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Sample records for based solder candidates

  1. Development of gold based solder candidates for flip chip assembly

    DEFF Research Database (Denmark)

    Chidambaram, Vivek; Hald, John; Hattel, Jesper Henri

    2009-01-01

    Flip chip technology is now rapidly replacing the traditional wire bonding interconnection technology in the first level packaging applications due to the miniaturization drive in the microelectronics industry. Flip chip assembly currently involves the use of high lead containing solders...

  2. Au-Ge based Candidate Alloys for High-Temperature Lead-Free Solder Alternatives

    DEFF Research Database (Denmark)

    Chidambaram, Vivek; Hald, John; Hattel, Jesper Henri

    2009-01-01

    Au-Ge based candidate alloys have been proposed as an alternative to high-lead content solders that are currently being used for high-temperature applications. The influence of the low melting point metals namely In, Sb and Sn to the Au-Ge eutectic with respect to the microstructure and microhard......Au-Ge based candidate alloys have been proposed as an alternative to high-lead content solders that are currently being used for high-temperature applications. The influence of the low melting point metals namely In, Sb and Sn to the Au-Ge eutectic with respect to the microstructure...... was primarily strengthened by the refined (Ge) dispersed phase. The distribution of phases played a relatively more crucial role in determining the ductility of the bulk solder alloy. In the present work it was found that among the low melting point metals, the addition of Sb to the Au-Ge eutectic would...

  3. Development of Au-Ge based candidate alloys as an alternative to high-lead content solders

    DEFF Research Database (Denmark)

    Chidambaram, Vivek; Hald, John; Hattel, Jesper Henri

    2010-01-01

    Au-Ge based candidate alloys have been proposed as an alternative to high-lead content solders that are currently being used for high-temperature applications. The changes in microstructure and microhardness associated with the addition of low melting point metals namely In, Sb and Sn to the Au......-Ge-In and Au-Ge-Sn combinations was determined to be the classic solid solution strengthening. The Au-Ge-Sb combination was primarily strengthened by the refined (Ge) dispersed phase. The aging temperature had a significant influence on the microhardness in the case of the Au-Ge-Sn candidate alloy...

  4. Assessment of potential solder candidates for high temperature applications

    DEFF Research Database (Denmark)

    pressure to eliminate lead containing materials despite the fact that materials for high Pb containing alloys are currently not affected by any legislations. A tentative assessment was carried out to determine the potential solder candidates for high temperature applications based on the solidification...... criterion, phases predicted in the bulk solder and the thermodynamic stability of chlorides. These promising solder candidates were precisely produced using the hot stage microscope and its respective anodic and cathodic polarization curves were investigated using a micro-electrochemical set up...

  5. A Corrosion Investigation of Solder Candidates for High-Temperature Applications

    DEFF Research Database (Denmark)

    Chidambaram, Vivek; Hald, John; Ambat, Rajan

    2009-01-01

    The step soldering approach is being employed in the Multi-Chip module (MCM) technology. High lead containing alloys is one of the solders currently being used in this approach. Au-Sn and Au-Ge based candidate alloys have been proposed as alternative solders for this application. In this work...

  6. Design of lead-free candidate alloys for high-temperature soldering based on the Au–Sn system

    DEFF Research Database (Denmark)

    Chidambaram, Vivek; Hattel, Jesper Henri; Hald, John

    2010-01-01

    of the Au–Sn binary system were explored in this work. Furthermore, the effects of thermal aging on the microstructure and microhardness of these promising Au–Sn based ternary alloys were investigated. For this purpose, the candidate alloys were aged at a lower temperature, 150°C for up to 1week...

  7. Solderability study of RABiTS-based YBCO coated conductors

    International Nuclear Information System (INIS)

    Zhang Yifei; Duckworth, Robert C.; Ha, Tam T.; Gouge, Michael J.

    2011-01-01

    Study examines the implication of solder and flux selection in YBCO splice joints. Focus is on commercially available RABiTS-based YBCO coated conductors. Solderability varied with solder and flux for three different stabilizations tested. Resistivity of stabilizer was dominant factor in splice joint resistance. Solder materials affected splice joint resistance when solderability was poor. The solderability of commercially available YBa 2 Cu 3 O 7-x (YBCO) coated conductors that were made from Rolling Assisted Biaxially Textured Substrates (RABiTS)-based templates was studied. The coated conductors, also known as second-generation (2G) high temperature superconductor (HTS) wires (in the geometry of flat tapes about 4 mm wide), were laminated with copper, brass, or stainless steel strips as stabilizers. To understand the factors that influence their solderability, surface profilometry and scanning electron microscopy were used to characterize the wire surfaces. The solderability of three solders, 52In48Sn, 67Bi33In, and 100In (wt.%), was evaluated using a standard test (IPC/ECA J-STD-002) and with two different commercial fluxes. It was found that the solderability varied with the solder and flux but the three different wires showed similar solderability for a fixed combination of solder and flux. Solder joints of the 2G wires were fabricated using the tools and the procedures recommended by the HTS wire manufacturer. The solder joints were made in a lap-joint geometry and with the superconducting sides of the two wires face-to-face. The electrical resistances of the solder joints were measured at 77 K, and the results were analyzed to qualify the soldering materials and evaluate the soldering process. It was concluded that although the selection of soldering materials affected the resistance of a solder joint, the resistivity of the stabilizer was the dominant factor.

  8. Mechanical properties of soldered joints of niobium base alloys

    International Nuclear Information System (INIS)

    Grishin, V.L.

    1980-01-01

    Mechanical properties of soldered joints of niobium alloys widely distributed in industry: VN3, VN4, VN5A, VN5AE, VN5AEP etc., 0.6-1.2 mm thick are investigated. It is found out that the usage of zirconium-vanadium, titanium-tantalum solders for welding niobium base alloys permits to obtain soldered joints with satisfactory mechanical properties at elevated temperatures

  9. Drinking Water Contamination Due To Lead-based Solder

    Science.gov (United States)

    Garcia, N.; Bartelt, E.; Cuff, K. E.

    2004-12-01

    The presence of lead in drinking water creates many health hazards. Exposure to lead-contaminated water can affect the brain, the central nervous system, blood cells, and kidneys, causing such problems as mental retardation, kidney disease, heart disease, stroke, and death. One way in which lead can contaminate our water supply is through the use of lead solder to join pipes. Lead solder was widely used in the past because of its ease of application as well as its low cost. Lead contamination in residential areas has previously been found to be a particularly serious problem in first-draw samples, of water that has sat stagnant in pipes overnight. To investigate the time-dependence of drinking water lead contamination, we analyzed samples taken hourly of water exposed to lead solder. While our preliminary data was insufficient to show more than a rough correlation between time of exposure and lead concentration over short periods (1-3 hours), we were able to confirm that overnight exposure of water to lead-based solder results in the presence high levels of lead. We also investigated other, external factors that previous research has indicated contribute to increased concentrations of lead. Our analysis of samples of lead-exposed water at various pH and temperatures suggests that these factors can be equally significant in terms of their contribution to elevated lead concentration levels. In particular, water that is slightly corrosive appears to severely impact the solubility of lead. As this type of water is common in much of the Northeast United States, the presence of lead-based solder in residential areas there is especially problematic. Although lead-based solder has been banned since the 1980s, it remains a serious concern, and a practical solution still requires further research.

  10. Development of Bi-base high-temperature Pb-free solders with second-phase dispersion: Thermodynamic calculation, microstructure, and interfacial reaction

    Science.gov (United States)

    Takaku, Yoshikazu; Ohnuma, Ikuo; Kainuma, Ryosuke; Yamada, Yasushi; Yagi, Yuji; Nishibe, Yuji; Ishida, Kiyohito

    2006-11-01

    Bismuth and its alloys are candidates for Pb-free high-temperature solders that can be substituted for conventional Pb-rich Pb-Sn solders (melting point (mp) = 573 583 K). However, inferior properties such as brittleness and weak bonding strength should be improved for practical use. To that end, BiCu-X (X=Sb, Sn, and Zn) Pb-free high-temperature solders are proposed. Miscibility gaps in liquid BiCu-X alloys were surveyed using the thermodynamic database ADAMIS (alloy database for micro-solders), and compositions of the BiCu-X solders were designed on the basis of calculation. In-situ composite solders that consist of a Bi-base matrix with fine intermetallic compound (IMC) particles were produced by gas-atomizing and melt-spinning methods. The interfacial reaction between in-situ composite solders and Cu or Ni substrates was investigated. The IMCs at the interface formed a thin, uniform layer, which is an appropriate morphology for a reliable solder joint.

  11. Effects of Metallic Nanoparticles on Interfacial Intermetallic Compounds in Tin-Based Solders for Microelectronic Packaging

    Science.gov (United States)

    Haseeb, A. S. M. A.; Arafat, M. M.; Tay, S. L.; Leong, Y. M.

    2017-10-01

    Tin (Sn)-based solders have established themselves as the main alternative to the traditional lead (Pb)-based solders in many applications. However, the reliability of the Sn-based solders continues to be a concern. In order to make Sn-based solders microstructurally more stable and hence more reliable, researchers are showing great interest in investigating the effects of the incorporation of different nanoparticles into them. This paper gives an overview of the influence of metallic nanoparticles on the characteristics of interfacial intermetallic compounds (IMCs) in Sn-based solder joints on copper substrates during reflow and thermal aging. Nanocomposite solders were prepared by mechanically blending nanoparticles of nickel (Ni), cobalt (Co), zinc (Zn), molybdenum (Mo), manganese (Mn) and titanium (Ti) with Sn-3.8Ag-0.7Cu and Sn-3.5Ag solder pastes. The composite solders were then reflowed and their wetting characteristics and interfacial microstructural evolution were investigated. Through the paste mixing route, Ni, Co, Zn and Mo nanoparticles alter the morphology and thickness of the IMCs in beneficial ways for the performance of solder joints. The thickness of Cu3Sn IMC is decreased with the addition of Ni, Co and Zn nanoparticles. The thickness of total IMC layer is decreased with the addition of Zn and Mo nanoparticles in the solder. The metallic nanoparticles can be divided into two groups. Ni, Co, and Zn nanoparticles undergo reactive dissolution during solder reflow, causing in situ alloying and therefore offering an alternative route of alloy additions to solders. Mo nanoparticles remain intact during reflow and impart their influence as discrete particles. Mechanisms of interactions between different types of metallic nanoparticles and solder are discussed.

  12. Research on Defects Inspection of Solder Balls Based on Eddy Current Pulsed Thermography

    Directory of Open Access Journals (Sweden)

    Xiuyun Zhou

    2015-10-01

    Full Text Available In order to solve tiny defect detection for solder balls in high-density flip-chip, this paper proposed feasibility study on the effect of detectability as well as classification based on eddy current pulsed thermography (ECPT. Specifically, numerical analysis of 3D finite element inductive heat model is generated to investigate disturbance on the temperature field for different kind of defects such as cracks, voids, etc. The temperature variation between defective and non-defective solder balls is monitored for defects identification and classification. Finally, experimental study is carried on the diameter 1mm tiny solder balls by using ECPT and verify the efficacy of the technique.

  13. The Effect of Gap Angle on Tensile Strength of Preceramic Base Metal Solder Joints.

    Science.gov (United States)

    Fattahi, Farnaz; Hashemi Ardakani, Zahra; Hashemi Ardakani, Maryam

    2015-12-01

    Soldering is a process commonly used in fabricating dental prosthesis. Since most soldered prosthesis fail at the solder joints; the joint strength is of utmost importance. The purpose of this study was to evaluate the effect of gap angle on the tensile strength of base metal solder joints. A total number of 40 Ni-Cr samples were fabricated according to ADA/ISO 9693 specifications for tensile test. Samples were cut at the midpoint of the bar, and were placed at the considered angles by employing an explicitly designed device. They were divided into 4 groups regarding the gap angle; Group C (control group) with parallel gap on steady distance of 0.2mm, Group 1: 10°, Group 2: 20°, and Group3: 30° gap angles. When soldered, the specimens were all tested for tensile strength using a universal testing machine at a cross-head speed of 0.5 mm/min with a preload of 10N. Kruskal-Wallis H test was used to compare tensile strength among the groups (ptensile strength values obtained from the study groups were respectively 307.84, 391.50, 365.18, and 368.86 MPa. The tensile strength was not statistically different among the four groups in general (p≤ 0.490). Making the gap angular at the solder joints and the subsequent unsteady increase of the gap distance would not change the tensile strength of the joint.

  14. Effect of gap distance on tensile strength of preceramic base metal solder joints.

    Science.gov (United States)

    Fattahi, Farnaz; Motamedi, Milad

    2011-01-01

    In order to fabricate prostheses with high accuracy and durability, soldering techniques have been introduced to clinical dentistry. However, these prostheses always fail at their solder joints. The purpose of this study was to evaluate the effect of gap distance on the tensile strength of base metal solder joints. Based on ADA/ISO 9693 specifications for tensile test, 40 specimens were fabricated from a Ni-Cr alloy and cut at the midpoint of 3-mm diameter bar and placed at desired positions by a specially designed device. The specimens were divided into four groups of 10 samples according to the desired solder gap distance: Group1: 0.1mm; Group2: 0.25mm; Group3: 0.5mm; and Group4: 0.75mm. After soldering, specimens were tested for tensile strength by a universal testing machine at a cross-head speed of 0.5mm/min with a preload of 10N. The mean tensile strength values of the groups were 162, 307.8, 206.1 and 336.7 MPa, respectively. The group with 0.75-mm gap had the highest and the group with 0.1-mm gap had the lowest tensile strength. Bonferroni test showed that Group1 and Group4 had statistically different values (P=0.023), but the differences between other groups were not sig-nificant at a significance level of 0.05. There was no direct relationship between increasing soldering gap distance and tensile strength of the solder joints.

  15. Soldering handbook

    CERN Document Server

    Vianco, Paul T

    1999-01-01

    Contains information related to soldering processes, and solder joint performance and reliability. Covers soldering fundamentals, technology, materials, substrate materials, fluxes, pastes, assembly processes, inspection, and environment. Covers today's advanced joining applications and emphasizes new materials, including higher strength alloys; predictive performance; computer modeling; advanced inspection techniques; new processing concepts, including laser heating; and the resurgence in ultrasonic soldering.

  16. A flip chip process based on electroplated solder bumps

    Science.gov (United States)

    Salonen, J.; Salmi, J.

    1994-01-01

    Compared to wire bonding and TAB, flip chip technology using solder joints offers the highest pin count and packaging density and superior electrical performance. The chips are mounted upside down on the substrate, which can be made of silicon, ceramic, glass or - in some cases - even PCB. The extra processing steps required for chips are the deposition of a suitable thin film metal layer(s) on the standard Al pad and the formation of bumps. Also, the development of new fine line substrate technologies is required to utilize the full potential of the technology. In our bumping process, bump deposition is done by electroplating, which was chosen for its simplicity and economy. Sputter deposited molybdenum and copper are used as thin film layers between the aluminum pads and the solder bumps. A reason for this choice is that the metals can be selectively etched after bumping using the bumps as a mask, thus circumventing the need for a separate mask for etching the thin film metals. The bumps are electroplated from a binary Pb-Sn bath using a thick liquid photoresist. An extensively modified commercial flip chip bonder is used for alignment and bonding. Heat assisted tack bonding is used to attach the chips to the substrate, and final reflow joining is done without flux in a vacuum furnace.

  17. Microstructural discovery of Al addition on Sn–0.5Cu-based Pb-free solder design

    International Nuclear Information System (INIS)

    Koo, Jahyun; Lee, Changsoo; Hong, Sung Jea; Kim, Keun-Soo; Lee, Hyuck Mo

    2015-01-01

    It is important to develop Pb-free solder alloys suitable for automotive use instead of traditional Sn–Pb solder due to environmental regulations (e.g., Restriction of Hazardous Substances (RoHS)). Al addition has been spotlighted to enhance solder properties. In this study, we investigated the microstructural change of Sn–0.5Cu wt.% based Pb-free solder alloys with Al addition (0.01–0.05 wt.%). The small amount of Al addition caused a remarkable microstructural change. The Al was favored to form Cu–Al intermetallic compounds inside the solder matrix. We identified the Cu–Al intermetallic compound as Cu_3_3Al_1_7, which has a rhombohedral structure, using EPMA and TEM analyses. This resulted in refined Cu_6Sn_5 networks in the Sn–0.5Cu based solder alloy. In addition, we conducted thermal analysis to confirm its stability at a high temperature of approximately 230 °C, which is the necessary temperature range for automotive applications. The solidification results were substantiated thermodynamically using the Scheil solidification model. We can provide criteria for the minimum aluminum content to modify the microstructure of Pb-free solder alloys. - Graphical abstract: The minor Al additions refined eutectic Cu_6Sn_5 IMC networks on the Sn–0.5Cu based solder alloys. The microstructure was dramatically changed with the minor Al addition. - Highlights: • We observed dramatic microstructure-change with Al additions. • We defined Cu_3_3Al_1_7 IMC with Al additions using TEM analysis. • We investigated grain refinement with Al additions using EBSD. • We discussed the refinement based on Scheil solidification model.

  18. Microstructural discovery of Al addition on Sn–0.5Cu-based Pb-free solder design

    Energy Technology Data Exchange (ETDEWEB)

    Koo, Jahyun; Lee, Changsoo [Department of Materials Science and Engineering, KAIST, Daejeon 305-701 (Korea, Republic of); Hong, Sung Jea [MK Electron Co., Ltd., Yongin Cheoin-gu 316-2 (Korea, Republic of); Kim, Keun-Soo, E-mail: keunsookim@hoseo.edu [Department of Display Engineering, Hoseo University, Asan 336-795 (Korea, Republic of); Lee, Hyuck Mo, E-mail: hmlee@kaist.ac.kr [Department of Materials Science and Engineering, KAIST, Daejeon 305-701 (Korea, Republic of)

    2015-11-25

    It is important to develop Pb-free solder alloys suitable for automotive use instead of traditional Sn–Pb solder due to environmental regulations (e.g., Restriction of Hazardous Substances (RoHS)). Al addition has been spotlighted to enhance solder properties. In this study, we investigated the microstructural change of Sn–0.5Cu wt.% based Pb-free solder alloys with Al addition (0.01–0.05 wt.%). The small amount of Al addition caused a remarkable microstructural change. The Al was favored to form Cu–Al intermetallic compounds inside the solder matrix. We identified the Cu–Al intermetallic compound as Cu{sub 33}Al{sub 17}, which has a rhombohedral structure, using EPMA and TEM analyses. This resulted in refined Cu{sub 6}Sn{sub 5} networks in the Sn–0.5Cu based solder alloy. In addition, we conducted thermal analysis to confirm its stability at a high temperature of approximately 230 °C, which is the necessary temperature range for automotive applications. The solidification results were substantiated thermodynamically using the Scheil solidification model. We can provide criteria for the minimum aluminum content to modify the microstructure of Pb-free solder alloys. - Graphical abstract: The minor Al additions refined eutectic Cu{sub 6}Sn{sub 5} IMC networks on the Sn–0.5Cu based solder alloys. The microstructure was dramatically changed with the minor Al addition. - Highlights: • We observed dramatic microstructure-change with Al additions. • We defined Cu{sub 33}Al{sub 17} IMC with Al additions using TEM analysis. • We investigated grain refinement with Al additions using EBSD. • We discussed the refinement based on Scheil solidification model.

  19. Interfacial reaction of Sn-based solder joint in the package system

    Science.gov (United States)

    Gu, Huandi

    In this thesis, I report a study on the effect of the solder size on intermetallic layer formation by comparing the morphology change and growth rate of two different size solder joint aged at a same temperature for different aging time. The layer thickness and microstructure were analyzed using scanning electron microscopy (SEM). Photoshop was used to measure the thickness of intermetallic compound. Two different size of solder joints with composition of Sn-Ag-Cu (305) were used.

  20. Solder joint technology materials, properties, and reliability

    CERN Document Server

    Tu, King-Ning

    2007-01-01

    Solder joints are ubiquitous in electronic consumer products. The European Union has a directive to ban the use of Pb-based solders in these products on July 1st, 2006. There is an urgent need for an increase in the research and development of Pb-free solders in electronic manufacturing. For example, spontaneous Sn whisker growth and electromigration induced failure in solder joints are serious issues. These reliability issues are quite complicated due to the combined effect of electrical, mechanical, chemical, and thermal forces on solder joints. To improve solder joint reliability, the science of solder joint behavior under various driving forces must be understood. In this book, the advanced materials reliability issues related to copper-tin reaction and electromigration in solder joints are emphasized and methods to prevent these reliability problems are discussed.

  1. Spontaneous soldering

    International Nuclear Information System (INIS)

    Percacci, R.

    1984-01-01

    It is proposed that the soldering form of general relativity be treated as a dynamical variable. This gives rise to the possibility of treating the linear connection on (n-dimensional) spacetime and an internal O(k)-Yang-Mills field as different components of the same O(N) gauge field (N= n+k). The distinction between gravitational and Yang-Mills interactions is due to a kind of Higgs mechanism driven by the vacuum expectation value of the soldering form. (orig.)

  2. Interfacial Microstructure and Shear Strength of Brazed Cu-Cr-Zr Alloy Cylinder and Cylindrical Hole by Au Based Solder

    Directory of Open Access Journals (Sweden)

    Zaihua Li

    2017-07-01

    Full Text Available Au-Ge-Ni solder was chosen for brazing of the Cu-Cr-Zr alloy cylinder and a part with a cylindrical hole (sleeve below 550 °C. The Au based solder was first sintered on the surface of the cylinder and then brazed to the inner surface of the sleeve. The effects of the heating process, the temperature and the holding time at the temperature on the microstructure of the sintered layer on the surface of the cylinder, the brazed interfacial microstructure, and the brazed shear strength between the cylinder and the sleeve were investigated by scanning electron microscope, energy dispersive X-ray spectroscopy analysis, and tensile shear tests. By approach of side solder melt feeding and brazing under proper parameters, the voids and micro cracks due to a lack of enough solder melt feeding are greatly lessened and the brazed shear strength of 100 MPa is ensured even with large clearances around 0.01 mm.

  3. Soldering in electronics assembly

    CERN Document Server

    Judd, Mike

    2013-01-01

    Soldering in Electronics Assembly discusses several concerns in soldering of electronic assemblies. The book is comprised of nine chapters that tackle different areas in electronic assembly soldering. Chapter 1 discusses the soldering process itself, while Chapter 2 covers the electronic assemblies. Chapter 3 talks about solders and Chapter 4 deals with flux. The text also tackles the CS and SC soldering process. The cleaning of soldered assemblies, solder quality, and standards and specifications are also discussed. The book will be of great use to professionals who deal with electronic assem

  4. Effect of temperature and flux concentration on soldering of base metal.

    Science.gov (United States)

    Lee, S Y; Lin, C T; Wang, M H; Tseng, H; Huang, H M; Dong, D R; Pan, L C; Shih, Y H

    2000-12-01

    The present study used the acoustic emission (AE) technique to evaluate interactions among soldering temperature, flux treatment, and the resultant ultimate tensile strength (UTS). Scanning electron microscopy (SEM) was used to examine fracture surfaces of the solder joints. Specimens were cast from removable partial denture alloy and then placed in a jig with a gap distance of 1.0 mm. A high-frequency soldering machine with an optical pyrometer was used for soldering at 1150 degrees C and 1200 degrees C, respectively. The flux concentrations were 67% and 75%. The soldered specimens were subjected to tensile test at a crosshead speed of 0.05 mm/min. During testing, acoustic emissions in the frequency range of 100--1200 kHz were collected, filtered, recorded, and processed by a sensing device. The results were analysed by ANOVA and Tukey LSD test. UTS at different temperatures showed no significant difference according to either mechanical or acoustic results. But in the 1200 degrees C group, the UTSs and AE counts showed significant differences (Pacoustic signals within the elastic deformation zone, while the 67% flux subgroup produced similar signals within the plastic deformation zone, either beyond the 0.2% yield point or before fracture.

  5. SMT soldering handbook

    National Research Council Canada - National Science Library

    Strauss, Rudolf

    1998-01-01

    ... 3.2.1 Constituents, melting behaviour and mechanical properties 3.2.2 Composition of solders for use in electronics 3.2.3 Lead-free solders 3.2.4 Solder impurities The soldered joint 3.3.1 Solde...

  6. Corrosion Behaviour of Sn-based Lead-Free Solders in Acidic Solution

    Science.gov (United States)

    Nordarina, J.; Mohd, H. Z.; Ahmad, A. M.; Muhammad, F. M. N.

    2018-03-01

    The corrosion properties of Sn-9(5Al-Zn), Sn-Cu and SAC305 were studied via potentiodynamic polarization method in an acidic solution of 1 M hydrochloric acid (HCl). Sn-9(5Al-Zn) produced different polarization profile compared with Sn-Cu and SAC305. The morphological analysis showed that small, deep grooves shaped of corrosion product formed on top of Sn-9(5Al-Zn) solder while two distinctive structures of closely packed and loosely packed corrosion product formed on top of Sn-Cu and SAC305 solder alloys. Phase analysis revealed the formations of various corrosion products such as SnO and SnO2 mainly dominant on surface of solder alloys after potentiodynamic polarization in 1 M hydrochloric acid (HCl).

  7. Laser soldering of Sn-Ag-Cu and Sn-Zn-Bi lead-free solder pastes

    Science.gov (United States)

    Takahashi, Junichi; Nakahara, Sumio; Hisada, Shigeyoshi; Fujita, Takeyoshi

    2004-10-01

    It has reported that a waste of an electronics substrate including lead and its compound such as 63Sn-37Pb has polluted the environment with acid rain. For that environment problem the development of lead-free solder alloys has been promoted in order to find out the substitute for Sn-Pb solders in the United States, Europe, and Japan. In a present electronics industry, typical alloys have narrowed down to Sn-Ag-Cu and Sn-Zn lead-free solder. In this study, solderability of Pb-free solder that are Sn-Ag-Cu and Sn-Zn-Bi alloy was studied on soldering using YAG (yttrium aluminum garnet) laser and diode laser. Experiments were peformed in order to determine the range of soldering parameters for obtaining an appropriate wettability based on a visual inspection. Joining strength of surface mounting chip components soldered on PCB (printed circuit board) was tested on application thickness of solder paste (0.2, 0.3, and 0.4 mm). In addition, joining strength characteristics of eutectic Sn-Pb alloy and under different power density were examined. As a result, solderability of Sn-Ag-Cu (Pb-free) solder paste are equivalent to that of coventional Sn-Pb solder paste, and are superior to that of Sn-Zn-Bi solder paste in the laser soldering method.

  8. Size effects in tin-based lead-free solder joints: Kinetics of bond formation and mechanical characteristics

    Science.gov (United States)

    Abdelhadi, Ousama Mohamed Omer

    Continuous miniaturization of microelectronic interconnects demands smaller joints with comparable microstructural and structural sizes. As the size of joints become smaller, the volume of intermetallics (IMCs) becomes comparable with the joint size. As a result, the kinetics of bond formation changes and the types and thicknesses of IMC phases that form within the constrained region of the bond varies. This dissertation focuses on investigating combination effects of process parameters and size on kinetics of bond formation, resulting microstructure and the mechanical properties of joints that are formed under structurally constrained conditions. An experiment is designed where several process parameters such as time of bonding, temperature, and pressure, and bond thickness as structural chracteristic, are varied at multiple levels. The experiment is then implemented on the process. Scanning electron microscope (SEM) is then utilized to determine the bond thickness, IMC phases and their thicknesses, and morphology of the bonds. Electron backscatter diffraction (EBSD) is used to determine the grain size in different regions, including the bulk solder, and different IMC phases. Physics-based analytical models have been developed for growth kinetics of IMC compounds and are verified using the experimental results. Nanoindentation is used to determine the mechanical behavior of IMC phases in joints in different scales. Four-point bending notched multilayer specimen and four-point bending technique were used to determine fracture toughness of the bonds containing IMCs. Analytical modeling of peeling and shear stresses and fracture toughness in tri-layer four-point bend specimen containing intermetallic layer was developed and was verified and validated using finite element simulation and experimental results. The experiment is used in conjunction with the model to calculate and verify the fracture toughness of Cu6Sn5 IMC materials. As expected two different IMC phases

  9. Features of soldering of molybdenum a lols

    International Nuclear Information System (INIS)

    Grishin, V.L.; Rybkin, B.V.; Cherkasov, A.F.

    1980-01-01

    Soldering features of complex-alloy molybdenum alloys were investigated in comparison with alloys based on solid solutions. Soldering features of heterogeneous molybdenum base alloys were investigated using samples of 0.5-1.O mm sheets with the strain of about 95% made of ingots which had been smelted in arc vacuum furnaces. The soldering of samples was carried out in 5x1O -5 mm Hg vacuum using different sources of heating: radiation, electron-ray and contact. It was shown that heat-resisting soldered joints of heterogeneous molybdenum alloys could be produced using zirconium and niobium base solders containing the most effective hardeners of the parent material (titanum, vanadium, tantalum, molybdenum, tungsten). To preserve high mechanical properties of heterogeneous alloys it was expedient to use for welding local heating sources which permitted to decrease considerably temperature- time conditions of the process

  10. Interfacial Reaction of Sn-Ag-Cu Lead-Free Solder Alloy on Cu: A Review

    Directory of Open Access Journals (Sweden)

    Liu Mei Lee

    2013-01-01

    Full Text Available This paper reviews the function and importance of Sn-Ag-Cu solder alloys in electronics industry and the interfacial reaction of Sn-Ag-Cu/Cu solder joint at various solder forms and solder reflow conditions. The Sn-Ag-Cu solder alloys are examined in bulk and in thin film. It then examines the effect of soldering conditions to the formation of intermetallic compounds such as Cu substrate selection, structural phases, morphology evolution, the growth kinetics, temperature and time is also discussed. Sn-Ag-Cu lead-free solder alloys are the most promising candidate for the replacement of Sn-Pb solders in modern microelectronic technology. Sn-Ag-Cu solders could possibly be considered and adapted in miniaturization technologies. Therefore, this paper should be of great interest to a large selection of electronics interconnect materials, reliability, processes, and assembly community.

  11. Interface between Sn-Sb-Cu solder and copper substrate

    Energy Technology Data Exchange (ETDEWEB)

    Sebo, P., E-mail: Pavel.Sebo@savba.sk [Institute of Materials and Machine Mechanics, Slovak Academy of Sciences, Racianska 75, 831 02 Bratislava 3 (Slovakia); Svec, P. [Institute of Physics, Slovak Academy of Sciences, Dubravska cesta 9, 845 11 Bratislava 45 (Slovakia); Faculty of Materials Science and Technology, Slovak University of Technology, J. Bottu 25, 917 24 Trnava (Slovakia); Janickovic, D.; Illekova, E. [Institute of Physics, Slovak Academy of Sciences, Dubravska cesta 9, 845 11 Bratislava 45 (Slovakia); Plevachuk, Yu. [Ivan Franko National University, Department of Metal Physics, 79005 Lviv (Ukraine)

    2011-07-15

    Highlights: {yields} New lead-free solder materials based on Sn-Sb-Cu were designed and prepared. {yields} Melting and solidification temperatures of the solders have been determined. {yields} Cu-substrate/solder interaction has been analyzed and quantified. {yields} Phases formed at the solder-substrate interface have been identified. {yields} Composition and soldering atmospheres were correlated with joint strength. - Abstract: Influence of antimony and copper in Sn-Sb-Cu solder on the melting and solidification temperatures and on the microstructure of the interface between the solder and copper substrate after wetting the substrate at 623 K for 1800 s were studied. Microstructure of the interface between the solder and copper substrates in Cu-solder-Cu joints prepared at the same temperature for 1800 s was observed and shear strength of the joints was measured. Influence of the atmosphere - air with the flux and deoxidising N{sub 2} + 10H{sub 2} gas - was taken into account. Thermal stability and microstructure were studied by differential scanning calorimetry (DSC), light microscopy, scanning electron microscopy (SEM) with energy-dispersive spectrometry (EDS) and X-ray diffraction (XRD). Melting and solidification temperatures of the solders were determined. An interfacial transition zone was formed by diffusion reaction between solid copper and liquid solder. At the interface Cu{sub 3}Sn and Cu{sub 6}Sn{sub 5} phases arise. Cu{sub 3}Sn is adjacent to the Cu substrate and its thickness decreases with increasing the amount of copper in solder. Scallop Cu{sub 6}Sn{sub 5} phase is formed also inside the solder drop. The solid solution Sn(Sb) and SbSn phase compose the interior of the solder drop. Shear strength of the joints measured by push-off method decreases with increasing Sb concentration. Copper in the solder shows even bigger negative effect on the strength.

  12. A FPGA implementation of solder paste deposit on printed circuit boards errors detector based in a bright and contrast algorithm

    OpenAIRE

    De Luca-Pennacchia, A.; Sánchez-Martínez, M. Á.

    2007-01-01

    Solder paste deposit on printed circuit boards (PCB) is a critical stage. It is known that about 60% of functionality defects in this type of boards are due to poor solder paste printing. These defects can be diminished by means of automatic optical inspection of this printing. Actually, this process is implemented by image processing software with its inherent high computational time cost. In this paper we propose to implement a high parallel degree image comparison algorithm suitable to be ...

  13. Features of Pd-Ni-Fe solder system for vacuum brazing of low alloy steels

    International Nuclear Information System (INIS)

    Radzievskij, V.N.; Kurochko, R.S.; Lotsmanov, S.N.; Rymar', V.I.

    1975-01-01

    The brazing solder of the Pd-Ni-Fe alloyed with copper and lithium, in order to decrease the melting point and provide for a better spreading, when soldered in vacuum ensures a uniform strength of soldered joints with the base metal of low-alloyed steels of 34KHNIM-type. The properties of low-alloyed steel joints brazed with the Pd-Ni-Fe-system solder little depend on the changes in the soldering parameters. The soldered joint keeps a homogeneous structure after all the stages of heat treatment (annealing, quenching and tempering)

  14. Evaluation on the characteristics of tin-silver-bismuth solder

    Science.gov (United States)

    Xia, Z.; Shi, Y.; Chen, Z.

    2002-02-01

    Tin-silver-bismuth solder is characterized by its lower melting point, good wetting behavior, and good mechanical property for which it is expected to be a new lead-free solder to replace tin-lead solder. In this article, Sn-3.33Ag-4.83Bi solder was investigated concerning its physical, spreading, and mechanical properties under specific conditions. Cooling curves and DSC results showed that it was close to eutectic composition (m.p. 210° 212 °C). Coefficiency of thermal expansion (CTE) of this solder, between that of PCBs and copper substrates, was beneficial to alleviate the thermal mismatch of the substrates. It was also a good electrical and thermal conductor. Using a rosin-based, mildly activated (RMA) flux, a spreading test indicated that SnAgBi solder paste had good solderability. Meanwhile, the solder had high tensile strength and fracture energy. Its fracture mechanism was a mixture of ductile and brittle fracture morphology. The metallographic and EDAX analyses indicated that it was composed of a tin-based solid solution and some intermetallic compound (IMC) that could strengthen the substrate. However, these large needle-like IMCs would cut the substrate and this resulted in the decreasing of the toughness of the solder.

  15. Thermomechanical fatigue life prediction for several solders

    Science.gov (United States)

    Wen, Shengmin

    Since solder connections operate at high homologous temperature, solders are high temperature materials. This feature makes their mechanical behavior and fatigue phenomena unique. Based on experimental findings, a physical damage mechanism is introduced for solders. The mechanism views the damage process as a series of independent local damage events characterized by the failure of individual grains, while the structural damage is the eventual percolation result of such local events. Fine's dislocation energy density concept and Mura's microcrack initiation theory are adopted to derive the fatigue formula for an individual grain. A physical damage metric is introduced to describe the material with damage. A unified creep and plasticity constitutive model is adopted to simulate the mechanical behavior of solders. The model is cast into a continuum damage mechanics framework to simulate material with damage. The model gives good agreement with the experimental results of 96.5Pb-3.5Sn and 96.5Sn-3.5Ag solders under uniaxial strain-controlled cyclic loading. The model is convenient for implementation into commercial computational packages. Also presented is a fatigue theory with its failure criterion for solders based on physical damage mechanism. By introducing grain orientation into the fatigue formula, an m-N curve (m is Schmid factor) at constant loading condition is suggested for fatigue of grains with different orientations. A solder structure is defined as fatigued when the damage metric reaches a critical threshold, since at this threshold the failed grains may form a cluster and percolate through the structure according to percolation theory. Fatigue data of 96.5Pb-3.5Sn solder bulk specimens under various uniaxial tension tests were analyzed. Results show that the theory gives consistent predictions under broad conditions, while inelastic strain theory does not. The theory is anisotropic with no size limitation to its application, which could be suitable for

  16. Mechanical properties of Bi-In-Zn/ Cu solder joint system

    International Nuclear Information System (INIS)

    Ervina Efzan Mohd Noor; Mohammed Noori Ridha; Ahmad Badri Ismail; Nurulakmal Mohd Sharif; Kuan Yew Cheong; Tadashi Ariga; Zuhailawati Hussain

    2009-01-01

    Full text: In recent years, the pollution of environment from lead (Pb) and Pb-containing compounds in microelectronic devices attracts more and more attentions in academia and industry; the lead-free solder alloys begin to replace the lead-based solders in packaging process of some devices and components. In this works, microstructure and mechanical properties of different reflow temperature (80, 100, 120 and 140 degree Celsius) for solder joints on shear strength of Bi-In-Zn lead free solder with low melting temperature of 60 degree Celsius on Cu solder joint has been investigated. This paper will compared the mechanical properties of the Bi-In-Zn lead-free solder alloys with current lead-free solder, Sn-Ag-Cu solder alloy. The fracture surface analyses have been observed by Optical Microscope and were investigated by Scanning Electron Microscope (SEM) and Energy Dispersive X-ray (EDX) and proved it by X-ray diffraction (XRD). (author)

  17. The effect of graphene on the intermetallic and joint strength of Sn-3.5Ag lead-free solder

    Science.gov (United States)

    Mayappan, R.; Salleh, A.; Andas, J.

    2017-09-01

    Solder has been widely used in electronic industry as interconnection for electronic packaging. European Union and Japan have restricted the use of Sn-Pb solder as it contains lead which can harmful to human health and environment. Due to this, many researches have been done in order to find a suitable replacement for the lead solder. Although many lead-free solders are available, the Sn-3.5Ag solder with the addition of graphene seem to be a suitable candidate. In this study, a 0.07 wt% graphene nanosheet was added into the Sn-3.5Ag solder and this composite solder was prepared under powder metallurgy method. The solder was reacted with copper substrate at 250 °C for one minute. For joint strength analysis, two copper strips were soldered together. The solder joint was aged at temperature 100 °C for 500 hours. Scanning Electron Microscope (SEM) was used to observe the interfacial reaction and Instron machine was used to determine the joint strength. Cu6Sn5 intermetallic layer was formed at the interface between the Cu substrate and the solders. Composite solder showed the retardation of the intermetallic growth compared to the plain solder. The thickness value of the intermetallic was used to calculate the growth rate the IMC. The graphene nanosheets added solder has lower growth rate which is 3.86 × 10-15 cm2/s compared to the plain solder 7.15 × 10-15 cm2/s. Shear strength analysis show that the composite solder has higher joint compared to the plain solder.

  18. Evaluation of process influences on surface chemistry of epoxy acrylate based solder mask via XPS, ToF-SIMS and contact angle measurement

    Energy Technology Data Exchange (ETDEWEB)

    Hofmeister, Caroline, E-mail: caroline.hofmeister@de.bosch.com [Robert Bosch GmbH, Postfach 30 02 40, 70442 Stuttgart (Germany); Fraunhofer Institute for Manufacturing Technology and Advanced Materials IFAM, Wiener Str. 12, 28359 Bremen (Germany); Maaß, Sebastian [Robert Bosch GmbH, Postfach 30 02 40, 70442 Stuttgart (Germany); Fladung, Thorsten; Mayer, Bernd [Fraunhofer Institute for Manufacturing Technology and Advanced Materials IFAM, Wiener Str. 12, 28359 Bremen (Germany)

    2017-01-01

    Epoxy acrylate based solder mask formulations were conditioned by different printed circuit board (PCB) manufacturing and PCB assembly process stages. Depending on these different influences the chemistry of the solder mask surface was investigated regarding adhesion to possible adhesion partners. The combination of X-ray photoelectron spectrometry (XPS), time-of-flight secondary ion mass spectrometry (ToF-SIMS) and the contact angle method, for surface energy determination, provided a detailed understanding of the surface near region up to the topmost monolayer, which forms the contact zone in which adhesion takes place. The combination of ToF-SIMS and XPS provided molecular information of surface components comprising quantitative information. The influences of all process steps, like UV, chemical and thermal treatment, on the chemical surface composition and appearance were identified. Based on the results a chemical surface model could be created regarding the different adhesion mechanisms. It has been shown that an enrichment of siloxanes at the surface is generated by different mechanisms that were distinguished based on ToF-SIMS. Even though an oxidation process in the surface near region (10 nm) was indicated by XPS, no increase of the surface polar groups and thus no polarity increase could be observed within the first monolayer. A surface model derived from the analysis results shows generation and occupation of free sites at the surface through all stages of the process. An occupation of free sites by siloxanes from additives in the solder mask formulation results in a siloxane dominated topmost monolayer. - Highlights: • A surface model describing the process influences is proposed. • Detailed siloxane reaction analysis was possible with ToF-SIMS. • Photo-chemical, chemical and thermal surface modification occur during PCB manufacturing.

  19. Laser-activated protein solder for peripheral nerve repair

    Science.gov (United States)

    Trickett, Rodney I.; Lauto, Antonio; Dawes, Judith M.; Owen, Earl R.

    1995-05-01

    A 100 micrometers core optical fiber-coupled 75 mW diode laser operating at a wavelength of 800 nm has been used in conjunction with a protein solder to stripe weld severed rat tibial nerves, reducing the long operating time required for microsurgical nerve repair. Welding is produced by selective laser denaturation of the albumin based solder which contains the dye indocyanine green. Operating time for laser soldering was 10 +/- 5 min. (n equals 20) compared to 23 +/- 9 min. (n equals 10) for microsuturing. The laser solder technique resulted in patent welds with a tensile strength of 15 +/- 5 g, while microsutured nerves had a tensile strength of 40 +/- 10 g. Histopathology of the laser soldered nerves, conducted immediately after surgery, displayed solder adhesion to the outer membrane with minimal damage to the inner axons of the nerves. An in vivo study is under way comparing laser solder repaired tibial nerves to conventional microsuture repair. At the time of submission 15 laser soldered nerves and 7 sutured nerves were characterized at 3 months and showed successful regeneration with compound muscle action potentials of 27 +/- 8 mV and 29 +/- 8 mW respectively. A faster, less damaging and long lasting laser based anastomotic technique is presented.

  20. Integration of environmentally compatible soldering technologies for waste minimization

    International Nuclear Information System (INIS)

    Hosking, F.M.

    1992-01-01

    There has been a concentrated effort throughout the international microelectronics industry to phase out chlorofluorocarbon (CFC) materials and alleviate the serious problem of ozone depletion created by the release of CFCS. The development of more environmentally compatible manufacturing technologies is the cornerstone of this effort. Alternative materials and processes for cleaning and soldering have received special attention. Electronic. soldering typically utilizes rosin-based fluxes to promote solder wettability. Flux residues must be removed from the soldered parts when high product reliability is essential. Halogenated or CFC solvents have been the principle chemicals used to clean the residues. With the accelerated push to eliminate CFCs in the US by 1995, CFC-free solvents, aqueous-based cleaning, water soluble or ''no clean'' fluxes, and fluxless soldering technologies are being developed and quickly integrated into manufacturing practice. Sandia's Center for Solder Science and Technology has been ch g a variety of fluxless and alternative soldering technologies for DOE's waste minimization program. The work has focused on controlled atmosphere, laser, and ultrasonic fluxless soldering, protective metallic and organic coatings, and fluxes which have water soluble or low solids-based chemistries. With the increasing concern that Pb will also be banned from electronic soldering, Sandia has been characterizing the wetting, aging, and mechanical properties of Pb-fire solder alloys. The progress of these integrated studies will be discussed. Their impact on environmentally compatible manufacturing will be emphasized. Since there is no universal solution to the various environmental, safety, and health issues which currently face industry, the proposed technologies offer several complementary materials and processing options from which one can choose

  1. Effect of silver and indium addition on mechanical properties and indentation creep behavior of rapidly solidified Bi–Sn based lead-free solder alloys

    International Nuclear Information System (INIS)

    Shalaby, Rizk Mostafa

    2013-01-01

    Mechanical properties and indentation creep of the melt-spun process Bi–42 wt%Sn, Bi–40 wt%Sn–2 wt%In, Bi–40 wt%Sn–2 wt%Ag and Bi–38 wt%Sn–2 wt%In–2 wt%Ag were studied by dynamic resonance technique and Vickers indentation testing at room temperature and compared to that of the traditional Sn–37 wt%Pb eutectic alloy. The results show that the structure of Bi–42 wt%Sn alloy is characterized by the presence of rhombohedral Bi and body centered tetragonal β-Sn. The two ternary alloys exhibit additional constituent phases of intermetallic compounds SnIn 19 for Bi–40 wt%Sn–2 wt%In and ε-Ag 3 Sn for Bi–40 wt%Sn–2 wt%Ag alloys. Attention has been paid to the role of intermetallic compounds on mechanical and creep behavior. The In and Ag containing solder alloy exhibited a good combination of higher creep resistance, good mechanical properties and lower melting temperature as compared with Pb–Sn eutectic solder alloy. This was attributed to the strengthening effect of Bi as a strong solid solution element in the Sn matrix and formation of intermetallic compounds β-SnBi, ε-Ag 3 Sn and InSn 19 which act as both strengthening agent and grain refiner in the matrix of the material. Addition of In and Ag decreased the melting temperature of Bi–Sn lead-free solder from 143 °C to 133 °C which was possible mainly due to the existence of InSn 19 and Ag 3 Sn intermetallic compounds. Elastic constants, internal friction and thermal properties of Bi–Sn based alloys have been studied and analyzed.

  2. Visual detection of defects in solder joints

    Science.gov (United States)

    Blaignan, V. B.; Bourbakis, Nikolaos G.; Moghaddamzadeh, Ali; Yfantis, Evangelos A.

    1995-03-01

    The automatic, real-time visual acquisition and inspection of VLSI boards requires the use of machine vision and artificial intelligence methodologies in a new `frame' for the achievement of better results regarding efficiency, products quality and automated service. In this paper the visual detection and classification of different types of defects on solder joints in PC boards is presented by combining several image processing methods, such as smoothing, segmentation, edge detection, contour extraction and shape analysis. The results of this paper are based on simulated solder defects and a real one.

  3. High power vertical stacked and horizontal arrayed diode laser bar development based on insulation micro-channel cooling (IMCC) and hard solder bonding technology

    Science.gov (United States)

    Wang, Boxue; Jia, Yangtao; Zhang, Haoyu; Jia, Shiyin; Liu, Jindou; Wang, Weifeng; Liu, Xingsheng

    2018-02-01

    An insulation micro-channel cooling (IMCC) has been developed for packaging high power bar-based vertical stack and horizontal array diode lasers, which eliminates many issues caused in its congener packaged by commercial copper formed micro-channel cooler(MCC), such as coefficient of thermal expansion (CTE) mismatch between cooler and diode laser bar, high coolant quality requirement (DI water) and channel corrosion and electro-corrosion induced by DI water if the DI-water quality is not well maintained The IMCC cooler separates water flow route and electrical route, which allows tap-water as coolant without electro-corrosion and therefore prolongs cooler lifetime dramatically and escalated the reliability of these diode lasers. The thickness of ceramic and copper in an IMCC cooler is well designed to minimize the CTE mismatch between laser bar and cooler, consequently, a very low "SMILE" of the laser bar can be achieved for small fast axis divergence after collimation. In additional, gold-tin hard solder bonding technology was also developed to minimize the risk of solder electromigration at high current density and thermal fatigue under hard-pulse operation mode. Testing results of IMCC packaged diode lasers are presented in this report.

  4. Oxidation and reduction kinetics of eutectic SnPb, InSn, and AuSn: a knowledge base for fluxless solder bonding applications

    DEFF Research Database (Denmark)

    Kuhmann, Jochen Friedrich; Preuss, A.; Adolphi, B.

    1998-01-01

    : (1) SnPb; (2) InSn; (3) AuSn. The studies of the oxidation kinetics show that the growth of the native oxide, which covers the solder surfaces from the start of all soldering operations is self-limiting. The rate of oxidation on the molten, metallic solder surfaces is significantly reduced...... and reduction kinetics, are applied to flip-chip (FC) bonding experiments in vacuum with and without the injection of H2. Wetting in vacuum is excellent but the self-alignment during flip-chip soldering is restricted. The desired, perfectly self-aligned FC-bonds have been only achieved, using evaporated...

  5. High-Temperature Lead-Free Solder Alternatives: Possibilities and Properties

    DEFF Research Database (Denmark)

    High-temperature solders have been widely used as joining materials to provide stable interconnections that resist a severe thermal environment and also to facilitate the drive for miniaturization. High-lead containing solders have been commonly used as high-temperature solders. The development...... of high-temperature lead-free solders has become an important issue for both the electronics and automobile industries because of the health and environmental concerns associated with lead usage. Unfortunately, limited choices are available as high-temperature lead-free solders. This work outlines...... the criteria for the evaluation of a new high-temperature lead-free solder material. A list of potential ternary high-temperature lead-free solder alternatives based on the Au-Sn and Au-Ge systems is proposed. Furthermore, a comprehensive comparison of the high-temperature stability of microstructures...

  6. Influence of solder joint length to the mechanical aspect during the thermal stress analysis

    Science.gov (United States)

    Tan, J. S.; Khor, C. Y.; Rahim, Wan Mohd Faizal Wan Abd; Ishak, Muhammad Ikman; Rosli, M. U.; Jamalludin, Mohd Riduan; Zakaria, M. S.; Nawi, M. A. M.; Aziz, M. S. Abdul; Ani, F. Che

    2017-09-01

    Solder joint is an important interconnector in surface mount technology (SMT) assembly process. The real time stress, strain and displacement of the solder joint is difficult to observe and assess the experiment. To tackle these problems, simulation analysis was employed to study the von Mises stress, strain and displacement in the thermal stress analysis by using Finite element based software. In this study, a model of leadless electronic package was considered. The thermal stress analysis was performed to investigate the effect of the solder length to those mechanical aspects. The simulation results revealed that solder length gives significant effect to the maximum von Mises stress to the solder joint. Besides, changes in solder length also influence the displacement of the solder joint in the thermal environment. The increment of the solder length significantly reduces the von Mises stress and strain on the solder joint. Thus, the understanding of the physical parameter for solder joint is important for engineer prior to designing the solder joint of the electronic component.

  7. Utilization of Pb-free solders in MEMS packaging

    Science.gov (United States)

    Selvaduray, Guna S.

    2003-01-01

    Soldering of components within a package plays an important role in providing electrical interconnection, mechanical integrity and thermal dissipation. MEMS packages present challenges that are more complex than microelectronic packages because they are far more sensitive to shock and vibration and also require precision alignment. Soldering is used at two major levels within a MEMS package: at the die attach level and at the component attach level. Emerging environmental regulations worldwide, notably in Europe and Japan, have targeted the elimination of Pb usage in electronic assemblies, due to the inherent toxicity of Pb. This has provided the driving force for development and deployment of Pb-free solder alloys. A relatively large number of Pb-free solder alloys have been proposed by various researchers and companies. Some of these alloys have also been patented. After several years of research, the solder alloy system that has emerged is based on Sn as a major component. The electronics industry has identified different compositions for different specific uses, such as wave soldering, surface mount reflow, etc. The factors that affect choice of an appropriate Pb-free solder can be divided into two major categories, those related to manufacturing, and those related to long term reliability and performance.

  8. Oriented regions grouping based candidate proposal for infrared pedestrian detection

    Science.gov (United States)

    Wang, Jiangtao; Zhang, Jingai; Li, Huaijiang

    2018-04-01

    Effectively and accurately locating the positions of pedestrian candidates in image is a key task for the infrared pedestrian detection system. In this work, a novel similarity measuring metric is designed. Based on the selective search scheme, the developed similarity measuring metric is utilized to yield the possible locations for pedestrian candidate. Besides this, corresponding diversification strategies are also provided according to the characteristics of the infrared thermal imaging system. Experimental results indicate that the presented scheme can achieve more efficient outputs than the traditional selective search methodology for the infrared pedestrian detection task.

  9. Evaluation of project based learning sufficiency of teacher candidates

    Directory of Open Access Journals (Sweden)

    Vasfi Tugun

    2012-01-01

    Full Text Available The aim of that research, it is the project based learning process suffuciency of teacher candidates who developedmultimedia by working in online and blended groups. Importance of research Being able to guide to studies that is going tobe done about assessment of multimedia projection for project based educational application to teachers and teachercandidates and It has been thought as an advisor source about being arranged new educational environment for the futureto teacher and teacher candidates for project based educational application and multimedia projection. Research is anexperimental study and has been shaped according to pre-test and last-test research model with the two groups. This groupsare online group and blended group. Discussion of research In the result of the study, in the process of project basedlearning, it is determined that the success level in multimedia development of teacher candidates who work in blendedlearning model is higher than the success level of teacher candidates who work in online learning model.

  10. Effect of soldering techniques and gap distance on tensile strength of soldered Ni-Cr alloy joint.

    Science.gov (United States)

    Lee, Sang-Yeob; Lee, Jong-Hyuk

    2010-12-01

    The present study was intended to evaluate the effect of soldering techniques with infrared ray and gas torch under different gap distances (0.3 mm and 0.5 mm) on the tensile strength and surface porosity formation in Ni-Cr base metal alloy. Thirty five dumbbell shaped Ni-Cr alloy specimens were prepared and assigned to 5 groups according to the soldering method and the gap distance. For the soldering methods, gas torch (G group) and infrared ray (IR group) were compared and each group was subdivided by corresponding gap distance (0.3 mm: G3 and IR3, 0.5 mm: G5, IR5). Specimens of the experimental groups were sectioned in the middle with a diamond disk and embedded in solder blocks according to the predetermined distance. As a control group, 7 specimens were prepared without sectioning or soldering. After the soldering procedure, a tensile strength test was performed using universal testing machine at a crosshead speed 1 mm/min. The proportions of porosity on the fractured surface were calculated on the images acquired through the scanning electronic microscope. Every specimen of G3, G5, IR3 and IR5 was fractured on the solder joint area. However, there was no significant difference between the test groups (P > .05). There was a negative correlation between porosity formation and tensile strength in all the specimens in the test groups (P tensile strength of joints and porosity formations between the gas-oxygen torch soldering and infrared ray soldering technique or between the gap distance of 0.3 mm and 0.5 mm.

  11. In situ measurement of electromigration-induced transient stress in Pb-free Sn-Cu solder joints by synchrotron radiation based X-ray polychromatic microdiffraction

    Energy Technology Data Exchange (ETDEWEB)

    Chen, Kai; Tamura, Nobumichi; Kunz, Martin; Tu, King-Ning; Lai, Yi-Shao

    2009-12-01

    Electromigration-induced hydrostatic elastic stress in Pb-free SnCu solder joints was studied by in situ synchrotron X-ray white beam microdiffraction. The elastic stresses in two different grains with similar crystallographic orientation, one located at the anode end and the other at the cathode end, were analyzed based on the elastic anisotropy of the Beta-Sn crystal structure. The stress in the grain at the cathode end remained constant except for temperature fluctuations, while the compressive stress in the grain at the anode end was built-up as a function of time during electromigration until a steady state was reached. The measured compressive stress gradient between the cathode and the anode is much larger than what is needed to initiate Sn whisker growth. The effective charge number of Beta-Sn derived from the electromigration data is in good agreement with the calculated value.

  12. In situ measurement of electromigration-induced transient stress in Pb-free Sn-Cu solder joints by synchrotron radiation based X-ray polychromatic microdiffraction

    Energy Technology Data Exchange (ETDEWEB)

    Chen, Kai; Tamura, Nobumichi; Kunz, Martin; Tu, King-Ning; Lai, Yi-Shao

    2009-05-15

    Electromigration-induced hydrostatic elastic stress in Pb-free SnCu solder joints was studied by in situ synchrotron X-ray white beam microdiffraction. The elastic stresses in two different grains with similar crystallographic orientation, one located at the anode end and the other at the cathode end, were analyzed based on the elastic anisotropy of the {beta}-Sn crystal structure. The stress in the grain at the cathode end remained constant except for temperature fluctuations, while the compressive stress in the grain at the anode end was built-up as a function of time during electromigration until a steady state was reached. The measured compressive stress gradient between the cathode and the anode is much larger than what is needed to initiate Sn whisker growth. The effective charge number of {beta}-Sn derived from the electromigration data is in good agreement with the calculated value.

  13. Soldering of Nanotubes onto Microelectrodes

    DEFF Research Database (Denmark)

    Madsen, Dorte Nørgaard; Mølhave, Kristian; Mateiu, Ramona Valentina

    2003-01-01

    Suspended bridges of individual multiwalled carbon nanotubes were fabricated inside a scanning electron microscope by soldering the nanotube onto microelectrodes with highly conducting gold-carbon material. By the decomposition of organometallic vapor with the electron beam, metal-containing sold...... bonds were consistently found to be mechanically stronger than the carbon nanotubes.......Suspended bridges of individual multiwalled carbon nanotubes were fabricated inside a scanning electron microscope by soldering the nanotube onto microelectrodes with highly conducting gold-carbon material. By the decomposition of organometallic vapor with the electron beam, metal-containing solder...... bonds were formed at the intersection of the nanotube and the electrodes. Current-voltage curves indicated metallic conduction of the nanotubes, with resistances in the range of 9-29 kOmega. Bridges made entirely of the soldering material exhibited resistances on the order of 100 Omega, and the solder...

  14. Effects of soldering methods on tensile strength of a gold-palladium metal ceramic alloy.

    Science.gov (United States)

    Ghadhanfari, Husain A; Khajah, Hasan M; Monaco, Edward A; Kim, Hyeongil

    2014-10-01

    The tensile strength obtained by conventional postceramic application soldering and laser postceramic welding may require more energy than microwave postceramic soldering, which could provide similar tensile strength values. The purpose of the study was to compare the tensile strength obtained by microwave postceramic soldering, conventional postceramic soldering, and laser postceramic welding. A gold-palladium metal ceramic alloy and gold-based solder were used in this study. Twenty-seven wax specimens were cast in gold-palladium noble metal and divided into 4 groups: laser welding with a specific postfiller noble metal, microwave soldering with a postceramic solder, conventional soldering with the same postceramic solder used in the microwave soldering group, and a nonsectioned control group. All the specimens were heat treated to simulate a normal porcelain sintering sequence. An Instron Universal Testing Machine was used to measure the tensile strength for the 4 groups. The means were analyzed statistically with 1-way ANOVA. The surface and fracture sites of the specimens were subjectively evaluated for fracture type and porosities by using a scanning electron microscope. The mean (standard deviation) ultimate tensile strength values were as follows: nonsectioned control 818 ±30 MPa, microwave 516 ±34 MPa, conventional 454 ±37 MPa, and laser weld 191 ±39 MPa. A 1-way ANOVA showed a significant difference in ultimate tensile strength among the groups (F3,23=334.5; Ptensile strength for gold and palladium noble metals than either conventional soldering or laser welding. Conventional soldering resulted in a higher tensile strength than laser welding. Under the experimental conditions described, either microwave or conventional postceramic soldering would appear to satisfy clinical requirements related to tensile strength. Copyright © 2014 Editorial Council for the Journal of Prosthetic Dentistry. Published by Elsevier Inc. All rights reserved.

  15. Tensile strength of two soldered alloys (Minalux and Verabond2

    Directory of Open Access Journals (Sweden)

    Mir Mohammad Rezaee S

    2002-07-01

    Full Text Available Recently. Minalux alloy, a base metal free from Be, has been presented on the market while no special soldering has been recommended for it. On the other hand, based on the manufacturer's claim, this alloy is similar to Verabond2. The aim of this study was to investigate the tensile strength of Minalux and Verabond2, soldered by Verasolder. Twelve standard dambble shape samples, with the length of 18 mm and the diameter of 3mm, were prepared from each alloy. Six samples of each alloy were divided into two pieces with carboradom disk. Soldering gap distance was 0.3mm, measured by a special jig and they were soldered by Verasolder alloy. Six other samples, of both Iranian and foreign unsoldered alloys were considered as control group. Then samples were examined under tensile force and their tensile strength was recorded. Two- way variance analysis showed that the tensile strength of Minalux alloy and Verabond2 were not statistically significant (Verasoler 686, Minalux 723, but after soldering, such difference became significant (Minalux 308, Verabond2 432. Verabond2 showed higher tensile strength after soldering.

  16. Corrosive microenvironments at lead solder surfaces arising from galvanic corrosion with copper pipe.

    Science.gov (United States)

    Nguyen, Caroline K; Stone, Kendall R; Dudi, Abhijeet; Edwards, Marc A

    2010-09-15

    As stagnant water contacts copper pipe and lead solder (simulated soldered joints), a corrosion cell is formed between the metals in solder (Pb, Sn) and the copper. If the resulting galvanic current exceeds about 2 μA/cm(2), a highly corrosive microenvironment can form at the solder surface, with pH chloride concentrations at least 11 times higher than bulk water levels. Waters with relatively high chloride tend to sustain high galvanic currents, preventing passivation of the solder surface, and contributing to lead contamination of potable water supplies. The total mass of lead corroded was consistent with predictions based on the galvanic current, and lead leaching to water was correlated with galvanic current. If the concentration of sulfate in the water increased relative to chloride, galvanic currents and associated lead contamination could be greatly reduced, and solder surfaces were readily passivated.

  17. On the problem of soldering refractory metals with silver-containing solders

    International Nuclear Information System (INIS)

    Anikeev, E.F.; Andryushchenko, V.I.; Chepelenko, V.N.; Batov, V.M.

    1981-01-01

    The processes of wetting, spreading and interphase interactions of copper-silver liquid alloys alloyed with Ni and Si, with niobium, tantalum, molybdenum, tungsten, 12Kh18N10T steel and nickel are studied. It has been determined that Ni or Si additions into the copper-silver solder improve the wetting and adhesion. When soldering with the alloy containing Ni additions, the strength of a soldered Joint grows with the increase of soldering duration while soldering with the alloy containing Si additions, the strength decreases. That is why Ni-containing solders are preferable for soldering thick-walled structures, and Si-containing solders - for thin-walled structures [ru

  18. A new method for soldering particle-reinforced aluminum metal matrix composites

    Energy Technology Data Exchange (ETDEWEB)

    Lu, Jinbin; Mu, Yunchao [Zhongyuan University of Technology, Zhengzhou 450007 (China); Luo, Xiangwei [Zhengzhou University, Zhengzhou 450002 (China); Niu, Jitai, E-mail: niujitai@163.com [Zhongyuan University of Technology, Zhengzhou 450007 (China)

    2012-12-01

    Highlights: Black-Right-Pointing-Pointer Soldering of 55% SiCp/Al composite and Kovar is first achieved in the world. Black-Right-Pointing-Pointer The nickel plating is required on the surface of the composites before soldering. Black-Right-Pointing-Pointer Low welding temperature is set to avoid overheating of the matrix. Black-Right-Pointing-Pointer Chemical and metallurgical bonding of composites and Kovar is carried out. Black-Right-Pointing-Pointer High tension strength of 225 MPa in soldering seam has been obtained. - Abstract: Soldering of aluminum metal matrix composites (Al-SiC) to other structural materials, or even to themselves, has proved unsuccessful mainly due to the poor wetting of these composites by conventional soldering alloys. This paper reports a new approach, which improves the wetting properties of these composites by molting solder alloys to promote stronger bonds. The new approach relies on nickel-plating of the composite's faying surface prior to application of a solder alloy. Based on this approach, an aluminum metal matrix composite containing 55 vol.% SiC particles is successfully soldered to a Fe-Ni-Co alloy (commercially known as Kovar 4J29). The solder material is a zinc-based alloy (Zn-Cd-Ag-Cu) with a melting point of about 400 Degree-Sign C. Microscopic examinations of the aluminum metal matrix composites (Al-MMCs)-Kovar interfaces show that the nickel-plating, prior to soldering, could noticeably enhance the reaction between the molten solder and composites. The fractography of the shear-tested samples revealed that fracture occurs within the composite (i.e. cohesive failure), indicating a good adhesion between the solder alloy and the Al-SiC composite.

  19. A new method for soldering particle-reinforced aluminum metal matrix composites

    International Nuclear Information System (INIS)

    Lu, Jinbin; Mu, Yunchao; Luo, Xiangwei; Niu, Jitai

    2012-01-01

    Highlights: ► Soldering of 55% SiCp/Al composite and Kovar is first achieved in the world. ► The nickel plating is required on the surface of the composites before soldering. ► Low welding temperature is set to avoid overheating of the matrix. ► Chemical and metallurgical bonding of composites and Kovar is carried out. ► High tension strength of 225 MPa in soldering seam has been obtained. - Abstract: Soldering of aluminum metal matrix composites (Al–SiC) to other structural materials, or even to themselves, has proved unsuccessful mainly due to the poor wetting of these composites by conventional soldering alloys. This paper reports a new approach, which improves the wetting properties of these composites by molting solder alloys to promote stronger bonds. The new approach relies on nickel-plating of the composite's faying surface prior to application of a solder alloy. Based on this approach, an aluminum metal matrix composite containing 55 vol.% SiC particles is successfully soldered to a Fe–Ni–Co alloy (commercially known as Kovar 4J29). The solder material is a zinc-based alloy (Zn–Cd–Ag–Cu) with a melting point of about 400 °C. Microscopic examinations of the aluminum metal matrix composites (Al-MMCs)–Kovar interfaces show that the nickel-plating, prior to soldering, could noticeably enhance the reaction between the molten solder and composites. The fractography of the shear-tested samples revealed that fracture occurs within the composite (i.e. cohesive failure), indicating a good adhesion between the solder alloy and the Al–SiC composite.

  20. Speeding disease gene discovery by sequence based candidate prioritization

    Directory of Open Access Journals (Sweden)

    Porteous David J

    2005-03-01

    Full Text Available Abstract Background Regions of interest identified through genetic linkage studies regularly exceed 30 centimorgans in size and can contain hundreds of genes. Traditionally this number is reduced by matching functional annotation to knowledge of the disease or phenotype in question. However, here we show that disease genes share patterns of sequence-based features that can provide a good basis for automatic prioritization of candidates by machine learning. Results We examined a variety of sequence-based features and found that for many of them there are significant differences between the sets of genes known to be involved in human hereditary disease and those not known to be involved in disease. We have created an automatic classifier called PROSPECTR based on those features using the alternating decision tree algorithm which ranks genes in the order of likelihood of involvement in disease. On average, PROSPECTR enriches lists for disease genes two-fold 77% of the time, five-fold 37% of the time and twenty-fold 11% of the time. Conclusion PROSPECTR is a simple and effective way to identify genes involved in Mendelian and oligogenic disorders. It performs markedly better than the single existing sequence-based classifier on novel data. PROSPECTR could save investigators looking at large regions of interest time and effort by prioritizing positional candidate genes for mutation detection and case-control association studies.

  1. Soldering-induced Cu diffusion and intermetallic compound formation between Ni/Cu under bump metallization and SnPb flip-chip solder bumps

    Science.gov (United States)

    Huang, Chien-Sheng; Jang, Guh-Yaw; Duh, Jenq-Gong

    2004-04-01

    Nickel-based under bump metallization (UBM) has been widely used as a diffusion barrier to prevent the rapid reaction between the Cu conductor and Sn-based solders. In this study, joints with and without solder after heat treatments were employed to evaluate the diffusion behavior of Cu in the 63Sn-37Pb/Ni/Cu/Ti/Si3N4/Si multilayer structure. The atomic flux of Cu diffused through Ni was evaluated from the concentration profiles of Cu in solder joints. During reflow, the atomic flux of Cu was on the order of 1015-1016 atoms/cm2s. However, in the assembly without solder, no Cu was detected on the surface of Ni even after ten cycles of reflow. The diffusion behavior of Cu during heat treatments was studied, and the soldering-process-induced Cu diffusion through Ni metallization was characterized. In addition, the effect of Cu content in the solder near the solder/intermetallic compound (IMC) interface on interfacial reactions between the solder and the Ni/Cu UBM was also discussed. It is evident that the (Cu,Ni)6Sn5 IMC might form as the concentration of Cu in the Sn-Cu-Ni alloy exceeds 0.6 wt.%.

  2. Lead-free solder technology transfer from ASE Americas

    Energy Technology Data Exchange (ETDEWEB)

    FTHENAKIS,V.

    1999-10-19

    To safeguard the environmental friendliness of photovoltaics, the PV industry follows a proactive, long-term environmental strategy involving a life-of-cycle approach to prevent environmental damage by its processes and products from cradle to grave. Part of this strategy is to examine substituting lead-based solder on PV modules with other solder alloys. Lead is a toxic metal that, if ingested, can damage the brain, nervous system, liver and kidneys. Lead from solder in electronic products has been found to leach out from municipal waste landfills and municipal incinerator ash was found to be high in lead also because of disposed consumer electronics and batteries. Consequently, there is a movement in Europe and Japan to ban lead altogether from use in electronic products and to restrict the movement across geographical boundaries of waste containing lead. Photovoltaic modules may contain small amounts of regulated materials, which vary from one technology to another. Environmental regulations impact the cost and complexity of dealing with end-of-life PV modules. If they were classified as hazardous according to Federal or State criteria, then special requirements for material handling, disposal, record-keeping and reporting would escalate the cost of decommissioning the modules. Fthenakis showed that several of today's x-Si modules failed the US-EPA Toxicity Characteristic Leaching Procedure (TCLP) for potential leaching of Pb in landfills and also California's standard on Total Threshold Limit Concentration (TTLC) for Pb. Consequently, such modules may be classified as hazardous waste. He highlighted potential legislation in Europe and Japan which could ban or restrict the use of lead and the efforts of the printed-circuit industries in developing Pb-free solder technologies in response to such expected legislation. Japanese firms already have introduced electronic products with Pb-free solder, and one PV manufacturer in the US, ASE Americas has used a

  3. A computer vision based candidate for functional balance test.

    Science.gov (United States)

    Nalci, Alican; Khodamoradi, Alireza; Balkan, Ozgur; Nahab, Fatta; Garudadri, Harinath

    2015-08-01

    Balance in humans is a motor skill based on complex multimodal sensing, processing and control. Ability to maintain balance in activities of daily living (ADL) is compromised due to aging, diseases, injuries and environmental factors. Center for Disease Control and Prevention (CDC) estimate of the costs of falls among older adults was $34 billion in 2013 and is expected to reach $54.9 billion in 2020. In this paper, we present a brief review of balance impairments followed by subjective and objective tools currently used in clinical settings for human balance assessment. We propose a novel computer vision (CV) based approach as a candidate for functional balance test. The test will take less than a minute to administer and expected to be objective, repeatable and highly discriminative in quantifying ability to maintain posture and balance. We present an informal study with preliminary data from 10 healthy volunteers, and compare performance with a balance assessment system called BTrackS Balance Assessment Board. Our results show high degree of correlation with BTrackS. The proposed system promises to be a good candidate for objective functional balance tests and warrants further investigations to assess validity in clinical settings, including acute care, long term care and assisted living care facilities. Our long term goals include non-intrusive approaches to assess balance competence during ADL in independent living environments.

  4. Damage behavior of SnAgCu/Cu solder joints subjected to thermomechanical cycling

    Energy Technology Data Exchange (ETDEWEB)

    Xiao, H., E-mail: xiaohui2013@yahoo.com.cn; Li, X.Y.; Hu, Y.; Guo, F.; Shi, Y.W.

    2013-11-25

    Highlights: •A creep–fatigue damage model based on CDM was proposed. •Designed system includes load frame, strain measure device and damage test device. •Damage evolution of solder joints was a function of accumulated inelastic strain. •Damage of solder joints is an interaction between creep and low-cycle fatigue. -- Abstract: Thermomechanical fatigue damage is a progressive process of material degradation. The objective of this study was to investigate the damage behavior of SnAgCu/Cu solder joints under thermomechanical cycling. A damage model was proposed based on continuum damage mechanics (CDM). Based upon an analysis of displacements for flip-chip solder joints subjected to thermal cycling, a special bimetallic loading frame with single-solder joint samples was designed to simulate the service conditions of actual joints in electronic packages. The assembly, which allowed for strain measurements of an individual solder joint during temperature cycling, was used to investigate the impact of stress–strain cycling on the damage behavior of SnAgCu/Cu solder joints. The characteristic parameters of the damage model were determined through thermomechanical cycling and strain measurement tests. The damage variable D = 1 − R{sub 0}/R was selected, and values for it were obtained using a four-probe method for the single-solder joint samples every dozen cycles during thermomechanical cycling tests to verify the model. The results showed that the predicted damage was in good agreement with the experimental results. The damage evolution law proposed here is a function of inelastic strain, and the results showed that the damage rate of SnAgCu/Cu solder joints increased as the range of the applied strain increased. In addition, the microstructure evolution of the solder joints was analyzed using scanning electron microscopy, which provided the microscopic explanation for the damage evolution law of SnAgCu/Cu solder joints.

  5. Damage behavior of SnAgCu/Cu solder joints subjected to thermomechanical cycling

    International Nuclear Information System (INIS)

    Xiao, H.; Li, X.Y.; Hu, Y.; Guo, F.; Shi, Y.W.

    2013-01-01

    Highlights: •A creep–fatigue damage model based on CDM was proposed. •Designed system includes load frame, strain measure device and damage test device. •Damage evolution of solder joints was a function of accumulated inelastic strain. •Damage of solder joints is an interaction between creep and low-cycle fatigue. -- Abstract: Thermomechanical fatigue damage is a progressive process of material degradation. The objective of this study was to investigate the damage behavior of SnAgCu/Cu solder joints under thermomechanical cycling. A damage model was proposed based on continuum damage mechanics (CDM). Based upon an analysis of displacements for flip-chip solder joints subjected to thermal cycling, a special bimetallic loading frame with single-solder joint samples was designed to simulate the service conditions of actual joints in electronic packages. The assembly, which allowed for strain measurements of an individual solder joint during temperature cycling, was used to investigate the impact of stress–strain cycling on the damage behavior of SnAgCu/Cu solder joints. The characteristic parameters of the damage model were determined through thermomechanical cycling and strain measurement tests. The damage variable D = 1 − R 0 /R was selected, and values for it were obtained using a four-probe method for the single-solder joint samples every dozen cycles during thermomechanical cycling tests to verify the model. The results showed that the predicted damage was in good agreement with the experimental results. The damage evolution law proposed here is a function of inelastic strain, and the results showed that the damage rate of SnAgCu/Cu solder joints increased as the range of the applied strain increased. In addition, the microstructure evolution of the solder joints was analyzed using scanning electron microscopy, which provided the microscopic explanation for the damage evolution law of SnAgCu/Cu solder joints

  6. Properties and Microstructures of Sn-Bi-X Lead-Free Solders

    Directory of Open Access Journals (Sweden)

    Fan Yang

    2016-01-01

    Full Text Available The Sn-Bi base lead-free solders are proposed as one of the most popular alloys due to the low melting temperature (eutectic point: 139°C and low cost. However, they are not widely used because of the lower wettability, fatigue resistance, and elongation compared to traditional Sn-Pb solders. So the alloying is considered as an effective way to improve the properties of Sn-Bi solders with the addition of elements (Al, Cu, Zn, Ga, Ag, In, Sb, and rare earth and nanoparticles. In this paper, the development of Sn-Bi lead-free solders bearing elements and nanoparticles was reviewed. The variation of wettability, melting characteristic, electromigration, mechanical properties, microstructures, intermetallic compounds reaction, and creep behaviors was analyzed systematically, which can provide a reference for investigation of Sn-Bi base solders.

  7. Long-Term Effects of Soldering By-Products on Nickel-Coated Copper Wire

    Science.gov (United States)

    Rolin, T. D.; Hodge, R. E.

    2008-01-01

    An analysis of thirty-year-old, down graded flight cables was conducted to determine the makeup of a green material on the surface of the shielded wire near soldered areas and to ascertain if the green material had corroded the nickel-coated copper wire. Two likely candidates were possible due to the handling and environments to which these cables were exposed. The flux used to solder the cables is known to contain abietic acid, a carboxylic acid found in many pine rosins used for the soldering process. The resulting material copper abietate is green in color and is formed during the application of heat during soldering operations. Copper (II) chloride, which is also green in color is known to contaminate flight parts and is corrosive. Data is presented that shows the material is copper abietate, not copper (II) chloride, and more importantly that the abietate does not aggressively attack nickel-plated copper wire.

  8. Effect of Strain Rate on Joint Strength and Failure Mode of Lead-Free Solder Joints

    Science.gov (United States)

    Lin, Jian; Lei, Yongping; Fu, Hanguang; Guo, Fu

    2018-03-01

    In surface mount technology, the Sn-3.0Ag-0.5Cu solder joint has a shorter impact lifetime than a traditional lead-tin solder joint. In order to improve the impact property of SnAgCu lead-free solder joints and identify the effect of silver content on tensile strength and impact property, impact experiments were conducted at various strain rates on three selected SnAgCu based solder joints. It was found that joint failure mainly occurred in the solder material with large plastic deformation under low strain rate, while joint failure occurred at the brittle intermetallic compound layer without any plastic deformation at a high strain rate. Joint strength increased with the silver content in SnAgCu alloys in static tensile tests, while the impact property of the solder joint decreased with increasing silver content. When the strain rate was low, plastic deformation occurred with failure and the tensile strength of the Sn-3.0Ag-0.5Cu solder joint was higher than that of Sn-0.3Ag-0.7Cu; when the strain rate was high, joint failure mainly occurred at the brittle interface layer and the Sn-0.3Ag-0.7Cu solder joint had a better impact resistance with a thinner intermetallic compound layer.

  9. Handbook of machine soldering SMT and TH

    CERN Document Server

    Woodgate, Ralph W

    1996-01-01

    A shop-floor guide to the machine soldering of electronics Sound electrical connections are the operational backbone of every piece of electronic equipment-and the key to success in electronics manufacturing. The Handbook of Machine Soldering is dedicated to excellence in the machine soldering of electrical connections. Self-contained, comprehensive, and down-to-earth, it cuts through jargon, peels away outdated notions, and presents all the information needed to select, install, and operate machine soldering equipment. This fully updated and revised volume covers all of the new technologies and processes that have emerged in recent years, most notably the use of surface mount technology (SMT). Supplemented with 200 illustrations, this thoroughly accessible text Describes reflow and wave soldering in detail, including reflow soldering of SMT boards and the use of nitrogen blankets * Explains the setup, operation, and maintenance of a variety of soldering machines * Discusses theory, selection, and control met...

  10. A Feasibility Study of Lead Free Solders for Level 1 Packaging Applications

    DEFF Research Database (Denmark)

    Chidambaram, Vivek; Hald, John; Hattel, Jesper Henri

    2009-01-01

    An attempt has been made to determine the lead free ternary combinations that satisfied the solidification requirement for a solder used in level 1 packaging applications, using the CALPHAD approach. The segregation profiles of the promising candidates were analyzed after scrutinizing the equilib......An attempt has been made to determine the lead free ternary combinations that satisfied the solidification requirement for a solder used in level 1 packaging applications, using the CALPHAD approach. The segregation profiles of the promising candidates were analyzed after scrutinizing...

  11. Whole genome homology-based identification of candidate genes ...

    African Journals Online (AJOL)

    Josephine Erhiakporeh

    2016-07-06

    Jul 6, 2016 ... candidate genes for drought tolerance in sesame. (Sesamum ... Our results provided genomic resources for further functional analysis and genetic engineering .... reverse transcribed using the Reverse Transcription System.

  12. The effect of intermetallic compound morphology on Cu diffusion in Sn-Ag and Sn-Pb solder bump on the Ni/Cu Under-bump metallization

    Science.gov (United States)

    Jang, Guh-Yaw; Duh, Jenq-Gong

    2005-01-01

    The eutectic Sn-Ag solder alloy is one of the candidates for the Pb-free solder, and Sn-Pb solder alloys are still widely used in today’s electronic packages. In this tudy, the interfacial reaction in the eutectic Sn-Ag and Sn-Pb solder joints was investigated with an assembly of a solder/Ni/Cu/Ti/Si3N4/Si multilayer structures. In the Sn-3.5Ag solder joints reflowed at 260°C, only the (Ni1-x,Cux)3Sn4 intermetallic compound (IMC) formed at the solder/Ni interface. For the Sn-37Pb solder reflowed at 225°C for one to ten cycles, only the (Ni1-x,Cux)3Sn4 IMC formed between the solder and the Ni/Cu under-bump metallization (UBM). Nevertheless, the (Cu1-y,Niy)6Sn5 IMC was observed in joints reflowed at 245°C after five cycles and at 265°C after three cycles. With the aid of microstructure evolution, quantitative analysis, and elemental distribution between the solder and Ni/Cu UBM, it was revealed that Cu content in the solder near the solder/IMC interface played an important role in the formation of the (Cu1-y,Niy)6Sn5 IMC. In addition, the diffusion behavior of Cu in eutectic Sn-Ag and Sn-Pb solders with the Ni/Cu UBM were probed and discussed. The atomic flux of Cu diffused through Ni was evaluated by detailed quantitative analysis in an electron probe microanalyzer (EPMA). During reflow, the atomic flux of Cu was on the order of 1016-1017 atoms/cm2sec in both the eutectic Sn-Ag and Sn-Pb systems.

  13. Physical properties of lead free solders in liquid and solid state

    Energy Technology Data Exchange (ETDEWEB)

    Mhiaoui, Souad

    2007-04-17

    The European legislation prohibits the use of lead containing solders in Europe. However, lead free solders have a higher melting point (typical 20%) and their mechanical characteristics are worse. Additional problems are aging and adhesion of the solder on the electronic circuits. Thus, research activities must focus on the optimization of the properties of Sn-Ag-Cu based lead free solders chosen by the industry. Two main objectives are treated in this work. In the center of the first one is the study of curious hysteresis effects of metallic cadmium-antimony alloys after thermal cycles by measuring electronic transport phenomena (thermoelectric power and electrical resistivity). The second objective, within the framework of ''cotutelle'' between the universities of Metz and of Chemnitz and supported by COST531, is to study more specifically lead free solders. A welding must well conduct electricity and well conduct and dissipate heat. In Metz, we determined the electrical conductivity, the thermoelectric power and the thermal conductivity of various lead free solders (Sn-Ag-Cu, Sn-Cu, Sn-Ag, Sn-Sb) as well in the liquid as well in the solid state. The results have been compared to classical lead-tin (Pb-Sn) solders. In Chemnitz we measured the surface tension, the interfacial tension and the density of lead free solders. We also measured the viscosity of these solders without and with additives, in particular nickel. These properties were related to the industrial problems of wettability and spreadability. Lastly, we solidified alloys under various conditions. We observed undercooling. We developed a technique of mixture of nanocrystalline powder with lead free solders ''to sow'' the liquid bath in order to obtain ''different'' solids which were examined using optical and electron microscopy. (orig.)

  14. Nanospot soldering polystyrene nanoparticles with an optical fiber probe laser irradiating a metallic AFM probe based on the near-field enhancement effect.

    Science.gov (United States)

    Cui, Jianlei; Yang, Lijun; Wang, Yang; Mei, Xuesong; Wang, Wenjun; Hou, Chaojian

    2015-02-04

    With the development of nanoscience and nanotechnology for the bottom-up nanofabrication of nanostructures formed from polystyrene nanoparticles, joining technology is an essential step in the manufacturing and assembly of nanodevices and nanostructures in order to provide mechanical integration and connection. To study the nanospot welding of polystyrene nanoparticles, we propose a new nanospot-soldering method using the near-field enhancement effect of a metallic atomic force microscope (AFM) probe tip that is irradiated by an optical fiber probe laser. On the basis of our theoretical analysis of the near-field enhancement effect, we set up an experimental system for nanospot soldering; this approach is carried out by using an optical fiber probe laser to irradiate the AFM probe tip to sinter the nanoparticles, providing a promising technical approach for the application of nanosoldering in nanoscience and nanotechnology.

  15. Thermomechanical behavior of tin-rich (lead-free) solders

    Science.gov (United States)

    Sidhu, Rajen Singh

    In order to adequately characterize the behavior of ball-grid-array (BGA) Pb-free solder spheres in electronic devices, the microstructure and thermomechanical behavior need to be studied. Microstructure characterization of pure Sn, Sn-0.7Cu, Sn-3.5Ag, and Sn-3.9Ag-0.7Cu alloys was conducted using optical microscopy, scanning electron microscopy, transmission electron microscopy, image analysis, and a novel serial sectioning 3D reconstruction process. Microstructure-based finite-element method (FEM) modeling of deformation in Sn-3.5Ag alloy was conducted, and it will be shown that this technique is more accurate when compared to traditional unit cell models for simulating and understanding material behavior. The effect of cooling rate on microstructure and creep behavior of bulk Sn-rich solders was studied. The creep behavior was evaluated at 25, 95, and 120°C. Faster cooling rates were found to increase the creep strength of the solders due to refinement of the solder microstructure. The creep behavior of Sn-rich single solder spheres reflowed on Cu substrates was studied at 25, 60, 95, and 130°C. Testing was conducted using a microforce testing system, with lap-shear geometry samples. The solder joints displayed two distinct creep behaviors: (a) precipitation-strengthening (Sn-3.5Ag and Sn-3.9Ag-0.7Cu) and (b) power law creep accommodated by grain boundary sliding (GBS) (Sn and Sn-0.7Cu). The relationship between microstructural features (i.e. intermetallic particle size and spacing), stress exponents, threshold stress, and activation energies are discussed. The relationship between small-length scale creep behavior and bulk behavior is also addressed. To better understand the damage evolution in Sn-rich solder joints during thermal fatigue, the local damage will be correlated to the cyclic hysteresis behavior and crystal orientations present in the Sn phase of solder joints. FEM modeling will also be utilized to better understand the macroscopic and local

  16. An evaluation of the lap-shear test for Sn-rich solder/Cu couples: Experiments and simulation

    Science.gov (United States)

    Chawla, N.; Shen, Y.-L.; Deng, X.; Ege, E. S.

    2004-12-01

    The lap-shear technique is commonly used to evaluate the shear, creep, and thermal fatigue behavior of solder joints. We have conducted a parametric experimental and modeling study, on the effect of testing and geometrical parameters on solder/copper joint response in lap-shear. It was shown that the farfield applied strain is quite different from the actual solder strain (measured optically). Subtraction of the deformation of the Cu substrate provides a reasonable approximation of the solder strain in the elastic regime, but not in the plastic regime. Solder joint thickness has a profound effect on joint response. The solder response moves progressively closer to “true” shear response with increasing joint thickness. Numerical modeling using finite-element analyses were performed to rationalize the experimental findings. The same lap-shear configuration was used in the simulation. The input response for solder was based on the experimental tensile test result on bulk specimens. The calculated shear response, using both the commonly adopted far-field measure and the actual shear strain in solder, was found to be consistent with the trends observed in the lap-shear experiments. The geometric features were further explored to provide physical insight into the problem. Deformation of the substrate was found to greatly influence the shear behavior of the solder.

  17. Spectroscopic investigation of oxidized solder surfaces

    International Nuclear Information System (INIS)

    Song, Jenn-Ming; Chang-Chien, Yu-Chien; Huang, Bo-Chang; Chen, Wei-Ting; Shie, Chi-Rung; Hsu, Chuang-Yao

    2011-01-01

    Highlights: → UV-visible spectroscopy is successfully used to evaluate the degree of discoloring of solders. → The surface oxides of solders can also be identified by UV-visible absorption spectra. → The discoloration of solder surface can be correlated with optical characterization of oxides. → A strategy against discoloring by alloying was also suggested. - Abstract: For further understanding of the discoloration of solder surfaces due to oxidation during the assembly and operation of electronic devices, UV-vis and X-ray photoelectron spectroscopic analyses were applied to evaluate the degree of discoloring and identify the surface oxides. The decrease in reflectance of the oxidized solder surface is related to SnO whose absorption band is located within the visible region. A trace of P can effectively depress the discoloration of solders under both solid and semi-solid states through the suppression of SnO.

  18. Soldering of Mg Joints Using Zn-Al Solders

    Science.gov (United States)

    Gancarz, Tomasz; Berent, Katarzyna; Skuza, Wojciech; Janik, Katarzyna

    2018-04-01

    Magnesium has applications in the automotive and aerospace industries that can significantly contribute to greater fuel economy and environmental conservation. The Mg alloys used in the automotive industry could reduce mass by up to 70 pct, providing energy savings. However, alongside the advantages there are limitations and technological barriers to use Mg alloys. One of the advantages concerns phenomena occurring at the interface when joining materials investigated in this study, in regard to the effect of temperature and soldering time for pure Mg joints. Eutectic Zn-Al and Zn-Al alloys with 0.05 (wt pct) Li and 0.2 (wt pct) Na were used in the soldering process. The process was performed for 3, 5, and 8 minutes of contact, at temperatures of 425 °C, 450 °C, 475 °C, and 500 °C. Selected, solidified solder-substrate couples were cross-sectioned, and their interfacial microstructures were investigated by scanning electron microscopy. The experiment was designed to demonstrate the effect of time, temperature, and the addition of Li and Na on the kinetics of the dissolving Mg substrate. The addition of Li and Na to eutectic Zn-Al caused to improve mechanical properties. Higher temperatures led to reduced joint strength, which is caused by increased interfacial reaction.

  19. Lead free solder mechanics and reliability

    CERN Document Server

    Pang, John Hock Lye

    2012-01-01

    Lead-free solders are used extensively as interconnection materials in electronic assemblies and play a critical role in the global semiconductor packaging and electronics manufacturing industry. Electronic products such as smart phones, notebooks and high performance computers rely on lead-free solder joints to connect IC chip components to printed circuit boards. Lead Free Solder: Mechanics and Reliability provides in-depth design knowledge on lead-free solder elastic-plastic-creep and strain-rate dependent deformation behavior and its application in failure assessment of solder joint reliability. It includes coverage of advanced mechanics of materials theory and experiments, mechanical properties of solder and solder joint specimens, constitutive models for solder deformation behavior; numerical modeling and simulation of solder joint failure subject to thermal cycling, mechanical bending fatigue, vibration fatigue and board-level drop impact tests. This book also: Discusses the mechanical prope...

  20. Modeling of high temperature- and diffusion-controlled die soldering in aluminum high pressure die casting

    DEFF Research Database (Denmark)

    Domkin, Konstantin; Hattel, Jesper Henri; Thorborg, Jesper

    2009-01-01

    of the die lifetime based on a quantitative analysis of die soldering in the framework of the numerical simulations of the die-casting process. Full 3D simulations of the process, including the filling. solidification, and the die cooling, are carried out using the casting simulation software MAGMAsoft....... The resulting transient temperature fields on the die surface and in the casting are then post-processed to estimate the die soldering. The present work deals only with the metallurgical/chemical kind of soldering which occurs at high temperatures and involves formation and growth of intermetallic layers...

  1. Eddy current quality control of soldered current-carrying busbar splices of superconducting magnets

    CERN Document Server

    Kogan, L; Savary, F; Principe, R; Datskov, V; Rozenfel'd, E; Khudjakov, B

    2015-01-01

    The eddy current technique associated with a U-shaped transducer is studied for the quality control of soldered joints between superconducting busbars ('splices'). Two other quality control techniques, based on X-rays and direct measurement of the electrical resistance, are also studied for comparison. A comparative analysis of the advantages and disadvantages of these three methods in relation to the quality control of soldered superconducting busbar cables enclosed in copper shells is used for benchmarking. The results of inspections with the U-shaped eddy current transducer carried out on several sample joints presenting different types of soldering defects show the potential of this type of nondestructive (ND) quality control technique.

  2. Thermal Analysis of the Sn-Ag-Cu-In Solder Alloy

    DEFF Research Database (Denmark)

    Sopousek, J.; Palcut, Marián; Hodúlová, Erika

    2010-01-01

    The tin-based alloy Sn-1.5Ag-0.7Cu-9.5In (composition in wt.%) is a potential candidate for lead-free soldering at temperatures close to 200°C due to the significant amount of indium. Samples of Sn-1.5Ag-0.7Cu-9.5In were prepared by controlled melting of the pure elements, followed by quenching...... to room temperature. The samples were analyzed by scanning electron microscopy/energy-dispersive x-ray spectroscopy (SEM/EDS) and electron backscatter diffraction. The solidified melt consisted of four different phases. Solidification behavior was monitored by heat-flux differential scanning calorimetry...

  3. Thermomechanical fatigue of Sn-37 wt.% Pb model solder joints

    International Nuclear Information System (INIS)

    Liu, X.W.; Plumbridge, W.J.

    2003-01-01

    The fatigue of Sn-37 wt.% Pb model solder joints has been investigated under thermomechanical and thermal cycling. Based upon an analysis of displacements during thermomechancial cycling, a model solder joint has been designed to simulate actual joints in electronic packages. The strain-stress relationship, characterised by hysteresis loops, was determined during cycling from 30 to 125 deg. C, and the stress-range monitored throughout. The number of cycles to failure, as defined by the fall in stress range, was correlated to strain range and strain energy. The strain hardening exponent, k, varied with the definition of failure and, when a stress-range drop of 50% was used, it was 0.46. Cracks were produced during pure thermal cycling without external strains applied. These arose due to the local strains caused by thermal expansion mismatches between the solder and Cu 6 Sn 5 intermetallic layer, between the phases of solder, and due to the anisotropy of the materials. The fatigue life under thermomechanical cycling was significantly inferior to that obtained in isothermal mechanical cycling. A factor contributing to this inferiority is the internal damage produced during temperature cycling

  4. Soldering Characteristics and Mechanical Properties of Sn-1.0Ag-0.5Cu Solder with Minor Aluminum Addition

    Directory of Open Access Journals (Sweden)

    Yee Mei Leong

    2016-06-01

    Full Text Available Driven by the trends towards miniaturization in lead free electronic products, researchers are putting immense efforts to improve the properties and reliabilities of Sn based solders. Recently, much interest has been shown on low silver (Ag content solder SAC105 (Sn-1.0Ag-0.5Cu because of economic reasons and improvement of impact resistance as compared to SAC305 (Sn-3.0Ag-0.5Cu. The present work investigates the effect of minor aluminum (Al addition (0.1–0.5 wt.% to SAC105 on the interfacial structure between solder and copper substrate during reflow. The addition of minor Al promoted formation of small, equiaxed Cu-Al particle, which are identified as Cu3Al2. Cu3Al2 resided at the near surface/edges of the solder and exhibited higher hardness and modulus. Results show that the minor addition of Al does not alter the morphology of the interfacial intermetallic compounds, but they substantially suppress the growth of the interfacial Cu6Sn5 intermetallic compound (IMC after reflow. During isothermal aging, minor alloying Al has reduced the thickness of interfacial Cu6Sn5 IMC but has no significant effect on the thickness of Cu3Sn. It is suggested that of atoms of Al exert their influence by hindering the flow of reacting species at the interface.

  5. Soldering Characteristics and Mechanical Properties of Sn-1.0Ag-0.5Cu Solder with Minor Aluminum Addition

    Science.gov (United States)

    Leong, Yee Mei; Haseeb, A.S.M.A.

    2016-01-01

    Driven by the trends towards miniaturization in lead free electronic products, researchers are putting immense efforts to improve the properties and reliabilities of Sn based solders. Recently, much interest has been shown on low silver (Ag) content solder SAC105 (Sn-1.0Ag-0.5Cu) because of economic reasons and improvement of impact resistance as compared to SAC305 (Sn-3.0Ag-0.5Cu. The present work investigates the effect of minor aluminum (Al) addition (0.1–0.5 wt.%) to SAC105 on the interfacial structure between solder and copper substrate during reflow. The addition of minor Al promoted formation of small, equiaxed Cu-Al particle, which are identified as Cu3Al2. Cu3Al2 resided at the near surface/edges of the solder and exhibited higher hardness and modulus. Results show that the minor addition of Al does not alter the morphology of the interfacial intermetallic compounds, but they substantially suppress the growth of the interfacial Cu6Sn5 intermetallic compound (IMC) after reflow. During isothermal aging, minor alloying Al has reduced the thickness of interfacial Cu6Sn5 IMC but has no significant effect on the thickness of Cu3Sn. It is suggested that of atoms of Al exert their influence by hindering the flow of reacting species at the interface. PMID:28773645

  6. In-situ study of electromigration-induced grain rotation in Pb-free solder joint by synchrotron microdiffraction

    International Nuclear Information System (INIS)

    Chen, Kai; Tamura, Nobumichi; Tu, King-Ning

    2008-01-01

    The rotation of Sn grains in Pb-free flip chip solder joints hasn't been reported in literature so far although it has been observed in Sn strips. In this letter, we report the detailed study of the grain orientation evolution induced by electromigration by synchrotron based white beam X-ray microdiffraction. It is found that the grains in solder joint rotate more slowly than in Sn strip even under higher current density. On the other hand, based on our estimation, the reorientation of the grains in solder joints also results in the reduction of electric resistivity, similar to the case of Sn strip. We will also discuss the reason why the electric resistance decreases much more in strips than in the Sn-based solders, and the different driving force for the grain growth in solder joint and in thin film interconnect lines

  7. In-situ study of electromigration-induced grain rotation in Pb-free solder joint by synchrotron microdiffraction

    Energy Technology Data Exchange (ETDEWEB)

    Chen, Kai; Tamura, Nobumichi; Tu, King-Ning

    2008-10-31

    The rotation of Sn grains in Pb-free flip chip solder joints hasn't been reported in literature so far although it has been observed in Sn strips. In this letter, we report the detailed study of the grain orientation evolution induced by electromigration by synchrotron based white beam X-ray microdiffraction. It is found that the grains in solder joint rotate more slowly than in Sn strip even under higher current density. On the other hand, based on our estimation, the reorientation of the grains in solder joints also results in the reduction of electric resistivity, similar to the case of Sn strip. We will also discuss the reason why the electric resistance decreases much more in strips than in the Sn-based solders, and the different driving force for the grain growth in solder joint and in thin film interconnect lines.

  8. Al and Si Alloying Effect on Solder Joint Reliability in Sn-0.5Cu for Automotive Electronics

    Science.gov (United States)

    Hong, Won Sik; Oh, Chulmin; Kim, Mi-Song; Lee, Young Woo; Kim, Hui Joong; Hong, Sung Jae; Moon, Jeong Tak

    2016-12-01

    To suppress the bonding strength degradation of solder joints in automotive electronics, we proposed a mid-temperature quaternary Pb-free Sn-0.5Cu solder alloy with minor Pd, Al, Si and Ge alloying elements. We manufactured powders and solder pastes of Sn-0.5Cu-(0.01,0.03)Al-0.005Si-(0.006-0.007)Ge alloys ( T m = 230°C), and vehicle electronic control units used for a flame-retardant-4 printed circuit board with an organic solderability preservative finish were assembled by a reflow soldering process. To investigate the degradation properties of solder joints used in engine compartments, thermal cycling tests were conducted from -40°C to 125°C (10 min dwell) for 1500 cycles. We also measured the shear strength of the solder joints in various components and observed the microstructural evolution of the solder joints. Based on these results, intermetallic compound (IMC) growth at the solder joints was suppressed by minor Pd, Al and Si additions to the Sn-0.5Cu alloy. After 1500 thermal cycles, IMC layers thicknesses for 100 parts per million (ppm) and 300 ppm Al alloy additions were 6.7 μm and 10 μm, compared to the as-reflowed bonding thicknesses of 6 μm and 7 μm, respectively. Furthermore, shear strength degradation rates for 100 ppm and 300 ppm Al(Si) alloy additions were at least 19.5%-26.2%. The cause of the improvement in thermal cycling reliability was analyzed using the (Al,Cu)-Sn, Si-Sn and Al-Sn phases dispersed around the Cu6Sn5 intermetallic at the solder matrix and bonding interfaces. From these results, we propose the possibility of a mid-temperature Sn-0.5Cu(Pd)-Al(Si)-Ge Pb-free solder for automotive engine compartment electronics.

  9. Thermal decomposition of solder flux activators under simulated wave soldering conditions

    DEFF Research Database (Denmark)

    Piotrowska, Kamila; Jellesen, Morten Stendahl; Ambat, Rajan

    2017-01-01

    /methodology/approach: Changes in the chemical structure of the activators were studied using Fourier transform infrared spectroscopy technique and were correlated to the exposure temperatures within the range of wave soldering process. The amount of residue left on the surface was estimated using standardized acid-base...... titration method as a function of temperature, time of exposure and the substrate material used. Findings: The study shows that there is a possibility of anhydride-like species formation during the thermal treatment of fluxes containing weak organic acids (WOAs) as activators (succinic and DL...

  10. Nano-soldering to single atomic layer

    Science.gov (United States)

    Girit, Caglar O [Berkeley, CA; Zettl, Alexander K [Kensington, CA

    2011-10-11

    A simple technique to solder submicron sized, ohmic contacts to nanostructures has been disclosed. The technique has several advantages over standard electron beam lithography methods, which are complex, costly, and can contaminate samples. To demonstrate the soldering technique graphene, a single atomic layer of carbon, has been contacted, and low- and high-field electronic transport properties have been measured.

  11. Safer Soldering Guidelines and Instructional Resources

    Science.gov (United States)

    Love, Tyler S.; Tomlinson, Joel

    2018-01-01

    Soldering is a useful and necessary process for many classroom, makerspace, Fab Lab, technology and engineering lab, and science lab activities. As described in this article, soldering can pose many safety risks without proper engineering controls, standard operating procedures, and direct instructor supervision. There are many safety hazards…

  12. Effect of rare earth Ce on the fatigue life of SnAgCu solder joints in WLCSP device using FEM and experiments

    International Nuclear Information System (INIS)

    Zhang, Liang; Han, Ji-guang; Guo, Yong-huan; He, Cheng-wen

    2014-01-01

    With the addition of 0.03 wt% rare earth Ce, in our previous works, the properties of SnAgCu solder were enhanced obviously. Based on the Garofalo–Arrhenius creep constitutive model, finite element method was used to simulate the stress–strain response during thermal cycle loading, and combined with the fatigue life prediction models, the fatigue life of SnAgCu/SnAgCuCe solder joints was calculated respectively, which can demonstrate the effect of the rare earth Ce on the fatigue life of SnAgCu solder joints. The results indicated that the maximum stress–strain can be found on the top surface of the corner solder joint, and the warpage of the PCB substrate occurred during thermal cycle loading. The trends obtained from modeling results have a good agreement with the experimental data reported in the literature for WLCSP devices. In addition, the stress–strain of SnAgCuCe solder joints is lower than that of SnAgCu solder joints. The thermal fatigue lives of solder joints calculated based on the creep model and creep strain energy density model show that the fatigue life of SnAgCuCe solder joints is higher than the SnAgCu solder joints. The fatigue life of SnAgCuCe solder joints can be enhanced significantly with the addition of Ce, is 30.2% higher than that of SnAgCu solder joints, which can be attributed to the CeSn 3 particles formed resisting the motion of dislocation; moreover, the refinement of microstructure and the IMC sizes also contribute to the enhancement of fatigue life, which elucidates that SnAgCuCe solder can be utilized in electronic industry with high reliability replacing the SnAgCu solder

  13. An inventory of continental U.S. terrestrial candidate ecological restoration areas based on landscape context

    Science.gov (United States)

    James Wickham; Kurt Riitters; Peter Vogt; Jennifer Costanza; Anne Neale

    2017-01-01

    Landscape context is an important factor in restoration ecology, but the use of landscape context for site prioritization has not been as fully developed.We used morphological image processing to identify candidate ecological restoration areas based on their proximity to existing natural vegetation. We identified 1,102,720 candidate ecological restoration areas across...

  14. Effects of voids on thermal-mechanical reliability of lead-free solder joints

    Directory of Open Access Journals (Sweden)

    Benabou Lahouari

    2014-06-01

    Full Text Available Reliability of electronic packages has become a major issue, particularly in systems used in electrical or hybrid cars where severe operating conditions must be met. Many studies have shown that solder interconnects are critical elements since many failure mechanisms originate from their typical response under thermal cycles. In this study, effects of voids in solder interconnects on the electronic assembly lifetime are estimated based on finite element simulations.

  15. Laser welding of vas deferens in rodents: initial experience with fluid solders.

    Science.gov (United States)

    Trickett, R I; Wang, D; Maitz, P; Lanzetta, M; Owen, E R

    1998-01-01

    This study evaluates the use of sutureless laser welding for vasovasostomy. In 14 rodents, the left vas deferens underwent vasovasostomy using an albumin-based solder applied to the adventitia of the vas deferens. The solder contained the dye, indocyanine green, to allow selective absorption and denaturation by a fiber-coupled 800-nm diode laser. The right vas deferens served as a control, receiving conventional layered microsurgical repair. We used a removable 4/0 nylon stent and microclamps to appose the vas deferens during repair, with no need for stay sutures. The mean time to perform laser solder repair (23.5 min) and conventional repair (23.3 min) were not significantly different (P=0.91). However, examination after 8 weeks showed that granuloma formation (G) and patency (P) rates for the conventional suture technique (G, 14%; P, 93%) were significantly better than observed for the laser solder technique (G, 57%; P, 50%).

  16. Effects of rework on adhesion of Pb-In soldered gold thick films

    International Nuclear Information System (INIS)

    Gehman, R.W.; Becka, G.A.; Losure, J.A.

    1982-02-01

    The feasibility of repeatedly reworking Pb-In soldered joints on gold thick films was evaluated. Nailhead adhesion tests on soldered thick films typically resulted in failure within the bulk solder (50 In-50 Pb). Average strengths increased with each rework, and the failure mode changed. An increase in metalization lift-off occurred with successive reworks. An investigation was initiated to determine why these changes occurred. Based on this work, the thick film adhesion to the substrate appeared to be lowered by indium reduction of cadmium oxide and by formation of a weak, brittle intermetallic compound, Au 9 In 4 . It was concluded that two solder reworks could be conducted without significant amounts of metallization lift-off during nailhead testing

  17. Photothermal effects of laser tissue soldering

    International Nuclear Information System (INIS)

    McNally, K.M.; Sorg, B.S.; Welch, A.J.; Dawes, J.M.; Owen, E.R.

    1999-01-01

    Low-strength anastomoses and thermal damage of tissue are major concerns in laser tissue welding techniques where laser energy is used to induce thermal changes in the molecular structure of the tissues being joined, hence allowing them to bond together. Laser tissue soldering, on the other hand, is a bonding technique in which a protein solder is applied to the tissue surfaces to be joined, and laser energy is used to bond the solder to the tissue surfaces. The addition of protein solders to augment tissue repair procedures significantly reduces the problems of low strength and thermal damage associated with laser tissue welding techniques. Investigations were conducted to determine optimal solder and laser parameters for tissue repair in terms of tensile strength, temperature rise and damage and the microscopic nature of the bonds formed. An in vitro study was performed using an 808 nm diode laser in conjunction with indocyanine green (ICG)-doped albumin protein solders to repair bovine aorta specimens. Liquid and solid protein solders prepared from 25% and 60% bovine serum albumin (BSA), respectively, were compared. The efficacy of temperature feedback control in enhancing the soldering process was also investigated. Increasing the BSA concentration from 25% to 60% greatly increased the tensile strength of the repairs. A reduction in dye concentration from 2.5mgml -1 to 0.25mgml -1 was also found to result in an increase in tensile strength. Increasing the laser irradiance and thus surface temperature resulted in an increased severity of histological injury. Thermal denaturation of tissue collagen and necrosis of the intimal layer smooth muscle cells increased laterally and in depth with higher temperatures. The strongest repairs were produced with an irradiance of 6.4Wcm -2 using a solid protein solder composed of 60% BSA and 0.25mgml -1 ICG. Using this combination of laser and solder parameters, surface temperatures were observed to reach 85±5 deg. C with a

  18. Albumin solder covalently bound to a polymer membrane: New approach to improve binding strength in laser tissue soldering in-vitro.

    Science.gov (United States)

    Hiebl, B; Ascher, L; Luetzow, K; Kratz, K; Gruber, C; Mrowietz, C; Nehring, M E; Lendlein, A; Franke, R-P; Jung, F

    2018-01-01

    Laser tissue soldering (LTS) based on indocyanine green (ICG)-mediated heat-denaturation of proteins might be a promising alternative technique for micro-suturing, but up to now the problem of too weak shear strength of the solder welds in comparison to sutures is not solved. Earlier reports gave promising results showing that solder supported by carrier materials can enhance the cohesive strength of the liquid solder. In these studies, the solder was applied to the carriers by dip coating. Higher reliability of the connection between the solder and the carrier material is expected when the solder is bound covalently to the carrier material. In the present study a poly(ether imide) (PEI) membrane served as carrier material and ICG-supplemented albumin as solder substrate. The latter was covalently coupled to the carrier membrane under physiological conditions to prevent structural protein changes. As laser source a diode continuous-wave laser emitting at 808 nm with intensities between 250 mW and 1500 mW was utilized. The albumin functionalized carrier membrane was placed onto the tunica media of explanted pig thoracic aortae forming an overlapping area of approximately 0.5×0.5 cm2. All tests were performed in a dry state to prevent laser light absorption by water. Infrared spectroscopy, spectro-photometrical determination of the secondary and primary amine groups after acid orange II staining, contact angle measurements, and atomic force microscopy proved the successful functionalization of the PEI membrane with albumin. A laser power of 450 mW LTS could generate a membrane-blood vessel connection which was characterized by a shear strength of 0.08±0.002 MPa, corresponding to 15% of the tensile strength of the native blood vessel. Theoretically, an overlapping zone of 4.1 mm around the entire circumference of the blood vessel could have provided shear strength of the PEI membrane-blood vessel compound identical to the tensile strength of the native

  19. The constitutive response of three solder materials

    International Nuclear Information System (INIS)

    Perez-Bergquist, Alejandro G.; Cao Fang; Perez-Bergquist, Sara J.; Lopez, Mike F.; Trujillo, Carl P.; Cerreta, Ellen K.; Gray, George T.

    2012-01-01

    Highlights: ► The full constitutive response of three solder materials. ► Test temperatures from −196 °C to 60 °C and strain rates from 10 −3 to >10 3 s −1 . ► Substitutes for leaded solders from a mechanical/microstructural properties view. - Abstract: As increasing worldwide demand for portable consumer electronics drives development of smaller, faster, more powerful electronic devices, components in these devices must become smaller, more precise, and more robust. Often, failure of these devices comes as a result of failure of the package (i.e. when a mobile phone is dropped) and specifically comes as a result of failure of solder interconnects. As a result, stronger more reliable solder materials are needed. In this paper, the constitutive responses of three solder materials (Sn63Pb37, Sn62Pb36Ag2, and Sn96.5Ag3Cu0.5) are analyzed as a function of temperature (−196 °C to 60 °C) and strain rate (10 −3 to >10 3 s −1 ). The lead-free Sn96.5Ag3Cu0.5 possessed the highest yield stress of the three solders at all tested strain rates and temperatures, and all solder microstructures which displayed a mechanical response that was sensitive to temperature exhibited grain coarsening with increasing plastic strain, even at room temperature.

  20. The constitutive response of three solder materials

    Energy Technology Data Exchange (ETDEWEB)

    Perez-Bergquist, Alejandro G., E-mail: alexpb@lanl.gov [Materials Science and Technology Division, Los Alamos National Laboratory, Mail Stop G755, Los Alamos, NM 87545 (United States); Cao Fang [Exxon Mobil Research and Engineering Company, Annadale, NJ 08801 (United States); Perez-Bergquist, Sara J.; Lopez, Mike F.; Trujillo, Carl P.; Cerreta, Ellen K.; Gray, George T. [Materials Science and Technology Division, Los Alamos National Laboratory, Mail Stop G755, Los Alamos, NM 87545 (United States)

    2012-05-25

    Highlights: Black-Right-Pointing-Pointer The full constitutive response of three solder materials. Black-Right-Pointing-Pointer Test temperatures from -196 Degree-Sign C to 60 Degree-Sign C and strain rates from 10{sup -3} to >10{sup 3} s{sup -1}. Black-Right-Pointing-Pointer Substitutes for leaded solders from a mechanical/microstructural properties view. - Abstract: As increasing worldwide demand for portable consumer electronics drives development of smaller, faster, more powerful electronic devices, components in these devices must become smaller, more precise, and more robust. Often, failure of these devices comes as a result of failure of the package (i.e. when a mobile phone is dropped) and specifically comes as a result of failure of solder interconnects. As a result, stronger more reliable solder materials are needed. In this paper, the constitutive responses of three solder materials (Sn63Pb37, Sn62Pb36Ag2, and Sn96.5Ag3Cu0.5) are analyzed as a function of temperature (-196 Degree-Sign C to 60 Degree-Sign C) and strain rate (10{sup -3} to >10{sup 3} s{sup -1}). The lead-free Sn96.5Ag3Cu0.5 possessed the highest yield stress of the three solders at all tested strain rates and temperatures, and all solder microstructures which displayed a mechanical response that was sensitive to temperature exhibited grain coarsening with increasing plastic strain, even at room temperature.

  1. Optimal parameters for laser tissue soldering

    Science.gov (United States)

    McNally-Heintzelman, Karen M.; Sorg, Brian S.; Chan, Eric K.; Welch, Ashley J.; Dawes, Judith M.; Owen, Earl R.

    1998-07-01

    Variations in laser irradiance, exposure time, solder composition, chromophore type and concentration have led to inconsistencies in published results of laser-solder repair of tissue. To determine optimal parameters for laser tissue soldering, an in vitro study was performed using an 808-nm diode laser in conjunction with an indocyanine green (ICG)- doped albumin protein solder to weld bovine aorta specimens. Liquid and solid protein solders prepared from 25% and 60% bovine serum albumin (BSA), respectively, were compared. The effects of laser irradiance and exposure time on tensile strength of the weld and temperature rise as well as the effect of hydration on bond stability were investigated. Optimum irradiance and exposure times were identified for each solder type. Increasing the BSA concentration from 25% to 60% greatly increased the tensile strength of the weld. A reduction in dye concentration from 2.5 mg/ml to 0.25 mg/ml was also found to result in an increase in tensile strength. The strongest welds were produced with an irradiance of 6.4 W/cm2 for 50 s using a solid protein solder composed of 60% BSA and 0.25 mg/ml ICG. Steady-state solder surface temperatures were observed to reach 85 plus or minus 5 degrees Celsius with a temperature gradient across the solid protein solder strips of between 15 and 20 degrees Celsius. Finally, tensile strength was observed to decrease significantly (20 to 25%) after the first hour of hydration in phosphate-buffered saline. No appreciable change was observed in the strength of the tissue bonds with further hydration.

  2. A Probabilistic Approach to Predict Thermal Fatigue Life for Ball Grid Array Solder Joints

    Science.gov (United States)

    Wei, Helin; Wang, Kuisheng

    2011-11-01

    Numerous studies of the reliability of solder joints have been performed. Most life prediction models are limited to a deterministic approach. However, manufacturing induces uncertainty in the geometry parameters of solder joints, and the environmental temperature varies widely due to end-user diversity, creating uncertainties in the reliability of solder joints. In this study, a methodology for accounting for variation in the lifetime prediction for lead-free solder joints of ball grid array packages (PBGA) is demonstrated. The key aspects of the solder joint parameters and the cyclic temperature range related to reliability are involved. Probabilistic solutions of the inelastic strain range and thermal fatigue life based on the Engelmaier model are developed to determine the probability of solder joint failure. The results indicate that the standard deviation increases significantly when more random variations are involved. Using the probabilistic method, the influence of each variable on the thermal fatigue life is quantified. This information can be used to optimize product design and process validation acceptance criteria. The probabilistic approach creates the opportunity to identify the root causes of failed samples from product fatigue tests and field returns. The method can be applied to better understand how variation affects parameters of interest in an electronic package design with area array interconnections.

  3. A Novel Technique for the Connection of Ceramic and Titanium Implant Components Using Glass Solder Bonding

    Directory of Open Access Journals (Sweden)

    Enrico Mick

    2015-07-01

    Full Text Available Both titanium and ceramic materials provide specific advantages in dental implant technology. However, some problems, like hypersensitivity reactions, corrosion and mechanical failure, have been reported. Therefore, the combining of both materials to take advantage of their pros, while eliminating their respective cons, would be desirable. Hence, we introduced a new technique to bond titanium and ceramic materials by means of a silica-based glass ceramic solder. Cylindrical compound samples (Ø10 mm × 56 mm made of alumina toughened zirconia (ATZ, as well as titanium grade 5, were bonded by glass solder on their end faces. As a control, a two-component adhesive glue was utilized. The samples were investigated without further treatment, after 30 and 90 days of storage in distilled water at room temperature, and after aging. All samples were subjected to quasi-static four-point-bending tests. We found that the glass solder bonding provided significantly higher bending strength than adhesive glue bonding. In contrast to the glued samples, the bending strength of the soldered samples remained unaltered by the storage and aging treatments. Scanning electron microscopy (SEM and energy-dispersive X-ray (EDX analyses confirmed the presence of a stable solder-ceramic interface. Therefore, the glass solder technique represents a promising method for optimizing dental and orthopedic implant bondings.

  4. Thermomechanical Behavior of Monolithic SN-AG-CU Solder and Copper Fiber Reinforced Solders

    National Research Council Canada - National Science Library

    Reuse, Rolando

    2005-01-01

    .... The thermomechanical cycling in the solder causes numerous reliability challenges, mostly because of the mismatch of the coefficient of thermal expansion between the silicon chip and the substrate...

  5. Perceptions of Teacher Candidates Regarding Project-Based Learning

    Science.gov (United States)

    Baysura, Ozge Deniz; Altun, Sertel; Yucel-Toy, Banu

    2016-01-01

    Problem Statement: Project-based learning (PBL) is a learning and teaching approach that makes students search for new knowledge and skills, helps them overcome real-life questions, and makes them design their own studies and performances. Research in Turkey reveals that teachers are not well-informed about PBL, can not guide students in this…

  6. Finite Element-Assisted Assessment of the Thermo-cyclic Characteristics of Leads Soldered with SnAgCu(+Bi,In) Alloys

    Science.gov (United States)

    Lis, Adrian; Nakanishi, Kohei; Matsuda, Tomoki; Sano, Tomokazu; Minagawa, Madoka; Okamoto, Masahide; Hirose, Akio

    2017-07-01

    Solder joints between leads and printed circuit boards in thin small outline packages were produced with conventional Sn1.0Ag0.7Cu (SAC107) and Sn3.0Ag0.7Cu (SAC305) solders as well as various solder alloys with gradually increasing amounts of Bi (up to 3.0 wt.%) and In (up to 1.0 wt.%) within the SAC107 base solder. The reliability of soldered leads in temperature cycle (TC) tests improved most with solder alloys containing both Bi (1.6 wt.%) and In (0.5 wt.%). Microindentation and electron probe microanalysis mappings revealed that the effect originates from a combination of solution and precipitation strengthening of the initial SAC alloy. The distribution of inelastic strain accumulation (ISA), as a measure for degradation, was determined in the solder joints by finite element calculations. It was shown that defects in the solder proximal to the lead (60-75 μm), which was underpinned by similar cracking characteristics along the lead-solder interface. The ISA was confirmed to be lower in SAC+Bi/In alloys owing to their enhanced elasto-plastic properties. Moreover, the addition of a thin Cu coating on the leads could improve the joint reliability, as suggested by the calculation of the ISA and the acceleration factor.

  7. Scalable Manufacturing of Solderable and Stretchable Physiologic Sensing Systems.

    Science.gov (United States)

    Kim, Yun-Soung; Lu, Jesse; Shih, Benjamin; Gharibans, Armen; Zou, Zhanan; Matsuno, Kristen; Aguilera, Roman; Han, Yoonjae; Meek, Ann; Xiao, Jianliang; Tolley, Michael T; Coleman, Todd P

    2017-10-01

    Methods for microfabrication of solderable and stretchable sensing systems (S4s) and a scaled production of adhesive-integrated active S4s for health monitoring are presented. S4s' excellent solderability is achieved by the sputter-deposited nickel-vanadium and gold pad metal layers and copper interconnection. The donor substrate, which is modified with "PI islands" to become selectively adhesive for the S4s, allows the heterogeneous devices to be integrated with large-area adhesives for packaging. The feasibility for S4-based health monitoring is demonstrated by developing an S4 integrated with a strain gauge and an onboard optical indication circuit. Owing to S4s' compatibility with the standard printed circuit board assembly processes, a variety of commercially available surface mount chip components, such as the wafer level chip scale packages, chip resistors, and light-emitting diodes, can be reflow-soldered onto S4s without modifications, demonstrating the versatile and modular nature of S4s. Tegaderm-integrated S4 respiration sensors are tested for robustness for cyclic deformation, maximum stretchability, durability, and biocompatibility for multiday wear time. The results of the tests and demonstration of the respiration sensing indicate that the adhesive-integrated S4s can provide end users a way for unobtrusive health monitoring. © 2017 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

  8. Mechanical Deformation Behavior of Sn-Ag-Cu Solders with Minor Addition of 0.05 wt.% Ni

    Science.gov (United States)

    Hammad, A. E.; El-Taher, A. M.

    2014-11-01

    The aim of the present work is to develop a comparative evaluation of the microstructural and mechanical deformation behavior of Sn-Ag-Cu (SAC) solders with the minor addition of 0.05 wt.% Ni. Test results showed that, by adding 0.05Ni element into SAC solders, generated mainly small rod-shaped (Cu,Ni)6Sn5 intermetallic compounds (IMCs) inside the β-Sn phase. Moreover, increasing the Ag content and adding Ni could result in the change of the shape and size of the IMC precipitate. Hence, a significant improvement is observed in the mechanical properties of SAC solders with increasing Ag content and Ni addition. On the other hand, the tensile results of Ni-doped SAC solders showed that both the yield stress and ultimate tensile strengths decrease with increasing temperature and with decreasing strain rate. This behavior was attributed to the competing effects of work hardening and dynamic recovery processes. The Sn-2.0Ag-0.5Cu-0.05Ni solder displayed the highest mechanical properties due to the formation of hard (Cu,Ni)6Sn5 IMCs. Based on the obtained stress exponents and activation energies, it is suggested that the dominant deformation mechanism in SAC (205)-, SAC (0505)- and SAC (0505)-0.05Ni solders is pipe diffusion, and lattice self-diffusion in SAC (205)-0.05Ni solder. In view of these results, the Sn-2.0Ag-0.5Cu-0.05Ni alloy is a more reliable solder alloy with improved properties compared with other solder alloys tested in the present work.

  9. Effect of Preconditioning and Soldering on Failures of Chip Tantalum Capacitors

    Science.gov (United States)

    Teverovsky, Alexander A.

    2014-01-01

    Soldering of molded case tantalum capacitors can result in damage to Ta205 dielectric and first turn-on failures due to thermo-mechanical stresses caused by CTE mismatch between materials used in the capacitors. It is also known that presence of moisture might cause damage to plastic cases due to the pop-corning effect. However, there are only scarce literature data on the effect of moisture content on the probability of post-soldering electrical failures. In this work, that is based on a case history, different groups of similar types of CWR tantalum capacitors from two lots were prepared for soldering by bake, moisture saturation, and longterm storage at room conditions. Results of the testing showed that both factors: initial quality of the lot, and preconditioning affect the probability of failures. Baking before soldering was shown to be effective to prevent failures even in lots susceptible to pop-corning damage. Mechanism of failures is discussed and recommendations for pre-soldering bake are suggested based on analysis of moisture characteristics of materials used in the capacitors' design.

  10. Fundamentals of lead-free solder interconnect technology from microstructures to reliability

    CERN Document Server

    Lee, Tae-Kyu; Kim, Choong-Un; Ma, Hongtao

    2015-01-01

    This unique book provides an up-to-date overview of the fundamental concepts behind lead-free solder and interconnection technology. Readers will find a description of the rapidly increasing presence of electronic systems in all aspects of modern life as well as the increasing need for predictable reliability in electronic systems. The physical and mechanical properties of lead-free solders are examined in detail, and building on fundamental science, the mechanisms responsible for damage and failure evolution, which affect reliability of lead-free solder joints are identified based on microstructure evolution.  The continuing miniaturization of electronic systems will increase the demand on the performance of solder joints, which will require new alloy and processing strategies as well as interconnection design strategies. This book provides a foundation on which improved performance and new design approaches can be based.  In summary, this book:  Provides an up-to-date overview on lead-free soldering tech...

  11. Development of high melting point, environmentally friendly solders, using the calphad approach

    DEFF Research Database (Denmark)

    Chidambaram, Vivek; Hald, John; Hattel, Jesper Henri

    2008-01-01

    An attempt has been made using the CALPHAD approach via Thermo-Calc to explore the various possible chemical compositions that adhere to the melting criterion i.e. 270-350 degrees C, required to replace the traditionally used high lead content solders for first level packaging applications. Vario...... tension have also been considered. Special focus has been given to toxicity related issues since the main ideology of looking for an alternative to high lead containing solders is not related to technical issues but due to environmental concerns.......An attempt has been made using the CALPHAD approach via Thermo-Calc to explore the various possible chemical compositions that adhere to the melting criterion i.e. 270-350 degrees C, required to replace the traditionally used high lead content solders for first level packaging applications. Various...... of promising solder alloy candidates. The ternary combinations that satisfied the primary solidification requirement were scrutinized taking into account the commercial interests i.e. availability, cost-effectiveness, recyclability and toxicity issues. Technical issues like manufacturability and surface...

  12. High temperature soldering of graphite

    International Nuclear Information System (INIS)

    Anikin, L.T.; Kravetskij, G.A.; Dergunova, V.S.

    1977-01-01

    The effect is studied of the brazing temperature on the strength of the brazed joint of graphite materials. In one case, iron and nickel are used as solder, and in another, molybdenum. The contact heating of the iron and nickel with the graphite has been studied in the temperature range of 1400-2400 ged C, and molybdenum, 2200-2600 deg C. The quality of the joints has been judged by the tensile strength at temperatures of 2500-2800 deg C and by the microstructure. An investigation into the kinetics of carbon dissolution in molten iron has shown that the failure of the graphite in contact with the iron melt is due to the incorporation of iron atoms in the interbase planes. The strength of a joint formed with the participation of the vapour-gas phase is 2.5 times higher than that of a joint obtained by graphite recrystallization through the carbon-containing metal melt. The critical temperatures are determined of graphite brazing with nickel, iron, and molybdenum interlayers, which sharply increase the strength of the brazed joint as a result of the formation of a vapour-gas phase and deposition of fine-crystal carbon

  13. Microstructure evolution and thermomechanical fatigue of solder materials

    NARCIS (Netherlands)

    Matin, M.A.

    2005-01-01

    The microelectronics industry is confronted with the new challenge to produce joints with lead-free solder materials replacing classical tin-lead solders in devices used in many fields (e.g. consumer electronics, road transport, aviation, space-crafts, telecommunication). In service, solder

  14. Efforts to Develop a 300°C Solder

    Energy Technology Data Exchange (ETDEWEB)

    Norann, Randy A [Perma Works LLC

    2015-01-25

    This paper covers the efforts made to find a 300°C electrical solder solution for geothermal well monitoring and logging tools by Perma Works LLC. This paper covers: why a high temperature solder is needed, what makes for a good solder, testing flux, testing conductive epoxy and testing intermetallic bonds. Future areas of research are suggested.

  15. Bryological exploration: field-trip based learning to develop competencies of science teacher candidate

    Science.gov (United States)

    Wisanti; Astriani, D.

    2018-04-01

    The purpose of this study was analyze the competencies of science teacher candidate after the bryological exploration. The intended competence of science teacher candidate was the ability to apply the concept and science ability to explore plant diversity that could be found around the environment.This field trip was conducted by exploring liverworts, hornworts, and mosses as well. This descriptive research was conducted during March until April 2017 at Universitas Negeri Surabaya (UNESA) and Sumber Brantas Arboretum in Malang, as the location of exploration. The subjects of this study were 76 candidate of teachers from science educations department, which is divided into three classes. The competences observed on this study were describing, identifying, collecting specimens, furthermore. The research instruments were observation sheets, product assessment sheets, and response questionnaire. The data were analyzed descriptive-quantitatively, in percentage and then categorized. The results of this study indicated that: the describing skill was categorized as ‘good’ identifying skill and collecting bryophytes was categorized as ‘very good’ and communicating skills was categorized ‘good’. In addition, the teacher candidates gave a very good response to field-trip-based learning. It can be concluded that the bryological exploration can develop the competences of science teacher candidates of Science Education Department of UNESA.

  16. Ranking candidate disease genes from gene expression and protein interaction: a Katz-centrality based approach.

    Directory of Open Access Journals (Sweden)

    Jing Zhao

    Full Text Available Many diseases have complex genetic causes, where a set of alleles can affect the propensity of getting the disease. The identification of such disease genes is important to understand the mechanistic and evolutionary aspects of pathogenesis, improve diagnosis and treatment of the disease, and aid in drug discovery. Current genetic studies typically identify chromosomal regions associated specific diseases. But picking out an unknown disease gene from hundreds of candidates located on the same genomic interval is still challenging. In this study, we propose an approach to prioritize candidate genes by integrating data of gene expression level, protein-protein interaction strength and known disease genes. Our method is based only on two, simple, biologically motivated assumptions--that a gene is a good disease-gene candidate if it is differentially expressed in cases and controls, or that it is close to other disease-gene candidates in its protein interaction network. We tested our method on 40 diseases in 58 gene expression datasets of the NCBI Gene Expression Omnibus database. On these datasets our method is able to predict unknown disease genes as well as identifying pleiotropic genes involved in the physiological cellular processes of many diseases. Our study not only provides an effective algorithm for prioritizing candidate disease genes but is also a way to discover phenotypic interdependency, cooccurrence and shared pathophysiology between different disorders.

  17. Finding gene regulatory network candidates using the gene expression knowledge base.

    Science.gov (United States)

    Venkatesan, Aravind; Tripathi, Sushil; Sanz de Galdeano, Alejandro; Blondé, Ward; Lægreid, Astrid; Mironov, Vladimir; Kuiper, Martin

    2014-12-10

    Network-based approaches for the analysis of large-scale genomics data have become well established. Biological networks provide a knowledge scaffold against which the patterns and dynamics of 'omics' data can be interpreted. The background information required for the construction of such networks is often dispersed across a multitude of knowledge bases in a variety of formats. The seamless integration of this information is one of the main challenges in bioinformatics. The Semantic Web offers powerful technologies for the assembly of integrated knowledge bases that are computationally comprehensible, thereby providing a potentially powerful resource for constructing biological networks and network-based analysis. We have developed the Gene eXpression Knowledge Base (GeXKB), a semantic web technology based resource that contains integrated knowledge about gene expression regulation. To affirm the utility of GeXKB we demonstrate how this resource can be exploited for the identification of candidate regulatory network proteins. We present four use cases that were designed from a biological perspective in order to find candidate members relevant for the gastrin hormone signaling network model. We show how a combination of specific query definitions and additional selection criteria derived from gene expression data and prior knowledge concerning candidate proteins can be used to retrieve a set of proteins that constitute valid candidates for regulatory network extensions. Semantic web technologies provide the means for processing and integrating various heterogeneous information sources. The GeXKB offers biologists such an integrated knowledge resource, allowing them to address complex biological questions pertaining to gene expression. This work illustrates how GeXKB can be used in combination with gene expression results and literature information to identify new potential candidates that may be considered for extending a gene regulatory network.

  18. A novel method for direct solder bump pull testing using lead-free solders

    Science.gov (United States)

    Turner, Gregory Alan

    This thesis focuses on the design, fabrication, and evaluation of a new method for testing the adhesion strength of lead-free solders, named the Isotraction Bump Pull method (IBP). In order to develop a direct solder joint-strength testing method that did not require customization for different solder types, bump sizes, specific equipment, or trial-and-error, a combination of two widely used and accepted standards was created. First, solder bumps were made from three types of lead free solder were generated on untreated copper PCB substrates using an in-house fabricated solder bump-on-demand generator, Following this, the newly developed method made use of a polymer epoxy to encapsulate the solder bumps that could then be tested under tension using a high precision universal vertical load machine. The tests produced repeatable and predictable results for each of the three alloys tested that were in agreement with the relative behavior of the same alloys using other testing methods in the literature. The median peak stress at failure for the three solders tested were 2020.52 psi, 940.57 psi, and 2781.0 psi, and were within one standard deviation of the of all data collected for each solder. The assumptions in this work that brittle fracture occurred through the Intermetallic Compound layer (IMC) were validated with the use of Energy-Dispersive X-Ray Spectrometry and high magnification of the fractured surface of both newly exposed sides of the test specimens. Following this, an examination of the process to apply the results from the tensile tests into standard material science equations for the fracture of the systems was performed..

  19. Comparative Evaluation of Marginal Accuracy of a Cast Fixed Partial Denture Compared to Soldered Fixed Partial Denture Made of Two Different Base Metal Alloys and Casting Techniques: An In vitro Study.

    Science.gov (United States)

    Jei, J Brintha; Mohan, Jayashree

    2014-03-01

    The periodontal health of abutment teeth and the durability of fixed partial denture depends on the marginal adaptation of the prosthesis. Any discrepancy in the marginal area leads to dissolution of luting agent and plaque accumulation. This study was done with the aim of evaluating the accuracy of marginal fit of four unit crown and bridge made up of Ni-Cr and Cr-Co alloys under induction and centrifugal casting. They were compared to cast fixed partial denture (FPD) and soldered FPD. For the purpose of this study a metal model was fabricated. A total of 40 samples (4-unit crown and bridge) were prepared in which 20 Cr-Co samples and 20 Ni-Cr samples were fabricated. Within these 20 samples of each group 10 samples were prepared by induction casting technique and other 10 samples with centrifugal casting technique. The cast FPD samples obtained were seated on the model and the samples were then measured with travelling microscope having precision of 0.001 cm. Sectioning of samples was done between the two pontics and measurements were made, then the soldering was made with torch soldering unit. The marginal discrepancy of soldered samples was measured and all findings were statistically analysed. The results revealed minimal marginal discrepancy with Cr-Co samples when compared to Ni-Cr samples done under induction casting technique. When compared to cast FPD samples, the soldered group showed reduced marginal discrepancy.

  20. Physics of Failure as a Basis for Solder Elements Reliability Assessment in Wind Turbines

    DEFF Research Database (Denmark)

    Kostandyan, Erik; Sørensen, John Dalsgaard

    2012-01-01

    description of the reliability. A physics of failure approach is applied. A SnAg solder component used in power electronics is used as an example. Crack propagation in the SnAg solder is modeled and a model to assess the accumulated plastic strain is proposed based on a physics of failure approach. Based...... on the proposed model it is described how to find the accumulated linear damage and reliability levels for a given temperature loading profile. Using structural reliability methods the reliability levels of the electrical components are assessed by introducing scale factors for stresses....

  1. A Hodge dual for soldered bundles

    International Nuclear Information System (INIS)

    Lucas, Tiago Gribl; Pereira, J G

    2009-01-01

    In order to account for all possible contractions allowed by the presence of the solder form, a generalized Hodge dual is defined for the case of soldered bundles. Although for curvature the generalized dual coincides with the usual one, for torsion it gives a completely new dual definition. Starting from the standard form of a gauge Lagrangian for the translation group, the generalized Hodge dual yields precisely the Lagrangian of the teleparallel equivalent of general relativity, and consequently also the Einstein-Hilbert Lagrangian of general relativity

  2. Commentary: Photothermal effects of laser tissue soldering

    International Nuclear Information System (INIS)

    Menovsky, T.; Beek, J.F.; Gemert, M.J.C. van

    1999-01-01

    freezing and thawing induces extracellular and intracellular damage. The study is methodologically sound, and the findings in agreement with those of previous studies, i.e. increasing the concentration of the solder results in a greater tensile strength of the bonded tissue and the higher the tissue temperature the greater the thermal damage. As proteins are believed to be the primary component of the welding process, topical applied proteins, used as solders, may provide the necessary amount of protein for welding and result in a greater tensile strength (Poppas et al 1992). A surprising finding is that no colour changes were observed at the irradiances producing optimal tensile strength (corresponding to a temperature of 85 deg. C), as it is above the denaturisation temperature of proteins and logically would be expected to result in some colour changes. Availability and cost are the biggest obstacles to the widespread use of lasers in tissue welding. Most lasers are not equipped with a stable milliwatt mode and/or a micromanipulator. Sutures, on the contrary, are cheap, reliable and always readily available. From a technical point of view, elements of the laser welding technique are unfamiliar to most surgeons. Therefore, acquisition of technical skills and handling of the laser is essential in a laboratory set-up before proceeding to the clinic. For repair of tissues in humans, placement of sutures seems to be mandatory to facilitate manipulation of the tissue during laser irradiation and to lower the risk of post-operative dehiscence. To use the laser only to avoid the placement of extra sutures (and thus proceeding to standard suture repair) seems, at present, unjustified as many studies have failed to show significant results in favour of laser welding. The end point in tissue welding is, at the moment, based on visual changes of the tissue and the surgeon must 'see and feel' whether the welding is complete. It is important that many investigations continue in the

  3. SINGLE IMAGE CAMERA CALIBRATION IN CLOSE RANGE PHOTOGRAMMETRY FOR SOLDER JOINT ANALYSIS

    Directory of Open Access Journals (Sweden)

    D. Heinemann

    2016-06-01

    Full Text Available Printed Circuit Boards (PCB play an important role in the manufacturing of electronic devices. To ensure a correct function of the PCBs a certain amount of solder paste is needed during the placement of components. The aim of the current research is to develop an real-time, closed-loop solution for the analysis of the printing process where solder is printed onto PCBs. Close range photogrammetry allows for determination of the solder volume and a subsequent correction if necessary. Photogrammetry is an image based method for three dimensional reconstruction from two dimensional image data of an object. A precise camera calibration is indispensable for an accurate reconstruction. In our certain application it is not possible to use calibration methods with two dimensional calibration targets. Therefore a special calibration target was developed and manufactured, which allows for single image camera calibration.

  4. Laser assisted soldering: microdroplet accumulation with a microjet device.

    Science.gov (United States)

    Chan, E K; Lu, Q; Bell, B; Motamedi, M; Frederickson, C; Brown, D T; Kovach, I S; Welch, A J

    1998-01-01

    We investigated the feasibility of a microjet to dispense protein solder for laser assisted soldering. Successive micro solder droplets were deposited on rat dermis and bovine intima specimens. Fixed laser exposure was synchronized with the jetting of each droplet. After photocoagulation, each specimen was cut into two halves at the center of solder coagulum. One half was fixed immediately, while the other half was soaked in phosphate-buffered saline for a designated hydration period before fixation (1 hour, 1, 2, and 7 days). After each hydration period, all tissue specimens were prepared for scanning electron microscopy (SEM). Stable solder coagulum was created by successive photocoagulation of microdroplets even after the soldered tissue exposed to 1 week of hydration. This preliminary study suggested that tissue soldering with successive microdroplets is feasible even with fixed laser parameters without active feedback control.

  5. Effect of trace elements on the interface reactions between two lead-free solders and copper or nickel substrates

    Directory of Open Access Journals (Sweden)

    Soares D.

    2007-01-01

    Full Text Available Traditional Sn-Pb solder alloys are being replaced, because of environmental and health concerns about lead toxicity. Among some alternative alloy systems, the Sn-Zn and Sn-Cu base alloy systems have been studied and reveal promising properties. The reliability of a solder joint is affected by the solder/substrate interaction and the nature of the layers formed at the interface. The solder/substrate reactions, for Sn-Zn and Sn-Cu base solder alloys, were evaluated in what concerns the morphology and chemical composition of the interface layers. The effect of the addition of P, at low levels, on the chemical composition of the layers present at the interface was studied. The phases formed at the interface between the Cu or Ni substrate and a molten lead-free solder at 250ºC, were studied for different stage times and alloy compositions. The melting temperatures, of the studied alloys, were determined by Differential Scanning Calorimetry (DSC. Identification of equilibrium phases formed at the interface layer, and the evaluation of their chemical composition were performed by Scanning Electron Microscopy (SEM/EDS. Different interface characteristics were obtained, namely for the alloys containing Zn. The obtained IML layer thickness was compared, for both types of alloy systems.

  6. A review of typical thermal fatigue failure models for solder joints of electronic components

    Science.gov (United States)

    Li, Xiaoyan; Sun, Ruifeng; Wang, Yongdong

    2017-09-01

    For electronic components, cyclic plastic strain makes it easier to accumulate fatigue damage than elastic strain. When the solder joints undertake thermal expansion or cold contraction, different thermal strain of the electronic component and its corresponding substrate is caused by the different coefficient of thermal expansion of the electronic component and its corresponding substrate, leading to the phenomenon of stress concentration. So repeatedly, cracks began to sprout and gradually extend [1]. In this paper, the typical thermal fatigue failure models of solder joints of electronic components are classified and the methods of obtaining the parameters in the model are summarized based on domestic and foreign literature research.

  7. Reliability of Wind Turbine Components-Solder Elements Fatigue Failure

    DEFF Research Database (Denmark)

    Kostandyan, Erik; Sørensen, John Dalsgaard

    2012-01-01

    on the temperature mean and temperature range. Constant terms and model errors are estimated. The proposed methods are useful to predict damage values for solder joint in power electrical components. Based on the proposed methods it is described how to find the damage level for a given temperature loading profile....... The proposed methods are discussed for application in reliability assessment of Wind Turbine’s electrical components considering physical, model and measurement uncertainties. For further research it is proposed to evaluate damage criteria for electrical components due to the operational temperature...

  8. THE POSSIBILITY OF USING LASER-ULTRASOUND TO MONITOR THE QUALITY SOLDERED CONNECTIONS CHAMBERS OF LIQUID ROCKET ENGINES

    Directory of Open Access Journals (Sweden)

    N. V. Astredinova

    2014-01-01

    Full Text Available During the manufacturing process to the design of modern liquid rocket engines are presented important requirements, such as minimum weight, maximum stiffness and strength of nodes, maximum service life in operation, high reliability and quality of soldered and welded seams. Due to the high quality requirements soldered connections and the specific design of the nozzle, it became necessary in the development and testing of a new non-conventional non-destructive testing method – laser-ultrasound diagnosis. In accordance with regulatory guidelines, quality control soldered connections is allowed to use an acoustic kind of control methods of the reflected light, transmitted light, resonant, free vibration and acoustic emission. Attempts to use traditional methods of non-destructive testing did not lead to positive results. This is due primarily to the size of typical solder joint defects, as well as the structural features of the rocket engine, the data structure is not controllable. In connection with this, a new method that provides quality control soldered connections cameras LRE based on the thermo generation of ultrasound. Methods of ultrasonic flaw detection of photoacoustic effect, in most cases, have a number of advantages over methods that use standard (traditional piezo transducers. In the course of studies have found that the sensitivity of the laser-ultrasonic method and flaw detector UDL-2M can detect lack of adhesion in the solder joints on the upper edges of the nozzle in the sub-header area of the site.

  9. Automatic vetting of planet candidates from ground based surveys: Machine learning with NGTS

    Science.gov (United States)

    Armstrong, David J.; Günther, Maximilian N.; McCormac, James; Smith, Alexis M. S.; Bayliss, Daniel; Bouchy, François; Burleigh, Matthew R.; Casewell, Sarah; Eigmüller, Philipp; Gillen, Edward; Goad, Michael R.; Hodgkin, Simon T.; Jenkins, James S.; Louden, Tom; Metrailler, Lionel; Pollacco, Don; Poppenhaeger, Katja; Queloz, Didier; Raynard, Liam; Rauer, Heike; Udry, Stéphane; Walker, Simon R.; Watson, Christopher A.; West, Richard G.; Wheatley, Peter J.

    2018-05-01

    State of the art exoplanet transit surveys are producing ever increasing quantities of data. To make the best use of this resource, in detecting interesting planetary systems or in determining accurate planetary population statistics, requires new automated methods. Here we describe a machine learning algorithm that forms an integral part of the pipeline for the NGTS transit survey, demonstrating the efficacy of machine learning in selecting planetary candidates from multi-night ground based survey data. Our method uses a combination of random forests and self-organising-maps to rank planetary candidates, achieving an AUC score of 97.6% in ranking 12368 injected planets against 27496 false positives in the NGTS data. We build on past examples by using injected transit signals to form a training set, a necessary development for applying similar methods to upcoming surveys. We also make the autovet code used to implement the algorithm publicly accessible. autovet is designed to perform machine learned vetting of planetary candidates, and can utilise a variety of methods. The apparent robustness of machine learning techniques, whether on space-based or the qualitatively different ground-based data, highlights their importance to future surveys such as TESS and PLATO and the need to better understand their advantages and pitfalls in an exoplanetary context.

  10. Comparison of implant-abutment interface misfits after casting and soldering procedures.

    Science.gov (United States)

    Neves, Flávio Domingues das; Elias, Gisele Araújo; da Silva-Neto, João Paulo; de Medeiros Dantas, Lucas Costa; da Mota, Adérito Soares; Neto, Alfredo Júlio Fernandes

    2014-04-01

    The aim of this study was to compare vertical and horizontal adjustments of castable abutments after conducting casting and soldering procedures. Twelve external hexagonal implants (3.75 × 10 mm) and their UCLA abutments were divided according their manufacturer and abutment type: PUN (plastic UCLA, Neodent), PUC (plastic UCLA, Conexão), PU3i (plastic UCLA, Biomet 3i), and PUTN (plastic UCLA with Tilite milled base, Neodent). Three infrastructures of a fixed partial implant-supported bridge with 3 elements were produced for each group. The measurements of vertical (VM) and horizontal (HM) misfits were obtained via scanning electron microscopy after completion of casting and soldering. The corresponding values were determined to be biomechanically acceptable to the system, and the results were rated as a percentage. Statistical analysis establishes differences between groups by chi-square after procedures, and McNeman's test was applied to analyze the influence of soldering over casting (α ≤ .05). For the values of VM and HM, respectively, when the casting process was complete, it was observed that 83.25% and 100% (PUTN), 33.3% and 27.75% (PUN), 33.3% and 88.8% (PUC), 33.3% and 94.35% (PU3i) represented acceptable values. After completing the requisite soldering, acceptable values were 50% and 94.35% (PUTN), 16.6% and 77.7% (PUN), 38.55% and 77.7% (PUC), and 27.75% and 94.35% (PU3i). Within the limitations of this study, it can be concluded that the premachined abutments presented more acceptable VM values. The HM values were within acceptable limits before and after the soldering procedure for most groups. Further, the soldering procedure resulted in an increase of VM in all groups.

  11. An Approach for Impression Creep of Lead Free Microelectronic Solders

    Science.gov (United States)

    Anastasio, Onofrio A.

    2002-06-01

    Currently, the microelectronics industry is transitioning from lead-containing to lead-free solders in response to legislation in the EU and Japan. Before an alternative alloy can be designated as a replacement for current Pb-Sn extensive testing must be accomplished. One major characteristic of the alloy that must be considered is creep. Traditionally, creep testing requires numerous samples and a long tin, which thwarts the generation of comprehensive creep databases for difficult to prepare samples such as microelectronic solder joints. However, a relatively new technique, impression creep enables us to rapidly generate creep data. This test uses a cylindrical punch with a flat end to make an impression on the surface of a specimen under constant load. The steady state velocity of the indenter is found to have the same stress and temperature dependence as the conventional unidirectional creep test using bulk specimens. This thesis examines impression creep tests of eutectic Sn-Ag. A testing program and apparatus was developed constructed based on a servo hydraulic test frame. The apparatus is capable of a load resolution of 0.01N with a stability of plus/minus 0.1N, and a displacement resolution of 0.05 microns with a stability of plus/minus 0.1 microns. Samples of eutectic Sn-Ag solder were reflowed to develop the microstructure used in microelectronic packaging. Creep tests were conducted at various stresses and temperatures and showed that coarse microstructures creep more rapidly than the microstructures in the tested regime.

  12. Transected sciatic nerve repair by diode laser protein soldering.

    Science.gov (United States)

    Fekrazad, Reza; Mortezai, Omid; Pedram, MirSepehr; Kalhori, Katayoun Am; Joharchi, Khojasteh; Mansoori, Korosh; Ebrahimi, Roja; Mashhadiabbas, Fatemeh

    2017-08-01

    Despite advances in microsurgical techniques, repair of peripheral nerve injuries (PNI) is still a major challenge in regenerative medicine. The standard treatment for PNI includes suturing and anasthomosis of the transected nerve. The objective of this study was to compare neurorraphy (nerve repair) using standard suturingto diode laser protein soldering on the functional recovery of transected sciatic nerves. Thirty adult male Fischer-344 Wistar rats were randomly assigned to 3 groups: 1. The control group, no repair, 2. the standard of care suture group, and 3. The laser/protein solder group. For all three groups, the sciatic nerve was transected and the repair was done immediately. For the suture repair group, 10.0 prolene suture was used and for the laser/protein solder group a diode laser (500mW output power) in combination with bovine serum albumen and indocyanine green dye was used. Behavioral assessment by sciatic functional index was done on all rats biweekly. At 12weeks post-surgery, EMG recordings were done on all the rats and the rats were euthanized for histological evaluation of the sciatic nerves. The one-way ANOVA test was used for statistical analysis. The average time required to perform the surgery was significantly shorter for the laser-assisted nerve repair group compared to the suture group. The EMG evaluation revealed no difference between the two groups. Based on the sciatic function index the laser group was significantly better than the suture group after 12weeks (pneurorraphy using standard suturing methods. Copyright © 2017 Elsevier B.V. All rights reserved.

  13. Processing and Characterization of NiTi Shape Memory Alloy Particle Reinforced Sn-In Solders

    National Research Council Canada - National Science Library

    Chung, Kohn C

    2006-01-01

    .... In previous work, it was proposed that reinforcement of solder by NiTi shape memory alloy particles to form smart composite solder reduces the inelastic strain of the solder and hence, may enhance...

  14. Candidate Smoke Region Segmentation of Fire Video Based on Rough Set Theory

    Directory of Open Access Journals (Sweden)

    Yaqin Zhao

    2015-01-01

    Full Text Available Candidate smoke region segmentation is the key link of smoke video detection; an effective and prompt method of candidate smoke region segmentation plays a significant role in a smoke recognition system. However, the interference of heavy fog and smoke-color moving objects greatly degrades the recognition accuracy. In this paper, a novel method of candidate smoke region segmentation based on rough set theory is presented. First, Kalman filtering is used to update video background in order to exclude the interference of static smoke-color objects, such as blue sky. Second, in RGB color space smoke regions are segmented by defining the upper approximation, lower approximation, and roughness of smoke-color distribution. Finally, in HSV color space small smoke regions are merged by the definition of equivalence relation so as to distinguish smoke images from heavy fog images in terms of V component value variety from center to edge of smoke region. The experimental results on smoke region segmentation demonstrated the effectiveness and usefulness of the proposed scheme.

  15. Children's Literacy Growth, and Candidates' and Teachers' Professional Development Resulting from a PDS-Based Initial Certification Literacy Course

    Science.gov (United States)

    Rosenthal, Julie L.; Donnantuono, Marie; Lebron, Mary; Flynn, Christina

    2017-01-01

    This paper reports the effects on children, teacher candidates, and classroom teachers of a PDS-based initial certification course in the teaching of literacy. In this course, teacher candidates work with individual struggling readers on a range of literacy tasks, and the classroom teacher and university faculty member serve as course…

  16. Mechanism of Solder Joint Cracks in Anisotropic Conductive Films Bonding and Solutions: Delaying Hot-Bar Lift-Up Time and Adding Silica Fillers

    Directory of Open Access Journals (Sweden)

    Shuye Zhang

    2018-01-01

    Full Text Available Micron sizes solder metallurgical joints have been applied in a thin film application of anisotropic conductive film and benefited three general advantages, such as lower joint resistance, higher power handling capability, and reliability, when compared with pressure based contact of metal conductor balls. Recently, flex-on-board interconnection has become more and more popular for mobile electronic applications. However, crack formation of the solder joint crack was occurred at low temperature curable acrylic polymer resins after bonding processes. In this study, the mechanism of SnBi58 solder joint crack at low temperature curable acrylic adhesive was investigated. In addition, SnBi58 solder joint cracks can be significantly removed by increasing the storage modulus of adhesives instead of coefficient of thermal expansion. The first approach of reducing the amount of polymer rebound can be achieved by using an ultrasonic bonding method to maintain a bonding pressure on the SnBi58 solder joints cooling to room temperature. The second approach is to increase storage modulus of adhesives by adding silica filler into acrylic polymer resins to prevent the solder joint from cracking. Finally, excellent acrylic based SnBi58 solder joints reliability were obtained after 1000 cycles thermal cycling test.

  17. Effect of Solder Flux Residues on Corrosion of Electronics

    DEFF Research Database (Denmark)

    Hansen, Kirsten Stentoft; Jellesen, Morten Stendahl; Møller, Per

    2009-01-01

    Flux from ‘No Clean’ solder processes can cause reliability problems in the field due to aggressive residues, which may be electrical conducting or corrosive in humid environments. The solder temperature during a wave solder process is of great importance to the amount of residues left on a PCBA...... testing and use in the field, consequences and recommendations are given. Failures, caused by harsh[1] customer environments, are not covered in this paper....

  18. Development of Pb-Free Nanocomposite Solder Alloys

    Directory of Open Access Journals (Sweden)

    Animesh K. Basak

    2018-04-01

    Full Text Available As an alternative to conventional Pb-containing solder material, Sn–Ag–Cu (SAC based alloys are at the forefront despite limitations associated with relatively poor strength and coarsening of grains/intermetallic compounds (IMCs during aging/reflow. Accordingly, this study examines the improvement of properties of SAC alloys by incorporating nanoparticles in it. Two different types of nanoparticles were added in monolithic SAC alloy: (1 Al2O3 or (2 Fe and their effect on microstructure and thermal properties were investigated. Addition of Fe nanoparticles leads to the formation of FeSn2 IMCs alongside Ag3Sn and Cu6Sn5 from monolithic SAC alloy. Addition of Al2O3 nano-particles do not contribute to phase formation, however, remains dispersed along primary β-Sn grain boundaries and act as a grain refiner. As the addition of either Fe or Al2O3 nano-particles do not make any significant effect on thermal behavior, these reinforced nanocomposites are foreseen to provide better mechanical characteristics with respect to conventional monolithic SAC solder alloys.

  19. Corrosion of candidate iron-base waste package structural barrier materials in moist salt environments

    International Nuclear Information System (INIS)

    Westerman, R.E.; Pitman, S.G.

    1984-11-01

    Mild steels are considered to be strong candidates for waste package structural barrier (e.g., overpack) applications in salt repositories. Corrosion rates of these materials determined in autoclave tests utilizing a simulated intrusion brine based on Permian Basin core samples are low, generally <25 μm (1 mil) per year. When the steels are exposed to moist salts containing simulated inclusion brines, the corrosion rates are found to increase significantly. The magnesium in the inclusion brine component of the environment is believed to be responsible for the increased corrosion rates. 1 reference, 4 figures, 2 tables

  20. The Shear Strength and Fracture Behavior of Sn-Ag- xSb Solder Joints with Au/Ni-P/Cu UBM

    Science.gov (United States)

    Lee, Hwa-Teng; Hu, Shuen-Yuan; Hong, Ting-Fu; Chen, Yin-Fa

    2008-06-01

    This study investigates the effects of Sb addition on the shear strength and fracture behavior of Sn-Ag-based solders with Au/Ni-P/Cu underbump metallization (UBM) substrates. Sn-3Ag- xSb ternary alloy solder joints were prepared by adding 0 wt.% to 10 wt.% Sb to a Sn-3.5Ag alloy and joining them with Au/Ni-P/Cu UBM substrates. The solder joints were isothermally stored at 150°C for up to 625 h to study their microstructure and interfacial reaction with the UBM. Single-lap shear tests were conducted to evaluate the mechanical properties, thermal resistance, and failure behavior. The results show that UBM effectively suppressed intermetallic compound (IMC) formation and growth during isothermal storage. The Sb addition helped to refine the Ag3Sn compounds, further improving the shear strength and thermal resistance of the solders. The fracture behavior evolved from solder mode toward the mixed mode and finally to the IMC mode with increasing added Sb and isothermal storage time. However, SnSb compounds were found in the solder with 10 wt.% Sb; they may cause mechanical degradation of the solder after long-term isothermal storage.

  1. Global Prioritization of Disease Candidate Metabolites Based on a Multi-omics Composite Network

    Science.gov (United States)

    Yao, Qianlan; Xu, Yanjun; Yang, Haixiu; Shang, Desi; Zhang, Chunlong; Zhang, Yunpeng; Sun, Zeguo; Shi, Xinrui; Feng, Li; Han, Junwei; Su, Fei; Li, Chunquan; Li, Xia

    2015-01-01

    The identification of disease-related metabolites is important for a better understanding of metabolite pathological processes in order to improve human medicine. Metabolites, which are the terminal products of cellular regulatory process, can be affected by multi-omic processes. In this work, we propose a powerful method, MetPriCNet, to predict and prioritize disease candidate metabolites based on integrated multi-omics information. MetPriCNet prioritized candidate metabolites based on their global distance similarity with seed nodes in a composite network, which integrated multi-omics information from the genome, phenome, metabolome and interactome. After performing cross-validation on 87 phenotypes with a total of 602 metabolites, MetPriCNet achieved a high AUC value of up to 0.918. We also assessed the performance of MetPriCNet on 18 disease classes and found that 4 disease classes achieved an AUC value over 0.95. Notably, MetPriCNet can also predict disease metabolites without known disease metabolite knowledge. Some new high-risk metabolites of breast cancer were predicted, although there is a lack of known disease metabolite information. A predicted disease metabolic landscape was constructed and analyzed based on the results of MetPriCNet for 87 phenotypes to help us understand the genetic and metabolic mechanism of disease from a global view. PMID:26598063

  2. Reliability Study of Solder Paste Alloy for the Improvement of Solder Joint at Surface Mount Fine-Pitch Components

    Directory of Open Access Journals (Sweden)

    Mohd Nizam Ab. Rahman

    2014-12-01

    Full Text Available The significant increase in metal costs has forced the electronics industry to provide new materials and methods to reduce costs, while maintaining customers’ high-quality expectations. This paper considers the problem of most electronic industries in reducing costly materials, by introducing a solder paste with alloy composition tin 98.3%, silver 0.3%, and copper 0.7%, used for the construction of the surface mount fine-pitch component on a Printing Wiring Board (PWB. The reliability of the solder joint between electronic components and PWB is evaluated through the dynamic characteristic test, thermal shock test, and Taguchi method after the printing process. After experimenting with the dynamic characteristic test and thermal shock test with 20 boards, the solder paste was still able to provide a high-quality solder joint. In particular, the Taguchi method is used to determine the optimal control parameters and noise factors of the Solder Printer (SP machine, that affects solder volume and solder height. The control parameters include table separation distance, squeegee speed, squeegee pressure, and table speed of the SP machine. The result shows that the most significant parameter for the solder volume is squeegee pressure (2.0 mm, and the solder height is the table speed of the SP machine (2.5 mm/s.

  3. Incorporation of Interfacial Intermetallic Morphology in Fracture Mechanism Map for Sn-Ag-Cu Solder Joints

    Science.gov (United States)

    Huang, Z.; Kumar, P.; Dutta, I.; Sidhu, R.; Renavikar, M.; Mahajan, R.

    2014-01-01

    A fracture mechanism map (FMM) is a powerful tool which correlates the fracture behavior of a material to its microstructural characteristics in an explicit and convenient way. In the FMM for solder joints, an effective thickness of the interfacial intermetallic compound (IMC) layer ( t eff) and the solder yield strength ( σ ys,eff) are used as abscissa and ordinate axes, respectively, as these two predominantly affect the fracture behavior of solder joints. Earlier, a definition of t eff, based on the uniform thickness of IMC ( t u) and the average height of the IMC scallops ( t s), was proposed and shown to aptly explain the fracture behavior of solder joints on Cu. This paper presents a more general definition of t eff that is more widely applicable to a range of metallizations, including Cu and electroless nickel immersion gold (ENIG). Using this new definition of t eff, mode I FMM for SAC387/Cu joints has been updated and its validity was confirmed. A preliminary FMM for SAC387/Cu joints with ENIG metallization is also presented.

  4. Microstructural and mechanical properties analysis of extruded Sn–0.7Cu solder alloy

    Directory of Open Access Journals (Sweden)

    Abdoul-Aziz Bogno

    2015-01-01

    Full Text Available The properties and performance of lead-free solder alloys such as fluidity and wettability are defined by the alloy composition and solidification microstructure. Rapid solidification of metallic alloys is known to result in refined microstructures with reduced microsegregation and improved mechanical properties of the final products as compared to normal castings. The rapidly solidified Sn-based solders by melt spinning were shown to be suitable for soldering with low temperature and short soldering duration. In the present study, rapidly solidified Sn–0.7 wt.%Cu droplets generated by impulse atomization (IA were achieved as well as directional solidification under transient conditions at lower cooling rate. This paper reports on a comparative study of the rapidly solidified and the directionally solidified samples. Different but complementary characterization techniques were used to fully analyze the solidification microstructures of the samples obtained under the two cooling regimes. These include X-ray diffractometry (XRD and scanning electron microscopy (SEM. In order to compare the tensile strength and elongation to fracture of the directionally solidified ingot and strip castings with the atomized droplet, compaction and extrusion of the latter were carried out. It was shown that more balanced and superior tensile mechanical properties are available for the hot extruded samples from compacted as-atomized Sn–0.7 wt.%Cu droplets. Further, elongation-to-fracture was 2–3× higher than that obtained for the directionally solidified samples.

  5. Design and Experiment of a Solder Paste Jetting System Driven by a Piezoelectric Stack

    Directory of Open Access Journals (Sweden)

    Shoudong Gu

    2016-06-01

    Full Text Available To compensate for the insufficiency and instability of solder paste dispensing and printing that are used in the SMT (Surface Mount Technology production process, a noncontact solder paste jetting system driven by a piezoelectric stack based on the principle of the nozzle-needle-system is introduced in this paper, in which a miniscule gap exists between the nozzle and needle during the jetting process. Here, the critical jet ejection velocity is discussed through theoretical analysis. The relations between ejection velocity and needle structure, needle velocity, and nozzle diameter were obtained by FLUENT software. Then, the prototype of the solder paste jetting system was fabricated, and the performance was verified by experiments. The effects of the gap between nozzle and needle, the driving voltage, and the nozzle diameter on the jetting performance and droplet diameter were obtained. Solder paste droplets 0.85 mm in diameter were produced when the gap between the nozzle and needle was adjusted to 10 μm, the driving voltage to 80 V, the nozzle diameter to 0.1 mm, and the variation of the droplet diameter was within ±3%.

  6. A Candidate Vegetation Index of Biological Integrity Based on Species Dominance and Habitat Fidelity

    Science.gov (United States)

    Gara, Brian D; Stapanian, Martin A.

    2015-01-01

    Indices of biological integrity of wetlands based on vascular plants (VIBIs) have been developed in many areas of the USA and are used in some states to make critical management decisions. An underlying concept of all VIBIs is that they respond negatively to disturbance. The Ohio VIBI (OVIBI) is calculated from 10 metrics, which are different for each wetland vegetation class. We present a candidate vegetation index of biotic integrity based on floristic quality (VIBI-FQ) that requires only two metrics to calculate an overall score regardless of vegetation class. These metrics focus equally on the critical ecosystem elements of diversity and dominance as related to a species’ degree of fidelity to habitat requirements. The indices were highly correlated but varied among vegetation classes. Both indices responded negatively with a published index of wetland disturbance in 261 Ohio wetlands. Unlike VIBI-FQ, however, errors in classifying wetland vegetation may lead to errors in calculating OVIBI scores. This is especially critical when assessing the ecological condition of rapidly developing ecosystems typically associated with wetland restoration and creation projects. Compared to OVIBI, the VIBI-FQ requires less field work, is much simpler to calculate and interpret, and can potentially be applied to all habitat types. This candidate index, which has been “standardized” across habitats, would make it easier to prioritize funding because it would score the “best” and “worst” of all habitats appropriately and allow for objective comparison across different vegetation classes.

  7. Network Based Integrated Analysis of Phenotype-Genotype Data for Prioritization of Candidate Symptom Genes

    Directory of Open Access Journals (Sweden)

    Xing Li

    2014-01-01

    Full Text Available Background. Symptoms and signs (symptoms in brief are the essential clinical manifestations for individualized diagnosis and treatment in traditional Chinese medicine (TCM. To gain insights into the molecular mechanism of symptoms, we develop a computational approach to identify the candidate genes of symptoms. Methods. This paper presents a network-based approach for the integrated analysis of multiple phenotype-genotype data sources and the prediction of the prioritizing genes for the associated symptoms. The method first calculates the similarities between symptoms and diseases based on the symptom-disease relationships retrieved from the PubMed bibliographic database. Then the disease-gene associations and protein-protein interactions are utilized to construct a phenotype-genotype network. The PRINCE algorithm is finally used to rank the potential genes for the associated symptoms. Results. The proposed method gets reliable gene rank list with AUC (area under curve 0.616 in classification. Some novel genes like CALCA, ESR1, and MTHFR were predicted to be associated with headache symptoms, which are not recorded in the benchmark data set, but have been reported in recent published literatures. Conclusions. Our study demonstrated that by integrating phenotype-genotype relationships into a complex network framework it provides an effective approach to identify candidate genes of symptoms.

  8. Soldering of copper-clad niobium--titanium superconductor composite

    International Nuclear Information System (INIS)

    Moorhead, A.J.; Woodhouse, J.J.; Easton, D.S.

    1977-04-01

    When superconductivity is applied to various electrical devices, the joining of the superconducting material and the performance of the joints are generally crucial to the successful operation of the system. Although many techniques are being considered for joining composite superconductors, soldering is the most common. We determined the wetting and flow behavior of various solder and flux combinations on a copper-clad Nb-Ti composite, developed equipment and techniques for soldering and inspection of lap joints, and determined the shear strength of joints at temperatures down to -269 0 C (4 0 K). We studied 15 solders and 17 commercial and experimental fluxes in the wettability and flow tests. A resistance unit was built for soldering test specimens. A series of samples soldered with 80 Pb-20 Sn, 83 Pb-15 Sn-2 Sb, 97.5 Pb-1.5 Ag-1 Sn, 80 In-15 Pb-5 Ag, or 25 In-37.5 Pb-37.5 Sn (wt percent) was inspected by three nondestructive techniques. Through-transmission ultrasound gave the best correlation with nonbond areas revealed in peel tests. Single-lap shear specimens soldered with 97.5 Pb-1.5 Ag-1 Sn had the highest strength (10.44 ksi, 72 MPa) and total elongation (0.074 in., 1.88 mm) at -269 0 C (4 0 K) of four solders tested

  9. Innovation in values based public health nursing student selection: A qualitative evaluation of candidate and selection panel member perspectives.

    Science.gov (United States)

    McGraw, Caroline; Abbott, Stephen; Brook, Judy

    2018-02-19

    Values based recruitment emerges from the premise that a high degree of value congruence, or the extent to which an individual's values are similar to those of the health organization in which they work, leads to organizational effectiveness. The aim of this evaluation was to explore how candidates and selection panel members experienced and perceived innovative methods of values based public health nursing student selection. The evaluation was framed by a qualitative exploratory design involving semi-structured interviews and a group exercise. Data were thematically analyzed. Eight semi-structured interviews were conducted with selection panel members. Twenty-two successful candidates took part in a group exercise. The use of photo elicitation interviews and situational judgment questions in the context of selection to a university-run public health nursing educational program was explored. While candidates were ambivalent about the use of photo elicitation interviews, with some misunderstanding the task, selection panel members saw the benefits for improving candidate expression and reducing gaming and deception. Situational interview questions were endorsed by candidates and selection panel members due to their fidelity to real-life problems and the ability of panel members to discern value congruence from candidates' responses. Both techniques offered innovative solutions to candidate selection for entry to the public health nursing education program. © 2018 Wiley Periodicals, Inc.

  10. CO2 temperature-controlled laser soldering of pig trachea incisions in vitro using flexible albumin bands

    Science.gov (United States)

    Sharvit, Dan; Vasilyev, Tamar; Vasserman, Irena; Simhon, David; Kariv, Naam; DeRowe, Ari; Katzir, Abraham

    2005-04-01

    Resection of a segment of the trachea is a procedure applied for the removal of cervical tumors invading the trachea, or for the treatment of severe tracheal stenosis. The current method of anastomosis is based on multiple sutures. The main drawbacks of this method are: 1) A long procedure time, 2) An air leakage, and 3) An inflammatory response to the sutures. In this study we evaluated the feasibility and effectiveness of the use of temperature controlled CO2 laser soldering of incisions in pig tracheas in vitro. A transverse incision was made in a separated pig trachea. A flexible albumin band was prepared and was laser soldered with albumin solder to the outer surface of the trachea, covering the incision. The soldered trachea ends were sealed and the burst pressure was measured. In a series of in vitro experiments, the mean burst pressure was found to be 230 mm Hg. These preliminary results demonstrated that laser soldering using a flexible albumin band may be a useful method for sealing an incision in the trachea.

  11. Electrical Resistance of Nb$_{3}$Sn/Cu Splices Produced by Electromagnetic Pulse Technology and Soft Soldering

    CERN Document Server

    Schoerling, D; Scheuerlein, C; Atieh, S; Schaefer, R

    2011-01-01

    The electrical interconnection of Nb$_{3}$Sn/Cu strands is a key issue for the construction of Nb$_{3}$Sn based damping ring wigglers and insertion devices for third generation light sources. We compare the electrical resistance of Nb$_{3}$Sn/Cu splices manufactured by solid state welding using Electromagnetic Pulse Technology (EMPT) with that of splices produced by soft soldering with two different solders. The resistance of splices produced by soft soldering depends strongly on the resistivity of the solder alloy at the operating temperature. By solid state welding splice resistances below 10 nOhm can be achieved with 1 cm strand overlap length only, which is about 4 times lower than the resistance of Sn96Ag4 soldered splices with the same overlap length. The comparison of experimental results with Finite Element simulations shows that the electrical resistance of EMPT welded splices is determined by the resistance of the stabilizing copper between the superconducting filaments and confirms that welding of ...

  12. Development of Sn-Ag-Cu-X Solders for Electronic Assembly by Micro-Alloying with Al

    Science.gov (United States)

    Boesenberg, Adam J.; Anderson, Iver E.; Harringa, Joel L.

    2012-07-01

    Of Pb-free solder choices, an array of solder alloys based on the Sn-Ag-Cu (SAC) ternary eutectic ( T eut = 217°C) composition have emerged with potential for broad use, including ball grid array (BGA) joints that cool slowly. This work investigated minor substitutional additions of Al (0.05Al), but the suppression effect faded for >0.20Al. Undercooling suppression did not correlate specifically with blade suppression since it became significant at 0.10Al and increased continuously with greater Al to 0.25Al. Surprisingly, an intermediate range of Al content (0.10 wt.% to 0.20 wt.% Al) promoted formation of significant populations of 2- μm to 5- μm faceted Cu-Al particles, identified as Cu33Al17, that clustered at the top of the solder joint matrix and exhibited extraordinary hardness. Clustering of Cu33Al17 was attributed to its buoyancy, from a lower density than Sn liquid, and its early position in the nucleation sequence within the solder matrix, permitting unrestricted migration to the top interface. Joint microstructures and implications for the full nucleation sequence for these SAC + Al solder joints are discussed, along with possible benefits from the clustered particles for improved thermal cycling resistance.

  13. Metabolomics-based promising candidate biomarkers and pathways in Alzheimer's disease.

    Science.gov (United States)

    Kang, Jian; Lu, Jingli; Zhang, Xiaojian

    2015-05-01

    Pathologically, loss of synapses and neurons, extracellular senile plaques and intracellular neurofibrillary tangles (NFTs) are observed in the brains of patients with Alzheimer's disease (AD). These features are associated with changes Aβ (amyloid β) 40, Aβ42, total tau and phosphorylated tau (p-tau), which are as definitely biomarkers for severe AD state. However, biomarkers for effectively diagnosing AD in the pre-clinical state for directing therapeutic strategies are lacking. Metabolic profiling as a powerful tool to identify new biomarkers is receiving increasing attention in AD. This review will focus on metabolomics-based detection of promising candidate biomarkers and pathways in AD to facilitate the discovery of new medicines and disease pathways.

  14. The effect of micro alloying on the microstructure evolution of Sn-Ag-Cu lead-free solder

    Science.gov (United States)

    Werden, Jesse

    The microelectronics industry is required to obtain alternative Pb-free soldering materials due to legal, environmental, and technological factors. As a joining material, solder provides an electrical and mechanical support in electronic assemblies and therefore, the properties of the solder are crucial to the durability and reliability of the solder joint and the function of the electronic device. One major concern with new Pb-free alternatives is that the microstructure is prone to microstructural coarsening over time which leads to inconsistent properties over the device's lifetime. Power aging the solder is a common method of stabilizing the microstructure for Pb-based alloys, however, it is unclear if this will be an appropriate solution to the microstructural coarsening of Pb-free solders. The goal of this work is to develop a better understanding of the coarsening process in new solder alloys and to suggest methods of stabilizing the solder microstructure. Microalloying is one potential solution to the microstructural coarsening problem. This experiment consists of a microstructural coarsening study of SAC305 in which each sample has been alloyed with one of three different solutes, directionally solidified at 100microm/s, and then aged at three different temperatures over a total period of 20 days. There are several important conclusions from this experiment. First, the coarsening kinetics of the intermetallics in the ternary eutectic follow the Ostwald ripening model where r3 in proprotional to t for each alloying constituent. Second, the activation energy for coarsening was found to be 68.1+/-10.3 kJ/mol for the SAC305 samples, Zn had the most significant increase in the activation energy increasing it to 88.8+/-34.9 kJ/mol for the SAC+Zn samples, Mn also increased the activation energy to 83.2+/-20.8 kJ/mol for the SAC+Mn samples, and Sb decreased the activation energy to 48.0+/-3.59 kJ/mol for the SAC+Sb samples. Finally, it was found that the

  15. Sequence-Based Introgression Mapping Identifies Candidate White Mold Tolerance Genes in Common Bean

    Directory of Open Access Journals (Sweden)

    Sujan Mamidi

    2016-07-01

    Full Text Available White mold, caused by the necrotrophic fungus (Lib. de Bary, is a major disease of common bean ( L.. WM7.1 and WM8.3 are two quantitative trait loci (QTL with major effects on tolerance to the pathogen. Advanced backcross populations segregating individually for either of the two QTL, and a recombinant inbred (RI population segregating for both QTL were used to fine map and confirm the genetic location of the QTL. The QTL intervals were physically mapped using the reference common bean genome sequence, and the physical intervals for each QTL were further confirmed by sequence-based introgression mapping. Using whole-genome sequence data from susceptible and tolerant DNA pools, introgressed regions were identified as those with significantly higher numbers of single-nucleotide polymorphisms (SNPs relative to the whole genome. By combining the QTL and SNP data, WM7.1 was located to a 660-kb region that contained 41 gene models on the proximal end of chromosome Pv07, while the WM8.3 introgression was narrowed to a 1.36-Mb region containing 70 gene models. The most polymorphic candidate gene in the WM7.1 region encodes a BEACH-domain protein associated with apoptosis. Within the WM8.3 interval, a receptor-like protein with the potential to recognize pathogen effectors was the most polymorphic gene. The use of gene and sequence-based mapping identified two candidate genes whose putative functions are consistent with the current model of pathogenicity.

  16. Microstructurally Adaptive Constitutive Relations and Reliability Assessment Protocols for Lead Free Solder

    Science.gov (United States)

    2015-05-05

    under bump metallurgy and solder joint geometry on Sn grain morphology in Pb free solder joints were examined. SnAgCu solder joints were examined for...free solder interconnects”, Sci. Technol. Weld . Join. 13, 732 (2008). [3.25] Terashima, S., Takahama, K., Nozaki, M., and Tanaka, M. Recrystallization

  17. Characterization of lead-free solders for electronic packaging

    Science.gov (United States)

    Ma, Hongtao

    The characterization of lead-free solders, especially after isothermal aging, is very important in order to accurately predict the reliability of solder joints. However, due to lack of experimental testing standards and the high homologous temperature of solder alloys (Th > 0.5T m even at room temperature), there are very large discrepancies in both the tensile and creep properties provided in current databases for both lead-free and Sn-Pb solder alloys. In this research, mechanical measurements of isothermal aging effects and the resulting changes in the materials behavior of lead-free solders were performed. A novel specimen preparation procedure was developed where the solder uniaxial test specimens are formed in high precision rectangular cross-section glass tubes using a vacuum suction process. Using specimens fabricated with the developed procedure, isothermal aging effects and viscoplastic material behavior evolution have been characterized for 95.5Sn-4.0Ag-0.5Cu (SAC405) and 96.5Sn-3.0Ag-0.5Cu (SAC305) lead-free solders, which are commonly used as the solder ball alloy in lead-free BGAs and other components. Analogous tests were performed with 63Sn-37Pb eutectic solder samples for comparison purposes. Up to 40% reduction in tensile strength was observed for water quenched specimens after two months of aging at room temperature. Creep deformation also increased dramatically with increasing aging durations. Microstructural changes during room temperature aging were also observed and recorded for the solder alloys and correlated with the observed mechanical behavior changes. Aging effects at elevated temperatures for up to 6 months were also investigated. Thermal aging caused significant tensile strength loss and deterioration of creep deformation. The thermal aging results also showed that after an initial tensile strength drop, the Sn-Pb eutectic solder reached a relatively stable stage after 200 hours of aging. However, for SAC alloy, both the tensile and

  18. Effect of solder bump size on interfacial reactions during soldering between Pb-free solder and Cu and Ni/ Pd/ Au surface finishes

    International Nuclear Information System (INIS)

    NorAkmal, F.; Ourdjini, A.; Azmah Hanim, M.A.; Siti Aisha, I.; Chin, Y.T.

    2007-01-01

    Flip chip technology provides the ultimate in high I/ O-density and count with superior electrical performance for interconnecting electronic components. Therefore, the study of the intermetallic compounds was conducted to investigate the effect of solder bumps sizes on several surface finishes which are copper and Electroless Nickel/ Electroless Palladium/ Immersion Gold (ENEPIG) which is widely used in electronics packaging as surface finish for flip-chip application nowadays. In this research, field emission scanning electron microscopy (FESEM) analysis was conducted to analyze the morphology and composition of intermetallic compounds (IMCs) formed at the interface between the solder and UBM. The IMCs between the SAC lead-free solder with Cu surface finish after reflow were mainly (Cu, Ni) 6 Sn 5 and Cu 6 Sn 5 . While the main IMCs formed between lead-free solder on ENEPIG surface finish are (Ni, Cu) 3 Sn 4 and Ni 3 Sn 4 . The results from FESEM with energy dispersive x-ray (EDX) have revealed that isothermal aging at 150 degree Celsius has caused the thickening and coarsening of IMCs as well as changing them into more spherical shape. The thickness of the intermetallic compounds in both finishes investigated was found to be higher in solders with smaller bump size. From the experimental results, it also appears that the growth rate of IMCs is higher when soldering on copper compared to ENEPIG finish. Besides that, the results also showed that the thickness of intermetallic compounds was found to be proportional to isothermal aging duration. (author)

  19. Accomplishing PETE Learning Standards and Program Accreditation through Teacher Candidates' Technology-Based Service Learning Projects

    Science.gov (United States)

    Gibbone, Anne; Mercier, Kevin

    2014-01-01

    Teacher candidates' use of technology is a component of physical education teacher education (PETE) program learning goals and accreditation standards. The methods presented in this article can help teacher candidates to learn about and apply technology as an instructional tool prior to and during field or clinical experiences. The goal in…

  20. Soldering formalism in noncommutative field theory: a brief note

    International Nuclear Information System (INIS)

    Ghosh, Subir

    2004-01-01

    In this Letter, I develop the soldering formalism in a new domain--the noncommutative planar field theories. The soldering mechanism fuses two distinct theories showing opposite or complimentary properties of some symmetry, taking into account the interference effects. The above mentioned symmetry is hidden in the composite (or soldered) theory. In the present work it is shown that a pair of noncommutative Maxwell-Chern-Simons theories, having opposite signs in their respective topological terms, can be consistently soldered to yield the Proca model (Maxwell theory with a mass term) with corrections that are at least quadratic in the noncommutativity parameter. We further argue that this model can be thought of as the noncommutative generalization of the Proca theory of ordinary spacetime. It is well known that abelian noncommutative gauge theory bears a close structural similarity with non-abelian gauge theory. This fact is manifested in a non-trivial way if the present Letter is compared with existing literature, where soldering of non-abelian models are discussed. Thus the present work further establishes the robustness of the soldering programme. The subtle role played by gauge invariance (or the lack of it), in the above soldering process, is revealed in an interesting way

  1. Fatigue and thermal fatigue of Pb-Sn solder joints

    International Nuclear Information System (INIS)

    Frear, D.; Grivas, D.; McCormack, M.; Tribula, D.; Morris, J.W. Jr.

    1987-01-01

    This paper presents a fundamental investigation of the fatigue and thermal fatigue characteristics, with an emphasis on the microstructural development during fatigue, of Sn-Pb solder joints. Fatigue tests were performed in simple shear on both 60Sn-40Pb and 5Sn-95Pb solder joints. Isothermal fatigue tests show increasing fatigue life of 60Sn-40Pb solder joints with decreasing strain and temperature. In contrast, such behavior was not observed in the isothermal fatigue of 5Sn-95Pb solder joints. Thermal fatigue results on 60Sn-40Pb solder cycled between -55 0 C and 125 0 C show that a coarsened region develops in the center of the joint. Both Pb-rich and Sn-rich phases coarsen, and cracks form within these coarsened regions. The failure mode 60Sn-40Pb solder joints in thermal and isothermal fatigue is similar: cracks form intergranularly through the Sn-rich phase or along Sn/Pb interphase boundaries. Extensive cracking is found throughout the 5Sn-95Pb joint for both thermal and isothermal fatigue. In thermal fatigue the 5Sn-95Pb solder joints failed after fewer cycles than 60Sn-40Pb

  2. Preparation of candidate reference materials for the determination of phosphorus containing flame retardants in styrene-based polymers.

    Science.gov (United States)

    Roth, Thomas; Urpi Bertran, Raquel; Latza, Andreas; Andörfer-Lang, Katrin; Hügelschäffer, Claudia; Pöhlein, Manfred; Puchta, Ralph; Placht, Christian; Maid, Harald; Bauer, Walter; van Eldik, Rudi

    2015-04-01

    Candidate reference materials (RM) for the analysis of phosphorus-based flame retardants in styrene-based polymers were prepared using a self-made mini-extruder. Due to legal requirements of the current restriction for the use of certain hazardous substances in electrical and electronic equipment, focus now is placed on phosphorus-based flame retardants instead of the brominated kind. Newly developed analytical methods for the first-mentioned substances also require RMs similar to industrial samples for validation and verification purposes. Hence, the prepared candidate RMs contained resorcinol-bis-(diphenyl phosphate), bisphenol A bis(diphenyl phosphate), triphenyl phosphate and triphenyl phosphine oxide as phosphorus-based flame retardants. Blends of polycarbonate and acrylonitrile-co-butadiene-co-styrene as well as blends of high-impact polystyrene and polyphenylene oxide were chosen as carrier polymers. Homogeneity and thermal stability of the candidate RMs were investigated. Results showed that the candidate RMs were comparable to the available industrial materials. Measurements by ICP/OES, FTIR and NMR confirmed the expected concentrations of the flame retardants and proved that analyte loss and degradation, respectively, was below the uncertainty of measurement during the extrusion process. Thus, the candidate RMs were found to be suitable for laboratory use.

  3. Decision-making in honeybee swarms based on quality and distance information of candidate nest sites.

    Science.gov (United States)

    Laomettachit, Teeraphan; Termsaithong, Teerasit; Sae-Tang, Anuwat; Duangphakdee, Orawan

    2015-01-07

    In the nest-site selection process of honeybee swarms, an individual bee performs a waggle dance to communicate information about direction, quality, and distance of a discovered site to other bees at the swarm. Initially, different groups of bees dance to represent different potential sites, but eventually the swarm usually reaches an agreement for only one site. Here, we model the nest-site selection process in honeybee swarms of Apis mellifera and show how the swarms make adaptive decisions based on a trade-off between the quality and distance to candidate nest sites. We use bifurcation analysis and stochastic simulations to reveal that the swarm's site distance preference is moderate>near>far when the swarms choose between low quality sites. However, the distance preference becomes near>moderate>far when the swarms choose between high quality sites. Our simulations also indicate that swarms with large population size prefer nearer sites and, in addition, are more adaptive at making decisions based on available information compared to swarms with smaller population size. Copyright © 2014 Elsevier Ltd. All rights reserved.

  4. Computerized detection of multiple sclerosis candidate regions based on a level set method using an artificial neural network

    International Nuclear Information System (INIS)

    Kuwazuru, Junpei; Magome, Taiki; Arimura, Hidetaka; Yamashita, Yasuo; Oki, Masafumi; Toyofuku, Fukai; Kakeda, Shingo; Yamamoto, Daisuke

    2010-01-01

    Yamamoto et al. developed the system for computer-aided detection of multiple sclerosis (MS) candidate regions. In a level set method in their proposed method, they employed the constant threshold value for the edge indicator function related to a speed function of the level set method. However, it would be appropriate to adjust the threshold value to each MS candidate region, because the edge magnitudes in MS candidates differ from each other. Our purpose of this study was to develop a computerized detection of MS candidate regions in MR images based on a level set method using an artificial neural network (ANN). To adjust the threshold value for the edge indicator function in the level set method to each true positive (TP) and false positive (FP) region, we constructed the ANN. The ANN could provide the suitable threshold value for each candidate region in the proposed level set method so that TP regions can be segmented and FP regions can be removed. Our proposed method detected MS regions at a sensitivity of 82.1% with 0.204 FPs per slice and similarity index of MS candidate regions was 0.717 on average. (author)

  5. Manipulation and soldering of carbon nanotubes using atomic force microscope

    International Nuclear Information System (INIS)

    Kashiwase, Yuta; Ikeda, Takayuki; Oya, Takahide; Ogino, Toshio

    2008-01-01

    Manipulation of carbon nanotubes (CNTs) by an atomic force microscope (AFM) and soldering of CNTs using Fe oxide nanoparticles are described. We succeeded to separate a CNT bundle into two CNTs or CNT bundles, to move the separated CNT to a desirable position, and to bind it to another bundle. For the accurate manipulation, load of the AFM cantilever and frequency of the scan were carefully selected. We soldered two CNTs using an Fe oxide nanoparticle prepared from a ferritin molecule. The adhesion forces between the soldered CNTs were examined by an AFM and it was found that the CNTs were bound, though the binding force was not strong

  6. Massive spalling of Cu-Zn and Cu-Al intermetallic compounds at the interface between solders and Cu substrate during liquid state reaction

    Science.gov (United States)

    Kotadia, H. R.; Panneerselvam, A.; Mokhtari, O.; Green, M. A.; Mannan, S. H.

    2012-04-01

    The interfacial intermetallic compound (IMC) formation between Cu substrate and Sn-3.8Ag-0.7Cu-X (wt.%) solder alloys has been studied, where X consists of 0-5% Zn or 0-2% Al. The study has focused on the effect of solder volume as well as the Zn or Al concentration. With low solder volume, when the Zn and Al concentrations in the solder are also low, the initial Cu-Zn and Al-Cu IMC layers, which form at the solder/substrate interface, are not stable and spall off, displaced by a Cu6Sn5 IMC layer. As the total Zn or Al content in the system increases by increasing solder volume, stable CuZn or Al2Cu IMCs form on the substrate and are not displaced. Increasing concentration of Zn has a similar effect of stabilizing the Cu-Zn IMC layer and also of forming a stable Cu5Zn8 layer, but increasing Al concentration alone does not prevent spalling of Al2Cu. These results are explained using a combination of thermodynamic- and kinetics-based arguments.

  7. Numerical prediction of mechanical properties of Pb-Sn solder alloys containing antimony, bismuth and or silver ternary trace elements

    Science.gov (United States)

    Gadag, Shiva P.; Patra, Susant

    2000-12-01

    Solder joint interconnects are mechanical means of structural support for bridging the various electronic components and providing electrical contacts and a thermal path for heat dissipation. The functionality of the electronic device often relies on the structural integrity of the solder. The dimensional stability of solder joints is numerically predicted based on their mechanical properties. Algorithms to model the kinetics of dissolution and subsequent growth of intermetallic from the complete knowledge of a single history of time-temperature-reflow profile, by considering equivalent isothermal time intervals, have been developed. The information for dissolution is derived during the heating cycle of reflow and for the growth process from cooling curve of reflow profile. A simple and quick analysis tool to derive tensile stress-strain maps as a function of the reflow temperature of solder and strain rate has been developed by numerical program. The tensile properties are used in modeling thermal strain, thermal fatigue and to predict the overall fatigue life of solder joints. The numerical analysis of the tensile properties as affected by their composition and rate of testing, has been compiled in this paper. A numerical model using constitutive equation has been developed to evaluate the interfacial fatigue crack growth rate. The model can assess the effect of cooling rate, which depends on the level of strain energy release rate. Increasing cooling rate from normalizing to water-quenching, enhanced the fatigue resistance to interfacial crack growth by up to 50% at low strain energy release rate. The increased cooling rates enhanced the fatigue crack growth resistance by surface roughening at the interface of solder joint. This paper highlights salient features of process modeling. Interfacial intermetallic microstructure is affected by cooling rate and thereby affects the mechanical properties.

  8. Trust Based Algorithm for Candidate Node Selection in Hybrid MANET-DTN

    Directory of Open Access Journals (Sweden)

    Jan Papaj

    2014-01-01

    Full Text Available The hybrid MANET - DTN is a mobile network that enables transport of the data between groups of the disconnected mobile nodes. The network provides benefits of the Mobile Ad-Hoc Networks (MANET and Delay Tolerant Network (DTN. The main problem of the MANET occurs if the communication path is broken or disconnected for some short time period. On the other side, DTN allows sending data in the disconnected environment with respect to higher tolerance to delay. Hybrid MANET - DTN provides optimal solution for emergency situation in order to transport information. Moreover, the security is the critical factor because the data are transported by mobile devices. In this paper, we investigate the issue of secure candidate node selection for transportation of the data in a disconnected environment for hybrid MANET- DTN. To achieve the secure selection of the reliable mobile nodes, the trust algorithm is introduced. The algorithm enables select reliable nodes based on collecting routing information. This algorithm is implemented to the simulator OPNET modeler.

  9. Prioritizing disease candidate proteins in cardiomyopathy-specific protein-protein interaction networks based on "guilt by association" analysis.

    Directory of Open Access Journals (Sweden)

    Wan Li

    Full Text Available The cardiomyopathies are a group of heart muscle diseases which can be inherited (familial. Identifying potential disease-related proteins is important to understand mechanisms of cardiomyopathies. Experimental identification of cardiomyophthies is costly and labour-intensive. In contrast, bioinformatics approach has a competitive advantage over experimental method. Based on "guilt by association" analysis, we prioritized candidate proteins involving in human cardiomyopathies. We first built weighted human cardiomyopathy-specific protein-protein interaction networks for three subtypes of cardiomyopathies using the known disease proteins from Online Mendelian Inheritance in Man as seeds. We then developed a method in prioritizing disease candidate proteins to rank candidate proteins in the network based on "guilt by association" analysis. It was found that most candidate proteins with high scores shared disease-related pathways with disease seed proteins. These top ranked candidate proteins were related with the corresponding disease subtypes, and were potential disease-related proteins. Cross-validation and comparison with other methods indicated that our approach could be used for the identification of potentially novel disease proteins, which may provide insights into cardiomyopathy-related mechanisms in a more comprehensive and integrated way.

  10. Crystal plasticity finite element analysis of deformation behaviour in SAC305 solder joint

    Science.gov (United States)

    Darbandi, Payam

    Due to the awareness of the potential health hazards associated with the toxicity of lead (Pb), actions have been taken to eliminate or reduce the use of Pb in consumer products. Among those, tin (Sn) solders have been used for the assembly of electronic systems. Anisotropy is of significant importance in all structural metals, but this characteristic is unusually strong in Sn, making Sn based solder joints one of the best examples of the influence of anisotropy. The effect of anisotropy arising from the crystal structure of tin and large grain microstructure on the microstructure and the evolution of constitutive responses of microscale SAC305 solder joints is investigated. Insights into the effects of key microstructural features and dominant plastic deformation mechanisms influencing the measured relative activity of slip systems in SAC305 are obtained from a combination of optical microscopy, orientation imaging microscopy (OIM), slip plane trace analysis and crystal plasticity finite element (CPFE) modeling. Package level SAC305 specimens were subjected to shear deformation in sequential steps and characterized using optical microscopy and OIM to identify the activity of slip systems. X-ray micro Laue diffraction and high energy monochromatic X-ray beam were employed to characterize the joint scale tensile samples to provide necessary information to be able to compare and validate the CPFE model. A CPFE model was developed that can account for relative ease of activating slip systems in SAC305 solder based upon the statistical estimation based on correlation between the critical resolved shear stress and the probability of activating various slip systems. The results from simulations show that the CPFE model developed using the statistical analysis of activity of slip system not only can satisfy the requirements associated with kinematic of plastic deformation in crystal coordinate systems (activity of slip systems) and global coordinate system (shape changes

  11. Detection of the early keratoconus based on corneal biomechanical properties in the refractive surgery candidates

    Directory of Open Access Journals (Sweden)

    Zofia Pniakowska

    2016-01-01

    Full Text Available Context: Subclinical keratoconus is contraindication to refractive surgery. The currently used methods of preoperative screening do not always allow differentiating between healthy eyes and those with subclinical keratoconus. Aim: To evaluate biomechanical parameters of the cornea, waveform score (WS, and intraocular pressure (IOP as potentially useful adjuncts to the diagnostic algorithm for precise detection of the early keratoconus stages and selection of refractive surgery candidates. Settings and Design: Department of Ophthalmology and prospective cross-sectional study. Patients and Methods: Patients enrolled in the study were diagnosed with refractive disorders. We assessed parameters of corneal biomechanics such as corneal hysteresis (CH, corneal resistance factor (CRF, Goldman-correlated IOP (IOPg, corneal compensated IOP, WS, and keratoconus match index (KMI. They were classified into one of three groups based on the predefined KMI range: Group 1 (from 0.352 to 0.757 – 45 eyes, Group 2 (from −0.08 to 0.313 – 52 eyes, and Group 0 - control group (from 0.761 to 1.642 – 80 eyes. Results: In both study groups, IOPg, CRF, and CH were decreased when compared to control (P < 0.0001. In control group, there was positive correlation between CH and KMI (P < 0.05, with no correlations in any of the two study groups. CRF correlated positively with KMI in control (P < 0.0001 and in Group 2 (P < 0.05. Conclusions: CH and CRF, together with WS and IOPg, consist a clinically useful adjunct to detect subclinical keratoconus in patients referred for refractive surgery when based on KMI staging.

  12. A candidate gene-based association study of tocopherol content and composition in rapeseed (Brassica napus

    Directory of Open Access Journals (Sweden)

    Steffi eFritsche

    2012-06-01

    Full Text Available Rapeseed (Brassica napus L. is the most important oil crop of temperate climates. Rapeseed oil contains tocopherols, also known as vitamin E, which is an indispensable nutrient for humans and animals due to its antioxidant and radical scavenging abilities. Moreover, tocopherols are also important for the oxidative stability of vegetable oils. Therefore, seed oil with increased tocopherol content or altered tocopherol composition is a target for breeding. We investigated the role of nucleotide variations within candidate genes from the tocopherol biosynthesis pathway. Field trials were carried out with 229 accessions from a worldwide B. napus collection which was divided into two panels of 96 and 133 accessions. Seed tocopherol content and composition were measured by HPLC. High heritabilities were found for both traits, ranging from 0.62 to 0.94. We identified polymorphisms by sequencing selected regions of the tocopherol genes from the 96 accession panel. Subsequently, we determined the population structure (Q and relative kinship (K as detected by genotyping with genome-wide distributed SSR markers. Association studies were performed using two models, the structure-based GLM+Q and the PK mixed model. Between 26 and 12 polymorphisms within two genes (BnaX.VTE3.a, BnaA.PDS1.c were significantly associated with tocopherol traits. The SNPs explained up to 16.93 % of the genetic variance for tocopherol composition and up to 10.48 % for total tocopherol content. Based on the sequence information we designed CAPS markers for genotyping the 133 accessions from the 2nd panel. Significant associations with various tocopherol traits confirmed the results from the first experiment. We demonstrate that the polymorphisms within the tocopherol genes clearly impact tocopherol content and composition in B. napus seeds. We suggest that these nucleotide variations may be used as selectable markers for breeding rapeseed with enhanced tocopherol quality.

  13. Development of a soft-soldering system for aluminum

    Science.gov (United States)

    Falke, W. L.; Lee, A. Y.; Neumeier, L. A.

    1983-03-01

    The method employs application of a thin nickel copper alloy coating to the substrate, which enables the tin lead solders to wet readily and spread over the areas to be joined. The aluminum substrate is mechanically or chemically cleaned to facilitate bonding to a minute layer of zinc that is subsequently applied, with an electroless zincate solution. The nickel copper alloy (30 to 70 pct Ni) coating is then applied electrolytically over the zinc, using immersion cell or brush coating techniques. Development of acetate electrolytes has permitted deposition of the proper alloys coatings. The coated areas can then be readily joined with conventional tin lead solders and fluxs. The joints so formed are ductile, strong, and relatively corrosion resistant, and exhibit strengths equivalent to those formed on copper and brass when the same solders and fluxes are used. The method has also been employed to soft solder magnesium alloys.

  14. PROTECTIVE ACTIVITY STUDY OF A CANDIDATE VACCINE AGAINST ROTAVIRUS INFECTION BASED ON RECOMBINANT PROTEIN FliCVP6VP8

    Directory of Open Access Journals (Sweden)

    I. V. Dukhovlinov

    2016-01-01

    Full Text Available Rotavirus infection is among leading causes of severe diarrhea which often leads to severe dehydration, especially, in children under 5 years old. In Russia, the incidence of rotavirus infection is constantly increased, due to higher rates of actual rotavirus infection cases and improved diagnostics of the disease. Immunity to rotavirus is unstable, thus causing repeated infections intra vitam. Anti-infectious resistance in reconvalescents is explained by induction of specific IgM, IgG, and, notably, IgA antibodies. Due to absence of market drugs with direct action against rotavirus, a rational vaccination is considered the most effective way to control the disease. Currently available vaccines for prevention of rotavirus infection are based on live attenuated rotavirus strains, human and/or animal origin, which replicate in human gut. Their implementation may result into different complications. Meanwhile, usage of vaccines based on recombinant proteins is aimed to avoid risks associated with introduction of a complete virus into humans. In this paper, we studied protective activity of candidate vaccines against rotavirus.In this work we studied protective activity of a candidate vaccine against rotavirus infection based on recombinant FliCVP6VP8 protein which includes VP6 and VP8, as well as components of Salmonella typhimurium flagellin (FliC as an adjuvant. Different components are joined by flexible bridges. Efficiency of the candidate vaccine was studied in animal model using Balb/c mice. We have shown high level of protection which occurs when the candidate vaccine is administered twice intramuscularly. Complete protection of animals against mouse rotavirus EDC after intramuscular immunization with a candidate vaccine was associated with arising rotavirus-specific IgA and IgG antibodies in serum and intestine of immunized animals. The efficacy of candidate vaccine based on recombinant protein FliCVP6VP8 against rotavirus infection was

  15. Strength of joints brazed with two-phase solders

    International Nuclear Information System (INIS)

    Shnyakin, N.S.; Parfenova, L.V.; Ekatova, A.S.; Prilepskaya, I.V.

    1976-01-01

    Dependence of the structure and strength of soldered joints upon a gap size in case of 1Kh18N10T stainless steel soldering with a double-phase solder of Ni-Zn-Cu system is described. Butt and lap joints have been subjected to soldering with gas-flame and induction heating. The optimum conditions of the solder crystallization are determined with wedge-gap samples. The studies show that the character of distribution of a fusible β-phase in metal depends upon a gap size. With gaps up to 0.1 mm the β-phase enriched with a fusible component (zinc) runs as a continuous thin interlayer in the middle of the seam. As a result of zinc evaporation from the β-phase this interlayer becomes internally oxidized. After the sample is broken an oxidized fracture gives one the impression of a poor fusion in the middle part of the joint. The ultimate strength of butt joints is 15-20 kgf/sq.mm. A value of thermal expansion of 1Kh18N10T steel samples, 1-5 mm thick, has been experimentally determined for butt soldering. The elongation of two halves of the sample is measured by an indicator and proved to be 0.89 mm for a 50x50x2 mm sample at a soldering temperature of 1.100 deg C. The paper presents methods for the calculation of an optimal gap value for butt soldering with a local gas-flame and induction heating

  16. Candidate lesion-based criteria for defining a positive sacroiliac joint MRI in two cohorts of patients with axial spondyloarthritis

    DEFF Research Database (Denmark)

    Weber, Ulrich; Østergaard, Mikkel; Lambert, Robert G W

    2015-01-01

    OBJECTIVE: To determine candidate lesion-based criteria for a positive sacroiliac joint (SIJ) MRI based on bone marrow oedema (BMO) and/or erosion in non-radiographic axial spondyloarthritis (nr-axSpA); to compare the performance of lesion-based criteria with global evaluation by expert readers. ...... for classification of axial SpA, reflecting the contextual information provided by T1SE and STIR sequences....

  17. Characteristics of solder joints under fatigue loads using piezomechanical actuation

    Science.gov (United States)

    Shim, Dong-Jin; Spearing, S. Mark

    2003-07-01

    Crack initiation and growth characteristics of solder joints under fatigue loads are investigated using piezomechanical actuation. Cracks in solder joints, which can cause failure in microelectronics components, are induced via piezoelectricity in piezo-ceramic bonded joints. Lead-zirconate-titanate ceramic plates and eutectic Sn-Pb solder bonded in a double-lap shear configuration are used in the investigation. Electric field across each piezo-ceramic plate is applied such that shear stresses/strains are induced in the solder joints. The experiments show that cracks initiate in the solder joints around defects such as voids and grow in length until they coalesce with other cracks from adjacent voids. These observations are compared with the similar thermal cycling tests from the literature to show feasibility and validity of the current method in investigating the fatigue characteristics of solder joints. In some specimens, cracks in the piezo-ceramic plates are observed, and failure in the specimens generally occurred due to piezo-ceramic plate fracture. The issues encountered in implementing this methodology such as low actuation and high processing temperatures are further discussed.

  18. Laser Soldering of Rat Skin Using a Controlled Feedback System

    Directory of Open Access Journals (Sweden)

    Mohammad Sadegh Nourbakhsh

    2009-03-01

    Full Text Available Introduction: Laser tissue soldering using albumin and indocyanine green dye (ICG is an effective technique utilized in various surgical procedures. The purpose of this study was to perform laser soldering of rat skin under a feedback control system and compare the results with those obtained using standard sutures. Material and Methods: Skin incisions were made over eight rats’ dorsa, which were subsequently closed using different wound closure interventions in two groups: (a using a temperature controlled infrared detector or (b by suture. Tensile strengths were measured at 2, 5, 7 and 10 days post-incision. Histological examination was performed at the time of sacrifice. Results: Tensile strength results showed that during the initial days following the incisions, the tensile strengths of the sutured samples were greater than the laser samples. However, 10 days after the incisions, the tensile strengths of the laser soldered incisions were higher than the sutured cuts. Histopathological examination showed a preferred wound healing response in the soldered skin compared with the control samples. The healing indices of the laser soldered repairs (426 were significantly better than the control samples (340.5. Conclusion: Tissue feedback control of temperature and optical changes in laser soldering of skin leads to a higher tensile strength and better histological results and hence this method may be considered as an alternative to standard suturing.

  19. Chest Fat Quantification via CT Based on Standardized Anatomy Space in Adult Lung Transplant Candidates.

    Directory of Open Access Journals (Sweden)

    Yubing Tong

    Full Text Available Overweight and underweight conditions are considered relative contraindications to lung transplantation due to their association with excess mortality. Yet, recent work suggests that body mass index (BMI does not accurately reflect adipose tissue mass in adults with advanced lung diseases. Alternative and more accurate measures of adiposity are needed. Chest fat estimation by routine computed tomography (CT imaging may therefore be important for identifying high-risk lung transplant candidates. In this paper, an approach to chest fat quantification and quality assessment based on a recently formulated concept of standardized anatomic space (SAS is presented. The goal of the paper is to seek answers to several key questions related to chest fat quantity and quality assessment based on a single slice CT (whether in the chest, abdomen, or thigh versus a volumetric CT, which have not been addressed in the literature.Unenhanced chest CT image data sets from 40 adult lung transplant candidates (age 58 ± 12 yrs and BMI 26.4 ± 4.3 kg/m2, 16 with chronic obstructive pulmonary disease (COPD, 16 with idiopathic pulmonary fibrosis (IPF, and the remainder with other conditions were analyzed together with a single slice acquired for each patient at the L5 vertebral level and mid-thigh level. The thoracic body region and the interface between subcutaneous adipose tissue (SAT and visceral adipose tissue (VAT in the chest were consistently defined in all patients and delineated using Live Wire tools. The SAT and VAT components of chest were then segmented guided by this interface. The SAS approach was used to identify the corresponding anatomic slices in each chest CT study, and SAT and VAT areas in each slice as well as their whole volumes were quantified. Similarly, the SAT and VAT components were segmented in the abdomen and thigh slices. Key parameters of the attenuation (Hounsfield unit (HU distributions were determined from each chest slice and from the

  20. A cell wall protein-based vaccine candidate induce protective immune response against Sporothrix schenckii infection.

    Science.gov (United States)

    Portuondo, Deivys Leandro; Batista-Duharte, Alexander; Ferreira, Lucas Souza; Martínez, Damiana Téllez; Polesi, Marisa Campos; Duarte, Roberta Aparecida; de Paula E Silva, Ana Carolina Alves; Marcos, Caroline Maria; Almeida, Ana Marisa Fusco de; Carlos, Iracilda Zeppone

    2016-02-01

    Sporotrichosis is a subcutaneous mycosis caused by several closely related thermo-dimorphic fungi of the Sporothrix schenckii species complex, affecting humans and other mammals. In the last few years, new strategies have been proposed for controlling sporotrichosis owning to concerns about its growing incidence in humans, cats, and dogs in Brazil, as well as the toxicity and limited efficacy of conventional antifungal drugs. In this study, we assessed the immunogenicity and protective properties of two aluminum hydroxide (AH)-adsorbed S. schenckii cell wall protein (ssCWP)-based vaccine formulations in a mouse model of systemic S. schenckii infection. Fractioning by SDS-PAGE revealed nine protein bands, two of which were functionally characterized: a 44kDa peptide hydrolase and a 47kDa enolase, which was predicted to be an adhesin. Sera from immunized mice recognized the 47kDa enolase and another unidentified 71kDa protein, whereas serum from S. schenckii-infected mice recognized both these proteins plus another unidentified 9.4kDa protein. Furthermore, opsonization with the anti-ssCWP sera led to markedly increased phagocytosis and was able to strongly inhibit the fungus' adhesion to fibroblasts. Immunization with the higher-dose AH-adjuvanted formulation led to increased ex vivo release of IL-12, IFN-γ, IL-4, and IL-17, whereas only IL-12 and IFN-γ were induced by the higher-dose non-adjuvanted formulation. Lastly, passive transference of the higher-dose AH-adjuvanted formulation's anti-ssCWP serum was able to afford in vivo protection in a subsequent challenge with S. schenckii, becoming a viable vaccine candidate for further testing. Copyright © 2015 Elsevier GmbH. All rights reserved.

  1. Life cycle assessment (LCA of lead-free solders from the environmental protection aspect

    Directory of Open Access Journals (Sweden)

    Mitovski Aleksandra M.

    2009-01-01

    Full Text Available Life-cycle assessment (LCA presents a relatively new approach, which allows comprehensive environmental consequences analysis of a product system over its entire life. This analysis is increasingly being used in the industry, as a tool for investigation of the influence of the product system on the environment, and serves as a protection and prevention tool in ecological management. This method is used to predict possible influences of a certain material to the environment through different development stages of the material. In LCA, the product systems are evaluated on a functionally equivalent basis, which, in this case, was 1000 cubic centimeters of an alloy. Two of the LCA phases, life-cycle inventory (LCA and life-cycle impact assessment (LCIA, are needed to calculate the environmental impacts. Methodology of LCIA applied in this analysis aligns every input and output influence into 16 different categories, divided in two subcategories. The life-cycle assessment reaserch review of the leadfree solders Sn-Cu, SAC (Sn-Ag-Cu, BSA (Bi-Sb-Ag and SABC (Sn-Ag-Bi-Cu respectively, is given in this paper, from the environmental protection aspect starting from production, through application process and finally, reclamation at the end-of-life, i.e. recycling. There are several opportunities for reducing the overall environmental and human health impacts of solder used in electronics manufacturing based on the results of the LCA, such as: using secondary metals reclaimed through post-industrial recycling; power consumption reducing by replacing older, less efficient reflow assembly equipment, or by optimizing the current equipment to perform at the elevated temperatures required for lead-free soldering, etc. The LCA analysis was done comparatively in relation to widely used Sn-Pb solder material. Additionally, the impact factors of material consumption, energy use, water and air reserves, human health and ecotoxicity have been ALSO considered including

  2. Evaluation on Dorsey Method in Surface Tension Measurement of Solder Liquids Containing Surfactants

    Science.gov (United States)

    Zhao, Xingke; Xie, Feiming; Fan, Jinsheng; Liu, Dayong; Huang, Jihua; Chen, Shuhai

    2018-06-01

    With the purpose of developing a feasible approach for measuring the surface tension of solders containing surfactants, the surface tension of Sn-3Ag-0.5Cu-xP solder alloys, with various drop sizes as well as different phosphorus (P) content, was evaluated using the Dorsey method based on the sessile drop test. The results show that the accuracy of the surface tension calculations depends on both of sessile drop size and the liquid metal composition. With a proper drop size, in the range of 4.5 mm to 5.3 mm in equivalent spherical diameters, the deviation of the surface tension calculation can be limited to 1.43 mN·m-1 and 6.30 mN·m-1 for SnAgCu and SnAgCu-P, respectively. The surface tension of SnAgCu-xP solder alloys decreases quickly to a minimum value when the P content reaches 0.5 wt% and subsequently increases slowly with the P content further increasing. The formation of a P-enriched surface layer and Sn4P3 intermetallic phases is regarded to be responsible for the decreasing and subsequent increasing of surface tension, respectively.

  3. Characterizing the Soldering Alloy Type In–Ag–Ti and the Study of Direct Soldering of SiC Ceramics and Copper

    Directory of Open Access Journals (Sweden)

    Roman Koleňák

    2018-04-01

    Full Text Available The aim of the research was to characterize the soldering alloy In–Ag–Ti type, and to study the direct soldering of SiC ceramics and copper. The In10Ag4Ti solder has a broad melting interval, which mainly depends on its silver content. The liquid point of the solder is 256.5 °C. The solder microstructure is composed of a matrix with solid solution (In, in which the phases of titanium (Ti3In4 and silver (AgIn2 are mainly segregated. The tensile strength of the solder is approximately 13 MPa. The strength of the solder increased with the addition of Ag and Ti. The solder bonds with SiC ceramics, owing to the interaction between active In metal and silicon infiltrated in the ceramics. XRD analysis has proven the interaction of titanium with ceramic material during the formation of the new minority phases of titanium silicide—SiTi and titanium carbide—C5Ti8. In and Ag also affect bond formation with the copper substrate. Two new phases were also observed in the bond interphase—(CuAg6In5 and (AgCuIn2. The average shear strength of a combined joint of SiC–Cu, fabricated with In10Ag4Ti solder, was 14.5 MPa. The In–Ag–Ti solder type studied possesses excellent solderability with several metallic and ceramic materials.

  4. Correlation Between Pin Misalignment and Crack Length in THT Solder Joints

    Directory of Open Access Journals (Sweden)

    Molnar A.

    2017-06-01

    Full Text Available In this manuscript, correlations were searched for between pin misalignments relative to PCB bores and crack propagation after cyclic thermal shock tests in THT solder joints produced from lead-free solder alloys. In total, 7 compositions were examined including SAC solders with varying Ag, Cu and Ni contents. The crack propagation was initiated by cyclic thermal shock tests with 40°C / +125°C temperature profiles. Pin misalignments relative to the bores were characterized with three attributes obtained from one section of the examined solder joints. Cracks typically originated at the solder/pin or solder/bore interfaces and propagated within the solder. It was shown that pin misalignments did not have an effect on crack propagation, thus, the solder joints’ lifetime.

  5. Fully Pipelined Parallel Architecture for Candidate Block and Pixel-Subsampling-Based Motion Estimation

    Directory of Open Access Journals (Sweden)

    Reeba Korah

    2008-01-01

    Full Text Available This paper presents a low power and high speed architecture for motion estimation with Candidate Block and Pixel Subsampling (CBPS Algorithm. Coarse-to-fine search approach is employed to find the motion vector so that the local minima problem is totally eliminated. Pixel subsampling is performed in the selected candidate blocks which significantly reduces computational cost with low quality degradation. The architecture developed is a fully pipelined parallel design with 9 processing elements. Two different methods are deployed to reduce the power consumption, parallel and pipelined implementation and parallel accessing to memory. For processing 30 CIF frames per second our architecture requires a clock frequency of 4.5 MHz.

  6. Identification of plasma biomarker candidates in glioblastoma using an antibody-array-based proteomic approach

    International Nuclear Information System (INIS)

    Zupancic, Klemen; Blejec, Andrej; Herman, Ana; Veber, Matija; Verbovsek, Urska; Korsic, Marjan; Knezevic, Miomir; Rozman, Primoz; Turnsek, Tamara Lah; Gruden, Kristina; Motaln, Helena

    2014-01-01

    Glioblastoma multiforme (GBM) is a brain tumour with a very high patient mortality rate, with a median survival of 47 weeks. This might be improved by the identification of novel diagnostic, prognostic and predictive therapy-response biomarkers, preferentially through the monitoring of the patient blood. The aim of this study was to define the impact of GBM in terms of alterations of the plasma protein levels in these patients. We used a commercially available antibody array that includes 656 antibodies to analyse blood plasma samples from 17 healthy volunteers in comparison with 17 blood plasma samples from patients with GBM. We identified 11 plasma proteins that are statistically most strongly associated with the presence of GBM. These proteins belong to three functional signalling pathways: T-cell signalling and immune responses; cell adhesion and migration; and cell-cycle control and apoptosis. Thus, we can consider this identified set of proteins as potential diagnostic biomarker candidates for GBM. In addition, a set of 16 plasma proteins were significantly associated with the overall survival of these patients with GBM. Guanine nucleotide binding protein alpha (GNAO1) was associated with both GBM presence and survival of patients with GBM. Antibody array analysis represents a useful tool for the screening of plasma samples for potential cancer biomarker candidates in small-scale exploratory experiments; however, clinical validation of these candidates requires their further evaluation in a larger study on an independent cohort of patients

  7. Identification of Novel Potential Vaccine Candidates against Tuberculosis Based on Reverse Vaccinology

    Directory of Open Access Journals (Sweden)

    Gloria P. Monterrubio-López

    2015-01-01

    Full Text Available Tuberculosis (TB is a chronic infectious disease, considered as the second leading cause of death worldwide, caused by Mycobacterium tuberculosis. The limited efficacy of the bacillus Calmette-Guérin (BCG vaccine against pulmonary TB and the emergence of multidrug-resistant TB warrants the need for more efficacious vaccines. Reverse vaccinology uses the entire proteome of a pathogen to select the best vaccine antigens by in silico approaches. M. tuberculosis H37Rv proteome was analyzed with NERVE (New Enhanced Reverse Vaccinology Environment prediction software to identify potential vaccine targets; these 331 proteins were further analyzed with VaxiJen for the determination of their antigenicity value. Only candidates with values ≥0.5 of antigenicity and 50% of adhesin probability and without homology with human proteins or transmembrane regions were selected, resulting in 73 antigens. These proteins were grouped by families in seven groups and analyzed by amino acid sequence alignments, selecting 16 representative proteins. For each candidate, a search of the literature and protein analysis with different bioinformatics tools, as well as a simulation of the immune response, was conducted. Finally, we selected six novel vaccine candidates, EsxL, PE26, PPE65, PE_PGRS49, PBP1, and Erp, from M. tuberculosis that can be used to improve or design new TB vaccines.

  8. Behavior of Sn-0.7Cu-xZn lead free solder on physical properties and micro structure

    Science.gov (United States)

    Siahaan, Erwin

    2017-09-01

    The issues to substitute Tin-Lead Solders is concerning the health and environmental hazards that is caused by lead, and also legislative actions around the world regarding lead toxicity, which has prompted the research community to attempt to replace solder alloys for the traditional Sn-Pb alloys lead which has been used by industrial worker throughout history because it is easily extracted and refined at a relatively low energy cost and also has a range of useful properties. Traditional industry lead has been used in soldering materials for electronic applications because it has low melting point and a soft, malleable nature, when combined with tin at the eutectic composition which causes the alloy to flow easily in the liquid state and solidifies over a very small range of temperature. One of the potential candidate to replace tin-lead solder is Sn-Cu-Zn eutectic alloy as it has a lower melting temperature. Consequently, it is of interest to determine what reactions can occur in ternary systems derived from the Sn-Cu-Zn eutectic. One such system is Sn-0.7Cu-xZn. The specimen was elaborated on physical properties. The chemical content was analyzed by using Shimadzu XRD and melting point was analyzed by using Differential Scanning Calorimeter ( DSC ). The results has shown that the highest addition of Zinc content (15%Zn) will decrease the melting temperatur to 189°C compared to Sn-Pb at 183°C Increasing the amount of Zn on Sn0.7Cu-xZn alloys will decrease Cu3Sn intermetallic coumpound.

  9. 30 CFR 77.1112 - Welding, cutting, or soldering with arc or flame; safeguards.

    Science.gov (United States)

    2010-07-01

    ... 30 Mineral Resources 1 2010-07-01 2010-07-01 false Welding, cutting, or soldering with arc or... WORK AREAS OF UNDERGROUND COAL MINES Fire Protection § 77.1112 Welding, cutting, or soldering with arc or flame; safeguards. (a) When welding, cutting, or soldering with arc or flame near combustible...

  10. 30 CFR 75.1106 - Welding, cutting, or soldering with arc or flame underground.

    Science.gov (United States)

    2010-07-01

    ... 30 Mineral Resources 1 2010-07-01 2010-07-01 false Welding, cutting, or soldering with arc or... Protection § 75.1106 Welding, cutting, or soldering with arc or flame underground. [Statutory Provisions] All welding, cutting, or soldering with arc or flame in all underground areas of a coal mine shall, whenever...

  11. 30 CFR 77.1916 - Welding, cutting, and soldering; fire protection.

    Science.gov (United States)

    2010-07-01

    ... 30 Mineral Resources 1 2010-07-01 2010-07-01 false Welding, cutting, and soldering; fire... OF UNDERGROUND COAL MINES Slope and Shaft Sinking § 77.1916 Welding, cutting, and soldering; fire protection. (a) One portable fire extinguisher shall be provided where welding, cutting, or soldering with...

  12. Fast-Solving Quasi-Optimal LS-S3VM Based on an Extended Candidate Set.

    Science.gov (United States)

    Ma, Yuefeng; Liang, Xun; Kwok, James T; Li, Jianping; Zhou, Xiaoping; Zhang, Haiyan

    2018-04-01

    The semisupervised least squares support vector machine (LS-S 3 VM) is an important enhancement of least squares support vector machines in semisupervised learning. Given that most data collected from the real world are without labels, semisupervised approaches are more applicable than standard supervised approaches. Although a few training methods for LS-S 3 VM exist, the problem of deriving the optimal decision hyperplane efficiently and effectually has not been solved. In this paper, a fully weighted model of LS-S 3 VM is proposed, and a simple integer programming (IP) model is introduced through an equivalent transformation to solve the model. Based on the distances between the unlabeled data and the decision hyperplane, a new indicator is designed to represent the possibility that the label of an unlabeled datum should be reversed in each iteration during training. Using the indicator, we construct an extended candidate set consisting of the indices of unlabeled data with high possibilities, which integrates more information from unlabeled data. Our algorithm is degenerated into a special scenario of the previous algorithm when the extended candidate set is reduced into a set with only one element. Two strategies are utilized to determine the descent directions based on the extended candidate set. Furthermore, we developed a novel method for locating a good starting point based on the properties of the equivalent IP model. Combined with the extended candidate set and the carefully computed starting point, a fast algorithm to solve LS-S 3 VM quasi-optimally is proposed. The choice of quasi-optimal solutions results in low computational cost and avoidance of overfitting. Experiments show that our algorithm equipped with the two designed strategies is more effective than other algorithms in at least one of the following three aspects: 1) computational complexity; 2) generalization ability; and 3) flexibility. However, our algorithm and other algorithms have

  13. Influence of Co and W powders on viscosity of composite solders during soldering of specially shaped diamond-abrasive tools

    Science.gov (United States)

    Sokolov, E. G.; Aref’eva, S. A.; Svistun, L. I.

    2018-03-01

    The influence of Co and W powders on the structure and the viscosity of composite solders Sn-Cu-Co-W used for the manufacture of the specially shaped diamond tools has been studied. The solders were obtained by mixing the metallic powders with an organic binder. The mixtures with and without diamonds were applied to steel rollers and shaped substrates. The sintering was carried out in a vacuum at 820 ° C with time-exposure of 40 minutes. The influence of Co and W powders on the viscosity solders was evaluated on the basis of the study of structures and according to the results of sintering specially shaped diamond tools. It was found that to provide the necessary viscosity and to obtain the uniform diamond-containing layers on the complex shaped surfaces, Sn-Cu-Co-W solder should contain 27–35 vol % of solid phase. This is achieved with a total solder content of 24–32 wt % of cobalt powder and 7 wt % of tungsten powder.

  14. An Overview of Surface Finishes and Their Role in Printed Circuit Board Solderability and Solder Joint Performance

    Energy Technology Data Exchange (ETDEWEB)

    Vianco, P.T.

    1998-10-15

    A overview has been presented on the topic of alternative surface finishes for package I/Os and circuit board features. Aspects of processability and solder joint reliability were described for the following coatings: baseline hot-dipped, plated, and plated-and-fused 100Sn and Sn-Pb coatings; Ni/Au; Pd, Ni/Pd, and Ni/Pd/Au finishes; and the recently marketed immersion Ag coatings. The Ni/Au coatings appear to provide the all-around best option in terms of solderability protection and wire bondability. Nickel/Pal ftishes offer a slightly reduced level of performance in these areas that is most likely due to variable Pd surface conditions. It is necessmy to minimize dissolved Au or Pd contents in the solder material to prevent solder joint embrittlement. Ancillary aspects that included thickness measurement techniques; the importance of finish compatibility with conformal coatings and conductive adhesives; and the need for alternative finishes for the processing of non-Pb bearing solders were discussed.

  15. Planetary Candidates Observed by Kepler. VIII. A Fully Automated Catalog with Measured Completeness and Reliability Based on Data Release 25

    DEFF Research Database (Denmark)

    Thompson, Susan E.; Coughlin, Jeffrey L.; Hoffman, Kelsey

    2018-01-01

    We present the Kepler Object of Interest (KOI) catalog of transiting exoplanets based on searching 4 yr of Kepler time series photometry (Data Release 25, Q1-Q17). The catalog contains 8054 KOIs, of which 4034 are planet candidates with periods between 0.25. and 632. days. Of these candidates, 219...... simulated data sets and measured how well it was able to separate TCEs caused by noise from those caused by low signal-to-noise transits. We discuss the Robovetter and the metrics it uses to sort TCEs. For orbital periods less than 100 days the Robovetter completeness (the fraction of simulated transits...... FGK-dwarf stars, the Robovetter is 76.7% complete and the catalog is 50.5% reliable. The KOI catalog, the transit fits, and all of the simulated data used to characterize this catalog are available at the NASA Exoplanet Archive....

  16. An Investigation of Immunogenicity of Chitosan-Based Botulinum Neurotoxin E Binding Domain Recombinant Candidate Vaccine via Mucosal Route

    Directory of Open Access Journals (Sweden)

    Mohammad Javad Bagheripour

    2017-01-01

    Full Text Available Background and Objectives: Botulism syndrome is caused by serotypes A-G of neurotoxins of Clostridium genus. Neurotoxin binding domain is an appropriate vaccine candidate due to its immunogenic activity. In this study, the immunogenicity of chitosan-based botulinum neurotoxin E binding domain recombinant candidate vaccine was investigated via mucosal route of administration. Methods: In this experimental study, chitosan nanoparticles containing rBoNT/E protein were synthesized by ionic gelation method and were administered orally and intranasally to mice. After each administration, IgG antibody titer was measured by ELISA method. Finally, all groups were challenged with active botulinum neurotoxin type E. Data were analyzed using Duncan and repeated ANOVA tests. The significance level was considered as p0.05, even intranasal route reduced the immunogenicity.

  17. Imputation-based analysis of association studies: candidate regions and quantitative traits.

    Directory of Open Access Journals (Sweden)

    Bertrand Servin

    2007-07-01

    Full Text Available We introduce a new framework for the analysis of association studies, designed to allow untyped variants to be more effectively and directly tested for association with a phenotype. The idea is to combine knowledge on patterns of correlation among SNPs (e.g., from the International HapMap project or resequencing data in a candidate region of interest with genotype data at tag SNPs collected on a phenotyped study sample, to estimate ("impute" unmeasured genotypes, and then assess association between the phenotype and these estimated genotypes. Compared with standard single-SNP tests, this approach results in increased power to detect association, even in cases in which the causal variant is typed, with the greatest gain occurring when multiple causal variants are present. It also provides more interpretable explanations for observed associations, including assessing, for each SNP, the strength of the evidence that it (rather than another correlated SNP is causal. Although we focus on association studies with quantitative phenotype and a relatively restricted region (e.g., a candidate gene, the framework is applicable and computationally practical for whole genome association studies. Methods described here are implemented in a software package, Bim-Bam, available from the Stephens Lab website http://stephenslab.uchicago.edu/software.html.

  18. Automation of experimental research of waveguide paths induction soldering

    Science.gov (United States)

    Tynchenko, V. S.; Petrenko, V. E.; Kukartsev, V. V.; Tynchenko, V. V.; Antamoshkin, O. A.

    2018-05-01

    The article presents an automated system of experimental studies of the waveguide paths induction soldering process. The system is a part of additional software for a complex of automated control of the technological process of induction soldering of thin-walled waveguide paths from aluminum alloys, expanding its capabilities. The structure of the software product, the general appearance of the controls and the potential application possibilities are presented. The utility of the developed application by approbation in a series of field experiments was considered and justified. The application of the experimental research system makes it possible to improve the process under consideration, providing the possibility of fine-tuning the control regulators, as well as keeping the statistics of the soldering process in a convenient form for analysis.

  19. Optimization of the soldering process by the DMAIC methodology

    Directory of Open Access Journals (Sweden)

    Michał Zasadzień

    2016-06-01

    Full Text Available The chapter presents the use of the DMAIC method for the analysis and improvement of the process of soldering pins in a plug connecting a bundle of wires to the board of a controller; a part of the steering system of a car. The main problem in the soldering process, that is an unsatisfactory share of bad soldered connections between the board and the plug and the instability of that number, was identified by means of a five-phase improvement process. Key points and main causes of the defect were pointed out, and process improvement measures were suggested. Due to the analysis conducted and the correct implementation of improvement measures the share of defective connections has been decreased twofold.

  20. Bottom-up nanoarchitecture of semiconductor nano-building blocks by controllable in situ SEM-FIB thermal soldering method

    KAUST Repository

    Zhang, Xuan

    2017-08-10

    Here we demonstrate that the building blocks of semiconductor WO3 nanowires can be controllably soldered together by a novel nano-soldering technique of in situ SEM-FIB thermal soldering, in which the soldering temperature can precisely remain in an optimal range to avoid a strong thermal diffusion.

  1. Bottom-up nanoarchitecture of semiconductor nano-building blocks by controllable in situ SEM-FIB thermal soldering method

    KAUST Repository

    Zhang, Xuan; Zheng, Xiujun; Zhang, Hong; Zhang, Junli; Fu, Jiecai; Zhang, Qiang; Peng, Chaoyi; Bai, Feiming; Zhang, Xixiang; Peng, Yong

    2017-01-01

    Here we demonstrate that the building blocks of semiconductor WO3 nanowires can be controllably soldered together by a novel nano-soldering technique of in situ SEM-FIB thermal soldering, in which the soldering temperature can precisely remain in an optimal range to avoid a strong thermal diffusion.

  2. Damage Model for Reliability Assessment of Solder Joints in Wind Turbines

    DEFF Research Database (Denmark)

    Kostandyan, Erik; Sørensen, John Dalsgaard

    2012-01-01

    environmental factors. Reliability assessment for such type of products conventionally is performed by classical reliability techniques based on test data. Usually conventional reliability approaches are time and resource consuming activities. Thus in this paper we choose a physics of failure approach to define...... damage model by Miner’s rule. Our attention is focused on crack propagation in solder joints of electrical components due to the temperature loadings. Based on the proposed method it is described how to find the damage level for a given temperature loading profile. The proposed method is discussed...

  3. Chronic obstructive pulmonary disease candidate gene prioritization based on metabolic networks and functional information.

    Directory of Open Access Journals (Sweden)

    Xinyan Wang

    Full Text Available Chronic obstructive pulmonary disease (COPD is a multi-factor disease, in which metabolic disturbances played important roles. In this paper, functional information was integrated into a COPD-related metabolic network to assess similarity between genes. Then a gene prioritization method was applied to the COPD-related metabolic network to prioritize COPD candidate genes. The gene prioritization method was superior to ToppGene and ToppNet in both literature validation and functional enrichment analysis. Top-ranked genes prioritized from the metabolic perspective with functional information could promote the better understanding about the molecular mechanism of this disease. Top 100 genes might be potential markers for diagnostic and effective therapies.

  4. Old and Unemployable? How Age-Based Stereotypes Affect Willingness to Hire Job Candidates.

    Science.gov (United States)

    Abrams, Dominic; Swift, Hannah J; Drury, Lisbeth

    2016-03-01

    Across the world, people are required, or want, to work until an increasingly old age. But how might prospective employers view job applicants who have skills and qualities that they associate with older adults? This article draws on social role theory, age stereotypes and research on hiring biases, and reports three studies using age-diverse North American participants. These studies reveal that: (1) positive older age stereotype characteristics are viewed less favorably as criteria for job hire, (2) even when the job role is low-status, a younger stereotype profile tends to be preferred, and (3) an older stereotype profile is only considered hirable when the role is explicitly cast as subordinate to that of a candidate with a younger age profile. Implications for age-positive selection procedures and ways to reduce the impact of implicit age biases are discussed.

  5. Accelerator-Based PIXE and STIM Analysis of Candidate Solar Sail Materials

    International Nuclear Information System (INIS)

    Hollerman, W.A.; Stanaland, T.L.; Boudreaux, P.; Elberson, L.; Fontenot, J.; Gates, E.; Greco, R.; McBride, M.; Woodward, A.; Edwards, D.

    2003-01-01

    Solar sailing is a unique form of propulsion where a spacecraft gains momentum from incident photons. A totally reflective sail experiences a pressure of 9.1 μPa at a distance of 1 AU from the Sun. Since sails are not limited by reaction mass, they provide continual acceleration, reduced only by the lifetime of the lightweight film in the space environment and the distance to the Sun. Practical solar sails can expand the number of possible missions, enabling new concepts that are difficult by conventional means. One of the current challenges is to develop strong, lightweight, and radiation resistant sail materials. This paper will discuss initial results from a Particle Induced X-Ray Emission (PIXE) and Scanning Transmission Ion Microscopy (STIM) analysis of candidate solar sail materials

  6. Old and Unemployable? How Age‐Based Stereotypes Affect Willingness to Hire Job Candidates

    Science.gov (United States)

    Swift, Hannah J.; Drury, Lisbeth

    2016-01-01

    Across the world, people are required, or want, to work until an increasingly old age. But how might prospective employers view job applicants who have skills and qualities that they associate with older adults? This article draws on social role theory, age stereotypes and research on hiring biases, and reports three studies using age‐diverse North American participants. These studies reveal that: (1) positive older age stereotype characteristics are viewed less favorably as criteria for job hire, (2) even when the job role is low‐status, a younger stereotype profile tends to be preferred, and (3) an older stereotype profile is only considered hirable when the role is explicitly cast as subordinate to that of a candidate with a younger age profile. Implications for age‐positive selection procedures and ways to reduce the impact of implicit age biases are discussed. PMID:27635102

  7. Creep deformation behavior in eutectic Sn-Ag solder joints using a novel mapping technique

    Energy Technology Data Exchange (ETDEWEB)

    Lucas, J.P.; Guo, F.; McDougall, J.; Bieler, T.R.; Subramanian, K.N.; Park, J.K.

    1999-11-01

    Creep deformation behavior was measured for 60--100 {micro}m thick solder joints. The solder joints investigated consisted of: (1) non-composite solder joints made with eutectic Sn-Ag solder, and (2) composite solder joints with eutectic Sn-Ag solder containing 20 vol.%, 5 {micro}m diameter in-situ Cu{sub 6}Sn{sub 5} intermetallic reinforcements. All creep testing in this study was carried out at room temperature. Qualitative and quantitative assessment of creep deformation was characterized on the solder joints. Creep deformation was analyzed using a novel mapping technique where a geometrical-regular line pattern was etched over the entire solder joint using excimer laser ablation. During creep, the laser-ablation (LA) pattern becomes distorted due to deformation in the solder joint. By imaging the distortion of laser-ablation patterns using the SEM, actual deformation mapping for the entire solder joint is revealed. The technique involves sequential optical/digital imaging of the deformation versus time history during creep. By tracing and recording the deformation of the LA patterns on the solder over intervals of time, local creep data are obtained in many locations in the joint. This analysis enables global and localized creep shear strains and strain rate to be determined.

  8. Reliability of lead-free solder joints with different PCB surface finishes under thermal cycling

    Energy Technology Data Exchange (ETDEWEB)

    Xia Yanghua [State Key Laboratory of Functional Materials for Informatics, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai 200050 (China)], E-mail: xia_yanghua@hotmail.com; Xie Xiaoming [State Key Laboratory of Functional Materials for Informatics, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai 200050 (China)

    2008-04-24

    The reliability of lead-free electronic assemblies under thermal cycling was investigated. Thin small outline package (TSOP) devices with FeNi leads were reflow soldered on FR4 PCB (printed circuit board) with Sn3.0Ag0.5Cu (wt%) solder. The effects of different PCB finishes (organic solderability preservative (OSP) and electroless nickel immersion gold (ENIG)) were studied. The results show that OSP finish reveals better performance than its ENIG counterparts. The crack originates at the fringe of heel fillet in both cases. The propagation of crack in the ENIG case is along the device/solder interface, while in the case of OSP, the crack extends parallel to the solder/PCB interface. When the OSP finishes are employed, many Cu6Sn5 precipitates form inside the bulk solder and have a strengthening effect on the solder joint, resulting in better reliability performance as compared to those with ENIG finishes.

  9. Soldering and brazing safety guide: A handbook on space practice for those involved in soldering and brazing

    Science.gov (United States)

    This manual provides those involved in welding and brazing with effective safety procedures for use in performance of their jobs. Hazards exist in four types of general soldering and brazing processes: (1) cleaning; (2) application of flux; (3) application of heat and filler metal; and (4) residue cleaning. Most hazards during those operations can be avoided by using care, proper ventilation, protective clothing and equipment. Specific process hazards for various methods of brazing and soldering are treated. Methods to check ventilation are presented as well as a check of personal hygiene and good maintenance practices are stressed. Several emergency first aid treatments are described.

  10. Improved Switching Characteristics of Fast Power MOSFETs Applying Solder Bump Technology

    Directory of Open Access Journals (Sweden)

    Sibylle Dieckerhoff

    2008-01-01

    Full Text Available The impact of a reduced package stray inductance on the switching performance of fast power MOSFETs is discussed applying advanced 3D packaging technologies. Starting from an overview over new packaging approaches, a solder bump technology using a flexible PI substrate is exemplarily chosen for the evaluation. Measurement techniques to determine the stray inductance are discussed and compared with a numerical solution based on the PEEC method. Experimental results show the improvement of the voltage utilization while there is only a slight impact on total switching losses.

  11. Far-Infrared Based Pedestrian Detection for Driver-Assistance Systems Based on Candidate Filters, Gradient-Based Feature and Multi-Frame Approval Matching.

    Science.gov (United States)

    Wang, Guohua; Liu, Qiong

    2015-12-21

    Far-infrared pedestrian detection approaches for advanced driver-assistance systems based on high-dimensional features fail to simultaneously achieve robust and real-time detection. We propose a robust and real-time pedestrian detection system characterized by novel candidate filters, novel pedestrian features and multi-frame approval matching in a coarse-to-fine fashion. Firstly, we design two filters based on the pedestrians' head and the road to select the candidates after applying a pedestrian segmentation algorithm to reduce false alarms. Secondly, we propose a novel feature encapsulating both the relationship of oriented gradient distribution and the code of oriented gradient to deal with the enormous variance in pedestrians' size and appearance. Thirdly, we introduce a multi-frame approval matching approach utilizing the spatiotemporal continuity of pedestrians to increase the detection rate. Large-scale experiments indicate that the system works in real time and the accuracy has improved about 9% compared with approaches based on high-dimensional features only.

  12. Far-Infrared Based Pedestrian Detection for Driver-Assistance Systems Based on Candidate Filters, Gradient-Based Feature and Multi-Frame Approval Matching

    Directory of Open Access Journals (Sweden)

    Guohua Wang

    2015-12-01

    Full Text Available Far-infrared pedestrian detection approaches for advanced driver-assistance systems based on high-dimensional features fail to simultaneously achieve robust and real-time detection. We propose a robust and real-time pedestrian detection system characterized by novel candidate filters, novel pedestrian features and multi-frame approval matching in a coarse-to-fine fashion. Firstly, we design two filters based on the pedestrians’ head and the road to select the candidates after applying a pedestrian segmentation algorithm to reduce false alarms. Secondly, we propose a novel feature encapsulating both the relationship of oriented gradient distribution and the code of oriented gradient to deal with the enormous variance in pedestrians’ size and appearance. Thirdly, we introduce a multi-frame approval matching approach utilizing the spatiotemporal continuity of pedestrians to increase the detection rate. Large-scale experiments indicate that the system works in real time and the accuracy has improved about 9% compared with approaches based on high-dimensional features only.

  13. Microstructural effects on constitutive and fatigue fracture behavior of TinSilverCopper solder

    Science.gov (United States)

    Tucker, Jonathon P.

    As microelectronic package construction becomes more diverse and complex, the need for accurate, geometry-independent material constitutive and failure models increases. Evaluations of packages based on accelerated environmental tests (such as accelerated thermal cycling or power cycling) only provide package-dependent reliability information. In addition, extrapolations of such test data to life predictions under field conditions are often empirical. Besides geometry, accelerated environmental test data must account for microstructural factors such as alloy composition or isothermal aging condition, resulting in expensive experimental variation. In this work, displacement-controlled, creep, and fatigue lap shear tests are conducted on specially designed SnAgCu test specimens with microstructures representative to those found in commercial microelectronic packages. The data are used to develop constitutive and fatigue fracture material models capable of describing deformation and fracture behavior for the relevant temperature and strain rate ranges. Furthermore, insight is provided into the microstructural variation of solder joints and the subsequent effect on material behavior. These models are appropriate for application to packages of any geometrical construction. The first focus of the thesis is on Pb-mixed SnAgCu solder alloys. During the transition from Pb-containing solders to Pb-free solders, joints composed of a mixture of SnPb and SnAgCu often result from either mixed assemblies or rework. Three alloys of 1, 5 and 20 weight percent Pb were selected so as to represent reasonable ranges of Pb contamination expected from different 63Sn37Pb components mixed with Sn3.0Ag0.5Cu. Displacement-controlled (constant strain rate) and creep tests were performed at temperatures of 25°C, 75°C, and 125°C using a double lap shear test setup that ensures a nearly homogeneous state of plastic strain at the joint interface. Rate-dependent constitutive models for Pb

  14. Horizon shells and BMS-like soldering transformations

    Energy Technology Data Exchange (ETDEWEB)

    Blau, Matthias [Albert Einstein Center for Fundamental Physics,Institute for Theoretical Physics, University of Bern,Sidlerstrasse 5, 3012 Bern (Switzerland); O’Loughlin, Martin [University of Nova Gorica,Vipavska 13, 5000 Nova Gorica (Slovenia)

    2016-03-07

    We revisit the theory of null shells in general relativity, with a particular emphasis on null shells placed at horizons of black holes. We study in detail the considerable freedom that is available in the case that one solders two metrics together across null hypersurfaces (such as Killing horizons) for which the induced metric is invariant under translations along the null generators. In this case the group of soldering transformations turns out to be infinite dimensional, and these solderings create non-trivial horizon shells containing both massless matter and impulsive gravitational wave components. We also rephrase this result in the language of Carrollian symmetry groups. To illustrate this phenomenon we discuss in detail the example of shells on the horizon of the Schwarzschild black hole (with equal interior and exterior mass), uncovering a rich classical structure at the horizon and deriving an explicit expression for the general horizon shell energy-momentum tensor. In the special case of BMS-like soldering supertranslations we find a conserved shell-energy that is strikingly similar to the standard expression for asymptotic BMS supertranslation charges, suggesting a direct relation between the physical properties of these horizon shells and the recently proposed BMS supertranslation hair of a black hole.

  15. Soluble Lead and Bismuth Chalcogenidometallates: Versatile Solders for Thermoelectric Materials

    Energy Technology Data Exchange (ETDEWEB)

    Zhang, Hao [Department; Son, Jae Sung [Department; School; Dolzhnikov, Dmitriy S. [Department; Filatov, Alexander S. [Department; Hazarika, Abhijit [Department; Wang, Yuanyuan [Department; Hudson, Margaret H. [Department; Sun, Cheng-Jun [Advanced; Chattopadhyay, Soma [Physical; Talapin, Dmitri V. [Department; Center

    2017-07-27

    Here we report the syntheses of largely unexplored lead and bismuth chalcogenidometallates in the solution phase. Using N2H4 as the solvent, new compounds such as K6Pb3Te6·7N2H4 were obtained. These soluble molecular compounds underwent cation exchange processes using resin chemistry, replacing Na+ or K+ by decomposable N2H5+ or tetraethylammonium cations. They also transformed into stoichiometric lead and bismuth chalcogenide nanomaterials with the addition of metal salts. Such a versatile chemistry led to a variety of composition-matched solders to join lead and bismuth chalcogenides and tune their charge transport properties at the grain boundaries. Solution-processed thin films composed of Bi0.5Sb1.5Te3 microparticles soldered by (N2H5)6Bi0.5Sb1.5Te6 exhibited thermoelectric power factors (~28 μW/cm K2) comparable to those in vacuum-deposited Bi0.5Sb1.5Te3 films. The soldering effect can also be integrated with attractive fabrication techniques for thermoelectric modules, such as screen printing, suggesting the potential of these solders in the rational design of printable and moldable thermoelectrics.

  16. Effects of PCB thickness on adjustable fountain wave soldering

    Indian Academy of Sciences (India)

    hybrid circuit assembly, component lead tinning, and wire tinning. .... The mesh model was built and optimized with 599920 hybrid nodes as shown in figure 9. ... conducted to track the fluid motions of the two phases (i.e., molten solder and air).

  17. A meta-analysis based method for prioritizing candidate genes involved in a pre-specific function

    Directory of Open Access Journals (Sweden)

    Jingjing Zhai

    2016-12-01

    Full Text Available The identification of genes associated with a given biological function in plants remains a challenge, although network-based gene prioritization algorithms have been developed for Arabidopsis thaliana and many non-model plant species. Nevertheless, these network-based gene prioritization algorithms have encountered several problems; one in particular is that of unsatisfactory prediction accuracy due to limited network coverage, varying link quality, and/or uncertain network connectivity. Thus a model that integrates complementary biological data may be expected to increase the prediction accuracy of gene prioritization. Towards this goal, we developed a novel gene prioritization method named RafSee, to rank candidate genes using a random forest algorithm that integrates sequence, evolutionary, and epigenetic features of plants. Subsequently, we proposed an integrative approach named RAP (Rank Aggregation-based data fusion for gene Prioritization, in which an order statistics-based meta-analysis was used to aggregate the rank of the network-based gene prioritization method and RafSee, for accurately prioritizing candidate genes involved in a pre-specific biological function. Finally, we showcased the utility of RAP by prioritizing 380 flowering-time genes in Arabidopsis. The ‘leave-one-out’ cross-validation experiment showed that RafSee could work as a complement to a current state-of-art network-based gene prioritization system (AraNet v2. Moreover, RAP ranked 53.68% (204/380 flowering-time genes higher than AraNet v2, resulting in an 39.46% improvement in term of the first quartile rank. Further evaluations also showed that RAP was effective in prioritizing genes-related to different abiotic stresses. To enhance the usability of RAP for Arabidopsis and non-model plant species, an R package implementing the method is freely available at http://bioinfo.nwafu.edu.cn/software.

  18. Phylogeography, salinity adaptations and metabolic potential of the Candidate Division KB1 Bacteria based on a partial single cell genome.

    Directory of Open Access Journals (Sweden)

    Lisa M Nigro

    2016-08-01

    Full Text Available Deep-sea hypersaline anoxic basins (DHABs and other hypersaline environments contain abundant and diverse microbial life that has adapted to these extreme conditions. The bacterial Candidate Division KB1 represents one of several uncultured groups that has been consistently observed in hypersaline microbial diversity studies. Here we report the phylogeography of KB1, its phylogenetic relationships to Candidate Division OP1 Bacteria, and its potential metabolic and osmotic stress adaptations based on a partial single cell amplified genome (SAG of KB1 from Orca Basin, the largest hypersaline seafloor brine basin in the Gulf of Mexico. Our results are consistent with the hypothesis – previously developed based on 14C incorporation experiments with mixed-species enrichments from Mediterranean seafloor brines - that KB1 has adapted its proteins to elevated intracellular salinity, but at the same time KB1 apparently imports glycine betaine; this compatible solute is potentially not limited to osmoregulation but could also serve as a carbon and energy source.

  19. Solder wetting behavior enhancement via laser-textured surface microcosmic topography

    Energy Technology Data Exchange (ETDEWEB)

    Chen, Haiyan [State Key Laboratory of Solidification Processing, Northwestern Polytechnical University, Xi’an 710072 (China); Shaanxi Key Laboratory of Friction Welding Technologies, Xi’an 710072 (China); Peng, Jianke [Shaanxi Key Laboratory of Friction Welding Technologies, Xi’an 710072 (China); Fu, Li, E-mail: fuli@nwpu.edu.cn [State Key Laboratory of Solidification Processing, Northwestern Polytechnical University, Xi’an 710072 (China); Shaanxi Key Laboratory of Friction Welding Technologies, Xi’an 710072 (China); Wang, Xincheng [Shaanxi Key Laboratory of Friction Welding Technologies, Xi’an 710072 (China); Xie, Yan [School of Materials Science and Engineering, Tianjin University, Tianjin 300072 (China)

    2016-04-15

    Graphical abstract: - Highlights: • The wetting angle of lead free solder on Cu was reduced by surface microstructure. • The wetting form of Sn-Ag-Cu solder on Cu was “non-composite surface”. • The experimental results had a sound fit with the theoretical calculation. - Abstract: In order to reduce or even replace the use of Sn-Pb solder in electronics industry, the laser-textured surface microstructures were used to enhance the wetting behavior of lead free solder during soldering. According to wetting theory and Sn-Ag-Cu lead free solder performance, we calculated and designed four microcosmic structures with the similar shape and different sizes to control the wetting behavior of lead free solder. The micro-structured surfaces with different dimensions were processed on copper plates by fiber femtosecond laser, and the effect of microstructures on wetting behavior was verified experimentally. The results showed that the wetting angle of Sn-Ag-Cu solder on the copper plate with microstructures decreased effectively compared with that on the smooth copper plate. The wetting angles had a sound fit with the theoretical values calculated by wetting model. The novel method provided a feasible route for adjusting the wetting behavior of solders and optimizing solders system.

  20. Optimized candidal biofilm microtiter assay

    NARCIS (Netherlands)

    Krom, Bastiaan P.; Cohen, Jesse B.; Feser, Gail E. McElhaney; Cihlar, Ronald L.

    Microtiter based candidal biofilm formation is commonly being used. Here we describe the analysis of factors influencing the development of candidal biofilms such as the coating with serum, growth medium and pH. The data reported here show that optimal candidal biofilm formation is obtained when

  1. Predicting Dissertation Methodology Choice among Doctoral Candidates at a Faith-Based University

    Science.gov (United States)

    Lunde, Rebecca

    2017-01-01

    Limited research has investigated dissertation methodology choice and the factors that contribute to this choice. Quantitative research is based in mathematics and scientific positivism, and qualitative research is based in constructivism. These underlying philosophical differences posit the question if certain factors predict dissertation…

  2. Recognition-Based Pedagogy: Teacher Candidates' Experience of Deficit

    Science.gov (United States)

    Parkison, Paul T.; DaoJensen, Thuy

    2014-01-01

    This study seeks to introduce what we call "recognition-based pedagogy" as a conceptual frame through which teachers and instructors can collaboratively develop educative experiences with students. Recognition-based pedagogy connects the theories of critical pedagogy, identity politics, and the politics of recognition with the educative…

  3. Thermal fatigue life evaluation of SnAgCu solder joints in a multi-chip power module

    Science.gov (United States)

    Barbagallo, C.; Malgioglio, G. L.; Petrone, G.; Cammarata, G.

    2017-05-01

    For power devices, the reliability of thermal fatigue induced by thermal cycling has been prioritized as an important concern. The main target of this work is to apply a numerical procedure to assess the fatigue life for lead-free solder joints, that represent, in general, the weakest part of the electronic modules. Starting from a real multi-chip power module, FE-based models were built-up by considering different conditions in model implementation in order to simulate, from one hand, the worst working condition for the module and, from another one, the module standing into a climatic test room performing thermal cycles. Simulations were carried-out both in steady and transient conditions in order to estimate the module thermal maps, the stress-strain distributions, the effective plastic strain distributions and finally to assess the number of cycles to failure of the constitutive solder layers.

  4. Thermal fatigue life evaluation of SnAgCu solder joints in a multi-chip power module

    International Nuclear Information System (INIS)

    Barbagallo, C; Petrone, G; Cammarata, G; Malgioglio, G L

    2017-01-01

    For power devices, the reliability of thermal fatigue induced by thermal cycling has been prioritized as an important concern. The main target of this work is to apply a numerical procedure to assess the fatigue life for lead-free solder joints, that represent, in general, the weakest part of the electronic modules. Starting from a real multi-chip power module, FE-based models were built-up by considering different conditions in model implementation in order to simulate, from one hand, the worst working condition for the module and, from another one, the module standing into a climatic test room performing thermal cycles. Simulations were carried-out both in steady and transient conditions in order to estimate the module thermal maps, the stress-strain distributions, the effective plastic strain distributions and finally to assess the number of cycles to failure of the constitutive solder layers. (paper)

  5. Substituição das soldas estanho-chumbo na manufatura: efeitos na saúde do trabalhador e no desempenho ambiental Substitution of tin-lead solders in manufacturing: impacts on workers' health and on the environment

    Directory of Open Access Journals (Sweden)

    Cecilia Maria Villas Bôas de Almeida

    2013-03-01

    Full Text Available As soldas à base de estanho-chumbo (63Sn/37Pb são largamente utilizadas no Brasil e no mundo. Este estudo aplica a avaliação em emergia em um fabricante de soldas brandas à base de estanho e chumbo e outros metais. O cálculo da emergia por unidade de três tipos de solda mostra que mais recursos são utilizados para produzir uma tonelada de soldas livres de chumbo do que para produzir soldas à base de estanho e chumbo. O indicador DALY (Disability Adjusted Life Years foi utilizado para comparar as emissões na atmosfera dos três tipos de produção de soldas e os resultados apontam para a adoção das soldas à base de chumbo, quando se considera todo o ciclo de vida do produto. A diferença entre os resultados obtidos por avaliações locais e globais é discutida.Tin-lead solders (Sn63-Pb37 have been widely used in Brazil and worldwide. This study evaluates the emergy in a company that manufactures soft solders based on tin, lead, and other metals. The calculation of emergy per unit of three types of solder showed that more resources are used to produce one ton of lead-free solders than those used to produce tin-lead solders. The DALY (Disability Adjusted Life Years indicator was used to assess the emissions to air of three types of solder. The results favor the use of tin-lead solders when the whole product life-cycle is evaluated. The difference between the results obtained by local and global assessments is discussed.

  6. Prioritizing Candidate Disease Metabolites Based on Global Functional Relationships between Metabolites in the Context of Metabolic Pathways

    Science.gov (United States)

    Yang, Haixiu; Xu, Yanjun; Han, Junwei; Li, Jing; Su, Fei; Zhang, Yunpeng; Zhang, Chunlong; Li, Dongguo; Li, Xia

    2014-01-01

    Identification of key metabolites for complex diseases is a challenging task in today's medicine and biology. A special disease is usually caused by the alteration of a series of functional related metabolites having a global influence on the metabolic network. Moreover, the metabolites in the same metabolic pathway are often associated with the same or similar disease. Based on these functional relationships between metabolites in the context of metabolic pathways, we here presented a pathway-based random walk method called PROFANCY for prioritization of candidate disease metabolites. Our strategy not only takes advantage of the global functional relationships between metabolites but also sufficiently exploits the functionally modular nature of metabolic networks. Our approach proved successful in prioritizing known metabolites for 71 diseases with an AUC value of 0.895. We also assessed the performance of PROFANCY on 16 disease classes and found that 4 classes achieved an AUC value over 0.95. To investigate the robustness of the PROFANCY, we repeated all the analyses in two metabolic networks and obtained similar results. Then we applied our approach to Alzheimer's disease (AD) and found that a top ranked candidate was potentially related to AD but had not been reported previously. Furthermore, our method was applicable to prioritize the metabolites from metabolomic profiles of prostate cancer. The PROFANCY could identify prostate cancer related-metabolites that are supported by literatures but not considered to be significantly differential by traditional differential analysis. We also developed a freely accessible web-based and R-based tool at http://bioinfo.hrbmu.edu.cn/PROFANCY. PMID:25153931

  7. Evaluation of Candidate Measures for Home-Based Screening of Sleep Disordered Breathing in Taiwanese Bus Drivers

    Directory of Open Access Journals (Sweden)

    Hua Ting

    2014-05-01

    Full Text Available Background: Sleepiness-at-the-wheel has been identified as a major cause of highway accidents. The aim of our study is identifying the candidate measures for home-based screening of sleep disordered breathing in Taiwanese bus drivers, instead of polysomnography. Methods: Overnight polysomnography accompanied with simultaneous measurements of alternative screening devices (pulse oximetry, ApneaLink, and Actigraphy, heart rate variability, wake-up systolic blood pressure and questionnaires were completed by 151 eligible participants who were long-haul bus drivers with a duty period of more than 12 h a day and duty shifting. Results: 63.6% of professional bus drivers were diagnosed as having sleep disordered breathing and had a higher body mass index, neck circumference, systolic blood pressure, arousal index and desaturation index than those professional bus drivers without evidence of sleep disordered breathing. Simple home-based candidate measures: (1 Pulse oximetry, oxygen-desaturation indices by ≥3% and 4% (r = 0.87~0.92; (2 Pulse oximetry, pulse-rising indices by ≥7% and 8% from a baseline (r = 0.61~0.89; and (3 ApneaLink airflow detection, apnea-hypopnea indices (r = 0.70~0.70, based on recording-time or Actigraphy-corrected total sleep time were all significantly correlated with, and had high agreement with, corresponding polysomnographic apnea-hypopnea indices [(1 94.5%~96.6%, (2 93.8%~97.2%, (3 91.1%~91.3%, respectively]. Conversely, no validities of SDB screening were found in the multi-variables apnea prediction questionnaire, Epworth Sleepiness Scale, night-sleep heart rate variability, wake-up systolic blood pressure and anthropometric variables. Conclusions: The indices of pulse oximetry and apnea flow detection are eligible criteria for home-based screening of sleep disordered breathing, specifically for professional drivers.

  8. Application of a kernel-based online learning algorithm to the classification of nodule candidates in computer-aided detection of CT lung nodules

    International Nuclear Information System (INIS)

    Matsumoto, S.; Ohno, Y.; Takenaka, D.; Sugimura, K.; Yamagata, H.

    2007-01-01

    Classification of the nodule candidates in computer-aided detection (CAD) of lung nodules in CT images was addressed by constructing a nonlinear discriminant function using a kernel-based learning algorithm called the kernel recursive least-squares (KRLS) algorithm. Using the nodule candidates derived from the processing by a CAD scheme of 100 CT datasets containing 253 non-calcified nodules or 3 mm or larger as determined by the consensus of two thoracic radiologists, the following trial were carried out 100 times: by randomly selecting 50 datasets for training, a nonlinear discriminant function was obtained using the nodule candidates in the training datasets and tested with the remaining candidates; for comparison, a rule-based classification was tested in a similar manner. At the number of false positives per case of about 5, the nonlinear classification method showed an improved sensitivity of 80% (mean over the 100 trials) compared with 74% of the rule-based method. (orig.)

  9. Blood-Based Biomarker Candidates of Cerebral Amyloid Using PiB PET in Non-Demented Elderly

    Science.gov (United States)

    Westwood, Sarah; Leoni, Emanuela; Hye, Abdul; Lynham, Steven; Khondoker, Mizanur R.; Ashton, Nicholas J.; Kiddle, Steven J.; Baird, Alison L.; Sainz-Fuertes, Ricardo; Leung, Rufina; Graf, John; Hehir, Cristina Tan; Baker, David; Cereda, Cristina; Bazenet, Chantal; Ward, Malcolm; Thambisetty, Madhav; Lovestone, Simon

    2018-01-01

    Increasingly, clinical trials for Alzheimer’s disease (AD) are being conducted earlier in the disease phase and with biomarker confirmation using in vivo amyloid PET imaging or CSF tau and Aβ measures to quantify pathology. However, making such a pre-clinical AD diagnosis is relatively costly and the screening failure rate is likely to be high. Having a blood-based marker that would reduce such costs and accelerate clinical trials through identifying potential participants with likely pre-clinical AD would be a substantial advance. In order to seek such a candidate biomarker, discovery phase proteomic analyses using 2DGE and gel-free LC-MS/MS for high and low molecular weight analytes were conducted on longitudinal plasma samples collected over a 12-year period from non-demented older individuals who exhibited a range of 11C-PiB PET measures of amyloid load. We then sought to extend our discovery findings by investigating whether our candidate biomarkers were also associated with brain amyloid burden in disease, in an independent cohort. Seven plasma proteins, including A2M, Apo-A1, and multiple complement proteins, were identified as pre-clinical biomarkers of amyloid burden and were consistent across three time points (p biomarker signature indicative of AD pathology at a stage long before the onset of clinical disease manifestation. As in previous studies, acute phase reactants and inflammatory markers dominate this signature. PMID:27031486

  10. Fast selection of miRNA candidates based on large-scale pre-computed MFE sets of randomized sequences.

    Science.gov (United States)

    Warris, Sven; Boymans, Sander; Muiser, Iwe; Noback, Michiel; Krijnen, Wim; Nap, Jan-Peter

    2014-01-13

    Small RNAs are important regulators of genome function, yet their prediction in genomes is still a major computational challenge. Statistical analyses of pre-miRNA sequences indicated that their 2D structure tends to have a minimal free energy (MFE) significantly lower than MFE values of equivalently randomized sequences with the same nucleotide composition, in contrast to other classes of non-coding RNA. The computation of many MFEs is, however, too intensive to allow for genome-wide screenings. Using a local grid infrastructure, MFE distributions of random sequences were pre-calculated on a large scale. These distributions follow a normal distribution and can be used to determine the MFE distribution for any given sequence composition by interpolation. It allows on-the-fly calculation of the normal distribution for any candidate sequence composition. The speedup achieved makes genome-wide screening with this characteristic of a pre-miRNA sequence practical. Although this particular property alone will not be able to distinguish miRNAs from other sequences sufficiently discriminative, the MFE-based P-value should be added to the parameters of choice to be included in the selection of potential miRNA candidates for experimental verification.

  11. The metallurgical approach on the solder voids behaviour in surface mount devices

    International Nuclear Information System (INIS)

    Mohabattul Zaman Bukhari

    1996-01-01

    Solder voids are believed to cause poor heat dissiption in the Surface Mount devices and reduce the reliability of the devices at higher operating services. There are a lot of factors involved in creating voids such as gas/flux entrapment, wettability, outgasseous, air bubbles in the solder paste, inconsistency of solder coverage and improper metal scheme selection. This study was done to observe the behaviour of the solder voids in term of flux entrapmentt and wettability. It is believed that flux entrapment and wettability are verify this hypothesis. Two types of metal scheme were chosen which are Nickel (Ni) plated and Tin (Sn) plated heatsink. X-ray techniques such as Radiographic Inspection Analysis and EDAX were used to detect the minute solder voids. The solder voids observed on the heatsinks and Copper shims after the reflow process are believed to be a non contact voids that resulted from some portion of the surface not wetting properly

  12. The Effect of Genre-based Scaffolding on Research Paper Writing of MA Candidates in an EFL Context

    Directory of Open Access Journals (Sweden)

    Sara Salehpour

    2014-11-01

    Full Text Available In recent years, there has been an increasing amount of literature on genre-based approaches to writing instruction. However, scant attention has been paid to the use of genre-based scaffolding in the realm of academic writing. Hence, in an attempt to tackle the problems prevalent in academic writing, this study set out to investigate the effect of genre-based scaffolding through sentence starters and writing frames on MA candidates’ research paper writing. To this end, twenty MA candidates majoring in ELT were randomly assigned to two homogenous groups, one control and one experimental group, each including 10 participants. Both groups were exposed to a five-session genre-based instruction while the experimental group benefitted from the additional provision of sentence starters and writing frames relevant to different sections of a research paper. The analysis of the results, using independent sample of t-test, reveals that genre-based instruction can be a useful tool in improving academic writing. Moreover, the outperformance of the participants of the experimental group is indicative of the beneficial effect of scaffolding through starters and frames.

  13. Discovery and characterization of antibody variants using mass spectrometry-based comparative analysis for biosimilar candidates of monoclonal antibody drugs.

    Science.gov (United States)

    Li, Wenhua; Yang, Bin; Zhou, Dongmei; Xu, Jun; Ke, Zhi; Suen, Wen-Chen

    2016-07-01

    Liquid chromatography mass spectrometry (LC-MS) is the most commonly used technique for the characterization of antibody variants. MAb-X and mAb-Y are two approved IgG1 subtype monoclonal antibody drugs recombinantly produced in Chinese hamster ovary (CHO) cells. We report here that two unexpected and rare antibody variants have been discovered during cell culture process development of biosimilars for these two approved drugs through intact mass analysis. We then used comprehensive mass spectrometry-based comparative analysis including reduced light, heavy chains, and domain-specific mass as well as peptide mapping analysis to fully characterize the observed antibody variants. The "middle-up" mass comparative analysis demonstrated that the antibody variant from mAb-X biosimilar candidate was caused by mass variation of antibody crystalline fragment (Fc), whereas a different variant with mass variation in antibody antigen-binding fragment (Fab) from mAb-Y biosimilar candidate was identified. Endoproteinase Lys-C digested peptide mapping and tandem mass spectrometry analysis further revealed that a leucine to glutamine change in N-terminal 402 site of heavy chain was responsible for the generation of mAb-X antibody variant. Lys-C and trypsin coupled non-reduced and reduced peptide mapping comparative analysis showed that the formation of the light-heavy interchain trisulfide bond resulted in the mAb-Y antibody variant. These two cases confirmed that mass spectrometry-based comparative analysis plays a critical role for the characterization of monoclonal antibody variants, and biosimilar developers should start with a comprehensive structural assessment and comparative analysis to decrease the risk of the process development for biosimilars. Copyright © 2016 Elsevier B.V. All rights reserved.

  14. Laser tissue welding mediated with a protein solder

    Science.gov (United States)

    Small, Ward, IV; Heredia, Nicholas J.; Celliers, Peter M.; Da Silva, Luiz B.; Eder, David C.; Glinsky, Michael E.; London, Richard A.; Maitland, Duncan J.; Matthews, Dennis L.; Soltz, Barbara A.

    1996-05-01

    A study of laser tissue welding mediated with an indocyanine green dye-enhanced protein solder was performed. Freshly obtained sections of porcine artery were used for the experiments. Sample arterial wall thickness ranged from two to three millimeters. Incisions approximately four millimeters in length were treated using an 805 nanometer continuous- wave diode laser coupled to a one millimeter diameter fiber. Controlled parameters included the power delivered by the laser, the duration of the welding process, and the concentration of dye in the solder. A two-color infrared detection system was constructed to monitor the surface temperatures achieved at the weld site. Burst pressure measurements were made to quantify the strengths of the welds immediately following completion of the welding procedure.

  15. Candidate for a fully frustrated square lattice in a verdazyl-based salt

    Science.gov (United States)

    Yamaguchi, H.; Tamekuni, Y.; Iwasaki, Y.; Hosokoshi, Y.

    2018-05-01

    We present an experimental realization of an S =1 /2 fully frustrated square lattice (FFSL) composed of a verdazyl-based salt (p -MePy-V) (TCNQ ) .(CH3)2CO . Ab initio molecular orbital calculations indicate that there are four types of competing ferro- and antiferromagnetic nearest-neighbor interactions present in the system, which combine to form an S =1 /2 FFSL. Below room temperature, the magnetic susceptibility of the material can be considered to arise from the S =1 /2 FFSL formed by the p -MePy-V and indicates that the system forms a quantum valence-bond solid state whose excitation energy is gapped. Furthermore, we also observe semiconducting behavior arising from the one-dimensional chain structure of the TCNQ molecules.

  16. Electromigration in 3D-IC scale Cu/Sn/Cu solder joints

    Energy Technology Data Exchange (ETDEWEB)

    Ho, Cheng-En, E-mail: ceho1975@hotmail.com; Lee, Pei-Tzu; Chen, Chih-Nan; Yang, Cheng-Hsien

    2016-08-15

    The electromigration effect on the three-dimensional integrated circuits (3D-IC) scale solder joints with a Cu/Sn(25–50 μm)/Cu configuration was investigated using a field-emission scanning electron microscope (FE–SEM) combined with electron backscatter diffraction (EBSD) analysis system. Electron current stressing for a few days caused the pronounced accumulation of Cu{sub 6}Sn{sub 5} in specific Sn grain boundaries (GBs). The EBSD analysis indicated that both the β-Sn crystallographic orientation and GB orientation play dominant roles in this accumulation. The dependencies of the Cu{sub 6}Sn{sub 5} accumulation on the two above factors (i.e., Sn grain orientation and GB orientation) can be well rationalized via a proposed mathematic model based on the Huntington and Grone's electromigration theory with the Cu anisotropic diffusion data in a β-Sn lattice. - Highlights: • Anisotropic Cu electromigration in the 3D-IC scale microelectronic solder joints. • Pronounced accumulation of Cu{sub 6}Sn{sub 5} intermetallic in specific Sn grain boundaries. • A linear dependence of Cu{sub 6}Sn{sub 5} accumulation over the current stressing time. • β-Sn and grain boundary orientations are the dominant factors in Cu{sub 6}Sn{sub 5} accumulation.

  17. Quality Analysis of Welded and Soldered Joints of Cu-Nb Microcomposite Wires

    Directory of Open Access Journals (Sweden)

    Nikolaj VIŠNIAKOV

    2011-03-01

    Full Text Available Quality analysis of welded and soldered joints of Cu-Nb microcomposite wires has been performed. Quality and mechanical characteristics of joints as ultimate tensile stress limit and elongation at break were measured with an universal testing machine and controlled visually using an optical microscope. Two wires joints were soldered with silver and copper solders and put into steel and copper sleeve respectively. Another two wires joints were soldered with silver solder and welded without any reinforcement. Joints soldered with the silver solder and steel sleeve have demonstrated the best mechanical characteristics: ultimate tensile stress limit of 650 MPa and elongation at break of 0.85 %. Joints soldered with the copper sleeve have no advantages comparing with the soldered butt joint. Ultimate tensile stress limit and elongation at break were in 300 MPa - 350 MPa and in 0.35 % - 0.45 % ranges respectively. Two welded joints had ultimate tensile stress limit of 470 MPa and elongation at break of 0.71 %. In all joints the microstructure of Nb filaments was destroyed and mechanical properties have been specified by mechanical strength of copper and sleeve materials only.http://dx.doi.org/10.5755/j01.ms.17.1.242

  18. Reliability of soldered joints for automotive electronic devices; Denso buhin ni okeru handa setsugo no shinraisei

    Energy Technology Data Exchange (ETDEWEB)

    Kita, T; Mukaibo, N; Ando, K; Moriyama, M [Honda R and D Co. Ltd., Tokyo (Japan)

    1997-10-01

    Concerning the tin and lead eutectic solder, we have evaluated the reliability of three factors of intermetallic compound layer, creep and vibration which cause solder degradation. First, the stress factor was extracted from investigating the mechanism of degradation, and the best acceleration test method was fixed. Next, the acceleration test was executed to find the stress dependency and the tendency of solder degradation was modeled numerically. While the environmental stress frequency was obtained and they were put together by using a minor method, which enabled us to predict the life span of solder on the market with precision. 5 refs., 13 figs.

  19. Influence of Difference Solders Volume on Intermetallic Growth of Sn-4.0Ag-0.5Cu/ENEPIG

    Directory of Open Access Journals (Sweden)

    Saliza Azlina O.

    2016-01-01

    Full Text Available In recent years, portable electronic packaging products such as smart phones, tablets, notebooks and other gadgets have been developed with reduced size of component packaging, light weight, high speed and with enhanced performance. Thus, flip chip technology with smaller solder sphere sizes that would produce fine solder joint interconnections have become essential in order to fulfill these miniaturization requirements. This study investigates the interfacial reactions and intermetallics formation during reflow soldering and isothermal aging between Sn-4.0Ag-0.5Cu (SAC405 and electroless nickel/immersion palladium/immersion gold (EN(PEPIG. Solder diameters of 300 μm and 700 μm were used to compare the effect of solder volume on the solder joint microstructure. The solid state isothermal aging was performed at 125°C starting from 250 hours until 2000 hours. The results revealed that only (Cu,Ni6Sn5 IMC was found at the interface during reflow soldering while both (Cu,Ni6Sn5 and (Ni,Cu3Sn4 IMC have been observed after aging process. Smaller solder sizes produced thinner IMC than larger solder joints investigated after reflow soldering, whereas the larger solders produced thinner IMC than the smaller solders after isothermal aging. Aging duration of solder joints has been found to be increase the IMC’s thickness and changed the IMC morphologies to spherical-shaped, compacted and larger grain size.

  20. Laser beam soldering of micro-optical components

    Science.gov (United States)

    Eberhardt, R.

    2003-05-01

    MOTIVATION Ongoing miniaturisation and higher requirements within optical assemblies and the processing of temperature sensitive components demands for innovative selective joining techniques. So far adhesive bonding has primarily been used to assemble and adjust hybrid micro optical systems. However, the properties of the organic polymers used for the adhesives limit the application of these systems. In fields of telecommunication and lithography, an enhancement of existing joining techniques is necessary to improve properties like humidity resistance, laserstability, UV-stability, thermal cycle reliability and life time reliability. Against this background laser beam soldering of optical components is a reasonable joining technology alternative. Properties like: - time and area restricted energy input - energy input can be controlled by the process temperature - direct and indirect heating of the components is possible - no mechanical contact between joining tool and components give good conditions to meet the requirements on a joining technology for sensitive optical components. Additionally to the laser soldering head, for the assembly of optical components it is necessary to include positioning units to adjust the position of the components with high accuracy before joining. Furthermore, suitable measurement methods to characterize the soldered assemblies (for instance in terms of position tolerances) need to be developed.

  1. A malaria diagnostic tool based on computer vision screening and visualization of Plasmodium falciparum candidate areas in digitized blood smears.

    Directory of Open Access Journals (Sweden)

    Nina Linder

    Full Text Available INTRODUCTION: Microscopy is the gold standard for diagnosis of malaria, however, manual evaluation of blood films is highly dependent on skilled personnel in a time-consuming, error-prone and repetitive process. In this study we propose a method using computer vision detection and visualization of only the diagnostically most relevant sample regions in digitized blood smears. METHODS: Giemsa-stained thin blood films with P. falciparum ring-stage trophozoites (n = 27 and uninfected controls (n = 20 were digitally scanned with an oil immersion objective (0.1 µm/pixel to capture approximately 50,000 erythrocytes per sample. Parasite candidate regions were identified based on color and object size, followed by extraction of image features (local binary patterns, local contrast and Scale-invariant feature transform descriptors used as input to a support vector machine classifier. The classifier was trained on digital slides from ten patients and validated on six samples. RESULTS: The diagnostic accuracy was tested on 31 samples (19 infected and 12 controls. From each digitized area of a blood smear, a panel with the 128 most probable parasite candidate regions was generated. Two expert microscopists were asked to visually inspect the panel on a tablet computer and to judge whether the patient was infected with P. falciparum. The method achieved a diagnostic sensitivity and specificity of 95% and 100% as well as 90% and 100% for the two readers respectively using the diagnostic tool. Parasitemia was separately calculated by the automated system and the correlation coefficient between manual and automated parasitemia counts was 0.97. CONCLUSION: We developed a decision support system for detecting malaria parasites using a computer vision algorithm combined with visualization of sample areas with the highest probability of malaria infection. The system provides a novel method for blood smear screening with a significantly reduced need for

  2. Losing on all fronts: the effects of negative versus positive person-based campaigns on implicit and explicit evaluations of political candidates.

    Science.gov (United States)

    Carraro, Luciana; Gawronski, Bertram; Castelli, Luigi

    2010-09-01

    The current research investigated the effects of negative as compared to positive person-based political campaigns on explicit and implicit evaluations of the involved candidates. Participants were presented with two political candidates and statements that one of them ostensibly said during the last political campaign. For half of the participants, the campaign included positive remarks about the source of the statement (positive campaign); for the remaining half, the campaign included negative remarks about the opponent (negative campaign). Afterwards, participants completed measures of explicit and implicit evaluations of both candidates. Results indicate that explicit evaluations of the source, but not the opponent, were less favourable after negative as compared to positive campaigns. In contrast, implicit evaluations were less favourable for both candidates after negative campaigns. The results are discussed in terms of associative and propositional processes, highlighting the importance of associative processes in political decision making.

  3. Electrochemical Behavior of Sn-9Zn- xTi Lead-Free Solders in Neutral 0.5M NaCl Solution

    Science.gov (United States)

    Wang, Zhenghong; Chen, Chuantong; Jiu, Jinting; Nagao, Shijo; Nogi, Masaya; Koga, Hirotaka; Zhang, Hao; Zhang, Gong; Suganuma, Katsuaki

    2018-05-01

    Electrochemical techniques were employed to study the electrochemical corrosion behavior of Sn-9Zn- xTi ( x = 0, 0.05, 0.1, 0.2 wt.%) lead-free solders in neutral 0.5M NaCl solution, aiming to figure out the effect of Ti content on the corrosion properties of Sn-9Zn, providing information for the composition design of Sn-Zn-based lead-free solders from the perspective of corrosion. EIS results reveal that Ti addition was involved in the corrosion product layer and changed electrochemical interface behavior from charge transfer control process to diffusion control process. The trace amount of Ti addition (0.05 wt.%) can refine the microstructure and improve the corrosion resistance of Sn-9Zn solder, evidenced by much lower corrosion current density ( i corr) and much higher total resistance ( R t). Excess Ti addition (over 0.1 wt.%) led to the formation of Ti-containing IMCs, which were confirmed as Sn3Ti2 and Sn5Ti6, deteriorating the corrosion resistance of Sn-9Zn- xTi solders. The main corrosion products were confirmed as Sn3O(OH)2Cl2 mixed with small amount of chlorine/oxide Sn compounds.

  4. Thermal Cycling Life Prediction of Sn-3.0Ag-0.5Cu Solder Joint Using Type-I Censored Data

    Directory of Open Access Journals (Sweden)

    Jinhua Mi

    2014-01-01

    Full Text Available Because solder joint interconnections are the weaknesses of microelectronic packaging, their reliability has great influence on the reliability of the entire packaging structure. Based on an accelerated life test the reliability assessment and life prediction of lead-free solder joints using Weibull distribution are investigated. The type-I interval censored lifetime data were collected from a thermal cycling test, which was implemented on microelectronic packaging with lead-free ball grid array (BGA and fine-pitch ball grid array (FBGA interconnection structures. The number of cycles to failure of lead-free solder joints is predicted by using a modified Engelmaier fatigue life model and a type-I censored data processing method. Then, the Pan model is employed to calculate the acceleration factor of this test. A comparison of life predictions between the proposed method and the ones calculated directly by Matlab and Minitab is conducted to demonstrate the practicability and effectiveness of the proposed method. At last, failure analysis and microstructure evolution of lead-free solders are carried out to provide useful guidance for the regular maintenance, replacement of substructure, and subsequent processing of electronic products.

  5. Effect of nano Ni additions on the structure and properties of Sn-9Zn and Sn-Zn-3Bi solders in Au/Ni/Cu ball grid array packages

    Energy Technology Data Exchange (ETDEWEB)

    Gain, Asit Kumar [Department of Electronic Engineering, City University of Hong Kong, Tat Chee Avenue, Kowloon Tong (Hong Kong); Chan, Y.C. [Department of Electronic Engineering, City University of Hong Kong, Tat Chee Avenue, Kowloon Tong (Hong Kong)], E-mail: eeycchan@cityu.edu.hk; Yung, Winco K.C. [Department of Industrial and Systems Engineering, The Hong Kong Polytechnic University, Hung Hom, Kowloon (Hong Kong)

    2009-05-25

    The effect of nano Ni additions in Sn-9Zn and Sn-8Zn-3Bi solders on their interfacial microstructures and shear loads with Au/Ni/Cu pad metallization in ball grid array (BGA) applications were investigated. After the addition of nano Ni powder in Sn-based lead-free solders, there were no significant changes in the interfacial microstructure. But, in the solder region a very fine Zn-rich phase was observed. Also on the fracture surfaces a fine Zn-Ni compound was found. After the addition of nano Ni powder in Sn-based solders, the shear loads were increased due to a refinement of the microstructure and in addition, ductile fracture surfaces were clearly observed. The shear loads of the plain Sn-9Zn and Sn-8Zn-3Bi solders after one reflow cycle were about 1798 g and 2059 g, respectively. After the addition of nano Ni powder, their loads were about 2172 g and 2212 g, respectively, after one reflow cycle and their shear loads after eight reflow cycles were about 2099 g and 2081 g, respectively.

  6. Effect of nano Ni additions on the structure and properties of Sn-9Zn and Sn-Zn-3Bi solders in Au/Ni/Cu ball grid array packages

    International Nuclear Information System (INIS)

    Gain, Asit Kumar; Chan, Y.C.; Yung, Winco K.C.

    2009-01-01

    The effect of nano Ni additions in Sn-9Zn and Sn-8Zn-3Bi solders on their interfacial microstructures and shear loads with Au/Ni/Cu pad metallization in ball grid array (BGA) applications were investigated. After the addition of nano Ni powder in Sn-based lead-free solders, there were no significant changes in the interfacial microstructure. But, in the solder region a very fine Zn-rich phase was observed. Also on the fracture surfaces a fine Zn-Ni compound was found. After the addition of nano Ni powder in Sn-based solders, the shear loads were increased due to a refinement of the microstructure and in addition, ductile fracture surfaces were clearly observed. The shear loads of the plain Sn-9Zn and Sn-8Zn-3Bi solders after one reflow cycle were about 1798 g and 2059 g, respectively. After the addition of nano Ni powder, their loads were about 2172 g and 2212 g, respectively, after one reflow cycle and their shear loads after eight reflow cycles were about 2099 g and 2081 g, respectively.

  7. Comparative testing of six antigen-based malaria vaccine candidates directed toward merozoite-stage Plasmodium falciparum

    DEFF Research Database (Denmark)

    Arnot, David E; Cavanagh, David R; Remarque, Edmond J

    2008-01-01

    Immunogenicity testing of Plasmodium falciparum antigens being considered as malaria vaccine candidates was undertaken in rabbits. The antigens compared were recombinant baculovirus MSP-1(19) and five Pichia pastoris candidates, including two versions of MSP-1(19), AMA-1 (domains I and II), AMA-1......G concentrations. The two P. pastoris-produced MSP-1(19)-induced IgGs conferred the lowest growth inhibition. Comparative analysis of immunogenicity of vaccine antigens can be used to prioritize candidates before moving to expensive GMP production and clinical testing. The assays used have given discriminating...

  8. 30 CFR 77.1111 - Welding, cutting, soldering; use of fire extinguisher.

    Science.gov (United States)

    2010-07-01

    ... 30 Mineral Resources 1 2010-07-01 2010-07-01 false Welding, cutting, soldering; use of fire... OF UNDERGROUND COAL MINES Fire Protection § 77.1111 Welding, cutting, soldering; use of fire extinguisher. One portable fire extinguisher shall be provided at each location where welding, cutting, or...

  9. Tissue soldering with biodegradable polymer films: in-vitro investigation of hydration effects on weld strength

    Science.gov (United States)

    Sorg, Brian S.; Welch, Ashley J.

    2001-05-01

    Previous work demonstrated increased breaking strengths of tissue repaired with liquid albumin solder reinforced with a biodegradable polymer film compared to unreinforced control specimens. It was hypothesized that the breaking strength increase was due to reinforcement of the liquid solder cohesive strength. Immersion in a moist environment can decrease the adhesion of solder to tissue and negate any strength benefits gained from reinforcement. The purpose of this study was to determine if hydrated specimens repaired with reinforced solder would still be stronger than unreinforced controls. A 50%(w/v) bovine serum albumin solder with 0.5 mg/mL Indocyanine Green dye was used to repair an incision in bovine aorta. The solder was coagulated with 806-nm diode laser light. A poly(DL-lactic- co-glycolic acid) film was used to reinforce the solder (the controls had no reinforcement). The repaired tissues were immersed in phosphate buffered saline for time periods of 1 and 2 days. The breaking strengths of all of the hydrated specimens decreased compared to the acute breaking strengths. However, the reinforced specimens still had larger breaking strengths than the unreinforced controls. These results indicate that reinforcement of a liquid albumin solder may have the potential to improve the breaking strength in a clinical setting.

  10. Current Problems and Possible Solutions in High-Temperature Lead-Free Soldering

    Czech Academy of Sciences Publication Activity Database

    Kroupa, Aleš; Andersson, D.; Hoo, N.; Pearce, J.; Watson, A.; Dinsdale, A.; Mucklejohn, S.

    2012-01-01

    Roč. 21, č. 5 (2012), s. 629-637 ISSN 1059-9495 Institutional support: RVO:68081723 Keywords : lead-free soldering, * materials for high-temperature LF * new technologies for HT lead-free soldering Subject RIV: BJ - Thermodynamics Impact factor: 0.915, year: 2012

  11. Development of technique for laser welding of biological tissues using laser welding device and nanocomposite solder.

    Science.gov (United States)

    Gerasimenko, A; Ichcitidze, L; Podgaetsky, V; Ryabkin, D; Pyankov, E; Saveliev, M; Selishchev, S

    2015-08-01

    The laser device for welding of biological tissues has been developed involving quality control and temperature stabilization of weld seam. Laser nanocomposite solder applied onto a wound to be weld has been used. Physicochemical properties of the nanocomposite solder have been elucidated. The nature of the tissue-organizing nanoscaffold has been analyzed at the site of biotissue welding.

  12. Failure Mechanisms of SAC/Fe-Ni Solder Joints During Thermal Cycling

    Science.gov (United States)

    Gao, Li-Yin; Liu, Zhi-Quan; Li, Cai-Fu

    2017-08-01

    Thermal cycling tests have been conducted on Sn-Ag-Cu/Fe- xNi ( x = 73 wt.% or 45 wt.%) and Sn-Ag-Cu/Cu solder joints according to the Joint Electron Device Engineering Council industrial standard to study their interfacial reliability under thermal stress. The interfacial intermetallic compounds formed for solder joints on Cu, Fe-73Ni, and Fe-45Ni were 4.5 μm, 1.7 μm, and 1.4 μm thick, respectively, after 3000 cycles, demonstrating excellent diffusion barrier effect of Fe-Ni under bump metallization (UBM). Also, two deformation modes, viz. solder extrusion and fatigue crack formation, were observed by scanning electron microscopy and three-dimensional x-ray microscopy. Solder extrusion dominated for solder joints on Cu, while fatigue cracks dominated for solder joints on Fe-45Ni and both modes were detected for those on Fe-73Ni. Solder joints on Fe-Ni presented inferior reliability during thermal cycling compared with those on Cu, with characteristic lifetime of 3441 h, 3190 h, and 1247 h for Cu, Fe-73Ni, and Fe-45Ni UBM, respectively. This degradation of the interfacial reliability for solder joints on Fe-Ni is attributed to the mismatch in coefficient of thermal expansion (CTE) at interconnection level. The CTE mismatch at microstructure level was also analyzed by electron backscatter diffraction for clearer identification of recrystallization-related deformation mechanisms.

  13. Corrosion Reliability of Lead-free Solder Systems Used in Electronics

    DEFF Research Database (Denmark)

    Li, Feng; Verdingovas, Vadimas; Medgyes, Balint

    2017-01-01

    humidity/temperature cycling tests on soldered surface insulation resistance (SIR) comb pattern. Complimentary microstructural and phase analysis of solder alloys has been carried out using the scanning electron microscope (SEM), energy dispersive spectroscopy (EDS), and X-ray diffraction (XRD) methods...

  14. Reliability and microstructure of lead-free solder joints in industrial electronics after accelerated thermal aging

    NARCIS (Netherlands)

    Scaltro, F.; Biglari, M.H.; Kodentsov, A.; Yakovleva, O.; Brom, E.

    2009-01-01

    The reliability of lead-free (LF) solder joints in surface-mounted device components (SMD) has been investigated after thermo-cycle testing. Kirkendall voids have been observed at the interface component/solder together with the formation of fractures. The evolution, the morphology and the elemental

  15. Investigation of moisture uptake into printed circuit board laminate and solder mask materials

    DEFF Research Database (Denmark)

    Conseil, Helene; Gudla, Visweswara Chakravarthy; Borgaonkar, Shruti

    2017-01-01

    with different solder mask materials and exposed to saturated water vapour and liquid water. The solder masks are characterised for their microstructure and constituent phases using scanning electron microscopy and X-ray diffraction. The observations are correlated with themoisture absorption characteristic...

  16. The Effects of Antimony Addition on the Microstructural, Mechanical, and Thermal Properties of Sn-3.0Ag-0.5Cu Solder Alloy

    Science.gov (United States)

    Sungkhaphaitoon, Phairote; Plookphol, Thawatchai

    2018-02-01

    In this study, we investigated the effects produced by the addition of antimony (Sb) to Sn-3.0Ag-0.5Cu-based solder alloys. Our focus was the alloys' microstructural, mechanical, and thermal properties. We evaluated the effects by means of scanning electron microscopy (SEM), energy dispersive X-ray spectroscopy (EDX), differential scanning calorimetry (DSC), and a universal testing machine (UTM). The results showed that a part of the Sb was dissolved in the Sn matrix phase, and the remaining one participated in the formation of intermetallic compounds (IMCs) of Ag3(Sn,Sb) and Cu6(Sn,Sb)5. In the alloy containing the highest wt pct Sb, the added component resulted in the formation of SnSb compound and small particle pinning of Ag3(Sn,Sb) along the grain boundary of the IMCs. Our tests of the Sn-3.0Ag-0.5Cu solder alloys' mechanical properties showed that the effects produced by the addition of Sb varied as a function of the wt pct Sb content. The ultimate tensile strength (UTS) increased from 29.21 to a maximum value of 40.44 MPa, but the pct elongation (pct EL) decreased from 48.0 to a minimum 25.43 pct. Principally, the alloys containing Sb had higher UTS and lower pct EL than Sb-free solder alloys due to the strengthening effects of solid solution and second-phase dispersion. Thermal analysis showed that the alloys containing Sb had a slightly higher melting point and that the addition amount ranging from 0.5 to 3.0 wt pct Sb did not significantly change the solidus and liquidus temperatures compared with the Sb-free solder alloys. Thus, the optimal concentration of Sb in the alloys was 3.0 wt pct because the microstructure and the ultimate tensile strength of the SAC305 solder alloys were improved.

  17. Glutathione transferase (GST) as a candidate molecular-based biomarker for soil toxin exposure in the earthworm Lumbricus rubellus

    International Nuclear Information System (INIS)

    LaCourse, E. James; Hernandez-Viadel, Mariluz; Jefferies, James R.; Svendsen, Claus; Spurgeon, David J.; Barrett, John; John Morgan, A.; Kille, Peter; Brophy, Peter M.

    2009-01-01

    The earthworm Lumbricus rubellus (Hoffmeister, 1843) is a terrestrial pollution sentinel. Enzyme activity and transcription of phase II detoxification superfamily glutathione transferases (GST) is known to respond in earthworms after soil toxin exposure, suggesting GST as a candidate molecular-based pollution biomarker. This study combined sub-proteomics, bioinformatics and biochemical assay to characterise the L. rubellus GST complement as pre-requisite to initialise assessment of the applicability of GST as a biomarker. L. rubellus possesses a range of GSTs related to known classes, with evidence of tissue-specific synthesis. Two affinity-purified GSTs dominating GST protein synthesis (Sigma and Pi class) were cloned, expressed and characterised for enzyme activity with various substrates. Electrospray ionisation mass spectrometry (ESI-MS) and tandem mass spectrometry (MS/MS) following SDS-PAGE were superior in retaining subunit stability relative to two-dimensional gel electrophoresis (2-DE). This study provides greater understanding of Phase II detoxification GST superfamily status of an important environmental pollution sentinel organism. - This study currently provides the most comprehensive view of the Phase II detoxification enzyme superfamily of glutathione transferases within the important environmental pollution sentinel earthworm Lumbricus rubellus.

  18. Glutathione transferase (GST) as a candidate molecular-based biomarker for soil toxin exposure in the earthworm Lumbricus rubellus

    Energy Technology Data Exchange (ETDEWEB)

    LaCourse, E. James, E-mail: james.la-course@liverpool.ac.u [Institute of Biological, Environmental, and Rural Sciences, Aberystwyth University, Aberystwyth SY23 3DA (United Kingdom); Hernandez-Viadel, Mariluz; Jefferies, James R. [Institute of Biological, Environmental, and Rural Sciences, Aberystwyth University, Aberystwyth SY23 3DA (United Kingdom); Svendsen, Claus; Spurgeon, David J. [Centre for Ecology and Hydrology, Huntingdon PE28 2LS (United Kingdom); Barrett, John [Institute of Biological, Environmental, and Rural Sciences, Aberystwyth University, Aberystwyth SY23 3DA (United Kingdom); John Morgan, A.; Kille, Peter [Biosciences, University of Cardiff, Cardiff CF10 3TL (United Kingdom); Brophy, Peter M. [Institute of Biological, Environmental, and Rural Sciences, Aberystwyth University, Aberystwyth SY23 3DA (United Kingdom)

    2009-08-15

    The earthworm Lumbricus rubellus (Hoffmeister, 1843) is a terrestrial pollution sentinel. Enzyme activity and transcription of phase II detoxification superfamily glutathione transferases (GST) is known to respond in earthworms after soil toxin exposure, suggesting GST as a candidate molecular-based pollution biomarker. This study combined sub-proteomics, bioinformatics and biochemical assay to characterise the L. rubellus GST complement as pre-requisite to initialise assessment of the applicability of GST as a biomarker. L. rubellus possesses a range of GSTs related to known classes, with evidence of tissue-specific synthesis. Two affinity-purified GSTs dominating GST protein synthesis (Sigma and Pi class) were cloned, expressed and characterised for enzyme activity with various substrates. Electrospray ionisation mass spectrometry (ESI-MS) and tandem mass spectrometry (MS/MS) following SDS-PAGE were superior in retaining subunit stability relative to two-dimensional gel electrophoresis (2-DE). This study provides greater understanding of Phase II detoxification GST superfamily status of an important environmental pollution sentinel organism. - This study currently provides the most comprehensive view of the Phase II detoxification enzyme superfamily of glutathione transferases within the important environmental pollution sentinel earthworm Lumbricus rubellus.

  19. A family-based association study identified CYP17 as a candidate gene for obesity susceptibility in Caucasians.

    Science.gov (United States)

    Yan, H; Guo, Y; Yang, T-L; Zhao, L-J; Deng, H-W

    2012-08-06

    The cytochrome P450c17α gene (CYP17) encodes a key biosynthesis enzyme of estrogen, which is critical in regulating adipogenesis and adipocyte development in humans. We therefore hypothesized that CYP17 is a candidate gene for predicting obesity. In order to test this hypothesis, we performed a family-based association test to investigate the relationship between the CYP17 gene and obesity phenotypes in a large sample comprising 1873 subjects from 405 Caucasian nuclear families of European origin recruited by the Osteoporosis Research Center of Creighton University, USA. Both single SNPs and haplotypes were tested for associations with obesity-related phenotypes, including body mass index (BMI) and fat mass. We identified three SNPs to be significantly associated with BMI, including rs3740397, rs6163, and rs619824. We further characterized the linkage disequilibrium structure for CYP17 and found that the whole CYP17 gene was located in a single-linkage disequilibrium block. This block was observed to be significantly associated with BMI. A major haplotype in this block was significantly associated with both BMI and fat mass. In conclusion, we suggest that the CYP17 gene has an effect on obesity in the Caucasian population. Further independent studies will be needed to confirm our findings.

  20. Effect of phosphorus element on the comprehensive properties of Sn-Cu lead-free solder

    International Nuclear Information System (INIS)

    Li Guangdong; Shi Yaowu; Hao Hu; Xia Zhidong; Lei Yongping; Guo Fu

    2010-01-01

    In the present work, the effect of phosphorus on the creep fatigue properties of Sn-Cu eutectic lead-free solder was carried out. The experimental results show that the melting temperature was almost not changed with adding small amount of P element. However, the addition of trace P element led to the decrease in the property of creep fatigue. The fractography analysis by a scanning electron microscopy (SEM) shows that ductile fracture was the dominant failure behavior in the process of creep fatigue test of Sn0.7Cu and Sn0.7Cu0.005P specimens. It should be pointed out that there is significant difference in the fractographs between the joints of Sn0.7Cu solder and Sn0.7Cu0.005P solder. In the fractograph of Sn0.7Cu solder joint, the microstructure is prolonged along testing direction, and the dimples were more than the fractograph of Sn0.7Cu0.005P solder joint. In addition, the voids could be found on the Sn0.7Cu0.005P solder joint, and trace P addition may increase the rate of forming void of Sn0.7Cu solder joint. The voids can potentially lead to crack initiation or propagation sites in the solder joint. As a result, the creep fatigue of solder joint containing P such as Sn0.7Cu0.005P offers worse property compared to Sn0.7Cu solder joint.

  1. Effect of phosphorus element on the comprehensive properties of Sn-Cu lead-free solder

    Energy Technology Data Exchange (ETDEWEB)

    Li Guangdong, E-mail: liguangdong@emails.bjut.edu.c [College of Materials Science and Engineering, Beijing University of Technology, 100 Ping Le Yuan, Chaoyang District, Beijing 100124 (China); Shi Yaowu; Hao Hu; Xia Zhidong; Lei Yongping; Guo Fu [College of Materials Science and Engineering, Beijing University of Technology, 100 Ping Le Yuan, Chaoyang District, Beijing 100124 (China)

    2010-02-18

    In the present work, the effect of phosphorus on the creep fatigue properties of Sn-Cu eutectic lead-free solder was carried out. The experimental results show that the melting temperature was almost not changed with adding small amount of P element. However, the addition of trace P element led to the decrease in the property of creep fatigue. The fractography analysis by a scanning electron microscopy (SEM) shows that ductile fracture was the dominant failure behavior in the process of creep fatigue test of Sn0.7Cu and Sn0.7Cu0.005P specimens. It should be pointed out that there is significant difference in the fractographs between the joints of Sn0.7Cu solder and Sn0.7Cu0.005P solder. In the fractograph of Sn0.7Cu solder joint, the microstructure is prolonged along testing direction, and the dimples were more than the fractograph of Sn0.7Cu0.005P solder joint. In addition, the voids could be found on the Sn0.7Cu0.005P solder joint, and trace P addition may increase the rate of forming void of Sn0.7Cu solder joint. The voids can potentially lead to crack initiation or propagation sites in the solder joint. As a result, the creep fatigue of solder joint containing P such as Sn0.7Cu0.005P offers worse property compared to Sn0.7Cu solder joint.

  2. A new strategy based on SmRho protein loaded chitosan nanoparticles as a candidate oral vaccine against schistosomiasis.

    Directory of Open Access Journals (Sweden)

    Carolina R Oliveira

    Full Text Available BACKGROUND: Schistosomiasis is one of the most important neglected tropical diseases and an effective control is unlikely in the absence of improved sanitation and vaccination. A new approach of oral vaccination with alginate coated chitosan nanoparticles appears interesting because their great stability and the ease of target accessibility, besides of chitosan and alginate immunostimulatory properties. Here we propose a candidate vaccine based on the combination of chitosan-based nanoparticles containing the antigen SmRho and coated with sodium alginate. METHODS AND FINDINGS: Our results showed an efficient performance of protein loading of nanoparticles before and after coating with alginate. Characterization of the resulting nanoparticles reported a size around 430 nm and a negative zeta potential. In vitro release studies of protein showed great stability of coated nanoparticles in simulated gastric fluid (SGF and simulated intestinal fluid (SIF. Further in vivo studies was performed with different formulations of chitosan nanoparticles and it showed that oral immunization was not able to induce high levels of antibodies, otherwise intramuscular immunization induced high levels of both subtypes IgG1 and IgG2a SmRho specific antibodies. Mice immunized with nanoparticles associated to CpG showed significant modulation of granuloma reaction. Mice from all groups immunized orally with nanoparticles presented significant levels of protection against infection challenge with S. mansoni worms, suggesting an important role of chitosan in inducing a protective immune response. Finally, mice immunized with nanoparticles associated with the antigen SmRho plus CpG had 38% of the granuloma area reduced and also presented 48% of protection against of S. mansoni infection. CONCLUSIONS: Taken together, this results support this new strategy as an efficient delivery system and a potential vaccine against schistosomiasis.

  3. Pressure brazing of ceramics to metals with copper solder

    International Nuclear Information System (INIS)

    Pavlova, M.A.; Metelkin, I.I.

    1986-01-01

    The effect on the quality of joints brazed with copper of different non metallized aluminooxide dielectrics with metals and alloys of a series of technological parameters (temperature, pressure, holding, and medium) in the course of pressure brazing is investigated. It is shown that in case of brazing with kovar and nickel the character of dependences is identical, however in all cases the joints with nickel are more durable. For the ceramics - molybdenum system characterized by weak interaction with copper solder kinetic dependences have no maximum and only under holding of more than 20 min the constant strength of 150-190 MPa is attained

  4. Study on Mitigation Method of Solder Corrosion for Crystalline Silicon Photovoltaic Modules

    Directory of Open Access Journals (Sweden)

    Ju-Hee Kim

    2014-01-01

    Full Text Available The corrosion of 62Sn36Pb2Ag solder connections poses serious difficulties for outdoor-exposed photovoltaic (PV modules, as connection degradation contributes to the increase in series resistance (RS of PV modules. In this study, we investigated a corrosion mitigation method based on the corrosion mechanism. The effect of added sacrificial metal on the reliability of PV modules was evaluated using the oxidation-reduction (redox reaction under damp heat (DH conditions. Experimental results after exposure to DH show that the main reason for the decrease in power was a drop in the module’s fill factor. This drop was attributed to the increase of RS. The drop in output power of the PV module without added sacrificial metal is greater than that of the sample with sacrificial metal. Electroluminescence and current-voltage mapping analysis also show that the PV module with sacrificial metal experienced less degradation than the sample without sacrificial metal.

  5. Novel Plasmodium falciparum malaria vaccines: evidence-based searching for variant surface antigens as candidates for vaccination against pregnancy-associated malaria

    DEFF Research Database (Denmark)

    Staalsoe, Trine; Jensen, Anja T R; Theander, Thor G

    2002-01-01

    Malaria vaccine development has traditionally concentrated on careful molecular, biochemical, and immunological characterisation of candidate antigens. In contrast, evidence of the importance of identified antigens in immunity to human infection and disease has generally been limited to statistic......Malaria vaccine development has traditionally concentrated on careful molecular, biochemical, and immunological characterisation of candidate antigens. In contrast, evidence of the importance of identified antigens in immunity to human infection and disease has generally been limited...... to statistically significant co-variation with protection rather than on demonstration of causal relationships. We have studied the relationship between variant surface antigen-specific antibodies and clinical protection from Plasmodium falciparum malaria in general, and from pregnancy-associated malaria (PAM......) in particular, to provide robust evidence of a causal link between the two in order to allow efficient and evidence-based identification of candidate antigens for malaria vaccine development....

  6. Generation and characterization of a novel candidate gene therapy and vaccination vector based on human species D adenovirus type 56.

    Science.gov (United States)

    Duffy, Margaret R; Alonso-Padilla, Julio; John, Lijo; Chandra, Naresh; Khan, Selina; Ballmann, Monika Z; Lipiec, Agnieszka; Heemskerk, Evert; Custers, Jerome; Arnberg, Niklas; Havenga, Menzo; Baker, Andrew H; Lemckert, Angelique

    2018-01-01

    The vectorization of rare human adenovirus (HAdV) types will widen our knowledge of this family and their interaction with cells, tissues and organs. In this study we focus on HAdV-56, a member of human Ad species D, and create ease-of-use cloning systems to generate recombinant HAdV-56 vectors carrying foreign genes. We present in vitro transduction profiles for HAdV-56 in direct comparison to the most commonly used HAdV-5-based vector. In vivo characterizations demonstrate that when it is delivered intravenously (i.v.) HAdV-56 mainly targets the spleen and, to a lesser extent, the lungs, whilst largely bypassing liver transduction in mice. HAdV-56 triggered robust inflammatory and cellular immune responses, with higher induction of IFNγ, TNFα, IL5, IL6, IP10, MCP1 and MIG1 compared to HAdV-5 following i.v. administration. We also investigated its potential as a vaccine vector candidate by performing prime immunizations in mice with HAdV-56 encoding luciferase (HAdV-56-Luc). Direct comparisons were made to HAdV-26, a highly potent human vaccine vector currently in phase II clinical trials. HAdV-56-Luc induced luciferase 'antigen'-specific IFNγ-producing cells and anti-HAdV-56 neutralizing antibodies in Balb/c mice, demonstrating a near identical profile to that of HAdV-26. Taken together, the data presented provides further insight into human Ad receptor/co-receptor usage, and the first report on HAdV-56 vectors and their potential for gene therapy and vaccine applications.

  7. Identification of candidate biomarkers of the exposure to PCBs in contaminated cattle: A gene expression- and proteomic-based approach.

    Science.gov (United States)

    Girolami, F; Badino, P; Spalenza, V; Manzini, L; Renzone, G; Salzano, A M; Dal Piaz, F; Scaloni, A; Rychen, G; Nebbia, C

    2018-05-28

    Dioxins and polychlorinated biphenyls (PCBs) are widespread and persistent contaminants. Through a combined gene expression/proteomic-based approach, candidate biomarkers of the exposure to such environmental pollutants in cattle subjected to a real eco-contamination event were identified. Animals were removed from the polluted area and fed a standard ration for 6 months. The decontamination was monitored by evaluating dioxin and PCB levels in pericaudal fat two weeks after the removal from the contaminated area (day 0) and then bimonthly for six months (days 59, 125 and 188). Gene expression measurements demonstrated that CYP1B1 expression was significantly higher in blood lymphocytes collected in contaminated animals (day 0), and decreased over time during decontamination. mRNA levels of interleukin 2 showed an opposite quantitative trend. MALDI-TOF-MS polypeptide profiling of serum samples ascertained a progressive decrease (from day 0 to 188) of serum levels of fibrinogen β-chain and serpin A3-7-like fragments, apolipoprotein (APO) C-II and serum amyloid A-4 protein, along with an augmented representation of transthyretin isoforms, as well as APOC-III and APOA-II proteins during decontamination. When differentially represented species were combined with serum antioxidant, acute phase and proinflammatory protein levels already ascertained in the same animals (Cigliano et al., 2016), bioinformatics unveiled an interaction network linking together almost all components. This suggests the occurrence of a complex PCB-responsive mechanism associated with animal contamination/decontamination, including a cohort of protein/polypeptide species involved in blood redox homeostasis, inflammation and lipid transport. All together, these results suggest the use in combination of such biomarkers for identifying PCB-contaminated animals, and for monitoring the restoring of their healthy condition following a decontamination process. Copyright © 2018 Elsevier B.V. All

  8. Multi-scale modeling of elasto-plastic response of SnAgCu lead-free solder alloys at different ageing conditions: Effect of microstructure evolution, particle size effects and interfacial failure

    Energy Technology Data Exchange (ETDEWEB)

    Maleki, Milad; Cugnoni, Joel, E-mail: joel.cugnoni@epfl.ch; Botsis, John

    2016-04-20

    In microelectronics applications, SnAgCu lead-free solder joints play the important role of ensuring both the mechanical and electrical integrity of the components. In such applications, the SnAgCu joints are subjected to elevated homologous temperatures for an extended period of time causing significant microstructural changes and leading to reliability issues. In this study, the link between the change in microstructures and deformation behavior of SnAgCu solder during ageing is explained by developing a hybrid multi-scale microstructure-based modeling approach. Herein, the SnAgCu solder alloy is seen as a three phase metal matrix composite in which Ag{sub 3}Sn and Cu{sub 6}Sn{sub 5} hard intermetallics play the role of reinforcements and Sn the role of a ductile matrix. The hardening of the Sn matrix due to fine intermetallics in the eutectic mixture is modeled by incorporating the mean field effects of geometrically necessary dislocations. Subsequently, a two level homogenization procedure based on micromechanical finite element (FE) models is used to capture the interactions between the different phases. For this purpose, tomographic images of microstructures obtained by Focused Ion Beam (FIB) and synchrotron X-Ray in different ageing conditions are directly used to generate statistically representative volume elements (RVE) using 3D FE models. The constitutive behavior of the solder is determined by sequentially performing two scales of numerical homogenization at the eutectic level and then at the dendrite level. For simplification, the anisotropy of Sn as well as the potential recovery processes have been neglected in the modeling. The observed decrease in the yield strength of solder due to ageing is well captured by the adopted modeling strategy and allows explaining the different ageing mechanisms. Finally, the effects of potential debonding at the intermetallic particle-matrix interface as well as particle fracture on the overall strength of solder are

  9. Impurity Effects in Electroplated-Copper Solder Joints

    Directory of Open Access Journals (Sweden)

    Hsuan Lee

    2018-05-01

    Full Text Available Copper (Cu electroplating is a mature technology, and has been extensively applied in microelectronic industry. With the development of advanced microelectronic packaging, Cu electroplating encounters new challenges for atomic deposition on a non-planar substrate and to deliver good throwing power and uniform deposit properties in a high-aspect-ratio trench. The use of organic additives plays an important role in modulating the atomic deposition to achieve successful metallic coverage and filling, which strongly relies on the adsorptive and chemical interactions among additives on the surface of growing film. However, the adsorptive characteristic of organic additives inevitably results in an incorporation of additive-derived impurities in the electroplated Cu film. The incorporation of high-level impurities originating from the use of polyethylene glycol (PEG and chlorine ions significantly affects the microstructural evolution of the electroplated Cu film, and the electroplated-Cu solder joints, leading to the formation of undesired voids at the joint interface. However, the addition of bis(3-sulfopropyl disulfide (SPS with a critical concentration suppresses the impurity incorporation and the void formation. In this article, relevant studies were reviewed, and the focus was placed on the effects of additive formula and plating parameters on the impurity incorporation in the electroplated Cu film, and the void formation in the solder joints.

  10. Fiscal 1998 achievement report on regional consortium research and development project. Venture business raising type regional consortium - Small business creation base type (Preparation of monodispersed spherical particles for solder materials for application to high density semiconductor packaging - 2nd year); 1998 nendo komitsudo handotai jisso no tame no tanbunsan kyukei handa ryushi no sakusei ni kansuru kenkyu seika hokokusho (dai 2 nendo)

    Energy Technology Data Exchange (ETDEWEB)

    NONE

    2000-03-01

    Fine solder grains have been developed, spherical in shape, uniform in diameter, high in dimensional precision, and high in surface cleanliness, which are necessary for the establishment of next-generation technologies of flip chip bonding and ball grid array which are indispensable for high-density high-reliability packaging of electronic devices such as LSI (large scale integration). Results attained in fiscal 1998 are described. A pulse pressure aided orifice injection method was used. Monodispersed grains are prepared for the Pb-63Sn solder and Sn-3.5Ag lead-free solder. In the case of a 200{mu}m-large orifice, the grain diameter was controlled to fall in the range of 190-210{mu}m and the accuracy was not lower than {+-}6{mu}m. The main goal of this project has been accomplished now that these figures were attained without a sorting process and satisfy the most rigorous conditions currently proposed by the industrial circle involved. The flow of hot liquid out of the orifice and the splitting process of grains were clarified by thermal hydraulic analysis. It was found that grains split and fly not because of instability due to Rayleigh surface waves but because of their liberation from surface tension when equipped with critical kinetic energy. (NEDO)

  11. Temperature-controlled laser-soldering system and its clinical application for bonding skin incisions

    Science.gov (United States)

    Simhon, David; Gabay, Ilan; Shpolyansky, Gregory; Vasilyev, Tamar; Nur, Israel; Meidler, Roberto; Hatoum, Ossama Abu; Katzir, Abraham; Hashmonai, Moshe; Kopelman, Doron

    2015-12-01

    Laser tissue soldering is a method of repairing incisions. It involves the application of a biological solder to the approximated edges of the incision and heating it with a laser beam. A pilot clinical study was carried out on 10 patients who underwent laparoscopic cholecystectomy. Of the four abdominal incisions in each patient, two were sutured and two were laser soldered. Cicatrization, esthetical appearance, degree of pain, and pruritus in the incisions were examined on postoperative days 1, 7, and 30. The soldered wounds were watertight and healed well, with no discharge from these wounds or infection. The total closure time was equal in both methods, but the net soldering time was much shorter than suturing. There was no difference between the two types of wound closure with respect to the pain and pruritus on a follow-up of one month. Esthetically, the soldered incisions were estimated as good as the sutured ones. The present study confirmed that temperature-controlled laser soldering of human skin incisions is clinically feasible, and the results obtained were at least equivalent to those of standard suturing.

  12. Beta-Tin Grain Formation in Aluminum-Modified Lead-Free Solder Alloys

    Science.gov (United States)

    Reeve, Kathlene N.; Handwerker, Carol A.

    2018-01-01

    The limited number of independent β-Sn grain orientations that typically form during solidification of Sn-based solders and the resulting large β-Sn grain size have major effects on overall solder performance and reliability. This study analyzes whether additions of Al to Sn-Cu and Sn-Cu-Ag alloys can be used to change the grain size, morphology, and twinning structures of atomized (as-solidified) and re-melted (reflowed) β-Sn dendrites as determined using scanning electron microscopy and electron backscatter diffraction for as-solidified and reflow cycled (20-250°C, 1-5 cycles) Sn-Cu-Al and Sn-Ag-Cu-Al drip atomized spheres (260 μm diameter). The resulting microstructures were compared to as-solidified and reflow cycled Sn-Ag-Cu spheres (450 μm diameter) as well as as-solidified Sn-Ag-Cu, Sn-Cu, and Sn-Ag microstructures from the literature. Previous literature observations reporting reductions in undercooling and β-Sn grain size with Al micro-alloying additions could not be correlated to the presence of the Cu9Al4 phase or Al solute. The as-solidified spheres displayed no change in β-Sn dendrite structure or grain size when compared to non-Al-modified alloys, and the reflow cycled spheres produced high undercoolings (22-64°C), indicating a lack of potent nucleation sites. The current findings highlighted the role of Ag in the formation of the interlaced twinning structure and demonstrated that with deliberate compositional choices, formation of the alloy's β-Sn grain structure (cyclical twinning versus interlaced twinning) could be influenced, in both the as-solidified and reflow cycled states, though still not producing the fine-grain sizes and multiple orientations desired for improved thermomechanical properties.

  13. Laser-tissue soldering with biodegradable polymer films in vitro: film surface morphology and hydration effects.

    Science.gov (United States)

    Sorg, B S; Welch, A J

    2001-01-01

    Previous research introduced the concept of using biodegradable polymer film reinforcement of a liquid albumin solder for improvement of the tensile strength of repaired incisions in vitro. In this study, the effect of creating small pores in the PLGA films on the weld breaking strength is studied. Additionally, the effect of hydration on the strength of the reinforced welds is investigated. A 50%(w/v) bovine serum albumin solder with 0.5 mg/mL Indocyanine Green dye was used to repair an incision in bovine aorta. The solder was coagulated with an 806-nm CW diode laser. A poly(DL-lactic-co-glycolic acid) (PLGA) film was used to reinforce the solder (the controls had solder but no reinforcement). Breaking strengths were measured acutely and after hydration in saline for 1 and 2 days. The data were analyzed by ANOVA (P < 0.05) and multiple comparisons of means were performed using the Newman-Keuls test. The creation of pores in the PLGA films qualitatively improved the film flexibility without having an apparent adverse effect on the breaking strength, while the actual technique of applying the film and solder had more of an effect. The acute maximum average breaking strengths of some of the film reinforced specimens (114.7 g-134.4 g) were significantly higher (P < 0.05) than the acute maximum average breaking strength of the unreinforced control specimens (68.3 g). Film reinforced specimens were shown to have a statistically significantly higher breaking strength than unreinforced controls after 1- and 2-day hydration. Reinforcement of liquid albumin solders in laser-assisted incision repair appears to have advantages over conventional methods that do not reinforce the cohesive strength of the solder in terms of acute breaking strength and after immersion in moist environments for short periods of time. Using a film with the solder applied to one surface only may be advantageous over other techniques.

  14. The influence of silver content on structure and properties of Sn–Bi–Ag solder and Cu/solder/Cu joints

    Energy Technology Data Exchange (ETDEWEB)

    Šebo, P. [Institute of Materials and Machine Mechanics, Slovak Academy of Sciences, Račianska 75, 831 02 Bratislava 3 (Slovakia); Švec, P. Sr., E-mail: Peter.Svec@savba.sk [Institute of Physics, Slovak Academy of Sciences, Dúbravská cesta 9, 845 11 Bratislava 45 (Slovakia); Faculty of Materials Science and Technology, Slovak University of Technology, J. Bottu 25, 917 24 Trnava (Slovakia); Janičkovič, D.; Illeková, E. [Institute of Physics, Slovak Academy of Sciences, Dúbravská cesta 9, 845 11 Bratislava 45 (Slovakia); Zemánková, M. [Institute of Materials and Machine Mechanics, Slovak Academy of Sciences, Račianska 75, 831 02 Bratislava 3 (Slovakia); Plevachuk, Yu. [Ivan Franko National University, Department of Metal Physics, 79005 Lviv (Ukraine); Sidorov, V. [Ural State Pedagogical University, Cosmonavtov 26, 620017 Ekaterinburg (Russian Federation); Švec, P. [Institute of Physics, Slovak Academy of Sciences, Dúbravská cesta 9, 845 11 Bratislava 45 (Slovakia)

    2013-06-01

    The effect of silver content on structure and properties of Sn{sub 100−x}Bi{sub 10}Ag{sub x} (x=3–10 at%) lead-free solder and Cu–solder–Cu joints was investigated. The microstructure of the solder in both bulk and rapidly solidified ribbon forms was analyzed by scanning electron microscopy (SEM) and X-ray diffraction. The peculiarities in melting kinetic, studied by differential scanning calorimetry (DSC), and silver influence on it are described and discussed. The wetting of a copper substrate was examined by the sessile drop method in the temperature range of 553–673 K in air and deoxidizing gas (N{sub 2}+10%H{sub 2}) at atmospheric pressure. Cu–solder–Cu joints were also prepared in both atmospheres, and their shear strength was measured by the push-off method. The produced solders consisted of tin, bismuth and Ag{sub 3}Sn phases. The product of the interaction between the solder and the copper substrate consists of two phases: Cu{sub 3}Sn, which is adjacent to the substrate, and a Cu{sub 6}Sn{sub 5} phase. The wetting angle in air increased slightly as the silver concentration in the solder increased. Wetting of the copper substrate in N{sub 2}+10H{sub 2} gas shows the opposite tendency: the wetting angle slightly decreased as the silver content in the solder increased. The shear strength of the joints prepared in air (using flux) tends to decrease with increasing production temperature and increasing silver content in the solder. The equivalent decrease in the shear strength of the joints prepared in N{sub 2}+10H{sub 2} is more apparent.

  15. Contamination profile on typical printed circuit board assemblies vs soldering process

    DEFF Research Database (Denmark)

    Conseil, Helene; Jellesen, Morten Stendahl; Ambat, Rajan

    2014-01-01

    Purpose – The purpose of this paper was to analyse typical printed circuit board assemblies (PCBAs) processed by reflow, wave or selective wave soldering for typical levels of process-related residues, resulting from a specific or combination of soldering processes. Typical solder flux residue...... structure was identified by Fourier transform infrared spectroscopy, while the concentration was measured using ion chromatography, and the electrical properties of the extracts were determined by measuring the leak current using a twin platinum electrode set-up. Localized extraction of residue was carried...

  16. Contamination profile of Printed Circuit Board Assemblies in relation to soldering types and conformal coating

    DEFF Research Database (Denmark)

    Conseil, Helene; Jellesen, Morten Stendahl; Ambat, Rajan

    2014-01-01

    Typical printed circuit board assemblies (PCBAs) processed by reflow, wave, or selective wave soldering were analysed for typical levels of process related residues, resulting from a specific or combination of soldering process. Typical solder flux residue distribution pattern, composition......, and concentration are profiled and reported. Presence of localized flux residues were visualized using a commercial Residue RAT gel test and chemical structure was identified by FT-IR, while the concentration was measured using ion chromatography, and the electrical properties of the extracts were determined...

  17. Long-term creep rupture strength of weldment of Fe-Ni based alloy as candidate tube and pipe for advanced USC boilers

    Energy Technology Data Exchange (ETDEWEB)

    Bao, Gang; Sato, Takashi [Babcok-Hitachi K.K., Hiroshima (Japan). Kure Research Laboratory; Marumoto, Yoshihide [Babcok-Hitachi K.K., Hiroshima (Japan). Kure Div.

    2010-07-01

    A lot of works have been going to develop 700C USC power plant in Europe and Japan. High strength Ni based alloys such as Alloy 617, Alloy 740 and Alloy 263 were the candidates for boiler tube and pipe in Europe, and Fe-Ni based alloy HR6W (45Ni-24Fe-23Cr-7W-Ti) is also a candidate for tube and pipe in Japan. One of the Key issues to achieve 700 C boilers is the welding process of these alloys. Authors investigated the weldability and the long-term creep rupture strength of HR6W tube. The weldments were investigated metallurgically to find proper welding procedure and creep rupture tests are ongoing exceed 38,000 hours. The long-term creep rupture strengths of the HST weld joints are similar to those of parent metals and integrity of the weldments was confirmed based on with other mechanical testing results. (orig.)

  18. Cooling thermal parameters and microstructure features of directionally solidified ternary Sn–Bi–(Cu,Ag) solder alloys

    Energy Technology Data Exchange (ETDEWEB)

    Silva, Bismarck L., E-mail: bismarck_luiz@yahoo.com.br [Department of Materials Engineering, Federal University of São Carlos, UFSCar, 13565-905 São Carlos, SP (Brazil); Garcia, Amauri [Department of Manufacturing and Materials Engineering, University of Campinas, UNICAMP, 13083-860 Campinas, SP (Brazil); Spinelli, José E. [Department of Materials Engineering, Federal University of São Carlos, UFSCar, 13565-905 São Carlos, SP (Brazil)

    2016-04-15

    Low temperature soldering technology encompasses Sn–Bi based alloys as reference materials for joints since such alloys may be molten at temperatures less than 180 °C. Despite the relatively high strength of these alloys, segregation problems and low ductility are recognized as potential disadvantages. Thus, for low-temperature applications, Bi–Sn eutectic or near-eutectic compositions with or without additions of alloying elements are considered interesting possibilities. In this context, additions of third elements such as Cu and Ag may be an alternative in order to reach sounder solder joints. The length scale of the phases and their proportions are known to be the most important factors affecting the final wear, mechanical and corrosions properties of ternary Sn–Bi–(Cu,Ag) alloys. In spite of this promising outlook, studies emphasizing interrelations of microstructure features and solidification thermal parameters regarding these multicomponent alloys are rare in the literature. In the present investigation Sn–Bi–(Cu,Ag) alloys were directionally solidified (DS) under transient heat flow conditions. A complete characterization is performed including experimental cooling thermal parameters, segregation (XRF), optical and scanning electron microscopies, X-ray diffraction (XRD) and length scale of the microstructural phases. Experimental growth laws relating dendritic spacings to solidification thermal parameters have been proposed with emphasis on the effects of Ag and Cu. The theoretical predictions of the Rappaz-Boettinger model are shown to be slightly above the experimental scatter of secondary dendritic arm spacings for both ternary Sn–Bi–Cu and Sn–Bi–Ag alloys examined. - Highlights: • Dendritic growth prevailed for the ternary Sn–Bi–Cu and Sn–Bi–Ag solder alloys. • Bi precipitates within Sn-rich dendrites were shown to be unevenly distributed. • Morphology and preferential region for the Ag{sub 3}Sn growth depend on Ag

  19. Bioinformatics Approach Based Research of Profile Protein Carbonic Anhydrase II Analysis as a Potential Candidate Cause Autism for The Variation of Learning Subjects Biotechnology

    Directory of Open Access Journals (Sweden)

    Dian Eka A. F. Ningrum

    2017-03-01

    Full Text Available This study aims to determine the needs of learning variations on Biotechnology courses using bioinformatics approaches. One example of applied use of bioinformatics in biotechnology course is the analysis of protein profiles carbonic anhydrase II as a potential cause of autism candidate. This research is a qualitative descriptive study consisted of two phases. The first phase of the data obtained from observations of learning, student questionnaires, and questionnaires lecturer. Results from the first phase, namely the need for variations learning in Biotechnology course using bioinformatics. Collecting data on the second stage uses three webserver to predict the target protein and scientific articles. Visualization of proteins using PyMOL software. 3 based webserver which is used, the candidate of target proteins associated with autism is carbonic anhydrase II. The survey results revealed that the protein carbonic anhydrase II as a potential candidate for the cause of autism classified metaloenzim are able to bind with heavy metals. The content of heavy metals in autistic patients high that affect metabolism. This prediction of protein candidate cause autism is applied use to solve the problem in society, so that can achieve the learning outcome in biotechnology course.

  20. Prediction of activities of all components in the lead-free solder systems Bi-In-Sn and Bi-In-Sn-Zn

    International Nuclear Information System (INIS)

    Tao Dongping

    2008-01-01

    The activities of components of the ternary lead-free solder systems Al-Sn-Zn at 973 K, Zn-Cu-Sn at 1023 K and Bi-In-Sn at 1000 and 1050 K have been predicted by a novel molecular interaction volume model-MIVM and the results are in good agreement with experimental data. Then the activities of all components of the Bi-In-Sn at 550 K and the Bi-In-Sn-Zn quaternary system at 700 K have been further predicted and the results are reasonable and reliable. This shows that the model may be a superior alternative for describing interfacial chemical reactions between lead-free solder alloys and common base materials and for the calculation of their phase diagrams because MIVM has certain physical meaning from the viewpoint of statistical thermodynamics and requires only two infinite dilute activity coefficients for each sub-binary system

  1. Effect of Solder-Joint Geometry on the Low-Cycle Fatigue Behavior of Sn- xAg-0.7Cu

    Science.gov (United States)

    Lee, Hwa-Teng; Huang, Kuo-Chen

    2016-12-01

    Low-cycle fatigue tests of Sn-Ag-Cu (SAC) Pb-free solder joints under fixed displacement were performed to evaluate the influence of Ag content (0-3 wt.%) and solder-joint geometry (barrel and hourglass types) on solder-joint fatigue behavior and reliability. The solder joints were composed of fine particles of Ag3Sn and Cu6Sn5, which aggregated as an eutectic constituent at grain boundaries of the primary β-Sn phase and formed a dense network structure. A decrease in the Ag content resulted in coarsening of the β-Sn and eutectic phases, which, in turn, decreased the strength of the joint and caused earlier failure. Solder joints in the hourglass form exhibited better fatigue performance with longer life than barrel-type joints. The sharp contact angle formed between the solder and the Cu substrate by the barrel-type joints concentrated stress, which compromised fatigue reliability. The addition of Ag to the solder, however, enhanced fatigue performance because of strengthening caused by Ag3Sn formation. The cracks of the barrel-type SAC solder joints originated mostly at the contact corner and propagated along the interfacial layer between the interfacial intermetallic compound (IMC) and solder matrix. Hourglass-type solder joints, however, demonstrated both crack initiation and propagation in the solder matrix (solder mode). The addition of 1.5-2.0 wt.% Ag to SAC solder appears to enhance the fatigue performance of solder joints while maintaining sufficient strength.

  2. A review on solder reflow and flux application for flip chip

    Science.gov (United States)

    Suppiah, Sarveshvaran; Ong, Nestor Rubio; Sauli, Zaliman; Sarukunaselan, Karunavani; Alcain, Jesselyn Barro; Visvanathan, Susthitha Menon; Retnasamy, Vithyacharan

    2017-09-01

    This paper encompassed of the evolution and key findings, critical technical challenges, solutions and bonding equipment of solder reflow in flip chip bonding. Upon scrutinizing researches done by others, it can be deduced that peak temperature, time above liquidus, soak temperature, soak time, cooling rate and reflow environment played a vital role in achieving the desired bonding profile. In addition, flux is also needed with the purpose of removing oxides/contaminations on bump surface as well as to promote wetting of solder balls. Electromigration and warpage are the two main challenges faced by solder reflow process which can be overcome by the advancement in under bump metallization (UBM) and substrate technology. The review is ended with a brief description of the current equipment used in solder reflow process.

  3. Nanoscale Soldering of Positioned Carbon Nanotubes using Highly Conductive Electron Beam Induced Gold Deposition

    DEFF Research Database (Denmark)

    Madsen, Dorte Nørgaard; Mølhave, Kristian; Mateiu, Ramona Valentina

    2003-01-01

    We have developed an in-situ method for controlled positioning of carbon nanotubes followed by highly conductive contacting of the nanotubes, using electron beam assisted deposition of gold. The positioning and soldering process takes place inside an Environmental Scanning Electron Microscope (E...... in a carbon matrix. Nanoscale soldering of multi-walled carbon nanotubes (MWNT) onto microelectrodes was achieved by deposition of a conducting gold line across a contact point between nanotube and electrode. The solderings were found to be mechanically stronger than the carbon nanotubes. We have positioned...... MWNTs to bridge the gap between two electrodes, and formed soldering bonds between the tube and each of the electrodes. All nanotube bridges showed ohmic resistances in the range 10-30 kΩ. We observed no increase in resistance after exposing the MWNT bridge to air for days....

  4. Microstructural Evolution and Mechanical Behavior of High Temperature Solders: Effects of High Temperature Aging

    Science.gov (United States)

    Hasnine, M.; Tolla, B.; Vahora, N.

    2018-04-01

    This paper explores the effects of aging on the mechanical behavior, microstructure evolution and IMC formation on different surface finishes of two high temperature solders, Sn-5 wt.% Ag and Sn-5 wt.% Sb. High temperature aging showed significant degradation of Sn-5 wt.% Ag solder hardness (34%) while aging has little effect on Sn-5 wt.% Sb solder. Sn-5 wt.% Ag experienced rapid grain growth as well as the coarsening of particles during aging. Sn-5 wt.% Sb showed a stable microstructure due to solid solution strengthening and the stable nature of SnSb precipitates. The increase of intermetallic compound (IMC) thickness during aging follows a parabolic relationship with time. Regression analysis (time exponent, n) indicated that IMC growth kinetics is controlled by a diffusion mechanism. The results have important implications in the selection of high temperature solders used in high temperature applications.

  5. The creep behavior of In-Ag eutectic solder joints

    International Nuclear Information System (INIS)

    Reynolds, H.L.; Kang, S.H.; Morris, J.W. Jr.; Univ. of California, Berkeley, CA

    1999-01-01

    The addition of 3 wt.% Ag to In results in a eutectic composition with improved mechanical properties while only slightly lowering the melting temperature. Steady-state creep properties of In-Ag eutectic solder joints have been measured using constant load tests at 0, 30, 60, and 90 C. Constitutive equations are derived to describe the creep behavior. The data are well represented by an equation of the form proposed by Dorn: a power-law equation applies to each independent creep mechanism. Two parallel mechanisms were observed for the In-Ag eutectic joints. The high-stress mechanism is a bulk mechanism with a thermal dependence dominated by the thermal dependence of creep in the In-rich matrix. The low-stress mechanism is a grain boundary mechanism. Results of this work are discussed with regard to creep behavior of typical eutectic systems

  6. Nanoconstruction by welding individual metallic nanowires together using nanoscale solder

    International Nuclear Information System (INIS)

    Peng, Y; Inkson, B J; Cullis, A G

    2010-01-01

    This work presents a new bottom-up nanowelding technique enabling building blocks to be assembled and welded together into complex 3D nanostructures using nanovolumes of metal solder. The building blocks of gold nanowires, (Co 72 Pt 28 /Pt) n multilayer nanowires, and nanosolder Sn 99 Au 1 alloy nanowires were successfully fabricated by a template technique. Individual metallic nanowires were picked up and assembled together. Conductive nanocircuits were then welded together using similar or dissimilar nanosolder material. At the weld sites, nanoscale volumes of a chosen metal are deposited using nanosolder of a sacrificial nanowire, which ensures that the nanoobjects to be bonded retain their structural integrity. The whole nanowelding process is clean, controllable and reliable, and ensures both mechanically strong and electrically conductive contacts.

  7. Soldered Contact and Current Risetime Effects on Negative Polarity Wire Array Z-pinches

    International Nuclear Information System (INIS)

    Chalenski, D. A.; Kusse, B. R.; Greenly, J. B.; Blesener, I. C.; McBride, R. D.; Hammer, D. A.; Knapp, P. F.

    2009-01-01

    The Cornell University COBRA pulser is a nominal 1 MA machine, capable of driving up to 32 wire cylindrical Z-pinch arrays. COBRA can operate with variable current risetimes ranging from 100 ns to 200 ns (short and long pulse, respectively). Wires are typically strung with a ''press'' contact to the electrode hardware, where the wire is loosely pulled against the hardware and held there to establish electrical contact. The machine is normally negative, but a bolt-on convolute can be used to modify the current path and effectively produce positive polarity operation at the load.Previous research with single wires on a 1-5 kA pulser has shown that soldering the wire, thereby improving the wire/electrode contact, and operating in positive polarity can improve the energy deposition into the wire and enhance wire core expansion. Negative polarity showed no difference. Previous experiments on the negative polarity, 20 MA, 100 ns Z accelerator have shown that improving the contact improved the x-ray yield.Cornell data were collected on 16-wire Aluminum Z-pinch arrays in negative polarity. Experiments were conducted with both short and long current pulses with soldered and no-soldered wire/electrode contacts. The initiation, ablation, implosion and stagnation phases were compared for these four conditions. Time dependent x-ray signals were measured using diodes and diamond detectors. An inductive voltage monitor was used to infer minimum current radius achieved, as defined by a uniform shell of current moving radially inward, producing a time dependent inductance. Total energy data were collected with a metal-strip bolometer. Self-emission data were collected by an XUV 4-frame camera and an optical streak camera.In negative polarity and with short pulses, soldering appeared to produce a smaller radius pinch and decrease variations in the x-ray pulse shape. The bolometer, laser backlighter, 4-frame and streak cameras showed negligible differences in the initiation ablation

  8. Investigation into mechanical properties of joints of heterogeneous materials brazed with high-temperature solders

    International Nuclear Information System (INIS)

    Lomenko, V.I.; Merkushev, V.P.; Borodina, L.M.; Sycheva, T.S.; Tokhtina, O.A.; Frolov, N.N.

    1988-01-01

    Mechanical properties of copper joints with copper, 12Kh18M10T steel and KhD50 composite obtained by vacuum brazing by copper-titanium solder as compared with properties of joints brazed by PSr 72 and PMFOTsr 6-4-0.03 solders in hydrogen are studied. Dependences of joints strength on temperature of contact - reactive vacuum brazing are obtained. Possible applications of joints of dissimilar materials in electrovacuum devices subjected to the effect of dynamic loadings are established

  9. Dye-enhanced protein solders and patches in laser-assisted tissue welding.

    Science.gov (United States)

    Small, W; Heredia, N J; Maitland, D J; Da Silva, L B; Matthews, D L

    1997-01-01

    This study examines the use of dye-enhanced protein bonding agents in 805 nm diode laser-assisted tissue welding. A comparison of an albumin liquid solder and collagen solid-matrix patches used to repair arteriotomies in an in vitro porcine model is presented. Extrinsic bonding media in the form of solders and patches have been used to enhance the practice of laser tissue welding. Preferential absorption of the laser wavelength has been achieved by the incorporation of chromophores. Both the solder and the patch included indocyanine green dye (ICG) to absorb the 805 nm continuous-wave diode laser light used to perform the welds. Solder-mediated welds were divided into two groups (high power/short exposure and low power/long exposure), and the patches were divided into three thickness groups ranging from 0.1 to 1.3 mm. The power used to activate the patches was constant, but the exposure time was increased with patch thickness. Burst pressure results indicated that solder-mediated and patched welds yielded similar average burst strengths in most cases, but the patches provided a higher success rate (i.e., more often exceeded 150 mmHg) and were more consistent (i.e., smaller standard deviation) than the solder. The strongest welds were obtained using 1.0-1.3 mm thick patches, while the high power/short exposure solder group was the weakest. Though the solder and patches yielded similar acute weld strengths, the solid-matrix patches facilitated the welding process and provided consistently strong welds. The material properties of the extrinsic agents influenced their performance.

  10. Evaluation of low-residue soldering for military and commercial applications: A report from the Low-Residue Soldering Task Force

    Energy Technology Data Exchange (ETDEWEB)

    Iman, R.L.; Anderson, D.J. [Sandia National Labs., Albuquerque, NM (United States); Burress, R.V. [SEHO (United States)] [and others

    1995-06-01

    The LRSTF combined the efforts of industry, military, and government to evaluate low-residue soldering processes for military and commercial applications. These processes were selected for evaluation because they provide a means for the military to support the presidential mandate while producing reliable hardware at a lower cost. This report presents the complete details and results of a testing program conducted by the LRSTF to evaluate low-residue soldering for printed wiring assemblies. A previous informal document provided details of the test plan used in this evaluation. Many of the details of that test plan are contained in this report. The test data are too massive to include in this report, however, these data are available on disk as Excel spreadsheets upon request. The main purpose of low-residue soldering is to eliminate waste streams during the manufacturing process.

  11. Reliability Assessment of Solder Joints in Power Electronic Modules by Crack Damage Model for Wind Turbine Applications

    Directory of Open Access Journals (Sweden)

    John D. Sørensen

    2011-12-01

    Full Text Available Wind turbine reliability is an important issue for wind energy cost minimization, especially by reduction of operation and maintenance costs for critical components and by increasing wind turbine availability. To develop an optimal operation and maintenance plan for critical components, it is necessary to understand the physics of their failure and be able to develop reliability prediction models. Such a model is proposed in this paper for an IGBT power electronic module. IGBTs are critical components in wind turbine converter systems. These are multilayered devices where layers are soldered to each other and they operate at a thermal-power cycling environment. Temperature loadings affect the reliability of soldered joints by developing cracks and fatigue processes that eventually result in failure. Based on Miner’s rule a linear damage model that incorporates a crack development and propagation processes is discussed. A statistical analysis is performed for appropriate model parameter selection. Based on the proposed model, a layout for component life prediction with crack movement is described in details.

  12. Rapid communication: Computational simulation and analysis of a candidate for the design of a novel silk-based biopolymer.

    Science.gov (United States)

    Golas, Ewa I; Czaplewski, Cezary

    2014-09-01

    This work theoretically investigates the mechanical properties of a novel silk-derived biopolymer as polymerized in silico from sericin and elastin-like monomers. Molecular Dynamics simulations and Steered Molecular Dynamics were the principal computational methods used, the latter of which applies an external force onto the system and thereby enables an observation of its response to stress. The models explored herein are single-molecule approximations, and primarily serve as tools in a rational design process for the preliminary assessment of properties in a new material candidate. © 2014 Wiley Periodicals, Inc.

  13. Quantitative iTRAQ-Based Proteomic Identification of Candidate Biomarkers for Diabetic Nephropathy in Plasma of Type 1 Diabetic Patients

    DEFF Research Database (Denmark)

    Overgaard, Anne Julie; Thingholm, Tine Engberg; Larsen, Martin R

    2010-01-01

    INTRODUCTION: As part of a clinical proteomics programme focused on diabetes and its complications, it was our goal to investigate the proteome of plasma in order to find improved candidate biomarkers to predict diabetic nephropathy. METHODS: Proteins derived from plasma from a cross-sectional co...... nephropathy; however, they need to be confirmed in a longitudinal cohort. ELECTRONIC SUPPLEMENTARY MATERIAL: The online version of this article (doi:10.1007/s12014-010-9053-0) contains supplementary material, which is available to authorized users....

  14. Effect of gamma radiation on micromechanical hardness of lead-free solder joint

    Energy Technology Data Exchange (ETDEWEB)

    Paulus, Wilfred [Universiti Kebangsaan Malaysia, Bangi, 43600 Kajang, Selangor (Malaysia); Malaysian Nuclear Agency, Bangi, 43000 Kajang, Selangor (Malaysia); Rahman, Irman Abdul; Jalar, Azman; Kamil, Insan; Bakar, Maria Abu [Universiti Kebangsaan Malaysia, Bangi, 43600 Kajang, Selangor (Malaysia); Yusoff, Wan Yusmawati Wan [Universiti Pertahanan Nasional Malaysia, Kem Sg. Besi, 57000 Kuala Lumpur (Malaysia)

    2015-09-25

    Lead-free solders are important material in nano and microelectronic surface mounting technology for various applications in bio medicine, environmental monitoring, spacecraft and satellite instrumentation. Nevertheless solder joint in radiation environment needs higher reliability and resistance to any damage caused by ionizing radiations. In this study a lead-free 99.0Sn0.3Ag0.7Cu wt.% (SAC) solder joint was developed and subjected to various doses of gamma radiation to investigate the effects of the ionizing radiation to micromechanical hardness of the solder. Averaged hardness of the SAC joint was obtained from nanoindentation test. The results show a relationship between hardness values of indentations and the increment of radiation dose. Highest mean hardness, 0.2290 ± 0.0270 GPa was calculated on solder joint which was exposed to 5 Gray dose of gamma radiation. This value indicates possible radiation hardening effect on irradiated solder. The hardness gradually decreased to 0.1933 ± 0.0210 GPa and 0.1631 ± 0.0173 GPa when exposed to doses 50 and 500 gray respectively. These values are also lower than the hardness of non irradiated sample which was calculated as 0.2084 ± 0.0.3633 GPa indicating possible radiation damage and needs further related atomic dislocation study.

  15. Characterization of the microstructure of tin-silver lead free solder

    Energy Technology Data Exchange (ETDEWEB)

    Hurtony, Tamás, E-mail: hurtony@ett.bme.hu [Department of Electronics Technology, Budapest University of Technology and Economics, Egry József utca 18, Budapest, H-1111 (Hungary); Szakál, Alex; Almásy, László [Neutron Spectroscopy Department, Wigner Research Centre for Physics, Budapest (Hungary); Len, Adél [Neutron Spectroscopy Department, Wigner Research Centre for Physics, Budapest (Hungary); Faculty of Engineering and Information Technology, University of Pécs (Hungary); Kugler, Sándor [Department of Theoretical Physics, Budapest University of Technology and Economics (Hungary); Bonyár, Attila; Gordon, Péter [Department of Electronics Technology, Budapest University of Technology and Economics, Egry József utca 18, Budapest, H-1111 (Hungary)

    2016-07-05

    Reliability and lifetime are the two most relevant design considerations in the production of safety critical assemblies. For example in a modern automobile dozens of electronic assemblies are integrated in which thousands of solder joints are mounting the electronic components to the printed circuit boards. There exists no standardised and universal observation method for characterising the fine microstructure of such solder joints. Previously we have developed a new method for the quantitative characterization of lead-free solder alloys and in present study the validity of the proposed method is demonstrated. Microstructure of Sn-3.5Ag lead free solder alloy was investigated by electrochemical impedance spectroscopy. Solder samples were solidified with different cooling rates in order to induce differences in the microstructure. Microstructure of the ingots was revealed by selective electrochemical etching. Electrochemical impedance spectra (EIS) were measured before and after the selective etching process. The complex impedance spectra contain information about microstructure of the solder alloys. Comparison and modelling of two EIS spectra allowed obtaining a characteristic parameter of surface structure of the etched specimens. The EIS measurements were complemented with small angle neutron scattering measurements and scanning electron microscopy, in order to correlate the EIS parameter with the magnitude of the interface of the β-Sn and Ag{sub 3}Sn phases.

  16. Wall-slip effects in SnAgCu solder pastes used in electronics assembly applications

    International Nuclear Information System (INIS)

    Mallik, S.; Ekere, N.N.; Durairaj, R.; Marks, A.E.; Seman, A.

    2009-01-01

    Solder paste is the most important strategic bonding material used in the assembly of surface mount components in electronics manufacturing. As the trend towards miniaturisation of electronic products continues, there is an increasing demand for better understanding of the flow and deformation that is, the rheological behaviour of solder paste formulations. Wall slip plays an important role in characterising the flow behaviour of solder paste materials. The problem of wall slip arises due to the various attractive and repulsive forces acting between the solder particles and the walls of the measuring geometry. These interactions could lead to the presence of a thin solvent layer adjacent to the wall, which gives rise to slippage. In rheological measurements, slip effects can generally be avoided by using roughened surfaces for measuring geometries. In this paper, a novel technique is developed to study the effect of wall slip in the rheological measurements of lead-free solder paste. The viscosity and oscillatory data obtained for three different solder paste samples (from measuring geometries of different surface roughness) have been analysed and compared. In viscosity measurements, slip effects were dominant at low shear rates and the use of serrated surfaces was found to be quite effective in minimizing slip effects. Oscillatory measurements were also affected by roughening the surfaces of measuring geometries.

  17. Rheological characterisation and printing performance of Sn/Ag/Cu solder pastes

    International Nuclear Information System (INIS)

    Durairaj, R.; Ramesh, S.; Mallik, S.; Seman, A.; Ekere, N.

    2009-01-01

    Lead-free solder paste printing process accounts for majority of the assembly defects in the electronic manufacturing industry. The study investigates rheological behaviour and stencil printing performance of the lead-free solder pastes (Sn/Ag/Cu). Oscillatory stress sweep test was carried out to study the visco-elastic behaviour of the lead-free solder pastes. The visco-elastic behaviour of the paste encompasses solid and liquid characteristic of the paste, which could be used to study the flow behaviour experienced by the pastes during the stencil printing process. From this study, it was found that the solid characteristics (G') is higher than the liquid characteristic (G'') for the pastes material. In addition, the results from the study showed that the solder paste with a large G' = G'' has a higher cohesiveness resulting in poor withdrawal of the paste during the stencil printing process. The phase angles (δ) was used to correlate the quality of the dense suspensions to the formulation of solder paste materials. This study has revealed the value of having a rheological measurement for explaining and characterising solder pastes for stencil printing. As the demand for lead free pastes increases rheological measurements can assist with the formulation or development of new pastes.

  18. Study on interfacial reaction between lead-free solders and alternative surface finishes

    International Nuclear Information System (INIS)

    Siti Rabiatul Aisha; Ourdjini, A.; Saliza Osman

    2007-01-01

    This study investigates the interfacial reactions occurring during reflow soldering between Sn-Ag-Cu lead-free solder and two surface finishes: electroless nickel/ immersion gold (ENIG) and immersion silver (IAg). The study focuses on interfacial reactions evolution and growth kinetics of intermetallic compounds (IMC) formed during soldering and isothermal ageing at 150 degree Celsius for up to 2000 hours. Optical and scanning electron microscopy were used to measure IMC thickness and examine the morphology of IMC respectively, whereas the IMC phases were identified by energy dispersive X-ray analysis (EDX). The results showed that the IMC formed on ENIG finish is thinner compared to that formed on IAg finish. For IAg surface finish, Cu 6 Sn 5 IMCs with scallop morphology are formed at the solder/ surface finish interface after reflow while a second IMC, Cu 3 Sn was formed between the copper and Cu 6 Sn 5 IMC after the isothermal ageing treatment. For ENIG surface finish both (Cu,Ni) 6 Sn 5 and (Ni,Cu) 3 Sn 4 are formed after soldering. Isothermal aging of the solder joints formed on ENIG finish was found to have a significant effect on the morphology of the intermetallics by transforming to more spherical and denser morphology in addition to increase i their thickness with increased ageing time. (author)

  19. Comparative shear tests of some low temperature lead-free solder pastes

    Science.gov (United States)

    Branzei, Mihai; Plotog, Ioan; Varzaru, Gaudentiu; Cucu, Traian C.

    2016-12-01

    The range of electronic components and as a consequence, all parts of automotive electronic equipment operating temperatures in a vehicle is given by the location of that equipment, so the maximum temperature can vary between 358K and 478K1. The solder joints could be defined as passive parts of the interconnection structure of automotive electronic equipment, at a different level, from boards of electronic modules to systems. The manufacturing costs reduction necessity and the RoHS EU Directive3, 7 consequences generate the trend to create new Low-Temperature Lead-Free (LTLF) solder pastes family9. In the paper, the mechanical strength of solder joints and samples having the same transversal section as resistor 1206 case type made using the same LTLF alloys into Vapour Phase Soldering (VPS) process characterized by different cooling rates (slow and rapid) and two types of test PCBs pads finish, were benchmarked at room temperature. The presented work extends the theoretical studies and experiments upon heat transfer in VPSP in order to optimize the technology for soldering process (SP) of automotive electronic modules and could be extended for home and modern agriculture appliances industry. The shear forces (SF) values of the LTLF alloy samples having the same transversal section as resistor 1206 case type will be considered as references values of a database useful in the new solder alloy creation processes and their qualification for automotive electronics domain.

  20. Investigation on solder joint strength of nickel tin-plated and CRS tabs with PCB

    International Nuclear Information System (INIS)

    Luay Hussain

    2002-01-01

    Failure analysis on easily peels off Nickel and CRS steel tabs from PCB was carried out. Nickel Tin plated tabs, CRS steel tabs and tube were joined to the PCB using reflow/ convection soldering, in an oven. The solder paste composition is Sn36/Pb35/Ag2. Peel test was conducted and it was found that many tabs could be easily peeled off with low force. Porosities which varies from 0.4 mm to < 0.01mm in diameter, developed during soldering process and solidification was noted. It was found, the number, size and position of these porosities inside the solder layer on both parts of the tabs affect the peel strength. Scanning Electron Microscopy study and EDX analysis were carried out. It was found that the low peel strength values were due to the combination of generation and development of porosities during soldering process which act as stress concentrators and the evolution (growth) of eutectic Sn/Pb and Sn/Ni/Cu brittle grainy phase. Large eutectic microstructure with brittle Sn-Ni-Cu grainy phase enhances the failure with low peeling forces. Sample showing no feature of Sn/Ni/Cu grain gave high peeling strength value. Solder reflow, an important process, can result in strength enhancement (if it was controlled for example in a furnace). (Author)

  1. Properties and Microstructures of Sn-Ag-Cu-X Lead-Free Solder Joints in Electronic Packaging

    Directory of Open Access Journals (Sweden)

    Lei Sun

    2015-01-01

    Full Text Available SnAgCu solder alloys were considered as one of the most popular lead-free solders because of its good reliability and mechanical properties. However, there are also many problems that need to be solved for the SnAgCu solders, such as high melting point and poor wettability. In order to overcome these shortcomings, and further enhance the properties of SnAgCu solders, many researchers choose to add a series of alloying elements (In, Ti, Fe, Zn, Bi, Ni, Sb, Ga, Al, and rare earth and nanoparticles to the SnAgCu solders. In this paper, the work of SnAgCu lead-free solders containing alloying elements and nanoparticles was reviewed, and the effects of alloying elements and nanoparticles on the melting temperature, wettability, mechanical properties, hardness properties, microstructures, intermetallic compounds, and whiskers were discussed.

  2. Multiple reaction monitoring assay based on conventional liquid chromatography and electrospray ionization for simultaneous monitoring of multiple cerebrospinal fluid biomarker candidates for Alzheimer's disease.

    Science.gov (United States)

    Choi, Yong Seok; Lee, Kelvin H

    2016-03-01

    Alzheimer's disease (AD) is the most common type of dementia, but early and accurate diagnosis remains challenging. Previously, a panel of cerebrospinal fluid (CSF) biomarker candidates distinguishing AD and non-AD CSF accurately (>90 %) was reported. Furthermore, a multiple reaction monitoring (MRM) assay based on nano liquid chromatography tandem mass spectrometry (nLC-MS/MS) was developed to help validate putative AD CSF biomarker candidates including proteins from the panel. Despite the good performance of the MRM assay, wide acceptance may be challenging because of limited availability of nLC-MS/MS systems in laboratories. Thus, here, a new MRM assay based on conventional LC-MS/MS is presented. This method monitors 16 peptides representing 16 (of 23) biomarker candidates that belonged to the previous AD CSF panel. A 30-times more concentrated sample than the sample used for the previous study was loaded onto a high capacity trap column, and all 16 MRM transitions showed good linearity (average R(2) = 0.966), intra-day reproducibility (average coefficient of variance (CV) = 4.78 %), and inter-day reproducibility (average CV = 9.85 %). The present method has several advantages such as a shorter analysis time, no possibility of target variability, and no need for an internal standard.

  3. VennPainter: A Tool for the Comparison and Identification of Candidate Genes Based on Venn Diagrams.

    Directory of Open Access Journals (Sweden)

    Guoliang Lin

    Full Text Available VennPainter is a program for depicting unique and shared sets of genes lists and generating Venn diagrams, by using the Qt C++ framework. The software produces Classic Venn, Edwards' Venn and Nested Venn diagrams and allows for eight sets in a graph mode and 31 sets in data processing mode only. In comparison, previous programs produce Classic Venn and Edwards' Venn diagrams and allow for a maximum of six sets. The software incorporates user-friendly features and works in Windows, Linux and Mac OS. Its graphical interface does not require a user to have programing skills. Users can modify diagram content for up to eight datasets because of the Scalable Vector Graphics output. VennPainter can provide output results in vertical, horizontal and matrix formats, which facilitates sharing datasets as required for further identification of candidate genes. Users can obtain gene lists from shared sets by clicking the numbers on the diagram. Thus, VennPainter is an easy-to-use, highly efficient, cross-platform and powerful program that provides a more comprehensive tool for identifying candidate genes and visualizing the relationships among genes or gene families in comparative analysis.

  4. Experimental and computational study of the morphological evolution of intermetallic compound (Cu6Sn5) layers at the Cu/Sn interface under isothermal soldering conditions

    International Nuclear Information System (INIS)

    Park, M.S.; Stephenson, M.K.; Shannon, C.; Cáceres Díaz, L.A.; Hudspeth, K.A.; Gibbons, S.L.; Muñoz-Saldaña, J.; Arróyave, R.

    2012-01-01

    Cu/Sn soldering alloys have emerged as a viable alternative to Pb-based solders, and thus have been extensively explored in the past decade, although the fine-scale behavior of the resulting intermetallic compounds (IMCs), particularly during the early stages of interface formation, is still a source of debate. In this work, the microstructural evolution of Cu 6 Sn 5 , in a Cu/Sn soldering reaction at 523 K, was experimentally investigated by dipping a single Cu sample into molten Sn at a near-constant speed, yielding a continuous set of time evolution samples. The thickness, coarsening and morphology evolution of the Cu 6 Sn 5 layer is investigated through the use of scanning electron microscopy. The experimental results are also compared to phase-field simulations of the microstructural evolution of the Cu 6 Sn 5 layer. The influence of model parameters on the kinetics and morphological evolution of the IMC layer was examined. In general, good qualitative agreement is found between experiments and simulations and for a limited parameter set there appears to be good quantitative agreement between the growth kinetics of the Cu 6 Sn 5 layer, the grain boundary (GB) effect on grain coarsening, and the substrate/IMC interface roughness evolution. Furthermore, the parametric investigations of the model suggests that good agreement between experiments and simulations is achieved when the dominant transport mechanism for the reacting elements (Cu and Sn) is GB diffusion.

  5. Generation and Characterization of Live Attenuated Influenza A(H7N9 Candidate Vaccine Virus Based on Russian Donor of Attenuation.

    Directory of Open Access Journals (Sweden)

    Svetlana Shcherbik

    Full Text Available Avian influenza A (H7N9 virus has emerged recently and continues to cause severe disease with a high mortality rate in humans prompting the development of candidate vaccine viruses. Live attenuated influenza vaccines (LAIV are 6:2 reassortant viruses containing the HA and NA gene segments from wild type influenza viruses to induce protective immune responses and the six internal genes from Master Donor Viruses (MDV to provide temperature sensitive, cold-adapted and attenuated phenotypes.LAIV candidate A/Anhui/1/2013(H7N9-CDC-LV7A (abbreviated as CDC-LV7A, based on the Russian MDV, A/Leningrad/134/17/57 (H2N2, was generated by classical reassortment in eggs and retained MDV temperature-sensitive and cold-adapted phenotypes. CDC-LV7A had two amino acid substitutions N123D and N149D (H7 numbering in HA and one substitution T10I in NA. To evaluate the role of these mutations on the replication capacity of the reassortants in eggs, the recombinant viruses A(H7N9RG-LV1 and A(H7N9RG-LV2 were generated by reverse genetics. These changes did not alter virus antigenicity as ferret antiserum to CDC-LV7A vaccine candidate inhibited hemagglutination by homologous A(H7N9 virus efficiently. Safety studies in ferrets confirmed that CDC-LV7A was attenuated compared to wild-type A/Anhui/1/2013. In addition, the genetic stability of this vaccine candidate was examined in eggs and ferrets by monitoring sequence changes acquired during virus replication in the two host models. No changes in the viral genome were detected after five passages in eggs. However, after ten passages additional mutations were detected in the HA gene. The vaccine candidate was shown to be stable in the ferret model; post-vaccination sequence data analysis showed no changes in viruses collected in nasal washes present at day 5 or day 7.Our data indicate that the A/Anhui/1/2013(H7N9-CDC-LV7A reassortant virus is a safe and genetically stable candidate vaccine virus that is now available for

  6. Elevated-Temperature Mechanical Properties of Lead-Free Sn-0.7Cu- xSiC Nanocomposite Solders

    Science.gov (United States)

    Mohammadi, A.; Mahmudi, R.

    2018-02-01

    Mechanical properties of Sn-0.7 wt.%Cu lead-free solder alloy reinforced with 0 vol.%, 1 vol.%, 2 vol.%, and 3 vol.% 100-nm SiC particles have been assessed using the shear punch testing technique in the temperature range from 25°C to 125°C. The composite materials were fabricated by the powder metallurgy route by blending, compacting, sintering, and finally extrusion. The 2 vol.% SiC-containing composite showed superior mechanical properties. In all conditions, the shear strength was adversely affected by increasing test temperature, and the 2 vol.% SiC-containing composite showed superior mechanical properties. Depending on the test temperature, the shear yield stress and ultimate shear strength increased, respectively, by 3 MPa to 4 MPa and 4 MPa to 5.5 MPa, in the composite materials. The strength enhancement was mostly attributed to the Orowan particle strengthening mechanism due to the SiC nanoparticles, and to a lesser extent to the coefficient of thermal expansion mismatch between the particles and matrix in the composite solder. A modified shear lag model was used to predict the total strengthening achieved by particle addition, based on the contribution of each of the above mechanisms.

  7. Properties and Microstructures of Sn-Ag-Cu-X Lead-Free Solder Joints in Electronic Packaging

    OpenAIRE

    Sun, Lei; Zhang, Liang

    2015-01-01

    SnAgCu solder alloys were considered as one of the most popular lead-free solders because of its good reliability and mechanical properties. However, there are also many problems that need to be solved for the SnAgCu solders, such as high melting point and poor wettability. In order to overcome these shortcomings, and further enhance the properties of SnAgCu solders, many researchers choose to add a series of alloying elements (In, Ti, Fe, Zn, Bi, Ni, Sb, Ga, Al, and rare earth) and nanoparti...

  8. Integration of gene-based markers in a pearl millet genetic map for identification of candidate genes underlying drought tolerance quantitative trait loci

    Directory of Open Access Journals (Sweden)

    Sehgal Deepmala

    2012-01-01

    Full Text Available Abstract Background Identification of genes underlying drought tolerance (DT quantitative trait loci (QTLs will facilitate understanding of molecular mechanisms of drought tolerance, and also will accelerate genetic improvement of pearl millet through marker-assisted selection. We report a map based on genes with assigned functional roles in plant adaptation to drought and other abiotic stresses and demonstrate its use in identifying candidate genes underlying a major DT-QTL. Results Seventy five single nucleotide polymorphism (SNP and conserved intron spanning primer (CISP markers were developed from available expressed sequence tags (ESTs using four genotypes, H 77/833-2, PRLT 2/89-33, ICMR 01029 and ICMR 01004, representing parents of two mapping populations. A total of 228 SNPs were obtained from 30.5 kb sequenced region resulting in a SNP frequency of 1/134 bp. The positions of major pearl millet linkage group (LG 2 DT-QTLs (reported from crosses H 77/833-2 × PRLT 2/89-33 and 841B × 863B were added to the present consensus function map which identified 18 genes, coding for PSI reaction center subunit III, PHYC, actin, alanine glyoxylate aminotransferase, uridylate kinase, acyl-CoA oxidase, dipeptidyl peptidase IV, MADS-box, serine/threonine protein kinase, ubiquitin conjugating enzyme, zinc finger C- × 8-C × 5-C × 3-H type, Hd3, acetyl CoA carboxylase, chlorophyll a/b binding protein, photolyase, protein phosphatase1 regulatory subunit SDS22 and two hypothetical proteins, co-mapping in this DT-QTL interval. Many of these candidate genes were found to have significant association with QTLs of grain yield, flowering time and leaf rolling under drought stress conditions. Conclusions We have exploited available pearl millet EST sequences to generate a mapped resource of seventy five new gene-based markers for pearl millet and demonstrated its use in identifying candidate genes underlying a major DT-QTL in this species. The reported gene-based

  9. Effect of Multiple Reflow Cycles and Al2O3 Nanoparticles Reinforcement on Performance of SAC305 Lead-Free Solder Alloy

    Science.gov (United States)

    Tikale, Sanjay; Prabhu, K. Narayan

    2018-05-01

    The effect of Al2O3 nanoparticles reinforcement on melting behavior, microstructure evolution at the interface and joint shear strength of 96.5Sn3Ag0.5Cu (SAC305) lead-free solder alloy subjected to multiple reflow cycles was investigated. The reinforced SAC305 solder alloy compositions were prepared by adding Al2O3 nanoparticles in different weight fractions (0.05, 0.1, 0.3 and 0.5 wt.%) through mechanical dispersion. Cu/solder/Cu micro-lap-shear solder joint specimens were used to assess the shear strength of the solder joint. Differential scanning calorimetry was used to investigate the melting behavior of SAC305 solder nanocomposites. The solder joint interfacial microstructure was studied using scanning electron microscopy. The results showed that the increase in melting temperature (T L) and melting temperature range of the SAC305 solder alloy by addition of Al2O3 nanoparticles were not significant. In comparison with unreinforced SAC305 solder alloy, the reinforcement of 0.05-0.5 wt.% of Al2O3 nanoparticles improved the solder wettability. The addition of nanoparticles in minor quantity effectively suppressed the Cu6Sn5 IMC growth, improved the solder joint shear strength and ductility under multiple reflow cycles. However, the improvement in solder properties was less pronounced on increasing the nanoparticle content above 0.1 wt.% of the solder alloy.

  10. Two novel blood-based biomarker candidates measuring degradation of tau are associated with dementia: A prospective study

    DEFF Research Database (Denmark)

    Neergaard, Jesper Skov; Dragsbæk, Katrine; Christiansen, Claus

    2018-01-01

    fragments were detected in serum of 5,309 women from the Prospective Epidemiological Risk Factor study. The study was an observational, prospective study of Danish postmenopausal women. Subjects were followed with registry-linkage for up to 15 years (median follow-up time 13.7 years). Cox regression......Truncated tau appears to be specifically related to disease pathology and recent studies have shown the presence and elevation of several truncated tau species in Cerebrospinal fluid (CSF) of subjects with Alzheimer's disease (AD); however, the relevance of truncated Tau measurements in blood...... is still being studied. The aim of the current study was to assess the longitudinal associations between baseline levels of two novel blood biomarker candidates measuring truncated tau, Tau-A and Tau-C, and the risk of incident dementia and AD in elderly women. Using solid phase competitive ELISA, two tau...

  11. A Feasibility Assessment of Behavioral-based Interviewing to Improve Candidate Selection for a Pulmonary and Critical Care Medicine Fellowship Program.

    Science.gov (United States)

    Tatem, Geneva; Kokas, Maria; Smith, Cathy L; DiGiovine, Bruno

    2017-04-01

    Traditional interviews for residency and fellowship training programs are an important component in the selection process, but can be of variable value due to a nonstandardized approach. We redesigned the candidate interview process for our large pulmonary and critical care medicine fellowship program in the United States using a behavioral-based interview (BBI) structure. The primary goal of this approach was to standardize the assessment of candidates within noncognitive domains with the goal of selecting those with the best fit for our institution's fellowship program. Eight faculty members attended two BBI workshops. The first workshop identified our program's "best fit" criteria using the framework of the Accreditation Council for Graduate Medical Education's six core competencies and additional behaviors that fit within our programs. BBI questions were then selected from a national database and refined based on the attributes deemed most important by our faculty. In the second workshop, faculty practiced the BBI format in mock interviews with third-year fellows. The interview process was further refined based on feedback from the interviewees, and then applied with fellowship candidates for the 2014 recruitment season. The 1-year pilot of behavioral-based interviewing allowed us to achieve consensus on the traits sought for our incoming fellows and to standardize the interview process for our program using the framework of the Accreditation Council for Graduate Medical Education core competencies. Although the effects of this change on the clinical performance of our fellows have not yet been assessed, this description of our development and implementation processes may be helpful for programs seeking to redesign their applicant interviews.

  12. Citizen Candidates Under Uncertainty

    OpenAIRE

    Eguia, Jon X.

    2005-01-01

    In this paper we make two contributions to the growing literature on "citizen-candidate" models of representative democracy. First, we add uncertainty about the total vote count. We show that in a society with a large electorate, where the outcome of the election is uncertain and where winning candidates receive a large reward from holding office, there will be a two-candidate equilibrium and no equilibria with a single candidate. Second, we introduce a new concept of equilibrium, which we te...

  13. How Many Peripheral Solder Joints in a Surface Mounted Design Experience Inelastic Strains?

    Science.gov (United States)

    Suhir, E.; Yi, S.; Ghaffarian, R.

    2017-03-01

    It has been established that it is the peripheral solder joints that are the most vulnerable in the ball-grid-array (BGA) and column-grid-array (CGA) designs and most often fail. As far as the long-term reliability of a soldered microelectronics assembly as a whole is concerned, it makes a difference, if just one or more peripheral joints experience inelastic strains. It is clear that the low cycle fatigue lifetime of the solder system is inversely proportional to the number of joints that simultaneously experience inelastic strains. A simple and physically meaningful analytical expression (formula) is obtained for the prediction, at the design stage, of the number of such joints, if any, for the given effective thermal expansion (contraction) mismatch of the package and PCB; materials and geometrical characteristics of the package/PCB assembly; package size; and, of course, the level of the yield stress in the solder material. The suggested formula can be used to determine if the inelastic strains in the solder material could be avoided by the proper selection of the above characteristics and, if not, how many peripheral joints are expected to simultaneously experience inelastic strains. The general concept is illustrated by a numerical example carried out for a typical BGA package. The suggested analytical model (formula) is applicable to any soldered microelectronics assembly. The roles of other important factors, such as, e.g., solder material anisotropy, grain size, and their random orientation within a joint, are viewed in this analysis as less important factors than the level of the interfacial stress. The roles of these factors will be accounted for in future work and considered, in addition to the location of the joint, in a more complicated, more sophisticated, and more comprehensive reliability/fatigue model.

  14. The critical oxide thickness for Pb-free reflow soldering on Cu substrate

    Energy Technology Data Exchange (ETDEWEB)

    Chung, C. Key [Department of Materials Science and Engineering, National Taiwan University, No. 1, Sec. 4, Roosevelt Road, Taipei, 10617, Taiwan (China); Assembly Test Global Materials, Intel Microelectronics Asia Ltd, B1, No. 205, Tun-Hwa North Road, 10595 Taipei, Taiwan (China); Chen, Y.J.; Li, C.C. [Department of Materials Science and Engineering, National Taiwan University, No. 1, Sec. 4, Roosevelt Road, Taipei, 10617, Taiwan (China); Kao, C.R., E-mail: crkao@ntu.edu.tw [Department of Materials Science and Engineering, National Taiwan University, No. 1, Sec. 4, Roosevelt Road, Taipei, 10617, Taiwan (China)

    2012-06-01

    Oxidation is an undesirable effect of reflow soldering. Non-wetting occurs when the oxide layer grows above the critical thickness. Characterizing the critical oxide thickness for soldering is challenging due to oxide's nano-scale thickness and irregular topographic surface. In this paper, the critical copper oxide thickness was characterized by Time-of-Flight Secondary Ion Mass Spectrometry, Scanning Electron Microscopy, Energy-Dispersive X-ray spectroscopy, and Transmission Electron Microscopy. Copper substrates were coated with an Organic-Solderable-Preservative (OSP) layer and baked at 150 Degree-Sign C and 85% Relative Humidity for different amounts of time. The onset of the non-wetting phenomenon occurred when the oxide thickness reached 18 {+-} 5 nm. As the oxide grew beyond this critical thickness, the percentage of non-wetting solder joint increased exponentially. The growth of the oxide thickness followed a parabolic rate law. The rate constant of oxidation was 0.6 Multiplication-Sign 10{sup -15} cm{sup 2} min{sup -1}. Oxidation resulted from interdiffusion of copper and oxygen atoms through the OSP and oxide layers. The oxidation mechanism will be presented and discussed. - Highlights: Black-Right-Pointing-Pointer Critical oxide thickness for Pb free solder on Cu substrate is 18 {+-} 5 nm. Black-Right-Pointing-Pointer Above the critical oxide, non-wet solder joint increases exponentially. Black-Right-Pointing-Pointer A maximum 13-nm oxide thickness is suggested for good solder joint. Black-Right-Pointing-Pointer Initial growth of oxide thickness is logarithmic and then parabolic after 12 nm. Black-Right-Pointing-Pointer Thick oxide (360-560 nm) is formed as pores shorten the oxidation path.

  15. Identification of candidate categories of the International Classification of Functioning Disability and Health (ICF for a Generic ICF Core Set based on regression modelling

    Directory of Open Access Journals (Sweden)

    Üstün Bedirhan T

    2006-07-01

    Full Text Available Abstract Background The International Classification of Functioning, Disability and Health (ICF is the framework developed by WHO to describe functioning and disability at both the individual and population levels. While condition-specific ICF Core Sets are useful, a Generic ICF Core Set is needed to describe and compare problems in functioning across health conditions. Methods The aims of the multi-centre, cross-sectional study presented here were: a to propose a method to select ICF categories when a large amount of ICF-based data have to be handled, and b to identify candidate ICF categories for a Generic ICF Core Set by examining their explanatory power in relation to item one of the SF-36. The data were collected from 1039 patients using the ICF checklist, the SF-36 and a Comorbidity Questionnaire. ICF categories to be entered in an initial regression model were selected following systematic steps in accordance with the ICF structure. Based on an initial regression model, additional models were designed by systematically substituting the ICF categories included in it with ICF categories with which they were highly correlated. Results Fourteen different regression models were performed. The variance the performed models account for ranged from 22.27% to 24.0%. The ICF category that explained the highest amount of variance in all the models was sensation of pain. In total, thirteen candidate ICF categories for a Generic ICF Core Set were proposed. Conclusion The selection strategy based on the ICF structure and the examination of the best possible alternative models does not provide a final answer about which ICF categories must be considered, but leads to a selection of suitable candidates which needs further consideration and comparison with the results of other selection strategies in developing a Generic ICF Core Set.

  16. Designing defect-based qubit candidates in wide-gap binary semiconductors for solid-state quantum technologies

    Science.gov (United States)

    Seo, Hosung; Ma, He; Govoni, Marco; Galli, Giulia

    2017-12-01

    The development of novel quantum bits is key to extending the scope of solid-state quantum-information science and technology. Using first-principles calculations, we propose that large metal ion-vacancy pairs are promising qubit candidates in two binary crystals: 4 H -SiC and w -AlN. In particular, we found that the formation of neutral Hf- and Zr-vacancy pairs is energetically favorable in both solids; these defects have spin-triplet ground states, with electronic structures similar to those of the diamond nitrogen-vacancy center and the SiC divacancy. Interestingly, they exhibit different spin-strain coupling characteristics, and the nature of heavy metal ions may allow for easy defect implantation in desired lattice locations and ensure stability against defect diffusion. To support future experimental identification of the proposed defects, we report predictions of their optical zero-phonon line, zero-field splitting, and hyperfine parameters. The defect design concept identified here may be generalized to other binary semiconductors to facilitate the exploration of new solid-state qubits.

  17. Nb-base FS-85 Alloy as a Candidate Structural Material for Space Reactor Applications: Effects of Thermal Aging

    International Nuclear Information System (INIS)

    Leonard, Keith J.; Busby, Jeremy T.; Hoelzer, David T.; Zinkle, Steven J.

    2009-01-01

    The proposed use of fission reactors for manned or deep space missions have typically relied on the potential use of refractory metal alloys as structural materials. Throughout the history of these programs, the lead candidate has been Nb-1Zr due to its good fabrication and welding characteristics. However, the less than optimal creep resistance of this alloy has encouraged interest in the more complex FS-85 (Nb-28Ta-10W-1Zr) alloy. Despite this interest, a relatively small database exists for the properties of FS-85. These gaps include potential microstructural instabilities that can lead to mechanical property degradation. In this work, changes in microstructure and mechanical properties of FS-85 were investigated following 1100 h of thermal aging at 1098, 1248 and 1398 K. The changes in electrical resistivity, hardness and tensile properties between the as-annealed and aged materials are compared. Evaluation of the microstructural changes was performed through optical, scanning and transmission electron microscopy. The development of intragranular and grain boundary precipitation of Zr-rich compounds as a function of aging temperature was followed. Brittle tensile behavior was measured in the 1248 K aged material, while ductile behavior occurred in material aged above and below this temperature. The effect of temperature on the under and overaging of the grain boundary particles are believed to have contributed to the mechanical property behavior of the aged material

  18. Nb-Base FS-85 Alloy as a Candidate Structural Material for Space Reactor Applications: Effects of Thermal Aging

    Science.gov (United States)

    Leonard, Keith J.; Busby, Jeremy T.; Hoelzer, David T.; Zinkle, Steven J.

    2009-04-01

    The proposed uses of fission reactors for manned or deep space missions have typically relied on the potential use of refractory metal alloys as structural materials. Throughout the history of these programs, a leading candidate has been Nb-1Zr, due to its good fabrication and welding characteristics. However, the less-than-optimal creep resistance of this alloy has encouraged interest in the more complex FS-85 (Nb-28Ta-10W-1Zr) alloy. Despite this interest, only a relatively small database exists for the properties of FS-85. Database gaps include the potential microstructural instabilities that can lead to mechanical property degradation. In this work, changes in the microstructure and mechanical properties of FS-85 were investigated following 1100 hours of thermal aging at 1098, 1248, and 1398 K. The changes in electrical resistivity, hardness, and tensile properties between the as-annealed and aged materials are compared. Evaluation of the microstructural changes was performed through optical microscopy (OM), scanning electron microscopy (SEM), and transmission electron microscopy (TEM). The development of intragranular and grain-boundary precipitation of Zr-rich compounds as a function of aging temperature was followed. Brittle tensile behavior was measured in the material aged at 1248 K, while ductile behavior occurred in samples aged above and below this temperature. The effect of temperature on the under- and overaging of the grain-boundary particles is believed to have contributed to the mechanical property behavior of the aged materials.

  19. Candidate Gene Identification with SNP Marker-Based Fine Mapping of Anthracnose Resistance Gene Co-4 in Common Bean.

    Science.gov (United States)

    Burt, Andrew J; William, H Manilal; Perry, Gregory; Khanal, Raja; Pauls, K Peter; Kelly, James D; Navabi, Alireza

    2015-01-01

    Anthracnose, caused by Colletotrichum lindemuthianum, is an important fungal disease of common bean (Phaseolus vulgaris). Alleles at the Co-4 locus confer resistance to a number of races of C. lindemuthianum. A population of 94 F4:5 recombinant inbred lines of a cross between resistant black bean genotype B09197 and susceptible navy bean cultivar Nautica was used to identify markers associated with resistance in bean chromosome 8 (Pv08) where Co-4 is localized. Three SCAR markers with known linkage to Co-4 and a panel of single nucleotide markers were used for genotyping. A refined physical region on Pv08 with significant association with anthracnose resistance identified by markers was used in BLAST searches with the genomic sequence of common bean accession G19833. Thirty two unique annotated candidate genes were identified that spanned a physical region of 936.46 kb. A majority of the annotated genes identified had functional similarity to leucine rich repeats/receptor like kinase domains. Three annotated genes had similarity to 1, 3-β-glucanase domains. There were sequence similarities between some of the annotated genes found in the study and the genes associated with phosphoinositide-specific phosphilipases C associated with Co-x and the COK-4 loci found in previous studies. It is possible that the Co-4 locus is structured as a group of genes with functional domains dominated by protein tyrosine kinase along with leucine rich repeats/nucleotide binding site, phosphilipases C as well as β-glucanases.

  20. GC-MS Based Plasma Metabolomics for Identification of Candidate Biomarkers for Hepatocellular Carcinoma in Egyptian Cohort.

    Directory of Open Access Journals (Sweden)

    Mohammad R Nezami Ranjbar

    Full Text Available This study evaluates changes in metabolite levels in hepatocellular carcinoma (HCC cases vs. patients with liver cirrhosis by analysis of human blood plasma using gas chromatography coupled with mass spectrometry (GC-MS. Untargeted metabolomic analysis of plasma samples from participants recruited in Egypt was performed using two GC-MS platforms: a GC coupled to single quadruple mass spectrometer (GC-qMS and a GC coupled to a time-of-flight mass spectrometer (GC-TOFMS. Analytes that showed statistically significant changes in ion intensities were selected using ANOVA models. These analytes and other candidates selected from related studies were further evaluated by targeted analysis in plasma samples from the same participants as in the untargeted metabolomic analysis. The targeted analysis was performed using the GC-qMS in selected ion monitoring (SIM mode. The method confirmed significant changes in the levels of glutamic acid, citric acid, lactic acid, valine, isoleucine, leucine, alpha tocopherol, cholesterol, and sorbose in HCC cases vs. patients with liver cirrhosis. Specifically, our findings indicate up-regulation of metabolites involved in branched-chain amino acid (BCAA metabolism. Although BCAAs are increasingly used as a treatment for cancer cachexia, others have shown that BCAA supplementation caused significant enhancement of tumor growth via activation of mTOR/AKT pathway, which is consistent with our results that BCAAs are up-regulated in HCC.

  1. Chemical wiring and soldering toward all-molecule electronic circuitry.

    Science.gov (United States)

    Okawa, Yuji; Mandal, Swapan K; Hu, Chunping; Tateyama, Yoshitaka; Goedecker, Stefan; Tsukamoto, Shigeru; Hasegawa, Tsuyoshi; Gimzewski, James K; Aono, Masakazu

    2011-06-01

    Key to single-molecule electronics is connecting functional molecules to each other using conductive nanowires. This involves two issues: how to create conductive nanowires at designated positions, and how to ensure chemical bonding between the nanowires and functional molecules. Here, we present a novel method that solves both issues. Relevant functional molecules are placed on a self-assembled monolayer of diacetylene compound. A probe tip of a scanning tunneling microscope is then positioned on the molecular row of the diacetylene compound to which the functional molecule is adsorbed, and a conductive polydiacetylene nanowire is fabricated by initiating chain polymerization by stimulation with the tip. Since the front edge of chain polymerization necessarily has a reactive chemical species, the created polymer nanowire forms chemical bonding with an encountered molecular element. We name this spontaneous reaction "chemical soldering". First-principles theoretical calculations are used to investigate the structures and electronic properties of the connection. We demonstrate that two conductive polymer nanowires are connected to a single phthalocyanine molecule. A resonant tunneling diode formed by this method is discussed. © 2011 American Chemical Society

  2. Improvement of the auto wire feeder machine in a de-soldering process

    Directory of Open Access Journals (Sweden)

    Niramon Nonkhukhetkhong

    2016-10-01

    Full Text Available This paper presents the methodology of the de-soldering process for rework of disk drive Head Stack Assembly (HSA units. The auto wire feeder is a machine that generates Tin (Sn on the product. This machine was determined to be one of the major sources of excess Sn on the HSA. The defect rate due to excess Sn is more than 30%, which leads to increased processing time and cost to perform additional cleaning steps. From process analysis, the major causes of excess Sn are as follows: 1 The machine cannot cut the wire all the way into the flux core area; 2 The sizes and types of soldering irons are not appropriate for the unit parts; and, 3 There are variations introduced into the de-soldering process by the workforce. This paper proposes a methodology to address all three of these causes. First, the auto wire feeder machine in the de-solder process will be adjusted in order to cut wires into flux core. Second, the types of equipment and material used in de-soldering will be optimized. Finally, a new standard method for operators, which can be controlled more easily, will be developed in order to reduce defects due to workforce related variation. After these process controls and machine adjustments were implemented, the overall Sn related problems were significantly improved. Sn contamination was reduced by 41% and cycle time was reduced by an average of 15 seconds.

  3. Electromigration-induced back stress in critical solder length for three-dimensional integrated circuits

    Energy Technology Data Exchange (ETDEWEB)

    Huang, Y. T.; Hsu, H. H.; Wu, Albert T., E-mail: atwu@ncu.edu.tw [Department of Chemical and Materials Engineering, National Central University, Jhongli City 320, Taiwan (China)

    2014-01-21

    Because of the miniaturization of electronic devices, the reliability of electromigration has become a major concern when shrinking the solder dimensions in flip-chip joints. Fast reaction between solders and electrodes causes intermetallic compounds (IMCs) to form, which grow rapidly and occupy entire joints when solder volumes decrease. In this study, U-grooves were fabricated on Si chips as test vehicles. An electrode-solder-electrode sandwich structure was fabricated by using lithography and electroplating. Gaps exhibiting well-defined dimensions were filled with Sn3.5Ag solders. The gaps between the copper electrodes in the test sample were limited to less than 15 μm to simulate microbumps. The samples were stressed at various current densities at 100 °C, 125 °C, and 150 °C. The morphological changes of the IMCs were observed, and the dimensions of the IMCs were measured to determine the kinetic growth of IMCs. Therefore, this study focused on the influence of back stress caused by microstructural evolution in microbumps.

  4. In vitro conjunctival incision repair by temperature-controlled laser soldering.

    Science.gov (United States)

    Norman, Galia; Rabi, Yaron; Assia, Ehud; Katzir, Abraham

    2009-01-01

    The common method of closing conjunctival incisions is by suturing, which is associated with several disadvantages. It requires skill to apply and does not always provide a watertight closure, which is required in some operations (e.g., glaucoma filtration). The purpose of the present study was to evaluate laser soldering as an alternative method for closing conjunctival incisions. Conjunctival incisions of 20 ex vivo porcine eyes were laser soldered using a temperature-controlled fiberoptic laser system and an albumin mixed with indocyanine green as a solder. The control group consisted of five repaired incisions by a 10-0 nylon running suture. The leak pressure of the repaired incisions was measured. The mean leak pressure in the laser-soldered group was 132 mm Hg compared to 4 mm Hg in the sutured group. There was no statistically significant difference in both the incision's length and distance from the limbus between the groups, before and after the procedure, indicating that there was no severe thermal damage. These preliminary results clearly demonstrate that laser soldering may be a useful method for achieving an immediate watertight conjunctival wound closure. This procedure is faster and easier to apply than suturing.

  5. Nano-soldering of magnetically aligned three-dimensional nanowire networks

    International Nuclear Information System (INIS)

    Gao Fan; Gu Zhiyong

    2010-01-01

    It is extremely challenging to fabricate 3D integrated nanostructures and hybrid nanoelectronic devices. In this paper, we report a simple and efficient method to simultaneously assemble and solder nanowires into ordered 3D and electrically conductive nanowire networks. Nano-solders such as tin were fabricated onto both ends of multi-segmented nanowires by a template-assisted electrodeposition method. These nanowires were then self-assembled and soldered into large-scale 3D network structures by magnetic field assisted assembly in a liquid medium with a high boiling point. The formation of junctions/interconnects between the nanowires and the scale of the assembly were dependent on the solder reflow temperature and the strength of the magnetic field. The size of the assembled nanowire networks ranged from tens of microns to millimeters. The electrical characteristics of the 3D nanowire networks were measured by regular current-voltage (I-V) measurements using a probe station with micropositioners. Nano-solders, when combined with assembling techniques, can be used to efficiently connect and join nanowires with low contact resistance, which are very well suited for sensor integration as well as nanoelectronic device fabrication.

  6. Development and evaluation of novel recombinant adenovirus-based vaccine candidates for infectious bronchitis virus and Mycoplasma gallisepticum in chickens.

    Science.gov (United States)

    Zhang, Dongchao; Long, Yuqing; Li, Meng; Gong, Jianfang; Li, Xiaohui; Lin, Jing; Meng, Jiali; Gao, Keke; Zhao, Ruili; Jin, Tianming

    2018-04-01

    Avian infectious bronchitis caused by the infectious bronchitis virus (IBV), and mycoplasmosis caused by Mycoplasma gallisepticum (MG) are two major respiratory diseases in chickens that have resulted in severe economic losses in the poultry industry. We constructed a recombinant adenovirus that simultaneously expresses the S1 spike glycoprotein of IBV and the TM-1 protein of MG (pBH-S1-TM-1-EGFP). For comparison, we constructed two recombinant adenoviruses (pBH-S1-EGFP and pBH-TM-1-EGFP) that express either the S1 spike glycoprotein or the TM-1 protein alone. The protective efficacy of these three vaccine constructs against challenge with IBV and/or MG was evaluated in specific pathogen free chickens. Groups of seven-day-old specific pathogen free chicks were immunized twice, two weeks apart, via the oculonasal route with the pBH-S1-TM-1-EGFP, pBH-S1-EGFP, or pBH-TM-1-EGFP vaccine candidates or the commercial attenuated infectious bronchitis vaccine strain H52 and MG vaccine strain F-36 (positive controls), and challenged with virulent IBV or MG two weeks later. Interestingly, by days 7 and 14 after the booster immunization, pBH-S1-TM-1-EGFP-induced antibody titre was significantly higher (P attenuated commercial IBV vaccine; however, there was no significant difference between the pBH-S1-TM-1-EGFP and attenuated commercial MG vaccine groups (P > 0.05). The clinical signs, the gross, and histopathological lesions scores of the adenovirus vaccine constructs were not significantly different from that of the attenuated commercial IBV or MG vaccines (positive controls) (P > 0.05). These results demonstrate the potential of the bivalent pBH-S1-TM-1-EGFP adenovirus construct as a combination vaccine against IB and mycoplasmosis.

  7. Candidate Gene Identification with SNP Marker-Based Fine Mapping of Anthracnose Resistance Gene Co-4 in Common Bean.

    Directory of Open Access Journals (Sweden)

    Andrew J Burt

    Full Text Available Anthracnose, caused by Colletotrichum lindemuthianum, is an important fungal disease of common bean (Phaseolus vulgaris. Alleles at the Co-4 locus confer resistance to a number of races of C. lindemuthianum. A population of 94 F4:5 recombinant inbred lines of a cross between resistant black bean genotype B09197 and susceptible navy bean cultivar Nautica was used to identify markers associated with resistance in bean chromosome 8 (Pv08 where Co-4 is localized. Three SCAR markers with known linkage to Co-4 and a panel of single nucleotide markers were used for genotyping. A refined physical region on Pv08 with significant association with anthracnose resistance identified by markers was used in BLAST searches with the genomic sequence of common bean accession G19833. Thirty two unique annotated candidate genes were identified that spanned a physical region of 936.46 kb. A majority of the annotated genes identified had functional similarity to leucine rich repeats/receptor like kinase domains. Three annotated genes had similarity to 1, 3-β-glucanase domains. There were sequence similarities between some of the annotated genes found in the study and the genes associated with phosphoinositide-specific phosphilipases C associated with Co-x and the COK-4 loci found in previous studies. It is possible that the Co-4 locus is structured as a group of genes with functional domains dominated by protein tyrosine kinase along with leucine rich repeats/nucleotide binding site, phosphilipases C as well as β-glucanases.

  8. Trial application of the candidate root cause categorization scheme and preliminary assessment of selected data bases for the root causes of component failures program

    International Nuclear Information System (INIS)

    Bruske, S.Z.; Cadwallader, L.C.; Stepina, P.L.

    1985-04-01

    The objective of the Nuclear Regulatory Commission's (NRC) Root Causes of Component Failures Program is to develop and apply a categorization scheme for identifying root causes of failures for components that comprise safety and safety support systems of nuclear power plants. Results from this program will provide valuable input in the areas of probabilistic risk assessment, reliability assurance, and application of risk assessments in the inspection program. This report presents the trial application and assessment of the candidate root cause categorization scheme to three failure data bases: the In-Plant Reliability Data System (IPRDS), the Licensee Event Report (LER) data base, and the Nuclear Plant Reliability Data System (NPRDS). Results of the trial application/assessment show that significant root cause information can be obtained from these failure data bases

  9. Effects of Fe2NiO4 nanoparticles addition into lead free Sn–3.0Ag–0.5Cu solder pastes on microstructure and mechanical properties after reflow soldering process

    International Nuclear Information System (INIS)

    Chellvarajoo, Srivalli; Abdullah, M.Z.; Samsudin, Z.

    2015-01-01

    Highlights: • Fe 2 NiO 4 nanoparticles added into SAC 305 by mechanical mixing to form nanocomposite solder paste. • Nanoparticles in the composite solder travels with flux to the outermost surface after reflow. • The intermetallics compound reduced with the addition of nanoparticles into solder paste. • The hardness increased with the addition of limited percentage of nanoparticles into SAC 305. - Abstract: This study investigates the effects of the addition of Fe 2 NiO 4 nanoparticles into a SAC-305 lead-free solder paste. Iron, nickel, and oxide nano-elements were mixed with Pb-free solder alloying elements to produce a new form of nanocomposite solder paste, which can be a promising material in electronic packaging. The SAC-305 was mechanically added with 0.5, 1.5, and 2.5 wt.% of Fe 2 NiO 4 nanoparticles. The migration of nanoparticles in the nanocomposite solder paste to the outermost surface was clarified using the copper ‘sandwich’ method, which was performed after the reflow soldering process. Varying amounts of nanoparticles in the SAC-305 affected the IMC thickness and mechanical properties of the nanocomposite solder paste. The IMC thickness was reduced by 29.15%, 42.37%, and 59.00% after adding 0.5, 1.5, and 2.5 wt.% of Fe 2 NiO 4 nanoparticles in the SAC-305, respectively. However, via nanoindentation method, the hardness of the nanocomposite solder was improved by 44.07% and 56.82% after adding 0.5 and 1.5 wt.% of Fe 2 NiO 4 nanoparticles, respectively. If the addition of Fe 2 NiO 4 nanoparticle exceeded 1.5 wt.%, the hardness increased infinitely

  10. Serum-free microcarrier based production of replication deficient Influenza vaccine candidate virus lacking NS1 using Vero cells

    Directory of Open Access Journals (Sweden)

    Yan Mylene L

    2011-08-01

    Full Text Available Abstract Background Influenza virus is a major health concern that has huge impacts on the human society, and vaccination remains as one of the most effective ways to mitigate this disease. Comparing the two types of commercially available Influenza vaccine, the live attenuated virus vaccine is more cross-reactive and easier to administer than the traditional inactivated vaccines. One promising live attenuated Influenza vaccine that has completed Phase I clinical trial is deltaFLU, a deletion mutant lacking the viral Nonstructural Protein 1 (NS1 gene. As a consequence of this gene deletion, this mutant virus can only propagate effectively in cells with a deficient interferon-mediated antiviral response. To demonstrate the manufacturability of this vaccine candidate, a batch bioreactor production process using adherent Vero cells on microcarriers in commercially available animal-component free, serum-free media is described. Results Five commercially available animal-component free, serum-free media (SFM were evaluated for growth of Vero cells in agitated Cytodex 1 spinner flask microcarrier cultures. EX-CELL Vero SFM achieved the highest cell concentration of 2.6 × 10^6 cells/ml, whereas other SFM achieved about 1.2 × 10^6 cells/ml. Time points for infection between the late exponential and stationary phases of cell growth had no significant effect in the final virus titres. A virus yield of 7.6 Log10 TCID50/ml was achieved using trypsin concentration of 10 μg/ml and MOI of 0.001. The Influenza vaccine production process was scaled up to a 3 liter controlled stirred tank bioreactor to achieve a cell density of 2.7 × 10^6 cells/ml and virus titre of 8.3 Log10 TCID50/ml. Finally, the bioreactor system was tested for the production of the corresponding wild type H1N1 Influenza virus, which is conventionally used in the production of inactivated vaccine. High virus titres of up to 10 Log10 TCID50/ml were achieved. Conclusions We describe for the

  11. Selection and validation of potato candidate genes for maturity corrected resistance to Phytophthora infestans based on differential expression combined with SNP association and linkage mapping

    Directory of Open Access Journals (Sweden)

    Meki Shehabu Muktar

    2015-09-01

    Full Text Available Late blight of potato (Solanum tuberosum L. caused by the oomycete Phytophthora infestans (Mont. de Bary, is one of the most important bottlenecks of potato production worldwide. Cultivars with high levels of durable, race unspecific, quantitative resistance are part of a solution to this problem. However, breeding for quantitative resistance is hampered by the correlation between resistance and late plant maturity, which is an undesirable agricultural attribute. The objectives of our research are (i the identification of genes that condition quantitative resistance to P. infestans not compromised by late plant maturity and (ii the discovery of diagnostic single nucleotide polymorphism (SNP markers to be used as molecular tools to increase efficiency and precision of resistance breeding. Twenty two novel candidate genes were selected based on comparative transcript profiling by SuperSAGE (serial analysis of gene expression in groups of plants with contrasting levels of maturity corrected resistance (MCR. Reproducibility of differential expression was tested by quantitative real time PCR and allele specific pyrosequencing in four new sets of genotype pools with contrasting late blight resistance levels, at three infection time points and in three independent infection experiments. Reproducibility of expression patterns ranged from 28% to 97%. Association mapping in a panel of 184 tetraploid cultivars identified SNPs in five candidate genes that were associated with MCR. These SNPs can be used in marker-assisted resistance breeding. Linkage mapping in two half-sib families (n = 111 identified SNPs in three candidate genes that were linked with MCR. The differentially expressed genes that showed association and/or linkage with MCR putatively function in phytosterol synthesis, fatty acid synthesis, asparagine synthesis, chlorophyll synthesis, cell wall modification and in the response to pathogen elicitors.

  12. Setup Time Reduction On Solder Paste Printing Machine – A Case Study

    Directory of Open Access Journals (Sweden)

    Rajesh Dhake

    2013-06-01

    Full Text Available Lean manufacturing envisages the reduction of the seven deadly wastes referred to as MUDA. Setup time forms a major component of the equipment downtime. It leads to lower machine utilization and restricts the output and product variety. This necessitates the requirement for quick setups. Single Minute Exchange of Die philosophy (a lean manufacturing tool here after referred as “SMED” is one of the important tool which aims at quick setups driving smaller lot sizes, lower production costs, improve productivity in terms of increased output, increased utilization of machine and labor hours, make additional capacity available (often at bottleneck resources, reduce scrap and rework, and increase flexibility[3]. This paper focuses on the application of Single Minute Exchange of Die[1] and Quick Changeover Philosophy[2] for reducing setup time on Solder Past Printing Machine (bottleneck machine in a electronic speedo-cluster manufacturing company. The four step SMED philosophy was adopted to effect reduction in setup time. The initial step was gathering information about the present setup times and its proportion to the total productive time. A detailed video based time study of setup activities was done to classify them into external and internal setup activities in terms of their need (i.e. preparation, replacement or adjustment, time taken and the way these could be reduced, simplified or eliminated. The improvements effected were of three categories viz., mechanical, procedural and organizational. The paper concludes by comparing the present and proposed (implemented methods of setup procedures.

  13. Enhanced interfacial thermal transport in pnictogen tellurides metallized with a lead-free solder alloy

    Energy Technology Data Exchange (ETDEWEB)

    Devender,; Ramanath, Ganpati, E-mail: Ramanath@rpi.edu [Department of Materials Science and Engineering, Rensselaer Polytechnic Institute, Troy, New York 12180 (United States); Lofgreen, Kelly; Devasenathipathy, Shankar; Swan, Johanna; Mahajan, Ravi [Intel Corporation, Assembly Test and Technology Development, Chandler, Arizona 85226 (United States); Borca-Tasciuc, Theodorian [Department of Mechanical Aerospace and Nuclear Engineering, Rensselaer Polytechnic Institute, Troy, New York 12180 (United States)

    2015-11-15

    Controlling thermal transport across metal–thermoelectric interfaces is essential for realizing high efficiency solid-state refrigeration and waste-heat harvesting power generation devices. Here, the authors report that pnictogen chalcogenides metallized with bilayers of Sn{sub 96.5}Ag{sub 3}Cu{sub 0.5} solder and Ni barrier exhibit tenfold higher interfacial thermal conductance Γ{sub c} than that obtained with In/Ni bilayer metallization. X-ray diffraction and x-ray spectroscopy indicate that reduced interdiffusion and diminution of interfacial SnTe formation due to Ni layer correlates with the higher Γ{sub c}. Finite element modeling of thermoelectric coolers metallized with Sn{sub 96.5}Ag{sub 3}Cu{sub 0.5}/Ni bilayers presages a temperature drop ΔT ∼ 22 K that is 40% higher than that obtained with In/Ni metallization. Our results underscore the importance of controlling chemical intermixing at solder–metal–thermoelectric interfaces to increase the effective figure of merit, and hence, the thermoelectric cooling efficiency. These findings should facilitate the design and development of lead-free metallization for pnictogen chalcogenide-based thermoelectrics.

  14. Reliability of Pb free solder alloys. Physical and mechanical properties; Pb free handa no shinraisei. Butsuri kikaiteki shinraisei

    Energy Technology Data Exchange (ETDEWEB)

    Sanji, M; Yoshino, M; Ishikawa, J; Takenaka, O [Denso Corp., Aichi (Japan)

    1997-10-01

    Properties of 19 different Pb free solders have been evaluated in comparison with Sn-37Pb eutectic solder. Pb free solders without Bi were on the same level as Sn-37Pb in tensile strength and elongation, and those with Bi had higher strength and lower elongation than Sn-37Pb. As the Bi content increased, strength was higher, and elongation was lower. In torsion fatigue tests, fatigue life of Pb free solders without Bi was longer than Sn-37Pb. The relationships of Coffin-Manson rule and Basquin rule with fatigue life was applicable to Pb free solder. Fatigue life of those is inferred from their tensile strength. 7 refs., 13 figs., 1 tab.

  15. Design of Experiments to Determine Causes of Flex Cable Solder Wicking, Discoloration and Hole Location Defects

    Energy Technology Data Exchange (ETDEWEB)

    Wolfe, Larry

    2009-04-22

    Design of Experiments (DoE) were developed and performed in an effort to discover and resolve the causes of three different manufacturing issues; large panel voids after Hot Air Solder Leveling (HASL), cable hole locations out of tolerance after lamination and delamination/solder wicking around flat flex cable circuit lands after HASL. Results from a first DoE indicated large panel voids could be eliminated by removing the pre-HASL cleaning. It also revealed eliminating the pre-HASL bake would not be detrimental when using a hard press pad lamination stackup. A second DoE indicated a reduction in hard press pad stackup lamination pressure reduced panel stretch in the y axis approximately 70%. A third DoE illustrated increasing the pre-HASL bake temperature could reduce delamination/solder wicking when using a soft press pad lamination stackup.

  16. Instantaneous fluxless bonding of Au with Pb-Sn solder in ambient atmosphere

    International Nuclear Information System (INIS)

    Lee, T.K.; Zhang, Sam; Wong, C.C.; Tan, A.C.

    2005-01-01

    A fluxless bonding technique has been developed as a method of flip-chip bonding for microelectronic packaging. The fluxless bonding technique can be achieved instantaneously in an ambient environment between metallic stud bumps and predefined molten solder. This paper describes the mechanics of the bonding action and verifies the effectiveness of this bonding method through wetting balance tests and scanning electron microscope and energy dispersive x-ray analysis. This technique has been demonstrated by using a gold stud bump to break the tin oxide layer over molten solder. This allows for a fast, solid liquid interdiffusion between gold (Au) and the fresh molten eutectic lead-tin (Pb-Sn) solder for joint formation during solidification. This bonding method has been successfully tested with 130-μm-pitch flip-chip bond pads on a joint-in-via flex substrate architecture

  17. Dissolution ad uptake of cadmium from dental gold solder alloy implants

    International Nuclear Information System (INIS)

    Bergman, B.; Bergman, M.; Soeremark, R.

    1977-01-01

    Pure metallic cadmium was irradiated by means of thermal neutrons. The irradiated cadmium ( 115 Cd) was placed in bags of gold foil and the bags were implanted subcutaneously in the neck region of mice. Two and 3 d respectively after implantation the mice were killed, the bags removed and the animals subjected to whole-body autoradiography. The autoradiograms revealed an uptake of 115 Cd in liver and kidney. In another experiment specimens of a cadmium-containing dental gold solder alloy, a cadmium-free dental casting gold alloy and soldered assemblies made of these two alloys were implanted subcutaneously in the neck region of mice. The animals were killed after 6 months; cadmium analysis showed significant increases in the cadmium concentration in liver and kidney of those mice which had been given implants of gold solder alloy. The study clearly shows that due to electrochemical corrosion cadmium can be released from implants and accumulated in the kidneys and the liver. (author)

  18. Investigation Of The Effects Of Reflow Profile Parameters On Lead-free Solder Bump Volumes And Joint Integrity

    Science.gov (United States)

    Amalu, E. H.; Lui, Y. T.; Ekere, N. N.; Bhatti, R. S.; Takyi, G.

    2011-01-01

    The electronics manufacturing industry was quick to adopt and use the Surface Mount Technology (SMT) assembly technique on realization of its huge potentials in achieving smaller, lighter and low cost product implementations. Increasing global customer demand for miniaturized electronic products is a key driver in the design, development and wide application of high-density area array package format. Electronic components and their associated solder joints have reduced in size as the miniaturization trend in packaging continues to be challenged by printing through very small stencil apertures required for fine pitch flip-chip applications. At very narrow aperture sizes, solder paste rheology becomes crucial for consistent paste withdrawal. The deposition of consistent volume of solder from pad-to-pad is fundamental to minimizing surface mount assembly defects. This study investigates the relationship between volume of solder paste deposit (VSPD) and the volume of solder bump formed (VSBF) after reflow, and the effect of reflow profile parameters on lead-free solder bump formation and the associated solder joint integrity. The study uses a fractional factorial design (FFD) of 24-1 Ramp-Soak-Spike reflow profile, with all main effects and two-way interactions estimable to determine the optimal factorial combination. The results from the study show that the percentage change in the VSPD depends on the combination of the process parameters and reliability issues could become critical as the size of solder joints soldered on the same board assembly vary greatly. Mathematical models describe the relationships among VSPD, VSBF and theoretical volume of solder paste. Some factors have main effects across the volumes and a number of interactions exist among them. These results would be useful for R&D personnel in designing and implementing newer applications with finer-pitch interconnect.

  19. Transcriptomic identification of candidate genes involved in sunflower responses to chilling and salt stresses based on cDNA microarray analysis

    Directory of Open Access Journals (Sweden)

    Paniego Norma

    2008-01-01

    Full Text Available Abstract Background Considering that sunflower production is expanding to arid regions, tolerance to abiotic stresses as drought, low temperatures and salinity arises as one of the main constrains nowadays. Differential organ-specific sunflower ESTs (expressed sequence tags were previously generated by a subtractive hybridization method that included a considerable number of putative abiotic stress associated sequences. The objective of this work is to analyze concerted gene expression profiles of organ-specific ESTs by fluorescence microarray assay, in response to high sodium chloride concentration and chilling treatments with the aim to identify and follow up candidate genes for early responses to abiotic stress in sunflower. Results Abiotic-related expressed genes were the target of this characterization through a gene expression analysis using an organ-specific cDNA fluorescence microarray approach in response to high salinity and low temperatures. The experiment included three independent replicates from leaf samples. We analyzed 317 unigenes previously isolated from differential organ-specific cDNA libraries from leaf, stem and flower at R1 and R4 developmental stage. A statistical analysis based on mean comparison by ANOVA and ordination by Principal Component Analysis allowed the detection of 80 candidate genes for either salinity and/or chilling stresses. Out of them, 50 genes were up or down regulated under both stresses, supporting common regulatory mechanisms and general responses to chilling and salinity. Interestingly 15 and 12 sequences were up regulated or down regulated specifically in one stress but not in the other, respectively. These genes are potentially involved in different regulatory mechanisms including transcription/translation/protein degradation/protein folding/ROS production or ROS-scavenging. Differential gene expression patterns were confirmed by qRT-PCR for 12.5% of the microarray candidate sequences. Conclusion

  20. In-vitro Investigations of Skin Closure using Diode Laser and Protein Solder Containing Gold Nanoshells

    Directory of Open Access Journals (Sweden)

    Mohammad Sadegh Nourbakhsh

    2010-12-01

    Full Text Available Introduction: Laser tissue soldering is a new technique for repair of various tissues including the skin, liver, articular cartilage and nerves and is a promising alternative to suture. To overcome the problems of thermal damage to surrounding tissues and low laser penetration depth, some exogenous chromophores such as gold nanoshells, a new class of nanoparticles consisting of a dielectric core surrounded by a thin metal shell, are used. The aims of this study were to use two different concentrations of gold nanoshells as the exogenous material for skin tissue soldering and also to examine the effects of laser soldering parameters on the properties of the repaired skin. Material and Methods: Two mixtures of albumin solder and different concentrations of gold nanoshells were prepared. A full thickness incision of 2×20 mm2 was made on the surface and after placing 50 μl of the solder mixture on the incision, an 810 nm diode laser was used to irradiate it at different power densities. The changes of tensile strength, σt, due to temperature rise, number of scan (Ns, and scan velocity (Vs were investigated. Results: The results showed that the tensile strength of the repaired skin increased with increasing irradiance for both gold nanoshell concentrations. In addition, at constant laser irradiance (I, the tensile strength of the repaired incision increased with increasing Ns and decreasing Vs. In our case, this corresponded to st = 1610 g/cm2 at I ~ 60 Wcm-2, T ~ 65ºC, Ns = 10 and Vs = 0.2 mms-1. Discussion and Conclusion: Gold nanoshells can be used as an indocyanine green dye (ICG alterative for laser tissue soldering.  Although by increasing the laser power density, the tensile strength of the repaired skin increases, an optimum power density must be considered due to the resulting increase in tissue temperature.

  1. Mechanical performances of lead-free solder joint connections with applications in the aerospace domain

    Directory of Open Access Journals (Sweden)

    Georgiana PADURARU

    2016-03-01

    Full Text Available The paper presents some theoretical and experimental aspects regarding the tribological performances of lead-free solder joint connections, with application in the aerospace domain. In order to highlight the mechanical and tribological properties of solder joint in correlation with different pad finishes, there were made some mechanical determinations using a dedicated Share Test System. The theoretical model highlights the link between the experimental results and the influence of gravitational acceleration on the mechanical and functional integrity of the electronic assemblies that works in vibration environment. The paper novelty is provided by the interdisciplinary experiment that offers results that can be used in the mechanical, tribological, electronical and aerospace domains.

  2. Aging treatment characteristics of solder bump joint for high reliability optical module

    International Nuclear Information System (INIS)

    Kim, Kyung-Seob; Yu, Chung-Hee; Yang, Jun-Mo

    2004-01-01

    The joint strength and fracture surfaces of Sn-37 mass% Pb and Au stud bumps for photo diode packages after isothermal aging testing were studied experimentally. Al/Au stud bumps and Cu/Sn-37 mass% Pb solders were adopted, and aged for up to 900 h to analyze the effect of intermetallic compound (IMC). The joint strength decreased with aging time. The diffraction patterns of Cu 6 Sn 5 , scallop-shaped IMCs, and planar-shaped Cu 3 Sn were characterized using transmission electron microscopy (TEM). The formation of Kirkendall voids and the growth of IMCs at the solder were found to be a possible mechanism for joint strength reduction

  3. Reliability Assessment of Solder Joints in Power Electronic Modules by Crack Damage Model for Wind Turbine Applications

    DEFF Research Database (Denmark)

    Kostandyan, Erik; Sørensen, John Dalsgaard

    2011-01-01

    Wind turbine reliability is an important issue for wind energy cost minimization, especially by reduction of operation and maintenance costs for critical components and by increasing wind turbine availability. To develop an optimal operation and maintenance plan for critical components, it is nec......Wind turbine reliability is an important issue for wind energy cost minimization, especially by reduction of operation and maintenance costs for critical components and by increasing wind turbine availability. To develop an optimal operation and maintenance plan for critical components...... to each other and they operate at a thermal-power cycling environment. Temperature loadings affect the reliability of soldered joints by developing cracks and fatigue processes that eventually result in failure. Based on Miner’s rule a linear damage model that incorporates a crack development...

  4. The Effect of ICT Assisted Project Based Learning Approach on Prospective ICT Integration Skills of Teacher Candidates

    Science.gov (United States)

    Pilten, Pusat; Pilten, Gulhiz; Sahinkaya, Nihan

    2017-01-01

    The purpose of the present research is studying the effects of information and communication technologies (ICT) assisted project based learning practices on ICT integration skills of pre-service classroom teachers. The research adopted a mixed method. The quantitative dimension of the research was designed with pre-test-post-test control groups.…

  5. Effect of the Creative Drama-Based Assertiveness Program on the Assertiveness Skill of Psychological Counsellor Candidates

    Science.gov (United States)

    Gundogdu, Rezzan

    2012-01-01

    The purpose of this quasi-experimental research is to study the effects of the creative drama-based assertiveness program (CDBAP) on the assertiveness skill of Psychological Counselling and Guidance (PCG) department students. The opinions of experimental group students on the program were obtained through the CDBAP evaluation form. The sample of…

  6. Looking for New Polycrystalline MC-Reinforced Cobalt-Based Superalloys Candidate to Applications at 1200°C

    OpenAIRE

    Patrice Berthod

    2017-01-01

    For applications for which temperatures higher than 1150°C can be encountered the currently best superalloys, the γ/γ′ single crystals, cannot be used under stress because of the disappearance of their reinforcing γ′ precipitates at such temperatures which are higher than their solvus. Cobalt-based alloys strengthened by refractory and highly stable carbides may represent an alternative solution. In this work the interest was focused on MC carbides of several types. Alloys were elaborated wit...

  7. Influence of nanoparticle addition on the formation and growth of intermetallic compounds (IMCs) in Cu/Sn–Ag–Cu/Cu solder joint during different thermal conditions

    Science.gov (United States)

    Ting Tan, Ai; Wen Tan, Ai; Yusof, Farazila

    2015-01-01

    Nanocomposite lead-free solders are gaining prominence as replacements for conventional lead-free solders such as Sn–Ag–Cu solder in the electronic packaging industry. They are fabricated by adding nanoparticles such as metallic and ceramic particles into conventional lead-free solder. It is reported that the addition of such nanoparticles could strengthen the solder matrix, refine the intermetallic compounds (IMCs) formed and suppress the growth of IMCs when the joint is subjected to different thermal conditions such as thermal aging and thermal cycling. In this paper, we first review the fundamental studies on the formation and growth of IMCs in lead-free solder joints. Subsequently, we discuss the effect of the addition of nanoparticles on IMC formation and their growth under several thermal conditions. Finally, an outlook on the future growth of research in the fabrication of nanocomposite solder is provided. PMID:27877786

  8. Influence of nanoparticle addition on the formation and growth of intermetallic compounds (IMCs) in Cu/Sn–Ag–Cu/Cu solder joint during different thermal conditions

    International Nuclear Information System (INIS)

    Ting Tan, Ai; Wen Tan, Ai; Yusof, Farazila

    2015-01-01

    Nanocomposite lead-free solders are gaining prominence as replacements for conventional lead-free solders such as Sn–Ag–Cu solder in the electronic packaging industry. They are fabricated by adding nanoparticles such as metallic and ceramic particles into conventional lead-free solder. It is reported that the addition of such nanoparticles could strengthen the solder matrix, refine the intermetallic compounds (IMCs) formed and suppress the growth of IMCs when the joint is subjected to different thermal conditions such as thermal aging and thermal cycling. In this paper, we first review the fundamental studies on the formation and growth of IMCs in lead-free solder joints. Subsequently, we discuss the effect of the addition of nanoparticles on IMC formation and their growth under several thermal conditions. Finally, an outlook on the future growth of research in the fabrication of nanocomposite solder is provided. (review)

  9. Using rule-based machine learning for candidate disease gene prioritization and sample classification of cancer gene expression data.

    Directory of Open Access Journals (Sweden)

    Enrico Glaab

    Full Text Available Microarray data analysis has been shown to provide an effective tool for studying cancer and genetic diseases. Although classical machine learning techniques have successfully been applied to find informative genes and to predict class labels for new samples, common restrictions of microarray analysis such as small sample sizes, a large attribute space and high noise levels still limit its scientific and clinical applications. Increasing the interpretability of prediction models while retaining a high accuracy would help to exploit the information content in microarray data more effectively. For this purpose, we evaluate our rule-based evolutionary machine learning systems, BioHEL and GAssist, on three public microarray cancer datasets, obtaining simple rule-based models for sample classification. A comparison with other benchmark microarray sample classifiers based on three diverse feature selection algorithms suggests that these evolutionary learning techniques can compete with state-of-the-art methods like support vector machines. The obtained models reach accuracies above 90% in two-level external cross-validation, with the added value of facilitating interpretation by using only combinations of simple if-then-else rules. As a further benefit, a literature mining analysis reveals that prioritizations of informative genes extracted from BioHEL's classification rule sets can outperform gene rankings obtained from a conventional ensemble feature selection in terms of the pointwise mutual information between relevant disease terms and the standardized names of top-ranked genes.

  10. Using rule-based machine learning for candidate disease gene prioritization and sample classification of cancer gene expression data.

    Science.gov (United States)

    Glaab, Enrico; Bacardit, Jaume; Garibaldi, Jonathan M; Krasnogor, Natalio

    2012-01-01

    Microarray data analysis has been shown to provide an effective tool for studying cancer and genetic diseases. Although classical machine learning techniques have successfully been applied to find informative genes and to predict class labels for new samples, common restrictions of microarray analysis such as small sample sizes, a large attribute space and high noise levels still limit its scientific and clinical applications. Increasing the interpretability of prediction models while retaining a high accuracy would help to exploit the information content in microarray data more effectively. For this purpose, we evaluate our rule-based evolutionary machine learning systems, BioHEL and GAssist, on three public microarray cancer datasets, obtaining simple rule-based models for sample classification. A comparison with other benchmark microarray sample classifiers based on three diverse feature selection algorithms suggests that these evolutionary learning techniques can compete with state-of-the-art methods like support vector machines. The obtained models reach accuracies above 90% in two-level external cross-validation, with the added value of facilitating interpretation by using only combinations of simple if-then-else rules. As a further benefit, a literature mining analysis reveals that prioritizations of informative genes extracted from BioHEL's classification rule sets can outperform gene rankings obtained from a conventional ensemble feature selection in terms of the pointwise mutual information between relevant disease terms and the standardized names of top-ranked genes.

  11. Improving the quality of biomarker candidates in untargeted metabolomics via peak table-based alignment of comprehensive two-dimensional gas chromatography-mass spectrometry data

    Science.gov (United States)

    Bean, Heather D.; Hill, Jane E.; Dimandja, Jean-Marie D.

    2015-01-01

    The potential of high-resolution analytical technologies like GC×GC/TOF MS in untargeted metabolomics and biomarker discovery has been limited by the development of fully automated software that can efficiently align and extract information from multiple chromatographic data sets. In this work we report the first investigation on a peak-by-peak basis of the chromatographic factors that impact GC×GC data alignment. A representative set of 16 compounds of different chromatographic characteristics were followed through the alignment of 63 GC×GC chromatograms. We found that varying the mass spectral match parameter had a significant influence on the alignment for poorly- resolved peaks, especially those at the extremes of the detector linear range, and no influence on well- chromatographed peaks. Therefore, optimized chromatography is required for proper GC×GC data alignment. Based on these observations, a workflow is presented for the conservative selection of biomarker candidates from untargeted metabolomics analyses. PMID:25857541

  12. Tensor decomposition-based unsupervised feature extraction identifies candidate genes that induce post-traumatic stress disorder-mediated heart diseases.

    Science.gov (United States)

    Taguchi, Y-H

    2017-12-21

    Although post-traumatic stress disorder (PTSD) is primarily a mental disorder, it can cause additional symptoms that do not seem to be directly related to the central nervous system, which PTSD is assumed to directly affect. PTSD-mediated heart diseases are some of such secondary disorders. In spite of the significant correlations between PTSD and heart diseases, spatial separation between the heart and brain (where PTSD is primarily active) prevents researchers from elucidating the mechanisms that bridge the two disorders. Our purpose was to identify genes linking PTSD and heart diseases. In this study, gene expression profiles of various murine tissues observed under various types of stress or without stress were analyzed in an integrated manner using tensor decomposition (TD). Based upon the obtained features, ∼ 400 genes were identified as candidate genes that may mediate heart diseases associated with PTSD. Various gene enrichment analyses supported biological reliability of the identified genes. Ten genes encoding protein-, DNA-, or mRNA-interacting proteins-ILF2, ILF3, ESR1, ESR2, RAD21, HTT, ATF2, NR3C1, TP53, and TP63-were found to be likely to regulate expression of most of these ∼ 400 genes and therefore are candidate primary genes that cause PTSD-mediated heart diseases. Approximately 400 genes in the heart were also found to be strongly affected by various drugs whose known adverse effects are related to heart diseases and/or fear memory conditioning; these data support the reliability of our findings. TD-based unsupervised feature extraction turned out to be a useful method for gene selection and successfully identified possible genes causing PTSD-mediated heart diseases.

  13. Microstructural evolution and tensile properties of Sn-Ag-Cu mixed with Sn-Pb solder alloys

    Energy Technology Data Exchange (ETDEWEB)

    Wang Fengjiang [Department of Materials Science and Engineering and Materials Research Center, Missouri University of Science and Technology, Rolla, MO 65401 (United States); O' Keefe, Matthew [Department of Materials Science and Engineering and Materials Research Center, Missouri University of Science and Technology, Rolla, MO 65401 (United States)], E-mail: mjokeefe@mst.edu; Brinkmeyer, Brandon [Department of Materials Science and Engineering and Materials Research Center, Missouri University of Science and Technology, Rolla, MO 65401 (United States)

    2009-05-27

    The effect of incorporating eutectic Sn-Pb solder with Sn-3.0Ag-0.5Cu (SAC) Pb-free solder on the microstructure and tensile properties of the mixed alloys was investigated. Alloys containing 100, 75, 50, 25, 20, 15, 10, 5 and 0 wt% SAC, with the balance being Sn-37Pb eutectic solder alloy, were prepared and characterized. Optical and scanning electron microscopy were used to analyze the microstructures while 'mini-tensile' test specimens were fabricated and tested to determine mechanical properties at the mm length scale, more closely matching that of the solder joints. Microstructural analysis indicated that a Pb-rich phase formed and was uniformly distributed at the boundary between the Sn-rich grains or between the Sn-rich and the intermetallic compounds in the solder. Tensile results showed that mixing of the alloys resulted in an increase in both the yield and the ultimate tensile strength compared to the original solders, with the 50% SAC-50% Sn-Pb mixture having the highest measured strength. Initial investigations indicate the formation and distribution of a Pb-rich phase in the mixed solder alloys as the source of the strengthening mechanism.

  14. Psychological consideration in patients with cerebral gliomas candidates for intra-operative radiation therapy based on tumor location.

    Science.gov (United States)

    Seddighi, Afsoun; Akbari, Mohammad Esmaeil; Seddighi, Amir Saied; Nikouei, Amir

    2017-01-01

    Intra-operative Radiation Therapy (IORT) is gaining popularity as an adjuvant option to surgical resection, in treatment of glioblastoma multiforme (GBM) for increasing survival rate, which a highly aggressive cerebral tumor with poor prognosis. Τhe authors plan to investigate the effects of IORT combined with surgical resection on the psychological status of these patients based on tumor location. From December 2013 to February 2017, we have enrolled 109 patients with high grade cerebral gliomas, documented by Magnetic Resonance Spectroscopy (MRS). Patients with previous history of brain surgery or radiation, altered mental status and psychological content and patients diagnosed with metastases were excluded. Demographic data, tumor volume based on pre-operative Magnetic Resonance Imaging (MRI) and psychological status were recorded based on Diagnostic and Statistical Manual of Mental Disorders, Fourth Edition (DSM-IV) criteria. The remaining 56 patients, were equally randomized into conventional (surgical resection-group A), and trial (surgical resection with IORT-group B) who underwent IORT using the 50kV INTRABEAM® system (Carl Zeiss Meditec AG, Germany). Psychological profiles of both groups were re-evaluated in the 3 rd post-operative month. Group A consisted of 18 males and 10 females with mean age of 54.4 years, while group B consisted of 16 males and 12 females with mean age of 57.8 years. Tumor volumetry revealed mean 81.52cc and 82.8cc for group A and B respectively. (P value 0.14) Patients were classified based on glioma location on pre-operative MRI: a) left parietal lobe (6 in group A, 5 in group B); b) left temporal lobe (7 in group A, 5 in group B); c) right parietal lobe (5 in group A, 6 in group B); d) left fronto-temporal lobe (4 in group A, 6 in group B); e) left parieto-temporal lobe (4 in group A, 5 in group B); and, f) right frontal lobe (2 in group A, 1 in group B). Group B received mean 8.05 Gy radiation for mean 11.2 minutes. Post

  15. The thermodynamic database COST MP0602 for materials for high-temperature lead-free soldering

    Czech Academy of Sciences Publication Activity Database

    Kroupa, Aleš; Dinsdale, A.; Watson, A.; Vřešťál, J.; Zemanová, Adéla; Brož, P.

    2012-01-01

    Roč. 48, č. 3 (2012), s. 339-346 ISSN 1450-5339 R&D Projects: GA MŠk LD11024 Institutional support: RVO:68081723 Keywords : CALPHAD method * lead-free solders * thermodynamic database Subject RIV: BJ - Thermodynamics Impact factor: 1.435, year: 2012

  16. Circuit reliability boosted by soldering pins of disconnect plugs to sockets

    Science.gov (United States)

    Pierce, W. B.

    1964-01-01

    Where disconnect pins must be used for wiring and testing a circuit, improved system reliability is obtained by making a permanent joint between pins and sockets of the disconnect plug. After the circuit has been tested, contact points may be fused through soldering, brazing, or welding.

  17. Maintaining Low Voiding Solder Die Attach for Power Die While Minimizing Die Tilt

    Energy Technology Data Exchange (ETDEWEB)

    Hamm, Randy; Peterson, Kenneth A.

    2015-10-01

    This paper addresses work to minimize voiding and die tilt in solder attachment of a large power die, measuring 9.0 mm X 6.5 mm X 0.1 mm (0.354” x 0.256” x 0.004”), to a heat spreader. As demands for larger high power die continue, minimizing voiding and die tilt is of interest for improved die functionality, yield, manufacturability, and reliability. High-power die generate considerable heat, which is important to dissipate effectively through control of voiding under high thermal load areas of the die while maintaining a consistent bondline (minimizing die tilt). Voiding was measured using acoustic imaging and die tilt was measured using two different optical measurement systems. 80Au-20Sn solder reflow was achieved using a batch vacuum solder system with optimized fixturing. Minimizing die tilt proved to be the more difficult of the two product requirements to meet. Process development variables included tooling, weight and solder preform thickness.

  18. Fatigue damage modeling in solder interconnects using a cohesive zone approach

    NARCIS (Netherlands)

    Abdul-Baqi, A.J.J.; Schreurs, P.J.G.; Geers, M.G.D.

    2005-01-01

    The objective of this work is to model the fatigue damage process in a solder bump subjected to cyclic loading conditions. Fatigue damage is simulated using the cohesive zone methodology. Damage is assumed to occur at interfaces modeled through cohesive zones in the material, while the bulk material

  19. Electrochemical migration of lead-free solder alloys in Na2SO4 environment

    DEFF Research Database (Denmark)

    Medgyes, Balint; Ádám, Sándor; Tar, Lajos

    2017-01-01

    The effect of sulphate ion concentration on electrochemical migration of lead-free solder alloys was investigated with the use of water drop tests, by applying an in-situ optical and electrical inspection system. According to the Mean-Time-To-Failure (MTTF) values it was found that in the case of...

  20. Characterizing performances of solder paste printing process at flexible manufacturing lines

    International Nuclear Information System (INIS)

    Siew, Jit Ping; Low, Heng Chin; Teoh, Ping Chow

    2015-01-01

    Solder paste printing (SPP) has been a challenge on printed circuit board (PCB) manufacturing, evident by the proliferation of solder paste inspection equipment, or substituted by rigorous non-value added activity of manual inspections. The objective of this study is to characterize the SPP performance of various products manufactured in flexible production lines with different equipment configurations, and determine areas for process improvement. The study began by collecting information on SPP performance relative to component placement (CP) process, and to the proportion of mixed products. Using a clustering algorithm to group similar elements together, SPP performance across all product-production line pairs are statistically modeled to discover the trend and the influential factors. The main findings are: (a) Ratio of overall dpku for CP and SPP processes are 2:1; (b) logistic regression models of SPP performance indicated that only effects of product-production line and solder paste printer configuration are significant; (c) PCB circuitry design with BGA components and single solder paste printer line configurations generated the highest monthly defects, with the highest variation in the latter

  1. Characterizing performances of solder paste printing process at flexible manufacturing lines

    Energy Technology Data Exchange (ETDEWEB)

    Siew, Jit Ping; Low, Heng Chin [University of Science Malaysia, 11800 Minden, Penang (Malaysia); Teoh, Ping Chow [Wawasan Open University, 54 Jalan Sultan Ahmad Shah, 10050 Penang (Malaysia)

    2015-02-03

    Solder paste printing (SPP) has been a challenge on printed circuit board (PCB) manufacturing, evident by the proliferation of solder paste inspection equipment, or substituted by rigorous non-value added activity of manual inspections. The objective of this study is to characterize the SPP performance of various products manufactured in flexible production lines with different equipment configurations, and determine areas for process improvement. The study began by collecting information on SPP performance relative to component placement (CP) process, and to the proportion of mixed products. Using a clustering algorithm to group similar elements together, SPP performance across all product-production line pairs are statistically modeled to discover the trend and the influential factors. The main findings are: (a) Ratio of overall dpku for CP and SPP processes are 2:1; (b) logistic regression models of SPP performance indicated that only effects of product-production line and solder paste printer configuration are significant; (c) PCB circuitry design with BGA components and single solder paste printer line configurations generated the highest monthly defects, with the highest variation in the latter.

  2. Looking for New Polycrystalline MC-Reinforced Cobalt-Based Superalloys Candidate to Applications at 1200°C

    Directory of Open Access Journals (Sweden)

    Patrice Berthod

    2017-01-01

    Full Text Available For applications for which temperatures higher than 1150°C can be encountered the currently best superalloys, the γ/γ′ single crystals, cannot be used under stress because of the disappearance of their reinforcing γ′ precipitates at such temperatures which are higher than their solvus. Cobalt-based alloys strengthened by refractory and highly stable carbides may represent an alternative solution. In this work the interest was focused on MC carbides of several types. Alloys were elaborated with atomically equivalent quantities in M element (among Ti, Ta, Nb, Hf, or Zr and in C. Script-like eutectic TiC, TaC, NbC, HfC, and ZrC carbides were successfully obtained in the interdendritic spaces. Unfortunately, only one type, HfC, demonstrated high morphological stability during about 50 hours at 1200°C. The concerned alloy, of the Co-25Cr-0.5C-7.4Hf type (in wt.%, was further characterized in flexural creep resistance and air-oxidation resistance at the same temperature. The creep behaviour was very good, notably by comparison with a more classical Co-25Cr-0.5C-7.5Ta alloy, proving that the interest of HfC is higher than the TaC one. In contrast the oxidation by air was faster and its behaviour not really chromia-forming. Significant improvements of this chemical resistance are expected before taking benefit from the mechanical superiority of this alloy.

  3. Quasar Photometric Redshifts and Candidate Selection: A New Algorithm Based on Optical and Mid-infrared Photometric Data

    Science.gov (United States)

    Yang, Qian; Wu, Xue-Bing; Fan, Xiaohui; Jiang, Linhua; McGreer, Ian; Green, Richard; Yang, Jinyi; Schindler, Jan-Torge; Wang, Feige; Zuo, Wenwen; Fu, Yuming

    2017-12-01

    We present a new algorithm to estimate quasar photometric redshifts (photo-zs), by considering the asymmetries in the relative flux distributions of quasars. The relative flux models are built with multivariate Skew-t distributions in the multidimensional space of relative fluxes as a function of redshift and magnitude. For 151,392 quasars in the SDSS, we achieve a photo-z accuracy, defined as the fraction of quasars with the difference between the photo-z z p and the spectroscopic redshift z s , | {{Δ }}z| =| {z}s-{z}p| /(1+{z}s) within 0.1, of 74%. Combining the WISE W1 and W2 infrared data with the SDSS data, the photo-z accuracy is enhanced to 87%. Using the Pan-STARRS1 or DECaLS photometry with WISE W1 and W2 data, the photo-z accuracies are 79% and 72%, respectively. The prior probabilities as a function of magnitude for quasars, stars, and galaxies are calculated, respectively, based on (1) the quasar luminosity function, (2) the Milky Way synthetic simulation with the Besançon model, and (3) the Bayesian Galaxy Photometric Redshift estimation. The relative fluxes of stars are obtained with the Padova isochrones, and the relative fluxes of galaxies are modeled through galaxy templates. We test our classification method to select quasars using the DECaLS g, r, z, and WISE W1 and W2 photometry. The quasar selection completeness is higher than 70% for a wide redshift range 0.5publicly available.

  4. Candidate genes and pathogenesis investigation for sepsis-related acute respiratory distress syndrome based on gene expression profile.

    Science.gov (United States)

    Wang, Min; Yan, Jingjun; He, Xingxing; Zhong, Qiang; Zhan, Chengye; Li, Shusheng

    2016-04-18

    Acute respiratory distress syndrome (ARDS) is a potentially devastating form of acute inflammatory lung injury as well as a major cause of acute respiratory failure. Although researchers have made significant progresses in elucidating the pathophysiology of this complex syndrome over the years, the absence of a universal detail disease mechanism up until now has led to a series of practical problems for a definitive treatment. This study aimed to predict some genes or pathways associated with sepsis-related ARDS based on a public microarray dataset and to further explore the molecular mechanism of ARDS. A total of 122 up-regulated DEGs and 91 down-regulated differentially expressed genes (DEGs) were obtained. The up- and down-regulated DEGs were mainly involved in functions like mitotic cell cycle and pathway like cell cycle. Protein-protein interaction network of ARDS analysis revealed 20 hub genes including cyclin B1 (CCNB1), cyclin B2 (CCNB2) and topoisomerase II alpha (TOP2A). A total of seven transcription factors including forkhead box protein M1 (FOXM1) and 30 target genes were revealed in the transcription factor-target gene regulation network. Furthermore, co-cited genes including CCNB2-CCNB1 were revealed in literature mining for the relations ARDS related genes. Pathways like mitotic cell cycle were closed related with the development of ARDS. Genes including CCNB1, CCNB2 and TOP2A, as well as transcription factors like FOXM1 might be used as the novel gene therapy targets for sepsis related ARDS.

  5. Hypospadias repair using laser tissue soldering (LTS): preliminary results of a prospective randomized study

    Science.gov (United States)

    Kirsch, Andrew J.; Cooper, Christopher S.; Canning, Douglas A.; Snyder, Howard M., III; Zderic, Stephen A.

    1998-07-01

    Purpose: The purpose of this study was to evaluate laser tissue soldering using an 808 nm diode laser and wavelength- matched human albumin solder for urethral surgery in children. Methods: Currently, 30 boys, ages 3 months to 8 years were randomized to standard suturing (n equals 22) or 'sutureless' laser hypospadias repair (n equals 18). Laser soldering was performed with a human albumin solder doped with indocyanine green dye (2.5 mg/ml) using a laser power output of 0.5 W, pulse duration of 0.5 sec, and interval of 0.1 sec. Power density was approximately 16 W/cm2. In the laser group, sutures were used for tissue alignment only. At the time of surgery, neourethral and penile lengths, operative time for urethral repair, and number of sutures/throws were measured. Postoperatively, patients were examined for complications of wound healing, stricture, or fistula formation. Results: Mean age, severity of urethral defect, type of repair, and neourethra length were equivalent between the two groups. Operative time was significantly faster for laser soldering in both simple (1.6 plus or minus 0.21 min, p less than 0.001) and complex (5.4 plus or minus 0.28 min, p less than 0.0001) hypospadias repairs compared to controls (10.6 plus or minus 1.4 min and 27.8 plus or minus 2.9 min, respectively). The mean number of sutures used in the laser group for simple and complex repairs (3.3 plus or minus 0.3 and 8.1 plus or minus 0.64, respectively) were significantly (p less than 0.0001) less than for controls (8.2 plus or minus 0.84 and 20 plus or minus 2.3, respectively). Followup was between 3 months and 14 months. The overall complication rate in the laser group (11%) was lower than the controls (23%). However, statistical significance (p less than 0.05) was achieved only for the subgroup of patients undergoing simple repairs (LTS, 100% success versus suturing, 69% success). Conclusions: These preliminary results indicate that laser tissue soldering for hypospadias repair

  6. Practical considerations of linear accelerator-based frameless extracranial radiosurgery for treatment of occipital neuralgia for nonsurgical candidates.

    Science.gov (United States)

    Denton, Travis R; Shields, Lisa B E; Howe, Jonathan N; Shanks, Todd S; Spalding, Aaron C

    2017-07-01

    Occipital neuralgia generally responds to medical or invasive procedures. Repeated invasive procedures generate increasing complications and are often contraindicated. Stereotactic radiosurgery (SRS) has not been reported as a treatment option largely due to the extracranial nature of the target as opposed to the similar, more established trigeminal neuralgia. A dedicated phantom study was conducted to determine the optimum imaging studies, fusion matrices, and treatment planning parameters to target the C2 dorsal root ganglion which forms the occipital nerve. The conditions created from the phantom were applied to a patient with medically and surgically refractory occipital neuralgia. A dose of 80 Gy in one fraction was prescribed to the C2 occipital dorsal root ganglion. The phantom study resulted in a treatment achieved with an average translational magnitude of correction of 1.35 mm with an acceptable tolerance of 0.5 mm and an average rotational magnitude of correction of 0.4° with an acceptable tolerance of 1.0°. For the patient, the spinal cord was 12.0 mm at its closest distance to the isocenter and received a maximum dose of 3.36 Gy, a dose to 0.35 cc of 1.84 Gy, and a dose to 1.2 cc of 0.79 Gy. The brain maximum dose was 2.20 Gy. Treatment time was 59 min for 18, 323 MUs. Imaging was performed prior to each arc delivery resulting in 21 imaging sessions. The average deviation magnitude requiring a positional or rotational correction was 0.96 ± 0.25 mm, 0.8 ± 0.41°, whereas the average deviation magnitude deemed within tolerance was 0.41 ± 0.12 mm, 0.57 ± 0.28°. Dedicated quality assurance of the treatment planning and delivery is necessary for safe and accurate SRS to the cervical spine dorsal root ganglion. With additional prospective study, linear accelerator-based frameless radiosurgery can provide an accurate, noninvasive alternative for treating occipital neuralgia where an invasive procedure is contraindicated. © 2017

  7. Decomposition of no-clean solder flux systems and their effects on the corrosion reliability of electronics

    DEFF Research Database (Denmark)

    Conseil, Helene; Verdingovas, Vadimas; Jellesen, Morten Stendahl

    2016-01-01

    No-clean flux systems are used today for the soldering of electronic printed circuit board assemblies assuming that all the aggressive substances of the flux will vanish during the soldering process i.e. evaporate, decompose or being enclosed safely in the residues. However this is not true in most...... that the fluxes do not decompose fully within the temperature regime of the soldering process, leaving behind significant level of weak organic acid residues. The residue depending on the type and amount can be can be very aggressive towards the corrosion on the printed circuit board assemblies. The glutaric acid...

  8. Conservation and diversity of influenza A H1N1 HLA-restricted T cell epitope candidates for epitope-based vaccines.

    Directory of Open Access Journals (Sweden)

    Paul Thiamjoo Tan

    2010-01-01

    Full Text Available The immune-related evolution of influenza viruses is exceedingly complex and current vaccines against influenza must be reformulated for each influenza season because of the high degree of antigenic drift among circulating influenza strains. Delay in vaccine production is a serious problem in responding to a pandemic situation, such as that of the current H1N1 strain. Immune escape is generally attributed to reduced antibody recognition of the viral hemagglutinin and neuraminidase proteins whose rate of mutation is much greater than that of the internal non-structural proteins. As a possible alternative, vaccines directed at T cell epitope domains of internal influenza proteins, that are less susceptible to antigenic variation, have been investigated.HLA transgenic mouse strains expressing HLA class I A*0201, A*2402, and B*0702, and class II DRB1*1501, DRB1*0301 and DRB1*0401 were immunized with 196 influenza H1N1 peptides that contained residues of highly conserved proteome sequences of the human H1N1, H3N2, H1N2, H5N1, and avian influenza A strains. Fifty-four (54 peptides that elicited 63 HLA-restricted peptide-specific T cell epitope responses were identified by IFN-gamma ELISpot assay. The 54 peptides were compared to the 2007-2009 human H1N1 sequences for selection of sequences in the design of a new candidate H1N1 vaccine, specifically targeted to highly-conserved HLA-restricted T cell epitopes.Seventeen (17 T cell epitopes in PB1, PB2, and M1 were selected as vaccine targets based on sequence conservation over the past 30 years, high functional avidity, non-identity to human peptides, clustered localization, and promiscuity to multiple HLA alleles. These candidate vaccine antigen sequences may be applicable to any avian or human influenza A virus.

  9. High-yield production of a stable Vero cell-based vaccine candidate against the highly pathogenic avian influenza virus H5N1

    International Nuclear Information System (INIS)

    Zhou, Fangye; Zhou, Jian; Ma, Lei; Song, Shaohui; Zhang, Xinwen; Li, Weidong; Jiang, Shude; Wang, Yue; Liao, Guoyang

    2012-01-01

    Highlights: ► Vero cell-based HPAI H5N1 vaccine with stable high yield. ► Stable high yield derived from the YNVa H3N2 backbone. ► H5N1/YNVa has a similar safety and immunogenicity to H5N1delta. -- Abstract: Highly pathogenic avian influenza (HPAI) viruses pose a global pandemic threat, for which rapid large-scale vaccine production technology is critical for prevention and control. Because chickens are highly susceptible to HPAI viruses, the supply of chicken embryos for vaccine production might be depleted during a virus outbreak. Therefore, developing HPAI virus vaccines using other technologies is critical. Meeting vaccine demand using the Vero cell-based fermentation process has been hindered by low stability and yield. In this study, a Vero cell-based HPAI H5N1 vaccine candidate (H5N1/YNVa) with stable high yield was achieved by reassortment of the Vero-adapted (Va) high growth A/Yunnan/1/2005(H3N2) (YNVa) virus with the A/Anhui/1/2005(H5N1) attenuated influenza vaccine strain (H5N1delta) using the 6/2 method. The reassorted H5N1/YNVa vaccine maintained a high hemagglutination (HA) titer of 1024. Furthermore, H5N1/YNVa displayed low pathogenicity and uniform immunogenicity compared to that of the parent virus.

  10. New Ablation-Resistant Material Candidate for Hypersonic Applications: Synthesis, Composition, and Oxidation Resistance of HfIr3-Based Solid Solution.

    Science.gov (United States)

    Lozanov, Victor V; Baklanova, Natalya I; Bulina, Natalia V; Titov, Anatoly T

    2018-04-18

    The peculiarities of the solid-state interaction in the HfC-Ir system have been studied within the 1000-1600 °C temperature range using a set of modern analytical techniques. It was stated that the interaction of HfC with iridium becomes noticeable at temperatures as low as 1000-1100 °C and results in the formation of HfIr 3 -based substitutional solid solution. The homogeneity range of the HfIr 3± x phase was evaluated and refined as HfIr 2.43 -HfIr 3.36 . The durability of the HfIr 3 -based system under extreme environmental conditions was studied. It was shown that the HfIr 3 -based material displays excellent ablation resistance under extreme environmental conditions. The benefits of the new designed material result from its relative oxygen impermeability and special microstructure similar to superalloys. The results obtained in this work allow us to consider HfIr 3 as a very promising candidate for extreme applications.

  11. High-yield production of a stable Vero cell-based vaccine candidate against the highly pathogenic avian influenza virus H5N1

    Energy Technology Data Exchange (ETDEWEB)

    Zhou, Fangye; Zhou, Jian; Ma, Lei; Song, Shaohui; Zhang, Xinwen; Li, Weidong; Jiang, Shude [No. 5, Department of Bioproducts, Institute of Medical Biology, Chinese Academy of Medical Science and Pecking Union Medical College, Jiaoling Avenue 935, Kunming, Yunnan Province 650102, People' s Republic of China (China); Wang, Yue [National Institute for Viral Disease Control and Prevention, China Center for Disease Control and Prevention, Yingxin Lane 100, Xicheng District, Beijing 100052, People' s Republic of China (China); Liao, Guoyang [No. 5, Department of Bioproducts, Institute of Medical Biology, Chinese Academy of Medical Science and Pecking Union Medical College, Jiaoling Avenue 935, Kunming, Yunnan Province 650102, People' s Republic of China (China)

    2012-05-18

    Highlights: Black-Right-Pointing-Pointer Vero cell-based HPAI H5N1 vaccine with stable high yield. Black-Right-Pointing-Pointer Stable high yield derived from the YNVa H3N2 backbone. Black-Right-Pointing-Pointer H5N1/YNVa has a similar safety and immunogenicity to H5N1delta. -- Abstract: Highly pathogenic avian influenza (HPAI) viruses pose a global pandemic threat, for which rapid large-scale vaccine production technology is critical for prevention and control. Because chickens are highly susceptible to HPAI viruses, the supply of chicken embryos for vaccine production might be depleted during a virus outbreak. Therefore, developing HPAI virus vaccines using other technologies is critical. Meeting vaccine demand using the Vero cell-based fermentation process has been hindered by low stability and yield. In this study, a Vero cell-based HPAI H5N1 vaccine candidate (H5N1/YNVa) with stable high yield was achieved by reassortment of the Vero-adapted (Va) high growth A/Yunnan/1/2005(H3N2) (YNVa) virus with the A/Anhui/1/2005(H5N1) attenuated influenza vaccine strain (H5N1delta) using the 6/2 method. The reassorted H5N1/YNVa vaccine maintained a high hemagglutination (HA) titer of 1024. Furthermore, H5N1/YNVa displayed low pathogenicity and uniform immunogenicity compared to that of the parent virus.

  12. Laser solder welding of articular cartilage: tensile strength and chondrocyte viability.

    Science.gov (United States)

    Züger, B J; Ott, B; Mainil-Varlet, P; Schaffner, T; Clémence, J F; Weber, H P; Frenz, M

    2001-01-01

    The surgical treatment of full-thickness cartilage defects in the knee joint remains a therapeutic challenge. Recently, new techniques for articular cartilage transplantation, such as mosaicplasty, have become available for cartilage repair. The long-term success of these techniques, however, depends not only on the chondrocyte viability but also on a lateral integration of the implant. The goal of this study was to evaluate the feasibility of cartilage welding by using albumin solder that was dye-enhanced to allow coagulation with 808-nm laser diode irradiation. Conventional histology of light microscopy was compared with a viability staining to precisely determine the extent of thermal damage after laser welding. Indocyanine green (ICG) enhanced albumin solder (25% albumin, 0.5% HA, 0.1% ICG) was used for articular cartilage welding. For coagulation, the solder was irradiated through the cartilage implant by 808-nm laser light and the tensile strength of the weld was measured. Viability staining revealed a thermal damage of typically 500 m in depth at an irradiance of approximately 10 W/cm(2) for 8 seconds, whereas conventional histologies showed only half of the extent found by the viability test. Heat-bath investigations revealed a threshold temperature of minimum 54 degrees C for thermal damage of chondrocytes. Efficient cartilage bonding was obtained by using bovine albumin solder as adhesive. Maximum tensile strength of more than 10 N/cm(2) was achieved. Viability tests revealed that the thermal damage is much greater (up to twice) than expected after light microscopic characterization. This study shows the feasibility to strongly laser weld cartilage on cartilage by use of a dye-enhanced albumin solder. Possibilities to reduce the range of damage are suggested. Copyright 2001 Wiley-Liss, Inc.

  13. Fluxless flip-chip bonding using a lead-free solder bumping technique

    Science.gov (United States)

    Hansen, K.; Kousar, S.; Pitzl, D.; Arab, S.

    2017-09-01

    With the LHC exceeding the nominal instantaneous luminosity, the current barrel pixel detector (BPIX) of the CMS experiment at CERN will reach its performance limits and undergo significant radiation damage. In order to improve detector performance in high luminosity conditions, the entire BPIX is replaced with an upgraded version containing an additional detection layer. Half of the modules comprising this additional layer are produced at DESY using fluxless and lead-free bumping and bonding techniques. Sequential solder-jetting technique is utilized to wet 40-μm SAC305 solder spheres on the silicon-sensor pads with electroless Ni, Pd and immersion Au (ENEPIG) under-bump metallization (UBM). The bumped sensors are flip-chip assembled with readout chips (ROCs) and then reflowed using a flux-less bonding facility. The challenges for jetting low solder volume have been analyzed and will be presented in this paper. An average speed of 3.4 balls per second is obtained to jet about 67 thousand solder balls on a single chip. On average, 7 modules have been produced per week. The bump-bond quality is evaluated in terms of electrical and mechanical properties. The peak-bump resistance is about 17.5 mΩ. The cross-section study revealed different types of intermetallic compounds (IMC) as a result of interfacial reactions between UBM and solder material. The effect of crystalline phases on the mechanical properties of the joint is discussed. The mean shear strength per bump after the final module reflow is about 16 cN. The results and sources of yield loss of module production are reported. The achieved yield is 95%.

  14. Thermal Fatigue Evaluation of Pb-Free Solder Joints: Results, Lessons Learned, and Future Trends

    Science.gov (United States)

    Coyle, Richard J.; Sweatman, Keith; Arfaei, Babak

    2015-09-01

    Thermal fatigue is a major source of failure of solder joints in surface mount electronic components and it is critically important in high reliability applications such as telecommunication, military, and aeronautics. The electronic packaging industry has seen an increase in the number of Pb-free solder alloy choices beyond the common near-eutectic Sn-Ag-Cu alloys first established as replacements for eutectic SnPb. This paper discusses the results from Pb-free solder joint reliability programs sponsored by two industry consortia. The characteristic life in accelerated thermal cycling is reported for 12 different Pb-free solder alloys and a SnPb control in 9 different accelerated thermal cycling test profiles in terms of the effects of component type, accelerated thermal cycling profile and dwell time. Microstructural analysis on assembled and failed samples was performed to investigate the effect of initial microstructure and its evolution during accelerated thermal cycling test. A significant finding from the study is that the beneficial effect of Ag on accelerated thermal cycling reliability (measured by characteristic lifetime) diminishes as the severity of the accelerated thermal cycling, defined by greater ΔT, higher peak temperature, and longer dwell time increases. The results also indicate that all the Pb-free solders are more reliable in accelerated thermal cycling than the SnPb alloy they have replaced. Suggestions are made for future work, particularly with respect to the continued evolution of alloy development for emerging application requirements and the value of using advanced analytical methods to provide a better understanding of the effect of microstructure and its evolution on accelerated thermal cycling performance.

  15. Subgrain Rotation Behavior in Sn3.0Ag0.5Cu-Sn37Pb Solder Joints During Thermal Shock

    Science.gov (United States)

    Han, Jing; Tan, Shihai; Guo, Fu

    2018-01-01

    Ball grid array (BGA) samples were soldered on a printed circuit board with Sn37Pb solder paste to investigate the recrystallization induced by subgrain rotation during thermal shock. The composition of the solder balls was Sn3.0Ag0.5Cu-Sn37Pb, which comprised mixed solder joints. The BGA component was cross-sectioned before thermal shock. The microstructure and grain orientations were obtained by a scanning electron microscope equipped with an electron back-scattered diffraction system. Two mixed solder joints at corners of the BGA component were selected as the subjects. The results showed that recrystallization occurred at the corner of the solder joints after 200 thermal shock cycles. The recrystallized subgrains had various new grain orientations. The newly generated grain orientations were closely related to the initial grain orientations, which indicated that different subgrain rotation behaviors could occur in one mixed solder joint with the same initial grain orientation. When the misorientation angles were very small, the rotation axes were about Sn [100], [010] and [001], as shown by analyzing the misorientation angles and subgrain rotation axes, while the subgrain rotation behavior with large misorientation angles in the solder joints was much more complicated. As Pb was contained in the solder joints and the stress was concentrated on the corner of the mixed solder joints, concaves and cracks were formed. When the adjacent recrystallized subgrains were separated, and the process of the continuous recrystallization was limited.

  16. Surface Morphology Study of Nanostructured Lead-Free Solder Alloy Sn-Ag-Cu Developed by Electrodeposition: Effect of Current Density Investigation

    Directory of Open Access Journals (Sweden)

    Sakinah Mohd Yusof

    2013-10-01

    Full Text Available Normal 0 false false false IN X-NONE X-NONE MicrosoftInternetExplorer4 Nanostructured lead-free solder Sn-Ag-Cu (SAC was developed by electrodeposition method at room temperature. Electrolite bath which comprised of the predetermined quantity of tin methane sulfonate, copper sulfate and silver sulfate were added sequentially to MSA solution. The methane sulphonic acid (MSA based ternary Sn-Ag-Cu bath was developed by using tin methane sulfonate as a source of Sn ions while the Cu+ and Ag+ ions were obtained from their respective sulfate salts. The rate of the electrodeposition was controlled by variation of current density. The addition of the buffer, comprising of sodium and ammonium acetate helped in raising the pH solution. During the experimental procedure, the pH of solution, composition of the electrolite bath, and the electrodeposition time were kept constant. The electrodeposited rate, deposit composition and microstructure were investigated as the effect of current density. The electrodeposited solder alloy was characterized for their morphology using Field Emission Scanning Electron Microscope (FESEM. In conclusion, vary of current density will play significant role in the surface morphology of nanostructured lead-free solder SAC developed. Normal 0 false false false IN X-NONE X-NONE MicrosoftInternetExplorer4 /* Style Definitions */ table.MsoNormalTable {mso-style-name:"Table Normal"; mso-tstyle-rowband-size:0; mso-tstyle-colband-size:0; mso-style-noshow:yes; mso-style-priority:99; mso-style-qformat:yes; mso-style-parent:""; mso-padding-alt:0cm 5.4pt 0cm 5.4pt; mso-para-margin:0cm; mso-para-margin-bottom:.0001pt; mso-pagination:widow-orphan; font-size:11.0pt; font-family:"Calibri","sans-serif"; mso-ascii-font-family:Calibri; mso-ascii-theme-font:minor-latin; mso-fareast-font-family:"Times New Roman"; mso-fareast-theme-font:minor-fareast; mso-hansi-font-family:Calibri; mso-hansi-theme-font:minor-latin; mso-bidi-font-family:"Times New

  17. The Effect of Reflow on Wettability of Sn 96.5 Ag 3 Cu 0.5 Solder

    Directory of Open Access Journals (Sweden)

    Zoltán Weltsch

    2012-11-01

    Full Text Available Surface conditions on Printed Circuit Board (PCB final finishes have an important impact on the wetting behaviour with lead-free solder. The improvement of wettability in liquid Sn 96.5 Ag 3 Cu 0.5 Solder alloy on PCB substrate was measured with a sessile drop method at 523 K temperature. Wetting properties was determined in normal atmospheric air and inert atmosphere. The wetting angles increasing with the number of reflows both atmosphere. The effect of the atmosphere has a huge importance of the oxidation which manifests itself of the measured wetting angles. One of the most important factors to the wetting properties is the amount of oxygen in the soldering atmosphere. Using the inert atmosphere is crucial to Pb-free solders, particularly after reflows.

  18. Effect of Surface Finish of Substrate on Mechanical Reliability of in-48SN Solder Joints in Moems Package

    OpenAIRE

    Koo, Ja-Myeong; Jung, Seung-Boo

    2007-01-01

    Submitted on behalf of EDA Publishing Association (http://irevues.inist.fr/handle/2042/5920); International audience; Interfacial reactions and shear properties of the In-48Sn (in wt.%) ball grid array (BGA) solder joints after bonding were investigated with four different surface finishes of the substrate over an underlying Cu pad: electroplated Ni/Au (hereafter E-NG), electroless Ni/immersion Au (hereafter ENIG), immersion Ag (hereafter I-Ag) and organic solderability preservative (hereafte...

  19. Effects of Ag addition on solid–state interfacial reactions between Sn–Ag–Cu solder and Cu substrate

    International Nuclear Information System (INIS)

    Yang, Ming; Ko, Yong-Ho; Bang, Junghwan; Kim, Taek-Soo; Lee, Chang-Woo; Li, Mingyu

    2017-01-01

    Low–Ag–content Sn–Ag–Cu (SAC) solders have attracted much recent attention in electronic packaging for their low cost. To reasonably reduce the Ag content in Pb–free solders, a deep understanding of the basic influence of Ag on the SAC solder/Cu substrate interfacial reaction is essential. Previous studies have discussed the influence of Ag on the interfacial intermetallic compound (IMC) thickness. However, because IMC growth is the joint result of multiple factors, such characterizations do not reveal the actual role of Ag. In this study, changes in interfacial IMCs after Ag introduction were systemically and quantitatively characterized in terms of coarsening behaviors, orientation evolution, and growth kinetics. The results show that Ag in the solder alloy affects the coarsening behavior, accelerates the orientation concentration, and inhibits the growth of interfacial IMCs during solid–state aging. The inhibition mechanism was quantitatively discussed considering the individual diffusion behaviors of Cu and Sn atoms, revealing that Ag inhibits interfacial IMC growth primarily by slowing the diffusion of Cu atoms through the interface. - Highlights: •Role of Ag in IMC formation during Sn–Ag–Cu soldering was investigated. •Ag affects coarsening, crystallographic orientation, and IMC growth. •Diffusion pathways of Sn and Cu are affected differently by Ag. •Ag slows Cu diffusion to inhibit IMC growth at solder/substrate interface.

  20. Effects of Ag addition on solid–state interfacial reactions between Sn–Ag–Cu solder and Cu substrate

    Energy Technology Data Exchange (ETDEWEB)

    Yang, Ming [Micro-Joining Center, Korea Institute of Industrial Technology (KITECH), Incheon 21999 (Korea, Republic of); Ko, Yong-Ho [Micro-Joining Center, Korea Institute of Industrial Technology (KITECH), Incheon 21999 (Korea, Republic of); Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology (KAIST), 291, Daehak-ro, Yuseong-gu, Daejeon 34141 (Korea, Republic of); Bang, Junghwan [Micro-Joining Center, Korea Institute of Industrial Technology (KITECH), Incheon 21999 (Korea, Republic of); Kim, Taek-Soo [Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology (KAIST), 291, Daehak-ro, Yuseong-gu, Daejeon 34141 (Korea, Republic of); Lee, Chang-Woo, E-mail: cwlee@kitech.re.kr [Micro-Joining Center, Korea Institute of Industrial Technology (KITECH), Incheon 21999 (Korea, Republic of); Li, Mingyu, E-mail: myli@hit.edu.cn [Shenzhen Key Laboratory of Advanced Materials, Harbin Institute of Technology Shenzhen Graduate School, Shenzhen 518055 (China)

    2017-02-15

    Low–Ag–content Sn–Ag–Cu (SAC) solders have attracted much recent attention in electronic packaging for their low cost. To reasonably reduce the Ag content in Pb–free solders, a deep understanding of the basic influence of Ag on the SAC solder/Cu substrate interfacial reaction is essential. Previous studies have discussed the influence of Ag on the interfacial intermetallic compound (IMC) thickness. However, because IMC growth is the joint result of multiple factors, such characterizations do not reveal the actual role of Ag. In this study, changes in interfacial IMCs after Ag introduction were systemically and quantitatively characterized in terms of coarsening behaviors, orientation evolution, and growth kinetics. The results show that Ag in the solder alloy affects the coarsening behavior, accelerates the orientation concentration, and inhibits the growth of interfacial IMCs during solid–state aging. The inhibition mechanism was quantitatively discussed considering the individual diffusion behaviors of Cu and Sn atoms, revealing that Ag inhibits interfacial IMC growth primarily by slowing the diffusion of Cu atoms through the interface. - Highlights: •Role of Ag in IMC formation during Sn–Ag–Cu soldering was investigated. •Ag affects coarsening, crystallographic orientation, and IMC growth. •Diffusion pathways of Sn and Cu are affected differently by Ag. •Ag slows Cu diffusion to inhibit IMC growth at solder/substrate interface.

  1. Improving the quality of biomarker candidates in untargeted metabolomics via peak table-based alignment of comprehensive two-dimensional gas chromatography-mass spectrometry data.

    Science.gov (United States)

    Bean, Heather D; Hill, Jane E; Dimandja, Jean-Marie D

    2015-05-15

    The potential of high-resolution analytical technologies like GC×GC/TOF MS in untargeted metabolomics and biomarker discovery has been limited by the development of fully automated software that can efficiently align and extract information from multiple chromatographic data sets. In this work we report the first investigation on a peak-by-peak basis of the chromatographic factors that impact GC×GC data alignment. A representative set of 16 compounds of different chromatographic characteristics were followed through the alignment of 63 GC×GC chromatograms. We found that varying the mass spectral match parameter had a significant influence on the alignment for poorly-resolved peaks, especially those at the extremes of the detector linear range, and no influence on well-chromatographed peaks. Therefore, optimized chromatography is required for proper GC×GC data alignment. Based on these observations, a workflow is presented for the conservative selection of biomarker candidates from untargeted metabolomics analyses. Copyright © 2015 Elsevier B.V. All rights reserved.

  2. A generalized matching law analysis of cocaine vs. food choice in rhesus monkeys: effects of candidate 'agonist-based' medications on sensitivity to reinforcement.

    Science.gov (United States)

    Hutsell, Blake A; Negus, S Stevens; Banks, Matthew L

    2015-01-01

    We have previously demonstrated reductions in cocaine choice produced by either continuous 14-day phendimetrazine and d-amphetamine treatment or removing cocaine availability under a cocaine vs. food choice procedure in rhesus monkeys. The aim of the present investigation was to apply the concatenated generalized matching law (GML) to cocaine vs. food choice dose-effect functions incorporating sensitivity to both the relative magnitude and price of each reinforcer. Our goal was to determine potential behavioral mechanisms underlying pharmacological treatment efficacy to decrease cocaine choice. A multi-model comparison approach was used to characterize dose- and time-course effects of both pharmacological and environmental manipulations on sensitivity to reinforcement. GML models provided an excellent fit of the cocaine choice dose-effect functions in individual monkeys. Reductions in cocaine choice by both pharmacological and environmental manipulations were principally produced by systematic decreases in sensitivity to reinforcer price and non-systematic changes in sensitivity to reinforcer magnitude. The modeling approach used provides a theoretical link between the experimental analysis of choice and pharmacological treatments being evaluated as candidate 'agonist-based' medications for cocaine addiction. The analysis suggests that monoamine releaser treatment efficacy to decrease cocaine choice was mediated by selectively increasing the relative price of cocaine. Overall, the net behavioral effect of these pharmacological treatments was to increase substitutability of food pellets, a nondrug reinforcer, for cocaine. Copyright © 2014 Elsevier Ireland Ltd. All rights reserved.

  3. Trans-sialidase-based vaccine candidate protects against Trypanosoma cruzi infection, not only inducing an effector immune response but also affecting cells with regulatory/suppressor phenotype

    Science.gov (United States)

    Prochetto, Estefanía; Roldán, Carolina; Bontempi, Iván A.; Bertona, Daiana; Peverengo, Luz; Vicco, Miguel H.; Rodeles, Luz M.; Pérez, Ana R.; Marcipar, Iván S.; Cabrera, Gabriel

    2017-01-01

    Prophylactic and/or therapeutic vaccines have an important potential to control Trypanosoma cruzi (T. cruzi)infection. The involvement of regulatory/suppressor immune cells after an immunization treatment and T. cruzi infection has never been addressed. Here we show that a new trans-sialidase-based immunogen (TSf) was able to confer protection, correlating not only with beneficial changes in effector immune parameters, but also influencing populations of cells related to immune control. Regarding the effector response, mice immunized with TSf showed a TS-specific antibody response, significant delayed-type hypersensitivity (DTH) reactivity and increased production of IFN-γ by CD8+ splenocytes. After a challenge with T. cruzi, TSf-immunized mice showed 90% survival and low parasitemia as compared with 40% survival and high parasitemia in PBS-immunized mice. In relation to the regulatory/suppressor arm of the immune system, after T. cruzi infection TSf-immunized mice showed an increase in spleen CD4+ Foxp3+ regulatory T cells (Treg) as compared to PBS-inoculated and infected mice. Moreover, although T. cruzi infection elicited a notable increase in myeloid derived suppressor cells (MDSC) in the spleen of PBS-inoculated mice, TSf-immunized mice showed a significantly lower increase of MDSC. Results presented herein highlight the need of studying the immune response as a whole when a vaccine candidate is rationally tested. PMID:28938533

  4. TAXONOMY AND BIOSTRATIGRAPHIC RECORD OF THE UPPER TRIASSIC CONODONTS OF THE PIZZO MONDELLO SECTION (WESTERN SICILY, ITALY, GSSP CANDIDATE FOR THE BASE OF THE NORIAN

    Directory of Open Access Journals (Sweden)

    MICHELE MAZZA

    2012-03-01

    Full Text Available New taxonomic and biostratigraphic investigations on the late Carnian to Rhaetian (Upper Triassic platform conodonts from the Pizzo Mondello section (Western Sicily, Italy, Sicano basin are here presented. Pizzo Mondello is one of the two GSSP candidates for the Carnian/Norian boundary; the section is a 430 m thick continuous succession of upper Carnian to upper Norian marine limestones (Scillato Formation, characterized by uniform facies and high sedimentation rates, and ca. 20 m of Rhaetian white calcilutites (Portella Gebbia limestone. Pizzo Mondello offers one of the most complete conodont records for this time interval in the Tethys. The conodont faunas are characterized by a large variety of species, belonging to the genera Carnepigondolella, Epigondolella, Metapolygnathus, Misikella, Mockina, Neocavitella, Norigondolella, Paragondolella, and Parvigondolella. The richness of the populations allowed a detailed revision and description of all the Upper Triassic species and morphotypes recovered. The revision of the problematic species Carnepigondolella nodosa and "Metapolygnathus communisti B" was thus possible, leading to the establishment of two new species: Carnepigondolella tuvalica n.sp. and Carnepigondolella gulloae n.sp. The latter species would be a good proxy for the Carnian/Norian boundary in the case that the FAD of Halobia austriaca (sample FNP135a will be selected as the primary biomarker for the base of the Norian. 

  5. Protection against multiple influenza A virus strains induced by candidate recombinant vaccine based on heterologous M2e peptides linked to flagellin.

    Directory of Open Access Journals (Sweden)

    Liudmila A Stepanova

    Full Text Available Matrix 2 protein ectodomain (M2e is considered a promising candidate for a broadly protective influenza vaccine. M2e-based vaccines against human influenza A provide only partial protection against avian influenza viruses because of differences in the M2e sequences. In this work, we evaluated the possibility of obtaining equal protection and immune response by using recombinant protein on the basis of flagellin as a carrier of the M2e peptides of human and avian influenza A viruses. Recombinant protein was generated by the fusion of two tandem copies of consensus M2e sequence from human influenza A and two copies of M2e from avian A/H5N1 viruses to flagellin (Flg-2M2eh2M2ek. Intranasal immunisation of Balb/c mice with recombinant protein significantly elicited anti-M2e IgG in serum, IgG and sIgA in BAL. Antibodies induced by the fusion protein Flg-2M2eh2M2ek bound efficiently to synthetic peptides corresponding to the human consensus M2e sequence as well as to the M2e sequence of A/Chicken/Kurgan/05/05 RG (H5N1 and recognised native M2e epitopes exposed on the surface of the MDCK cells infected with A/PR/8/34 (H1N1 and A/Chicken/Kurgan/05/05 RG (H5N1 to an equal degree. Immunisation led to both anti-M2e IgG1 and IgG2a response with IgG1 prevalence. We observed a significant intracellular production of IL-4, but not IFN-γ, by CD4+ T-cells in spleen of mice following immunisation with Flg-2M2eh2M2ek. Immunisation with the Flg-2M2eh2M2ek fusion protein provided similar protection from lethal challenge with human influenza A viruses (H1N1, H3N2 and avian influenza virus (H5N1. Immunised mice experienced significantly less weight loss and decreased lung viral titres compared to control mice. The data obtained show the potential for the development of an M2e-flagellin candidate influenza vaccine with broad spectrum protection against influenza A viruses of various origins.

  6. Rapid Solidification of Sn-Cu-Al Alloys for High-Reliability, Lead-Free Solder: Part II. Intermetallic Coarsening Behavior of Rapidly Solidified Solders After Multiple Reflows

    Science.gov (United States)

    Reeve, Kathlene N.; Choquette, Stephanie M.; Anderson, Iver E.; Handwerker, Carol A.

    2016-12-01

    Controlling the size, dispersion, and stability of intermetallic compounds in lead-free solder alloys is vital to creating reliable solder joints regardless of how many times the solder joints are melted and resolidified (reflowed) during circuit board assembly. In this article, the coarsening behavior of Cu x Al y and Cu6Sn5 in two Sn-Cu-Al alloys, a Sn-2.59Cu-0.43Al at. pct alloy produced via drip atomization and a Sn-5.39Cu-1.69Al at. pct alloy produced via melt spinning at a 5-m/s wheel speed, was characterized after multiple (1-5) reflow cycles via differential scanning calorimetry between the temperatures of 293 K and 523 K (20 °C and 250 °C). Little-to-no coarsening of the Cu x Al y particles was observed for either composition; however, clustering of Cu x Al y particles was observed. For Cu6Sn5 particle growth, a bimodal size distribution was observed for the drip atomized alloy, with large, faceted growth of Cu6Sn5 observed, while in the melt spun alloy, Cu6Sn5 particles displayed no significant increase in the average particle size, with irregularly shaped, nonfaceted Cu6Sn5 particles observed after reflow, which is consistent with shapes observed in the as-solidified alloys. The link between original alloy composition, reflow undercooling, and subsequent intermetallic coarsening behavior was discussed by using calculated solidification paths. The reflowed microstructures suggested that the heteroepitaxial relationship previously observed between the Cu x Al y and the Cu6Sn5 was maintained for both alloys.

  7. Effect of surface oxide on the melting behavior of lead-free solder nanowires and nanorods

    International Nuclear Information System (INIS)

    Gao Fan; Rajathurai, Karunaharan; Cui, Qingzhou; Zhou, Guangwen; NkengforAcha, Irene; Gu Zhiyong

    2012-01-01

    Lead-free nanosolders have shown promise in nanowire and nanoelectronics assembly. Among various important parameters, melting is the most fundamental property affecting the assembly process. Here we report that the melting behavior of tin and tin/silver nanowires and nanorods can be significantly affected by the surface oxide of nanosolders. By controlling the nanosolder reflow atmosphere using a flux, the surface oxide of the nanowires/nanorods can be effectively removed and complete nanosolder melting can be achieved. The complete melting of the nanosolders leads to the formation of nanoscale to microscale spherical solder balls, followed by Ostwald ripening phenomenon. The contact angle of the microscale solder balls formed on Si substrate was measured by direct electron microscopic imaging. These results provide new insights into micro- and nanoscale phase transition and liquid droplet coalescence from nanowires/nanorods to spheroids, and are relevant to nanoscale assembly and smaller ball grid array formation.

  8. Recovery of Tin and Nitric Acid from Spent Solder Stripping Solutions

    International Nuclear Information System (INIS)

    Ahn, Jae-Woo; Ryu, Seong-Hyung; Kim, Tae-young

    2015-01-01

    Spent solder-stripping solutions containing tin, copper, iron, and lead in nitric acid solution, are by-products of the manufacture of printed-circuit boards. The recovery of these metals and the nitric acid, for re-use has economic and environmental benefits. In the spent solder-stripping solution, a systematic method to determine a suitable process for recovery of valuable metals and nitric acid was developed. Initially, more than 90% of the tin was successfully recovered as high-purity SnO 2 by thermal precipitation at 80 ℃ for 3 hours. About 94% of the nitric acid was regenerated effectively from the spent solutions by diffusion dialysis, after which there remained copper, iron, and lead in solution. Leakage of tin through the anion-exchange membrane was the lowest (0.026%), whereas Pb-leakage was highest (4.26%). The concentration of the regenerated nitric acid was about 5.1 N.

  9. Solder bond requirement for large, built-up, high-performance conductors

    International Nuclear Information System (INIS)

    Willig, R.L.

    1981-01-01

    Some large built-up conductors fabricated for large superconducting magnets are designed to operate above the maximum recovery current. Because the stability of these conductors is sensitive to the quality of the solder bond joining the composite superconductor to the high-conductivity substrate, a minimum bond requirement is necessary. The present analysis finds that the superconductor is unstable and becomes abruptly resistive when there are temperature excursions into the current sharing region of a poorly bonded conductor. This abrupt transition, produces eddy current heating in the vicinity of the superconducting filaments and causes a sharp reduction in the minimum propagating zone (MPZ) energy. This sensitivity of the MPZ energy to the solder bond contact area is used to specify a minimum bond requirement. For the superconducting MHD magnet built for the Component Development Integration Facility (CDIF), the minimum bonded surface area is .68 cm/sup 2//cm which is 44% of the composite perimeter. 5 refs

  10. Appendix to the report from the low-residue soldering task force: Phase 2 results

    Energy Technology Data Exchange (ETDEWEB)

    Iman, R.L.; Anderson, D.J.; Huffman, D.D. [and others

    1995-12-01

    The LRSTF report for Phase I of its evaluation of low-residue soldering was issued in June 1995. This Appendix summarizes the results of follow-on testing performed in Phase II and compares electrical test results for both phases. Deliberate decisions were made by the LRSTF in Phase I to challenge the design guideline limits in MILSTD-275, Printed Wiring for Electronic Equipment The LRSTF considered this approach to produce a ``worst case`` design and provide useful information about the robustness of LR soldering processes. As such, good design practices were sometimes deliberately violated in designing the LRSTF board. This approach created some anomalies for both LR boards and RMA/cleaned controls. Phase II testing verified that problems that affected both RMA/cleaned and LR boards in Phase I were design related.

  11. Intense generation of respirable metal nanoparticles from a low-power soldering unit

    Energy Technology Data Exchange (ETDEWEB)

    Gómez, Virginia [Department of Chemical Engineering, Nanoscience Institute of Aragon (INA), 50018 Zaragoza (Spain); Irusta, Silvia [Department of Chemical Engineering, Nanoscience Institute of Aragon (INA), 50018 Zaragoza (Spain); Networking Biomedical Research Center of Bioengineering, Biomaterials and Nanomedicine (CIBER-BBN), 50018 Zaragoza (Spain); Balas, Francisco [Networking Biomedical Research Center of Bioengineering, Biomaterials and Nanomedicine (CIBER-BBN), 50018 Zaragoza (Spain); Instituto de Carboquímica – Consejo Superior de Investigaciones Científicas (ICB-CSIC), 50018 Zaragoza (Spain); Santamaria, Jesus, E-mail: Jesus.Santamaria@unizar.es [Department of Chemical Engineering, Nanoscience Institute of Aragon (INA), 50018 Zaragoza (Spain); Networking Biomedical Research Center of Bioengineering, Biomaterials and Nanomedicine (CIBER-BBN), 50018 Zaragoza (Spain)

    2013-07-15

    Highlights: • Intense generation of nanoparticles in the breathing range from a flux-soldering unit is detected. • Coagulation in the aerosol phase leads to 200-nm respirable nanoparticles up to 30 min after operation. • Nanoparticle concentration in the working environment depends on the presence of ambient air. • Metal-containing nanoparticles are collected in TEM grids and filters in the hundreds of nanometer range. -- Abstract: Evidence of intense nanoparticle generation from a low power (45 W) flux soldering unit is presented. This is a familiar device often used in daily life, including home repairs and school electronic laboratories. We demonstrate that metal-containing nanoparticles may reach high concentrations (ca. 10{sup 6} particles/cm{sup 3}) within the breathing range of the operator, with initial size distributions centered at 35–60 nm The morphological and chemical analysis of nanoparticle agglomerates collected on TEM grids and filters confirms their multiparticle structure and the presence of metals.

  12. Intense generation of respirable metal nanoparticles from a low-power soldering unit

    International Nuclear Information System (INIS)

    Gómez, Virginia; Irusta, Silvia; Balas, Francisco; Santamaria, Jesus

    2013-01-01

    Highlights: • Intense generation of nanoparticles in the breathing range from a flux-soldering unit is detected. • Coagulation in the aerosol phase leads to 200-nm respirable nanoparticles up to 30 min after operation. • Nanoparticle concentration in the working environment depends on the presence of ambient air. • Metal-containing nanoparticles are collected in TEM grids and filters in the hundreds of nanometer range. -- Abstract: Evidence of intense nanoparticle generation from a low power (45 W) flux soldering unit is presented. This is a familiar device often used in daily life, including home repairs and school electronic laboratories. We demonstrate that metal-containing nanoparticles may reach high concentrations (ca. 10 6 particles/cm 3 ) within the breathing range of the operator, with initial size distributions centered at 35–60 nm The morphological and chemical analysis of nanoparticle agglomerates collected on TEM grids and filters confirms their multiparticle structure and the presence of metals

  13. Diode Lasers used in Plastic Welding and Selective Laser Soldering - Applications and Products

    Science.gov (United States)

    Reinl, S.

    Aside from conventional welding methods, laser welding of plastics has established itself as a proven bonding method. The component-conserving and clean process offers numerous advantages and enables welding of sensitive assemblies in automotive, electronic, medical, human care, food packaging and consumer electronics markets. Diode lasers are established since years within plastic welding applications. Also, soft soldering using laser radiation is becoming more and more significant in the field of direct diode laser applications. Fast power controllability combined with a contactless temperature measurement to minimize thermal damage make the diode laser an ideal tool for this application. These advantages come in to full effect when soldering of increasingly small parts in temperature sensitive environments is necessary.

  14. Effects of In and Ni Addition on Microstructure of Sn-58Bi Solder Joint

    Science.gov (United States)

    Mokhtari, Omid; Nishikawa, Hiroshi

    2014-11-01

    In this study, the effect of adding 0.5 wt.% and 1 wt.% In and Ni to Sn-58Bi solder on intermetallic compound (IMC) layers at the interface and the microstructure of the solder alloys were investigated during reflow and thermal aging by scanning electron microscopy and electron probe micro-analysis. The results showed that the addition of minor elements was not effective in suppressing the IMC growth during the reflow; however, the addition of 0.5 wt.% In and Ni was effective in suppressing the IMC layer growth during thermal aging. The thickening kinetics of the total IMC layer was analyzed by plotting the mean thickness versus the aging time on log-log coordinates, and the results showed the transition point from grain boundary diffusion control to a volume diffusion control mechanism. The results also showed that the minor addition of In can significantly suppress the coarsening of the Bi phase.

  15. Current redistribution in cables made of insulated, soldered, or oxidized strands

    International Nuclear Information System (INIS)

    Turck, B.

    1979-07-01

    Current redistributions are compared in cables made of insulated strands, soldered, or oxidized strands and insulated strands with periodic joints. After discussing the different current redistributions in the cases of a rapidly changing current and a dc current, several particular situations are investigated: what happens if a strand is broken, or if a local normal zone appears that does not affect all the strands equally, the detection of this normal zone, and the influence of short circuits between strands

  16. Study of silicon chip soldering in high-power transistor housing

    Directory of Open Access Journals (Sweden)

    Vasily S. Anosov

    2017-09-01

    We experimentally assessed the effect of outer housing layer materials and back side chip metallization. For lead-silver soldering of silicon chips, the best housing is that with a nickel outer layer rather than with a gold-plated one, because the resultant thermal resistance is lower and the absence of gold makes the technology cheaper. We obtained a 0.6 K/W thermal resistance for a 24 mm2 chip area.

  17. Liver repair and hemorrhage control by using laser soldering of liquid albumin in a porcine model.

    Science.gov (United States)

    Wadia, Y; Xie, H; Kajitani, M

    2000-01-01

    We evaluated laser soldering by using liquid albumin for welding liver injuries. Major liver trauma has a high mortality because of immediate exsanguination and a delayed morbidity from septicemia, peritonitis, biliary fistulae, and delayed secondary hemorrhage. Eight laceration (6 x 2 cm) and eight nonanatomic resection injuries (raw surface, 6 x 2 cm) were repaired. An 805-nm laser was used to weld 50% liquid albumin-indocyanine green solder to the liver surface, reinforcing it with a free autologous omental scaffold. The animals were heparinized and hepatic inflow occlusion was used for vascular control. All 16 soldering repairs were evaluated at 3 hours. All 16 laser mediated liver repairs had minimal blood loss as compared with the suture controls. No dehiscence, hemorrhage, or bile leakage was seen in any of the laser repairs after 3 hours. Laser fusion repair of the liver is a reliable technique to gain hemostasis on the raw surface as well as weld lacerations. Copyright 2000 Wiley-Liss, Inc.

  18. Investigation of Sn-Pb solder bumps of prototype photo detectors for the LHCb experiment

    CERN Document Server

    Delsante, M L; Arnau-Izquierdo, G

    2004-01-01

    The Large Hadron Collider (LHC) is now under construction at the European Organization for Nuclear Research (CERN). LHCb is one of the dedicated LHC experiments, allowing high energy proton-proton collisions to be exploited. This paper presents the results of the metallurgic studies carried out on Sn-Pb solder bumps of prototype vacuum photo detectors under development for LHCb, and in particular for the ring imaging Cherenkov-hybrid photo diode (RICH-HPD) project. These detectors encapsulate, in a vacuum tube, an assembly made of two silicon chips bonded together by a matrix of solder bumps. Each bump lies on a suitable system of under-bump metallic layers ensuring mechanical and electrical transition between the chip pad and the solder alloy. During manufacturing of the detector, bump-bonded (BB) assemblies are exposed to severe heat cycles up to 400 degree C inducing, in the present fabrication process, a clear degradation of electrical connectivity. Several investigations such as microstructural observati...

  19. Multi-layer SiC ceramics/Mo joints brazed using high-temperature solders

    International Nuclear Information System (INIS)

    Olesinska, W.; Kesik, J.

    2003-01-01

    The paper presents the results of studies on joining SiC ceramics with molybdenum, with the ceramic surface being activated by titanium, chromium or copper. Titanium or chromium were deposited by the sputtering technique, and copper - by the electro-chemical method. The microstructures of the SiC/Mo joints brazed with the CuMn13Ni3 solder and copper in a nitrogen atmosphere were examined and the results discussed. The joints, in which the ceramic surface was activated in addition with chromium, do not contain mechanical defects caused by the joining process, and the ceramic surface is covered with a continuous layer of the solder. A phase analysis of the interface surface identified an MeSiC phase. The mechanical strength of the joints in which the ceramic surface was modified by the Ti, Cr and Cu layers was markedly greater than that of the joints brazed directly to the uncoated ceramics with the use of active solders. (author)

  20. Laser Soldering and Thermal Cycling Tests of Monolithic Silicon Pixel Chips

    CERN Document Server

    Strand, Frode Sneve

    2015-01-01

    An ALPIDE-1 monolithic silicon pixel sensor prototype has been laser soldered to a flex printed circuit using a novel interconnection technique using lasers. This technique is to be optimised to ensure stable, good quality connections between the sensor chips and the FPCs. To test the long-term stability of the connections, as well as study the effects on hit thresholds and noise in the sensor, it was thermally cycled in a climate chamber 1200 times. The soldered connections showed good qualities like even melting and good adhesion on pad/flex surfaces, and the chip remained in working condition for 1080 cycles. After this, a few connections failed, having cracks in the soldering tin, rendering the chip unusable. Threshold and noise characteristics seemed stable, except for the noise levels of sector 2 in the chip, for 1000 cycles in a temperature interval of "10^{\\circ}" and "50^{\\circ}" C. Still, further testing with wider temperature ranges and more cycles is needed to test the limitations of the chi...

  1. Reinforcement of high-risk anastomoses using laser-activated protein solders: a clinical study

    Science.gov (United States)

    Libutti, Steven K.; Bessler, Marc; Chabot, J.; Bass, Lawrence S.; Oz, Mehmet C.; Auteri, Joseph S.; Kirsch, Andrew J.; Nowygrod, Roman; Treat, Michael R.

    1993-07-01

    Anastomotic leakage or breakdown can result in catastrophic complications and significantly increased post-operative morbidity and mortality. Certain anastomoses are subject to a higher incidence of disruption and are therefore termed high risk. In an attempt to decrease the risk of anastomotic leaks, we reinforced sutured anastomoses with a laser activated protein solder in patients undergoing esophagojejunostomies (n equals 2), lung transplantation (n equals 2), and pancreaticojejunostomies (Whipple procedure, n equals 5). The protein solder was composed of 1.0 ml of a 25% human albumin solution, 1.0 ml of sodium hyaluronate, and 0.1 ml of Cardiogreen dye. This composition was applied to the sutured anastomosis and activated with an 860 nm pulsed diode laser. Drains were placed when appropriate and patients were followed for up to 10 months post-operatively and assessed for clinical signs of anastomotic leaks. Results to data demonstrated that there were no immediate complications as a result of the procedure. Operative time was not significantly lengthened. There were no cases of clinically significant leakage from any of the reinforced anastomoses. Laser activated protein solders may help to reduce the incidence of leakage in high risk anastomoses. Large numbers of patients and longer follow-up is needed however, to draw significant conclusions.

  2. Liver repair and hemorrhage control using laser soldering of liquid albumin in a porcine model

    Science.gov (United States)

    Wadia, Yasmin; Xie, Hua; Kajitani, Michio; Gregory, Kenton W.; Prahl, Scott A.

    2000-05-01

    The purpose of this study was to evaluate laser soldering using liquid albumin for welding liver lacerations and sealing raw surfaces created by segmental resection of a lobe. Major liver trauma has a high mortality due to immediate exsanguination and a delayed morbidity and mortality from septicemia, peritonitis, biliary fistulae and delayed secondary hemorrhage. Eight laceration injuries (6 cm long X 2 cm deep) and eight non-anatomical resection injuries (raw surface 6 cm X 2 cm) were repaired. An 805 nm laser was used to weld 53% liquid albumin-ICG solder to the liver surface, reinforcing it with a free autologous omental scaffold. The animals were heparinized to simulate coagulation failure and hepatic inflow occlusion was used for vascular control. For both laceration and resection injuries, eight soldering repairs each were evaluated at three hours. A single suture repair of each type was evaluated at three hours. All 16 laser mediated liver repairs were accompanied by minimal blood loss as compared to the suture controls. No dehiscence, hemorrhage or bile leakage was seen in any of the laser repairs after three hours. In conclusion laser fusion repair of the liver is a quick and reliable technique to gain hemostasis on the cut surface as well as weld lacerations.

  3. Dissolution and uptake of cadmium from dental gold solder alloy implants

    Energy Technology Data Exchange (ETDEWEB)

    Bergman, B; Bergman, M; Soeremark, R [Umeaa Univ. (Sweden); Karolinska Institutet, Stockholm (Sweden))

    1977-01-01

    Pure metallic cadmium was irradiated by means of thermal neutrons. The irradiated cadmium (/sup 115/Cd) was placed in bags of gold foil and the bags were implanted subcutaneously in the neck region of mice. Two and 3 d respectively after implantation the mice were killed, the bags removed and the animals subjected to whole-body autoradiography. The autoradiograms revealed an uptake of /sup 115/Cd in liver and kidney. In another experiment specimens of a cadmium-containing dental gold solder alloy, a cadmium-free dental casting gold alloy and soldered assemblies made of these two alloys were implanted subcutaneously in the neck region of mice. The animals were killed after 6 months; cadmium analysis showed significant increases in the cadmium concentration in liver and kidney of those mice which had been given implants of gold solder alloy. The study clearly shows that due to electrochemical corrosion cadmium can be released from implants and accumulated in the kidneys and the liver.

  4. Evaluation and selection of Bacillus species based on enzyme production, antimicrobial activity and biofilm synthesis as direct-fed microbials candidates for poultry

    Directory of Open Access Journals (Sweden)

    Juan D Latorre

    2016-10-01

    Full Text Available Social concern about misuse of antibiotics as growth promoters (AGP and generation of multidrug-resistant bacteria have restricted the dietary inclusion of antibiotics in livestock feed in several countries. Direct-fed microbials (DFM are one of the multiple alternatives commonly evaluated as substitutes of AGP. Sporeformer bacteria from the genus Bacillus have been extensively investigated because of their extraordinary properties to form highly-resistant endospores, production of antimicrobial compounds and synthesize different exogenous enzymes. The purpose of the present study was to evaluate and select Bacillus spp. from environmental and poultry sources as DFM candidates, considering their enzyme production profile, biofilm synthesis capacity and pathogen-inhibition activity. Thirty one Bacillus isolates were screened for in vitro relative enzyme activity of amylase, protease, lipase and phytase using a selective media for each enzyme, with 3/31 strains selected as superior enzyme producers. These three isolates were identified as B. subtilis (1/3, and B. amyloliquefaciens (2/3 based on biochemical tests and 16S rRNA sequence analysis. For evaluation of biofilm synthesis, the generation of an adherent crystal violet-stained ring was determined in polypropylene tubes, resulting in 11/31 strains showing a strong biofilm formation. Moreover, all Bacillus strains were evaluated for growth inhibition activity against Salmonella enterica serovar Enteritidis (26/31, Escherichia coli (28/31 and Clostridioides difficile (29/31. Additionally, in previous in vitro and in vivo studies, these selected Bacillus strains have shown to be resistant to different biochemical conditions of the gastrointestinal tract of poultry. Results of the present study suggest that the selection and consumption of Bacillus-DFM, producing a variable set of enzymes and antimicrobial compounds may contribute to enhanced performance through improving nutrient digestibility

  5. Identification of candidate agents active against N. ceranae infection in honey bees: establishment of a medium throughput screening assay based on N. ceranae infected cultured cells.

    Science.gov (United States)

    Gisder, Sebastian; Genersch, Elke

    2015-01-01

    Many flowering plants in both natural ecosytems and agriculture are dependent on insect pollination for fruit set and seed production. Managed honey bees (Apis mellifera) and wild bees are key pollinators providing this indispensable eco- and agrosystem service. Like all other organisms, bees are attacked by numerous pathogens and parasites. Nosema apis is a honey bee pathogenic microsporidium which is widely distributed in honey bee populations without causing much harm. Its congener Nosema ceranae was originally described as pathogen of the Eastern honey bee (Apis cerana) but jumped host from A. cerana to A. mellifera about 20 years ago and spilled over from A. mellifera to Bombus spp. quite recently. N. ceranae is now considered a deadly emerging parasite of both Western honey bees and bumblebees. Hence, novel and sustainable treatment strategies against N. ceranae are urgently needed to protect honey and wild bees. We here present the development of an in vitro medium throughput screening assay for the identification of candidate agents active against N. ceranae infections. This novel assay is based on our recently developed cell culture model for N. ceranae and coupled with an RT-PCR-ELISA protocol for quantification of N. ceranae in infected cells. The assay has been adapted to the 96-well microplate format to allow automated analysis. Several substances with known (fumagillin) or presumed (surfactin) or no (paromomycin) activity against N. ceranae were tested as well as substances for which no data concerning N. ceranae inhibition existed. While fumagillin and two nitroimidazoles (metronidazole, tinidazole) totally inhibited N. ceranae proliferation, all other test substances were inactive. In summary, the assay proved suitable for substance screening and demonstrated the activity of two synthetic antibiotics against N. ceranae.

  6. Identification of candidate agents active against N. ceranae infection in honey bees: establishment of a medium throughput screening assay based on N. ceranae infected cultured cells.

    Directory of Open Access Journals (Sweden)

    Sebastian Gisder

    Full Text Available Many flowering plants in both natural ecosytems and agriculture are dependent on insect pollination for fruit set and seed production. Managed honey bees (Apis mellifera and wild bees are key pollinators providing this indispensable eco- and agrosystem service. Like all other organisms, bees are attacked by numerous pathogens and parasites. Nosema apis is a honey bee pathogenic microsporidium which is widely distributed in honey bee populations without causing much harm. Its congener Nosema ceranae was originally described as pathogen of the Eastern honey bee (Apis cerana but jumped host from A. cerana to A. mellifera about 20 years ago and spilled over from A. mellifera to Bombus spp. quite recently. N. ceranae is now considered a deadly emerging parasite of both Western honey bees and bumblebees. Hence, novel and sustainable treatment strategies against N. ceranae are urgently needed to protect honey and wild bees. We here present the development of an in vitro medium throughput screening assay for the identification of candidate agents active against N. ceranae infections. This novel assay is based on our recently developed cell culture model for N. ceranae and coupled with an RT-PCR-ELISA protocol for quantification of N. ceranae in infected cells. The assay has been adapted to the 96-well microplate format to allow automated analysis. Several substances with known (fumagillin or presumed (surfactin or no (paromomycin activity against N. ceranae were tested as well as substances for which no data concerning N. ceranae inhibition existed. While fumagillin and two nitroimidazoles (metronidazole, tinidazole totally inhibited N. ceranae proliferation, all other test substances were inactive. In summary, the assay proved suitable for substance screening and demonstrated the activity of two synthetic antibiotics against N. ceranae.

  7. Phytoplasma phylogenetics based on analysis of secA and 23S rRNA gene sequences for improved resolution of candidate species of 'Candidatus Phytoplasma'.

    Science.gov (United States)

    Hodgetts, Jennifer; Boonham, Neil; Mumford, Rick; Harrison, Nigel; Dickinson, Matthew

    2008-08-01

    Phytoplasma phylogenetics has focused primarily on sequences of the non-coding 16S rRNA gene and the 16S-23S rRNA intergenic spacer region (16-23S ISR), and primers that enable amplification of these regions from all phytoplasmas by PCR are well established. In this study, primers based on the secA gene have been developed into a semi-nested PCR assay that results in a sequence of the expected size (about 480 bp) from all 34 phytoplasmas examined, including strains representative of 12 16Sr groups. Phylogenetic analysis of secA gene sequences showed similar clustering of phytoplasmas when compared with clusters resolved by similar sequence analyses of a 16-23S ISR-23S rRNA gene contig or of the 16S rRNA gene alone. The main differences between trees were in the branch lengths, which were elongated in the 16-23S ISR-23S rRNA gene tree when compared with the 16S rRNA gene tree and elongated still further in the secA gene tree, despite this being a shorter sequence. The improved resolution in the secA gene-derived phylogenetic tree resulted in the 16SrII group splitting into two distinct clusters, while phytoplasmas associated with coconut lethal yellowing-type diseases split into three distinct groups, thereby supporting past proposals that they represent different candidate species within 'Candidatus Phytoplasma'. The ability to differentiate 16Sr groups and subgroups by virtual RFLP analysis of secA gene sequences suggests that this gene may provide an informative alternative molecular marker for pathogen identification and diagnosis of phytoplasma diseases.

  8. Prediction of overall in vitro microsomal stability of drug candidates based on molecular modeling and support vector machines. Case study of novel arylpiperazines derivatives.

    Directory of Open Access Journals (Sweden)

    Szymon Ulenberg

    Full Text Available Other than efficacy of interaction with the molecular target, metabolic stability is the primary factor responsible for the failure or success of a compound in the drug development pipeline. The ideal drug candidate should be stable enough to reach its therapeutic site of action. Despite many recent excellent achievements in the field of computational methods supporting drug metabolism studies, a well-recognized procedure to model and predict metabolic stability quantitatively is still lacking. This study proposes a workflow for developing quantitative metabolic stability-structure relationships, taking a set of 30 arylpiperazine derivatives as an example. The metabolic stability of the compounds was assessed in in vitro incubations in the presence of human liver microsomes and NADPH and subsequently quantified by liquid chromatography-mass spectrometry (LC-MS. Density functional theory (DFT calculations were used to obtain 30 models of the molecules, and Dragon software served as a source of structure-based molecular descriptors. For modeling structure-metabolic stability relationships, Support Vector Machines (SVM, a non-linear machine learning technique, were found to be more effective than a regression technique, based on the validation parameters obtained. Moreover, for the first time, general sites of metabolism for arylpiperazines bearing the 4-aryl-2H-pyrido[1,2-c]pyrimidine-1,3-dione system were defined by analysis of Q-TOF-MS/MS spectra. The results indicated that the application of one of the most advanced chemometric techniques combined with a simple and quick in vitro procedure and LC-MS analysis provides a novel and valuable tool for predicting metabolic half-life values. Given the reduced time and simplicity of analysis, together with the accuracy of the predictions obtained, this is a valid approach for predicting metabolic stability using structural data. The approach presented provides a novel, comprehensive and reliable tool

  9. Dark matter candidates

    International Nuclear Information System (INIS)

    Turner, M.S.

    1989-01-01

    One of the simplest, yet most profound, questions we can ask about the Universe is, how much stuff is in it, and further what is that stuff composed of? Needless to say, the answer to this question has very important implications for the evolution of the Universe, determining both the ultimate fate and the course of structure formation. Remarkably, at this late date in the history of the Universe we still do not have a definitive answer to this simplest of questions---although we have some very intriguing clues. It is known with certainty that most of the material in the Universe is dark, and we have the strong suspicion that the dominant component of material in the Cosmos is not baryons, but rather is exotic relic elementary particles left over from the earliest, very hot epoch of the Universe. If true, the Dark Matter question is a most fundamental one facing both particle physics and cosmology. The leading particle dark matter candidates are: the axion, the neutralino, and a light neutrino species. All three candidates are accessible to experimental tests, and experiments are now in progress. In addition, there are several dark horse, long shot, candidates, including the superheavy magnetic monopole and soliton stars. 13 refs

  10. Interfacial microstructures and solder joint strengths of the Sn-8Zn-3Bi and Sn-9Zn-lAl Pb-free solder pastes on OSP finished printed circuit boards

    Energy Technology Data Exchange (ETDEWEB)

    Lin, C.-T. [Department of Materials Science and Engineering, National United University, 1 Lein-Da, Kung-Ching Li, Miaoli 36003, Taiwan (China); Electronics and Optoelectronics Research Laboratories, Industrial Technology Research Institute, 195 Section 4, Chung-Hsing Road, Chutung, Hsinchu 31040, Taiwan (China); Hsi, C.-S. [Department of Materials Science and Engineering, National United University, 1 Lein-Da, Kung-Ching Li, Miaoli 36003, Taiwan (China); Wang, M.-C. [Faculty of Fragrance and Cosmetics, Kaohsiung Medical University, 100 Shih-Chuan 1st Road, Kaohsiung 807, Taiwan (China)], E-mail: mcwang@kmu.edu.tw; Chang, T.-C.; Liang, M.-K. [Electronics and Optoelectronics Research Laboratories, Industrial Technology Research Institute, 195 Section 4, Chung-Hsing Road, Chutung, Hsinchu 31040, Taiwan (China)

    2008-07-14

    Two kinds of lead-free solders, Sn-8Zn-3Bi and Sn-9Zn-lAl, were used to mount passive components onto printed circuit boards via a re-flow soldering process. The samples were stored at 150 deg. C for 200, 400, 600, 800, and 1100 h. The microstructures of the samples after aged at 150 deg. C for various times were characterized using optical microscopy (OM), scanning electron microscopy (SEM), energy dispersive spectrometry (EDS) and the analyzed of solder joint shear strengths. The joint strength between Sn-8Zn-3Bi and Cu pad was about 4.0 {+-} 0.3 kg, while the strength between Sn-9Zn-lAl and Cu pad had values of 2.6 {+-} 0.1 kg. Both kinds of solder joints exhibited reduced strengths with increasing aging times. After aging at 150 deg. C for 1100 h, the joints strengths of Sn-8Zn-3Bi and Sn-9Zn-lAl were 1.8 {+-} 0.3 and 1.7 {+-} 0.3 kg, respectively. Both the Sn-8Zn-3Bi and Sn-9Zn-lAl joints showed brittle fracture behaviors. A flat layer of Cu{sub 5}Zn{sub 8} intermetallic compound (IMC) was formed between Sn-8Zn-3Bi solder and Cu pad after reflow. When the aging time was increased to 400 h, Zn-depletion and formation of Cu{sub 6}Sn{sub 5} IMC were observed in the solders due to the interaction between the tin and zinc compounds. The interaction between Sn-9Zn-lAl solder and Cu pad had similar behavior, however, Cu{sub 6}Sn{sub 5} IMC formed in Sn-9Zn-lAl solder when after aging at 150 deg. C for 600 h. As the aging time increased, both types of solders generated clear IMC spalling layers with large and continuous voids. Those voids substantially decreased the joint strength.

  11. A case-based, problem-based learning approach to prepare master of public health candidates for the complexities of global health.

    Science.gov (United States)

    Leon, Juan S; Winskell, Kate; McFarland, Deborah A; del Rio, Carlos

    2015-03-01

    Global health is a dynamic, emerging, and interdisciplinary field. To address current and emerging global health challenges, we need a public health workforce with adaptable and collaborative problem-solving skills. In the 2013-2014 academic year, the Hubert Department of Global Health at the Rollins School of Public Health-Emory University launched an innovative required core course for its first-year Master of Public Health students in the global health track. The course uses a case-based, problem-based learning approach to develop global health competencies. Small teams of students propose solutions to these problems by identifying learning issues and critically analyzing and synthesizing new information. We describe the course structure and logistics used to apply this approach in the context of a large class and share lessons learned.

  12. Immunogenicity of a virosomally-formulated Plasmodium falciparum GLURP-MSP3 chimeric protein-based malaria vaccine candidate in comparison to adjuvanted formulations

    DEFF Research Database (Denmark)

    Tamborrini, Marco; Stoffel, Sabine A; Westerfeld, Nicole

    2011-01-01

    In clinical trials, immunopotentiating reconstituted influenza virosomes (IRIVs) have shown great potential as a versatile antigen delivery platform for synthetic peptides derived from Plasmodium falciparum antigens. This study describes the immunogenicity of a virosomally-formulated recombinant ...... fusion protein comprising domains of the two malaria vaccine candidate antigens MSP3 and GLURP....

  13. Do People 'Like' Candidates on Facebook?

    DEFF Research Database (Denmark)

    Nielsen, Rasmus Kleis

    The online popularity of a few exceptional candidates has led many to suggest that social media have given politicians powerful ways of communicating directly with voters. In this paper, we examine whether this is happening on a significant scale and show, based on analysis of 224 candidates....... We therefore suggest that the political implications of social media are generally better understood in terms of facilitating indirect communication and institutional change than in terms of direct communication....

  14. Interfacial Reaction and IMC Growth of an Ultrasonically Soldered Cu/SAC305/Cu Structure during Isothermal Aging

    Directory of Open Access Journals (Sweden)

    Yulong Li

    2018-01-01

    Full Text Available In order to accelerate the growth of interfacial intermetallic compound (IMC layers in a soldering structure, Cu/SAC305/Cu was first ultrasonically spot soldered and then subjected to isothermal aging. Relatively short vibration times, i.e., 400 ms and 800 ms, were used for the ultrasonic soldering. The isothermal aging was conducted at 150 °C for 0, 120, 240, and 360 h. The evolution of microstructure, the IMC layer growth mechanism during aging, and the shear strength of the joints after aging were systemically investigated. Results showed the following. (i Formation of intermetallic compounds was accelerated by ultrasonic cavitation and streaming effects, the thickness of the interfacial Cu6Sn5 layer increased with aging time, and a thin Cu3Sn layer was identified after aging for 360 h. (ii The growth of the interfacial IMC layer of the ultrasonically soldered Cu/SAC305/Cu joints followed a linear function of the square root of the aging time, revealing a diffusion-controlled mechanism. (iii The tensile shear strength of the joint decreased to a small extent with increasing aging time, owing to the combined effects of IMC grain coarsening and the increase of the interfacial IMC. (iv Finally, although the fracture surfaces and failure locations of the joint soldered with 400 ms and 800 ms vibration times show similar characteristics, they are influenced by the aging time.

  15. Comparative Study of ENIG and ENEPIG as Surface Finishes for a Sn-Ag-Cu Solder Joint

    Science.gov (United States)

    Yoon, Jeong-Won; Noh, Bo-In; Jung, Seung-Boo

    2011-09-01

    Interfacial reactions and joint reliability of Sn-3.0Ag-0.5Cu solder with two different surface finishes, electroless nickel-immersion gold (ENIG) and electroless nickel-electroless palladium-immersion gold (ENEPIG), were evaluated during a reflow process. We first compared the interfacial reactions of the two solder joints and also successfully revealed a connection between the interfacial reaction behavior and mechanical reliability. The Sn-Ag-Cu/ENIG joint exhibited a higher intermetallic compound (IMC) growth rate and a higher consumption rate of the Ni(P) layer than the Sn-Ag-Cu/ENEPIG joint. The presence of the Pd layer in the ENEPIG suppressed the growth of the interfacial IMC layer and the consumption of the Ni(P) layer, resulting in the superior interfacial stability of the solder joint. The shear test results show that the ENIG joint fractured along the interface, exhibiting indications of brittle failure possibly due to the brittle IMC layer. In contrast, the failure of the ENEPIG joint only went through the bulk solder, supporting the idea that the interface is mechanically reliable. The results from this study confirm that the Sn-Ag-Cu/ENEPIG solder joint is mechanically robust and, thus, the combination is a viable option for a Pb-free package system.

  16. RNA-Seq Based Identification of Candidate Parasitism Genes of Cereal Cyst Nematode (Heterodera avenae during Incompatible Infection to Aegilops variabilis.

    Directory of Open Access Journals (Sweden)

    Minghui Zheng

    targets with potential lethality were screened out and primarily validated, which provide candidates for engineering-based control of cereal cyst nematode in crops breeding.

  17. Stability of molybdenum nanoparticles in Sn-3.8Ag-0.7Cu solder during multiple reflow and their influence on interfacial intermetallic compounds

    Energy Technology Data Exchange (ETDEWEB)

    Haseeb, A.S.M.A., E-mail: haseeb@um.edu.my; Arafat, M.M., E-mail: arafat_mahmood@yahoo.com; Johan, Mohd Rafie, E-mail: mrafiej@um.edu.my

    2012-02-15

    This work investigates the effects of molybdenum nanoparticles on the growth of interfacial intermetallic compound between Sn-3.8Ag-0.7Cu solder and copper substrate during multiple reflow. Molybdenum nanoparticles were mixed with Sn-3.8Ag-0.7Cu solder paste by manual mixing. Solder samples were reflowed on a copper substrate in a 250 Degree-Sign C reflow oven up to six times. The molybdenum content of the bulk solder was determined by inductive coupled plasma-optical emission spectrometry. It is found that upon the addition of molybdenum nanoparticles to Sn-3.8Ag-0.7Cu solder, the interfacial intermetallic compound thickness and scallop diameter decreases under all reflow conditions. Molybdenum nanoparticles do not appear to dissolve or react with the solder. They tend to adsorb preferentially at the interface between solder and the intermetallic compound scallops. It is suggested that molybdenum nanoparticles impart their influence on the interfacial intermetallic compound as discrete particles. The intact, discrete nanoparticles, by absorbing preferentially at the interface, hinder the diffusion flux of the substrate and thereby suppress the intermetallic compound growth. - Highlights: Black-Right-Pointing-Pointer Mo nanoparticles do not dissolve or react with the SAC solder during reflow. Black-Right-Pointing-Pointer Addition of Mo nanoparticles results smaller IMC thickness and scallop diameter. Black-Right-Pointing-Pointer Mo nanoparticles influence the interfacial IMC through discrete particle effect.

  18. Effects of Ni{sub 3}Sn{sub 4} and (Cu,Ni){sub 6}Sn{sub 5} intermetallic layers on cross-interaction between Pd and Ni in solder joints

    Energy Technology Data Exchange (ETDEWEB)

    Baek, Yong-Ho [Department of Materials Science and Engineering, Korea University, Seoul 136-713 (Korea, Republic of); Division of Advanced Circuit Interconnect, Samsung Electro-Mechanics Co., Ltd., Suwon 443-743 (Korea, Republic of); Chung, Bo-Mook [Department of Materials Science and Engineering, Korea University, Seoul 136-713 (Korea, Republic of); Department of Research and Development, KPM TECH, Ansan 425-090 (Korea, Republic of); Choi, Young-Sik [Division of Advanced Circuit Interconnect, Samsung Electro-Mechanics Co., Ltd., Suwon 443-743 (Korea, Republic of); Choi, Jaeho [Department of Advanced Metal and Materials Engineering, Gangneung-Wonju National University, Gangneung 210-702 (Korea, Republic of); Huh, Joo-Youl, E-mail: jyhuh@korea.ac.kr [Department of Materials Science and Engineering, Korea University, Seoul 136-713 (Korea, Republic of)

    2013-12-05

    Highlights: •Ni{sub 3}Sn{sub 4} acts as a source of Ni atoms, leading to a strong cross-interaction with Pd. •(Cu,Ni){sub 6}Sn{sub 5} is an effective Ni diffusion barrier, inhibiting Pd resettlement. •Dissolution kinetics of (Pd,Ni)Sn{sub 4} was interpreted based on the Sn–Ni–Pd isotherm. •Cu addition to solder alleviates the (Pd,Ni)Sn{sub 4}-related risk of reliability deterioration. -- Abstract: We examined the effects of layers of intermetallic compound (IMC) Ni{sub 3}Sn{sub 4} and (Cu,Ni){sub 6}Sn{sub 5} formed at the solder/Ni interface, on the cross-interactions between Pd and Ni during solid-state aging and reflow soldering. Two types of diffusion couples, Pd/Sn/Ni and Pd/Sn–Cu/Ni, were aged at 150 °C to study the solid-state interactions. In contrast to the Pd/Sn/Ni couples in which a Ni{sub 3}Sn{sub 4} layer formed at the Ni interface, the Pd/Sn–Cu/Ni couple where a (Cu,Ni){sub 6}Sn{sub 5} layer formed at the Ni interface exhibited no significant interaction between Pd and Ni. The (Cu,Ni){sub 6}Sn{sub 5} layer acted as an effective barrier against Ni diffusion and thus inhibited the resettlement of (Pd,Ni)Sn{sub 4} onto the Ni interface. For the interaction during reflow, Sn–3.5Ag and Sn–3.0Ag–0.5Cu solder balls were isothermally reflowed on an electroless Ni(P)/electroless Pd/immersion Au (ENEPIG) surface finish at 250 °C, and the dissolution kinetics of the (Pd,Ni)Sn{sub 4} particles converted from the 0.2-μm-thick Pd-finish layer were examined. The spalled (Pd,Ni)Sn{sub 4} particles very quickly dissolved into the molten solder when the IMC layer formed on the Ni substrate was (Cu,Ni){sub 6}Sn{sub 5} rather than Ni{sub 3}Sn{sub 4}. The dependence of the dissolution kinetics of the spalled (Pd,Ni)Sn{sub 4} particles on the IMC layers was rationalized on the basis of a Sn–Ni–Pd isotherm at 250 °C. The present study suggests that the formation of a dense (Cu,Ni){sub 6}Sn{sub 5} layer at the solder/Ni interface can effectively

  19. Evaluating print performance of Sn-Ag-Cu lead-free solder pastes used in electronics assembly process

    Science.gov (United States)

    Mallik, S.; Bauer, R.; Hübner, F.; Ekere, N. N.

    2011-01-01

    Solder paste is the most widely used interconnection material in the electronic assembly process for attaching electronic components/devices directly onto the surface of printed circuit boards, using stencil printing process. This paper evaluates the performance of three different commercially available Sn-Ag-Cu solder pastes formulated with different particle size distributions (PSD), metal content and alloy composition. A series of stencil printing tests were carried out using a specially designed stencil of 75 μm thickness and apertures of 300×300 μm2 dimension and 500 μm pitch sizes. Solder paste printing behaviors were found related to attributes such as slumping and surface tension and printing performance was correlated with metal content and PSD. The results of the study should benefit paste manufacturers and SMT assemblers to improve their products and practices.

  20. Interconnection of thermal parameters, microstructure and mechanical properties in directionally solidified Sn–Sb lead-free solder alloys

    Energy Technology Data Exchange (ETDEWEB)

    Dias, Marcelino; Costa, Thiago [Department of Manufacturing and Materials Engineering, University of Campinas — UNICAMP, 13083-860 Campinas, SP (Brazil); Rocha, Otávio [Federal Institute of Education, Science and Technology of Pará — IFPA, 66093-020 Belém, PA (Brazil); Spinelli, José E. [Department of Materials Engineering, Federal University of São Carlos — UFSCar, 13565-905 São Carlos, SP (Brazil); Cheung, Noé, E-mail: cheung@fem.unicamp.br [Department of Manufacturing and Materials Engineering, University of Campinas — UNICAMP, 13083-860 Campinas, SP (Brazil); Garcia, Amauri [Department of Manufacturing and Materials Engineering, University of Campinas — UNICAMP, 13083-860 Campinas, SP (Brazil)

    2015-08-15

    Considerable effort is being made to develop lead-free solders for assembling in environmental-conscious electronics, due to the inherent toxicity of Pb. The search for substitute alloys of Pb–Sn solders has increased in order to comply with different soldering purposes. The solder must not only meet the expected levels of electrical performance but may also have appropriate mechanical strength, with the absence of cracks in the solder joints. The Sn–Sb alloy system has a range of compositions that can be potentially included in the class of high temperature solders. This study aims to establish interrelations of solidification thermal parameters, microstructure and mechanical properties of Sn–Sb alloys (2 wt.%Sb and 5.5 wt.%Sb) samples, which were directionally solidified under cooling rates similar to those of reflow procedures in industrial practice. A complete high-cooling rate cellular growth is shown to be associated with the Sn–2.0 wt.%Sb alloy and a reverse dendrite-to-cell transition is observed for the Sn–5.5 wt.%Sb alloy. Strength and ductility of the Sn–2.0 wt.%Sb alloy are shown not to be affected by the cellular spacing. On the other hand, a considerable variation in these properties is associated with the cellular region of the Sn–5.5 wt.%Sb alloy casting. - Graphical abstract: Display Omitted - Highlights: • The microstructure of the Sn–2 wt.%Sb alloy is characterized by high-cooling rates cells. • Reverse dendrite > cell transition occurs for Sn–5.5 wt.%Sb alloy: cells prevail for cooling rates > 1.2 K/s. • Sn–5.5 wt.%Sb alloy: the dendritic region occurs for cooling rates < 0.9 K/s. • Sn–5.5 wt.%Sb alloy: tensile properties are improved with decreasing cellular spacing.

  1. In-vitro investigations of skin closure using diode laser and protein solder containing gold nano shells

    International Nuclear Information System (INIS)

    Nourbakhsh, M. S.; Etrati Khosroshahi, M.

    2011-01-01

    Laser tissue soldering is a new technique for repair of various tissues including the skin, liver, articular cartilage and nerves and is a promising alternative to suture. To overcome the problems of thermal damage to surrounding tissues and low laser penetration depth, some exogenous chromophores such as gold nano shells, a new class of nanoparticles consisting of a dielectric core surrounded by a thin metal shell, are used. The aims of this study were to use two different concentrations of gold nano shells as the exogenous material for skin tissue soldering and also to examine the effects of laser soldering parameters on the properties of the repaired skin. Material and Methods: Two mixtures of albumin solder and different concentrations of gold nano shells were prepared. A full thickness incision of 2*20 mm 2 was made on the surface and after placing 50 μ1 of the solder mixture on the incision, an 810 nm diode laser was used to irradiate it at different power densities. The changes of tensile strength, σt, due to temperature rise, number of scan (Ns), and scan velocity (Vs) were investigated. Results: The results showed that the tensile strength of the repaired skin increased with increasing irradiance for both gold nano shell concentrations. In addition, at constant laser irradiance (I), the tensile strength of the repaired incision increased with increasing Ns and decreasing Vs. In our case, this corresponded to σt = 1610 g/cm 2 at I ∼ 60 W cm-2, T ∼ 65 d egree C , Ns = 10 and Vs = 0.2 mms-1. Discussion and Conclusion: Gold nano shells can be used as an indocyanine green dye alterative for laser tissue soldering. Although by increasing the laser power density, the tensile strength of the repaired skin increases, an optimum power density must be considered due to the resulting increase in tissue temperature.

  2. In situ investigation of SnAgCu solder alloy microstructure

    International Nuclear Information System (INIS)

    Pietrikova, Alena; Bednarcik, Jozef; Durisin, Juraj

    2011-01-01

    Research highlights: → In situ X-ray diffraction investigation enabled detailed analysis of the melting and solidification process of the SAC305 alloy. → It was found that the SAC305 solder melts at 230 deg. C. When cooling from 240 deg. C the SAC305 alloy solidifies at the temperature of 214 deg. C. During solidification β-Sn and Cu 6 Sn 5 is also formed. Formation of Ag 3 Sn occurs at 206 deg. C and the remaining amount of alloy crystallizes approximately at 160 deg. C. → Furthermore, observation of the thermal expansion behaviour of the β-Sn tetragonal unit cell revealed linear dependence of the unit cell volume on temperature. The unit cell parameters a and c also increase linearly with the temperature. Despite the fact that the c parameter is substantially smaller than parameter a, it exhibits a significantly higher linear thermal expansion coefficient. Comparison between data obtained during heating and cooling indicates that the thermal expansion coefficient is slightly greater in the case of cooling. - Abstract: In situ X-ray diffraction experiments, using synchrotron radiation, were employed to analyze microstructure evolution of the 96.5Sn3Ag0.5Cu (wt.%)-SAC305 lead-free solder alloy during heating (30-240 deg. C), isothermal dwell (240 deg. C) and cooling (240-30 deg. C). The special emphasis was placed on the study of the melting and solidification processes, explaining formation, distribution and the order of crystallization of the crystal phases (β-Sn, intermetallic compounds) in the solder alloy. Furthermore, thermal expansion behaviour of the main constituent phase β-Sn was analyzed prior to melting and after the consequent solidification.

  3. Contact of ZnSb thermoelectric material to metallic electrodes using S-Bond 400 solder alloy

    DEFF Research Database (Denmark)

    Malik, Safdar Abbas; Le, Thanh Hung; Van Nong, Ngo

    2018-01-01

    and metallic electrodes. In this paper, we investigate the joining of ZnSb to Ni and Ag electrodes using a commercial solder alloy S-Bond 400 and hot-pressing technique. Ti and Cr layers are also introduced as a diffusion barrier and microstructure at the interfaces is observed by scanning electron microscopy....... We found that S-bond 400 solder reacts with Ag and Ni electrodes to form different alloys at the interfaces. Cr layer was found to be broken after joining, resulting in a thicker reaction/diffusion layer at the interface, while Ti layer was preserved....

  4. Decomposition studies of no-clean solder flux systems in connection with corrosion reliability of electronics

    DEFF Research Database (Denmark)

    Conseil, Helene; Jellesen, Morten Stendahl; Verdingovas, Vadimas

    2013-01-01

    with specific soldering process and parameters, while most important factors are the flux chemistry and its decomposition characteristics. Active parts of the flux residue can cause increased water absorption due to their hygroscopic nature and in solution they will increase leakage current and corrosion...... the contaminated PCBA parts to varying humidity and measuring the resulting leakage current. Results revealed a significant influence of flux chemistry including the amount of WOAs, while aggressiveness of the residue seems to vary with content and type of WOAs, and their nature of decomposition....

  5. Control of microstructure in soldered, brazed, welded, plated, cast or vapor deposited manufactured components

    Science.gov (United States)

    Ripley, Edward B.; Hallman, Russell L.

    2015-11-10

    Disclosed are methods and systems for controlling of the microstructures of a soldered, brazed, welded, plated, cast, or vapor deposited manufactured component. The systems typically use relatively weak magnetic fields of either constant or varying flux to affect material properties within a manufactured component, typically without modifying the alloy, or changing the chemical composition of materials or altering the time, temperature, or transformation parameters of a manufacturing process. Such systems and processes may be used with components consisting of only materials that are conventionally characterized as be uninfluenced by magnetic forces.

  6. In situ TEM observation of microcrack nucleation and propagation in pure tin solder

    International Nuclear Information System (INIS)

    Ding Ying; Wang Chunqing; Li, Mingyu; Wang Weiqiang

    2006-01-01

    Microcrack nucleation and propagation behavior in pure tin solder was investigated by using transmission electron microscopy (TEM) through in situ tensile test. Observation results showed that fracture process was completed in this visco-plastic material by connecting discontinuous cracks or voids. Depending on remarkable vacancy diffusion ability, microvoids were nucleated and developed in the dislocation free zone (DFZ) or super thinned area ahead of crack tip under local high stress concentration. The cracks were linked with each other by mutual dislocation emission which expedites the propagation of crack tips effectively

  7. Soldering Technology (6th) Proceedings of Annual Seminar, 17-18 February 1982.

    Science.gov (United States)

    1982-02-01

    aspect oF health and safety during this presentation. We are hoping that the work conducted by Van 2 Der Molen in the USA will clarify this issue. FLUX... Der Molen , PROC. OF 5th ANNUAL SEMINAR SOLDERING TECHNOLOGY, Naval Weapons Centre, China Lake, California, February 1981. 3. Burge, Perks, O’Brien...developed a new and innovative solution, which we believe to be a significant advance in the state of the art. In this new design (Fig.l) a FM DER

  8. Influence of Nickel Thickness and Annealing Time on the Mechanical Properties of Intermetallic Compounds Formed between Cu-Sn Solder and Substrate

    Energy Technology Data Exchange (ETDEWEB)

    Kim, Yiseul; Kwon, Jeehye; Yoo, Dayoung; Park, Sungkyu; Lee, Dajeong; Lee, Dongyun [Pusan National University, Busan (Korea, Republic of)

    2017-03-15

    Intermetallic compounds (IMCs) developed on the interface between a solder alloy and its bonding pads are an important factor in the failure of electronic circuits. In this study, the mechanical behaviors of the IMCs formed in the Cu-Ni-Sn ternary alloy system are investigated. Presumably, Ni can act as a diffusion barrier to Cu and Sn to form the IMCs. Detailed analysis of the microstructure is conducted using an electron probe micro-analyzer (EPMA). The addition of Ni softened the IMCs, which is determined based on the fracture toughness increasing (from 0.71 to 1.55 MPa√m) with the Ni layer thickness. However, above a critical amount of Ni involved in the Cu-Sn IMCs, the softening effect is diminished, and this could result from the segregation of Ni inside the IMCs. Therefore, the optimized condition must be determined in order to obtain a positive Ni effect on enhancing the reliability of the electronic circuits.

  9. Immunogenicity of a virosomally-formulated Plasmodium falciparum GLURP-MSP3 chimeric protein-based malaria vaccine candidate in comparison to adjuvanted formulations

    Directory of Open Access Journals (Sweden)

    Tamborrini Marco

    2011-12-01

    Full Text Available Abstract Background In clinical trials, immunopotentiating reconstituted influenza virosomes (IRIVs have shown great potential as a versatile antigen delivery platform for synthetic peptides derived from Plasmodium falciparum antigens. This study describes the immunogenicity of a virosomally-formulated recombinant fusion protein comprising domains of the two malaria vaccine candidate antigens MSP3 and GLURP. Methods The highly purified recombinant protein GMZ2 was coupled to phosphatidylethanolamine and the conjugates incorporated into the membrane of IRIVs. The immunogenicity of this adjuvant-free virosomal formulation was compared to GMZ2 formulated with the adjuvants Montanide ISA 720 and Alum in three mouse strains with different genetic backgrounds. Results Intramuscular injections of all three candidate vaccine formulations induced GMZ2-specific antibody responses in all mice tested. In general, the humoral immune response in outbred NMRI mice was stronger than that in inbred BALB/c and C57BL/6 mice. ELISA with the recombinant antigens demonstrated immunodominance of the GLURP component over the MSP3 component. However, compared to the Al(OH3-adjuvanted formulation the two other formulations elicited in NMRI mice a larger proportion of anti-MSP3 antibodies. Analyses of the induced GMZ2-specific IgG subclass profiles showed for all three formulations a predominance of the IgG1 isotype. Immune sera against all three formulations exhibited cross-reactivity with in vitro cultivated blood-stage parasites. Immunofluorescence and immunoblot competition experiments showed that both components of the hybrid protein induced IgG cross-reactive with the corresponding native proteins. Conclusion A virosomal formulation of the chimeric protein GMZ2 induced P. falciparum blood stage parasite cross-reactive IgG responses specific for both MSP3 and GLURP. GMZ2 thus represents a candidate component suitable for inclusion into a multi-valent virosomal

  10. Identification and Comparison of Candidate Olfactory Genes in the Olfactory and Non-Olfactory Organs of Elm Pest Ambrostoma quadriimpressum (Coleoptera: Chrysomelidae) Based on Transcriptome Analysis.

    Science.gov (United States)

    Wang, Yinliang; Chen, Qi; Zhao, Hanbo; Ren, Bingzhong

    2016-01-01

    The leaf beetle Ambrostoma quadriimpressum (Coleoptera: Chrysomelidae) is a predominant forest pest that causes substantial damage to the lumber industry and city management. However, no effective and environmentally friendly chemical method has been discovered to control this pest. Until recently, the molecular basis of the olfactory system in A. quadriimpressum was completely unknown. In this study, antennae and leg transcriptomes were analyzed and compared using deep sequencing data to identify the olfactory genes in A. quadriimpressum. Moreover, the expression profiles of both male and female candidate olfactory genes were analyzed and validated by bioinformatics, motif analysis, homology analysis, semi-quantitative RT-PCR and RT-qPCR experiments in antennal and non-olfactory organs to explore the candidate olfactory genes that might play key roles in the life cycle of A. quadriimpressum. As a result, approximately 102.9 million and 97.3 million clean reads were obtained from the libraries created from the antennas and legs, respectively. Annotation led to 34344 Unigenes, which were matched to known proteins. Annotation data revealed that the number of genes in antenna with binding functions and receptor activity was greater than that of legs. Furthermore, many pathway genes were differentially expressed in the two organs. Sixteen candidate odorant binding proteins (OBPs), 10 chemosensory proteins (CSPs), 34 odorant receptors (ORs), 20 inotropic receptors [1] and 2 sensory neuron membrane proteins (SNMPs) and their isoforms were identified. Additionally, 15 OBPs, 9 CSPs, 18 ORs, 6 IRs and 2 SNMPs were predicted to be complete ORFs. Using RT-PCR, RT-qPCR and homology analysis, AquaOBP1/2/4/7/C1/C6, AquaCSP3/9, AquaOR8/9/10/14/15/18/20/26/29/33, AquaIR8a/13/25a showed olfactory-specific expression, indicating that these genes might play a key role in olfaction-related behaviors in A. quadriimpressum such as foraging and seeking. AquaOBP4/C5, AquaOBP4/C5, AquaCSP7

  11. Identification and Comparison of Candidate Olfactory Genes in the Olfactory and Non-Olfactory Organs of Elm Pest Ambrostoma quadriimpressum (Coleoptera: Chrysomelidae Based on Transcriptome Analysis.

    Directory of Open Access Journals (Sweden)

    Yinliang Wang

    Full Text Available The leaf beetle Ambrostoma quadriimpressum (Coleoptera: Chrysomelidae is a predominant forest pest that causes substantial damage to the lumber industry and city management. However, no effective and environmentally friendly chemical method has been discovered to control this pest. Until recently, the molecular basis of the olfactory system in A. quadriimpressum was completely unknown. In this study, antennae and leg transcriptomes were analyzed and compared using deep sequencing data to identify the olfactory genes in A. quadriimpressum. Moreover, the expression profiles of both male and female candidate olfactory genes were analyzed and validated by bioinformatics, motif analysis, homology analysis, semi-quantitative RT-PCR and RT-qPCR experiments in antennal and non-olfactory organs to explore the candidate olfactory genes that might play key roles in the life cycle of A. quadriimpressum. As a result, approximately 102.9 million and 97.3 million clean reads were obtained from the libraries created from the antennas and legs, respectively. Annotation led to 34344 Unigenes, which were matched to known proteins. Annotation data revealed that the number of genes in antenna with binding functions and receptor activity was greater than that of legs. Furthermore, many pathway genes were differentially expressed in the two organs. Sixteen candidate odorant binding proteins (OBPs, 10 chemosensory proteins (CSPs, 34 odorant receptors (ORs, 20 inotropic receptors [1] and 2 sensory neuron membrane proteins (SNMPs and their isoforms were identified. Additionally, 15 OBPs, 9 CSPs, 18 ORs, 6 IRs and 2 SNMPs were predicted to be complete ORFs. Using RT-PCR, RT-qPCR and homology analysis, AquaOBP1/2/4/7/C1/C6, AquaCSP3/9, AquaOR8/9/10/14/15/18/20/26/29/33, AquaIR8a/13/25a showed olfactory-specific expression, indicating that these genes might play a key role in olfaction-related behaviors in A. quadriimpressum such as foraging and seeking. AquaOBP4/C5, Aqua

  12. Relationship between candidate communication ability and oral certification examination scores.

    Science.gov (United States)

    Lunz, Mary E; Bashook, Philip G

    2008-12-01

    Structured case-based oral examinations are widely used in medical certifying examinations in the USA. These orals assess the candidate's decision-making skills using real or realistic patient cases. Frequently mentioned but not empirically evaluated is the potential bias introduced by the candidate's communication ability. This study aimed to assess the relationship between candidate communication ability and medical certification oral examination scores. Non-doctor communication observers rated a random sample of 90 candidates on communication ability during a medical oral certification examination. The multi-facet Rasch model was used to analyse the communication survey and the oral examination data. The multi-facet model accounts for observer and examiner severity bias. anova was used to measure differences in communication ability between passing and failing candidates and candidates grouped by level of communication ability. Pearson's correlations were used to compare candidate communication ability and oral certification examination performance. Candidate separation reliability values for the communication survey and the oral examination were 0.85 and 0.97, respectively, suggesting accurate candidate measurement. The correlation between communication scores and oral examination scores was 0.10. No significant difference was found between passing and failing candidates for measured communication ability. When candidates were grouped by high, moderate and low communication ability, there was no significant difference in their oral certification examination performance. Candidates' communication ability has little relationship to candidate performance on high-stakes, case-based oral examinations. Examiners for this certifying examination focused on assessing candidate decision-making ability and were not influenced by candidate communication ability.

  13. Various Approaches for Targeting Quasar Candidates

    Science.gov (United States)

    Zhang, Y.; Zhao, Y.

    2015-09-01

    With the establishment and development of space-based and ground-based observational facilities, the improvement of scientific output of high-cost facilities is still a hot issue for astronomers. The discovery of new and rare quasars attracts much attention. Different methods to select quasar candidates are in bloom. Among them, some are based on color cuts, some are from multiwavelength data, some rely on variability of quasars, some are based on data mining, and some depend on ensemble methods.

  14. Developing Potential Candidates of Preclinical Preeclampsia

    Directory of Open Access Journals (Sweden)

    Sandra Founds

    2015-11-01

    Full Text Available The potential for developing molecules of interest in preclinical preeclampsia from candidate genes that were discovered on gene expression microarray analysis has been challenged by limited access to additional first trimester trophoblast and decidual tissues. The question of whether these candidates encode secreted proteins that may be detected in maternal circulation early in pregnancy has been investigated using various proteomic methods. Pilot studies utilizing mass spectrometry based proteomic assays, along with enzyme linked immunosorbent assays (ELISAs, and Western immunoblotting in first trimester samples are reported. The novel targeted mass spectrometry methods led to robust multiple reaction monitoring assays. Despite detection of several candidates in early gestation, challenges persist. Future antibody-based studies may lead to a novel multiplex protein panel for screening or detection to prevent or mitigate preeclampsia.

  15. Miniaturization of Micro-Solder Bumps and Effect of IMC on Stress Distribution

    Science.gov (United States)

    Choudhury, Soud Farhan; Ladani, Leila

    2016-07-01

    As the joints become smaller in more advanced packages and devices, intermetallic (IMCs) volume ratio increases, which significantly impacts the overall mechanical behavior of joints. The existence of only a few grains of Sn (Tin) and IMC materials results in anisotropic elastic and plastic behavior which is not detectable using conventional finite element (FE) simulation with average properties for polycrystalline material. In this study, crystal plasticity finite element (CPFE) simulation is used to model the whole joint including copper, Sn solder and Cu6Sn5 IMC material. Experimental lap-shear test results for solder joints from the literature were used to validate the models. A comparative analysis between traditional FE, CPFE and experiments was conducted. The CPFE model was able to correlate the experiments more closely compared to traditional FE analysis because of its ability to capture micro-mechanical anisotropic behavior. Further analysis was conducted to evaluate the effect of IMC thickness on stress distribution in micro-bumps using a systematic numerical experiment with IMC thickness ranging from 0% to 80%. The analysis was conducted on micro-bumps with single crystal Sn and bicrystal Sn. The overall stress distribution and shear deformation changes as the IMC thickness increases. The model with higher IMC thickness shows a stiffer shear response, and provides a higher shear yield strength.

  16. Soldered Power Arm: An Easy and Effective Method for Intrusion and Retraction of Anterior Teeth

    Directory of Open Access Journals (Sweden)

    Ketan K Vakil

    2014-01-01

    Full Text Available The orthodontic correction of deep overbite can be achieved with several mechanisms that will result in true intrusion of anterior teeth, extrusion of posterior teeth, or a combination of both. For the orthodontic correction of bimaxillary dentoalveolar protrusion with deep bite, there are several treatment modalities like segmented arch approach, retraction and intrusion utility arches, temporary anchorage devices. Though not a novel therapeutic concept, the use of miniscrew implants to obtain absolute anchorage has recently become very popular in clinical orthodontic approaches. To allow the use of sliding mechanics for bodily retraction with intrusion of anterior teeth, we devised a soldered power arm (SPA on standard molar tube. It is simple, stable, precise and effective in cases where anterior teeth need to be simultaneously retracted and intruded. A power arm can be readily fabricated from 20 gauge stainless steel wire and soldered on the molar buccal tube so as to avoid any distortion or loosening of power arm from molar tube during the course of the treatment. The SPA works efficiently with the molar being stabilized in all three planes of space. The resultant force vector is directed more apically toward the center of resistance of the anchor unit, which resulted in the treatment outcome of retraction and intrusion of the anterior teeth and correction of the deep bite.

  17. Interactions of Cu-substrates with titanium-alloyed Sn-Zn solders

    Directory of Open Access Journals (Sweden)

    Soares D.

    2006-01-01

    Full Text Available The interactions of copper substrate with titanium-alloyed Sn-Zn eutectic solders have been studied. Two series of experiments have been performed. The first one consisted in differential thermal analyses of Sn-Zn nearly eutectic alloys containing from 1.3 to 2.2 wt. % Ti. Diffusion couples consisted of Cu-wires and Sn-Zn-Ti liquid solders, produced at 250 and 275 OC have been prepared in the second series,. The contact times were up to 3600 s. The contact zones have been characterized by optical and scanning electron microscope. Two layers have been found along the interfaces solid/liquid. The first and the second layers are identical, respectively, with γ and ε phases of the Cu-Zn system. No changes of the chemical compositions were detected for the tested temperatures and reaction times. Continuous parabolic growth of the total diffusion zone thickness with the time of diffusion is observed. The growth is due mainly to one the formed layers (γ while the thickness of the ε-phase layer, stays almost constant for all tested diffusion times and temperatures.

  18. Economical surface treatment of die casting dies to prevent soldering in high pressure casting

    International Nuclear Information System (INIS)

    Fraser, D.T.; Jahedi, M.Z.

    2001-01-01

    This paper describes the use of a gas oxidation treatment of H13 tool steel to develop a compact iron oxide layer at the surface of core pins to prevent soldering in high pressure die casting. The performance of oxide layers in the protection of die steel against soldering during high pressure die casting was tested in a specially designed die using removable core pins and Al-11 Si-3 Cu casting alloy. The gas oxidation treatment can be applied at low temperatures and to large areas of the die surface. In addition this process is very cost effective compared to other coating processes such as physical vapour deposition (PVD), or thermo-reactive diffusion (TRD) coatings. This work demonstrated that surface treatment producing pure magnetite (Fe 3 O 4 ) layers are more protective than oxide layers containing a combination of Fe 3 O 4 (magnetite) and Fe 3 O 3 (haematite). The magnetite layer acts as a barrier between the die steel/casting alloy interface and prevents the formation of inter-metallic phases. Optical microscopy and scanning electron microscope were used to determine the thickness of the oxide layer, while X-ray diffraction was performed to determine the oxide phase structure

  19. Assessment of the effects of the Japanese shift to lead-free solders and its impact on material substitution and environmental emissions by a dynamic material flow analysis

    International Nuclear Information System (INIS)

    Fuse, Masaaki; Tsunemi, Kiyotaka

    2012-01-01

    Lead-free electronics has been extensively studied, whereas their adoption by society and their impact on material substitution and environmental emissions are not well understood. Through a material flow analysis (MFA), this paper explores the life cycle flows for solder-containing metals in Japan, which leads the world in the shift to lead-free solders in electronics. The results indicate that the shift has been progressing rapidly for a decade, and that substitutes for lead in solders, which include silver and copper, are still in the early life cycle stages. The results also show, however, that such substitution slows down during the late life cycle stages owing to long electronic product lifespans. This deceleration of material substitution in the solder life cycle may not only preclude a reduction in lead emissions to air but also accelerate an increase in silver emissions to air and water. As an effective measure against ongoing lead emissions, our scenario analysis suggests an aggressive recycling program for printed circuit boards that utilizes an existing recycling scheme. -- Highlights: ► We model the life cycle flows for solder-containing metals in Japan. ► The Japanese shift to lead-free solders progresses rapidly for a decade. ► Substitution for lead in solders slows down during the late life cycle stages. ► The deceleration of substitution precludes a reduction in lead emissions to air.

  20. Rapidly quenched amorphous and microcrystalline solders for atomic power industry

    International Nuclear Information System (INIS)

    Kalin, V.A.; Fedotov, V.T.; Sevryukov, O.N.; Grigor'ev, A.E.; Skuratov, L.A.; Sulaberidze, V.Sh.; Yurchenko, A.D.; Sokolov, V.F.; Rodionov, V.A.

    1996-01-01

    The possibility of using strip amorphous brazing alloys STEMET on Ni, Cu, Ti or Al base to braze various materials (stainless steels - zirconium, ceramics - metal, copper alloys, titanium alloys, cermets, molybdenum, beryllium) is under study. Experimental bench is designed and brazing regimes are developed for various dissimilar materials. Mechanical and corrosion tests of brazed joints show that rapidly quenching STEMET type brazing alloys are promising materials for manufacturing components of irradiating devices [ru

  1. Effect of cooling rate during solidification of Sn-9Zn lead-free solder alloy on its microstructure, tensile strength and ductile-brittle transition temperature

    Energy Technology Data Exchange (ETDEWEB)

    Prabhu, K.N., E-mail: prabhukn_2002@yahoo.co.in [Department of Metallurgical and Materials Engineering, National Institute of Technology Karnataka, Surathkal, Mangalore 575 025 (India); Deshapande, Parashuram; Satyanarayan [Department of Metallurgical and Materials Engineering, National Institute of Technology Karnataka, Surathkal, Mangalore 575 025 (India)

    2012-01-30

    Highlights: Black-Right-Pointing-Pointer Effect of cooling rate on tensile and impact properties of Sn-9Zn alloy was assessed. Black-Right-Pointing-Pointer Both DBTT and UTS of the solder alloy increased with increase in cooling rate. Black-Right-Pointing-Pointer An optimum cooling rate during solidification would minimize DBTT and maximize UTS. - Abstract: Solidification rate is an important variable during processing of materials, including soldering, involving solidification. The rate of solidification controls the metallurgical microstructure at the solder joint and hence the mechanical properties. A high tensile strength and a lower ductile-brittle transition temperature are necessary for reliability of solder joints in electronic circuits. Hence in the present work, the effect of cooling rate during solidification on microstructure, impact and tensile properties of Sn-9Zn lead-free solder alloy was investigated. Four different cooling media (copper and stainless steel moulds, air and furnace cooling) were used for solidification to achieve different cooling rates. Solder alloy solidified in copper mould exhibited higher cooling rate as compared to other cooling media. The microstructure is refined as the cooling rate was increased from 0.03 to 25 Degree-Sign C/s. With increase in cooling rate it was observed that the size of Zn flakes became finer and distributed uniformly throughout the matrix. Ductile-to-brittle transition temperature (DBTT) of the solder alloy increased with increase in cooling rate. Fractured surfaces of impact test specimens showed cleavage like appearance and river like pattern at very low temperatures and dimple like appearance at higher temperatures. The tensile strength of the solder alloy solidified in Cu and stainless moulds were higher as compared to air and furnace cooled samples. It is therefore suggested that the cooling rate during solidification of the solder alloy should be optimum to maximize the strength and minimize the

  2. Effect of cooling rate during solidification of Sn–9Zn lead-free solder alloy on its microstructure, tensile strength and ductile–brittle transition temperature

    International Nuclear Information System (INIS)

    Prabhu, K.N.; Deshapande, Parashuram; Satyanarayan

    2012-01-01

    Highlights: ► Effect of cooling rate on tensile and impact properties of Sn–9Zn alloy was assessed. ► Both DBTT and UTS of the solder alloy increased with increase in cooling rate. ► An optimum cooling rate during solidification would minimize DBTT and maximize UTS. - Abstract: Solidification rate is an important variable during processing of materials, including soldering, involving solidification. The rate of solidification controls the metallurgical microstructure at the solder joint and hence the mechanical properties. A high tensile strength and a lower ductile–brittle transition temperature are necessary for reliability of solder joints in electronic circuits. Hence in the present work, the effect of cooling rate during solidification on microstructure, impact and tensile properties of Sn–9Zn lead-free solder alloy was investigated. Four different cooling media (copper and stainless steel moulds, air and furnace cooling) were used for solidification to achieve different cooling rates. Solder alloy solidified in copper mould exhibited higher cooling rate as compared to other cooling media. The microstructure is refined as the cooling rate was increased from 0.03 to 25 °C/s. With increase in cooling rate it was observed that the size of Zn flakes became finer and distributed uniformly throughout the matrix. Ductile-to-brittle transition temperature (DBTT) of the solder alloy increased with increase in cooling rate. Fractured surfaces of impact test specimens showed cleavage like appearance and river like pattern at very low temperatures and dimple like appearance at higher temperatures. The tensile strength of the solder alloy solidified in Cu and stainless moulds were higher as compared to air and furnace cooled samples. It is therefore suggested that the cooling rate during solidification of the solder alloy should be optimum to maximize the strength and minimize the DBTT.

  3. Three-dimensional (3D) visualization of reflow porosity and modeling of deformation in Pb-free solder joints

    International Nuclear Information System (INIS)

    Dudek, M.A.; Hunter, L.; Kranz, S.; Williams, J.J.; Lau, S.H.; Chawla, N.

    2010-01-01

    The volume, size, and dispersion of porosity in solder joints are known to affect mechanical performance and reliability. Most of the techniques used to characterize the three-dimensional (3D) nature of these defects are destructive. With the enhancements in high resolution computed tomography (CT), the detection limits of intrinsic microstructures have been significantly improved. Furthermore, the 3D microstructure of the material can be used in finite element models to understand their effect on microscopic deformation. In this paper we describe a technique utilizing high resolution (< 1 μm) X-ray tomography for the three-dimensional (3D) visualization of pores in Sn-3.9Ag-0.7Cu/Cu joints. The characteristics of reflow porosity, including volume fraction and distribution, were investigated for two reflow profiles. The size and distribution of porosity size were visualized in 3D for four different solder joints. In addition, the 3D virtual microstructure was incorporated into a finite element model to quantify the effect of voids on the lap shear behavior of a solder joint. The presence, size, and location of voids significantly increased the severity of strain localization at the solder/copper interface.

  4. In-situ Investigation of Lead-free Solder Alloy Formation Using a Hot-plate Microscope

    DEFF Research Database (Denmark)

    Bergmann, René; Tang, Peter Torben; Hansen, Hans Nørgaard

    2007-01-01

    This work presents the advantages of using a hot-plate microscope for investigation of new (high-temperature) lead- free solders as in-situ analysis tool and preparation equipment. A description of the equipment and the preparation method is given and some examples are outlined. The formation...

  5. Characterization of the Gray Whale Eschrichtius robustus Genome and a Genotyping Array Based on Single-Nucleotide Polymorphisms in Candidate Genes.

    Science.gov (United States)

    DeWoody, J Andrew; Fernandez, Nadia B; Brüniche-Olsen, Anna; Antonides, Jennifer D; Doyle, Jacqueline M; San Miguel, Phillip; Westerman, Rick; Vertyankin, Vladimir V; Godard-Codding, Céline A J; Bickham, John W

    2017-06-01

    Genetic and genomic approaches have much to offer in terms of ecology, evolution, and conservation. To better understand the biology of the gray whale Eschrichtius robustus (Lilljeborg, 1861), we sequenced the genome and produced an assembly that contains ∼95% of the genes known to be highly conserved among eukaryotes. From this assembly, we annotated 22,711 genes and identified 2,057,254 single-nucleotide polymorphisms (SNPs). Using this assembly, we generated a curated list of candidate genes potentially subject to strong natural selection, including genes associated with osmoregulation, oxygen binding and delivery, and other aspects of marine life. From these candidate genes, we queried 92 autosomal protein-coding markers with a panel of 96 SNPs that also included 2 sexing and 2 mitochondrial markers. Genotyping error rates, calculated across loci and across 69 intentional replicate samples, were low (0.021%), and observed heterozygosity was 0.33 averaged over all autosomal markers. This level of variability provides substantial discriminatory power across loci (mean probability of identity of 1.6 × 10 -25 and mean probability of exclusion >0.999 with neither parent known), indicating that these markers provide a powerful means to assess parentage and relatedness in gray whales. We found 29 unique multilocus genotypes represented among our 36 biopsies (indicating that we inadvertently sampled 7 whales twice). In total, we compiled an individual data set of 28 western gray whales (WGSs) and 1 presumptive eastern gray whale (EGW). The lone EGW we sampled was no more or less related to the WGWs than expected by chance alone. The gray whale genomes reported here will enable comparative studies of natural selection in cetaceans, and the SNP markers should be highly informative for future studies of gray whale evolution, population structure, demography, and relatedness.

  6. Intergranular stress corrosion in soldered joints of stainless steel 304

    International Nuclear Information System (INIS)

    Zamora R, L.

    1994-01-01

    The intergranular stress cracking of welded joints of austenitic stainless steel, AISI 304, is a serious problem in BWR type reactors. It is associated with the simultaneous presence of three factors; stress, a critical media and sensibilization (DOS). EPR technique was used in order to verify the sensibilization degree in the base metal, and the zone affected by heat and welding material. The characterization of material was done. The objective of this work is the study of microstructure and the evaluation of EPR technique used for the determination of DOS in a welded plate of austenitic stainless steel AISI 304. (Author)

  7. High temperature soldering of the VT14 titanium alloy

    International Nuclear Information System (INIS)

    Besednyj, V.A.

    1978-01-01

    Two methods of brazing the VT14 alloys have been investigated, as well as the effect of annealing and heating during brazing and on mechanical properties of this alloy. Contact reaction brazing using a palladium layer has been shown to be applicable for simple-shape products, while capillary brazing using Cu-Ti, Ni-Ti and Fe-Ti brazing alloy systems, for complex-shape products. Brazed joints strength is similar to the strength of the VT14 alloy. Heating during brazing (960 deg - 1160 deg C) and the following annealing (900 deg C) have but a slight effect on the properties of the base metal, reducing strength by 2-5% and increasing ductility by 10-20%

  8. BEEF CATTLE MUSCULARITY CANDIDATE GENES

    Directory of Open Access Journals (Sweden)

    Irida Novianti

    2010-04-01

    Full Text Available Muscularity is a potential indicator for the selection of more productive cattle. Mapping quantitative trait loci (QTL for traits related to muscularity is useful to identify the genomic regions where the genes affecting muscularity reside. QTL analysis from a Limousin-Jersey double backcross herd was conducted using QTL Express software with cohort and breed as the fixed effects. Nine QTL suggested to have an association with muscularity were identified on cattle chromosomes BTA 1, 2, 3, 4, 5, 8, 12, 14 and 17. The myostatin gene is located at the centromeric end of chromosome 2 and not surprisingly, the Limousin myostatin F94L variant accounted for the QTL on BTA2. However, when the myostatin F94L genotype was included as an additional fixed effect, the QTL on BTA17 was also no longer significant. This result suggests that there may be gene(s that have epistatic effects with myostatin located on cattle chromosome 17. Based on the position of the QTL in base pairs, all the genes that reside in the region were determined using the Ensembl data base (www.ensembl.org. There were two potential candidate genes residing within these QTL regions were selected. They were Smad nuclear interacting protein 1 (SNIP1 and similar to follistatin-like 5 (FSTL5. (JIIPB 2010 Vol 20 No 1: 1-10

  9. Rapid Solidification of Sn-Cu-Al Alloys for High-Reliability, Lead-Free Solder: Part I. Microstructural Characterization of Rapidly Solidified Solders

    Science.gov (United States)

    Reeve, Kathlene N.; Choquette, Stephanie M.; Anderson, Iver E.; Handwerker, Carol A.

    2016-12-01

    Particles of Cu x Al y in Sn-Cu-Al solders have previously been shown to nucleate the Cu6Sn5 phase during solidification. In this study, the number and size of Cu6Sn5 nucleation sites were controlled through the particle size refinement of Cu x Al y via rapid solidification processing and controlled cooling in a differential scanning calorimeter. Cooling rates spanning eight orders of magnitude were used to refine the average Cu x Al y and Cu6Sn5 particle sizes down to submicron ranges. The average particle sizes, particle size distributions, and morphologies in the microstructures were analyzed as a function of alloy composition and cooling rate. Deep etching of the samples revealed the three-dimensional microstructures and illuminated the epitaxial and morphological relationships between the Cu x Al y and Cu6Sn5 phases. Transitions in the Cu6Sn5 particle morphologies from faceted rods to nonfaceted, equiaxed particles were observed as a function of both cooling rate and composition. Initial solidification cooling rates within the range of 103 to 104 °C/s were found to be optimal for realizing particle size refinement and maintaining the Cu x Al y /Cu6Sn5 nucleant relationship. In addition, little evidence of the formation or decomposition of the ternary- β phase in the solidified alloys was noted. Solidification pathways omitting the formation of the ternary- β phase agreed well with observed room temperature microstructures.

  10. SU-B-213-00: Education Council Symposium: Accreditation and Certification: Establishing Educational Standards and Evaluating Candidates Based on these Standards

    International Nuclear Information System (INIS)

    2015-01-01

    The North American medical physics community validates the education received by medical physicists and the clinical qualifications for medical physicists through accreditation of educational programs and certification of medical physicists. Medical physics educational programs (graduate education and residency education) are accredited by the Commission on Accreditation of Medical Physics Education Programs (CAMPEP), whereas medical physicists are certified by several organizations, the most familiar of which is the American Board of Radiology (ABR). In order for an educational program to become accredited or a medical physicist to become certified, the applicant must meet certain specified standards set by the appropriate organization. In this Symposium, representatives from both CAMPEP and the ABR will describe the process by which standards are established as well as the process by which qualifications of candidates for accreditation or certification are shown to be compliant with these standards. The Symposium will conclude with a panel discussion. Learning Objectives: Recognize the difference between accreditation of an educational program and certification of an individual Identify the two organizations primarily responsible for these tasks Describe the development of educational standards Describe the process by which examination questions are developed GS is Executive Secretary of CAMPEP

  11. Identification of Candidate Genes Involved in the Salt Tolerance of Date Palm (Phoenix dactylifera L.) Based on a Yeast Functional Bioassay.

    Science.gov (United States)

    Patankar, Himanshu V; Al-Harrasi, Ibtisam; Al-Yahyai, Rashid; Yaish, Mahmoud W

    2018-06-01

    Although date palm is a relatively salt-tolerant plant, the molecular basis of this tolerance is complex and poorly understood. Therefore, this study aimed to identify the genes involved in salinity tolerance using a basic yeast functional bioassay. To achieve this, a date palm cDNA library was overexpressed in Saccharomyces cerevisiae cells. The expression levels of selected genes that make yeast cells tolerant to salt were subsequently validated in the leaf and root tissues of date palm seedlings using a quantitative PCR method. About 6000 yeast transformant cells were replica printed and screened on a synthetic minimal medium containing 1.0 M of NaCl. The screening results showed the presence of 62 salt-tolerant transformant colonies. Sequence analysis of the recombinant yeast plasmids revealed the presence of a group of genes with potential salt-tolerance functions, such as aquaporins (PIP), serine/threonine protein kinases (STKs), ethylene-responsive transcription factor 1 (ERF1), and peroxidases (PRX). The expression pattern of the selected genes endorsed the hypothesis that these genes may be involved in salinity tolerance, as they showed a significant (p < 0.05) overexpression trend in both the leaf and root tissues in response to salinity. The genes identified in this project are suitable candidates for the further functional characterization of date palms.

  12. Measurement of erosion of stainless steel by molten lead-free solder using micro-focus x-ray CT system

    International Nuclear Information System (INIS)

    Nishikawa, Hiroshi; Takemoto, Tadashi; Kang, Songai

    2009-01-01

    The severe erosion damage, which is caused by a molten lead-free solder, of wave solder equipment made into stainless steel has been encountered in operation. Then, the higher maintenance frequency and reduced life time of wave solder machine component is a serious issue in a manufacturing process. In this study, the evaluation method of erosion of stainless steel by molten lead-free solders was investigated using micro-focus X-ray systems for fluoroscopic and computed tomography (CT). As a result, it was found that the fluoroscopic image could truly reconstruct the cross-shape of the stainless steel sample after immersion test without destruction. In the case of X-ray systems for fluoroscopic and CT used in this study, three-dimensional data can be obtained. Therefore, it was possible to easily check the whole picture of the test sample after immersion test and to decide the maximum erosion depth of test sample. (author)

  13. Determination of Te in soldering tin using continuous flowing electrochemical hydride generation atomic fluorescence spectrometry

    International Nuclear Information System (INIS)

    Jiang Xianjuan; Gan Wuer; Han Suping; He Youzhao

    2008-01-01

    An electrochemical hydride generation system was developed for the detection of Te by coupling an electrochemical hydride generator with atomic fluorescence spectrometry. Since TeH 2 is unstable and easily decomposes in solution, a reticular W filament cathode was used in the present system. The TeH 2 generated on the cathode surface was effectively driven out by sweeping gas from the cathode chamber. In addition, a low temperature electrochemical cell (10 deg. C) was applied to reduce the decomposition of TeH 2 in solution. The limit of detection (LOD) was 2.2 ng ml -1 and the relative standard deviation (RSD) was 3.9% for nine consecutive measurements of standard solution. This method was successfully employed for determination of Te in soldering tin material

  14. Enhanced mucosal immune responses induced by a combined candidate mucosal vaccine based on Hepatitis A virus and Hepatitis E virus structural proteins linked to tuftsin.

    Science.gov (United States)

    Gao, Yan; Su, Qiudong; Yi, Yao; Jia, Zhiyuan; Wang, Hao; Lu, Xuexin; Qiu, Feng; Bi, Shengli

    2015-01-01

    Hepatitis A virus (HAV) and Hepatitis E virus (HEV) are the most common causes of infectious hepatitis. These viruses are spread largely by the fecal-oral route and lead to clinically important disease in developing countries. To evaluate the potential of targeting hepatitis A and E infection simultaneously, a combined mucosal candidate vaccine was developed with the partial open reading frame 2 (ORF2) sequence (aa 368-607) of HEV (HE-ORF2) and partial virus protein 1 (VP1) sequence (aa 1-198) of HAV (HA-VP1), which included the viral neutralization epitopes. Tuftsin is an immunostimulatory peptide which can enhance the immunogenicity of a protein by targeting it to macrophages and dendritic cells. Here, we developed a novel combined protein vaccine by conjugating tuftsin to HE-ORF2 and HA-VP1 and used synthetic CpG oligodeoxynucleotides (ODNs) as the adjuvant. Subsequent experiments in BALB/c mice demonstrated that tuftsin enhanced the serum-specific IgG and IgA antibodies against HEV and HAV at the intestinal, vaginal and pulmonary interface when delivered intranasally. Moreover, mice from the intranasally immunized tuftsin group (HE-ORF2-tuftsin + HA-VP1-tuftsin + CpG) showed higher levels of IFN-γ-secreting splenocytes (Th1 response) and ratio of CD4+/CD8+ T cells than those of the no-tuftsin group (HE-ORF2 + HA-VP1 + CpG). Thus, the tuftsin group generated stronger humoral and cellular immune responses compared with the no-tuftsin group. Moreover, enhanced responses to the combined protein vaccine were obtained by intranasal immunization compared with intramuscular injection. By integrating HE-ORF2, HA-VP1 and tuftsin in a vaccine, this study validated an important concept for further development of a combined mucosal vaccine against hepatitis A and E infection.

  15. Towards disentangling natural and anthropogenic GHG emissions by space-based atmospheric concentration imaging - The CarbonSat Earth Explorer 8 Candidate Mission

    Science.gov (United States)

    Bovensmann, Heinrich; Gerilowski, Konstantin; Krings, Thomas; Reuter, Max; Burrows, John P.; Buchwitz, Michael; Bösch, Hartmut; Brunner, Dominik; Ciais, Philippe; Breon, Francois-Marie; Crisp, David; Dolman, Han; Hayman, Garry; Houweling, Sander; Lichtenberg, Günter; Ingmann, Paul; Meijer, Yasjka

    2013-04-01

    CarbonSat was selected by ESA as a candidate for the 8 Earth Explorer Opportunity (EE8). The objective of the CarbonSat mission is to determine natural and anthropogenic sources and sinks of the two most important greenhouse gases, carbon dioxide and methane. The unique features of the CarbonSat mission concept are that it offers a combination of high spatial resolution (2 x 2 km2) and broad swath (240 km) to provide global imaging of localised strong emission source areas such as large cities (Megacities), landfills, power plants, volcanoes, etc. and to be able to separate anthropogenic from natural fluxes. In addition, CarbonSat data will also quantify natural fluxes of CO2 and CH4 (biospheric CO2, wetland CH4 etc.) and their changes, to better understand these important sources and sinks and their sensitivity to a changing climate. CarbonSat aims to deliver global data sets of dry column mixing ratios of CO2 and CH4 with high precision (goal: CO2 concept builds on the heritage and lessons learned from SCIAMACHY (2002-2012), GOSAT (2009-present) and OCO-2 (2014 onwards) to make scientifically and strategically important measurements of the amounts and distribution of CO2 and CH4 for biogeochemical and climate change research. CarbonSat entered industrial system feasibility activities in 2012, which are supported by scientific studies and campaigns. The current status of the mission concept and selected results from the scientific studies documenting the expected data quality and characteristics will be presented.

  16. Query by image example: The CANDID approach

    Energy Technology Data Exchange (ETDEWEB)

    Kelly, P.M.; Cannon, M. [Los Alamos National Lab., NM (United States). Computer Research and Applications Group; Hush, D.R. [Univ. of New Mexico, Albuquerque, NM (United States). Dept. of Electrical and Computer Engineering

    1995-02-01

    CANDID (Comparison Algorithm for Navigating Digital Image Databases) was developed to enable content-based retrieval of digital imagery from large databases using a query-by-example methodology. A user provides an example image to the system, and images in the database that are similar to that example are retrieved. The development of CANDID was inspired by the N-gram approach to document fingerprinting, where a ``global signature`` is computed for every document in a database and these signatures are compared to one another to determine the similarity between any two documents. CANDID computes a global signature for every image in a database, where the signature is derived from various image features such as localized texture, shape, or color information. A distance between probability density functions of feature vectors is then used to compare signatures. In this paper, the authors present CANDID and highlight two results from their current research: subtracting a ``background`` signature from every signature in a database in an attempt to improve system performance when using inner-product similarity measures, and visualizing the contribution of individual pixels in the matching process. These ideas are applicable to any histogram-based comparison technique.

  17. Effects of aging time on the mechanical properties of Sn–9Zn–1.5Ag–xBi lead-free solder alloys

    Energy Technology Data Exchange (ETDEWEB)

    Liu, Chih-Yao [Department of Materials Science and Engineering, National Cheng Kung University, 1 Ta-Hsueh Road, Tainan 70101, Taiwan (China); Hon, Min-Hsiung [Department of Materials Science and Engineering, National Cheng Kung University, 1 Ta-Hsueh Road, Tainan 70101, Taiwan (China); Department of Mechanical Engineering, National Kaohsiung University of Applied Sciences, 415 Chien-Kung Road, Kaohsiung 80782, Taiwan (China); Wang, Moo-Chin, E-mail: mcwang@kmu.edu.tw [Department of Fragrance and Cosmetic Science, Kaohsiung Medical University, 100, Shih-Chuan 1st Road, Kaohsiung 80728, Taiwan (China); Chen, Ying-Ru; Chang, Kuo-Ming; Li, Wang-Long [Institute of Nanotechnology and Microsystems Engineering, National Cheng Kung University, No. 1, University Road, Tainan 70101, Taiwan (China)

    2014-01-05

    Highlights: • The microstructure of these solder alloys are composed of Sn-rich phase and Ag{sub 3}Sn. • The grain size of Sn–9Zn–1.5Ag–xBi solder alloys increases with rose aging time. • The maximum yield strength is 112.7 ± 2.2 MPa for Sn–9Zn–1.5Ag–3Bi solder alloys. • TEM observed that Bi appears as oblong shape fine particles. -- Abstract: The effects of aging time on the mechanical properties of the Sn–9Zn–1.5Ag–xBi lead-free solder alloys are investigated using scanning electron microscopy (SEM), X-ray diffraction (XRD), transmission electron microscopy (TEM), selected area electron diffraction (SAED), energy dispersive spectrometry (EDS) and a universal testing machine. The experimental results show that the microstructure of Sn–9Zn–1.5Ag–xBi solder alloys is composed of Sn-rich phase and AgZn{sub 3}. No other intermetallic compounds (IMCs) with Bi content was observed in the solder matrix for Sn–9Zn–1.5Ag solder alloys with various Bi contents before and after aging at 150 °C for different durations. The lattice parameter increases significantly with increasing aging time or Bi addition. The size of Sn-rich grain increased gradually with aging time increased, but decreases with Bi content increases. The maximum yield strength is 112.7 ± 2.2 MPa for Sn–9Zn–1.5Ag–3Bi solder alloy before aging.

  18. Effects of aging time on the mechanical properties of Sn–9Zn–1.5Ag–xBi lead-free solder alloys

    International Nuclear Information System (INIS)

    Liu, Chih-Yao; Hon, Min-Hsiung; Wang, Moo-Chin; Chen, Ying-Ru; Chang, Kuo-Ming; Li, Wang-Long

    2014-01-01

    Highlights: • The microstructure of these solder alloys are composed of Sn-rich phase and Ag 3 Sn. • The grain size of Sn–9Zn–1.5Ag–xBi solder alloys increases with rose aging time. • The maximum yield strength is 112.7 ± 2.2 MPa for Sn–9Zn–1.5Ag–3Bi solder alloys. • TEM observed that Bi appears as oblong shape fine particles. -- Abstract: The effects of aging time on the mechanical properties of the Sn–9Zn–1.5Ag–xBi lead-free solder alloys are investigated using scanning electron microscopy (SEM), X-ray diffraction (XRD), transmission electron microscopy (TEM), selected area electron diffraction (SAED), energy dispersive spectrometry (EDS) and a universal testing machine. The experimental results show that the microstructure of Sn–9Zn–1.5Ag–xBi solder alloys is composed of Sn-rich phase and AgZn 3 . No other intermetallic compounds (IMCs) with Bi content was observed in the solder matrix for Sn–9Zn–1.5Ag solder alloys with various Bi contents before and after aging at 150 °C for different durations. The lattice parameter increases significantly with increasing aging time or Bi addition. The size of Sn-rich grain increased gradually with aging time increased, but decreases with Bi content increases. The maximum yield strength is 112.7 ± 2.2 MPa for Sn–9Zn–1.5Ag–3Bi solder alloy before aging

  19. Effects of metallic nanoparticle doped flux on the interfacial intermetallic compounds between lead-free solder ball and copper substrate

    International Nuclear Information System (INIS)

    Sujan, G.K.; Haseeb, A.S.M.A.; Afifi, A.B.M.

    2014-01-01

    Lead free solders currently in use are prone to develop thick interfacial intermetallic compound layers with rough morphology which are detrimental to the long term solder joint reliability. A novel method has been developed to control the morphology and growth of intermetallic compound layers between lead-free Sn–3.0Ag–0.5Cu solder ball and copper substrate by doping a water soluble flux with metallic nanoparticles. Four types of metallic nanoparticles (nickel, cobalt, molybdenum and titanium) were used to investigate their effects on the wetting behavior and interfacial microstructural evaluations after reflow. Nanoparticles were dispersed manually with a water soluble flux and the resulting nanoparticle doped flux was placed on copper substrate. Lead-free Sn–3.0Ag–0.5Cu solder balls of diameter 0.45 mm were placed on top of the flux and were reflowed at a peak temperature of 240 °C for 45 s. Angle of contact, wetting area and interfacial microstructure were studied by optical microscopy, field emission scanning electron microscopy and energy-dispersive X-ray spectroscopy. It was observed that the angle of contact increased and wetting area decreased with the addition of cobalt, molybdenum and titanium nanoparticles to flux. On the other hand, wettability improved with the addition of nickel nanoparticles. Cross-sectional micrographs revealed that both nickel and cobalt nanoparticle doping transformed the morphology of Cu 6 Sn 5 from a typical scallop type to a planer one and reduced the intermetallic compound thickness under optimum condition. These effects were suggested to be related to in-situ interfacial alloying at the interface during reflow. The minimum amount of nanoparticles required to produce the planer morphology was found to be 0.1 wt.% for both nickel and cobalt. Molybdenum and titanium nanoparticles neither appear to undergo alloying during reflow nor have any influence at the solder/substrate interfacial reaction. Thus, doping of flux

  20. Effects of metallic nanoparticle doped flux on the interfacial intermetallic compounds between lead-free solder ball and copper substrate

    Energy Technology Data Exchange (ETDEWEB)

    Sujan, G.K., E-mail: sgkumer@gmail.com; Haseeb, A.S.M.A., E-mail: haseeb@um.edu.my; Afifi, A.B.M., E-mail: amalina@um.edu.my

    2014-11-15

    Lead free solders currently in use are prone to develop thick interfacial intermetallic compound layers with rough morphology which are detrimental to the long term solder joint reliability. A novel method has been developed to control the morphology and growth of intermetallic compound layers between lead-free Sn–3.0Ag–0.5Cu solder ball and copper substrate by doping a water soluble flux with metallic nanoparticles. Four types of metallic nanoparticles (nickel, cobalt, molybdenum and titanium) were used to investigate their effects on the wetting behavior and interfacial microstructural evaluations after reflow. Nanoparticles were dispersed manually with a water soluble flux and the resulting nanoparticle doped flux was placed on copper substrate. Lead-free Sn–3.0Ag–0.5Cu solder balls of diameter 0.45 mm were placed on top of the flux and were reflowed at a peak temperature of 240 °C for 45 s. Angle of contact, wetting area and interfacial microstructure were studied by optical microscopy, field emission scanning electron microscopy and energy-dispersive X-ray spectroscopy. It was observed that the angle of contact increased and wetting area decreased with the addition of cobalt, molybdenum and titanium nanoparticles to flux. On the other hand, wettability improved with the addition of nickel nanoparticles. Cross-sectional micrographs revealed that both nickel and cobalt nanoparticle doping transformed the morphology of Cu{sub 6}Sn{sub 5} from a typical scallop type to a planer one and reduced the intermetallic compound thickness under optimum condition. These effects were suggested to be related to in-situ interfacial alloying at the interface during reflow. The minimum amount of nanoparticles required to produce the planer morphology was found to be 0.1 wt.% for both nickel and cobalt. Molybdenum and titanium nanoparticles neither appear to undergo alloying during reflow nor have any influence at the solder/substrate interfacial reaction. Thus, doping

  1. Mechanistic Prediction of the Effect of Microstructural Coarsening on Creep Response of SnAgCu Solder Joints

    Science.gov (United States)

    Mukherjee, S.; Chauhan, P.; Osterman, M.; Dasgupta, A.; Pecht, M.

    2016-07-01

    Mechanistic microstructural models have been developed to capture the effect of isothermal aging on time dependent viscoplastic response of Sn3.0Ag0.5Cu (SAC305) solders. SnAgCu (SAC) solders undergo continuous microstructural coarsening during both storage and service because of their high homologous temperature. The microstructures of these low melting point alloys continuously evolve during service. This results in evolution of creep properties of the joint over time, thereby influencing the long term reliability of microelectronic packages. It is well documented that isothermal aging degrades the creep resistance of SAC solder. SAC305 alloy is aged for (24-1000) h at (25-100)°C (~0.6-0.8 × T melt). Cross-sectioning and image processing techniques were used to periodically quantify the effect of isothermal aging on phase coarsening and evolution. The parameters monitored during isothermal aging include size, area fraction, and inter-particle spacing of nanoscale Ag3Sn intermetallic compounds (IMCs) and the volume fraction of micronscale Cu6Sn5 IMCs, as well as the area fraction of pure tin dendrites. Effects of microstructural evolution on secondary creep constitutive response of SAC305 solder joints were then modeled using a mechanistic multiscale creep model. The mechanistic phenomena modeled include: (1) dispersion strengthening by coarsened nanoscale Ag3Sn IMCs in the eutectic phase; and (2) load sharing between pro-eutectic Sn dendrites and the surrounding coarsened eutectic Sn-Ag phase and microscale Cu6Sn5 IMCs. The coarse-grained polycrystalline Sn microstructure in SAC305 solder was not captured in the above model because isothermal aging does not cause any significant change in the initial grain size and orientation of SAC305 solder joints. The above mechanistic model can successfully capture the drop in creep resistance due to the influence of isothermal aging on SAC305 single crystals. Contribution of grain boundary sliding to the creep strain of

  2. Democratic candidates call for change in the health care system: wider use of home and community-based care, chronic disease management, universal coverage, and greater use of telehealth.

    Science.gov (United States)

    Marsh, Aaron G

    2008-10-01

    Senator Barack Obama, the Democratic candidate for president, and Senator Joe Biden, the party's candidate for vice president, have made health care reform a central pillar of their campaign. The Democrats want to target the 12 percent of Americans who are responsible for 69 percent of health care costs. Such individuals generally have multiple and complex health care problems, which if left untreated, require them to seek care in hospital emergency rooms which are vastly overcrowded. In order to solve the problem, they believe first that universal coverage along the lines of the Federal Government Employees' health plan is necessary, followed by a shift away from institutionally-based care, making home and community-based care, which integrates telehealth and other technologies, the norm. The party's platform includes this committment to help solve the problem of long-term care, which affects not only the nation's 35 million elderly, but increasingly will affect the 78 million baby boomers who are entering their retirement years.

  3. Pyrosequencing-based assessment of the bacteria diversity in surface and subsurface peat layers of a northern wetland, with focus on poorly studied phyla and candidate divisions.

    Science.gov (United States)

    Serkebaeva, Yulia M; Kim, Yongkyu; Liesack, Werner; Dedysh, Svetlana N

    2013-01-01

    Northern peatlands play a key role in the global carbon and water budget, but the bacterial diversity in these ecosystems remains poorly described. Here, we compared the bacterial community composition in the surface (0-5 cm depth) and subsurface (45-50 cm) peat layers of an acidic (pH 4.0) Sphagnum-dominated wetland, using pyrosequencing of 16S rRNA genes. The denoised sequences (37,229 reads, average length ∼430 bp) were affiliated with 27 bacterial phyla and corresponded to 1,269 operational taxonomic units (OTUs) determined at 97% sequence identity. Abundant OTUs were affiliated with the Acidobacteria (35.5±2.4% and 39.2±1.2% of all classified sequences in surface and subsurface peat, respectively), Alphaproteobacteria (15.9±1.7% and 25.8±1.4%), Actinobacteria (9.5±2.0% and 10.7±0.5%), Verrucomicrobia (8.5±1.4% and 0.6±0.2%), Planctomycetes (5.8±0.4% and 9.7±0.6%), Deltaproteobacteria (7.1±0.4% and 4.4%±0.3%), and Gammaproteobacteria (6.6±0.4% and 2.1±0.1%). The taxonomic patterns of the abundant OTUs were uniform across all the subsamples taken from each peat layer. In contrast, the taxonomic patterns of rare OTUs were different from those of the abundant OTUs and varied greatly among subsamples, in both surface and subsurface peat. In addition to the bacterial taxa listed above, rare OTUs represented the following groups: Armatimonadetes, Bacteroidetes, Chlamydia, Chloroflexi, Cyanobacteria, Elusimicrobia, Fibrobacteres, Firmicutes, Gemmatimonadetes, Spirochaetes, AD3, WS1, WS4, WS5, WYO, OD1, OP3, BRC1, TM6, TM7, WPS-2, and FCPU426. OTU richness was notably higher in the surface layer (882 OTUs) than in the anoxic subsurface peat (483 OTUs), with only 96 OTUs common to both data sets. Most members of poorly studied phyla, such as the Acidobacteria, Verrucomicrobia, Planctomycetes and the candidate division TM6, showed a clear preference for growth in either oxic or anoxic conditions. Apparently, the bacterial communities in surface and

  4. An annotated history of container candidate material selection

    International Nuclear Information System (INIS)

    McCright, R.D.

    1988-07-01

    This paper documents events in the Nevada Nuclear Waste Storage Investigations (NNWSI) Project that have influenced the selection of metals and alloys proposed for fabrication of waste package containers for permanent disposal of high-level nuclear waste in a repository at Yucca Mountain, Nevada. The time period from 1981 to 1988 is covered in this annotated history. The history traces the candidate materials that have been considered at different stages of site characterization planning activities. At present, six candidate materials are considered and described in the 1988 Consultation Draft of the NNWSI Site Characterization Plan (SCP). The six materials are grouped into two alloy families, copper-base materials and iron to nickel-base materials with an austenitic structure. The three austenitic candidates resulted from a 1983 survey of a longer list of candidate materials; the other three candidates resulted from a special request from DOE in 1984 to evaluate copper and copper-base alloys. 24 refs., 2 tabs

  5. Metaphors of Social Studies Teacher Candidates on Democracy

    Science.gov (United States)

    Tural, Aysegül

    2018-01-01

    Democracy is a form of government in which principle of equality is based, human rights and freedoms are protected. In this research, it is aimed to reveal democracy perceptions of social science teacher candidates through metaphors. Towards this aim, 105 social science teacher candidates are consulted about their democracy opinions. Study is a…

  6. Evaluation of a Bacillus direct-fed microbial candidate on digesta viscosity, bacterial translocation, microbiota composition and bone mineralisation in broiler chickens fed on a rye-based diet.

    Science.gov (United States)

    Latorre, J D; Hernandez-Velasco, X; Bielke, L R; Vicente, J L; Wolfenden, R; Menconi, A; Hargis, B M; Tellez, G

    2015-01-01

    1. The effects of the dietary inclusion of a Bacillus-based direct-fed microbial (DFM) candidate on digesta viscosity, bacterial translocation, microbiota composition and bone mineralisation were evaluated in broilers consuming rye-based diets. 2. In the present study, control mash rye-based diets (CON) or Bacillus-DFM supplemented diets (TRT) were administered ad libitum to male broilers in three independent experiments. 3. In Experiments 1 and 2 (n = 25/group), liver samples were taken to evaluate bacterial translocation, digesta samples were used for viscosity measurements and the intestinal microbial flora was evaluated from different intestinal sections to enumerate total recovered gram-negative bacteria (TGB), lactic acid bacteria (LAB) and anaerobic bacteria (TAB). Additionally, both tibias were removed for assessment of bone quality. 4. In Experiment 3, each experimental group had 8 replicates of 20 chickens (n = 160/group). Weekly, body weight (BW), feed intake (FI) and feed conversion ratio (FCR) were evaluated. At d 28-of-age, samples were taken to determine bacterial translocation, digesta viscosity and bone quality characteristics. 5. In all experiments, consumption of Bacillus-DFM reduced bacterial translocation to the liver and digesta viscosity. Additionally, DFM supplementation improved BW, bone quality measurements and FCR. Moreover, chickens fed on the Bacillus-DFM diet in Experiments 1 and 2 showed a significant reduction in the number of gram-negative and anaerobic bacteria in the duodenal content compared to control. 6. In summary, chickens fed on a rye-based diet without DFM inclusion showed an increase in bacterial translocation and digesta viscosity, accompanied by reduced performance and bone quality variables relative to the Bacillus-DFM candidate group. Hence, incorporation into the feed of a selected DFM ameliorated the adverse anti-nutritional effects related to utilisation of rye-based diets in broilers chickens.

  7. Aging effects on the microstructure, surface characteristics and wettability of Cu pretinned with Sn-Pb solders

    Energy Technology Data Exchange (ETDEWEB)

    Linch, Heidi Sue [Univ. of California, Berkeley, CA (United States)

    1993-11-01

    This study investigates effects of aging in air and argon at 170 C on Cu coupons which were pretinned with 75Sn-25Pb, 8Sn-92Pb, and 5Sn-95Pb solders. Coatings were applied using electroplating or hot dipping techniques. The coating thickness was controlled between 3 to 3μm and the specimens were aged for 0 hours, 2 hours, 24 hours and 2 weeks. Wetting balance tests were used to evaluate the wettability of the test specimens. Microstructural development was evaluated using X-ray diffraction, energy dispersive X-ray and Auger spectroscopy, as well as optical and scanning electron microscopy. The wetting behavior of the test specimens is interpreted with respect to observed microstructural changes and as a function of aging time, solder composition, and processing conditions.

  8. Tin-silver and tin-copper alloys for capillarity joining-soft soldering-of copper piping

    International Nuclear Information System (INIS)

    Duran, J.; Amo, J. M.; Duran, C. M.

    2001-01-01

    It is studied the influence of the type of alloy used as filling material on the defects of the soldering joints in copper piping installations, which induce the fluid leak of the systems. The different eutectic temperatures and solidus-liquidus ranges of these alloys, require the setting of the soldering heat input in each case to obtain the suitable capillarity features and alloying temperatures to achieve for the correct formation of the bonding. Most defects in the joints are demonstrated to be generated by bad dossification of thermal inputs, which led depending on the filler alloy used to variations in its fluidity that may produce penetration failures in the bonds or insufficient consistency for the filling of the joints. (Author) 7 refs

  9. Aging effects on fracture behavior of 63Sn37Pb eutectic solder during tensile tests under the SEM

    International Nuclear Information System (INIS)

    Ding Ying; Wang Chunqing; Li Mingyu; Bang Hansur

    2004-01-01

    This study investigates the influence of aging treatment on fracture behavior of Sn-Pb eutectic solder alloys at different loading rate regime during tensile tests under the scanning electron microscope. In high homologous temperature, the solder exhibit the creep behavior that could be confirmed through the phenomena of grain boundary sliding (GBS) to both as-cast and aged specimens. Owing to the large grain scale after high temperature storage, boundary behavior was limited to some extent for the difficulty in grain rotation and boundary migration. Instead, drastic intragranular deformation occurred. Also, the phase coarsening weakened the combination between lead-rich phase and tin matrix. Consequently, surface fragmentation was detected for the aged specimens. Furthermore, the fracture mechanism changed from intergranular dominated to transgranular dominated with increasing loading rate to both specimens during early stage

  10. Influence of intermetallic growth on the mechanical properties of Zn–Sn–Cu–Bi/Cu solder joints

    Energy Technology Data Exchange (ETDEWEB)

    Xing, Fei; Yao, Jia; Liang, Jingwei; Qiu, Xiaoming, E-mail: qiuxm13@163.com

    2015-11-15

    The formation of intermetallic reaction layers and their influence on shear strength and fractography was investigated between the Zn–Sn–Cu–Bi (ZSCB) and Cu substrate during the liquid state reaction at 450 °C after 10–90 s. Results showed that reliable solder joints could be obtained at 450 °C after 15–30 s of wetting, accompanied by the creation of scallop ε-CuZn{sub 5}, flat γ-Cu{sub 5}Zn{sub 8} and β-CuZn intermetallic layers in ZSCB/Cu interface. However, with excess increase of soldering time, a transient intermetallic ε-CuZn{sub 4} phase was nuclear and grew at ε-CuZn{sub 5}/γ-Cu{sub 5}Zn{sub 8} interface, which apparently deteriorated the shear strength of solder joints from 76.5 MPa to 51.6 MPa. The sensitivity of the fracture proportion was gradually transformed from monotonic ε-CuZn{sub 5} to the mixture of ε-CuZn{sub 4} and ε-CuZn{sub 5} intermetallic cleavage. Furthermore, the growth mechanism of ε-CuZn{sub 4} intermetallic phase at the ZSCB/Cu interface was discussed. - Highlights: • There are four interfacial intermetallic layers formed at the Zn–Sn–Cu–Bi/Cu interface. • The growth mechanism of ε-CuZn{sub 4} intermetallic phase was discussed. • The wetting time of Zn–Sn–Cu–Bi solder in contact with Cu substrate is a key parameter.

  11. Electromigration-induced cracks in Cu/Sn3.5Ag/Cu solder reaction couple at room temperature

    International Nuclear Information System (INIS)

    He Hongwen; Xu Guangchen; Guo Fu

    2009-01-01

    Electromigration (EM) behavior of Cu/Sn 3.5 Ag/Cu solder reaction couple was investigated with a high current density of 5 x 10 3 A/cm 2 at room temperature. One dimensional structure, copper wire/solder ball/copper wire SRC was designed and fabricated to dissipate the Joule heating induced by the current flow. In addition, thermomigration effect was excluded due to the symmetrical structure of the SRC. The experimental results indicated that micro-cracks initially appeared near the cathode interface between solder matrix and copper substrate after 474 h current stressing. With current stressing time increased, the cracks propagated and extended along the cathode interface. It should be noted that the continuous Cu 6 Sn 5 intermetallic compounds (IMCs) layer both at the anode and at the cathode remained their sizes. Interestingly, tiny cracks appeared at the root of some long column-type Cu 6 Sn 5 at the cathode interface due to the thermal stress.

  12. Sutureless liver repair and hemorrhage control using laser-mediated fusion of human albumin as a solder.

    Science.gov (United States)

    Wadia, Y; Xie, H; Kajitani, M

    2001-07-01

    Major liver trauma has a high mortality because of immediate exsanguination and a delayed morbidity from septicemia, peritonitis, biliary fistulae, and delayed secondary hemorrhage. We evaluated laser soldering using liquid albumin for welding liver injuries. Fourteen lacerations (6 x 2 cm) and 13 nonanatomic resection injuries (raw surface, 8 x 2 cm) were repaired. An 805-nm laser was used to weld 53% liquid albumin-indocyanine green solder to the liver surface, reinforcing it by welding a free autologous omental scaffold. The animals were heparinized and hepatic inflow occlusion was used for vascular control. For both laceration and resection injuries, 16 soldering repairs were evaluated acutely at 3 hours. Eleven animals were evaluated chronically, two at 2 weeks and nine at 4 weeks. All 27 laser mediated-liver repairs had minimal blood loss compared with the suture controls. No dehiscence, hemorrhage, or bile leakage was seen in any of the laser repairs after 3 hours. All 11 chronic repairs healed without complication. This modality effectively seals the liver surface, joins lacerations with minimal thermal injury, and works independently of the patient's coagulation status.

  13. The micro-droplet behavior of a molten lead-free solder in an inkjet printing process

    International Nuclear Information System (INIS)

    Tsai, M H; Chou, H H; Hwang, W S

    2009-01-01

    An experimental investigation on the droplet formation of molten Sn3.0 wt%Ag0.5 wt%Cu alloy by an inkjet printing process was conducted. The printing process used a piezoelectric print head with a nozzle orifice diameter of 50 µm. Micro-droplets of a molten lead-free solder were ejected at 230 °C. The print head was driven by a bipolar pulse 40 V in amplitude. The major variables for this study were two pulse times; t rise /t finalrise and t fall , as well as N 2 back-pressure in the molten solder reservoir. Under various printing conditions, extrusion of the liquid column, contraction of liquid thread and pinch-off of liquid thread at nozzle exit were observed by monitoring the dynamics of the molten solder droplet ejection process. The droplet formation was found to be insensitive to t rise and t finalrise in the range of 250–1000 µs. The behavior of droplet formation was, however, significantly affected by the transfer rate, t fall , in the range of 30–60 µs and t fall of 50 µs yielded the most desirable condition of single droplet formation. The N 2 back-pressure was also found to be critical, where a back pressure between 10 and 21 kPa could give the desirable single-droplet formation condition

  14. The Effect of Wetting Gravity Regime on Shear Strength of SAC and Sn-Pb Solder Lap Joints

    Science.gov (United States)

    Sona, Mrunali; Prabhu, K. Narayan

    2017-09-01

    The failure of solder joints due to imposed stresses in an electronic assembly is governed by shear bond strength. In the present study, the effect of wetting gravity regime on single-lap shear strength of Sn-0.3Ag-0.7Cu and Sn-2.5Ag-0.5Cu solder alloys reflowed between bare copper substrates as well as Ni-coated Cu substrates was investigated. Samples were reflowed for 10 s, T gz (time corresponding to the end of gravity regime) and 100 s individually and tested for single-lap shear strength. The single-lap shear test was also carried out on eutectic Sn-Pb/Cu- and Sn-Pb/Ni-coated Cu specimens to compare the shear strength values obtained with those of lead-free alloys. The eutectic Sn-Pb showed significantly higher ultimate shear strength on bare Cu substrates when compared to Sn-Ag-Cu alloys. However, SAC alloys reflowed on nickel-coated copper substrate exhibited higher shear strength when compared to eutectic Sn-Pb/Ni-coated Cu specimens. All the substrate/solder/substrate lap joint specimens that were reflowed for the time corresponding to the end of gravity regime exhibited maximum ultimate shear strength.

  15. New Coating Technique of Ceramic Implants with Different Glass Solder Matrices for Improved Osseointegration-Mechanical Investigations.

    Science.gov (United States)

    Mick, Enrico; Markhoff, Jana; Mitrovic, Aurica; Jonitz, Anika; Bader, Rainer

    2013-09-11

    Ceramics are a very popular material in dental implant technology due to their tribological properties, their biocompatibility and their esthetic appearance. However, their natural surface structure lacks the ability of proper osseointegration, which constitutes a crucial process for the stability and, thus, the functionality of a bone implant. We investigated the application of a glass solder matrix in three configurations-consisting mainly of SiO₂, Al₂O₃, K₂O and Na₂O to TZP-A ceramic specimens. The corresponding adhesive strength and surface roughness of the coatings on ceramic specimens have been analyzed. Thereby, high adhesive strength (70.3 ± 7.9 MPa) was found for the three different coatings. The obtained roughness (R z ) amounted to 18.24 ± 2.48 µm in average, with significant differences between the glass solder configurations. Furthermore, one configuration was also tested after additional etching which did not lead to significant increase of surface roughness (19.37 ± 1.04 µm) or adhesive strength (57.2 ± 5.8 MPa). In conclusion, coating with glass solder matrix seems to be a promising surface modification technique that may enable direct insertion of ceramic implants in dental and orthopaedic surgery.

  16. New Coating Technique of Ceramic Implants with Different Glass Solder Matrices for Improved Osseointegration-Mechanical Investigations

    Directory of Open Access Journals (Sweden)

    Rainer Bader

    2013-09-01

    Full Text Available Ceramics are a very popular material in dental implant technology due to their tribological properties, their biocompatibility and their esthetic appearance. However, their natural surface structure lacks the ability of proper osseointegration, which constitutes a crucial process for the stability and, thus, the functionality of a bone implant. We investigated the application of a glass solder matrix in three configurations—consisting mainly of SiO2, Al2O3, K2O and Na2O to TZP-A ceramic specimens. The corresponding adhesive strength and surface roughness of the coatings on ceramic specimens have been analyzed. Thereby, high adhesive strength (70.3 ± 7.9 MPa was found for the three different coatings. The obtained roughness (Rz amounted to 18.24 ± 2.48 µm in average, with significant differences between the glass solder configurations. Furthermore, one configuration was also tested after additional etching which did not lead to significant increase of surface roughness (19.37 ± 1.04 µm or adhesive strength (57.2 ± 5.8 MPa. In conclusion, coating with glass solder matrix seems to be a promising surface modification technique that may enable direct insertion of ceramic implants in dental and orthopaedic surgery.

  17. Problem-Based Learning and the Training of Secondary Social Studies Teachers: A Case Study of Candidate Perceptions during Their Field Experience

    Science.gov (United States)

    Wynn, Charles T., Sr.; Okie, William

    2017-01-01

    We present results of a case study in which we analyzed the impact of problem-based learning (PBL) and cognitive scaffolding techniques introduced in our secondary social studies methods course on the perceptions and practices of 12 preservice teachers (PSTs) during their fall practicum and spring student teaching. Our PSTs reported teaching 54…

  18. Systematic exploration of a class of hydrophobic unnatural base pairs yields multiple new candidates for the expansion of the genetic alphabet

    Czech Academy of Sciences Publication Activity Database

    Dhami, K.; Malyshev, D. A.; Ordoukhanian, P.; Kubelka, Tomáš; Hocek, Michal; Romesberg, F. E.

    2014-01-01

    Roč. 42, č. 16 (2014), s. 10235-10244 ISSN 0305-1048 R&D Projects: GA ČR GBP206/12/G151 Institutional support: RVO:61388963 Keywords : unnatural base pairs * DNA * dTPT3-dNaM Subject RIV: CE - Biochemistry Impact factor: 9.112, year: 2014 http://nar.oxfordjournals.org/content/42/16/10235

  19. Disease candidate gene identification and prioritization using protein interaction networks

    Directory of Open Access Journals (Sweden)

    Aronow Bruce J

    2009-02-01

    Full Text Available Abstract Background Although most of the current disease candidate gene identification and prioritization methods depend on functional annotations, the coverage of the gene functional annotations is a limiting factor. In the current study, we describe a candidate gene prioritization method that is entirely based on protein-protein interaction network (PPIN analyses. Results For the first time, extended versions of the PageRank and HITS algorithms, and the K-Step Markov method are applied to prioritize disease candidate genes in a training-test schema. Using a list of known disease-related genes from our earlier study as a training set ("seeds", and the rest of the known genes as a test list, we perform large-scale cross validation to rank the candidate genes and also evaluate and compare the performance of our approach. Under appropriate settings – for example, a back probability of 0.3 for PageRank with Priors and HITS with Priors, and step size 6 for K-Step Markov method – the three methods achieved a comparable AUC value, suggesting a similar performance. Conclusion Even though network-based methods are generally not as effective as integrated functional annotation-based methods for disease candidate gene prioritization, in a one-to-one comparison, PPIN-based candidate gene prioritization performs better than all other gene features or annotations. Additionally, we demonstrate that methods used for studying both social and Web networks can be successfully used for disease candidate gene prioritization.

  20. Processing and characterization of device solder interconnection and module attachment for power electronics modules

    Science.gov (United States)

    Haque, Shatil

    This research is focused on the processing of an innovative three-dimensional packaging architecture for power electronics building blocks with soldered device interconnections and subsequent characterization of the module's critical interfaces. A low-cost approach termed metal posts interconnected parallel plate structure (MPIPPS) was developed for packaging high-performance modules of power electronics building blocks (PEBB). The new concept implemented direct bonding of copper posts, not wire bonding of fine aluminum wires, to interconnect power devices as well as joining the different circuit planes together. We have demonstrated the feasibility of this packaging approach by constructing PEBB modules (consisting of Insulated Gate Bipolar Transistors (IGBTs), diodes, and a few gate driver elements and passive components). In the 1st phase of module fabrication with IGBTs with Si3N 4 passivation, we had successfully fabricated packaged devices and modules using the MPIPPS technique. These modules were tested electrically and thermally, and they operated at pulse-switch and high power stages up to 6kW. However, in the 2nd phase of module fabrication with polyimide passivated devices, we experienced significant yield problems due to metallization difficulties of these devices. The under-bump metallurgy scheme for the development of a solderable interface involved sputtering of Ti-Ni-Cu and Cr-Cu, and an electroless deposition of Zn-Ni-Au metallization. The metallization process produced excellent yield in the case of Si3N4 passivated devices. However, under the same metallization schemes, devices with a polyimide passivation exhibited inconsistent electrical contact resistance. We found that organic contaminants such as hydrocarbons remain in the form of thin monolayers on the surface, even in the case of as-received devices from the manufacturer. Moreover, in the case of polyimide passivated devices, plasma cleaning introduced a few carbon constituents on the

  1. Novel Insect-Specific Eilat Virus-Based Chimeric Vaccine Candidates Provide Durable, Mono- and Multivalent, Single-Dose Protection against Lethal Alphavirus Challenge.

    Science.gov (United States)

    Erasmus, Jesse H; Seymour, Robert L; Kaelber, Jason T; Kim, Dal Y; Leal, Grace; Sherman, Michael B; Frolov, Ilya; Chiu, Wah; Weaver, Scott C; Nasar, Farooq

    2018-02-15

    Most alphaviruses are mosquito borne and exhibit a broad host range, infecting many different vertebrates, including birds, rodents, equids, humans, and nonhuman primates. Recently, a host-restricted, mosquito-borne alphavirus, Eilat virus (EILV), was described with an inability to infect vertebrate cells based on defective attachment and/or entry, as well as a lack of genomic RNA replication. We investigated the utilization of EILV recombinant technology as a vaccine platform against eastern (EEEV) and Venezuelan equine encephalitis viruses (VEEV), two important pathogens of humans and domesticated animals. EILV chimeras containing structural proteins of EEEV or VEEV were engineered and successfully rescued in Aedes albopictus cells. Cryo-electron microscopy reconstructions at 8 and 11 Å of EILV/VEEV and EILV/EEEV, respectively, showed virion and glycoprotein spike structures similar to those of VEEV-TC83 and other alphaviruses. The chimeras were unable to replicate in vertebrate cell lines or in brains of newborn mice when injected intracranially. Histopathologic examinations of the brain tissues showed no evidence of pathological lesions and were indistinguishable from those of mock-infected animals. A single-dose immunization of either monovalent or multivalent EILV chimera(s) generated neutralizing antibody responses and protected animals against lethal challenge 70 days later. Lastly, a single dose of monovalent EILV chimeras generated protective responses as early as day 1 postvaccination and partial or complete protection by day 6. These data demonstrate the safety, immunogenicity, and efficacy of novel insect-specific EILV-based chimeras as potential EEEV and VEEV vaccines. IMPORTANCE Mostly in the last decade, insect-specific viruses have been discovered in several arbovirus families. However, most of these viruses are not well studied and largely have been ignored. We explored the use of the mosquito-specific alphavirus EILV as an alphavirus vaccine

  2. Electrical performance verification methodology for large reflector antennas: based on the P-band SAR payload of the ESA BIOMASS candidate mission

    DEFF Research Database (Denmark)

    Pivnenko, Sergey; Kim, Oleksiy S.; Nielsen, Jeppe Majlund

    2013-01-01

    pattern and gain of the entire antenna including support and satellite structure with an appropriate computational software. A preliminary investigation of the proposed methodology was carried out by performing extensive simulations of different verification approaches. The experimental validation......In this paper, an electrical performance verification methodology for large reflector antennas is proposed. The verification methodology was developed for the BIOMASS P-band (435 MHz) synthetic aperture radar (SAR), but can be applied to other large deployable or fixed reflector antennas for which...... the verification of the entire antenna or payload is impossible. The two-step methodology is based on accurate measurement of the feed structure characteristics, such as complex radiation pattern and radiation efficiency, with an appropriate Measurement technique, and then accurate calculation of the radiation...

  3. Teacher Candidate Selection and Evaluation.

    Science.gov (United States)

    Collins, Mary Lynn; And Others

    Summaries are presented of three papers presented at a summer workshop on Quality Assurance in Teacher Education conducted by the Association of Teacher Educators. The general topic covered by these presentations was teacher candidate selection and evaluation. Papers focused upon the following questions: (1) What entry level criteria should be…

  4. Candidate Prediction Models and Methods

    DEFF Research Database (Denmark)

    Nielsen, Henrik Aalborg; Nielsen, Torben Skov; Madsen, Henrik

    2005-01-01

    This document lists candidate prediction models for Work Package 3 (WP3) of the PSO-project called ``Intelligent wind power prediction systems'' (FU4101). The main focus is on the models transforming numerical weather predictions into predictions of power production. The document also outlines...... the possibilities w.r.t. different numerical weather predictions actually available to the project....

  5. Candidate cave entrances on Mars

    Science.gov (United States)

    Cushing, Glen E.

    2012-01-01

    This paper presents newly discovered candidate cave entrances into Martian near-surface lava tubes, volcano-tectonic fracture systems, and pit craters and describes their characteristics and exploration possibilities. These candidates are all collapse features that occur either intermittently along laterally continuous trench-like depressions or in the floors of sheer-walled atypical pit craters. As viewed from orbit, locations of most candidates are visibly consistent with known terrestrial features such as tube-fed lava flows, volcano-tectonic fractures, and pit craters, each of which forms by mechanisms that can produce caves. Although we cannot determine subsurface extents of the Martian features discussed here, some may continue unimpeded for many kilometers if terrestrial examples are indeed analogous. The features presented here were identified in images acquired by the Mars Odyssey's Thermal Emission Imaging System visible-wavelength camera, and by the Mars Reconnaissance Orbiter's Context Camera. Select candidates have since been targeted by the High-Resolution Imaging Science Experiment. Martian caves are promising potential sites for future human habitation and astrobiology investigations; understanding their characteristics is critical for long-term mission planning and for developing the necessary exploration technologies.

  6. SU-F-T-631: Linear Accelerator-Based Frameless Extracranial Radiosurgery for Treatment of Occipital Neuralgia for Non-Surgical Candidates

    Energy Technology Data Exchange (ETDEWEB)

    Denton, T; Howe, J [Associates In Medical Physics, Louisville, KY (United States); Spalding, A [The Norton Cancer Institute Radiation Center, Louisville, KY (United States)

    2016-06-15

    Purpose: Occipital neuralgia is a condition wherein pain is transmitted by the occipital nerves. Non-invasive therapies generally alleviate symptoms; however, persistent or recurring pain may require invasive procedures. Repeated invasive procedures upon failure are considered higher risk and are often contraindicated due to compounding inherent risk. SRS has not been explored as a treatment option largely due to the extracranial nature of the target (as opposed to the similar, more established trigeminal neuralgia), but advances in linear-accelerator frameless-based SRS now present an opportunity to evaluate the novel potential of this modality for this application. Methods: Patient presented with severe occipital pain following decompression and fusion of the cervical vertebrae with prior intervention attempted via radiofrequency ablation yielding temporary pain cessation. A 0.6 mm slice spacing CT was obtained for treatment planning, and a cervical spine oriented 1.0 mm slice spacing CT myelogram was obtained for the purpose of defining the targeted C2 occipital dorsal root ganglion (to receive 80 Gy to the isocenter) and spinal cord. Results: The spinal cord was most proximally 12.0 mm from the isocenter receiving a maximum dose of 3.36 Gy, and doses to 0.35 and 1.2 cc of 1.84 Gy and 0.79 Gy, respectively. The brain maximum dose was 2.29 Gy. The treatment was successfully performed with a NovalisTX (Varian) equipped with ExacTrac stereoscopic x-ray image guidance (BrainLAB). Treatment time was 59 minutes for 18,323 MUs. Imaging was performed prior to each arc delivery resulting in twenty-one imaging sessions (twelve requiring positional corrections with the remaining verified within tolerance). The average deviation magnitude requiring a positional or rotational correction was 0.96±0.25 mm, 0.8±0.41° while the average deviation magnitude deemed within tolerance was 0.41±0.12 mm, 0.57±0.28°. Conclusion: Linear accelerator-based frameless radiosurgery

  7. SU-F-T-631: Linear Accelerator-Based Frameless Extracranial Radiosurgery for Treatment of Occipital Neuralgia for Non-Surgical Candidates

    International Nuclear Information System (INIS)

    Denton, T; Howe, J; Spalding, A

    2016-01-01

    Purpose: Occipital neuralgia is a condition wherein pain is transmitted by the occipital nerves. Non-invasive therapies generally alleviate symptoms; however, persistent or recurring pain may require invasive procedures. Repeated invasive procedures upon failure are considered higher risk and are often contraindicated due to compounding inherent risk. SRS has not been explored as a treatment option largely due to the extracranial nature of the target (as opposed to the similar, more established trigeminal neuralgia), but advances in linear-accelerator frameless-based SRS now present an opportunity to evaluate the novel potential of this modality for this application. Methods: Patient presented with severe occipital pain following decompression and fusion of the cervical vertebrae with prior intervention attempted via radiofrequency ablation yielding temporary pain cessation. A 0.6 mm slice spacing CT was obtained for treatment planning, and a cervical spine oriented 1.0 mm slice spacing CT myelogram was obtained for the purpose of defining the targeted C2 occipital dorsal root ganglion (to receive 80 Gy to the isocenter) and spinal cord. Results: The spinal cord was most proximally 12.0 mm from the isocenter receiving a maximum dose of 3.36 Gy, and doses to 0.35 and 1.2 cc of 1.84 Gy and 0.79 Gy, respectively. The brain maximum dose was 2.29 Gy. The treatment was successfully performed with a NovalisTX (Varian) equipped with ExacTrac stereoscopic x-ray image guidance (BrainLAB). Treatment time was 59 minutes for 18,323 MUs. Imaging was performed prior to each arc delivery resulting in twenty-one imaging sessions (twelve requiring positional corrections with the remaining verified within tolerance). The average deviation magnitude requiring a positional or rotational correction was 0.96±0.25 mm, 0.8±0.41° while the average deviation magnitude deemed within tolerance was 0.41±0.12 mm, 0.57±0.28°. Conclusion: Linear accelerator-based frameless radiosurgery

  8. An evaluation of the spring finger solder joints on SA1358-10 and SA2052-4 connector assemblies (MC3617,W87)

    International Nuclear Information System (INIS)

    Kilgo, Alice C.; Vianco, Paul Thomas; Hlava, Paul Frank; Zender, Gary L.

    2006-01-01

    The SA1358-10 and SA2052-4 circular JT Type plug connectors are used on a number of nuclear weapons and Joint Test Assembly (JTA) systems. Prototype units were evaluated for the following specific defects associated with the 95Sn-5Sb (Sn-Sb, wt.%) solder joint used to attach the beryllium-copper (BeCu) spring fingers to the aluminum (Al) connector shell: (1) extended cracking within the fillet; (2) remelting of the solder joint during the follow-on, soldering step that attached the EMR adapter ring to the connector shell (and/or soldering the EMR shell to the adapter ring) that used the lower melting temperature 63Sn-37Pb (Sn-Pb) alloy; and (3) spalling of the Cd (Cr) layer overplating layer from the fillet surface. Several pedigrees of connectors were evaluated, which represented older fielded units as well as those assemblies that were recently constructed at Kansas City Plant. The solder joints were evaluated that were in place on connectors made with the current soldering process as well as an alternative induction soldering process for attaching the EMR adapter ring to the shell. Very similar observations were made, which crossed the different pedigrees of parts and processes. The extent of cracking in the top side fillets varied between the different connector samples and likely the EMR adapter ring to the shell. Very similar observations were made, which crossed the different pedigrees of parts and processes. The extent of cracking in the top side fillets varied between the different connector samples and likely reflected the different extents to which the connector was mated to its counterpart assembly. In all cases, the spring finger solder joints on the SA1358-10 connectors were remelted as a result of the subsequent EMR adapter ring attachment process. Spalling of the Cd (Cr) overplating layer was also observed for these connectors, which was a consequence of the remelting activity. On the other hand, the SA2052-4 connector did not exhibit evidence of

  9. Developments of high strength Bi-containing Sn0.7Cu lead-free solder alloys prepared by directional solidification

    Energy Technology Data Exchange (ETDEWEB)

    Hu, Xiaowu, E-mail: xwhmaterials@aliyun.com [School of Mechanical Electrical Engineering, Nanchang University, Nanchang 330031 (China); Li, Yulong [School of Mechanical Electrical Engineering, Nanchang University, Nanchang 330031 (China); Liu, Yi [School of Materials Science and Engineering, Nanchang University, Nanchang 330031 (China); Min, Zhixian [China Electronics Technology Group Corporation No. 38 Research Institute, Hefei 230088 (China)

    2015-03-15

    Highlights: • The Sn0.7Cu–xBi solder alloys were directionally solidified. • Both spacing and diameter of fibers decreased with increasing solidification rate. • The UTS and YS first increased with increased solidification rate, then decreased. • The UTS and YS of Sn0.7Cu–xBi first increased with increased Bi content. - Abstract: Bi-containing Sn0.7Cu (SC) eutectic solder alloys were prepared and subjected to directional solidification, through which new types of fiber reinforced eutectic composites were generated. The influences of Bi addition on the microstructures and tensile properties of directionally solidified (DS) Bi-containing eutectic SC lead-free solder alloys have been investigated by using differential scanning calorimetry (DSC), scanning electron microscopy (SEM), energy dispersive spectrometry (EDS) and a tensile testing machine. The experimental results showed that addition of Bi could effectively reduce both the melting temperature and undercooling of SC solder alloy. The microstructures of DS SC–xBi solder alloys were composed of Sn-rich phase (β) and Cu{sub 6}Sn{sub 5} fiber. No other intermetallic compounds (IMCs) with Bi content were observed in the solder matrix for SC solder alloys with various Bi contents. Both fiber spacing and diameter all decreased gradually with increasing growth rate and/or Bi content. Besides, the regularity of Cu{sub 6}Sn{sub 5} fibers alignment also decreased with increasing growth rate, too. The tensile strengths of the SC–xBi eutectic solder alloys varied parabolically with growth rate (R). When R was 60 μm/s, maximum tensile strengths of 43.8, 55.2 and 56.37 MPa were reached for SC, SC0.7Bi and SC1.3Bi solder alloys. A comparison of tensile strength of SC, SC0.7Bi and SC1.3Bi with the same R indicated that the tensile strength increased with increasing Bi content, which was attributed to the presence of Bi and its role in refining microstructure and solid solution strengthening.

  10. Fc-based delivery system enhances immunogenicity of a tuberculosis subunit vaccine candidate consisting of the ESAT-6:CFP-10 complex.

    Science.gov (United States)

    Farsiani, Hadi; Mosavat, Arman; Soleimanpour, Saman; Sadeghian, Hamid; Akbari Eydgahi, Mohammad Reza; Ghazvini, Kiarash; Sankian, Mojtaba; Aryan, Ehsan; Jamehdar, Saeid Amel; Rezaee, Seyed Abdolrahim

    2016-06-21

    Tuberculosis (TB) remains a major global health threat despite chemotherapy and Bacilli Calmette-Guérin (BCG) vaccination. Therefore, a safer and more effective vaccine against TB is urgently needed. This study evaluated the immunogenicity of a recombinant fusion protein consisting of early secreted antigenic target protein 6 kDa (ESAT-6), culture filtrate protein 10 kDa (CFP-10) and the Fc-domain of mouse IgG2a as a novel subunit vaccine. The recombinant expression vectors (pPICZαA-ESAT-6:CFP-10:Fcγ2a and pPICZαA-ESAT-6:CFP-10:His) were transferred into Pichia pastoris. After SDS-PAGE and immunoblotting, the immunogenicity of the recombinant proteins was evaluated in mice. When both recombinant proteins (ESAT-6:CFP-10:Fcγ2a and ESAT-6:CFP-10:His) were used for vaccination, Th1-type cellular responses were induced producing high levels of IFN-γ and IL-12. However, the Fc-tagged recombinant protein induced more effective Th1-type cellular responses with a small increase in IL-4 as compared to the BCG and ESAT-6:CFP-10:His groups. Moreover, mice primed with BCG and then supplemented with ESAT-6:CFP-10:Fcγ2a produced the highest levels of IFN-γ and IL-12 in immunized groups. The findings indicate that when Fcγ2a is fused to the ESAT-6:CFP-10 complex, as a delivery vehicle, there could be an increase in the immunogenicity of this type of subunit vaccine. Therefore, additional investigations are necessary for the development of appropriate Fc-based tuberculosis vaccines.

  11. A risk-based statistical investigation of the quantification of polymorphic purity of a pharmaceutical candidate by solid-state 19F NMR.

    Science.gov (United States)

    Barry, Samantha J; Pham, Tran N; Borman, Phil J; Edwards, Andrew J; Watson, Simon A

    2012-01-27

    The DMAIC (Define, Measure, Analyse, Improve and Control) framework and associated statistical tools have been applied to both identify and reduce variability observed in a quantitative (19)F solid-state NMR (SSNMR) analytical method. The method had been developed to quantify levels of an additional polymorph (Form 3) in batches of an active pharmaceutical ingredient (API), where Form 1 is the predominant polymorph. In order to validate analyses of the polymorphic form, a single batch of API was used as a standard each time the method was used. The level of Form 3 in this standard was observed to gradually increase over time, the effect not being immediately apparent due to method variability. In order to determine the cause of this unexpected increase and to reduce method variability, a risk-based statistical investigation was performed to identify potential factors which could be responsible for these effects. Factors identified by the risk assessment were investigated using a series of designed experiments to gain a greater understanding of the method. The increase of the level of Form 3 in the standard was primarily found to correlate with the number of repeat analyses, an effect not previously reported in SSNMR literature. Differences in data processing (phasing and linewidth) were found to be responsible for the variability in the method. After implementing corrective actions the variability was reduced such that the level of Form 3 was within an acceptable range of ±1% ww(-1) in fresh samples of API. Copyright © 2011. Published by Elsevier B.V.

  12. A wireless intraocular pressure monitoring device with a solder-filled microchannel antenna

    International Nuclear Information System (INIS)

    Varel, Çağdaş; Shih, Yi-Chun; Otis, Brian P; Böhringer, Karl F; Shen, Tueng S

    2014-01-01

    This paper presents the prototype of an intraocular pressure sensor as a major step toward building a device that can be permanently implanted during cataract surgery. The implantation will proceed through an incision of 2–3 mm using an injector, during which the complete device must be folded into a cross-section of 2 mm × 1 mm. The device uses radio frequency (RF) for wireless power and data transfer. The prototype includes an antenna, an RF chip and a pressure sensor assembled on a printed circuit board with several circuit components used for testing and calibration. The antenna is fabricated and integrated with the circuit using a fabrication method employing solder-filled microchannels embedded in an elastomer. The monitoring device is powered at 2.716 GHz from a distance of 1–2 cm. The prototype has undergone electrical and mechanical tests for antenna and sensor performance. The flexible antenna can withstand a stress of 33.4 kPa without any electrical disconnection. It did not show a significant increase in electrical resistance after 50 bending cycles with a maximum applied stress of 116 kPa. Transmitted pressure data shows an averaged sensitivity of 16.66 Hz (mm-Hg) –1 . (paper)

  13. Leaching Studies for Copper and Solder Alloy Recovery from Shredded Particles of Waste Printed Circuit Boards

    Science.gov (United States)

    Kavousi, Maryam; Sattari, Anahita; Alamdari, Eskandar Keshavarz; Fatmehsari, Davoud Haghshenas

    2018-06-01

    Printed circuit boards (PCBs) comprise various metals such as Cu, Sn, and Pb, as well as platinum group metals. The recovery of metals from PCBs is important not only due to the waste treat