WorldWideScience

Sample records for based solder candidates

  1. Development of gold based solder candidates for flip chip assembly

    DEFF Research Database (Denmark)

    Chidambaram, Vivek; Hald, John; Hattel, Jesper Henri

    2009-01-01

    Flip chip technology is now rapidly replacing the traditional wire bonding interconnection technology in the first level packaging applications due to the miniaturization drive in the microelectronics industry. Flip chip assembly currently involves the use of high lead containing solders for inte......Flip chip technology is now rapidly replacing the traditional wire bonding interconnection technology in the first level packaging applications due to the miniaturization drive in the microelectronics industry. Flip chip assembly currently involves the use of high lead containing solders...

  2. Au-Ge based Candidate Alloys for High-Temperature Lead-Free Solder Alternatives

    DEFF Research Database (Denmark)

    Chidambaram, Vivek; Hald, John; Hattel, Jesper Henri

    2009-01-01

    Au-Ge based candidate alloys have been proposed as an alternative to high-lead content solders that are currently being used for high-temperature applications. The influence of the low melting point metals namely In, Sb and Sn to the Au-Ge eutectic with respect to the microstructure and microhard...

  3. A Corrosion Investigation of Solder Candidates for High-Temperature Applications

    DEFF Research Database (Denmark)

    Chidambaram, Vivek; Hald, John; Ambat, Rajan;

    2009-01-01

    The step soldering approach is being employed in the Multi-Chip module (MCM) technology. High lead containing alloys is one of the solders currently being used in this approach. Au-Sn and Au-Ge based candidate alloys have been proposed as alternative solders for this application. In this work, co...

  4. Development of Au-Ge based candidate alloys as an alternative to high-lead content solders

    DEFF Research Database (Denmark)

    Chidambaram, Vivek; Hald, John; Hattel, Jesper Henri

    2010-01-01

    , 150°C for up to 3 weeks and compared with aging at 200°C. After being subjected to high-temperature aging, the microstructure varied a lot in morphology in the case of both Au-Ge-Sb and Au-Ge-Sn candidate alloys while the microstructure remained relatively stable even after long-term thermal aging......-Ge-In and Au-Ge-Sn combinations was determined to be the classic solid solution strengthening. The Au-Ge-Sb combination was primarily strengthened by the refined (Ge) dispersed phase. The aging temperature had a significant influence on the microhardness in the case of the Au-Ge-Sn candidate alloy...

  5. Assessment of potential solder candidates for high temperature applications

    DEFF Research Database (Denmark)

    Multi-Chip module (MCM) technology is a specialized electronic packaging technology recently gaining momentum due to the miniaturization drive in the microelectronics industry. The step soldering approach is being employed in the MCM technology. This method is used to solder various levels...... of the package with different solders of different melting temperatures. High Pb containing alloys where the lead levels can be above 85% by weight, is one of the solders currently being used in this technology. Responding to market pressure i.e. need for green electronic products there is now an increasing....... The corrosion surface morphology and also the corrosion products were analyzed using SEM. Focus in particular has been given to the property of corrosion resistance since corrosion resistance is a major issue for lead-free solder alloys. The electric field experienced by the solders during usage further...

  6. Nanocopper Based Solder-Free Electronic Assembly

    Science.gov (United States)

    Schnabl, K.; Wentlent, L.; Mootoo, K.; Khasawneh, S.; Zinn, A. A.; Beddow, J.; Hauptfleisch, E.; Blass, D.; Borgesen, P.

    2014-12-01

    CuantumFuse nano copper material has been used to assemble functional LED test boards and a small camera board with a 48 pad CMOS sensor quad-flat no-lead chip and a 10 in flexible electronics demo. Drop-in replacement of solder, by use of stencil printing and standard surface mount technology equipment, has been demonstrated. Applications in space and commercial systems are currently under consideration. The stable copper-nanoparticle paste has been examined and characterized by scanning electron microscopy and high-resolution transmission electron microscopy; this has shown that the joints are nanocrystalline but with substantial porosity. Assessment of reliability is expected to be complicated by this and by the effects of thermal and strain-enhanced coarsening of pores. Strength, creep, and fatigue properties were measured and results are discussed with reference to our understanding of solder reliability to assess the potential of this nano-copper based solder alternative.

  7. Corrosion resistance of the soldering joint of post-soldering of palladium-based metal-ceramic alloys.

    Science.gov (United States)

    Kawada, E; Sakurai, Y; Oda, Y

    1997-05-01

    To evaluate the corrosion resistance of post soldering of metal-ceramic alloys, four commercially available palladium-system metal-ceramic alloys (Pd-Cu, Pd-Ni, Pd-Ag, and Pd-Sb systems) and two types of solder (12 k gold solder and 16 k gold solder) with different compositions and melting points were used. The corrosion resistance of the soldered joint was evaluated by anodic polarization. The electrochemical characteristics of soldered surface were measured using electrochemical equipment. Declines in corrosion resistance were not detectable with Pd-Cu, Pd-Ag and Pd-Sb types, but break down at low potential occurred with Pd-Ni type.

  8. Research on Defects Inspection of Solder Balls Based on Eddy Current Pulsed Thermography

    Science.gov (United States)

    Zhou, Xiuyun; Zhou, Jinlong; Tian, Guiyun; Wang, Yizhe

    2015-01-01

    In order to solve tiny defect detection for solder balls in high-density flip-chip, this paper proposed feasibility study on the effect of detectability as well as classification based on eddy current pulsed thermography (ECPT). Specifically, numerical analysis of 3D finite element inductive heat model is generated to investigate disturbance on the temperature field for different kind of defects such as cracks, voids, etc. The temperature variation between defective and non-defective solder balls is monitored for defects identification and classification. Finally, experimental study is carried on the diameter 1mm tiny solder balls by using ECPT and verify the efficacy of the technique. PMID:26473871

  9. Research on defects inspection of solder balls based on eddy current pulsed thermography.

    Science.gov (United States)

    Zhou, Xiuyun; Zhou, Jinlong; Tian, Guiyun; Wang, Yizhe

    2015-10-13

    In order to solve tiny defect detection for solder balls in high-density flip-chip, this paper proposed feasibility study on the effect of detectability as well as classification based on eddy current pulsed thermography (ECPT). Specifically, numerical analysis of 3D finite element inductive heat model is generated to investigate disturbance on the temperature field for different kind of defects such as cracks, voids, etc. The temperature variation between defective and non-defective solder balls is monitored for defects identification and classification. Finally, experimental study is carried on the diameter 1mm tiny solder balls by using ECPT and verify the efficacy of the technique.

  10. Research on Defects Inspection of Solder Balls Based on Eddy Current Pulsed Thermography

    Directory of Open Access Journals (Sweden)

    Xiuyun Zhou

    2015-10-01

    Full Text Available In order to solve tiny defect detection for solder balls in high-density flip-chip, this paper proposed feasibility study on the effect of detectability as well as classification based on eddy current pulsed thermography (ECPT. Specifically, numerical analysis of 3D finite element inductive heat model is generated to investigate disturbance on the temperature field for different kind of defects such as cracks, voids, etc. The temperature variation between defective and non-defective solder balls is monitored for defects identification and classification. Finally, experimental study is carried on the diameter 1mm tiny solder balls by using ECPT and verify the efficacy of the technique.

  11. Thermal analysis of selected tin-based lead-free solder alloys

    DEFF Research Database (Denmark)

    Palcut, Marián; Sopoušek, J.; Trnková, L.

    2009-01-01

    The Sn-Ag-Cu alloys have favourable solderability and wetting properties and are, therefore, being considered as potential lead-free solder materials. In the present study, tin-based Sn-Ag-Cu and Sn-Ag-Cu-Bi alloys were studied in detail by a differential scanning calorimetry (DSC) and thermodyna......The Sn-Ag-Cu alloys have favourable solderability and wetting properties and are, therefore, being considered as potential lead-free solder materials. In the present study, tin-based Sn-Ag-Cu and Sn-Ag-Cu-Bi alloys were studied in detail by a differential scanning calorimetry (DSC...... was simulated using the Thermo-Calc software package. This approach enabled us to obtain the enthalpy of cooling for each alloy and to compare its temperature derivative with the experimental DSC curves....

  12. Effects of Ga Addition on Interfacial Reactions Between Sn-Based Solders and Ni

    Science.gov (United States)

    Wang, Chao-Hong; Li, Kuan-Ting

    2016-12-01

    The use of Ga as a micro-alloying element in Sn-based solders can change the microstructure of solder joints to improve the mechanical properties, and even suppress the interfacial intermetallic compound (IMC) growth. This research investigated the effects of Ga addition (0.2-1 wt.%Ga) on the IMC formation and morphological evolution in the Sn-based solder joints with Ni substrate. In the soldering reaction at 250°C and with less than 0.2 wt.%Ga addition, the formed phase was Ni3Sn4. When the Ga addition increased to 0.5 wt.%, it changed to a thin Ni2Ga3 layer of ˜1 μm thick, which stably existed at the interface in the initial 1-h reaction. Subsequently, the whole Ni2Ga3 layer detached from the Ni substrate and drifted into the molten solder. The Ni3Sn4 phase became dominant in the later stage. Notably, the Ga addition significantly reduced the grain size of Ni3Sn4, resulting in the massive spalling of Ni3Sn4 grains. With 1 wt.%Ga addition, the Ni2Ga3 layer remained very thin with no significant growth, and it stably existed at the interface for more than 10 h. In addition, the solid-state reactions were examined at temperatures of 160°C to 200°C. With addition of 0.5 wt.%Ga, the Ni3Sn4 phase dominated the whole reaction. By contrast, with increasing to 1 wt.%Ga, only a thin Ni2Ga3 layer was found even after aging at 160°C for more than 1200 h. The 1 wt.%Ga addition in solder can effectively inhibit the Ni3Sn4 formation in soldering and the long-term aging process.

  13. Effects of Ga Addition on Interfacial Reactions Between Sn-Based Solders and Ni

    Science.gov (United States)

    Wang, Chao-Hong; Li, Kuan-Ting

    2016-07-01

    The use of Ga as a micro-alloying element in Sn-based solders can change the microstructure of solder joints to improve the mechanical properties, and even suppress the interfacial intermetallic compound (IMC) growth. This research investigated the effects of Ga addition (0.2-1 wt.%Ga) on the IMC formation and morphological evolution in the Sn-based solder joints with Ni substrate. In the soldering reaction at 250°C and with less than 0.2 wt.%Ga addition, the formed phase was Ni3Sn4. When the Ga addition increased to 0.5 wt.%, it changed to a thin Ni2Ga3 layer of ˜1 μm thick, which stably existed at the interface in the initial 1-h reaction. Subsequently, the whole Ni2Ga3 layer detached from the Ni substrate and drifted into the molten solder. The Ni3Sn4 phase became dominant in the later stage. Notably, the Ga addition significantly reduced the grain size of Ni3Sn4, resulting in the massive spalling of Ni3Sn4 grains. With 1 wt.%Ga addition, the Ni2Ga3 layer remained very thin with no significant growth, and it stably existed at the interface for more than 10 h. In addition, the solid-state reactions were examined at temperatures of 160°C to 200°C. With addition of 0.5 wt.%Ga, the Ni3Sn4 phase dominated the whole reaction. By contrast, with increasing to 1 wt.%Ga, only a thin Ni2Ga3 layer was found even after aging at 160°C for more than 1200 h. The 1 wt.%Ga addition in solder can effectively inhibit the Ni3Sn4 formation in soldering and the long-term aging process.

  14. Study on Solder Joint Reliability of Plastic Ball Grid Array Component Based on SMT Products Virtual Assembly Technology

    Institute of Scientific and Technical Information of China (English)

    HUANG Chunyue; WU Zhaohua; ZHOU Dejian

    2006-01-01

    Based on surface mount products virtual assembly technology, the solder joint reliability of plastic ball grid array (PBGA) was studied. Four process parameters, including the upper pad diameter,the stencil thickness, the chip weight on a single solder joint and the lower pad diameter were chose as four control factors. By using an L25(56) orthogonal array the PBGA solder joints which have 25 different process parameters' levels combinations were designed. The numerical models of all the 25 PBGA solder joints were developed and the finite element analysis models were setup. The stress and strain distribution within the PBGA solder joints under thermal cycles were studied by finite element analysis, and the thermal fatigue life of PBGA solder joint was calculated using Coffin-Manson equation. Based on the calculated thermal fatigue life results, the range analysis was performed. The results of study show that that the impact sequence of the four factors from high to low on the fatigue life of PBGA solder joints are the stencil thickness,the upper pad diameter, the lower pad diameter and the chip weight on a single solder joint; the best level combination ofprocess parameters that results in the longest fatigue life is the lower pad diameter of 0.6 mm, the stencil thickness of 0.175 mm, the chip weight on asingle solder joint of 28×10-5 N and the upper pad diameter of 0.5 mm.

  15. Research and application of visual location technology for solder paste printing based on machine vision

    Institute of Scientific and Technical Information of China (English)

    Luosi WEI; Zongxia JIAO

    2009-01-01

    A location system is very important for solder paste printing in the process of surface mount technology (SMT). Using machine vision technology to complete the location mission is new and very efficient. This paper presents an integrated visual location system for solder paste printing based on machine vision. The working principle of solder paste printing is introduced and then the design and implementation of the visual location system are described. In the system, two key techniques are completed by secondary development based on VisionPro.One is accurate image location solved by the pattern-based location algorithms of PatMax. The other one is camera calibration that is achieved by image warping technology through the checkerboard plate. Moreover, the system can provide good performances such as high image locating accuracy with 1/40 sub-pixels, high anti-jamming, and high-speed location of objects whose appearance is rotated, scaled, and/or stretched.

  16. Soldering handbook

    CERN Document Server

    Vianco, Paul T

    1999-01-01

    Contains information related to soldering processes, and solder joint performance and reliability. Covers soldering fundamentals, technology, materials, substrate materials, fluxes, pastes, assembly processes, inspection, and environment. Covers today's advanced joining applications and emphasizes new materials, including higher strength alloys; predictive performance; computer modeling; advanced inspection techniques; new processing concepts, including laser heating; and the resurgence in ultrasonic soldering.

  17. Solderability test system

    Energy Technology Data Exchange (ETDEWEB)

    Yost, Fred (Cedar Crest, NM); Hosking, Floyd M. (Albuquerque, NM); Jellison, James L. (Albuquerque, NM); Short, Bruce (Beverly, MA); Giversen, Terri (Beverly, MA); Reed, Jimmy R. (Austin, TX)

    1998-01-01

    A new test method to quantify capillary flow solderability on a printed wiring board surface finish. The test is based on solder flow from a pad onto narrow strips or lines. A test procedure and video image analysis technique were developed for conducting the test and evaluating the data. Feasibility tests revealed that the wetted distance was sensitive to the ratio of pad radius to line width (l/r), solder volume, and flux predry time.

  18. Solderability test system

    Energy Technology Data Exchange (ETDEWEB)

    Yost, F.; Hosking, F.M.; Jellison, J.L.; Short, B.; Giversen, T.; Reed, J.R.

    1998-10-27

    A new test method to quantify capillary flow solderability on a printed wiring board surface finish. The test is based on solder flow from a pad onto narrow strips or lines. A test procedure and video image analysis technique were developed for conducting the test and evaluating the data. Feasibility tests revealed that the wetted distance was sensitive to the ratio of pad radius to line width (l/r), solder volume, and flux predry time. 11 figs.

  19. Lead-free solder

    Energy Technology Data Exchange (ETDEWEB)

    Anderson, Iver E. (Ames, IA); Terpstra, Robert L. (Ames, IA)

    2001-05-15

    A Sn--Ag--Cu eutectic alloy is modified with one or more low level and low cost alloy additions to enhance high temperature microstructural stability and thermal-mechanical fatigue strength without decreasing solderability. Purposeful fourth or fifth element additions in the collective amount not exceeding about 1 weight % (wt. %) are added to Sn--Ag--Cu eutectic solder alloy based on the ternary eutectic Sn--4.7%Ag--1.7%Cu (wt. %) and are selected from the group consisting essentially of Ni, Fe, and like-acting elements as modifiers of the intermetallic interface between the solder and substrate to improve high temperature solder joint microstructural stability and solder joint thermal-mechanical fatigue strength.

  20. Studies on in situ particulate reinforced tin-silver composite solders relevant to thermomechanical fatigue issues

    Science.gov (United States)

    Choi, Sunglak

    2001-07-01

    Global pressure based on environmental and health concerns regarding the use of Pb-bearing solder has forced the electronics industry to develop Pb-free alternative solders. Eutectic Sn-Ag solder has received much attention as a potential Pb-free candidate to replace Sn-Pb solder. Since introduction of surface mount technology, packaging density increased and the electronic devices became smaller. As a result, solders in electronic modules are forced to function as a mechanical connection as well as electrical contact. Solders are also exposed to very harsh service conditions such as automotive under-the-hood and aerospace applications. Solder joints experience thermomechanical fatigue, i.e. interaction of fatigue and creep, during thermal cycling due to temperature fluctuation in service conditions. Microstructural study on thermomechanical fatigue of the actual eutectic Sn-Ag and Sn-4Ag-0.5Cu solder joints was performed to better understand deformation and damage accumulation occurring during service. Incorporation of reinforcements has been pursued to improve the mechanical and particularly thermomechanical behavior of solders, and their service temperature capability. In-situ Sn-Ag composite solders were developed by incorporating Cu 6Sn5, Ni3Sn4, and FeSn2 particulate reinforcements in the eutectic Sn-Ag solder in an effort to enhance thermomechanical fatigue resistance. In-situ composite solders were investigated on the growth of interfacial intermetallic layer between solder and Cu substrate growth and creep properties. Solder joints exhibited significant deformation and damage on free surface and interior regions during thermomechanical fatigue. Cracks initiated on the free surface of the solder joints and propagated toward interior regions near the substrate of the solder joint. Crack grew along Sn grain boundaries by grain boundary sliding. There was significant residual stress within the solder joint causing more damage. Presence of small amount of Cu

  1. Thermo-mechanical fatigue reliability optimization of PBGA solder joints based on ANN-PSO

    Institute of Scientific and Technical Information of China (English)

    ZHOU Ji-cheng; XIAO Xiao-qing; EN Yun-fei; CHEN Ni; WANG Xiang-zhong

    2008-01-01

    Based on a method combined artificial neural network (ANN) with particle swarm optimization (PSO) algorithm, the thermo-mechanical fatigue reliability of plastic ball grid array (PBGA) solder joints was studied. The simulation experiments of accelerated thermal cycling test were performed by ANSYS software. Based on orthogonal array experiments, a back-propagation artificial neural network (BPNN) was used to establish the nonlinear multivariate relationship between thermo-mechanical fatigue reliability and control factors. Then, PSO was applied to obtaining the optimal levels of control factors by using the output of BPNN as the affinity measure. The results show that the control factors, such as print circuit board (PCB) size, PCB thickness, substrate size,substrate thickness, PCB coefficient of thermal expansion (CTE), substrate CTE, silicon die CTE, and solder joint CTE, have a great influence on thermo-mechanical fatigue reliability of PBGA solder joints. The ratio of signal to noise of ANN-PSO method is 51.77dB and its error is 33.3% less than that of Taguchi method. Moreover, the running time of ANN-PSO method is only 2% of that of the BPNN. These conclusions are verified by the confirmative experiments.

  2. High-temperature lead-free solder alternatives

    DEFF Research Database (Denmark)

    Nachiappan, Vivek Chidambaram; Hattel, Jesper Henri; Hald, John

    2011-01-01

    For lead-free solders in the high-temperature regime, unfortunately, a limited number of alloying systems are available. These are Bi based alloys, gold involving alloys and Zn–Al based alloys. Based on these systems, possible candidate alloys were designed to have a melting range between 270°C a...

  3. Thermophysical Properties of Sn-Ag-Cu Based Pb-Free Solders

    Science.gov (United States)

    Kim, Sok Won; Lee, Jaeran; Jeon, Bo-Min; Jung, Eun; Lee, Sang Hyun; Kang, Kweon Ho; Lim, Kwon Taek

    2009-06-01

    Lead-tin (Pb-Sn) alloys are the dominant solders used for electronic packaging because of their low cost and superior properties required for interconnecting electronic components. However, increasing environmental and health concerns over the toxicity of lead, combined with global legislation to limit the use of Pb in manufactured products, have led to extensive research and development studies of lead-free solders. The Sn-Ag-Cu ternary eutectic alloy is considered to be one of the promising alternatives. Except for thermal properties, much research on several properties of Sn-Ag-Cu alloy has been performed. In this study, five Sn-xAg-0.5Cu alloys with variations of Ag content x of 1.0 mass%, 2.5 mass%, 3.0 mass%, 3.5 mass%, and 4.0 mass% were prepared, and their thermal diffusivity and specific heat were measured from room temperature to 150 °C, and the thermal conductivity was calculated using the measured thermal diffusivity, specific heat, and density values. Also, the linear thermal expansion was measured from room temperature to 170 °C. The results show that Sn-3.5Ag-0.5Cu is the best candidate because it has a maximum thermal conductivity and a low thermal expansion, which are the ideal conditions to be a proper packaging alloy for effective cooling and thermostability.

  4. Development of new multicomponent Sn–Ag–Cu–Bi lead-free solders for low-cost commercial electronic assembly

    Energy Technology Data Exchange (ETDEWEB)

    El-Daly, A.A., E-mail: dreldaly11@yahoo.com [Physics Department, Faculty of Science, Zagazig Univ., Zagazig (Egypt); Center of Nanotechnology, Zagazig Univ., Zagazig (Egypt); El-Taher, A.M. [Physics Department, Faculty of Science, Zagazig Univ., Zagazig (Egypt); Center of Nanotechnology, Zagazig Univ., Zagazig (Egypt); Gouda, S. [Physics Department, Faculty of Science, Zagazig Univ., Zagazig (Egypt)

    2015-04-05

    Highlights: • Small amounts of Bi have been added into Sn–1.5Ag–0.7Cu solder. • Bi reduced the undercooling and eutectic temperature of SAC257 solder. • Bi refined the microstructure and diminishes the nucleation rate of IMCs. • Bi increased the creep resistance and fracture lifetime of the solder. • Overall SAC properties can be improved adding not more than 3 wt.% Bi. - Abstract: Eutectic Sn–Ag–Cu (SAC) solder is one of the candidate alternatives to Sn–Pb-based solder alloys. The coupling effect of both minor alloying Bi addition and reducing the amount of Ag phase have been proposed as an important approach to optimize existing and to develop new SAC solders. Characteristics of new Sn–Ag–Cu–Bi solders were analyzed and compared with those of as-solidified Sn–1.5Ag–0.7Cu (SAC157) alloy. The results of differential scanning calorimetry (DSC) indicate significant reduction of both undercooling, eutectic temperature, solidus and liquidus temperatures with the addition of Bi into SAC(157) solder, although the pasty range remains the same or slightly increased. Moreover, SAC(157) solders containing Bi were found to have a higher creep resistance (126.1 times) than SAC(157) solder at the same stress level and testing temperature. The higher creep resistance was contributed by the solid solution and precipitations strengthen effects of Bi. The precipitation of these Bi atoms or particles can significantly refine the microstructure, blocks the movement of dislocations and increases the creep resistance of Bi-containing solders. The creep life time of plain SAC(157) alloy was extremely enlarged 23.7 times with the addition of 3 wt.% Bi. Constitutive Garofalo model of creep for both SAC(157) and Sn–Ag–Cu–Bi solders was assembled based on the experimental data.

  5. Solder joint technology materials, properties, and reliability

    CERN Document Server

    Tu, King-Ning

    2007-01-01

    Solder joints are ubiquitous in electronic consumer products. The European Union has a directive to ban the use of Pb-based solders in these products on July 1st, 2006. There is an urgent need for an increase in the research and development of Pb-free solders in electronic manufacturing. For example, spontaneous Sn whisker growth and electromigration induced failure in solder joints are serious issues. These reliability issues are quite complicated due to the combined effect of electrical, mechanical, chemical, and thermal forces on solder joints. To improve solder joint reliability, the science of solder joint behavior under various driving forces must be understood. In this book, the advanced materials reliability issues related to copper-tin reaction and electromigration in solder joints are emphasized and methods to prevent these reliability problems are discussed.

  6. Wave soldering with Pb-free solders

    Energy Technology Data Exchange (ETDEWEB)

    Artaki, I.; Finley, D.W.; Jackson, A.M.; Ray, U. [AT and T Bell Labs., Princeton, NJ (United States); Vianco, P.T. [Sandia National Labs., Albuquerque, NM (United States)

    1995-07-01

    The manufacturing feasibility and attachment reliability of a series of newly developed lead-free solders were investigated for wave soldering applications. Some of the key assembly aspects addressed included: wettability as a function of board surface finish, flux activation and surface tension of the molten solder, solder joint fillet quality and optimization of soldering thermal profiles. Generally, all new solder formulations exhibited adequate wave soldering performance and can be considered as possible alternatives to eutectic SnPb for wave soldering applications. Further process optimization and flux development is necessary to achieve the defect levels associated with the conventional SnPb process.

  7. Mechanical properties of FeCo magnetic particles-based Sn-Ag-Cu solder composites

    Science.gov (United States)

    Xu, Siyang; Prasitthipayong, Anya; Pickel, Andrea D.; Habib, Ashfaque H.; McHenry, Michael E.

    2013-06-01

    We demonstrate magnetic nanoparticles (MNPs) in enabling lead-free solder reflow in RF fields and improved mechanical properties that impact solder joint reliability. Here, we report on Sn-Ag-Cu (SAC) alloys. SAC solder-FeCo MNP composites with 0, 1, 2, 3, and 4 wt. % FeCo MNP and the use of AC magnetic fields to achieve localized reflow. Electron microscopy of the as-reflowed samples show a decrease in the volume of Sn dendrite regions as well as smaller and more homogeneously dispersed Ag3Sn intermetallic compounds (IMCs) with increasing MNP concentrations. Mechanical properties of the composites were measured by nanoindentation. In pure solder samples and solder composites with 4 wt. % MNP, hardness values increased from 0.18 GPa to 0.20 GPa and the modulus increased from 39.22 GPa to 71.22 GPa. The stress exponent, reflecting creep resistance, increased from 12.85 of pure solder to 16.47 for solder composites with 4 wt. % MNP. Enhanced mechanical properties as compared with the as-prepared solder joints are explained in terms of grain boundary and dispersion strengthening resulting from the microstructural refinement.

  8. Development of alternatives to lead-bearing solders

    Energy Technology Data Exchange (ETDEWEB)

    Vianco, P.T. [Sandia National Labs., Albuquerque, NM (United States)

    1993-07-01

    Soldering technology, using tin-lead alloys has had a significant role in the packaging of highly functional, low cost electronic devices. The elimination of lead from all manufactured products, whether through legislation or tax incentives, will impact the electronics community which uses lead-containing solders. In response to these proposed measures, the National Center for Manufacturing Sciences has established a multi-year program involving participants from industry, academia, and the national laboratories with the objective to identify potential replacements for lead-bearing solders. Selection of candidate alloys is based upon the analysis of materials properties, manufacturability, modeling codes for reliability prediction, as well as toxicological properties and resource availability, data developed in the program.

  9. Phase reaction of Au/Sn solder bonding for GaN-based vertical structure light emitting diodes

    Institute of Scientific and Technical Information of China (English)

    2010-01-01

    Au/Sn solder bonding on Si substrates was used to fabricate the GaN-based vertical structure light emitting diodes (VSLEDs). The phase reaction of Au/Sn solder under different bonding conditions was investigated by the measurement of electron back scattering diffraction (EBSD), and the characteristics of VSLED were analyzed by scanning acoustic microscope (SAM), Raman scattering, current-voltage (I-V) and light output-current (L-I) curves. After the bonding process, horizontal stripes of Au/Sn phase (δ phase) and Au5Sn phase (ζ phase) were redirected to vertical stripes, and δ phase tended to move to the solder joint. Sn interstitial diffusion led to the distribution of δ phase and voids in Au/Sn solder, which could be seen in SAM and SEM images. Vertical distribution of the δ phase and ζ phase with proper voids in the Au/Sn bonding layer showed the best bonding quality. Good bonding quality led to little shift of the E2-high mode of Raman spectra peak in GaN after laser lift off (LLO). It also caused more light extraction and forward bias reduction to 2.9 V at 20 mA.

  10. Soldering in electronics assembly

    CERN Document Server

    Judd, Mike

    2013-01-01

    Soldering in Electronics Assembly discusses several concerns in soldering of electronic assemblies. The book is comprised of nine chapters that tackle different areas in electronic assembly soldering. Chapter 1 discusses the soldering process itself, while Chapter 2 covers the electronic assemblies. Chapter 3 talks about solders and Chapter 4 deals with flux. The text also tackles the CS and SC soldering process. The cleaning of soldered assemblies, solder quality, and standards and specifications are also discussed. The book will be of great use to professionals who deal with electronic assem

  11. Electrodeposition of lead-free, tin-based alloy solder films

    Science.gov (United States)

    Han, Chunfen

    The dominant materials used for solders in electronic assemblies over the past 60 years have been Pb-Sn alloys. Increasing pressure from environmental and health authorities has stimulated the development of various Pb-free solders. Two of the most promising replacements are eutectic Sn-Cu and Sn-Ag-Cu alloys that are produced primarily by electrodeposition. During soldering and solid state aging (storage or in service of the electronic assemblies), interactions take place at the solder/substrate metal interface and form intermetallic compounds (IMCs) which are crucial for the reliability of the solder joints. Simple and "green" Sn-citrate and Sn-Cu-citrate solutions have been developed and optimized to electrodeposit eutectic and near eutectic Sn-Cu solder films. Sn-citrate suspensions with Cu particles and Sn-Cu-citrate suspensions with Ag nano-particles have also been developed and optimized to allow for electrochemical composite deposition of eutectic and near eutectic Sn-Cu and Sn-Ag-Cu solder films. Different plating and post-plating conditions, including solution concentration, current density, agitation, additives, and aging, have been investigated by evaluating their effects on plating rate, deposit composition and microstructure. Tri-ammonium citrate is used as the only complexing agent for Sn, Sn-Cu, and Sn-Ag-Cu deposition. Speciation diagram calculations, reduction potential calculations, and polarization studies are conducted to study Sn-citrate solution chemistry and the kinetics of Sn electrodeposition. X-ray photoelectron spectroscopy (XPS) analysis is used to identify the precipitates formed in Sn-citrate solutions at low pH. Current-controlled and potential-controlled electrochemical techniques, nucleation modeling, and surface morphology characterization techniques are applied to study the nucleation and film growth mechanism of Sn and Sn-Cu electrodeposition from Sn-citrate and Sn-Cu-citrate solutions. Reflow and aging tests for deposited Sn

  12. Laser soldering of Sn-Ag-Cu and Sn-Zn-Bi lead-free solder pastes

    Science.gov (United States)

    Takahashi, Junichi; Nakahara, Sumio; Hisada, Shigeyoshi; Fujita, Takeyoshi

    2004-10-01

    It has reported that a waste of an electronics substrate including lead and its compound such as 63Sn-37Pb has polluted the environment with acid rain. For that environment problem the development of lead-free solder alloys has been promoted in order to find out the substitute for Sn-Pb solders in the United States, Europe, and Japan. In a present electronics industry, typical alloys have narrowed down to Sn-Ag-Cu and Sn-Zn lead-free solder. In this study, solderability of Pb-free solder that are Sn-Ag-Cu and Sn-Zn-Bi alloy was studied on soldering using YAG (yttrium aluminum garnet) laser and diode laser. Experiments were peformed in order to determine the range of soldering parameters for obtaining an appropriate wettability based on a visual inspection. Joining strength of surface mounting chip components soldered on PCB (printed circuit board) was tested on application thickness of solder paste (0.2, 0.3, and 0.4 mm). In addition, joining strength characteristics of eutectic Sn-Pb alloy and under different power density were examined. As a result, solderability of Sn-Ag-Cu (Pb-free) solder paste are equivalent to that of coventional Sn-Pb solder paste, and are superior to that of Sn-Zn-Bi solder paste in the laser soldering method.

  13. The Lead-Free Solder Selection Method and Process Optimization Based on Design of Experiment

    Directory of Open Access Journals (Sweden)

    Wang Bing

    2013-07-01

    Full Text Available In the study, through researching the characteristic of the lead-free solder, we introduce the method of QFD (Quality Function Deployment to transform the demand of production properties and process into the technical demand of the lead-free solder, thus we could transform the demand concept of sampling into a concrete performance index. Finally we can obtain two parameters of the technological competitive power index and market competitive power index to evaluate performance of the lead-free solder through making a series of experiments. We utilize the design of experiment method to find out key parameter of process and the best collocation of parameter, which make the co planarity of tin ball descend to 149 from 178 and promote the process’s ability up to 95.2 from 85%.

  14. Role of grain orientation in the failure of Sn-based solder joints under thermomechanical fatigue

    Institute of Scientific and Technical Information of China (English)

    Jing HAN; Hongtao CHEN; Mingyu LI

    2012-01-01

    A small Pb-free solder joint exhibits an extremely strong anisotropy due to the bodycentered tetragonal (BCT) lattice structure of β-Sn.Grain orientations can significantly influence the failure mode of Pb-free solder joints under thermomechanical fatigue (TMF) due to the coefficient of thermal expansion (CTE) mismatch of β-Sn grains.The research work in this paper focused on the microstructure and damage evolution of Sn3.0Ag0.5Cu BGA packages as well as individual Sn3.5Ag solder joints without constraints introduced by the package structure under TMF tests.The microstructure and damage evolution in cross-sections of solder joints under thermomechanical shock tests were characterized using optical microscopy with cross-polarized light and scanning electron microscopy (SEM),and orientations of Sn grains were determined by orientation imaging microscopy (OIM).During TMF,obvious recrystallization regions were observed with different thermomechanical responses depending on Sn grain orientations.It indicates that substantial stresses can build up at grain boundaries,leading to significant grain boundary sliding.The results show that recrystallized grains prefer to nucleate along pre-existing high-angle grain boundaries and fatigue cracks tend to propagate intergranularly in recrystallized regions,leading to an accelerated damage after recrystallization.

  15. Die Soldering in Aluminium Die Casting

    Energy Technology Data Exchange (ETDEWEB)

    Han, Q.; Kenik, E.A.; Viswanathan, S.

    2000-03-15

    Two types of tests, dipping tests and dip-coating tests were carried out on small steel cylinders using pure aluminum and 380 alloy to investigate the mechanism of die soldering during aluminum die casting. Optical and scanning electron microscopy were used to study the morphology and composition of the phases formed during soldering. A soldering mechanism is postulated based on experimental observations. A soldering critical temperature is postulated at which iron begins to react with aluminum to form an aluminum-rich liquid phase and solid intermetallic compounds. When the temperature at the die surface is higher than this critical temperature, the aluminum-rich phase is liquid and joins the die with the casting during the subsequent solidification. The paper discusses the mechanism of soldering for the case of pure aluminum and 380 alloy casting in a steel mold, the factors that promote soldering, and the strength of the bond formed when soldering occurs. conditions, an aluminum-rich soldering layer may also form over the intermetallic layer. Although a significant amount of research has been conducted on the nature of these intermetallics, little is known about the conditions under which soldering occurs.

  16. Anomalous creep in Sn-rich solder joints

    Energy Technology Data Exchange (ETDEWEB)

    Song, Ho Geon; Morris Jr., John W.; Hua, Fay

    2002-03-15

    This paper discusses the creep behavior of example Sn-rich solders that have become candidates for use in Pb-free solder joints. The specific solders discussed are Sn-3.5Ag, Sn-3Ag-0.5Cu, Sn-0.7Cu and Sn-10In-3.1Ag, used in thin joints between Cu and Ni-Au metallized pads.

  17. 高强度无银铜基钎料的制备研究%Study on Preparation of High-strength Silver-free Copper Base Solder

    Institute of Scientific and Technical Information of China (English)

    杨凯珍; 易振华; 刘凤美; 向杰

    2009-01-01

    通过实验确定了Cu-5P为无银铜基钎料的基体,在此基础上添加Sn、Ni和其他微量元素,制备了性能指标超过含Ag量(质量分数)达5%的铜基钎料的新型无银铜基钎料.%This article selected Cu-5P as the matrix of silver-free copper based solder by experiment,on this basis, adding Sn, Ni and other trace elements, the new type of silver -free copper based solder was prepared,and it has better performance than the copper-based solder with 5% Ag.

  18. Size effects in tin-based lead-free solder joints: Kinetics of bond formation and mechanical characteristics

    Science.gov (United States)

    Abdelhadi, Ousama Mohamed Omer

    Continuous miniaturization of microelectronic interconnects demands smaller joints with comparable microstructural and structural sizes. As the size of joints become smaller, the volume of intermetallics (IMCs) becomes comparable with the joint size. As a result, the kinetics of bond formation changes and the types and thicknesses of IMC phases that form within the constrained region of the bond varies. This dissertation focuses on investigating combination effects of process parameters and size on kinetics of bond formation, resulting microstructure and the mechanical properties of joints that are formed under structurally constrained conditions. An experiment is designed where several process parameters such as time of bonding, temperature, and pressure, and bond thickness as structural chracteristic, are varied at multiple levels. The experiment is then implemented on the process. Scanning electron microscope (SEM) is then utilized to determine the bond thickness, IMC phases and their thicknesses, and morphology of the bonds. Electron backscatter diffraction (EBSD) is used to determine the grain size in different regions, including the bulk solder, and different IMC phases. Physics-based analytical models have been developed for growth kinetics of IMC compounds and are verified using the experimental results. Nanoindentation is used to determine the mechanical behavior of IMC phases in joints in different scales. Four-point bending notched multilayer specimen and four-point bending technique were used to determine fracture toughness of the bonds containing IMCs. Analytical modeling of peeling and shear stresses and fracture toughness in tri-layer four-point bend specimen containing intermetallic layer was developed and was verified and validated using finite element simulation and experimental results. The experiment is used in conjunction with the model to calculate and verify the fracture toughness of Cu6Sn5 IMC materials. As expected two different IMC phases

  19. Interfacial Reaction of Sn-Ag-Cu Lead-Free Solder Alloy on Cu: A Review

    Directory of Open Access Journals (Sweden)

    Liu Mei Lee

    2013-01-01

    Full Text Available This paper reviews the function and importance of Sn-Ag-Cu solder alloys in electronics industry and the interfacial reaction of Sn-Ag-Cu/Cu solder joint at various solder forms and solder reflow conditions. The Sn-Ag-Cu solder alloys are examined in bulk and in thin film. It then examines the effect of soldering conditions to the formation of intermetallic compounds such as Cu substrate selection, structural phases, morphology evolution, the growth kinetics, temperature and time is also discussed. Sn-Ag-Cu lead-free solder alloys are the most promising candidate for the replacement of Sn-Pb solders in modern microelectronic technology. Sn-Ag-Cu solders could possibly be considered and adapted in miniaturization technologies. Therefore, this paper should be of great interest to a large selection of electronics interconnect materials, reliability, processes, and assembly community.

  20. Organic solderability preservation evaluation. Topical report

    Energy Technology Data Exchange (ETDEWEB)

    Becka, G.A.; McHenry, M.R.; Slanina, J.T.

    1997-03-01

    An evaluation was conducted to determine the possible replacement of the hot air solder leveling (HASL) process used in the Allied Signal Federal Manufacturing & Technologies (FM&T) Printed Wiring Board Facility with an organic solderability preservative (OSP). The drivers for replacing HASL include (1) Eliminating lead from PWB fabrication processes; (2) Potential legislation restricting use of lead, (3) Less expensive processing utilizing OSP rather than HASL processing; (4) Avoiding solder dross disposal inherent with HASL processing, (5) OSP provides flat, planar surface required for surface mount technology product, and (6) Trend to thinner PWB designs. A reduction in the cost of nonconformance (CONC) due to HASL defects (exposed copper, solderability, dewetting and non-wetting) would be realized with the incorporation of the OSP process. Several supplier HASL replacement candidates were initially evaluated. One supplier chemistry was chosen for potential use in the FM&T PWB and assembly areas.

  1. Solder flow over fine line PWB surface finishes

    Energy Technology Data Exchange (ETDEWEB)

    Hosking, F.M.; Hernandez, C.L.

    1998-08-01

    The rapid advancement of interconnect technology has stimulated the development of alternative printed wiring board (PWB) surface finishes to enhance the solderability of standard copper and solder-coated surfaces. These new finishes are based on either metallic or organic chemistries. As part of an ongoing solderability study, Sandia National Laboratories has investigated the solder flow behavior of two azole-based organic solderability preservations, immersion Au, immersion Ag, electroless Pd, and electroless Pd/Ni on fine line copper features. The coated substrates were solder tested in the as-fabricated and environmentally-stressed conditions. Samples were processed through an inerted reflow machine. The azole-based coatings generally provided the most effective protection after aging. Thin Pd over Cu yielded the best wetting results of the metallic coatings, with complete dissolution of the Pd overcoat and wetting of the underlying Cu by the flowing solder. Limited wetting was measured on the thicker Pd and Pd over Ni finishes, which were not completely dissolved by the molten solder. The immersion Au and Ag finishes yielded the lowest wetted lengths, respectively. These general differences in solderability were directly attributed to the type of surface finish which the solder came in contact with. The effects of circuit geometry, surface finish, stressing, and solder processing conditions are discussed.

  2. Solder Joint Health Monitoring Testbed

    Science.gov (United States)

    Delaney, Michael M.; Flynn, James G.; Browder, Mark E.

    2009-01-01

    A method of monitoring the health of selected solder joints, called SJ-BIST, has been developed by Ridgetop Group Inc. under a Small Business Innovative Research (SBIR) contract. The primary goal of this research program is to test and validate this method in a flight environment using realistically seeded faults in selected solder joints. An additional objective is to gather environmental data for future development of physics-based and data-driven prognostics algorithms. A test board is being designed using a Xilinx FPGA. These boards will be tested both in flight and on the ground using a shaker table and an altitude chamber.

  3. On the synthesis of Bi-based precursors for lead-free solders development

    Directory of Open Access Journals (Sweden)

    Gandova V.

    2010-01-01

    Full Text Available Preliminary studies on the design of lead-free solders precursors by wet chemistry methods are presented. The main objective is to assess the impact of the way of hydroxide precipitates preparation on the metal elements content of the precipitates. Namely, ternary hydroxide mixtures of three systems: a. Cu(II, Bi(III, Sn(II; b. Cu(II, Bi(III, Sb(III; and c. Cu(II, Bi(III, Zn(II were prepared, firstly, by single-element precipitation and, secondly, by co-precipitation. Thereafter, all mixtures were reduced by using hydrogen gas. Both, the initial mixtures and the reduced samples were studied by X-ray diffraction, optical and scanning electron microscopes. The chemical compositions of the precipitates were determined experimentally and their dependence on the pH was verified. It was found that alloying occurred during the reduction procedure, but in some cases the reduction was not complete (i.e. oxide phases rest in the samples. This might be a huge obstacle to use such an approach for the preparation of lead-free solders. Moreover, the materials obtained after reductions apparently are bulk alloys, thus, the preparation of small-sized metal particles would be a challenge. Another key feature to be addressed in future studies is the correlation between the chemical compositions of the parent solution and these of the corresponding precipitates.

  4. Reduced oxide soldering activation (ROSA) PWB solderability testing

    Energy Technology Data Exchange (ETDEWEB)

    Hernandez, C.L.; Hosking, F.M. [Sandia National Labs., Albuquerque, NM (United States). Physical and Joining Metallurgy Dept.; Reed, J. [Texas Instruments, Austin, TX (United States); Tench, D.M.; White, J. [Rockwell Science Center, Thousand Oaks, CA (United States)

    1996-02-01

    The effect of ROSA pretreatment on the solderability of environmentally stressed PWB test coupons was investigated. The PWB surface finish was an electroplated, reflowed solder. Test results demonstrated the ability to recover plated-through-hole fill of steam aged samples with solder after ROSA processing. ROSA offers an alternative method for restoring the solderability of aged PWB surfaces.

  5. Thermal Analysis of the Sn-Ag-Cu-In Solder Alloy

    DEFF Research Database (Denmark)

    Sopousek, J.; Palcut, Marián; Hodúlová, Erika

    2010-01-01

    The tin-based alloy Sn-1.5Ag-0.7Cu-9.5In (composition in wt.%) is a potential candidate for lead-free soldering at temperatures close to 200°C due to the significant amount of indium. Samples of Sn-1.5Ag-0.7Cu-9.5In were prepared by controlled melting of the pure elements, followed by quenching...

  6. Effect of Ag on Sn–Cu and Sn–Zn lead free solders

    Directory of Open Access Journals (Sweden)

    Alam S.N.

    2015-06-01

    Full Text Available Lead and lead-containing compounds are considered as toxic substances due to their detrimental effect on the environment. Sn-based soldering systems, like Sn-Cu and Sn-Zn are considered as the most promising candidates to replace the eutectic Sn-Pb solder compared to other solders because of their low melting temperature and favorable properties. Eutectic Sn-0.7 wt.% Cu and near eutectic composition Sn-8 wt.% Zn solders have been considered here for study. For the Sn-Cu system, besides the eutectic Sn-0.7 wt.% Cu composition, Sn-1Cu and Sn-2Cu were studied. Three compositions containing Ag: Sn-2Ag-0.7Cu, Sn-2.5Ag-0.7Cu and Sn-4.5Ag-0.7Cu were also developed. Ag was added to the eutectic Sn-0.7 wt.% Cu composition in order to reduce the melting temperature of the eutectic alloy and to enhance the mechanical properties. For the Sn-Zn system, besides the Sn-8 wt.% Zn near eutectic composition, Sn-8Zn-0.05Ag, Sn-8Zn-0.1Ag and Sn-8Zn-0.2Ag solder alloys were developed. The structure and morphology of the solder alloys were analyzed using a scanning electron microscope (SEM, filed emission scanning electron microscope (FESEM, electron diffraction X-ray spectroscopy (EDX and X-ray diffraction (XRD. Thermal analysis of the alloys was also done using a differential scanning calorimeter (DSC. Trace additions of Ag have been found to significantly reduce the melting temperature of the Sn-0.7 wt.% Cu and Sn-8 wt.% Zn alloys.

  7. PWB solder wettability after simulated storage

    Energy Technology Data Exchange (ETDEWEB)

    Hernandez, C.L.; Hosking, F.M.

    1996-03-01

    A new solderability test method has been developed at Sandia National Laboratories that simulates the capillary flow physics of solders on circuit board surfaces. The solderability test geometry was incorporated on a circuit board prototype that was developed for a National Center for Manufacturing Sciences (NCMS) program. The work was conducted under a cooperative research and development agreement between Sandia National Laboratories, NCMS, and several PWB fabricators (AT&T, IBM, Texas Instruments, United Technologies/Hamilton Standard and Hughes Aircraft) to advance PWB interconnect technology. The test was used to investigate the effects of environmental prestressing on the solderability of printed wiring board (PWB) copper finishes. Aging was performed in a controlled chamber representing a typical indoor industrial environment. Solderability testing on as-fabricated and exposed copper samples was performed with the Sn-Pb eutectic solder at four different reflow temperatures (215, 230, 245 and 260{degrees}C). Rosin mildly activated (RMA), low solids (LS), and citric acid-based (CA) fluxes were included in the evaluation. Under baseline conditions, capillary flow was minimal at the lowest temperatures with all fluxes. Wetting increased with temperature at both baseline and prestressing conditions. Poor wetting, however, was observed at all temperatures with the LS flux. Capillary flow is effectively restored with the CA flux.

  8. Influences of fine pitch solder joint shape parameters on fatigue life under thermal cycle

    Institute of Scientific and Technical Information of China (English)

    HUANG Chun-yue; WU Zhao-hua; HUANG Hong-yan; ZHOU De-jian

    2005-01-01

    The solder joint reliability of a 0. 5 mm lead pitch, 240-pin quad flat package(QFP) was studied by nonlinear finite element analysis(FEA). The stress/strain distributions within the solder joints and the maximum plastic strain range of the solder joints were determined. Based on the calculated maximum plastic strain range the thermal fatigue life of the solder joints was calculated using Coffin-Manson equation. The influences of shape parameters including volume of solder joint, pad size and stand-off on the thermal fatigue life of the solder joints were also studied. The results show that the stress and strain distribution in the solder joint are not uniform; the interface between the lead and the solder joint is the high stress and strain region; the maximum stress and stain occur at the topmost point where the solder joint intersects with the inner side of the lead. The solder joint cracks should occur firstly at this point and propagate along the interface between the solder and the lead. The solder joint with the pad size of 1.25 mm× 0.35 mm, the stand-off of 0.02 mm and the solder volume of 0. 026 mm3 has longer fatigue life than that of any others. These optimal parameters have been applied in practice to assemble the 240-pin, 0.5 mm pitch QFP.

  9. Characterization of Low-Melting-Point Sn-Bi-In Lead-Free Solders

    Science.gov (United States)

    Li, Qin; Ma, Ninshu; Lei, YongPing; Lin, Jian; Fu, HanGuang; Gu, Jian

    2016-11-01

    Development of lead-free solders with low melting temperature is important for substitution of Pb-based solders to reduce direct risks to human health and the environment. In the present work, Sn-Bi-In solders were studied for different ratios of Bi and Sn to obtain solders with low melting temperature. The microstructure, thermal properties, wettability, mechanical properties, and reliability of joints with Cu have been investigated. The results show that the microstructures of the Sn-Bi-In solders were composed of β-Sn, Bi, and InBi phases. The intermetallic compound (IMC) layer was mainly composed of Cu6Sn5, and its thickness increased slightly as the Bi content was increased. The melting temperature of the solders was around 100°C to 104°C. However, when the Sn content exceeded 50 wt.%, the melting range became larger and the wettability became worse. The tensile strength of the solder alloys and solder joints declined with increasing Bi content. Two fracture modes (IMC layer fracture and solder/IMC mixed fracture) were found in solder joints. The fracture mechanism of solder joints was brittle fracture. In addition, cleavage steps on the fracture surface and coarse grains in the fracture structure were comparatively apparent for higher Bi content, resulting in decreased elongation for both solder alloys and solder joints.

  10. High temperature solder alloys for underhood applications: Final report

    Energy Technology Data Exchange (ETDEWEB)

    Kern, J.A. [Univ. of New Mexico, Albuquerque, NM (United States). Dept. of Mechanical Engineering; Drewien, C.A.; Yost, F.G.; Sackinger, S. [Sandia National Laboratories, Albuquerque, NM (United States); Weiser, M.W. [Johnson-Mathey Electronics Corp., Spokane, WA (United States)

    1996-06-01

    In this continued study, the microstructural evolution and peel strength as a function of thermal aging were evaluated for four Sn-Ag solders deposited on double layered Ag-Pt metallization. Additionally, activation energies for intermetallic growth over the temperature range of 134 to 190{degrees}C were obtained through thickness measurements of the Ag-Sn intermetallic that formed at the solder-metallization interface. It was found that Bi-containing solders yielded higher activation energies for the intermetallic growth, leading to thicker intermetallic layers at 175 and 190{degrees}C for times of 542 and 20.5 hrs, respectively, than the solders free of Bi. Complete reaction of the solder with the metallization occurred and lower peel strengths were measured on the Bi-containing solders. In all solder systems, a Ag-Sn intermetallic thickness of greater than {approximately}7 {mu}m contributed to lower peel strength values. The Ag-Sn binary eutectic composition and the Ag-Sn-Cu ternary eutectic composition solders yielded lower activation energies for intermetallic formation, less microstructural change with time, and higher peel strengths; these solder systems were resilient to the effects of temperatures up to 175{degrees}C. Accelerated isothermal aging studies provide useful criteria for recommendation of materials systems. The Sn-Ag and Sn-Ag-Cu eutectic compositions should be considered for future service life and reliability studies based upon their performance in this study.

  11. Dissolution and Interface Reactions between Palladium and Tin(Sn)-Based Solders: Part II. 63Sn-37Pb Alloy

    Science.gov (United States)

    Vianco, Paul T.; Rejent, Jerome A.; Zender, Gary L.; Hlava, Paul F.

    2010-12-01

    The interface microstructures as well as the rate kinetics of dissolution and intermetallic compound (IMC) layer formation were investigated for couples formed between molten 63Sn-37Pb (wt pct) solder and 99.9 pct Pd sheet. The solder bath temperatures were 488 K to 593 K (215 °C to 320 °C), and the immersion times were 5, 15, 30, 60, 120, and 240 seconds. The predominant IMC phases were Pd(Sn, Pb)4, PdSn4, and PdSn3. The IMC layer microstructure contained these phases and varying amounts of solder Pb- and Sn-rich phases. Isolated Pd-Sn needles appeared in the solder field at temperatures and times of ≥563 K (290 °C) and ≥30 seconds, respectively. Palladium dissolution was largely monotonic as a function of time and solder temperature, except for a sharp decline at 593 K (320 °C). The dissolution rate kinetics over 488 K to 563 K (215 °C to 290 °C) were represented by the At n exp(-Δ H/R T) equation. The values of n and Δ H were 0.67 ± 0.19 and 48 ± 20 kJ/mol, respectively, suggesting that a combination of interface reaction and solid-state mass transport processes controlled dissolution. The IMC layer grew monotonically with time and solder temperature, except at 593 K (320 °C) where growth dropped off significantly. The IMC growth rate kinetics over 488 K to 563 K (215 °C to 290 °C) exhibited values of n and Δ H equal to 0.88 ± 0.10 and 64 ± 10 kJ/mol, respectively, indicating a combination of interface reaction and solid-state diffusion processes. The extents of Pd dissolution and IMC layer development were significantly greater for molten Sn-Pb solder than the Pb-free Sn-Ag-Cu solder (Part I study) at a given test temperature.

  12. Optimization of the Ni(P) Thickness for an Ultrathin Ni(P)-Based Surface Finish in Soldering Applications

    Science.gov (United States)

    Ho, C. E.; Wang, S. J.; Fan, C. W.; Wu, W. H.

    2014-01-01

    The effects of the Ni(P) thickness δ Ni(P) on the interfacial reaction between an Sn-3Ag-0.5Cu solder and an Au/Pd(P)/Ni(P)/Cu pad (thickness: 0.05/0.05/0.1-0.3/20 μm) and the resulting mechanical properties were investigated using scanning electron microscopy equipped with an electron backscatter diffraction system, a focused ion beam system, electron probe microanalysis, and high-speed ball shear (HSBS) testing. Regardless of δ Ni(P), all of the Au/Pd(P)/Ni(P) surface finishes examined were completely exhausted in one reflow, exposing the Cu pad underneath the solder. Cu6Sn5 dissolved with various Ni contents, termed (Cu,Ni)6Sn5, was the dominant intermetallic compound (IMC) species at the solder/Cu interface. Additionally, Ni2SnP and Ni3P IMCs might form with the (Cu,Ni)6Sn5 in the thick Ni(P) case, i.e., δ Ni(P) = 0.3 μm, and the two IMCs (Ni2SnP and Ni3P) were gradually eliminated from the interface after multiple reflows. A mass balance analysis indicated that the growth of the Ni-containing IMCs, rather than the dissolution of the metallization pad, played a key role in the Ni(P) exhaustion. The HSBS test results indicated that the mechanical strength of the solder joints was also δ Ni(P) dependent. The combined results of the interfacial reaction and the mechanical evaluation provided the optimal δ Ni(P) value for soldering applications.

  13. Surface tension and reactive wetting in solder connections

    Energy Technology Data Exchange (ETDEWEB)

    Wedi, Andre; Schmitz, Guido [Institut fuer Materialphysik, Westf. Wilhelms-Universitaet, Wilhelm-Klemm-Strasse 10, 48149 Muenster (Germany)

    2011-07-01

    Wetting is an important pre-requisite of a reliable solder connection. However, it is only an indirect measure for the important specific energy of the reactive interface between solder and base metallization. In order to quantify this energy, we measured wetting angles of solder drops as well as surface tension of SnPb solders under systematic variation of composition and gaseous flux at different reflow temperatures. For the latter, we used the sessile drop method placing a solder drop on a glas substrate. From the two independent data sets, the important energy of the reactive interface is evaluated based on Young's equation. Remarkably, although both, the tension between the solder and flux and the wetting angle, reveal significant dependence on solder composition. So the adhesion energy reveals distinguished plateaus which are related to different reaction products in contact to the solder. TEM analysis and calculations of phase stabilities show that there is no Cu6Sn5 for high lead concentrations. The experiments confirm a model of reactive wetting by Eustathopoulos.

  14. A Study of Solder Alloy Ductility for Cryogenic Applications

    Science.gov (United States)

    Lupinacci, A.; Shapiro, A. A.; Suh, J-O.; Minor, A. M.

    2013-01-01

    For aerospace applications it is important to understand the mechanical performance of components at the extreme temperature conditions seen in service. For solder alloys used in microelectronics, cryogenic temperatures can prove problematic. At low temperatures Sn-based solders undergo a ductile to brittle transition that leads to brittle cracks, which can result in catastrophic failure of electronic components, assemblies and spacecraft payloads. As industrial processes begin to move away from Pb-Sn solder, it is even more critical to characterize the behavior of alternative Sn-based solders. Here we report on initial investigations using a modified Charpy test apparatus to characterize the ductile to brittle transformation temperature of nine different solder systems.

  15. Microstructural Evolution of Lead-Free Solder Joints in Ultrasonic-Assisted Soldering

    Science.gov (United States)

    Ji, Hongjun; Wang, Qiang; Li, Mingyu

    2016-01-01

    Solder joint reliability greatly depends on the microstructure of the solder matrix and the morphology of intermetallic compounds (IMCs) in the joints. Addition of strengthening phases such as carbon nanotubes and ceramic particles to solder joints to improve their properties has been widely studied. In this work, ultrasonic vibration (USV) of casting ingots was applied to considerably improve their microstructure and properties, and the resulting influence on fluxless soldering of Cu/Sn-3.0Ag-0.5Cu/Cu joints and their microstructural evolution was investigated. It was demonstrated that USV application during reflow of Sn-based solder had favorable effects on β-Sn grain size refinement as well as the growth and distribution of various IMC phases within the joints. The β-Sn grain size was significantly refined as the ultrasound power was increased, with a reduction of almost 90% from more than 100 μm to below 10 μm. Long and large Cu6Sn5 tubes in the solder matrix of the joints were broken into tiny ones. Needle-shaped Ag3Sn was transformed into flake-shaped. These IMCs were mainly precipitated along β-Sn phase boundaries. High-temperature storage tests indicated that the growth rate of interfacial IMCs in joints formed with USV was slower than in conventional reflow joints. The mechanisms of grain refinement and IMC fragmentation are discussed and related to the ultrasonic effects.

  16. Influence of Adding Alloying Element on Properties of Tin-based Lead-free Solder%合金元素添加对锡基无铅钎料性能的影响

    Institute of Scientific and Technical Information of China (English)

    周俊生; 池水莲; 修建国

    2012-01-01

    对现阶段常用的无铅钎料进行了综合分析和概括评述,总结了各种钎料的特点和存在的缺陷,重点介绍了Ag、Bi、RE、Ni、Cu、In、Sb、Al、P、Ga等合金元素添加对Sn基无铅钎料性能的影响,并分析了利弊所在,为新型无铅钎料的研发提供了参考依据.%With the propulsion of lead-free process, a new kind of lead-free solders emerges. The typical lead-free solders in these days was analyzed and generally reviewed. The characteristic and defects of these solders were summarized. The influences of Ag, Bi, RE, Ni, Cu, In, Sb, Al, P and Ga alloying elements on the properties of tin-based lead-free solder were analyzed, and then the advantages and disadvantages were analyzed. The reference for the research of new lead-free solder was offered.

  17. 一种基于焊点形态的可焊性分析方法%A solderability analysis method based on the form of welding spot

    Institute of Scientific and Technical Information of China (English)

    张智畅

    2014-01-01

    通过扫描电镜对润湿不良(不充分)焊盘进行分析,背散射电子图像下在焊料润湿边界处可观察到一条带状区域,在此称之为润湿过渡层。经过大量观察分析发现润湿过渡层是焊料在焊盘表面润湿焊接界面反应的起始位置,因而其形态随着焊接条件以及焊盘的状态变化而变化。文章通过对回流贴装焊接过程中回流温度、老化引起的润湿过渡层形态差异变化的分析,总结出通过润湿过渡层形态观察对被焊面润湿性进行焊接后评估的方法,为可焊性失效分析提供新的分析思路。%In the backscattered electron image of scanning electron microscopy (SEM), a strip zone can be observed at the solder wetting boundaries of the poor wetting pads after delfux. It is the starting position of the interface reaction in the welding process, so the form of the wetting transition layer changes with the condition changes of relfow process and the pads. In this paper, based on the analysis of the different forms of the wetting transition layer formed in different relfow temperature or PCB aging condition in relfow process, a new method for judging the wetting ability after soldering was established and a new way for solderability failure analysis was provided.

  18. Effect of silver and indium addition on mechanical properties and indentation creep behavior of rapidly solidified Bi-Sn based lead-free solder alloys

    Energy Technology Data Exchange (ETDEWEB)

    Shalaby, Rizk Mostafa, E-mail: rizk1969@yahoo.co.uk [Mansoura University, Metal Physics Lab., Physics Department, Faculty of Science, Al-Gomhouria Street, Mansoura, P.O.Box 35516 (Egypt)

    2013-01-10

    Mechanical properties and indentation creep of the melt-spun process Bi-42 wt%Sn, Bi-40 wt%Sn-2 wt%In, Bi-40 wt%Sn-2 wt%Ag and Bi-38 wt%Sn-2 wt%In-2 wt%Ag were studied by dynamic resonance technique and Vickers indentation testing at room temperature and compared to that of the traditional Sn-37 wt%Pb eutectic alloy. The results show that the structure of Bi-42 wt%Sn alloy is characterized by the presence of rhombohedral Bi and body centered tetragonal {beta}-Sn. The two ternary alloys exhibit additional constituent phases of intermetallic compounds SnIn{sub 19} for Bi-40 wt%Sn-2 wt%In and {epsilon}-Ag{sub 3}Sn for Bi-40 wt%Sn-2 wt%Ag alloys. Attention has been paid to the role of intermetallic compounds on mechanical and creep behavior. The In and Ag containing solder alloy exhibited a good combination of higher creep resistance, good mechanical properties and lower melting temperature as compared with Pb-Sn eutectic solder alloy. This was attributed to the strengthening effect of Bi as a strong solid solution element in the Sn matrix and formation of intermetallic compounds {beta}-SnBi, {epsilon}-Ag{sub 3}Sn and InSn{sub 19} which act as both strengthening agent and grain refiner in the matrix of the material. Addition of In and Ag decreased the melting temperature of Bi-Sn lead-free solder from 143 Degree-Sign C to 133 Degree-Sign C which was possible mainly due to the existence of InSn{sub 19} and Ag{sub 3}Sn intermetallic compounds. Elastic constants, internal friction and thermal properties of Bi-Sn based alloys have been studied and analyzed.

  19. Creep properties of Pb-free solder joints

    Energy Technology Data Exchange (ETDEWEB)

    Song, H.G.; Morris Jr., J.W.; Hua, F.

    2002-04-01

    Describes the creep behavior of three Sn-rich solders that have become candidates for use in Pb-free solder joints: Sn-3.5Ag, Sn-3Ag-0.5Cu and Sn-0.7Cu. The three solders show the same general behavior when tested in thin joints between Cu and Ni/Au metallized pads at temperatures between 60 and 130 C. Their steady-state creep rates are separated into two regimes with different stress exponents(n). The low-stress exponents range from {approx}3-6, while the high-stress exponents are anomalously high (7-12). Strikingly, the high-stress exponent has a strong temperature dependence near room temperature, increasing significantly as the temperature drops from 95 to 60 C. The anomalous creep behavior of the solders appears to be due to the dominant Sn constituent. Joints of pure Sn have stress exponents, n, that change with stress and temperature almost exactly like those of the Sn-rich solder joints. Research on creep in bulk samples of pure Sn suggests that the anomalous temperature dependence of the stress exponent may show a change in the dominant mechanism of creep. Whatever its source, it has the consequence that conventional constitutive relations for steady-state creep must be used with caution in treating Sn-rich solder joints, and qualification tests that are intended to verify performance should be carefully designed.

  20. Mechanical properties of QFP micro-joints soldered with lead-free solders using diode laser soldering technology

    Institute of Scientific and Technical Information of China (English)

    HAN Zong-jie; XUE Song-bai; WANG Jian-xin; ZHANG Xin; ZHANG Liang; YU Sheng-lin; WANG Hui

    2008-01-01

    Soldering experiments of quad flat package(QFP) devices were carried out by means of diode laser soldering system with Sn-Ag-Cu and Sn-Cu-Ni lead-free solders, and competitive experiments were also carried out not only with Sn-Pb eutectic solders but also with infrared reflow soldering method. The results indicate that under the conditions of laser continuous scanning mode as well as the fixed laser soldering time, an optimal power exists, while the optimal mechanical properties of QFP micro-joints are gained. Mechanical properties of QFP micro-joints soldered with laser soldering system are better than those of QFP micro-joints soldered with IR reflow soldering method. Fracture morphologies of QFP micro-joints soldered with laser soldering system exhibit the characteristic of tough fracture, and homogeneous and fine dimples appear under the optimal laser output power.

  1. Hexagonal-Rod Growth Mechanism and Kinetics of the Primary Cu6Sn5 Phase in Liquid Sn-Based Solder

    Science.gov (United States)

    Zhang, Z. H.; Cao, H. J.; Yang, H. F.; Li, M. Y.; Yu, Y. X.

    2016-11-01

    A hexagonal-rod growth mechanism is proposed to describe the growth behavior of the primary Cu6Sn5 phase in liquid Sn-based solder. After Sn-6.5 at.%Cu solder had been maintained at 250°C for 10 h, a large number of hexagonal-rod-type Cu6Sn5 grains were found to have separated within it. Our observations show that these hexagonal rods had side facets in the { 10overline{1} 0}_{η } family and round ends close to the {0002}η family. Moreover, the nucleation of the hexagonal rods was studied, and the corresponding growth kinetics found to be governed by a Cu-supply-controlled mechanism rather than an interfacial-reaction-controlled or Cu-diffusion-limited mechanism. More importantly, the anisotropic growth of the Cu6Sn5 phase was confirmed to be the dominant reason for production of these primary hexagonal rods with high aspect ratio. This may represent an avenue for synthesis of nanosized Cu6Sn5 single crystals for use as anode materials in lithium-ion batteries. Additionally, our Cu6Sn5 hexagonal-rod growth mechanism may provide insight into morphological and kinetic studies on interfacial Cu6Sn5 grains and similar intermetallics.

  2. Fuzzy Logic Based Trusted Candidate Selection for Stable Multipath Routing

    Directory of Open Access Journals (Sweden)

    Sujata V. Mallapur

    2015-05-01

    Full Text Available In mobile ad hoc networks (MANETs, providing reliable and stable communication paths between wireless devices is critical. This paper presents a fuzzy logic stablebackbone-based multipath routing protocol (FLSBMRP for MANET that provides a high-quality path for communication between nodes. The proposed protocol has two main phases. The first phase is the selection of candidate nodes using a fuzzy logic technique. The second phase is the construction of a routing backbone that establishes multiple paths between nodes through the candidate nodes, thus forming a routing backbone. If any candidate node in the path fails due to a lack of bandwidth, residual energy or link quality, an alternate path through another candidate node is selected for communication before the route breaks, because a candidate node failure may lead to a broken link between the nodes. Simulation results demonstrate that the proposed protocol performs better in terms of the packet delivery ratio, overhead, delay and packet drop ratio than the major existing ad hoc routing protocols.

  3. Capillary flow solder wettability test

    Energy Technology Data Exchange (ETDEWEB)

    Vianco, P.T.; Rejent, J.A.

    1996-01-01

    A test procedure was developed to assess the capillary flow wettability of solders inside of a confined geometry. The test geometry was comprised of two parallel plates with a controlled gap of constant thickness (0.008 cm, 0.018 cm, 0.025 cm, and 0.038 cm). Capillary flow was assessed by: (1) the meniscus or capillary rise of the solder within the gap, (2) the extent of void formation in the gap, and (3) the time-dependence of the risen solder film. Tests were performed with the lead-free solders.

  4. Soldering of Nanotubes onto Microelectrodes

    DEFF Research Database (Denmark)

    Madsen, Dorte Nørgaard; Mølhave, Kristian; Mateiu, Ramona Valentina;

    2003-01-01

    Suspended bridges of individual multiwalled carbon nanotubes were fabricated inside a scanning electron microscope by soldering the nanotube onto microelectrodes with highly conducting gold-carbon material. By the decomposition of organometallic vapor with the electron beam, metal-containing solder...... bonds were formed at the intersection of the nanotube and the electrodes. Current-voltage curves indicated metallic conduction of the nanotubes, with resistances in the range of 9-29 kOmega. Bridges made entirely of the soldering material exhibited resistances on the order of 100 Omega, and the solder...... bonds were consistently found to be mechanically stronger than the carbon nanotubes....

  5. Oxidation and reduction kinetics of eutectic SnPb, InSn, and AuSn: a knowledge base for fluxless solder bonding applications

    DEFF Research Database (Denmark)

    Kuhmann, Jochen Friedrich; Preuss, A.; Adolphi, B.;

    1998-01-01

    For microelectronics and especially for upcoming new packaging technologies in micromechanics and photonics fluxless, reliable and economic soldering technologies are needed. In this article, we consequently focus on the oxidation and reduction kinetics of three commonly used eutectic solder allo...... and reflowed AuSn(80/20) and SnPb(60/40) after the introduction of H2...

  6. In situ measurement of electromigration-induced transient stress in Pb-free Sn-Cu solder joints by synchrotron radiation based X-ray polychromatic microdiffraction

    Energy Technology Data Exchange (ETDEWEB)

    Chen, Kai; Tamura, Nobumichi; Kunz, Martin; Tu, King-Ning; Lai, Yi-Shao

    2009-05-15

    Electromigration-induced hydrostatic elastic stress in Pb-free SnCu solder joints was studied by in situ synchrotron X-ray white beam microdiffraction. The elastic stresses in two different grains with similar crystallographic orientation, one located at the anode end and the other at the cathode end, were analyzed based on the elastic anisotropy of the {beta}-Sn crystal structure. The stress in the grain at the cathode end remained constant except for temperature fluctuations, while the compressive stress in the grain at the anode end was built-up as a function of time during electromigration until a steady state was reached. The measured compressive stress gradient between the cathode and the anode is much larger than what is needed to initiate Sn whisker growth. The effective charge number of {beta}-Sn derived from the electromigration data is in good agreement with the calculated value.

  7. In situ measurement of electromigration-induced transient stress in Pb-free Sn-Cu solder joints by synchrotron radiation based X-ray polychromatic microdiffraction

    Energy Technology Data Exchange (ETDEWEB)

    Chen, Kai; Tamura, Nobumichi; Kunz, Martin; Tu, King-Ning; Lai, Yi-Shao

    2009-12-01

    Electromigration-induced hydrostatic elastic stress in Pb-free SnCu solder joints was studied by in situ synchrotron X-ray white beam microdiffraction. The elastic stresses in two different grains with similar crystallographic orientation, one located at the anode end and the other at the cathode end, were analyzed based on the elastic anisotropy of the Beta-Sn crystal structure. The stress in the grain at the cathode end remained constant except for temperature fluctuations, while the compressive stress in the grain at the anode end was built-up as a function of time during electromigration until a steady state was reached. The measured compressive stress gradient between the cathode and the anode is much larger than what is needed to initiate Sn whisker growth. The effective charge number of Beta-Sn derived from the electromigration data is in good agreement with the calculated value.

  8. Closure of incision in cataract surgery in-vivo using a temperature controlled laser soldering system based on a 1.9μm semiconductor laser

    Science.gov (United States)

    Gabay, Ilan; Basov, Svetlana; Varssano, David; Barequet, Irina; Rosner, Mordechai; Rattunde, Marcel; Wagner, Joachim; Platkov, Max; Harlev, Mickey; Rossman, Uri; Katzir, Abraham

    2016-03-01

    In phacoemulsification-based cataract surgery, a corneal incision is made and is then closed by hydration of the wound lips, or by suturing. We developed a system for sealing such an incision by soldering with a semiconductor disk laser (λ=1.9μm), under close temperature control. The goal was to obtain stronger and more watertight adhesion. The system was tested on incisions in the corneas of 15 eyes of pigs, in-vivo. Optical Coherent Tomography (OCT) and histopathologic examination showed little thermal damage and good apposition. The measured average burst pressure was 1000+/-30mmHg. In the future, this method wound may replace suturing of corneal wounds, including in traumatic corneal laceration and corneal transplantation.

  9. An equivalent impedance model for lead-free solder joints based on crack propagation%基于裂纹扩展的无铅焊点阻抗等效模型

    Institute of Scientific and Technical Information of China (English)

    蒋礼; 伍晓霞; 潘毅; 张健

    2011-01-01

    After a case study on single solder joint, an equivalent impedance model was established for lead-free solder joints based on the crack propagation and skin effect of the joint, and the way to calculate the parameters included in the model was introduced. Simulation was then performed using the Matlab software. The results show that with the crack propagation, the impedance of solder joints changes slowly first and then abruptly. And, the higher the signal frequency is, the earlier the abrupt change takes place. At a frequency of 500 MHz, the abrupt change of impedance occurs when the area of crack is about 75% of the cross section of solder joint; while the DC resistance only changes sharply right before the failure of solder joint.%以单个无铅焊点为研究对象,根据裂纹扩展及趋肤效应建立了无铅焊点的阻抗等效模型,给出了模型参数的计算方法,并用Matlab软件对模型进行了仿真.结果表明:随裂纹扩展,焊点阻抗经历了一个由缓慢变化到突变的过程,且信号频率越高,阻抗突变时间越早;在500 MHz信号作用下,当裂纹面积约为焊点横截面的75%时,焊点阻抗便发生突变,而直流电阻则在焊点临近断裂时才有较大的变化.

  10. Corrosive microenvironments at lead solder surfaces arising from galvanic corrosion with copper pipe.

    Science.gov (United States)

    Nguyen, Caroline K; Stone, Kendall R; Dudi, Abhijeet; Edwards, Marc A

    2010-09-15

    As stagnant water contacts copper pipe and lead solder (simulated soldered joints), a corrosion cell is formed between the metals in solder (Pb, Sn) and the copper. If the resulting galvanic current exceeds about 2 μA/cm(2), a highly corrosive microenvironment can form at the solder surface, with pH galvanic currents, preventing passivation of the solder surface, and contributing to lead contamination of potable water supplies. The total mass of lead corroded was consistent with predictions based on the galvanic current, and lead leaching to water was correlated with galvanic current. If the concentration of sulfate in the water increased relative to chloride, galvanic currents and associated lead contamination could be greatly reduced, and solder surfaces were readily passivated.

  11. Speeding disease gene discovery by sequence based candidate prioritization

    Directory of Open Access Journals (Sweden)

    Porteous David J

    2005-03-01

    Full Text Available Abstract Background Regions of interest identified through genetic linkage studies regularly exceed 30 centimorgans in size and can contain hundreds of genes. Traditionally this number is reduced by matching functional annotation to knowledge of the disease or phenotype in question. However, here we show that disease genes share patterns of sequence-based features that can provide a good basis for automatic prioritization of candidates by machine learning. Results We examined a variety of sequence-based features and found that for many of them there are significant differences between the sets of genes known to be involved in human hereditary disease and those not known to be involved in disease. We have created an automatic classifier called PROSPECTR based on those features using the alternating decision tree algorithm which ranks genes in the order of likelihood of involvement in disease. On average, PROSPECTR enriches lists for disease genes two-fold 77% of the time, five-fold 37% of the time and twenty-fold 11% of the time. Conclusion PROSPECTR is a simple and effective way to identify genes involved in Mendelian and oligogenic disorders. It performs markedly better than the single existing sequence-based classifier on novel data. PROSPECTR could save investigators looking at large regions of interest time and effort by prioritizing positional candidate genes for mutation detection and case-control association studies.

  12. Creep Behavior of Lead-Free Sn-Ag-Cu + Ni-Ge Solder Alloys

    Science.gov (United States)

    Hidaka, N.; Watanabe, H.; Yoshiba, M.

    2009-05-01

    We developed a new lead-free solder alloy, an Sn-Ag-Cu base to which a small amount of Ni and Ge is added, to improve the mechanical properties of solder alloys. We examined creep deformation in bulk and through-hole (TH) form for two lead-free solder alloys, Sn-3.5Ag-0.5Cu-Ni-Ge and Sn-3.0Ag-0.5Cu, at elevated temperatures, finding that the creep rupture life of the Sn-3.5Ag-0.5Cu-Ni-Ge solder alloy was over three times better than that of the Sn-3.0Ag-0.5Cu solder at 398 K. Adding Ni to the solder appears to make microstructural development finer and more uniform. The Ni added to the solder readily combined with Cu to form stable intermetallic compounds of (Cu, Ni)6Sn5 capable of improving the creep behavior of solder alloys. Moreover, microstructural characterization based on transmission electron microscopy analyses observing creep behavior in detail showed that such particles in the Sn-3.5Ag-0.5Cu-Ni-Ge solder alloy prevent dislocation and movement.

  13. A computer vision based candidate for functional balance test.

    Science.gov (United States)

    Nalci, Alican; Khodamoradi, Alireza; Balkan, Ozgur; Nahab, Fatta; Garudadri, Harinath

    2015-08-01

    Balance in humans is a motor skill based on complex multimodal sensing, processing and control. Ability to maintain balance in activities of daily living (ADL) is compromised due to aging, diseases, injuries and environmental factors. Center for Disease Control and Prevention (CDC) estimate of the costs of falls among older adults was $34 billion in 2013 and is expected to reach $54.9 billion in 2020. In this paper, we present a brief review of balance impairments followed by subjective and objective tools currently used in clinical settings for human balance assessment. We propose a novel computer vision (CV) based approach as a candidate for functional balance test. The test will take less than a minute to administer and expected to be objective, repeatable and highly discriminative in quantifying ability to maintain posture and balance. We present an informal study with preliminary data from 10 healthy volunteers, and compare performance with a balance assessment system called BTrackS Balance Assessment Board. Our results show high degree of correlation with BTrackS. The proposed system promises to be a good candidate for objective functional balance tests and warrants further investigations to assess validity in clinical settings, including acute care, long term care and assisted living care facilities. Our long term goals include non-intrusive approaches to assess balance competence during ADL in independent living environments.

  14. An Evaluation of Prototype Circuit Boards Assembled with a Sn-Ag Bi Solder

    Energy Technology Data Exchange (ETDEWEB)

    ARTAKI,I.; RAY,U.; REJENT,JEROME A.; VIANCO,PAUL T.

    1999-09-01

    An evaluation was performed which examined the aging of surface mount solder joints assembled with 91.84Sn-3.33Ag-4.83Bi solder. Defect analysis of the as-fabricated test vehicles revealed excellent solderability, good package alignment, and a minimum number of voids. Continuous DC electrical monitoring of the solder joints did not reveal opens during as many as 10,000 thermal cycles (0 C, 100 C). The solder joints exhibited no significant degradation through 2500 cycles, based upon an absence of microstructural damage and sustained shear and pull strengths of chip capacitors and J-leaded solder joints, respectively. Thermal cycles of 5000 and 10,000 resulted in some surface cracking of the solder fillets and coatings. In a few cases, deeper cracks were observed in the thinner reaches of several solder fillets. There was no deformation or cracking in the solder located in the gap between the package I/O and the circuit board pad nor in the interior of the fillets, both locations that would raise concerns of joint mechanical integrity. A drop in the chip capacitor shear strength was attributed to crack growth near the top of the fillet.

  15. Joining of Bi-2212 high- Tc superconductors and metals using indium solders

    Science.gov (United States)

    Oh, S. Y.; Kim, H. R.; Jeong, Y. H.; Hyun, O. B.; Kim, C. J.

    2007-10-01

    BSCCO tubes can be used as a base material for switching devices such as superconducting fault current limiters (SFCLs) that prevent an electrical problem from occurring in an electrical power system. To apply an BSCCO bulk tube to a switching device, the superconducting tube has to be joined with a metallic part to by the over current to the metal part when the FCL is quenched. In this study, joining between Cu-Ni alloy and BSCCO was accomplished by soldering using In-Sn and In-Bi solders. Additionally, an Sn-Ag-Cu/In-Bi solder was used for the soldering of a different kind. For a better joining of the BSCCO superconductor with the In-Bi solder, the surface of the BSCCO was pre-coated with Ag by electro-plating. From the experiments, an intermetallic compound (IMC) of AgxIny chain was observed to be mainly formed from In-Sn and In-Bi soldering process. In case of the soldering of a different kind, IMC of AgxIny and CuxSny was also developed. Finally, we confirmed that the properties of soldering were enhanced by Sn-Ag-Cu/In-Bi twice-soldering process.

  16. Joining of Bi-2212 high-T{sub c} superconductors and metals using indium solders

    Energy Technology Data Exchange (ETDEWEB)

    Oh, S.Y. [Nuclear Nanomaterials Development Laboratory, Korea Atomic Energy Research Institute (KAERI), 150 Dukjin-dong, Yusong-gu, Daejeon 305-353 (Korea, Republic of); Kim, H.R.; Jeong, Y.H.; Hyun, O.B. [Superconductivity and Applications Group, Korea Electric Power Research Institute (KEPRI), Daejeon 305-380 (Korea, Republic of); Kim, C.J. [Nuclear Nanomaterials Development Laboratory, Korea Atomic Energy Research Institute (KAERI), 150 Dukjin-dong, Yusong-gu, Daejeon 305-353 (Korea, Republic of)], E-mail: cjkim2@kaeri.re.kr

    2007-10-01

    BSCCO tubes can be used as a base material for switching devices such as superconducting fault current limiters (SFCLs) that prevent an electrical problem from occurring in an electrical power system. To apply an BSCCO bulk tube to a switching device, the superconducting tube has to be joined with a metallic part to by the over current to the metal part when the FCL is quenched. In this study, joining between Cu-Ni alloy and BSCCO was accomplished by soldering using In-Sn and In-Bi solders. Additionally, an Sn-Ag-Cu/In-Bi solder was used for the soldering of a different kind. For a better joining of the BSCCO superconductor with the In-Bi solder, the surface of the BSCCO was pre-coated with Ag by electro-plating. From the experiments, an intermetallic compound (IMC) of Ag{sub x}In{sub y} chain was observed to be mainly formed from In-Sn and In-Bi soldering process. In case of the soldering of a different kind, IMC of Ag{sub x}In{sub y} and Cu{sub x}Sn{sub y} was also developed. Finally, we confirmed that the properties of soldering were enhanced by Sn-Ag-Cu/In-Bi twice-soldering process.

  17. Physics of Failure as a Basis for Solder Elements Reliability Assessment in Wind Turbines

    DEFF Research Database (Denmark)

    Kostandyan, Erik; Sørensen, John Dalsgaard

    2012-01-01

    description of the reliability. A physics of failure approach is applied. A SnAg solder component used in power electronics is used as an example. Crack propagation in the SnAg solder is modeled and a model to assess the accumulated plastic strain is proposed based on a physics of failure approach. Based...

  18. Lead-free solder technology transfer from ASE Americas

    Energy Technology Data Exchange (ETDEWEB)

    FTHENAKIS,V.

    1999-10-19

    To safeguard the environmental friendliness of photovoltaics, the PV industry follows a proactive, long-term environmental strategy involving a life-of-cycle approach to prevent environmental damage by its processes and products from cradle to grave. Part of this strategy is to examine substituting lead-based solder on PV modules with other solder alloys. Lead is a toxic metal that, if ingested, can damage the brain, nervous system, liver and kidneys. Lead from solder in electronic products has been found to leach out from municipal waste landfills and municipal incinerator ash was found to be high in lead also because of disposed consumer electronics and batteries. Consequently, there is a movement in Europe and Japan to ban lead altogether from use in electronic products and to restrict the movement across geographical boundaries of waste containing lead. Photovoltaic modules may contain small amounts of regulated materials, which vary from one technology to another. Environmental regulations impact the cost and complexity of dealing with end-of-life PV modules. If they were classified as hazardous according to Federal or State criteria, then special requirements for material handling, disposal, record-keeping and reporting would escalate the cost of decommissioning the modules. Fthenakis showed that several of today's x-Si modules failed the US-EPA Toxicity Characteristic Leaching Procedure (TCLP) for potential leaching of Pb in landfills and also California's standard on Total Threshold Limit Concentration (TTLC) for Pb. Consequently, such modules may be classified as hazardous waste. He highlighted potential legislation in Europe and Japan which could ban or restrict the use of lead and the efforts of the printed-circuit industries in developing Pb-free solder technologies in response to such expected legislation. Japanese firms already have introduced electronic products with Pb-free solder, and one PV manufacturer in the US, ASE Americas has used a

  19. Trinocular stereo vision method based on mesh candidates

    Science.gov (United States)

    Liu, Bin; Xu, Gang; Li, Haibin

    2010-10-01

    One of the most interesting goals of machine vision is 3D structure recovery of the scenes. This recovery has many applications, such as object recognition, reverse engineering, automatic cartography, autonomous robot navigation, etc. To meet the demand of measuring the complex prototypes in reverse engineering, a trinocular stereo vision method based on mesh candidates was proposed. After calibration of the cameras, the joint field of view can be defined in the world coordinate system. Mesh grid is established along the coordinate axes, and the mesh nodes are considered as potential depth data of the object surface. By similarity measure of the correspondence pairs which are projected from a certain group of candidates, the depth data can be obtained readily. With mesh nodes optimization, the interval between the neighboring nodes in depth direction could be designed reasonably. The potential ambiguity can be eliminated efficiently in correspondence matching with the constraint of a third camera. The cameras can be treated as two independent pairs, left-right and left-centre. Due to multiple peaks of the correlation values, the binocular method may not satisfy the accuracy of the measurement. Another image pair is involved if the confidence coefficient is less than the preset threshold. The depth is determined by the highest sum of correlation of both camera pairs. The measurement system was simulated using 3DS MAX and Matlab software for reconstructing the surface of the object. The experimental result proved that the trinocular vision system has good performance in depth measurement.

  20. Soldering Formalism Theory and Applications

    CERN Document Server

    Wotzasek, C

    1998-01-01

    The soldering mechanism is a new technique to work with distinct manifestations of dualities that incorporates interference effects, leading to new physical results that includes quantum contributions. This approach was used to investigate the cases of electromagnetic dualities, and $D\\geq 2$ bosonization. In the former context this technique is applied for the quantum mechanical harmonic oscillator, the scalar field theory in two dimensions and the Maxwell theory in four dimensions. The soldered actions in any dimension leads to a master action which is duality invariant under a much bigger set of symmetries. The effects of coupling to gravity are also elaborated. In the later context, a technique is developed that solders the dual aspects of some symmetry following from the bosonisation of two distinct fermionic models, leading to new results which cannot be otherwise obtained. Exploiting this technique, the two dimensional chiral determinants with opposite chirality are soldered to reproduce either the usu...

  1. Research advances in the interfacial IMC between the Sn-based solders and Cu substrate%锡基钎料与铜界面IMC的研究进展

    Institute of Scientific and Technical Information of China (English)

    位松; 尹立孟; 许章亮; 李欣霖; 李望云

    2012-01-01

    Research advances in the formation and growth mechanism of interfacial IMC between the Sn-based solder and Cu substrate in interconnection solder joint of electronic packaging are reviewed and commented. The formation and growth behavior of interfacial IMC in lead-free solder joints, the thermodynamics of IMC formation and the kinetics of IMC growth are expounded. Some other factors which are related to the growth behavior of interfacial IMC are also briefly proposed. In addition, the development trends of the research on interfacial IMC in lead-free electronic packaging are discussed.%对国内外电子封装“锡基钎料/铜基板”焊点体系界面IMC形成与生长机理的研究进展进行了回顾、评述,重点阐述了界面IMC的形成与生长行为、形成热力学和生长动力学,简要评述了相关因素对界面IMC生长行为的影响.最后,对无铅化电子封装互连焊点界面IMC研究的发展趋势进行了展望.

  2. Wetting behavior of alternative solder alloys

    Energy Technology Data Exchange (ETDEWEB)

    Hosking, F.M.; Vianco, P.T.; Hernandez, C.L.; Rejent, J.A.

    1993-07-01

    Recent economic and environmental issues have stimulated interest in solder alloys other than the traditional Sn-Pb eutectic or near eutectic composition. Preliminary evaluations suggest that several of these alloys approach the baseline properties (wetting, mechanical, thermal, and electrical) of the Sn-Pb solders. Final alloy acceptance will require major revisions to existing industrial and military soldering specifications. Bulk alloy and solder joint properties are consequently being investigated to validate their producibility and reliability. The work reported in this paper examines the wetting behavior of several of the more promising commercial alloys on copper substrates. Solder wettability was determined by the meniscometer and wetting balance techniques. The wetting results suggest that several of the alternative solders would satisfy pretinning and surface mount soldering applications. Their use on plated through hole technology might be more difficult since the alloys generally did not spread or flow as well as the 60Sn-40Pb solder.

  3. Intermetallic compound layer growth kinetics in non-lead bearing solders

    Energy Technology Data Exchange (ETDEWEB)

    Vianco, P.T.; Kilgo, A.C.; Grant, R.

    1995-04-01

    The introduction of alternative, non-lead bearing solders into electronic assemblies requires a thorough investigation of product manufacturability and reliability. Both of these attributes can be impacted by the excessive growth of intermetallic compound (IMC) layers at the solder/substrate interface. An extensive study has documented the stoichiometry and solid state growth kinetics of IMC layers formed between copper and the lead-free solders: 96.5Sn-3.5Ag (wt.%), 95Sn-5Sb, 100Sn, and 58Bi-42Sn. Aging temperatures were 70--205 C for the Sn-based solders and 55--120 C for the Bi-rich solder. Time periods were 1--400 days for all of the alloys. The Sn/Cu, Sn-Ag/Cu, and Sn-Sb/Cu IMC layers exhibited sub-layers of Cu{sub 6}Sn{sub 5} and Cu{sub 3}Sn; the latter composition was present only following prolonged aging times or higher temperatures. The total layer growth exhibited a time exponent of n = 0.5 at low temperatures and a value of n = 0.42 at higher temperatures in each of the solder/Cu systems. Similar growth kinetics were observed with the low temperature 58Bi-42Sn solder; however, a considerably more complex sub-layer structure was observed. The kinetic data will be discussed with respect to predicting IMC layer growth based upon solder composition.

  4. Dural reconstruction by fascia using a temperature-controlled CO2 laser soldering system

    Science.gov (United States)

    Forer, Boaz; Vasilyev, Tamar; Brosh, Tamar; Kariv, Naam; Gil, Ziv; Fliss, Dan M.; Katzir, Abraham

    2005-04-01

    Conventional methods for dura repair are normally based on sutures or stitches. These methods have several disadvantages: (1) The dura is often brittle, and the standard procedures are difficult and time consuming. (2) The seal is leaky. (3) The introduction of a foreign body (e.g. sutures) may cause an inflammatory response. In order to overcome these difficulties we used a temperature controlled fiber optic based CO2 laser soldering system. In a set of in vitro experiments we generated a hole of diameter 10 mm in the dura of a pig corpse, covered the hole with a segment of fascia, and soldered the fascia to the edges of the hole, using 47% bovine albumin as a solder. The soldering was carried out spot by spot, and each spot was heated to 65° C for 3-6 seconds. The soldered dura was removed and the burst pressure of the soldered patch was measured. The average value for microscopic muscular side soldering was 194 mm Hg. This is much higher than the maximal physiological pressure of the CSF fluid in the brain, which is 15 mm Hg. In a set of in vivo experiments, fascia patches were soldered on holes in five farm pigs. The long term results of these experiments were very promising. In conclusion, we have developed an advanced technique for dural reconstruction, which will find important clinical applications.

  5. Properties and Microstructures of Sn-Bi-X Lead-Free Solders

    Directory of Open Access Journals (Sweden)

    Fan Yang

    2016-01-01

    Full Text Available The Sn-Bi base lead-free solders are proposed as one of the most popular alloys due to the low melting temperature (eutectic point: 139°C and low cost. However, they are not widely used because of the lower wettability, fatigue resistance, and elongation compared to traditional Sn-Pb solders. So the alloying is considered as an effective way to improve the properties of Sn-Bi solders with the addition of elements (Al, Cu, Zn, Ga, Ag, In, Sb, and rare earth and nanoparticles. In this paper, the development of Sn-Bi lead-free solders bearing elements and nanoparticles was reviewed. The variation of wettability, melting characteristic, electromigration, mechanical properties, microstructures, intermetallic compounds reaction, and creep behaviors was analyzed systematically, which can provide a reference for investigation of Sn-Bi base solders.

  6. Candidate antibody-based therapeutics against HIV-1.

    Science.gov (United States)

    Gong, Rui; Chen, Weizao; Dimitrov, Dimiter S

    2012-06-01

    Antibody-based therapeutics have been successfully used for the treatment of various diseases and as research tools. Several well characterized, broadly neutralizing monoclonal antibodies (bnmAbs) targeting HIV-1 envelope glycoproteins or related host cell surface proteins show sterilizing protection of animals, but they are not effective when used for therapy of an established infection in humans. Recently, a number of novel bnmAbs, engineered antibody domains (eAds), and multifunctional fusion proteins have been reported which exhibit exceptionally potent and broad neutralizing activity against a wide range of HIV-1 isolates from diverse genetic subtypes. eAds could be more effective in vivo than conventional full-size antibodies generated by the human immune system. Because of their small size (12∼15 kD), they can better access sterically restricted epitopes and penetrate densely packed tissue where HIV-1 replicates than the larger full-size antibodies. HIV-1 possesses a number of mechanisms to escape neutralization by full-size antibodies but could be less likely to develop resistance to eAds. Here, we review the in vitro and in vivo antiviral efficacies of existing HIV-1 bnmAbs, summarize the development of eAds and multispecific fusion proteins as novel types of HIV-1 inhibitors, and discuss possible strategies to generate more potent antibody-based candidate therapeutics against HIV-1, including some that could be used to eradicate the virus.

  7. Long-Term Effects of Soldering By-Products on Nickel-Coated Copper Wire

    Science.gov (United States)

    Rolin, T. D.; Hodge, R. E.

    2008-01-01

    An analysis of thirty-year-old, down graded flight cables was conducted to determine the makeup of a green material on the surface of the shielded wire near soldered areas and to ascertain if the green material had corroded the nickel-coated copper wire. Two likely candidates were possible due to the handling and environments to which these cables were exposed. The flux used to solder the cables is known to contain abietic acid, a carboxylic acid found in many pine rosins used for the soldering process. The resulting material copper abietate is green in color and is formed during the application of heat during soldering operations. Copper (II) chloride, which is also green in color is known to contaminate flight parts and is corrosive. Data is presented that shows the material is copper abietate, not copper (II) chloride, and more importantly that the abietate does not aggressively attack nickel-plated copper wire.

  8. Reliability of Wind Turbine Components-Solder Elements Fatigue Failure

    DEFF Research Database (Denmark)

    Kostandyan, Erik; Sørensen, John Dalsgaard

    2012-01-01

    The physics of failure for electrical components due to temperature loading is described. The main focus is on crack propagation in solder joints and damage accumulation models based on the Miner’s rule. Two models are proposed that describe the initial accumulated plastic strain depending...... on the temperature mean and temperature range. Constant terms and model errors are estimated. The proposed methods are useful to predict damage values for solder joint in power electrical components. Based on the proposed methods it is described how to find the damage level for a given temperature loading profile...

  9. Monoclonal antibody-based candidate therapeutics against HIV type 1.

    Science.gov (United States)

    Chen, Weizao; Dimitrov, Dimiter S

    2012-05-01

    Treatment of HIV-1 infection has been highly successful with small molecule drugs. However, resistance still develops. In addition, long-term use can lead to toxicity with unpredictable effects on health. Finally, current drugs do not lead to HIV-1 eradication. The presence of the virus leads to chronic inflammation, which can result in increased morbidity and mortality after prolonged periods of infection. Monoclonal antibodies (mAbs) have been highly successful during the past two decades for therapy of many diseases, primarily cancers and immune disorders. They are relatively safe, especially human mAbs that have evolved in humans at high concentrations to fight diseases and long-term use may not lead to toxicities. Several broadly neutralizing mAbs (bnmAbs) against HIV-1 can protect animals but are not effective when used for therapy of an established infection. We have hypothesized that HIV-1 has evolved strategies to effectively escape neutralization by full-size antibodies in natural infections but not by smaller antibody fragments. Therefore, a promising direction of research is to discover and exploit antibody fragments as potential candidate therapeutics against HIV-1. Here we review several bnmAbs and engineered antibody domains (eAds), their in vitro and in vivo antiviral efficacy, mechanisms used by HIV-1 to escape them, and strategies that could be effective to develop more powerful mAb-based HIV-1 therapeutics.

  10. Methylene blue solder re-absorption in microvascular anastomoses

    Science.gov (United States)

    Birch, Jeremy F.; Hepplewhite, J.; Frier, Malcolm; Bell, Peter R. F.

    2003-06-01

    Soldered vascular anastomoses have been reported using several chromophores but little is known of the optimal conditions for microvascular anastomosis. There are some indications of the optimal protein contents of a solder, and the effects of methylene blue on anastomotic strength. The effects of varying laser power density in vivo have also been described, showing a high rate of thrombosis with laser power over 22.9Wcm-2. However no evidence exists to describe how long the solder remains at the site of the anastomosis. Oz et al reported that the fibrin used in their study had been almost completely removed by 90 days but without objective evidence of solder removal. In order to address the issue of solder re-absorption from the site of an anastomosis we used radio-labelled albumin (I-125) incorporated into methylene blue based solder. This was investigated in both the situation of the patent and thrombosed anastomosis with anastomoses formed at high and low power. Iodine-125 (half life: 60.2 days) was covalently bonded to porcine albumin and mixed with the solder solution. Radio-iodine has been used over many years to determine protein turnover using either I-125 or I-131. Iodine-125 labelled human albumin is regularly used as a radiopharmaceutical tool for the determination of plasma volume. Radio-iodine has the advantages of not affecting protein metabolism and the label is rapidly excreted after metabolic breakdown. Labelling with chromium (Cr-51) causes protein denaturation and is lost from the protein with time. Labelled albumin has been reported in human studies over a 21-day period, with similar results reported by Matthews. Most significantly McFarlane reported a different rate of catabolism of I-131 and I-125 over a 22-day period. The conclusion from this is that the rate of iodine clearance is a good indicator of protein catabolism. In parallel with the surgery a series of blank standards were prepared with a known mass of solder to correct for isotope

  11. Tensile properties and thermal shock reliability of Sn-Ag-Cu solder joint with indium addition.

    Science.gov (United States)

    Yu, A-Mi; Jang, Jae-Won; Lee, Jong-Hyun; Kim, Jun-Ki; Kim, Mok-Soon

    2012-04-01

    The thermal shock reliability and tensile properties of a newly developed quaternary Sn-1.2Ag-0.5Cu-0.4In (wt%) solder alloy were investigated and compared to those of ternary Sn-Ag-Cu based Pb-free solder alloys. It was revealed that the Sn-1.2Ag-0.5Cu-0.4In solder alloy shows better thermal shock reliability compared to the Sn-1.0Ag-0.5Cu and Sn-3.0Ag-0.5Cu solder alloys. The quaternary alloy has higher strength than Sn-1.0Ag-0.5Cu alloy, and higher elongation than Sn-3.0Ag-0.5Cu alloy. It was also revealed that the addition of indium promotes the formation of Ag3(Sn, In) phase in the solder joint during reflow process.

  12. Complex of automated equipment and technologies for waveguides soldering using induction heating

    Science.gov (United States)

    Murygin, A. V.; Tynchenko, V. S.; Laptenok, V. D.; Emilova, O. A.; Bocharov, A. N.

    2017-02-01

    The article deals with the problem of designing complex automated equipment for soldering waveguides based on induction heating technology. A theoretical analysis of the problem, allowing to form a model of the «inductor-waveguide» system and to carry out studies to determine the form of inducing wire, creating a narrow and concentrated heat zone in the area of the solder joint. Also solves the problem of the choice of the temperature control means, the information from which is used later to generate the effective management of induction soldering process. Designed hardware complex in conjunction with the developed software system is a system of automatic control, allowing to manage the process of induction heating, to prevent overheating and destruction of the soldered products, improve the stability of induction soldering process, to improve the quality of products, thereby reducing time and material costs for the production.

  13. Study on Non-rosin Based Flux Used for Cored Lead-free Solder Wire%无铅药芯焊锡丝用非松香基固体助焊剂的研究

    Institute of Scientific and Technical Information of China (English)

    程方杰; 杨俊香; 葛文君

    2011-01-01

    针对现有松香固体助焊剂活性温度低和焊后变色的问题,研制了以十八酸、聚乙二醇和少量耐热松香作为载体,以己二酸和癸二酸复配作为活性剂的非松香基固体助焊剂.此助焊剂常温下为白色膏状,熔点范围110℃~130 ℃,满足Sn-0.7Cu无铅药芯焊锡丝灌芯和拔丝工艺.助焊剂中各成分沸点在300℃左右,满足手工烙铁焊高温要求且大大减少焊接飞溅,测试飞溅仅为0.16%.试验测定焊前焊后表面绝缘电阻均达到国家一级标准1×1012 Ω.其铺展率好,助焊效果理想.该助焊剂在高温助焊活性、稳定性和焊后腐蚀性等方面都符合标准,焊后焊点饱满光亮,残留物无腐蚀.%A non-rosin based flux was developed due to the problems of solders which are no activity at high temperatures and have discoloration after soldering associated with some conventional fluxes, using stearic acid, Polyethylene glycol (PEG),and a small amount of heat-resistant rosin as the vector, and a combination of adipic acid and sebacic acid as the active agent.This flux is a white paste at room temperature, and is found to have a melting point 110 ℃~ 130 ℃, which is suitable for wire core grouted and wire-drawn Sn-0.7Cu lead-free solder. The boiling points of each component are about 300 ℃, meeting the requirements of a high temperature for manual soldering. Also, splash was reduced significantly, and was only 0.16% in tests.Experimental measurement showed that the insulation resistance of the surface reached the standard of 1 × 1012 Ω, and it was found that its spreading rate was comparable to the commercial fluxes. Importantly, the soldering results were satisfactory.The activity characteristics at high temperatures, stability, corrosion resistance, and other variables of the flux, all reached established soldering standards, achieving full bright spot solder, with no corrosion residue.

  14. The effect of intermetallic compound morphology on Cu diffusion in Sn-Ag and Sn-Pb solder bump on the Ni/Cu Under-bump metallization

    Science.gov (United States)

    Jang, Guh-Yaw; Duh, Jenq-Gong

    2005-01-01

    The eutectic Sn-Ag solder alloy is one of the candidates for the Pb-free solder, and Sn-Pb solder alloys are still widely used in today’s electronic packages. In this tudy, the interfacial reaction in the eutectic Sn-Ag and Sn-Pb solder joints was investigated with an assembly of a solder/Ni/Cu/Ti/Si3N4/Si multilayer structures. In the Sn-3.5Ag solder joints reflowed at 260°C, only the (Ni1-x,Cux)3Sn4 intermetallic compound (IMC) formed at the solder/Ni interface. For the Sn-37Pb solder reflowed at 225°C for one to ten cycles, only the (Ni1-x,Cux)3Sn4 IMC formed between the solder and the Ni/Cu under-bump metallization (UBM). Nevertheless, the (Cu1-y,Niy)6Sn5 IMC was observed in joints reflowed at 245°C after five cycles and at 265°C after three cycles. With the aid of microstructure evolution, quantitative analysis, and elemental distribution between the solder and Ni/Cu UBM, it was revealed that Cu content in the solder near the solder/IMC interface played an important role in the formation of the (Cu1-y,Niy)6Sn5 IMC. In addition, the diffusion behavior of Cu in eutectic Sn-Ag and Sn-Pb solders with the Ni/Cu UBM were probed and discussed. The atomic flux of Cu diffused through Ni was evaluated by detailed quantitative analysis in an electron probe microanalyzer (EPMA). During reflow, the atomic flux of Cu was on the order of 1016-1017 atoms/cm2sec in both the eutectic Sn-Ag and Sn-Pb systems.

  15. Handbook of machine soldering SMT and TH

    CERN Document Server

    Woodgate, Ralph W

    1996-01-01

    A shop-floor guide to the machine soldering of electronics Sound electrical connections are the operational backbone of every piece of electronic equipment-and the key to success in electronics manufacturing. The Handbook of Machine Soldering is dedicated to excellence in the machine soldering of electrical connections. Self-contained, comprehensive, and down-to-earth, it cuts through jargon, peels away outdated notions, and presents all the information needed to select, install, and operate machine soldering equipment. This fully updated and revised volume covers all of the new technologies and processes that have emerged in recent years, most notably the use of surface mount technology (SMT). Supplemented with 200 illustrations, this thoroughly accessible text Describes reflow and wave soldering in detail, including reflow soldering of SMT boards and the use of nitrogen blankets * Explains the setup, operation, and maintenance of a variety of soldering machines * Discusses theory, selection, and control met...

  16. Physical properties of lead free solders in liquid and solid state

    Energy Technology Data Exchange (ETDEWEB)

    Mhiaoui, Souad

    2007-04-17

    The European legislation prohibits the use of lead containing solders in Europe. However, lead free solders have a higher melting point (typical 20%) and their mechanical characteristics are worse. Additional problems are aging and adhesion of the solder on the electronic circuits. Thus, research activities must focus on the optimization of the properties of Sn-Ag-Cu based lead free solders chosen by the industry. Two main objectives are treated in this work. In the center of the first one is the study of curious hysteresis effects of metallic cadmium-antimony alloys after thermal cycles by measuring electronic transport phenomena (thermoelectric power and electrical resistivity). The second objective, within the framework of ''cotutelle'' between the universities of Metz and of Chemnitz and supported by COST531, is to study more specifically lead free solders. A welding must well conduct electricity and well conduct and dissipate heat. In Metz, we determined the electrical conductivity, the thermoelectric power and the thermal conductivity of various lead free solders (Sn-Ag-Cu, Sn-Cu, Sn-Ag, Sn-Sb) as well in the liquid as well in the solid state. The results have been compared to classical lead-tin (Pb-Sn) solders. In Chemnitz we measured the surface tension, the interfacial tension and the density of lead free solders. We also measured the viscosity of these solders without and with additives, in particular nickel. These properties were related to the industrial problems of wettability and spreadability. Lastly, we solidified alloys under various conditions. We observed undercooling. We developed a technique of mixture of nanocrystalline powder with lead free solders ''to sow'' the liquid bath in order to obtain ''different'' solids which were examined using optical and electron microscopy. (orig.)

  17. Effect of Lanthanum on Driving Force for Cu6Sn5 Growth and Improvement of Solder Joint Reliability

    Institute of Scientific and Technical Information of China (English)

    2002-01-01

    By means of adding low content of rare earth element La into Sn60-Pb40 solder alloy, the growth of Cu6Sn5 intermetallic compound at the interface of solder joint is hindered, and the thermal fatigue life of solder joint is increased by 2 times. The results of thermodynamic calculation based on diffusion kinetics show that, the driving force for Cu6Sn5 growth is lowered by adding small content of La in Sn60-Pb40 solder alloy. Meanwhile, there is an effective local mole fraction range of La, in which, 0.18% is the limited value and 0.08% is the best value.

  18. Electrodeposition and characterisation of Sn-Ag-Cu solder alloys for flip-chip interconnection

    Energy Technology Data Exchange (ETDEWEB)

    Qin Yi [Department of Materials, Loughborough University, Leicestershire, LE11 3TU (United Kingdom); Wolfson School of Mechanical and Manufacturing Engineering, Loughborough University, Leicestershire, LE11 3TU (United Kingdom); Wilcox, G.D., E-mail: G.D.Wilcox@lboro.ac.u [Department of Materials, Loughborough University, Leicestershire, LE11 3TU (United Kingdom); Liu Changqing [Wolfson School of Mechanical and Manufacturing Engineering, Loughborough University, Leicestershire, LE11 3TU (United Kingdom)

    2010-12-15

    A pyrophosphate and iodide based bath was investigated for the electrodeposition of near-eutectic Sn-Ag-Cu alloys, which are promising lead-free solder candidates for electronics interconnection. Near-eutectic Sn-Ag-Cu electrodeposits (2.5-4.2 wt.% Ag and 0.7-1.5 wt.% Cu) were achieved from the system as measured by wavelength dispersive X-ray spectroscopy (WDS). Electroplating such near-eutectic ternary alloys at higher deposition rates was possible with the application of electrolyte agitation. Different morphologies of deposited Sn-Ag-Cu films were analysed using scanning electron microscopy (SEM). X-ray diffraction (XRD) data indicated that Sn, Ag{sub 3}Sn and Cu{sub 6}Sn{sub 5} were present in the 'as-electrodeposited' Sn-Ag-Cu film. The microstructure of the deposits and the morphology of Ag{sub 3}Sn and Cu{sub 6}Sn{sub 5} intermetallics were characterised from cross-sectional images produced from a focused ion beam scanning electron microscopy and then imaged from transmission electron microscopy (TEM) micrographs. The proposed bath proved capable of producing fine pitch near-eutectic Sn-Ag-Cu solder bumps as demonstrated on a glass test wafer.

  19. Dissolution and Interface Reactions between Palladium and Tin (Sn)-Based Solders: Part I. 95.5Sn-3.9Ag-0.6Cu Alloy

    Science.gov (United States)

    Vianco, Paul T.; Rejent, Jerome A.; Zender, Gary L.; Hlava, Paul F.

    2010-12-01

    The interface microstructures and dissolution behavior were studied, which occur between 99.9 pct Pd substrates and molten 95.5Sn-3.9Ag-0.6Cu (wt pct, Sn-Ag-Cu) solder. The solder bath temperatures were 513 K to 623 K (240 °C to 350 °C). The immersion times were 5 to 240 seconds. The IMC layer composition exhibited the (Pd, Cu)Sn4 (Cu, 0 to 2 at. pct) and (Pd, Sn) solid-solution phases for all test conditions. The phases PdSn and PdSn2 were observed only for the 623 K (350 °C), 60 seconds test conditions. The metastable phase, Pd11Sn9, occurred consistently for the 623 K (350 °C), 240 seconds conditions. Palladium-tin needles appeared in the Sn-Ag-Cu solder, but only at temperatures of 563 K (290 °C ) or higher, and had a (Pd, Cu)Sn4 stoichiometry. Palladium dissolution increased monotonically with both solder bath temperature and exposure time. The rate kinetics of dissolution were represented by the expression At n exp(∆ H/R T), where the time exponent ( n) was 0.52 ± 0.10 and the apparent activation energy (∆ H) was 44 ± 9 kJ/mol. The IMC layer thickness increased between 513 K and 563 K (240 °C and 290 °C) to approximately 3 to 5 µm, but then was less than 3 µm at 593 K and 623 K (320 °C and 350 °C). The thickness values exhibited no significant time dependence. As a protective finish in electronics assembly applications, Pd would be relatively slow to dissolve into molten Sn-Ag-Cu solder. The Pd-Sn IMC layer would remain sufficiently thin and adherent to a residual Pd layer so as to pose a minimal reliability concern for Sn-Ag-Cu solder interconnections.

  20. Lead Free Solder Joint Thermal Condition in Semiconductor Packaging

    Directory of Open Access Journals (Sweden)

    M. N. Harif

    2010-01-01

    Full Text Available Problem statement: Solder joints are responsible for both electrical and mechanical connections. Solder does not have adequate ductility to ensure the repeated relative displacements due to the mismatch between expansion coefficients of the chip carrier and the circuit board. Solder material plays a crucial role to provide the necessary electrical and mechanical interconnections in an electronic assembly. Finding a technique to increase the service life of future connections is not the total solution. A method must be developed for predicting the remaining service life of many joints already in use. Approach: The effect of High Temperature Storage (HTS on lead free solder joint material for ball grid array application using pull test method is studied in this study. Some statistical analysis base on the pull test data also discussed. Three samples of different lead free solder joint material were selected in this experiment namely Sn3.8Ag0.7Cu (SAC387, Sn2.3Ag0.08Ni0.01Co (SANC and Sn3.5Ag. After the thermal condition test, all the lead free solder joint material samples were tested using Dage 4000 pull test machine. Each pull test will be 5 units and each unit contains 8 balls. Results: The mean pull strength for high temperature storage is 2847.66, 2628.20 and 2613.79 g for Sn3.5Ag, SANC and SAC387, respectively. Thus, Sn3.5Ag shows a significantly better solder joint performance in terms of joint strength compare to SANC and SAC387. Hence, Intermetallic Compound (IMC thicknesses were measured after cross-sectioning. Sample size for cross-sectioning was 3 units per read point, 2 balls per unit and 3 maximum IMC peaks per ball and the measurement using high power scope of 100x and Image Analyzer software to measure the IMC thickness. For high temperature storage, result show that the mean IMC thicknesses for SAC387, SANC and Sn3.5Ag are 3.9139, 2.3111 and 2.3931 µm. Conclusion/Recommendations: It was found that IMC thickness for SANC and Sn3

  1. Improving the Reliability of Si Die Attachment with Zn-Sn-Based High-Temperature Pb-Free Solder Using a TiN Diffusion Barrier

    Science.gov (United States)

    Kim, Seongjun; Kim, Keun-Soo; Kim, Sun-Sik; Suganuma, Katsuaki; Izuta, Goro

    2009-12-01

    The thermal fatigue reliability of Si die-attached joints with Zn-30wt.%Sn, high-temperature, Pb-free solder was investigated, focusing on the interfacial microstructure and joining strength of a Cu/solder/Cu joint during thermal cycling. A sound die attachment on an aluminum nitride (AlN) direct-bonded copper (DBC) substrate was achieved by forming Cu-Zn intermetallic compound (IMC) layers at the interface with the Cu of the substrate. During the thermal cycling test performed between -40°C and 125°C, thermal fatigue cracks were induced by the growth of Cu-Zn IMCs at the interface with the Cu. A thin titanium nitride (TiN) film was applied to suppress the formation of Cu-Zn IMCs. Adequate joint formation was accomplished by using an Au/TiN-coated DBC substrate, and only the TiN layer was observed at both interfaces. In conjunction with the TiN diffusion barrier, the Si die-attached joint created with Zn-30wt.%Sn solder exhibited a stable interfacial microstructure during thermal cycling. No microstructural changes, such as IMC formation, grain growth or formation of fatigue cracks, were observed, and the joining strength was maintained even after 2000 cycles.

  2. Candidate Smoke Region Segmentation of Fire Video Based on Rough Set Theory

    OpenAIRE

    Yaqin Zhao

    2015-01-01

    Candidate smoke region segmentation is the key link of smoke video detection; an effective and prompt method of candidate smoke region segmentation plays a significant role in a smoke recognition system. However, the interference of heavy fog and smoke-color moving objects greatly degrades the recognition accuracy. In this paper, a novel method of candidate smoke region segmentation based on rough set theory is presented. First, Kalman filtering is used to update video background in order to ...

  3. Detection of micro solder balls using active thermography and probabilistic neural network

    Science.gov (United States)

    He, Zhenzhi; Wei, Li; Shao, Minghui; Lu, Xingning

    2017-03-01

    Micro solder ball/bump has been widely used in electronic packaging. It has been challenging to inspect these structures as the solder balls/bumps are often embedded between the component and substrates, especially in flip-chip packaging. In this paper, a detection method for micro solder ball/bump based on the active thermography and the probabilistic neural network is investigated. A VH680 infrared imager is used to capture the thermal image of the test vehicle, SFA10 packages. The temperature curves are processed using moving average technique to remove the peak noise. And the principal component analysis (PCA) is adopted to reconstruct the thermal images. The missed solder balls can be recognized explicitly in the second principal component image. Probabilistic neural network (PNN) is then established to identify the defective bump intelligently. The hot spots corresponding to the solder balls are segmented from the PCA reconstructed image, and statistic parameters are calculated. To characterize the thermal properties of solder bump quantitatively, three representative features are selected and used as the input vector in PNN clustering. The results show that the actual outputs and the expected outputs are consistent in identification of the missed solder balls, and all the bumps were recognized accurately, which demonstrates the viability of the PNN in effective defect inspection in high-density microelectronic packaging.

  4. Eddy current quality control of soldered current-carrying busbar splices of superconducting magnets

    CERN Document Server

    Kogan, L; Savary, F; Principe, R; Datskov, V; Rozenfel'd, E; Khudjakov, B

    2015-01-01

    The eddy current technique associated with a U-shaped transducer is studied for the quality control of soldered joints between superconducting busbars ('splices'). Two other quality control techniques, based on X-rays and direct measurement of the electrical resistance, are also studied for comparison. A comparative analysis of the advantages and disadvantages of these three methods in relation to the quality control of soldered superconducting busbar cables enclosed in copper shells is used for benchmarking. The results of inspections with the U-shaped eddy current transducer carried out on several sample joints presenting different types of soldering defects show the potential of this type of nondestructive (ND) quality control technique.

  5. Life Prediction of Ball Grid Array Soldered Joints under Thermal Cycling Loading by Fracture Mechanics Method

    Institute of Scientific and Technical Information of China (English)

    2001-01-01

    Fatigue crack propagation life of ball grid array (BGA) soldered joints during thermal cycling loading was investigated by fracture mechanics approach using finite element analysis. The relationships between the strain energy release rate (G) and crack size (α), thermal cycle numbers (N) can be derived. Based on the relationships, fatigue life of the soldered joints was determined. The results showed that crack propagation life was higher than crack initiation life. Therefore, it appears that it is more appropriate to predict the fatigue life of soldered joints using the fracture mechanics method.

  6. Simulation of thermomechanical fatigue in solder joints

    Energy Technology Data Exchange (ETDEWEB)

    Fang, H.E.; Porter, V.L.; Fye, R.M.; Holm, E.A. [Sandia National Labs., Albuquerque, NM (United States)

    1997-12-31

    Thermomechanical fatigue (TMF) is a very complex phenomenon in electronic component systems and has been identified as one prominent degradation mechanism for surface mount solder joints in the stockpile. In order to precisely predict the TMF-related effects on the reliability of electronic components in weapons, a multi-level simulation methodology is being developed at Sandia National Laboratories. This methodology links simulation codes of continuum mechanics (JAS3D), microstructural mechanics (GLAD), and microstructural evolution (PARGRAIN) to treat the disparate length scales that exist between the macroscopic response of the component and the microstructural changes occurring in its constituent materials. JAS3D is used to predict strain/temperature distributions in the component due to environmental variable fluctuations. GLAD identifies damage initiation and accumulation in detail based on the spatial information provided by JAS3D. PARGRAIN simulates the changes of material microstructure, such as the heterogeneous coarsening in Sn-Pb solder, when the component`s service environment varies.

  7. Lead free solder mechanics and reliability

    CERN Document Server

    Pang, John Hock Lye

    2012-01-01

    Lead-free solders are used extensively as interconnection materials in electronic assemblies and play a critical role in the global semiconductor packaging and electronics manufacturing industry. Electronic products such as smart phones, notebooks and high performance computers rely on lead-free solder joints to connect IC chip components to printed circuit boards. Lead Free Solder: Mechanics and Reliability provides in-depth design knowledge on lead-free solder elastic-plastic-creep and strain-rate dependent deformation behavior and its application in failure assessment of solder joint reliability. It includes coverage of advanced mechanics of materials theory and experiments, mechanical properties of solder and solder joint specimens, constitutive models for solder deformation behavior; numerical modeling and simulation of solder joint failure subject to thermal cycling, mechanical bending fatigue, vibration fatigue and board-level drop impact tests. This book also: Discusses the mechanical prope...

  8. In-situ study of electromigration-induced grain rotation in Pb-free solder joint by synchrotron microdiffraction

    Energy Technology Data Exchange (ETDEWEB)

    Chen, Kai; Tamura, Nobumichi; Tu, King-Ning

    2008-10-31

    The rotation of Sn grains in Pb-free flip chip solder joints hasn't been reported in literature so far although it has been observed in Sn strips. In this letter, we report the detailed study of the grain orientation evolution induced by electromigration by synchrotron based white beam X-ray microdiffraction. It is found that the grains in solder joint rotate more slowly than in Sn strip even under higher current density. On the other hand, based on our estimation, the reorientation of the grains in solder joints also results in the reduction of electric resistivity, similar to the case of Sn strip. We will also discuss the reason why the electric resistance decreases much more in strips than in the Sn-based solders, and the different driving force for the grain growth in solder joint and in thin film interconnect lines.

  9. Al and Si Alloying Effect on Solder Joint Reliability in Sn-0.5Cu for Automotive Electronics

    Science.gov (United States)

    Hong, Won Sik; Oh, Chulmin; Kim, Mi-Song; Lee, Young Woo; Kim, Hui Joong; Hong, Sung Jae; Moon, Jeong Tak

    2016-08-01

    To suppress the bonding strength degradation of solder joints in automotive electronics, we proposed a mid-temperature quaternary Pb-free Sn-0.5Cu solder alloy with minor Pd, Al, Si and Ge alloying elements. We manufactured powders and solder pastes of Sn-0.5Cu-(0.01,0.03)Al-0.005Si-(0.006-0.007)Ge alloys (T m = 230°C), and vehicle electronic control units used for a flame-retardant-4 printed circuit board with an organic solderability preservative finish were assembled by a reflow soldering process. To investigate the degradation properties of solder joints used in engine compartments, thermal cycling tests were conducted from -40°C to 125°C (10 min dwell) for 1500 cycles. We also measured the shear strength of the solder joints in various components and observed the microstructural evolution of the solder joints. Based on these results, intermetallic compound (IMC) growth at the solder joints was suppressed by minor Pd, Al and Si additions to the Sn-0.5Cu alloy. After 1500 thermal cycles, IMC layers thicknesses for 100 parts per million (ppm) and 300 ppm Al alloy additions were 6.7 μm and 10 μm, compared to the as-reflowed bonding thicknesses of 6 μm and 7 μm, respectively. Furthermore, shear strength degradation rates for 100 ppm and 300 ppm Al(Si) alloy additions were at least 19.5%-26.2%. The cause of the improvement in thermal cycling reliability was analyzed using the (Al,Cu)-Sn, Si-Sn and Al-Sn phases dispersed around the Cu6Sn5 intermetallic at the solder matrix and bonding interfaces. From these results, we propose the possibility of a mid-temperature Sn-0.5Cu(Pd)-Al(Si)-Ge Pb-free solder for automotive engine compartment electronics.

  10. Study on laser and hot air reflow soldering of PBGA solder ball

    Institute of Scientific and Technical Information of China (English)

    田艳红; 王春青

    2002-01-01

    Laser and hot air reflow soldering of PBGA solder ball was investigated. Experimental results showed that surface quality and shear strength of solder bump reflowed by laser was superior than the solder bump by hot air, and the microstructure within the solder bump reflowed by laser was much finer. Analysis on interfacial reaction showed that eutectic solder reacted with Au/Ni/Cu pad shortly after the solder was melted. Interface of solder bump reflowed by laser consists of a continuous AuSn4 layer and remnant Au element. Needle-like AuSn4 grew sidewise from interface, and then spread out to the entire interface region. A thin layer of Ni3Sn4 intermetallic compound was found at the interface of solder bump reflowed by hot air, and AuSn4 particles distributed within the whole solder bump randomly. The combination effect of the continuous AuSn4 layer and finer eutectic microstructure contributes to the higher shear strength of solder bump reflowed by laser.

  11. Effects of voids on thermal-mechanical reliability of lead-free solder joints

    Directory of Open Access Journals (Sweden)

    Benabou Lahouari

    2014-06-01

    Full Text Available Reliability of electronic packages has become a major issue, particularly in systems used in electrical or hybrid cars where severe operating conditions must be met. Many studies have shown that solder interconnects are critical elements since many failure mechanisms originate from their typical response under thermal cycles. In this study, effects of voids in solder interconnects on the electronic assembly lifetime are estimated based on finite element simulations.

  12. Technical study on Ag-Cu based medium temperature solder prepared by mechanical alloying method%机械合金化法制备Ag-Cu基中温合金钎料工艺研究

    Institute of Scientific and Technical Information of China (English)

    郑苗; 刘薇; 王晓蓉; 陈融; 王天根; 沈杭燕

    2016-01-01

    为研究机械合金化法制备Ag-Cu中温合金钎料的工艺过程,系统分析了球磨工艺参数对合金焊粉粒度及形貌演变的影响,确定了机械合金化制备球磨焊粉的优化工艺参数.采用X射线衍射仪(XRD)、扫描电镜(SEM)和差示扫描量热分析仪(DSC)等分析手段,对合金化过程中物相变化、微观结构及熔化特性进行了表征,并在此基础上进行了Ag-Cu基三元和四元焊粉机械合金化的研究.结果表明:Ag-Cu系合金焊粉经优化工艺(球料比20:1,转速400 r/min,无水乙醇作为工艺控制剂,球磨40 h)球磨后,合金化完全,以过饱和固溶体为基体相;不同组元的添加对于焊粉尺寸形貌和相结构的影响不同.Ag-Cu-10Sn粉末在球磨40 h后生成了以亚稳态的过饱和固溶体Ag(Cu)为主要组成相的合金粉,其金相组织细小均匀,与不锈钢基板之间形成过渡层,有利于增加接头强度.这表明,通过控制球磨工艺和多组元的添加,可改变合金粉末的形貌和相结构,能得到过饱和固溶体为主要组成相的钎料合金,有利于改善钎料的性能.%To study the preparation process of the medium temperature solder powders using mechanical alloying method, the effects of ball-milling parameters on the size and morphology evolution of the powders were systematic studied and optimized. The phase compositions, microstructure and melting properties of the powders were characterized by X-ray diffraction ( XRD ) , scanning electron microscopy ( SEM ) and differential scanning calorimetry (DSC) methods. The mechanical alloying of ternary and quaternary solder powders based on Ag-Cu was also carried out. The results show that Ag-Cu system solder powders can be completely alloyed with the optimized ball-milling parameters:20:1 ball-to-powder weight ratio, 400 r/min milling speed, ethyl alcohol as PCA, milling for 40 h, and the supersaturated solid solutions can be obtained. The different elements additions such

  13. Development of aluminum, manganese, and zinc-doped tin-silver-copper-X solders for electronic assembly

    Science.gov (United States)

    Boesenberg, Adam James

    The global electronic assembly community is striving for a robust replacement for leaded solders due to increased environmental regulations. A family of Pb-free solder alloys based on Sn-Ag-Cu (SAC) compositions has shown promise; but reliability issues in certain assembly and operating environments have arisen. Elemental (X) additions (Al, Mn, Zn) to SAC3595 were developed recently for better control of heterogeneous nucleation in solder joint solidification. Cu substrate solderability of these SAC+X alloys was investigated at concentrations between 0.01-0.25 wt. % using globule wetting balance tests due to concern about increased oxidation during reflow. Asymmetric four point bend (AFPB) tests were conducted on as-soldered and thermally aged specimens to investigate correlation between decreased shear strength and extended aging time; a common phenomenon seen in solder joints in service. Composition dependence of these X additions also was explored in simplified Cu joints by differential scanning calorimetry (DSC) and joint microstructure analysis to determine the coupling between undercooling and solidification morphology on single and multiple reflow cycles. Interesting observations by methods such as x-ray diffraction (XRD) and nano-indentation of SAC solder joints with aluminum elemental additions led to promising results and provided a possible solution to promoting heterogeneous nucleation and high reliability in these solder alloys.

  14. Nano-soldering to single atomic layer

    Science.gov (United States)

    Girit, Caglar O.; Zettl, Alexander K.

    2011-10-11

    A simple technique to solder submicron sized, ohmic contacts to nanostructures has been disclosed. The technique has several advantages over standard electron beam lithography methods, which are complex, costly, and can contaminate samples. To demonstrate the soldering technique graphene, a single atomic layer of carbon, has been contacted, and low- and high-field electronic transport properties have been measured.

  15. Modeling of high temperature- and diffusion-controlled die soldering in aluminum high pressure die casting

    DEFF Research Database (Denmark)

    Domkin, Konstantin; Hattel, Jesper Henri; Thorborg, Jesper

    2009-01-01

    of the die lifetime based on a quantitative analysis of die soldering in the framework of the numerical simulations of the die-casting process. Full 3D simulations of the process, including the filling. solidification, and the die cooling, are carried out using the casting simulation software MAGMAsoft......Soldering of cast alloys to the dies has been a continuing source of die surface damage in the aluminum die-casting industry. To reduce the repair and maintenance costs, an approach to modeling the damage and predicting the die lifetime is required. The aim of the present study is the estimation....... The resulting transient temperature fields on the die surface and in the casting are then post-processed to estimate the die soldering. The present work deals only with the metallurgical/chemical kind of soldering which occurs at high temperatures and involves formation and growth of intermetallic layers...

  16. Correlation Between Sn Grain Orientation and Corrosion in Sn-Ag-Cu Solder Interconnects

    Science.gov (United States)

    Lee, Tae-Kyu; Liu, Bo; Zhou, Bite; Bieler, Thomas; Liu, Kuo-Chuan

    2011-09-01

    The impact of a marine environment on Sn-Ag-Cu interconnect reliability is examined using salt spray exposure followed by thermal cycling. Sn-Ag-Cu solder alloy wafer-level packages, with and without pretreatment with 5% NaCl salt spray, were thermally cycled to failure. The prior salt spray reduced the characteristic lifetime of the Sn-Ag-Cu solder joints by over 43%. Although Sn-based materials show strong resistance to corrosion, the nature of localized corroded areas at critical locations in the solder joint caused significant degradation in the Sn-Ag-Cu solder joints. An important link between the corrosion path and Sn grain orientation was observed using orientation imaging microscopy (OIM). A strong correlation between the corrosion path and grain orientation was identified, indicating that the corrosion attack preferentially followed the basal plane of the Sn lattice.

  17. Climate specific thermomechanical fatigue of flat plate photovoltaic module solder joints

    Energy Technology Data Exchange (ETDEWEB)

    Bosco, Nick; Silverman, Timothy J.; Kurtz, Sarah

    2016-07-01

    FEM simulations of PbSn solder fatigue damage are used to evaluate seven cities that represent a variety of climatic zones. It is shown that the rate of solder fatigue damage is not ranked with the cities' climate designations. For an accurate ranking, the mean maximum daily temperature, daily temperature change and a characteristic of clouding events are all required. A physics-based empirical equation is presented that accurately calculates solder fatigue damage according to these three factors. An FEM comparison of solder damage accumulated through service and thermal cycling demonstrates the number of cycles required for an equivalent exposure. For an equivalent 25-year exposure, the number of thermal cycles (-40 degrees C to 85 degrees C) required ranged from roughly 100 to 630 for the cities examined. It is demonstrated that increasing the maximum cycle temperature may significantly reduce the number of thermal cycles required for an equivalent exposure.

  18. Development of high melting point, environmentally friendly solders, using the calphad approach

    DEFF Research Database (Denmark)

    Chidambaram, Vivek; Hald, John; Hattel, Jesper Henri

    2008-01-01

    An attempt has been made using the CALPHAD approach via Thermo-Calc to explore the various possible chemical compositions that adhere to the melting criterion i.e. 270-350 degrees C, required to replace the traditionally used high lead content solders for first level packaging applications. Various...... of promising solder alloy candidates. The ternary combinations that satisfied the primary solidification requirement were scrutinized taking into account the commercial interests i.e. availability, cost-effectiveness, recyclability and toxicity issues. Technical issues like manufacturability and surface...... tension have also been considered. Special focus has been given to toxicity related issues since the main ideology of looking for an alternative to high lead containing solders is not related to technical issues but due to environmental concerns....

  19. Preliminary Study on Synthesis of Organolead Halide with Lead Derived from Solder Wire

    Science.gov (United States)

    Pratiwi, P.; Rahmi, G. N.; Aimon, A. H.; Iskandar, F.; Abdullah, M.; Nuryadin, B. W.

    2016-08-01

    Organolead halide has attracted great attention for application in perovskite solar cells due to its high power conversion efficiency (PCE) of up to 20.1%. One of the most common perovskite materials is lead based reagent. In this research, we have synthesized organolead halide with lead extracted from solder wire. In the preparation procedure, first PbCl2 and PbI2 are produced by reacting lead from the solder wire with NaCl and KI, which are used as the basic substance for the perovskite material. Then, in order to get perovskite solution, the powders are reacted with methylamine iodide (MAI) in dimethylformamide (DMF) using a solution based method. Further, the spin coating method is used to fabricate perovskite thin film. The XRD peak results agreed with JCPDS Powder Diffraction of PbCl2 and PbI2. Based on FTIR, the transmittance spectra of the organolead mixed halide that was prepared using solder wire lead exhibited absorption peaks identical to organolead mixed halide using commercial lead. The UV-Vis absorbance spectra of the organolead mixed halide from solder wire lead also exhibited the same absorption ability as from commercial lead. Morever, EDS measurement showed that the element composition of the perovskite thin film using lead from solder wire identical to that from commercial lead. This indicates that solder wire lead is suitable enough for organolead halide material synthesis.

  20. Interfacial reactions of Sn-Ag-Cu solders modified by minor Zn alloying addition

    Science.gov (United States)

    Kang, Sung K.; Leonard, Donovan; Shih, Da-Yuan; Gignac, Lynne; Henderson, D. W.; Cho, Sungil; Yu, Jin

    2006-03-01

    The near-ternary eutectic Sn-Ag-Cu alloys have been identified as leading Pb-free solder candidates to replace Pb-bearing solders in microelectronic applications. However, recent investigations on the processing behavior and solder joints reliability assessment have revealed several potential reliability risk factors associated with the alloy system. The formation of large Ag3Sn plates in Sn-Ag-Cu joints, especially when solidified in a relatively slow cooling rate, is one issue of concern. The implications of large Ag3Sn plates on solder joint performance and several methods to control them have been discussed in previous studies. The minor Zn addition was found to be effective in reducing the amount of undercooling required for tin solidification and thereby to suppress the formation of large Ag3Sn plates. The Zn addition also caused the changes in the bulk microstructure as well as the interfacial reaction. In this paper, an in-depth characterization of the interfacial reaction of Zn-added Sn-Ag-Cu solders on Cu and Au/Ni(P) surface finishes is reported. The effects of a Zn addition on modification of the interfacial IMCs and their growth kinetics are also discussed.

  1. Research on Poor Solderability based on the SMT Process Technology%基于SMT的印制板可焊性不良工艺技术研究

    Institute of Scientific and Technical Information of China (English)

    孙亚芬; 安平

    2016-01-01

    There are more factors influencing the solderability of the PCB,and various technological process is very complex.It is difficult to control the overall quality of the PCB.Through combing and analyzing the production process, and combined with the test and verification,the quality problem of poor solderability is located.The methods have certain consulted value and reference significance to the quality problem analysis.%影响印制板可焊性的因素比较多,各种工艺流程比较复杂,批量印制板整体质量控制有一定的难度.通过对生产过程中的流程梳理和分析,并结合检验及试验验证,对引起印制板可焊性不良的原因进行了排查、分析和定位.该分析方法对于类似质量问题的排查具有一定的借鉴和指导意义.

  2. Low cycle fatigue of lead free solder joints

    Energy Technology Data Exchange (ETDEWEB)

    Schemmann, Lars; Wedi, Andre; Baither, Dietmar; Schmitz, Guido [Institut fuer Materialphysik, Westf. Wilhelms-Universitaet, Muenster (Germany)

    2011-07-01

    Presently solders containing lead are banned from consumer electronics. Important alternatives are the Sn-Ag-Cu (SAC) solders and solders containing antimony. This work studies the isothermal low cycle fatigue properties of SAC solders and the SnSb(8) solder. For the experiments, model solder joints were produced and used. They consist of two pure copper plates joined together by a circular disk of solder. Low cycle fatigue experiments were done under displacement control. Furthermore hardness was tested by a micro indenter. In order to find an explanation for the different lifetimes of the solders, several micro structural investigations were performed. For this we used transmission and scanning electron microscopy as well as optical microscopy. The measured data showed a strong relation between lifetime and hardness of the solder alloy. We also found, that the type of solder influences the crack propagation.

  3. Joint Lead-Free Solder Test Program for High Reliability Military and Space Applications

    Science.gov (United States)

    Brown, Christina

    2004-01-01

    Current and future space and defense systems face potential risks from the continued use of tin-lead solder, including: compliance with current environmental regulations, concerns about potential environmental legislation banning lead-containing products, reduced mission readiness, and component obsolescence with lead surface finishes. For example, the United States Environmental Protection Agency (USEPA) has lowered the Toxic Chemical Release reporting threshold for lead to 100 pounds. Overseas, the Waste Electrical and Electronic Equipment (WEEE) and the Restriction on Hazardous Substances (RoHS) Dicctives in Europe and similar mandates in Japan have instilled concern that a legislative body will prohibit the use of lead in aerospace/military electronics soldering. Any potential banning of lead compounds could reduce the supplier base and adversely affect the readiness of missions led by the National Aeronautics and Space Administration (NASA) and the U.S. Department of Defense (DoD). Before considering lead-free electronics for system upgrades or future designs, however, it is important for the DoD and NASA to know whether lead-free solders can meet their systems' requirements. No single lead-free solder is likely to qualify for all defense and space applications. Therefore, it is important to validate alternative solders for discrete applications. As a result of the need for comprehensive test data on the reliability of lead-free solders, a partnership was formed between the DoD, NASA, and several original equipment manufactures (OEMs) to conduct solder-joint reliability (laboratory) testing of three lead-free solder alloys on newly manufactured and reworked circuit cards to generate performance data for high-reliability (IPC Class 3) applications.

  4. A Novel Technique for the Connection of Ceramic and Titanium Implant Components Using Glass Solder Bonding

    Directory of Open Access Journals (Sweden)

    Enrico Mick

    2015-07-01

    Full Text Available Both titanium and ceramic materials provide specific advantages in dental implant technology. However, some problems, like hypersensitivity reactions, corrosion and mechanical failure, have been reported. Therefore, the combining of both materials to take advantage of their pros, while eliminating their respective cons, would be desirable. Hence, we introduced a new technique to bond titanium and ceramic materials by means of a silica-based glass ceramic solder. Cylindrical compound samples (Ø10 mm × 56 mm made of alumina toughened zirconia (ATZ, as well as titanium grade 5, were bonded by glass solder on their end faces. As a control, a two-component adhesive glue was utilized. The samples were investigated without further treatment, after 30 and 90 days of storage in distilled water at room temperature, and after aging. All samples were subjected to quasi-static four-point-bending tests. We found that the glass solder bonding provided significantly higher bending strength than adhesive glue bonding. In contrast to the glued samples, the bending strength of the soldered samples remained unaltered by the storage and aging treatments. Scanning electron microscopy (SEM and energy-dispersive X-ray (EDX analyses confirmed the presence of a stable solder-ceramic interface. Therefore, the glass solder technique represents a promising method for optimizing dental and orthopedic implant bondings.

  5. Numerical simulation of soldered joints and reliability analysis of PLCC components with J-shape leads

    Institute of Scientific and Technical Information of China (English)

    Zhang Liang; Xue Songbai; Lu Fangyan; Han Zongjie; Wang Jianxin

    2008-01-01

    This paper deals with a study on SnPb and lead-free soldered joint reliability of PLCC devices with different lead counts under three kinds of temperature cycle profiles, which is based on non-linear finite element method. By analyzing the stress of soldered joints, it is found that the largest stress is at the area between the soldered joints and the leads, and analysis results indicate that the von Mises stress at the location slightly increases with the increase of lead counts. For PLCC with 84 leads the soldered joints was modeled for three typical loading (273-398 K, 218-398 K and 198-398 K) in order to study the influence of acceleration factors on the reliability of soldered joints. And the estimation of equivalent plastic strain of three different lead-free solder alloys (Sn3.8Ag0.7Cu, Sn3.5Ag and Sn37Pb) was also carried out.

  6. Effect of interface microstructure on the mechanical properties of Pb-free hybrid microcircuit solder joints

    Energy Technology Data Exchange (ETDEWEB)

    Hernandez, C.L.; Vianco, P.T.; Rejent, J.A.

    1998-08-01

    Although Sn-Pb eutectic alloy is widely used as a joining material in the electronics industry, it has well documented environmental and toxicity issues. Sandia National Laboratories is developing alternative solder materials to replace traditional Pb-containing alloys. The alloys are based on the Sn-Ag, Sn-Ag-Bi and Sn-Ag-Bi-Au systems. Prototype hybrid microcircuit (HMC) test vehicles have been developed to evaluate these Pb-free solders, using Au-Pt-Pd thick film metallization. Populated test vehicles with surface mount devices have been designed and fabricated to evaluate the reliability of surface mount solder joints. The test components consist of a variety of dummy chip capacitors and leadless ceramic chip carriers (LCCC`s). Intermetallic compound (IMC) layer reaction products that form at the solder/substrate interface have been characterized and their respective growth kinetics quantified. Thicker IMC layers pose a potential reliability problem with solder joint integrity. Since the IMC layer is brittle, the likelihood of mechanical failure of a joint in service is increased. The effect of microstructure and the response of these different materials to wetting, aging and mechanical testing was also investigated. Solid-state reaction data for intermetallic formation and mechanical properties of the solder joints are reported.

  7. Mechanical properties of Pb-free solder alloys on thick film hybrid microcircuits

    Energy Technology Data Exchange (ETDEWEB)

    Hernandez, C.L.; Vianco, P.T.; Rejent, J.A.; Hosking, F.M.

    1998-03-10

    The technology drivers of the electronics industry continue to be systems miniaturization and reliability, in addition to addressing a variety of important environmental issues. Although the Sn-Pb eutectic alloy is widely used as a joining material in the electronics industry, it has drawn environmental concern due to its Pb content. The solder acts both as an electrical and mechanical connection within the different packaging levels in an electronic device. New Pb-free solders are being developed at Sandia National Laboratories. The alloys are based on the Sn-Ag alloy, having Bi and Au additions. Prototype hybrid microcircuit (HMC) test vehicles have been assembled to evaluate Pb-free solders for Au-Pt-Pd thick film soldering. The test components consist of a variety of dummy chip capacitors and leadless ceramic chip carriers (LCCC`s). The mechanical properties of the joints were evaluated. The reflow profiles and the solid state intermetallic formation reaction will also be presented. Improved solder joint manufacturability and increased fatigue resistance solder alloys are the goals of these materials.

  8. Development of high strength Sn-Mg solder alloys with reasonable ductility

    Science.gov (United States)

    Alam, Md Ershadul; Gupta, Manoj

    2013-09-01

    This study discussed the development of a series of new lead-free Sn-Mg solders by incorporating varying amounts of Mg (0.8, 1.5 and 2.5 wt. %) into pure Sn using disintegrated melt deposition technique followed by room temperature extrusion. All extruded Sn and Sn-Mg solder samples were characterized. Microstructural characterization studies revealed equiaxed grain morphology, minimal porosity and relatively uniform distribution of secondary phase. Better coefficient of thermal expansion was observed for Sn-2.5Mg sample when compared to conventional Sn-37Pb solder. Melting temperature of Sn-1.5Mg was found to be 212°C which is much lower than the conventional Sn-Ag-Cu or Sn-Cu (227°C) solders. Microhardness was increased with increasing amount of Mg in pure Sn. Room temperature tensile test results revealed that newly developed Sn-Mg solders exhibit enhanced strengths (0.2% yield strength and ultimate tensile strength) with comparable (if not better) ductility when compared to other commercially available and widely used Sn-based solder alloys.

  9. Thermomechanical Behavior of Monolithic SN-AG-CU Solder and Copper Fiber Reinforced Solders

    Science.gov (United States)

    2005-09-01

    controlled fatigue life, likely because of increased void -nucleation via creep-fatigue interactions. Since the solder is largely under strain-controlled...to plastically deform the solder in order to break the oxide layers and eliminate some minor voids around the NiTi particles. Figure 32... Underfill Constraint Effects during Thermomechanical Cycling of Flip Chip Solder Joints,” Journal of Electronic Materials, Vol. 31, No. 4, 2002

  10. Finite Element-Assisted Assessment of the Thermo-cyclic Characteristics of Leads Soldered with SnAgCu(+Bi,In) Alloys

    Science.gov (United States)

    Lis, Adrian; Nakanishi, Kohei; Matsuda, Tomoki; Sano, Tomokazu; Minagawa, Madoka; Okamoto, Masahide; Hirose, Akio

    2017-03-01

    Solder joints between leads and printed circuit boards in thin small outline packages were produced with conventional Sn1.0Ag0.7Cu (SAC107) and Sn3.0Ag0.7Cu (SAC305) solders as well as various solder alloys with gradually increasing amounts of Bi (up to 3.0 wt.%) and In (up to 1.0 wt.%) within the SAC107 base solder. The reliability of soldered leads in temperature cycle (TC) tests improved most with solder alloys containing both Bi (1.6 wt.%) and In (0.5 wt.%). Microindentation and electron probe microanalysis mappings revealed that the effect originates from a combination of solution and precipitation strengthening of the initial SAC alloy. The distribution of inelastic strain accumulation (ISA), as a measure for degradation, was determined in the solder joints by finite element calculations. It was shown that defects in the solder proximal to the lead (60-75 μm), which was underpinned by similar cracking characteristics along the lead-solder interface. The ISA was confirmed to be lower in SAC+Bi/In alloys owing to their enhanced elasto-plastic properties. Moreover, the addition of a thin Cu coating on the leads could improve the joint reliability, as suggested by the calculation of the ISA and the acceleration factor.

  11. Nano Coated Lead Free Solders for Sustainable Electronic Waste Management

    Directory of Open Access Journals (Sweden)

    K. Arun Vasantha Geethan

    Full Text Available ABSTRACT Lead has been used in a wide range of applications, but in the past decades it became clear that its high toxicity could cause various problems. Studies indicate that exposure to high concentrations of lead can cause harmful damages to humans. To eliminate the usage of lead in electronic products as an initiative towards electronic waste management (e waste, lead free solders were produced with suitable methods by replacing lead. But lead free solders are not preferred as a substitute of lead because they are poor in their mechanical properties such as tensile strength, shear strength and hardness which are ultimately required for a material to resist failure.Nano-Structured materials and coatings offer the potential for Vital improvements in engineering properties based on improvements in physical and mechanical properties resulting from reducing micro structural features by factors of 100 to 1000 times compared to current engineering materials.

  12. Soldering Chiralities; 2, Non-Abelian Case

    CERN Document Server

    Wotzasek, C

    1996-01-01

    We study the non-abelian extension of the soldering process of two chiral WZW models of opposite chiralities, resulting in a (non-chiral) WZW model living in a 2D space-time with non trivial Riemanian curvature.

  13. Shrink-Fit Solderable Inserts Seal Hermetically

    Science.gov (United States)

    Croucher, William C.

    1992-01-01

    Shrink-fit stainless-steel insert in aluminum equipment housing allows electrical connectors to be replaced by soldering, without degrading hermeticity of housing or connector. Welding could destroy electrostatic-sensitive components and harm housing and internal cables. Steel insert avoids problems because connector soldered directly to it rather than welded to housing. Seals between flange and housing, and between connector and flange resistant to leaks, even after mechanical overloading and thermal shocking.

  14. Wetting Behavior in Ultrasonic Vibration-Assisted Brazing of Aluminum to Graphite Using Sn-Ag-Ti Active Solder

    Science.gov (United States)

    Yu, Wei-Yuan; Liu, Sen-Hui; Liu, Xin-Ya; Shao, Jia-Lin; Liu, Min-Pen

    2015-03-01

    In this study, Sn-Ag-Ti ternary alloy has been used as the active solder to braze pure aluminum and graphite in atmospheric conditions using ultrasonic vibration as an aid. The authors studied the formation, composition and decomposition temperature of the surface oxides of the active solder under atmospheric conditions. In addition, the wettability of Sn-5Ag-8Ti active solder on the surface of pure aluminum and graphite has also been studied. The results showed that the major components presented in the surface oxides formed on the Sn-5Ag-8Ti active solder under ambient conditions are TiO, TiO2, Ti2O3, Ti3O5 and SnO2. Apart from AgO and Ag2O2, which can be decomposed at the brazing temperature (773 K), other oxides will not be decomposed. The oxide layer comprises composite oxides and it forms a compact layer with a certain thickness to enclose the melted solder, which will prevent the liquid solder from wetting the base metals at the brazing temperature. After ultrasonic vibration, the oxide layer was destroyed and the liquid solder was able to wet and spread out around the base materials. Furthermore, better wettability of the active solder was observed on the surface of graphite and pure aluminum at the brazing temperature of 773-823 K using ultrasonic waves. The ultrasonic wave acts as the dominant driving factor which promotes the wetting and spreading of the liquid solder on the surface of graphite and aluminum to achieve a stable and reliable brazed joint.

  15. Temperature versus time curves for manual and automated soldering processes

    Energy Technology Data Exchange (ETDEWEB)

    Trent, M.A.

    1978-08-01

    Temperature-versus-time curves were recorded for various electronic components during pre-tinning, hand soldering, and drag soldering operations to determine the temperature ranges encountered. The component types investigated included a wide range of electronic assemblies. The data collected has been arranged by process and will help engineers to: (1) predetermine the thermal profile to which various components are subjected during the soldering operation; (2) decide--on the basis of component heat sensitivity and the need for thermal relief--where hand soldering would be more feasible than drag soldering; and (3) determine the optimum drag solder control parameters.

  16. Comparison of Extensive Thermal Cycling Effects on Microstructure Development in Micro-alloyed Sn-Ag-Cu Solder Joints

    Energy Technology Data Exchange (ETDEWEB)

    Anderson, Iver E.; Boesenberg, Adam; Harringa, Joel; Riegner, David; Steinmetz, Andrew; Hillman, David

    2011-09-28

    Pb-free solder alloys based on the Sn-Ag-Cu (SAC) ternary eutectic have promise for widespread adoption across assembly conditions and operating environments, but enhanced microstructural control is needed. Micro-alloying with elements such as Zn was demonstrated for promoting a preferred solidification path and joint microstructure earlier in simple (Cu/Cu) solder joints studies for different cooling rates. This beneficial behavior now has been verified in reworked ball grid array (BGA) joints, using dissimilar SAC305 (Sn-3.0Ag-0.5Cu, wt.%) solder paste. After industrial assembly, BGA components joined with Sn-3.5Ag-0.74Cu-0.21Zn solder were tested in thermal cycling (-55 C/+125 C) along with baseline SAC305 BGA joints beyond 3000 cycles with continuous failure monitoring. Weibull analysis of the results demonstrated that BGA components joined with SAC + Zn/SAC305 have less joint integrity than SAC305 joints, but their lifetime is sufficient for severe applications in consumer, defense, and avionics electronic product field environments. Failure analysis of the BGA joints revealed that cracking did not deviate from the typical top area (BGA component side) of each joint, in spite of different Ag3Sn blade content. Thus, SAC + Zn solder has not shown any advantage over SAC305 solder in these thermal cycling trials, but other characteristics of SAC + Zn solder may make it more attractive for use across the full range of harsh conditions of avionics or defense applications.

  17. Integrated environmentally compatible soldering technologies. Final report

    Energy Technology Data Exchange (ETDEWEB)

    Hosking, F.M.; Frear, D.R.; Iman, R.L.; Keicher, D.M.; Lopez, E.P.; Peebles, H.C.; Sorensen, N.R.; Vianco, P.T.

    1994-05-01

    Chemical fluxes are typically used during conventional electronic soldering to enhance solder wettability. Most fluxes contain very reactive, hazardous constituents that require special storage and handling. Corrosive flux residues that remain on soldered parts can severely degrade product reliability. The residues are removed with chlorofluorocarbon (CFC), hydrochlorofluorocarbon (HCFC), or other hazardous solvents that contribute to ozone depletion, release volatile organic compounds into the atmosphere, or add to the solvent waste stream. Alternative materials and processes that offer the potential for the reduction or elimination of cleaning are being developed to address these environmental issues. Timing of the effort is critical, since the targeted chemicals will soon be heavily taxed or banned. DOE`s Office of Environmental Restoration and Waste Management (DOE/EM) has supported Sandia National Laboratories` Environmentally Conscious Manufacturing Integrated Demonstration (ECMID). Part of the ECM program involves the integration of several environmentally compatible soldering technologies for assembling electronics devices. Fluxless or {open_quotes}low-residue/no clean{close_quotes} soldering technologies (conventional and ablative laser processing, controlled atmospheres, ultrasonic tinning, protective coatings, and environmentally compatible fluxes) have been demonstrated at Sandia (SNL/NM), the University of California at Berkeley, and Allied Signal Aerospace-Kansas City Division (AS-KCD). The university demonstrations were directed under the guidance of Sandia staff. Results of the FY93 Soldering ID are presented in this report.

  18. SNL initiatives in electronic fluxless soldering

    Science.gov (United States)

    Hosking, F. M.; Frear, D. R.; Vianco, P. T.; Keicher, D. M.

    Conventional soldering of electronic components generally requires the application of a chemical flux to promote solder wetting and flow. Chlorofluorocarbons (CFC) and halogenated solvents are normally used to remove the resulting flux residues. While such practice has been routinely accepted throughout the electronics industry, the environmental impact of hazardous solvents on ozone depletion will eventually limit or prevent their use. Solvent substitution or alternative technologies must be developed to meet these goals. Sandia National Laboratories (SNL), Albuquerque has a comprehensive environmentally conscious electronics manufacturing program underway that is funded by the DOE Office of Technology Development. Primary elements of the integrated task are the characterization and development of alternative fluxless soldering technologies that would eliminate circuit board cleaning associated with flux residue removal. Storage and handling of hazardous solvents and mixed solvent-flux waste would be consequently reduced during electronics soldering. This paper will report on the progress of the SNL fluxless soldering initiative. Emphasis is placed on the use of controlled atmospheres, laser heating, and ultrasonic soldering.

  19. Use of organic solderability preservatives on solderability retention of copper after accelerated aging

    Energy Technology Data Exchange (ETDEWEB)

    Hernandez, C.L.; Sorensen, N.R.; Lucero, S.J.

    1997-02-01

    Organic solderability preservatives (OSP`s) have been used by the electronics industry for some time to maintain the solderability of circuit boards and components. Since solderability affects both manufacturing efficiency and product reliability, there is significant interest in maintaining good solder wettability. There is often a considerable time interval between the initial fabrication of a circuit board or component and its use at the assembly level. Parts are often stored under a variety of conditions, in many cases not well controlled. Solder wettability can deteriorate during storage, especially in harsh environments. This paper describes the ongoing efforts at Sandia National Laboratories to quantify solder watability on bare and aged copper surfaces. Benzotriazole and imidazole were applied to electronic grade copper to retard aging effects on solderability. The coupons were introduced into Sandia`s Facility for Atmospheric Corrosion Testing (FACT) to simulate aging in a typical indoor industrial environment. H{sub 2}S, NO{sub 2} and Cl{sub 2} mixed gas was introduced into the test cell and maintained at 35{degrees}C and 70% relative humidity for test periods of one day to two weeks. The OSP`s generally performed better than bare Cu, although solderability diminished with increasing exposure times.

  20. Mechanical Deformation Behavior of Sn-Ag-Cu Solders with Minor Addition of 0.05 wt.% Ni

    Science.gov (United States)

    Hammad, A. E.; El-Taher, A. M.

    2014-11-01

    The aim of the present work is to develop a comparative evaluation of the microstructural and mechanical deformation behavior of Sn-Ag-Cu (SAC) solders with the minor addition of 0.05 wt.% Ni. Test results showed that, by adding 0.05Ni element into SAC solders, generated mainly small rod-shaped (Cu,Ni)6Sn5 intermetallic compounds (IMCs) inside the β-Sn phase. Moreover, increasing the Ag content and adding Ni could result in the change of the shape and size of the IMC precipitate. Hence, a significant improvement is observed in the mechanical properties of SAC solders with increasing Ag content and Ni addition. On the other hand, the tensile results of Ni-doped SAC solders showed that both the yield stress and ultimate tensile strengths decrease with increasing temperature and with decreasing strain rate. This behavior was attributed to the competing effects of work hardening and dynamic recovery processes. The Sn-2.0Ag-0.5Cu-0.05Ni solder displayed the highest mechanical properties due to the formation of hard (Cu,Ni)6Sn5 IMCs. Based on the obtained stress exponents and activation energies, it is suggested that the dominant deformation mechanism in SAC (205)-, SAC (0505)- and SAC (0505)-0.05Ni solders is pipe diffusion, and lattice self-diffusion in SAC (205)-0.05Ni solder. In view of these results, the Sn-2.0Ag-0.5Cu-0.05Ni alloy is a more reliable solder alloy with improved properties compared with other solder alloys tested in the present work.

  1. Utility-based Recommendation of Candidate Coalitions in Virtual Creativity Teams

    NARCIS (Netherlands)

    Sie, Rory; Bitter-Rijpkema, Marlies; Sloep, Peter

    2010-01-01

    Sie, R. L. L., Bitter-Rijpkema, M. E., & Sloep, P. B. (2010, 28-30 September). Utility-based Recommendation of Candidate Coalitions in Virtual Creativity Teams. Presentation at the first Workshop on Recommender Systems in Technology Enhanced Learning (RecSysTEL 2010), Barcelona, Spain.

  2. A three-dimensional measurement method based on mesh candidates assisted with structured light

    Science.gov (United States)

    Xu, Gang; Zhang, Wenming; Li, Haibin; Liu, Bin

    2009-07-01

    Rendering three-dimensional information of a scene from optical measurement is very important for a wide variety of applications such as robot navigation, rapid prototyping, medical imaging, industrial inspection, etc. In this paper, a new 3D measurement method based on mesh candidate with structured light illuminating is proposed. The vision sensor consists of two CCD cameras and a DLP projector. The measurement system combines the technology of binocular stereo vision and structured light, so as to simplify the process of acquiring depth information using mesh candidates. The measurement method is based on mesh candidates which represent the potential depth in the three dimensional scene. First the mesh grid was created along the direction of axes in world coordinate system, and the nodes were considered as depth candidates on the surface of object. Then each group of the mesh nodes varying along z axis were mapped to the captured image planes of both cameras. At last, according to the similarity measure of the corresponding pixel pairs, the depth of the object surface can be obtained. The matching process is between the pixels in both camera planes corresponding to the spatial mesh candidates. Aided by the structured light pattern, the accuracy of measurement system improved. Appending the periodic sawtooth pattern on the scene by structured light made measurement easier, while the computational cost did not increased since the projector had no need to be calibrated. The 3DS MAX and Matlab software were used to simulate measurement system and reconstruct the surface of the object. After the positioned cameras have been calibrated using Matlab calibration toolbox, the projector is used to project structured light pattern on the scene. Indicated by experimental results, the mesh-candidate-based method is obviously superior in computation and accuracy. Compared with traditional methods based on image matching, our method has several advantages: (1) the complex

  3. Evaluation technology of lead-free solders; Namari free handa zairyo ni okeru hyoka gijutsu

    Energy Technology Data Exchange (ETDEWEB)

    Yamashita, M.; Shiokawa, K. [Fuji Electric Co. Ltd., Tokyo (Japan); Ueda, A. [Fuji Electric Corporate Research and Development,Ltd., Kanagawa (Japan)

    2000-09-10

    Solders mainly composed of tin and lead are currently in widespread use in semiconductor devices. However, in view of lead influences on the human body and environmental problems, lead-free solders have been in urgent demand. In this study, aiming to improve the solderability and reliability of a tin-silver solder, one of most promising lead-free solder materials, we have investigated elements to be added. Focusing on typical lead-free tin-silver solders and tin-lead eutectic solders, this paper describes the result of investigations into the mechanical properties solderability, micro structures of the solder materials and gas analysis in soldering. (author)

  4. Age-aware solder performance models : level 2 milestone completion.

    Energy Technology Data Exchange (ETDEWEB)

    Neilsen, Michael K.; Vianco, Paul Thomas; Neidigk, Matthew Aaron; Holm, Elizabeth Ann

    2010-09-01

    Legislated requirements and industry standards are replacing eutectic lead-tin (Pb-Sn) solders with lead-free (Pb-free) solders in future component designs and in replacements and retrofits. Since Pb-free solders have not yet seen service for long periods, their long-term behavior is poorly characterized. Because understanding the reliability of Pb-free solders is critical to supporting the next generation of circuit board designs, it is imperative that we develop, validate and exercise a solder lifetime model that can capture the thermomechanical response of Pb-free solder joints in stockpile components. To this end, an ASC Level 2 milestone was identified for fiscal year 2010: Milestone 3605: Utilize experimentally validated constitutive model for lead-free solder to simulate aging and reliability of solder joints in stockpile components. This report documents the completion of this milestone, including evidence that the milestone completion criteria were met and a summary of the milestone Program Review.

  5. Fundamentals of lead-free solder interconnect technology from microstructures to reliability

    CERN Document Server

    Lee, Tae-Kyu; Kim, Choong-Un; Ma, Hongtao

    2015-01-01

    This unique book provides an up-to-date overview of the fundamental concepts behind lead-free solder and interconnection technology. Readers will find a description of the rapidly increasing presence of electronic systems in all aspects of modern life as well as the increasing need for predictable reliability in electronic systems. The physical and mechanical properties of lead-free solders are examined in detail, and building on fundamental science, the mechanisms responsible for damage and failure evolution, which affect reliability of lead-free solder joints are identified based on microstructure evolution.  The continuing miniaturization of electronic systems will increase the demand on the performance of solder joints, which will require new alloy and processing strategies as well as interconnection design strategies. This book provides a foundation on which improved performance and new design approaches can be based.  In summary, this book:  Provides an up-to-date overview on lead-free soldering tech...

  6. Application of robust color composite fringe in flip-chip solder bump 3-D measurement

    Science.gov (United States)

    Kuo, Chung-Feng Jeffrey; Wu, Han-Cheng

    2017-04-01

    This study developed a 3-D measurement system based on flip-chip solder bump, used fringes with different modulation intensities in color channels, in order to produce color composite fringe with robustness, and proposed a multi-channel composite phase unwrapping algorithm, which uses fringe modulation weights of different channels to recombine the phase information for better measurement accuracy and stability. The experimental results showed that the average measurement accuracy is 0.43μm and the standard deviation is 1.38 μm. The results thus proved that the proposed 3-D measurement system is effective in measuring a plane with a height of 50 μm. In the flip-chip solder bump measuring experiment, different fringe modulation configurations were tested to overcome the problem of reflective coefficient between the flip-chip base board and the solder bump. The proposed system has a good measurement results and robust stability in the solder bump measurement, and can be used for the measurement of 3-D information for micron flip-chip solder bump application.

  7. Microstructural evolution of eutectic Au-Sn solder joints

    Energy Technology Data Exchange (ETDEWEB)

    Song, Ho Geon

    2002-05-31

    Current trends toward miniaturization and the use of lead(Pb)-free solder in electronic packaging present new problems in the reliability of solder joints. This study was performed in order to understand the microstructure and microstructural evolution of small volumes of nominally eutectic Au-Sn solder joints (80Au-20Sn by weight), which gives insight into properties and reliability.

  8. Efforts to Develop a 300°C Solder

    Energy Technology Data Exchange (ETDEWEB)

    Norann, Randy A [Perma Works LLC

    2015-01-25

    This paper covers the efforts made to find a 300°C electrical solder solution for geothermal well monitoring and logging tools by Perma Works LLC. This paper covers: why a high temperature solder is needed, what makes for a good solder, testing flux, testing conductive epoxy and testing intermetallic bonds. Future areas of research are suggested.

  9. Effect of Solder Flux Residues on Corrosion of Electronics

    DEFF Research Database (Denmark)

    Hansen, Kirsten Stentoft; Jellesen, Morten Stendahl; Møller, Per

    2009-01-01

    Flux from ‘No Clean’ solder processes can cause reliability problems in the field due to aggressive residues, which may be electrical conducting or corrosive in humid environments. The solder temperature during a wave solder process is of great importance to the amount of residues left on a PCBA[...

  10. Microstructural evolution of eutectic Au-Sn solder joints

    Energy Technology Data Exchange (ETDEWEB)

    Song, Ho Geon [Univ. of California, Berkeley, CA (United States)

    2002-05-01

    Current trends toward miniaturization and the use of lead(Pb)-free solder in electronic packaging present new problems in the reliability of solder joints. This study was performed in order to understand the microstructure and microstructural evolution of small volumes of nominally eutectic Au-Sn solder joints (80Au-20Sn by weight), which gives insight into properties and reliability.

  11. Multistate Degradation Mo del for Prognostics of Solder Joints Under Vibration Conditions

    Institute of Scientific and Technical Information of China (English)

    TANG Wei; JING Bo; HUANG Yifeng; SHENG Zengjin; JIAO Xiaoxuan

    2016-01-01

    This paper develops a multistate degra-dation structure of the solder joints which can be used under various vibration conditions based on nonhomoge-neous continuous-time hidden semi-Markov process. The parameters of the structure were estimated to illustrate the stochastic relationship between the degradation pro-cess and the monitoring indicator by using unsupervised learning methods. Random vibration tests on solder joints with different levels of power spectral density and fixed forms were conducted with a real time monitoring electri-cal resistance to examine the suitability of the model. It was experimentally verified that the multistate degrada-tion structure matches the experimental process reason-ably and accurately. Based on this multistate degradation model, the online prognostics of solder joint were analyzed and the results indicated that faults or failures can be de-tected timely, leading to appreciate maintenance actions scheduled to avoid catastrophic failures of electronics.

  12. Wetting and Soldering Behavior of Eutectic Au-Ge Alloy on Cu and Ni Substrates

    Science.gov (United States)

    Leinenbach, C.; Valenza, F.; Giuranno, D.; Elsener, H. R.; Jin, S.; Novakovic, R.

    2011-07-01

    Au-Ge-based alloys are interesting as novel high-temperature lead-free solders because of their low melting point, good thermal and electrical conductivity, and high corrosion resistance. In the present work, the wetting and soldering behavior of the eutectic Au-28Ge (at.%) alloy on Cu and Ni substrates have been investigated. Good wetting on both substrates with final contact angles of 13° to 14° was observed. In addition, solder joints with bond shear strength of 30 MPa to 35 MPa could be produced under controlled conditions. Cu substrates exhibit pronounced dissolution into the Au-Ge filler metal. On Ni substrates, the NiGe intermetallic compound was formed at the filler/substrate interface, which prevents dissolution of Ni into the solder. Using thin filler metal foils (25 μm), complete consumption of Ge in the reaction at the Ni interface was observed, leading to the formation of an almost pure Au layer in the soldering zone.

  13. In situ X-ray observation and simulation of ratcheting-fatigue interactions in solder joints

    Science.gov (United States)

    Shi, Liting; Mei, Yunhui; Chen, Gang; Chen, Xu

    2017-01-01

    Reflow voids created by solder oxidation reduce the reliability of lap joints. In situ visualization of reflow voids in Sn-3Ag-0.5Cu (SAC305) lap-shear solder joints under cyclic stressing was realized by X-ray computed tomography (CT), while the ratcheting deformation of the solder joints was monitored by a non-contact displacement detecting system (NDDS). The results revealed that the shape evolution of reflow voids in solder joints, as characterized by the sphericity of the voids, can be divided into three stages: i.e., the initial stage with a sharp drop, a stable stage, and a rapidly declining stage. A new evolution law for describing the progress of sphericity was proposed, and was further introduced into a viscoplastic constitutive model based on the OW-AF nonlinear kinematic hardening rule. The damage-coupled OW-AF model yielded an accurate estimation of the whole-life ratcheting behavior of Sn-3Ag-0.5Cu (SAC305) lap-shear solder joints. [Figure not available: see fulltext.

  14. A Study of the Interface of Soldered Joints of SnInAgTi Active Solder with Ito Ceramics

    OpenAIRE

    M. Provazník; R. Koleňák

    2010-01-01

    This paper presents an analysis of the solderability ITO ceramics (In2O3/SnO2). The soft active solder SnInAgeTi was used for the experiments. The solder was activated by power ultrasound in air without flux. An analysis of the interface of the phases between the solder and the ceramic was carried out in order to discover the ultrasonic impacts on the active metal and to identify the mechanism of the joint on the ceramic side.

  15. Decomposition of no-clean solder flux systems and their effects on the corrosion reliability of electronics

    DEFF Research Database (Denmark)

    Conseil, Helene; Verdingovas, Vadimas; Jellesen, Morten Stendahl

    2016-01-01

    of temperature, thus simulating the soldering process. Differential Scanning Calorimetry, Fourier Transform Infrared Spectroscopy, and Ion Chromatography were employed for decomposition and residue analysis. Aggressiveness of the residue was investigated using a pH indicator gel test and by acid value......No-clean flux systems are used today for the soldering of electronic printed circuit board assemblies assuming that all the aggressive substances of the flux will vanish during the soldering process i.e. evaporate, decompose or being enclosed safely in the residues. However this is not true in most...... cases, as the flux residue left on a printed circuit board assembly is a key factor compromising the corrosion reliability under humid conditions. This investigation focuses on the chemical degradation of three kinds of solder flux systems based on adipic, succinic, and glutaric acid as a function...

  16. A Simulation for Content-based and Utility-based Recommendation of Candidate Coalitions in Virtual Creativity Teams

    NARCIS (Netherlands)

    Sie, Rory; Bitter-Rijpkema, Marlies; Sloep, Peter

    2010-01-01

    Sie, R. L. L., Bitter-Rijpkema, M. E., Sloep, P. B. (2010). A Simulation for Content-based and Utility-based Recommendation of Candidate Coalitions in Virtual Creativity Teams. 1st Workshop on Recommender Systems for Technology Enhanced Learning (RecSysTEL 2010). September, 29 -30, 2010, Barcelona,

  17. A novel method for direct solder bump pull testing using lead-free solders

    Science.gov (United States)

    Turner, Gregory Alan

    This thesis focuses on the design, fabrication, and evaluation of a new method for testing the adhesion strength of lead-free solders, named the Isotraction Bump Pull method (IBP). In order to develop a direct solder joint-strength testing method that did not require customization for different solder types, bump sizes, specific equipment, or trial-and-error, a combination of two widely used and accepted standards was created. First, solder bumps were made from three types of lead free solder were generated on untreated copper PCB substrates using an in-house fabricated solder bump-on-demand generator, Following this, the newly developed method made use of a polymer epoxy to encapsulate the solder bumps that could then be tested under tension using a high precision universal vertical load machine. The tests produced repeatable and predictable results for each of the three alloys tested that were in agreement with the relative behavior of the same alloys using other testing methods in the literature. The median peak stress at failure for the three solders tested were 2020.52 psi, 940.57 psi, and 2781.0 psi, and were within one standard deviation of the of all data collected for each solder. The assumptions in this work that brittle fracture occurred through the Intermetallic Compound layer (IMC) were validated with the use of Energy-Dispersive X-Ray Spectrometry and high magnification of the fractured surface of both newly exposed sides of the test specimens. Following this, an examination of the process to apply the results from the tensile tests into standard material science equations for the fracture of the systems was performed..

  18. Capillary wave formation on excited solder jet and fabrication of lead-free solder ball

    Institute of Scientific and Technical Information of China (English)

    ZHANG Shu-guang; HE Li-jun; ZHU Xue-xin; ZHANG Shao-ming; SHI Li-kai; XU Jun

    2005-01-01

    A survey of solder ball production processes especially focusing on disturbed molten metal jet breakup process was made. Then the formation of capillary wave on tin melt jet in the way of rapid solidification was studied. A semi-empirical formula, which can be written as λ = Cvib (σ/ρ)1/3f-2/3 to predict the relationship between wavelength of capillary wave and frequency of imposed vibration was obtained. Sn-4.0Ag-0.5Cu lead free solder ball was successfully produced with tight distribution and good sphericity. The excited jet breakup process is promising for cost effectively producing solder ball.

  19. Controlling Ag3Sn plate formation in near-ternary-eutectic Sn-Ag-Cu solder by minor Zn alloying

    Science.gov (United States)

    Kang, Sung K.; Shih, Da-Yuan; Leonard, Donovan; Henderson, Donald W.; Gosselin, Timothy; Cho, Sung-Il; Yu, Jin; Choi, Won K.

    2004-06-01

    As a result of extensive studies, nearternary-eutectic Sn-Ag-Cu (SAC) alloys have been identified as the leading lead-free solder candidates to replace lead-bearing solders for ball-grid array module assembly. However, recent studies revealed several potential reliability risk factors associated with the alloy system. The formation of large Ag3Sn plates in solder joints, especially when solidified at a relatively slow cooling rate, poses a reliability concern. In this study, the effect of adding a minor amount of zinc in SAC alloy was investigated. The minor zinc addition was shown to reduce the amount of undercooling during solidification and thereby suppress the formation of large Ag3Sn plates. In addition, the zinc was found to cause changes in both the microstructure and interfacial reaction of the solder joint. The interaction of zinc with other alloying elements in the solder was also investigated for a better understanding of the role of zinc during solidification of the nearternary-eutectic alloys.

  20. Dissolution and Interfacial Reactions of (Cu,Ni)6Sn5 Intermetallic Compound in Molten Sn-Cu-Ni Solders

    Science.gov (United States)

    Wang, Chao-hong; Lai, Wei-han; Chen, Sinn-wen

    2014-01-01

    (Cu,Ni)6Sn5 is an important intermetallic compound (IMC) in lead-free Sn-Ag-Cu solder joints on Ni substrate. The formation, growth, and microstructural evolution of (Cu,Ni)6Sn5 are closely correlated with the concentrations of Cu and Ni in the solder. This study reports the interfacial behaviors of (Cu,Ni)6Sn5 IMC (Sn-31 at.%Cu-24 at.%Ni) with various Sn-Cu, Sn-Ni, and Sn-Cu-Ni solders at 250°C. The (Cu,Ni)6Sn5 substrate remained intact for Sn-0.7 wt.%Cu solder. When the Cu concentration was decreased to 0.3 wt.%, (Cu,Ni)6Sn5 significantly dissolved into the molten solder. Moreover, (Cu,Ni)6Sn5 dissolution and (Ni,Cu)3Sn4 formation occurred simultaneously for the Sn-0.1 wt.%Ni solder. In Sn-0.5 wt.%Cu-0.2 wt.%Ni solder, many tiny (Cu,Ni)6Sn5 particulates were formed and dispersed in the solder matrix, while in Sn-0.3 wt.%Cu-0.2 wt.%Ni a lot of (Ni,Cu)3Sn4 grains were produced. Based on the local equilibrium hypothesis, these results are further discussed based on the liquid-(Cu, Ni)6Sn5-(Ni,Cu)3Sn4 tie-triangle, and the liquid apex is suggested to be very close to Sn-0.4 wt.%Cu-0.2 wt.%Ni.

  1. Using Bayesian Networks for Candidate Generation in Consistency-based Diagnosis

    Science.gov (United States)

    Narasimhan, Sriram; Mengshoel, Ole

    2008-01-01

    Consistency-based diagnosis relies heavily on the assumption that discrepancies between model predictions and sensor observations can be detected accurately. When sources of uncertainty like sensor noise and model abstraction exist robust schemes have to be designed to make a binary decision on whether predictions are consistent with observations. This risks the occurrence of false alarms and missed alarms when an erroneous decision is made. Moreover when multiple sensors (with differing sensing properties) are available the degree of match between predictions and observations can be used to guide the search for fault candidates. In this paper we propose a novel approach to handle this problem using Bayesian networks. In the consistency- based diagnosis formulation, automatically generated Bayesian networks are used to encode a probabilistic measure of fit between predictions and observations. A Bayesian network inference algorithm is used to compute most probable fault candidates.

  2. Solder Joint Health Monitoring Testbed System

    Science.gov (United States)

    Delaney, Michael M.

    2009-01-01

    The density and pin count for Field Programmable Gate Arrays (FPGAs) has been increasing, and has exceeded current methods of solder joint inspection, making early detection of failures more problematic. These failures are a concern for both flight safety and maintenance in commercial aviation. Ridgetop Group, Inc. has developed a method for detecting solder joint failures in real time. The NASA Dryden Flight Research Center is developing a set of boards to test this method in ground environmental and accelerated testing as well as flight test on a Dryden F-15 or F-18 research aircraft. In addition to detecting intermittent and total solder joint failures, environmental data on the boards, such as temperature and vibration, will be collected and time-correlated to aircraft state data. This paper details the technical approach involved in the detection process, and describes the design process and products to date for Dryden s FPGA failure detection boards.

  3. Pb-Free Soldering Iron Temperature Controller

    Science.gov (United States)

    Hamane, Hiroto; Wajima, Kenji; Hayashi, Yoichi; Komiyama, Eiichi; Tachibana, Toshiaki; Miyazaki, Kazuyoshi

    Recently, much importance has been attached to the environmental problem. The content of two directives to better control the management of waste electronic equipment was approved. The two directives are the Waste from Electrical and Electronic Equipment (WEEE) and the Restriction of Hazardous Substances (RoHS). These set phase-out dates for the use of lead materials contained in electronic products. Increasingly, attention is focusing on the potential use of Pb-free soldering in electronics manufacturing. It should be noted that many of the current solding irons are not suitable for Pb-free technology, due to the inferior wetting ability of Pb-free alloys compared with SnPb solder pastes. This paper presents a Pb-free soldering iron temperature controller using an embedded micro-processor with a low memory capacity.

  4. Comparative Evaluation of Marginal Accuracy of a Cast Fixed Partial Denture Compared to Soldered Fixed Partial Denture Made of Two Different Base Metal Alloys and Casting Techniques: An In vitro Study.

    Science.gov (United States)

    Jei, J Brintha; Mohan, Jayashree

    2014-03-01

    The periodontal health of abutment teeth and the durability of fixed partial denture depends on the marginal adaptation of the prosthesis. Any discrepancy in the marginal area leads to dissolution of luting agent and plaque accumulation. This study was done with the aim of evaluating the accuracy of marginal fit of four unit crown and bridge made up of Ni-Cr and Cr-Co alloys under induction and centrifugal casting. They were compared to cast fixed partial denture (FPD) and soldered FPD. For the purpose of this study a metal model was fabricated. A total of 40 samples (4-unit crown and bridge) were prepared in which 20 Cr-Co samples and 20 Ni-Cr samples were fabricated. Within these 20 samples of each group 10 samples were prepared by induction casting technique and other 10 samples with centrifugal casting technique. The cast FPD samples obtained were seated on the model and the samples were then measured with travelling microscope having precision of 0.001 cm. Sectioning of samples was done between the two pontics and measurements were made, then the soldering was made with torch soldering unit. The marginal discrepancy of soldered samples was measured and all findings were statistically analysed. The results revealed minimal marginal discrepancy with Cr-Co samples when compared to Ni-Cr samples done under induction casting technique. When compared to cast FPD samples, the soldered group showed reduced marginal discrepancy.

  5. Relative effect of solder flux chemistry on the humidity related failures in electronics

    DEFF Research Database (Denmark)

    Verdingovas, Vadimas; Jellesen, Morten Stendahl; Ambat, Rajan

    2015-01-01

    was visualized by the ex situ analysis using a gel with tin ion indicator. Findings - The results showed that the solder flux residues are characterized by different threshold RH, above which a sudden increase in direct current leakage by 2-4 orders of magnitude and a significant reduction in surface resistance...... was studied by quartz crystal microbalance, while corrosive effects were studied by leakage current and impedance measurements on standard test boards. The measurements were performed as a function of relative humidity (RH) in the range from 60 to ~99 per cent at 25°C. The corrosiveness of solder flux systems...... of printed circuit boards under humid conditions. Originality/value - The classification of solder flux systems according to IPC J-STD-004 standard does not specify the WOAs in the flux; however, ranking of the flux systems based on the hygroscopic property of activators would be useful information when...

  6. A statistical mechanics model to predict electromigration induced damage and void growth in solder interconnects

    Science.gov (United States)

    Wang, Yuexing; Yao, Yao; Keer, Leon M.

    2017-02-01

    Electromigration is an irreversible mass diffusion process with damage accumulation in microelectronic materials and components under high current density. Based on experimental observations, cotton type voids dominate the electromigration damage accumulation prior to cracking in the solder interconnect. To clarify the damage evolution process corresponding to cotton type void growth, a statistical model is proposed to predict the stochastic characteristic of void growth under high current density. An analytical solution of the cotton type void volume growth over time is obtained. The synchronous electromigration induced damage accumulation is predicted by combining the statistical void growth and the entropy increment. The electromigration induced damage evolution in solder joints is developed and applied to verify the tensile strength deterioration of solder joints due to electromigration. The predictions agree well with the experimental results.

  7. High-precision optomechanical lens system for space applications assembled by a local soldering technique

    Science.gov (United States)

    Pleguezuelo, Pol Ribes; Koechlin, Charlie; Hornaff, Marcel; Kamm, Andreas; Beckert, Erik; Fiault, Guillaume; Eberhardt, Ramona; Tünnermann, Andreas

    2016-06-01

    Soldering using metallic solder alloys is an alternative to adhesive bonding. Laser-based soldering processes are especially well suited for the joining of optical components made of fragile and brittle materials such as glass, ceramics, and optical crystals. This is due to a localized and minimized input of thermal energy. Solderjet bumping technology has been used to assemble a lens mount breadboard using specifications and requirements found for the optical beam expander for the European Space Agency EarthCare Mission. The silica lens and a titanium barrel have been designed and assembled with this technology in order to withstand the stringent mission demands of handling high mechanical and thermal loads without losing the optical performance. Finally, a high-precision optomechanical lens mount has been assembled with minimal localized stress (<1 MPa) showing outstanding performance in terms of wave-front error and beam depolarization ratio before and after environmental tests.

  8. Single Image Camera Calibration in Close Range Photogrammetry for Solder Joint Analysis

    Science.gov (United States)

    Heinemann, D.; Knabner, S.; Baumgarten, D.

    2016-06-01

    Printed Circuit Boards (PCB) play an important role in the manufacturing of electronic devices. To ensure a correct function of the PCBs a certain amount of solder paste is needed during the placement of components. The aim of the current research is to develop an real-time, closed-loop solution for the analysis of the printing process where solder is printed onto PCBs. Close range photogrammetry allows for determination of the solder volume and a subsequent correction if necessary. Photogrammetry is an image based method for three dimensional reconstruction from two dimensional image data of an object. A precise camera calibration is indispensable for an accurate reconstruction. In our certain application it is not possible to use calibration methods with two dimensional calibration targets. Therefore a special calibration target was developed and manufactured, which allows for single image camera calibration.

  9. Effect of trace elements on the interface reactions between two lead-free solders and copper or nickel substrates

    Directory of Open Access Journals (Sweden)

    Soares D.

    2007-01-01

    Full Text Available Traditional Sn-Pb solder alloys are being replaced, because of environmental and health concerns about lead toxicity. Among some alternative alloy systems, the Sn-Zn and Sn-Cu base alloy systems have been studied and reveal promising properties. The reliability of a solder joint is affected by the solder/substrate interaction and the nature of the layers formed at the interface. The solder/substrate reactions, for Sn-Zn and Sn-Cu base solder alloys, were evaluated in what concerns the morphology and chemical composition of the interface layers. The effect of the addition of P, at low levels, on the chemical composition of the layers present at the interface was studied. The phases formed at the interface between the Cu or Ni substrate and a molten lead-free solder at 250ºC, were studied for different stage times and alloy compositions. The melting temperatures, of the studied alloys, were determined by Differential Scanning Calorimetry (DSC. Identification of equilibrium phases formed at the interface layer, and the evaluation of their chemical composition were performed by Scanning Electron Microscopy (SEM/EDS. Different interface characteristics were obtained, namely for the alloys containing Zn. The obtained IML layer thickness was compared, for both types of alloy systems.

  10. Moisture and aging effects of solder wettability of copper surfaces

    Energy Technology Data Exchange (ETDEWEB)

    Hernandez, C.L.; Sorensen, N.R.; Lucero, S.J.

    1996-12-01

    Solderability is a critical property of electronic assembly that affects both manufacturing efficiency and product reliability. There is often a considerable time interval between initial fabrication of a circuit board or component and its use at the assembly level. Parts are often stored under a variety of conditions, usually not controlled. Solder wettability can soon deteriorate during storage, especially in extreme environments. This paper describes ongoing efforts at Sandia to quantify solder wettability on bare and aged Cu surfaces. In addition, organic solderability preservatives (OSPs) were applied to the bare Cu to retard solderability loss due to aging. The OSPs generally performed well, although wetting did decrease with exposure time.

  11. Parametric study on the solderability of etched PWB copper

    Energy Technology Data Exchange (ETDEWEB)

    Hosking, F.M.; Stevenson, J.O.; Hernandez, C.L.

    1996-10-01

    The rapid advancement of interconnect technology has resulted in a more engineered approach to designing and fabricating printed wiring board (PWB) surface features. Recent research at Sandia National Laboratories has demonstrated the importance of surface roughness on solder flow. This paper describes how chemical etching was used to enhance the solderability of surfaces that were normally difficult to wet. The effects of circuit geometry, etch concentration, and etching time on solder flow are discussed. Surface roughness and solder flow data are presented. The results clearly demonstrate the importance of surface roughness on the solderability of fine PWB surface mount features.

  12. Intelligent computing budget allocation for on-road tra jectory planning based on candidate curves

    Institute of Scientific and Technical Information of China (English)

    Xiao-xin FU; Yong-heng JIANG; De-xian HUANG; Jing-chun WANG; Kai-sheng HUANG

    2016-01-01

    In this paper, on-road trajectory planning is solved by introducing intelligent computing budget allocation (ICBA) into a candidate-curve-based planning algorithm, namely, ordinal-optimization-based differential evolution (OODE). The proposed algorithm is named IOODE with‘I’ representing ICBA. OODE plans the trajectory in two parts: trajectory curve and acceleration profi le. The best trajectory curve is picked from a set of candidate curves, where each curve is evaluated by solving a subproblem with the differential evolution (DE) algorithm. The more iterations DE performs, the more accurate the evaluation will become. Thus, we intelligently allocate the iterations to individual curves so as to reduce the total number of iterations performed. Meanwhile, the selected best curve is ensured to be one of the truly top curves with a high enough probability. Simulation results show that IOODE is 20% faster than OODE while maintaining the same performance in terms of solution quality. The computing budget allocation framework presented in this paper can also be used to enhance the efficiency of other candidate-curve-based planning methods.

  13. Lead (Pb)-Free Solder Applications

    Energy Technology Data Exchange (ETDEWEB)

    VIANCO,PAUL T.

    2000-08-15

    Legislative and marketing forces both abroad and in the US are causing the electronics industry to consider the use of Pb-free solders in place of traditional Sn-Pb alloys. Previous case studies have demonstrated the satisfactory manufacturability and reliability of several Pb-free compositions for printed circuit board applications. Those data, together with the results of fundamental studies on Pb-free solder materials, have indicated the general feasibility of their use in the broader range of present-day, electrical and electronic components.

  14. Finite element simulation for mechanical response of surface mounted solder joints under different temperature cycling

    Institute of Scientific and Technical Information of China (English)

    马鑫; 钱乙余

    2001-01-01

    Nonlinear finite element simulation for mechanical response of surface mounted solder joint under different temperature cycling was carried out. Seven sets of parameters were used in order to evaluate the influence of temperature cycling profile parameters. The results show that temperature cycling history has significant effect on the stress response of the solder joint. Based on the concept of relative damage stress proposed by the authors, it is found that enough high temperature holding time is necessary for designing the temperature cycling profile in accelerated thermal fatigue test.

  15. Prototype circuit boards assembled with non-lead bearing solders

    Energy Technology Data Exchange (ETDEWEB)

    Vianco, P.T.; Rejent, J.A.

    1998-04-01

    The 91.84Sn-3.33Ag-4.83Bi and 96.5Sn-3.5Ag Pb-free solders were evaluated for surface mount circuit board interconnects. The 63Sn-37Pb solder provided the baseline data. All three solders exhibited suitable manufacturability per a defect analyses of circuit board test vehicles. Thermal cycling had no significant effect on the 91.84Sn-3.33Ag-4.83Bi solder joints. Some degradation in the form of grain boundary sliding was observed in 96.5Sn-3.5Ag and 63Sn-37Pb solder joints. The quality of the solder joint microstructures showed a slight degree of degradation under thermal shock exposure for all of the solders tested. Trends in the solder joint shear strengths could be traced to the presence of Pd in the solder, the source of which was the Pd/Ni finish on the circuit board conductor features. The higher, intrinsic strengths of the Pb-free solders encouraged the failure path to be located in proximity to the solder/substrate interface where Pd combined with Sn to form brittle PdSn{sub 4} particles, resulting in reduced shear strengths.

  16. Effects of PCB thickness on adjustable fountain wave soldering

    Indian Academy of Sciences (India)

    M S Abdul Aziz; M Z Abdullah; C Y Khor; A Jalar; M A Bakar; W Y W Yusoff; F Che Ani; Nobe Yan; M Zhou; C Cheok

    2015-10-01

    This study investigates the effects of printed circuit board (PCB) thickness on adjustable fountain and conventional wave soldering. The pin-through-hole (PTH) vertical fill is examined with three PCBs of different thicknesses (i.e., 1.6, 3.1, and 6.0 mm) soldered through adjustable fountain and conventional wave soldering at conveyor angles of 0° and 6°. The vertical fill of each PCB is the focus. The PTH solder profile is inspected with a non-destructive X-ray computed tomography scanning machine. The percentages of the PTH vertical fill of both soldering processes are also estimated and compared. The aspect ratio of the PCB is also investigated. Experimental results reveal that adjustable fountain wave soldering yields better vertical fill than conventional wave soldering. The vertical fill level of adjustable fountain wave soldering is 100%, 90%, and 50% for the 1.6, 3.1, and 6.0 mm PCB thickness, respectively. FLUENT simulation is conducted for the vertical fill of the solder profile. Simulation and experimental results show that the PTH solder profiles of the two soldering processes are almost identical. The effect of PCB thickness on PTH voiding is also discussed.

  17. Capillary flow of solder on chemically roughened PWB surfaces

    Energy Technology Data Exchange (ETDEWEB)

    Hosking, F.M.; Stevenson, J.O.; Yost, F.G.

    1996-02-01

    The Center for Solder Science and Technology at Sandia National Laboratories has developed a solderability test for evaluating fundamental solder flow over PWB (printed wiring boards) surface finishes. The work supports a cooperative research and development agreement between Sandia, the National Center for Manufacturing Sciences (NCMS), and several industrial partners. An important facet of the effort involved the ``engineering`` of copper surfaces through mechanical and chemical roughening. The roughened topography enhances solder flow, especially over very fine features. In this paper, we describe how etching with different chemical solutions can affect solder flow on a specially designed ball grid array test vehicle (BGATV). The effects of circuit geometry, solution concentration, and etching time are discussed. Surface roughness and solder flow data are presented to support the roughening premise. Noticeable improvements in solder wettability were observed on uniformly etched surfaces having relatively steep peak-to-valley slopes.

  18. Automatic computer-aided system of simulating solder joint formation

    Science.gov (United States)

    Zhao, Xiujuan; Wang, Chunqing; Zheng, Guanqun; Wang, Gouzhong; Yang, Shiqin

    1999-08-01

    One critical aspect in electronic packaging is the fatigue/creep-induced failure in solder interconnections, which is found to be highly dependent on the shape of solder joints. Thus predicting and analyzing the solder joint shape is warranted. In this paper, an automatic computer-aided system is developed to simulate the formation of solder joint and analyze the influence of the different process parameters on the solder joint shape. The developed system is capable of visually designing the process parameters and calculating the solder joint shape automatically without any intervention from the user. The automation achieved will enable fast shape estimation with the variation of process parameters without time consuming experiments, and the simulating system provides the design and manufacturing engineers an efficient software tools to design soldering process in design environment. Moreover, a program developed from the system can serve as the preprocessor for subsequent finite element joint analysis program.

  19. Influence of nickel–phosphorus surface roughness on wettability and pores formation in solder joints for high power electronic applications

    Energy Technology Data Exchange (ETDEWEB)

    Vivet, L., E-mail: laurent.vivet@valeo.com [Valeo, Group Electronic Expertise and Development Services, 2 rue André Boulle, 94046 Créteil (France); Joudrier, A.-L. [Institut Lavoisier de Versailles, UMR CNRS 8180, 45 Avenue des Etats-Unis, 78035 Versailles (France); Tan, K.-L.; Morelle, J.-M. [Valeo, Group Electronic Expertise and Development Services, 2 rue André Boulle, 94046 Créteil (France); Etcheberry, A. [Institut Lavoisier de Versailles, UMR CNRS 8180, 45 Avenue des Etats-Unis, 78035 Versailles (France); Chalumeau, L. [Egide, Site industriel du Sactar, 85500 Bollène (France)

    2013-12-15

    Electroless nickel-high-phosphorus Ni–P plating is used as substrate coating in the electronic component technology. The ability to minimize pores formation in solder joints and the wettability of the Ni–P layer remain points of investigation. The qualities and the control of the physical and chemical properties of the deposits are essential for the reliability of the products. In this contribution it has been measured how a controlled change of one property of the Ni–P surface, its average roughness, changes the wettability of this surface before soldering completion, at ambient temperature and under ambient air, and how it contribute to change the amount and size of pores inside solder joints, after soldering completion. Before all, observations of the Ni–P surfaces using scanning electron microscopy have been achieved. Then the wettability has been measured through the determination of both the disperse and the polar fractions of the substrate surface tension, based on the measurements of the wetting angle for droplets of four different liquids, under ambient air and at room temperature (classical sessile drop technique). Finally the X-ray micro-radiography measurements of both the area fraction of pores and the size of the largest pore inside the solder joint of dice laser soldered on the studied substrate, using high melting temperature solder (300 °C, PbSnAg) have been achieved. This study clearly demonstrates that both the ability to minimize pores formation in solder joints and the wettability under ambient conditions of the Ni–P substrate decrease and become more variable when its average roughness increases. These effects can be explained considering the Cassie–Baxter model for rough surface wetting behaviour, completed by the model of heterogeneous nucleation and growth for gas bubbles inside a liquid.

  20. Influence of nickel-phosphorus surface roughness on wettability and pores formation in solder joints for high power electronic applications

    Science.gov (United States)

    Vivet, L.; Joudrier, A.-L.; Tan, K.-L.; Morelle, J.-M.; Etcheberry, A.; Chalumeau, L.

    2013-12-01

    Electroless nickel-high-phosphorus Ni-P plating is used as substrate coating in the electronic component technology. The ability to minimize pores formation in solder joints and the wettability of the Ni-P layer remain points of investigation. The qualities and the control of the physical and chemical properties of the deposits are essential for the reliability of the products. In this contribution it has been measured how a controlled change of one property of the Ni-P surface, its average roughness, changes the wettability of this surface before soldering completion, at ambient temperature and under ambient air, and how it contribute to change the amount and size of pores inside solder joints, after soldering completion. Before all, observations of the Ni-P surfaces using scanning electron microscopy have been achieved. Then the wettability has been measured through the determination of both the disperse and the polar fractions of the substrate surface tension, based on the measurements of the wetting angle for droplets of four different liquids, under ambient air and at room temperature (classical sessile drop technique). Finally the X-ray micro-radiography measurements of both the area fraction of pores and the size of the largest pore inside the solder joint of dice laser soldered on the studied substrate, using high melting temperature solder (300 °C, PbSnAg) have been achieved. This study clearly demonstrates that both the ability to minimize pores formation in solder joints and the wettability under ambient conditions of the Ni-P substrate decrease and become more variable when its average roughness increases. These effects can be explained considering the Cassie-Baxter model for rough surface wetting behaviour, completed by the model of heterogeneous nucleation and growth for gas bubbles inside a liquid.

  1. Characterization and modeling of microstructural evolution of near-eutectic tin-silver-copper solder joints

    Science.gov (United States)

    Zbrzezny, Adam R.

    Near-eutectic Sn-Ag-Cu (SAC) solders are currently considered as major lead-free replacement candidates for Sn-Pb eutectic alloys in microelectronics applications. In this thesis, the microstructural thermal stability including recrystallization, grain growth behavior, Pb and Au contamination effects and interaction of the SAC solder with Cu and Ni substrates were investigated. The true eutectic composition of the Sn-Ag-Cu alloy was verified to be Sn3.5Ag0.9Cu wt.%, and the eutectic melting temperature was determined to be 217.4 +/- 0.8°C. The system was classified as belonging to faceting (Cu6Sn5)-faceting (Ag3Sn)-nonfaceting (Sn matrix) ternary eutectic. The most significant consequence of Pb contamination was the formation of a quaternary eutectic phase (Sn-Ag-Cu-Pb) with a melting point at 176°C. Similarly, the presence of gold in the SAC alloy led to a development of a new quaternary phase (Sn-Ag-Cu-Au) melting at 204°C. Prolonged aging of SAC-4 wt.% Au on nickel resulted in the deposition of a new, previously unreported, intermetallic (IMC) layer, ((Au1-xCUx)6Sn 5, 15 wt.% of Au) on top of the existing (Cu1-yNi y)6Sn5 layer. The interfacial products that formed during soldering to copper were Cu6Sn5 and Cu3Sn. Soldering to nickel resulted in the formation of one layer, (Cu1-yNiy) 6Sn5, which was different from the expected Ni3Sn 4 layer. A small copper content in the SAC solder (0.7 wt.%) was sufficient to promote this thermodynamic shift. Intermetallic growth on Cu during solid state aging was established to be bulk diffusion controlled. The IMC layers in the SAC system grew at a slower rate than in the Sn-Pb system. It was found that the reliability of SAC solder joints on copper was considerably better than on nickel due to copper enrichment during reflow and subsequent Cu6Sn5 intermetallic precipitation. Enhanced copper and silver diffusion followed by tin recrystallization and grain growth, cavity nucleation and subsequent micro-crack linkage formed

  2. Candidate pathway based analysis for cleft lip with or without cleft palate.

    Science.gov (United States)

    Zhang, Tian-Xiao; Beaty, Terri H; Ruczinski, Ingo

    2012-01-06

    The objective of this research was to identify potential biological pathways associated with non-syndromic cleft lip with or without cleft palate (NSCL/P), and to explore the potential biological mechanisms underlying these associated pathways on risk of NSCL/P. This project was based on the dataset of a previously published genome-wide association (GWA) study on NSCL/P (Beaty et al. 2010). Case-parent trios used here originated from an international consortium (The Gene, Environment Association Studies consortium, GENEVA) formed in 2007. A total of 5,742 individuals from 1,908 CL/P case-parents trios (1,591 complete trios and 317 incomplete trios where one parent was missing) were collected and genotyped using the Illumina Human610-Quad array. Candidate pathways were selected using a list of 356 genes that may be related to oral clefts. In total, 42 candidate pathways, which included 1,564 genes and 40,208 SNPs were tested. Using a pathway-based analysis approach proposed by Wang et al (2007), we conducted a permutation-based test to assess the statistical significance of the nominal p-values of 42 candidate pathways. The analysis revealed several pathways yielding nominally significant p-values. However, controlling for the family wise error rate, none of these pathways could retain statistical significance. Nominal p-values of these pathways were concentrated at the lower tail of the distribution, with more than expected low p-values. A permutation based test for examining this type of distribution pattern yielded an overall p-value of 0.029. Thus, while this pathway-based analysis did not yield a clear significant result for any particular pathway, we conclude that one or more of the genes and pathways considered here likely do play a role in oral clefting.

  3. Candidate Smoke Region Segmentation of Fire Video Based on Rough Set Theory

    Directory of Open Access Journals (Sweden)

    Yaqin Zhao

    2015-01-01

    Full Text Available Candidate smoke region segmentation is the key link of smoke video detection; an effective and prompt method of candidate smoke region segmentation plays a significant role in a smoke recognition system. However, the interference of heavy fog and smoke-color moving objects greatly degrades the recognition accuracy. In this paper, a novel method of candidate smoke region segmentation based on rough set theory is presented. First, Kalman filtering is used to update video background in order to exclude the interference of static smoke-color objects, such as blue sky. Second, in RGB color space smoke regions are segmented by defining the upper approximation, lower approximation, and roughness of smoke-color distribution. Finally, in HSV color space small smoke regions are merged by the definition of equivalence relation so as to distinguish smoke images from heavy fog images in terms of V component value variety from center to edge of smoke region. The experimental results on smoke region segmentation demonstrated the effectiveness and usefulness of the proposed scheme.

  4. Soldering and Mass Generation in Four Dimensions

    CERN Document Server

    Banerjee, R; Banerjee, Rabin; Wotzasek, Clovis

    2000-01-01

    We propose bosonised expressions for the chiral Schwinger models in four dimensions. Then, in complete analogy with the two dimensional case, we show the soldering of two bosonised chiral Schwinger models with opposite chiralities to yield the bosonised Schwinger model in four dimensions. The implications of the Schwinger model or its chiral version, as known for two dimensions, thereby get extended to four dimensions.

  5. Solderability test development. Final report. [Meniscograph tests

    Energy Technology Data Exchange (ETDEWEB)

    Jarboe, D.M.

    1977-10-01

    Operating procedures and data reduction techniques applicable to the Meniscograph (General Electric Company, Limited) were developed. Using force-time traces from tests involving various sample materials and configurations, flux types, and test temperatures, the wetting rate and contact angle were obtained through statistical treatment of the data. This information provides a means of directly correlating solderability with the physical phenomenon of wetting.

  6. Damage Model for Reliability Assessment of Solder Joints in Wind Turbines

    DEFF Research Database (Denmark)

    Kostandyan, Erik; Sørensen, John Dalsgaard

    2012-01-01

    damage model by Miner’s rule. Our attention is focused on crack propagation in solder joints of electrical components due to the temperature loadings. Based on the proposed method it is described how to find the damage level for a given temperature loading profile. The proposed method is discussed...

  7. Preparation of solder pads by selective laser scanning

    Institute of Scientific and Technical Information of China (English)

    Wenqing Shi; Yongqiang Yang; Yanlu Huang; Guoqiang Wei; Wei Guo

    2009-01-01

    We propose a new laser preparation technique to solder Sn-Ag3.5-Cu0.7 on a copper clad laminate (CCL). The experiment is conducted by selective laser heating and melting the thin solder layer and then preprint-ing it on CCL in order to form the matrix with solder pads. Through the analysis of macro morphology of the matrix with solder pads and microstructure of single pads, this technique is proved to be suitable for preparing solder pads and that the solder pads are of good mechanical properties. The results also reveal that high frequency laser pulse is beneficial to the formation of better solder pad, and that the 12-W fiber laser with a beam diameter of 0.030 mm can solder Sn-Ag3.5-Cu0.7 successfully on CCL at 500-kHz pulse frequency. The optimized parameters of laser soldering on CCL are as follows: the laser power is 12 W, the scanning speed is 1.0 mm/s, the beam diameter is 0.030 mm, the lead-free solder is Sn-Ag3.5-Cu0.7, and the laser pulse frequency is 500 kHz.

  8. Microwave Tissue Soldering for Immediate Wound Closure

    Science.gov (United States)

    Arndt, G. Dickey; Ngo, Phong H.; Phan, Chau T.; Byerly, Diane; Dusl, John; Sognier, Marguerite A.; Carl, James

    2011-01-01

    A novel approach for the immediate sealing of traumatic wounds is under development. A portable microwave generator and handheld antenna are used to seal wounds, binding the edges of the wound together using a biodegradable protein sealant or solder. This method could be used for repairing wounds in emergency settings by restoring the wound surface to its original strength within minutes. This technique could also be utilized for surgical purposes involving solid visceral organs (i.e., liver, spleen, and kidney) that currently do not respond well to ordinary surgical procedures. A miniaturized microwave generator and a handheld antenna are used to deliver microwave energy to the protein solder, which is applied to the wound. The antenna can be of several alternative designs optimized for placement either in contact with or in proximity to the protein solder covering the wound. In either case, optimization of the design includes the matching of impedances to maximize the energy delivered to the protein solder and wound at a chosen frequency. For certain applications, an antenna could be designed that would emit power only when it is in direct contact with the wound. The optimum frequency or frequencies for a specific application would depend on the required depth of penetration of the microwave energy. In fact, a computational simulation for each specific application could be performed, which would then match the characteristics of the antenna with the protein solder and tissue to best effect wound closure. An additional area of interest with potential benefit that remains to be validated is whether microwave energy can effectively kill bacteria in and around the wound. Thus, this may be an efficient method for simultaneously sterilizing and closing wounds.

  9. Sn-Ag-Cu Nanosolders: Solder Joints Integrity and Strength

    Science.gov (United States)

    Roshanghias, Ali; Khatibi, Golta; Yakymovych, Andriy; Bernardi, Johannes; Ipser, Herbert

    2016-08-01

    Although considerable research has been dedicated to the synthesis and characterization of lead-free nanoparticle solder alloys, only very little has been reported on the reliability of the respective joints. In fact, the merit of nanoparticle solders with depressed melting temperatures close to the Sn-Pb eutectic temperature has always been challenged when compared with conventional solder joints, especially in terms of inferior solderability due to the oxide shell commonly present on the nanoparticles, as well as due to compatibility problems with common fluxing agents. Correspondingly, in the current study, Sn-Ag-Cu (SAC) nanoparticle alloys were combined with a proper fluxing vehicle to produce prototype nanosolder pastes. The reliability of the solder joints was successively investigated by means of electron microscopy and mechanical tests. As a result, the optimized condition for employing nanoparticles as a competent nanopaste and a novel procedure for surface treatment of the SAC nanoparticles to diminish the oxide shell prior to soldering are being proposed.

  10. Network Based Integrated Analysis of Phenotype-Genotype Data for Prioritization of Candidate Symptom Genes

    Directory of Open Access Journals (Sweden)

    Xing Li

    2014-01-01

    Full Text Available Background. Symptoms and signs (symptoms in brief are the essential clinical manifestations for individualized diagnosis and treatment in traditional Chinese medicine (TCM. To gain insights into the molecular mechanism of symptoms, we develop a computational approach to identify the candidate genes of symptoms. Methods. This paper presents a network-based approach for the integrated analysis of multiple phenotype-genotype data sources and the prediction of the prioritizing genes for the associated symptoms. The method first calculates the similarities between symptoms and diseases based on the symptom-disease relationships retrieved from the PubMed bibliographic database. Then the disease-gene associations and protein-protein interactions are utilized to construct a phenotype-genotype network. The PRINCE algorithm is finally used to rank the potential genes for the associated symptoms. Results. The proposed method gets reliable gene rank list with AUC (area under curve 0.616 in classification. Some novel genes like CALCA, ESR1, and MTHFR were predicted to be associated with headache symptoms, which are not recorded in the benchmark data set, but have been reported in recent published literatures. Conclusions. Our study demonstrated that by integrating phenotype-genotype relationships into a complex network framework it provides an effective approach to identify candidate genes of symptoms.

  11. THERMAL PROCESS OF VACUUM FLUXLESS LASERSOLDERING AND ANALYSIS ON SOLDER SPREADING AND WETTING

    Institute of Scientific and Technical Information of China (English)

    2000-01-01

    In order to study the mechanism of vacuum fluxless soldering on the conditions of laser heating, the method of measuring temperature by the thermocouple is used to analyze the spreading and wetting process of boh fluxless SnPb solder in the vacuum surroundings and flux SnPb solder on Cu pad. Solder spreading and wetting affected by the soldering thermal process is also discussed according to the thermodynamics principle. Results show that vacuum fluxless soldering demands higher temperature, and the fall of the solder su rface tension is the important factor achieving fluxless laser soldering.

  12. Combined Thermodynamic-Kinetic Analysis of the Interfacial Reactions between Ni Metallization and Various Lead-Free Solders

    Directory of Open Access Journals (Sweden)

    Tomi Laurila

    2009-11-01

    Full Text Available In this paper we will demonstrate how a thermodynamic-kinetic method can be utilized to rationalize a wide range of interfacial phenomena between Sn-based lead-free solders and Ni metallizations. First, the effect of P on the interfacial reactions, and thus on the reliability, between Sn-based solders and electroless Ni/immersion Au (ENIG metallizations, will be discussed. Next, the effect of small amounts of Cu in Sn-based solders on the intermetallic compound (IMC, which forms first on top of Ni metallization, will be covered. With the help of thermodynamic arguments a so called critical Cu concentration for the formation of (Cu,Ni6Sn5 can be determined as a function of temperature. Then the important phenomenon of redeposition of (Au,NiSn4 layer on top of Ni3Sn4 IMC will be discussed in detail. The reasons leading to this behaviour will be rationalized with the help of thermodynamic information and an explanation of why this phenomenon does not occur when an appropriate amount of Cu is present in the soldering system will be given. Finally, interfacial reaction issues related to low temperature Sn-Zn and Sn-Bi based solders and Ni metallization will be discussed.

  13. Solderability preservation through the use of organic inhibitors

    Energy Technology Data Exchange (ETDEWEB)

    Sorensen, N.R.; Hosking, F.M.

    1994-12-01

    Organic inhibitors can be used to prevent corrosion of metals and have application in the electronics industry as solderability preservatives. We have developed a model to describe the action of two inhibitors (benzotriazole and imidazole) during the environmental aging and soldering process. The inhibitors bond with the metal surface and form a barrier that prevents or retards oxidation. At soldering temperatures, the metal-organic complex breaks down leaving an oxide-free metal surface that allows excellent wetting by molten solder. The presence of the inhibitor retards the wetting rate relative to clean copper, but provides a vast improvement relative to oxidized copper.

  14. Aging, stressing and solderability of electroplated and electroless copper

    Energy Technology Data Exchange (ETDEWEB)

    Sorensen, N.R.; Hosking, F.M.

    1995-08-01

    Organic inhibitors can be used to prevent corrosion of metals have application in the electronics industry as solderability preservatives. We have developed a model to describe the action of two inhibitors (benzotriazole and imidazole) during the environmental aging and soldering process. The inhibitors bond with the metal surface and form a barrier that prevents or retards oxidation. At soldering temperatures, the metal-organic complex breaks down leaving an oxide-free metal surface that allows excellent wetting by the molten solder. The presence of the inhibitor retards the wetting rate relative to clean copper but provides a vast improvement relative to oxidized copper.

  15. Recent Research Trend in Laser-Soldering Process

    Energy Technology Data Exchange (ETDEWEB)

    Kim, Hwan Tae; Kil, Sang Cheol [Korea Institute of Science and Technology Information, Seoul (Korea, Republic of); Hwang, Woon Suk [Inha University, Incheon (Korea, Republic of)

    2009-10-15

    The trend of the microjoining technology by the laser-soldering process has been reviewed. Among the production technologies, joining technology plays an important role in the fabrication of electronic components. This has led to an increasing attention towards the use of modem microjoining technology such as micro-resistance spot joining micro-soldering, micro-friction stir joining and laser-soldering, etc. This review covers the recent technical trends of laser-soldering collected from the COMPENDEX DB analysis of published papers, research subject and research institutes.

  16. Development of Sn-Ag-Cu-X Solders for Electronic Assembly by Micro-Alloying with Al

    Science.gov (United States)

    Boesenberg, Adam J.; Anderson, Iver E.; Harringa, Joel L.

    2012-07-01

    Of Pb-free solder choices, an array of solder alloys based on the Sn-Ag-Cu (SAC) ternary eutectic ( T eut = 217°C) composition have emerged with potential for broad use, including ball grid array (BGA) joints that cool slowly. This work investigated minor substitutional additions of Al (solders to promote more consistent solder joint microstructures and to avoid deleterious product phases, e.g., Ag3Sn "blades," for BGA cooling rates, since such Al additions to SAC had already demonstrated excellent thermal aging stability. Consistent with past work, blade formation was suppressed for increased Al content (>0.05Al), but the suppression effect faded for >0.20Al. Undercooling suppression did not correlate specifically with blade suppression since it became significant at 0.10Al and increased continuously with greater Al to 0.25Al. Surprisingly, an intermediate range of Al content (0.10 wt.% to 0.20 wt.% Al) promoted formation of significant populations of 2- μm to 5- μm faceted Cu-Al particles, identified as Cu33Al17, that clustered at the top of the solder joint matrix and exhibited extraordinary hardness. Clustering of Cu33Al17 was attributed to its buoyancy, from a lower density than Sn liquid, and its early position in the nucleation sequence within the solder matrix, permitting unrestricted migration to the top interface. Joint microstructures and implications for the full nucleation sequence for these SAC + Al solder joints are discussed, along with possible benefits from the clustered particles for improved thermal cycling resistance.

  17. Comparison of Extensive Thermal Cycling Effects on Microstructure Development in Micro-alloyed Sn-Ag-Cu Solder Joints

    Science.gov (United States)

    Anderson, Iver E.; Boesenberg, Adam; Harringa, Joel; Riegner, David; Steinmetz, Andrew; Hillman, David

    2012-02-01

    Pb-free solder alloys based on the Sn-Ag-Cu (SAC) ternary eutectic have promise for widespread adoption across assembly conditions and operating environments, but enhanced microstructural control is needed. Micro-alloying with elements such as Zn was demonstrated for promoting a preferred solidification path and joint microstructure earlier in simple (Cu/Cu) solder joints studies for different cooling rates. This beneficial behavior now has been verified in reworked ball grid array (BGA) joints, using dissimilar SAC305 (Sn-3.0Ag-0.5Cu, wt.%) solder paste. After industrial assembly, BGA components joined with Sn-3.5Ag-0.74Cu-0.21Zn solder were tested in thermal cycling (-55°C/+125°C) along with baseline SAC305 BGA joints beyond 3000 cycles with continuous failure monitoring. Weibull analysis of the results demonstrated that BGA components joined with SAC + Zn/SAC305 have less joint integrity than SAC305 joints, but their lifetime is sufficient for severe applications in consumer, defense, and avionics electronic product field environments. Failure analysis of the BGA joints revealed that cracking did not deviate from the typical top area (BGA component side) of each joint, in spite of different Ag3Sn blade content. Thus, SAC + Zn solder has not shown any advantage over SAC305 solder in these thermal cycling trials, but other characteristics of SAC + Zn solder may make it more attractive for use across the full range of harsh conditions of avionics or defense applications.

  18. Design and Experiment of a Solder Paste Jetting System Driven by a Piezoelectric Stack

    Directory of Open Access Journals (Sweden)

    Shoudong Gu

    2016-06-01

    Full Text Available To compensate for the insufficiency and instability of solder paste dispensing and printing that are used in the SMT (Surface Mount Technology production process, a noncontact solder paste jetting system driven by a piezoelectric stack based on the principle of the nozzle-needle-system is introduced in this paper, in which a miniscule gap exists between the nozzle and needle during the jetting process. Here, the critical jet ejection velocity is discussed through theoretical analysis. The relations between ejection velocity and needle structure, needle velocity, and nozzle diameter were obtained by FLUENT software. Then, the prototype of the solder paste jetting system was fabricated, and the performance was verified by experiments. The effects of the gap between nozzle and needle, the driving voltage, and the nozzle diameter on the jetting performance and droplet diameter were obtained. Solder paste droplets 0.85 mm in diameter were produced when the gap between the nozzle and needle was adjusted to 10 μm, the driving voltage to 80 V, the nozzle diameter to 0.1 mm, and the variation of the droplet diameter was within ±3%.

  19. Microstructural and mechanical properties analysis of extruded Sn–0.7Cu solder alloy

    Directory of Open Access Journals (Sweden)

    Abdoul-Aziz Bogno

    2015-01-01

    Full Text Available The properties and performance of lead-free solder alloys such as fluidity and wettability are defined by the alloy composition and solidification microstructure. Rapid solidification of metallic alloys is known to result in refined microstructures with reduced microsegregation and improved mechanical properties of the final products as compared to normal castings. The rapidly solidified Sn-based solders by melt spinning were shown to be suitable for soldering with low temperature and short soldering duration. In the present study, rapidly solidified Sn–0.7 wt.%Cu droplets generated by impulse atomization (IA were achieved as well as directional solidification under transient conditions at lower cooling rate. This paper reports on a comparative study of the rapidly solidified and the directionally solidified samples. Different but complementary characterization techniques were used to fully analyze the solidification microstructures of the samples obtained under the two cooling regimes. These include X-ray diffractometry (XRD and scanning electron microscopy (SEM. In order to compare the tensile strength and elongation to fracture of the directionally solidified ingot and strip castings with the atomized droplet, compaction and extrusion of the latter were carried out. It was shown that more balanced and superior tensile mechanical properties are available for the hot extruded samples from compacted as-atomized Sn–0.7 wt.%Cu droplets. Further, elongation-to-fracture was 2–3× higher than that obtained for the directionally solidified samples.

  20. ReCGiP, a database of reproduction candidate genes in pigs based on bibliomics

    Directory of Open Access Journals (Sweden)

    Yang Lun

    2010-08-01

    Full Text Available Abstract Background Reproduction in pigs is one of the most economically important traits. To improve the reproductive performances, numerous studies have focused on the identification of candidate genes. However, it is hard for one to read all literatures thoroughly to get information. So we have developed a database providing candidate genes for reproductive researches in pig by mining and processing existing biological literatures in human and pigs, named as ReCGiP. Description Based on text-mining and comparative genomics, ReCGiP presents diverse information of reproduction-relevant genes in human and pig. The genes were sorted by the degree of relevance with the reproduction topics and were visualized in a gene's co-occurrence network where two genes were connected if they were co-cited in a PubMed abstract. The 'hub' genes which had more 'neighbors' were thought to be have more important functions and could be identified by the user in their web browser. In addition, ReCGiP provided integrated GO annotation, OMIM and biological pathway information collected from the Internet. Both pig and human gene information can be found in the database, which is now available. Conclusions ReCGiP is a unique database providing information on reproduction related genes for pig. It can be used in the area of the molecular genetics, the genetic linkage map, and the breeding of the pig and other livestock. Moreover, it can be used as a reference for human reproduction research.

  1. A Study of the Interface of Soldered Joints of SnInAgTi Active Solder with Ito Ceramics

    Directory of Open Access Journals (Sweden)

    M. Provazník

    2010-01-01

    Full Text Available This paper presents an analysis of the solderability ITO ceramics (In2O3/SnO2. The soft active solder SnInAgeTi was used for the experiments. The solder was activated by power ultrasound in air without flux. An analysis of the interface of the phases between the solder and the ceramic was carried out in order to discover the ultrasonic impacts on the active metal and to identify the mechanism of the joint on the ceramic side.

  2. Effects of rare earth element Ce on solderabilities of micron-powdered Sn-Ag-Cu solder

    Institute of Scientific and Technical Information of China (English)

    XUE Song-bai; YU Sheng-lin; WANG Xu-yan; LIU lin; HU Yong-fang; YAO Li-hua

    2005-01-01

    Several important properties of the micron-powdered Sn-Ag-Cu-Ce solder, including the spreadability, spreading ratio, wetting time, and melting point, were investigated for verifying the effects of rare earth element Ce on solderabilities of micron-powdered Sn-Ag-Cu solder. The solidus and the liquidus of the micron-powdered Sn-Ag-Cu-Ce solder are 193.6℃ and 218.4℃, respectively, about 28℃ and 3℃ lower than the melting point of the block Sn-Ag-Cu solder, which reminds the existence of the surface effect of the micron-powdered solder. By adding Ce into Sn-Ag-Cu alloy, its wetting time on pure copper can be obviously decreased. For the Sn-Ag-Cu-0.03%Ce, the soldering temperature is 250℃, and the wetting time on pure copper is close to 1s, with the soldering temperature approaching to 260℃, the wetting time is dropped to 0.8s, which is close to the wetting time, 0.68s, of Sn-Pb solder at 235℃.

  3. Reliability Study of Solder Paste Alloy for the Improvement of Solder Joint at Surface Mount Fine-Pitch Components

    Directory of Open Access Journals (Sweden)

    Mohd Nizam Ab. Rahman

    2014-12-01

    Full Text Available The significant increase in metal costs has forced the electronics industry to provide new materials and methods to reduce costs, while maintaining customers’ high-quality expectations. This paper considers the problem of most electronic industries in reducing costly materials, by introducing a solder paste with alloy composition tin 98.3%, silver 0.3%, and copper 0.7%, used for the construction of the surface mount fine-pitch component on a Printing Wiring Board (PWB. The reliability of the solder joint between electronic components and PWB is evaluated through the dynamic characteristic test, thermal shock test, and Taguchi method after the printing process. After experimenting with the dynamic characteristic test and thermal shock test with 20 boards, the solder paste was still able to provide a high-quality solder joint. In particular, the Taguchi method is used to determine the optimal control parameters and noise factors of the Solder Printer (SP machine, that affects solder volume and solder height. The control parameters include table separation distance, squeegee speed, squeegee pressure, and table speed of the SP machine. The result shows that the most significant parameter for the solder volume is squeegee pressure (2.0 mm, and the solder height is the table speed of the SP machine (2.5 mm/s.

  4. Handwritten Japanese Address Recognition Technique Based on Improved Phased Search of Candidate Rectangle Lattice

    Directory of Open Access Journals (Sweden)

    Hidehisa NAKAYAMA

    2004-08-01

    Full Text Available In the field of handwritten Japanese address recognition, it is common to recognize place-name strings from place-name images. However, in practice, it is necessary to recognize the place-name strings from address images. Therefore, we have proposed the post-processing system, which checks the list of the place-name strings in two-stages for recognizing the place-name images. In this paper, we propose a new technique based on phased search of candidate rectangle lattice, and improve the technique with the detection of key-characters for final output. Applying our proposal to the IPTP 1840 image data of address strings, the results of experiments clearly show the efficiency of our system in handwritten Japanese address recognition.

  5. Microstructure and Reliability Comparison of Different Pb-Free Alloys Used for Wave Soldering and Rework

    Science.gov (United States)

    Snugovsky, Polina; Bagheri, Zohreh; Hamilton, Craig

    2009-12-01

    This paper describes the results of an intensive microstructural and reliability study of pin-through-hole (PTH) and surface mount technology (SMT) components which were wave solder assembled using three groups of alloys: (1) near-eutectic Sn-Ag-Cu alloys such as SAC405 and SAC305, (2) low-Ag off-eutectic Pb-free alloys with an Ag content of about 1% and lower, and (3) eutectic Sn-Cu alloys with Ni and other additives. Both primary attach and reworked solder connections using solder fountain and hand rework were studied. The PTH connector types and SMT components were wave solder assembled on a test vehicle. Accelerated thermal cycling (ATC) was conducted at 0°C to 100°C for 6000 cycles. The difference in microstructures, intermetallic formation, Cu dissolution, grain coarsening, and crack formation is shown. The influence of the microstructure after assembly and rework on Weibull plot parameters and failure modes is described for 2512 resistors. Interconnect defects such as nonuniform phase distribution and void formation are discussed. The Sn-Cu-Ni- and Sn-Cu-Ag-Bi-based alloys tested in this study are recommended as potential suitable replacements for SAC305/405 in the wave solder process; no failure was detected up to 6000 cycles at 0°C to 100°C. Although SAC405 demonstrated better barrel fill and lower rate of crack propagation during ATC, after PTH rework, both of the alternative Pb-free alloys have a much lower Cu dissolution rate and definitely outperform SAC405 in ATC. SAC405 glue and wave resistors after primary attachment and rework demonstrate higher reliability than alternative alloys. Early failures relate to alternative alloy characteristics and should be considered for some applications.

  6. Vibration characteristics of aluminum surface subjected to ultrasonic waves and their effect on wetting behavior of solder droplets.

    Science.gov (United States)

    Ma, Lin; Xu, Zhiwu; Zheng, Kun; Yan, Jiuchun; Yang, Shiqin

    2014-03-01

    The vibration characteristics of an aluminum surface subjected to ultrasonic waves were investigated with a combination of numerical simulation and experimental testing. The wetting behavior of solder droplets on the vibrating aluminum surface was also examined. The results show that the vibration pattern of the aluminum surface is inhomogeneous. The amplitude of the aluminum surface exceeds the excitation amplitude in some zones, while the amplitude decreases nearly to zero in other zones. The distribution of the zero-amplitude zones is much less dependent on the strength of the vibration than on the location of the vibration source. The surface of the liquid solder vibrates at an ultrasonic frequency that is higher than the vibration source, and the amplitude of the liquid solder is almost twice that of the aluminum surface. The vibration of the surface of the base metal (liquid solder) correlates with the oxide film removal effect. Significant removal of the oxide film can be achieved within 2s when the amplitude of the aluminum surface is higher than 5.4 μm or when the amplitude of the liquid solder surface is higher than 10.2 μm.

  7. Electrical Resistance of Nb3Sn/Cu Splices Produced by Electromagnetic Pulse Technology and Soft Soldering

    CERN Document Server

    Schoerling, D; Scheuerlein, C; Atieh, S; Schaefer, R

    2011-01-01

    The electrical interconnection of Nb3Sn/Cu strands is a key issue for the construction of Nb3Sn based damping ring wigglers and insertion devices for third generation light sources. We compare the electrical resistance of Nb3Sn/Cu splices manufactured by solid state welding using Electromagnetic Pulse Technology (EMPT) with that of splices produced by soft soldering with two different solders. The resistance of splices produced by soft soldering depends strongly on the resistivity of the solder alloy at the operating temperature. By solid state welding splice resistances below 10 nOhm can be achieved with 1 cm strand overlap length only, which is about 4 times lower than the resistance of Sn96Ag4 soldered splices with the same overlap length. The comparison of experimental results with Finite Element simulations shows that the electrical resistance of EMPT welded splices is determined by the resistance of the stabilizing copper between the superconducting filaments and confirms that welding of the strand matr...

  8. The effect of micro alloying on the microstructure evolution of Sn-Ag-Cu lead-free solder

    Science.gov (United States)

    Werden, Jesse

    The microelectronics industry is required to obtain alternative Pb-free soldering materials due to legal, environmental, and technological factors. As a joining material, solder provides an electrical and mechanical support in electronic assemblies and therefore, the properties of the solder are crucial to the durability and reliability of the solder joint and the function of the electronic device. One major concern with new Pb-free alternatives is that the microstructure is prone to microstructural coarsening over time which leads to inconsistent properties over the device's lifetime. Power aging the solder is a common method of stabilizing the microstructure for Pb-based alloys, however, it is unclear if this will be an appropriate solution to the microstructural coarsening of Pb-free solders. The goal of this work is to develop a better understanding of the coarsening process in new solder alloys and to suggest methods of stabilizing the solder microstructure. Microalloying is one potential solution to the microstructural coarsening problem. This experiment consists of a microstructural coarsening study of SAC305 in which each sample has been alloyed with one of three different solutes, directionally solidified at 100microm/s, and then aged at three different temperatures over a total period of 20 days. There are several important conclusions from this experiment. First, the coarsening kinetics of the intermetallics in the ternary eutectic follow the Ostwald ripening model where r3 in proprotional to t for each alloying constituent. Second, the activation energy for coarsening was found to be 68.1+/-10.3 kJ/mol for the SAC305 samples, Zn had the most significant increase in the activation energy increasing it to 88.8+/-34.9 kJ/mol for the SAC+Zn samples, Mn also increased the activation energy to 83.2+/-20.8 kJ/mol for the SAC+Mn samples, and Sb decreased the activation energy to 48.0+/-3.59 kJ/mol for the SAC+Sb samples. Finally, it was found that the

  9. Interfacial reactions of BGA Sn-3.5%Ag-0.5%Cu and Sn-3.5%Ag solders during high-temperature aging with Ni/Au metallization

    Energy Technology Data Exchange (ETDEWEB)

    Sharif, Ahmed [Department of Electronic Engineering, City University of Hong Kong, Tat Chee Avenue, Kowloon Tong, Hong Kong (China); Islam, M.N. [Department of Electronic Engineering, City University of Hong Kong, Tat Chee Avenue, Kowloon Tong, Hong Kong (China); Chan, Y.C. [Department of Electronic Engineering, City University of Hong Kong, Tat Chee Avenue, Kowloon Tong, Hong Kong (China)]. E-mail: eeycchan@cityu.edu.hk

    2004-11-15

    The joint strength and the microstructure of Sn-3.5Ag and Sn-3.5Ag-0.5Cu (wt.%) solders on Cu/Ni/Au ball-grid-array (BGA) pad metallization were investigated after high-temperature solid-state aging at 190 deg. C (around 0.86T{sup m} of solder alloys). Sn-Ag solder gave better results in terms of shear strength on high-temperature aging than Sn-Ag-Cu. Very high consumption of Ni was observed in the case of Sn-Ag-Cu solder alloys. After 16 days of aging at the afore mentioned temperature, 5 {mu}m Ni layer was fully consumed from the substrate pad and a thick layer of Cu-Sn intermetallic compounds (IMCs) was found at the base of the interfacial IMCs. Much less consumption of Ni substrate was observed for Sn-3.5Ag solder during high-temperature aging for longer time. The mean thickness of the intermetallics at the interface was higher for Sn-Ag-Cu solder alloy. For both cases Ni diffused through the interfacial IMCs and formed quaternary compounds for Sn-Ag-Cu system and ternary compounds for Sn-Ag system within the bulk solder. It appeared that Sn-Ag-Cu solder alloy was more vulnerable in high-temperature solid-state aging.

  10. Hybrid microcircuit board assembly with lead-free solders

    Energy Technology Data Exchange (ETDEWEB)

    Vianco, P.T.; Hernandez, C.L.; Rejent, J.A.

    2000-01-11

    An assessment was made of the manufacturability of hybrid microcircuit test vehicles assembled using three Pb-free solder compositions 96.5Sn--3.5Ag (wt.%), 91.84Sn--3.33Ag--4.83Bi, and 86.85Sn--3.15Ag--5.0Bi--5.0Au. The test vehicle substrate was 96% alumina; the thick film conductor composition was 76Au--21Pt--3Pd. Excellent registration between the LCCC or chip capacitor packages and the thick film solder pads was observed. Reduced wetting of bare (Au-coated) LCCC castellations was eliminated by hot solder dipping the I/Os prior to assembly of the circuit card. The Pb-free solders were slightly more susceptible to void formation, but not to a degree that would significantly impact joint functionality. Microstructural damage, while noted in the Sn-Pb solder joints, was not observed in the Pb-free interconnects.

  11. Current Status of Lead-Free Soldering and Conductive Adhesives

    Institute of Scientific and Technical Information of China (English)

    KatsuakiSuganuma

    2003-01-01

    Lead-free soldering technology took offin the Japanese market during the year 2000, and as the year 2001-03 ushered in the 21 st century, a large number of products with lead-free soldering were already appearing on store shelves. Elsewhere, EU deliberation on the draft of the WEEE/RoHS directive finalized in February 2003 and be in force in July 2006. The course had been set for adopting lead-free solder for mounting processes of parts as well, bringing the possibility of lead-free solder mounting very close to achievement. This review will provide a view of the current state of technological progress in lead-free soldering, both in Japan and abroad, and will discuss future prospects.

  12. Development of lead-free solders for hybrid microcircuits

    Energy Technology Data Exchange (ETDEWEB)

    Hosking, F.M.; Vianco, P.T.; Frear, D.R.; Robinson, D.G.

    1996-01-01

    Extensive work has been conducted by industry to develop lead-free solders for electronics applications. The driving force behind this effort is pressure to ban or tax the use of lead-bearing solders. There has been further interest to reduce the use of hazardous chemical cleaners. Lead-free soldering and low-residue, ``no clean`` assembly processing are being considered as solutions to these environmental issues. Most of the work has been directed toward commercial and military printed wiring board (PWB) technology, although similar problems confront the hybrid microcircuit (HMC) industry, where the development of lead-free HMC solders is generally lagging. Sandia National Laboratories is responsible for designing a variety of critical, high reliability hybrid components for radars. Sandia has consequently initiated a project, as part of its Environmentally Conscious Manufacturing program, to develop low-residue, lead-free soldering for HMCs. This paper discusses the progress of that work.

  13. High-precision opto-mechanical lens system for space applications assembled by innovative local soldering technique

    Science.gov (United States)

    Ribes, P.; Koechlin, C.; Burkhardt, T.; Hornaff, M.; Burkhardt, D.; Kamm, A.; Gramens, S.; Beckert, E.; Fiault, G.; Eberhardt, R.; Tünnermann, A.

    2016-02-01

    Solder joining using metallic solder alloys is an alternative to adhesive bonding. Laser-based soldering processes are especially well suited for the joining of optical components made of fragile and brittle materials such as glasses, ceramics and optical crystals. This is due to a localized and minimized input of thermal energy. Solderjet bumping technology has been used to assemble a lens mount breadboard taking as input specifications the requirements found for the optical beam expander for the European Space Agency (ESA) EarthCare Mission. The silica lens and a titanium barrel have been designed and assembled with this technology in order to withstand the stringent mission demands; handling high mechanical and thermal loads without losing its optical performances. Finally a high-precision opto-mechanical lens mount has been assembled with a minimal localized stress (<1 MPa) showing outstanding performances in terms of wave-front error measurements and beam depolarization ratio before and after environmental tests.

  14. Break-up Process of Perturbed Molten Metal Jet and Preparation of Lead-Free Solder Balls

    Institute of Scientific and Technical Information of China (English)

    He Lijun; Zhang Shuguang; Zhang Shaoming; Xu Jun; Shi Likai

    2004-01-01

    Solder balls, which are used in advanced electronics packages such as BGA (Ball Grid Array) and CSP (Chip Scale Package) to substitute the leads and realize the electrical and mechanical connections between substrate and chip,have severe specifications in diameter tolerance, roundness and surface quality, and therefore challenge the traditional technologies for fabrication of metallic particles and powders. The present work made a survey of perturbed molten metal jet break-up process, observed the formation and growth of capillary wave of tin-lead melt jet by way of rapid solidification, and on the basis of the above research, successfully obtained tin-lead eutectic and Sn-4.0Ag-0.5Cu lead free solder balls with tight distribution and good sphericity of particles through optimization of processing parameters, forming a solid base for cost effectively producing solder balls.

  15. A PROJECT-BASED LEARNING PACKAGE FOR PH. D CANDIDATES AT HIT

    Institute of Scientific and Technical Information of China (English)

    ZhaoYuqin

    2004-01-01

    Project-based learning is to involve students in a project-like learning program to achieve the required purposes of language learning, It is a new pedagogical approach composed of a series of tasks, requiring students to use various languages and other skills to accomplish respectively. It is to provide students with opportunities to learn the language in a simulated authentic communicative situation when they are using the language. A project-based learning program was desigued for the Ph. D.candidates at HIT, named “simulating an international conference”. It involves the students in the whole process of organizing and participating an international conference. In the simulated context, students have opportunities to learn and practice English while they are using English to fulfill some tasks. Meanwhile, students are able to practice other skills, such as using information technologies, word editing and publishing. More importantly, students need to collaborate and cooperate with each other. The abilities to use English as a communicative tool for international communication, to use information technologies and to be able to cooperate with other sare the aims of education in the 21st century.

  16. Solid particle erosion of steels and nickel based alloys candidates for USC steam turbine blading

    Energy Technology Data Exchange (ETDEWEB)

    Cernuschi, Federico; Guardamagna, Cristina; Lorenzoni, Lorenzo [ERSE SpA, Milan (Italy); Robba, Davide [CESI, Milan (Italy)

    2010-07-01

    The main objective of COST536 Action is to develop highly efficient steam power plant with low emissions, from innovative alloy development to validation of component integrity. In this perspective, to improve the operating efficiency, materials capable of withstanding higher operating temperatures are required. For the manufacturing of components for steam power plants with higher efficiency steels and nickel-based alloys with improved oxidation resistance and creep strength at temperature as high as 650 C - 700 C have to be developed. Candidate alloys for manufacturing high pressure steam turbine diaphragms, buckets, radial seals and control valves should exhibit, among other properties, a good resistance at the erosion phenomena induced by hard solid particles. Ferric oxide (magnetite) scales cause SPE by exfoliating from boiler tubes and steam pipes (mainly super-heaters and re-heaters) and being transported within the steam flow to the turbine. In order to comparatively study the erosion behaviour of different materials in relatively short times, an accelerated experimental simulation of the erosion phenomena must be carried out. Among different techniques to induce erosion on material targets, the use of an air jet tester is well recognised to be one of the most valid and reliable. In this work the results of SPE comparative tests performed at high temperatures (550 C, 600 C and 650 C) at different impaction angles on some steels and nickel based alloys samples are reported. (orig.)

  17. Packaging of hard solder 500W QCW diode laser array

    Science.gov (United States)

    Li, Xiaoning; Wang, Jingwei; Hou, Dong; Nie, Zhiqiang; Liu, Xingsheng

    2016-03-01

    The package structure critically influences the major characteristics of diode laser, such as thermal behavior, output power, wavelength and smile effect. In this work, a novel micro channel cooler (MCC) for stack array laser with good heat dissipation capability and high reliability is presented. Numerical simulations of thermal management with different MCC structure are conducted and analyzed. Based on this new MCC packaging structure, a series of QCW 500W high power laser arrays with hard solder packaging technology has been fabricated. The performances of the laser arrays are characterized. A narrow spectrum of 3.12 nm and an excellent smile value are obtained. The lifetime of the laser array is more than 1.38×109 shots and still ongoing.

  18. Modeling of thermal processes in waveguide tracts induction soldering

    Science.gov (United States)

    Murygin, A. V.; Tynchenko, V. S.; Laptenok, V. D.; Emilova, O. A.; Seregin, Yu N.

    2017-02-01

    The problem solving of the induction heating models development, which describe the heating of the separate structural assembly components of the waveguide path and product generally, is presented in this paper. Proposed mathematical models are based on the thermodynamics equation and on the heat balance law. The system of the heating process mathematical models, such as surge tube and flange heating, and the mathematical model of the energy distribution are presented. During the modeling process with Matlab system by using mathematical models graphs of the tube, flange and coupling heating were obtained. These design charts are confirmed by the results of the experimental study. During the experimental studies pyrometers for temperature control and a video camera for visual control of the process parameters were used. On the basis of obtained models the induction soldering process features analysis is carried out and the need of its automation by the using of the information control systems for thermal management between the connection elements is revealed.

  19. In-situ Investigation of Lead-free Solder Alloy Formation Using a Hot-plate Microscope

    DEFF Research Database (Denmark)

    Bergmann, René; Tang, Peter Torben; Hansen, Hans Nørgaard

    2007-01-01

    This work presents the advantages of using a hot-plate microscope for investigation of new (high-temperature) lead- free solders as in-situ analysis tool and preparation equipment. A description of the equipment and the preparation method is given and some examples are outlined. The formation...... of small AuSn-based, homogeneous and un-oxidized solder spheres will be demonstrated. Moreover the possibility of using this equipment as a sample preparation method to further investigation is shown. As example the equipment was used to produce samples for Vickers microhardness measurement of important...

  20. Duality Symmetry and Soldering in Different Dimensions

    CERN Document Server

    Banerjee, R

    1997-01-01

    We develop a systematic method of obtaining duality symmetric actions in different dimensions. This technique is applied for the quantum mechanical harmonic oscillator, the scalar field theory in two dimensions and the Maxwell theory in four dimensions. In all cases there are two such distinct actions. Furthermore, by soldering these distinct actions in any dimension a master action is obtained which is duality invariant under a much bigger set of symmetries than is usually envisaged. The concept of swapping duality is introduced and its implications are discussed. The effects of coupling to gravity are also elaborated. Finally, the extension of the analysis for arbitrary dimensions is indicated.

  1. Investigation on the Microstructure, Interfacial IMC Layer, and Mechanical Properties of Cu/Sn-0.7Cu- xNi/Cu Solder Joints

    Science.gov (United States)

    Yang, Li; Ge, Jinguo; Zhang, Yaocheng; Dai, Jun; Liu, Haixiang; Xiang, Jicen

    2016-07-01

    Sn-0.7Cu- xNi composite solder has been fabricated via mechanical mixing of different weight percentages of Ni particles with Sn-0.7Cu solder paste, and the effect of the Ni concentration on the microstructure, wettability, and tensile properties of Cu/Sn-0.7Cu- xNi/Cu solder joints investigated. The results show that refined dot-shaped particles of intermetallic compounds (IMCs) are uniformly dispersed in a primary β-Sn matrix in the Cu/Sn-0.7Cu-(0.05-0.1)Ni/Cu solder joints. The interfacial IMC layer thickness increased slightly when adding Ni content to 0.05 wt.%, then rapidly when further increasing the Ni concentration to 0.4 wt.%. Excellent wettability with bright appearance was obtained for the Sn-0.7Cu-0.05Ni solder due to diminished interfacial tension. The tensile properties improved after adding Ni content to 0.05 wt.% due to the presence of the refined dot-like IMC particles, in agreement with theoretical predictions based on the combination of dispersion and grain-refinement strengthening mechanisms. Refined microstructure and enhanced mechanical properties were obtained for the Cu/Sn-0.7Cu-0.05Ni/Cu solder joint.

  2. Interfacial Phenomena in Al/Al, Al/Cu, and Cu/Cu Joints Soldered Using an Al-Zn Alloy with Ag or Cu Additions

    Science.gov (United States)

    Pstruś, Janusz; Gancarz, Tomasz

    2014-05-01

    The studies of soldered joints were carried out in systems: Al/solder/Al, Al/solder/Cu, Cu/solder/Cu, where the solder was (Al-Zn)EUT, (Al-Zn)EUT with 0.5, 1.0, and 1.5 at.% of Ag and (Al-Zn)EUT with 0.5, 1.0, and 1.5 at.% of Cu addition. Brazing was performed at 500 °C for 3 min. The EDS analysis indicated that the composition of the layers starting from the Cu pad was CuZn, Cu5Zn8, and CuZn4, respectively. Wetting tests were performed at 500 °C for 3, 8, 15, and 30 min, respectively. Thickness of the layers and their kinetics of growth were measured based on the SEM micrographs. The formation of interlayers was not observed from the side of Al pads. On the contrary, dissolution of the Al substrate and migration of Al-rich particles into the bulk of the solder were observed.

  3. Novel chikungunya vaccine candidate with an IRES-based attenuation and host range alteration mechanism.

    Directory of Open Access Journals (Sweden)

    Kenneth Plante

    2011-07-01

    Full Text Available Chikungunya virus (CHIKV is a reemerging mosquito-borne pathogen that has recently caused devastating urban epidemics of severe and sometimes chronic arthralgia. As with most other mosquito-borne viral diseases, control relies on reducing mosquito populations and their contact with people, which has been ineffective in most locations. Therefore, vaccines remain the best strategy to prevent most vector-borne diseases. Ideally, vaccines for diseases of resource-limited countries should combine low cost and single dose efficacy, yet induce rapid and long-lived immunity with negligible risk of serious adverse reactions. To develop such a vaccine to protect against chikungunya fever, we employed a rational attenuation mechanism that also prevents the infection of mosquito vectors. The internal ribosome entry site (IRES from encephalomyocarditis virus replaced the subgenomic promoter in a cDNA CHIKV clone, thus altering the levels and host-specific mechanism of structural protein gene expression. Testing in both normal outbred and interferon response-defective mice indicated that the new vaccine candidate is highly attenuated, immunogenic and efficacious after a single dose. Furthermore, it is incapable of replicating in mosquito cells or infecting mosquitoes in vivo. This IRES-based attenuation platform technology may be useful for the predictable attenuation of any alphavirus.

  4. Trust Based Algorithm for Candidate Node Selection in Hybrid MANET-DTN

    Directory of Open Access Journals (Sweden)

    Jan Papaj

    2014-01-01

    Full Text Available The hybrid MANET - DTN is a mobile network that enables transport of the data between groups of the disconnected mobile nodes. The network provides benefits of the Mobile Ad-Hoc Networks (MANET and Delay Tolerant Network (DTN. The main problem of the MANET occurs if the communication path is broken or disconnected for some short time period. On the other side, DTN allows sending data in the disconnected environment with respect to higher tolerance to delay. Hybrid MANET - DTN provides optimal solution for emergency situation in order to transport information. Moreover, the security is the critical factor because the data are transported by mobile devices. In this paper, we investigate the issue of secure candidate node selection for transportation of the data in a disconnected environment for hybrid MANET- DTN. To achieve the secure selection of the reliable mobile nodes, the trust algorithm is introduced. The algorithm enables select reliable nodes based on collecting routing information. This algorithm is implemented to the simulator OPNET modeler.

  5. 1WHSP: An IR-based sample of ~1000 VHE γ-ray blazar candidates

    Science.gov (United States)

    Arsioli, B.; Fraga, B.; Giommi, P.; Padovani, P.; Marrese, P. M.

    2015-07-01

    Context. Blazars are the dominant type of extragalactic sources at microwave and at γ-ray energies. In the most energetic part of the electromagnetic spectrum (E ≳ 100 GeV) a high fraction of high Galactic latitude sources are blazars of the high synchrotron peaked (HSP) type, that is BL Lac objects with synchrotron power peaking in the UV or in the X-ray band. Building new large samples of HSP blazars is key to understand the properties of jets under extreme conditions, and to study the demographics and the peculiar cosmological evolution of these sources. Aims: High synchrotron peaked blazars are remarkably rare, with only a few hundreds of them expected to be above the sensitivity limits of currently available surveys, some of which include hundreds of millions of sources. To find these very uncommon objects, we have devised a method that combines ALLWISE survey data with multi-frequency selection criteria. Methods: The sample was defined starting from a primary list of infrared colour-colour selected sources from the ALLWISE all sky survey database, and applying further restrictions on IR-radio and IR-X-ray flux ratios. Using a polynomial fit to the multi-frequency data (radio to X-ray), we estimated synchrotron peak frequencies and fluxes of each object. Results: We assembled a sample including 992 sources, which is currently the largest existing list of confirmed and candidates HSP blazars. All objects are expected to radiate up to the highest γ-ray photon energies. In fact, 299 of these are confirmed emitters of GeV γ-ray photons (based on Fermi-LAT catalogues), and 36 have already been detected in the TeV band. The majority of sources in the sample are within reach of the upcoming Cherenkov Telescope Array (CTA), and many may be detectable even by the current generation of Cherenkov telescopes during flaring episodes. The sample includes 425 previously known blazars, 151 new identifications, and 416 HSP candidates (mostly faint sources) for which no

  6. Environmentally compatible solder materials for thick film hybrid assemblies

    Energy Technology Data Exchange (ETDEWEB)

    Hosking, F.M.; Vianco, P.T.; Rejent, J.A.; Hernandez, C.L. [Sandia National Labs., Albuquerque, NM (United States). Materials and Process Sciences Center

    1997-02-01

    New soldering materials and processes have been developed over the last several years to address a variety of environmental issues. One of the primary efforts by the electronics industry has involved the development of alternative solders to replace the traditional lead-containing alloys. Sandia National Laboratories is developing such alternative solder materials for printed circuit board and hybrid microcircuit (HMC) applications. This paper describes the work associated with low residue, lead-free soldering of thick film HMC`s. The response of the different materials to wetting, aging, and mechanical test conditions was investigated. Hybrid test vehicles were designed and fabricated with a variety of chip capacitors and leadless ceramic chip carriers to conduct thermal, electrical continuity, and mechanical evaluations of prototype joints. Microstructural development along the solder and thick film interface, after isothermal solid state aging over a range of elevated temperatures and times, was quantified using microanalytical techniques. Flux residues on soldered samples were stressed (temperature-humidity aged) to identify potential corrosion problems. Mechanical tests also supported the development of a solder joint lifetime prediction model. Progress of this effort is summarized.

  7. Electromigration of composite Sn-Ag-Cu solder bumps

    Science.gov (United States)

    Sharma, Ashutosh; Xu, Di Erick; Chow, Jasper; Mayer, Michael; Sohn, Heung-Rak; Jung, Jae Pil

    2015-11-01

    This study investigates the electromigration (EM) behavior of lead free Sn-Ag-Cu (SAC) solder alloys that were reinforced with different types of nanoparticles [Copper-coated carbon nanotubes (Cu/CNT), La2O3, Graphene, SiC, and ZrO2]. The composite solders were bumped on a Cu substrate at 220°C, and the resistance of the bumped solders was measured using a four wire setup. Current aging was carried out for 4 hours at a temperature of 160°C, and an increase in resistance was noted during this time. Of all the composite solders that were studied, La2O3 and SiC reinforced SAC solders exhibited the smallest resistances after current aging. However, the rate of change in the resistance at room temperature was lower for the SiC-reinforced SAC solder. The SAC and Graphene reinforced SAC solder bumps completely failed within 15 - 20 min of these tests. The SiC nanoparticles were reported to possibly entrap the SAC atoms better than other nanoparticles with a lower rate of EM. [Figure not available: see fulltext.

  8. A candidate gene-based association study of tocopherol content and composition in rapeseed (Brassica napus

    Directory of Open Access Journals (Sweden)

    Steffi eFritsche

    2012-06-01

    Full Text Available Rapeseed (Brassica napus L. is the most important oil crop of temperate climates. Rapeseed oil contains tocopherols, also known as vitamin E, which is an indispensable nutrient for humans and animals due to its antioxidant and radical scavenging abilities. Moreover, tocopherols are also important for the oxidative stability of vegetable oils. Therefore, seed oil with increased tocopherol content or altered tocopherol composition is a target for breeding. We investigated the role of nucleotide variations within candidate genes from the tocopherol biosynthesis pathway. Field trials were carried out with 229 accessions from a worldwide B. napus collection which was divided into two panels of 96 and 133 accessions. Seed tocopherol content and composition were measured by HPLC. High heritabilities were found for both traits, ranging from 0.62 to 0.94. We identified polymorphisms by sequencing selected regions of the tocopherol genes from the 96 accession panel. Subsequently, we determined the population structure (Q and relative kinship (K as detected by genotyping with genome-wide distributed SSR markers. Association studies were performed using two models, the structure-based GLM+Q and the PK mixed model. Between 26 and 12 polymorphisms within two genes (BnaX.VTE3.a, BnaA.PDS1.c were significantly associated with tocopherol traits. The SNPs explained up to 16.93 % of the genetic variance for tocopherol composition and up to 10.48 % for total tocopherol content. Based on the sequence information we designed CAPS markers for genotyping the 133 accessions from the 2nd panel. Significant associations with various tocopherol traits confirmed the results from the first experiment. We demonstrate that the polymorphisms within the tocopherol genes clearly impact tocopherol content and composition in B. napus seeds. We suggest that these nucleotide variations may be used as selectable markers for breeding rapeseed with enhanced tocopherol quality.

  9. Detection of the early keratoconus based on corneal biomechanical properties in the refractive surgery candidates

    Directory of Open Access Journals (Sweden)

    Zofia Pniakowska

    2016-01-01

    Full Text Available Context: Subclinical keratoconus is contraindication to refractive surgery. The currently used methods of preoperative screening do not always allow differentiating between healthy eyes and those with subclinical keratoconus. Aim: To evaluate biomechanical parameters of the cornea, waveform score (WS, and intraocular pressure (IOP as potentially useful adjuncts to the diagnostic algorithm for precise detection of the early keratoconus stages and selection of refractive surgery candidates. Settings and Design: Department of Ophthalmology and prospective cross-sectional study. Patients and Methods: Patients enrolled in the study were diagnosed with refractive disorders. We assessed parameters of corneal biomechanics such as corneal hysteresis (CH, corneal resistance factor (CRF, Goldman-correlated IOP (IOPg, corneal compensated IOP, WS, and keratoconus match index (KMI. They were classified into one of three groups based on the predefined KMI range: Group 1 (from 0.352 to 0.757 – 45 eyes, Group 2 (from −0.08 to 0.313 – 52 eyes, and Group 0 - control group (from 0.761 to 1.642 – 80 eyes. Results: In both study groups, IOPg, CRF, and CH were decreased when compared to control (P < 0.0001. In control group, there was positive correlation between CH and KMI (P < 0.05, with no correlations in any of the two study groups. CRF correlated positively with KMI in control (P < 0.0001 and in Group 2 (P < 0.05. Conclusions: CH and CRF, together with WS and IOPg, consist a clinically useful adjunct to detect subclinical keratoconus in patients referred for refractive surgery when based on KMI staging.

  10. Albumin-genipin solder for laser tissue welding

    Science.gov (United States)

    Lauto, Antonio; Foster, John; Avolio, Albert; Poole-Warren, Laura

    2004-07-01

    Background. Laser tissue soldering (LTS) is an alternative technique to suturing for tissue repair. One of the major drawbacks of LTS is the weak tensile strength of the solder welds when compared to sutures. In this study, the possibility was investigated for a low cytotoxic crosslinker, acting on amino groups, to enhance the bond strength of albumin solders. Materials and Methods. Solder strips were welded onto rectangular sections of sheep small intestine by a diode laser. The laser delivered in continuous mode mode a power of 170 +/- 10 mW at λ=808 nm, through a multimode optical fiber (core size = 200 μm) to achieve a dose of 10.8 +/- 0.5 J/mg. The solder thickness and surface area were kept constant throughout the experiment (thickness = 0.15 +/- 1 mm, area = 12 +/- 1.2 mm2). The solder incorporated 62% bovine serum albumin, 0.38% genipin, 0.25% indocyanin green dye (IG) and water. Tissue welding was also performed with a similar solder, which did not incorporate genipin, as a control group. The repaired tissue was tested for tensile strength by a calibrated tensiometer. Results. The tensile strength of the "genipin" solder was twice as high as the strength of the BSA solder (0.21 +/- 0.04 N and 0.11 +/- 0.04 N respectively; p~10-15 unpaired t-test, N=30). Discussion. Addition of a chemical crosslinking agent, such as genipin, significantly increased the tensile strength of adhesive-tissue bonds. A proposed mechanism for this enhanced bond strength is the synergistic action of mechanical adhesion with chemical crosslinking by genipin.

  11. Mechanical Reliability of Aged Lead-­Free Solders

    OpenAIRE

    Lewin, Susanne

    2012-01-01

    The usage of lead-­free solder joints in electronic packaging is of greatest concern to the electronic industry due to the health and environmental hazards arising with the use of lead. As a consequence, lead is legally prohibited in the European Union and the industry is aiming to produce lead-free products.            The reliability of solder joints is an important issue as the failure could destroy the whole function of a product. SnAgCu is a commonly used alloy for lead-­free solders. Co...

  12. Solder technology in the manufacturing of electronic products

    Energy Technology Data Exchange (ETDEWEB)

    Vianco, P.T.

    1993-08-01

    The electronics industry has relied heavily upon the use of soldering for both package construction and circuit assembly. The solder attachment of devices onto printed circuit boards and ceramic microcircuits has supported the high volume manufacturing processes responsible for low cost, high quality consumer products and military hardware. Defects incurred during the manufacturing process are minimized by the proper selection of solder alloys, substrate materials and process parameters. Prototyping efforts are then used to evaluate the manufacturability of the chosen material systems. Once manufacturing feasibility has been established, service reliability of the final product is evaluated through accelerated testing procedures.

  13. Modular construction of quaternary hemiaminal-based inhibitor candidates and their in cellulo assessment with HIV-1 protease.

    Science.gov (United States)

    Gros, Guillaume; Martinez, Lorena; Gimenez, Anna Servat; Adler, Paula; Maurin, Philippe; Wolkowicz, Roland; Falson, Pierre; Hasserodt, Jens

    2013-09-01

    Non-peptidomimetic drug-like protease inhibitors have potential for circumventing drug resistance. We developed a much-improved synthetic route to our previously reported inhibitor candidate displaying an unusual quaternized hemi-aminal. This functional group forms from a linear precursor upon passage into physiological media. Seven variants were prepared and tested in cellulo with our HIV-1 fusion-protein technology that result in an eGFP-based fluorescent readout. Three candidates showed inhibition potency above 20μM and toxicity at higher concentrations, making them attractive targets for further refinement. Importantly, our class of original inhibitor candidates is not recognized by two major multidrug resistance pumps, quite in contrast to most clinically applied HIV-1 protease inhibitors.

  14. Crystal plasticity finite element analysis of deformation behaviour in SAC305 solder joint

    Science.gov (United States)

    Darbandi, Payam

    Due to the awareness of the potential health hazards associated with the toxicity of lead (Pb), actions have been taken to eliminate or reduce the use of Pb in consumer products. Among those, tin (Sn) solders have been used for the assembly of electronic systems. Anisotropy is of significant importance in all structural metals, but this characteristic is unusually strong in Sn, making Sn based solder joints one of the best examples of the influence of anisotropy. The effect of anisotropy arising from the crystal structure of tin and large grain microstructure on the microstructure and the evolution of constitutive responses of microscale SAC305 solder joints is investigated. Insights into the effects of key microstructural features and dominant plastic deformation mechanisms influencing the measured relative activity of slip systems in SAC305 are obtained from a combination of optical microscopy, orientation imaging microscopy (OIM), slip plane trace analysis and crystal plasticity finite element (CPFE) modeling. Package level SAC305 specimens were subjected to shear deformation in sequential steps and characterized using optical microscopy and OIM to identify the activity of slip systems. X-ray micro Laue diffraction and high energy monochromatic X-ray beam were employed to characterize the joint scale tensile samples to provide necessary information to be able to compare and validate the CPFE model. A CPFE model was developed that can account for relative ease of activating slip systems in SAC305 solder based upon the statistical estimation based on correlation between the critical resolved shear stress and the probability of activating various slip systems. The results from simulations show that the CPFE model developed using the statistical analysis of activity of slip system not only can satisfy the requirements associated with kinematic of plastic deformation in crystal coordinate systems (activity of slip systems) and global coordinate system (shape changes

  15. Chest Fat Quantification via CT Based on Standardized Anatomy Space in Adult Lung Transplant Candidates

    Science.gov (United States)

    Tong, Yubing; Udupa, Jayaram K.; Torigian, Drew A.; Odhner, Dewey; Wu, Caiyun; Pednekar, Gargi; Palmer, Scott; Rozenshtein, Anna; Shirk, Melissa A.; Newell, John D.; Porteous, Mary; Diamond, Joshua M.

    2017-01-01

    Purpose Overweight and underweight conditions are considered relative contraindications to lung transplantation due to their association with excess mortality. Yet, recent work suggests that body mass index (BMI) does not accurately reflect adipose tissue mass in adults with advanced lung diseases. Alternative and more accurate measures of adiposity are needed. Chest fat estimation by routine computed tomography (CT) imaging may therefore be important for identifying high-risk lung transplant candidates. In this paper, an approach to chest fat quantification and quality assessment based on a recently formulated concept of standardized anatomic space (SAS) is presented. The goal of the paper is to seek answers to several key questions related to chest fat quantity and quality assessment based on a single slice CT (whether in the chest, abdomen, or thigh) versus a volumetric CT, which have not been addressed in the literature. Methods Unenhanced chest CT image data sets from 40 adult lung transplant candidates (age 58 ± 12 yrs and BMI 26.4 ± 4.3 kg/m2), 16 with chronic obstructive pulmonary disease (COPD), 16 with idiopathic pulmonary fibrosis (IPF), and the remainder with other conditions were analyzed together with a single slice acquired for each patient at the L5 vertebral level and mid-thigh level. The thoracic body region and the interface between subcutaneous adipose tissue (SAT) and visceral adipose tissue (VAT) in the chest were consistently defined in all patients and delineated using Live Wire tools. The SAT and VAT components of chest were then segmented guided by this interface. The SAS approach was used to identify the corresponding anatomic slices in each chest CT study, and SAT and VAT areas in each slice as well as their whole volumes were quantified. Similarly, the SAT and VAT components were segmented in the abdomen and thigh slices. Key parameters of the attenuation (Hounsfield unit (HU) distributions) were determined from each chest slice and

  16. Solderability and intermetallic compounds formation of Sn-9Zn-xAg lead-free solders wetted on Cu substrate

    Institute of Scientific and Technical Information of China (English)

    CHEN Wenxue; XUE Songbai; WANG Hui; WANG Jianxin; HAN Zongjie

    2009-01-01

    The eutectie Sn-9Zn alloy was doped with Ag (0 wt.%-1 wt.%) to form Sn-9Zn-xAg lead-free solder alloys. The effect of the addition of Ag on the microstructure and solderability of this alloy was investigated and intermetallic compounds (IMCs) formed at the solder/Cu interface were also examined in this study. The results show that, due to the addition of Ag, the microstructure of the solder changes. When the quan-tity of Ag is lower than 0.3 wt.%, the needle-like Zn-rich phase decreases gradually. However, when the quantity of Ag is 0.5 wt.%-1 wt.%, Ag-Zn intermetallic compounds appear in the solder. In particular, adding 0.3 wt.% Ag improves the wetting behavior due to the better oxi-dation resistance of the Sn-9Zn solder. The addition of an excessive amount of Ag will deteriorate the wetting property because the gluti-nosity and fluidity of Sn-9Zn-(0.5, 1)Ag solder decrease. The results also indicate that the addition of Ag to the Sn-Zn solder leads to the pre-cipitation of ε-AgZn_3 from the liquid solder on preformed interracial intermetallics (Cu_5Zn_8). The peripheral AgZn_3, nodular on the Cu_5Zn_8 IMCs layer, is likely to be generated by a peritectic reaction L+γ-Ag_5Zn8→ε-AgZn_3 and the following crystallization of AgZn_3.

  17. Relative effect of solder flux chemistry on the humidity related failures in electronics

    DEFF Research Database (Denmark)

    Verdingovas, Vadimas; Jellesen, Morten Stendahl; Ambat, Rajan

    2015-01-01

    was studied by quartz crystal microbalance, while corrosive effects were studied by leakage current and impedance measurements on standard test boards. The measurements were performed as a function of relative humidity (RH) in the range from 60 to ~99 per cent at 25°C. The corrosiveness of solder flux systems...... of printed circuit boards under humid conditions. Originality/value - The classification of solder flux systems according to IPC J-STD-004 standard does not specify the WOAs in the flux; however, ranking of the flux systems based on the hygroscopic property of activators would be useful information when...... selecting no-clean flux systems for electronics with applications in humid conditions....

  18. A cell wall protein-based vaccine candidate induce protective immune response against Sporothrix schenckii infection.

    Science.gov (United States)

    Portuondo, Deivys Leandro; Batista-Duharte, Alexander; Ferreira, Lucas Souza; Martínez, Damiana Téllez; Polesi, Marisa Campos; Duarte, Roberta Aparecida; de Paula E Silva, Ana Carolina Alves; Marcos, Caroline Maria; Almeida, Ana Marisa Fusco de; Carlos, Iracilda Zeppone

    2016-02-01

    Sporotrichosis is a subcutaneous mycosis caused by several closely related thermo-dimorphic fungi of the Sporothrix schenckii species complex, affecting humans and other mammals. In the last few years, new strategies have been proposed for controlling sporotrichosis owning to concerns about its growing incidence in humans, cats, and dogs in Brazil, as well as the toxicity and limited efficacy of conventional antifungal drugs. In this study, we assessed the immunogenicity and protective properties of two aluminum hydroxide (AH)-adsorbed S. schenckii cell wall protein (ssCWP)-based vaccine formulations in a mouse model of systemic S. schenckii infection. Fractioning by SDS-PAGE revealed nine protein bands, two of which were functionally characterized: a 44kDa peptide hydrolase and a 47kDa enolase, which was predicted to be an adhesin. Sera from immunized mice recognized the 47kDa enolase and another unidentified 71kDa protein, whereas serum from S. schenckii-infected mice recognized both these proteins plus another unidentified 9.4kDa protein. Furthermore, opsonization with the anti-ssCWP sera led to markedly increased phagocytosis and was able to strongly inhibit the fungus' adhesion to fibroblasts. Immunization with the higher-dose AH-adjuvanted formulation led to increased ex vivo release of IL-12, IFN-γ, IL-4, and IL-17, whereas only IL-12 and IFN-γ were induced by the higher-dose non-adjuvanted formulation. Lastly, passive transference of the higher-dose AH-adjuvanted formulation's anti-ssCWP serum was able to afford in vivo protection in a subsequent challenge with S. schenckii, becoming a viable vaccine candidate for further testing.

  19. High temperature solder alloys for underhood applications. Progress report

    Energy Technology Data Exchange (ETDEWEB)

    Drewien, C.A.; Yost, F.G.; Sackinger, S. [Sandia National Labs., Albuquerque, NM (United States); Kern, J.; Weiser, M.W. [Univ. of New Mexico (United States). Dept. of Mechanical Engineering

    1995-02-01

    Under a cooperative research and development agreement with General Motors Corporation, lead-free solder systems including the flux, metallization, and solder are being developed for high temperature, underhood applications. Six tin-rich solders, five silver-rich metallizations, and four fluxes were screened using an experimental matrix whereby every combination was used to make sessile drops via hot plate or Heller oven processing. The contact angle, sessile drop appearance, and in some instances the microstructure was evaluated to determine combinations that would yield contact angles of less than 30{degrees}, well-formed sessile drops, and fine, uniform microstructures. Four solders, one metallization, and one flux were selected and will be used for further aging and mechanical property studies.

  20. Exploring Mathematical Knowledge in Elementary Teacher Candidates with the Use of Classroom-Based Artifacts

    Science.gov (United States)

    Gillentine, E. Paige

    2013-01-01

    Researchers have suggested that teachers use a specialized type of knowledge specifically attributed to the work of teaching. One aspect of this specific type of knowledge is the ability to analyze children's work. With continued emphasis on a teacher's ability to analyze their students' thought processes, teacher candidates will need to develop…

  1. Method of defence of solder surface from oxidization

    Directory of Open Access Journals (Sweden)

    Kurmashev Sh. D.

    2010-02-01

    Full Text Available Compositions are developed for defence of fusion solder from oxidization on the basis of mixture of glycerin, urea and powders of refractory oxides, carbides (Al2O3, TiO2, SIC, graphite. The offered compositions can be used for defence of fusion of solder from oxidization in the process of soludering and tinning of explorers, and also electric conclusions of elements of radio electronic apparatus by the method of immersion in stationary baths.

  2. Critical evaluations of lead-free solder alloys and performance comparisons

    Energy Technology Data Exchange (ETDEWEB)

    Hitch, T.T.; Palit, K.; Prabhu, A.N. [David Sarnoff Research Center, Princeton, NJ (United States)

    1996-12-31

    This paper discusses the methodology for solder alloy selection, solder preparation processes, test selection, results, and conclusions. The conclusions from this phase of study were that: (1). Solders containing significant amounts of bismuth exhibit poor fatigue life. (2). The Sn-Ag-Cu alloy was the best solder we studied for use as a replacement for Sn-Pb eutectic. A second phase of the work involved detailed study of the Sn-Ag-Cu system with other additions to determine the optimum lead-free solder compositions in terms of melting point, solderability, and mechanical properties.

  3. Interfacial Reaction of Sn-Ag-Cu Lead-Free Solder Alloy on Cu: A Review

    OpenAIRE

    Liu Mei Lee; Ahmad Azmin Mohamad

    2013-01-01

    This paper reviews the function and importance of Sn-Ag-Cu solder alloys in electronics industry and the interfacial reaction of Sn-Ag-Cu/Cu solder joint at various solder forms and solder reflow conditions. The Sn-Ag-Cu solder alloys are examined in bulk and in thin film. It then examines the effect of soldering conditions to the formation of intermetallic compounds such as Cu substrate selection, structural phases, morphology evolution, the growth kinetics, temperature and time is also disc...

  4. Life cycle assessment (LCA of lead-free solders from the environmental protection aspect

    Directory of Open Access Journals (Sweden)

    Mitovski Aleksandra M.

    2009-01-01

    Full Text Available Life-cycle assessment (LCA presents a relatively new approach, which allows comprehensive environmental consequences analysis of a product system over its entire life. This analysis is increasingly being used in the industry, as a tool for investigation of the influence of the product system on the environment, and serves as a protection and prevention tool in ecological management. This method is used to predict possible influences of a certain material to the environment through different development stages of the material. In LCA, the product systems are evaluated on a functionally equivalent basis, which, in this case, was 1000 cubic centimeters of an alloy. Two of the LCA phases, life-cycle inventory (LCA and life-cycle impact assessment (LCIA, are needed to calculate the environmental impacts. Methodology of LCIA applied in this analysis aligns every input and output influence into 16 different categories, divided in two subcategories. The life-cycle assessment reaserch review of the leadfree solders Sn-Cu, SAC (Sn-Ag-Cu, BSA (Bi-Sb-Ag and SABC (Sn-Ag-Bi-Cu respectively, is given in this paper, from the environmental protection aspect starting from production, through application process and finally, reclamation at the end-of-life, i.e. recycling. There are several opportunities for reducing the overall environmental and human health impacts of solder used in electronics manufacturing based on the results of the LCA, such as: using secondary metals reclaimed through post-industrial recycling; power consumption reducing by replacing older, less efficient reflow assembly equipment, or by optimizing the current equipment to perform at the elevated temperatures required for lead-free soldering, etc. The LCA analysis was done comparatively in relation to widely used Sn-Pb solder material. Additionally, the impact factors of material consumption, energy use, water and air reserves, human health and ecotoxicity have been ALSO considered including

  5. Sputtered Ni-Zn under bump metallurgy (UBM) for Sn-Ag-Cu solders

    Energy Technology Data Exchange (ETDEWEB)

    Kim, Tae Jin; Kim, Young Min [Division of Materials Science and Engineering, Hanyang University, Seoul 133-791 (Korea, Republic of); Kim, Young-Ho, E-mail: kimyh@hanyang.ac.kr [Division of Materials Science and Engineering, Hanyang University, Seoul 133-791 (Korea, Republic of)

    2012-09-15

    Highlights: Black-Right-Pointing-Pointer Ni-Zn UBM can effectively suppress the growth of IMCs and the consumption of UBM. Black-Right-Pointing-Pointer The growth of (Ni, Cu){sub 3}Sn{sub 4} was retarded at the SAC305/Ni-Zn interface after aging. Black-Right-Pointing-Pointer Only a single (Cu, Ni){sub 6}Sn{sub 5} formed at the SAC107/Ni-Zn interface after aging. Black-Right-Pointing-Pointer Segregated Zn atoms on IMC layers retarded the interdiffusion of Cu, Ni, and Sn. Black-Right-Pointing-Pointer Sputtered Ni-Zn UBM is promising for Pb-free solder flip chip applications. - Abstract: We developed a new sputtered under bump metallurgy (UBM) based on Ni-20wt% Zn thin films for Pb-free solders. This study focuses on the interfacial reactions between two Pb-free solders (Sn3.0Ag0.5Cu and Sn1.0Ag0.7Cu) and a Ni-Zn alloy UBM. By adding Zn to Ni UBM, Zn is incorporated into intermetallic compounds (IMCs) to form a quaternary Cu-Ni-Zn-Sn phase at the solder/Ni-Zn interface after reflow and subsequent isothermal aging. The Ni-Zn UBM sufficiently reduces the interfacial reaction and IMCs formation rates as well as UBM consumption rates compared to a Ni UBM. In particular, the formation of (Ni, Cu){sub 3}Sn{sub 4} IMC was significantly retarded by adding Zn into UBM.

  6. Time And Temperature Dependent Micromechanical Properties Of Solder Joints For 3D-Package Integration

    Science.gov (United States)

    Roellig, Mike; Meier, Karsten; Metasch, Rene

    2010-11-01

    The recent development of 3D-integrated electronic packages is characterized by the need to increase the diversity of functions and to miniaturize. Currently many 3D-integration concepts are being developed and all of them demand new materials, new designs and new processing technologies. The combination of simulation and experimental investigation becomes increasingly accepted since simulations help to shorten the R&D cycle time and reduce costs. Numerical calculations like the Finite-Element-Method are strong tools to calculate stress conditions in electronic packages resulting from thermal strains due to the manufacturing process and environmental loads. It is essential for the application of numerical calculations that the material data is accurate and describes sufficiently the physical behaviour. The developed machine allows the measurement of time and temperature dependent micromechanical properties of solder joints. Solder joints, which are used to mechanically and electrically connect different packages, are physically measured as they leave the process. This allows accounting for process influences, which may change material properties. Additionally, joint sizes and metallurgical interactions between solder and under bump metallization can be respected by this particular measurement. The measurement allows the determination of material properties within a temperature range of 20° C-200° C. Further, the time dependent creep deformation can be measured within a strain-rate range of 10-31/s-10-81/s. Solder alloys based on Sn-Ag/Sn-Ag-Cu with additionally impurities and joint sizes down to O/ 200 μm were investigated. To finish the material characterization process the material model coefficient were extracted by FEM-Simulation to increase the accuracy of data.

  7. Solderability perservative coatings: Electroless tin vs. organic azoles

    Energy Technology Data Exchange (ETDEWEB)

    Artaki, I.; Ray, U.; Jackson, A.M.; Gordon, H.M. [AT and T Bell Labs., Princeton, NJ (United States); Vianco, P.T. [Sandia National Labs., Albuquerque, NM (United States)

    1993-07-01

    This paper compares the solderability performance and corrosions ion protection effectiveness of electroless tin coatings versus organic azole films after exposure to a series of humidity and thermal (lead-free solders) cycling conditions. The solderability of immersion tin is directly related to the tin oxide growth on the surface and is not affected by the formation of Sn-Cu intermetallic phases as long as the intermetallic phase is protected by a Sn layer. For a nominal tin thickness of 60{mu}inches, the typical thermal excursions associated with assembly are not sufficient to cause the intermetallic phase to consume the entire tin layer. Exposure to humidity at moderate to elevated temperatures promotes heavy tin oxide formation which leads to solderability loss. In contrast, thin azole films are more robust to humidity exposure; however upon heating in the presence of oxygen, they decompose and lead to severe solderability degradation. Evaluations of lead-free solder pastes for surface mount assembly applications indicate that immersion tin significantly improves the spreading of Sn:Ag and Sn:Bi alloys as compared to azole surface finishes.

  8. Soldering of Thin Film-Metallized Glass Substrates

    Energy Technology Data Exchange (ETDEWEB)

    Hosking, F.M.; Hernandez, C.L.; Glass, S.J.

    1999-03-31

    The ability to produce reliable electrical and structural interconnections between glass and metals by soldering was investigated. Soldering generally requires premetallization of the glass. As a solderable surface finish over soda-lime-silicate glass, two thin films coatings, Cr-Pd-Au and NiCr-Sn, were evaluated. Solder nettability and joint strengths were determined. Test samples were processed with Sn60-Pb40 solder alloy at a reflow temperature of 210 C. Glass-to-cold rolled steel single lap samples yielded an average shear strength of 12 MPa. Solder fill was good. Control of the Au thickness was critical in minimizing the formation of AuSn{sub 4} intermetallic in the joint, with a resulting joint shear strength of 15 MPa. Similar glass-to-glass specimens with the Cr-Pd-Au finish failed at 16.5 MPa. The NiCr-Sn thin film gave even higher shear strengths of 20-22.5 MPa, with failures primarily in the glass.

  9. Microsurgical anastomosis of sperm duct by laser tissue soldering

    Science.gov (United States)

    Wehner, Martin M.; Teutu-Kengne, Alain-Fleury; Brkovic, Drasko; Henning, Thomas; Klee, Doris; Poprawe, Reinhart; Jakse, Gerhard

    2005-04-01

    Connection of small vessels is usually done by suturing which is very cumbersome. Laser tissue soldering can circumvent that obstacle if a handy procedure can be defined. Our principle approach consists of a bioresorbable hollow stent with an expected degradation time of 3 weeks in combination with laser soldering. The stent is to be fed into the vessel to stabilize both ends and should allow percolation immediately after joining. The stents are made of Poly(D,L-lactid-co-glycolid) and solder is prepared from bovine serum albumin (BSA) doped with Indocyanine green (ICG) as chromophore to increase the absorption of laser light. After insertion, solder is applied onto the outer surface of the vessel and coagulated by laser radiation. The wavelength of 810 nm of a diode laser fits favorably to absorption properties of tissue and solder such that heating up of tissue is limited to prevent from necrosis and wound healing complications. In our study the preparation of stents, the consistency and doping of solder, a beam delivery instrument and the irradiation conditions are worked out. In-vitro tests are carried out on sperm ducts of Sprague-Dowlae (SD) rats. Different irradiation conditions are investigated and a micro-optical system consisting of a lens and a reflecting prism to ensure simultaneous irradiation of front and back side of the vessels tested. Under these conditions, the short-term rupture strength of laser anastomosis revealed as high as those achieved by suturing.

  10. Laser Soldering of Rat Skin Using a Controlled Feedback System

    Directory of Open Access Journals (Sweden)

    Mohammad Sadegh Nourbakhsh

    2009-03-01

    Full Text Available Introduction: Laser tissue soldering using albumin and indocyanine green dye (ICG is an effective technique utilized in various surgical procedures. The purpose of this study was to perform laser soldering of rat skin under a feedback control system and compare the results with those obtained using standard sutures. Material and Methods: Skin incisions were made over eight rats’ dorsa, which were subsequently closed using different wound closure interventions in two groups: (a using a temperature controlled infrared detector or (b by suture. Tensile strengths were measured at 2, 5, 7 and 10 days post-incision. Histological examination was performed at the time of sacrifice. Results: Tensile strength results showed that during the initial days following the incisions, the tensile strengths of the sutured samples were greater than the laser samples. However, 10 days after the incisions, the tensile strengths of the laser soldered incisions were higher than the sutured cuts. Histopathological examination showed a preferred wound healing response in the soldered skin compared with the control samples. The healing indices of the laser soldered repairs (426 were significantly better than the control samples (340.5. Conclusion: Tissue feedback control of temperature and optical changes in laser soldering of skin leads to a higher tensile strength and better histological results and hence this method may be considered as an alternative to standard suturing.

  11. 基于二次多项式回归方法的无铅钎料设计%Design for lead-free solder based on of the quadratic polynomial regression method

    Institute of Scientific and Technical Information of China (English)

    杨拓宇; 李忠芳; 陈丰; 夏显明

    2012-01-01

    采用统计理论中的二次多项式回归方法,进行新型的无铅钎料的组分设计.对搜集到的SnAgCu合金成分与熔点数据进行统计分析.按照交互作用关系,建立起熔点与各种元素相关关系的数学模型.在已有的成分与熔点之间,找出一个明确的函数表达式.定量描述成分对熔化温度范围的影响程度.经过对方程的检验,对该数学模型进行优化运算;在区间外对融化范围进行预测,得到银铜交互作用的三维立体图.预测出较低熔点时的合金成分范围.在钎料中添加锗作为合金化元素.采用高频感应加热设备作为热源制备出新的钎料.分析测试表明:试样成分均匀、组织细密.%Adopting the statistical theory of quadratic polynomial regression method, we designed the new component of lead-free solder.Various alloy composition and melting point of the SnAgCu Lead Free System Alloy are collected and analyzed. According to interaction relations between the melting point and various elements, the mathematical model is established.An explicit (unction expression on the composition and melting point is found.The impact of composition on the melting temperature range is quantitatively described. After inspection of the equation, the mathematical model is optimized predicting the melting range outside the range of existing ingredients, three-dimensional map of the silver-copper interaction is obtained.The Alloy composition range in low melting point was predicted.Germanium is added to the solder as an alloying element. Frequency induction heating equipment as a heat source,Quartz tube as a melting vessel,Inert gas as a protective factor, the solder was prepared.Analysis and test results show that: the sample is very uniform composition and its micro structure is very fine.

  12. Fully Pipelined Parallel Architecture for Candidate Block and Pixel-Subsampling-Based Motion Estimation

    Directory of Open Access Journals (Sweden)

    Reeba Korah

    2008-01-01

    Full Text Available This paper presents a low power and high speed architecture for motion estimation with Candidate Block and Pixel Subsampling (CBPS Algorithm. Coarse-to-fine search approach is employed to find the motion vector so that the local minima problem is totally eliminated. Pixel subsampling is performed in the selected candidate blocks which significantly reduces computational cost with low quality degradation. The architecture developed is a fully pipelined parallel design with 9 processing elements. Two different methods are deployed to reduce the power consumption, parallel and pipelined implementation and parallel accessing to memory. For processing 30 CIF frames per second our architecture requires a clock frequency of 4.5 MHz.

  13. Multiple candidates and multiple constraints based accurate depth estimation for multi-view stereo

    Science.gov (United States)

    Zhang, Chao; Zhou, Fugen; Xue, Bindang

    2017-02-01

    In this paper, we propose a depth estimation method for multi-view image sequence. To enhance the accuracy of dense matching and reduce the inaccurate matching which is produced by inaccurate feature description, we select multiple matching points to build candidate matching sets. Then we compute an optimal depth from a candidate matching set which satisfies multiple constraints (epipolar constraint, similarity constraint and depth consistency constraint). To further increase the accuracy of depth estimation, depth consistency constraint of neighbor pixels is used to filter the inaccurate matching. On this basis, in order to get more complete depth map, depth diffusion is performed by neighbor pixels' depth consistency constraint. Through experiments on the benchmark datasets for multiple view stereo, we demonstrate the superiority of proposed method over the state-of-the-art method in terms of accuracy.

  14. Characterization nanoparticles-based vaccines and vaccine candidates: a Transmission Electron Microscopy study

    Directory of Open Access Journals (Sweden)

    I. Menéndez I

    2016-05-01

    Full Text Available Transmission Electron Microscopy (TEM is a valuable tool for the biotech industry. This paper summarizes some of the contributions of MET in the characterization of the recombinant antigens are part of vaccines or vaccine candidates obtained in the CIGB. It mentions the use of complementary techniques MET (Negative staining, and immunoelectron that enhance visualization and ultrastructural characterization of the recombinant proteins obtained by Genetic Engineering.

  15. Identification of Novel Potential Vaccine Candidates against Tuberculosis Based on Reverse Vaccinology.

    Science.gov (United States)

    Monterrubio-López, Gloria P; González-Y-Merchand, Jorge A; Ribas-Aparicio, Rosa María

    2015-01-01

    Tuberculosis (TB) is a chronic infectious disease, considered as the second leading cause of death worldwide, caused by Mycobacterium tuberculosis. The limited efficacy of the bacillus Calmette-Guérin (BCG) vaccine against pulmonary TB and the emergence of multidrug-resistant TB warrants the need for more efficacious vaccines. Reverse vaccinology uses the entire proteome of a pathogen to select the best vaccine antigens by in silico approaches. M. tuberculosis H37Rv proteome was analyzed with NERVE (New Enhanced Reverse Vaccinology Environment) prediction software to identify potential vaccine targets; these 331 proteins were further analyzed with VaxiJen for the determination of their antigenicity value. Only candidates with values ≥0.5 of antigenicity and 50% of adhesin probability and without homology with human proteins or transmembrane regions were selected, resulting in 73 antigens. These proteins were grouped by families in seven groups and analyzed by amino acid sequence alignments, selecting 16 representative proteins. For each candidate, a search of the literature and protein analysis with different bioinformatics tools, as well as a simulation of the immune response, was conducted. Finally, we selected six novel vaccine candidates, EsxL, PE26, PPE65, PE_PGRS49, PBP1, and Erp, from M. tuberculosis that can be used to improve or design new TB vaccines.

  16. Identification of Novel Potential Vaccine Candidates against Tuberculosis Based on Reverse Vaccinology

    Directory of Open Access Journals (Sweden)

    Gloria P. Monterrubio-López

    2015-01-01

    Full Text Available Tuberculosis (TB is a chronic infectious disease, considered as the second leading cause of death worldwide, caused by Mycobacterium tuberculosis. The limited efficacy of the bacillus Calmette-Guérin (BCG vaccine against pulmonary TB and the emergence of multidrug-resistant TB warrants the need for more efficacious vaccines. Reverse vaccinology uses the entire proteome of a pathogen to select the best vaccine antigens by in silico approaches. M. tuberculosis H37Rv proteome was analyzed with NERVE (New Enhanced Reverse Vaccinology Environment prediction software to identify potential vaccine targets; these 331 proteins were further analyzed with VaxiJen for the determination of their antigenicity value. Only candidates with values ≥0.5 of antigenicity and 50% of adhesin probability and without homology with human proteins or transmembrane regions were selected, resulting in 73 antigens. These proteins were grouped by families in seven groups and analyzed by amino acid sequence alignments, selecting 16 representative proteins. For each candidate, a search of the literature and protein analysis with different bioinformatics tools, as well as a simulation of the immune response, was conducted. Finally, we selected six novel vaccine candidates, EsxL, PE26, PPE65, PE_PGRS49, PBP1, and Erp, from M. tuberculosis that can be used to improve or design new TB vaccines.

  17. Solderability of Sn-9Zn-0.5Ag-1In lead-free solder on Cu substrate

    Energy Technology Data Exchange (ETDEWEB)

    Chang, T.-C. [Department of Materials Science and Engineering, National Cheng Kung University, 1 Ta-Hsueh Road, Tainan 70101, Taiwan (China); Wang, J.-W. [Department of Environmental and Safety Engineering, Chung Hwa College of Medical Technology, 89 Wen-Hwa 1st Street, Jen-Te, Tainan 71703, Taiwan (China); Wang, M.-C. [Department of Mechanical Engineering, National Kaohsiung University of Applied Sciences, 415 Chien-Kung Road, Kaohsiung 80782, Taiwan (China)]. E-mail: mcwang@cc.kuas.edu.tw; Hon, M.-H. [Department of Materials Science and Engineering, National Cheng Kung University, 1 Ta-Hsueh Road, Tainan 70101, Taiwan (China); Da-Yeh University, 112 Shan Jean Road, Da-tsuen, Chang-hua, Taiwan (China)

    2006-09-28

    The thermal properties, microstructure corrosion and oxidation resistance of the Sn-9Zn-0.5Ag-1In lead-free solder have been investigated by differential scanning calorimetry, X-ray diffractometry, scanning electron microscopy, energy dispersive spectrometry, potentiostat and thermogravimetry. The Sn-9Zn-0.5Ag-1In solder alloy has a near-eutectic composition, it melts at 187.6 deg. C and the heat of fusion is determined as 71.3 J/g. The Sn-9Zn-0.5Ag-1In solder alloy with a corrosion potential of -1.09 V{sub SCE} and a current density of 9.90 x 10{sup -2} A/cm{sup 2}, shows a better corrosion resistance than that of the Sn-9Zn solder alloy. From the thermogravimetry analysis, the weight gain ratio of the Sn-9Zn solder alloy appears a parabolic relationship at 150 deg. C. The initial oxidation behavior of the Sn-9Zn-0.5Ag and Sn-9Zn-0.5Ag-1In solder alloys also shows a parabolic relationship but the weight gain ratio of them appears a negative linear one after aging at 150 deg. C for 2.5 and 5 h, respectively.

  18. Effect of Thick Film Firing Conditions on the Solderability and Structure of Au-Pt-Pd Conductor for Low-Temperature, Co-Fired Ceramic Substrates

    Energy Technology Data Exchange (ETDEWEB)

    Hernandez, C.L; Vianco, P.T.

    1999-03-16

    Low-temperature, co-fired ceramics (LTCC) are the substrate material-of-choice for a growing number of multi-chip module (MCM) applications. Unlike the longer-standing hybrid microcircuit technology based upon alumina substrates, the manufacturability and reliability of thick film solder joints on LTCC substrates have not been widely studied. An investigation was undertaken to fully characterize such solder joints. A surface mount test vehicle with Daisy chain electrical connections was designed and built with Dupont{trademark} 951 tape. The Dupont{trademark} 4569 thick film ink (Au76-Pt21 -Pd3 wt.%) was used to establish the surface conductor pattern. The conductor pattern was fired onto the LTCC substrate in a matrix of process conditions that included: (1) double versus triple prints, (2) dielectric frame versus no frame, and (3) three firing temperatures (800 C, 875 C and 950 C). Pads were examined from the test vehicles. The porosity of the thick film layers was measured using quantitative image analysis in both the transverse and short transverse directions. A significant dependence on firing temperature was recorded for porosity. Solder paste comprised of Sn63-Pb37 powder with an RMA flux was screen printed onto the circuit boards. The appropriate components, which included chip capacitors of sizes 0805 up to 2225 and 50 mil pitch, leadless ceramic chip carriers having sizes of 16 I/O to 68 I/O, were then placed on the circuit boards. The test vehicles were oven reflowed under a N{sub 2} atmosphere. The solderability of the thick film pads was also observed to be sensitive to the firing conditions. Solderability appeared to degrade by the added processing steps needed for the triple print and dielectric window depositions. However, the primary factor in solderability was the firing temperature. Solderability was poorer when the firing temperature was higher.

  19. Prime candidate earth targets for the post-launch radiometric calibration of space-based optical imaging instruments

    Science.gov (United States)

    Teillet, P.M.; Barsi, J.A.; Chander, G.; Thome, K.J.

    2007-01-01

    This paper provides a comprehensive list of prime candidate terrestrial targets for consideration as benchmark sites for the post-launch radiometric calibration of space-based instruments. The key characteristics of suitable sites are outlined primarily with respect to selection criteria, spatial uniformity, and temporal stability. The establishment and utilization of such benchmark sites is considered an important element of the radiometric traceability of satellite image data products for use in the accurate monitoring of environmental change.

  20. The Reliability of Microalloyed Sn-Ag-Cu Solder Interconnections Under Cyclic Thermal and Mechanical Shock Loading

    Science.gov (United States)

    Mattila, Toni T.; Hokka, Jussi; Paulasto-Kröckel, Mervi

    2014-11-01

    In this study, the performance of three microalloyed Sn-Ag-Cu solder interconnection compositions (Sn-3.1Ag-0.52Cu, Sn-3.0Ag-0.52Cu-0.24Bi, and Sn-1.1Ag-0.52Cu-0.1Ni) was compared under mechanical shock loading (JESD22-B111 standard) and cyclic thermal loading (40 ± 125°C, 42 min cycle) conditions. In the drop tests, the component boards with the low-silver nickel-containing composition (Sn-Ag-Cu-Ni) showed the highest average number of drops-to-failure, while those with the bismuth-containing alloy (Sn-Ag-Cu-Bi) showed the lowest. Results of the thermal cycling tests showed that boards with Sn-Ag-Cu-Bi interconnections performed the best, while those with Sn-Ag-Cu-Ni performed the worst. Sn-Ag-Cu was placed in the middle in both tests. In this paper, we demonstrate that solder strength is an essential reliability factor and that higher strength can be beneficial for thermal cycling reliability but detrimental to drop reliability. We discuss these findings from the perspective of the microstructures and mechanical properties of the three solder interconnection compositions and, based on a comprehensive literature review, investigate how the differences in the solder compositions influence the mechanical properties of the interconnections and discuss how the differences are reflected in the failure mechanisms under both loading conditions.

  1. Double layer structure-based virtual screening reveals 3'-Hydroxy-A-Naphthoflavone as novel inhibitor candidate of human acetylcholinesterase

    Science.gov (United States)

    Ichsan, Mochammad; Pangastuti, Ardini; Habibi, Mohammad Wildan; Juliana, Kartika

    2016-03-01

    One of the most effective target for Alzheimer's disease's (AD) treatment is the inhibition of human acetylcholinesterase (hAChE) eventhough it has many side effects. So that, this study was aimed to discover a new candidate of hAChE's inhibitor that has more negative binding affinity than existing drugs. hAChE's 3D model used in this study has a good quality according to its number of residues in most favoured regions (92%), three bad contacts, >50 ERRAT's score (85,870) and successfully passed the VERIFY 3D threshold (>80%). Based on the first layer of SBVS againts more than 12.180.630 ligands, we discovered 11.806 hits and then we found 359 hits from the second layer of SBVS. Based on our previous steps, we found that 3'-Hydroxy-a-Naphthoflavone was the only one candidate, that directly interacted with Trp286 via hydrogen bond and hydrophobic interactions and also has the most negative binding affinity (-10,6 kcal/mol) and also has more negative than existing hAChE's inhibitors, such as tacrine, donepezil, etc. 3'-Hydroxy-a-Naphthoflavone is the best candidate of hAChE's inhibitor based on its binding affinity (-10,6 kcal/mol) that is more negative than existing hAChE's inhibitors, such as tacrine, donepezil, etc.

  2. Fast-Solving Quasi-Optimal LS-S$³$VM Based on an Extended Candidate Set.

    Science.gov (United States)

    Ma, Yuefeng; Liang, Xun; Kwok, James T; Li, Jianping; Zhou, Xiaoping; Zhang, Haiyan

    2017-02-14

    The semisupervised least squares support vector machine (LS-S³VM) is an important enhancement of least squares support vector machines in semisupervised learning. Given that most data collected from the real world are without labels, semisupervised approaches are more applicable than standard supervised approaches. Although a few training methods for LS-S³VM exist, the problem of deriving the optimal decision hyperplane efficiently and effectually has not been solved. In this paper, a fully weighted model of LS-S³VM is proposed, and a simple integer programming (IP) model is introduced through an equivalent transformation to solve the model. Based on the distances between the unlabeled data and the decision hyperplane, a new indicator is designed to represent the possibility that the label of an unlabeled datum should be reversed in each iteration during training. Using the indicator, we construct an extended candidate set consisting of the indices of unlabeled data with high possibilities, which integrates more information from unlabeled data. Our algorithm is degenerated into a special scenario of the previous algorithm when the extended candidate set is reduced into a set with only one element. Two strategies are utilized to determine the descent directions based on the extended candidate set. Furthermore, we developed a novel method for locating a good starting point based on the properties of the equivalent IP model. Combined with the extended candidate set and the carefully computed starting point, a fast algorithm to solve LS-S³VM quasi-optimally is proposed. The choice of quasi-optimal solutions results in low computational cost and avoidance of overfitting. Experiments show that our algorithm equipped with the two designed strategies is more effective than other algorithms in at least one of the following three aspects: 1) computational complexity; 2) generalization ability; and 3) flexibility. However, our algorithm and other algorithms have similar

  3. Establishing a Th17 based mouse model for preclinical assessment of the toxicity of candidate microbicides

    Institute of Scientific and Technical Information of China (English)

    LI Liang-zhu; YANG Yu; YUAN Song-hua; WAN Yan-min; QIU Chao; FENG Yan-ling; XU Jian-qing; ZHANG Xiao-yan

    2010-01-01

    one mouse (score: 8), which were significantly associated with both inflammatory cytokines IL-17A and IL-6 and anti-inflammatory cytokines IL-4 and IL-10. Interestingly, IL-17A showed significant positive association with inflammatory cytokine TNF-α (r=0.739; P <0.05), anti-inflammatory cytokines IL-10 (r=0.804; P <0.01) and IL-4 (r=0.668; P <0.05).Conclusions Our data demonstrate that a panel of cytokines (IL-17A, IL-6, IL-4 and IL-10) could be used as surrogate biomarkers to predict the histopathological damage. Th17 may play a central role in orchestrating inflammatory cytokine responses. This Th17 based mouse model is cost-effective and suitable to assess the toxicity of candidate microbicides in preclinical studies.

  4. Development of a new Pb-free solder: Sn-Ag-Cu

    Energy Technology Data Exchange (ETDEWEB)

    Miller, C.M.

    1995-02-10

    With the ever increasing awareness of the toxicity of Pb, significant pressure has been put on the electronics industry to get the Pb out of solder. This work pertains to the development and characterization of an alloy which is Pb-free, yet retains the proven positive qualities of current Sn-Pb solders while enhancing the shortcomings of Sn-Pb solder. The solder studied is the Sn-4.7Ag-1.7Cu wt% alloy. By utilizing a variety of experimental techniques the alloy was characterized. The alloy has a melting temperature of 217{degrees}C and exhibits eutectic melting behavior. The solder was examined by subjecting to different annealing schedules and examining the microstructural stability. The effect of cooling rate on the microstructure of the solder was also examined. Overall, this solder alloy shows great promise as a viable alternative to Pb-bearing solders and, as such, an application for a patent has been filed.

  5. Solder wetting behavior enhancement via laser-textured surface microcosmic topography

    Science.gov (United States)

    Chen, Haiyan; Peng, Jianke; Fu, Li; Wang, Xincheng; Xie, Yan

    2016-04-01

    In order to reduce or even replace the use of Sn-Pb solder in electronics industry, the laser-textured surface microstructures were used to enhance the wetting behavior of lead free solder during soldering. According to wetting theory and Sn-Ag-Cu lead free solder performance, we calculated and designed four microcosmic structures with the similar shape and different sizes to control the wetting behavior of lead free solder. The micro-structured surfaces with different dimensions were processed on copper plates by fiber femtosecond laser, and the effect of microstructures on wetting behavior was verified experimentally. The results showed that the wetting angle of Sn-Ag-Cu solder on the copper plate with microstructures decreased effectively compared with that on the smooth copper plate. The wetting angles had a sound fit with the theoretical values calculated by wetting model. The novel method provided a feasible route for adjusting the wetting behavior of solders and optimizing solders system.

  6. Interaction Kinetics between Sn-Pb Solder Droplet and Au/Ni/Cu Pad

    Institute of Scientific and Technical Information of China (English)

    Fuquan LI; Chunqing WANG; Yanhong TIAN

    2006-01-01

    The interfacial phenomena of the Sn-Pb solder droplet on Au/Ni/Cu pad are investigated. A continuous AuSn2and needle-like AuSn4 are formed at the interface after the liquid state reaction (soldering). The interfacial reaction between the solder and Au layer continues during solid state aging with AuSn4 breaking off from the interface and felling into the solder. The kinetics of Au layer dissolution and diffusion into the solder during soldering and aging is analyzed to elucidate intermetallic formation mechanism at the solder/Au pad interface.The concentration of Au near the solder/pad interface is identified to increase and reach the solubility limit during the period of liquid state reaction. During solid state reaction, the thickening of Au-Sn compound is mainly controlled by element diffusion.

  7. Microbial leaching of waste solder for recovery of metal.

    Science.gov (United States)

    Hocheng, H; Hong, T; Jadhav, U

    2014-05-01

    This study proposes an environment-friendly bioleaching process for recovery of metals from solders. Tin-copper (Sn-Cu), tin-copper-silver (Sn-Cu-Ag), and tin-lead (Sn-Pb) solders were used in the current study. The culture supernatant of Aspergillus niger removed metals faster than the culture supernatant of Acidithiobacillus ferrooxidans. Also, the metal removal by A. niger culture supernatant is faster for Sn-Cu-Ag solder as compared to other solder types. The effect of various process parameters such as shaking speed, temperature, volume of culture supernatant, and increased solder weight on bioleaching of metals was studied. About 99 (±1.75) % metal dissolution was achieved in 60 h, at 200-rpm shaking speed, 30 °C temperature, and by using 100-ml A. niger culture supernatant. An optimum solder weight for bioleaching was found to be 5 g/l. Addition of sodium hydroxide (NaOH) and sodium chloride (NaCl) in the bioleached solution from Sn-Cu-Ag precipitated tin (85 ± 0.35 %) and silver (80 ± 0.08 %), respectively. Passing of hydrogen sulfide (H2S) gas at pH 8.1 selectively precipitated lead (57.18 ± 0.13 %) from the Sn-Pb bioleached solution. The proposed innovative bioleaching process provides an alternative technology for recycling waste solders to conserve resources and protect environment.

  8. A PSF-based approach to Kepler/K2 data. II. Exoplanet candidates in Praesepe (M 44)

    CERN Document Server

    Libralato, M; Bedin, L R; Borsato, L; Granata, V; Malavolta, L; Piotto, G; Ochner, P; Cunial, A; Nascimbeni, V

    2016-01-01

    In this work we keep pushing K2 data to a high photometric precision, close to that of the Kepler main mission, using a PSF-based, neighbour-subtraction technique, which also overcome the dilution effects in crowded environments. We analyse the open cluster M 44 (NGC 2632), observed during the K2 Campaign 5, and extract light curves of stars imaged on module 14, where most of the cluster lies. We present two candidate exoplanets hosted by cluster members and five by field stars. As a by-product of our investigation, we find 1680 eclipsing binaries and variable stars, 1071 of which are new discoveries. Among them, we report the presence of a heartbeat binary star. Together with this work, we release to the community a catalogue with the variable stars and the candidate exoplanets found, as well as all our raw and detrended light curves.

  9. Analysis of solderability test methods: predicition model generation for through-hole components

    OpenAIRE

    Woods, Bobby

    2013-01-01

    peer-reviewed In order to achieve a reduction in solderability related defects on electronic components and Printed Circuit Board???s (PCB???s) in electronics manufacturing, preventive controls such as ???Dip & Look??? and ???Wetting Balance??? solderability testing need to be fully optimised to screen out all poor soldering components and PCB???s. Components and PCB???s that pass these tests should solder correctly in volume production. This thesis initially investigates the variations...

  10. Mechanical Properties and Microstructure Investigation of Lead Free Solder

    Science.gov (United States)

    Wang, Qing; Gail, William F.; Johnson, R. Wayne; Strickland, Mark; Blanche, Jim

    2005-01-01

    While the electronics industry appears to be focusing on Sn-Ag-Cu as the alloy of choice for lead free electronics assembly, ,the exact composition varies by geographic region, supplier and user. Add to that dissolved copper and silver from the printed circuit board traces and surface finish, and there can be significant variation in the final solder joint composition. A systematic study of the mechanical and microstructural properties of Sn-Ag-Cu alloys with Ag varying from 2wt% to 4wt% and Cu varying from 0.5wt% to lSwt%, was undertaken in this research study. Different sample preparation techniques (water quenched, oil quenched and water quenched followed by reflow) were explored and the resulting microstructure compared to that of a typical reflowed lead free chip scale package (CSP) solder joint. Tensile properties (modulus, 0.2% yield strength and the ultimate tensile strength) and creep behavior of selected alloy compositions (Sn-4Ag-1 X u , Sn-4Ag-OSCu, Sn- 2Ag-1 X u , Sn-2Ag-OSCu, Sn-3.5Ag-O.SCu) were determined for three conditions: as- cast; aged for 100 hours at 125OC; and aged for 250 hours at 125OC. There was no significant difference in Young's Modulus as a function of alloy composition. After an initial decrease in modulus after 100 hours at 125"C, there was an insignificant change with further aging. The distribution of 0.2% strain yield stress and ultimate tensile strength as a function of alloy composition was more significant and decreased with aging time and temperature. The microstructures of these alloys were examined using light and scanning electron microscopy (LM and SEM) respectively and SEM based energy dispersive x-ray spectroscopy (EDS). Fracture surface and cross-section analysis were performed on the specimens after creep testing. The creep testing results and the effect of high temperature aging on mechanical properties is presented for the oil quenched samples. In general the microstructure of oil quenched specimen exhibited a

  11. Imputation-based analysis of association studies: candidate regions and quantitative traits.

    Directory of Open Access Journals (Sweden)

    Bertrand Servin

    2007-07-01

    Full Text Available We introduce a new framework for the analysis of association studies, designed to allow untyped variants to be more effectively and directly tested for association with a phenotype. The idea is to combine knowledge on patterns of correlation among SNPs (e.g., from the International HapMap project or resequencing data in a candidate region of interest with genotype data at tag SNPs collected on a phenotyped study sample, to estimate ("impute" unmeasured genotypes, and then assess association between the phenotype and these estimated genotypes. Compared with standard single-SNP tests, this approach results in increased power to detect association, even in cases in which the causal variant is typed, with the greatest gain occurring when multiple causal variants are present. It also provides more interpretable explanations for observed associations, including assessing, for each SNP, the strength of the evidence that it (rather than another correlated SNP is causal. Although we focus on association studies with quantitative phenotype and a relatively restricted region (e.g., a candidate gene, the framework is applicable and computationally practical for whole genome association studies. Methods described here are implemented in a software package, Bim-Bam, available from the Stephens Lab website http://stephenslab.uchicago.edu/software.html.

  12. Investigations into the Antibacterial Activity of the Silver-Based Antibiotic Drug Candidate SBC3

    Directory of Open Access Journals (Sweden)

    Matthias Tacke

    2012-11-01

    Full Text Available The synthesis of N-heterocyclic carbene (NHC silver(I acetate complexes with varying lipophilic benzyl-substituents at the 1 and 3 positions starting from 4,5-diphenylimidazole, opened a new class of antibiotic drug candidates. These NHC-silver(I acetate derivatives exhibit interesting structural motifs in the solid state and proved to be soluble and stable in biological media. The leading candidate, SBC3, which was known to exhibit good antibacterial activity in preliminary Kirby-Bauer tests, was tested quantitatively using minimum inhibitory concentrations. NHC-silver(I acetate complexes were found to have MIC values ranging from 20 to 3.13 μg/mL for a variety of Gram-positive, Gram-negative and mycobacteria tested. These values represent good antibiotic activities against potential pathogens when compared to clinically approved antibiotics. Most striking is the fact that SBC3 is active against methicillin-resistant Staphylococcus aureus with a MIC value of 12.5 μg/mL.

  13. Polarity effect of electromigration on kinetics of intermetallic compound formation in Pb-free solder V-groove samples

    Science.gov (United States)

    Gan, H.; Tu, K. N.

    2005-03-01

    Intermetallic compound (IMC) formation is critical for the reliability of microelectronic interconnections, especially for flip chip solder joints. In this article, we investigate the polarity effect of electromigration on kinetics of IMC formation at the anode and the cathode in solder V-groove samples. We use V-groove solder line samples, with width of 100 μm and length of 500-700 μm, to study interfacial IMC growth between Cu electrodes and Sn-3.8Ag-0.7Cu (in wt %) solder under different current density and temperature settings. The current densities are in the range of 103 to 104A/cm2 and the temperature settings are 120, 150, and 180 °C. While the same types of IMCs, Cu6Sn5 and Cu3Sn, form at the solder/Cu interfaces independent of the passage of electric current, the growth of the IMC layer has been enhanced by electric current at the anode and inhibited at the cathode, in comparison with the no-current case. We present a kinetic model, based on the Cu mass transport in the sample, to explain the growth rate of IMC at the anode and cathode. The growth of IMC at the anode follows a parabolic growth rule, and we propose that the back stress induced in the IMC plays a significant role. The model is in good agreement with our experimental data. We then discuss the influence of both chemical force and electrical force, and their combined effect on the IMC growth with electric current.

  14. Photonic flash soldering of thin chips and SMD components on foils for flexible electronics

    NARCIS (Netherlands)

    Ende, D.A. van den; Hendriks, R.; Cauchois, R.; Kusters, R.H.L.; Cauwe, M.; Groen, W.A.; Brand, J. van den

    2014-01-01

    Ultrathin bare die chips and small-size surface mount device components were successfully soldered using a novel roll-to-roll compatible soldering technology. A high-power xenon light flash was used to successfully solder the components to copper tracks on polyimide (PI) and polyethylene terephthala

  15. 30 CFR 77.1916 - Welding, cutting, and soldering; fire protection.

    Science.gov (United States)

    2010-07-01

    ... 30 Mineral Resources 1 2010-07-01 2010-07-01 false Welding, cutting, and soldering; fire... OF UNDERGROUND COAL MINES Slope and Shaft Sinking § 77.1916 Welding, cutting, and soldering; fire protection. (a) One portable fire extinguisher shall be provided where welding, cutting, or soldering...

  16. 30 CFR 77.1112 - Welding, cutting, or soldering with arc or flame; safeguards.

    Science.gov (United States)

    2010-07-01

    ... 30 Mineral Resources 1 2010-07-01 2010-07-01 false Welding, cutting, or soldering with arc or... WORK AREAS OF UNDERGROUND COAL MINES Fire Protection § 77.1112 Welding, cutting, or soldering with arc or flame; safeguards. (a) When welding, cutting, or soldering with arc or flame near...

  17. 30 CFR 75.1106 - Welding, cutting, or soldering with arc or flame underground.

    Science.gov (United States)

    2010-07-01

    ... 30 Mineral Resources 1 2010-07-01 2010-07-01 false Welding, cutting, or soldering with arc or... Protection § 75.1106 Welding, cutting, or soldering with arc or flame underground. All welding, cutting, or... conducted in fireproof enclosures. Welding, cutting, or soldering with arc or flame in other than...

  18. Investigation Of Intermetallic Compounds In Sn-Cu-Ni Lead-Free Solders

    Directory of Open Access Journals (Sweden)

    Nagy E.

    2015-06-01

    Full Text Available Interfacial intermetallic compounds (IMC play an important role in Sn-Cu lead-free soldering. The size and morphology of the intermetallic compounds formed between the lead-free solder and the Cu substrate have a significant effect on the mechanical strength of the solder joint.

  19. Reliability of lead-free solders in electronic packaging technology

    Science.gov (United States)

    Choi, Woojin

    The electromigration of flip chip solder bump (eutetic SnPb) has been studied at temperatures of 100, 125 and 150°C and current densities of 1.9 to 2.75 x 104 A/cm2. The under-bump-metallization on the chip side is thin film Al/Ni(V)/Cu and on the board side is thick Cu. By simulation, we found that current crowding occurs at the corner on the chip side where the electrons enter the solder ball. We are able to match this simulation to the real electromigration damage in the sample. The experimental result showed that voids initiated from the position of current crowding and propagated across the interface between UBM and the solder ball. The Cu-Sn intermetallic compounds formed during the reflow is known to adhere well to the thin film UBM, but they detached from the UBM after current stressing. Therefore, the UBM itself becomes part of the reliability problem of the flip chip solder joint under electromigration. Currently there is a renewed interest in Sn whisker growth owing to the introduction of Pb-free solder in electronic manufacturing. The leadframe is electroplated or finished with a layer of Pb-free solder. The solder is typically pure Sn or eutectic SnCu (0.7 atomic % Cu). It is a serious reliability concern in the use of the eutectic SnCu solder as leadframe surface finish due to the growth of long whiskers on it. The origin of the driving force of compressive stress can be mechanical, thermal, and chemical. Among them, the chemical force is the most important contribution to the whisker growth and its origin is due to the reaction between Sn and Cu to form intermetallic compound (IMC) at room temperature. For whisker or hillock growth, the surface cannot be free of oxide and it must be covered with oxide and the oxide must be a protective one so that it removes effectively all the vacancy sources and sinks on the surface. Hence, only those metals, which grow protective oxides such as Al and Sn, are known to have hillock growth or whisker growth. We

  20. Experimental Methods in Reduced-gravity Soldering Research

    Science.gov (United States)

    Pettegrew, Richard D.; Struk, Peter M.; Watson, John K.; Haylett, Daniel R.

    2002-01-01

    The National Center for Microgravity Research, NASA Glenn Research Center, and NASA Johnson Space Center are conducting an experimental program to explore the influence of reduced gravity environments on the soldering process. An improved understanding of the effects of the acceleration environment is important to application of soldering during current and future human space missions. Solder joint characteristics that are being considered include solder fillet geometry, porosity, and microstructural features. Both through-hole and surface mounted devices are being investigated. This paper focuses on the experimental methodology employed in this project and the results of macroscopic sample examination. The specific soldering process, sample configurations, materials, and equipment were selected to be consistent with those currently on-orbit. Other apparatus was incorporated to meet requirements imposed by operation onboard NASA's KC-135 research aircraft and instrumentation was provided to monitor both the atmospheric and acceleration environments. The contingent of test operators was selected to include both highly skilled technicians and less skilled individuals to provide a population cross-section that would be representative of the skill mix that might be encountered in space mission crews.

  1. Low-temperature solder for laser tissue welding

    Science.gov (United States)

    Lauto, Antonio; Stewart, Robert B.; Felsen, D.; Foster, John; Poole-Warren, Laura; Poppas, Dix P.

    2003-12-01

    In this study, a two layer (TL) solid solder was developed with a fixed thickness to minimize the difference in temperature across the solder (ΔT) and to weld at low temperature. Solder strips comprising two layers (65% albumin, 35% water) were welded onto rectangular sections of dog small intestine by a diode laser (λ = 808 nm). The laser delivered a power of 170 +/- 10 mW through an optical fiber (spot size approximately 1 mm) for 100 seconds. A solder layer incorporated also a dye (carbon black, 0.25%) to absorb the laser radiation. A thermocouple and an infrared thermometer system recorded the temperatures at the tissue interface and at the external solder surface, during welding. The repaired tissue was tested for tensile strength by a calibrated tensiometer. The TL strips were able to minimize ΔT (12 +/- 4°C) and control the temperature at tissue-interface. The strips fused on tissue at 55=70°C for tissue repair, which cause more irreversible thermal damage.

  2. Old and Unemployable? How Age‐Based Stereotypes Affect Willingness to Hire Job Candidates

    Science.gov (United States)

    Swift, Hannah J.; Drury, Lisbeth

    2016-01-01

    Across the world, people are required, or want, to work until an increasingly old age. But how might prospective employers view job applicants who have skills and qualities that they associate with older adults? This article draws on social role theory, age stereotypes and research on hiring biases, and reports three studies using age‐diverse North American participants. These studies reveal that: (1) positive older age stereotype characteristics are viewed less favorably as criteria for job hire, (2) even when the job role is low‐status, a younger stereotype profile tends to be preferred, and (3) an older stereotype profile is only considered hirable when the role is explicitly cast as subordinate to that of a candidate with a younger age profile. Implications for age‐positive selection procedures and ways to reduce the impact of implicit age biases are discussed. PMID:27635102

  3. Anti-Lyme Subunit Vaccines: Design and Development of Peptide-Based Vaccine Candidates.

    Science.gov (United States)

    Small, Christina M; Mwangi, Waithaka; Esteve-Gassent, Maria D

    2016-01-01

    Vaccinology today has been presented with several avenues to improve protection against infectious disease. The recent employment of the reverse vaccinology technique has changed the face of vaccine development against many pathogens, including Borrelia burgdorferi, the causative agent of Lyme disease. Using this technique, genomics and in silico analyses come together to identify potentially antigenic epitopes in a high-throughput fashion. The forward methodology of vaccine development was used previously to generate the only licensed human vaccine for Lyme disease, which is no longer on the market. Using reverse vaccinology to identify new antigens and isolate specific epitopes to protect against B. burgdorferi, subunit vaccines will be generated that lack reactogenic and nonspecific epitopes, yielding more effective vaccine candidates. Additionally, novel epitopes are being utilized and are presently in the commercialization pipeline both for B. burgdorferi and other spirochaetal pathogens. The versatility and methodology of the subunit protein vaccine are described as it pertains to Lyme disease from conception to performance evaluation.

  4. A recombinant, chimeric tetravalent dengue vaccine candidate based on a dengue virus serotype 2 backbone.

    Science.gov (United States)

    Osorio, Jorge E; Wallace, Derek; Stinchcomb, Dan T

    2016-01-01

    Dengue fever is caused by infection with one of four dengue virus (DENV) serotypes (DENV-1-4), necessitating tetravalent dengue vaccines that can induce protection against all four DENV. Takeda's live attenuated tetravalent dengue vaccine candidate (TDV) comprises an attenuated DENV-2 strain plus chimeric viruses containing the prM and E genes of DENV-1, -3 and -4 cloned into the attenuated DENV-2 'backbone'. In Phase 1 and 2 studies, TDV was well tolerated by children and adults aged 1.5-45 years, irrespective of prior dengue exposure; mild injection-site symptoms were the most common adverse events. TDV induced neutralizing antibody responses and seroconversion to all four DENV as well as cross-reactive T cell-mediated responses that may be necessary for broad protection against dengue fever.

  5. Effects of Solder Temperature on Pin Through-Hole during Wave Soldering: Thermal-Fluid Structure Interaction Analysis

    Science.gov (United States)

    Abdul Aziz, M. S.; Abdullah, M. Z.; Khor, C. Y.

    2014-01-01

    An efficient simulation technique was proposed to examine the thermal-fluid structure interaction in the effects of solder temperature on pin through-hole during wave soldering. This study investigated the capillary flow behavior as well as the displacement, temperature distribution, and von Mises stress of a pin passed through a solder material. A single pin through-hole connector mounted on a printed circuit board (PCB) was simulated using a 3D model solved by FLUENT. The ABAQUS solver was employed to analyze the pin structure at solder temperatures of 456.15 K (183°C) analysis. In addition, an experiment was conducted to measure the temperature difference (ΔT) between the top and the bottom of the pin. Analysis results showed that an increase in temperature increased the structural displacement and the von Mises stress. Filling time exhibited a quadratic relationship to the increment of temperature. The deformation of pin showed a linear correlation to the temperature. The ΔT obtained from the simulation and the experimental method were validated. This study elucidates and clearly illustrates wave soldering for engineers in the PCB assembly industry. PMID:25225638

  6. An Overview of Surface Finishes and Their Role in Printed Circuit Board Solderability and Solder Joint Performance

    Energy Technology Data Exchange (ETDEWEB)

    Vianco, P.T.

    1998-10-15

    A overview has been presented on the topic of alternative surface finishes for package I/Os and circuit board features. Aspects of processability and solder joint reliability were described for the following coatings: baseline hot-dipped, plated, and plated-and-fused 100Sn and Sn-Pb coatings; Ni/Au; Pd, Ni/Pd, and Ni/Pd/Au finishes; and the recently marketed immersion Ag coatings. The Ni/Au coatings appear to provide the all-around best option in terms of solderability protection and wire bondability. Nickel/Pal ftishes offer a slightly reduced level of performance in these areas that is most likely due to variable Pd surface conditions. It is necessmy to minimize dissolved Au or Pd contents in the solder material to prevent solder joint embrittlement. Ancillary aspects that included thickness measurement techniques; the importance of finish compatibility with conformal coatings and conductive adhesives; and the need for alternative finishes for the processing of non-Pb bearing solders were discussed.

  7. Bosonisation and Duality Symmetry in the Soldering Formalism

    CERN Document Server

    Banerjee, R

    1998-01-01

    We develop a technique that solders the dual aspects of some symmetry. Using this technique it is possible to combine two theories with such symmetries to yield a new effective theory. Some applications in two and three dimensional bosonisation are discussed. In particular, it is shown that two apparently independent three dimensional massive Thirring models with same coupling but opposite mass signatures, in the long wavelegth limit, combine by the process of bosonisation and soldering to yield an effective massive Maxwell theory. Similar features also hold for quantum electrodynamics in three dimensions. We also provide a systematic derivation of duality symmetric actions and show that the soldering mechanism leads to a master action which is duality invariant under a bigger set of symmetries than is usually envisaged. The concept of duality swapping is introduced and its implications are analysed. The example of electromagnetic duality is discussed in details.

  8. Corrosion Issues in Solder Joint Design and Service

    Energy Technology Data Exchange (ETDEWEB)

    VIANCO,PAUL T.

    1999-11-24

    Corrosion is an important consideration in the design of a solder joint. It must be addressed with respect to the service environment or, as in the case of soldered conduit, as the nature of the medium being transported within piping or tubing. Galvanic-assisted corrosion is of particular concern, given the fact that solder joints are comprised of different metals or alloy compositions that are in contact with one-another. The (thermodynamic) potential for corrosion to take place in a particular environment requires the availability of the galvanic series for those conditions and which includes the metals or alloys in question. However, the corrosion kinetics, which actually determine the rate of material loss under the specified service conditions, are only available through laboratory evaluations or field data that are found in the existing literature or must be obtained by in-house testing.

  9. Horizon Shells and BMS-like Soldering Transformations

    CERN Document Server

    Blau, Matthias

    2015-01-01

    We revisit the theory of null shells in general relativity, with a particular emphasis on null shells placed at horizons of black holes. We study in detail the considerable freedom that is available in the case that one solders two metrics together across null hypersurfaces (such as Killing horizons) for which the induced metric is invariant under translations along the null generators. In this case the group of soldering transformations turns out to be infinite dimensional, and these solderings create non-trivial horizon shells containing both massless matter and impulsive gravitational wave components. We also rephrase this result in the language of Carrollian symmetry groups. To illustrate this phenomenon we discuss in detail the example of shells on the horizon of the Schwarzschild black hole (with equal interior and exterior mass), uncovering a rich classical structure at the horizon and deriving an explicit expression for the general horizon shell energy-momentum tensor. In the special case of BMS-like ...

  10. Materials chemistry. Composition-matched molecular "solders" for semiconductors.

    Science.gov (United States)

    Dolzhnikov, Dmitriy S; Zhang, Hao; Jang, Jaeyoung; Son, Jae Sung; Panthani, Matthew G; Shibata, Tomohiro; Chattopadhyay, Soma; Talapin, Dmitri V

    2015-01-23

    We propose a general strategy to synthesize largely unexplored soluble chalcogenidometallates of cadmium, lead, and bismuth. These compounds can be used as "solders" for semiconductors widely used in photovoltaics and thermoelectrics. The addition of solder helped to bond crystal surfaces and link nano- or mesoscale particles together. For example, CdSe nanocrystals with Na2Cd2Se3 solder was used as a soluble precursor for CdSe films with electron mobilities exceeding 300 square centimeters per volt-second. CdTe, PbTe, and Bi2Te3 powders were molded into various shapes in the presence of a small additive of composition-matched chalcogenidometallate or chalcogel, thus opening new design spaces for semiconductor technologies.

  11. The impact of process parameters on gold elimination from soldered connector assemblies

    Energy Technology Data Exchange (ETDEWEB)

    VIANCO,PAUL T.; KILGO,ALICE C.

    2000-02-02

    Minimizing the likelihood of solder joint embrittlement in connectors is realized by reducing or eliminating retained Au plating and/or Au-Sn intermetallic compound formation from the assemblies. Gold removal is performed most effectively by using a double wicking process. When only a single wicking procedure can be used, a higher soldering temperature improves the process of Au removal from the connector surfaces and to a nominal extent, removal of Au-contaminated solder from the joint. A longer soldering time did not appear to offer any appreciable improvement toward removing the Au-contaminated solder from the joint. Because the wicking procedure was a manual process, it was operator dependent.

  12. Process characterization and control of hand-soldered printed wiring assemblies

    Energy Technology Data Exchange (ETDEWEB)

    Cheray, D.L.; Mandl, R.G.

    1993-09-01

    A designed experiment was conducted to characterize the hand soldering process parameters for manufacturing printed wiring assemblies (PWAs). Component tinning was identified as the most important parameter in hand soldering. After tinning, the soldering iron tip temperature of 700{degrees}F and the choice of operators influence solder joint quality more than any other parameters. Cleaning and flux/flux core have little impact on the quality of the solder joint. The need for component cleaning prior to assembly must be evaluated for each component.

  13. Improving low-level plasma protein mass spectrometry-based detection for candidate biomarker discovery and validation

    Energy Technology Data Exchange (ETDEWEB)

    Page, Jason S.; Kelly, Ryan T.; Camp, David G.; Smith, Richard D.

    2008-09-01

    Methods. To improve the detection of low abundance protein candidate biomarker discovery and validation, particularly in complex biological fluids such as blood plasma, increased sensitivity is desired using mass spectrometry (MS)-based instrumentation. A key current limitation on the sensitivity of electrospray ionization (ESI) MS is due to the fact that many sample molecules in solution are never ionized, and the vast majority of the ions that are created are lost during transmission from atmospheric pressure to the low pressure region of the mass analyzer. Two key technologies, multi-nanoelectrospray emitters and the electrodynamic ion funnel have recently been developed and refined at Pacific Northwest National Laboratory (PNNL) to greatly improve the ionization and transmission efficiency of ESI MS based analyses. Multi-emitter based ESI enables the flow from a single source (typically a liquid chromatography [LC] column) to be divided among an array of emitters (Figure 1). The flow rate delivered to each emitter is thus reduced, allowing the well-documented benefits of nanoelectrospray 1 for both sensitivity and quantitation to be realized for higher flow rate separations. To complement the increased ionization efficiency afforded by multi-ESI, tandem electrodynamic ion funnels have also been developed at PNNL, and shown to greatly improve ion transmission efficiency in the ion source interface.2, 3 These technologies have been integrated into a triple quadrupole mass spectrometer for multiple reaction monitoring (MRM) of probable biomarker candidates in blood plasma and show promise for the identification of new species even at low level concentrations.

  14. QUICK ASSESSMENT METHODOLOGY FOR RELIABILITY OF SOLDER JOINTS IN BALL GRID ARRAY (BGA) ASSEMBLY——PART Ⅰ: CREEP CONSTITUTIVE RELATION AND FATIGUE MODEL

    Institute of Scientific and Technical Information of China (English)

    史训清; 王志平; John HL Pang; 张学仁; 聂景旭

    2002-01-01

    In this study, a new unified creep constitutive relation and a modified energy-based fatigue model have been established respectively to describe the creep flow and predict the fatigue life of Sn-Pb solders. It is found that the relation successfully elucidates the creep mechanism related to current constitutive relations.The model can be used to describe the temperature and frequency dependent low cycle fatigue behavior of the solder. The relation and the model are further employed in part Ⅱ to develop the numerical simulation approach for the long-term reliability assessment of the plastic ball grid array (BGA) assembly.

  15. 板级跌落碰撞下BGA焊点的失效分析与可靠性%Failure analysis and reliability studying of BGA solder joint in board-level drop test

    Institute of Scientific and Technical Information of China (English)

    朱桂兵

    2012-01-01

    研究焊点在跌落碰撞状态下的可靠性是研究电子产品可靠性的关键技术之一,本文基于JE-DEC冲击跌落标准对焊料的跌落性能进行了测试,试验过程中充分考虑了焊料的材料组成、助焊剂、焊盘的处理方法以及焊球的大小等因素.焊料选择常用的Sn-3Ag-0.5Cu(SAC305)和Sn-1Ag-0.5Cu(SAC105)和Sn63Pb37,焊盘处理方法为Ni/Au电镀法和有机保焊膜(OSP)涂覆法.运用红油浸渍试验和焊点金相剖面分析对焊点的失效模式和可靠性进行分析,结果表明无铅焊料中银含量较低和焊盘采用OSP涂覆法有利于提高BGA焊点的可靠性.%The experimental studying of the reliability of solder joint in dropping and impacting have been a key procedure of studying of the electronic product reliability. The paper have measured the drop performance about solder joint point based on JEDEC drop standard, and compared the effect to reliability of solder joint among the composition of solder material, fluxes, the method of substrate pad surface treatment and solder ball size and so on. Now Sn -3Ag -0. 5Cu and Sn - lAg -0. 5Cu and Sn63Pb37 are three kind of solder material selected, and substrate pad with Ni/Au surface finish and organic solder-ability preservatives (OSP) coating in the testing. The failure model and reliability of solder joint are examined using the dye- pry and cross - section test, and the result indicate that the solder joint with a low Ag weight contented and substrate pad with OSP coating can both enhance the reliability of BGA solder joint.

  16. A meta-analysis based method for prioritizing candidate genes involved in a pre-specific function

    Directory of Open Access Journals (Sweden)

    Jingjing Zhai

    2016-12-01

    Full Text Available The identification of genes associated with a given biological function in plants remains a challenge, although network-based gene prioritization algorithms have been developed for Arabidopsis thaliana and many non-model plant species. Nevertheless, these network-based gene prioritization algorithms have encountered several problems; one in particular is that of unsatisfactory prediction accuracy due to limited network coverage, varying link quality, and/or uncertain network connectivity. Thus a model that integrates complementary biological data may be expected to increase the prediction accuracy of gene prioritization. Towards this goal, we developed a novel gene prioritization method named RafSee, to rank candidate genes using a random forest algorithm that integrates sequence, evolutionary, and epigenetic features of plants. Subsequently, we proposed an integrative approach named RAP (Rank Aggregation-based data fusion for gene Prioritization, in which an order statistics-based meta-analysis was used to aggregate the rank of the network-based gene prioritization method and RafSee, for accurately prioritizing candidate genes involved in a pre-specific biological function. Finally, we showcased the utility of RAP by prioritizing 380 flowering-time genes in Arabidopsis. The ‘leave-one-out’ cross-validation experiment showed that RafSee could work as a complement to a current state-of-art network-based gene prioritization system (AraNet v2. Moreover, RAP ranked 53.68% (204/380 flowering-time genes higher than AraNet v2, resulting in an 39.46% improvement in term of the first quartile rank. Further evaluations also showed that RAP was effective in prioritizing genes-related to different abiotic stresses. To enhance the usability of RAP for Arabidopsis and non-model plant species, an R package implementing the method is freely available at http://bioinfo.nwafu.edu.cn/software.

  17. Phylogeography, salinity adaptations and metabolic potential of the Candidate Division KB1 Bacteria based on a partial single cell genome.

    Directory of Open Access Journals (Sweden)

    Lisa M Nigro

    2016-08-01

    Full Text Available Deep-sea hypersaline anoxic basins (DHABs and other hypersaline environments contain abundant and diverse microbial life that has adapted to these extreme conditions. The bacterial Candidate Division KB1 represents one of several uncultured groups that has been consistently observed in hypersaline microbial diversity studies. Here we report the phylogeography of KB1, its phylogenetic relationships to Candidate Division OP1 Bacteria, and its potential metabolic and osmotic stress adaptations based on a partial single cell amplified genome (SAG of KB1 from Orca Basin, the largest hypersaline seafloor brine basin in the Gulf of Mexico. Our results are consistent with the hypothesis – previously developed based on 14C incorporation experiments with mixed-species enrichments from Mediterranean seafloor brines - that KB1 has adapted its proteins to elevated intracellular salinity, but at the same time KB1 apparently imports glycine betaine; this compatible solute is potentially not limited to osmoregulation but could also serve as a carbon and energy source.

  18. Improved Switching Characteristics of Fast Power MOSFETs Applying Solder Bump Technology

    Directory of Open Access Journals (Sweden)

    Sibylle Dieckerhoff

    2008-01-01

    Full Text Available The impact of a reduced package stray inductance on the switching performance of fast power MOSFETs is discussed applying advanced 3D packaging technologies. Starting from an overview over new packaging approaches, a solder bump technology using a flexible PI substrate is exemplarily chosen for the evaluation. Measurement techniques to determine the stray inductance are discussed and compared with a numerical solution based on the PEEC method. Experimental results show the improvement of the voltage utilization while there is only a slight impact on total switching losses.

  19. Reliability Assessment of Solder Joints in Power Electronic Modules by Crack Damage Model for Wind Turbine Applications

    DEFF Research Database (Denmark)

    Kostandyan, Erik; Sørensen, John Dalsgaard

    2011-01-01

    , it is necessary to understand the physics of their failure and be able to develop reliability prediction models. Such a model is proposed in this paper for an IGBT power electronic module. IGBTs are critical components in wind turbine converter systems. These are multi-layered devices where layers are soldered...... to each other and they operate at a thermal-power cycling environment. Temperature loadings affect the reliability of soldered joints by developing cracks and fatigue processes that eventually result in failure. Based on Miner’s rule a linear damage model that incorporates a crack development...... and propagation processes is discussed. A statistical analysis is performed for appropriate model parameter selection. Based on the proposed model, a layout for component life prediction with crack movement is described in details....

  20. Recognition-Based Pedagogy: Teacher Candidates' Experience of Deficit

    Science.gov (United States)

    Parkison, Paul T.; DaoJensen, Thuy

    2014-01-01

    This study seeks to introduce what we call "recognition-based pedagogy" as a conceptual frame through which teachers and instructors can collaboratively develop educative experiences with students. Recognition-based pedagogy connects the theories of critical pedagogy, identity politics, and the politics of recognition with the educative…

  1. Thermally induced degradation pathways of three different antibody-based drug development candidates.

    Science.gov (United States)

    Fincke, Anja; Winter, Jonas; Bunte, Thomas; Olbrich, Carsten

    2014-10-01

    Protein-based medicinal products are prone to undergo a variety of chemical and physical degradation pathways. One of the most important exogenous stress condition to consider during manufacturing, transport and storage processes is temperature, because antibody-based therapeutics are only stable in a limited temperature range. In this study, three different formats of antibody-based molecules (IgG1, a bispecific scFv and a fab fragment) were exposed to thermal stress conditions occurring during transport and storage. For evaluation, an analytical platform was developed for the detection and characterization of relevant degradation pathways of different antibody-based therapeutics. The effect of thermal stress conditions on the stability of the three antibody-based formats was therefore investigated using visual inspection, different spectroscopic measurements, dynamic light scattering (DLS), differential scanning calorimetry (DSC), electrophoresis, asymmetric flow field-flow fractionation (AF4) and surface plasmon resonance technology (SPR). In summary, thermal stress led to heterogeneous chemical and physical degradation pathways of all three antibody-based formats used. In addition, identical exogenous stress conditions resulted in different kinds and levels of aggregates and fragmentation products. This knowledge is fundamental for a systematic and successful stabilization of protein-based therapeutics by the use of formulation additives.

  2. Evaluation of Candidate Measures for Home-Based Screening of Sleep Disordered Breathing in Taiwanese Bus Drivers

    Directory of Open Access Journals (Sweden)

    Hua Ting

    2014-05-01

    Full Text Available Background: Sleepiness-at-the-wheel has been identified as a major cause of highway accidents. The aim of our study is identifying the candidate measures for home-based screening of sleep disordered breathing in Taiwanese bus drivers, instead of polysomnography. Methods: Overnight polysomnography accompanied with simultaneous measurements of alternative screening devices (pulse oximetry, ApneaLink, and Actigraphy, heart rate variability, wake-up systolic blood pressure and questionnaires were completed by 151 eligible participants who were long-haul bus drivers with a duty period of more than 12 h a day and duty shifting. Results: 63.6% of professional bus drivers were diagnosed as having sleep disordered breathing and had a higher body mass index, neck circumference, systolic blood pressure, arousal index and desaturation index than those professional bus drivers without evidence of sleep disordered breathing. Simple home-based candidate measures: (1 Pulse oximetry, oxygen-desaturation indices by ≥3% and 4% (r = 0.87~0.92; (2 Pulse oximetry, pulse-rising indices by ≥7% and 8% from a baseline (r = 0.61~0.89; and (3 ApneaLink airflow detection, apnea-hypopnea indices (r = 0.70~0.70, based on recording-time or Actigraphy-corrected total sleep time were all significantly correlated with, and had high agreement with, corresponding polysomnographic apnea-hypopnea indices [(1 94.5%~96.6%, (2 93.8%~97.2%, (3 91.1%~91.3%, respectively]. Conversely, no validities of SDB screening were found in the multi-variables apnea prediction questionnaire, Epworth Sleepiness Scale, night-sleep heart rate variability, wake-up systolic blood pressure and anthropometric variables. Conclusions: The indices of pulse oximetry and apnea flow detection are eligible criteria for home-based screening of sleep disordered breathing, specifically for professional drivers.

  3. Potential and limits of water cooled divertor concepts based on monoblock design as possible candidates for a DEMO reactor

    Energy Technology Data Exchange (ETDEWEB)

    Li-Puma, Antonella, E-mail: antonella.lipuma@cea.fr [CEA, DEN, Saclay, DM2S, SERMA, F-91191 Gif-sur-Yvette (France); Richou, Marianne; Magaud, Philippe; Missirlian, Marc [CEA, IRFM, F-13108 Saint Paul Lez Durance (France); Visca, Eliseo [Associazione EURATOM-ENEA sulla Fusione, C.R. Frascati, IT-00044 Frascati (Italy); Ridolfini, Vincenzo Pericoli [EFDA-CSU Garching, PPPT department, D-85748 Garching bei München (Germany)

    2013-10-15

    In this paper water-cooled divertor concepts based on tungsten monoblock design identified in previous studies as candidate for fusion power plant have been reviewed to assess their potential and limits as possible candidates for a DEMO concept deliverable in a short to medium term (“conservative baseline design”). The rationale and technology development assumptions that have led to their selection are revisited taking into account present factual information on reactor parameters, materials properties and manufacturing technologies. For that purpose, main parameters impacting the divertor design are identified and their relevance discussed. The state of the art knowledge on materials and relevant manufacturing techniques is reviewed. Particular attention is paid to material properties change after irradiation; phenomenon thresholds (if any) and possible operating ranges are identified (in terms of temperature and damage dose). The suitability of various proposed heat sink/structural and sacrificial layer materials, as proposed in the past, are re-assessed (e.g. with regard to the possibility of reducing peak heat flux and/or neutron radiation damages). As a result, potential and limits of various proposed concepts are highlighted, ranges in which they could operate (if any) defined and possible improvements are proposed. Identified missing point in materials database and/or manufacturing techniques knowledge that should be uppermost investigated in future R and D activities are reported. This work has been carried out in the frame of EFDA PPPT Work Programme activities.

  4. Fundamentals of wetting and spreading with emphasis on soldering

    Energy Technology Data Exchange (ETDEWEB)

    Yost, F.G.

    1991-01-01

    Soldering is often referred to as a mature technology whose fundamentals were established long ago. Yet a multitude of soldering problems persist, not the least of which are related to the wetting and spreading of solder. The Buff-Goodrich approach to thermodynamics of capillarity is utilized in a review of basic wetting principles. These thermodynamics allow a very compact formulation of capillary phenomena which is used to calculate various meniscus shapes and wetting forces. These shapes and forces lend themselves to experimental techniques, such as the sessile drop and the Wilhelmy plate, for measuring useful surface and interfacial energies. The familiar equations of Young, Wilhelmy, and Neumann are all derived with this approach. The force-energy duality of surface energy is discussed and the force method is developed and used to derive the Herring relations for anisotropic surfaces. The importance of contact angle hysteresis which results from surface roughness and chemical inhomogeneity is presented and Young's equation is modified to reflect these ever present effects. Finally, an analysis of wetting with simultaneous metallurigical reaction is given and used to discuss solder wetting phenomena. 60 refs., 13 figs.

  5. Porosity in collapsible Ball Grid Array solder joints

    Energy Technology Data Exchange (ETDEWEB)

    Gonzalez, C.A. [Univ. of California, Berkeley, CA (United States). Dept. of Materials Science and Mineral Engineering]|[Lawrence Berkeley National Lab., Berkeley, CA (United States). Materials Science Div.

    1998-05-01

    Ball Grid Array (BGA) technology has taken off in recent years due to the increased need for high interconnect density. Opposite to all the advantages BGA packages offer, porosity in collapsible BGA solder joints is often a major concern in the reliability of such packages. The effect of pores on the strength of collapsible BGA solder-joints was studied by manufacturing samples with different degrees of porosity and testing them under a shear load. It was found that the shear strength of the solder joints decreased in a linear fashion with increasing porosity. Failure occurred by internal necking of the interpore matrix. It was confirmed that entrapment of flux residues leads to porosity by manufacturing fluxless samples in a specially made furnace, and comparing them with samples assembled using flux. Also, contamination of Au electrodeposits (in substrate metallization) was determined to cause significant porosity. It was found that hard-Au (Co hardened Au) electrodeposits produce high degrees of porosity even in the absence of flux. Finally, increasing the time the solder spends in the molten state was proven to successfully decrease porosity.

  6. Horizon shells and BMS-like soldering transformations

    Science.gov (United States)

    Blau, Matthias; O'Loughlin, Martin

    2016-03-01

    We revisit the theory of null shells in general relativity, with a particular emphasis on null shells placed at horizons of black holes. We study in detail the considerable freedom that is available in the case that one solders two metrics together across null hypersurfaces (such as Killing horizons) for which the induced metric is invariant under translations along the null generators. In this case the group of soldering transformations turns out to be infinite dimensional, and these solderings create non-trivial horizon shells containing both massless matter and impulsive gravitational wave components. We also rephrase this result in the language of Carrollian symmetry groups. To illustrate this phenomenon we discuss in detail the example of shells on the horizon of the Schwarzschild black hole (with equal interior and exterior mass), uncovering a rich classical structure at the horizon and deriving an explicit expression for the general horizon shell energy-momentum tensor. In the special case of BMS-like soldering supertranslations we find a conserved shell-energy that is strikingly similar to the standard expression for asymptotic BMS supertranslation charges, suggesting a direct relation between the physical properties of these horizon shells and the recently proposed BMS supertranslation hair of a black hole.

  7. FORMATION AND CHANGE OF AuSn4 COMPOUNDS AT INTERFACE BETWEEN PBGA SOLDER BALL AND Au/Ni/Cu METALLIZATION DURING LASER AND INFRA-RED REFLOW SOLDERING

    Institute of Scientific and Technical Information of China (English)

    Y.H.Tian; C.Q.Wang

    2004-01-01

    Interactions between 63Sn37Pb solder and PBGA metallization(Au/Ni/Cu)during laser and infrared reflow soldering were studied.During laser refow soldering process,a thin layer of AuSn4 was observed at the interface of the solder bumps,its morphology was strongly dependent on the laser reflow power and heating time.The solder bumps formed by the first laser reflow was refowed again to form the solder joints.The AuSn4 compounds formed in the first laser reflow process dissolved into the bulk solder after the secondary infrared reflow process.The needle-like AuSn4 changed into rodlike,and distributed inside the solder near the solder/pad interface.

  8. Substituição das soldas estanho-chumbo na manufatura: efeitos na saúde do trabalhador e no desempenho ambiental Substitution of tin-lead solders in manufacturing: impacts on workers' health and on the environment

    Directory of Open Access Journals (Sweden)

    Cecilia Maria Villas Bôas de Almeida

    2013-03-01

    Full Text Available As soldas à base de estanho-chumbo (63Sn/37Pb são largamente utilizadas no Brasil e no mundo. Este estudo aplica a avaliação em emergia em um fabricante de soldas brandas à base de estanho e chumbo e outros metais. O cálculo da emergia por unidade de três tipos de solda mostra que mais recursos são utilizados para produzir uma tonelada de soldas livres de chumbo do que para produzir soldas à base de estanho e chumbo. O indicador DALY (Disability Adjusted Life Years foi utilizado para comparar as emissões na atmosfera dos três tipos de produção de soldas e os resultados apontam para a adoção das soldas à base de chumbo, quando se considera todo o ciclo de vida do produto. A diferença entre os resultados obtidos por avaliações locais e globais é discutida.Tin-lead solders (Sn63-Pb37 have been widely used in Brazil and worldwide. This study evaluates the emergy in a company that manufactures soft solders based on tin, lead, and other metals. The calculation of emergy per unit of three types of solder showed that more resources are used to produce one ton of lead-free solders than those used to produce tin-lead solders. The DALY (Disability Adjusted Life Years indicator was used to assess the emissions to air of three types of solder. The results favor the use of tin-lead solders when the whole product life-cycle is evaluated. The difference between the results obtained by local and global assessments is discussed.

  9. Roles of interfacial reaction on mechanical properties of solder interfaces

    Science.gov (United States)

    Liu, Pilin

    This study investigated roles of interfacial reaction in fracture and fatigue of solder interconnects. The interfacial reaction phases in the as-reflowed and after aging were examined by cross-sectional transmission electron microscopy (TEM) while interfacial mechanical properties were determined from a flexural peel fracture mechanics technique. Because of their widespread uses in microelectronic packaging, SnPb solder interfaces, and Bi-containing Pb-free solder interfaces were chosen as the subjects of this study. In the interfacial reaction study, we observed a complicated micro structural evolution during solid-state aging of electroless-Ni(P)/SnPb solder interconnects. In as-reflowed condition, the interfacial reaction produced Ni3Sn 4 and P-rich layers. Following overaging, the interfacial microstructure degenerated into a complex multilayer structure consisting of multiple layers of Ni-Sn compounds and transformed Ni-P phases. In SnPb solder interfacial system, fatigue study showed that the overaging of the high P electroless Ni-P/SnPb interconnects resulted in a sharp reduction in the fatigue resistance of the interface in the high crack growth rate regime. Fracture mechanism analysis indicated that the sharp drop in fatigue resistance was triggered by the brittle fracture of the Ni3Sn2 intermetallic phase developed at the overaged interface. The fatigue behavior was strongly dependent on P concentration in electroless Ni. Kirkendall voids were found in the interfacial region after aging, but they did not cause premature fracture of the solder interfaces. In Bi-containing solder interfacial system, we found that Bi segregated to the Cu-intermetallic interface during aging in SnBi/Cu interconnect. This caused serious embrittlement of Sn-Bi/Cu interface. Further aging induced numerous voids along the Cu3Sn/Cu interface. These interfacial voids were different from Kirkendall voids. Their formation was explained on basis of vacancy condensation at the

  10. Electromigration Behaviors of Cu Reinforced Sn-3.5Ag Composite Solder Joints

    Science.gov (United States)

    Wang, Yan; Han, Jing; Ma, Limin; Zuo, Yong; Guo, Fu

    2016-12-01

    The composite approach, by incorporating small amounts of reinforcement particles in the solder matrix, has proven to be one of the effective ways to improve the reliability of solder joints. The effects of Cu addition on electromigration were investigated in this study by incorporating 2% volume fraction Cu particles into Sn-3.5Ag eutectic solder paste by the in situ process. The one-dimensional solder joints, designed to prevent the current crowding effect, were stressed under a constant current density of 104 A/cm2 at room temperature, and the temperature of the sample could reach 105 ± 5°C due to the Joule heating effect. Doping 2 vol.% Cu was found to retard the electromigration phenomenon effectively. After electric current stressing for 528 h, the growth rate of an interfacial intermetallic compound (IMC) layer at the anode decreased 73% in contrast to that of Sn-3.5Ag solder joints, and the IMC layer at the cathode was almost unchanged. The polarization effect of Cu reinforced composite solder joints was also apparently mitigated. In addition, the surface damage of the composite solder joints was relieved by incorporating 2 vol.% Cu particles. Compared to Sn-3.5Ag solder joints, which had protruded Cu6Sn5 and wrinkles of Sn-solder matrix on the surface, the solder joints with Cu addition had a more even surface.

  11. Electromigration Behaviors of Cu Reinforced Sn-3.5Ag Composite Solder Joints

    Science.gov (United States)

    Wang, Yan; Han, Jing; Ma, Limin; Zuo, Yong; Guo, Fu

    2016-09-01

    The composite approach, by incorporating small amounts of reinforcement particles in the solder matrix, has proven to be one of the effective ways to improve the reliability of solder joints. The effects of Cu addition on electromigration were investigated in this study by incorporating 2% volume fraction Cu particles into Sn-3.5Ag eutectic solder paste by the in situ process. The one-dimensional solder joints, designed to prevent the current crowding effect, were stressed under a constant current density of 104 A/cm2 at room temperature, and the temperature of the sample could reach 105 ± 5°C due to the Joule heating effect. Doping 2 vol.% Cu was found to retard the electromigration phenomenon effectively. After electric current stressing for 528 h, the growth rate of an interfacial intermetallic compound (IMC) layer at the anode decreased 73% in contrast to that of Sn-3.5Ag solder joints, and the IMC layer at the cathode was almost unchanged. The polarization effect of Cu reinforced composite solder joints was also apparently mitigated. In addition, the surface damage of the composite solder joints was relieved by incorporating 2 vol.% Cu particles. Compared to Sn-3.5Ag solder joints, which had protruded Cu6Sn5 and wrinkles of Sn-solder matrix on the surface, the solder joints with Cu addition had a more even surface.

  12. Usability of a Web-Based School Experience System: Opinions of IT Teachers and Teacher Candidates

    Science.gov (United States)

    Genç, Zülfü

    2015-01-01

    With advances in information and communication technologies, the classical nature of educational institutions has changed. One innovative effort within teacher training is the Web-Based School Experience System (WBSES) developed by the researcher. In this study, the usability of an existing WBSES is evaluated from both teachers' (n = 13) and…

  13. Problem-Based Learning in the Educational Psychology Classroom: Bahraini Teacher Candidates' Experience

    Science.gov (United States)

    Razzak, Nina Abdul

    2012-01-01

    There was a concern from faculty at Bahrain Teachers' College that undergraduate Bahraini students lack the necessary competencies needed for success in educational contexts that are conducive to active, student-centered learning. It was decided that the students be introduced to a problem-based learning (PBL) strategy in one of their educational…

  14. Immunostimulation by Synthetic Lipopeptide-Based Vaccine Candidates: Structure-Activity Relationships

    OpenAIRE

    Zaman, Mehfuz; Toth, Istvan

    2013-01-01

    Peptide-based vaccines offer several advantages over conventional whole organism or protein approaches by offering improved purity and specificity in inducing immune response. However, peptides alone are generally non-immunogenic. Concerns remain about the toxicity of adjuvants which are critical for immunogenicity of synthetic peptides. The use of lipopeptides in peptide vaccines is currently under intensive investigation because potent immune responses can be generated without the use of ad...

  15. Development of materials design tool and its application in Pb-free micro-solders in electronic package

    Institute of Scientific and Technical Information of China (English)

    OHNUMA; Ikuo; KAINUMA; Ryosuke; ISHIDA; Kiyohito; CHANG; Austin; Y.

    2010-01-01

    A materials design tool for developing Pb-free soldering alloys in electronic package was developed based on comprehensive experimental data of phase equilibria and thermodynamic properties data accumulated with the CALPHAD (calculation of phase diagrams) method and contains 10 elements,namely,Ag,Au,Bi,Cu,In,Ni,Sb,Sn,Zn and Pb.It can handle the calculation of phase diagrams in all combinations of these elements and all composition ranges.In addition,based on this tool,the liquidus,solidus,phase fractions and constitutions,equilibrium and non-equilibrium solidification behavior,surface tension and viscosity of liquid,diffusion reactions and microstructural evolution,etc.can be predicted.Typical examples of the calculation and application of this tool are presented.The design tool is expected to be a powerful tool for the development of Pb-free solders,as well as for promoting the understanding of the interfacial phenomena between Cu substrate and Pb-free solders in electronic packaging technology.

  16. Discovery and characterization of antibody variants using mass spectrometry-based comparative analysis for biosimilar candidates of monoclonal antibody drugs.

    Science.gov (United States)

    Li, Wenhua; Yang, Bin; Zhou, Dongmei; Xu, Jun; Ke, Zhi; Suen, Wen-Chen

    2016-07-01

    Liquid chromatography mass spectrometry (LC-MS) is the most commonly used technique for the characterization of antibody variants. MAb-X and mAb-Y are two approved IgG1 subtype monoclonal antibody drugs recombinantly produced in Chinese hamster ovary (CHO) cells. We report here that two unexpected and rare antibody variants have been discovered during cell culture process development of biosimilars for these two approved drugs through intact mass analysis. We then used comprehensive mass spectrometry-based comparative analysis including reduced light, heavy chains, and domain-specific mass as well as peptide mapping analysis to fully characterize the observed antibody variants. The "middle-up" mass comparative analysis demonstrated that the antibody variant from mAb-X biosimilar candidate was caused by mass variation of antibody crystalline fragment (Fc), whereas a different variant with mass variation in antibody antigen-binding fragment (Fab) from mAb-Y biosimilar candidate was identified. Endoproteinase Lys-C digested peptide mapping and tandem mass spectrometry analysis further revealed that a leucine to glutamine change in N-terminal 402 site of heavy chain was responsible for the generation of mAb-X antibody variant. Lys-C and trypsin coupled non-reduced and reduced peptide mapping comparative analysis showed that the formation of the light-heavy interchain trisulfide bond resulted in the mAb-Y antibody variant. These two cases confirmed that mass spectrometry-based comparative analysis plays a critical role for the characterization of monoclonal antibody variants, and biosimilar developers should start with a comprehensive structural assessment and comparative analysis to decrease the risk of the process development for biosimilars.

  17. Investigation of candidate data structures and search algorithms to support a knowledge based fault diagnosis system

    Science.gov (United States)

    Bosworth, Edward L., Jr.

    1987-01-01

    The focus of this research is the investigation of data structures and associated search algorithms for automated fault diagnosis of complex systems such as the Hubble Space Telescope. Such data structures and algorithms will form the basis of a more sophisticated Knowledge Based Fault Diagnosis System. As a part of the research, several prototypes were written in VAXLISP and implemented on one of the VAX-11/780's at the Marshall Space Flight Center. This report describes and gives the rationale for both the data structures and algorithms selected. A brief discussion of a user interface is also included.

  18. Conservation analysis of dengue virust-cell epitope-based vaccine candidates using peptide block entropy

    DEFF Research Database (Denmark)

    Olsen, Lars Rønn; Zhang, Guang Lan; Keskin, Derin B.;

    2011-01-01

    Broad coverage of the pathogen population is particularly important when designing CD8+ T-cell epitope vaccines against viral pathogens. Traditional approaches are based on combinations of highly conserved T-cell epitopes. Peptide block entropy analysis is a novel approach for assembling sets...... residues. The block entropy analysis provides broad coverage of variant antigens. We applied the block entropy analysis method to the proteomes of the four serotypes of dengue virus (DENV) and found 1,551 blocks of 9-mer peptides, which cover 99% of available sequences with five or fewer unique peptides...

  19. Effects of particle size on the mechanical properties of particle-reinforced Sn-Ag composite solder joint

    Institute of Scientific and Technical Information of China (English)

    2009-01-01

    Particulate size has significant influenced on the mechanical properties of particle-reinforced composite solder joints. In this current research, Cu or Ni reinforcement particles were mechanically added to the Sn-3.5Ag eutectic solder, and the effects of the particle size on the mechanical properties of particle-reinforced composite solder joint were systematically studied. This investigation touched on how mechanical properties of the solder joints are affected by particles size. A quantitative formula was set up to correlate the mechanical property of the solder joint with particle size in different processing conditions. Besides, the fracture mechanism of the composite solder joint was analyzed.

  20. Key enzymes and proteins of crop insects as candidate for RNAi based gene silencing.

    Science.gov (United States)

    Kola, Vijaya Sudhakara Rao; Renuka, P; Madhav, Maganti Sheshu; Mangrauthia, Satendra K

    2015-01-01

    RNA interference (RNAi) is a mechanism of homology dependent gene silencing present in plants and animals. It operates through 21-24 nucleotides small RNAs which are processed through a set of core enzymatic machinery that involves Dicer and Argonaute proteins. In recent past, the technology has been well appreciated toward the control of plant pathogens and insects through suppression of key genes/proteins of infecting organisms. The genes encoding key enzymes/proteins with the great potential for developing an effective insect control by RNAi approach are actylcholinesterase, cytochrome P450 enzymes, amino peptidase N, allatostatin, allatotropin, tryptophan oxygenase, arginine kinase, vacuolar ATPase, chitin synthase, glutathione-S-transferase, catalase, trehalose phosphate synthase, vitellogenin, hydroxy-3-methylglutaryl coenzyme A reductase, and hormone receptor genes. Through various studies, it is demonstrated that RNAi is a reliable molecular tool which offers great promises in meeting the challenges imposed by crop insects with careful selection of key enzymes/proteins. Utilization of RNAi tool to target some of these key proteins of crop insects through various approaches is described here. The major challenges of RNAi based insect control such as identifying potential targets, delivery methods of silencing trigger, off target effects, and complexity of insect biology are very well illustrated. Further, required efforts to address these challenges are also discussed.

  1. Immunostimulation by synthetic lipopeptide based vaccine candidates: structure-activity relationships.

    Directory of Open Access Journals (Sweden)

    Mehfuz eZaman

    2013-10-01

    Full Text Available Peptide based vaccines offer several advantages over conventional whole organism or protein approaches by offering improved purity and specificity in inducing immune response. However, peptides alone are generally non-immunogenic. Concerns remain about the toxicity of adjuvants which are critical for immunogenicity of synthetic peptides. The use of lipopeptides in peptide vaccines is currently under intensive investigation because potent immune responses can be generated without the use of adjuvant (thus are self-adjuvanting. Several lipopeptides derived from microbial origin, and their synthetic versions or simpler fatty acid moieties impart this self-adjuvanting activity by signalling via Toll-like receptor 2 (TLR2. Engagement of this innate immune receptor on antigen-presenting cell leads to the initiation and development of potent immune responses. Therefore optimization of lipopeptides to enhance TLR2-mediated activation is a promising strategy for vaccine development. Considerable structure-activity relationships that determine TLR2 binding and consequent stimulation of innate immune responses have been investigated for a range of lipopeptides. In this review we address the development of lipopeptide vaccines, mechanism of TLR2 recognition, and immune activation. An overview is provided of the best studied lipopeptide vaccine systems.

  2. The Mechanical Behavior of Sn-Ag4 Solder Joints Subjected to Thermal Cycling

    Institute of Scientific and Technical Information of China (English)

    CHENGuohai; MAJusheng

    2004-01-01

    The method of mount strain gages is used to measure the stress/strain hysteresis loops of the solder joints under thermal cycling. The results show that different solders have different loops; the shape of the loops will change less, and finally become a line along with the thermal cycle increase. The shear module decreases along with the thermal cycling process. But the creep index of the solder joints is not sensitive to the cycling process,which fluctuates between 5 and 7. Because the elements of the solder and matrix materials diffuse during the process, the voids induced in the solder joints expand. The expansion of the voids will lead to the crystal lattice aberrance of solder crystal.

  3. Losing on all fronts: the effects of negative versus positive person-based campaigns on implicit and explicit evaluations of political candidates.

    Science.gov (United States)

    Carraro, Luciana; Gawronski, Bertram; Castelli, Luigi

    2010-09-01

    The current research investigated the effects of negative as compared to positive person-based political campaigns on explicit and implicit evaluations of the involved candidates. Participants were presented with two political candidates and statements that one of them ostensibly said during the last political campaign. For half of the participants, the campaign included positive remarks about the source of the statement (positive campaign); for the remaining half, the campaign included negative remarks about the opponent (negative campaign). Afterwards, participants completed measures of explicit and implicit evaluations of both candidates. Results indicate that explicit evaluations of the source, but not the opponent, were less favourable after negative as compared to positive campaigns. In contrast, implicit evaluations were less favourable for both candidates after negative campaigns. The results are discussed in terms of associative and propositional processes, highlighting the importance of associative processes in political decision making.

  4. A malaria diagnostic tool based on computer vision screening and visualization of Plasmodium falciparum candidate areas in digitized blood smears.

    Directory of Open Access Journals (Sweden)

    Nina Linder

    Full Text Available INTRODUCTION: Microscopy is the gold standard for diagnosis of malaria, however, manual evaluation of blood films is highly dependent on skilled personnel in a time-consuming, error-prone and repetitive process. In this study we propose a method using computer vision detection and visualization of only the diagnostically most relevant sample regions in digitized blood smears. METHODS: Giemsa-stained thin blood films with P. falciparum ring-stage trophozoites (n = 27 and uninfected controls (n = 20 were digitally scanned with an oil immersion objective (0.1 µm/pixel to capture approximately 50,000 erythrocytes per sample. Parasite candidate regions were identified based on color and object size, followed by extraction of image features (local binary patterns, local contrast and Scale-invariant feature transform descriptors used as input to a support vector machine classifier. The classifier was trained on digital slides from ten patients and validated on six samples. RESULTS: The diagnostic accuracy was tested on 31 samples (19 infected and 12 controls. From each digitized area of a blood smear, a panel with the 128 most probable parasite candidate regions was generated. Two expert microscopists were asked to visually inspect the panel on a tablet computer and to judge whether the patient was infected with P. falciparum. The method achieved a diagnostic sensitivity and specificity of 95% and 100% as well as 90% and 100% for the two readers respectively using the diagnostic tool. Parasitemia was separately calculated by the automated system and the correlation coefficient between manual and automated parasitemia counts was 0.97. CONCLUSION: We developed a decision support system for detecting malaria parasites using a computer vision algorithm combined with visualization of sample areas with the highest probability of malaria infection. The system provides a novel method for blood smear screening with a significantly reduced need for

  5. Recombinant vesicular stomatitis virus-based dengue-2 vaccine candidate induces humoral response and protects mice against lethal infection.

    Science.gov (United States)

    Lauretti, Flavio; Chattopadhyay, Anasuya; de Oliveira França, Rafael Freitas; Castro-Jorge, Luiza; Rose, John; Fonseca, Benedito A L da

    2016-09-01

    Dengue is the most important arbovirus disease throughout the world and it is responsible for more than 500,000 dengue hemorrhagic cases and 22,000 deaths every year. One vaccine was recently licensed for human use in Brazil, Mexico and Philippines and although at least seven candidates have been in clinical trials the results of the most developed CYD vaccine have demonstrated immunization problems, such as uneven protection and interference between serotypes. We constructed a vaccine candidate based on vesicular stomatitis virus (VSV) expression of pre-membrane (prM) and envelope (E) proteins of dengue-2 virus (DENV-2) and tested it in mice to evaluate immunogenicity and protection against DENV-2 infection. VSV has been successfully used as vaccine vectors for several viruses to induce strong humoral and cellular immune responses. The VSV-DENV-2 recombinant was constructed by inserting the DENV-2 structural proteins into a VSV plasmid DNA for recombinant VSV-DENV-2 recovery. Infectious recombinant VSV viruses were plaque purified and prM and E expression were confirmed by immunofluorescence and radiolabeling of proteins of infected cells. Forty Balb/C mice were inoculated through subcutaneous (s.c.) route with VSV-DENV-2 vaccine in a two doses schedule 15 d apart and 29 d after first inoculation, sera were collected and the mice were challenged with 50 lethal doses (LD50) of a neurovirulent DENV-2. The VSV-DENV-2 induced anti-DENV-2 antibodies and protected animals in the challenge experiment comparable to DENV-2 immunization control group. We conclude that VSV is a promising platform to test as a DENV vaccine and perhaps against others Flaviviridae.

  6. Selecting candidate service based on functional reusability%基于功能重用性的候选服务选定方法

    Institute of Scientific and Technical Information of China (English)

    昌广才; 蒋溢; 熊安萍

    2012-01-01

    SOA-based service modeling is widely used in the enterprise applications. During SOMA service is modeling, according to the identification inaccuracy of function reusability between use case when selecting reusable candidate services, based on the expansion and containment relationship, the selection process of reusable candidate services are provided, which join generalization relationship between the use case, and the selection of reusability candidate services is improved. Practice shows that the improved candidate services selection methods not only simplify reusable candidate selection process, but also improve the selection accuracy of reusability candidate services.%基于SOA的服务建模在企业中得到了广泛运用,针对SOMA服务建模过程中基于用例间包含与扩展关系对可重用候选服务进行选定时存在功能重用性用例确定不准确的问题,给出了加入用例泛化关系的可重用候选服务选定方法,完善了可重用性候选服务的选定.实践表明,改进后的候选服务选定方法不仅使简化了可重用性候选服务选定过程,还提高了可重用性候选服务选定的准确率.

  7. Reaction of Liquid Sn-Ag-Cu-Ce Solders with Solid Copper

    Science.gov (United States)

    Chriaštel'Ová, J.; Rízeková Trnková, L.; Pocisková Dimová, K.; Ožvold, M.

    2011-09-01

    Small amounts of the rare-earth element Ce were added to the Sn-rich lead-free eutectic solders Sn-3.5Ag-0.7Cu, Sn-0.7Cu, and Sn-3.5Ag to improve their properties. The microstructures of the solders without Ce and with different amounts (0.1 wt.%, 0.2 wt.%, and 0.5 wt.%) of Ce were compared. The microstructure of the solders became finer with increasing Ce content. Deviation from this rule was observed for the Sn-Ag-Cu solder with 0.2 wt.% Ce, and for the Sn-0.7Cu eutectic alloy, which showed the finest microstructure without Ce. The melting temperatures of the solders were not affected. The morphology of intermetallic compounds (IMC) formed at the interface between the liquid solders and a Cu substrate at temperatures about 40°C above the melting point of the solder for dipping times from 2 s to 256 s was studied for the basic solder and for solder with 0.5 wt.% Ce addition. The morphology of the Cu6Sn5 IMC layer developed at the interface between the solders and the substrate exhibited the typical scallop-type shape without significant difference between solders with and without Ce for the shortest dipping time. Addition of Ce decreased the thickness of the Cu6Sn5 IMC layer only at the Cu/Sn-Ag-Cu solder interface for the 2-s dipping. A different morphology of the IMC layer was observed for the 256-s dipping time: The layers were less continuous and exhibited a broken relief. Massive scallops were not observed. For longer dipping times, Cu3Sn IMC layers located near the Cu substrate were also observed.

  8. Investigation of moisture uptake into printed circuit board laminate and solder mask materials

    DEFF Research Database (Denmark)

    Conseil, Helene; Gudla, Visweswara Chakravarthy; Borgaonkar, Shruti

    2017-01-01

    Presence of moisture in a printed circuit board (PCB) laminate, typically made of glass fibres reinforced epoxy polymer, significantly influences the electrical functionality in various ways and causes problems during soldering process. This paper investigates the water uptake of laminates coated...... with different solder mask materials and exposed to saturated water vapour and liquid water. The solder masks are characterised for their microstructure and constituent phases using scanning electron microscopy and X-ray diffraction. The observations are correlated with themoisture absorption characteristic...

  9. SINGLE IMAGE CAMERA CALIBRATION IN CLOSE RANGE PHOTOGRAMMETRY FOR SOLDER JOINT ANALYSIS

    OpenAIRE

    Heinemann, D.; S. Knabner; Baumgarten, D.

    2016-01-01

    Printed Circuit Boards (PCB) play an important role in the manufacturing of electronic devices. To ensure a correct function of the PCBs a certain amount of solder paste is needed during the placement of components. The aim of the current research is to develop an real-time, closed-loop solution for the analysis of the printing process where solder is printed onto PCBs. Close range photogrammetry allows for determination of the solder volume and a subsequent correction if necessary. ...

  10. Sn-Zn系无铅钎料最新进展%Review on Latest Advances of Sn-Zn-X Solder Joints

    Institute of Scientific and Technical Information of China (English)

    孙磊; 张亮

    2015-01-01

    Sn-Zn系钎料熔点与传统Sn-37Pb钎料十分接近,成本低廉,被研究者所推崇。由于Zn的存在导致Sn-Zn钎料润湿性差及抗氧化性不足,阻碍了该钎料的发展。添加合金元素和纳米颗粒是改善Sn-Zn钎料组织和性能行之有效的方法之一,为国内外研究者所推崇。结合国内外Sn-Zn系无铅钎料最新研究成果,探讨添加微量的合金元素In、Ni、Cr、Ga、Bi、Cu、Al、Ag、稀土元素及纳米颗粒对钎料润湿性、抗氧化性、力学性能、显微组织和界面组织的影响,同时简述有关钎剂对Sn-Zn的影响,并对Sn-Zn系钎料的发展趋势进行分析与展望。%Sn-Zn alloy, a nontoxic binary lead-free solder with melting temperature of 198˚C, closer to the eutectic temperature of Sn-Pb solder, has been identified as one of very few suitable candidates for lead-free solder replacement. Due to the high activity of Zn, the wettability and oxidation resistance of the Sn-Zn alloys are poor, which is a major obstacle to its application. The addition of alloying elements and nanoparticles is one of the effective ways to improve the performance of Sn-Zn solders. The work of Sn-Zn lead-free solders bearing In, Ni, Cr, Ga, Bi, Cu, Al, Ag, rare earth and nanoparticles were reviewed, and the effect of alloying elements and nanoparticles on the wettability, oxidation resistance, mechanical properties, microstructure and intermetallic compounds were analyzed. Meanwhile, the influence of flux of Sn-Zn was outlined and the prospect on Sn-Zn solders bearing alloying elements and nanoparties were analyzed and looked-ahead.

  11. Influence of Difference Solders Volume on Intermetallic Growth of Sn-4.0Ag-0.5Cu/ENEPIG

    Directory of Open Access Journals (Sweden)

    Saliza Azlina O.

    2016-01-01

    Full Text Available In recent years, portable electronic packaging products such as smart phones, tablets, notebooks and other gadgets have been developed with reduced size of component packaging, light weight, high speed and with enhanced performance. Thus, flip chip technology with smaller solder sphere sizes that would produce fine solder joint interconnections have become essential in order to fulfill these miniaturization requirements. This study investigates the interfacial reactions and intermetallics formation during reflow soldering and isothermal aging between Sn-4.0Ag-0.5Cu (SAC405 and electroless nickel/immersion palladium/immersion gold (EN(PEPIG. Solder diameters of 300 μm and 700 μm were used to compare the effect of solder volume on the solder joint microstructure. The solid state isothermal aging was performed at 125°C starting from 250 hours until 2000 hours. The results revealed that only (Cu,Ni6Sn5 IMC was found at the interface during reflow soldering while both (Cu,Ni6Sn5 and (Ni,Cu3Sn4 IMC have been observed after aging process. Smaller solder sizes produced thinner IMC than larger solder joints investigated after reflow soldering, whereas the larger solders produced thinner IMC than the smaller solders after isothermal aging. Aging duration of solder joints has been found to be increase the IMC’s thickness and changed the IMC morphologies to spherical-shaped, compacted and larger grain size.

  12. Research Progress in Solderable Black Pad of Electroless Nickel/Immersion Gold

    Institute of Scientific and Technical Information of China (English)

    Liu Haiping; Li Ning; Bi Sifu; Li Deyu

    2007-01-01

    Electroless nickel/immersion gold (ENIG) technology is widely used as one of the surface final finish for electronics packaging substrate and printed circuit board (PCB), providing a protective, conductive and solderable surface. However, there is a solder joint interfacial brittle fracture (or solderability failure) of using the ENIG coating. The characteristics and the application of ENIG technology were narrated in this paper. The research progress on the solderability failure of ENIG was introduced. The mechanism of "black pad" and the possible measure of eliminating or alleviating the "black pad" were also introduced. The development direction and market prospects of ENIG were prospected.

  13. Solderability study of 63Sn-37Pb on zinc-plated and cadmium-plated stainless steel for the MC4636 lightning arrestor connector.

    Energy Technology Data Exchange (ETDEWEB)

    Lopez, Edwin Paul; Vianco, Paul Thomas; Rejent, Jerome Andrew; Martin, Joseph J.

    2004-06-01

    Cadmium plating on metal surfaces is commonly used for corrosion protection and to achieve good solderability on the 304L stainless steel shell of the MC4636 lightning arrestor connector (LAC) for the W76-1 system. This study examined the use of zinc as a potential substitute for the cadmium protective surface finish. Tests were performed with an R and RMA flux and test temperatures of 230 C, 245 C, and 260 C. Contact angle, {theta}{sub c}, served as the generalized solderability metric. The wetting rate and wetting time parameters were also collected. The solderability ({theta}{sub c}) of the Erie Plating Cd/Ni coatings was better than that of similar Amphenol coatings. Although the {theta}{sub c} data indicated that both Cd/Ni platings would provide adequate solderability, the wetting rate and wetting time data showed the Amphenol coatings to have better performance. The Zn/Ni coatings exhibited non-wetting under all flux and temperature conditions. Based on the results of these tests, it has been demonstrated that zinc plating is not a viable alternate to cadmium plating for the LAC connectors.

  14. Comparison of Sn-Ag-Cu Solder Alloy Intermetallic Compound Growth Under Different Thermal Excursions for Fine-Pitch Flip-Chip Assemblies

    Science.gov (United States)

    Tian, Ye; Liu, Xi; Chow, Justin; Wu, Yi Ping; Sitaraman, Suresh K.

    2013-08-01

    The intermetallic compound (IMC) evolution in Cu pad/Sn-Ag-Cu solder interface and Sn-Ag-Cu solder/Ni pad interface was investigated using thermal shock experiments with 100- μm-pitch flip-chip assemblies. The experiments show that low standoff height of solder joints and high thermomechanical stress play a great role in the interfacial IMC microstructure evolution under thermal shock, and strong cross-reaction of pad metallurgies is evident in the intermetallic growth. Furthermore, by comparing the IMC growth during thermal aging and thermal shock, it was found that thermal shock accelerates IMC growth and that kinetic models based on thermal aging experiments underpredict IMC growth in thermal shock experiments. Therefore, new diffusion kinetic parameters were determined for the growth of (Cu,Ni)6Sn5 using thermal shock experiments, and the Cu diffusion coefficient through the IMC layer was calculated to be 0.2028 μm2/h under thermal shock. Finite-element models also show that the solder stresses are higher under thermal shock, which could explain why the IMC growth is faster and greater under thermal shock cycling as opposed to thermal aging.

  15. Morphology and Shear Strength of Lead-Free Solder Joints with Sn3.0Ag0.5Cu Solder Paste Reinforced with Ceramic Nanoparticles

    Science.gov (United States)

    Yakymovych, A.; Plevachuk, Yu.; Švec, P.; Švec, P.; Janičkovič, D.; Šebo, P.; Beronská, N.; Roshanghias, A.; Ipser, H.

    2016-12-01

    To date, additions of different oxide nanoparticles is one of the most widespread procedures to improve the mechanical properties of metals and metal alloys. This research deals with the effect of minor ceramic nanoparticle additions (SiO2, TiO2 and ZrO2) on the microstructure and mechanical properties of Cu/solder/Cu joints. The reinforced Sn3.0Ag0.5Cu (SAC305) solder alloy with 0.5 wt.% and 1.0 wt.% of ceramic nanoparticles was prepared through mechanically stirring. The microstructure of as-solidified Cu/solder/Cu joints was studied using scanning electron microscopy. The additions of ceramic nanoparticles suppressed the growth of the intermetallic compound layer Cu6Sn5 at the interface solder/Cu and improved the microstructure of the joints. Furthermore, measurements of mechanical properties showed improved shear strength of Cu/composite solder/Cu joints compared to joints with unreinforced solder. This fact related to all investigated ceramic nanoinclusions and should be attributed to the adsorption of nanoparticles on the grain surface during solidification. However, this effect is less pronounced on increasing the nanoinclusion content from 0.5 wt.% to 1.0 wt.% due to agglomeration of nanoparticles. Moreover, a comparison analysis showed that the most beneficial influence was obtained by minor additions of SiO2 nanoparticles into the SAC305 solder alloy.

  16. Identification of putative candidate genes for red rot resistance in sugarcane (Saccharum species hybrid) using LD-based association mapping.

    Science.gov (United States)

    Singh, Ram K; Banerjee, Nandita; Khan, M S; Yadav, Sonia; Kumar, Sanjeev; Duttamajumder, S K; Lal, Ram Ji; Patel, Jinesh D; Guo, H; Zhang, Dong; Paterson, Andrew H

    2016-06-01

    Red rot is a serious disease of sugarcane caused by the fungus Colletotrichum falcatum that has a colossal damage potential. The fungus, prevalent mainly in the Indian sub-continent, keeps on producing new pathogenic strains leading to breakdown of resistance in newly released varieties and hence the deployment of linked markers for marker-assisted selection for resistance to this disease can fine tune the breeding programme. This study based on a panel of 119 sugarcane genotypes fingerprinted for 944 SSR alleles was undertaken with an aim to identify marker-trait associations (MTAs) for resistance to red rot. Mixed linear model containing population structure and kinship as co-factor detected four MTAs that were able to explain 10-16 % of the trait variation, individually. Among the four MTAs, EST sequences diagnostic of three could be BLAST searched to the sorghum genome with significant sequence homology. Several genes encoding important plant defence related proteins, viz., cytochrome P450, Glycerol-3-phosphate transporter-1, MAP Kinase-4, Serine/threonine-protein kinase, Ring finger domain protein and others were localized to the vicinity of these MTAs. These positional candidate genes are worth of further investigation and possibly these could contribute directly to red rot resistance, and may find a potential application in marker-assisted sugarcane breeding.

  17. New π-Conjugated Materials Based on Furylenevinylene Candidate for Organic Solar Cells Application: A DFT Study

    Directory of Open Access Journals (Sweden)

    El Alamy Aziz

    2015-12-01

    Full Text Available The specific properties of organic-conjugated molecules and polymers are of great importance since they have become the most promising materials for the optoelectronic device technology such as solar cells. The use of low band gap materials is a viable method for better harvesting of the solar spectrum and increasing its efficiency. The control of the parameters of these materials is a research issue of ongoing interest. In this work, a quantum chemical investigation was performed to explore the optical and electronic properties of a series of different compounds based on furylenevinylene. Different electron side groups were introduced to investigate their effects on the electronic structure. The theoretical knowledge of the highest occupied molecular orbital (HOMO and lowest unoccupied molecular orbital (LUMO energy levels of the components is basic in studying organic solar cells; so the HOMO, LUMO, Gap energy and open circuit voltage (Voc of the studied compounds have been calculated and reported. These properties suggest that these materials behave as good candidate for organic solar cells. DOI: http://dx.doi.org/10.17807/orbital.v7i4.763 

  18. Glutathione transferase (GST) as a candidate molecular-based biomarker for soil toxin exposure in the earthworm Lumbricus rubellus

    Energy Technology Data Exchange (ETDEWEB)

    LaCourse, E. James, E-mail: james.la-course@liverpool.ac.u [Institute of Biological, Environmental, and Rural Sciences, Aberystwyth University, Aberystwyth SY23 3DA (United Kingdom); Hernandez-Viadel, Mariluz; Jefferies, James R. [Institute of Biological, Environmental, and Rural Sciences, Aberystwyth University, Aberystwyth SY23 3DA (United Kingdom); Svendsen, Claus; Spurgeon, David J. [Centre for Ecology and Hydrology, Huntingdon PE28 2LS (United Kingdom); Barrett, John [Institute of Biological, Environmental, and Rural Sciences, Aberystwyth University, Aberystwyth SY23 3DA (United Kingdom); John Morgan, A.; Kille, Peter [Biosciences, University of Cardiff, Cardiff CF10 3TL (United Kingdom); Brophy, Peter M. [Institute of Biological, Environmental, and Rural Sciences, Aberystwyth University, Aberystwyth SY23 3DA (United Kingdom)

    2009-08-15

    The earthworm Lumbricus rubellus (Hoffmeister, 1843) is a terrestrial pollution sentinel. Enzyme activity and transcription of phase II detoxification superfamily glutathione transferases (GST) is known to respond in earthworms after soil toxin exposure, suggesting GST as a candidate molecular-based pollution biomarker. This study combined sub-proteomics, bioinformatics and biochemical assay to characterise the L. rubellus GST complement as pre-requisite to initialise assessment of the applicability of GST as a biomarker. L. rubellus possesses a range of GSTs related to known classes, with evidence of tissue-specific synthesis. Two affinity-purified GSTs dominating GST protein synthesis (Sigma and Pi class) were cloned, expressed and characterised for enzyme activity with various substrates. Electrospray ionisation mass spectrometry (ESI-MS) and tandem mass spectrometry (MS/MS) following SDS-PAGE were superior in retaining subunit stability relative to two-dimensional gel electrophoresis (2-DE). This study provides greater understanding of Phase II detoxification GST superfamily status of an important environmental pollution sentinel organism. - This study currently provides the most comprehensive view of the Phase II detoxification enzyme superfamily of glutathione transferases within the important environmental pollution sentinel earthworm Lumbricus rubellus.

  19. A microstructural analysis of solder joints from the electronic assemblies of dismantled nuclear weapons

    Energy Technology Data Exchange (ETDEWEB)

    Vianco, P.T.; Rejent, J.A. [Sandia National Labs., Albuquerque, NM (United States). Materials Joining Dept.

    1997-05-01

    MC1814 Interconnection Boxes from dismantled B57 bombs, and MC2839 firing Sets from retired W70-1 warheads were obtained from the Pantex facility. Printed circuit boards were selected from these components for microstructural analysis of their solder joints. The analysis included a qualitative examination of the solder joints and quantitative assessments of (1) the thickness of the intermetallic compound layer that formed between the solder and circuit board Cu features, and (2) the Pb-rich phase particle distribution within the solder joint microstructure. The MC2839 solder joints had very good workmanship qualities. The intermetallic compound layer stoichiometry was determined to be that of Cu6Sn5. The mean intermetallic compound layer thickness for all solder joints was 0.885 mm. The magnitude of these values did not indicate significant growth over the weapon lifetime. The size distribution of the Pb-rich phase particles for each of the joints were represented by the mean of 9.85 {times} 10{sup {minus}6} mm{sup 2}. Assuming a spherical geometry, the mean particle diameter would be 3.54 mm. The joint-to-joint difference of intermetallic compound layer thickness and Pb-rich particle size distribution was not caused by varying thermal environments, but rather, was a result of natural variations in the joint microstructure that probably existed at the time of manufacture. The microstructural evaluation of the through-hole solder joints form the MC2839 and MC1814 components indicated that the environmental conditions to which these electronic units were exposed in the stockpile, were benign regarding solder joint aging. There was an absence of thermal fatigue damage in MC2839 circuit board, through-hole solder joints. The damage to the eyelet solder joints of the MC1814 more likely represented infant mortality failures at or very near the time of manufacture, resulting from a marginal design status of this type of solder joint design.

  20. The (w)hole survey: an unbiased sample study of transition disk candidates based on Spitzer catalogs

    CERN Document Server

    van der Marel, Nienke; van Terwisga, Sierk; Merin, Bruno; Herczeg, Gregory; Ligterink, Niels F W; van Dishoeck, Ewine F

    2016-01-01

    Understanding disk evolution and dissipation is essential for studies of planet formation. Transition disks, i.e., disks with large dust cavities and gaps, are promising candidates of active evolution. About two dozen SED-selected candidates have been confirmed to have dust cavities through millimeter interferometric imaging, but this sample is biased towards the brightest disks. The Spitzer surveys of nearby low-mass star forming regions have resulted in more than 4000 Young Stellar Objects (YSOs). Using color criteria we have selected a sample of ~150 candidates, and an additional 40 candidates and known transition disks from the literature. The Spitzer data were complemented by new observations at longer wavelengths, including new JCMT and APEX submillimeter photometry, and WISE and Herschel-PACS mid and far-infrared photometry. Furthermore, optical spectroscopy was obtained and stellar types were derived for 85% of the sample, including information from the literature. The SEDs were fit to a grid of RADMC...

  1. Combined thermal, thermodynamic and kinetic modelling for the reliability of high-density lead-free solder interconnections

    OpenAIRE

    Yu, Hao

    2006-01-01

    Continuous miniaturization of electronics devices as well as increasing complexity of soldering metallurgy introduce more and more challenges to the reliability of modern electronics products. Although loading condition plays an important role, the reliability of solder interconnections is ultimately controlled by microstructures' responses to loading. It is therefore of great importance to understand and control the microstructural evolutions of solder interconnections under different loadin...

  2. Conservation analysis of dengue virus T-cell epitope-based vaccine candidates using peptide block entropy

    Directory of Open Access Journals (Sweden)

    Lars Ronn Olsen

    2011-12-01

    Full Text Available Broad coverage of the pathogen population is particularly important when designing CD8+ T-cell epitope vaccines against viral pathogens. Traditional approaches to assembling broadly covering sets of peptides are commonly based on assembling highly conserved epitopes. Peptide block entropy analysis is a novel approach to assembling sets of broadly covering antigens. Since T-cell epitopes are recognized as peptides rather than individual residues, this method is based on calculating the information content of blocks of peptides from a multiple sequence alignment of homologous proteins rather than individual residues. The block entropy analysis provides broad coverage by variant inclusion, since high frequency may not be the sole determinant of the immunogenic potential of a predicted MHC class I binder. We applied block entropy analysis method to the proteomes of the four serotypes of dengue virus and found 1,551 blocks of 9-mer peptides, which covered all available sequences with five or fewer unique peptides. In contrast, the benchmark study by Khan et al. (2008, resulted in 165 9-mers being determined as conserved. Many of the blocks are located consecutively in the proteins, so connecting these blocks resulted in 78 conserved regions which can be covered with 457 subunit peptides. Of the 1551 blocks of 9-mer peptides, 110 blocks consisted of peptides all predicted to bind to MHC with similar affinity and the same HLA restriction. In total, we identified a pool of 333 peptides as T-cell epitope candidates. This set could form the basis for a broadly neutralizing dengue virus vaccine. The peptide block entropy analysis approach significantly increases the number of conserved peptide regions in comparison to traditional conservation analysis of individual residues. We determined 457 subunit peptides with the capacity to encompass the diversity of all sequenced DENV strains.

  3. Assessment of circuit board surface finishes for electronic assembly with lead-free solders

    Energy Technology Data Exchange (ETDEWEB)

    Ray, U.; Artaki, I.; Finley, D.W.; Wenger, G.M. [Bell Labs., Princeton, NJ (United States). Lucent Technologies; Pan, T.; Blair, H.D.; Nicholson, J.M. [Ford Motor Co., Dearborn, MI (United States); Vianco, P.T. [Sandia National Labs., Albuquerque, NM (United States)

    1996-10-01

    The suitability of various metallic printed wiring board surface finishes was assessed for new technology applications that incorporate assembly with Lead-free solders. The manufacture of a lead-free product necessitates elimination of lead (Pb) from the solder, the circuit board as well as the component lead termination. It is critical however for the selected interconnect Pb-free solder and the corresponding printed wiring board (PWB) and component lead finishes to be mutually compatible. Baseline compatibility of select Pb-free solders with Pb containing PWB surface finish and components was assessed. This was followed by examining the compatibility of the commercially available CASTIN{trademark} (SnAgCuSb) Pb-free solder with a series of PWB metallic finishes: Ni/Au, Ni/Pd, and Pd/Cu. The compatibility was assessed with respect to assembly performance, solder joint integrity and long term attachment reliability. Solder joint integrity and mechanical behavior of representative 50 mil pitch 20I/O SOICs was determined before and after thermal stress. Mechanical pull test studies demonstrated that the strength of SnAgCuSb solder interconnections is notably greater than that of SnPb interconnections.

  4. Generation of Tin(II) Oxide Crystals on Lead-Free Solder Joints in Deionized Water

    Science.gov (United States)

    Chang, Hong; Chen, Hongtao; Li, Mingyu; Wang, Ling; Fu, Yonggao

    2009-10-01

    The effect of the anode and cathode on the electrochemical corrosion behavior of lead-free Sn-Ag-Cu and Sn-Ag-Cu-Bi solder joints in deionized water was investigated. Corrosion studies indicate that SnO crystals were generated on the surfaces of all lead-free solder joints. The constituents of the lead-free solder alloys, such as Ag, Cu, and Bi, did not affect the corrosion reaction significantly. In contrast to lead-free solders, PbO x was formed on the surface of the traditional 63Sn-37Pb solder joint in deionized water. A cathode, such as Au or Cu, was necessary for the electrochemical corrosion reaction of solders to occur. The corrosion reaction rate decreased with reduction of the cathode area. The formation mechanism of SnO crystals was essentially a galvanic cell reaction. The anodic reaction of Sn in the lead-free solder joints occurred through solvation by water molecules to form hydrated cations. In the cathodic reaction, oxygen dissolved in the deionized water captures electrons and is deoxidized to hydroxyl at the Au or Cu cathode. By diffusion, the anodic reaction product Sn2+ and the cathodic reaction product OH- meet to form Sn(OH)2, some of which can dehydrate to form more stable SnO· xH2O crystals on the surface of the solder joints. In addition, thermodynamic analysis confirms that the Sn corrosion reaction could occur spontaneously.

  5. The automated system for technological process of spacecraft's waveguide paths soldering

    Science.gov (United States)

    Tynchenko, V. S.; Murygin, A. V.; Emilova, O. A.; Bocharov, A. N.; Laptenok, V. D.

    2016-11-01

    The paper solves the problem of automated process control of space vehicles waveguide paths soldering by means of induction heating. The peculiarities of the induction soldering process are analyzed and necessity of information-control system automation is identified. The developed automated system makes the control of the product heating process, by varying the power supplied to the inductor, on the basis of information about the soldering zone temperature, and stabilizing the temperature in a narrow range above the melting point of the solder but below the melting point of the waveguide. This allows the soldering process automating to improve the quality of the waveguides and eliminate burn-troughs. The article shows a block diagram of a software system consisting of five modules, and describes the main algorithm of its work. Also there is a description of the waveguide paths automated soldering system operation, for explaining the basic functions and limitations of the system. The developed software allows setting of the measurement equipment, setting and changing parameters of the soldering process, as well as view graphs of temperatures recorded by the system. There is shown the results of experimental studies that prove high quality of soldering process control and the system applicability to the tasks of automation.

  6. Indium Corporation Introduces New Pb-Free VOC-Free Wave Solder Flux

    Institute of Scientific and Technical Information of China (English)

    2005-01-01

    The Indium Corporation of America has introduced WF-7742 Wave Solder Flux specifically designed to meet the process demands of Pb-Free manufacturing. WF-7742 is a VOC-Free material formulated for Pb-Free wave soldering of surface-mount, mixed-technology and through-holeelectronics assemblies.

  7. Development of lead-free solders for high-temperature applications

    DEFF Research Database (Denmark)

    Chidambaram, Vivek

    -temperature applications. Unfortunately, even the substitute technologies that are currently being developed cannot address several critical issues of high-temperature soldering. Therefore, further research and development of high-temperature lead-free soldering is obviously needed. It is hoped that this thesis can serve...... as a valuable source of information to those interested in environmentally conscious electronic packaging....

  8. 30 CFR 77.1111 - Welding, cutting, soldering; use of fire extinguisher.

    Science.gov (United States)

    2010-07-01

    ... 30 Mineral Resources 1 2010-07-01 2010-07-01 false Welding, cutting, soldering; use of fire... OF UNDERGROUND COAL MINES Fire Protection § 77.1111 Welding, cutting, soldering; use of fire extinguisher. One portable fire extinguisher shall be provided at each location where welding, cutting,...

  9. Active soft solder deposition by magnetron-sputter-ion-plating (MSIP)-PVD-process

    Energy Technology Data Exchange (ETDEWEB)

    Lugscheider, E.; Bobzin, K.; Erdle, A

    2004-01-30

    In different technical areas micro electro mechanical systems (M.E.M.S.), e.g. micro pumps, micro sensors, actuators and micro dosage systems are in use today. The components of these M.E.M.S. consist of various materials, which have to be joined. To join materials like ceramics, plastics or metals to a hybrid M.E.M.S., established joining technologies have to be adjusted. For the assembling and mounting of temperature sensible micro components, a low temperature joining process, e.g. transient liquid phase (TLP) bonding or an active soft soldering process can be performed. In this article the deposition of a low melting active soft solder by magnetron-sputter (MS)-PVD deposition with an active substrate cooling will be presented. The substrate temperatures were set and controlled by an additional cooling unit, which was integrated into the sputtering facility. In the performed experiments a substrate temperature range from -40 to +20 deg. C was investigated. The effects of these different substrate temperatures to the microstructure and the soldering suitability of the solder system were investigated by scanning electron microscopy (SEM), nanoindentation and soldering tests. The chemical composition of the deposited solder systems was examined by glow discharge optical spectroscopy (GDOS)-analysis. As a suitable substrate temperature range for deposition -10 to -20 deg. C was detected. Solder systems deposited in this temperature range showed good solder abilities.

  10. Tissue soldering with biodegradable polymer films: in-vitro investigation of hydration effects on weld strength

    Science.gov (United States)

    Sorg, Brian S.; Welch, Ashley J.

    2001-05-01

    Previous work demonstrated increased breaking strengths of tissue repaired with liquid albumin solder reinforced with a biodegradable polymer film compared to unreinforced control specimens. It was hypothesized that the breaking strength increase was due to reinforcement of the liquid solder cohesive strength. Immersion in a moist environment can decrease the adhesion of solder to tissue and negate any strength benefits gained from reinforcement. The purpose of this study was to determine if hydrated specimens repaired with reinforced solder would still be stronger than unreinforced controls. A 50%(w/v) bovine serum albumin solder with 0.5 mg/mL Indocyanine Green dye was used to repair an incision in bovine aorta. The solder was coagulated with 806-nm diode laser light. A poly(DL-lactic- co-glycolic acid) film was used to reinforce the solder (the controls had no reinforcement). The repaired tissues were immersed in phosphate buffered saline for time periods of 1 and 2 days. The breaking strengths of all of the hydrated specimens decreased compared to the acute breaking strengths. However, the reinforced specimens still had larger breaking strengths than the unreinforced controls. These results indicate that reinforcement of a liquid albumin solder may have the potential to improve the breaking strength in a clinical setting.

  11. Candidates for Intracluster Planetary Nebulae in the Virgo Cluster based on the Suprime-Cam Narrow-Band Imaging in O[III] and Halpha

    CERN Document Server

    Okamura, S; Arnaboldi, M; Freeman, K C; Ando, H; Doi, M; Furusawa, H; Gerhard, O E; Hamabe, M; Kimura, M; Kajino, T; Komiyama, Yu; Miyazaki, S; Nakata, F; Napolitano, N R; Ouchi, M; Pannella, M; Sekiguchi, M; Shimasaku, K; Yagi, M

    2002-01-01

    We have identified 38 candidates of intracluster planetary nebulae (ICPNe) in a $34'\\times27'$ field in the core of the Virgo cluster based on the Suprime-Cam imaging through two narrow-band filters centered at the redshifted wavelengths of the [OIII]$\\lambda=5007\\AA$ and the Halpha \\lambda=6563\\AA lines. Broad-band images in V and R bands are used to check for any emissions in the adjacent continuum. We describe the method briefly and present the list of intracluster planetary nebulae candidates, together with their finding charts. The ICPN candidates show a highly inhomogeneous distribution, which may suggest an association with the M86-M84 subcluster. Fraction of diffuse intracluster light with respect to total light in galaxies is estimated to be about 10%, leading to an estimate of about 20% for the baryon fraction. Spectroscopic follow up and a wider survey are critical to reveal the nature of intracluster stellar population.

  12. Optimization of Pb-Free Solder Joint Reliability from a Metallurgical Perspective

    Science.gov (United States)

    Zeng, Kejun; Pierce, Mike; Miyazaki, Hiroshi; Holdford, Becky

    2012-02-01

    To obtain the desired performance of Pb-free packages in mechanical tests, while the solder composition should be carefully selected, the influence of metals dissolved from the soldering pad or under bump metallization (UBM) should also be taken into account. Dissolved metals such as Cu can alter the intermetallic compound (IMC) formation, not only at the local interface but also on the other side of the joint. The high rate of interfacial cracking of Sn-Ag-Cu solder joints on Ni/Au-plated pads is attributed to the high stiffness of the solder and the dual IMC structure of (Cu,Ni)6Sn5 on Ni3Sn4 at the interface. Approaches to avoid this dual IMC structure at the interface are discussed. A rule for selecting the solder alloy composition and the pad surface materials on both sides of the joints is proposed for ball grid array (BGA) packages.

  13. Codominant PCR-based markers and candidate genes for powdery mildew resistance in melon (Cucumis melo L.).

    Science.gov (United States)

    Yuste-Lisbona, Fernando J; Capel, Carmen; Gómez-Guillamón, María L; Capel, Juan; López-Sesé, Ana I; Lozano, Rafael

    2011-03-01

    Powdery mildew caused by Podosphaera xanthii is a major disease in melon crops, and races 1, 2, and 5 of this fungus are those that occur most frequently in southern Europe. The genotype TGR-1551 bears a dominant gene that provides resistance to these three races of P. xanthii. By combining bulked segregant analysis and amplified fragment length polymorphisms (AFLP), we identified eight markers linked to this dominant gene. Cloning and sequencing of the selected AFLP fragments allowed the development of six codominant PCR-based markers which mapped on the linkage group (LG) V. Sequence analysis of these markers led to the identification of two resistance-like genes, MRGH5 and MRGH63, belonging to the nucleotide binding site (NBS)-leucine-rich repeat (LRR) gene family. Quantitative trait loci (QTL) analysis detected two QTLs, Pm-R1-2 and Pm-R5, the former significantly associated with the resistance to races 1 and 2 (LOD score of 26.5 and 33.3; 53.6 and 61.9% of phenotypic variation, respectively), and the latter with resistance to race 5 (LOD score of 36.8; 65.5% of phenotypic variation), which have been found to be colocalized with the MRGH5 and MRGH63 genes, respectively. The results suggest that the cluster of NBS-LRR genes identified in LG V harbours candidate genes for resistance to races 1, 2, and 5 of P. xanthii. The evaluation of other resistant germplasm showed that the codominant markers here reported are also linked to the Pm-w resistance gene carried by the accession 'WMR-29' proving their usefulness as genotyping tools in melon breeding programmes.

  14. Identification of HSPA8 as a candidate biomarker for endometrial carcinoma by using iTRAQ-based proteomic analysis

    Directory of Open Access Journals (Sweden)

    Shan N

    2016-04-01

    Full Text Available Nianchun Shan,1 Wei Zhou,2 Shufen Zhang,1 Yu Zhang1 1Department of Obstetric and Gynecology, 2Health Management Center, Xiangya Hospital, Central South University, Changsha, Hunan, People’s Republic of China Abstract: Although there are advances in diagnostic, predictive, and therapeutic strategies, discovering protein biomarker for early detection is required for improving the survival rate of the patients with endometrial carcinoma. In this study, we identify proteins that are differentially expressed between the Stage I endometrial carcinoma and the normal pericarcinous tissues by using isobaric tags for relative and absolute quantitation (iTRAQ-based proteomic analysis. Totally, we screened 1,266 proteins. Among them, 103 proteins were significantly overexpressed, and 30 were significantly downexpressed in endometrial carcinoma. Using the bioinformatics analysis, we identified a list of proteins that might be closely associated with endometrial carcinoma, including CCT7, HSPA8, PCBP2, LONP1, PFN1, and EEF2. We validated the gene overexpression of these molecules in the endometrial carcinoma tissues and found that HSPA8 was most significantly upregulated. We further validated the overexpression of HSPA8 by using immunoblot analysis. Then, HSPA8 siRNA was transferred into the endometrial cancer cells RL-95-2 and HEC-1B. The depletion of HSPA8 siRNAs significantly reduced cell proliferation, promoted cell apoptosis, and suppressed cell growth in both cell lines. Taken together, HSPA8 plays a vital role in the development of endometrial carcinoma. HSPA8 is a candidate biomarker for early diagnosis and therapy of Stage I endometrial carcinoma. Keywords: iTRAQ, HSPA8, endometrial carcinoma, RL-95-2 cells

  15. Study on Sn-Zn Solder Used in Cu-Al Soldering%用于铜铝焊接的锡锌焊料研究

    Institute of Scientific and Technical Information of China (English)

    倪广春; 张浩; 韩敏

    2013-01-01

    Lead-free electronic products led the development of lead-free solder technology. Taking cost factors into account, some copper material has been replaced by aluminum material. When ordinary Sn-Cu and Sn-Ag-Cu solder are used in soldering of Cu-Al, there is the electrochemical corrosion problems. So Sn-Zn solder is used for Cu-Al soldering. However, the joints of Sn-Zn solder are brittle and easy to crack. Focus on problems in Cu-Al soldering joint of electrical and electronic devices, put forward Sn-Zn-X alloy soldering materials, did a large number of experiments, and achieved good results.%电子产品无铅化的推广带动了无铅焊料技术的发展,考虑到成本因素,部分铜材已被铝材取代。普通的锡铜系和锡银铜系焊料在铜铝焊接时,存在电化学腐蚀问题,因此多用锡锌焊料进行焊接。但锡锌焊料的焊点脆,存在易开裂的问题。针对电工电子器件铜铝焊接点存在的问题,提出了Sn一Zn一X多元合金焊接材料,并做了大量实验,取得很好的效果。

  16. Impact of Cooling Rate-Induced Recrystallization on High G Mechanical Shock and Thermal Cycling in Sn-Ag-Cu Solder Interconnects

    Science.gov (United States)

    Lee, Tae-Kyu; Bieler, Thomas R.; Kim, Choong-Un

    2016-01-01

    The mechanical stability and thermo-mechanical fatigue performance of solder joints with low silver content Sn-1.0Ag-0.5Cu (wt.%) (SAC105) alloy based on different cooling rates are investigated in high G level shock environment and thermal cycling conditions. The cooling rate-controlled samples ranging from 1°C/min to 75°C/min cooling rate, not only show differences in microstructure, where a fine poly-granular microstructure develops in the case of fast cooling versus normal cooling, but also show various shock performances based on the microstructure changes. The fast cooling rate improves the high G shock performance by over 90% compared to the normal cooled SAC105 alloy air-cooling environment commonly used after assembly reflow. The microstructure effect on thermal cycling performance is also discussed, which is analyzed based on the Sn grain orientation, interconnect stability, and solder joint bulk microstructure.

  17. Study on Mitigation Method of Solder Corrosion for Crystalline Silicon Photovoltaic Modules

    Directory of Open Access Journals (Sweden)

    Ju-Hee Kim

    2014-01-01

    Full Text Available The corrosion of 62Sn36Pb2Ag solder connections poses serious difficulties for outdoor-exposed photovoltaic (PV modules, as connection degradation contributes to the increase in series resistance (RS of PV modules. In this study, we investigated a corrosion mitigation method based on the corrosion mechanism. The effect of added sacrificial metal on the reliability of PV modules was evaluated using the oxidation-reduction (redox reaction under damp heat (DH conditions. Experimental results after exposure to DH show that the main reason for the decrease in power was a drop in the module’s fill factor. This drop was attributed to the increase of RS. The drop in output power of the PV module without added sacrificial metal is greater than that of the sample with sacrificial metal. Electroluminescence and current-voltage mapping analysis also show that the PV module with sacrificial metal experienced less degradation than the sample without sacrificial metal.

  18. Nanoscale soldering of axially positioned single-walled carbon nanotubes: a molecular dynamics simulation study.

    Science.gov (United States)

    Cui, Jianlei; Yang, Lijun; Zhou, Liang; Wang, Yang

    2014-02-12

    The miniaturization of electronics devices into the nanometer scale is indispensable for next-generation semi-conductor technology. Carbon nanotubes (CNTs) are considered to be the promising candidates for future interconnection wires. To study the carbon nanotubes interconnection during nanosoldering, the melting process of nanosolder and nanosoldering process between single-walled carbon nanotubes are simulated with molecular dynamics method. As the simulation results, the melting point of 2 nm silver solder is about 605 K because of high surface energy, which is below the melting temperature of Ag bulk material. In the nanosoldering process simulations, Ag atoms may be dragged into the nanotubes to form different connection configuration, which has no apparent relationship with chirality of SWNTs. The length of core filling nanowires structure has the relationship with the diameter, and it does not become longer with the increasing diameter of SWNT. Subsequently, the dominant mechanism of was analyzed. In addition, as the heating temperature and time, respectively, increases, more Ag atoms can enter the SWNTs with longer length of Ag nanowires. And because of the strong metal bonds, less Ag atoms can remain with the tight atomic structures in the gap between SWNT and SWNT. The preferred interconnection configurations can be achieved between SWNT and SWNT in this paper.

  19. Imaging and Analysis of Void-defects in Solder Joints Formed in Reduced Gravity using High-Resolution Computed Tomography

    Science.gov (United States)

    Easton, John W.; Struk, Peter M.; Rotella, Anthony

    2008-01-01

    As a part of efforts to develop an electronics repair capability for long duration space missions, techniques and materials for soldering components on a circuit board in reduced gravity must be developed. This paper presents results from testing solder joint formation in low gravity on a NASA Reduced Gravity Research Aircraft. The results presented include joints formed using eutectic tin-lead solder and one of the following fluxes: (1) a no-clean flux core, (2) a rosin flux core, and (3) a solid solder wire with external liquid no-clean flux. The solder joints are analyzed with a computed tomography (CT) technique which imaged the interior of the entire solder joint. This replaced an earlier technique that required the solder joint to be destructively ground down revealing a single plane which was subsequently analyzed. The CT analysis technique is described and results presented with implications for future testing as well as implications for the overall electronics repair effort discussed.

  20. Pb-free Sn-Ag-Cu ternary eutectic solder

    Energy Technology Data Exchange (ETDEWEB)

    Anderson, I.E.; Yost, F.G.; Smith, J.F.; Miller, C.M.; Terpstra, R.L.

    1996-06-18

    A Pb-free solder includes a ternary eutectic composition consisting essentially of about 93.6 weight % Sn-about 4.7 weight % Ag-about 1.7 weight % Cu having a eutectic melting temperature of about 217 C and variants of the ternary composition wherein the relative concentrations of Sn, Ag, and Cu deviate from the ternary eutectic composition to provide a controlled melting temperature range (liquid-solid ``mushy`` zone) relative to the eutectic melting temperature (e.g. up to 15 C above the eutectic melting temperature). 5 figs.

  1. Candidates of eclipsing multiples based on extraneous eclipses on binary light curves: KIC 7622486, KIC 7668648, KIC 7670485 and KIC 8938628

    CERN Document Server

    Zhang, Jia; He, Jian-Duo

    2016-01-01

    Four candidates of eclipsing multiples, based on new extraneous eclipses found on Kepler binary light curves, are presented and studied. KIC 7622486 is a double eclipsing binary candidate with orbital period of 2.2799960 days and 40.246503 days. The two binary systems do not eclipse each other in the line of sight, but there is mutual gravitational influence between them which leads to the small but definite eccentricity 0.0035(0.0022) on the short 2.2799960 days period orbit. KIC 7668648 is hierarchical quadruple system candidate, with two sets of solid 203(+-5) days period extraneous eclipses and another independent set of extraneous eclipses. A clear and credible extraneous eclipse is found on the binary light curve of KIC 7670485 which made it a triple system candidates. Two sets of extraneous eclipse of about 390 days and 220 days period are found on KIC 8938628 binary curves, which not only confirms the previous conclusion of $388.5(+-0.3) triple system, but also proposed a new additional objects that m...

  2. A microstructural study of creep and thermal fatigue deformation in 60Sn-40Pb solder joints

    Energy Technology Data Exchange (ETDEWEB)

    Tribula, D.

    1990-06-02

    Thermal fatigue failures of solder joints in electronic devices often arise from cyclic shear strains imposed by the mismatched thermal expansion coefficients of the materials that bind the joint as temperature changes are encountered. Increased solder joint reliability demands a fundamental understanding of the metallurigical mechanisms that control the fatigue to design accurate accelerated probative tests and new, more fatigue resistant solder alloys. The high temperatures and slow strain rates that pertain to thermal fatigue imply that creep is an important deformation mode in the thermal fatigue cycle. In this work, the creep behaviour of a solder joint is studied to determine the solder's microstructural response to this type of deformation and to relate this to the more complex problem of thermal fatigue. It is shown that creep failures arise from the inherent inhomogeneity and instability of the solder microstructure and suggest that small compositional changes of the binary near-eutectic Pn-Sn alloy may defeat the observed failure mechanisms. This work presents creep and thermal fatigue data for several near-eutectic Pb-Sn solder compositions and concludes that a 58Sn-40Pb-2In and a 58Sn-40Pb-2Cd alloy show significantly enhanced fatigue resistance over that of the simple binary material. 80 refs., 33 figs., 1 tab.

  3. Enhanced laser tissue soldering using indocyanine green chromophore and gold nanoshells combination.

    Science.gov (United States)

    Khosroshahi, Mohammad E; Nourbakhsh, Mohammad S

    2011-08-01

    Gold nanoshells (GNs) are new materials that have an optical response dictated by the plasmon resonance. The wavelength at which the resonance occurs depends on the core and shell sizes. The purposes of this study were to use the combination of indocyanine green (ICG) and different concentration of gold nanoshells for skin tissue soldering and also to examine the effect of laser soldering parameters on the properties of repaired skin. Two mixtures of albumin solder and different combinations of ICG and gold nanoshells were prepared. A full thickness incision of 2 × 20 mm(2) was made on the surface and after addition of mixtures it was irradiated by an 810 nm diode laser at different power densities. The changes of tensile strength (σ(t)) due to temperature rise, number of scan (Ns), and scan velocity (Vs) were investigated. The results showed at constant laser power density (I), σ(t) of repaired incisions increases by increasing the concentration of gold nanoshells in solder, Ns, and decreasing Vs. It was demonstrated that laser soldering using combination of ICG + GNs could be practical provided the optothermal properties of the tissue are carefully optimized. Also, the tensile strength of soldered skin is higher than skins that soldered with only ICG or GNs. In our case, this corresponds to σ(t) = 1800 g cm(-2) at I ∼ 47 Wcm(-2), T ∼ 85 [ordinal indicator, masculine]C, Ns = 10, and Vs = 0.3 mms(-1).

  4. Laser ablative fluxless soldering (LAFS): 60Sn-40Pb solder wettability tests on laser cleaned OFHC copper substrates

    Energy Technology Data Exchange (ETDEWEB)

    Peebles, H. C.; Keicher, D. M.; Hosking, F. M.; Hlava, P. F.; Creager, N. A.

    1991-01-01

    OFHC copper substrates, cleaned by laser ablation under argon and helium gas, were tested for solder wettability by 60Sn-40Pb using an area-of-spread method. The wettability of copper surfaces cleaned under both argon and helium gas was found to equal or exceed the wettability obtained on this surface in air using a standard RMA flux. The area of spread on copper substrates cleaned under helium was eight times larger than the area of spread of substrates cleaned under argon. The enhanced spreading observed on the substrates cleaned under helium gas was found to be due to surface roughness. 11 refs., 8 figs., 2 tabs.

  5. Quantitative iTRAQ-Based Proteomic Identification of Candidate Biomarkers for Diabetic Nephropathy in Plasma of Type 1 Diabetic Patients

    DEFF Research Database (Denmark)

    Overgaard, Anne Julie; Thingholm, Tine Engberg; Larsen, Martin R

    2010-01-01

    INTRODUCTION: As part of a clinical proteomics programme focused on diabetes and its complications, it was our goal to investigate the proteome of plasma in order to find improved candidate biomarkers to predict diabetic nephropathy. METHODS: Proteins derived from plasma from a cross...... immunoassay confirmed the overall protein expression patterns observed by the iTRAQ analysis. CONCLUSION: The candidate biomarkers discovered in this cross-sectional cohort may turn out to be progression biomarkers and might have several clinical applications in the treatment and monitoring of diabetic......-sectional cohort of 123 type 1 diabetic patients previously diagnosed as normoalbuminuric, microalbuminuric or macroalbuminuric were enriched with hexapeptide library beads and subsequently pooled within three groups. Proteins from the three groups were compared by online liquid chromatography and tandem mass...

  6. The tensile strength characteristics study of the laser welds of biological tissue using the nanocomposite solder

    Science.gov (United States)

    Rimshan, I. B.; Ryabkin, D. I.; Savelyev, M. S.; Zhurbina, N. N.; Pyanov, I. V.; Eganova, E. M.; Pavlov, A. A.; Podgaetsky, V. M.; Ichkitidze, L. P.; Selishchev, S. V.; Gerasimenko, A. Y.

    2016-04-01

    Laser welding device for biological tissue has been developed. The main device parts are the radiation system and adaptive thermal stabilization system of welding area. Adaptive thermal stabilization system provided the relation between the laser radiation intensity and the weld temperature. Using atomic force microscopy the structure of composite which is formed by the radiation of laser solder based on aqua- albuminous dispersion of multi-walled carbon nanotubes was investigated. AFM topograms nanocomposite solder are mainly defined by the presence of pores in the samples. In generally, the surface structure of composite is influenced by the time, laser radiation power and MWCNT concentration. Average size of backbone nanoelements not exceeded 500 nm. Bulk density of nanoelements was in the range 106-108 sm-3. The data of welding temperature maintained during the laser welding process and the corresponding tensile strength values were obtained. Maximum tensile strength of the suture was reached in the range 50-55°C. This temperature and the pointwise laser welding technology (point area ~ 2.5mm) allows avoiding thermal necrosis of healthy section of biological tissue and provided reliable bonding construction of weld join. In despite of the fact that tensile strength values of the samples are in the range of 15% in comparison with unbroken strips of pigskin leather. This situation corresponds to the initial stage of the dissected tissue connection with a view to further increasing of the joint strength of tissues with the recovery of tissue structure; thereby achieved ratio is enough for a medical practice in certain cases.

  7. Effect of contact metallization on electromigration reliability of Pb-free solder joints

    Science.gov (United States)

    Ding, Min; Wang, Guotao; Chao, Brook; Ho, Paul S.; Su, Peng; Uehling, Trent

    2006-05-01

    The effect of underbump metallization (UBM) on electromigration (EM) lifetime and failure mechanism has been investigated for Pb-free solder bumps of 97Sn3Ag composition in the temperature range of 110-155 °C. The EM lifetime of the SnAg Pb-free solders with either Cu or Ni UBM was found to be better than the eutectic SnPb (63Sn37Pb) solders but worse than high-Pb (95Pb5Sn) solders. In the test temperature range, the EM lifetimes were found to be comparable for Cu and Ni UBMs but with different activation energies: 0.64-0.72 eV for Cu UBM and 1.03-1.11 eV for Ni UBM. EM failure was observed only in solder bumps with electron current flow from UBM to the substrate. Failure analysis revealed that EM damage was initiated by the formation of intermetallic compounds (IMC) at the UBM/solder interface which was found to be significantly enhanced by mass transport driven by the electron current. Under EM, the continued growth of IMC with the dissolution of the UBM and the accumulation of Kirkendall voids resulted in the formation of interfacial cracks and eventual EM failure of the solder bump. For Ni UBM, the IMC formation was dominated by the Ni3Sn4 phase while for Cu UBM, a bilayer of Cu3Sn/Cu6Sn5 was found. Void formation at the Cu6Sn5/solder interface was found to be important in controlling the EM lifetime of the Cu UBM solder.

  8. Network-based data integration for selecting candidate virulence associated proteins in the cereal infecting fungus Fusarium graminearum.

    Directory of Open Access Journals (Sweden)

    Artem Lysenko

    Full Text Available The identification of virulence genes in plant pathogenic fungi is important for understanding the infection process, host range and for developing control strategies. The analysis of already verified virulence genes in phytopathogenic fungi in the context of integrated functional networks can give clues about the underlying mechanisms and pathways directly or indirectly linked to fungal pathogenicity and can suggest new candidates for further experimental investigation, using a 'guilt by association' approach. Here we study 133 genes in the globally important Ascomycete fungus Fusarium graminearum that have been experimentally tested for their involvement in virulence. An integrated network that combines information from gene co-expression, predicted protein-protein interactions and sequence similarity was employed and, using 100 genes known to be required for virulence, we found a total of 215 new proteins potentially associated with virulence of which 29 are annotated as hypothetical proteins. The majority of these potential virulence genes are located in chromosomal regions known to have a low recombination frequency. We have also explored the taxonomic diversity of these candidates and found 25 sequences, which are likely to be fungal specific. We discuss the biological relevance of a few of the potentially novel virulence associated genes in detail. The analysis of already verified virulence genes in phytopathogenic fungi in the context of integrated functional networks can give clues about the underlying mechanisms and pathways directly or indirectly linked to fungal pathogenicity and can suggest new candidates for further experimental investigation, using a 'guilt by association' approach.

  9. Allele diversity for abiotic stress responsive candidate genes in chickpea reference set using gene based SNP markers

    Directory of Open Access Journals (Sweden)

    Manish eRoorkiwal

    2014-06-01

    Full Text Available Chickpea is an important food legume crop for the semi-arid regions, however, its productivity is adversely affected by various biotic and abiotic stresses. Identification of candidate genes associated with abiotic stress response will help breeding efforts aiming to enhance its productivity. With this objective, 10 abiotic stress responsive candidate genes were selected on the basis of prior knowledge of this complex trait. These 10 genes were subjected to allele specific sequencing across a chickpea reference set comprising 300 genotypes including 211 accessions of chickpea mini core collection. A total of 1.3 Mbp sequence data were generated. Multiple sequence alignment revealed 79 SNPs and 41 indels in nine genes while the CAP2 gene was found to be conserved across all the genotypes. Among ten candidate genes, the maximum number of SNPs (34 was observed in abscisic acid stress and ripening (ASR gene including 22 transitions, 11 transversions and one tri-allelic SNP. Nucleotide diversity varied from 0.0004 to 0.0029 while PIC values ranged from 0.01 (AKIN gene to 0.43 (CAP2 promoter. Haplotype analysis revealed that alleles were represented by more than two haplotype blocks, except alleles of the CAP2 and sucrose synthase (SuSy gene, where only one haplotype was identified. These genes can be used for association analysis and if validated, may be useful for enhancing abiotic stress, including drought tolerance, through molecular breeding.

  10. Wettability Studies of Pb-Free Soldering Materials

    Science.gov (United States)

    Moser, Z.; Gąsior, W.; Pstruś, J.; Dębski, A.

    2008-12-01

    For Pb-free soldering materials, two main substitutes are currently being considered, consisting of Sn-Ag and Sn-Ag-Cu eutectics, both with melting points higher than that of the Sn-Pb eutectic. Therefore, both will require higher soldering temperatures for industrial applications. Also, both eutectics have a higher surface tension than the Sn-Pb eutectic, requiring wettability studies on adding Bi, Sb, and In to the eutectics to decrease the melting points and surface tension. The experimental results for the surface tension were compared with thermodynamic modeling by Butler’s method and were used to create the SURDAT database, which also includes densities for pure metals, binary, ternary, quaternary, and quinary alloys. To model the surface tension, excess Gibbs energies of the molten components were taken from the ADAMIS database. For the case of the Ag-Sn system, enthalpies of formation of Ag3Sn from solution calorimetry were used for checking optimized thermodynamic parameters. In the study of Sn-Ag-Cu-Bi-Sb liquid alloys, the range of possible Bi compositions for practical applications has been used to formulate a generalized metric of wettability, which was checked by measurements of the influence of In on the Sn-Ag-Cu system.

  11. Novel Plasmodium falciparum malaria vaccines: evidence-based searching for variant surface antigens as candidates for vaccination against pregnancy-associated malaria

    DEFF Research Database (Denmark)

    Staalsoe, Trine; Jensen, Anja T R; Theander, Thor G;

    2002-01-01

    to statistically significant co-variation with protection rather than on demonstration of causal relationships. We have studied the relationship between variant surface antigen-specific antibodies and clinical protection from Plasmodium falciparum malaria in general, and from pregnancy-associated malaria (PAM......) in particular, to provide robust evidence of a causal link between the two in order to allow efficient and evidence-based identification of candidate antigens for malaria vaccine development....

  12. The influence of silver content on structure and properties of Sn–Bi–Ag solder and Cu/solder/Cu joints

    Energy Technology Data Exchange (ETDEWEB)

    Šebo, P. [Institute of Materials and Machine Mechanics, Slovak Academy of Sciences, Račianska 75, 831 02 Bratislava 3 (Slovakia); Švec, P. Sr., E-mail: Peter.Svec@savba.sk [Institute of Physics, Slovak Academy of Sciences, Dúbravská cesta 9, 845 11 Bratislava 45 (Slovakia); Faculty of Materials Science and Technology, Slovak University of Technology, J. Bottu 25, 917 24 Trnava (Slovakia); Janičkovič, D.; Illeková, E. [Institute of Physics, Slovak Academy of Sciences, Dúbravská cesta 9, 845 11 Bratislava 45 (Slovakia); Zemánková, M. [Institute of Materials and Machine Mechanics, Slovak Academy of Sciences, Račianska 75, 831 02 Bratislava 3 (Slovakia); Plevachuk, Yu. [Ivan Franko National University, Department of Metal Physics, 79005 Lviv (Ukraine); Sidorov, V. [Ural State Pedagogical University, Cosmonavtov 26, 620017 Ekaterinburg (Russian Federation); Švec, P. [Institute of Physics, Slovak Academy of Sciences, Dúbravská cesta 9, 845 11 Bratislava 45 (Slovakia)

    2013-06-01

    The effect of silver content on structure and properties of Sn{sub 100−x}Bi{sub 10}Ag{sub x} (x=3–10 at%) lead-free solder and Cu–solder–Cu joints was investigated. The microstructure of the solder in both bulk and rapidly solidified ribbon forms was analyzed by scanning electron microscopy (SEM) and X-ray diffraction. The peculiarities in melting kinetic, studied by differential scanning calorimetry (DSC), and silver influence on it are described and discussed. The wetting of a copper substrate was examined by the sessile drop method in the temperature range of 553–673 K in air and deoxidizing gas (N{sub 2}+10%H{sub 2}) at atmospheric pressure. Cu–solder–Cu joints were also prepared in both atmospheres, and their shear strength was measured by the push-off method. The produced solders consisted of tin, bismuth and Ag{sub 3}Sn phases. The product of the interaction between the solder and the copper substrate consists of two phases: Cu{sub 3}Sn, which is adjacent to the substrate, and a Cu{sub 6}Sn{sub 5} phase. The wetting angle in air increased slightly as the silver concentration in the solder increased. Wetting of the copper substrate in N{sub 2}+10H{sub 2} gas shows the opposite tendency: the wetting angle slightly decreased as the silver content in the solder increased. The shear strength of the joints prepared in air (using flux) tends to decrease with increasing production temperature and increasing silver content in the solder. The equivalent decrease in the shear strength of the joints prepared in N{sub 2}+10H{sub 2} is more apparent.

  13. Observations of microstructural coarsening in micro flip-chip solder joints

    Science.gov (United States)

    Barney, Monica M.; Morris, J. W.

    2001-09-01

    Coarsening of solder microstructures dramatically affects fatigue lifetimes. This paper presents a study of microstructural evolution due to thermal cycling and aging of small solder joints. The lead-tin solder joints in this study have a height of 55 5 m and a tin content of 65 70 wt.%, with a degenerate eutectic microstructure. The joint microstructure coarsens more rapidly during aging at 160°C than cycling from 0 160°C. No coarsened bands are observed. The cycling data scales with standard coarsening equations, while the aging data fits to an enhanced trend. The joints experiencing 2.8% strain during cycling fail by 1000 cycles.

  14. Effect of constraint on crack propagation behavior in BGA soldered joints

    Institute of Scientific and Technical Information of China (English)

    王莉; 王国忠; 方洪渊; 钱乙余

    2001-01-01

    The effects of stress triaxiality on crack propagation behavior in the BGA soldered joint were analyzed using FEM method. The computation results verified that stress triaxiality factor has an important effect on crack growth behavior. Crack growth rate increased with increasing stress triaxiality at the near-tip region, which is caused by increasing crack lengths or decreasing solder joint heights. Solder joint deformation is subjected to constraint effect provided by its surrounding rigid ceramic substrate, the constraint can be scaled by stress triaxiality near crack tip region. Therefore, it can be concluded that crack growth rate increased when the constraint effect increases.

  15. A cause of the non-solderability of ceramic capacitor terminations

    Science.gov (United States)

    Cozzolino, M. J.; Kumar, A.; Ewell, G. J.

    1981-01-01

    The results of an analysis into the cause of the non-solderability of multiple defective part lots from two capacitor manufacturers are described. This analysis consisted of visual, scanning electron microscopic, surface, and metalographic examinations and analyses. The results indicated that non-solderability results from areas of excess porosity in the termination which are caused by segregation of ink constituents during manufacturing. This segregation can be minimized by proper monitoring and control of process variables; where excess porosity does occur, solderability can be improved by proper precleaning of parts.

  16. Contamination profile on typical printed circuit board assemblies vs soldering process

    DEFF Research Database (Denmark)

    Conseil, Helene; Jellesen, Morten Stendahl; Ambat, Rajan

    2014-01-01

    Purpose – The purpose of this paper was to analyse typical printed circuit board assemblies (PCBAs) processed by reflow, wave or selective wave soldering for typical levels of process-related residues, resulting from a specific or combination of soldering processes. Typical solder flux residue...... structure was identified by Fourier transform infrared spectroscopy, while the concentration was measured using ion chromatography, and the electrical properties of the extracts were determined by measuring the leak current using a twin platinum electrode set-up. Localized extraction of residue was carried...

  17. Electromigration Reliability and Morphologies of Cu Pillar Flip-Chip Solder Joints with Cu Substrate Pad Metallization

    Science.gov (United States)

    Lai, Yi-Shao; Chiu, Ying-Ta; Chen, Jiunn

    2008-10-01

    The Cu pillar is a thick underbump metallurgy (UBM) structure developed to alleviate current crowding in a flip-chip solder joint under operating conditions. We present in this work an examination of the electromigration reliability and morphologies of Cu pillar flip-chip solder joints formed by joining Ti/Cu/Ni UBM with largely elongated ˜62 μm Cu onto Cu substrate pad metallization using the Sn-3Ag-0.5Cu solder alloy. Three test conditions that controlled average current densities in solder joints and ambient temperatures were considered: 10 kA/cm2 at 150°C, 10 kA/cm2 at 160°C, and 15 kA/cm2 at 125°C. Electromigration reliability of this particular solder joint turns out to be greatly enhanced compared to a conventional solder joint with a thin-film-stack UBM. Cross-sectional examinations of solder joints upon failure indicate that cracks formed in (Cu,Ni)6Sn5 or Cu6Sn5 intermetallic compounds (IMCs) near the cathode side of the solder joint. Moreover, the ~52- μm-thick Sn-Ag-Cu solder after long-term current stressing has turned into a combination of ~80% Cu-Ni-Sn IMC and ~20% Sn-rich phases, which appeared in the form of large aggregates that in general were distributed on the cathode side of the solder joint.

  18. Effect of Surface Finish of Substrate on Mechanical Reliability of in-48SN Solder Joints in Moems Package

    CERN Document Server

    Koo, Ja-Myeong

    2007-01-01

    Interfacial reactions and shear properties of the In-48Sn (in wt.%) ball grid array (BGA) solder joints after bonding were investigated with four different surface finishes of the substrate over an underlying Cu pad: electroplated Ni/Au (hereafter E-NG), electroless Ni/immersion Au (hereafter ENIG), immersion Ag (hereafter I-Ag) and organic solderability preservative (hereafter OSP). During bonding, continuous AuIn2, Ni3(Sn,In)4 and Cu6(Sn,In)5 intermetallic compound (IMC) layers were formed at the solder/E-NG, solder/ENIG and solder/OSP interface, respectively. The interfacial reactions between the solder and I-Ag substrate during bonding resulted in the formation of Cu6(Sn,In)5 and Cu(Sn,In)2 IMCs with a minor Ag element. The In-48Sn/I-Ag solder joint showed the best shear properties among the four solder joints after bonding, whereas the solder/ENIG solder joint exhibited the weakest mechanical integrity.

  19. Electroplated solder alloys for flip chip interconnections

    Science.gov (United States)

    Annala, P.; Kaitila, J.; Salonen, J.

    1997-01-01

    Flip chip mounting of bare dice is gaining widespread use in microelectronics packaging. The main drivers for this technology are high packaging density, improved performance at high frequency, low parasitic effects and potentially high reliability and low cost. Many companies have made significant efforts to develop a technology for bump processing, bare die testing and underfill encapsulation to gain the benefit of all potential advantages. We have focussed on low cost bumping of fully processed silicon wafers to develop a flexible scheme for various reflow requirements. The bumping process is based on galvanic plating from an alloy solution or, alternatively, from several elemental plating baths. Sputtered Mo/Cu or Cr/Cu is used as a wettable base for electroplating. Excess base metal is removed by using the bumps as an etching mask. Variation of the alloy composition or the layer structure, allows the adjustment of the bump reflow temperature for the specific requirements of the assembly. Using binary tin-lead and ternary tin-lead-bismuth alloys, reflow temperatures from 100 °C (bismuth rich alloys) to above 300 °C (lead rich alloys) can be covered. The influence of the plating current density on the final alloy composition has been established by ion beam analysis of the plated layers and a series of reflow experiments. To control the plating uniformity and the alloy composition, a new cup plating system has been built with a random flow pattern and continuous adjustment of the current density. A well-controlled reflow of the bumps has been achieved in hot glycerol up to the eutectic point of tin-lead alloys. For high temperature alloys, high molecular weight organic liquids have been used. A tensile pull strength of 20 g per bump and resistance of 5 mΩ per bump have been measured for typical eutectic tin-lead bumps of 100 μm in diameter.

  20. Novel benzamide-based histamine h3 receptor antagonists: the identification of two candidates for clinical development.

    Science.gov (United States)

    Letavic, Michael A; Aluisio, Leah; Apodaca, Richard; Bajpai, Manoj; Barbier, Ann J; Bonneville, Anne; Bonaventure, Pascal; Carruthers, Nicholas I; Dugovic, Christine; Fraser, Ian C; Kramer, Michelle L; Lord, Brian; Lovenberg, Timothy W; Li, Lilian Y; Ly, Kiev S; Mcallister, Heather; Mani, Neelakandha S; Morton, Kirsten L; Ndifor, Anthony; Nepomuceno, S Diane; Pandit, Chennagiri R; Sands, Steven B; Shah, Chandra R; Shelton, Jonathan E; Snook, Sandra S; Swanson, Devin M; Xiao, Wei

    2015-04-09

    The preclinical characterization of novel phenyl(piperazin-1-yl)methanones that are histamine H3 receptor antagonists is described. The compounds described are high affinity histamine H3 antagonists. Optimization of the physical properties of these histamine H3 antagonists led to the discovery of several promising lead compounds, and extensive preclinical profiling aided in the identification of compounds with optimal duration of action for wake promoting activity. This led to the discovery of two development candidates for Phase I and Phase II clinical trials.

  1. Planetary Candidates Observed by Kepler. VII. The First Fully Uniform Catalog Based on The Entire 48 Month Dataset (Q1-Q17 DR24)

    CERN Document Server

    Coughlin, Jeffrey L; Thompson, Susan E; Rowe, Jason F; Burke, Christopher J; Latham, David W; Batalha, Natalie M; Ofir, Aviv; Quarles, Billy L; Henze, Christopher E; Wolfgang, Angie; Caldwell, Douglas A; Bryson, Stephen T; Shporer, Avi; Catanzarite, Joseph; Akeson, Rachel; Barclay, Thomas; Borucki, William J; Boyajian, Tabetha S; Campbell, Jennifer R; Christiansen, Jessie L; Girouard, Forrest R; Haas, Michael R; Howell, Steve B; Huber, Daniel; Jenkins, Jon M; Li, Jie; Patil-Sabale, Anima; Quintana, Elisa V; Ramirez, Solange; Seader, Shawn; Smith, Jeffrey C; Tenenbaum, Peter; Twicken, Joseph D; Zamudio, Khadeejah A

    2015-01-01

    We present the seventh Kepler planet candidate catalog, which is the first to be based on the entire, uniformly processed, 48 month Kepler dataset. This is the first fully automated catalog, employing robotic vetting procedures to uniformly evaluate every periodic signal detected by the Q1-Q17 Data Release 24 (DR24) Kepler pipeline. While we prioritize uniform vetting over the absolute correctness of individual objects, we find that our robotic vetting is overall comparable to, and in most cases is superior to, the human vetting procedures employed by past catalogs. This catalog is the first to utilize artificial transit injection to evaluate the performance of our vetting procedures and quantify potential biases, which are essential for accurate computation of planetary occurrence rates. With respect to the cumulative Kepler Object of Interest (KOI) catalog, we designate 1,478 new KOIs, of which 402 are dispositioned as planet candidates (PCs). Also, 237 KOIs dispositioned as false positives (FPs) in previou...

  2. VennPainter: A Tool for the Comparison and Identification of Candidate Genes Based on Venn Diagrams.

    Directory of Open Access Journals (Sweden)

    Guoliang Lin

    Full Text Available VennPainter is a program for depicting unique and shared sets of genes lists and generating Venn diagrams, by using the Qt C++ framework. The software produces Classic Venn, Edwards' Venn and Nested Venn diagrams and allows for eight sets in a graph mode and 31 sets in data processing mode only. In comparison, previous programs produce Classic Venn and Edwards' Venn diagrams and allow for a maximum of six sets. The software incorporates user-friendly features and works in Windows, Linux and Mac OS. Its graphical interface does not require a user to have programing skills. Users can modify diagram content for up to eight datasets because of the Scalable Vector Graphics output. VennPainter can provide output results in vertical, horizontal and matrix formats, which facilitates sharing datasets as required for further identification of candidate genes. Users can obtain gene lists from shared sets by clicking the numbers on the diagram. Thus, VennPainter is an easy-to-use, highly efficient, cross-platform and powerful program that provides a more comprehensive tool for identifying candidate genes and visualizing the relationships among genes or gene families in comparative analysis.

  3. Shear Deformation Behaviors of Sn3.5Ag Lead-free Solder Samples

    Institute of Scientific and Technical Information of China (English)

    Jing Han; Hongtao Chen; Mingyu Li; Chunqing Wang

    2013-01-01

    In this study,shear tests have been performed on the as-reflowed Sn3.5Ag solder bumps and joints to investigate the deformation behavior of Sn3.5Ag lead-free solder samples.Scanning electron microscopy (SEM) was employed to characterize the microstructures of the samples and orientation imaging microscopy (OIM) with electron backscattered diffraction (EBSD) in SEM was used to obtain crystallographic orientation of grains to provide a detailed characterization of the deformation behavior in Sn3.5Ag solder samples after shear tests.The deformation behavior in solder samples under shear stress was discussed.The experimental results suggest that the dynamic recrystallization could occur under shear stress at room temperature and recrystallized grains should evolve from subgrains by rotation.Compared with that of non-recrystallized and as-reflowed microstructures,the microhardness of the recrystallized microstructure decreased after shear tests.

  4. Influence of Asymmetrical Waveform on Low-Cycle Fatigue Life of Micro Solder Joint

    Science.gov (United States)

    Kanda, Yoshihiko; Kariya, Yoshiharu

    2010-02-01

    The effects of waveform symmetry on the low-cycle fatigue life of the Sn-3.0Ag-0.5Cu alloy have been investigated, using micro solder joint specimens with approximately the same volume of solder as is used in actual products. Focusing on crack initiation life, fatigue tests on Sn-Ag-Cu micro solder joints using asymmetrical triangular waveforms revealed no significant reduction in fatigue life. A slight reduction in fatigue life at low strain ranges caused by an increase in the fatigue ductility exponent, which is the result of a weakening microstructure due to loads applied at high temperature for long testing time, was observed. This was due to the fact that grain boundary damage, which has been reported in large-size specimens subjected to asymmetrical triangular waveforms, does not occur in Sn-Ag-Cu micro size solder joints with only a small number of crystal grain boundaries.

  5. Nano ZrO2 Particulate-reinforced Lead-Free Solder Composite

    Institute of Scientific and Technical Information of China (English)

    Jun SHEN; Yongchang LIU; Dongjiang WANG; Houxiu GAO

    2006-01-01

    A lead-free solder composite was prepared by adding ZrO2 nanopowders in eutectic Sn-Ag alloy. Microstructural features and microhardness properties of those solders with different ZrO2 nanopowder fraction were examined. Results indicate that the addition of ZrO2 nanopowders reduced the size ofβ-Sn grains and restrained the formation of bulk Ag3Sn intermetallic compounds (IMCs) due to the adsorption effect of the ZrO2 particles. The Vicker's hardness of the obtained lead-free solder composites fits well with the Hall-Petch relationship. The refinement of β-Sn grains favors to improve the microhardness of composite solders.

  6. Joint Strength with Soldering of Al2O3 Ceramics After Ni-P Chemical Plating

    Institute of Scientific and Technical Information of China (English)

    邹贵生; 吴爱萍; 张德库; 孟繁明; 白海林; 张永清; 黎义; 巫世杰; 顾兆旃

    2004-01-01

    Ni-P alloy was chemically plated on Al2O3 ceramics to produce uniform alloy coatings at temperatures below 70℃. Cu metal was electroplated onto the Ni-P coating to facilitate the soldering and shorten the chemical plating time. Then, the electroplated ceramic specimens were soldered with 60 wt.% Sn-40 wt.% Pb solder in active colophony. The highest shear strength was acquired after the heat treatment at 170℃ for 15 min. The joint fractures mostly propagated along the interface between the ceramics and the Ni-P coating, with some fracture in both the ceramics and the Ni-P coating near the interface and some along the interface between the Cu and Ni-P coatings. The results show that ceramic surface roughness and the chemical plating parameters influence the coating quality, and that suitable heat treatment before the soldering also improves the adhesion between the ceramics and Ni-P coatings, thus strengthening the joints.

  7. Abnormal growth of Ag3Sn intermetallic compounds in Sn-Ag lead-free solder

    Institute of Scientific and Technical Information of China (English)

    SHEN Jun; LIU Yongchang; GAO Houxiu

    2006-01-01

    The abnormal growth of Ag3Sn intermetallic compounds in eutectic Sn-3.5% Ag solder was investigated through high-temperature aging treatment. Microstructural evolutions of this solder before and after the aging treatment were observed by optical microscopy and scanning electron microscopy. Precise differential thermal analysis was made to study the changes in enthalpies of the solder under different conditions. The results reveal that the water-cooled solder is in metastable thermodynamic state due to the high free energy of Ag3Sn nanoparticles, which sporadically distribute in the matrix as second-phase. The second-phase Ag3Sn nanoparticles aggregate rapidly and grow to form bulk intermetallic compounds due to the migration of grain boundary between primary Sn-rich phase and the Ag3Sn nanoparticles during high temperature aging treatment.

  8. Interfacial Reactions and Joint Strengths of Sn- xZn Solders with Immersion Ag UBM

    Science.gov (United States)

    Jee, Y. K.; Yu, Jin

    2010-10-01

    The solder joint microstructures of immersion Ag with Sn- xZn ( x = 0 wt.%, 1 wt.%, 5 wt.%, and 9 wt.%) solders were analyzed and correlated with their drop impact reliability. Addition of 1 wt.% Zn to Sn did not change the interface microstructure and was only marginally effective. In comparison, the addition of 5 wt.% or 9 wt.% Zn formed layers of AgZn3/Ag5Zn8 at the solder joint interface, which increased drop reliability significantly. Under extensive aging, Ag-Zn intermetallic compounds (IMCs) transformed into Cu5Zn8 and Ag3Sn, and the drop impact resistance at the solder joints deteriorated up to a point. The beneficial role of Zn on immersion Ag pads was ascribed to the formation of Ag-Zn IMC layers, which were fairly resistant to the drop impact, and to the suppression of the brittle Cu6Sn5 phase at the joint interface.

  9. Generation and Characterization of Live Attenuated Influenza A(H7N9 Candidate Vaccine Virus Based on Russian Donor of Attenuation.

    Directory of Open Access Journals (Sweden)

    Svetlana Shcherbik

    Full Text Available Avian influenza A (H7N9 virus has emerged recently and continues to cause severe disease with a high mortality rate in humans prompting the development of candidate vaccine viruses. Live attenuated influenza vaccines (LAIV are 6:2 reassortant viruses containing the HA and NA gene segments from wild type influenza viruses to induce protective immune responses and the six internal genes from Master Donor Viruses (MDV to provide temperature sensitive, cold-adapted and attenuated phenotypes.LAIV candidate A/Anhui/1/2013(H7N9-CDC-LV7A (abbreviated as CDC-LV7A, based on the Russian MDV, A/Leningrad/134/17/57 (H2N2, was generated by classical reassortment in eggs and retained MDV temperature-sensitive and cold-adapted phenotypes. CDC-LV7A had two amino acid substitutions N123D and N149D (H7 numbering in HA and one substitution T10I in NA. To evaluate the role of these mutations on the replication capacity of the reassortants in eggs, the recombinant viruses A(H7N9RG-LV1 and A(H7N9RG-LV2 were generated by reverse genetics. These changes did not alter virus antigenicity as ferret antiserum to CDC-LV7A vaccine candidate inhibited hemagglutination by homologous A(H7N9 virus efficiently. Safety studies in ferrets confirmed that CDC-LV7A was attenuated compared to wild-type A/Anhui/1/2013. In addition, the genetic stability of this vaccine candidate was examined in eggs and ferrets by monitoring sequence changes acquired during virus replication in the two host models. No changes in the viral genome were detected after five passages in eggs. However, after ten passages additional mutations were detected in the HA gene. The vaccine candidate was shown to be stable in the ferret model; post-vaccination sequence data analysis showed no changes in viruses collected in nasal washes present at day 5 or day 7.Our data indicate that the A/Anhui/1/2013(H7N9-CDC-LV7A reassortant virus is a safe and genetically stable candidate vaccine virus that is now available for

  10. Generation and Characterization of Live Attenuated Influenza A(H7N9) Candidate Vaccine Virus Based on Russian Donor of Attenuation

    Science.gov (United States)

    Shcherbik, Svetlana; Pearce, Nicholas; Balish, Amanda; Jones, Joyce; Thor, Sharmi; Davis, Charles Todd; Pearce, Melissa; Tumpey, Terrence; Cureton, David; Chen, Li-Mei; Villanueva, Julie; Bousse, Tatiana L.

    2015-01-01

    Background Avian influenza A (H7N9) virus has emerged recently and continues to cause severe disease with a high mortality rate in humans prompting the development of candidate vaccine viruses. Live attenuated influenza vaccines (LAIV) are 6:2 reassortant viruses containing the HA and NA gene segments from wild type influenza viruses to induce protective immune responses and the six internal genes from Master Donor Viruses (MDV) to provide temperature sensitive, cold-adapted and attenuated phenotypes. Methodology/Principal Findings LAIV candidate A/Anhui/1/2013(H7N9)-CDC-LV7A (abbreviated as CDC-LV7A), based on the Russian MDV, A/Leningrad/134/17/57 (H2N2), was generated by classical reassortment in eggs and retained MDV temperature-sensitive and cold-adapted phenotypes. CDC-LV7A had two amino acid substitutions N123D and N149D (H7 numbering) in HA and one substitution T10I in NA. To evaluate the role of these mutations on the replication capacity of the reassortants in eggs, the recombinant viruses A(H7N9)RG-LV1 and A(H7N9)RG-LV2 were generated by reverse genetics. These changes did not alter virus antigenicity as ferret antiserum to CDC-LV7A vaccine candidate inhibited hemagglutination by homologous A(H7N9) virus efficiently. Safety studies in ferrets confirmed that CDC-LV7A was attenuated compared to wild-type A/Anhui/1/2013. In addition, the genetic stability of this vaccine candidate was examined in eggs and ferrets by monitoring sequence changes acquired during virus replication in the two host models. No changes in the viral genome were detected after five passages in eggs. However, after ten passages additional mutations were detected in the HA gene. The vaccine candidate was shown to be stable in the ferret model; post-vaccination sequence data analysis showed no changes in viruses collected in nasal washes present at day 5 or day 7. Conclusions/Significance Our data indicate that the A/Anhui/1/2013(H7N9)-CDC-LV7A reassortant virus is a safe and

  11. Integration of gene-based markers in a pearl millet genetic map for identification of candidate genes underlying drought tolerance quantitative trait loci

    Directory of Open Access Journals (Sweden)

    Sehgal Deepmala

    2012-01-01

    Full Text Available Abstract Background Identification of genes underlying drought tolerance (DT quantitative trait loci (QTLs will facilitate understanding of molecular mechanisms of drought tolerance, and also will accelerate genetic improvement of pearl millet through marker-assisted selection. We report a map based on genes with assigned functional roles in plant adaptation to drought and other abiotic stresses and demonstrate its use in identifying candidate genes underlying a major DT-QTL. Results Seventy five single nucleotide polymorphism (SNP and conserved intron spanning primer (CISP markers were developed from available expressed sequence tags (ESTs using four genotypes, H 77/833-2, PRLT 2/89-33, ICMR 01029 and ICMR 01004, representing parents of two mapping populations. A total of 228 SNPs were obtained from 30.5 kb sequenced region resulting in a SNP frequency of 1/134 bp. The positions of major pearl millet linkage group (LG 2 DT-QTLs (reported from crosses H 77/833-2 × PRLT 2/89-33 and 841B × 863B were added to the present consensus function map which identified 18 genes, coding for PSI reaction center subunit III, PHYC, actin, alanine glyoxylate aminotransferase, uridylate kinase, acyl-CoA oxidase, dipeptidyl peptidase IV, MADS-box, serine/threonine protein kinase, ubiquitin conjugating enzyme, zinc finger C- × 8-C × 5-C × 3-H type, Hd3, acetyl CoA carboxylase, chlorophyll a/b binding protein, photolyase, protein phosphatase1 regulatory subunit SDS22 and two hypothetical proteins, co-mapping in this DT-QTL interval. Many of these candidate genes were found to have significant association with QTLs of grain yield, flowering time and leaf rolling under drought stress conditions. Conclusions We have exploited available pearl millet EST sequences to generate a mapped resource of seventy five new gene-based markers for pearl millet and demonstrated its use in identifying candidate genes underlying a major DT-QTL in this species. The reported gene-based

  12. Thermomechanical cycling investigation of CU particulate and NITI reinforced lead-free solder

    OpenAIRE

    Horton, W. Scott.

    2006-01-01

    In todayâ s Flip Chip (FC) and Ball Grid Array (BGA) electronic packages solder joints provide both the electrical as well as the mechanical connections between the silicon chip and the substrate. Due to coefficient of thermal expansion (CTE) differences between the chip and substrate the solder joints undergo thermomechanical stresses and strains as an electronic package is heated and cooled with power on/off cycles. Advances in chip designs result in chips that are larger, run hotter and d...

  13. Studies of intermetallic growth in Cu-solder systems and wettability at solid-liquid interfaces

    OpenAIRE

    Martin, Raymond W.

    1991-01-01

    Approved for public release; distribution is unlimited The metallurgical bond formed between tin-lead solder and the copper substrate is characterized by the formation of an intermetallic compound layer. The growth of the intermetallic layer is the result of competing mechanisms, growth of the intermetallic at the intermetallic/copper interface and its dissolution at the intermetallic/liquid solder interface. These were studied by determining the dissolution rates of the copper and the i...

  14. Alternative Solder Bond Packaging Approach for High-Voltage (HV) Pulsed Power Devices

    Science.gov (United States)

    2016-09-01

    ARL-TR-7830 ● SEP 2016 US Army Research Laboratory Alternative Solder Bond Packaging Approach for High-Voltage (HV) Pulsed Power ...US Army Research Laboratory Alternative Solder Bond Packaging Approach for High-Voltage (HV) Pulsed Power Devices by Aderinto Ogunniyi, Gail...HV) Pulsed Power Devices 5a. CONTRACT NUMBER 5b. GRANT NUMBER 5c. PROGRAM ELEMENT NUMBER 6. AUTHOR(S) Aderinto Ogunniyi, Gail Koebke

  15. Immunogenicity of a Candidate DNA Vaccine Based on the prM/E Genes of a Dengue Type 2 Virus Cosmopolitan Genotype Strain.

    Science.gov (United States)

    Putri, Dwi Hilda; Sudiro, Tjahjani Mirawati; Yunita, Rina; Jaya, Ungke Anton; Dewi, Beti Ernawati; Sjatha, Fithriyah; Konishi, Eiji; Hotta, Hak; Sudarmono, Pratiwi

    2015-01-01

    The development of a dengue virus vaccine is a major priority in efforts to control the diseases. Several researchers are currently using the Asian 1 and Asian 2 genotypes as vaccine candidates for dengue type 2 virus (DENV-2). However, in this study, we constructed a recombinant plasmid-based prM/E gene, from a DENV-2 Cosmopolitan genotype strain as a dengue DNA vaccine candidate. The protein expression of the recombinant plasmid in CHO cells was analyzed using an enzyme-linked immunosorbent assay, western blotting, and sucrose gradient sedimentation. After being used to immunize ddY mice three times at doses of 25 or 100 μg, the DNA vaccine induced humoral immune responses. There was no difference in the neutralizing antibody titer (focus reduction neutralization test 50% value) of mice immunized with 25 and 100 μg DNA vaccine doses. When challenged with 3 × 10(5) FFU DENV-2, immunized mice could raise anamnestic neutralizing antibody responses, which were observed at day 4 and day 8 post-challenge. Analysis of immunogenicity using BALB/c mice showed that their antibody neutralization titers were lower than those of ddY mice. In addition, the antibodies produced after immunization and challenge could also neutralize a DENV-2 Asian 2 genotype (New Guinea C) strain. Therefore, the DENV-2 Cosmopolitan genotype may be a DENV-2 vaccine candidate.

  16. Properties and Microstructures of Sn-Ag-Cu-X Lead-Free Solder Joints in Electronic Packaging

    Directory of Open Access Journals (Sweden)

    Lei Sun

    2015-01-01

    Full Text Available SnAgCu solder alloys were considered as one of the most popular lead-free solders because of its good reliability and mechanical properties. However, there are also many problems that need to be solved for the SnAgCu solders, such as high melting point and poor wettability. In order to overcome these shortcomings, and further enhance the properties of SnAgCu solders, many researchers choose to add a series of alloying elements (In, Ti, Fe, Zn, Bi, Ni, Sb, Ga, Al, and rare earth and nanoparticles to the SnAgCu solders. In this paper, the work of SnAgCu lead-free solders containing alloying elements and nanoparticles was reviewed, and the effects of alloying elements and nanoparticles on the melting temperature, wettability, mechanical properties, hardness properties, microstructures, intermetallic compounds, and whiskers were discussed.

  17. 3D modeling of void nucleation and initial void growth due to Tin diffusion as a result of electromigration in polycrystalline lead-free solders

    Science.gov (United States)

    Karunakaran, Deepak

    Electromigration (EM) has been a serious reliability concern in microelectronics packaging for close to half a century now. Whenever the challenges of EM are overcome newer complications arise such as the demand for better performance due to increased miniaturization of semiconductor devices or the problems faced due to undesirable properties of lead-free solders. The motivation for the work is that there exists no fully computational modeling study on EM damage in lead-free solders (and also in lead-based solders). Modeling techniques such as one developed here can give new insights on effects of different grain features and offer high flexibility in varying parameters and study the corresponding effects. In this work, a new computational approach has been developed to study void nucleation and initial void growth in solders due to metal atom diffusion. It involves the creation of a 3D stochastic mesoscale model of the microstructure of a polycrystalline Tin structure. The next step was to identify regions of current crowding or 'hot-spots'. This was done through solving a finite difference scheme on top of the 3D structure. The nucleation of voids due to atomic diffusion from the regions of current crowding was modeled by diffusion from the identified hot-spot through a rejection free kinetic Monte-Carlo scheme. This resulted in the net movement of atoms from the cathode to the anode. The above steps of identifying the hotspot and diffusing the atoms at the hotspot were repeated and this lead to the initial growth of the void. This procedure was studied varying different grain parameters. In the future, the goal is to explore the effect of more grain parameters and consider other mechanisms of failure such as the formation of intermetallic compounds due to interstitial diffusion and dissolution of underbump metallurgy.

  18. Investigation of electrochemical migration on Sn-0.7Cu-0.3Ag-0.03P-0.005Ni solder alloy in HNO{sub 3} solution

    Energy Technology Data Exchange (ETDEWEB)

    Sarveswaran, C.; Othman, N. K. [School of Applied Physics, Faculty of Science and Technology, Universiti Kebangsaan Malaysia, 43600, Bangi, Selangor (Malaysia); Ali, M. Yusuf Tura; Ani, F. Che; Samsudin, Z. [Jabil Circuit Sdn Bhd, Bayan Lepas Industrial Park, 11900, Penang (Malaysia)

    2015-09-25

    Current issue in lead-free solder in term of its reliability is still under investigation. This high impact research attempts to investigate the electrochemical migration (ECM) on Sn-0.7Cu-0.3Ag-0.03P-0.005Ni solder alloy by Water Drop Test (WDT) in different concentration of HNO{sub 3} solution. The concentration of HNO{sub 3} solution used in this research was 0.05, 0.10, 0.50 and 1M. Optical Microscope (OM), Field Emission Scanning Electron Microscope (FESEM) and Energy Dispersive X-Ray Analysis (EDX) were carried out in order to analysis the ECM behavior based on the growth of dendrite formation after WDT. In general, the results demonstrated that dendrite growth is faster in higher concentration compared with low concentration of HNO{sub 3}. The concentration of HNO{sub 3} solution used has a strong correlation with Mean-Time-To-Failure (MTTF). As the concentration of HNO{sub 3} increases, the MTTF value decreases. Based on the MTTF results the solder alloy in 1M HNO{sub 3} solution is most susceptible to ECM. SnO{sub 2} forms as a corrosion by-product in the samples proved by EDX analysis. The solder alloy poses a high reliability risk in microelectronic devices during operation in 1M HNO{sub 3} solution.

  19. Evaluation of low-residue soldering for military and commercial applications: A report from the Low-Residue Soldering Task Force

    Energy Technology Data Exchange (ETDEWEB)

    Iman, R.L.; Anderson, D.J. [Sandia National Labs., Albuquerque, NM (United States); Burress, R.V. [SEHO (United States)] [and others

    1995-06-01

    The LRSTF combined the efforts of industry, military, and government to evaluate low-residue soldering processes for military and commercial applications. These processes were selected for evaluation because they provide a means for the military to support the presidential mandate while producing reliable hardware at a lower cost. This report presents the complete details and results of a testing program conducted by the LRSTF to evaluate low-residue soldering for printed wiring assemblies. A previous informal document provided details of the test plan used in this evaluation. Many of the details of that test plan are contained in this report. The test data are too massive to include in this report, however, these data are available on disk as Excel spreadsheets upon request. The main purpose of low-residue soldering is to eliminate waste streams during the manufacturing process.

  20. Stochastic Dynamics of the Multi-State Voter Model over a Network based on Interacting Cliques and Zealot Candidates

    CERN Document Server

    Palombi, Filippo

    2013-01-01

    The stochastic dynamics of the multi-state voter model is investigated on a class of complex networks made of non-overlapping cliques, each hosting a political candidate and interacting with the others via Erd\\H{o}s-R\\'enyi links. Numerical simulations of the model are interpreted in terms of an ad-hoc mean field theory, specifically tuned to resolve the inter/intra-clique interactions. Under a proper definition of the thermodynamic limit (with the average degree of the agents kept fixed while increasing the network size), the model is found to display the empirical scaling discovered by Fortunato and Castellano (2007) [1] and the vote distribution resembles qualitatively that observed in Brazilian elections.

  1. Stochastic Dynamics of the Multi-State Voter Model Over a Network Based on Interacting Cliques and Zealot Candidates

    Science.gov (United States)

    Palombi, Filippo; Toti, Simona

    2014-07-01

    The stochastic dynamics of the multi-state voter model is investigated on a class of complex networks made of non-overlapping cliques, each hosting a political candidate and interacting with the others via Erdős-Rényi links. Numerical simulations of the model are interpreted in terms of an ad-hoc mean field theory, specifically tuned to resolve the inter/intra-clique interactions. Under a proper definition of the thermodynamic limit (with the average degree of the agents kept fixed while increasing the network size), the model is found to display the empirical scaling discovered by Fortunato and Castellano (Phys Rev Lett 99(13):138701, 2007) , while the vote distribution resembles roughly that observed in Brazilian elections.

  2. Effect of Cu concentration on morphology of Sn-Ag-Cu solders by mechanical alloying

    Science.gov (United States)

    Kao, Szu-Tsung; Duh, Jenq-Gong

    2004-12-01

    The mechanical alloying (MA) process is considered an alternative approach to produce solder materials. In this study, the effect of Cu concentration in the ternary Sn-3.5Ag-xCu (x=0.2, 0.7, and 1) solder by MA was investigated. The (Cu,Sn) solid solution was precipitated as the Cu6Sn5 intermetallic compound (IMC), which was distributed nonuniformly through the microstructure. The Cu6Sn5 IMC, which was present in the SnAgCu solder with high Cu composition, causes the as-milled MA particle to fracture to a smaller size. Appreciable distinction on morphology of as-milled MA powders with different Cu content was revealed. When the Cu concentration was low (x=0.2), MA particle aggregated to a spherical ingot with large particle size. For higher Cu concentration (x=0.7 and x=1), the MA particle turned to flakes with smaller particle size. The distinction of the milling mechanism of Sn-3.5Ag-xCu (x=0.2, 0.7, and 1) solder by the MA process was discussed. An effective approach was developed to reduce the particle size of the SnAgCu solder from 1 mm down to 10-100 µm by doping the Cu6Sn5 nanoparticle during the MA process. In addition, the differential scanning calorimetry (DSC) results also ensure the compatibility to apply the solder material for the reflow process.

  3. Solder-Filling of a Cicc Cable for the Efda Dipole Magnet

    Science.gov (United States)

    Bauer, P.; Bruzzone, P.; Cau, F.; Weiss, K.; Portone, A.; Salpietro, E.; Vogel, M.; Vostner, A.

    2008-03-01

    Several prototype Cable-In-Conduit-Conductors (CICC) for the superconducting EDIPO (Efda DIPOle) revealed a degradation of their critical current (Ic) increasing with each loading cycle. The strong Lorentz-forces during operation in combination with the limited support of the single strands against these forces are thought to be the cause of the permanent degradation of the brittle Nb3Sn superconductor from which the multi-stranded CICC are made. In summer 2006 EFDA started to explore the possibility to remedy the Ic degradation by solder-filling the conductor in order to mechanically stabilize the twisted-strand cable inside the conduit. This solution was not considered as the main one, but as an emergency solution to be applied to the completed magnet, should every other option fail. The solder-filling approach was previously applied with success in some cases. Some issues, however, needed to be clarified before this solution could be proposed for the EDIPO project. The most important among them are the choice of solder material, details of the solder filling process, and the thermo-mechanical implications of a solder-filled, high-field, high-current cable. This work, being reported here, made use not only of simulation but also of experiments, such as the mechanical testing of solder filled cables at cryogenic temperatures.

  4. Comparative shear tests of some low temperature lead-free solder pastes

    Science.gov (United States)

    Branzei, Mihai; Plotog, Ioan; Varzaru, Gaudentiu; Cucu, Traian C.

    2016-12-01

    The range of electronic components and as a consequence, all parts of automotive electronic equipment operating temperatures in a vehicle is given by the location of that equipment, so the maximum temperature can vary between 358K and 478K1. The solder joints could be defined as passive parts of the interconnection structure of automotive electronic equipment, at a different level, from boards of electronic modules to systems. The manufacturing costs reduction necessity and the RoHS EU Directive3, 7 consequences generate the trend to create new Low-Temperature Lead-Free (LTLF) solder pastes family9. In the paper, the mechanical strength of solder joints and samples having the same transversal section as resistor 1206 case type made using the same LTLF alloys into Vapour Phase Soldering (VPS) process characterized by different cooling rates (slow and rapid) and two types of test PCBs pads finish, were benchmarked at room temperature. The presented work extends the theoretical studies and experiments upon heat transfer in VPSP in order to optimize the technology for soldering process (SP) of automotive electronic modules and could be extended for home and modern agriculture appliances industry. The shear forces (SF) values of the LTLF alloy samples having the same transversal section as resistor 1206 case type will be considered as references values of a database useful in the new solder alloy creation processes and their qualification for automotive electronics domain.

  5. Effect of gamma radiation on micromechanical hardness of lead-free solder joint

    Energy Technology Data Exchange (ETDEWEB)

    Paulus, Wilfred [Universiti Kebangsaan Malaysia, Bangi, 43600 Kajang, Selangor (Malaysia); Malaysian Nuclear Agency, Bangi, 43000 Kajang, Selangor (Malaysia); Rahman, Irman Abdul; Jalar, Azman; Kamil, Insan; Bakar, Maria Abu [Universiti Kebangsaan Malaysia, Bangi, 43600 Kajang, Selangor (Malaysia); Yusoff, Wan Yusmawati Wan [Universiti Pertahanan Nasional Malaysia, Kem Sg. Besi, 57000 Kuala Lumpur (Malaysia)

    2015-09-25

    Lead-free solders are important material in nano and microelectronic surface mounting technology for various applications in bio medicine, environmental monitoring, spacecraft and satellite instrumentation. Nevertheless solder joint in radiation environment needs higher reliability and resistance to any damage caused by ionizing radiations. In this study a lead-free 99.0Sn0.3Ag0.7Cu wt.% (SAC) solder joint was developed and subjected to various doses of gamma radiation to investigate the effects of the ionizing radiation to micromechanical hardness of the solder. Averaged hardness of the SAC joint was obtained from nanoindentation test. The results show a relationship between hardness values of indentations and the increment of radiation dose. Highest mean hardness, 0.2290 ± 0.0270 GPa was calculated on solder joint which was exposed to 5 Gray dose of gamma radiation. This value indicates possible radiation hardening effect on irradiated solder. The hardness gradually decreased to 0.1933 ± 0.0210 GPa and 0.1631 ± 0.0173 GPa when exposed to doses 50 and 500 gray respectively. These values are also lower than the hardness of non irradiated sample which was calculated as 0.2084 ± 0.0.3633 GPa indicating possible radiation damage and needs further related atomic dislocation study.

  6. QUICK ASSESSMENT METHODOLOGY FOR RELIABILITY OF SOLDER JOINTS IN BALL GRID ARRAY (BGA)ASSEMBLY--PART Ⅱ: RELIABILITY EXPERIMENT AND NUMERICAL SIMULATION

    Institute of Scientific and Technical Information of China (English)

    史训清; John HL Pang; 杨前进; 王志平; 聂景旭

    2002-01-01

    In the present study, a facility, i.e., a mechanical deflection system(MDS), was established and applied to assess the long-term reliability of the solder joints in plastic ball grid array (BGA) assembly. It was found that the MDS not only quickly assesses the long-term reliability of solder joints within days, but can also mimic similar failure mechanisms in accelerated thermal cycling (ATC) tests.Based on the MDS and ATC reliability experiments, the acceleration factors (AF)were obtained for different reliability testing conditions. Furthermore, by using the creep constitutive relation and fatigue life model developed in part I, a numerical approach was established for the purpose of virtual life prediction of solder joints.The simulation results were found to be in good agreement with the test results from the MDS. As a result, a new reliability assessment methodology was established as an alternative to ATC for the evaluation of long-term reliability of plastic BGA assembly.

  7. Soldering in a Reduced Gravity Environment (SoRGE)

    Science.gov (United States)

    Easton, John W.; Struk, Peter M.

    2012-01-01

    Future long-duration human exploration missions will be challenged by constraints on mass and volume allocations available for spare parts. Addressing this challenge will be critical to the success of these missions. As a result, it is necessary to consider new approaches to spacecraft maintenance and repair that reduce the need for large replacement components. Currently, crew members on the International Space Station (ISS) recover from faults by removing and replacing, using backup systems, or living without the function of Orbital Replacement Units (ORUs). These ORUs are returned to a depot where the root cause of the failure is determined and the ORU is repaired. The crew has some limited repair capability with the Modulation/DeModulation (MDM) ORU, where circuit cards are removed and replace in faulty units. The next step to reducing the size of the items being replaced would be to implement component-level repair. This mode of repair has been implemented by the U.S. Navy in an operational environment and is now part of their standard approach for maintenance. It is appropriate to consider whether this approach can be adapted for future spaceflight operations. To this end, the Soldering in a Reduced Gravity Environment (SoRGE) experiment studied the effect of gravity on the formation of solder joints on electronic circuit boards. This document describes the SoRGE experiment, the analysis methods, and results to date. This document will also contain comments from the crew regarding their experience conducting the SoRGE experiment as well as recommendations for future improvements. Finally, this document will discuss the plans for the SoRGE samples which remain on ISS.

  8. Dominant effects of Sn orientation on serrated cathode dissolution and resulting failure in actual solder joints under electromigration

    Energy Technology Data Exchange (ETDEWEB)

    Yang, T.L.; Yu, J.J.; Li, C.C.; Lin, Y.F.; Kao, C.R., E-mail: crkao@ntu.edu.tw

    2015-04-05

    Highlights: • Excessive serrated cathode dissolution strongly depends on the Sn grain orientation. • Sn grain orientation is a dominant factor that controls the direction of the serrated teeth. • Producing joints with fine Sn grains is one of the approaches to improve the reliability against current-induced failures in solder joints. - Abstract: Excessive metal dissolution is one of the major electromigration-induced degradation mechanisms in interconnects, and it often produces a distinctive serrated cathode interface with most of the serrated teeth inclined toward a specific direction. In this study, actual flip-chip solder joints were systematically analyzed to understand this highly interesting morphology. It was unequivocally established that the Sn grain orientation is a dominant factor that controls the direction of the serrated teeth. When the c-axis of a Sn grain was nearly parallel to the electron flow direction, serrated dissolution occurred, with the serrated teeth inclined toward the c-axis. These observations were rationalized based on the diffusion anisotropy of Cu in Sn.

  9. Identification of candidate categories of the International Classification of Functioning Disability and Health (ICF for a Generic ICF Core Set based on regression modelling

    Directory of Open Access Journals (Sweden)

    Üstün Bedirhan T

    2006-07-01

    Full Text Available Abstract Background The International Classification of Functioning, Disability and Health (ICF is the framework developed by WHO to describe functioning and disability at both the individual and population levels. While condition-specific ICF Core Sets are useful, a Generic ICF Core Set is needed to describe and compare problems in functioning across health conditions. Methods The aims of the multi-centre, cross-sectional study presented here were: a to propose a method to select ICF categories when a large amount of ICF-based data have to be handled, and b to identify candidate ICF categories for a Generic ICF Core Set by examining their explanatory power in relation to item one of the SF-36. The data were collected from 1039 patients using the ICF checklist, the SF-36 and a Comorbidity Questionnaire. ICF categories to be entered in an initial regression model were selected following systematic steps in accordance with the ICF structure. Based on an initial regression model, additional models were designed by systematically substituting the ICF categories included in it with ICF categories with which they were highly correlated. Results Fourteen different regression models were performed. The variance the performed models account for ranged from 22.27% to 24.0%. The ICF category that explained the highest amount of variance in all the models was sensation of pain. In total, thirteen candidate ICF categories for a Generic ICF Core Set were proposed. Conclusion The selection strategy based on the ICF structure and the examination of the best possible alternative models does not provide a final answer about which ICF categories must be considered, but leads to a selection of suitable candidates which needs further consideration and comparison with the results of other selection strategies in developing a Generic ICF Core Set.

  10. Effects of Aging Treatment on Mechanical Properties of Sn-58Bi Epoxy Solder on ENEPIG-Surface-Finished PCB

    Science.gov (United States)

    Kim, Jungsoo; Myung, Woo-Ram; Jung, Seung-Boo

    2016-11-01

    The mechanical properties of Sn-58Bi epoxy solder were evaluated by low-speed shear testing as functions of aging time and temperature. To determine the effects of epoxy, the interfacial reaction and mechanical properties of both Sn-58Bi and Sn-58Bi epoxy solder were investigated after aging treatment. The chemical composition and growth kinetics of the intermetallic compound (IMC) formed at the interface between Sn-58Bi solder and electroless nickel electroless palladium immersion gold (ENEPIG) surface finish were analyzed. Sn-58Bi solder paste was applied by stencil-printing on flame retardant-4 substrate, then reflowed. Reflowed samples were aged at 85°C, 95°C, 105°C, and 115°C for up to 1000 h. (Ni,Pd)3Sn4 IMC formed between Sn-58Bi solder and ENEPIG surface finish after reflow. Ni3Sn4 and Ni3P IMCs formed at the interface between (Ni,Pd)3Sn4 IMC and ENEPIG surface finish after aging at 115°C for 300 h. The overall IMC growth rate of Sn-58Bi solder joint was higher than that of Sn-58Bi epoxy solder joint during aging. The shear strength of Sn-58Bi epoxy solder was about 2.4 times higher than that of Sn-58Bi solder due to the blocking effect of epoxy, and the shear strength decreased with increasing aging time.

  11. Laser solder repair technique for nerve anastomosis: temperatures required for optimal tensile strength

    Science.gov (United States)

    McNally-Heintzelman, Karen M.; Dawes, Judith M.; Lauto, Antonio; Parker, Anthony E.; Owen, Earl R.; Piper, James A.

    1998-01-01

    Laser-assisted repair of nerves is often unsatisfactory and has a high failure rate. Two disadvantages of laser assisted procedures are low initial strength of the resulting anastomosis and thermal damage of tissue by laser heating. Temporary or permanent stay sutures are used and fluid solders have been proposed to increase the strength of the repair. These techniques, however, have their own disadvantages including foreign body reaction and difficulty of application. To address these problems solid protein solder strips have been developed for use in conjunction with a diode laser for nerve anastomosis. The protein helps to supplement the bond, especially in the acute healing phase up to five days post- operative. Indocyanine green dye is added to the protein solder to absorb a laser wavelength (approximately 800 nm) that is poorly absorbed by water and other bodily tissues. This reduces the collateral thermal damage typically associated with other laser techniques. An investigation of the feasibility of the laser-solder repair technique in terms of required laser irradiance, tensile strength of the repair, and solder and tissue temperature is reported here. The tensile strength of repaired nerves rose steadily with laser irradiance reaching a maximum of 105 plus or minus 10 N.cm-2 at 12.7 W.cm-2. When higher laser irradiances were used the tensile strength of the resulting bonds dropped. Histopathological analysis of the laser- soldered nerves, conducted immediately after surgery, showed the solder to have adhered well to the perineurial membrane, with minimal damage to the inner axons of the nerve. The maximum temperature reached at the solder surface and at the solder/nerve interface, measured using a non-contact fiber optic radiometer and thermocouple respectively, also rose steadily with laser irradiance. At 12.7 W.cm-2, the temperatures reached at the surface and at the interface were 85 plus or minus 4 and 68 plus or minus 4 degrees Celsius respectively

  12. A new high-throughput method utilizing porous silica-based nano-composites for the determination of partition coefficients of drug candidates.

    Science.gov (United States)

    Yu, Chih H; Tam, Kin; Tsang, Shik C

    2011-09-01

    We show that highly porous silica-based nanoparticles prepared via micro-emulsion and sol-gel techniques are stable colloids in aqueous solution. By incorporating a magnetic core into the porous silica nano-composite, it is found that the material can be rapidly separated (precipitated) upon exposure to an external magnetic field. Alternatively, the porous silica nanoparticles without magnetic cores can be equally separated from solution by applying a high-speed centrifugation. Using these silica-based nanostructures a new high-throughput method for the determination of partition coefficient for water/n-octanol is hereby described. First, a tiny quantity of n-octanol phase is pre-absorbed in the porous silica nano-composite colloids, which allows an establishment of interface at nano-scale between the adsorbed n-octanol with the bulk aqueous phase. Organic compounds added to the mixture can therefore undergo a rapid partition between the two phases. The concentration of drug compound in the supernatant in a small vial can be determined by UV-visible absorption spectroscopy. With the adaptation of a robotic liquid handler, a high-throughput technology for the determination of partition coefficients of drug candidates can be employed for drug screening in the industry based on these nano-separation skills. The experimental results clearly suggest that this new method can provide partition coefficient values of potential drug candidates comparable to the conventional shake-flask method but requires much shorter analytical time and lesser quantity of chemicals.

  13. Systematic exploration of a class of hydrophobic unnatural base pairs yields multiple new candidates for the expansion of the genetic alphabet.

    Science.gov (United States)

    Dhami, Kirandeep; Malyshev, Denis A; Ordoukhanian, Phillip; Kubelka, Tomáš; Hocek, Michal; Romesberg, Floyd E

    2014-01-01

    We have developed a family of unnatural base pairs (UBPs), which rely on hydrophobic and packing interactions for pairing and which are well replicated and transcribed. While the pair formed between d5SICS and dNaM (d5SICS-dNaM) has received the most attention, and has been used to expand the genetic alphabet of a living organism, recent efforts have identified dTPT3-dNaM, which is replicated with even higher fidelity. These efforts also resulted in more UBPs than could be independently analyzed, and thus we now report a PCR-based screen to identify the most promising. While we found that dTPT3-dNaM is generally the most promising UBP, we identified several others that are replicated nearly as well and significantly better than d5SICS-dNaM, and are thus viable candidates for the expansion of the genetic alphabet of a living organism. Moreover, the results suggest that continued optimization should be possible, and that the putatively essential hydrogen-bond acceptor at the position ortho to the glycosidic linkage may not be required. These results clearly demonstrate the generality of hydrophobic forces for the control of base pairing within DNA, provide a wealth of new structure-activity relationship data and importantly identify multiple new candidates for in vivo evaluation and further optimization.

  14. An In Silico Identification of Common Putative Vaccine Candidates against Treponema pallidum: A Reverse Vaccinology and Subtractive Genomics Based Approach

    Science.gov (United States)

    Kumar Jaiswal, Arun; Tiwari, Sandeep; Jamal, Syed Babar; Barh, Debmalya; Azevedo, Vasco; Soares, Siomar C.

    2017-01-01

    Sexually transmitted infections (STIs) are caused by a wide variety of bacteria, viruses, and parasites that are transmitted from one person to another primarily by vaginal, anal, or oral sexual contact. Syphilis is a serious disease caused by a sexually transmitted infection. Syphilis is caused by the bacterium Treponema pallidum subspecies pallidum. Treponema pallidum (T. pallidum) is a motile, gram-negative spirochete, which can be transmitted both sexually and from mother to child, and can invade virtually any organ or structure in the human body. The current worldwide prevalence of syphilis emphasizes the need for continued preventive measures and strategies. Unfortunately, effective measures are limited. In this study, we focus on the identification of vaccine targets and putative drugs against syphilis disease using reverse vaccinology and subtractive genomics. We compared 13 strains of T. pallidum using T. pallidum Nichols as the reference genome. Using an in silicoapproach, four pathogenic islands were detected in the genome of T. pallidum Nichols. We identified 15 putative antigenic proteins and sixdrug targets through reverse vaccinology and subtractive genomics, respectively, which can be used as candidate therapeutic targets in the future. PMID:28216574

  15. Plant-based production of recombinant Plasmodium surface protein pf38 and evaluation of its potential as a vaccine candidate.

    Science.gov (United States)

    Feller, Tatjana; Thom, Pascal; Koch, Natalie; Spiegel, Holger; Addai-Mensah, Otchere; Fischer, Rainer; Reimann, Andreas; Pradel, Gabriele; Fendel, Rolf; Schillberg, Stefan; Scheuermayer, Matthias; Schinkel, Helga

    2013-01-01

    Pf38 is a surface protein of the malarial parasite Plasmodium falciparum. In this study, we produced and purified recombinant Pf38 and a fusion protein composed of red fluorescent protein and Pf38 (RFP-Pf38) using a transient expression system in the plant Nicotiana benthamiana. To our knowledge, this is the first description of the production of recombinant Pf38. To verify the quality of the recombinant Pf38, plasma from semi-immune African donors was used to confirm specific binding to Pf38. ELISA measurements revealed that immune responses to Pf38 in this African subset were comparable to reactivities to AMA-1 and MSP119. Pf38 and RFP-Pf38 were successfully used to immunise mice, although titres from these mice were low (on average 1∶11.000 and 1∶39.000, respectively). In immune fluorescence assays, the purified IgG fraction from the sera of immunised mice recognised Pf38 on the surface of schizonts, gametocytes, macrogametes and zygotes, but not sporozoites. Growth inhibition assays using αPf38 antibodies demonstrated strong inhibition (≥60%) of the growth of blood-stage P. falciparum. The development of zygotes was also effectively inhibited by αPf38 antibodies, as determined by the zygote development assay. Collectively, these results suggest that Pf38 is an interesting candidate for the development of a malaria vaccine.

  16. Plant-based production of recombinant Plasmodium surface protein pf38 and evaluation of its potential as a vaccine candidate.

    Directory of Open Access Journals (Sweden)

    Tatjana Feller

    Full Text Available Pf38 is a surface protein of the malarial parasite Plasmodium falciparum. In this study, we produced and purified recombinant Pf38 and a fusion protein composed of red fluorescent protein and Pf38 (RFP-Pf38 using a transient expression system in the plant Nicotiana benthamiana. To our knowledge, this is the first description of the production of recombinant Pf38. To verify the quality of the recombinant Pf38, plasma from semi-immune African donors was used to confirm specific binding to Pf38. ELISA measurements revealed that immune responses to Pf38 in this African subset were comparable to reactivities to AMA-1 and MSP119. Pf38 and RFP-Pf38 were successfully used to immunise mice, although titres from these mice were low (on average 1∶11.000 and 1∶39.000, respectively. In immune fluorescence assays, the purified IgG fraction from the sera of immunised mice recognised Pf38 on the surface of schizonts, gametocytes, macrogametes and zygotes, but not sporozoites. Growth inhibition assays using αPf38 antibodies demonstrated strong inhibition (≥60% of the growth of blood-stage P. falciparum. The development of zygotes was also effectively inhibited by αPf38 antibodies, as determined by the zygote development assay. Collectively, these results suggest that Pf38 is an interesting candidate for the development of a malaria vaccine.

  17. GC-MS Based Plasma Metabolomics for Identification of Candidate Biomarkers for Hepatocellular Carcinoma in Egyptian Cohort.

    Directory of Open Access Journals (Sweden)

    Mohammad R Nezami Ranjbar

    Full Text Available This study evaluates changes in metabolite levels in hepatocellular carcinoma (HCC cases vs. patients with liver cirrhosis by analysis of human blood plasma using gas chromatography coupled with mass spectrometry (GC-MS. Untargeted metabolomic analysis of plasma samples from participants recruited in Egypt was performed using two GC-MS platforms: a GC coupled to single quadruple mass spectrometer (GC-qMS and a GC coupled to a time-of-flight mass spectrometer (GC-TOFMS. Analytes that showed statistically significant changes in ion intensities were selected using ANOVA models. These analytes and other candidates selected from related studies were further evaluated by targeted analysis in plasma samples from the same participants as in the untargeted metabolomic analysis. The targeted analysis was performed using the GC-qMS in selected ion monitoring (SIM mode. The method confirmed significant changes in the levels of glutamic acid, citric acid, lactic acid, valine, isoleucine, leucine, alpha tocopherol, cholesterol, and sorbose in HCC cases vs. patients with liver cirrhosis. Specifically, our findings indicate up-regulation of metabolites involved in branched-chain amino acid (BCAA metabolism. Although BCAAs are increasingly used as a treatment for cancer cachexia, others have shown that BCAA supplementation caused significant enhancement of tumor growth via activation of mTOR/AKT pathway, which is consistent with our results that BCAAs are up-regulated in HCC.

  18. Gonadotrophin releasing hormone-based vaccine, an effective candidate for prostate cancer and other hormone-sensitive neoplasms.

    Science.gov (United States)

    Junco, Jesús A; Basalto, Roberto; Fuentes, Franklin; Bover, Eddy; Reyes, Osvaldo; Pimentel, Eulogio; Calzada, Lesvia; Castro, Maria D; Arteaga, Niurka; López, Yovisleidis; Hernández, Héctor; Bringas, Ricardo; Garay, Hilda; Peschke, Peter; Bertot, José; Guillén, Gerardo

    2008-01-01

    Prostate growth, development, functions, and neoplastic transformation is androgen dependent. Estrogens have similar effects in the ovary and breast. Previous studies using gonadotrophin releasing hormone (GnRH/LHRH) vaccines have shown the usefulness of immunization against this hormone in prostate (PC) and breast cancer (BC). We have synthesized a peptide mutated at position 6 and attached to the 830-844 tetanic toxoid (TT) helper T cell sequence in the same synthesis process. After repeated pig immunizations, we have demonstrated a vaccine that significantly decreased testes size (p < 0.001), prostate (p < 0.01), seminal vesicles (p < 0.01), and testosterone (T) castration [0.05 nM ml(-1) (p < 0. 01)]. Similar results were obtained in adult male and female healthy dogs and Macaca fascicularis models. These data indicate that this GnRHm1-TT vaccine is safe and able to induce significant tumor growth inhibition in the Dunning R3327-H rat androgen responsive prostate tumor model. In these rats, the immunization induced high anti-GnRH titers concomitant with T castration reduction (p < 0.01) in 90% of the animals tested. In addition, 70% of the responders exhibited tumor growth inhibition (p = 0.02) and a survival rate approximately three times longer that those of untreated rats. These data indicate that GnRHm1-TT vaccine may be a potential candidate in the treatment of PC, BC, and other hormone-dependent cancers.

  19. Intermetallic compound formation at Sn-3.0Ag-0.5Cu-1.0Zn lead-free solder alloy/Cu interface during as-soldered and as-aged conditions

    Energy Technology Data Exchange (ETDEWEB)

    Wang, Feng-Jiang [Department of Materials Science and Engineering, Shanghai University of Engineering Science, Shanghai 201620 (China)]. E-mail: wangfjy@yahoo.com.cn; Yu, Zhi-Shui [Department of Materials Science and Engineering, Shanghai University of Engineering Science, Shanghai 201620 (China); Qi, Kai [Department of Materials Science and Engineering, Shanghai University of Engineering Science, Shanghai 201620 (China)

    2007-07-12

    Intermetallic formations of Sn-3.0Ag-0.5Cu solder alloy with additional 1.0 wt% Zn were investigated for Cu-substrate during soldering and isothermal aging. During soldering condition, the Cu{sub 5}Zn{sub 8} compound with granular-type morphology is the interfacial IMC for Sn-3.0Ag-0.5Cu-1.0Zn solder, while the Cu{sub 6}Sn{sub 5} compound with scallop-type morphology is the interfacial IMC for Sn-3.0Ag-0.5Cu solder. During thermal aging, the final interfacial structure for Sn-3.0Ag-0.5Cu-1.0Zn solder is solder/Cu{sub 5}Zn{sub 8}/Cu{sub 6}Sn{sub 5}/Cu{sub 3}Sn/Cu, different from the solder/Cu{sub 6}Sn{sub 5}/Cu{sub 3}Sn/Cu for Sn-3.0Ag-0.5Cu solder. The thickness of Cu-Sn IMC layers increases, while the thickness of Cu{sub 5}Zn{sub 8} compound layer decreases with increasing aging time due to the decomposition of the Cu{sub 5}Zn{sub 8} layer by the diffusion of Cu and Zn atoms into the solder and Cu{sub 6}Sn{sub 5} at higher aging temperature. For Sn-3.0Ag-0.5Cu-1.0Zn solder, at higher aging temperature of 150 or 175 {sup o}C, with the formation of Cu{sub 3}Sn at Cu{sub 6}Sn{sub 5}/Cu, Kirkendall voids can be observed at the interface of Cu{sub 3}Sn/Cu.

  20. Effect of diode-laser parameters on shear force of micro-joints soldered with Sn-Ag-Cu lead-free solder on Au/Ni/Cu pad

    Institute of Scientific and Technical Information of China (English)

    WANG Jian-xin; XUE Song-bai; FANG Dian-song; JU Jin-long; HAN Zong-jie; YAO Li-hua

    2006-01-01

    Soldering experiments with Sn-3.5Ag-0.5Cu lead-free solder on Au/Ni/Cu pad were carried out by means of diode-laser and IR reflow soldering methods respectively. The influence of different heating methods as well as output power of diode-laser on shear force of micro-joints was studied and the relationship between the shear force and microstructures of micro-joints was analyzed.The results indicate that the formation of intermetallic compound Ag3Sn is the key factor to affect the shear force and the fine eutectic network structures of micro-joints as well as the dispersion morphology of fine compound Ag3Sn, in which eutectic network band is responsible for the improvement of the shear force of micro-joints soldered with Sn-Ag-Cu lead-free solder. With the increases of output power of diode-laser, the shear force and the microstructures change obviously. The eutectic network structures of micro-joints soldered with diode-laser soldering method are more homogeneous and the grains of Ag3Sn compounds are finer in the range of near optimal output power than those soldered with IR reflow soldering method, so the shear force is also higher than that using IR reflow soldering method. When the output power value of diode-laser is about 41.0 W, the shear force exhibits the highest value that is 70% higher than that using IR reflow soldering method.

  1. Candidate Gene Identification with SNP Marker-Based Fine Mapping of Anthracnose Resistance Gene Co-4 in Common Bean

    Science.gov (United States)

    Burt, Andrew J.; William, H. Manilal; Perry, Gregory; Khanal, Raja; Pauls, K. Peter; Kelly, James D.; Navabi, Alireza

    2015-01-01

    Anthracnose, caused by Colletotrichum lindemuthianum, is an important fungal disease of common bean (Phaseolus vulgaris). Alleles at the Co–4 locus confer resistance to a number of races of C. lindemuthianum. A population of 94 F4:5 recombinant inbred lines of a cross between resistant black bean genotype B09197 and susceptible navy bean cultivar Nautica was used to identify markers associated with resistance in bean chromosome 8 (Pv08) where Co–4 is localized. Three SCAR markers with known linkage to Co–4 and a panel of single nucleotide markers were used for genotyping. A refined physical region on Pv08 with significant association with anthracnose resistance identified by markers was used in BLAST searches with the genomic sequence of common bean accession G19833. Thirty two unique annotated candidate genes were identified that spanned a physical region of 936.46 kb. A majority of the annotated genes identified had functional similarity to leucine rich repeats/receptor like kinase domains. Three annotated genes had similarity to 1, 3-β-glucanase domains. There were sequence similarities between some of the annotated genes found in the study and the genes associated with phosphoinositide-specific phosphilipases C associated with Co-x and the COK–4 loci found in previous studies. It is possible that the Co–4 locus is structured as a group of genes with functional domains dominated by protein tyrosine kinase along with leucine rich repeats/nucleotide binding site, phosphilipases C as well as β-glucanases. PMID:26431031

  2. Immunogenicity of a polyvalent HIV-1 candidate vaccine based on fourteen wild type gp120 proteins in golden hamsters

    Directory of Open Access Journals (Sweden)

    Ghorbani Masoud

    2006-10-01

    Full Text Available Abstract Background One of the major obstacles in the design of an effective vaccine against HIV-1 is the hypervariability of the HIV-1 envelope glycoprotein. Most HIV-1 vaccine candidates have utilized envelope glycoprotein from a single virus isolate, but to date, none of them elicited broadly reactive humoral immunity. Herein, we hypothesised that a cocktail of HIV-1 gp120 proteins containing multiple epitopes may increase the breadth of immune responses against HIV-1. We compared and evaluated the immunogenicity of HIV-1 vaccines containing either gp120 protein alone or in combinations of four or fourteen gp120s from different primary HIV-1 isolates in immunized hamsters. Results We amplified and characterized 14 different gp120s from primary subtype B isolates with both syncytium and non-syncytium inducing properties, and expressed the proteins in Chinese Hamster Ovary (CHO cell lines. Purified proteins were used either alone or in combinations of four or fourteen different gp120s to vaccinate golden hamsters. The polyvalent vaccine showed higher antibody titers to HIV-1 subtype B isolates MN and SF162 compared to the groups that received one or four gp120 proteins. However, the polyvalent vaccine was not able to show higher neutralizing antibody responses against HIV-1 primary isolates. Interestingly, the polyvalent vaccine group had the highest proliferative immune responses and showed a substantial proportion of cross-subtype CD4 reactivity to HIV-1 subtypes B, C, and A/E Conclusion Although the polyvalent approach achieved only a modest increase in the breadth of humoral and cellular immunity, the qualitative change in the vaccine (14 vs. 1 gp120 resulted in a quantitative improvement in vaccine-induced immunity.

  3. High-Reliability Low-Ag-Content Sn-Ag-Cu Solder Joints for Electronics Applications

    Science.gov (United States)

    Shnawah, Dhafer Abdulameer; Said, Suhana Binti Mohd; Sabri, Mohd Faizul Mohd; Badruddin, Irfan Anjum; Che, Fa Xing

    2012-09-01

    Sn-Ag-Cu (SAC) alloy is currently recognized as the standard lead-free solder alloy for packaging of interconnects in the electronics industry, and high- Ag-content SAC alloys are the most popular choice. However, this choice has been encumbered by the fragility of the solder joints that has been observed in drop testing as well as the high cost of the Ag itself. Therefore, low-Ag-content SAC alloy was considered as a solution for both issues. However, this approach may compromise the thermal-cycling performance of the solders. Therefore, to enhance the thermal-cycling reliability of low-Ag-content SAC alloys without sacrificing their drop-impact performance, alloying elements such as Mn, Ce, Ti, Bi, In, Sb, Ni, Zn, Al, Fe, and Co were selected as additions to these alloys. However, research reports related to these modified SAC alloys are limited. To address this paucity, the present study reviews the effect of these minor alloying elements on the solder joint reliability of low-Ag-content SAC alloys in terms of thermal cycling and drop impact. Addition of Mn, Ce, Bi, and Ni to low-Ag-content SAC solder effectively improves the thermal-cycling reliability of joints without sacrificing the drop-impact performance. Taking into consideration the improvement in the bulk alloy microstructure and mechanical properties, wetting properties, and growth suppression of the interface intermetallic compound (IMC) layers, addition of Ti, In, Sb, Zn, Al, Fe, and Co to low-Ag-content SAC solder has the potential to improve the thermal-cycling reliability of joints without sacrificing the drop-impact performance. Consequently, further investigations of both thermal-cycling and drop reliability of these modified solder joints must be carried out in future work.

  4. EFFECTS OF LEAD WIDTHS AND PITCHES ON RELIABILITY OF QUAD FLAT PACKAGE (QFP) SOLDERED JOINTS

    Institute of Scientific and Technical Information of China (English)

    XUE Songbai; WU Yuxiu; HAN Zongjie; WANG Jianxin

    2007-01-01

    The finite element method(FEM) is used to analyze the effects of lead widths and pitches on reliability of soldered joints. The optimum Simulation for QFP devices is also researched. The results indicate that when the lead pitches are the same, the maximum equivalent stress of the soldered joints increases with the increasing of lead widths, while the reliability of the soldered joints reduces. When the lead widths are the same, the maximum equivalent stress of the soldered joints doesn't decrease completely with the increasing of lead pitches, a minimum value of the maximum equivalent stress values exists in all the curves. Under this condition the maximum equivalent stress of the soldered joints is relatively the least, the reliability of soldered joints is high and the assembly is excellent. The simulating results indicate the best parameter: The lead width is 0.2 mm and lead pitch is 0.3 mm (the distance between two leads is 0.1 mm), which are benefited for the micromation of QFP devices now. The minimum value of the maximum equivalent stress of soldered joints exists while lead width is 0.25 mm and lead pitch is 0.35 mm (the distance between two leads is 0.1 mm), the devices can serve for a long time and the reliability is the highest, the assembly is excellent. The simulating results also indicate the fact that the lead width is 0.15 mm and lead pitch is 0.2 mm maybe the limit of QFP, which is significant for the high lead count and micromation of assembly.

  5. How Many Peripheral Solder Joints in a Surface Mounted Design Experience Inelastic Strains?

    Science.gov (United States)

    Suhir, E.; Yi, S.; Ghaffarian, R.

    2017-03-01

    It has been established that it is the peripheral solder joints that are the most vulnerable in the ball-grid-array (BGA) and column-grid-array (CGA) designs and most often fail. As far as the long-term reliability of a soldered microelectronics assembly as a whole is concerned, it makes a difference, if just one or more peripheral joints experience inelastic strains. It is clear that the low cycle fatigue lifetime of the solder system is inversely proportional to the number of joints that simultaneously experience inelastic strains. A simple and physically meaningful analytical expression (formula) is obtained for the prediction, at the design stage, of the number of such joints, if any, for the given effective thermal expansion (contraction) mismatch of the package and PCB; materials and geometrical characteristics of the package/PCB assembly; package size; and, of course, the level of the yield stress in the solder material. The suggested formula can be used to determine if the inelastic strains in the solder material could be avoided by the proper selection of the above characteristics and, if not, how many peripheral joints are expected to simultaneously experience inelastic strains. The general concept is illustrated by a numerical example carried out for a typical BGA package. The suggested analytical model (formula) is applicable to any soldered microelectronics assembly. The roles of other important factors, such as, e.g., solder material anisotropy, grain size, and their random orientation within a joint, are viewed in this analysis as less important factors than the level of the interfacial stress. The roles of these factors will be accounted for in future work and considered, in addition to the location of the joint, in a more complicated, more sophisticated, and more comprehensive reliability/fatigue model.

  6. The critical oxide thickness for Pb-free reflow soldering on Cu substrate

    Energy Technology Data Exchange (ETDEWEB)

    Chung, C. Key [Department of Materials Science and Engineering, National Taiwan University, No. 1, Sec. 4, Roosevelt Road, Taipei, 10617, Taiwan (China); Assembly Test Global Materials, Intel Microelectronics Asia Ltd, B1, No. 205, Tun-Hwa North Road, 10595 Taipei, Taiwan (China); Chen, Y.J.; Li, C.C. [Department of Materials Science and Engineering, National Taiwan University, No. 1, Sec. 4, Roosevelt Road, Taipei, 10617, Taiwan (China); Kao, C.R., E-mail: crkao@ntu.edu.tw [Department of Materials Science and Engineering, National Taiwan University, No. 1, Sec. 4, Roosevelt Road, Taipei, 10617, Taiwan (China)

    2012-06-01

    Oxidation is an undesirable effect of reflow soldering. Non-wetting occurs when the oxide layer grows above the critical thickness. Characterizing the critical oxide thickness for soldering is challenging due to oxide's nano-scale thickness and irregular topographic surface. In this paper, the critical copper oxide thickness was characterized by Time-of-Flight Secondary Ion Mass Spectrometry, Scanning Electron Microscopy, Energy-Dispersive X-ray spectroscopy, and Transmission Electron Microscopy. Copper substrates were coated with an Organic-Solderable-Preservative (OSP) layer and baked at 150 Degree-Sign C and 85% Relative Humidity for different amounts of time. The onset of the non-wetting phenomenon occurred when the oxide thickness reached 18 {+-} 5 nm. As the oxide grew beyond this critical thickness, the percentage of non-wetting solder joint increased exponentially. The growth of the oxide thickness followed a parabolic rate law. The rate constant of oxidation was 0.6 Multiplication-Sign 10{sup -15} cm{sup 2} min{sup -1}. Oxidation resulted from interdiffusion of copper and oxygen atoms through the OSP and oxide layers. The oxidation mechanism will be presented and discussed. - Highlights: Black-Right-Pointing-Pointer Critical oxide thickness for Pb free solder on Cu substrate is 18 {+-} 5 nm. Black-Right-Pointing-Pointer Above the critical oxide, non-wet solder joint increases exponentially. Black-Right-Pointing-Pointer A maximum 13-nm oxide thickness is suggested for good solder joint. Black-Right-Pointing-Pointer Initial growth of oxide thickness is logarithmic and then parabolic after 12 nm. Black-Right-Pointing-Pointer Thick oxide (360-560 nm) is formed as pores shorten the oxidation path.

  7. Effect Mechanism of Rare Earth on the Microstructures of SnAgCu Solder Joints%稀土元素对SnAgCu焊点内部组织的影响机制

    Institute of Scientific and Technical Information of China (English)

    张亮; 韩继光; 郭永环; 何成文; 袁建民

    2012-01-01

    Due to the enhancement of environmental protection in our world, the research on lead-free solders has become the important role in electronic industry, the addition of rare earth can improve the properties of lead-free solders, based on the soldering testing of lead-free solders bearing rare earth Ce, the scanning electron microscope and energy dispersive X-ray spectroscopy technology are used to investigate the effect mechanism of rare earth Ce on the microstructure of SnAgCu solder joints systematically. The results indicated that CeSn3 with different morphologies appear in the solder matrix. The chemical affinity is utilized to describe the correlation between Ce and Sn, Ag, Cu elements, it can be demonstrated that the rare earth Ce had higher affinity for Sn in the SnAgCu system in theoretically. The adsorption effect of rare earth is investigated based on ULF principle, it can be used to explain the intermetallic compounds(IMCs) refinement of SnAgCu solder joints bearing rare earth Ce. With the microstructure analysis of SnAgCuCe solder joints, it is found that the order of IMCs particles sizes is CeSn3>Cu6Sn5>Ag3Sn, in the theory, it is confirmed that the Ag3Sn particles plays an important role in the strengthen of SnAgCu solder joints, which can provide the theory support for the research of lead-free solders.%随着人们环保意识的逐渐增强,新型无铅钎料的研究成为电子工业中的研究热点,而稀土元素的添加可以显著改善钎料的性能,基于含稀土Ce无铅钎料的钎焊试验,采用扫描电镜和能谱仪研究稀土元素Ce对SnAgCu焊点内部组织的影响机制.结果表明,稀土元素在SnAgCu焊点内部以CeSn3的形式存在,且稀土相形态各异.采用化学亲和力来表征稀土元素Ce与Sn、Ag、Cu之间的内在联系,从理论上证明Ce的“亲Sn性”.采用乌尔夫原理研究稀土元素的吸附现象,解释稀土元素Ce对SnAgCu焊点内部金属间化合物的细化作用.由SnAgCuCe焊

  8. Oxidation kinetics of thin copper films and wetting behaviour of copper and Organic Solderability Preservatives (OSP) with lead-free solder

    Energy Technology Data Exchange (ETDEWEB)

    Ramirez, Mauricio, E-mail: mauricio.ramirez2@de.bosch.com [Robert Bosch GmbH, Robert-Bosch-Strasse 2, 71701 Schwieberdingen (Germany); Chair for Surface Science and Corrosion, University of Erlangen-Nuremberg, Martensstrasse 7, 91058 Erlangen (Germany); Henneken, Lothar [Robert Bosch GmbH, Robert-Bosch-Strasse 2, 71701 Schwieberdingen (Germany); Virtanen, Sannakaisa [Chair for Surface Science and Corrosion, University of Erlangen-Nuremberg, Martensstrasse 7, 91058 Erlangen (Germany)

    2011-05-15

    The oxide formation on thin copper films deposited on Si wafer was studied by XPS, SEM and Sequential Electrochemical Reduction Analysis SERA. The surfaces were oxidized in air with a reflow oven as used in electronic assembly at temperatures of 100 deg. C, 155 deg. C, 200 deg. C, 230 deg. C and 260 deg. C. The SERA analyses detected only the formation of Cu{sub 2}O but the XPS analysis done for the calibration of the SERA equipment proved also the presence of a CuO layer smaller than 2 nm above the Cu{sub 2}O oxide. The oxide growth follows a power-law dependence on time within this temperature range and an activation energy of 33.1 kJ/mol was obtained. The wettability of these surfaces was also determined by measuring the contact angle between solder and copper substrate after the soldering process. A correlation between oxide thickness and wetting angle was established. It was found that the wetting is acceptable only when the oxide thickness is smaller than 16 nm. An activation energy of 27 kJ/mol was acquired for the spreading of lead free solder on oxidized copper surfaces. From wetting tests on copper surfaces protected by Organic Solderability Preservatives (OSP), it was possible to calculate the activation energy for the thermal decomposition of these protective layers.

  9. Effect of firing conditions on thick film microstructure and solder joint strength for low-temperature, co-fired ceramic substrates

    Energy Technology Data Exchange (ETDEWEB)

    Hernandez, C.L.; Vianco, P.T.; Rejent, J.A.

    2000-01-04

    Low-temperature, co-fired ceramics (LTCC) are the substrate material-of-choice for a growing number of multi-chip module (MCM) applications. Unlike the longer-standing hybrid microcircuit technology based upon alumina substrates, the manufacturability and reliability of thick film solder joints on LTCC substrates have not been widely studied. An investigation was undertaken to fully characterize solder joints on these substrates. A surface mount test vehicle with Daisy chain electrical connections was designed and built with Dupont{trademark} 951 tape. The Dupont{trademark} 4569 thick film ink (Au76-Pt21-Pd3 wt.%) was used to establish the surface conductor pattern. The conductor pattern was fired onto the LTCC substrate in a matrix of processing conditions that included: (1) double versus triple prints, (2) dielectric window versus no window, and (3) three firing temperatures (800 C, 875 C and 950 C). Sn63-Pb37 solder paste with an RMA flux was screen printed onto the circuit boards. The appropriate packages, which included five sizes of chip capacitors and four sizes of leadless ceramic chip carriers, were placed on the circuit boards. The test vehicles were oven reflowed under a N{sub 2} atmosphere. Nonsoldered pads were removed from the test vehicles and the porosity of their thick film layers was measured using quantitative image analysis in both the transverse and short transverse directions. A significant dependence on firing temperature was recorded for porosity. The double printed substrates without a dielectric window revealed a thick film porosity of 31.2% at 800 C, 26.2% at 875 C and 20.4% at 950 C. In contrast, the thick film porosity of the triple printed substrates with a dielectric window is 24.1% at 800 C, 23.2% at 875 C and 17.6% at 950 C. These observations were compared with the shear strength of the as-fabricated chip capacitor solder joints to determine the effect of firing conditions on solder joint integrity. The denser films from the higher

  10. Selection and validation of potato candidate genes for maturity corrected resistance to Phytophthora infestans based on differential expression combined with SNP association and linkage mapping

    Directory of Open Access Journals (Sweden)

    Meki Shehabu Muktar

    2015-09-01

    Full Text Available Late blight of potato (Solanum tuberosum L. caused by the oomycete Phytophthora infestans (Mont. de Bary, is one of the most important bottlenecks of potato production worldwide. Cultivars with high levels of durable, race unspecific, quantitative resistance are part of a solution to this problem. However, breeding for quantitative resistance is hampered by the correlation between resistance and late plant maturity, which is an undesirable agricultural attribute. The objectives of our research are (i the identification of genes that condition quantitative resistance to P. infestans not compromised by late plant maturity and (ii the discovery of diagnostic single nucleotide polymorphism (SNP markers to be used as molecular tools to increase efficiency and precision of resistance breeding. Twenty two novel candidate genes were selected based on comparative transcript profiling by SuperSAGE (serial analysis of gene expression in groups of plants with contrasting levels of maturity corrected resistance (MCR. Reproducibility of differential expression was tested by quantitative real time PCR and allele specific pyrosequencing in four new sets of genotype pools with contrasting late blight resistance levels, at three infection time points and in three independent infection experiments. Reproducibility of expression patterns ranged from 28% to 97%. Association mapping in a panel of 184 tetraploid cultivars identified SNPs in five candidate genes that were associated with MCR. These SNPs can be used in marker-assisted resistance breeding. Linkage mapping in two half-sib families (n = 111 identified SNPs in three candidate genes that were linked with MCR. The differentially expressed genes that showed association and/or linkage with MCR putatively function in phytosterol synthesis, fatty acid synthesis, asparagine synthesis, chlorophyll synthesis, cell wall modification and in the response to pathogen elicitors.

  11. Serum-free microcarrier based production of replication deficient Influenza vaccine candidate virus lacking NS1 using Vero cells

    Directory of Open Access Journals (Sweden)

    Yan Mylene L

    2011-08-01

    Full Text Available Abstract Background Influenza virus is a major health concern that has huge impacts on the human society, and vaccination remains as one of the most effective ways to mitigate this disease. Comparing the two types of commercially available Influenza vaccine, the live attenuated virus vaccine is more cross-reactive and easier to administer than the traditional inactivated vaccines. One promising live attenuated Influenza vaccine that has completed Phase I clinical trial is deltaFLU, a deletion mutant lacking the viral Nonstructural Protein 1 (NS1 gene. As a consequence of this gene deletion, this mutant virus can only propagate effectively in cells with a deficient interferon-mediated antiviral response. To demonstrate the manufacturability of this vaccine candidate, a batch bioreactor production process using adherent Vero cells on microcarriers in commercially available animal-component free, serum-free media is described. Results Five commercially available animal-component free, serum-free media (SFM were evaluated for growth of Vero cells in agitated Cytodex 1 spinner flask microcarrier cultures. EX-CELL Vero SFM achieved the highest cell concentration of 2.6 × 10^6 cells/ml, whereas other SFM achieved about 1.2 × 10^6 cells/ml. Time points for infection between the late exponential and stationary phases of cell growth had no significant effect in the final virus titres. A virus yield of 7.6 Log10 TCID50/ml was achieved using trypsin concentration of 10 μg/ml and MOI of 0.001. The Influenza vaccine production process was scaled up to a 3 liter controlled stirred tank bioreactor to achieve a cell density of 2.7 × 10^6 cells/ml and virus titre of 8.3 Log10 TCID50/ml. Finally, the bioreactor system was tested for the production of the corresponding wild type H1N1 Influenza virus, which is conventionally used in the production of inactivated vaccine. High virus titres of up to 10 Log10 TCID50/ml were achieved. Conclusions We describe for the

  12. 高速动车联轴器鼓形齿动力学特性分析和研究%Fabrication of Precise Solder Balls by Pneumatic-diaphragm Droplet Jetting Method

    Institute of Scientific and Technical Information of China (English)

    方喜峰; 石明友; 景睿; 张胜文; 王召景

    2012-01-01

    鼓形齿联轴器是动车驱动装置的关键部件之一.为了提高我国高速动车鼓形齿联轴器的设计和制造水平,实现国产化,研究了鼓形齿动力学特性.导出了自由振动方程及固有频率方程.建立了联轴器鼓形齿的有限元模型.对几种不同鼓形量的鼓形齿进行了结构动力学和强度分析,得到了联轴器鼓形齿的动态特性和接触应力.最后制造了样机,进行了模态试验,验证了理论分析的正确性.%Aimed at high uniform ultra-small solder balls requirement in area array package,a newel fabrication method was developed based on pneumatic-diaphragm droplet jetting.The principle and self-developed equipment of this method were introduced in this paper.Solder balls with diameter less than 100|xm were fabricated with a stainless steel nozzle of 50μm in diameter.Meanwhile main control parameters were studied to investigate their effects on the diameter of solder balls.The results prove that pneumatic-diaphragm droplet jetting method can fabricate solder balls with highly uniform diameter less than l00μn, good exterior quality and roundness ,which fills up the blank of domestic solder ball fabricating technology.

  13. Independent candidates in Mexico

    OpenAIRE

    Campos, Gonzalo Santiago

    2014-01-01

    In this paper we discuss the issue of independent candidates in Mexico, because through the so-called political reform of 2012 was incorporated in the Political Constitution of the Mexican United States the right of citizens to be registered as independent candidates. Also, in September 2013 was carried out a reform of Article 116 of the Political Constitution of the Mexican United States in order to allow independent candidates in each state of the Republic. However, prior to the constitutio...

  14. Mechanical Shock Behavior of Environmentally-Benign Lead-free Solders

    Science.gov (United States)

    Yazzie, Kyle

    The mechanical behavior of Pb-free solder alloys is important, since they must maintain mechanical integrity under thermomechanical fatigue, creep, and mechanical shock conditions. Mechanical shock, in particular, has become an increasing concern in the electronics industry, since electronic packages can be subjected to mechanical shock by mishandling during manufacture or by accidental dropping. In this study, the mechanical shock behavior of Sn and Sn-Ag-Cu alloys was systematically analyzed over the strain rate range 10-3 -- 30 s-1 in bulk samples, and over 10-3 -- 12 s-1 on the single solder joint level. More importantly, the influences of solder microstructure and intermetallic compounds (IMC) on mechanical shock resistance were quantified. A thorough microstructural characterization of Sn-rich alloys was conducted using synchrotron x-ray computed tomography. The three-dimensional morphology and distribution of contiguous phases and precipitates was analyzed. A multiscale approach was utilized to characterize Sn-rich phases on the microscale with x-ray tomography and focused ion beam tomography to characterize nanoscale precipitates. A high strain rate servohydraulic test system was developed in conjunction with a modified tensile specimen geometry and a high speed camera for quantifying deformation. The effect of microstructure and applied strain rate on the local strain and strain rate distributions were quantified using digital image correlation. Necking behavior was analyzed using a novel mirror fixture, and the triaxial stresses associated with necking were corrected using a self-consistent method to obtain the true stress-true strain constitutive behavior. Fracture mechanisms were quantified as a function of strain rate. Finally, the relationship between solder microstructure and intermetallic compound layer thickness with the mechanical shock resistance of Sn-3.8Ag-0.7Cu solder joints was characterized. It was found that at low strain rates the dynamic

  15. The Role of Pd in Sn-Ag-Cu Solder Interconnect Mechanical Shock Performance

    Science.gov (United States)

    Lee, Tae-Kyu; Zhou, Bite; Bieler, Thomas R.; Tseng, Chien-Fu; Duh, Jeng-Gong

    2013-02-01

    The mechanical stability of solder joints with Pd added to Sn-Ag-Cu alloy with different aging conditions was investigated in a high- G level shock environment. A test vehicle with three different strain and shock level conditions in one board was used to identify the joint stability and failure modes. The results revealed that Pd provided stability at the package-side interface with an overall shock performance improvement of over 65% compared with the Sn-Ag-Cu alloy without Pd. A dependency on the pad structure was also identified. However, the strengthening mechanism was only observed in the non-solder mask defined (NSMD) pad design, whereas the solder mask defined (SMD) pad design boards showed no improvement in shock performance with Pd-added solders. The effects of Sn grain orientation on shock performance, interconnect stability, and crack propagation path with and without Pd are discussed. The SAC305 + Pd solder joints showed more grain refinements, recrystallization, and especially mechanical twin deformation during the shock test, which provides a partial explanation for the ability of SAC305 + Pd to absorb more shock-induced energy through active deformation compared with SAC305.

  16. Effect of Plasma Surface Finish on Wettability and Mechanical Properties of SAC305 Solder Joints

    Science.gov (United States)

    Kim, Kyoung-Ho; Koike, Junichi; Yoon, Jeong-Won; Yoo, Sehoon

    2016-12-01

    The wetting behavior, interfacial reactions, and mechanical reliability of Sn-Ag-Cu solder on a plasma-coated printed circuit board (PCB) substrate were evaluated under multiple heat-treatments. Conventional organic solderability preservative (OSP) finished PCBs were used as a reference. The plasma process created a dense and highly cross-linked polymer coating on the Cu substrates. The plasma finished samples had higher wetting forces and shorter zero-cross times than those with OSP surface finish. The OSP sample was degraded after sequential multiple heat treatments and reflow processes, whereas the solderability of the plasma finished sample was retained after multiple heat treatments. After the soldering process, similar microstructures were observed at the interfaces of the two solder joints, where the development of intermetallic compounds was observed. From ball shear tests, it was found that the shear force for the plasma substrate was consistently higher than that for the OSP substrate. Deterioration of the OSP surface finish was observed after multiple heat treatments. Overall, the plasma surface finish was superior to the conventional OSP finish with respect to wettability and joint reliability, indicating that it is a suitable material for the fabrication of complex electronic devices.

  17. Electrical Resistance of the Solder Connections for the Consolidation of the LHC Main Interconnection Splices

    CERN Document Server

    Lutum, R; Scheuerlein, C

    2013-01-01

    For the consolidation of the LHC 13 kA main interconnection splices, shunts will be soldered onto each of the 10170 splices. The solder alloy selected for this purpose is Sn60Pb40. In this context the electrical resistance of shunt to busbar lap splices has been measured in the temperature range from RT to 20 K. A cryocooler set-up has been adapted such that a test current of 150 A could be injected for accurate resistance measurements in the low nΩ range. To study the influence of the solder bulk resistivity on the overall splice resistance, connections produced with Sn96Ag4 and Sn77.2In20Ag2.8 have been studied as well. The influence of the Sn60Pb40 solder resistance is negligible when measuring the splice resistance in a longitudinal configuration over a length of 6 cm. In a transverse measurement configuration the splice resistance is significantly influenced by the solder. The connections prepared with Sn77.2In20Ag2.8 show significantly higher resistance values, as expected from the relatively high sol...

  18. Interfacial Reaction and Die Attach Properties of Zn-Sn High-Temperature Solders

    Science.gov (United States)

    Kim, Seongjun; Kim, Keun-Soo; Kim, Sun-Sik; Suganuma, Katsuaki

    2009-02-01

    Interfacial reaction and die attach properties of Zn- xSn ( x = 20 wt.%, 30 wt.%, and 40 wt.%) solders on an aluminum nitride-direct bonded copper substrate were investigated. At the interface with Si die coated with Au/TiN thin layers, the TiN layer did not react with the solder and worked as a good protective layer. At the interface with Cu, CuZn5, and Cu5Zn8 IMC layers were formed, the thicknesses of which can be controlled by joining conditions such as peak temperature and holding time. During multiple reflow treatments at 260°C, the die attach structure was quite stable. The shear strength of the Cu/solder/Cu joint with Zn-Sn solder was about 30 MPa to 34 MPa, which was higher than that of Pb-5Sn solder (26 MPa). The thermal conductivity of Zn-Sn alloys of 100 W/m K to 106 W/m K was sufficiently high and superior to those of Au-20Sn (59 W/m K) and Pb-5Sn (35 W/m K).

  19. The influence of heat treatment on properties of lead-free solders

    Directory of Open Access Journals (Sweden)

    Lýdia Trnková Rízeková

    2015-02-01

    Full Text Available The article is focused on the analysis of degradation of properties of two eutectic lead-free solders SnCu0.7 and SnAg3.5Cu0.7. The microstructures of the intermetallic compound (IMC layers at the copper substrate - solder interface were examined before and after heat treatment at 150°C for 50, 200, 500 and 1000 hours. The thickness of IMC layers of the Cu6Sn5 phase was growing with the increasing time of annealing and shown the typical scallops. For the heat treatment times of 200 hours and longer, the Cu3Sn IMC layers located near the Cu substrate were also observed. The experiments showed there is a link between the thickness of IMC layers and decrease of the shear strength of solder joints. In general, the joints made of the ternary solder showed higher shear strength before and after heat treatment in comparison to joints from solder SnCu0.7.

  20. Improvement of the auto wire feeder machine in a de-soldering process

    Directory of Open Access Journals (Sweden)

    Niramon Nonkhukhetkhong

    2016-10-01

    Full Text Available This paper presents the methodology of the de-soldering process for rework of disk drive Head Stack Assembly (HSA units. The auto wire feeder is a machine that generates Tin (Sn on the product. This machine was determined to be one of the major sources of excess Sn on the HSA. The defect rate due to excess Sn is more than 30%, which leads to increased processing time and cost to perform additional cleaning steps. From process analysis, the major causes of excess Sn are as follows: 1 The machine cannot cut the wire all the way into the flux core area; 2 The sizes and types of soldering irons are not appropriate for the unit parts; and, 3 There are variations introduced into the de-soldering process by the workforce. This paper proposes a methodology to address all three of these causes. First, the auto wire feeder machine in the de-solder process will be adjusted in order to cut wires into flux core. Second, the types of equipment and material used in de-soldering will be optimized. Finally, a new standard method for operators, which can be controlled more easily, will be developed in order to reduce defects due to workforce related variation. After these process controls and machine adjustments were implemented, the overall Sn related problems were significantly improved. Sn contamination was reduced by 41% and cycle time was reduced by an average of 15 seconds.

  1. Effects of Ni-coated Carbon Nanotubes addition on the electromigration of Sn–Ag–Cu solder joints

    Energy Technology Data Exchange (ETDEWEB)

    Yang, Zhongbao; Zhou, Wei; Wu, Ping, E-mail: pingwu@tju.edu.cn

    2013-12-25

    Highlights: •The electromigration behaviors of the composite solder joints were investigated. •The presence of Ni altered the morphology of the IMC layer after reflow. •Carbon nanotube network was observed in solder matrix. •Current crowding occurred at the carbon nanotube networks. •The electromigration effect of composite solder joint was suppressed effectively. -- Abstract: The electromigration behaviors of line-type Cu/Sn–Ag–Cu/Cu interconnects with and without Ni-Coated multi-walled Carbon Nanotubes addition were investigated in this work. After soldering, the (Cu,Ni){sub 6}Sn{sub 5} intermetallic compounds formed at the solder/Cu interface. The electromigration analysis shows that the presence of Carbon Nanotubes can suppress the atomic diffusion in the solder induced by electromigration effectively. And finite element simulation indicates that the Carbon Nanotube networks can reduce the current density in the solder matrix, which results in the improvement of electromigration resistance of composite solders.

  2. Compatibility of lead-free solders with lead containing surface finishes as a reliability issue in electronic assemblies

    Energy Technology Data Exchange (ETDEWEB)

    Vianco, P.; Rejent, J. [Sandia National Labs., Albuquerque, NM (United States); Artaki, I.; Ray, U.; Finley, D.; Jackson, A. [AT and T Bell Labs., Princeton, NJ (United States)

    1996-03-01

    Enhanced performance goals and environmental restrictions have heightened the consideration for use of alternative solders as replacements for the traditional tin-lead (Sn-Pb) eutectic and near-eutectic alloys. However, the implementation of non-Pb bearing surface finishes may lag behind solder alloy development. A study was performed which examined the effect(s) of Pb contamination on the performance of Sn-Ag-Bi and Sn-Ag-Cu-Sb lead-free solders by the controlled addition of 63Sn-37Pb solder at levels of 0.5 {minus} 8.0 wt.%. Thermal analysis and ring-in-plug shear strength studies were conducted on bulk solder properties. Circuit board prototype studies centered on the performance of 20I/O SOIC gull wing joints. Both alloys exhibited declines in their melting temperatures with greater Sn-Pb additions. The ring-in-plug shear strength of the Sn-Ag-Cu-Sb solder increased slightly with Sn-Pb levels while the Sn-Ag-Bi alloy experienced a strength loss. The mechanical behavior of the SOIC (Small Outline Integrated Circuit) Sn-Ag-Bi solder joints reproduced the strength levels were insensitive to 10,106 thermal cycles. The Sn-Ag-Cu-Sb solder showed a slight decrease in the gull wing joint strengths that was sensitive to the Pb content of the surface finish.

  3. HLAMatchmaker-based strategy to identify acceptable HLA class I mismatches for highly sensitized kidney transplant candidates.

    Science.gov (United States)

    Duquesnoy, Rene J; Witvliet, Marian; Doxiadis, Ilias I N; de Fijter, Hans; Claas, Frans H J

    2004-01-01

    HLAMatchmaker determines HLA compatibility at the level of polymorphic amino acid triplets in antibody-accessible sequence positions. Recent studies have shown that among HLA-DR-matched kidney transplants, the HLA-A,B antigen mismatches which are compatible at the triplet level have almost identical graft survival rates as the zero-HLA-A,B antigen mismatches. This finding provides the basis of a new strategy to identify HLA-mismatched organs that have similar success rates as the zero-HLA-antigen mismatches. This report describes how in conjunction with the Acceptable Mismatch program in Eurotransplant, HLAMatchmaker can expand the pool of potential donors for highly sensitized patients, for whom it is very difficult to find a compatible transplant. Sera from 35 highly sensitized kidney transplant candidates with an average PRA of 96% were screened by lymphocytotoxicity with HLA-typed panels that included cells that were selectively mismatched for one or two HLA antigens for each patient. Acceptable and unacceptable HLA-A,B antigen mismatches were determined from the serum reactivity with the cell panel. HLAMatchmaker analysis was applied to identify additional HLA class I antigens that were matched at the triplet level. For each patient, we calculated the probability of finding a donor (PFD) in the different match categories from HLA gene frequencies in the kidney donor population. The median PFD for a zero-antigen mismatch was 0.025%. Matching at the triplet level increased the median PFD to 0.037% ( P = 0.008). The median PFD was 0.058% for a 0-1-triplet mismatch and 0.226% for a 0-2-triplet mismatch. Serum screening identified acceptable antigen mismatches for 28 of 35 highly sensitized patients, and the median PFD increased to 0.307% for a zero/acceptable antigen mismatch. The application of HLAMatchmaker permitted for 33 patients (or 92%) the identification of additional antigens that were acceptable at the triplet level, and the median PFD for a zero

  4. Understanding the Influence of Copper Nanoparticles on Thermal Characteristics and Microstructural Development of a Tin-Silver Solder

    Science.gov (United States)

    Lin, D. C.; Srivatsan, T. S.; Wang, G.-X.; Kovacevic, R.

    2007-10-01

    This paper presents and discusses issues relevant to solidification of a chosen lead-free solder, the eutectic Sn-3.5%Ag, and its composite counterparts. Direct temperature recordings for the no-clean solder paste during the simulated reflow process revealed a significant amount of undercooling to occur prior to the initiation of solidification of the eutectic Sn-3.5%Ag solder, which is 6.5 °C, and for the composite counterparts, it is dependent on the percentage of copper nanopowder. Temperature recordings revealed the same temperature level of 221 °C for both melting (from solid to liquid) and final solidification (after recalescence) of the Sn-3.5%Ag solder. Addition of copper nanoparticles was observed to have no appreciable influence on melting temperature of the composite solder. However, it does influence solidification of the composite solder. The addition of 0.5 wt.% copper nanoparticles lowered the solidification temperature to 219.5 °C, while addition of 1.0 wt.% copper nanoparticles lowered the solidification temperature to 217.5 °C, which is close to the melting point of the ternary eutectic Sn-Ag-Cu solder alloy, Sn-3.7Ag-0.9Cu. This indicates the copper nanoparticles are completely dissolved in the eutectic Sn-3.5%Ag solder and precipitate as the Cu6Sn5, which reinforces the eutectic solder. Optical microscopy observations revealed the addition of 1.0 wt.% of copper nanoparticles to the Sn-3.5%Ag solder results in the formation and presence of the intermetallic compound Cu6Sn5. These particles are polygonal in morphology and dispersed randomly through the solder matrix. Addition of microsized copper particles cannot completely dissolve in the eutectic solder and projects a sunflower morphology with the solid copper particle surrounded by the Cu6Sn5 intermetallic compound coupled with residual porosity present in the solder sample. Microhardness measurements revealed the addition of copper nanopowder to the eutectic Sn-3.5%Ag solder resulted in

  5. An Investigation of TiO2 Addition on Microstructure Evolution of Sn-Cu-Ni Solder Paste Composite

    Directory of Open Access Journals (Sweden)

    Saud Norainiza

    2016-01-01

    Full Text Available In this research, varying fraction of titanium oxide (TiO2 reinforcement particles was successfully incorporated into Sn-Cu-Ni solder paste in an effort to study the influence of TiO2 addition on microstructure evolution of Sn-Cu-Ni solder paste composite. Sn-Cu-Ni solder paste composite was produced by mixing TiO2 particle with Sn-Cu-Ni solder paste. The microstructure analysis was carried out by Scanning Electron Microscopy-Energy dispersive X-ray (SEM-EDX. The addition TiO2 particle helps to refine the bulk solder microstructure and suppress the intermetallic compound (IMC formation at the interface as will be discussed further.

  6. Spreading Behavior and Evolution of IMCs During Reactive Wetting of SAC Solders on Smooth and Rough Copper Substrates

    Science.gov (United States)

    Satyanarayan; Prabhu, K. N.

    2013-08-01

    The effect of surface roughness of copper substrate on the reactive wetting of Sn-Ag-Cu solder alloys and morphology of intermetallic compounds (IMCs) was investigated. The spreading behavior of solder alloys on smooth and rough Cu substrates was categorized into capillary, diffusion/reaction, and contact angle stabilization zones. The increase in substrate surface roughness improved the wetting of solder alloys, being attributed to the presence of thick Cu3Sn IMC at the interface. The morphology of IMCs transformed from long needle shaped to short protruded type with an increase in the substrate surface roughness for the Sn-0.3Ag-0.7Cu and Sn-3Ag-0.5Cu solder alloys. However, for the Sn-2.5Ag-0.5Cu solder alloy the needle-shaped IMCs transformed to the completely scallop type with increase in the substrate surface roughness. The effect of Ag content on wetting behavior was not significant.

  7. WETTING OF COPPER BY LEAD-FREE Sn-Cu SOLDERS AND SHEAR STRENGTH OF Cu – Cu JOINTS

    Directory of Open Access Journals (Sweden)

    Pavol Šebo

    2009-04-01

    Full Text Available Developing and microstructure of lead-free Sn-Cu solders containing 3, 5 and 10 wt. % of copper in bulk as well as in ribbon form is presented. Wetting of copper substrate by these solders at the temperatures 300, 350 and 400°C in air (partially in N2+10H2 during 1800 s was studied by sessile drop method. Joints Cu – solder – Cu were prepared at 300°C and 1800 s in air as well as in gas mix and their shear strength was measured. The microstructure was studied by light and scanning electron microscopy (SEM equipped with energy dispersive X-ray analyzer and standard X-ray diffraction machine. Wetting angle decreases with increasing wetting temperature. Wetting angle increased for higher (10 wt. % amount of copper in solder. Shear strength of the joints decreases with increasing the copper concentration in solder.

  8. Effects of rapid solidification on the microstructure and microhardness of a lead-free Sn-3.5Ag solder

    Institute of Scientific and Technical Information of China (English)

    SHEN Jun; LIU Yongchang; Han Yajing; GAO Houxiu

    2006-01-01

    A lead-free Sn-3.5Ag solder was prepared by rapid solidification technology. The high solidification rate, obtained by rapid cooling, promotes nucleation, and suppresses the growth of Ag3Sn intermetallic compounds (IMCs) in Ag-rich zone, yielding fine Ag3Sn nanoparticulates with spherical morphology in the matrix of the solder. The large amount of tough homogeneously-dispersed IMCs helps to improve the surface area per unit volume and obstructs the dislocation lines passing through the solder, which fits with the dispersion-strengthening theory. Hence, the rapidly-solidified Sn-3.5Ag solder exhibits a higher microhardness when compared with a slowly-solidified Sn-3.5Ag solder.

  9. Candidate lesion-based criteria for defining a positive sacroiliac joint MRI in two cohorts of patients with axial spondyloarthritis

    DEFF Research Database (Denmark)

    Weber, Ulrich; Østergaard, Mikkel; Lambert, Robert G W

    2015-01-01

    . METHODS: Two independent cohorts A/B of 69/88 consecutive patients with back pain aged ≤50 years, with median symptom duration 1.3/10.0 years, were referred for suspected SpA (A) or acute anterior uveitis plus back pain (B). Patients were classified according to rheumatologist expert opinion based...

  10. Enhanced interfacial thermal transport in pnictogen tellurides metallized with a lead-free solder alloy

    Energy Technology Data Exchange (ETDEWEB)

    Devender,; Ramanath, Ganpati, E-mail: Ramanath@rpi.edu [Department of Materials Science and Engineering, Rensselaer Polytechnic Institute, Troy, New York 12180 (United States); Lofgreen, Kelly; Devasenathipathy, Shankar; Swan, Johanna; Mahajan, Ravi [Intel Corporation, Assembly Test and Technology Development, Chandler, Arizona 85226 (United States); Borca-Tasciuc, Theodorian [Department of Mechanical Aerospace and Nuclear Engineering, Rensselaer Polytechnic Institute, Troy, New York 12180 (United States)

    2015-11-15

    Controlling thermal transport across metal–thermoelectric interfaces is essential for realizing high efficiency solid-state refrigeration and waste-heat harvesting power generation devices. Here, the authors report that pnictogen chalcogenides metallized with bilayers of Sn{sub 96.5}Ag{sub 3}Cu{sub 0.5} solder and Ni barrier exhibit tenfold higher interfacial thermal conductance Γ{sub c} than that obtained with In/Ni bilayer metallization. X-ray diffraction and x-ray spectroscopy indicate that reduced interdiffusion and diminution of interfacial SnTe formation due to Ni layer correlates with the higher Γ{sub c}. Finite element modeling of thermoelectric coolers metallized with Sn{sub 96.5}Ag{sub 3}Cu{sub 0.5}/Ni bilayers presages a temperature drop ΔT ∼ 22 K that is 40% higher than that obtained with In/Ni metallization. Our results underscore the importance of controlling chemical intermixing at solder–metal–thermoelectric interfaces to increase the effective figure of merit, and hence, the thermoelectric cooling efficiency. These findings should facilitate the design and development of lead-free metallization for pnictogen chalcogenide-based thermoelectrics.

  11. Setup Time Reduction On Solder Paste Printing Machine – A Case Study

    Directory of Open Access Journals (Sweden)

    Rajesh Dhake

    2013-06-01

    Full Text Available Lean manufacturing envisages the reduction of the seven deadly wastes referred to as MUDA. Setup time forms a major component of the equipment downtime. It leads to lower machine utilization and restricts the output and product variety. This necessitates the requirement for quick setups. Single Minute Exchange of Die philosophy (a lean manufacturing tool here after referred as “SMED” is one of the important tool which aims at quick setups driving smaller lot sizes, lower production costs, improve productivity in terms of increased output, increased utilization of machine and labor hours, make additional capacity available (often at bottleneck resources, reduce scrap and rework, and increase flexibility[3]. This paper focuses on the application of Single Minute Exchange of Die[1] and Quick Changeover Philosophy[2] for reducing setup time on Solder Past Printing Machine (bottleneck machine in a electronic speedo-cluster manufacturing company. The four step SMED philosophy was adopted to effect reduction in setup time. The initial step was gathering information about the present setup times and its proportion to the total productive time. A detailed video based time study of setup activities was done to classify them into external and internal setup activities in terms of their need (i.e. preparation, replacement or adjustment, time taken and the way these could be reduced, simplified or eliminated. The improvements effected were of three categories viz., mechanical, procedural and organizational. The paper concludes by comparing the present and proposed (implemented methods of setup procedures.

  12. Investigation Of The Effects Of Reflow Profile Parameters On Lead-free Solder Bump Volumes And Joint Integrity

    Science.gov (United States)

    Amalu, E. H.; Lui, Y. T.; Ekere, N. N.; Bhatti, R. S.; Takyi, G.

    2011-01-01

    The electronics manufacturing industry was quick to adopt and use the Surface Mount Technology (SMT) assembly technique on realization of its huge potentials in achieving smaller, lighter and low cost product implementations. Increasing global customer demand for miniaturized electronic products is a key driver in the design, development and wide application of high-density area array package format. Electronic components and their associated solder joints have reduced in size as the miniaturization trend in packaging continues to be challenged by printing through very small stencil apertures required for fine pitch flip-chip applications. At very narrow aperture sizes, solder paste rheology becomes crucial for consistent paste withdrawal. The deposition of consistent volume of solder from pad-to-pad is fundamental to minimizing surface mount assembly defects. This study investigates the relationship between volume of solder paste deposit (VSPD) and the volume of solder bump formed (VSBF) after reflow, and the effect of reflow profile parameters on lead-free solder bump formation and the associated solder joint integrity. The study uses a fractional factorial design (FFD) of 24-1 Ramp-Soak-Spike reflow profile, with all main effects and two-way interactions estimable to determine the optimal factorial combination. The results from the study show that the percentage change in the VSPD depends on the combination of the process parameters and reliability issues could become critical as the size of solder joints soldered on the same board assembly vary greatly. Mathematical models describe the relationships among VSPD, VSBF and theoretical volume of solder paste. Some factors have main effects across the volumes and a number of interactions exist among them. These results would be useful for R&D personnel in designing and implementing newer applications with finer-pitch interconnect.

  13. Bosonisation and Soldering of Dual Symmetries in Two and Three Dimensions

    CERN Document Server

    Banerjee, R

    1997-01-01

    We develop a technique that solders the dual aspects of some symmetry following from the bosonisation of two distinct fermionic models, thereby leading to new results which cannot be otherwise obtained. Exploiting this technique, the two dimensional chiral determinants with opposite chirality are soldered to reproduce either the usual gauge invariant expression leading to the Schwinger model or, alternatively, the Thirring model. Likewise, two apparently independent three dimensional massive Thirring models with same coupling but opposite mass signatures, in the long wavelegth limit, combine by the process of bosonisation and soldering to yield an effective massive Maxwell theory. The current bosonisation formulas are given, both in the original independent formulation as well as the effective theory, and shown to yield consistent results for the correlation functions. Similar features also hold for quantum electrodynamics in three dimensions.

  14. Design of Experiments to Determine Causes of Flex Cable Solder Wicking, Discoloration and Hole Location Defects

    Energy Technology Data Exchange (ETDEWEB)

    Wolfe, Larry

    2009-04-22

    Design of Experiments (DoE) were developed and performed in an effort to discover and resolve the causes of three different manufacturing issues; large panel voids after Hot Air Solder Leveling (HASL), cable hole locations out of tolerance after lamination and delamination/solder wicking around flat flex cable circuit lands after HASL. Results from a first DoE indicated large panel voids could be eliminated by removing the pre-HASL cleaning. It also revealed eliminating the pre-HASL bake would not be detrimental when using a hard press pad lamination stackup. A second DoE indicated a reduction in hard press pad stackup lamination pressure reduced panel stretch in the y axis approximately 70%. A third DoE illustrated increasing the pre-HASL bake temperature could reduce delamination/solder wicking when using a soft press pad lamination stackup.

  15. Universal solders for direct and powerful bonding on semiconductors, diamond, and optical materials

    Science.gov (United States)

    Mavoori, Hareesh; Ramirez, Ainissa G.; Jin, Sungho

    2001-05-01

    The surfaces of electronic and optical materials such as nitrides, carbides, oxides, sulfides, fluorides, selenides, diamond, silicon, and GaAs are known to be very difficult to bond with low melting point solders (<300 °C). We have achieved a direct and powerful bonding on these surfaces by using low temperature solders doped with rare-earth elements. The rare earth is stored in micron-scale, finely-dispersed intermetallic islands (Sn3Lu or Au4Lu), and when released, causes chemical reactions at the interface producing strong bonds. These solders directly bond to semiconductor surfaces and provide ohmic contacts. They can be useful for providing direct electrical contacts and interconnects in a variety of electronic assemblies, dimensionally stable and reliable bonding in optical fiber, laser, or thermal management assemblies.

  16. 5-Fluorouracil-lipid conjugate: potential candidate for drug delivery through encapsulation in hydrophobic polyester-based nanoparticles.

    Science.gov (United States)

    Ashwanikumar, N; Kumar, Nisha Asok; Nair, S Asha; Kumar, G S Vinod

    2014-11-01

    The encapsulation of 5-fluorouracil (5-FU) in hydrophobic polymeric materials is made feasible by a lipid-based prodrug approach. A lipid-5-FU conjugate of 5-FU with palmitic acid was synthesized in two-step process. A synthesized dipalmitoyl derivative (5-FUDIPAL) was characterized using Fourier transform infrared spectroscopy and (1)H-nuclear magnetic resonance. The 5-FUDIPAL was encapsulated in polyester-based polymers by the double emulsion-solvent evaporation method. The nanoparticles were characterized by scanning electron microscopy, transmission electron microscopy and dynamic light scattering. The thermal stability was assessed by differential scanning calorimetry data. In vitro release kinetics measurements of the drug from nanoparticles showed the controlled release pattern over a period of time. Cytotoxicity measurements by MTT assay confirmed that dipalmitoyl derivative in nano formulation successfully inhibited the cell growth. Thus the combined physical and biological evaluation of the different polyester-based nanoparticle containing the modified drug showed a facile approach to delivering 5-FU to the tumour site with enhanced efficacy.

  17. Identification and prioritization of candidate genes for symptom variability in breast cancer survivors based on disease characteristics at the cellular level

    Directory of Open Access Journals (Sweden)

    Koleck TA

    2016-03-01

    Full Text Available Theresa A Koleck,1 Yvette P Conley2 1School of Nursing, 2Department of Human Genetics, School of Nursing and Graduate School of Public Health, University of Pittsburgh, Pittsburgh, PA, USA Abstract: Research is beginning to suggest that the presence and/or severity of symptoms reported by breast cancer survivors may be associated with disease-related factors of cancer. In this article, we present a novel approach to the identification and prioritization of biologically plausible candidate genes to investigate relationships between genomic variation and symptom variability in breast cancer survivors. Cognitive dysfunction is utilized as a representative breast cancer survivor symptom to elucidate the conceptualization of and justification for our cellular, disease-based approach to address symptom variability in cancer survivors. Initial candidate gene identification was based on genes evaluated as part of multigene expression profiles for breast cancer, which are commonly used in the clinical setting to characterize the biology of cancer cells for the purpose of describing overall tumor aggressiveness, prognostication, and individualization of therapy. A list of genes evaluated within five multigene expression profiles for breast cancer was compiled. In order to prioritize candidate genes for investigation, genes used in each profile were compared for duplication. Twenty-one genes (BAG1, BCL2, BIRC5, CCNB1, CENPA, CMC2, DIAPH3, ERBB2, ESR1, GRB7, MELK, MKI67, MMP11, MYBL2, NDC80, ORC6, PGR, RACGAP1, RFC4, RRM2, and SCUBE2 are utilized in two or more profiles, including five genes (CCNB1, CENPA, MELK, MYBL2, and ORC6 used in three profiles. To ensure that the parsimonious 21 gene set is representative of the more global biological hallmarks of cancer, an Ingenuity Pathway Analysis was conducted. Evaluation of genes known to impact pathways involved with cancer development and progression provide a means to evaluate the overlap between the

  18. Benefit-of-doubt (BOD) scoring: a sequencing-based method for SNP candidate assessment from high to medium read number data sets.

    Science.gov (United States)

    Sedlazeck, Fritz Joachim; Talloji, Prabhavathi; von Haeseler, Arndt; Bachmair, Andreas

    2013-03-01

    Identification of single nucleotide polymorphisms (SNPs) is a key element in sequence-based genetic analysis. Next generation sequencing offers a cost-effective basis to generate the necessary, large sequence data sets, and bioinformatic methods are being developed to process sequencing machine readouts. We were interested in detection of SNPs in a 350 kb region of an EMS-mutagenized Arabidopsis chromosome 3. The region was selectively analyzed using PCR-generated, overlapping fragments for Solexa sequencing. The ensuing reads provided a high coverage and were processed bioinformatically. In order to assess the SNP candidates obtained with a frequently used alignment program and SNP caller, we developed an additional method that allows the identification of high confidence SNP loci. The method can easily be applied to complete genome sequence data of sufficient coverage.

  19. The microstructure and properties of as-cast Sn-Zn-Bi solder alloys

    Directory of Open Access Journals (Sweden)

    Mladenović Srba A.

    2012-01-01

    Full Text Available Research on the lead-free solders has attracted wide attention, mostly as the result of the implementation of the Directive on the Restriction of the Use of Hazardous Substances in Electrical and Electronic Equipment. The Sn-Zn solder alloys have been considered to be one of the most attractive lead-free solders due to its ability to easily replace Sn-Pb eutectic alloy without increasing the soldering temperature. Furthermore, the mechanical properties are comparable or even superior to those of Sn-Pb solder. However, other problems still persist. The solution to overcoming these drawbacks is to add a small amount of alloying elements (Bi, Ag, Cr, Cu, and Sb to the Sn-Zn alloys. Microstructure, tensile strength, and hardness of the selected Sn-Zn-Bi ternary alloys have been investigated in this study. The SEM-EDS was used for the identification of co-existing phases in the samples. The specimens’ microstructures are composed of three phases: Sn-rich solid solution as the matrix, Bi-phase and Zn-rich phase. The Bi precipitates are formed around the Sn-dendrit grains as well as around the Zn-rich phase. The amount of Bi segregation increases with the increase of Bi content. The Sn-Zn-Bi alloys exhibit the high tensile strength and hardness, but the values of these mechanical properties decrease with the increase of Bi content, as well as the reduction of Zn content. The results presented in this paper may offer further knowledge of the effects various parameters have on the properties of lead-free Sn-Zn-Bi solders.

  20. In-vitro Investigations of Skin Closure using Diode Laser and Protein Solder Containing Gold Nanoshells

    Directory of Open Access Journals (Sweden)

    Mohammad Sadegh Nourbakhsh

    2010-12-01

    Full Text Available Introduction: Laser tissue soldering is a new technique for repair of various tissues including the skin, liver, articular cartilage and nerves and is a promising alternative to suture. To overcome the problems of thermal damage to surrounding tissues and low laser penetration depth, some exogenous chromophores such as gold nanoshells, a new class of nanoparticles consisting of a dielectric core surrounded by a thin metal shell, are used. The aims of this study were to use two different concentrations of gold nanoshells as the exogenous material for skin tissue soldering and also to examine the effects of laser soldering parameters on the properties of the repaired skin. Material and Methods: Two mixtures of albumin solder and different concentrations of gold nanoshells were prepared. A full thickness incision of 2×20 mm2 was made on the surface and after placing 50 μl of the solder mixture on the incision, an 810 nm diode laser was used to irradiate it at different power densities. The changes of tensile strength, σt, due to temperature rise, number of scan (Ns, and scan velocity (Vs were investigated. Results: The results showed that the tensile strength of the repaired skin increased with increasing irradiance for both gold nanoshell concentrations. In addition, at constant laser irradiance (I, the tensile strength of the repaired incision increased with increasing Ns and decreasing Vs. In our case, this corresponded to st = 1610 g/cm2 at I ~ 60 Wcm-2, T ~ 65ºC, Ns = 10 and Vs = 0.2 mms-1. Discussion and Conclusion: Gold nanoshells can be used as an indocyanine green dye (ICG alterative for laser tissue soldering.  Although by increasing the laser power density, the tensile strength of the repaired skin increases, an optimum power density must be considered due to the resulting increase in tissue temperature.

  1. Mechanical properties and microstructure investigation of Sn-Ag-Cu lead free solder for electronic package applications

    Science.gov (United States)

    Wang, Qing

    While the electronics industry appears to be focusing on Sn-Ag-Cu as the alloy of choice for lead free electronics assembly, the exact composition varies by geographic region, supplier and user. Add to that dissolved copper and silver from the printed circuit board traces and surface finish, and there can be significant variation in the final solder joint composition. A systematic study of the mechanical and microstructural properties of Sn-Ag-Cu alloys with Ag varying from 2wt% to 4wt% and Cu varying from 0.5wt% to 1.5wt%, was investigated in this research study. Different sample preparation techniques (water quenched, oil quenched and water quenched followed by reflow) were explored and the resulting microstructure compared to that of a typical reflowed lead free chip scale package (CSP) solder joint. Tensile properties such as tensile strength, 0.2% yield strength and the ultimate tensile strength and creep behavior of selected alloy compositions (Sn-4Ag-1.5Cu, Sn-4Ag-0.5Cu, Sn-2Ag-1.5Cu, Sn-2Ag-0.5Cu, Sn-3.5Ag-0.8Cu) were performed for three conditions: as-cast; aged for 100 hours at 125°C; and aged for 250 hours at 125°C. The microstructures of these alloys were examined using light and scanning electron microscopy (LM and SEM) respectively and SEM based energy dispersive x-ray spectroscopy (EDS). Fracture surface and cross-section analysis were performed on the specimens after creep testing. The creep testing results and the effect of high temperature aging on mechanical properties will also be presented for the oil quenched samples. A hyperbolic-sine creep model was adopted and used to fit the creep experiment data. The effect of adding the quaternary element bismuth to the Sn-3.5Ag-0.8Cu alloy on the mechanical properties was measured and compared with the mechanical properties of the ternary alloys. The results of this research study provide necessary data for the modeling of solder joint reliability for a range of Sn-Ag-Cu compositions and a baseline

  2. The Numerical Analysis of Strain Behavior at Solder Joint and Interface of Flip Chip Package

    Institute of Scientific and Technical Information of China (English)

    S; C; Chen; Y; C; Lin

    2002-01-01

    The flip chip package is a kind of advanced electri ca l packages. Due to the requirement of miniaturization, lower weight, higher dens ity and higher performance in the advanced electric package, it is expected that flip chip package will soon be a mainstream technology. The silicon chip is dir ectly connected to printing circuit substrate by SnPb solder joints. Also, the u nderfill, a composite of polymer and silica particles, is filled in the gap betw een the chip and substrate around the solder joint...

  3. Sensitivity of Solder Joint Fatigue to Sources of Variation in Advanced Vehicular Power Electronics Cooling

    Energy Technology Data Exchange (ETDEWEB)

    Vlahinos, A.; O' Keefe, M.

    2010-06-01

    This paper demonstrates a methodology for taking variation into account in thermal and fatigue analyses of the die attach for an inverter of an electric traction drive vehicle. This method can be used to understand how variation and mission profile affect parameters of interest in a design. Three parameters are varied to represent manufacturing, material, and loading variation: solder joint voiding, aluminum nitride substrate thermal conductivity, and heat generation at the integrated gate bipolar transistor. The influence of these parameters on temperature and solder fatigue life is presented. The heat generation loading variation shows the largest influence on the results for the assumptions used in this problem setup.

  4. Mechanical performances of lead-free solder joint connections with applications in the aerospace domain

    Directory of Open Access Journals (Sweden)

    Georgiana PADURARU

    2016-03-01

    Full Text Available The paper presents some theoretical and experimental aspects regarding the tribological performances of lead-free solder joint connections, with application in the aerospace domain. In order to highlight the mechanical and tribological properties of solder joint in correlation with different pad finishes, there were made some mechanical determinations using a dedicated Share Test System. The theoretical model highlights the link between the experimental results and the influence of gravitational acceleration on the mechanical and functional integrity of the electronic assemblies that works in vibration environment. The paper novelty is provided by the interdisciplinary experiment that offers results that can be used in the mechanical, tribological, electronical and aerospace domains.

  5. Contamination profile of Printed Circuit Board Assemblies in relation to soldering types and conformal coating

    DEFF Research Database (Denmark)

    Conseil, Helene; Jellesen, Morten Stendahl; Ambat, Rajan

    2014-01-01

    , and concentration are profiled and reported. Presence of localized flux residues were visualized using a commercial Residue RAT gel test and chemical structure was identified by FT-IR, while the concentration was measured using ion chromatography, and the electrical properties of the extracts were determined...... by an appropriate cleaning. Selective soldering process generates significantly higher levels of residues compared to the wave and reflow process. For conformal coated PCBAs, the contamination levels generated from the tested wave and selective soldering process are found to be enough to generate blisters under...

  6. Effect of Electromigration on the Type of Drop Failure of Sn-3.0Ag-0.5Cu Solder Joints in PBGA Packages

    Science.gov (United States)

    Huang, M. L.; Zhao, N.

    2015-10-01

    Board-level drop tests of plastic ball grid array (PBGA) packages were performed in accordance with the Joint Electron Devices Engineering Council standard to investigate the effect of electromigration (EM) on the drop reliability of Sn-3.0Ag-0.5Cu solder joints with two substrate surface finishes, organic solderability preservative (OSP) and electroless nickel electroless palladium immersion gold (ENEPIG). In the as-soldered state, drop failures occurred at the substrate sides only, with cracks propagating within the interfacial intermetallic compound (IMC) layer for OSP solder joints and along the IMC/Ni-P interface for ENEPIG solder joints. The drop lifetime of OSP solder joints was approximately twice that of ENEPIG joints. EM had an important effect on crack formation and drop lifetime of the PBGA solder joints. ENEPIG solder joints performed better in drop reliability tests after EM, that is, the drop lifetime of ENEPIG joints decreased by 43% whereas that of OSP solder joints decreased by 91%, compared with the as-soldered cases. The more serious polarity effect, i.e., excessive growth of the interfacial IMC at the anode, was responsible for the sharper decrease in drop lifetime. The different types of drop failure of PBGA solder joints before and after EM, including the position of initiation and the propagation path of cracks, are discussed on the basis of the growth behavior of interfacial IMC.

  7. Conservation and diversity of influenza A H1N1 HLA-restricted T cell epitope candidates for epitope-based vaccines.

    Directory of Open Access Journals (Sweden)

    Paul Thiamjoo Tan

    Full Text Available BACKGROUND: The immune-related evolution of influenza viruses is exceedingly complex and current vaccines against influenza must be reformulated for each influenza season because of the high degree of antigenic drift among circulating influenza strains. Delay in vaccine production is a serious problem in responding to a pandemic situation, such as that of the current H1N1 strain. Immune escape is generally attributed to reduced antibody recognition of the viral hemagglutinin and neuraminidase proteins whose rate of mutation is much greater than that of the internal non-structural proteins. As a possible alternative, vaccines directed at T cell epitope domains of internal influenza proteins, that are less susceptible to antigenic variation, have been investigated. METHODOLOGY/PRINCIPAL FINDINGS: HLA transgenic mouse strains expressing HLA class I A*0201, A*2402, and B*0702, and class II DRB1*1501, DRB1*0301 and DRB1*0401 were immunized with 196 influenza H1N1 peptides that contained residues of highly conserved proteome sequences of the human H1N1, H3N2, H1N2, H5N1, and avian influenza A strains. Fifty-four (54 peptides that elicited 63 HLA-restricted peptide-specific T cell epitope responses were identified by IFN-gamma ELISpot assay. The 54 peptides were compared to the 2007-2009 human H1N1 sequences for selection of sequences in the design of a new candidate H1N1 vaccine, specifically targeted to highly-conserved HLA-restricted T cell epitopes. CONCLUSIONS/SIGNIFICANCE: Seventeen (17 T cell epitopes in PB1, PB2, and M1 were selected as vaccine targets based on sequence conservation over the past 30 years, high functional avidity, non-identity to human peptides, clustered localization, and promiscuity to multiple HLA alleles. These candidate vaccine antigen sequences may be applicable to any avian or human influenza A virus.

  8. Candidate genes involved in cardiovascular risk factors by a family-based association study on the island of Kosrae, Federated States of Micronesia.

    Science.gov (United States)

    Han, Zhihua; Heath, Simon C; Shmulewitz, Dvora; Li, Wentian; Auerbach, Steve B; Blundell, Maude L; Lehner, Thomas; Ott, Jurg; Stoffel, Markus; Friedman, Jeffrey M; Breslow, Jan L

    2002-07-01

    Altered plasma levels of lipids and lipoproteins, obesity, hypertension, and diabetes are major risk factors for atherosclerotic cardiovascular disease. To identify genes that affect these traits and disorders, we looked for association between markers in candidate genes (apolipoprotein AII (apo AII), apolipoprotein AI-CIII-AIV gene cluster (apo AI-CIII-AIV), apolipoprotein E (apo E), cholesteryl ester transfer protein (CETP), cholesterol 7alpha-hydroxylase (CYP7a), hepatic lipase (HL), and microsomal triglyceride transfer protein (MTP)) and known risk factors (triglycerides (Tg), total cholesterol (TC), apolipoprotein AI (apo AI), apolipoprotein AII (apo AII), apolipoprotein B (apo B), body mass index (BMI), blood pressure (BP), leptin, and fasting blood sugar (FBS) levels.) A total of 1,102 individuals from the Pacific island of Kosrae were genotyped for the following markers: Apo AII/MspI, Apo CIII/SstI, Apo AI/XmnI, Apo E/HhaI, CETP/TaqIB, CYP7a/BsaI, HL/DraI, and MTP/HhpI. After testing for population stratification, family-based association analysis was carried out. Novel associations found were: 1) the apo AII/MspI with apo AI and BP levels, 2) the CYP7a/BsaI with apo AI and BMI levels. We also confirmed the following associations: 1) the apo AII/MspI with Tg level; 2) the apo CIII/SstI with Tg, TC, and apo B levels; 3) the Apo E/HhaI E2, E3, and E4 alleles with TC, apo AI, and apo B levels; and 4) the CETP/TaqIB with apo AI level. We further confirmed the connection between the apo AII gene and Tg level by a nonparametric linkage analysis. We therefore conclude that many of these candidate genes may play a significant role in susceptibility to heart disease.

  9. High-yield production of a stable Vero cell-based vaccine candidate against the highly pathogenic avian influenza virus H5N1

    Energy Technology Data Exchange (ETDEWEB)

    Zhou, Fangye; Zhou, Jian; Ma, Lei; Song, Shaohui; Zhang, Xinwen; Li, Weidong; Jiang, Shude [No. 5, Department of Bioproducts, Institute of Medical Biology, Chinese Academy of Medical Science and Pecking Union Medical College, Jiaoling Avenue 935, Kunming, Yunnan Province 650102, People' s Republic of China (China); Wang, Yue, E-mail: euy-tokyo@umin.ac.jp [National Institute for Viral Disease Control and Prevention, China Center for Disease Control and Prevention, Yingxin Lane 100, Xicheng District, Beijing 100052, People' s Republic of China (China); Liao, Guoyang, E-mail: liaogy@21cn.com [No. 5, Department of Bioproducts, Institute of Medical Biology, Chinese Academy of Medical Science and Pecking Union Medical College, Jiaoling Avenue 935, Kunming, Yunnan Province 650102, People' s Republic of China (China)

    2012-05-18

    Highlights: Black-Right-Pointing-Pointer Vero cell-based HPAI H5N1 vaccine with stable high yield. Black-Right-Pointing-Pointer Stable high yield derived from the YNVa H3N2 backbone. Black-Right-Pointing-Pointer H5N1/YNVa has a similar safety and immunogenicity to H5N1delta. -- Abstract: Highly pathogenic avian influenza (HPAI) viruses pose a global pandemic threat, for which rapid large-scale vaccine production technology is critical for prevention and control. Because chickens are highly susceptible to HPAI viruses, the supply of chicken embryos for vaccine production might be depleted during a virus outbreak. Therefore, developing HPAI virus vaccines using other technologies is critical. Meeting vaccine demand using the Vero cell-based fermentation process has been hindered by low stability and yield. In this study, a Vero cell-based HPAI H5N1 vaccine candidate (H5N1/YNVa) with stable high yield was achieved by reassortment of the Vero-adapted (Va) high growth A/Yunnan/1/2005(H3N2) (YNVa) virus with the A/Anhui/1/2005(H5N1) attenuated influenza vaccine strain (H5N1delta) using the 6/2 method. The reassorted H5N1/YNVa vaccine maintained a high hemagglutination (HA) titer of 1024. Furthermore, H5N1/YNVa displayed low pathogenicity and uniform immunogenicity compared to that of the parent virus.

  10. Intermetallic compound formation in Sn-Co-Cu, Sn-Ag-Cu and eutectic Sn-Cu solder joints on electroless Ni(P) immersion Au surface finish after reflow soldering

    Energy Technology Data Exchange (ETDEWEB)

    Sun Peng [Key State Lab for New Displays and System Integration (Chinese Ministry of Education), SMIT Center, Shanghai University, 200072 Shanghai (China) and Department of Microtechnology and Nanoscience, SMIT Center, Chalmers University of Technology, 412-96 Goeteborg (Sweden)]. E-mail: peng.sun@mc2.chalmers.se; Andersson, Cristina [Department of Microtechnology and Nanoscience, SMIT Center, Chalmers University of Technology, 412-96 Goeteborg (Sweden); Wei Xicheng [Key State Lab for New Displays and System Integration (Chinese Ministry of Education), SMIT Center, Shanghai University, 200072 Shanghai (China); Cheng Zhaonian [Department of Microtechnology and Nanoscience, SMIT Center, Chalmers University of Technology, 412-96 Goeteborg (Sweden); Shangguan Dongkai [Flextronics International, San Jose, CA (United States); Liu Johan [Key State Lab for New Displays and System Integration (Chinese Ministry of Education), SMIT Center, Shanghai University, 200072 Shanghai (China); Department of Microtechnology and Nanoscience, SMIT Center, Chalmers University of Technology, 412-96 Goeteborg (Sweden)

    2006-11-25

    The interfacial reactions between Sn-0.4Co-0.7Cu eutectic alloy and immersion Au/electroless Ni(P)/Cu substrate were investigated after reflow soldering at 260 deg. C for 2 min. Common Sn-4.0Ag-0.5Cu and eutectic Sn-0.7Cu solders were used as reference. Two types of intermetallic compounds (IMC) were found in the solder matrix of the Sn-0.4Co-0.7Cu alloy, namely coarser CoSn{sub 2} and finer Cu{sub 6}Sn{sub 5} particles, while only one ternary (Cu, Ni){sub 6}Sn{sub 5} interfacial compound was detected between the solder alloy and the electroless nickel and immersion gold (ENIG) coated substrate. The same trend was also observed for the Sn-Ag-Cu and Sn-Cu solder joints. Compared with the CoSn{sub 2} particles found in the Sn-Co-Cu solder and the Ag{sub 3}Sn particles found in the Sn-Ag-Cu solder, the Cu{sub 6}Sn{sub 5} particles found in both solder systems exhibited finer structure and more uniform distribution. It was noted that the thickness of the interfacial IMCs for the Sn-Co-Cu, Sn-Ag-Cu and Sn-Cu alloys was 3.5 {mu}m, 4.3 {mu}m and 4.1 {mu}m, respectively, as a result of longer reflow time above the alloy's melting temperature since the Sn-Ag-Cu solder alloy has the lowest melting point.

  11. A finite element-based injury metric for pulmonary contusion: investigation of candidate metrics through correlation with computed tomography.

    Science.gov (United States)

    Gayzik, F Scott; Hoth, J Jason; Daly, Melissa; Meredith, J Wayne; Stitzel, Joel D

    2007-10-01

    Pulmonary contusion (PC) is the most common thoracic soft tissue injury following non-penetrating blunt trauma and has been associated with mortality rates as high as 25%. This study is part of an ongoing effort to develop a finite element based injury criteria for PC. The aims of this study are two fold. The first is to investigate the use of computed tomography (CT) to quantify the volume of pathologic lung tissue in a prospective study of PC. The second is to use a finite element model (FEM) of the lung to investigate several mathematical predictors of contusion to determine the injury metric that best matches the spatial distribution of contusion obtained from the CT analysis. PC is induced in-situ utilizing male Sprague Dawley rats (n = 24) through direct impact to the right lung at 5.0 ms(-1). Force vs. deflection data are collected and used for model validation and optimization. CT scans are taken at 24 hours, 48 hours, 1 week, and 1 month post contusion. A numerical simulation is performed using an FEM of the rat lung and surrounding structures. Injury predictors investigated include maximum first principal strain, maximum shear strain, triaxial mean strain, octahedral shear stress, and maximum shear stress. Strain rate and the product of strain and strain rate are evaluated for all listed strains. At each post-impact time point, the volume of contused lung is used to determine the specific elements representing pathologic lung. Through this method, a threshold is determined for all listed metrics. The spatial distribution of the elements exceeding this threshold is compared to the spatial distribution of high-radiopacity lung tissue in the CT through a three dimensional registration technique to determine the predictor with the best correlation to the outcome. Impacts resulted in a mean energy input to the lung of 8.74 +/- 2.5 mJ. Segmentation of the imaging data yielded a mean unilateral high-radiopacity tissue estimate of 14.5% by volume at 24 hours with

  12. Comparative testing of six antigen-based malaria vaccine candidates directed toward merozoite-stage Plasmodium falciparum

    DEFF Research Database (Denmark)

    Arnot, David E; Cavanagh, David R; Remarque, Edmond J;

    2008-01-01

    Immunogenicity testing of Plasmodium falciparum antigens being considered as malaria vaccine candidates was undertaken in rabbits. The antigens compared were recombinant baculovirus MSP-1(19) and five Pichia pastoris candidates, including two versions of MSP-1(19), AMA-1 (domains I and II), AMA-1...

  13. Effects of bismuth on growth of intermetallic compounds in Sn-Ag-Cu Pb-free solder joints

    Institute of Scientific and Technical Information of China (English)

    LI Guo-yuan; SHI Xun-qing

    2006-01-01

    The effects of Bi addition on the growth of intermetallic compound (IMC) formation in Sn-3.8Ag-0.7Cu solder joints were investigated. The test samples were prepared by conventional surface mounting technology. To investigate the element diffusion and the growth kinetics of intermetallics formation in solder joint,isothermal aging test was performed at temperatures of 100,150,and 190 ℃,respectively. The optical microscope (OM) and scanning electron microscope (SEM) were used to observe microstructure evolution of solder joint and to estimate the thickness and the grain size of the intermetallic layers. The IMC phases were identified by energy dispersive X-ray (EDX) and X-ray diffractometer (XRD). The results clearly show that adding about 1.0% Bi in Sn-Ag-Cu solder alloy system can refine the grain size of the IMC and inhibit the excessive IMC growth in solder joints,and therefore improve the reliability of the Pb-free solder joints. Through observation of the microstructural evolution of the solder joints,the mechanism of inhibition of IMC growth due to Bi addition was proposed.

  14. Microstructural evolution and tensile properties of Sn-Ag-Cu mixed with Sn-Pb solder alloys

    Energy Technology Data Exchange (ETDEWEB)

    Wang Fengjiang [Department of Materials Science and Engineering and Materials Research Center, Missouri University of Science and Technology, Rolla, MO 65401 (United States); O' Keefe, Matthew [Department of Materials Science and Engineering and Materials Research Center, Missouri University of Science and Technology, Rolla, MO 65401 (United States)], E-mail: mjokeefe@mst.edu; Brinkmeyer, Brandon [Department of Materials Science and Engineering and Materials Research Center, Missouri University of Science and Technology, Rolla, MO 65401 (United States)

    2009-05-27

    The effect of incorporating eutectic Sn-Pb solder with Sn-3.0Ag-0.5Cu (SAC) Pb-free solder on the microstructure and tensile properties of the mixed alloys was investigated. Alloys containing 100, 75, 50, 25, 20, 15, 10, 5 and 0 wt% SAC, with the balance being Sn-37Pb eutectic solder alloy, were prepared and characterized. Optical and scanning electron microscopy were used to analyze the microstructures while 'mini-tensile' test specimens were fabricated and tested to determine mechanical properties at the mm length scale, more closely matching that of the solder joints. Microstructural analysis indicated that a Pb-rich phase formed and was uniformly distributed at the boundary between the Sn-rich grains or between the Sn-rich and the intermetallic compounds in the solder. Tensile results showed that mixing of the alloys resulted in an increase in both the yield and the ultimate tensile strength compared to the original solders, with the 50% SAC-50% Sn-Pb mixture having the highest measured strength. Initial investigations indicate the formation and distribution of a Pb-rich phase in the mixed solder alloys as the source of the strengthening mechanism.

  15. Determination of Average Failure Time and Microstructural Analysis of Sn-Ag-Bi-In Solder Under Electromigration

    Science.gov (United States)

    Wu, Albert T.; Sun, K. H.

    2009-12-01

    Despite the extensive use of Sn-Ag-Cu as a Pb-free solder alloy, its melting point is significantly higher than that of eutectic Sn-Pb solder. Sn-Ag-Bi-In solder is an alternative Pb-free solder, with a melting temperature close to that of eutectic Sn-Pb. This study elucidates the electromigration behavior of Sn-Ag-Bi-In solder and then compares the results with those of the Sn-Ag-Bi system. The behavior of Pb-free Sn-Ag-Bi-In solder strips under electromigration is examined by preparing them in Si (001) U-grooves. The samples are then tested under various temperatures and current densities. Although the compounds thicken near both electrodes with current stressing, the thickness at the anode exceeds that at the cathode. Experimental results of the average failure time indicate that Sn-Ag-Bi-In solder has a longer lifetime than does Sn-Ag-Bi, which is attributed to the ζ phase. Additionally, the ζ phase dissolved by the current in the early stage replenishes the outgoing atomic flux. These atomic fluxes also enhance the growth of abnormally large particles in the middle of the strips. Field-emission electron probe microanalysis (FE-EPMA) results indicate that the amount of indium is reduced after the ζ phase near the cathode is exhausted for extended current stressing time.

  16. Microstructural characterization and mechanical property of active soldering anodized 6061 Al alloy using Sn-3.5Ag-xTi active solders

    Energy Technology Data Exchange (ETDEWEB)

    Wang, Wei-Lin, E-mail: wangwl77@gmail.com; Tsai, Yi-Chia, E-mail: tij@itri.org.tw

    2012-06-15

    Active solders Sn-3.5Ag-xTi varied from x = 0 to 6 wt.% Ti addition were prepared by vacuum arc re-melting and the resultant phase formation and variation of microstructure with titanium concentration were analyzed using X-ray diffraction, optical microscopy and scanning electron microscopy. The Sn-3.5Ag-xTi active solders are used as metallic filler to join with anodized 6061 Al alloy for potential applications of providing a higher heat conduction path. Their joints and mechanical properties were characterized and evaluated in terms of titanium content. The mechanical property of joints was measured by shear testing. The joint strength was very dependent on the titanium content. Solder with a 0.5 wt.% Ti addition can successfully wet and bond to the anodized aluminum oxide layers of Al alloy and posses a shear strength of 16.28 {+-} 0.64 MPa. The maximum bonding strength reached 22.24 {+-} 0.70 MPa at a 3 wt.% Ti addition. Interfacial reaction phase and chemical composition were identified by a transmission electron microscope with energy dispersive spectrometer. Results showed that the Ti element reacts with anodized aluminum oxide to form Al{sub 3}Ti-rich and Al{sub 3}Ti phases at the joint interfaces. - Highlights: Black-Right-Pointing-Pointer Active solder joining of anodized Al alloy needs 0.5 wt.% Ti addition for Sn-3.5Ag. Black-Right-Pointing-Pointer The maximum bonding strength occurs at 3 wt.% Ti addition. Black-Right-Pointing-Pointer The Ti reacts with anodized Al oxide to form Al{sub 3}Ti-rich and Al{sub 3}Ti at joint interface.

  17. Assessment of Solder Interconnect Integrity in Dismantled Electronic Components from N57 and B61 Tube-Type Radars

    Energy Technology Data Exchange (ETDEWEB)

    Rejent, J.A.; Vianco, P.T.; Woodrum, R.A.

    1999-07-01

    Aging analyses were performed on solder joints from two radar units: (1) a laboratory, N57 tube-type radar unit and (2) a field-returned, B61-0, tube-type radar unit. The cumulative temperature environments experienced by the units during aging were calculated from the intermetallic compound layer thickness and the mean Pb-rich phase particle size metrics for solder joints in the units, assuming an aging time of 35 years for both radars. Baseline aging metrics were obtained from a laboratory test vehicle assembled at AS/FM and T; the aging kinetics of both metrics were calculated from isothermal aging experiments. The N57 radar unit interconnect board solder joints exhibited very little aging. The eyelet solder joints did show cracking that most likely occurred at the time of assembly. The eyelet, SA1126 connector solder joints, showed some delamination between the Cu pad and underlying laminate. The B61 field-returned radar solder joints showed a nominal degree of aging. Cracking of the eyelet solder joints was observed. The Pb-rich phase particle measurements indicated additional aging of the interconnects as a result of residual stresses. Cracking of the terminal pole connector, pin-to-pin solder joint was observed; but it was not believed to jeopardize the electrical functionality of the interconnect. Extending the stockpile lifetime of the B61 tube-type radar by an additional 20 years would not be impacted by the reliability of the solder joints with respect to further growth of the intermetallic compound layer. Additional coarsening of the Pb-rich phase will increase the joints' sensitivity to thermomechanical fatigue.

  18. [Bioinformatics-based Design of Peptide Vaccine Candidates Targeting Spike Protein of MERS-CoV and Immunity analysis in Mice].

    Science.gov (United States)

    Lan, Jiaming; Lu, Shuai; Deng, Yao; Wen, Bo; Chen, Hong; Wang, Wen; Tan, Wenjie

    2016-01-01

    Middle East respiratory syndrome coronavirus (MERS-CoV) was identified as a novel human coronavirus and posed great threat to public health world wide,which calls for the development of effective and safe vaccine urgently. In the study, peptide epitopes tagrgeting spike antigen were predicted based on bioinformatics methods. Nine polypeptides with high scores were synthesized and linked to keyhole limpet hemocyanin (KLH). Female BALB/C mice were immunized with individual polypeptide-KLH, and the total IgG was detected by ELISA as well as the cellular mediated immunity (CMI) was analyzed using ELIs-pot assay. The results showed that an individual peptide of YVDVGPDSVKSACIEVDIQQTFFDKTWPRPIDVSKADGI could induce the highest level of total IgG as well as CMI (high frequency of IFN-γ secretion) against MERS-CoV antigen in mice. Our study identified a promising peptide vaccine candidate against MERS-CoV and provided an experimental support for bioinformatics-based design of peptide vaccine.

  19. The use of process plasmas for cleaning PCB substrates for fluxless soldering of electronic assemblies

    Energy Technology Data Exchange (ETDEWEB)

    Philpott, J.D

    1999-12-01

    In this thesis the ability of single and multiple gas plasmas to improve the solderability of PCB substrates, and hence allow the removal of flux from the soldering process for electronic assemblies has been investigated. It has been shown that asymmetric electrode plasma chambers allow the use of single gas plasmas for this purpose due to their greater efficiency compared to symmetric systems. It has also been shown that the use of triple gas plasmas results in improved cleaning ability when using symmetric electrode systems. Dynamic contact angle (DCA) analysis was the primary analytical technique used in this work. This technique produces two contact angles, advancing and receding. The advancing contact angle determines the surface energy of a solid. It has been shown using Auger analysis that contact angles of approximately 48 deg indicate low levels of hydrocarbon contamination. It has also been shown that plasma cleaning processes giving advancing contact angles of this magnitude result in the ability to solder Hot Air Solder Leveled (HASL) PCB substrates without the use of flux. In addition it has been shown that, whilst it is possible to reduce the advancing contact angle of copper substrates considerably, the reduction is not as great as for HASL substrates. Analytical models of RF plasma chambers have also been reviewed, and these adapted for the plasma chambers used in this work. The experimental work carried out in this research also shows that these models hold true. (author)

  20. Microstructural Coarsening during Thermomechanical Fatigue and Annealing of Micro Flip-Chip Solder Joints

    Energy Technology Data Exchange (ETDEWEB)

    Barney, Monica Michele [Univ. of California, Berkeley, CA (United States)

    1998-12-01

    Microstructural evolution due to thermal effects was studied in micro solder joints (55 ± 5 μm). The composition of the Sn/Pb solder studied was found to be hypereutectic with a tin content of 65-70 wt%.This was determined by Energy Dispersive X-ray analysis and confirmed with quantitative stereology. The quantitative stereological value of the surface-to-volume ratio was used to characterize and compare the coarsening during thermal cycling from 0-160 C to the coarsening during annealing at 160 C. The initial coarsening of the annealed samples was more rapid than the cycled samples, but tapered off as time to the one-half as expected. Because the substrates to which the solder was bonded have different thermal expansion coefficients, the cycled samples experienced a mechanical strain with thermal cycling. The low-strain cycled samples had a 2.8% strain imposed on the solder and failed by 1,000 cycles, despite undergoing less coarsening than the annealed samples. The high-strain cycled samples experienced a 28% strain and failed between 25 and 250 cycles. No failures were observed in the annealed samples. Failure mechanisms and processing issues unique to small, fine pitch joints are also discussed.

  1. Nanoscale Soldering of Positioned Carbon Nanotubes using Highly Conductive Electron Beam Induced Gold Deposition

    DEFF Research Database (Denmark)

    Madsen, Dorte Nørgaard; Mølhave, Kristian; Mateiu, Ramona Valentina

    2003-01-01

    We have developed an in-situ method for controlled positioning of carbon nanotubes followed by highly conductive contacting of the nanotubes, using electron beam assisted deposition of gold. The positioning and soldering process takes place inside an Environmental Scanning Electron Microscope (E...

  2. Microstructure and mechanical behavior of novel rare earth-containing Pb-Free solders

    Science.gov (United States)

    Dudek, M. A.; Sidhu, R. S.; Chawla, N.; Renavikar, M.

    2006-12-01

    Sn-rich solders have been shown to have superior mechanical properties when compared to the Pb-Sn system. Much work remains to be done in developing these materials for electronic packaging. In this paper, we report on the microstructure and mechanical properties of La-containing Sn-3.9Ag-0.7Cu alloys. The addition of small amounts of La (up to 0.5 wt.%) to Sn-Ag-Cu refined the microstructure by decreasing the length and spacing of the Sn dendrites and decreased the thickness of the Cu6Sn5 intermetallic layer at the Cu/solder interface. As a result of the change in the microstructure, Sn-Ag-Cu alloys with La additions exhibited a small decrease in ultimate shear strength but significantly higher elongations compared with Sn-Ag-Cu. The influence of LaSn3 intermetallics on microstructural refinement and damage evolution in these novel solders is discussed. Our results have profound implications for improving the mechanical shock resistance of Pb-free solders.

  3. Interfacial reaction of eutectic AuSi solder with Si (100) and Si (111) surfaces

    Science.gov (United States)

    Jang, Jin-Wook; Hayes, Scott; Lin, Jong-Kai; Frear, Darrel R.

    2004-06-01

    The dissolution behavior of Si (100) and (111) dies by eutectic AuSi solder was investigated. On the Si (100) surface, the dissolution primarily occurred by the formation of craters resulting in a rough surface. The dissolution of the Si (111) resulted in a relatively smooth surface. The morphology of the Si (100) surface during a AuSi soldering reaction exhibited more time-dependent behavior and the etching craters on a Si (100) surface grew larger with time whereas Si (111) did not significantly change. This difference was ascribed to the surface energy differences between Si (111) and (100) surfaces that resulted in the two- and three-dimensional dissolution behaviors, respectively. This difference plays an important role in the formation of voids during the AuSi die bonding. The etching craters on Si (100) act as a AuSi solder sink and the regions surrounded by etch pits tend to become voids. For Si (111), flat surfaces were observed in the voided regions. Cross section analysis showed that no solder reaction occurred in the voided region of the Si (111) surface. This suggests the possibility of the formation of a thin inert layer in a potentially voided region prior to assembly. To achieve void-free die bonding, different parameters must be adjusted to the Si (100) and Si (111) surfaces with the AuSi alloy.

  4. Microstructure evolution in a Pb-free solder alloy during mechanical fatigue

    NARCIS (Netherlands)

    Matin, M. A.; Vellinga, W. P.; Geers, M. G. D.

    2006-01-01

    Microstructural evolution in a Sn-rich eutectic Sn-3.8Ag-0.7Cu solder alloy has been investigated in low cycle mechanical fatigue. Inhomogeneity in deformation occurred on a grain scale (determined by grain orientation and plastic anisotropy of Sn) and on a subgrain scale where persistent slip bands

  5. Characterizing performances of solder paste printing process at flexible manufacturing lines

    Energy Technology Data Exchange (ETDEWEB)

    Siew, Jit Ping; Low, Heng Chin [University of Science Malaysia, 11800 Minden, Penang (Malaysia); Teoh, Ping Chow [Wawasan Open University, 54 Jalan Sultan Ahmad Shah, 10050 Penang (Malaysia)

    2015-02-03

    Solder paste printing (SPP) has been a challenge on printed circuit board (PCB) manufacturing, evident by the proliferation of solder paste inspection equipment, or substituted by rigorous non-value added activity of manual inspections. The objective of this study is to characterize the SPP performance of various products manufactured in flexible production lines with different equipment configurations, and determine areas for process improvement. The study began by collecting information on SPP performance relative to component placement (CP) process, and to the proportion of mixed products. Using a clustering algorithm to group similar elements together, SPP performance across all product-production line pairs are statistically modeled to discover the trend and the influential factors. The main findings are: (a) Ratio of overall dpku for CP and SPP processes are 2:1; (b) logistic regression models of SPP performance indicated that only effects of product-production line and solder paste printer configuration are significant; (c) PCB circuitry design with BGA components and single solder paste printer line configurations generated the highest monthly defects, with the highest variation in the latter.

  6. Relative Damage Stress: Dominant Mechanical Factor for the Failure of Soldered Joints under Temperature Cycling

    Institute of Scientific and Technical Information of China (English)

    2001-01-01

    By temperature normalization of the concept of equivalent damage stress proposed by Lemaitre,a new concept of relative damage stress has been put forward as the dominant mechanical factor for the failure of soldered joints under temperature cycling. Finite element numerical simulation results showed that the highest value of relative damage stress occurred at the high temperaturehold time during temperature cycling history.

  7. A Feasibility Study of Lead Free Solders for Level 1 Packaging Applications

    DEFF Research Database (Denmark)

    Chidambaram, Vivek; Hald, John; Hattel, Jesper Henri

    2009-01-01

    the equilibrium calculations by Scheil solidification simulations and optimization. A feasibility study has been carried out for the replacement of high-lead-containing solders with the focus on surface tension, natural radius of curvature, oxidation resistance, intermetallic compound formation, and environmental...

  8. Au-SN Flip-Chip Solder Bump for Microelectronic and Optoelectronic Applications

    CERN Document Server

    Yoon, Jeong-Won; Koo, Ja-Myeong; Jung, Seung-Boo

    2007-01-01

    As an alternative to the time-consuming solder pre-forms and pastes currently used, a co-electroplating method of eutectic Au-Sn alloy was used in this study. Using a co-electroplating process, it was possible to plate the Au-Sn solder directly onto a wafer at or near the eutectic composition from a single solution. Two distinct phases, Au5Sn and AuSn, were deposited at a composition of 30at.%Sn. The Au-Sn flip-chip joints were formed at 300 and 400 degrees without using any flux. In the case where the samples were reflowed at 300 degrees, only an (Au,Ni)3Sn2 IMC layer formed at the interface between the Au-Sn solder and Ni UBM. On the other hand, two IMC layers, (Au,Ni)3Sn2 and (Au,Ni)3Sn, were found at the interfaces of the samples reflowed at 400 degrees. As the reflow time increased, the thickness of the (Au,Ni)3Sn2 and (Au,Ni)3Sn IMC layers formed at the interface increased and the eutectic lamellae in the bulk solder coarsened.

  9. Maintaining Low Voiding Solder Die Attach for Power Die While Minimizing Die Tilt

    Energy Technology Data Exchange (ETDEWEB)

    Hamm, Randy; Peterson, Kenneth A.

    2015-10-01

    This paper addresses work to minimize voiding and die tilt in solder attachment of a large power die, measuring 9.0 mm X 6.5 mm X 0.1 mm (0.354” x 0.256” x 0.004”), to a heat spreader. As demands for larger high power die continue, minimizing voiding and die tilt is of interest for improved die functionality, yield, manufacturability, and reliability. High-power die generate considerable heat, which is important to dissipate effectively through control of voiding under high thermal load areas of the die while maintaining a consistent bondline (minimizing die tilt). Voiding was measured using acoustic imaging and die tilt was measured using two different optical measurement systems. 80Au-20Sn solder reflow was achieved using a batch vacuum solder system with optimized fixturing. Minimizing die tilt proved to be the more difficult of the two product requirements to meet. Process development variables included tooling, weight and solder preform thickness.

  10. The effect of ultrasound on the gold plating of silica nanoparticles for use in composite solders.

    Science.gov (United States)

    Cobley, A J; Mason, T J; Alarjah, M; Ashayer, R; Mannan, S H

    2011-01-01

    In order to produce electronic devices that can survive harsh environments it is essential that the solder joints are very reliable and this has led to the development of composite solders. One approach to the manufacture of such solders is to disperse silica nanoparticles into it to improve their mechanical and fatigue characteristics. However, this is difficult to achieve using bare silica particles because they are not "wettable" in the solder matrix and so cannot be dispersed efficiently. In an attempt to alleviate this issue it has been found that if the silica nanoparticles are first plated with gold then this problem of wetting can, to some extent, be overcome. However, the particles must be completely encapsulated with gold which, using the method previously described by workers at Kings College London, was found to be difficult to accomplish. In this short communication the effect of ultrasound on the gold coverage is described. Different frequencies of ultrasound were used (20, 850 and 1176 kHz) and it was found that higher frequencies of ultrasound improved the coverage and dispersion of the gold nanoparticles over silica during the seeding step compared to simple mechanical agitation. This subsequently led to a more complete encapsulation of gold in the plating stage.

  11. Length-Dependent Electromigration Behavior of Sn58Bi Solder and Critical Length of Electromigration

    Science.gov (United States)

    Zhao, Xu; Muraoka, Mikio; Saka, Masumi

    2017-02-01

    On the basis of a developed test structure, electromigration (EM) tests of Sn58Bi solder strips with lengths of 50 μm, 100 μm, and 150 μm were simultaneously conducted at a current density of 27 kA/cm2 at 373 K. Length-dependent EM behavior was detected, and the mechanism is discussed. Bi atoms were segregated to the anode side more easily as the strip length increased, which resulted in the formation of a thicker Bi-rich layer or Sn-Bi mixed hillocks. The results reveal the existence of back flow that depends on the solder joint length. The back flow is most likely caused by an oxide layer formed on the Sn58Bi solder. By measuring the thicknesses of the Bi-rich layers, the Bi drift velocities were obtained. The critical length of the solder joint and the critical product of the length and the current density were estimated to be 16 μm and 43 A/cm, respectively. This observation will assist design of advanced electronic devices to anticipate EM reliability.

  12. Nucleation and Growth of Tin in Pb-Free Solder Joints

    Science.gov (United States)

    Gourlay, C. M.; Belyakov, S. A.; Ma, Z. L.; Xian, J. W.

    2015-08-01

    The solidification of Pb-free solder joints is overviewed with a focus on the formation of the βSn grain structure and grain orientations. Three solders commonly used in electronics manufacturing, Sn-3Ag-0.5Cu, Sn-3.5Ag, and Sn-0.7Cu-0.05Ni, are used as case studies to demonstrate that (I) growth competition between primary dendrites and eutectic fronts during growth in undercooled melts is important in Pb-free solders and (II) a metastable eutectic containing NiSn4 forms in Sn-3.5Ag/Ni joints. Additionally, it is shown that the substrate (metallization) has a strong influence on the nucleation and growth of tin. We identify Co, Pd, and Pt substrates as having the potential to control solidification and microstructure formation. In the case of Pd and Pt substrates, βSn is shown to nucleate on the PtSn4 or PdSn4 intermetallic compound (IMC) reaction layer at relatively low undercooling of ~4 K, even for small solder ball diameters down to <200 μm.

  13. [Assessment of exposure to toxic metals released during soldering and grazing processes].

    Science.gov (United States)

    Matczak, Wanda

    2002-01-01

    The aim of the study was to assess toxic metal exposure in workers performing soldering and brazing operations. The study group included workers of three plants manufacturing electronic systems, household equipment and electric motors. Membrane filters were used to collect 50 air samples, including personal 8-h samples to assess average weighed concentration of soldering and brazing fumes and their elements, and to assay respirable dust and "background" or "area" samples. After testing by gravimetry, the filter with collected sample was mineralized with concentrated HCL/HNO3 and 10 ml sample solution in 32% HCL/4% HNO3 was prepared according to OSHA ID-206. Atomic absorption spectrometry was used to assess the contents of lead (Pb), tin (Sn), copper (Cu), zinc (Zn), antimony (Sb), silver (Ag) and manganese (Mn) in the sample solution. The quantitative analysis revealed that time-weighed average (TWA) of fume concentrations were: soldering fume Cu brazing fume Cu < 0.003-0.038 mg/m3, Zn < 0.003-0.025 mg/m3, Pb < 0.014-0.023 mg/m3, Ag < 0.014 mg/m3, Sn < 0.15 mg/m3, Mn < 0.07-0.12 mg/m3. The results show that on the day of measurements, working conditions at solderer/brazer workplaces were safe, i.e. relevant MAC values were not exceeded.

  14. Mechanical Characterization of Lead-Free Sn-Ag-Cu Solder Joints by High-Temperature Nanoindentation

    OpenAIRE

    Lotfian, S.; Molina Aldareguía, Jon M.; Yazzie, K. E.; Llorca Martinez, Francisco Javier; Chawla, N

    2013-01-01

    The reliability of Pb-free solder joints is controlled by their microstructural constituents. Therefore, knowledge of the solder microconstituents’ mechanical properties as a function of temperature is required. Sn-Ag-Cu lead-free solder alloy contains three phases: a Sn-rich phase, and the intermetallic compounds (IMCs) Cu6Sn5 and Ag3Sn. Typically, the Sn-rich phase is surrounded by a eutectic mixture of β-Sn, Cu6Sn5, and Ag3Sn. In this paper, we report on the Young’s modulus and hardness of...

  15. Microstructures and fatigue life of SnAgCu solder joints bearing Nano-Al particles in QFP devices

    Science.gov (United States)

    Zhang, Liang; Fan, Xi-ying; Guo, Yong-huan; He, Cheng-wen

    2014-05-01

    Microstructures and fatigue life of SnAgCu and SnAgCu bearing nano-Al particles in QFP (Quad flat package) devices were investigated, respectively. Results show that the addition of nano-Al particles into SnAgCu solder can refine the microstructures of matrix microstructure. Moreover, the nano-Al particles present in the solder matrix, act as obstacles which can create a back stress, resisting the motion of dislocations. In QFP device, it is found that the addition of nano-Al particles can increase the fatigue life by 32% compared with the SnAgCu solder joints during thermal cycling loading.

  16. Thermal Fatigue Evaluation of Pb-Free Solder Joints: Results, Lessons Learned, and Future Trends

    Science.gov (United States)

    Coyle, Richard J.; Sweatman, Keith; Arfaei, Babak

    2015-09-01

    Thermal fatigue is a major source of failure of solder joints in surface mount electronic components and it is critically important in high reliability applications such as telecommunication, military, and aeronautics. The electronic packaging industry has seen an increase in the number of Pb-free solder alloy choices beyond the common near-eutectic Sn-Ag-Cu alloys first established as replacements for eutectic SnPb. This paper discusses the results from Pb-free solder joint reliability programs sponsored by two industry consortia. The characteristic life in accelerated thermal cycling is reported for 12 different Pb-free solder alloys and a SnPb control in 9 different accelerated thermal cycling test profiles in terms of the effects of component type, accelerated thermal cycling profile and dwell time. Microstructural analysis on assembled and failed samples was performed to investigate the effect of initial microstructure and its evolution during accelerated thermal cycling test. A significant finding from the study is that the beneficial effect of Ag on accelerated thermal cycling reliability (measured by characteristic lifetime) diminishes as the severity of the accelerated thermal cycling, defined by greater ΔT, higher peak temperature, and longer dwell time increases. The results also indicate that all the Pb-free solders are more reliable in accelerated thermal cycling than the SnPb alloy they have replaced. Suggestions are made for future work, particularly with respect to the continued evolution of alloy development for emerging application requirements and the value of using advanced analytical methods to provide a better understanding of the effect of microstructure and its evolution on accelerated thermal cycling performance.

  17. Solid protein solder-doped biodegradable polymer membranes for laser-assisted tissue repair

    Science.gov (United States)

    Hodges, Diane E.; McNally-Heintzelman, Karen M.; Welch, Ashley J.

    2000-05-01

    Solid protein solder-doped polymer membranes have been developed for laser-assisted tissue repair. Biodegradable polymer films of controlled porosity were fabricated with poly(L-lactic-co-glycolic acid) (PLGA) and poly(ethylene glycol) (PEG) using a solvent-casting and particulate-leaching technique. The films provided a porous scaffold that readily absorbed the traditional protein solder mix composed of bovine serum albumin (BSA) and indocyanine green (ICG) dye. In vitro investigations were conducted to assess the influence of various processing parameters on the strength of tissue repairs formed using the new membranes. These parameters included the PLGA copolymer and PLGA/PEG blend ratio, the salt particle size, the initial bovine serum albumin (BSA) weight fraction, and the laser irradiance used to denature the solder. Altering the PLGA copolymer ratio had little effect on repair strength, however, it influenced the membrane degradation rate. Repair strength increased with increased membrane pore size and BSA concentration. The addition of PEG during the film casting stage increased the flexibility of the membranes but not necessarily the repair strength. The repair strength increased with increasing irradiance from 12 W/cm2 to 15 W/cm2. The new solder-doped polymer membranes provide all of the benefits associated with solid protein solders including high repair strength and improved edge coaptation. In addition, the flexible and moldable nature of the new membranes offer the capability of tailoring the membranes to a wide range of tissue geometries, and consequently, improved clinical applicability of laser- assisted tissue repair.

  18. Soldered joints—an essential component of demountable high temperature superconducting fusion magnets

    Science.gov (United States)

    Tsui, Yeekin; Surrey, Elizabeth; Hampshire, Damian

    2016-07-01

    Demountable superconducting magnet coils would offer significant benefits to commercial nuclear fusion power plants. Whether large pressed joints or large soldered joints provide the solution for demountable fusion magnets, a critical component or building block for both will be the many, smaller-scale joints that enable the supercurrent to leave the superconducting layer, cross the superconducting tape and pass into the solder that lies between the tape and the conductor that eventually provides one of the demountable surfaces. This paper considers the electrical and thermal properties of this essential component part of demountable high temperature superconducting (HTS) joints by considering the fabrication and properties of jointed HTSs consisting of a thin layer of solder (In52Sn48 or Pb38Sn62) sandwiched between two rare-earth-Ba2Cu3O7 (REBCO) second generation HTS coated conductors (CCs). The HTS joints are analysed using numerical modelling, critical current and resistivity measurements on the joints from 300 to 4.2 K in applied magnetic fields up to 12 T, as well as scanning electron microscopy studies. Our results show that the copper/silver layers significantly reduce the heating in the joints to less than a few hundred mK. When the REBCO alone is superconducting, the joint resistivity (R J) predominantly has two sources, the solder layer and an interfacial resistivity at the REBCO/silver interface (∼25 nΩ cm2) in the as-supplied CCs which together have a very weak magnetoresistance in fields up to 12 T. We achieved excellent reproducibility in the R J of the In52Sn48 soldered joints of better than 10% at temperatures below T c of the REBCO layer which can be compared to variations of more than two orders of magnitude in the literature. We also show that demountable joints in fusion energy magnets are viable and need only add a few percent to the total cryogenic cost for a fusion tokamak.

  19. Surface Morphology Study of Nanostructured Lead-Free Solder Alloy Sn-Ag-Cu Developed by Electrodeposition: Effect of Current Density Investigation

    Directory of Open Access Journals (Sweden)

    Sakinah Mohd Yusof

    2013-10-01

    Full Text Available Normal 0 false false false IN X-NONE X-NONE MicrosoftInternetExplorer4 Nanostructured lead-free solder Sn-Ag-Cu (SAC was developed by electrodeposition method at room temperature. Electrolite bath which comprised of the predetermined quantity of tin methane sulfonate, copper sulfate and silver sulfate were added sequentially to MSA solution. The methane sulphonic acid (MSA based ternary Sn-Ag-Cu bath was developed by using tin methane sulfonate as a source of Sn ions while the Cu+ and Ag+ ions were obtained from their respective sulfate salts. The rate of the electrodeposition was controlled by variation of current density. The addition of the buffer, comprising of sodium and ammonium acetate helped in raising the pH solution. During the experimental procedure, the pH of solution, composition of the electrolite bath, and the electrodeposition time were kept constant. The electrodeposited rate, deposit composition and microstructure were investigated as the effect of current density. The electrodeposited solder alloy was characterized for their morphology using Field Emission Scanning Electron Microscope (FESEM. In conclusion, vary of current density will play significant role in the surface morphology of nanostructured lead-free solder SAC developed. Normal 0 false false false IN X-NONE X-NONE MicrosoftInternetExplorer4 /* Style Definitions */ table.MsoNormalTable {mso-style-name:"Table Normal"; mso-tstyle-rowband-size:0; mso-tstyle-colband-size:0; mso-style-noshow:yes; mso-style-priority:99; mso-style-qformat:yes; mso-style-parent:""; mso-padding-alt:0cm 5.4pt 0cm 5.4pt; mso-para-margin:0cm; mso-para-margin-bottom:.0001pt; mso-pagination:widow-orphan; font-size:11.0pt; font-family:"Calibri","sans-serif"; mso-ascii-font-family:Calibri; mso-ascii-theme-font:minor-latin; mso-fareast-font-family:"Times New Roman"; mso-fareast-theme-font:minor-fareast; mso-hansi-font-family:Calibri; mso-hansi-theme-font:minor-latin; mso-bidi-font-family:"Times New

  20. A case-based evaluation of SRD5A1, SRD5A2, AR, and ADRA1A as candidate genes for severity of BPH.

    Science.gov (United States)

    Klotsman, M; Weinberg, C R; Davis, K; Binnie, C G; Hartmann, K E

    2004-01-01

    In men with a clinical diagnosis of benign prostatic hyperplasia (BPH), polytomous logistic regression analysis was conducted to evaluate associations between two silent polymorphisms in SRD5A1 (codon positions 30 and 116), two polymorphisms in SRD5A2 (Val89Leu substitution and C to T transition in intron 1), a trinucleotide (CAG)n repeat in androgen receptor (AR), and an Arg492Cys substitution in ADRA1A and clinical parameters that characterize severity of BPH. Candidate gene selection was based on two mechanistic pathways targeted by pharmacotherapy for BPH: (1) androgen metabolic loci contributing to prostate growth (static obstruction); and (2) factors affecting smooth muscle tone (dynamic obstruction). Polymorphisms in SRD5A2 were not associated with severity of BPH; however, SRD5A1 polymorphisms were associated with severity of BPH. The process(es) in which these silent single-nucleotide polymorphisms (SNPs) influence BPH phenotypes is unknown and additional studies will be needed to assess whether these SNPs have direct functional consequences. The characterization of additional molecular factors that contribute to static and dynamic obstruction may help predict response to pharmacotherapy and serve to identify novel drug targets for the clinical management of BPH.