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Sample records for based solder candidates

  1. Development of gold based solder candidates for flip chip assembly

    DEFF Research Database (Denmark)

    Chidambaram, Vivek; Hald, John; Hattel, Jesper Henri

    2009-01-01

    Flip chip technology is now rapidly replacing the traditional wire bonding interconnection technology in the first level packaging applications due to the miniaturization drive in the microelectronics industry. Flip chip assembly currently involves the use of high lead containing solders...... for interconnecting the chip to a carrier in certain applications due to the unique properties of lead. Despite of all the beneficial attributes of lead, its potential environmental impact when the products are discarded to land fills has resulted in various legislatives to eliminate lead from the electronic products...... based on its notorious legacy as a major health hazard across the spectrum of human generations and cultures. Flip chip assembly is also now increasingly being used for the high-performance (H-P) systems. These H-P systems perform mission-critical operations and are expected to experience virtually...

  2. Assessment of potential solder candidates for high temperature applications

    DEFF Research Database (Denmark)

    of the package with different solders of different melting temperatures. High Pb containing alloys where the lead levels can be above 85% by weight, is one of the solders currently being used in this technology. Responding to market pressure i.e. need for green electronic products there is now an increasing......Multi-Chip module (MCM) technology is a specialized electronic packaging technology recently gaining momentum due to the miniaturization drive in the microelectronics industry. The step soldering approach is being employed in the MCM technology. This method is used to solder various levels...... pressure to eliminate lead containing materials despite the fact that materials for high Pb containing alloys are currently not affected by any legislations. A tentative assessment was carried out to determine the potential solder candidates for high temperature applications based on the solidification...

  3. Au-Ge based Candidate Alloys for High-Temperature Lead-Free Solder Alternatives

    DEFF Research Database (Denmark)

    Chidambaram, Vivek; Hald, John; Hattel, Jesper Henri

    2009-01-01

    and reactivity of these alloying elements, characteristics of their intermetallic compounds (IMCs) and the distribution of phases. The primary strengthening mechanism in the case of Au-Ge-In and Au-Ge-Sn combinations was determined to be the classic solute atom strengthening. The Au-Ge-Sb combination...... was primarily strengthened by the refined (Ge) dispersed phase. The distribution of phases played a relatively more crucial role in determining the ductility of the bulk solder alloy. In the present work it was found that among the low melting point metals, the addition of Sb to the Au-Ge eutectic would...

  4. Development of Au-Ge based candidate alloys as an alternative to high-lead content solders

    DEFF Research Database (Denmark)

    Chidambaram, Vivek; Hald, John; Hattel, Jesper Henri

    2010-01-01

    in the case of the Au-Ge-In candidate alloy. The microhardness measurement is well correlated with the solubility and reactivity of these alloying elements, characteristics of their intermetallic compounds (IMCs) and the distribution of phases. The primary strengthening mechanism in the case of Au......-Ge-In and Au-Ge-Sn combinations was determined to be the classic solid solution strengthening. The Au-Ge-Sb combination was primarily strengthened by the refined (Ge) dispersed phase. The aging temperature had a significant influence on the microhardness in the case of the Au-Ge-Sn candidate alloy....... The distribution of phases played a relatively more crucial role in determining the ductility of the bulk solder alloy. The findings of this work are: the addition of Sb to the Au-Ge eutectic would not only decrease its melting point but would also improve its ductility substantially and the lattice strains...

  5. A Corrosion Investigation of Solder Candidates for High-Temperature Applications

    DEFF Research Database (Denmark)

    Chidambaram, Vivek; Hald, John; Ambat, Rajan

    2009-01-01

    , corrosion investigation was carried out on potential ternary lead-free candidate alloys based on these binary alloys for high temperature applications. These promising ternary candidate alloys were determined by the CALPHAD approach based on the solidification criterion and the nature of the phases...... predicted in the bulk solder. This work reveals that the Au-Sn based candidate alloys close to the eutectic composition (20 wt. % Sn) are more corrosion resistant than the Au-Ge based ones.......The step soldering approach is being employed in the Multi-Chip module (MCM) technology. High lead containing alloys is one of the solders currently being used in this approach. Au-Sn and Au-Ge based candidate alloys have been proposed as alternative solders for this application. In this work...

  6. Design of lead-free candidate alloys for high-temperature soldering based on the Au–Sn system

    DEFF Research Database (Denmark)

    Chidambaram, Vivek; Hattel, Jesper Henri; Hald, John

    2010-01-01

    of the Au–Sn binary system were explored in this work. Furthermore, the effects of thermal aging on the microstructure and microhardness of these promising Au–Sn based ternary alloys were investigated. For this purpose, the candidate alloys were aged at a lower temperature, 150°C for up to 1week...

  7. Coarsening of the Sn-Pb Solder Microstructure in Constitutive Model-Based Predictions of Solder Joint Thermal Mechanical Fatigue

    Energy Technology Data Exchange (ETDEWEB)

    Vianco, P.T.; Burchett, S.N.; Neilsen, M.K.; Rejent, J.A.; Frear, D.R.

    1999-04-12

    Thermal mechanical fatigue (TMF) is an important damage mechanism for solder joints exposed to cyclic temperature environments. Predicting the service reliability of solder joints exposed to such conditions requires two knowledge bases: first, the extent of fatigue damage incurred by the solder microstructure leading up to fatigue crack initiation, must be quantified in both time and space domains. Secondly, fatigue crack initiation and growth must be predicted since this metric determines, explicitly, the loss of solder joint functionality as it pertains to its mechanical fastening as well as electrical continuity roles. This paper will describe recent progress in a research effort to establish a microstructurally-based, constitutive model that predicts TMF deformation to 63Sn-37Pb solder in electronic solder joints up to the crack initiation step. The model is implemented using a finite element setting; therefore, the effects of both global and local thermal expansion mismatch conditions in the joint that would arise from temperature cycling.

  8. Metallurgical characterization of experimental Ag-based soldering alloys

    Directory of Open Access Journals (Sweden)

    Argyro Ntasi

    2014-10-01

    Conclusion: The experimental alloys tested demonstrated similar microstructures and melting ranges. Ga and Sn might be used as alternative to Cu and Zn to modify the selected properties of Ag based soldering alloys.

  9. Development of Bi-base high-temperature Pb-free solders with second-phase dispersion: Thermodynamic calculation, microstructure, and interfacial reaction

    Science.gov (United States)

    Takaku, Yoshikazu; Ohnuma, Ikuo; Kainuma, Ryosuke; Yamada, Yasushi; Yagi, Yuji; Nishibe, Yuji; Ishida, Kiyohito

    2006-11-01

    Bismuth and its alloys are candidates for Pb-free high-temperature solders that can be substituted for conventional Pb-rich Pb-Sn solders (melting point (mp) = 573 583 K). However, inferior properties such as brittleness and weak bonding strength should be improved for practical use. To that end, BiCu-X (X=Sb, Sn, and Zn) Pb-free high-temperature solders are proposed. Miscibility gaps in liquid BiCu-X alloys were surveyed using the thermodynamic database ADAMIS (alloy database for micro-solders), and compositions of the BiCu-X solders were designed on the basis of calculation. In-situ composite solders that consist of a Bi-base matrix with fine intermetallic compound (IMC) particles were produced by gas-atomizing and melt-spinning methods. The interfacial reaction between in-situ composite solders and Cu or Ni substrates was investigated. The IMCs at the interface formed a thin, uniform layer, which is an appropriate morphology for a reliable solder joint.

  10. Effects of Metallic Nanoparticles on Interfacial Intermetallic Compounds in Tin-Based Solders for Microelectronic Packaging

    Science.gov (United States)

    Haseeb, A. S. M. A.; Arafat, M. M.; Tay, S. L.; Leong, Y. M.

    2017-10-01

    Tin (Sn)-based solders have established themselves as the main alternative to the traditional lead (Pb)-based solders in many applications. However, the reliability of the Sn-based solders continues to be a concern. In order to make Sn-based solders microstructurally more stable and hence more reliable, researchers are showing great interest in investigating the effects of the incorporation of different nanoparticles into them. This paper gives an overview of the influence of metallic nanoparticles on the characteristics of interfacial intermetallic compounds (IMCs) in Sn-based solder joints on copper substrates during reflow and thermal aging. Nanocomposite solders were prepared by mechanically blending nanoparticles of nickel (Ni), cobalt (Co), zinc (Zn), molybdenum (Mo), manganese (Mn) and titanium (Ti) with Sn-3.8Ag-0.7Cu and Sn-3.5Ag solder pastes. The composite solders were then reflowed and their wetting characteristics and interfacial microstructural evolution were investigated. Through the paste mixing route, Ni, Co, Zn and Mo nanoparticles alter the morphology and thickness of the IMCs in beneficial ways for the performance of solder joints. The thickness of Cu3Sn IMC is decreased with the addition of Ni, Co and Zn nanoparticles. The thickness of total IMC layer is decreased with the addition of Zn and Mo nanoparticles in the solder. The metallic nanoparticles can be divided into two groups. Ni, Co, and Zn nanoparticles undergo reactive dissolution during solder reflow, causing in situ alloying and therefore offering an alternative route of alloy additions to solders. Mo nanoparticles remain intact during reflow and impart their influence as discrete particles. Mechanisms of interactions between different types of metallic nanoparticles and solder are discussed.

  11. The Effect of Gap Angle on Tensile Strength of Preceramic Base Metal Solder Joints.

    Science.gov (United States)

    Fattahi, Farnaz; Hashemi Ardakani, Zahra; Hashemi Ardakani, Maryam

    2015-12-01

    Soldering is a process commonly used in fabricating dental prosthesis. Since most soldered prosthesis fail at the solder joints; the joint strength is of utmost importance. The purpose of this study was to evaluate the effect of gap angle on the tensile strength of base metal solder joints. A total number of 40 Ni-Cr samples were fabricated according to ADA/ISO 9693 specifications for tensile test. Samples were cut at the midpoint of the bar, and were placed at the considered angles by employing an explicitly designed device. They were divided into 4 groups regarding the gap angle; Group C (control group) with parallel gap on steady distance of 0.2mm, Group 1: 10°, Group 2: 20°, and Group3: 30° gap angles. When soldered, the specimens were all tested for tensile strength using a universal testing machine at a cross-head speed of 0.5 mm/min with a preload of 10N. Kruskal-Wallis H test was used to compare tensile strength among the groups (ptensile strength values obtained from the study groups were respectively 307.84, 391.50, 365.18, and 368.86 MPa. The tensile strength was not statistically different among the four groups in general (p≤ 0.490). Making the gap angular at the solder joints and the subsequent unsteady increase of the gap distance would not change the tensile strength of the joint.

  12. Effect of Gap Distance on Tensile Strength of Preceramic Base Metal Solder Joints

    Directory of Open Access Journals (Sweden)

    Farnaz Fattahi

    2011-09-01

    Full Text Available Background and aims. In order to fabricate prostheses with high accuracy and durability, soldering techniques have been introduced to clinical dentistry. However, these prostheses always fail at their solder joints. The purpose of this study was to evaluate the effect of gap distance on the tensile strength of base metal solder joints. Materials and methods. Based on ADA/ISO 9693 specifications for tensile test, 40 specimens were fabricated from a Ni-Cr alloy and cut at the midpoint of 3-mm diameter bar and placed at desired positions by a specially designed device. The specimens were divided into four groups of 10 samples according to the desired solder gap distance: Group1: 0.1mm; Group2: 0.25mm; Group3: 0.5mm; and Group4: 0.75mm. After soldering, specimens were tested for tensile strength by a universal testing machine at a cross-head speed of 0.5mm/min with a preload of 10N. Results. The mean tensile strength values of the groups were 162, 307.8, 206.1 and 336.7 MPa, respectively. The group with 0.75-mm gap had the highest and the group with 0.1-mm gap had the lowest tensile strength. Bonferroni test showed that Group1 and Group4 had statistically different values (P=0.023, but the differences between other groups were not significant at a significance level of 0.05. Conclusion. There was no direct relationship between increasing soldering gap distance and tensile strength of the solder joints.

  13. Effect of gap distance on tensile strength of preceramic base metal solder joints.

    Science.gov (United States)

    Fattahi, Farnaz; Motamedi, Milad

    2011-01-01

    In order to fabricate prostheses with high accuracy and durability, soldering techniques have been introduced to clinical dentistry. However, these prostheses always fail at their solder joints. The purpose of this study was to evaluate the effect of gap distance on the tensile strength of base metal solder joints. Based on ADA/ISO 9693 specifications for tensile test, 40 specimens were fabricated from a Ni-Cr alloy and cut at the midpoint of 3-mm diameter bar and placed at desired positions by a specially designed device. The specimens were divided into four groups of 10 samples according to the desired solder gap distance: Group1: 0.1mm; Group2: 0.25mm; Group3: 0.5mm; and Group4: 0.75mm. After soldering, specimens were tested for tensile strength by a universal testing machine at a cross-head speed of 0.5mm/min with a preload of 10N. The mean tensile strength values of the groups were 162, 307.8, 206.1 and 336.7 MPa, respectively. The group with 0.75-mm gap had the highest and the group with 0.1-mm gap had the lowest tensile strength. Bonferroni test showed that Group1 and Group4 had statistically different values (P=0.023), but the differences between other groups were not sig-nificant at a significance level of 0.05. There was no direct relationship between increasing soldering gap distance and tensile strength of the solder joints.

  14. Microstructure, mechanical performance and corrosion properties of base metal solder joints

    Directory of Open Access Journals (Sweden)

    Sujesh Machha

    2011-01-01

    Full Text Available Context: Alloys have been considered to be of paramount importance in the field of prosthodontics. Long span prosthesis may often require joining of one or more individual castings to obtain better fit, occlusal harmony and esthetics in comparison to one-piece casting. Aim: This study was undertaken to evaluate the mechanical properties of base metal alloys joined by two different techniques, namely, gas oxygen torch soldering and laser fusion, compared to a one-piece casting. Mechanical properties evaluated were tensile strength, percentage of elongation and hardness of the solder joint. In addition, corrosion properties and scanning electron microscopic appearance of the joints were also evaluated. Materials and Methods: The samples were prepared according to American Society for Testing Materials specifications (ASTM, E8. Specimens were made with self-cure acrylic and then invested in phosphate-bonded investment material. Casting was done in induction casting machine. Thirty specimens were thus prepared for each group and compared with 30 specimens of the one-piece casting group. Statistical Analysis Used: SPSS software (version 10.0, Chicago, IL, USA was used for statistical analysis. ANOVA and Benferroni post hoc tests were done for multiple comparisons between the groups and within the groups for mean difference and standard error. Results: Results showed that tensile strength of the one-piece casting was higher than laser fused and gas oxygen torch soldered joints. Laser fused joints exhibited higher hardness values compared to that of gas oxygen torch soldered joints. Scanning electron microscopic examination revealed greater porosity in the gas oxygen torch soldered joints. This contributed to the reduction in the strength of the joint. Gas oxygen torch soldered joints showed less corrosion resistance when compared to laser fused joints and one-piece casting. Conclusion: Laser fusion, which is a recent introduction to the field of

  15. Studies on inhibition of galvanic corrosion of lead based solders

    International Nuclear Information System (INIS)

    Perumareddi, R.; Sastri, V.S.; Elboujdaini, M.

    1999-01-01

    Exposure of Pb/Sn solder embedded in copper plates releases Pb into tap water and well water in excess of permissible level of 10 μg/L. Release of Pb has been inhibited by adding 40 ppm of silicate or 20 ppm of silicate and 20 ppm of phosphate to tap water and well water. XPS, electron microprobe and EDAX analysis of the solder surfaces show the surfaces deposits to be copper silicate and copper silicate and calcium carbonate on Pb/Sn surfaces exposed to tap and well water respectively containing silicate. The release of Pb can be explained satisfactorily on the basis of a scheme of reactions due to galvanic corrosion. (author)

  16. A flip chip process based on electroplated solder bumps

    Science.gov (United States)

    Salonen, J.; Salmi, J.

    1994-01-01

    Compared to wire bonding and TAB, flip chip technology using solder joints offers the highest pin count and packaging density and superior electrical performance. The chips are mounted upside down on the substrate, which can be made of silicon, ceramic, glass or - in some cases - even PCB. The extra processing steps required for chips are the deposition of a suitable thin film metal layer(s) on the standard Al pad and the formation of bumps. Also, the development of new fine line substrate technologies is required to utilize the full potential of the technology. In our bumping process, bump deposition is done by electroplating, which was chosen for its simplicity and economy. Sputter deposited molybdenum and copper are used as thin film layers between the aluminum pads and the solder bumps. A reason for this choice is that the metals can be selectively etched after bumping using the bumps as a mask, thus circumventing the need for a separate mask for etching the thin film metals. The bumps are electroplated from a binary Pb-Sn bath using a thick liquid photoresist. An extensively modified commercial flip chip bonder is used for alignment and bonding. Heat assisted tack bonding is used to attach the chips to the substrate, and final reflow joining is done without flux in a vacuum furnace.

  17. Soldering sheets using soft solders

    Directory of Open Access Journals (Sweden)

    Milan Brožek

    2013-01-01

    Full Text Available The paper contains strength tests results of joints soldered using lead and leadless soft solders. For tests lead solders types Pb60Sn40 and Sn60Pb40 and leadless soft solders types Sn95.5Ag3.8Cu0.7 and Sn96Ag4 were used. As basic materials steel sheet, zinc-coated steel sheet, copper sheet and brass sheet 100 x 20 x 1 mm was the test samples size. Always two sheets were cleaned and jointed together. For heating the propane-butane + air flame was used. Then the tested assemblies were loaded using the universal tensile-strength testing machine till to failure. At the tests the force needed for assemblies failure and failure type (in soldered joint, in basic material were recorded. From measured data the solder strength was calculated. From the experiment results it follows that from the point of view of the soldered joints strength as well of the solder strength relatively small differences were found. At the same time it is evident that the joint strength and solder strength depend on soldered material type and on soldered joint lapping length. On the basis of carried out experiments it can be stated that the substitution of lead solders by leadless solders is possible without risk of soldered joints strength decrease.

  18. Cross-border impacts of the restriction of hazardous substances: a perspective based on Japanese solders.

    Science.gov (United States)

    Fuse, Masaaki; Tsunemi, Kiyotaka

    2013-08-20

    Despite the relevance of the global economy, Regulatory Impact Assessments of the restriction of hazardous substances (RoHS) in the European Union (EU) are based only on domestic impacts. This paper explores the cross-border environmental impacts of the RoHS by focusing on the shifts to lead-free solders in Japan, which exports many electronics to the EU. The regulatory impacts are quantified by integrating a material flow analysis for metals constituting a solder with a scenario analysis with and without the RoHS. The results indicate that the EU regulation, the RoHS, has triggered shifts in Japan to lead-free solders, not only for electronics subject to this regulation, but for other products as well. We also find that the RoHS leads to a slow reduction in environmental emissions of the target, lead, but results in a rapid increase in the use of tin and silver in lead-free solders. This indicates the importance of assessing potential alternative substances, the use of which may increase as a result of adhering to the RoHS. The latter constitutes a negative impact because of recent concerns regarding resource criticality.

  19. The failure models of Sn-based solder joints under coupling effects of electromigration and thermal cycling

    Science.gov (United States)

    Ma, Limin; Zuo, Yong; Liu, Sihan; Guo, Fu; Wang, Xitao

    2013-01-01

    Currently, the main concerns of Pb-free solder joints are focusing on electromigration (EM) and thermomechanical fatigue (TMF) problems. Many models have been established to understand the failure mechanisms of the joint under such single test conditions. Based on the fact that almost all microelectronic devices serve in combination conditions of fluctuated temperature and electric current stressing, the coupling effects of EM and TMF on evolution of microstructure and resistance of solder joint had been investigated. The failure models of binary SnBi alloy and ternary SnAgCu (SAC) solder under the coupling stressing were divided into four and three different stages, respectively. The failure mechanisms were dominant by the relationship of phase segregation, polarity effect, phase coarsening, and the coefficient of thermal expansion mismatch. Cracks tend to form and propagate along the interface between intermetallic compound layers and solder matrix in SAC solder. However, grain boundary was considered as the nucleation sites for microcracks in SnBi solder. High current density alleviates the deterioration of solder at the beginning stage of coupling stressing through Joule heating effect. An abrupt jump of resistance could be observed before the failure of the joint. The failure molds were determined by interactions of EM behaviors and TMF damages.

  20. High-temperature lead-free solder alternatives

    DEFF Research Database (Denmark)

    Nachiappan, Vivek Chidambaram; Hattel, Jesper Henri; Hald, John

    2011-01-01

    For lead-free solders in the high-temperature regime, unfortunately, a limited number of alloying systems are available. These are Bi based alloys, gold involving alloys and Zn–Al based alloys. Based on these systems, possible candidate alloys were designed to have a melting range between 270°C...... and 350°C. Each has its own superior characteristics as well as some drawbacks however none of them can fulfill all the requirements to replace the current high-lead content solders. Even the alternative technologies that are currently being developed cannot address several critical issues of high......-temperature soldering. Therefore, further research and development of high-temperature lead-free soldering is obviously needed....

  1. Microstructural discovery of Al addition on Sn–0.5Cu-based Pb-free solder design

    Energy Technology Data Exchange (ETDEWEB)

    Koo, Jahyun; Lee, Changsoo [Department of Materials Science and Engineering, KAIST, Daejeon 305-701 (Korea, Republic of); Hong, Sung Jea [MK Electron Co., Ltd., Yongin Cheoin-gu 316-2 (Korea, Republic of); Kim, Keun-Soo, E-mail: keunsookim@hoseo.edu [Department of Display Engineering, Hoseo University, Asan 336-795 (Korea, Republic of); Lee, Hyuck Mo, E-mail: hmlee@kaist.ac.kr [Department of Materials Science and Engineering, KAIST, Daejeon 305-701 (Korea, Republic of)

    2015-11-25

    It is important to develop Pb-free solder alloys suitable for automotive use instead of traditional Sn–Pb solder due to environmental regulations (e.g., Restriction of Hazardous Substances (RoHS)). Al addition has been spotlighted to enhance solder properties. In this study, we investigated the microstructural change of Sn–0.5Cu wt.% based Pb-free solder alloys with Al addition (0.01–0.05 wt.%). The small amount of Al addition caused a remarkable microstructural change. The Al was favored to form Cu–Al intermetallic compounds inside the solder matrix. We identified the Cu–Al intermetallic compound as Cu{sub 33}Al{sub 17}, which has a rhombohedral structure, using EPMA and TEM analyses. This resulted in refined Cu{sub 6}Sn{sub 5} networks in the Sn–0.5Cu based solder alloy. In addition, we conducted thermal analysis to confirm its stability at a high temperature of approximately 230 °C, which is the necessary temperature range for automotive applications. The solidification results were substantiated thermodynamically using the Scheil solidification model. We can provide criteria for the minimum aluminum content to modify the microstructure of Pb-free solder alloys. - Graphical abstract: The minor Al additions refined eutectic Cu{sub 6}Sn{sub 5} IMC networks on the Sn–0.5Cu based solder alloys. The microstructure was dramatically changed with the minor Al addition. - Highlights: • We observed dramatic microstructure-change with Al additions. • We defined Cu{sub 33}Al{sub 17} IMC with Al additions using TEM analysis. • We investigated grain refinement with Al additions using EBSD. • We discussed the refinement based on Scheil solidification model.

  2. A dislocation density based micromechanical constitutive model for Sn-Ag-Cu solder alloys

    Science.gov (United States)

    Liu, Lu; Yao, Yao; Zeng, Tao; Keer, Leon M.

    2017-10-01

    Based on the dislocation density hardening law, a micromechanical model considering the effects of precipitates is developed for Sn-Ag-Cu solder alloys. According to the microstructure of the Sn-3.0Ag-0.5Cu thin films, intermetallic compounds (IMCs) are assumed as sphere particles embedded in the polycrystalline β-Sn matrix. The mechanical behavior of polycrystalline β-Sn matrix is determined by the elastic-plastic self-consistent method. The existence of IMCs not only impedes the motion of dislocations but also increases the overall stiffness. Thus, a dislocation density based hardening law considering non-shearable precipitates is adopted locally for single β-Sn crystal, and the Mori-Tanaka scheme is applied to describe the overall viscoplastic behavior of solder alloys. The proposed model is incorporated into finite element analysis and the corresponding numerical implementation method is presented. The model can describe the mechanical behavior of Sn-3.0Ag-0.5Cu and Sn-1.0Ag-0.5Cu alloys under high strain rates at a wide range of temperatures. Furthermore, the overall Young’s modulus changes due to different contents of IMCs is predicted and compared with experimental data. Results show that the proposed model can describe both elastic and inelastic behavior of solder alloys with reasonable accuracy.

  3. Thermophysical Properties of Sn-Ag-Cu Based Pb-Free Solders

    Science.gov (United States)

    Kim, Sok Won; Lee, Jaeran; Jeon, Bo-Min; Jung, Eun; Lee, Sang Hyun; Kang, Kweon Ho; Lim, Kwon Taek

    2009-06-01

    Lead-tin (Pb-Sn) alloys are the dominant solders used for electronic packaging because of their low cost and superior properties required for interconnecting electronic components. However, increasing environmental and health concerns over the toxicity of lead, combined with global legislation to limit the use of Pb in manufactured products, have led to extensive research and development studies of lead-free solders. The Sn-Ag-Cu ternary eutectic alloy is considered to be one of the promising alternatives. Except for thermal properties, much research on several properties of Sn-Ag-Cu alloy has been performed. In this study, five Sn-xAg-0.5Cu alloys with variations of Ag content x of 1.0 mass%, 2.5 mass%, 3.0 mass%, 3.5 mass%, and 4.0 mass% were prepared, and their thermal diffusivity and specific heat were measured from room temperature to 150 °C, and the thermal conductivity was calculated using the measured thermal diffusivity, specific heat, and density values. Also, the linear thermal expansion was measured from room temperature to 170 °C. The results show that Sn-3.5Ag-0.5Cu is the best candidate because it has a maximum thermal conductivity and a low thermal expansion, which are the ideal conditions to be a proper packaging alloy for effective cooling and thermostability.

  4. Soldering with ductile active solders

    Czech Academy of Sciences Publication Activity Database

    Dupák, Jan; Ustohal, V.

    2001-01-01

    Roč. 16, č. 6 (2001), s. 855 - 861 ISSN 1042-6914 Institutional research plan: CEZ:AV0Z2065902 Keywords : active solders * ductile solders * cryogenics devices Subject RIV: BM - Solid Matter Physics ; Magnetism Impact factor: 0.288, year: 2001

  5. Interfacial reaction of Sn-based solder joint in the package system

    Science.gov (United States)

    Gu, Huandi

    In this thesis, I report a study on the effect of the solder size on intermetallic layer formation by comparing the morphology change and growth rate of two different size solder joint aged at a same temperature for different aging time. The layer thickness and microstructure were analyzed using scanning electron microscopy (SEM). Photoshop was used to measure the thickness of intermetallic compound. Two different size of solder joints with composition of Sn-Ag-Cu (305) were used.

  6. Solder joint technology materials, properties, and reliability

    CERN Document Server

    Tu, King-Ning

    2007-01-01

    Solder joints are ubiquitous in electronic consumer products. The European Union has a directive to ban the use of Pb-based solders in these products on July 1st, 2006. There is an urgent need for an increase in the research and development of Pb-free solders in electronic manufacturing. For example, spontaneous Sn whisker growth and electromigration induced failure in solder joints are serious issues. These reliability issues are quite complicated due to the combined effect of electrical, mechanical, chemical, and thermal forces on solder joints. To improve solder joint reliability, the science of solder joint behavior under various driving forces must be understood. In this book, the advanced materials reliability issues related to copper-tin reaction and electromigration in solder joints are emphasized and methods to prevent these reliability problems are discussed.

  7. Soldering on

    Czech Academy of Sciences Publication Activity Database

    Watson, A.; Kroupa, Aleš; Ipser, H.; Dinsdale, A.; Vřešťál, J.

    2007-01-01

    Roč. 15, č. 7 (2007), s. 32-33 ISSN 0967-8638 Institutional research plan: CEZ:AV0Z20410507 Keywords : lead -ree solders * high temperatures Subject RIV: BJ - Thermodynamics Impact factor: 0.153, year: 2007

  8. Soldering in electronics assembly

    CERN Document Server

    Judd, Mike

    2013-01-01

    Soldering in Electronics Assembly discusses several concerns in soldering of electronic assemblies. The book is comprised of nine chapters that tackle different areas in electronic assembly soldering. Chapter 1 discusses the soldering process itself, while Chapter 2 covers the electronic assemblies. Chapter 3 talks about solders and Chapter 4 deals with flux. The text also tackles the CS and SC soldering process. The cleaning of soldered assemblies, solder quality, and standards and specifications are also discussed. The book will be of great use to professionals who deal with electronic assem

  9. SMT soldering handbook

    National Research Council Canada - National Science Library

    Strauss, Rudolf

    1998-01-01

    ... 3.2.1 Constituents, melting behaviour and mechanical properties 3.2.2 Composition of solders for use in electronics 3.2.3 Lead-free solders 3.2.4 Solder impurities The soldered joint 3.3.1 Solde...

  10. Corrosion Behaviour of Sn-based Lead-Free Solders in Acidic Solution

    Science.gov (United States)

    Nordarina, J.; Mohd, H. Z.; Ahmad, A. M.; Muhammad, F. M. N.

    2018-03-01

    The corrosion properties of Sn-9(5Al-Zn), Sn-Cu and SAC305 were studied via potentiodynamic polarization method in an acidic solution of 1 M hydrochloric acid (HCl). Sn-9(5Al-Zn) produced different polarization profile compared with Sn-Cu and SAC305. The morphological analysis showed that small, deep grooves shaped of corrosion product formed on top of Sn-9(5Al-Zn) solder while two distinctive structures of closely packed and loosely packed corrosion product formed on top of Sn-Cu and SAC305 solder alloys. Phase analysis revealed the formations of various corrosion products such as SnO and SnO2 mainly dominant on surface of solder alloys after potentiodynamic polarization in 1 M hydrochloric acid (HCl).

  11. Laser soldering of Sn-Ag-Cu and Sn-Zn-Bi lead-free solder pastes

    Science.gov (United States)

    Takahashi, Junichi; Nakahara, Sumio; Hisada, Shigeyoshi; Fujita, Takeyoshi

    2004-10-01

    It has reported that a waste of an electronics substrate including lead and its compound such as 63Sn-37Pb has polluted the environment with acid rain. For that environment problem the development of lead-free solder alloys has been promoted in order to find out the substitute for Sn-Pb solders in the United States, Europe, and Japan. In a present electronics industry, typical alloys have narrowed down to Sn-Ag-Cu and Sn-Zn lead-free solder. In this study, solderability of Pb-free solder that are Sn-Ag-Cu and Sn-Zn-Bi alloy was studied on soldering using YAG (yttrium aluminum garnet) laser and diode laser. Experiments were peformed in order to determine the range of soldering parameters for obtaining an appropriate wettability based on a visual inspection. Joining strength of surface mounting chip components soldered on PCB (printed circuit board) was tested on application thickness of solder paste (0.2, 0.3, and 0.4 mm). In addition, joining strength characteristics of eutectic Sn-Pb alloy and under different power density were examined. As a result, solderability of Sn-Ag-Cu (Pb-free) solder paste are equivalent to that of coventional Sn-Pb solder paste, and are superior to that of Sn-Zn-Bi solder paste in the laser soldering method.

  12. Surface tension and density of binary lead and lead-free Sn-based solders

    Science.gov (United States)

    Kaban, I.; Mhiaoui, S.; Hoyer, W.; Gasser, J.-G.

    2005-12-01

    The surface tension and density of the liquid Sn60Pb40, Sn90Pb10, Sn96.5Ag3.5 and Sn97Cu3 solder alloys (wt%) have been determined experimentally over a wide temperature interval. It is established that the surface tension of liquid Sn90Pb10 is about 7% higher than that of a traditional Sn60Pb40 solder and that the surface tension of Sn96.5Ag3.5 and Sn97Cu3 alloys is about 12% higher than that of Sn60Pb40. The analytical expressions for the temperature dependences of the surface tension and density are given.

  13. Research of Interaction Between Zn Based Solders and Cu, Al Substrates

    Directory of Open Access Journals (Sweden)

    Prach Michal

    2014-06-01

    Full Text Available The paper deals with the study of interaction between Cu, Al substrates (purity 5N and ZnAl4, ZnAg6Al6 zinc solders for higher application temperatures. Soldering was performed with power ultrasound in the air without flux application at temperature 420 °C. Acting time of ultrasonic vibration was 3 s and ultrasound frequency was 40 kHz. Soldered joints were assessed by optical light microscopy and EDX microanalysis. Intermetallic layers (IM CuZn4 and Cu5Zn8 were formed at the Cu/ZnAl4 boundary. The βZn-αAl mechanical mixture was formed at the Al/ZnAl4 boundary. AgZn3 and Cu5Zn8 IM layers were formed at the Cu/ZnAg6Al6 boundary, and mechanical mixture of βZn-αAl and AgZn3 intermetallic mixture were formed at the boundary Al/ZnAg6Al6.

  14. Features of soldering of molybdenum a lols

    International Nuclear Information System (INIS)

    Grishin, V.L.; Rybkin, B.V.; Cherkasov, A.F.

    1980-01-01

    Soldering features of complex-alloy molybdenum alloys were investigated in comparison with alloys based on solid solutions. Soldering features of heterogeneous molybdenum base alloys were investigated using samples of 0.5-1.O mm sheets with the strain of about 95% made of ingots which had been smelted in arc vacuum furnaces. The soldering of samples was carried out in 5x1O -5 mm Hg vacuum using different sources of heating: radiation, electron-ray and contact. It was shown that heat-resisting soldered joints of heterogeneous molybdenum alloys could be produced using zirconium and niobium base solders containing the most effective hardeners of the parent material (titanum, vanadium, tantalum, molybdenum, tungsten). To preserve high mechanical properties of heterogeneous alloys it was expedient to use for welding local heating sources which permitted to decrease considerably temperature- time conditions of the process

  15. Interfacial Reaction of Sn-Ag-Cu Lead-Free Solder Alloy on Cu: A Review

    Directory of Open Access Journals (Sweden)

    Liu Mei Lee

    2013-01-01

    Full Text Available This paper reviews the function and importance of Sn-Ag-Cu solder alloys in electronics industry and the interfacial reaction of Sn-Ag-Cu/Cu solder joint at various solder forms and solder reflow conditions. The Sn-Ag-Cu solder alloys are examined in bulk and in thin film. It then examines the effect of soldering conditions to the formation of intermetallic compounds such as Cu substrate selection, structural phases, morphology evolution, the growth kinetics, temperature and time is also discussed. Sn-Ag-Cu lead-free solder alloys are the most promising candidate for the replacement of Sn-Pb solders in modern microelectronic technology. Sn-Ag-Cu solders could possibly be considered and adapted in miniaturization technologies. Therefore, this paper should be of great interest to a large selection of electronics interconnect materials, reliability, processes, and assembly community.

  16. Solder flow over fine line PWB surface finishes

    Energy Technology Data Exchange (ETDEWEB)

    Hosking, F.M.; Hernandez, C.L.

    1998-08-01

    The rapid advancement of interconnect technology has stimulated the development of alternative printed wiring board (PWB) surface finishes to enhance the solderability of standard copper and solder-coated surfaces. These new finishes are based on either metallic or organic chemistries. As part of an ongoing solderability study, Sandia National Laboratories has investigated the solder flow behavior of two azole-based organic solderability preservations, immersion Au, immersion Ag, electroless Pd, and electroless Pd/Ni on fine line copper features. The coated substrates were solder tested in the as-fabricated and environmentally-stressed conditions. Samples were processed through an inerted reflow machine. The azole-based coatings generally provided the most effective protection after aging. Thin Pd over Cu yielded the best wetting results of the metallic coatings, with complete dissolution of the Pd overcoat and wetting of the underlying Cu by the flowing solder. Limited wetting was measured on the thicker Pd and Pd over Ni finishes, which were not completely dissolved by the molten solder. The immersion Au and Ag finishes yielded the lowest wetted lengths, respectively. These general differences in solderability were directly attributed to the type of surface finish which the solder came in contact with. The effects of circuit geometry, surface finish, stressing, and solder processing conditions are discussed.

  17. A thermodynamics based damage mechanics framework for fatigue analysis of microelectronics solder joints with size effects

    Science.gov (United States)

    Gomez, Juan

    Experimental observations of an increase in resistance with decreasing specimen size and under the presence of non-uniform plastic deformation fields have pushed the development for small scale plasticity theories since the early 90's. The observed phenomenon has been explained in terms of an accumulation of a density of geometrically necessary dislocations, which is required in order to accommodate nonuniform plastic deformation fields. This extra density of dislocations, contributes to the additional hardening observed in small scale specimens under imposed non-uniform plastic deformations. The density of geometrically necessary dislocations has been related to the gradients of plastic strain which are imposed either by the loading conditions or the geometry of the specimen. The proposed set of theories has promoted the idea that there is an additional material parameter, namely a plastic length scale. Within these theories when the material is under the presence of a non-uniform plastic deformation field and once typical structural dimensions approaches the material length scale there is an increase in resistance. Such a class of mathematical framework is currently known as strain gradient plasticity (SGP) theory. On the other hand, the current trend towards miniaturization in the microelectronics industry has raised questions about the true behavior of small structural systems. In this dissertation we address such a problem but from the perspective of eutectic solder alloys. Eutectic solder alloys as frequently used in the microelectronics industry exhibit considerable rate dependent response even at room temperature. Moreover for this type of material, the problem of interest is the response under cyclic loadings induced by thermomechanical fatigue leading to the classical case of creep-fatigue interaction. Several experimental and theoretical studies have been developed in order to generate robust constitutive descriptions for this class of applications. For

  18. Comparison of the mechanical solidity of soldered and differently laser welded test specimens from a Palladium based alloy before and after six months of chemical stress.

    OpenAIRE

    Heintzenberg, Katja Ulrike

    2010-01-01

    The submitted study is about the comparison of the mechanical solidity of soldered and differently laser welded test specimens from a Palladium based alloy before and after six months of chemical stress. By vacuum-pressure-technique 80 DIN meeting test specimens have been produced from the Palladium alloy BegoPal® 300. 3 of the 10 series originated from five times cast reused metal, the remaining from pure new metal. After visual check of the test specimen...

  19. Effect of Ag on Sn–Cu and Sn–Zn lead free solders

    Directory of Open Access Journals (Sweden)

    Alam S.N.

    2015-06-01

    Full Text Available Lead and lead-containing compounds are considered as toxic substances due to their detrimental effect on the environment. Sn-based soldering systems, like Sn-Cu and Sn-Zn are considered as the most promising candidates to replace the eutectic Sn-Pb solder compared to other solders because of their low melting temperature and favorable properties. Eutectic Sn-0.7 wt.% Cu and near eutectic composition Sn-8 wt.% Zn solders have been considered here for study. For the Sn-Cu system, besides the eutectic Sn-0.7 wt.% Cu composition, Sn-1Cu and Sn-2Cu were studied. Three compositions containing Ag: Sn-2Ag-0.7Cu, Sn-2.5Ag-0.7Cu and Sn-4.5Ag-0.7Cu were also developed. Ag was added to the eutectic Sn-0.7 wt.% Cu composition in order to reduce the melting temperature of the eutectic alloy and to enhance the mechanical properties. For the Sn-Zn system, besides the Sn-8 wt.% Zn near eutectic composition, Sn-8Zn-0.05Ag, Sn-8Zn-0.1Ag and Sn-8Zn-0.2Ag solder alloys were developed. The structure and morphology of the solder alloys were analyzed using a scanning electron microscope (SEM, filed emission scanning electron microscope (FESEM, electron diffraction X-ray spectroscopy (EDX and X-ray diffraction (XRD. Thermal analysis of the alloys was also done using a differential scanning calorimeter (DSC. Trace additions of Ag have been found to significantly reduce the melting temperature of the Sn-0.7 wt.% Cu and Sn-8 wt.% Zn alloys.

  20. Assessment of Exposure to Sensitizing Rosin-derived Compounds from Electronics Soldering

    National Research Council Canada - National Science Library

    Bowerbank, Christopher

    1998-01-01

    Exposure potential for rosin-derived compounds, including volatile and semivolatile organic compounds produced during electronics soldering operations using rosin-based fluxes and rosin core solders, was investigated...

  1. Physical properties of lead free solders in liquid and solid state

    OpenAIRE

    Mhiaoui, Souad

    2008-01-01

    The European legislation prohibits the use of lead containing solders in Europe. However, lead free solders have a higher melting point (typical 20%) and their mechanical characteristics are worse. Additional problems are aging and adhesion of the solder on the electronic circuits. Thus, research activities must focus on the optimization of the properties of Sn-Ag-Cu based lead free solders chosen by the industry. Two main objectives are treated in this work. In the center of the first one...

  2. The effect of graphene on the intermetallic and joint strength of Sn-3.5Ag lead-free solder

    Science.gov (United States)

    Mayappan, R.; Salleh, A.; Andas, J.

    2017-09-01

    Solder has been widely used in electronic industry as interconnection for electronic packaging. European Union and Japan have restricted the use of Sn-Pb solder as it contains lead which can harmful to human health and environment. Due to this, many researches have been done in order to find a suitable replacement for the lead solder. Although many lead-free solders are available, the Sn-3.5Ag solder with the addition of graphene seem to be a suitable candidate. In this study, a 0.07 wt% graphene nanosheet was added into the Sn-3.5Ag solder and this composite solder was prepared under powder metallurgy method. The solder was reacted with copper substrate at 250 °C for one minute. For joint strength analysis, two copper strips were soldered together. The solder joint was aged at temperature 100 °C for 500 hours. Scanning Electron Microscope (SEM) was used to observe the interfacial reaction and Instron machine was used to determine the joint strength. Cu6Sn5 intermetallic layer was formed at the interface between the Cu substrate and the solders. Composite solder showed the retardation of the intermetallic growth compared to the plain solder. The thickness value of the intermetallic was used to calculate the growth rate the IMC. The graphene nanosheets added solder has lower growth rate which is 3.86 × 10-15 cm2/s compared to the plain solder 7.15 × 10-15 cm2/s. Shear strength analysis show that the composite solder has higher joint compared to the plain solder.

  3. Integration of environmentally compatible soldering technologies for waste minimization

    International Nuclear Information System (INIS)

    Hosking, F.M.

    1992-01-01

    There has been a concentrated effort throughout the international microelectronics industry to phase out chlorofluorocarbon (CFC) materials and alleviate the serious problem of ozone depletion created by the release of CFCS. The development of more environmentally compatible manufacturing technologies is the cornerstone of this effort. Alternative materials and processes for cleaning and soldering have received special attention. Electronic. soldering typically utilizes rosin-based fluxes to promote solder wettability. Flux residues must be removed from the soldered parts when high product reliability is essential. Halogenated or CFC solvents have been the principle chemicals used to clean the residues. With the accelerated push to eliminate CFCs in the US by 1995, CFC-free solvents, aqueous-based cleaning, water soluble or ''no clean'' fluxes, and fluxless soldering technologies are being developed and quickly integrated into manufacturing practice. Sandia's Center for Solder Science and Technology has been ch g a variety of fluxless and alternative soldering technologies for DOE's waste minimization program. The work has focused on controlled atmosphere, laser, and ultrasonic fluxless soldering, protective metallic and organic coatings, and fluxes which have water soluble or low solids-based chemistries. With the increasing concern that Pb will also be banned from electronic soldering, Sandia has been characterizing the wetting, aging, and mechanical properties of Pb-fire solder alloys. The progress of these integrated studies will be discussed. Their impact on environmentally compatible manufacturing will be emphasized. Since there is no universal solution to the various environmental, safety, and health issues which currently face industry, the proposed technologies offer several complementary materials and processing options from which one can choose

  4. [Solder melting torches].

    Science.gov (United States)

    Cubero Postigo, G

    1988-11-01

    In this study about melting and torchs employed in solder in fixed prosthodontics, it's analysed the accurate melting, adequate quantity, as well as protection of adjacent tissues with an accurate anti-melting. The torch chosen is the oxyacetylene burner, because its greater calorific power.

  5. Visual detection of defects in solder joints

    Science.gov (United States)

    Blaignan, V. B.; Bourbakis, Nikolaos G.; Moghaddamzadeh, Ali; Yfantis, Evangelos A.

    1995-03-01

    The automatic, real-time visual acquisition and inspection of VLSI boards requires the use of machine vision and artificial intelligence methodologies in a new `frame' for the achievement of better results regarding efficiency, products quality and automated service. In this paper the visual detection and classification of different types of defects on solder joints in PC boards is presented by combining several image processing methods, such as smoothing, segmentation, edge detection, contour extraction and shape analysis. The results of this paper are based on simulated solder defects and a real one.

  6. Quantitative analysis of trace lead in tin-base lead-free solder by laser-induced plasma spectroscopy in air at atmospheric pressure.

    Science.gov (United States)

    Chen, Baozhong; Kano, Hidenori; Kuzuya, Mikio

    2008-02-01

    A quantitative analysis of trace lead in tin-base lead-free solder was carried out with laser-induced plasma spectroscopy (LIPS). In order to evaluate the applicability of the technique for rapid in situ analytical purposes, measurements were performed in air at atmospheric pressure, and the emission characteristics of the plasma produced by a Q-switched Nd:YAG laser over a laser energy range of 10 - 90 mJ were investigated using time-resolved spectroscopy. The experimental results showed that the emission intensity of the analysis line (Pb I 405.78 nm) was maximized at a laser energy of around 30 mJ, and a time-resolved measurement of a spectrum with a delay time of 0.4 micros after the laser pulse was effective for reducing the background continuum. Based on the results, lead-free solder certified reference materials were analyzed for trace lead (concentration 174 - 1940 ppm), and a linear calibration curve was obtained with a detection limit of several tens ppm.

  7. Oxidation and reduction kinetics of eutectic SnPb, InSn, and AuSn: a knowledge base for fluxless solder bonding applications

    DEFF Research Database (Denmark)

    Kuhmann, Jochen Friedrich; Preuss, A.; Adolphi, B.

    1998-01-01

    : (1) SnPb; (2) InSn; (3) AuSn. The studies of the oxidation kinetics show that the growth of the native oxide, which covers the solder surfaces from the start of all soldering operations is self-limiting. The rate of oxidation on the molten, metallic solder surfaces is significantly reduced...... and reduction kinetics, are applied to flip-chip (FC) bonding experiments in vacuum with and without the injection of H2. Wetting in vacuum is excellent but the self-alignment during flip-chip soldering is restricted. The desired, perfectly self-aligned FC-bonds have been only achieved, using evaporated...

  8. High power vertical stacked and horizontal arrayed diode laser bar development based on insulation micro-channel cooling (IMCC) and hard solder bonding technology

    Science.gov (United States)

    Wang, Boxue; Jia, Yangtao; Zhang, Haoyu; Jia, Shiyin; Liu, Jindou; Wang, Weifeng; Liu, Xingsheng

    2018-02-01

    An insulation micro-channel cooling (IMCC) has been developed for packaging high power bar-based vertical stack and horizontal array diode lasers, which eliminates many issues caused in its congener packaged by commercial copper formed micro-channel cooler(MCC), such as coefficient of thermal expansion (CTE) mismatch between cooler and diode laser bar, high coolant quality requirement (DI water) and channel corrosion and electro-corrosion induced by DI water if the DI-water quality is not well maintained The IMCC cooler separates water flow route and electrical route, which allows tap-water as coolant without electro-corrosion and therefore prolongs cooler lifetime dramatically and escalated the reliability of these diode lasers. The thickness of ceramic and copper in an IMCC cooler is well designed to minimize the CTE mismatch between laser bar and cooler, consequently, a very low "SMILE" of the laser bar can be achieved for small fast axis divergence after collimation. In additional, gold-tin hard solder bonding technology was also developed to minimize the risk of solder electromigration at high current density and thermal fatigue under hard-pulse operation mode. Testing results of IMCC packaged diode lasers are presented in this report.

  9. High-Temperature Lead-Free Solder Alternatives: Possibilities and Properties

    DEFF Research Database (Denmark)

    High-temperature solders have been widely used as joining materials to provide stable interconnections that resist a severe thermal environment and also to facilitate the drive for miniaturization. High-lead containing solders have been commonly used as high-temperature solders. The development...... the criteria for the evaluation of a new high-temperature lead-free solder material. A list of potential ternary high-temperature lead-free solder alternatives based on the Au-Sn and Au-Ge systems is proposed. Furthermore, a comprehensive comparison of the high-temperature stability of microstructures...... of high-temperature lead-free solders has become an important issue for both the electronics and automobile industries because of the health and environmental concerns associated with lead usage. Unfortunately, limited choices are available as high-temperature lead-free solders. This work outlines...

  10. Soldering of Nanotubes onto Microelectrodes

    DEFF Research Database (Denmark)

    Madsen, Dorte Nørgaard; Mølhave, Kristian; Mateiu, Ramona Valentina

    2003-01-01

    Suspended bridges of individual multiwalled carbon nanotubes were fabricated inside a scanning electron microscope by soldering the nanotube onto microelectrodes with highly conducting gold-carbon material. By the decomposition of organometallic vapor with the electron beam, metal-containing solder...... bonds were formed at the intersection of the nanotube and the electrodes. Current-voltage curves indicated metallic conduction of the nanotubes, with resistances in the range of 9-29 kOmega. Bridges made entirely of the soldering material exhibited resistances on the order of 100 Omega, and the solder...

  11. Utilization of Pb-free solders in MEMS packaging

    Science.gov (United States)

    Selvaduray, Guna S.

    2003-01-01

    Soldering of components within a package plays an important role in providing electrical interconnection, mechanical integrity and thermal dissipation. MEMS packages present challenges that are more complex than microelectronic packages because they are far more sensitive to shock and vibration and also require precision alignment. Soldering is used at two major levels within a MEMS package: at the die attach level and at the component attach level. Emerging environmental regulations worldwide, notably in Europe and Japan, have targeted the elimination of Pb usage in electronic assemblies, due to the inherent toxicity of Pb. This has provided the driving force for development and deployment of Pb-free solder alloys. A relatively large number of Pb-free solder alloys have been proposed by various researchers and companies. Some of these alloys have also been patented. After several years of research, the solder alloy system that has emerged is based on Sn as a major component. The electronics industry has identified different compositions for different specific uses, such as wave soldering, surface mount reflow, etc. The factors that affect choice of an appropriate Pb-free solder can be divided into two major categories, those related to manufacturing, and those related to long term reliability and performance.

  12. Effect of soldering techniques and gap distance on tensile strength of soldered Ni-Cr alloy joint.

    Science.gov (United States)

    Lee, Sang-Yeob; Lee, Jong-Hyuk

    2010-12-01

    The present study was intended to evaluate the effect of soldering techniques with infrared ray and gas torch under different gap distances (0.3 mm and 0.5 mm) on the tensile strength and surface porosity formation in Ni-Cr base metal alloy. Thirty five dumbbell shaped Ni-Cr alloy specimens were prepared and assigned to 5 groups according to the soldering method and the gap distance. For the soldering methods, gas torch (G group) and infrared ray (IR group) were compared and each group was subdivided by corresponding gap distance (0.3 mm: G3 and IR3, 0.5 mm: G5, IR5). Specimens of the experimental groups were sectioned in the middle with a diamond disk and embedded in solder blocks according to the predetermined distance. As a control group, 7 specimens were prepared without sectioning or soldering. After the soldering procedure, a tensile strength test was performed using universal testing machine at a crosshead speed 1 mm/min. The proportions of porosity on the fractured surface were calculated on the images acquired through the scanning electronic microscope. Every specimen of G3, G5, IR3 and IR5 was fractured on the solder joint area. However, there was no significant difference between the test groups (P > .05). There was a negative correlation between porosity formation and tensile strength in all the specimens in the test groups (P tensile strength of joints and porosity formations between the gas-oxygen torch soldering and infrared ray soldering technique or between the gap distance of 0.3 mm and 0.5 mm.

  13. Defects detecting method of lamp cap of single soldering lug

    Science.gov (United States)

    Cai, Jihe; Lv, Jidong

    2017-07-01

    In order to resolve the problems of low efficiency and large separating difference in fault detection of lamp holders with single soldering lug, an image-detection-based defect detection method is presented in this paper. The selected image is first preprocessed, where the possible area of soldering lug is cut in this preprocessing to narrow the scope for subsequent partition with the consideration that the smooth surface of metal at lamp holder and black insulation glass may reflect the light. Then, the soldering lug is extracted by a series of processing including clustering partition. Based on this, the defects are detected by regional marking, area comparison, circularity and coordinate deviation. The experiment results show that the designed method is simple and practical to detect main quality defects of lamp holder with single soldering lug correctly and efficiently.

  14. In situ measurement of electromigration-induced transient stress in Pb-free Sn-Cu solder joints by synchrotron radiation based X-ray polychromatic microdiffraction

    Energy Technology Data Exchange (ETDEWEB)

    Chen, Kai; Tamura, Nobumichi; Kunz, Martin; Tu, King-Ning; Lai, Yi-Shao

    2009-12-01

    Electromigration-induced hydrostatic elastic stress in Pb-free SnCu solder joints was studied by in situ synchrotron X-ray white beam microdiffraction. The elastic stresses in two different grains with similar crystallographic orientation, one located at the anode end and the other at the cathode end, were analyzed based on the elastic anisotropy of the Beta-Sn crystal structure. The stress in the grain at the cathode end remained constant except for temperature fluctuations, while the compressive stress in the grain at the anode end was built-up as a function of time during electromigration until a steady state was reached. The measured compressive stress gradient between the cathode and the anode is much larger than what is needed to initiate Sn whisker growth. The effective charge number of Beta-Sn derived from the electromigration data is in good agreement with the calculated value.

  15. In situ measurement of electromigration-induced transient stress in Pb-free Sn-Cu solder joints by synchrotron radiation based X-ray polychromatic microdiffraction

    Energy Technology Data Exchange (ETDEWEB)

    Chen, Kai; Tamura, Nobumichi; Kunz, Martin; Tu, King-Ning; Lai, Yi-Shao

    2009-05-15

    Electromigration-induced hydrostatic elastic stress in Pb-free SnCu solder joints was studied by in situ synchrotron X-ray white beam microdiffraction. The elastic stresses in two different grains with similar crystallographic orientation, one located at the anode end and the other at the cathode end, were analyzed based on the elastic anisotropy of the {beta}-Sn crystal structure. The stress in the grain at the cathode end remained constant except for temperature fluctuations, while the compressive stress in the grain at the anode end was built-up as a function of time during electromigration until a steady state was reached. The measured compressive stress gradient between the cathode and the anode is much larger than what is needed to initiate Sn whisker growth. The effective charge number of {beta}-Sn derived from the electromigration data is in good agreement with the calculated value.

  16. Effects of soldering methods on tensile strength of a gold-palladium metal ceramic alloy.

    Science.gov (United States)

    Ghadhanfari, Husain A; Khajah, Hasan M; Monaco, Edward A; Kim, Hyeongil

    2014-10-01

    The tensile strength obtained by conventional postceramic application soldering and laser postceramic welding may require more energy than microwave postceramic soldering, which could provide similar tensile strength values. The purpose of the study was to compare the tensile strength obtained by microwave postceramic soldering, conventional postceramic soldering, and laser postceramic welding. A gold-palladium metal ceramic alloy and gold-based solder were used in this study. Twenty-seven wax specimens were cast in gold-palladium noble metal and divided into 4 groups: laser welding with a specific postfiller noble metal, microwave soldering with a postceramic solder, conventional soldering with the same postceramic solder used in the microwave soldering group, and a nonsectioned control group. All the specimens were heat treated to simulate a normal porcelain sintering sequence. An Instron Universal Testing Machine was used to measure the tensile strength for the 4 groups. The means were analyzed statistically with 1-way ANOVA. The surface and fracture sites of the specimens were subjectively evaluated for fracture type and porosities by using a scanning electron microscope. The mean (standard deviation) ultimate tensile strength values were as follows: nonsectioned control 818 ±30 MPa, microwave 516 ±34 MPa, conventional 454 ±37 MPa, and laser weld 191 ±39 MPa. A 1-way ANOVA showed a significant difference in ultimate tensile strength among the groups (F3,23=334.5; Ptensile strength for gold and palladium noble metals than either conventional soldering or laser welding. Conventional soldering resulted in a higher tensile strength than laser welding. Under the experimental conditions described, either microwave or conventional postceramic soldering would appear to satisfy clinical requirements related to tensile strength. Copyright © 2014 Editorial Council for the Journal of Prosthetic Dentistry. Published by Elsevier Inc. All rights reserved.

  17. Thermal Analysis of the Sn-Ag-Cu-In Solder Alloy

    DEFF Research Database (Denmark)

    Sopousek, J.; Palcut, Marián; Hodúlová, Erika

    2010-01-01

    The tin-based alloy Sn-1.5Ag-0.7Cu-9.5In (composition in wt.%) is a potential candidate for lead-free soldering at temperatures close to 200°C due to the significant amount of indium. Samples of Sn-1.5Ag-0.7Cu-9.5In were prepared by controlled melting of the pure elements, followed by quenching t...... (DSC). The phase equilibrium has been further investigated by thermodynamic calculations. The observed phase compositions as well as DSC signals are reasonably explained using the calculation of phase diagrams (CALPHAD) approach....

  18. Tensile strength of two soldered alloys (Minalux and Verabond2

    Directory of Open Access Journals (Sweden)

    Mir Mohammad Rezaee S

    2002-07-01

    Full Text Available Recently. Minalux alloy, a base metal free from Be, has been presented on the market while no special soldering has been recommended for it. On the other hand, based on the manufacturer's claim, this alloy is similar to Verabond2. The aim of this study was to investigate the tensile strength of Minalux and Verabond2, soldered by Verasolder. Twelve standard dambble shape samples, with the length of 18 mm and the diameter of 3mm, were prepared from each alloy. Six samples of each alloy were divided into two pieces with carboradom disk. Soldering gap distance was 0.3mm, measured by a special jig and they were soldered by Verasolder alloy. Six other samples, of both Iranian and foreign unsoldered alloys were considered as control group. Then samples were examined under tensile force and their tensile strength was recorded. Two- way variance analysis showed that the tensile strength of Minalux alloy and Verabond2 were not statistically significant (Verasoler 686, Minalux 723, but after soldering, such difference became significant (Minalux 308, Verabond2 432. Verabond2 showed higher tensile strength after soldering.

  19. Study of Direct Bonding Ceramics with Metal Using Sn2La Solder

    Directory of Open Access Journals (Sweden)

    Roman Koleňák

    2015-01-01

    Full Text Available The aim of this research was to study the direct bonding of ceramic materials, mainly Al2O3 and selected metals, with primary attention given to Cu substrate. Soldering was performed with Sn-based solder alloyed with 2% La. We found that the bond formation between Sn2La solder and Al2O3 occurs at the activation of lanthanum phases in solder by ultrasound. Lanthanum in the solder becomes oxidised in air during the soldering process. However, due to ultrasonic activation, the lanthanum particles are distributed to the boundary with ceramic material. A uniformly thin layer containing La, 1.5 µm in thickness, is formed on the boundary with Al2O3 material, ensuring both wetting and joint formation. The shear strength with Al2O3 ceramics is 7.5 MPa. Increased strength to 13.5 MPa was observed with SiC ceramics.

  20. A new method for soldering particle-reinforced aluminum metal matrix composites

    Energy Technology Data Exchange (ETDEWEB)

    Lu, Jinbin; Mu, Yunchao [Zhongyuan University of Technology, Zhengzhou 450007 (China); Luo, Xiangwei [Zhengzhou University, Zhengzhou 450002 (China); Niu, Jitai, E-mail: niujitai@163.com [Zhongyuan University of Technology, Zhengzhou 450007 (China)

    2012-12-01

    Highlights: Black-Right-Pointing-Pointer Soldering of 55% SiCp/Al composite and Kovar is first achieved in the world. Black-Right-Pointing-Pointer The nickel plating is required on the surface of the composites before soldering. Black-Right-Pointing-Pointer Low welding temperature is set to avoid overheating of the matrix. Black-Right-Pointing-Pointer Chemical and metallurgical bonding of composites and Kovar is carried out. Black-Right-Pointing-Pointer High tension strength of 225 MPa in soldering seam has been obtained. - Abstract: Soldering of aluminum metal matrix composites (Al-SiC) to other structural materials, or even to themselves, has proved unsuccessful mainly due to the poor wetting of these composites by conventional soldering alloys. This paper reports a new approach, which improves the wetting properties of these composites by molting solder alloys to promote stronger bonds. The new approach relies on nickel-plating of the composite's faying surface prior to application of a solder alloy. Based on this approach, an aluminum metal matrix composite containing 55 vol.% SiC particles is successfully soldered to a Fe-Ni-Co alloy (commercially known as Kovar 4J29). The solder material is a zinc-based alloy (Zn-Cd-Ag-Cu) with a melting point of about 400 Degree-Sign C. Microscopic examinations of the aluminum metal matrix composites (Al-MMCs)-Kovar interfaces show that the nickel-plating, prior to soldering, could noticeably enhance the reaction between the molten solder and composites. The fractography of the shear-tested samples revealed that fracture occurs within the composite (i.e. cohesive failure), indicating a good adhesion between the solder alloy and the Al-SiC composite.

  1. A new method for soldering particle-reinforced aluminum metal matrix composites

    International Nuclear Information System (INIS)

    Lu, Jinbin; Mu, Yunchao; Luo, Xiangwei; Niu, Jitai

    2012-01-01

    Highlights: ► Soldering of 55% SiCp/Al composite and Kovar is first achieved in the world. ► The nickel plating is required on the surface of the composites before soldering. ► Low welding temperature is set to avoid overheating of the matrix. ► Chemical and metallurgical bonding of composites and Kovar is carried out. ► High tension strength of 225 MPa in soldering seam has been obtained. - Abstract: Soldering of aluminum metal matrix composites (Al–SiC) to other structural materials, or even to themselves, has proved unsuccessful mainly due to the poor wetting of these composites by conventional soldering alloys. This paper reports a new approach, which improves the wetting properties of these composites by molting solder alloys to promote stronger bonds. The new approach relies on nickel-plating of the composite's faying surface prior to application of a solder alloy. Based on this approach, an aluminum metal matrix composite containing 55 vol.% SiC particles is successfully soldered to a Fe–Ni–Co alloy (commercially known as Kovar 4J29). The solder material is a zinc-based alloy (Zn–Cd–Ag–Cu) with a melting point of about 400 °C. Microscopic examinations of the aluminum metal matrix composites (Al-MMCs)–Kovar interfaces show that the nickel-plating, prior to soldering, could noticeably enhance the reaction between the molten solder and composites. The fractography of the shear-tested samples revealed that fracture occurs within the composite (i.e. cohesive failure), indicating a good adhesion between the solder alloy and the Al–SiC composite.

  2. The Wiedemann–Franz–Lorenz relation for lead-free solder and intermetallic materials

    International Nuclear Information System (INIS)

    Yao, Yao; Fry, Jared; Fine, Morris E.; Keer, Leon M.

    2013-01-01

    Lead-free solders are replacing lead-rich solders in the electronics industry. Due to the limitation of available experimental data for thermal conductivity of lead-free solder and intermetallic compound (IMC) materials, the Wiedemann–Franz–Lorenz (WFL) relation is presented in this paper as a possible solution to predict thermal conductivity with known electrical conductivity. The method is based upon the fact that heat and electrical transport both involve free electrons. The thermal and electrical conductivities of Cu, Ni, Sn and different Sn-rich lead-free solder and IMC materials are studied by employing the WFL relation. Generally, analysis of the experimental data shows that the WFL relation is obeyed in both solder alloy and IMC materials, especially matching close to the relation for Sn, with a positive deviation from the theoretical Lorenz number. Thus, with the available electrical conductivity data, the thermal conductivity of solder and IMC materials can be obtained based on the proper WFL relation, and vice versa. A coupled thermal–electrical three-dimensional finite element analysis is performed to study the behavior of lead-free solder/IMC interconnects. Solder and IMC material properties predicted using the WFL relation are adopted in the computational model. By applying the WFL relation, the number of experiments required to determine the material properties for different lead-free solder/IMC interconnects can be significantly reduced, which can lead to pronounced savings of time and cost

  3. Lead-free solder technology transfer from ASE Americas

    Energy Technology Data Exchange (ETDEWEB)

    FTHENAKIS,V.

    1999-10-19

    To safeguard the environmental friendliness of photovoltaics, the PV industry follows a proactive, long-term environmental strategy involving a life-of-cycle approach to prevent environmental damage by its processes and products from cradle to grave. Part of this strategy is to examine substituting lead-based solder on PV modules with other solder alloys. Lead is a toxic metal that, if ingested, can damage the brain, nervous system, liver and kidneys. Lead from solder in electronic products has been found to leach out from municipal waste landfills and municipal incinerator ash was found to be high in lead also because of disposed consumer electronics and batteries. Consequently, there is a movement in Europe and Japan to ban lead altogether from use in electronic products and to restrict the movement across geographical boundaries of waste containing lead. Photovoltaic modules may contain small amounts of regulated materials, which vary from one technology to another. Environmental regulations impact the cost and complexity of dealing with end-of-life PV modules. If they were classified as hazardous according to Federal or State criteria, then special requirements for material handling, disposal, record-keeping and reporting would escalate the cost of decommissioning the modules. Fthenakis showed that several of today's x-Si modules failed the US-EPA Toxicity Characteristic Leaching Procedure (TCLP) for potential leaching of Pb in landfills and also California's standard on Total Threshold Limit Concentration (TTLC) for Pb. Consequently, such modules may be classified as hazardous waste. He highlighted potential legislation in Europe and Japan which could ban or restrict the use of lead and the efforts of the printed-circuit industries in developing Pb-free solder technologies in response to such expected legislation. Japanese firms already have introduced electronic products with Pb-free solder, and one PV manufacturer in the US, ASE Americas has used a

  4. ULTRASONIC SOLDERING OF Cu AND Al2O3 CERAMICS BY USE OF Bi-La AND Bi-Ag-La SOLDERS

    Directory of Open Access Journals (Sweden)

    Roman Koleňák

    2016-04-01

    Full Text Available This work deals with the effect of solder alloying with a small amount of lanthanum on joint formation with metallic and ceramic substrate. The Bi-Ag – based solder with 2 wt.% lanthanum addition and Bi solder with 2 wt.% lanthanum addition were studied. Soldering was performed by afluxless process on the air, by activation with a power ultrasound. It was found out that, during the process of ultrasonic soldering, lanthanum is distributed on the boundary, both with the copper and the ceramic substrate, which enhances the joint formation. The bond with Al2O3 ceramics is of an adhesive character, without the formation of a new contact interlayer.

  5. Gelatin based on Power-gel.TM. as solders for Cr.sup.4+laser tissue welding and sealing of lung air leak and fistulas in organs

    Science.gov (United States)

    Alfano, Robert R.; Tang, Jing; Evans, Jonathan M.; Ho, Peng Pei

    2006-04-25

    Laser tissue welding can be achieved using tunable Cr.sup.4+ lasers, semiconductor lasers and fiber lasers, where the weld strength follows the absorption spectrum of water. The use of gelatin and esterified gelatin as solders in conjunction with laser inducted tissue welding impart much stronger tensile and torque strengths than albumin solders. Selected NIR wavelength from the above lasers can improve welding and avoid thermal injury to tissue when used alone or with gelatin and esterified gelatin solders. These discoveries can be used to enhance laser tissue welding of tissues such as skin, mucous, bone, blood vessel, nerve, brain, liver, pancreas, spleen, kidney, lung, bronchus, respiratory track, urinary tract, gastrointestinal tract, or gynecologic tract and as a sealant for pulmonary air leaks and fistulas such as intestinal, rectal and urinary fistulas.

  6. Dural reconstruction by fascia using a temperature-controlled CO2 laser soldering system

    Science.gov (United States)

    Forer, Boaz; Vasilyev, Tamar; Brosh, Tamar; Kariv, Naam; Gil, Ziv; Fliss, Dan M.; Katzir, Abraham

    2005-04-01

    Conventional methods for dura repair are normally based on sutures or stitches. These methods have several disadvantages: (1) The dura is often brittle, and the standard procedures are difficult and time consuming. (2) The seal is leaky. (3) The introduction of a foreign body (e.g. sutures) may cause an inflammatory response. In order to overcome these difficulties we used a temperature controlled fiber optic based CO2 laser soldering system. In a set of in vitro experiments we generated a hole of diameter 10 mm in the dura of a pig corpse, covered the hole with a segment of fascia, and soldered the fascia to the edges of the hole, using 47% bovine albumin as a solder. The soldering was carried out spot by spot, and each spot was heated to 65° C for 3-6 seconds. The soldered dura was removed and the burst pressure of the soldered patch was measured. The average value for microscopic muscular side soldering was 194 mm Hg. This is much higher than the maximal physiological pressure of the CSF fluid in the brain, which is 15 mm Hg. In a set of in vivo experiments, fascia patches were soldered on holes in five farm pigs. The long term results of these experiments were very promising. In conclusion, we have developed an advanced technique for dural reconstruction, which will find important clinical applications.

  7. Properties and Microstructures of Sn-Bi-X Lead-Free Solders

    Directory of Open Access Journals (Sweden)

    Fan Yang

    2016-01-01

    Full Text Available The Sn-Bi base lead-free solders are proposed as one of the most popular alloys due to the low melting temperature (eutectic point: 139°C and low cost. However, they are not widely used because of the lower wettability, fatigue resistance, and elongation compared to traditional Sn-Pb solders. So the alloying is considered as an effective way to improve the properties of Sn-Bi solders with the addition of elements (Al, Cu, Zn, Ga, Ag, In, Sb, and rare earth and nanoparticles. In this paper, the development of Sn-Bi lead-free solders bearing elements and nanoparticles was reviewed. The variation of wettability, melting characteristic, electromigration, mechanical properties, microstructures, intermetallic compounds reaction, and creep behaviors was analyzed systematically, which can provide a reference for investigation of Sn-Bi base solders.

  8. Effects of Solder Temperature on Pin Through-Hole during Wave Soldering: Thermal-Fluid Structure Interaction Analysis

    Directory of Open Access Journals (Sweden)

    M. S. Abdul Aziz

    2014-01-01

    Full Text Available An efficient simulation technique was proposed to examine the thermal-fluid structure interaction in the effects of solder temperature on pin through-hole during wave soldering. This study investigated the capillary flow behavior as well as the displacement, temperature distribution, and von Mises stress of a pin passed through a solder material. A single pin through-hole connector mounted on a printed circuit board (PCB was simulated using a 3D model solved by FLUENT. The ABAQUS solver was employed to analyze the pin structure at solder temperatures of 456.15 K (183°C < T < 643.15 K (370°C. Both solvers were coupled by the real time coupling software and mesh-based parallel code coupling interface during analysis. In addition, an experiment was conducted to measure the temperature difference (ΔT between the top and the bottom of the pin. Analysis results showed that an increase in temperature increased the structural displacement and the von Mises stress. Filling time exhibited a quadratic relationship to the increment of temperature. The deformation of pin showed a linear correlation to the temperature. The ΔT obtained from the simulation and the experimental method were validated. This study elucidates and clearly illustrates wave soldering for engineers in the PCB assembly industry.

  9. Residual stress distribution of the soldered structure with Kovar alloy and Al2O3 ceramics

    Directory of Open Access Journals (Sweden)

    Qile Gao

    2017-03-01

    Full Text Available Residual stress distribution in soldered structure of Kovar alloy and Al2O3 ceramics was determined using XRD analyses. In order to measure the residual stress, position of the characteristic diffraction peak and stress constant were obtained using several versatile/advanced techniques after calibration. Residual stress of soldered structure was measured based on the diffraction patterns obtained for the distribution of residual stress in the soldered joint. Only diffraction peak at 149° for Kovar alloy and two diffraction peaks ranging from 140–170° for Al2O3 ceramics were found to be appropriate for the residual stress determination. It was also confirmed that for Al2O3 ceramics the XRD peak at 152° reflects the changes of stress more precisely than the one at 146°. The stress constant K of Kovar alloy and Al2O3 ceramics was found to be −197 MPa/° and −654 MPa/°, respectively. After soldering, the maximum residual stress of the soldered joint of both materials developed at 1 mm from the soldering seam, and the values within 3 mm from the soldering seam are generally significant. Thus, it is important to pay attention to the area of 3 mm from the soldering seam in practical application.

  10. Wettability study of lead free solder paste and its effect towards multiple reflow

    Directory of Open Access Journals (Sweden)

    Idris Siti Rabiatull Aisha

    2016-01-01

    Full Text Available Nowadays, wafer bumping using solder paste has come into focus as it provides a low cost method. However, since the industries are moving towards lead-free electronic packaging, a new type of no-clean flux was produced specifically for lead-free solder paste. Therefore, this study is used to evaluate the wettability of two different types of no-clean flux onto copper substrate. Besides, its effect towards multiple reflow was also studied. Reflow soldering was conducted for both types of solder paste that contained different type of no-clean flux for up to double reflow. Two different reflow profile was used. The results showed that the Flux A exhibit better soldering performance after first and second reflow soldering. In addition, type of intermetallic compound (IMC found after first reflow remain the same even after second reflow which was Cu-Sn based. This is shows that Flux A manage to control the diffusion process which will finally leads to a better solder joint performance. Nevertheless, mechanical testing should be carried out in order to evaluate the solder joint strength.

  11. Effect of Strain Rate on Joint Strength and Failure Mode of Lead-Free Solder Joints

    Science.gov (United States)

    Lin, Jian; Lei, Yongping; Fu, Hanguang; Guo, Fu

    2018-03-01

    In surface mount technology, the Sn-3.0Ag-0.5Cu solder joint has a shorter impact lifetime than a traditional lead-tin solder joint. In order to improve the impact property of SnAgCu lead-free solder joints and identify the effect of silver content on tensile strength and impact property, impact experiments were conducted at various strain rates on three selected SnAgCu based solder joints. It was found that joint failure mainly occurred in the solder material with large plastic deformation under low strain rate, while joint failure occurred at the brittle intermetallic compound layer without any plastic deformation at a high strain rate. Joint strength increased with the silver content in SnAgCu alloys in static tensile tests, while the impact property of the solder joint decreased with increasing silver content. When the strain rate was low, plastic deformation occurred with failure and the tensile strength of the Sn-3.0Ag-0.5Cu solder joint was higher than that of Sn-0.3Ag-0.7Cu; when the strain rate was high, joint failure mainly occurred at the brittle interface layer and the Sn-0.3Ag-0.7Cu solder joint had a better impact resistance with a thinner intermetallic compound layer.

  12. Physical properties of lead free solders in liquid and solid state

    Energy Technology Data Exchange (ETDEWEB)

    Mhiaoui, Souad

    2007-04-17

    The European legislation prohibits the use of lead containing solders in Europe. However, lead free solders have a higher melting point (typical 20%) and their mechanical characteristics are worse. Additional problems are aging and adhesion of the solder on the electronic circuits. Thus, research activities must focus on the optimization of the properties of Sn-Ag-Cu based lead free solders chosen by the industry. Two main objectives are treated in this work. In the center of the first one is the study of curious hysteresis effects of metallic cadmium-antimony alloys after thermal cycles by measuring electronic transport phenomena (thermoelectric power and electrical resistivity). The second objective, within the framework of ''cotutelle'' between the universities of Metz and of Chemnitz and supported by COST531, is to study more specifically lead free solders. A welding must well conduct electricity and well conduct and dissipate heat. In Metz, we determined the electrical conductivity, the thermoelectric power and the thermal conductivity of various lead free solders (Sn-Ag-Cu, Sn-Cu, Sn-Ag, Sn-Sb) as well in the liquid as well in the solid state. The results have been compared to classical lead-tin (Pb-Sn) solders. In Chemnitz we measured the surface tension, the interfacial tension and the density of lead free solders. We also measured the viscosity of these solders without and with additives, in particular nickel. These properties were related to the industrial problems of wettability and spreadability. Lastly, we solidified alloys under various conditions. We observed undercooling. We developed a technique of mixture of nanocrystalline powder with lead free solders ''to sow'' the liquid bath in order to obtain ''different'' solids which were examined using optical and electron microscopy. (orig.)

  13. Nanospot soldering polystyrene nanoparticles with an optical fiber probe laser irradiating a metallic AFM probe based on the near-field enhancement effect.

    Science.gov (United States)

    Cui, Jianlei; Yang, Lijun; Wang, Yang; Mei, Xuesong; Wang, Wenjun; Hou, Chaojian

    2015-02-04

    With the development of nanoscience and nanotechnology for the bottom-up nanofabrication of nanostructures formed from polystyrene nanoparticles, joining technology is an essential step in the manufacturing and assembly of nanodevices and nanostructures in order to provide mechanical integration and connection. To study the nanospot welding of polystyrene nanoparticles, we propose a new nanospot-soldering method using the near-field enhancement effect of a metallic atomic force microscope (AFM) probe tip that is irradiated by an optical fiber probe laser. On the basis of our theoretical analysis of the near-field enhancement effect, we set up an experimental system for nanospot soldering; this approach is carried out by using an optical fiber probe laser to irradiate the AFM probe tip to sinter the nanoparticles, providing a promising technical approach for the application of nanosoldering in nanoscience and nanotechnology.

  14. A computer vision based candidate for functional balance test.

    Science.gov (United States)

    Nalci, Alican; Khodamoradi, Alireza; Balkan, Ozgur; Nahab, Fatta; Garudadri, Harinath

    2015-08-01

    Balance in humans is a motor skill based on complex multimodal sensing, processing and control. Ability to maintain balance in activities of daily living (ADL) is compromised due to aging, diseases, injuries and environmental factors. Center for Disease Control and Prevention (CDC) estimate of the costs of falls among older adults was $34 billion in 2013 and is expected to reach $54.9 billion in 2020. In this paper, we present a brief review of balance impairments followed by subjective and objective tools currently used in clinical settings for human balance assessment. We propose a novel computer vision (CV) based approach as a candidate for functional balance test. The test will take less than a minute to administer and expected to be objective, repeatable and highly discriminative in quantifying ability to maintain posture and balance. We present an informal study with preliminary data from 10 healthy volunteers, and compare performance with a balance assessment system called BTrackS Balance Assessment Board. Our results show high degree of correlation with BTrackS. The proposed system promises to be a good candidate for objective functional balance tests and warrants further investigations to assess validity in clinical settings, including acute care, long term care and assisted living care facilities. Our long term goals include non-intrusive approaches to assess balance competence during ADL in independent living environments.

  15. Reliability of Wind Turbine Components-Solder Elements Fatigue Failure

    DEFF Research Database (Denmark)

    Kostandyan, Erik; Sørensen, John Dalsgaard

    2012-01-01

    The physics of failure for electrical components due to temperature loading is described. The main focus is on crack propagation in solder joints and damage accumulation models based on the Miner’s rule. Two models are proposed that describe the initial accumulated plastic strain depending...

  16. A Feasibility Study of Lead Free Solders for Level 1 Packaging Applications

    DEFF Research Database (Denmark)

    Chidambaram, Vivek; Hald, John; Hattel, Jesper Henri

    2009-01-01

    An attempt has been made to determine the lead free ternary combinations that satisfied the solidification requirement for a solder used in level 1 packaging applications, using the CALPHAD approach. The segregation profiles of the promising candidates were analyzed after scrutinizing the equilib......An attempt has been made to determine the lead free ternary combinations that satisfied the solidification requirement for a solder used in level 1 packaging applications, using the CALPHAD approach. The segregation profiles of the promising candidates were analyzed after scrutinizing...... the equilibrium calculations by Scheil solidification simulations and optimization. A feasibility study has been carried out for the replacement of high-lead-containing solders with the focus on surface tension, natural radius of curvature, oxidation resistance, intermetallic compound formation, and environmental...

  17. FEM simulation of the size and constraining effect in lead free solder joints

    Directory of Open Access Journals (Sweden)

    Lederer M.

    2012-06-01

    Full Text Available Due to the ongoing miniaturization in microelectronics, the influence of dimensional constraining effects on the strength of solder joints becomes increasingly important. Detailed investigations show a strong dependence of tensile strength and ductility on solder geometry. This paper focuses on FEM simulations of the thickness effect of Sn-3.5Ag solder gaps under tensile load. Solder joints and copper base material are simulated with an elasto-plastic material model in the framework of von Mises plasticity. Within the solder material a pronounced triaxiality of stress is observed. In consequence, the von Mises stress inside the solder material is considerably smaller than the longitudinal stress along the tensile axis. This leads to increased tensile strength of thin solder joints. However, the increase of strength also depends on the yield stress of the copper base material. The FEM simulations were compared with experimental results of tensile tests and satisfactory coincidence was found. The remaining deviation between experiment and simulation is explained by pressure dependency of the flow stress. In conclusion, a new pressure dependent plasticity model is suggested.

  18. Lead free solder mechanics and reliability

    CERN Document Server

    Pang, John Hock Lye

    2012-01-01

    Lead-free solders are used extensively as interconnection materials in electronic assemblies and play a critical role in the global semiconductor packaging and electronics manufacturing industry. Electronic products such as smart phones, notebooks and high performance computers rely on lead-free solder joints to connect IC chip components to printed circuit boards. Lead Free Solder: Mechanics and Reliability provides in-depth design knowledge on lead-free solder elastic-plastic-creep and strain-rate dependent deformation behavior and its application in failure assessment of solder joint reliability. It includes coverage of advanced mechanics of materials theory and experiments, mechanical properties of solder and solder joint specimens, constitutive models for solder deformation behavior; numerical modeling and simulation of solder joint failure subject to thermal cycling, mechanical bending fatigue, vibration fatigue and board-level drop impact tests. This book also: Discusses the mechanical prope...

  19. Characterization of the shear test method with low melting point In-48Sn solder joints

    International Nuclear Information System (INIS)

    Kim, Jong-Woong; Jung, Seung-Boo

    2005-01-01

    The ball shear tests were investigated in terms of effects of test parameters, i.e. shear height and shear speed, with an experimental and non-linear finite element analysis for evaluating the solder joint integrity of area array packages. A representative low melting point solder, In-48Sn, was examined in this work. The substrate was a common solder mask defined (SMD) type with solder bond pad openings of 460 μm in diameter. The microstructural investigations were carried out using scanning electron microscopy (SEM), and the intermetallic compounds (IMCs) were identified with energy dispersive spectrometer (EDS) and electron probe micro analyzer (EPMA). Shear tests were conducted with the two varying test parameters. It could be observed that increasing shear height, at fixed shear speed, has the effect of decreasing shear force, while the shear force increased with increasing shear speed at fixed shear height. Too high shear height could cause some bad effects on the test results such as unexpected high standard deviation values or shear tip sliding from the solder ball surface. The low shear height conditions were favorable for screening the type of brittle interfacial fractures or the degraded layers in the interfaces. The sensitivity of shear speed in In-48Sn solder is largely higher than those of Sn-based solders

  20. Thermomechanical fatigue of Sn-37 wt.% Pb model solder joints

    International Nuclear Information System (INIS)

    Liu, X.W.; Plumbridge, W.J.

    2003-01-01

    The fatigue of Sn-37 wt.% Pb model solder joints has been investigated under thermomechanical and thermal cycling. Based upon an analysis of displacements during thermomechancial cycling, a model solder joint has been designed to simulate actual joints in electronic packages. The strain-stress relationship, characterised by hysteresis loops, was determined during cycling from 30 to 125 deg. C, and the stress-range monitored throughout. The number of cycles to failure, as defined by the fall in stress range, was correlated to strain range and strain energy. The strain hardening exponent, k, varied with the definition of failure and, when a stress-range drop of 50% was used, it was 0.46. Cracks were produced during pure thermal cycling without external strains applied. These arose due to the local strains caused by thermal expansion mismatches between the solder and Cu 6 Sn 5 intermetallic layer, between the phases of solder, and due to the anisotropy of the materials. The fatigue life under thermomechanical cycling was significantly inferior to that obtained in isothermal mechanical cycling. A factor contributing to this inferiority is the internal damage produced during temperature cycling

  1. Electronic hidden solder joint geometry characterization

    Science.gov (United States)

    Hsieh, Sheng-Jen

    2009-05-01

    To reduce the size of electronic equipment, multi-layer printed circuit board structures have become popular in recent years. As a result, the inspection of hidden solder joints between layers of boards has become increasingly difficult. Xray machines have been used for ball grid array (BGA) and hidden solder joint inspection; however, the equipment is costly and the inspection process is time consuming. In this paper, we investigate an active thermography approach to probing solder joint geometry. A set of boards having the same number of solder joints and amount of solder paste (0.061 g) was fabricated. Each solder joint had a different geometry. A semi-automated system was built to heat and then transfer each board to a chamber where an infrared camera was used to scan the board as it was cooling down. Two-thirds of the data set was used for model development and one-third was used for model evaluation. Both artificial neural network (ANN) and binary logistic regression models were constructed. Results suggest that solder joints with more surface area cool much faster than those with less surface area. In addition, both modeling approaches are consistent in predicting solder geometry; ANN had 85% accuracy and the regression model had 80%. This approach can potentially be used to test for cold solder joints prior to BGA assembly, since cold solder joints may have air gaps between the joint and the board and air is a poor heat conductor. Therefore, a cold solder joint may have a slower cooling rate than a normal one.

  2. Optimization on laser soldering parameters onto lead-free solder joint

    Science.gov (United States)

    Nabila, T. J.; Idris, S. R. A.; Ishak, M.

    2017-09-01

    This paper presents the results of optimization on laser soldering parameters onto lead free solder joint. The objective of this study is to determine the laser power needed and scanning time required to produce a high quality of solder joint. Laser soldering was selected due to its rapid and controllable selective process as well as suitable for temperature sensitive assemblies, which is very desirable nowadays as compared to time consuming process such as casting. A fibre laser with 200W was used in this study to form a joining between lead free solder wire and copper board. However, a continuous laser power was ranged between 48 to 60W to create joining. Before that, flux was also applied prior to laser soldering for uniform heat distribution throughout the solder volume. Lead free solder wire with the size of 1.0mm diameter was formed into several shapes including straight line-shape with 20mm in length, and spiral-shape with 6mm diameter, in order to capture and disperse the heat evenly. Results showed that laser power ranged from 48W to 60W with 3.5 to 4.5s duration was found to be suitable for lead free solder wire with spiral-shape condition. Besides, the wetting angle was also in optimal when the laser power was increased The optimized fibre laser parameters obtained in this study will be used for future reference in performing a laser soldering between solder alloy copper board.

  3. Soldering Characteristics and Mechanical Properties of Sn-1.0Ag-0.5Cu Solder with Minor Aluminum Addition

    Directory of Open Access Journals (Sweden)

    Yee Mei Leong

    2016-06-01

    Full Text Available Driven by the trends towards miniaturization in lead free electronic products, researchers are putting immense efforts to improve the properties and reliabilities of Sn based solders. Recently, much interest has been shown on low silver (Ag content solder SAC105 (Sn-1.0Ag-0.5Cu because of economic reasons and improvement of impact resistance as compared to SAC305 (Sn-3.0Ag-0.5Cu. The present work investigates the effect of minor aluminum (Al addition (0.1–0.5 wt.% to SAC105 on the interfacial structure between solder and copper substrate during reflow. The addition of minor Al promoted formation of small, equiaxed Cu-Al particle, which are identified as Cu3Al2. Cu3Al2 resided at the near surface/edges of the solder and exhibited higher hardness and modulus. Results show that the minor addition of Al does not alter the morphology of the interfacial intermetallic compounds, but they substantially suppress the growth of the interfacial Cu6Sn5 intermetallic compound (IMC after reflow. During isothermal aging, minor alloying Al has reduced the thickness of interfacial Cu6Sn5 IMC but has no significant effect on the thickness of Cu3Sn. It is suggested that of atoms of Al exert their influence by hindering the flow of reacting species at the interface.

  4. Soldering Characteristics and Mechanical Properties of Sn-1.0Ag-0.5Cu Solder with Minor Aluminum Addition

    Science.gov (United States)

    Leong, Yee Mei; Haseeb, A.S.M.A.

    2016-01-01

    Driven by the trends towards miniaturization in lead free electronic products, researchers are putting immense efforts to improve the properties and reliabilities of Sn based solders. Recently, much interest has been shown on low silver (Ag) content solder SAC105 (Sn-1.0Ag-0.5Cu) because of economic reasons and improvement of impact resistance as compared to SAC305 (Sn-3.0Ag-0.5Cu. The present work investigates the effect of minor aluminum (Al) addition (0.1–0.5 wt.%) to SAC105 on the interfacial structure between solder and copper substrate during reflow. The addition of minor Al promoted formation of small, equiaxed Cu-Al particle, which are identified as Cu3Al2. Cu3Al2 resided at the near surface/edges of the solder and exhibited higher hardness and modulus. Results show that the minor addition of Al does not alter the morphology of the interfacial intermetallic compounds, but they substantially suppress the growth of the interfacial Cu6Sn5 intermetallic compound (IMC) after reflow. During isothermal aging, minor alloying Al has reduced the thickness of interfacial Cu6Sn5 IMC but has no significant effect on the thickness of Cu3Sn. It is suggested that of atoms of Al exert their influence by hindering the flow of reacting species at the interface. PMID:28773645

  5. Safer Soldering Guidelines and Instructional Resources

    Science.gov (United States)

    Love, Tyler S.; Tomlinson, Joel

    2018-01-01

    Soldering is a useful and necessary process for many classroom, makerspace, Fab Lab, technology and engineering lab, and science lab activities. As described in this article, soldering can pose many safety risks without proper engineering controls, standard operating procedures, and direct instructor supervision. There are many safety hazards…

  6. WETTABILITY STUDIES OF LEAD-FREE SOLDERS

    African Journals Online (AJOL)

    2012-03-01

    Mar 1, 2012 ... produced and characterized for possible replacement of Tin-Lead solders. The solder alloys produced are: 91Sn–9Zn, 60Sn–40Zn, 42Sn–58Bi, and 90Sn–10Bi. Tin-lead ... processing equipment and the use of lead pipes for drinking water is now discouraged due to the possibility of lead poisoning from ...

  7. Nano-soldering to single atomic layer

    Science.gov (United States)

    Girit, Caglar O [Berkeley, CA; Zettl, Alexander K [Kensington, CA

    2011-10-11

    A simple technique to solder submicron sized, ohmic contacts to nanostructures has been disclosed. The technique has several advantages over standard electron beam lithography methods, which are complex, costly, and can contaminate samples. To demonstrate the soldering technique graphene, a single atomic layer of carbon, has been contacted, and low- and high-field electronic transport properties have been measured.

  8. In-situ study of electromigration-induced grain rotation in Pb-free solder joint by synchrotron microdiffraction

    Energy Technology Data Exchange (ETDEWEB)

    Chen, Kai; Tamura, Nobumichi; Tu, King-Ning

    2008-10-31

    The rotation of Sn grains in Pb-free flip chip solder joints hasn't been reported in literature so far although it has been observed in Sn strips. In this letter, we report the detailed study of the grain orientation evolution induced by electromigration by synchrotron based white beam X-ray microdiffraction. It is found that the grains in solder joint rotate more slowly than in Sn strip even under higher current density. On the other hand, based on our estimation, the reorientation of the grains in solder joints also results in the reduction of electric resistivity, similar to the case of Sn strip. We will also discuss the reason why the electric resistance decreases much more in strips than in the Sn-based solders, and the different driving force for the grain growth in solder joint and in thin film interconnect lines.

  9. Corrosion Reliability of Lead-free Solder Systems Used in Electronics

    DEFF Research Database (Denmark)

    Li, Feng; Verdingovas, Vadimas; Medgyes, Balint

    2017-01-01

    The present work investigated the corrosion reliability of Sn-Ag-Cu based five lead-free solder alloys. The corrosion and electrochemical migration (ECM) susceptibility study of the solder alloys has been carried out by water droplet (WD) tests on pure alloy ingot samples, and by accelerated....... The galvanic corrosion was found between cathodically active Bi phase and anodic (Sn, Sb) solid solution in InnoLot alloy, while the Ag3Sn phase was cathodically active in the other four alloys. The paper theoretically illustrated the reason for the differences in corrosion reliability in the five alloys based...... humidity/temperature cycling tests on soldered surface insulation resistance (SIR) comb pattern. Complimentary microstructural and phase analysis of solder alloys has been carried out using the scanning electron microscope (SEM), energy dispersive spectroscopy (EDS), and X-ray diffraction (XRD) methods...

  10. Effects of PCB thickness on adjustable fountain wave soldering

    Indian Academy of Sciences (India)

    Simulation and experimental results show that the PTH solder profiles of the two soldering processes are almost identical. The effect of PCB thickness on PTH voiding is also discussed. Keywords. Pin through hole (PTH); adjustable fountain wave soldering; wave soldering; printed circuit board (PCB); vertical fill; simulation.

  11. Effects of voids on thermal-mechanical reliability of lead-free solder joints

    Directory of Open Access Journals (Sweden)

    Benabou Lahouari

    2014-06-01

    Full Text Available Reliability of electronic packages has become a major issue, particularly in systems used in electrical or hybrid cars where severe operating conditions must be met. Many studies have shown that solder interconnects are critical elements since many failure mechanisms originate from their typical response under thermal cycles. In this study, effects of voids in solder interconnects on the electronic assembly lifetime are estimated based on finite element simulations.

  12. Effects of rework on adhesion of Pb-In soldered gold thick films

    International Nuclear Information System (INIS)

    Gehman, R.W.; Becka, G.A.; Losure, J.A.

    1982-02-01

    The feasibility of repeatedly reworking Pb-In soldered joints on gold thick films was evaluated. Nailhead adhesion tests on soldered thick films typically resulted in failure within the bulk solder (50 In-50 Pb). Average strengths increased with each rework, and the failure mode changed. An increase in metalization lift-off occurred with successive reworks. An investigation was initiated to determine why these changes occurred. Based on this work, the thick film adhesion to the substrate appeared to be lowered by indium reduction of cadmium oxide and by formation of a weak, brittle intermetallic compound, Au 9 In 4 . It was concluded that two solder reworks could be conducted without significant amounts of metallization lift-off during nailhead testing

  13. Effect of Solder Flux Residues on Corrosion of Electronics

    DEFF Research Database (Denmark)

    Hansen, Kirsten Stentoft; Jellesen, Morten Stendahl; Møller, Per

    2009-01-01

    that no cleaning after the solder process is required. In some cases, however, this statement is not correct. Experiments with ‘No Clean’ wave solder flux have been performed, and the results show, that the solder temperature plays an important role; temperatures below 170°C cause more flux residues than solder......Flux from ‘No Clean’ solder processes can cause reliability problems in the field due to aggressive residues, which may be electrical conducting or corrosive in humid environments. The solder temperature during a wave solder process is of great importance to the amount of residues left on a PCBA...... of dust, which can act as a humidity absorber. The experiments have been made on SnPb wave solder flux, later experiments will show if the problems are less for Lead-free reflow and wave soldering, because the solder temperature is about 20°C higher. Furthermore an example of failure after humidity...

  14. Development of high melting point, environmentally friendly solders, using the calphad approach

    DEFF Research Database (Denmark)

    Chidambaram, Vivek; Hald, John; Hattel, Jesper Henri

    2008-01-01

    An attempt has been made using the CALPHAD approach via Thermo-Calc to explore the various possible chemical compositions that adhere to the melting criterion i.e. 270-350 degrees C, required to replace the traditionally used high lead content solders for first level packaging applications. Various...... of promising solder alloy candidates. The ternary combinations that satisfied the primary solidification requirement were scrutinized taking into account the commercial interests i.e. availability, cost-effectiveness, recyclability and toxicity issues. Technical issues like manufacturability and surface...... tension have also been considered. Special focus has been given to toxicity related issues since the main ideology of looking for an alternative to high lead containing solders is not related to technical issues but due to environmental concerns....

  15. Joint Lead-Free Solder Test Program for High Reliability Military and Space Applications

    Science.gov (United States)

    Brown, Christina

    2004-01-01

    Current and future space and defense systems face potential risks from the continued use of tin-lead solder, including: compliance with current environmental regulations, concerns about potential environmental legislation banning lead-containing products, reduced mission readiness, and component obsolescence with lead surface finishes. For example, the United States Environmental Protection Agency (USEPA) has lowered the Toxic Chemical Release reporting threshold for lead to 100 pounds. Overseas, the Waste Electrical and Electronic Equipment (WEEE) and the Restriction on Hazardous Substances (RoHS) Dicctives in Europe and similar mandates in Japan have instilled concern that a legislative body will prohibit the use of lead in aerospace/military electronics soldering. Any potential banning of lead compounds could reduce the supplier base and adversely affect the readiness of missions led by the National Aeronautics and Space Administration (NASA) and the U.S. Department of Defense (DoD). Before considering lead-free electronics for system upgrades or future designs, however, it is important for the DoD and NASA to know whether lead-free solders can meet their systems' requirements. No single lead-free solder is likely to qualify for all defense and space applications. Therefore, it is important to validate alternative solders for discrete applications. As a result of the need for comprehensive test data on the reliability of lead-free solders, a partnership was formed between the DoD, NASA, and several original equipment manufactures (OEMs) to conduct solder-joint reliability (laboratory) testing of three lead-free solder alloys on newly manufactured and reworked circuit cards to generate performance data for high-reliability (IPC Class 3) applications.

  16. Thermomechanical Behavior of Monolithic SN-AG-CU Solder and Copper Fiber Reinforced Solders

    National Research Council Canada - National Science Library

    Reuse, Rolando

    2005-01-01

    .... The thermomechanical cycling in the solder causes numerous reliability challenges, mostly because of the mismatch of the coefficient of thermal expansion between the silicon chip and the substrate...

  17. A Novel Technique for the Connection of Ceramic and Titanium Implant Components Using Glass Solder Bonding

    Directory of Open Access Journals (Sweden)

    Enrico Mick

    2015-07-01

    Full Text Available Both titanium and ceramic materials provide specific advantages in dental implant technology. However, some problems, like hypersensitivity reactions, corrosion and mechanical failure, have been reported. Therefore, the combining of both materials to take advantage of their pros, while eliminating their respective cons, would be desirable. Hence, we introduced a new technique to bond titanium and ceramic materials by means of a silica-based glass ceramic solder. Cylindrical compound samples (Ø10 mm × 56 mm made of alumina toughened zirconia (ATZ, as well as titanium grade 5, were bonded by glass solder on their end faces. As a control, a two-component adhesive glue was utilized. The samples were investigated without further treatment, after 30 and 90 days of storage in distilled water at room temperature, and after aging. All samples were subjected to quasi-static four-point-bending tests. We found that the glass solder bonding provided significantly higher bending strength than adhesive glue bonding. In contrast to the glued samples, the bending strength of the soldered samples remained unaltered by the storage and aging treatments. Scanning electron microscopy (SEM and energy-dispersive X-ray (EDX analyses confirmed the presence of a stable solder-ceramic interface. Therefore, the glass solder technique represents a promising method for optimizing dental and orthopedic implant bondings.

  18. Induction soldering of photovoltaic system components

    Science.gov (United States)

    Kumaria, Shashwat; de Leon, Briccio

    2015-11-17

    A method comprises positioning a pair of photovoltaic wafers in a side-by-side arrangement. An interconnect is placed on the pair of wafers such that the interconnect overlaps both wafers of the pair, solder material being provided between the interconnect and the respective wafers. A solder head is then located adjacent the interconnect, and the coil is energized to effect inductive heating of the solder material. The solder head comprises an induction coil shaped to define an eye, and a magnetic field concentrator located at least partially in the eye of the coil. The magnetic field concentrator defines a passage extending axially through the eye of the coil, and may be of a material with a high magnetic permeability.

  19. Feasibility studies for laser solder neurorrhaphy

    Science.gov (United States)

    Bass, Lawrence S.; Moazami, Nader; Avellino, Anthony; Trosaborg, W.; Treat, Michael R.

    1994-09-01

    We present a novel technique of nerve repair attempting to reduce scarring and improve alignment. A laser solder composed of albumin, hyaluronate, and indocyanine green dye (peak absorbance 805 nm) was used. After applying solder to the anastomotic site, nerve ends can be precisely aligned and sealed in place using an 810 nm diode laser. Transected sciatic nerves in the rat were used as the experimental model. Laser repairs had approximately half the immediate strength of suture repairs (130 vs 280 g/cm2) but comparable strength by 7 days (270 vs 250 g/cm2). There was no dehiscence in either group. Thermal damage was confined to the solder and epineurium. At 90 days there was no difference in nerve conduction values or axon counts in suture or laser repairs. Histology was suggestive of a later stage of regeneration in the laser group. Laser soldering produces increased strength compared with traditional laser welding with less thermal injury.

  20. Nano Coated Lead Free Solders for Sustainable Electronic Waste Management

    Directory of Open Access Journals (Sweden)

    K. Arun Vasantha Geethan

    Full Text Available ABSTRACT Lead has been used in a wide range of applications, but in the past decades it became clear that its high toxicity could cause various problems. Studies indicate that exposure to high concentrations of lead can cause harmful damages to humans. To eliminate the usage of lead in electronic products as an initiative towards electronic waste management (e waste, lead free solders were produced with suitable methods by replacing lead. But lead free solders are not preferred as a substitute of lead because they are poor in their mechanical properties such as tensile strength, shear strength and hardness which are ultimately required for a material to resist failure.Nano-Structured materials and coatings offer the potential for Vital improvements in engineering properties based on improvements in physical and mechanical properties resulting from reducing micro structural features by factors of 100 to 1000 times compared to current engineering materials.

  1. Recrystallization Behavior in SAC305 and SAC305 + 3.0POSS Solder Joints Under Thermal Shock

    Science.gov (United States)

    Han, Jing; Gu, Penghao; Ma, Limin; Guo, Fu; Liu, Jianping

    2018-04-01

    Sn-3.0Ag-0.5Cu (SAC305) and SAC305 + 3.0 polyhedral oligomeric silsesquioxanes (POSS) ball grid array (BGA) assemblies have been prepared, observed, and subjected to thermal shock. The microstructure and grain orientation evolution of the solder joints located at the same position of the package were characterized by scanning electron microscopy and electron backscattering diffraction, respectively. The results showed that the microstructure of the solder joints was refined by addition of POSS particles. In addition, compared with the single-grained or tricrystal joints normally observed in SAC305 BGA solder joints, the frequency of single-grained as-reflowed SAC305 + 3.0POSS BGA joints was greatly reduced, and the solder joints were typically composed of multicrystals with orientations separated by high-angle grain boundaries. These multicrystal joints appear to be obtained by dominant tricrystals or double tricrystals with deviation of the preferred [110] and [1\\bar{1}0] growth directions of Sn dendrites in Sn-Ag-based solder alloys during solidification from the melt. After 928 thermal shock cycles, the SAC305 solder joint had large-area recrystallization and cracks in contrast to the SAC305 + 3.0POSS solder joint located at the same position of the package, indicating that addition of POSS to SAC305 solder joints may contribute to postponement of recrystallization and subsequent crack initiation and propagation along recrystallized grain boundaries by pinning grain boundaries and movement of dislocations. This finding also confirms the double tricrystal solidification twinning nucleation behavior in Pb-free solder joints.

  2. Microstructural evolution of eutectic Au-Sn solder joints

    Energy Technology Data Exchange (ETDEWEB)

    Song, Ho Geon [Univ. of California, Berkeley, CA (United States)

    2002-05-01

    Current trends toward miniaturization and the use of lead(Pb)-free solder in electronic packaging present new problems in the reliability of solder joints. This study was performed in order to understand the microstructure and microstructural evolution of small volumes of nominally eutectic Au-Sn solder joints (80Au-20Sn by weight), which gives insight into properties and reliability.

  3. Effects of PCB thickness on adjustable fountain wave soldering

    Indian Academy of Sciences (India)

    PTH components, such as the pin, resistor, and light emit- ting diode, are inserted into the PCB hole and carried by the conveyor to the soldering zone. The soldering process begins when a mechanical bond is formed between PTH and the PCBs pass- ing through the molten solder. This study investigated the effect of PCB ...

  4. Efforts to Develop a 300°C Solder

    Energy Technology Data Exchange (ETDEWEB)

    Norann, Randy A [Perma Works LLC

    2015-01-25

    This paper covers the efforts made to find a 300°C electrical solder solution for geothermal well monitoring and logging tools by Perma Works LLC. This paper covers: why a high temperature solder is needed, what makes for a good solder, testing flux, testing conductive epoxy and testing intermetallic bonds. Future areas of research are suggested.

  5. Fundamentals of lead-free solder interconnect technology from microstructures to reliability

    CERN Document Server

    Lee, Tae-Kyu; Kim, Choong-Un; Ma, Hongtao

    2015-01-01

    This unique book provides an up-to-date overview of the fundamental concepts behind lead-free solder and interconnection technology. Readers will find a description of the rapidly increasing presence of electronic systems in all aspects of modern life as well as the increasing need for predictable reliability in electronic systems. The physical and mechanical properties of lead-free solders are examined in detail, and building on fundamental science, the mechanisms responsible for damage and failure evolution, which affect reliability of lead-free solder joints are identified based on microstructure evolution.  The continuing miniaturization of electronic systems will increase the demand on the performance of solder joints, which will require new alloy and processing strategies as well as interconnection design strategies. This book provides a foundation on which improved performance and new design approaches can be based.  In summary, this book:  Provides an up-to-date overview on lead-free soldering tech...

  6. Intelligent laser soldering inspection and process control

    Science.gov (United States)

    Vanzetti, Riccardo

    1987-01-01

    Component assembly on printed circuitry keeps making giant strides toward denser packaging and smaller dimensions. From a single layer to multilayer, from through holes to surface mounted components and tape applied bonds, unrelenting progress results in new, difficult problems in assembling, soldering, inspecting and controlling the manufacturing process of the new electronics. Among the major problems are the variables introduced by human operators. The small dimensions and the tight assembly tolerances are now successfully met by machines which are faster and more precise than the human hand. The same is true for soldering. But visual inspection of the solder joints is now so severely limited by the ever shrinking area accessible to the human eye that the inspector's diagnosis cannot be trusted any longer. Solutions to correcting these problems are discussed.

  7. Lead (Pb)-Free Solder Applications

    Energy Technology Data Exchange (ETDEWEB)

    VIANCO,PAUL T.

    2000-08-15

    Legislative and marketing forces both abroad and in the US are causing the electronics industry to consider the use of Pb-free solders in place of traditional Sn-Pb alloys. Previous case studies have demonstrated the satisfactory manufacturability and reliability of several Pb-free compositions for printed circuit board applications. Those data, together with the results of fundamental studies on Pb-free solder materials, have indicated the general feasibility of their use in the broader range of present-day, electrical and electronic components.

  8. Physics of Failure as a Basis for Solder Elements Reliability Assessment in Wind Turbines

    DEFF Research Database (Denmark)

    Kostandyan, Erik; Sørensen, John Dalsgaard

    2012-01-01

    description of the reliability. A physics of failure approach is applied. A SnAg solder component used in power electronics is used as an example. Crack propagation in the SnAg solder is modeled and a model to assess the accumulated plastic strain is proposed based on a physics of failure approach. Based...... on the proposed model it is described how to find the accumulated linear damage and reliability levels for a given temperature loading profile. Using structural reliability methods the reliability levels of the electrical components are assessed by introducing scale factors for stresses....

  9. Decomposition of no-clean solder flux systems and their effects on the corrosion reliability of electronics

    DEFF Research Database (Denmark)

    Conseil, Helene; Verdingovas, Vadimas; Jellesen, Morten Stendahl

    2016-01-01

    No-clean flux systems are used today for the soldering of electronic printed circuit board assemblies assuming that all the aggressive substances of the flux will vanish during the soldering process i.e. evaporate, decompose or being enclosed safely in the residues. However this is not true in most...... cases, as the flux residue left on a printed circuit board assembly is a key factor compromising the corrosion reliability under humid conditions. This investigation focuses on the chemical degradation of three kinds of solder flux systems based on adipic, succinic, and glutaric acid as a function...... of temperature, thus simulating the soldering process. Differential Scanning Calorimetry, Fourier Transform Infrared Spectroscopy, and Ion Chromatography were employed for decomposition and residue analysis. Aggressiveness of the residue was investigated using a pH indicator gel test and by acid value...

  10. SINGLE IMAGE CAMERA CALIBRATION IN CLOSE RANGE PHOTOGRAMMETRY FOR SOLDER JOINT ANALYSIS

    Directory of Open Access Journals (Sweden)

    D. Heinemann

    2016-06-01

    Full Text Available Printed Circuit Boards (PCB play an important role in the manufacturing of electronic devices. To ensure a correct function of the PCBs a certain amount of solder paste is needed during the placement of components. The aim of the current research is to develop an real-time, closed-loop solution for the analysis of the printing process where solder is printed onto PCBs. Close range photogrammetry allows for determination of the solder volume and a subsequent correction if necessary. Photogrammetry is an image based method for three dimensional reconstruction from two dimensional image data of an object. A precise camera calibration is indispensable for an accurate reconstruction. In our certain application it is not possible to use calibration methods with two dimensional calibration targets. Therefore a special calibration target was developed and manufactured, which allows for single image camera calibration.

  11. Detection of small-size solder ball defects through heat conduction analysis

    Science.gov (United States)

    Zhou, Xiuyun; Chen, Yaqiu; Lu, Xiaochuan

    2018-02-01

    Aiming to solve the defect detection problem of a small-size solder ball in the high density chip, heat conduction analysis based on eddy current pulsed thermography is put forward to differentiate various defects. With establishing the 3D finite element model about induction heating, defects such as cracks and void can be distinguished by temperature difference resulting from heat conduction. Furthermore, the experiment of 0.4 mm-diameter solder balls with different defects is carried out to prove that crack and void solder can be distinguished. Three kinds of crack length on a gull-wing pin are selected, including 0.24 mm, 1.2 mm, and 2.16 mm, to verify that the small defect can be discriminated. Both the simulation study and experiment result show that the heat conduction analysis method is reliable and convenient.

  12. ReCGiP, a database of reproduction candidate genes in pigs based on bibliomics

    OpenAIRE

    Yang, Lun; Zhang, Xiangzhe; Chen, Jian; Wang, Qishan; Wang, Lishan; Jiang, Yue; Pan, Yuchun

    2010-01-01

    Abstract Background Reproduction in pigs is one of the most economically important traits. To improve the reproductive performances, numerous studies have focused on the identification of candidate genes. However, it is hard for one to read all literatures thoroughly to get information. So we have developed a database providing candidate genes for reproductive researches in pig by mining and processing existing biological literatures in human and pigs, named as ReCGiP. Description Based on te...

  13. Effect of trace elements on the interface reactions between two lead-free solders and copper or nickel substrates

    Directory of Open Access Journals (Sweden)

    Soares D.

    2007-01-01

    Full Text Available Traditional Sn-Pb solder alloys are being replaced, because of environmental and health concerns about lead toxicity. Among some alternative alloy systems, the Sn-Zn and Sn-Cu base alloy systems have been studied and reveal promising properties. The reliability of a solder joint is affected by the solder/substrate interaction and the nature of the layers formed at the interface. The solder/substrate reactions, for Sn-Zn and Sn-Cu base solder alloys, were evaluated in what concerns the morphology and chemical composition of the interface layers. The effect of the addition of P, at low levels, on the chemical composition of the layers present at the interface was studied. The phases formed at the interface between the Cu or Ni substrate and a molten lead-free solder at 250ºC, were studied for different stage times and alloy compositions. The melting temperatures, of the studied alloys, were determined by Differential Scanning Calorimetry (DSC. Identification of equilibrium phases formed at the interface layer, and the evaluation of their chemical composition were performed by Scanning Electron Microscopy (SEM/EDS. Different interface characteristics were obtained, namely for the alloys containing Zn. The obtained IML layer thickness was compared, for both types of alloy systems.

  14. Performance on the Athletic Training Certification Examination Based on Candidates' Routes to Eligibility

    Science.gov (United States)

    Starkey, Chad; Henderson, James

    1995-01-01

    The National Athletic Trainers' Association Board of Certification initiated a task force whose purpose is to evaluate the criteria that determine eligibility for the athletic training certification examination. Candidates may qualify to take the examination through one of two routes: an academic-based curriculum program or the practical education, work-experience-based internship route. The certification examination is comprised of three sections: a written examination, a written simulation, and a practical examination. We retrospectively examined certification examination scores during a 2-year period to determine whether a significant difference existed between the two groups of candidates. Test results for first-time candidates sitting for one of the nine examinations administered during 1992 and 1993 were extracted from the data base maintained by Columbia Assessment Services, Inc (Raleigh, NC) and grouped according to the candidates' route to eligibility. Curriculum candidates had significantly greater scores than did internship candidates on each of the three parts of the examination. Although the test analysis yields strong statistical power in interpreting these results, examination outcomes may also be influenced by the structure and content of the academic program followed, the quality of the clinical experience, the heterogeneity of each of the routes, and the psychosocial rigors of the examination process. PMID:16558313

  15. Influence of nickel–phosphorus surface roughness on wettability and pores formation in solder joints for high power electronic applications

    Energy Technology Data Exchange (ETDEWEB)

    Vivet, L., E-mail: laurent.vivet@valeo.com [Valeo, Group Electronic Expertise and Development Services, 2 rue André Boulle, 94046 Créteil (France); Joudrier, A.-L. [Institut Lavoisier de Versailles, UMR CNRS 8180, 45 Avenue des Etats-Unis, 78035 Versailles (France); Tan, K.-L.; Morelle, J.-M. [Valeo, Group Electronic Expertise and Development Services, 2 rue André Boulle, 94046 Créteil (France); Etcheberry, A. [Institut Lavoisier de Versailles, UMR CNRS 8180, 45 Avenue des Etats-Unis, 78035 Versailles (France); Chalumeau, L. [Egide, Site industriel du Sactar, 85500 Bollène (France)

    2013-12-15

    Electroless nickel-high-phosphorus Ni–P plating is used as substrate coating in the electronic component technology. The ability to minimize pores formation in solder joints and the wettability of the Ni–P layer remain points of investigation. The qualities and the control of the physical and chemical properties of the deposits are essential for the reliability of the products. In this contribution it has been measured how a controlled change of one property of the Ni–P surface, its average roughness, changes the wettability of this surface before soldering completion, at ambient temperature and under ambient air, and how it contribute to change the amount and size of pores inside solder joints, after soldering completion. Before all, observations of the Ni–P surfaces using scanning electron microscopy have been achieved. Then the wettability has been measured through the determination of both the disperse and the polar fractions of the substrate surface tension, based on the measurements of the wetting angle for droplets of four different liquids, under ambient air and at room temperature (classical sessile drop technique). Finally the X-ray micro-radiography measurements of both the area fraction of pores and the size of the largest pore inside the solder joint of dice laser soldered on the studied substrate, using high melting temperature solder (300 °C, PbSnAg) have been achieved. This study clearly demonstrates that both the ability to minimize pores formation in solder joints and the wettability under ambient conditions of the Ni–P substrate decrease and become more variable when its average roughness increases. These effects can be explained considering the Cassie–Baxter model for rough surface wetting behaviour, completed by the model of heterogeneous nucleation and growth for gas bubbles inside a liquid.

  16. THE POSSIBILITY OF USING LASER-ULTRASOUND TO MONITOR THE QUALITY SOLDERED CONNECTIONS CHAMBERS OF LIQUID ROCKET ENGINES

    Directory of Open Access Journals (Sweden)

    N. V. Astredinova

    2014-01-01

    Full Text Available During the manufacturing process to the design of modern liquid rocket engines are presented important requirements, such as minimum weight, maximum stiffness and strength of nodes, maximum service life in operation, high reliability and quality of soldered and welded seams. Due to the high quality requirements soldered connections and the specific design of the nozzle, it became necessary in the development and testing of a new non-conventional non-destructive testing method – laser-ultrasound diagnosis. In accordance with regulatory guidelines, quality control soldered connections is allowed to use an acoustic kind of control methods of the reflected light, transmitted light, resonant, free vibration and acoustic emission. Attempts to use traditional methods of non-destructive testing did not lead to positive results. This is due primarily to the size of typical solder joint defects, as well as the structural features of the rocket engine, the data structure is not controllable. In connection with this, a new method that provides quality control soldered connections cameras LRE based on the thermo generation of ultrasound. Methods of ultrasonic flaw detection of photoacoustic effect, in most cases, have a number of advantages over methods that use standard (traditional piezo transducers. In the course of studies have found that the sensitivity of the laser-ultrasonic method and flaw detector UDL-2M can detect lack of adhesion in the solder joints on the upper edges of the nozzle in the sub-header area of the site.

  17. An Approach for Impression Creep of Lead Free Microelectronic Solders

    Science.gov (United States)

    Anastasio, Onofrio A.

    2002-06-01

    Currently, the microelectronics industry is transitioning from lead-containing to lead-free solders in response to legislation in the EU and Japan. Before an alternative alloy can be designated as a replacement for current Pb-Sn extensive testing must be accomplished. One major characteristic of the alloy that must be considered is creep. Traditionally, creep testing requires numerous samples and a long tin, which thwarts the generation of comprehensive creep databases for difficult to prepare samples such as microelectronic solder joints. However, a relatively new technique, impression creep enables us to rapidly generate creep data. This test uses a cylindrical punch with a flat end to make an impression on the surface of a specimen under constant load. The steady state velocity of the indenter is found to have the same stress and temperature dependence as the conventional unidirectional creep test using bulk specimens. This thesis examines impression creep tests of eutectic Sn-Ag. A testing program and apparatus was developed constructed based on a servo hydraulic test frame. The apparatus is capable of a load resolution of 0.01N with a stability of plus/minus 0.1N, and a displacement resolution of 0.05 microns with a stability of plus/minus 0.1 microns. Samples of eutectic Sn-Ag solder were reflowed to develop the microstructure used in microelectronic packaging. Creep tests were conducted at various stresses and temperatures and showed that coarse microstructures creep more rapidly than the microstructures in the tested regime.

  18. Processing and Characterization of NiTi Shape Memory Alloy Particle Reinforced Sn-In Solders

    National Research Council Canada - National Science Library

    Chung, Kohn C

    2006-01-01

    .... In previous work, it was proposed that reinforcement of solder by NiTi shape memory alloy particles to form smart composite solder reduces the inelastic strain of the solder and hence, may enhance...

  19. Research of Joining Brittle Nonmetallic Materials with an Active Solder

    Directory of Open Access Journals (Sweden)

    Roman Koleňák

    2014-01-01

    Full Text Available This paper deals with soldering high-purity brittle, nonmetallic materials such as SiO2, Si, and C (graphite. However, these materials exert poor wettability when using tin solder. Therefore, to reduce the wetting angle, an Sn solder alloyed with active Ti element was used. At a soldering temperature of 860°C and 15 min soldering time, the wetting angle on SiO2 ceramics was 30°, on silicon 42°, and on graphite 52°. All these wetting angles are below 90° and are acceptable for soldering. It has been shown that the bond in all joined materials (SiO2, Si, and C was of a diffusion character. New intermetallic products were formed on the boundary with nonmetal, thus allowing bond formation. The shear strength of SiO2 ceramics attained an average value of 17 MPa.

  20. Mechanism of Solder Joint Cracks in Anisotropic Conductive Films Bonding and Solutions: Delaying Hot-Bar Lift-Up Time and Adding Silica Fillers

    Directory of Open Access Journals (Sweden)

    Shuye Zhang

    2018-01-01

    Full Text Available Micron sizes solder metallurgical joints have been applied in a thin film application of anisotropic conductive film and benefited three general advantages, such as lower joint resistance, higher power handling capability, and reliability, when compared with pressure based contact of metal conductor balls. Recently, flex-on-board interconnection has become more and more popular for mobile electronic applications. However, crack formation of the solder joint crack was occurred at low temperature curable acrylic polymer resins after bonding processes. In this study, the mechanism of SnBi58 solder joint crack at low temperature curable acrylic adhesive was investigated. In addition, SnBi58 solder joint cracks can be significantly removed by increasing the storage modulus of adhesives instead of coefficient of thermal expansion. The first approach of reducing the amount of polymer rebound can be achieved by using an ultrasonic bonding method to maintain a bonding pressure on the SnBi58 solder joints cooling to room temperature. The second approach is to increase storage modulus of adhesives by adding silica filler into acrylic polymer resins to prevent the solder joint from cracking. Finally, excellent acrylic based SnBi58 solder joints reliability were obtained after 1000 cycles thermal cycling test.

  1. Development of new candidate gene and EST-based molecular markers for Gossypium species

    Science.gov (United States)

    New source of molecular markers accelerates the efforts in improving cotton fiber traits and aid in developing high-density integrated genetic maps. We developed new markers based on candidate genes and G. arboreum expressed sequence tag (EST) sequences, and validated them through amplification, ge...

  2. An inventory of continental U.S. terrestrial candidate ecological restoration areas based on landscape context

    Science.gov (United States)

    Landscape context is an important factor in restoration ecology, but the use of landscape context for site prioritization has not been as fully developed. We used morphological image processing to identify candidate ecological restoration areas based on their proximity to existin...

  3. Finding gene regulatory network candidates using the gene expression knowledge base.

    Science.gov (United States)

    Venkatesan, Aravind; Tripathi, Sushil; Sanz de Galdeano, Alejandro; Blondé, Ward; Lægreid, Astrid; Mironov, Vladimir; Kuiper, Martin

    2014-12-10

    Network-based approaches for the analysis of large-scale genomics data have become well established. Biological networks provide a knowledge scaffold against which the patterns and dynamics of 'omics' data can be interpreted. The background information required for the construction of such networks is often dispersed across a multitude of knowledge bases in a variety of formats. The seamless integration of this information is one of the main challenges in bioinformatics. The Semantic Web offers powerful technologies for the assembly of integrated knowledge bases that are computationally comprehensible, thereby providing a potentially powerful resource for constructing biological networks and network-based analysis. We have developed the Gene eXpression Knowledge Base (GeXKB), a semantic web technology based resource that contains integrated knowledge about gene expression regulation. To affirm the utility of GeXKB we demonstrate how this resource can be exploited for the identification of candidate regulatory network proteins. We present four use cases that were designed from a biological perspective in order to find candidate members relevant for the gastrin hormone signaling network model. We show how a combination of specific query definitions and additional selection criteria derived from gene expression data and prior knowledge concerning candidate proteins can be used to retrieve a set of proteins that constitute valid candidates for regulatory network extensions. Semantic web technologies provide the means for processing and integrating various heterogeneous information sources. The GeXKB offers biologists such an integrated knowledge resource, allowing them to address complex biological questions pertaining to gene expression. This work illustrates how GeXKB can be used in combination with gene expression results and literature information to identify new potential candidates that may be considered for extending a gene regulatory network.

  4. Effect of Metal Bond-Pad Configurations on the Solder Microstructure Development of Flip-Chip Solder Joints

    Science.gov (United States)

    Hu, Y. J.; Hsu, Y. C.; Huang, T. S.; Lu, C. T.; Wu, Albert T.; Liu, C. Y.

    2014-01-01

    Various microstructural zones were observed in the solidified solder of flip-chip solder joints with three metal bond-pad configurations (Cu/Sn/Cu, Ni/Sn/Cu, and Cu/Sn/Ni). The developed microstructures of the solidified flip-chip solder joints were strongly related to the associated metal bond pad. A hypoeutectic microstructure always developed near the Ni bond pad, and a eutectic or hypereutectic microstructure formed near the Cu pad. The effect of the metal bond pads on the solder microstructure alters the Cu solubility in the molten solder. The Cu content (solubility) in the molten Sn(Cu) solder eventually leads to the development of particular microstructures. In addition to the effect of the associated metal bond pads, the developed microstructure of the flip-chip solder joint depends on the configuration of the metal bond pads. A hypereutectic microstructure formed near the bottom Cu pad, and a eutectic microstructure formed near the top Cu pad. Directional cooling in the flip-chip solder joint during the solidification process causes the effects of the metal bond-pad configuration. Directional cooling causes the Cu content to vary in the liquid Sn(Cu) phase, resulting in the formation of distinct microstructural zones in the developed microstructure of the flip-chip solder joint.

  5. Reliability Study of Solder Paste Alloy for the Improvement of Solder Joint at Surface Mount Fine-Pitch Components

    Directory of Open Access Journals (Sweden)

    Mohd Nizam Ab. Rahman

    2014-12-01

    Full Text Available The significant increase in metal costs has forced the electronics industry to provide new materials and methods to reduce costs, while maintaining customers’ high-quality expectations. This paper considers the problem of most electronic industries in reducing costly materials, by introducing a solder paste with alloy composition tin 98.3%, silver 0.3%, and copper 0.7%, used for the construction of the surface mount fine-pitch component on a Printing Wiring Board (PWB. The reliability of the solder joint between electronic components and PWB is evaluated through the dynamic characteristic test, thermal shock test, and Taguchi method after the printing process. After experimenting with the dynamic characteristic test and thermal shock test with 20 boards, the solder paste was still able to provide a high-quality solder joint. In particular, the Taguchi method is used to determine the optimal control parameters and noise factors of the Solder Printer (SP machine, that affects solder volume and solder height. The control parameters include table separation distance, squeegee speed, squeegee pressure, and table speed of the SP machine. The result shows that the most significant parameter for the solder volume is squeegee pressure (2.0 mm, and the solder height is the table speed of the SP machine (2.5 mm/s.

  6. Combined Thermodynamic-Kinetic Analysis of the Interfacial Reactions between Ni Metallization and Various Lead-Free Solders

    Directory of Open Access Journals (Sweden)

    Tomi Laurila

    2009-11-01

    Full Text Available In this paper we will demonstrate how a thermodynamic-kinetic method can be utilized to rationalize a wide range of interfacial phenomena between Sn-based lead-free solders and Ni metallizations. First, the effect of P on the interfacial reactions, and thus on the reliability, between Sn-based solders and electroless Ni/immersion Au (ENIG metallizations, will be discussed. Next, the effect of small amounts of Cu in Sn-based solders on the intermetallic compound (IMC, which forms first on top of Ni metallization, will be covered. With the help of thermodynamic arguments a so called critical Cu concentration for the formation of (Cu,Ni6Sn5 can be determined as a function of temperature. Then the important phenomenon of redeposition of (Au,NiSn4 layer on top of Ni3Sn4 IMC will be discussed in detail. The reasons leading to this behaviour will be rationalized with the help of thermodynamic information and an explanation of why this phenomenon does not occur when an appropriate amount of Cu is present in the soldering system will be given. Finally, interfacial reaction issues related to low temperature Sn-Zn and Sn-Bi based solders and Ni metallization will be discussed.

  7. Microstructural and mechanical properties analysis of extruded Sn–0.7Cu solder alloy

    Directory of Open Access Journals (Sweden)

    Abdoul-Aziz Bogno

    2015-01-01

    Full Text Available The properties and performance of lead-free solder alloys such as fluidity and wettability are defined by the alloy composition and solidification microstructure. Rapid solidification of metallic alloys is known to result in refined microstructures with reduced microsegregation and improved mechanical properties of the final products as compared to normal castings. The rapidly solidified Sn-based solders by melt spinning were shown to be suitable for soldering with low temperature and short soldering duration. In the present study, rapidly solidified Sn–0.7 wt.%Cu droplets generated by impulse atomization (IA were achieved as well as directional solidification under transient conditions at lower cooling rate. This paper reports on a comparative study of the rapidly solidified and the directionally solidified samples. Different but complementary characterization techniques were used to fully analyze the solidification microstructures of the samples obtained under the two cooling regimes. These include X-ray diffractometry (XRD and scanning electron microscopy (SEM. In order to compare the tensile strength and elongation to fracture of the directionally solidified ingot and strip castings with the atomized droplet, compaction and extrusion of the latter were carried out. It was shown that more balanced and superior tensile mechanical properties are available for the hot extruded samples from compacted as-atomized Sn–0.7 wt.%Cu droplets. Further, elongation-to-fracture was 2–3× higher than that obtained for the directionally solidified samples.

  8. Design and Experiment of a Solder Paste Jetting System Driven by a Piezoelectric Stack

    Directory of Open Access Journals (Sweden)

    Shoudong Gu

    2016-06-01

    Full Text Available To compensate for the insufficiency and instability of solder paste dispensing and printing that are used in the SMT (Surface Mount Technology production process, a noncontact solder paste jetting system driven by a piezoelectric stack based on the principle of the nozzle-needle-system is introduced in this paper, in which a miniscule gap exists between the nozzle and needle during the jetting process. Here, the critical jet ejection velocity is discussed through theoretical analysis. The relations between ejection velocity and needle structure, needle velocity, and nozzle diameter were obtained by FLUENT software. Then, the prototype of the solder paste jetting system was fabricated, and the performance was verified by experiments. The effects of the gap between nozzle and needle, the driving voltage, and the nozzle diameter on the jetting performance and droplet diameter were obtained. Solder paste droplets 0.85 mm in diameter were produced when the gap between the nozzle and needle was adjusted to 10 μm, the driving voltage to 80 V, the nozzle diameter to 0.1 mm, and the variation of the droplet diameter was within ±3%.

  9. Performance on the Athletic Training Certification Examination Based on Candidates' Routes to Eligibility

    OpenAIRE

    Starkey, Chad; Henderson, James

    1995-01-01

    The National Athletic Trainers' Association Board of Certification initiated a task force whose purpose is to evaluate the criteria that determine eligibility for the athletic training certification examination. Candidates may qualify to take the examination through one of two routes: an academic-based curriculum program or the practical education, work-experience-based internship route. The certification examination is comprised of three sections: a written examination, a written simulation,...

  10. Soldering of copper-clad niobium--titanium superconductor composite

    International Nuclear Information System (INIS)

    Moorhead, A.J.; Woodhouse, J.J.; Easton, D.S.

    1977-04-01

    When superconductivity is applied to various electrical devices, the joining of the superconducting material and the performance of the joints are generally crucial to the successful operation of the system. Although many techniques are being considered for joining composite superconductors, soldering is the most common. We determined the wetting and flow behavior of various solder and flux combinations on a copper-clad Nb-Ti composite, developed equipment and techniques for soldering and inspection of lap joints, and determined the shear strength of joints at temperatures down to -269 0 C (4 0 K). We studied 15 solders and 17 commercial and experimental fluxes in the wettability and flow tests. A resistance unit was built for soldering test specimens. A series of samples soldered with 80 Pb-20 Sn, 83 Pb-15 Sn-2 Sb, 97.5 Pb-1.5 Ag-1 Sn, 80 In-15 Pb-5 Ag, or 25 In-37.5 Pb-37.5 Sn (wt percent) was inspected by three nondestructive techniques. Through-transmission ultrasound gave the best correlation with nonbond areas revealed in peel tests. Single-lap shear specimens soldered with 97.5 Pb-1.5 Ag-1 Sn had the highest strength (10.44 ksi, 72 MPa) and total elongation (0.074 in., 1.88 mm) at -269 0 C (4 0 K) of four solders tested

  11. Characterization of Solder Joint Reliability Using Cyclic Mechanical Fatigue Testing

    Science.gov (United States)

    Kim, Choong-Un; Bang, Woong-Ho; Xu, Huili; Lee, Tae-Kyu

    2013-10-01

    This article summarizes the mechanics of two mechanical fatigue methods, cyclic bending fatigue and shear fatigue, in inducing failure in solder joints in package assemblies, and it presents the characteristics of fatigue failures resulting from these methods using example cases of Sn-Pb eutectic and Sn-rich Pb-free solder alloys. Numerical simulation suggests that both testing configurations induce fatigue failure by the crack-opening mode. In the case of bending fatigue, the strain induced by the bending displacement is found to be sensitive to chip geometry, and it induces fatigue cracks mainly at the solder matrix adjacent to the printed circuit board interface. In case of shear fatigue, the failure location is firmly fixed at the solder neck, created by solder mask, where an abrupt change in the solder geometry occurs. Both methods conclude that the Coffin-Manson model is the most appropriate model for the isothermal mechanical fatigue of solder alloys. An analysis of fatigue characteristics using the frame of the Coffin-Manson model produces several insightful results, such as the reason why Pb-free alloys show higher fatigue resistance than Sn-Pb alloys even if they are generally more brittle. Our analysis suggests that it is related to higher work hardening. All these results indicate that mechanical fatigue can be an extremely useful method for fast screening of defective package structures and also in gaining a better understanding of fatigue failure mechanism and prediction of reliability in solder joints.

  12. Solder joint reliability in solid-state lighting applications

    NARCIS (Netherlands)

    Kloosterman, J.; Kregting, R.; Erinc, M.; Driel, W.D. van

    2013-01-01

    Lighting is an advancing phenomenon both on the technology and on the market level due to the rapid development of the solid-state lighting technology. The interest in solder joint reliability has increased by the introduction of the so-called high brightness leadless type of packages. Solder joint

  13. Dry soldering with hot filament produced atomic hydrogen

    Science.gov (United States)

    Panitz, J.K.G.; Jellison, J.L.; Staley, D.J.

    1995-04-25

    A system is disclosed for chemically transforming metal surface oxides to metal that is especially, but not exclusively, suitable for preparing metal surfaces for dry soldering and solder reflow processes. The system employs one or more hot, refractory metal filaments, grids or surfaces to thermally dissociate molecular species in a low pressure of working gas such as a hydrogen-containing gas to produce reactive species in a reactive plasma that can chemically reduce metal oxides and form volatile compounds that are removed in the working gas flow. Dry soldering and solder reflow processes are especially applicable to the manufacture of printed circuit boards, semiconductor chip lead attachment and packaging multichip modules. The system can be retrofitted onto existing metal treatment ovens, furnaces, welding systems and wave soldering system designs. 1 fig.

  14. Interfacial behavior and mechanical properties of aluminum foam joint fabricated by surface self-abrasion fluxless soldering

    Energy Technology Data Exchange (ETDEWEB)

    Wan, Long, E-mail: wanlong178@163.com; Huang, Yongxian; Huang, Tifang; Lv, Zongliang; Feng, Jicai

    2016-06-25

    Fluxless soldering with surface self-abrasion has been developed for joining aluminum foams with metallic bonding. The effect of the self-abrasion on the wettability of molten solder alloy and mechanical properties is determined by microstructural observation, tension and compression tests. No apparent macroscopic deformation and collapse of foam structure are observed adjacent to the joint interface. The average tensile strength of the joints is about 14% higher than that of aluminum foam, and the compressive strength can reach 200% of that of aluminum foam. The deformation mechanisms and energy absorbing characteristics of aluminum foam and the joint are investigated. The aluminum foam joint fails primarily by bending, crushing, and compaction of cell walls and cracking of the solder seam. The interdiffusion process is explained based on thermodynamic equations. - Highlights: • Fluxless soldering with surface self-abrasion is developed for joining aluminum foam. • Excellent metallic bonding has been informed between foam cores. • The aluminum foam joint has excellent mechanical properties. • The joining mechanism of solder alloy and aluminum foam is explained.

  15. CO2 temperature-controlled laser soldering of pig trachea incisions in vitro using flexible albumin bands

    Science.gov (United States)

    Sharvit, Dan; Vasilyev, Tamar; Vasserman, Irena; Simhon, David; Kariv, Naam; DeRowe, Ari; Katzir, Abraham

    2005-04-01

    Resection of a segment of the trachea is a procedure applied for the removal of cervical tumors invading the trachea, or for the treatment of severe tracheal stenosis. The current method of anastomosis is based on multiple sutures. The main drawbacks of this method are: 1) A long procedure time, 2) An air leakage, and 3) An inflammatory response to the sutures. In this study we evaluated the feasibility and effectiveness of the use of temperature controlled CO2 laser soldering of incisions in pig tracheas in vitro. A transverse incision was made in a separated pig trachea. A flexible albumin band was prepared and was laser soldered with albumin solder to the outer surface of the trachea, covering the incision. The soldered trachea ends were sealed and the burst pressure was measured. In a series of in vitro experiments, the mean burst pressure was found to be 230 mm Hg. These preliminary results demonstrated that laser soldering using a flexible albumin band may be a useful method for sealing an incision in the trachea.

  16. Vibration characteristics of aluminum surface subjected to ultrasonic waves and their effect on wetting behavior of solder droplets.

    Science.gov (United States)

    Ma, Lin; Xu, Zhiwu; Zheng, Kun; Yan, Jiuchun; Yang, Shiqin

    2014-03-01

    The vibration characteristics of an aluminum surface subjected to ultrasonic waves were investigated with a combination of numerical simulation and experimental testing. The wetting behavior of solder droplets on the vibrating aluminum surface was also examined. The results show that the vibration pattern of the aluminum surface is inhomogeneous. The amplitude of the aluminum surface exceeds the excitation amplitude in some zones, while the amplitude decreases nearly to zero in other zones. The distribution of the zero-amplitude zones is much less dependent on the strength of the vibration than on the location of the vibration source. The surface of the liquid solder vibrates at an ultrasonic frequency that is higher than the vibration source, and the amplitude of the liquid solder is almost twice that of the aluminum surface. The vibration of the surface of the base metal (liquid solder) correlates with the oxide film removal effect. Significant removal of the oxide film can be achieved within 2s when the amplitude of the aluminum surface is higher than 5.4 μm or when the amplitude of the liquid solder surface is higher than 10.2 μm. Copyright © 2013 Elsevier B.V. All rights reserved.

  17. Development of Sn-Ag-Cu-X Solders for Electronic Assembly by Micro-Alloying with Al

    Science.gov (United States)

    Boesenberg, Adam J.; Anderson, Iver E.; Harringa, Joel L.

    2012-07-01

    Of Pb-free solder choices, an array of solder alloys based on the Sn-Ag-Cu (SAC) ternary eutectic ( T eut = 217°C) composition have emerged with potential for broad use, including ball grid array (BGA) joints that cool slowly. This work investigated minor substitutional additions of Al (0.05Al), but the suppression effect faded for >0.20Al. Undercooling suppression did not correlate specifically with blade suppression since it became significant at 0.10Al and increased continuously with greater Al to 0.25Al. Surprisingly, an intermediate range of Al content (0.10 wt.% to 0.20 wt.% Al) promoted formation of significant populations of 2- μm to 5- μm faceted Cu-Al particles, identified as Cu33Al17, that clustered at the top of the solder joint matrix and exhibited extraordinary hardness. Clustering of Cu33Al17 was attributed to its buoyancy, from a lower density than Sn liquid, and its early position in the nucleation sequence within the solder matrix, permitting unrestricted migration to the top interface. Joint microstructures and implications for the full nucleation sequence for these SAC + Al solder joints are discussed, along with possible benefits from the clustered particles for improved thermal cycling resistance.

  18. Characterization of lead-free solders for electronic packaging

    Science.gov (United States)

    Ma, Hongtao

    The characterization of lead-free solders, especially after isothermal aging, is very important in order to accurately predict the reliability of solder joints. However, due to lack of experimental testing standards and the high homologous temperature of solder alloys (Th > 0.5T m even at room temperature), there are very large discrepancies in both the tensile and creep properties provided in current databases for both lead-free and Sn-Pb solder alloys. In this research, mechanical measurements of isothermal aging effects and the resulting changes in the materials behavior of lead-free solders were performed. A novel specimen preparation procedure was developed where the solder uniaxial test specimens are formed in high precision rectangular cross-section glass tubes using a vacuum suction process. Using specimens fabricated with the developed procedure, isothermal aging effects and viscoplastic material behavior evolution have been characterized for 95.5Sn-4.0Ag-0.5Cu (SAC405) and 96.5Sn-3.0Ag-0.5Cu (SAC305) lead-free solders, which are commonly used as the solder ball alloy in lead-free BGAs and other components. Analogous tests were performed with 63Sn-37Pb eutectic solder samples for comparison purposes. Up to 40% reduction in tensile strength was observed for water quenched specimens after two months of aging at room temperature. Creep deformation also increased dramatically with increasing aging durations. Microstructural changes during room temperature aging were also observed and recorded for the solder alloys and correlated with the observed mechanical behavior changes. Aging effects at elevated temperatures for up to 6 months were also investigated. Thermal aging caused significant tensile strength loss and deterioration of creep deformation. The thermal aging results also showed that after an initial tensile strength drop, the Sn-Pb eutectic solder reached a relatively stable stage after 200 hours of aging. However, for SAC alloy, both the tensile and

  19. Gene- and evidence-based candidate gene selection for schizophrenia and gene feature analysis.

    Science.gov (United States)

    Sun, Jingchun; Han, Leng; Zhao, Zhongming

    2010-01-01

    Schizophrenia is a chronic psychiatric disorder that affects about 1% of the population globally. A tremendous amount of effort has been expended in the past decade, including more than 2400 association studies, to identify genes influencing susceptibility to the disorder. However, few genes or markers have been reliably replicated. The wealth of this information calls for an integration of gene association data, evidence-based gene ranking, and follow-up replication in large sample. The objective of this study is to develop and evaluate evidence-based gene ranking methods and to examine the features of top-ranking candidate genes for schizophrenia. We proposed a gene-based approach for selecting and prioritizing candidate genes by combining odds ratios (ORs) of multiple markers in each association study and then combining ORs in multiple studies of a gene. We named it combination-combination OR method (CCOR). CCOR is similar to our recently published method, which first selects the largest OR of the markers in each study and then combines these ORs in multiple studies (i.e., selection-combination OR method, SCOR), but differs in selecting representative OR in each study. Features of top-ranking genes were examined by Gene Ontology terms and gene expression in tissues. Our evaluation suggested that the SCOR method overall outperforms the CCOR method. Using the SCOR, a list of 75 top-ranking genes was selected for schizophrenia candidate genes (SZGenes). We found that SZGenes had strong correlation with neuro-related functional terms and were highly expressed in brain-related tissues. The scientific landscape for schizophrenia genetics and other complex disease studies is expected to change dramatically in the next a few years, thus, the gene-based combined OR method is useful in candidate gene selection for follow-up association studies and in further artificial intelligence in medicine. This method for prioritization of candidate genes can be applied to other

  20. Analysis of the Thermal Stress for Combined Electrode of Soldered Crystalline Silicon Solar Cells under Temperature Field

    Directory of Open Access Journals (Sweden)

    He Wang

    2016-01-01

    Full Text Available Based on the theory of material mechanics and thermal stress analysis, the stress distribution of combined electrode for crystalline silicon solar module was studied for the first time. The shear stress and normal stress distribution of soldered structure for crystalline silicon solar cells under the thermal field were discussed. And the results show that the stress distribution is not simply linear relationship as some results found. But there is a stress concentration at the edge, which was considered as the true reason that caused microcracks at the edge of soldered solar cells. The conclusions we got in this paper provide a theoretical basis for deceasing the breakage rates of soldered crystalline silicon solar cells and improving the reliability of crystalline silicon solar modules.

  1. Fatigue and thermal fatigue of Pb-Sn solder joints

    International Nuclear Information System (INIS)

    Frear, D.; Grivas, D.; McCormack, M.; Tribula, D.; Morris, J.W. Jr.

    1987-01-01

    This paper presents a fundamental investigation of the fatigue and thermal fatigue characteristics, with an emphasis on the microstructural development during fatigue, of Sn-Pb solder joints. Fatigue tests were performed in simple shear on both 60Sn-40Pb and 5Sn-95Pb solder joints. Isothermal fatigue tests show increasing fatigue life of 60Sn-40Pb solder joints with decreasing strain and temperature. In contrast, such behavior was not observed in the isothermal fatigue of 5Sn-95Pb solder joints. Thermal fatigue results on 60Sn-40Pb solder cycled between -55 0 C and 125 0 C show that a coarsened region develops in the center of the joint. Both Pb-rich and Sn-rich phases coarsen, and cracks form within these coarsened regions. The failure mode 60Sn-40Pb solder joints in thermal and isothermal fatigue is similar: cracks form intergranularly through the Sn-rich phase or along Sn/Pb interphase boundaries. Extensive cracking is found throughout the 5Sn-95Pb joint for both thermal and isothermal fatigue. In thermal fatigue the 5Sn-95Pb solder joints failed after fewer cycles than 60Sn-40Pb

  2. Candidate Smoke Region Segmentation of Fire Video Based on Rough Set Theory

    Directory of Open Access Journals (Sweden)

    Yaqin Zhao

    2015-01-01

    Full Text Available Candidate smoke region segmentation is the key link of smoke video detection; an effective and prompt method of candidate smoke region segmentation plays a significant role in a smoke recognition system. However, the interference of heavy fog and smoke-color moving objects greatly degrades the recognition accuracy. In this paper, a novel method of candidate smoke region segmentation based on rough set theory is presented. First, Kalman filtering is used to update video background in order to exclude the interference of static smoke-color objects, such as blue sky. Second, in RGB color space smoke regions are segmented by defining the upper approximation, lower approximation, and roughness of smoke-color distribution. Finally, in HSV color space small smoke regions are merged by the definition of equivalence relation so as to distinguish smoke images from heavy fog images in terms of V component value variety from center to edge of smoke region. The experimental results on smoke region segmentation demonstrated the effectiveness and usefulness of the proposed scheme.

  3. Investigating Pathways from the Earth Science Knowledge Base to Candidate Solutions

    Science.gov (United States)

    Anderson, D. J.; Johnson, E.; Mita, D.; Dabbiru, L.; Katragadda, S.; Lewis, D.; O'Hara, C.

    2007-12-01

    A principle objective of the NASA Applied Sciences Program is to support the transition of scientific research results into decisions which benefit society. One of the Solutions Network activities supporting this goal is the generation of Candidate Solutions derived from NASA Earth Science research results that have the potential to enhance future operational systems for societal benefit. In short, the program seeks to fill gaps between Earth Science results and operational needs. The Earth Science Knowledge Base (ESKB) is being developed to provide connectivity and deliver content for the research information needs of the NASA Applied Science Program and related scientific communities of practice. Data has been collected which will permit users to identify and analyze the current network of interactions between organizations within the community of practice, harvest research results fixed to those interactions, examine the individual components of that research, and assist in developing strategies for furthering research. The ESKB will include information about organizations that conduct NASA-funded Earth Science research, NASA research solicitations, principal investigators, research publications and other project reports, publication authors, inter-agency agreements like memoranda-of-understanding, and NASA assets, models, decision support tools, and data products employed in the course of or developed as a part of the research. The generation of candidate solutions is the first step in developing rigorously tested applications for operational use from the normal yet chaotic process of natural discovery. While the process of 'idea generation' cannot be mechanized, the ESKB serves to provide a resource for testing theories about advancing research streams into the operational realm. Formulation Reports are the documents which outline a Candidate Solution. The reports outline the essential elements, most of which are detailed in the ESKB, which must be analyzed

  4. Manipulation and soldering of carbon nanotubes using atomic force microscope

    International Nuclear Information System (INIS)

    Kashiwase, Yuta; Ikeda, Takayuki; Oya, Takahide; Ogino, Toshio

    2008-01-01

    Manipulation of carbon nanotubes (CNTs) by an atomic force microscope (AFM) and soldering of CNTs using Fe oxide nanoparticles are described. We succeeded to separate a CNT bundle into two CNTs or CNT bundles, to move the separated CNT to a desirable position, and to bind it to another bundle. For the accurate manipulation, load of the AFM cantilever and frequency of the scan were carefully selected. We soldered two CNTs using an Fe oxide nanoparticle prepared from a ferritin molecule. The adhesion forces between the soldered CNTs were examined by an AFM and it was found that the CNTs were bound, though the binding force was not strong

  5. Solder extrusion pressure bonding process and bonded products produced thereby

    Science.gov (United States)

    Beavis, Leonard C.; Karnowsky, Maurice M.; Yost, Frederick G.

    1992-01-01

    Production of soldered joints which are highly reliable and capable of surviving 10,000 thermal cycles between about -40.degree. C. and 110.degree. C. Process involves interposing a thin layer of a metal solder composition between the metal surfaces of members to be bonded and applying heat and up to about 1000 psi compression pressure to the superposed members, in the presence of a reducing atmosphere, to extrude the major amount of the solder composition, contaminants including fluxing gases and air, from between the members being bonded, to form a very thin, strong intermetallic bonding layer having a thermal expansion tolerant with that of the bonded members.

  6. Massive spalling of Cu-Zn and Cu-Al intermetallic compounds at the interface between solders and Cu substrate during liquid state reaction

    Science.gov (United States)

    Kotadia, H. R.; Panneerselvam, A.; Mokhtari, O.; Green, M. A.; Mannan, S. H.

    2012-04-01

    The interfacial intermetallic compound (IMC) formation between Cu substrate and Sn-3.8Ag-0.7Cu-X (wt.%) solder alloys has been studied, where X consists of 0-5% Zn or 0-2% Al. The study has focused on the effect of solder volume as well as the Zn or Al concentration. With low solder volume, when the Zn and Al concentrations in the solder are also low, the initial Cu-Zn and Al-Cu IMC layers, which form at the solder/substrate interface, are not stable and spall off, displaced by a Cu6Sn5 IMC layer. As the total Zn or Al content in the system increases by increasing solder volume, stable CuZn or Al2Cu IMCs form on the substrate and are not displaced. Increasing concentration of Zn has a similar effect of stabilizing the Cu-Zn IMC layer and also of forming a stable Cu5Zn8 layer, but increasing Al concentration alone does not prevent spalling of Al2Cu. These results are explained using a combination of thermodynamic- and kinetics-based arguments.

  7. Global Prioritization of Disease Candidate Metabolites Based on a Multi-omics Composite Network

    Science.gov (United States)

    Yao, Qianlan; Xu, Yanjun; Yang, Haixiu; Shang, Desi; Zhang, Chunlong; Zhang, Yunpeng; Sun, Zeguo; Shi, Xinrui; Feng, Li; Han, Junwei; Su, Fei; Li, Chunquan; Li, Xia

    2015-01-01

    The identification of disease-related metabolites is important for a better understanding of metabolite pathological processes in order to improve human medicine. Metabolites, which are the terminal products of cellular regulatory process, can be affected by multi-omic processes. In this work, we propose a powerful method, MetPriCNet, to predict and prioritize disease candidate metabolites based on integrated multi-omics information. MetPriCNet prioritized candidate metabolites based on their global distance similarity with seed nodes in a composite network, which integrated multi-omics information from the genome, phenome, metabolome and interactome. After performing cross-validation on 87 phenotypes with a total of 602 metabolites, MetPriCNet achieved a high AUC value of up to 0.918. We also assessed the performance of MetPriCNet on 18 disease classes and found that 4 disease classes achieved an AUC value over 0.95. Notably, MetPriCNet can also predict disease metabolites without known disease metabolite knowledge. Some new high-risk metabolites of breast cancer were predicted, although there is a lack of known disease metabolite information. A predicted disease metabolic landscape was constructed and analyzed based on the results of MetPriCNet for 87 phenotypes to help us understand the genetic and metabolic mechanism of disease from a global view. PMID:26598063

  8. Immunogenicity of multi-epitope-based vaccine candidates administered with the adjuvant Gp96 against rabies.

    Science.gov (United States)

    Niu, Yange; Liu, Ye; Yang, Limin; Qu, Hongren; Zhao, Jingyi; Hu, Rongliang; Li, Jing; Liu, Wenjun

    2016-04-01

    Rabies, a zoonotic disease, causes > 55,000 human deaths globally and results in at least 500 million dollars in losses every year. The currently available rabies vaccines are mainly inactivated and attenuated vaccines, which have been linked with clinical diseases in animals. Thus, a rabies vaccine with high safety and efficacy is urgently needed. Peptide vaccines are known for their low cost, simple production procedures and high safety. Therefore, in this study, we examined the efficacy of multi-epitope-based vaccine candidates against rabies virus. The ability of various peptides to induce epitope-specific responses was examined, and the two peptides that possessed the highest antigenicity and conservation, i.e., AR16 and hPAB, were coated with adjuvant canine-Gp96 and used to prepare vaccines. The peptides were prepared as an emulsion of oil in water (O/W) to create three batches of bivalent vaccine products. The vaccine candidates possessed high safety. Virus neutralizing antibodies were detected on the day 14 after the first immunization in mice and beagles, reaching 5-6 IU/mL in mice and 7-9 IU/mL in beagles by day 28. The protective efficacy of the vaccine candidates was about 70%-80% in mice challenged by a virulent strain of rabies virus. Thus, a novel multi-epitope-based rabies vaccine with Gp96 as an adjuvant was developed and validated in mice and dogs. Our results suggest that synthetic peptides hold promise for the development of novel vaccines against rabies.

  9. Relative effect of solder flux chemistry on the humidity related failures in electronics

    DEFF Research Database (Denmark)

    Verdingovas, Vadimas; Jellesen, Morten Stendahl; Ambat, Rajan

    2015-01-01

    was studied by quartz crystal microbalance, while corrosive effects were studied by leakage current and impedance measurements on standard test boards. The measurements were performed as a function of relative humidity (RH) in the range from 60 to ~99 per cent at 25°C. The corrosiveness of solder flux systems...... of printed circuit boards under humid conditions. Originality/value - The classification of solder flux systems according to IPC J-STD-004 standard does not specify the WOAs in the flux; however, ranking of the flux systems based on the hygroscopic property of activators would be useful information when...... selecting no-clean flux systems for electronics with applications in humid conditions....

  10. Method of defence of solder surface from oxidization

    Directory of Open Access Journals (Sweden)

    Kurmashev Sh. D.

    2010-02-01

    Full Text Available Compositions are developed for defence of fusion solder from oxidization on the basis of mixture of glycerin, urea and powders of refractory oxides, carbides (Al2O3, TiO2, SIC, graphite. The offered compositions can be used for defence of fusion of solder from oxidization in the process of soludering and tinning of explorers, and also electric conclusions of elements of radio electronic apparatus by the method of immersion in stationary baths.

  11. Laser Soldering of Rat Skin Using a Controlled Feedback System

    Directory of Open Access Journals (Sweden)

    Mohammad Sadegh Nourbakhsh

    2009-03-01

    Full Text Available Introduction: Laser tissue soldering using albumin and indocyanine green dye (ICG is an effective technique utilized in various surgical procedures. The purpose of this study was to perform laser soldering of rat skin under a feedback control system and compare the results with those obtained using standard sutures. Material and Methods: Skin incisions were made over eight rats’ dorsa, which were subsequently closed using different wound closure interventions in two groups: (a using a temperature controlled infrared detector or (b by suture. Tensile strengths were measured at 2, 5, 7 and 10 days post-incision. Histological examination was performed at the time of sacrifice. Results: Tensile strength results showed that during the initial days following the incisions, the tensile strengths of the sutured samples were greater than the laser samples. However, 10 days after the incisions, the tensile strengths of the laser soldered incisions were higher than the sutured cuts. Histopathological examination showed a preferred wound healing response in the soldered skin compared with the control samples. The healing indices of the laser soldered repairs (426 were significantly better than the control samples (340.5. Conclusion: Tissue feedback control of temperature and optical changes in laser soldering of skin leads to a higher tensile strength and better histological results and hence this method may be considered as an alternative to standard suturing.

  12. ReCGiP, a database of reproduction candidate genes in pigs based on bibliomics.

    Science.gov (United States)

    Yang, Lun; Zhang, Xiangzhe; Chen, Jian; Wang, Qishan; Wang, Lishan; Jiang, Yue; Pan, Yuchun

    2010-08-14

    Reproduction in pigs is one of the most economically important traits. To improve the reproductive performances, numerous studies have focused on the identification of candidate genes. However, it is hard for one to read all literatures thoroughly to get information. So we have developed a database providing candidate genes for reproductive researches in pig by mining and processing existing biological literatures in human and pigs, named as ReCGiP. Based on text-mining and comparative genomics, ReCGiP presents diverse information of reproduction-relevant genes in human and pig. The genes were sorted by the degree of relevance with the reproduction topics and were visualized in a gene's co-occurrence network where two genes were connected if they were co-cited in a PubMed abstract. The 'hub' genes which had more 'neighbors' were thought to be have more important functions and could be identified by the user in their web browser. In addition, ReCGiP provided integrated GO annotation, OMIM and biological pathway information collected from the Internet. Both pig and human gene information can be found in the database, which is now available. ReCGiP is a unique database providing information on reproduction related genes for pig. It can be used in the area of the molecular genetics, the genetic linkage map, and the breeding of the pig and other livestock. Moreover, it can be used as a reference for human reproduction research.

  13. Life cycle assessment (LCA of lead-free solders from the environmental protection aspect

    Directory of Open Access Journals (Sweden)

    Mitovski Aleksandra M.

    2009-01-01

    Full Text Available Life-cycle assessment (LCA presents a relatively new approach, which allows comprehensive environmental consequences analysis of a product system over its entire life. This analysis is increasingly being used in the industry, as a tool for investigation of the influence of the product system on the environment, and serves as a protection and prevention tool in ecological management. This method is used to predict possible influences of a certain material to the environment through different development stages of the material. In LCA, the product systems are evaluated on a functionally equivalent basis, which, in this case, was 1000 cubic centimeters of an alloy. Two of the LCA phases, life-cycle inventory (LCA and life-cycle impact assessment (LCIA, are needed to calculate the environmental impacts. Methodology of LCIA applied in this analysis aligns every input and output influence into 16 different categories, divided in two subcategories. The life-cycle assessment reaserch review of the leadfree solders Sn-Cu, SAC (Sn-Ag-Cu, BSA (Bi-Sb-Ag and SABC (Sn-Ag-Bi-Cu respectively, is given in this paper, from the environmental protection aspect starting from production, through application process and finally, reclamation at the end-of-life, i.e. recycling. There are several opportunities for reducing the overall environmental and human health impacts of solder used in electronics manufacturing based on the results of the LCA, such as: using secondary metals reclaimed through post-industrial recycling; power consumption reducing by replacing older, less efficient reflow assembly equipment, or by optimizing the current equipment to perform at the elevated temperatures required for lead-free soldering, etc. The LCA analysis was done comparatively in relation to widely used Sn-Pb solder material. Additionally, the impact factors of material consumption, energy use, water and air reserves, human health and ecotoxicity have been ALSO considered including

  14. Recrystallization and Precipitate Coarsening in Pb-Free Solder Joints During Thermomechanical Fatigue

    Science.gov (United States)

    Yin, Liang; Wentlent, Luke; Yang, Linlin; Arfaei, Babak; Oasaimeh, Awni; Borgesen, Peter

    2012-02-01

    The recrystallization of β-Sn profoundly affects deformation and failure of Sn-Ag-Cu solder joints in thermomechanical fatigue (TMF) testing. The numerous grain boundaries of recrystallized β-Sn enable grain boundary sliding, which is absent in as-solidified solder joints. Fatigue cracks initiate at, and propagate along, recrystallized grain boundaries, eventually leading to intergranular fracture. The recrystallization behavior of Sn-Ag-Cu solder joints was examined in three different TMF conditions for five different ball grid array component designs. Based on the experimental observations, a TMF damage accumulation model is proposed: (1) strain-enhanced coarsening of secondary precipitates of Ag3Sn and Cu6Sn5 starts at joint corners, eventually allowing recrystallization of the Sn grain there as well; (2) coarsening and recrystallization continue to develop into the interior of the joints, while fatigue crack growth lags behind; (3) fatigue cracks finally progress through the recrystallized region. Independent of the TMF condition, the recrystallization appeared to be essentially complete after somewhat less than 50% of the characteristic life, while it took another 50% to 75% of the lifetime for a fatigue crack to propagate through the recrystallized region.

  15. Characterizing the Soldering Alloy Type In–Ag–Ti and the Study of Direct Soldering of SiC Ceramics and Copper

    Directory of Open Access Journals (Sweden)

    Roman Koleňák

    2018-04-01

    Full Text Available The aim of the research was to characterize the soldering alloy In–Ag–Ti type, and to study the direct soldering of SiC ceramics and copper. The In10Ag4Ti solder has a broad melting interval, which mainly depends on its silver content. The liquid point of the solder is 256.5 °C. The solder microstructure is composed of a matrix with solid solution (In, in which the phases of titanium (Ti3In4 and silver (AgIn2 are mainly segregated. The tensile strength of the solder is approximately 13 MPa. The strength of the solder increased with the addition of Ag and Ti. The solder bonds with SiC ceramics, owing to the interaction between active In metal and silicon infiltrated in the ceramics. XRD analysis has proven the interaction of titanium with ceramic material during the formation of the new minority phases of titanium silicide—SiTi and titanium carbide—C5Ti8. In and Ag also affect bond formation with the copper substrate. Two new phases were also observed in the bond interphase—(CuAg6In5 and (AgCuIn2. The average shear strength of a combined joint of SiC–Cu, fabricated with In10Ag4Ti solder, was 14.5 MPa. The In–Ag–Ti solder type studied possesses excellent solderability with several metallic and ceramic materials.

  16. [The dental soldering by means of high frequency induction heating (author's transl)].

    Science.gov (United States)

    Ichimaru, T; Kameda, T

    1977-04-01

    The authors examined the methods of high frequency induction soldering, especially Loop-method, other than the gas flame soldering which was known generally. The details which was done are: (1) about the form of induction coil, and the relative places of the coil and restrative appliance, and some supplementary appliances of them. (2) about strength of soldered joints of Co-Cr wire using silver solder and Pd-solder, and observation on the corrosion of soldered-joints by the scanning electron-microscope. (3) about the comparison of the characteristics of Co-Cr wire by means of high-frequency induction heating and gas-flame one. (4) about the examples of soldering of porcelain crown-bridge and clasp wire attached on the dental cast, and possibility of soldering techniques of them on the dental cast. The authors found that the high frequency induction method was preeminent from the other method on the point of (a) the characteristic of heated wire, (b) the strength of soldered joints, (c) the easiness of operating of them, and (d) the possibility of soldering using the high-melting point of Pd-solder, and the soldering of them on the dental cast. Therefore we can enough respect the application on the dental area of this apparatus and this techniques of the high-frequency induction soldering.

  17. Composite Based Chitosan/Zinc-Doped HA as a Candidate Material for Bone Substitute Applications

    Science.gov (United States)

    Wicaksono, S. T.; Rasyida, A.; Purnomo, A.; Pradita, N. N.; Ardhyananta, H.; Hidayat, M. I. P.

    2017-05-01

    The composite based Zinc-doped in Chitosan/Hydroxyapatite was successfully prepared by wet mixing method through the addition of 10, 15, and 20wt% of chitosan. The addition of Chitosan increased the compressive strength and the modulus elasticity. However, it decreased the density and the surface hardness of HA-Zn. Mechanical characterization revealed that these composites are suitable as a candidate of a cancellous bone substitute. Composite with 10% chitosan has compressive strength and modulus elasticity of 57.03 MPa and 0.15 GPa, respectively. Hence, it has the physical and mechanical properties that meet the standards as a cancellous bone substitute material. Also, in vitro biocompatibility test against BHK-21 cells exhibited non-toxic materials.

  18. Sequence-Based Introgression Mapping Identifies Candidate White Mold Tolerance Genes in Common Bean

    Directory of Open Access Journals (Sweden)

    Sujan Mamidi

    2016-07-01

    Full Text Available White mold, caused by the necrotrophic fungus (Lib. de Bary, is a major disease of common bean ( L.. WM7.1 and WM8.3 are two quantitative trait loci (QTL with major effects on tolerance to the pathogen. Advanced backcross populations segregating individually for either of the two QTL, and a recombinant inbred (RI population segregating for both QTL were used to fine map and confirm the genetic location of the QTL. The QTL intervals were physically mapped using the reference common bean genome sequence, and the physical intervals for each QTL were further confirmed by sequence-based introgression mapping. Using whole-genome sequence data from susceptible and tolerant DNA pools, introgressed regions were identified as those with significantly higher numbers of single-nucleotide polymorphisms (SNPs relative to the whole genome. By combining the QTL and SNP data, WM7.1 was located to a 660-kb region that contained 41 gene models on the proximal end of chromosome Pv07, while the WM8.3 introgression was narrowed to a 1.36-Mb region containing 70 gene models. The most polymorphic candidate gene in the WM7.1 region encodes a BEACH-domain protein associated with apoptosis. Within the WM8.3 interval, a receptor-like protein with the potential to recognize pathogen effectors was the most polymorphic gene. The use of gene and sequence-based mapping identified two candidate genes whose putative functions are consistent with the current model of pathogenicity.

  19. Microbial leaching of waste solder for recovery of metal.

    Science.gov (United States)

    Hocheng, H; Hong, T; Jadhav, U

    2014-05-01

    This study proposes an environment-friendly bioleaching process for recovery of metals from solders. Tin-copper (Sn-Cu), tin-copper-silver (Sn-Cu-Ag), and tin-lead (Sn-Pb) solders were used in the current study. The culture supernatant of Aspergillus niger removed metals faster than the culture supernatant of Acidithiobacillus ferrooxidans. Also, the metal removal by A. niger culture supernatant is faster for Sn-Cu-Ag solder as compared to other solder types. The effect of various process parameters such as shaking speed, temperature, volume of culture supernatant, and increased solder weight on bioleaching of metals was studied. About 99 (±1.75) % metal dissolution was achieved in 60 h, at 200-rpm shaking speed, 30 °C temperature, and by using 100-ml A. niger culture supernatant. An optimum solder weight for bioleaching was found to be 5 g/l. Addition of sodium hydroxide (NaOH) and sodium chloride (NaCl) in the bioleached solution from Sn-Cu-Ag precipitated tin (85 ± 0.35 %) and silver (80 ± 0.08 %), respectively. Passing of hydrogen sulfide (H2S) gas at pH 8.1 selectively precipitated lead (57.18 ± 0.13 %) from the Sn-Pb bioleached solution. The proposed innovative bioleaching process provides an alternative technology for recycling waste solders to conserve resources and protect environment.

  20. Histological Study of Toxic Effects of Solder Fumes on Thickness of Germinal Epithelium in Seminiferous Tubule in Rat

    Directory of Open Access Journals (Sweden)

    Mohammad Reza Arab

    2014-10-01

    Full Text Available Background: Toxic fumes generating during soldering contains various contaminants. The aim of the study was to determine toxic effects of solder fumes in thickness of semniferous tubule in Rat. Materials and Methods 48 male adult rats were randomly divided into experimental (n=30 and control (n=18 groups. Based on exposure time, each group was further divided into three subgroups such as 2, 4 and 6 weeks. The concentrations of toxic fumes were measured by standard method. Rats of experimental group were exposed to solder fumes for 1 hour/day. According to time table rats of experimental and control subgroups were killed. After fixation of testis, paraffin sections were stained by Hematoxylin & Eosin. The thicknesses of germinal epithelium were measured and data were analyzed by SPSS software version 17 with Mann Whitney test. Results: The results showed that the concentration of fumes was 0.193 mg/m3 for formaldehyde, 0.35 mg/m3 for Stanum (Sn and 3 mg/m3 for Pb. Although there was no significant difference for weight of rats’ testis between control and experimental subgroups, there was only a significant difference for the thickness of germinal epithelium between 6 week experimental and control subgroups ( p<0.02. Conclusion: The results of study showed that solder fumes can change the structure and thickness of seminiferous epithelium in experimental groups in a time dependent manner.

  1. Correlation Between Pin Misalignment and Crack Length in THT Solder Joints

    Directory of Open Access Journals (Sweden)

    Molnar A.

    2017-06-01

    Full Text Available In this manuscript, correlations were searched for between pin misalignments relative to PCB bores and crack propagation after cyclic thermal shock tests in THT solder joints produced from lead-free solder alloys. In total, 7 compositions were examined including SAC solders with varying Ag, Cu and Ni contents. The crack propagation was initiated by cyclic thermal shock tests with 40°C / +125°C temperature profiles. Pin misalignments relative to the bores were characterized with three attributes obtained from one section of the examined solder joints. Cracks typically originated at the solder/pin or solder/bore interfaces and propagated within the solder. It was shown that pin misalignments did not have an effect on crack propagation, thus, the solder joints’ lifetime.

  2. Behavior of Sn-0.7Cu-xZn lead free solder on physical properties and micro structure

    Science.gov (United States)

    Siahaan, Erwin

    2017-09-01

    The issues to substitute Tin-Lead Solders is concerning the health and environmental hazards that is caused by lead, and also legislative actions around the world regarding lead toxicity, which has prompted the research community to attempt to replace solder alloys for the traditional Sn-Pb alloys lead which has been used by industrial worker throughout history because it is easily extracted and refined at a relatively low energy cost and also has a range of useful properties. Traditional industry lead has been used in soldering materials for electronic applications because it has low melting point and a soft, malleable nature, when combined with tin at the eutectic composition which causes the alloy to flow easily in the liquid state and solidifies over a very small range of temperature. One of the potential candidate to replace tin-lead solder is Sn-Cu-Zn eutectic alloy as it has a lower melting temperature. Consequently, it is of interest to determine what reactions can occur in ternary systems derived from the Sn-Cu-Zn eutectic. One such system is Sn-0.7Cu-xZn. The specimen was elaborated on physical properties. The chemical content was analyzed by using Shimadzu XRD and melting point was analyzed by using Differential Scanning Calorimeter ( DSC ). The results has shown that the highest addition of Zinc content (15%Zn) will decrease the melting temperatur to 189°C compared to Sn-Pb at 183°C Increasing the amount of Zn on Sn0.7Cu-xZn alloys will decrease Cu3Sn intermetallic coumpound.

  3. Photonic flash soldering of thin chips and SMD components on foils for flexible electronics

    NARCIS (Netherlands)

    Ende, D.A. van den; Hendriks, R.; Cauchois, R.; Kusters, R.H.L.; Cauwe, M.; Groen, W.A.; Brand, J. van den

    2014-01-01

    Ultrathin bare die chips and small-size surface mount device components were successfully soldered using a novel roll-to-roll compatible soldering technology. A high-power xenon light flash was used to successfully solder the components to copper tracks on polyimide (PI) and polyethylene

  4. Investigation Of Intermetallic Compounds In Sn-Cu-Ni Lead-Free Solders

    Directory of Open Access Journals (Sweden)

    Nagy E.

    2015-06-01

    Full Text Available Interfacial intermetallic compounds (IMC play an important role in Sn-Cu lead-free soldering. The size and morphology of the intermetallic compounds formed between the lead-free solder and the Cu substrate have a significant effect on the mechanical strength of the solder joint.

  5. 30 CFR 77.1916 - Welding, cutting, and soldering; fire protection.

    Science.gov (United States)

    2010-07-01

    ... 30 Mineral Resources 1 2010-07-01 2010-07-01 false Welding, cutting, and soldering; fire... OF UNDERGROUND COAL MINES Slope and Shaft Sinking § 77.1916 Welding, cutting, and soldering; fire protection. (a) One portable fire extinguisher shall be provided where welding, cutting, or soldering with...

  6. 30 CFR 75.1106 - Welding, cutting, or soldering with arc or flame underground.

    Science.gov (United States)

    2010-07-01

    ... 30 Mineral Resources 1 2010-07-01 2010-07-01 false Welding, cutting, or soldering with arc or... Protection § 75.1106 Welding, cutting, or soldering with arc or flame underground. [Statutory Provisions] All welding, cutting, or soldering with arc or flame in all underground areas of a coal mine shall, whenever...

  7. 30 CFR 77.1112 - Welding, cutting, or soldering with arc or flame; safeguards.

    Science.gov (United States)

    2010-07-01

    ... 30 Mineral Resources 1 2010-07-01 2010-07-01 false Welding, cutting, or soldering with arc or... WORK AREAS OF UNDERGROUND COAL MINES Fire Protection § 77.1112 Welding, cutting, or soldering with arc or flame; safeguards. (a) When welding, cutting, or soldering with arc or flame near combustible...

  8. Preparation of candidate reference materials for the determination of phosphorus containing flame retardants in styrene-based polymers.

    Science.gov (United States)

    Roth, Thomas; Urpi Bertran, Raquel; Latza, Andreas; Andörfer-Lang, Katrin; Hügelschäffer, Claudia; Pöhlein, Manfred; Puchta, Ralph; Placht, Christian; Maid, Harald; Bauer, Walter; van Eldik, Rudi

    2015-04-01

    Candidate reference materials (RM) for the analysis of phosphorus-based flame retardants in styrene-based polymers were prepared using a self-made mini-extruder. Due to legal requirements of the current restriction for the use of certain hazardous substances in electrical and electronic equipment, focus now is placed on phosphorus-based flame retardants instead of the brominated kind. Newly developed analytical methods for the first-mentioned substances also require RMs similar to industrial samples for validation and verification purposes. Hence, the prepared candidate RMs contained resorcinol-bis-(diphenyl phosphate), bisphenol A bis(diphenyl phosphate), triphenyl phosphate and triphenyl phosphine oxide as phosphorus-based flame retardants. Blends of polycarbonate and acrylonitrile-co-butadiene-co-styrene as well as blends of high-impact polystyrene and polyphenylene oxide were chosen as carrier polymers. Homogeneity and thermal stability of the candidate RMs were investigated. Results showed that the candidate RMs were comparable to the available industrial materials. Measurements by ICP/OES, FTIR and NMR confirmed the expected concentrations of the flame retardants and proved that analyte loss and degradation, respectively, was below the uncertainty of measurement during the extrusion process. Thus, the candidate RMs were found to be suitable for laboratory use.

  9. In Silico Analysis of Epitope-Based Vaccine Candidates against Hepatitis B Virus Polymerase Protein.

    Science.gov (United States)

    Zheng, Juzeng; Lin, Xianfan; Wang, Xiuyan; Zheng, Liyu; Lan, Songsong; Jin, Sisi; Ou, Zhanfan; Wu, Jinming

    2017-05-16

    Hepatitis B virus (HBV) infection has persisted as a major public health problem due to the lack of an effective treatment for those chronically infected. Therapeutic vaccination holds promise, and targeting HBV polymerase is pivotal for viral eradication. In this research, a computational approach was employed to predict suitable HBV polymerase targeting multi-peptides for vaccine candidate selection. We then performed in-depth computational analysis to evaluate the predicted epitopes' immunogenicity, conservation, population coverage, and toxicity. Lastly, molecular docking and MHC-peptide complex stabilization assay were utilized to determine the binding energy and affinity of epitopes to the HLA-A0201 molecule. Criteria-based analysis provided four predicted epitopes, RVTGGVFLV, VSIPWTHKV, YMDDVVLGA and HLYSHPIIL. Assay results indicated the lowest binding energy and high affinity to the HLA-A0201 molecule for epitopes VSIPWTHKV and YMDDVVLGA and epitopes RVTGGVFLV and VSIPWTHKV, respectively. Regions 307 to 320 and 377 to 387 were considered to have the highest probability to be involved in B cell epitopes. The T cell and B cell epitopes identified in this study are promising targets for an epitope-focused, peptide-based HBV vaccine, and provide insight into HBV-induced immune response.

  10. A sub-pathway based method to identify candidate agents for Ankylosing Spondylitis.

    Science.gov (United States)

    Chen, Kai; Zhao, Yingchuan; Chen, Yu; Wang, Chuanfeng; Chen, Ziqiang; Bai, Yushu; Zhu, Xiaodong; Li, Ming

    2012-10-22

    The need for new therapeutics for Ankylosing Spondylitis (AS) is highlighted by the general lack of efficacy for most agents currently available for this disease. Many recent studies have detailed molecular pathways in AS, and several molecule-targeting agents are undergoing evaluation. We aimed to explore the mechanism of AS and identify biologically active small molecules capable of targeting the sub-pathways which were disregulated in the development of AS. By using the GSE25101 microarray data accessible from the Gene Expression Omnibus database, we first identified the differentially expressed genes (DEGs) between AS samples and healthy controls, followed by the sub-pathway enrichment analysis of the DEGs. In addition, we propose the use of an approach based on targeting sub-pathways to identify potential agents for AS. A total of 3,280 genes were identified as being significantly different between patients and controls with p-values pathway and some immune-associated pathways may be involved in the development of AS. Besides, our bioinformatics analysis revealed a total of 15 small molecules which may play a role in perturbing the development of AS. Our study proposes the use of an approach based on targeting sub-pathways to identify potential agents for AS. Candidate agents identified by our approach may provide the groundwork for a combination therapy approach for AS.

  11. A Sub-Pathway Based Method to Identify Candidate Agents for Ankylosing Spondylitis

    Directory of Open Access Journals (Sweden)

    Ming Li

    2012-10-01

    Full Text Available The need for new therapeutics for Ankylosing Spondylitis (AS is highlighted by the general lack of efficacy for most agents currently available for this disease. Many recent studies have detailed molecular pathways in AS, and several molecule-targeting agents are undergoing evaluation. We aimed to explore the mechanism of AS and identify biologically active small molecules capable of targeting the sub-pathways which were disregulated in the development of AS. By using the GSE25101 microarray data accessible from the Gene Expression Omnibus database, we first identified the differentially expressed genes (DEGs between AS samples and healthy controls, followed by the sub-pathway enrichment analysis of the DEGs. In addition, we propose the use of an approach based on targeting sub-pathways to identify potential agents for AS. A total of 3,280 genes were identified as being significantly different between patients and controls with p-values < 0.1. Our study showed that neurotrophic signaling pathway and some immune-associated pathways may be involved in the development of AS. Besides, our bioinformatics analysis revealed a total of 15 small molecules which may play a role in perturbing the development of AS. Our study proposes the use of an approach based on targeting sub-pathways to identify potential agents for AS. Candidate agents identified by our approach may provide the groundwork for a combination therapy approach for AS.

  12. An Overview of Surface Finishes and Their Role in Printed Circuit Board Solderability and Solder Joint Performance

    Energy Technology Data Exchange (ETDEWEB)

    Vianco, P.T.

    1998-10-15

    A overview has been presented on the topic of alternative surface finishes for package I/Os and circuit board features. Aspects of processability and solder joint reliability were described for the following coatings: baseline hot-dipped, plated, and plated-and-fused 100Sn and Sn-Pb coatings; Ni/Au; Pd, Ni/Pd, and Ni/Pd/Au finishes; and the recently marketed immersion Ag coatings. The Ni/Au coatings appear to provide the all-around best option in terms of solderability protection and wire bondability. Nickel/Pal ftishes offer a slightly reduced level of performance in these areas that is most likely due to variable Pd surface conditions. It is necessmy to minimize dissolved Au or Pd contents in the solder material to prevent solder joint embrittlement. Ancillary aspects that included thickness measurement techniques; the importance of finish compatibility with conformal coatings and conductive adhesives; and the need for alternative finishes for the processing of non-Pb bearing solders were discussed.

  13. Planetary Candidates Observed by Kepler. VIII. A Fully Automated Catalog with Measured Completeness and Reliability Based on Data Release 25

    Science.gov (United States)

    Thompson, Susan E.; Coughlin, Jeffrey L.; Hoffman, Kelsey; Mullally, Fergal; Christiansen, Jessie L.; Burke, Christopher J.; Bryson, Steve; Batalha, Natalie; Haas, Michael R.; Catanzarite, Joseph; Rowe, Jason F.; Barentsen, Geert; Caldwell, Douglas A.; Clarke, Bruce D.; Jenkins, Jon M.; Li, Jie; Latham, David W.; Lissauer, Jack J.; Mathur, Savita; Morris, Robert L.; Seader, Shawn E.; Smith, Jeffrey C.; Klaus, Todd C.; Twicken, Joseph D.; Van Cleve, Jeffrey E.; Wohler, Bill; Akeson, Rachel; Ciardi, David R.; Cochran, William D.; Henze, Christopher E.; Howell, Steve B.; Huber, Daniel; Prša, Andrej; Ramírez, Solange V.; Morton, Timothy D.; Barclay, Thomas; Campbell, Jennifer R.; Chaplin, William J.; Charbonneau, David; Christensen-Dalsgaard, Jørgen; Dotson, Jessie L.; Doyle, Laurance; Dunham, Edward W.; Dupree, Andrea K.; Ford, Eric B.; Geary, John C.; Girouard, Forrest R.; Isaacson, Howard; Kjeldsen, Hans; Quintana, Elisa V.; Ragozzine, Darin; Shabram, Megan; Shporer, Avi; Silva Aguirre, Victor; Steffen, Jason H.; Still, Martin; Tenenbaum, Peter; Welsh, William F.; Wolfgang, Angie; Zamudio, Khadeejah A.; Koch, David G.; Borucki, William J.

    2018-04-01

    We present the Kepler Object of Interest (KOI) catalog of transiting exoplanets based on searching 4 yr of Kepler time series photometry (Data Release 25, Q1–Q17). The catalog contains 8054 KOIs, of which 4034 are planet candidates with periods between 0.25 and 632 days. Of these candidates, 219 are new, including two in multiplanet systems (KOI-82.06 and KOI-2926.05) and 10 high-reliability, terrestrial-size, habitable zone candidates. This catalog was created using a tool called the Robovetter, which automatically vets the DR25 threshold crossing events (TCEs). The Robovetter also vetted simulated data sets and measured how well it was able to separate TCEs caused by noise from those caused by low signal-to-noise transits. We discuss the Robovetter and the metrics it uses to sort TCEs. For orbital periods less than 100 days the Robovetter completeness (the fraction of simulated transits that are determined to be planet candidates) across all observed stars is greater than 85%. For the same period range, the catalog reliability (the fraction of candidates that are not due to instrumental or stellar noise) is greater than 98%. However, for low signal-to-noise candidates between 200 and 500 days around FGK-dwarf stars, the Robovetter is 76.7% complete and the catalog is 50.5% reliable. The KOI catalog, the transit fits, and all of the simulated data used to characterize this catalog are available at the NASA Exoplanet Archive.

  14. Optimization of the soldering process by the DMAIC methodology

    Directory of Open Access Journals (Sweden)

    Michał Zasadzień

    2016-06-01

    Full Text Available The chapter presents the use of the DMAIC method for the analysis and improvement of the process of soldering pins in a plug connecting a bundle of wires to the board of a controller; a part of the steering system of a car. The main problem in the soldering process, that is an unsatisfactory share of bad soldered connections between the board and the plug and the instability of that number, was identified by means of a five-phase improvement process. Key points and main causes of the defect were pointed out, and process improvement measures were suggested. Due to the analysis conducted and the correct implementation of improvement measures the share of defective connections has been decreased twofold.

  15. Temperature-controlled two-wavelength laser soldering of tissues.

    Science.gov (United States)

    Gabay, Ilan; Abergel, Avraham; Vasilyev, Tamar; Rabi, Yaron; Fliss, Dan M; Katzir, Abraham

    2011-11-01

    Laser tissue soldering is a method for bonding of incisions in tissues. A biological solder is spread over the cut, laser radiation heats the solder and the underlying cut edges and the incision is bonded. This method offers many advantages over conventional techniques (e.g., sutures). Past researches have shown that laser soldering, using a single laser, does not provide sufficient strength for bonding of cuts in thick (>1 mm) tissues. This study introduces a novel method for laser soldering of thick tissues, under temperature control, using two lasers, emitting two different wavelengths. An experimental system was built, using two lasers: (i) a CO(2) laser, whose radiation heated the upper surface of the tissue and (ii) a GaAs laser that heated an albumin layer under the tissue. An infrared fiber-optic radiometer monitored the temperature of the tissue. All three devices were connected to a computer that controlled the process. A computer simulation was written to optimize the system parameters. The system was tested on tissue phantoms, to validate the simulation and ensure that both the upper and lower sides of the cut were heated, and that the temperature could be controlled on both sides. The system was then used ex vivo to bond longitudinal cuts of lengths ∼12 mm in the esophagi of large farm pigs. The theoretical simulations showed a good stabilization of the temperatures at the upper and lower tissue surfaces at the target values. Experiments on tissue phantom showed a good agreement with these simulations. Incisions in esophagi, removed from large farm pigs, were then successfully bonded. The mean burst pressure was ∼3.6 m of water. This study demonstrated the capability of soldering cuts in thick tissues, paving the way for new types of surgical applications. Copyright © 2010 Wiley Periodicals, Inc.

  16. Bottom-up nanoarchitecture of semiconductor nano-building blocks by controllable in situ SEM-FIB thermal soldering method

    KAUST Repository

    Zhang, Xuan

    2017-08-10

    Here we demonstrate that the building blocks of semiconductor WO3 nanowires can be controllably soldered together by a novel nano-soldering technique of in situ SEM-FIB thermal soldering, in which the soldering temperature can precisely remain in an optimal range to avoid a strong thermal diffusion.

  17. Selection Methodology of H-1 Components as Potential Candidates for Performance Based Logistics Contracts

    National Research Council Canada - National Science Library

    Erickson, Jamie; Hutchins, Jim

    2008-01-01

    ...) explore methods of identifying components as PBL candidates specifically for the H-1 community, through an analysis of readiness data, interviews with subject matter experts and use of Crystal Ball...

  18. Antihypertensives for combating dementia? A perspective on candidate molecular mechanisms and population-based prevention.

    Science.gov (United States)

    Valenzuela, M; Esler, M; Ritchie, K; Brodaty, H

    2012-04-24

    Age-related increases in prevalent dementia over the next 30-40 years risk collapsing medical resources or radically altering the way we treat patients. Better prevention of dementia therefore needs to be one of our highest medical priorities. We propose a perspective on the pathological basis of dementia based on a cerebrovascular-Alzheimer disease spectrum that provides a more powerful explanatory framework when considering the impact of possible public health interventions. With this in mind, a synthesis of evidence from basic, clinical and epidemiological studies indeed suggests that the enhanced treatment of hypertension could be effective for the primary prevention of dementia of either Alzheimer or vascular etiology. In particular, we focus on candidate preventative mechanisms, including reduced cerebrovascular disease, disruption of hypoxia-dependent amyloidogenesis and the potential neuroprotective properties of calcium channel blockers. Following the successful translation of large, long-term and resource-intense trials in cardiology into improved vascular health outcomes in many countries, new multinational prevention trials with dementia-related primary outcomes are now urgently required.

  19. Trust Based Algorithm for Candidate Node Selection in Hybrid MANET-DTN

    Directory of Open Access Journals (Sweden)

    Jan Papaj

    2014-01-01

    Full Text Available The hybrid MANET - DTN is a mobile network that enables transport of the data between groups of the disconnected mobile nodes. The network provides benefits of the Mobile Ad-Hoc Networks (MANET and Delay Tolerant Network (DTN. The main problem of the MANET occurs if the communication path is broken or disconnected for some short time period. On the other side, DTN allows sending data in the disconnected environment with respect to higher tolerance to delay. Hybrid MANET - DTN provides optimal solution for emergency situation in order to transport information. Moreover, the security is the critical factor because the data are transported by mobile devices. In this paper, we investigate the issue of secure candidate node selection for transportation of the data in a disconnected environment for hybrid MANET- DTN. To achieve the secure selection of the reliable mobile nodes, the trust algorithm is introduced. The algorithm enables select reliable nodes based on collecting routing information. This algorithm is implemented to the simulator OPNET modeler.

  20. Whole Genome Sequencing-Based Mapping and Candidate Identification of Mutations from Fixed Zebrafish Tissue.

    Science.gov (United States)

    Sanchez, Nicholas E; Harty, Breanne L; O'Reilly-Pol, Thomas; Ackerman, Sarah D; Herbert, Amy L; Holmgren, Melanie; Johnson, Stephen L; Gray, Ryan S; Monk, Kelly R

    2017-10-05

    As forward genetic screens in zebrafish become more common, the number of mutants that cannot be identified by gross morphology or through transgenic approaches, such as many nervous system defects, has also increased. Screening for these difficult-to-visualize phenotypes demands techniques such as whole-mount in situ hybridization (WISH) or antibody staining, which require tissue fixation. To date, fixed tissue has not been amenable for generating libraries for whole genome sequencing (WGS). Here, we describe a method for using genomic DNA from fixed tissue and a bioinformatics suite for WGS-based mapping of zebrafish mutants. We tested our protocol using two known zebrafish mutant alleles, gpr126 st49 and egr2b fh227 , both of which cause myelin defects. As further proof of concept we mapped a novel mutation, stl64 , identified in a zebrafish WISH screen for myelination defects. We linked stl64 to chromosome 1 and identified a candidate nonsense mutation in the F-box and WD repeat domain containing 7 ( fbxw7 ) gene. Importantly, stl64 mutants phenocopy previously described fbxw7 vu56 mutants, and knockdown of fbxw7 in wild-type animals produced similar defects, demonstrating that stl64 disrupts fbxw7 Together, these data show that our mapping protocol can map and identify causative lesions in mutant screens that require tissue fixation for phenotypic analysis. Copyright © 2017 Sanchez et al.

  1. The Extremely Luminous Quasar Survey in the SDSS Footprint. I. Infrared-based Candidate Selection

    Science.gov (United States)

    Schindler, Jan-Torge; Fan, Xiaohui; McGreer, Ian D.; Yang, Qian; Wu, Jin; Jiang, Linhua; Green, Richard

    2017-12-01

    Studies of the most luminous quasars at high redshift directly probe the evolution of the most massive black holes in the early universe and their connection to massive galaxy formation. However, extremely luminous quasars at high redshift are very rare objects. Only wide-area surveys have a chance to constrain their population. The Sloan Digital Sky Survey (SDSS) has so far provided the most widely adopted measurements of the quasar luminosity function at z> 3. However, a careful re-examination of the SDSS quasar sample revealed that the SDSS quasar selection is in fact missing a significant fraction of z≳ 3 quasars at the brightest end. We identified the purely optical-color selection of SDSS, where quasars at these redshifts are strongly contaminated by late-type dwarfs, and the spectroscopic incompleteness of the SDSS footprint as the main reasons. Therefore, we designed the Extremely Luminous Quasar Survey (ELQS), based on a novel near-infrared JKW2 color cut using Wide-field Infrared Survey Explorer mission (WISE) AllWISE and 2MASS all-sky photometry, to yield high completeness for very bright ({m}{{i}}footprint to obtain a well-defined and complete quasar sample for an accurate measurement of the bright-end quasar luminosity function (QLF) at 3.0≤slant z≤slant 5.0. In this paper, we present the quasar selection algorithm and the quasar candidate catalog.

  2. Database of Pb - free soldering materials, surface tension and density, experiment vs. Modeling

    Directory of Open Access Journals (Sweden)

    Z Moser

    2006-01-01

    Full Text Available Experimental studies of surface tension and density by the maximum bubble pressure method and dilatometric technique were undertaken and the accumulated data for liquid pure components, binary, ternary and multicomponent alloys were used to create the SURDAT data base for Pb-free soldering materials. The data base enabled, also to compare the experimental results with those obtained by the Butler’s model and with the existing literature data. This comparison has been extended by including the experimental data of Sn-Ag-Cu-Sb alloys.

  3. Prioritizing disease candidate proteins in cardiomyopathy-specific protein-protein interaction networks based on "guilt by association" analysis.

    Directory of Open Access Journals (Sweden)

    Wan Li

    Full Text Available The cardiomyopathies are a group of heart muscle diseases which can be inherited (familial. Identifying potential disease-related proteins is important to understand mechanisms of cardiomyopathies. Experimental identification of cardiomyophthies is costly and labour-intensive. In contrast, bioinformatics approach has a competitive advantage over experimental method. Based on "guilt by association" analysis, we prioritized candidate proteins involving in human cardiomyopathies. We first built weighted human cardiomyopathy-specific protein-protein interaction networks for three subtypes of cardiomyopathies using the known disease proteins from Online Mendelian Inheritance in Man as seeds. We then developed a method in prioritizing disease candidate proteins to rank candidate proteins in the network based on "guilt by association" analysis. It was found that most candidate proteins with high scores shared disease-related pathways with disease seed proteins. These top ranked candidate proteins were related with the corresponding disease subtypes, and were potential disease-related proteins. Cross-validation and comparison with other methods indicated that our approach could be used for the identification of potentially novel disease proteins, which may provide insights into cardiomyopathy-related mechanisms in a more comprehensive and integrated way.

  4. Detection of colonic polyp candidates with level set-based thickness mapping over the colon wall

    Science.gov (United States)

    Han, Hao; Li, Lihong; Duan, Chaijie; Zhao, Yang; Wang, Huafeng; Liang, Zhengrong

    2015-03-01

    Further improvement of computer-aided detection (CADe) of colonic polyps is vital to advance computed tomographic colonography (CTC) toward a screening modality, where the detection of flat polyps is especially challenging because limited image features can be extracted from flat polyps, and the traditional geometric features-based CADe methods usually fail to detect such polyps. In this paper, we present a novel pipeline to automatically detect initial polyp candidates (IPCs), especially flat polyps, from CTC images. First, the colon wall mucosa was extracted via a partial volume segmentation approach as a volumetric layer, where the inner border of colon wall can be obtained by shrinking the volumetric layer using level set based adaptive convolution. Then the outer border of colon wall (or the colon wall serosa) was segmented via a combined implementation of geodesic active contour and Mumford-Shah functional in a coarse-to-fine manner. Finally, the wall thickness was estimated along a unique path between the segmented inner and outer borders with consideration of the volumetric layers and was mapped onto a patient-specific three-dimensional (3D) colon wall model. The IPC detection results can usually be better visualized in a 2D image flattened from the 3D model, where abnormalities were detected by Z-score transformation of the thickness values. The proposed IPC detection approach was validated on 11 patients with 22 CTC scans, and each scan has at least one flat poly annotation. The above presented novel pipeline was effective to detect some flat polyps that were missed by our CADe system while keeping false detections in a relative low level. This preliminary study indicates that the presented pipeline can be incorporated into an existing CADe system to enhance the polyp detection power, especially for flat polyps.

  5. Detection of the early keratoconus based on corneal biomechanical properties in the refractive surgery candidates

    Directory of Open Access Journals (Sweden)

    Zofia Pniakowska

    2016-01-01

    Full Text Available Context: Subclinical keratoconus is contraindication to refractive surgery. The currently used methods of preoperative screening do not always allow differentiating between healthy eyes and those with subclinical keratoconus. Aim: To evaluate biomechanical parameters of the cornea, waveform score (WS, and intraocular pressure (IOP as potentially useful adjuncts to the diagnostic algorithm for precise detection of the early keratoconus stages and selection of refractive surgery candidates. Settings and Design: Department of Ophthalmology and prospective cross-sectional study. Patients and Methods: Patients enrolled in the study were diagnosed with refractive disorders. We assessed parameters of corneal biomechanics such as corneal hysteresis (CH, corneal resistance factor (CRF, Goldman-correlated IOP (IOPg, corneal compensated IOP, WS, and keratoconus match index (KMI. They were classified into one of three groups based on the predefined KMI range: Group 1 (from 0.352 to 0.757 – 45 eyes, Group 2 (from −0.08 to 0.313 – 52 eyes, and Group 0 - control group (from 0.761 to 1.642 – 80 eyes. Results: In both study groups, IOPg, CRF, and CH were decreased when compared to control (P < 0.0001. In control group, there was positive correlation between CH and KMI (P < 0.05, with no correlations in any of the two study groups. CRF correlated positively with KMI in control (P < 0.0001 and in Group 2 (P < 0.05. Conclusions: CH and CRF, together with WS and IOPg, consist a clinically useful adjunct to detect subclinical keratoconus in patients referred for refractive surgery when based on KMI staging.

  6. A candidate gene-based association study of tocopherol content and composition in rapeseed (Brassica napus

    Directory of Open Access Journals (Sweden)

    Steffi eFritsche

    2012-06-01

    Full Text Available Rapeseed (Brassica napus L. is the most important oil crop of temperate climates. Rapeseed oil contains tocopherols, also known as vitamin E, which is an indispensable nutrient for humans and animals due to its antioxidant and radical scavenging abilities. Moreover, tocopherols are also important for the oxidative stability of vegetable oils. Therefore, seed oil with increased tocopherol content or altered tocopherol composition is a target for breeding. We investigated the role of nucleotide variations within candidate genes from the tocopherol biosynthesis pathway. Field trials were carried out with 229 accessions from a worldwide B. napus collection which was divided into two panels of 96 and 133 accessions. Seed tocopherol content and composition were measured by HPLC. High heritabilities were found for both traits, ranging from 0.62 to 0.94. We identified polymorphisms by sequencing selected regions of the tocopherol genes from the 96 accession panel. Subsequently, we determined the population structure (Q and relative kinship (K as detected by genotyping with genome-wide distributed SSR markers. Association studies were performed using two models, the structure-based GLM+Q and the PK mixed model. Between 26 and 12 polymorphisms within two genes (BnaX.VTE3.a, BnaA.PDS1.c were significantly associated with tocopherol traits. The SNPs explained up to 16.93 % of the genetic variance for tocopherol composition and up to 10.48 % for total tocopherol content. Based on the sequence information we designed CAPS markers for genotyping the 133 accessions from the 2nd panel. Significant associations with various tocopherol traits confirmed the results from the first experiment. We demonstrate that the polymorphisms within the tocopherol genes clearly impact tocopherol content and composition in B. napus seeds. We suggest that these nucleotide variations may be used as selectable markers for breeding rapeseed with enhanced tocopherol quality.

  7. PROTECTIVE ACTIVITY STUDY OF A CANDIDATE VACCINE AGAINST ROTAVIRUS INFECTION BASED ON RECOMBINANT PROTEIN FliCVP6VP8

    Directory of Open Access Journals (Sweden)

    I. V. Dukhovlinov

    2016-01-01

    Full Text Available Rotavirus infection is among leading causes of severe diarrhea which often leads to severe dehydration, especially, in children under 5 years old. In Russia, the incidence of rotavirus infection is constantly increased, due to higher rates of actual rotavirus infection cases and improved diagnostics of the disease. Immunity to rotavirus is unstable, thus causing repeated infections intra vitam. Anti-infectious resistance in reconvalescents is explained by induction of specific IgM, IgG, and, notably, IgA antibodies. Due to absence of market drugs with direct action against rotavirus, a rational vaccination is considered the most effective way to control the disease. Currently available vaccines for prevention of rotavirus infection are based on live attenuated rotavirus strains, human and/or animal origin, which replicate in human gut. Their implementation may result into different complications. Meanwhile, usage of vaccines based on recombinant proteins is aimed to avoid risks associated with introduction of a complete virus into humans. In this paper, we studied protective activity of candidate vaccines against rotavirus.In this work we studied protective activity of a candidate vaccine against rotavirus infection based on recombinant FliCVP6VP8 protein which includes VP6 and VP8, as well as components of Salmonella typhimurium flagellin (FliC as an adjuvant. Different components are joined by flexible bridges. Efficiency of the candidate vaccine was studied in animal model using Balb/c mice. We have shown high level of protection which occurs when the candidate vaccine is administered twice intramuscularly. Complete protection of animals against mouse rotavirus EDC after intramuscular immunization with a candidate vaccine was associated with arising rotavirus-specific IgA and IgG antibodies in serum and intestine of immunized animals. The efficacy of candidate vaccine based on recombinant protein FliCVP6VP8 against rotavirus infection was

  8. Chest Fat Quantification via CT Based on Standardized Anatomy Space in Adult Lung Transplant Candidates.

    Directory of Open Access Journals (Sweden)

    Yubing Tong

    Full Text Available Overweight and underweight conditions are considered relative contraindications to lung transplantation due to their association with excess mortality. Yet, recent work suggests that body mass index (BMI does not accurately reflect adipose tissue mass in adults with advanced lung diseases. Alternative and more accurate measures of adiposity are needed. Chest fat estimation by routine computed tomography (CT imaging may therefore be important for identifying high-risk lung transplant candidates. In this paper, an approach to chest fat quantification and quality assessment based on a recently formulated concept of standardized anatomic space (SAS is presented. The goal of the paper is to seek answers to several key questions related to chest fat quantity and quality assessment based on a single slice CT (whether in the chest, abdomen, or thigh versus a volumetric CT, which have not been addressed in the literature.Unenhanced chest CT image data sets from 40 adult lung transplant candidates (age 58 ± 12 yrs and BMI 26.4 ± 4.3 kg/m2, 16 with chronic obstructive pulmonary disease (COPD, 16 with idiopathic pulmonary fibrosis (IPF, and the remainder with other conditions were analyzed together with a single slice acquired for each patient at the L5 vertebral level and mid-thigh level. The thoracic body region and the interface between subcutaneous adipose tissue (SAT and visceral adipose tissue (VAT in the chest were consistently defined in all patients and delineated using Live Wire tools. The SAT and VAT components of chest were then segmented guided by this interface. The SAS approach was used to identify the corresponding anatomic slices in each chest CT study, and SAT and VAT areas in each slice as well as their whole volumes were quantified. Similarly, the SAT and VAT components were segmented in the abdomen and thigh slices. Key parameters of the attenuation (Hounsfield unit (HU distributions were determined from each chest slice and from the

  9. Novel candidate blood-based transcriptional biomarkers of Machado-Joseph disease.

    Science.gov (United States)

    Raposo, Mafalda; Bettencourt, Conceição; Maciel, Patrícia; Gao, Fuying; Ramos, Amanda; Kazachkova, Nadiya; Vasconcelos, João; Kay, Teresa; Rodrigues, Ana João; Bettencourt, Bruno; Bruges-Armas, Jácome; Geschwind, Daniel; Coppola, Giovanni; Lima, Manuela

    2015-06-01

    Machado-Joseph disease (or spinocerebellar ataxia type 3) is a late-onset polyglutamine neurodegenerative disorder caused by a mutation in the ATXN3 gene, which encodes for the ubiquitously expressed protein ataxin-3. Previous studies on cell and animal models have suggested that mutated ataxin-3 is involved in transcriptional dysregulation. Starting with a whole-transcriptome profiling of peripheral blood samples from patients and controls, we aimed to confirm abnormal expression profiles in Machado-Joseph disease and to identify promising up-regulated genes as potential candidate biomarkers of disease status. The Illumina Human V4-HT12 array was used to measure transcriptome-wide gene expression in peripheral blood samples from 12 patients and 12 controls. Technical validation and validation in an independent set of samples were performed by quantitative real-time polymerase chain reaction (PCR). Based on the results from the microarray, twenty six genes, found to be up-regulated in patients, were selected for technical validation by quantitative real-time PCR (validation rate of 81% for the up-regulation trend). Fourteen of these were further tested in an independent set of 42 patients and 35 controls; 10 genes maintained the up-regulation trend (FCGR3B, CSR2RA, CLC, TNFSF14, SLA, P2RY13, FPR2, SELPLG, YIPF6, and GPR96); FCGR3B, P2RY13, and SELPLG were significantly up-regulated in patients when compared with controls. Our findings support the hypothesis that mutated ataxin-3 is associated with transcription dysregulation, detectable in peripheral blood cells. Furthermore, this is the first report suggesting a pool of up-regulated genes in Machado-Joseph disease that may have the potential to be used for fine phenotyping of this disease. © 2015 International Parkinson and Movement Disorder Society. © 2015 International Parkinson and Movement Disorder Society.

  10. FuSpot: a web-based tool for visual evaluation of fusion candidates.

    Science.gov (United States)

    Killian, Jackson A; Topiwala, Taha M; Pelletier, Alex R; Frankhouser, David E; Yan, Pearlly S; Bundschuh, Ralf

    2018-02-13

    Gene fusions often occur in cancer cells and in some cases are the main driver of oncogenesis. Correct identification of oncogenic gene fusions thus has implications for targeted cancer therapy. Recognition of this potential has led to the development of a myriad of sequencing-based fusion detection tools. However, given the same input, many of these detectors will find different fusion points or claim different sets of supporting data. Furthermore, the rate at which these tools falsely detect fusion events in data varies greatly. This discrepancy between tools underscores the fact that computation algorithms still cannot perfectly evaluate evidence; especially when provided with small amounts of supporting data as is typical in fusion detection. We assert that when evidence is provided in an easily digestible form, humans are more proficient in identifying true positives from false positives. We have developed a web tool that, given the genomic coordinates of a candidate fusion breakpoint, will extract fusion and non-fusion reads adjacent to the fusion point from partner transcripts, and color code reads by transcript origin and read orientation for ease of intuitive inspection by the user. Fusion partner transcript read alignments are performed using a novel variant of the Smith-Waterman algorithm. Combined with dynamic filtering parameters, the visualization provided by our tool introduces a powerful new investigative step that allows researchers to comprehensively evaluate fusion evidence. Additionally, this allows quick identification of false positives that may deceive most fusion detectors, thus eliminating unnecessary gene fusion validation. We apply our visualization tool to publicly available datasets and provide examples of true as well as false positives reported by open source fusion detection tools.

  11. A cell wall protein-based vaccine candidate induce protective immune response against Sporothrix schenckii infection.

    Science.gov (United States)

    Portuondo, Deivys Leandro; Batista-Duharte, Alexander; Ferreira, Lucas Souza; Martínez, Damiana Téllez; Polesi, Marisa Campos; Duarte, Roberta Aparecida; de Paula E Silva, Ana Carolina Alves; Marcos, Caroline Maria; Almeida, Ana Marisa Fusco de; Carlos, Iracilda Zeppone

    2016-02-01

    Sporotrichosis is a subcutaneous mycosis caused by several closely related thermo-dimorphic fungi of the Sporothrix schenckii species complex, affecting humans and other mammals. In the last few years, new strategies have been proposed for controlling sporotrichosis owning to concerns about its growing incidence in humans, cats, and dogs in Brazil, as well as the toxicity and limited efficacy of conventional antifungal drugs. In this study, we assessed the immunogenicity and protective properties of two aluminum hydroxide (AH)-adsorbed S. schenckii cell wall protein (ssCWP)-based vaccine formulations in a mouse model of systemic S. schenckii infection. Fractioning by SDS-PAGE revealed nine protein bands, two of which were functionally characterized: a 44kDa peptide hydrolase and a 47kDa enolase, which was predicted to be an adhesin. Sera from immunized mice recognized the 47kDa enolase and another unidentified 71kDa protein, whereas serum from S. schenckii-infected mice recognized both these proteins plus another unidentified 9.4kDa protein. Furthermore, opsonization with the anti-ssCWP sera led to markedly increased phagocytosis and was able to strongly inhibit the fungus' adhesion to fibroblasts. Immunization with the higher-dose AH-adjuvanted formulation led to increased ex vivo release of IL-12, IFN-γ, IL-4, and IL-17, whereas only IL-12 and IFN-γ were induced by the higher-dose non-adjuvanted formulation. Lastly, passive transference of the higher-dose AH-adjuvanted formulation's anti-ssCWP serum was able to afford in vivo protection in a subsequent challenge with S. schenckii, becoming a viable vaccine candidate for further testing. Copyright © 2015 Elsevier GmbH. All rights reserved.

  12. Horizon shells and BMS-like soldering transformations

    Science.gov (United States)

    Blau, Matthias; O'Loughlin, Martin

    2016-03-01

    We revisit the theory of null shells in general relativity, with a particular emphasis on null shells placed at horizons of black holes. We study in detail the considerable freedom that is available in the case that one solders two metrics together across null hypersurfaces (such as Killing horizons) for which the induced metric is invariant under translations along the null generators. In this case the group of soldering transformations turns out to be infinite dimensional, and these solderings create non-trivial horizon shells containing both massless matter and impulsive gravitational wave components. We also rephrase this result in the language of Carrollian symmetry groups. To illustrate this phenomenon we discuss in detail the example of shells on the horizon of the Schwarzschild black hole (with equal interior and exterior mass), uncovering a rich classical structure at the horizon and deriving an explicit expression for the general horizon shell energy-momentum tensor. In the special case of BMS-like soldering supertranslations we find a conserved shell-energy that is strikingly similar to the standard expression for asymptotic BMS supertranslation charges, suggesting a direct relation between the physical properties of these horizon shells and the recently proposed BMS supertranslation hair of a black hole.

  13. Soluble Lead and Bismuth Chalcogenidometallates: Versatile Solders for Thermoelectric Materials

    Energy Technology Data Exchange (ETDEWEB)

    Zhang, Hao [Department; Son, Jae Sung [Department; School; Dolzhnikov, Dmitriy S. [Department; Filatov, Alexander S. [Department; Hazarika, Abhijit [Department; Wang, Yuanyuan [Department; Hudson, Margaret H. [Department; Sun, Cheng-Jun [Advanced; Chattopadhyay, Soma [Physical; Talapin, Dmitri V. [Department; Center

    2017-07-27

    Here we report the syntheses of largely unexplored lead and bismuth chalcogenidometallates in the solution phase. Using N2H4 as the solvent, new compounds such as K6Pb3Te6·7N2H4 were obtained. These soluble molecular compounds underwent cation exchange processes using resin chemistry, replacing Na+ or K+ by decomposable N2H5+ or tetraethylammonium cations. They also transformed into stoichiometric lead and bismuth chalcogenide nanomaterials with the addition of metal salts. Such a versatile chemistry led to a variety of composition-matched solders to join lead and bismuth chalcogenides and tune their charge transport properties at the grain boundaries. Solution-processed thin films composed of Bi0.5Sb1.5Te3 microparticles soldered by (N2H5)6Bi0.5Sb1.5Te6 exhibited thermoelectric power factors (~28 μW/cm K2) comparable to those in vacuum-deposited Bi0.5Sb1.5Te3 films. The soldering effect can also be integrated with attractive fabrication techniques for thermoelectric modules, such as screen printing, suggesting the potential of these solders in the rational design of printable and moldable thermoelectrics.

  14. Horizon shells and BMS-like soldering transformations

    Energy Technology Data Exchange (ETDEWEB)

    Blau, Matthias [Albert Einstein Center for Fundamental Physics,Institute for Theoretical Physics, University of Bern,Sidlerstrasse 5, 3012 Bern (Switzerland); O’Loughlin, Martin [University of Nova Gorica,Vipavska 13, 5000 Nova Gorica (Slovenia)

    2016-03-07

    We revisit the theory of null shells in general relativity, with a particular emphasis on null shells placed at horizons of black holes. We study in detail the considerable freedom that is available in the case that one solders two metrics together across null hypersurfaces (such as Killing horizons) for which the induced metric is invariant under translations along the null generators. In this case the group of soldering transformations turns out to be infinite dimensional, and these solderings create non-trivial horizon shells containing both massless matter and impulsive gravitational wave components. We also rephrase this result in the language of Carrollian symmetry groups. To illustrate this phenomenon we discuss in detail the example of shells on the horizon of the Schwarzschild black hole (with equal interior and exterior mass), uncovering a rich classical structure at the horizon and deriving an explicit expression for the general horizon shell energy-momentum tensor. In the special case of BMS-like soldering supertranslations we find a conserved shell-energy that is strikingly similar to the standard expression for asymptotic BMS supertranslation charges, suggesting a direct relation between the physical properties of these horizon shells and the recently proposed BMS supertranslation hair of a black hole.

  15. Microstructural effects on constitutive and fatigue fracture behavior of TinSilverCopper solder

    Science.gov (United States)

    Tucker, Jonathon P.

    As microelectronic package construction becomes more diverse and complex, the need for accurate, geometry-independent material constitutive and failure models increases. Evaluations of packages based on accelerated environmental tests (such as accelerated thermal cycling or power cycling) only provide package-dependent reliability information. In addition, extrapolations of such test data to life predictions under field conditions are often empirical. Besides geometry, accelerated environmental test data must account for microstructural factors such as alloy composition or isothermal aging condition, resulting in expensive experimental variation. In this work, displacement-controlled, creep, and fatigue lap shear tests are conducted on specially designed SnAgCu test specimens with microstructures representative to those found in commercial microelectronic packages. The data are used to develop constitutive and fatigue fracture material models capable of describing deformation and fracture behavior for the relevant temperature and strain rate ranges. Furthermore, insight is provided into the microstructural variation of solder joints and the subsequent effect on material behavior. These models are appropriate for application to packages of any geometrical construction. The first focus of the thesis is on Pb-mixed SnAgCu solder alloys. During the transition from Pb-containing solders to Pb-free solders, joints composed of a mixture of SnPb and SnAgCu often result from either mixed assemblies or rework. Three alloys of 1, 5 and 20 weight percent Pb were selected so as to represent reasonable ranges of Pb contamination expected from different 63Sn37Pb components mixed with Sn3.0Ag0.5Cu. Displacement-controlled (constant strain rate) and creep tests were performed at temperatures of 25°C, 75°C, and 125°C using a double lap shear test setup that ensures a nearly homogeneous state of plastic strain at the joint interface. Rate-dependent constitutive models for Pb

  16. Thermal cyclic test for Sn-4Ag-0.5Cu solders on high P Ni/Au and Ni/Pd/Au surface finishes

    Directory of Open Access Journals (Sweden)

    M.A. Azmah Hanim

    2015-12-01

    Full Text Available In electronic packaging, the reliability of the interconnection changes with the surface finish and the type of solders being used. Thermal cycling is one method of reliability assessment. In thermal cycling experiments, the strain state is simplified by soldering together regular shaped pieces of materials with different coefficients of thermal expansion and exposing the joint to repeated fluctuations of temperature within a certain range. Thus, this study focuses on the intermetallic evolution of Sn-4Ag-0.5Cu on Ni/Au and Ni/Pd/Au surface finishes with thermal cycling up to 1000 cycles with the range of temperature varying from 10 to 80 °C. Sandwich samples were prepared by placing solder balls of Sn-4Ag-0.5Cu between two substrates of two different surface finishes: Ni/Au and Ni/Pd/Au. Optical microscope and FESEM (Field emission scanning electron microscope were used to analyze the samples. From the study, it was observed that the intermetallic changes from (Cu, Ni6Sn5 to (Ni, Cu3Sn4 after 1000 thermal cycles for Ni/Au. These changes promote the formation of cracks at the solder joint because of the different mechanical properties between Ni-Sn based intermetallic and Cu-Sn intermetallics. However, for the Ni/Pd/Au surface finishes, no cracks formed after thermal cycling up to 1000 cycles. This shows that the reliability of the solder joint is higher for Ni/Pd/Au surface finishes in this experiment. Based on these results, it can be concluded that the reliability of the Ni/Pd/Au surface finishes with Sn-4Ag-0.5Cu solders is higher within the given condition of this research.

  17. Using a Candidate Gene-Based Genetic Linkage Map to Identify QTL for Winter Survival in Perennial Ryegrass.

    Directory of Open Access Journals (Sweden)

    Cristiana Paina

    Full Text Available Important agronomical traits in perennial ryegrass (Lolium perenne breeding programs such as winter survival and heading date, are quantitative traits that are generally controlled by multiple loci. Individually, these loci have relatively small effects. The aim of this study was to develop a candidate gene based Illumina GoldenGate 1,536-plex assay, containing single nucleotide polymorphism markers designed from transcripts involved in response to cold acclimation, vernalization, and induction of flowering. The assay was used to genotype a mapping population that we have also phenotyped for winter survival to complement the heading date trait previously mapped in this population. A positive correlation was observed between strong vernalization requirement and winter survival, and some QTL for winter survival and heading date overlapped on the genetic map. Candidate genes were located in clusters along the genetic map, some of which co-localized with QTL for winter survival and heading date. These clusters of candidate genes may be used in candidate gene based association studies to identify alleles associated with winter survival and heading date.

  18. Solder wetting behavior enhancement via laser-textured surface microcosmic topography

    Energy Technology Data Exchange (ETDEWEB)

    Chen, Haiyan [State Key Laboratory of Solidification Processing, Northwestern Polytechnical University, Xi’an 710072 (China); Shaanxi Key Laboratory of Friction Welding Technologies, Xi’an 710072 (China); Peng, Jianke [Shaanxi Key Laboratory of Friction Welding Technologies, Xi’an 710072 (China); Fu, Li, E-mail: fuli@nwpu.edu.cn [State Key Laboratory of Solidification Processing, Northwestern Polytechnical University, Xi’an 710072 (China); Shaanxi Key Laboratory of Friction Welding Technologies, Xi’an 710072 (China); Wang, Xincheng [Shaanxi Key Laboratory of Friction Welding Technologies, Xi’an 710072 (China); Xie, Yan [School of Materials Science and Engineering, Tianjin University, Tianjin 300072 (China)

    2016-04-15

    Graphical abstract: - Highlights: • The wetting angle of lead free solder on Cu was reduced by surface microstructure. • The wetting form of Sn-Ag-Cu solder on Cu was “non-composite surface”. • The experimental results had a sound fit with the theoretical calculation. - Abstract: In order to reduce or even replace the use of Sn-Pb solder in electronics industry, the laser-textured surface microstructures were used to enhance the wetting behavior of lead free solder during soldering. According to wetting theory and Sn-Ag-Cu lead free solder performance, we calculated and designed four microcosmic structures with the similar shape and different sizes to control the wetting behavior of lead free solder. The micro-structured surfaces with different dimensions were processed on copper plates by fiber femtosecond laser, and the effect of microstructures on wetting behavior was verified experimentally. The results showed that the wetting angle of Sn-Ag-Cu solder on the copper plate with microstructures decreased effectively compared with that on the smooth copper plate. The wetting angles had a sound fit with the theoretical values calculated by wetting model. The novel method provided a feasible route for adjusting the wetting behavior of solders and optimizing solders system.

  19. Solder wetting behavior enhancement via laser-textured surface microcosmic topography

    International Nuclear Information System (INIS)

    Chen, Haiyan; Peng, Jianke; Fu, Li; Wang, Xincheng; Xie, Yan

    2016-01-01

    Graphical abstract: - Highlights: • The wetting angle of lead free solder on Cu was reduced by surface microstructure. • The wetting form of Sn-Ag-Cu solder on Cu was “non-composite surface”. • The experimental results had a sound fit with the theoretical calculation. - Abstract: In order to reduce or even replace the use of Sn-Pb solder in electronics industry, the laser-textured surface microstructures were used to enhance the wetting behavior of lead free solder during soldering. According to wetting theory and Sn-Ag-Cu lead free solder performance, we calculated and designed four microcosmic structures with the similar shape and different sizes to control the wetting behavior of lead free solder. The micro-structured surfaces with different dimensions were processed on copper plates by fiber femtosecond laser, and the effect of microstructures on wetting behavior was verified experimentally. The results showed that the wetting angle of Sn-Ag-Cu solder on the copper plate with microstructures decreased effectively compared with that on the smooth copper plate. The wetting angles had a sound fit with the theoretical values calculated by wetting model. The novel method provided a feasible route for adjusting the wetting behavior of solders and optimizing solders system.

  20. Study on the Tensile Creep Behavior of Carbon Nanotubes-Reinforced Sn-58Bi Solder Joints

    Science.gov (United States)

    Yang, Li; Liu, Haixiang; Zhang, Yaocheng

    2018-01-01

    The microstructure and tensile creep behavior of plain Sn-58Bi solder and carbon nanotubes (CNTs)-reinforced composite solder joints were investigated. The stress exponent n under different stresses and the creep activation energy Q c under different temperatures of solder joints were obtained by an empirical equation. The results reveal that the microstructure of the composite solder joint is refined and the tensile creep resistance is improved by CNTs. The improvement of creep behavior is due to the microstructural change of the composite solder joints, since the CNTs could provide more obstacles for dislocation pile-up, which enhances the values of the stress exponent and the creep activation energy. The steady-state tensile creep rates of plain solder and composite solder joints are increased with increasing temperature and applied stress. The tensile creep constitutive equations of plain solder and composite solder joints are written as \\dot{ɛ }_{s1} = 14.94( {σ /G} )^{3.7} \\exp ( { - 81444/RT} ) and \\dot{ɛ }_{s2} = 2.5( {σ /G} )^{4.38} \\exp ( { - 101582/RT} ) , respectively. The tensile creep mechanism of the solder joints is the effects of lattice diffusion determined by dislocation climbing.

  1. Effect of ultrasonic vibration time on the Cu/Sn-Ag-Cu/Cu joint soldered by low-power-high-frequency ultrasonic-assisted reflow soldering.

    Science.gov (United States)

    Tan, Ai Ting; Tan, Ai Wen; Yusof, Farazila

    2017-01-01

    Techniques to improve solder joint reliability have been the recent research focus in the electronic packaging industry. In this study, Cu/SAC305/Cu solder joints were fabricated using a low-power high-frequency ultrasonic-assisted reflow soldering approach where non-ultrasonic-treated samples were served as control sample. The effect of ultrasonic vibration (USV) time (within 6s) on the solder joint properties was characterized systematically. Results showed that the solder matrix microstructure was refined at 1.5s of USV, but coarsen when the USV time reached 3s and above. The solder matrix hardness increased when the solder matrix was refined, but decreased when the solder matrix coarsened. The interfacial intermetallic compound (IMC) layer thickness was found to decrease with increasing USV time, except for the USV-treated sample with 1.5s. This is attributed to the insufficient USV time during the reflow stage and consequently accelerated the Cu dissolution at the joint interface during the post-ultrasonic reflow stage. All the USV-treated samples possessed higher shear strength than the control sample due to the USV-induced-degassing effect. The shear strength of the USV-treated sample with 6s was the lowest among the USV-treated samples due to the formation of plate-like Ag 3 Sn that may act as the crack initiation site. Copyright © 2016 Elsevier B.V. All rights reserved.

  2. Fully Pipelined Parallel Architecture for Candidate Block and Pixel-Subsampling-Based Motion Estimation

    Directory of Open Access Journals (Sweden)

    Reeba Korah

    2008-01-01

    Full Text Available This paper presents a low power and high speed architecture for motion estimation with Candidate Block and Pixel Subsampling (CBPS Algorithm. Coarse-to-fine search approach is employed to find the motion vector so that the local minima problem is totally eliminated. Pixel subsampling is performed in the selected candidate blocks which significantly reduces computational cost with low quality degradation. The architecture developed is a fully pipelined parallel design with 9 processing elements. Two different methods are deployed to reduce the power consumption, parallel and pipelined implementation and parallel accessing to memory. For processing 30 CIF frames per second our architecture requires a clock frequency of 4.5 MHz.

  3. Machines vs Malaria: a flow-based preparation of the drug candidate OZ439

    OpenAIRE

    Lau, Shing Hing; Galván, Alicia; Merchant, Rohan R; Battilocchio, Claudio; Souto, José A; Berry, Malcolm B; Ley, Steven Victor

    2015-01-01

    An efficient preparation of the antimalarial drug candidate OZ439, which was obtained by integrating a machine-assisted approach with batch processes, is reported. This approach allows a rapid and cost-effective production of the key intermediates that were readily elaborated into the target molecule. We are grateful to Croucher Foundation and Cambridge Trust (SHL), MEC-Spain (FPU-predoctoral grants, AG), Pfizer World-wide Research and Development (CB), the Xunta de Galicia Gov-ernment (JA...

  4. Characterization nanoparticles-based vaccines and vaccine candidates: a Transmission Electron Microscopy study

    Directory of Open Access Journals (Sweden)

    I. Menéndez I

    2016-05-01

    Full Text Available Transmission Electron Microscopy (TEM is a valuable tool for the biotech industry. This paper summarizes some of the contributions of MET in the characterization of the recombinant antigens are part of vaccines or vaccine candidates obtained in the CIGB. It mentions the use of complementary techniques MET (Negative staining, and immunoelectron that enhance visualization and ultrastructural characterization of the recombinant proteins obtained by Genetic Engineering.

  5. Identification of Novel Potential Vaccine Candidates against Tuberculosis Based on Reverse Vaccinology

    Directory of Open Access Journals (Sweden)

    Gloria P. Monterrubio-López

    2015-01-01

    Full Text Available Tuberculosis (TB is a chronic infectious disease, considered as the second leading cause of death worldwide, caused by Mycobacterium tuberculosis. The limited efficacy of the bacillus Calmette-Guérin (BCG vaccine against pulmonary TB and the emergence of multidrug-resistant TB warrants the need for more efficacious vaccines. Reverse vaccinology uses the entire proteome of a pathogen to select the best vaccine antigens by in silico approaches. M. tuberculosis H37Rv proteome was analyzed with NERVE (New Enhanced Reverse Vaccinology Environment prediction software to identify potential vaccine targets; these 331 proteins were further analyzed with VaxiJen for the determination of their antigenicity value. Only candidates with values ≥0.5 of antigenicity and 50% of adhesin probability and without homology with human proteins or transmembrane regions were selected, resulting in 73 antigens. These proteins were grouped by families in seven groups and analyzed by amino acid sequence alignments, selecting 16 representative proteins. For each candidate, a search of the literature and protein analysis with different bioinformatics tools, as well as a simulation of the immune response, was conducted. Finally, we selected six novel vaccine candidates, EsxL, PE26, PPE65, PE_PGRS49, PBP1, and Erp, from M. tuberculosis that can be used to improve or design new TB vaccines.

  6. Identification of plasma biomarker candidates in glioblastoma using an antibody-array-based proteomic approach

    International Nuclear Information System (INIS)

    Zupancic, Klemen; Blejec, Andrej; Herman, Ana; Veber, Matija; Verbovsek, Urska; Korsic, Marjan; Knezevic, Miomir; Rozman, Primoz; Turnsek, Tamara Lah; Gruden, Kristina; Motaln, Helena

    2014-01-01

    Glioblastoma multiforme (GBM) is a brain tumour with a very high patient mortality rate, with a median survival of 47 weeks. This might be improved by the identification of novel diagnostic, prognostic and predictive therapy-response biomarkers, preferentially through the monitoring of the patient blood. The aim of this study was to define the impact of GBM in terms of alterations of the plasma protein levels in these patients. We used a commercially available antibody array that includes 656 antibodies to analyse blood plasma samples from 17 healthy volunteers in comparison with 17 blood plasma samples from patients with GBM. We identified 11 plasma proteins that are statistically most strongly associated with the presence of GBM. These proteins belong to three functional signalling pathways: T-cell signalling and immune responses; cell adhesion and migration; and cell-cycle control and apoptosis. Thus, we can consider this identified set of proteins as potential diagnostic biomarker candidates for GBM. In addition, a set of 16 plasma proteins were significantly associated with the overall survival of these patients with GBM. Guanine nucleotide binding protein alpha (GNAO1) was associated with both GBM presence and survival of patients with GBM. Antibody array analysis represents a useful tool for the screening of plasma samples for potential cancer biomarker candidates in small-scale exploratory experiments; however, clinical validation of these candidates requires their further evaluation in a larger study on an independent cohort of patients

  7. A control algorithm for waveguide path induction soldering with product positioning1

    Science.gov (United States)

    Tynchenko, V. S.; Murygin, A. V.; Petrenko, V. E.; Seregin, Yu N.; Emilova, O. A.

    2017-10-01

    In the article, the problem of developing a control algorithm is described for the induction soldering process of aluminium alloy waveguide paths. The authors suggest a solution using logic controllers in two loops: controlling the speed at which product elements heat up and controlling the waveguide assembly movement relative to the plane of the inductor. The proposed solutions are based on the analysis of the thermal processes occurring in the waveguide pipe and the flange/coupler. Based on the results of numerical experiments, forms of control actions in the system and their parameters were selected. The proposed approach to generating such a control was tested in a series of waveguide path soldering field experiments and the obtained graphs showing the heating of product elements allow the efficiency of the developed logic controllers to be confirmed. The application of the proposed approach provides the high quality regulation of the induction heating process and also the possibility to obtain reliable permanent connections between elements of waveguide paths. Through the flexible adjustment of the proposed logic controller parameters, the high versatility of their use can be demonstrated.

  8. Characteristics of Creep Damage for 60Sn-40Pb Solder Material

    Energy Technology Data Exchange (ETDEWEB)

    Wei, Y.; Chow, C.L.; Fang, H.E.; Neilsen, M.K.

    1999-08-26

    This paper presents a viscoplasticity model taking into account the effects of change in grain or phase size and damage on the characterization of creep damage in 60Sn-40Pb solder. Based on the theory of damage mechanics, a two-scalar damage model is developed for isotropic materials by introducing the free energy equivalence principle. The damage evolution equations are derived in terms of the damage energy release rates. In addition, a failure criterion is developed based on the postulation that a material element is said to have ruptured when the total damage accumulated in the element reaches a critical value. The damage coupled viscoplasticity model is discretized and coded in a general-purpose finite element program known as ABAQUS through its user-defined material subroutine UMAT. To illustrate the application of the model, several example cases are introduced to analyze, both numerically and experimentally, the tensile creep behaviors of the material at three stress levels. The model is then applied to predict the deformation of a notched specimen under monotonic tension at room temperature (22 C). The results demonstrate that the proposed model can successfully predict the viscoplastic behavior of the solder material.

  9. Contamination profile of Printed Circuit Board Assemblies in relation to soldering types and conformal coating

    DEFF Research Database (Denmark)

    Conseil, Helene; Jellesen, Morten Stendahl; Ambat, Rajan

    2014-01-01

    Typical printed circuit board assemblies (PCBAs) processed by reflow, wave, or selective wave soldering were analysed for typical levels of process related residues, resulting from a specific or combination of soldering process. Typical solder flux residue distribution pattern, composition...... by measuring the leak current using a twin platinum electrode setup. Localized extraction of residue was carried out using a commercial C3 extraction system. Results clearly show that the amount and distribution of flux residues are a function of the soldering process, and the level can be reduced...... by an appropriate cleaning. Selective soldering process generates significantly higher levels of residues compared to the wave and reflow process. For conformal coated PCBAs, the contamination levels generated from the tested wave and selective soldering process are found to be enough to generate blisters under...

  10. Contamination profile on typical printed circuit board assemblies vs soldering process

    DEFF Research Database (Denmark)

    Conseil, Helene; Jellesen, Morten Stendahl; Ambat, Rajan

    2014-01-01

    Purpose – The purpose of this paper was to analyse typical printed circuit board assemblies (PCBAs) processed by reflow, wave or selective wave soldering for typical levels of process-related residues, resulting from a specific or combination of soldering processes. Typical solder flux residue...... out using a commercial critical contamination control extraction system. Findings – Results clearly show that the amount and distribution of flux residues are a function of the soldering process, and the level can be reduced by an appropriate cleaning. Selective soldering process generates...... significantly higher levels of residues compared to the wave and reflow process. For conformal coated PCBAs, the contamination levels generated from the tested wave and selective soldering process are found to be enough to generate blisters under exposure to high humidity levels. Originality/value – Although...

  11. Candidate genes and genetic architecture of symbiotic and agronomic traits revealed by whole-genome, sequence-based association genetics in Medicago truncatula.

    Directory of Open Access Journals (Sweden)

    John Stanton-Geddes

    Full Text Available Genome-wide association study (GWAS has revolutionized the search for the genetic basis of complex traits. To date, GWAS have generally relied on relatively sparse sampling of nucleotide diversity, which is likely to bias results by preferentially sampling high-frequency SNPs not in complete linkage disequilibrium (LD with causative SNPs. To avoid these limitations we conducted GWAS with >6 million SNPs identified by sequencing the genomes of 226 accessions of the model legume Medicago truncatula. We used these data to identify candidate genes and the genetic architecture underlying phenotypic variation in plant height, trichome density, flowering time, and nodulation. The characteristics of candidate SNPs differed among traits, with candidates for flowering time and trichome density in distinct clusters of high linkage disequilibrium (LD and the minor allele frequencies (MAF of candidates underlying variation in flowering time and height significantly greater than MAF of candidates underlying variation in other traits. Candidate SNPs tagged several characterized genes including nodulation related genes SERK2, MtnodGRP3, MtMMPL1, NFP, CaML3, MtnodGRP3A and flowering time gene MtFD as well as uncharacterized genes that become candidates for further molecular characterization. By comparing sequence-based candidates to candidates identified by in silico 250K SNP arrays, we provide an empirical example of how reliance on even high-density reduced representation genomic makers can bias GWAS results. Depending on the trait, only 30-70% of the top 20 in silico array candidates were within 1 kb of sequence-based candidates. Moreover, the sequence-based candidates tagged by array candidates were heavily biased towards common variants; these comparisons underscore the need for caution when interpreting results from GWAS conducted with sparsely covered genomes.

  12. Fast-Solving Quasi-Optimal LS-S3VM Based on an Extended Candidate Set.

    Science.gov (United States)

    Ma, Yuefeng; Liang, Xun; Kwok, James T; Li, Jianping; Zhou, Xiaoping; Zhang, Haiyan

    2018-04-01

    The semisupervised least squares support vector machine (LS-S 3 VM) is an important enhancement of least squares support vector machines in semisupervised learning. Given that most data collected from the real world are without labels, semisupervised approaches are more applicable than standard supervised approaches. Although a few training methods for LS-S 3 VM exist, the problem of deriving the optimal decision hyperplane efficiently and effectually has not been solved. In this paper, a fully weighted model of LS-S 3 VM is proposed, and a simple integer programming (IP) model is introduced through an equivalent transformation to solve the model. Based on the distances between the unlabeled data and the decision hyperplane, a new indicator is designed to represent the possibility that the label of an unlabeled datum should be reversed in each iteration during training. Using the indicator, we construct an extended candidate set consisting of the indices of unlabeled data with high possibilities, which integrates more information from unlabeled data. Our algorithm is degenerated into a special scenario of the previous algorithm when the extended candidate set is reduced into a set with only one element. Two strategies are utilized to determine the descent directions based on the extended candidate set. Furthermore, we developed a novel method for locating a good starting point based on the properties of the equivalent IP model. Combined with the extended candidate set and the carefully computed starting point, a fast algorithm to solve LS-S 3 VM quasi-optimally is proposed. The choice of quasi-optimal solutions results in low computational cost and avoidance of overfitting. Experiments show that our algorithm equipped with the two designed strategies is more effective than other algorithms in at least one of the following three aspects: 1) computational complexity; 2) generalization ability; and 3) flexibility. However, our algorithm and other algorithms have

  13. Investigation of moisture uptake into printed circuit board laminate and solder mask materials

    DEFF Research Database (Denmark)

    Conseil, Helene; Gudla, Visweswara Chakravarthy; Borgaonkar, Shruti

    2017-01-01

    with different solder mask materials and exposed to saturated water vapour and liquid water. The solder masks are characterised for their microstructure and constituent phases using scanning electron microscopy and X-ray diffraction. The observations are correlated with themoisture absorption characteristic...... such as diffusivity, permeability, and solubility. In addition, the effect of a reflow soldering simulation on microstructural changes and onincrease of water uptake of the materials has been analysed...

  14. The Candidate

    OpenAIRE

    Osborn, John C

    2013-01-01

    ABSTRACT   The Candidate is an attempt to marry elements of journalism and gaming into a format that both entertains and educates the player. The Google-AP Scholarship, a new scholarship award that is given to several journalists a year to work on projects at the threshold of technology and journalism, funded the project. The objective in this prototype version of the game is to put the player in the shoes of a congressional candidate during an off-year election, specificall...

  15. Application of CO2 laser for electronic components soldering

    Science.gov (United States)

    Mascorro-Pantoja, J.; Soto-Bernal, J. J.; Nieto-Pérez, M.; Gonzalez-Mota, R.; Rosales-Candelas, I.

    2011-10-01

    Laser provides a high controllable and localized spot for soldering joint formation and this is a valuable tool in Sn/Pb Soldering process on electronic industry, in recent years, laser beam welding has become an emerging welding technique, the use of laser in welding area is a high efficiency method. A 60 Watts CO2 continuous laser was used on this study, during welding experimental results indicated the laser could significantly improve speed and weld quality. In this work, the welding interactions of CO2 laser with Sn/Pb wire have been investigated in details through varying the energy ratios of laser. And at the same time, the effect of distance from laser spot to material.

  16. Statistical and Physical Analyses of Electromigration-induced Failure in Lead-free Flip Chip Solder Joints

    Science.gov (United States)

    Choi, Daechul

    While electromigration in Al and Cu interconnects has been a persistent reliability issue in microelectronic industry, the trend of miniaturization in wireless and portable devices has caused electromigration in Pb-free flip chip solder joints to become another most challenging problem in electronic manufacturing industry. Up to now, the link between statistical and physical analyses of electromigration failure is weak, for example, we do not have a deep understanding of the reliability failure on the basis of kinetics of void nucleation and growth. In this study, we intend to make a direct link between Weibull distribution of Pb-free flip chip solder joint failure and Johnson-Mehl-Avrami's equations of phase transformations in terms of void nucleation and growth based on the assumption that void nucleation and propagation can be treated as a phase transformation induced by electromigration in the interconnect which is the main cause of failure in Pb-free solder joints. The statistical failure data from Pb-free flip chip solder joints were systematically collected by DAQ (data acquisition) program which measures in-situ resistance change due to a set of constant current densities stressed at a set of temperatures, and the data were statistically analyzed by Weibull distribution by using Minitab program. The test samples are from industry and the data are reproducible. It is worth mentioning that Weibull distribution function and Avrami's equation have the same mathematical form, and we shall develop the mathematical and physical links between them. Physical analysis of failure was supported by SEM (scanning electron microscope) examination and FIB (focused ion beam) of the cross-section of failed samples, 3-dimensional finite element simulation, and 3-D images obtained by using synchrotron radiation x-ray tomography at Advanced Light Source of Lawrence Berkeley National Laboratory. The final goal of this research is to establish a tool for critical analysis of

  17. Laser soldering of piezoelectric actuator with minimal thermal impact

    OpenAIRE

    Seigneur, Frank; Fournier, Yannick; Maeder, Thomas; Jacot, Jacques

    2007-01-01

    Mechanical and electrical connecting of piezoelectric actuator is often done using conductive glue. Its advantage is not to heat the piezoelectric actuator during connection. But there are many disadvantages to gluing; the main one is curing time. Welding is another alternative, but when done in an oven, the temperature needed for this operation might destroy the heat sensitive actuator. The method described in this paper is laser soldering of piezoelectric actuator. The piezo actuator is mec...

  18. Comparative Tensile Strengths of Non-Precious Dental Alloy Solders.

    Science.gov (United States)

    1981-12-01

    thesis committee. My gratitude is extended to Dr. Charles Swoope and the Education and Research Foundation of Prosthodontics , Seattle, Washington, for...Most casting and soldering techniques used today in dentistry are those which were developed specifically for dental gold alloys. The newer , non...investment; this procedure yielded a more accurate finished casting. III. MATERIALS AND METHODS Dental materials research is carried out primarily to

  19. Trend Inspection Station for Printed Circuit Board Solder Joints.

    Science.gov (United States)

    1979-04-07

    the aid of CIRCON Corp. of Santa Barbara, CA, a leading supplier of micro-video systems. The total system would feature display options as well as a...PCB thus making the TIS a full inspection station for all solder joints. Battelle has used the CIRCON Corporation, a leader in CCTV inspection, as a... CIRCON . Further, their color TV camera is the smallest currently on the market and would be the easiest physically to incorporate into the TIS. Therefore

  20. An Investigation of Immunogenicity of Chitosan-Based Botulinum Neurotoxin E Binding Domain Recombinant Candidate Vaccine via Mucosal Route

    Directory of Open Access Journals (Sweden)

    Mohammad Javad Bagheripour

    2017-01-01

    Full Text Available Background and Objectives: Botulism syndrome is caused by serotypes A-G of neurotoxins of Clostridium genus. Neurotoxin binding domain is an appropriate vaccine candidate due to its immunogenic activity. In this study, the immunogenicity of chitosan-based botulinum neurotoxin E binding domain recombinant candidate vaccine was investigated via mucosal route of administration. Methods: In this experimental study, chitosan nanoparticles containing rBoNT/E protein were synthesized by ionic gelation method and were administered orally and intranasally to mice. After each administration, IgG antibody titer was measured by ELISA method. Finally, all groups were challenged with active botulinum neurotoxin type E. Data were analyzed using Duncan and repeated ANOVA tests. The significance level was considered as p0.05, even intranasal route reduced the immunogenicity.

  1. High temperature corrosion resistance of candidate nickel-based weld overlay alloys in a low NOx environment

    Energy Technology Data Exchange (ETDEWEB)

    Deacon, R.M.; Du Pont, J.N.; Marder, A.R. [Lehigh University, Bethlehem, PA (United States)

    2007-07-15

    Changes in environmental regulations have led many fossil fuel-fired boiler operators to alter their combustion practices (low NOx, burning), thereby lowering plant emissions. This change has led to unacceptable wastage of carbon and low alloy steel waterwall tubes and expensive shutdowns due to severe corrosion. One favored solution is to weld overlay a more corrosion resistant alloy on top of existing tubes. Two nickel-based alloys developed for such applications were tested alongside the commercially available alloy 622 in a simulated low NOx, environment. Electron probe microanalysis (EPMA) examination of the weld overlays and corrosion scales demonstrated that microsegregation of molybdenum occurred in one of the candidate alloys and alloy 622. This microsegregation had a detrimental effect on the corrosion resistance of these alloys. The candidate alloy with higher chromium concentration, low nominal molybdenum concentration, and corresponding minimum molybdenum segregation, exhibited the best corrosion resistance of the examined alloys.

  2. High temperature corrosion resistance of candidate nickel-based weld overlay alloys in a low NO {sub x} environment

    Energy Technology Data Exchange (ETDEWEB)

    Deacon, R.M. [Lehigh University, 5 East Packer Avenue, Bethlehem, PA 18015 (United States)], E-mail: rmd3@lehigh.edu; DuPont, J.N. [Lehigh University, 5 East Packer Avenue, Bethlehem, PA 18015 (United States); Marder, A.R. [Lehigh University, 5 East Packer Avenue, Bethlehem, PA 18015 (United States)

    2007-07-15

    Changes in environmental regulations have led many fossil fuel-fired boiler operators to alter their combustion practices (low NO {sub x} burning), thereby lowering plant emissions. This change has led to unacceptable wastage of carbon and low alloy steel waterwall tubes and expensive shutdowns due to severe corrosion. One favored solution is to weld overlay a more corrosion resistant alloy on top of existing tubes. Two nickel-based alloys developed for such applications were tested alongside the commercially available alloy 622 in a simulated low NO {sub x} environment. Electron probe microanalysis (EPMA) examination of the weld overlays and corrosion scales demonstrated that microsegregation of molybdenum occurred in one of the candidate alloys and alloy 622. This microsegregation had a detrimental effect on the corrosion resistance of these alloys. The candidate alloy with higher chromium concentration, low nominal molybdenum concentration, and corresponding minimum molybdenum segregation, exhibited the best corrosion resistance of the examined alloys.

  3. Reliability of soldered joints for automotive electronic devices; Denso buhin ni okeru handa setsugo no shinraisei

    Energy Technology Data Exchange (ETDEWEB)

    Kita, T.; Mukaibo, N.; Ando, K.; Moriyama, M. [Honda R and D Co. Ltd., Tokyo (Japan)

    1997-10-01

    Concerning the tin and lead eutectic solder, we have evaluated the reliability of three factors of intermetallic compound layer, creep and vibration which cause solder degradation. First, the stress factor was extracted from investigating the mechanism of degradation, and the best acceleration test method was fixed. Next, the acceleration test was executed to find the stress dependency and the tendency of solder degradation was modeled numerically. While the environmental stress frequency was obtained and they were put together by using a minor method, which enabled us to predict the life span of solder on the market with precision. 5 refs., 13 figs.

  4. Electromigration in 3D-IC scale Cu/Sn/Cu solder joints

    Energy Technology Data Exchange (ETDEWEB)

    Ho, Cheng-En, E-mail: ceho1975@hotmail.com; Lee, Pei-Tzu; Chen, Chih-Nan; Yang, Cheng-Hsien

    2016-08-15

    The electromigration effect on the three-dimensional integrated circuits (3D-IC) scale solder joints with a Cu/Sn(25–50 μm)/Cu configuration was investigated using a field-emission scanning electron microscope (FE–SEM) combined with electron backscatter diffraction (EBSD) analysis system. Electron current stressing for a few days caused the pronounced accumulation of Cu{sub 6}Sn{sub 5} in specific Sn grain boundaries (GBs). The EBSD analysis indicated that both the β-Sn crystallographic orientation and GB orientation play dominant roles in this accumulation. The dependencies of the Cu{sub 6}Sn{sub 5} accumulation on the two above factors (i.e., Sn grain orientation and GB orientation) can be well rationalized via a proposed mathematic model based on the Huntington and Grone's electromigration theory with the Cu anisotropic diffusion data in a β-Sn lattice. - Highlights: • Anisotropic Cu electromigration in the 3D-IC scale microelectronic solder joints. • Pronounced accumulation of Cu{sub 6}Sn{sub 5} intermetallic in specific Sn grain boundaries. • A linear dependence of Cu{sub 6}Sn{sub 5} accumulation over the current stressing time. • β-Sn and grain boundary orientations are the dominant factors in Cu{sub 6}Sn{sub 5} accumulation.

  5. Imputation-based analysis of association studies: candidate regions and quantitative traits.

    Directory of Open Access Journals (Sweden)

    Bertrand Servin

    2007-07-01

    Full Text Available We introduce a new framework for the analysis of association studies, designed to allow untyped variants to be more effectively and directly tested for association with a phenotype. The idea is to combine knowledge on patterns of correlation among SNPs (e.g., from the International HapMap project or resequencing data in a candidate region of interest with genotype data at tag SNPs collected on a phenotyped study sample, to estimate ("impute" unmeasured genotypes, and then assess association between the phenotype and these estimated genotypes. Compared with standard single-SNP tests, this approach results in increased power to detect association, even in cases in which the causal variant is typed, with the greatest gain occurring when multiple causal variants are present. It also provides more interpretable explanations for observed associations, including assessing, for each SNP, the strength of the evidence that it (rather than another correlated SNP is causal. Although we focus on association studies with quantitative phenotype and a relatively restricted region (e.g., a candidate gene, the framework is applicable and computationally practical for whole genome association studies. Methods described here are implemented in a software package, Bim-Bam, available from the Stephens Lab website http://stephenslab.uchicago.edu/software.html.

  6. Finding candidate drugs for hepatitis C based on chemical-chemical and chemical-protein interactions.

    Directory of Open Access Journals (Sweden)

    Lei Chen

    Full Text Available Hepatitis C virus (HCV is an infectious virus that can cause serious illnesses. Only a few drugs have been reported to effectively treat hepatitis C. To have greater diversity in drug choice and better treatment options, it is necessary to develop more drugs to treat the infection. However, it is time-consuming and expensive to discover candidate drugs using experimental methods, and computational methods may complement experimental approaches as a preliminary filtering process. This type of approach was proposed by using known chemical-chemical interactions to extract interactive compounds with three known drug compounds of HCV, and the probabilities of these drug compounds being able to treat hepatitis C were calculated using chemical-protein interactions between the interactive compounds and HCV target genes. Moreover, the randomization test and expectation-maximization (EM algorithm were both employed to exclude false discoveries. Analysis of the selected compounds, including acyclovir and ganciclovir, indicated that some of these compounds had potential to treat the HCV. Hopefully, this proposed method could provide new insights into the discovery of candidate drugs for the treatment of HCV and other diseases.

  7. Influence of Difference Solders Volume on Intermetallic Growth of Sn-4.0Ag-0.5Cu/ENEPIG

    Directory of Open Access Journals (Sweden)

    Saliza Azlina O.

    2016-01-01

    Full Text Available In recent years, portable electronic packaging products such as smart phones, tablets, notebooks and other gadgets have been developed with reduced size of component packaging, light weight, high speed and with enhanced performance. Thus, flip chip technology with smaller solder sphere sizes that would produce fine solder joint interconnections have become essential in order to fulfill these miniaturization requirements. This study investigates the interfacial reactions and intermetallics formation during reflow soldering and isothermal aging between Sn-4.0Ag-0.5Cu (SAC405 and electroless nickel/immersion palladium/immersion gold (EN(PEPIG. Solder diameters of 300 μm and 700 μm were used to compare the effect of solder volume on the solder joint microstructure. The solid state isothermal aging was performed at 125°C starting from 250 hours until 2000 hours. The results revealed that only (Cu,Ni6Sn5 IMC was found at the interface during reflow soldering while both (Cu,Ni6Sn5 and (Ni,Cu3Sn4 IMC have been observed after aging process. Smaller solder sizes produced thinner IMC than larger solder joints investigated after reflow soldering, whereas the larger solders produced thinner IMC than the smaller solders after isothermal aging. Aging duration of solder joints has been found to be increase the IMC’s thickness and changed the IMC morphologies to spherical-shaped, compacted and larger grain size.

  8. Anti-Lyme Subunit Vaccines: Design and Development of Peptide-Based Vaccine Candidates.

    Science.gov (United States)

    Small, Christina M; Mwangi, Waithaka; Esteve-Gassent, Maria D

    2016-01-01

    Vaccinology today has been presented with several avenues to improve protection against infectious disease. The recent employment of the reverse vaccinology technique has changed the face of vaccine development against many pathogens, including Borrelia burgdorferi, the causative agent of Lyme disease. Using this technique, genomics and in silico analyses come together to identify potentially antigenic epitopes in a high-throughput fashion. The forward methodology of vaccine development was used previously to generate the only licensed human vaccine for Lyme disease, which is no longer on the market. Using reverse vaccinology to identify new antigens and isolate specific epitopes to protect against B. burgdorferi, subunit vaccines will be generated that lack reactogenic and nonspecific epitopes, yielding more effective vaccine candidates. Additionally, novel epitopes are being utilized and are presently in the commercialization pipeline both for B. burgdorferi and other spirochaetal pathogens. The versatility and methodology of the subunit protein vaccine are described as it pertains to Lyme disease from conception to performance evaluation.

  9. Chronic obstructive pulmonary disease candidate gene prioritization based on metabolic networks and functional information.

    Directory of Open Access Journals (Sweden)

    Xinyan Wang

    Full Text Available Chronic obstructive pulmonary disease (COPD is a multi-factor disease, in which metabolic disturbances played important roles. In this paper, functional information was integrated into a COPD-related metabolic network to assess similarity between genes. Then a gene prioritization method was applied to the COPD-related metabolic network to prioritize COPD candidate genes. The gene prioritization method was superior to ToppGene and ToppNet in both literature validation and functional enrichment analysis. Top-ranked genes prioritized from the metabolic perspective with functional information could promote the better understanding about the molecular mechanism of this disease. Top 100 genes might be potential markers for diagnostic and effective therapies.

  10. A recombinant, chimeric tetravalent dengue vaccine candidate based on a dengue virus serotype 2 backbone.

    Science.gov (United States)

    Osorio, Jorge E; Wallace, Derek; Stinchcomb, Dan T

    2016-01-01

    Dengue fever is caused by infection with one of four dengue virus (DENV) serotypes (DENV-1-4), necessitating tetravalent dengue vaccines that can induce protection against all four DENV. Takeda's live attenuated tetravalent dengue vaccine candidate (TDV) comprises an attenuated DENV-2 strain plus chimeric viruses containing the prM and E genes of DENV-1, -3 and -4 cloned into the attenuated DENV-2 'backbone'. In Phase 1 and 2 studies, TDV was well tolerated by children and adults aged 1.5-45 years, irrespective of prior dengue exposure; mild injection-site symptoms were the most common adverse events. TDV induced neutralizing antibody responses and seroconversion to all four DENV as well as cross-reactive T cell-mediated responses that may be necessary for broad protection against dengue fever.

  11. Thermal Cycling Life Prediction of Sn-3.0Ag-0.5Cu Solder Joint Using Type-I Censored Data

    Directory of Open Access Journals (Sweden)

    Jinhua Mi

    2014-01-01

    Full Text Available Because solder joint interconnections are the weaknesses of microelectronic packaging, their reliability has great influence on the reliability of the entire packaging structure. Based on an accelerated life test the reliability assessment and life prediction of lead-free solder joints using Weibull distribution are investigated. The type-I interval censored lifetime data were collected from a thermal cycling test, which was implemented on microelectronic packaging with lead-free ball grid array (BGA and fine-pitch ball grid array (FBGA interconnection structures. The number of cycles to failure of lead-free solder joints is predicted by using a modified Engelmaier fatigue life model and a type-I censored data processing method. Then, the Pan model is employed to calculate the acceleration factor of this test. A comparison of life predictions between the proposed method and the ones calculated directly by Matlab and Minitab is conducted to demonstrate the practicability and effectiveness of the proposed method. At last, failure analysis and microstructure evolution of lead-free solders are carried out to provide useful guidance for the regular maintenance, replacement of substructure, and subsequent processing of electronic products.

  12. Study on the Reliability of Carbon Nanotube-Reinforced Sn-58Bi Lead-Free Solder Joints

    Science.gov (United States)

    Yang, Li; Liu, Haixiang; Zhang, Yaocheng; Yu, Huakuan

    2017-12-01

    The wettability, microstructure and mechanical properties of multi-walled carbon nanotube (CNT)-reinforced Sn-58Bi composite solder joints were investigated. The results indicate that the wettability of the Sn-58Bi solder is improved and the growth of interfacial intermetallic (IMC) compounds for solder joints is restrained by CNTs. The thickness of the IMC layers is decreased with increasing CNTs concentration. The microstructure of the Sn-58Bi composite solders is refined, the maximum tensile strength and shear strength are obtained by adding the optimum CNTs content about 0.01 wt.%. However, excessive content of CNTs addition can deteriorate the properties. The creep rupture life of Sn-58Bi solder joint and Sn-58Bi-0.01CNTs solder joint is decreased with increasing load, temperature and current density. The average creep rupture life of Sn-58Bi-0.01CNTs composite solder joint is 60% higher than that of the plain solder joint.

  13. Finite element analysis and neural network model for electronic hidden solder joint geometry prediction

    Science.gov (United States)

    Giron Palomares, Jose Benjamin Dolores; Hsieh, Sheng-Jen

    2010-05-01

    This paper investigates an active thermography approach to probing hidden solder joint geometry. Ten boards were fabricated with the same number of solder joints and amount of solder paste (0.061 g), but using three solder joint geometries (60°, 90°, and 120°). The 90° angle solder pin represented a normal joint, and the 60° and 120° angle pins represented abnormal solder joints. Each board was covered with another board that had three openings just big enough to allow the pin terminals to protrude. A semi-automated system was built to heat and then transfer each board set to a chamber where an infrared camera was used to scan the board as it was cooling down. Each board set underwent the heating, cooling, and scanning process for five trials. Two-thirds of the data set was used for model development and one-third for model evaluation. An artificial neural network (ANN) was constructed to predict abnormal joints given thermal data. Results suggest that solder joints with more surface area cool much faster than those with less surface area. A Finite Element Analysis (FEA) of the heating up and cooling down process consistently predicted solder geometry using the ANN with 86% accuracy. This approach can be used not only to inspect bad solder joints (i.e., low reliability) but also to mass screen for cold solder joints during BGA assembly, since the air gaps in cold solder joints may cause them to cool more slowly than normal joints.

  14. Far-Infrared Based Pedestrian Detection for Driver-Assistance Systems Based on Candidate Filters, Gradient-Based Feature and Multi-Frame Approval Matching

    Directory of Open Access Journals (Sweden)

    Guohua Wang

    2015-12-01

    Full Text Available Far-infrared pedestrian detection approaches for advanced driver-assistance systems based on high-dimensional features fail to simultaneously achieve robust and real-time detection. We propose a robust and real-time pedestrian detection system characterized by novel candidate filters, novel pedestrian features and multi-frame approval matching in a coarse-to-fine fashion. Firstly, we design two filters based on the pedestrians’ head and the road to select the candidates after applying a pedestrian segmentation algorithm to reduce false alarms. Secondly, we propose a novel feature encapsulating both the relationship of oriented gradient distribution and the code of oriented gradient to deal with the enormous variance in pedestrians’ size and appearance. Thirdly, we introduce a multi-frame approval matching approach utilizing the spatiotemporal continuity of pedestrians to increase the detection rate. Large-scale experiments indicate that the system works in real time and the accuracy has improved about 9% compared with approaches based on high-dimensional features only.

  15. Far-Infrared Based Pedestrian Detection for Driver-Assistance Systems Based on Candidate Filters, Gradient-Based Feature and Multi-Frame Approval Matching.

    Science.gov (United States)

    Wang, Guohua; Liu, Qiong

    2015-12-21

    Far-infrared pedestrian detection approaches for advanced driver-assistance systems based on high-dimensional features fail to simultaneously achieve robust and real-time detection. We propose a robust and real-time pedestrian detection system characterized by novel candidate filters, novel pedestrian features and multi-frame approval matching in a coarse-to-fine fashion. Firstly, we design two filters based on the pedestrians' head and the road to select the candidates after applying a pedestrian segmentation algorithm to reduce false alarms. Secondly, we propose a novel feature encapsulating both the relationship of oriented gradient distribution and the code of oriented gradient to deal with the enormous variance in pedestrians' size and appearance. Thirdly, we introduce a multi-frame approval matching approach utilizing the spatiotemporal continuity of pedestrians to increase the detection rate. Large-scale experiments indicate that the system works in real time and the accuracy has improved about 9% compared with approaches based on high-dimensional features only.

  16. Corrosion Reliability of Lead-free Solder Systems Used in Electronics

    DEFF Research Database (Denmark)

    Li, Feng; Verdingovas, Vadimas; Medgyes, Balint

    2017-01-01

    humidity/temperature cycling tests on soldered surface insulation resistance (SIR) comb pattern. Complimentary microstructural and phase analysis of solder alloys has been carried out using the scanning electron microscope (SEM), energy dispersive spectroscopy (EDS), and X-ray diffraction (XRD) methods...

  17. Current Problems and Possible Solutions in High-Temperature Lead-Free Soldering

    Czech Academy of Sciences Publication Activity Database

    Kroupa, Aleš; Andersson, D.; Hoo, N.; Pearce, J.; Watson, A.; Dinsdale, A.; Mucklejohn, S.

    2012-01-01

    Roč. 21, č. 5 (2012), s. 629-637 ISSN 1059-9495 Institutional support: RVO:68081723 Keywords : lead-free soldering , * materials for high-temperature LF * new technologies for HT lead-free soldering Subject RIV: BJ - Thermodynamics Impact factor: 0.915, year: 2012

  18. 30 CFR 77.1111 - Welding, cutting, soldering; use of fire extinguisher.

    Science.gov (United States)

    2010-07-01

    ... 30 Mineral Resources 1 2010-07-01 2010-07-01 false Welding, cutting, soldering; use of fire... OF UNDERGROUND COAL MINES Fire Protection § 77.1111 Welding, cutting, soldering; use of fire extinguisher. One portable fire extinguisher shall be provided at each location where welding, cutting, or...

  19. Method and apparatus for jetting, manufacturing and attaching uniform solder balls

    Science.gov (United States)

    Yost, F.G.; Frear, D.R.; Schmale, D.T.

    1999-01-05

    An apparatus and process are disclosed for jetting molten solder in the form of balls directly onto all the metallized interconnects lands for a ball grid array package in one step with no solder paste required. Molten solder is jetted out of a grid of holes using a piston attached to a piezoelectric crystal. When voltage is applied to the crystal it expands forcing the piston to extrude a desired volume of solder through holes in the aperture plate. When the voltage is decreased the piston reverses motion creating an instability in the molten solder at the aperture plate surface and thereby forming spherical solder balls that fall onto a metallized substrate. The molten solder balls land on the substrate and form a metallurgical bond with the metallized lands. The size of the solder balls is determined by a combination of the size of the holes in the aperture plate, the duration of the piston pulse, and the displacement of the piston. The layout of the balls is dictated by the location of the hooks in the grid. Changes in ball size and layout can be easily accomplished by changing the grid plate. This invention also allows simple preparation of uniform balls for subsequent supply to BGA users. 7 figs.

  20. Development of lead-free solders for high-temperature applications

    DEFF Research Database (Denmark)

    Chidambaram, Vivek

    -temperature applications. Unfortunately, even the substitute technologies that are currently being developed cannot address several critical issues of high-temperature soldering. Therefore, further research and development of high-temperature lead-free soldering is obviously needed. It is hoped that this thesis can serve...

  1. The Effects of Antimony Addition on the Microstructural, Mechanical, and Thermal Properties of Sn-3.0Ag-0.5Cu Solder Alloy

    Science.gov (United States)

    Sungkhaphaitoon, Phairote; Plookphol, Thawatchai

    2018-02-01

    In this study, we investigated the effects produced by the addition of antimony (Sb) to Sn-3.0Ag-0.5Cu-based solder alloys. Our focus was the alloys' microstructural, mechanical, and thermal properties. We evaluated the effects by means of scanning electron microscopy (SEM), energy dispersive X-ray spectroscopy (EDX), differential scanning calorimetry (DSC), and a universal testing machine (UTM). The results showed that a part of the Sb was dissolved in the Sn matrix phase, and the remaining one participated in the formation of intermetallic compounds (IMCs) of Ag3(Sn,Sb) and Cu6(Sn,Sb)5. In the alloy containing the highest wt pct Sb, the added component resulted in the formation of SnSb compound and small particle pinning of Ag3(Sn,Sb) along the grain boundary of the IMCs. Our tests of the Sn-3.0Ag-0.5Cu solder alloys' mechanical properties showed that the effects produced by the addition of Sb varied as a function of the wt pct Sb content. The ultimate tensile strength (UTS) increased from 29.21 to a maximum value of 40.44 MPa, but the pct elongation (pct EL) decreased from 48.0 to a minimum 25.43 pct. Principally, the alloys containing Sb had higher UTS and lower pct EL than Sb-free solder alloys due to the strengthening effects of solid solution and second-phase dispersion. Thermal analysis showed that the alloys containing Sb had a slightly higher melting point and that the addition amount ranging from 0.5 to 3.0 wt pct Sb did not significantly change the solidus and liquidus temperatures compared with the Sb-free solder alloys. Thus, the optimal concentration of Sb in the alloys was 3.0 wt pct because the microstructure and the ultimate tensile strength of the SAC305 solder alloys were improved.

  2. Phylogeography, salinity adaptations and metabolic potential of the Candidate Division KB1 Bacteria based on a partial single cell genome.

    Directory of Open Access Journals (Sweden)

    Lisa M Nigro

    2016-08-01

    Full Text Available Deep-sea hypersaline anoxic basins (DHABs and other hypersaline environments contain abundant and diverse microbial life that has adapted to these extreme conditions. The bacterial Candidate Division KB1 represents one of several uncultured groups that has been consistently observed in hypersaline microbial diversity studies. Here we report the phylogeography of KB1, its phylogenetic relationships to Candidate Division OP1 Bacteria, and its potential metabolic and osmotic stress adaptations based on a partial single cell amplified genome (SAG of KB1 from Orca Basin, the largest hypersaline seafloor brine basin in the Gulf of Mexico. Our results are consistent with the hypothesis – previously developed based on 14C incorporation experiments with mixed-species enrichments from Mediterranean seafloor brines - that KB1 has adapted its proteins to elevated intracellular salinity, but at the same time KB1 apparently imports glycine betaine; this compatible solute is potentially not limited to osmoregulation but could also serve as a carbon and energy source.

  3. Effect of phosphorus element on the comprehensive properties of Sn-Cu lead-free solder

    International Nuclear Information System (INIS)

    Li Guangdong; Shi Yaowu; Hao Hu; Xia Zhidong; Lei Yongping; Guo Fu

    2010-01-01

    In the present work, the effect of phosphorus on the creep fatigue properties of Sn-Cu eutectic lead-free solder was carried out. The experimental results show that the melting temperature was almost not changed with adding small amount of P element. However, the addition of trace P element led to the decrease in the property of creep fatigue. The fractography analysis by a scanning electron microscopy (SEM) shows that ductile fracture was the dominant failure behavior in the process of creep fatigue test of Sn0.7Cu and Sn0.7Cu0.005P specimens. It should be pointed out that there is significant difference in the fractographs between the joints of Sn0.7Cu solder and Sn0.7Cu0.005P solder. In the fractograph of Sn0.7Cu solder joint, the microstructure is prolonged along testing direction, and the dimples were more than the fractograph of Sn0.7Cu0.005P solder joint. In addition, the voids could be found on the Sn0.7Cu0.005P solder joint, and trace P addition may increase the rate of forming void of Sn0.7Cu solder joint. The voids can potentially lead to crack initiation or propagation sites in the solder joint. As a result, the creep fatigue of solder joint containing P such as Sn0.7Cu0.005P offers worse property compared to Sn0.7Cu solder joint.

  4. Inferior immunogenicity and efficacy of respiratory syncytial virus fusion protein-based subunit vaccine candidates in aged versus young mice.

    Directory of Open Access Journals (Sweden)

    Corinne Cayatte

    Full Text Available Respiratory syncytial virus (RSV is recognized as an important cause of lower and upper respiratory tract infections in older adults, and a successful vaccine would substantially lower morbidity and mortality in this age group. Recently, two vaccine candidates based on soluble purified glycoprotein F (RSV F, either alone or adjuvanted with glucopyranosyl lipid A formulated in a stable emulsion (GLA-SE, failed to reach their primary endpoints in clinical efficacy studies, despite demonstrating the desired immunogenicity profile and efficacy in young rodent models. Here, one of the RSV F vaccine candidates (post-fusion conformation, RSV post-F, and a stabilized pre-fusion form of RSV F (RSV pre-F, DS-Cav1 were evaluated in aged BALB/c mice. Humoral and cellular immunogenicity elicited after immunization of naïve, aged mice was generally lower compared to young animals. In aged mice, RSV post-F vaccination without adjuvant poorly protected the respiratory tract from virus replication, and addition of GLA-SE only improved protection in the lungs, but not in nasal turbinates. RSV pre-F induced higher neutralizing antibody titers compared to RSV post-F (as previously reported but interestingly, RSV F-specific CD8 T cell responses were lower compared to RSV post-F responses regardless of age. The vaccines were also tested in RSV seropositive aged mice, in which both antigen forms similarly boosted neutralizing antibody titers, although GLA-SE addition boosted neutralizing activity only in RSV pre-F immunized animals. Cell-mediated immune responses in the aged mice were only slightly boosted and well below levels induced in seronegative young mice. Taken together, the findings suggest that the vaccine candidates were not able to induce a strong anti-RSV immune response in recipient mice with an aged immune system, in agreement with recent human clinical trial results. Therefore, the aged mouse model could be a useful tool to evaluate improved vaccine

  5. Prioritizing Candidate Disease Metabolites Based on Global Functional Relationships between Metabolites in the Context of Metabolic Pathways

    Science.gov (United States)

    Yang, Haixiu; Xu, Yanjun; Han, Junwei; Li, Jing; Su, Fei; Zhang, Yunpeng; Zhang, Chunlong; Li, Dongguo; Li, Xia

    2014-01-01

    Identification of key metabolites for complex diseases is a challenging task in today's medicine and biology. A special disease is usually caused by the alteration of a series of functional related metabolites having a global influence on the metabolic network. Moreover, the metabolites in the same metabolic pathway are often associated with the same or similar disease. Based on these functional relationships between metabolites in the context of metabolic pathways, we here presented a pathway-based random walk method called PROFANCY for prioritization of candidate disease metabolites. Our strategy not only takes advantage of the global functional relationships between metabolites but also sufficiently exploits the functionally modular nature of metabolic networks. Our approach proved successful in prioritizing known metabolites for 71 diseases with an AUC value of 0.895. We also assessed the performance of PROFANCY on 16 disease classes and found that 4 classes achieved an AUC value over 0.95. To investigate the robustness of the PROFANCY, we repeated all the analyses in two metabolic networks and obtained similar results. Then we applied our approach to Alzheimer's disease (AD) and found that a top ranked candidate was potentially related to AD but had not been reported previously. Furthermore, our method was applicable to prioritize the metabolites from metabolomic profiles of prostate cancer. The PROFANCY could identify prostate cancer related-metabolites that are supported by literatures but not considered to be significantly differential by traditional differential analysis. We also developed a freely accessible web-based and R-based tool at http://bioinfo.hrbmu.edu.cn/PROFANCY. PMID:25153931

  6. Evaluation of Candidate Measures for Home-Based Screening of Sleep Disordered Breathing in Taiwanese Bus Drivers

    Directory of Open Access Journals (Sweden)

    Hua Ting

    2014-05-01

    Full Text Available Background: Sleepiness-at-the-wheel has been identified as a major cause of highway accidents. The aim of our study is identifying the candidate measures for home-based screening of sleep disordered breathing in Taiwanese bus drivers, instead of polysomnography. Methods: Overnight polysomnography accompanied with simultaneous measurements of alternative screening devices (pulse oximetry, ApneaLink, and Actigraphy, heart rate variability, wake-up systolic blood pressure and questionnaires were completed by 151 eligible participants who were long-haul bus drivers with a duty period of more than 12 h a day and duty shifting. Results: 63.6% of professional bus drivers were diagnosed as having sleep disordered breathing and had a higher body mass index, neck circumference, systolic blood pressure, arousal index and desaturation index than those professional bus drivers without evidence of sleep disordered breathing. Simple home-based candidate measures: (1 Pulse oximetry, oxygen-desaturation indices by ≥3% and 4% (r = 0.87~0.92; (2 Pulse oximetry, pulse-rising indices by ≥7% and 8% from a baseline (r = 0.61~0.89; and (3 ApneaLink airflow detection, apnea-hypopnea indices (r = 0.70~0.70, based on recording-time or Actigraphy-corrected total sleep time were all significantly correlated with, and had high agreement with, corresponding polysomnographic apnea-hypopnea indices [(1 94.5%~96.6%, (2 93.8%~97.2%, (3 91.1%~91.3%, respectively]. Conversely, no validities of SDB screening were found in the multi-variables apnea prediction questionnaire, Epworth Sleepiness Scale, night-sleep heart rate variability, wake-up systolic blood pressure and anthropometric variables. Conclusions: The indices of pulse oximetry and apnea flow detection are eligible criteria for home-based screening of sleep disordered breathing, specifically for professional drivers.

  7. Study on Mitigation Method of Solder Corrosion for Crystalline Silicon Photovoltaic Modules

    Directory of Open Access Journals (Sweden)

    Ju-Hee Kim

    2014-01-01

    Full Text Available The corrosion of 62Sn36Pb2Ag solder connections poses serious difficulties for outdoor-exposed photovoltaic (PV modules, as connection degradation contributes to the increase in series resistance (RS of PV modules. In this study, we investigated a corrosion mitigation method based on the corrosion mechanism. The effect of added sacrificial metal on the reliability of PV modules was evaluated using the oxidation-reduction (redox reaction under damp heat (DH conditions. Experimental results after exposure to DH show that the main reason for the decrease in power was a drop in the module’s fill factor. This drop was attributed to the increase of RS. The drop in output power of the PV module without added sacrificial metal is greater than that of the sample with sacrificial metal. Electroluminescence and current-voltage mapping analysis also show that the PV module with sacrificial metal experienced less degradation than the sample without sacrificial metal.

  8. Blood-Based Biomarker Candidates of Cerebral Amyloid Using PiB PET in Non-Demented Elderly

    Science.gov (United States)

    Westwood, Sarah; Leoni, Emanuela; Hye, Abdul; Lynham, Steven; Khondoker, Mizanur R.; Ashton, Nicholas J.; Kiddle, Steven J.; Baird, Alison L.; Sainz-Fuertes, Ricardo; Leung, Rufina; Graf, John; Hehir, Cristina Tan; Baker, David; Cereda, Cristina; Bazenet, Chantal; Ward, Malcolm; Thambisetty, Madhav; Lovestone, Simon

    2018-01-01

    Increasingly, clinical trials for Alzheimer’s disease (AD) are being conducted earlier in the disease phase and with biomarker confirmation using in vivo amyloid PET imaging or CSF tau and Aβ measures to quantify pathology. However, making such a pre-clinical AD diagnosis is relatively costly and the screening failure rate is likely to be high. Having a blood-based marker that would reduce such costs and accelerate clinical trials through identifying potential participants with likely pre-clinical AD would be a substantial advance. In order to seek such a candidate biomarker, discovery phase proteomic analyses using 2DGE and gel-free LC-MS/MS for high and low molecular weight analytes were conducted on longitudinal plasma samples collected over a 12-year period from non-demented older individuals who exhibited a range of 11C-PiB PET measures of amyloid load. We then sought to extend our discovery findings by investigating whether our candidate biomarkers were also associated with brain amyloid burden in disease, in an independent cohort. Seven plasma proteins, including A2M, Apo-A1, and multiple complement proteins, were identified as pre-clinical biomarkers of amyloid burden and were consistent across three time points (p biomarker signature indicative of AD pathology at a stage long before the onset of clinical disease manifestation. As in previous studies, acute phase reactants and inflammatory markers dominate this signature. PMID:27031486

  9. Biotransformation of prednisone and dexamethasone by cytochrome P450 based systems - Identification of new potential drug candidates.

    Science.gov (United States)

    Putkaradze, Natalia; Kiss, Flora Marta; Schmitz, Daniela; Zapp, Josef; Hutter, Michael C; Bernhardt, Rita

    2017-01-20

    Prednisone and dexamethasone are synthetic glucocorticoids widely used as anti-inflammatory and immunosuppressive drugs. Since their hydroxylated derivatives could serve as novel potential drug candidates, our aim was to investigate their biotransformation by the steroid hydroxylase CYP106A2 from Bacillus megaterium ATCC13368. In vitro we were able to demonstrate highly selective 15β-hydroxylation of the steroids with a reconstituted CYP106A2 system. The reactions were thoroughly characterized, determining the kinetic parameters and the equilibrium dissociation constant. The observed lower conversion rate in the case of dexamethasone hydroxylation was clarified by quantum chemical calculations, which suggest a rearrangement of the intermediately formed radical species. To identify the obtained conversion products with NMR, CYP106A2-based Bacillus megaterium whole-cell systems were applied resulting in an altered product pattern for prednisone, yet no significant change for dexamethasone conversion compared to in vitro. Even the MS941 control strain performed a highly selective biotransformation of prednisone producing the known metabolite 20β-dihydrocortisone. The identified novel prednisone derivatives 15β, 17, 20β, 21-tetrahydroxy-preg-4-en-3,11-dione and 15β, 17, 20β, 21-tetrahydroxy-preg-1,4-dien-3,11-dione as well as the 15β-hydroxylated variants of both drugs are promising candidates for drug-design and development approaches. Copyright © 2016 Elsevier B.V. All rights reserved.

  10. Conservation analysis of dengue virust-cell epitope-based vaccine candidates using peptide block entropy

    DEFF Research Database (Denmark)

    Olsen, Lars Rønn; Zhang, Guang Lan; Keskin, Derin B.

    2011-01-01

    Broad coverage of the pathogen population is particularly important when designing CD8+ T-cell epitope vaccines against viral pathogens. Traditional approaches are based on combinations of highly conserved T-cell epitopes. Peptide block entropy analysis is a novel approach for assembling sets of ...

  11. Problem-Based Learning in the Educational Psychology Classroom: Bahraini Teacher Candidates' Experience

    Science.gov (United States)

    Razzak, Nina Abdul

    2012-01-01

    There was a concern from faculty at Bahrain Teachers' College that undergraduate Bahraini students lack the necessary competencies needed for success in educational contexts that are conducive to active, student-centered learning. It was decided that the students be introduced to a problem-based learning (PBL) strategy in one of their educational…

  12. Amplicon-based metagenomics identified candidate organisms in soils that caused yield decline in strawberry.

    Science.gov (United States)

    Xu, Xiangming; Passey, Thomas; Wei, Feng; Saville, Robert; Harrison, Richard J

    2015-01-01

    A phenomenon of yield decline due to weak plant growth in strawberry was recently observed in non-chemo-fumigated soils, which was not associated with the soil fungal pathogen Verticillium dahliae, the main target of fumigation. Amplicon-based metagenomics was used to profile soil microbiota in order to identify microbial organisms that may have caused the yield decline. A total of 36 soil samples were obtained in 2013 and 2014 from four sites for metagenomic studies; two of the four sites had a yield-decline problem, the other two did not. More than 2000 fungal or bacterial operational taxonomy units (OTUs) were found in these samples. Relative abundance of individual OTUs was statistically compared for differences between samples from sites with or without yield decline. A total of 721 individual comparisons were statistically significant - involving 366 unique bacterial and 44 unique fungal OTUs. Based on further selection criteria, we focused on 34 bacterial and 17 fungal OTUs and found that yield decline resulted probably from one or more of the following four factors: (1) low abundance of Bacillus and Pseudomonas populations, which are well known for their ability of supressing pathogen development and/or promoting plant growth; (2) lack of the nematophagous fungus (Paecilomyces species); (3) a high level of two non-specific fungal root rot pathogens; and (4) wet soil conditions. This study demonstrated the usefulness of an amplicon-based metagenomics approach to profile soil microbiota and to detect differential abundance in microbes.

  13. Pharmacokinetics of the phage endolysin-based candidate drug SAL200 in monkeys and its appropriate intravenous dosing period.

    Science.gov (United States)

    Jun, Soo Youn; Jung, Gi Mo; Yoon, Seong Jun; Youm, So Young; Han, Hyoung-Yun; Lee, Jong-Hwa; Kang, Sang Hyeon

    2016-10-01

    SAL200 is a new phage endolysin-based candidate drug for the treatment of staphylococcal infections. An intravenous administration study was conducted in monkeys to obtain pharmacokinetic information on SAL200 and to assess the safety of a short SAL200 dosing period (<1 week). Maximum serum drug concentrations and systemic SAL200 exposure were proportional to the dose and comparable in male and female monkeys. SAL200 was well tolerated, and no adverse events or laboratory abnormalities were detected after injection of a single dose of up to 80 mg/kg per day, or injection of multiple doses of up to 40 mg/kg per day. © 2016 John Wiley & Sons Australia, Ltd.

  14. The Effect of Genre-based Scaffolding on Research Paper Writing of MA Candidates in an EFL Context

    Directory of Open Access Journals (Sweden)

    Sara Salehpour

    2014-11-01

    Full Text Available In recent years, there has been an increasing amount of literature on genre-based approaches to writing instruction. However, scant attention has been paid to the use of genre-based scaffolding in the realm of academic writing. Hence, in an attempt to tackle the problems prevalent in academic writing, this study set out to investigate the effect of genre-based scaffolding through sentence starters and writing frames on MA candidates’ research paper writing. To this end, twenty MA candidates majoring in ELT were randomly assigned to two homogenous groups, one control and one experimental group, each including 10 participants. Both groups were exposed to a five-session genre-based instruction while the experimental group benefitted from the additional provision of sentence starters and writing frames relevant to different sections of a research paper. The analysis of the results, using independent sample of t-test, reveals that genre-based instruction can be a useful tool in improving academic writing. Moreover, the outperformance of the participants of the experimental group is indicative of the beneficial effect of scaffolding through starters and frames.

  15. Amplicon-based metagenomics identified candidate organisms in soils that caused yield decline in strawberry

    OpenAIRE

    Xiangming Xu; Thomas Passey; Feng Wei; Robert Saville; Richard J. Harrison

    2015-01-01

    A phenomenon of yield decline due to weak plant growth in strawberry was recently observed in non-chemo-fumigated soils, which was not associated with the soil fungal pathogen Verticillium dahliae, the main target of fumigation. Amplicon-based metagenomics was used to profile soil microbiota in order to identify microbial organisms that may have caused the yield decline. A total of 36 soil samples were obtained in 2013 and 2014 from four sites for metagenomic studies; two of the four sites ha...

  16. Investigation of candidate data structures and search algorithms to support a knowledge based fault diagnosis system

    Science.gov (United States)

    Bosworth, Edward L., Jr.

    1987-01-01

    The focus of this research is the investigation of data structures and associated search algorithms for automated fault diagnosis of complex systems such as the Hubble Space Telescope. Such data structures and algorithms will form the basis of a more sophisticated Knowledge Based Fault Diagnosis System. As a part of the research, several prototypes were written in VAXLISP and implemented on one of the VAX-11/780's at the Marshall Space Flight Center. This report describes and gives the rationale for both the data structures and algorithms selected. A brief discussion of a user interface is also included.

  17. Discovery and characterization of antibody variants using mass spectrometry-based comparative analysis for biosimilar candidates of monoclonal antibody drugs.

    Science.gov (United States)

    Li, Wenhua; Yang, Bin; Zhou, Dongmei; Xu, Jun; Ke, Zhi; Suen, Wen-Chen

    2016-07-01

    Liquid chromatography mass spectrometry (LC-MS) is the most commonly used technique for the characterization of antibody variants. MAb-X and mAb-Y are two approved IgG1 subtype monoclonal antibody drugs recombinantly produced in Chinese hamster ovary (CHO) cells. We report here that two unexpected and rare antibody variants have been discovered during cell culture process development of biosimilars for these two approved drugs through intact mass analysis. We then used comprehensive mass spectrometry-based comparative analysis including reduced light, heavy chains, and domain-specific mass as well as peptide mapping analysis to fully characterize the observed antibody variants. The "middle-up" mass comparative analysis demonstrated that the antibody variant from mAb-X biosimilar candidate was caused by mass variation of antibody crystalline fragment (Fc), whereas a different variant with mass variation in antibody antigen-binding fragment (Fab) from mAb-Y biosimilar candidate was identified. Endoproteinase Lys-C digested peptide mapping and tandem mass spectrometry analysis further revealed that a leucine to glutamine change in N-terminal 402 site of heavy chain was responsible for the generation of mAb-X antibody variant. Lys-C and trypsin coupled non-reduced and reduced peptide mapping comparative analysis showed that the formation of the light-heavy interchain trisulfide bond resulted in the mAb-Y antibody variant. These two cases confirmed that mass spectrometry-based comparative analysis plays a critical role for the characterization of monoclonal antibody variants, and biosimilar developers should start with a comprehensive structural assessment and comparative analysis to decrease the risk of the process development for biosimilars. Copyright © 2016 Elsevier B.V. All rights reserved.

  18. Candidate lesion-based criteria for defining a positive sacroiliac joint MRI in two cohorts of patients with axial spondyloarthritis

    DEFF Research Database (Denmark)

    Weber, Ulrich; Østergaard, Mikkel; Lambert, Robert G W

    2015-01-01

    OBJECTIVE: To determine candidate lesion-based criteria for a positive sacroiliac joint (SIJ) MRI based on bone marrow oedema (BMO) and/or erosion in non-radiographic axial spondyloarthritis (nr-axSpA); to compare the performance of lesion-based criteria with global evaluation by expert readers....... METHODS: Two independent cohorts A/B of 69/88 consecutive patients with back pain aged ≤50 years, with median symptom duration 1.3/10.0 years, were referred for suspected SpA (A) or acute anterior uveitis plus back pain (B). Patients were classified according to rheumatologist expert opinion based...... on clinical examination, pelvic radiography and laboratory values as having nr-axSpA (n=51), ankylosing spondylitis (n=34) or non-specific back pain (n=72). Four blinded readers assessed SIJ MRI, recording the presence/absence of SpA by concomitant global evaluation of T1-weighted spin echo (T1SE) and short τ...

  19. Corrosion reliability of electronics: the influence of solder temperature on the decomposition of flux activators

    DEFF Research Database (Denmark)

    Piotrowska, Kamila; Conseil, Helene; Jellesen, Morten Stendahl

    2014-01-01

    This manuscript gives a brief overview on the studies of thermal decomposition of solder flux systems commonly used in the electronic industry. Changes in chemical composition and structural changes of the flux components have been investigated as a function of temperature. Six weak organic acids......, serving as flux activators, have been studied. Additionally, eleven industrially used solder flux systems have been investigated towards their thermal decomposition pattern. The results show the formation of additional species at high soldering temperatures, some having more aggressive nature than...

  20. COST531 project: Study of the advanced materials for lead free soldering

    Directory of Open Access Journals (Sweden)

    Kroupa A.

    2007-01-01

    Full Text Available The COST 531 [1] project runt in the years 2002-2007, and dealt with the materials suitable for lead-free soldering. The main aim was to increase the basic knowledge on possible alloy systems that were used or planned to be used as lead-free solder materials and offer scientific information about these materials in order to replace the currently used lead-containing solders. The databases of materials and thermodynamic properties are one of the expected results and the basic features and properties of the thermodynamic database, allowing to model phase diagrams in multicomponent systems, are described in following paper.

  1. Current status and perspectives of plant-based candidate vaccines against the human immunodeficiency virus (HIV).

    Science.gov (United States)

    Rosales-Mendoza, Sergio; Rubio-Infante, Néstor; Govea-Alonso, Dania O; Moreno-Fierros, Leticia

    2012-03-01

    Genetically engineered plants are economical platforms for the large-scale production of recombinant proteins and have been used over the last 21 years as models for oral vaccines against a wide variety of human infectious and autoimmune diseases with promising results. The main inherent advantages of this approach consist in the absence of purification needs and easy production and administration. One relevant infectious agent is the human immunodeficiency virus (HIV), since AIDS evolved as an alarming public health problem implicating very high costs for government agencies in most African and developing countries. The design of an effective and inexpensive vaccine able to limit viral spread and neutralizing the viral entry is urgently needed. Due to the limited efficacy of the vaccines assessed in clinical trials, new HIV vaccines able to generate broad immune profiles are a priority in the field. This review discusses the current advances on the topic of using plants as alternative expression systems to produce functional vaccine components against HIV, including antigens from Env, Gag and early proteins such as Tat and Nef. Ongoing projects of our group based on the expression of chimeric proteins comprising C4 and V3 domains from gp120, as an approach to elicit broadly neutralizing antibodies are mentioned. The perspectives of the revised approaches, such as the great need of assessing the oral immunogenicity and a detailed immunological characterization of the elicited immune responses, are also discussed.

  2. Paediatric obstructive sleep apnoea: can our identification of surgical candidates be evidence-based?

    Science.gov (United States)

    Pabla, L; Duffin, J; Flood, L; Blackmore, K

    2018-02-14

    Paediatric obstructive sleep apnoea is a common clinical condition managed by most ENT clinicians. However, despite the plethora of publications on the subject, there is wide variability, in the literature and in practice, on key aspects such as diagnostic criteria, the impact of co-morbidities and the indications for surgical correction. A systematic review is presented, addressing four key questions from the available literature: (1) what is the evidence base for any definition of paediatric obstructive sleep apnoea?; (2) does it cause serious systemic illness?; (3) what co-morbidities influence the severity of paediatric obstructive sleep apnoea?; and (4) is there a medical answer? There is a considerable lack of evidence regarding most of these fundamental questions. Notably, screening measures show low specificity and can be insensitive to mild obstructive sleep apnoea. There is a surprising lack of clarity in the definition (let alone estimate of severity) of sleep-disordered breathing, relying on what may be arbitrary test thresholds. Areas of potential research might include investigation of the mechanisms through which obstructive sleep apnoea causes co-morbidities, whether neurocognitive, behavioural, metabolic or cardiovascular, and the role of non-surgical management.

  3. Recombinant vesicular stomatitis virus-based dengue-2 vaccine candidate induces humoral response and protects mice against lethal infection.

    Science.gov (United States)

    Lauretti, Flavio; Chattopadhyay, Anasuya; de Oliveira França, Rafael Freitas; Castro-Jorge, Luiza; Rose, John; Fonseca, Benedito A L da

    2016-09-01

    Dengue is the most important arbovirus disease throughout the world and it is responsible for more than 500,000 dengue hemorrhagic cases and 22,000 deaths every year. One vaccine was recently licensed for human use in Brazil, Mexico and Philippines and although at least seven candidates have been in clinical trials the results of the most developed CYD vaccine have demonstrated immunization problems, such as uneven protection and interference between serotypes. We constructed a vaccine candidate based on vesicular stomatitis virus (VSV) expression of pre-membrane (prM) and envelope (E) proteins of dengue-2 virus (DENV-2) and tested it in mice to evaluate immunogenicity and protection against DENV-2 infection. VSV has been successfully used as vaccine vectors for several viruses to induce strong humoral and cellular immune responses. The VSV-DENV-2 recombinant was constructed by inserting the DENV-2 structural proteins into a VSV plasmid DNA for recombinant VSV-DENV-2 recovery. Infectious recombinant VSV viruses were plaque purified and prM and E expression were confirmed by immunofluorescence and radiolabeling of proteins of infected cells. Forty Balb/C mice were inoculated through subcutaneous (s.c.) route with VSV-DENV-2 vaccine in a two doses schedule 15 d apart and 29 d after first inoculation, sera were collected and the mice were challenged with 50 lethal doses (LD50) of a neurovirulent DENV-2. The VSV-DENV-2 induced anti-DENV-2 antibodies and protected animals in the challenge experiment comparable to DENV-2 immunization control group. We conclude that VSV is a promising platform to test as a DENV vaccine and perhaps against others Flaviviridae.

  4. A malaria diagnostic tool based on computer vision screening and visualization of Plasmodium falciparum candidate areas in digitized blood smears.

    Directory of Open Access Journals (Sweden)

    Nina Linder

    Full Text Available INTRODUCTION: Microscopy is the gold standard for diagnosis of malaria, however, manual evaluation of blood films is highly dependent on skilled personnel in a time-consuming, error-prone and repetitive process. In this study we propose a method using computer vision detection and visualization of only the diagnostically most relevant sample regions in digitized blood smears. METHODS: Giemsa-stained thin blood films with P. falciparum ring-stage trophozoites (n = 27 and uninfected controls (n = 20 were digitally scanned with an oil immersion objective (0.1 µm/pixel to capture approximately 50,000 erythrocytes per sample. Parasite candidate regions were identified based on color and object size, followed by extraction of image features (local binary patterns, local contrast and Scale-invariant feature transform descriptors used as input to a support vector machine classifier. The classifier was trained on digital slides from ten patients and validated on six samples. RESULTS: The diagnostic accuracy was tested on 31 samples (19 infected and 12 controls. From each digitized area of a blood smear, a panel with the 128 most probable parasite candidate regions was generated. Two expert microscopists were asked to visually inspect the panel on a tablet computer and to judge whether the patient was infected with P. falciparum. The method achieved a diagnostic sensitivity and specificity of 95% and 100% as well as 90% and 100% for the two readers respectively using the diagnostic tool. Parasitemia was separately calculated by the automated system and the correlation coefficient between manual and automated parasitemia counts was 0.97. CONCLUSION: We developed a decision support system for detecting malaria parasites using a computer vision algorithm combined with visualization of sample areas with the highest probability of malaria infection. The system provides a novel method for blood smear screening with a significantly reduced need for

  5. Losing on all fronts: the effects of negative versus positive person-based campaigns on implicit and explicit evaluations of political candidates.

    Science.gov (United States)

    Carraro, Luciana; Gawronski, Bertram; Castelli, Luigi

    2010-09-01

    The current research investigated the effects of negative as compared to positive person-based political campaigns on explicit and implicit evaluations of the involved candidates. Participants were presented with two political candidates and statements that one of them ostensibly said during the last political campaign. For half of the participants, the campaign included positive remarks about the source of the statement (positive campaign); for the remaining half, the campaign included negative remarks about the opponent (negative campaign). Afterwards, participants completed measures of explicit and implicit evaluations of both candidates. Results indicate that explicit evaluations of the source, but not the opponent, were less favourable after negative as compared to positive campaigns. In contrast, implicit evaluations were less favourable for both candidates after negative campaigns. The results are discussed in terms of associative and propositional processes, highlighting the importance of associative processes in political decision making.

  6. Effects of Solder Volume and Reflow Conditions on Self-Alignment Accuracy for Fan-Out Package Applications

    Science.gov (United States)

    Park, Hwan-Pil; Seo, Gwancheol; Kim, Sungchul; Kim, Young-Ho

    2018-01-01

    The effects of solder volume and reaction time between molten solder and a metal pad at the peak temperature of reflow on the self-alignment effect have been investigated in flip chip bonding. A glass die with two different pad designs and a flame retardant-4 (FR-4) organic substrate were used. Sn-3.0Ag-0.5Cu and Sn-3.5Ag solders were formed on Cu-organic solderability preservation (Cu-OSP) and electroless nickel electroless palladium immersion gold (ENEPIG) pads on FR-4 substrates using the stencil printing method. To assess the effect of solder volume, the thickness and opening size of the stencil mask were controlled. Reflow experiments were performed at 250°C with wetting times of 40 s, 55 s, 65 s, and 75 s. After flip chip reflow soldering, the bonding areas were cross-sectioned to inspect the shape of the interconnected solder using scanning electron microscopy. The results revealed that using an insufficient solder volume on the pad was responsible for die shifts larger than 1 μm, while a sufficient solder volume on the pad and a stable solder joint shape could ensure misalignment less than 1 μm. The Sn-3.0Ag-0.5Cu solder showed a lower die shift value than the Sn-3.5Ag solder because the Sn-3.0Ag-0.5Cu solder has stronger surface tension than the Sn-3.5Ag solder. Using a longer wetting time between the solder and the pad at the peak temperature also improved the die shift value because the increased reaction time changed the interconnected solder shape between the die and substrate from concave to convex, moving the die to a more accurate position. Furthermore, the restoring forces on die self-alignment influenced the die shift value. A stronger solder surface tension and a larger volume of solder on the pad produced stronger restoring forces for die self-alignment, thereby improving the die shift value.

  7. Influence of Zn additions on the interfacial reaction and microstructure of Sn37Pb/Cu solder joints

    Science.gov (United States)

    Qiu, Yu; Hu, Xiaowu; Li, Yulong; Jiang, Xiongxin

    2017-10-01

    The effects of Zn (5 and 10 wt%) additions into Sn37Pb solder and isothermal solid state aging on the interfacial reactions between Sn37Pb- xZn solders and Cu substrates were investigated in this study. It was found that the addition of Zn changed the types and morphologies of interfacial IMC layers during reflowing and thereafter under aging condition. During reflowing, the planar-type Cu5Zn8 compound was the interfacial IMC for Sn37Pb- xZn (5 and 10 wt%) solder, while the scallop-type Cu6Sn5 was the interfacial IMC for Sn37Pb solder. After aging, the final interfacial structure for Sn37Pb-5Zn solder was solder/Cu5Zn8/Cu6(Sn,Zn)5/Cu, while solder/Cu6Sn5/Cu3Sn/Cu for Sn37Pb solder and solder/Cu5Zn8/Cu for Sn37Pb-10Zn solder, respectively. The Kirkendall voids disappeared with Zn addition into Sn37Pb solder. For the Sn37Pb-5Zn/Cu solder joint, the thickness of Cu6(Sn,Zn)5 layer increased, while the thickness of Cu5Zn8 layer decreased with aging time extended to 360 h due to the decomposition of the Cu5Zn8 IMC layer by diffusing Cu and Zn atoms into nether IMC layer, combining Sn atoms diffused from solder matrix to form Cu6(Sn,Zn)5 IMCs. Furthermore, the growth of Cu6Sn5 and Cu3Sn layers for Sn37Pb/Cu solder joint and the total IMC layer at the interface of Sn37Pb- xZn ( x = 0, 5, and 10 wt%) solder with Cu substrate followed the diffusion control mechanism. Compared to the Sn37Pb-5Zn/Cu solder joint, higher Zn concentration depressed the growth of Cu5Zn8 layer for Sn37Pb-10Zn solder. In the end, refining effect on IMC grains was found by the addition of Zn into Sn37Pb solder and the 10 wt% Zn-doping significantly refined the interfacial IMC grains.

  8. Cooling thermal parameters and microstructure features of directionally solidified ternary Sn–Bi–(Cu,Ag) solder alloys

    Energy Technology Data Exchange (ETDEWEB)

    Silva, Bismarck L., E-mail: bismarck_luiz@yahoo.com.br [Department of Materials Engineering, Federal University of São Carlos, UFSCar, 13565-905 São Carlos, SP (Brazil); Garcia, Amauri [Department of Manufacturing and Materials Engineering, University of Campinas, UNICAMP, 13083-860 Campinas, SP (Brazil); Spinelli, José E. [Department of Materials Engineering, Federal University of São Carlos, UFSCar, 13565-905 São Carlos, SP (Brazil)

    2016-04-15

    Low temperature soldering technology encompasses Sn–Bi based alloys as reference materials for joints since such alloys may be molten at temperatures less than 180 °C. Despite the relatively high strength of these alloys, segregation problems and low ductility are recognized as potential disadvantages. Thus, for low-temperature applications, Bi–Sn eutectic or near-eutectic compositions with or without additions of alloying elements are considered interesting possibilities. In this context, additions of third elements such as Cu and Ag may be an alternative in order to reach sounder solder joints. The length scale of the phases and their proportions are known to be the most important factors affecting the final wear, mechanical and corrosions properties of ternary Sn–Bi–(Cu,Ag) alloys. In spite of this promising outlook, studies emphasizing interrelations of microstructure features and solidification thermal parameters regarding these multicomponent alloys are rare in the literature. In the present investigation Sn–Bi–(Cu,Ag) alloys were directionally solidified (DS) under transient heat flow conditions. A complete characterization is performed including experimental cooling thermal parameters, segregation (XRF), optical and scanning electron microscopies, X-ray diffraction (XRD) and length scale of the microstructural phases. Experimental growth laws relating dendritic spacings to solidification thermal parameters have been proposed with emphasis on the effects of Ag and Cu. The theoretical predictions of the Rappaz-Boettinger model are shown to be slightly above the experimental scatter of secondary dendritic arm spacings for both ternary Sn–Bi–Cu and Sn–Bi–Ag alloys examined. - Highlights: • Dendritic growth prevailed for the ternary Sn–Bi–Cu and Sn–Bi–Ag solder alloys. • Bi precipitates within Sn-rich dendrites were shown to be unevenly distributed. • Morphology and preferential region for the Ag{sub 3}Sn growth depend on Ag

  9. The creep behavior of In-Ag eutectic solder joints

    International Nuclear Information System (INIS)

    Reynolds, H.L.; Kang, S.H.; Morris, J.W. Jr.; Univ. of California, Berkeley, CA

    1999-01-01

    The addition of 3 wt.% Ag to In results in a eutectic composition with improved mechanical properties while only slightly lowering the melting temperature. Steady-state creep properties of In-Ag eutectic solder joints have been measured using constant load tests at 0, 30, 60, and 90 C. Constitutive equations are derived to describe the creep behavior. The data are well represented by an equation of the form proposed by Dorn: a power-law equation applies to each independent creep mechanism. Two parallel mechanisms were observed for the In-Ag eutectic joints. The high-stress mechanism is a bulk mechanism with a thermal dependence dominated by the thermal dependence of creep in the In-rich matrix. The low-stress mechanism is a grain boundary mechanism. Results of this work are discussed with regard to creep behavior of typical eutectic systems

  10. Microstructural Evolution and Mechanical Behavior of High Temperature Solders: Effects of High Temperature Aging

    Science.gov (United States)

    Hasnine, M.; Tolla, B.; Vahora, N.

    2018-04-01

    This paper explores the effects of aging on the mechanical behavior, microstructure evolution and IMC formation on different surface finishes of two high temperature solders, Sn-5 wt.% Ag and Sn-5 wt.% Sb. High temperature aging showed significant degradation of Sn-5 wt.% Ag solder hardness (34%) while aging has little effect on Sn-5 wt.% Sb solder. Sn-5 wt.% Ag experienced rapid grain growth as well as the coarsening of particles during aging. Sn-5 wt.% Sb showed a stable microstructure due to solid solution strengthening and the stable nature of SnSb precipitates. The increase of intermetallic compound (IMC) thickness during aging follows a parabolic relationship with time. Regression analysis (time exponent, n) indicated that IMC growth kinetics is controlled by a diffusion mechanism. The results have important implications in the selection of high temperature solders used in high temperature applications.

  11. Preformulation characterization of an aluminum salt-adjuvanted trivalent recombinant protein-based vaccine candidate against Streptococcus pneumoniae.

    Science.gov (United States)

    Iyer, Vidyashankara; Hu, Lei; Liyanage, Mangala Roshan; Esfandiary, Reza; Reinisch, Christoph; Meinke, Andreas; Maisonneuve, Jeff; Volkin, David B; Joshi, Sangeeta B; Middaugh, C Russell

    2012-09-01

    The preformulation of a trivalent recombinant protein-based vaccine candidate for protection against Streptococcus pneumoniae is described both in the presence and in the absence of aluminum salt adjuvants. The biophysical properties of the three protein-based antigens, fragments of pneumococcal surface adhesion A (PsaA), serine-threonine protein kinase (StkP), and protein required for cell wall separation of group B streptococcus (PcsB), were studied using several spectroscopic and light scattering techniques. An empirical phase diagram was constructed to assess the overall conformational stability of the three antigens as a function of pH and temperatures. A variety of excipients were screened on the basis of their ability to stabilize each antigen using intrinsic fluorescence spectroscopy and circular dichroism spectroscopy. Sorbitol, sucrose, and trehalose stabilized the three proteins in solution. The addition of manganese also showed a drastic increase in the thermal stability of SP1650 in solution. The adsorption and desorption processes of each of the antigens to aluminum salt adjuvants were evaluated, and the stability of the adsorbed proteins was then assessed using intrinsic fluorescence spectroscopy and Fourier transform infrared spectroscopy. All the three proteins showed good adsorption to Alhydrogel. PsaA was destabilized when adsorbed onto Alhydrogel® and adding sodium phosphate showed a stabilizing effect. PcsB was found to be stabilized when adsorbed to Alhydrogel®, and no destabilizing or stabilizing effects were seen in the case of StkP. Copyright © 2012 Wiley Periodicals, Inc.

  12. Evaluation of low-residue soldering for military and commercial applications: A report from the Low-Residue Soldering Task Force

    Energy Technology Data Exchange (ETDEWEB)

    Iman, R.L.; Anderson, D.J. [Sandia National Labs., Albuquerque, NM (United States); Burress, R.V. [SEHO (United States)] [and others

    1995-06-01

    The LRSTF combined the efforts of industry, military, and government to evaluate low-residue soldering processes for military and commercial applications. These processes were selected for evaluation because they provide a means for the military to support the presidential mandate while producing reliable hardware at a lower cost. This report presents the complete details and results of a testing program conducted by the LRSTF to evaluate low-residue soldering for printed wiring assemblies. A previous informal document provided details of the test plan used in this evaluation. Many of the details of that test plan are contained in this report. The test data are too massive to include in this report, however, these data are available on disk as Excel spreadsheets upon request. The main purpose of low-residue soldering is to eliminate waste streams during the manufacturing process.

  13. Comparative testing of six antigen-based malaria vaccine candidates directed toward merozoite-stage Plasmodium falciparum

    DEFF Research Database (Denmark)

    Arnot, David E; Cavanagh, David R; Remarque, Edmond J

    2008-01-01

    Immunogenicity testing of Plasmodium falciparum antigens being considered as malaria vaccine candidates was undertaken in rabbits. The antigens compared were recombinant baculovirus MSP-1(19) and five Pichia pastoris candidates, including two versions of MSP-1(19), AMA-1 (domains I and II), AMA-1......G concentrations. The two P. pastoris-produced MSP-1(19)-induced IgGs conferred the lowest growth inhibition. Comparative analysis of immunogenicity of vaccine antigens can be used to prioritize candidates before moving to expensive GMP production and clinical testing. The assays used have given discriminating...

  14. Using active thermography and modified SVM for intelligent diagnosis of solder bumps

    Science.gov (United States)

    Wei, Wei; Wei, Li; Nie, Lei; Su, Lei; Lu, Xiangning

    2015-09-01

    Solder bump technology has been used extensively in microelectronic packaging. But defect inspection becomes increasingly difficult due to the decrease of solder bumps in dimension and pitch. To overcome the shortages of traditional methods, we have developed an intelligent system using the active thermography for defects inspection of the solder bumps. A modified support vector machine (M-SVM) was investigated to solve the problem of small sample size in solder bumps classification. The chip SFA1 and SFA2 were chosen as the test vehicles. Captured thermal images were preprocessed using the improved wiener filter and moving average technique to remove the peak noise. The principal component analysis (PCA) algorithm was then adopted to reconstruct the thermal image, in which the hot spots were segmented. The statistical features corresponding to every solder bump were extracted and input into the M-SVM for solder bumps classification. The defective bumps w distinguished from the good bumps, which proves that the intelligent system using the modified SVM is effective for defects inspection in microelectronic packages.

  15. Rheological characterisation and printing performance of Sn/Ag/Cu solder pastes

    International Nuclear Information System (INIS)

    Durairaj, R.; Ramesh, S.; Mallik, S.; Seman, A.; Ekere, N.

    2009-01-01

    Lead-free solder paste printing process accounts for majority of the assembly defects in the electronic manufacturing industry. The study investigates rheological behaviour and stencil printing performance of the lead-free solder pastes (Sn/Ag/Cu). Oscillatory stress sweep test was carried out to study the visco-elastic behaviour of the lead-free solder pastes. The visco-elastic behaviour of the paste encompasses solid and liquid characteristic of the paste, which could be used to study the flow behaviour experienced by the pastes during the stencil printing process. From this study, it was found that the solid characteristics (G') is higher than the liquid characteristic (G'') for the pastes material. In addition, the results from the study showed that the solder paste with a large G' = G'' has a higher cohesiveness resulting in poor withdrawal of the paste during the stencil printing process. The phase angles (δ) was used to correlate the quality of the dense suspensions to the formulation of solder paste materials. This study has revealed the value of having a rheological measurement for explaining and characterising solder pastes for stencil printing. As the demand for lead free pastes increases rheological measurements can assist with the formulation or development of new pastes.

  16. Properties and Microstructures of Sn-Ag-Cu-X Lead-Free Solder Joints in Electronic Packaging

    Directory of Open Access Journals (Sweden)

    Lei Sun

    2015-01-01

    Full Text Available SnAgCu solder alloys were considered as one of the most popular lead-free solders because of its good reliability and mechanical properties. However, there are also many problems that need to be solved for the SnAgCu solders, such as high melting point and poor wettability. In order to overcome these shortcomings, and further enhance the properties of SnAgCu solders, many researchers choose to add a series of alloying elements (In, Ti, Fe, Zn, Bi, Ni, Sb, Ga, Al, and rare earth and nanoparticles to the SnAgCu solders. In this paper, the work of SnAgCu lead-free solders containing alloying elements and nanoparticles was reviewed, and the effects of alloying elements and nanoparticles on the melting temperature, wettability, mechanical properties, hardness properties, microstructures, intermetallic compounds, and whiskers were discussed.

  17. Glutathione transferase (GST) as a candidate molecular-based biomarker for soil toxin exposure in the earthworm Lumbricus rubellus

    Energy Technology Data Exchange (ETDEWEB)

    LaCourse, E. James, E-mail: james.la-course@liverpool.ac.u [Institute of Biological, Environmental, and Rural Sciences, Aberystwyth University, Aberystwyth SY23 3DA (United Kingdom); Hernandez-Viadel, Mariluz; Jefferies, James R. [Institute of Biological, Environmental, and Rural Sciences, Aberystwyth University, Aberystwyth SY23 3DA (United Kingdom); Svendsen, Claus; Spurgeon, David J. [Centre for Ecology and Hydrology, Huntingdon PE28 2LS (United Kingdom); Barrett, John [Institute of Biological, Environmental, and Rural Sciences, Aberystwyth University, Aberystwyth SY23 3DA (United Kingdom); John Morgan, A.; Kille, Peter [Biosciences, University of Cardiff, Cardiff CF10 3TL (United Kingdom); Brophy, Peter M. [Institute of Biological, Environmental, and Rural Sciences, Aberystwyth University, Aberystwyth SY23 3DA (United Kingdom)

    2009-08-15

    The earthworm Lumbricus rubellus (Hoffmeister, 1843) is a terrestrial pollution sentinel. Enzyme activity and transcription of phase II detoxification superfamily glutathione transferases (GST) is known to respond in earthworms after soil toxin exposure, suggesting GST as a candidate molecular-based pollution biomarker. This study combined sub-proteomics, bioinformatics and biochemical assay to characterise the L. rubellus GST complement as pre-requisite to initialise assessment of the applicability of GST as a biomarker. L. rubellus possesses a range of GSTs related to known classes, with evidence of tissue-specific synthesis. Two affinity-purified GSTs dominating GST protein synthesis (Sigma and Pi class) were cloned, expressed and characterised for enzyme activity with various substrates. Electrospray ionisation mass spectrometry (ESI-MS) and tandem mass spectrometry (MS/MS) following SDS-PAGE were superior in retaining subunit stability relative to two-dimensional gel electrophoresis (2-DE). This study provides greater understanding of Phase II detoxification GST superfamily status of an important environmental pollution sentinel organism. - This study currently provides the most comprehensive view of the Phase II detoxification enzyme superfamily of glutathione transferases within the important environmental pollution sentinel earthworm Lumbricus rubellus.

  18. Glutathione transferase (GST) as a candidate molecular-based biomarker for soil toxin exposure in the earthworm Lumbricus rubellus

    International Nuclear Information System (INIS)

    LaCourse, E. James; Hernandez-Viadel, Mariluz; Jefferies, James R.; Svendsen, Claus; Spurgeon, David J.; Barrett, John; John Morgan, A.; Kille, Peter; Brophy, Peter M.

    2009-01-01

    The earthworm Lumbricus rubellus (Hoffmeister, 1843) is a terrestrial pollution sentinel. Enzyme activity and transcription of phase II detoxification superfamily glutathione transferases (GST) is known to respond in earthworms after soil toxin exposure, suggesting GST as a candidate molecular-based pollution biomarker. This study combined sub-proteomics, bioinformatics and biochemical assay to characterise the L. rubellus GST complement as pre-requisite to initialise assessment of the applicability of GST as a biomarker. L. rubellus possesses a range of GSTs related to known classes, with evidence of tissue-specific synthesis. Two affinity-purified GSTs dominating GST protein synthesis (Sigma and Pi class) were cloned, expressed and characterised for enzyme activity with various substrates. Electrospray ionisation mass spectrometry (ESI-MS) and tandem mass spectrometry (MS/MS) following SDS-PAGE were superior in retaining subunit stability relative to two-dimensional gel electrophoresis (2-DE). This study provides greater understanding of Phase II detoxification GST superfamily status of an important environmental pollution sentinel organism. - This study currently provides the most comprehensive view of the Phase II detoxification enzyme superfamily of glutathione transferases within the important environmental pollution sentinel earthworm Lumbricus rubellus.

  19. Haplotype-based genome-wide association study identifies loci and candidate genes for milk yield in Holsteins.

    Directory of Open Access Journals (Sweden)

    Zhenliang Chen

    Full Text Available Since milk yield is a highly important economic trait in dairy cattle, the genome-wide association study (GWAS is vital to explain the genetic architecture underlying milk yield and to perform marker-assisted selection (MAS. In this study, we adopted a haplotype-based empirical Bayesian GWAS to identify the loci and candidate genes for milk yield. A total of 1 092 Holstein cows were sequenced by using the genotyping by genome reducing and sequencing (GGRS method. After filtering, 164 312 high-confidence SNPs and 13 476 haplotype blocks were identified to use for GWAS. The results indicated that 17 blocks were significantly associated with milk yield. We further identified the nearest gene of each haplotype block and annotated the genes with milk-associated quantitative trait locus (QTL intervals and ingenuity pathway analysis (IPA networks. Our analysis showed that four genes, DLGAP1, AP2B1, ITPR2 and THBS4, have relationships with milk yield, while another three, ARHGEF4, TDRD1 and KIF19, were inferred to have potential relationships. Additionally, a network derived from the IPA containing one inferred (ARHGEF4 and all four confirmed genes likely regulates milk yield. Our findings add to the understanding of identifying the causal genes underlying milk production traits and could guide follow up studies for further confirmation of the associated genes, pathways and biological networks.

  20. Jenner-predict server: prediction of protein vaccine candidates (PVCs) in bacteria based on host-pathogen interactions.

    Science.gov (United States)

    Jaiswal, Varun; Chanumolu, Sree Krishna; Gupta, Ankit; Chauhan, Rajinder S; Rout, Chittaranjan

    2013-07-01

    Subunit vaccines based on recombinant proteins have been effective in preventing infectious diseases and are expected to meet the demands of future vaccine development. Computational approach, especially reverse vaccinology (RV) method has enormous potential for identification of protein vaccine candidates (PVCs) from a proteome. The existing protective antigen prediction software and web servers have low prediction accuracy leading to limited applications for vaccine development. Besides machine learning techniques, those software and web servers have considered only protein's adhesin-likeliness as criterion for identification of PVCs. Several non-adhesin functional classes of proteins involved in host-pathogen interactions and pathogenesis are known to provide protection against bacterial infections. Therefore, knowledge of bacterial pathogenesis has potential to identify PVCs. A web server, Jenner-Predict, has been developed for prediction of PVCs from proteomes of bacterial pathogens. The web server targets host-pathogen interactions and pathogenesis by considering known functional domains from protein classes such as adhesin, virulence, invasin, porin, flagellin, colonization, toxin, choline-binding, penicillin-binding, transferring-binding, fibronectin-binding and solute-binding. It predicts non-cytosolic proteins containing above domains as PVCs. It also provides vaccine potential of PVCs in terms of their possible immunogenicity by comparing with experimentally known IEDB epitopes, absence of autoimmunity and conservation in different strains. Predicted PVCs are prioritized so that only few prospective PVCs could be validated experimentally. The performance of web server was evaluated against known protective antigens from diverse classes of bacteria reported in Protegen database and datasets used for VaxiJen server development. The web server efficiently predicted known vaccine candidates reported from Streptococcus pneumoniae and Escherichia coli

  1. Prioritizing Disease Candidate Proteins in Cardiomyopathy-Specific Protein-Protein Interaction Networks Based on “Guilt by Association” Analysis

    Science.gov (United States)

    He, Weiming; Li, Weiguo; Qu, Xiaoli; Liang, Binhua; Gao, Qianping; Feng, Chenchen; Jia, Xu; Lv, Yana; Zhang, Siya; Li, Xia

    2013-01-01

    The cardiomyopathies are a group of heart muscle diseases which can be inherited (familial). Identifying potential disease-related proteins is important to understand mechanisms of cardiomyopathies. Experimental identification of cardiomyophthies is costly and labour-intensive. In contrast, bioinformatics approach has a competitive advantage over experimental method. Based on “guilt by association” analysis, we prioritized candidate proteins involving in human cardiomyopathies. We first built weighted human cardiomyopathy-specific protein-protein interaction networks for three subtypes of cardiomyopathies using the known disease proteins from Online Mendelian Inheritance in Man as seeds. We then developed a method in prioritizing disease candidate proteins to rank candidate proteins in the network based on “guilt by association” analysis. It was found that most candidate proteins with high scores shared disease-related pathways with disease seed proteins. These top ranked candidate proteins were related with the corresponding disease subtypes, and were potential disease-related proteins. Cross-validation and comparison with other methods indicated that our approach could be used for the identification of potentially novel disease proteins, which may provide insights into cardiomyopathy-related mechanisms in a more comprehensive and integrated way. PMID:23940716

  2. FIRST LINE 5-FU-BASED CHEMOTHERAPY WITH/WITHOUT BEVACIZUMAB FOR METASTATIC COLORECTAL CANCER: TISSUE BIOMARKER CANDIDATES

    Directory of Open Access Journals (Sweden)

    Assia Konsoulova

    2016-03-01

    Full Text Available Purpose: Colorectal cancer is the second leading cause of cancer mortality in the USA. According to Bulgarian National Statistics Institute, 2370 colon and 1664 rectal cancer cases were diagnosed in 2012 with total number of patients 29995. Adding bevacizumab to chemotherapy in patients with metastatic disease improves progression-free survival (PFS but no predictive markers have been proven in the clinical practice. In our study we examined two tissue biomarkers that may correlate with response to bevacizumab-containing chemotherapy in patients with metastatic colorectal cancer. Patients and Methods: 54 patients with metastatic colorectal cancer were assigned to first line 5-Fu-based chemotherapy with/without bevacizumab. The primary end point was PFS, with additional determination of response and toxicity. Paraffin-embedded samples from primary tumors were collected from all 54 patients. Expression levels of two tumor biomarkers VEGFR-2 and Neuropilin 1 (NP-1 were evaluated with immunohistochemistry. Results: The median PFS for the group treated with CT/Bev was 8.8 months, compared with 5.4 months for the group with chemotherapy alone (95% CI, log-rank test P =0.003. The corresponding overall response rates were 19.3% and 10.2% respectively (P < 0.05 for CT/Bev vs CT. Patients with low NP-1 had statistically significant prolongation of PFS as compared to those with high NP-1 (95% CI, log rank test p= 0.017. Patients with low NP-1 appeared to experience a larger bevacizumab treatment effect in terms of PFS (p=0,049,HR 0.333, 95% CI, 0.111 to 0.995 than patients with high NP-1. Conclusion: The addition of bevacizumab to 5-Fu based chemotherapy improves PFS for patients with metastatic colorectal cancer. Expression of tumor NP-1 is a potential biomarker candidate for prediction of clinical outcome in patients with metastatic colorectal cancer, treated with first line chemotherapy plus bevacizumab.

  3. Conservation analysis of dengue virus T-cell epitope-based vaccine candidates using peptide block entropy

    Directory of Open Access Journals (Sweden)

    Lars Ronn Olsen

    2011-12-01

    Full Text Available Broad coverage of the pathogen population is particularly important when designing CD8+ T-cell epitope vaccines against viral pathogens. Traditional approaches to assembling broadly covering sets of peptides are commonly based on assembling highly conserved epitopes. Peptide block entropy analysis is a novel approach to assembling sets of broadly covering antigens. Since T-cell epitopes are recognized as peptides rather than individual residues, this method is based on calculating the information content of blocks of peptides from a multiple sequence alignment of homologous proteins rather than individual residues. The block entropy analysis provides broad coverage by variant inclusion, since high frequency may not be the sole determinant of the immunogenic potential of a predicted MHC class I binder. We applied block entropy analysis method to the proteomes of the four serotypes of dengue virus and found 1,551 blocks of 9-mer peptides, which covered all available sequences with five or fewer unique peptides. In contrast, the benchmark study by Khan et al. (2008, resulted in 165 9-mers being determined as conserved. Many of the blocks are located consecutively in the proteins, so connecting these blocks resulted in 78 conserved regions which can be covered with 457 subunit peptides. Of the 1551 blocks of 9-mer peptides, 110 blocks consisted of peptides all predicted to bind to MHC with similar affinity and the same HLA restriction. In total, we identified a pool of 333 peptides as T-cell epitope candidates. This set could form the basis for a broadly neutralizing dengue virus vaccine. The peptide block entropy analysis approach significantly increases the number of conserved peptide regions in comparison to traditional conservation analysis of individual residues. We determined 457 subunit peptides with the capacity to encompass the diversity of all sequenced DENV strains.

  4. Experimental and computational study of the morphological evolution of intermetallic compound (Cu6Sn5) layers at the Cu/Sn interface under isothermal soldering conditions

    International Nuclear Information System (INIS)

    Park, M.S.; Stephenson, M.K.; Shannon, C.; Cáceres Díaz, L.A.; Hudspeth, K.A.; Gibbons, S.L.; Muñoz-Saldaña, J.; Arróyave, R.

    2012-01-01

    Cu/Sn soldering alloys have emerged as a viable alternative to Pb-based solders, and thus have been extensively explored in the past decade, although the fine-scale behavior of the resulting intermetallic compounds (IMCs), particularly during the early stages of interface formation, is still a source of debate. In this work, the microstructural evolution of Cu 6 Sn 5 , in a Cu/Sn soldering reaction at 523 K, was experimentally investigated by dipping a single Cu sample into molten Sn at a near-constant speed, yielding a continuous set of time evolution samples. The thickness, coarsening and morphology evolution of the Cu 6 Sn 5 layer is investigated through the use of scanning electron microscopy. The experimental results are also compared to phase-field simulations of the microstructural evolution of the Cu 6 Sn 5 layer. The influence of model parameters on the kinetics and morphological evolution of the IMC layer was examined. In general, good qualitative agreement is found between experiments and simulations and for a limited parameter set there appears to be good quantitative agreement between the growth kinetics of the Cu 6 Sn 5 layer, the grain boundary (GB) effect on grain coarsening, and the substrate/IMC interface roughness evolution. Furthermore, the parametric investigations of the model suggests that good agreement between experiments and simulations is achieved when the dominant transport mechanism for the reacting elements (Cu and Sn) is GB diffusion.

  5. Elevated-Temperature Mechanical Properties of Lead-Free Sn-0.7Cu- xSiC Nanocomposite Solders

    Science.gov (United States)

    Mohammadi, A.; Mahmudi, R.

    2018-02-01

    Mechanical properties of Sn-0.7 wt.%Cu lead-free solder alloy reinforced with 0 vol.%, 1 vol.%, 2 vol.%, and 3 vol.% 100-nm SiC particles have been assessed using the shear punch testing technique in the temperature range from 25°C to 125°C. The composite materials were fabricated by the powder metallurgy route by blending, compacting, sintering, and finally extrusion. The 2 vol.% SiC-containing composite showed superior mechanical properties. In all conditions, the shear strength was adversely affected by increasing test temperature, and the 2 vol.% SiC-containing composite showed superior mechanical properties. Depending on the test temperature, the shear yield stress and ultimate shear strength increased, respectively, by 3 MPa to 4 MPa and 4 MPa to 5.5 MPa, in the composite materials. The strength enhancement was mostly attributed to the Orowan particle strengthening mechanism due to the SiC nanoparticles, and to a lesser extent to the coefficient of thermal expansion mismatch between the particles and matrix in the composite solder. A modified shear lag model was used to predict the total strengthening achieved by particle addition, based on the contribution of each of the above mechanisms.

  6. Investigation of electrochemical migration on Sn-0.7Cu-0.3Ag-0.03P-0.005Ni solder alloy in HNO{sub 3} solution

    Energy Technology Data Exchange (ETDEWEB)

    Sarveswaran, C.; Othman, N. K. [School of Applied Physics, Faculty of Science and Technology, Universiti Kebangsaan Malaysia, 43600, Bangi, Selangor (Malaysia); Ali, M. Yusuf Tura; Ani, F. Che; Samsudin, Z. [Jabil Circuit Sdn Bhd, Bayan Lepas Industrial Park, 11900, Penang (Malaysia)

    2015-09-25

    Current issue in lead-free solder in term of its reliability is still under investigation. This high impact research attempts to investigate the electrochemical migration (ECM) on Sn-0.7Cu-0.3Ag-0.03P-0.005Ni solder alloy by Water Drop Test (WDT) in different concentration of HNO{sub 3} solution. The concentration of HNO{sub 3} solution used in this research was 0.05, 0.10, 0.50 and 1M. Optical Microscope (OM), Field Emission Scanning Electron Microscope (FESEM) and Energy Dispersive X-Ray Analysis (EDX) were carried out in order to analysis the ECM behavior based on the growth of dendrite formation after WDT. In general, the results demonstrated that dendrite growth is faster in higher concentration compared with low concentration of HNO{sub 3}. The concentration of HNO{sub 3} solution used has a strong correlation with Mean-Time-To-Failure (MTTF). As the concentration of HNO{sub 3} increases, the MTTF value decreases. Based on the MTTF results the solder alloy in 1M HNO{sub 3} solution is most susceptible to ECM. SnO{sub 2} forms as a corrosion by-product in the samples proved by EDX analysis. The solder alloy poses a high reliability risk in microelectronic devices during operation in 1M HNO{sub 3} solution.

  7. Novel Plasmodium falciparum malaria vaccines: evidence-based searching for variant surface antigens as candidates for vaccination against pregnancy-associated malaria

    DEFF Research Database (Denmark)

    Staalsoe, Trine; Jensen, Anja T R; Theander, Thor G

    2002-01-01

    Malaria vaccine development has traditionally concentrated on careful molecular, biochemical, and immunological characterisation of candidate antigens. In contrast, evidence of the importance of identified antigens in immunity to human infection and disease has generally been limited......) in particular, to provide robust evidence of a causal link between the two in order to allow efficient and evidence-based identification of candidate antigens for malaria vaccine development....... to statistically significant co-variation with protection rather than on demonstration of causal relationships. We have studied the relationship between variant surface antigen-specific antibodies and clinical protection from Plasmodium falciparum malaria in general, and from pregnancy-associated malaria (PAM...

  8. A Biologically-Inspired Framework for Contour Detection Using Superpixel-Based Candidates and Hierarchical Visual Cues

    Directory of Open Access Journals (Sweden)

    Xiao Sun

    2015-10-01

    Full Text Available Contour detection has been extensively investigated as a fundamental problem in computer vision. In this study, a biologically-inspired candidate weighting framework is proposed for the challenging task of detecting meaningful contours. In contrast to previous models that detect contours from pixels, a modified superpixel generation processing is proposed to generate a contour candidate set and then weigh the candidates by extracting hierarchical visual cues. We extract the low-level visual local cues to weigh the contour intrinsic property and mid-level visual cues on the basis of Gestalt principles for weighting the contour grouping constraint. Experimental results tested on the BSDS benchmark show that the proposed framework exhibits promising performances to capture meaningful contours in complex scenes.

  9. A biologically-inspired framework for contour detection using superpixel-based candidates and hierarchical visual cues.

    Science.gov (United States)

    Sun, Xiao; Shang, Ke; Ming, Delie; Tian, Jinwen; Ma, Jiayi

    2015-10-20

    Contour detection has been extensively investigated as a fundamental problem in computer vision. In this study, a biologically-inspired candidate weighting framework is proposed for the challenging task of detecting meaningful contours. In contrast to previous models that detect contours from pixels, a modified superpixel generation processing is proposed to generate a contour candidate set and then weigh the candidates by extracting hierarchical visual cues. We extract the low-level visual local cues to weigh the contour intrinsic property and mid-level visual cues on the basis of Gestalt principles for weighting the contour grouping constraint. Experimental results tested on the BSDS benchmark show that the proposed framework exhibits promising performances to capture meaningful contours in complex scenes.

  10. A candidate for the Global Stratotype Section and Point at the base of the Serpukhovian in the South Urals, Russia

    Science.gov (United States)

    Richards, B. C.; Nikolaeva, S. V.; Kulagina, E. I.; Alekseev, A. S.; Gorozhanina, E. N.; Gorozhanin, V. M.; Konovalova, V. A.; Goreva, N. V.; Joachimski, M. M.; Gatovsky, Y. A.

    2017-12-01

    The Verkhnyaya Kardailovka section is one of the best candidates for the GSSP (Global Stratotype Section and Point) at the base of the Stage (Mississippian). For boundary definition, the first appearance of the conodont Lochriea ziegleri Nemirovskaya, Perret et Meischner, 1994 in the lineage Lochriea nodosa (Bischoff, 1957)- L. ziegleri is used. L. ziegleri appears in the Venevian Substage somewhat below the base of the Serpukhovian in the Moscow Basin. The position of the FAD of L. ziegleri within the Hypergoniatites- Ferganoceras Genozone is confirmed and lies between 19.53 and 19.63 m above the section's base. Before 2010, deep-water stylonodular limestone containing the boundary in unnamed formation C at Kardailovka was well exposed but only 3 m of Viséan strata cropped out immediately below. Recent trenching exposed another 10 m of underlying Viséan carbonates in formation C and older Viséan siliciclastics and volcanics in unnamed formation B. The contact between formation B and underlying crinoidal limestones in unnamed formation A representing the middle Viséan Zhukovian (Tulian) regional Substage was excavated. The boundary succession, situated in the Magnitogorsk tectonic zone above the Devonian Magnitogorsk arc and Mississippian magmatic and sedimentary rift succession, was deposited west of the Kazakhstanian continent during closure of the Ural Ocean. In the lower part of the section, Viséan tuffaceous siliciclastics and volcanics of formation B record rapid deepening after deposition of neritic middle Viséan crinoid lime grainstone of formation A and subsequent subaerial exposure. The overlying condensed upper Viséan to Serpukhovian succession in formation C comprises deep-water limestone deposited in a sediment-starved basin recording minor turbidite influx and carbonate-mound development. The δ13Ccarb plot shows a positive shift of 1‰ V-PDB (from +2 to +3‰) between 17.0 and 17.75 m (3.05 and 1.97 m below FAD L. ziegleri). The δ18Oapatite

  11. Thermal decomposition of solder flux activators under simulated wave soldering conditions

    DEFF Research Database (Denmark)

    Piotrowska, Kamila; Jellesen, Morten Stendahl; Ambat, Rajan

    2017-01-01

    -base titration method as a function of temperature, time of exposure and the substrate material used. Findings: The study shows that there is a possibility of anhydride-like species formation during the thermal treatment of fluxes containing weak organic acids (WOAs) as activators (succinic and DL...

  12. Electrical Resistance of the Solder Connections for the Consolidation of the LHC Main Interconnection Splices

    CERN Document Server

    Lutum, R; Scheuerlein, C

    2013-01-01

    For the consolidation of the LHC 13 kA main interconnection splices, shunts will be soldered onto each of the 10170 splices. The solder alloy selected for this purpose is Sn60Pb40. In this context the electrical resistance of shunt to busbar lap splices has been measured in the temperature range from RT to 20 K. A cryocooler set-up has been adapted such that a test current of 150 A could be injected for accurate resistance measurements in the low nΩ range. To study the influence of the solder bulk resistivity on the overall splice resistance, connections produced with Sn96Ag4 and Sn77.2In20Ag2.8 have been studied as well. The influence of the Sn60Pb40 solder resistance is negligible when measuring the splice resistance in a longitudinal configuration over a length of 6 cm. In a transverse measurement configuration the splice resistance is significantly influenced by the solder. The connections prepared with Sn77.2In20Ag2.8 show significantly higher resistance values, as expected from the relatively high sol...

  13. Metal ion release from silver soldering and laser welding caused by different types of mouthwash.

    Science.gov (United States)

    Erdogan, Ayse Tuygun; Nalbantgil, Didem; Ulkur, Feyza; Sahin, Fikrettin

    2015-07-01

    To compare metal ion release from samples welded with silver soldering and laser welding when immersed into mouthwashes with different ingredients. A total of 72 samples were prepared: 36 laser welded and 36 silver soldered. Four samples were chosen from each subgroup to study the morphologic changes on their surfaces via scanning electron microscopy (SEM). Each group was further divided into four groups where the samples were submerged into mouthwash containing sodium fluoride (NaF), mouthwash containing sodium fluoride + alcohol (NaF + alcohol), mouthwash containing chlorhexidine (CHX), or artificial saliva (AS) for 24 hours and removed thereafter. Subsequently, the metal ion release from the samples was measured with inductively coupled plasma mass spectrometry (ICP-MS). The metal ion release among the solutions and the welding methods were compared. The Kruskal-Wallis and analysis of variance (ANOVA) tests were used for the group comparisons, and post hoc Dunn multiple comparison test was utilized for the two group comparisons. The level of metal ion release from samples of silver soldering was higher than from samples of laser welding. Furthermore, greater amounts of nickel, chrome, and iron were released from silver soldering. With regard to the mouthwash solutions, the lowest amounts of metal ions were released in CHX, and the highest amounts of metal ions were released in NaF + alcohol. SEM images were in accord with these findings. The laser welding should be preferred over silver soldering. CHX can be recommended for patients who have welded appliances for orthodontic reasons.

  14. In vitro conjunctival incision repair by temperature-controlled laser soldering

    Science.gov (United States)

    Norman, Galia; Rabi, Yaron; Assia, Ehud; Katzir, Abraham

    2009-11-01

    The common method of closing conjunctival incisions is by suturing, which is associated with several disadvantages. It requires skill to apply and does not always provide a watertight closure, which is required in some operations (e.g., glaucoma filtration). The purpose of the present study was to evaluate laser soldering as an alternative method for closing conjunctival incisions. Conjunctival incisions of 20 ex vivo porcine eyes were laser soldered using a temperature-controlled fiberoptic laser system and an albumin mixed with indocyanine green as a solder. The control group consisted of five repaired incisions by a 10-0 nylon running suture. The leak pressure of the repaired incisions was measured. The mean leak pressure in the laser-soldered group was 132 mm Hg compared to 4 mm Hg in the sutured group. There was no statistically significant difference in both the incision's length and distance from the limbus between the groups, before and after the procedure, indicating that there was no severe thermal damage. These preliminary results clearly demonstrate that laser soldering may be a useful method for achieving an immediate watertight conjunctival wound closure. This procedure is faster and easier to apply than suturing.

  15. Improvement of the auto wire feeder machine in a de-soldering process

    Directory of Open Access Journals (Sweden)

    Niramon Nonkhukhetkhong

    2016-10-01

    Full Text Available This paper presents the methodology of the de-soldering process for rework of disk drive Head Stack Assembly (HSA units. The auto wire feeder is a machine that generates Tin (Sn on the product. This machine was determined to be one of the major sources of excess Sn on the HSA. The defect rate due to excess Sn is more than 30%, which leads to increased processing time and cost to perform additional cleaning steps. From process analysis, the major causes of excess Sn are as follows: 1 The machine cannot cut the wire all the way into the flux core area; 2 The sizes and types of soldering irons are not appropriate for the unit parts; and, 3 There are variations introduced into the de-soldering process by the workforce. This paper proposes a methodology to address all three of these causes. First, the auto wire feeder machine in the de-solder process will be adjusted in order to cut wires into flux core. Second, the types of equipment and material used in de-soldering will be optimized. Finally, a new standard method for operators, which can be controlled more easily, will be developed in order to reduce defects due to workforce related variation. After these process controls and machine adjustments were implemented, the overall Sn related problems were significantly improved. Sn contamination was reduced by 41% and cycle time was reduced by an average of 15 seconds.

  16. The influence of heat treatment on properties of lead-free solders

    Directory of Open Access Journals (Sweden)

    Lýdia Trnková Rízeková

    2015-02-01

    Full Text Available The article is focused on the analysis of degradation of properties of two eutectic lead-free solders SnCu0.7 and SnAg3.5Cu0.7. The microstructures of the intermetallic compound (IMC layers at the copper substrate - solder interface were examined before and after heat treatment at 150°C for 50, 200, 500 and 1000 hours. The thickness of IMC layers of the Cu6Sn5 phase was growing with the increasing time of annealing and shown the typical scallops. For the heat treatment times of 200 hours and longer, the Cu3Sn IMC layers located near the Cu substrate were also observed. The experiments showed there is a link between the thickness of IMC layers and decrease of the shear strength of solder joints. In general, the joints made of the ternary solder showed higher shear strength before and after heat treatment in comparison to joints from solder SnCu0.7.

  17. Electrospun Poly(ɛ-Caprolactone) Scaffold for Suture-Free Solder-Mediated Laser-Assisted Vessel Repair

    NARCIS (Netherlands)

    Pabittei, Dara R.; Heger, Michal; Balm, Ron; Meijer, Han E. H.; de Mol, Bas; Beek, Johan F.

    2011-01-01

    Abstract Background and Objective: The addition of poly(lactic-co-glycolic) acid (PLGA) scaffolds to liquid solder-mediated laser-assisted vascular repair (sLAVR) has been shown to increase soldering strength significantly. Unfortunately, the fast degradation of PLGA is associated with adverse

  18. Investigating the heat transfer on the top side of inclined printed circuit boards during vapour phase soldering

    International Nuclear Information System (INIS)

    Illés, Balázs; Géczy, Attila

    2016-01-01

    Highlights: • Investigating the effect of inclination on heat transfer uniformity and intensity during VPS. • Even moderate inclination has high impact on the condensate layer and on the heat transfer. • Inclination under 1° has negative effect on temperature distribution of the soldered board. • Inclination from 1° to 10° improves heat transfer uniformity of vapour phase soldering. • Inclination can help to reduce soldering failures during vapour phase soldering. - Abstract: In this paper, heat transfer and condensate layer formation was investigated by numerical simulations on the top side of inclined printed circuit boards during vapour phase soldering. The phase change on the inclined surface and the transfer mechanisms in the condensate layer were embedded in a three-dimensional model. Steady-state and saturated vapour conditions were applied as boundary conditions in order to study the pure effect of the inclination. Due to the electronic component and circuit board structures during soldering only moderate inclination angles were studied between 0° and 10°. It was found that a moderate inclination of the printed circuit board has considerable effects on the formation of condensate layer and consequently on heat transfer. Compared to the default horizontal orientation of the board, the thickness differences of the condensate layer can be decreased with an optimised inclination of the printed circuit board. This effect homogenizes heat transfer during the process, enabling improved solder joint quality, with reduced overall soldering failure count.

  19. A 2015 International Geomagnetic Reference Field (IGRF) candidate model based on Swarm’s experimental absolute magnetometer vector mode data

    DEFF Research Database (Denmark)

    Vigneron, Pierre; Hulot, Gauthier; Olsen, Nils

    2015-01-01

    to epoch 2015.0 and truncated at degree and order 13. The resulting ASM-only 2015.0 IGRF candidate model is compared to analogous models derived from the mission’s nominal data and to the now-published final 2015.0 IGRF model. Differences among models mainly highlight uncertainties enhanced by the limited...... data. Here, we report on how ASM-only scalar and vector data from the Alpha and Bravo satellites between November 29, 2013 (a week after launch) and September 25, 2014 (for on-time delivery of the model on October 1, 2014) could be used to build a very valuable candidate model for the 2015.......0 International Geomagnetic Reference Field (IGRF). A parent model was first computed, describing the geomagnetic field of internal origin up to degree and order 40 in a spherical harmonic representation and including a constant secular variation up to degree and order 8. This model was next simply forwarded...

  20. Bioinformatics Approach Based Research of Profile Protein Carbonic Anhydrase II Analysis as a Potential Candidate Cause Autism for The Variation of Learning Subjects Biotechnology

    Directory of Open Access Journals (Sweden)

    Dian Eka A. F. Ningrum

    2017-03-01

    Full Text Available This study aims to determine the needs of learning variations on Biotechnology courses using bioinformatics approaches. One example of applied use of bioinformatics in biotechnology course is the analysis of protein profiles carbonic anhydrase II as a potential cause of autism candidate. This research is a qualitative descriptive study consisted of two phases. The first phase of the data obtained from observations of learning, student questionnaires, and questionnaires lecturer. Results from the first phase, namely the need for variations learning in Biotechnology course using bioinformatics. Collecting data on the second stage uses three webserver to predict the target protein and scientific articles. Visualization of proteins using PyMOL software. 3 based webserver which is used, the candidate of target proteins associated with autism is carbonic anhydrase II. The survey results revealed that the protein carbonic anhydrase II as a potential candidate for the cause of autism classified metaloenzim are able to bind with heavy metals. The content of heavy metals in autistic patients high that affect metabolism. This prediction of protein candidate cause autism is applied use to solve the problem in society, so that can achieve the learning outcome in biotechnology course.

  1. Setup Time Reduction On Solder Paste Printing Machine – A Case Study

    Directory of Open Access Journals (Sweden)

    Rajesh Dhake

    2013-06-01

    Full Text Available Lean manufacturing envisages the reduction of the seven deadly wastes referred to as MUDA. Setup time forms a major component of the equipment downtime. It leads to lower machine utilization and restricts the output and product variety. This necessitates the requirement for quick setups. Single Minute Exchange of Die philosophy (a lean manufacturing tool here after referred as “SMED” is one of the important tool which aims at quick setups driving smaller lot sizes, lower production costs, improve productivity in terms of increased output, increased utilization of machine and labor hours, make additional capacity available (often at bottleneck resources, reduce scrap and rework, and increase flexibility[3]. This paper focuses on the application of Single Minute Exchange of Die[1] and Quick Changeover Philosophy[2] for reducing setup time on Solder Past Printing Machine (bottleneck machine in a electronic speedo-cluster manufacturing company. The four step SMED philosophy was adopted to effect reduction in setup time. The initial step was gathering information about the present setup times and its proportion to the total productive time. A detailed video based time study of setup activities was done to classify them into external and internal setup activities in terms of their need (i.e. preparation, replacement or adjustment, time taken and the way these could be reduced, simplified or eliminated. The improvements effected were of three categories viz., mechanical, procedural and organizational. The paper concludes by comparing the present and proposed (implemented methods of setup procedures.

  2. Enhanced interfacial thermal transport in pnictogen tellurides metallized with a lead-free solder alloy

    Energy Technology Data Exchange (ETDEWEB)

    Devender,; Ramanath, Ganpati, E-mail: Ramanath@rpi.edu [Department of Materials Science and Engineering, Rensselaer Polytechnic Institute, Troy, New York 12180 (United States); Lofgreen, Kelly; Devasenathipathy, Shankar; Swan, Johanna; Mahajan, Ravi [Intel Corporation, Assembly Test and Technology Development, Chandler, Arizona 85226 (United States); Borca-Tasciuc, Theodorian [Department of Mechanical Aerospace and Nuclear Engineering, Rensselaer Polytechnic Institute, Troy, New York 12180 (United States)

    2015-11-15

    Controlling thermal transport across metal–thermoelectric interfaces is essential for realizing high efficiency solid-state refrigeration and waste-heat harvesting power generation devices. Here, the authors report that pnictogen chalcogenides metallized with bilayers of Sn{sub 96.5}Ag{sub 3}Cu{sub 0.5} solder and Ni barrier exhibit tenfold higher interfacial thermal conductance Γ{sub c} than that obtained with In/Ni bilayer metallization. X-ray diffraction and x-ray spectroscopy indicate that reduced interdiffusion and diminution of interfacial SnTe formation due to Ni layer correlates with the higher Γ{sub c}. Finite element modeling of thermoelectric coolers metallized with Sn{sub 96.5}Ag{sub 3}Cu{sub 0.5}/Ni bilayers presages a temperature drop ΔT ∼ 22 K that is 40% higher than that obtained with In/Ni metallization. Our results underscore the importance of controlling chemical intermixing at solder–metal–thermoelectric interfaces to increase the effective figure of merit, and hence, the thermoelectric cooling efficiency. These findings should facilitate the design and development of lead-free metallization for pnictogen chalcogenide-based thermoelectrics.

  3. Low-stress soldering technique used to assemble an optical system for aerospace missions

    Science.gov (United States)

    Ribes-Pleguezuelo, P.; Koechlin, C.; Burkhardt, T.; Hornaff, M.; Kamm, A.; Gramens, S.; Beckert, E.; Fiault, G.; Eberhardt, R.; Tünnermann, A.

    2017-09-01

    A high-precision opto-mechanical breadboard for a lens mount has been assembled by means of a laserbased soldering process called Solderjet Bumping; which thanks to its localized and minimized input of thermal energy, is well suited for the joining of optical components made of fragile and brittle materials such as glasses. An optical element made of a silica lens and a titanium barrel has been studied to replicate the lens mounts of the afocal beam expander used in the LIDAR instrument (ATLID) of the ESA EarthCare Mission, whose aim is to monitor molecular and particle-based back-scattering in order to analyze atmosphere composition. Finally, a beam expander optical element breadboard with a silica lens and a titanium barrel was assembled using the Solderjet Bumping technology with Sn96.5Ag3Cu0.5 SAC305 alloy resulting in a low residual stress (<1 MPa) on the joining areas, a low light-depolarization (<0.2 %) and low distortion (wave-front error measurement < 5 nm rms) on the assemblies. The devices also successfully passed humidity, thermal-vacuum, vibration, and shock tests with conditions similar to the ones expected for the ESA EarthCare mission and without altering their optical performances.

  4. Alloying influences on low melt temperature SnZn and SnBi solder alloys for electronic interconnections

    Energy Technology Data Exchange (ETDEWEB)

    Ren, Guang [Stokes Laboratories, Bernal Institute, University of Limerick (Ireland); Department of Civil Engineering and Materials Science, University of Limerick (Ireland); Wilding, Ian J. [Henkel Ltd, Hemel Hempstead (United Kingdom); Collins, Maurice N., E-mail: Maurice.collins@ul.ie [Stokes Laboratories, Bernal Institute, University of Limerick (Ireland)

    2016-04-25

    Due to its commercial potential and the technological challenges associated with processing, low temperature soldering is a topic gaining widespread interest in both industry and academia in the application space of consumer and “throw away” electronics. This review focuses on the latest metallurgical alloys, tin zinc (Sn–Zn) and tin bismuth (Sn–Bi), for lower temperature processed electronic interconnections. The fundamentals of solder paste production and flux development for these highly surface active metallic powders are introduced. Intermetallic compounds that underpin low temperature solder joint production and reliability are discussed. The influence of alloying on these alloys is described in terms of critical microstructural changes, mechanical properties and reliability. The review concludes with an outlook for next generation electronic interconnect materials. - Highlights: • Review of the latest advances in Sn–Zn and Sn–Bi solder alloys. • Technological developments underpinning low temperature soldering. • Micro alloying influences on next generation interconnect materials.

  5. Reliability of Pb free solder alloys. Physical and mechanical properties; Pb free handa no shinraisei. Butsuri kikaiteki shinraisei

    Energy Technology Data Exchange (ETDEWEB)

    Sanji, M.; Yoshino, M.; Ishikawa, J.; Takenaka, O. [Denso Corp., Aichi (Japan)

    1997-10-01

    Properties of 19 different Pb free solders have been evaluated in comparison with Sn-37Pb eutectic solder. Pb free solders without Bi were on the same level as Sn-37Pb in tensile strength and elongation, and those with Bi had higher strength and lower elongation than Sn-37Pb. As the Bi content increased, strength was higher, and elongation was lower. In torsion fatigue tests, fatigue life of Pb free solders without Bi was longer than Sn-37Pb. The relationships of Coffin-Manson rule and Basquin rule with fatigue life was applicable to Pb free solder. Fatigue life of those is inferred from their tensile strength. 7 refs., 13 figs., 1 tab.

  6. Predicting the Drop Performance of Solder Joints by Evaluating the Elastic Strain Energy from High-Speed Ball Pull Tests

    Science.gov (United States)

    You, Taehoon; Kim, Yunsung; Kim, Jina; Lee, Jaehong; Jung, Byungwook; Moon, Jungtak; Choe, Heeman

    2009-03-01

    Despite being expensive and time consuming, board-level drop testing has been widely used to assess the drop or impact resistance of the solder joints in handheld microelectronic devices, such as cellphones and personal digital assistants (PDAs). In this study, a new test method, which is much simpler and quicker, is proposed. The method involves evaluating the elastic strain energy and relating it to the impact resistance of the solder joint by considering the Young’s modulus of the bulk solder and the fracture stress of the solder joint during a ball pull test at high strain rates. The results show that solder joints can be ranked in order of descending elastic strain energy as follows: Sn-37Pb, Sn-1Ag-0.5Cu, Sn-3Ag-0.5Cu, and Sn-4Ag-0.5Cu. This order is consistent with the actual drop performances of the samples.

  7. Ultrasonic assisted fluxless flame soldering and brazing of aluminum alloys; Flussmittelfreies Flammloeten von Aluminiumlegierungen durch Ultraschallunterstuetzung

    Energy Technology Data Exchange (ETDEWEB)

    Bach, F.W. [FORTIS, ISOT GmbH, Witten (Germany); Moehwald, K.; Hollaender, U.; Stoll, P. [FORTIS, Hannover Univ., Hannover (Germany)

    2004-07-01

    Fluxless flame soldering and brazing of different pipe joints made of aluminium alloys can be realized by charging the joining zone with high power ultrasonic during the current process. The fundamental requirement for a successful ultrasonic assisted fluxless flame soldering or brazing is to couple the ultrasonic directly to the molten solder via a sonotrode. In order to guarantee defined acoustic conditions, constant temperature gradients in the sonotrode are required. This can be achieved by adapting a water cooling at the sonotrode. The acoustic energy which is applied to the joining zone causes the development of cavitations and ''micro-streams'' in the molten brazing filler metal. These effects ensure the occurrence of wetting and diffusion processes in the joining zone. (orig.)

  8. Dissolution ad uptake of cadmium from dental gold solder alloy implants

    International Nuclear Information System (INIS)

    Bergman, B.; Bergman, M.; Soeremark, R.

    1977-01-01

    Pure metallic cadmium was irradiated by means of thermal neutrons. The irradiated cadmium ( 115 Cd) was placed in bags of gold foil and the bags were implanted subcutaneously in the neck region of mice. Two and 3 d respectively after implantation the mice were killed, the bags removed and the animals subjected to whole-body autoradiography. The autoradiograms revealed an uptake of 115 Cd in liver and kidney. In another experiment specimens of a cadmium-containing dental gold solder alloy, a cadmium-free dental casting gold alloy and soldered assemblies made of these two alloys were implanted subcutaneously in the neck region of mice. The animals were killed after 6 months; cadmium analysis showed significant increases in the cadmium concentration in liver and kidney of those mice which had been given implants of gold solder alloy. The study clearly shows that due to electrochemical corrosion cadmium can be released from implants and accumulated in the kidneys and the liver. (author)

  9. Design of Experiments to Determine Causes of Flex Cable Solder Wicking, Discoloration and Hole Location Defects

    Energy Technology Data Exchange (ETDEWEB)

    Wolfe, Larry

    2009-04-22

    Design of Experiments (DoE) were developed and performed in an effort to discover and resolve the causes of three different manufacturing issues; large panel voids after Hot Air Solder Leveling (HASL), cable hole locations out of tolerance after lamination and delamination/solder wicking around flat flex cable circuit lands after HASL. Results from a first DoE indicated large panel voids could be eliminated by removing the pre-HASL cleaning. It also revealed eliminating the pre-HASL bake would not be detrimental when using a hard press pad lamination stackup. A second DoE indicated a reduction in hard press pad stackup lamination pressure reduced panel stretch in the y axis approximately 70%. A third DoE illustrated increasing the pre-HASL bake temperature could reduce delamination/solder wicking when using a soft press pad lamination stackup.

  10. In-vitro Investigations of Skin Closure using Diode Laser and Protein Solder Containing Gold Nanoshells

    Directory of Open Access Journals (Sweden)

    Mohammad Sadegh Nourbakhsh

    2010-12-01

    Full Text Available Introduction: Laser tissue soldering is a new technique for repair of various tissues including the skin, liver, articular cartilage and nerves and is a promising alternative to suture. To overcome the problems of thermal damage to surrounding tissues and low laser penetration depth, some exogenous chromophores such as gold nanoshells, a new class of nanoparticles consisting of a dielectric core surrounded by a thin metal shell, are used. The aims of this study were to use two different concentrations of gold nanoshells as the exogenous material for skin tissue soldering and also to examine the effects of laser soldering parameters on the properties of the repaired skin. Material and Methods: Two mixtures of albumin solder and different concentrations of gold nanoshells were prepared. A full thickness incision of 2×20 mm2 was made on the surface and after placing 50 μl of the solder mixture on the incision, an 810 nm diode laser was used to irradiate it at different power densities. The changes of tensile strength, σt, due to temperature rise, number of scan (Ns, and scan velocity (Vs were investigated. Results: The results showed that the tensile strength of the repaired skin increased with increasing irradiance for both gold nanoshell concentrations. In addition, at constant laser irradiance (I, the tensile strength of the repaired incision increased with increasing Ns and decreasing Vs. In our case, this corresponded to st = 1610 g/cm2 at I ~ 60 Wcm-2, T ~ 65ºC, Ns = 10 and Vs = 0.2 mms-1. Discussion and Conclusion: Gold nanoshells can be used as an indocyanine green dye (ICG alterative for laser tissue soldering.  Although by increasing the laser power density, the tensile strength of the repaired skin increases, an optimum power density must be considered due to the resulting increase in tissue temperature.

  11. Decomposition studies of no-clean solder flux systems in connection with corrosion reliability of electronics

    DEFF Research Database (Denmark)

    Conseil, Helene; Jellesen, Morten Stendahl; Verdingovas, Vadimas

    2013-01-01

    One of the predominant factors for accelerated corrosion in electronics is the intrinsic contamination on Printed Circuit Board Assemblies (PCBAs) originating from the soldering process used for component mounting. However, the amount, distribution, and morphology of flux residue vary considerably...... with specific soldering process and parameters, while most important factors are the flux chemistry and its decomposition characteristics. Active parts of the flux residue can cause increased water absorption due to their hygroscopic nature and in solution they will increase leakage current and corrosion...

  12. Aging treatment characteristics of solder bump joint for high reliability optical module

    International Nuclear Information System (INIS)

    Kim, Kyung-Seob; Yu, Chung-Hee; Yang, Jun-Mo

    2004-01-01

    The joint strength and fracture surfaces of Sn-37 mass% Pb and Au stud bumps for photo diode packages after isothermal aging testing were studied experimentally. Al/Au stud bumps and Cu/Sn-37 mass% Pb solders were adopted, and aged for up to 900 h to analyze the effect of intermetallic compound (IMC). The joint strength decreased with aging time. The diffraction patterns of Cu 6 Sn 5 , scallop-shaped IMCs, and planar-shaped Cu 3 Sn were characterized using transmission electron microscopy (TEM). The formation of Kirkendall voids and the growth of IMCs at the solder were found to be a possible mechanism for joint strength reduction

  13. Mechanical performances of lead-free solder joint connections with applications in the aerospace domain

    Directory of Open Access Journals (Sweden)

    Georgiana PADURARU

    2016-03-01

    Full Text Available The paper presents some theoretical and experimental aspects regarding the tribological performances of lead-free solder joint connections, with application in the aerospace domain. In order to highlight the mechanical and tribological properties of solder joint in correlation with different pad finishes, there were made some mechanical determinations using a dedicated Share Test System. The theoretical model highlights the link between the experimental results and the influence of gravitational acceleration on the mechanical and functional integrity of the electronic assemblies that works in vibration environment. The paper novelty is provided by the interdisciplinary experiment that offers results that can be used in the mechanical, tribological, electronical and aerospace domains.

  14. Modeling of high temperature- and diffusion-controlled die soldering in aluminum high pressure die casting

    DEFF Research Database (Denmark)

    Domkin, Konstantin; Hattel, Jesper Henri; Thorborg, Jesper

    2009-01-01

    Soldering of cast alloys to the dies has been a continuing source of die surface damage in the aluminum die-casting industry. To reduce the repair and maintenance costs, an approach to modeling the damage and predicting the die lifetime is required. The aim of the present study is the estimation...... the die-casting industry. As an example, the model is applied to several cases of high pressure die casting (HPDC) where A380 alloy parts are cast in the H13 steel die. The predicted locations of the higher strength of soldering appear in the "hot spot" areas of the die surface in agreement...

  15. Identification of candidate domestication regions in the radish genome based on high-depth resequencing analysis of 17 genotypes.

    Science.gov (United States)

    Kim, Namshin; Jeong, Young-Min; Jeong, Seongmun; Kim, Goon-Bo; Baek, Seunghoon; Kwon, Young-Eun; Cho, Ara; Choi, Sang-Bong; Kim, Jiwoong; Lim, Won-Jun; Kim, Kyoung Hyoun; Park, Won; Kim, Jae-Yoon; Kim, Jin-Hyun; Yim, Bomi; Lee, Young Joon; Chun, Byung-Moon; Lee, Young-Pyo; Park, Beom-Seok; Yu, Hee-Ju; Mun, Jeong-Hwan

    2016-09-01

    This study provides high-quality variation data of diverse radish genotypes. Genome-wide SNP comparison along with RNA-seq analysis identified candidate genes related to domestication that have potential as trait-related markers for genetics and breeding of radish. Radish (Raphanus sativus L.) is an annual root vegetable crop that also encompasses diverse wild species. Radish has a long history of domestication, but the origins and selective sweep of cultivated radishes remain controversial. Here, we present comprehensive whole-genome resequencing analysis of radish to explore genomic variation between the radish genotypes and to identify genetic bottlenecks due to domestication in Asian cultivars. High-depth resequencing and multi-sample genotyping analysis of ten cultivated and seven wild accessions obtained 4.0 million high-quality homozygous single-nucleotide polymorphisms (SNPs)/insertions or deletions. Variation analysis revealed that Asian cultivated radish types are closely related to wild Asian accessions, but are distinct from European/American cultivated radishes, supporting the notion that Asian cultivars were domesticated from wild Asian genotypes. SNP comparison between Asian genotypes identified 153 candidate domestication regions (CDRs) containing 512 genes. Network analysis of the genes in CDRs functioning in plant signaling pathways and biochemical processes identified group of genes related to root architecture, cell wall, sugar metabolism, and glucosinolate biosynthesis. Expression profiling of the genes during root development suggested that domestication-related selective advantages included a main taproot with few branched lateral roots, reduced cell wall rigidity and favorable taste. Overall, this study provides evolutionary insights into domestication-related genetic selection in radish as well as identification of gene candidates with the potential to act as trait-related markers for background selection of elite lines in molecular

  16. Reliability Assessment of Solder Joints in Power Electronic Modules by Crack Damage Model for Wind Turbine Applications

    DEFF Research Database (Denmark)

    Kostandyan, Erik; Sørensen, John Dalsgaard

    2011-01-01

    Wind turbine reliability is an important issue for wind energy cost minimization, especially by reduction of operation and maintenance costs for critical components and by increasing wind turbine availability. To develop an optimal operation and maintenance plan for critical components......, it is necessary to understand the physics of their failure and be able to develop reliability prediction models. Such a model is proposed in this paper for an IGBT power electronic module. IGBTs are critical components in wind turbine converter systems. These are multi-layered devices where layers are soldered...... and propagation processes is discussed. A statistical analysis is performed for appropriate model parameter selection. Based on the proposed model, a layout for component life prediction with crack movement is described in details....

  17. VennPainter: A Tool for the Comparison and Identification of Candidate Genes Based on Venn Diagrams.

    Directory of Open Access Journals (Sweden)

    Guoliang Lin

    Full Text Available VennPainter is a program for depicting unique and shared sets of genes lists and generating Venn diagrams, by using the Qt C++ framework. The software produces Classic Venn, Edwards' Venn and Nested Venn diagrams and allows for eight sets in a graph mode and 31 sets in data processing mode only. In comparison, previous programs produce Classic Venn and Edwards' Venn diagrams and allow for a maximum of six sets. The software incorporates user-friendly features and works in Windows, Linux and Mac OS. Its graphical interface does not require a user to have programing skills. Users can modify diagram content for up to eight datasets because of the Scalable Vector Graphics output. VennPainter can provide output results in vertical, horizontal and matrix formats, which facilitates sharing datasets as required for further identification of candidate genes. Users can obtain gene lists from shared sets by clicking the numbers on the diagram. Thus, VennPainter is an easy-to-use, highly efficient, cross-platform and powerful program that provides a more comprehensive tool for identifying candidate genes and visualizing the relationships among genes or gene families in comparative analysis.

  18. Generation and Characterization of Live Attenuated Influenza A(H7N9 Candidate Vaccine Virus Based on Russian Donor of Attenuation.

    Directory of Open Access Journals (Sweden)

    Svetlana Shcherbik

    Full Text Available Avian influenza A (H7N9 virus has emerged recently and continues to cause severe disease with a high mortality rate in humans prompting the development of candidate vaccine viruses. Live attenuated influenza vaccines (LAIV are 6:2 reassortant viruses containing the HA and NA gene segments from wild type influenza viruses to induce protective immune responses and the six internal genes from Master Donor Viruses (MDV to provide temperature sensitive, cold-adapted and attenuated phenotypes.LAIV candidate A/Anhui/1/2013(H7N9-CDC-LV7A (abbreviated as CDC-LV7A, based on the Russian MDV, A/Leningrad/134/17/57 (H2N2, was generated by classical reassortment in eggs and retained MDV temperature-sensitive and cold-adapted phenotypes. CDC-LV7A had two amino acid substitutions N123D and N149D (H7 numbering in HA and one substitution T10I in NA. To evaluate the role of these mutations on the replication capacity of the reassortants in eggs, the recombinant viruses A(H7N9RG-LV1 and A(H7N9RG-LV2 were generated by reverse genetics. These changes did not alter virus antigenicity as ferret antiserum to CDC-LV7A vaccine candidate inhibited hemagglutination by homologous A(H7N9 virus efficiently. Safety studies in ferrets confirmed that CDC-LV7A was attenuated compared to wild-type A/Anhui/1/2013. In addition, the genetic stability of this vaccine candidate was examined in eggs and ferrets by monitoring sequence changes acquired during virus replication in the two host models. No changes in the viral genome were detected after five passages in eggs. However, after ten passages additional mutations were detected in the HA gene. The vaccine candidate was shown to be stable in the ferret model; post-vaccination sequence data analysis showed no changes in viruses collected in nasal washes present at day 5 or day 7.Our data indicate that the A/Anhui/1/2013(H7N9-CDC-LV7A reassortant virus is a safe and genetically stable candidate vaccine virus that is now available for

  19. COST531 project - study of the advanced materials for lead free soldering

    Czech Academy of Sciences Publication Activity Database

    Kroupa, Aleš; Dinsdale, A.; Watson, A.; Vřešťál, J.; Zemanová, Adéla

    2007-01-01

    Roč. 43, č. 2 (2007), s. 113-123 ISSN 1450-5339 R&D Projects: GA MŠk OC 531.002 Institutional research plan: CEZ:AV0Z20410507 Keywords : lead-free solders * thermodynamic database * Calphad method Subject RIV: BJ - Thermodynamics

  20. Longitudinal measurements of the cadmium burden of 'jig solderers' using IVNAA.

    Science.gov (United States)

    Perrin, B; Green, S; Morgan, W D

    1998-01-01

    The liver and kidney cadmium burdens of a population of 10 'jig solderers' were measured in 1983 and 1995 using similar IVNAA measuring systems. Cadmium exposure ceased in 1985. No significant variation in kidney content was observed. The mean body burden had fallen by 18%, due to a decrease of mean liver content of 35%.

  1. The Development of the COST 531 Lead-Free Solders Thermodynamic Database

    Czech Academy of Sciences Publication Activity Database

    Kroupa, Aleš; Dinsdale, A.; Watson, A.; Vřešťál, J.; Vízdal, J.; Zemanová, Adéla

    2007-01-01

    Roč. 59, č. 7 (2007), s. 20-25 ISSN 1047-4838 R&D Projects: GA MŠk OC 531.002; GA AV ČR KJB200410601 Institutional research plan: CEZ:AV0Z20410507 Keywords : lead-free solders * thermodynamic database Subject RIV: BJ - Thermodynamics Impact factor: 1.081, year: 2007

  2. Characterizing performances of solder paste printing process at flexible manufacturing lines

    International Nuclear Information System (INIS)

    Siew, Jit Ping; Low, Heng Chin; Teoh, Ping Chow

    2015-01-01

    Solder paste printing (SPP) has been a challenge on printed circuit board (PCB) manufacturing, evident by the proliferation of solder paste inspection equipment, or substituted by rigorous non-value added activity of manual inspections. The objective of this study is to characterize the SPP performance of various products manufactured in flexible production lines with different equipment configurations, and determine areas for process improvement. The study began by collecting information on SPP performance relative to component placement (CP) process, and to the proportion of mixed products. Using a clustering algorithm to group similar elements together, SPP performance across all product-production line pairs are statistically modeled to discover the trend and the influential factors. The main findings are: (a) Ratio of overall dpku for CP and SPP processes are 2:1; (b) logistic regression models of SPP performance indicated that only effects of product-production line and solder paste printer configuration are significant; (c) PCB circuitry design with BGA components and single solder paste printer line configurations generated the highest monthly defects, with the highest variation in the latter

  3. The thermodynamic database COST MP0602 for materials for high-temperature lead-free soldering

    Czech Academy of Sciences Publication Activity Database

    Kroupa, Aleš; Dinsdale, A.; Watson, A.; Vřešťál, J.; Zemanová, Adéla; Brož, P.

    2012-01-01

    Roč. 48, č. 3 (2012), s. 339-346 ISSN 1450-5339 R&D Projects: GA MŠk LD11024 Institutional support: RVO:68081723 Keywords : CALPHAD method * lead-free solders * thermodynamic database Subject RIV: BJ - Thermodynamics Impact factor: 1.435, year: 2012

  4. Effects of Electromigration on the Creep and Thermal Fatigue Behavior of Sn58Bi Solder Joints

    Science.gov (United States)

    Zuo, Yong; Ma, Limin; Guo, Fu; Qiao, Lei; Shu, Yutian; Lee, Andree; Subramanian, K. N.

    2014-12-01

    Electromigration (EM), creep, and thermal fatigue (TF) are the most important aspects of the reliability of electronic solder joints, the failure mechanisms of which used to be investigated separately. However, current, mechanical loading, and temperature fluctuation usually co-exist under real service conditions, especially as the magnitude of current density is increasing with joint miniaturization. The importance of EM can no longer be simply ignored when analyzing the creep and TF behavior of a solder joint. The published literature reports that current density substantially changes creep rate, but the intrinsic mechanism is still unclear. Hence, the purpose of this study was to investigate the effects of EM on the creep and TF behavior of Sn58Bi solder joints by analyzing the evolution of electrical resistance and microstructure. The results indicated that EM shortens the lifetime of creep or TF of Sn58Bi solder joints. During creep, EM delays or suppresses the cracking and deforming process, so fracture occurs at the cathode interface. During TF, EM suppresses the cracking process and changes the interfacial structure.

  5. Electrochemical migration of lead-free solder alloys in Na2SO4 environment

    DEFF Research Database (Denmark)

    Medgyes, Balint; Ádám, Sándor; Tar, Lajos

    2017-01-01

    The effect of sulphate ion concentration on electrochemical migration of lead-free solder alloys was investigated with the use of water drop tests, by applying an in-situ optical and electrical inspection system. According to the Mean-Time-To-Failure (MTTF) values it was found that in the case of...

  6. Maintaining Low Voiding Solder Die Attach for Power Die While Minimizing Die Tilt

    Energy Technology Data Exchange (ETDEWEB)

    Hamm, Randy; Peterson, Kenneth A.

    2015-10-01

    This paper addresses work to minimize voiding and die tilt in solder attachment of a large power die, measuring 9.0 mm X 6.5 mm X 0.1 mm (0.354” x 0.256” x 0.004”), to a heat spreader. As demands for larger high power die continue, minimizing voiding and die tilt is of interest for improved die functionality, yield, manufacturability, and reliability. High-power die generate considerable heat, which is important to dissipate effectively through control of voiding under high thermal load areas of the die while maintaining a consistent bondline (minimizing die tilt). Voiding was measured using acoustic imaging and die tilt was measured using two different optical measurement systems. 80Au-20Sn solder reflow was achieved using a batch vacuum solder system with optimized fixturing. Minimizing die tilt proved to be the more difficult of the two product requirements to meet. Process development variables included tooling, weight and solder preform thickness.

  7. Investigation of wall-slip effect on lead-free solder paste and ...

    Indian Academy of Sciences (India)

    and could be related to the performance of the material in the real production environment. In the electronic manufacturing industry, the most popular method to deposit paste material. (solder paste and isotropic conductive adhesives) is known as stencil printing, as can be seen in figure 1. During the stencil printing process, ...

  8. Investigation of wall-slip effect on lead-free solder paste and ...

    Indian Academy of Sciences (India)

    Slippage due to wall depletion effect is well-known in rheological investigation. The aim of this study was to investigate the influence of the paste microstructure on slip formation for the paste materials (lead-free solder paste and isotropic conductive adhesives). The effect of different flow geometries, gap heights and surface ...

  9. Prioritization of candidate genes for cattle reproductive traits, based on protein-protein interactions, gene expression, and text-mining

    DEFF Research Database (Denmark)

    Hulsegge, Ina; Woelders, Henri; Smits, Mari

    2013-01-01

    Reproduction is of significant economic importance in dairy cattle. Improved understanding of mechanisms that control estrous behavior and other reproduction traits could help in developing strategies to improve and/or monitor these traits. The objective of this study was to predict and rank genes...... and processes in brain areas and pituitary involved in reproductive traits in cattle using information derived from three different data sources: gene expression, protein-protein interactions, and literature. We identified 59, 89, 53, 23, and 71 genes in bovine amygdala, dorsal hypothalamus, hippocampus......, pituitary, and ventral hypothalamus, respectively, potentially involved in processes underlying estrus and estrous behavior. Functional annotation of the candidate genes points to a number of tissue-specific processes of which the "neurotransmitter/ion channel/synapse" process in the amygdala, "steroid...

  10. Quantitative iTRAQ-Based Proteomic Identification of Candidate Biomarkers for Diabetic Nephropathy in Plasma of Type 1 Diabetic Patients

    DEFF Research Database (Denmark)

    Overgaard, Anne Julie; Thingholm, Tine Engberg; Larsen, Martin R

    2010-01-01

    spectrometry in three identical repetitions using isobaric mass tags (iTRAQ). The results were further analysed with ingenuity pathway analysis. Levels of apolipoprotein A1, A2, B, C3, E and J were analysed and validated by a multiplex immunoassay in 20 type 1 diabetic patients with macroalbuminuria and 10......INTRODUCTION: As part of a clinical proteomics programme focused on diabetes and its complications, it was our goal to investigate the proteome of plasma in order to find improved candidate biomarkers to predict diabetic nephropathy. METHODS: Proteins derived from plasma from a cross......-sectional cohort of 123 type 1 diabetic patients previously diagnosed as normoalbuminuric, microalbuminuric or macroalbuminuric were enriched with hexapeptide library beads and subsequently pooled within three groups. Proteins from the three groups were compared by online liquid chromatography and tandem mass...

  11. Candidate genes-based investigation of susceptibility to Human African Trypanosomiasis in Côte d'Ivoire.

    Science.gov (United States)

    Ahouty, Bernardin; Koffi, Mathurin; Ilboudo, Hamidou; Simo, Gustave; Matovu, Enock; Mulindwa, Julius; Hertz-Fowler, Christiane; Bucheton, Bruno; Sidibé, Issa; Jamonneau, Vincent; MacLeod, Annette; Noyes, Harry; N'Guetta, Simon-Pierre

    2017-10-01

    Human African Trypanosomiasis (HAT) or sleeping sickness is a Neglected Tropical Disease. Long regarded as an invariably fatal disease, there is increasing evidence that infection by T. b. gambiense can result in a wide range of clinical outcomes, including latent infections, which are long lasting infections with no parasites detectable by microscopy. The determinants of this clinical diversity are not well understood but could be due in part to parasite or host genetic diversity in multiple genes, or their interactions. A candidate gene association study was conducted in Côte d'Ivoire using a case-control design which included a total of 233 subjects (100 active HAT cases, 100 controls and 33 latent infections). All three possible pairwise comparisons between the three phenotypes were tested using 96 SNPs in16 candidate genes (IL1, IL4, IL4R, IL6, IL8, IL10, IL12, IL12R, TNFA, INFG, MIF, APOL1, HPR, CFH, HLA-A and HLA-G). Data from 77 SNPs passed quality control. There were suggestive associations at three loci in IL6 and TNFA in the comparison between active cases and controls, one SNP in each of APOL1, MIF and IL6 in the comparison between latent infections and active cases and seven SNP in IL4, HLA-G and TNFA between latent infections and controls. No associations remained significant after Bonferroni correction, but the Benjamini Hochberg false discovery rate test indicated that there were strong probabilities that at least some of the associations were genuine. The excess of associations with latent infections despite the small number of samples available suggests that these subjects form a distinct genetic cluster different from active HAT cases and controls, although no clustering by phenotype was observed by principle component analysis. This underlines the complexity of the interactions existing between host genetic polymorphisms and parasite diversity.

  12. Hypospadias repair using laser tissue soldering (LTS): preliminary results of a prospective randomized study

    Science.gov (United States)

    Kirsch, Andrew J.; Cooper, Christopher S.; Canning, Douglas A.; Snyder, Howard M., III; Zderic, Stephen A.

    1998-07-01

    Purpose: The purpose of this study was to evaluate laser tissue soldering using an 808 nm diode laser and wavelength- matched human albumin solder for urethral surgery in children. Methods: Currently, 30 boys, ages 3 months to 8 years were randomized to standard suturing (n equals 22) or 'sutureless' laser hypospadias repair (n equals 18). Laser soldering was performed with a human albumin solder doped with indocyanine green dye (2.5 mg/ml) using a laser power output of 0.5 W, pulse duration of 0.5 sec, and interval of 0.1 sec. Power density was approximately 16 W/cm2. In the laser group, sutures were used for tissue alignment only. At the time of surgery, neourethral and penile lengths, operative time for urethral repair, and number of sutures/throws were measured. Postoperatively, patients were examined for complications of wound healing, stricture, or fistula formation. Results: Mean age, severity of urethral defect, type of repair, and neourethra length were equivalent between the two groups. Operative time was significantly faster for laser soldering in both simple (1.6 plus or minus 0.21 min, p less than 0.001) and complex (5.4 plus or minus 0.28 min, p less than 0.0001) hypospadias repairs compared to controls (10.6 plus or minus 1.4 min and 27.8 plus or minus 2.9 min, respectively). The mean number of sutures used in the laser group for simple and complex repairs (3.3 plus or minus 0.3 and 8.1 plus or minus 0.64, respectively) were significantly (p less than 0.0001) less than for controls (8.2 plus or minus 0.84 and 20 plus or minus 2.3, respectively). Followup was between 3 months and 14 months. The overall complication rate in the laser group (11%) was lower than the controls (23%). However, statistical significance (p less than 0.05) was achieved only for the subgroup of patients undergoing simple repairs (LTS, 100% success versus suturing, 69% success). Conclusions: These preliminary results indicate that laser tissue soldering for hypospadias repair

  13. Microstructures and fatigue life of SnAgCu solder joints bearing Nano-Al particles in QFP devices

    Science.gov (United States)

    Zhang, Liang; Fan, Xi-ying; Guo, Yong-huan; He, Cheng-wen

    2014-05-01

    Microstructures and fatigue life of SnAgCu and SnAgCu bearing nano-Al particles in QFP (Quad flat package) devices were investigated, respectively. Results show that the addition of nano-Al particles into SnAgCu solder can refine the microstructures of matrix microstructure. Moreover, the nano-Al particles present in the solder matrix, act as obstacles which can create a back stress, resisting the motion of dislocations. In QFP device, it is found that the addition of nano-Al particles can increase the fatigue life by 32% compared with the SnAgCu solder joints during thermal cycling loading.

  14. CO2 laser nerve welding: optimal laser parameters and the use of solders in vitro.

    Science.gov (United States)

    Menovsky, T; Beek, J F; van Gemert, M J

    1994-01-01

    To improve the welding strength, an in vitro study was performed to investigate the bonding strength of CO2 laser nerve welding (LNW), with and without the use of human albumin solution, dried albumin solution, egg white, fibrinogen solution, fibrin glue, and red blood cells as a solder. Fifteen different combinations of laser power (50, 100, and 150 mW) and pulse duration (0.1 to 3 s) were used with a spot size of 320 microns. The results have been compared to suture, fibrin glue, and laser-assisted nerve repair (LANR). The strongest welds (associated with whitening and caramelization of tissue) were produced at 100 mW with pulses of 1.0 s and at 50 mW with pulses of 3 s. The use of a dried albumin solution as a solder at 100 mW with pulses of 1 s increased the bonding strength 9-fold as compared to LNW (bonding strength 21.0 +/- 8.6 g and 2.4 +/- 0.9 g, respectively). However, positioning the nerves between cottons soaked in saline for 20 minutes resulted in a decrease of the bonding strength (9.8 +/- 4.5 g). The use of a 20% albumin solution and egg white, both at 50 mW with pulses of 3 s, resulted in a bonding strength of, respectively, 5.7 +/- 2.1 g and 7.7 +/- 2.4 g. Other solders did not increase the bonding strength in comparison to LNW. The substantial increase in bonding strength for some solders suggests that it is worthwhile to investigate the dehiscence rate and nerve regeneration of solder enhanced LNW in an in vivo study.

  15. Soldered joints—an essential component of demountable high temperature superconducting fusion magnets

    Science.gov (United States)

    Tsui, Yeekin; Surrey, Elizabeth; Hampshire, Damian

    2016-07-01

    Demountable superconducting magnet coils would offer significant benefits to commercial nuclear fusion power plants. Whether large pressed joints or large soldered joints provide the solution for demountable fusion magnets, a critical component or building block for both will be the many, smaller-scale joints that enable the supercurrent to leave the superconducting layer, cross the superconducting tape and pass into the solder that lies between the tape and the conductor that eventually provides one of the demountable surfaces. This paper considers the electrical and thermal properties of this essential component part of demountable high temperature superconducting (HTS) joints by considering the fabrication and properties of jointed HTSs consisting of a thin layer of solder (In52Sn48 or Pb38Sn62) sandwiched between two rare-earth-Ba2Cu3O7 (REBCO) second generation HTS coated conductors (CCs). The HTS joints are analysed using numerical modelling, critical current and resistivity measurements on the joints from 300 to 4.2 K in applied magnetic fields up to 12 T, as well as scanning electron microscopy studies. Our results show that the copper/silver layers significantly reduce the heating in the joints to less than a few hundred mK. When the REBCO alone is superconducting, the joint resistivity (R J) predominantly has two sources, the solder layer and an interfacial resistivity at the REBCO/silver interface (∼25 nΩ cm2) in the as-supplied CCs which together have a very weak magnetoresistance in fields up to 12 T. We achieved excellent reproducibility in the R J of the In52Sn48 soldered joints of better than 10% at temperatures below T c of the REBCO layer which can be compared to variations of more than two orders of magnitude in the literature. We also show that demountable joints in fusion energy magnets are viable and need only add a few percent to the total cryogenic cost for a fusion tokamak.

  16. Thermal Fatigue Evaluation of Pb-Free Solder Joints: Results, Lessons Learned, and Future Trends

    Science.gov (United States)

    Coyle, Richard J.; Sweatman, Keith; Arfaei, Babak

    2015-09-01

    Thermal fatigue is a major source of failure of solder joints in surface mount electronic components and it is critically important in high reliability applications such as telecommunication, military, and aeronautics. The electronic packaging industry has seen an increase in the number of Pb-free solder alloy choices beyond the common near-eutectic Sn-Ag-Cu alloys first established as replacements for eutectic SnPb. This paper discusses the results from Pb-free solder joint reliability programs sponsored by two industry consortia. The characteristic life in accelerated thermal cycling is reported for 12 different Pb-free solder alloys and a SnPb control in 9 different accelerated thermal cycling test profiles in terms of the effects of component type, accelerated thermal cycling profile and dwell time. Microstructural analysis on assembled and failed samples was performed to investigate the effect of initial microstructure and its evolution during accelerated thermal cycling test. A significant finding from the study is that the beneficial effect of Ag on accelerated thermal cycling reliability (measured by characteristic lifetime) diminishes as the severity of the accelerated thermal cycling, defined by greater ΔT, higher peak temperature, and longer dwell time increases. The results also indicate that all the Pb-free solders are more reliable in accelerated thermal cycling than the SnPb alloy they have replaced. Suggestions are made for future work, particularly with respect to the continued evolution of alloy development for emerging application requirements and the value of using advanced analytical methods to provide a better understanding of the effect of microstructure and its evolution on accelerated thermal cycling performance.

  17. Citizen Candidates Under Uncertainty

    OpenAIRE

    Eguia, Jon X.

    2005-01-01

    In this paper we make two contributions to the growing literature on "citizen-candidate" models of representative democracy. First, we add uncertainty about the total vote count. We show that in a society with a large electorate, where the outcome of the election is uncertain and where winning candidates receive a large reward from holding office, there will be a two-candidate equilibrium and no equilibria with a single candidate. Second, we introduce a new concept of equilibrium, which we te...

  18. Identification of candidate categories of the International Classification of Functioning Disability and Health (ICF for a Generic ICF Core Set based on regression modelling

    Directory of Open Access Journals (Sweden)

    Üstün Bedirhan T

    2006-07-01

    Full Text Available Abstract Background The International Classification of Functioning, Disability and Health (ICF is the framework developed by WHO to describe functioning and disability at both the individual and population levels. While condition-specific ICF Core Sets are useful, a Generic ICF Core Set is needed to describe and compare problems in functioning across health conditions. Methods The aims of the multi-centre, cross-sectional study presented here were: a to propose a method to select ICF categories when a large amount of ICF-based data have to be handled, and b to identify candidate ICF categories for a Generic ICF Core Set by examining their explanatory power in relation to item one of the SF-36. The data were collected from 1039 patients using the ICF checklist, the SF-36 and a Comorbidity Questionnaire. ICF categories to be entered in an initial regression model were selected following systematic steps in accordance with the ICF structure. Based on an initial regression model, additional models were designed by systematically substituting the ICF categories included in it with ICF categories with which they were highly correlated. Results Fourteen different regression models were performed. The variance the performed models account for ranged from 22.27% to 24.0%. The ICF category that explained the highest amount of variance in all the models was sensation of pain. In total, thirteen candidate ICF categories for a Generic ICF Core Set were proposed. Conclusion The selection strategy based on the ICF structure and the examination of the best possible alternative models does not provide a final answer about which ICF categories must be considered, but leads to a selection of suitable candidates which needs further consideration and comparison with the results of other selection strategies in developing a Generic ICF Core Set.

  19. An In Silico Identification of Common Putative Vaccine Candidates against Treponema pallidum: A Reverse Vaccinology and Subtractive Genomics Based Approach.

    Science.gov (United States)

    Kumar Jaiswal, Arun; Tiwari, Sandeep; Jamal, Syed Babar; Barh, Debmalya; Azevedo, Vasco; Soares, Siomar C

    2017-02-14

    Sexually transmitted infections (STIs) are caused by a wide variety of bacteria, viruses, and parasites that are transmitted from one person to another primarily by vaginal, anal, or oral sexual contact. Syphilis is a serious disease caused by a sexually transmitted infection. Syphilis is caused by the bacterium Treponema pallidum subspecies pallidum . Treponema pallidum ( T. pallidum ) is a motile, gram-negative spirochete, which can be transmitted both sexually and from mother to child, and can invade virtually any organ or structure in the human body. The current worldwide prevalence of syphilis emphasizes the need for continued preventive measures and strategies. Unfortunately, effective measures are limited. In this study, we focus on the identification of vaccine targets and putative drugs against syphilis disease using reverse vaccinology and subtractive genomics. We compared 13 strains of T. pallidum using T. pallidum Nichols as the reference genome. Using an in silicoapproach, four pathogenic islands were detected in the genome of T. pallidum Nichols. We identified 15 putative antigenic proteins and sixdrug targets through reverse vaccinology and subtractive genomics, respectively, which can be used as candidate therapeutic targets in the future.

  20. GC-MS Based Plasma Metabolomics for Identification of Candidate Biomarkers for Hepatocellular Carcinoma in Egyptian Cohort.

    Directory of Open Access Journals (Sweden)

    Mohammad R Nezami Ranjbar

    Full Text Available This study evaluates changes in metabolite levels in hepatocellular carcinoma (HCC cases vs. patients with liver cirrhosis by analysis of human blood plasma using gas chromatography coupled with mass spectrometry (GC-MS. Untargeted metabolomic analysis of plasma samples from participants recruited in Egypt was performed using two GC-MS platforms: a GC coupled to single quadruple mass spectrometer (GC-qMS and a GC coupled to a time-of-flight mass spectrometer (GC-TOFMS. Analytes that showed statistically significant changes in ion intensities were selected using ANOVA models. These analytes and other candidates selected from related studies were further evaluated by targeted analysis in plasma samples from the same participants as in the untargeted metabolomic analysis. The targeted analysis was performed using the GC-qMS in selected ion monitoring (SIM mode. The method confirmed significant changes in the levels of glutamic acid, citric acid, lactic acid, valine, isoleucine, leucine, alpha tocopherol, cholesterol, and sorbose in HCC cases vs. patients with liver cirrhosis. Specifically, our findings indicate up-regulation of metabolites involved in branched-chain amino acid (BCAA metabolism. Although BCAAs are increasingly used as a treatment for cancer cachexia, others have shown that BCAA supplementation caused significant enhancement of tumor growth via activation of mTOR/AKT pathway, which is consistent with our results that BCAAs are up-regulated in HCC.

  1. Nb-Base FS-85 Alloy as a Candidate Structural Material for Space Reactor Applications: Effects of Thermal Aging

    Science.gov (United States)

    Leonard, Keith J.; Busby, Jeremy T.; Hoelzer, David T.; Zinkle, Steven J.

    2009-04-01

    The proposed uses of fission reactors for manned or deep space missions have typically relied on the potential use of refractory metal alloys as structural materials. Throughout the history of these programs, a leading candidate has been Nb-1Zr, due to its good fabrication and welding characteristics. However, the less-than-optimal creep resistance of this alloy has encouraged interest in the more complex FS-85 (Nb-28Ta-10W-1Zr) alloy. Despite this interest, only a relatively small database exists for the properties of FS-85. Database gaps include the potential microstructural instabilities that can lead to mechanical property degradation. In this work, changes in the microstructure and mechanical properties of FS-85 were investigated following 1100 hours of thermal aging at 1098, 1248, and 1398 K. The changes in electrical resistivity, hardness, and tensile properties between the as-annealed and aged materials are compared. Evaluation of the microstructural changes was performed through optical microscopy (OM), scanning electron microscopy (SEM), and transmission electron microscopy (TEM). The development of intragranular and grain-boundary precipitation of Zr-rich compounds as a function of aging temperature was followed. Brittle tensile behavior was measured in the material aged at 1248 K, while ductile behavior occurred in samples aged above and below this temperature. The effect of temperature on the under- and overaging of the grain-boundary particles is believed to have contributed to the mechanical property behavior of the aged materials.

  2. Nb-base FS-85 Alloy as a Candidate Structural Material for Space Reactor Applications: Effects of Thermal Aging

    International Nuclear Information System (INIS)

    Leonard, Keith J.; Busby, Jeremy T.; Hoelzer, David T.; Zinkle, Steven J.

    2009-01-01

    The proposed use of fission reactors for manned or deep space missions have typically relied on the potential use of refractory metal alloys as structural materials. Throughout the history of these programs, the lead candidate has been Nb-1Zr due to its good fabrication and welding characteristics. However, the less than optimal creep resistance of this alloy has encouraged interest in the more complex FS-85 (Nb-28Ta-10W-1Zr) alloy. Despite this interest, a relatively small database exists for the properties of FS-85. These gaps include potential microstructural instabilities that can lead to mechanical property degradation. In this work, changes in microstructure and mechanical properties of FS-85 were investigated following 1100 h of thermal aging at 1098, 1248 and 1398 K. The changes in electrical resistivity, hardness and tensile properties between the as-annealed and aged materials are compared. Evaluation of the microstructural changes was performed through optical, scanning and transmission electron microscopy. The development of intragranular and grain boundary precipitation of Zr-rich compounds as a function of aging temperature was followed. Brittle tensile behavior was measured in the 1248 K aged material, while ductile behavior occurred in material aged above and below this temperature. The effect of temperature on the under and overaging of the grain boundary particles are believed to have contributed to the mechanical property behavior of the aged material

  3. Low Temperature Flex-on-Flex Assembly Using Polyvinylidene Fluoride Nanofiber Incorporated Sn58Bi Solder Anisotropic Conductive Films and Vertical Ultrasonic Bonding

    Directory of Open Access Journals (Sweden)

    Tae-Wan Kim

    2013-01-01

    Full Text Available In this study, solder ball incorporated polyvinylidenefluoride (PVDF nanofiber was added into the ACF system to overcome short circuit issues of fine pitch flex-on-flex (FOF assembly. Also, in order to improve the thermal mismatch of the flexible substrate which can lead to electrode misalignment during the bonding process, low melting temperature Sn58Bi solder balls were used with vertical ultrasonic (U/S bonding method. When performing FOF assembly using PVDF nanofiber/Sn58Bi solder ACF and vertical ultrasonic bonding, PVDF nanofiber/Sn58Bi solder ACFs showed 34% higher solder capture rate on an electrode compared to conventional Ni ACFs and conventional Sn58Bi solder ACFs. Additionally, PVDF nanofiber/Sn58Bisolder ACFs showed 100% insulation between neighboring electrodes where conventional Ni ACFs and conventional Sn58Bi solder ACFs showed 75% and 87.5% insulation. Other electrical properties such as contact resistance and current handling capability as well as reliability test of PVDF nanofiber/Sn58Bi solder ACFs showed improved results compared to those of conventional Ni ACFs, which proves the formation of stable solder joint of PVDF nanofiber/Sn58Bi solder ACFs.

  4. THE EFFECT OF REFLOW ON WETTABILITY OF Sn 96.5 Ag 3 Cu 0.5 SOLDER

    Directory of Open Access Journals (Sweden)

    Zoltán Weltsch

    2012-12-01

    Full Text Available Surface conditions on Printed Circuit Board (PCB final finishes have an important impact on the wetting behavior with lead-free solder. The improvement of the wettability in liquid Sn 96.5 Ag 3 Cu 0.5 Solder alloy on PCB substrate was measured with a sessile drop method at 523 K temperature. Wetting properties were determined in normal atmospheric air and inert atmosphere. The wetting angles increasing with the number of reflows both atmosphere. The effect of the atmosphere has a huge importance of the oxidation which manifests itself of the measured wetting angles. One of the most important factors affecting the wetting properties is the amount of oxygen in the soldering atmosphere. Using the inert atmosphere is crucial in case of Pb-free solders, particularly after reflows.

  5. The Effect of Reflow on Wettability of Sn 96.5 Ag 3 Cu 0.5 Solder

    Directory of Open Access Journals (Sweden)

    Zoltán Weltsch

    2012-11-01

    Full Text Available Surface conditions on Printed Circuit Board (PCB final finishes have an important impact on the wetting behaviour with lead-free solder. The improvement of wettability in liquid Sn 96.5 Ag 3 Cu 0.5 Solder alloy on PCB substrate was measured with a sessile drop method at 523 K temperature. Wetting properties was determined in normal atmospheric air and inert atmosphere. The wetting angles increasing with the number of reflows both atmosphere. The effect of the atmosphere has a huge importance of the oxidation which manifests itself of the measured wetting angles. One of the most important factors to the wetting properties is the amount of oxygen in the soldering atmosphere. Using the inert atmosphere is crucial to Pb-free solders, particularly after reflows.

  6. Surface Morphology Study of Nanostructured Lead-Free Solder Alloy Sn-Ag-Cu Developed by Electrodeposition: Effect of Current Density Investigation

    Directory of Open Access Journals (Sweden)

    Sakinah Mohd Yusof

    2013-10-01

    Full Text Available Normal 0 false false false IN X-NONE X-NONE MicrosoftInternetExplorer4 Nanostructured lead-free solder Sn-Ag-Cu (SAC was developed by electrodeposition method at room temperature. Electrolite bath which comprised of the predetermined quantity of tin methane sulfonate, copper sulfate and silver sulfate were added sequentially to MSA solution. The methane sulphonic acid (MSA based ternary Sn-Ag-Cu bath was developed by using tin methane sulfonate as a source of Sn ions while the Cu+ and Ag+ ions were obtained from their respective sulfate salts. The rate of the electrodeposition was controlled by variation of current density. The addition of the buffer, comprising of sodium and ammonium acetate helped in raising the pH solution. During the experimental procedure, the pH of solution, composition of the electrolite bath, and the electrodeposition time were kept constant. The electrodeposited rate, deposit composition and microstructure were investigated as the effect of current density. The electrodeposited solder alloy was characterized for their morphology using Field Emission Scanning Electron Microscope (FESEM. In conclusion, vary of current density will play significant role in the surface morphology of nanostructured lead-free solder SAC developed. Normal 0 false false false IN X-NONE X-NONE MicrosoftInternetExplorer4 /* Style Definitions */ table.MsoNormalTable {mso-style-name:"Table Normal"; mso-tstyle-rowband-size:0; mso-tstyle-colband-size:0; mso-style-noshow:yes; mso-style-priority:99; mso-style-qformat:yes; mso-style-parent:""; mso-padding-alt:0cm 5.4pt 0cm 5.4pt; mso-para-margin:0cm; mso-para-margin-bottom:.0001pt; mso-pagination:widow-orphan; font-size:11.0pt; font-family:"Calibri","sans-serif"; mso-ascii-font-family:Calibri; mso-ascii-theme-font:minor-latin; mso-fareast-font-family:"Times New Roman"; mso-fareast-theme-font:minor-fareast; mso-hansi-font-family:Calibri; mso-hansi-theme-font:minor-latin; mso-bidi-font-family:"Times New

  7. Candidate Gene Identification with SNP Marker-Based Fine Mapping of Anthracnose Resistance Gene Co-4 in Common Bean

    Science.gov (United States)

    Burt, Andrew J.; William, H. Manilal; Perry, Gregory; Khanal, Raja; Pauls, K. Peter; Kelly, James D.; Navabi, Alireza

    2015-01-01

    Anthracnose, caused by Colletotrichum lindemuthianum, is an important fungal disease of common bean (Phaseolus vulgaris). Alleles at the Co–4 locus confer resistance to a number of races of C. lindemuthianum. A population of 94 F4:5 recombinant inbred lines of a cross between resistant black bean genotype B09197 and susceptible navy bean cultivar Nautica was used to identify markers associated with resistance in bean chromosome 8 (Pv08) where Co–4 is localized. Three SCAR markers with known linkage to Co–4 and a panel of single nucleotide markers were used for genotyping. A refined physical region on Pv08 with significant association with anthracnose resistance identified by markers was used in BLAST searches with the genomic sequence of common bean accession G19833. Thirty two unique annotated candidate genes were identified that spanned a physical region of 936.46 kb. A majority of the annotated genes identified had functional similarity to leucine rich repeats/receptor like kinase domains. Three annotated genes had similarity to 1, 3-β-glucanase domains. There were sequence similarities between some of the annotated genes found in the study and the genes associated with phosphoinositide-specific phosphilipases C associated with Co-x and the COK–4 loci found in previous studies. It is possible that the Co–4 locus is structured as a group of genes with functional domains dominated by protein tyrosine kinase along with leucine rich repeats/nucleotide binding site, phosphilipases C as well as β-glucanases. PMID:26431031

  8. Trial application of the candidate root cause categorization scheme and preliminary assessment of selected data bases for the root causes of component failures program

    International Nuclear Information System (INIS)

    Bruske, S.Z.; Cadwallader, L.C.; Stepina, P.L.

    1985-04-01

    The objective of the Nuclear Regulatory Commission's (NRC) Root Causes of Component Failures Program is to develop and apply a categorization scheme for identifying root causes of failures for components that comprise safety and safety support systems of nuclear power plants. Results from this program will provide valuable input in the areas of probabilistic risk assessment, reliability assurance, and application of risk assessments in the inspection program. This report presents the trial application and assessment of the candidate root cause categorization scheme to three failure data bases: the In-Plant Reliability Data System (IPRDS), the Licensee Event Report (LER) data base, and the Nuclear Plant Reliability Data System (NPRDS). Results of the trial application/assessment show that significant root cause information can be obtained from these failure data bases

  9. Electromigration Critical Product to Measure Effect of Underfill Material in Suppressing Bi Segregation in Sn-58Bi Solder

    Science.gov (United States)

    Zhao, Xu; Takaya, Satoshi; Muraoka, Mikio

    2017-08-01

    Recently, we detected length-dependent electromigration (EM) behavior in Sn-58Bi (SB) solder and revealed the existence of Bi back-flow, which retards EM-induced Bi segregation and is dependent on solder length. The cause of the back-flow is attributed to an oxide layer formed on the SB solder. At present, underfill (UF) material is commonly used in flip-chip packaging as filler between chip and substrate to surround solder bumps. In this study, we quantitatively investigated the effect of UF material as a passivation layer on EM in SB solder strips. EM tests on SB solder strips with length of 50 μm, 100 μm, and 150 μm were conducted simultaneously. Some samples were coated with commercial thermosetting epoxy UF material, which acted as a passivation layer on the Cu-SB-Cu interconnections. The value of the critical product for SB solder was estimated to be 38 A/cm to 43 A/cm at 353 K to 373 K without UF coating and 59 A/cm at 373 K with UF coating. The UF material acting as a passivation layer suppressed EM-induced Bi segregation and increased the threshold current density by 37% to 55%. However, at very high current density, this effect became very slight. In addition, Bi atoms can diffuse to the anode side through the Sn phase, hence addition of microelements to the Sn phase to form obstacles, such as intermetallic compounds, may retard Bi segregation in SB solder.

  10. Influence of supply of heat to cobalt-chromium frameworks during soldering and subsequent hardening heat treatment of wrought clasps.

    Science.gov (United States)

    Eriksson, T; Sjögren, G; Bergman, M

    1983-01-01

    Retentive clasp arms of wrought gold alloy wire were soldered to frameworks made of three dental cobalt-chromium alloys. The clasps were then subjected to a conventional hardening heat treatment. Microstructure and hardness of the cobalt-chromium alloys were determined before and after these operations. The results reveal that the supply of heat during soldering and hardening heat treatment of the clasp does not influence the microstructure and hardness of the cobalt-chromium alloys.

  11. Serum-free microcarrier based production of replication deficient Influenza vaccine candidate virus lacking NS1 using Vero cells

    Directory of Open Access Journals (Sweden)

    Yan Mylene L

    2011-08-01

    Full Text Available Abstract Background Influenza virus is a major health concern that has huge impacts on the human society, and vaccination remains as one of the most effective ways to mitigate this disease. Comparing the two types of commercially available Influenza vaccine, the live attenuated virus vaccine is more cross-reactive and easier to administer than the traditional inactivated vaccines. One promising live attenuated Influenza vaccine that has completed Phase I clinical trial is deltaFLU, a deletion mutant lacking the viral Nonstructural Protein 1 (NS1 gene. As a consequence of this gene deletion, this mutant virus can only propagate effectively in cells with a deficient interferon-mediated antiviral response. To demonstrate the manufacturability of this vaccine candidate, a batch bioreactor production process using adherent Vero cells on microcarriers in commercially available animal-component free, serum-free media is described. Results Five commercially available animal-component free, serum-free media (SFM were evaluated for growth of Vero cells in agitated Cytodex 1 spinner flask microcarrier cultures. EX-CELL Vero SFM achieved the highest cell concentration of 2.6 × 10^6 cells/ml, whereas other SFM achieved about 1.2 × 10^6 cells/ml. Time points for infection between the late exponential and stationary phases of cell growth had no significant effect in the final virus titres. A virus yield of 7.6 Log10 TCID50/ml was achieved using trypsin concentration of 10 μg/ml and MOI of 0.001. The Influenza vaccine production process was scaled up to a 3 liter controlled stirred tank bioreactor to achieve a cell density of 2.7 × 10^6 cells/ml and virus titre of 8.3 Log10 TCID50/ml. Finally, the bioreactor system was tested for the production of the corresponding wild type H1N1 Influenza virus, which is conventionally used in the production of inactivated vaccine. High virus titres of up to 10 Log10 TCID50/ml were achieved. Conclusions We describe for the

  12. Thermal Fluid-Structure Interaction in the Effects of Pin-Through-Hole Diameter during Wave Soldering

    Directory of Open Access Journals (Sweden)

    M. S. Abdul Aziz

    2014-03-01

    Full Text Available An effective simulation approach is introduced in this paper to study the thermal fluid-structure interaction (thermal FSI on the effect of pin-through-hole (PTH diameter on the wave soldering zone. A 3D single PTH connector and a printed circuit board model were constructed to investigate the capillary flow behavior when passing through molten solder (63SnPb37. In the analysis, the fluid solver FLUENT was used to solve and track the molten solder advancement using the volume of fluid technique. The structural solver ABAQUS was used to examine the von Mises stress and displacement of the PTH connector in the wave soldering process. Both solvers were coupled by MpCCI software. The effects of six different diameter ratios (0.1 < d/D < 0.97 were studied through a simulation modeling. The use of ratio d/D = 0.2 yielded a balanced filling profile and low thermal stress. Results revealed that filling level, temperature, and displacement exhibited polynomial behavior to d/D. Stress of pin varied quadratically with the d/D. The predicted molten solder profile was validated by experimental results. The simulation results are expected to provide better visualization and understanding of the wave soldering process by considering the aspects of thermal FSI.

  13. Microstructural evolution and IMCs growth behavior of Sn-58Bi-0.25Mo solder joint during aging treatment

    Science.gov (United States)

    Yang, Li; Zhu, Lu; Zhang, Yaocheng; Zhou, Shiyuan; Xiong, Yifeng; Wu, Pengcheng

    2018-02-01

    The microstructural evolution and IMCs growth behavior of Sn-58Bi and Sn-58Bi-0.25Mo solder joints were investigated. The results showed that the microstructure is coarsened, the IMCs layer thickness is increased and the tensile strength of Sn-58Bi and Sn-58Bi-0.25Mo solder joints is decreased with increasing aging time and temperature. Aging temperature is the key factor that causes the excessive IMCs growth of the solder joint compared with aging time, and the activation energy of IMCs layer growth of Sn-58Bi and Sn-58Bi-0.25Mo solder joints is 48.94 kJ mol‑1 and 53.79 kJ mol‑1, respectively. During the aging treatment, the microstructure of Sn-58Bi solder joint is refined by adding Mo nanoparticles, and the appropriate IMCs layer thickness and improved mechanical properties are obtained by Sn-58Bi-0.25Mo solder joint.

  14. Selection and validation of potato candidate genes for maturity corrected resistance to Phytophthora infestans based on differential expression combined with SNP association and linkage mapping

    Directory of Open Access Journals (Sweden)

    Meki Shehabu Muktar

    2015-09-01

    Full Text Available Late blight of potato (Solanum tuberosum L. caused by the oomycete Phytophthora infestans (Mont. de Bary, is one of the most important bottlenecks of potato production worldwide. Cultivars with high levels of durable, race unspecific, quantitative resistance are part of a solution to this problem. However, breeding for quantitative resistance is hampered by the correlation between resistance and late plant maturity, which is an undesirable agricultural attribute. The objectives of our research are (i the identification of genes that condition quantitative resistance to P. infestans not compromised by late plant maturity and (ii the discovery of diagnostic single nucleotide polymorphism (SNP markers to be used as molecular tools to increase efficiency and precision of resistance breeding. Twenty two novel candidate genes were selected based on comparative transcript profiling by SuperSAGE (serial analysis of gene expression in groups of plants with contrasting levels of maturity corrected resistance (MCR. Reproducibility of differential expression was tested by quantitative real time PCR and allele specific pyrosequencing in four new sets of genotype pools with contrasting late blight resistance levels, at three infection time points and in three independent infection experiments. Reproducibility of expression patterns ranged from 28% to 97%. Association mapping in a panel of 184 tetraploid cultivars identified SNPs in five candidate genes that were associated with MCR. These SNPs can be used in marker-assisted resistance breeding. Linkage mapping in two half-sib families (n = 111 identified SNPs in three candidate genes that were linked with MCR. The differentially expressed genes that showed association and/or linkage with MCR putatively function in phytosterol synthesis, fatty acid synthesis, asparagine synthesis, chlorophyll synthesis, cell wall modification and in the response to pathogen elicitors.

  15. Transcriptomic identification of candidate genes involved in sunflower responses to chilling and salt stresses based on cDNA microarray analysis.

    Science.gov (United States)

    Fernandez, Paula; Di Rienzo, Julio; Fernandez, Luis; Hopp, H Esteban; Paniego, Norma; Heinz, Ruth A

    2008-01-26

    Considering that sunflower production is expanding to arid regions, tolerance to abiotic stresses as drought, low temperatures and salinity arises as one of the main constrains nowadays. Differential organ-specific sunflower ESTs (expressed sequence tags) were previously generated by a subtractive hybridization method that included a considerable number of putative abiotic stress associated sequences. The objective of this work is to analyze concerted gene expression profiles of organ-specific ESTs by fluorescence microarray assay, in response to high sodium chloride concentration and chilling treatments with the aim to identify and follow up candidate genes for early responses to abiotic stress in sunflower. Abiotic-related expressed genes were the target of this characterization through a gene expression analysis using an organ-specific cDNA fluorescence microarray approach in response to high salinity and low temperatures. The experiment included three independent replicates from leaf samples. We analyzed 317 unigenes previously isolated from differential organ-specific cDNA libraries from leaf, stem and flower at R1 and R4 developmental stage. A statistical analysis based on mean comparison by ANOVA and ordination by Principal Component Analysis allowed the detection of 80 candidate genes for either salinity and/or chilling stresses. Out of them, 50 genes were up or down regulated under both stresses, supporting common regulatory mechanisms and general responses to chilling and salinity. Interestingly 15 and 12 sequences were up regulated or down regulated specifically in one stress but not in the other, respectively. These genes are potentially involved in different regulatory mechanisms including transcription/translation/protein degradation/protein folding/ROS production or ROS-scavenging. Differential gene expression patterns were confirmed by qRT-PCR for 12.5% of the microarray candidate sequences. Eighty genes isolated from organ-specific cDNA libraries

  16. Transcriptomic identification of candidate genes involved in sunflower responses to chilling and salt stresses based on cDNA microarray analysis

    Directory of Open Access Journals (Sweden)

    Paniego Norma

    2008-01-01

    Full Text Available Abstract Background Considering that sunflower production is expanding to arid regions, tolerance to abiotic stresses as drought, low temperatures and salinity arises as one of the main constrains nowadays. Differential organ-specific sunflower ESTs (expressed sequence tags were previously generated by a subtractive hybridization method that included a considerable number of putative abiotic stress associated sequences. The objective of this work is to analyze concerted gene expression profiles of organ-specific ESTs by fluorescence microarray assay, in response to high sodium chloride concentration and chilling treatments with the aim to identify and follow up candidate genes for early responses to abiotic stress in sunflower. Results Abiotic-related expressed genes were the target of this characterization through a gene expression analysis using an organ-specific cDNA fluorescence microarray approach in response to high salinity and low temperatures. The experiment included three independent replicates from leaf samples. We analyzed 317 unigenes previously isolated from differential organ-specific cDNA libraries from leaf, stem and flower at R1 and R4 developmental stage. A statistical analysis based on mean comparison by ANOVA and ordination by Principal Component Analysis allowed the detection of 80 candidate genes for either salinity and/or chilling stresses. Out of them, 50 genes were up or down regulated under both stresses, supporting common regulatory mechanisms and general responses to chilling and salinity. Interestingly 15 and 12 sequences were up regulated or down regulated specifically in one stress but not in the other, respectively. These genes are potentially involved in different regulatory mechanisms including transcription/translation/protein degradation/protein folding/ROS production or ROS-scavenging. Differential gene expression patterns were confirmed by qRT-PCR for 12.5% of the microarray candidate sequences. Conclusion

  17. An Organic Metal/Silver Nanoparticle Finish on Copper for Efficient Passivation and Solderability Preservation

    Directory of Open Access Journals (Sweden)

    Wessling Bernhard

    2007-01-01

    Full Text Available AbstractFor the first time, a complex formed by polyaniline (in its organic metal form and silver has been deposited on copper in nanoparticulate form. When depositing on Cu pads of printed circuit boards it efficiently protects against oxidation and preserves its solderability. The deposited layer has a thickness of only nominally 50 nm, containing the Organic Metal (conductive polymer, polyaniline, and silver. With >90% (by volume, polyaniline (PAni is the major component of the deposited layer, Ag is present equivalent to a 4 nm thickness. The Pani–Ag complex is deposited on Cu in form of about 100 nm small particles. Morphology, electrochemical characteristics, anti-oxidation and solderability results are reported.

  18. Diode Lasers used in Plastic Welding and Selective Laser Soldering - Applications and Products

    Science.gov (United States)

    Reinl, S.

    Aside from conventional welding methods, laser welding of plastics has established itself as a proven bonding method. The component-conserving and clean process offers numerous advantages and enables welding of sensitive assemblies in automotive, electronic, medical, human care, food packaging and consumer electronics markets. Diode lasers are established since years within plastic welding applications. Also, soft soldering using laser radiation is becoming more and more significant in the field of direct diode laser applications. Fast power controllability combined with a contactless temperature measurement to minimize thermal damage make the diode laser an ideal tool for this application. These advantages come in to full effect when soldering of increasingly small parts in temperature sensitive environments is necessary.

  19. Formation mechanism of pillar-shaped intermetallic compounds dispersed lead-free solder joint

    Science.gov (United States)

    Nakata, Y.; Hashimoto, T.; Kurasawa, M.; Hayashi, Y.; Shohji, I.

    2017-10-01

    Large area joining between a substrate and a heat sink is desirable for high performance power modules. An intermetallic compounds (IMCs) pillar dispersed solder joint has been developed as a highly durable joint to achieve large area joining. The aim of this study is to clarify the generation and growth mechanism of the IMC pillar during soldering process. The structural characteristic of the IMC pillar was also examined by cross-sectional observation. The area ratio of the IMC pillars in the cross section of the joint increased with increasing the joining temperature. The shape of the IMC pillar became finer when the cooling rate was fast. In addition, the IMC pillar grew along the cooling direction.

  20. Appendix to the report from the low-residue soldering task force: Phase 2 results

    Energy Technology Data Exchange (ETDEWEB)

    Iman, R.L.; Anderson, D.J.; Huffman, D.D. [and others

    1995-12-01

    The LRSTF report for Phase I of its evaluation of low-residue soldering was issued in June 1995. This Appendix summarizes the results of follow-on testing performed in Phase II and compares electrical test results for both phases. Deliberate decisions were made by the LRSTF in Phase I to challenge the design guideline limits in MILSTD-275, Printed Wiring for Electronic Equipment The LRSTF considered this approach to produce a ``worst case`` design and provide useful information about the robustness of LR soldering processes. As such, good design practices were sometimes deliberately violated in designing the LRSTF board. This approach created some anomalies for both LR boards and RMA/cleaned controls. Phase II testing verified that problems that affected both RMA/cleaned and LR boards in Phase I were design related.

  1. Intense generation of respirable metal nanoparticles from a low-power soldering unit

    International Nuclear Information System (INIS)

    Gómez, Virginia; Irusta, Silvia; Balas, Francisco; Santamaria, Jesus

    2013-01-01

    Highlights: • Intense generation of nanoparticles in the breathing range from a flux-soldering unit is detected. • Coagulation in the aerosol phase leads to 200-nm respirable nanoparticles up to 30 min after operation. • Nanoparticle concentration in the working environment depends on the presence of ambient air. • Metal-containing nanoparticles are collected in TEM grids and filters in the hundreds of nanometer range. -- Abstract: Evidence of intense nanoparticle generation from a low power (45 W) flux soldering unit is presented. This is a familiar device often used in daily life, including home repairs and school electronic laboratories. We demonstrate that metal-containing nanoparticles may reach high concentrations (ca. 10 6 particles/cm 3 ) within the breathing range of the operator, with initial size distributions centered at 35–60 nm The morphological and chemical analysis of nanoparticle agglomerates collected on TEM grids and filters confirms their multiparticle structure and the presence of metals

  2. Study of silicon chip soldering in high-power transistor housing

    Directory of Open Access Journals (Sweden)

    Vasily S. Anosov

    2017-09-01

    We experimentally assessed the effect of outer housing layer materials and back side chip metallization. For lead-silver soldering of silicon chips, the best housing is that with a nickel outer layer rather than with a gold-plated one, because the resultant thermal resistance is lower and the absence of gold makes the technology cheaper. We obtained a 0.6 K/W thermal resistance for a 24 mm2 chip area.

  3. Current redistribution in cables made of insulated, soldered, or oxidized strands

    International Nuclear Information System (INIS)

    Turck, B.

    1979-07-01

    Current redistributions are compared in cables made of insulated strands, soldered, or oxidized strands and insulated strands with periodic joints. After discussing the different current redistributions in the cases of a rapidly changing current and a dc current, several particular situations are investigated: what happens if a strand is broken, or if a local normal zone appears that does not affect all the strands equally, the detection of this normal zone, and the influence of short circuits between strands

  4. Influence of active element Ti on interfacial reaction and soldering strength between Sn3.5Ag4Ti(Ce,Ga) alloy filler and Si substrate

    Energy Technology Data Exchange (ETDEWEB)

    Cheng, L.X. [School of Electronic and Information Engineering, South China University of Technology, Wushan R.D., Tianhe District, Guangzhou 510641 (China); Li, G.Y., E-mail: phgyli@scut.edu.cn [School of Electronic and Information Engineering, South China University of Technology, Wushan R.D., Tianhe District, Guangzhou 510641 (China); Wang, X.Q. [China Electronic Product Reliability and Environmental Testing Research Institute, Dongguanzhuang R.D., Tianhe District, Guangzhou 510610 (China); Li, Z.L.; Wu, Z.Z. [School of Electronic and Information Engineering, South China University of Technology, Wushan R.D., Tianhe District, Guangzhou 510641 (China)

    2016-03-21

    The influence of titanium on the interfacial reaction and soldering strength between Sn3.5Ag4Ti(Ce,Ga) and silicon substrates has been studied. The microstructure, the distribution of the elements, and the new phases formed at the interface were investigated. It is observed that the Sn3.5Ag4Ti(Ce,Ga) solder can wet the silicon well under the agitation of external force. The titanium element could be found to obviously segregate at the silicon/solder interface by element mapping, and some discontinuous reaction products could be found at the silicon/solder interface by transmission electron microscopy (TEM). Theoretical analysis results suggest that there might be two soldering mechanisms coexisting in the soldering process, the chemical adsorption of Ti on the silicon surface and the interfacial reaction between Si substrate and Sn3.5Ag4Ti(Ce,Ga) solder. Both of them play important roles in realizing reliable bonding of silicon to silicon. The interfacial model between Si and Sn3.5Ag4Ti(Ce,Ga) active solder was established to explain the bonding mechanism. The shear strengths of the soldered silicon/silicon joints were measured and the effects of Ti on the bonding strength are discussed.

  5. The influence of solder mask and hygroscopic flux residues on water layer formation on PCBA surface and corrosion reliability of electronics

    DEFF Research Database (Denmark)

    Piotrowska, Kamila; Jellesen, Morten Stendahl; Ambat, Rajan

    2017-01-01

    The presence of solder flux residue on the Printed Circuit Board Assembly (PCBA) surface compromises the corrosion reliability of electronics under humid conditions and can lead to degradation of the device’s lifetime. In this work, the effect of solder mask morphology and hygroscopic residues were...... studied towards assessment of their influence on the water film formation on the PCBA surface. The in-situ observations of water layer build-up was studied on the solder mask substrates as a function of surface finish and residue type (adipic and glutaric acids). The effect of solder flux residues...

  6. The Wetting Properties of UBM-coated Si-wafer to the Lead-free Solders in Si-wafer/Bumps/Glass Flip-Chip Bonding System

    Energy Technology Data Exchange (ETDEWEB)

    Hong, S.M.; Park, J.Y. [Seoul National University, Seoul (Korea); Park, C.B.; Jung, J.P. [University of Seoul, Seoul (Korea); Kang, C.S. [Seoul National University, Seoul (Korea)

    2000-04-24

    In an attempt to estimate the wetting properties of wettable metal layers by wetting balance method, an analysis of wetting curves of the coating later was performed. Based on the analysis, wetting properties of UBM-coated Si-plate were estimated by the new wettability indices. The wetting curves of the one and both sides-coated UBM layers have the similar shape and show the similar tendency to the temperature. So the wetting property estimation of one side coating is possible with wetting balance method. For UBM of Si-chip, Cr/Cu/Au UBM is better than Ti/Ni/Au in the point of wetting time. At general reflow temperature, the wettability of high melting point solders (Sn-Sb, Sn-Ag) is better than that of low melting point ones (Sn-Bi, Sn-In). The contact angle of the one side coated plate to the solder can be calculated from the force balance equation by measuring the static state force and the tilt angle. (author). 4 refs., 2 tabs., 9 figs.

  7. Effect of the Creative Drama-Based Assertiveness Program on the Assertiveness Skill of Psychological Counsellor Candidates

    Science.gov (United States)

    Gundogdu, Rezzan

    2012-01-01

    The purpose of this quasi-experimental research is to study the effects of the creative drama-based assertiveness program (CDBAP) on the assertiveness skill of Psychological Counselling and Guidance (PCG) department students. The opinions of experimental group students on the program were obtained through the CDBAP evaluation form. The sample of…

  8. The Effect of ICT Assisted Project Based Learning Approach on Prospective ICT Integration Skills of Teacher Candidates

    Science.gov (United States)

    Pilten, Pusat; Pilten, Gulhiz; Sahinkaya, Nihan

    2017-01-01

    The purpose of the present research is studying the effects of information and communication technologies (ICT) assisted project based learning practices on ICT integration skills of pre-service classroom teachers. The research adopted a mixed method. The quantitative dimension of the research was designed with pre-test-post-test control groups.…

  9. Uniaxial tensile and shear deformation tests of gold–tin eutectic solder film

    Directory of Open Access Journals (Sweden)

    Takahiro Namazu, Hideki Takemoto, Hiroshi Fujita and Shozo Inoue

    2007-01-01

    Full Text Available This paper describes a novel experimental technique for measuring mechanical properties of gold-tin (Au–Sn eutectic solder film used for soldering package in microelectromechanical systems (MEMS. Dual-source DC magnetron sputtering was employed to deposit Au-20 weight % (wt% Sn film. The tensile test with in situ X-ray diffraction (XRD measurement evaluates the Young's modulus and Poisson's ratio at intermediate temperatures. The Young's modulus and Poisson's ratio at room temperature were found to be 51.3 GPa and 0.288, lower than bulk values. The Young's modulus decreased with increasing temperature, whereas the Poisson's ratio did not depend on temperature. The XRD tensile test also showed creep deformation behavior of Au–Sn film. We have developed a shear deformation test technique, which is performed by using Au–Sn film sandwiched by two single crystal silicon (Si cantilever structures, to characterize the shear properties of the film. The shear moduli obtained from the shear deformation tests ranged from 11.5 to 13.3 GPa, about 38% lower than those from the XRD tensile tests. The measured shear strength from 12 to 17 MPa exhibited a temperature dependency. Information about the tensile and shear characteristics would likely to be of great use in designing Au–Sn soldering packages for MEMS.

  10. The Influence of PV Module Materials and Design on Solder Joint Thermal Fatigue Durability

    Energy Technology Data Exchange (ETDEWEB)

    Bosco, Nick; Silverman, Timothy J.; Kurtz, Sarah

    2016-11-01

    Finite element model (FEM) simulations have been performed to elucidate the effect of flat plate photovoltaic (PV) module materials and design on PbSn eutectic solder joint thermal fatigue durability. The statistical method of Latin Hypercube sampling was employed to investigate the sensitivity of simulated damage to each input variable. Variables of laminate material properties and their thicknesses were investigated. Using analysis of variance, we determined that the rate of solder fatigue was most sensitive to solder layer thickness, with copper ribbon and silicon thickness being the next two most sensitive variables. By simulating both accelerated thermal cycles (ATCs) and PV cell temperature histories through two characteristic days of service, we determined that the acceleration factor between the ATC and outdoor service was independent of the variables sampled in this study. This result implies that an ATC test will represent a similar time of outdoor exposure for a wide range of module designs. This is an encouraging result for the standard ATC that must be universally applied across all modules.

  11. Laser Soldering and Thermal Cycling Tests of Monolithic Silicon Pixel Chips

    CERN Document Server

    Strand, Frode Sneve

    2015-01-01

    An ALPIDE-1 monolithic silicon pixel sensor prototype has been laser soldered to a flex printed circuit using a novel interconnection technique using lasers. This technique is to be optimised to ensure stable, good quality connections between the sensor chips and the FPCs. To test the long-term stability of the connections, as well as study the effects on hit thresholds and noise in the sensor, it was thermally cycled in a climate chamber 1200 times. The soldered connections showed good qualities like even melting and good adhesion on pad/flex surfaces, and the chip remained in working condition for 1080 cycles. After this, a few connections failed, having cracks in the soldering tin, rendering the chip unusable. Threshold and noise characteristics seemed stable, except for the noise levels of sector 2 in the chip, for 1000 cycles in a temperature interval of "10^{\\circ}" and "50^{\\circ}" C. Still, further testing with wider temperature ranges and more cycles is needed to test the limitations of the chi...

  12. Investigation of Sn-Pb solder bumps of prototype photo detectors for the LHCb experiment

    CERN Document Server

    Delsante, M L; Arnau-Izquierdo, G

    2004-01-01

    The Large Hadron Collider (LHC) is now under construction at the European Organization for Nuclear Research (CERN). LHCb is one of the dedicated LHC experiments, allowing high energy proton-proton collisions to be exploited. This paper presents the results of the metallurgic studies carried out on Sn-Pb solder bumps of prototype vacuum photo detectors under development for LHCb, and in particular for the ring imaging Cherenkov-hybrid photo diode (RICH-HPD) project. These detectors encapsulate, in a vacuum tube, an assembly made of two silicon chips bonded together by a matrix of solder bumps. Each bump lies on a suitable system of under-bump metallic layers ensuring mechanical and electrical transition between the chip pad and the solder alloy. During manufacturing of the detector, bump-bonded (BB) assemblies are exposed to severe heat cycles up to 400 degree C inducing, in the present fabrication process, a clear degradation of electrical connectivity. Several investigations such as microstructural observati...

  13. Synthesis of composite gold/tin-oxide nanoparticles by nano-soldering

    International Nuclear Information System (INIS)

    Bajaj, Geetika; Soni, R. K.

    2010-01-01

    Composite Au-SnO 2 nanoparticles (NPs) are synthesized by nano-soldering of pure Au and SnO 2 NPs. The multi-step process involves synthesis of pure Au and SnO 2 NPs separately by nanosecond pulse laser ablation of pure gold and pure tin targets in deionized water and post-ablation laser heating of mixed solution of Au colloidal and SnO 2 colloidal to form nanocomposite. Transmission Electron Microscopy (TEM) and High-Resolution Transmission Electron Microscopy (HRTEM) were used to study the effect of laser irradiation time on morphology of the composite Au-SnO 2 NPs. The spherical particles of 4 nm mean size were obtained for 5 min of post-laser heating. Increased mean size and elongated particles were observed on further laser heating. UV-vis spectra of Au-SnO 2 nanocomposites show red shift in the plasmon resonance absorption peak and line shape broadening with respect to pure Au NPs. The negative binding energy shift of Au 4f 7/2 peak observed in X-ray Photoelectron Spectra (XPS) indicates charge transfer in the nano-soldered Au-SnO 2 between gold and tin oxide and formation of soldered nanocomposite.

  14. Looking for New Polycrystalline MC-Reinforced Cobalt-Based Superalloys Candidate to Applications at 1200°C

    OpenAIRE

    Patrice Berthod

    2017-01-01

    For applications for which temperatures higher than 1150°C can be encountered the currently best superalloys, the γ/γ′ single crystals, cannot be used under stress because of the disappearance of their reinforcing γ′ precipitates at such temperatures which are higher than their solvus. Cobalt-based alloys strengthened by refractory and highly stable carbides may represent an alternative solution. In this work the interest was focused on MC carbides of several types. Alloys were elaborated wit...

  15. Using rule-based machine learning for candidate disease gene prioritization and sample classification of cancer gene expression data.

    Directory of Open Access Journals (Sweden)

    Enrico Glaab

    Full Text Available Microarray data analysis has been shown to provide an effective tool for studying cancer and genetic diseases. Although classical machine learning techniques have successfully been applied to find informative genes and to predict class labels for new samples, common restrictions of microarray analysis such as small sample sizes, a large attribute space and high noise levels still limit its scientific and clinical applications. Increasing the interpretability of prediction models while retaining a high accuracy would help to exploit the information content in microarray data more effectively. For this purpose, we evaluate our rule-based evolutionary machine learning systems, BioHEL and GAssist, on three public microarray cancer datasets, obtaining simple rule-based models for sample classification. A comparison with other benchmark microarray sample classifiers based on three diverse feature selection algorithms suggests that these evolutionary learning techniques can compete with state-of-the-art methods like support vector machines. The obtained models reach accuracies above 90% in two-level external cross-validation, with the added value of facilitating interpretation by using only combinations of simple if-then-else rules. As a further benefit, a literature mining analysis reveals that prioritizations of informative genes extracted from BioHEL's classification rule sets can outperform gene rankings obtained from a conventional ensemble feature selection in terms of the pointwise mutual information between relevant disease terms and the standardized names of top-ranked genes.

  16. Using rule-based machine learning for candidate disease gene prioritization and sample classification of cancer gene expression data.

    Science.gov (United States)

    Glaab, Enrico; Bacardit, Jaume; Garibaldi, Jonathan M; Krasnogor, Natalio

    2012-01-01

    Microarray data analysis has been shown to provide an effective tool for studying cancer and genetic diseases. Although classical machine learning techniques have successfully been applied to find informative genes and to predict class labels for new samples, common restrictions of microarray analysis such as small sample sizes, a large attribute space and high noise levels still limit its scientific and clinical applications. Increasing the interpretability of prediction models while retaining a high accuracy would help to exploit the information content in microarray data more effectively. For this purpose, we evaluate our rule-based evolutionary machine learning systems, BioHEL and GAssist, on three public microarray cancer datasets, obtaining simple rule-based models for sample classification. A comparison with other benchmark microarray sample classifiers based on three diverse feature selection algorithms suggests that these evolutionary learning techniques can compete with state-of-the-art methods like support vector machines. The obtained models reach accuracies above 90% in two-level external cross-validation, with the added value of facilitating interpretation by using only combinations of simple if-then-else rules. As a further benefit, a literature mining analysis reveals that prioritizations of informative genes extracted from BioHEL's classification rule sets can outperform gene rankings obtained from a conventional ensemble feature selection in terms of the pointwise mutual information between relevant disease terms and the standardized names of top-ranked genes.

  17. Tensor decomposition-based unsupervised feature extraction identifies candidate genes that induce post-traumatic stress disorder-mediated heart diseases.

    Science.gov (United States)

    Taguchi, Y-H

    2017-12-21

    Although post-traumatic stress disorder (PTSD) is primarily a mental disorder, it can cause additional symptoms that do not seem to be directly related to the central nervous system, which PTSD is assumed to directly affect. PTSD-mediated heart diseases are some of such secondary disorders. In spite of the significant correlations between PTSD and heart diseases, spatial separation between the heart and brain (where PTSD is primarily active) prevents researchers from elucidating the mechanisms that bridge the two disorders. Our purpose was to identify genes linking PTSD and heart diseases. In this study, gene expression profiles of various murine tissues observed under various types of stress or without stress were analyzed in an integrated manner using tensor decomposition (TD). Based upon the obtained features, ∼ 400 genes were identified as candidate genes that may mediate heart diseases associated with PTSD. Various gene enrichment analyses supported biological reliability of the identified genes. Ten genes encoding protein-, DNA-, or mRNA-interacting proteins-ILF2, ILF3, ESR1, ESR2, RAD21, HTT, ATF2, NR3C1, TP53, and TP63-were found to be likely to regulate expression of most of these ∼ 400 genes and therefore are candidate primary genes that cause PTSD-mediated heart diseases. Approximately 400 genes in the heart were also found to be strongly affected by various drugs whose known adverse effects are related to heart diseases and/or fear memory conditioning; these data support the reliability of our findings. TD-based unsupervised feature extraction turned out to be a useful method for gene selection and successfully identified possible genes causing PTSD-mediated heart diseases.

  18. Identifying Candidate Targets of Immune Responses in Zika Virus Based on Homology to Epitopes in Other Flavivirus Species.

    Science.gov (United States)

    Xu, Xiaojun; Vaughan, Kerrie; Weiskopf, Daniela; Grifoni, Alba; Diamond, Michael S; Sette, Alessandro; Peters, Bjoern

    2016-11-15

    The current outbreak of Zika virus has resulted in a massive effort to accelerate the development of ZIKV-specific diagnostics and vaccines. These efforts would benefit greatly from the definition of the specific epitope targets of immune responses in ZIKV, but given the relatively recent emergence of ZIKV as a pandemic threat, few such data are available. We used a large body of epitope data for other Flaviviruses that was available from the IEDB for a comparative analysis against the ZIKV proteome in order to project targets of immune responses in ZIKV. We found a significant level of overlap between known antigenic sites from other Flavivirus proteins with residues on the ZIKV polyprotein. The E and NS1 proteins shared functional antibody epitope sites, whereas regions of T cell reactivity were conserved within NS3 and NS5 for ZIKV.  Discussion: Our epitope based analysis provides guidance for which regions of the ZIKV polyprotein are most likely unique targets of ZIKV-specific antibodies, and which targets in ZIKV are most likely to be cross-reactive with other Flavivirus species. These data may therefore provide insights for the development of antibody- and T cell-based ZIKV-specific diagnostics, therapeutics and prophylaxis.

  19. Effects of Ce and La Additions on the Microstructure and Mechanical Properties of Sn-9Zn Solder Joints

    Science.gov (United States)

    Lin, Hsiu-Jen; Chuang, Tung-Han

    2010-02-01

    The effects of rare-earth elements on the microstructure and mechanical properties of Sn-9Zn alloys and solder joints in ball grid array packages with Ni/Au(ENIG) surface finishes have been investigated. Metallographic observations showed that (Ce0.8Zn0.2)Sn3 and (La0.9Zn0.1)Sn3 intermetallic compounds appeared in the solder matrix of Sn-9Zn-0.5Ce and Sn-9Zn-0.5La alloys, respectively. Both fiber- and hillock-shaped tin whiskers were inhibited in the Sn-9Zn-0.5Ce solder, while tin fibers were still observed on the surface of oxidized (La0.9Zn0.1)Sn3 intermetallics in Sn-9Zn-0.5La after air exposure at room temperature. Mechanical testing indicated that the tensile strength of Sn-9Zn alloys doped with Ce and La increased significantly, and the elongation decreased, in comparison with the undoped Sn-9Zn. The bonding strengths of the as-reflowed Sn-9Zn-0.5Ce and Sn-9Zn-0.5La solder joints were also improved. However, aging treatment at 100°C and 150°C caused degradation of ball shear strength in all specimens. During the reflowing and aging processes, AuZn8 intermetallic phases appeared at the interfaces of all solder joints. In addition, Zn-rich phases were observed to migrate from the solder matrix to the solder/pad interfaces of the aged specimens.

  20. Interfacial microstructures and solder joint strengths of the Sn-8Zn-3Bi and Sn-9Zn-lAl Pb-free solder pastes on OSP finished printed circuit boards

    International Nuclear Information System (INIS)

    Lin, C.-T.; Hsi, C.-S.; Wang, M.-C.; Chang, T.-C.; Liang, M.-K.

    2008-01-01

    Two kinds of lead-free solders, Sn-8Zn-3Bi and Sn-9Zn-lAl, were used to mount passive components onto printed circuit boards via a re-flow soldering process. The samples were stored at 150 deg. C for 200, 400, 600, 800, and 1100 h. The microstructures of the samples after aged at 150 deg. C for various times were characterized using optical microscopy (OM), scanning electron microscopy (SEM), energy dispersive spectrometry (EDS) and the analyzed of solder joint shear strengths. The joint strength between Sn-8Zn-3Bi and Cu pad was about 4.0 ± 0.3 kg, while the strength between Sn-9Zn-lAl and Cu pad had values of 2.6 ± 0.1 kg. Both kinds of solder joints exhibited reduced strengths with increasing aging times. After aging at 150 deg. C for 1100 h, the joints strengths of Sn-8Zn-3Bi and Sn-9Zn-lAl were 1.8 ± 0.3 and 1.7 ± 0.3 kg, respectively. Both the Sn-8Zn-3Bi and Sn-9Zn-lAl joints showed brittle fracture behaviors. A flat layer of Cu 5 Zn 8 intermetallic compound (IMC) was formed between Sn-8Zn-3Bi solder and Cu pad after reflow. When the aging time was increased to 400 h, Zn-depletion and formation of Cu 6 Sn 5 IMC were observed in the solders due to the interaction between the tin and zinc compounds. The interaction between Sn-9Zn-lAl solder and Cu pad had similar behavior, however, Cu 6 Sn 5 IMC formed in Sn-9Zn-lAl solder when after aging at 150 deg. C for 600 h. As the aging time increased, both types of solders generated clear IMC spalling layers with large and continuous voids. Those voids substantially decreased the joint strength

  1. Interfacial microstructures and solder joint strengths of the Sn-8Zn-3Bi and Sn-9Zn-lAl Pb-free solder pastes on OSP finished printed circuit boards

    Energy Technology Data Exchange (ETDEWEB)

    Lin, C.-T. [Department of Materials Science and Engineering, National United University, 1 Lein-Da, Kung-Ching Li, Miaoli 36003, Taiwan (China); Electronics and Optoelectronics Research Laboratories, Industrial Technology Research Institute, 195 Section 4, Chung-Hsing Road, Chutung, Hsinchu 31040, Taiwan (China); Hsi, C.-S. [Department of Materials Science and Engineering, National United University, 1 Lein-Da, Kung-Ching Li, Miaoli 36003, Taiwan (China); Wang, M.-C. [Faculty of Fragrance and Cosmetics, Kaohsiung Medical University, 100 Shih-Chuan 1st Road, Kaohsiung 807, Taiwan (China)], E-mail: mcwang@kmu.edu.tw; Chang, T.-C.; Liang, M.-K. [Electronics and Optoelectronics Research Laboratories, Industrial Technology Research Institute, 195 Section 4, Chung-Hsing Road, Chutung, Hsinchu 31040, Taiwan (China)

    2008-07-14

    Two kinds of lead-free solders, Sn-8Zn-3Bi and Sn-9Zn-lAl, were used to mount passive components onto printed circuit boards via a re-flow soldering process. The samples were stored at 150 deg. C for 200, 400, 600, 800, and 1100 h. The microstructures of the samples after aged at 150 deg. C for various times were characterized using optical microscopy (OM), scanning electron microscopy (SEM), energy dispersive spectrometry (EDS) and the analyzed of solder joint shear strengths. The joint strength between Sn-8Zn-3Bi and Cu pad was about 4.0 {+-} 0.3 kg, while the strength between Sn-9Zn-lAl and Cu pad had values of 2.6 {+-} 0.1 kg. Both kinds of solder joints exhibited reduced strengths with increasing aging times. After aging at 150 deg. C for 1100 h, the joints strengths of Sn-8Zn-3Bi and Sn-9Zn-lAl were 1.8 {+-} 0.3 and 1.7 {+-} 0.3 kg, respectively. Both the Sn-8Zn-3Bi and Sn-9Zn-lAl joints showed brittle fracture behaviors. A flat layer of Cu{sub 5}Zn{sub 8} intermetallic compound (IMC) was formed between Sn-8Zn-3Bi solder and Cu pad after reflow. When the aging time was increased to 400 h, Zn-depletion and formation of Cu{sub 6}Sn{sub 5} IMC were observed in the solders due to the interaction between the tin and zinc compounds. The interaction between Sn-9Zn-lAl solder and Cu pad had similar behavior, however, Cu{sub 6}Sn{sub 5} IMC formed in Sn-9Zn-lAl solder when after aging at 150 deg. C for 600 h. As the aging time increased, both types of solders generated clear IMC spalling layers with large and continuous voids. Those voids substantially decreased the joint strength.

  2. Looking for New Polycrystalline MC-Reinforced Cobalt-Based Superalloys Candidate to Applications at 1200°C

    Directory of Open Access Journals (Sweden)

    Patrice Berthod

    2017-01-01

    Full Text Available For applications for which temperatures higher than 1150°C can be encountered the currently best superalloys, the γ/γ′ single crystals, cannot be used under stress because of the disappearance of their reinforcing γ′ precipitates at such temperatures which are higher than their solvus. Cobalt-based alloys strengthened by refractory and highly stable carbides may represent an alternative solution. In this work the interest was focused on MC carbides of several types. Alloys were elaborated with atomically equivalent quantities in M element (among Ti, Ta, Nb, Hf, or Zr and in C. Script-like eutectic TiC, TaC, NbC, HfC, and ZrC carbides were successfully obtained in the interdendritic spaces. Unfortunately, only one type, HfC, demonstrated high morphological stability during about 50 hours at 1200°C. The concerned alloy, of the Co-25Cr-0.5C-7.4Hf type (in wt.%, was further characterized in flexural creep resistance and air-oxidation resistance at the same temperature. The creep behaviour was very good, notably by comparison with a more classical Co-25Cr-0.5C-7.5Ta alloy, proving that the interest of HfC is higher than the TaC one. In contrast the oxidation by air was faster and its behaviour not really chromia-forming. Significant improvements of this chemical resistance are expected before taking benefit from the mechanical superiority of this alloy.

  3. Preclinical profiling of the immunogenicity of a two-component subunit malaria vaccine candidate based on virosome technology.

    Science.gov (United States)

    Okitsu, Shinji L; Mueller, Markus S; Amacker, Mario; Vogel, Denise; Westerfeld, Nicole; Robinson, John A; Zurbriggen, Rinaldo; Pluschke, Gerd

    2008-01-01

    Presentation of synthetic peptides on immunopotentiating reconstituted influenza virosomes is a promising technology for subunit vaccine development. An optimized virosomally delivered peptide representing 5 NPNA repeats of P. falciparum circumsporozoite protein is highly immunogenic in mice. Antibodies against this peptide (UK-39) inhibit sporozoite invasion of human hepatocytes. A second peptide (AMA49-C1) based on domain III of apical membrane antigen 1, induces antibodies that inhibit blood-stage parasite growth in vitro. Here we show a detailed pre-clinical profiling of these virosomally formulated peptides alone and in combination in mice and rabbits. Two immunizations with virosomally formulated UK-39 or AMA49-C1 were enough to elicit high titers of parasite cross-reactive antibodies in both species. A low dose of 10 microg UK-39 was enough to induce maximal titers in rabbits. Higher doses of peptide did not increase antibody titers. In contrast, AMA49-C1 induced higher antibody titers with 25 and 50 microg peptide. Combination of UK-39 and AMA49- C1 on separate virosomes did not have any negative effect on anti-peptide antibody titers in mice or rabbits. No MHC restriction was observed in the development of humoral responses in outbred rabbits with different immunogenetic backgrounds. All vaccine formulations were safe in toxicity studies in rabbits and rats. Taken together, low amounts of synthetic peptides delivered on virosomes induced high antibody titers in mice and rabbits. Moreover, different peptides could be combined without interfering with individual anti-peptide responses, augmenting the value of this system for the development of a multivalent malaria vaccine.

  4. Conservation and diversity of influenza A H1N1 HLA-restricted T cell epitope candidates for epitope-based vaccines.

    Directory of Open Access Journals (Sweden)

    Paul Thiamjoo Tan

    2010-01-01

    Full Text Available The immune-related evolution of influenza viruses is exceedingly complex and current vaccines against influenza must be reformulated for each influenza season because of the high degree of antigenic drift among circulating influenza strains. Delay in vaccine production is a serious problem in responding to a pandemic situation, such as that of the current H1N1 strain. Immune escape is generally attributed to reduced antibody recognition of the viral hemagglutinin and neuraminidase proteins whose rate of mutation is much greater than that of the internal non-structural proteins. As a possible alternative, vaccines directed at T cell epitope domains of internal influenza proteins, that are less susceptible to antigenic variation, have been investigated.HLA transgenic mouse strains expressing HLA class I A*0201, A*2402, and B*0702, and class II DRB1*1501, DRB1*0301 and DRB1*0401 were immunized with 196 influenza H1N1 peptides that contained residues of highly conserved proteome sequences of the human H1N1, H3N2, H1N2, H5N1, and avian influenza A strains. Fifty-four (54 peptides that elicited 63 HLA-restricted peptide-specific T cell epitope responses were identified by IFN-gamma ELISpot assay. The 54 peptides were compared to the 2007-2009 human H1N1 sequences for selection of sequences in the design of a new candidate H1N1 vaccine, specifically targeted to highly-conserved HLA-restricted T cell epitopes.Seventeen (17 T cell epitopes in PB1, PB2, and M1 were selected as vaccine targets based on sequence conservation over the past 30 years, high functional avidity, non-identity to human peptides, clustered localization, and promiscuity to multiple HLA alleles. These candidate vaccine antigen sequences may be applicable to any avian or human influenza A virus.

  5. New Ablation-Resistant Material Candidate for Hypersonic Applications: Synthesis, Composition, and Oxidation Resistance of HfIr3-Based Solid Solution.

    Science.gov (United States)

    Lozanov, Victor V; Baklanova, Natalya I; Bulina, Natalia V; Titov, Anatoly T

    2018-04-18

    The peculiarities of the solid-state interaction in the HfC-Ir system have been studied within the 1000-1600 °C temperature range using a set of modern analytical techniques. It was stated that the interaction of HfC with iridium becomes noticeable at temperatures as low as 1000-1100 °C and results in the formation of HfIr 3 -based substitutional solid solution. The homogeneity range of the HfIr 3± x phase was evaluated and refined as HfIr 2.43 -HfIr 3.36 . The durability of the HfIr 3 -based system under extreme environmental conditions was studied. It was shown that the HfIr 3 -based material displays excellent ablation resistance under extreme environmental conditions. The benefits of the new designed material result from its relative oxygen impermeability and special microstructure similar to superalloys. The results obtained in this work allow us to consider HfIr 3 as a very promising candidate for extreme applications.

  6. High-yield production of a stable Vero cell-based vaccine candidate against the highly pathogenic avian influenza virus H5N1

    Energy Technology Data Exchange (ETDEWEB)

    Zhou, Fangye; Zhou, Jian; Ma, Lei; Song, Shaohui; Zhang, Xinwen; Li, Weidong; Jiang, Shude [No. 5, Department of Bioproducts, Institute of Medical Biology, Chinese Academy of Medical Science and Pecking Union Medical College, Jiaoling Avenue 935, Kunming, Yunnan Province 650102, People' s Republic of China (China); Wang, Yue, E-mail: euy-tokyo@umin.ac.jp [National Institute for Viral Disease Control and Prevention, China Center for Disease Control and Prevention, Yingxin Lane 100, Xicheng District, Beijing 100052, People' s Republic of China (China); Liao, Guoyang, E-mail: liaogy@21cn.com [No. 5, Department of Bioproducts, Institute of Medical Biology, Chinese Academy of Medical Science and Pecking Union Medical College, Jiaoling Avenue 935, Kunming, Yunnan Province 650102, People' s Republic of China (China)

    2012-05-18

    Highlights: Black-Right-Pointing-Pointer Vero cell-based HPAI H5N1 vaccine with stable high yield. Black-Right-Pointing-Pointer Stable high yield derived from the YNVa H3N2 backbone. Black-Right-Pointing-Pointer H5N1/YNVa has a similar safety and immunogenicity to H5N1delta. -- Abstract: Highly pathogenic avian influenza (HPAI) viruses pose a global pandemic threat, for which rapid large-scale vaccine production technology is critical for prevention and control. Because chickens are highly susceptible to HPAI viruses, the supply of chicken embryos for vaccine production might be depleted during a virus outbreak. Therefore, developing HPAI virus vaccines using other technologies is critical. Meeting vaccine demand using the Vero cell-based fermentation process has been hindered by low stability and yield. In this study, a Vero cell-based HPAI H5N1 vaccine candidate (H5N1/YNVa) with stable high yield was achieved by reassortment of the Vero-adapted (Va) high growth A/Yunnan/1/2005(H3N2) (YNVa) virus with the A/Anhui/1/2005(H5N1) attenuated influenza vaccine strain (H5N1delta) using the 6/2 method. The reassorted H5N1/YNVa vaccine maintained a high hemagglutination (HA) titer of 1024. Furthermore, H5N1/YNVa displayed low pathogenicity and uniform immunogenicity compared to that of the parent virus.

  7. High-yield production of a stable Vero cell-based vaccine candidate against the highly pathogenic avian influenza virus H5N1

    International Nuclear Information System (INIS)

    Zhou, Fangye; Zhou, Jian; Ma, Lei; Song, Shaohui; Zhang, Xinwen; Li, Weidong; Jiang, Shude; Wang, Yue; Liao, Guoyang

    2012-01-01

    Highlights: ► Vero cell-based HPAI H5N1 vaccine with stable high yield. ► Stable high yield derived from the YNVa H3N2 backbone. ► H5N1/YNVa has a similar safety and immunogenicity to H5N1delta. -- Abstract: Highly pathogenic avian influenza (HPAI) viruses pose a global pandemic threat, for which rapid large-scale vaccine production technology is critical for prevention and control. Because chickens are highly susceptible to HPAI viruses, the supply of chicken embryos for vaccine production might be depleted during a virus outbreak. Therefore, developing HPAI virus vaccines using other technologies is critical. Meeting vaccine demand using the Vero cell-based fermentation process has been hindered by low stability and yield. In this study, a Vero cell-based HPAI H5N1 vaccine candidate (H5N1/YNVa) with stable high yield was achieved by reassortment of the Vero-adapted (Va) high growth A/Yunnan/1/2005(H3N2) (YNVa) virus with the A/Anhui/1/2005(H5N1) attenuated influenza vaccine strain (H5N1delta) using the 6/2 method. The reassorted H5N1/YNVa vaccine maintained a high hemagglutination (HA) titer of 1024. Furthermore, H5N1/YNVa displayed low pathogenicity and uniform immunogenicity compared to that of the parent virus.

  8. Development of a candidate secondary reference procedure (immunoassay based measurement procedure of higher metrological order) for cardiac troponin I: I. Antibody characterization and preliminary validation.

    Science.gov (United States)

    Noble, James E; Bunk, David M; Christenson, Robert H; Cole, Kenneth D; He, Hua-Jun; Katrukha, Alexei G; Panteghini, Mauro; Porter, Robert A; Schimmel, Heinz; Tate, Jillian R; Wang, Lili

    2010-11-01

    In this study, the first steps in the development of a secondary reference measurement procedure (RMP) 'higher metrological order measurement procedure' to support the cardiac troponin I (cTnI) standardization initiative is described. The RMP should be used to assign values to serum-based secondary reference materials (RMs) without analytical artifacts causing bias. A multiplexed bead-based assay and sodium dodecyl sulfate polyacrylamide gel electrophoresis (SDS-PAGE) were used to identify the optimum monoclonal antibody pair (clones 560 and 19C7) for the RMP. Using these antibodies, an ELISA-based procedure was developed to accurately measure the main cTnI forms present in blood. The proposed RMP appears to show no bias when tested on samples containing various troponin complexes, phosphorylated and dephosphorylated forms, and heparin. The candidate assay displayed suitable linearity and sensitivity (limit of detection, 0.052 μg/L) for the measurement of the proposed cTnI secondary RMs. Preliminary comparison data on patient samples with a commercial cTnI assay are also provided to support the suitability of RMP for value assignment to RMs. Full validation and final assessment of the RMP will be performed through transferability and inter-comparison studies.

  9. Interfacial Reaction and IMC Growth of an Ultrasonically Soldered Cu/SAC305/Cu Structure during Isothermal Aging

    Directory of Open Access Journals (Sweden)

    Yulong Li

    2018-01-01

    Full Text Available In order to accelerate the growth of interfacial intermetallic compound (IMC layers in a soldering structure, Cu/SAC305/Cu was first ultrasonically spot soldered and then subjected to isothermal aging. Relatively short vibration times, i.e., 400 ms and 800 ms, were used for the ultrasonic soldering. The isothermal aging was conducted at 150 °C for 0, 120, 240, and 360 h. The evolution of microstructure, the IMC layer growth mechanism during aging, and the shear strength of the joints after aging were systemically investigated. Results showed the following. (i Formation of intermetallic compounds was accelerated by ultrasonic cavitation and streaming effects, the thickness of the interfacial Cu6Sn5 layer increased with aging time, and a thin Cu3Sn layer was identified after aging for 360 h. (ii The growth of the interfacial IMC layer of the ultrasonically soldered Cu/SAC305/Cu joints followed a linear function of the square root of the aging time, revealing a diffusion-controlled mechanism. (iii The tensile shear strength of the joint decreased to a small extent with increasing aging time, owing to the combined effects of IMC grain coarsening and the increase of the interfacial IMC. (iv Finally, although the fracture surfaces and failure locations of the joint soldered with 400 ms and 800 ms vibration times show similar characteristics, they are influenced by the aging time.

  10. Identification and chemical characterization of particulate matter from wave soldering processes at a printed circuit board manufacturing company

    International Nuclear Information System (INIS)

    Szoboszlai, Z.; Kertész, Zs.; Szikszai, Z.; Angyal, A.; Furu, E.; Török, Zs.; Daróczi, L.; Kiss, Á.Z.

    2012-01-01

    Highlights: ► We characterized aerosol particles in an environment where wave soldering is used. ► The constituents of the melt were recognized in the aerosols. ► Sources and creation process of PM were identified, e.g. soldering, fluxing, etching. ► Pb and other metals showed a maximum in the fine mode in the size distributions. ► Deposition probabilities of different particles along the respiratory tract were calculated. - Abstract: In this case study, the elemental composition and mass size distribution of indoor aerosol particles were determined in a working environment where soldering of printed circuit boards (PCB) took place. Single particle analysis using ion and electron microscopy was carried out to obtain more detailed and reliable data about the origin of these particles. As a result, outdoor and indoor aerosol sources such as wave soldering, fluxing processes, workers’ activity, mineral dust, biomass burning, fertilizing and other anthropogenic sources could be separated. With the help of scanning electron microscopy, characteristic particle types were identified. On the basis of the mass size distribution data, a stochastic lung deposition model was used to calculate the total and regional deposition efficiencies of the different types of particles within the human respiratory system. The information presented in this study aims to give insights into the detailed characteristics and the health impact of aerosol particles in a working environment where different kinds of soldering activity take place.

  11. On the Mutual Effect of Viscoplasticity and Interfacial Damage Progression in Interfacial Fracture of Lead-Free Solder Joints

    Science.gov (United States)

    Maleki, Milad; Cugnoni, Joel; Botsis, John

    2011-10-01

    The main goal of this paper is to shed light on the effect of strain rate and viscoplastic deformation of bulk solder on the interfacial failure of lead-free solder joints. For this purpose, interfacial damage evolution and mode I fracture behavior of the joint were evaluated experimentally by performing stable fracture tests at different strain rates employing an optimized tapered double cantilever beam (TDCB) design. The viscoplastic behavior of the solder was characterized in shear, and the constitutive parameters related to the Anand model were determined. A rate-independent cohesive zone damage model was identified to best simulate the interfacial damage progression in the TDCB tests by developing a three-dimensional (3D) finite-element (FE) model and considering the viscoplastic response of the bulk solder. The influence of strain rate on the load capability and failure mode of the joint was clarified by analyzing the experimental and simulation results. It was shown how, at the lower strain rates, the normal stress generated at the interface is limited by the significant creep relaxation developed in the bulk solder and thus is not sufficiently high to initiate interfacial damage, whereas at higher rates, a large amount of the external energy is dissipated into interfacial damage development.

  12. Do People 'Like' Candidates on Facebook?

    DEFF Research Database (Denmark)

    Nielsen, Rasmus Kleis

    The online popularity of a few exceptional candidates has led many to suggest that social media have given politicians powerful ways of communicating directly with voters. In this paper, we examine whether this is happening on a significant scale and show, based on analysis of 224 candidates invo...

  13. Stability of molybdenum nanoparticles in Sn-3.8Ag-0.7Cu solder during multiple reflow and their influence on interfacial intermetallic compounds

    Energy Technology Data Exchange (ETDEWEB)

    Haseeb, A.S.M.A., E-mail: haseeb@um.edu.my; Arafat, M.M., E-mail: arafat_mahmood@yahoo.com; Johan, Mohd Rafie, E-mail: mrafiej@um.edu.my

    2012-02-15

    This work investigates the effects of molybdenum nanoparticles on the growth of interfacial intermetallic compound between Sn-3.8Ag-0.7Cu solder and copper substrate during multiple reflow. Molybdenum nanoparticles were mixed with Sn-3.8Ag-0.7Cu solder paste by manual mixing. Solder samples were reflowed on a copper substrate in a 250 Degree-Sign C reflow oven up to six times. The molybdenum content of the bulk solder was determined by inductive coupled plasma-optical emission spectrometry. It is found that upon the addition of molybdenum nanoparticles to Sn-3.8Ag-0.7Cu solder, the interfacial intermetallic compound thickness and scallop diameter decreases under all reflow conditions. Molybdenum nanoparticles do not appear to dissolve or react with the solder. They tend to adsorb preferentially at the interface between solder and the intermetallic compound scallops. It is suggested that molybdenum nanoparticles impart their influence on the interfacial intermetallic compound as discrete particles. The intact, discrete nanoparticles, by absorbing preferentially at the interface, hinder the diffusion flux of the substrate and thereby suppress the intermetallic compound growth. - Highlights: Black-Right-Pointing-Pointer Mo nanoparticles do not dissolve or react with the SAC solder during reflow. Black-Right-Pointing-Pointer Addition of Mo nanoparticles results smaller IMC thickness and scallop diameter. Black-Right-Pointing-Pointer Mo nanoparticles influence the interfacial IMC through discrete particle effect.

  14. Isolation of human umbilical cord blood-derived osteoprogenitor cells: a promising candidate for cell-based therapy for bone repair

    Directory of Open Access Journals (Sweden)

    Igor Iuco Castro-Silva

    2011-12-01

    Full Text Available Objective: The aim of this study was to evaluate the osteogenic potential of human umbilical cord blood-derived osteoprogenitor cells and to prove its applicability as a promising candidate for cell-based therapeutics for bone repair. Methods: Primary cultures of human umbilical blood cord adherent cells were expanded in vitro until passage 2 and seeded for osteodifferentiation study. Morphological (light microscopy, cytochemical (Von Kossa’s method, and functional analyses (calcium level, alkaline phosphatase activity, and total protein content in cell culture were carried out 7, 14, 21, and 28 days after the osteoinduction protocol. Results: The proliferative step showed colony-forming units in 7 days. After osteoinduction, cuboidal cellular morphology similar to osteoblasts at 14 days and mineralization nodules and biochemical changes (increased alkaline phosphatase level and calcium deposits at 21 days confirmed the osteodifferentiation process. Conclusion: Cell culture of human umbilical blood cord is a reliable technique, constituting itself as an alternative source of osteoprogenitor cells for experimental needs. More animal tests and clinical trials must be carried out to validate its use and to establish quality control of future autologous or allogeneic cell-based therapy aimed at bone repair.

  15. Effect of additives on the co-electrodeposition of Sn-Ag-Cu lead-free solder composition

    Energy Technology Data Exchange (ETDEWEB)

    Joseph, Shany, E-mail: shany@cmet.gov.i [Electronic Packaging Group, Centre for Materials for Electronic Technology (C-MET), Panchawati, off Pashan Road, Pune-411 008 (India); Phatak, Girish J. [Electronic Packaging Group, Centre for Materials for Electronic Technology (C-MET), Panchawati, off Pashan Road, Pune-411 008 (India)

    2010-04-15

    We have developed a methane sulfonic acid (MSA) based ternary electrodeposition bath for the deposition of near eutectic Sn-Ag-Cu films aimed at solder bumping applications in electronics. The bath contains thiourea as chelating agent and iso-octyl phenoxy ethanol (OPPE) as surfactant. We added gelatin to this bath and studied its effect on bath stability, microstructure of the deposited films and the film composition. It is found that the bath containing both the additives, viz. OPPE and gelatin, show improved stability up to 8-10 days. Striking improvement in the film microstructure, in terms of the compactness, uniformity and refinement of grains was found when the bath contained these additives. Detailed electrochemical studies with the help of cyclic voltametry and impedance analysis helped in understanding the role played by these additives during deposition. It is confirmed that there is a formation of loosely connected, highly non-uniform passivating film on the cathode surface, which is removed competitively by the depositing metal ions during the deposition. It is also clear that the additives play a role in the formation of such a passivating film.

  16. Research on a fast cooling process of the spacer grids for nuclear fuel assembly after soldering-aging

    International Nuclear Information System (INIS)

    Wang Baolin; Gu Jianhua

    1997-11-01

    A fast cooling process of the spacer grids for nuclear fuel assembly after soldering-aging due to a long cycle of vacuum cooling is presented. In the process, the grids can be fast cooled down by filling with 0.06, 0.08, 0.10 and 0.12 MPa of argon into the furnace respectively at temperatures of 550 degree C, 600 degree C and 650 degree C. As a result, the cooling time is reduced to 2.5∼3 h from 15∼16 h and the soldering-aging cycle is shortened to 20 h from 33 h. The grids completely meet with the requirements for soldering on surface color, welds quality, overall dimension, rupture stress and joint thickness

  17. Thermal processes and solidification kinetcs of evolution of the microstructure of tin-silver-copper solder alloys

    Science.gov (United States)

    Kinyanjui, Robert Kamau

    The adoption of Sn-Ag-Cu (SAC) Pb-free solders will affect electronic manufacturing processes and joint reliability for electronics packages. Since SAC solder has a higher melting temperature than eutectic Pb-Sn solder, higher processing temperatures will be required. The higher processing temperatures can potentially affect the microstructure of these Pb-free solder joints. We investigated the effect of thermal history on the evolution of the microstructure of Sn-xAg-yCu (0 ≤ x ≤ 4.0; 0 ≤ y ≤ 1.4, concentrations are in weight percent) solder alloys. This family of alloys falls within a class of Sn-rich Sn-Ag-Cu (SAC) alloys recommended by various international consortia for implementation in electronic manufacturing industry to replace the conventional PbSn solders. This investigation was divided into three parts: part one was an investigation of an optimum SAC alloy composition devoid of large (in length scales) intermetallic compounds (IMCs) after thermal treatment. The presence of large IMCs, with different mechanical characteristics from the bulk Sn, may compromise the mechanical integrity of the Pb-free solder interconnect. In part two of this study, we examined the growth morphology of Ag3Sn, Cu6Sn 5, and betaSn in the SAC alloys. In part three, an examination of the effect of sample size on undercooling was carried out. A Sn-Ag-Cu alloy of the composition: 96.5Sn-2.6Ag-0.9Cu (in weight percent) was found to exhibit no growth of large Ag3Sn, Cu6Sn 5 intermetallic compounds at cooling rates from 0.1 to 1°C/s. However, growth of large betaSn dendrites was observed. The crystallized Sn-Ag-Cu balls were found to contain only a few Sn grains. Also the solidification temperature of the 96.5Sn-2.6Ag-yCu (0 ≤ y ≤ 1.4) solder system was found to increase with Cu content. Further, this investigation established a strong correlation between Sn-Ag-Cu sample size and degree of undercooling for these Pb-free solder alloys. The degree of undercooling of Sn in

  18. Candidate selection for quadrant-based focal ablation through a combination of diffusion-weighted magnetic resonance imaging and prostate biopsy.

    Science.gov (United States)

    Matsuoka, Yoh; Numao, Noboru; Saito, Kazutaka; Tanaka, Hiroshi; Kumagai, Jiro; Yoshida, Soichiro; Ishioka, Junichiro; Koga, Fumitaka; Masuda, Hitoshi; Kawakami, Satoru; Fujii, Yasuhisa; Kihara, Kazunori

    2016-01-01

    To identify prostatic quadrants that could be preserved without intervention, using diffusion-weighted magnetic resonance imaging (DWI) and extended core biopsy, as a step toward implementation of quadrant-based focal ablation with potential preservation of erectile and ejaculatory functions, based on comparisons with unilateral hemi-gland ablation. We conducted a prebiopsy DWI study including 648 quadrants in 162 men who underwent 14-core biopsy including anterior sampling and radical prostatectomy (RP) for localised cancer. Imaging and pathology were analysed on a quadrant basis. Each quadrant was assessed through four-core sampling. Predictive performance of DWI and biopsy for quadrant status was analysed. On RP specimens, 170 anterior (52.5%) and 172 posterior quadrants (53.1%) harboured significant cancer. Negative predictive values of DWI, biopsy, and their combination for significant cancer were 79.7%, 70.6%, and 91.1%, respectively, in anterior quadrants, and 78.5%, 81.3%, and 91.7%, respectively, in posterior quadrants. DWI incrementally improved the negative predictive values of biopsy in anterior (P < 0.001) and posterior quadrants (P = 0.025), without untoward impacts on positive predictive values. Negative findings on both DWI and biopsy were identified in posterior quadrants of 109 sides (33.6%), but in entire hemi-glands of 54 sides (16.7%). The combination of DWI and 14-core biopsy including anterior sampling efficiently identifies quadrants without significant cancer in men with localised prostate cancer; the remaining quadrants, therefore, could be potential candidate areas for focal ablation. Focal therapy designed based on quadrant-based assessment could be superior to unilateral hemi-gland ablation for preservation of posterior quadrants and retaining of sexual function in more sides. © 2014 The Authors BJU International © 2014 BJU International Published by John Wiley & Sons Ltd.

  19. In situ investigation of SnAgCu solder alloy microstructure

    International Nuclear Information System (INIS)

    Pietrikova, Alena; Bednarcik, Jozef; Durisin, Juraj

    2011-01-01

    Research highlights: → In situ X-ray diffraction investigation enabled detailed analysis of the melting and solidification process of the SAC305 alloy. → It was found that the SAC305 solder melts at 230 deg. C. When cooling from 240 deg. C the SAC305 alloy solidifies at the temperature of 214 deg. C. During solidification β-Sn and Cu 6 Sn 5 is also formed. Formation of Ag 3 Sn occurs at 206 deg. C and the remaining amount of alloy crystallizes approximately at 160 deg. C. → Furthermore, observation of the thermal expansion behaviour of the β-Sn tetragonal unit cell revealed linear dependence of the unit cell volume on temperature. The unit cell parameters a and c also increase linearly with the temperature. Despite the fact that the c parameter is substantially smaller than parameter a, it exhibits a significantly higher linear thermal expansion coefficient. Comparison between data obtained during heating and cooling indicates that the thermal expansion coefficient is slightly greater in the case of cooling. - Abstract: In situ X-ray diffraction experiments, using synchrotron radiation, were employed to analyze microstructure evolution of the 96.5Sn3Ag0.5Cu (wt.%)-SAC305 lead-free solder alloy during heating (30-240 deg. C), isothermal dwell (240 deg. C) and cooling (240-30 deg. C). The special emphasis was placed on the study of the melting and solidification processes, explaining formation, distribution and the order of crystallization of the crystal phases (β-Sn, intermetallic compounds) in the solder alloy. Furthermore, thermal expansion behaviour of the main constituent phase β-Sn was analyzed prior to melting and after the consequent solidification.

  20. Interconnection of thermal parameters, microstructure and mechanical properties in directionally solidified Sn–Sb lead-free solder alloys

    Energy Technology Data Exchange (ETDEWEB)

    Dias, Marcelino; Costa, Thiago [Department of Manufacturing and Materials Engineering, University of Campinas — UNICAMP, 13083-860 Campinas, SP (Brazil); Rocha, Otávio [Federal Institute of Education, Science and Technology of Pará — IFPA, 66093-020 Belém, PA (Brazil); Spinelli, José E. [Department of Materials Engineering, Federal University of São Carlos — UFSCar, 13565-905 São Carlos, SP (Brazil); Cheung, Noé, E-mail: cheung@fem.unicamp.br [Department of Manufacturing and Materials Engineering, University of Campinas — UNICAMP, 13083-860 Campinas, SP (Brazil); Garcia, Amauri [Department of Manufacturing and Materials Engineering, University of Campinas — UNICAMP, 13083-860 Campinas, SP (Brazil)

    2015-08-15

    Considerable effort is being made to develop lead-free solders for assembling in environmental-conscious electronics, due to the inherent toxicity of Pb. The search for substitute alloys of Pb–Sn solders has increased in order to comply with different soldering purposes. The solder must not only meet the expected levels of electrical performance but may also have appropriate mechanical strength, with the absence of cracks in the solder joints. The Sn–Sb alloy system has a range of compositions that can be potentially included in the class of high temperature solders. This study aims to establish interrelations of solidification thermal parameters, microstructure and mechanical properties of Sn–Sb alloys (2 wt.%Sb and 5.5 wt.%Sb) samples, which were directionally solidified under cooling rates similar to those of reflow procedures in industrial practice. A complete high-cooling rate cellular growth is shown to be associated with the Sn–2.0 wt.%Sb alloy and a reverse dendrite-to-cell transition is observed for the Sn–5.5 wt.%Sb alloy. Strength and ductility of the Sn–2.0 wt.%Sb alloy are shown not to be affected by the cellular spacing. On the other hand, a considerable variation in these properties is associated with the cellular region of the Sn–5.5 wt.%Sb alloy casting. - Graphical abstract: Display Omitted - Highlights: • The microstructure of the Sn–2 wt.%Sb alloy is characterized by high-cooling rates cells. • Reverse dendrite > cell transition occurs for Sn–5.5 wt.%Sb alloy: cells prevail for cooling rates > 1.2 K/s. • Sn–5.5 wt.%Sb alloy: the dendritic region occurs for cooling rates < 0.9 K/s. • Sn–5.5 wt.%Sb alloy: tensile properties are improved with decreasing cellular spacing.

  1. The thermodynamic database COST MP0602 for materials for high-temperature lead-free soldering

    Directory of Open Access Journals (Sweden)

    Kroupa A.

    2012-01-01

    Full Text Available The current state of thermodynamic modelling in the field of high-temperature lead-free soldering is presented. A consistent thermodynamic database, containing 18 elements (Ag, Al, Au, Bi, Co, Cu, Ga, Ge, Mg, Ni, P, Pb, Pd, Sb, Sn, Ti and Zn has been created. The thermodynamic data for the most of the important binary and selected ternary systems were checked and included into the database. The database was tested using major commercial software packages. Such reliable and sophisticated software coupled to reliable thermodynamic databases are necessary prerequisites for application of thermodynamics in advanced alloys design.

  2. Microstructurally Adaptive Constitutive Relations and Reliability Assessment Protocols for Lead Free Solder

    Science.gov (United States)

    2015-05-05

    lead or the PCB pad. The latter had a very limited effect on the overall life and indeed variations in life with accelerated thermal cycling parameters...amplitude vs. aging time at 125oC for 30 mil SAC305 and SAC105 solder joints. Figure 3.4: Average rate of damage (inverse life ) vs. work per cycle for...characteristic number of cycles to failure for this assembly) Figure 3.15: The number of cycles , expressed as fraction of total life , after which cross

  3. Nanoscale Soldering of Positioned Carbon Nanotubes using Highly Conductive Electron Beam Induced Gold Deposition

    DEFF Research Database (Denmark)

    Madsen, Dorte Nørgaard; Mølhave, Kristian; Mateiu, Ramona Valentina

    2003-01-01

    We have developed an in-situ method for controlled positioning of carbon nanotubes followed by highly conductive contacting of the nanotubes, using electron beam assisted deposition of gold. The positioning and soldering process takes place inside an Environmental Scanning Electron Microscope (E......-SEM) in the presence of a source of gold-organic precursor gas. Bridges deposited between suspended microelectrodes show resistivities down to 10-4 Ωcm and Transmission Electron Microscopy (TEM) of the deposits reveals a dense core of gold particles surrounded by a crust of small gold nanoparticles embedded...

  4. Contact of ZnSb thermoelectric material to metallic electrodes using S-Bond 400 solder alloy

    DEFF Research Database (Denmark)

    Malik, Safdar Abbas; Le, Thanh Hung; Van Nong, Ngo

    2018-01-01

    and metallic electrodes. In this paper, we investigate the joining of ZnSb to Ni and Ag electrodes using a commercial solder alloy S-Bond 400 and hot-pressing technique. Ti and Cr layers are also introduced as a diffusion barrier and microstructure at the interfaces is observed by scanning electron microscopy....... We found that S-bond 400 solder reacts with Ag and Ni electrodes to form different alloys at the interfaces. Cr layer was found to be broken after joining, resulting in a thicker reaction/diffusion layer at the interface, while Ti layer was preserved....

  5. Effect of Thermal Aging on Impact Absorbed Energies of Solder Joints Under High-Strain-Rate Conditions

    Science.gov (United States)

    Zhang, Ning; Shi, Yaowu; Lei, Yongping; Xia, Zhidong; Guo, Fu; Li, Xiaoyan

    2009-10-01

    This study was concerned with the effect of thermal aging on the impact properties of solder joints. Three kinds of solders, conventional Sn-37Pb solder, Sn-3.8Ag-0.7Cu solder, and Sn-3.8Ag-0.7Cu doped with rare-earth (RE) elements, were selected to manufacture joint specimens for the Charpy impact test. U-notch specimens were adopted and isothermally aged at 150°C for 100 h and 1000 h, and then impacted by using a pendulum-type impact tester at room temperature. The Sn-37Pb solder joints exhibited higher performance in terms of impact absorbed energy in the as-soldered and 100 h thermally aged conditions. Interestingly, the Sn-3.8Ag-0.7Cu solder joints exhibited improved performance for the impact value after 1000 h of thermal aging. For the Sn-37Pb and Sn-3.8Ag-0.7Cu solder joints, the impact absorbed energies initially increased when the storage duration was limited to 100 h, and then gradually decreased with its further increase. For the Sn-3.8Ag-0.7Cu-RE specimens, impact performance decreased directly with increasing thermal aging. Furthermore, scanning electron microscopy (SEM) observation showed that the fracture paths were focused on the interface zone for the three kinds of joints in the aged conditions. For the Sn-37Pb joints, the fracture surfaces mainly presented a ductile fracture mode. For the Sn-3.8Ag-0.7Cu joints, with microstructure coarsening, crack propagation partly shifted towards the Sn/Cu6Sn5 interface. Compared with the 100 h aged joints, the area fraction of intergranular fracture of Sn grains on the Sn-3.8Ag-0.7Cu fracture surfaces was increased when the aging time was 1000 h. On the contrary, the fracture morphologies of Sn-3.8Ag-0.7Cu-RE were mainly brittle as thermal aging increased. Thus, an interrelationship between impact energy value and fracture morphology was observed.

  6. Investigation on Thermocompression Bonding Using Lead Free Sinterable Paste and High Lead Solder Paste for Power QFN Application

    Directory of Open Access Journals (Sweden)

    Chandrakasan Gunaseelan

    2016-01-01

    Full Text Available Persistently growing Power QFN packages are used in various fields especially micro-electronics, aerospace, oil and gas as well. However, the particular industries is pushing forward to reduce the use of hazardous materials in the process of manufacturing and assemblies. Thermo-compression die-attach layer is perceived to be the most critical element in power QFN packages as the increase in operating temperature requires new materials with suitable thermo-chemical properties also with suitable melting points of next generation lead free die attachment material. In this situation, Hi-lead solder (RM218: Pb92.5Sn5Ag2.5 which known as high temperature material is widely being used in most semiconductor assembly for die attach, yet it deduce few reliability challenges like solder voids, the clip tilt performance and also solder splash which has been considered as major quality issue in assembly of Power QFN packages (FET die, IC die and clip attach. As a solution, sintering epoxy paste (SPC073-3: Sn96.5/Ag3/Cu0.5 is being considered as a replacement. In this case, sintering epoxy paste demonstrating excellent electrical and thermal performance for Power QFN packages which is known to be demanded in market. Thus, this study investigates the differential pastes sintering paste and also solder paste, in order to identify best die attachment material to be used in thermo-compression bonding method. Therefore, the shear strength was resulting good indication where the sintering paste was recorded 2.4 Kg/mm meanwhile the solder paste was recorded 0Kg/mm at peak temperature of 260°C. Besides of that, the pot life seems promising as the sintering paste seems to have constant viscosity of 100Pa*s throughout the 48 hours tested while, high lead solder paste records viscosity from 100Pa*s marginally increase as the time increase which effects the inconsistency of pot life. Last but not least, the voids mechanisms proves sintering epoxy paste has the same

  7. A generalized matching law analysis of cocaine vs. food choice in rhesus monkeys: effects of candidate 'agonist-based' medications on sensitivity to reinforcement.

    Science.gov (United States)

    Hutsell, Blake A; Negus, S Stevens; Banks, Matthew L

    2015-01-01

    We have previously demonstrated reductions in cocaine choice produced by either continuous 14-day phendimetrazine and d-amphetamine treatment or removing cocaine availability under a cocaine vs. food choice procedure in rhesus monkeys. The aim of the present investigation was to apply the concatenated generalized matching law (GML) to cocaine vs. food choice dose-effect functions incorporating sensitivity to both the relative magnitude and price of each reinforcer. Our goal was to determine potential behavioral mechanisms underlying pharmacological treatment efficacy to decrease cocaine choice. A multi-model comparison approach was used to characterize dose- and time-course effects of both pharmacological and environmental manipulations on sensitivity to reinforcement. GML models provided an excellent fit of the cocaine choice dose-effect functions in individual monkeys. Reductions in cocaine choice by both pharmacological and environmental manipulations were principally produced by systematic decreases in sensitivity to reinforcer price and non-systematic changes in sensitivity to reinforcer magnitude. The modeling approach used provides a theoretical link between the experimental analysis of choice and pharmacological treatments being evaluated as candidate 'agonist-based' medications for cocaine addiction. The analysis suggests that monoamine releaser treatment efficacy to decrease cocaine choice was mediated by selectively increasing the relative price of cocaine. Overall, the net behavioral effect of these pharmacological treatments was to increase substitutability of food pellets, a nondrug reinforcer, for cocaine. Copyright © 2014 Elsevier Ireland Ltd. All rights reserved.

  8. Trans-sialidase-based vaccine candidate protects against Trypanosoma cruzi infection, not only inducing an effector immune response but also affecting cells with regulatory/suppressor phenotype

    Science.gov (United States)

    Prochetto, Estefanía; Roldán, Carolina; Bontempi, Iván A.; Bertona, Daiana; Peverengo, Luz; Vicco, Miguel H.; Rodeles, Luz M.; Pérez, Ana R.; Marcipar, Iván S.; Cabrera, Gabriel

    2017-01-01

    Prophylactic and/or therapeutic vaccines have an important potential to control Trypanosoma cruzi (T. cruzi)infection. The involvement of regulatory/suppressor immune cells after an immunization treatment and T. cruzi infection has never been addressed. Here we show that a new trans-sialidase-based immunogen (TSf) was able to confer protection, correlating not only with beneficial changes in effector immune parameters, but also influencing populations of cells related to immune control. Regarding the effector response, mice immunized with TSf showed a TS-specific antibody response, significant delayed-type hypersensitivity (DTH) reactivity and increased production of IFN-γ by CD8+ splenocytes. After a challenge with T. cruzi, TSf-immunized mice showed 90% survival and low parasitemia as compared with 40% survival and high parasitemia in PBS-immunized mice. In relation to the regulatory/suppressor arm of the immune system, after T. cruzi infection TSf-immunized mice showed an increase in spleen CD4+ Foxp3+ regulatory T cells (Treg) as compared to PBS-inoculated and infected mice. Moreover, although T. cruzi infection elicited a notable increase in myeloid derived suppressor cells (MDSC) in the spleen of PBS-inoculated mice, TSf-immunized mice showed a significantly lower increase of MDSC. Results presented herein highlight the need of studying the immune response as a whole when a vaccine candidate is rationally tested. PMID:28938533

  9. Improving the quality of biomarker candidates in untargeted metabolomics via peak table-based alignment of comprehensive two-dimensional gas chromatography-mass spectrometry data.

    Science.gov (United States)

    Bean, Heather D; Hill, Jane E; Dimandja, Jean-Marie D

    2015-05-15

    The potential of high-resolution analytical technologies like GC×GC/TOF MS in untargeted metabolomics and biomarker discovery has been limited by the development of fully automated software that can efficiently align and extract information from multiple chromatographic data sets. In this work we report the first investigation on a peak-by-peak basis of the chromatographic factors that impact GC×GC data alignment. A representative set of 16 compounds of different chromatographic characteristics were followed through the alignment of 63 GC×GC chromatograms. We found that varying the mass spectral match parameter had a significant influence on the alignment for poorly-resolved peaks, especially those at the extremes of the detector linear range, and no influence on well-chromatographed peaks. Therefore, optimized chromatography is required for proper GC×GC data alignment. Based on these observations, a workflow is presented for the conservative selection of biomarker candidates from untargeted metabolomics analyses. Copyright © 2015 Elsevier B.V. All rights reserved.

  10. Protection against Multiple Influenza A Virus Strains Induced by Candidate Recombinant Vaccine Based on Heterologous M2e Peptides Linked to Flagellin

    Science.gov (United States)

    Kovaleva, Anna A.; Potapchuk, Marina V.; Korotkov, Alexandr V.; Sergeeva, Mariia V.; Kasianenko, Marina A.; Kuprianov, Victor V.; Ravin, Nikolai V.; Tsybalova, Liudmila M.; Skryabin, Konstantin G.; Kiselev, Oleg I.

    2015-01-01

    Matrix 2 protein ectodomain (M2e) is considered a promising candidate for a broadly protective influenza vaccine. M2e-based vaccines against human influenza A provide only partial protection against avian influenza viruses because of differences in the M2e sequences. In this work, we evaluated the possibility of obtaining equal protection and immune response by using recombinant protein on the basis of flagellin as a carrier of the M2e peptides of human and avian influenza A viruses. Recombinant protein was generated by the fusion of two tandem copies of consensus M2e sequence from human influenza A and two copies of M2e from avian A/H5N1 viruses to flagellin (Flg-2M2eh2M2ek). Intranasal immunisation of Balb/c mice with recombinant protein significantly elicited anti-M2e IgG in serum, IgG and sIgA in BAL. Antibodies induced by the fusion protein Flg-2M2eh2M2ek bound efficiently to synthetic peptides corresponding to the human consensus M2e sequence as well as to the M2e sequence of A/Chicken/Kurgan/05/05 RG (H5N1) and recognised native M2e epitopes exposed on the surface of the MDCK cells infected with A/PR/8/34 (H1N1) and A/Chicken/Kurgan/05/05 RG (H5N1) to an equal degree. Immunisation led to both anti-M2e IgG1 and IgG2a response with IgG1 prevalence. We observed a significant intracellular production of IL-4, but not IFN-γ, by CD4+ T-cells in spleen of mice following immunisation with Flg-2M2eh2M2ek. Immunisation with the Flg-2M2eh2M2ek fusion protein provided similar protection from lethal challenge with human influenza A viruses (H1N1, H3N2) and avian influenza virus (H5N1). Immunised mice experienced significantly less weight loss and decreased lung viral titres compared to control mice. The data obtained show the potential for the development of an M2e-flagellin candidate influenza vaccine with broad spectrum protection against influenza A viruses of various origins. PMID:25799221

  11. Protection against multiple influenza A virus strains induced by candidate recombinant vaccine based on heterologous M2e peptides linked to flagellin.

    Directory of Open Access Journals (Sweden)

    Liudmila A Stepanova

    Full Text Available Matrix 2 protein ectodomain (M2e is considered a promising candidate for a broadly protective influenza vaccine. M2e-based vaccines against human influenza A provide only partial protection against avian influenza viruses because of differences in the M2e sequences. In this work, we evaluated the possibility of obtaining equal protection and immune response by using recombinant protein on the basis of flagellin as a carrier of the M2e peptides of human and avian influenza A viruses. Recombinant protein was generated by the fusion of two tandem copies of consensus M2e sequence from human influenza A and two copies of M2e from avian A/H5N1 viruses to flagellin (Flg-2M2eh2M2ek. Intranasal immunisation of Balb/c mice with recombinant protein significantly elicited anti-M2e IgG in serum, IgG and sIgA in BAL. Antibodies induced by the fusion protein Flg-2M2eh2M2ek bound efficiently to synthetic peptides corresponding to the human consensus M2e sequence as well as to the M2e sequence of A/Chicken/Kurgan/05/05 RG (H5N1 and recognised native M2e epitopes exposed on the surface of the MDCK cells infected with A/PR/8/34 (H1N1 and A/Chicken/Kurgan/05/05 RG (H5N1 to an equal degree. Immunisation led to both anti-M2e IgG1 and IgG2a response with IgG1 prevalence. We observed a significant intracellular production of IL-4, but not IFN-γ, by CD4+ T-cells in spleen of mice following immunisation with Flg-2M2eh2M2ek. Immunisation with the Flg-2M2eh2M2ek fusion protein provided similar protection from lethal challenge with human influenza A viruses (H1N1, H3N2 and avian influenza virus (H5N1. Immunised mice experienced significantly less weight loss and decreased lung viral titres compared to control mice. The data obtained show the potential for the development of an M2e-flagellin candidate influenza vaccine with broad spectrum protection against influenza A viruses of various origins.

  12. Anisotropic viscoelastic shell modeling technique of copper patterns/photoimageable solder resist composite for warpage simulation of multi-layer printed circuit boards

    International Nuclear Information System (INIS)

    Kim, Do-Hyoung; Joo, Sung-Jun; Kim, Hak-Sung; Kwak, Dong-Ok

    2015-01-01

    In this study, the warpage simulation of a multi-layer printed circuit board (PCB) was performed as a function of various copper (Cu) patterns/photoimageable solder resist (PSR) composite patterns and their anisotropic viscoelastic properties. The thermo-mechanical properties of Cu/PSR patterns were obtained from finite element analysis (virtual test) and homogenized with anisotropic composite shell models that considered the viscoelastic properties. The multi-layer PCB model was simplified based on the unit Cu/PSR patterns and the warpage simulation during the reflow process was performed by using ABAQUS combined with a user-defined subroutine. From these results, it was demonstrated that the proposed anisotropic viscoelastic composite shell simulation technique can be successfully used to predict warpage of multi-layer PCBs during the reflow process. (paper)

  13. Neoadjuvant Chemotherapy for Patients with Muscle-invasive Urothelial Bladder Cancer Candidates for Curative Surgery: A Prospective Clinical Trial Based on Cisplatin Feasibility.

    Science.gov (United States)

    Schinzari, Giovanni; Monterisi, Santa; Pierconti, Francesco; Nazzicone, Giulia; Marandino, Laura; Orlandi, Armando; Racioppi, Marco; Cassano, Alessandra; Bassi, Pierfrancesco; Barone, Carlo; Rossi, Ernesto

    2017-11-01

    Neoadjuvant chemotherapy demonstrated a survival benefit versus cystectomy alone in muscle-invasive urothelial bladder cancer. Despite this advantage, preoperative chemotherapy is not widely employed. When patients are unfit for cisplatin-based regimen, they are often candidates for immediate surgery. In our study, patients with muscle-invasive bladder cancer were treated with neoadjuvant chemotherapy. The principal objective was the rate of complete pathological response (pCR). Secondary end-points were disease-free survival (DFS), overall survival (OS) and toxicity. Patients (n=72) with Eastern Cooperative Oncology Group (ECOG) performance status 0-1, clinical stage cT3-4, and/or N+ muscle-invasive bladder cancer were enrolled. The chemotherapy regimen was established according to the cisplatin feasibility. Thirty patients were treated with cisplatin/gemcitabine (Gem) and 42 with carboplatin/Gem. The rate of pCR was 29.2%, 36% with cisplatin-based treatment and 23.8% with carboplatin (p=0.3574). DFS and OS were longer in pCR patients, while no difference was reported between cisplatin/Gem and Carboplatin/Gem groups. Our results confirm the prognostic value of pCR in neoadjuvant chemotherapy for muscle-invasive bladder cancer. When the patients are not fit for cisplatin, a carboplatin/Gem regimen represents a valid option because of comparable long-term outcome. When cisplatin is not feasible, the exclusion of a preoperative treatment is not justified. Copyright© 2017, International Institute of Anticancer Research (Dr. George J. Delinasios), All rights reserved.

  14. Pharmacokinetics and Tolerance of the Phage Endolysin-Based Candidate Drug SAL200 after a Single Intravenous Administration among Healthy Volunteers.

    Science.gov (United States)

    Jun, Soo Youn; Jang, In Jin; Yoon, Seonghae; Jang, Kyungho; Yu, Kyung-Sang; Cho, Joo Youn; Seong, Moon-Woo; Jung, Gi Mo; Yoon, Seong Jun; Kang, Sang Hyeon

    2017-06-01

    This study was a phase 1, single-center, randomized, double-blind, placebo-controlled, single-dosing, and dose-escalating study of intravenous SAL200. It is a new candidate drug for the treatment of antibiotic-resistant staphylococcal infections based on a recombinant form of the phage endolysin SAL-1. The study evaluated the pharmacokinetics, pharmacodynamics, and tolerance among healthy male volunteers after the intravenous infusion of single ascending doses of SAL200 (0.1, 0.3, 1, 3, and 10 mg/kg of body weight). SAL200 was well tolerated, and no serious adverse events (AEs) were observed in this clinical study. Most AEs were mild, self-limiting, and transient. The AEs reported in more than three participants were fatigue, rigors, headache, and myalgia. No clinically significant values with respect to the findings of clinical chemistry, hematology, and coagulation analyses, urinalysis, vital signs, and physical examinations were observed, and no notable trends in our electrocardiogram (ECG) results for any tested dose were noticed. A greater-than-dose-proportional increase with regard to systemic exposure and the maximum serum concentration was observed when the SAL200 dose was increased from 0.1 mg/kg to 10 mg/kg. This investigation constitutes the first-in-human phase 1 study of an intravenously administered, phage endolysin-based drug. (This study has been registered at ClinicalTrials.gov under identifier NCT01855048 and at the Clinical Research Information Service [https://cris.nih.go.kr/cris/] under identifier KCT0000968.). Copyright © 2017 Jun et al.

  15. Genetic dissection of drought and heat tolerance in chickpea through genome-wide and candidate gene-based association mapping approaches.

    Directory of Open Access Journals (Sweden)

    Mahendar Thudi

    Full Text Available To understand the genetic basis of tolerance to drought and heat stresses in chickpea, a comprehensive association mapping approach has been undertaken. Phenotypic data were generated on the reference set (300 accessions, including 211 mini-core collection accessions for drought tolerance related root traits, heat tolerance, yield and yield component traits from 1-7 seasons and 1-3 locations in India (Patancheru, Kanpur, Bangalore and three locations in Africa (Nairobi, Egerton in Kenya and Debre Zeit in Ethiopia. Diversity Array Technology (DArT markers equally distributed across chickpea genome were used to determine population structure and three sub-populations were identified using admixture model in STRUCTURE. The pairwise linkage disequilibrium (LD estimated using the squared-allele frequency correlations (r2; when r2<0.20 was found to decay rapidly with the genetic distance of 5 cM. For establishing marker-trait associations (MTAs, both genome-wide and candidate gene-sequencing based association mapping approaches were conducted using 1,872 markers (1,072 DArTs, 651 single nucleotide polymorphisms [SNPs], 113 gene-based SNPs and 36 simple sequence repeats [SSRs] and phenotyping data mentioned above employing mixed linear model (MLM analysis with optimum compression with P3D method and kinship matrix. As a result, 312 significant MTAs were identified and a maximum number of MTAs (70 was identified for 100-seed weight. A total of 18 SNPs from 5 genes (ERECTA, 11 SNPs; ASR, 4 SNPs; DREB, 1 SNP; CAP2 promoter, 1 SNP and AMDH, 1SNP were significantly associated with different traits. This study provides significant MTAs for drought and heat tolerance in chickpea that can be used, after validation, in molecular breeding for developing superior varieties with enhanced drought and heat tolerance.

  16. Black hole candidates

    Indian Academy of Sciences (India)

    First page Back Continue Last page Overview Graphics. Black hole candidates. In the case of X-ray sources such as Cyg X-1, the mass of the compact object inferred from combined optical and X-ray data, suggest M_compact object > 3.4 M_sun => Black Hole! A remarkable discovery!! Thus X-ray emitting binary systems ...

  17. Primary and Presidential Candidates

    DEFF Research Database (Denmark)

    Goddard, Joseph

    2012-01-01

    This article looks at primary and presidential candidates in 2008 and 2012. Evidence suggests that voters are less influenced by candidates’ color, gender, or religious observation than previously. Conversely, markers of difference remain salient in the imaginations of pollsters and journalists......, and appear in opinion polls and newspaper columns....

  18. Cell interconnection without glueing or soldering for crystalline Si photovoltaic modules

    Directory of Open Access Journals (Sweden)

    Summhammer Johann

    2016-01-01

    Full Text Available In order to maximize the power output of polycrystalline silicon PV-modules, in previous work we have already tested rectangular cells of 39 × 156 mm which are overlapped along the long sides. The low current density at the cell overlap allows interconnections which need neither soldering nor glueing, but use metallic strips inserted between the cells in the overlap region. The contact is established by the pressure applied to the module during lamination and is retained by the slightly bent cells in the solidified encapsulant. Here we report on the long term stability of different contact materials and contact cross sections applied in eight modules of the 240 W class monitored for up to 24 months of outdoor operation and in a variety of small 5-cell modules exposed to rapid ageing tests with up to 1000 thermal cycles. Cells with three different electrode designs were tested and the contact materials were Cu, Ag, SnPbAg and Sn. Focussing especially on series resistance, fill factor and peak power, it is found that Ag-coated contact strips perform equally well and have practically the same stability as soldered cell interconnections. Due to 70–90% savings in copper and simpler manufacturing the cost of PV-modules may thus be reduced further.

  19. Interactions of Cu-substrates with titanium-alloyed Sn-Zn solders

    Directory of Open Access Journals (Sweden)

    Soares D.

    2006-01-01

    Full Text Available The interactions of copper substrate with titanium-alloyed Sn-Zn eutectic solders have been studied. Two series of experiments have been performed. The first one consisted in differential thermal analyses of Sn-Zn nearly eutectic alloys containing from 1.3 to 2.2 wt. % Ti. Diffusion couples consisted of Cu-wires and Sn-Zn-Ti liquid solders, produced at 250 and 275 OC have been prepared in the second series,. The contact times were up to 3600 s. The contact zones have been characterized by optical and scanning electron microscope. Two layers have been found along the interfaces solid/liquid. The first and the second layers are identical, respectively, with γ and ε phases of the Cu-Zn system. No changes of the chemical compositions were detected for the tested temperatures and reaction times. Continuous parabolic growth of the total diffusion zone thickness with the time of diffusion is observed. The growth is due mainly to one the formed layers (γ while the thickness of the ε-phase layer, stays almost constant for all tested diffusion times and temperatures.

  20. Soldered Power Arm: An Easy and Effective Method for Intrusion and Retraction of Anterior Teeth

    Directory of Open Access Journals (Sweden)

    Ketan K Vakil

    2014-01-01

    Full Text Available The orthodontic correction of deep overbite can be achieved with several mechanisms that will result in true intrusion of anterior teeth, extrusion of posterior teeth, or a combination of both. For the orthodontic correction of bimaxillary dentoalveolar protrusion with deep bite, there are several treatment modalities like segmented arch approach, retraction and intrusion utility arches, temporary anchorage devices. Though not a novel therapeutic concept, the use of miniscrew implants to obtain absolute anchorage has recently become very popular in clinical orthodontic approaches. To allow the use of sliding mechanics for bodily retraction with intrusion of anterior teeth, we devised a soldered power arm (SPA on standard molar tube. It is simple, stable, precise and effective in cases where anterior teeth need to be simultaneously retracted and intruded. A power arm can be readily fabricated from 20 gauge stainless steel wire and soldered on the molar buccal tube so as to avoid any distortion or loosening of power arm from molar tube during the course of the treatment. The SPA works efficiently with the molar being stabilized in all three planes of space. The resultant force vector is directed more apically toward the center of resistance of the anchor unit, which resulted in the treatment outcome of retraction and intrusion of the anterior teeth and correction of the deep bite.

  1. Contact angle of 63Sn-37Pb and Pb-free solder on Cu plating

    International Nuclear Information System (INIS)

    Lin, C.-T.; Lin, K.-L.

    2003-01-01

    This study investigated the wetting behavior of 63Sn-37Pb and Pb-free solder on different surface roughness Cu plating. The Cu plating roughness was controlled by current density and deposition time. The contact angles were measured to investigate the wetting behavior. The contact angles of DI (de-ionized) water obey Wenzel's equation and decrease with the increase of surface roughness. Daubing the flux on solder balls as well as on the Cu plating lowers the magnitude of contact angle by 2-23 deg. and the deviation of measured values by 4-6 deg. . The contact angles decrease with the increase of Cu substrate surface roughness in the temperature range of 250-280 deg. C. The cleaning effect of flux was analyzed by Auger electron spectroscopy. The oxide on the Cu substrate surface was well removed by flux. The carbon residue left behind on the substrate surface after reflow raises both the magnitude and the scattering of contact angle

  2. Assessment of the effects of the Japanese shift to lead-free solders and its impact on material substitution and environmental emissions by a dynamic material flow analysis

    International Nuclear Information System (INIS)

    Fuse, Masaaki; Tsunemi, Kiyotaka

    2012-01-01

    Lead-free electronics has been extensively studied, whereas their adoption by society and their impact on material substitution and environmental emissions are not well understood. Through a material flow analysis (MFA), this paper explores the life cycle flows for solder-containing metals in Japan, which leads the world in the shift to lead-free solders in electronics. The results indicate that the shift has been progressing rapidly for a decade, and that substitutes for lead in solders, which include silver and copper, are still in the early life cycle stages. The results also show, however, that such substitution slows down during the late life cycle stages owing to long electronic product lifespans. This deceleration of material substitution in the solder life cycle may not only preclude a reduction in lead emissions to air but also accelerate an increase in silver emissions to air and water. As an effective measure against ongoing lead emissions, our scenario analysis suggests an aggressive recycling program for printed circuit boards that utilizes an existing recycling scheme. -- Highlights: ► We model the life cycle flows for solder-containing metals in Japan. ► The Japanese shift to lead-free solders progresses rapidly for a decade. ► Substitution for lead in solders slows down during the late life cycle stages. ► The deceleration of substitution precludes a reduction in lead emissions to air.

  3. FINITE ELEMENT ANALYSIS ON THE EFFECT OF SOLDER JOINT GEOMETRY FOR THE RELIABILITY OF BALL GRID ARRAY ASSEMBLY WITH FLEXIBLE AND RIGID PCBS

    Directory of Open Access Journals (Sweden)

    CHUN-SEAN LAU

    2014-02-01

    Full Text Available In the present study, three-dimensional (3D finite element simulation on 132 PIN fleXBGATM package was performed to predict the effect of solder joint geometry on the reliability of Ball Grid Array (BGA solder joints on flexible and rigid PCBs subjected to thermo-cyclic loading. The commercial FEA tool ABAQUS Version 6.9 was used for the simulations of various shapes of solder joints such as barrel, column and hourglass. Apart from a global modeling, the submodeling analysis technique (local modeling was also used on the critically affected solder joints, in order to enhance the computation efficiency. The accumulated creep strain and strain energy density were observed for each case, and optimum geometries were obtained. The model was validated with the published experimental data with the minimum percentage error of 3%. It was observed that the hourglass solder joint geometry was very crucial on the reliability of BGA solder joints, and for a given PCB, the optimal choice of hourglass solder joint geometry depended on its rigidity.

  4. Intergranular stress corrosion in soldered joints of stainless steel 304

    International Nuclear Information System (INIS)

    Zamora R, L.

    1994-01-01

    The intergranular stress cracking of welded joints of austenitic stainless steel, AISI 304, is a serious problem in BWR type reactors. It is associated with the simultaneous presence of three factors; stress, a critical media and sensibilization (DOS). EPR technique was used in order to verify the sensibilization degree in the base metal, and the zone affected by heat and welding material. The characterization of material was done. The objective of this work is the study of microstructure and the evaluation of EPR technique used for the determination of DOS in a welded plate of austenitic stainless steel AISI 304. (Author)

  5. Evaluation and Selection of Bacillus Species Based on Enzyme Production, Antimicrobial Activity, and Biofilm Synthesis as Direct-Fed Microbial Candidates for Poultry

    Science.gov (United States)

    Latorre, Juan D.; Hernandez-Velasco, Xochitl; Wolfenden, Ross E.; Vicente, Jose L.; Wolfenden, Amanda D.; Menconi, Anita; Bielke, Lisa R.; Hargis, Billy M.; Tellez, Guillermo

    2016-01-01

    Social concern about misuse of antibiotics as growth promoters (AGP) and generation of multidrug-resistant bacteria have restricted the dietary inclusion of antibiotics in livestock feed in several countries. Direct-fed microbials (DFM) are one of the multiple alternatives commonly evaluated as substitutes of AGP. Sporeformer bacteria from the genus Bacillus have been extensively investigated because of their extraordinary properties to form highly resistant endospores, produce antimicrobial compounds, and synthesize different exogenous enzymes. The purpose of the present study was to evaluate and select Bacillus spp. from environmental and poultry sources as DFM candidates, considering their enzyme production profile, biofilm synthesis capacity, and pathogen-inhibition activity. Thirty-one Bacillus isolates were screened for in vitro relative enzyme activity of amylase, protease, lipase, and phytase using a selective media for each enzyme, with 3/31 strains selected as superior enzyme producers. These three isolates were identified as Bacillus subtilis (1/3), and Bacillus amyloliquefaciens (2/3), based on biochemical tests and 16S rRNA sequence analysis. For evaluation of biofilm synthesis, the generation of an adherent crystal violet-stained ring was determined in polypropylene tubes, resulting in 11/31 strains showing a strong biofilm formation. Moreover, all Bacillus strains were evaluated for growth inhibition activity against Salmonella enterica serovar Enteritidis (26/31), Escherichia coli (28/31), and Clostridioides difficile (29/31). Additionally, in previous in vitro and in vivo studies, these selected Bacillus strains have shown to be resistant to different biochemical conditions of the gastrointestinal tract of poultry. Results of the present study suggest that the selection and consumption of Bacillus-DFM, producing a variable set of enzymes and antimicrobial compounds, may contribute to enhanced performance through improving nutrient digestibility

  6. A virus-like particle vaccine candidate for influenza A virus based on multiple conserved antigens presented on hepatitis B tandem core particles.

    Science.gov (United States)

    Ramirez, Alejandro; Morris, Stephen; Maucourant, Sophie; D'Ascanio, Isabella; Crescente, Vincenzo; Lu, I-Na; Farinelle, Sophie; Muller, Claude P; Whelan, Michael; Rosenberg, William

    2018-02-01

    Existing Influenza A virus (IAV) vaccines target variable parts of the virus that may change between seasons. Vaccine design relies on predicting the predominant circulating influenza strains but when there is a mismatch between vaccine and circulating strains, efficacy is sub-optimal. Furthermore, current approaches provide limited protection against emerging influenza strains that may cause pandemics. One solution is to design vaccines that target conserved protein domains of influenza, which remain largely unchanged over time and are likely to be found in emergent variants. We present a virus-like particle (VLP), built using the hepatitis B virus tandem core platform, as an IAV vaccine candidate containing multiple conserved antigens. Hepatitis B core protein spontaneously assembles into a VLP that is immunogenic and confers immunogenicity to proteins incorporated into the major insertion region (MIR) of core monomers. However, insertion of antigen sequences may disrupt particle assembly preventing VLP formation or result in unstable particles. We have overcome these problems by genetically manipulating the hepatitis B core to express core monomers in tandem, ligated with a flexible linker, incorporating different antigens at each of the MIRs. Immunisation with this VLP, named Tandiflu1, containing 4 conserved antigens from matrix protein 2 ectodomain and hemagglutinin stalk, leads to production of cross-reactive and protective antibodies. The polyclonal antibodies induced by Tandiflu1 can bind IAV Group 1 hemagglutinin types H1, H5, H11, H9, H16 and a conserved epitope on matrix protein 2 expressed by most strains of IAV. Vaccination with Tandiflu1 results in 100% protection from a lethal influenza challenge with H1N1 IAV. Serum transfer from vaccinated animals is sufficient to confer protection from influenza-associated illness in naïve mice. These data suggest that a Tandem Core based IAV vaccine might provide broad protection against common and emergent H1

  7. Identification of candidate agents active against N. ceranae infection in honey bees: establishment of a medium throughput screening assay based on N. ceranae infected cultured cells.

    Directory of Open Access Journals (Sweden)

    Sebastian Gisder

    Full Text Available Many flowering plants in both natural ecosytems and agriculture are dependent on insect pollination for fruit set and seed production. Managed honey bees (Apis mellifera and wild bees are key pollinators providing this indispensable eco- and agrosystem service. Like all other organisms, bees are attacked by numerous pathogens and parasites. Nosema apis is a honey bee pathogenic microsporidium which is widely distributed in honey bee populations without causing much harm. Its congener Nosema ceranae was originally described as pathogen of the Eastern honey bee (Apis cerana but jumped host from A. cerana to A. mellifera about 20 years ago and spilled over from A. mellifera to Bombus spp. quite recently. N. ceranae is now considered a deadly emerging parasite of both Western honey bees and bumblebees. Hence, novel and sustainable treatment strategies against N. ceranae are urgently needed to protect honey and wild bees. We here present the development of an in vitro medium throughput screening assay for the identification of candidate agents active against N. ceranae infections. This novel assay is based on our recently developed cell culture model for N. ceranae and coupled with an RT-PCR-ELISA protocol for quantification of N. ceranae in infected cells. The assay has been adapted to the 96-well microplate format to allow automated analysis. Several substances with known (fumagillin or presumed (surfactin or no (paromomycin activity against N. ceranae were tested as well as substances for which no data concerning N. ceranae inhibition existed. While fumagillin and two nitroimidazoles (metronidazole, tinidazole totally inhibited N. ceranae proliferation, all other test substances were inactive. In summary, the assay proved suitable for substance screening and demonstrated the activity of two synthetic antibiotics against N. ceranae.

  8. Evaluation and selection of Bacillus species based on enzyme production, antimicrobial activity and biofilm synthesis as direct-fed microbials candidates for poultry

    Directory of Open Access Journals (Sweden)

    Juan D Latorre

    2016-10-01

    Full Text Available Social concern about misuse of antibiotics as growth promoters (AGP and generation of multidrug-resistant bacteria have restricted the dietary inclusion of antibiotics in livestock feed in several countries. Direct-fed microbials (DFM are one of the multiple alternatives commonly evaluated as substitutes of AGP. Sporeformer bacteria from the genus Bacillus have been extensively investigated because of their extraordinary properties to form highly-resistant endospores, production of antimicrobial compounds and synthesize different exogenous enzymes. The purpose of the present study was to evaluate and select Bacillus spp. from environmental and poultry sources as DFM candidates, considering their enzyme production profile, biofilm synthesis capacity and pathogen-inhibition activity. Thirty one Bacillus isolates were screened for in vitro relative enzyme activity of amylase, protease, lipase and phytase using a selective media for each enzyme, with 3/31 strains selected as superior enzyme producers. These three isolates were identified as B. subtilis (1/3, and B. amyloliquefaciens (2/3 based on biochemical tests and 16S rRNA sequence analysis. For evaluation of biofilm synthesis, the generation of an adherent crystal violet-stained ring was determined in polypropylene tubes, resulting in 11/31 strains showing a strong biofilm formation. Moreover, all Bacillus strains were evaluated for growth inhibition activity against Salmonella enterica serovar Enteritidis (26/31, Escherichia coli (28/31 and Clostridioides difficile (29/31. Additionally, in previous in vitro and in vivo studies, these selected Bacillus strains have shown to be resistant to different biochemical conditions of the gastrointestinal tract of poultry. Results of the present study suggest that the selection and consumption of Bacillus-DFM, producing a variable set of enzymes and antimicrobial compounds may contribute to enhanced performance through improving nutrient digestibility

  9. Identification of candidate agents active against N. ceranae infection in honey bees: establishment of a medium throughput screening assay based on N. ceranae infected cultured cells.

    Science.gov (United States)

    Gisder, Sebastian; Genersch, Elke

    2015-01-01

    Many flowering plants in both natural ecosytems and agriculture are dependent on insect pollination for fruit set and seed production. Managed honey bees (Apis mellifera) and wild bees are key pollinators providing this indispensable eco- and agrosystem service. Like all other organisms, bees are attacked by numerous pathogens and parasites. Nosema apis is a honey bee pathogenic microsporidium which is widely distributed in honey bee populations without causing much harm. Its congener Nosema ceranae was originally described as pathogen of the Eastern honey bee (Apis cerana) but jumped host from A. cerana to A. mellifera about 20 years ago and spilled over from A. mellifera to Bombus spp. quite recently. N. ceranae is now considered a deadly emerging parasite of both Western honey bees and bumblebees. Hence, novel and sustainable treatment strategies against N. ceranae are urgently needed to protect honey and wild bees. We here present the development of an in vitro medium throughput screening assay for the identification of candidate agents active against N. ceranae infections. This novel assay is based on our recently developed cell culture model for N. ceranae and coupled with an RT-PCR-ELISA protocol for quantification of N. ceranae in infected cells. The assay has been adapted to the 96-well microplate format to allow automated analysis. Several substances with known (fumagillin) or presumed (surfactin) or no (paromomycin) activity against N. ceranae were tested as well as substances for which no data concerning N. ceranae inhibition existed. While fumagillin and two nitroimidazoles (metronidazole, tinidazole) totally inhibited N. ceranae proliferation, all other test substances were inactive. In summary, the assay proved suitable for substance screening and demonstrated the activity of two synthetic antibiotics against N. ceranae.

  10. Three-dimensional (3D) visualization of reflow porosity and modeling of deformation in Pb-free solder joints

    International Nuclear Information System (INIS)

    Dudek, M.A.; Hunter, L.; Kranz, S.; Williams, J.J.; Lau, S.H.; Chawla, N.

    2010-01-01

    The volume, size, and dispersion of porosity in solder joints are known to affect mechanical performance and reliability. Most of the techniques used to characterize the three-dimensional (3D) nature of these defects are destructive. With the enhancements in high resolution computed tomography (CT), the detection limits of intrinsic microstructures have been significantly improved. Furthermore, the 3D microstructure of the material can be used in finite element models to understand their effect on microscopic deformation. In this paper we describe a technique utilizing high resolution (< 1 μm) X-ray tomography for the three-dimensional (3D) visualization of pores in Sn-3.9Ag-0.7Cu/Cu joints. The characteristics of reflow porosity, including volume fraction and distribution, were investigated for two reflow profiles. The size and distribution of porosity size were visualized in 3D for four different solder joints. In addition, the 3D virtual microstructure was incorporated into a finite element model to quantify the effect of voids on the lap shear behavior of a solder joint. The presence, size, and location of voids significantly increased the severity of strain localization at the solder/copper interface.

  11. The Effect Of Void Formation On The Reliability Of ED-XRF Measurements In Lead-Free Reflow Soldering

    Directory of Open Access Journals (Sweden)

    Koncz-Horváth D.

    2015-06-01

    Full Text Available In lead-free reflow soldering, the presence of voids should be taken into account. For this reason, the effect of the applied heating profiles was examined via the characterization of voids in galvanic and immersion Sn coatings. According to EU Directive 2002/95/EC, the screening of Pb element of reflow soldering (i.e. of electrical and electronic equipment is necessary; and the practical implementation of this measurement is largely affected by the characteristics of the solder (i.e. the presence of voids and the inhomogeneity of the solder. Comparing the results of the above two coating methods, it was found that by chemical coating more voids were formed and the detected lead content was higher than for galvanic Sn. The standard deviation of Ag and Cu concentrations was mainly influenced by the appearance of large compounds in the second case, while with chemical coating, no large compounds were formed due to the elevated number of voids.

  12. Soldering of Bi-2223/Ag high temperature superconducting tapes with Sn-Pb-Bi-Ag alloy paste

    Energy Technology Data Exchange (ETDEWEB)

    Guo Wei, E-mail: gwei@tsinghua.edu.c [Department of Mechanical Engineering, Key Laboratory for Advanced Manufacturing by Materials Processing Technology, Tsinghua University, Ministry of Education of PR China, Beijing 100084 (China); School of Mechanical Engineering and Automation, Beijing University of Aeronautics and Astronautics, Beijing 100191 (China); Zou Guisheng; Wu Aiping; Bai Hailin; Ren Jialie [Department of Mechanical Engineering, Key Laboratory for Advanced Manufacturing by Materials Processing Technology, Tsinghua University, Ministry of Education of PR China, Beijing 100084 (China)

    2010-01-15

    Soldered joints of Bi-2223/Ag-sheathed high temperature superconducting multifilamentary tapes were fabricated using 63 wt.%Sn-34 wt.%Pb-1 wt.%Bi-2 wt.%Ag paste. The soldered joints were observed by scanning electron microscope (SEM) and X-ray diffraction (XRD). Moreover, the electrical properties of joints were evaluated by current-voltage curves, and the tensile strengths of the joints were also tested. The results show that the soldered joint consists of Ag sheath - Ag{sub 3}Sn compound layer - PbSn{sub 2} and Ag{sub 3}Sn solder layer - Ag{sub 3}Sn compound layer - Ag sheath. The joints are obeyed with Ohms Law and the magnitude of the joint resistance, which deceases with the increase of the overlap length, can reach the order of 10{sup -8} OMEGA. The tensile strength of the joints with a brittle fracture mode is a little lower than that of the original tapes.

  13. Liquid-phase diffusion bonding: Temperature effects and solute redistribution in high temperature lead-free composite solders

    Energy Technology Data Exchange (ETDEWEB)

    Anderson, Iver [Ames Lab. and Iowa State Univ., Ames, IA (United States); Iowa State Univ., Ames, IA (United States); Choquette, Stephanie [Ames Lab. and Iowa State Univ., Ames, IA (United States); Iowa State Univ., Ames, IA (United States)

    2015-05-17

    Liquid-phase diffusion bonding (LPDB) is being studied as the primary phenomena occurring in the development of a high temperature lead-free composite solder paste composed of gas-atomized Cu-10Ni, wt.% (Cu-11Ni, at.%) powder blended with Sn-0.7Cu-0.05Ni-0.01Ge (Sn-1.3Cu-0.1Ni-0.02Ge, at.%) Nihon-Superior SN100C solder powder. Powder compacts were used as a model system. LPDB promotes enhanced interdiffusion of the low-melting alloy matrix with the solid Cu-10Ni reinforcement powder above the matrix liquidus temperature. The initial study involved the effective intermetallic compound (IMC) compositions and microstructures that occur at varying reflow temperatures and times between 250-300°C and 30-60s, respectively. Certain reflow temperatures encourage adequate interdiffusion to form a continuous highly-conductive network throughout the composite solder joints. The diffusion of nickel, in particular, has a disperse pattern that foreshadows the possibility of a highly-conductive low-melting solder that can be successfully utilized at high temperatures.

  14. The shearing behavior and microstructure of Sn-4Ag-0.5Cu solder joints on a Ni-P-carbon nanotubes composite coating

    International Nuclear Information System (INIS)

    Gu, X.; Chan, Y.C.; Yang, D.; Wu, B.Y.

    2009-01-01

    This study employed an electroless Ni-P-carbon nanotubes (Ni-P-CNTs) composite coating as a pad finish for electronic packaging. It was aimed at investigating the effect of CNTs on the mechanical behavior and microstructure of ball grid array (BGA) solder joints after multiple reflows. Electroless Ni-P and electroless Ni-P-CNTs composite coatings with the same P-content were prepared for comparison. It was found that the CNTs in the coating increased the brittleness of solder joints and weakened their shear strength. After shearing tests, more brittle fractures occurred in the intermetallic compound (IMC) layer in the Sn-4Ag-0.5Cu/Ni-P-CNTs (SAC/Ni-P-CNTs) solder joints. According to the scanning electron microscope (SEM) observation, a Ni 3 Sn 4 IMC layer and a P-rich layer were formed in the solder joints on both coatings after multiple reflows. The IMC layers in the SAC/Ni-P solder joints were found to be compact with chunky-shaped grains, whilst the IMC layers in the SAC/Ni-P-CNTs solder joints were porous with needle-shaped grains. Due to the high stability of the CNTs in the metal matrix, the CNTs dispersed in the Ni-P coating acted as a retardant in the reaction of the Ni with the solder. Therefore, the growth rates of both the Ni 3 Sn 4 IMC layer and the P richer layer in the SAC/Ni-P-CNTs solder joints were slower than those in the SAC/Ni-P solder joints

  15. Microstructure, mechanical, and thermal properties of the Sn-1Ag-0.5Cu solder alloy bearing Fe for electronics applications

    Energy Technology Data Exchange (ETDEWEB)

    Shnawah, Dhafer Abdul-Ameer, E-mail: dhafer_eng@yahoo.com [Department of Mechanical Engineering, University of Malaya, 50603 Kuala Lumpur (Malaysia); Said, Suhana Binti Mohd [Department of Electrical Engineering, University of Malaya, 50603 Kuala Lumpur (Malaysia); Sabri, Mohd Faizul Mohd; Badruddin, Irfan Anjum [Department of Mechanical Engineering, University of Malaya, 50603 Kuala Lumpur (Malaysia); Che Faxing [Institute of Microelectronics, A-STAR (Agency for Science, Technology and Research), 11 Science Park Road, Singapore Science Park II, Singapore 117685 (Singapore)

    2012-08-15

    This work investigates the effect of Fe addition on the microstructural, mechanical, and thermal properties of the Sn-1Ag-0.5Cu (SAC105) solder alloy. The addition of Fe leads to the formation of large circular FeSn{sub 2} intermetallic compound (IMC) particles, which produce a weak interface with the {beta}-Sn matrix. The addition of Fe also leads to the inclusion of Fe in the Ag{sub 3}Sn and Cu{sub 6}Sn{sub 5} IMC particles. Moreover, Fe-bearing solders have been shown to form large primary {beta}-Sn grains. The weak interface between the large FeSn{sub 2} IMC particles and the {beta}-Sn matrix together with the presence of the large primary {beta}-Sn grains results in a significant reduction on the elastic modulus and yield strength of the Fe-bearing solders. Moreover, the improved plasticity of the large primary {beta}-Sn grains causes the Fe-bearing solders to exhibit large total elongation. The addition of Fe also significantly reduces the effect of aging. After aging at 100 Degree-Sign C and 180 Degree-Sign C, it has been observed that the Fe-bearing solders significantly suppress the coarsening of the Ag{sub 3}Sn IMC particles; consequently, they exhibit stable mechanical properties. This effect can be attributed to the inclusion of Fe in the Ag{sub 3}Sn IMC particles. In addition, fracture surface analysis indicates that the addition of Fe to the SAC105 solder alloy does not affect the mode of fracture, and all tested solders exhibited large ductile-dimples on the fracture surface. Moreover, the addition of Fe did not produce any significant effect on the melting behavior. As a result, the use conditions of the Fe-bearing solders are consistent with the conditions for conventional Sn-Ag-Cu solder alloys.

  16. The use of a directional solidification technique to investigate the interrelationship of thermal parameters, microstructure and microhardness of Bi–Ag solder alloys

    International Nuclear Information System (INIS)

    Spinelli, José Eduardo; Silva, Bismarck Luiz; Cheung, Noé; Garcia, Amauri

    2014-01-01

    Bi–Ag alloys have been stressed as possible alternatives to replace Pb-based solder alloys. Although acceptable melting temperatures and suitable mechanical properties may characterize such alloys, as referenced in literature, there is a lack of comprehension regarding their microstructures (morphologies and sizes of the phases) considering a composition range from 1.5 to 4.0 wt.%Ag. In order to better comprehend such aspects and their correlations with solidification thermal parameters (growth rate, v and cooling rate, T-dot), directional solidification experiments were carried out under transient heat flow conditions. The effects of Ag content on both cooling rate and growth rate during solidification are examined. Microstructure parameters such as eutectic/dendritic spacing, interphase spacing and diameter of the Ag-rich phase were determined by optical microscopy and scanning electron microscopy. The competition between eutectic cells and dendrites in the range from 1.5 to 4.0 wt.%Ag is explained by the coupled zone concept. Microhardness was determined for different microstructures and alloy Ag contents with a view to permitting correlations with microstructure parameters to be established. Hardness is shown to be directly affected by both solute macrosegregation and morphologies of the phases forming the Bi–Ag alloys, with higher hardness being associated with the cellular morphology of the Bi-2.5 and 4.0 wt.%Ag alloys. - Highlights: • Asymmetric zone of coupled growth for Bi–Ag is demonstrated. • Faceted Bi-rich dendrites have been characterized for Bi–1.5 wt.%Ag alloy. • Eutectic cells were shown for the Bi-2.5 and 4.0 wt.%Ag solder alloys. • Interphase spacing relations with G × v are able to represent the experimental scatters. • Hall-Petch type equations are proposed relating microstructural spacings to hardness

  17. Prediction of overall in vitro microsomal stability of drug candidates based on molecular modeling and support vector machines. Case study of novel arylpiperazines derivatives.

    Directory of Open Access Journals (Sweden)

    Szymon Ulenberg

    Full Text Available Other than efficacy of interaction with the molecular target, metabolic stability is the primary factor responsible for the failure or success of a compound in the drug development pipeline. The ideal drug candidate should be stable enough to reach its therapeutic site of action. Despite many recent excellent achievements in the field of computational methods supporting drug metabolism studies, a well-recognized procedure to model and predict metabolic stability quantitatively is still lacking. This study proposes a workflow for developing quantitative metabolic stability-structure relationships, taking a set of 30 arylpiperazine derivatives as an example. The metabolic stability of the compounds was assessed in in vitro incubations in the presence of human liver microsomes and NADPH and subsequently quantified by liquid chromatography-mass spectrometry (LC-MS. Density functional theory (DFT calculations were used to obtain 30 models of the molecules, and Dragon software served as a source of structure-based molecular descriptors. For modeling structure-metabolic stability relationships, Support Vector Machines (SVM, a non-linear machine learning technique, were found to be more effective than a regression technique, based on the validation parameters obtained. Moreover, for the first time, general sites of metabolism for arylpiperazines bearing the 4-aryl-2H-pyrido[1,2-c]pyrimidine-1,3-dione system were defined by analysis of Q-TOF-MS/MS spectra. The results indicated that the application of one of the most advanced chemometric techniques combined with a simple and quick in vitro procedure and LC-MS analysis provides a novel and valuable tool for predicting metabolic half-life values. Given the reduced time and simplicity of analysis, together with the accuracy of the predictions obtained, this is a valid approach for predicting metabolic stability using structural data. The approach presented provides a novel, comprehensive and reliable tool

  18. The effects of nucleation and solidification mechanisms on the microstructure and thermomechanical response of tin silver copper solder joints

    Science.gov (United States)

    Arfaei, Babak

    This work examines the nucleation mechanism of Sn in SnAgCu alloys and its effect on the microstructure of those solder joints. The nucleation rate of Sn in a SAC alloy was obtained by simultaneous calorimetric examination of the isothermal solidification of 88 flip chip Sn-Ag-Cu solder joints. Qualitative agreement with classic nucleation theory was observed, although it was concluded that the spherical cap model cannot be applied to explain the structure of nucleus. It was shown that the solidification temperature significantly affects the microstructure; samples that undercooled less than approximately 40oC revealed one or three large Sn grains, while interlaced twinning was observed in the samples that solidified at lower temperatures. In order to better understand the effect of microstructure on the thermomechanical properties of solder joints, a study of the dependence of room temperature shear fatigue lifetime on Sn grain number and orientation was conducted. This study examined the correlations of variations in fatigue life of solder balls with the microstructure of Sn-Ag-Cu solder. The mean fatigue lifetime was found to be significantly longer for samples with multiple Sn grains than for samples with single Sn grains. For single grain samples, correlations between Sn grain orientation (with respect to the loading direction) and lifetime were observed, providing insight on early failures in SnAgCu solder joints. Correlations between the lifetimes of single Sn grained, SAC205 solder joints with differences in Ag3Sn and Cu6Sn5 precipitate microstructures were investigated. It was found that Ag3Sn precipitates were highly segregated from Cu6Sn 5 precipitates on a length scale of approximately twenty microns. Furthermore, large (factor of two) variations of the Sn dendrite arm size were observed within given samples. Such variations in values of dendrite arm size within a single sample were much larger than observed variations of this parameter between

  19. Supersymmetric Dark Matter Candidates

    CERN Document Server

    Ellis, John

    2010-01-01

    After reviewing the theoretical, phenomenological and experimental motivations for supersymmetric extensions of the Standard Model, we recall that supersymmetric relics from the Big Bang are expected in models that conserve R parity. We then discuss possible supersymmetric dark matter candidates, focusing on the lightest neutralino and the gravitino. In the latter case, the next-to-lightest supersymmetric particle is expected to be long-lived, and possible candidates include spartners of the tau lepton, top quark and neutrino. We then discuss the roles of the renormalization-group equations and electroweak symmetry breaking in delimiting the supersymmetric parameter space. We discuss in particular the constrained minimal extension of the Standard Model (CMSSM), in which the supersymmetry-breaking parameters are assumed to be universal at the grand unification scale, presenting predictions from a frequentist analysis of its parameter space. We also discuss astrophysical and cosmological constraints on gravitin...

  20. Developing a fast cordless soldering iron via induction heating

    Directory of Open Access Journals (Sweden)

    Ernesto Edgar Mazón-Valadez

    2014-01-01

    Full Text Available Se presenta el desarrollo de un dispositivo para soldar compone ntes electrónicos, el cual funciona a base de campos magnéticos alternos. El dispositivo ha sido diseñado para trabajar sin cableado. El nuevo soldador se compone de un inversor resonante capaz de gen erar campos magnéticos alternos de 250 kHz en el centro de una bobin a de 11 espiras. El elemento calefactor es una pequeña pieza ci líndrica de acero inoxidable magnético con un núcleo concéntrico de cobr e, el cual se encuentra unido a una punta reemplazable para cau tín comercial. Adicionalmente hemos determinado el factor de potenc ia y la eficiencia en la transferencia de energía con un máximo de consumo de potencia de 134 Watts. El dispositivo representa una buena herramienta adecuada para la realización de tarjetas imp resas para circuitos o tareas de electrónica.

  1. Dark matter candidates

    International Nuclear Information System (INIS)

    Turner, M.S.

    1989-01-01

    One of the simplest, yet most profound, questions we can ask about the Universe is, how much stuff is in it, and further what is that stuff composed of? Needless to say, the answer to this question has very important implications for the evolution of the Universe, determining both the ultimate fate and the course of structure formation. Remarkably, at this late date in the history of the Universe we still do not have a definitive answer to this simplest of questions---although we have some very intriguing clues. It is known with certainty that most of the material in the Universe is dark, and we have the strong suspicion that the dominant component of material in the Cosmos is not baryons, but rather is exotic relic elementary particles left over from the earliest, very hot epoch of the Universe. If true, the Dark Matter question is a most fundamental one facing both particle physics and cosmology. The leading particle dark matter candidates are: the axion, the neutralino, and a light neutrino species. All three candidates are accessible to experimental tests, and experiments are now in progress. In addition, there are several dark horse, long shot, candidates, including the superheavy magnetic monopole and soliton stars. 13 refs

  2. Microstructural Aspects of Fatigue Parameters of Lead-Free Sn-Zn Solders with Various Zn Content

    Directory of Open Access Journals (Sweden)

    Pietrzak K.

    2017-03-01

    Full Text Available The study includes the results of research conducted on selected lead-free binary solder alloys designed for operation at high temperatures. The results of qualitative and quantitative metallographic examinations of SnZn alloys with various Zn content are presented. The quantitative microstructure analysis was carried out using a combinatorial method based on phase quanta theory, per which any microstructure can be treated as an array of elements disposed in the matrix material. Fatigue tests were also performed using the capabilities of a modified version of the LCF method hereinafter referred to in short as MLCF, which is particularly useful in the estimation of mechanical parameters when there are difficulties in obtaining many samples normally required for the LCF test. The fatigue life of alloys was analyzed in the context of their microstructure. It has been shown that the mechanical properties are improved with the Zn content increasing in the alloy. However, the best properties were obtained in the alloy with a chemical composition close to the eutectic system, when the Zn-rich precipitates showed the most preferred morphological characteristics. At higher content of Zn, a strong structural notch was formed in the alloy because of the formation in the microstructure of a large amount of the needle-like Zn-rich precipitates deteriorating the mechanical characteristics. Thus, the results obtained during previous own studies, which in the field of mechanical testing were based on static tensile test only, have been confirmed. It is interesting to note that during fatigue testing, both significant strengthening and weakening of the examined material can be expected. The results of fatigue tests performed on SnZn alloys have proved that in this case the material was softened.

  3. Constitutive Behavior of Mixed Sn-Pb/Sn-3.0Ag-0.5Cu Solder Alloys

    Science.gov (United States)

    Tucker, J. P.; Chan, D. K.; Subbarayan, G.; Handwerker, C. A.

    2012-03-01

    During the transition from Pb-containing solders to Pb-free solders, joints composed of a mixture of Sn-Pb and Sn-Ag-Cu often result from either mixed assemblies or rework. Comprehensive characterization of the mechanical behavior of these mixed solder alloys resulting in a deformationally complete constitutive description is necessary to predict failure of mixed alloy solder joints. Three alloys with 1 wt.%, 5 wt.%, and 20 wt.% Pb were selected so as to represent reasonable ranges of Pb contamination expected from different 63Sn-37Pb components mixed with Sn-3.0Ag-0.5Cu. Creep and displacement-controlled tests were performed on specially designed assemblies at temperatures of 25°C, 75°C, and 125°C using a double lap shear test setup that ensures a nearly homogeneous state of plastic strain at the joint interface. The observed changes in creep and tensile behavior with Pb additions were related to phase equilibria and microstructure differences observed through differential scanning calorimetric and scanning electron microscopic cross-sectional analysis. As Pb content increased, the steady-state creep strain rates increased, and primary creep decreased. Even 1 wt.% Pb addition was sufficient to induce substantially large creep strains relative to the Sn-3.0Ag-0.5Cu alloy. We describe rate-dependent constitutive models for Pb-contaminated Sn-Ag-Cu solder alloys, ranging from the traditional time-hardening creep model to the viscoplastic Anand model. We illustrate the utility of these constitutive models by examining the inelastic response of a chip-scale package (CSP) under thermomechanical loading through finite-element analysis. The models predict that, as Pb content increases, total inelastic dissipation decreases.

  4. A case-based, problem-based learning approach to prepare master of public health candidates for the complexities of global health.

    Science.gov (United States)

    Leon, Juan S; Winskell, Kate; McFarland, Deborah A; del Rio, Carlos

    2015-03-01

    Global health is a dynamic, emerging, and interdisciplinary field. To address current and emerging global health challenges, we need a public health workforce with adaptable and collaborative problem-solving skills. In the 2013-2014 academic year, the Hubert Department of Global Health at the Rollins School of Public Health-Emory University launched an innovative required core course for its first-year Master of Public Health students in the global health track. The course uses a case-based, problem-based learning approach to develop global health competencies. Small teams of students propose solutions to these problems by identifying learning issues and critically analyzing and synthesizing new information. We describe the course structure and logistics used to apply this approach in the context of a large class and share lessons learned.

  5. Immunogenicity of a virosomally-formulated Plasmodium falciparum GLURP-MSP3 chimeric protein-based malaria vaccine candidate in comparison to adjuvanted formulations

    DEFF Research Database (Denmark)

    Tamborrini, Marco; Stoffel, Sabine A; Westerfeld, Nicole

    2011-01-01

    In clinical trials, immunopotentiating reconstituted influenza virosomes (IRIVs) have shown great potential as a versatile antigen delivery platform for synthetic peptides derived from Plasmodium falciparum antigens. This study describes the immunogenicity of a virosomally-formulated recombinant...... fusion protein comprising domains of the two malaria vaccine candidate antigens MSP3 and GLURP....

  6. Congenital diaphragmatic hernia and chromosome 15q26: Determination of a candidate region by use of fluorescent in situ hybridization and array-based comparative genomic hybridization

    NARCIS (Netherlands)

    M. Klaassens (Merel); M.F. van Dooren (Marieke); H.J.F.M.M. Eussen (Bert); H. Douben (Hannie); A. Dekker (Anita); C. Lee (Charles); P.K. Donahoe; R-J.H. Galjaard (Robert-Jan); N.N.T. Goemaere (Natascha); R.R. de Krijger (Ronald); C.H. Wouters (Cokkie); J. Wauters (Jan); B.A. Oostra (Ben); D. Tibboel (Dick); J.E.M.M. de Klein (Annelies)

    2005-01-01

    textabstractCongenital diaphragmatic hernia (CDH) has an incidence of 1 in 3,000 births and a high mortality rate (33%-58%). Multifactorial inheritance, teratogenic agents, and genetic abnormalities have all been suggested as possible etiologic factors. To define candidate regions for CDH, we

  7. Congenital diaphragmatic hernia and chromosome 15q26: determination of a candidate region by use of fluorescent in situ hybridization and array-based comparative genomic hybridization

    NARCIS (Netherlands)

    M. Klaassens (Merel); C. Wouters (Cokkie); M.F. van Dooren (Marieke); H.J.F.M.M. Eussen (Bert); H. Douben (Hannie); J.E.M.M. de Klein (Annelies); A.T. den Dekker (Alexander); C. Lee; P.K. Donahoe; D. Tibboel (Dick); R-J.H. Galjaard (Robert-Jan); N.N.T. Goemaere (Natascha); B.A. Oostra (Ben); R.R. de Krijger (Ronald); J. Wauters (Jan)

    2005-01-01

    textabstractCongenital diaphragmatic hernia (CDH) has an incidence of 1 in 3,000 births and a high mortality rate (33%-58%). Multifactorial inheritance, teratogenic agents, and genetic abnormalities have all been suggested as possible etiologic factors. To define candidate

  8. Teachers Candidates' Reviews on Teacher Candidate Training System

    Science.gov (United States)

    Altintas, Sedat; Görgen, Izzet

    2017-01-01

    In our country, as a result of the appointment in some different disciplines, nearly 30000 teacher candidates could be a part of education system. Also, a new revision has been completed on teacher candidate training and it has been put into action. Teacher candidates have been trained for six months after they have been appointed. These teachers…

  9. Utilization of a Porous Cu Interlayer for the Enhancement of Pb-Free Sn-3.0Ag-0.5Cu Solder Joint

    Directory of Open Access Journals (Sweden)

    Nashrah Hani Jamadon

    2016-09-01

    Full Text Available The joining of lead-free Sn-3.0Ag-0.5Cu (SAC305 solder alloy to metal substrate with the addition of a porous Cu interlayer was investigated. Two types of porous Cu interlayers, namely 15 ppi—pore per inch (P15 and 25 ppi (P25 were sandwiched in between SAC305/Cu substrate. The soldering process was carried out at soldering time of 60, 180, and 300 s at three temperature levels of 267, 287, and 307 °C. The joint strength was evaluated by tensile testing. The highest strength for solder joints with addition of P25 and P15 porous Cu was 51 MPa (at 180 s and 307 °C and 54 MPa (at 300 s and 307 °C , respectively. The fractography of the solder joint was analyzed by optical microscope (OM and scanning electron microscopy (SEM. The results showed that the propagation of fracture during tensile tests for solder with a porous Cu interlayer occurred in three regions: (i SAC305/Cu interface; (ii inside SAC305 solder alloy; and (iii inside porous Cu. Energy dispersive X-ray spectroscopy (EDX was used to identify intermetallic phases. Cu6Sn5 phase with scallop-liked morphology was observed at the interface of the SAC305/Cu substrate. In contrast, the scallop-liked intermetallic phase together with more uniform but a less defined scallop-liked phase was observed at the interface of porous Cu and solder alloy.

  10. Effects of aging time on the mechanical properties of Sn–9Zn–1.5Ag–xBi lead-free solder alloys

    Energy Technology Data Exchange (ETDEWEB)

    Liu, Chih-Yao [Department of Materials Science and Engineering, National Cheng Kung University, 1 Ta-Hsueh Road, Tainan 70101, Taiwan (China); Hon, Min-Hsiung [Department of Materials Science and Engineering, National Cheng Kung University, 1 Ta-Hsueh Road, Tainan 70101, Taiwan (China); Department of Mechanical Engineering, National Kaohsiung University of Applied Sciences, 415 Chien-Kung Road, Kaohsiung 80782, Taiwan (China); Wang, Moo-Chin, E-mail: mcwang@kmu.edu.tw [Department of Fragrance and Cosmetic Science, Kaohsiung Medical University, 100, Shih-Chuan 1st Road, Kaohsiung 80728, Taiwan (China); Chen, Ying-Ru; Chang, Kuo-Ming; Li, Wang-Long [Institute of Nanotechnology and Microsystems Engineering, National Cheng Kung University, No. 1, University Road, Tainan 70101, Taiwan (China)

    2014-01-05

    Highlights: • The microstructure of these solder alloys are composed of Sn-rich phase and Ag{sub 3}Sn. • The grain size of Sn–9Zn–1.5Ag–xBi solder alloys increases with rose aging time. • The maximum yield strength is 112.7 ± 2.2 MPa for Sn–9Zn–1.5Ag–3Bi solder alloys. • TEM observed that Bi appears as oblong shape fine particles. -- Abstract: The effects of aging time on the mechanical properties of the Sn–9Zn–1.5Ag–xBi lead-free solder alloys are investigated using scanning electron microscopy (SEM), X-ray diffraction (XRD), transmission electron microscopy (TEM), selected area electron diffraction (SAED), energy dispersive spectrometry (EDS) and a universal testing machine. The experimental results show that the microstructure of Sn–9Zn–1.5Ag–xBi solder alloys is composed of Sn-rich phase and AgZn{sub 3}. No other intermetallic compounds (IMCs) with Bi content was observed in the solder matrix for Sn–9Zn–1.5Ag solder alloys with various Bi contents before and after aging at 150 °C for different durations. The lattice parameter increases significantly with increasing aging time or Bi addition. The size of Sn-rich grain increased gradually with aging time increased, but decreases with Bi content increases. The maximum yield strength is 112.7 ± 2.2 MPa for Sn–9Zn–1.5Ag–3Bi solder alloy before aging.

  11. Effects of aging time on the mechanical properties of Sn–9Zn–1.5Ag–xBi lead-free solder alloys

    International Nuclear Information System (INIS)

    Liu, Chih-Yao; Hon, Min-Hsiung; Wang, Moo-Chin; Chen, Ying-Ru; Chang, Kuo-Ming; Li, Wang-Long

    2014-01-01

    Highlights: • The microstructure of these solder alloys are composed of Sn-rich phase and Ag 3 Sn. • The grain size of Sn–9Zn–1.5Ag–xBi solder alloys increases with rose aging time. • The maximum yield strength is 112.7 ± 2.2 MPa for Sn–9Zn–1.5Ag–3Bi solder alloys. • TEM observed that Bi appears as oblong shape fine particles. -- Abstract: The effects of aging time on the mechanical properties of the Sn–9Zn–1.5Ag–xBi lead-free solder alloys are investigated using scanning electron microscopy (SEM), X-ray diffraction (XRD), transmission electron microscopy (TEM), selected area electron diffraction (SAED), energy dispersive spectrometry (EDS) and a universal testing machine. The experimental results show that the microstructure of Sn–9Zn–1.5Ag–xBi solder alloys is composed of Sn-rich phase and AgZn 3 . No other intermetallic compounds (IMCs) with Bi content was observed in the solder matrix for Sn–9Zn–1.5Ag solder alloys with various Bi contents before and after aging at 150 °C for different durations. The lattice parameter increases significantly with increasing aging time or Bi addition. The size of Sn-rich grain increased gradually with aging time increased, but decreases with Bi content increases. The maximum yield strength is 112.7 ± 2.2 MPa for Sn–9Zn–1.5Ag–3Bi solder alloy before aging

  12. Proceedings of the Annual Soldering/Manufacturing Seminar (10th) Held in China Lake, California on 19-20 February 1986

    Science.gov (United States)

    1986-02-19

    8217 coefficient of thermal expansion ( CTE ), not just the different CTEs "- of the device and the substrate, but also of the solder itself (Ref. 9). The high...solder CTE cart be the driving force for metallurgical instability of surface mounted assemblies. Future tests are planned to correlate accelerated...manufacturing and quality related problems. 168 NWC TP 6707 To better understand the uses of statistical control charts, consider the game of football

  13. Effects of metallic nanoparticle doped flux on the interfacial intermetallic compounds between lead-free solder ball and copper substrate

    International Nuclear Information System (INIS)

    Sujan, G.K.; Haseeb, A.S.M.A.; Afifi, A.B.M.

    2014-01-01

    Lead free solders currently in use are prone to develop thick interfacial intermetallic compound layers with rough morphology which are detrimental to the long term solder joint reliability. A novel method has been developed to control the morphology and growth of intermetallic compound layers between lead-free Sn–3.0Ag–0.5Cu solder ball and copper substrate by doping a water soluble flux with metallic nanoparticles. Four types of metallic nanoparticles (nickel, cobalt, molybdenum and titanium) were used to investigate their effects on the wetting behavior and interfacial microstructural evaluations after reflow. Nanoparticles were dispersed manually with a water soluble flux and the resulting nanoparticle doped flux was placed on copper substrate. Lead-free Sn–3.0Ag–0.5Cu solder balls of diameter 0.45 mm were placed on top of the flux and were reflowed at a peak temperature of 240 °C for 45 s. Angle of contact, wetting area and interfacial microstructure were studied by optical microscopy, field emission scanning electron microscopy and energy-dispersive X-ray spectroscopy. It was observed that the angle of contact increased and wetting area decreased with the addition of cobalt, molybdenum and titanium nanoparticles to flux. On the other hand, wettability improved with the addition of nickel nanoparticles. Cross-sectional micrographs revealed that both nickel and cobalt nanoparticle doping transformed the morphology of Cu 6 Sn 5 from a typical scallop type to a planer one and reduced the intermetallic compound thickness under optimum condition. These effects were suggested to be related to in-situ interfacial alloying at the interface during reflow. The minimum amount of nanoparticles required to produce the planer morphology was found to be 0.1 wt.% for both nickel and cobalt. Molybdenum and titanium nanoparticles neither appear to undergo alloying during reflow nor have any influence at the solder/substrate interfacial reaction. Thus, doping of flux

  14. Mechanistic Prediction of the Effect of Microstructural Coarsening on Creep Response of SnAgCu Solder Joints

    Science.gov (United States)

    Mukherjee, S.; Chauhan, P.; Osterman, M.; Dasgupta, A.; Pecht, M.

    2016-07-01

    Mechanistic microstructural models have been developed to capture the effect of isothermal aging on time dependent viscoplastic response of Sn3.0Ag0.5Cu (SAC305) solders. SnAgCu (SAC) solders undergo continuous microstructural coarsening during both storage and service because of their high homologous temperature. The microstructures of these low melting point alloys continuously evolve during service. This results in evolution of creep properties of the joint over time, thereby influencing the long term reliability of microelectronic packages. It is well documented that isothermal aging degrades the creep resistance of SAC solder. SAC305 alloy is aged for (24-1000) h at (25-100)°C (~0.6-0.8 × T melt). Cross-sectioning and image processing techniques were used to periodically quantify the effect of isothermal aging on phase coarsening and evolution. The parameters monitored during isothermal aging include size, area fraction, and inter-particle spacing of nanoscale Ag3Sn intermetallic compounds (IMCs) and the volume fraction of micronscale Cu6Sn5 IMCs, as well as the area fraction of pure tin dendrites. Effects of microstructural evolution on secondary creep constitutive response of SAC305 solder joints were then modeled using a mechanistic multiscale creep model. The mechanistic phenomena modeled include: (1) dispersion strengthening by coarsened nanoscale Ag3Sn IMCs in the eutectic phase; and (2) load sharing between pro-eutectic Sn dendrites and the surrounding coarsened eutectic Sn-Ag phase and microscale Cu6Sn5 IMCs. The coarse-grained polycrystalline Sn microstructure in SAC305 solder was not captured in the above model because isothermal aging does not cause any significant change in the initial grain size and orientation of SAC305 solder joints. The above mechanistic model can successfully capture the drop in creep resistance due to the influence of isothermal aging on SAC305 single crystals. Contribution of grain boundary sliding to the creep strain of

  15. Effects of metallic nanoparticle doped flux on the interfacial intermetallic compounds between lead-free solder ball and copper substrate

    Energy Technology Data Exchange (ETDEWEB)

    Sujan, G.K., E-mail: sgkumer@gmail.com; Haseeb, A.S.M.A., E-mail: haseeb@um.edu.my; Afifi, A.B.M., E-mail: amalina@um.edu.my

    2014-11-15

    Lead free solders currently in use are prone to develop thick interfacial intermetallic compound layers with rough morphology which are detrimental to the long term solder joint reliability. A novel method has been developed to control the morphology and growth of intermetallic compound layers between lead-free Sn–3.0Ag–0.5Cu solder ball and copper substrate by doping a water soluble flux with metallic nanoparticles. Four types of metallic nanoparticles (nickel, cobalt, molybdenum and titanium) were used to investigate their effects on the wetting behavior and interfacial microstructural evaluations after reflow. Nanoparticles were dispersed manually with a water soluble flux and the resulting nanoparticle doped flux was placed on copper substrate. Lead-free Sn–3.0Ag–0.5Cu solder balls of diameter 0.45 mm were placed on top of the flux and were reflowed at a peak temperature of 240 °C for 45 s. Angle of contact, wetting area and interfacial microstructure were studied by optical microscopy, field emission scanning electron microscopy and energy-dispersive X-ray spectroscopy. It was observed that the angle of contact increased and wetting area decreased with the addition of cobalt, molybdenum and titanium nanoparticles to flux. On the other hand, wettability improved with the addition of nickel nanoparticles. Cross-sectional micrographs revealed that both nickel and cobalt nanoparticle doping transformed the morphology of Cu{sub 6}Sn{sub 5} from a typical scallop type to a planer one and reduced the intermetallic compound thickness under optimum condition. These effects were suggested to be related to in-situ interfacial alloying at the interface during reflow. The minimum amount of nanoparticles required to produce the planer morphology was found to be 0.1 wt.% for both nickel and cobalt. Molybdenum and titanium nanoparticles neither appear to undergo alloying during reflow nor have any influence at the solder/substrate interfacial reaction. Thus, doping

  16. National Vocational Qualifications: the candidates' experience.

    Science.gov (United States)

    Isaac, Susan

    2007-03-01

    To examine the experience of studying for an National Vocational Qualification (NVQ) by past and present candidates in the library and information science sector, their reasons for choosing this qualification and its impact on completion. Following a review of the literature, a number of NVQ candidates were interviewed using a semi-structured questionnaire. Candidates were contacted via e-mail through NVQ Centres and the LondonLinks e-mail list. There is a focus on health libraries as the flexibility and work-based nature of NVQs enable more staff to access training and education in this sector, despite the not uncommon low levels of staffing. NVQ Centres have gained experience since NVQs were launched 10 years ago. More support is offered to candidates and a number of issues such as isolation, are no longer a problem. An interesting result was the high number of candidates who had gone on to higher education following the completion of an NVQ. The NVQ is a useful method of providing staff with an opportunity to gain a recognized qualification. A significant number of candidates reported that the NVQ was ultimately a positive experience that improved their working practices. It can be an important first step for non-professional staff, but the future remains uncertain.

  17. Immunogenicity of a virosomally-formulated Plasmodium falciparum GLURP-MSP3 chimeric protein-based malaria vaccine candidate in comparison to adjuvanted formulations

    Directory of Open Access Journals (Sweden)

    Tamborrini Marco

    2011-12-01

    Full Text Available Abstract Background In clinical trials, immunopotentiating reconstituted influenza virosomes (IRIVs have shown great potential as a versatile antigen delivery platform for synthetic peptides derived from Plasmodium falciparum antigens. This study describes the immunogenicity of a virosomally-formulated recombinant fusion protein comprising domains of the two malaria vaccine candidate antigens MSP3 and GLURP. Methods The highly purified recombinant protein GMZ2 was coupled to phosphatidylethanolamine and the conjugates incorporated into the membrane of IRIVs. The immunogenicity of this adjuvant-free virosomal formulation was compared to GMZ2 formulated with the adjuvants Montanide ISA 720 and Alum in three mouse strains with different genetic backgrounds. Results Intramuscular injections of all three candidate vaccine formulations induced GMZ2-specific antibody responses in all mice tested. In general, the humoral immune response in outbred NMRI mice was stronger than that in inbred BALB/c and C57BL/6 mice. ELISA with the recombinant antigens demonstrated immunodominance of the GLURP component over the MSP3 component. However, compared to the Al(OH3-adjuvanted formulation the two other formulations elicited in NMRI mice a larger proportion of anti-MSP3 antibodies. Analyses of the induced GMZ2-specific IgG subclass profiles showed for all three formulations a predominance of the IgG1 isotype. Immune sera against all three formulations exhibited cross-reactivity with in vitro cultivated blood-stage parasites. Immunofluorescence and immunoblot competition experiments showed that both components of the hybrid protein induced IgG cross-reactive with the corresponding native proteins. Conclusion A virosomal formulation of the chimeric protein GMZ2 induced P. falciparum blood stage parasite cross-reactive IgG responses specific for both MSP3 and GLURP. GMZ2 thus represents a candidate component suitable for inclusion into a multi-valent virosomal

  18. Identification and Comparison of Candidate Olfactory Genes in the Olfactory and Non-Olfactory Organs of Elm Pest Ambrostoma quadriimpressum (Coleoptera: Chrysomelidae) Based on Transcriptome Analysis.

    Science.gov (United States)

    Wang, Yinliang; Chen, Qi; Zhao, Hanbo; Ren, Bingzhong

    2016-01-01

    The leaf beetle Ambrostoma quadriimpressum (Coleoptera: Chrysomelidae) is a predominant forest pest that causes substantial damage to the lumber industry and city management. However, no effective and environmentally friendly chemical method has been discovered to control this pest. Until recently, the molecular basis of the olfactory system in A. quadriimpressum was completely unknown. In this study, antennae and leg transcriptomes were analyzed and compared using deep sequencing data to identify the olfactory genes in A. quadriimpressum. Moreover, the expression profiles of both male and female candidate olfactory genes were analyzed and validated by bioinformatics, motif analysis, homology analysis, semi-quantitative RT-PCR and RT-qPCR experiments in antennal and non-olfactory organs to explore the candidate olfactory genes that might play key roles in the life cycle of A. quadriimpressum. As a result, approximately 102.9 million and 97.3 million clean reads were obtained from the libraries created from the antennas and legs, respectively. Annotation led to 34344 Unigenes, which were matched to known proteins. Annotation data revealed that the number of genes in antenna with binding functions and receptor activity was greater than that of legs. Furthermore, many pathway genes were differentially expressed in the two organs. Sixteen candidate odorant binding proteins (OBPs), 10 chemosensory proteins (CSPs), 34 odorant receptors (ORs), 20 inotropic receptors [1] and 2 sensory neuron membrane proteins (SNMPs) and their isoforms were identified. Additionally, 15 OBPs, 9 CSPs, 18 ORs, 6 IRs and 2 SNMPs were predicted to be complete ORFs. Using RT-PCR, RT-qPCR and homology analysis, AquaOBP1/2/4/7/C1/C6, AquaCSP3/9, AquaOR8/9/10/14/15/18/20/26/29/33, AquaIR8a/13/25a showed olfactory-specific expression, indicating that these genes might play a key role in olfaction-related behaviors in A. quadriimpressum such as foraging and seeking. AquaOBP4/C5, AquaOBP4/C5, AquaCSP7

  19. Identification and Comparison of Candidate Olfactory Genes in the Olfactory and Non-Olfactory Organs of Elm Pest Ambrostoma quadriimpressum (Coleoptera: Chrysomelidae Based on Transcriptome Analysis.

    Directory of Open Access Journals (Sweden)

    Yinliang Wang

    Full Text Available The leaf beetle Ambrostoma quadriimpressum (Coleoptera: Chrysomelidae is a predominant forest pest that causes substantial damage to the lumber industry and city management. However, no effective and environmentally friendly chemical method has been discovered to control this pest. Until recently, the molecular basis of the olfactory system in A. quadriimpressum was completely unknown. In this study, antennae and leg transcriptomes were analyzed and compared using deep sequencing data to identify the olfactory genes in A. quadriimpressum. Moreover, the expression profiles of both male and female candidate olfactory genes were analyzed and validated by bioinformatics, motif analysis, homology analysis, semi-quantitative RT-PCR and RT-qPCR experiments in antennal and non-olfactory organs to explore the candidate olfactory genes that might play key roles in the life cycle of A. quadriimpressum. As a result, approximately 102.9 million and 97.3 million clean reads were obtained from the libraries created from the antennas and legs, respectively. Annotation led to 34344 Unigenes, which were matched to known proteins. Annotation data revealed that the number of genes in antenna with binding functions and receptor activity was greater than that of legs. Furthermore, many pathway genes were differentially expressed in the two organs. Sixteen candidate odorant binding proteins (OBPs, 10 chemosensory proteins (CSPs, 34 odorant receptors (ORs, 20 inotropic receptors [1] and 2 sensory neuron membrane proteins (SNMPs and their isoforms were identified. Additionally, 15 OBPs, 9 CSPs, 18 ORs, 6 IRs and 2 SNMPs were predicted to be complete ORFs. Using RT-PCR, RT-qPCR and homology analysis, AquaOBP1/2/4/7/C1/C6, AquaCSP3/9, AquaOR8/9/10/14/15/18/20/26/29/33, AquaIR8a/13/25a showed olfactory-specific expression, indicating that these genes might play a key role in olfaction-related behaviors in A. quadriimpressum such as foraging and seeking. AquaOBP4/C5, Aqua

  20. FEM simulation of the size- and constraining effect in lead- free solder joints with the theory of strain gradient elasticity

    Science.gov (United States)

    Lederer, M.; Magnien, J.; Khatibi, G.; Weiss, B.

    2015-04-01

    Reliability studies of electronic parts prevalently involve FEM simulations of solder joints under service conditions. However, simulations performed with classical continuum mechanics lead to strain singularities at the surface of material transitions. In consequence, the desired independence of the results from mesh size can usually not be achieved. Therefore, we propose a novel version of strain gradient elasticity which consequently removes strain singularities. Our approach shows similarities to a strain gradient theory which was developed already in the 1960s. But in our version of the theory it is required that the stress tensor of equilibrium states is always symmetric. This approach is implemented in the commercial FEM code ABAQUS through user subroutine UEL. Thus, it is demonstrated that in the new approach mesh convergence is achieved. Furthermore, simulations for solder joints of different sizes predict a mechanical size effect in the sense “smaller is stronger”.

  1. Aging effects on the microstructure, surface characteristics and wettability of Cu pretinned with Sn-Pb solders

    Energy Technology Data Exchange (ETDEWEB)

    Linch, Heidi Sue [Univ. of California, Berkeley, CA (United States)

    1993-11-01

    This study investigates effects of aging in air and argon at 170 C on Cu coupons which were pretinned with 75Sn-25Pb, 8Sn-92Pb, and 5Sn-95Pb solders. Coatings were applied using electroplating or hot dipping techniques. The coating thickness was controlled between 3 to 3μm and the specimens were aged for 0 hours, 2 hours, 24 hours and 2 weeks. Wetting balance tests were used to evaluate the wettability of the test specimens. Microstructural development was evaluated using X-ray diffraction, energy dispersive X-ray and Auger spectroscopy, as well as optical and scanning electron microscopy. The wetting behavior of the test specimens is interpreted with respect to observed microstructural changes and as a function of aging time, solder composition, and processing conditions.

  2. In-situ Investigation of Lead-free Solder Alloy Formation Using a Hot-plate Microscope

    DEFF Research Database (Denmark)

    Bergmann, René; Tang, Peter Torben; Hansen, Hans Nørgaard

    2007-01-01

    This work presents the advantages of using a hot-plate microscope for investigation of new (high-temperature) lead- free solders as in-situ analysis tool and preparation equipment. A description of the equipment and the preparation method is given and some examples are outlined. The formation...... phases of the Au-Sn system. The measured values are comparable to those found in the literature. An outlook to further research is also given....

  3. A novel dengue virus serotype 1 vaccine candidate based on Japanese encephalitis virus vaccine strain SA14-14-2 as the backbone.

    Science.gov (United States)

    Yang, Huiqiang; Li, Zhushi; Lin, Hua; Wang, Wei; Yang, Jian; Liu, Lina; Zeng, Xianwu; Wu, Yonglin; Yu, Yongxin; Li, Yuhua

    2016-06-01

    To develop a potential dengue vaccine candidate, a full-length cDNA clone of a novel chimeric virus was constructed using recombinant DNA technology, with Japanese encephalitis virus (JEV) vaccine strain SA14-14-2 as the backbone, with its premembrane (prM) and envelope (E) genes substituted by their counterparts from dengue virus type 1 (DENV1). The chimeric virus (JEV/DENV1) was successfully recovered from primary hamster kidney (PHK) cells by transfection with the in vitro transcription products of JEV/DENV1 cDNA and was identified by complete genome sequencing and immunofluorescent staining. No neuroinvasiveness of this chimeric virus was observed in mice inoculated by the subcutaneous route (s.c.) or by the intraperitoneal route (i.p.), while some neurovirulence was displayed in mice that were inoculated directly by the intracerebral route (i.c.). The chimeric virus was able to stimulate high-titer production of antibodies against DENV1 and provided protection against lethal challenge with neuroadapted dengue virus in mice. These results suggest that the chimeric virus is a promising dengue vaccine candidate.

  4. New Coating Technique of Ceramic Implants with Different Glass Solder Matrices for Improved Osseointegration-Mechanical Investigations.

    Science.gov (United States)

    Mick, Enrico; Markhoff, Jana; Mitrovic, Aurica; Jonitz, Anika; Bader, Rainer

    2013-09-11

    Ceramics are a very popular material in dental implant technology due to their tribological properties, their biocompatibility and their esthetic appearance. However, their natural surface structure lacks the ability of proper osseointegration, which constitutes a crucial process for the stability and, thus, the functionality of a bone implant. We investigated the application of a glass solder matrix in three configurations-consisting mainly of SiO₂, Al₂O₃, K₂O and Na₂O to TZP-A ceramic specimens. The corresponding adhesive strength and surface roughness of the coatings on ceramic specimens have been analyzed. Thereby, high adhesive strength (70.3 ± 7.9 MPa) was found for the three different coatings. The obtained roughness (R z ) amounted to 18.24 ± 2.48 µm in average, with significant differences between the glass solder configurations. Furthermore, one configuration was also tested after additional etching which did not lead to significant increase of surface roughness (19.37 ± 1.04 µm) or adhesive strength (57.2 ± 5.8 MPa). In conclusion, coating with glass solder matrix seems to be a promising surface modification technique that may enable direct insertion of ceramic implants in dental and orthopaedic surgery.

  5. New Coating Technique of Ceramic Implants with Different Glass Solder Matrices for Improved Osseointegration-Mechanical Investigations

    Directory of Open Access Journals (Sweden)

    Rainer Bader

    2013-09-01

    Full Text Available Ceramics are a very popular material in dental implant technology due to their tribological properties, their biocompatibility and their esthetic appearance. However, their natural surface structure lacks the ability of proper osseointegration, which constitutes a crucial process for the stability and, thus, the functionality of a bone implant. We investigated the application of a glass solder matrix in three configurations—consisting mainly of SiO2, Al2O3, K2O and Na2O to TZP-A ceramic specimens. The corresponding adhesive strength and surface roughness of the coatings on ceramic specimens have been analyzed. Thereby, high adhesive strength (70.3 ± 7.9 MPa was found for the three different coatings. The obtained roughness (Rz amounted to 18.24 ± 2.48 µm in average, with significant differences between the glass solder configurations. Furthermore, one configuration was also tested after additional etching which did not lead to significant increase of surface roughness (19.37 ± 1.04 µm or adhesive strength (57.2 ± 5.8 MPa. In conclusion, coating with glass solder matrix seems to be a promising surface modification technique that may enable direct insertion of ceramic implants in dental and orthopaedic surgery.

  6. Developing Potential Candidates of Preclinical Preeclampsia

    Science.gov (United States)

    Founds, Sandra; Zeng, Xuemei; Lykins, David; Roberts, James M.

    2015-01-01

    The potential for developing molecules of interest in preclinical preeclampsia from candidate genes that were discovered on gene expression microarray analysis has been challenged by limited access to additional first trimester trophoblast and decidual tissues. The question of whether these candidates encode secreted proteins that may be detected in maternal circulation early in pregnancy has been investigated using various proteomic methods. Pilot studies utilizing mass spectrometry based proteomic assays, along with enzyme linked immunosorbent assays (ELISAs), and Western immunoblotting in first trimester samples are reported. The novel targeted mass spectrometry methods led to robust multiple reaction monitoring assays. Despite detection of several candidates in early gestation, challenges persist. Future antibody-based studies may lead to a novel multiplex protein panel for screening or detection to prevent or mitigate preeclampsia. PMID:26580600

  7. Developing Potential Candidates of Preclinical Preeclampsia

    Directory of Open Access Journals (Sweden)

    Sandra Founds

    2015-11-01

    Full Text Available The potential for developing molecules of interest in preclinical preeclampsia from candidate genes that were discovered on gene expression microarray analysis has been challenged by limited access to additional first trimester trophoblast and decidual tissues. The question of whether these candidates encode secreted proteins that may be detected in maternal circulation early in pregnancy has been investigated using various proteomic methods. Pilot studies utilizing mass spectrometry based proteomic assays, along with enzyme linked immunosorbent assays (ELISAs, and Western immunoblotting in first trimester samples are reported. The novel targeted mass spectrometry methods led to robust multiple reaction monitoring assays. Despite detection of several candidates in early gestation, challenges persist. Future antibody-based studies may lead to a novel multiplex protein panel for screening or detection to prevent or mitigate preeclampsia.

  8. Processing and characterization of device solder interconnection and module attachment for power electronics modules

    Science.gov (United States)

    Haque, Shatil

    This research is focused on the processing of an innovative three-dimensional packaging architecture for power electronics building blocks with soldered device interconnections and subsequent characterization of the module's critical interfaces. A low-cost approach termed metal posts interconnected parallel plate structure (MPIPPS) was developed for packaging high-performance modules of power electronics building blocks (PEBB). The new concept implemented direct bonding of copper posts, not wire bonding of fine aluminum wires, to interconnect power devices as well as joining the different circuit planes together. We have demonstrated the feasibility of this packaging approach by constructing PEBB modules (consisting of Insulated Gate Bipolar Transistors (IGBTs), diodes, and a few gate driver elements and passive components). In the 1st phase of module fabrication with IGBTs with Si3N 4 passivation, we had successfully fabricated packaged devices and modules using the MPIPPS technique. These modules were tested electrically and thermally, and they operated at pulse-switch and high power stages up to 6kW. However, in the 2nd phase of module fabrication with polyimide passivated devices, we experienced significant yield problems due to metallization difficulties of these devices. The under-bump metallurgy scheme for the development of a solderable interface involved sputtering of Ti-Ni-Cu and Cr-Cu, and an electroless deposition of Zn-Ni-Au metallization. The metallization process produced excellent yield in the case of Si3N4 passivated devices. However, under the same metallization schemes, devices with a polyimide passivation exhibited inconsistent electrical contact resistance. We found that organic contaminants such as hydrocarbons remain in the form of thin monolayers on the surface, even in the case of as-received devices from the manufacturer. Moreover, in the case of polyimide passivated devices, plasma cleaning introduced a few carbon constituents on the

  9. Effect of the bismuth content on the interface reactions between copper substrate and Sn-Zn-Al-Bi lead-free solder

    Directory of Open Access Journals (Sweden)

    Soares, D.

    2005-12-01

    Full Text Available Because of environmental and health concerns, some alternative solder alloys, named lead-free ones, are being developed. Among them, the Sn-Zn-Al system has been studied and reveals promising properties. In this work the presence of bismuth, in the range of 0-8 wt%, was evaluated in what concerns to the chemical interactions between solder/substrate and the equilibrium phases present at the interface. The phases formed at the interface between the copper substrate and a molten lead-free solder were studied with different time of stage and alloy compositions. The effect of bismuth content on transformation temperatures of a Sn-9Zn-1Al base alloy was studied by Differential Scanning Calorimetry (DSC. For each alloy the solidification range was determined, which is an important characteristic regarding the application of these materials in the electronic industry. Identification of equilibrium phases and their chemical composition evaluation was performed by scanning electron microscopy (SEM/EDS. The interface thickness and chemical composition profiles were also evaluated.

    Debido a las preocupaciones ambientales y sanitarias, se están desarrollando aleaciones alternativas para soldadura sin plomo. Entre ellas se ha estudiado el sistema Sn-Zn-Al, que revela propiedades prometedoras. En este trabajo se evalúa la presencia de bismuto, en el rango de 0 a 8 % en peso, en relación con las interacciones químicas entre soldadura y substrato y con las fases de equilibrio presentes en la superficie de contacto. Se han estudiado las fases formadas en la superficie de contacto entre el substrato de cobre y una soldadura fundida sin plomo en función del tiempo de mantenimiento y de la composición de la aleación. Se ha evaluado el efecto del contenido en bismuto sobre las temperaturas de transformación de una aleación de base Sn-9Zn-1Al mediante Calorimetría de Barrido Diferencial (DSC. Se ha determinado el rango de solidificación para cada

  10. Effects of thermal annealing in the post-reflow process on microstructure, tin crystallography, and impact reliability of Sn–Ag–Cu solder joints

    International Nuclear Information System (INIS)

    Chen, Wen-Lin; Yu, Chi-Yang; Ho, Cheng-Ying; Duh, Jenq-Gong

    2014-01-01

    This study aims to investigate the microstructure, β-Sn crystallography, micro-hardness and impact reliability of both Sn–3.0Ag–0.5Cu/Cu (SAC/Cu) and Sn–3.0Ag–0.5Cu/Ni (SAC/Ni) solder joints under various reflow processes. During the solidification step of the reflow process, solder joints were annealed at 210 °C for 50 s and 100 s, respectively. Network-type precipitations formed within the SAC/Cu joint, while dot-type precipitations distributed within the SAC/Ni joint. With the increase of annealing time, these precipitations grew larger; the interfacial intermetallic compounds (IMCs) became slightly thicker, and the hardness of solder alloys gradually decreased. Electron backscatter diffraction (EBSD) analysis indicates that the β-Sn grain structure depended on the distribution of precipitations. A high speed shear tester was used to evaluate the impact toughness of solder joints. Noteworthily, the short-time annealing can improve the impact reliability of solder joints. After annealing for 50 s, the average impact toughness of both SAC/Cu and SAC/Ni solder joints was enhanced, and the percentage of ductile fracture increased significantly. However, the growth of (Cu,Ni) 6 Sn 5 at the SAC/Ni interface degraded the impact toughness as the SAC/Ni joint was annealed for 100 s. The variation of impact toughness in SAC/Cu and SAC/Ni is correlated to the variation of microstructure and hardness in solder joints

  11. Environmental factors and uptake of cadmium among brazers using cadmium-containing hard solders.

    Science.gov (United States)

    Lundberg, I; Sjögren, B; Hallne, U; Hedström, L; Holgersson, M

    1984-06-01

    The influence of different work factors on the uptake of cadmium has been studied in 102 brazers working at least 10% of their work day with cadmium-containing hard solders. The blood concentrations of cadmium varied between less than 1 and 113 micrograms/L (less than 9 and 1010 nmol/L). Blood cadmium concentrations were below 10 micrograms/L (89 nmol/L) in 71 brazers and 31 brazers had levels equal to or above that value. The importance of some environmental factors on the blood-level of cadmium was studied with discrimination analysis. The length of the splice was found to be almost the sole determining factor for the cadmium concentration in blood. All brazers working with splices shorter than 2 cm had blood concentrations below 10 micrograms/L, while 87% of the brazers working with splices longer than 10 cm had blood concentrations equal to or above 10 micrograms/L. Other factors like age, sex, exposure time, smoking habit and brazing method were devoid of any measurable importance.

  12. Selective separation of copper over solder alloy from waste printed circuit boards leach solution.

    Science.gov (United States)

    Kavousi, Maryam; Sattari, Anahita; Alamdari, Eskandar Keshavarz; Firozi, Sadegh

    2017-02-01

    The printed circuit boards (PCBs) from electronic waste are important resource, since the PCBs contain precious metals such as gold, copper, tin, silver, platinum and so forth. In addition to the economic point of view, the presence of lead turns this scrap into dangerous to environment. This study was conducted as part of the development of a novel process for selective recovery of copper over tin and lead from printed circuit boards by HBF 4 leaching. In previous study, Copper with solder alloy was associated, simultaneously were leached in HBF 4 solution using hydrogen peroxide as an oxidant at room temperature. The objective of this study is the separation of copper from tin and lead from Fluoroborate media using CP-150 as an extractant. The influence of organic solvent's concentration, pH, temperature and A/O phase ratio was investigated. The possible extraction mechanism and the composition of the extracted species have been determined. The separation factors for these metals using this agent are reported, while efficient methods for separation of Cu (II) from other metal ions are proposed. The treatment of leach liquor for solvent extraction of copper with CP-150 revealed that 20% CP-150 in kerosene, a 30min period of contact time, and a pH of 3 were sufficient for the extraction of Cu(II) and 99.99% copper was recovered from the leached solution. Copyright © 2016. Published by Elsevier Ltd.

  13. Indentation Size Effect on Ag Nanoparticle-Modified Graphene/Sn-Ag-Cu Solders

    Science.gov (United States)

    Xu, L. Y.; Zhang, S. T.; Jing, H. Y.; Wang, L. X.; Wei, J.; Kong, X. C.; Han, Y. D.

    2018-01-01

    This paper presents the results for the indentation size effect (ISE) on the creep stress exponent and hardness of 0.03 wt.% Ag-modified graphene nanosheet Sn-Ag-Cu solder alloys, using constant loading/holding and multi-cycle (CMC) loading methods, respectively. At each maximum load, with increasing indentation depth, the creep exponent first decreased and then increased. At the same strain rate, the stress exponent also showed the same tendency, increasing as the indentation depth (peak load) increased and then decreased. The hardness was measured continuously with increasing indentation depth by the CMC loading method. The hardness did not exhibit a decrease as the indentation depth increased, which differs from the classical description of the ISE. After an initial decrease, the hardness then increased and finally decreased as the indentation depth increased. This study reviews the existing theories and formulations describing ISE with hardening effects. The experimental results fit well with the empirical formulation. The phenomenon of ISE accompanied by hardening effects has been explained physically via the interaction between geometrically necessary dislocations and grain boundaries.

  14. Leaching Studies for Copper and Solder Alloy Recovery from Shredded Particles of Waste Printed Circuit Boards

    Science.gov (United States)

    Kavousi, Maryam; Sattari, Anahita; Alamdari, Eskandar Keshavarz; Fatmehsari, Davoud Haghshenas

    2018-03-01

    Printed circuit boards (PCBs) comprise various metals such as Cu, Sn, and Pb, as well as platinum group metals. The recovery of metals from PCBs is important not only due to the waste treatment but also for recycling of valuable metals. In the present work, the leaching process of Cu, Sn, and Pb from PCBs was studied using fluoroboric acid and hydrogen peroxide as the leaching agent and oxidant, respectively. Pertinent factors including concentration of acid, temperature, liquid-solid ratio, and concentration of oxidizing agent were evaluated. The results showed 99 pct of copper and 90 pct solder alloy were dissolved at a temperature of 298 K (25 °C) for 180 minutes using 0.6 M HBF4 for the particle size range of 0.15 to 0.4 mm. Moreover, solid/liquid ratio had insignificant effect on the recovery of metals. Kinetics analysis revealed that the chemical control regime governs the process with activation energy 41.25 and 38.9 kJ/mol for copper and lead leaching reactions, respectively.

  15. Occupational exposure to dioxins by thermal oxygen cutting, welding, and soldering of metals.

    Science.gov (United States)

    Menzel, H M; Bolm-Audorff, U; Turcer, E; Bienfait, H G; Albracht, G; Walter, D; Emmel, C; Knecht, U; Päpke, O

    1998-04-01

    This paper focuses on one aspect of occupational dioxin exposure that is novel and unexpected. Exposures in excess of the German threshold limit value of 50 pg international toxicity equivalent (I-TEQ)/m3 are very frequent, unpredictable, and sometimes very high--up to 6612 pg I-TEQ/m3--during thermal oxygen cutting at scrap metal and demolition sites. The same procedure involving virgin steel in steel trade and mass production of steel objects gave no such evidence, even though no final conclusions can be drawn because of the low number of samples analyzed. Low dioxin exposures during inert gas electric arc welding confirm previous literature findings, whereas soldering and thermal oxygen cutting in the presence of polyvinyl chloride give rise to concern. The consequences of occupational dioxin exposure were studied by analysis of the dioxin-blood concentration, the body burden, of men performing thermal oxygen cutting at scrap metal reclamation and demolition sites, in steel trade and producing plants as well as for industrial welders and white-collar workers. The results concerning body burdens are in excellent agreement with the dioxin exposure as characterized by dioxin air concentration in the workplace. The significant positive correlation between duration and frequency of performing thermal oxygen cutting at metal reclamation and demolition sites expressed in job-years and dioxin body burden speaks for the occupational origin of the observed overload after long times. The results reported here lead to consequences for occupational health, which are discussed and require immediate attention.

  16. Inductive Soldering of the Junctions of the Main Superconducting Busbars of the LHC

    CERN Document Server

    Jacquemod, A; Schauf, F; Skoczen, Blazej; Tock, J P

    2004-01-01

    The Large Hadron Collider (LHC) is the next world-facility for the high energy physics community, presently under construction at CERN, Geneva. The LHC will bring into collisions intense beams of protons and ions. The main components of the LHC are the twin-aperture high-field superconducting cryomagnets that will be installed in the existing 26.7-km long tunnel. They are powered in series by superconducting Nb-Ti cables. Along the machine, about 60 000 joints between superconducting cables must be realised in-situ during the installation. Ten thousands of them, rated at 13 000 A, are involved in the powering scheme of the main dipoles and quadrupoles. To meet the requirements of the cryogenic budget, an electrical resistance at operating temperature (1.9 K) lower than 0.6 nW has to be achieved. The induction soldering technology was selected for this purpose. After a brief introduction to the LHC project, the constraints and requirements are listed. Then, the applied solution is detailed. The splices of the ...

  17. Mechanical Fracturing of Core-Shell Undercooled Metal Particles for Heat-Free Soldering

    Science.gov (United States)

    Çınar, Simge; Tevis, Ian D.; Chen, Jiahao; Thuo, Martin

    2016-02-01

    Phase-change materials, such as meta-stable undercooled (supercooled) liquids, have been widely recognized as a suitable route for complex fabrication and engineering. Despite comprehensive studies on the undercooling phenomenon, little progress has been made in the use of undercooled metals, primarily due to low yields and poor stability. This paper reports the use of an extension of droplet emulsion technique (SLICE) to produce undercooled core-shell particles of structure; metal/oxide shell-acetate (‘/’ = physisorbed, ‘-’ = chemisorbed), from molten Field’s metal (Bi-In-Sn) and Bi-Sn alloys. These particles exhibit stability against solidification at ambient conditions. Besides synthesis, we report the use of these undercooled metal, liquid core-shell, particles for heat free joining and manufacturing at ambient conditions. Our approach incorporates gentle etching and/or fracturing of outer oxide-acetate layers through mechanical stressing or shearing, thus initiating a cascade entailing fluid flow with concomitant deformation, combination/alloying, shaping, and solidification. This simple and low cost technique for soldering and fabrication enables formation of complex shapes and joining at the meso- and micro-scale at ambient conditions without heat or electricity.

  18. Mechanical Fracturing of Core-Shell Undercooled Metal Particles for Heat-Free Soldering.

    Science.gov (United States)

    Çınar, Simge; Tevis, Ian D; Chen, Jiahao; Thuo, Martin

    2016-02-23

    Phase-change materials, such as meta-stable undercooled (supercooled) liquids, have been widely recognized as a suitable route for complex fabrication and engineering. Despite comprehensive studies on the undercooling phenomenon, little progress has been made in the use of undercooled metals, primarily due to low yields and poor stability. This paper reports the use of an extension of droplet emulsion technique (SLICE) to produce undercooled core-shell particles of structure; metal/oxide shell-acetate ('/' = physisorbed, '-' = chemisorbed), from molten Field's metal (Bi-In-Sn) and Bi-Sn alloys. These particles exhibit stability against solidification at ambient conditions. Besides synthesis, we report the use of these undercooled metal, liquid core-shell, particles for heat free joining and manufacturing at ambient conditions. Our approach incorporates gentle etching and/or fracturing of outer oxide-acetate layers through mechanical stressing or shearing, thus initiating a cascade entailing fluid flow with concomitant deformation, combination/alloying, shaping, and solidification. This simple and low cost technique for soldering and fabrication enables formation of complex shapes and joining at the meso- and micro-scale at ambient conditions without heat or electricity.

  19. Electoral Systems and Candidate Selection

    NARCIS (Netherlands)

    Hazan, Reuven Y.; Voerman, Gerrit

    Electoral systems at the national level and candidate selection methods at the party level are connected, maybe not causally but they do influence each other. More precisely, the electoral system constrains and conditions the parties' menu of choices concerning candidate selection. Moreover, in

  20. SU-B-213-00: Education Council Symposium: Accreditation and Certification: Establishing Educational Standards and Evaluating Candidates Based on these Standards

    Energy Technology Data Exchange (ETDEWEB)

    NONE

    2015-06-15

    The North American medical physics community validates the education received by medical physicists and the clinical qualifications for medical physicists through accreditation of educational programs and certification of medical physicists. Medical physics educational programs (graduate education and residency education) are accredited by the Commission on Accreditation of Medical Physics Education Programs (CAMPEP), whereas medical physicists are certified by several organizations, the most familiar of which is the American Board of Radiology (ABR). In order for an educational program to become accredited or a medical physicist to become certified, the applicant must meet certain specified standards set by the appropriate organization. In this Symposium, representatives from both CAMPEP and the ABR will describe the process by which standards are established as well as the process by which qualifications of candidates for accreditation or certification are shown to be compliant with these standards. The Symposium will conclude with a panel discussion. Learning Objectives: Recognize the difference between accreditation of an educational program and certification of an individual Identify the two organizations primarily responsible for these tasks Describe the development of educational standards Describe the process by which examination questions are developed GS is Executive Secretary of CAMPEP.

  1. SU-B-213-00: Education Council Symposium: Accreditation and Certification: Establishing Educational Standards and Evaluating Candidates Based on these Standards

    International Nuclear Information System (INIS)

    2015-01-01

    The North American medical physics community validates the education received by medical physicists and the clinical qualifications for medical physicists through accreditation of educational programs and certification of medical physicists. Medical physics educational programs (graduate education and residency education) are accredited by the Commission on Accreditation of Medical Physics Education Programs (CAMPEP), whereas medical physicists are certified by several organizations, the most familiar of which is the American Board of Radiology (ABR). In order for an educational program to become accredited or a medical physicist to become certified, the applicant must meet certain specified standards set by the appropriate organization. In this Symposium, representatives from both CAMPEP and the ABR will describe the process by which standards are established as well as the process by which qualifications of candidates for accreditation or certification are shown to be compliant with these standards. The Symposium will conclude with a panel discussion. Learning Objectives: Recognize the difference between accreditation of an educational program and certification of an individual Identify the two organizations primarily responsible for these tasks Describe the development of educational standards Describe the process by which examination questions are developed GS is Executive Secretary of CAMPEP

  2. Query by image example: The CANDID approach

    Energy Technology Data Exchange (ETDEWEB)

    Kelly, P.M.; Cannon, M. [Los Alamos National Lab., NM (United States). Computer Research and Applications Group; Hush, D.R. [Univ. of New Mexico, Albuquerque, NM (United States). Dept. of Electrical and Computer Engineering

    1995-02-01

    CANDID (Comparison Algorithm for Navigating Digital Image Databases) was developed to enable content-based retrieval of digital imagery from large databases using a query-by-example methodology. A user provides an example image to the system, and images in the database that are similar to that example are retrieved. The development of CANDID was inspired by the N-gram approach to document fingerprinting, where a ``global signature`` is computed for every document in a database and these signatures are compared to one another to determine the similarity between any two documents. CANDID computes a global signature for every image in a database, where the signature is derived from various image features such as localized texture, shape, or color information. A distance between probability density functions of feature vectors is then used to compare signatures. In this paper, the authors present CANDID and highlight two results from their current research: subtracting a ``background`` signature from every signature in a database in an attempt to improve system performance when using inner-product similarity measures, and visualizing the contribution of individual pixels in the matching process. These ideas are applicable to any histogram-based comparison technique.

  3. Democratic candidates call for change in the health care system: wider use of home and community-based care, chronic disease management, universal coverage, and greater use of telehealth.

    Science.gov (United States)

    Marsh, Aaron G

    2008-10-01

    Senator Barack Obama, the Democratic candidate for president, and Senator Joe Biden, the party's candidate for vice president, have made health care reform a central pillar of their campaign. The Democrats want to target the 12 percent of Americans who are responsible for 69 percent of health care costs. Such individuals generally have multiple and complex health care problems, which if left untreated, require them to seek care in hospital emergency rooms which are vastly overcrowded. In order to solve the problem, they believe first that universal coverage along the lines of the Federal Government Employees' health plan is necessary, followed by a shift away from institutionally-based care, making home and community-based care, which integrates telehealth and other technologies, the norm. The party's platform includes this committment to help solve the problem of long-term care, which affects not only the nation's 35 million elderly, but increasingly will affect the 78 million baby boomers who are entering their retirement years.

  4. Influence of Poly(ethylene glycol) Degradation on Voiding Sporadically Occurring in Solder Joints with Electroplated Cu

    Science.gov (United States)

    Wafula, F.; Yin, L.; Borgesen, P.; Andala, D.; Dimitrov, N.

    2012-07-01

    This paper presents a comprehensive study of the effect of poly(ethylene glycol) (PEG) degradation on the void formation known to take place sporadically at the interface between electroplated Cu and Pb-free solder. Thorough chemical analysis of our plating solution, carried out at different times of the deposition process by matrix-assisted laser desorption ionization time-of-flight mass spectroscopy, reveals a dramatic shift in the peaks to lower mass range with time. Scanning electron microscopy cross-sectional images of solder joints with Cu samples that have been plated at different times in the course of solution aging show a decrease in void formation. A decreasing magnitude of the deposition overpotential also seen during aging suggests that, breaking down to lower-molecular-weight fragments, PEG loses its suppression effect and likely has lower impact on the voiding propensity. This indirect correlation is confirmed further by the use of plating solutions containing PEG with preselected molecular weight. We also report on the effect of the surface area-to-solution volume ratio on PEG degradation studied by comparative experiments performed in a 50-mL bath with a rotating disc electrode and in a larger cell (Hull cell) with volume of 267 mL. The results show that, at fixed charge per unit volume, PEG degrades at a greatly accelerated rate in the Hull cell featuring higher electrode surface-to-solution volume ratio. Analysis of solder joints with accordingly grown Cu layers suggests that the voiding decreases faster with the accelerated rate of PEG degradation.

  5. Size and constraint effects on mechanical and fracture behavior of micro-scale Ni/Sn3.0Ag0.5Cu/Ni solder joints

    Energy Technology Data Exchange (ETDEWEB)

    Qin, H.B. [School of Materials Science and Engineering, South China University of Technology, Guangzhou 510640 (China); Zhang, X.P., E-mail: mexzhang@scut.edu.cn [School of Materials Science and Engineering, South China University of Technology, Guangzhou 510640 (China); Zhou, M.B.; Zeng, J.B. [School of Materials Science and Engineering, South China University of Technology, Guangzhou 510640 (China); Mai, Y.-W. [Centre for Advanced Materials Technology (CAMT), School of Aerospace, Mechanical and Mechatronic Engineering J07, The University of Sydney, NSW 2006 (Australia)

    2014-11-03

    Solder joints are generally regarded as the weakest part in packaging systems and electronic assemblies in modern electronic products and devices. In this study, both experimental and finite element methods were used to characterize the mechanical behavior of micro-scale Ni/Sn3.0Ag0.5Cu/Ni sandwich-structured joints with different thickness-to-diameter ratios (R varying from 1/3 to 1/12) under quasi-static tension loading using a dynamic mechanical analyzer (DMA). Experimental results show that crack initiation and propagation in the solder matrix occur in a typical ductile manner. Compared with Cu/Sn3.0Ag0.5Cu/Cu sandwich-structured solder joints, Ni/Sn3.0Ag0.5Cu/Ni solder joints have much higher tensile strengths due to the dispersion strengthening effect through the fine Ag{sub 3}Sn particles. With decreasing R, both stiffness and tensile strength of solder joints increase obviously with decreasing coefficient of stress state and damage equivalent stress. Moreover, results of quantitative fractographic analysis by SEM and EDS display three fracture modes with decreasing R. Joints with R≥1/4 all fail by ductile fracture, those with R=1/6 fail by either ductile fracture or mixed ductile and brittle fractures, and for joints with R=1/12, brittle fracture is dominant. Furthermore, results obtained have also shown that the crack growth driving forces, K{sub I} and K{sub II}, as well as the strain energy release rate, G{sub I}, in the Ni{sub 3}Sn{sub 4} layer and at the Ni{sub 3}Sn{sub 4}/Ni interface, increase significantly with decreasing R. Hence, under tensile loading the fracture mode of solder joints changes from ductile to brittle as R is decreased.

  6. Thermal analysis of selected tin-based lead-free solder alloys

    DEFF Research Database (Denmark)

    Palcut, Marián; Sopoušek, J.; Trnková, L.

    2009-01-01

    ) and thermodynamic calculations using the CALPHAD approach. The amount of the alloying elements in the materials was chosen to be close to the respective eutectic composition and the nominal compositions were the following: Sn-3.7Ag-0.7Cu, Sn-1.0Ag-0.5Cu-1Bi (in wt.%). Thermal effects during melting and solidifying...

  7. Pyrosequencing-based assessment of the bacteria diversity in surface and subsurface peat layers of a northern wetland, with focus on poorly studied phyla and candidate divisions.

    Directory of Open Access Journals (Sweden)

    Yulia M Serkebaeva

    Full Text Available Northern peatlands play a key role in the global carbon and water budget, but the bacterial diversity in these ecosystems remains poorly described. Here, we compared the bacterial community composition in the surface (0-5 cm depth and subsurface (45-50 cm peat layers of an acidic (pH 4.0 Sphagnum-dominated wetland, using pyrosequencing of 16S rRNA genes. The denoised sequences (37,229 reads, average length ∼430 bp were affiliated with 27 bacterial phyla and corresponded to 1,269 operational taxonomic units (OTUs determined at 97% sequence identity. Abundant OTUs were affiliated with the Acidobacteria (35.5±2.4% and 39.2±1.2% of all classified sequences in surface and subsurface peat, respectively, Alphaproteobacteria (15.9±1.7% and 25.8±1.4%, Actinobacteria (9.5±2.0% and 10.7±0.5%, Verrucomicrobia (8.5±1.4% and 0.6±0.2%, Planctomycetes (5.8±0.4% and 9.7±0.6%, Deltaproteobacteria (7.1±0.4% and 4.4%±0.3%, and Gammaproteobacteria (6.6±0.4% and 2.1±0.1%. The taxonomic patterns of the abundant OTUs were uniform across all the subsamples taken from each peat layer. In contrast, the taxonomic patterns of rare OTUs were different from those of the abundant OTUs and varied greatly among subsamples, in both surface and subsurface peat. In addition to the bacterial taxa listed above, rare OTUs represented the following groups: Armatimonadetes, Bacteroidetes, Chlamydia, Chloroflexi, Cyanobacteria, Elusimicrobia, Fibrobacteres, Firmicutes, Gemmatimonadetes, Spirochaetes, AD3, WS1, WS4, WS5, WYO, OD1, OP3, BRC1, TM6, TM7, WPS-2, and FCPU426. OTU richness was notably higher in the surface layer (882 OTUs than in the anoxic subsurface peat (483 OTUs, with only 96 OTUs common to both data sets. Most members of poorly studied phyla, such as the Acidobacteria, Verrucomicrobia, Planctomycetes and the candidate division TM6, showed a clear preference for growth in either oxic or anoxic conditions. Apparently, the bacterial communities in surface and

  8. Study of 3D solder-paste profilometer by dual digital fringe projection

    Science.gov (United States)

    Juan, Yi-Hua; Yih, Jeng-Nan; Cheng, Nai-Jen

    2013-09-01

    In a 3D profilometer by the fringe projection, the shadow will be produced inevitably, thus the fringes cannot be detected in the region of the shadow. In addition, a smooth surface or a metal surface produces the specular reflection, and then, no projection fringe can be recorded in the region of oversaturation on CCD. This paper reveals a proposed system for improved these defects and shows some preliminary improved 3D profiles by the proposed dual fringe projection. To obtain the profile of sample hided in the shadow and the oversaturation, this study used the dual-projection system by two projectors. This system adopted two different directions of fringe projection and illuminates them alternately, therefore, the shadow and the oversaturation produced in their corresponding locations. Two raw 3D profiles obtained from taking the dual-projection by the four-step phase-shift. A set of algorithms used to identify the pixels of the shadow and the oversaturation, and create an error-map. According to the error-map to compensate, two 3D profiles merged into an error-reduced 3D profile. We used the solder paste as a testing sample. After comparatively analyzing the 3D images obtained by our measurement system and by a contact stylus profilometer, the result shows that our measurement system can effectively reduce the error caused by shadows and oversaturation. Fringe projection system by using a projector is a non-contact, full field and quickly measuring system. The proposed dual-projection by dual-projectors can effectively reduce the shadow and the oversaturation errors and enhance the scope of application of the 3D contour detection, especially in the detection of precision structure parts with specular reflection.

  9. Influence of Activated Carbon Particles on Intermetallic Compound Growth Mechanism in Sn-Cu-Ni Composite Solder

    Directory of Open Access Journals (Sweden)

    Ramli M.I.I.

    2016-01-01

    Full Text Available The influence of Activated Carbon (AC particles on mechanical properties of Sn-Cu-Ni-xAC solder joint was investigated. Five different Activated Carbon (AC percentage addition (0 wt. %, 0.25 wt. %, 0.5 wt. %, 0.75 wt. %, and 1.0 wt. % were prepared via powder metallurgy (PM technique. Interfacial IMC thickness measurement and shear strength results showed that with thinner IMC layer (by increasing amount of wt.% of AC, the higher the shear strength of the joint. It is believed that the AC particles suppresses the interfacial IMC growth and thus improves the shear strength.

  10. Evaluation of a Bacillus direct-fed microbial candidate on digesta viscosity, bacterial translocation, microbiota composition and bone mineralisation in broiler chickens fed on a rye-based diet.

    Science.gov (United States)

    Latorre, J D; Hernandez-Velasco, X; Bielke, L R; Vicente, J L; Wolfenden, R; Menconi, A; Hargis, B M; Tellez, G

    2015-01-01

    1. The effects of the dietary inclusion of a Bacillus-based direct-fed microbial (DFM) candidate on digesta viscosity, bacterial translocation, microbiota composition and bone mineralisation were evaluated in broilers consuming rye-based diets. 2. In the present study, control mash rye-based diets (CON) or Bacillus-DFM supplemented diets (TRT) were administered ad libitum to male broilers in three independent experiments. 3. In Experiments 1 and 2 (n = 25/group), liver samples were taken to evaluate bacterial translocation, digesta samples were used for viscosity measurements and the intestinal microbial flora was evaluated from different intestinal sections to enumerate total recovered gram-negative bacteria (TGB), lactic acid bacteria (LAB) and anaerobic bacteria (TAB). Additionally, both tibias were removed for assessment of bone quality. 4. In Experiment 3, each experimental group had 8 replicates of 20 chickens (n = 160/group). Weekly, body weight (BW), feed intake (FI) and feed conversion ratio (FCR) were evaluated. At d 28-of-age, samples were taken to determine bacterial translocation, digesta viscosity and bone quality characteristics. 5. In all experiments, consumption of Bacillus-DFM reduced bacterial translocation to the liver and digesta viscosity. Additionally, DFM supplementation improved BW, bone quality measurements and FCR. Moreover, chickens fed on the Bacillus-DFM diet in Experiments 1 and 2 showed a significant reduction in the number of gram-negative and anaerobic bacteria in the duodenal content compared to control. 6. In summary, chickens fed on a rye-based diet without DFM inclusion showed an increase in bacterial translocation and digesta viscosity, accompanied by reduced performance and bone quality variables relative to the Bacillus-DFM candidate group. Hence, incorporation into the feed of a selected DFM ameliorated the adverse anti-nutritional effects related to utilisation of rye-based diets in broilers chickens.

  11. Solder Flux Residues and Humidity-Related Failures in Electronics: Relative Effects of Weak Organic Acids Used in No-Clean Flux Systems

    DEFF Research Database (Denmark)

    Verdingovas, Vadimas; Jellesen, Morten Stendahl; Ambat, Rajan

    2015-01-01

    This paper presents the results of humidity testing of weak organic acids (WOAs), namely adipic, succinic, glutaric, dl-malic, and palmitic acids, which are commonly used as activators in no-clean solder fluxes. The study was performed under humidity conditions varying from 60% relative humidity...... increase of leakage currents and probability of electrochemical migration was observed at humidity levels above the RH corresponding to the deliquescence point of WOAs present as contaminants on the printed circuit boards. The results suggest that use of solder fluxes with WOAs having higher deliquescence...

  12. Specific memory B cell response and participation of CD4+central and effector memory T cells in mice immunized with liposome encapsulated recombinant NE protein based Hepatitis E vaccine candidate.

    Science.gov (United States)

    Kulkarni, Shruti P; Thanapati, Subrat; Arankalle, Vidya A; Tripathy, Anuradha S

    2016-11-21

    Liposome encapsulated neutralizing epitope protein of Hepatitis E virus (HEV), rNEp, our Hepatitis E vaccine candidate, was shown to be immunogenic and safe in pregnant and non-pregnant mice and yielded sterilizing immunity in rhesus monkeys. The current study in Balb/c mice assessed the levels and persistence of anti-HEV IgG antibodies by ELISA, frequencies of B, memory B, T and memory T cells by flow cytometry and HEV-specific IgG secreting memory B cells by ELISPOT till 420days post immunization (PI) with 5?g rNEp encapsulated in liposome based adjuvant (2 doses, 4weeks apart). Mice immunized with a lower dose (1?g) were assessed only for anamnestic response post booster dose. Vaccine candidate immunized mice (5?g dose) elicited strong anti-HEV IgG response that was estimated to persist for lifetime. At day 120 PI, frequency of memory B cells was higher in immunized mice than those receiving adjuvant alone. Anti-HEV IgG titers were lower in mice immunized with 1?g dose. A booster dose yielded a heightened antibody response in mice with both high (>800GMT, 5?g) and low (?100GMT, 1?g) anti-HEV IgG titers. At day 6th post booster dose, HEV-specific antibody secreting plasma cells (ASCs) were detected in 100% and 50% of mice with high and low anti-HEV IgG titers, respectively, whereas the frequencies of CD4 + central and effector memory T cells were high in mice with high anti-HEV IgG titers only. Taken together, the vaccine candidate effectively generates persistent and anamnestic antibody response, elicits participation of CD4 + memory T cells and triggers memory B cells to differentiate into ASCs upon boosting. This approach of assessing the immunogenicity of vaccine candidate could be useful to explore the longevity of HEV-specific memory response in future HEV vaccine trials in human. Copyright © 2016. Published by Elsevier Ltd.

  13. Nutritional Status of Bariatric Surgery Candidates

    OpenAIRE

    Aliaa Al-Mutawa; Alfred Kojo Anderson; Salman Alsabah; Mohammad Al-Mutawa

    2018-01-01

    Obesity is a global epidemic affecting populations globally. Bariatric surgery is an effective treatment for morbid obesity, and has increased dramatically. Bariatric surgery candidates frequently have pre-existing nutritional deficiencies that might exacerbate post-surgery. To provide better health care management pre- and post-bariatric surgery, it is imperative to establish the nutritional status of prospective patients before surgery. The aim of this study was to assess and provide baseli...

  14. Problem-Based Learning and the Training of Secondary Social Studies Teachers: A Case Study of Candidate Perceptions during Their Field Experience

    Science.gov (United States)

    Wynn, Charles T., Sr.; Okie, William

    2017-01-01

    We present results of a case study in which we analyzed the impact of problem-based learning (PBL) and cognitive scaffolding techniques introduced in our secondary social studies methods course on the perceptions and practices of 12 preservice teachers (PSTs) during their fall practicum and spring student teaching. Our PSTs reported teaching 54…

  15. Microstructure and adhesion strength of Sn-9Zn-xAg lead-free solders wetted on Cu substrate

    International Nuclear Information System (INIS)

    Chang, T.-C.; Chou, S.-M.; Hon, M.-H.; Wang, M.-C.

    2006-01-01

    The microstructure and adhesion strength of the Sn-9Zn-xAg lead-free solders wetted on Cu substrates have been investigated by differential scanning calorimetry, optical microscopy, scanning electron microscopy, energy dispersive spectrometry and pull-off testing. The liquidus temperatures of the Sn-9Zn-xAg solder alloys are 222.1, 226.7, 231.4 and 232.9 deg. C for x = 2.5, 3.5, 5.0 and 7.5 wt%, respectively. A flat interface can be obtained as wetted at 350 deg. C at a rate of 11.8 mm/s. The adhesion strength of the Sn-9Zn-xAg/Cu interfaces decreases from 23.09 ± 0.31 to 12.32 ± 1.40 MPa with increasing Ag content from 2.5 to 7.5 wt% at 400 deg. C. After heat treatment at 150 deg. C, the adhesion strength of the Sn-9Zn-xAg/Cu interface decreases with increasing aging time

  16. Impact of Fe powder sintering and soldering in production of porous heating surface on flow boiling heat transfer in minichannels

    Science.gov (United States)

    Depczyński, Wojciech; Piasecki, Artur; Piasecka, Magdalena; Strąk, Kinga

    2017-10-01

    This paper focuses on identification of the impact of porous heated surface on flow boiling heat transfer in a rectangular minichannel. The heated element for Fluorinert FC-72 was a thin plate made of Haynes-230. Infrared thermography was used to determine changes in the temperature on its outer smooth side. The porous surface in contact with the fluid in the minichannel was produced in two processes: sintering or soldering of Fe powder to the plate. The results were presented as relationships between the heat transfer coefficient and the distance from the minichannel inlet and as boiling curves. Results obtained for using a smooth heated plate at the saturated boiling region were also presented to compare. In the subcooled boiling region, at a higher heat flux, the heat transfer coefficient was slightly higher for the surface prepared via soldering. In the saturated boiling region, the local heat transfer coefficients obtained for the smooth plate surface were slightly higher than those achieved from the sintered plate surface. The porous structures formed have low thermal conductivity. This may induce noticeable thermal resistance at the diffusion bridges of the sintered structures, in particular within the saturated boiling region.

  17. Systematic exploration of a class of hydrophobic unnatural base pairs yields multiple new candidates for the expansion of the genetic alphabet

    Czech Academy of Sciences Publication Activity Database

    Dhami, K.; Malyshev, D. A.; Ordoukhanian, P.; Kubelka, Tomáš; Hocek, Michal; Romesberg, F. E.

    2014-01-01

    Roč. 42, č. 16 (2014), s. 10235-10244 ISSN 0305-1048 R&D Projects: GA ČR GBP206/12/G151 Institutional support: RVO:61388963 Keywords : unnatural base pairs * DNA * dTPT3-dNaM Subject RIV: CE - Biochemistry Impact factor: 9.112, year: 2014 http://nar.oxfordjournals.org/content/42/16/10235

  18. Transit timing observations from Kepler. V. Transit timing variation candidates in the first sixteen months from polynomial models

    DEFF Research Database (Denmark)

    Ford, E.B.; Ragozzine, D.; Holman, M.J.

    2012-01-01

    Transit timing variations provide a powerful tool for confirming and characterizing transiting planets, as well as detecting non-transiting planets. We report the results of an updated transit timing variation (TTV) analysis for 1481 planet candidates based on transit times measured during...... find that the occurrence rate of planet candidates that show TTVs is significantly increased (~68%) for planet candidates transiting stars with multiple transiting planet candidates when compared to planet candidates transiting stars with a single transiting planet candidate....

  19. Large area photonic flash soldering of thin chips on flex foils for flexible electronic systems: In situ temperature measurements and thermal modelling

    NARCIS (Netherlands)

    Ende, D.A. van den; Hendriks, R.; Cauchois, R.; Groen, W.A.

    2014-01-01

    In this work photonic energy from a high power xenon flash lamp is used for soldering thin chips on polyimide and polyester foil substrates using standard Sn-Ag-Cu lead free alloys. The absorption of the xenon light pulse leads to rapid heating of components and tracks up to temperatures above the

  20. Assessment of the effects of the Japanese shift to lead-free solders and its impact on material substitution and environmental emissions by a dynamic material flow analysis.

    Science.gov (United States)

    Fuse, Masaaki; Tsunemi, Kiyotaka

    2012-11-01

    Lead-free electronics has been extensively studied, whereas their adoption by society and their impact on material substitution and environmental emissions are not well understood. Through a material flow analysis (MFA), this paper explores the life cycle flows for solder-containing metals in Japan, which leads the world in the shift to lead-free solders in electronics. The results indicate that the shift has been progressing rapidly for a decade, and that substitutes for lead in solders, which include silver and copper, are still in the early life cycle stages. The results also show, however, that such substitution slows down during the late life cycle stages owing to long electronic product lifespans. This deceleration of material substitution in the solder life cycle may not only preclude a reduction in lead emissions to air but also accelerate an increase in silver emissions to air and water. As an effective measure against ongoing lead emissions, our scenario analysis suggests an aggressive recycling program for printed circuit boards that utilizes an existing recycling scheme. Copyright © 2012 Elsevier B.V. All rights reserved.