cooling from bonding temperatures. Bonding performed at 900 Degree-Sign C under 70 MPa for 3 h with the inclusion of a vanadium interlayer was found to be superior of the conditions explored in this work.

Book-entry bonds as a variety of the debt securities

Directory of Open Access Journals (Sweden)

М. М. Кулик

2015-10-01

Full Text Available Problem Setting. The article is devoted to the allocation of the features of the legal order and legal nature of the book-entry bonds as a variety of the debt securities. Analysis of the recent researches and publications. The book-entry securities and their place among other objects of the civil legal relations from the moment of their appearance on the securities market have been devoted many scientific works and publications both Ukrainian scientists and scientists of other countries, in particular, E. Dyomushkina, L. Dobrynina, V. A. Barulin, D. Stepanov, E. Reshetin, V. L. Yarotsky, G. N. Shevchenko, O. V. Vygovsky, S. Ya. Vavzhenchuk and others. Paper objective. With regard of definitions of the bond as the debt security of the documentary form of issue which has been proposed by the scientists specialized on civil law problems  at different times of the development of the teaching on securities and specific features of the book–entry securities as certain rights, it is necessary to allocate  peculiarities of   the legal order and legal nature of the book-entry bonds as a variety of the debt securities. Paper main body. In the article the different approaches to the definition of the bond have been given. It is specified that the documentary bond as the debt security mediates or establishes   relations of   the loan between the issuer of the bond and its owner and  obligates the issuer to return a certain cash equivalent within a specified period and to pay a certain percentage (profit. On the base of the comparative analysis of the documentary and book-entry securities the content of which includes the certain rights, the features of the book-entry bond as the debt security have been allocated: 1 the content of the right, embodied in the decision on the issue of the securities and in the securities emission prospectus, includes property ( obligation right of the requirement by its owner to return their nominal value and the

Au–Sn bonding material for the assembly of power integrated circuit module

Energy Technology Data Exchange (ETDEWEB)

Zhu, Z.X.; Li, C.C. [Department of Materials Science & Engineering, National Taiwan University, Taipei, Taiwan (China); Liao, L.L.; Liu, C.K. [Electronic and Optoelectronics Research Laboratories, Industrial Technology Research Institute, Hsinchu, Taiwan (China); Kao, C.R., E-mail: crkao@ntu.edu.tw [Department of Materials Science & Engineering, National Taiwan University, Taipei, Taiwan (China)

2016-06-25

Insulated gate bipolar transistor (IGBT) chips are the key components in high-temperature power electronic modules, which have to efficiently convert electricity between direct and alternating current. In this study, the eutectic Au–Sn (20 wt.% Sn) is successfully used to assemble IGBT chips and direct-bond-copper substrates by using solid liquid interdiffusion (SLID) bonding. During subsequent isothermal aging at 150, 200, and 240 °C, the microstructure evolution and growth kinetics of intermetallic compounds are investigated. Excellent thermal stability and mechanical strength are observed. It is concluded that the eutectic Au–Sn solder is ideal to assemble high-temperature IGBT by using the SLID process. - Highlights: • Au–20Sn serves as a promising bonding material for IGBT operating at T < 519 °C. • The Au–20Sn reacted with Ni to form (Ni,Au){sub 3}Sn{sub 2}/(Au{sub 5}Sn + AuSn)/(Ni,Au){sub 3}Sn{sub 2}. • Once the AuSn was nearly exhausted, the whole joint could withstand higher temperatures. • A cost-effective way for long-term operations at high temperature.

The role of uranium-arene bonding in H2O reduction catalysis

Science.gov (United States)

Halter, Dominik P.; Heinemann, Frank W.; Maron, Laurent; Meyer, Karsten

2018-03-01

The reactivity of uranium compounds towards small molecules typically occurs through stoichiometric rather than catalytic processes. Examples of uranium catalysts reacting with water are particularly scarce, because stable uranyl groups form that preclude the recovery of the uranium compound. Recently, however, an arene-anchored, electron-rich uranium complex has been shown to facilitate the electrocatalytic formation of H2 from H2O. Here, we present the precise role of uranium-arene δ bonding in intermediates of the catalytic cycle, as well as details of the atypical two-electron oxidative addition of H2O to the trivalent uranium catalyst. Both aspects were explored by synthesizing mid- and high-valent uranium-oxo intermediates and by performing comparative studies with a structurally related complex that cannot engage in δ bonding. The redox activity of the arene anchor and a covalent δ-bonding interaction with the uranium ion during H2 formation were supported by density functional theory analysis. Detailed insight into this catalytic system may inspire the design of ligands for new uranium catalysts.

Halogen Bonding Involving CO and CS with Carbon as the Electron Donor

Directory of Open Access Journals (Sweden)

Janet E. Del Bene

2017-11-01

Full Text Available MP2/aug’-cc-pVTZ calculations have been carried out to investigate the halogen-bonded complexes formed when CO and CS act as electron-pair donors through C to ClF, ClNC, ClCl, ClOH, ClCN, ClCCH, and ClNH2. CO forms only complexes stabilized by traditional halogen bonds, and all ClY molecules form traditional halogen-bonded complexes with SC, except ClF which forms only an ion-pair complex. Ion-pair complexes are also found on the SC:ClNC and SC:ClCl surfaces. SC:ClY complexes stabilized by traditional halogen bonds have greater binding energies than the corresponding OC:ClY complexes. The largest binding energies are found for the ion-pair SC–Cl+:−Y complexes. The transition structures which connect the complex and the ion pair on SC:ClNC and SC:ClCl potential surfaces provide the barriers for inter-converting these structures. Charge-transfer from the lone pair on C to the σ-hole on Cl is the primary charge-transfer interaction stabilizing OC:ClY and SC:ClY complexes with traditional halogen bonds. A secondary charge-transfer occurs from the lone pairs on Cl to the in-plane and out-of-plane π antibonding orbitals of ClY. This secondary interaction assumes increased importance in the SC:ClNH2 complex, and is a factor leading to its unusual structure. C–O and C–S stretching frequencies and 13C chemical shieldings increase upon complex formation with ClY molecules. These two spectroscopic properties clearly differentiate between SC:ClY complexes and SC–Cl+:−Y ion pairs. Spin–spin coupling constants 1xJ(C–Cl for OC:ClY complexes increase with decreasing distance. As a function of the C–Cl distance, 1xJ(C–Cl and 1J(C–Cl provide a fingerprint of the evolution of the halogen bond from a traditional halogen bond in the complexes, to a chlorine-shared halogen bond in the transition structures, to a covalent bond in the ion pairs.

GaN microring waveguide resonators bonded to silicon substrate by a two-step polymer process.

Science.gov (United States)

Hashida, Ryohei; Sasaki, Takashi; Hane, Kazuhiro

2018-03-20

Using a polymer bonding technique, GaN microring waveguide resonators were fabricated on a Si substrate for future hybrid integration of GaN and Si photonic devices. The designed GaN microring consisted of a rib waveguide having a core of 510 nm in thickness, 1000 nm in width, and a clad of 240 nm in thickness. A GaN crystalline layer of 1000 nm in thickness was grown on a Si(111) substrate by metal organic chemical vapor deposition using a buffer layer of 300 nm in thickness for the compensation of lattice constant mismatch between GaN and Si crystals. The GaN/Si wafer was bonded to a Si(100) wafer by a two-step polymer process to prevent it from trapping air bubbles. The bonded GaN layer was thinned from the backside by a fast atom beam etching to remove the buffer layer and to generate the rib waveguides. The transmission characteristics of the GaN microring waveguide resonators were measured. The losses of the straight waveguides were measured to be 4.0±1.7  dB/mm around a wavelength of 1.55 μm. The microring radii ranged from 30 to 60 μm, where the measured free-spectral ranges varied from 2.58 to 5.30 nm. The quality factors of the microring waveguide resonators were from 1710 to 2820.

Short hydrogen bonds in the catalytic mechanism of serine proteases

Directory of Open Access Journals (Sweden)

VLADIMIR LESKOVAC

2008-04-01

Full Text Available The survey of crystallographic data from the Protein Data Bank for 37 structures of trypsin and other serine proteases at a resolution of 0.78–1.28 Å revealed the presence of hydrogen bonds in the active site of the enzymes, which are formed between the catalytic histidine and aspartate residues and are on average 2.7 Å long. This is the typical bond length for normal hydrogen bonds. The geometric properties of the hydrogen bonds in the active site indicate that the H atom is not centered between the heteroatoms of the catalytic histidine and aspartate residues in the active site. Taken together, these findings exclude the possibility that short “low-barrier” hydrogen bonds are formed in the ground state structure of the active sites examined in this work. Some time ago, it was suggested by Cleland that the “low-barrier hydrogen bond” hypothesis is operative in the catalytic mechanism of serine proteases, and requires the presence of short hydrogen bonds around 2.4 Å long in the active site, with the H atom centered between the catalytic heteroatoms. The conclusions drawn from this work do not exclude the validity of the “low-barrier hydrogen bond” hypothesis at all, but they merely do not support it in this particular case, with this particular class of enzymes.

Qualifications of Bonding Process of Temperature Sensors to Deep-Space Missions

Science.gov (United States)

Ramesham, Rajeshuni; Kitiyakara, Amarit; Redick, Richard W., III; Sunada, Eric T.

2011-01-01

A process has been examined for bonding a platinum resistance thermometer (PRT) onto potential aerospace materials such as flat aluminum surfaces and a flexible copper tube to simulate coaxial cables for flight applications. Primarily, PRTs were inserted into a silver-plated copper braid to avoid stresses on the sensor while the sensor was attached with the braid to the base material for long-duration, deep-space missions. A1-1145/graphite composite (planar substrate) and copper tube have been used in this study to assess the reliability of PRT bonding materials. A flexible copper tube was chosen to simulate the coaxial cable to attach PRTs. The substrate materials were cleaned with acetone wipes to remove oils and contaminants. Later, the surface was also cleaned with ethyl alcohol and was air-dried. The materials were gently abraded and then were cleaned again the same way as previously mentioned. Initially, shielded (silver plated copper braid) PRT (type X) test articles were fabricated and cleaned. The base antenna material was pretreated and shielded, and CV-2566 NuSil silicone was used to attach the shielded PRT to the base material. The test articles were cured at room temperature and humidity for seven days. The resistance of the PRTs was continuously monitored during the thermal cycling, and the test articles were inspected prior to, at various intermediate steps during, and at the end of the thermal cycling as well. All of the PRTs survived three times the expected mission life for the JUNO project. No adhesion problems were observed in the PRT sensor area, or under the shielded PRT. Furthermore, the PRT resistance accurately tracked the thermal cycling of the chamber.

BCB Bonding Technology of Back-Side Illuminated COMS Device

Science.gov (United States)

Wu, Y.; Jiang, G. Q.; Jia, S. X.; Shi, Y. M.

2018-03-01

Back-side illuminated CMOS(BSI) sensor is a key device in spaceborne hyperspectral imaging technology. Compared with traditional devices, the path of incident light is simplified and the spectral response is planarized by BSI sensors, which meets the requirements of quantitative hyperspectral imaging applications. Wafer bonding is the basic technology and key process of the fabrication of BSI sensors. 6 inch bonding of CMOS wafer and glass wafer was fabricated based on the low bonding temperature and high stability of BCB. The influence of different thickness of BCB on bonding strength was studied. Wafer bonding with high strength, high stability and no bubbles was fabricated by changing bonding conditions.

Hydrogen bond dynamics in bulk alcohols

International Nuclear Information System (INIS)

Shinokita, Keisuke; Cunha, Ana V.; Jansen, Thomas L. C.; Pshenichnikov, Maxim S.

2015-01-01

Hydrogen-bonded liquids play a significant role in numerous chemical and biological phenomena. In the past decade, impressive developments in multidimensional vibrational spectroscopy and combined molecular dynamics–quantum mechanical simulation have established many intriguing features of hydrogen bond dynamics in one of the fundamental solvents in nature, water. The next class of a hydrogen-bonded liquid—alcohols—has attracted much less attention. This is surprising given such important differences between water and alcohols as the imbalance between the number of hydrogen bonds, each molecule can accept (two) and donate (one) and the very presence of the hydrophobic group in alcohols. Here, we use polarization-resolved pump-probe and 2D infrared spectroscopy supported by extensive theoretical modeling to investigate hydrogen bond dynamics in methanol, ethanol, and isopropanol employing the OH stretching mode as a reporter. The sub-ps dynamics in alcohols are similar to those in water as they are determined by similar librational and hydrogen-bond stretch motions. However, lower density of hydrogen bond acceptors and donors in alcohols leads to the appearance of slow diffusion-controlled hydrogen bond exchange dynamics, which are essentially absent in water. We anticipate that the findings herein would have a potential impact on fundamental chemistry and biology as many processes in nature involve the interplay of hydrophobic and hydrophilic groups

Hydrogen bond dynamics in bulk alcohols.

Science.gov (United States)

Shinokita, Keisuke; Cunha, Ana V; Jansen, Thomas L C; Pshenichnikov, Maxim S

2015-06-07

Hydrogen-bonded liquids play a significant role in numerous chemical and biological phenomena. In the past decade, impressive developments in multidimensional vibrational spectroscopy and combined molecular dynamics-quantum mechanical simulation have established many intriguing features of hydrogen bond dynamics in one of the fundamental solvents in nature, water. The next class of a hydrogen-bonded liquid--alcohols--has attracted much less attention. This is surprising given such important differences between water and alcohols as the imbalance between the number of hydrogen bonds, each molecule can accept (two) and donate (one) and the very presence of the hydrophobic group in alcohols. Here, we use polarization-resolved pump-probe and 2D infrared spectroscopy supported by extensive theoretical modeling to investigate hydrogen bond dynamics in methanol, ethanol, and isopropanol employing the OH stretching mode as a reporter. The sub-ps dynamics in alcohols are similar to those in water as they are determined by similar librational and hydrogen-bond stretch motions. However, lower density of hydrogen bond acceptors and donors in alcohols leads to the appearance of slow diffusion-controlled hydrogen bond exchange dynamics, which are essentially absent in water. We anticipate that the findings herein would have a potential impact on fundamental chemistry and biology as many processes in nature involve the interplay of hydrophobic and hydrophilic groups.

Super-pnicogen bonding in the radical anion of the fluorophosphine dimer

Science.gov (United States)

Setiawan, Dani; Cremer, Dieter

2016-10-01

The LUMO of the pnicogen-bonded fluoro-phosphine dimer has PP bonding character. Radical anion and dianion form relatively strong pnicogen bonds with some covalent character where however the dianion turns out to be a second order transition state. The binding energy of (FPH 2)2- is 30.4 kcal/mol (CCSD(T)/aug-cc-pVTZ; CASPT2(5,8): 30.7 kcal/mol) and the bond strength order measured with the local PP bond stretching force constant increases from 0.055 for the neutral dimer to 0.187 thus revealing that the stabilization of the radical anion is to a large extend a result of one-electron six-center delocalization. Pnicogen-bonded complexes have a stabilizing electron affinity.

Lowland river systems - processes, form and function

DEFF Research Database (Denmark)

Pedersen, M. L.; Kronvang, B.; Sand-Jensen, K.

2006-01-01

Present day river valleys and rivers are not as dynamic and variable as they used to be. We will here describe the development and characteristics of rivers and their valleys and explain the background to the physical changes in river networks and channel forms from spring to the sea. We seek...... to answer two fundamental questions: How has anthropogenic disturbance of rivers changed the fundamental form and physical processes in river valleys? Can we use our understanding of fl uvial patterns to restore the dynamic nature of channelised rivers and drained fl oodplains in river valleys?...

Contingent convertible bonds as countercyclical capital measures

Directory of Open Access Journals (Sweden)

Francois Liebenberg

2017-06-01

Aim: The effectiveness of the CCB during contractions is not obvious. Contingent convertible (CoCo bonds – which are bond-like until triggered by a deterioration of a prescribed capital metric, at which point they convert into a form of equity – are explored as a supplementary countercyclical capital measure for such periods to establish whether or not they function effectively. Setting: The analysis is undertaken using global bank CoCo data, and then applied to South African banks. Methods: The Hodrick Prescott filter was applied to empirical historical data. Results: The CCB functions as a good countercyclical capital measure in times of economic expansion by absorbing losses and stabilising the capital base through equity issuance. Conclusion: The issuance of CoCo bonds – if their trigger mechanisms are designed correctly – may prove helpful to banks and the broader financial sector in times of economic contraction through the countercyclical capital properties that manifest through CoCo bonds under these economic conditions.

Fluorine-enhanced low-temperature wafer bonding of native-oxide covered Si wafers

Science.gov (United States)

Tong, Q.-Y.; Gan, Q.; Fountain, G.; Enquist, P.; Scholz, R.; Gösele, U.

2004-10-01

The bonding energy of bonded native-oxide-covered silicon wafers treated in the HNO3/H2O/HF or the HNO3/HF solution prior to room-temperature contact is significantly higher than bonded standard RCA1 cleaned wafer pairs after low-temperature annealing. The bonding energy reaches over 2000mJ/m2 after annealing at 100 °C. The very slight etching and fluorine in the chemically grown oxide are believed to be the main contributors to the enhanced bonding energy. Transmission-electron-microscopic images have shown that the chemically formed native oxide at bonding interface is embedded with many flake-like cavities. The cavities can absorb the by-products of the interfacial reactions that result in covalent bond formation at low temperatures allowing the strong bond to be retained.

Grain refinement and mechanical properties of CP-Ti processed by warm accumulative roll bonding

International Nuclear Information System (INIS)

Milner, Justin L.; Abu-Farha, Fadi; Bunget, Cristina; Kurfess, Thomas; Hammond, Vincent H.

2013-01-01

Accumulative roll bonding (ARB), a severe plastic deformation technique, was used in this study to process commercially pure titanium (CP-Ti) at 450 °C. Sheet samples were processed by seven consecutive ARB cycles, with an overall equivalent strain of 5.6. Mechanical characterization and microstructural examination were carried out on the processed material to track their changes and relationships with regard to one another. Electron microscopy, TEM in particular, revealed significant grain refinement in the material, with submicron microstructure achieved even after one cycle of warm processing. Further processing was shown to progressively fragment the highly elongated grains, ultimately producing a predominantly-equiaxed ultrafine grain structure with an average grain size of ∼100 nm. Tensile strength and microhardness of the material increased with the number of ARB cycles; the strength–grain size relationship followed the Hall–Petch equation. The overall grain refinement and strengthening levels observed here are close to those reported in the literature for ARB processing of CP-Ti at ambient temperatures. This demonstrates the ability of warm ARB can be as effective as cold ARB, while offering several advantages for industrial utilization.

Chemical origin of blue- and redshifted hydrogen bonds: intramolecular hyperconjugation and its coupling with intermolecular hyperconjugation.

Science.gov (United States)

Li, An Yong

2007-04-21

Upon formation of a H bond Y...H-XZ, intramolecular hyperconjugation n(Z)-->sigma*(X-H) of the proton donor plays a key role in red- and blueshift characters of H bonds and must be introduced in the concepts of hyperconjugation and rehybridization. Intermolecular hyperconjugation transfers electron density from Y to sigma*(X-H) and causes elongation and stretch frequency redshift of the X-H bond; intramolecular hyperconjugation couples with intermolecular hyperconjugation and can adjust electron density in sigma*(X-H); rehybridization causes contraction and stretch frequency blueshift of the X-H bond on complexation. The three factors--intra- and intermolecular hyperconjugations and rehybridization--determine commonly red- or blueshift of the formed H bond. A proton donor that has strong intramolecular hyperconjugation often forms blueshifted H bonds.

Comparison of shear bond strength between unfilled resin to dry enamel and dentin bonding to moist and dry enamel

Directory of Open Access Journals (Sweden)

Yasini E.

2005-05-01

Full Text Available Statement of Problem: The use of dentine bondings on enamel and dentin in total etch protocols has recently become popular. Unfilled resin is hydrophobic and dentin bonding is hydrophilic in nature. This chemical difference could be effective in enamel bonding process. Purpose: The aim of this study was to compare the shear bond strength of unfilled resin to dry enamel and dentin bonding to dry and moist enamel. Materials and Methods: In this experimental study, a total of 30 incisor teeth were used. The specimens were randomly assigned to three groups of 10. 37% phosphoric acid etchant was applied to the enamel surfaces in each group for 15 seconds, rinsed with water for 20 seconds and dried for 20 seconds with compressed air in groups one and two. After conditioning, group 1 received unfilled resin (Margin Bond, Colten and group 2 received dentin bonding (Single Bond, 3M and in group 3 after conditioning and rinsing with water, a layer of dentin bonding (Single Bond was applied on wet enamel. The enamel and dentin bonding were light cured for 20 seconds. A ring mold 3.5 mm in diameter and 2 mm height was placed over the specimens to receive the composite filling material (Z100, 3M. The composite was cured for 40 seconds. The specimens were thermocycled and shear bond strengths were determined using an Instron Universal Testing Machine. The findings were analyzed by ANOVA One-Way and Tukey HSD tests. Results: Shear bond strength of dentin bonding to dry enamel was significantly less than unfilled resin to dry enamel (P<0.05. There was no significant difference between the bond strength of dentin bonding to moist and dry enamel. In addition bond strength of dentin bonding to wet enamel was not significantly different from unfilled resin to dry enamel. Conclusion: Based on the findings of this study, it is suggested that enamel surface should remain slightly moist after etching before bonding with single bond but when using unfilled resin, the

Bond length contraction in Au nanocrystals formed by ion implantation into thin SiO2

International Nuclear Information System (INIS)

Kluth, P.; Johannessen, B.; Giraud, V.; Cheung, A.; Glover, C.J.; Azevedo, G. de M; Foran, G.J.; Ridgway, M.C.

2004-01-01

Au nanocrystals (NCs) fabricated by ion implantation into thin SiO 2 and annealing were investigated by means of extended x-ray absorption fine structure (EXAFS) spectroscopy and transmission electron microscopy. A bond length contraction was observed and can be explained by surface tension effects in a simple liquid-drop model. Such results are consistent with previous reports on nonembedded NCs implying a negligible influence of the SiO 2 matrix. Cumulant analysis of the EXAFS data suggests surface reconstruction or relaxation involving a further shortened bond length. A deviation from the octahedral closed shell structure is apparent for NCs of size 25 A

Facilitation of Nanoscale Thermal Transport by Hydrogen Bonds

OpenAIRE

Zhang, Lin

2017-01-01

Thermal transport performance at the nanoscale and/or of biomaterials is essential to the success of many new technologies including nanoelectronics, biomedical devices, and various nanocomposites. Due to complicated microstructures and chemical bonding, thermal transport process in these materials has not been well understood yet. In terms of chemical bonding, it is well known that the strength of atomic bonding can significantly affect thermal transport across materials or across interfaces...

Catalytic constructive deoxygenation of lignin-derived phenols: new C-C bond formation processes from imidazole-sulfonates and ether cleavage reactions.

Science.gov (United States)

Leckie, Stuart M; Harkness, Gavin J; Clarke, Matthew L

2014-10-09

As part of a programme aimed at exploiting lignin as a chemical feedstock for less oxygenated fine chemicals, several catalytic C-C bond forming reactions utilising guaiacol imidazole sulfonate are demonstrated. These include the cross-coupling of a Grignard, a non-toxic cyanide source, a benzoxazole, and nitromethane. A modified Meyers reaction is used to accomplish a second constructive deoxygenation on a benzoxazole functionalised anisole.

The Topographic Design of River Channels for Form-Process Linkages.

Science.gov (United States)

Brown, Rocko A; Pasternack, Gregory B; Lin, Tin

2016-04-01

Scientists and engineers design river topography for a wide variety of uses, such as experimentation, site remediation, dam mitigation, flood management, and river restoration. A recent advancement has been the notion of topographical design to yield specific fluvial mechanisms in conjunction with natural or environmental flow releases. For example, the flow convergence routing mechanism, whereby shear stress and spatially convergent flow migrate or jump from the topographic high (riffle) to the low point (pool) from low to high discharge, is thought to be a key process able to maintain undular relief in gravel bedded rivers. This paper develops an approach to creating riffle-pool topography with a form-process linkage to the flow convergence routing mechanism using an adjustable, quasi equilibrium synthetic channel model. The link from form to process is made through conceptualizing form-process relationships for riffle-pool couplets into geomorphic covariance structures (GCSs) that are then quantitatively embedded in a synthetic channel model. Herein, GCSs were used to parameterize a geometric model to create five straight, synthetic river channels with varying combinations of bed and width undulations. Shear stress and flow direction predictions from 2D hydrodynamic modeling were used to determine if scenarios recreated aspects of the flow convergence routing mechanism. Results show that the creation of riffle-pool couplets that experience flow convergence in straight channels requires GCSs with covarying bed and width undulations in their topography as supported in the literature. This shows that GCSs are a useful way to translate conceptualizations of form-process linkages into quantitative models of channel form.

Magnetic Induction Machines Embedded in Fusion-Bonded Silicon

National Research Council Canada - National Science Library

Arnold, David P; Cros, Florent; Zana, Iulica; Allen, Mark G; Das, Sauparna; Lang, Jeffrey H

2004-01-01

...) within etched and fusion-bonded silicon to form the machine structure. The induction machines were characterized in motoring mode using tethered rotors, and exhibited a maximum measured torque...

Effect of bond administration on construction project delivery

Directory of Open Access Journals (Sweden)

Oke Ayodeji Emmanuel

2016-12-01

Full Text Available Construction bond administration involves management of bond issues from inception of obtaining bond from guarantor to the point of release of contractor by the client. This process has posted a lot of challenges to construction stakeholders; it is therefore, necessary to examine the relationship between bond administration and project success. Archival data of completed bonded building projects were gathered through a pro forma developed for this purpose. Using Pearson product moment of correlation, it was revealed that the cost of securing a construction bond has a positive and significant effect on the initial and final costs of the project, while the number of days needed to secure a construction bond has no significant effect on the initial and final durations of the construction project. In order to establish the relationship between project delivery indices of cost and time and the construction bond administration variables, iteration of linear regression was adopted to arrive at the best-fit equation. Factors affecting the cost of securing construction bonds from guarantors should be identified and given adequate attention by construction stakeholders in order to minimize the effect of construction bond administration on project delivery.

A Novel Process for Joining Ti Alloy and Al Alloy using Two-Stage Sintering Powder Metallurgy

Science.gov (United States)

Long, Luping; Liu, Wensheng; Ma, Yunzhu; Wu, Lei; Liu, Chao

2018-04-01

The major challenges for conventional diffusion bonding of joining Ti alloy and Al alloy are the undesirable interfacial reaction, low matrixes and joint strength. To avoid the problem in diffusion bonding, a novel two-stage sintering powder metallurgy process is developed. In the present work, the interface characterization and joint performance of the bonds obtained by powder metallurgy bonding are investigated and are compared with the diffusion bonded Ti/Al joints obtained with the same and the optimized process parameters. The results show that no intermetallic compound is visible in the Ti/Al joint obtained by powder metallurgy bonding, while a new layer formed at the joint diffusion bonded with the same parameters. The maximum tensile strength of joint obtained by diffusion bonding is 58 MPa, while a higher tensile strength reaching 111 MPa for a bond made by powder metallurgy bonding. Brittle fractures occur at all the bonds. It is shown that the powder metallurgy bonding of Ti/Al is better than diffusion bonding. The results of this study should benefit the bonding quality.

Effect of ethanol-wet-bonding technique on resin–enamel bonds

Directory of Open Access Journals (Sweden)

Muhammet Kerim Ayar

2014-03-01

Conclusion: The ethanol-wet-bonding technique may increase the bond strength of commercial adhesives to enamel. The chemical composition of the adhesives can affect the bond strength of adhesives when bonding to acid-etched enamel, using the ethanol-wet-bonding technique. Some adhesive systems used in the present study may simultaneously be applied to enamel and dentin using ethanol-wet-bonding. Furthermore, deploying ethanol-wet-bonding for the tested commercial adhesives to enamel can increase the adhesion abilities of these adhesives to enamel.

A Metal Bump Bonding Method Using Ag Nanoparticles as Intermediate Layer

Science.gov (United States)

Fu, Weixin; Nimura, Masatsugu; Kasahara, Takashi; Mimatsu, Hayata; Okada, Akiko; Shoji, Shuichi; Ishizuka, Shugo; Mizuno, Jun

2015-11-01

The future development of low-temperature and low-pressure bonding technology is necessary for fine-pitch bump application. We propose a bump structure using Ag nanoparticles as an intermediate layer coated on a fine-pitch Cu pillar bump. The intermediate layer is prepared using an efficient and cost-saving squeegee-coating method followed by a 100°C baking process. This bump structure can be easily flattened before the bonding process, and the low-temperature sinterability of the nanoparticles is retained. The bonding experiment was successfully performed at 250°C and 39.8 MPa and the bonding strength was comparable to that achieved via other bonding technology utilizing metal particles or porous material as bump materials.

Bond strength investigation of two shot moulded polymer

DEFF Research Database (Denmark)

Islam, Mohammad Aminul

This report on the project “Bond strength investigation of two shot moulded polymers” has been submitted for fulfilling the requirements for the course “Experimental Plastic Technology – 42234” at IPL-DTU. Two shot moulding is a classic manufacturing process to combine two different polymers...... in a single product and it is getting more and more importance day by day. One of the biggest challenges of two shot moulding is to achieve a reasonably good bonding between two polymers. The purpose of this project is to investigate the effects of different process, material and machine parameters...... on the bond strength of two shot moulded polymers. For the experiments two engineering polymers (PS and ABS) were used. After all the experimental work, several parameters were found which could effectively control the bond strength of two shot moulded polymers. This report also presents different aspects...

[Two-dimensional model of a double-well potential: proton transfer when a hydrogen bond is deformed].

Science.gov (United States)

Krasilnikov, P M

2014-01-01

The potential energy cross-section profile along a hydrogen bond may contain two minima in certain conditions; it is so-called a double well potential. The H-bond double well potential is essential for proton transfer along this hydrogen bond. We have considered the two-dimensional model of such double well potential in harmonic approximation, and we have also investigated the proton tunneling in it. In real environments thermal motion of atoms or conformational changes may cause reorientation and relative shift of molecule fragment forming the hydrogen bond and, as a result, the hydrogen bond isdeformed. This deformation is liable to change the double well potential form and, hence, the probability of the proton tunneling is changed too. As it is shown the characteristic time of proton tunneling is essentially increased by even small relative shift of heavy atoms forming the H-bond and also rotational displacement of covalent bond generated by one of heavy atoms and the proton (hydrogen atom). However, it is also shown, at the certain geometry of the H-bond deformation the opposite effect occurred, i.e., the characteristic time is not increased and even decreased. Notice that such its behavior arises from two-dimensionality of potential wells; this and other properties of our model are discussed in detail.

Modeling of direct wafer bonding: Effect of wafer bow and etch patterns

Science.gov (United States)

Turner, K. T.; Spearing, S. M.

2002-12-01

Direct wafer bonding is an important technology for the manufacture of silicon-on-insulator substrates and microelectromechanical systems. As devices become more complex and require the bonding of multiple patterned wafers, there is a need to understand the mechanics of the bonding process. A general bonding criterion based on the competition between the strain energy accumulated in the wafers and the surface energy that is dissipated as the bond front advances is developed. The bonding criterion is used to examine the case of bonding bowed wafers. An analytical expression for the strain energy accumulation rate, which is the quantity that controls bonding, and the final curvature of a bonded stack is developed. It is demonstrated that the thickness of the wafers plays a large role and bonding success is independent of wafer diameter. The analytical results are verified through a finite element model and a general method for implementing the bonding criterion numerically is presented. The bonding criterion developed permits the effect of etched features to be assessed. Shallow etched patterns are shown to make bonding more difficult, while it is demonstrated that deep etched features can facilitate bonding. Model results and their process design implications are discussed in detail.

Nucleophilicities of Lewis Bases B and Electrophilicities of Lewis Acids A Determined from the Dissociation Energies of Complexes B⋯A Involving Hydrogen Bonds, Tetrel Bonds, Pnictogen Bonds, Chalcogen Bonds and Halogen Bonds

Directory of Open Access Journals (Sweden)

Ibon Alkorta

2017-10-01

Full Text Available It is shown that the dissociation energy D e for the process B⋯A = B + A for 250 complexes B⋯A composed of 11 Lewis bases B (N2, CO, HC≡CH, CH2=CH2, C3H6, PH3, H2S, HCN, H2O, H2CO and NH3 and 23 Lewis acids (HF, HCl, HBr, HC≡CH, HCN, H2O, F2, Cl2, Br2, ClF, BrCl, H3SiF, H3GeF, F2CO, CO2, N2O, NO2F, PH2F, AsH2F, SO2, SeO2, SF2, and SeF2 can be represented to good approximation by means of the equation D e = c ′ N B E A , in which N B is a numerical nucleophilicity assigned to B, E A is a numerical electrophilicity assigned to A, and c ′ is a constant, conveniently chosen to have the value 1.00 kJ mol−1 here. The 250 complexes were chosen to cover a wide range of non-covalent interaction types, namely: (1 the hydrogen bond; (2 the halogen bond; (3 the tetrel bond; (4 the pnictogen bond; and (5 the chalcogen bond. Since there is no evidence that one group of non-covalent interaction was fitted any better than the others, it appears the equation is equally valid for all the interactions considered and that the values of N B and E A so determined define properties of the individual molecules. The values of N B and E A can be used to predict the dissociation energies of a wide range of binary complexes B⋯A with reasonable accuracy.

Silicate bonding properties: Investigation through thermal conductivity measurements

Energy Technology Data Exchange (ETDEWEB)

Lorenzini, M; Cesarini, E; Cagnoli, G; Campagna, E; Losurdo, G; Martelli, F; Piergiovanni, F; Vetrano, F [INFN, Istituto Nazionale di Fisica Nucleare, Sez. di Firenze, via G. Sansone 1, 50019 Sesto Fiorentino (Italy); Haughian, K; Hough, J; Martin, I; Reid, S; Rowan, S; Veggel, A A van, E-mail: lorenzini@fi.infn.i [SUPA, University of Glasgow, Department of Physics and Astronomy, Kelvin Building G12 8QQ Glasgow, Scotland (United Kingdom)

2010-05-01

A direct approach to reduce the thermal noise contribution to the sensitivity limit of a GW interferometric detector is the cryogenic cooling of the mirrors and mirrors suspensions. Future generations of detectors are foreseen to implement this solution. Silicon has been proposed as a candidate material, thanks to its very low intrinsic loss angle at low temperatures and due to its very high thermal conductivity, allowing the heat deposited in the mirrors by high power lasers to be efficiently extracted. To accomplish such a scheme, both mirror masses and suspension elements must be made of silicon, then bonded together forming a quasi-monolithic stage. Elements can be assembled using hydroxide-catalysis silicate bonding, as for silica monolithic joints. The effect of Si to Si bonding on suspension thermal conductance has therefore to be experimentally studied. A measurement of the effect of silicate bonding on thermal conductance carried out on 1 inch thick silicon bonded samples, from room temperature down to 77 K, is reported. In the explored temperature range, the silicate bonding does not seem to affect in a relevant way the sample conductance.

Parental Bonding

Directory of Open Access Journals (Sweden)

T. Paul de Cock

2014-08-01

Full Text Available Estimating the early parent–child bonding relationship can be valuable in research and practice. Retrospective dimensional measures of parental bonding provide a means for assessing the experience of the early parent–child relationship. However, combinations of dimensional scores may provide information that is not readily captured with a dimensional approach. This study was designed to assess the presence of homogeneous groups in the population with similar profiles on parental bonding dimensions. Using a short version of the Parental Bonding Instrument (PBI, three parental bonding dimensions (care, authoritarianism, and overprotection were used to assess the presence of unobserved groups in the population using latent profile analysis. The class solutions were regressed on 23 covariates (demographics, parental psychopathology, loss events, and childhood contextual factors to assess the validity of the class solution. The results indicated four distinct profiles of parental bonding for fathers as well as mothers. Parental bonding profiles were significantly associated with a broad range of covariates. This person-centered approach to parental bonding has broad utility in future research which takes into account the effect of parent–child bonding, especially with regard to “affectionless control” style parenting.

Alternatives for high-level waste forms, containers, and container processing systems

International Nuclear Information System (INIS)

Crawford, T.W.

1995-01-01

This study evaluates alternatives for high-level waste forms, containers, container processing systems, and onsite interim storage. Glass waste forms considered are cullet, marbles, gems, and monolithic glass. Small and large containers configured with several combinations of overpack confinement and shield casks are evaluated for these waste forms. Onsite interim storage concepts including canister storage building, bore holes, and storage pad were configured with various glass forms and canister alternatives. All favorable options include the monolithic glass production process as the waste form. Of the favorable options the unshielded 4- and 7-canister overpack options have the greatest technical assurance associated with their design concepts due to their process packaging and storage methods. These canisters are 0.68 m and 0.54 m in diameter respectively and 4.57 m tall. Life-cycle costs are not a discriminating factor in most cases, varying typically less than 15 percent

Interfacial microstructure and mechanical properties of diffusion-bonded titanium-stainless steel joints using a nickel interlayer

International Nuclear Information System (INIS)

Kundu, S.; Chatterjee, S.

2006-01-01

Diffusion bonding was carried out between commercially pure titanium and 304 stainless steel using nickel interlayer in the temperature range of 800-950 deg. C for 3.6 ks under 3 MPa load in vacuum. The transition joints thus formed were characterized in optical and scanning electron microscopes. TiNi 3 , TiNi and Ti 2 Ni are formed at the nickel-titanium (Ni-Ti) interface; whereas, stainless steel-nickel (SS-Ni) interface is free from intermetallic compounds up to 900 deg. C processing temperatures. At 950 deg. C, Ni-Ti interface exhibits the presence of β-Ti discrete islands in the matrix of Ti 2 Ni and the phase mixture of λ + χ + α-Fe, λ + α-Fe, λ + FeTi + β-Ti and FeTi + β-Ti occurs at the stainless steel-nickel interface. Nickel is able to inhibit the diffusion of Ti to stainless steel side up to 900 deg. C temperature; however, becomes unable to restrict the migration of Ti to stainless steel at 950 deg. C. Bond strength was also evaluated and maximum tensile strength of ∼302 MPa and shear strength of ∼219 MPa were obtained for the diffusion couple processed at 900 deg. C temperature due to better contact of the mating surfaces and failure takes place at the Ni-Ti interface. At higher joining temperature, the formation of Fe-Ti bases intermetallics reduces the bond strength and failure occurs at the SS-Ni interface

Method and device for secure, high-density tritium bonded with carbon

Science.gov (United States)

Wertsching, Alan Kevin; Trantor, Troy Joseph; Ebner, Matthias Anthony; Norby, Brad Curtis

2016-04-05

A method and device for producing secure, high-density tritium bonded with carbon. A substrate comprising carbon is provided. A precursor is intercalated between carbon in the substrate. The precursor intercalated in the substrate is irradiated until at least a portion of the precursor, preferably a majority of the precursor, is transmutated into tritium and bonds with carbon of the substrate forming bonded tritium. The resulting bonded tritium, tritium bonded with carbon, produces electrons via beta decay. The substrate is preferably a substrate from the list of substrates consisting of highly-ordered pyrolytic graphite, carbon fibers, carbon nanotunes, buckministerfullerenes, and combinations thereof. The precursor is preferably boron-10, more preferably lithium-6. Preferably, thermal neutrons are used to irradiate the precursor. The resulting bonded tritium is preferably used to generate electricity either directly or indirectly.

The first row anomaly and recoupled pair bonding in the halides of the late p-block elements.

Science.gov (United States)

Dunning, Thom H; Woon, David E; Leiding, Jeff; Chen, Lina

2013-02-19

The dramatic differences between the properties of molecules formed from the late p-block elements of the first row of the periodic table (N-F) and those of the corresponding elements in subsequent rows is well recognized as the first row anomaly. Certain properties of the atoms, such as the relative energies and spatial extents of the ns and np orbitals, can explain some of these differences, but not others. In this Account, we summarize the results of our recent computational studies of the halides of the late p-block elements. Our studies point to a single underlying cause for many of these differences: the ability of the late p-block elements in the second and subsequent rows of the periodic table to form recoupled pair bonds and recoupled pair bond dyads with very electronegative ligands. Recoupled pair bonds form when an electron in a singly occupied ligand orbital recouples the pair of electrons in a doubly occupied lone pair orbital on the central atom, leading to a central atom-ligand bond. Recoupled pair bond dyads occur when a second ligand forms a bond with the orbital left over from the initial recoupled pair bond. Recoupled pair bonds and recoupled pair bond dyads enable the late p-block elements to form remarkably stable hypervalent compounds such as PF(5) and SF(6) and lead to unexpected excited states in smaller halides of the late p-block elements such as SF and SF(2). Recoupled pair bonding also causes the F(n-1)X-F bond energies to oscillate dramatically once the normal valences of the central atoms have been satisfied. In addition, recoupled pair bonding provides a lower-energy pathway for inversion in heavily fluorinated compounds (PF(3) and PF(2)H, but not PH(2)F and PH(3)) and leads to unusual intermediates and products in reactions involving halogens and late p-block element compounds, such as (CH(3))(2)S + F(2). Although this Account focuses on the halides of the second row, late p-block elements, recoupled pair bonds and recoupled pair