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Sample records for based solder candidates

  1. Development of gold based solder candidates for flip chip assembly

    DEFF Research Database (Denmark)

    Chidambaram, Vivek; Hald, John; Hattel, Jesper Henri

    2009-01-01

    Flip chip technology is now rapidly replacing the traditional wire bonding interconnection technology in the first level packaging applications due to the miniaturization drive in the microelectronics industry. Flip chip assembly currently involves the use of high lead containing solders...... for interconnecting the chip to a carrier in certain applications due to the unique properties of lead. Despite of all the beneficial attributes of lead, its potential environmental impact when the products are discarded to land fills has resulted in various legislatives to eliminate lead from the electronic products...... based on its notorious legacy as a major health hazard across the spectrum of human generations and cultures. Flip chip assembly is also now increasingly being used for the high-performance (H-P) systems. These H-P systems perform mission-critical operations and are expected to experience virtually...

  2. Assessment of potential solder candidates for high temperature applications

    DEFF Research Database (Denmark)

    of the package with different solders of different melting temperatures. High Pb containing alloys where the lead levels can be above 85% by weight, is one of the solders currently being used in this technology. Responding to market pressure i.e. need for green electronic products there is now an increasing...... complicates the corrosion problems. Although the cost of corrosion in the electronic sector could not be estimated, it has been suggested that a significant part of all electronic system failures are caused by corrosion. Thus, the determined potential solder candidates were classified based on its property...

  3. Au-Ge based Candidate Alloys for High-Temperature Lead-Free Solder Alternatives

    DEFF Research Database (Denmark)

    Chidambaram, Vivek; Hald, John; Hattel, Jesper Henri

    2009-01-01

    and reactivity of these alloying elements, characteristics of their intermetallic compounds (IMCs) and the distribution of phases. The primary strengthening mechanism in the case of Au-Ge-In and Au-Ge-Sn combinations was determined to be the classic solute atom strengthening. The Au-Ge-Sb combination...... was primarily strengthened by the refined (Ge) dispersed phase. The distribution of phases played a relatively more crucial role in determining the ductility of the bulk solder alloy. In the present work it was found that among the low melting point metals, the addition of Sb to the Au-Ge eutectic would...

  4. Development of Au-Ge based candidate alloys as an alternative to high-lead content solders

    DEFF Research Database (Denmark)

    Chidambaram, Vivek; Hald, John; Hattel, Jesper Henri

    2010-01-01

    in the case of the Au-Ge-In candidate alloy. The microhardness measurement is well correlated with the solubility and reactivity of these alloying elements, characteristics of their intermetallic compounds (IMCs) and the distribution of phases. The primary strengthening mechanism in the case of Au....... The distribution of phases played a relatively more crucial role in determining the ductility of the bulk solder alloy. The findings of this work are: the addition of Sb to the Au-Ge eutectic would not only decrease its melting point but would also improve its ductility substantially and the lattice strains...

  5. A Corrosion Investigation of Solder Candidates for High-Temperature Applications

    DEFF Research Database (Denmark)

    Chidambaram, Vivek; Hald, John; Ambat, Rajan;

    2009-01-01

    , corrosion investigation was carried out on potential ternary lead-free candidate alloys based on these binary alloys for high temperature applications. These promising ternary candidate alloys were determined by the CALPHAD approach based on the solidification criterion and the nature of the phases...... predicted in the bulk solder. This work reveals that the Au-Sn based candidate alloys close to the eutectic composition (20 wt. % Sn) are more corrosion resistant than the Au-Ge based ones....

  6. Creep behavior on Ag particle reinforced SnCu based composite solder joints

    Institute of Scientific and Technical Information of China (English)

    YAN Yan-fu; ZHU Jin-hong; CHEN Fu-xiao; HE Jun-guang; YANG Di-xin

    2006-01-01

    SnCu solder is one of the most promising substitutes of SnPb solder, but its creep resistance is worse than that of the other lead-free solders. Particle-reinforcement is a way to improve the creep resistance of solder alloys and cause much more attention than before. A novel Ag particles reinforced SnCu based composite solder is formed and the influence of stress on creep behavior of the composite solder is investigated. Results indicate that the creep resistance of solder joints is superior to that of the SnCu solder joints. Creep rupture lifetime of solder joints decreases gradually with stress increasing. And the creep rupture lifetime of the composite solder joints falls down faster than that of the matrix solder joints.

  7. Influence of Temperature on Creep Behavior of Ag Particle Enhancement SnCu Based Composite Solder

    Institute of Scientific and Technical Information of China (English)

    YAN Yanfu; FENG Lifang; ZHANG Keke; WEN Jiuba

    2007-01-01

    The creep properties of solder alloys are an important factor affecting the reliability of soldered joints in surface mount technologies. Particle-enhancement is one way to improve the properties of solder alloys. The temperature of the solder joint is one of the primary factors affecting the solder joint creep properties. Single shear lap creep specimens with a 1 mm2 cross-sectional area were fabricated using Ag particle enhancement 99.3Sn0.7Cu based composite solder and 99.3Sn0.7Cu eutectic solder to examine the influence of temperature on the creep behavior of solder joints. The results show that the solder joint creep resistance of the composite solder joint was generally superior to that of the 99.3Sn0.7Cu solder joint. The creep rupture life of the composite solder joint was reduced by increasing temperatures at a faster rate than that of the 99.3Sn0.7Cu eutectic solder joint.

  8. The Effect of Gap Angle on Tensile Strength of Preceramic Base Metal Solder Joints

    OpenAIRE

    Farnaz Fattahi; Zahra Hashemi Ardakani; Maryam Hashemi Ardakani

    2015-01-01

    Statement of the Problem: Soldering is a process commonly used in fabricating dental prosthesis. Since most soldered prosthesis fail at the solder joints; the joint strength is of utmost importance. Purpose: The purpose of this study was to evaluate the effect of gap angle on the tensile strength of base metal solder joints. Materials and Method: A total number of 40 Ni-Cr samples were fabricated according to ADA/ISO 9693 specifications for tensile test. Samples were cut at the midpoint...

  9. Nano copper based high temperature solder alternative

    Science.gov (United States)

    Sharma, Akshay

    Nano Cu an alternative to high temperature solder is developed by the Advance Technological Center at the Lockheed Martin Corporation. A printable paste of Cu nano particles is developed with an ability to fuse at 200°C in reflow oven. After reflow the deposited material has nano crystalline and nano porous structure which affects its properties. Accelerated test are performed on nano Cu deposition having nano porous and nano crystalline structure for assessment and prediction of reliability. Nano Cu assemblies with different bond layer thickness are sheared to calculate the strength of the material and are correlated with the porous and crystalline structure of nano Cu. Thermal and isothermal fatigue test are performed on nano Cu to see the dependency of life on stress and further surface of failed assemblies were observed to determine the type of failure. Creep test at RT are performed to find the type of creep mechanism and how they are affected when subjected to high temperature. TEM, SEM, X-ray, C-SAM and optical microscopy is done on the nano Cu sample for structure and surface analysis.

  10. The influence of temperature on creep behavior of Cu particle enhanced SnPb based composite soldered joints

    Institute of Scientific and Technical Information of China (English)

    Yan Yanfu; Yan Hongxing; Chen Fuxiao; Zhang Keke; Zhu Jinhong

    2007-01-01

    Creep property of solder alloys is one of the important factors to affect the reliability of soldered joints in SMT(surface mount technology). Particle-enhancement is a way to improve the properties of solder alloys and has caused much more attention than before. Temperatures applied to soldered joints are one of the primary factors of affecting creep properties of particle enhancement composite soldered joints. In this paper single shear lap creep specimens with a 1 mm2 cross-sectional area were fabricated using Cu particle enhancement 63Sn37Pb based composite soldered joints and 63Sn37Pb eutectic soldered joints to examine the influence of temperature on creep behavior of soldered joints. Results indicated that the creep resistance of soldered joints of Cu particle enhancement 63Sn37Pb based composite soldered joint was generally superior to that of the conventional 63Sn37Pb soldered joint. At the same time, creep rupture life of the composite soldered joint was declined with increasing temperature and drop faster than that of the conventional 63Sn37Pb eutectic soldered joint.

  11. Research on defects inspection of solder balls based on eddy current pulsed thermography.

    Science.gov (United States)

    Zhou, Xiuyun; Zhou, Jinlong; Tian, Guiyun; Wang, Yizhe

    2015-10-13

    In order to solve tiny defect detection for solder balls in high-density flip-chip, this paper proposed feasibility study on the effect of detectability as well as classification based on eddy current pulsed thermography (ECPT). Specifically, numerical analysis of 3D finite element inductive heat model is generated to investigate disturbance on the temperature field for different kind of defects such as cracks, voids, etc. The temperature variation between defective and non-defective solder balls is monitored for defects identification and classification. Finally, experimental study is carried on the diameter 1mm tiny solder balls by using ECPT and verify the efficacy of the technique.

  12. Research on Defects Inspection of Solder Balls Based on Eddy Current Pulsed Thermography

    Directory of Open Access Journals (Sweden)

    Xiuyun Zhou

    2015-10-01

    Full Text Available In order to solve tiny defect detection for solder balls in high-density flip-chip, this paper proposed feasibility study on the effect of detectability as well as classification based on eddy current pulsed thermography (ECPT. Specifically, numerical analysis of 3D finite element inductive heat model is generated to investigate disturbance on the temperature field for different kind of defects such as cracks, voids, etc. The temperature variation between defective and non-defective solder balls is monitored for defects identification and classification. Finally, experimental study is carried on the diameter 1mm tiny solder balls by using ECPT and verify the efficacy of the technique.

  13. Fast formation and growth of high-density Sn whiskers in Mg/Sn-based solder/Mg joints by ultrasonic-assisted soldering: Phenomena, mechanism and prevention.

    Science.gov (United States)

    Li, M Y; Yang, H F; Zhang, Z H; Gu, J H; Yang, S H

    2016-01-01

    A universally applicable method for promoting the fast formation and growth of high-density Sn whiskers on solders was developed by fabricating Mg/Sn-based solder/Mg joints using ultrasonic-assisted soldering at 250 °C for 6 s and then subjected to thermal aging at 25 °C for 7 d. The results showed that the use of the ultrasonic-assisted soldering could produce the supersaturated dissolution of Mg in the liquid Sn and lead to the existence of two forms of Mg in Sn after solidification. Moreover, the formation and growth of the high-density whiskers were facilitated by the specific contributions of both of the Mg forms in the solid Sn. Specifically, interstitial Mg can provide the persistent driving force for Sn whisker growth, whereas the Mg2Sn phase can increase the formation probability of Sn whiskers. In addition, we presented that the formation and growth of Sn whiskers in the Sn-based solders can be significantly restricted by a small amount of Zn addition (≥3 wt.%), and the prevention mechanisms are attributed to the segregation of Zn atoms at grain or phase boundaries and the formation of the lamellar-type Zn-rich structures in the solder. PMID:27273421

  14. Mechanical property of the epoxy-contained Sn–58Bi solder with OSP surface finish

    International Nuclear Information System (INIS)

    Highlights: • We studied the improved bonding properties of the Sn–58Bi epoxy solder. • We evaluated the mechanical properties compared no surface finished and OSP surface finished on the Cu substrate. • The Sn–58Bi solder with epoxy exhibited the higher value of shear strength than that of Sn–58Bi solder. • The epoxy solder of OSP finished sample showed higher number of drops than other conditions. - Abstract: In the electronic packaging technology, lead-free solders have been widely used to replace lead-based solders because of the toxicity of lead. Among the investigated lead-free solders, the Sn–58Bi solder has been considered as a highly promising candidate because of its low-melting temperature, high tensile strength and good creep resistance. However, the Sn–58Bi solder has poor ductility and shock absorbance. To enhance the mechanical properties of the Sn–58Bi solder, epoxy resin is mixed with the Sn–58Bi solder. The advantages of the Sn–58Bi solder with epoxy are good reliability and no need of a cleaning process. This study elucidated not only the mechanical properties of the Sn–58Bi epoxy solder but also the effects of the epoxy during the reflow process by conducting a shear test and a board-level drop test. The shear strength of the Sn–58Bi epoxy solder was about 2 times higher than that of the Sn–58Bi solder. In result of the drop test, the Sn–58Bi solder specimen failed under the 10th drop. However, the number of drops of the Sn–58Bi epoxy solder was over 100 drops without failure

  15. Mechanical property of the epoxy-contained Sn–58Bi solder with OSP surface finish

    Energy Technology Data Exchange (ETDEWEB)

    Myung, Woo-Ram [SKKU Advanced Institute of Nanotechnology (SAINT), Sungkyunkwan University, 300 Cheoncheon-dong, Jangan-gu, Suwon 440-746 (Korea, Republic of); Kim, Yongil [Micro Electronic Packaging Laboratory, Sungkyunkwan University, 300 Cheoncheon-dong, Jangan-gu, Suwon 440-746 (Korea, Republic of); Jung, Seung-Boo, E-mail: sbjung@skku.edu [School of Advanced Materials Science and Engineering, Sungkyunkwan University, 300 Cheoncheon-dong, Jangan-gu, Suwon 440-746 (Korea, Republic of)

    2014-12-05

    Highlights: • We studied the improved bonding properties of the Sn–58Bi epoxy solder. • We evaluated the mechanical properties compared no surface finished and OSP surface finished on the Cu substrate. • The Sn–58Bi solder with epoxy exhibited the higher value of shear strength than that of Sn–58Bi solder. • The epoxy solder of OSP finished sample showed higher number of drops than other conditions. - Abstract: In the electronic packaging technology, lead-free solders have been widely used to replace lead-based solders because of the toxicity of lead. Among the investigated lead-free solders, the Sn–58Bi solder has been considered as a highly promising candidate because of its low-melting temperature, high tensile strength and good creep resistance. However, the Sn–58Bi solder has poor ductility and shock absorbance. To enhance the mechanical properties of the Sn–58Bi solder, epoxy resin is mixed with the Sn–58Bi solder. The advantages of the Sn–58Bi solder with epoxy are good reliability and no need of a cleaning process. This study elucidated not only the mechanical properties of the Sn–58Bi epoxy solder but also the effects of the epoxy during the reflow process by conducting a shear test and a board-level drop test. The shear strength of the Sn–58Bi epoxy solder was about 2 times higher than that of the Sn–58Bi solder. In result of the drop test, the Sn–58Bi solder specimen failed under the 10th drop. However, the number of drops of the Sn–58Bi epoxy solder was over 100 drops without failure.

  16. Effects of Ga Addition on Interfacial Reactions Between Sn-Based Solders and Ni

    Science.gov (United States)

    Wang, Chao-Hong; Li, Kuan-Ting

    2016-07-01

    The use of Ga as a micro-alloying element in Sn-based solders can change the microstructure of solder joints to improve the mechanical properties, and even suppress the interfacial intermetallic compound (IMC) growth. This research investigated the effects of Ga addition (0.2-1 wt.%Ga) on the IMC formation and morphological evolution in the Sn-based solder joints with Ni substrate. In the soldering reaction at 250°C and with less than 0.2 wt.%Ga addition, the formed phase was Ni3Sn4. When the Ga addition increased to 0.5 wt.%, it changed to a thin Ni2Ga3 layer of ˜1 μm thick, which stably existed at the interface in the initial 1-h reaction. Subsequently, the whole Ni2Ga3 layer detached from the Ni substrate and drifted into the molten solder. The Ni3Sn4 phase became dominant in the later stage. Notably, the Ga addition significantly reduced the grain size of Ni3Sn4, resulting in the massive spalling of Ni3Sn4 grains. With 1 wt.%Ga addition, the Ni2Ga3 layer remained very thin with no significant growth, and it stably existed at the interface for more than 10 h. In addition, the solid-state reactions were examined at temperatures of 160°C to 200°C. With addition of 0.5 wt.%Ga, the Ni3Sn4 phase dominated the whole reaction. By contrast, with increasing to 1 wt.%Ga, only a thin Ni2Ga3 layer was found even after aging at 160°C for more than 1200 h. The 1 wt.%Ga addition in solder can effectively inhibit the Ni3Sn4 formation in soldering and the long-term aging process.

  17. Research and application of visual location technology for solder paste printing based on machine vision

    Institute of Scientific and Technical Information of China (English)

    Luosi WEI; Zongxia JIAO

    2009-01-01

    A location system is very important for solder paste printing in the process of surface mount technology (SMT). Using machine vision technology to complete the location mission is new and very efficient. This paper presents an integrated visual location system for solder paste printing based on machine vision. The working principle of solder paste printing is introduced and then the design and implementation of the visual location system are described. In the system, two key techniques are completed by secondary development based on VisionPro.One is accurate image location solved by the pattern-based location algorithms of PatMax. The other one is camera calibration that is achieved by image warping technology through the checkerboard plate. Moreover, the system can provide good performances such as high image locating accuracy with 1/40 sub-pixels, high anti-jamming, and high-speed location of objects whose appearance is rotated, scaled, and/or stretched.

  18. Soldering handbook

    CERN Document Server

    Vianco, Paul T

    1999-01-01

    Contains information related to soldering processes, and solder joint performance and reliability. Covers soldering fundamentals, technology, materials, substrate materials, fluxes, pastes, assembly processes, inspection, and environment. Covers today's advanced joining applications and emphasizes new materials, including higher strength alloys; predictive performance; computer modeling; advanced inspection techniques; new processing concepts, including laser heating; and the resurgence in ultrasonic soldering.

  19. Study on solder joint reliability of ceramic ball grid array component based on design of experiment method

    Institute of Scientific and Technical Information of China (English)

    Wu Zhaohua; Huang Chunyue; Zhou Dejian

    2006-01-01

    Four process parameters, pad diameter, stencil thickness, ball diameter and stand-off were chosen as four control factors.By using an L25 ( 56 ) orthogonal array the ceramic ball grid array ( CBGA ) solder joints which have 25 different combinations of process parameters were designed.The numerical models of all the 25 CBGA solder joints were developed using the Surface Evolver.Utilizing the surface coordinate exported from the 25 CBGA solder joints numerical models, the finite element analysis models were set up and the nonlinear finite element analysis of the CBGA solder joints under thermal cycles were performed by ANSYS.The thermal fatigne life of CBGA solder joint was calculated using Coffin-Manson equation.Based on the calculated thermal fatigue life results, the range analysis and the variance analysis were performed.The results show that the fatigue life of CBGA solder joint is affected by the pad diameter, the stencil thickness, the ball diameter and the standoff in a descending order, the best combination of process parameters results in the longest fatigue life is 0.07 mm stand-off,0.125 mm stencil thickness of, 0.85 mm ball diameter and 0.89 mm pad diameter.With 95% confidence the pad diameter has a significant effect on the reliability of CBGA solder joints whereas the stand-off, the stencil thickness and the ball diameter have little effect on the reliability of CBGA solder joints.

  20. Cross-border impacts of the restriction of hazardous substances: a perspective based on Japanese solders.

    Science.gov (United States)

    Fuse, Masaaki; Tsunemi, Kiyotaka

    2013-08-20

    Despite the relevance of the global economy, Regulatory Impact Assessments of the restriction of hazardous substances (RoHS) in the European Union (EU) are based only on domestic impacts. This paper explores the cross-border environmental impacts of the RoHS by focusing on the shifts to lead-free solders in Japan, which exports many electronics to the EU. The regulatory impacts are quantified by integrating a material flow analysis for metals constituting a solder with a scenario analysis with and without the RoHS. The results indicate that the EU regulation, the RoHS, has triggered shifts in Japan to lead-free solders, not only for electronics subject to this regulation, but for other products as well. We also find that the RoHS leads to a slow reduction in environmental emissions of the target, lead, but results in a rapid increase in the use of tin and silver in lead-free solders. This indicates the importance of assessing potential alternative substances, the use of which may increase as a result of adhering to the RoHS. The latter constitutes a negative impact because of recent concerns regarding resource criticality. PMID:23875815

  1. Low-strain laser-based solder joining of mounted lenses

    Science.gov (United States)

    Burkhardt, Thomas; Hornaff, Marcel; Kamm, Andreas; Burkhardt, Diana; Schmidt, Erik; Beckert, Erik; Eberhardt, Ramona; Tünnermann, Andreas

    2015-09-01

    A novel laser-based soldering technique - Solderjet Bumping - using liquid solder droplets in a flux-free process with only localized heating is presented. We demonstrate an all inorganic, adhesive free bonding of optical components and support structures suitable for optical assemblies and instruments under harsh environmental conditions. Low strain bonding suitable for a following high-precision adjustment turning process is presented, addressing components and subsystems for objectives for high power and short wavelengths. The discussed case study shows large aperture transmissive optics (diameter approx. 74 mm and 50 mm) made of fused silica and LAK9G15, a radiation resistant glass, bonded to thermally matched metallic mounts. The process chain of Solderjet Bumping - cleaning, solderable metallization, handling, bonding and inspection - is discussed. This multi-material approach requires numerical modelling for dimensioning according to thermal and mechanical loads. The findings of numerical modelling, process parametrization and environmental testing (thermal and vibrational loads) are presented. Stress and strain introduced into optical components as well as deformation of optical surfaces can significantly deteriorate the wave front of passing light and therefore reduce system performance significantly. The optical performance with respect to stress/strain and surface deformation during bonding and environmental testing were evaluated using noncontact and nondestructive optical techniques: polarimetry and interferometry, respectively. Stress induced surface deformation of less than 100 nm and changes in optical path difference below 5 nm were achieved. Bond strengths of about 55 MPa are reported using tin-silver-copper soft solder alloy.

  2. Solder poisoning

    Science.gov (United States)

    ... occurs when someone swallows solder in large amounts. Skin burns can occur if solder touches the skin. This ... the effect of the poison Surgery to remove burned skin Tube through the mouth into the stomach to ...

  3. High-temperature lead-free solder alternatives

    DEFF Research Database (Denmark)

    Nachiappan, Vivek Chidambaram; Hattel, Jesper Henri; Hald, John

    2011-01-01

    For lead-free solders in the high-temperature regime, unfortunately, a limited number of alloying systems are available. These are Bi based alloys, gold involving alloys and Zn–Al based alloys. Based on these systems, possible candidate alloys were designed to have a melting range between 270°C and...... 350°C. Each has its own superior characteristics as well as some drawbacks however none of them can fulfill all the requirements to replace the current high-lead content solders. Even the alternative technologies that are currently being developed cannot address several critical issues of high......-temperature soldering. Therefore, further research and development of high-temperature lead-free soldering is obviously needed....

  4. Structural and mechanical characteristics of some lead-free Cu-Sn based solder alloys

    OpenAIRE

    Mitovski Aleksandra M.; Balanović Ljubiša T.; Živković Dragana T.; Marjanović Šaša R.; Marjanović Bata R.; Novaković Slađana O.

    2008-01-01

    The results of structural and mechanical characteristics of lead-free Cu-Sn based solder alloys, produced in Company "11. mart" AD Srebrenica (Republic of Srpska), are presented in this paper. The results of investigation of samples - alloys CuSnl4, CuSnlFelAlO.5, CuSnlOFelAllMnO.5 and CuA110Fe3Mn produced by different processing methods, include the data obtained by optical microscopy and measurements of hardness, micro hardness and electroconductivity, in order to characterize mentioned all...

  5. Development of new multicomponent Sn–Ag–Cu–Bi lead-free solders for low-cost commercial electronic assembly

    International Nuclear Information System (INIS)

    Highlights: • Small amounts of Bi have been added into Sn–1.5Ag–0.7Cu solder. • Bi reduced the undercooling and eutectic temperature of SAC257 solder. • Bi refined the microstructure and diminishes the nucleation rate of IMCs. • Bi increased the creep resistance and fracture lifetime of the solder. • Overall SAC properties can be improved adding not more than 3 wt.% Bi. - Abstract: Eutectic Sn–Ag–Cu (SAC) solder is one of the candidate alternatives to Sn–Pb-based solder alloys. The coupling effect of both minor alloying Bi addition and reducing the amount of Ag phase have been proposed as an important approach to optimize existing and to develop new SAC solders. Characteristics of new Sn–Ag–Cu–Bi solders were analyzed and compared with those of as-solidified Sn–1.5Ag–0.7Cu (SAC157) alloy. The results of differential scanning calorimetry (DSC) indicate significant reduction of both undercooling, eutectic temperature, solidus and liquidus temperatures with the addition of Bi into SAC(157) solder, although the pasty range remains the same or slightly increased. Moreover, SAC(157) solders containing Bi were found to have a higher creep resistance (126.1 times) than SAC(157) solder at the same stress level and testing temperature. The higher creep resistance was contributed by the solid solution and precipitations strengthen effects of Bi. The precipitation of these Bi atoms or particles can significantly refine the microstructure, blocks the movement of dislocations and increases the creep resistance of Bi-containing solders. The creep life time of plain SAC(157) alloy was extremely enlarged 23.7 times with the addition of 3 wt.% Bi. Constitutive Garofalo model of creep for both SAC(157) and Sn–Ag–Cu–Bi solders was assembled based on the experimental data

  6. Development of new multicomponent Sn–Ag–Cu–Bi lead-free solders for low-cost commercial electronic assembly

    Energy Technology Data Exchange (ETDEWEB)

    El-Daly, A.A., E-mail: dreldaly11@yahoo.com [Physics Department, Faculty of Science, Zagazig Univ., Zagazig (Egypt); Center of Nanotechnology, Zagazig Univ., Zagazig (Egypt); El-Taher, A.M. [Physics Department, Faculty of Science, Zagazig Univ., Zagazig (Egypt); Center of Nanotechnology, Zagazig Univ., Zagazig (Egypt); Gouda, S. [Physics Department, Faculty of Science, Zagazig Univ., Zagazig (Egypt)

    2015-04-05

    Highlights: • Small amounts of Bi have been added into Sn–1.5Ag–0.7Cu solder. • Bi reduced the undercooling and eutectic temperature of SAC257 solder. • Bi refined the microstructure and diminishes the nucleation rate of IMCs. • Bi increased the creep resistance and fracture lifetime of the solder. • Overall SAC properties can be improved adding not more than 3 wt.% Bi. - Abstract: Eutectic Sn–Ag–Cu (SAC) solder is one of the candidate alternatives to Sn–Pb-based solder alloys. The coupling effect of both minor alloying Bi addition and reducing the amount of Ag phase have been proposed as an important approach to optimize existing and to develop new SAC solders. Characteristics of new Sn–Ag–Cu–Bi solders were analyzed and compared with those of as-solidified Sn–1.5Ag–0.7Cu (SAC157) alloy. The results of differential scanning calorimetry (DSC) indicate significant reduction of both undercooling, eutectic temperature, solidus and liquidus temperatures with the addition of Bi into SAC(157) solder, although the pasty range remains the same or slightly increased. Moreover, SAC(157) solders containing Bi were found to have a higher creep resistance (126.1 times) than SAC(157) solder at the same stress level and testing temperature. The higher creep resistance was contributed by the solid solution and precipitations strengthen effects of Bi. The precipitation of these Bi atoms or particles can significantly refine the microstructure, blocks the movement of dislocations and increases the creep resistance of Bi-containing solders. The creep life time of plain SAC(157) alloy was extremely enlarged 23.7 times with the addition of 3 wt.% Bi. Constitutive Garofalo model of creep for both SAC(157) and Sn–Ag–Cu–Bi solders was assembled based on the experimental data.

  7. Solder joint technology materials, properties, and reliability

    CERN Document Server

    Tu, King-Ning

    2007-01-01

    Solder joints are ubiquitous in electronic consumer products. The European Union has a directive to ban the use of Pb-based solders in these products on July 1st, 2006. There is an urgent need for an increase in the research and development of Pb-free solders in electronic manufacturing. For example, spontaneous Sn whisker growth and electromigration induced failure in solder joints are serious issues. These reliability issues are quite complicated due to the combined effect of electrical, mechanical, chemical, and thermal forces on solder joints. To improve solder joint reliability, the science of solder joint behavior under various driving forces must be understood. In this book, the advanced materials reliability issues related to copper-tin reaction and electromigration in solder joints are emphasized and methods to prevent these reliability problems are discussed.

  8. Soldering in electronics assembly

    CERN Document Server

    Judd, Mike

    2013-01-01

    Soldering in Electronics Assembly discusses several concerns in soldering of electronic assemblies. The book is comprised of nine chapters that tackle different areas in electronic assembly soldering. Chapter 1 discusses the soldering process itself, while Chapter 2 covers the electronic assemblies. Chapter 3 talks about solders and Chapter 4 deals with flux. The text also tackles the CS and SC soldering process. The cleaning of soldered assemblies, solder quality, and standards and specifications are also discussed. The book will be of great use to professionals who deal with electronic assem

  9. The Lead-Free Solder Selection Method and Process Optimization Based on Design of Experiment

    Directory of Open Access Journals (Sweden)

    Wang Bing

    2013-07-01

    Full Text Available In the study, through researching the characteristic of the lead-free solder, we introduce the method of QFD (Quality Function Deployment to transform the demand of production properties and process into the technical demand of the lead-free solder, thus we could transform the demand concept of sampling into a concrete performance index. Finally we can obtain two parameters of the technological competitive power index and market competitive power index to evaluate performance of the lead-free solder through making a series of experiments. We utilize the design of experiment method to find out key parameter of process and the best collocation of parameter, which make the co planarity of tin ball descend to 149 from 178 and promote the process’s ability up to 95.2 from 85%.

  10. Size effects in tin-based lead-free solder joints: Kinetics of bond formation and mechanical characteristics

    Science.gov (United States)

    Abdelhadi, Ousama Mohamed Omer

    Continuous miniaturization of microelectronic interconnects demands smaller joints with comparable microstructural and structural sizes. As the size of joints become smaller, the volume of intermetallics (IMCs) becomes comparable with the joint size. As a result, the kinetics of bond formation changes and the types and thicknesses of IMC phases that form within the constrained region of the bond varies. This dissertation focuses on investigating combination effects of process parameters and size on kinetics of bond formation, resulting microstructure and the mechanical properties of joints that are formed under structurally constrained conditions. An experiment is designed where several process parameters such as time of bonding, temperature, and pressure, and bond thickness as structural chracteristic, are varied at multiple levels. The experiment is then implemented on the process. Scanning electron microscope (SEM) is then utilized to determine the bond thickness, IMC phases and their thicknesses, and morphology of the bonds. Electron backscatter diffraction (EBSD) is used to determine the grain size in different regions, including the bulk solder, and different IMC phases. Physics-based analytical models have been developed for growth kinetics of IMC compounds and are verified using the experimental results. Nanoindentation is used to determine the mechanical behavior of IMC phases in joints in different scales. Four-point bending notched multilayer specimen and four-point bending technique were used to determine fracture toughness of the bonds containing IMCs. Analytical modeling of peeling and shear stresses and fracture toughness in tri-layer four-point bend specimen containing intermetallic layer was developed and was verified and validated using finite element simulation and experimental results. The experiment is used in conjunction with the model to calculate and verify the fracture toughness of Cu6Sn5 IMC materials. As expected two different IMC phases

  11. Thermo-mechanical investigations on the effects of the solder meniscus design in solder joint lifetime for power electronic devices

    OpenAIRE

    BOUARROUDJ, M; KHATIR, Z; Lefebvre, S.; L. Dupont

    2007-01-01

    The crack and delamination of solder joints between base plates and DCB substrates of power modules is one of the most frequently encountered failure mode and studied in literature. In this paper we present numerical effects of solder meniscus design in solder lifetime prediction. Especially, we show the effect of singular points, which appear in the border edges or corners of DCB or solder joints geometries, in mechanical stress, strain and plastic work evaluations. Furthermore the effect of...

  12. Coplanarity inspection of BGA solder balls based on laser interference structure light

    Science.gov (United States)

    Wei, Zhe; Xiao, Zexin; Zhang, Xuefei; Zhou, Haiying

    2011-11-01

    Using laser interference structure light for profilometry is a rapid, non-contact, full-field profile and high accuracy measuring method.And it has been a promising technique in complicated geometrical shape measurement. In this paper, a fast and cost-effective measurement method of coplanarity inspection of ball grid array (BGA) solder balls is proposed. Laser interference structure light can be obtained by using the principle of shearing interferometry. The collimated and beam expanded laser produced interference fringe by the high reflection rate optical flat. After laser interference fringe project on the surface of object and the structured light would modulated. The light signal pass through the image optical grabber and captured by the CCD image sensor. The height of each point on object can be demodulated by the imaging processing software.This method to construct the measurement appliance for coplanarity inspection of ball grid array (BGA) chip solder ball. Experiments have shown that the coplanarity measurement of BGA solder balls is very efficient and effective with the measurement. The measurement accuracy achieve micrometer level. The processing time of the measurement accuracy is less than 3s on a personal computer. This measurement appliance could completely meet the demand of measure.

  13. Soldered solar arrays

    Science.gov (United States)

    Allen, H. C.

    1982-06-01

    The ability of soldered interconnects to withstand a combination of long life and severe environmental conditions was investigated. Improvements in joint life from the use of solder mixes appropriate to low temperature conditons were studied. Solder samples were placed in a 150 C oven for 5 weeks (= 12 yr at 80 C, or 24 at 70 C according to Arrhenius's rule). Conventional and high solder melting point array samples underwent 1000 thermal cycles between -186 and 100 C. Results show that conventional and lead rich soldered arrays can survive 10 yr geostationary orbit missions.

  14. Comparisons of Mechanical Properties of sub-mm Lead Based and Lead Free Based Solder Using in Manufacturing of Printed Circuits

    OpenAIRE

    Alaa Hasan Ali

    2014-01-01

    This study investigates the mechanical compression properties of tin-lead and lead-free alloy spherical balls, using more than 500 samples to identify statistical variability in the properties in each alloy. Isothermal aging was done to study and compare the aging effect on the microstructure and properties. The results showed significant elastic and plastic anisotropy of tin phase in lead-free tin based solder and that was compared with simulation using a Crystal Plasticity Finite Element (C...

  15. Solder Joint Health Monitoring Testbed

    Science.gov (United States)

    Delaney, Michael M.; Flynn, James G.; Browder, Mark E.

    2009-01-01

    A method of monitoring the health of selected solder joints, called SJ-BIST, has been developed by Ridgetop Group Inc. under a Small Business Innovative Research (SBIR) contract. The primary goal of this research program is to test and validate this method in a flight environment using realistically seeded faults in selected solder joints. An additional objective is to gather environmental data for future development of physics-based and data-driven prognostics algorithms. A test board is being designed using a Xilinx FPGA. These boards will be tested both in flight and on the ground using a shaker table and an altitude chamber.

  16. Solder flow over fine line PWB surface finishes

    Energy Technology Data Exchange (ETDEWEB)

    Hosking, F.M.; Hernandez, C.L.

    1998-08-01

    The rapid advancement of interconnect technology has stimulated the development of alternative printed wiring board (PWB) surface finishes to enhance the solderability of standard copper and solder-coated surfaces. These new finishes are based on either metallic or organic chemistries. As part of an ongoing solderability study, Sandia National Laboratories has investigated the solder flow behavior of two azole-based organic solderability preservations, immersion Au, immersion Ag, electroless Pd, and electroless Pd/Ni on fine line copper features. The coated substrates were solder tested in the as-fabricated and environmentally-stressed conditions. Samples were processed through an inerted reflow machine. The azole-based coatings generally provided the most effective protection after aging. Thin Pd over Cu yielded the best wetting results of the metallic coatings, with complete dissolution of the Pd overcoat and wetting of the underlying Cu by the flowing solder. Limited wetting was measured on the thicker Pd and Pd over Ni finishes, which were not completely dissolved by the molten solder. The immersion Au and Ag finishes yielded the lowest wetted lengths, respectively. These general differences in solderability were directly attributed to the type of surface finish which the solder came in contact with. The effects of circuit geometry, surface finish, stressing, and solder processing conditions are discussed.

  17. Soldering-based easy packaging of thin polyimide multichannel electrodes for neuro-signal recording

    Science.gov (United States)

    Baek, Dong-Hyun; Han, Chang-Hee; Jung, Ha-Chul; Kim, Seon Min; Im, Chang-Hwan; Oh, Hyun-Jik; Jungho Pak, James; Lee, Sang-Hoon

    2012-11-01

    We propose a novel packaging method for preparing thin polyimide (PI) multichannel microelectrodes. The electrodes were connected simply by making a via-hole at the interconnection pad of a thin PI electrode, and a nickel (Ni) ring was constructed by electroplating through the via-hole to permit stable soldering with strong adhesion to the electrode and the printed circuit board. The electroplating conditions were optimized for the construction of a well-organized Ni ring. The electrical properties of the packaged electrode were evaluated by fabricating and packaging a 40-channel thin PI electrode. Animal experiments were performed using the packaged electrode for high-resolution recording of somatosensory evoked potential from the skull of a rat. The in vivo and in vitro tests demonstrated that the packaged PI electrode may be used broadly for the continuous measurement of bio-signals or for neural prosthetics.

  18. A thermodynamics based damage mechanics framework for fatigue analysis of microelectronics solder joints with size effects

    Science.gov (United States)

    Gomez, Juan

    Experimental observations of an increase in resistance with decreasing specimen size and under the presence of non-uniform plastic deformation fields have pushed the development for small scale plasticity theories since the early 90's. The observed phenomenon has been explained in terms of an accumulation of a density of geometrically necessary dislocations, which is required in order to accommodate nonuniform plastic deformation fields. This extra density of dislocations, contributes to the additional hardening observed in small scale specimens under imposed non-uniform plastic deformations. The density of geometrically necessary dislocations has been related to the gradients of plastic strain which are imposed either by the loading conditions or the geometry of the specimen. The proposed set of theories has promoted the idea that there is an additional material parameter, namely a plastic length scale. Within these theories when the material is under the presence of a non-uniform plastic deformation field and once typical structural dimensions approaches the material length scale there is an increase in resistance. Such a class of mathematical framework is currently known as strain gradient plasticity (SGP) theory. On the other hand, the current trend towards miniaturization in the microelectronics industry has raised questions about the true behavior of small structural systems. In this dissertation we address such a problem but from the perspective of eutectic solder alloys. Eutectic solder alloys as frequently used in the microelectronics industry exhibit considerable rate dependent response even at room temperature. Moreover for this type of material, the problem of interest is the response under cyclic loadings induced by thermomechanical fatigue leading to the classical case of creep-fatigue interaction. Several experimental and theoretical studies have been developed in order to generate robust constitutive descriptions for this class of applications. For

  19. In situ measurement of electromigration-induced transient stress in Pb-free Sn-Cu solder joints by synchrotron radiation based X-ray polychromatic microdiffraction

    OpenAIRE

    CHEN, KAI

    2011-01-01

    Electromigration-induced hydrostatic elastic stress in Pb-free SnCu solder joints was studied by in situ synchrotron X-ray white beam microdiffraction. The elastic stresses in two different grains with similar crystallographic orientation, one located at the anode end and the other at the cathode end, were analyzed based on the elastic anisotropy of the Beta-Sn crystal structure. The stress in the grain at the cathode end remained constant except for temperature fluctuations, while the compre...

  20. Thermal Analysis of the Sn-Ag-Cu-In Solder Alloy

    DEFF Research Database (Denmark)

    Sopousek, J.; Palcut, Marián; Hodúlová, Erika;

    2010-01-01

    The tin-based alloy Sn-1.5Ag-0.7Cu-9.5In (composition in wt.%) is a potential candidate for lead-free soldering at temperatures close to 200°C due to the significant amount of indium. Samples of Sn-1.5Ag-0.7Cu-9.5In were prepared by controlled melting of the pure elements, followed by quenching t...

  1. Characterization of Low-Melting-Point Sn-Bi-In Lead-Free Solders

    Science.gov (United States)

    Li, Qin; Ma, Ninshu; Lei, YongPing; Lin, Jian; Fu, HanGuang; Gu, Jian

    2016-11-01

    Development of lead-free solders with low melting temperature is important for substitution of Pb-based solders to reduce direct risks to human health and the environment. In the present work, Sn-Bi-In solders were studied for different ratios of Bi and Sn to obtain solders with low melting temperature. The microstructure, thermal properties, wettability, mechanical properties, and reliability of joints with Cu have been investigated. The results show that the microstructures of the Sn-Bi-In solders were composed of β-Sn, Bi, and InBi phases. The intermetallic compound (IMC) layer was mainly composed of Cu6Sn5, and its thickness increased slightly as the Bi content was increased. The melting temperature of the solders was around 100°C to 104°C. However, when the Sn content exceeded 50 wt.%, the melting range became larger and the wettability became worse. The tensile strength of the solder alloys and solder joints declined with increasing Bi content. Two fracture modes (IMC layer fracture and solder/IMC mixed fracture) were found in solder joints. The fracture mechanism of solder joints was brittle fracture. In addition, cleavage steps on the fracture surface and coarse grains in the fracture structure were comparatively apparent for higher Bi content, resulting in decreased elongation for both solder alloys and solder joints.

  2. Oxidation and reduction kinetics of eutectic SnPb, InSn, and AuSn: a knowledge base for fluxless solder bonding applications

    DEFF Research Database (Denmark)

    Kuhmann, Jochen Friedrich; Preuss, A.; Adolphi, B.;

    1998-01-01

    For microelectronics and especially for upcoming new packaging technologies in micromechanics and photonics fluxless, reliable and economic soldering technologies are needed. In this article, we consequently focus on the oxidation and reduction kinetics of three commonly used eutectic solder allo...

  3. Reliability of Sn-3.5Ag Solder Joints in High Temperature Packaging Applications

    Energy Technology Data Exchange (ETDEWEB)

    Muralidharan, Govindarajan [ORNL; Kurumaddali, Nalini Kanth [ORNL; Kercher, Andrew K [ORNL; Leslie, Dr Scott [Powerex Inc

    2010-01-01

    There is a significant need for next generation, high performance power electronic packages and systems with wide band gap devices to operate at high temperatures in automotive and electricity transmission applications. Sn-3.5Ag solder is a candidate for use in such packages with potential operating temperatures up to 200oC. However, there is a need to understand thermal cycling reliability of Sn-3.5Ag solders subject to such operating conditions. The results of a study on the damage evolution occurring in large area Sn-3.5Ag solders joints between silicon dies and DBC substrates subject to thermal cycling between 200oC and 5oC is presented in this paper. Damage accumulation was followed using high resolution X-ray radiography techniques while nonlinear finite element models were developed based on the mechanical property data available in literature to understand the relationship between the stress state within the solder joint and the damage evolution occurring under thermal cycling conditions. It was observed that regions of damage observed in the experiments do not correspond to the finite element predictions of the location of regions of maximum plastic work.

  4. Oxidation and reduction kinetics of eutectic SnPb, InSn, and AuSn: a knowledge base for fluxless solder bonding applications

    OpenAIRE

    Kuhmann, Jochen Friedrich; Preuss, A.; Adolphi, B.; K. Maly; Wirth, T.; Oesterle, W.; Pittroff, W.; Weyer, G.; Fanciulli, M.

    1998-01-01

    For microelectronics and especially for upcoming new packaging technologies in micromechanics and photonics fluxless, reliable and economic soldering technologies are needed. In this article, we consequently focus on the oxidation and reduction kinetics of three commonly used eutectic solder alloys: (1) SnPb; (2) InSn; (3) AuSn. The studies of the oxidation kinetics show that the growth of the native oxide, which covers the solder surfaces from the start of all soldering operations is self-li...

  5. Optimization of the Ni(P) Thickness for an Ultrathin Ni(P)-Based Surface Finish in Soldering Applications

    Science.gov (United States)

    Ho, C. E.; Wang, S. J.; Fan, C. W.; Wu, W. H.

    2014-01-01

    The effects of the Ni(P) thickness δ Ni(P) on the interfacial reaction between an Sn-3Ag-0.5Cu solder and an Au/Pd(P)/Ni(P)/Cu pad (thickness: 0.05/0.05/0.1-0.3/20 μm) and the resulting mechanical properties were investigated using scanning electron microscopy equipped with an electron backscatter diffraction system, a focused ion beam system, electron probe microanalysis, and high-speed ball shear (HSBS) testing. Regardless of δ Ni(P), all of the Au/Pd(P)/Ni(P) surface finishes examined were completely exhausted in one reflow, exposing the Cu pad underneath the solder. Cu6Sn5 dissolved with various Ni contents, termed (Cu,Ni)6Sn5, was the dominant intermetallic compound (IMC) species at the solder/Cu interface. Additionally, Ni2SnP and Ni3P IMCs might form with the (Cu,Ni)6Sn5 in the thick Ni(P) case, i.e., δ Ni(P) = 0.3 μm, and the two IMCs (Ni2SnP and Ni3P) were gradually eliminated from the interface after multiple reflows. A mass balance analysis indicated that the growth of the Ni-containing IMCs, rather than the dissolution of the metallization pad, played a key role in the Ni(P) exhaustion. The HSBS test results indicated that the mechanical strength of the solder joints was also δ Ni(P) dependent. The combined results of the interfacial reaction and the mechanical evaluation provided the optimal δ Ni(P) value for soldering applications.

  6. Laser-activated protein solder for peripheral nerve repair

    Science.gov (United States)

    Trickett, Rodney I.; Lauto, Antonio; Dawes, Judith M.; Owen, Earl R.

    1995-05-01

    A 100 micrometers core optical fiber-coupled 75 mW diode laser operating at a wavelength of 800 nm has been used in conjunction with a protein solder to stripe weld severed rat tibial nerves, reducing the long operating time required for microsurgical nerve repair. Welding is produced by selective laser denaturation of the albumin based solder which contains the dye indocyanine green. Operating time for laser soldering was 10 +/- 5 min. (n equals 20) compared to 23 +/- 9 min. (n equals 10) for microsuturing. The laser solder technique resulted in patent welds with a tensile strength of 15 +/- 5 g, while microsutured nerves had a tensile strength of 40 +/- 10 g. Histopathology of the laser soldered nerves, conducted immediately after surgery, displayed solder adhesion to the outer membrane with minimal damage to the inner axons of the nerves. An in vivo study is under way comparing laser solder repaired tibial nerves to conventional microsuture repair. At the time of submission 15 laser soldered nerves and 7 sutured nerves were characterized at 3 months and showed successful regeneration with compound muscle action potentials of 27 +/- 8 mV and 29 +/- 8 mW respectively. A faster, less damaging and long lasting laser based anastomotic technique is presented.

  7. Microstructural Evolution of Lead-Free Solder Joints in Ultrasonic-Assisted Soldering

    Science.gov (United States)

    Ji, Hongjun; Wang, Qiang; Li, Mingyu

    2016-01-01

    Solder joint reliability greatly depends on the microstructure of the solder matrix and the morphology of intermetallic compounds (IMCs) in the joints. Addition of strengthening phases such as carbon nanotubes and ceramic particles to solder joints to improve their properties has been widely studied. In this work, ultrasonic vibration (USV) of casting ingots was applied to considerably improve their microstructure and properties, and the resulting influence on fluxless soldering of Cu/Sn-3.0Ag-0.5Cu/Cu joints and their microstructural evolution was investigated. It was demonstrated that USV application during reflow of Sn-based solder had favorable effects on β-Sn grain size refinement as well as the growth and distribution of various IMC phases within the joints. The β-Sn grain size was significantly refined as the ultrasound power was increased, with a reduction of almost 90% from more than 100 μm to below 10 μm. Long and large Cu6Sn5 tubes in the solder matrix of the joints were broken into tiny ones. Needle-shaped Ag3Sn was transformed into flake-shaped. These IMCs were mainly precipitated along β-Sn phase boundaries. High-temperature storage tests indicated that the growth rate of interfacial IMCs in joints formed with USV was slower than in conventional reflow joints. The mechanisms of grain refinement and IMC fragmentation are discussed and related to the ultrasonic effects.

  8. A study on the Joining Properties of Bi-2212 High-Tc Superconducting Tube and Indium Solder

    International Nuclear Information System (INIS)

    As a material for SFCL(Superconducting Fault Current Limiter), BSCCO tube with metal stabilizer is a promising candidate, assuring the stability and large power capacity, For the application, the proper soldering technique, which overcome the difficulties of the joining between BSCCO and metal stabilizer, is required. In this study, after soldering In-Bi solder and In-Sn solder with BSCCO superconductor, welding properties between BSCCO and solders were investigated. Because ceramic materials is difficult to weld, Ag electro-plating on BSCCO 2212 is used for intermetallic layer. To find out the best welding condition for superconductor, soldering is tested in the maximum temperature from 155 degrees C to 165 degrees C in the reflow oven. By investigating the composition and thickness of IMC (lntermetallic Compound) created in the reaction of Ag with solder, we analyzed the welding properties of High-Tc superconductor from a micro point of view.

  9. Hexagonal-Rod Growth Mechanism and Kinetics of the Primary Cu6Sn5 Phase in Liquid Sn-Based Solder

    Science.gov (United States)

    Zhang, Z. H.; Cao, H. J.; Yang, H. F.; Li, M. Y.; Yu, Y. X.

    2016-11-01

    A hexagonal-rod growth mechanism is proposed to describe the growth behavior of the primary Cu6Sn5 phase in liquid Sn-based solder. After Sn-6.5 at.%Cu solder had been maintained at 250°C for 10 h, a large number of hexagonal-rod-type Cu6Sn5 grains were found to have separated within it. Our observations show that these hexagonal rods had side facets in the { 10overline{1} 0}_{η } family and round ends close to the {0002}η family. Moreover, the nucleation of the hexagonal rods was studied, and the corresponding growth kinetics found to be governed by a Cu-supply-controlled mechanism rather than an interfacial-reaction-controlled or Cu-diffusion-limited mechanism. More importantly, the anisotropic growth of the Cu6Sn5 phase was confirmed to be the dominant reason for production of these primary hexagonal rods with high aspect ratio. This may represent an avenue for synthesis of nanosized Cu6Sn5 single crystals for use as anode materials in lithium-ion batteries. Additionally, our Cu6Sn5 hexagonal-rod growth mechanism may provide insight into morphological and kinetic studies on interfacial Cu6Sn5 grains and similar intermetallics.

  10. Passive alignment and soldering technique for optical components

    Science.gov (United States)

    Faidel, Heinrich; Gronloh, Bastian; Winzen, Matthias; Liermann, Erik; Esser, Dominik; Morasch, Valentin; Luttmann, Jörg; Leers, Michael; Hoffmann, Dieter

    2012-03-01

    The passive-alignment-packaging technique presented in this work provides a method for mounting tolerance-insensitive optical components e.g. non-linear crystals by means of mechanical stops. The requested tolerances for the angle deviation are +/-100 μrad and for the position tolerance +/-100 μm. Only the angle tolerances were investigated, because they are more critical. The measurements were carried out with an autocollimator. Fused silica components were used for test series. A solder investigation was carried out. Different types of solder were tested. Due to good solderability on air and low induced stress in optical components, Sn based solders were indicated as the most suitable solders. In addition several concepts of reflow soldering configuration were realized. In the first iteration a system with only the alignment of the yaw angle was implemented. The deviation for all materials after the thermal and mechanical cycling was within the tolerances. The solderability of BBO and LBO crystals was investigated and concepts for mounting were developed.

  11. Soldering Tested in Reduced Gravity

    Science.gov (United States)

    Struk, Peter M.; Pettegrew, Richard D.; Watson, J. Kevin; Down, Robert S.; Haylett, Daniel R.

    2005-01-01

    Whether used occasionally for contingency repair or routinely in nominal repair operations, soldering will become increasingly important to the success of future long-duration human space missions. As a result, it will be critical to have a thorough understanding of the service characteristics of solder joints produced in reduced-gravity environments. The National Center for Space Exploration Research (via the Research for Design program), the NASA Glenn Research Center, and the NASA Johnson Space Center are conducting an experimental program to explore the influence of reduced gravity environments on the soldering process. Solder joint characteristics that are being considered include solder fillet geometry, porosity, and microstructural features. Both through-hole (see the drawing and image on the preceding figure) and surface-mounted devices are being investigated. This effort (the low-gravity portion being conducted on NASA s KC-135 research aircraft) uses the soldering hardware currently available on the International Space Station. The experiment involves manual soldering by a contingent of test operators, including both highly skilled technicians and less skilled individuals to provide a skill mix that might be encountered in space mission crews. The experiment uses both flux-cored solder and solid-core solder with an externally applied flux. Other experimental parameters include the type of flux, gravitational level (nominally zero,

  12. Soldering of Nanotubes onto Microelectrodes

    DEFF Research Database (Denmark)

    Madsen, Dorte Nørgaard; Mølhave, Kristian; Mateiu, Ramona Valentina;

    2003-01-01

    Suspended bridges of individual multiwalled carbon nanotubes were fabricated inside a scanning electron microscope by soldering the nanotube onto microelectrodes with highly conducting gold-carbon material. By the decomposition of organometallic vapor with the electron beam, metal-containing solder...... bonds were formed at the intersection of the nanotube and the electrodes. Current-voltage curves indicated metallic conduction of the nanotubes, with resistances in the range of 9-29 kOmega. Bridges made entirely of the soldering material exhibited resistances on the order of 100 Omega, and the solder...... bonds were consistently found to be mechanically stronger than the carbon nanotubes....

  13. Frictional Behavior of Fe-based Cladding Candidates for PWR

    Energy Technology Data Exchange (ETDEWEB)

    Lee, Young-Ho; Kim, Hyung-Kyu [Korea Atomic Energy Research Institute, Daejeon (Korea, Republic of); Byun, Thak Sang [Oak Ridge National Lab., Oak Ridge (United States)

    2014-10-15

    After the recent nuclear disaster at Fukushima Daiichi reactors, there is a growing consensus on the development of new fuel systems (i.e., accident-tolerant fuel, ATF) that have high safety margins under design-basis accident (DBA) and beyond design-basis accident (BDBA). A common objective of various developing candidates is to archive the outstanding corrosion-resistance under severe accidents such as DBA and DBDA conditions for decreasing hydrogen production and increasing coping time to respond to severe accidents. ATF could be defined as new fuel/cladding system with enhanced accident tolerant to loss of active cooling in the core for a considerably longer time period under severe accidents while maintaining or improving the fuel performance during normal operations. This means that, in normal operating conditions, new fuel systems should be applicable to current operating PWRs for suppressing various degradation mechanisms of current fuel assembly without excessive design changes. When considering that one of the major degradation mechanisms of PWR fuel assemblies is a grid-to-rod fretting (GTRF), it is necessary to examine the tribological behavior of various ATF candidates at initial development stage. In this study, friction and reciprocating wear behavior of two kinds of Fe-based ATF candidates were examined with a reciprocating wear tests at room temperature (RT) air and water. The objective is to examine the compatibilities of these Fe-based alloys against current Zr-based alloy properties, which is used as major structural materials of PWR fuel assemblies. The reciprocating wear behaviors of Fe-based accident-tolerant fuel cladding candidates against current Zr-based alloy has been studied using a reciprocating sliding wear tester in room temperature air and water. Frictional behavior and wear depth were used for evaluating the applicability and compatibilities of Fe-based candidates without significant design changes of PWR fuel assemblies

  14. Mechanical and Physical Properties of In-Zn-Ga Lead-Free Solder Alloy for Low Energy Consumption

    Science.gov (United States)

    Ervina Efzan, M. N.; Nur Faziera, M. N.; Bakri Abdullah, Mohd Mustafa Al

    2016-06-01

    Due to the demand in the use of electronics devices in industry, the usage of solder connections has increased. Concerning with the toxicity of lead in Sn-37Pb solder alloy, developing lead free solder alloy with low melting temperature is one of the most important issues in electronic industry. Previously, researchers found out that the most promising candidate of lead free solder alloy is Sn-3.0Ag-0.5Cu (SAC). However, the melting temperature of this solder alloy is 217°C, 34°C higher than Sn-37Pb. This can lead to high energy consumption in electronic industry. In this paper, In-Zn-Ga solder alloy was investigated as a potential candidate replacing SAC. This study covers on the physical and mechanical properties of the solder alloy. Differential Scanning Calorimetry (DSC) testing shows that this solder alloy gave low melting temperature as low as 141.31°C. The addition of Ga in In-Zn solder alloy lowered the melting temperature compared to SAC and Sn-37Pb. From coefficient of thermal expansion (CTE) analysis, the In-Zn-Ga solder alloy gives good expansion properties and able to avoid the mismatch between the solder and copper substrates. The density of In-Zn-Ga solder alloy is 6.801g/cm3, lower than SAC and Sn-37Pb. For the strength, single lap shear testing was conducted on the In-Zn-Ga solder alloy and the results is near to the strength of SAC.

  15. In situ measurement of electromigration-induced transient stress in Pb-free Sn-Cu solder joints by synchrotron radiation based X-ray polychromatic microdiffraction

    Energy Technology Data Exchange (ETDEWEB)

    Chen, Kai; Tamura, Nobumichi; Kunz, Martin; Tu, King-Ning; Lai, Yi-Shao

    2009-05-15

    Electromigration-induced hydrostatic elastic stress in Pb-free SnCu solder joints was studied by in situ synchrotron X-ray white beam microdiffraction. The elastic stresses in two different grains with similar crystallographic orientation, one located at the anode end and the other at the cathode end, were analyzed based on the elastic anisotropy of the {beta}-Sn crystal structure. The stress in the grain at the cathode end remained constant except for temperature fluctuations, while the compressive stress in the grain at the anode end was built-up as a function of time during electromigration until a steady state was reached. The measured compressive stress gradient between the cathode and the anode is much larger than what is needed to initiate Sn whisker growth. The effective charge number of {beta}-Sn derived from the electromigration data is in good agreement with the calculated value.

  16. In situ measurement of electromigration-induced transient stress in Pb-free Sn-Cu solder joints by synchrotron radiation based X-ray polychromatic microdiffraction

    Energy Technology Data Exchange (ETDEWEB)

    Chen, Kai; Tamura, Nobumichi; Kunz, Martin; Tu, King-Ning; Lai, Yi-Shao

    2009-12-01

    Electromigration-induced hydrostatic elastic stress in Pb-free SnCu solder joints was studied by in situ synchrotron X-ray white beam microdiffraction. The elastic stresses in two different grains with similar crystallographic orientation, one located at the anode end and the other at the cathode end, were analyzed based on the elastic anisotropy of the Beta-Sn crystal structure. The stress in the grain at the cathode end remained constant except for temperature fluctuations, while the compressive stress in the grain at the anode end was built-up as a function of time during electromigration until a steady state was reached. The measured compressive stress gradient between the cathode and the anode is much larger than what is needed to initiate Sn whisker growth. The effective charge number of Beta-Sn derived from the electromigration data is in good agreement with the calculated value.

  17. Quantitative Analysis of Porosity and Transport Properties by FIB-SEM 3D Imaging of a Solder Based Sintered Silver for a New Microelectronic Component

    Science.gov (United States)

    Rmili, W.; Vivet, N.; Chupin, S.; Le Bihan, T.; Le Quilliec, G.; Richard, C.

    2016-04-01

    As part of development of a new assembly technology to achieve bonding for an innovative silicon carbide (SiC) power device used in harsh environments, the aim of this study is to compare two silver sintering profiles and then to define the best candidate for die attach material for this new component. To achieve this goal, the solder joints have been characterized in terms of porosity by determination of the morphological characteristics of the material heterogeneities and estimating their thermal and electrical transport properties. The three dimensional (3D) microstructure of sintered silver samples has been reconstructed using a focused ion beam scanning electron microscope (FIB-SEM) tomography technique. The sample preparation and the experimental milling and imaging parameters have been optimized in order to obtain a high quality of 3D reconstruction. Volume fractions and volumetric connectivity of the individual phases (silver and voids) have been determined. Effective thermal and electrical conductivities of the samples and the tortuosity of the silver phase have been also evaluated by solving the diffusive transport equation.

  18. Eutectic Solder Bonding for Highly Manufacturable Microelectromechanical Systems Probe Card

    Science.gov (United States)

    Kim, Bonghwan

    2011-06-01

    We developed eutectic solder bonding for the microelectromechanical systems (MEMS) probe card. We tested various eutectic solder materials, such as Sn, AgSn, and AuSn, and investigated the bonding ability of Sn-based multi-element alloys and their resistance to chemical solutions. The Sn-based alloys were formed by sputtering, electroplating, and the use of solder paste. According to our experimental results, Sn-rich solders, such as Ag3.5Sn, Ag3.5Sn96Cu0.5, and Sn, were severely damaged by silicon wet etchant such as potassium hydroxide (KOH) and tetramethylammonium hydroxide (TMAH). On the other hand Au80Sn20 was resistant to those chemicals. In order to verify the joint bondability of the solders, we used a cantilever probe beam, and bump which were made of nickel and nickel alloy. After flip-chip bonding of the cantilever beam and the bump with Au80Sn20 solder paste, we measured the contact force to verify the mechanical strength. We then re-inspected it with X-rays and found no voids in the joint.

  19. Influence on the soldered seam properties with large gap widths by heat treatment

    International Nuclear Information System (INIS)

    Soldering tests were performed on the nickel base alloy NiCr 20 TiAl with the soldering material NiCrSi. It is seen that soldered seams of over 100 μm width are very brittle. The brittleness is due to the silicides formed during soldering. The ductility behaviour can be considerably improved by an annealing treatment after soldering which does not affect the properties of the basic material. This ductility-increasing heat treatment can also be applied to other soldered joints, the optimum temperatures and annealing times being determined by metallographic and technological investigations. Spot sampling under the actual operational conditions is recommended prior to introducing this heat treatment step into the fabrication. (orig./LH)

  20. Corrosive microenvironments at lead solder surfaces arising from galvanic corrosion with copper pipe.

    Science.gov (United States)

    Nguyen, Caroline K; Stone, Kendall R; Dudi, Abhijeet; Edwards, Marc A

    2010-09-15

    As stagnant water contacts copper pipe and lead solder (simulated soldered joints), a corrosion cell is formed between the metals in solder (Pb, Sn) and the copper. If the resulting galvanic current exceeds about 2 μA/cm(2), a highly corrosive microenvironment can form at the solder surface, with pH galvanic currents, preventing passivation of the solder surface, and contributing to lead contamination of potable water supplies. The total mass of lead corroded was consistent with predictions based on the galvanic current, and lead leaching to water was correlated with galvanic current. If the concentration of sulfate in the water increased relative to chloride, galvanic currents and associated lead contamination could be greatly reduced, and solder surfaces were readily passivated.

  1. Study of Direct Bonding Ceramics with Metal Using Sn2La Solder

    Directory of Open Access Journals (Sweden)

    Roman Koleňák

    2015-01-01

    Full Text Available The aim of this research was to study the direct bonding of ceramic materials, mainly Al2O3 and selected metals, with primary attention given to Cu substrate. Soldering was performed with Sn-based solder alloyed with 2% La. We found that the bond formation between Sn2La solder and Al2O3 occurs at the activation of lanthanum phases in solder by ultrasound. Lanthanum in the solder becomes oxidised in air during the soldering process. However, due to ultrasonic activation, the lanthanum particles are distributed to the boundary with ceramic material. A uniformly thin layer containing La, 1.5 µm in thickness, is formed on the boundary with Al2O3 material, ensuring both wetting and joint formation. The shear strength with Al2O3 ceramics is 7.5 MPa. Increased strength to 13.5 MPa was observed with SiC ceramics.

  2. Microstructure-based modeling of the ageing effect on the deformation behavior of the eutectic micro-constituent in SnAgCu lead-free solder

    International Nuclear Information System (INIS)

    The eutectic micro-constituent in SnAgCu solder governs the deformation behavior of the joint as it shows better deformation resistance than the Sn dendrites and occupies a high volume percentage of the whole solder. The main scope of this study is to develop a three-dimensional (3-D) homogenization model taking into account the microstructural evolution in the eutectic micro-constituent of SnAgCu solder in order to simulate the change in mechanical behavior of the joint caused by isothermal ageing. For this purpose, 3-D configurations of Ag3Sn and Cu6Sn5 intermetallic compounds (IMCs) in near-eutectic SnAgCu solder are visualized in the as-soldered condition and after ageing by focused ion beam/scanning electron microscopy tomography. The tomographic images are used to generate feature-preserving finite element meshes of the actual microstructures. The representative volume element size and constitutive behavior of the eutectic mixture in the two conditions are determined by a numerical homogenization procedure. The results show a considerable reduction in the yield stress level of the eutectic micro-constituent after ageing of the solder joint. It is shown that the increase in the inter-particle spacing and decrease in the aspect ratio of IMCs due to ageing cause a significant change in the strain distribution in the tin matrix, which leads to a lower contribution of IMCs in load-sharing and yield strength of aged solder. The elastic–plastic properties of as-soldered and aged eutectic mixtures are determined by nanoindentation. The results of homogenization are validated through comparison with experimental results and prediction of the dislocation detachment theory.

  3. Speeding disease gene discovery by sequence based candidate prioritization

    Directory of Open Access Journals (Sweden)

    Porteous David J

    2005-03-01

    Full Text Available Abstract Background Regions of interest identified through genetic linkage studies regularly exceed 30 centimorgans in size and can contain hundreds of genes. Traditionally this number is reduced by matching functional annotation to knowledge of the disease or phenotype in question. However, here we show that disease genes share patterns of sequence-based features that can provide a good basis for automatic prioritization of candidates by machine learning. Results We examined a variety of sequence-based features and found that for many of them there are significant differences between the sets of genes known to be involved in human hereditary disease and those not known to be involved in disease. We have created an automatic classifier called PROSPECTR based on those features using the alternating decision tree algorithm which ranks genes in the order of likelihood of involvement in disease. On average, PROSPECTR enriches lists for disease genes two-fold 77% of the time, five-fold 37% of the time and twenty-fold 11% of the time. Conclusion PROSPECTR is a simple and effective way to identify genes involved in Mendelian and oligogenic disorders. It performs markedly better than the single existing sequence-based classifier on novel data. PROSPECTR could save investigators looking at large regions of interest time and effort by prioritizing positional candidate genes for mutation detection and case-control association studies.

  4. Lead-free solder technology transfer from ASE Americas

    Energy Technology Data Exchange (ETDEWEB)

    FTHENAKIS,V.

    1999-10-19

    To safeguard the environmental friendliness of photovoltaics, the PV industry follows a proactive, long-term environmental strategy involving a life-of-cycle approach to prevent environmental damage by its processes and products from cradle to grave. Part of this strategy is to examine substituting lead-based solder on PV modules with other solder alloys. Lead is a toxic metal that, if ingested, can damage the brain, nervous system, liver and kidneys. Lead from solder in electronic products has been found to leach out from municipal waste landfills and municipal incinerator ash was found to be high in lead also because of disposed consumer electronics and batteries. Consequently, there is a movement in Europe and Japan to ban lead altogether from use in electronic products and to restrict the movement across geographical boundaries of waste containing lead. Photovoltaic modules may contain small amounts of regulated materials, which vary from one technology to another. Environmental regulations impact the cost and complexity of dealing with end-of-life PV modules. If they were classified as hazardous according to Federal or State criteria, then special requirements for material handling, disposal, record-keeping and reporting would escalate the cost of decommissioning the modules. Fthenakis showed that several of today's x-Si modules failed the US-EPA Toxicity Characteristic Leaching Procedure (TCLP) for potential leaching of Pb in landfills and also California's standard on Total Threshold Limit Concentration (TTLC) for Pb. Consequently, such modules may be classified as hazardous waste. He highlighted potential legislation in Europe and Japan which could ban or restrict the use of lead and the efforts of the printed-circuit industries in developing Pb-free solder technologies in response to such expected legislation. Japanese firms already have introduced electronic products with Pb-free solder, and one PV manufacturer in the US, ASE Americas has used a

  5. An Evaluation of Prototype Circuit Boards Assembled with a Sn-Ag Bi Solder

    International Nuclear Information System (INIS)

    An evaluation was performed which examined the aging of surface mount solder joints assembled with 91.84Sn-3.33Ag-4.83Bi solder. Defect analysis of the as-fabricated test vehicles revealed excellent solderability, good package alignment, and a minimum number of voids. Continuous DC electrical monitoring of the solder joints did not reveal opens during as many as 10,000 thermal cycles (0 C, 100 C). The solder joints exhibited no significant degradation through 2500 cycles, based upon an absence of microstructural damage and sustained shear and pull strengths of chip capacitors and J-leaded solder joints, respectively. Thermal cycles of 5000 and 10,000 resulted in some surface cracking of the solder fillets and coatings. In a few cases, deeper cracks were observed in the thinner reaches of several solder fillets. There was no deformation or cracking in the solder located in the gap between the package I/O and the circuit board pad nor in the interior of the fillets, both locations that would raise concerns of joint mechanical integrity. A drop in the chip capacitor shear strength was attributed to crack growth near the top of the fillet

  6. A computer vision based candidate for functional balance test.

    Science.gov (United States)

    Nalci, Alican; Khodamoradi, Alireza; Balkan, Ozgur; Nahab, Fatta; Garudadri, Harinath

    2015-08-01

    Balance in humans is a motor skill based on complex multimodal sensing, processing and control. Ability to maintain balance in activities of daily living (ADL) is compromised due to aging, diseases, injuries and environmental factors. Center for Disease Control and Prevention (CDC) estimate of the costs of falls among older adults was $34 billion in 2013 and is expected to reach $54.9 billion in 2020. In this paper, we present a brief review of balance impairments followed by subjective and objective tools currently used in clinical settings for human balance assessment. We propose a novel computer vision (CV) based approach as a candidate for functional balance test. The test will take less than a minute to administer and expected to be objective, repeatable and highly discriminative in quantifying ability to maintain posture and balance. We present an informal study with preliminary data from 10 healthy volunteers, and compare performance with a balance assessment system called BTrackS Balance Assessment Board. Our results show high degree of correlation with BTrackS. The proposed system promises to be a good candidate for objective functional balance tests and warrants further investigations to assess validity in clinical settings, including acute care, long term care and assisted living care facilities. Our long term goals include non-intrusive approaches to assess balance competence during ADL in independent living environments.

  7. Trinocular stereo vision method based on mesh candidates

    Science.gov (United States)

    Liu, Bin; Xu, Gang; Li, Haibin

    2010-10-01

    One of the most interesting goals of machine vision is 3D structure recovery of the scenes. This recovery has many applications, such as object recognition, reverse engineering, automatic cartography, autonomous robot navigation, etc. To meet the demand of measuring the complex prototypes in reverse engineering, a trinocular stereo vision method based on mesh candidates was proposed. After calibration of the cameras, the joint field of view can be defined in the world coordinate system. Mesh grid is established along the coordinate axes, and the mesh nodes are considered as potential depth data of the object surface. By similarity measure of the correspondence pairs which are projected from a certain group of candidates, the depth data can be obtained readily. With mesh nodes optimization, the interval between the neighboring nodes in depth direction could be designed reasonably. The potential ambiguity can be eliminated efficiently in correspondence matching with the constraint of a third camera. The cameras can be treated as two independent pairs, left-right and left-centre. Due to multiple peaks of the correlation values, the binocular method may not satisfy the accuracy of the measurement. Another image pair is involved if the confidence coefficient is less than the preset threshold. The depth is determined by the highest sum of correlation of both camera pairs. The measurement system was simulated using 3DS MAX and Matlab software for reconstructing the surface of the object. The experimental result proved that the trinocular vision system has good performance in depth measurement.

  8. Research advances in the interfacial IMC between the Sn-based solders and Cu substrate%锡基钎料与铜界面IMC的研究进展

    Institute of Scientific and Technical Information of China (English)

    位松; 尹立孟; 许章亮; 李欣霖; 李望云

    2012-01-01

    Research advances in the formation and growth mechanism of interfacial IMC between the Sn-based solder and Cu substrate in interconnection solder joint of electronic packaging are reviewed and commented. The formation and growth behavior of interfacial IMC in lead-free solder joints, the thermodynamics of IMC formation and the kinetics of IMC growth are expounded. Some other factors which are related to the growth behavior of interfacial IMC are also briefly proposed. In addition, the development trends of the research on interfacial IMC in lead-free electronic packaging are discussed.%对国内外电子封装“锡基钎料/铜基板”焊点体系界面IMC形成与生长机理的研究进展进行了回顾、评述,重点阐述了界面IMC的形成与生长行为、形成热力学和生长动力学,简要评述了相关因素对界面IMC生长行为的影响.最后,对无铅化电子封装互连焊点界面IMC研究的发展趋势进行了展望.

  9. Heat Lamps Solder Solar Array Quickly

    Science.gov (United States)

    Coyle, P. J.; Crouthamel, M. S.

    1982-01-01

    Interconnection tabs in a nine-solar-cell array have been soldered simultaneously with radiant heat. Cells and tabs are held in position for soldering by sandwiching them between compliant silicone-rubber vacuum platen and transparent polyimide sealing membrane. Heat lamps warm cells, producing smooth, flat solder joints of high quality.

  10. Dural reconstruction by fascia using a temperature-controlled CO2 laser soldering system

    Science.gov (United States)

    Forer, Boaz; Vasilyev, Tamar; Brosh, Tamar; Kariv, Naam; Gil, Ziv; Fliss, Dan M.; Katzir, Abraham

    2005-04-01

    Conventional methods for dura repair are normally based on sutures or stitches. These methods have several disadvantages: (1) The dura is often brittle, and the standard procedures are difficult and time consuming. (2) The seal is leaky. (3) The introduction of a foreign body (e.g. sutures) may cause an inflammatory response. In order to overcome these difficulties we used a temperature controlled fiber optic based CO2 laser soldering system. In a set of in vitro experiments we generated a hole of diameter 10 mm in the dura of a pig corpse, covered the hole with a segment of fascia, and soldered the fascia to the edges of the hole, using 47% bovine albumin as a solder. The soldering was carried out spot by spot, and each spot was heated to 65° C for 3-6 seconds. The soldered dura was removed and the burst pressure of the soldered patch was measured. The average value for microscopic muscular side soldering was 194 mm Hg. This is much higher than the maximal physiological pressure of the CSF fluid in the brain, which is 15 mm Hg. In a set of in vivo experiments, fascia patches were soldered on holes in five farm pigs. The long term results of these experiments were very promising. In conclusion, we have developed an advanced technique for dural reconstruction, which will find important clinical applications.

  11. Methylene blue solder re-absorption in microvascular anastomoses

    Science.gov (United States)

    Birch, Jeremy F.; Hepplewhite, J.; Frier, Malcolm; Bell, Peter R. F.

    2003-06-01

    Soldered vascular anastomoses have been reported using several chromophores but little is known of the optimal conditions for microvascular anastomosis. There are some indications of the optimal protein contents of a solder, and the effects of methylene blue on anastomotic strength. The effects of varying laser power density in vivo have also been described, showing a high rate of thrombosis with laser power over 22.9Wcm-2. However no evidence exists to describe how long the solder remains at the site of the anastomosis. Oz et al reported that the fibrin used in their study had been almost completely removed by 90 days but without objective evidence of solder removal. In order to address the issue of solder re-absorption from the site of an anastomosis we used radio-labelled albumin (I-125) incorporated into methylene blue based solder. This was investigated in both the situation of the patent and thrombosed anastomosis with anastomoses formed at high and low power. Iodine-125 (half life: 60.2 days) was covalently bonded to porcine albumin and mixed with the solder solution. Radio-iodine has been used over many years to determine protein turnover using either I-125 or I-131. Iodine-125 labelled human albumin is regularly used as a radiopharmaceutical tool for the determination of plasma volume. Radio-iodine has the advantages of not affecting protein metabolism and the label is rapidly excreted after metabolic breakdown. Labelling with chromium (Cr-51) causes protein denaturation and is lost from the protein with time. Labelled albumin has been reported in human studies over a 21-day period, with similar results reported by Matthews. Most significantly McFarlane reported a different rate of catabolism of I-131 and I-125 over a 22-day period. The conclusion from this is that the rate of iodine clearance is a good indicator of protein catabolism. In parallel with the surgery a series of blank standards were prepared with a known mass of solder to correct for isotope

  12. Effects of solder temperature on pin through-hole during wave soldering: thermal-fluid structure interaction analysis.

    Science.gov (United States)

    Aziz, M S Abdul; Abdullah, M Z; Khor, C Y

    2014-01-01

    An efficient simulation technique was proposed to examine the thermal-fluid structure interaction in the effects of solder temperature on pin through-hole during wave soldering. This study investigated the capillary flow behavior as well as the displacement, temperature distribution, and von Mises stress of a pin passed through a solder material. A single pin through-hole connector mounted on a printed circuit board (PCB) was simulated using a 3D model solved by FLUENT. The ABAQUS solver was employed to analyze the pin structure at solder temperatures of 456.15 K (183(°)C) < T < 643.15 K (370(°)C). Both solvers were coupled by the real time coupling software and mesh-based parallel code coupling interface during analysis. In addition, an experiment was conducted to measure the temperature difference (ΔT) between the top and the bottom of the pin. Analysis results showed that an increase in temperature increased the structural displacement and the von Mises stress. Filling time exhibited a quadratic relationship to the increment of temperature. The deformation of pin showed a linear correlation to the temperature. The ΔT obtained from the simulation and the experimental method were validated. This study elucidates and clearly illustrates wave soldering for engineers in the PCB assembly industry. PMID:25225638

  13. A Feasibility Study of Lead Free Solders for Level 1 Packaging Applications

    DEFF Research Database (Denmark)

    Chidambaram, Vivek; Hald, John; Hattel, Jesper Henri

    2009-01-01

    An attempt has been made to determine the lead free ternary combinations that satisfied the solidification requirement for a solder used in level 1 packaging applications, using the CALPHAD approach. The segregation profiles of the promising candidates were analyzed after scrutinizing the equilib......An attempt has been made to determine the lead free ternary combinations that satisfied the solidification requirement for a solder used in level 1 packaging applications, using the CALPHAD approach. The segregation profiles of the promising candidates were analyzed after scrutinizing...

  14. 基于Ag-Sn焊片共晶键合的MEMS气密性封装%Eutectic Bonding for MEMS Hermetic Packaging Based on Ag -Sn Solder Film

    Institute of Scientific and Technical Information of China (English)

    陈继超; 赵湛; 刘启民; 肖丽; 杜利东

    2012-01-01

    This paper introduced the eutectic bonding technology in MEMS hermetic packaging based on Ag - Sn solder film. The structure of multi-layer material for eutectic bonding and the pattern of sealing rings were designed. A good bonding effect was realized in the N2 protecting environment at 221 ℃,and the average shear strength was 9.4 MPa. Helium leak rate is no more than 5 × 10-4 Pa ·cm3/s in the comparative experiments through three months,which meets the GJB548B -2005 standard and verifies the feasibility of Ag - Sn eutectic bonding technology in MEMS hermetic packaging.%研究了在MEMS气密性封装中基于Ag - Sn焊片的共晶键合技术.设计了共晶键合多层材料的结构和密封环图形,在221℃实现了良好的键合效果,充N2保护的键合环境下,平均剪切强度达到9.4 Mpa.三个月前后气密性对比实验表明氦泄漏不超过5×10-4 Pa.cm3/s,满足GJB548B-2005标准规定,验证了Ag - Sn共晶键合技术在MEMS气密封装中应用的可行性.

  15. The effect of intermetallic compound morphology on Cu diffusion in Sn-Ag and Sn-Pb solder bump on the Ni/Cu Under-bump metallization

    Science.gov (United States)

    Jang, Guh-Yaw; Duh, Jenq-Gong

    2005-01-01

    The eutectic Sn-Ag solder alloy is one of the candidates for the Pb-free solder, and Sn-Pb solder alloys are still widely used in today’s electronic packages. In this tudy, the interfacial reaction in the eutectic Sn-Ag and Sn-Pb solder joints was investigated with an assembly of a solder/Ni/Cu/Ti/Si3N4/Si multilayer structures. In the Sn-3.5Ag solder joints reflowed at 260°C, only the (Ni1-x,Cux)3Sn4 intermetallic compound (IMC) formed at the solder/Ni interface. For the Sn-37Pb solder reflowed at 225°C for one to ten cycles, only the (Ni1-x,Cux)3Sn4 IMC formed between the solder and the Ni/Cu under-bump metallization (UBM). Nevertheless, the (Cu1-y,Niy)6Sn5 IMC was observed in joints reflowed at 245°C after five cycles and at 265°C after three cycles. With the aid of microstructure evolution, quantitative analysis, and elemental distribution between the solder and Ni/Cu UBM, it was revealed that Cu content in the solder near the solder/IMC interface played an important role in the formation of the (Cu1-y,Niy)6Sn5 IMC. In addition, the diffusion behavior of Cu in eutectic Sn-Ag and Sn-Pb solders with the Ni/Cu UBM were probed and discussed. The atomic flux of Cu diffused through Ni was evaluated by detailed quantitative analysis in an electron probe microanalyzer (EPMA). During reflow, the atomic flux of Cu was on the order of 1016-1017 atoms/cm2sec in both the eutectic Sn-Ag and Sn-Pb systems.

  16. Physical properties of lead free solders in liquid and solid state

    Energy Technology Data Exchange (ETDEWEB)

    Mhiaoui, Souad

    2007-04-17

    The European legislation prohibits the use of lead containing solders in Europe. However, lead free solders have a higher melting point (typical 20%) and their mechanical characteristics are worse. Additional problems are aging and adhesion of the solder on the electronic circuits. Thus, research activities must focus on the optimization of the properties of Sn-Ag-Cu based lead free solders chosen by the industry. Two main objectives are treated in this work. In the center of the first one is the study of curious hysteresis effects of metallic cadmium-antimony alloys after thermal cycles by measuring electronic transport phenomena (thermoelectric power and electrical resistivity). The second objective, within the framework of ''cotutelle'' between the universities of Metz and of Chemnitz and supported by COST531, is to study more specifically lead free solders. A welding must well conduct electricity and well conduct and dissipate heat. In Metz, we determined the electrical conductivity, the thermoelectric power and the thermal conductivity of various lead free solders (Sn-Ag-Cu, Sn-Cu, Sn-Ag, Sn-Sb) as well in the liquid as well in the solid state. The results have been compared to classical lead-tin (Pb-Sn) solders. In Chemnitz we measured the surface tension, the interfacial tension and the density of lead free solders. We also measured the viscosity of these solders without and with additives, in particular nickel. These properties were related to the industrial problems of wettability and spreadability. Lastly, we solidified alloys under various conditions. We observed undercooling. We developed a technique of mixture of nanocrystalline powder with lead free solders ''to sow'' the liquid bath in order to obtain ''different'' solids which were examined using optical and electron microscopy. (orig.)

  17. Effect of Lanthanum on Driving Force for Cu6Sn5 Growth and Improvement of Solder Joint Reliability

    Institute of Scientific and Technical Information of China (English)

    2002-01-01

    By means of adding low content of rare earth element La into Sn60-Pb40 solder alloy, the growth of Cu6Sn5 intermetallic compound at the interface of solder joint is hindered, and the thermal fatigue life of solder joint is increased by 2 times. The results of thermodynamic calculation based on diffusion kinetics show that, the driving force for Cu6Sn5 growth is lowered by adding small content of La in Sn60-Pb40 solder alloy. Meanwhile, there is an effective local mole fraction range of La, in which, 0.18% is the limited value and 0.08% is the best value.

  18. Lead Free Solder Joint Thermal Condition in Semiconductor Packaging

    Directory of Open Access Journals (Sweden)

    M. N. Harif

    2010-01-01

    Full Text Available Problem statement: Solder joints are responsible for both electrical and mechanical connections. Solder does not have adequate ductility to ensure the repeated relative displacements due to the mismatch between expansion coefficients of the chip carrier and the circuit board. Solder material plays a crucial role to provide the necessary electrical and mechanical interconnections in an electronic assembly. Finding a technique to increase the service life of future connections is not the total solution. A method must be developed for predicting the remaining service life of many joints already in use. Approach: The effect of High Temperature Storage (HTS on lead free solder joint material for ball grid array application using pull test method is studied in this study. Some statistical analysis base on the pull test data also discussed. Three samples of different lead free solder joint material were selected in this experiment namely Sn3.8Ag0.7Cu (SAC387, Sn2.3Ag0.08Ni0.01Co (SANC and Sn3.5Ag. After the thermal condition test, all the lead free solder joint material samples were tested using Dage 4000 pull test machine. Each pull test will be 5 units and each unit contains 8 balls. Results: The mean pull strength for high temperature storage is 2847.66, 2628.20 and 2613.79 g for Sn3.5Ag, SANC and SAC387, respectively. Thus, Sn3.5Ag shows a significantly better solder joint performance in terms of joint strength compare to SANC and SAC387. Hence, Intermetallic Compound (IMC thicknesses were measured after cross-sectioning. Sample size for cross-sectioning was 3 units per read point, 2 balls per unit and 3 maximum IMC peaks per ball and the measurement using high power scope of 100x and Image Analyzer software to measure the IMC thickness. For high temperature storage, result show that the mean IMC thicknesses for SAC387, SANC and Sn3.5Ag are 3.9139, 2.3111 and 2.3931 µm. Conclusion/Recommendations: It was found that IMC thickness for SANC and Sn3

  19. Microstructures and properties of SnZn-xEr lead-free solders

    Institute of Scientific and Technical Information of China (English)

    ZHANG Liang; CUI Junhua; HAN Jiguang; GUO Yonghuan; HE Chengwen

    2012-01-01

    The Sn9Zn eutectic alloy is the nontoxic lead-free solders alternative having a melting temperature which is closest to that of the entectic SnPb alloy.In order to improve the properties of SnZn lead-free solders,0-0.5 wt.% of rare earth Er was added to the base alloys,and the microstructures were studied.Results showed that the addition of rare earth Er could enhance the wettability of SnZn solders,with 0.08%Er addition,the spreading area gave an 19.1% increase.And based on the mechanical testing,it was found that the tensile force and shear force of SnZn-xEr solder joints could be improved significantly.Moreover,the oxidation resistance of SnZn0.08Er solder was better than that of SnZn solder.In addition,it was found that trace amounts of rare earth Er could refine the microstRUctures of SnZn solders,especially for Zn-rich phases,and excessive amount of rare earth Er led to a coarse microstructure.

  20. A Study of Temperature, Microstructure and Hardness Properties of Sn-3.8Ag-0.7Cu (SAC Solder Alloy

    Directory of Open Access Journals (Sweden)

    Singh Amares

    2015-01-01

    Full Text Available Solder alloys are one of the most crucial aspect linking the electrical components to the printed circuit board PCB substrate. Thus, producing a good solder is a must to say in electronic industries. Among major functions of solder alloys are to provide beneficial properties in melting, microstructure and mechanical strand. In this aspect, the Sn-3.8Ag-0.7Cu (SAC solder alloys are recommended as potential candidate to assure these benefits. In this study, the solder possesses melting temperature of, TM=227°C which is below the desired soldering temperature, TM=250°C. Besides, this SAC solder produces well-defined microstructures with Sn-matrix and eutectic phase consisting Cu6Sn5 and Ag3Sn displayed from SEM image, contributes in harvesting good mechanical properties. The SAC solder also provides a high hardness value with an average of 14.4Hv for Vickers hardness. All these results seem to satisfy the need of a viable solder alloy.

  1. Pilot Study of a Haptic Soldering Environment

    OpenAIRE

    Sung, R.C.W.; Ritchie, J. M.; Lim, T; Dewar, R.; Weston, N.

    2012-01-01

    Soldering plays an important role in the electronics manufacturing industry, whether it is carried out manually, semi-automatically or fully-automatically. Even though it is straightforward to learn the fundamental techniques involved in manual soldering, it still requires a vast amount of time and effort to reach an expert level. The research presented here aims to simulate the manual soldering process in a haptics environment, and by logging the users’ actions automatically and uno...

  2. Eddy current quality control of soldered current-carrying busbar splices of superconducting magnets

    CERN Document Server

    Kogan, L; Savary, F; Principe, R; Datskov, V; Rozenfel'd, E; Khudjakov, B

    2015-01-01

    The eddy current technique associated with a U-shaped transducer is studied for the quality control of soldered joints between superconducting busbars ('splices'). Two other quality control techniques, based on X-rays and direct measurement of the electrical resistance, are also studied for comparison. A comparative analysis of the advantages and disadvantages of these three methods in relation to the quality control of soldered superconducting busbar cables enclosed in copper shells is used for benchmarking. The results of inspections with the U-shaped eddy current transducer carried out on several sample joints presenting different types of soldering defects show the potential of this type of nondestructive (ND) quality control technique.

  3. Life Prediction of Ball Grid Array Soldered Joints under Thermal Cycling Loading by Fracture Mechanics Method

    Institute of Scientific and Technical Information of China (English)

    2001-01-01

    Fatigue crack propagation life of ball grid array (BGA) soldered joints during thermal cycling loading was investigated by fracture mechanics approach using finite element analysis. The relationships between the strain energy release rate (G) and crack size (α), thermal cycle numbers (N) can be derived. Based on the relationships, fatigue life of the soldered joints was determined. The results showed that crack propagation life was higher than crack initiation life. Therefore, it appears that it is more appropriate to predict the fatigue life of soldered joints using the fracture mechanics method.

  4. Simulation of thermomechanical fatigue in solder joints

    Energy Technology Data Exchange (ETDEWEB)

    Fang, H.E.; Porter, V.L.; Fye, R.M.; Holm, E.A. [Sandia National Labs., Albuquerque, NM (United States)

    1997-12-31

    Thermomechanical fatigue (TMF) is a very complex phenomenon in electronic component systems and has been identified as one prominent degradation mechanism for surface mount solder joints in the stockpile. In order to precisely predict the TMF-related effects on the reliability of electronic components in weapons, a multi-level simulation methodology is being developed at Sandia National Laboratories. This methodology links simulation codes of continuum mechanics (JAS3D), microstructural mechanics (GLAD), and microstructural evolution (PARGRAIN) to treat the disparate length scales that exist between the macroscopic response of the component and the microstructural changes occurring in its constituent materials. JAS3D is used to predict strain/temperature distributions in the component due to environmental variable fluctuations. GLAD identifies damage initiation and accumulation in detail based on the spatial information provided by JAS3D. PARGRAIN simulates the changes of material microstructure, such as the heterogeneous coarsening in Sn-Pb solder, when the component`s service environment varies.

  5. Lead free solder mechanics and reliability

    CERN Document Server

    Pang, John Hock Lye

    2012-01-01

    Lead-free solders are used extensively as interconnection materials in electronic assemblies and play a critical role in the global semiconductor packaging and electronics manufacturing industry. Electronic products such as smart phones, notebooks and high performance computers rely on lead-free solder joints to connect IC chip components to printed circuit boards. Lead Free Solder: Mechanics and Reliability provides in-depth design knowledge on lead-free solder elastic-plastic-creep and strain-rate dependent deformation behavior and its application in failure assessment of solder joint reliability. It includes coverage of advanced mechanics of materials theory and experiments, mechanical properties of solder and solder joint specimens, constitutive models for solder deformation behavior; numerical modeling and simulation of solder joint failure subject to thermal cycling, mechanical bending fatigue, vibration fatigue and board-level drop impact tests. This book also: Discusses the mechanical prope...

  6. In-situ study of electromigration-induced grain rotation in Pb-free solder joint by synchrotron microdiffraction

    Energy Technology Data Exchange (ETDEWEB)

    Chen, Kai; Tamura, Nobumichi; Tu, King-Ning

    2008-10-31

    The rotation of Sn grains in Pb-free flip chip solder joints hasn't been reported in literature so far although it has been observed in Sn strips. In this letter, we report the detailed study of the grain orientation evolution induced by electromigration by synchrotron based white beam X-ray microdiffraction. It is found that the grains in solder joint rotate more slowly than in Sn strip even under higher current density. On the other hand, based on our estimation, the reorientation of the grains in solder joints also results in the reduction of electric resistivity, similar to the case of Sn strip. We will also discuss the reason why the electric resistance decreases much more in strips than in the Sn-based solders, and the different driving force for the grain growth in solder joint and in thin film interconnect lines.

  7. Study on laser and hot air reflow soldering of PBGA solder ball

    Institute of Scientific and Technical Information of China (English)

    田艳红; 王春青

    2002-01-01

    Laser and hot air reflow soldering of PBGA solder ball was investigated. Experimental results showed that surface quality and shear strength of solder bump reflowed by laser was superior than the solder bump by hot air, and the microstructure within the solder bump reflowed by laser was much finer. Analysis on interfacial reaction showed that eutectic solder reacted with Au/Ni/Cu pad shortly after the solder was melted. Interface of solder bump reflowed by laser consists of a continuous AuSn4 layer and remnant Au element. Needle-like AuSn4 grew sidewise from interface, and then spread out to the entire interface region. A thin layer of Ni3Sn4 intermetallic compound was found at the interface of solder bump reflowed by hot air, and AuSn4 particles distributed within the whole solder bump randomly. The combination effect of the continuous AuSn4 layer and finer eutectic microstructure contributes to the higher shear strength of solder bump reflowed by laser.

  8. Al and Si Alloying Effect on Solder Joint Reliability in Sn-0.5Cu for Automotive Electronics

    Science.gov (United States)

    Hong, Won Sik; Oh, Chulmin; Kim, Mi-Song; Lee, Young Woo; Kim, Hui Joong; Hong, Sung Jae; Moon, Jeong Tak

    2016-08-01

    To suppress the bonding strength degradation of solder joints in automotive electronics, we proposed a mid-temperature quaternary Pb-free Sn-0.5Cu solder alloy with minor Pd, Al, Si and Ge alloying elements. We manufactured powders and solder pastes of Sn-0.5Cu-(0.01,0.03)Al-0.005Si-(0.006-0.007)Ge alloys (T m = 230°C), and vehicle electronic control units used for a flame-retardant-4 printed circuit board with an organic solderability preservative finish were assembled by a reflow soldering process. To investigate the degradation properties of solder joints used in engine compartments, thermal cycling tests were conducted from -40°C to 125°C (10 min dwell) for 1500 cycles. We also measured the shear strength of the solder joints in various components and observed the microstructural evolution of the solder joints. Based on these results, intermetallic compound (IMC) growth at the solder joints was suppressed by minor Pd, Al and Si additions to the Sn-0.5Cu alloy. After 1500 thermal cycles, IMC layers thicknesses for 100 parts per million (ppm) and 300 ppm Al alloy additions were 6.7 μm and 10 μm, compared to the as-reflowed bonding thicknesses of 6 μm and 7 μm, respectively. Furthermore, shear strength degradation rates for 100 ppm and 300 ppm Al(Si) alloy additions were at least 19.5%-26.2%. The cause of the improvement in thermal cycling reliability was analyzed using the (Al,Cu)-Sn, Si-Sn and Al-Sn phases dispersed around the Cu6Sn5 intermetallic at the solder matrix and bonding interfaces. From these results, we propose the possibility of a mid-temperature Sn-0.5Cu(Pd)-Al(Si)-Ge Pb-free solder for automotive engine compartment electronics.

  9. Effect of rare earth Ce on the fatigue life of SnAgCu solder joints in WLCSP device using FEM and experiments

    International Nuclear Information System (INIS)

    With the addition of 0.03 wt% rare earth Ce, in our previous works, the properties of SnAgCu solder were enhanced obviously. Based on the Garofalo–Arrhenius creep constitutive model, finite element method was used to simulate the stress–strain response during thermal cycle loading, and combined with the fatigue life prediction models, the fatigue life of SnAgCu/SnAgCuCe solder joints was calculated respectively, which can demonstrate the effect of the rare earth Ce on the fatigue life of SnAgCu solder joints. The results indicated that the maximum stress–strain can be found on the top surface of the corner solder joint, and the warpage of the PCB substrate occurred during thermal cycle loading. The trends obtained from modeling results have a good agreement with the experimental data reported in the literature for WLCSP devices. In addition, the stress–strain of SnAgCuCe solder joints is lower than that of SnAgCu solder joints. The thermal fatigue lives of solder joints calculated based on the creep model and creep strain energy density model show that the fatigue life of SnAgCuCe solder joints is higher than the SnAgCu solder joints. The fatigue life of SnAgCuCe solder joints can be enhanced significantly with the addition of Ce, is 30.2% higher than that of SnAgCu solder joints, which can be attributed to the CeSn3 particles formed resisting the motion of dislocation; moreover, the refinement of microstructure and the IMC sizes also contribute to the enhancement of fatigue life, which elucidates that SnAgCuCe solder can be utilized in electronic industry with high reliability replacing the SnAgCu solder

  10. Nano-soldering to single atomic layer

    Science.gov (United States)

    Girit, Caglar O.; Zettl, Alexander K.

    2011-10-11

    A simple technique to solder submicron sized, ohmic contacts to nanostructures has been disclosed. The technique has several advantages over standard electron beam lithography methods, which are complex, costly, and can contaminate samples. To demonstrate the soldering technique graphene, a single atomic layer of carbon, has been contacted, and low- and high-field electronic transport properties have been measured.

  11. Effects of voids on thermal-mechanical reliability of lead-free solder joints

    OpenAIRE

    Benabou Lahouari; Le Van Nhat; Sun Zhidan; Pougnet Philippe; Etgens Victor

    2014-01-01

    Reliability of electronic packages has become a major issue, particularly in systems used in electrical or hybrid cars where severe operating conditions must be met. Many studies have shown that solder interconnects are critical elements since many failure mechanisms originate from their typical response under thermal cycles. In this study, effects of voids in solder interconnects on the electronic assembly lifetime are estimated based on finite element simulations.

  12. Effects of voids on thermal-mechanical reliability of lead-free solder joints

    Directory of Open Access Journals (Sweden)

    Benabou Lahouari

    2014-06-01

    Full Text Available Reliability of electronic packages has become a major issue, particularly in systems used in electrical or hybrid cars where severe operating conditions must be met. Many studies have shown that solder interconnects are critical elements since many failure mechanisms originate from their typical response under thermal cycles. In this study, effects of voids in solder interconnects on the electronic assembly lifetime are estimated based on finite element simulations.

  13. Climate specific thermomechanical fatigue of flat plate photovoltaic module solder joints

    Energy Technology Data Exchange (ETDEWEB)

    Bosco, Nick; Silverman, Timothy J.; Kurtz, Sarah

    2016-07-01

    FEM simulations of PbSn solder fatigue damage are used to evaluate seven cities that represent a variety of climatic zones. It is shown that the rate of solder fatigue damage is not ranked with the cities' climate designations. For an accurate ranking, the mean maximum daily temperature, daily temperature change and a characteristic of clouding events are all required. A physics-based empirical equation is presented that accurately calculates solder fatigue damage according to these three factors. An FEM comparison of solder damage accumulated through service and thermal cycling demonstrates the number of cycles required for an equivalent exposure. For an equivalent 25-year exposure, the number of thermal cycles (-40 degrees C to 85 degrees C) required ranged from roughly 100 to 630 for the cities examined. It is demonstrated that increasing the maximum cycle temperature may significantly reduce the number of thermal cycles required for an equivalent exposure.

  14. Inspection of the Spirometric Parameters and the Frequency of Respiratory Symptoms in Soldering Workers of a Factory Producing Electronic Appliances

    Directory of Open Access Journals (Sweden)

    E Safavi

    2005-07-01

    Full Text Available Introduction: Regarding the numerous problems of solderers in electronic industries because of their exposure to Acids, bases and fumes of soldering ,a study was carried out on107 solderers and administrative personels of a factory producing electronic appliances in Tehran to inspect the long term effects of soldering on lung functions Inspection. Methods: At first ,47 solderers and 66 controls (totally 107 persons were selected randomly. All the solderers were working in the manual soldering section and used the soldering wire made of an alloy (composed of plumbum, Stannum and special oil of soldering called flux . The persons controls worked in the administrative sections of the same factory and for the same hours as the solderers , but they did not have any soldering experience. After they filled the standard respiratory questionnaire , spirometry was done at least 3 times on each of them under the same conditions and according to the ACT criteria (No smokers included in the study Results:The spirometry parameters of the two groups were compared . There was a significant difference in the average FEF 25 : 75% (P=0.03.Also ,there was a significant difference in the average FEV1/FVC P=0.026 and PEFR (P=0.04between two groups .After controling the altering age factor . ameaningful relation between the years of work in soldering section and decrease in the spirometry parameters related to FED 25-75% and FEV1/FVC was seem . Also . the frequency of the signs of nasal and eyes initation in the solderer group was more than the other group (p=0.007 Cough and Asthma related to ork had no meaningful difference in the two groups . Conclsion :It seem that in the above study , soldering is a factor decreasing the spirometry parameters with a blocking pattern , especilly in smal airways . This study was done in the direction of the former studies done in other countries and emphasizes on the need for necessary preventive action in this profession , uch as

  15. New Candidates for Plant-Based Repellents Against Aedes aegypti.

    Science.gov (United States)

    Misni, Norashiqin; Nor, Zurainee Mohamed; Ahmad, Rohani

    2016-06-01

    Based on an ethnobotanical study on use for plant species against mosquito bites in the Kota Tinggi District, Johor State, Malaysia, 3 plants selected for study, Citrus aurantifolia (leaves), Citrus grandis (fruit peel), and Alpinia galanga (rhizome), were extracted using hydrodistillation to produce essential oils. These essential oils were then formulated as a lotion using a microencapsulation process and then tested for their repellent effect against Aedes aegypti. N,N-diethyl-m-toluamide (deet) was also prepared in the same formulation and tested for repellency as controls. Four commercial plant-based repellent (KAPS(®), MozAway(®), BioZ Natural(®), and Mosiquard(®)) also were incorporated in the bioassay for comparison purposes. Bioassays revealed that at 20% concentration all repellent formulations demonstrated complete protection for 2 h and >90% for 4 h post-application. The A. galanga-based formulation provided the greatest level of protection (98.91%), which extended for 4 h post-application and was not significantly different from deet at similar concentration. When compared with commercial plant-based repellents (KAPS(®), MozAway(®), and BioZ Natural(®)), the 3 lotion formulations showed significantly better protection against Ae. aegypti bites, providing >90% protection for 4 h. In conclusion, our 3 plant-based lotion formulations provided acceptable levels of protection against host-seeking Ae. aegypti and should be developed. PMID:27280349

  16. Reliability of Wind Turbine Components-Solder Elements Fatigue Failure

    DEFF Research Database (Denmark)

    Kostandyan, Erik; Sørensen, John Dalsgaard

    2012-01-01

    The physics of failure for electrical components due to temperature loading is described. The main focus is on crack propagation in solder joints and damage accumulation models based on the Miner’s rule. Two models are proposed that describe the initial accumulated plastic strain depending...... on the temperature mean and temperature range. Constant terms and model errors are estimated. The proposed methods are useful to predict damage values for solder joint in power electrical components. Based on the proposed methods it is described how to find the damage level for a given temperature loading profile....... The proposed methods are discussed for application in reliability assessment of Wind Turbine’s electrical components considering physical, model and measurement uncertainties. For further research it is proposed to evaluate damage criteria for electrical components due to the operational temperature...

  17. Numerical simulation of soldered joints and reliability analysis of PLCC components with J-shape leads

    Institute of Scientific and Technical Information of China (English)

    Zhang Liang; Xue Songbai; Lu Fangyan; Han Zongjie; Wang Jianxin

    2008-01-01

    This paper deals with a study on SnPb and lead-free soldered joint reliability of PLCC devices with different lead counts under three kinds of temperature cycle profiles, which is based on non-linear finite element method. By analyzing the stress of soldered joints, it is found that the largest stress is at the area between the soldered joints and the leads, and analysis results indicate that the von Mises stress at the location slightly increases with the increase of lead counts. For PLCC with 84 leads the soldered joints was modeled for three typical loading (273-398 K, 218-398 K and 198-398 K) in order to study the influence of acceleration factors on the reliability of soldered joints. And the estimation of equivalent plastic strain of three different lead-free solder alloys (Sn3.8Ag0.7Cu, Sn3.5Ag and Sn37Pb) was also carried out.

  18. A Novel Technique for the Connection of Ceramic and Titanium Implant Components Using Glass Solder Bonding

    Directory of Open Access Journals (Sweden)

    Enrico Mick

    2015-07-01

    Full Text Available Both titanium and ceramic materials provide specific advantages in dental implant technology. However, some problems, like hypersensitivity reactions, corrosion and mechanical failure, have been reported. Therefore, the combining of both materials to take advantage of their pros, while eliminating their respective cons, would be desirable. Hence, we introduced a new technique to bond titanium and ceramic materials by means of a silica-based glass ceramic solder. Cylindrical compound samples (Ø10 mm × 56 mm made of alumina toughened zirconia (ATZ, as well as titanium grade 5, were bonded by glass solder on their end faces. As a control, a two-component adhesive glue was utilized. The samples were investigated without further treatment, after 30 and 90 days of storage in distilled water at room temperature, and after aging. All samples were subjected to quasi-static four-point-bending tests. We found that the glass solder bonding provided significantly higher bending strength than adhesive glue bonding. In contrast to the glued samples, the bending strength of the soldered samples remained unaltered by the storage and aging treatments. Scanning electron microscopy (SEM and energy-dispersive X-ray (EDX analyses confirmed the presence of a stable solder-ceramic interface. Therefore, the glass solder technique represents a promising method for optimizing dental and orthopedic implant bondings.

  19. Solderability of Electrodeposited Fe-Ni Alloys with Eutectic SnAgCu Solder

    Institute of Scientific and Technical Information of China (English)

    2007-01-01

    Solderabilities of electrodeposited Fe-Ni alloys with SnAgCu solder were examined by wetting balance measurements and compared to those of pure Ni and pure Fe platings. Excellent solderability was found on the Ni-52Fe plating as both the wetting force and kinetics approached or exceeded those on the pure Ni. However,upon further increase in Fe content to 75 at. pct, the solderability of the alloy was severely degraded even though it was still better than that of the pure Feplating. X-ray photoelectron spectroscopy showed that such a strong dependence of solderability on Fe content is related to the much thinner, incomplete oxide coverage of Ni-rich plating surface.

  20. Age-aware solder performance models : level 2 milestone completion.

    Energy Technology Data Exchange (ETDEWEB)

    Neilsen, Michael K.; Vianco, Paul Thomas; Neidigk, Matthew Aaron; Holm, Elizabeth Ann

    2010-09-01

    Legislated requirements and industry standards are replacing eutectic lead-tin (Pb-Sn) solders with lead-free (Pb-free) solders in future component designs and in replacements and retrofits. Since Pb-free solders have not yet seen service for long periods, their long-term behavior is poorly characterized. Because understanding the reliability of Pb-free solders is critical to supporting the next generation of circuit board designs, it is imperative that we develop, validate and exercise a solder lifetime model that can capture the thermomechanical response of Pb-free solder joints in stockpile components. To this end, an ASC Level 2 milestone was identified for fiscal year 2010: Milestone 3605: Utilize experimentally validated constitutive model for lead-free solder to simulate aging and reliability of solder joints in stockpile components. This report documents the completion of this milestone, including evidence that the milestone completion criteria were met and a summary of the milestone Program Review.

  1. Experimental characterization of the mechanical behavior of two solder alloys for high temperature power electronics applications

    OpenAIRE

    Msolli, Sabeur; Alexis, Joël; Dalverny, Olivier; Karama, Moussa

    2015-01-01

    An experimental investigation of two potential candidate materials for the diamond die attachment is presented in this framework. These efforts are motivated by the need of developing a power electronic packaging for the diamond chip. The performance of the designed packaging relies particularly on the specific choice of the solder alloys for the die/substrate junction. To implement a high temperature junction, AuGe and AlSi eutectic alloys were chosen as die attachment and characterized expe...

  2. Effect of Preconditioning and Soldering on Failures of Chip Tantalum Capacitors

    Science.gov (United States)

    Teverovsky, Alexander A.

    2014-01-01

    Soldering of molded case tantalum capacitors can result in damage to Ta205 dielectric and first turn-on failures due to thermo-mechanical stresses caused by CTE mismatch between materials used in the capacitors. It is also known that presence of moisture might cause damage to plastic cases due to the pop-corning effect. However, there are only scarce literature data on the effect of moisture content on the probability of post-soldering electrical failures. In this work, that is based on a case history, different groups of similar types of CWR tantalum capacitors from two lots were prepared for soldering by bake, moisture saturation, and longterm storage at room conditions. Results of the testing showed that both factors: initial quality of the lot, and preconditioning affect the probability of failures. Baking before soldering was shown to be effective to prevent failures even in lots susceptible to pop-corning damage. Mechanism of failures is discussed and recommendations for pre-soldering bake are suggested based on analysis of moisture characteristics of materials used in the capacitors' design.

  3. An Evaluation Method for Tensile Characteristics of Cu/Sn IMCs Using Miniature Composite Solder Specimen

    Science.gov (United States)

    Ohguchi, Ken-ichi; Kurosawa, Kengo

    2016-06-01

    In design of electronic packages, finite-element method (FEM) analysis for evaluating the strength and reliability of solder joints should be conducted with consideration of the presence of Cu/Sn intermetallic compounds (IMCs) generated at the interface between solder and copper wiring. To conduct such analysis accurately, the deformation characteristics of Cu/Sn IMCs must be clarified by conducting tensile tests. This paper describes a method to evaluate tensile characteristics of Cu/Sn IMCs. The method employs a composite specimen with first outer layer of Cu, second layer of Cu/Sn IMCs, and core of Sn-3.0Ag-0.5Cu lead-free solder. The specimen is made by a method in which a copper-plated solder specimen is heat treated at 453 K to generate Cu/Sn IMCs between the solder and copper. Tensile tests were conducted using the composite specimen. After the tests, the fracture appearance and characteristics of the stress-strain relations of the specimens were investigated. Based on the results, a numerical method based on the rule of mixtures (ROM) is proposed to estimate the stress-strain relation of Cu/Sn IMCs under tensile loading.

  4. Fundamentals of lead-free solder interconnect technology from microstructures to reliability

    CERN Document Server

    Lee, Tae-Kyu; Kim, Choong-Un; Ma, Hongtao

    2015-01-01

    This unique book provides an up-to-date overview of the fundamental concepts behind lead-free solder and interconnection technology. Readers will find a description of the rapidly increasing presence of electronic systems in all aspects of modern life as well as the increasing need for predictable reliability in electronic systems. The physical and mechanical properties of lead-free solders are examined in detail, and building on fundamental science, the mechanisms responsible for damage and failure evolution, which affect reliability of lead-free solder joints are identified based on microstructure evolution.  The continuing miniaturization of electronic systems will increase the demand on the performance of solder joints, which will require new alloy and processing strategies as well as interconnection design strategies. This book provides a foundation on which improved performance and new design approaches can be based.  In summary, this book:  Provides an up-to-date overview on lead-free soldering tech...

  5. Single-wall carbon nanotube (SWCNT) functionalized Sn-Ag-Cu lead-free composite solders

    International Nuclear Information System (INIS)

    Sn-3.8Ag-0.7Cu-based composite solders functionalized with single-wall carbon nanotubes (SWCNTs) with various weight proportions ranging from 0.01 to 1 wt% were successfully produced. The microstuctural, melting and mechanical properties of Sn-3.8Ag-0.7Cu-based composite solders were evaluated as a function of different wt% of SWCNT addition. The microstructures of the composite specimens were studied by means of field-emission scanning electron microscope (FE-SEM). It was observed that SWCNTs were homogeneously distributed at the edges of Ag3Sn compounds that are distributed evenly in the β-Sn solder matrix. Energy dispersion X-ray (EDX) analysis method was employed to reveal the presence of the phases existed in the solder composites. The mechanical properties of the composite solders were evaluated by Vickers-microhardness measurements and tensile tests performed at room temperature. The different wt% and addition of SWCNTs to Sn-3.8Ag-0.7Cu produced a dramatic increase in tensile strength, hardness, and better melting characteristics. A slight decrease in elongation to failure was observed. FE-SEM observations of the fracture surface, revealed the overall failure mechanism as the ductile manner of failure

  6. Calibration of the Gaia RVS from ground-based observations of candidate standard stars

    OpenAIRE

    Chemin, L.; Soubiran, C.; Crifo, Françoise; Jasniewicz, Gérard; Katz, David; Hestroffer, Daniel; Udry, Stéphane

    2011-01-01

    International audience The Radial Velocity Spectrometer (RVS) on board of Gaia will perform a large spectroscopic survey to determine the radial velocities of some 1.5 × 10^8 stars. We present the status of ground-based observations of a sample of 1420 candidate standard stars designed to calibrate the RVS. Each candidate star has to be observed several times before Gaia launch (and at least once during the mission) to ensure that its radial velocity remains stable during the whole mission...

  7. Calibration of the Gaia Radial Velocity Spectrometer from ground-based observations of candidate standard stars

    OpenAIRE

    Chemin, L.; Soubiran, C.; Crifo, F.; Jasniewicz, G.; Katz, D.; Hestroffer, D.; Udry, S.

    2011-01-01

    The Radial Velocity Spectrometer (RVS) on board of Gaia will perform a large spectroscopic survey to determine the radial velocities of some 1.5x10^8 stars. We present the status of ground-based observations of a sample of 1420 candidate standard stars designed to calibrate the RVS. Each candidate star has to be observed several times before Gaia launch (and at least once during the mission) to ensure that its radial velocity remains stable during the whole mission. Observations are performed...

  8. A three-dimensional measurement method based on mesh candidates assisted with structured light

    Science.gov (United States)

    Xu, Gang; Zhang, Wenming; Li, Haibin; Liu, Bin

    2009-07-01

    Rendering three-dimensional information of a scene from optical measurement is very important for a wide variety of applications such as robot navigation, rapid prototyping, medical imaging, industrial inspection, etc. In this paper, a new 3D measurement method based on mesh candidate with structured light illuminating is proposed. The vision sensor consists of two CCD cameras and a DLP projector. The measurement system combines the technology of binocular stereo vision and structured light, so as to simplify the process of acquiring depth information using mesh candidates. The measurement method is based on mesh candidates which represent the potential depth in the three dimensional scene. First the mesh grid was created along the direction of axes in world coordinate system, and the nodes were considered as depth candidates on the surface of object. Then each group of the mesh nodes varying along z axis were mapped to the captured image planes of both cameras. At last, according to the similarity measure of the corresponding pixel pairs, the depth of the object surface can be obtained. The matching process is between the pixels in both camera planes corresponding to the spatial mesh candidates. Aided by the structured light pattern, the accuracy of measurement system improved. Appending the periodic sawtooth pattern on the scene by structured light made measurement easier, while the computational cost did not increased since the projector had no need to be calibrated. The 3DS MAX and Matlab software were used to simulate measurement system and reconstruct the surface of the object. After the positioned cameras have been calibrated using Matlab calibration toolbox, the projector is used to project structured light pattern on the scene. Indicated by experimental results, the mesh-candidate-based method is obviously superior in computation and accuracy. Compared with traditional methods based on image matching, our method has several advantages: (1) the complex

  9. Microstructural evolution of eutectic Au-Sn solder joints

    Energy Technology Data Exchange (ETDEWEB)

    Song, Ho Geon

    2002-05-31

    Current trends toward miniaturization and the use of lead(Pb)-free solder in electronic packaging present new problems in the reliability of solder joints. This study was performed in order to understand the microstructure and microstructural evolution of small volumes of nominally eutectic Au-Sn solder joints (80Au-20Sn by weight), which gives insight into properties and reliability.

  10. Effect of Solder Flux Residues on Corrosion of Electronics

    DEFF Research Database (Denmark)

    Hansen, Kirsten Stentoft; Jellesen, Morten Stendahl; Møller, Per;

    2009-01-01

    Flux from ‘No Clean’ solder processes can cause reliability problems in the field due to aggressive residues, which may be electrical conducting or corrosive in humid environments. The solder temperature during a wave solder process is of great importance to the amount of residues left on a PCBA[...

  11. Efforts to Develop a 300°C Solder

    Energy Technology Data Exchange (ETDEWEB)

    Norann, Randy A [Perma Works LLC

    2015-01-25

    This paper covers the efforts made to find a 300°C electrical solder solution for geothermal well monitoring and logging tools by Perma Works LLC. This paper covers: why a high temperature solder is needed, what makes for a good solder, testing flux, testing conductive epoxy and testing intermetallic bonds. Future areas of research are suggested.

  12. Microstructural evolution of eutectic Au-Sn solder joints

    OpenAIRE

    Song, Ho Geon

    2002-01-01

    Current trends toward miniaturization and the use of lead(Pb)-free solder in electronic packaging present new problems in the reliability of solder joints. This study was performed in order to understand the microstructure and microstructural evolution of small volumes of nominally eutectic Au-Sn solder joints (80Au-20Sn by weight), which gives insight into properties and reliability.

  13. A novel method for direct solder bump pull testing using lead-free solders

    Science.gov (United States)

    Turner, Gregory Alan

    This thesis focuses on the design, fabrication, and evaluation of a new method for testing the adhesion strength of lead-free solders, named the Isotraction Bump Pull method (IBP). In order to develop a direct solder joint-strength testing method that did not require customization for different solder types, bump sizes, specific equipment, or trial-and-error, a combination of two widely used and accepted standards was created. First, solder bumps were made from three types of lead free solder were generated on untreated copper PCB substrates using an in-house fabricated solder bump-on-demand generator, Following this, the newly developed method made use of a polymer epoxy to encapsulate the solder bumps that could then be tested under tension using a high precision universal vertical load machine. The tests produced repeatable and predictable results for each of the three alloys tested that were in agreement with the relative behavior of the same alloys using other testing methods in the literature. The median peak stress at failure for the three solders tested were 2020.52 psi, 940.57 psi, and 2781.0 psi, and were within one standard deviation of the of all data collected for each solder. The assumptions in this work that brittle fracture occurred through the Intermetallic Compound layer (IMC) were validated with the use of Energy-Dispersive X-Ray Spectrometry and high magnification of the fractured surface of both newly exposed sides of the test specimens. Following this, an examination of the process to apply the results from the tensile tests into standard material science equations for the fracture of the systems was performed..

  14. Microstructure and In Situ Observations of Undercooling for Nucleation of β-Sn Relevant to Lead-Free Solder Alloys

    OpenAIRE

    Elmer, John W.; Specht, Eliot D.; Kumar, Mukul

    2010-01-01

    Difficult nucleation of β-Sn during solidification of tin and tin-based lead-free solder alloys can result in high degrees of undercooling of the liquid prior to solidification. The undercooling can produce solder joints with large grains, anisotropic behavior, and undesirable mechanical properties. This paper describes our examination of the amount of undercooling of tin on both graphite (non-wetting) and copper (wetting) surfaces using in situ x-ray diffraction. The microstructure was furth...

  15. Multistate Degradation Mo del for Prognostics of Solder Joints Under Vibration Conditions

    Institute of Scientific and Technical Information of China (English)

    TANG Wei; JING Bo; HUANG Yifeng; SHENG Zengjin; JIAO Xiaoxuan

    2016-01-01

    This paper develops a multistate degra-dation structure of the solder joints which can be used under various vibration conditions based on nonhomoge-neous continuous-time hidden semi-Markov process. The parameters of the structure were estimated to illustrate the stochastic relationship between the degradation pro-cess and the monitoring indicator by using unsupervised learning methods. Random vibration tests on solder joints with different levels of power spectral density and fixed forms were conducted with a real time monitoring electri-cal resistance to examine the suitability of the model. It was experimentally verified that the multistate degrada-tion structure matches the experimental process reason-ably and accurately. Based on this multistate degradation model, the online prognostics of solder joint were analyzed and the results indicated that faults or failures can be de-tected timely, leading to appreciate maintenance actions scheduled to avoid catastrophic failures of electronics.

  16. Wetting and Soldering Behavior of Eutectic Au-Ge Alloy on Cu and Ni Substrates

    Science.gov (United States)

    Leinenbach, C.; Valenza, F.; Giuranno, D.; Elsener, H. R.; Jin, S.; Novakovic, R.

    2011-07-01

    Au-Ge-based alloys are interesting as novel high-temperature lead-free solders because of their low melting point, good thermal and electrical conductivity, and high corrosion resistance. In the present work, the wetting and soldering behavior of the eutectic Au-28Ge (at.%) alloy on Cu and Ni substrates have been investigated. Good wetting on both substrates with final contact angles of 13° to 14° was observed. In addition, solder joints with bond shear strength of 30 MPa to 35 MPa could be produced under controlled conditions. Cu substrates exhibit pronounced dissolution into the Au-Ge filler metal. On Ni substrates, the NiGe intermetallic compound was formed at the filler/substrate interface, which prevents dissolution of Ni into the solder. Using thin filler metal foils (25 μm), complete consumption of Ge in the reaction at the Ni interface was observed, leading to the formation of an almost pure Au layer in the soldering zone.

  17. Capillary wave formation on excited solder jet and fabrication of lead-free solder ball

    Institute of Scientific and Technical Information of China (English)

    ZHANG Shu-guang; HE Li-jun; ZHU Xue-xin; ZHANG Shao-ming; SHI Li-kai; XU Jun

    2005-01-01

    A survey of solder ball production processes especially focusing on disturbed molten metal jet breakup process was made. Then the formation of capillary wave on tin melt jet in the way of rapid solidification was studied. A semi-empirical formula, which can be written as λ = Cvib (σ/ρ)1/3f-2/3 to predict the relationship between wavelength of capillary wave and frequency of imposed vibration was obtained. Sn-4.0Ag-0.5Cu lead free solder ball was successfully produced with tight distribution and good sphericity. The excited jet breakup process is promising for cost effectively producing solder ball.

  18. Solder Joint Health Monitoring Testbed System

    Science.gov (United States)

    Delaney, Michael M.

    2009-01-01

    The density and pin count for Field Programmable Gate Arrays (FPGAs) has been increasing, and has exceeded current methods of solder joint inspection, making early detection of failures more problematic. These failures are a concern for both flight safety and maintenance in commercial aviation. Ridgetop Group, Inc. has developed a method for detecting solder joint failures in real time. The NASA Dryden Flight Research Center is developing a set of boards to test this method in ground environmental and accelerated testing as well as flight test on a Dryden F-15 or F-18 research aircraft. In addition to detecting intermittent and total solder joint failures, environmental data on the boards, such as temperature and vibration, will be collected and time-correlated to aircraft state data. This paper details the technical approach involved in the detection process, and describes the design process and products to date for Dryden s FPGA failure detection boards.

  19. Lead (Pb)-Free Solder Applications

    Energy Technology Data Exchange (ETDEWEB)

    VIANCO,PAUL T.

    2000-08-15

    Legislative and marketing forces both abroad and in the US are causing the electronics industry to consider the use of Pb-free solders in place of traditional Sn-Pb alloys. Previous case studies have demonstrated the satisfactory manufacturability and reliability of several Pb-free compositions for printed circuit board applications. Those data, together with the results of fundamental studies on Pb-free solder materials, have indicated the general feasibility of their use in the broader range of present-day, electrical and electronic components.

  20. Dissolution and Interfacial Reactions of (Cu,Ni)6Sn5 Intermetallic Compound in Molten Sn-Cu-Ni Solders

    Science.gov (United States)

    Wang, Chao-hong; Lai, Wei-han; Chen, Sinn-wen

    2014-01-01

    (Cu,Ni)6Sn5 is an important intermetallic compound (IMC) in lead-free Sn-Ag-Cu solder joints on Ni substrate. The formation, growth, and microstructural evolution of (Cu,Ni)6Sn5 are closely correlated with the concentrations of Cu and Ni in the solder. This study reports the interfacial behaviors of (Cu,Ni)6Sn5 IMC (Sn-31 at.%Cu-24 at.%Ni) with various Sn-Cu, Sn-Ni, and Sn-Cu-Ni solders at 250°C. The (Cu,Ni)6Sn5 substrate remained intact for Sn-0.7 wt.%Cu solder. When the Cu concentration was decreased to 0.3 wt.%, (Cu,Ni)6Sn5 significantly dissolved into the molten solder. Moreover, (Cu,Ni)6Sn5 dissolution and (Ni,Cu)3Sn4 formation occurred simultaneously for the Sn-0.1 wt.%Ni solder. In Sn-0.5 wt.%Cu-0.2 wt.%Ni solder, many tiny (Cu,Ni)6Sn5 particulates were formed and dispersed in the solder matrix, while in Sn-0.3 wt.%Cu-0.2 wt.%Ni a lot of (Ni,Cu)3Sn4 grains were produced. Based on the local equilibrium hypothesis, these results are further discussed based on the liquid-(Cu, Ni)6Sn5-(Ni,Cu)3Sn4 tie-triangle, and the liquid apex is suggested to be very close to Sn-0.4 wt.%Cu-0.2 wt.%Ni.

  1. Single Image Camera Calibration in Close Range Photogrammetry for Solder Joint Analysis

    Science.gov (United States)

    Heinemann, D.; Knabner, S.; Baumgarten, D.

    2016-06-01

    Printed Circuit Boards (PCB) play an important role in the manufacturing of electronic devices. To ensure a correct function of the PCBs a certain amount of solder paste is needed during the placement of components. The aim of the current research is to develop an real-time, closed-loop solution for the analysis of the printing process where solder is printed onto PCBs. Close range photogrammetry allows for determination of the solder volume and a subsequent correction if necessary. Photogrammetry is an image based method for three dimensional reconstruction from two dimensional image data of an object. A precise camera calibration is indispensable for an accurate reconstruction. In our certain application it is not possible to use calibration methods with two dimensional calibration targets. Therefore a special calibration target was developed and manufactured, which allows for single image camera calibration.

  2. High-precision optomechanical lens system for space applications assembled by a local soldering technique

    Science.gov (United States)

    Pleguezuelo, Pol Ribes; Koechlin, Charlie; Hornaff, Marcel; Kamm, Andreas; Beckert, Erik; Fiault, Guillaume; Eberhardt, Ramona; Tünnermann, Andreas

    2016-06-01

    Soldering using metallic solder alloys is an alternative to adhesive bonding. Laser-based soldering processes are especially well suited for the joining of optical components made of fragile and brittle materials such as glass, ceramics, and optical crystals. This is due to a localized and minimized input of thermal energy. Solderjet bumping technology has been used to assemble a lens mount breadboard using specifications and requirements found for the optical beam expander for the European Space Agency EarthCare Mission. The silica lens and a titanium barrel have been designed and assembled with this technology in order to withstand the stringent mission demands of handling high mechanical and thermal loads without losing the optical performance. Finally, a high-precision optomechanical lens mount has been assembled with minimal localized stress (<1 MPa) showing outstanding performance in terms of wave-front error and beam depolarization ratio before and after environmental tests.

  3. Effect of trace elements on the interface reactions between two lead-free solders and copper or nickel substrates

    Directory of Open Access Journals (Sweden)

    Soares D.

    2007-01-01

    Full Text Available Traditional Sn-Pb solder alloys are being replaced, because of environmental and health concerns about lead toxicity. Among some alternative alloy systems, the Sn-Zn and Sn-Cu base alloy systems have been studied and reveal promising properties. The reliability of a solder joint is affected by the solder/substrate interaction and the nature of the layers formed at the interface. The solder/substrate reactions, for Sn-Zn and Sn-Cu base solder alloys, were evaluated in what concerns the morphology and chemical composition of the interface layers. The effect of the addition of P, at low levels, on the chemical composition of the layers present at the interface was studied. The phases formed at the interface between the Cu or Ni substrate and a molten lead-free solder at 250ºC, were studied for different stage times and alloy compositions. The melting temperatures, of the studied alloys, were determined by Differential Scanning Calorimetry (DSC. Identification of equilibrium phases formed at the interface layer, and the evaluation of their chemical composition were performed by Scanning Electron Microscopy (SEM/EDS. Different interface characteristics were obtained, namely for the alloys containing Zn. The obtained IML layer thickness was compared, for both types of alloy systems.

  4. Effects of PCB thickness on adjustable fountain wave soldering

    Indian Academy of Sciences (India)

    M S Abdul Aziz; M Z Abdullah; C Y Khor; A Jalar; M A Bakar; W Y W Yusoff; F Che Ani; Nobe Yan; M Zhou; C Cheok

    2015-10-01

    This study investigates the effects of printed circuit board (PCB) thickness on adjustable fountain and conventional wave soldering. The pin-through-hole (PTH) vertical fill is examined with three PCBs of different thicknesses (i.e., 1.6, 3.1, and 6.0 mm) soldered through adjustable fountain and conventional wave soldering at conveyor angles of 0° and 6°. The vertical fill of each PCB is the focus. The PTH solder profile is inspected with a non-destructive X-ray computed tomography scanning machine. The percentages of the PTH vertical fill of both soldering processes are also estimated and compared. The aspect ratio of the PCB is also investigated. Experimental results reveal that adjustable fountain wave soldering yields better vertical fill than conventional wave soldering. The vertical fill level of adjustable fountain wave soldering is 100%, 90%, and 50% for the 1.6, 3.1, and 6.0 mm PCB thickness, respectively. FLUENT simulation is conducted for the vertical fill of the solder profile. Simulation and experimental results show that the PTH solder profiles of the two soldering processes are almost identical. The effect of PCB thickness on PTH voiding is also discussed.

  5. Solder for oxide layer-building metals and alloys

    International Nuclear Information System (INIS)

    A low temperature solder and method for soldering an oxide layer-building metal such as aluminum, titanium, tantalum or stainless steel is disclosed. The composition comprises tin and zinc; germanium as a wetting agent; preferably small amounts of copper and antimony; and a grit, such as silicon carbide. The grit abrades any oxide layer formed on the surface of the metal as the germanium penetrates beneath and loosens the oxide layer to provide good metal-to-metal contact. The germanium comprises less than approximately 10% by weight of the solder composition so that it provides sufficient wetting action but does not result in a melting temperature above approximately 300 C. The method comprises the steps rubbing the solder against the metal surface so the grit in the solder abrades the surface while heating the surface until the solder begins to melt and the germanium penetrates the oxide layer, then brushing aside any oxide layer loosened by the solder

  6. Automatic computer-aided system of simulating solder joint formation

    Science.gov (United States)

    Zhao, Xiujuan; Wang, Chunqing; Zheng, Guanqun; Wang, Gouzhong; Yang, Shiqin

    1999-08-01

    One critical aspect in electronic packaging is the fatigue/creep-induced failure in solder interconnections, which is found to be highly dependent on the shape of solder joints. Thus predicting and analyzing the solder joint shape is warranted. In this paper, an automatic computer-aided system is developed to simulate the formation of solder joint and analyze the influence of the different process parameters on the solder joint shape. The developed system is capable of visually designing the process parameters and calculating the solder joint shape automatically without any intervention from the user. The automation achieved will enable fast shape estimation with the variation of process parameters without time consuming experiments, and the simulating system provides the design and manufacturing engineers an efficient software tools to design soldering process in design environment. Moreover, a program developed from the system can serve as the preprocessor for subsequent finite element joint analysis program.

  7. Finite element simulation for mechanical response of surface mounted solder joints under different temperature cycling

    Institute of Scientific and Technical Information of China (English)

    马鑫; 钱乙余

    2001-01-01

    Nonlinear finite element simulation for mechanical response of surface mounted solder joint under different temperature cycling was carried out. Seven sets of parameters were used in order to evaluate the influence of temperature cycling profile parameters. The results show that temperature cycling history has significant effect on the stress response of the solder joint. Based on the concept of relative damage stress proposed by the authors, it is found that enough high temperature holding time is necessary for designing the temperature cycling profile in accelerated thermal fatigue test.

  8. Thermal loss and soldering effect study of high-Q antennas in handheld devices

    DEFF Research Database (Denmark)

    Bahramzy, Pevand; Jagielski, Ole; Pedersen, Gert Frølund

    2013-01-01

    , in a very good conductor as copper, may be achieved. The effect from solderings on the antenna efficiency is also investigated and the effect has shown to be small. The resistance value, based on the extra loss due to the solderings, is estimated to be 0.25 Ohm. It is also shown that two different high......-Q antennas, having the same Q value, can have difference in efficiency. Furthermore, it is discussed why it is so difficult to compare the electrical size and volume of different antenna types....

  9. Influence of nickel–phosphorus surface roughness on wettability and pores formation in solder joints for high power electronic applications

    Energy Technology Data Exchange (ETDEWEB)

    Vivet, L., E-mail: laurent.vivet@valeo.com [Valeo, Group Electronic Expertise and Development Services, 2 rue André Boulle, 94046 Créteil (France); Joudrier, A.-L. [Institut Lavoisier de Versailles, UMR CNRS 8180, 45 Avenue des Etats-Unis, 78035 Versailles (France); Tan, K.-L.; Morelle, J.-M. [Valeo, Group Electronic Expertise and Development Services, 2 rue André Boulle, 94046 Créteil (France); Etcheberry, A. [Institut Lavoisier de Versailles, UMR CNRS 8180, 45 Avenue des Etats-Unis, 78035 Versailles (France); Chalumeau, L. [Egide, Site industriel du Sactar, 85500 Bollène (France)

    2013-12-15

    Electroless nickel-high-phosphorus Ni–P plating is used as substrate coating in the electronic component technology. The ability to minimize pores formation in solder joints and the wettability of the Ni–P layer remain points of investigation. The qualities and the control of the physical and chemical properties of the deposits are essential for the reliability of the products. In this contribution it has been measured how a controlled change of one property of the Ni–P surface, its average roughness, changes the wettability of this surface before soldering completion, at ambient temperature and under ambient air, and how it contribute to change the amount and size of pores inside solder joints, after soldering completion. Before all, observations of the Ni–P surfaces using scanning electron microscopy have been achieved. Then the wettability has been measured through the determination of both the disperse and the polar fractions of the substrate surface tension, based on the measurements of the wetting angle for droplets of four different liquids, under ambient air and at room temperature (classical sessile drop technique). Finally the X-ray micro-radiography measurements of both the area fraction of pores and the size of the largest pore inside the solder joint of dice laser soldered on the studied substrate, using high melting temperature solder (300 °C, PbSnAg) have been achieved. This study clearly demonstrates that both the ability to minimize pores formation in solder joints and the wettability under ambient conditions of the Ni–P substrate decrease and become more variable when its average roughness increases. These effects can be explained considering the Cassie–Baxter model for rough surface wetting behaviour, completed by the model of heterogeneous nucleation and growth for gas bubbles inside a liquid.

  10. Intelligent computing budget allocation for on-road tra jectory planning based on candidate curves

    Institute of Scientific and Technical Information of China (English)

    Xiao-xin FU; Yong-heng JIANG; De-xian HUANG; Jing-chun WANG; Kai-sheng HUANG

    2016-01-01

    In this paper, on-road trajectory planning is solved by introducing intelligent computing budget allocation (ICBA) into a candidate-curve-based planning algorithm, namely, ordinal-optimization-based differential evolution (OODE). The proposed algorithm is named IOODE with‘I’ representing ICBA. OODE plans the trajectory in two parts: trajectory curve and acceleration profi le. The best trajectory curve is picked from a set of candidate curves, where each curve is evaluated by solving a subproblem with the differential evolution (DE) algorithm. The more iterations DE performs, the more accurate the evaluation will become. Thus, we intelligently allocate the iterations to individual curves so as to reduce the total number of iterations performed. Meanwhile, the selected best curve is ensured to be one of the truly top curves with a high enough probability. Simulation results show that IOODE is 20% faster than OODE while maintaining the same performance in terms of solution quality. The computing budget allocation framework presented in this paper can also be used to enhance the efficiency of other candidate-curve-based planning methods.

  11. New Failure Mode of Flip-Chip Solder Joints Related to the Metallization of an Organic Substrate

    Science.gov (United States)

    Jang, J. W.; Yoo, S. J.; Hwang, H. I.; Yuk, S. Y.; Kim, C. K.; Kim, S. J.; Han, J. S.; An, S. H.

    2015-10-01

    We report a new failure phenomenon during flip-chip die attach. After reflow, flip-chip bumps were separated between the Al and Ti layers on the Si die side. This was mainly observed at the Si die corner. Transmission electron microscopy images revealed corrosion of the Al layer at the edge of the solder bump metallization. The corrosion at the metallization edge exhibited a notch shape with high stress concentration factor. The organic substrate had Cu metallization with an organic solderable preservative (OSP) coating layer, where a small amount of Cl ions were detected. A solder bump separation mechanism is suggested based on the reaction between Al and Cl, related to the flow of soldering flux. During reflow, the flux will dissolve the Cl-containing OSP layer and flow up to the Al layer on the Si die side. Then, the Cl-dissolved flux will actively react with Al, forming AlCl3. During cooling, solder bumps at the Si die corner will separate through the location of Al corrosion. This demonstrated that the chemistry of the substrate metallization can affect the thermomechanical reliability of flip-chip solder joints.

  12. Arc spraying solderable tabs to glass

    Science.gov (United States)

    Lindmayer, J.

    1981-01-01

    Tabs suitable for electrical or mechanical connections in solar cells and integrated circuits are made by spraying technique. Solder wets copper, copper bonds to aluminum, and aluminum adheres to glass. Arc spraying is automated and integrated with encapsulation, eliminating hand tabbing, improving reliability, and reducing cost.

  13. Microwave Tissue Soldering for Immediate Wound Closure

    Science.gov (United States)

    Arndt, G. Dickey; Ngo, Phong H.; Phan, Chau T.; Byerly, Diane; Dusl, John; Sognier, Marguerite A.; Carl, James

    2011-01-01

    A novel approach for the immediate sealing of traumatic wounds is under development. A portable microwave generator and handheld antenna are used to seal wounds, binding the edges of the wound together using a biodegradable protein sealant or solder. This method could be used for repairing wounds in emergency settings by restoring the wound surface to its original strength within minutes. This technique could also be utilized for surgical purposes involving solid visceral organs (i.e., liver, spleen, and kidney) that currently do not respond well to ordinary surgical procedures. A miniaturized microwave generator and a handheld antenna are used to deliver microwave energy to the protein solder, which is applied to the wound. The antenna can be of several alternative designs optimized for placement either in contact with or in proximity to the protein solder covering the wound. In either case, optimization of the design includes the matching of impedances to maximize the energy delivered to the protein solder and wound at a chosen frequency. For certain applications, an antenna could be designed that would emit power only when it is in direct contact with the wound. The optimum frequency or frequencies for a specific application would depend on the required depth of penetration of the microwave energy. In fact, a computational simulation for each specific application could be performed, which would then match the characteristics of the antenna with the protein solder and tissue to best effect wound closure. An additional area of interest with potential benefit that remains to be validated is whether microwave energy can effectively kill bacteria in and around the wound. Thus, this may be an efficient method for simultaneously sterilizing and closing wounds.

  14. Preparation of solder pads by selective laser scanning

    Institute of Scientific and Technical Information of China (English)

    Wenqing Shi; Yongqiang Yang; Yanlu Huang; Guoqiang Wei; Wei Guo

    2009-01-01

    We propose a new laser preparation technique to solder Sn-Ag3.5-Cu0.7 on a copper clad laminate (CCL). The experiment is conducted by selective laser heating and melting the thin solder layer and then preprint-ing it on CCL in order to form the matrix with solder pads. Through the analysis of macro morphology of the matrix with solder pads and microstructure of single pads, this technique is proved to be suitable for preparing solder pads and that the solder pads are of good mechanical properties. The results also reveal that high frequency laser pulse is beneficial to the formation of better solder pad, and that the 12-W fiber laser with a beam diameter of 0.030 mm can solder Sn-Ag3.5-Cu0.7 successfully on CCL at 500-kHz pulse frequency. The optimized parameters of laser soldering on CCL are as follows: the laser power is 12 W, the scanning speed is 1.0 mm/s, the beam diameter is 0.030 mm, the lead-free solder is Sn-Ag3.5-Cu0.7, and the laser pulse frequency is 500 kHz.

  15. Effect of Solder Joint Length on Fracture Under Bending

    Science.gov (United States)

    Akbari, Saeed; Nourani, Amir; Spelt, Jan K.

    2016-01-01

    Fracture tests were conducted on copper-solder-copper joints of various lengths using double-cantilever-beam (DCB) specimens under mode I loading conditions. The thickness and length of the solder joints were large enough to neglect any anisotropy associated with the solder microstructure. It was found that the critical strain energy release rate at crack initiation, G ci, was insensitive to the length of the solder joint; however, for joints shorter than a characteristic length which was a function of the thickness and the mechanical properties of the solder layer and the substrates, the fracture load increased with increasing solder joint length. A sandwich model was developed for the analysis of the stress and strain in solder joints, taking into account the influence of both the bending deformation and the shear deformation of the substrates on the solder joint stresses. Consistent with the experimental results, it was found that solder joints longer than the characteristic length have a maximum peel stress that remains unchanged with joint length, causing the joint strength to become independent of the joint length. A closed-form analytical solution was developed for the characteristic length of DCB specimens under mode I loading. The experimental results were in good agreement with the analytical model and with finite element results. The generality of the G ci failure criterion was demonstrated by comparing the experimental results and the fracture load predictions of mode I DCB solder joints with different lengths.

  16. Candidate Smoke Region Segmentation of Fire Video Based on Rough Set Theory

    Directory of Open Access Journals (Sweden)

    Yaqin Zhao

    2015-01-01

    Full Text Available Candidate smoke region segmentation is the key link of smoke video detection; an effective and prompt method of candidate smoke region segmentation plays a significant role in a smoke recognition system. However, the interference of heavy fog and smoke-color moving objects greatly degrades the recognition accuracy. In this paper, a novel method of candidate smoke region segmentation based on rough set theory is presented. First, Kalman filtering is used to update video background in order to exclude the interference of static smoke-color objects, such as blue sky. Second, in RGB color space smoke regions are segmented by defining the upper approximation, lower approximation, and roughness of smoke-color distribution. Finally, in HSV color space small smoke regions are merged by the definition of equivalence relation so as to distinguish smoke images from heavy fog images in terms of V component value variety from center to edge of smoke region. The experimental results on smoke region segmentation demonstrated the effectiveness and usefulness of the proposed scheme.

  17. Effect of the Soldering Process on the Microstructure and Mechanical Properties of Sn-9Zn/Al Solder Joints

    Science.gov (United States)

    Yao, Yao; Feng, Xue; Jian, Zhou; Zhanying, Feng; Xu, Chen

    2015-08-01

    Tin-zinc solder alloys are considered to be appropriate for soldering of aluminum alloys at low-temperature in electronics and radiators applications. In this paper, the effects of different soldering parameters on the microstructure and interfacial reaction behaviors of 1070Al/Sn-9Zn/1070Al joints were investigated. The results show that the Al substrate was dissolved by the liquid solder, but Al-related intermetallic was not observed in the interface. Two kinds of Al-rich phases formed in the solder matrix. Large butterfly-shaped solid solution (Al)″ phases (about 10 μm) were formed in the liquid alloys, and compact-shaped precipitations (nano-size) were dissolved out from solders during solidification process. With increasing of the soldering time, Al″ phases were migrated upwards in the solders and the amount of this phase increased. In addition, with the increase of the soldering temperature, the dissolution rate of Al into the solder increased and the formation time of (Al)″ phases was reduced. Shear test results indicate when soldered at 250 °C, the shear strength increased from 48.6 MPa to a maximum 60.5 MPa and then decreased to a stable value (about 55 MPa) with increasing of the soldering time. Similar trends were also observed at 300 and 350 °C, while the soldering time needed to obtain maximum shear strength was shortened. The formation of these Al-rich phases improves the shear strength but deteriorates the ductility.

  18. Solder assembly of cantilever bar force or displacement sensors

    OpenAIRE

    Maeder, Thomas; Genoud, Dominique

    2001-01-01

    In this paper, the stability of a displacement sensor assembled with Sn96 (tin- silver) solder, Sn62 (tin-leadsilver) solder or conductive silver-loaded epoxy glue was compared. In the absence of humidity or thermal cycling, the glue was found to be much better than both solders. This is ascribed to better creep behaviour combined with lower elastic modulus and much smaller bond thickness. However, the glue underwent severe degradation in hot, humid air, and is therefore not suitable for...

  19. THERMAL PROCESS OF VACUUM FLUXLESS LASERSOLDERING AND ANALYSIS ON SOLDER SPREADING AND WETTING

    Institute of Scientific and Technical Information of China (English)

    2000-01-01

    In order to study the mechanism of vacuum fluxless soldering on the conditions of laser heating, the method of measuring temperature by the thermocouple is used to analyze the spreading and wetting process of boh fluxless SnPb solder in the vacuum surroundings and flux SnPb solder on Cu pad. Solder spreading and wetting affected by the soldering thermal process is also discussed according to the thermodynamics principle. Results show that vacuum fluxless soldering demands higher temperature, and the fall of the solder su rface tension is the important factor achieving fluxless laser soldering.

  20. Recent Research Trend in Laser-Soldering Process

    Energy Technology Data Exchange (ETDEWEB)

    Kim, Hwan Tae; Kil, Sang Cheol [Korea Institute of Science and Technology Information, Seoul (Korea, Republic of); Hwang, Woon Suk [Inha University, Incheon (Korea, Republic of)

    2009-10-15

    The trend of the microjoining technology by the laser-soldering process has been reviewed. Among the production technologies, joining technology plays an important role in the fabrication of electronic components. This has led to an increasing attention towards the use of modem microjoining technology such as micro-resistance spot joining micro-soldering, micro-friction stir joining and laser-soldering, etc. This review covers the recent technical trends of laser-soldering collected from the COMPENDEX DB analysis of published papers, research subject and research institutes.

  1. Combined Thermodynamic-Kinetic Analysis of the Interfacial Reactions between Ni Metallization and Various Lead-Free Solders

    Directory of Open Access Journals (Sweden)

    Tomi Laurila

    2009-11-01

    Full Text Available In this paper we will demonstrate how a thermodynamic-kinetic method can be utilized to rationalize a wide range of interfacial phenomena between Sn-based lead-free solders and Ni metallizations. First, the effect of P on the interfacial reactions, and thus on the reliability, between Sn-based solders and electroless Ni/immersion Au (ENIG metallizations, will be discussed. Next, the effect of small amounts of Cu in Sn-based solders on the intermetallic compound (IMC, which forms first on top of Ni metallization, will be covered. With the help of thermodynamic arguments a so called critical Cu concentration for the formation of (Cu,Ni6Sn5 can be determined as a function of temperature. Then the important phenomenon of redeposition of (Au,NiSn4 layer on top of Ni3Sn4 IMC will be discussed in detail. The reasons leading to this behaviour will be rationalized with the help of thermodynamic information and an explanation of why this phenomenon does not occur when an appropriate amount of Cu is present in the soldering system will be given. Finally, interfacial reaction issues related to low temperature Sn-Zn and Sn-Bi based solders and Ni metallization will be discussed.

  2. Calibration of the Gaia Radial Velocity Spectrometer from ground-based observations of candidate standard stars

    CERN Document Server

    Chemin, L; Crifo, F; Jasniewicz, G; Katz, D; Hestroffer, D; Udry, S

    2011-01-01

    The Radial Velocity Spectrometer (RVS) on board of Gaia will perform a large spectroscopic survey to determine the radial velocities of some 1.5x10^8 stars. We present the status of ground-based observations of a sample of 1420 candidate standard stars designed to calibrate the RVS. Each candidate star has to be observed several times before Gaia launch (and at least once during the mission) to ensure that its radial velocity remains stable during the whole mission. Observations are performed with the high-resolution spectrographs SOPHIE, NARVAL and CORALIE, completed with archival data of the ELODIE and HARPS instruments. The analysis shows that about 7% of the current catalogue exhibits variations larger than the adopted threshold of 300 m/s. Consequently, those stars should be rejected as reference targets, due to the expected accuracy of the Gaia RVS. Emphasis is also put here on our observations of bright asteroids to calibrate the ground-based velocities by a direct comparison with celestial mechanics. ...

  3. Microstructural and mechanical properties analysis of extruded Sn–0.7Cu solder alloy

    Directory of Open Access Journals (Sweden)

    Abdoul-Aziz Bogno

    2015-01-01

    Full Text Available The properties and performance of lead-free solder alloys such as fluidity and wettability are defined by the alloy composition and solidification microstructure. Rapid solidification of metallic alloys is known to result in refined microstructures with reduced microsegregation and improved mechanical properties of the final products as compared to normal castings. The rapidly solidified Sn-based solders by melt spinning were shown to be suitable for soldering with low temperature and short soldering duration. In the present study, rapidly solidified Sn–0.7 wt.%Cu droplets generated by impulse atomization (IA were achieved as well as directional solidification under transient conditions at lower cooling rate. This paper reports on a comparative study of the rapidly solidified and the directionally solidified samples. Different but complementary characterization techniques were used to fully analyze the solidification microstructures of the samples obtained under the two cooling regimes. These include X-ray diffractometry (XRD and scanning electron microscopy (SEM. In order to compare the tensile strength and elongation to fracture of the directionally solidified ingot and strip castings with the atomized droplet, compaction and extrusion of the latter were carried out. It was shown that more balanced and superior tensile mechanical properties are available for the hot extruded samples from compacted as-atomized Sn–0.7 wt.%Cu droplets. Further, elongation-to-fracture was 2–3× higher than that obtained for the directionally solidified samples.

  4. A quick electrical inspection method of solder joint quality for LED products

    Science.gov (United States)

    Zhang, Jianhua; Que, Xiufu; Liu, Yanan; Chen, Weining; Tao, Guoqiao; Yang, Lianqiao

    2016-06-01

    Solder joint qualities of light-emitting diodes (LED) lamps have a significant effect on their lifetime. Due to variations in LEDs, the product lifetime is determined by the lowest performing component of the product when multi-LEDs are used. In this paper, we propose a quick electrical inspection method of solder joint quality for LED products, which is obtained by the heating curve measurement for a short time with the forward voltage as a temperature sensitive parameter. The utility of this quick inspection method is verified by the measurement of a solder voids ratio based on the most commonly used approaches in the industry—x-ray. The proposed method is cost effective and only needs around 1–5 s for each LED, which is about one third of the x-ray. Therefore, the quick electrical test method is both meaningful and promising especially when carrying out quality tests on large quantities of solder and can be a highly recommended method to be adopted by the LED lighting industry.

  5. Design and Experiment of a Solder Paste Jetting System Driven by a Piezoelectric Stack

    Directory of Open Access Journals (Sweden)

    Shoudong Gu

    2016-06-01

    Full Text Available To compensate for the insufficiency and instability of solder paste dispensing and printing that are used in the SMT (Surface Mount Technology production process, a noncontact solder paste jetting system driven by a piezoelectric stack based on the principle of the nozzle-needle-system is introduced in this paper, in which a miniscule gap exists between the nozzle and needle during the jetting process. Here, the critical jet ejection velocity is discussed through theoretical analysis. The relations between ejection velocity and needle structure, needle velocity, and nozzle diameter were obtained by FLUENT software. Then, the prototype of the solder paste jetting system was fabricated, and the performance was verified by experiments. The effects of the gap between nozzle and needle, the driving voltage, and the nozzle diameter on the jetting performance and droplet diameter were obtained. Solder paste droplets 0.85 mm in diameter were produced when the gap between the nozzle and needle was adjusted to 10 μm, the driving voltage to 80 V, the nozzle diameter to 0.1 mm, and the variation of the droplet diameter was within ±3%.

  6. Effect of Metal Bond-Pad Configurations on the Solder Microstructure Development of Flip-Chip Solder Joints

    Science.gov (United States)

    Hu, Y. J.; Hsu, Y. C.; Huang, T. S.; Lu, C. T.; Wu, Albert T.; Liu, C. Y.

    2014-01-01

    Various microstructural zones were observed in the solidified solder of flip-chip solder joints with three metal bond-pad configurations (Cu/Sn/Cu, Ni/Sn/Cu, and Cu/Sn/Ni). The developed microstructures of the solidified flip-chip solder joints were strongly related to the associated metal bond pad. A hypoeutectic microstructure always developed near the Ni bond pad, and a eutectic or hypereutectic microstructure formed near the Cu pad. The effect of the metal bond pads on the solder microstructure alters the Cu solubility in the molten solder. The Cu content (solubility) in the molten Sn(Cu) solder eventually leads to the development of particular microstructures. In addition to the effect of the associated metal bond pads, the developed microstructure of the flip-chip solder joint depends on the configuration of the metal bond pads. A hypereutectic microstructure formed near the bottom Cu pad, and a eutectic microstructure formed near the top Cu pad. Directional cooling in the flip-chip solder joint during the solidification process causes the effects of the metal bond-pad configuration. Directional cooling causes the Cu content to vary in the liquid Sn(Cu) phase, resulting in the formation of distinct microstructural zones in the developed microstructure of the flip-chip solder joint.

  7. Reliability Study of Solder Paste Alloy for the Improvement of Solder Joint at Surface Mount Fine-Pitch Components

    Directory of Open Access Journals (Sweden)

    Mohd Nizam Ab. Rahman

    2014-12-01

    Full Text Available The significant increase in metal costs has forced the electronics industry to provide new materials and methods to reduce costs, while maintaining customers’ high-quality expectations. This paper considers the problem of most electronic industries in reducing costly materials, by introducing a solder paste with alloy composition tin 98.3%, silver 0.3%, and copper 0.7%, used for the construction of the surface mount fine-pitch component on a Printing Wiring Board (PWB. The reliability of the solder joint between electronic components and PWB is evaluated through the dynamic characteristic test, thermal shock test, and Taguchi method after the printing process. After experimenting with the dynamic characteristic test and thermal shock test with 20 boards, the solder paste was still able to provide a high-quality solder joint. In particular, the Taguchi method is used to determine the optimal control parameters and noise factors of the Solder Printer (SP machine, that affects solder volume and solder height. The control parameters include table separation distance, squeegee speed, squeegee pressure, and table speed of the SP machine. The result shows that the most significant parameter for the solder volume is squeegee pressure (2.0 mm, and the solder height is the table speed of the SP machine (2.5 mm/s.

  8. AuSn Solder Packaging in Vacuum Oven%真空炉金锡封焊

    Institute of Scientific and Technical Information of China (English)

    刘艳; 徐骁; 陈洁民; 陈凯

    2012-01-01

      In this paper,with the introduction of semiconductor packaging technology of AuSn solder, emphasis on the deep research of technology problems of AuSn solder and temperature curve settings. Based on many vacuum AuSn solder packaging experiments and theoretical analysis,research the technologies of module gas-tight packaging. Discusses the effects of packaging fixture,lid plating layer,alloy state,interface,pressing block,solder thickness and heating process to the solder packaging. The gas-tight performance can be fairly meet after environment mechanism test. The feasibility of alloy used and packaging technique can be proved according to the application background.%  文章在介绍半导体金锡焊料封装工艺的基础上,重点对金锡焊料、炉温曲线设置等工艺技术问题进行了深入研究。基于大量的金锡焊料真空焊接封装实验及理论分析,研究了器件气密封装技术。讨论了封焊夹具、管帽镀层、合金状态、封接面表面、压块、焊料厚度以及加热程序对焊接质量的影响。密封后的产品在经过环境试验和机械试验考核后,封装气密性能很好地满足要求。并且结合应用背景证明了所采用的合金及封装工艺的可行性。

  9. Site candidates for ground-based telescope devoted to space debris searching

    Science.gov (United States)

    Jiang, Hu; Hu, Haiying; Shen, Xue-min

    2015-12-01

    The demands for space debris scanning have been increasingly urgent in recent decade. The more space activities, the more urgent demands for space debris information. China has laid out space debris scanning from ground-based observation facilities. According to the latitudinal boundaries of China, north latitudes of 20deg, 30deg, 40deg, 50deg, 60deg are considered to be candidates for telescope sites. Space debris distribution is simulated under the assumption that telescopes are stationed in north latitudes of 20deg, 30deg, 40deg, 50deg, 60deg respectively. According to space debris simulations, it is recommended that the telescope dedicated to space debris scanning should be deployed in lower latitudes in order to achieve a better performance in detecting space debrises for China observing users.

  10. Handwritten Japanese Address Recognition Technique Based on Improved Phased Search of Candidate Rectangle Lattice

    Directory of Open Access Journals (Sweden)

    Hidehisa NAKAYAMA

    2004-08-01

    Full Text Available In the field of handwritten Japanese address recognition, it is common to recognize place-name strings from place-name images. However, in practice, it is necessary to recognize the place-name strings from address images. Therefore, we have proposed the post-processing system, which checks the list of the place-name strings in two-stages for recognizing the place-name images. In this paper, we propose a new technique based on phased search of candidate rectangle lattice, and improve the technique with the detection of key-characters for final output. Applying our proposal to the IPTP 1840 image data of address strings, the results of experiments clearly show the efficiency of our system in handwritten Japanese address recognition.

  11. Glcbal Trends of Lead-free Soldering and Technologies

    Institute of Scientific and Technical Information of China (English)

    JohnH.Lau; KatrinaLiu

    2003-01-01

    In this study, the global trends of lead-free soldering and technologies, such as costs, regulations, definitions, designs, materials, forward-process incompatibility, backward-process incompatibility, and reliability of components, PCBs (printed circuit boards), tin whiskers, and solder joints are investigated.

  12. Electrical Resistance of Nb3Sn/Cu Splices Produced by Electromagnetic Pulse Technology and Soft Soldering

    CERN Document Server

    Schoerling, D; Scheuerlein, C; Atieh, S; Schaefer, R

    2011-01-01

    The electrical interconnection of Nb3Sn/Cu strands is a key issue for the construction of Nb3Sn based damping ring wigglers and insertion devices for third generation light sources. We compare the electrical resistance of Nb3Sn/Cu splices manufactured by solid state welding using Electromagnetic Pulse Technology (EMPT) with that of splices produced by soft soldering with two different solders. The resistance of splices produced by soft soldering depends strongly on the resistivity of the solder alloy at the operating temperature. By solid state welding splice resistances below 10 nOhm can be achieved with 1 cm strand overlap length only, which is about 4 times lower than the resistance of Sn96Ag4 soldered splices with the same overlap length. The comparison of experimental results with Finite Element simulations shows that the electrical resistance of EMPT welded splices is determined by the resistance of the stabilizing copper between the superconducting filaments and confirms that welding of the strand matr...

  13. Current Status of Lead-Free Soldering and Conductive Adhesives

    Institute of Scientific and Technical Information of China (English)

    KatsuakiSuganuma

    2003-01-01

    Lead-free soldering technology took offin the Japanese market during the year 2000, and as the year 2001-03 ushered in the 21 st century, a large number of products with lead-free soldering were already appearing on store shelves. Elsewhere, EU deliberation on the draft of the WEEE/RoHS directive finalized in February 2003 and be in force in July 2006. The course had been set for adopting lead-free solder for mounting processes of parts as well, bringing the possibility of lead-free solder mounting very close to achievement. This review will provide a view of the current state of technological progress in lead-free soldering, both in Japan and abroad, and will discuss future prospects.

  14. Laser beam soldering of fine-pitch technology packages with solid solder deposits

    Science.gov (United States)

    Pucher, Hans-Joerg; Glasmacher, Mathias; Geiger, Manfred

    1996-04-01

    Micro electronics is a key technology attracting the attention of information, communication, automation and data processing technologies. Ongoing miniaturization combined with an increasing number of I/Os has inevitably lead to ever finer lead geometries. Therefore the demands put upon the surface mount technology are increasing continuously. Processing of high lead count fine pitch packages, for example those which are applied in high-capacity computers, has not increased the demands put upon the assembly process only, but also on the connecting techniques. By reflow soldering with laser beam radiation the benefits from the tool `laser beam' are used extensively, for example contact and force free processing, strictly localized heating and the good controllability thereof, formation of fine crystalline and homogeneous structures, etc. Within the scope of this paper the fundamentals of laser beam soldering are discussed for fine pitch lead frames (pitch 300 micrometers ) for plastic packages, made by a modified CuFe2P alloy with a 5 micrometers Sn90Pb plating, on solid solder depths (Sn63Pb) performed by the so called High-Pad process. These investigations are unique in the field of laser beam soldering and are carried out by means of a Nd:YAG-laser. A pyrometer is used for detection of the emission of the temperature radiation of the joining area for process control. The additional use of a high-speed camera gives a detailed description of the melting and wetting process. The influence of laser beam parameters and the volume of the solid solder deposits on the joining result are presented.

  15. Packaging of hard solder 500W QCW diode laser array

    Science.gov (United States)

    Li, Xiaoning; Wang, Jingwei; Hou, Dong; Nie, Zhiqiang; Liu, Xingsheng

    2016-03-01

    The package structure critically influences the major characteristics of diode laser, such as thermal behavior, output power, wavelength and smile effect. In this work, a novel micro channel cooler (MCC) for stack array laser with good heat dissipation capability and high reliability is presented. Numerical simulations of thermal management with different MCC structure are conducted and analyzed. Based on this new MCC packaging structure, a series of QCW 500W high power laser arrays with hard solder packaging technology has been fabricated. The performances of the laser arrays are characterized. A narrow spectrum of 3.12 nm and an excellent smile value are obtained. The lifetime of the laser array is more than 1.38×109 shots and still ongoing.

  16. Power Cycling Test Circuit for Thermal Fatigue Resistance Analysis of Solder Joints in IGBT

    OpenAIRE

    Dupont, Laurent; Lefebvre, Stéphane; Khatir, Zoubir; FAUGIERE, Jean Claude

    2003-01-01

    The paper will give a detailed presentation of an active power cycling test bench in high temperature conditions developed to ageing the solder between the Direct Copper Bonding (DCB) and the base of IGBT devices. The average junction temperature measurement protocol, the temperature regulation of the base plate, the acquisition of all the electrical signals, and the performance of the test circuit will be presented and discussed. Moreover, a thermal modelling presentation has been used to de...

  17. Effects Of Nickel On The Microstructure And The Mechanical Properties Of Sn-0.7Cu Lead-Free Solders

    Directory of Open Access Journals (Sweden)

    Gyenes A.

    2015-06-01

    Full Text Available This paper investigates the effects of small amount nickel addition (0, 200, 400, 800, 1800 ppm on the microstructure and the mechanical properties of Sn-0.7Cu lead-free solder alloys. It is known that even ppm level Ni additions have significant effects on the microstructure of Sn-Cu solder alloys. Ni suppresses the growth of β-Sn dendrites in favour of eutectic formation. As the nickel content increases, the microstructure undergoes a morphological evolution from hypoeutectic through fully eutectic to hypereutectic. Along with these transformations, the mechanical properties of the alloy also significantly change. Based on the experimental results presented in this paper, the Sn-0.7Cu solder achieves maximum strength at the addition level of 800 ppm Ni, when the microstructure becomes fully eutectic.

  18. High-precision opto-mechanical lens system for space applications assembled by innovative local soldering technique

    Science.gov (United States)

    Ribes, P.; Koechlin, C.; Burkhardt, T.; Hornaff, M.; Burkhardt, D.; Kamm, A.; Gramens, S.; Beckert, E.; Fiault, G.; Eberhardt, R.; Tünnermann, A.

    2016-02-01

    Solder joining using metallic solder alloys is an alternative to adhesive bonding. Laser-based soldering processes are especially well suited for the joining of optical components made of fragile and brittle materials such as glasses, ceramics and optical crystals. This is due to a localized and minimized input of thermal energy. Solderjet bumping technology has been used to assemble a lens mount breadboard taking as input specifications the requirements found for the optical beam expander for the European Space Agency (ESA) EarthCare Mission. The silica lens and a titanium barrel have been designed and assembled with this technology in order to withstand the stringent mission demands; handling high mechanical and thermal loads without losing its optical performances. Finally a high-precision opto-mechanical lens mount has been assembled with a minimal localized stress (<1 MPa) showing outstanding performances in terms of wave-front error measurements and beam depolarization ratio before and after environmental tests.

  19. Break-up Process of Perturbed Molten Metal Jet and Preparation of Lead-Free Solder Balls

    Institute of Scientific and Technical Information of China (English)

    He Lijun; Zhang Shuguang; Zhang Shaoming; Xu Jun; Shi Likai

    2004-01-01

    Solder balls, which are used in advanced electronics packages such as BGA (Ball Grid Array) and CSP (Chip Scale Package) to substitute the leads and realize the electrical and mechanical connections between substrate and chip,have severe specifications in diameter tolerance, roundness and surface quality, and therefore challenge the traditional technologies for fabrication of metallic particles and powders. The present work made a survey of perturbed molten metal jet break-up process, observed the formation and growth of capillary wave of tin-lead melt jet by way of rapid solidification, and on the basis of the above research, successfully obtained tin-lead eutectic and Sn-4.0Ag-0.5Cu lead free solder balls with tight distribution and good sphericity of particles through optimization of processing parameters, forming a solid base for cost effectively producing solder balls.

  20. Solid particle erosion of steels and nickel based alloys candidates for USC steam turbine blading

    Energy Technology Data Exchange (ETDEWEB)

    Cernuschi, Federico; Guardamagna, Cristina; Lorenzoni, Lorenzo [ERSE SpA, Milan (Italy); Robba, Davide [CESI, Milan (Italy)

    2010-07-01

    The main objective of COST536 Action is to develop highly efficient steam power plant with low emissions, from innovative alloy development to validation of component integrity. In this perspective, to improve the operating efficiency, materials capable of withstanding higher operating temperatures are required. For the manufacturing of components for steam power plants with higher efficiency steels and nickel-based alloys with improved oxidation resistance and creep strength at temperature as high as 650 C - 700 C have to be developed. Candidate alloys for manufacturing high pressure steam turbine diaphragms, buckets, radial seals and control valves should exhibit, among other properties, a good resistance at the erosion phenomena induced by hard solid particles. Ferric oxide (magnetite) scales cause SPE by exfoliating from boiler tubes and steam pipes (mainly super-heaters and re-heaters) and being transported within the steam flow to the turbine. In order to comparatively study the erosion behaviour of different materials in relatively short times, an accelerated experimental simulation of the erosion phenomena must be carried out. Among different techniques to induce erosion on material targets, the use of an air jet tester is well recognised to be one of the most valid and reliable. In this work the results of SPE comparative tests performed at high temperatures (550 C, 600 C and 650 C) at different impaction angles on some steels and nickel based alloys samples are reported. (orig.)

  1. A PROJECT-BASED LEARNING PACKAGE FOR PH. D CANDIDATES AT HIT

    Institute of Scientific and Technical Information of China (English)

    ZhaoYuqin

    2004-01-01

    Project-based learning is to involve students in a project-like learning program to achieve the required purposes of language learning, It is a new pedagogical approach composed of a series of tasks, requiring students to use various languages and other skills to accomplish respectively. It is to provide students with opportunities to learn the language in a simulated authentic communicative situation when they are using the language. A project-based learning program was desigued for the Ph. D.candidates at HIT, named “simulating an international conference”. It involves the students in the whole process of organizing and participating an international conference. In the simulated context, students have opportunities to learn and practice English while they are using English to fulfill some tasks. Meanwhile, students are able to practice other skills, such as using information technologies, word editing and publishing. More importantly, students need to collaborate and cooperate with each other. The abilities to use English as a communicative tool for international communication, to use information technologies and to be able to cooperate with other sare the aims of education in the 21st century.

  2. Physics of Failure as a Basis for Solder Elements Reliability Assessment in Wind Turbines

    DEFF Research Database (Denmark)

    Kostandyan, Erik; Sørensen, John Dalsgaard

    2012-01-01

    Traditionally assessment of reliability of electrical components is done by classical reliability techniques using failure rates as the basic measure of reliability. In this paper a structural reliability approach is applied in order to include all relevant uncertainties and to give a more detailed...... description of the reliability. A physics of failure approach is applied. A SnAg solder component used in power electronics is used as an example. Crack propagation in the SnAg solder is modeled and a model to assess the accumulated plastic strain is proposed based on a physics of failure approach. Based...... on the proposed model it is described how to find the accumulated linear damage and reliability levels for a given temperature loading profile. Using structural reliability methods the reliability levels of the electrical components are assessed by introducing scale factors for stresses....

  3. Investigation on the Microstructure, Interfacial IMC Layer, and Mechanical Properties of Cu/Sn-0.7Cu- xNi/Cu Solder Joints

    Science.gov (United States)

    Yang, Li; Ge, Jinguo; Zhang, Yaocheng; Dai, Jun; Liu, Haixiang; Xiang, Jicen

    2016-07-01

    Sn-0.7Cu- xNi composite solder has been fabricated via mechanical mixing of different weight percentages of Ni particles with Sn-0.7Cu solder paste, and the effect of the Ni concentration on the microstructure, wettability, and tensile properties of Cu/Sn-0.7Cu- xNi/Cu solder joints investigated. The results show that refined dot-shaped particles of intermetallic compounds (IMCs) are uniformly dispersed in a primary β-Sn matrix in the Cu/Sn-0.7Cu-(0.05-0.1)Ni/Cu solder joints. The interfacial IMC layer thickness increased slightly when adding Ni content to 0.05 wt.%, then rapidly when further increasing the Ni concentration to 0.4 wt.%. Excellent wettability with bright appearance was obtained for the Sn-0.7Cu-0.05Ni solder due to diminished interfacial tension. The tensile properties improved after adding Ni content to 0.05 wt.% due to the presence of the refined dot-like IMC particles, in agreement with theoretical predictions based on the combination of dispersion and grain-refinement strengthening mechanisms. Refined microstructure and enhanced mechanical properties were obtained for the Cu/Sn-0.7Cu-0.05Ni/Cu solder joint.

  4. Cell-Based Assay Design for High-Content Screening of Drug Candidates.

    Science.gov (United States)

    Nierode, Gregory; Kwon, Paul S; Dordick, Jonathan S; Kwon, Seok-Joon

    2016-02-01

    To reduce attrition in drug development, it is crucial to consider the development and implementation of translational phenotypic assays as well as decipher diverse molecular mechanisms of action for new molecular entities. High-throughput fluorescence and confocal microscopes with advanced analysis software have simplified the simultaneous identification and quantification of various cellular processes through what is now referred to as highcontent screening (HCS). HCS permits automated identification of modifiers of accessible and biologically relevant targets and can thus be used to detect gene interactions or identify toxic pathways of drug candidates to improve drug discovery and development processes. In this review, we summarize several HCS-compatible, biochemical, and molecular biology-driven assays, including immunohistochemistry, RNAi, reporter gene assay, CRISPR-Cas9 system, and protein-protein interactions to assess a variety of cellular processes, including proliferation, morphological changes, protein expression, localization, post-translational modifications, and protein-protein interactions. These cell-based assay methods can be applied to not only 2D cell culture but also 3D cell culture systems in a high-throughput manner. PMID:26428732

  5. Trust Based Algorithm for Candidate Node Selection in Hybrid MANET-DTN

    Directory of Open Access Journals (Sweden)

    Jan Papaj

    2014-01-01

    Full Text Available The hybrid MANET - DTN is a mobile network that enables transport of the data between groups of the disconnected mobile nodes. The network provides benefits of the Mobile Ad-Hoc Networks (MANET and Delay Tolerant Network (DTN. The main problem of the MANET occurs if the communication path is broken or disconnected for some short time period. On the other side, DTN allows sending data in the disconnected environment with respect to higher tolerance to delay. Hybrid MANET - DTN provides optimal solution for emergency situation in order to transport information. Moreover, the security is the critical factor because the data are transported by mobile devices. In this paper, we investigate the issue of secure candidate node selection for transportation of the data in a disconnected environment for hybrid MANET- DTN. To achieve the secure selection of the reliable mobile nodes, the trust algorithm is introduced. The algorithm enables select reliable nodes based on collecting routing information. This algorithm is implemented to the simulator OPNET modeler.

  6. Novel chikungunya vaccine candidate with an IRES-based attenuation and host range alteration mechanism.

    Directory of Open Access Journals (Sweden)

    Kenneth Plante

    2011-07-01

    Full Text Available Chikungunya virus (CHIKV is a reemerging mosquito-borne pathogen that has recently caused devastating urban epidemics of severe and sometimes chronic arthralgia. As with most other mosquito-borne viral diseases, control relies on reducing mosquito populations and their contact with people, which has been ineffective in most locations. Therefore, vaccines remain the best strategy to prevent most vector-borne diseases. Ideally, vaccines for diseases of resource-limited countries should combine low cost and single dose efficacy, yet induce rapid and long-lived immunity with negligible risk of serious adverse reactions. To develop such a vaccine to protect against chikungunya fever, we employed a rational attenuation mechanism that also prevents the infection of mosquito vectors. The internal ribosome entry site (IRES from encephalomyocarditis virus replaced the subgenomic promoter in a cDNA CHIKV clone, thus altering the levels and host-specific mechanism of structural protein gene expression. Testing in both normal outbred and interferon response-defective mice indicated that the new vaccine candidate is highly attenuated, immunogenic and efficacious after a single dose. Furthermore, it is incapable of replicating in mosquito cells or infecting mosquitoes in vivo. This IRES-based attenuation platform technology may be useful for the predictable attenuation of any alphavirus.

  7. Solder technology in the manufacturing of electronic products

    Energy Technology Data Exchange (ETDEWEB)

    Vianco, P.T.

    1993-08-01

    The electronics industry has relied heavily upon the use of soldering for both package construction and circuit assembly. The solder attachment of devices onto printed circuit boards and ceramic microcircuits has supported the high volume manufacturing processes responsible for low cost, high quality consumer products and military hardware. Defects incurred during the manufacturing process are minimized by the proper selection of solder alloys, substrate materials and process parameters. Prototyping efforts are then used to evaluate the manufacturability of the chosen material systems. Once manufacturing feasibility has been established, service reliability of the final product is evaluated through accelerated testing procedures.

  8. Solder extrusion pressure bonding process and bonded products produced thereby

    Science.gov (United States)

    Beavis, Leonard C.; Karnowsky, Maurice M.; Yost, Frederick G.

    1992-01-01

    Production of soldered joints which are highly reliable and capable of surviving 10,000 thermal cycles between about -40.degree. C. and 110.degree. C. Process involves interposing a thin layer of a metal solder composition between the metal surfaces of members to be bonded and applying heat and up to about 1000 psi compression pressure to the superposed members, in the presence of a reducing atmosphere, to extrude the major amount of the solder composition, contaminants including fluxing gases and air, from between the members being bonded, to form a very thin, strong intermetallic bonding layer having a thermal expansion tolerant with that of the bonded members.

  9. A Novel Technique for the Connection of Ceramic and Titanium Implant Components Using Glass Solder Bonding

    OpenAIRE

    Enrico Mick; Joachim Tinschert; Aurica Mitrovic; Rainer Bader

    2015-01-01

    Both titanium and ceramic materials provide specific advantages in dental implant technology. However, some problems, like hypersensitivity reactions, corrosion and mechanical failure, have been reported. Therefore, the combining of both materials to take advantage of their pros, while eliminating their respective cons, would be desirable. Hence, we introduced a new technique to bond titanium and ceramic materials by means of a silica-based glass ceramic solder. Cylindrical compound samples (...

  10. Detection of the early keratoconus based on corneal biomechanical properties in the refractive surgery candidates

    Directory of Open Access Journals (Sweden)

    Zofia Pniakowska

    2016-01-01

    Full Text Available Context: Subclinical keratoconus is contraindication to refractive surgery. The currently used methods of preoperative screening do not always allow differentiating between healthy eyes and those with subclinical keratoconus. Aim: To evaluate biomechanical parameters of the cornea, waveform score (WS, and intraocular pressure (IOP as potentially useful adjuncts to the diagnostic algorithm for precise detection of the early keratoconus stages and selection of refractive surgery candidates. Settings and Design: Department of Ophthalmology and prospective cross-sectional study. Patients and Methods: Patients enrolled in the study were diagnosed with refractive disorders. We assessed parameters of corneal biomechanics such as corneal hysteresis (CH, corneal resistance factor (CRF, Goldman-correlated IOP (IOPg, corneal compensated IOP, WS, and keratoconus match index (KMI. They were classified into one of three groups based on the predefined KMI range: Group 1 (from 0.352 to 0.757 – 45 eyes, Group 2 (from −0.08 to 0.313 – 52 eyes, and Group 0 - control group (from 0.761 to 1.642 – 80 eyes. Results: In both study groups, IOPg, CRF, and CH were decreased when compared to control (P < 0.0001. In control group, there was positive correlation between CH and KMI (P < 0.05, with no correlations in any of the two study groups. CRF correlated positively with KMI in control (P < 0.0001 and in Group 2 (P < 0.05. Conclusions: CH and CRF, together with WS and IOPg, consist a clinically useful adjunct to detect subclinical keratoconus in patients referred for refractive surgery when based on KMI staging.

  11. Crystal plasticity finite element analysis of deformation behaviour in SAC305 solder joint

    Science.gov (United States)

    Darbandi, Payam

    Due to the awareness of the potential health hazards associated with the toxicity of lead (Pb), actions have been taken to eliminate or reduce the use of Pb in consumer products. Among those, tin (Sn) solders have been used for the assembly of electronic systems. Anisotropy is of significant importance in all structural metals, but this characteristic is unusually strong in Sn, making Sn based solder joints one of the best examples of the influence of anisotropy. The effect of anisotropy arising from the crystal structure of tin and large grain microstructure on the microstructure and the evolution of constitutive responses of microscale SAC305 solder joints is investigated. Insights into the effects of key microstructural features and dominant plastic deformation mechanisms influencing the measured relative activity of slip systems in SAC305 are obtained from a combination of optical microscopy, orientation imaging microscopy (OIM), slip plane trace analysis and crystal plasticity finite element (CPFE) modeling. Package level SAC305 specimens were subjected to shear deformation in sequential steps and characterized using optical microscopy and OIM to identify the activity of slip systems. X-ray micro Laue diffraction and high energy monochromatic X-ray beam were employed to characterize the joint scale tensile samples to provide necessary information to be able to compare and validate the CPFE model. A CPFE model was developed that can account for relative ease of activating slip systems in SAC305 solder based upon the statistical estimation based on correlation between the critical resolved shear stress and the probability of activating various slip systems. The results from simulations show that the CPFE model developed using the statistical analysis of activity of slip system not only can satisfy the requirements associated with kinematic of plastic deformation in crystal coordinate systems (activity of slip systems) and global coordinate system (shape changes

  12. Relative effect of solder flux chemistry on the humidity related failures in electronics

    DEFF Research Database (Denmark)

    Verdingovas, Vadimas; Jellesen, Morten Stendahl; Ambat, Rajan

    2015-01-01

    was studied by quartz crystal microbalance, while corrosive effects were studied by leakage current and impedance measurements on standard test boards. The measurements were performed as a function of relative humidity (RH) in the range from 60 to ~99 per cent at 25°C. The corrosiveness of solder flux systems...... of printed circuit boards under humid conditions. Originality/value - The classification of solder flux systems according to IPC J-STD-004 standard does not specify the WOAs in the flux; however, ranking of the flux systems based on the hygroscopic property of activators would be useful information when...... selecting no-clean flux systems for electronics with applications in humid conditions....

  13. Precision dispensing of small volumes of albumin solder for laser-assisted wound closure

    Science.gov (United States)

    Sorg, Brian S.; McNally-Heintzelman, Karen M.; Chan, Eric K.; Frederickson, Christopher J.; Welch, Ashley J.

    1999-06-01

    Recent laser-tissue soldering work in our lab has demonstrated the feasibility of building a solder bond from individually coagulated small droplets using a precision pipette for the deposition of the solder droplets. This method of using small, precise volumes of solder to build a bond may result in stronger and more reproducible bonds than coagulating an equivalent large volume of solder all at once. We have investigated the technique further in this study. The solder was dispensed onto the intimal side of a bovine aorta substrate and irradiated with an 808nm diode laser. A bond was created across an incision in the tissue substrate by alternately dispensing and coagulating each small volume of solder, or by coagulating a single large equivalent volume. Acute strength analysis was performed on the solder bond. Future work will concentrate on testing a bench-top solder dispensing device and investigating the feasibility of turning the deice into a prototype tool for clinical applications.

  14. Modular construction of quaternary hemiaminal-based inhibitor candidates and their in cellulo assessment with HIV-1 protease.

    Science.gov (United States)

    Gros, Guillaume; Martinez, Lorena; Gimenez, Anna Servat; Adler, Paula; Maurin, Philippe; Wolkowicz, Roland; Falson, Pierre; Hasserodt, Jens

    2013-09-01

    Non-peptidomimetic drug-like protease inhibitors have potential for circumventing drug resistance. We developed a much-improved synthetic route to our previously reported inhibitor candidate displaying an unusual quaternized hemi-aminal. This functional group forms from a linear precursor upon passage into physiological media. Seven variants were prepared and tested in cellulo with our HIV-1 fusion-protein technology that result in an eGFP-based fluorescent readout. Three candidates showed inhibition potency above 20μM and toxicity at higher concentrations, making them attractive targets for further refinement. Importantly, our class of original inhibitor candidates is not recognized by two major multidrug resistance pumps, quite in contrast to most clinically applied HIV-1 protease inhibitors.

  15. A cell wall protein-based vaccine candidate induce protective immune response against Sporothrix schenckii infection.

    Science.gov (United States)

    Portuondo, Deivys Leandro; Batista-Duharte, Alexander; Ferreira, Lucas Souza; Martínez, Damiana Téllez; Polesi, Marisa Campos; Duarte, Roberta Aparecida; de Paula E Silva, Ana Carolina Alves; Marcos, Caroline Maria; Almeida, Ana Marisa Fusco de; Carlos, Iracilda Zeppone

    2016-02-01

    Sporotrichosis is a subcutaneous mycosis caused by several closely related thermo-dimorphic fungi of the Sporothrix schenckii species complex, affecting humans and other mammals. In the last few years, new strategies have been proposed for controlling sporotrichosis owning to concerns about its growing incidence in humans, cats, and dogs in Brazil, as well as the toxicity and limited efficacy of conventional antifungal drugs. In this study, we assessed the immunogenicity and protective properties of two aluminum hydroxide (AH)-adsorbed S. schenckii cell wall protein (ssCWP)-based vaccine formulations in a mouse model of systemic S. schenckii infection. Fractioning by SDS-PAGE revealed nine protein bands, two of which were functionally characterized: a 44kDa peptide hydrolase and a 47kDa enolase, which was predicted to be an adhesin. Sera from immunized mice recognized the 47kDa enolase and another unidentified 71kDa protein, whereas serum from S. schenckii-infected mice recognized both these proteins plus another unidentified 9.4kDa protein. Furthermore, opsonization with the anti-ssCWP sera led to markedly increased phagocytosis and was able to strongly inhibit the fungus' adhesion to fibroblasts. Immunization with the higher-dose AH-adjuvanted formulation led to increased ex vivo release of IL-12, IFN-γ, IL-4, and IL-17, whereas only IL-12 and IFN-γ were induced by the higher-dose non-adjuvanted formulation. Lastly, passive transference of the higher-dose AH-adjuvanted formulation's anti-ssCWP serum was able to afford in vivo protection in a subsequent challenge with S. schenckii, becoming a viable vaccine candidate for further testing.

  16. Horizon shells and BMS-like soldering transformations

    OpenAIRE

    Blau, Matthias; O’Loughlin, Martin

    2016-01-01

    We revisit the theory of null shells in general relativity, with a particular emphasis on null shells placed at horizons of black holes. We study in detail the considerable freedom that is available in the case that one solders two metrics together across null hypersurfaces (such as Killing horizons) for which the induced metric is invariant under translations along the null generators. In this case the group of soldering transformations turns out to be infinite dimensional, an...

  17. A New Strategy Based on Smrho Protein Loaded Chitosan Nanoparticles as a Candidate Oral Vaccine against Schistosomiasis

    OpenAIRE

    Oliveira, Carolina R.; Rezende, Cíntia M. F.; Silva, Marina R.; Ana Paula Pêgo; Olga Borges; Alfredo M. Goes

    2012-01-01

    BACKGROUND: Schistosomiasis is one of the most important neglected tropical diseases and an effective control is unlikely in the absence of improved sanitation and vaccination. A new approach of oral vaccination with alginate coated chitosan nanoparticles appears interesting because their great stability and the ease of target accessibility, besides of chitosan and alginate immunostimulatory properties. Here we propose a candidate vaccine based on the combination of chitosan-based nanoparticl...

  18. Life cycle assessment (LCA of lead-free solders from the environmental protection aspect

    Directory of Open Access Journals (Sweden)

    Mitovski Aleksandra M.

    2009-01-01

    Full Text Available Life-cycle assessment (LCA presents a relatively new approach, which allows comprehensive environmental consequences analysis of a product system over its entire life. This analysis is increasingly being used in the industry, as a tool for investigation of the influence of the product system on the environment, and serves as a protection and prevention tool in ecological management. This method is used to predict possible influences of a certain material to the environment through different development stages of the material. In LCA, the product systems are evaluated on a functionally equivalent basis, which, in this case, was 1000 cubic centimeters of an alloy. Two of the LCA phases, life-cycle inventory (LCA and life-cycle impact assessment (LCIA, are needed to calculate the environmental impacts. Methodology of LCIA applied in this analysis aligns every input and output influence into 16 different categories, divided in two subcategories. The life-cycle assessment reaserch review of the leadfree solders Sn-Cu, SAC (Sn-Ag-Cu, BSA (Bi-Sb-Ag and SABC (Sn-Ag-Bi-Cu respectively, is given in this paper, from the environmental protection aspect starting from production, through application process and finally, reclamation at the end-of-life, i.e. recycling. There are several opportunities for reducing the overall environmental and human health impacts of solder used in electronics manufacturing based on the results of the LCA, such as: using secondary metals reclaimed through post-industrial recycling; power consumption reducing by replacing older, less efficient reflow assembly equipment, or by optimizing the current equipment to perform at the elevated temperatures required for lead-free soldering, etc. The LCA analysis was done comparatively in relation to widely used Sn-Pb solder material. Additionally, the impact factors of material consumption, energy use, water and air reserves, human health and ecotoxicity have been ALSO considered including

  19. The In-Space Soldering Investigation: To Date Analysis of Experiments Conducted on the International Space Station

    Science.gov (United States)

    Grugel, Richard N.; Gillies, D. C.; Hua, F.; Anilkumar, A.

    2006-01-01

    Soldering is a well established joining and repair process that is of particular importance in the electronics industry. Still, internal solder joint defects such as porosity are prevalent and compromise desired properties such as electrical/thermal conductivity and fatigue strength. Soldering equipment resides aboard the International Space Station (ISS) and will likely accompany Exploration Missions during transit to, as well as on, the moon and Mars. Unfortunately, detrimental porosity appears to be enhanced in lower gravity environments. To this end, the In-Space Soldering Investigation (ISSI) is being conducted in the Microgravity Workbench Area (MWA) aboard the ISS as "Saturday Science" with the goal of promoting our understanding of joining techniques, shape equilibrium, wetting phenomena, and microstructural development in a microgravity environment. The work presented here will focus on direct observation of melting dynamics and shape determination in comparison to ground-based samples, with implications made to processing in other low-gravity environments. Unexpected convection effects, masked on Earth, will also be shown as well as the value of the ISS as a research platform in support of Exploration Missions.

  20. The In-Space Soldering Investigation: Research Conducted on the International Space Station in Support of NASA's Exploration Initiative

    Science.gov (United States)

    Grugel, R. N.; Fincke, M.; Sergre, P. N.; Ogle, J. A.; Funkhouser, G.; Parris, F.; Murphy, L.; Gillies, D.; Hua, F.

    2004-01-01

    Soldering is a well established joining and repair process that is of particular importance in the electronics industry. Still. internal solder joint defects such as porosity are prevalent and compromise desired properties such as electrical/thermal conductivity and fatigue strength. Soldering equipment resides aboard the International Space Station (ISS) and will likely accompany Exploration Missions during transit to, as well as on, the moon and Mars. Unfortunately, detrimental porosity appears to be enhanced in lower gravity environments. To this end, the In-Space Soldering Investigation (ISSI) is being conducted in the Microgravity Workbench Area (MWA) aboard the ISS as "Saturday Science" with the goal of promoting our understanding of joining techniques, shape equilibrium, wetting phenomena, and microstructural development in a microgravity environment. The work presented here will focus on direct observation of melting dynamics and shape determination in comparison to ground-based samples, with implications made to processing in other low-gravity environments. Unexpected convection effects, masked on Earth, will also be shown as well as the value of the ISS as a research platform in support of Exploration Missions.

  1. Fully Pipelined Parallel Architecture for Candidate Block and Pixel-Subsampling-Based Motion Estimation

    Directory of Open Access Journals (Sweden)

    Reeba Korah

    2008-01-01

    Full Text Available This paper presents a low power and high speed architecture for motion estimation with Candidate Block and Pixel Subsampling (CBPS Algorithm. Coarse-to-fine search approach is employed to find the motion vector so that the local minima problem is totally eliminated. Pixel subsampling is performed in the selected candidate blocks which significantly reduces computational cost with low quality degradation. The architecture developed is a fully pipelined parallel design with 9 processing elements. Two different methods are deployed to reduce the power consumption, parallel and pipelined implementation and parallel accessing to memory. For processing 30 CIF frames per second our architecture requires a clock frequency of 4.5 MHz.

  2. Genetic relationships of some Citrus genotypes based on the candidate iron chlorosis genes

    OpenAIRE

    KAÇAR, Yıldız AKA; Özhan ŞİMŞEK; DÖNMEZ, Dicle; BONCUK, Melda; YEŞİLOĞLU, Turgut; Ollitrault, Patrick

    2014-01-01

    Iron is one of the most important elements in plant mineral nutrition. Fe deficiency is a critical abiotic stress factor for Mediterranean citriculture; the development of marker-assisted selection for this trait would greatly enhance rootstock breeding. In this study, DNA sequencing and single-stranded conformation polymorphism (SSCP) analyses were performed to determine the allelic diversity of genes associated with tolerance to iron chlorosis in citrus. Two candidate iron chlorosis toleran...

  3. Characterization nanoparticles-based vaccines and vaccine candidates: a Transmission Electron Microscopy study

    Directory of Open Access Journals (Sweden)

    I. Menéndez I

    2016-05-01

    Full Text Available Transmission Electron Microscopy (TEM is a valuable tool for the biotech industry. This paper summarizes some of the contributions of MET in the characterization of the recombinant antigens are part of vaccines or vaccine candidates obtained in the CIGB. It mentions the use of complementary techniques MET (Negative staining, and immunoelectron that enhance visualization and ultrastructural characterization of the recombinant proteins obtained by Genetic Engineering.

  4. Identification of Novel Potential Vaccine Candidates against Tuberculosis Based on Reverse Vaccinology

    Directory of Open Access Journals (Sweden)

    Gloria P. Monterrubio-López

    2015-01-01

    Full Text Available Tuberculosis (TB is a chronic infectious disease, considered as the second leading cause of death worldwide, caused by Mycobacterium tuberculosis. The limited efficacy of the bacillus Calmette-Guérin (BCG vaccine against pulmonary TB and the emergence of multidrug-resistant TB warrants the need for more efficacious vaccines. Reverse vaccinology uses the entire proteome of a pathogen to select the best vaccine antigens by in silico approaches. M. tuberculosis H37Rv proteome was analyzed with NERVE (New Enhanced Reverse Vaccinology Environment prediction software to identify potential vaccine targets; these 331 proteins were further analyzed with VaxiJen for the determination of their antigenicity value. Only candidates with values ≥0.5 of antigenicity and 50% of adhesin probability and without homology with human proteins or transmembrane regions were selected, resulting in 73 antigens. These proteins were grouped by families in seven groups and analyzed by amino acid sequence alignments, selecting 16 representative proteins. For each candidate, a search of the literature and protein analysis with different bioinformatics tools, as well as a simulation of the immune response, was conducted. Finally, we selected six novel vaccine candidates, EsxL, PE26, PPE65, PE_PGRS49, PBP1, and Erp, from M. tuberculosis that can be used to improve or design new TB vaccines.

  5. Identification of Novel Potential Vaccine Candidates against Tuberculosis Based on Reverse Vaccinology.

    Science.gov (United States)

    Monterrubio-López, Gloria P; González-Y-Merchand, Jorge A; Ribas-Aparicio, Rosa María

    2015-01-01

    Tuberculosis (TB) is a chronic infectious disease, considered as the second leading cause of death worldwide, caused by Mycobacterium tuberculosis. The limited efficacy of the bacillus Calmette-Guérin (BCG) vaccine against pulmonary TB and the emergence of multidrug-resistant TB warrants the need for more efficacious vaccines. Reverse vaccinology uses the entire proteome of a pathogen to select the best vaccine antigens by in silico approaches. M. tuberculosis H37Rv proteome was analyzed with NERVE (New Enhanced Reverse Vaccinology Environment) prediction software to identify potential vaccine targets; these 331 proteins were further analyzed with VaxiJen for the determination of their antigenicity value. Only candidates with values ≥0.5 of antigenicity and 50% of adhesin probability and without homology with human proteins or transmembrane regions were selected, resulting in 73 antigens. These proteins were grouped by families in seven groups and analyzed by amino acid sequence alignments, selecting 16 representative proteins. For each candidate, a search of the literature and protein analysis with different bioinformatics tools, as well as a simulation of the immune response, was conducted. Finally, we selected six novel vaccine candidates, EsxL, PE26, PPE65, PE_PGRS49, PBP1, and Erp, from M. tuberculosis that can be used to improve or design new TB vaccines.

  6. Phylogeography, Salinity Adaptations and Metabolic Potential of the Candidate Division KB1 Bacteria Based on a Partial Single Cell Genome.

    Science.gov (United States)

    Nigro, Lisa M; Hyde, Andrew S; MacGregor, Barbara J; Teske, Andreas

    2016-01-01

    Deep-sea hypersaline anoxic basins and other hypersaline environments contain abundant and diverse microbial life that has adapted to these extreme conditions. The bacterial Candidate Division KB1 represents one of several uncultured groups that have been consistently observed in hypersaline microbial diversity studies. Here we report the phylogeography of KB1, its phylogenetic relationships to Candidate Division OP1 Bacteria, and its potential metabolic and osmotic stress adaptations based on a partial single cell amplified genome of KB1 from Orca Basin, the largest hypersaline seafloor brine basin in the Gulf of Mexico. Our results are consistent with the hypothesis - previously developed based on (14)C incorporation experiments with mixed-species enrichments from Mediterranean seafloor brines - that KB1 has adapted its proteins to elevated intracellular salinity, but at the same time KB1 apparently imports glycine betaine; this compatible solute is potentially not limited to osmoregulation but could also serve as a carbon and energy source. PMID:27597842

  7. Interaction Kinetics between Sn-Pb Solder Droplet and Au/Ni/Cu Pad

    Institute of Scientific and Technical Information of China (English)

    Fuquan LI; Chunqing WANG; Yanhong TIAN

    2006-01-01

    The interfacial phenomena of the Sn-Pb solder droplet on Au/Ni/Cu pad are investigated. A continuous AuSn2and needle-like AuSn4 are formed at the interface after the liquid state reaction (soldering). The interfacial reaction between the solder and Au layer continues during solid state aging with AuSn4 breaking off from the interface and felling into the solder. The kinetics of Au layer dissolution and diffusion into the solder during soldering and aging is analyzed to elucidate intermetallic formation mechanism at the solder/Au pad interface.The concentration of Au near the solder/pad interface is identified to increase and reach the solubility limit during the period of liquid state reaction. During solid state reaction, the thickening of Au-Sn compound is mainly controlled by element diffusion.

  8. Prime candidate earth targets for the post-launch radiometric calibration of space-based optical imaging instruments

    Science.gov (United States)

    Teillet, P.M.; Barsi, J.A.; Chander, G.; Thome, K.J.

    2007-01-01

    This paper provides a comprehensive list of prime candidate terrestrial targets for consideration as benchmark sites for the post-launch radiometric calibration of space-based instruments. The key characteristics of suitable sites are outlined primarily with respect to selection criteria, spatial uniformity, and temporal stability. The establishment and utilization of such benchmark sites is considered an important element of the radiometric traceability of satellite image data products for use in the accurate monitoring of environmental change.

  9. Double layer structure-based virtual screening reveals 3'-Hydroxy-A-Naphthoflavone as novel inhibitor candidate of human acetylcholinesterase

    Science.gov (United States)

    Ichsan, Mochammad; Pangastuti, Ardini; Habibi, Mohammad Wildan; Juliana, Kartika

    2016-03-01

    One of the most effective target for Alzheimer's disease's (AD) treatment is the inhibition of human acetylcholinesterase (hAChE) eventhough it has many side effects. So that, this study was aimed to discover a new candidate of hAChE's inhibitor that has more negative binding affinity than existing drugs. hAChE's 3D model used in this study has a good quality according to its number of residues in most favoured regions (92%), three bad contacts, >50 ERRAT's score (85,870) and successfully passed the VERIFY 3D threshold (>80%). Based on the first layer of SBVS againts more than 12.180.630 ligands, we discovered 11.806 hits and then we found 359 hits from the second layer of SBVS. Based on our previous steps, we found that 3'-Hydroxy-a-Naphthoflavone was the only one candidate, that directly interacted with Trp286 via hydrogen bond and hydrophobic interactions and also has the most negative binding affinity (-10,6 kcal/mol) and also has more negative than existing hAChE's inhibitors, such as tacrine, donepezil, etc. 3'-Hydroxy-a-Naphthoflavone is the best candidate of hAChE's inhibitor based on its binding affinity (-10,6 kcal/mol) that is more negative than existing hAChE's inhibitors, such as tacrine, donepezil, etc.

  10. Establishing a Th17 based mouse model for preclinical assessment of the toxicity of candidate microbicides

    Institute of Scientific and Technical Information of China (English)

    LI Liang-zhu; YANG Yu; YUAN Song-hua; WAN Yan-min; QIU Chao; FENG Yan-ling; XU Jian-qing; ZHANG Xiao-yan

    2010-01-01

    one mouse (score: 8), which were significantly associated with both inflammatory cytokines IL-17A and IL-6 and anti-inflammatory cytokines IL-4 and IL-10. Interestingly, IL-17A showed significant positive association with inflammatory cytokine TNF-α (r=0.739; P <0.05), anti-inflammatory cytokines IL-10 (r=0.804; P <0.01) and IL-4 (r=0.668; P <0.05).Conclusions Our data demonstrate that a panel of cytokines (IL-17A, IL-6, IL-4 and IL-10) could be used as surrogate biomarkers to predict the histopathological damage. Th17 may play a central role in orchestrating inflammatory cytokine responses. This Th17 based mouse model is cost-effective and suitable to assess the toxicity of candidate microbicides in preclinical studies.

  11. Reliability of lead-free solders in electronic packaging technology

    Science.gov (United States)

    Choi, Woojin

    The electromigration of flip chip solder bump (eutetic SnPb) has been studied at temperatures of 100, 125 and 150°C and current densities of 1.9 to 2.75 x 104 A/cm2. The under-bump-metallization on the chip side is thin film Al/Ni(V)/Cu and on the board side is thick Cu. By simulation, we found that current crowding occurs at the corner on the chip side where the electrons enter the solder ball. We are able to match this simulation to the real electromigration damage in the sample. The experimental result showed that voids initiated from the position of current crowding and propagated across the interface between UBM and the solder ball. The Cu-Sn intermetallic compounds formed during the reflow is known to adhere well to the thin film UBM, but they detached from the UBM after current stressing. Therefore, the UBM itself becomes part of the reliability problem of the flip chip solder joint under electromigration. Currently there is a renewed interest in Sn whisker growth owing to the introduction of Pb-free solder in electronic manufacturing. The leadframe is electroplated or finished with a layer of Pb-free solder. The solder is typically pure Sn or eutectic SnCu (0.7 atomic % Cu). It is a serious reliability concern in the use of the eutectic SnCu solder as leadframe surface finish due to the growth of long whiskers on it. The origin of the driving force of compressive stress can be mechanical, thermal, and chemical. Among them, the chemical force is the most important contribution to the whisker growth and its origin is due to the reaction between Sn and Cu to form intermetallic compound (IMC) at room temperature. For whisker or hillock growth, the surface cannot be free of oxide and it must be covered with oxide and the oxide must be a protective one so that it removes effectively all the vacancy sources and sinks on the surface. Hence, only those metals, which grow protective oxides such as Al and Sn, are known to have hillock growth or whisker growth. We

  12. Experimental Methods in Reduced-gravity Soldering Research

    Science.gov (United States)

    Pettegrew, Richard D.; Struk, Peter M.; Watson, John K.; Haylett, Daniel R.

    2002-01-01

    The National Center for Microgravity Research, NASA Glenn Research Center, and NASA Johnson Space Center are conducting an experimental program to explore the influence of reduced gravity environments on the soldering process. An improved understanding of the effects of the acceleration environment is important to application of soldering during current and future human space missions. Solder joint characteristics that are being considered include solder fillet geometry, porosity, and microstructural features. Both through-hole and surface mounted devices are being investigated. This paper focuses on the experimental methodology employed in this project and the results of macroscopic sample examination. The specific soldering process, sample configurations, materials, and equipment were selected to be consistent with those currently on-orbit. Other apparatus was incorporated to meet requirements imposed by operation onboard NASA's KC-135 research aircraft and instrumentation was provided to monitor both the atmospheric and acceleration environments. The contingent of test operators was selected to include both highly skilled technicians and less skilled individuals to provide a population cross-section that would be representative of the skill mix that might be encountered in space mission crews.

  13. 30 CFR 77.1112 - Welding, cutting, or soldering with arc or flame; safeguards.

    Science.gov (United States)

    2010-07-01

    ... 30 Mineral Resources 1 2010-07-01 2010-07-01 false Welding, cutting, or soldering with arc or... WORK AREAS OF UNDERGROUND COAL MINES Fire Protection § 77.1112 Welding, cutting, or soldering with arc or flame; safeguards. (a) When welding, cutting, or soldering with arc or flame near...

  14. 30 CFR 77.1916 - Welding, cutting, and soldering; fire protection.

    Science.gov (United States)

    2010-07-01

    ... 30 Mineral Resources 1 2010-07-01 2010-07-01 false Welding, cutting, and soldering; fire... OF UNDERGROUND COAL MINES Slope and Shaft Sinking § 77.1916 Welding, cutting, and soldering; fire protection. (a) One portable fire extinguisher shall be provided where welding, cutting, or soldering...

  15. 30 CFR 75.1106 - Welding, cutting, or soldering with arc or flame underground.

    Science.gov (United States)

    2010-07-01

    ... 30 Mineral Resources 1 2010-07-01 2010-07-01 false Welding, cutting, or soldering with arc or... Protection § 75.1106 Welding, cutting, or soldering with arc or flame underground. All welding, cutting, or... conducted in fireproof enclosures. Welding, cutting, or soldering with arc or flame in other than...

  16. High-Temperature Lead-Free Solder Alternatives: Possibilities and Properties

    DEFF Research Database (Denmark)

    High-temperature solders have been widely used as joining materials to provide stable interconnections that resist a severe thermal environment and also to facilitate the drive for miniaturization. High-lead containing solders have been commonly used as high-temperature solders. The development of...

  17. Investigation Of Intermetallic Compounds In Sn-Cu-Ni Lead-Free Solders

    Directory of Open Access Journals (Sweden)

    Nagy E.

    2015-06-01

    Full Text Available Interfacial intermetallic compounds (IMC play an important role in Sn-Cu lead-free soldering. The size and morphology of the intermetallic compounds formed between the lead-free solder and the Cu substrate have a significant effect on the mechanical strength of the solder joint.

  18. Photonic flash soldering of thin chips and SMD components on foils for flexible electronics

    NARCIS (Netherlands)

    Ende, D.A. van den; Hendriks, R.; Cauchois, R.; Kusters, R.H.L.; Cauwe, M.; Groen, W.A.; Brand, J. van den

    2014-01-01

    Ultrathin bare die chips and small-size surface mount device components were successfully soldered using a novel roll-to-roll compatible soldering technology. A high-power xenon light flash was used to successfully solder the components to copper tracks on polyimide (PI) and polyethylene terephthala

  19. Polarity effect of electromigration on kinetics of intermetallic compound formation in Pb-free solder V-groove samples

    Science.gov (United States)

    Gan, H.; Tu, K. N.

    2005-03-01

    Intermetallic compound (IMC) formation is critical for the reliability of microelectronic interconnections, especially for flip chip solder joints. In this article, we investigate the polarity effect of electromigration on kinetics of IMC formation at the anode and the cathode in solder V-groove samples. We use V-groove solder line samples, with width of 100 μm and length of 500-700 μm, to study interfacial IMC growth between Cu electrodes and Sn-3.8Ag-0.7Cu (in wt %) solder under different current density and temperature settings. The current densities are in the range of 103 to 104A/cm2 and the temperature settings are 120, 150, and 180 °C. While the same types of IMCs, Cu6Sn5 and Cu3Sn, form at the solder/Cu interfaces independent of the passage of electric current, the growth of the IMC layer has been enhanced by electric current at the anode and inhibited at the cathode, in comparison with the no-current case. We present a kinetic model, based on the Cu mass transport in the sample, to explain the growth rate of IMC at the anode and cathode. The growth of IMC at the anode follows a parabolic growth rule, and we propose that the back stress induced in the IMC plays a significant role. The model is in good agreement with our experimental data. We then discuss the influence of both chemical force and electrical force, and their combined effect on the IMC growth with electric current.

  20. A PSF-based approach to Kepler/K2 data. II. Exoplanet candidates in Praesepe (M 44)

    CERN Document Server

    Libralato, M; Bedin, L R; Borsato, L; Granata, V; Malavolta, L; Piotto, G; Ochner, P; Cunial, A; Nascimbeni, V

    2016-01-01

    In this work we keep pushing K2 data to a high photometric precision, close to that of the Kepler main mission, using a PSF-based, neighbour-subtraction technique, which also overcome the dilution effects in crowded environments. We analyse the open cluster M 44 (NGC 2632), observed during the K2 Campaign 5, and extract light curves of stars imaged on module 14, where most of the cluster lies. We present two candidate exoplanets hosted by cluster members and five by field stars. As a by-product of our investigation, we find 1680 eclipsing binaries and variable stars, 1071 of which are new discoveries. Among them, we report the presence of a heartbeat binary star. Together with this work, we release to the community a catalogue with the variable stars and the candidate exoplanets found, as well as all our raw and detrended light curves.

  1. Candidate evaluation system: Documentation of the data base design and application software for the prototype expert support system

    Energy Technology Data Exchange (ETDEWEB)

    Arnold, H.G.; Loffman, R.S.; Sexton, F.L.; Rush, R.M.

    1988-06-01

    The US Department of the Army established the Candidate Evaluation Prototype Project, Project Management Office to analyze the current procedure for filing Army civilian jobs and to develop improved automated procedures to meet this need. The Army Civilian Personnel Center (now the Civilian Information Directorate) tasked The Oak Ridge National Laboratory (ORNL) to provide technical support, research, and development to the Project Management Office and deliver a prototype of a Candidate Evaluation System that would run on the minicomputer hardware and software being delivered to personnel offices located throughout the world. This report discusses the background of the project, including constraints and requirements; describes the data base design and program code developed to implement the prototype; documents known limitations of the prototype; and contains recommendations to be considered in future development. The objective of this report is to document the prototype software system for use by Army programmers/analysts who will maintain or further develop the prototype software.

  2. A PSF-based approach to Kepler/K2 data. II. Exoplanet candidates in Praesepe (M 44)

    Science.gov (United States)

    Libralato, M.; Nardiello, D.; Bedin, L. R.; Borsato, L.; Granata, V.; Malavolta, L.; Piotto, G.; Ochner, P.; Cunial, A.; Nascimbeni, V.

    2016-08-01

    In this work we keep pushing K2 data to a high photometric precision, close to that of the Kepler main mission, using a PSF-based, neighbour-subtraction technique, which also overcome the dilution effects in crowded environments. We analyse the open cluster M 44 (NGC 2632), observed during the K2 Campaign 5, and extract light curves of stars imaged on module 14, where most of the cluster lies. We present two candidate exoplanets hosted by cluster members and five by field stars. As a by-product of our investigation, we find 1680 eclipsing binaries and variable stars, 1071 of which are new discoveries. Among them, we report the presence of a heartbeat binary star. Together with this work, we release to the community a catalogue with the variable stars and the candidate exoplanets found, as well as all our raw and detrended light curves.

  3. Globular clusters hosting intermediate-mass black-holes: no mass-segregation based candidates

    CERN Document Server

    Pasquato, Mario; Sohn, Bong Won; Lee, Young-Wook

    2016-01-01

    Recently, both stellar mass-segregation and binary-fractions were uniformly measured on relatively large samples of Galactic Globular Clusters (GCs). Simulations show that both sizeable binary-star populations and Intermediate-Mass Black Holes (IMBHs) quench mass-segregation in relaxed GCs. Thus mass-segregation in GCs with a reliable binary-fraction measurement is a valuable probe to constrain IMBHs. In this paper we combine mass-segregation and binary-fraction measurements from the literature to build a sample of 33 GCs (with measured core-binary fractions), and a sample of 43 GCs (with a binary fraction measurement in the area between the core radius and the half-mass radius). Within both samples we try to identify IMBH-host candidates. These should have relatively low mass-segregation, a low binary fraction (< 5%), and short (< 1 Gyr) relaxation time. Considering the core binary fraction sample, no suitable candidates emerge. If the binary fraction between the core and the half-mass radius is consid...

  4. Investigations into the Antibacterial Activity of the Silver-Based Antibiotic Drug Candidate SBC3

    Directory of Open Access Journals (Sweden)

    Matthias Tacke

    2012-11-01

    Full Text Available The synthesis of N-heterocyclic carbene (NHC silver(I acetate complexes with varying lipophilic benzyl-substituents at the 1 and 3 positions starting from 4,5-diphenylimidazole, opened a new class of antibiotic drug candidates. These NHC-silver(I acetate derivatives exhibit interesting structural motifs in the solid state and proved to be soluble and stable in biological media. The leading candidate, SBC3, which was known to exhibit good antibacterial activity in preliminary Kirby-Bauer tests, was tested quantitatively using minimum inhibitory concentrations. NHC-silver(I acetate complexes were found to have MIC values ranging from 20 to 3.13 μg/mL for a variety of Gram-positive, Gram-negative and mycobacteria tested. These values represent good antibiotic activities against potential pathogens when compared to clinically approved antibiotics. Most striking is the fact that SBC3 is active against methicillin-resistant Staphylococcus aureus with a MIC value of 12.5 μg/mL.

  5. Imputation-based analysis of association studies: candidate regions and quantitative traits.

    Directory of Open Access Journals (Sweden)

    Bertrand Servin

    2007-07-01

    Full Text Available We introduce a new framework for the analysis of association studies, designed to allow untyped variants to be more effectively and directly tested for association with a phenotype. The idea is to combine knowledge on patterns of correlation among SNPs (e.g., from the International HapMap project or resequencing data in a candidate region of interest with genotype data at tag SNPs collected on a phenotyped study sample, to estimate ("impute" unmeasured genotypes, and then assess association between the phenotype and these estimated genotypes. Compared with standard single-SNP tests, this approach results in increased power to detect association, even in cases in which the causal variant is typed, with the greatest gain occurring when multiple causal variants are present. It also provides more interpretable explanations for observed associations, including assessing, for each SNP, the strength of the evidence that it (rather than another correlated SNP is causal. Although we focus on association studies with quantitative phenotype and a relatively restricted region (e.g., a candidate gene, the framework is applicable and computationally practical for whole genome association studies. Methods described here are implemented in a software package, Bim-Bam, available from the Stephens Lab website http://stephenslab.uchicago.edu/software.html.

  6. Horizon Shells and BMS-like Soldering Transformations

    CERN Document Server

    Blau, Matthias

    2015-01-01

    We revisit the theory of null shells in general relativity, with a particular emphasis on null shells placed at horizons of black holes. We study in detail the considerable freedom that is available in the case that one solders two metrics together across null hypersurfaces (such as Killing horizons) for which the induced metric is invariant under translations along the null generators. In this case the group of soldering transformations turns out to be infinite dimensional, and these solderings create non-trivial horizon shells containing both massless matter and impulsive gravitational wave components. We also rephrase this result in the language of Carrollian symmetry groups. To illustrate this phenomenon we discuss in detail the example of shells on the horizon of the Schwarzschild black hole (with equal interior and exterior mass), uncovering a rich classical structure at the horizon and deriving an explicit expression for the general horizon shell energy-momentum tensor. In the special case of BMS-like ...

  7. Materials chemistry. Composition-matched molecular "solders" for semiconductors.

    Science.gov (United States)

    Dolzhnikov, Dmitriy S; Zhang, Hao; Jang, Jaeyoung; Son, Jae Sung; Panthani, Matthew G; Shibata, Tomohiro; Chattopadhyay, Soma; Talapin, Dmitri V

    2015-01-23

    We propose a general strategy to synthesize largely unexplored soluble chalcogenidometallates of cadmium, lead, and bismuth. These compounds can be used as "solders" for semiconductors widely used in photovoltaics and thermoelectrics. The addition of solder helped to bond crystal surfaces and link nano- or mesoscale particles together. For example, CdSe nanocrystals with Na2Cd2Se3 solder was used as a soluble precursor for CdSe films with electron mobilities exceeding 300 square centimeters per volt-second. CdTe, PbTe, and Bi2Te3 powders were molded into various shapes in the presence of a small additive of composition-matched chalcogenidometallate or chalcogel, thus opening new design spaces for semiconductor technologies.

  8. Corrosion Issues in Solder Joint Design and Service

    Energy Technology Data Exchange (ETDEWEB)

    VIANCO,PAUL T.

    1999-11-24

    Corrosion is an important consideration in the design of a solder joint. It must be addressed with respect to the service environment or, as in the case of soldered conduit, as the nature of the medium being transported within piping or tubing. Galvanic-assisted corrosion is of particular concern, given the fact that solder joints are comprised of different metals or alloy compositions that are in contact with one-another. The (thermodynamic) potential for corrosion to take place in a particular environment requires the availability of the galvanic series for those conditions and which includes the metals or alloys in question. However, the corrosion kinetics, which actually determine the rate of material loss under the specified service conditions, are only available through laboratory evaluations or field data that are found in the existing literature or must be obtained by in-house testing.

  9. Globular Clusters Hosting Intermediate-Mass Black Holes: No Mass-Segregation Based Candidates

    Science.gov (United States)

    Pasquato, Mario; Miocchi, Paolo; Won, Sohn Bong; Lee, Young-Wook

    2016-06-01

    Recently, both stellar mass segregation and binary fractions were uniformly measured on relatively large samples of Galactic globular clusters (GCs). Simulations show that both sizable binary-star populations and intermediate-mass black holes (IMBHs) quench mass segregation in relaxed GCs. Thus mass segregation in GCs with a reliable binary-fraction measurement is a valuable probe to constrain IMBHs. In this paper we combine mass-segregation and binary-fraction measurements from the literature to build a sample of 33 GCs (with measured core binary fractions), and a sample of 43 GCs (with binary-fraction measurements in the area between the core radius and the half-mass radius). Within both samples we try to identify IMBH-host candidates. These should have relatively low mass segregation, a low binary fraction (segregated (and show a larger binary fraction), confirming the theoretical expectation that the energy sources responsible for the large core are also quenching mass segregation.

  10. Old and Unemployable? How Age‐Based Stereotypes Affect Willingness to Hire Job Candidates

    Science.gov (United States)

    Swift, Hannah J.; Drury, Lisbeth

    2016-01-01

    Across the world, people are required, or want, to work until an increasingly old age. But how might prospective employers view job applicants who have skills and qualities that they associate with older adults? This article draws on social role theory, age stereotypes and research on hiring biases, and reports three studies using age‐diverse North American participants. These studies reveal that: (1) positive older age stereotype characteristics are viewed less favorably as criteria for job hire, (2) even when the job role is low‐status, a younger stereotype profile tends to be preferred, and (3) an older stereotype profile is only considered hirable when the role is explicitly cast as subordinate to that of a candidate with a younger age profile. Implications for age‐positive selection procedures and ways to reduce the impact of implicit age biases are discussed. PMID:27635102

  11. Candidate lesion-based criteria for defining a positive sacroiliac joint MRI in two cohorts of patients with axial spondyloarthritis

    DEFF Research Database (Denmark)

    Weber, Ulrich; Østergaard, Mikkel; Lambert, Robert G W;

    2015-01-01

    OBJECTIVE: To determine candidate lesion-based criteria for a positive sacroiliac joint (SIJ) MRI based on bone marrow oedema (BMO) and/or erosion in non-radiographic axial spondyloarthritis (nr-axSpA); to compare the performance of lesion-based criteria with global evaluation by expert readers...... clinical examination, pelvic radiography and laboratory values as having nr-axSpA (n=51), ankylosing spondylitis (n=34) or non-specific back pain (n=72). Four blinded readers assessed SIJ MRI, recording the presence/absence of SpA by concomitant global evaluation of T1-weighted spin echo (T1SE) and short τ...... inversion recovery (STIR) scans and, thereafter, whether BMO and/or erosion were present/absent in each SIJ quadrant of each MRI slice. We derived candidate lesion-based criteria based on the number of SIJ quadrants with BMO and/or erosion and calculated mean sensitivity and specificity for SpA. RESULTS...

  12. Investigation of causes of defects of mechanisms and soldered joints in problems of increasing reliability of airborne radioelectronics

    Directory of Open Access Journals (Sweden)

    В. В. Зубарев

    1999-05-01

    Full Text Available Presented are the results of investigation of the soldered units quality on physical and chemical levels, also the influence of the conditions of soldering technology on the structure of solder on the surface of printed plate. Investigated is solder granularity structure and the coefficient of its blowing depending on the time in melted state. Investigated is also dependence of insulation resistance of printed plates on the time of exposure in humidity chamber, also the solder degradation mechanisms are studied

  13. The (w)hole survey: An unbiased sample study of transition disk candidates based on Spitzer catalogs

    Science.gov (United States)

    van der Marel, N.; Verhaar, B. W.; van Terwisga, S.; Merín, B.; Herczeg, G.; Ligterink, N. F. W.; van Dishoeck, E. F.

    2016-08-01

    Understanding disk evolution and dissipation is essential for studies of planet formation. Transition disks, i.e., disks with large dust cavities and gaps, are promising candidates of active evolution. About two dozen candidates, selected by their spectral energy distribution (SED), have been confirmed to have dust cavities through millimeter interferometric imaging, but this sample is biased toward the brightest disks. The Spitzer surveys of nearby low-mass star-forming regions have resulted in more than 4000 young stellar objects. Using color criteria, we selected a sample of ~150 candidates and an additional 40 candidates and known transition disks from the literature. The Spitzer data were complemented by new observations at longer wavelengths, including new JCMT and APEX submillimeter photometry, and WISE and Herschel-PACS mid- and far-infrared photometry. Furthermore, optical spectroscopy was obtained and stellar types were derived for 85% of the sample, including information from the literature. The SEDs were fit to a grid of RADMC-3D disk models with a limited number of parameters: disk mass, inner disk mass, scale height and flaring, and disk cavity radius, where the latter is the main parameter of interest. About 72% of our targets possibly have dust cavities based on the SED. The derived cavity sizes are consistent with imaging/modeling results in the literature, where available. Trends are found with Ldisk over L∗ ratio and stellar mass and a possible connection with exoplanet orbital radii. A comparison with a previous study where color observables are used reveals large overlap between their category of planet-forming disks and our transition disks with cavities. A large number of the new transition disk candidates are suitable for follow-up observations with ALMA. Full Tables 4, 5, A.1-A.3, C.1, and D.1 are only available at the CDS via anonymous ftp to http://cdsarc.u-strasbg.fr (http://130.79.128.5) or via http://cdsarc

  14. Thermal cyclic test for Sn-4Ag-0.5Cu solders on high P Ni/Au and Ni/Pd/Au surface finishes

    Directory of Open Access Journals (Sweden)

    M.A. Azmah Hanim

    2015-12-01

    Full Text Available In electronic packaging, the reliability of the interconnection changes with the surface finish and the type of solders being used. Thermal cycling is one method of reliability assessment. In thermal cycling experiments, the strain state is simplified by soldering together regular shaped pieces of materials with different coefficients of thermal expansion and exposing the joint to repeated fluctuations of temperature within a certain range. Thus, this study focuses on the intermetallic evolution of Sn-4Ag-0.5Cu on Ni/Au and Ni/Pd/Au surface finishes with thermal cycling up to 1000 cycles with the range of temperature varying from 10 to 80 °C. Sandwich samples were prepared by placing solder balls of Sn-4Ag-0.5Cu between two substrates of two different surface finishes: Ni/Au and Ni/Pd/Au. Optical microscope and FESEM (Field emission scanning electron microscope were used to analyze the samples. From the study, it was observed that the intermetallic changes from (Cu, Ni6Sn5 to (Ni, Cu3Sn4 after 1000 thermal cycles for Ni/Au. These changes promote the formation of cracks at the solder joint because of the different mechanical properties between Ni-Sn based intermetallic and Cu-Sn intermetallics. However, for the Ni/Pd/Au surface finishes, no cracks formed after thermal cycling up to 1000 cycles. This shows that the reliability of the solder joint is higher for Ni/Pd/Au surface finishes in this experiment. Based on these results, it can be concluded that the reliability of the Ni/Pd/Au surface finishes with Sn-4Ag-0.5Cu solders is higher within the given condition of this research.

  15. Improving low-level plasma protein mass spectrometry-based detection for candidate biomarker discovery and validation

    Energy Technology Data Exchange (ETDEWEB)

    Page, Jason S.; Kelly, Ryan T.; Camp, David G.; Smith, Richard D.

    2008-09-01

    Methods. To improve the detection of low abundance protein candidate biomarker discovery and validation, particularly in complex biological fluids such as blood plasma, increased sensitivity is desired using mass spectrometry (MS)-based instrumentation. A key current limitation on the sensitivity of electrospray ionization (ESI) MS is due to the fact that many sample molecules in solution are never ionized, and the vast majority of the ions that are created are lost during transmission from atmospheric pressure to the low pressure region of the mass analyzer. Two key technologies, multi-nanoelectrospray emitters and the electrodynamic ion funnel have recently been developed and refined at Pacific Northwest National Laboratory (PNNL) to greatly improve the ionization and transmission efficiency of ESI MS based analyses. Multi-emitter based ESI enables the flow from a single source (typically a liquid chromatography [LC] column) to be divided among an array of emitters (Figure 1). The flow rate delivered to each emitter is thus reduced, allowing the well-documented benefits of nanoelectrospray 1 for both sensitivity and quantitation to be realized for higher flow rate separations. To complement the increased ionization efficiency afforded by multi-ESI, tandem electrodynamic ion funnels have also been developed at PNNL, and shown to greatly improve ion transmission efficiency in the ion source interface.2, 3 These technologies have been integrated into a triple quadrupole mass spectrometer for multiple reaction monitoring (MRM) of probable biomarker candidates in blood plasma and show promise for the identification of new species even at low level concentrations.

  16. Fast Qualification of Solder Reliability in Solid-state Lighting System

    OpenAIRE

    Zhang, J.

    2015-01-01

    Solid-state lighting (SSL), which is based 0n semiconductor Lighting Emitting Diode (LED), is the most promising and reliable energy saving solution for future lighting applications. Since a bare LED die can hardly survive without a package, one of the most import function of the LED package is to facilitate the electrical connection and heat dissipation of the light engine mounted on a printed circuit board (PCB) by Land Grid Array (LGA) solder joints. These joints have been proven to be one...

  17. Identification of candidate target genes of pituitary adenomas based on the DNA microarray.

    Science.gov (United States)

    Zhou, Wei; Ma, Chun-Xiao; Xing, Ya-Zhou; Yan, Zhao-Yue

    2016-03-01

    The present study aimed to explore molecular mechanisms involved in pituitary adenomas (PAs) and to discover target genes for their treatment. The gene expression profile GSE4488 was downloaded from the Gene Expression Omnibus database. Differentially expressed genes (DEGs) were identified using the Limma package and analyzed by two‑dimensional hierarchical clustering. Gene ontology (GO) and pathway enrichment analyses were performed in order to investigate the functions of DEGs. Subsequently, the protein‑protein interaction (PPI) network was constructed using Cytoscape software. DEGs were then mapped to the connectivity map database to identify molecular agents associated with the underlying mechanisms of PAs. A total of 340 upregulated and 49 downregulated DEGs in PA samples compared with those in normal controls were identified. Hierarchical clustering analysis showed that DEGs were highly differentially expressed, indicating their aptness for distinguishing PA samples from normal controls. Significant gene ontology terms were positive regulation of immune system-associated processes for downregulated DEGs and skeletal system development for upregulated DEGs. Pathways significantly enriched by DEGs included extracellular matrix (ECM)‑receptor interaction, the Hedgehog (Hh) signaling pathway and neuroactive ligand‑receptor interaction. The PPI network was constructed with 117 nodes, 123 edges and CD44 and Gli2 as hub nodes. Furthermore, depudecin, a small molecule drug, was identified to be mechanistically associated with PA. The genes CD44 and Gli2 have important roles in the progression of PAs via ECM‑receptor interaction and the Hh signaling pathway and are therefore potential target genes of PA. In addition, depudecin may be a candidate drug for the treatment of PAs. PMID:26782791

  18. Aqueous cleaning of flux residue from solder joints. Final report

    Energy Technology Data Exchange (ETDEWEB)

    Krska, C.M.

    1992-08-01

    Solder joints have traditionally been cleaned using chlorinated or fluorinated solvents. This study addressed alternate processing. One process involved using a saponifier/water solution to remove rosin flux residues; the other process involved using a water-soluble flux and water to remove the residues. Although both processes were satisfactory, the water-soluble flux with water cleaning proved to be the best.

  19. Aqueous cleaning of flux residue from solder joints

    Energy Technology Data Exchange (ETDEWEB)

    Krska, C.M.

    1992-08-01

    Solder joints have traditionally been cleaned using chlorinated or fluorinated solvents. This study addressed alternate processing. One process involved using a saponifier/water solution to remove rosin flux residues; the other process involved using a water-soluble flux and water to remove the residues. Although both processes were satisfactory, the water-soluble flux with water cleaning proved to be the best.

  20. Horizon shells and BMS-like soldering transformations

    Science.gov (United States)

    Blau, Matthias; O'Loughlin, Martin

    2016-03-01

    We revisit the theory of null shells in general relativity, with a particular emphasis on null shells placed at horizons of black holes. We study in detail the considerable freedom that is available in the case that one solders two metrics together across null hypersurfaces (such as Killing horizons) for which the induced metric is invariant under translations along the null generators. In this case the group of soldering transformations turns out to be infinite dimensional, and these solderings create non-trivial horizon shells containing both massless matter and impulsive gravitational wave components. We also rephrase this result in the language of Carrollian symmetry groups. To illustrate this phenomenon we discuss in detail the example of shells on the horizon of the Schwarzschild black hole (with equal interior and exterior mass), uncovering a rich classical structure at the horizon and deriving an explicit expression for the general horizon shell energy-momentum tensor. In the special case of BMS-like soldering supertranslations we find a conserved shell-energy that is strikingly similar to the standard expression for asymptotic BMS supertranslation charges, suggesting a direct relation between the physical properties of these horizon shells and the recently proposed BMS supertranslation hair of a black hole.

  1. Fundamentals of wetting and spreading with emphasis on soldering

    Energy Technology Data Exchange (ETDEWEB)

    Yost, F.G.

    1991-01-01

    Soldering is often referred to as a mature technology whose fundamentals were established long ago. Yet a multitude of soldering problems persist, not the least of which are related to the wetting and spreading of solder. The Buff-Goodrich approach to thermodynamics of capillarity is utilized in a review of basic wetting principles. These thermodynamics allow a very compact formulation of capillary phenomena which is used to calculate various meniscus shapes and wetting forces. These shapes and forces lend themselves to experimental techniques, such as the sessile drop and the Wilhelmy plate, for measuring useful surface and interfacial energies. The familiar equations of Young, Wilhelmy, and Neumann are all derived with this approach. The force-energy duality of surface energy is discussed and the force method is developed and used to derive the Herring relations for anisotropic surfaces. The importance of contact angle hysteresis which results from surface roughness and chemical inhomogeneity is presented and Young's equation is modified to reflect these ever present effects. Finally, an analysis of wetting with simultaneous metallurigical reaction is given and used to discuss solder wetting phenomena. 60 refs., 13 figs.

  2. Phylogeography, salinity adaptations and metabolic potential of the Candidate Division KB1 Bacteria based on a partial single cell genome.

    Directory of Open Access Journals (Sweden)

    Lisa M Nigro

    2016-08-01

    Full Text Available Deep-sea hypersaline anoxic basins (DHABs and other hypersaline environments contain abundant and diverse microbial life that has adapted to these extreme conditions. The bacterial Candidate Division KB1 represents one of several uncultured groups that has been consistently observed in hypersaline microbial diversity studies. Here we report the phylogeography of KB1, its phylogenetic relationships to Candidate Division OP1 Bacteria, and its potential metabolic and osmotic stress adaptations based on a partial single cell amplified genome (SAG of KB1 from Orca Basin, the largest hypersaline seafloor brine basin in the Gulf of Mexico. Our results are consistent with the hypothesis – previously developed based on 14C incorporation experiments with mixed-species enrichments from Mediterranean seafloor brines - that KB1 has adapted its proteins to elevated intracellular salinity, but at the same time KB1 apparently imports glycine betaine; this compatible solute is potentially not limited to osmoregulation but could also serve as a carbon and energy source.

  3. Roles of interfacial reaction on mechanical properties of solder interfaces

    Science.gov (United States)

    Liu, Pilin

    This study investigated roles of interfacial reaction in fracture and fatigue of solder interconnects. The interfacial reaction phases in the as-reflowed and after aging were examined by cross-sectional transmission electron microscopy (TEM) while interfacial mechanical properties were determined from a flexural peel fracture mechanics technique. Because of their widespread uses in microelectronic packaging, SnPb solder interfaces, and Bi-containing Pb-free solder interfaces were chosen as the subjects of this study. In the interfacial reaction study, we observed a complicated micro structural evolution during solid-state aging of electroless-Ni(P)/SnPb solder interconnects. In as-reflowed condition, the interfacial reaction produced Ni3Sn 4 and P-rich layers. Following overaging, the interfacial microstructure degenerated into a complex multilayer structure consisting of multiple layers of Ni-Sn compounds and transformed Ni-P phases. In SnPb solder interfacial system, fatigue study showed that the overaging of the high P electroless Ni-P/SnPb interconnects resulted in a sharp reduction in the fatigue resistance of the interface in the high crack growth rate regime. Fracture mechanism analysis indicated that the sharp drop in fatigue resistance was triggered by the brittle fracture of the Ni3Sn2 intermetallic phase developed at the overaged interface. The fatigue behavior was strongly dependent on P concentration in electroless Ni. Kirkendall voids were found in the interfacial region after aging, but they did not cause premature fracture of the solder interfaces. In Bi-containing solder interfacial system, we found that Bi segregated to the Cu-intermetallic interface during aging in SnBi/Cu interconnect. This caused serious embrittlement of Sn-Bi/Cu interface. Further aging induced numerous voids along the Cu3Sn/Cu interface. These interfacial voids were different from Kirkendall voids. Their formation was explained on basis of vacancy condensation at the

  4. Recognition-Based Pedagogy: Teacher Candidates' Experience of Deficit

    Science.gov (United States)

    Parkison, Paul T.; DaoJensen, Thuy

    2014-01-01

    This study seeks to introduce what we call "recognition-based pedagogy" as a conceptual frame through which teachers and instructors can collaboratively develop educative experiences with students. Recognition-based pedagogy connects the theories of critical pedagogy, identity politics, and the politics of recognition with the educative…

  5. Thermally induced degradation pathways of three different antibody-based drug development candidates.

    Science.gov (United States)

    Fincke, Anja; Winter, Jonas; Bunte, Thomas; Olbrich, Carsten

    2014-10-01

    Protein-based medicinal products are prone to undergo a variety of chemical and physical degradation pathways. One of the most important exogenous stress condition to consider during manufacturing, transport and storage processes is temperature, because antibody-based therapeutics are only stable in a limited temperature range. In this study, three different formats of antibody-based molecules (IgG1, a bispecific scFv and a fab fragment) were exposed to thermal stress conditions occurring during transport and storage. For evaluation, an analytical platform was developed for the detection and characterization of relevant degradation pathways of different antibody-based therapeutics. The effect of thermal stress conditions on the stability of the three antibody-based formats was therefore investigated using visual inspection, different spectroscopic measurements, dynamic light scattering (DLS), differential scanning calorimetry (DSC), electrophoresis, asymmetric flow field-flow fractionation (AF4) and surface plasmon resonance technology (SPR). In summary, thermal stress led to heterogeneous chemical and physical degradation pathways of all three antibody-based formats used. In addition, identical exogenous stress conditions resulted in different kinds and levels of aggregates and fragmentation products. This knowledge is fundamental for a systematic and successful stabilization of protein-based therapeutics by the use of formulation additives.

  6. Evaluation of Candidate Measures for Home-Based Screening of Sleep Disordered Breathing in Taiwanese Bus Drivers

    Directory of Open Access Journals (Sweden)

    Hua Ting

    2014-05-01

    Full Text Available Background: Sleepiness-at-the-wheel has been identified as a major cause of highway accidents. The aim of our study is identifying the candidate measures for home-based screening of sleep disordered breathing in Taiwanese bus drivers, instead of polysomnography. Methods: Overnight polysomnography accompanied with simultaneous measurements of alternative screening devices (pulse oximetry, ApneaLink, and Actigraphy, heart rate variability, wake-up systolic blood pressure and questionnaires were completed by 151 eligible participants who were long-haul bus drivers with a duty period of more than 12 h a day and duty shifting. Results: 63.6% of professional bus drivers were diagnosed as having sleep disordered breathing and had a higher body mass index, neck circumference, systolic blood pressure, arousal index and desaturation index than those professional bus drivers without evidence of sleep disordered breathing. Simple home-based candidate measures: (1 Pulse oximetry, oxygen-desaturation indices by ≥3% and 4% (r = 0.87~0.92; (2 Pulse oximetry, pulse-rising indices by ≥7% and 8% from a baseline (r = 0.61~0.89; and (3 ApneaLink airflow detection, apnea-hypopnea indices (r = 0.70~0.70, based on recording-time or Actigraphy-corrected total sleep time were all significantly correlated with, and had high agreement with, corresponding polysomnographic apnea-hypopnea indices [(1 94.5%~96.6%, (2 93.8%~97.2%, (3 91.1%~91.3%, respectively]. Conversely, no validities of SDB screening were found in the multi-variables apnea prediction questionnaire, Epworth Sleepiness Scale, night-sleep heart rate variability, wake-up systolic blood pressure and anthropometric variables. Conclusions: The indices of pulse oximetry and apnea flow detection are eligible criteria for home-based screening of sleep disordered breathing, specifically for professional drivers.

  7. Electromigration Behaviors of Cu Reinforced Sn-3.5Ag Composite Solder Joints

    Science.gov (United States)

    Wang, Yan; Han, Jing; Ma, Limin; Zuo, Yong; Guo, Fu

    2016-09-01

    The composite approach, by incorporating small amounts of reinforcement particles in the solder matrix, has proven to be one of the effective ways to improve the reliability of solder joints. The effects of Cu addition on electromigration were investigated in this study by incorporating 2% volume fraction Cu particles into Sn-3.5Ag eutectic solder paste by the in situ process. The one-dimensional solder joints, designed to prevent the current crowding effect, were stressed under a constant current density of 104 A/cm2 at room temperature, and the temperature of the sample could reach 105 ± 5°C due to the Joule heating effect. Doping 2 vol.% Cu was found to retard the electromigration phenomenon effectively. After electric current stressing for 528 h, the growth rate of an interfacial intermetallic compound (IMC) layer at the anode decreased 73% in contrast to that of Sn-3.5Ag solder joints, and the IMC layer at the cathode was almost unchanged. The polarization effect of Cu reinforced composite solder joints was also apparently mitigated. In addition, the surface damage of the composite solder joints was relieved by incorporating 2 vol.% Cu particles. Compared to Sn-3.5Ag solder joints, which had protruded Cu6Sn5 and wrinkles of Sn-solder matrix on the surface, the solder joints with Cu addition had a more even surface.

  8. Potential and limits of water cooled divertor concepts based on monoblock design as possible candidates for a DEMO reactor

    Energy Technology Data Exchange (ETDEWEB)

    Li-Puma, Antonella, E-mail: antonella.lipuma@cea.fr [CEA, DEN, Saclay, DM2S, SERMA, F-91191 Gif-sur-Yvette (France); Richou, Marianne; Magaud, Philippe; Missirlian, Marc [CEA, IRFM, F-13108 Saint Paul Lez Durance (France); Visca, Eliseo [Associazione EURATOM-ENEA sulla Fusione, C.R. Frascati, IT-00044 Frascati (Italy); Ridolfini, Vincenzo Pericoli [EFDA-CSU Garching, PPPT department, D-85748 Garching bei München (Germany)

    2013-10-15

    In this paper water-cooled divertor concepts based on tungsten monoblock design identified in previous studies as candidate for fusion power plant have been reviewed to assess their potential and limits as possible candidates for a DEMO concept deliverable in a short to medium term (“conservative baseline design”). The rationale and technology development assumptions that have led to their selection are revisited taking into account present factual information on reactor parameters, materials properties and manufacturing technologies. For that purpose, main parameters impacting the divertor design are identified and their relevance discussed. The state of the art knowledge on materials and relevant manufacturing techniques is reviewed. Particular attention is paid to material properties change after irradiation; phenomenon thresholds (if any) and possible operating ranges are identified (in terms of temperature and damage dose). The suitability of various proposed heat sink/structural and sacrificial layer materials, as proposed in the past, are re-assessed (e.g. with regard to the possibility of reducing peak heat flux and/or neutron radiation damages). As a result, potential and limits of various proposed concepts are highlighted, ranges in which they could operate (if any) defined and possible improvements are proposed. Identified missing point in materials database and/or manufacturing techniques knowledge that should be uppermost investigated in future R and D activities are reported. This work has been carried out in the frame of EFDA PPPT Work Programme activities.

  9. Potential and limits of water cooled divertor concepts based on monoblock design as possible candidates for a DEMO reactor

    International Nuclear Information System (INIS)

    In this paper water-cooled divertor concepts based on tungsten monoblock design identified in previous studies as candidate for fusion power plant have been reviewed to assess their potential and limits as possible candidates for a DEMO concept deliverable in a short to medium term (“conservative baseline design”). The rationale and technology development assumptions that have led to their selection are revisited taking into account present factual information on reactor parameters, materials properties and manufacturing technologies. For that purpose, main parameters impacting the divertor design are identified and their relevance discussed. The state of the art knowledge on materials and relevant manufacturing techniques is reviewed. Particular attention is paid to material properties change after irradiation; phenomenon thresholds (if any) and possible operating ranges are identified (in terms of temperature and damage dose). The suitability of various proposed heat sink/structural and sacrificial layer materials, as proposed in the past, are re-assessed (e.g. with regard to the possibility of reducing peak heat flux and/or neutron radiation damages). As a result, potential and limits of various proposed concepts are highlighted, ranges in which they could operate (if any) defined and possible improvements are proposed. Identified missing point in materials database and/or manufacturing techniques knowledge that should be uppermost investigated in future R and D activities are reported. This work has been carried out in the frame of EFDA PPPT Work Programme activities

  10. Substituição das soldas estanho-chumbo na manufatura: efeitos na saúde do trabalhador e no desempenho ambiental Substitution of tin-lead solders in manufacturing: impacts on workers' health and on the environment

    Directory of Open Access Journals (Sweden)

    Cecilia Maria Villas Bôas de Almeida

    2013-03-01

    Full Text Available As soldas à base de estanho-chumbo (63Sn/37Pb são largamente utilizadas no Brasil e no mundo. Este estudo aplica a avaliação em emergia em um fabricante de soldas brandas à base de estanho e chumbo e outros metais. O cálculo da emergia por unidade de três tipos de solda mostra que mais recursos são utilizados para produzir uma tonelada de soldas livres de chumbo do que para produzir soldas à base de estanho e chumbo. O indicador DALY (Disability Adjusted Life Years foi utilizado para comparar as emissões na atmosfera dos três tipos de produção de soldas e os resultados apontam para a adoção das soldas à base de chumbo, quando se considera todo o ciclo de vida do produto. A diferença entre os resultados obtidos por avaliações locais e globais é discutida.Tin-lead solders (Sn63-Pb37 have been widely used in Brazil and worldwide. This study evaluates the emergy in a company that manufactures soft solders based on tin, lead, and other metals. The calculation of emergy per unit of three types of solder showed that more resources are used to produce one ton of lead-free solders than those used to produce tin-lead solders. The DALY (Disability Adjusted Life Years indicator was used to assess the emissions to air of three types of solder. The results favor the use of tin-lead solders when the whole product life-cycle is evaluated. The difference between the results obtained by local and global assessments is discussed.

  11. Problem-Based Learning in the Educational Psychology Classroom: Bahraini Teacher Candidates' Experience

    Science.gov (United States)

    Razzak, Nina Abdul

    2012-01-01

    There was a concern from faculty at Bahrain Teachers' College that undergraduate Bahraini students lack the necessary competencies needed for success in educational contexts that are conducive to active, student-centered learning. It was decided that the students be introduced to a problem-based learning (PBL) strategy in one of their educational…

  12. Development of materials design tool and its application in Pb-free micro-solders in electronic package

    Institute of Scientific and Technical Information of China (English)

    OHNUMA; Ikuo; KAINUMA; Ryosuke; ISHIDA; Kiyohito; CHANG; Austin; Y.

    2010-01-01

    A materials design tool for developing Pb-free soldering alloys in electronic package was developed based on comprehensive experimental data of phase equilibria and thermodynamic properties data accumulated with the CALPHAD (calculation of phase diagrams) method and contains 10 elements,namely,Ag,Au,Bi,Cu,In,Ni,Sb,Sn,Zn and Pb.It can handle the calculation of phase diagrams in all combinations of these elements and all composition ranges.In addition,based on this tool,the liquidus,solidus,phase fractions and constitutions,equilibrium and non-equilibrium solidification behavior,surface tension and viscosity of liquid,diffusion reactions and microstructural evolution,etc.can be predicted.Typical examples of the calculation and application of this tool are presented.The design tool is expected to be a powerful tool for the development of Pb-free solders,as well as for promoting the understanding of the interfacial phenomena between Cu substrate and Pb-free solders in electronic packaging technology.

  13. Amplicon-based metagenomics identified candidate organisms in soils that caused yield decline in strawberry.

    Science.gov (United States)

    Xu, Xiangming; Passey, Thomas; Wei, Feng; Saville, Robert; Harrison, Richard J

    2015-01-01

    A phenomenon of yield decline due to weak plant growth in strawberry was recently observed in non-chemo-fumigated soils, which was not associated with the soil fungal pathogen Verticillium dahliae, the main target of fumigation. Amplicon-based metagenomics was used to profile soil microbiota in order to identify microbial organisms that may have caused the yield decline. A total of 36 soil samples were obtained in 2013 and 2014 from four sites for metagenomic studies; two of the four sites had a yield-decline problem, the other two did not. More than 2000 fungal or bacterial operational taxonomy units (OTUs) were found in these samples. Relative abundance of individual OTUs was statistically compared for differences between samples from sites with or without yield decline. A total of 721 individual comparisons were statistically significant - involving 366 unique bacterial and 44 unique fungal OTUs. Based on further selection criteria, we focused on 34 bacterial and 17 fungal OTUs and found that yield decline resulted probably from one or more of the following four factors: (1) low abundance of Bacillus and Pseudomonas populations, which are well known for their ability of supressing pathogen development and/or promoting plant growth; (2) lack of the nematophagous fungus (Paecilomyces species); (3) a high level of two non-specific fungal root rot pathogens; and (4) wet soil conditions. This study demonstrated the usefulness of an amplicon-based metagenomics approach to profile soil microbiota and to detect differential abundance in microbes. PMID:26504572

  14. Conservation analysis of dengue virust-cell epitope-based vaccine candidates using peptide block entropy

    DEFF Research Database (Denmark)

    Olsen, Lars Rønn; Zhang, Guang Lan; Keskin, Derin B.;

    2011-01-01

    Broad coverage of the pathogen population is particularly important when designing CD8+ T-cell epitope vaccines against viral pathogens. Traditional approaches are based on combinations of highly conserved T-cell epitopes. Peptide block entropy analysis is a novel approach for assembling sets....... In contrast, the benchmark study by Khan et al. (2008) resulted in 165 conserved 9-mer peptides. Many of the conserved blocks are located consecutively in the proteins. Connecting these blocks resulted in 78 conserved regions. Of the 1551 blocks of 9-mer peptides 110 comprised predicted HLA binder sets...

  15. Amplicon-based metagenomics identified candidate organisms in soils that caused yield decline in strawberry

    OpenAIRE

    Xiangming Xu; Thomas Passey; Feng Wei; Robert Saville; Harrison, Richard J.

    2015-01-01

    A phenomenon of yield decline due to weak plant growth in strawberry was recently observed in non-chemo-fumigated soils, which was not associated with the soil fungal pathogen Verticillium dahliae, the main target of fumigation. Amplicon-based metagenomics was used to profile soil microbiota in order to identify microbial organisms that may have caused the yield decline. A total of 36 soil samples were obtained in 2013 and 2014 from four sites for metagenomic studies; two of the four sites ha...

  16. Discovery and characterization of antibody variants using mass spectrometry-based comparative analysis for biosimilar candidates of monoclonal antibody drugs.

    Science.gov (United States)

    Li, Wenhua; Yang, Bin; Zhou, Dongmei; Xu, Jun; Ke, Zhi; Suen, Wen-Chen

    2016-07-01

    Liquid chromatography mass spectrometry (LC-MS) is the most commonly used technique for the characterization of antibody variants. MAb-X and mAb-Y are two approved IgG1 subtype monoclonal antibody drugs recombinantly produced in Chinese hamster ovary (CHO) cells. We report here that two unexpected and rare antibody variants have been discovered during cell culture process development of biosimilars for these two approved drugs through intact mass analysis. We then used comprehensive mass spectrometry-based comparative analysis including reduced light, heavy chains, and domain-specific mass as well as peptide mapping analysis to fully characterize the observed antibody variants. The "middle-up" mass comparative analysis demonstrated that the antibody variant from mAb-X biosimilar candidate was caused by mass variation of antibody crystalline fragment (Fc), whereas a different variant with mass variation in antibody antigen-binding fragment (Fab) from mAb-Y biosimilar candidate was identified. Endoproteinase Lys-C digested peptide mapping and tandem mass spectrometry analysis further revealed that a leucine to glutamine change in N-terminal 402 site of heavy chain was responsible for the generation of mAb-X antibody variant. Lys-C and trypsin coupled non-reduced and reduced peptide mapping comparative analysis showed that the formation of the light-heavy interchain trisulfide bond resulted in the mAb-Y antibody variant. These two cases confirmed that mass spectrometry-based comparative analysis plays a critical role for the characterization of monoclonal antibody variants, and biosimilar developers should start with a comprehensive structural assessment and comparative analysis to decrease the risk of the process development for biosimilars. PMID:27214604

  17. The Mechanical Behavior of Sn-Ag4 Solder Joints Subjected to Thermal Cycling

    Institute of Scientific and Technical Information of China (English)

    CHENGuohai; MAJusheng

    2004-01-01

    The method of mount strain gages is used to measure the stress/strain hysteresis loops of the solder joints under thermal cycling. The results show that different solders have different loops; the shape of the loops will change less, and finally become a line along with the thermal cycle increase. The shear module decreases along with the thermal cycling process. But the creep index of the solder joints is not sensitive to the cycling process,which fluctuates between 5 and 7. Because the elements of the solder and matrix materials diffuse during the process, the voids induced in the solder joints expand. The expansion of the voids will lead to the crystal lattice aberrance of solder crystal.

  18. Wettability and Reaction between Solder and Silver Busbar during the Tabbing Process for Silicon Photovoltaic Modules

    Science.gov (United States)

    Lee, Beom-Yong; Hoang, Thi-Lien; Cho, Sung-Bin; Huh, Joo-Youl; Lee, Young-Sik

    2012-10-01

    The soldering quality of a Cu ribbon onto the Ag busbars of solar cells is one of the key factors affecting the cell-to-module loss and durability of a silicon photovoltaic module. In this study, we examined the effects of the surface chemistry and morphology of the screen-printed Ag busbars on the solder wettability and bonding uniformity of the Cu ribbon over the length of the busbar during the tabbing process. The surface of the as-fired Ag busbar was covered by a thin glass layer originating from the glass frit contained in the Ag paste. The presence of the thin glass layer significantly decreased the wettability of the solder, leading to the formation of voided regions at the solder/busbar interface. Although it had only a minor influence on solder wettability, increasing the roughness of the busbar surface resulted in the formation of more voided regions at the solder/busbar interface.

  19. High-speed through-silicon via filling method using Cu-cored solder balls

    Institute of Scientific and Technical Information of China (English)

    He Ran; Wang Huijuan; Yu Daquan; Zhou Jing; Dai Fengwei; Song Chongshen; Sun Yu; Wan Lixi

    2012-01-01

    A novel low-cost and high-speed via filling method using Cu-cored solder balls was investigated for through-silicon via manufacture.Cu-cored solder balls with a total diameter of 100 μm were used to fill 150 μm deep,110 μm wide vias in silicon.The wafer-level filling process can be completed in a few seconds,which is much faster than using the traditional electroplating process.Thermo-mechanical analysis of via filling using solder,Cu and Cu-cored solder was carried out to assess the thermo-mechanical properties of the different filling materials.It was found that the vias filled with Cu-cored solder exhibit less thermal-mechanical stresses than solder-filled vias,but more than Cu-filled vias.

  20. Effects of particle size on the mechanical properties of particle-reinforced Sn-Ag composite solder joint

    Institute of Scientific and Technical Information of China (English)

    TAI Feng; GUO Fu

    2009-01-01

    Particulate size has significant influenced on the mechanical properties of particle-reinforced compos-ite solder joints. In this current research, Cu or Ni reinforcement particles were mechanically added to the Sn-3.5Ag eutectic solder, and the effects of the particle size on the mechanical properties of parti-cle-reinforced composite solder joint were systematically studied. This investigation touched on how mechanical properties of the solder joints are affected by particles size. A quantitative formula was set up to correlate the mechanical property of the solder joint with particle size in different processing conditions. Besides, the fracture mechanism of the composite solder joint was analyzed.

  1. Effects of particle size on the mechanical properties of particle-reinforced Sn-Ag composite solder joint

    Institute of Scientific and Technical Information of China (English)

    2009-01-01

    Particulate size has significant influenced on the mechanical properties of particle-reinforced composite solder joints. In this current research, Cu or Ni reinforcement particles were mechanically added to the Sn-3.5Ag eutectic solder, and the effects of the particle size on the mechanical properties of particle-reinforced composite solder joint were systematically studied. This investigation touched on how mechanical properties of the solder joints are affected by particles size. A quantitative formula was set up to correlate the mechanical property of the solder joint with particle size in different processing conditions. Besides, the fracture mechanism of the composite solder joint was analyzed.

  2. Microstructure, phases morphologies and hardness of a Bi–Ag eutectic alloy for high temperature soldering applications

    International Nuclear Information System (INIS)

    Highlights: • Growth of eutectic cells prevailed for lower “v” values. • The experimental growth formula λ2v = C encompasses eutectic growth. • Interphase spacing between Ag-rich spheroids occurred in the range 0.4–1.7 μm. • Hall–Petch type equations are proposed relating to hardness. - Abstract: The conversion to RoHS-compliant lead-free assembly has been a considerable challenge to the electronics industry. Among several alternative solder alloys, Bi–Ag alloys have been highlighted as a potential candidate to replace high Pb solder alloys for applications in oil and gas, automotive and avionics industries. The typical melting temperatures of Bi–Ag near-eutectic alloys are considered acceptable and excellent mechanical properties may be achieved with appropriate microstructures. Such promising alloys for high temperature soldering remain barely understood especially regarding non-equilibrium solidification features. In this study, a directional solidification experiment was carried out with the Bi–2.5 wt%Ag eutectic so that a large range of cooling rates (T) could be obtained under unsteady-state conditions. The experimental investigation include: thermal solidification parameters (growth rate, v and cooling rate, T), microstructure parameters (eutectic/dendritic spacing, interphase spacings) and phases morphologies analyzed by optical microscopy, scanning electron microscopy (SEM), energy-dispersive X-ray spectroscopy (EDS), and hardness. Experimental interrelations between hardness and microstructure (scale and morphology) of the eutectic Bi–Ag are reported. Solidification parameters are also associated with each configuration observed along the casting, i.e., coexistence of dendrites and eutectic cells for regions very close to the cooled casting surface, eutectic cells prevailing and eutectic cells together with β-Bi primary phase. The cell spacing, λc, is correlated with hardness by Hall–Petch type equations

  3. Soldering Failure Reasons of BGA "Head in Pillow"%BGA"枕头效应"焊接失效原因

    Institute of Scientific and Technical Information of China (English)

    贺光辉; 罗道军

    2011-01-01

    针对BGA的一类典型的焊接失效模式"枕头效应"选取了一个典型案例进行分析,详细介绍了分析的过程以及采用的手段,通过采用X-ray、金相切片、SEM&EDS和工艺模拟等分析手段,获得了导致BGA"枕头效应"产生的主要原因,即锡膏与焊接工艺不兼容造成其焊接不良.同时,以此总结和分析了其他导致此缺陷的原因和应采取的对策.%Present a typical analysis case on soldering failure of BGA such as "Head in Pillow (HIP) ".The detailed analysis procedure and means such as X-ray inspection, cross section, SEM&EDS and simulated soldering process analysis performed on the samples are introduced. The conclusion is that the root cause of HIP failure is bad compatibility of solder paste and reflow process. Base on some studies and experience of some cases, other cause resulting in HIP Defect and preventive measure are analyzed and summarized.

  4. Study of pose and expression variant face recognition based on Candide-3 model%基于Candide-3模型的姿态表情人脸识别研究

    Institute of Scientific and Technical Information of China (English)

    杜杏菁; 白廷柱; 何玉青

    2012-01-01

    针对姿态表情严重影响人脸识别准确率的问题,基于Candide-3模型的简化,提出了形状表情关键点拟合的人脸几何结构重建和基于三角网格模型的纹理映射的方法,该方法确定关键特征点,根据人脸的几何结构信息确定姿态角,提取Candide-3模型形状表情对应点,调整模型参数,进行几何结构重建;对几何结构中每个三角网格模型进行纹理影射,得到逼真的特定人脸模型.实验结果表明,该方法提高了人脸重建速度,达到减弱姿态表情对人脸识别影响的目的.%For pose and expressions seriously affecting to the accuracy of face recognition, based on the Candide-3 model, a method of pose and expression key points fitting to reconstruct face geometry and texture mapping based on Triangular mesh model are proposed. First the eyes, nose, mouth feature points are determined according to the face geometry information, then the pose angle are determined, facial expressions corresponding points are extracted with Candide-3 model , the model parameters are adjusted to make structural reconstruction, then texture mapping of each triangle mesh in the geometry are completed to obtain specific 3D face reconstruction model. Experiment shows that the method improve the speed of 3D face reconstruction and the effect of pose and expression variant to face recognition is reduced.

  5. Intermetallic growth at the interface between copper and bismuth-tin solder

    OpenAIRE

    Vollweiler, Fred O. P.

    1993-01-01

    Approved for public release; distribution is unlimited. Tin-bismuth alloys have been proposed as alternatives to lead containing solders for interconnection and packaging applications. Consequently, the interface between copper metallizations and bismuth-tin solders needs to be evaluated with respect to brittle intermetallic formation. In the binary Bi-Sn alloys both the Cu6Sn5 and Cu3Sn intermetallic phases were found at the Cu/ solder interface after exposure at 250 deg C, 300 deg C, and...

  6. A malaria diagnostic tool based on computer vision screening and visualization of Plasmodium falciparum candidate areas in digitized blood smears.

    Directory of Open Access Journals (Sweden)

    Nina Linder

    Full Text Available INTRODUCTION: Microscopy is the gold standard for diagnosis of malaria, however, manual evaluation of blood films is highly dependent on skilled personnel in a time-consuming, error-prone and repetitive process. In this study we propose a method using computer vision detection and visualization of only the diagnostically most relevant sample regions in digitized blood smears. METHODS: Giemsa-stained thin blood films with P. falciparum ring-stage trophozoites (n = 27 and uninfected controls (n = 20 were digitally scanned with an oil immersion objective (0.1 µm/pixel to capture approximately 50,000 erythrocytes per sample. Parasite candidate regions were identified based on color and object size, followed by extraction of image features (local binary patterns, local contrast and Scale-invariant feature transform descriptors used as input to a support vector machine classifier. The classifier was trained on digital slides from ten patients and validated on six samples. RESULTS: The diagnostic accuracy was tested on 31 samples (19 infected and 12 controls. From each digitized area of a blood smear, a panel with the 128 most probable parasite candidate regions was generated. Two expert microscopists were asked to visually inspect the panel on a tablet computer and to judge whether the patient was infected with P. falciparum. The method achieved a diagnostic sensitivity and specificity of 95% and 100% as well as 90% and 100% for the two readers respectively using the diagnostic tool. Parasitemia was separately calculated by the automated system and the correlation coefficient between manual and automated parasitemia counts was 0.97. CONCLUSION: We developed a decision support system for detecting malaria parasites using a computer vision algorithm combined with visualization of sample areas with the highest probability of malaria infection. The system provides a novel method for blood smear screening with a significantly reduced need for

  7. Recombinant vesicular stomatitis virus-based dengue-2 vaccine candidate induces humoral response and protects mice against lethal infection.

    Science.gov (United States)

    Lauretti, Flavio; Chattopadhyay, Anasuya; de Oliveira França, Rafael Freitas; Castro-Jorge, Luiza; Rose, John; Fonseca, Benedito A L da

    2016-09-01

    Dengue is the most important arbovirus disease throughout the world and it is responsible for more than 500,000 dengue hemorrhagic cases and 22,000 deaths every year. One vaccine was recently licensed for human use in Brazil, Mexico and Philippines and although at least seven candidates have been in clinical trials the results of the most developed CYD vaccine have demonstrated immunization problems, such as uneven protection and interference between serotypes. We constructed a vaccine candidate based on vesicular stomatitis virus (VSV) expression of pre-membrane (prM) and envelope (E) proteins of dengue-2 virus (DENV-2) and tested it in mice to evaluate immunogenicity and protection against DENV-2 infection. VSV has been successfully used as vaccine vectors for several viruses to induce strong humoral and cellular immune responses. The VSV-DENV-2 recombinant was constructed by inserting the DENV-2 structural proteins into a VSV plasmid DNA for recombinant VSV-DENV-2 recovery. Infectious recombinant VSV viruses were plaque purified and prM and E expression were confirmed by immunofluorescence and radiolabeling of proteins of infected cells. Forty Balb/C mice were inoculated through subcutaneous (s.c.) route with VSV-DENV-2 vaccine in a two doses schedule 15 d apart and 29 d after first inoculation, sera were collected and the mice were challenged with 50 lethal doses (LD50) of a neurovirulent DENV-2. The VSV-DENV-2 induced anti-DENV-2 antibodies and protected animals in the challenge experiment comparable to DENV-2 immunization control group. We conclude that VSV is a promising platform to test as a DENV vaccine and perhaps against others Flaviviridae.

  8. Research Progress in Solderable Black Pad of Electroless Nickel/Immersion Gold

    Institute of Scientific and Technical Information of China (English)

    Liu Haiping; Li Ning; Bi Sifu; Li Deyu

    2007-01-01

    Electroless nickel/immersion gold (ENIG) technology is widely used as one of the surface final finish for electronics packaging substrate and printed circuit board (PCB), providing a protective, conductive and solderable surface. However, there is a solder joint interfacial brittle fracture (or solderability failure) of using the ENIG coating. The characteristics and the application of ENIG technology were narrated in this paper. The research progress on the solderability failure of ENIG was introduced. The mechanism of "black pad" and the possible measure of eliminating or alleviating the "black pad" were also introduced. The development direction and market prospects of ENIG were prospected.

  9. Application of CO2 laser for electronic components soldering

    Science.gov (United States)

    Mascorro-Pantoja, J.; Soto-Bernal, J. J.; Nieto-Pérez, M.; Gonzalez-Mota, R.; Rosales-Candelas, I.

    2011-10-01

    Laser provides a high controllable and localized spot for soldering joint formation and this is a valuable tool in Sn/Pb Soldering process on electronic industry, in recent years, laser beam welding has become an emerging welding technique, the use of laser in welding area is a high efficiency method. A 60 Watts CO2 continuous laser was used on this study, during welding experimental results indicated the laser could significantly improve speed and weld quality. In this work, the welding interactions of CO2 laser with Sn/Pb wire have been investigated in details through varying the energy ratios of laser. And at the same time, the effect of distance from laser spot to material.

  10. Losing on all fronts: the effects of negative versus positive person-based campaigns on implicit and explicit evaluations of political candidates.

    Science.gov (United States)

    Carraro, Luciana; Gawronski, Bertram; Castelli, Luigi

    2010-09-01

    The current research investigated the effects of negative as compared to positive person-based political campaigns on explicit and implicit evaluations of the involved candidates. Participants were presented with two political candidates and statements that one of them ostensibly said during the last political campaign. For half of the participants, the campaign included positive remarks about the source of the statement (positive campaign); for the remaining half, the campaign included negative remarks about the opponent (negative campaign). Afterwards, participants completed measures of explicit and implicit evaluations of both candidates. Results indicate that explicit evaluations of the source, but not the opponent, were less favourable after negative as compared to positive campaigns. In contrast, implicit evaluations were less favourable for both candidates after negative campaigns. The results are discussed in terms of associative and propositional processes, highlighting the importance of associative processes in political decision making.

  11. Selecting candidate service based on functional reusability%基于功能重用性的候选服务选定方法

    Institute of Scientific and Technical Information of China (English)

    昌广才; 蒋溢; 熊安萍

    2012-01-01

    SOA-based service modeling is widely used in the enterprise applications. During SOMA service is modeling, according to the identification inaccuracy of function reusability between use case when selecting reusable candidate services, based on the expansion and containment relationship, the selection process of reusable candidate services are provided, which join generalization relationship between the use case, and the selection of reusability candidate services is improved. Practice shows that the improved candidate services selection methods not only simplify reusable candidate selection process, but also improve the selection accuracy of reusability candidate services.%基于SOA的服务建模在企业中得到了广泛运用,针对SOMA服务建模过程中基于用例间包含与扩展关系对可重用候选服务进行选定时存在功能重用性用例确定不准确的问题,给出了加入用例泛化关系的可重用候选服务选定方法,完善了可重用性候选服务的选定.实践表明,改进后的候选服务选定方法不仅使简化了可重用性候选服务选定过程,还提高了可重用性候选服务选定的准确率.

  12. Miniaturized frequency doubled DPSS laser soldered for space applications

    OpenAIRE

    Gilaberte Basset, Marta

    2014-01-01

    This master thesis presents the research performed to reach the optimum assembling technique for the miniaturized green laser for the ESA Exomars space mission. The strong requirements on optical performance of the laser, in combination with the space resistance needs, make a challenge to assemble this laser. The objective of this master thesis is to demonstrate that assembling the laser using the solderjet soldering technology studied and developed by Fraunhofer IOF is the solution for the l...

  13. Cartan's soldered spaces and conservation laws in physics

    Science.gov (United States)

    Kouneiher, Joseph; Barbachoux, Cécile

    2015-06-01

    In this paper, we will introduce a generalized soldering p-forms geometry, which can be the right framework to describe many new approaches and concepts in modern physics. Here we will treat some aspects of the theory of local cohomology in fields theory or more precisely the theory of soldering-form conservation laws in physics. We provide some illustrative applications, primarily taken from the Einstein equations of general theory of relativity and Yang-Mills theory. This theory can be considered to be a generalization of Noether's theory of conserved current to differential forms of any degree. An essential result of this, is that the conservation of the energy-momentum in general relativity, is linked to the fact that the vacuum field equations are equivalent to the integrability conditions of a first-order system of differential equations. We also apply the idea of the soldered space and the integrability conditions to the case of Yang-Mills theory. The mathematical framework, where these intuitive considerations would fit naturally, can be used to describe also the dynamics of changing manifolds.

  14. Comparison of Sn-Ag-Cu Solder Alloy Intermetallic Compound Growth Under Different Thermal Excursions for Fine-Pitch Flip-Chip Assemblies

    Science.gov (United States)

    Tian, Ye; Liu, Xi; Chow, Justin; Wu, Yi Ping; Sitaraman, Suresh K.

    2013-08-01

    The intermetallic compound (IMC) evolution in Cu pad/Sn-Ag-Cu solder interface and Sn-Ag-Cu solder/Ni pad interface was investigated using thermal shock experiments with 100- μm-pitch flip-chip assemblies. The experiments show that low standoff height of solder joints and high thermomechanical stress play a great role in the interfacial IMC microstructure evolution under thermal shock, and strong cross-reaction of pad metallurgies is evident in the intermetallic growth. Furthermore, by comparing the IMC growth during thermal aging and thermal shock, it was found that thermal shock accelerates IMC growth and that kinetic models based on thermal aging experiments underpredict IMC growth in thermal shock experiments. Therefore, new diffusion kinetic parameters were determined for the growth of (Cu,Ni)6Sn5 using thermal shock experiments, and the Cu diffusion coefficient through the IMC layer was calculated to be 0.2028 μm2/h under thermal shock. Finite-element models also show that the solder stresses are higher under thermal shock, which could explain why the IMC growth is faster and greater under thermal shock cycling as opposed to thermal aging.

  15. Morphology and Shear Strength of Lead-Free Solder Joints with Sn3.0Ag0.5Cu Solder Paste Reinforced with Ceramic Nanoparticles

    Science.gov (United States)

    Yakymovych, A.; Plevachuk, Yu.; Švec, P.; Švec, P.; Janičkovič, D.; Šebo, P.; Beronská, N.; Roshanghias, A.; Ipser, H.

    2016-08-01

    To date, additions of different oxide nanoparticles is one of the most widespread procedures to improve the mechanical properties of metals and metal alloys. This research deals with the effect of minor ceramic nanoparticle additions (SiO2, TiO2 and ZrO2) on the microstructure and mechanical properties of Cu/solder/Cu joints. The reinforced Sn3.0Ag0.5Cu (SAC305) solder alloy with 0.5 wt.% and 1.0 wt.% of ceramic nanoparticles was prepared through mechanically stirring. The microstructure of as-solidified Cu/solder/Cu joints was studied using scanning electron microscopy. The additions of ceramic nanoparticles suppressed the growth of the intermetallic compound layer Cu6Sn5 at the interface solder/Cu and improved the microstructure of the joints. Furthermore, measurements of mechanical properties showed improved shear strength of Cu/composite solder/Cu joints compared to joints with unreinforced solder. This fact related to all investigated ceramic nanoinclusions and should be attributed to the adsorption of nanoparticles on the grain surface during solidification. However, this effect is less pronounced on increasing the nanoinclusion content from 0.5 wt.% to 1.0 wt.% due to agglomeration of nanoparticles. Moreover, a comparison analysis showed that the most beneficial influence was obtained by minor additions of SiO2 nanoparticles into the SAC305 solder alloy.

  16. A microstructural analysis of solder joints from the electronic assemblies of dismantled nuclear weapons

    Energy Technology Data Exchange (ETDEWEB)

    Vianco, P.T.; Rejent, J.A. [Sandia National Labs., Albuquerque, NM (United States). Materials Joining Dept.

    1997-05-01

    MC1814 Interconnection Boxes from dismantled B57 bombs, and MC2839 firing Sets from retired W70-1 warheads were obtained from the Pantex facility. Printed circuit boards were selected from these components for microstructural analysis of their solder joints. The analysis included a qualitative examination of the solder joints and quantitative assessments of (1) the thickness of the intermetallic compound layer that formed between the solder and circuit board Cu features, and (2) the Pb-rich phase particle distribution within the solder joint microstructure. The MC2839 solder joints had very good workmanship qualities. The intermetallic compound layer stoichiometry was determined to be that of Cu6Sn5. The mean intermetallic compound layer thickness for all solder joints was 0.885 mm. The magnitude of these values did not indicate significant growth over the weapon lifetime. The size distribution of the Pb-rich phase particles for each of the joints were represented by the mean of 9.85 {times} 10{sup {minus}6} mm{sup 2}. Assuming a spherical geometry, the mean particle diameter would be 3.54 mm. The joint-to-joint difference of intermetallic compound layer thickness and Pb-rich particle size distribution was not caused by varying thermal environments, but rather, was a result of natural variations in the joint microstructure that probably existed at the time of manufacture. The microstructural evaluation of the through-hole solder joints form the MC2839 and MC1814 components indicated that the environmental conditions to which these electronic units were exposed in the stockpile, were benign regarding solder joint aging. There was an absence of thermal fatigue damage in MC2839 circuit board, through-hole solder joints. The damage to the eyelet solder joints of the MC1814 more likely represented infant mortality failures at or very near the time of manufacture, resulting from a marginal design status of this type of solder joint design.

  17. Research on Void Rate of Eutectic Solder Welding%共晶焊料焊接的孔隙率研究

    Institute of Scientific and Technical Information of China (English)

    陈波; 丁荣峥; 明雪飞; 高娜燕

    2012-01-01

      大功率或高功率密度的高可靠集成电路等通常采用合金焊料焊接芯片,以降低封装热阻和提高芯片焊接的可靠性。合金焊料焊接方式主要有真空烧结、保护气氛下静压烧结、共晶摩擦焊等。不同焊接工艺有其不同的适应性和焊接可靠性。文章以高可靠封装常用金基焊料的共晶焊接为例,探讨在相同封装结构、不同共晶焊接工艺下焊接层孔隙率,以及相同工艺设备、工艺条件下随芯片尺寸增大孔隙率的变化趋势。研究结果表明:金-硅共晶摩擦焊工艺的孔隙率低于金-锡真空烧结工艺和金-锡保护气氛静压烧结;同一焊接工艺,随着芯片尺寸变大,其孔隙率变化不显著,但单个空洞的尺寸有明显增大趋势。%  Alloy solder slice is widely used in the package of IC devices with high power or high power density. Generally, these IC devices are called for high reliability which is realized by the use of alloy solder slice, while it decreases the heat resistance of IC package. The widely used processes for alloy soldering are soldering in vacuum, soldering in protecting gas same as atmospheric pressure, jointing with eutectic scrub, etc. These processes vary in soldering reliability and are employed in different conditions according to different demands. It is reported that how the eutectic soldering process and chip size influence the void rate of Au-based alloy. Researches show that, void rate of Au-Si eutectic scrub bonding is lower than Au-Sn alloy jointing in vacuum and Au-Sn alloy jointing in protecting gas;void rate does not but the size of single void does obviously change as chip size increases.

  18. Identification of putative candidate genes for red rot resistance in sugarcane (Saccharum species hybrid) using LD-based association mapping.

    Science.gov (United States)

    Singh, Ram K; Banerjee, Nandita; Khan, M S; Yadav, Sonia; Kumar, Sanjeev; Duttamajumder, S K; Lal, Ram Ji; Patel, Jinesh D; Guo, H; Zhang, Dong; Paterson, Andrew H

    2016-06-01

    Red rot is a serious disease of sugarcane caused by the fungus Colletotrichum falcatum that has a colossal damage potential. The fungus, prevalent mainly in the Indian sub-continent, keeps on producing new pathogenic strains leading to breakdown of resistance in newly released varieties and hence the deployment of linked markers for marker-assisted selection for resistance to this disease can fine tune the breeding programme. This study based on a panel of 119 sugarcane genotypes fingerprinted for 944 SSR alleles was undertaken with an aim to identify marker-trait associations (MTAs) for resistance to red rot. Mixed linear model containing population structure and kinship as co-factor detected four MTAs that were able to explain 10-16 % of the trait variation, individually. Among the four MTAs, EST sequences diagnostic of three could be BLAST searched to the sorghum genome with significant sequence homology. Several genes encoding important plant defence related proteins, viz., cytochrome P450, Glycerol-3-phosphate transporter-1, MAP Kinase-4, Serine/threonine-protein kinase, Ring finger domain protein and others were localized to the vicinity of these MTAs. These positional candidate genes are worth of further investigation and possibly these could contribute directly to red rot resistance, and may find a potential application in marker-assisted sugarcane breeding. PMID:26961118

  19. Glutathione transferase (GST) as a candidate molecular-based biomarker for soil toxin exposure in the earthworm Lumbricus rubellus

    Energy Technology Data Exchange (ETDEWEB)

    LaCourse, E. James, E-mail: james.la-course@liverpool.ac.u [Institute of Biological, Environmental, and Rural Sciences, Aberystwyth University, Aberystwyth SY23 3DA (United Kingdom); Hernandez-Viadel, Mariluz; Jefferies, James R. [Institute of Biological, Environmental, and Rural Sciences, Aberystwyth University, Aberystwyth SY23 3DA (United Kingdom); Svendsen, Claus; Spurgeon, David J. [Centre for Ecology and Hydrology, Huntingdon PE28 2LS (United Kingdom); Barrett, John [Institute of Biological, Environmental, and Rural Sciences, Aberystwyth University, Aberystwyth SY23 3DA (United Kingdom); John Morgan, A.; Kille, Peter [Biosciences, University of Cardiff, Cardiff CF10 3TL (United Kingdom); Brophy, Peter M. [Institute of Biological, Environmental, and Rural Sciences, Aberystwyth University, Aberystwyth SY23 3DA (United Kingdom)

    2009-08-15

    The earthworm Lumbricus rubellus (Hoffmeister, 1843) is a terrestrial pollution sentinel. Enzyme activity and transcription of phase II detoxification superfamily glutathione transferases (GST) is known to respond in earthworms after soil toxin exposure, suggesting GST as a candidate molecular-based pollution biomarker. This study combined sub-proteomics, bioinformatics and biochemical assay to characterise the L. rubellus GST complement as pre-requisite to initialise assessment of the applicability of GST as a biomarker. L. rubellus possesses a range of GSTs related to known classes, with evidence of tissue-specific synthesis. Two affinity-purified GSTs dominating GST protein synthesis (Sigma and Pi class) were cloned, expressed and characterised for enzyme activity with various substrates. Electrospray ionisation mass spectrometry (ESI-MS) and tandem mass spectrometry (MS/MS) following SDS-PAGE were superior in retaining subunit stability relative to two-dimensional gel electrophoresis (2-DE). This study provides greater understanding of Phase II detoxification GST superfamily status of an important environmental pollution sentinel organism. - This study currently provides the most comprehensive view of the Phase II detoxification enzyme superfamily of glutathione transferases within the important environmental pollution sentinel earthworm Lumbricus rubellus.

  20. New π-Conjugated Materials Based on Furylenevinylene Candidate for Organic Solar Cells Application: A DFT Study

    Directory of Open Access Journals (Sweden)

    El Alamy Aziz

    2015-12-01

    Full Text Available The specific properties of organic-conjugated molecules and polymers are of great importance since they have become the most promising materials for the optoelectronic device technology such as solar cells. The use of low band gap materials is a viable method for better harvesting of the solar spectrum and increasing its efficiency. The control of the parameters of these materials is a research issue of ongoing interest. In this work, a quantum chemical investigation was performed to explore the optical and electronic properties of a series of different compounds based on furylenevinylene. Different electron side groups were introduced to investigate their effects on the electronic structure. The theoretical knowledge of the highest occupied molecular orbital (HOMO and lowest unoccupied molecular orbital (LUMO energy levels of the components is basic in studying organic solar cells; so the HOMO, LUMO, Gap energy and open circuit voltage (Voc of the studied compounds have been calculated and reported. These properties suggest that these materials behave as good candidate for organic solar cells. DOI: http://dx.doi.org/10.17807/orbital.v7i4.763 

  1. The (w)hole survey: an unbiased sample study of transition disk candidates based on Spitzer catalogs

    CERN Document Server

    van der Marel, Nienke; van Terwisga, Sierk; Merin, Bruno; Herczeg, Gregory; Ligterink, Niels F W; van Dishoeck, Ewine F

    2016-01-01

    Understanding disk evolution and dissipation is essential for studies of planet formation. Transition disks, i.e., disks with large dust cavities and gaps, are promising candidates of active evolution. About two dozen SED-selected candidates have been confirmed to have dust cavities through millimeter interferometric imaging, but this sample is biased towards the brightest disks. The Spitzer surveys of nearby low-mass star forming regions have resulted in more than 4000 Young Stellar Objects (YSOs). Using color criteria we have selected a sample of ~150 candidates, and an additional 40 candidates and known transition disks from the literature. The Spitzer data were complemented by new observations at longer wavelengths, including new JCMT and APEX submillimeter photometry, and WISE and Herschel-PACS mid and far-infrared photometry. Furthermore, optical spectroscopy was obtained and stellar types were derived for 85% of the sample, including information from the literature. The SEDs were fit to a grid of RADMC...

  2. Indium Corporation Introduces New Pb-Free VOC-Free Wave Solder Flux

    Institute of Scientific and Technical Information of China (English)

    2005-01-01

    The Indium Corporation of America has introduced WF-7742 Wave Solder Flux specifically designed to meet the process demands of Pb-Free manufacturing. WF-7742 is a VOC-Free material formulated for Pb-Free wave soldering of surface-mount, mixed-technology and through-holeelectronics assemblies.

  3. Development of technique for laser welding of biological tissues using laser welding device and nanocomposite solder.

    Science.gov (United States)

    Gerasimenko, A; Ichcitidze, L; Podgaetsky, V; Ryabkin, D; Pyankov, E; Saveliev, M; Selishchev, S

    2015-08-01

    The laser device for welding of biological tissues has been developed involving quality control and temperature stabilization of weld seam. Laser nanocomposite solder applied onto a wound to be weld has been used. Physicochemical properties of the nanocomposite solder have been elucidated. The nature of the tissue-organizing nanoscaffold has been analyzed at the site of biotissue welding. PMID:26738200

  4. 30 CFR 77.1111 - Welding, cutting, soldering; use of fire extinguisher.

    Science.gov (United States)

    2010-07-01

    ... 30 Mineral Resources 1 2010-07-01 2010-07-01 false Welding, cutting, soldering; use of fire... OF UNDERGROUND COAL MINES Fire Protection § 77.1111 Welding, cutting, soldering; use of fire extinguisher. One portable fire extinguisher shall be provided at each location where welding, cutting,...

  5. Tissue soldering with biodegradable polymer films: in-vitro investigation of hydration effects on weld strength

    Science.gov (United States)

    Sorg, Brian S.; Welch, Ashley J.

    2001-05-01

    Previous work demonstrated increased breaking strengths of tissue repaired with liquid albumin solder reinforced with a biodegradable polymer film compared to unreinforced control specimens. It was hypothesized that the breaking strength increase was due to reinforcement of the liquid solder cohesive strength. Immersion in a moist environment can decrease the adhesion of solder to tissue and negate any strength benefits gained from reinforcement. The purpose of this study was to determine if hydrated specimens repaired with reinforced solder would still be stronger than unreinforced controls. A 50%(w/v) bovine serum albumin solder with 0.5 mg/mL Indocyanine Green dye was used to repair an incision in bovine aorta. The solder was coagulated with 806-nm diode laser light. A poly(DL-lactic- co-glycolic acid) film was used to reinforce the solder (the controls had no reinforcement). The repaired tissues were immersed in phosphate buffered saline for time periods of 1 and 2 days. The breaking strengths of all of the hydrated specimens decreased compared to the acute breaking strengths. However, the reinforced specimens still had larger breaking strengths than the unreinforced controls. These results indicate that reinforcement of a liquid albumin solder may have the potential to improve the breaking strength in a clinical setting.

  6. A new strategy based on SmRho protein loaded chitosan nanoparticles as a candidate oral vaccine against schistosomiasis.

    Directory of Open Access Journals (Sweden)

    Carolina R Oliveira

    Full Text Available BACKGROUND: Schistosomiasis is one of the most important neglected tropical diseases and an effective control is unlikely in the absence of improved sanitation and vaccination. A new approach of oral vaccination with alginate coated chitosan nanoparticles appears interesting because their great stability and the ease of target accessibility, besides of chitosan and alginate immunostimulatory properties. Here we propose a candidate vaccine based on the combination of chitosan-based nanoparticles containing the antigen SmRho and coated with sodium alginate. METHODS AND FINDINGS: Our results showed an efficient performance of protein loading of nanoparticles before and after coating with alginate. Characterization of the resulting nanoparticles reported a size around 430 nm and a negative zeta potential. In vitro release studies of protein showed great stability of coated nanoparticles in simulated gastric fluid (SGF and simulated intestinal fluid (SIF. Further in vivo studies was performed with different formulations of chitosan nanoparticles and it showed that oral immunization was not able to induce high levels of antibodies, otherwise intramuscular immunization induced high levels of both subtypes IgG1 and IgG2a SmRho specific antibodies. Mice immunized with nanoparticles associated to CpG showed significant modulation of granuloma reaction. Mice from all groups immunized orally with nanoparticles presented significant levels of protection against infection challenge with S. mansoni worms, suggesting an important role of chitosan in inducing a protective immune response. Finally, mice immunized with nanoparticles associated with the antigen SmRho plus CpG had 38% of the granuloma area reduced and also presented 48% of protection against of S. mansoni infection. CONCLUSIONS: Taken together, this results support this new strategy as an efficient delivery system and a potential vaccine against schistosomiasis.

  7. Contamination profile on typical printed circuit board assemblies vs soldering process

    DEFF Research Database (Denmark)

    Conseil, Helene; Jellesen, Morten Stendahl; Ambat, Rajan

    2014-01-01

    Purpose – The purpose of this paper was to analyse typical printed circuit board assemblies (PCBAs) processed by reflow, wave or selective wave soldering for typical levels of process-related residues, resulting from a specific or combination of soldering processes. Typical solder flux residue...... distribution pattern, composition and concentration are profiled and reported. The effect of such contaminants on conformal coating was tested. Design/methodology/approach – Presence of localized flux residues was visualized using a commercial residue reliability assessment testing gel test and chemical...... out using a commercial critical contamination control extraction system. Findings – Results clearly show that the amount and distribution of flux residues are a function of the soldering process, and the level can be reduced by an appropriate cleaning. Selective soldering process generates...

  8. Modification of Sn-1.0Ag-0.5Cu solder using nickel and boron

    Institute of Scientific and Technical Information of China (English)

    Jun-Feng Qu; Jun Xu; Qiang Hu; Fu-Wen Zhang; Shao-Ming Zhang

    2015-01-01

    Effects of Ni and B additions on the microstructure and growth behavior of the intermetallic compound (IMC) of Sn-1.0Ag-0.5Cu alloys (SAC105) were investigated in this study.Results show that microadditions of Ni and B result in volume fraction of primary Sn increasing and the grain size decreasing observably.It is found that a large number of fine reinforcement particles with network-like shape are found in the solder,and the thickness of interfacial IMC layer in the solder joint is grew less than that of SAC 105 with longer aging time.Shear test results reveal that as-soldered solder joints of microalloyed SAC105 have better shear strength than that of SAC 105 solder alloy.

  9. In-Au复合焊料研究%Research on In-Au Composite Solder

    Institute of Scientific and Technical Information of China (English)

    徐会武; 牛江丽; 任永晓; 王伟

    2009-01-01

    大功率半导体激光器封装过程中,为降低封装引入的应力,踊般用In焊料进行焊接.In焊料具有易氧化、易"攀爬"的特性,因而导致封装成品率很低.提出了一种新型焊料--In-Au复合焊料,使用此焊料进行封装,很好地解决了上述问题.通过理论分析及实验摸索,确定了In-Au复合焊料蒸发条件,分别利用纯In焊料和In-Au复合焊料封装了一批激光器样品,通过对比这两组样品的焊料浸润性、电光参数、剪切强度等,发现利用In-Au复合焊料封装的样品优于纯In焊料封装的样品.%To reduce packaging stress, In solder is often used in high power semiconductor laser diode packaging process. But In solder is easy to be oxidized and easy to "climb", so the product yield is very low. A new solder was introduced, In-Au composite solder, the issue above was solved by this solder. The parameter of vapor was confirmed with the help of theory analyzing and testing. A batch of LD samples were packaged using pure In solder and In-Au composite solder separately, by comparing soldering wetting, electric-optic parameter, shear intensity etc. It is proved that the sample using In-Au composite solder is preceding than that using pure In solder.

  10. Field based measurements of albedo for two candidate perennial cellulosic feedstocks and row crops in Central Illinois

    Science.gov (United States)

    Miller, J. N.; VanLoocke, A.; Bernacchi, C. J.

    2012-12-01

    The production of perennial cellulosic feedstocks for bioenergy present the potential to diversify regional economies and the national energy supply, while also serving as a climate 'regulators' due to a number of biogeochemical and biophysical differences relative to row crops. Numerous observationally and modeling based approaches, including life cycle analyses have investigated biogeochemical tradeoffs, such as increased carbon sequestration and biophysical increased water use, associated with growing cellulosic feedstocks. A less understood aspect is the biophysical changes associated with the difference in albedo, which will alter the local energy balance and could cause a local to regional cooling several times larger than that associated with offsetting carbon. To address this factor an experiment consisting of paired fields of Miscanthus and Switchgrass, two of the leading perennial cellulosic feedstock candidates, and traditional row crops was established in central Illinois. Data from the first two growing seasons indicate that this effect is most pronounced during the spring and fall as perennial biofuel crops green up earlier and senesce later than common annual row crops. The albedo of the perennials converges to that of the row crops during the growing season as the canopies develop. During the early winter, before the perennial crops are harvested, the albedo over fallow soybean and maize fields can vary greatly depending on snowfall and, to a lesser extent, soil moisture, whereas perennials show less variation. Thus, perennial biofuel crops also have the potential to buffer the local environment against short-term variations in climate. These factors should be considered when evaluating the tradeoffs and climate-regulation services associated with large-scale planting of bioenergy crops.

  11. Study on Mitigation Method of Solder Corrosion for Crystalline Silicon Photovoltaic Modules

    Directory of Open Access Journals (Sweden)

    Ju-Hee Kim

    2014-01-01

    Full Text Available The corrosion of 62Sn36Pb2Ag solder connections poses serious difficulties for outdoor-exposed photovoltaic (PV modules, as connection degradation contributes to the increase in series resistance (RS of PV modules. In this study, we investigated a corrosion mitigation method based on the corrosion mechanism. The effect of added sacrificial metal on the reliability of PV modules was evaluated using the oxidation-reduction (redox reaction under damp heat (DH conditions. Experimental results after exposure to DH show that the main reason for the decrease in power was a drop in the module’s fill factor. This drop was attributed to the increase of RS. The drop in output power of the PV module without added sacrificial metal is greater than that of the sample with sacrificial metal. Electroluminescence and current-voltage mapping analysis also show that the PV module with sacrificial metal experienced less degradation than the sample without sacrificial metal.

  12. Pb-free Sn-Ag-Cu ternary eutectic solder

    Science.gov (United States)

    Anderson, Iver E.; Yost, Frederick G.; Smith, John F.; Miller, Chad M.; Terpstra, Robert L.

    1996-06-18

    A Pb-free solder includes a ternary eutectic composition consisting essentially of about 93.6 weight % Sn-about 4.7 weight % Ag-about 1.7 weight % Cu having a eutectic melting temperature of about 217.degree. C. and variants of the ternary composition wherein the relative concentrations of Sn, Ag, and Cu deviate from the ternary eutectic composition to provide a controlled melting temperature range (liquid-solid "mushy" zone) relative to the eutectic melting temperature (e.g. up to 15.degree. C. above the eutectic melting temperature).

  13. Reflow Soldering of Surface Mount Electronic Components in a Laboratory

    CERN Document Server

    Erickson, Christopher J

    2009-01-01

    We present a basic tutorial for implementing surface mount technology in lab-built scientific instruments. We discuss the advantages and disadvantages of using surface mount chips. We also describe methods for the development and prototyping of surface mount circuitry in home-built electronics. The method of soldering surface mount components in a common toaster oven is described. We provide advice from our own experience in developing this technology, and argue that surface mount technology is often preferable to using leaded components when building large circuits, and is essential if the desired component characteristics are only available in surface mount packages.

  14. Nanoscale soldering of axially positioned single-walled carbon nanotubes: a molecular dynamics simulation study.

    Science.gov (United States)

    Cui, Jianlei; Yang, Lijun; Zhou, Liang; Wang, Yang

    2014-02-12

    The miniaturization of electronics devices into the nanometer scale is indispensable for next-generation semi-conductor technology. Carbon nanotubes (CNTs) are considered to be the promising candidates for future interconnection wires. To study the carbon nanotubes interconnection during nanosoldering, the melting process of nanosolder and nanosoldering process between single-walled carbon nanotubes are simulated with molecular dynamics method. As the simulation results, the melting point of 2 nm silver solder is about 605 K because of high surface energy, which is below the melting temperature of Ag bulk material. In the nanosoldering process simulations, Ag atoms may be dragged into the nanotubes to form different connection configuration, which has no apparent relationship with chirality of SWNTs. The length of core filling nanowires structure has the relationship with the diameter, and it does not become longer with the increasing diameter of SWNT. Subsequently, the dominant mechanism of was analyzed. In addition, as the heating temperature and time, respectively, increases, more Ag atoms can enter the SWNTs with longer length of Ag nanowires. And because of the strong metal bonds, less Ag atoms can remain with the tight atomic structures in the gap between SWNT and SWNT. The preferred interconnection configurations can be achieved between SWNT and SWNT in this paper.

  15. Impact of Cooling Rate-Induced Recrystallization on High G Mechanical Shock and Thermal Cycling in Sn-Ag-Cu Solder Interconnects

    Science.gov (United States)

    Lee, Tae-Kyu; Bieler, Thomas R.; Kim, Choong-Un

    2016-01-01

    The mechanical stability and thermo-mechanical fatigue performance of solder joints with low silver content Sn-1.0Ag-0.5Cu (wt.%) (SAC105) alloy based on different cooling rates are investigated in high G level shock environment and thermal cycling conditions. The cooling rate-controlled samples ranging from 1°C/min to 75°C/min cooling rate, not only show differences in microstructure, where a fine poly-granular microstructure develops in the case of fast cooling versus normal cooling, but also show various shock performances based on the microstructure changes. The fast cooling rate improves the high G shock performance by over 90% compared to the normal cooled SAC105 alloy air-cooling environment commonly used after assembly reflow. The microstructure effect on thermal cycling performance is also discussed, which is analyzed based on the Sn grain orientation, interconnect stability, and solder joint bulk microstructure.

  16. Imaging and Analysis of Void-defects in Solder Joints Formed in Reduced Gravity using High-Resolution Computed Tomography

    Science.gov (United States)

    Easton, John W.; Struk, Peter M.; Rotella, Anthony

    2008-01-01

    As a part of efforts to develop an electronics repair capability for long duration space missions, techniques and materials for soldering components on a circuit board in reduced gravity must be developed. This paper presents results from testing solder joint formation in low gravity on a NASA Reduced Gravity Research Aircraft. The results presented include joints formed using eutectic tin-lead solder and one of the following fluxes: (1) a no-clean flux core, (2) a rosin flux core, and (3) a solid solder wire with external liquid no-clean flux. The solder joints are analyzed with a computed tomography (CT) technique which imaged the interior of the entire solder joint. This replaced an earlier technique that required the solder joint to be destructively ground down revealing a single plane which was subsequently analyzed. The CT analysis technique is described and results presented with implications for future testing as well as implications for the overall electronics repair effort discussed.

  17. Isoquinoline-based analogs of the cancer drug clinical candidate tipifarnib as anti-Trypanosoma cruzi agents

    OpenAIRE

    Chennamaneni, Naveen Kumar; Arif, Jenifer; Buckner, Frederick S.; Gelb, Michael H

    2009-01-01

    We developed a synthetic route to prepare isoquinoline analogs of the cancer drug clinical candidate tipifarnib. We show that these compounds kill Trypanosoma cruzi amastigotes grown in mammalian host cells at concentrations in the low nanomolar range. These isoquinolines represent new leads for the development of drugs to treat Chagas disease.

  18. Quantitative iTRAQ-Based Proteomic Identification of Candidate Biomarkers for Diabetic Nephropathy in Plasma of Type 1 Diabetic Patients

    DEFF Research Database (Denmark)

    Overgaard, Anne Julie; Thingholm, Tine Engberg; Larsen, Martin R;

    2010-01-01

    INTRODUCTION: As part of a clinical proteomics programme focused on diabetes and its complications, it was our goal to investigate the proteome of plasma in order to find improved candidate biomarkers to predict diabetic nephropathy. METHODS: Proteins derived from plasma from a cross-sectional co...

  19. Effects of Temperature on the Wave Soldering of Printed Circuit Boards: CFD Modeling Approach

    Directory of Open Access Journals (Sweden)

    M.S. Abdul Aziz

    2016-01-01

    Full Text Available ABSTRACT This study investigated the effects of temperature on the wave soldering of printed circuit boards (PCBs using three-dimensional finite volume analysis. A computational solder pot model consisting of a six-blade rotational propeller was developed and meshed using tetrahedral elements. The leaded molten solder (Sn63Pb37 distribution and PCB wetting profile were determined using the volume of fluid technique in the fluid flow solver, FLUENT. In this study, the effects of five different molten solder temperatures (456 K, 473 K, 523 K, 583 K, and 643 K on the wave soldering of a 70 mm × 146 mm PCB were considered. The effects of temperature on wetting area, wetting profile, velocity vector, and full wetting time were likewise investigated. Molten solder temperature significantly affected the wetting time and distribution of PCBs. The molten solder temperature at 523 K demonstrated desirable wetting distribution and yielded a stable fountain profile and was therefore considered the best temperature in this study. The simulation results were substantiated by the experimental results.

  20. A microstructural study of creep and thermal fatigue deformation in 60Sn-40Pb solder joints

    Energy Technology Data Exchange (ETDEWEB)

    Tribula, D.

    1990-06-02

    Thermal fatigue failures of solder joints in electronic devices often arise from cyclic shear strains imposed by the mismatched thermal expansion coefficients of the materials that bind the joint as temperature changes are encountered. Increased solder joint reliability demands a fundamental understanding of the metallurigical mechanisms that control the fatigue to design accurate accelerated probative tests and new, more fatigue resistant solder alloys. The high temperatures and slow strain rates that pertain to thermal fatigue imply that creep is an important deformation mode in the thermal fatigue cycle. In this work, the creep behaviour of a solder joint is studied to determine the solder's microstructural response to this type of deformation and to relate this to the more complex problem of thermal fatigue. It is shown that creep failures arise from the inherent inhomogeneity and instability of the solder microstructure and suggest that small compositional changes of the binary near-eutectic Pn-Sn alloy may defeat the observed failure mechanisms. This work presents creep and thermal fatigue data for several near-eutectic Pb-Sn solder compositions and concludes that a 58Sn-40Pb-2In and a 58Sn-40Pb-2Cd alloy show significantly enhanced fatigue resistance over that of the simple binary material. 80 refs., 33 figs., 1 tab.

  1. The tensile strength characteristics study of the laser welds of biological tissue using the nanocomposite solder

    Science.gov (United States)

    Rimshan, I. B.; Ryabkin, D. I.; Savelyev, M. S.; Zhurbina, N. N.; Pyanov, I. V.; Eganova, E. M.; Pavlov, A. A.; Podgaetsky, V. M.; Ichkitidze, L. P.; Selishchev, S. V.; Gerasimenko, A. Y.

    2016-04-01

    Laser welding device for biological tissue has been developed. The main device parts are the radiation system and adaptive thermal stabilization system of welding area. Adaptive thermal stabilization system provided the relation between the laser radiation intensity and the weld temperature. Using atomic force microscopy the structure of composite which is formed by the radiation of laser solder based on aqua- albuminous dispersion of multi-walled carbon nanotubes was investigated. AFM topograms nanocomposite solder are mainly defined by the presence of pores in the samples. In generally, the surface structure of composite is influenced by the time, laser radiation power and MWCNT concentration. Average size of backbone nanoelements not exceeded 500 nm. Bulk density of nanoelements was in the range 106-108 sm-3. The data of welding temperature maintained during the laser welding process and the corresponding tensile strength values were obtained. Maximum tensile strength of the suture was reached in the range 50-55°C. This temperature and the pointwise laser welding technology (point area ~ 2.5mm) allows avoiding thermal necrosis of healthy section of biological tissue and provided reliable bonding construction of weld join. In despite of the fact that tensile strength values of the samples are in the range of 15% in comparison with unbroken strips of pigskin leather. This situation corresponds to the initial stage of the dissected tissue connection with a view to further increasing of the joint strength of tissues with the recovery of tissue structure; thereby achieved ratio is enough for a medical practice in certain cases.

  2. Effect of contact metallization on electromigration reliability of Pb-free solder joints

    Science.gov (United States)

    Ding, Min; Wang, Guotao; Chao, Brook; Ho, Paul S.; Su, Peng; Uehling, Trent

    2006-05-01

    The effect of underbump metallization (UBM) on electromigration (EM) lifetime and failure mechanism has been investigated for Pb-free solder bumps of 97Sn3Ag composition in the temperature range of 110-155 °C. The EM lifetime of the SnAg Pb-free solders with either Cu or Ni UBM was found to be better than the eutectic SnPb (63Sn37Pb) solders but worse than high-Pb (95Pb5Sn) solders. In the test temperature range, the EM lifetimes were found to be comparable for Cu and Ni UBMs but with different activation energies: 0.64-0.72 eV for Cu UBM and 1.03-1.11 eV for Ni UBM. EM failure was observed only in solder bumps with electron current flow from UBM to the substrate. Failure analysis revealed that EM damage was initiated by the formation of intermetallic compounds (IMC) at the UBM/solder interface which was found to be significantly enhanced by mass transport driven by the electron current. Under EM, the continued growth of IMC with the dissolution of the UBM and the accumulation of Kirkendall voids resulted in the formation of interfacial cracks and eventual EM failure of the solder bump. For Ni UBM, the IMC formation was dominated by the Ni3Sn4 phase while for Cu UBM, a bilayer of Cu3Sn/Cu6Sn5 was found. Void formation at the Cu6Sn5/solder interface was found to be important in controlling the EM lifetime of the Cu UBM solder.

  3. Nanoscale Soldering of Positioned Carbon Nanotubes using Highly Conductive Electron Beam Induced Gold Deposition

    DEFF Research Database (Denmark)

    Madsen, Dorte Nørgaard; Mølhave, Kristian; Mateiu, Ramona Valentina;

    2003-01-01

    We have developed an in-situ method for controlled positioning of carbon nanotubes followed by highly conductive contacting of the nanotubes, using electron beam assisted deposition of gold. The positioning and soldering process takes place inside an Environmental Scanning Electron Microscope (E...... in a carbon matrix. Nanoscale soldering of multi-walled carbon nanotubes (MWNT) onto microelectrodes was achieved by deposition of a conducting gold line across a contact point between nanotube and electrode. The solderings were found to be mechanically stronger than the carbon nanotubes. We have positioned...

  4. Observations of microstructural coarsening in micro flip-chip solder joints

    Science.gov (United States)

    Barney, Monica M.; Morris, J. W.

    2001-09-01

    Coarsening of solder microstructures dramatically affects fatigue lifetimes. This paper presents a study of microstructural evolution due to thermal cycling and aging of small solder joints. The lead-tin solder joints in this study have a height of 55 5 m and a tin content of 65 70 wt.%, with a degenerate eutectic microstructure. The joint microstructure coarsens more rapidly during aging at 160°C than cycling from 0 160°C. No coarsened bands are observed. The cycling data scales with standard coarsening equations, while the aging data fits to an enhanced trend. The joints experiencing 2.8% strain during cycling fail by 1000 cycles.

  5. Potentiodynamic polarization effect on phase and microstructure of SAC305 solder in hydrochloric acid solution

    Science.gov (United States)

    Zaini, Nurwahida Binti Mohd; Nazeri, Muhammad Firdaus Bin Mohd

    2016-07-01

    The corrosion analysis of SAC305 lead free solder was investigated in Hydrochloric acid (HCl) solution. Potentiodynamic polarization was used to polarize the SAC305. The effect of polarization on the phase and microstructure were compared to as-prepared SAC305 solder. Potentiodynamic polarization introduces mixed corrosion products on the surface of SAC305 solder. The XRD analysis confirms that the mixed corrosion products emerged on the surface after polarization by formation of SnO and SnO2 of which confirmed that dissolution of Sn was dominant during polarization. Microstructure analysis reveal the presence of gap and porosities produced limits the protection offered by the passivation film.

  6. Candidates of eclipsing multiples based on extraneous eclipses on binary light curves: KIC 7622486, KIC 7668648, KIC 7670485 and KIC 8938628

    CERN Document Server

    Zhang, Jia; He, Jian-Duo

    2016-01-01

    Four candidates of eclipsing multiples, based on new extraneous eclipses found on Kepler binary light curves, are presented and studied. KIC 7622486 is a double eclipsing binary candidate with orbital period of 2.2799960 days and 40.246503 days. The two binary systems do not eclipse each other in the line of sight, but there is mutual gravitational influence between them which leads to the small but definite eccentricity 0.0035(0.0022) on the short 2.2799960 days period orbit. KIC 7668648 is hierarchical quadruple system candidate, with two sets of solid 203(+-5) days period extraneous eclipses and another independent set of extraneous eclipses. A clear and credible extraneous eclipse is found on the binary light curve of KIC 7670485 which made it a triple system candidates. Two sets of extraneous eclipse of about 390 days and 220 days period are found on KIC 8938628 binary curves, which not only confirms the previous conclusion of $388.5(+-0.3) triple system, but also proposed a new additional objects that m...

  7. Comparative testing of six antigen-based malaria vaccine candidates directed toward merozoite-stage Plasmodium falciparum

    DEFF Research Database (Denmark)

    Arnot, David E; Cavanagh, David R; Remarque, Edmond J;

    2008-01-01

    Immunogenicity testing of Plasmodium falciparum antigens being considered as malaria vaccine candidates was undertaken in rabbits. The antigens compared were recombinant baculovirus MSP-1(19) and five Pichia pastoris candidates, including two versions of MSP-1(19), AMA-1 (domains I and II), AMA-1......+MSP-1(19), and fused AMA-1/MSP-1(19)). Animals were immunized with equimolar amounts of each antigen, formulated in Montanide ISA720. The specificities and titers of antibodies were compared using immunofluorescence assays and enzyme-linked immunosorbent assay (ELISA). The antiparasite activity...... of immunoglobulin G (IgG) in in vitro cultures was determined by growth inhibition assay, flow cytometry, lactate dehydrogenase assay, and microscopy. Baculovirus MSP-1(19) immunizations produced the highest parasite-specific antibody titers in immunofluorescence assays. In ELISAs, baculovirus-produced MSP-1...

  8. Effect of Surface Finish of Substrate on Mechanical Reliability of in-48SN Solder Joints in Moems Package

    CERN Document Server

    Koo, Ja-Myeong

    2007-01-01

    Interfacial reactions and shear properties of the In-48Sn (in wt.%) ball grid array (BGA) solder joints after bonding were investigated with four different surface finishes of the substrate over an underlying Cu pad: electroplated Ni/Au (hereafter E-NG), electroless Ni/immersion Au (hereafter ENIG), immersion Ag (hereafter I-Ag) and organic solderability preservative (hereafter OSP). During bonding, continuous AuIn2, Ni3(Sn,In)4 and Cu6(Sn,In)5 intermetallic compound (IMC) layers were formed at the solder/E-NG, solder/ENIG and solder/OSP interface, respectively. The interfacial reactions between the solder and I-Ag substrate during bonding resulted in the formation of Cu6(Sn,In)5 and Cu(Sn,In)2 IMCs with a minor Ag element. The In-48Sn/I-Ag solder joint showed the best shear properties among the four solder joints after bonding, whereas the solder/ENIG solder joint exhibited the weakest mechanical integrity.

  9. 化学镀可焊性锡基合金的研究进展%Progress of research on electroless plating of solderable tin alloy

    Institute of Scientific and Technical Information of China (English)

    赵国鹏; 樊江莉; 温青

    2001-01-01

    本文综述了近10年来化学镀可焊性锡基合金的研究现状及动态。列举了4种不同镀液体系的典型配方及工艺,并对化学镀锡合金的未来发展提出了建议。%Current status and prospect of solderable electroless tin alloy plating were summarized with 18 references published in the recent decade. Four traditional plating solutions based on chloride, fluoboric, alkyl sulfonate and ethane sulfonate were exemplified. Suggestions were presented about the develoment of electroless plating of solderable tin alloy.

  10. Ultrasonic semi-solid coating soldering 6061 aluminum alloys with Sn-Pb-Zn alloys.

    Science.gov (United States)

    Yu, Xin-ye; Xing, Wen-qing; Ding, Min

    2016-07-01

    In this paper, 6061 aluminum alloys were soldered without a flux by the ultrasonic semi-solid coating soldering at a low temperature. According to the analyses, it could be obtained that the following results. The effect of ultrasound on the coating which promoted processes of metallurgical reaction between the components of the solder and 6061 aluminum alloys due to the thermal effect. Al2Zn3 was obtained near the interface. When the solder was in semi-solid state, the connection was completed. Ultimately, the interlayer mainly composed of three kinds of microstructure zones: α-Pb solid solution phases, β-Sn phases and Sn-Pb eutectic phases. The strength of the joints was improved significantly with the minimum shear strength approaching 101MPa. PMID:26964943

  11. Contamination profile of Printed Circuit Board Assemblies in relation to soldering types and conformal coating

    DEFF Research Database (Denmark)

    Conseil, Helene; Jellesen, Morten Stendahl; Ambat, Rajan

    2014-01-01

    Typical printed circuit board assemblies (PCBAs) processed by reflow, wave, or selective wave soldering were analysed for typical levels of process related residues, resulting from a specific or combination of soldering process. Typical solder flux residue distribution pattern, composition......, and concentration are profiled and reported. Presence of localized flux residues were visualized using a commercial Residue RAT gel test and chemical structure was identified by FT-IR, while the concentration was measured using ion chromatography, and the electrical properties of the extracts were determined...... by measuring the leak current using a twin platinum electrode setup. Localized extraction of residue was carried out using a commercial C3 extraction system. Results clearly show that the amount and distribution of flux residues are a function of the soldering process, and the level can be reduced...

  12. Interfacial Reactions and Joint Strengths of Sn- xZn Solders with Immersion Ag UBM

    Science.gov (United States)

    Jee, Y. K.; Yu, Jin

    2010-10-01

    The solder joint microstructures of immersion Ag with Sn- xZn ( x = 0 wt.%, 1 wt.%, 5 wt.%, and 9 wt.%) solders were analyzed and correlated with their drop impact reliability. Addition of 1 wt.% Zn to Sn did not change the interface microstructure and was only marginally effective. In comparison, the addition of 5 wt.% or 9 wt.% Zn formed layers of AgZn3/Ag5Zn8 at the solder joint interface, which increased drop reliability significantly. Under extensive aging, Ag-Zn intermetallic compounds (IMCs) transformed into Cu5Zn8 and Ag3Sn, and the drop impact resistance at the solder joints deteriorated up to a point. The beneficial role of Zn on immersion Ag pads was ascribed to the formation of Ag-Zn IMC layers, which were fairly resistant to the drop impact, and to the suppression of the brittle Cu6Sn5 phase at the joint interface.

  13. Comprehensive analytical strategy for biomarker identification based on liquid chromatography coupled to mass spectrometry and new candidate confirmation tools.

    Science.gov (United States)

    Mohamed, Rayane; Varesio, Emmanuel; Ivosev, Gordana; Burton, Lyle; Bonner, Ron; Hopfgartner, Gérard

    2009-09-15

    A comprehensive analytical LC-MS(/MS) platform for low weight biomarkers molecule in biological fluids is described. Two complementary retention mechanisms were used in HPLC by optimizing the chromatographic conditions for a reversed-phase column and a hydrophilic interaction chromatography column. LC separation was coupled to mass spectrometry by using an electrospray ionization operating in positive polarity mode. This strategy enables us to correctly retain and separate hydrophobic as well as polar analytes. For that purpose artificial model study samples were generated with a mixture of 38 well characterized compounds likely to be present in biofluids. The set of compounds was used as a standard aqueous mixture or was spiked into urine at different concentration levels to investigate the capability of the LC-MS(/MS) platform to detect variations across biological samples. Unsupervised data analysis by principal component analysis was performed and followed by principal component variable grouping to find correlated variables. This tool allows us to distinguish three main groups whose variables belong to (a) background ions (found in all type of samples), (b) ions distinguishing urine samples from aqueous standard and blank samples, (c) ions related to the spiked compounds. Interpretation of these groups allows us to identify and eliminate isotopes, adducts, fragments, etc. and to generate a reduced list of m/z candidates. This list is then submitted to the prototype MZSearcher software tool which simultaneously searches several lists of potential metabolites extracted from metabolomics databases (e.g., KEGG, HMDB, etc) to propose biomarker candidates. Structural confirmation of these candidates was done off-line by fraction collection followed by nanoelectrospray infusion to provide high quality MS/MS data for spectral database queries. PMID:19702294

  14. Rapid communication: Computational simulation and analysis of a candidate for the design of a novel silk-based biopolymer.

    Science.gov (United States)

    Golas, Ewa I; Czaplewski, Cezary

    2014-09-01

    This work theoretically investigates the mechanical properties of a novel silk-derived biopolymer as polymerized in silico from sericin and elastin-like monomers. Molecular Dynamics simulations and Steered Molecular Dynamics were the principal computational methods used, the latter of which applies an external force onto the system and thereby enables an observation of its response to stress. The models explored herein are single-molecule approximations, and primarily serve as tools in a rational design process for the preliminary assessment of properties in a new material candidate. PMID:24723330

  15. Development of motion control method for laser soldering process

    Energy Technology Data Exchange (ETDEWEB)

    Yerganian, S.S.

    1997-05-01

    Development of a method to generate the motion control data for sealing an electronic housing using laser soldering is described. The motion required to move the housing under the laser is a nonstandard application and was performed with a four-axis system using the timed data streaming mode capabilities of a Compumotor AT6400 indexer. A Microsoft Excel 5.0 spreadsheet (named Israuto.xls) was created to calculate the movement of the part under the laser, and macros were written into the spreadsheet to allow the user to easily create this data. A data verification method was developed for simulating the motion data. The geometry of the assembly was generated using Parametric Technology Corporation Pro/E version 15. This geometry was then converted using Pro/DADS version 3.1 from Computer Aided Design Software Inc. (CADSI), and the simulation was carried out using DADS version 8.0 from CADSI.

  16. Reliability Assessment of Solder Joints in Power Electronic Modules by Crack Damage Model for Wind Turbine Applications

    Directory of Open Access Journals (Sweden)

    John D. Sørensen

    2011-12-01

    Full Text Available Wind turbine reliability is an important issue for wind energy cost minimization, especially by reduction of operation and maintenance costs for critical components and by increasing wind turbine availability. To develop an optimal operation and maintenance plan for critical components, it is necessary to understand the physics of their failure and be able to develop reliability prediction models. Such a model is proposed in this paper for an IGBT power electronic module. IGBTs are critical components in wind turbine converter systems. These are multilayered devices where layers are soldered to each other and they operate at a thermal-power cycling environment. Temperature loadings affect the reliability of soldered joints by developing cracks and fatigue processes that eventually result in failure. Based on Miner’s rule a linear damage model that incorporates a crack development and propagation processes is discussed. A statistical analysis is performed for appropriate model parameter selection. Based on the proposed model, a layout for component life prediction with crack movement is described in details.

  17. Decomposition studies of no-clean solder flux systems in connection with corrosion reliability of electronics

    OpenAIRE

    Conseil, Helene; Jellesen, Morten Stendahl; Verdingovas, Vadimas; Ambat, Rajan

    2013-01-01

    One of the predominant factors for accelerated corrosion in electronics is the intrinsic contamination on Printed Circuit Board Assemblies (PCBAs) originating from the soldering process used for component mounting. However, the amount, distribution, and morphology of flux residue vary considerably with specific soldering process and parameters, while most important factors are the flux chemistry and its decomposition characteristics. Active parts of the flux residue can cause increased water ...

  18. Thermomechanical cycling investigation of CU particulate and NITI reinforced lead-free solder

    OpenAIRE

    Horton, W. Scott.

    2006-01-01

    In todayâ s Flip Chip (FC) and Ball Grid Array (BGA) electronic packages solder joints provide both the electrical as well as the mechanical connections between the silicon chip and the substrate. Due to coefficient of thermal expansion (CTE) differences between the chip and substrate the solder joints undergo thermomechanical stresses and strains as an electronic package is heated and cooled with power on/off cycles. Advances in chip designs result in chips that are larger, run hotter and d...

  19. Processing and Characterization of Device Solder Interconnection and Module Attachment for Power Electronics Modules

    OpenAIRE

    Haque, Ashim Shatil

    1999-01-01

    Processing and Characterization of Device Solder Interconnection and Module Attachment for Power Electronics Modules by Shatil Haque Committee Chairman: Dr. Guo-Quan Lu Materials Engineering and Science Department (ABSTRACT) This research is focused on the processing of an innovative three-dimensional packaging architecture for power electronics building blocks with soldered device interconnections and subsequent characterization of the module's critical interfaces. A low-co...

  20. Analysis of Direct-Soldered Power Module / Heat Sink Thermal Interface for Electric Vehicle Applications

    OpenAIRE

    Kim, Junhyung

    2001-01-01

    Reducing the thermal impedance between power module and heat sink is important for high-power density, low-cost inverter applications. Mounting a power module by directly soldering it onto a heat sink can significantly reduce the thermal impedance at the module / heat sink interface, as compared to the conventional method of bolting the two together with a thermal grease or some other interface materials in between. However, a soldered interface typically contains a large number of voids, whi...

  1. Planetary Candidates Observed by Kepler. VII. The First Fully Uniform Catalog Based on The Entire 48 Month Dataset (Q1-Q17 DR24)

    CERN Document Server

    Coughlin, Jeffrey L; Thompson, Susan E; Rowe, Jason F; Burke, Christopher J; Latham, David W; Batalha, Natalie M; Ofir, Aviv; Quarles, Billy L; Henze, Christopher E; Wolfgang, Angie; Caldwell, Douglas A; Bryson, Stephen T; Shporer, Avi; Catanzarite, Joseph; Akeson, Rachel; Barclay, Thomas; Borucki, William J; Boyajian, Tabetha S; Campbell, Jennifer R; Christiansen, Jessie L; Girouard, Forrest R; Haas, Michael R; Howell, Steve B; Huber, Daniel; Jenkins, Jon M; Li, Jie; Patil-Sabale, Anima; Quintana, Elisa V; Ramirez, Solange; Seader, Shawn; Smith, Jeffrey C; Tenenbaum, Peter; Twicken, Joseph D; Zamudio, Khadeejah A

    2015-01-01

    We present the seventh Kepler planet candidate catalog, which is the first to be based on the entire, uniformly processed, 48 month Kepler dataset. This is the first fully automated catalog, employing robotic vetting procedures to uniformly evaluate every periodic signal detected by the Q1-Q17 Data Release 24 (DR24) Kepler pipeline. While we prioritize uniform vetting over the absolute correctness of individual objects, we find that our robotic vetting is overall comparable to, and in most cases is superior to, the human vetting procedures employed by past catalogs. This catalog is the first to utilize artificial transit injection to evaluate the performance of our vetting procedures and quantify potential biases, which are essential for accurate computation of planetary occurrence rates. With respect to the cumulative Kepler Object of Interest (KOI) catalog, we designate 1,478 new KOIs, of which 402 are dispositioned as planet candidates (PCs). Also, 237 KOIs dispositioned as false positives (FPs) in previou...

  2. Evaluation of low-residue soldering for military and commercial applications: A report from the Low-Residue Soldering Task Force

    Energy Technology Data Exchange (ETDEWEB)

    Iman, R.L.; Anderson, D.J. [Sandia National Labs., Albuquerque, NM (United States); Burress, R.V. [SEHO (United States)] [and others

    1995-06-01

    The LRSTF combined the efforts of industry, military, and government to evaluate low-residue soldering processes for military and commercial applications. These processes were selected for evaluation because they provide a means for the military to support the presidential mandate while producing reliable hardware at a lower cost. This report presents the complete details and results of a testing program conducted by the LRSTF to evaluate low-residue soldering for printed wiring assemblies. A previous informal document provided details of the test plan used in this evaluation. Many of the details of that test plan are contained in this report. The test data are too massive to include in this report, however, these data are available on disk as Excel spreadsheets upon request. The main purpose of low-residue soldering is to eliminate waste streams during the manufacturing process.

  3. VennPainter: A Tool for the Comparison and Identification of Candidate Genes Based on Venn Diagrams.

    Directory of Open Access Journals (Sweden)

    Guoliang Lin

    Full Text Available VennPainter is a program for depicting unique and shared sets of genes lists and generating Venn diagrams, by using the Qt C++ framework. The software produces Classic Venn, Edwards' Venn and Nested Venn diagrams and allows for eight sets in a graph mode and 31 sets in data processing mode only. In comparison, previous programs produce Classic Venn and Edwards' Venn diagrams and allow for a maximum of six sets. The software incorporates user-friendly features and works in Windows, Linux and Mac OS. Its graphical interface does not require a user to have programing skills. Users can modify diagram content for up to eight datasets because of the Scalable Vector Graphics output. VennPainter can provide output results in vertical, horizontal and matrix formats, which facilitates sharing datasets as required for further identification of candidate genes. Users can obtain gene lists from shared sets by clicking the numbers on the diagram. Thus, VennPainter is an easy-to-use, highly efficient, cross-platform and powerful program that provides a more comprehensive tool for identifying candidate genes and visualizing the relationships among genes or gene families in comparative analysis.

  4. VennPainter: A Tool for the Comparison and Identification of Candidate Genes Based on Venn Diagrams.

    Science.gov (United States)

    Lin, Guoliang; Chai, Jing; Yuan, Shuo; Mai, Chao; Cai, Li; Murphy, Robert W; Zhou, Wei; Luo, Jing

    2016-01-01

    VennPainter is a program for depicting unique and shared sets of genes lists and generating Venn diagrams, by using the Qt C++ framework. The software produces Classic Venn, Edwards' Venn and Nested Venn diagrams and allows for eight sets in a graph mode and 31 sets in data processing mode only. In comparison, previous programs produce Classic Venn and Edwards' Venn diagrams and allow for a maximum of six sets. The software incorporates user-friendly features and works in Windows, Linux and Mac OS. Its graphical interface does not require a user to have programing skills. Users can modify diagram content for up to eight datasets because of the Scalable Vector Graphics output. VennPainter can provide output results in vertical, horizontal and matrix formats, which facilitates sharing datasets as required for further identification of candidate genes. Users can obtain gene lists from shared sets by clicking the numbers on the diagram. Thus, VennPainter is an easy-to-use, highly efficient, cross-platform and powerful program that provides a more comprehensive tool for identifying candidate genes and visualizing the relationships among genes or gene families in comparative analysis. PMID:27120465

  5. Effect of gamma radiation on micromechanical hardness of lead-free solder joint

    Energy Technology Data Exchange (ETDEWEB)

    Paulus, Wilfred [Universiti Kebangsaan Malaysia, Bangi, 43600 Kajang, Selangor (Malaysia); Malaysian Nuclear Agency, Bangi, 43000 Kajang, Selangor (Malaysia); Rahman, Irman Abdul; Jalar, Azman; Kamil, Insan; Bakar, Maria Abu [Universiti Kebangsaan Malaysia, Bangi, 43600 Kajang, Selangor (Malaysia); Yusoff, Wan Yusmawati Wan [Universiti Pertahanan Nasional Malaysia, Kem Sg. Besi, 57000 Kuala Lumpur (Malaysia)

    2015-09-25

    Lead-free solders are important material in nano and microelectronic surface mounting technology for various applications in bio medicine, environmental monitoring, spacecraft and satellite instrumentation. Nevertheless solder joint in radiation environment needs higher reliability and resistance to any damage caused by ionizing radiations. In this study a lead-free 99.0Sn0.3Ag0.7Cu wt.% (SAC) solder joint was developed and subjected to various doses of gamma radiation to investigate the effects of the ionizing radiation to micromechanical hardness of the solder. Averaged hardness of the SAC joint was obtained from nanoindentation test. The results show a relationship between hardness values of indentations and the increment of radiation dose. Highest mean hardness, 0.2290 ± 0.0270 GPa was calculated on solder joint which was exposed to 5 Gray dose of gamma radiation. This value indicates possible radiation hardening effect on irradiated solder. The hardness gradually decreased to 0.1933 ± 0.0210 GPa and 0.1631 ± 0.0173 GPa when exposed to doses 50 and 500 gray respectively. These values are also lower than the hardness of non irradiated sample which was calculated as 0.2084 ± 0.0.3633 GPa indicating possible radiation damage and needs further related atomic dislocation study.

  6. Properties and Microstructures of Sn-Ag-Cu-X Lead-Free Solder Joints in Electronic Packaging

    Directory of Open Access Journals (Sweden)

    Lei Sun

    2015-01-01

    Full Text Available SnAgCu solder alloys were considered as one of the most popular lead-free solders because of its good reliability and mechanical properties. However, there are also many problems that need to be solved for the SnAgCu solders, such as high melting point and poor wettability. In order to overcome these shortcomings, and further enhance the properties of SnAgCu solders, many researchers choose to add a series of alloying elements (In, Ti, Fe, Zn, Bi, Ni, Sb, Ga, Al, and rare earth and nanoparticles to the SnAgCu solders. In this paper, the work of SnAgCu lead-free solders containing alloying elements and nanoparticles was reviewed, and the effects of alloying elements and nanoparticles on the melting temperature, wettability, mechanical properties, hardness properties, microstructures, intermetallic compounds, and whiskers were discussed.

  7. Method of temporary solder assembling of peelable plates for mechanical peel off release device and assembly obtained thereby

    Energy Technology Data Exchange (ETDEWEB)

    Philipoussi, J.-P.

    1989-03-07

    A method is provided of temporary assembling (by soldering) of peel off plates through soldering material, and a flexible junction element for a mechancial release device to release two parts temporarily fixed edgewise by peeling off the flexible element and the soldering material. Reserved areas are provided on the plates and flexible junction element, these areas having no adherence to the soldering material. Preferably at the limits of said reserved areas, trap means are also provided for removing any excess of soldering material. The melting solder material is put under load for distributing it between the plates and the flexible junction element. An assembly so obtained can be applied particularly to the automatic opening of containers, in particular for spreading out solar panels in space. 1 fig.

  8. Generation and Characterization of Live Attenuated Influenza A(H7N9 Candidate Vaccine Virus Based on Russian Donor of Attenuation.

    Directory of Open Access Journals (Sweden)

    Svetlana Shcherbik

    Full Text Available Avian influenza A (H7N9 virus has emerged recently and continues to cause severe disease with a high mortality rate in humans prompting the development of candidate vaccine viruses. Live attenuated influenza vaccines (LAIV are 6:2 reassortant viruses containing the HA and NA gene segments from wild type influenza viruses to induce protective immune responses and the six internal genes from Master Donor Viruses (MDV to provide temperature sensitive, cold-adapted and attenuated phenotypes.LAIV candidate A/Anhui/1/2013(H7N9-CDC-LV7A (abbreviated as CDC-LV7A, based on the Russian MDV, A/Leningrad/134/17/57 (H2N2, was generated by classical reassortment in eggs and retained MDV temperature-sensitive and cold-adapted phenotypes. CDC-LV7A had two amino acid substitutions N123D and N149D (H7 numbering in HA and one substitution T10I in NA. To evaluate the role of these mutations on the replication capacity of the reassortants in eggs, the recombinant viruses A(H7N9RG-LV1 and A(H7N9RG-LV2 were generated by reverse genetics. These changes did not alter virus antigenicity as ferret antiserum to CDC-LV7A vaccine candidate inhibited hemagglutination by homologous A(H7N9 virus efficiently. Safety studies in ferrets confirmed that CDC-LV7A was attenuated compared to wild-type A/Anhui/1/2013. In addition, the genetic stability of this vaccine candidate was examined in eggs and ferrets by monitoring sequence changes acquired during virus replication in the two host models. No changes in the viral genome were detected after five passages in eggs. However, after ten passages additional mutations were detected in the HA gene. The vaccine candidate was shown to be stable in the ferret model; post-vaccination sequence data analysis showed no changes in viruses collected in nasal washes present at day 5 or day 7.Our data indicate that the A/Anhui/1/2013(H7N9-CDC-LV7A reassortant virus is a safe and genetically stable candidate vaccine virus that is now available for

  9. Investigation of electrochemical migration on Sn-0.7Cu-0.3Ag-0.03P-0.005Ni solder alloy in HNO{sub 3} solution

    Energy Technology Data Exchange (ETDEWEB)

    Sarveswaran, C.; Othman, N. K. [School of Applied Physics, Faculty of Science and Technology, Universiti Kebangsaan Malaysia, 43600, Bangi, Selangor (Malaysia); Ali, M. Yusuf Tura; Ani, F. Che; Samsudin, Z. [Jabil Circuit Sdn Bhd, Bayan Lepas Industrial Park, 11900, Penang (Malaysia)

    2015-09-25

    Current issue in lead-free solder in term of its reliability is still under investigation. This high impact research attempts to investigate the electrochemical migration (ECM) on Sn-0.7Cu-0.3Ag-0.03P-0.005Ni solder alloy by Water Drop Test (WDT) in different concentration of HNO{sub 3} solution. The concentration of HNO{sub 3} solution used in this research was 0.05, 0.10, 0.50 and 1M. Optical Microscope (OM), Field Emission Scanning Electron Microscope (FESEM) and Energy Dispersive X-Ray Analysis (EDX) were carried out in order to analysis the ECM behavior based on the growth of dendrite formation after WDT. In general, the results demonstrated that dendrite growth is faster in higher concentration compared with low concentration of HNO{sub 3}. The concentration of HNO{sub 3} solution used has a strong correlation with Mean-Time-To-Failure (MTTF). As the concentration of HNO{sub 3} increases, the MTTF value decreases. Based on the MTTF results the solder alloy in 1M HNO{sub 3} solution is most susceptible to ECM. SnO{sub 2} forms as a corrosion by-product in the samples proved by EDX analysis. The solder alloy poses a high reliability risk in microelectronic devices during operation in 1M HNO{sub 3} solution.

  10. Integration of gene-based markers in a pearl millet genetic map for identification of candidate genes underlying drought tolerance quantitative trait loci

    Directory of Open Access Journals (Sweden)

    Sehgal Deepmala

    2012-01-01

    Full Text Available Abstract Background Identification of genes underlying drought tolerance (DT quantitative trait loci (QTLs will facilitate understanding of molecular mechanisms of drought tolerance, and also will accelerate genetic improvement of pearl millet through marker-assisted selection. We report a map based on genes with assigned functional roles in plant adaptation to drought and other abiotic stresses and demonstrate its use in identifying candidate genes underlying a major DT-QTL. Results Seventy five single nucleotide polymorphism (SNP and conserved intron spanning primer (CISP markers were developed from available expressed sequence tags (ESTs using four genotypes, H 77/833-2, PRLT 2/89-33, ICMR 01029 and ICMR 01004, representing parents of two mapping populations. A total of 228 SNPs were obtained from 30.5 kb sequenced region resulting in a SNP frequency of 1/134 bp. The positions of major pearl millet linkage group (LG 2 DT-QTLs (reported from crosses H 77/833-2 × PRLT 2/89-33 and 841B × 863B were added to the present consensus function map which identified 18 genes, coding for PSI reaction center subunit III, PHYC, actin, alanine glyoxylate aminotransferase, uridylate kinase, acyl-CoA oxidase, dipeptidyl peptidase IV, MADS-box, serine/threonine protein kinase, ubiquitin conjugating enzyme, zinc finger C- × 8-C × 5-C × 3-H type, Hd3, acetyl CoA carboxylase, chlorophyll a/b binding protein, photolyase, protein phosphatase1 regulatory subunit SDS22 and two hypothetical proteins, co-mapping in this DT-QTL interval. Many of these candidate genes were found to have significant association with QTLs of grain yield, flowering time and leaf rolling under drought stress conditions. Conclusions We have exploited available pearl millet EST sequences to generate a mapped resource of seventy five new gene-based markers for pearl millet and demonstrated its use in identifying candidate genes underlying a major DT-QTL in this species. The reported gene-based

  11. Stochastic Dynamics of the Multi-State Voter Model over a Network based on Interacting Cliques and Zealot Candidates

    CERN Document Server

    Palombi, Filippo

    2013-01-01

    The stochastic dynamics of the multi-state voter model is investigated on a class of complex networks made of non-overlapping cliques, each hosting a political candidate and interacting with the others via Erd\\H{o}s-R\\'enyi links. Numerical simulations of the model are interpreted in terms of an ad-hoc mean field theory, specifically tuned to resolve the inter/intra-clique interactions. Under a proper definition of the thermodynamic limit (with the average degree of the agents kept fixed while increasing the network size), the model is found to display the empirical scaling discovered by Fortunato and Castellano (2007) [1] and the vote distribution resembles qualitatively that observed in Brazilian elections.

  12. Stochastic Dynamics of the Multi-State Voter Model Over a Network Based on Interacting Cliques and Zealot Candidates

    Science.gov (United States)

    Palombi, Filippo; Toti, Simona

    2014-07-01

    The stochastic dynamics of the multi-state voter model is investigated on a class of complex networks made of non-overlapping cliques, each hosting a political candidate and interacting with the others via Erdős-Rényi links. Numerical simulations of the model are interpreted in terms of an ad-hoc mean field theory, specifically tuned to resolve the inter/intra-clique interactions. Under a proper definition of the thermodynamic limit (with the average degree of the agents kept fixed while increasing the network size), the model is found to display the empirical scaling discovered by Fortunato and Castellano (Phys Rev Lett 99(13):138701, 2007) , while the vote distribution resembles roughly that observed in Brazilian elections.

  13. Dominant effects of Sn orientation on serrated cathode dissolution and resulting failure in actual solder joints under electromigration

    Energy Technology Data Exchange (ETDEWEB)

    Yang, T.L.; Yu, J.J.; Li, C.C.; Lin, Y.F.; Kao, C.R., E-mail: crkao@ntu.edu.tw

    2015-04-05

    Highlights: • Excessive serrated cathode dissolution strongly depends on the Sn grain orientation. • Sn grain orientation is a dominant factor that controls the direction of the serrated teeth. • Producing joints with fine Sn grains is one of the approaches to improve the reliability against current-induced failures in solder joints. - Abstract: Excessive metal dissolution is one of the major electromigration-induced degradation mechanisms in interconnects, and it often produces a distinctive serrated cathode interface with most of the serrated teeth inclined toward a specific direction. In this study, actual flip-chip solder joints were systematically analyzed to understand this highly interesting morphology. It was unequivocally established that the Sn grain orientation is a dominant factor that controls the direction of the serrated teeth. When the c-axis of a Sn grain was nearly parallel to the electron flow direction, serrated dissolution occurred, with the serrated teeth inclined toward the c-axis. These observations were rationalized based on the diffusion anisotropy of Cu in Sn.

  14. 基于Android系统的考生身份认证系统%Candidates identification system based on Android system

    Institute of Scientific and Technical Information of China (English)

    高嵩

    2012-01-01

      随着3G网络的发展,为了更快捷方便地认证考生身份,笔者基于开源的Android平台开发了一套考生身份认证系统。本文对系统结构进行了分析,阐述了客户端与服务器端的连接方式以及整个查询认证的执行过程,实现了通过手机辅助认证考生身份。%  With the development of 3G networks,I developed a set of candidates identification system based on open source Android system, for verifying the identity of candidates quickly. In this paper, the system structure is analyzed, described the connection of the client and server and Implementation of the certification process of the inquiries. The identity of the secondary certification candidates by phone.

  15. Predicted Coverage and Immuno-Safety of a Recombinant C-Repeat Region Based Streptococcus pyogenes Vaccine Candidate.

    Science.gov (United States)

    McNeilly, Celia; Cosh, Samantha; Vu, Therese; Nichols, Jemma; Henningham, Anna; Hofmann, Andreas; Fane, Anne; Smeesters, Pierre R; Rush, Catherine M; Hafner, Louise M; Ketheesan, Natkuman; Sriprakash, Kadaba S; McMillan, David J

    2016-01-01

    The C-terminal region of the M-protein of Streptococcus pyogenes is a major target for vaccine development. The major feature is the C-repeat region, consisting of 35-42 amino acid repeat units that display high but not perfect identity. SV1 is a S. pyogenes vaccine candidate that incorporates five 14mer amino acid sequences (called J14i variants) from differing C-repeat units in a single recombinant construct. Here we show that the J14i variants chosen for inclusion in SV1 are the most common variants in a dataset of 176 unique M-proteins. Murine antibodies raised against SV1 were shown to bind to each of the J14i variants present in SV1, as well as variants not present in the vaccine. Antibodies raised to the individual J14i variants were also shown to bind to multiple but different combinations of J14i variants, supporting the underlying rationale for the design of SV1. A Lewis Rat Model of valvulitis was then used to assess the capacity of SV1 to induce deleterious immune response associated with rheumatic heart disease. In this model, both SV1 and the M5 positive control protein were immunogenic. Neither of these antibodies were cross-reactive with cardiac myosin or collagen. Splenic T cells from SV1/CFA and SV1/alum immunized rats did not proliferate in response to cardiac myosin or collagen. Subsequent histological examination of heart tissue showed that 4 of 5 mice from the M5/CFA group had valvulitis and inflammatory cell infiltration into valvular tissue, whereas mice immunised with SV1/CFA, SV1/alum showed no sign of valvulitis. These results suggest that SV1 is a safe vaccine candidate that will elicit antibodies that recognise the vast majority of circulating GAS M-types. PMID:27310707

  16. Effects of Aging Treatment on Mechanical Properties of Sn-58Bi Epoxy Solder on ENEPIG-Surface-Finished PCB

    Science.gov (United States)

    Kim, Jungsoo; Myung, Woo-Ram; Jung, Seung-Boo

    2016-11-01

    The mechanical properties of Sn-58Bi epoxy solder were evaluated by low-speed shear testing as functions of aging time and temperature. To determine the effects of epoxy, the interfacial reaction and mechanical properties of both Sn-58Bi and Sn-58Bi epoxy solder were investigated after aging treatment. The chemical composition and growth kinetics of the intermetallic compound (IMC) formed at the interface between Sn-58Bi solder and electroless nickel electroless palladium immersion gold (ENEPIG) surface finish were analyzed. Sn-58Bi solder paste was applied by stencil-printing on flame retardant-4 substrate, then reflowed. Reflowed samples were aged at 85°C, 95°C, 105°C, and 115°C for up to 1000 h. (Ni,Pd)3Sn4 IMC formed between Sn-58Bi solder and ENEPIG surface finish after reflow. Ni3Sn4 and Ni3P IMCs formed at the interface between (Ni,Pd)3Sn4 IMC and ENEPIG surface finish after aging at 115°C for 300 h. The overall IMC growth rate of Sn-58Bi solder joint was higher than that of Sn-58Bi epoxy solder joint during aging. The shear strength of Sn-58Bi epoxy solder was about 2.4 times higher than that of Sn-58Bi solder due to the blocking effect of epoxy, and the shear strength decreased with increasing aging time.

  17. Laser solder repair technique for nerve anastomosis: temperatures required for optimal tensile strength

    Science.gov (United States)

    McNally-Heintzelman, Karen M.; Dawes, Judith M.; Lauto, Antonio; Parker, Anthony E.; Owen, Earl R.; Piper, James A.

    1998-01-01

    Laser-assisted repair of nerves is often unsatisfactory and has a high failure rate. Two disadvantages of laser assisted procedures are low initial strength of the resulting anastomosis and thermal damage of tissue by laser heating. Temporary or permanent stay sutures are used and fluid solders have been proposed to increase the strength of the repair. These techniques, however, have their own disadvantages including foreign body reaction and difficulty of application. To address these problems solid protein solder strips have been developed for use in conjunction with a diode laser for nerve anastomosis. The protein helps to supplement the bond, especially in the acute healing phase up to five days post- operative. Indocyanine green dye is added to the protein solder to absorb a laser wavelength (approximately 800 nm) that is poorly absorbed by water and other bodily tissues. This reduces the collateral thermal damage typically associated with other laser techniques. An investigation of the feasibility of the laser-solder repair technique in terms of required laser irradiance, tensile strength of the repair, and solder and tissue temperature is reported here. The tensile strength of repaired nerves rose steadily with laser irradiance reaching a maximum of 105 plus or minus 10 N.cm-2 at 12.7 W.cm-2. When higher laser irradiances were used the tensile strength of the resulting bonds dropped. Histopathological analysis of the laser- soldered nerves, conducted immediately after surgery, showed the solder to have adhered well to the perineurial membrane, with minimal damage to the inner axons of the nerve. The maximum temperature reached at the solder surface and at the solder/nerve interface, measured using a non-contact fiber optic radiometer and thermocouple respectively, also rose steadily with laser irradiance. At 12.7 W.cm-2, the temperatures reached at the surface and at the interface were 85 plus or minus 4 and 68 plus or minus 4 degrees Celsius respectively

  18. Evaluating the Impact of Dwell Time on Solder Interconnect Durability Under Bending Loads

    Science.gov (United States)

    Menon, Sandeep; Osterman, Michael; Pecht, Michael

    2015-11-01

    With the increasing portability and miniaturization of modern-day electronics, the mechanical robustness of these systems has become more of a concern. Existing standards for conducting mechanical durability tests of electronic assemblies include bend, shock/drop, vibration, and torsion. Although these standards provide insights into both cyclic fatigue and overstress damage incurred in solder interconnects (widely regarded as the primary mode of failure in electronic assemblies), they fail to address the impact of time- dependent (creep) behavior due to sustained mechanical loads on solder interconnect durability. It has been seen in previous studies that solder durability under thermal cycling loads is inversely proportional to the dwell time or hold time at either temperature extreme of the imposed temperature cycle. Fatigue life models, which include dwell time, have been developed for solder interconnects subject to temperature cycling. However, the fatigue life models that have been developed in the literature for solder interconnects under mechanical loads fail to address the influence of the duration of loading. In this study, solder interconnect test vehicles were subjected to cyclic mechanical bending with various dwell times in order to understand the impact of the duration of mechanical loads on solder interconnect durability. The solder interconnects examined in this study were formed with 2512 resistor packages using various solder compositions [tin-lead (Sn-Pb) and 96.5Sn-3Ag-0.5Cu (SAC305)]. To evaluate the impact of dwell time, the boards were tested with 0 s, 60 s, and 300 s of dwell time at both extremes of the loading profile. It was observed that an increase in the dwell time of the loading profile resulted in a decrease in the characteristic life of the solder interconnects. The decrease in fatigue life was attributed to increased creep damage as identified using finite-element simulations. An energy partitioning approach was then used to

  19. Identification of candidate categories of the International Classification of Functioning Disability and Health (ICF for a Generic ICF Core Set based on regression modelling

    Directory of Open Access Journals (Sweden)

    Üstün Bedirhan T

    2006-07-01

    Full Text Available Abstract Background The International Classification of Functioning, Disability and Health (ICF is the framework developed by WHO to describe functioning and disability at both the individual and population levels. While condition-specific ICF Core Sets are useful, a Generic ICF Core Set is needed to describe and compare problems in functioning across health conditions. Methods The aims of the multi-centre, cross-sectional study presented here were: a to propose a method to select ICF categories when a large amount of ICF-based data have to be handled, and b to identify candidate ICF categories for a Generic ICF Core Set by examining their explanatory power in relation to item one of the SF-36. The data were collected from 1039 patients using the ICF checklist, the SF-36 and a Comorbidity Questionnaire. ICF categories to be entered in an initial regression model were selected following systematic steps in accordance with the ICF structure. Based on an initial regression model, additional models were designed by systematically substituting the ICF categories included in it with ICF categories with which they were highly correlated. Results Fourteen different regression models were performed. The variance the performed models account for ranged from 22.27% to 24.0%. The ICF category that explained the highest amount of variance in all the models was sensation of pain. In total, thirteen candidate ICF categories for a Generic ICF Core Set were proposed. Conclusion The selection strategy based on the ICF structure and the examination of the best possible alternative models does not provide a final answer about which ICF categories must be considered, but leads to a selection of suitable candidates which needs further consideration and comparison with the results of other selection strategies in developing a Generic ICF Core Set.

  20. Intermetallic compound formation at Sn-3.0Ag-0.5Cu-1.0Zn lead-free solder alloy/Cu interface during as-soldered and as-aged conditions

    Energy Technology Data Exchange (ETDEWEB)

    Wang, Feng-Jiang [Department of Materials Science and Engineering, Shanghai University of Engineering Science, Shanghai 201620 (China)]. E-mail: wangfjy@yahoo.com.cn; Yu, Zhi-Shui [Department of Materials Science and Engineering, Shanghai University of Engineering Science, Shanghai 201620 (China); Qi, Kai [Department of Materials Science and Engineering, Shanghai University of Engineering Science, Shanghai 201620 (China)

    2007-07-12

    Intermetallic formations of Sn-3.0Ag-0.5Cu solder alloy with additional 1.0 wt% Zn were investigated for Cu-substrate during soldering and isothermal aging. During soldering condition, the Cu{sub 5}Zn{sub 8} compound with granular-type morphology is the interfacial IMC for Sn-3.0Ag-0.5Cu-1.0Zn solder, while the Cu{sub 6}Sn{sub 5} compound with scallop-type morphology is the interfacial IMC for Sn-3.0Ag-0.5Cu solder. During thermal aging, the final interfacial structure for Sn-3.0Ag-0.5Cu-1.0Zn solder is solder/Cu{sub 5}Zn{sub 8}/Cu{sub 6}Sn{sub 5}/Cu{sub 3}Sn/Cu, different from the solder/Cu{sub 6}Sn{sub 5}/Cu{sub 3}Sn/Cu for Sn-3.0Ag-0.5Cu solder. The thickness of Cu-Sn IMC layers increases, while the thickness of Cu{sub 5}Zn{sub 8} compound layer decreases with increasing aging time due to the decomposition of the Cu{sub 5}Zn{sub 8} layer by the diffusion of Cu and Zn atoms into the solder and Cu{sub 6}Sn{sub 5} at higher aging temperature. For Sn-3.0Ag-0.5Cu-1.0Zn solder, at higher aging temperature of 150 or 175 {sup o}C, with the formation of Cu{sub 3}Sn at Cu{sub 6}Sn{sub 5}/Cu, Kirkendall voids can be observed at the interface of Cu{sub 3}Sn/Cu.

  1. Effect of diode-laser parameters on shear force of micro-joints soldered with Sn-Ag-Cu lead-free solder on Au/Ni/Cu pad

    Institute of Scientific and Technical Information of China (English)

    WANG Jian-xin; XUE Song-bai; FANG Dian-song; JU Jin-long; HAN Zong-jie; YAO Li-hua

    2006-01-01

    Soldering experiments with Sn-3.5Ag-0.5Cu lead-free solder on Au/Ni/Cu pad were carried out by means of diode-laser and IR reflow soldering methods respectively. The influence of different heating methods as well as output power of diode-laser on shear force of micro-joints was studied and the relationship between the shear force and microstructures of micro-joints was analyzed.The results indicate that the formation of intermetallic compound Ag3Sn is the key factor to affect the shear force and the fine eutectic network structures of micro-joints as well as the dispersion morphology of fine compound Ag3Sn, in which eutectic network band is responsible for the improvement of the shear force of micro-joints soldered with Sn-Ag-Cu lead-free solder. With the increases of output power of diode-laser, the shear force and the microstructures change obviously. The eutectic network structures of micro-joints soldered with diode-laser soldering method are more homogeneous and the grains of Ag3Sn compounds are finer in the range of near optimal output power than those soldered with IR reflow soldering method, so the shear force is also higher than that using IR reflow soldering method. When the output power value of diode-laser is about 41.0 W, the shear force exhibits the highest value that is 70% higher than that using IR reflow soldering method.

  2. EFFECTS OF LEAD WIDTHS AND PITCHES ON RELIABILITY OF QUAD FLAT PACKAGE (QFP) SOLDERED JOINTS

    Institute of Scientific and Technical Information of China (English)

    XUE Songbai; WU Yuxiu; HAN Zongjie; WANG Jianxin

    2007-01-01

    The finite element method(FEM) is used to analyze the effects of lead widths and pitches on reliability of soldered joints. The optimum Simulation for QFP devices is also researched. The results indicate that when the lead pitches are the same, the maximum equivalent stress of the soldered joints increases with the increasing of lead widths, while the reliability of the soldered joints reduces. When the lead widths are the same, the maximum equivalent stress of the soldered joints doesn't decrease completely with the increasing of lead pitches, a minimum value of the maximum equivalent stress values exists in all the curves. Under this condition the maximum equivalent stress of the soldered joints is relatively the least, the reliability of soldered joints is high and the assembly is excellent. The simulating results indicate the best parameter: The lead width is 0.2 mm and lead pitch is 0.3 mm (the distance between two leads is 0.1 mm), which are benefited for the micromation of QFP devices now. The minimum value of the maximum equivalent stress of soldered joints exists while lead width is 0.25 mm and lead pitch is 0.35 mm (the distance between two leads is 0.1 mm), the devices can serve for a long time and the reliability is the highest, the assembly is excellent. The simulating results also indicate the fact that the lead width is 0.15 mm and lead pitch is 0.2 mm maybe the limit of QFP, which is significant for the high lead count and micromation of assembly.

  3. The critical oxide thickness for Pb-free reflow soldering on Cu substrate

    Energy Technology Data Exchange (ETDEWEB)

    Chung, C. Key [Department of Materials Science and Engineering, National Taiwan University, No. 1, Sec. 4, Roosevelt Road, Taipei, 10617, Taiwan (China); Assembly Test Global Materials, Intel Microelectronics Asia Ltd, B1, No. 205, Tun-Hwa North Road, 10595 Taipei, Taiwan (China); Chen, Y.J.; Li, C.C. [Department of Materials Science and Engineering, National Taiwan University, No. 1, Sec. 4, Roosevelt Road, Taipei, 10617, Taiwan (China); Kao, C.R., E-mail: crkao@ntu.edu.tw [Department of Materials Science and Engineering, National Taiwan University, No. 1, Sec. 4, Roosevelt Road, Taipei, 10617, Taiwan (China)

    2012-06-01

    Oxidation is an undesirable effect of reflow soldering. Non-wetting occurs when the oxide layer grows above the critical thickness. Characterizing the critical oxide thickness for soldering is challenging due to oxide's nano-scale thickness and irregular topographic surface. In this paper, the critical copper oxide thickness was characterized by Time-of-Flight Secondary Ion Mass Spectrometry, Scanning Electron Microscopy, Energy-Dispersive X-ray spectroscopy, and Transmission Electron Microscopy. Copper substrates were coated with an Organic-Solderable-Preservative (OSP) layer and baked at 150 Degree-Sign C and 85% Relative Humidity for different amounts of time. The onset of the non-wetting phenomenon occurred when the oxide thickness reached 18 {+-} 5 nm. As the oxide grew beyond this critical thickness, the percentage of non-wetting solder joint increased exponentially. The growth of the oxide thickness followed a parabolic rate law. The rate constant of oxidation was 0.6 Multiplication-Sign 10{sup -15} cm{sup 2} min{sup -1}. Oxidation resulted from interdiffusion of copper and oxygen atoms through the OSP and oxide layers. The oxidation mechanism will be presented and discussed. - Highlights: Black-Right-Pointing-Pointer Critical oxide thickness for Pb free solder on Cu substrate is 18 {+-} 5 nm. Black-Right-Pointing-Pointer Above the critical oxide, non-wet solder joint increases exponentially. Black-Right-Pointing-Pointer A maximum 13-nm oxide thickness is suggested for good solder joint. Black-Right-Pointing-Pointer Initial growth of oxide thickness is logarithmic and then parabolic after 12 nm. Black-Right-Pointing-Pointer Thick oxide (360-560 nm) is formed as pores shorten the oxidation path.

  4. Bonding Low-density Nanoporous Metal Foams Using Sputtered Solder

    Energy Technology Data Exchange (ETDEWEB)

    Bono, M; Cervantes, O; Akaba, C; Hamza, A; Foreman, R; Teslich, N

    2007-08-21

    A method has been developed for bonding low-density nanoporous metal foam components to a substrate using solder that is sputtered onto the surfaces. Metal foams have unusual properties that make them excellent choices for many applications, and as technologies for processing these materials are evolving, their use in industry is increasing dramatically. Metal foams are lightweight and have advantageous dynamic properties, which make them excellent choices for many structural applications. They also provide good acoustic damping, low thermal conductivity, and excellent energy absorption characteristics. Therefore, these materials are commonly used in the automotive, aerospace, construction, and biomedical industries. The synthesis of nanoporous metal foams with a cell size of less then 1 {micro}m is an emerging technology that is expected to lead to widespread application of metal foams in microdevices, such as sensors and actuators. One of the challenges to manufacturing components from metal foams is that they can be difficult to attach to other structures without degrading their properties. For example, traditional liquid adhesives cannot be used because they are absorbed into foams. The problem of bonding or joining can be particularly difficult for small-scale devices made from nanoporous foam, due to the requirement for a thin bond layer. The current study addresses this problem and develops a method of soldering a nanoporous metal foam to a substrate with a bond thickness of less than 2 {micro}m. There are many applications that require micro-scale metal foams precisely bonded to substrates. This study was motivated by a physics experiment that used a laser to drive a shock wave through an aluminum foil and into a copper foam, in order to determine the speed of the shock in the copper foam. To avoid disturbing the shock, the interface between the copper foam and the aluminum substrate had to be as thin as possible. There are many other applications that

  5. GC-MS Based Plasma Metabolomics for Identification of Candidate Biomarkers for Hepatocellular Carcinoma in Egyptian Cohort.

    Directory of Open Access Journals (Sweden)

    Mohammad R Nezami Ranjbar

    Full Text Available This study evaluates changes in metabolite levels in hepatocellular carcinoma (HCC cases vs. patients with liver cirrhosis by analysis of human blood plasma using gas chromatography coupled with mass spectrometry (GC-MS. Untargeted metabolomic analysis of plasma samples from participants recruited in Egypt was performed using two GC-MS platforms: a GC coupled to single quadruple mass spectrometer (GC-qMS and a GC coupled to a time-of-flight mass spectrometer (GC-TOFMS. Analytes that showed statistically significant changes in ion intensities were selected using ANOVA models. These analytes and other candidates selected from related studies were further evaluated by targeted analysis in plasma samples from the same participants as in the untargeted metabolomic analysis. The targeted analysis was performed using the GC-qMS in selected ion monitoring (SIM mode. The method confirmed significant changes in the levels of glutamic acid, citric acid, lactic acid, valine, isoleucine, leucine, alpha tocopherol, cholesterol, and sorbose in HCC cases vs. patients with liver cirrhosis. Specifically, our findings indicate up-regulation of metabolites involved in branched-chain amino acid (BCAA metabolism. Although BCAAs are increasingly used as a treatment for cancer cachexia, others have shown that BCAA supplementation caused significant enhancement of tumor growth via activation of mTOR/AKT pathway, which is consistent with our results that BCAAs are up-regulated in HCC.

  6. Systematic exploration of a class of hydrophobic unnatural base pairs yields multiple new candidates for the expansion of the genetic alphabet.

    Science.gov (United States)

    Dhami, Kirandeep; Malyshev, Denis A; Ordoukhanian, Phillip; Kubelka, Tomáš; Hocek, Michal; Romesberg, Floyd E

    2014-01-01

    We have developed a family of unnatural base pairs (UBPs), which rely on hydrophobic and packing interactions for pairing and which are well replicated and transcribed. While the pair formed between d5SICS and dNaM (d5SICS-dNaM) has received the most attention, and has been used to expand the genetic alphabet of a living organism, recent efforts have identified dTPT3-dNaM, which is replicated with even higher fidelity. These efforts also resulted in more UBPs than could be independently analyzed, and thus we now report a PCR-based screen to identify the most promising. While we found that dTPT3-dNaM is generally the most promising UBP, we identified several others that are replicated nearly as well and significantly better than d5SICS-dNaM, and are thus viable candidates for the expansion of the genetic alphabet of a living organism. Moreover, the results suggest that continued optimization should be possible, and that the putatively essential hydrogen-bond acceptor at the position ortho to the glycosidic linkage may not be required. These results clearly demonstrate the generality of hydrophobic forces for the control of base pairing within DNA, provide a wealth of new structure-activity relationship data and importantly identify multiple new candidates for in vivo evaluation and further optimization.

  7. Effect Mechanism of Rare Earth on the Microstructures of SnAgCu Solder Joints%稀土元素对SnAgCu焊点内部组织的影响机制

    Institute of Scientific and Technical Information of China (English)

    张亮; 韩继光; 郭永环; 何成文; 袁建民

    2012-01-01

    Due to the enhancement of environmental protection in our world, the research on lead-free solders has become the important role in electronic industry, the addition of rare earth can improve the properties of lead-free solders, based on the soldering testing of lead-free solders bearing rare earth Ce, the scanning electron microscope and energy dispersive X-ray spectroscopy technology are used to investigate the effect mechanism of rare earth Ce on the microstructure of SnAgCu solder joints systematically. The results indicated that CeSn3 with different morphologies appear in the solder matrix. The chemical affinity is utilized to describe the correlation between Ce and Sn, Ag, Cu elements, it can be demonstrated that the rare earth Ce had higher affinity for Sn in the SnAgCu system in theoretically. The adsorption effect of rare earth is investigated based on ULF principle, it can be used to explain the intermetallic compounds(IMCs) refinement of SnAgCu solder joints bearing rare earth Ce. With the microstructure analysis of SnAgCuCe solder joints, it is found that the order of IMCs particles sizes is CeSn3>Cu6Sn5>Ag3Sn, in the theory, it is confirmed that the Ag3Sn particles plays an important role in the strengthen of SnAgCu solder joints, which can provide the theory support for the research of lead-free solders.%随着人们环保意识的逐渐增强,新型无铅钎料的研究成为电子工业中的研究热点,而稀土元素的添加可以显著改善钎料的性能,基于含稀土Ce无铅钎料的钎焊试验,采用扫描电镜和能谱仪研究稀土元素Ce对SnAgCu焊点内部组织的影响机制.结果表明,稀土元素在SnAgCu焊点内部以CeSn3的形式存在,且稀土相形态各异.采用化学亲和力来表征稀土元素Ce与Sn、Ag、Cu之间的内在联系,从理论上证明Ce的“亲Sn性”.采用乌尔夫原理研究稀土元素的吸附现象,解释稀土元素Ce对SnAgCu焊点内部金属间化合物的细化作用.由SnAgCuCe焊

  8. Candidate Gene Identification with SNP Marker-Based Fine Mapping of Anthracnose Resistance Gene Co-4 in Common Bean.

    Directory of Open Access Journals (Sweden)

    Andrew J Burt

    Full Text Available Anthracnose, caused by Colletotrichum lindemuthianum, is an important fungal disease of common bean (Phaseolus vulgaris. Alleles at the Co-4 locus confer resistance to a number of races of C. lindemuthianum. A population of 94 F4:5 recombinant inbred lines of a cross between resistant black bean genotype B09197 and susceptible navy bean cultivar Nautica was used to identify markers associated with resistance in bean chromosome 8 (Pv08 where Co-4 is localized. Three SCAR markers with known linkage to Co-4 and a panel of single nucleotide markers were used for genotyping. A refined physical region on Pv08 with significant association with anthracnose resistance identified by markers was used in BLAST searches with the genomic sequence of common bean accession G19833. Thirty two unique annotated candidate genes were identified that spanned a physical region of 936.46 kb. A majority of the annotated genes identified had functional similarity to leucine rich repeats/receptor like kinase domains. Three annotated genes had similarity to 1, 3-β-glucanase domains. There were sequence similarities between some of the annotated genes found in the study and the genes associated with phosphoinositide-specific phosphilipases C associated with Co-x and the COK-4 loci found in previous studies. It is possible that the Co-4 locus is structured as a group of genes with functional domains dominated by protein tyrosine kinase along with leucine rich repeats/nucleotide binding site, phosphilipases C as well as β-glucanases.

  9. Candidate Gene Identification with SNP Marker-Based Fine Mapping of Anthracnose Resistance Gene Co-4 in Common Bean

    Science.gov (United States)

    Burt, Andrew J.; William, H. Manilal; Perry, Gregory; Khanal, Raja; Pauls, K. Peter; Kelly, James D.; Navabi, Alireza

    2015-01-01

    Anthracnose, caused by Colletotrichum lindemuthianum, is an important fungal disease of common bean (Phaseolus vulgaris). Alleles at the Co–4 locus confer resistance to a number of races of C. lindemuthianum. A population of 94 F4:5 recombinant inbred lines of a cross between resistant black bean genotype B09197 and susceptible navy bean cultivar Nautica was used to identify markers associated with resistance in bean chromosome 8 (Pv08) where Co–4 is localized. Three SCAR markers with known linkage to Co–4 and a panel of single nucleotide markers were used for genotyping. A refined physical region on Pv08 with significant association with anthracnose resistance identified by markers was used in BLAST searches with the genomic sequence of common bean accession G19833. Thirty two unique annotated candidate genes were identified that spanned a physical region of 936.46 kb. A majority of the annotated genes identified had functional similarity to leucine rich repeats/receptor like kinase domains. Three annotated genes had similarity to 1, 3-β-glucanase domains. There were sequence similarities between some of the annotated genes found in the study and the genes associated with phosphoinositide-specific phosphilipases C associated with Co-x and the COK–4 loci found in previous studies. It is possible that the Co–4 locus is structured as a group of genes with functional domains dominated by protein tyrosine kinase along with leucine rich repeats/nucleotide binding site, phosphilipases C as well as β-glucanases. PMID:26431031

  10. Mechanical Shock Behavior of Environmentally-Benign Lead-free Solders

    Science.gov (United States)

    Yazzie, Kyle

    The mechanical behavior of Pb-free solder alloys is important, since they must maintain mechanical integrity under thermomechanical fatigue, creep, and mechanical shock conditions. Mechanical shock, in particular, has become an increasing concern in the electronics industry, since electronic packages can be subjected to mechanical shock by mishandling during manufacture or by accidental dropping. In this study, the mechanical shock behavior of Sn and Sn-Ag-Cu alloys was systematically analyzed over the strain rate range 10-3 -- 30 s-1 in bulk samples, and over 10-3 -- 12 s-1 on the single solder joint level. More importantly, the influences of solder microstructure and intermetallic compounds (IMC) on mechanical shock resistance were quantified. A thorough microstructural characterization of Sn-rich alloys was conducted using synchrotron x-ray computed tomography. The three-dimensional morphology and distribution of contiguous phases and precipitates was analyzed. A multiscale approach was utilized to characterize Sn-rich phases on the microscale with x-ray tomography and focused ion beam tomography to characterize nanoscale precipitates. A high strain rate servohydraulic test system was developed in conjunction with a modified tensile specimen geometry and a high speed camera for quantifying deformation. The effect of microstructure and applied strain rate on the local strain and strain rate distributions were quantified using digital image correlation. Necking behavior was analyzed using a novel mirror fixture, and the triaxial stresses associated with necking were corrected using a self-consistent method to obtain the true stress-true strain constitutive behavior. Fracture mechanisms were quantified as a function of strain rate. Finally, the relationship between solder microstructure and intermetallic compound layer thickness with the mechanical shock resistance of Sn-3.8Ag-0.7Cu solder joints was characterized. It was found that at low strain rates the dynamic

  11. Electrical Resistance of the Solder Connections for the Consolidation of the LHC Main Interconnection Splices

    CERN Document Server

    Lutum, R; Scheuerlein, C

    2013-01-01

    For the consolidation of the LHC 13 kA main interconnection splices, shunts will be soldered onto each of the 10170 splices. The solder alloy selected for this purpose is Sn60Pb40. In this context the electrical resistance of shunt to busbar lap splices has been measured in the temperature range from RT to 20 K. A cryocooler set-up has been adapted such that a test current of 150 A could be injected for accurate resistance measurements in the low nΩ range. To study the influence of the solder bulk resistivity on the overall splice resistance, connections produced with Sn96Ag4 and Sn77.2In20Ag2.8 have been studied as well. The influence of the Sn60Pb40 solder resistance is negligible when measuring the splice resistance in a longitudinal configuration over a length of 6 cm. In a transverse measurement configuration the splice resistance is significantly influenced by the solder. The connections prepared with Sn77.2In20Ag2.8 show significantly higher resistance values, as expected from the relatively high sol...

  12. Effect of Plasma Surface Finish on Wettability and Mechanical Properties of SAC305 Solder Joints

    Science.gov (United States)

    Kim, Kyoung-Ho; Koike, Junichi; Yoon, Jeong-Won; Yoo, Sehoon

    2016-09-01

    The wetting behavior, interfacial reactions, and mechanical reliability of Sn-Ag-Cu solder on a plasma-coated printed circuit board (PCB) substrate were evaluated under multiple heat-treatments. Conventional organic solderability preservative (OSP) finished PCBs were used as a reference. The plasma process created a dense and highly cross-linked polymer coating on the Cu substrates. The plasma finished samples had higher wetting forces and shorter zero-cross times than those with OSP surface finish. The OSP sample was degraded after sequential multiple heat treatments and reflow processes, whereas the solderability of the plasma finished sample was retained after multiple heat treatments. After the soldering process, similar microstructures were observed at the interfaces of the two solder joints, where the development of intermetallic compounds was observed. From ball shear tests, it was found that the shear force for the plasma substrate was consistently higher than that for the OSP substrate. Deterioration of the OSP surface finish was observed after multiple heat treatments. Overall, the plasma surface finish was superior to the conventional OSP finish with respect to wettability and joint reliability, indicating that it is a suitable material for the fabrication of complex electronic devices.

  13. 高速动车联轴器鼓形齿动力学特性分析和研究%Fabrication of Precise Solder Balls by Pneumatic-diaphragm Droplet Jetting Method

    Institute of Scientific and Technical Information of China (English)

    方喜峰; 石明友; 景睿; 张胜文; 王召景

    2012-01-01

    鼓形齿联轴器是动车驱动装置的关键部件之一.为了提高我国高速动车鼓形齿联轴器的设计和制造水平,实现国产化,研究了鼓形齿动力学特性.导出了自由振动方程及固有频率方程.建立了联轴器鼓形齿的有限元模型.对几种不同鼓形量的鼓形齿进行了结构动力学和强度分析,得到了联轴器鼓形齿的动态特性和接触应力.最后制造了样机,进行了模态试验,验证了理论分析的正确性.%Aimed at high uniform ultra-small solder balls requirement in area array package,a newel fabrication method was developed based on pneumatic-diaphragm droplet jetting.The principle and self-developed equipment of this method were introduced in this paper.Solder balls with diameter less than 100|xm were fabricated with a stainless steel nozzle of 50μm in diameter.Meanwhile main control parameters were studied to investigate their effects on the diameter of solder balls.The results prove that pneumatic-diaphragm droplet jetting method can fabricate solder balls with highly uniform diameter less than l00μn, good exterior quality and roundness ,which fills up the blank of domestic solder ball fabricating technology.

  14. Chemical wiring and soldering toward all-molecule electronic circuitry.

    Science.gov (United States)

    Okawa, Yuji; Mandal, Swapan K; Hu, Chunping; Tateyama, Yoshitaka; Goedecker, Stefan; Tsukamoto, Shigeru; Hasegawa, Tsuyoshi; Gimzewski, James K; Aono, Masakazu

    2011-06-01

    Key to single-molecule electronics is connecting functional molecules to each other using conductive nanowires. This involves two issues: how to create conductive nanowires at designated positions, and how to ensure chemical bonding between the nanowires and functional molecules. Here, we present a novel method that solves both issues. Relevant functional molecules are placed on a self-assembled monolayer of diacetylene compound. A probe tip of a scanning tunneling microscope is then positioned on the molecular row of the diacetylene compound to which the functional molecule is adsorbed, and a conductive polydiacetylene nanowire is fabricated by initiating chain polymerization by stimulation with the tip. Since the front edge of chain polymerization necessarily has a reactive chemical species, the created polymer nanowire forms chemical bonding with an encountered molecular element. We name this spontaneous reaction "chemical soldering". First-principles theoretical calculations are used to investigate the structures and electronic properties of the connection. We demonstrate that two conductive polymer nanowires are connected to a single phthalocyanine molecule. A resonant tunneling diode formed by this method is discussed. PMID:21548552

  15. Serum-free microcarrier based production of replication deficient Influenza vaccine candidate virus lacking NS1 using Vero cells

    Directory of Open Access Journals (Sweden)

    Yan Mylene L

    2011-08-01

    Full Text Available Abstract Background Influenza virus is a major health concern that has huge impacts on the human society, and vaccination remains as one of the most effective ways to mitigate this disease. Comparing the two types of commercially available Influenza vaccine, the live attenuated virus vaccine is more cross-reactive and easier to administer than the traditional inactivated vaccines. One promising live attenuated Influenza vaccine that has completed Phase I clinical trial is deltaFLU, a deletion mutant lacking the viral Nonstructural Protein 1 (NS1 gene. As a consequence of this gene deletion, this mutant virus can only propagate effectively in cells with a deficient interferon-mediated antiviral response. To demonstrate the manufacturability of this vaccine candidate, a batch bioreactor production process using adherent Vero cells on microcarriers in commercially available animal-component free, serum-free media is described. Results Five commercially available animal-component free, serum-free media (SFM were evaluated for growth of Vero cells in agitated Cytodex 1 spinner flask microcarrier cultures. EX-CELL Vero SFM achieved the highest cell concentration of 2.6 × 10^6 cells/ml, whereas other SFM achieved about 1.2 × 10^6 cells/ml. Time points for infection between the late exponential and stationary phases of cell growth had no significant effect in the final virus titres. A virus yield of 7.6 Log10 TCID50/ml was achieved using trypsin concentration of 10 μg/ml and MOI of 0.001. The Influenza vaccine production process was scaled up to a 3 liter controlled stirred tank bioreactor to achieve a cell density of 2.7 × 10^6 cells/ml and virus titre of 8.3 Log10 TCID50/ml. Finally, the bioreactor system was tested for the production of the corresponding wild type H1N1 Influenza virus, which is conventionally used in the production of inactivated vaccine. High virus titres of up to 10 Log10 TCID50/ml were achieved. Conclusions We describe for the

  16. Selection and validation of potato candidate genes for maturity corrected resistance to Phytophthora infestans based on differential expression combined with SNP association and linkage mapping

    Directory of Open Access Journals (Sweden)

    Meki Shehabu Muktar

    2015-09-01

    Full Text Available Late blight of potato (Solanum tuberosum L. caused by the oomycete Phytophthora infestans (Mont. de Bary, is one of the most important bottlenecks of potato production worldwide. Cultivars with high levels of durable, race unspecific, quantitative resistance are part of a solution to this problem. However, breeding for quantitative resistance is hampered by the correlation between resistance and late plant maturity, which is an undesirable agricultural attribute. The objectives of our research are (i the identification of genes that condition quantitative resistance to P. infestans not compromised by late plant maturity and (ii the discovery of diagnostic single nucleotide polymorphism (SNP markers to be used as molecular tools to increase efficiency and precision of resistance breeding. Twenty two novel candidate genes were selected based on comparative transcript profiling by SuperSAGE (serial analysis of gene expression in groups of plants with contrasting levels of maturity corrected resistance (MCR. Reproducibility of differential expression was tested by quantitative real time PCR and allele specific pyrosequencing in four new sets of genotype pools with contrasting late blight resistance levels, at three infection time points and in three independent infection experiments. Reproducibility of expression patterns ranged from 28% to 97%. Association mapping in a panel of 184 tetraploid cultivars identified SNPs in five candidate genes that were associated with MCR. These SNPs can be used in marker-assisted resistance breeding. Linkage mapping in two half-sib families (n = 111 identified SNPs in three candidate genes that were linked with MCR. The differentially expressed genes that showed association and/or linkage with MCR putatively function in phytosterol synthesis, fatty acid synthesis, asparagine synthesis, chlorophyll synthesis, cell wall modification and in the response to pathogen elicitors.

  17. Effects of Ni-coated Carbon Nanotubes addition on the electromigration of Sn–Ag–Cu solder joints

    Energy Technology Data Exchange (ETDEWEB)

    Yang, Zhongbao; Zhou, Wei; Wu, Ping, E-mail: pingwu@tju.edu.cn

    2013-12-25

    Highlights: •The electromigration behaviors of the composite solder joints were investigated. •The presence of Ni altered the morphology of the IMC layer after reflow. •Carbon nanotube network was observed in solder matrix. •Current crowding occurred at the carbon nanotube networks. •The electromigration effect of composite solder joint was suppressed effectively. -- Abstract: The electromigration behaviors of line-type Cu/Sn–Ag–Cu/Cu interconnects with and without Ni-Coated multi-walled Carbon Nanotubes addition were investigated in this work. After soldering, the (Cu,Ni){sub 6}Sn{sub 5} intermetallic compounds formed at the solder/Cu interface. The electromigration analysis shows that the presence of Carbon Nanotubes can suppress the atomic diffusion in the solder induced by electromigration effectively. And finite element simulation indicates that the Carbon Nanotube networks can reduce the current density in the solder matrix, which results in the improvement of electromigration resistance of composite solders.

  18. Enhanced interfacial thermal transport in pnictogen tellurides metallized with a lead-free solder alloy

    Energy Technology Data Exchange (ETDEWEB)

    Devender,; Ramanath, Ganpati, E-mail: Ramanath@rpi.edu [Department of Materials Science and Engineering, Rensselaer Polytechnic Institute, Troy, New York 12180 (United States); Lofgreen, Kelly; Devasenathipathy, Shankar; Swan, Johanna; Mahajan, Ravi [Intel Corporation, Assembly Test and Technology Development, Chandler, Arizona 85226 (United States); Borca-Tasciuc, Theodorian [Department of Mechanical Aerospace and Nuclear Engineering, Rensselaer Polytechnic Institute, Troy, New York 12180 (United States)

    2015-11-15

    Controlling thermal transport across metal–thermoelectric interfaces is essential for realizing high efficiency solid-state refrigeration and waste-heat harvesting power generation devices. Here, the authors report that pnictogen chalcogenides metallized with bilayers of Sn{sub 96.5}Ag{sub 3}Cu{sub 0.5} solder and Ni barrier exhibit tenfold higher interfacial thermal conductance Γ{sub c} than that obtained with In/Ni bilayer metallization. X-ray diffraction and x-ray spectroscopy indicate that reduced interdiffusion and diminution of interfacial SnTe formation due to Ni layer correlates with the higher Γ{sub c}. Finite element modeling of thermoelectric coolers metallized with Sn{sub 96.5}Ag{sub 3}Cu{sub 0.5}/Ni bilayers presages a temperature drop ΔT ∼ 22 K that is 40% higher than that obtained with In/Ni metallization. Our results underscore the importance of controlling chemical intermixing at solder–metal–thermoelectric interfaces to increase the effective figure of merit, and hence, the thermoelectric cooling efficiency. These findings should facilitate the design and development of lead-free metallization for pnictogen chalcogenide-based thermoelectrics.

  19. Integrating candidate metabolites and biochemical factors to elucidate the action mechanism of Xue-sai-tong injection based on (1)H NMR metabolomics.

    Science.gov (United States)

    Jiang, Miaomiao; Zhao, Xiaoping; Wang, Linli; Xu, Lei; Zhang, Yan; Li, Zheng

    2016-07-15

    A strategy of integrating candidate metabolites with crucial biochemical factors was proposed in this study to discover relevant biological functions for interpreting the action mechanism of Traditional Chinese Medicines (TCM). This approach was applied to Xue-Sai-Tong injection (XST) to reveal the action mechanism based on the metabolic response in an ischemia/reperfusion (I/R) rat model by analyzing NMR profile. Partial least squares discriminate analysis (PLS-DA) was used to compare metabolic profiles of serum samples and revealed nine metabolites altered by I/R injury could be restored to normal status (sham-operated group) under the therapy of XST. The pathway enrichment analysis suggested the metabolic changes were mainly involved in pyruvate metabolism, glycolysis, and citrate cycle. The functional roles of the candidate metabolites were further identified by Pearson correlation analysis with the key biochemical factors in serum. The results indicated pyruvate, succinate, acetate and lysine showed significant associations with the oxidative stress factors. Elevated level of pyruvate was found as an essential metabolic response for the major effect of XST against I/R injury by enhancing glycolysis and overcoming the induced reactive oxygen species (ROS). This metabolomics approach provides a better understanding of the mechanisms of TCM and helps to develop a holistic view of TCM efficacy. PMID:26862062

  20. Universal solders for direct and powerful bonding on semiconductors, diamond, and optical materials

    Science.gov (United States)

    Mavoori, Hareesh; Ramirez, Ainissa G.; Jin, Sungho

    2001-05-01

    The surfaces of electronic and optical materials such as nitrides, carbides, oxides, sulfides, fluorides, selenides, diamond, silicon, and GaAs are known to be very difficult to bond with low melting point solders (<300 °C). We have achieved a direct and powerful bonding on these surfaces by using low temperature solders doped with rare-earth elements. The rare earth is stored in micron-scale, finely-dispersed intermetallic islands (Sn3Lu or Au4Lu), and when released, causes chemical reactions at the interface producing strong bonds. These solders directly bond to semiconductor surfaces and provide ohmic contacts. They can be useful for providing direct electrical contacts and interconnects in a variety of electronic assemblies, dimensionally stable and reliable bonding in optical fiber, laser, or thermal management assemblies.

  1. Design of Experiments to Determine Causes of Flex Cable Solder Wicking, Discoloration and Hole Location Defects

    Energy Technology Data Exchange (ETDEWEB)

    Wolfe, Larry

    2009-04-22

    Design of Experiments (DoE) were developed and performed in an effort to discover and resolve the causes of three different manufacturing issues; large panel voids after Hot Air Solder Leveling (HASL), cable hole locations out of tolerance after lamination and delamination/solder wicking around flat flex cable circuit lands after HASL. Results from a first DoE indicated large panel voids could be eliminated by removing the pre-HASL cleaning. It also revealed eliminating the pre-HASL bake would not be detrimental when using a hard press pad lamination stackup. A second DoE indicated a reduction in hard press pad stackup lamination pressure reduced panel stretch in the y axis approximately 70%. A third DoE illustrated increasing the pre-HASL bake temperature could reduce delamination/solder wicking when using a soft press pad lamination stackup.

  2. Dissolution ad uptake of cadmium from dental gold solder alloy implants

    International Nuclear Information System (INIS)

    Pure metallic cadmium was irradiated by means of thermal neutrons. The irradiated cadmium (115Cd) was placed in bags of gold foil and the bags were implanted subcutaneously in the neck region of mice. Two and 3 d respectively after implantation the mice were killed, the bags removed and the animals subjected to whole-body autoradiography. The autoradiograms revealed an uptake of 115Cd in liver and kidney. In another experiment specimens of a cadmium-containing dental gold solder alloy, a cadmium-free dental casting gold alloy and soldered assemblies made of these two alloys were implanted subcutaneously in the neck region of mice. The animals were killed after 6 months; cadmium analysis showed significant increases in the cadmium concentration in liver and kidney of those mice which had been given implants of gold solder alloy. The study clearly shows that due to electrochemical corrosion cadmium can be released from implants and accumulated in the kidneys and the liver. (author)

  3. Interfacial Reactions Between In-Sn Solder and Ni-Fe Platings

    Science.gov (United States)

    Daghfal, John P.; Shang, P. J.; Liu, Z. Q.; Shang, J. K.

    2009-12-01

    Interfacial interactions in a Ni- xFe-Sn-In eutectic solder ( x = 30 at.%, 55 at.%) have been examined. Transmission and scanning electron microscopy (TEM/SEM) were utilized to investigate the structure, composition, and morphology of the intermetallic compounds (IMCs). Upon reflow, Ni3Sn4 and FeSn2 phases appeared at the interface along with Cu6Sn5 in the solder. Annealing experiments revealed the formation of a bilayer IMC that was Fe-rich adjacent to the Ni-Fe metallization and Ni-rich on the solder side. Kinetic studies established the apparent activation energies for both systems to be 51.8 kJ/mol and 85.1 kJ/mol, for 30 at.% and 55 at.% Fe contents, respectively. In the Fe-rich system, globular Ni3Sn4 crystals were formed upon reflow, but were changed into a cubic/faceted structure after annealing.

  4. Investigation Of The Effects Of Reflow Profile Parameters On Lead-free Solder Bump Volumes And Joint Integrity

    Science.gov (United States)

    Amalu, E. H.; Lui, Y. T.; Ekere, N. N.; Bhatti, R. S.; Takyi, G.

    2011-01-01

    The electronics manufacturing industry was quick to adopt and use the Surface Mount Technology (SMT) assembly technique on realization of its huge potentials in achieving smaller, lighter and low cost product implementations. Increasing global customer demand for miniaturized electronic products is a key driver in the design, development and wide application of high-density area array package format. Electronic components and their associated solder joints have reduced in size as the miniaturization trend in packaging continues to be challenged by printing through very small stencil apertures required for fine pitch flip-chip applications. At very narrow aperture sizes, solder paste rheology becomes crucial for consistent paste withdrawal. The deposition of consistent volume of solder from pad-to-pad is fundamental to minimizing surface mount assembly defects. This study investigates the relationship between volume of solder paste deposit (VSPD) and the volume of solder bump formed (VSBF) after reflow, and the effect of reflow profile parameters on lead-free solder bump formation and the associated solder joint integrity. The study uses a fractional factorial design (FFD) of 24-1 Ramp-Soak-Spike reflow profile, with all main effects and two-way interactions estimable to determine the optimal factorial combination. The results from the study show that the percentage change in the VSPD depends on the combination of the process parameters and reliability issues could become critical as the size of solder joints soldered on the same board assembly vary greatly. Mathematical models describe the relationships among VSPD, VSBF and theoretical volume of solder paste. Some factors have main effects across the volumes and a number of interactions exist among them. These results would be useful for R&D personnel in designing and implementing newer applications with finer-pitch interconnect.

  5. Special Education Teacher Candidate Assessment: A Review

    Science.gov (United States)

    McCall, Zach; McHatton, Patricia Alvarez; Shealey, Monika Williams

    2014-01-01

    Teacher preparation has been under intense scrutiny in recent years. In order for preparation of special education teacher candidates to remain viable, candidate assessment practices must apply practices identified in the extant literature base, while special education teacher education researchers must extend this base with rigorous efforts to…

  6. A new high-throughput method utilizing porous silica-based nano-composites for the determination of partition coefficients of drug candidates.

    Science.gov (United States)

    Yu, Chih H; Tam, Kin; Tsang, Shik C

    2011-09-01

    We show that highly porous silica-based nanoparticles prepared via micro-emulsion and sol-gel techniques are stable colloids in aqueous solution. By incorporating a magnetic core into the porous silica nano-composite, it is found that the material can be rapidly separated (precipitated) upon exposure to an external magnetic field. Alternatively, the porous silica nanoparticles without magnetic cores can be equally separated from solution by applying a high-speed centrifugation. Using these silica-based nanostructures a new high-throughput method for the determination of partition coefficient for water/n-octanol is hereby described. First, a tiny quantity of n-octanol phase is pre-absorbed in the porous silica nano-composite colloids, which allows an establishment of interface at nano-scale between the adsorbed n-octanol with the bulk aqueous phase. Organic compounds added to the mixture can therefore undergo a rapid partition between the two phases. The concentration of drug compound in the supernatant in a small vial can be determined by UV-visible absorption spectroscopy. With the adaptation of a robotic liquid handler, a high-throughput technology for the determination of partition coefficients of drug candidates can be employed for drug screening in the industry based on these nano-separation skills. The experimental results clearly suggest that this new method can provide partition coefficient values of potential drug candidates comparable to the conventional shake-flask method but requires much shorter analytical time and lesser quantity of chemicals. PMID:21780284

  7. Effect of the Creative Drama-Based Assertiveness Program on the Assertiveness Skill of Psychological Counsellor Candidates

    Science.gov (United States)

    Gundogdu, Rezzan

    2012-01-01

    The purpose of this quasi-experimental research is to study the effects of the creative drama-based assertiveness program (CDBAP) on the assertiveness skill of Psychological Counselling and Guidance (PCG) department students. The opinions of experimental group students on the program were obtained through the CDBAP evaluation form. The sample of…

  8. A novel technique and soldering method to improve performance of transparent polymer antennas

    OpenAIRE

    Peter, T; Nilavalan, R; AbuTarboush, HF; Cheung, SW

    2010-01-01

    A novel technique and a nonthermal soldering method to improve the performance of AgHT-8 transparent polymer antennas are proposed in this letter. The proposed technique involves the removal of the coating layer at areas on the coplanar waveguide (CPW) ground and feed line where the connectors of the coaxial feed or legs of the SMA connectors will be attached and applying a coat of silver paint on the exposed areas before cold-soldering the coaxial connections or SMA connector legs. The nonth...

  9. Sensitivity of Solder Joint Fatigue to Sources of Variation in Advanced Vehicular Power Electronics Cooling

    Energy Technology Data Exchange (ETDEWEB)

    Vlahinos, A.; O' Keefe, M.

    2010-06-01

    This paper demonstrates a methodology for taking variation into account in thermal and fatigue analyses of the die attach for an inverter of an electric traction drive vehicle. This method can be used to understand how variation and mission profile affect parameters of interest in a design. Three parameters are varied to represent manufacturing, material, and loading variation: solder joint voiding, aluminum nitride substrate thermal conductivity, and heat generation at the integrated gate bipolar transistor. The influence of these parameters on temperature and solder fatigue life is presented. The heat generation loading variation shows the largest influence on the results for the assumptions used in this problem setup.

  10. Mechanical performances of lead-free solder joint connections with applications in the aerospace domain

    Directory of Open Access Journals (Sweden)

    Georgiana PADURARU

    2016-03-01

    Full Text Available The paper presents some theoretical and experimental aspects regarding the tribological performances of lead-free solder joint connections, with application in the aerospace domain. In order to highlight the mechanical and tribological properties of solder joint in correlation with different pad finishes, there were made some mechanical determinations using a dedicated Share Test System. The theoretical model highlights the link between the experimental results and the influence of gravitational acceleration on the mechanical and functional integrity of the electronic assemblies that works in vibration environment. The paper novelty is provided by the interdisciplinary experiment that offers results that can be used in the mechanical, tribological, electronical and aerospace domains.

  11. The Numerical Analysis of Strain Behavior at Solder Joint and Interface of Flip Chip Package

    Institute of Scientific and Technical Information of China (English)

    S; C; Chen; Y; C; Lin

    2002-01-01

    The flip chip package is a kind of advanced electri ca l packages. Due to the requirement of miniaturization, lower weight, higher dens ity and higher performance in the advanced electric package, it is expected that flip chip package will soon be a mainstream technology. The silicon chip is dir ectly connected to printing circuit substrate by SnPb solder joints. Also, the u nderfill, a composite of polymer and silica particles, is filled in the gap betw een the chip and substrate around the solder joint...

  12. Identification and prioritization of candidate genes for symptom variability in breast cancer survivors based on disease characteristics at the cellular level

    Directory of Open Access Journals (Sweden)

    Koleck TA

    2016-03-01

    Full Text Available Theresa A Koleck,1 Yvette P Conley2 1School of Nursing, 2Department of Human Genetics, School of Nursing and Graduate School of Public Health, University of Pittsburgh, Pittsburgh, PA, USA Abstract: Research is beginning to suggest that the presence and/or severity of symptoms reported by breast cancer survivors may be associated with disease-related factors of cancer. In this article, we present a novel approach to the identification and prioritization of biologically plausible candidate genes to investigate relationships between genomic variation and symptom variability in breast cancer survivors. Cognitive dysfunction is utilized as a representative breast cancer survivor symptom to elucidate the conceptualization of and justification for our cellular, disease-based approach to address symptom variability in cancer survivors. Initial candidate gene identification was based on genes evaluated as part of multigene expression profiles for breast cancer, which are commonly used in the clinical setting to characterize the biology of cancer cells for the purpose of describing overall tumor aggressiveness, prognostication, and individualization of therapy. A list of genes evaluated within five multigene expression profiles for breast cancer was compiled. In order to prioritize candidate genes for investigation, genes used in each profile were compared for duplication. Twenty-one genes (BAG1, BCL2, BIRC5, CCNB1, CENPA, CMC2, DIAPH3, ERBB2, ESR1, GRB7, MELK, MKI67, MMP11, MYBL2, NDC80, ORC6, PGR, RACGAP1, RFC4, RRM2, and SCUBE2 are utilized in two or more profiles, including five genes (CCNB1, CENPA, MELK, MYBL2, and ORC6 used in three profiles. To ensure that the parsimonious 21 gene set is representative of the more global biological hallmarks of cancer, an Ingenuity Pathway Analysis was conducted. Evaluation of genes known to impact pathways involved with cancer development and progression provide a means to evaluate the overlap between the

  13. Improving the quality of biomarker candidates in untargeted metabolomics via peak table-based alignment of comprehensive two-dimensional gas chromatography-mass spectrometry data.

    Science.gov (United States)

    Bean, Heather D; Hill, Jane E; Dimandja, Jean-Marie D

    2015-05-15

    The potential of high-resolution analytical technologies like GC×GC/TOF MS in untargeted metabolomics and biomarker discovery has been limited by the development of fully automated software that can efficiently align and extract information from multiple chromatographic data sets. In this work we report the first investigation on a peak-by-peak basis of the chromatographic factors that impact GC×GC data alignment. A representative set of 16 compounds of different chromatographic characteristics were followed through the alignment of 63 GC×GC chromatograms. We found that varying the mass spectral match parameter had a significant influence on the alignment for poorly-resolved peaks, especially those at the extremes of the detector linear range, and no influence on well-chromatographed peaks. Therefore, optimized chromatography is required for proper GC×GC data alignment. Based on these observations, a workflow is presented for the conservative selection of biomarker candidates from untargeted metabolomics analyses. PMID:25857541

  14. Benefit-of-doubt (BOD) scoring: a sequencing-based method for SNP candidate assessment from high to medium read number data sets.

    Science.gov (United States)

    Sedlazeck, Fritz Joachim; Talloji, Prabhavathi; von Haeseler, Arndt; Bachmair, Andreas

    2013-03-01

    Identification of single nucleotide polymorphisms (SNPs) is a key element in sequence-based genetic analysis. Next generation sequencing offers a cost-effective basis to generate the necessary, large sequence data sets, and bioinformatic methods are being developed to process sequencing machine readouts. We were interested in detection of SNPs in a 350 kb region of an EMS-mutagenized Arabidopsis chromosome 3. The region was selectively analyzed using PCR-generated, overlapping fragments for Solexa sequencing. The ensuing reads provided a high coverage and were processed bioinformatically. In order to assess the SNP candidates obtained with a frequently used alignment program and SNP caller, we developed an additional method that allows the identification of high confidence SNP loci. The method can easily be applied to complete genome sequence data of sufficient coverage.

  15. Newly identified YSO candidates towards LDN 1188

    Science.gov (United States)

    Marton , G.; Verebélyi, E.; Kiss, Cs.; Smidla, J.

    2013-11-01

    We present an analysis of young stellar object (YSO) candidates towards the LDN 1188 molecular cloud. The YSO candidates were selected from the WISE all-sky catalogue, based on a statistical method. We found 601 candidates in the region, and classified them as Class I, Flat, and Class II YSOs. Groups were identified and described with the Minimal Spanning Tree (MST) method. Previously identified molecular cores show evidence of ongoing star formation at different stages throughout the cloud complex.

  16. Effect of Electromigration on the Type of Drop Failure of Sn-3.0Ag-0.5Cu Solder Joints in PBGA Packages

    Science.gov (United States)

    Huang, M. L.; Zhao, N.

    2015-10-01

    Board-level drop tests of plastic ball grid array (PBGA) packages were performed in accordance with the Joint Electron Devices Engineering Council standard to investigate the effect of electromigration (EM) on the drop reliability of Sn-3.0Ag-0.5Cu solder joints with two substrate surface finishes, organic solderability preservative (OSP) and electroless nickel electroless palladium immersion gold (ENEPIG). In the as-soldered state, drop failures occurred at the substrate sides only, with cracks propagating within the interfacial intermetallic compound (IMC) layer for OSP solder joints and along the IMC/Ni-P interface for ENEPIG solder joints. The drop lifetime of OSP solder joints was approximately twice that of ENEPIG joints. EM had an important effect on crack formation and drop lifetime of the PBGA solder joints. ENEPIG solder joints performed better in drop reliability tests after EM, that is, the drop lifetime of ENEPIG joints decreased by 43% whereas that of OSP solder joints decreased by 91%, compared with the as-soldered cases. The more serious polarity effect, i.e., excessive growth of the interfacial IMC at the anode, was responsible for the sharper decrease in drop lifetime. The different types of drop failure of PBGA solder joints before and after EM, including the position of initiation and the propagation path of cracks, are discussed on the basis of the growth behavior of interfacial IMC.

  17. Synthesis and evaluation of influenza A viral neuraminidase candidate inhibitors based on a bicyclo[3.1.0]hexane scaffold.

    Science.gov (United States)

    Colombo, Cinzia; Pinto, B Mario; Bernardi, Anna; Bennet, Andrew J

    2016-07-01

    This manuscript describes a novel class of derivatives based on a bicyclo[3.1.0]hexane scaffold, proposed as mimics of sialic acid in a distorted boat conformation that is on the catalytic pathway of neuraminidases (sialidases). A general synthetic route for these constrained-ring molecules was developed using a photochemical reaction followed by a Johnson-Corey-Chaykovsky cyclopropanation. Functionalization with the goal of occupying the 150-cavity was also exploited. Inhibition assays demonstrated low micromolar inhibition against both group-1 (H5N1) and group-2 (H9N2) influenza neuraminidase subtypes, indicating good affinity for the alpha and beta sialic acid mimics and 150-cavity-targeted derivatives. These results provide a validation of a bicyclo[3.1.0]hexane scaffold as a mimic of a distorted sialic acid bound in the neuraminidase active site during catalysis. PMID:27305457

  18. Information criterion-based clustering with order-restricted candidate profiles in short time-course microarray experiments

    Directory of Open Access Journals (Sweden)

    Zhang Baoxue

    2009-05-01

    Full Text Available Abstract Background Time-course microarray experiments produce vector gene expression profiles across a series of time points. Clustering genes based on these profiles is important in discovering functional related and co-regulated genes. Early developed clustering algorithms do not take advantage of the ordering in a time-course study, explicit use of which should allow more sensitive detection of genes that display a consistent pattern over time. Peddada et al. 1 proposed a clustering algorithm that can incorporate the temporal ordering using order-restricted statistical inference. This algorithm is, however, very time-consuming and hence inapplicable to most microarray experiments that contain a large number of genes. Its computational burden also imposes difficulty to assess the clustering reliability, which is a very important measure when clustering noisy microarray data. Results We propose a computationally efficient information criterion-based clustering algorithm, called ORICC, that also takes account of the ordering in time-course microarray experiments by embedding the order-restricted inference into a model selection framework. Genes are assigned to the profile which they best match determined by a newly proposed information criterion for order-restricted inference. In addition, we also developed a bootstrap procedure to assess ORICC's clustering reliability for every gene. Simulation studies show that the ORICC method is robust, always gives better clustering accuracy than Peddada's method and saves hundreds of times computational time. Under some scenarios, its accuracy is also better than some other existing clustering methods for short time-course microarray data, such as STEM 2 and Wang et al. 3. It is also computationally much faster than Wang et al. 3. Conclusion Our ORICC algorithm, which takes advantage of the temporal ordering in time-course microarray experiments, provides good clustering accuracy and is meanwhile much

  19. Effects of bismuth on growth of intermetallic compounds in Sn-Ag-Cu Pb-free solder joints

    Institute of Scientific and Technical Information of China (English)

    LI Guo-yuan; SHI Xun-qing

    2006-01-01

    The effects of Bi addition on the growth of intermetallic compound (IMC) formation in Sn-3.8Ag-0.7Cu solder joints were investigated. The test samples were prepared by conventional surface mounting technology. To investigate the element diffusion and the growth kinetics of intermetallics formation in solder joint,isothermal aging test was performed at temperatures of 100,150,and 190 ℃,respectively. The optical microscope (OM) and scanning electron microscope (SEM) were used to observe microstructure evolution of solder joint and to estimate the thickness and the grain size of the intermetallic layers. The IMC phases were identified by energy dispersive X-ray (EDX) and X-ray diffractometer (XRD). The results clearly show that adding about 1.0% Bi in Sn-Ag-Cu solder alloy system can refine the grain size of the IMC and inhibit the excessive IMC growth in solder joints,and therefore improve the reliability of the Pb-free solder joints. Through observation of the microstructural evolution of the solder joints,the mechanism of inhibition of IMC growth due to Bi addition was proposed.

  20. Assessment of Solder Interconnect Integrity in Dismantled Electronic Components from N57 and B61 Tube-Type Radars

    Energy Technology Data Exchange (ETDEWEB)

    Rejent, J.A.; Vianco, P.T.; Woodrum, R.A.

    1999-07-01

    Aging analyses were performed on solder joints from two radar units: (1) a laboratory, N57 tube-type radar unit and (2) a field-returned, B61-0, tube-type radar unit. The cumulative temperature environments experienced by the units during aging were calculated from the intermetallic compound layer thickness and the mean Pb-rich phase particle size metrics for solder joints in the units, assuming an aging time of 35 years for both radars. Baseline aging metrics were obtained from a laboratory test vehicle assembled at AS/FM and T; the aging kinetics of both metrics were calculated from isothermal aging experiments. The N57 radar unit interconnect board solder joints exhibited very little aging. The eyelet solder joints did show cracking that most likely occurred at the time of assembly. The eyelet, SA1126 connector solder joints, showed some delamination between the Cu pad and underlying laminate. The B61 field-returned radar solder joints showed a nominal degree of aging. Cracking of the eyelet solder joints was observed. The Pb-rich phase particle measurements indicated additional aging of the interconnects as a result of residual stresses. Cracking of the terminal pole connector, pin-to-pin solder joint was observed; but it was not believed to jeopardize the electrical functionality of the interconnect. Extending the stockpile lifetime of the B61 tube-type radar by an additional 20 years would not be impacted by the reliability of the solder joints with respect to further growth of the intermetallic compound layer. Additional coarsening of the Pb-rich phase will increase the joints' sensitivity to thermomechanical fatigue.

  1. High-yield production of a stable Vero cell-based vaccine candidate against the highly pathogenic avian influenza virus H5N1

    International Nuclear Information System (INIS)

    Highlights: ► Vero cell-based HPAI H5N1 vaccine with stable high yield. ► Stable high yield derived from the YNVa H3N2 backbone. ► H5N1/YNVa has a similar safety and immunogenicity to H5N1delta. -- Abstract: Highly pathogenic avian influenza (HPAI) viruses pose a global pandemic threat, for which rapid large-scale vaccine production technology is critical for prevention and control. Because chickens are highly susceptible to HPAI viruses, the supply of chicken embryos for vaccine production might be depleted during a virus outbreak. Therefore, developing HPAI virus vaccines using other technologies is critical. Meeting vaccine demand using the Vero cell-based fermentation process has been hindered by low stability and yield. In this study, a Vero cell-based HPAI H5N1 vaccine candidate (H5N1/YNVa) with stable high yield was achieved by reassortment of the Vero-adapted (Va) high growth A/Yunnan/1/2005(H3N2) (YNVa) virus with the A/Anhui/1/2005(H5N1) attenuated influenza vaccine strain (H5N1delta) using the 6/2 method. The reassorted H5N1/YNVa vaccine maintained a high hemagglutination (HA) titer of 1024. Furthermore, H5N1/YNVa displayed low pathogenicity and uniform immunogenicity compared to that of the parent virus.

  2. High-yield production of a stable Vero cell-based vaccine candidate against the highly pathogenic avian influenza virus H5N1

    Energy Technology Data Exchange (ETDEWEB)

    Zhou, Fangye; Zhou, Jian; Ma, Lei; Song, Shaohui; Zhang, Xinwen; Li, Weidong; Jiang, Shude [No. 5, Department of Bioproducts, Institute of Medical Biology, Chinese Academy of Medical Science and Pecking Union Medical College, Jiaoling Avenue 935, Kunming, Yunnan Province 650102, People' s Republic of China (China); Wang, Yue, E-mail: euy-tokyo@umin.ac.jp [National Institute for Viral Disease Control and Prevention, China Center for Disease Control and Prevention, Yingxin Lane 100, Xicheng District, Beijing 100052, People' s Republic of China (China); Liao, Guoyang, E-mail: liaogy@21cn.com [No. 5, Department of Bioproducts, Institute of Medical Biology, Chinese Academy of Medical Science and Pecking Union Medical College, Jiaoling Avenue 935, Kunming, Yunnan Province 650102, People' s Republic of China (China)

    2012-05-18

    Highlights: Black-Right-Pointing-Pointer Vero cell-based HPAI H5N1 vaccine with stable high yield. Black-Right-Pointing-Pointer Stable high yield derived from the YNVa H3N2 backbone. Black-Right-Pointing-Pointer H5N1/YNVa has a similar safety and immunogenicity to H5N1delta. -- Abstract: Highly pathogenic avian influenza (HPAI) viruses pose a global pandemic threat, for which rapid large-scale vaccine production technology is critical for prevention and control. Because chickens are highly susceptible to HPAI viruses, the supply of chicken embryos for vaccine production might be depleted during a virus outbreak. Therefore, developing HPAI virus vaccines using other technologies is critical. Meeting vaccine demand using the Vero cell-based fermentation process has been hindered by low stability and yield. In this study, a Vero cell-based HPAI H5N1 vaccine candidate (H5N1/YNVa) with stable high yield was achieved by reassortment of the Vero-adapted (Va) high growth A/Yunnan/1/2005(H3N2) (YNVa) virus with the A/Anhui/1/2005(H5N1) attenuated influenza vaccine strain (H5N1delta) using the 6/2 method. The reassorted H5N1/YNVa vaccine maintained a high hemagglutination (HA) titer of 1024. Furthermore, H5N1/YNVa displayed low pathogenicity and uniform immunogenicity compared to that of the parent virus.

  3. Characterizing performances of solder paste printing process at flexible manufacturing lines

    Energy Technology Data Exchange (ETDEWEB)

    Siew, Jit Ping; Low, Heng Chin [University of Science Malaysia, 11800 Minden, Penang (Malaysia); Teoh, Ping Chow [Wawasan Open University, 54 Jalan Sultan Ahmad Shah, 10050 Penang (Malaysia)

    2015-02-03

    Solder paste printing (SPP) has been a challenge on printed circuit board (PCB) manufacturing, evident by the proliferation of solder paste inspection equipment, or substituted by rigorous non-value added activity of manual inspections. The objective of this study is to characterize the SPP performance of various products manufactured in flexible production lines with different equipment configurations, and determine areas for process improvement. The study began by collecting information on SPP performance relative to component placement (CP) process, and to the proportion of mixed products. Using a clustering algorithm to group similar elements together, SPP performance across all product-production line pairs are statistically modeled to discover the trend and the influential factors. The main findings are: (a) Ratio of overall dpku for CP and SPP processes are 2:1; (b) logistic regression models of SPP performance indicated that only effects of product-production line and solder paste printer configuration are significant; (c) PCB circuitry design with BGA components and single solder paste printer line configurations generated the highest monthly defects, with the highest variation in the latter.

  4. Microstructural Coarsening during Thermomechanical Fatigue and Annealing of Micro Flip-Chip Solder Joints

    Energy Technology Data Exchange (ETDEWEB)

    Barney, Monica M.

    1998-12-01

    Microstructural evolution due to thermal effects was studied in micro solder joints (55 {+-} 5 {micro}m). The composition of the Sn/Pb solder studied was found to be hypereutectic with a tin content of 65--70 wt%.This was determined by Energy Dispersive X-ray analysis and confirmed with quantitative stereology. The quantitative stereological value of the surface-to-volume ratio was used to characterize and compare the coarsening during thermal cycling from 0--160 C to the coarsening during annealing at 160 C. The initial coarsening of the annealed samples was more rapid than the cycled samples, but tapered off as time to the one-half as expected. Because the substrates to which the solder was bonded have different thermal expansion coefficients, the cycled samples experienced a mechanical strain with thermal cycling. The low-strain cycled samples had a 2.8% strain imposed on the solder and failed by 1,000 cycles, despite undergoing less coarsening than the annealed samples. The high-strain cycled samples experienced a 28% strain and failed between 25 and 250 cycles. No failures were observed in the annealed samples. Failure mechanisms and processing issues unique to small, fine pitch joints are also discussed.

  5. Development of high melting point, environmentally friendly solders, using the calphad approach

    DEFF Research Database (Denmark)

    Chidambaram, Vivek; Hald, John; Hattel, Jesper Henri

    2008-01-01

    An attempt has been made using the CALPHAD approach via Thermo-Calc to explore the various possible chemical compositions that adhere to the melting criterion i.e. 270-350 degrees C, required to replace the traditionally used high lead content solders for first level packaging applications. Various...

  6. Reliability of Solder Materials (Sn-Pb and Pb-Free) for Deep Space Missions

    Science.gov (United States)

    Ramesham, Rajeshuni

    2011-01-01

    The purpose of this study is to assess the experimental reliability results of miniaturized passive components (01005, 0201, 0402, 0603, 0805, and 1206) assembled using surface mounting processes with tin-lead (Sn-Pb) and lead-free (Pb-Free) solder alloys under extreme temperature deep space environments.

  7. Modeling of high temperature- and diffusion-controlled die soldering in aluminum high pressure die casting

    DEFF Research Database (Denmark)

    Domkin, Konstantin; Hattel, Jesper Henri; Thorborg, Jesper

    2009-01-01

    Soldering of cast alloys to the dies has been a continuing source of die surface damage in the aluminum die-casting industry. To reduce the repair and maintenance costs, an approach to modeling the damage and predicting the die lifetime is required. The aim of the present study is the estimation...

  8. Sn-Pb and lead free solders containing active carbon particles

    Science.gov (United States)

    Talas, S.; Gökçe, B.; Çakmakkaya, M.

    2016-08-01

    Upon the legislations issued by the governmental agencies, many companies are in effort of using lead free solders for their electronic products. Many researchers have also focused on lead free solders and determined their physical properties to the merit of their desired strength and conductivity which turns out to be a potentially advantageous after all. The addition of nano particles into the solder alloys has been attempted to investigate the property change caused by such addition from which a main outcome was a limited improved mechanical and physical properties such as lowering the melting temperature. In this study, the addition of nano active carbon particles to Pb-Sn and Pb-free solder alloys were made and characterization studies were conducted to determine their basic properties such as electrical conductivity, microstructural study and also phase transformations. The results indicate that the addition of active carbon particles brings about a change in thermal properties more markedly than other properties with respect to the amount of addition.

  9. Au-SN Flip-Chip Solder Bump for Microelectronic and Optoelectronic Applications

    CERN Document Server

    Yoon, Jeong-Won; Koo, Ja-Myeong; Jung, Seung-Boo

    2007-01-01

    As an alternative to the time-consuming solder pre-forms and pastes currently used, a co-electroplating method of eutectic Au-Sn alloy was used in this study. Using a co-electroplating process, it was possible to plate the Au-Sn solder directly onto a wafer at or near the eutectic composition from a single solution. Two distinct phases, Au5Sn and AuSn, were deposited at a composition of 30at.%Sn. The Au-Sn flip-chip joints were formed at 300 and 400 degrees without using any flux. In the case where the samples were reflowed at 300 degrees, only an (Au,Ni)3Sn2 IMC layer formed at the interface between the Au-Sn solder and Ni UBM. On the other hand, two IMC layers, (Au,Ni)3Sn2 and (Au,Ni)3Sn, were found at the interfaces of the samples reflowed at 400 degrees. As the reflow time increased, the thickness of the (Au,Ni)3Sn2 and (Au,Ni)3Sn IMC layers formed at the interface increased and the eutectic lamellae in the bulk solder coarsened.

  10. Laser-welded vs soldered nonprecious alloy dental bridges: a comparative study.

    Science.gov (United States)

    Apotheker, H; Nishimura, I; Seerattan, C

    1984-01-01

    The high cost of gold alloy has caused the dental profession to begin substituting nonprecious alloy for the framework in porcelain fused to metal bridges. Especially in long-span bridges it may be advantageous to make multiple castings and then join them for a better fit. As opposed to the highly successful soldering of gold, soldered nonprecious alloy bridges have a great failure rate in the mouth. Removal of and remaking of the bridges is thus the result. This study compares nonprecious units that have been laser-welded with those conventionally soldered. Seven identical bridges of three units were cast in a popular alloy composed of 74-78% nickel, 12-15% chromium, 4-6% molybdenum, and 1.8% maximum beryllium. One served as a control, while the remaining six were all cut in the same place. Of these, three were soldered with a gas oxygen torch. The other three were welded with a Nd-YAG laser. Better and stronger joints unlikely to fracture in the mouth were found with the laser-welded specimen. PMID:6147733

  11. Relative Damage Stress: Dominant Mechanical Factor for the Failure of Soldered Joints under Temperature Cycling

    Institute of Scientific and Technical Information of China (English)

    2001-01-01

    By temperature normalization of the concept of equivalent damage stress proposed by Lemaitre,a new concept of relative damage stress has been put forward as the dominant mechanical factor for the failure of soldered joints under temperature cycling. Finite element numerical simulation results showed that the highest value of relative damage stress occurred at the high temperaturehold time during temperature cycling history.

  12. Microstructure evolution in a Pb-free solder alloy during mechanical fatigue

    NARCIS (Netherlands)

    Matin, M. A.; Vellinga, W. P.; Geers, M. G. D.

    2006-01-01

    Microstructural evolution in a Sn-rich eutectic Sn-3.8Ag-0.7Cu solder alloy has been investigated in low cycle mechanical fatigue. Inhomogeneity in deformation occurred on a grain scale (determined by grain orientation and plastic anisotropy of Sn) and on a subgrain scale where persistent slip bands

  13. Nucleation and Growth of Tin in Pb-Free Solder Joints

    Science.gov (United States)

    Gourlay, C. M.; Belyakov, S. A.; Ma, Z. L.; Xian, J. W.

    2015-08-01

    The solidification of Pb-free solder joints is overviewed with a focus on the formation of the βSn grain structure and grain orientations. Three solders commonly used in electronics manufacturing, Sn-3Ag-0.5Cu, Sn-3.5Ag, and Sn-0.7Cu-0.05Ni, are used as case studies to demonstrate that (I) growth competition between primary dendrites and eutectic fronts during growth in undercooled melts is important in Pb-free solders and (II) a metastable eutectic containing NiSn4 forms in Sn-3.5Ag/Ni joints. Additionally, it is shown that the substrate (metallization) has a strong influence on the nucleation and growth of tin. We identify Co, Pd, and Pt substrates as having the potential to control solidification and microstructure formation. In the case of Pd and Pt substrates, βSn is shown to nucleate on the PtSn4 or PdSn4 intermetallic compound (IMC) reaction layer at relatively low undercooling of ~4 K, even for small solder ball diameters down to <200 μm.

  14. Corrosion reliability of electronics: the influence of solder temperature on the decomposition of flux activators

    DEFF Research Database (Denmark)

    Piotrowska, Kamila; Conseil, Helene; Jellesen, Morten Stendahl;

    2014-01-01

    This manuscript gives a brief overview on the studies of thermal decomposition of solder flux systems commonly used in the electronic industry. Changes in chemical composition and structural changes of the flux components have been investigated as a function of temperature. Six weak organic acids...

  15. High-temperature creep and hardness of eutectic 80Au/20Sn solder

    International Nuclear Information System (INIS)

    Eutectic 80Au/20Sn solder is widely used for device packaging in optoelectronic and high power electronic industries. The knowledge of thermomechanical properties of the solder is critical for design and application. In this piece of work, Berkovich depth-sensing indentation test has been used to study the effect of temperature on the hardness and the creep behavior of the 80Au/20Sn solder alloy at temperatures ranging from 25 deg. C to 200 deg. C. The results showed that the hardness of eutectic 80Au/20Sn solder decreased as temperature increased. The change of hardness with temperature in the range from 25 deg. C to 150 deg. C could be considered as linear and a temperature coefficient of hardness of -1.1 x 10-2 GPa/deg. C could be estimated; thereafter the change of hardness tapers off as the temperature increases to 200 deg. C. On the other hand, the creep penetration and creep strain rate increased and its associated stress exponent decreased with temperature, which resulted in large plastic deformation during indentation

  16. Teaching "Candide": A Debate.

    Science.gov (United States)

    Braun, Theodore E. D.; And Others

    1988-01-01

    Two different approaches to teaching Voltaire's "Candide", one deriving meaning from the textual fabric or "inside" of the story and the other focusing on the author's "external" intent in writing the story, are presented and compared. (MSE)

  17. Soldered joints—an essential component of demountable high temperature superconducting fusion magnets

    Science.gov (United States)

    Tsui, Yeekin; Surrey, Elizabeth; Hampshire, Damian

    2016-07-01

    Demountable superconducting magnet coils would offer significant benefits to commercial nuclear fusion power plants. Whether large pressed joints or large soldered joints provide the solution for demountable fusion magnets, a critical component or building block for both will be the many, smaller-scale joints that enable the supercurrent to leave the superconducting layer, cross the superconducting tape and pass into the solder that lies between the tape and the conductor that eventually provides one of the demountable surfaces. This paper considers the electrical and thermal properties of this essential component part of demountable high temperature superconducting (HTS) joints by considering the fabrication and properties of jointed HTSs consisting of a thin layer of solder (In52Sn48 or Pb38Sn62) sandwiched between two rare-earth-Ba2Cu3O7 (REBCO) second generation HTS coated conductors (CCs). The HTS joints are analysed using numerical modelling, critical current and resistivity measurements on the joints from 300 to 4.2 K in applied magnetic fields up to 12 T, as well as scanning electron microscopy studies. Our results show that the copper/silver layers significantly reduce the heating in the joints to less than a few hundred mK. When the REBCO alone is superconducting, the joint resistivity (R J) predominantly has two sources, the solder layer and an interfacial resistivity at the REBCO/silver interface (∼25 nΩ cm2) in the as-supplied CCs which together have a very weak magnetoresistance in fields up to 12 T. We achieved excellent reproducibility in the R J of the In52Sn48 soldered joints of better than 10% at temperatures below T c of the REBCO layer which can be compared to variations of more than two orders of magnitude in the literature. We also show that demountable joints in fusion energy magnets are viable and need only add a few percent to the total cryogenic cost for a fusion tokamak.

  18. Solid protein solder-doped biodegradable polymer membranes for laser-assisted tissue repair

    Science.gov (United States)

    Hodges, Diane E.; McNally-Heintzelman, Karen M.; Welch, Ashley J.

    2000-05-01

    Solid protein solder-doped polymer membranes have been developed for laser-assisted tissue repair. Biodegradable polymer films of controlled porosity were fabricated with poly(L-lactic-co-glycolic acid) (PLGA) and poly(ethylene glycol) (PEG) using a solvent-casting and particulate-leaching technique. The films provided a porous scaffold that readily absorbed the traditional protein solder mix composed of bovine serum albumin (BSA) and indocyanine green (ICG) dye. In vitro investigations were conducted to assess the influence of various processing parameters on the strength of tissue repairs formed using the new membranes. These parameters included the PLGA copolymer and PLGA/PEG blend ratio, the salt particle size, the initial bovine serum albumin (BSA) weight fraction, and the laser irradiance used to denature the solder. Altering the PLGA copolymer ratio had little effect on repair strength, however, it influenced the membrane degradation rate. Repair strength increased with increased membrane pore size and BSA concentration. The addition of PEG during the film casting stage increased the flexibility of the membranes but not necessarily the repair strength. The repair strength increased with increasing irradiance from 12 W/cm2 to 15 W/cm2. The new solder-doped polymer membranes provide all of the benefits associated with solid protein solders including high repair strength and improved edge coaptation. In addition, the flexible and moldable nature of the new membranes offer the capability of tailoring the membranes to a wide range of tissue geometries, and consequently, improved clinical applicability of laser- assisted tissue repair.

  19. [Bioinformatics-based Design of Peptide Vaccine Candidates Targeting Spike Protein of MERS-CoV and Immunity analysis in Mice].

    Science.gov (United States)

    Lan, Jiaming; Lu, Shuai; Deng, Yao; Wen, Bo; Chen, Hong; Wang, Wen; Tan, Wenjie

    2016-01-01

    Middle East respiratory syndrome coronavirus (MERS-CoV) was identified as a novel human coronavirus and posed great threat to public health world wide,which calls for the development of effective and safe vaccine urgently. In the study, peptide epitopes tagrgeting spike antigen were predicted based on bioinformatics methods. Nine polypeptides with high scores were synthesized and linked to keyhole limpet hemocyanin (KLH). Female BALB/C mice were immunized with individual polypeptide-KLH, and the total IgG was detected by ELISA as well as the cellular mediated immunity (CMI) was analyzed using ELIs-pot assay. The results showed that an individual peptide of YVDVGPDSVKSACIEVDIQQTFFDKTWPRPIDVSKADGI could induce the highest level of total IgG as well as CMI (high frequency of IFN-γ secretion) against MERS-CoV antigen in mice. Our study identified a promising peptide vaccine candidate against MERS-CoV and provided an experimental support for bioinformatics-based design of peptide vaccine.

  20. Surface Morphology Study of Nanostructured Lead-Free Solder Alloy Sn-Ag-Cu Developed by Electrodeposition: Effect of Current Density Investigation

    Directory of Open Access Journals (Sweden)

    Sakinah Mohd Yusof

    2013-10-01

    Full Text Available Normal 0 false false false IN X-NONE X-NONE MicrosoftInternetExplorer4 Nanostructured lead-free solder Sn-Ag-Cu (SAC was developed by electrodeposition method at room temperature. Electrolite bath which comprised of the predetermined quantity of tin methane sulfonate, copper sulfate and silver sulfate were added sequentially to MSA solution. The methane sulphonic acid (MSA based ternary Sn-Ag-Cu bath was developed by using tin methane sulfonate as a source of Sn ions while the Cu+ and Ag+ ions were obtained from their respective sulfate salts. The rate of the electrodeposition was controlled by variation of current density. The addition of the buffer, comprising of sodium and ammonium acetate helped in raising the pH solution. During the experimental procedure, the pH of solution, composition of the electrolite bath, and the electrodeposition time were kept constant. The electrodeposited rate, deposit composition and microstructure were investigated as the effect of current density. The electrodeposited solder alloy was characterized for their morphology using Field Emission Scanning Electron Microscope (FESEM. In conclusion, vary of current density will play significant role in the surface morphology of nanostructured lead-free solder SAC developed. Normal 0 false false false IN X-NONE X-NONE MicrosoftInternetExplorer4 /* Style Definitions */ table.MsoNormalTable {mso-style-name:"Table Normal"; mso-tstyle-rowband-size:0; mso-tstyle-colband-size:0; mso-style-noshow:yes; mso-style-priority:99; mso-style-qformat:yes; mso-style-parent:""; mso-padding-alt:0cm 5.4pt 0cm 5.4pt; mso-para-margin:0cm; mso-para-margin-bottom:.0001pt; mso-pagination:widow-orphan; font-size:11.0pt; font-family:"Calibri","sans-serif"; mso-ascii-font-family:Calibri; mso-ascii-theme-font:minor-latin; mso-fareast-font-family:"Times New Roman"; mso-fareast-theme-font:minor-fareast; mso-hansi-font-family:Calibri; mso-hansi-theme-font:minor-latin; mso-bidi-font-family:"Times New

  1. Manual Soldering Process Technology (continued)%手工软钎焊工艺技术(待续)

    Institute of Scientific and Technical Information of China (English)

    史建卫; 檀正东; 周璇; 苏立军; 杜彬

    2014-01-01

    Manual soldering is one of the basic process technologies in PCB assembly and rework. Mainly elaborate manual soldering process in detail aiming at the site requirements, soldering tools selection, process parameter setting, component assembly and repair and other related content. Provide important reference for manual soldering practitioners.%手工软钎焊是PCB组装和返修工艺中基本的工艺技术之一。主要针对现场要求、焊接工具选择、工艺参数设定、元件组装焊接及返修拆焊等相关内容,对手工软钎焊工艺技术进行详细阐述,为手工焊接从业者提供重要参考依据。

  2. Manual Soldering Process Technology (continued)%手工软钎焊工艺技术(续三)

    Institute of Scientific and Technical Information of China (English)

    史建卫; 檀正东; 周璇; 苏立军; 杜彬

    2015-01-01

    Manual soldering is one of the basic process technologies in PCB assembly and rework. Mainly elaborate manual soldering process in detail aiming at the site requirements, soldering tools selection, process parameter setting, component assembly and repair and other related content. Provide important reference for manual soldering practitioners.%手工软钎焊是PCB组装和返修工艺中基本的工艺技术之一。主要针对现场要求、焊接工具选择、工艺参数设定、元件组装焊接及返修拆焊等相关内容,对手工软钎焊工艺技术进行详细阐述,为手工焊接从业者提供重要参考依据。

  3. Manual Soldering Process Technology (continued)%手工软钎焊工艺技术(续二)

    Institute of Scientific and Technical Information of China (English)

    史建卫; 檀正东; 周璇; 苏立军; 杜彬

    2015-01-01

    Manual soldering is one of the basic process technologies in PCB assembly and rework. Mainly elaborate manual soldering process in detail aiming at the site requirements, soldering tools selection, process parameter setting, component assembly and repair and other related content. Provide important reference for manual soldering practitioners.%手工软钎焊是PCB组装和返修工艺中基本的工艺技术之一。主要针对现场要求、焊接工具选择、工艺参数设定、元件组装焊接及返修拆焊等相关内容,对手工软钎焊工艺技术进行详细阐述,为手工焊接从业者提供重要参考依据。

  4. 手工软钎焊工艺技术(续完)%Manual Soldering Process Technology ( continued )

    Institute of Scientific and Technical Information of China (English)

    史建卫; 檀正东; 周璇; 苏立军; 杜彬

    2015-01-01

    Manual soldering is one of the basic process technologies in PCB assembly and rework. Mainly elaborate manual soldering process in detail aiming at the site requirements, soldering tools selection, process parameter setting, component assembly and repair and other related content. Provide important reference for manual soldering practitioners.%手工软钎焊是PCB组装和返修工艺中基本的工艺技术之一.主要针对现场要求、焊接工具选择、工艺参数设定、元件组装焊接及返修拆焊等相关内容,对手工软钎焊工艺技术进行详细阐述,为手工焊接从业者提供重要参考依据.

  5. The Effect of Reflow on Wettability of Sn 96.5 Ag 3 Cu 0.5 Solder

    Directory of Open Access Journals (Sweden)

    Zoltán Weltsch

    2012-11-01

    Full Text Available Surface conditions on Printed Circuit Board (PCB final finishes have an important impact on the wetting behaviour with lead-free solder. The improvement of wettability in liquid Sn 96.5 Ag 3 Cu 0.5 Solder alloy on PCB substrate was measured with a sessile drop method at 523 K temperature. Wetting properties was determined in normal atmospheric air and inert atmosphere. The wetting angles increasing with the number of reflows both atmosphere. The effect of the atmosphere has a huge importance of the oxidation which manifests itself of the measured wetting angles. One of the most important factors to the wetting properties is the amount of oxygen in the soldering atmosphere. Using the inert atmosphere is crucial to Pb-free solders, particularly after reflows.

  6. Soldering of Bi-2223/Ag high temperature superconducting tapes with Sn-Pb-Bi-Ag alloy paste

    Science.gov (United States)

    Wei, Guo; Guisheng, Zou; Aiping, Wu; Hailin, Bai; Jialie, Ren

    2010-01-01

    Soldered joints of Bi-2223/Ag-sheathed high temperature superconducting multifilamentary tapes were fabricated using 63 wt.%Sn-34 wt.%Pb-1 wt.%Bi-2 wt.%Ag paste. The soldered joints were observed by scanning electron microscope (SEM) and X-ray diffraction (XRD). Moreover, the electrical properties of joints were evaluated by current-voltage curves, and the tensile strengths of the joints were also tested. The results show that the soldered joint consists of Ag sheath - Ag 3Sn compound layer - PbSn 2 and Ag 3Sn solder layer - Ag 3Sn compound layer - Ag sheath. The joints are obeyed with Ohms Law and the magnitude of the joint resistance, which deceases with the increase of the overlap length, can reach the order of 10 -8 Ω. The tensile strength of the joints with a brittle fracture mode is a little lower than that of the original tapes.

  7. Utilizing energy efficient microwave sintering to significantly enhance the tensile response of a lead-free solder

    Science.gov (United States)

    Nai, S. M. L.; Kuma, J. V. M.; Gupta, M.

    2009-01-01

    This study investigates the effects of conventional sintering and hybrid microwave sintering techniques on the microstructure evolution and tensile properties of a Sn-Ag-Cu solder. A significant energy saving of up to 99% was achieved using the hybrid microwave assisted sintering approach. Hybrid microwave sintered samples exhibited better densification (in terms of lower porosity level) and this indicates the ability of microwaves to sinter solder materials more effectively. Furthermore, tensile results revealed that samples hybrid microwave sintered at 210 °C exhibited the best enhancement in yield strength and ultimate tensile strength, with no compromise in the failure strain, as compared with other widely used commercial solders. The morphology of pores and interparticle spacing were observed to be the two key factors influencing the mechanical properties of the solders.

  8. Usolka section (southern Urals, Russia: a potential candidate for GSSP to define the base of the Gzhelian Stage in the global chronostratigraphic scale

    Directory of Open Access Journals (Sweden)

    Valery V. Chernykh

    2006-12-01

    Full Text Available Conodont species Streptognathodus simulator Ellison, 1941 has been proposed recently to define the Kasimovian-Gzhelian boundary in the global chronostratigraphic scale.The species distributed globally and traditionally has been used as a marker of the base of the Gzhelian Stage in the type sections in Moscow Basin and Urals. Recent studies of conodont taxonomy and biostratigraphy in southern Urals have established the chronocline with ascendant and descendant to Streptognathodus simulator species. Usolka section proposed here as a potential candidate for the GSSP (Global Stratotype Section and Point to define the global Gzhelian Stage at the FAD of the Streptognathodus simulator within the chronocline Streptognathodus praenuntius Chernykh, 2005 – St. simulator Ellison, 1941 – St. auritus Chernykh, 2005. The chronocline recovered within 2.7 m of beds 4 and 5 at the Usolka section, with all three species described and properly figured. No obvious interruptions in sedimentation are recorded within the Kasimovian-Gzhelian transition there. Several volcanic ash beds are present below and above the proposed boundary, making radiometric calibration highly possible in the near future. Mode of preservation of conodonts with a CAI of around 1.0–1.5 provides excellent basis for the geochemical studies. Accessibility presently is adequate, and this exposure will be improved and maintained permanently for interested scientists. Future access will be guaranteed by means of legislative action to create a scientific preserve.

  9. ZDHHC8 as a candidate gene for schizophrenia: Analysis of a putative functional intronic marker in case-control and family-based association studies

    Directory of Open Access Journals (Sweden)

    Jabs Burkhard

    2005-10-01

    Full Text Available Abstract Background The chromosome 22q11 region is proposed as a major candidate locus for susceptibility genes to schizophrenia. Recently, the gene ZDHHC8 encoding a putative palmitoyltransferase at 22q11 was proposed to increase liability to schizophrenia based on both animal models and human association studies by significant over-transmission of allele rs175174A in female, but not male subjects with schizophrenia. Methods Given the genetic complexity of schizophrenia and the potential genetic heterogeneity in different populations, we examined rs175174 in 204 German proband-parent triads and in an independent case-control study (schizophrenic cases: n = 433; controls: n = 186. Results In the triads heterozygous parents transmitted allele G preferentially to females, and allele A to males (heterogeneity χ2 = 4.43; p = 0.035. The case-control sample provided no further evidence for overall or gender-specific effects regarding allele and genotype frequency distributions. Conclusion The findings on rs175174 at ZDHHC8 are still far from being conclusive, but evidence for sexual dimorphism is moderate, and our data do not support a significant genetic contribution of rs175174 to the aetiopathogenesis of schizophrenia.

  10. TAXONOMY AND BIOSTRATIGRAPHIC RECORD OF THE UPPER TRIASSIC CONODONTS OF THE PIZZO MONDELLO SECTION (WESTERN SICILY, ITALY, GSSP CANDIDATE FOR THE BASE OF THE NORIAN

    Directory of Open Access Journals (Sweden)

    MICHELE MAZZA

    2012-03-01

    Full Text Available New taxonomic and biostratigraphic investigations on the late Carnian to Rhaetian (Upper Triassic platform conodonts from the Pizzo Mondello section (Western Sicily, Italy, Sicano basin are here presented. Pizzo Mondello is one of the two GSSP candidates for the Carnian/Norian boundary; the section is a 430 m thick continuous succession of upper Carnian to upper Norian marine limestones (Scillato Formation, characterized by uniform facies and high sedimentation rates, and ca. 20 m of Rhaetian white calcilutites (Portella Gebbia limestone. Pizzo Mondello offers one of the most complete conodont records for this time interval in the Tethys. The conodont faunas are characterized by a large variety of species, belonging to the genera Carnepigondolella, Epigondolella, Metapolygnathus, Misikella, Mockina, Neocavitella, Norigondolella, Paragondolella, and Parvigondolella. The richness of the populations allowed a detailed revision and description of all the Upper Triassic species and morphotypes recovered. The revision of the problematic species Carnepigondolella nodosa and "Metapolygnathus communisti B" was thus possible, leading to the establishment of two new species: Carnepigondolella tuvalica n.sp. and Carnepigondolella gulloae n.sp. The latter species would be a good proxy for the Carnian/Norian boundary in the case that the FAD of Halobia austriaca (sample FNP135a will be selected as the primary biomarker for the base of the Norian. 

  11. Protection against multiple influenza A virus strains induced by candidate recombinant vaccine based on heterologous M2e peptides linked to flagellin.

    Directory of Open Access Journals (Sweden)

    Liudmila A Stepanova

    Full Text Available Matrix 2 protein ectodomain (M2e is considered a promising candidate for a broadly protective influenza vaccine. M2e-based vaccines against human influenza A provide only partial protection against avian influenza viruses because of differences in the M2e sequences. In this work, we evaluated the possibility of obtaining equal protection and immune response by using recombinant protein on the basis of flagellin as a carrier of the M2e peptides of human and avian influenza A viruses. Recombinant protein was generated by the fusion of two tandem copies of consensus M2e sequence from human influenza A and two copies of M2e from avian A/H5N1 viruses to flagellin (Flg-2M2eh2M2ek. Intranasal immunisation of Balb/c mice with recombinant protein significantly elicited anti-M2e IgG in serum, IgG and sIgA in BAL. Antibodies induced by the fusion protein Flg-2M2eh2M2ek bound efficiently to synthetic peptides corresponding to the human consensus M2e sequence as well as to the M2e sequence of A/Chicken/Kurgan/05/05 RG (H5N1 and recognised native M2e epitopes exposed on the surface of the MDCK cells infected with A/PR/8/34 (H1N1 and A/Chicken/Kurgan/05/05 RG (H5N1 to an equal degree. Immunisation led to both anti-M2e IgG1 and IgG2a response with IgG1 prevalence. We observed a significant intracellular production of IL-4, but not IFN-γ, by CD4+ T-cells in spleen of mice following immunisation with Flg-2M2eh2M2ek. Immunisation with the Flg-2M2eh2M2ek fusion protein provided similar protection from lethal challenge with human influenza A viruses (H1N1, H3N2 and avian influenza virus (H5N1. Immunised mice experienced significantly less weight loss and decreased lung viral titres compared to control mice. The data obtained show the potential for the development of an M2e-flagellin candidate influenza vaccine with broad spectrum protection against influenza A viruses of various origins.

  12. Influence of Dopant on Growth of Intermetallic Layers in Sn-Ag-Cu Solder Joints

    Science.gov (United States)

    Li, G. Y.; Bi, X. D.; Chen, Q.; Shi, X. Q.

    2011-02-01

    The interfacial interaction between Cu substrates and Sn-3.5Ag-0.7Cu- xSb ( x = 0, 0.2, 0.5, 0.8, 1.0, 1.5, and 2.0) solder alloys has been investigated under different isothermal aging temperatures of 100°C, 150°C, and 190°C. Scanning electron microscopy (SEM) was used to measure the thickness of the intermetallic compound (IMC) layer and observe the microstructural evolution of the solder joints. The IMC phases were identified by energy-dispersive x-ray spectroscopy (EDX) and x-ray diffractometry (XRD). The growth of both the Cu6Sn5 and Cu3Sn IMC layers at the interface between the Cu substrate and the solder fits a power-law relationship with the exponent ranging from 0.42 to 0.83, which suggests that the IMC growth is primarily controlled by diffusion but may also be influenced by interface reactions. The activation energies and interdiffusion coefficients of the IMC formation of seven solder alloys were determined. The addition of Sb has a strong influence on the growth of the Cu6Sn5 layer, but very little influence on the formation of the Cu3Sn IMC phase. The thickness of the Cu3Sn layer rapidly increases with aging time and temperature, whereas the thickness of the Cu6Sn5 layer increases slowly. This is probably due to the formation of Cu3Sn at the interface between two IMC phases, which occurs with consumption of Cu6Sn5. Adding antimony to Sn-3.5Ag-0.7Cu solder can evidently increase the activation energy of Cu6Sn5 IMC formation, reduce the atomic diffusion rate, and thus inhibit excessive growth of Cu6Sn5 IMCs. This study suggests that grain boundary pinning is one of the most important mechanisms for inhibiting the growth of Cu6Sn5 IMCs in such solder joints when Sb is added.

  13. Wetting Behavior and Interfacial Reactions in (Sn-9Zn)-2Cu/Ni Joints during Soldering and Isothermal Aging

    Institute of Scientific and Technical Information of China (English)

    Ning Zhao; Haitao Ma; Haiping Xie; Lai Wang

    2009-01-01

    The wetting property of (Sn-9Zn)-2Cu (wt pct) on Ni substrate and the evolution of interfacial microstructure in (Sn-9Zn)-2Cu/Ni joints during soldering as well as isothermal aging were studied.The wetting ability of eutectic Sn-9Zn solder on Ni substrate was markedly improved by adding 2 wt pct Cu into this solder alloy.Plate-like Cu5Zn8 intermetallic compounds (IMCs) were detected in (Sn-9Zn)-2Cu solder matrix.A continuous Ni5Zn21 IMC layer was formed at (Sn-9Zn)-2Cu/Ni interface after soldering.This IMC layer kept its type and integrality even after aging at 170℃ for up to 1000 h.At the early aging stage (before 500 h), the IMC layer grew fast and its thickness followed a linear relationship with the square root of aging time.Thereafter,however, the thickness increased very slowly with longer aging time.When the joints were aged for 1000 h,a new IMC phase, (Cu,Ni)5Zn8, was found in the matrix near the interface.The formation of (Cu,Ni)5Zn8phase can be attributed to the diffusion of Ni atoms into the solder matrix from the substrate.

  14. Enhancement on wettability and intermetallic compound formation with an addition of Al on Sn-0.7Cu lead-free solder fabricated via powder metallurgy method

    Science.gov (United States)

    Adli, Nisrin; Razak, Nurul Razliana Abdul; Saud, Norainiza

    2016-07-01

    Due to the toxicity of lead (Pb), the exploration of another possibility for lead-free solder is necessary. Nowadays, SnCu alloys are being established as one of the lead-free solder alternatives. In this study, Sn-0.7Cu lead-free solder with an addition of 1wt% and 5wt% Al were investigated by using powder metallurgy method. The effect of Al addition on the wettability and intermetallic compound thickness (IMC) of Sn-0.7Cu-Al lead-free solder were appraised. Results showed that Al having a high potential to enhance Sn-0.7Cu lead-free solder due to its good wetting and reduction of IMC thickness. The contact angle and IMC of the Sn-0.7Cu-Al lead-free solder were decreased by 14.32% and 40% as the Al content increased from 1 wt% to 5 wt%.

  15. Genetic dissection of drought and heat tolerance in chickpea through genome-wide and candidate gene-based association mapping approaches.

    Science.gov (United States)

    Thudi, Mahendar; Upadhyaya, Hari D; Rathore, Abhishek; Gaur, Pooran Mal; Krishnamurthy, Lakshmanan; Roorkiwal, Manish; Nayak, Spurthi N; Chaturvedi, Sushil Kumar; Basu, Partha Sarathi; Gangarao, N V P R; Fikre, Asnake; Kimurto, Paul; Sharma, Prakash C; Sheshashayee, M S; Tobita, Satoshi; Kashiwagi, Junichi; Ito, Osamu; Killian, Andrzej; Varshney, Rajeev Kumar

    2014-01-01

    To understand the genetic basis of tolerance to drought and heat stresses in chickpea, a comprehensive association mapping approach has been undertaken. Phenotypic data were generated on the reference set (300 accessions, including 211 mini-core collection accessions) for drought tolerance related root traits, heat tolerance, yield and yield component traits from 1-7 seasons and 1-3 locations in India (Patancheru, Kanpur, Bangalore) and three locations in Africa (Nairobi, Egerton in Kenya and Debre Zeit in Ethiopia). Diversity Array Technology (DArT) markers equally distributed across chickpea genome were used to determine population structure and three sub-populations were identified using admixture model in STRUCTURE. The pairwise linkage disequilibrium (LD) estimated using the squared-allele frequency correlations (r2; when r2<0.20) was found to decay rapidly with the genetic distance of 5 cM. For establishing marker-trait associations (MTAs), both genome-wide and candidate gene-sequencing based association mapping approaches were conducted using 1,872 markers (1,072 DArTs, 651 single nucleotide polymorphisms [SNPs], 113 gene-based SNPs and 36 simple sequence repeats [SSRs]) and phenotyping data mentioned above employing mixed linear model (MLM) analysis with optimum compression with P3D method and kinship matrix. As a result, 312 significant MTAs were identified and a maximum number of MTAs (70) was identified for 100-seed weight. A total of 18 SNPs from 5 genes (ERECTA, 11 SNPs; ASR, 4 SNPs; DREB, 1 SNP; CAP2 promoter, 1 SNP and AMDH, 1SNP) were significantly associated with different traits. This study provides significant MTAs for drought and heat tolerance in chickpea that can be used, after validation, in molecular breeding for developing superior varieties with enhanced drought and heat tolerance. PMID:24801366

  16. Genetic dissection of drought and heat tolerance in chickpea through genome-wide and candidate gene-based association mapping approaches.

    Directory of Open Access Journals (Sweden)

    Mahendar Thudi

    Full Text Available To understand the genetic basis of tolerance to drought and heat stresses in chickpea, a comprehensive association mapping approach has been undertaken. Phenotypic data were generated on the reference set (300 accessions, including 211 mini-core collection accessions for drought tolerance related root traits, heat tolerance, yield and yield component traits from 1-7 seasons and 1-3 locations in India (Patancheru, Kanpur, Bangalore and three locations in Africa (Nairobi, Egerton in Kenya and Debre Zeit in Ethiopia. Diversity Array Technology (DArT markers equally distributed across chickpea genome were used to determine population structure and three sub-populations were identified using admixture model in STRUCTURE. The pairwise linkage disequilibrium (LD estimated using the squared-allele frequency correlations (r2; when r2<0.20 was found to decay rapidly with the genetic distance of 5 cM. For establishing marker-trait associations (MTAs, both genome-wide and candidate gene-sequencing based association mapping approaches were conducted using 1,872 markers (1,072 DArTs, 651 single nucleotide polymorphisms [SNPs], 113 gene-based SNPs and 36 simple sequence repeats [SSRs] and phenotyping data mentioned above employing mixed linear model (MLM analysis with optimum compression with P3D method and kinship matrix. As a result, 312 significant MTAs were identified and a maximum number of MTAs (70 was identified for 100-seed weight. A total of 18 SNPs from 5 genes (ERECTA, 11 SNPs; ASR, 4 SNPs; DREB, 1 SNP; CAP2 promoter, 1 SNP and AMDH, 1SNP were significantly associated with different traits. This study provides significant MTAs for drought and heat tolerance in chickpea that can be used, after validation, in molecular breeding for developing superior varieties with enhanced drought and heat tolerance.

  17. Primary and Presidential Candidates

    DEFF Research Database (Denmark)

    Goddard, Joseph

    2012-01-01

    This article looks at primary and presidential candidates in 2008 and 2012. Evidence suggests that voters are less influenced by candidates’ color, gender, or religious observation than previously. Conversely, markers of difference remain salient in the imaginations of pollsters and journalists...

  18. 热循环条件下SnAgCu钎料损伤行为的研究%Damage Behavior of SnAgCu Solder under Thermal Cycling

    Institute of Scientific and Technical Information of China (English)

    肖慧; 李晓延; 严永长; 刘娜; 史耀武

    2013-01-01

    The failure of solder joints under thermal cycling is mainly as a result of progressive damage process of solder materials.The objective of this study was to investigate the damage behavior of SnAgCu solder under thermal cycling condition.A damage model was proposed and employed to simulate the thermal cycling behavior of SnAgCu solder.The proposed damage evolution law was based on continuum damage mechanics and an interaction between creep and fatigue.Thermo-mechanical cycling and thermal cycling tests were conducted for model parameter determination.A special bimetallic load frame with single joint-shear solder sample was designed and used to study the damage evolution behavior of SnAgCu solder.The damage variable D=1-R0/R was selected and measured for the single joint-shear solder sample every dozens of cycles during thermal cycling tests to verify the model.The damage evolution law was deduced as power function with thermal cycles and the results show that the experimental damage data can be fitted reasonably well by the relationship as the damage model proposed.The microstructure evolution of SnAgCu solder under thermal cycling was observed by Scanning Electron Microscopy and the damage mechanism was analyzed.%电子封装焊点的热循环失效是焊点材料损伤逐步发展的结果,本工作旨在对SnAgCu钎料的热循环损伤失效行为进行研究.以连续损伤力学理论为基础,提出了一种适用于热循环条件下SnAgCu钎料蠕变-疲劳交互作用的损伤模型.据此,设计了热力循环实验和热循环实验用以标定损伤模型相关参量.自行设计了双金属剪切加载装置并结合温度循环实验,对SnAgCu钎料的热力耦合损伤行为进行了深入研究.以电阻变化率作为损伤变量,并在热循环的不同周次测量试样的损伤值从而验证损伤模型.结果表明:所提出的幂函数形式的损伤模型能较好的描述SnAgCu钎料的热循环损伤演变.最后,对热循环条件下Sn

  19. Rate-dependent Constitutive Model for Lead-free Solders Considering Damage Effect%考虑损伤效应的无铅焊锡材料的率相关本构模型

    Institute of Scientific and Technical Information of China (English)

    秦飞; 安彤; 王旭明

    2013-01-01

    In this paper, the damage effect was considered into the impact process of lead-free solder specimens. Based on the experimental data, the modified rate-dependent Johnson-Cook model for the Sn3.OAgO.5Cu and Sn3. 5Ag lead-free solders were derived. The stress-strain curves obtained from the modified Johnson-Cook material models and the experiments agreed quite well with each other. It indicates that presented modified Johnson-Cook models are suitable to describe the dynamic behavior of the two lead-free solder materials.%考虑冲击过程中无铅焊锡材料试件中的损伤影响,根据实验数据确定了损伤演化参数,对原模型进行了修正,给出了Sn3.0Ag0.5Cu和Sn3.5Ag两种无铅焊锡材料考虑损伤效应的率相关本构模型.结果表明,修正后的模型与实验结果吻合较好.

  20. Reaction Between Thin Gold Wires and Pb-Sn-In Solder (37.5%, 37.5%, 25%), Part A: The Radial Reaction Inside The Solder Mounds, Its Linear Reaction Model, Statistical Variation of Reaction Rate, and Induced Structural Changes In The Solder Mounds.

    Energy Technology Data Exchange (ETDEWEB)

    Siekhaus, W J

    2011-01-19

    Thermodynamics favors the reaction between indium and gold, since the heat of formation of AuIn{sub 2} is 6 kcal/mole, substantially larger than the heat of formation of any other possible reaction product. Thermodynamic equilibrium between gold and the elements in the solder mound is reached only when ALL gold is converted to AuIn{sub 2}. There are two aspects to this conversion: (A) the reaction WITHIN the solder mound (called here 'radial reaction') and (B) the reaction OUTSIDE the solder mound (called here 'axial reaction') and the transition from (A) to (B). The reaction between thin gold detonator wires and the In/Pb/Sn solder mound in older detonators has been looked at repeatedly. There are, in addition, two studies which look at the reaction between indium and gold in planar geometry. All data are shown in tables I to V. It is the objective of this section dealing with aspect (A), to combine all of these results into a reaction model and to use this reaction model to reliably and conservatively predict the gold-solder reaction rate of soldered gold bridge-wires as a function of storage temperature and time.

  1. On-line Testing of Faults in Solder Joint Networks of FPGA%FPGA焊点网络失效的在线测试

    Institute of Scientific and Technical Information of China (English)

    黄锋; 王建业

    2012-01-01

    Based on analyzing physics of failure in solder-joint networks of FPGA with BGA packaging,a built-in self-testing ( SJBIST) method for faults in solder joint networks was proposed. The test results show that this theory-supported sensor can accurately discover and report the high-resistivity faults not less than 100Ω. This provides a practical approach for the FPGA application-oriented failure prediction.%在分析BGA封装型FPGA焊点网络失效机理的基础上,提出一种焊点内建自测试(SJ BIST)方法,用于对焊点网络失效的在线测试.结果表明:该原理实现的传感器能准确发现并报告不小于100Ω的高阻值失效,为FPGA面向应用的故障预测提供了一种可行的发展方向.

  2. Fluxless eutectic bonding of GaAs-on-Si by using Ag/Sn solder

    Science.gov (United States)

    Eo, Sung-Hwa; Kim, Dae-Seon; Jeong, Ho-Jung; Jang, Jae-Hyung

    2013-11-01

    Fluxless GaAs-on-Si wafer bonding using Ag/Sn solder was investigated to realize uniform and void-free heterogeneous material integration. The effects of the diffusion barrier, Ag/Sn thickness, and Ar plasma treatment were studied to achieve the optimal fluxless bonding process. Pt on a GaAs wafer and Mo on a Si wafer act as diffusion barriers by preventing the flow of Ag/Sn solder into both the wafers. The bonding strength is closely related to the Ag/Sn thickness and Ar plasma treatment. A shear strength test was carried out to investigate the bonding strength. Under identical bonding conditions, the Ag/Sn thickness was optimized to achieve higher bonding strength and to avoid the formation of voids due to thermal stress. An Ar plasma pretreatment process improved the bonding strength because the Ar plasma removed carbon contaminants and metal-oxide bonds from the metal surface.

  3. Intense generation of respirable metal nanoparticles from a low-power soldering unit

    Energy Technology Data Exchange (ETDEWEB)

    Gómez, Virginia [Department of Chemical Engineering, Nanoscience Institute of Aragon (INA), 50018 Zaragoza (Spain); Irusta, Silvia [Department of Chemical Engineering, Nanoscience Institute of Aragon (INA), 50018 Zaragoza (Spain); Networking Biomedical Research Center of Bioengineering, Biomaterials and Nanomedicine (CIBER-BBN), 50018 Zaragoza (Spain); Balas, Francisco [Networking Biomedical Research Center of Bioengineering, Biomaterials and Nanomedicine (CIBER-BBN), 50018 Zaragoza (Spain); Instituto de Carboquímica – Consejo Superior de Investigaciones Científicas (ICB-CSIC), 50018 Zaragoza (Spain); Santamaria, Jesus, E-mail: Jesus.Santamaria@unizar.es [Department of Chemical Engineering, Nanoscience Institute of Aragon (INA), 50018 Zaragoza (Spain); Networking Biomedical Research Center of Bioengineering, Biomaterials and Nanomedicine (CIBER-BBN), 50018 Zaragoza (Spain)

    2013-07-15

    Highlights: • Intense generation of nanoparticles in the breathing range from a flux-soldering unit is detected. • Coagulation in the aerosol phase leads to 200-nm respirable nanoparticles up to 30 min after operation. • Nanoparticle concentration in the working environment depends on the presence of ambient air. • Metal-containing nanoparticles are collected in TEM grids and filters in the hundreds of nanometer range. -- Abstract: Evidence of intense nanoparticle generation from a low power (45 W) flux soldering unit is presented. This is a familiar device often used in daily life, including home repairs and school electronic laboratories. We demonstrate that metal-containing nanoparticles may reach high concentrations (ca. 10{sup 6} particles/cm{sup 3}) within the breathing range of the operator, with initial size distributions centered at 35–60 nm The morphological and chemical analysis of nanoparticle agglomerates collected on TEM grids and filters confirms their multiparticle structure and the presence of metals.

  4. Appendix to the report from the low-residue soldering task force: Phase 2 results

    Energy Technology Data Exchange (ETDEWEB)

    Iman, R.L.; Anderson, D.J.; Huffman, D.D. [and others

    1995-12-01

    The LRSTF report for Phase I of its evaluation of low-residue soldering was issued in June 1995. This Appendix summarizes the results of follow-on testing performed in Phase II and compares electrical test results for both phases. Deliberate decisions were made by the LRSTF in Phase I to challenge the design guideline limits in MILSTD-275, Printed Wiring for Electronic Equipment The LRSTF considered this approach to produce a ``worst case`` design and provide useful information about the robustness of LR soldering processes. As such, good design practices were sometimes deliberately violated in designing the LRSTF board. This approach created some anomalies for both LR boards and RMA/cleaned controls. Phase II testing verified that problems that affected both RMA/cleaned and LR boards in Phase I were design related.

  5. Diode Lasers used in Plastic Welding and Selective Laser Soldering - Applications and Products

    Science.gov (United States)

    Reinl, S.

    Aside from conventional welding methods, laser welding of plastics has established itself as a proven bonding method. The component-conserving and clean process offers numerous advantages and enables welding of sensitive assemblies in automotive, electronic, medical, human care, food packaging and consumer electronics markets. Diode lasers are established since years within plastic welding applications. Also, soft soldering using laser radiation is becoming more and more significant in the field of direct diode laser applications. Fast power controllability combined with a contactless temperature measurement to minimize thermal damage make the diode laser an ideal tool for this application. These advantages come in to full effect when soldering of increasingly small parts in temperature sensitive environments is necessary.

  6. An Organic Metal/Silver Nanoparticle Finish on Copper for Efficient Passivation and Solderability Preservation

    Directory of Open Access Journals (Sweden)

    Wessling Bernhard

    2007-01-01

    Full Text Available AbstractFor the first time, a complex formed by polyaniline (in its organic metal form and silver has been deposited on copper in nanoparticulate form. When depositing on Cu pads of printed circuit boards it efficiently protects against oxidation and preserves its solderability. The deposited layer has a thickness of only nominally 50 nm, containing the Organic Metal (conductive polymer, polyaniline, and silver. With >90% (by volume, polyaniline (PAni is the major component of the deposited layer, Ag is present equivalent to a 4 nm thickness. The Pani–Ag complex is deposited on Cu in form of about 100 nm small particles. Morphology, electrochemical characteristics, anti-oxidation and solderability results are reported.

  7. A Novel and Facile Method to Prepare Integrated Electrospun Nanofibrous Membrane with Soldered Junctions.

    Science.gov (United States)

    Shen, Lingdi; Chen, Jiajia; Hong, Guishan; Wang, Xuefen

    2016-01-01

    Integrated electrospun nanofibrous membrane was prepared by creating soldered junctions between nanofibers via a facile strategy. Polyacrylonitrile (PAN) mixed with poly(vinylidene fluoride) (PVDF) at different ratios of PVDF were prepared in N,N'-dimethyl formamide (DMF), then electrospun to fabricate PAN/PVDF membranes. PVDF can form microgels in DMF which slows down volatile speed of DMF and affects the solidification of PAN/PVDF nanofibers. The resulting membranes were investigated by Fourier transform infrared spectroscopy, scanning electron microscopy, dynamic water contact angle and tensile testing to confirm the morphology and mechanical properties. Soldered junctions were observed between nanofibers with the increase of PVDF content. These junctions made the membrane integrated and greatly enhanced tensile strength from 5.1 to 8.1 MPa (increased by ~60%) and tensile modulus from 49.4 to 117.9 MPa (increased by ~139%) without compromising porosity when the content of PVDF increased from 0 to 60 wt%. PMID:27398532

  8. Identification of candidate agents active against N. ceranae infection in honey bees: establishment of a medium throughput screening assay based on N. ceranae infected cultured cells.

    Directory of Open Access Journals (Sweden)

    Sebastian Gisder

    Full Text Available Many flowering plants in both natural ecosytems and agriculture are dependent on insect pollination for fruit set and seed production. Managed honey bees (Apis mellifera and wild bees are key pollinators providing this indispensable eco- and agrosystem service. Like all other organisms, bees are attacked by numerous pathogens and parasites. Nosema apis is a honey bee pathogenic microsporidium which is widely distributed in honey bee populations without causing much harm. Its congener Nosema ceranae was originally described as pathogen of the Eastern honey bee (Apis cerana but jumped host from A. cerana to A. mellifera about 20 years ago and spilled over from A. mellifera to Bombus spp. quite recently. N. ceranae is now considered a deadly emerging parasite of both Western honey bees and bumblebees. Hence, novel and sustainable treatment strategies against N. ceranae are urgently needed to protect honey and wild bees. We here present the development of an in vitro medium throughput screening assay for the identification of candidate agents active against N. ceranae infections. This novel assay is based on our recently developed cell culture model for N. ceranae and coupled with an RT-PCR-ELISA protocol for quantification of N. ceranae in infected cells. The assay has been adapted to the 96-well microplate format to allow automated analysis. Several substances with known (fumagillin or presumed (surfactin or no (paromomycin activity against N. ceranae were tested as well as substances for which no data concerning N. ceranae inhibition existed. While fumagillin and two nitroimidazoles (metronidazole, tinidazole totally inhibited N. ceranae proliferation, all other test substances were inactive. In summary, the assay proved suitable for substance screening and demonstrated the activity of two synthetic antibiotics against N. ceranae.

  9. Planetary Candidates Observed by Kepler. VII. The First Fully Uniform Catalog Based on the Entire 48-month Data Set (Q1-Q17 DR24)

    Science.gov (United States)

    Coughlin, Jeffrey L.; Mullally, F.; Thompson, Susan E.; Rowe, Jason F.; Burke, Christopher J.; Latham, David W.; Batalha, Natalie M.; Ofir, Aviv; Quarles, Billy L.; Henze, Christopher E.; Wolfgang, Angie; Caldwell, Douglas A.; Bryson, Stephen T.; Shporer, Avi; Catanzarite, Joseph; Akeson, Rachel; Barclay, Thomas; Borucki, William J.; Boyajian, Tabetha S.; Campbell, Jennifer R.; Christiansen, Jessie L.; Girouard, Forrest R.; Haas, Michael R.; Howell, Steve B.; Huber, Daniel; Jenkins, Jon M.; Li, Jie; Patil-Sabale, Anima; Quintana, Elisa V.; Ramirez, Solange; Seader, Shawn; Smith, Jeffrey C.; Tenenbaum, Peter; Twicken, Joseph D.; Zamudio, Khadeejah A.

    2016-05-01

    We present the seventh Kepler planet candidate (PC) catalog, which is the first catalog to be based on the entire, uniformly processed 48-month Kepler data set. This is the first fully automated catalog, employing robotic vetting procedures to uniformly evaluate every periodic signal detected by the Q1-Q17 Data Release 24 (DR24) Kepler pipeline. While we prioritize uniform vetting over the absolute correctness of individual objects, we find that our robotic vetting is overall comparable to, and in most cases superior to, the human vetting procedures employed by past catalogs. This catalog is the first to utilize artificial transit injection to evaluate the performance of our vetting procedures and to quantify potential biases, which are essential for accurate computation of planetary occurrence rates. With respect to the cumulative Kepler Object of Interest (KOI) catalog, we designate 1478 new KOIs, of which 402 are dispositioned as PCs. Also, 237 KOIs dispositioned as false positives (FPs) in previous Kepler catalogs have their disposition changed to PC and 118 PCs have their disposition changed to FPs. This brings the total number of known KOIs to 8826 and PCs to 4696. We compare the Q1-Q17 DR24 KOI catalog to previous KOI catalogs, as well as ancillary Kepler catalogs, finding good agreement between them. We highlight new PCs that are both potentially rocky and potentially in the habitable zone of their host stars, many of which orbit solar-type stars. This work represents significant progress in accurately determining the fraction of Earth-size planets in the habitable zone of Sun-like stars. The full catalog is publicly available at the NASA Exoplanet Archive.

  10. Identification of candidate agents active against N. ceranae infection in honey bees: establishment of a medium throughput screening assay based on N. ceranae infected cultured cells.

    Science.gov (United States)

    Gisder, Sebastian; Genersch, Elke

    2015-01-01

    Many flowering plants in both natural ecosytems and agriculture are dependent on insect pollination for fruit set and seed production. Managed honey bees (Apis mellifera) and wild bees are key pollinators providing this indispensable eco- and agrosystem service. Like all other organisms, bees are attacked by numerous pathogens and parasites. Nosema apis is a honey bee pathogenic microsporidium which is widely distributed in honey bee populations without causing much harm. Its congener Nosema ceranae was originally described as pathogen of the Eastern honey bee (Apis cerana) but jumped host from A. cerana to A. mellifera about 20 years ago and spilled over from A. mellifera to Bombus spp. quite recently. N. ceranae is now considered a deadly emerging parasite of both Western honey bees and bumblebees. Hence, novel and sustainable treatment strategies against N. ceranae are urgently needed to protect honey and wild bees. We here present the development of an in vitro medium throughput screening assay for the identification of candidate agents active against N. ceranae infections. This novel assay is based on our recently developed cell culture model for N. ceranae and coupled with an RT-PCR-ELISA protocol for quantification of N. ceranae in infected cells. The assay has been adapted to the 96-well microplate format to allow automated analysis. Several substances with known (fumagillin) or presumed (surfactin) or no (paromomycin) activity against N. ceranae were tested as well as substances for which no data concerning N. ceranae inhibition existed. While fumagillin and two nitroimidazoles (metronidazole, tinidazole) totally inhibited N. ceranae proliferation, all other test substances were inactive. In summary, the assay proved suitable for substance screening and demonstrated the activity of two synthetic antibiotics against N. ceranae.

  11. Evaluation and Selection of Bacillus Species Based on Enzyme Production, Antimicrobial Activity, and Biofilm Synthesis as Direct-Fed Microbial Candidates for Poultry

    Science.gov (United States)

    Latorre, Juan D.; Hernandez-Velasco, Xochitl; Wolfenden, Ross E.; Vicente, Jose L.; Wolfenden, Amanda D.; Menconi, Anita; Bielke, Lisa R.; Hargis, Billy M.; Tellez, Guillermo

    2016-01-01

    Social concern about misuse of antibiotics as growth promoters (AGP) and generation of multidrug-resistant bacteria have restricted the dietary inclusion of antibiotics in livestock feed in several countries. Direct-fed microbials (DFM) are one of the multiple alternatives commonly evaluated as substitutes of AGP. Sporeformer bacteria from the genus Bacillus have been extensively investigated because of their extraordinary properties to form highly resistant endospores, produce antimicrobial compounds, and synthesize different exogenous enzymes. The purpose of the present study was to evaluate and select Bacillus spp. from environmental and poultry sources as DFM candidates, considering their enzyme production profile, biofilm synthesis capacity, and pathogen-inhibition activity. Thirty-one Bacillus isolates were screened for in vitro relative enzyme activity of amylase, protease, lipase, and phytase using a selective media for each enzyme, with 3/31 strains selected as superior enzyme producers. These three isolates were identified as Bacillus subtilis (1/3), and Bacillus amyloliquefaciens (2/3), based on biochemical tests and 16S rRNA sequence analysis. For evaluation of biofilm synthesis, the generation of an adherent crystal violet-stained ring was determined in polypropylene tubes, resulting in 11/31 strains showing a strong biofilm formation. Moreover, all Bacillus strains were evaluated for growth inhibition activity against Salmonella enterica serovar Enteritidis (26/31), Escherichia coli (28/31), and Clostridioides difficile (29/31). Additionally, in previous in vitro and in vivo studies, these selected Bacillus strains have shown to be resistant to different biochemical conditions of the gastrointestinal tract of poultry. Results of the present study suggest that the selection and consumption of Bacillus-DFM, producing a variable set of enzymes and antimicrobial compounds, may contribute to enhanced performance through improving nutrient digestibility

  12. Experimental and mechanical characterizations of a lead free solder alloy for electronic devices

    OpenAIRE

    Msolli, Sabeur; Dalverny, Olivier; Alexis, Joël; Karama, Moussa

    2012-01-01

    International audience Electronic power modules devices are paramount components in the aeronautical,automotive and military applications. The solder layers are the most critical parts of the module and are usually subjected in their whole life to complex loading conditions. To improve the design task, realistic thermoelastoviscoplastic and lifetime prediction models which can describe efficiently the deformation-damage of the electrical device must be chosen carefully. Some of the most co...

  13. Solder self-assembled, surface micromachined MEMS for micromirror applications and atom trapping

    Science.gov (United States)

    McCarthy, Brian

    Solder self-assembly can be used to expand the versatility of a commercial foundry, like MEMSCAP's PolyMUMPs process. These foundries are attractive for prototyping MEMS as they can offer consistent, low cost fabrication runs by sticking to a single process and integrating multiple customers on each wafer. However, this standardization limits the utility of the process for a given application. Solder self-assembly gives back some of this versatility and expands the envelope of surface micromachining capability in the form of a simple post-process step. Here it is used to create novel micromirrors and micromirror arrays as well as to delve into the field of ultracold atom optics where the utility of MEMS as an enabling technology for atom control is explored. Two types of torsional, electrostatic micromirrors are demonstrated, both of which can achieve +/-10° of rotation. The first is a novel out-of-plane micromirror that can be rotated to a desired angle from the substrate. This integrated, on-chip assembly allows much simpler packaging technology to be used for devices that require a laser beam to be steered off-chip. Planar micromirror arrays that use solder self-assembly to tailor the electrode gap height are also demonstrated. With these designs, no special fabrication techniques are required to achieve large gap heights, and micromirrors with a variety of gap heights can even be fabricated on the same chip. Finally, solder self-assembly is used to explore how complex micro-scale structures can be used to control ultracold atoms. For this study, a MEMS version of a magneto-optical trap, the basis for most ultracold atomic systems, is used to control Rb atoms. In doing so, it provides a path for the successful integration of a number of MEMS devices in these types of systems.

  14. High temperature indentation behavior of eutectic lead-free solder materials

    OpenAIRE

    Worrack H.; Müllera W.H.

    2010-01-01

    Electronic malfunction caused by thermal stresses is one major problem in modern electronic industries. Therefore, the precise knowledge of the mechanical solder material properties as a function of temperature is required. Nanoindentation and its potential of recording load-displacement curves is a widely-used miniature test for the determination of Young’s modulus and hardness values. Furthermore, such tests can be performed in a temperature range from Room Temperature (RT) up to +500...

  15. Oral Candidal Colonization in the Patients with RPDs by Different Base Materials%RPDs基托材料对口腔念珠菌定植的影响

    Institute of Scientific and Technical Information of China (English)

    姜薇; 陈骏; 吴凌莉; 何祥一; 车团结

    2011-01-01

    目的:初步研究可摘局部义齿(RPDs)不同基托材料对口腔念珠菌的定植的影响.方法:临床随机选择RPDs修复患者147例.其中树脂基托义齿(A组)58例,钴铬合金铸造基托义齿(B组)63例,纯钛及钛合金铸造基托义齿(C组)26例.吐唾法取样,用CHROMagar培养基鉴定念珠菌菌种.培养基中念珠菌菌落计数为每个样本的念珠菌检出强度.通过统计学方法,比较3组不同基托材料义齿戴用人群念珠菌检出率和检出强度的差异.结果:147例不同基托材料义齿戴用人群中检出的念珠菌包括白色念珠菌、热带念珠菌、克柔念珠菌3个菌种.A、B、C组白色念珠菌和非白色念珠菌检出率无显著差异.白色念珠菌的菌落形成单位数,A组显著高于B、C组(P<0.05);B组显著高于C组(P<0.05).非白色念珠菌间的菌落形成单位数无明显差异.结论:戴不同材料义齿患者口腔除了能检出白色念珠菌,还可检出非白色念珠菌;口腔念珠菌的菌落形成单位数与义齿基托材料密切相关,钛及钛合金基托义齿应为预防义齿性口炎的首选义齿.%Objective: To study of the oral Candidal colonization status with different base-materials denture. Methods: 147 cases who wear RPDs were divided into three groups: group A (resin base denture), group B (Co- Cr alloy base denture) . And group C (Titanium and Titanium alloy base denture). Non- stimulated saliva were collected by standard procedure as before. Salivary samples were inoculated on CHROMagar Candida? To identify Candida strains. The total number of colonies was considered as the detectable intensity of oral Candida. Statistical analysis was used to compare the differences of detection rate and detection intensity between three denture materials. Results; Candida was isolated from 147 cases who wear different base materials denture, such as Candida albi-cans. Candida tropical, Candida krusei. The frequency of Candida

  16. Laser Soldering and Thermal Cycling Tests of Monolithic Silicon Pixel Chips

    CERN Document Server

    Strand, Frode Sneve

    2015-01-01

    An ALPIDE-1 monolithic silicon pixel sensor prototype has been laser soldered to a flex printed circuit using a novel interconnection technique using lasers. This technique is to be optimised to ensure stable, good quality connections between the sensor chips and the FPCs. To test the long-term stability of the connections, as well as study the effects on hit thresholds and noise in the sensor, it was thermally cycled in a climate chamber 1200 times. The soldered connections showed good qualities like even melting and good adhesion on pad/flex surfaces, and the chip remained in working condition for 1080 cycles. After this, a few connections failed, having cracks in the soldering tin, rendering the chip unusable. Threshold and noise characteristics seemed stable, except for the noise levels of sector 2 in the chip, for 1000 cycles in a temperature interval of "10^{\\circ}" and "50^{\\circ}" C. Still, further testing with wider temperature ranges and more cycles is needed to test the limitations of the chi...

  17. Strength of MWCNT-Reinforced 70Sn-30Bi Solder Alloys

    Science.gov (United States)

    Billah, Md Muktadir; Chen, Quanfang

    2016-01-01

    In this study, the effect of Cu-coated multi-walled carbon nanotubes (MWCNTs) on the tensile strength of 70Sn-30Bi solder alloy has been investigated. Copper was first deposited onto metal-activated MWCNTs by an electroless process and confirmed with a scanning electron microscope and energy dispersive spectroscopy. Sn-Bi alloy solder was reinforced with Cu-coated MWCNTs with additions of 0.5 wt.%, 1 wt.%, 2 wt.%, and 3 wt.%, respectively. 70Sn-30Bi solder was produced by melting pure tin and bismuth in an inert gas atmosphere. Cu-coated MWCNTs were then added into the metal matrix by cold rolling, followed by hot pressing to disperse the carbon nanotubes (CNTs) in the matrix. Tensile tests were conducted on an mechanical testing and simulation (MTS) tester. The tensile strength was found to be proportional to the addition of Cu/MWCNTs, and about 47.6% increase in tensile strength over the pure alloy has been obtained for an addition of 3 wt.% Cu/MWCNTs. The Cu coating may enhance CNT dispersion to prevent tangling.

  18. Utilizing the thermodynamic nanoparticle size effects for low temperature Pb-free solder

    Energy Technology Data Exchange (ETDEWEB)

    Koppes, John P. [Department of Materials Engineering, Purdue University, West Lafayette, IN (United States); Grossklaus, Kevin A. [Department of Materials Science and Engineering, University of Michigan, Ann Arbor, MI (United States); Muza, Anthony R. [Department of Materials Engineering, Purdue University, West Lafayette, IN (United States); Revur, R. Rao; Sengupta, Suvankar [MetaMateria Partners LLC, Columbus, OH (United States); Rae, Alan [TPF Enterprises LLC, Wilson, NY (United States); Stach, Eric A. [Department of Materials Engineering, Purdue University, West Lafayette, IN (United States); Center for Functional Nanomaterials, Brookhaven National Laboratory, Upton, NY (United States); Handwerker, Carol A., E-mail: carolh@purdue.edu [Department of Materials Engineering, Purdue University, West Lafayette, IN (United States)

    2012-02-15

    Highlights: Black-Right-Pointing-Pointer In this study we developed prototype Sn nanoparticle Pb-free solder pastes. Black-Right-Pointing-Pointer Particle size, melting temperature, coalescence, and volume loading were examined. Black-Right-Pointing-Pointer DSC results showed melting point depression and nanoparticle coalescence. Black-Right-Pointing-Pointer Low metals volume loading inhibited the formation of a solder joint. - Abstract: Development of a Pb-free Sn nanosolder paste with an initial melting temperature near or below the melting temperature of eutectic Sn-Pb solder (183 Degree-Sign C) has been investigated using the size-dependent melting behavior of small particles. Three to five nanometer Sn nanoparticles were fabricated by sonochemical reduction and observed to melt at temperatures near or below 183 Degree-Sign C. Prototype nanosolder pastes were produced by combining the nanoparticles with flux and were characterized by differential scanning calorimetry (DSC) in terms of their melting, solidification, coalescence, and metal particle loading properties. The results indicate that, although target melting temperatures were achieved, nanoparticle coalescence was limited by low volume loading of the metal, due in part to the capping layer (an organic layer adsorbed on the metal surface during chemical synthesis).

  19. Sutureless microvascular anastomoses by a biodegradable laser-activated solid protein solder.

    Science.gov (United States)

    Maitz, P K; Trickett, R I; Dekker, P; Tos, P; Dawes, J M; Piper, J A; Lanzetta, M; Owen, E R

    1999-11-01

    A new sutureless technique to successfully anastomose the abdominal aorta of rats (1.3 mm in diameter) by using a fully biodegradable, laser-activated protein solder is presented. A total of 90 rats were divided into two groups randomly. In group one, the anastomoses were performed by using conventional microsuturing technique, whereas in group two, the anastomoses were performed by using a new laser welding technique. In addition, each of the two groups were divided into five subgroups and evaluated at different follow-up periods (10 minutes, 1 hour, 1 day, 1 week, and 6 weeks). At these intervals, the anastomoses were evaluated for patency and tensile strength. Three anastomoses in each subgroup were processed for light and electron microscopy. All anastomoses were found to be patent. The mean clamp time of the anastomoses performed with conventional suturing was 20.6 minutes compared with 7.2 minutes for the laser-activated welded anastomoses (p laser-welded anastomoses was higher compared with the conventional suture technique. Histologic evaluations revealed a near complete resorption of the solder after 6 weeks. The junction site of the vessel ends cannot be determined on the luminal side of the artery. In conclusion, a resorbable protein used as a solder, activated by a diode laser, can provide a reliable, safe, and rapid arterial anastomosis, which could be performed by any microsurgeon faster than conventional suturing after a short learning curve. PMID:10541175

  20. Investigation of Sn-Pb solder bumps of prototype photo detectors for the LHCb experiment

    CERN Document Server

    Delsante, M L; Arnau-Izquierdo, G

    2004-01-01

    The Large Hadron Collider (LHC) is now under construction at the European Organization for Nuclear Research (CERN). LHCb is one of the dedicated LHC experiments, allowing high energy proton-proton collisions to be exploited. This paper presents the results of the metallurgic studies carried out on Sn-Pb solder bumps of prototype vacuum photo detectors under development for LHCb, and in particular for the ring imaging Cherenkov-hybrid photo diode (RICH-HPD) project. These detectors encapsulate, in a vacuum tube, an assembly made of two silicon chips bonded together by a matrix of solder bumps. Each bump lies on a suitable system of under-bump metallic layers ensuring mechanical and electrical transition between the chip pad and the solder alloy. During manufacturing of the detector, bump-bonded (BB) assemblies are exposed to severe heat cycles up to 400 degree C inducing, in the present fabrication process, a clear degradation of electrical connectivity. Several investigations such as microstructural observati...

  1. A 2015 International Geomagnetic Reference Field (IGRF) candidate model based on Swarm’s experimental absolute magnetometer vector mode data

    DEFF Research Database (Denmark)

    Vigneron, Pierre; Hulot, Gauthier; Olsen, Nils;

    2015-01-01

    geographical distribution of the selected data set (essentially due to a lack of availability of data at high northern latitude satisfying nighttime conditions at the end of the time period considered). These appear to be comparable to differences classically observed among IGRF candidate models...... to epoch 2015.0 and truncated at degree and order 13. The resulting ASM-only 2015.0 IGRF candidate model is compared to analogous models derived from the mission’s nominal data and to the now-published final 2015.0 IGRF model. Differences among models mainly highlight uncertainties enhanced by the limited...

  2. Biodegradable synthetic polymer scaffolds for reinforcement of albumin protein solders used for laser-assisted tissue repair.

    Science.gov (United States)

    Hoffman, Grant T; Soller, Eric C; McNally-Heintzelman, Karen M

    2002-01-01

    Laser tissue soldering has been investigated for several years by researchers in our laboratory as an alternative to conventional tissue fasteners, including sutures, staples and clips. Laser tissue soldering is a bonding technique in which protein solder is applied to the tissue surfaces to be joined, and laser energy is used to bond the solder to the tissue surfaces. Over the past four years we have been investigating the use of synthetic polymer membranes as a means for reinforcing the strength of tissue repairs formed using traditional laser tissue soldering techniques. The purpose of this study was to assess the influence of various processing parameters on the strength of tissue repairs formed using the reinforced solder. Biodegradable polymer membranes of specific porosity were fabricated by means of a solvent-casting and particulate-leaching technique, using three different poly(alpha ester)s: polyglycolic acid (PGA), polylactic acid (PLA) and poly(L-lactic-co-glycolic acid) (PLGA). In addition, several membranes were also prepared with poly(ethylene glycol) (PEG). The membranes were then doped with the traditional protein solder mixture of serum albumin and indocyanine green dye. Varied processing parameters included the polymer type, the PLGA copolymer blend ratio, the polymer/PEG blend ratio, the porosity of the polymer membrane and the initial albumin weight fraction. Variation of the polymer type had negligible effect on the strength of the repairs. Although it is known that alteration of the copolymer blend ratio of PLGA influences the degradation rate of the polymer, this variation also had no significant effect on the strength of the repairs formed. Increased membrane flexibility was observed when PEG was added during the casting stage. An increase in the porosity of the polymer membranes led to a subsequent increase in the final concentration of protein contained within the membranes, hence aiding in strengthening the resultant repairs. Likewise

  3. Do People 'Like' Candidates on Facebook?

    DEFF Research Database (Denmark)

    Nielsen, Rasmus Kleis

    The online popularity of a few exceptional candidates has led many to suggest that social media have given politicians powerful ways of communicating directly with voters. In this paper, we examine whether this is happening on a significant scale and show, based on analysis of 224 candidates....... We therefore suggest that the political implications of social media are generally better understood in terms of facilitating indirect communication and institutional change than in terms of direct communication....

  4. The Relating Level of Teacher Candidates Based on Scientific Information with Their Daily Lives: A Case of Ataturk and Caucasian Universities

    Science.gov (United States)

    Kurt, Murat

    2014-01-01

    The aim of this research is to determine and compare candidate teachers' level of relating scientific information with their daily lives. The teachers were studying in the 1st and 4th classes in Atatürk and Caucasian Universities, Education Faculty, Elementary School Science Teaching Department during the 2012-2013 academic year. The research…

  5. DIFFUSION-INDUCED STRESS IN THE INTERMETALLIC COMPOUND LAYER OF SOLDER JOINTS%焊锡接点IMC层的扩散应力

    Institute of Scientific and Technical Information of China (English)

    秦飞; 安彤; 夏国峰

    2012-01-01

    钎焊过程中在焊锡接点中形成的金属间化合物(IMC)对焊锡接点可靠性具有重要影响.在原子扩散效应下,回流焊和等温时效过程中IMC层的生长会在其内部产生应力,其微结构也发生变化,致使IMC层和整个焊锡接点的力学性能下降.论文基于扩散反应机制,研究了由于原子扩散产生的IMC层的扩散应力.首先建立了描述焊锡接点IMC层生长早期微结构特征的2界面(Cu/Cu6 Sn5/Solder)分析模型,然后运用Laplace变换法求解扩散方程得到了Cu原了在IMC层中的浓度分布;采用把原子扩散作用转换为体应变方法,计算了IMC层在形成和生长过程中应力的解析解.结果表明:IMC层中的扩散应力为压应力,最大值位于Cu/IMC界面处,大小与扩散原子浓度密切相关;随着时效时间的增加,扩散应力增大,但最终趋于稳定并沿IMC厚度方向线性变化.%Intermetallic compound (IMC) layers formed during soldering processes significantly affect the reliability of solder joints. The atomic diffusion effect during reflow and isothermal aging leads to growth and morphological evolution of IMC layers.and stress is developed in the IMC layers. The changed microstructure and the stress in the IMC layer result in degradation of mechanical performance of solder joints. Based on the mechanism of atomic diffusion-reaction, the diffusion induced stress during the growth of the IMC layer is investigated. An analytic model with two interfaces(Cu/Cu6Sn3/Solder)at the early stages of IMC formation is proposed,and then the copper concentration distribution in the IMC layer is calculated using the Laplace transformation method. Diffusion-induced stresses are obtained analytically by transforming atomic diffusion effects into bulk strain. The results show that the diffusion-induced stress is compressive,and it reaches its peak at the Cu/Cu6Sn5 interface. The diffusion induced stress increases with the increase of the isothermal

  6. Interfacial microstructures and solder joint strengths of the Sn-8Zn-3Bi and Sn-9Zn-lAl Pb-free solder pastes on OSP finished printed circuit boards

    International Nuclear Information System (INIS)

    Two kinds of lead-free solders, Sn-8Zn-3Bi and Sn-9Zn-lAl, were used to mount passive components onto printed circuit boards via a re-flow soldering process. The samples were stored at 150 deg. C for 200, 400, 600, 800, and 1100 h. The microstructures of the samples after aged at 150 deg. C for various times were characterized using optical microscopy (OM), scanning electron microscopy (SEM), energy dispersive spectrometry (EDS) and the analyzed of solder joint shear strengths. The joint strength between Sn-8Zn-3Bi and Cu pad was about 4.0 ± 0.3 kg, while the strength between Sn-9Zn-lAl and Cu pad had values of 2.6 ± 0.1 kg. Both kinds of solder joints exhibited reduced strengths with increasing aging times. After aging at 150 deg. C for 1100 h, the joints strengths of Sn-8Zn-3Bi and Sn-9Zn-lAl were 1.8 ± 0.3 and 1.7 ± 0.3 kg, respectively. Both the Sn-8Zn-3Bi and Sn-9Zn-lAl joints showed brittle fracture behaviors. A flat layer of Cu5Zn8 intermetallic compound (IMC) was formed between Sn-8Zn-3Bi solder and Cu pad after reflow. When the aging time was increased to 400 h, Zn-depletion and formation of Cu6Sn5 IMC were observed in the solders due to the interaction between the tin and zinc compounds. The interaction between Sn-9Zn-lAl solder and Cu pad had similar behavior, however, Cu6Sn5 IMC formed in Sn-9Zn-lAl solder when after aging at 150 deg. C for 600 h. As the aging time increased, both types of solders generated clear IMC spalling layers with large and continuous voids. Those voids substantially decreased the joint strength

  7. Interfacial microstructures and solder joint strengths of the Sn-8Zn-3Bi and Sn-9Zn-lAl Pb-free solder pastes on OSP finished printed circuit boards

    Energy Technology Data Exchange (ETDEWEB)

    Lin, C.-T. [Department of Materials Science and Engineering, National United University, 1 Lein-Da, Kung-Ching Li, Miaoli 36003, Taiwan (China); Electronics and Optoelectronics Research Laboratories, Industrial Technology Research Institute, 195 Section 4, Chung-Hsing Road, Chutung, Hsinchu 31040, Taiwan (China); Hsi, C.-S. [Department of Materials Science and Engineering, National United University, 1 Lein-Da, Kung-Ching Li, Miaoli 36003, Taiwan (China); Wang, M.-C. [Faculty of Fragrance and Cosmetics, Kaohsiung Medical University, 100 Shih-Chuan 1st Road, Kaohsiung 807, Taiwan (China)], E-mail: mcwang@kmu.edu.tw; Chang, T.-C.; Liang, M.-K. [Electronics and Optoelectronics Research Laboratories, Industrial Technology Research Institute, 195 Section 4, Chung-Hsing Road, Chutung, Hsinchu 31040, Taiwan (China)

    2008-07-14

    Two kinds of lead-free solders, Sn-8Zn-3Bi and Sn-9Zn-lAl, were used to mount passive components onto printed circuit boards via a re-flow soldering process. The samples were stored at 150 deg. C for 200, 400, 600, 800, and 1100 h. The microstructures of the samples after aged at 150 deg. C for various times were characterized using optical microscopy (OM), scanning electron microscopy (SEM), energy dispersive spectrometry (EDS) and the analyzed of solder joint shear strengths. The joint strength between Sn-8Zn-3Bi and Cu pad was about 4.0 {+-} 0.3 kg, while the strength between Sn-9Zn-lAl and Cu pad had values of 2.6 {+-} 0.1 kg. Both kinds of solder joints exhibited reduced strengths with increasing aging times. After aging at 150 deg. C for 1100 h, the joints strengths of Sn-8Zn-3Bi and Sn-9Zn-lAl were 1.8 {+-} 0.3 and 1.7 {+-} 0.3 kg, respectively. Both the Sn-8Zn-3Bi and Sn-9Zn-lAl joints showed brittle fracture behaviors. A flat layer of Cu{sub 5}Zn{sub 8} intermetallic compound (IMC) was formed between Sn-8Zn-3Bi solder and Cu pad after reflow. When the aging time was increased to 400 h, Zn-depletion and formation of Cu{sub 6}Sn{sub 5} IMC were observed in the solders due to the interaction between the tin and zinc compounds. The interaction between Sn-9Zn-lAl solder and Cu pad had similar behavior, however, Cu{sub 6}Sn{sub 5} IMC formed in Sn-9Zn-lAl solder when after aging at 150 deg. C for 600 h. As the aging time increased, both types of solders generated clear IMC spalling layers with large and continuous voids. Those voids substantially decreased the joint strength.

  8. CASE via MS: Ranking Structure Candidates by Mass Spectra

    OpenAIRE

    Kerber, Adalbert; Meringer, Markus; Rücker, Christoph

    2006-01-01

    Two important tasks in computer-aided structure elucidation (CASE) are the generation of candidate structures from a given molecular formula, and the ranking of structure candidates according to compatibility with an experimental spectrum. Candidate ranking with respect to electron impact mass spectra is based on virtual fragmentation of a candidate structure and comparison of the fragments’ isotope distributions against the spectrum of the unknown compound, whence a structure–spectrum compat...

  9. Self-assembly of Sn-3Ag-0.5Cu Solder in Thermoplastic Resin Containing Carboxyl Group and its Interconnection

    Science.gov (United States)

    Miyauchi, Kazuhiro; Yamashita, Yukihiko; Suzuki, Naoya; Takano, Nozomu

    2014-09-01

    The self-assembly of solder powder on pads is attractive as a novel interconnection method between chips and substrates. However, the solder used in this method is limited to Sn-58Bi and Sn-52In. In contrast, Sn-3Ag-0.5Cu has been relatively less studied despite its wide use as a lead-free solder in assembling semiconductor packages. Hence, here, polymeric materials incorporating Sn-3Ag-0.5Cu solder powder were investigated for the self-assembly of the solder on pads at temperatures up to 260°C in a lead-free reflow process. The self-assembly of the solder was observed with an optical microscope through transparent glass chips placed on substrates covered with the polymeric materials incorporating the solder powder. Differential scanning calorimetry measurements were performed to confirm the behaviors of the reaction of the resins and the melting of the solder. When epoxy resin with a fluxing additive was used as a matrix, self-assembly of the solder was prevented by the cross-linking reaction. Conversely, when thermoplastic resin containing carboxyl groups was used as a matrix, the self-assembly of solder was successfully achieved in the absence of fluxing additives. The shear strength of interconnection using reflowfilm with lamination was sufficient and significantly increased during the reflow process. However, the shear strength of the reflowfilm showed cohesive failure, possibly because of the brittle intermetallic compounds (Ag3Sn, Au4Sn) network in bulk was lower than that of conventional solder paste that showed interfacial failure after the reflow process with a rapid cooling rate.

  10. Influence of TiO{sub 2} nanoparticles on IMC growth in Sn–3.0Ag–0.5Cu–xTiO{sub 2} solder joints in reflow process

    Energy Technology Data Exchange (ETDEWEB)

    Tang, Y. [School of Electronic and Information Engineering, South China University of Technology, Guangzhou 510641 (China); School of Information, Zhongkai University of Agriculture and Engineering, Guangzhou 510225 (China); Li, G.Y., E-mail: phgyli@scut.edu.cn [School of Electronic and Information Engineering, South China University of Technology, Guangzhou 510641 (China); Pan, Y.C. [School of Electronic and Information Engineering, South China University of Technology, Guangzhou 510641 (China)

    2013-03-25

    Highlights: ► The microstructure and kinetics of IMC growth between SAC-xTiO{sub 2} and Cu were studied. ► Addition of small amounts TiO{sub 2} nanoparticles can suppress the growth of IMC layer. ► Nano-TiO{sub 2} addition can act as a grain refiner in the IMC formation and growth. ► The growth of the IMC layer is controlled through combined kinetics process. -- Abstract: The influence of TiO{sub 2} nanoparticles on the growth kinetics of intermetallic compound (IMC) between Sn–3.0 wt.% Ag–0.5 wt.% Cu–x wt.%TiO{sub 2} (x = 0, 0.02, 0.05, 0.1, 0.3, and 0.6) solder and copper substrate during reflow process has been investigated in this study. Scanning electron microscope (SEM) was applied to observe the microstructural evolution of the solder joints, to measure the thickness of the IMC layer, and to estimate the grain size of the IMC layer. The IMC phases were identified by energy-dispersive X-ray spectroscopy (EDX) and X-ray diffractometry (XRD). Results show that both the thickness and grain size of IMC decrease when TiO{sub 2} nanoparticles are added into the Sn–3.0Ag–0.5Cu solder system, and have a significant drop when the weight percentage of TiO{sub 2} nanoparticles is about 0.1 wt.%. Beyond this amount, the thickness and grain size of IMC increase slightly. The growth exponents for both the IMC layers and grains are determined by curve-fitting to study the growth kinetics of IMC in the soldering reaction process. Results reveal that the growth exponents of the IMC layer range from 0.354 to 0.358, and those of the IMC grains range from 0.332 to 0.346, which suggests that the growth of the IMC layer is controlled by the combined kinetics process of atomic interdiffusion, interfacial reaction, and grain ripening. These data also show that Sn–3.0Ag–0.5Cu with about 0.1 wt.% TiO{sub 2} nanoparticles solder system exhibits the smallest growth rate and gives the most prominent effect in suppressing IMC growth and refining IMC grain size. Based

  11. RNA-Seq Based Identification of Candidate Parasitism Genes of Cereal Cyst Nematode (Heterodera avenae during Incompatible Infection to Aegilops variabilis.

    Directory of Open Access Journals (Sweden)

    Minghui Zheng

    targets with potential lethality were screened out and primarily validated, which provide candidates for engineering-based control of cereal cyst nematode in crops breeding.

  12. Investigating the thermomechanical properties and intermetallic layer formation of Bi micro-alloyed low-Ag content solders

    Energy Technology Data Exchange (ETDEWEB)

    Krammer, Olivér, E-mail: krammer@ett.bme.hu [Department of Electronics Technology, Budapest University of Technology and Economics, Egry J. u. 18., Budapest H-1111 (Hungary); Garami, Tamás [Department of Electronics Technology, Budapest University of Technology and Economics, Egry J. u. 18., Budapest H-1111 (Hungary); Horváth, Barbara [National Institute for Materials Science, 1-2-1 Sengen, Tsukuba 305-0047 (Japan); Hurtony, Tamás; Medgyes, Bálint; Jakab, László [Department of Electronics Technology, Budapest University of Technology and Economics, Egry J. u. 18., Budapest H-1111 (Hungary)

    2015-06-15

    Highlights: • Thermomechanical properties of SnAgCu and micro-alloyed solders were investigated. • Intermetallic layer growth of SnAgCu and micro-alloyed solders was investigated. • The Cu{sub 6}Sn{sub 5} intermetallic layer growth during soldering was lower in SnAgCu alloys. • The layer growth during Thermal Shock was lower in micro-alloyed solders. • The SnAg0.3Cu0.7Bi0.1Sb0.01 alloy has the best thermomechanical properties. - Abstract: In our research, we performed comparative analyses concerning various lead-free SAC (Sn96.5Ag3Cu0.5, Sn95.5Ag4Cu0.5) and two types of micro-alloyed SAC (SnAgCu + Bi + Sb) solder alloys. The mechanical properties of these solder alloys were characterised by measuring the shear strength of 0603 (1.5 × 0.75 mm) size chip resistors’ joints. We designed a testboard, which contains fifty pieces of 0603 size resistors for mechanical characterisation and for measuring the thickness of intermetallic layers. During the experiment, twenty-eight pieces of testboards were soldered with vapour phase soldering (seven with each solder alloy) and sixteen of them were subjected to Thermal-Shock (TS) life-time tests with temperature range of +140 to −40 °C up to 2000 cycles. The intermetallic layer (IML) formation was investigated with Scanning Electron Microscopy (SEM) and Scanning Transmission Electron Microscopy (STEM) methods; and the growth of the layer was analysed by measuring the IML thickness on cross-sectional samples after given TS cycles. It is shown that the thickness of the intermetallic layer in as-reflowed samples (samples without aging) depends on the silver content of the given alloy. Besides, the layer growth rate during Thermal Shock tests is affected by the number of intermetallic layer grain-boundaries along a unit of length.

  13. Three Dimensional Characterization of Tin Crystallography and Cu6Sn5 Intermetallics in Solder Joints by Multiscale Tomography

    Science.gov (United States)

    Kirubanandham, A.; Lujan-Regalado, I.; Vallabhaneni, R.; Chawla, N.

    2016-07-01

    Decreasing pitch size in electronic packaging has resulted in a drastic decrease in solder volumes. The Sn grain crystallography and fraction of intermetallic compounds (IMCs) in small-scale solder joints evolve much differently at the smaller length scales. A cross-sectional study limits the morphological analysis of microstructural features to two dimensions. This study utilizes serial sectioning technique in conjunction with electron backscatter diffraction to investigate the crystallographic orientation of both Sn grains and Cu6Sn5 IMCs in Cu/Pure Sn/Cu solder joints in three dimensional (3D). Quantification of grain aspect ratio is affected by local cooling rate differences within the solder volume. Backscatter electron imaging and focused ion beam serial sectioning enabled the visualization of morphology of both nanosized Cu6Sn5 IMCs and the hollow hexagonal morphology type Cu6Sn5 IMCs in 3D. Quantification and visualization of microstructural features in 3D thus enable us to better understand the microstructure and deformation mechanics within these small scale solder joints.

  14. EVOLUTION OF MICROSTRUCTURE OF Sn-Ag-Cu LEAD-FREE FLIP CHIP SOLDER JOINTS DURING AGING PROCESS

    Institute of Scientific and Technical Information of China (English)

    Y.H. Tian; C.Q. Wang; W.F. Zhou

    2006-01-01

    Flip chip bonding has become a primary technology that has found application in the chip interconnection process in the electronic manufacturing industry in recent years. The solder joints of the flip chip bonding are small and consist of complicated microstructures such as Sn solution,eutectic mixture, and intermetallic compounds (IMCs), whose mechanical performance is quite different from the original solder bulk. The evolution of microstructure of the flip chip solder joints under thermal aging was analyzed. The results show that with an increase in aging time, coarsening of solder bulk matrix and AuSn4 IMCs occurred within the solder. The IMCs that are formed at the bottom side of the flip chip bond were different from those on the top side during the aging process. ( Cu, Ni, Au )6Sn5 were formed at the interfaces of both sides, and large complicated (Au, Ni,Cu)Sn4 IMCs appeared for some time near the bottom interface after aging, but they disappeared again and thus ( Cu, Ni,Au )6Sns IMC thickness increased considerably. The influence of reflow times during the flip chip bonding (as-bonded condition) on the characteristics of interfacial IMCs was weakened when subjected to the aging process.

  15. Effects of fullerenes reinforcement on the performance of 96.5Sn–3Ag–0.5Cu lead-free solder

    Energy Technology Data Exchange (ETDEWEB)

    Chen, Guang [State Key Laboratory of Materials Processing and Die & Mould Technology, Huazhong University of Science and Technology, Wuhan 430074 (China); Wolfson School of Mechanical and Manufacturing Engineering, Loughborough University (United Kingdom); Wu, Fengshun, E-mail: fengshunwu@hust.edu.cn [State Key Laboratory of Materials Processing and Die & Mould Technology, Huazhong University of Science and Technology, Wuhan 430074 (China); Liu, Changqing [Wolfson School of Mechanical and Manufacturing Engineering, Loughborough University (United Kingdom); Xia, Weisheng; Liu, Hui [State Key Laboratory of Materials Processing and Die & Mould Technology, Huazhong University of Science and Technology, Wuhan 430074 (China)

    2015-06-11

    In this study, fullerenes (FNSs) nanoparticles with different weight fractions (0.05, 0.1 and 0.2 wt%) were successfully integrated into SAC305 lead-free solder utilizing a powder metallurgy route. The composite solders were then studied extensively concerning their microstructures, wettability, thermal and mechanical properties. Refined microstructures were observed in the matrices of the composite solders after the addition of FNSs nanoparticles to the solder alloy. With an increase in the amount of FNSs nanoparticles added, the composite solders exhibited a homologous improvement in wettability. Furthermore, the electrical resistance and melting point of the solder changed only marginally after the addition of the FNSs nanoparticles. According to the mechanical results, the 0.2 wt% FNSs addition would give rise to a 12.1% and 19.9% improvement in shear strength and microhardness respectively in comparison to the unreinforced solders. These progressions can be attributed to the refined microstructures and the presence of uniformly dispersed FNSs nanoparticles, which acted as reinforcements. Finally, the existence of added FNSs nanoparticles in the solder matrix was further confirmed by energy-dispersive X-ray spectroscopy, scanning electron microscopy, and Raman spectroscopy.

  16. Stability of molybdenum nanoparticles in Sn-3.8Ag-0.7Cu solder during multiple reflow and their influence on interfacial intermetallic compounds

    Energy Technology Data Exchange (ETDEWEB)

    Haseeb, A.S.M.A., E-mail: haseeb@um.edu.my; Arafat, M.M., E-mail: arafat_mahmood@yahoo.com; Johan, Mohd Rafie, E-mail: mrafiej@um.edu.my

    2012-02-15

    This work investigates the effects of molybdenum nanoparticles on the growth of interfacial intermetallic compound between Sn-3.8Ag-0.7Cu solder and copper substrate during multiple reflow. Molybdenum nanoparticles were mixed with Sn-3.8Ag-0.7Cu solder paste by manual mixing. Solder samples were reflowed on a copper substrate in a 250 Degree-Sign C reflow oven up to six times. The molybdenum content of the bulk solder was determined by inductive coupled plasma-optical emission spectrometry. It is found that upon the addition of molybdenum nanoparticles to Sn-3.8Ag-0.7Cu solder, the interfacial intermetallic compound thickness and scallop diameter decreases under all reflow conditions. Molybdenum nanoparticles do not appear to dissolve or react with the solder. They tend to adsorb preferentially at the interface between solder and the intermetallic compound scallops. It is suggested that molybdenum nanoparticles impart their influence on the interfacial intermetallic compound as discrete particles. The intact, discrete nanoparticles, by absorbing preferentially at the interface, hinder the diffusion flux of the substrate and thereby suppress the intermetallic compound growth. - Highlights: Black-Right-Pointing-Pointer Mo nanoparticles do not dissolve or react with the SAC solder during reflow. Black-Right-Pointing-Pointer Addition of Mo nanoparticles results smaller IMC thickness and scallop diameter. Black-Right-Pointing-Pointer Mo nanoparticles influence the interfacial IMC through discrete particle effect.

  17. Biodegradable polymer thin film for enhancement of laser-assisted incision closure with an indocyanine-green-doped liquid albumin solder

    Science.gov (United States)

    Sorg, Brian S.; McNally-Heintzelman, Karen M.; Welch, Ashley J.

    2000-05-01

    The purpose of this study was to determine if solid material reinforcement of a liquid albumin solder coagulum could improve the cohesive strength of the solder and thus the ultimate breaking strength of the incision repair in vitro. A 50%(w/v) bovine serum albumin solder with 0.5 mg/mL Indocyanine Green (ICG) dye was used to repair an incision in bovine aorta. The solder was coagulated with an 806 nm CW diode laser. A 50 micrometer thick poly(DL-lactic-co-glycolic acid) film was used to reinforce the solder (the controls had no reinforcement). Acute breaking strengths were measured and the data were analyzed by one-way ANOVA (P less than 0.05). Multiple comparisons of means were performed using the Newman- Keuls test. Observations of the failure modes indicated cohesive strength reinforcement of the test specimens versus the controls. At the higher laser powers used in this study (400 and 450 mW), the reinforced solder was consistently stronger than the controls. Reinforcement of liquid albumin solders in laser-assisted incision repair may have mechanical advantages in terms of acute breaking strength over conventional methods that do not reinforce the cohesive strength of the solder.

  18. Effects of fullerenes reinforcement on the performance of 96.5Sn–3Ag–0.5Cu lead-free solder

    International Nuclear Information System (INIS)

    In this study, fullerenes (FNSs) nanoparticles with different weight fractions (0.05, 0.1 and 0.2 wt%) were successfully integrated into SAC305 lead-free solder utilizing a powder metallurgy route. The composite solders were then studied extensively concerning their microstructures, wettability, thermal and mechanical properties. Refined microstructures were observed in the matrices of the composite solders after the addition of FNSs nanoparticles to the solder alloy. With an increase in the amount of FNSs nanoparticles added, the composite solders exhibited a homologous improvement in wettability. Furthermore, the electrical resistance and melting point of the solder changed only marginally after the addition of the FNSs nanoparticles. According to the mechanical results, the 0.2 wt% FNSs addition would give rise to a 12.1% and 19.9% improvement in shear strength and microhardness respectively in comparison to the unreinforced solders. These progressions can be attributed to the refined microstructures and the presence of uniformly dispersed FNSs nanoparticles, which acted as reinforcements. Finally, the existence of added FNSs nanoparticles in the solder matrix was further confirmed by energy-dispersive X-ray spectroscopy, scanning electron microscopy, and Raman spectroscopy

  19. Prospects for high-z cluster detections with Planck, based on a follow-up of 28 candidates using MegaCam@CFHT

    CERN Document Server

    van der Burg, R F J; Pratt, G W; Arnaud, M; Melin, J -B; Aghanim, N; Barrena, R; Dahle, H; Douspis, M; Ferragamo, A; Fromenteau, S; Herbonnet, R; Hurier, G; Pointecouteau, E; Rubino-Martin, J A; Streblyanska, A

    2015-01-01

    The Planck catalogue of SZ sources limits itself to a significance threshold of 4.5 to ensure a low contamination rate by false cluster candidates. This means that only the most massive clusters at redshift z>0.5, and in particular z>0.7, are expected to enter into the catalogue, with a large number of systems in that redshift regime being expected around and just below that threshold. In this paper, we follow-up a sample of SZ sources from the Planck SZ catalogues from 2013 and 2015. In the latter maps, we consider detections around and at lower significance than the threshold adopted by the Planck Collaboration. To keep the contamination rate low, our 28 candidates are chosen to have significant WISE detections, in combination with non-detections in SDSS/DSS, which effectively selects galaxy cluster candidates at redshifts $z\\gtrsim0.5$. By taking r- and z-band imaging with MegaCam@CFHT, we bridge the 4000A rest-frame break over a significant redshift range, thus allowing accurate redshift estimates of red-...

  20. Differential CD4+ versus CD8+ T-Cell Responses Elicited by Different Poxvirus-Based Human Immunodeficiency Virus Type 1 Vaccine Candidates Provide Comparable Efficacies in Primates▿ †

    OpenAIRE

    Mooij, Petra; Balla-Jhagjhoorsingh, Sunita S.; Koopman, Gerrit; Beenhakker, Niels; van Haaften, Patricia; Baak, Ilona; Nieuwenhuis, Ivonne G.; Kondova, Ivanela; Wagner, Ralf; Wolf, Hans; Gómez, Carmen E.; José L Nájera; Jiménez, Victoria; Esteban, Mariano; Heeney, Jonathan L.

    2008-01-01

    Poxvirus vectors have proven to be highly effective for boosting immune responses in diverse vaccine settings. Recent reports reveal marked differences in the gene expression of human dendritic cells infected with two leading poxvirus-based human immunodeficiency virus (HIV) vaccine candidates, New York vaccinia virus (NYVAC) and modified vaccinia virus Ankara (MVA). To understand how complex genomic changes in these two vaccine vectors translate into antigen-specific systemic immune response...

  1. Effect of Yttrium on the Fracture Strength of the Sn-1.0Ag-0.5Cu Solder Joints

    Science.gov (United States)

    Choi, Hyelim; Kaplan, Wayne D.; Choe, Heeman

    2016-07-01

    This is a preliminary investigation on the mechanical properties of Pb-free Sn-1.0Ag-0.5Cu solder joints containing 0.02 wt.% to 0.1 wt.% Y under a range of thermal aging and reflow conditions. Despite the significantly thicker intermetallic compound (IMC) formed at the solder joint, the 0.1 wt.% Y-doped joint exhibited a higher fracture strength than its baseline Sn-1.0Ag-0.5Cu counterpart under most aging and reflow conditions. This may be associated with the formation of Y-Cu IMCs formed at the interface between the solder and the Cu substrate, because the Y-Cu IMCs have recently been referred to as relatively `ductile' IMCs.

  2. Retarding the electromigration effects to the eutectic SnBi solder joints by micro-sized Ni-particles reinforcement approach

    International Nuclear Information System (INIS)

    Research highlights: → We used a revised solder joints with one-dimension geometry that can help us to investigate the true failure mechanisms of solder joints induced by EM. → One of possible solutions to inhibit the EM effect to solder joint can be achieved by adding micro- or nano-sized metal particles into it. → Micro-sized Ni particles were selected as the reinforcement to retard the phase segregation in the eutectic SnBi solder joints under high current density (104 A/cm2). It has been approved in this study that Ni particles can act as obstacles to obstruct the fast diffusion channel along the phase boundaries in the eutectic SnBi system. - Abstract: Electromigration (EM) has become one of the reliability concerns to the electronic solder joint due to its increasing capacity to bear the high current density (104 A/cm2). Although the failure induced by EM can trigger a large void across the entire cathode interface, no effective solutions are presented throughout years of effort on this problem. Here, the composite solder joints are addressed to demonstrate their potential roles on solving the EM issue in the eutectic SnBi solder joints. Micro-sized Ni particles were selected to intentionally add into the solder matrix due to their extensive application as a barrier layer in the under-bump-metallization (UBM) of flip chip solder joints. The ultimate results illustrated that the Ni particles can react with Sn to form the cluster-type Sn-Ni intermetallic compounds (IMCs) inside the solder matrix after the first reflow. Accordingly, the phase segregation of Sn and Bi was significantly inhibited during the current stressing, demonstrating the Sn-Ni IMCs can act as the obstacles to obstruct the movement of dominant diffusion entity (Bi atoms/ions) along the phase boundaries.

  3. Interconnection of thermal parameters, microstructure and mechanical properties in directionally solidified Sn–Sb lead-free solder alloys

    International Nuclear Information System (INIS)

    Considerable effort is being made to develop lead-free solders for assembling in environmental-conscious electronics, due to the inherent toxicity of Pb. The search for substitute alloys of Pb–Sn solders has increased in order to comply with different soldering purposes. The solder must not only meet the expected levels of electrical performance but may also have appropriate mechanical strength, with the absence of cracks in the solder joints. The Sn–Sb alloy system has a range of compositions that can be potentially included in the class of high temperature solders. This study aims to establish interrelations of solidification thermal parameters, microstructure and mechanical properties of Sn–Sb alloys (2 wt.%Sb and 5.5 wt.%Sb) samples, which were directionally solidified under cooling rates similar to those of reflow procedures in industrial practice. A complete high-cooling rate cellular growth is shown to be associated with the Sn–2.0 wt.%Sb alloy and a reverse dendrite-to-cell transition is observed for the Sn–5.5 wt.%Sb alloy. Strength and ductility of the Sn–2.0 wt.%Sb alloy are shown not to be affected by the cellular spacing. On the other hand, a considerable variation in these properties is associated with the cellular region of the Sn–5.5 wt.%Sb alloy casting. - Graphical abstract: Display Omitted - Highlights: • The microstructure of the Sn–2 wt.%Sb alloy is characterized by high-cooling rates cells. • Reverse dendrite > cell transition occurs for Sn–5.5 wt.%Sb alloy: cells prevail for cooling rates > 1.2 K/s. • Sn–5.5 wt.%Sb alloy: the dendritic region occurs for cooling rates < 0.9 K/s. • Sn–5.5 wt.%Sb alloy: tensile properties are improved with decreasing cellular spacing

  4. Interconnection of thermal parameters, microstructure and mechanical properties in directionally solidified Sn–Sb lead-free solder alloys

    Energy Technology Data Exchange (ETDEWEB)

    Dias, Marcelino; Costa, Thiago [Department of Manufacturing and Materials Engineering, University of Campinas — UNICAMP, 13083-860 Campinas, SP (Brazil); Rocha, Otávio [Federal Institute of Education, Science and Technology of Pará — IFPA, 66093-020 Belém, PA (Brazil); Spinelli, José E. [Department of Materials Engineering, Federal University of São Carlos — UFSCar, 13565-905 São Carlos, SP (Brazil); Cheung, Noé, E-mail: cheung@fem.unicamp.br [Department of Manufacturing and Materials Engineering, University of Campinas — UNICAMP, 13083-860 Campinas, SP (Brazil); Garcia, Amauri [Department of Manufacturing and Materials Engineering, University of Campinas — UNICAMP, 13083-860 Campinas, SP (Brazil)

    2015-08-15

    Considerable effort is being made to develop lead-free solders for assembling in environmental-conscious electronics, due to the inherent toxicity of Pb. The search for substitute alloys of Pb–Sn solders has increased in order to comply with different soldering purposes. The solder must not only meet the expected levels of electrical performance but may also have appropriate mechanical strength, with the absence of cracks in the solder joints. The Sn–Sb alloy system has a range of compositions that can be potentially included in the class of high temperature solders. This study aims to establish interrelations of solidification thermal parameters, microstructure and mechanical properties of Sn–Sb alloys (2 wt.%Sb and 5.5 wt.%Sb) samples, which were directionally solidified under cooling rates similar to those of reflow procedures in industrial practice. A complete high-cooling rate cellular growth is shown to be associated with the Sn–2.0 wt.%Sb alloy and a reverse dendrite-to-cell transition is observed for the Sn–5.5 wt.%Sb alloy. Strength and ductility of the Sn–2.0 wt.%Sb alloy are shown not to be affected by the cellular spacing. On the other hand, a considerable variation in these properties is associated with the cellular region of the Sn–5.5 wt.%Sb alloy casting. - Graphical abstract: Display Omitted - Highlights: • The microstructure of the Sn–2 wt.%Sb alloy is characterized by high-cooling rates cells. • Reverse dendrite > cell transition occurs for Sn–5.5 wt.%Sb alloy: cells prevail for cooling rates > 1.2 K/s. • Sn–5.5 wt.%Sb alloy: the dendritic region occurs for cooling rates < 0.9 K/s. • Sn–5.5 wt.%Sb alloy: tensile properties are improved with decreasing cellular spacing.

  5. Electromigration effect on intermetallic growth and Young's modulus in SAC solder joint

    Science.gov (United States)

    Xu, Luhua; Pang, John H. L.; Ren, Fei; Tu, K. N.

    2006-12-01

    Solid-state intermetallic compound (IMC) growth behavior plays and important role in solder joint reliability of electronic packaging assemblies. The directional impact of electromigration (EM) on the growth of interfacial IMCs in Ni/SAC/Ni, Cu/SAC/Ni single BGA ball solder joint, and fine pitch ball-grid-array (FPBGA) at the anode and cathode sides is reported in this study. When the solder joint was subjected to a current density of 5,000 A/cm2 at 125°C or 150°C, IMC layer growth on the anode interface was faster than that on the cathode interface, and both were faster than isothermal aging due to the Joule heating effect. The EM affects the IMC growth rate, as well as the composition and mechanical properties. The Young’s modulus and hardness were measured by the nanoindentation continuous stiffness measurement (CSM) from planar IMC surfaces after EM exposure. Different values were observed at the anode and cathode. The energy-dispersive x-ray (EDX) line scan analysis was conducted at the interface from the cathode to anode to study the presence of species; Ni was found in the anode IMC at SAC/Cu in the Ni/SAC/Cu joint, but not detected when the current was reverse. Electron-probe microanalysis (EPMA) measurement on the Ni/SAC/Ni specimen also confirmed the polarized Ni and Cu distributions in cathode and anode IMCs, which were (Ni0.57Cu0.43)3Sn4 and (Cu0.73Ni0.27)6Sn5, respectively. Thus, the Young’s moduli of the IMC are 141 and 175 GPa, respectively.

  6. Immunogenicity of a virosomally-formulated Plasmodium falciparum GLURP-MSP3 chimeric protein-based malaria vaccine candidate in comparison to adjuvanted formulations

    Directory of Open Access Journals (Sweden)

    Tamborrini Marco

    2011-12-01

    Full Text Available Abstract Background In clinical trials, immunopotentiating reconstituted influenza virosomes (IRIVs have shown great potential as a versatile antigen delivery platform for synthetic peptides derived from Plasmodium falciparum antigens. This study describes the immunogenicity of a virosomally-formulated recombinant fusion protein comprising domains of the two malaria vaccine candidate antigens MSP3 and GLURP. Methods The highly purified recombinant protein GMZ2 was coupled to phosphatidylethanolamine and the conjugates incorporated into the membrane of IRIVs. The immunogenicity of this adjuvant-free virosomal formulation was compared to GMZ2 formulated with the adjuvants Montanide ISA 720 and Alum in three mouse strains with different genetic backgrounds. Results Intramuscular injections of all three candidate vaccine formulations induced GMZ2-specific antibody responses in all mice tested. In general, the humoral immune response in outbred NMRI mice was stronger than that in inbred BALB/c and C57BL/6 mice. ELISA with the recombinant antigens demonstrated immunodominance of the GLURP component over the MSP3 component. However, compared to the Al(OH3-adjuvanted formulation the two other formulations elicited in NMRI mice a larger proportion of anti-MSP3 antibodies. Analyses of the induced GMZ2-specific IgG subclass profiles showed for all three formulations a predominance of the IgG1 isotype. Immune sera against all three formulations exhibited cross-reactivity with in vitro cultivated blood-stage parasites. Immunofluorescence and immunoblot competition experiments showed that both components of the hybrid protein induced IgG cross-reactive with the corresponding native proteins. Conclusion A virosomal formulation of the chimeric protein GMZ2 induced P. falciparum blood stage parasite cross-reactive IgG responses specific for both MSP3 and GLURP. GMZ2 thus represents a candidate component suitable for inclusion into a multi-valent virosomal

  7. Identification and Comparison of Candidate Olfactory Genes in the Olfactory and Non-Olfactory Organs of Elm Pest Ambrostoma quadriimpressum (Coleoptera: Chrysomelidae Based on Transcriptome Analysis.

    Directory of Open Access Journals (Sweden)

    Yinliang Wang

    Full Text Available The leaf beetle Ambrostoma quadriimpressum (Coleoptera: Chrysomelidae is a predominant forest pest that causes substantial damage to the lumber industry and city management. However, no effective and environmentally friendly chemical method has been discovered to control this pest. Until recently, the molecular basis of the olfactory system in A. quadriimpressum was completely unknown. In this study, antennae and leg transcriptomes were analyzed and compared using deep sequencing data to identify the olfactory genes in A. quadriimpressum. Moreover, the expression profiles of both male and female candidate olfactory genes were analyzed and validated by bioinformatics, motif analysis, homology analysis, semi-quantitative RT-PCR and RT-qPCR experiments in antennal and non-olfactory organs to explore the candidate olfactory genes that might play key roles in the life cycle of A. quadriimpressum. As a result, approximately 102.9 million and 97.3 million clean reads were obtained from the libraries created from the antennas and legs, respectively. Annotation led to 34344 Unigenes, which were matched to known proteins. Annotation data revealed that the number of genes in antenna with binding functions and receptor activity was greater than that of legs. Furthermore, many pathway genes were differentially expressed in the two organs. Sixteen candidate odorant binding proteins (OBPs, 10 chemosensory proteins (CSPs, 34 odorant receptors (ORs, 20 inotropic receptors [1] and 2 sensory neuron membrane proteins (SNMPs and their isoforms were identified. Additionally, 15 OBPs, 9 CSPs, 18 ORs, 6 IRs and 2 SNMPs were predicted to be complete ORFs. Using RT-PCR, RT-qPCR and homology analysis, AquaOBP1/2/4/7/C1/C6, AquaCSP3/9, AquaOR8/9/10/14/15/18/20/26/29/33, AquaIR8a/13/25a showed olfactory-specific expression, indicating that these genes might play a key role in olfaction-related behaviors in A. quadriimpressum such as foraging and seeking. AquaOBP4/C5, Aqua

  8. Investigation on Thermocompression Bonding Using Lead Free Sinterable Paste and High Lead Solder Paste for Power QFN Application

    Directory of Open Access Journals (Sweden)

    Chandrakasan Gunaseelan

    2016-01-01

    Full Text Available Persistently growing Power QFN packages are used in various fields especially micro-electronics, aerospace, oil and gas as well. However, the particular industries is pushing forward to reduce the use of hazardous materials in the process of manufacturing and assemblies. Thermo-compression die-attach layer is perceived to be the most critical element in power QFN packages as the increase in operating temperature requires new materials with suitable thermo-chemical properties also with suitable melting points of next generation lead free die attachment material. In this situation, Hi-lead solder (RM218: Pb92.5Sn5Ag2.5 which known as high temperature material is widely being used in most semiconductor assembly for die attach, yet it deduce few reliability challenges like solder voids, the clip tilt performance and also solder splash which has been considered as major quality issue in assembly of Power QFN packages (FET die, IC die and clip attach. As a solution, sintering epoxy paste (SPC073-3: Sn96.5/Ag3/Cu0.5 is being considered as a replacement. In this case, sintering epoxy paste demonstrating excellent electrical and thermal performance for Power QFN packages which is known to be demanded in market. Thus, this study investigates the differential pastes sintering paste and also solder paste, in order to identify best die attachment material to be used in thermo-compression bonding method. Therefore, the shear strength was resulting good indication where the sintering paste was recorded 2.4 Kg/mm meanwhile the solder paste was recorded 0Kg/mm at peak temperature of 260°C. Besides of that, the pot life seems promising as the sintering paste seems to have constant viscosity of 100Pa*s throughout the 48 hours tested while, high lead solder paste records viscosity from 100Pa*s marginally increase as the time increase which effects the inconsistency of pot life. Last but not least, the voids mechanisms proves sintering epoxy paste has the same

  9. A New Solder Jet Printing Technology and its Characteristics%一种新型焊膏喷印技术

    Institute of Scientific and Technical Information of China (English)

    周峻霖; 臧子昂; 卢剑寒; 李金宝; 段元明

    2012-01-01

      Solder paste printing is one of key processing technologies in SMT/Surface Mount Technology manufacture, the processing quality would impact the following surface mounting, solder-reflow and packaging, the comprehensive product quality,etc. At first,the paper introduced the solder paste screen printing technology, and a brand-new solder paste jet printing technology developed from abroad. Later, it focused on a comparison of the processing principles, characteristics and advantages of these 2 processing technologies. The present microelectronics Industry are mostly applying metal mask stencil in solder paste screen printing to push for high-quality solder pattern, but due to impacts from multi-factors like equipment parameters, operator experiencee, the screen printing quality would be effected. Comparatively speaking, the jet printing technology is highly automatic and it is capable of shortening the difference of solder patten processing qulity against the original solder pattern expectation in jet software.%  焊膏印刷是SMT/表面组装技术的核心工艺,其加工质量的优劣关系到后序组装、回流焊、封装及产品整体性能。文章首先介绍了通过金属箔掩模版、激光打孔不锈钢掩模版进行焊膏丝印的技术,并介绍了国外研发成功的一种焊膏喷印新技术。同时,对两种工艺技术的原理、特点和优势进行了详细比较。当前微电子业界焊膏网印过程中,一般大量使用丝网印刷来获取高质量的焊膏图形,但多种硬件参数、操作员个人经验因素等综合因素会影响到最终加工效果。比较而言,焊膏喷印方式自动化程度高,可有效缩短焊膏图形最终加工结果与焊膏喷印软件中预计效果间的差距。

  10. Microstructural development and mechanical properties of a near-eutectic directionally solidified Sn–Bi solder alloy

    International Nuclear Information System (INIS)

    Sn–Bi solders may be applied for electronic applications where low-temperature soldering is required, i.e., sensitive components, step soldering and soldering LEDs. In spite of their potential to cover such applications, the mechanical response of soldered joints of Sn–Bi alloys in some cases does not meet the strength requirements due to inappropriate resulting microstructures. Hence, careful examination and control of as-soldered microstructures become necessary with a view to pre-programming reliable final properties. The present study aims to investigate the effects of solidification thermal parameters (growth rate — VL and cooling rate — T-dotL) on the microstructure of the Sn–52 wt.%Bi solder solidified under unsteady-state conditions. Samples were obtained by upward directional solidification (DS), followed by characterization through metallography and scanning electron microscopy (SEM). The microstructures are shown to be formed by Sn-rich dendrites decorated with Bi precipitates surrounded by a complex regular eutectic mixture, with alternated Bi-rich and Sn-rich phases. Experimental correlations of primary (λ1), secondary (λ2), tertiary (λ3) dendritic and eutectic spacings (λcoarse and λfine) with cooling rate and growth rate are established. Two ranges of lamellar eutectic sizes were determined, described by two experimental equations λ = 1.1 VL−1/2 and λ = 0.67 VL−1/2. The onset of tertiary branches within the dendritic array along the Sn–52 wt.%Bi alloy DS casting is shown to occur for cooling rates lower than 1.5 °C/s. - Highlights: • The Sn–52 wt.%Bi solder was shown to have two eutectic sizes. • The fishbone eutectic is preferably located adjacent to the Bi-rich lamellar phases. • The onset of tertiary dendritic branches in Sn–Bi is associated with T-dotL < 1.5 °C/s. • Higher eutectic fraction and λ3 provoked a reverse increase in σu and σy

  11. Microstructural development and mechanical properties of a near-eutectic directionally solidified Sn–Bi solder alloy

    Energy Technology Data Exchange (ETDEWEB)

    Silva, Bismarck Luiz, E-mail: bismarck_luiz@yahoo.com.br [Department of Materials Engineering, Federal University of São Carlos, UFSCar, 13565-905 São Carlos, SP (Brazil); Reinhart, Guillaume; Nguyen-Thi, Henri; Mangelinck-Noël, Nathalie [Aix Marseille Université, CNRS, IM2NP UMR 7334, 13397 Marseille (France); Garcia, Amauri [Department of Manufacturing and Materials Engineering, University of Campinas, UNICAMP, PO Box 6122, 13083-970 Campinas, SP (Brazil); Spinelli, José Eduardo [Department of Materials Engineering, Federal University of São Carlos, UFSCar, 13565-905 São Carlos, SP (Brazil)

    2015-09-15

    Sn–Bi solders may be applied for electronic applications where low-temperature soldering is required, i.e., sensitive components, step soldering and soldering LEDs. In spite of their potential to cover such applications, the mechanical response of soldered joints of Sn–Bi alloys in some cases does not meet the strength requirements due to inappropriate resulting microstructures. Hence, careful examination and control of as-soldered microstructures become necessary with a view to pre-programming reliable final properties. The present study aims to investigate the effects of solidification thermal parameters (growth rate — V{sub L} and cooling rate — T-dot{sub L}) on the microstructure of the Sn–52 wt.%Bi solder solidified under unsteady-state conditions. Samples were obtained by upward directional solidification (DS), followed by characterization through metallography and scanning electron microscopy (SEM). The microstructures are shown to be formed by Sn-rich dendrites decorated with Bi precipitates surrounded by a complex regular eutectic mixture, with alternated Bi-rich and Sn-rich phases. Experimental correlations of primary (λ{sub 1}), secondary (λ{sub 2}), tertiary (λ{sub 3}) dendritic and eutectic spacings (λ{sub coarse} and λ{sub fine}) with cooling rate and growth rate are established. Two ranges of lamellar eutectic sizes were determined, described by two experimental equations λ = 1.1 V{sub L}{sup −1/2} and λ = 0.67 V{sub L}{sup −1/2}. The onset of tertiary branches within the dendritic array along the Sn–52 wt.%Bi alloy DS casting is shown to occur for cooling rates lower than 1.5 °C/s. - Highlights: • The Sn–52 wt.%Bi solder was shown to have two eutectic sizes. • The fishbone eutectic is preferably located adjacent to the Bi-rich lamellar phases. • The onset of tertiary dendritic branches in Sn–Bi is associated with T-dot{sub L} < 1.5 °C/s. • Higher eutectic fraction and λ{sub 3} provoked a reverse increase in

  12. Anisotropic viscoelastic shell modeling technique of copper patterns/photoimageable solder resist composite for warpage simulation of multi-layer printed circuit boards

    International Nuclear Information System (INIS)

    In this study, the warpage simulation of a multi-layer printed circuit board (PCB) was performed as a function of various copper (Cu) patterns/photoimageable solder resist (PSR) composite patterns and their anisotropic viscoelastic properties. The thermo-mechanical properties of Cu/PSR patterns were obtained from finite element analysis (virtual test) and homogenized with anisotropic composite shell models that considered the viscoelastic properties. The multi-layer PCB model was simplified based on the unit Cu/PSR patterns and the warpage simulation during the reflow process was performed by using ABAQUS combined with a user-defined subroutine. From these results, it was demonstrated that the proposed anisotropic viscoelastic composite shell simulation technique can be successfully used to predict warpage of multi-layer PCBs during the reflow process. (paper)

  13. Various Approaches for Targeting Quasar Candidates

    Science.gov (United States)

    Zhang, Y.; Zhao, Y.

    2015-09-01

    With the establishment and development of space-based and ground-based observational facilities, the improvement of scientific output of high-cost facilities is still a hot issue for astronomers. The discovery of new and rare quasars attracts much attention. Different methods to select quasar candidates are in bloom. Among them, some are based on color cuts, some are from multiwavelength data, some rely on variability of quasars, some are based on data mining, and some depend on ensemble methods.

  14. Rapid directional solidification in Sn-Cu lead-free solder

    Institute of Scientific and Technical Information of China (English)

    Jun Shen; Yongchang Liu; Houxiu Gao

    2006-01-01

    An experimental study on the microstructures of a rapid directionally solidified metallo-eutectic Sn-Cu alloy was carried out.This material is an important alloy that is used as a lead-free solder. The results showed that the kinetic undercooling due to the rapid solidification process led to the formation of a pseudoeutectic zone, whereas the hypereutectic reaction produced the regular lamellar structure in the hypereutectic Sn-1.0Cu alloy. The corresponding arm spacing in the obtained lamellar phases decreased gradually with the increase of the applied cooling rate, which corresponded well with the prediction of a rapid directional solidification model.

  15. Control of microstructure in soldered, brazed, welded, plated, cast or vapor deposited manufactured components

    Science.gov (United States)

    Ripley, Edward B.; Hallman, Russell L.

    2015-11-10

    Disclosed are methods and systems for controlling of the microstructures of a soldered, brazed, welded, plated, cast, or vapor deposited manufactured component. The systems typically use relatively weak magnetic fields of either constant or varying flux to affect material properties within a manufactured component, typically without modifying the alloy, or changing the chemical composition of materials or altering the time, temperature, or transformation parameters of a manufacturing process. Such systems and processes may be used with components consisting of only materials that are conventionally characterized as be uninfluenced by magnetic forces.

  16. Solder Stencil Printing on Deep Cavity%深腔焊膏印刷

    Institute of Scientific and Technical Information of China (English)

    Elsie A. Cabahug; Marion D. Bartolo; 李翔

    2009-01-01

    过去,在金属介质上进行倒装芯片组装时,如何在有凹槽空间的介质上实现焊膏印刷成为一大挑战.主要瓶颈是限流器有限区域内的模腔(深度小于2.0mm).一种做法是印刷焊膏时使用多孔焊膏喷嘴,其带来的问题在于喷嘴堵塞会造成焊膏量不一致.而喷嘴口的多重设计和焊膏尺寸的一致性对于提高焊膏性能至关重要.焊膏印刷技术已经使用多年.然而,传统的二维模版技术主要适用于平面介质.最近,相关模版制造商研发了一种新的模版技术,能够在小于100μm的凹槽上印刷.最新的研发成果是使用3D模版,配合一个专门设计的刮刀,以实现在受力变形的有限空间上良好的印刷效果.本文研究的是采用3D模版在凹槽深300μ m、小于2.0mm区域上实现焊膏印刷的技术,该技术可在有限空间内实现一致的焊膏印刷效果;此外,本文还研究了在间隔400μm、凹槽深150μm的区域上实现焊膏印刷的技术.3D模版可帮助焊膏印刷在凹槽空间内更好地控制焊膏质量.以下几个因素会影响焊膏印刷质量:焊料类型、模版布局、刮刀类型、凹槽形态及深度,此外还包含印刷参数.上述因素的相互作用使得在凹槽上进行连续的焊膏印刷成为可能.%In the past when flip chip assembly on a metal substrate was implemented, these presented a challenge in solder paste printing using stencil on a cavity-formed space. The main restrictor is the cavity depth on a limited area (less than 2.0mm). Hence, an approach was to solder dispensing using a multi-hole dispense nozzle. This created challenges on the nozzle hole clogging resulting in inconsistencies and unacceptable volume deposited. Several iterations in the nozzle hole design and solder powder size consistency improved the performance but not to the expected level.Stencil printing technologies have been in use in the industry for many years. However, the conventional 2D stencil

  17. A novel dengue virus serotype 1 vaccine candidate based on Japanese encephalitis virus vaccine strain SA14-14-2 as the backbone.

    Science.gov (United States)

    Yang, Huiqiang; Li, Zhushi; Lin, Hua; Wang, Wei; Yang, Jian; Liu, Lina; Zeng, Xianwu; Wu, Yonglin; Yu, Yongxin; Li, Yuhua

    2016-06-01

    To develop a potential dengue vaccine candidate, a full-length cDNA clone of a novel chimeric virus was constructed using recombinant DNA technology, with Japanese encephalitis virus (JEV) vaccine strain SA14-14-2 as the backbone, with its premembrane (prM) and envelope (E) genes substituted by their counterparts from dengue virus type 1 (DENV1). The chimeric virus (JEV/DENV1) was successfully recovered from primary hamster kidney (PHK) cells by transfection with the in vitro transcription products of JEV/DENV1 cDNA and was identified by complete genome sequencing and immunofluorescent staining. No neuroinvasiveness of this chimeric virus was observed in mice inoculated by the subcutaneous route (s.c.) or by the intraperitoneal route (i.p.), while some neurovirulence was displayed in mice that were inoculated directly by the intracerebral route (i.c.). The chimeric virus was able to stimulate high-titer production of antibodies against DENV1 and provided protection against lethal challenge with neuroadapted dengue virus in mice. These results suggest that the chimeric virus is a promising dengue vaccine candidate. PMID:26976137

  18. Roles of phosphorous in Sn{sub 4}Ag{sub 0.5}Cu solder reaction with electrolytic Ni-Au

    Energy Technology Data Exchange (ETDEWEB)

    Key Chung, C. [Department of Materials Science and Engineering, National Taiwan University, No. 1, Sec. 4, Roosevelt Road, Taipei 10617, Taiwan (China); Assembly Test Global Materials, Intel Microelectronics Asia Ltd., B1, No. 205, Tun-Hwa North Road, Taipei 10595, Taiwan (China); Huang, T.C. [Department of Materials Science and Engineering, National Taiwan University, No. 1, Sec. 4, Roosevelt Road, Taipei 10617, Taiwan (China); Shia, R. [Assembly Test Global Materials, Intel Microelectronics Asia Ltd., B1, No. 205, Tun-Hwa North Road, Taipei 10595, Taiwan (China); Yang, T.L. [Department of Materials Science and Engineering, National Taiwan University, No. 1, Sec. 4, Roosevelt Road, Taipei 10617, Taiwan (China); Kao, C.R., E-mail: crkao@ntu.edu.tw [Department of Materials Science and Engineering, National Taiwan University, No. 1, Sec. 4, Roosevelt Road, Taipei 10617, Taiwan (China)

    2012-10-25

    Graphical abstract: The reaction of P-doped Sn{sub 4}Ag{sub 0.5}Cu solder with electrolytic Ni-Au forms a layer of nano crystallites in between (Cu,Ni){sub 6}Sn{sub 5} and (Ni,Cu){sub 3}Sn{sub 4}. This layer effectively suppresses the growth of intermetallic compound. Highlights: Black-Right-Pointing-Pointer P-doped solder changed the intermetallic compounds from chunky to planar structure. Black-Right-Pointing-Pointer P-doped solder suppressed the growth of intermetallic and tensile strain. Black-Right-Pointing-Pointer Nano crystallites were found in between (Ni,Cu){sub 6}Sn{sub 5} and (Cu,Ni){sub 3}Sn{sub 4}. Black-Right-Pointing-Pointer P-doped solder strengthened the interface initially but not multiple reflows. Black-Right-Pointing-Pointer P-doped solder increased the activation energy of intermetallic compounds. - Abstract: In this study, the interfacial reactions of different P-doped and undoped Sn{sub 4}Ag{sub 0.5}Cu solders with electrolytic Ni-Au were investigated. The solder joints were reflowed once and then subjected to two more reflow cycles. The thickness of the intermetallic compound (IMC) layer and the IMC composition were analyzed by scanning electron microscopy and transmission electron microscopy (TEM). The tensile properties of the solder joint were measured using a Dage 4000 instrument. The results showed that the P content of the solder was inversely proportional to the IMC layer thickness and maximum tensile strain. TEM observations showed that a nanocrystallite layer existed between (Ni,Cu){sub 6}Sn{sub 5} and (Cu,Ni){sub 3}Sn{sub 4}. This nanocrystallite layer was responsible for the abovementioned relationship. This layer not only suppressed the growth of the IMC layer effectively but also decreased the pull strength of the solder joint after three reflow cycles. Energy-dispersive X-ray spectra of this interfacial layer were recorded to determine the P, Ni, Cu, and Sn contents. As the P content of the P-doped Sn{sub 4}Ag{sub 0.5}Cu solder

  19. Hypervelocity Star Candidates in the SEGUE G & K Dwarf Sample

    CERN Document Server

    Palladino, Lauren E; Holley-Bockelmann, Kelly; Prieto, Carlos Allende; Beers, Timothy C; Lee, Young Sun; Schneider, Donald P

    2013-01-01

    We identify 13 candidate hypervelocity stars from the Sloan Extension for Galactic Understanding and Exploration (SEGUE) G and K dwarf samples. Previous searches for hypervelocity stars have only focused on large radial velocities; in this study we also use proper motions to select the candidates. We determine the hypervelocity likelihood of each candidate, considering the significant errors often associated with high proper motion stars via Monte Carlo simulations. We find that more than half of the candidates exceed their escape velocities with at least 90% probability. All of our candidates also have less than a 60% chance of being a high velocity fluke within the SEGUE sample. Based on orbits calculated using the observed 6-d positions and velocities, few, if any, of these candidates originate from the Galactic Center. If these candidates are truly hypervelocity stars, they were not ejected by interactions with the Milky Way's supermassive black hole. This calls for a more serious examination of alternati...

  20. Research on the Social-cost-based Model for Bid Evaluation of BOT Project Concession Candidates%考虑社会成本的BOT项目特许经营者评标模型研究

    Institute of Scientific and Technical Information of China (English)

    路浩; 何德文

    2014-01-01

    对于BOT项目委托方而言,项目的价值在于社会效益的实现程度而不仅仅是考虑项目的建设成本。提出了一套考虑社会成本的BOT项目特许经营者评标属性集,当特许经营者评标属性的权重已知,评标委员会对各属性的评价以及业主对特许经营者的偏好不确定的情况下,运用区间数和灰色关联分析来构建特许经营者评标模型,通过引入区间数距离,求得区间数的灰色关联度,最终对各候选特许经营者进行排序。由于该模型考虑了社会成本因素,对促使特许经营者更加合理地规划项目方案,减少社会成本的形成具有一定的作用。此外,引入区间数来处理社会成本等模糊评价信息,提高了评标结果的科学性。%For BOT project clients,the project value is to realize social benefit,rather than merely to consider the construction cost of the project. This paper presents a set of social-cost-based attributes for bid evaluation of BOT project concession candidates. The bid evaluation committee can develop a model for bid evaluation of concession candidates based on interval numbers and grey relational analysis,if they understand weighted attributes and face uncertainties concerning the attributes evaluation and the owner’s preference for concession candidates. The ranking of concession candidates can be done by obtaining grey correlation for interval numbers through the distance between interval numbers. This social-cost-based model is established to contribute to less social costs by forcing a concession candidate to work out a more reasonable operational scheme. Meanwhile,uncertain information for decision making is offset by interval numbers,yielding more practical evaluation results.

  1. Protective effects of a Modified Vaccinia Ankara-based vaccine candidate against Crimean-Congo Haemorrhagic Fever virus require both cellular and humoral responses.

    Directory of Open Access Journals (Sweden)

    Stuart D Dowall

    Full Text Available Crimean-Congo Haemorrhagic Fever (CCHF is a severe tick-borne disease, endemic in many countries in Africa, the Middle East, Eastern Europe and Asia. There is no approved vaccine currently available against CCHF. The most promising candidate, which has previously been shown to confer protection in the small animal model, is a modified Vaccinia Ankara virus vector expressing the CCHF viral glycoprotein (MVA-GP. It has been shown that MVA-GP induces both humoral and cellular immunogenicity. In the present study, sera and T-lymphocytes were passively and adoptively transferred into recipient mice prior to challenge with CCHF virus. Results demonstrated that mediators from both arms of the immune system were required to demonstrate protective effects against lethal challenge.

  2. Protective effects of a Modified Vaccinia Ankara-based vaccine candidate against Crimean-Congo Haemorrhagic Fever virus require both cellular and humoral responses.

    Science.gov (United States)

    Dowall, Stuart D; Graham, Victoria A; Rayner, Emma; Hunter, Laura; Watson, Robert; Taylor, Irene; Rule, Antony; Carroll, Miles W; Hewson, Roger

    2016-01-01

    Crimean-Congo Haemorrhagic Fever (CCHF) is a severe tick-borne disease, endemic in many countries in Africa, the Middle East, Eastern Europe and Asia. There is no approved vaccine currently available against CCHF. The most promising candidate, which has previously been shown to confer protection in the small animal model, is a modified Vaccinia Ankara virus vector expressing the CCHF viral glycoprotein (MVA-GP). It has been shown that MVA-GP induces both humoral and cellular immunogenicity. In the present study, sera and T-lymphocytes were passively and adoptively transferred into recipient mice prior to challenge with CCHF virus. Results demonstrated that mediators from both arms of the immune system were required to demonstrate protective effects against lethal challenge.

  3. Tensile creep characteristics of Sn–3.5Ag–0.5Cu (SAC355) solder reinforced with nano-metric ZnO particles

    International Nuclear Information System (INIS)

    Recently, nano-composite solders have been developed in the electronic packaging materials industry to improve the mechanical response of solder joints to be used in service under different conditions. In this study mechanical mixing has been used to disperse nano-metric ZnO particles in Sn–3.5Ag–0.5Cu (SAC355) solder at 420 °C for 2 h. In comparison with SAC355 solder, addition of nano-metric ZnO particles effectively suppressed the formation and restricted the volume fraction of the Ag3Sn and Cu6Sn5 intermetallic compound particles, lowering grain sizes and controlled the growth of β-Sn grains in the matrix. An improvement in tensile creep resistance of the reinforced SAC355 composite is noticed. This improvement seems to be due to its effect in structural refinement and makes the composite solder to display a large creep life time. The addition of nano-metric ZnO particles keeps the melting temperature nearly at the SAC355 level, indicating that the composite solder is fit for the existing soldering process

  4. EFFECT OF LASER INPUT ENERGY ON AuSnx INTERMETALLIC COMPOUNDS FORMATION IN SOLDER JOINTS WITH DIFFERENT THICKNESS OF Au SURFACE FINISH ON PADS

    Institute of Scientific and Technical Information of China (English)

    W.Liu; C.Q.Wang; Y.H.Tian; M.Y.Li

    2008-01-01

    Formation of AuSnx intermetallic compounds (IMCs) in laser reflowed solder joints was investigated. The results showed that few IMCs formed at the solder/0.1 μm Au interface. Needlelike AuSn4 IMCs were observed at the solder/0.5 μm Au interface.In Sn-2.0Ag-0.75Cu-3.0Bi and Sn-3.5Ag-O.75Cu solder joints, when the laser input energy was increased, AuSn4 IMCs changed from a layer to needlelike or dendritic distribution at the solder/0.9 μm Au interface. As for the solder joints with 4.0 μm thickness of Au surface finish on pads, AuSn4 , AuSn2, AuSn IMCs, and Au2 Sn phases formed at the interface. Moreover, the content of AuSnx IMCs, such as, AuSn4 and AuSn2, which contained high Sn concentration, would become larger as the laser input energy increased. In the Sn-37Pb solder joints with 0.9 μm or 4.0 μm thickness of the Au surface finish on pads, AuSn4 IMCs were in netlike distribution. The interspaces between them were filled with Pb-rich phases.

  5. Characterization of Cu3P phase in Sn3.0Ag0.5Cu0.5P/Cu solder joints

    Institute of Scientific and Technical Information of China (English)

    Jian-xun Chen; Xing-ke Zhao; Xu-chen Zou; Ji-hua Huang; Hai-chun Hu; Hai-lian Luo

    2014-01-01

    This article reports the effects of phosphorus addition on the melting behavior, microstructure, and mechanical properties of Sn3.0Ag0.5Cu solder. The melting behavior of the solder alloys was determined by differential scanning calorimetry. The interfacial micro-structure and phase composition of solder/Cu joints were studied by scanning electron microscopy and energy dispersive spectrometry. Thermodynamics of Cu-P phase formation at the interface between Sn3.0Ag0.5Cu0.5P solder and the Cu substrate was characterized. The results indicate that P addition into Sn3.0Ag0.5Cu solder can change the microstructure and cause the appearance of rod-like Cu3P phase which is distributed randomly in the solder bulk. The Sn3.0Ag0.5Cu0.5P joint shows a mixture of ductile and brittle fracture after shear test-ing. Meanwhile, the solidus temperature of Sn3.0Ag0.5Cu solder is slightly enhanced with P addition.

  6. Effects of Rapid Solidification Process and 0.1 wt.% Pr Addition on Properties of Sn-9Zn Alloy and Cu/Solder/Cu Joints

    Science.gov (United States)

    Zhao, Guoji; Jing, Yanxia; Sheng, Guangmin; Chen, Jianhua

    2016-05-01

    Effects of 0.1 wt.% Pr addition and rapid solidification process on Sn-9Zn solder alloy were investigated. Solder characteristics of the as-solidified and rapidly solidified Sn-9Zn-0.1Pr alloys were analyzed in comparison with those of the as-solidified Sn-9Zn alloy. Mechanical properties and interfacial microstructure of solder/Cu joints obtained using these solders were comparatively studied. By comparison with the as-solidified Sn-9Zn alloy, the wettability of the solder was obviously improved with 0.1 wt.% Pr addition, and the melting behavior of the solder was promoted due to the rapid solidification process. The corrosion resistance of Sn-9Zn-0.1Pr alloy was improved due to the refined microstructure resulting from 0.1 wt.% Pr addition and rapid solidification. The growth of IMCs at the interface of Sn-9Zn-0.1Pr/Cu joints was depressed in some degree. Rapid solidification process promoted the interfacial reaction during soldering and improved the bonding strength of joints.

  7. Use of multi-criteria decision analysis in regulatory alternatives analysis: a case study of lead free solder.

    Science.gov (United States)

    Malloy, Timothy F; Sinsheimer, Peter J; Blake, Ann; Linkov, Igor

    2013-10-01

    Regulators are implementing new programs that require manufacturers of products containing certain chemicals of concern to identify, evaluate, and adopt viable, safer alternatives. Such programs raise the difficult question for policymakers and regulated businesses of which alternatives are "viable" and "safer." To address that question, these programs use "alternatives analysis," an emerging methodology that integrates issues of human health and environmental effects with technical feasibility and economic impact. Despite the central role that alternatives analysis plays in these programs, the methodology itself is neither well-developed nor tailored to application in regulatory settings. This study uses the case of Pb-based bar solder and its non-Pb-based alternatives to examine the application of 2 multi-criteria decision analysis (MCDA) methods to alternatives analysis: multi-attribute utility analysis and outranking. The article develops and evaluates an alternatives analysis methodology and supporting decision-analysis software for use in a regulatory context, using weighting of the relevant decision criteria generated from a stakeholder elicitation process. The analysis produced complete rankings of the alternatives, including identification of the relative contribution to the ranking of each of the highest level decision criteria such as human health impacts, technical feasibility, and economic feasibility. It also examined the effect of variation in data conventions, weighting, and decision frameworks on the outcome. The results indicate that MCDA can play a critical role in emerging prevention-based regulatory programs. Multi-criteria decision analysis methods offer a means for transparent, objective, and rigorous analysis of products and processes, providing regulators and stakeholders with a common baseline understanding of the relative performance of alternatives and the trade-offs they present.

  8. Interactions of Cu-substrates with titanium-alloyed Sn-Zn solders

    Directory of Open Access Journals (Sweden)

    Soares D.

    2006-01-01

    Full Text Available The interactions of copper substrate with titanium-alloyed Sn-Zn eutectic solders have been studied. Two series of experiments have been performed. The first one consisted in differential thermal analyses of Sn-Zn nearly eutectic alloys containing from 1.3 to 2.2 wt. % Ti. Diffusion couples consisted of Cu-wires and Sn-Zn-Ti liquid solders, produced at 250 and 275 OC have been prepared in the second series,. The contact times were up to 3600 s. The contact zones have been characterized by optical and scanning electron microscope. Two layers have been found along the interfaces solid/liquid. The first and the second layers are identical, respectively, with γ and ε phases of the Cu-Zn system. No changes of the chemical compositions were detected for the tested temperatures and reaction times. Continuous parabolic growth of the total diffusion zone thickness with the time of diffusion is observed. The growth is due mainly to one the formed layers (γ while the thickness of the ε-phase layer, stays almost constant for all tested diffusion times and temperatures.

  9. Cell interconnection without glueing or soldering for crystalline Si photovoltaic modules

    Science.gov (United States)

    Summhammer, Johann; Halavani, Zahra

    2016-05-01

    In order to maximize the power output of polycrystalline silicon PV-modules, in previous work we have already tested rectangular cells of 39 × 156 mm which are overlapped along the long sides. The low current density at the cell overlap allows interconnections which need neither soldering nor glueing, but use metallic strips inserted between the cells in the overlap region. The contact is established by the pressure applied to the module during lamination and is retained by the slightly bent cells in the solidified encapsulant. Here we report on the long term stability of different contact materials and contact cross sections applied in eight modules of the 240 W class monitored for up to 24 months of outdoor operation and in a variety of small 5-cell modules exposed to rapid ageing tests with up to 1000 thermal cycles. Cells with three different electrode designs were tested and the contact materials were Cu, Ag, SnPbAg and Sn. Focussing especially on series resistance, fill factor and peak power, it is found that Ag-coated contact strips perform equally well and have practically the same stability as soldered cell interconnections. Due to 70-90% savings in copper and simpler manufacturing the cost of PV-modules may thus be reduced further.

  10. Cell interconnection without glueing or soldering for crystalline Si photovoltaic modules

    Directory of Open Access Journals (Sweden)

    Summhammer Johann

    2016-01-01

    Full Text Available In order to maximize the power output of polycrystalline silicon PV-modules, in previous work we have already tested rectangular cells of 39 × 156 mm which are overlapped along the long sides. The low current density at the cell overlap allows interconnections which need neither soldering nor glueing, but use metallic strips inserted between the cells in the overlap region. The contact is established by the pressure applied to the module during lamination and is retained by the slightly bent cells in the solidified encapsulant. Here we report on the long term stability of different contact materials and contact cross sections applied in eight modules of the 240 W class monitored for up to 24 months of outdoor operation and in a variety of small 5-cell modules exposed to rapid ageing tests with up to 1000 thermal cycles. Cells with three different electrode designs were tested and the contact materials were Cu, Ag, SnPbAg and Sn. Focussing especially on series resistance, fill factor and peak power, it is found that Ag-coated contact strips perform equally well and have practically the same stability as soldered cell interconnections. Due to 70–90% savings in copper and simpler manufacturing the cost of PV-modules may thus be reduced further.

  11. Miniaturization of Micro-Solder Bumps and Effect of IMC on Stress Distribution

    Science.gov (United States)

    Choudhury, Soud Farhan; Ladani, Leila

    2016-07-01

    As the joints become smaller in more advanced packages and devices, intermetallic (IMCs) volume ratio increases, which significantly impacts the overall mechanical behavior of joints. The existence of only a few grains of Sn (Tin) and IMC materials results in anisotropic elastic and plastic behavior which is not detectable using conventional finite element (FE) simulation with average properties for polycrystalline material. In this study, crystal plasticity finite element (CPFE) simulation is used to model the whole joint including copper, Sn solder and Cu6Sn5 IMC material. Experimental lap-shear test results for solder joints from the literature were used to validate the models. A comparative analysis between traditional FE, CPFE and experiments was conducted. The CPFE model was able to correlate the experiments more closely compared to traditional FE analysis because of its ability to capture micro-mechanical anisotropic behavior. Further analysis was conducted to evaluate the effect of IMC thickness on stress distribution in micro-bumps using a systematic numerical experiment with IMC thickness ranging from 0% to 80%. The analysis was conducted on micro-bumps with single crystal Sn and bicrystal Sn. The overall stress distribution and shear deformation changes as the IMC thickness increases. The model with higher IMC thickness shows a stiffer shear response, and provides a higher shear yield strength.

  12. Ti addition to enhance corrosion resistance of Sn–Zn solder alloy by tailoring microstructure

    Energy Technology Data Exchange (ETDEWEB)

    Liu, Jian-Chun [Department of Mechanical Engineering, Tsinghua University, Beijing 100084 (China); Zhang, Gong, E-mail: zhangg@tsinghua.edu.cn [Department of Mechanical Engineering, Tsinghua University, Beijing 100084 (China); Ma, Ju-Sheng [Department of Mechanical Engineering, Tsinghua University, Beijing 100084 (China); Suganuma, Katsuaki [Institute of Scientific and Industrial Research, Osaka University, Mihogaoka 8-1, Ibaraki, Osaka 567-0047 (Japan)

    2015-09-25

    Highlights: • Trace amount of Ti was added to Sn–9Zn alloy. • Corrosion resistance of the modified alloy was significantly enhanced. • Zn-rich precipitates within the microstructure were effectively refined. • The enhanced corrosion resistance was attributed to the refined Zn-rich precipitates. - Abstract: The effect of trace addition of Ti on the corrosion behavior of Sn–9Zn (wt.%) solder alloy in NaCl solution was investigated using polarization and electrochemical impedance spectroscopy techniques. It is found that the corrosion resistance of Sn–9Zn alloy can be significantly enhanced by adding 0.05 wt.% of Ti, evidenced by much lower corrosion current density, lower passive current density and higher impedance. Such enhancement results from the refinement of Zn-rich precipitates within the microstructure, which is conducive to forming a relatively more protective passive film on the surface of the modified alloy. This would be an important finding in the design of novel Sn–Zn solder alloys in electronic assemblies operating under aggressive conditions.

  13. High temperature indentation behavior of eutectic lead-free solder materials

    Directory of Open Access Journals (Sweden)

    Worrack H.

    2010-06-01

    Full Text Available Electronic malfunction caused by thermal stresses is one major problem in modern electronic industries. Therefore, the precise knowledge of the mechanical solder material properties as a function of temperature is required. Nanoindentation and its potential of recording load-displacement curves is a widely-used miniature test for the determination of Young’s modulus and hardness values. Furthermore, such tests can be performed in a temperature range from Room Temperature (RT up to +500°C by using a Hot-Stage add on. In this paper the lead-free solder alloys Sn91Zn9 and Sn42Bi58, and also copper and fused silica, which is used for the indenter calibration are investigated. The results for quartz and copper agree with the published values in several references. However, the Young’s modulus of Sn42Bi58 as a function of temperature differs from the values presented in the literature. Due to delayed material response in the unloading regime it must be assumed that creep effects lead to an incorrect automatic data evaluation. Investigation and understanding of the creep behavior is part of this paper. For this purpose a visco-elastic material model is used to model the indentation response at elevated temperatures and to determine the corresponding viscous material constants.

  14. Statistical Classification of Soft Solder Alloys by Laser-Induced Breakdown Spectroscopy: Review of Methods

    Science.gov (United States)

    Zdunek, R.; Nowak, M.; Pliński, E.

    2016-02-01

    This paper reviews machine-learning methods that are nowadays the most frequently used for the supervised classification of spectral signals in laser-induced breakdown spectroscopy (LIBS). We analyze and compare various statistical classification methods, such as linear discriminant analysis (LDA), quadratic discriminant analysis (QDA), partial least-squares discriminant analysis (PLS-DA), soft independent modeling of class analogy (SIMCA), support vector machine (SVM), naive Bayes method, probabilistic neural networks (PNN), and K-nearest neighbor (KNN) method. The theoretical considerations are supported with experiments conducted for real soft-solder-alloy spectra obtained using LIBS. We consider two decision problems: binary and multiclass classification. The former is used to distinguish overheated soft solders from their normal versions. The latter aims to assign a testing sample to a given group of materials. The measurements are obtained for several laser-energy values, projection masks, and numbers of laser shots. Using cross-validation, we evaluate the above classification methods in terms of their usefulness in solving both classification problems.

  15. Design and fabrication of lanthanum-doped tin-silver-copper lead-free solder for the next generation of microelectronics applications in severe environment

    Science.gov (United States)

    Sadiq, Muhammad

    Tin-Lead solder (Sn-Pb) has long been used in the Electronics industry. But, due to its toxic nature and environmental effects, certain restrictions are made on its use by the European Rehabilitation of Hazardous Substances (RoHS) directive, and therefore, many researchers are looking to replace it. The urgent need for removing lead from solder alloys led to the very fast introduction of lead-free solder alloys without a deep knowledge of their behavior. Therefore, an extensive knowledge and understanding of the mechanical behavior of the emerging generation of lead-free solders is required to satisfy the demands of structural reliability. Sn-Ag-Cu (SAC) solders are widely used as lead-free replacements but their coarse microstructure and formation of hard and brittle Inter-Metallic Compounds (IMCs) have limited their use in high temperature applications. Many additives are studied to refine the microstructure and improve the mechanical properties of SAC solders including iron (Fe), bismuth (Bi), antimony (Sb) and indium (In) etc. Whereas many researchers studied the impact of novel rare earth (RE) elements like lanthanum (La), cerium (Ce) and lutetium (Lu) on SAC solders. These RE elements are known as “vitamins of metals” because of their special surface active properties. They reduce the surface free energy, refine the grain size and improve the mechanical properties of many lead free solder alloys like Sn-Ag, Sn-Cu and SAC but still a systematic study is required to explore the special effects of “La” on the eutectic SAC alloys. The objective of this PhD thesis is to extend the current knowledge about lead free solders of SAC alloys towards lanthanum doping with varying environmental conditions implemented during service. This thesis is divided into six main parts.

  16. Characteristics of Laser Reflow Bumping of Sn3.5Ag and Sn3.5Ag0.5Cu Lead-Free Solder Balls

    Institute of Scientific and Technical Information of China (English)

    Yanhong TIAN; Chunqing WANG; Yarong CHEN

    2008-01-01

    Lead-free Sn3.5Ag and Sn3.5Ag0.5Cu solder balls were reflowed by laser to form solder bumps. Shear test was performed on the solder bumps, and SEM/EDX (scanning electron microscopy/energy dispersive X-ray spectrometer) was used to analyze the formation of intermetallic compounds (IMCs) at interface region. A finite element modeling on the temperature gradient and distribution at the interface of solder bump during laser reflow process was conducted to elucidate the mechanism of the IMCs growth direction. The results show that the parameters window for laser reflow bumping of Sn3.5Ag0.5Cu was wider than that of Sn3.5Ag. The shear strength of Sn3.5Ag0.5Cu solder bump was comparable to that of Sn3.5Ag solder bump, and was not affected obviously by laser power and irradiation time when appropriate parameters were used. Both laser power and heating time had a significant effect on the formation of IMCs. A continuous AuSn4 interrnetallic compound layer and some needle-like AuSn4 were observed at the interface of solder and Au/Ni/Cu metallization layer when the laser power is small. The formation of needle-like AuSn4 was due to temperature gradient at the interface, and the direction of temperature gradient was the preferred growth direction of AuSn4. With increasing the laser power and heating time, the needle-like AuSn4 IMCs dissolved into the bulk solder, and precipitated out once again during solidification along the grain boundary of the solder bump.

  17. Decomposition of no-clean solder flux systems and their effects on the corrosion reliability of electronics

    DEFF Research Database (Denmark)

    Conseil, Helene; Verdingovas, Vadimas; Jellesen, Morten Stendahl;

    2016-01-01

    of temperature, thus simulating the soldering process. Differential Scanning Calorimetry, Fourier Transform Infrared Spectroscopy, and Ion Chromatography were employed for decomposition and residue analysis. Aggressiveness of the residue was investigated using a pH indicator gel test and by acid value...

  18. Manual Method of Removing and Soldering for QFP%手工拆焊QFP器件的方法

    Institute of Scientific and Technical Information of China (English)

    李九峰

    2015-01-01

    在电子装联中,手工焊接始终是不可缺少的操作方法,特别是在产品以多品种和小批量为主的各大研究所内.以QFP封装器件为例,介绍QFP器件的封装类型和其发展趋势,从手工焊接方面论述焊接的条件、焊接温度、焊接技巧、焊接工具和相关焊接辅料的选择等.结合返修实践,分析手工返修QFP的相关过程控制要点和手工拆除QFP的方法.%Manual soldering is always an indispensable operational approach in electronic assembly, especially in institutes whose products are mainly in multi-varieties and small batch. Take QFP encapsulation device as an example, encapsulation kinds of QFP device and their development trends are introduced. The soldering conditions, temperature, techniques, tools, as well as selection of relevant soldering materials are discussed from the aspect of manual soldering. Combination of repair practice, key points for process control relating to manual repairing of QFP and method for mannul removing of QFP are analyzed.

  19. The Effect Of Void Formation On The Reliability Of ED-XRF Measurements In Lead-Free Reflow Soldering

    Directory of Open Access Journals (Sweden)

    Koncz-Horváth D.

    2015-06-01

    Full Text Available In lead-free reflow soldering, the presence of voids should be taken into account. For this reason, the effect of the applied heating profiles was examined via the characterization of voids in galvanic and immersion Sn coatings. According to EU Directive 2002/95/EC, the screening of Pb element of reflow soldering (i.e. of electrical and electronic equipment is necessary; and the practical implementation of this measurement is largely affected by the characteristics of the solder (i.e. the presence of voids and the inhomogeneity of the solder. Comparing the results of the above two coating methods, it was found that by chemical coating more voids were formed and the detected lead content was higher than for galvanic Sn. The standard deviation of Ag and Cu concentrations was mainly influenced by the appearance of large compounds in the second case, while with chemical coating, no large compounds were formed due to the elevated number of voids.

  20. Mechanical Behavior of Sn-3.0Ag-0.5Cu/Cu Solder Joints After Isothermal Aging

    Science.gov (United States)

    Nguyen, Van Luong; Chung, Chin-Sung; Kim, Ho-Kyung

    2016-01-01

    The tensile impact behavior of lead-free Sn-3Ag-0.5Cu/Cu solder joints aged at 413 K and 453 K for times ranging from 24 h to 1000 h has been investigated in this study. The activation energy for growth of the intermetallic compound (IMC) layer was estimated and compared with literature values. Additionally, the tensile strength of solder joints with IMC thickness of 17.6 μm was found to be more sensitive to the strain rate as compared with solder joints with thinner IMC layers. Equations representing the relationships among the effective stress, strain rate, aging time, and aging temperature as well as IMC thickness were established using matrix laboratory (MATLAB) software. These equations show that the tensile strength decreases with increase in the IMC thickness to about 8 μm, after which it becomes nearly constant when the IMC thickness is between approximately 8 μm and 14 μm, before decreasing significantly when the IMC thickness exceeds 14 μm. The main reason for these characteristics was excessive increase in the IMC thickness of solder joints, causing a change in the stress concentration of the tensile load from the protruding region to the inside of the IMC layer at the same tested strain rate.

  1. Effect of the addition of In on the microstructural formation of Sn-Ag-Zn lead-free solder

    International Nuclear Information System (INIS)

    The effect of addition of In, up to 1 wt.%, on the formation of intermetallic compounds (IMCs) in the solidified Sn-3.7%Ag-0.9%Zn lead-free solder was investigated. As observed by microstructural analysis, the typical structure of Sn-Ag-Zn solder is composed of β-Sn phase and mixed granules of Ag3Sn and AgZn IMCs. After alloying with In, it evolves into a mixture of randomly distributed rods and granules of Ag3Sn and AgZn. Clearly, the addition of In into the explored Sn-Ag-Zn solder promotes the formation of rod-like IMCs for the reason that the growth competition of the Ag3Sn and AgZn IMCs was destroyed by the selective adsorption of In atoms on a certain preferable crystalline planes of the separated IMCs. The change in the morphology of the formed IMCs leads to a great difference in the mechanical performances, for example, the measured microhardness of the investigated solders evolves from 16.95 HV to 21.35 HV with the increase of In content

  2. Size distribution and morphology of Cu6Sn5 scallops in wetting reaction between molten solder and copper

    International Nuclear Information System (INIS)

    During the reaction between molten solder and copper, ripening and growth of Cu6Sn5 scallops take place at the solder/metal interface. An experimental study on the morphology, size distribution and growth rate of Cu6Sn5 scallops was conducted. The measured size distributions of Cu6Sn5 as a function of time from top-view and cross-sectional view scanning electron microscopy images were in good agreement with the flux-driven ripening (FDR) theory. The FDR theory assumes a non-conservative ripening under a constant total interfacial area between the scallops and the solder, while the total volume of scallops increases with reaction time. The measured average radius of the scallops was proportional to the cube root of time. Comparing the experimental results and the theoretical model, the width of the liquid channel between scallops was calculated to be ∼2.5 nm. Morphology of the scallop-type Cu6Sn5 was dependent to the composition of the solder. The scallop morphology became more faceted when the composition was further away from the eutectic composition. The Cu6Sn5 scallops with a shape close to hemispheric gave better agreement with FDR theory. The small difference between the experimental data and theory was explained by taking the noise factor into account. The modified FDR model showed even better agreement with the experimental data

  3. Phase identification on the intermetallic compound formed between eutectic SnIn solder and single crystalline Cu substrate

    Energy Technology Data Exchange (ETDEWEB)

    Tian, Feifei; Liu, Zhi-Quan, E-mail: zqliu@imr.ac.cn; Shang, Pan-Ju; Guo, Jingdong

    2014-04-05

    Graphical abstract: Two kinds of intermetallic compounds were formed in three sublayers during interfacial reaction between eutectic SnIn solder and single crystalline Cu substrate, which are Cu(In,Sn){sub 2} layer with tetragonal crystal structure at solder side, coarse-grain Cu{sub 2}(In,Sn) sublayer and fine-grain Cu{sub 2}(In,Sn) sublayer with hexagonal crystal structure at Cu side. -- Highlights: • Reflowing at 160 °C Cu(In,Sn){sub 2} and Cu{sub 2}(In,Sn) were formed on single crystalline Cu. • Large Cu(In,Sn){sub 2} grain has tetragonal crystal structure with chunk-type morphology. • Cu(In,Sn){sub 2} layer is prone of spalling into solder in liquid soldering process. • Cu{sub 2}(In,Sn) is made up of fine and coarse sublayers with hexagonal crystal structure. • Fine Cu{sub 2}(In,Sn) grain has granular morphology and coarse one is elongated. -- Abstract: The intermetallic compound (IMC) formed between eutectic SnIn solder and single crystalline Cu substrate during reflow and solid-state aging was investigated precisely utilizing electron microscope. Two kinds of crystal structures with different morphologies were identified, which are Cu(In,Sn){sub 2} at the solder side and the Cu{sub 2}(In,Sn) at the Cu substrate side. The Cu(In,Sn){sub 2} layer with chunk-type morphology suffered spalling easily during slightly increased liquid soldering at 160 °C, and Cu{sub 2}(In,Sn) was in the form of duplex structure with coarse-grain and fine-grain sublayers. During solid-state aging at 60 °C, the morphology of fine-grain Cu{sub 2}(In,Sn) kept granule-type, while that of the coarse-grain Cu{sub 2}(In,Sn) was substrate-dependent with elongated morphology.

  4. Intergranular stress corrosion in soldered joints of stainless steel 304

    International Nuclear Information System (INIS)

    The intergranular stress cracking of welded joints of austenitic stainless steel, AISI 304, is a serious problem in BWR type reactors. It is associated with the simultaneous presence of three factors; stress, a critical media and sensibilization (DOS). EPR technique was used in order to verify the sensibilization degree in the base metal, and the zone affected by heat and welding material. The characterization of material was done. The objective of this work is the study of microstructure and the evaluation of EPR technique used for the determination of DOS in a welded plate of austenitic stainless steel AISI 304. (Author)

  5. Electoral Systems and Candidate Selection

    NARCIS (Netherlands)

    Hazan, Reuven Y.; Voerman, Gerrit

    2006-01-01

    Electoral systems at the national level and candidate selection methods at the party level are connected, maybe not causally but they do influence each other. More precisely, the electoral system constrains and conditions the parties' menu of choices concerning candidate selection. Moreover, in ligh

  6. Newly identified YSO candidates towards the LDN 1188

    CERN Document Server

    Marton, Gábor; Kiss, Csaba; Smidla, József

    2013-01-01

    We present an analysis of Young Stellar Object (YSO) candidates towards the LDN 1188 molecular cloud. The YSO candidates were selected from the WISE all-sky catalogue, based on a statistical method. We found 601 candidates in the region, and classified them as Class I, Flat and Class II YSOs. Groups were identified and described with the Minimal Spanning Tree (MST) method. Previously identified molecular cores show evidence of ongoing star formation at different stages throughout the cloud complex.

  7. Generation and characterization of potential dengue vaccine candidates based on domain III of the envelope protein and the capsid protein of the four serotypes of dengue virus.

    Science.gov (United States)

    Suzarte, Edith; Marcos, Ernesto; Gil, Lázaro; Valdés, Iris; Lazo, Laura; Ramos, Yassel; Pérez, Yusleidi; Falcón, Viviana; Romero, Yaremis; Guzmán, María G; González, Sirenia; Kourí, Juan; Guillén, Gerardo; Hermida, Lisset

    2014-07-01

    Dengue is currently one of the most important arthropod-borne diseases, causing up to 25,000 deaths annually. There is currently no vaccine to prevent dengue virus infection, which needs a tetravalent vaccine approach. In this work, we describe the cloning and expression in Escherichia coli of envelope domain III-capsid chimeric proteins (DIIIC) of the four dengue serotypes as a tetravalent dengue vaccine candidate that is potentially able to generate humoral and cellular immunity. The recombinant proteins were purified to more than 85 % purity and were recognized by anti-dengue mouse and human sera. Mass spectrometry analysis verified the identity of the proteins and the correct formation of the intracatenary disulfide bond in the domain III region. The chimeric DIIIC proteins were also serotype-specific, and in the presence of oligonucleotides, they formed aggregates that were visible by electron microscopy. These results support the future use of DIIIC recombinant chimeric proteins in preclinical studies in mice for assessing their immunogenicity and efficacy. PMID:24420159

  8. SU-B-213-00: Education Council Symposium: Accreditation and Certification: Establishing Educational Standards and Evaluating Candidates Based on these Standards

    Energy Technology Data Exchange (ETDEWEB)

    NONE

    2015-06-15

    The North American medical physics community validates the education received by medical physicists and the clinical qualifications for medical physicists through accreditation of educational programs and certification of medical physicists. Medical physics educational programs (graduate education and residency education) are accredited by the Commission on Accreditation of Medical Physics Education Programs (CAMPEP), whereas medical physicists are certified by several organizations, the most familiar of which is the American Board of Radiology (ABR). In order for an educational program to become accredited or a medical physicist to become certified, the applicant must meet certain specified standards set by the appropriate organization. In this Symposium, representatives from both CAMPEP and the ABR will describe the process by which standards are established as well as the process by which qualifications of candidates for accreditation or certification are shown to be compliant with these standards. The Symposium will conclude with a panel discussion. Learning Objectives: Recognize the difference between accreditation of an educational program and certification of an individual Identify the two organizations primarily responsible for these tasks Describe the development of educational standards Describe the process by which examination questions are developed GS is Executive Secretary of CAMPEP.

  9. The power of low-resolution spectroscopy: On the spectral classification of planet candidates in the ground-based CoRoT follow-up

    CERN Document Server

    Eiff, M Ammler-von; Guenther, E W; Stecklum, B; Cabrera, J

    2015-01-01

    Planetary transits detected by the CoRoT mission can be mimicked by a low-mass star in orbit around a giant star. Spectral classification helps to identify the giant stars and also early-type stars which are often excluded from further follow-up. We study the potential and the limitations of low-resolution spectroscopy to improve the photometric spectral types of CoRoT candidates. In particular, we want to study the influence of the signal-to-noise ratio (SNR) of the target spectrum in a quantitative way. We built an own template library and investigate whether a template library from the literature is able to reproduce the classifications. Including previous photometric estimates, we show how the additional spectroscopic information improves the constraints on spectral type. Low-resolution spectroscopy ($R\\approx$1000) of 42 CoRoT targets covering a wide range in SNR (1-437) and of 149 templates was obtained in 2012-2013 with the Nasmyth spectrograph at the Tautenburg 2m telescope. Spectral types have been d...

  10. SU-B-213-00: Education Council Symposium: Accreditation and Certification: Establishing Educational Standards and Evaluating Candidates Based on these Standards

    International Nuclear Information System (INIS)

    The North American medical physics community validates the education received by medical physicists and the clinical qualifications for medical physicists through accreditation of educational programs and certification of medical physicists. Medical physics educational programs (graduate education and residency education) are accredited by the Commission on Accreditation of Medical Physics Education Programs (CAMPEP), whereas medical physicists are certified by several organizations, the most familiar of which is the American Board of Radiology (ABR). In order for an educational program to become accredited or a medical physicist to become certified, the applicant must meet certain specified standards set by the appropriate organization. In this Symposium, representatives from both CAMPEP and the ABR will describe the process by which standards are established as well as the process by which qualifications of candidates for accreditation or certification are shown to be compliant with these standards. The Symposium will conclude with a panel discussion. Learning Objectives: Recognize the difference between accreditation of an educational program and certification of an individual Identify the two organizations primarily responsible for these tasks Describe the development of educational standards Describe the process by which examination questions are developed GS is Executive Secretary of CAMPEP

  11. Genetic variants determining survival and fertility in an adverse African environment: a population-based large-scale candidate gene association study.

    Science.gov (United States)

    Koopman, Jacob J E; Pijpe, Jeroen; Böhringer, Stefan; van Bodegom, David; Eriksson, Ulrika K; Sanchez-Faddeev, Hernando; Ziem, Juventus B; Zwaan, Bas; Slagboom, P Eline; de Knijff, Peter; Westendorp, Rudi G J

    2016-07-01

    Human survival probability and fertility decline strongly with age. These life history traits have been shaped by evolution. However, research has failed to uncover a consistent genetic determination of variation in survival and fertility. As an explanation, such genetic determinants have been selected in adverse environments, in which humans have lived during most of their history, but are almost exclusively studied in populations in modern affluent environments. Here, we present a large-scale candidate gene association study in a rural African population living in an adverse environment. In 4387 individuals, we studied 4052 SNPs in 148 genes that have previously been identified as possible determinants of survival or fertility in animals or humans. We studied their associations with survival comparing newborns, middle-age adults, and old individuals. In women, we assessed their associations with reported and observed numbers of children. We found no statistically significant associations of these SNPs with survival between the three age groups nor with women's reported and observed fertility. Population stratification was unlikely to explain these results. Apart from a lack of power, we hypothesise that genetic heterogeneity of complex phenotypes and gene-environment interactions prevent the identification of genetic variants explaining variation in survival and fertility in humans.

  12. Developing a fast cordless soldering iron via induction heating

    Directory of Open Access Journals (Sweden)

    Ernesto Edgar Mazón-Valadez

    2014-01-01

    Full Text Available Se presenta el desarrollo de un dispositivo para soldar compone ntes electrónicos, el cual funciona a base de campos magnéticos alternos. El dispositivo ha sido diseñado para trabajar sin cableado. El nuevo soldador se compone de un inversor resonante capaz de gen erar campos magnéticos alternos de 250 kHz en el centro de una bobin a de 11 espiras. El elemento calefactor es una pequeña pieza ci líndrica de acero inoxidable magnético con un núcleo concéntrico de cobr e, el cual se encuentra unido a una punta reemplazable para cau tín comercial. Adicionalmente hemos determinado el factor de potenc ia y la eficiencia en la transferencia de energía con un máximo de consumo de potencia de 134 Watts. El dispositivo representa una buena herramienta adecuada para la realización de tarjetas imp resas para circuitos o tareas de electrónica.

  13. Enhanced mucosal immune responses induced by a combined candidate mucosal vaccine based on Hepatitis A virus and Hepatitis E virus structural proteins linked to tuftsin.

    Directory of Open Access Journals (Sweden)

    Yan Gao

    Full Text Available Hepatitis A virus (HAV and Hepatitis E virus (HEV are the most common causes of infectious hepatitis. These viruses are spread largely by the fecal-oral route and lead to clinically important disease in developing countries. To evaluate the potential of targeting hepatitis A and E infection simultaneously, a combined mucosal candidate vaccine was developed with the partial open reading frame 2 (ORF2 sequence (aa 368-607 of HEV (HE-ORF2 and partial virus protein 1 (VP1 sequence (aa 1-198 of HAV (HA-VP1, which included the viral neutralization epitopes. Tuftsin is an immunostimulatory peptide which can enhance the immunogenicity of a protein by targeting it to macrophages and dendritic cells. Here, we developed a novel combined protein vaccine by conjugating tuftsin to HE-ORF2 and HA-VP1 and used synthetic CpG oligodeoxynucleotides (ODNs as the adjuvant. Subsequent experiments in BALB/c mice demonstrated that tuftsin enhanced the serum-specific IgG and IgA antibodies against HEV and HAV at the intestinal, vaginal and pulmonary interface when delivered intranasally. Moreover, mice from the intranasally immunized tuftsin group (HE-ORF2-tuftsin + HA-VP1-tuftsin + CpG showed higher levels of IFN-γ-secreting splenocytes (Th1 response and ratio of CD4+/CD8+ T cells than those of the no-tuftsin group (HE-ORF2 + HA-VP1 + CpG. Thus, the tuftsin group generated stronger humoral and cellular immune responses compared with the no-tuftsin group. Moreover, enhanced responses to the combined protein vaccine were obtained by intranasal immunization compared with intramuscular injection. By integrating HE-ORF2, HA-VP1 and tuftsin in a vaccine, this study validated an important concept for further development of a combined mucosal vaccine against hepatitis A and E infection.

  14. Phase I Clinical Trial of a Recombinant Blood Stage Vaccine Candidate for Plasmodium falciparum Malaria Based on MSP1 and EBA175.

    Directory of Open Access Journals (Sweden)

    Chetan E Chitnis

    Full Text Available A phase I randomised, controlled, single blind, dose escalation trial was conducted to evaluate safety and immunogenicity of JAIVAC-1, a recombinant blood stage vaccine candidate against Plasmodium falciparum malaria, composed of a physical mixture of two recombinant proteins, PfMSP-1(19, the 19 kD conserved, C-terminal region of PfMSP-1 and PfF2 the receptor-binding F2 domain of EBA175.Healthy malaria naïve Indian male subjects aged 18-45 years were recruited from the volunteer database of study site. Fifteen subjects in each cohort, randomised in a ratio of 2:1 and meeting the protocol specific eligibility criteria, were vaccinated either with three doses (10 μg, 25 μg and 50 μg of each antigen of JAIVAC-1 formulated with adjuvant Montanide ISA 720 or with standard dosage of Hepatitis B vaccine. Each subject received the assigned vaccine in the deltoid muscle of the upper arms on Day 0, Day 28 and Day 180.JAIVAC-1 was well tolerated and no serious adverse event was observed. All JAIVAC-1 subjects sero-converted for PfF2 but elicited poor immune response to PfMSP-1(19. Dose-response relationship was observed between vaccine dose of PfF2 and antibody response. The antibodies against PfF2 were predominantly of IgG1 and IgG3 isotype. Sera from JAIVAC-1 subjects reacted with late schizonts in a punctate pattern in immunofluorescence assays. Purified IgG from JAIVAC-1 sera displayed significant growth inhibitory activity against Plasmodium falciparum CAMP strain.Antigen PfF2 should be retained as a component of a recombinant malaria vaccine but PfMSP-1(19 construct needs to be optimised to improve its immunogenicity.Clinical Trial Registry, India CTRI/2010/091/000301.

  15. Phase I Clinical Trial of a Recombinant Blood Stage Vaccine Candidate for Plasmodium falciparum Malaria Based on MSP1 and EBA175

    Science.gov (United States)

    Chitnis, Chetan E.; Mukherjee, Paushali; Mehta, Shantanu; Yazdani, Syed Shams; Dhawan, Shikha; Shakri, Ahmad Rushdi; Bharadwaj, Rukmini; Gupta, Puneet Kumar; Hans, Dhiraj; Mazumdar, Suman; Singh, Bijender; Kumar, Sanjeev; Pandey, Gaurav; Parulekar, Varsha; Imbault, Nathalie; Shivyogi, Preethi; Godbole, Girish; Mohan, Krishna; Leroy, Odile; Singh, Kavita; Chauhan, Virander S.

    2015-01-01

    Background A phase I randomised, controlled, single blind, dose escalation trial was conducted to evaluate safety and immunogenicity of JAIVAC-1, a recombinant blood stage vaccine candidate against Plasmodium falciparum malaria, composed of a physical mixture of two recombinant proteins, PfMSP-119, the 19 kD conserved, C-terminal region of PfMSP-1 and PfF2 the receptor-binding F2 domain of EBA175. Method Healthy malaria naïve Indian male subjects aged 18–45 years were recruited from the volunteer database of study site. Fifteen subjects in each cohort, randomised in a ratio of 2:1 and meeting the protocol specific eligibility criteria, were vaccinated either with three doses (10μg, 25μg and 50μg of each antigen) of JAIVAC-1 formulated with adjuvant Montanide ISA 720 or with standard dosage of Hepatitis B vaccine. Each subject received the assigned vaccine in the deltoid muscle of the upper arms on Day 0, Day 28 and Day 180. Results JAIVAC-1 was well tolerated and no serious adverse event was observed. All JAIVAC-1 subjects sero-converted for PfF2 but elicited poor immune response to PfMSP-119. Dose-response relationship was observed between vaccine dose of PfF2 and antibody response. The antibodies against PfF2 were predominantly of IgG1 and IgG3 isotype. Sera from JAIVAC-1 subjects reacted with late schizonts in a punctate pattern in immunofluorescence assays. Purified IgG from JAIVAC-1 sera displayed significant growth inhibitory activity against Plasmodium falciparum CAMP strain. Conclusion Antigen PfF2 should be retained as a component of a recombinant malaria vaccine but PfMSP-119 construct needs to be optimised to improve its immunogenicity. Trial Registration Clinical Trial Registry, India CTRI/2010/091/000301 PMID:25927360

  16. Effect of a Trace of Bi and Ni on the Microstructure and Wetting Properties of Sn-Zn-Cu Lead-Free Solder

    Institute of Scientific and Technical Information of China (English)

    Haitao MA; Haiping XIE; Lai WANG

    2007-01-01

    The microstructure and melting behavior of Sn-9Zn-2Cu (SZC) lead-free solder with 3 wt pct Bi and various amount of Ni additions were studied. The wetting properties and the interracial reaction of Sn-Zn-Cu with Cu substrate were also examined. The results indicated that the addition of 3 wt pct Bi could decrease the melting point of the solder and Ni would refine the microstructure and the rod-shape Cu5Zn8 phase changed into square-shape (Cu, Ni)5Zn8 phase. The addition of Bi, Ni greatly improved the wettability of SZC solder.In addition, the interfacial phase of the solders/Cu joint was typical planar Cu5Zn8 in SZC-3Bi-INi alloy.

  17. 混装电路板焊接工艺设计%Process Design of Soldering for Mix-assembled Circuit Board

    Institute of Scientific and Technical Information of China (English)

    徐冬霞; 韩飞

    2011-01-01

    Manual iron soldering of certain mix-assembled circuit board product was used as an example, process design of soldering for mix-assembled circuit board was introduced, including criteria of soldering procedure, choice of soldering method and key points of process design. It could serve as a basis and reference for process design of like products in future.%本文以某产品的混装电路板手工焊接为例,介绍了混装电路板焊接工艺设计的过程,包括工艺设计的依据、焊接方法的选择以及工艺设计的要点,可作为今后类似产品的设计依据和参考.

  18. Microstructure and elemental composition of electrochemically formed dendrites on lead-free micro-alloyed low Ag solder alloys used in electronics

    International Nuclear Information System (INIS)

    Highlights: • The electrochemical migration is investigated on micro-alloyed low Ag solders. • Transmission electron microscopy is applied to investigate dendrites. • Antimony (micro-alloy) takes part during electrochemical migration processes. • The electrochemical migration model of antimony is established. - Abstract: The Electrochemical Migration (ECM) behaviour of lead-free, micro-alloyed, low Ag solder alloys was investigated using Scanning Transmission Electron Microscopy (STEM), Energy Disperse X-ray Spectroscopy (EDS) and electron diffraction methods. Different solder alloys were investigated by Water Drop (WD) tests to stimulate ECM failure mechanism. After WD tests, differently structured dendrites were formed depending on the solder alloy types. The results showed that micro-alloying components (e.g. Sb) also played role during the ECM processes. The novelty of this study is the demonstration that Sb can take part in the ECM process; the ECM model of Sb is also discussed

  19. Manual Soldering Process Technology (continued)%手工软钎焊工艺技术(续一)实用电子组装技术

    Institute of Scientific and Technical Information of China (English)

    史建卫; 檀正东; 周璇; 苏立军; 杜彬

    2014-01-01

    Manual soldering is one of the basic process technologies in PCB assembly and rework. Mainly elaborate manual soldering process in detail aiming at the site requirements, soldering tools selection, process parameter setting, component assembly and repair and other related content. Provide important reference for manual soldering practitioners.%手工软钎焊是PCB组装和返修工艺中基本的工艺技术之一。主要针对现场要求、焊接工具选择、工艺参数设定、元件组装焊接及返修拆焊等相关内容,对手工软钎焊工艺技术进行详细阐述,为手工焊接从业者提供重要参考依据。

  20. Joints of magnesium to dissimilar metals - comperative study of soldering, adhesive bonding and mechanical joining; Magnesium-Mischverbindungen - Vergleichende Untersuchungen zwischen Loeten, Kleben und mechanischem Fuegen

    Energy Technology Data Exchange (ETDEWEB)

    Muecklich, S.; Wielage, B. [Technische Univ. Chemnitz (Germany); Horstmann, M.; Hahn, O. [Paderborn Univ. (Germany). Lehrstuhl fuer Werkstoff- und Fuegetechnik

    2007-07-01

    For joints of magnesium to dissimilar metals like aluminium or steel, the fundamentals and the state of knowledge concerning glueing, soldering, mechanical joining and hybrid methods are pointed out. (orig.)