WorldWideScience

Sample records for auto-catalytic electroless plating

  1. LASER INDUCED SELECTIVE ACTIVATION UTILIZING AUTO-CATALYTIC ELECTROLESS PLATING ON POLYMER SURFACE

    DEFF Research Database (Denmark)

    Zhang, Yang; Nielsen, Jakob Skov; Tang, Peter Torben

    2009-01-01

    . Characterization of the deposited copper layer was used to select and improve laser parameters. Several types of polymers with different melting points were used as substrate. Using the above mentioned laser treatment, standard grades of thermoplastic materials such as ABS, SAN, PE, PC and others have been......This paper presents a new method for selective micro metallization of polymers induced by laser. An Nd: YAG laser was employed to draw patterns on polymer surfaces using a special set-up. After subsequent activation and auto-catalytic electroless plating, copper only deposited on the laser tracks....... Induced by the laser, porous and rough structures are formed on the surface, which favours the palladium attachment during the activation step prior to the metallization. Laser focus detection, scanning electron microscopy (SEM) and other instruments were used to analyze the topography of the laser track...

  2. Electroless Plating on Plastic Induced by Selective Laser Activation

    DEFF Research Database (Denmark)

    Zhang, Yang; Tang, Peter Torben; Hansen, Hans Nørgaard

    2009-01-01

    This paper presents a new method for selective micro metallization of polymers. A Nd:YAG laser is employed to draw patterns on polymer surfaces that are submerged in a liquid (usually water). After subsequent activation with palladium chloride and followed by auto-catalytic electroless plating...... in width with 50μm between two tracks, but further optimization is expected in this field. Due to the porous and rough structure of the laser track, excellent adhesion between metallization and substrate is obtained. On top of the first copper layer, additional metal such as nickel, gold, palladium or tin...

  3. Hydrogen Recombination Rates of Plate-type Passive Auto-catalytic Recombiner

    Energy Technology Data Exchange (ETDEWEB)

    Kim, Jongtae; Hong, Seong-Wan [Korea Atomic Energy Research Institute, Daejeon (Korea, Republic of); Kim, Gun Hong [Kyungwon E-C Co., Seongnam (Korea, Republic of)

    2014-10-15

    The hydrogen mitigation system may include igniters, passive autocatalytic recombiner (PAR), and venting or dilution system. Recently PAR is commonly used as a main component of HMS in a NPP containment because of its passive nature. PARs are categorized by the shape and material of catalytic surface. Catalytic surface coated by platinum is mostly used for the hydrogen recombiners. The shapes of the catalytic surface can be grouped into plate type, honeycomb type and porous media type. Among them, the plate-type PAR is well tested by many experiments. PAR performance analysis can be approached by a multi-scale method which is composed of micro, meso and macro scales. The criterion of the scaling is the ratio of thickness of boundary layer developed on a catalytic surface to representative length of a computational domain. Mass diffusion in the boundary layer must be resolved in the micro scale analysis. In a lumped parameter (LP) analysis using a system code such as MAAP or MELCOR, the chamber of the PAR is much smaller than a computational node. The hydrogen depletion by a PAR is modeled as a source of mass and energy conservation equations. Te catalytic surface reaction of hydrogen must be modeled by a volume-averaged correlation. In this study, a micro scale analysis method is developed using libraries in OpenFOAM to evaluate a hydrogen depletion rate depending on parameters such as size and number of plates and plate arrangement. The analysis code is validated by simulating REKO-3 experiment. And hydrogen depletion analysis is conducted by changing the plate arrangement as a trial of the performance enhancement of a PAR. In this study, a numerical code for an analysis of a PAR performance in a micro scale has been developed by using OpenFOAM libraries. The physical and numerical models were validated by simulating the REKO-3 experiment. As a try to enhance the performance of the plate-type PAR, it was proposed to apply a staggered two-layer arrangement of the

  4. 40 CFR 413.70 - Applicability: Description of the electroless plating subcategory.

    Science.gov (United States)

    2010-07-01

    ... electroless plating subcategory. 413.70 Section 413.70 Protection of Environment ENVIRONMENTAL PROTECTION AGENCY (CONTINUED) EFFLUENT GUIDELINES AND STANDARDS ELECTROPLATING POINT SOURCE CATEGORY Electroless Plating Subcategory § 413.70 Applicability: Description of the electroless plating subcategory....

  5. Recovery process for electroless plating baths

    Science.gov (United States)

    Anderson, Roger W.; Neff, Wayne A.

    1992-01-01

    A process for removing, from spent electroless metal plating bath solutions, accumulated byproducts and counter-ions that have deleterious effects on plating. The solution, or a portion thereof, is passed through a selected cation exchange resin bed in hydrogen form, the resin selected from strong acid cation exchangers and combinations of intermediate acid cation exchangers with strong acid cation exchangers. Sodium and nickel ions are sorbed in the selected cation exchanger, with little removal of other constituents. The remaining solution is subjected to sulfate removal through precipitation of calcium sulfate hemihydrate using, sequentially, CaO and then CaCO.sub.3. Phosphite removal from the solution is accomplished by the addition of MgO to form magnesium phosphite trihydrate. The washed precipitates of these steps can be safely discarded in nontoxic land fills, or used in various chemical industries. Finally, any remaining solution can be concentrated, adjusted for pH, and be ready for reuse. The plating metal can be removed from the exchanger with sulfuric acid or with the filtrate from the magnesium phosphite precipitation forming a sulfate of the plating metal for reuse. The process is illustrated as applied to processing electroless nickel plating baths.

  6. Aeroheating model advancements featuring electroless metallic plating

    Science.gov (United States)

    Stalmach, C. J., Jr.; Goodrich, W. D.

    1976-01-01

    Discussed are advancements in wind tunnel model construction methods and hypersonic test data demonstrating the methods. The general objective was to develop model fabrication methods for improved heat transfer measuring capability at less model cost. A plated slab model approach was evaluated with cast models containing constantan wires that formed single-wire-to-plate surface thermocouple junctions with a seamless skin of electroless nickel alloy. The surface of a space shuttle orbiter model was selectively plated with scaled tiles to simulate, with high fidelity, the probable misalignments of the heatshield tiles on a flight vehicle. Initial, Mach 8 heating results indicated a minor effect of tile misalignment roughness on boundary layer transition, implying a possible relaxation of heatshield manufacturing tolerances. Some loss of the plated tiles was experienced when the model was tested at high heating rates.

  7. Electroless nickel plating on stainless steels and aluminum

    Science.gov (United States)

    1966-01-01

    Procedures for applying an adherent electroless nickel plating on 303 SE, 304, and 17-7 PH stainless steels, and 7075 aluminum alloy was developed. When heat treated, the electroless nickel plating provides a hard surface coating on a high strength, corrosion resistant substrate.

  8. Electroless metal plating of plastics

    Science.gov (United States)

    Krause, Lawrence J.

    1984-01-01

    Process for plating main group metals on aromatic polymers is carried out by the use of a nonaqueous solution of a salt of an alkali metal in a positive valence state and a main group metal in a negative valence state with contact between the solution and polymer providing a redox reaction causing the deposition of the main group metal and the reduction of the polymer. Products from the process exhibit useful decorative and electrical properties.

  9. Electroless nickel plating on polymer particles.

    Science.gov (United States)

    Fujii, Syuji; Hamasaki, Hiroyuki; Takeoka, Hiroaki; Tsuruoka, Takaaki; Akamatsu, Kensuke; Nakamura, Yoshinobu

    2014-09-15

    Near-monodisperse, micrometer-sized polypyrrole-palladium (PPy-Pd) nanocomposite-coated polystyrene (PS) particles have been coated with Ni overlayers by electroless plating in aqueous media. Good control of the Ni loading was achieved for 1.0 μm diameter PPy-Pd nanocomposite-coated PS particles and particles of up to 20 μm in diameter could also be efficiently coated with the Ni. Laser diffraction particle size analysis studies of dilute aqueous suspensions indicated that an additional water-soluble colloidal stabilizer, poly(N-vinyl pyrrolidone), in the electroless plating reaction media was crucial to obtain colloidally stable Ni-coated composite particles. Elemental microanalysis indicated that the Ni loading could be controlled between 61 and 78 wt% for the 1.0 μm-sized particles. Scanning/transmission electron microscopy studies revealed that the particle surface had a flaked morphology after Ni coating. Spherical capsules were obtained after extraction of the PS component from the Ni-coated composite particles, which indicated that the shell became rigid after Ni coating. X-ray diffraction confirmed the production of elemental Ni and X-ray photoelectron spectroscopy studies indicated the existence of elemental Ni on the surface of the composite particles.

  10. Electroless nickel plating on optical fiber probe

    Institute of Scientific and Technical Information of China (English)

    Li Huang; Zhoufeng Wang; Zhuomin Li; Wenli Deng

    2009-01-01

    As a component of near-field scanning optical microscope (NSOM),optical fiber probe is an important factor influncing the equipment resolution.Electroless nickel plating is introduced to metallize the optical fiber probe.The optical fibers are etched by 40% HF with Turner etching method.Through pretreatment,the optical fiber probe is coated with Ni-P film by clectrolcss plating in a constant temperature water tank.Atomic absorption spectrometry (AAS),scanning electron microscopy (SEM),and energy dispersive X-ray spectrometry (EDXS) are carried out to charaeterizc the deposition on fiber probe.We have rcproducibly fabricated two kinds of fiber probes with a Ni-P fihn:aperture probe and apertureless probe.In addition,reductive particle transportation on the surface of fiber probe is proposed to explain the cause of these probes.

  11. Direct electroless nickel plating on silicon surface

    Institute of Scientific and Technical Information of China (English)

    HU Guanghui; WU Huihuang; YANG Fangzu

    2004-01-01

    Direct electroless nickel plating on n-Si(100)wafers in alkaline solutions was demonstrated without any activation procedure in advance, the effect of pH and temperature of the solutions on size of metal particles in deposits was examined, and also the element contents of deposits were analyzed by energy disperse spectroscopy (EDS). The results indicated that the size of metal particles increases with increasing temperature or decreasing pH. The possible mechanism of nickel deposition on n-Si(100) was discussed in terms of semiconductor electrochemistry, and the formation of nickel seed crystal on Si was mainly attributed to the generation of atomic hydrogen by electron capture of water molecule from the semiconductor in alkaline solutions.

  12. Development of Electroless Copper and Gold Plating on Wood

    Institute of Scientific and Technical Information of China (English)

    ZHOUGao; ZHAOGuangjie

    2004-01-01

    The use of more and more electron products requires interior wood products to have the performance of electromagnetic shielding. One of the ways to realize it is to introduce the chemical plating which has already been developed in electron industry into wood processing. The paper clarifies the mechanism of electroless copper and gold plating and its application to wood. It emphasizes the development and technology of electroless copper and gold plating on wood. Meanwhile, it points out that it is highly feasible to take this technology into effect.

  13. Electroless plating apparatus for discrete microsized particles

    Science.gov (United States)

    Mayer, Anton

    1978-01-01

    Method and apparatus are disclosed for producing very uniform coatings of a desired material on discrete microsized particles by electroless techniques. Agglomeration or bridging of the particles during the deposition process is prevented by imparting a sufficiently random motion to the particles that they are not in contact with each other for a time sufficient for such to occur.

  14. Scaling and Removal of Calcium Carbonate on Electroless Plating Surface

    Institute of Scientific and Technical Information of China (English)

    2001-01-01

    The scaling process of calcium carbonate on a low-energy heat transfer surface-electroless plating surface was investigated in a simulated cooling water system. Owing to the very low surface energy, the electroless plating surface exhibited less scaling susceptibility. A longer induction period and a lower scaling rate were obtained on the low-energy surface compared to copper surface under identical conditions. The calcite particles obtained on the electroless plating surface during the induction period were larger in size than those on copper surface because fewer crystals formed and grew at the same time on the low-energy surface. With increasing surface temperature, the induction period reduced and the scaling rate increased for the low-energy surface. When initial surface temperature was fixed, an increase in fluid velocity would reduce the induction period and increase the scaling rate due to the diffusion effect. However, when the heat flux was fixed, an increase in fluid velocity would decrease the surface temperature, and lead to a longer induction period and a lower scaling rate. The removal experiments of calcium carbonate scale indicated that during post induction period, the detachment was not obvious, while during the induction period, apparent removal of crystal particles was obtained on the electroless plating surface owing to the weak adhesion force. The more frequently the transient high hydrodynamic force acted, the more the detached crystal particles were.

  15. Laser Induced Selective Activation For Subsequent Autocatalytic Electroless Plating

    DEFF Research Database (Denmark)

    Zhang, Yang

    The subject of this PhD thesis is “Laser induced selective activation for subsequent autocatalytic electroless plating.” The objective of the project is to investigate the process chains for micro structuring of polymer surfaces for selective micro metallization. Laser induced selective activation...

  16. Electrochemically promoted electroless nickel-phosphorous plating on titanium substrate

    Science.gov (United States)

    Gao, Ce; Dai, Lei; Meng, Wei; He, Zhangxing; Wang, Ling

    2017-01-01

    An electrochemically promoted electroless nickel-phosphorous plating process on titanium substrate is proposed. The influences of the temperature and current density on the phosphorous content, coating thickness and corrosion resistance are investigated. The results show that with the help of the electrochemical promotion, the uniform and amorphous nickel-phosphorous coatings with medium phosphorus content (6-8 wt%) are successfully prepared in the electroless bath at 40-60 °C. The phosphorous content of the coating increases with the temperature increasing, while decreases with current density increasing. Obvious passivation occurs for the nickel-phosphorous coatings during the anodic polarization in 3.5 wt% NaCl solution.

  17. Process of electroless plating Cu-Sn-Zn ternary alloy

    Institute of Scientific and Technical Information of China (English)

    2006-01-01

    Cu-Sn-Zn ternary alloy layer with 10 μm thickness was prepared through electroless plating method. The influences of process conditions including the concentration of metallic salts, reductant and complex agent on Cu-Sn-Zn alloy were studied in details.The stability to bear color changes and corrosion resistance of Cu-Sn-Zn film layer were studied through air-exposure experiment and electrochemical analyses test respectively. The results show that the performances of Cu-Sn-Zn film layer are obviously superior to brass matrix. By use of SEM,EDS and XRD, the morphology, microstructure and chemical composition were investigated. The results show that complex agent can increase the content of Sn and Zn, improve the evenness and compactness and decrease needle holes, therefore the properties of electroless plating layer such as the stability to bear color changes and corrosion resistance are improved remarkably.The probable mechanism of complex agent was discussed.

  18. High performance 3D printed electronics using electroless plated copper

    Science.gov (United States)

    Jian, Jin Rong; Kim, Taeil; Park, Jae Sung; Wang, Jiacheng; Kim, Woo Soo

    2017-03-01

    This paper presents design and performance validation of 3D printed electronic components, 3D toroidal air-core inductors, fabricated by multi-material based Fused Deposition Modelling (FDM) 3D printing technology and electroless copper plating. Designs of toroidal inductor is investigated with different core shapes and winding numbers; circular and half-circular cores with 10 and 13 turns of windings. Electroless plated copper thin film ensures 3D printed toroidal plastic structures to possess inductive behaviors. The inductance is demonstrated reliably with an applied source frequency from 100 kHz to 2 MHz as designs vary. An RL circuit is utilized to test the fabricated inductors' phase-leading characteristics with corresponding phase angle changes.

  19. Magnetic performance and corrosion resistance of electroless plating CoWP film

    Institute of Scientific and Technical Information of China (English)

    2012-01-01

    The CoWP film with good magnetic performance and corrosion resistance was electrolessly plated from alkaline solution. The technical parameters of the electroless plating system were optimized. When the pH value of electroless plating solution was 11.0 and the reducing agent (NaH2PO2) content was 0.4 mol L 1, the target chemical reactions proceeded in the electroless plating solution smoothly with negligible interference and side effects. CoWP film prepared under optimal deposition condition contained more ...

  20. Electroless nickel plated graphite fibers and surface behavior in Gr(Ni)/6061Al composite

    Institute of Scientific and Technical Information of China (English)

    WANG Chun-yu; WU Gao-hui; ZHANG Qiang; ZHANG Yun-he; XIU Zi-yang; CHEN Guo-qin

    2006-01-01

    The electroless nickel plated graphite fibers reinforced aluminum matrix composites (Gr(Ni)/Al) were produced by squeeze casting, and the microstructure of Gr(Ni)/Al composite and surface behavior of Ni-P coating were studied. The optimum process of electroless Ni-P plating included: burning to get rid of glue→degreasing→neutralization→acidulating→sensitizing→activation→electroless plating. The surface analysis results show that the electroless nickel plating can diffuse into the graphite fiber surface during the squeeze casting, and the Ni-P coating and aluminum alloys can produce brittle phase NiAl3 or NiAl. The X-ray diffraction(XRD) results indicate that Al4C3 is so little that no Al4C3 peaks are found, and the harmful hl4C3 can be decreased by the electroless plating Ni-P coating. The coating improves the interfacial bonding of continuous graphite fibers reinforced aluminum matrix composites.

  1. Method for conducting electroless metal-plating processes

    Science.gov (United States)

    Petit, George S.; Wright, Ralph R.

    1978-01-01

    This invention is an improved method for conducting electroless metal-plating processes in a metal tank which is exposed to the plating bath. The invention solves a problem commonly encountered in such processes: how to determine when it is advisable to shutdown the process in order to clean and/or re-passivate the tank. The new method comprises contacting the bath with a current-conducting, non-catalytic probe and, during plating operations, monitoring the gradually changing difference in electropotential between the probe and tank. It has been found that the value of this voltage is indicative of the extent to which nickel-bearing decomposition products accumulate on the tank. By utilizing the voltage to determine when shutdown for cleaning is advisable, the operator can avoid premature shutdown and at the same time avoid prolonging operations to the point that spontaneous decomposition occurs.

  2. 2-Mercaptobenzimidazole, 2-Mercaptobenzothiazole, and Thioglycolic Acid in an Electroless Nickel-Plating Bath

    Directory of Open Access Journals (Sweden)

    Ahmet Ozan Gezerman

    2015-01-01

    Full Text Available The use of three different materials, 2-mercaptobenzimidazole, 2-mercaptobenzothiazole, and thioglycolic acid, was investigated to improve the performance of electroless nickel-plating baths. By changing the concentrations of these materials, sample plates were coated. Optical microscope images were obtained by selecting representative coated plates. From the results of the investigations, the effects of these materials on electroless nickel plating were observed, and the most appropriate amounts of these materials for nickel plating were determined. Moreover, the nickel plating speed observed with the bath solution containing 2-mercaptobenzimidazole, 2-mercaptobenzothiazole, and thioglycolic acid is higher than that in the case of traditional electroless plating baths, but the nickel consumption amount in the former case is lower. In order to minimize the waste water generated from electroless nickel-plating baths, we determined the lowest amounts of the chemicals that can be used for the concentrations reported in the literature.

  3. Electroless Nickel Plating and Electroplating on FBG Temperature Sensor

    Institute of Scientific and Technical Information of China (English)

    SHEN Ren-sheng; TENG Rui; LI Xiang-ping; ZHANG Jin; XIA Dao-cheng; FAN Zhao-qi; YU Yong-sen; ZHANG Yu-shu; DU Guo-tong

    2008-01-01

    Metal-coated fiber Bragg grating(FBG) temperature sensors were prepared via electroless nickel(EN) plating and tin electroplating methods on the surface of normal bare FBG.The surface morphologies of the metal-coated layers were observed under a metallographic microscope.The effects of pretreatment sequence,pH value of EN plating solution and current density of electroplating on the performance of the metal-coated layers were analyzed.Meanwhile,the Bragg wavelength shift induced by temperature was monitored by an optical spectrum analyzer.Sensitivity of the metal-coated FBG(MFBG) sensor was almost two times that of normal bare FBG sensor.The measuring temperature of the MFBG sensor could be up to 280 ℃,which was much better than that of conventional FBG sensor.

  4. Studies on Properties and Structure of Electroless Plating Tin Coating

    Institute of Scientific and Technical Information of China (English)

    XU Rui-dong; GUO Zhong-cheng; ZHU Xiao-yun

    2004-01-01

    The composition and structure of electroless tin coating were analyzed by SEM and X-ray diffraction. In the meantime, porosity, solderability and extensibility were determined by physical and chemical methods. The results showed that the porosity of the tin coating increases with the rise of bath temperature and decreases as the plating time rises. Solderability is improved with the rise of thickness of tin coating, and decreases when the tin deposit is heated at 180 ~ 200 ℃. The crystalline grain size becomes bigger and bigger with increasing plating time or bath temperature or coating thickness. X-ray diffraction indicates that only Cu and β-Sn phases show up in the diffraction patterns. Tin coating has a strong joint force with copper substrate and excellent function of electrochemical protection as anode coating.

  5. Robust nanogap electrodes by self-terminating electroless gold plating.

    Science.gov (United States)

    Serdio V, Victor M; Azuma, Yasuo; Takeshita, Shuhei; Muraki, Taro; Teranishi, Toshiharu; Majima, Yutaka

    2012-11-21

    Robust nanogap electrodes for nanodevices with a separation of 3.0 ± 1.7 nm were simultaneously mass-produced at a yield of 90% by a combination of electron beam lithography (EBL) and electroless gold plating (EGP). Nanogap electrodes demonstrated their robustness as they maintained their structure unchanged up to temperatures of 170 °C, during the isotropic oxygen plasma ashing removal of the amorphous carbon overlayer resulting from scanning electron microscopy observations, therefore maintaining their surface reactivity for EGP and formation of a self-assembled monolayer. A gold layer grows over the electrode surface during EGP, narrowing the separation between the electrodes; growth stops around 3 nm due to a self-termination phenomenon. This is the main factor in the high yield and reproducibility of the EGP process because it prevents contact between the electrodes. A 90% yield is achieved by also controlling the etching and physisorption of gold clusters, which is accomplished by reduction of triiodide ions and heat treatment of the EGP solution, respectively. A mixed self-assembled monolayer of octanethiol and decanedithiol can be formed at the surface of the nanogap electrodes after the oxygen plasma treatment, and decanethiol-protected Au nanoparticles were chemisorbed between the self-terminated nanogap electrodes via decanedithiol. Chemically assembled single-electron transistors based on the nanogap electrodes exhibit ideal, stable, and reproducible Coulomb diamonds.

  6. Effects of Dimethylamine Borane in Electroless Ni-B Plating.

    Science.gov (United States)

    Rha, Sa-Kyun; Baek, Seung-Deok; Lee, Youn-Seoung

    2015-10-01

    By electroless plating in a pH 7 bath at 50 °C, Ni-B alloy films with nano-crystallite size (3-6 nm) were formed on screen printed Ag paste. According to the addition of DMAB (dimethylamine borane), the boron concentration in the Ni-B alloy films increased systematically from <1 at.% to ~10 at.%, and the crystallite size of the Ni-B alloy films decreased gradually. The crystal/electronic structures of the Ni-B alloys were studied using XAS (X-ray absorption spectroscopy), XRD, etc., with changes of boron contents. In the crystalline structure, the ordering of fcc type was broken upon alloying and then the samples with additions of 0.5 M and 1 M DMAB had amorphous-like structures with decreases of crystallite size. In the electronic structure, the unoccupied d states of the Ni sites were filled as the B concentration increased upon alloying. From the electronegativity rule and the broken orderging upon alloying, we can suggest that an overall charge transfer occurs from the Ni sites toward the alloying B sites with intra-atomic charge redistribution, leading to an increased occupancy of the Ni 3d states in the alloys.

  7. Electroless Cu Plating on Anodized Al Substrate for High Power LED.

    Science.gov (United States)

    Rha, Sa-Kyun; Lee, Youn-Seoung

    2015-03-01

    Area-selective copper deposition on screen printed Ag pattern/anodized Al/Al substrate was attempted using a neutral electroless plating processes for printed circuit boards (PCBs), according to a range of variation of pH 6.5-pH 8 at 70 °C. The utilized basic electroless solution consisted of copper(II) sulfate pentahydrate, sodium phosphinate monohydrate, sodium citrate tribasic dihydrate, ammonium chloride, and nickel(II) sulfate hexahydrate. The pH of the copper plating solutions was adjusted from pH 6.5 to pH 8 using NH4OH. Using electroless plating in pH 6.5 and pH 7 baths, surface damage to the anodized Al layer hardly occurred; the structure of the plated Cu-rich films was a typical fcc-Cu, but a small Ni component was co-deposited. In electroless plating at pH 8, the surface of the anodized Al layer was damaged and the Cu film was composed of a lot of Ni and P which were co-deposited with Cu. Finally, in a pH 7 bath, we can make a selectively electroless plated Cu film on a PCB without any lithography and without surface damage to the anodized Al layer.

  8. Electroless Ni-B plating for electrical contact applications

    Directory of Open Access Journals (Sweden)

    Dervos, C. T.

    2005-12-01

    Full Text Available Electroless Ni-B plating has been tried on steel substrate in an effort to employ low-cost starting materials for electrical contacts or connectors. By selected conditions of heat treatment in a high vacuum environment the plating can acquire Cr-equivalent hardness without the effluents of the hard chromium plating process. The surfaces were characterized under scanning electron microscope and by XRD. The fabricated materials were tested under corrosion conditions by polarization measurements. Semispherical nickel plated steel joints were tested in a computer controlled contact make-break apparatus, under simultaneous application of a mechanical and a low-voltage electrical load for 20,000 cycles. After heat treatment the plating acquires a crystalline structure with very good adhesion to the substrate material. Corrosion decreases and increased hardness is obtained. The surface is also characterized by good electrical properties during aging accelerated tests.

    Se ha investigado la deposición de Ni-B por vía química sobre un substrato de acero, con el fin de poder emplear materiales de bajo coste para los contactos o conectores eléctricos. Mediante condiciones específicas de tratamiento térmico en un ambiente de alto vacío, la deposición puede alcanzar durezas equivalentes al cromo (Cr sin los efluentes del proceso de cromado duro. Las superficies se caracterizaron en el microscopio electrónico de barrido y mediante DRX. Los materiales fabricados se ensayaron bajo condiciones de corrosión utilizando mediciones de polarización. Se ensayaron las juntas semiesféricas de acero niquelado en un equipo de contactos controlado por ordenador bajo la aplicación simultánea de una carga mecánica y de una carga eléctrica de bajo voltaje durante 20.000 ciclos. Después del tratamiento térmico, el recubrimiento adquiere una estructura cristalina con muy buena adherencia al material del substrato. Se consigue una menor corrosión y mayor

  9. Electroless silver plating on PET fabric initiated by in situ reduction of polyaniline

    Energy Technology Data Exchange (ETDEWEB)

    Mu, Shipeng; Xie, Huayang [College of Chemistry, Chemical Engineering and Biotechnology, Donghua University, Shanghai 201620 (China); Wang, Wei [College of Chemistry, Chemical Engineering and Biotechnology, Donghua University, Shanghai 201620 (China); Key Lab of Eco-Textile, Ministry of Education, Donghua University, Shanghai 201620 (China); Yu, Dan, E-mail: yudan@dhu.edu.cn [College of Chemistry, Chemical Engineering and Biotechnology, Donghua University, Shanghai 201620 (China); Key Lab of Eco-Textile, Ministry of Education, Donghua University, Shanghai 201620 (China)

    2015-10-30

    Graphical abstract: - Highlights: • We propose a method to initiate electroless plating by reduction of PANI. • The shielding effective of the silver-plated fabric reaches 50–90 dB. • The silver-plated fabric has good antibacterial activity. - Abstract: Novel electroless silver plating poly(ethylene terephthalate) (PET) fabric was prepared by a two-step procedure. In the first step, the in situ polymerized polyaniline (PANI) occurred on the fabric surface in the presence of ammonium persulfate (APS). Then, Ag(0) species reduced from silver nitrate (AgNO{sub 3}) by in situ reduction of PANI were used as catalyst to initiate electroless silver plating. Hence, this composite material was prepared by conductive polymer combined with electroless plating. The silver layer on PET fabric surface was characterized by scanning electron microscopy (SEM), X-ray diffraction (XRD) and energy dispersive spectroscopy (EDX) as well as X-ray photoelectron spectroscopy (XPS). The results showed that the silver layer was plated uniformly and compactly with surface resistance about 0.1 Ω/sq on average. The shielding effectiveness (SE) of silver-plated PET fabric was around 50–90 dB, which was considered to have potential applications in electromagnetic shielding materials. Thermogravimetric (TG) analysis was carried out to study thermal stability. The antibacterial tests demonstrated that the silver-plated fabric exhibited excellent antibacterial activity against Staphylococcus aureus and Escherichia coli both with 100%.

  10. Electroplating zinc transition layer for electroless nickel plating on AM60 magnesium alloys

    Institute of Scientific and Technical Information of China (English)

    WANG Xiao-min; ZHOU Wan-qiu; HAN En-Hou

    2006-01-01

    Electroplating zinc coating as transition layer of electroless nickel plating on AM60 magnesium alloys was investigated. The zinc film can be deposited in a pyrophosphate bath at 50-60 ℃ under current density of 0.5-1.5 A/dm2. A new fore treatment technology was applied by acid cleaning with a solution containing molybdate and phosphorous acid, by alkaline cleaning in a bath containing molybdate and sodium hydroxide. The subsequent electroless plating was carried out in nickel sulfate bath. The SEM observation shows that the deposition is uniform and compact. The polarization curve measurements show that the corrosion potential of the zinc plating in 3.5% NaCl is about -1.3 V(vs SCE) which is noble than that of magnesium substrate. The zinc electroplating can be applied as the pretreatment process for electroless nickel plating on magnesium alloys.

  11. Mechanical assisted electroless barrel-plating Ni-P coatings on magnesium alloy

    Institute of Scientific and Technical Information of China (English)

    Zhaoxia PING; Juntao YUAN; Yedong HE; Xiaogang LI

    2009-01-01

    A mechanically assisted electroless barrel-plating Ni-P was carried out in a rolling drum containing Mg alloy specimens and ceramic balls, which was submerged in a bath containing electroless plating solution. It is demonstrated that the Ni-P coatings deposited by this novel technique have a crystallized Ni-P solid solution structure,showing fine-grains, higher hardness, and higher corrosion resistance compared with the conventional electroless plated amorphous Ni-P coatings. After heat treatment at 400 ~C for 1 h, the structure of such Ni-P coatings were transformed to a structure with Ni-Ni3P double phases, and cracks in these coatings could not-be observed,whereas cracks appeared seriously in the conventional electroless plated Ni-P coating after same heat treatment. Therefore, both hardness and corrosion resistance of these Ni-P coatings can be improved further by heat treatment. All of these beneficial effects can be attributed to the role of mechanical attrition during the mechanically assisted electroless barrel-plating process.

  12. Direct electroless Ni-P plating on AZ91D magnesium alloy

    Institute of Scientific and Technical Information of China (English)

    LI Zhong-hou; QU Yu-ping; ZHENG Feng; DAI A-gan

    2006-01-01

    An electroless Ni-P plating treatment was applied on AZ91D magnesium alloy to improve its corrosion resistance. Optimum pretreatment conditions and optimum bath of electroless nickel plating for magnesium alloy were found through many experiments. In order to avoid bother of pre-plating medium layer, a set of procedure of direct electroless Ni-P under the acid condition was investigated. The properties of the coating with 10% phosphorus were investigated. The results show that a coating with high hardness, low porosity and good adhesive strength is obtained. X-ray diffraction patterns show that the structure of the coating is an amorphous phase. After annealing at 400 ℃, the amorphous phase of Ni-P is transformed to crystalline phases,and some intermetallics as Ni3P and Ni5P2 are deposited from Ni -P solid solution along with an enhancing hardness from Hv 450 to Hv 910.

  13. ABS polymer electroless plating through a one-step poly(acrylic acid) covalent grafting.

    Science.gov (United States)

    Garcia, Alexandre; Berthelot, Thomas; Viel, Pascal; Mesnage, Alice; Jégou, Pascale; Nekelson, Fabien; Roussel, Sébastien; Palacin, Serge

    2010-04-01

    A new, efficient, palladium- and chromium-free process for the electroless plating of acrylonitrile-butadiene-styrene (ABS) polymers has been developed. The process is based on the ion-exchange properties of poly(acrylic acid) (PAA) chemically grafted onto ABS via a simple and one-step method that prevents using classical surface conditioning. Hence, ABS electroless plating can be obtained in three steps, namely: (i) the grafting of PAA onto ABS, (ii) the copper Cu(0) seeding of the ABS surface, and (iii) the nickel or copper metallization using commercial-like electroless plating bath. IR, XPS, and SEM were used to characterize each step of the process, and the Cu loading was quantified by atomic absorption spectroscopy. This process successfully compares with the commercial one based on chromic acid etching and palladium-based seed layer, because the final metallic layer showed excellent adhesion with the ABS substrate.

  14. Fabrication of conductive copper patterns using reactive inkjet printing followed by two-step electroless plating

    Science.gov (United States)

    Chen, Jin-Ju; Lin, Guo-Qiang; Wang, Yan; Sowade, Enrico; Baumann, Reinhard R.; Feng, Zhe-Sheng

    2017-02-01

    A simple and low-cost process for fabricating conductive copper patterns on flexible polyimide substrates was demonstrated. Copper catalyst patterns were first produced on polyimide substrates using reactive inkjet printing of Cu (II)-bearing ink and reducing ink, and then the conductive copper patterns were generated after a two-step electroless plating procedure. The copper layers were characterized by optical microscope, SEM, XRD and EDS. Homogeneously distributed copper nanoclusters were found in the catalyst patterns. A thin copper layer with uniform particle size was formed after first-step electroless plating, and a thick copper layer of about 14.3 μm with closely packed structure and fine crystallinity was produced after second-step electroless plating. This resulting copper layer had good solderability, reliable adhesion strength and a low resistivity of 5.68 μΩ cm without any sintering process.

  15. Regeneration and reuse of exhausted solutions of electroless nickel plating wood veneer

    Institute of Scientific and Technical Information of China (English)

    WANG Lijuan; LI Jian; LIAN Aizhen

    2006-01-01

    The regeneration of exhausted solutions of electroless nickel plating wood veneer was realized using soluble calcium salt to precipitate and remove phosphite and then using fluoride to remove residual calcium ions from the solution.The effect of the pH value of the solution,treatment temperature and the molar ratio of calcium ions to phosphite ions on the removal efficiency of phosphite was investigated.Wood veneer was electroless plated using regenerated solutions.A coating with better electrical conductivity and electromagnetic shielding was obtained.

  16. Fabrication of gold patterns via multilayer transfer printing and electroless plating.

    Science.gov (United States)

    Basarir, Fevzihan

    2012-03-01

    Gold patterns were fabricated on Si wafer substrate via multilayer transfer printing of polyelectrolytes, followed by selective deposition of gold nanoparticles (AuNPs) and then electroless plating of gold. First, PDMS stamp was coated with (PAH)(1)/(PSS/PDAC)(10) multilayer system, followed by transfer printing on the piranha cleaned fresh Si wafer substrate. Next, the substrate was dipped in AuNP solution for deposition of the nanoparticles on PAH layer. Then, the substrate was subjected to electroless plating to obtain the gold patterns. Very clean and precise gold patterns with electrical conductivity of 2.5 × 10(5) Ω(-1) cm(-1) were obtained.

  17. Metal nanodot arrays fabricated via seed-mediated electroless plating with block copolymer thin film scaffolding.

    Science.gov (United States)

    Komiyama, Hideaki; Iyoda, Tomokazu; Sanji, Takanobu

    2015-10-02

    We present an alternative approach to fabricating hexagonally arranged nanodot arrays of various metals by seed-mediated electroless plating with a cylinder-forming block copolymer thin film, PEO-b-PMA(Az), as a scaffold. Metal ions were selectively incorporated into PEO cylinders, followed by their reduction to metal and the etching of the scaffold to obtain highly ordered seed arrays of Au, Pd, and Pt. Nanodot arrays of the target metals (Au, Ag, and Ni) were selectively grown on the seed with their highly ordered arrangement by electroless plating. We studied the fabrication processes' suitability for control of the nanodot array size, as well as the plasmonic properties thereof.

  18. Electroless plating of thin gold films directly onto silicon nitride thin films and into micropores.

    Science.gov (United States)

    Whelan, Julie C; Karawdeniya, Buddini Iroshika; Bandara, Y M Nuwan D Y; Velleco, Brian D; Masterson, Caitlin M; Dwyer, Jason R

    2014-07-23

    A method to directly electrolessly plate silicon-rich silicon nitride with thin gold films was developed and characterized. Films with thicknesses plating free-standing ultrathin silicon nitride membranes, and we successfully plated the interior walls of micropore arrays in 200 nm thick silicon nitride membranes. The method is thus amenable to coating planar, curved, and line-of-sight-obscured silicon nitride surfaces.

  19. Enhanced microwave absorbing properties and heat resistance of carbonyl iron by electroless plating Co

    Energy Technology Data Exchange (ETDEWEB)

    Wang, Hongyu, E-mail: wanghongyu07010310@163.com; Zhu, Dongmei; Zhou, Wancheng; Luo, Fa

    2015-11-01

    Co coated carbonyl iron particles (Co (CI)) are fabricated through electroless plating method, and the electromagnetic microwave absorbing properties are investigated in the frequencies during 8.2–12.4 GHz. The complex permittivity of CI particles after electroless plating Co is higher than that of raw CI particles due to improvment of the polarization process. Furthermore, according to the XRD and TG results, the Co layer can enhance the heat resistance of CI particles. The bandwidth below −10 dB can reach 3.9 GHz for the Co(CI) absorbent. The results indicate that the electroless plating Co not only enhances the absorbing properties but also improves the heat resistance of CI. - Highlights: • The Co-coated carbonyl iron Co(CI) particles were prepared by electroless plating. • The electromagnetic wave absorbing properties of Co(CI) particles were studied. • The heat treatment on the absorbing property of Co(CI) particles was studied. • The Co(CI) particles have good absorbing property when compared with CI.

  20. Fabrication of porous flaky electromagnetic particles by electroless plating of CoNiP on diatomite

    Science.gov (United States)

    Yuan, Liming; Cai, Jun; Zhang, Wenqiang; Lian, Zhiyang; Zhang, Deyuan

    2012-10-01

    In order to fabricate lightweight flaky electromagnetic particles efficiently, the diatomite was used as the forming template to which the CoNiP coating was deposited by an electroless plating technique. The electroless plating of CoNiP on diatomite was accomplished with the coupling processing before the activation, in which 3-aminopropyltriethoxysilane (APTES) was used as the coupling agent. The effect of coupling processing on the activation and electroless plating of diatomite was characterized by SEM, FT-IR and EDS analysis. The results indicated that with coupling processing before activation, the catalytic effect was improved remarkably than that of direct colloidal palladium activation, which resulted in superior electroless plating on diatomite, even on the surface of submicron holes. The XRD analysis showed that the CoNiP coating was a transitional structure between crystal and amorphousness. The measurement of complex permeability and permittivity in the range of 2-18 GHz suggested that the micro flaky electromagnetic particles had promising electromagnetic properties.

  1. Copper circuit patterning on polymer using selective surface modification and electroless plating

    Science.gov (United States)

    Park, Sang Jin; Ko, Tae-Jun; Yoon, Juil; Moon, Myoung-Woon; Oh, Kyu Hwan; Han, Jun Hyun

    2017-02-01

    We have examined a potential new and simple method for patterning a copper circuit on PET substrate by copper electroless plating, without the pretreatment steps (i.e., sensitization and activation) for electroless plating as well as the etching processes of conventional circuit patterning. A patterned mask coated with a catalyst material, Ag, for the reduction of Cu ions, is placed on a PET substrate. Subsequent oxygen plasma treatment of the PET substrate covered with the mask promotes the selective generation of anisotropic pillar- or hair-like nanostructures coated with co-deposited nanoparticles of the catalyst material on PET. After oxygen plasma treatment, a Cu circuit is well formed just by dipping the plasma-treated PET into a Cu electroless plating solution. By increasing the oxygen gas pressure in the chamber, the height of the nanostructures increases and the Ag catalyst particles are coated on not only the top but also the side surfaces of the nanostructures. Strong mechanical interlocking between the Cu circuit and PET substrate is produced by the large surface area of the nanostructures, and enhances peel strength. Results indicate this new simple two step (plasma surface modification and pretreatment-free electroless plating) method can be used to produce a flexible Cu circuit with good adhesion.

  2. The Studies of Composite Electroless Plating Process on Sintering Ndfeb Permanent Magnet

    Institute of Scientific and Technical Information of China (English)

    HU Jian-wen; MA Jing; YAN Dong-qing; GAO Qing; MENG Yong-qiang

    2004-01-01

    A reasonable pre-treatment and an ultrasonic pre-plating Cu film were applied for sintering NdFeB permanent magnet. The samples were then plated in neutral bath (PH=7) for 40min and in acidic bath (PH=4.8~5.1) for 2h. A composite electroless plating with different phosphor content was obtained. The results show that the composite plating coatings are dense and have a strong bond with the substrate, which contribute to the excellent corrosion resistance of the plating coating.

  3. The Studies of Composite Electroless Plating Process on Sintering Ndfeb Permanent Magnet

    Institute of Scientific and Technical Information of China (English)

    HUJian-wen; MAJing; YANDong-qing; GAOQing; MENGYong-qiang

    2004-01-01

    A reasonable pre-treatment and an ultrasonic pre-plating Cu film were applied for sintering NdFeB permanent magnet. The samples were then plated in neutral bath (PH=7) for 40rnin and in acidic bath (PH=4.8-5.1) for 2h. A composite electroless plating with different phosphor content was obtained. The results show that the composite plating coatings are dense and have a strong bond with the substrate, which contribute to the excellent corrosion resistance of the plating coating.

  4. Electroless silver plating on PET fabric initiated by in situ reduction of polyaniline

    Science.gov (United States)

    Mu, Shipeng; Xie, Huayang; Wang, Wei; Yu, Dan

    2015-10-01

    Novel electroless silver plating poly(ethylene terephthalate) (PET) fabric was prepared by a two-step procedure. In the first step, the in situ polymerized polyaniline (PANI) occurred on the fabric surface in the presence of ammonium persulfate (APS). Then, Ag(0) species reduced from silver nitrate (AgNO3) by in situ reduction of PANI were used as catalyst to initiate electroless silver plating. Hence, this composite material was prepared by conductive polymer combined with electroless plating. The silver layer on PET fabric surface was characterized by scanning electron microscopy (SEM), X-ray diffraction (XRD) and energy dispersive spectroscopy (EDX) as well as X-ray photoelectron spectroscopy (XPS). The results showed that the silver layer was plated uniformly and compactly with surface resistance about 0.1 Ω/sq on average. The shielding effectiveness (SE) of silver-plated PET fabric was around 50-90 dB, which was considered to have potential applications in electromagnetic shielding materials. Thermogravimetric (TG) analysis was carried out to study thermal stability. The antibacterial tests demonstrated that the silver-plated fabric exhibited excellent antibacterial activity against Staphylococcus aureus and Escherichia coli both with 100%.

  5. Electroless plating and magnetic properties of Co–Zn–P coating on short carbon fibres

    Indian Academy of Sciences (India)

    Xinghua Su; Chengwen Qiang

    2012-12-01

    A layer of Co–Zn–P alloys was coated on short carbon fibre (CFs) surfaces using electroless plating method. The influence of the concentration of Co2+ and Zn2+ and reaction time on the plating rate were measured by comparing the relative mass gain rate of Co–Zn–P-coated fibres with uncoated carbon fibres prepared under different conditions. The materials characterizations were analysed by field emission scanning electron microscopy, X-ray diffraction and energy dispersive spectroscope. The magnetic properties of Co–Zn–P/CFs composites prepared in different Zn2+ concentration baths were measured by the vibrating sample magnetometer. The best processing parameters of electroless plating of Co–Zn–P coating on short carbon fibres were obtained.

  6. A Novel RF Inductor Fabricated Through MEMS Processing and Electroless Copper Plating

    Institute of Scientific and Technical Information of China (English)

    LIYi; WUWengang; HAOYilong

    2005-01-01

    A novel radio-frequency inductor with single-crystal-silicon spiral structure suspended on glass substrate is reported. The inductor is fabricated by using an improved silicon-glass anodic bonding and deep etching releasing process combined with electroless copper plating technology. The newly developed process is proved simple, stable and easily controlled. Based on the process, the performances of the inductor, such as quality factor, inductance and operating frequency, can be adjusted by changing the structure parameters. Through the electroless copper plating, the silicon spiral structure of the inductor is encapsulated completely by highly conformal copper film. Furthermore, a thin nickel film is plated on the top of the copper layer for passivation and measurement convenience. The thickness of copper and nickel layers influences the characteristics of the inductors largely. The fabricated inductor exhibits high performances. Its quality factor has reached 27 at the frequency arrange from 9 to 11GHz.

  7. Metal deposition by electroless plating on polydopamine functionalized micro- and nanoparticles.

    Science.gov (United States)

    Mondin, Giovanni; Wisser, Florian M; Leifert, Annika; Mohamed-Noriega, Nasser; Grothe, Julia; Dörfler, Susanne; Kaskel, Stefan

    2013-12-01

    A novel approach for the fabrication of metal coated micro- and nanoparticles by functionalization with a thin polydopamine layer followed by electroless plating is reported. The particles are initially coated with polydopamine via self-polymerization. The resulting polydopamine coated particles have a surface rich in catechols and amino groups, resulting in a high affinity toward metal ions. Thus, they provide an effective platform for selective electroless metal deposition without further activation and sensitization steps. The combination of a polydopamine-based functionalization with electroless plating ensures a simple, scalable, and cost-effective metal coating strategy. Silver-plated tungsten carbide microparticles, copper-plated tungsten carbide microparticles, and copper-plated alumina nanoparticles were successfully fabricated, showing also the high versatility of the method, since the polymerization of dopamine leads to the formation of an adherent polydopamine layer on the surface of particles of any material and size. The metal coated particles produced with this process are particularly well suited for the production of metal matrix composites, since the metal coating increases the wettability of the particles by the metal, promoting their integration within the matrix. Such composite materials are used in a variety of applications including electrical contacts, components for the automotive industries, magnets, and electromagnetic interference shielding.

  8. Effect of electroless plating nickel treatment on electrode properties of Zr-based AB2 type alloy

    Institute of Scientific and Technical Information of China (English)

    文明芬; 翟玉春; 陈廉; 佟敏; 郑华; 马荣骏

    2001-01-01

    An electroless plating nickel treatment was processed to improve the active behaviors and discharge capacities of Zr-based AB2 alloys. The effects of the nickel coating on the surface appearance, the structure of the alloy powders and the electrode characteristics were investigated. It is found that the Ni-rich layer formed through electroless plating nickel treatment plays an important role on the initial activation property and the discharge capacity of Zr-based alloy. The optimal content of electroless plating nickel is about 15 %, and the discharge capacity of the electrode can be increased to 400mA· h·g 1 after 6 cycles. Although coated nickel is beneficial for quick activation and discharge capacity, excessive electroless plating nickel can result in a decreased discharge capacity.

  9. Electroless Plating of Carbon Nanotubes with Copper%碳纳米管的化学镀铜

    Institute of Scientific and Technical Information of China (English)

    凤仪; 袁海龙

    2004-01-01

    A simple chemical method was employed to coat carbon nanotubes with a layer of copper. Due to the hydrophobic nature, large surface curvature, small diameter and large aspect ratio, it is difficult to gain continuous electroless plating layer on the surface of carbon nanotubes. In this paper, a series methods (oxidization, sensitization and activation) are used to add active sites before electroless plating, and the adjustment of the traditional composition of copper electroless plating bath and operating condition can decelerate electroless plating rate. The samples before and after coating were analyzed using transmission electron microscopy and energy-dispersive X-ray spectroscopy. The results showed that the surface of carbon nanotubes was successfully coated with continuous layer of copper, which lays a good foundation for applying carbon nanotubes in composites.

  10. Developments in convective heat transfer models featuring seamless and selected detail surfaces, employing electroless plating

    Science.gov (United States)

    Stalmach, C. J., Jr.

    1975-01-01

    Several model/instrument concepts employing electroless metallic skin were considered for improvement of surface condition, accuracy, and cost of contoured-geometry convective heat transfer models. A plated semi-infinite slab approach was chosen for development and evaluation in a hypersonic wind tunnel. The plated slab model consists of an epoxy casting containing fine constantan wires accurately placed at specified surface locations. An electroless alloy was deposited on the plastic surface that provides a hard, uniformly thick, seamless skin. The chosen alloy forms a high-output thermocouple junction with each exposed constantan wire, providing means of determining heat transfer during tunnel testing of the model. A selective electroless plating procedure was used to deposit scaled heatshield tiles on the lower surface of a 0.0175-scale shuttle orbiter model. Twenty-five percent of the tiles were randomly selected and plated to a height of 0.001-inch. The purpose was to assess the heating effects of surface roughness simulating misalignment of tiles that may occur during manufacture of the spacecraft.

  11. Mechanism and Microstructure of Electroless Ni-Fe-P Plating on CNTs

    Institute of Scientific and Technical Information of China (English)

    XUE Ru-jun; WU Yu-cheng

    2007-01-01

    Electroless Ni-Fe-P alloy plating on the surface of CNTs was carried out with a bath using citrate salt and lactic acid as complex agents. We proposed a chemical reaction mechanism. The morphology, structure and chemical composition of the Ni-Fe-P/CNTs were studied with the aid of a scanning electronic microscope (SEM), X-ray diffraction (XRD) and an energy-dispersive X-ray spectral analysis (EDS). The results show that through a correct pretreatment and electroless plating, Ni-Fe-P/CNTs composite particles can be obtained. The optimum electroless plating parameters of 35-42 ℃ and pH of 8.5-9.7 were achieved. The as-plated Ni-Fe-P alloy is amorphous. After a heat treat-ment at 500 ℃ for 90 min in H2, the coating is transformed into crystalloid Ni3P, Fe2NiP and (Fe,Ni)3P. The Ni-Fe-P al-loy coating on the surface of CNTs is smooth and unique. The amount of Ni on the surface (mass fraction) of the Ni-Fe-P/CNTs composite particles is 29.13%, that of Fe 3.19% and that of P 2.28%.

  12. Nickel Electroless Plating: Adhesion Analysis for Mono-Type Crystalline Silicon Solar Cells.

    Science.gov (United States)

    Shin, Eun Gu; Rehman, Atteq ur; Lee, Sang Hee; Lee, Soo Hong

    2015-10-01

    The adhesion of the front electrodes to silicon substrate is the most important parameters to be optimized. Nickel silicide which is formed by sintering process using a silicon substrate improves the mechanical and electrical properties as well as act as diffusion barrier for copper. In this experiment p-type mono-crystalline czochralski (CZ) silicon wafers having resistivity of 1.5 Ω·cm were used to study one step and two step nickel electroless plating process. POCl3 diffusion process was performed to form the emitter with the sheet resistance of 70 ohm/sq. The Six, layer was set down as an antireflection coating (ARC) layer at emitter surface by plasma enhanced chemical vapor deposition (PECVD) process. Laser ablation process was used to open SiNx passivation layer locally for the formation of the front electrodes. Nickel was deposited by electroless plating process by one step and two step nickel electroless deposition process. The two step nickel plating was performed by applying a second nickel deposition step subsequent to the first sintering process. Furthermore, the adhesion analysis for both one step and two steps process was conducted using peel force tester (universal testing machine, H5KT) after depositing Cu contact by light induced plating (LIP).

  13. Electroless Deposited Gold Nanoparticles on Glass Plates as Sensors for Measuring the Dielectric Constant of Solutions

    OpenAIRE

    Kobayashi, Y.; Ishii, Y.

    2013-01-01

    This work describes a method for the deposition of Au nanoparticles on glass plates (Au-glass). An electroless metal plating technique was extended to the Au nanoparticle deposition. The technique consisted of three steps that took place on the glass plate: (1) adsorption of Sn2+ ions, (2) deposition of metallic Ag nuclei generated by reducing Ag+ ions with Sn2+ ions on the Sn-adsorbed sites, and (3) deposition of Au nanoparticles by reducing Au+ ions on the Ag surface. TEM observation reveal...

  14. Electrochemical performance of electroless nickel plated silicon electrodes for Li-ion batteries

    Energy Technology Data Exchange (ETDEWEB)

    Cetinkaya, T., E-mail: tcetinkaya@sakarya.edu.tr; Uysal, M.; Akbulut, H.

    2015-04-15

    Highlights: • Si/Ni composite powders were produced via electroless plating method. • Increasing content of the nickel on the surface of the silicon powders caused increasing discharge capacity. • The Si/Ni composite electrode produced using 40 g/L NiCl{sub 2} exhibited 246 mAh/g discharge capacity after 30 cycles. - Abstract: In this study, nickel plated silicon powders were produced using an electroless deposition process. The nickel content on the surface of silicon powders was changed by using different concentrations of NiCl{sub 2} in the plating bath. The surface morphology of the produced Ni plated composite powders was characterized using scanning electron microscopy (SEM). Energy dispersive spectroscopy (EDS) was used to determine the elemental surface composition of the composites. X-ray diffraction (XRD) analysis was performed to investigate the structure of the nickel plated silicon powders. Electrochemical cycling test of the nickel plated silicon electrodes were performed at a constant current of 100 mA/g in CR2016 test cells. In order to investigate electrochemical reactions of the nickel plated silicon powders with electrolyte, cyclic voltammetry test was performed at a scan rate of 0.1 mV/s. Among the used concentrations, the nickel plated silicon electrode produced using 40 g/L NiCl{sub 2} had a 246 mAh/g discharge capacity after 30 cycles.

  15. Preparation of (103)Pd brachytherapy seeds by electroless plating of (103)Pd onto carbon bars.

    Science.gov (United States)

    Li, Zhong-Yong; Gao, Hui-Bo; Deng, Xue-Song; Zhou, Leng; Zhang, Wen-Hui; Han, Lian-Ge; Jin, Xiao-Hai; Cui, Hai-Ping

    2015-09-01

    A method for preparing (103)Pd brachytherapy seeds is reported. The key of the method was to deposit (103)Pd onto carbon bars by electroless plating so as to prepare source cores. After each carbon bar with (103)Pd was sealed in a titanium capsule, the (103)Pd seeds were fabricated. This paper provides valuable experiences and data for the preparation of (103)Pd brachytherapy seeds.

  16. Study of electroless copper plating on ABS resin surface modified by heterocyclic organosilane self-assembled film

    Indian Academy of Sciences (India)

    H N Zhang; J Wang; F F Sun; D Liu; H Y Wang; F Wang

    2014-02-01

    6-(3-triethoxysilylpropyl)amino-1, 3, 5-triazine-2, 4-dithiol monosodium (TES) was used to fabricate self-assembled film on corona pretreated acrylonitrile–butadiene–styrene (ABS) resin surface. The self-assembled film modified ABS resin was treated by electroless copper plating. Orthogonal test was carried out to study optimal condition of the process. The surface appearance, plating rate and thickness of electroless copper films were investigated to determine the optimal time of corona-discharge, self-assembly and electroless copper plating. SEM results indicated that porous morphology appeared on ABS resin surface modified by TES self-assembled film and the surface roughness also increased. The adhesion test showed that the adhesion property between ABS resin and copper was excellent. The surface of electroless copper film had high brightness under the optimal condition of 1 min corona-discharge, 30 min self-assembly and 10 min electroless copper plating. The electroless-copper plating temperature was 55 ∼ 60°C and pH was 13 ∼ 13.5.

  17. Comparison Between Electrolysis and Reduction for Treatment of Spent Electroless Nickel Plating Bath

    Institute of Scientific and Technical Information of China (English)

    YAN Lei; LI Shuqin; YU Xiujuan

    2009-01-01

    There are lots of residual nickel and organic compounds in the spent electroless nickel plating bath. It not only wastes resource but also causes environmental pollution if the wastewater is discharged without treatment. In this paper, electrolytic method and reduction method for treating spent electroless nickel plating bath were compared. The factors studied included reaction time, pH, temperature, effectiveness and cost. It was found that the recovery rate of nickel by reduction was 99.9% under the condition ofpH 6, 50℃ for 10 min. The purity of reclaimed nickel was 66.1%. This treatment needed about 16 g NaBH4 for a liter spent solution, which cost RMB 64 Yuan. For electrolysis method, with pH 7.6, 80℃, 0.45 A (current intensity) for 2 h, the recovery rate reached 97.3%. The purity was 88.5% for the reclaimed nickel. Moreover, it was found that through electrolysis, the value of TOC (Total Organic Carbon) decreased from 114 to 3.08 g·L-1 with removal rate of 97.3%. The main cost of electrolysis came from electric energy. It cost about 0.09 kWh (less than RMB 0.1 Yuan) per liter wastewater. Compared with reduction, electrolysis had more advantages, so the priority of selection should be given to the electrolysis method for the treatment of spent electroless nickel plating bath.

  18. Higher-resolution selective metallization on alumina substrate by laser direct writing and electroless plating

    Energy Technology Data Exchange (ETDEWEB)

    Lv, Ming; Liu, Jianguo, E-mail: liujg@mail.hust.edu.cn; Wang, Suhuan; Ai, Jun; Zeng, Xiaoyan

    2016-03-15

    Graphical abstract: - Highlights: • Mechanisms of laser direct writing and electroless plating were studied. • Active seeds in laser-irradiated zone and laser-affected zone were found to be different. • A special chemical cleaning method with aqua regia was taken. • Higher-resolution copper patterns on alumina ceramic were obtained conveniently. - Abstract: How to fabricate conductive patterns on ceramic boards with higher resolution is a challenge in the past years. The fabrication of copper patterns on alumina substrate by laser direct writing and electroless copper plating is a low cost and high efficiency method. Nevertheless, the lower resolution limits its further industrial applications in many fields. In this report, the mechanisms of laser direct writing and electroless copper plating were studied. The results indicated that as the decomposed products of precursor PdCl{sub 2} have different chemical states respectively in laser-irradiated zone (LIZ) and laser-affected zone (LAZ). This phenomenon was utilized and a special chemical cleaning method with aqua regia solution was taken to selectively remove the metallic Pd in LAZ, while kept the PdO in LIZ as the only active seeds. As a result, the resolution of subsequent copper patterns was improved significantly. This technique has a great significance to develop the microelectronics devices.

  19. Synthesis of nickel nanoparticles supported on metal oxides using electroless plating: controlling the dispersion and size of nickel nanoparticles.

    Science.gov (United States)

    Wu, Zhijie; Ge, Shaohui; Zhang, Minghui; Li, Wei; Tao, Keyi

    2009-02-15

    Nickel nanoparticles supported on metal oxides were prepared by a modified electroless nickel-plating method. The process and mechanism of electroless plating were studied by changing the active metal (Ag) loading, acidity, and surface area of metal oxides and were characterized by UV-vis spectroscopy, transmission electron microscopy, scanning electron microscopy, and H(2) chemisorption. The results showed that the dispersion of nickel nanoparticles was dependent on the interface reaction between the metal oxide and the plating solution or the active metal and the plating solution. The Ag loading and acidity of the metal oxide mainly affected the interface reaction to change the dispersion of nickel nanoparticles. The use of ultrasonic waves and microwaves and the change of solvents from water to ethylene glycol in the electroless plating could affect the dispersion and size of nickel nanoparticles.

  20. Electroless silver plating of the surface of organic semiconductors.

    Science.gov (United States)

    Campione, Marcello; Parravicini, Matteo; Moret, Massimo; Papagni, Antonio; Schröter, Bernd; Fritz, Torsten

    2011-10-04

    The integration of nanoscale processes and devices demands fabrication routes involving rapid, cost-effective steps, preferably carried out under ambient conditions. The realization of the metal/organic semiconductor interface is one of the most demanding steps of device fabrication, since it requires mechanical and/or thermal treatments which increment costs and are often harmful in respect to the active layer. Here, we provide a microscopic analysis of a room temperature, electroless process aimed at the deposition of a nanostructured metallic silver layer with controlled coverage atop the surface of single crystals and thin films of organic semiconductors. This process relies on the reaction of aqueous AgF solutions with the nonwettable crystalline surface of donor-type organic semiconductors. It is observed that the formation of a uniform layer of silver nanoparticles can be accomplished within 20 min contact time. The electrical characterization of two-terminal devices performed before and after the aforementioned treatment shows that the metal deposition process is associated with a redox reaction causing the p-doping of the semiconductor.

  1. Direct writing patterns for electroless plated copper thin film on plastic substrates.

    Science.gov (United States)

    Liao, Ying-Chih; Kao, Zhen-Kai

    2012-10-24

    A simple and efficient method is developed to create conductive copper thin films on polymer surfaces. Instead of regular palladium colloid inks, micropatterns of silver nitrate inks, which serve as an activating agent for copper plating, were printed and dried on flexible plastic substrates. The printed plastic sheets were then immersed in an electroless copper plating bath at 55 °C for 2 min to create copper thin films on the printed patterns. The prepared copper films have an electrical conductivity as high as 83% of bulk copper and show good adhesion on PET or PI substrates.

  2. Direct Electroless Nickel Plating on AZ91D Magnesium Alloy from a Sulfate Solution and its Deposition Mechanism

    Institute of Scientific and Technical Information of China (English)

    GU Chang-dong; LIAN Jian-she; LI Guang-yu; NIU Li-yuan; JIANG Zhong-hao

    2004-01-01

    A bath of electroless plating Ni on the AZ91D magnesium alloy, containing sulfate nickel, was given in this paper. The nucleation mechanism of Ni-P deposits on the AZ91D magnesium alloy was studied by using XRD and SEM.The electroless Ni-P deposits were preferentially nucleated on the β (Mg17Al12) phase and extended to the primary and eutectic α phases of the AZ91D magnesium alloy.

  3. Direct Electroless Nickel Plating on AZ91D Magnesium Alloy from a Sulfate Solution and its Deposition Mechanism

    Institute of Scientific and Technical Information of China (English)

    GUChang-dong; LIANJian-she; LIGuang-yu; NIULi-yuan; JIANGZhong-hao

    2004-01-01

    A bath of electroless plating Ni on the AZ91D magnesium alloy, containing sulfate nickel, was given in this paper. The nucleation mechanism of Ni-P deposits on the AZ91D magnesium alloy was studied by using XRD and SEM. The electroless Ni-P deposits were preferentially nucleated on the β(Mg17Al12) phase and extended to the primary and eutectic α phases of the AZ91D magnesium alloy.

  4. A New Activation Method for Electroless Metal Plating: Palladium Laden via Bonding with Self-Assembly Monolayers

    Institute of Scientific and Technical Information of China (English)

    2002-01-01

    A new activation method has been developed for electroless copper plating on silicon wafer based on palladium chemisorption on SAMs of APTS without SnCl2 sensitization and roughening condition. A closely packed electroless copper film with strong adhesion is successfully fonned by AFM observation. XPS study indicates that palladium chemisorption occurred via palladium chloride bonding to the pendant amino group of the SAMs.

  5. Preparation and characterization of molybdenum powders with copper coating by the electroless plating technique

    Institute of Scientific and Technical Information of China (English)

    WANG Guangjun; WANG Dezhi

    2008-01-01

    Molybdenum powders with a diameter of approximately 3 μm were coated with copper using the electroless plating technique in the pH 12.5-13 and temperature range of 55-75℃.The optimization of the electroless copper bath was evaluated through the combination of process parameters like pH and temperature.The optimized values of pH and temperature were found to be 12.5 and 60℃,respectively,which attributes to the bright maroon color of the coating with an increase in weight of 46%.The uncoated and coated powders were subjected to microstructural studies using scanning electron microscope (SEM) and the phases were analyzed using X-ray diffraction (XRD).An attempt was made to understand the growth mechanism of the coating.The diffusion-shrinkage autocatalytic model was suggested for copper growth on the molybdenum surface.

  6. Site-selective electroless nickel plating on patterned thin films of macromolecular metal complexes.

    Science.gov (United States)

    Kimura, Mutsumi; Yamagiwa, Hiroki; Asakawa, Daisuke; Noguchi, Makoto; Kurashina, Tadashi; Fukawa, Tadashi; Shirai, Hirofusa

    2010-12-01

    We demonstrate a simple route to depositing nickel layer patterns using photocross-linked polymer thin films containing palladium catalysts, which can be used as adhesive interlayers for fabrication of nickel patterns on glass and plastic substrates. Electroless nickel patterns can be obtained in three steps: (i) the pattern formation of partially quaterized poly(vinyl pyridine) by UV irradiation, (ii) the formation of macromolecular metal complex with palladium, and (iii) the nickel metallization using electroless plating bath. Metallization is site-selective and allows for a high resolution. And the resulting nickel layered structure shows good adhesion with glass and plastic substrates. The direct patterning of metallic layers onto insulating substrates indicates a great potential for fabricating micro/nano devices.

  7. 3D amino-induced electroless plating: a powerful toolset for localized metallization on polymer substrates.

    Science.gov (United States)

    Garcia, Alexandre; Berthelot, Thomas; Viel, Pascal; Jégou, Pascale; Palacin, Serge

    2011-11-18

    The "3D amino-induced electroless plating" (3D-AIEP) process is an easy and cost-effective way to produce metallic patterns onto flexible polymer substrates with a micrometric resolution and based on the direct printing of the mask with a commercial printer. Its effectiveness is based on the covalent grafting onto substrates of a 3D polymer layer which presents the ability to entrap Pd species. Therefore, this activated Pd-loaded and 3D polymer layer acts both as a seed layer for electroless metal growth and as an interdigital layer for enhanced mechanical properties of the metallic patterns. Consequently, flexible and transparent poly(ethylene terephtalate) (PET) sheets were selectively metalized with nickel or copper patterns. The electrical properties of the obtained metallic patterns were also studied.

  8. Fabrication of electroless nickel plated aluminum freeform mirror for an infrared off-axis telescope.

    Science.gov (United States)

    Kim, Sanghyuk; Chang, Seunghyuk; Pak, Soojong; Lee, Kwang Jo; Jeong, Byeongjoon; Lee, Gil-jae; Kim, Geon Hee; Shin, Sang Kyo; Yoo, Song Min

    2015-12-01

    Freeform mirrors can be readily fabricated by a single point diamond turning (SPDT) machine. However, this machining process often leaves mid-frequency errors (MFEs) that generate undesirable diffraction effects and stray light. In this work, we propose a novel thin electroless nickel plating procedure to remove MFE on freeform surfaces. The proposed procedure has a distinct advantage over a typical thick plating method in that the machining process can be endlessly repeated until the designed mirror surface is obtained. This is of great importance because the sophisticated surface of a freeform mirror cannot be optimized by a typical SPDT machining process, which can be repeated only several times before the limited thickness of the nickel plating is consumed. We will also describe the baking process of a plated mirror to improve the hardness of the mirror surface, which is crucial for minimizing the degradation of that mirror surface that occurs during the polishing process. During the whole proposed process, the changes in surface figures and textures are monitored and cross checked by two different types of measurements, as well as by an interference pattern test. The experimental results indicate that the proposed thin electroless nickel plating procedure is very simple but powerful for removing MFEs on freeform mirror surfaces.

  9. Electrochemical behavior of Cu-Zn-Al shape memory alloy after surface modification by electroless plated Ni-P

    Institute of Scientific and Technical Information of China (English)

    LIANG Chenghao; CHEN Bangyi; CHEN Wan; WANG Hua

    2004-01-01

    The electrochemical behavior of Cu-Zn-Al shape memory alloy (SMA) with and without electroless plated Ni-P was investigated by electrochemical methods in artificial Tyrode's solution. The results showed that Cu-Zn-Al SMA engendered dezincification corrosion in Tyrode's solution. The anodic active current densities as well as electrochemical dissolution sensitivity of the electroless plated Ni-P Cu-Zn-Al SMA increased with NaCl concentration rising, pH of solution decreasing and environmental temperature uprising. X-ray diffraction analysis indicated that after surface modification by electroless plated Ni-P, an amorphous plated film formed on the surface of Cu-Zn-Al SMA. This film can effectively isolate matrix metal from corrosion media and significantly improve the electrochemical property of Cu-Zn-Al SMA in artificial Tyrode's solution.

  10. Seeding of silicon by copper ion implantation for selective electroless copper plating

    Energy Technology Data Exchange (ETDEWEB)

    Bhansali, S.; Sood, D.K.; Zmood, R.B. [Microelectronic and Materials Technology Centre, Royal Melbourne Institute of Technolgy, Melbourne, VIC (Australia)

    1993-12-31

    We report on the successful use of copper(self) ion implantation into silicon to seed the electroless plating of copper on silicon (100) surfaces. Copper ions have been implanted to doses of 5E14-6.4E16 ions/cm{sup 2} using a MEEVA ion implanter at extraction voltage of 40kV. Dose was varied in fine steps to determine the threshold dose of 2E15 Cu ions/cm{sup 2} for `seed` formation of copper films on silicon using a commercial electroless plating solution. Plated films were studied with Rutherford backscattering spectrometry, scanning electron microscopy, EDX and profilometry . The adhesion of films was measured by `scotch tape test`. The adhesion was found to improve with increasing dose. However thicker films exhibited rather poor adhesion and high internal stress. SEM results show that the films grow first as isolated islands which become larger and eventually impinge into a continuous film as the plating time is increased. (authors). 5 refs., 1 tab., 3 figs.

  11. Electroless nickel plating of arc discharge synthesized carbon nanotubes for metal matrix composites

    Energy Technology Data Exchange (ETDEWEB)

    Jagannatham, M.; Sankaran, S.; Prathap, Haridoss, E-mail: prathap@iitm.ac.in

    2015-01-01

    Highlights: • Electroless Ni coatings have been performed on CNTs for various deposition times. • The deposition of nickel increased with increase in deposition time. • A deposition time of 60 min has been optimum for uniform coating of Ni on CNTs. • The CNTs with uniform coating of Ni are potential for reinforcements in composites. • Electroless nickel coatings are determined to be super paramagnetic behavior. - Abstract: Electroless nickel (EN) plating was performed on arc discharge synthesized multiwalled carbon nanotubes for various deposition times. X-ray diffraction (XRD), Transmission electron microscopy (TEM), and Raman spectroscopy characterization techniques are used to identify the presence of nickel deposition on the carbon nanotubes (CNTs) and the degree of graphitization. The results indicate that impurities are less in the purified CNTs as compared to raw carbon soot. Increasing deposition time up to 60 min increases uniform deposition of nickel throughout the length of the CNTs. However, for deposition time longer than 60 min, nickel particles are seen separated from the surface of the CNTs. Uniformly coated nickel CNTs throughout their length are potential candidates for reinforcements in composite materials. Magnetic properties of the nickel coated CNTs, with deposition time of 30 and 60 min were also evaluated. The magnetic saturation of nickel coated CNTs with deposition time of 30 min is less compared to nickel coated CNTs with deposition time of 60 min.

  12. Evaluation of Electroless-Nickel Plated Polypropylene under Thermal Cycling and Mechanical Tests

    Directory of Open Access Journals (Sweden)

    O.O. Ajibola

    2016-09-01

    Full Text Available The electroless-nickel composite (ENC consisting of bright metallic electroless-nickel (EN and dull electroless-nickel-phosphorus (EN-P were deposited on the polypropylene (PP substrate from the sodium hypophosphite baths. The ENC plated specimens were subjected to abrasive wear-adhesion test of 1750, 3500, 7000 and 14000 cycles; thermal cycle-adhesion tests, and tensile strength and creep tests. The deposition of ENC influenced the strength and creep strain properties of the PP. The maximum stress σ of 118 (MPa was obtained from EN-PP specimen at strain  of 0.1 mm/mm as compared with the PP having stress σ of 36 (MPa at strain  of 0.07 mm/mm before failure The surface appearances and microstructures of ENC film on PP substrates were examined under the higher resolution metallurgical microscope with digital camera and microscopic camera. The composition of ENC film was characterized using Scanning Electron Microscopy and Energy Dispersive X-Ray analyses (Jeol JSM-7600F Field Emission SEM/EDX, The micrographs and spectra lines data generated were used to interpret the results.

  13. Environmentally friendly electroless plating for Ag/TiO2-coated core-shell magnetic particles using ultrasonic treatment.

    Science.gov (United States)

    Kim, Soo-Dong; Choe, Won-Gyun; Jeong, Jong-Ryul

    2013-11-01

    In this work, high-reflectance brilliant white color magnetic microspheres comprising a Fe/TiO2/Ag core-shell structure with a continuous, uniform compact silver layer were successfully fabricated by TiO2-assisted electroless plating in a simple and eco-friendly method. The coating procedure for TiO2 and Ag involved a sol-gel reaction and electroless plating with ultrasound treatment. The electroless plating step was carried out in an eco-friendly manner in a single process without environmentally toxic additives. The TiO2 layer was used as a modification layer between the Fe microspheres and the silver layer to improve adhesion. A continuous and compact silver layer could be formed with a high degree of morphological control by introducing ultrasonication and adjusting the ammonium hydroxide concentration.

  14. Effect of hydrogen plasma on electroless-plating Ni-B films and its Cu diffusion barrier property.

    Science.gov (United States)

    Choi, Kyeong-Keun; Kee, Jong; Kwon, Da-Jung; Kim, Deok-Kee

    2014-12-01

    Electroless-plating Ni-B films have been evaluated for the application as the diffusion barrier and metal cap for copper integration. The effect of post plasma treatment in a hydrogen environment on the characteristics of Ni-B films such as chemical composition, surface roughness, crystallinity, and resistivity was investigated. By treating electroless-plating Ni-B films with H2 plasma, the resistance and the roughness of the films decreased. The leakage current of Ni-B bottom electrode/30-nm-thick Al2O3/Al top electrode structures improved after the H2 plasma treatment on the Ni-B films. 40 nm-thick electroless-plating Ni-B film was able to block Cu diffusion up to 350 degrees C.

  15. Synthesis of YSZ@Ni Nanoparticle by Modified Electroless Plating Process.

    Science.gov (United States)

    Yu, Ping; Zheng, Haizhong; Li, Guifa; Xiong, Lingling; Luo, Qinhao

    2015-12-01

    Ni-YSZ (Y2O3-stabilized ZrO2) composites with core-shell structure (YSZ@Ni) were produced by modified electroless plating process. It was found that YSZ nanoparticles were well encapsulated by nickel powders at 65 degrees C with pH = 12. The spherical nanopowders had core-shell structure and the shell layer was less than 20 nm. The X-ray diffraction (XRD) analysis inferred the production was composed of YSZ and Ni crystals. In the end, the formation mechanism was discussed.

  16. High Aspect Pattern Formation by Integration of Micro Inkjetting and Electroless Plating

    CERN Document Server

    Gian, P W; Liang, Y N; Lok, B K; Lu, C W; Ooi, B L

    2008-01-01

    This paper reports on formation of high aspect micro patterns on low temperature co-fired ceramic (LTCC) substrates by integrating micro inkjetting with electroless plating. Micro inkjetting was realized by using an inkjetting printer that ejects ink droplets from a printhead. This printhead consists of a glass nozzle with a diameter of 50 micrometers and a piezoelectric transducer that is coated on the nozzle. The silver colloidal solution was inkjetted on a sintered CT800 ceramic substrate, followed by curing at 200 degrees C for 60 minutes. As a result, the silver trace with a thickness of 200 nm was obtained. The substrate, with the ejected silver thin film as the seed layer, was then immersed into a preinitiator solution to coat a layer of palladium for enhancing the deposition of nickel. Electroless nickel plating was successfully conducted at a rate of 0.39 micrometers /min, and the thickness of traces was plated up to 84 micrometers. This study demonstrates that the integration of inkjetting with plat...

  17. Electroless-plated gold films for sensitive surface plasmon resonance detection of white spot syndrome virus.

    Science.gov (United States)

    Lei, Yun; Chen, Hongyu; Dai, Heping; Zeng, Zhaorui; Lin, Yi; Zhou, Feimeng; Pang, Daiwen

    2008-02-28

    The paper describes the rapid and label-free detection of the white spot syndrome virus (WSSV) using a surface plasmon resonance (SPR) device based on gold films prepared by electroless plating. The plating condition for obtaining films suitable for SPR measurements was optimized. Gold nanoparticles adsorbed on glass slides were characterized by transmission electron microscopy (TEM). Detection of the WSSV was performed through the binding between WSSV in solution and the anti-WSSV single chain variable fragment (scFv antibody) preimmobilized onto the sensor surface. Morphologies of the as-prepared gold films, gold films modified with self-assembled alkanethiol monolayers, and films covered with antibody were examined using an atomic force microscope (AFM). To demonstrate the viability of the method for real sample analysis, WSSV of different concentrations present in a shrimp hemolymph matrix was determined upon optimizing the surface density of the antibody molecules. The SPR device based on the electroless-plated gold films is capable of detecting concentration of WSSV as low as 2.5 ng/mL in 2% shrimp hemolymph, which is one to two orders of magnitude lower than the level measurable by enzyme-linked immunosorbant assays.

  18. Enhanced uniformity in arrays of electroless plated spherical gold nanoparticles using tin presensitization.

    Science.gov (United States)

    Blake, Phillip; Ahn, Wonmi; Roper, D Keith

    2010-02-02

    Gold nanoparticle arrays created with electroless gold plating provide a unique means of transforming nanocylinders usually formed in electron beam lithography to spherical nanoparticles. Alone, electroless gold plating is not selective to the substrate and results in the formation of a gold film on all exposed surfaces of an electron beam patterned sample, including the electron resist. Undesired gold plating occurred near patterned features on the substrate surface, which was reduced by increasing post-spin-coat cure time. When the electron resist is removed, some nanocylinders break off with the gold film, leaving partial cylinders or holes in the patterned elements. By presensitizing the substrate surface with tin, gold cylinders may be selectively deposited to the substrate surface without forming a film on the electron resist. Tin presensitized arrays were produced with 47.1 +/- 7.4 nm radius gold nanoparticles with an interparticle distance of 646.0 +/- 12.4 nm. Defects from sheared, missing, and redeposited Au particles associated with the resist removal were minimized, resulting in enhanced size and shape uniformity of pillars and arrays. Hollow particles were eliminated, and relative standard deviation in particle size was reduced by 7.4% on average, while elongation was reduced 12.3% when astigmatism was eliminated.

  19. Electroless plating Ni-P matrix composite coating reinforced by carbon nanotubes

    Institute of Scientific and Technical Information of China (English)

    邓福铭; 陈小华; 陈卫祥; 李文铸

    2004-01-01

    Ni-P matrix composite coating reinforced by carbon nanotubes (CNTs) was deposited by electroless plating. The most important factors that influence the content of carbon nanotubes in deposits, such as agitation, surfactant and carbon nanotubes concentration in the plating bath were investigated. The surface morphology, structure and properties of the Ni-P-CNTs coating were examined. It is found that the maximum content of carbon nanotubes in the deposits is independent of carbon nanotubes concentration in the plating bath when it is up to 5 mg/L. The test results show that the carbon nanotubes co-deposited do not change the structure of the Ni-P matrix of the composite coating, but greatly increase the hardness and wear resistance and decrease the friction coefficient of the Ni-PCNTs composite coating with increasing content of carbon nanotubes in deposits.

  20. Preparation of conductive silk fabric with antibacterial properties by electroless silver plating

    Science.gov (United States)

    Yu, Dan; Kang, Gengen; Tian, Weicheng; Lin, Lu; Wang, Wei

    2015-12-01

    To obtain an efficient approach to metalize silk fabric, a novel method was explored and silver-plated silk was prepared. In this study, tris (2-carboxyethyl) phosphine (TCEP) was utilized as a reducing agent to generate thiol groups on the silk surface. These thiol groups react with silver ions to form metal complexes, which were used as catalytic seeds and successfully initiated electroless silver plating. A variety of methods, including Raman, XRD, TG, SEM and EDS were used to characterize the intermediates and final products. The results showed that a uniform and smooth metal layer could be obtained when compared with that without TCEP pretreatment. The silver-plated silk fabric exhibited good electrical conductivity and high anti-bacterial properties. These attractive features enable this conductive silk fabric to be a good candidate as a biomedical material.

  1. Characterization of nano-sized SiC@Ni composite fabricated by electroless plating method.

    Science.gov (United States)

    Xu, Zhan; Chen, Yigang

    2013-02-01

    A nano-sized SiC@Ni composite was prepared by simple electroless plating method. Nickel can be reduced by Na2H2PO2 under the catalysis of Pd to despite onto the surface of SiC nanoparticles. The composite structure was characterized by means of TEM images, XRD and the components were analyzed using EDS. The coating layer on the SiC particles was several nanometers thick and mainly in a form of fine Ni crystalline grain and amorphous Ni-P alloy. By increasing the concentration of Na2H2PO2 in the plating bath, the uniformity of the coating layer can be improved obviously. Both of the magnetism and crystallinity of Ni coatings depends on the P content in the coating which can be decreased by increasing the pH values of plating solutions. The SiC@Ni particles exhibited soft magnetic characteristics.

  2. [Characterization of Wood Surface Treated with Electroless Copper Plating by Near Infrared Spectroscopy Technology].

    Science.gov (United States)

    Qin, Jing; Zhang, Mao-mao; Zhao, Guang-jie; Yang, Zhong

    2015-05-01

    Wood electromagnetic shielding material, which was made by treating wood with electroless plating, not only keep the superior characteristics of wood, but also improve the conductivity, thermal conductivity and electromagnetic shielding properties of wood. The emergence of this material opens the way to the value-added exploitation of wood and widens the processing and application field for the electromagnetic shielding material. In order to explore the feasibility of using NIR technology to investigate the properties of wood electromagnetic shielding material, this study analysis the samples before and after copper plated process by the NIR spectroscopy coupled with principal component analysis (PCA). The results showed that (1) there exist significant differences between samples before and after copper plated process both on the spectral shape and absorption, and the great differences can also be seen in the samples with different treat time, especially for the samples with 5 min treat time; (2) after PCA analysis, six clusters from the samples before and after copper plated process were separately distributed in the score plot, and the properties of untreated wood and sensitized wood were similar, and the properties of samples for 25 and 40 min treat time were also similar in order that these samples were close to each other, all of which might suggest that the NIR spectroscopy reflected major feature information about material treatment; (3) After comparing the PCA performance between NIR and visible spectral region, it could be found that the classification performance of samples before and after copper plated process based on the NIR region were better than that based on the visible region, and the information of color on the surface of samples were preferably reflected in the visible region, which could indicate that there are more information about samples' surface characters using the visible spectroscopy coupled with NIR spectroscopy and it is feasible to

  3. Electroless Ni-Cu-P/nano-graphite composite coatings for bipolar plates of proton exchange membrane fuel cells

    Science.gov (United States)

    Lee, Cheng-Kuo

    2012-12-01

    This study evaluates the effects of an electroless Ni-Cu-P/nano-graphite composite coating on the surface characteristics of anodized 5083 aluminum alloy, including electrical resistivity, corrosion resistance of the alloy in a simulated solution of 0.5 M H2SO4 + 2 ppm NaF in polymer electrolyte membrane fuel cells (PEMFCs). The co-deposition and adhesion of the composite coatings on a 5083 substrate are enhanced by an anodizing process. The electroless Ni-Cu-P plating solution is prepared by adding different CuSO4·5H2O concentrations into the electroless Ni-P plating solution and adding nano-graphite (15-40 nm) particles to form the Ni-Cu-P/nano-graphite composite coatings. Experimental results indicate that the electroless Ni-Cu-P/nano-graphite composite coating enhances the hardness, conductivity, corrosion resistance of the 5083 substrate in the corrosive solution. The anodizing treatment enhances the electroless composite coatings by providing better uniformity, density, and adhesion compared to substrate without anodizing treatment. The electroless Ni-Cu-P/nano-graphite composite coating deposited on the optimal anodized 5083 substrate at a low CuSO4·5H2O concentration of 0.25 g l-1 with 20 g l-1 nano-graphite added have the best surface structure, highest hardness, electrical conductivity and corrosion resistance. Therefore, this novel electroless Ni-Cu-P/nano-graphite composite-coated 5083 aluminum alloy has potential applications in bipolar plates of PEM fuel cells.

  4. Study of electroless nickel plating of ceramic particles

    Energy Technology Data Exchange (ETDEWEB)

    Deuis, R.L.; Subramanian, C.; Strafford, K.N.; Arora, P. [Univ. of South Australia (Australia); Yellup, J.M. [CSIRO, Woodville North, South Australia (Australia). Div. of Manufacturing Technology

    1995-10-15

    In the production of aluminum-based metal matrix composites (MMC), the wettability of the reinforcement particulates by the matrix is an important factor. The manufacture of MMC reinforced with alumina particles require the use of specialized fabrication techniques such as rheocasting in order to achieve effective particle incorporation. Several surface treatments have been applied to alumina and other reinforcement particulates in order to modify particle wettability. The aim of this study was to investigate the deposition of Ni-P onto several ceramic particulate surfaces without the use of the conventional sensitization and activation steps. This nickel plating treatment, had the potential to improve the incorporation of alumina particles in aluminum melts, with respect to MMC formation by the plasma transferred arc (PTA) surfacing process.

  5. Preparation of micro gold devices on poly(dimethylsiloxane) chips with region-selective electroless plating.

    Science.gov (United States)

    Hao, Zhenxia; Chen, Hengwu; Ma, Dan

    2009-10-15

    A novel protocol for fabrication of micro gold devices on poly(dimethylsiloxane) (PDMS) substrates was developed on the basis of region-selective electroless plating. The layout of a micro gold device was first photochemically patterned onto the PDMS surface through a UV induced poly(acrylic acid) (PAA) grafting process. The carboxylic moieties on the grafted PAA served as the scaffold for a series of wet chemical reactions that led to the immobilization of gold nanoparticles in the UV-exposed region, where electroless plating then occurred under the catalysis of the nanoparticles. Gold devices fabricated with such a protocol could tolerate the Scotch tape test and survive in a repeated bending-straightening test. They also showed good stability in acidic and alkaline solutions, possessed almost the same electrochemical properties as a standard gold disk electrode, and allowed thiol-compounds to form a perfect self-assembled monolayer on their surfaces. The fabricated micro gold electrode was demonstrated to be suitable as the integrated amperometric detection element in a full PDMS micro electrophoresis chip.

  6. The Effect of Adding Corrosion Inhibitors into an Electroless Nickel Plating Bath for Magnesium Alloys

    Science.gov (United States)

    Hu, Rong; Su, Yongyao; Liu, Hongdong; Cheng, Jiang; Yang, Xin; Shao, Zhongcai

    2016-10-01

    In this work, corrosion inhibitors were added into an electroless nickel plating bath to realize nickel-phosphorus (Ni-P) coating deposition on magnesium alloy directly. The performance of five corrosion inhibitors was evaluated by inhibition efficiency. The results showed that only ammonium hydrogen fluoride (NH4HF2) and ammonium molybdate ((NH4)2MoO4) could be used as corrosion inhibitors for magnesium alloy in the bath. Moreover, compounding NH4HF2 and (NH4)2MoO4, the optimal concentrations were both at 1.5 ~ 2%. The deposition process of Ni-P coating was observed by using a scanning electron microscope (SEM). It showed corrosion inhibitors inhibited undesired dissolution of magnesium substrate during the electroless plating process. In addition, SEM observation indicated that the corrosion inhibition reaction and the Ni2+ replacement reaction were competitive at the initial deposition time. Both electrochemical analysis and thermal shock test revealed that the Ni-P coating exhibited excellent corrosion resistance and adhesion properties in protecting the magnesium alloy.

  7. Electroless plating of PVC plastic through new surface modification method applying a semi-IPN hydrogel film

    Science.gov (United States)

    Wang, Ming-Qiu; Yan, Jun; Du, Shi-Guo; Li, Hong-Guang

    2013-07-01

    A novel palladium-free surface activation process for electroless nickel plating was developed. This method applied a semi-Interpenetrating Polymer Network (semi-IPN) hydrogel film to modify the poly(vinyl chloride) (PVC) surface by chemical bonds. The activation process involved the formation of semi-IPN hydrogel film on the PVC surface and the immobilization of catalyst for electroless plating linking to the pretreated substrate via Nsbnd Ni chemical bond. The hydrogel layer was used as the chemisorption sites for nickel ions, and the catalyst could initiate the subsequent electroless nickel plating onto the PVC surface. Finally, a Ni-P layer was deposited on the nickel-activated PVC substrate by electroless plating technique. The composition and morphology of nickel-plated PVC foils were characterized by scanning electron microscopy (SEM), X-ray photoelectron spectroscopy (XPS), energy dispersive X-ray spectroscopy (EDS) and X-ray diffraction (XRD). The results of SEM and XRD show that a compact and continuous Ni-P layer with amorphous nickel phase is formed on the PVC surface. EDS shows that the content of the nickel and the phosphorus in the deposits is 89.4 wt.% and 10.6 wt.%, respectively.

  8. Electroless plating of PVC plastic through new surface modification method applying a semi-IPN hydrogel film

    Energy Technology Data Exchange (ETDEWEB)

    Wang, Ming-Qiu, E-mail: mqwang1514@163.com; Yan, Jun; Du, Shi-Guo; Li, Hong-Guang

    2013-07-15

    A novel palladium-free surface activation process for electroless nickel plating was developed. This method applied a semi-Interpenetrating Polymer Network (semi-IPN) hydrogel film to modify the poly(vinyl chloride) (PVC) surface by chemical bonds. The activation process involved the formation of semi-IPN hydrogel film on the PVC surface and the immobilization of catalyst for electroless plating linking to the pretreated substrate via N-Ni chemical bond. The hydrogel layer was used as the chemisorption sites for nickel ions, and the catalyst could initiate the subsequent electroless nickel plating onto the PVC surface. Finally, a Ni–P layer was deposited on the nickel-activated PVC substrate by electroless plating technique. The composition and morphology of nickel-plated PVC foils were characterized by scanning electron microscopy (SEM), X-ray photoelectron spectroscopy (XPS), energy dispersive X-ray spectroscopy (EDS) and X-ray diffraction (XRD). The results of SEM and XRD show that a compact and continuous Ni–P layer with amorphous nickel phase is formed on the PVC surface. EDS shows that the content of the nickel and the phosphorus in the deposits is 89.4 wt.% and 10.6 wt.%, respectively.

  9. Electroless Plating of Ni-Fe-P Alloy and Corrosion Resistance of the Deposit

    Institute of Scientific and Technical Information of China (English)

    Senlin WANG

    2005-01-01

    Electroless Ni-Fe-P alloys in an alkaline bath were plated. Theeffects of deposition parameters on the plating rate and the coating composition were examined. The weight loss test and the anodic polarization measurement of the deposits in 3.5 wt pct NaCl solution (pH7.0) showed that the deposits with the mole ratio of NiSO4/FeSO4 being 0.07:0.03, pH8.0 and 7.5 possess better corrosion resistance than that of the other deposits and the Ni-Fe-P deposits did not form passive films in this environment. In 5.0 wt pct NaOH solution, the Ni-Fe-P deposits have better corrosion resistance and formed passive films.

  10. Effect of plating time on growth of nanocrystalline Ni–P from sulphate/glycine bath by electroless deposition method

    Indian Academy of Sciences (India)

    N Latha; V Raj; M Selvam

    2013-08-01

    Nanocrystalline nickel phosphorus (NC-Ni–P) deposits from sulphate/glycine bath using a simple electroless deposition process is demonstrated. In the present investigation, nanoporous alumina films are formed on the aluminium surface by anodization process followed by deposition of nickel onto the pores by electroless plating method. Anodic aluminium oxide surface was first sensitized and activated by using palladium chloride solution before immersing into the electroless nickel bath. Electroless nickel plating was carried out from the optimized bath by changing the deposition time from 20 to 1800 s at a constant temperature of 80 °C and a pH of 4.0. Surface morphology, elemental composition, structure and reflectance of the deposits have been analysed by using scanning electron microscopy, atomic force microscopy, energy dispersive X-ray analysis, X-ray diffractometry and UV-visible spectroscopic studies, respectively. Electroless nickel deposits formed at an early stage produces dense uniform nanocrystals containing higher percentage of atomic phosphorus with cubic Ni (111) structure. As the deposition time increased, nanocrystalline sharp peak became amorphous and dimension of the crystal size varied from 54 to 72 nm.

  11. Electroless Sliver-Plating Process in the Preparation of 103Pd-125I Hybrid Brachytherapy Seed Cores

    Directory of Open Access Journals (Sweden)

    LI Zhong-yong1,2;CHEN Bin-da1;Lv Xiao-zhou1;LU Jin-hui1;CUI Hai-ping1,2

    2014-02-01

    Full Text Available Electroless 103Pd plating and electroless Ag plating and chemical 125I depositing were took place on the surface of carbon rods in turn, which was a reliable method for the preparation of 103Pd-125I hybrid brachytherapy seed cores. 103Pd and 125I were deposited on the same substrate effectively through silver coating as a bridge. The process of electroless Ag plating was a novel and important step in the preparation of 103Pd-125I hybrid seed. In this work, the process of electroless Ag plating was studied using 0.5×3.0 mm carbon rods with palladium coating as substrate, silver-ammino complex as precursor, 110mAg as radioactive tracer, and hydrazine as reductant. The optimum conditions were AgNO3 2g/L,Na2EDTA 40 g/L,NH3•H2O 16.25%,H4N2•H2O 5‰,pH=10,t=60 min,and T=35 ℃. Sliver deposited on each carbon rod was uniform, and sliver-coating was white and smooth.

  12. Fabrication of a gold microelectrode for amperometric detection on a polycarbonate electrophoresis chip by photodirected electroless plating.

    Science.gov (United States)

    Kong, Yong; Chen, Hengwu; Wang, Yurong; Soper, Steven A

    2006-07-01

    A novel method of photoresist-free micropatterning coupled with electroless gold plating is described for the fabrication of an integrated gold electrode for electrochemical detection (ED) on a polycarbonate (PC) electrophoresis microchip. The microelectrode layout was photochemically patterned onto the surface of a PC plate by selective exposure of the surface coated without photoresist to 254 nm UV light through a chromium/quartz photomask. Thus, the PC plate was selectively sensitized by formation of reactive chemical moieties in the exposed areas. After a series of wet chemistry reactions, the UV-exposed area was activated with a layer of gold nanoparticles that served as a seed to catalyze the electroless plating. The gold microelectrode was then selectively plated onto the activated area by using an electroless gold plating bath. Nonselective gold deposition on the unwanted areas was eliminated by sonication of the activated PC plate in a KSCN solution before electroless plating, and the adhesion of the plated electrodes to the PC surface was strengthened with thermal annealing. Compared with the previously reported electroless plating technique for fabrication of microelectrodes on a microchip, the present method avoided the use of a membrane stencil with an electrode pattern to restrict the area to be wet-chemically sensitized. The CE with integrated ED (CE-ED) microchip was assembled by thermal bonding an electrode-plated PC cover plate to a microchannel-embossed PC substrate. The novel method allows one to fabricate low-cost, electrode-integrated, complete PC CE-ED chips with no need of a clean room. The fabricated CE-ED microchip was demonstrated for separation and detection of model analytes, including dopamine (DA) and catechol (CA). Detection limits of 0.65 and 1.03 microM were achieved for DA and CA, respectively, and theoretical plate number of 1.4 x 10(4) was obtained for DA. The plated gold electrode can be used for about 4 h, bearing usually more

  13. High-purity Ni electroless plating on screen-printed anodized Al substrates

    Science.gov (United States)

    Park, Sang-Geon; Lee, Youn-Seoung; Rha, Sa-Kyun

    2016-07-01

    By using an electroless plating process with a Ni source solution including dimethylamine borane (DMAB) at pH 6.5 and 65 ◦ C, we obtained a higher purity Ni film (< 1 at.% boron) without damage to the anodized Al substrate. With increasing plating time, the thickness of the film increased gradually, although the average deposition rate of the Ni films decreased steadily. We can infer that the abrupt decrease in sheet resistance (Rs) at the interface region is due to the change in the boron concentration caused by surface reactions, and the gradual decrease in Rs in the bulk region is due mainly to the effect of the saturation of boron's concentration on the thickness. From a boron-distribution viewpoint, this result indicates that the B concentration in the Ni film increases gradually with increasing plating time for plating times ≤ 60 s as a kind of initial stage (that is, interface region), and then saturates uniformly for plating times ≥ 300 s as a kind of bulk region. On the other hand, from an electronic structure viewpoint, this result implies that Ni gains 3d electrons with respect to elemental Ni. The increase in the number of electrons gained by the Ni 3d states may result in an enhancement of the electrical conductivity.

  14. ELECTROLESS COPPER PLATING ON FRAXINUS MANDSHURICA VENEER USING GLYOXYLIC ACID AS REDUCING AGENT

    Directory of Open Access Journals (Sweden)

    Lijuan Wang

    2011-06-01

    Full Text Available Copper coating was deposited on Fraxinus mandshurica veneers for preparing EMI shielding composite by electroless plating using glyoxylic acid as reducing agent in the solution. XPS and SEM were used to analyze the activation process. It was found that a continuous chitosan membrane was loaded on the wood surface. XPS results showed that Pd(II ions were chemically adsorbed on a chitosan membrane on the wood surface through an N-Pd σ coordination bond. After reduction, part of Pd(II absorbed formed very little Pd(0 particles on the chitosan-treated wood surface. The activated wood veneers were immersed into a plating bath in which copper film was successfully initiated. The coatings were characterized by SEM-EDS, XPS, and XRD. The metal deposition, surface resistivity, and electromagnetic shielding effectiveness were measured. The morphology of the coating was uniform, compact, and continuous. The wood grains were preserved on the plated wood veneer, which had a copper-like color and sheen. EDS, XPS, and XRD results indicated that the coating consisted of Cu0 with crystalline structure. The surface resistivity and copper deposition reached 175.14 mΩ•cm-2 and 21.66 g/m2 when the veneer was pretreated with 0.8 % chitosan for 8 min and plated for 30 min at 55 oC. The plated veneers exhibited good electromagnetic shielding effectiveness of over 60 dB in frequency ranging from10 MHz to 1.5 GHz.

  15. Crystallization behavior of electroless Co-Ni-B alloy plated in magnetic field in presence of cerium

    Institute of Scientific and Technical Information of China (English)

    XUAN Tian-peng; ZHANG Lei; HUANG Qin-hua

    2006-01-01

    The electrochemical property, chemical composition and crystal structure of electroless Co-Ni-B-Ce alloy plated in general state as well as in magnetic field were studied using potentiometer, plasma emission spectrometer, X-ray diffractometer,transmission electron microscope. The results show that the static potential and polarizability of electroless Co-Ni-B alloy are remarkably improved as the plating is carried out in magnetic field in the presence of a little amount of cerium in plating bath.Because of the action of magnetic field and rare earth element cerium, the boron content in alloy decreases, while cobalt and nickel contents increase. As a result, the amorphous Co-Ni-B alloy transforms to the microcrystalline Co-Ni-B-Ce alloy when the plating is in general state, and the Co-Ni-B alloy makes a crystalline transformation because of the action of magnetic field and rare earth element cerium.

  16. Antibacterial characteristics of electroless plating Ni-P-TiO2 coatings

    Science.gov (United States)

    Zhao, Qi; Liu, Chen; Su, Xueju; Zhang, Shuai; Song, Wei; Wang, Su; Ning, Guiling; Ye, Junwei; Lin, Yuan; Gong, Weitao

    2013-06-01

    Electroless Ni-P coatings have been widely used in the chemical, mechanical and electronic industries due to their excellent corrosion and wear resistance. Many studies reported that the incorporation of nano-sized particles TiO2 into Ni-P matrix greatly improved their anti-corrosion and anti-wear resistance. However no studies have been reported on their anti-bacterial property. In this paper, the Ni-P-TiO2 nano-composite coatings were prepared on stainless steel 316L using electroless plating technique. The experimental results showed that the Ni-P-TiO2 coatings reduced the adhesion of three bacterial strains (Pseudomonas fluorescens, Cobetia and Vibrio) by up to 75% and 70% respectively, as compared with stainless steel and Ni-P coatings. The electron donor surface energy of the Ni-P-TiO2 coatings increased significantly with increasing TiO2 content after UV irradiation. The number of adhered bacteria decreased with increasing electron donor surface energy of the coatings.

  17. Antibacterial characteristics of electroless plating Ni–P–TiO{sub 2} coatings

    Energy Technology Data Exchange (ETDEWEB)

    Zhao, Qi, E-mail: Q.Zhao@dundee.ac.uk [Department of Mechanical Engineering, University of Dundee, DD1 4HN (United Kingdom); Liu, Chen; Su, Xueju; Zhang, Shuai; Song, Wei; Wang, Su [Department of Mechanical Engineering, University of Dundee, DD1 4HN (United Kingdom); Ning, Guiling, E-mail: ninggl@dlut.edu.cn [State Key Laboratory of Fine Chemicals and School of Chemical Engineering, Dalian University of Technology, 2 Linggong Road, Dalian 116024 (China); Ye, Junwei; Lin, Yuan; Gong, Weitao [State Key Laboratory of Fine Chemicals and School of Chemical Engineering, Dalian University of Technology, 2 Linggong Road, Dalian 116024 (China)

    2013-06-01

    Electroless Ni–P coatings have been widely used in the chemical, mechanical and electronic industries due to their excellent corrosion and wear resistance. Many studies reported that the incorporation of nano-sized particles TiO{sub 2} into Ni–P matrix greatly improved their anti-corrosion and anti-wear resistance. However no studies have been reported on their anti-bacterial property. In this paper, the Ni–P–TiO{sub 2} nano-composite coatings were prepared on stainless steel 316L using electroless plating technique. The experimental results showed that the Ni–P–TiO{sub 2} coatings reduced the adhesion of three bacterial strains (Pseudomonas fluorescens, Cobetia and Vibrio) by up to 75% and 70% respectively, as compared with stainless steel and Ni–P coatings. The electron donor surface energy of the Ni–P–TiO{sub 2} coatings increased significantly with increasing TiO{sub 2} content after UV irradiation. The number of adhered bacteria decreased with increasing electron donor surface energy of the coatings.

  18. Polyimide surface modification by using microwave plasma for adhesion enhancement of Cu electroless plating.

    Science.gov (United States)

    Cho, Sang-Jin; Nguyen, Trieu; Boo, Jin-Hyo

    2011-06-01

    Microwave (MW) plasma was applied to the surface of polyimide (PI) films as a treatment to enhance the adhesion between copper deposition layer and PI surface for electroless plating. The influences of nitrogen MW plasma treatment on chemical composition of the PI surface were investigated by using X-Ray photoelectron spectroscopy (XPS). The wettability was also investigated by water contact angle measurement. The surface morphologies of PI films before and after treatment were characterized with atomic force microscopy (AFM). The contact angle results show that was dramatically decreased to 16.1 degrees at the optimal treatment condition from 72.1 degrees (untreated PI). However, the root mean square (RMS) roughness of treated PI film was almost unchanged. The AFM roughness was stayed from 1.0 to 1.2 with/without plasma treatment. XPS data show a nitrogen increase when PI films exposed to N2 MW plasma. Electroless copper depositions were carried out with the free-formaldehyde method using glyoxylic acid as the reducing reagent and mixture palladium chloride, tin chloride as activation solution. Adhesion property between polyimide surface and copper layer was investigated by tape test.

  19. ADSORPTION PROPERTIES OF NICKEL-BASED MAGNETIC ACTIVATED CARBON PREPARED BY PD-FREE ELECTROLESS PLATING

    Directory of Open Access Journals (Sweden)

    Boyang Jia

    2011-02-01

    Full Text Available Nickel-based magnetic activated carbon was synthesized from coconut shell activated carbon by electroless plating with palladium-free activation. The effect of plating solution volume on metallic ratio and adsorption capacity were evaluated. The effect of metallic ratio on specific area, pore volume, and magnetic properties were investigated. The morphologies of activated carbon before and after plating were observed by SEM, and the composition of the layer was analyzed by EDS analysis. The results showed that the metallic ratio was increased with the increase of the plating solution volume. The magnetic activated carbon showed high adsorption capacity for methylene blue and a high iodine number. Those values reached 142.5 mg/g and 1035 mg/g, respectively. The specific area and pore volume decreased from 943 m2/g to 859 m2/g and 0.462 ml/g to 0.417 ml/g, respectively. And the layer was more compact and continuous when the metallic ratio reached 16.37 wt.%. In the layer, there was about 97 wt.% nickel and 3 wt.% phosphorus, which indicates that the layer was a low-phosphorus one. At the same time, magnetism was enhanced, making the product suitable for some special applications.

  20. Microwire formation based on dielectrophoresis of electroless gold plated polystyrene microspheres

    Institute of Scientific and Technical Information of China (English)

    Jiang Hong-Yuan; Ren Yu-Kun; Tao Ye

    2011-01-01

    Microspheres coated with a perfectly conductive surface have many advantages in the applications of biosensors and micro-electromechanical systems. Polystyrene microspheres with the diameter of 10 μm were coated with a 50 nmthick gold layer using an electroless gold plating approach. Dielectrophoresis (DEP) for bare microspheres and shelled microspheres was theoretically analysed and the real part of the Clausius-Mossotti factor was calculated for the two kinds of microspheres. The experiments on the dielectrophoretic characterisation of the uncoated polystyrene microspheres and gold coated polystyrene microspheres (GCPMs) were carried out. Experimental results showed that the gold coated polystyrene microspheres were only acted by a positive dielectrophoretic force when the frequency was below 40M Hz,while the uncoated polystyrene microspheres were governed by a negative dielectrophoretic force in this frequency range.The gold coated polystyrene microspheres were exploited to form the microwire automatically according to their stable dielectrophoretic and electric characterisations.

  1. Research on Processes and Adhesion of Electroless Plating Ni-Cu-P Coating

    Institute of Scientific and Technical Information of China (English)

    HUANG Yan-bin; LIU Bo; ZHANG Ping; LIU De-gang; XU Xiao-li

    2004-01-01

    In order to improve the corrosion and wear resistance of the coatings of electroless plating Ni-Cu-P and broaden its application, an optimizing mathematical theory test has been applied in this research. The processing parameters have been optimized and some Ni-Cu-P coatings have been obtained with smooth and glittering appearance. At the same time,the composite complexants can prevent copper from depositing first and obtain coatings with strong adhesion. The porosity of Ni-Cu-P coating (20 μm) ranked class 9. The changing color time of the coating is more than 800 seconds with HNO3 dropthan 0.5 g/L. The surface appearance of deposition is typical cystiform cells by SEM,which rank close and neatly.

  2. Synthesis and microwave characterization of Co-SiC core-shell powders by electroless plating

    Institute of Scientific and Technical Information of China (English)

    ZHANG Haijun; WU Xiangwei; JIA Quanli; JIA Xiaolin

    2006-01-01

    Co-SiC core-shell powders were prepared by electroless plating. Scanning electron microscopy (SEM) revealed that Co-SiC core-shell powders were of nearly sphere-like shape and were about 0.3 μm. X-ray powder diffraction (XRD)patterns showed that the cobalt powder was hexagonal crystallite. The complex dielectric constant and the complex permeability of Co-SiC core-shell powders-paraffin wax composite were measured by the rectangle waveguide method. It showed that the dielectric loss was less than 0.1 and the magnetic loss was about 0.2 in 8.2-12.4 GHz for prepared Co-SiC core-shell composite powders.

  3. Calculating formation range of binary amorphous alloys fabricated by electroless plating

    Science.gov (United States)

    Zhang, Bangwei; Liao, Shuzhi; Shu, Xiaolin; Xie, Haowen

    2016-06-01

    A lot of amorphous alloy deposits in the binary (Ni, Co, Cu)-(P, B) alloy systems fabricated by electroless plating (EP) have been reported up to date. But no one reported their theoretical modeling of the amorphous formation and calculated their concentration range of amorphous formation (RAF). Using Miedema model and subregular model scheme, the RAFs for the six EP (Ni, Co, Cu)-(P, B) alloys and three Ni-Cu, Ni-Co and Co-Cu alloys have been calculated systematically for the first time. The calculated results are in agreement with experimental observations. Experiments and calculations for the RAFs in the latter three alloy systems reveal that not any RAF formed except crystalline states. The huge difference between the six metal-metalloid alloys and three metal-metal alloys in RAF has been discussed in detail in the paper.

  4. Electroless Plated Co-Ni-P-B/Ni Foam Catalyst for Hydrogen Generation from Sodium Borohydride.

    Science.gov (United States)

    Park, Daeil; Kim, Taegyu

    2016-02-01

    Co-Ni-P-B catalyst supported on Ni foam was prepared using electroless plating for hydrogen generation from an alkaline NaBH4 solution. Co-B, Co-P-B, and Co-Ni-B were prepared for comparison. Surface morphology of catalyst/Ni foams were observed using SEM analysis. The Co- Ni-P-B/Ni foam catalyst showed the superior performance on hydrogen generation rate due to the uniform formation of catalyst particles on the surface of Ni foam. Characteristics of hydrogen generation rate on the Co-N-P-B/Ni foam catalyst were investigated at the variety of NaBH4 and NaOH concentrations. The hydrogen generation rate increased with decreasing NaBH4 concentration, while increasing NaOH concentration. Durability test was performed, resulting in the stable hydrogen generation for 6 hours.

  5. Study of palladium catalyzation for electroless copper plating on polyimide film.

    Science.gov (United States)

    Kim, Bin; Jung, Sang Hee; Suh, Seung Wook; Park, Byung Ki

    2013-01-01

    In order to form flexible printed circuits through inkjet printing technique, the Pd(ll) catalyst ink was printed on the surface of polyimide film modified with KOH solution and then reduced with NaBH4 solution to extract the Pd(O) catalyst nuclei. The concentration of the Pd(ll) catalyst ink and reduction time showed a significant influence on the microstructure of the Pd(O) catalyst nuclei and the formation of Cu patterns through electroless plating. When reduction time exceeded 1 minute, and as the concentration of the Pd(II) catalyst ink increased above 0.02 M, the catalyst nuclei began aggregation, resulting in Cu patterns with thick and more defects.

  6. Electroless copper plating on 3-mercaptopropyltriethoxysilane modified PET fabric challenged by ultrasonic washing

    Energy Technology Data Exchange (ETDEWEB)

    Lu Yinxiang, E-mail: yxlu@fudan.edu.cn [Department of Materials Science, Fudan University, Shanghai 200433 (China); Department of Electronic Chemistry, Interdisciplinary Graduate School of Science and Engineering, Tokyo Institute of Technology, Nagatsuta, Midori-ku, Yokohama 226-8502 (Japan)

    2009-07-30

    Electroless deposition of Cu on poly(ethylene terephthalate) (PET) fabric modified with 3-mercaptopropyltriethoxysilane was investigated. Morphology, composition, structure, thermal decomposing behavior of copper coating PET fabric after ultrasonic washing in water for 1 h were characterized by scanning electron microscopy (SEM), energy dispersive X-ray (EDX) analysis, X-ray photoelectron spectroscopy (XPS), Raman spectrometer, X-ray diffraction (XRD), and thermogravimetric analysis (TG), respectively. Copper plating on modified fabric has good adherence stability and high electric conductivity before and after ultrasonic washing, while copper coating fabric without modification is easily destroyed during the washing process, which leads to the textile changing from conductor to dielectric. As the copper weight on the treated fabric is 28 g/m{sup 2}, the shielding effectiveness (SE) is more than 54 dB at frequency ranging from 0.01 MHz to 18 GHz.

  7. Preparation and magnetic properties of Ni–P–La coating by electroless plating on silicon substrate

    Energy Technology Data Exchange (ETDEWEB)

    Gao, Yun [Tianjin Key Laboratory of Composite and Functional Materials, School of Materials Science and Engineering, Tianjin University, Tianjin 300072 (China); Wang, Jihui, E-mail: jhwang@tju.edu.cn [Tianjin Key Laboratory of Composite and Functional Materials, School of Materials Science and Engineering, Tianjin University, Tianjin 300072 (China); Yuan, Jing [Tianjin Key Laboratory of Composite and Functional Materials, School of Materials Science and Engineering, Tianjin University, Tianjin 300072 (China); College of Physics and Electronic Information Engineering, Qinghai University for Nationalities, Xining, Qinghai 810007 (China); Li, Haiqin [College of Physics and Electronic Information Engineering, Qinghai University for Nationalities, Xining, Qinghai 810007 (China)

    2016-02-28

    Graphical abstract: The content of Ni phase, which is the main ferromagnetic phase in Ni–P–La coating, is almost increased linearly with the concentration of La in plating solution. - Highlights: • The La element improves the magnetic properties of Ni–P–La coating. • Magnetism increases but the stability of bath decreases with La content and pH. • Coatings peel off at high temperature (≥80 °C) and magnetism is weak in short time. • The optimum is the La{sub 2}O{sub 3} of 10 mg L{sup −1}, pH of 5.0, temperature of 75 °C and time of 45 min. - Abstract: Ni–P–La coatings were prepared on Si substrate by electroless plating method under different La content, pH value, plating temperature and plating time. The surface morphology, chemical composition, structure and magnetic properties of coatings were observed and determined by scanning electron microscope (SEM), energy dispersive X-ray spectrometry (EDS), X-ray diffractometer (XRD) and vibrating sample magnetometer (VSM). The results showed that Ni–P–La coating is smooth and uniform with a cellular morphology grown in columnar manner. With the increase of La content, pH value and plating time, the thickness and saturation magnetization of coating are increased continuously, but the stability of plating bath is decreased greatly with La content and pH value. Under higher plating temperature, the thickness and saturation magnetization of coatings are obviously enhanced. But too high plating temperature is harmful to the plating bath and coating. The optimum plating conditions for Ni–P–La coating is La{sub 2}O{sub 3} addition of 10 mg L{sup −1}, pH value of 5.0, plating temperature of 75 °C and plating time of 45 min. The role of La element is to benefit the deposition of Ni element, promote the formation of Ni phase during the annealing process, and thus improve the magnetic properties of Ni–P–La coating.

  8. Study on Physical and Chemical Behaviors of Rare Earths in Preparing Ceramic Tube Supported Palladium Film by Electroless Plating

    Institute of Scientific and Technical Information of China (English)

    2006-01-01

    The rare earths of ytterbium, lanthanum, praseodymium, neodymium and their binary mixtures were respectively added into the traditional electroless plating solution to prepare thin palladium film on the inner surface of porous ceramic tube. The experimental results shows that the addition of rare earths increases palladium deposition rates and the binary mixtures are superior to the single rare earths and the mixture of ytterbium-lanthanum is the most efficient. Adding the mixture of ytterbium-lanthanum can also reduce the plating temperature by 10~20 ℃, shrink the metal crystal size and improve the film densification compared to those by traditional electroless plating. A thin palladium film with 5 μm was prepared and the film made a highly pure hydrogen with a molar fraction of more than 99.97% from a H2-N2 gas mixture. More attentions were paid to analyze the physical and chemical behaviors of the rare earths in palladium film preparation.

  9. Effects of bath composition on the morphology of electroless-plated Cu electrodes for hetero-junctions with intrinsic thin layer solar cell

    Energy Technology Data Exchange (ETDEWEB)

    Lee, Woon Young [Surface Technology R& BD Group, Korea Institute of Industrial Technology (KITECH), Gaetbeol-ro 156, Yeonsu-gu, Incheon 406-840 (Korea, Republic of); Lee, Yu Jin [Surface Technology R& BD Group, Korea Institute of Industrial Technology (KITECH), Gaetbeol-ro 156, Yeonsu-gu, Incheon 406-840 (Korea, Republic of); Department of Materials Science & Engineering, Yonsei University, Yonsei-ro 50, Seodaemun-Gu, Seoul 120-749 (Korea, Republic of); Lee, Min Hyung, E-mail: minhyung@kitech.re.kr [Surface Technology R& BD Group, Korea Institute of Industrial Technology (KITECH), Gaetbeol-ro 156, Yeonsu-gu, Incheon 406-840 (Korea, Republic of)

    2015-07-31

    The morphology of an electroless-plated Cu electrode was investigated as a function of bath composition. To enhance the selectivity of Cu electrode deposition on the surface of an indium tin oxide layer, a Ti/Cu multi-layer was deposited as a Cu electrode seed layer by physical vapor deposition, and then electroless plating was performed using various complexing agents and a surfactant. The degree of selectivity was effectively influenced by the type of complexing agent. The electroless plating solution containing N,N,N′,N′-tetrakis(2-hydroxypropyl)ethylenediamine (THPED) as complexing agent showed excellent selective growth of the Cu electrode as compared to the solution containing ethylenediaminetetraacetic acid. Even though THPED led to better selective growth of the electroless-plated Cu electrode, the aspect ratio of electrode lateral growth was about 2.7 times that of vertical growth. By adding a nonionic surfactant, the ratio between vertical growth rate and lateral growth rate was improved about 4.6 times. The Cu–THPED electroless plating with nonionic surfactant provided a drastic decrease in lateral growth rate, compared with the Cu–THPED electroless plating bath excluding nonionic surfactant. The Cu–THPED solution including nonionic surfactant is a promising composition of electroless plating solution for the clear selective plating of Cu electrodes on hetero-junctions with intrinsic thin layer solar cells. - Highlights: • Selective electroless plating (SEP) depends on binding strength of complexing agent. • The SEP was performed using Cu-N,N,N′,N′-tetrakis(2-hydroxypropyl)ethylenediamine. • A surfactant is able to remove hydrogen bubbles on Cu electrode surface. • The growth of Cu electrode was improved in vertical direction by adding surfactant.

  10. Electroless Deposited Gold Nanoparticles on Glass Plates as Sensors for Measuring the Dielectric Constant of Solutions

    Directory of Open Access Journals (Sweden)

    Y. Kobayashi

    2013-01-01

    Full Text Available This work describes a method for the deposition of Au nanoparticles on glass plates (Au-glass. An electroless metal plating technique was extended to the Au nanoparticle deposition. The technique consisted of three steps that took place on the glass plate: (1 adsorption of Sn2+ ions, (2 deposition of metallic Ag nuclei generated by reducing Ag+ ions with Sn2+ ions on the Sn-adsorbed sites, and (3 deposition of Au nanoparticles by reducing Au+ ions on the Ag surface. TEM observation revealed that metallic Au nanoparticles with a size of  nm were formed on the glass surface. A surface plasmon resonance absorption peak was observed, and its peak wavelength redshifted by immersing the Au-glass into a solution with a large dielectric constant. The redshift corresponded qualitatively to the calculation by the Mie theory accompanying the Drude expression, which was based on the change of the dielectric constant of the solution. The obtained results indicated that the Au-glass functioned as a sensor for measuring the dielectric constant of the solution.

  11. Modeling, Fabrication and Characterization of Scalable Electroless Gold Plated Nanostructures for Enhanced Surface Plasmon Resonance

    Science.gov (United States)

    Jang, Gyoung Gug

    The scientific and industrial demand for controllable thin gold (Au) film and Au nanostructures is increasing in many fields including opto-electronics, photovoltaics, MEMS devices, diagnostics, bio-molecular sensors, spectro-/microscopic surfaces and probes. In this study, a novel continuous flow electroless (CF-EL) Au plating method is developed to fabricate uniform Au thin films in ambient condition. The enhanced local mass transfer rate and continuous deposition resulting from CF-EL plating improved physical uniformity of deposited Au films and thermally transformed nanoparticles (NPs). Au films and NPs exhibited improved optical photoluminescence (PL) and surface plasmon resonance (SPR), respectively, relative to batch immersion EL (BI-EL) plating. Suggested mass transfer models of Au mole deposition are consistent with optical feature of CF-EL and BI-EL films. The prototype CF-EL plating system is upgraded an automated scalable CF-EL plating system with real-time transmission UV-vis (T-UV) spectroscopy which provides the advantage of CF-EL plating, such as more uniform surface morphology, and overcomes the disadvantages of conventional EL plating, such as no continuous process and low deposition rate, using continuous process and controllable deposition rate. Throughout this work, dynamic morphological and chemical transitions during redox-driven self-assembly of Ag and Au film on silica surfaces under kinetic and equilibrium conditions are distinguished by correlating real-time T-UV spectroscopy with X-ray photoelectron spectroscopy (XPS) and scanning electron microscopy (SEM) measurements. The characterization suggests that four previously unrecognized time-dependent physicochemical regimes occur during consecutive EL deposition of silver (Ag) and Au onto tin-sensitized silica surfaces: self-limiting Ag activation; transitory Ag NP formation; transitional Au-Ag alloy formation during galvanic replacement of Ag by Au; and uniform morphology formation under

  12. Electroless Plating of Thin Silver Films on Porous Al2O3 Substrate and the Study of Deposition Kinetics

    Institute of Scientific and Technical Information of China (English)

    Fang Mei; Donglu Shi

    2005-01-01

    A novel concept has been developed to coat the inner pore surfaces of reticulated alumina with a thin silver film by an electroless-plating method. As a result of coating, the porous alumina sample exhibits a sharp transition from insulating to conducting due to a thin silver layer on the inner pore surfaces. Systematic studies have been carried out to investigate the coating kinetics by employment of scanning electron microscope (SEM), X-ray diffraction (XRD), and computer simulation. Both coating procedures and effects of processing parameters on the quality of films are reported. Also, this paper presents the film bonding strength to the substrate, effects of sintering, and conduction mechanism of coated composite. The fundamental silver electroless-plating mechanism has been identified based on computer modeling. The simulation results indicate an excellent agreement between the silver deposition behavior and the physical model applied.

  13. Cu patterning on Si substrate using solution-processed Ti-Cu oxide films and electroless plating

    Science.gov (United States)

    Miyazeki, Yusuke; Horiuchi, Yoshio; Noh, Joo-Hyong; Cordonier, Christopher E. J.; Honma, Hideo; Arakawa, Taro

    2016-09-01

    We demonstrated for the first time the Cu patterning on Si using Ti and Cu oxide (TiCu-ox) films patterned by photolithography and electroless plating without etching or surface modification. The TiCu-ox films had a porous structure and acted as adhesion layers. The TiCu-ox films were patterned by photolithography on Si and glass for comparison, followed by Cu deposition by electroless plating. Fine Cu patterns on the patterned TiCu-ox films were formed. The smallest line/space widths on glass and Si were 3.2/0.8 and 3.6/4.4 µm, respectively. The deposited Cu layers had high adhesion strength and low sheet resistance.

  14. Preparation and characterization of monodispersed PS/Ag composite microspheres through modified electroless plating

    Energy Technology Data Exchange (ETDEWEB)

    Ma Yuehui [State Key Laboratory for Modification of Chemical Fibers and Polymer Materials, College of Materials Science and Engineering, Donghua University, Shanghai 201620 (China); Zhang Qinghua, E-mail: qhzhang@dhu.edu.cn [State Key Laboratory for Modification of Chemical Fibers and Polymer Materials, College of Materials Science and Engineering, Donghua University, Shanghai 201620 (China)

    2012-07-15

    A modified electroless silver-plating process has been devised for the preparation of monodispersed, polystyrene/silver (PS/Ag) composite microspheres with tunable shell thickness. Tailoring was achieved by altering the concentration of the silver precursor in the plating bath. PS/Ag composite microspheres were characterized by field-emission scanning electron microscopy, ultraviolet-visible absorption, X-ray diffraction and thermogravimetric analysis. The results showed that a dense, stable and uniform silver nanoshell was formed on the surface of PS microspheres in the presence of poly(vinylpyrrolidone) and glucose. The bulk conductivity of the PS/Ag composites increased from 1.16 S/m to 3.57 Multiplication-Sign 10{sup 4} S/m, corresponding to a shell thickness of 35-198 nm. The PS/Ag composite microspheres with diameters of ca. 3 {mu}m might have great potential to be used as fillers in anisotropic conductive films because of the uniform diameter, low density and good conductivity of the microspheres.

  15. Corrosion and wear properties of electroless Ni-P plating layer on AZ91D magnesium alloy

    Institute of Scientific and Technical Information of China (English)

    LI Zhong-hou; CHEN Zhi-yong; LIU Sha-sha; ZHENG Feng; DAI A-gan

    2008-01-01

    A direct electroless Ni-P plating treatment was applied to AZ91D magnesium alloy for improving its corrosion resistance and wear resistance. Corrosion resistance of the Ni-P coatings was evaluated by potentiodynamic polarization and immersing experiments in 3.5% NaCl solution. The wear resistance of the coatings was investigated by the wear track and the mass change after ball-on-disk experiment. The results show that corrosion resistance and wear resistance of the AZ91D alloy are greatly improved after direct electroless Ni-P plating. No discoloration is noticed until 4 d of immersion in 3.5% NaCl solution. Potentiodynamic polarization experiments show that the free corrosion potential of magnesium alloy is shifted from -1 500 mV to -250 mV and passivation occurs at 1 350 mV after direct electroless plating. The friction coefficients and wear rates of Ni-P coating and Ni-P coating after tempering are 0.10-0.351, 9.038×10-3 mm3/m and 0.13-0.177, 3.056×10-4 mm3/m, respectively, at a load of 1.5 N with dry sliding. Although minor hurt on corrosion resistance was caused, significant improvement of wear resistance was obtained after tempering treatment of the coating.

  16. 镁合金化学镀镍层的生长过程%Deposition process of electroless nickel plating on magnesium alloy

    Institute of Scientific and Technical Information of China (English)

    邵忠财; 李建中; 康凤娣; 田彦文

    2005-01-01

    The initial nickel deposition for the direct electroless nickel plating on non-catalytically active magnesium alloy is critical. The surface morphology and composition of the initial nickel plating coating are obtained by means of the scanning electron microscopy (SEM) and the energy dispersive X-ray (EDS). In addition, the mass gain/loss in the initial nickel deposition process was measured by using the electrobalance. The results showed that the MgO coating was gradually corroded by the plating solution, at the same time, MgF2 produced by F , H+ and MgO was deposited on the substrate during the initial electroless plating process. The nickel of the initial electroless plating was mostly growing on the boundary between the MgF2 coating and the MgO coating of the activation substrate, and then came to two sides. After that, the Ni-P coating growth rate to cover with the MgF2 coating was prior to the MgO coating. The electroless plating was in company with the substrate corrosion, but the electroless plating rate catalyzed by the exchanged nickel was more than the substrate corrosion rate.

  17. CURRENT AND EMERGING TECHNOLOGIES FOR EXTENDING THE LIFETIME OF ELECTROLESS NICKEL PLATING BATHS

    Science.gov (United States)

    The waste treatment and rejuvenation of spent electroless nickel baths has attracted a considerable amount of interest from electroplating shops, electroless nickel suppliers, universities and regulatory agencies due to the finite life of the baths and the associated waste that t...

  18. Copper-Ti3SiC2 composite powder prepared by electroless plating under ultrasonic environment

    Institute of Scientific and Technical Information of China (English)

    ZHANG Zhongbao; XU Shaofan

    2007-01-01

    In this article, a new type of Cu-Ti3SiC2 composite powder prepared using the electroless plating technique was introduced. The initial Ti3SiC2 particles are 11 μm in diameter on an average. The Cu plating was carried out at middle temperature (62-65 ℃) with the application of ultrasonic agitation. The copper deposition rate was determined by measuring the weight gain of the powder after plating. It has been found that the pretreatment of Ti3SiC2 powder is very important to obtain copper nanoparticles on the surface of Ti3SiC2. The optimum procedure before plating aimed to add activated sites and the adjustment of the tradifonal composition of the electroless copper plating bath could decelerate the copper deposition rate to 0.8 μm/h. X-ray diffraction (XRD) indicates that the chemical composition of the plating layer is copper. SEM images show that the surface of the Ti3SiC2 particles is successfully coated with continuous copper layer. The wetting property between the copper matrix and Ti3SiC2 can be improved so as to increase the interfacial strength.

  19. Electroless plating preparation and electromagnetic properties of Co-coated carbonyl iron particles/polyimide composite

    Science.gov (United States)

    Zhou, Yingying; Zhou, Wancheng; Li, Rong; Qing, Yuchang; Luo, Fa; Zhu, Dongmei

    2016-03-01

    To solve the serious electromagnetic interference problems at elevated temperature, one thin microwave-absorbing sheet employing Co-coated carbonyl iron particles and polyimide was prepared. The Co-coated carbonyl iron particles were successfully prepared using an electroless plating method. The microstructure, composition, phase and static magnetic properties of Co-coated carbonyl iron particles were characterized by combination of scanning electron microscope (SEM), energy dispersive spectrometer (EDS), X-ray diffraction (XRD) and vibrating sample magnetometer (VSM). The electromagnetic parameters of Co-coated carbonyl iron particles/polyimide composite were measured in the frequency range of 2-18 GHz, and the electromagnetic loss mechanism of the material-obtained was discussed. The microwave absorption properties of composites before and after heat treatment at 300 °C for 100 h were characterized in 2-18 GHz frequency range. It was established that composites based on Co-coated carbonyl iron demonstrate thermomagnetic stability, indicating that Co coating reduces the oxidation of carbonyl iron. Thus, Co-coated carbonyl iron particles/polyimide composites are useful in the design of microwave absorbers operating at temperatures up to 300 °C.

  20. Removal of nickel from spent electroless nickel-plating bath with nickel foam cathode

    Institute of Scientific and Technical Information of China (English)

    于秀娟; 郑彤; 魏杰; 周定

    2002-01-01

    The electrochemical method was used to remove nickel ion from spent electroless nickel plating bath(pH = 5.3). An electrolytic cell was composed of a porous nickel foam cathode and an inert RuO2/Ti anode.Nickel ions were reduced and deposited on the surface of the nickel foam cathode. The effect of current density(i), linear velocity of wastewater (v), gap between cathode and anode (dc/A) and reaction time (t) on nickelremoval rate and current efficiency were studied. As reaction time prolonged, nickel removal rate increasedwhile current efficiency decreased. And larger v and smaller dc/A can enhance nickel removal rate and increasecurrent efficiency by promoting mass transfer and dropping concentration polarization. The effect of current den-sity on nickel removal by electrochemistry was related to other parameters. After three hours' electrolysis withi = 1.0 A/dm2, v = 18.5 cm/min and dc/A = 0. 5 cm, nickel removal rate and current efficiency reached85.6% and 29. 1%, respectively.

  1. Preparation, characterization and wear behavior of carbon coated magnesium alloy with electroless plating nickel interlayer

    Energy Technology Data Exchange (ETDEWEB)

    Mao, Yan [Shanghai Key Laboratory of Materials Laser Processing and Modification, School of Materials Science and Engineering, Shanghai Jiao Tong University, Shanghai 200240 (China); Li, Zhuguo, E-mail: lizg@sjtu.edu.cn [Shanghai Key Laboratory of Materials Laser Processing and Modification, School of Materials Science and Engineering, Shanghai Jiao Tong University, Shanghai 200240 (China); Academician Expert Office Workstation (Jiansheng Pan), Lin’an, Zhejiang Province (China); Feng, Kai, E-mail: fengkai@sjtu.edu.cn [Shanghai Key Laboratory of Materials Laser Processing and Modification, School of Materials Science and Engineering, Shanghai Jiao Tong University, Shanghai 200240 (China); Academician Expert Office Workstation (Jiansheng Pan), Lin’an, Zhejiang Province (China); Guo, Xingwu [National Engineering Research Center of Light Alloys Net Forming (LAF), School of Materials Science and Engineering, Shanghai Jiao Tong University, Shanghai 200240 (China); Zhou, Zhifeng [Department of Mechanical and Biomedical Engineering, City University of Hong Kong, Kowloon, Hong Kong (China); Dong, Jie [National Engineering Research Center of Light Alloys Net Forming (LAF), School of Materials Science and Engineering, Shanghai Jiao Tong University, Shanghai 200240 (China); Wu, Yixiong [Shanghai Key Laboratory of Materials Laser Processing and Modification, School of Materials Science and Engineering, Shanghai Jiao Tong University, Shanghai 200240 (China); State Key Laboratory of Metal Matrix Composites, Shanghai Jiao Tong University, Shanghai 200240 (China); Academician Expert Office Workstation (Jiansheng Pan), Lin’an, Zhejiang Province (China)

    2015-02-01

    Highlights: • The carbon film with nickel interlayer (Ni + C coating) is deposited on GW83. • In Ni + C composite coating the carbon coating has good adhesion with the nickel interlayer. • The wear track of Ni + C coating is narrower compared to the bare one. • The wear resistance of GW83 is greatly improved by the Ni + C coating. - Abstract: Poor wear resistance of rare earth magnesium alloys has prevented them from wider application. In this study, composite coating (PVD carbon coating deposited on electroless plating nickel interlayer) is prepared to protect GW83 magnesium alloys against wear. The Ni + C composite coating has a dense microstructure, improved adhesion strength and hardness due to the effective support of Ni interlayer. The wear test result shows that the Ni + C composite coating can greatly prolong the wear life of the magnesium alloy. The wear track of the Ni + C coated magnesium alloy is obviously narrower and shows less abrasive particles as compared with the bare one. Abrasive wear is the wear mechanism of the coatings at the room temperature. In conclusion, the wear resistance of the GW83 magnesium alloy can be greatly improved by the Ni + C composite coating.

  2. Fabrication and microwave properties of hollow nickel spheres prepared by electroless plating and template corrosion method

    Energy Technology Data Exchange (ETDEWEB)

    Wang, Guiqin, E-mail: wanggq@dlut.edu.cn; Wang, Lifang; Gan, Yulin; Lu, Wei

    2013-07-01

    Using carbonyl iron as template, hollow nickel spheres were prepared by electroless plating on carbonyl iron and template corrosion method. The samples were characterized by X-ray diffraction (XRD), X-ray fluorescence spectrometer (XRF), transmission electron microscope (TEM), scanning electron microscope (SEM), vibrating sample magnetometer (VSM) and vector network analyzer. Results showed that the shell thickness can be controlled by adjusting the loadage of carbonyl iron templates. The hollow nickel spheres exhibited good magnetic properties with a saturation magnetization of 48.56 emu/g and enhanced coercivity (as high as 260 Oe). The real (ε′) and imaginary (ε″) parts of complex permittivity of hollow nickel spheres first increased and then decreased as the shell thickness increased, and the sample with the thinnest shell showed the lowest complex permittivity. For the complex permeability, the resonance peak shifted to the lower frequency and then moved to higher frequency, as the shell thickness increased. The microwave absorption performances could be tuned by changing the shell thickness. In this study, the minimum reflection loss (RL) value of −27.2 dB was obtained at 13.4 GHz with a matching thickness of 1.4 mm and the effective absorption band (RL <−5 dB) from 11.8 to 18 GHz, covering the whole Ku-band (12.4−18 GHz).

  3. Reclaim nickel and remove organics from the spent electroless nickel-plating bath by electrolysis

    Institute of Scientific and Technical Information of China (English)

    YU Xiu-juan; SHEN Jin; MENG Xian-lin; LI Shu-qin; YAN Lei; ZHOU Ding

    2006-01-01

    Typical wastes from nickel plating operations include excess drag-out solution. An electrochemical approach was made to recover the nickel and remove the organic pollutants from the spent electroless nickelplating bath. An electrolyte cell which was constructed by the cathode of porous nickel foam and the anode of Ti/RuO2 was used. During electrolysis, the nickel ion was electrodeposited at the cathode and the oxidation of the organics in the bath was conducted at the anode. The current ( i), time ( t), temperature (T) and pH of the solution affected the recovery efficiency of nickel with constant potential electrolysis. With the optimum experimental conditions of pH = 7. 6, i = 0.45 A, T = 65℃ and t = 2 h, the concentration of nickel ion was reduced from 2. 09 g/L to 0. 053 g/L and the recovery rate of nickel, the current efficiency and the consumed energy were 97.5%, 17.1%, 12.2 kWh/kg Ni, respectively. Meanwhile, total organic carbon (TOC) of the bath was reduced from 5 800 mg/L to 152. 5 mg/L and the removal efficiency of TOC was 97.3%. The recovery rate of nickel could keep to about 97% when electrodeposit was used to recover nickel for 40 hours in a laboratory batch reactor containing the spent bath. Dull nickel containing phosphorus was obtained on the cathode.

  4. A polydopamine-modified optical fiber SPR biosensor using electroless-plated gold films for immunoassays.

    Science.gov (United States)

    Shi, Se; Wang, Libing; Su, Rongxin; Liu, Boshi; Huang, Renliang; Qi, Wei; He, Zhimin

    2015-12-15

    A sensitive and stable electroless-plated gold film for the preparation of an optical fiber surface plasmon resonance (SPR) sensor is presented in this work, together with a facile antibody immobilization method. Gold nanoparticles were uniformly adsorbed onto the surface of an optical fiber forming a film with a thickness of approximately 56.3 nm. The sensor had a high sensitivity with 2054 nm/RIU and 3980 nm/RIU in the refractive index ranges of 1.333-1.359 and 1.359-1.386, respectively. An SPR biosensor was developed based on polydopamine-modified gold film (PDA-Au), which was fabricated by a simple and quick spontaneous polymerization of dopamine (DA) on the gold film. When goat anti-human IgG antibodies were immobilized, the PDA-Au surface had a larger resonant wavelength shift of 66.21 nm compared with the traditional 11-mercaptoundecanoic acid-modified gold film (MUA-Au) surface. In addition, the PDA-Au surface enabled the sensitive and selective determination of human IgG down to a concentration of 2 μg mL(-1) with a high sensitivity of 0.41 nm per μg mL(-1). The PDA-Au surface exhibited an approximately four fold higher sensitivity and an about seven fold lower LOD than the MUA-Au surface to human IgG.

  5. Electroless plating of ultrathin palladium films: self-initiated deposition and application in microreactor fabrication

    Science.gov (United States)

    Muench, Falk; Oezaslan, Mehtap; Svoboda, Ingrid; Ensinger, Wolfgang

    2015-10-01

    We present new electroless palladium plating reactions, which can be applied to complex-shaped substrates and lead to homogeneous, dense and conformal palladium films consisting of small nanoparticles. Notably, autocatalytic and surface-selective metal deposition could be achieved on a wide range of materials without sensitization and activation pretreatments. This provides a facile and competitive route to directly deposit well-defined palladium nanofilms on e.g. carbon, paper, polymers or glass substrates. The reactions proceed at mild conditions and are based on easily accessible chemicals (reducing agent: hydrazine; metal source: PdCl2; ligands: ethylenediaminetetraacetic acid (EDTA), acetylacetone). Additionally, the water-soluble capping agent 4-dimethylaminopyridine (DMAP) is employed to increase the bath stability, to ensure the formation of small particles and to improve the film conformity. The great potential of the outlined reactions for micro- and nanofabrication is demonstrated by coating an ion-track etched polycarbonate membrane with a uniform Pd film of approximately 20 nm thickness. The as-prepared membrane is then employed as a highly miniaturized flow reactor, using the reduction of 4-nitrophenol with NaBH4 as a model reaction.

  6. Selective electroless nickel plating on oxygen-plasma-activated gold seed-layers for the fabrication of low contact resistance vias and microstructures

    OpenAIRE

    Fischer A.C.; Lapisa M.; Roxhed N.; Stemme G; Niklaus F.

    2010-01-01

    This paper presents a novel technique to selectively deposit nickel by electroless plating on gold seed layers using an oxygen-plasma-activation step. No prior wet surface pre- treatments or metal oxide etches are required. This enables the manufacturing of low-resistance vias for heterogeneous three-dimensional (3D) integration of MEMS but it is also a suitable technique for the fabrication of arbitrary shaped nickel-microstructures using chemically stable and cost-effective electroless nick...

  7. Structural Characterization and Mechanical Properties of As-plated and Heat Treated Electroless Ni-B-P Alloy Coatings

    Directory of Open Access Journals (Sweden)

    P. G. Venkatakrishnan

    2014-05-01

    Full Text Available The Ni-B-P alloy coatings were made autocatalytically (electroless using an alkaline plating bath with nickel chloride hexahydrate (NiCl2.6H2O as the source of nickel ions, sodium borohydride (NaBH4 and sodium hypophosphite (NaH2PO2 as reducing agents and source of boron and phosphorous ions, respectively. The effects of bath concentrations on the plating rate, composition of coating, surface morphology, structural features and microhardness have been studied by varying NaBH4 concentration in the plating bath from 0.2 to 0.8 g/l while keeping NaH2PO2 concentration constant (12 g/l. The plating rate and boron content of the electroless Ni-B-P ternary alloy coatings increased with increasing NaBH4 concentration in the plating bath. The scanning electron microscopic images revealed that the morphology of the coating changed from corn cob structure to coarse cauliflower structure with increasing borohydride concentration in the plating bath. Broadening of X-ray diffraction peak is observed, as the borohydride concentration is increased in the plating bath, which is attributed to the large reduction in the crystallite size of the Ni-B-P alloy coatings. The microhardness values of the coating increased with increasing borohydride concentration in the plating bath. The as-plated Ni-B-P alloy coating containing higher boron content (3.2 wt% shows higher hardness of 700 HV compared to other Ni-B-P alloy coatings. The XRD patterns of heat treated Ni-B-P alloy coatings (500 °C show Ni3B intermetallic peaks along with Ni peaks. The presence of Ni3B intermetallic compound significantly increases the microhardness values of the heat treated Ni-B-P alloy coatings.

  8. Reliability Tests of Aluminium Wedge Wire Bonding on Auto-catalytic Silver Immersion Gold (ASIG) PCB Metallization

    CERN Document Server

    Drozd, A; Kaufmann, S; Manolescu, F; McGill, I

    2011-01-01

    The Auto-catalytic Silver Immersion Gold (ASIG) PCB metallization is a new process that has clear advantages for PCB assembly especially with regard to lead-free soldering. As it may become a popular process in the future for electronics used in physics experiments, the quality of this metallization for aluminium wire bonding has been studied. Aluminium wedge wire bonding continues to be the interconnection method of choice for many physics detector sensors, for high density signal routing and for unpackaged die. Although advertised as having good quality for aluminium wire bonding, this study was performed to verify this claim as well as to test the longer term reliability of the wire bonds taking into consideration the environmental conditions and life-expectancy of devices, in particular for high energy physics detector applications. The tests were performed on PCBs made with the ASIG and ENIG (Electro-less Nickel Immersion Gold) processes at the same time in order to make a comparison with the current ind...

  9. Study of Nd:YAG laser annealing of electroless Ni-P film on spiegel-iron plate by Taguchi method and grey system theory

    Energy Technology Data Exchange (ETDEWEB)

    Liu, W.L. [Department of Materials Science and Engineering, National Formosa University, 64, Wunhua Road, Huwei, Yunlin 632, Taiwan (China); Chien, W.T.; Jiang, M.H. [Department of Mechanical Engineering, National Pingtung University of Science and Technology, 1, Shuehfu Road, Neipu, Pingtung 912, Taiwan (China); Chen, W.J., E-mail: chenwjau@yuntech.edu.t [Graduate School of Materials Science, National Yunlin University of Science and Technology, 123 University Road, Section 3, Douliou, Yunlin 64002, Taiwan (China)

    2010-04-09

    An electroless Ni-P film was first deposited on a spiegel-iron plate and then annealed by an Nd:YAG pulsed wave laser. In order to obtain the optimal laser annealing parameters for maximizing the hardness and minimizing the surface roughness of electroless Ni-P films, the Taguchi method and grey system theory were used to analyze the experimental data. The electroless Ni-P film was also characterized by scanning electron microscopy for the morphology, and transmission electron microscopy for the microstructure and crystal structure. The results showed that the hardness and the surface roughness of electroless Ni-P films can be, at the same time, improved to 50.8% and 68%, respectively, by the laser annealing with the optimal parameters.

  10. Development of micromachined preconcentrators and gas chromatographic separation columns by an electroless gold plating technology

    Science.gov (United States)

    Kuo, C.-Y.; Chen, P.-S.; Chen, H.-T.; Lu, C.-J.; Tian, W.-C.

    2017-03-01

    In this study, a simple process for fabricating a novel micromachined preconcentrator (μPCT) and a gas chromatographic separation column (μSC) for use in a micro gas chromatograph (μGC) using one photomask is described. By electroless gold plating, a high-surface-area gold layer was deposited on the surface of channels inside the μPCT and μSC. For this process, (3-aminopropyl) trimethoxysilane (APTMS) was used as a promoter for attaching gold nanoparticles on a silicon substrate to create a seed layer. For this purpose, a gold sodium sulfite solution was used as reagent for depositing gold to form heating structures. The microchannels of the μPCT and μSC were coated with the adsorbent and stationary phase, Tenax-TA and polydimethylsiloxane (DB-1), respectively. μPCTs were heated at temperatures greater than 280 °C under an applied electrical power of 24 W and a heating rate of 75 °C s‑1. Repeatable thermal heating responses for μPCTs were achieved; good linearity (R 2  >  0.9997) was attained at three heating rates for the temperature programme for the μSC (0.2, 0.5 and 1 °C s‑1). The volatile organic compounds (VOCs) toluene and m-xylene were concentrated over the μPCT by rapid thermal desorption (peak width of half height (PWHH)  7900. The VOCs acetone, benzene, toluene, m-xylene and 1,3,5-trimethylbenzene were also separated on the μSC as evidenced by their different retention times (47–184 s).

  11. Electrical resistivity and dielectric properties of helical microorganism cells coated with silver by electroless plating

    Energy Technology Data Exchange (ETDEWEB)

    Cai, Jun, E-mail: jun_cai@buaa.edu.cn [Bionic and Micro/Nano/Bio Manufacturing Technology Research Center, School of Mechanical Engineering and Automation, Beihang University, Beijing 100191 (China); Lan, Mingming; Zhang, Deyuan; Zhang, Wenqiang [Bionic and Micro/Nano/Bio Manufacturing Technology Research Center, School of Mechanical Engineering and Automation, Beihang University, Beijing 100191 (China)

    2012-09-01

    Highlights: Black-Right-Pointing-Pointer We use the microorganism cells as forming templates to fabricate the bio-based conductive particles. Black-Right-Pointing-Pointer The microorganism cells selected as forming templates are Spirulina platens, which are of natural helical shape and high aspect ratio. Black-Right-Pointing-Pointer The sliver-coated Spirulina cells are a kind of lightweight conductive particles. Black-Right-Pointing-Pointer The composites containing sliver-coated Spirulina cells exhibit a lower percolation value. - Abstract: In this paper, microorganism cells (Spirulina platens) were used as forming templates for the fabrication of the helical functional particles by electroless silver plating process. The morphologies and ingredients of the coated Spirulina cells were analyzed with scanning electron microscopy and energy dispersive spectrometer. The crystal structures were characterized by employing the X-ray diffraction. The electrical resistivity and dielectric properties of samples containing different volume faction of sliver-coated Spirulina cells were measured and investigated by four-probe meter and vector network analyzer. The results showed that the Spirulina cells were successfully coated with a uniform silver coating and their initial helical shapes were perfectly kept. The electrical resistivity and dielectric properties of the samples had a strong dependence on the volume content of sliver-coated Spirulina cells and the samples could achieve a low percolation value owing to high aspect ratio and preferable helical shape of Spirulina cells. Furthermore, the conductive mechanism was analyzed with the classic percolation theory, and the values of {phi}{sub c} and t were obtained.

  12. Development of Microelectrode Arrays Using Electroless Plating for CMOS-Based Direct Counting of Bacterial and HeLa Cells.

    Science.gov (United States)

    Niitsu, Kiichi; Ota, Shoko; Gamo, Kohei; Kondo, Hiroki; Hori, Masaru; Nakazato, Kazuo

    2015-10-01

    The development of two new types of high-density, electroless plated microelectrode arrays for CMOS-based high-sensitivity direct bacteria and HeLa cell counting are presented. For emerging high-sensitivity direct pathogen counting, two technical challenges must be addressed. One is the formation of a bacteria-sized microelectrode, and the other is the development of a high-sensitivity and high-speed amperometry circuit. The requirement for microelectrode formation is that the gold microelectrodes are required to be as small as the target cell. By improving a self-aligned electroless plating technique, the dimensions of the microelectrodes on a CMOS sensor chip in this work were successfully reduced to 1.2 μm × 2.05 μm. This is 1/20th of the smallest size reported in the literature. Since a bacteria-sized microelectrode has a severe limitation on the current flow, the amperometry circuit has to have a high sensitivity and high speed with low noise. In this work, a current buffer was inserted to mitigate the potential fluctuation. Three test chips were fabricated using a 0.6- μm CMOS process: two with 1.2 μm × 2.05 μm (1024 × 1024 and 4 × 4) sensor arrays and one with 6- μm square (16 × 16) sensor arrays; and the microelectrodes were formed on them using electroless plating. The uniformity among the 1024 × 1024 electrodes arranged with a pitch of 3.6 μm × 4.45 μm was optically verified. For improving sensitivity, the trenches on each microelectrode were developed and verified optically and electrochemically for the first time. Higher sensitivity can be achieved by introducing a trench structure than by using a conventional microelectrode formed by contact photolithography. Cyclic voltammetry (CV) measurements obtained using the 1.2 μm × 2.05 μm 4 × 4 and 6- μm square 16 × 16 sensor array with electroless-plated microelectrodes successfully demonstrated direct counting of the bacteria-sized microbeads and HeLa cells.

  13. 聚氨酯泡沫化学镀镍工艺%Technology of Electroless Nickel Plating on Polyurethane Foam

    Institute of Scientific and Technical Information of China (English)

    龚凡; 马玲俊; 李占双

    2001-01-01

    Technical conditions of electroless nickel plating on polyurethane foam were given in detail in this paper. Solution components and o perating conditions in the process of the removal of oil stain ,the activation and the electroless nickel plating were discussed.%介绍了聚氨酯泡沫化学镀镍的工艺条件,其中包括除油、活化和 化学镀镍溶液的配方及操作条件

  14. Efficacy of reducing agent and surfactant contacting pattern on the performance characteristics of nickel electroless plating baths coupled with and without ultrasound.

    Science.gov (United States)

    Agarwal, Amrita; Pujari, Murali; Uppaluri, Ramgopal; Verma, Anil

    2014-07-01

    This article addresses furthering the role of sonication for the optimal fabrication of nickel ceramic composite membranes using electroless plating. Deliberating upon process modifications for surfactant induced electroless plating (SIEP) and combined surfactant and sonication induced electroless plating (SSOEP), this article highlights a novel method of contacting of the reducing agent and surfactant to the conventional electroless nickel plating baths. Rigorous experimental investigations indicated that the combination of ultrasound (in degas mode), surfactant and reducing agent pattern had a profound influence in altering the combinatorial plating characteristics. For comparison purpose, purely surfactant induced nickel ELP baths have also been investigated. These novel insights consolidate newer research horizons for the role of ultrasound to achieve dense metal ceramic composite membranes in a shorter span of total plating time. Surface and physical characterizations were carried out using BET, FTIR, XRD, FESEM and nitrogen permeation experiments. It has been analyzed that the SSOEP baths provided maximum ratio of percent pore densification per unit metal film thickness (PPDδ) and hold the key for further fine tuning of the associated degrees of freedom. On the other hand SIEP baths provided lower (PPDδ) ratio but higher PPD. For SSOEP baths with dropwise reducing agent and bulk surfactant, the PPD and metal film thickness values were 73.4% and 8.4 μm which varied to 66.9% and 13.3 μm for dropwise reducing agent and drop surfactant case.

  15. Enhanced antioxidation and electromagnetic properties of Co-coated flaky carbonyl iron particles prepared by electroless plating

    Energy Technology Data Exchange (ETDEWEB)

    Zhou, Yingying, E-mail: zyzlchappy1989@163.com [State Key Laboratory of Solidification Processing, Northwestern Polytechnical University, Xi’an, Shaanxi 710072 (China); Zhou, Wancheng [State Key Laboratory of Solidification Processing, Northwestern Polytechnical University, Xi’an, Shaanxi 710072 (China); Li, Rong [State Key Laboratory of Solidification Processing, Northwestern Polytechnical University, Xi’an, Shaanxi 710072 (China); No. 603 Faculty, Xi’an Institute of High Technology, Xi’an 710025 (China); Mu, Yang; Qing, Yuchang [State Key Laboratory of Solidification Processing, Northwestern Polytechnical University, Xi’an, Shaanxi 710072 (China)

    2015-07-15

    Highlights: • Co-coated carbonyl iron particles were prepared by electroless plating method. • The obvious weight gain of carbonyl iron was deferred to 400 °C after Co-coated. • The permeability of the Co-coated particle composite kept almost invariable. • Co-coated carbonyl iron composite reserves a better absorption after heat treatment. - Abstract: Co was successfully coated on the surface of flaky carbonyl iron particles using an electroless plating method. The morphologies, composition, as well as magnetic, antioxidation and electromagnetic properties of the samples were characterized by scanning electron microscope (SEM), energy dispersive spectrometer (EDS), vibrating sample magnetometer (VSM), thermogravimetric (TG) and microwave network analyzer. TG curve shows that the obvious weight gain of carbonyl iron was deferred from 300 to 400 °C after Co-coated. In contrast to raw carbonyl iron, the Co-coated carbonyl iron shows better stability on electromagnetic properties after 300 °C heat treatment for 10 h, demonstrating that the Co coating can act as the protection of carbonyl iron.

  16. Development and Characterization of an Electroless Plated Silver/Cysteine Sensor Platform for the Electrochemical Determination of Aflatoxin B1

    Directory of Open Access Journals (Sweden)

    Alex Paul Wacoo

    2016-01-01

    Full Text Available An electroless plated silver/cysteine sensor platform [Glass|silver|cysteine|aflatoxin B1|horseradish peroxidase] for the Electrochemical detection of aflatoxin B1 was developed and characterized. This involved four major steps: (1 an electroless deposition of silver (plating onto a glass slide, (2 immobilization of cysteine; (3 conjugation of aflatoxin B1 to cysteine groups; and (4 blocking of free cysteine groups with horseradish peroxidase (HRP. The binding of cysteine to the silver was demonstrated by the disappearance of thiol (S-H groups at 2500 cm−1 using Fourier transmittance infrared spectra (FT-IR, while the subsequent steps in the assembly of sensor platform were monitored using both FT-IR and cyclic voltammetry, respectively. The sensor platform exhibited a broadened nonsymmetrical redox couple as indicated by cyclic voltammetry. The platform was further characterized for sensitivity and limit of detection. The indirect competitive immunoassay format, whereby free and immobilized aflatoxin B1 on the sensor competed for the binding site of free anti-aflatoxin B1 antibody, was used at various concentrations of aflatoxin B1. The sensor generated differential staircase voltammogram that was inversely proportional to the concentration of aflatoxin B1 and aflatoxin B1 in the range of 0.06–1.1 ng/mL with a detection limit of 0.08 ng/mL could be detected.

  17. Optimization and kinetics of electroless Ni-P-B plating of quartz optical fiber

    Science.gov (United States)

    Jiang, Boquan; Xiao, Lin; Hu, Shufen; Peng, Jian; Zhang, Hua; Wang, Minwei

    2009-08-01

    The preparation of Ni-P-B coatings on surface of quartz optical fibers was carried out using electroless plating method. The effects of the concentrations of nickel chloride, sodium hypophosphite, potassium borohydride, ethylenediamine, cadmium sulfate and temperature on the quality of Ni-P-B coatings were investigated by orthogonal experiment and their optimal values were determined to be: 0.1 mol L -1, 0.094 mol L -1, 0.185 mol L -1, 0.36 mol L -1, 5.68 × 10 -4 mol L -1 and 90 °C, respectively. The effect of coarsening time of the naked fiber on the quality of Ni-P-B coatings was also researched and the optimal coarsening time was determined to be 15 min. Stereomicroscope, Scanning Electron Microscope and X-ray diffractometer were used to characterize the apparentness, morphology and structure of the prepared Ni-P-B coatings. Inductively Coupled Plasma-Atomic Emission Spectroscopy, Thermal Shock Method and Gravimetric Analysis Method were employed to analyze the composition, force of adhesion and solderability of the coatings, respectively. The results showed that a Ni-P-B coating with low surface roughness, good strength of adhesion, low resistivity and good solderability was successfully prepared. The kinetic models (Ni-P-B deposition rate equations) of the process were established as v=7.95×10-6cA0.830cB0.428cC-0.288cD-0.645cE0..02exp{26788(T-298)298RT; v=1.03×10-7c}/{A0.830cB0.428cC-0.288cD-0.645cE-0.614exp 26788(T-298)298RT. The theoretical values calculated by the models were proved to be basically consistent with the practical measurements through experimental verification.

  18. A New Approach on the Active Treatment for Electroless Copper Plating on Glass

    Institute of Scientific and Technical Information of China (English)

    LIU,Zheng-Chun; HE,Quan-Guo; TANG,Jian-Xin; XIAO,Peng-Feng; HE,Nong-Yue; LU,Zu-Hong

    2003-01-01

    A new method is described for the electroless deposition of copper onto glass. Commercially available glass slide was modified with γ-aminopropyltrimethoxysilane to form self-assembled monolayer (SAM) on it. Then it was dipped directly into PdCl2 solutlon instead of the conventional SnCl2 sensitization followed by PdCl2 activation. Experimental results showed that the Pd2+ ions from PdCl2solution were coordinated to the amino groups on the glass surfaceresulting in the formation of N-Pd complex. In an electroless copper bath containing a formaldehyde reducing agent, the N-Pd complexes were reduced to Pd0 atoms, which then acted as catalysts and initiated the deposition of copper metal. Although the copper deposition rate on SAM-modified glass was slow at the beginning, it reached to that of conventional method in about 5 min.

  19. Fabrication of Pd/Pd-Alloy Films by Surfactant Induced Electroless Plating for Hydrogen Separation from Advanced Coal Gasification Processes

    Energy Technology Data Exchange (ETDEWEB)

    Ilias, Shamsuddin; Kumar, Dhananjay

    2012-07-31

    Dense Pd, Pd-Cu and Pd-Ag composite membranes on microporous stainless steel substrate (MPSS) were fabricated by a novel electroless plating (EP) process. In the conventional Pd-EP process, the oxidation-reduction reactions between Pd-complex and hydrazine result in an evolution of NH{sub 3} and N{sub 2} gas bubbles. When adhered to the substrate surface and in the pores, these gas bubbles hinder uniform Pd-film deposition which results in dendrite growth leading to poor film formation. This problem was addressed by introducing cationic surfactant in the electroless plating process known as surfactant induced electroless plating (SIEP). The unique features of this innovation provide control of Pd-deposition rate, and Pd-grain size distribution. The surfactant molecules play an important role in the EP process by tailoring grain size and the process of agglomeration by removing tiny gas bubbles through adsorption at the gas-liquid interface. As a result surfactant can tailor a nanocrystalline Pd, Cu and Ag deposition in the film resulting in reduced membrane film thickness. Also, it produces a uniform, agglomerated film structure. The Pd-Cu and Pd-Ag membranes on MPSS support were fabricated by sequential deposition using SIEP method. The pre- and post-annealing characterizations of these membranes (Pd, Pd-Cu and Pd-Ag on MPSS substrate) were carried out by SEM, EDX, XRD, and AFM studies. The SEM images show significant improvement of the membrane surface morphology, in terms of metal grain structures and grain agglomeration compared to the membranes fabricated by conventional EP process. The SEM images and helium gas-tightness studies indicate that dense and thinner films of Pd, Pd-Cu and Pd-Ag membranes can be produced with shorter deposition time using surfactant. H{sub 2} Flux through the membranes fabricated by SIEP shows large improvement compared to those by CEP with comparable permselectivity. Pd-MPSS composite membrane was subjected to test for long term

  20. 电路板化学镀金液IG-600的研制%Development of Electroless Gold Plating Bath IG-600 for PCBs

    Institute of Scientific and Technical Information of China (English)

    高敏; 陆云

    2009-01-01

    The paper introduced a displacement electroless gold plating solution IG-600 for electroless nickel/immersion gold(ENIG) process in printed circuit boards. This solution contains tow special inhibitors which can effectively eliminate nickel corrosion by electroless gold solution. IG-600 can deposit excellent gold on nickel layer without black pad problem and improve ENIG process yields.%文章介绍一种用于电路板化学镀镍/沉金工艺的置换型化学镀金液IG-600.这种处理液通过加入特殊的复合缓蚀剂,减轻镀液对镍层的过度腐蚀,有效防止"黑色镍垫"的发生,提高化学镀镍/沉金处理的良品率.

  1. Study of electroless copper plating on ABS plastic%ABS塑料化学镀铜的研究

    Institute of Scientific and Technical Information of China (English)

    秦建芳; 姚陈忠; 曹新录

    2012-01-01

    The basic process of electroless copper plating was discussed using ABS plastic as a matrix,formaldehyde as a reducing agent and EDTA as a complexing agent It was sudied for the bath pH, plating temperature and plating time. The optimum process parameters were identified that they were temperature being 50℃, the optimum pH value being 12. S and plating time being 40 min. the composition and morphology of the copper layer under optimal conditions were analyzed by X-ray diffraction and SEM. The results showed that:the copper coating was hongliang appearance,surface roughness,and few impurities.%以ABS塑料为基体,甲醛为还原剂,EDTA为络合剂,研究了化学镀铜的基本工艺.考察镀液的pH值、温度、时间对镀铜的影响,确定最佳工艺参数为pH=12.5、T=50℃、t=40min.通过扫描电镜和X射线衍射分析了最佳条件下镀铜层的形貌和成分,结果表明:该镀层外观红亮,表面平整,杂质含量很少.

  2. Interlaminar and ductile characteristics of carbon fibers-reinforced plastics produced by nanoscaled electroless nickel plating on carbon fiber surfaces.

    Science.gov (United States)

    Park, Soo-Jin; Jang, Yu-Sin; Rhee, Kyong-Yop

    2002-01-15

    In this work, a new method based on nanoscaled Ni-P alloy coating on carbon fiber surfaces is proposed for the improvement of interfacial properties between fibers and epoxy matrix in a composite system. Fiber surfaces and the mechanical interfacial properties of composites were characterized by atomic absorption spectrophotometer (AAS), scanning electron microscopy (SEM), X-ray photoelectron spectrometry (XPS), interlaminar shear strength (ILSS), and impact strength. Experimental results showed that the O(1s)/C(1s) ratio or Ni and P amounts had been increased as the electroless nickel plating proceeded; the ILSS had also been slightly improved. The impact properties were significantly improved in the presence of Ni-P alloy on carbon fiber surfaces, increasing the ductility of the composites. This was probably due to the effect of substituted Ni-P alloy, leading to an increase of the resistance to the deformation and the crack initiation of the epoxy system.

  3. Effect Of Low-Temperature Annealing On The Properties Of Ni-P Amorphous Alloys Deposited Via Electroless Plating

    Directory of Open Access Journals (Sweden)

    Zhao Guanlin

    2015-06-01

    Full Text Available Amorphous Ni-P alloys were prepared via electroless plating and annealing at 200°C at different times to obtain different microstructures. The effects of low-temperature annealing on the properties of amorphous Ni-P alloys were studied. The local atomic structure of the annealed amorphous Ni-P alloys was analyzed by calculating the atomic pair distribution function from their X-ray diffraction patterns. The results indicate that the properties of the annealed amorphous Ni-P alloys are closely related to the order atomic cluster size. However, these annealed Ni-P alloys maintained their amorphous structure at different annealing times. The variation in microhardness is in agreement with the change in cluster size. By contrast, the corrosion resistance of the annealed alloys in 3.5 wt% NaCl solution increases with the decrease in order cluster size.

  4. State of the art on hydrogen passive auto-catalytic recombiner (european union Parsoar project)

    Energy Technology Data Exchange (ETDEWEB)

    Arnould, F.; Bachellerie, E. [Technicatome, 13 - Aix en Provence (France); Auglaire, M. [Tractebel Energy Engineering, Brussels (Belgium); Boeck, B. de [Association Vincotte Nuclear, Brussels (Belgium); Braillard, O. [CEA Cadarache, 13 - Saint Paul lez Durance (France); Eckardt, B. [Siemens AG, Offenbach am Main (Germany); Ferroni, F. [Electrowatt Engineering Limited, Zurich (Switzerland); Moffett, R. [Atomic Energy Canada Limited, Pinawa (Canada); Van Goethem, G. [European Commission, Brussels (Belgium)

    2001-07-01

    This paper presents an overview of the European Union PARSOAR project, which consists in carrying out a state of the art on hydrogen passive auto-catalytic recombiner (PAR) and a handbook guide for implementing these devices in nuclear power plants. This work is performed in the area ''Operational Safety of Existing Installations'' of the key action ''Nuclear Fission'' of the fifth Euratom Framework Programme (1998-2002). (author)

  5. The influence of platinum washing-out time on its recovery from used auto catalytic converters

    Directory of Open Access Journals (Sweden)

    A. Fornalczyk

    2014-07-01

    Full Text Available The used catalytic converters contain small amounts of precious metals. Recovery of these metals is essential for environmental and economic reasons. This work presents a method of Platinum Group Metals (PGM recovery from auto catalytic converters in which they are washed out by a liquid metal. The magneto-hydro-dynamic pump was used to force circulation of liquid metal under the influence of electromagnetic fields The influence of process time on platinum recovery was also carried out.

  6. Estimation of fatigue evolution of aluminum alloy plated with electroless NI–CO–P by using electromagnetic impedance method

    Energy Technology Data Exchange (ETDEWEB)

    Kinoshita, Katsuyuki

    2015-02-01

    We have developed a method for detecting fatigue in aluminum alloys that is based on a applying a ferromagnetic electroless Ni–Co–P plating and then using an electromagnetic impedance (EMI) method to determine its permeability properties by measuring the high-frequency AC impedance of a coil sensor in the presence of a static magnetic field. The results obtained confirmed that this method can estimate the fatigue evolution of a specimen until the point at which the cumulative strain becomes saturated by using measurements obtained by the EMI method under tensile deformation and FEM analysis results. - Highlights: • Plating aluminum alloy with Ni–Co–P film increases its fatigue strength by 13−16%. • The tensile direction is the stress induced “hard axis” of the Ni–Co–P plating. • In-plane permeability determines the coil impedance for out-of-plane excitation. • This method can measure fatigue up to saturation of the substrate's residual strain.

  7. Effects of Hard Surface Grinding and Activation on Electroless-Nickel Plating on Cast Aluminium Alloy Substrates

    Directory of Open Access Journals (Sweden)

    Olawale Olarewaju Ajibola

    2014-01-01

    Full Text Available This work examined effects of hard surface polishing grits and activation on electroless-nickel (EN plating on cast aluminium alloy substrates in sodium hypophosphite baths. As-received aluminium alloy sample sourced from automobile hydraulic brake master cylinder piston was melted in electric furnace and sand cast into rod. The cast samples were polished using different grits (60 μm–1200 μm before plating. The effects on adhesion, appearance, and quantity of EN deposits on substrates were studied. Observation shows that the quantity of EN deposit is partly dependent on the alloy type and roughness of the surface of the substrates, whereas the adhesion and brightness are not solely controlled by the degree of surface polishing. The best yield in terms of adhesion and appearance was obtained from the activation in zincate and palladium chloride solutions. Higher plating rates (g/mm2/min of 3.01E-05, 2.41E-05, and 2.90E-05 were obtained from chromate, zincate, and chloride than 8.49E-06, 8.86E-06, and 1.69E-05 as obtained from HCl etched, NaOH, and H2O activated surfaces, respectively.

  8. Influence of electroless Ni-P plating condition on wire bondability(1)%化学镀Ni-P镀层状态对引线键合的影响(1)

    Institute of Scientific and Technical Information of China (English)

    蔡积庆(译)

    2012-01-01

    观测了化学镀Ni/Au工艺中化学镀Ni-P镀层的状态,评估了基底化学镀Ni-P镀层的P含量和Ni析出状态对引线键合性的影响。%In this paper,electroless Ni-P plating condition in electroless Au/Ni process was observed,and influence of P content and Ni deposits condition of electroless Ni-P plating sued as under layer on wire bondability was evaluated.

  9. Effects of Sodium Dodecyl Sulfate on Electroless Nickel Plating%十二烷基硫酸钠对化学镀镍的影响

    Institute of Scientific and Technical Information of China (English)

    线东升; 李喜太; 李艳玲

    2012-01-01

    Sodium dodecyl sulfate is an indispensable pinhole preventive in the electroless nickel plating. During the electroless nickel plating process, white attachments can be easily produced on the surface of larger solid steel parts, which affects the quality of electroless nickel plating. But no white attachments were found on the surface of test pieces in the same plating bath. The producing reasons and solving methods of the produced white attachments have been found after years of exploration and analysis.%十二烷基硫酸钠是化学镀镍不可缺少的防针孔剂,较大实心钢铁零件化学镀镍过程中,很容易在零件表面产生白色附着物,影响化学镀镍的质量,而在同一镀槽的化学镀镍试片表面不产生白色附着物;经过多年的探索和分析,找到了白色附着物产生的原因和解决方法.

  10. Magnetically Driven Micromachines Created by Two-Photon Microfabrication and Selective Electroless Magnetite Plating for Lab-on-a-Chip Applications

    Directory of Open Access Journals (Sweden)

    Tommaso Zandrini

    2017-01-01

    Full Text Available We propose a novel method to fabricate three-dimensional magnetic microparts, which can be integrated in functional microfluidic networks and lab-on-a-chip devices, by the combination of two-photon microfabrication and selective electroless plating. In our experiments, magnetic microparts could be successfully fabricated by optimizing various experimental conditions of electroless plating. In addition, energy dispersive X-ray spectrometry (EDS clarified that iron oxide nanoparticles were deposited onto the polymeric microstructure site-selectively. We also fabricated magnetic microrotors which could smoothly rotate using common laboratory equipment. Since such magnetic microparts can be remotely driven with an external magnetic field, our fabrication process can be applied to functional lab-on-a-chip devices for analytical and biological applications.

  11. Preparation of Fabric Sensor for Heart Signal Acquisition Using Printing and Electroless Plating of Copper on Polyester Fabric

    Directory of Open Access Journals (Sweden)

    F. Haghdoost

    2015-07-01

    Full Text Available In the last decade, a significant progress has been made in the wearable medical devices. Scientists are extensively involved in the design of the flexible instruments equipped with garments to fulfill the daily needs and requirements. The fulfillment of this demand particularly needs a conductive fabric substrate with a high level of homogeneity, and the lowest barrier against electrical current. In this study, textile based ECG electrode was prepared by screen printing of activator followed by electroless plating of copper particles. The data acquisition showed the best outcome with pH=8.5 and the plating temperature of 70 ˚C. The electrical resistance showed a range around 0.08 Ω/sq, which sounds quite proper for ECG signal acquisition since the potential difference according to heart activity on skin surface is in milivolt range. We tested the cardiac signal with a reference electrode of Electroshock monitoring system and the results revealed a very high quality receiving signal. Employing of these types of sensors in textile surface due to their flexibility can bring the users more freedom of action.

  12. Collection of Ni-bearing material from electroless plating waste by magnetic separation with HTS bulk magnet

    Energy Technology Data Exchange (ETDEWEB)

    Oka, T., E-mail: okat@eng.niigata-u.ac.jp [Niigata University, 8050 Ikarashi-Ninocho, Nishi-ku, Niigata 950-2181 (Japan); Fukazawa, H.; Fukui, S.; Ogawa, J.; Sato, T.; Ooizumi, M. [Niigata University, 8050 Ikarashi-Ninocho, Nishi-ku, Niigata 950-2181 (Japan); Tsujimura, M. [Aichi Giken Co., 50-1 Takeshita, Hitotugi-cho, Kariya, Aichi 448-0003 (Japan); Yokoyama, K. [Ashikaga Institute of Technology, 268-1 Ohmae-cho, Ashikaga, Tochigi 326-8558 (Japan)

    2014-01-15

    Highlights: ► The magnetic separation for Ni compounds was conducted by HTS bulk magnet. ► The coarse Ni-sulfate crystals were formed from the Ni-phosphite precipitates. ► Ni-sulfate crystals was separated from the mixture of Ni-sulfate and Ni-phosphite compounds. -- Abstract: The magnetic separation experiment to collect the Ni compounds from the waste liquid of electroless plating processes was conducted in the open-gradient magnetic separation process with the high temperature superconducting bulk magnet system. The magnetic pole containing Gd-based bulk superconductors was activated to 3.45 T at 35 K in the static magnetic field of 5 T with use of a superconducting solenoid magnet. The coarse Ni-sulfate crystals were formed by adding the concentrated sulfuric acid to the Ni-phosphite precipitates which yielded from the plating waste liquid by controlling the temperature and the pH value. The open-gradient magnetic separation technique was employed to separate the Ni-sulfate crystals from the mixture of the Ni-sulfate and Ni-phosphite compounds by the difference between their magnetic properties. And we succeeded in collecting Ni-sulfate crystals preferentially to the Ni-phosphite by attracting them to the magnetic pole soon after the Ni-sulfate crystals began to grow.

  13. PREPARATION OF MICROWAVE ABSORBING NICKEL-BASED ACTIVATED CARBON BY ELECTROLESS PLATING WITH PALLADIUM-FREE ACTIVATION

    Directory of Open Access Journals (Sweden)

    Boyang Jia

    2010-08-01

    Full Text Available Nickel-based activated carbon was prepared from coconut shell activated carbon by electroless plating with palladium-free activation. The materials were characterized by scanning electron microscopy (SEM, X-ray energy dispersion spectroscopy (EDS, vibrating sample magnetometry (VSM, and vector network analyzer, respectively. The results show that the surface of the activated carbon was covered by a Ni-P coating, which was uniform, compact, and continuous and had an obvious metallic sheen. The content of P and Ni was 2.73% and 97.27% in the coating. Compared with the untreated activated carbon, the real permeability μ′ and imaginary permeability μ″ of Ni-based activated carbon became greater, whereas the real permittivity ε′ and imaginary permittivity ε″ became smaller. Also, the plated activated carbon was magnetic, making it suitable for some special applications. In general, the method reported here might be a feasible procedure to coat activated carbon with other magnetic metals, which may find application in various areas.

  14. Application of electroless plating in electromagnetic shielding fabrics production%化学镀在电磁屏蔽织物制备中的应用

    Institute of Scientific and Technical Information of China (English)

    颜冬; 齐鲁

    2011-01-01

    The shielding principle of electromagnetic shielding fabrics was introduced, as were the principle and application of electroless plating in electromagnetic shielding fabrics. The shielding fabrics electroplating with silver, copper, nickel, copper/ nickel, nickel/copper/nickel, copper/nickel/silver and their production technologies were described emphatically. It was pointed out that the development trend of electroless plating shielding fabrics should focus on the environmental-friendly electroless plating technique and multilayer and composite electroplating fabrics.%介绍了电磁屏蔽材料的屏蔽原理、化学镀的原理及其在电磁屏蔽织物中的应用;重点慨述了镀银、镀铜、镀镍以及镀铜/镍、镀镍/铜/镍、镀铜/镍/银等主要化学镀电磁屏蔽织物及制备方法;提出开发具有环保的化学镀方法、多层镀及复合镀织物将是化学镀电磁屏蔽织物的发展方向.

  15. 预化学镀镍时间对铝基化学镀镍层性能的影响%Effect of Electroless Nickel Pre-plating Time on Properties of Electroless Nickel on Aluminum

    Institute of Scientific and Technical Information of China (English)

    孙硕; 宋贡生; 马正华

    2016-01-01

    目的 揭示试样的显微形貌随预化学镀镍时间的变化规律,并探讨试样的显微形貌、镀层的结合强度及耐蚀性能的相关性. 方法 以预化学镀镍时间为变量,通过化学沉积方法制得化学镀镍层. 采用扫描电镜观察预镀层及化学镀镍层的表面形貌,采用热震试验、弯曲试验和划格试验测试镀层的结合力,并对化学镀镍层与铝基体之间的结合力进行评价. 采用电化学方法对镀层在模拟燃料电池腐蚀介质中的耐蚀性进行评价. 结果 随着预化学镀镍时间的延长,颗粒尺寸不断增大,预化学镀镍层形貌先逐渐变得均匀、致密,之后又变得粗糙不均匀. 化学镀镍层的耐蚀性以及与基体的结合力呈现出先增加后降低的趋势. 结论 预化学镀镍时间在5 min时,所得化学镀镍层的表面形貌最平整,结合力最好,耐蚀性最佳.%Objective To reveal the variation trend of surface morphology of the sample along with the different pre-plating time and discuss the correlations between surface morphology, adhesion of coatings with aluminum matrix, and corrosion resistance. Methods Electroless nickel coatings were prepared by chemical deposition at different pre-plating time. The surface morphology of coatings was characterized by SEM. The adhesion of coatings with aluminum matrix was determined and evaluated by bending test, thermal shock test and scribe test. And the corrosion resistance of coatings in a simulated fuel cell corrosion medium was also cha-racterized by the electrochemical workstation. Results With the electroless nickel pre-plating time increasing,the surface morphology of pre-plating nickel coating gradually became dense and uniform. And the particle size of pre-plating coating became bigger. Elec-troless nickel coating first became smooth and then rough,and its corrosion resistance and adhesion with matrix also first increased and then decreased with the electroless nickel pre-plating

  16. Fabrication and Characteristics of High Capacitance Al Thin Films Capacitor Using a Polymer Inhibitor Bath in Electroless Plating Process.

    Science.gov (United States)

    Cho, Young-Lae; Lee, Jung-Woo; Lee, Chang-Hyoung; Choi, Hyung-Seon; Kim, Sung-Su; Song, Young Il; Park, Chan; Suh, Su-Jeong

    2015-10-01

    An aluminum (Al) thin film capacitor was fabricated for a high capacitance capacitor using electrochemical etching, barrier-type anodizing, and electroless Ni-P plating. In this study, we focused on the bottom-up filling of Ni-P electrodes on Al2O3/Al with etched tunnels. The Al tunnel pits were irregularly distributed on the Al foil, diameters were in the range of about 0.5~1 μm, the depth of the tunnel pits was approximately 35~40 μm, and the complex structure was made full filled hard metal. To control the plating rate, the experiment was performed by adding polyethyleneimine (PEI, C2H5N), a high molecular substance. PEI forms a cross-link at the etching tunnel inlet, playing the role of delaying the inlet plating. When the PEI solution bath was used after activation, the Ni-P layer was deposited selectively on the bottoms of the tunnels. The characteristics were analyzed by adding the PEI addition quantity rate of 100~600 mg/L into the DI water. The capacitance of the Ni-P/Al2O3 (650~700 nm)/Al film was measured at 1 kHz using an impedance/gain phase analyzer. For the plane film without etch tunnels the capacitance was 12.5 nF/cm2 and for the etch film with Ni-P bottom-up filling the capacitance was 92 nF/cm2. These results illustrate a remarkable maximization of capacitance for thin film metal capacitors.

  17. 陶瓷金属化化学镀镍原理和生产工艺综述%Ceramic metal electroless nickel plating the principles and Production Summary

    Institute of Scientific and Technical Information of China (English)

    卢玉厚; 金德明

    2012-01-01

    化学镀镍适合多品种、少批量产品镀镍,生产非常灵活,中小企业多采用化镀生产工艺,本文介绍了化学镀镍原理、镀液配制和化镀生产工艺,为企业加强工艺控制,提高产品质量提供参考。%Electroless nickel for many varieties, small batch products nickel plating, very flexible production, Production SMEs to use more of electroless nickel plating, electroless nickel plating principle, the preparation of chemical plating nickel plating bath and electroless nickel production process, provide reference for enterprises to enhance process control, improve product quality.

  18. 关于镀镍铜母线温升的分析%Analysis of Temperature Rise of Electroless Nickel Plating Copper Bus

    Institute of Scientific and Technical Information of China (English)

    刘燕

    2012-01-01

    通过对镀镍铜母线产生温升进行分析,通过对镀镍过程以及镀层成分进行分析,提出控制镀镍层中有害元素的含量来解决降低温升的措施.%This article analyzes the temperature rise and process of the electroless nickel plating copper bus, its and the coating composi tion and puts forward the measures that the temperature rise is lowered is used to control the harmful element in nickel plating layer.

  19. Structure and Mechanical Properties of Ni-P-Nano Al2O3 Composite Coatings Synthesized by Electroless Plating

    Institute of Scientific and Technical Information of China (English)

    ZHOU Guang-hong; DING Hong-yan; ZHOU Fei; ZHANG Yue

    2008-01-01

    Ni-P-nano Al2O3 composite coatings were deposited by electroless plating, and their microstructures were observed by SEM (scanning electron microscope). The microhardness and the wear resistance of the Ni-P-nano Al2O3 composite coatings were measured using microhardness tester and block-on-ring tribometer, respectively, and the comparison with those of Ni-P coatings or Ni-P-micro Al2O3 coating was given. The influences of aging temperature on their hardness and wear resistance were analyzed. The results showed that the nano Al2O3 particles were distributed uniformly in the Ni-P-Al2O3 coatings. Among three kinds of Ni-P based coatings, the hardness and wear resistance of Ni-P-nano Al2O3 coatings were largest, and the maximum values could be obtained at 400 ℃. This indicated that the precipitation of nano Al2O3 particles would improve the hardness and wear resistance of the Ni-P coatings.

  20. Preparation and Magnetic Properties of Anisotropic (Sm,PrCo5/Fe Nanocomposites Particles via Electroless Plating

    Directory of Open Access Journals (Sweden)

    Shi Wang

    2014-01-01

    Full Text Available Anisotropic (Sm,PrCo5/Fe nanocomposites particles were prepared by electroless plating iron on the surface of (Sm,PrCo5 nanoflakes after being prepared by ball milling for 4 h. A uniform and continuous coating layer was obtained due to the addition of complexing agent and the particle size of the reduced Fe particles was in the range of 10~20 nm. When the nominal addition of Fe was 15 wt%, the nanocomposites show enhanced remnant and saturation magnetization: Mr=53.35 emu/g, Ms=73.08 emu/g compared to the noncoated nanoflakes with Mr=48.52 emu/g, Ms=60.15 emu/g, while the coercivity drops from 10.33 kOe to 8.89 kOe. The effect of Fe content on the magnetic properties of the magnets is also discussed.

  1. The Microstructure and Thermal Conductivity of Pressureless Infiltrated SiCp/Al Composites Containing Electroless Nickel Platings

    Directory of Open Access Journals (Sweden)

    Aihua Zou

    2015-01-01

    Full Text Available A nickel (Ni coating was deposited on the surface of silicon carbide particles (SiCp through electroless plating and we characterized the morphology and phase structure of the coating and the pressureless infiltrated SiCp/Al composites. The effect of Ni coatings on the thermal conductivity of the composites was examined and analyzed with three-dimensional video microscope, scanning electron microscope (SEM, energy-dispersive X-ray spectroscopy (EDS, X-ray diffraction microscope (XRD, and finite-element. The results show that a continuous and uniform coating with a certain thickness (around 3.5 μm can be formed on the surface of SiCp. With the addition of the Ni layer, there are some intermetallics Ni3Al but no interfacial carbide Al4C3, which improves the wettability and the thermal conductivity of the composites. The experiments and simulations both show that Ni coatings do not substantially decrease the overall thermal conductivity of the composite, although the thermal conductivity of Ni itself is lower than Al and SiC by a factor of 1.

  2. 涤纶纤维表面化学镀镍-磷工艺研究%Study of electroless nickel-phosphorus plating process on polyester fiber surface

    Institute of Scientific and Technical Information of China (English)

    高嵩; 陶睿; 王桂林; 杨帆

    2014-01-01

    以涤纶纤维的增重率和电阻为指标,研究了镀液组成、pH、温度、涤纶装载量和施镀时间等对化学镀镍-磷的影响,得到涤纶化学镀镍-磷的最佳工艺条件为:柠檬酸钠10 g/L,硫酸镍20 g/L,次磷酸钠8 g/L,乙酸钠15 g/L,镀液pH为6.0~6.2,温度80°C,装载量9 g/L,时间10~15 min。采用最佳工艺对涤纶纤维化学镀镍-磷后其增重率约为19%,电阻约为10Ω/cm。%The effects of plating bath composition, pH, loading capacity of polyester, and plating time on electroless nickel–phosphorous plating were studied by evaluating the weight gain rate and resistance of polyester fiber. The optimal process parameters of electroless nickel–phosphorous plating were obtained as follows: sodium citrate 10 g/L, nickel sulfate 20 g/L, sodium hypophosphite 8 g/L, sodium acetate 15 g/L, pH 6.0-6.2, temperature 80 °C, loading capacity 9 g/L, and time 10-15 min. The polyester fiber obtained after electroless nickel–phosphorous plating under optimal process conditions has a weight gain rate of ca.19%and a resistance of 10Ω/cm.

  3. NH3 Plasma Surface Treatments of Engineering Fluoropolymers: A Way to Enhance Adhesion of Ni or Cu Thin Films Deposited by Electroless Plating

    Institute of Scientific and Technical Information of China (English)

    MauriceRomand; MarleneCharbonnier; YvesGoepfert

    2004-01-01

    This paper describes the electroless Ni or Cu plating of some fluoropolymer substrates through a tin-free activation process. Materials subjected to surface metallization are commercial Teflon FEE Nation, ACLAR and LaRCTM-CP1 thin films which have recently gained a large scientific and technological interest due to their excellent thermal, chemical, mechanical and dielectric properties. The original approach implemented in the present work involves: (i) the grafting of nitrogen-containing functionalities on the polymer surfaces through plasma treatments in ammonia, (ii) the direct catalysis of the so-modified surfaces via their immersion insurface sensitization in an acidic SnCl2 solution), and finally (iii)a simple acidic PdCl2 solution (i.e. without using a prior the electroless metallization itself. However, prior to the immersion in the industrial plating baths, the chemical reduction of the Pd+1 species (species covalently tethered on the nitrogen-containing groups) to metallic palladium (Pd0) is shown to be a key factor in catalyzing the electroless deposition initiation. This is made by immersion in an hypophosphite (H2PO2-) solution. Wettability measurements and X-ray photoelectron spectroscopy (XPS) experiments are used to characterize every surface modification step of the developed process. A cross-hatch tape test was used to asses the adhesion strength of the electroless films that is shown qualitatively good. In addition, a fragmentation test was developed in combination with electrical measurements. Its use allows to distinguish different adhesion levels at the metal/polymer interface and to evidence the influence of some processing parameters.

  4. NH3 Plasma Surface Treatments of Engineering Fluoropolymers:A Way toEnhance Adhesion of Ni or Cu Thin Films Deposited by Electroless Plating

    Institute of Scientific and Technical Information of China (English)

    Maurice Romand; Marlène Charbonnier; Yves Goepfert

    2004-01-01

    This paper describes the electroless Ni or Cu plating of some fiuoropolymer substrates through a tin-free activation process. Materials subjected to surface metallization are commercial Teflon() FEP, Nafion(), ACLAR() and LaRCTM-CP1 thin films which have recently gained a large scientific and technological interest due to their excellent thermal, chemical, mechanical and dielectric properties. The original approach implemented in the present work involves: (i)the grafting of nitrogen-containing functionalities on the polymer surfaces through plasma treatments in ammonia, (ii) the direct catalysis of the so-modified surfaces via their immersion in a simple acidic PdCl2 solution (i.e. without using a prior surface sensitization in an acidic SnCl2 solution), and finally (iii) the electroless metallization itself. However, prior to the immersion in the industrial plating baths, the chemical reduction of the Pd+2 species (species covalently tethered on the nitrogen-containing groups) to metallic palladium (PdO) is shown to be a key factor in catalyzing the electroless deposition initiation. This is made by immersion in an hypophosphite (H2PO2-) solution. Wettability measurements and X-ray photoelectron spectroscopy (XPS) experiments are used to characterize every surface modification step of the developed process. A cross-hatch tape test was used to asses the adhesion strength of the electroless films that is shown qualitatively good. In addition, a fragmentation test was developed in combination with electrical measurements. Its use allows to distinguish different adhesion levels at the metal/polymer interface and to evidence the influence of some processing parameters.

  5. Effect of CuSO4 Content in the Plating Bath on the Properties of Composites from Electroless Plating of Ni-Cu-P on Birch Veneer

    Directory of Open Access Journals (Sweden)

    Bin Hui

    2014-04-01

    Full Text Available A wood-based composite was prepared via simple electroless Ni-Cu-P plating on birch veneer for EMI shielding. The effects of CuSO4•5H2O concentration on the metal deposition, elemental composition, phase structure, surface morphology, wettability, surface resistivity, and shielding effectiveness of coatings were investigated. The coatings were characterized using X-ray diffraction (XRD, X-ray photoelectron spectroscopy (XPS, and scanning electron microscopy (SEM. When the CuSO4•5H2O concentration was increased from 0.6 g/L to 2.2 g/L, the metal deposition was decreased from 79.61 g/m2 to 66.44 g/m2. Elemental composition showed that the copper content in the coating increased significantly, whereas the nickel content was reduced significantly and the phosphorus content was slightly reduced. The crystallinity of coatings increased, and fine-grain structure was observed, with higher copper content. Ni-Cu-P deposition improved the hydrophobic properties when the maximum static contact angle increased from 77.5° to 116.5°. The lowest surface resistivity was 367.5 mΩ/cm2, and the EMI shielding effectiveness of Ni-Cu-P-coated veneers was higher than 60 dB in frequencies ranging from 9 kHz to 1.5 GHz.

  6. 乙醛酸化学镀铜工艺%An Electroless Copper Plating Process Using Glyoxylate as Reductant

    Institute of Scientific and Technical Information of China (English)

    杨防祖; 姚光华; 周绍民

    2012-01-01

    An electroless copper plating process using glyoxylate as reductant was developed, structure and surface morphology of the deposit were also studied. The bath composition and operating conditions were: 28.0g/L CuSO4·5H2O,44.0g/L EDTA·2Na,10.0mg/L α,α' -bipyridyl,10.0mg/L potassium ferrocy-anide,9.2g/L glyoxylate,pH 11.5 ~ 12.5,temperature 40~50℃. Experimental results showed that:the electroless copper plating bath was quite stable; the copper deposition rate would increased in case of bath temperature and copper sulfate concentration increased; the bath stability would decreased due to lower activation energy of copper deposition in case of higher temperature; the qualified copper coating could be obtained only at a proper bath pH range of 11.5 ~12.5; the copper deposition rate would not be affected by concentrations of glyoxylate and complexing agent evidently, whereas excessive content of glyoxylate would cause the bath stability decreased; the copper coating had a FCC mixed crystal structure with blocky grains 、pink/bright appearance and good ductility.%研究了以乙醛酸为还原剂的化学镀铜工艺、镀层结构和形貌.其镀液组成和操作条件为:28.0 g/L CuSO4·5H2O,44.0 g/L EDTA-2Na,10.0 mg/L α,α'-联吡啶,10.0 mg/L亚铁氰化钾,9.2g/L乙醛酸,pH为11.5 ~12.5,θ为40 ~ 50℃.实验结果表明,化学镀铜溶液较稳定;镀液温度和硫酸铜质量浓度提高,铜沉积速率增大;较高的镀液温度下,化学镀铜反应的活化能较低,镀液稳定性下降;镀液pH在11.5~12.5可获得较好的铜镀层;随乙醛酸和络合剂质量浓度提高,铜沉积速率变化不大,但过量的乙醛酸导致镀液的稳定性降低;铜镀层为面心立方混晶结构,呈光亮的粉红色块状形貌,有较高的韧性.

  7. Analysis of continuous solvent extraction of nickel from spent electroless nickel plating baths by a mixer-settler.

    Science.gov (United States)

    Huang, Ying; Tanaka, Mikiya

    2009-05-30

    It is urgent to develop an effective technique to treat the large amount of spent electroless nickel plating bath and recycle the high concentration nickel. In our previous study, high recycling efficiency of nickel from the model spent bath was obtained by continuous solvent extraction with 2-hydroxy-5-nonylacetophenone oxime (LIX84I) as the extractant and 2-ethylhexylphosphonic acid mono-2-ethylhexyl ester (PC88A) as the accelerator using a mixer-settler extractor. It was observed that the extraction efficiency was affected by the operation parameters such as the flow rates of the aqueous and organic phases and the total stage number. In the present study, the effects of the operation parameters on the extraction efficiency were quantitatively studied on the basis of the pseudo-first-order interfacial extraction rate equation together with the hydrodynamic properties in the mixer. The organic phase holdup, measured under varying conditions of the flow rates of both phases, was analyzed by the Takahashi-Takeuchi holdup model in order to estimate the specific interfacial area. The overall extraction rate coefficients defined by the product of the interfacial extraction rate constant and the specific interfacial area were evaluated using the experimental data and ranged from 3.5 x 10(-3) to 6.7 x 10(-3)s(-1), which was close to the value of 3.4 x 10(-3)s(-1) obtained by batch extraction. Finally, an engineering simulation method was established for assessing the extraction efficiency of nickel during a multistage operation.

  8. Field Emission Lamps Prepared with Dip-Coated and Nickel Electroless Plated Carbon Nanotube Cathodes.

    Science.gov (United States)

    Pu, N W; Youh, M J; Chung, K J; Liu, Y M; Ger, M D

    2015-07-01

    Fabrication and efficiency enhancement of tubal field emission lamps (FELs) using multi-walled carbon nanotubes (MWNTs) as the cathode field emitters were studied. The cathode filaments were prepared by eletrolessly plating a nickel (Ni) film on the cathode made of a 304 stainless steel wire dip-coated with MWNTs. The 304 wire was dip-coated with MWNTs and nano-sized Pd catalyst in a solution, and then eletrolessly plated with Ni to form an MWNT-embedded composite film. The MWNTs embedded in Ni not only had better adhesion but also exhibited a higher FE threshold voltage, which is beneficial to our FEL system and can increase the luminous efficiency of the anode phosphor. Our results show that the FE cathode prepared by dipping three times in a solution containing 400 ppm Pd nano-catalysts and 0.2 wt.% MWNTs and then eletrolessly plating a Ni film at a deposition temperature of 60 °C, pH value of 5, and deposition time of 7 min has the best FE uniformity and efficiency. Its emission current can stay as low as 2.5 mA at a high applied voltage of 7 kV, which conforms to the high-voltage-and-low-current requirement of the P22 phosphor and can therefore maximize the luminous efficiency of our FEL. We found that the MWNT cathodes prepared by this approach are suitable for making high-efficiency FELs.

  9. ELECTROLESS NICKEL PLATING OF MAGNESIUM ALLOY WITH MICROARC OXIDATION PRETREATMENT%镁合金微弧氧化预处理化学镀镍研究

    Institute of Scientific and Technical Information of China (English)

    李均明; 薛晓楠; 王爱娟; 马安博; 符致昭

    2012-01-01

    Magnesium alloys after microarc oxidation(MAO) pretreatment were directly electroless Ni plated by using NiSO_4 solution,meanwhile,any traditional pretreatment,including alkaline washing,acid washing and activation,etc.,was used.The microstructure and composition of nickel layer were characterized.The effect of MAO pretreatment on the thickness,hardness,electrical conductivity and corrosion resistance of nickel layer were investigated.The results indicate that the layer which contains Ni and P is composed of cellular particles. MAO pretreatmely affects the thickness and electrical conductivity of nickel layer significantly.The thickness of nickel layer fastly increases but the sheet resistance of the layer rapidly decreases when the thickness of MAO film increases from 3 to 7μm.Furthermore,the results of polarization curve test reveal that when the thickness of MAO film is 15μm,the corrosion potential of the obtained electroless nickel plated magnesium alloy is the highest,and the corrosion current is the lowest.The results of 48 h salt spray test show that the corrosion resistance of electroless nickel plated magnesium alloy with MAO pretreatment is much higher than that of electroless nickel plated magnesium alloy with traditional pretreatment and magnesium alloy substrate.%镁合金微弧氧化(MAO)预处理后,无需碱洗酸洗活化等传统预处理直接在硫酸镍溶液中化学镀镍。表征了镀镍层的显微结构与成分,研究了MAO预处理对镀层厚度、硬度、导电性及耐蚀性的影响。结果表明:含有Ni,P两种元素的镀层由均匀分布的胞状颗粒组成。MAO预处理显著影响镀层的厚度与导电性;当MAO薄膜从3μm增厚至7μm时,镀层的厚度快速增大而方块电阻迅速下降。极化曲线测试表明,当MAO薄膜厚15μm时化学镀镍镁合金的腐蚀电位最高,腐蚀电流最小。48h盐雾实验表明,MAO预处理化学镀镍镁合金的耐蚀性显著优于传统预处理化学镀镍镁合金。

  10. Supercritical CO2 assisted electroless plating on polypropylene substrate-effect of injection speed on adhesive force of metal to polymer

    Science.gov (United States)

    Ohshima, Masahiro; Tsubouchi, Kensuke; Ishihara, Shota; Hikima, Yuta; Tengsuwan, Siwach

    2016-03-01

    The aqueous plating solution cannot be diffused into a plain polypropylene (PP) substrate and consequently Ni-P metal layer cannot be formed by electroless plating on the PP substrate with a satisfied degree of adhesive force unless the hydrophilicity of the substrate surface was increased. A block copolymer PP-b-polyethylene oxide (PP-b-PEO) was used to increase the hydrophilicity of the surface and the adhesive force of the metal layer to the satisfactory level. Our previous study showed the morphology of PP-b-PEO domain near the surface of substrate strongly affected the adhesiveness of the metal layer to the substrate. The degrees of elongation and orientation of the PP-b-PEO domains in PP matrix were the key factors of determining the thickness of the metal-PP composite layer and the resulting adhesive strength. In this study, the effect of injection molding condition on the degrees of elongation and orientation was investigated: PP/PP-b-PEO blend substrates were prepared by injection molding at different injection speed. The higher injection speed increased the degrees of elongation and orientation of copolymer and formed multilayered structure of the copolymer domains. It could produce the electroless plating PP substrate with the higher adhesive strength of the Ni-P metal layer to the PP substrate.

  11. 化学镀Ni层中的添加剂对焊料接合可靠性的影响%The Inlfuence of additives in electroless nickel plating on the reliability of solder joint

    Institute of Scientific and Technical Information of China (English)

    蔡积庆(译)

    2013-01-01

    This paper describes the inlfuence of trace additives(Pb•s) concentration in electroless nickel plating on the deposit speed, corrosion resistance, solder wetting and solder joint reliabilily of electroless Ni/Pd/Au plating.%  概述了化学镀镍层中的微量添加剂(PDIS)浓度对化学镀Ni/Pa/Au镀层的析出速度、耐蚀性、焊料湿润性和焊料接合可靠性的影响。

  12. Electroless plating of Ni-Zn(Fe)-P alloy on carbon steel sheets

    Institute of Scientific and Technical Information of China (English)

    WANG Sen-lin; WU Hui-huang

    2004-01-01

    The autocatalytic deposition of Ni-Zn(Fe)-P alloys were carried out on carbon steel sheets from bath containing nickel sulfate, zinc sulfate, sodium hypophosphite, sodium citrate and boric acid. The effects of pH and mole ratio of NiSO4/ZnSO4 on the deposition rate and the composition of deposit were studied. It is found that the presence of zinc sulfate in the bath has an inhibitory effect on the alloy deposition. As a consequence, the mole fraction of zinc in the deposits never reaches high value, which is less than 18.0%. The structure and surface morphology of Ni-Zn(Fe)-P coatings were charactered by XRD and SEM. The alloys plated at all conditions consist of amorphous phase coexisting with a crystalline cubic Ni phase. The surface morphology of coating is dependent on the deposition parameters.

  13. Versatile Micropatterning of Plasmonic Nanostructures by Visible Light Induced Electroless Silver Plating on Gold Nanoseeds.

    Science.gov (United States)

    Yoshikawa, Hiroyuki; Hironou, Asami; Shen, ZhengJun; Tamiya, Eiichi

    2016-09-14

    A versatile fabrication technique for plasmonic silver (Ag) nanostructures that uses visible light exposure for micropatterning and plasmon resonance tuning is presented. The surface of a glass substrate modified with gold (Au) nanoseeds by a thermal dewetting process was used as a Ag plating platform. When a solution containing silver nitrate and sodium citrate was dropped on the Au nanoseeds under visible light exposure, the plasmon-mediated reduction of Ag ions was induced on the Au nanoseeds to form Ag nanostructures. The plasmon resonance spectra of Ag nanostructures were examined by an absorption spectral measurement and a finite-difference time-domain (FDTD) simulation. Some examples of Ag nanostructure patterning were demonstrated by means of light exposure through a photomask, direct writing with a focused laser beam, and the interference between two laser beams. Surface enhanced Raman spectroscopy (SERS) of 4-aminothiophenol (4-ATP) was conducted with fabricated Ag nanostructures.

  14. 2-巯基苯并噻唑对化学镀铜的影响%Effect of 2-mercaptobenzothiazole on electroless copper plating

    Institute of Scientific and Technical Information of China (English)

    昝灵兴; 王晓兰; 丁杰; 孙宇曦; 高琼; 路旭斌; 王增林

    2012-01-01

    The effect of 2-mercaptobenzothiazole on deposition rate of electroless copper plating on ABS plastic, as well as the surface morphology, purity, evenness, and crystal type of copper coating was studied using formaldehyde as the reducing agent. The process parameters of electroless copper plating are as follows: CuSO4·5H2O 10 g/L, EDTA-2Na 30 g/L, HCHO 3 mL/L, PEG-1000 2 mg/L, 2-MBT 0-2 mg/L, temperature 70 ℃ or 40 ℃, pH 12.5, and time 1 h. With the addition of low concentration of 2-MBT to the bath, the mixed potential of electroless copper coating becomes more positive, the deposition rate increases, and the density and evenness of Cu coating improves, while the crystal type of coating slightly changes. The obtained Cu coating has high purity as 2-MBT just plays the part of complexant and accelerant during the electroless copper plating.%以甲醛为还原剂,研究了2-巯基苯并噻唑(2-MBT)对ABS塑料化学镀铜沉积速率、铜镀层表面形貌、纯度、平整度及晶型的影响.化学镀铜的工艺条件为:CuSO4·5H2O 10g/L,EDTA-2Na30g/L,HCHO3mL/L,PEG-10002mg/L,2-MBT0~2mg/L,温度70℃或40℃,pH 12.5,时间1 h.镀液中加入低浓度2-MBT后,化学镀铜的混合电位正移,沉积速率提高,铜镀层的致密性和平整性得到改善,但镀层晶型变化不大.2-MBT在化学镀铜中只起配位和加速作用,所得铜镀层纯度较高.

  15. 镍-磷/纳米碳管化学复合镀层的研究%Study of Electroless Ni-P-CNTs Composite Plating

    Institute of Scientific and Technical Information of China (English)

    孔纪兰; 周上祺; 任勤; 张喜

    2006-01-01

    采用化学复合镀方法,在基体铜片上进行Ni-P/纳米碳管复合镀.用金相显微镜、扫描电子显微镜、X射线衍射仪和显微硬度计等实验手段研究复合镀层的组织、结构和性能.结果表明:随着镀液中纳米碳管含量的增加,复合镀层表面的颗粒变小且密度增加;复合镀层的硬度随纳米碳管含量的增加而提高;此外,纳米碳管的加入,使镀层由非晶变成了纳米晶,促进了复合镀层的晶化.%The electroless Ni-P-carbon nanotubes composite plating was studied on the copper substrate. Metallurgical microscope, scanning electronic microscope, X-ray diffractometer and micro hardness tester were used to study the structure, constitution and performance of the electroless Ni-P-carbon nanotubes composite deposit. Experiential results show that, with the increment of carbon nanotubes content in electroless plating solution, the grain size on the sample surface decreases whereas the density of grains and the hardness for composite deposit increases. Moreover, adding carbon nanotubes not only improves the degree of crystallization for the composite deposit but also helps their transformation from the amorphous state to the nanocrystal state.

  16. Structure and 57Fe conversion electron M(o)ssbauer spectroscopy study of Mn-Zn ferrite nanocrystal thin films by electroless plating in aqueous solution

    Institute of Scientific and Technical Information of China (English)

    SUN JianRong; WANG XueWen; LIU JinHong; WANG JianBo; LI FaShen

    2008-01-01

    Mn1-xZnxFe2O4 thin films with various Zn contents and of different thickness were synthesized on glass substrates directly by electroless plating in aqueous solution at 90℃ without heat treatment. The Mn-Zn ferrite films have a single spinel phase structure and well-crystallized columnar grains growing per-pendicularly to the substrates. The results of conversion electron 57Fe Mossbauer spectroscopy (CEMS) indicate that the cation distribution of Mn-xZnxFe2O4 ferrite nanocrystal thin films fabricated by elec-troless plating is different from the bulk materials' and a great quantity of Fe3+ ions are still present on A sites for x>0.5. When the Zn content of the films increases, Fe3+ ions in the films transfer from A sites to B sites and the hyperfine magnetic field reduces, suggesting that Zn2+ has strong chemical affinity towards the A sites. On the other side, with the increase of the thickness of the films, Fe3+ ions, at B sites in the spinel structure, increase and the array of magnetic moments no longer lies in the thin film plane completely. At x=0.5, Hc and Ms of Mn1-xZnxFe2O4 thin films show a minimum of 3.7 kA/m and a maximum of 419.6 kA/m, respectively.

  17. Electromagnetic properties of core–shell particles by way of electroless Ni–Fe–P alloy plating on flake-shaped diatomite

    Energy Technology Data Exchange (ETDEWEB)

    Zhang, Deyuan [Bionic and Micro/Nano/Bio Manufacturing Technology Research Center, School of Mechanical Engineering and Automation, Beihang University, Beijing 100191 (China); Yuan, Liming, E-mail: lming_y@163.com [Bionic and Micro/Nano/Bio Manufacturing Technology Research Center, School of Mechanical Engineering and Automation, Beihang University, Beijing 100191 (China); Lan, Mingming; Hu, Yanyan; Cai, Jun [Bionic and Micro/Nano/Bio Manufacturing Technology Research Center, School of Mechanical Engineering and Automation, Beihang University, Beijing 100191 (China); Zhang, Wenqiang [College of Engineering, China Agricultural University, Beijing 100083 (China); Li, Haiyang [China Aerospace Science and Technology Corporation, Beijing 100854 (China)

    2013-11-15

    Flake-shaped diatomite particles coated by Ni–Fe–P alloy were prepared by electroless plating technique and processed by heat treatment. The samples were characterized by SEM, EDS and XRD. The results indicated that the magnetic diatomite particles had continuous and homogeneous Ni–Fe–P coating, and the phase constitution of the Ni–Fe–P coating was transformed from an amorphous structure to a crystalline structure during heat treatment. The measured electromagnetic parameters and the calculated reflection loss suggested that heat treatment was able to enhance the microwave absorption performance of the paraffin wax based composites. In a word, the Ni–Fe–P coated diatomite particle obtained in this paper is a promising candidate for lightweight microwave absorbing inclusions. - Highlights: • We used the flake-shaped diatomite particles as forming template to fabricate the core–shell ferromagnetic particles. • The diatomite particles were deposited Ni–Fe–P alloy by way of electroless plating methods. • The coated diatomite particles were lightweight ferromagnetic fillers. • The composites containing coated diatomite particles with heat treatment exhibited great potential in the field of electromagnetic absorbing.

  18. Ultrasonic preparation of nano-nickel/activated carbon composite using spent electroless nickel plating bath and application in degradation of 2,6-dichlorophenol.

    Science.gov (United States)

    Su, Jingyu; Jin, Guanping; Li, Changyong; Zhu, Xiaohui; Dou, Yan; Li, Yong; Wang, Xin; Wang, Kunwei; Gu, Qianqian

    2014-11-01

    Ni was effectively recovered from spent electroless nickel (EN) plating baths by forming a nano-nickel coated activated carbon composite. With the aid of ultrasonication, melamine-formaldehyde-tetraoxalyl-ethylenediamine chelating resins were grafted on activated carbon (MFT/AC). PdCl2 sol was adsorbed on MFT/AC, which was then immersed in spent electroless nickel plating bath; then nano-nickel could be reduced by ascorbic acid to form a nano-nickel coating on the activated carbon composite (Ni/AC) in situ. The materials present were carefully examined by Fourier transform infrared spectroscopy, X-ray diffraction, field emission scanning electron microscopy, X-ray photoelectron spectroscopy and electrochemistry techniques. The resins were well distributed on the inside and outside surfaces of activated carbon with a size of 120 ± 30 nm in MFT/AC, and a great deal of nano-nickel particles were evenly deposited with a size of 3.8 ± 1.1 nm in Ni/MFT. Moreover, Ni/AC was successfully used as a catalyst for ultrasonic degradation of 2,6-dichlorophenol.

  19. Electrolessly Plated Ni-Zn(Fe)-P Alloy and Its Corrosion Resistance Properties

    Institute of Scientific and Technical Information of China (English)

    WANG Sen-lin; WU Hui-huang

    2005-01-01

    The autocatalytic deposition of Ni-Zn(Fe)-P alloys has been carried out on substrate of carbon steel from a bath containing nickel sulfate, zinc sulfate, sodium hypophosphite, sodium citrate and boric acid. The effects of pH and the molar ratio of NiSO4/ZnSO4 on the deposition rate and the composition of deposits have been studied. It was found that the presence of zinc sulfate in the bath has an inhibitory effect on the alloy deposition. The structure and the surface morphology of Ni-Zn(Fe)-P coatings were characterized with XRD and SEM, respectively. The alloys plated under the experimental conditions consisted of an amorphous phase coexisting with a crystalline cubic Ni phase(poly-crystalline). The surface morphology of the coating is dependent on the deposition parameters. The corrosion resistance of the Ni-Zn(Fe)-P deposits was examined via mass loss tests and anodic polarization measurements, respectively. The results show that the surface morphologies of the deposits and the corrosion resistance of the deposits have been improved. The results of mass loss tests almost accord with those of anodic polarization measurements. The corrosion mechanisms of Ni-Zn(Fe)-P alloys in NaCl and NaOH solutions were investigated by means of EDX. The deposit immersed in an NaCl or an NaOH solution contains more content of oxygen and less contents of the metals(except Fe) than that placed in air, which shows that the NaCl or NaOH solution can accelerate the oxidation of the deposit.

  20. 化学镀锡反应动力学特性研究%Dynamic Characteristics of Electroless Tin Plating Reaction

    Institute of Scientific and Technical Information of China (English)

    杨余芳; 衷明华; 黄俊生

    2014-01-01

    ABSTRACT:Objective To study the dynamic characteristics of electroless tin plating reaction. Methods Using sodium hypophos-phite as the reducing agent, and SnCl2 as the main salt, electroless Sn was deposited on copper in the thiourea-citric acid-tartaric acid trinary ligand system. Influences of temperature, as well as the concentrations of main salt, reducing agent, hydrogenion and complexing agents on the deposition rate were investigated, respectively. Results The reaction orders of Sn2+, sodium hypophos-phite and H+ were 0. 302, 0. 192 and 0. 21,and those of thiourea, citric acid and tartaric acid were 0. 237, 0. 213 and 0. 081, re-spectively. The rate constant was 0. 013, the total reaction order was 1. 235, and the apparent activation energy was 11. 184 kJ/mol. Conclusion The kinetic equation of electroless tin plating reaction was established, which provides reference for the technology se-lection and product control in electroless tin deposition technology.%目的研究化学镀锡反应过程的动力学特性。方法在硫脲鄄柠檬酸鄄酒石酸三元络合体系中,以次磷酸钠为还原剂,以SnCl2为主盐,在铜片上化学沉积锡镀层,研究温度、主盐、还原剂、H+和络合剂的浓度对沉积速度的影响规律。结果镀锡过程中,Sn2+,H+和次磷酸钠的反应级数分别为0.302,0.21和0.192;硫脲、柠檬酸和酒石酸的反应级数分别为0.237,0.213和0.081;速度常数为0.013,总反应级数为1.235级,表观活化能为11.184kJ/mol。结论建立了化学镀锡反应的动力学方程,对化学镀锡沉积工艺的选择和产物的控制具有一定的参考作用。

  1. Thermal/plasma-driven reversible wettability switching of a bare gold film on a poly(dimethylsiloxane) surface by electroless plating.

    Science.gov (United States)

    Wu, Jian; Bai, Hai-Jing; Zhang, Xian-Bo; Xu, Jing-Juan; Chen, Hong-Yuan

    2010-01-19

    We report an approach for fabricating a tunable wettability surface by electroless gold plating on poly(dimethylsiloxane) (PDMS). A two-layer structured gold film with a tight layer and a loose layer can be obtained on the surface of a PDMS chip when the PDMS chip is immersed in a gold plating solution at 30 degrees C for 4 h. Its wettability can be rapidly switched between superhydrophilicity and superhydrophobicity by plasma and heat treatments without any self-assembled monolayer, and the superhydrophobicity can be even changed from the gecko-foot-hair-like character to the lotus-leaf-like character. Benefiting from the various wettabilities of the prepared gold/PDMS composites, protein patterning is successfully achieved on a patterned superhydrophobic/superhydrophilic gold/PDMS composite; a superhydrophobic needle for transferring supersmall water droplets (1 microL) to a superhydrophobic surface is successfully fabricated.

  2. Study of silver activating solution used in PCB electroless copper plating%银活化液在PCB化学镀铜的研究

    Institute of Scientific and Technical Information of China (English)

    杨琼; 陈世荣; 汪浩; 曹权根; 王恒义; 谢金平; 范小玲

    2013-01-01

    文章简述了印制电路板孔金属化用的各种钯活化液的原理和特点,提出了一种银活化液,并将其催化活性和催化效果与胶体钯进行了对比。结果表明银活化用于化学镀铜,诱导时间快,可以节约成本。%This paper describes the principles and characteristics of various PCB plated through hole palladium activating solution, we propose a silver activation solution and its catalytic activity and catalytic effects were compared with colloidal palladium. The results show that silver activation solution can quickly induce electroless copper plating, and save production cost.

  3. Electroless copper plating of inkjet-printed polydopamine nanoparticles: a facile method to fabricate highly conductive patterns at near room temperature.

    Science.gov (United States)

    Ma, Siyuan; Liu, Liang; Bromberg, Vadim; Singler, Timothy J

    2014-11-26

    Aqueous dispersions of artificially synthesized, mussel-inspired poly(dopamine) nanoparticles were inkjet printed on flexible polyethylene terephthalate (PET) substrates. Narrow line patterns (4 μm in width) of poly(dopamine) resulted due to evaporatively driven transport (coffee ring effect). The printed patterns were metallized via a site-selective Cu electroless plating process at a controlled temperature (30 °C) for varied bath times. The lowest electrical resistivity value of the plated Cu lines was about 6 times greater than the bulk resistivity of Cu. This process presents an industrially viable way to fabricate Cu conductive fine patterns for flexible electronics at low temperature, low cost, and without need of sophisticated equipment.

  4. 聚乙二醇改性PET薄膜化学镀铜%Electroless copper plating on polyethylene glycol-modified PET film

    Institute of Scientific and Technical Information of China (English)

    潘湛昌; 程果; 武守坤; 李柱梁; 邓剑锋; 胡光辉; 肖楚民

    2013-01-01

    研究了聚乙二醇改性对聚对苯二甲酸乙二醇酯(PET)薄膜化学镀铜的影响.主要工序为:依次用1#、3#、5#金相砂纸打磨PET薄膜,在紫外光下用聚乙二醇改性接枝,以及化学镀铜.镀液的组成与工艺条件为:CuSO4·5H2O 16 g/L,Na2EDTA14 g/L,NaKC4H4O6·2H2O 19.5 g/L,NaOH 14.5 g/L,HCHO15 mL/L,温度40℃,时间30 min.红外光谱图表明PEG-6000被成功接枝在PET薄膜表面.分别采用X射线衍射仪、扫描电镜分析了化学镀铜后PET薄膜的结构和表面形貌,并测试了PET薄膜的结合力、厚度、导电性等性能.结果表明,PET表面的化学镀铜层纯度高;与未改性PET基铜镀层相比,改性的PET基铜镀层结晶更细致、光亮;镀铜层的厚度、电导率、背光等级及其与PET薄膜之间的结合力分别为1.21 μm、1.9×105 S/cm、10级、16.1 N/cm,可用以生产挠性电路板(FCB).%The effect of polyethylene glycol (PEG-6000) modification of polyethylene terephthalate (PET) film on electroless copper plating on its surface was studied. The process flow mainly consists of: (a) successive polishing of PET film with 1#, 3# and 5# metallographic sand paper; (b) modification of PET film by grafting with PEG; and (c) electroless copper plating from a bath containing CuSO4·5H2O 16 g/L, Na2EDTA 14 g/L, NaKC4H4O6·2H2O 19.5 g/L, NaOH 14.5 g/L, and HCHO 15 mL/L at temperature 40 ℃ for 30 min. The infrared spectra show that PEG-6000 are grafted successfully to the surface of PET film. The structure and surface morphology of PET film before and after electroless copper plating were analyzed by X-ray diffractometer and scanning electron microscope, respectively, and the properties of PET film such as adhesion strength, thickness, and conductivity were tested. The results show that the electroless copper coating on PET film is highly pure. Compared to the copper coating on ungrafted PET substrate, the copper coating on grafted PET substrate is fine-grained and bright. The

  5. 镁合金化学镀镍基合金的工艺研究进展%Research Progress of Electroless Nickel Base Alloy Plating on Mg Alloy

    Institute of Scientific and Technical Information of China (English)

    邵颖; 李广宇; 邵忠财; 华利明

    2011-01-01

    Magnesium alloy is used widely but its corrosion resistance is poor, and the corrosion resistance can be improved by electroless nickel base alloy plating. Interlayer preparation method and direct electro-less plating method of electroless nickel base alloy plating on magnesium alloy were introduced; development situation of electroless nickel base alloy plating on magnesium alloy was briefly reviewed; existing problems and future development tendency were pointed out.%镁合金用途广泛,但耐蚀性能差,通过化学镀镍基合金可以改善其耐蚀性能.介绍了镁合金化学镀镍基合金制取中间层法和直接化学镀法;对镁及镁合金化学镀镍基合金的发展作了简要评述,在此基础上指出了目前镁合金化学镀存在的问题及今后发展方向.

  6. 镍-铜复合镀层Kevlar纤维的研制%Development and Research of Electroless Ni-Cu Plated Kevlar Fibers

    Institute of Scientific and Technical Information of China (English)

    梁晶晶; 邹新国; 张慧茹; 邵勤思; 唐志勇; 孙晋良

    2012-01-01

    采用化学镀技术制备了镍-铜复合镀层的导电Kevlar纤维。进行了自制金属化试剂对Kevlar纤维的粗化处理,研究了镍镀层含量、添加剂聚乙二醇(PEG6000)和亚铁氰化钾(K4Fe(CN)6))对化学镀铜的影响。实验表明,镍镀层质量增加率为10%较适宜继续化学镀铜;添加剂均可降低化学镀铜的沉积速度,PEG6000能够细化圆滑镀层颗粒,K4Fe(CN)6使得镀层表面平整光亮,制得光滑致密有金属光泽的铜镀层,并提高其导电性。镍-铜复合镀层Kevlar纤维的断裂强力为45 N,表面电阻为0.4Ω/cm。%Electroless copper plating at the nickel modified surface of Kevlar fibers was investigated. The surface of Kevlar fibers was roughened using sodium hydride-dimethyl sulfoxide (NaH-DMSO). Then, influence of Ni weight gain rate and additives (polyethylene glycol PEG6000 and potassium ferrocyanide K4Fe(CN)6) on electroless Cu plating was studied. The results show that favorable Ni weight gain rate is approximate 10 %, PEG6000 and K4Fe (CN)6 increase the stability of plating bath, and reduce the deposition rate of electroless Cu plating. Copper grains turn fine, sleek and homogeneous with adding PEG6000. Copper deposits become more compact, smoother and brighter with adding KaFe (CN)6. Correspondingly, the appearance of deposits changes from dark-brown to red brown, and then to bright copper. Meanwhile, the conductivity of deposits increases. The properties tests show that breaking strength of Ni-Cu coated Kevlar fibers is 45N and thesiarface resistance is 0.4Ω/cm.

  7. Potentiodynamic studies of Ni-P-TiO2 nano-composited coating on the mild steel deposited by electroless plating method

    Science.gov (United States)

    Uttam, Vibha; Duchaniya, R. K.

    2016-05-01

    Now a days, corrosion studies are important for reducing the wastage of metals. The importance of corrosion studies is two folds i.e. first is economic, including the reduction of material losses resulting from the wasting away or sudden failure of materials and second is conservation Electroless process is an autocatalytic reduction method in which metallic ions are reduced in the solution. Nanocomposite coatings of Ni-P-TiO2 on mild steel are deposited by varying volume of TiO2 nano-powder by electroless method from Ni-P plating bath containing Nickel Sulphate as a source of nickel ions, sodium hypophosphite as the reducing agent, lactic acid as a complexing agents and TiO2 nano powder. Electroless Ni-P-TiO2 coating have been widely used in the chemical process industries, mechanical industries, electronic industries and chloroalkali industries due to their excellent corrosion with mechanical properties. In the present work, deposition of Ni-P alloy coating and Ni-P-TiO2 nanocomposited coatings were done on the mild steel and corrosion properties were studied with Potentio-dynamic polarization measurements method in 3.5 wt% sodium chloride solution. It showed in the experiments that Ni-P-TiO2 nanocomposited coating has better corrosion resistance as comparedthan Ni-P alloy coating. Morphological studies were done by field emission scanning electron microscopy (FESEM), energy-dispersive analysis of X-ray (EDAX) and X-ray diffraction (XRD). These studies confirmed the deposition of Ni-P alloy coating and Ni-P-TiO2 nanocomposited coating.

  8. 化学镀镍复合添加剂BH的工艺特性%Technological properties of composite stabilizer BH for electroless nickel plating

    Institute of Scientific and Technical Information of China (English)

    鹿轩; 梁颖诗; 张晓明; 林继月; 胡耀红; 赵国鹏

    2013-01-01

    开发了一种由含钼化合物、碘化钾以及邻苯二甲酸酐衍生物组成的复合添加剂BH,讨论了它对化学镀镍液稳定性、镀速以及镀层磷含量、硬度、孔隙率和微观形貌的影响。对测试化学镀镍液稳定性的PdCl2试验标准进行了改进:温度由80°C提高到90°C,PdCl2的浓度由0.1 g/L增加到1.0 g/L。研究结果显示,新标准检验的镀液稳定性差异能较好地反映实际生产中的镀液稳定性差异;当复合添加剂BH的添加量为2.0 mL/L时,化学镀镍层微观形貌得到较大的改善。经过新的PdCl2试验标准检验,该镀液可达到900 s不发生浑浊,镀速为24μm/h,镀层孔隙率0.57个/cm2,磷含量7.3%,硬度520 HV。%A composite additive BH consisting of molybdenum-containing compound, potassium iodide, and phthalic anhydride derivative was developed, and its influence on the stability and deposition rate of electroless nickel plating bath, as well as the phosphorus content, hardness, porosity, and micro-morphology of deposit was discussed. The PdCl2 test standard used for determining stability of electroless nickel plating bath was improved as follows: increasing temperature from 80 °C to 90 °C and PdCl2 concentration from 0.1 g/L to 1.0 g/L. The results indicated that the difference of bath stability tested by the improved method has good relevance with that in practical production. The electroless nickel plating bath with composite additive BH 2.0 mL/L remains stable within 900 s without becoming turbid by testing based on the improved method and produces electroless nickel coatings with improved micro-morphologies at a deposition rate of 24μm/h.The electroless nickel coating obtained has a porosity 0.57 pores/cm2, phosphorus content 7.3%and hardness 520 HV.

  9. 前处理对高体积分数SiCp/Al复合材料化学镀镍的影响∗%Influence of pretreatment on electroless nickel plating on high volume fraction SiCp/Al composite

    Institute of Scientific and Technical Information of China (English)

    张建云; 张灿铭; 李普同; 崔霞

    2014-01-01

    对高体积分数 SiCp/Al 复合材料进行前处理,再化学镀镍。研究了除油、粗化、活化对 SiCp/Al复合材料化学镀镍的影响。分析了镀镍层的显微组织。结果表明,有机溶剂除油比碱液除油效果好。H2 O2系粗化比 HF 系粗化更为适宜。在由醋酸镍、次亚磷酸钠和乙醇组成的活化剂中室温浸润,然后160℃温度下热还原30 min,化学镀镍镀速较高。前处理后在 SiCp/Al 复合材料表面化学镀镍可沉积上致密、均匀、结合良好的镀镍层。%The high volume fraction SiCp/Al composite was processed by pretreatment,then it was proceeded by electroless nickel plating.The influence of deoiling,roughening,activating on electroless nickel plating on SiCp/Al composite was investigated.The microstructure of electroless nickel plating on composite was ana-lyzed.The results show that organic solvent was better than alkaline solvent for deoiling.H2 O2 system was more appropriate than HF system for roughening.Infiltrating in activation solution consisted nickel acetate,so-dium hypophosphite and alcohol at room temperature,then thermo deoxidizing at 160 ℃ temperature for 30 min,the procedure makes electroless nickel plating rate higher.After pretreatment,electroless nickel plating deposited on SiCp/Al composite surface was dense,uniform,firmly combined.

  10. SiC颗粒化学镀铜工艺研究%Study on Technics of Electroless Copper Plating on SiC Particle

    Institute of Scientific and Technical Information of China (English)

    吴开霞; 王博

    2016-01-01

    化学镀铜在生产中应用比较广泛,但是在化学镀铜过程中的活化工艺所需试剂有毒,并且价格较为昂贵。探讨了取消化学镀铜过程中的活化工艺后,其他工艺条件对SiC镀铜效果的影响规律。经实验分析,获得了化学镀铜实验优化工艺参数为:化学镀铜溶液温度为35℃,溶液pH值用氢氧化钠调节至12~13,硫酸铜加入量为12 g/L,甲醛加入量为28 ml/L,酒石酸钾钠加入量为40 g/L,经过一定时间在碳化硅表面得到了良好的铜镀层。通过X射线衍射仪及扫描电镜检测,结果表明:取消了活化工艺后,在碳化硅表面仍然得到了较好的铜包覆层。%Chemical copper plating is widely applied in the production, but the reagent used in activation technology is toxic and expensive. The paper discussed the influence of the rule of other process conditions of electroless plating on SiC copper plating effect. The optimal process parameters of experiment by analyzing was that electroless copper plating solu-tion temperature was 35 ° C, the pH value of the solution was adjusted to 12 ~13 with sodium hydroxide, the amount of copper sulfate added to 12 g/L, the amount of formaldehyde added to 28 ml/L, sodium potassium tartrate added in an a-mount of 40 g/L, after a certain time, we will get a good copper plating layer on the silicon carbide surface. By EDS anal-ysis and scanning electron microscopy ( SEM) testing, the results show that the surface of the silicon carbide still gets the better copper plating layer without the activation process.

  11. 化学镀银黏胶纤维的制备及性能分析%Preparation and property analysis of silver electroless plated viscose fibre

    Institute of Scientific and Technical Information of China (English)

    刘俊丽; 林红; 陈宇岳

    2013-01-01

    Conductive viscose fibres were prepared by electroless plating of silver .Its characteristics such as surface morphology , chemical composition , crystal structure , structural change and thermal property were analyzed by using SEM , EDS, XRD, FTIR and TG.The mechanical properties and surface resistance of the silver plated viscose fibres were also measured .The results show that the structure and properties of viscose fibers have no obvious change after silver plating , and the silver plated on the surface is compact , combined with good fastness .%采用化学镀银方法,在黏胶纤维表面沉积银金属层,制备导电黏胶纤维。分别借助SEM、EDS、XRD、FTIR、TG等对纤维的表面形貌、镀层成分、结晶情况、结构变化、热性能进行分析,并测试纤维的力学性能和表面电阻。结果表明:镀银后黏胶纤维的结构和性能变化不大,表面覆盖的银单质层比较致密,且结合牢度好。

  12. Fe-Ni-B合金的化学镀和磁性能%Electroless plating and magnetic properties of Fe-Ni-B alloy

    Institute of Scientific and Technical Information of China (English)

    王森林

    2006-01-01

    Electroless Fe-Ni-B deposit was plated from the solution using potassium borohydride (KBH4) as a reducing agent, and sodium citrate and potassium sodium tartrate as complexing agents. The effects of plating conditions on the plating rate, the deposit composition, and the magnetic properties of the deposit were studied. Satisfactory stability of the plating solution and relative high iron content of the coating was achieved with this solution. The results show that the magnetic performances of the coating increase with the increase of the iron content of the deposit.%以硼氢化钾为还原剂,柠檬酸钠和酒石酸钾钠为络合剂的镀液中化学镀制备Fe-Ni-B合金.研究了沉积条件对沉积速率、镀层组成和磁性能的影响.结果表明,镀层的磁性能随着镀层中铁含量的增加而升高,并获得了具有良好稳定性的镀液体系和相对含铁量高的镀层.

  13. Design of a rack-vibration device for electroless nickel plating%化学镀镍挂架上下振动装置的设计

    Institute of Scientific and Technical Information of China (English)

    储荣邦; 王文龙; 李清泉; 朱传开

    2001-01-01

    在化学镀镍过程中,电脑硬盘驱动臂与挂架接触处易产生黑斑、气泡和脱皮现象。本文分析了产生上述故障的原因,设计了一种挂架上下振动装置,消除了上述故障。%Black spot, air bubble and scaling are usally produced during electroless nickel plating of computer hard disk drivers at the contact site with rack. Causes for the above mentioned defects were discussed. A rack vibration device has been designed to solve the problem.

  14. 纯铜化学镀Ni-Cu-P工艺的研究%A Study of Electroless Ni-Cu-P Plating on Pure Copper

    Institute of Scientific and Technical Information of China (English)

    陈益兵; 赵芳霞; 张振忠; 孙晓东

    2013-01-01

    Aiming at the problems of corrosion and boundary conductivity to be improved when pure copper is in the process of application, the surface of pure copper was modified by electroless Ni-Cu-P plating. The effects of electroless Ni-Cu-P plating process on the properties of pure copper were investigated by means of XRD, SEM, contact resistance test, corrosion test, etc.The results show that the process can obtain a typical amorphous cellular structure, the contact resistance of modified pure copper is 15 % ~ 30 % of that before modification, and the self-corrosion current density is decreased by two orders of magnitude.%针对纯铜使用过程中表面腐蚀及导电性需进一步提高等问题,采用化学镀Ni-Cu-P对纯铜进行表面改性.采用X射线衍射仪(XRD)、扫描电子显微镜(SEM)、界面接触电阻测试、极化曲线等手段,研究了化学镀Ni-Cu-P工艺对纯铜性能的影响.结果表明:该工艺能得到典型的非晶胞状结构,改性后纯铜的接触电阻为改性前的15 %~30%,自腐蚀电流密度降低两个数量级.

  15. Electroless plating of low-resistivity Cu–Mn alloy thin films with self-forming capacity and enhanced thermal stability

    Energy Technology Data Exchange (ETDEWEB)

    Chen, Sung-Te, E-mail: stchen@mail.hust.edu.tw [Department of Electronic Engineering, Hsiuping University of Science and Technology, Dali 412, Taichung, Taiwan (China); Chen, Giin-Shan [Department of Materials Science and Engineering, Feng Chia University, Seatwen 407, Taichung, Taiwan (China)

    2015-11-05

    Previous studies have typically used sputter deposition to fabricate Cu–Mn alloy thin films with concentrated solute additions which have exceeded several atomic percentages, and the electrical resistivity values of the resultant films from previous studies are relatively high, ranging from 2.5 to 3.5 μΩ-cm. Herein, we proposed a different approach by using electroless process to plate dilute Cu–Mn (0.1 at.%) alloy thin films on dielectric layers (SiO{sub 2}). Upon forming-gas annealing, the Mn incorporated into Cu–Mn films was segregated toward the SiO{sub 2} side, eventually converting itself into a few atomic layer thickness at the Cu/SiO{sub 2} interface, and forming films with a low level of resistivity the same as that of pure Cu films (2.0 μΩ-cm). The interfacial layer served as not only a diffusion barrier, but also an adhesion promoter that prevented the film’s agglomeration during annealing at elevated temperatures. The mechanism for the dual-function performance by the Mn addition was elucidated by interfacial bonding analysis, as well as dynamic (adhesive strength) and thermodynamic (surface-tension) measurements. - Highlights: • Electroless plating is proposed to grow dilute (0.1%) Cu–Mn films on SiO{sub 2} layers. • Adequate annealing results in a self-forming of MnO{sub x} at the Cu/SiO{sub 2} interface. • The role of interfacial MnO{sub x} as a barrier and adhesion promoter is demonstrated. • The treated dilute film has a low ρ level of pure Cu, in contrast to concentrated films. • Its potential as a single entity replacement of Cu interconnect is presented.

  16. Phytic acid activation prior to electroless nickel plating on magnesium alloy%镁合金化学镀镍前植酸活化工艺

    Institute of Scientific and Technical Information of China (English)

    王娟; 丁毅; 尹明勇; 马立群

    2012-01-01

    通过植酸活化可提高AZ31镁合金化学镀层的耐蚀性能.采用正交试验优化植酸活化工艺,利用金相显微镜观察了植酸膜的微观形貌,测定了植酸膜在质量分数为3.5%的NaCl溶液中的极化曲线及在化学镀镍液中的开路电位.结果表明,当植酸质量浓度为20 g/L、温度为50 ℃、pH=8时处理25 min,植酸膜具有良好的耐蚀性能,并且能够作为化学镀的活化层.%The corrosion resistance of AZ31 magnesium alloy can be improved by phytic acid activation. The phytic acid activation process was optimized through orthogonal test. The micro-morphology of phytic acid coating was observed by metallographic microscope, and its polarization curve in 3.5wt% NaCl solution and open circuit potential in electroless nickel plating bath were measured. The results showed that the phytic acid coating obtained with phytic acid 20 g/L at 50 ℃ and pH 8 for 25 min has good corrosion resistance and can be used as an activated layer for electroless nickel plating.

  17. Thermodynamic Analysis of Electroless Plating Nickel for 5383 Aluminum Alloy%5383铝合金表面化学镀镍的热力学分析

    Institute of Scientific and Technical Information of China (English)

    韩滔; 罗兵辉; 柏振海; 陈和兴; 张吉阜

    2013-01-01

    Electroless nickel plating was conducted on surface of 5383 cast state aluminum alloy with one time and two times zinc dipping process.Kinds of coatings were investigated with scanning electron microscopy (SEM),energy dispersive spectroscopy (EDS) analysis and X-ray diffraction (XRD) under the conditions of different pH value and temperature.According to the electrochemical corrosion experiment,the corrosion resistance of coating in 3.5wt% NaCl solution has been tested.According to thermodynamic analysis of the chemical plating nickel,the influences of the plating bath temperature and pH value to the coating were analyzed.The experimental results indicate that after two times zinc dipping process,the content of zinc became lower and the coating became well-distributed and denser,compared with 5383 aluminum alloy surface of the one time.The key reaction step of electroless nickel plating is H2→2Had.The pH value is the main factor of the thickness of electroless nickel plating.The content of P element under acidic conditions is higher than that under alkaline conditions,and the Ni-P alloy coating is amorphous phase.The corrosion resistance of nickel plating is optimal as the pH value is 4.5 and temperature is 90 ℃.%分别采用一次、二次浸锌工艺在5383铸态铝合金表面进行化学镀镍,并对不同镀液pH值和温度下形成的各种镀层进行了扫描电镜(SEM)观察、能谱分析(EDS)、X射线衍射(XRD)物相分析.通过电化学腐蚀实验对镀层在3.5%(质量分数)NaCl溶液的耐蚀性进行测试,采用热力学分析化学镀镍反应机理并研究施镀温度和镀液pH值对镀层的影响.结果表明,二次浸锌后5383铝合金表面的锌含量较一次浸锌更低而镀层更加均匀、致密;化学镀镍中的关键反应步骤为H2→ 2Had;其中pH值是影响化学镀镍层厚度的主要因素之一并且酸性条件下P的含量比碱性条件下要高许多,Ni-P镀层为非晶相;在pH=4.5、温度90℃

  18. 碳纳米管化学镀Ni-Co-P三元合金%Carbon Nanotubes Electroless Plating Ni-Co-P Ternary Alloy

    Institute of Scientific and Technical Information of China (English)

    王广征; 黄英; 孙晓峰

    2011-01-01

    为得到电磁性能优良的碳纳米管,采用化学镀的方法在碳纳米管表面镀镍-钴-磷三元合金.利用透射电镜(TEM)、能谱分析(EDS)、振动样品磁强计(VSM)对施镀后的碳纳米管进行表征,发现所得镀层完整、均匀,为软磁材料.碳纳米管化学镀Ni-Co-P三元合金的电磁参数研究表明,其吸波机理主要为磁损耗.%In order to obtain carbon nanotubes with excellent electromagnetic properties, Ni-Co-P ternary alloy were plated on the surface of carbon nanotubes. The carbon nanotubes were characterized with TEM, EDS and VSM after electroless plating, which show that the coating was complete, uniform and soft magnetic materials. The electromagnetic nanotubes plated with Ni-Co-P ternary alloy have show that the absorbing mechanism was magnetic loss.

  19. Preparation and properties of silver electroless plated PET fabrics%化学镀银涤纶织物的制备及其性能

    Institute of Scientific and Technical Information of China (English)

    徐文龙; 熊杰; 徐勤; 刘志才; 焦玉雪; 陈虎

    2011-01-01

    利用化学镀方法制备镀银电磁屏蔽涤纶织物.分别采用场发射电镜( FE-SEM)、电子能谱(EDS)和X射线衍射(XRD)表征镀层的表面形貌、成分和结晶情况;考察了织物的厚度、增重率、耐摩擦色牢度、表面电阻、抗静电性、拉伸断裂强力、断裂伸长率、刚柔性、悬垂性以及透气性.结果表明:镀层为高纯度立方面心结构的单质银;化学镀银后织物的抗静电性能、拉伸断裂强力、断裂伸长率、抗弯刚度及悬垂性增加,而透气性下降;耐摩擦色牢度随着增重率的增加而减小,增重率为35%时,织物的耐摩擦色牢度和导电性均比较优越.%Electromagnetic shielding poly ( ethylene terephthalate) ( PET) fabrics were prepared by electroless plating of silver. The silver plated fabrics were characterized by surface morphology, chemical composition and crystal structure using FE-SEM, EDS and XRD. An investigation of thickness, mass gain, color fastness to rubbing, surface resistance, anti-static property, tensile strength, breaking elongation, stiffness, draping and air permeability of PET fabrics before and after electroless plating of silver. The Results revealed that the metal-layer is high purity sliver with face cubic central structure. Sliver plated polyester fabric has higher anti-static property, tensile strength, elongation, stiffness, and draping, but lower air permeability. The color fastness to rubbing decreases with the increase of mass gain. The fabrics show good color fastness to rubbing and conductivity when the mass gain 35% .

  20. Application of electroless nickel plating prior to sulfate copper electroplating%化学镀镍作为钢酸性镀铜前处理工艺的应用研究

    Institute of Scientific and Technical Information of China (English)

    黄元盛

    2012-01-01

    In order to avoid copper replacement reaction during sulfate copper electroplating on steel surface, electroless nickel plating process was introduced as the pretreatment of electroplating. The effect of electroless nickel plating on sulfate copper electroplating was studied. The results show that there is no copper precipitation on the surface of steel samples electroless nickel plated at least for 6 min after dipping in sulfate copper electroplating solution for 10 min. The effects of electroless plating coating on the both the surface appearance and the adhesion of copper coating are not obvious, so the eleetroless nickel plating can be used for the pretreatment of sulfate copper electroplating.%为了防止钢表面酸性电镀铜出现置换铜,采取在电镀铜前增加化学镀镍工序,研究了化学镀镍工艺对酸性电镀铜的影响。结果表明,化学镀镍时间超过6min时(镍层厚度〉2.5-3μm),工件在酸性镀铜液中浸泡10min,无置换铜出现。化学镀镍层对后续的酸性镀铜层的表面形貌和附着力均无明显影响,表明化学镀镍可作为钢酸性镀铜的底层。

  1. Study on the Process of Electroless Copper Plating on SiCp%SiCp表面化学镀铜工艺研究

    Institute of Scientific and Technical Information of China (English)

    陈曙光; 丁厚福; 郑治祥; 刘君武

    2001-01-01

    Because of its excellent properties, such a s high strength, highmodule, wear resisting, etc, SiCp is added to metal-matrix composite as a reinforce particle. In this present work, the process of electroless copper plating on SiCp was optimized with orthogonal experiments, and SiCp covered with electroless co pper coating was obtained. The relationship between the increasing mass percenta ge of SiCp, the pH value of the bath and the time was studied, meanwhile, the su rface morphology of deposited coating was measured by scanning electron microsco pe (SEM). As the results show, the pH value and the concentration of Ni2+ have a strong influence on the deposition rate, the particles are fine dispersed, and the surface of deposited coating is uniform.%SiCp因其高强度、高模量、耐热、耐磨、耐高温等性能而被作为颗粒增强体制备金属基复合材料。本文用正交法优化了SiCp表面化学镀铜工艺,获得了Cu包覆SiCp,测定了SiCp的增重百分率及镀液的pH值随时间的变化规律,并对镀覆层形貌进行了SEM考察。结果表明,镀液的pH值及Ni2+浓度对镀速影响最为显著;粒子分散很好、镀层均匀。

  2. The Problems and Solutions of Electroless Plating Nickel Gold in PCB Technology%化学镀镍金技术在PCB应用中的问题及解决办法

    Institute of Scientific and Technical Information of China (English)

    薛杉; 黄兆丰; 薛贝

    2011-01-01

    简单介绍了化学镀镍金工艺过程中容易出现的镀层问题,渗镀,漏镀问题及镀后印制电路板的处理等问题,根据本公司在生产过程中的经验,提出了一些可供参考的解决方案。%The problem of seepage plating,plating leakage and treatment of PCB after plating in the electroless nickel gold process was introduced.Several reference solutions according to the company's experience in the production process were proposed.

  3. 化学镀镍施镀过程稳定性分析%Evaluation on Plating Stability in Electroless Nickel Deposition

    Institute of Scientific and Technical Information of China (English)

    陈月华; 刘永永; 江德凤; 袁礼华

    2013-01-01

    Based on the action mechanism of electroless nickel deposition, the factors affecting the stability of the plating solution, such as salinity ( nickelous sulfate and sodium hypophosphite) , pH value, temperature and operating methods were analyzed. It is indicated that when the concentration of Nickel and hypophosphite acid is 5. 8 g/L and 17.4 g/L respectively, and pH value is 4. 4, the best plating stability can be achieved under 82 ℃.%以化学镀镍反应机理为依据,针对一种酸性化学镀镍体系,就主盐浓度(硫酸镍)、还原剂(次磷酸钠)、pH值、温度等因素对施镀过程中镀液稳定性的影响进行了分析.结果表明:在Ni2+质量浓度5.8 g/L、H2PO2-质量浓度17.4 g/L、pH值4.4、温度82℃的条件下施镀,化学镀镍施镀过程稳定性最佳.

  4. Regeneration of spent electroless nickel plating bath by electrodialysis%电渗析法再生化学镀镍废液工艺

    Institute of Scientific and Technical Information of China (English)

    何湘柱; 赵雨; 赵国鹏

    2011-01-01

    The electrodialysis technique was used to treat the wastewater of electroless nickel plating, and the effect of three technical conditions including current density, aging liquid pH and flow rate on the removal (loss) rate of various ions was mainly studied. The optimal process conditions are obtained as follows: current density 65 mA/cm2, pH = 4.5 and flow rate 1 L/45 s, and the performance of the regenerated bath were tested. Results indicated that the plating speed, phosphorus content and hardness had been reach thc production level of the third period, and the anti-tarnish property and salt spray test meet the requirements of production.%采用电渗析法处理化学镀镍废液,重点考察了3种工艺条件(电流密度、老化液pH、流量)对各种离子去除(损失)率的影响,得出优化的工艺条件为:J= 65 mA/cm2,pH=4.5,v=1 L/45 s.对再生镀液的性能进行了测试.结果表明,其镀速、镀层磷含量和显微硬度均达到第三周期的生产水平,耐色变性与盐雾试验符合生产需求.

  5. 桐木板材表面化学镀镍工艺的研究%Electroless Nickel Plating on Surface of Paulownia Wood

    Institute of Scientific and Technical Information of China (English)

    刘西德

    2015-01-01

    The operating methods, the process and the influence of several factors on nickel-plating on the surface of ordinary paulownia wood were studied. Then the combination strength between chemical coating and paulownia wood was tested, the process and the optimum conditions were determined finally. The quality of electroless nickel-plating was good when the paulownia wood were pretreated, sensitized and activated, the pH=8.0, the reaction temperature was 65℃and the reaction time was 40 min.%实验研究了桐木板材表面化学镀镍的操作方法和工艺条件,讨论了各种操作因素对镀层质量的影响,试验了化学镀层与镀件基体的结合力,确定了桐木板材化学镀镍的工艺流程和控制条件。实验结果表明,桐木板材经过预处理及敏化、活化处理后,化学镀镍溶液的pH值控制在8.0,镀镍温度控制在65℃,反应时间40min,桐木板材表面可以得到较好的金属镀层。

  6. 聚酯材料表面化学镀镍的研究%Research on Electroless Nickel Plating on Surface of Polyester Material

    Institute of Scientific and Technical Information of China (English)

    刘建升

    2014-01-01

    研究了聚酯材料表面化学镀镍的实验操作方法、工艺控制条件,讨论了各种因素对镀层质量的影响,确定了聚酯材料表面化学镀镍的工艺流程和最佳实验条件。实验结果表明,聚酯材料经过预处理及敏化、活化处理后,化学镀镍溶液的pH值控制在5.5,镀镍温度在45℃,反应时间25min,可以得到较好的聚酯材料化学镀镍镀层。%The operating methods and condition of electroless nickel plating on surface of the polyester material were studied,influ-ence factors of nickel-plating on the surface of the polyester material were discussed.Then the combination strength between chemi-cal coating and polyester material was tested,the best process and optimum conditons were finally determined. The results showed that the optimum conditions were as followed:pH=5.5,the nickel plating temperature 45℃and the reaction time 10~20min. Under the above conditions,good nickel-plating coating on surface polyester material after pretreatment,sensitization and activation could be gained.

  7. Ni-P化学镀层表面黏液形成菌微生物污垢特性%Microbial fouling characteristics of slime-forming bacteria on the surface of electroless plating of Ni-P

    Institute of Scientific and Technical Information of China (English)

    武霖; 姚响

    2015-01-01

    A new experiment was designed to investigate microbial fouling characteristics on heat exchanger of electroless plating of Ni-P. In this paper,the surface of low-carbon steel sheet,which is common for heat exchanger,was modified by using the method of electroless Ni-P and low-carbon steels before and after electroless Ni-P,and pictures were taken by scanning electron microscopy. A comparative experiment was designed to investigate microbial fouling characteristics of low-carbon steel sheet and low-carbon steel sheet with electroless plating of Ni-P. Slime-forming bacteria that was isolated and purified from Songhua River is chosen as the strains. The changes of fouling were recorded by the method of weighing,and the changes of bacterial counts were recorded by the method of optical turbidity. The results of the experimental show that the surface morphology of electroless plating of Ni-P is better than that of low-carbon steel after the low-carbon steel sheet was electroless plated. For the corrosion caused by slime-forming bacteria,the corrosion resistance of electroless plating of Ni-P is better than that of low-carbon steel sheet and the anti-microbial fouling of electroless plating of Ni-P is preferred. When the slime-forming bacteria grew and reproduced vigorously and metabolites were excessive,biofouling was formed soon; in contrast,biofouling was formed slowly.%为了研究化学镀Ni-P换热器上黏液形成菌微生物污垢的特性,利用化学镀Ni-P的方式对低碳钢表面进行改性。采用微生物污垢对比实验,对低碳钢片和具有Ni-P镀层低碳钢片拍摄扫描电镜图,利用称重法记录污垢变化情况和光电比浊法记录黏液形成菌的数量变化情况。结果表明,Ni-P 镀层表面形貌明显好于低碳钢;Ni-P镀层相比于碳钢具有很好的耐蚀性和抗微生物污垢特性;黏液形成菌生长繁殖旺盛和细菌代谢产物多时,微生物污垢的形成就快。相反,微生物污垢形成就慢。

  8. Effect of Heat Treatment on Structure and Magnetic Performance of Ni-Fe-P Alloy Obtained by Electroless Plating

    Institute of Scientific and Technical Information of China (English)

    WANG Sen-lin; ZHANG Yong

    2005-01-01

    The electroless deposition of Ni68-Fe10.5-P21.5 alloy has been investigated. The crystallization behavior of the deposit was comparatively studied by using differential scanning calorimetry and X-ray diffractometry. The deposit transforms into a square Ni3P phase at 380.0 ℃, then changes into a cubic FeNi3 phase at 490.0 ℃. The microhardness,the size of the formed grains and the magnetic performance of the deposit increase with the increase of the heat treatment temperature below 500 ℃, then they decrease after this temperature. The effect of heat treatment time at 500 ℃on the surface micromorphology, the structure and the magnetic performance of the deposit were also studied. The resuIts show that with the increase of heat treatment time, the extent of crystallization of the deposit increases and the size of the formed grains becomes uniform. The results also show that the magnetic performance of the deposit under heat treatment for 40 min is maximal and then decreases with the increase of heat treatment time. The property change of the deposit is related to the crystal structure and the size of the formed grains of the deposit.

  9. Technological study of Ni-P-PTFE electroless composite plating%化学复合镀Ni-P-PTFE的工艺研究

    Institute of Scientific and Technical Information of China (English)

    冯婧

    2014-01-01

    Ni-P-PTFE electroless composite plating on differ-ent parameters and studying the effect of PTFE content in the coat-ing. The results show that PTFE content in the coating reached a peak with the increase of different technological parameters of surfac-tants concentration, temperature and stirring speed. Too large or too small about the the technological parameters is bad for the adsorp-tion of the PTFE particles.%在不同的工艺参数下进行化学复合镀Ni-P-PTFE,研究了工艺参数对复合镀层PTFE含量的影响。结果表明,随工艺参数表面活性剂含量、温度和搅拌速度的增加,镀层中PTFE的含量都会达到一个峰值,工艺参数过大或过小,都不利于镀层PTFE粒子的吸附。

  10. Electroless Silver Plating on Hollow Glass Microsphere Modified by Silane Coupling Agent%空心玻璃微珠偶联化学镀银的研究

    Institute of Scientific and Technical Information of China (English)

    朱国庆; 文力; 张辉

    2012-01-01

    Surface of hollow glass microsphere was firstly modified by silane coupling agent, and then applying electroless silver plating directly. Surface morphology and structure of the coating were characterized by FTIR, SEM and XRD techniques. Results showed that compared with the colloidal palladium activation and silver ammonium solution activation methods, this silane coupling method could result in a uniform and compact coating with superior conductivity, higher adhesion and better silver utilization.%使用氨丙基三乙氧基硅烷偶联剂改性空心玻璃微珠表面,然后直接实施化学镀银,借助红外光谱、扫描电镜和X-射线衍射测试手段对偶联改性效果、镀层表面形貌和结构进行了表征.测试结果表明,与胶体钯活化法和硝酸银活化法化学镀银相比,空心玻璃微珠偶联表面改性直接化学镀银的镀层更为致密、均匀,银利用率高,导电性好,结合力强.

  11. Parameters optimization of high stability bath for electroless copper plating%高稳定性化学镀铜液的参数优化

    Institute of Scientific and Technical Information of China (English)

    杨超; 陈金菊; 冯哲圣; 王大勇; 薛文明

    2014-01-01

    The stability of bath, the speed and the brightness of coating were taken as indexes to optimize the bath of electroless copper plating through the single factor experiment method. Electrochemical test of plating solution was done to study the influence of additives on polarization performance of bath. The stability of solution decreases with the concentration of CuSO4·5H2O and HCHO increasing. The addition of appropriate complexing agent and stabilizers can effectively increase the stability of the plating solution. The copper deposition rate reaches to 4.93μm/h for plating 30 min. The stable time of plating bath is more than two hours in 80℃ water bath. Copper layer appears shiny pale pink, and copper particles are close together. The magnitude of copper layer resistivity is 3.67×10-8Ω·m. The adhesion strength between copper layer and substrate is up to 10 N/mm2.%采用单因素实验法,以镀液稳定性、镀速及镀层光亮度为指标,优化了化学镀铜液参数以提高镀液稳定性,并研究了添加剂对镀液电化学极化性能的影响。试验结果表明:随着CuSO4·5H2O和HCHO浓度的增加,镀液稳定性有所下降;适量的络合剂和稳定剂的加入能有效提高镀液稳定性。采用优化后的镀液施镀30 min,镀速为4.93μm/h;施镀后的镀液在80℃水浴中的稳定时间大于2 h;所得铜层为具有金属光泽的淡粉红色,铜颗粒排列紧密;镀铜层电阻率低至3.67×10-8Ω·m,铜层与基体之间的附着强度提高至10 N/mm2。

  12. 硬质合金化学镀Ni/Co-P-Ag复合涂层工艺研究%Hard Alloy Electroless Plating Ni/Co-P-Ag Composite Coating

    Institute of Scientific and Technical Information of China (English)

    陈晓琼; 张怀清; 王金芳; 涂志标

    2016-01-01

    通过化学镀方式在经过清洗、粗化、活化的硬质合金表面镀覆了Ni/Co-P-Ag涂层。通过观察涂层的组织形貌,测试涂层的物理化学性能的方法研究了不同预处理工艺对化学镀Ag的影响,得到最佳的化学镀Co-P-Ag预处理方案。经过大量实验研究发现,通过预镀钴不仅能得到均匀的镀银涂层,化学镀Ag层还具备较好的结合力。%Ni/Co-P-Ag alloy film was deposited on the surface of cermet by electroless plating after cleaning, roughening and activation. Study the effects of different ways of Ag plating pretreatment by seeing the morphology of coating and testing the physical and chemical properties of coating, and the best Co-P-Ag plating pretreatment was obtained. Through large numbers of tests, we found that having a pre-cobalt layer before silver-plating could get a uniform coating, and the electroless silver plating layer has a forceful adhesion of the silver to the basis metal.

  13. 化学镀镍电磁屏蔽单板的表面特性研究%Surface characteristics of electroless nickel plated electromagnetic shielding wood veneer

    Institute of Scientific and Technical Information of China (English)

    王立娟; 李坚; 刘一星

    2005-01-01

    木材是一种导电性极差的天然多孔性材料.为了制造具有导电性和电磁屏蔽性能的木质材料,使用了化学镀镍的方法在木材表面获得Ni-P合金镀层.利用扫描电镜观察了镀后木材单板的表面形貌,利用能谱分析和X-射线衍射分析技术分别研究了不同条件下的所得镀层的表面成分和结构,同时还测定了相应的表面电阻率和电磁屏蔽效能.从而探讨了镀层中磷含量与镀层结构、镀后单板的导电性和电磁屏蔽效能的关系.通过扫描电镜图片可以看到镀镍单板表面完全被镀层覆盖,使其具有极强的金属感.研究结果还表明,随着镀层中P含量的降低,镀层的微结构向晶态结构转变,且导电性和电磁屏蔽性能逐渐提高.当P含量低于2.37%时,镀层为晶态结构,表面电阻率和电磁屏蔽效能分别约为0.5Ω/□ 和55-60dB.图8表1参11.%Wood is a kind of porous natural material with very poor electro-conductivity, and it has almost no function of electromagnetic shielding. The method of electroless nickel plating was used to produce wooden material with electrical and effective electromagnetic shielding properties. Ni-P alloy layer was obtained on wood surface. The surface feature of plated wood veneer was observed by SEM and the surface composition and microstructure of the layer under different conditions were investigated by EDS and XRD respectively. Meanwhile, the relevant surface resistivity and electromagnetic shielding effectiveness were measured. Correlations of the phosphorous content in the layer to the structure of Ni-P alloy, electro-conductivity and electromagnetic shielding of plated veneers were discussed. SEM photos showed that the surface of electroless nickel plated veneers were covered with Ni-P alloy layer entirely,which made wood veneers more like metal. At the same time, the results showed that with the decreasing of the phosphorous content in the layer, the microstructure of Ni

  14. The relationship between stabilizer and copper deposition rate in the electroless copper plating solution%化学镀铜溶液中稳定剂与铜沉积速率的关系

    Institute of Scientific and Technical Information of China (English)

    秦建芳; 姚陈忠; 孙鸿

    2012-01-01

    It was researched for stabilizer on the copper deposition rate in the electroless copper plating solution. It was fully consider for main complexing agent, side effects of inhibitors and formaldehyde capture agent which concentration of electroless copper plating. The base formula as copper sulfate 3 g/L, formaldehyde 8 g/L, ethylenediamine tetraacetic acid 28 g/L, sodium hydroxide 7.5 g/L, the process parameters were temperature being 50℃, the pH value being 12.5 and plating time being 40 min. The a-mount of the three types of stabilizers were determined for methanol 8 mg/L, potassium ferrocyanide 6 mg/L bipyridyl. The coating obtained under the optimal technical conditions was Hongliang appearance, surface roughness, grain size and detailed electroless copper plating solution stability.%研究了化学镀铜溶液中稳定剂对铜沉积速率的影响,着重考虑主配位剂、副反应的抑制剂、甲醛捕获剂对化学镀铜的影响.结果表明,在基本配方8 g/L CuSO4·5H2O,3 g/L HCHO,28 g/L EDTA,7.5 g/L NaOH,工艺参数pH=12.5,温度50℃,时间40 min的基础上,各种稳定剂的适宜用量为6 mL/L CH3OH、8 mg/L K4Fe(CN)6、6 mg/L2,2’-bipy.在最佳工艺下得到的镀层外观红亮,表面平整,晶粒细致,化学镀铜液稳定.

  15. 玻璃表面低磷化学镀镍研究%Electroless Nickel Plating of Low-Phosphorous on Glass

    Institute of Scientific and Technical Information of China (English)

    刘敏基; 胡志超; 丁毅; 秦铁男

    2011-01-01

    采用正交实验优化了玻璃表面低磷化学镀镍工艺,获得的最优组成为:柠檬酸钠15 g/L,氯化铵20 g/L,次磷酸钠30g/L,pH值8.采用扫描电镜(SEM)、能谱成分分析(EDS)和X射线衍射(XRD)等方法对镀镍层的表面形貌、镀层成分及物相结构进行了分析.结果表明:在最佳组成条件下所得的镀层具有致密的胞状组织,磷的质量分数为1.78%,属于低磷镀层,镀层为微晶态结构.%The process for electroless nickel plating of low-phosphorous on glass was optimized by orthogonal experiment. The optimal parameters obtained are: sodium citrate 15 g/L, ammonium chloride ZO g/L, sodium hypophosphite 30 g/L, pH 8.The morphology, composition and phase structure of the Ni-P deposit were analyzed by the XRD, SEM and EDX techniques.The results show that the Ni-P coating obtained under the optimal conditions has a compact cellular structure, of which the phosphorus mass fraction is 1. 78 %, belonging to low-phosphorous coating with a microcrystalline structure.

  16. Current Statues of the Wear Resistance of Electroless Ni-P Based Alloy Plating%化学镀镍磷基合金镀层耐磨性的研究进展

    Institute of Scientific and Technical Information of China (English)

    刘宏; 卞建胜; 李莎; 张彪

    2012-01-01

    化学镀镍磷基合金镀层因硬度高、厚度均匀及耐磨性优异,在工业中得到了广泛应用.简述了化学镀镍磷基合金从二元、三元到复合镀层的发展历程,概述了化学镀镍磷基合金镀层耐磨性的影响因素——合金镀层的化学成分、镀层与基体间的结合力及镀层硬度,并从这三方面论述了改善耐磨性的方法,最后提出了在改善合金镀层耐磨性研究中存在的问题和未来的发展方向.%Electroless Ni-P based alloy platings have found extensive application in industry because of its high hardness, uniform thickness and excellent wear resistance. The development of the electroless Ni-P based alloy platings, from binary and tenary alloy coatings to composite coatings, was summarized, and the influence factors of the wear resistance were presented from the chemical composition of alloy coating, the combining power between coating and matrix and the hardness of coating, as well as current status of improving the wear resistance of electroless plated Ni-P based alloys. At last, the problem exiting in the research of improving the wear resistance of alloy coating and the future research orientation were raised.

  17. 化学镀黑镍工艺特点和镀膜性能及其应用%Characteristic and Properties of Electroless Blackening-nickel Plating and Its Application

    Institute of Scientific and Technical Information of China (English)

    高进; 孙金厂

    2001-01-01

    介绍了化学镀黑镍工艺及其镀膜性能。试验表明化学镀黑镍可以增加材料表面硬度、耐磨性和耐蚀性,并具有良好的装饰性能和工艺性能。%Are introduced the electroless blackening-nickel plating technology and its properties.It can improve surface hardness,wear resistance and corrosion-resistance of metals,and has good technology and decoration properties.

  18. Development of nanoscale Ni-embedded single-wall carbon nanotubes by electroless plating for transparent conductive electrodes of 375 nm AlGaN-based ultraviolet light-emitting diodes

    Science.gov (United States)

    Park, Jun-Beom; Park, Hyung-Jo; Bae, Hyojung; Jeong, Tak; Han, Jong-Hun; Kwak, Joon Seop; Ha, Jun-Seok

    2016-08-01

    We propose a nanoscale Ni-embedded single-wall carbon nanotube (SWCNT) composite for transparent conductive electrodes (TCEs) of AlGaN-based ultraviolet light-emitting diodes (UV LEDs). TCEs specifically for the ultraviolet region were developed using Ni selectively electroless-plated SWCNTs. The nanoscale Ni of TCEs improved electrical conductivity and formed ohmic contact with p-GaN while minimizing transmittance loss. We applied Ni-embedded SWCNTs, SWCNTs, and Ni/Au to the TCEs of 375 nm UV LEDs. UV LEDs with Ni-embedded SWCNTs showed a 32% higher output power than UV LEDs with conventional Ni/Au TCEs.

  19. Study of Cyanide-free Electroless Gold Plating for Patterned Circuits with Fine-pitch%细间距图形电路无氰化学镀金工艺研究*

    Institute of Scientific and Technical Information of China (English)

    刘东光; 胡江华

    2013-01-01

    Commercial cyanide-free electroless Gold Plating technology used to deposit gold film on patterned circuits with fine-pitch(50 µm/50 µm). Investigated results indicated the thickness of gold film up to 2 µm, the film surface is smooth, and no gold coating spill over. New electroless gold plating progress as one of the weld surface treatment technology, can be used to selective area plating, has contact conductive, good bonding performance, and can compatible with various solder. This technology has the significance for the fine-pitch patterned circuits.%  采用市售无氰化学金工艺在线宽/间距(50µm/50µm)精细图形电路表面化学镀金。镀层表面均匀一致,厚度可达2µm以上,无镀金层溢出现象。新的化学镀金工艺作为微带板可焊性表面处理技术之一,兼具可选择区域镀、可接触导通、良好的键合性能,能兼容各种助焊剂,对于细间距图形电路表面处理具有十分重要的意义。

  20. N,O-羧甲基壳聚糖在导电涤纶织物化学镀中的应用%Application of N,O-carboxymethyl chitosan in conductive polyester fabrics with electroless plating treatment

    Institute of Scientific and Technical Information of China (English)

    吴建文; 俞丹; 王炜

    2011-01-01

    对壳聚糖引入羧基制备改性N,O-羧甲基壳聚糖(NOCC),因其有良好的水溶性,可采用浸轧法处理在涤纶织物上,利用其在活化过程中吸附贵金属钯引发之后的化学镀,获得致密、均匀的金属镀层,赋予织物导电性和电磁屏蔽效能.采用红外图谱(FT-IR)和1℃核磁共振谱图对NOCC进行表征,并用SEM图观察了经NOCC处理后和化学镀后导电涤纶织物的纤维表面形貌.%Chitosan was modified with carboxyl to produce N,O-carboxymethyl chitosan (NOCC). Due to good water solubility, NOCC was treated on the polyester (PET) fabrics through padding method, which adsorbed precious palladium metal in the activation process and catalyzed the electroless plating process. Accordingly, compact and even metal plating was obtained, which endowed the fabric with electrical conductivity and electromagnetic shielding property. The structure of NOCC was characterized by FT-IR and 13C-NMR. The morphology of electrical conductive polyester fabric treated by NOCC and electroless plating was observed by SEM.

  1. Study on the Additive for Electroless Copper Plating Taking the Potassium Sodium Tartrate as the Main Complexing Agent%以酒石酸钾钠为主络合剂的化学镀铜添加剂研究

    Institute of Scientific and Technical Information of China (English)

    肖友军; 许永章

    2012-01-01

    It studied the additive for electroless copper plating taking potassium sodium tartrate as complexing agen, and discussed the effect of CH3OH, K4[Fe(CN)6] ? 3H2O,2,2 -bipyridine on the stability of plating bath, the quality of electroplating layer, the deposition rate of plating, to determine the amount of additive. The results indicate that the optimal conditions of the electroless copper plating system as follows: CH3OH is 14 ml/L, K4 [Fe(CN)6] ? 3H2O is 30 mg/L,2,2'-bipyridine is 5 mg/L,plating 30 min in the bath, the copper deposition rate reaches 4. 6 μm/h,e-lectroplating layer appears shiny pale pink, and stability of plating bath is optimal, electroplating layer has good adhesion.%研究了以酒石酸钾钠为主络合剂的化学镀铜添加剂,讨论了甲醇、亚铁氰化钾、2,2'-联吡啶三种添加剂对镀液稳定性、镀层质量、沉积速率的影响,通过正交试验确定了各添加剂的用量.实验结果表明:在酒石酸钾钠为主络合剂的化学镀铜液中添加14mL/L甲醇、30mg/L亚铁氰化钾和5mg/L2,2’-联吡啶,化学铜沉积30min后,沉积速率可达到4.6μm/h.在此工艺条件下,镀层呈现带光泽的淡粉红色,镀液稳定性佳,镀层附着力好.

  2. 化学镀Ni-P合金在铝合金表面强化上的应用%Application of Electroless Plating Ni-P Alloy on Aluminium Alloy

    Institute of Scientific and Technical Information of China (English)

    朱晓云; 郭忠诚; 翟大成

    2001-01-01

    研究了化学镀镍-磷合金的性能,结果表明,热处理温度对镍-磷合金镀层硬度和耐磨性有较大的影响,二者经400℃×1 h热处理后达到峰值;镍-磷合金在酸、碱、盐介质中的耐蚀性优于1Cr18Ni9Ti不锈钢。应用结果证明,化学镀Ni-P合金在铝合金零部件上具有广泛的应用前景。%Properties of electroless plating Ni-Palloy have been studied, the results show that heattreatment temperature has a considerable effect onthe hardness and wear resistance of Ni-P alloy, andthey reach peak value after heat treatment at 400 ℃X 1h. Corrosion resistance of Ni-P alloy in acid,alkaline and salt media is superior to that of1Cr18Ni9Ti stainless steel. The electroless platingNi-P alloy has a wide application for the componentof aluminium alloy.

  3. 化学镀非晶镍-磷合金分形分析%Fractal analysis on electrolessly plated amorphous nickel-phosphorus alloy

    Institute of Scientific and Technical Information of China (English)

    翁星星; 朱贤博

    2012-01-01

    Four Ni-P alloy coatings with different phosphorus contents were prepared by changing the concentration of sodium citrate as complexing agent in an electroless nickel plating bath consisting of NiSO4-6H2O, NaH2PO2-H2O, Na3C6H5O7, CH3COONa, and KIO3. The fractal dimension of the coating surface was calculated by projective covering method. The relationship between fractal dimension, sodium citrate concentration, and corrosion resistance in nitric acid was studied. The results showed that the fractal dimension is between 2.329 8 to 2.658 6 for the coatings, and has a good positive linear correlation with sodium citrate concentration but a negative linear correlation with corrosion weight loss in nitric acid. The quantitative characterization of corrosion resistance of coating by surface fractal dimension is feasible.%在由NiSO4·6H2O、NaH2PO2·H2O、Na3C6H5O7、CH3COONa和KIO3组成的化学镀镍液中,改变配位剂柠檬酸钠的浓度制备了4种不同含磷量的Ni-P合金镀层,用投影覆盖法计算了其表面分形维数,并考察了分形维数与柠檬酸钠浓度及镀层耐硝酸性能的关系.结果表明,镀层的表面分形维数介于2.329 8~2.6586之间,与柠檬酸钠浓度具有良好的线性正比关系,而与镀层在硝酸中的腐蚀失重量呈良好的线性负相关.因此,表面分形维数可用于定量表征镀层的耐蚀性.

  4. 化学镀镍法制备Ni/石墨烯%Synthesis of Ni/graphene sheets by an electroless Ni-plating method

    Institute of Scientific and Technical Information of China (English)

    胡庆华; 王玺堂; 陈浩; 王周福

    2012-01-01

    Ni/graphene sheets were synthesized from graphene oxide sheets using electroless Ni-plating in a NiSO4 solution,with NaBH4 as a reducing agent.The samples were characterized by X-ray diffraction,scanning and transmission electron microscopy.Ni deposited on the surface of the reduced graphene oxide sheets had a high dispersion without aggregation,although the amount of Ni was as high as 32.9% by mass.,The stacking of Ni/graphene sheets resulted in the formation of meso- and macropores.Nitrogen adsorption showed that the meso- and macropores had a slit shape and that the Brunauer-Emmett-Teller specific surface area reached 91 m2/g.The average pore size calculated by the BarretJoyner-Halenda method from desorption studies was 3.83 m,with a pore volume of 0.28 cm3/g.%采用化学镀镍方法,以氧化石墨烯薄片为基体、NaBH4为还原剂,在NiSO4溶液中制备了Ni/石墨烯.通过X射线衍射、场发射扫描电镜和透射电镜对样品进行了表征,结果表明:沉积在石墨烯片表面Ni的的质量分数高达32.9%时,仍具有高度的分散性;相互堆积Ni/石墨烯片形成了介孔和大孔.氮气等温吸附表明:其介孔和大孔为狭缝型结构,孔的Brunauer-Emmett-Teller比表面积为91 m2/g;吸附支的Barret-Joyner-Halenda平均孔径为3.83nm,孔容为0.28 cm3/g.

  5. Vapour Treatment Method Against Other Pyro- and Hydrometallurgical Processes Applied to Recover Platinum From Used Auto Catalytic Converters

    Institute of Scientific and Technical Information of China (English)

    Agnieszka FORNALCZYK; Mariola SATERNUS

    2013-01-01

    Today more and more cars are produced every year.All of them have to be equipped with catalytic converters,the main role of which is to obtain substances harmless to the environment instead of exhausted gases.Catalytic converters contain platinum group metals (PGM) especially platinum,palladium and rhodium.The price of these metals and their increasing demand are the reasons why today it is necessary to recycle used auto catalytic converters.There are many available methods of recovering PGM metals from them,especially platinum.These methods used mainly hydrometallurgical processes; however pyrometallurgical ones become more and more popular.The article presents results of the research mainly concerning pyrometallurgical processes.Two groups of research were carried out.In the first one different metals such as lead,magnesium and copper were used as a metal collector.During the tests,platinum went to those metals forming an alloy.In other research metal vapours were blown through catalytic converter carrier (grinded or whole).In the tests metals such as calcium,magnesium,cadmium and zinc were applied.As a result white or grey powder (metal plus platinum) was obtained.The tables present results of the research.Processing parameters and conclusions are also shown.To compare efficiency of pyrometallurgical and hydrometallurgical methods catalytic converter carrier and samples of copper with platinum obtained from pyrometallurgical method were solved in aqua regia,mixture of aqua regia and fluoric acid.

  6. 主盐对镁合金表面化学镀Ni-B合金性能的影响%Effects of Primary Salt Concentration on Property of Electroless Plating Ni-B Alloy on Mg Alloy Surface

    Institute of Scientific and Technical Information of China (English)

    苌清华; 苌真真; 盛俊豪; 彭叠

    2011-01-01

    The effects of the concentration of primary salt on the property of electroless plating Ni-B alloy on Mg alloy surface were studied. The effects of salt concentration on the plating speed, morphology and corrosion resistance of the coating were emphatically discussed. The results show that, when the concentration of nickel chloride is 30g/L, the plating speed is maximum, the microstructure of the plating is small, uniform and compact, the plating has good corrosion resistance.%主要研究镀液中主盐浓度对镁合金表面化学镀Ni-B合金性能的影响,着重探讨主盐浓度对镀速、镀层形貌及耐腐蚀性的影响.结果表明:当氯化镍浓度为30g/L时,镀速最大且镀层组织均匀、紧凑、细小,耐腐蚀性较好.

  7. Preparation of nano-nickel colloid and its application to activation of electroless plating of fabrics%纳米镍胶体的制备及其在织物化学镀活化中的应用

    Institute of Scientific and Technical Information of China (English)

    赖冬志; 陈文兴

    2012-01-01

    为制备可在织物化学镀铜上使用的经济实惠的胶体镍活化液,在酸性条件下,以聚乙烯吡咯烷酮为稳定剂,采用硼氢化钠还原硫酸镍制备的镍微粒为催化剂,催化次亚磷酸钠液相还原硫酸镍,制备出纳米镍胶体.将该胶体应用于织物化学镀铜的活化工序,实验结果表明该胶体镍具有良好的催化活性.用透射电镜、扫描电镜及X射线衍射仪对该胶体及活化前后织物进行了表征,结果表明:所得纳米镍胶体成分纯净,粒径分布均匀;浸渍了该胶体镍的织物可以在以甲醛为还原剂的化学镀铜液中顺利起镀.%For preparation of nano-nickel colloid which is suitable for the activation of electroless-plating of fabrics with copper economically, under acidic conditions, the nano-nickel colloid was prepared with nickel particles as catalyst and polyvinylpyrrollidone ( PVP) as stabilizer. The nickel particles were prepared by reduction of nickel sulfate with sodium borohydride in the presence of sodium hypophosphite solution. Then the nano-nickel colloid was used in the activation process of electroless plating of fabrics with copper. Transmission electron microscopy (TEM) , scanning electron microscopy (SEM) and X-ray diffraction (XRD) were used to characterize the nickel colloid and fabrics before and after activation treatment. The results showed that the nano-nickel colloid has pure composition, uniform particle size distribution, and good catalytic activity, and fabrics dipped with this nickel colloid can be successfully electroless plated with copper using formaldehyde as reducing agent.

  8. 碳纳米管表面化学镀银及场发射性能研究%Study on field emission properties of CNTs electroless plating with Ag

    Institute of Scientific and Technical Information of China (English)

    叶芸; 肖晓晶; 郭太良; 黎威志; 蒋亚东

    2012-01-01

    Ag were deposited on the surface of carbon nanotubes (CNTs) by eleetroless palting method, and the field emission properties of CNTs electroless plating with Ag were studied. The carbonyl, carboxyl and hydroxy groups on the surface of CNTs were produced by oxidization in mixed acid. The turn-on field of CNTs electroless plating with Ag was 0.19V/μm, and the maximal emission current achieved 6mA/cm2 at the field of 0. 37 V/μm, which the field enhancement factor was calculated as 25565. The results showed that the improvement of emission stability was attributed to the electronic and thermal conductivity of CNTs, which caused by Ag electroless plating on CNTs surface. The proposed CNT/Ag cathodes possess good field emission properties and have potential for application in field emission displays.%利用化学镀方法对碳纳米管(carbon nano-tubes,CNTs)表面金属化镀银,研究表面化学镀银碳纳米管的场发射性能。碳纳米管经氧化处理后,表面存在一些羰基(CO)、羧基(—COOH)和羟基(—OH)等活性基团,经敏化、活化处理后,形成金属钯活化中心,进而还原金属银离子,从而获得表面化学镀银的碳纳米管。表面化学镀银碳纳米管阴极的开启电场约为0.19V/μm,当电场强度为0.37V/μm时,最大发射电流达6mA/cm2,场增强因子约为25565。实验结果表明,化学镀银层可以提高碳纳米管的电子传输和热传输能力,提高碳纳米管的场发射电流和发射稳定性,有利于碳纳米管在场发射平板显示领域的应用。

  9. 氧化铝陶瓷局部活化及选择性化学镀铜的研究%Study of the local activation and selective electroless copper plating on alumina ceramics

    Institute of Scientific and Technical Information of China (English)

    由劲博; 龙晋明; 朱晓云; 张秀

    2015-01-01

    为解决陶瓷表面局部化学镀存在的问题,研制了一种针对氧化铝陶瓷局部化学镀铜前处理用的活化胶,其由具有活化能力的银盐(或钯盐)和粘稠的复合物有机载体组成。将活化胶印于氧化铝陶瓷表面,经500℃高温烧结形成局部活化层后,可直接置于化学镀液中进行镀铜处理,得到与印刷图形一致的局部镀铜层。利用电化学工作站测定样品在化学镀铜溶液中电位随时间的变化情况,考察不同活化条件对Cu2+还原的催化活性,利用SEM/EDS进行表面形貌及成分分析,确定了活化胶中银盐和钯盐的适宜浓度。结果表明,该两种活化胶应用于氧化铝陶瓷表面化学镀铜的活化工艺,可实现敏化活化的一步化,使陶瓷表面局部化学镀工艺流程简化,成本降低,具有较高的实用价值。%To solve the problem of local chemical plating on the ceramic surface, a glue ink used in local activation treatment on dielectric alumina ceramics for selective electroless copper plating is developed. It is composed of silver or palladium salt activator and complex organic carrier and can be printed on the alumina substrate through printing method. After the local activation layer on alumina is formed in a sintering process at the temperature of 500℃, the selective electroless copper plating could be performed. A local copper coating, whose pattern is identical with printing graph, is obtained on alumina ceramics. The kinetics of the electroless copper plating and its dependence on different activation glue ink were investigated by monitoring the mixed potential of the specimen in plating bath using an electrochemical workstation. The morphology and composition of the activation layers and copper coatings on alumina were characterized by means of SEM and EDS. The proper concentration of silver and palladium salt in the glue ink is recommended as well. The results show that the

  10. Electroless Fabrication of Cobalt Alloys Nanowires within Alumina Template

    Directory of Open Access Journals (Sweden)

    Nazila Dadvand

    2007-01-01

    Full Text Available A new method of nanowire fabrication based on electroless deposition process is described. The method is novel compared to the current electroless procedure used in making nanowires as it involves growing nanowires from the bottom up. The length of the nanowires was controlled at will simply by adjusting the deposition time. The nanowires were fabricated within the nanopores of an alumina template. It was accomplished by coating one side of the template by a thin layer of palladium in order to activate the electroless deposition within the nanopores from bottom up. However, prior to electroless deposition process, the template was pretreated with a suitable wetting agent in order to facilitate the penetration of the plating solution through the pores. As well, the electroless deposition process combined with oblique metal evaporation process within a prestructured silicon wafer was used in order to fabricate long nanowires along one side of the grooves within the wafer.

  11. NdFeB磁性材料表面化学镀Ni-Cu-P实验研究%Electroless plating of Ni-Cu-P alloy on the surface of NdFeB permanent magnets

    Institute of Scientific and Technical Information of China (English)

    王憨鹰; 李增生; 李成荣; 陈焕铭

    2011-01-01

    In order to improve corrosion resistance of electroless plating Ni-Cu-P coating, plating bath and plating parameters of eletroless deposition of Ni-Cu-P alloy on the surface of NdFeB magnets was optimized by an orthogonal experiment. The optimal formula of electroless Ni-Cu-P plating bath was obtained as follows: 25 g/L of nickel sulfate, 0.4 g/L of copper sulfate, 35 g/L of sodium hypophosphite, 48 g/L of complexant, 50 g/L of buffering agent and pH value of 9. The effect of pH and CuSO4 ? 5H2O content in solution on plating rate and deposit composition was investigated. It is found that the plating rate and the copper and nickel contents of the deposit increase with increasing pH, while phosphorus content decreases; with increasing CuSO4?5H2O content in solution, the copper content of the deposit increases, while the phosphorus contents first increase and then decrease with a simultaneous decrease in the nickel content.%为提高Ni-Cu-P合金镀层的耐腐蚀性,采用正交试验法对NdFeB磁体表面化学镀Ni-Cu-P合金的镀液配方和施镀工艺进行优化,获得NdFeB磁体表面化学镀Ni-Cu-P合金的最佳成分配方为:硫酸镍25g/L,硫酸铜0.4 g/L,次亚磷酸钠35 g/L,络合剂48 g/L,缓冲剂50 g/L,pH值9.分析镀液pH值和镀液中CuS04·5H20浓度对沉积速度和镀层成分的影响.结果表明:随镀液pH值增加,沉积速度提高,镀层中Cu和Ni含量略升高,P含量逐渐降低;随镀液中CuS04·5H20浓度的增加,镀层中Cu含量升高,P含量先升高后降低,Ni含量降低.

  12. A Study of Electroless Nickel Plating with Citric Acid-Succinic Acid Double Complexing Agent System%柠檬酸-丁二酸双配位剂体系化学镀镍的研究

    Institute of Scientific and Technical Information of China (English)

    崔东; 刘定富

    2012-01-01

    Selection of complexing agent is one of the keys for electroless nickel plating technology. With two commonly used organic acids — citric acid and succinic acid as complexing agents, plating rate and mass fraction of phosphorus content in coating as evaluating indicator, their effects were investigated when they are used in separate and compounded forms on the basis of the single-factor experiment. The results show that single complexing agent is difficult to simultaneously satisfy the requirements of electroless nickel plating on plating rate and mass fraction of phosphorus content in coating while compounded use of complexing agents can overcome the difficulty between plating rate and mass fraction of phosphorus content in coating; when citric acid is 20 g/L and succinic acid 6 g/L. Plating rate is moderate, but the mass fraction of phosphorus content in coating is higher.%配位剂的选择是化学镀镍技术的关键之一.使用两种常用的有机酸——柠檬酸和丁二酸作为配位剂,以镀速和镀层中磷的质量分数为评价指标,先分别考察两者单独使用时的影响,然后在单因素实验的基础上,考察两者复配使用时的影响.结果表明:单一配位剂难以同时满足化学镀镍工艺对镀速和镀层中磷的质量分数的要求,配位剂复配使用可以克服镀速与镀层中磷的质量分数之间的矛盾;在柠檬酸20 g/L,丁二酸6 g/L的条件下,镀速适中且镀层中磷的质量分数较高.

  13. 石英光纤表面化学镀镍磷合金工艺%Electroless nickel-phosphor plating process on surface of quartz optical fiber

    Institute of Scientific and Technical Information of China (English)

    李小甫; 姜德生; 余海湖; 余丁山; 杨恩宇; 李鸿辉

    2005-01-01

    Quartz optical fibers are of great significance in many fields. For example, they can be used to fabricate strain sensors and temperature sensors. If the surface of optical fibers is metal-coated by the electroless plating method, the measuring precision and stability of the optical fiber sensors can be improved remarkably, additionally the life-span of sensors can be prolonged. In this work, an electroles snickel-phosphor plating process for optical fibers was presented. The influences of the content of NaH2PO2·H2O, bath pH value and temperature and the plating deposition rate on the quality of the plating coatings were studied with orthogonal testing. The results indicated that the content of NaH2PO2·H2O was the key factor, which influenced the adhesion force of the plating coatings. The nickel-phosphor plating bath presented in this work possessed excellent stability and the plating deposition rate could be accelerated. Using the process described in this work, nickel-phosphor coatings with great brightness and high adhesion force can be prepared successfully. Optimum conditions were: NiSO4 30g·L-1, NaH2PO2 ·H2O 20g·L-1, C3H6O3 4 ml·L-1, Na2CO3 3g·L-1 , NH4Cl 4g·L-1 , saccharin 1mg·L-1, temperature 84℃, pH 4.6.

  14. A Study of Electroless Silver Plating with Pd-Free Activation on Cenosphere%空心玻璃微珠无钯活化化学镀银的研究

    Institute of Scientific and Technical Information of China (English)

    朱国庆; 张瑾; 张辉

    2012-01-01

    基于银镜反应原理,不经过粗化和活化直接对空心玻璃微珠进行化学镀银.采用单因素分析法,研究了硝酸银、葡萄糖、装载量、氢氧化钠和无水乙醇对银的利用率以及镀层的增重率、导电性能和结合强度等的影响,并借助扫描电镜和X射线衍射仪对镀层的表面形貌和结构进行了分析.结果表明:与胶体钯活化工艺相比,无(钯)活化化学镀银工艺的银的利用率高,镀层均匀、致密,导电性好,结合强度高.%Based on the principle of silver mirror reaction, electroless silver plating was directly carried out on cenoshpere without pretreatments of coarsening and activation. The effects of silver nitrate, glucose, cenosphere loadage, sodium hydroxide and anhydrous alcohol on silver utilization ratio end the weight gain rate, conductivity, binding strength, etc. of the coating were investigated by single factor analysis. The surface morphology and structure of the coating were analyzed by SEM and XRD, The results indicate that as compared with colloidal palladium activation method, the silver utilization ratio is high, and the coating is uniform and compact with superior conductivity and high binding strength when the electroless silver plating process without palladium activation prelreatment is adopted.

  15. Development of Nickel Immersion Pretreatment of Electroless Nickel Plating on Al Alloy Surface%铝基化学镀镍浸镍前处理的研究进展

    Institute of Scientific and Technical Information of China (English)

    孙硕; 宋贡生; 马正华

    2015-01-01

    铝基表面欲获得结合力好的镀层,关键在于前处理工艺的选择. 尽管浸锌法是目前研究较多、效果较好的前处理方法,但仍存在一些不足,而浸镍法可以避免这些不足,有望取代浸锌法. 较详细地阐述了浸镍法的原理及研究现状,并将文献中涉及的浸镍法分为活化浸镍、碱性预镀镍和二次浸镍. 活化浸镍液中一般不含还原剂,主要通过置换反应生成一层具有催化作用的镍,进而促使化学镀过程中镍紧密均匀地沉积;碱性预镀镍则是通过含有还原剂的镍盐溶液,在铝基表面预化学镀上一薄层镍,其原理与化学镀镍相同. 同时,对比分析了两种浸镍法及其组合处理法之间的区别与联系. 最后,指出了浸镍法未来的发展方向:其一,简化工艺,用一次浸镍法代替二次浸镍法;其二,无毒、低污染,研发出无氟浸镍液;其三,获得高性能,即优化浸镍液配方,使得镀层与基体结合强度更好.%The key line to obtain electroless nickel plating with excellent adhesion to the substrate is the pretreatment process. The zincate treatment method as a pretreatment process has been studied by many researchers, and its effect is good. However, its disadvantages cannot be ignored. The nickel immersion method can avoid these shortages, and it is expected to replace zinc immer-sion method. The present article introduced the research status and the principle of zincate treatment. At the same time, this paper divided the relative zincate treatment into activation-nickel immersion method, alkaline elctroless nickel pre-plating method, and double nickel immersion method. The solution of activation-nickel immersion method normally does not contain reducing agent. This method produces a thin layer of nickel catalyst by substitution reaction, prompting the deposition of electroless nickel plating closely and evenly in the later process. The solution of alkaline nickel pre-plating is a kind of

  16. Technology of ultrasonic-electroless plating Ni-P-SiC nanocomposite coating%超声波-化学镀Ni-P-SiC纳米复合镀层的工艺研究

    Institute of Scientific and Technical Information of China (English)

    马春阳; 吴蒙华; 曲智家

    2011-01-01

    Ni-P-SiC nanocomposite coatings were prepared by ultrasonic-electroless plating on surface of 45 steel substrate. Through orthogonal experiment, the technology parameters of plating Ni-P-SiC nanocomposite coatings were optimized and the hest addition amount of SiC nanoparticles. ultrasonic power, temperature of plating liquid and pH value were determined. The microstructure of the coatings was observed and analysed by scanning electron microscopy ( SEM) and atomic force microscopy ( AFM) .%采用超声波-化学镀的方法,在45钢基体表面制备Ni-P-SiC纳米复合镀层.利用正交试验法对制备Ni-P-SiC纳米复合镀层的工艺参数进行优化,并确定SiC纳米粒子的加入量、超声波功率、复合镀液的温度以及pH值.最后,利用扫描电镜(SEM)和原子力显微镜(AFM)对复合镀层的显微组织形貌进行观察和分析.

  17. Preparation of Co/SiC Composite Particles Using Electroless Plating Method%化学镀法制备钴包覆碳化硅复合粉末的研究

    Institute of Scientific and Technical Information of China (English)

    周超兰; 张高科; 甘慧慧

    2011-01-01

    Electroless plating method was employed to prepare Co/SiC composite particles. In the process of electro-less deposition, the optimal conditions of electroless cobalt can be obtained through studying on the influence factors of the deposition rate, such as cobaltic salt concentration, deoxidizer concentration, complexing agent concentration, buffering agent concentration, temperature and pH value, etc. The composite particles were characterized by X-ray diffraction (XRD), Scanning electron microscope (SEM) and Energy dispersive x-ray analysis (EDAX). The experimental results indicate that the deposition rate is faster and the powder surface is coated by cobalt evenly when the concentration of sul-furic acid cobalt is varied form 30 g/L to 50 g/L, the concentration of sodium hypophosphite is set as 40 g/L, the concentration of sodium citrate is between 60 g/L and 70 g/L, the temperature is controlled in 50 ~ 70℃and pH value is adjusted as 8.%采用化学镀法制备钴包覆碳化硅复合粉末,通过研究化学镀过程中钴盐浓度、还原剂浓度、络合剂浓度、缓冲剂浓度、温度以及pH值等因素对沉积速率的影响规律,得到化学镀钴的优化条件.利用XRD、SEM和EDAX等测试手段对该复合粉末的组分及形貌进行了表征.实验和表征结果表明,当硫酸钴浓度为30~50 g/L,次磷酸钠浓度为40 g/L,柠檬酸钠浓度为60~70 g/L,控制温度为50~70℃以及调节pH值等于8时,镀层沉积速度较快,所得粉体表面被钴均匀包覆.

  18. ZM6镁合金化学镀镍预处理工艺及镀层耐蚀性%Pretreatment process and corrosion resistance of electroless nickel plating on ZM6 magnesium alloy

    Institute of Scientific and Technical Information of China (English)

    高艳蕊; 刘楚明; 傅圣利; 李慧中; 舒心; 高永浩

    2011-01-01

    Nickel coating was prepared on ZM6 magnesium alloy by electroless nickel plating in nickel carbonate bath with pretreatment of zinc immersion.The morphology and composition of zinc coating and electroless nickel coating were studied by scanning electronic microscopy (SEM) and energy dispersive spectroscopy (EDS).The structure of nickel coating was studied by X-ray diffraction spectroscopy (XRD).Potentiodynamic polarization analysis was used to study the corrosion resistance of the coating.The results indicate that a compact, well-distributed zinc coating is obtained on the surface of ZM6 alloy in a new zinc immersion solution with addition of Sn2+.The subsequent amorphous electroless nickel coating is uniform and the thickness is 8.74 μm after 1 h deposition.Phosphorus mass fraction is 9.29%.The corrosion potential is -0.609 V, and the corrosion current density is about 1/10 of substrate in 3.5% NaCl solution.%采用浸锌预处理工艺,研究在碱式碳酸镍体系中ZM6镁合金表面化学镀镍层性能.用扫描电镜(SEM)、能谱仪(EDS)和X线衍射仪(XRD)研究浸锌层和镀镍层的形貌、成分及镀层结构,采用极化曲线测试镀层的耐蚀性.研究结果表明,浸锌溶液中加入Sn2+可在ZM6镁合金表面获得均匀致密的浸锌层,后续在碳酸镍体系中施镀1 h后所得非晶态Ni-P镀层均匀致密,无明显缺陷,厚度为8.74 μm,磷质量分数达9.29%;在3.5%NaCl溶液中,镀层的自腐蚀电位为-0.609 V,腐蚀电流密度约为基体的1/10,耐腐蚀性能良好.

  19. 化学镀Ni-P-B合金中的动力学%Kinetics of Electroless Plating Ni-P-B Alloy

    Institute of Scientific and Technical Information of China (English)

    彭健

    2012-01-01

    Logarithmic relationship curves between the deposition rate and the concentration of reactants and operation temperature were obtained by experiments. Reaction kinetic parameters were obtained from comparison of experimental results and kinetic equations. Experimental equation of deposition rate can provide theoretical reference for electroless Ni-P-B alloy.%通过试验得到了化学镀Ni-P-B合金镀液中反应物浓度、温度等因素与沉积速率间的对数关系曲线,分别确定上述各因素对应的动力学参数,建立了沉积速率的经验方程式,计算了Ni-P-B合金化学镀的反应活化能。

  20. Study on preparation and performance of ultraviolet-curable active paste for electroless copper plating%紫外光固化化学镀铜活化浆料的制备及性能研究

    Institute of Scientific and Technical Information of China (English)

    曹权根; 陈世荣; 赖福东; 谢金平; 范小玲

    2015-01-01

    In order to prepare a silver-containing UV-curable active paste for electroless copper plating on the surface of PI (polyimide) thin film, the mixed potentialvs. time curves for electroless copper plating initiated by the active pastes obtained from different mass ratios of polyester acrylate to polyurethane acrylate were determined by electrochemical method, and the influence of the contents of silver nitrate and conductive carbon black on the adhesion and catalytic activity of the active paste and the conductivity of the copper deposit were studied. The surface morphology, structure, and silver distribution of the active paste and copper deposit were examined by scanning electron microscope (SEM), energy-dispersive X-ray spectrometer (EDS), and X-ray diffractometer (XRD). The active paste prepared with polyester acrylate and polyurethane acrylate at a mass ratio of 4 to 6 as composite prepolymers, conductive carbon black 10%, and AgNO3 7% was coated on PI thin film and then cured under UV irradiation. The copper deposit obtained by electroless copper plating for 10 min thereafter is fine-grained and compact with a 100% adhesion to the substrate and a square resistance of 0.046Ω/□.%为了在PI(聚酰亚胺)薄膜上制备一种含银的紫外光(UV)固化化学镀铜活化浆料,采用电化学方法测定了聚酯丙烯酸酯和聚氨酯丙烯酸酯不同质量比得到的活化浆料引发化学镀铜的混合电位–时间曲线,研究了硝酸银和导电炭黑含量对活化浆料的附着力、催化活性及铜镀层导电性的影响,通过扫描电镜(SEM)、X射线能谱仪(EDS)和X射线衍射仪(XRD)对活化浆料和铜镀层的表面形貌、结构以及Ag元素分布等进行了研究。以聚酯丙烯酸酯和聚氨酯丙烯酸酯按质量比为4∶6组成复合预聚体,导电炭黑和AgNO3的用量分别为10%和7%制备活化浆料,将其涂覆在PI薄膜上,UV固化后化学镀铜10 min,所得镀铜层颗粒细小、致

  1. Fabrication Characteristics of Silicon Nanowires via the Electrochemical Electroless Etching Method.

    Science.gov (United States)

    Kang, ByeongSu; Jeong, Chae Hwan; Kim, Changheon; Kim, Min-Young; Choi, Bum Ho; Lee, Moo Sung; Kim, Ho-Sung

    2015-07-01

    A silicon nanowire structure was fabricated using the electrochemical electroless etching method, involving electroless plating and the electrochemical etching process. The reflection of the absorption layer with the nanowires' structure was about 5%, which is better than a bulk-type solar cell (10%).

  2. INVESTIGATION INTO THE REJUVENATION OF SPENT ELECTROLESS NICKEL BATHS BY ELECTRODIALYSIS

    Science.gov (United States)

    Electroless nickel plating generates substantially more waste than other metal-finishing processes due to the inherent limited bath life and the need for regular bath disposal. Electrodialysis can be used to generate electroless nickel baths, but poor membrane permselectivity, l...

  3. 化学镀铜短碳纤维-铜-石墨复合材料的性能研究%Properties of Electroless Copper Plating on Short Carbon Fiber-Copper-Graphite Composite

    Institute of Scientific and Technical Information of China (English)

    许少凡; 许少平; 霍金元; 顾斌

    2012-01-01

    The surfaces of short carbon fibers were coated by electroless copper plating method, and the long carbon fibers coated by continuous electroplating copper method were cut short. The carbon fiber-copper-graphite composites with the two kinds of short carbon fibers and the copper-graphite composite without short carbon fibers were prepared by the powder metallurgy method. Their physical and mechanical properties were tested. The dry friction tests of the composites under sliding velocity of 15 m/s and load of 4. 9 N were conducted for 30 h . The results show that such properties of the electroless copper plating on short carbon fiber-copper-graphite composite as electric conductivity, hardness, bending strength and wear resistance are increased much more remarkably than those of the electroplating copper short carbon fiber-copper-graphite and copper-graphite composite without short carbon fiber.%本文采用化学镀铜法对短碳纤维表面进行镀铜,并用电镀法对长碳纤维表面进行连续镀铜后,再切割成镀铜短碳纤维.随后用粉末冶金法制备了含有这两种镀铜短碳纤维的碳纤维-铜-石墨复合材料和不含碳纤维的铜-石墨复合材料,对它们的物理和力学性能进行了测试,并在滑动速度为15 m/s、载荷为4.9N的干摩擦条件下进行了30 h磨损试验,结果表明:化学镀铜短碳纤维-铜-石墨复合材料的导电性、硬度、抗弯强度和耐磨性优于电镀铜短碳纤维-铜-石墨复合材料和不含碳纤维的铜-石墨复合材料.

  4. Electroless alloy/composite coatings: A review

    Indian Academy of Sciences (India)

    R C Agarwala; Vijaya Agarwala

    2003-06-01

    Since the inception of electroless coating by Brenner & Riddell in 1946, it has been the subject of research interest and, in the past two decades, emphasis has shifted to the studies of its properties and applications. The co-deposition of particulate matter or substance within the growing film has led to a new generation of electroless composite coatings, many of which possess excellent wear and corrosion resistance. This valuable process can coat not only electrically conductive materials including graphite but also fabrics, insulators like plastics, rubber etc. The low coating rates with these can provide better reflectivity of plated surfaces and many more applications. Coatings can be tailored for desired properties by selecting the composition of the coating alloy/composite/metallic to suit specific requirements. The market for these coatings is expanding fast as the potential applications are on the rise. In the present article, an attempt has been made to review different electroless alloy/composite coatings with respect to bath types and their composition, properties and applications. Different characterisation studies have been conducted on various electroless nickel-based coatings with emphasis on wear and corrosion properties.

  5. Study on electroless Ni-Cu plating with palladium-free activation on PET fabric%涤纶织物的铜镍无钯化学镀工艺研究

    Institute of Scientific and Technical Information of China (English)

    张葛成; 张瑞萍; 钟菲菲; 周磊

    2016-01-01

    采用高温热氧化还原方法对涤纶织物进行无钯活化,并在涤纶织物表面进行化学镀铜镍合金,分析了活化和化学镀工艺中主要因素对镀速的影响。结果表明,铜镍织物无钯高温活化工艺条件为:m[NaH2PO2(g)]∶m[Ni(Ac)2(g)]∶V[CH3OH (mL)]=1∶1∶30,浸渍时间3 min,活化温度205℃,活化时间10 min。铜镍织物的化学镀工艺条件为:硼酸0.4 mol/L,次亚磷酸钠0.5 mol/L,聚乙二醇100 mg/L,柠檬酸钠0.08 mol/L,硫酸镍0.04 mol/L,硫酸铜0.08 mol/L,镀覆温度90℃,镀覆时间30 min,pH=9.5。涤纶织物表面得到了较好的铜镍合金镀层,电阻值为11.9Ω/sq。%Polyethylene terephthalate (PET) fabrics were pal adium- free activated by high temperature thermal oxidation reduction method. Electroless plating of copper- nickel on the surface of polyester fabric was carried out, and the influences of the main factors during the activation and electroless plating process on the plating rate were analyzed. The results showed that the optimal parameters of activation process were: m [NaH2PO2(g)]∶m[Ni(Ac)2(g)]∶V[CH3OH(mL)]=1∶1∶30, the fabric was immersed in an active solution for 3 min, then was cured at 205 ℃ for 10 min. The optimal parameters of electro- less plating process were: boric acid 0.4 mol/L, sodium hypophosphite 0.5 mol/L, polyethylene glycol 100 mg/L, sodium citrate 0.08 mol/L, nickel sulfate 0.04 mol/L, cupric sulfate 0.08 mol/L, pH=9.5, plating at 90 ℃ for 30 min. A good copper nickel al oy coating on the surface of polyester fabric was obtained and the resistance value was 11.9Ω/sq.

  6. 光亮剂对酸性中磷化学镀镍层性能的影响%Effect of brightening agent on properties of medium-phosphorus nickel coating deposited by acidic electroless plating

    Institute of Scientific and Technical Information of China (English)

    杨倩韵; 郑文芝; 张晓明; 鹿轩; 林继月; 陈姚; 于欣伟

    2016-01-01

    The effects of four kinds of brightening agents, i.e. 3-N,N-diethylamino-1-propyne formate (DEP), copper sulfate, composite brightener RS, and sodium saccharin on properties of the medium-phosphorus Ni-P alloy coating deposited from an acidic electroless nickel plating bath were studied by polarization curve measurement, scanning electron microscopy (SEM), neutral salt spray (NSS) test, and other methods. The results showed that the coating obtained with copper sulfate as brightening agent has the highest brightness and a mirror-like surface with an average roughness (Ra) of 0.78μm, but the worst corrosion resistance. The fastest deposition rate was obtained as 21.56μm/h when using sodium saccharin as a brightening agent. The coating deposited by adding the RS intermediate to plating bath shows the best corrosion resistance and a relative good brightness.%采用极化曲线、扫描电子显微镜(SEM)、中性盐雾(NSS)试验等方法,研究了酸性中磷化学镀镍液中N,N?二乙基丙炔胺甲酸盐(DEP)、硫酸铜、复配光亮剂RS和糖精钠4种光亮剂对镀层性能的影响.结果表明,以硫酸铜作为光亮剂所获得的镀层光亮度最高,镀层表面粗糙度(Ra)平均值达0.78μm且呈镜面状态,但镀层耐蚀性最差;用糖精钠作光亮剂时镀速最快,达21.56μm/h;而加入中间体RS的镀层耐蚀性最好,且光亮度较好.

  7. Ni-P-PTFE化学复合镀工艺优化及镀层性能研究%Process Optimization of Electroless Ni-P-PTFE Composite Plating and Research on the Coating Performance

    Institute of Scientific and Technical Information of China (English)

    张翠杰; 刘贯军; 张培彦

    2015-01-01

    目的:研究表面活性剂FC4和PTFE添加量,对Ni-P-PTFE化学复合镀层质量和镀层中PTFE体积分数的影响规律以及对镀层的摩擦磨损性能的影响。方法改变镀液中FC4和PTFE添加量,获得不同的Ni-P-PTFE化学复合镀层,用扫描电子显微镜观察镀层形貌,用能谱仪并结合直方图方法测算镀层中PTFE的体积分数,研究镀层质量和镀层中PTFE的体积分数随镀液中FC4和PTFE添加量的变化规律,测试镀层的摩擦学性能。结果 Ni-P-PTFE复合镀工艺中FC4的用量为0.3 g/L时镀层表面质量最好,镀层中PTFE体积分数最大;PTFE体积分数为10%时Ni-P-PTFE复合镀层的磨损率最小。结论镀层中PTFE的体积分数随镀液中PTFE添加量的增加而增加,对镀层磨损率的减小存在最优值。%ABSTRACT:Objective To investigate the influence rules of FC4 surfactant and PTFE addition amount on the quality of the coat-ing, the volume fraction of PTFE in the coating and the friction-wear properties. Methods Different electroless Ni-P-PTFE compos-ite platings were obtained by changing the addition amount of FC4 and PTFE. The morphology of the coatings was observed by Scanning Electron Microscope and the volume fractions of PTFE in the coatings were measured and calculated by combining Energy Disperse Spectroscopy with histogram method. The changing rules of the quality of the coatings and the volume fraction of PTFE in the coatings with the addition amount of FC4 and PTFE were investigated,and the tribological property of the coatings was analyzed. Results The best coating with the biggest volume fraction of PTFE was obtained when the addition amount of FC4 was 0. 3 g/L in the electroless Ni-P-PTFE composite plating process, and the coating with the lowest wear rate was prepared when the volume frac-tion of PTFE in the coating was 10%. Conclusion The volume fraction of PTFE in the coating increased with increasing addition a-mount of PTFE in the

  8. Study of the Electroless Tin Plating Process on Cotton Fabric and Its Antibacterial Property%棉织物表面电镀锡及其抑菌性检测

    Institute of Scientific and Technical Information of China (English)

    张平; 赵旭堃; 佐同林; 杨召

    2016-01-01

    以平纹棉织物为基布,用含有氨基和氰基的高分子溶胶无钯活化法使棉织物表面形成活化中心,再对其进行化学镀铜和电镀锡。运用扫描电子显微镜比较观察电镀锡前后的表面形态。研究了电镀锡前后棉织物表面的增重率,并用8099大肠埃氏杆菌对其进行抑菌性检测,结果发现抑菌率与增重率之间存在一定的非线性关系,且抑菌率随增重率的增大呈增大的趋势,增重率最高可达4.53%,抑菌率最高可达96.60%,说明电镀锡棉织物抑菌性有效,满足一定的生产生活需要。%The cotton fabric was proceeded electroless copper plating and tin plating using amino and cyano polymer sol containing palladium free activation method to make the fabric surface form the activation center.The surface morphology of the fabric was ob-served by the scanning electron microscope (SEM).The weight gain rate of the surface of the cotton fabric before and after tin plating was studied.The antibacterial activity was detected with 8099 E.coli.The results showed that there was a certain nonlinear relation-ship between the inhibition rate and weight gain rate,and the inhibition rate increased with the increase of weight ratio.The weight gain rate was 4.53%,and the inhibition rate was 96.60%.

  9. 硫代硫酸钠对涤纶织物化学镀银的影响%Influences of sodium thiosulfate on electroless silver plating on PET fabrics

    Institute of Scientific and Technical Information of China (English)

    徐文龙; 熊杰; 徐勤; 刘志才; 焦玉雪; 陈虎

    2011-01-01

    研究硫代硫酸钠对化学镀银镀液稳定性、镀层表面形貌、镀层成分、结晶情况、镀银速率、表面电阻以及电磁屏蔽效能的影响.结果表明:添加硫代硫酸钠能使镀液的稳定性得到明显提高,但若浓度过高,会出现镀层结构疏松的现象;镀层中银的结晶形态是立方面心(fcc)结构,晶粒尺寸随硫代硫酸钠浓度的增加而减小;硫代硫酸钠的加入使镀银速率下降,但速率对温度的敏感性增加,当硫代硫酸钠质量浓度增大到0.6 mg/L时,会使镀银速率大幅降低,对化学镀银带来不利影响;当硫代硫酸钠质量浓度在0.4 mg/L以内,对织物的表面电阻和电磁屏蔽效能影响不大.%The influences of sodium thiosulfate on the stability of plating solution, surface morphology, chemical composition, crystal structure, deposition rate, surface resistance and electromagnetic interference shielding effectiveness (EMI SE) of the silver coated fabric were investigated. The results revealed that the stability of plating solution was significantly improved with addition of sodium thiosulfate. But high concentration of sodium thiosulfate leads to loose deposited layer. The crystalline structure of silver in deposit is of face centered cubic (fee) structure. The grain size decreases with the increase of the concentration of sodium thiosulfate. The deposition rate decreases with the addition of sodium thiosulfate. However, the sensitivity of deposition rate on temperature increases in the presence of sodium thiosulfate. The deposition rate greatly decreases and it will bring above adverse effect on electroless silver plating when the concentration of sodium thiosulfate is higher than 0. 6 mg/L. Surface resistance and electromagnetic interference shielding effectiveness had no significant change when the concentration of sodium thiosulfate is lower than 0. 4 mg/L.

  10. Synthesis and characterization of LiNi{sub 0.49}Mn{sub 1.49}Y{sub 0.02}O{sub 4}@Ag by electroless plating technique

    Energy Technology Data Exchange (ETDEWEB)

    Xiong, Lizhi; Liu, Wenping; Wu, Yuxian; He, Zeqiang, E-mail: csuhzq@163.com

    2015-02-15

    Highlights: • LiNi{sub 0.49}Mn{sub 1.49}Y{sub 0.02}O{sub 4} cathode materials have been synthesized by citric acid-assisted combustion method. • LiNi{sub 0.49}Mn{sub 1.49}Y{sub 0.02}O{sub 4}@Ag cathode materials with 4 wt% silver in Ag{sup 0} state coating layer on the surface of LiNi{sub 0.49}Mn{sub 1.49}Y{sub 0.02}O{sub 4} have been prepared by electroless plating technique. • The Ag-coating improves the electronic conductivity and the surface stability of LiNi{sub 0.49}Mn{sub 1.49}Y{sub 0.02}O{sub 4}. • LiNi{sub 0.49}Mn{sub 1.49}Y{sub 0.02}O{sub 4}@Ag exhibit enhanced cycling stability and rate capability. - Abstract: Silver (Ag) coated LiNi{sub 0.49}Mn{sub 1.49}Y{sub 0.02}O{sub 4} (LiNi{sub 0.49}Mn{sub 1.49}Y{sub 0.02}O{sub 4}@Ag) was prepared by electroless plating method. The microstructure, surface morphology and electronic conductivity of LiNi{sub 0.49}Mn{sub 1.49}Y{sub 0.02}O{sub 4}@Ag were investigated by X-ray diffraction (XRD), scanning electron microscopy (SEM), transmission electron microscopy (TEM), X-ray photoelectron spectroscopy (XPS) and electronic conductivity tests. The results showed that 4 wt% silver was tightly coated in Ag{sup 0} state on the surface of LiNi{sub 0.49}Mn{sub 1.49}Y{sub 0.02}O{sub 4} to form a uniform Ag-coating layer of about 30 nm. Electrochemical tests stated clearly that the cycling performance of LiNi{sub 0.49}Mn{sub 1.49}Y{sub 0.02}O{sub 4}@Ag was more stable and the rate capability was more outstanding than that of LiNi{sub 0.49}Mn{sub 1.49}Y{sub 0.02}O{sub 4} due to the coating of Ag on the surface of LiNi{sub 0.49}Mn{sub 1.49}Y{sub 0.02}O{sub 4} by improving the electronic conductivity, preventing LiNi{sub 0.49}Mn{sub 1.49}Y{sub 0.02}O{sub 4} from being attacked by electrolyte, decreasing the electrochemical polarization during cycling and increasing the lithium ion diffusion coefficient on cathode materials.

  11. NdFeB磁性材料表面化学镀Ni-W-P合金研究%Electroless Ni-W-P plating alloy on the surface of the NdFeB permanent magnets

    Institute of Scientific and Technical Information of China (English)

    刘炜; 王憨鹰

    2011-01-01

    通过不同的化学镀工艺配方,在NdFeB永磁体表面获得4种不同W含量的化学镀Ni-W-P三元合金镀层.利用SEM对镀层的微观组织观察与分析表明:镀层表面形貌呈致密胞状结构,Ni、W、P元素分布均匀.进一步的衍射分析和硬度测试表明:随镀层中W和P元素含量的不同,镀层结构分别由纳米晶态、混晶态和非晶态组成,镀层的硬度随镀层结构从非晶态-混晶态-晶态的转变而增加.%Four ternary Ni-W-P alloy coatings on the surface of the Nd-Fe-B permanent magnet with different W contents were obtained by four different electroless Ni-W-P plating bath. The SEM observation and analysis of the coatings indicate that the morphology appeares closely nodules structure, and Ni, Cu, P elements distribute homogeneously in the coatings. The X-ray diffraction analysis and the hardness measurement suggest that with the changing of W and P content, the coating structures are crystalline, mixed crystalline and amorphous respectively. And the hardness of coatings also increases with its structure changing from amorphous into mixed crystalline and crystalline.

  12. Electroless Plating and Magnetic Properties of Tb-Fe-Co-B Alloy at Room Temperature%室温化学镀Tb-F e-C o-B合金的制备及磁性能研究

    Institute of Scientific and Technical Information of China (English)

    赵美峰; 刘影; 王建朝; 胡博; 陆军; 黄严

    2014-01-01

    The Tb-Fe-Co-B thin films were prepared through a non-aqueous electroless plating method at room temperature.The structures and magnetic properties of Sm-Fe-Ni-B alloys were characterized using SEM,EDS,XRD and VSM analyses.The results indicated that the coating was smooth.The density, deposition rate were improved with 3 g/L of Tb solution.An amorphous of Fe-Co-B was changed with a microcrystalline state of Tb-Fe-Co-B.The saturation magnetization rate and coercivity were enhanced in the meantime.In addition,the structure could be changed to produce a greater effect on the magnetic al-loy at 600 ℃.%本文采用非水室温化学镀的方法制备了Tb-Fe-Co-B合金薄膜,并利用SEM、EDS、XRD和VSM分析了稀土Tb对镀层形貌、成分、结构和磁性能的影响。结果表明:稀土Tb的添加量在3 g/L时,镀层更趋于平整致密,镀速明显提高,而镀层结构并未有明显转变;但对镀层的饱和磁化率和矫顽力均有所提高。此外,通过600℃热处理可改变镀层的结构从而对合金的磁性产生较大的影响。

  13. 陶瓷化学镀铜沉积速度及镀层外观的研究%Study on Deposition Rate and Coating Appearance of Electroless Copper Plating on Ceramics

    Institute of Scientific and Technical Information of China (English)

    张敏; 宣天鹏; 孙衍乐; 许少楠

    2011-01-01

    探讨了硫酸铜质量浓度、络合剂质量浓度比例、甲醛质量浓度、稀土质量浓度及温度变化对陶瓷表面化学镀铜的沉积速率和镀铜层微观形貌的影响.结果表明:随着硫酸铜质量浓度的增加、温度的升高和络合比的降低,化学镀铜的沉积速率提高,但镀液稳定性有所降低;增加甲醛或稀土含量,镀速先升高后下降,有一个最佳值.加入稀土Ce细化了铜颗粒,铜在基体表面的沉积变得均匀,当p(硫酸铈)为0.8g/L时,镀铜层平整细密、孔洞较少.%Effects of copper sulfate concentration, complexing agent concentration ratio, formaldehyde concentration, rare earth content and temperature on copper deposition rate, coating microstructure of elec-troless copper plating on ceramic were discussed. Results showed that with the increase in copper sulfate concentration and temperature and decrease in complexing agent ratio, the Cu deposition rate was increased but bath stability decreased; with increasing formaldehyde concentration and rare earth content, the Cu deposition rate was increased at first and then decreased. By adding rare earth Ce salt, copper particles got refined and copper depositon became even, especially when cerium sulfate content was 0. 8g/L, copper coating became more level,finer and less pores.

  14. AZ31变形镁合金化学镀前无铬酸洗工艺研究%An Investigation of Chromium-Free Pickling Process for Electroless Nickel Plating on AZ 31 Wrought Magnesium Alloy

    Institute of Scientific and Technical Information of China (English)

    秦铁男; 马立群; 贺忠臣; 姚妍; 丁毅

    2011-01-01

    主要研究了AZ 31变形镁合金化学镀前的磷酸-硝酸-氢氟酸混合酸洗工艺及各组分对镁合金基体的腐蚀失重表面形貌、镀层与基体的截面形貌和结合力的影响.结果表明:氢氟酸的加入可以有效降低酸洗反应速率并防止新鲜的镁合金基体表面的再次氧化;硝酸的体积分数对镁合金表面形貌的改变有较大影响;当磷酸-硝酸-氢氟酸的体积分数分别为300 mL/L,60 mL/L和100 mL/L时,镀层与基体的结合力最好.%A phosphoric acid-nitric acid-hydrofuoric acid mixed acid pickling process was studied for electroless nickel plating on AZ 31 wrought magnesium alloy sheet. The effects of pickle components on corrosion weight loss, surface morphology, cross section morphology and adhesion strength between the substrate and coating were investigated. The results show that addition of hydrofluoric acid can effectively reduce the rate of pickling reaction and protect the fresh substrate from being Oxidized again. The volume fraction of nitric acid has a great impact on changes of the surface morphology of magnesium substrate. The best adhesion strength between the substrate and the coating is achieved when the pickle solution contains 300 mL/L phosphoric acid, 60 mL/L nitric acid and 100 mL/L hydrofluoric acid.

  15. Study on Electroless Nickel Plating for Surface Modification of Carbon Fiber%碳纤维化学镀镍表面改性研究

    Institute of Scientific and Technical Information of China (English)

    姚怀; 郭军华; 崔文聪; 董伟学; 詹海娇

    2014-01-01

    Objective To perform nickel coating on the surface of carbon fiber using chemical deposition under ultrasonic condi-tion so as to study nickel plating for surface modification of carbon fiber. Methods The organizational structure,microstructure and plating rate were changed by the pH value of plating bath and temperature of heat treatment as well as ultrasound, which were in-vestigated through XRD and SEM analysis. Results When the pH value was between 8. 0 and 10. 0, the deposition rate was in-creased with the pH value, the coating was uniform, dense and well bonded with the matrix and the coating thickness was about 0. 5 μm. The carbon fiber had a reunion phenomenon, when the pH value was between 10. 0 ~ 11. 0. The plating layer was recrys-tallized to generate Ni3 P phase after being kept for 10 min at the heat treatment temperature of 400 ℃ . With increasing of the tem-perature, the plating layer crazed and the gap between the crazed parts decreased. Conclusion The pH value had great influence on deposition and would lead to carbon fiber reunion when exceeding the limit value. Too high temperature for heat treatment would lead to recrystallization and crack of the plating layer.%目的:在碳纤维表面进行化学镀镍,对碳纤维化学镀镍的表面改性进行研究。方法通过 X 射线衍射仪、扫描电子显微镜等测试手段研究 pH 值、热处理温度及超声波对镀层的形貌、组织结构及镀速的影响。结果 pH 值在8.0~10.0时,随 pH 值增大,沉积速率逐渐变大,镀层表面均匀致密,与基体结合良好,厚度约为0.5μm;pH 值在10.0~11.0时,碳纤维发生团聚。热处理温度为400℃时,保温10 min,镀层重结晶析出 Ni3 P 相;随温度升高,镀层发生开裂,且开裂部位间隔变小。结论 pH 值对镀层沉积影响较大,超过极限值会导致碳纤维团聚。热处理温度过高会导致镀层重结晶,且发生开裂。

  16. 铝及铝合金光亮化学镀镍的研究%Research on Bright Electroless Nickel Plating of Aluminum and Ahnninum Alloy

    Institute of Scientific and Technical Information of China (English)

    赵岚; 杨震

    2012-01-01

    研究了一种新的、简便的、环保的铝及铝合金化学镀镍新工艺,探讨了前处理、光亮剂添加量对镀层质量的影响。结果表明,铝及铝合金经过自制浸锌剂二次浸锌后,每升镀液中添加15mL光亮剂所获得的样品镀层均匀、结合力最佳。%This research studies a new simple environment-friendly aluminum and aluminum alloy eleetroless nickel plating process, analyses the influence ofpretreatment and bright plating additives on deposit quality as well. The experimental results show that an optimal deposit with even coating and strong binding force was achieved after two-time zinc dipping with self-made zinc dipping agent and 15ml brightener in every

  17. Study on effects of processing parameters on copper-coated tungsten powders prepared by electroless plating%化学镀工艺参数对制备铜包钨粉的影响研究

    Institute of Scientific and Technical Information of China (English)

    林涛; 史萍萍; 邵慧萍; 何新波

    2014-01-01

    采用化学镀法制备铜包钨复合粉,通过前处理工艺、络合剂、还原剂、溶液的 pH 值以及温度等影响因素研究粉镀层的性能.研究结果表明化学镀铜在前处理工艺中必须要进行完全处理才能使得镀层稳定、均匀;使用络合剂酒石酸钾钠和 EDTA-2Na 相结合,可以既减少镀液中游离的铜离子提高溶液的稳定性,也可以在镀液稳定时间将铜离子完全沉淀,提高镀速,当络合剂 EDTA-2Na 和酒石酸钾钠质量比为1.2时,沉铜速率最快;还原剂甲醛和溶液的 pH 值也相互影响着镀液的稳定性,结果显示还原剂甲醛的最佳浓度为10~20 mL/L,pH 值为12~13;反应最佳温度为45~55℃;制备的铜包覆钨复合粉表面的镀层均匀、连续、致密.%The copper-coated tungsten powder was prepared by electroless plating method in this study.The effects of surface treatment,reducing agent,complexing agent,stabilizer,and pH value of the solution on cop-per coating were studied.Tungsten powder surface should be coarsened,sensitized and activated at first.By combination of two complexing agents of potassium sodium tartrate and EDTA-2Na,free copper particles are decreased,and solution stabilization and plating rate are increased.The maximum plating rate can be reached when the weight ratio of the two complexing agents.The stability of plating solution was also affected by reduc-ing agent formaldehyde and solution pH value,and the optimum content of formaldehyde was 10-20 mL/L and pH value was 12-13.The optimum temperature of plating solution was 45-55 ℃.The copper coating on tung-sten particle was dense,uniform and complete.

  18. Research progress of electroless plating applied on heat exchange surface to enhance dropwise condensation,anti-fouling and anti-corrosion properties%化学镀在换热表面强化滴状凝结、阻垢、耐蚀研究进展

    Institute of Scientific and Technical Information of China (English)

    胡丞; 高景山; 张英

    2015-01-01

    Based on the practical problems of condenser,this article reviews the research progress of electroless plating applied to enhance dropwise condensation,anti-fouling and anti-corrosion properties.It is discussed the influence of surface energy,amorphous content,temperature, pressure,and PTFE content on the dropwise condensation.The growth of deposition on the electroless plating surface is introduced,and it is discussed the effect of amorphous content, experiment conditions,multi-layer plating and wolfram,boron nitride,stannum and cooper content on the surface anti-fouling property.This article discusses the influence of phosphorus content,multi-layer plating,surfactant,pH,temperature and Cu and PTFE content on the surface anti-corrosion property.Considering practical problems of condenser, put forward to future research which is creating a muli-property electroless plating.Meanwhile,in order to promote the development of electroless plating technology industrialization,longevity problem of electroless plating should also be solved.%从换热器实际问题出发,分别回顾了化学镀层强化凝结换热、阻垢、耐蚀3个方面的研究进展。在强化凝结换热方面,阐述了以 Ni-P化学镀为基础的界面表面能、镀层非晶含量、温度、压力以及添加 PTFE等物质对在换热界面形成滴状凝结的影响。在化学镀阻垢方面,介绍了污垢的生长过程,讨论了镀层非晶含量、实验条件、梯度镀层以及添加W、BN、Sn、Cu等元素对镀层阻垢性能的影响。在化学镀耐腐蚀研究方面,阐述了镀层磷含量、梯度镀层、表面活性剂、镀液 pH 值、温度以及添加Cu、PTFE等元素对镀层抗腐蚀性能的影响。并根据实际生产情况,提出对镀层强化凝结换热、阻垢和耐腐蚀3个方面特性相互间的影响关系进行研究。同时提出,为了推进镀层技术工业化发展,还应解决镀层长效性的问题。

  19. Electroless plating of Ag-TiO2 nanoparticle composite on PET fabric%涤纶织物纳米TiO2颗粒化学复合镀银

    Institute of Scientific and Technical Information of China (English)

    凌明花; 张辉

    2011-01-01

    采用化学镀技术,实现了不同分散剂分散纳米TiO2颗粒涤纶织物表面化学复合镀银,借助SEM、XRD和TG对镀层表面形貌、结构和织物热性能进行研究,测试织物的电磁波屏蔽、导电、耐磨、透气和光催化性能.结果表明:用PVP&T80作分散剂时,纳米TiO2的引入对镀层结构没有影响,但晶粒尺寸增大;随着纳米TiO2质量浓度的增加,镀速先上升后降低然后再上升;当增重率相同时,较化学镀银织物,纳米TiO2化学复合镀银织物热学性能没有明显变化,耐磨性增强,透气性下降;当纳米TiO2质量浓度小于0.25 g/L时,电磁波屏蔽性能有所提高,可以降解亚甲基橙染料.%TiO2 nanoparticles were firstly dispersed by using different dispersants, and then was added to the solution of silver ammonia. The Ag-TiO2 composite coating on PET fabric was performed by electroless plating. The morphology, structure, and thermal property of the Ag-TiO2-coated fabric was characterized using SEM, EDX, XRD and TG. The electromagnetic shielding effectiveness, electrical conductivity, abrasion resistance, air permeability and degradation of methylene orange dye under UV irradiation of the fabric were investigated. It was found that the introdution of TiO2 nanoparticles had no effect on the structure of the Ag coating when PVA and Tween 80 were used as dispersant. But the crystal size increased. With the increase of the mass concentration of TiO2 nanoparticles, the plating rate increased at first, then decreased and increased at last. As compared with the Ag-plated fabric, the onset decomposition temperature of the Ag-TiO2-plated fabric did not change when the weighting percentage was identical. However, the abrasion resistance was increased and air permeability was decreased. The electromagnetic shielding effectiveness was improved when the mass concentration of TiO2 nanoparticles was below 0. 2 g/L. The capability of photocatalytic degradation of methylene

  20. An Environmentally-friendly Process of Direct Electroless Nickel Plating on AZ91 D Magnesium Alloy%环保型AZ91 D镁合金直接化学镀镍工艺研究

    Institute of Scientific and Technical Information of China (English)

    谢治辉

    2015-01-01

    Objective To develop a chromium-free and stable direct electroless nickel plating ( ENP) technology for magnesium alloy. Methods SEM, EDX, immersion test, polarization curves, scribe and grid test as well as the stability factor and deposition rate were used to compare the effects of the new and traditional processes on the characteristics of the performance of Ni-P coating and plating bath. Results The stability of the base solution with nickel sulfate as the main salt could be obviously improved when 0. 5 mg/L of thiourea was added. A good corrosion morphology structure of the AZ91D magnesium alloy was achieved after pickling in a mixture of nitric acid and phosphoric acid. This specific surface structure could improve the mechanical adhesion between the substrate and the coating. The coating prepared using the new technology belonged to high-P coating, with a P content of about 11%. Compared to the bare magnesium alloy, the potentiodynamic polarization test in NaCl solution showed that the corrosion po-tential and the corrosion current density of the new coating increased positively from -1. 5 V to -0. 5 V and decreased by three or-ders of magnitude, respectively. Conclusion The corrosion resistance of coating obtained from a plating bath using nickel sulfate as the main salt was better than that from a plating bath using basic nickel carbonate as the main salt. The optimal pH and temperature of the ENP processes were 5 and 82 ℃, respectively.%目的:开发一种无铬、低氟、稳定的镁合金直接化学镀镍工艺。方法通过SEM,EDX及浸泡实验、动电位极化曲线、划格试验等方法,以稳定系数和镀速等参数为对象,对比新工艺和传统工艺对镀层或镀液性能的影响。结果在以硫酸镍为主盐的基础液中,添加质量浓度为0.5 mg/L的硫脲,镀液的稳定性可得到明显的提高。在使用硝酸+磷酸酸洗后的镁合金试样表面,获得了良好的腐蚀形貌结构,这种结构有利于增

  1. Effects of Sodium Citrate Concentration on Electroless Ni-Fe Bath Stability and Deposition

    Science.gov (United States)

    Jung, Myung-Won; Kang, Sung K.; Lee, Jae-Ho

    2014-01-01

    In this research, electroless Ni-Fe bath stability and deposition characteristics were investigated for various sodium citrate concentrations. Complexing agents such as sodium citrate are one of the main components of such electroless plating baths. Since they could play various roles such as maintaining pH stability, preventing precipitation of metal salts, and reducing the concentrations of free metal ions, the concentration of complexing agents in the plating bath is an important parameter for electroless deposition processes. In this research, unstable baths were obtained for insufficient sodium citrate concentrations, and these phenomena were analyzed with ChemEQL. Moreover, the deposition characteristics of electroless Ni-Fe for under bump metallurgy diffusion barriers were also investigated using energy-dispersive spectroscopy and field-emission scanning electron microscopy.

  2. Direct electroless Ni-P deposition on AM50 magnesium alloy from sulfate bath

    Institute of Scientific and Technical Information of China (English)

    LI Guang-yu; NIU Li-yuan; JIANG Zhong-hao; GU Chang-dong; LIAN Jian-she

    2006-01-01

    A bright electroless Ni-P deposition on AM50 magnesium alloy in a sulfate plating bath was proposed by using direct plating process with non-chromate pretreatment. The electroless Ni-P plating on AM50 magnesium alloy has an admirable appearance and good adhesion. The results indicate that the electroless Ni-P deposition with non-chromate pretreatment has better adhesion than that of zinc immersion coating. Anodic polarization curves indicate that the electroless Ni-P deposition obtained from the sulfate bath has similar corrosion-resistance to that obtained from basic nickel carbonate bath. The deposition process generates less pollutant by a non-chromate plating bath and is suitable for the magnesium alloys manufacture because of its low cost. The hardness of the electroless Ni-P plated AM50 is about HV 720.6 and HV 969.7 after heat treatments at 180 ℃ for 2 h. The wear resistance of Ni-P plated magnesium alloy specimens is about 5 to 9 times as high as that of bare magnesium alloys.

  3. A novel Ag catalyzation process using swelling impregnation method for electroless Ni deposition on Kevlar® fiber

    Science.gov (United States)

    Pang, Hongwei; Bai, Ruicheng; Shao, Qinsi; Gao, Yufang; Li, Aijun; Tang, Zhiyong

    2015-12-01

    A novel Ag catalyzation process using swelling impregnation pretreatment method was developed for electroless nickel (EN) deposition on Kevlar fiber. Firstly, the fiber was immersed into an aqueous dimethylsulfoxide (DMSO) solution of silver nitrate to impart silver nitrate into the inner part of the fiber near the surface. Subsequently silver nitrate was reduced to metal silver nanoparticles on the fiber surface by treatment with aqueous solution of sodium borohydride. After electroless plating, a dense and homogeneous nickel coating was obtained on the fiber surface. The silver nanoparticles formed at the fiber surface functioned as a catalyst for electroless deposition as well as an anchor for the plated layer. The study also revealed that the incorporation of surfactant sodium dodecyl sulfate (SDS) in electroless nickel plating bath can enhance the adhesion strength of EN layer with the fiber surface and minimize the surface roughness of the EN coating. The Ni plated Kevlar fiber possessed excellent corrosion resistance and high tensile strength.

  4. ELECTRODIALYSIS AS A TECHNIQUE FOR EXTENDING ELECTROLESS NICKEL BATH LIFE-IMPROVING SELECTIVITY AND REDUCING LOSSES OF VALUABLE BATH COMPONENTS

    Science.gov (United States)

    Over the last decade electrodialysis has emerged as an effective technique for removing accumulated reactant counterions (sodium and sulfate) and reaction products (orthophosphite) that interfere with the electroless nickel plating process, thus extending bath life by up to 50 me...

  5. Optimization of process conditions of electroless nickelphosphorus-zinc alloy plating and its kinetic research%化学镀镍-磷-锌合金工艺条件的优化及其动力学研究

    Institute of Scientific and Technical Information of China (English)

    魏林生; 章亚芳; 蒋柏泉

    2012-01-01

    考察了化学镀Ni-P-Zn的镀液组成、温度以及pH对镀层沉积速率和耐蚀性能的影响,确定了适宜的参数为:硫酸镍0.103 mol/L、次磷酸钠0.226 mol/L、硫酸锌0.028 mol/L和柠檬酸三钠0.29 mol/L,温度90℃,pH=9.0.在此条件下,镀层沉积速率为11.5 μm/(cm2·h),镀层中锌的质量分数为11.9%,钝化后镀层在5%(质量分数)NaC1溶液浸泡试验中的耐腐蚀时间达到1 440h.建立了Ni-P-Zn沉积速率的动力学方程.经实验验证,该数学模型与实验结果吻合度较好,对Ni-P-Zn沉积过程的调节和产物的控制具有一定的指导意义.%The effects of bath composition, temperature, and Ph on the deposition rate and corrosion resistance of electrolessly plated Ni-P-Zn coating were studied. The suitable process parameters were determined as follows: nickel sulfate 0.103 mol/L, sodium hypophosphite 0.226 mol/L, zinc sulfate 0.028 mol/L, trisodium citrate 0.29 mol/L, temperature 90 °C, and Ph 9.0. Under the above conditions, the deposition rate is 11.5 μm/(cm2·h), the mass fraction of zinc in the coating is 11.9%, and the time to failure for the passivated coating in corrosion test by immersion in 5wt% NaCl solution reaches 1 440 h. A kinetic equation of Ni-P-Zn deposition rate was established. Test results proved that the mathematic model is in good agreement with experimental results, which has an guiding significance for Ni-P-Zn deposition process adjustment and product control.

  6. Growth behavior of electroless copper on silicon substrate

    Institute of Scientific and Technical Information of China (English)

    Shin-Shyan Wu; Wei-Long Liu; Ting-Kan Tsai; Shu-Huei Hsieh; Wen-Jauh Chen

    2007-01-01

    The growth behavior containing deposit morphology,growth rate,activation energy,and growth mechanism of copper on silicon substrate,especially at the initial stage,in the electroless plating process was studied.Copper was deposited on the surface of the silicon substrate in an electroless plating bath containing formalin (CH2O 37vol%) as a reducing agent at a pH value of 12.5 and a temperature of 50-75 ℃.The copper deposit was characterized using a field emission scanning electron microscope and transmission electron microscope.The results showed that after the activation process,nanoscale Pd particles were distributed evenly on the surface of the silicon; in the deposition process,copper first nucleated at locations not only near the Pd particles but also between the Pd particles;the growth rate of electroless Cu ranged from 0.517 nm/s at 50 ℃ to 1.929 nm/s at 75 ℃.The activation energy of electroless Cu on Si was 52.97 kJ/mol.

  7. Preparation of copper-coated fine molybdenum powders with electroless technique

    Institute of Scientific and Technical Information of China (English)

    WANG Guang-jun; WANG De-zhi; ZHOU Jie; WU Zhuang-zhi

    2009-01-01

    The molybdenum powders with average particle size of 3 μm were coated with copper by electroless plating. The influence of pretreatment, solution composition and plating conditions on electroless copper plating was studied. The copper-coated molybdenum powders were examined by SEM and XRD. Results indicate that a series of optimization methods is used to add activated sites before electroless copper plating. Taking TEA and EDTA as chief and assistant complex agents respectively, 2,2'-bipyridyl and PEG as double stabilizers, the Mo powders are coated with copper successfully with little Cu2O contained, at the same time, Mo-Cu composite powders with copper content of 15 - 85 wt% can be obtained. The optimal values of pH, temperature and HCHO concentration are 12- 13, 60-65 ℃ and 22-26 mL/L, respectively.

  8. Gold nanostructuring on Si substrate by selective electroless deposition.

    Science.gov (United States)

    Bhuvana, T; Kulkarni, G U

    2007-06-01

    Gold deposition on Si(111) substrates has been carried out by electroless process from KAuCl4 in a fluorinated solution and the resulting nanostructures have been characterized by X-ray diffraction (XRD), atomic force microscopy (AFM), and scanning electron microscopy (SEM). Deposition carried out under normal plating conditions produces an Au film with (111) orientation. The effect of additives such as poly(vinylpyrrolidone) (PVP) and mercaptoundecanoic acid (MUA) to the plating solution has been examined. While PVP induces amorphous deposition, MUA gives rise to flat (111) oriented islands. In order to produce individual nanostructures, we made use of octadecyltrichlorosilane (OTS) as a masking agent and carried out electroless deposition with an intermittent dip in OTS. By varying the durations of dip in the two solutions, various Au nanostructures-islands, cellular networks, and nanowires are obtained.

  9. Electroless synthesis of cellulose-metal aerogel composites

    Science.gov (United States)

    Schestakow, M.; Muench, F.; Reimuth, C.; Ratke, L.; Ensinger, W.

    2016-05-01

    An environmentally benign electroless plating procedure enables a dense coating of silver nanoparticles onto complex cellulose aerogel structures. In the course of the nanoparticle deposition, the morphological characteristics of the aerogel are preserved, such as the continuous self-supporting network structure. While achieving a high metal loading, the large specific surface area as well as the low density is retained in the cellulose-metal aerogel composite. Due to the interesting features of cellulose aerogel substrates (e.g., the accessibility of its open-porous network) and electroless plating (e.g., the possibility to control the density, size, and composition of the deposited metal nanoparticles), the outlined synthetic scheme provides a facile and flexible route towards advanced materials in heterogeneous catalysis, plasmonics, and sensing.

  10. Study of the Electroless Deposition of Ni for Betavoltaic Battery Using PN Junction without Seed Layer

    Directory of Open Access Journals (Sweden)

    Jin Joo Kim

    2015-01-01

    Full Text Available The method and conditions of Ni plating were optimized to maximize the output of a betavoltaic battery using radioactive 63Ni. The difference of the short circuit currents between the pre- and postdeposition of 63Ni on the PN junction was 90 nA at the I-V characteristics. It is suspected that the beta rays emitted from 63Ni did not deeply penetrate into the PN junction due to a Ni seed layer with a thickness of 500 Å. To increase the penetration of the beta rays, electroless Ni plating was carried out on the PN junction without a seed layer. To establish the electroless coating conditions for 63Ni, nonradioactive Ni was deposited onto a Si wafer without flaws on the surface. This process can be applied for electroless Ni plating on a PN junction semiconductor using radioactive 63Ni in further studies.

  11. Ohmic Contacts for Technology for Frequency Agile Digitally Synthesized Transmitters

    Science.gov (United States)

    2010-07-01

    Catalyzed by Ru) Gold potassium cyanide 0.2 g/L Hydrazine hydrate 4ml/L NaOH (pH adjustment) As needed PH 12.2 Temperature 70 - 80°C Table V. Second...electroless Au bath (auto-catalytic). [7] Au Bath #2 (Auto-catalytic) Gold potassium cyanide 5.8 g/L Potassium cyanide 6.5 g/L KOH 11.2 g/L KBH4...result in a non- uniform plating potential (and a non-uniform deposition rate) across the wa- fer. Alternatively, a selective electroless process can

  12. Impact of Specifically Adsorbing Anions on the Electroless Growth of Gold Nanotubes

    OpenAIRE

    Falk Muench; Cornelia Neetzel; Stefan Lauterbach; Hans-Joachim Kleebe; Wolfgang Ensinger

    2012-01-01

    Electroless metal deposition on nanochannel-containing templates is a versatile route towards metal nanotubes and nanowires if the plating reaction can be sufficiently controlled. In this study, disulfitoaurate-formaldehyde-based gold plating baths were modified by the addition of halides, pseudohalides, and EDTA. The introduction of specifically adsorbing anions strongly affected the heterogeneously autocatalyzed plating reaction and allowed the regulation of the reaction rate and the produc...

  13. Structures and magnetic properties of electroless Ni multilayers on Fe/Si substrate.

    Science.gov (United States)

    Chen, Wen Jauh; Hsieh, Shu Huei; Liu, Wei Long; Chen, Wan Ling

    2010-07-01

    Nanosized single and multiple layers of electroless Ni films were deposited on Fe film. The multilayer films consisting of a Fe/(Ni1 Ni2)n structure, where Ni1 and Ni2 denote various electroless Ni films deposited in plating baths with different pH values, and n denotes layer numbers and equals to 2, 4, 8, and 16, were formed by alternately changing the pH value of plating baths under controlled deposition time during the deposition process. The ensuing results showed that the boundaries between films are almost even. The deposition of various electroless Ni films on Fe film can increase the coercivity and squareness ratio of Fe film.

  14. Electroless deposition process for zirconium and zirconium alloys

    Science.gov (United States)

    Donaghy, Robert E.; Sherman, Anna H.

    1981-01-01

    A method is disclosed for preventing stress corrosion cracking or metal embrittlement of a zirconium or zirconium alloy container that is to be coated on the inside surface with a layer of a metal such as copper, a copper alloy, nickel, or iron and used for holding nuclear fuel material as a nuclear fuel element. The zirconium material is etched in an etchant solution, desmutted mechanically or ultrasonically, oxidized to form an oxide coating on the zirconium, cleaned in an aqueous alkaline cleaning solution, activated for electroless deposition of a metal layer and contacted with an electroless metal plating solution. This method provides a boundary layer of zirconium oxide between the zirconium container and the metal layer.

  15. Broadband infrared absorption enhancement by electroless-deposited silver nanoparticles

    DEFF Research Database (Denmark)

    Gritti, Claudia; Raza, Søren; Kadkhodazadeh, Shima

    2017-01-01

    Decorating semiconductor surfaces with plasmonic nanoparticles (NPs) is considered a viable solution for enhancing the absorptive properties of photovoltaic and photodetecting devices. We propose to deposit silver NPs on top of a semiconductor wafer by a cheap and fast electroless plating technique....... Optical characterization confirms that the random array of electroless-deposited NPs improves absorption by up to 20% in a broadband of nearinfrared frequencies from the bandgap edge to 2000 nm. Due to the small filling fraction of particles, the reflection in the visible range is practically unchanged......, which points to the possible applications of such deposition method for harvesting photons in nanophotonics and photovoltaics. The broadband absorption is a consequence of the resonant behavior of particles with different shapes and sizes, which strongly localize the incident light at the interface...

  16. Process for electroless deposition of metals on zirconium materials

    Science.gov (United States)

    Donaghy, Robert E.

    1978-01-01

    A process for the electroless deposition of a metal layer on an article comprised of zirconium or a zirconium alloy is disclosed. The article is activated in an aged aqueous solution comprising from about 10 to about 20 grams per liter ammonium bifluoride and from about 0.75 to about 2 grams per liter of sulfuric acid. The solution is aged by immersion of pickled zirconium in the solution for at least about 10 minutes. The loosely adhering film formed on the article in the activating step is removed and the article is contacted with an electroless plating solution containing the metal to be deposited on the article upon sufficient contact with the article.

  17. Stress of electroless copper deposits on insulating and metal substrates

    Energy Technology Data Exchange (ETDEWEB)

    Brüning, Ralf, E-mail: rbruening@mta.ca [Physics Department, Mount Allison University, Sackville, New Brunswick E4L 1E6 (Canada); Sibley, Allison; Sharma, Tanu; Brown, Delilah A.; Demay, Thibault [Physics Department, Mount Allison University, Sackville, New Brunswick E4L 1E6 (Canada); Brüning, Frank; Bernhard, Tobias [Atotech Deutschland GmbH, Erasmusstrasse 20, 10553 Berlin (Germany)

    2014-08-28

    In the fabrication of printed circuit boards, electroless copper is plated on insulating substrates. However, data for film stress by substrate bending are frequently obtained with metal substrates. We compare the stress evolution on an insulating substrate (acrylonitrile butadiene styrene) with results from commercial Ni–Fe and Cu–Fe alloy test strips, as well as X-ray diffraction based strain data. Tests were done with two plating bath formulations, one with and one without added nickel. Substrate type and condition determine the stress near the beginning of plating. Stress of the Ni-free films depends more strongly on the substrate material. Further, when the samples are cooled from the bath operating temperature to room temperature, the thermal contraction of the insulating substrate compresses the plated thin copper film. The measured stress change agrees with the change predicted by calculation. Data correction methods are discussed, and other substrate materials can be tested readily with the method employed here. - Highlights: • We report stress of electroless Cu deposits on insulating and metal substrates. • The final deposit stress is substrate-independent. • The final deposit stress and the X-ray diffraction based strain agree. • The stress change due to the thermal contraction of the substrate is observed. • Plating bath type, substrate and surface preparation alter the stress.

  18. PLATE

    DEFF Research Database (Denmark)

    Kling, Joyce; Hjulmand, Lise-Lotte

    2008-01-01

    Copenhagen Business School (CBS) finds itself needing to address the issue of English-medium instruction for its increasing number of foreign exchange and full degree students. With internationalisation as a main pillar of the institution’s agenda, there are concerns whether the teaching faculty......’s level of English is sufficient for the increasing number of courses offered in English each semester. This paper addresses these concerns and describes a pilot project initiated in 2003 at CBS to gauge the overall English language proficiency of those teaching content courses in English. Through...... the Project in Language Assessment for Teaching in English (PLATE) language professionals from CBS’s Language Center observe teachers and provide feedback using evaluation criteria from the Common European Framework for Reference (CEFR) supplemented by some additional criteria which take the LSP nature...

  19. Electroless Nickel-Based Catalyst for Diffusion Limited Hydrogen Generation through Hydrolysis of Borohydride

    Directory of Open Access Journals (Sweden)

    Shannon P. Anderson

    2013-07-01

    Full Text Available Catalysts based on electroless nickel and bi-metallic nickel-molybdenum nanoparticles were synthesized for the hydrolysis of sodium borohydride for hydrogen generation. The catalysts were synthesized by polymer-stabilized Pd nanoparticle-catalyzation and activation of Al2O3 substrate and electroless Ni or Ni-Mo plating of the substrate for selected time lengths. Catalytic activity of the synthesized catalysts was tested for the hydrolyzation of alkaline-stabilized NaBH4 solution for hydrogen generation. The effects of electroless plating time lengths, temperature and NaBH4 concentration on hydrogen generation rates were analyzed and discussed. Compositional analysis and surface morphology were carried out for nano-metallized Al2O3 using Scanning Electron Micrographs (SEM and Energy Dispersive X-Ray Microanalysis (EDAX. The as-plated polymer-stabilized electroless nickel catalyst plated for 10 min and unstirred in the hydrolysis reaction exhibited appreciable catalytic activity for hydrolysis of NaBH4. For a zero-order reaction assumption, activation energy of hydrogen generation using the catalyst was estimated at 104.6 kJ/mol. Suggestions are provided for further work needed prior to using the catalyst for portable hydrogen generation from aqueous alkaline-stabilized NaBH4 solution for fuel cells.

  20. Microfluidic Patterning of Metal Structures for Flexible Conductors by In Situ Polymer-Assisted Electroless Deposition.

    Science.gov (United States)

    Liang, Suqing; Li, Yaoyao; Zhou, Tingjiao; Yang, Jinbin; Zhou, Xiaohu; Zhu, Taipeng; Huang, Junqiao; Zhu, Julie; Zhu, Deyong; Liu, Yizhen; He, Chuanxin; Zhang, Junmin; Zhou, Xuechang

    2017-02-01

    A low-cost, solution-processed, versatile, microfluidic approach is developed for patterning structures of highly conductive metals (e.g., copper, silver, and nickel) on chemically modified flexible polyethylene terephthalate thin films by in situ polymer-assisted electroless metal deposition. This method has significantly lowered the consumption of catalyst as well as the metal plating solution.

  1. Broadband infrared absorption enhancement by electroless-deposited silver nanoparticles

    Directory of Open Access Journals (Sweden)

    Gritti Claudia

    2016-07-01

    Full Text Available Decorating semiconductor surfaces with plasmonic nanoparticles (NPs is considered a viable solution for enhancing the absorptive properties of photovoltaic and photodetecting devices. We propose to deposit silver NPs on top of a semiconductor wafer by a cheap and fast electroless plating technique. Optical characterization confirms that the random array of electroless-deposited NPs improves absorption by up to 20% in a broadband of near-infrared frequencies from the bandgap edge to 2000 nm. Due to the small filling fraction of particles, the reflection in the visible range is practically unchanged, which points to the possible applications of such deposition method for harvesting photons in nanophotonics and photovoltaics. The broadband absorption is a consequence of the resonant behavior of particles with different shapes and sizes, which strongly localize the incident light at the interface of a high-index semiconductor substrate. Our hypothesis is substantiated by examining the plasmonic response of the electroless-deposited NPs using both electron energy loss spectroscopy and numerical calculations.

  2. Broadband infrared absorption enhancement by electroless-deposited silver nanoparticles

    Science.gov (United States)

    Gritti, Claudia; Raza, Søren; Kadkhodazadeh, Shima; Kardynal, Beata; Malureanu, Radu; Mortensen, N. Asger; Lavrinenko, Andrei V.

    2017-01-01

    Decorating semiconductor surfaces with plasmonic nanoparticles (NPs) is considered a viable solution for enhancing the absorptive properties of photovoltaic and photodetecting devices. We propose to deposit silver NPs on top of a semiconductor wafer by a cheap and fast electroless plating technique. Optical characterization confirms that the random array of electroless-deposited NPs improves absorption by up to 20% in a broadband of near-infrared frequencies from the bandgap edge to 2000 nm. Due to the small filling fraction of particles, the reflection in the visible range is practically unchanged, which points to the possible applications of such deposition method for harvesting photons in nanophotonics and photovoltaics. The broadband absorption is a consequence of the resonant behavior of particles with different shapes and sizes, which strongly localize the incident light at the interface of a high-index semiconductor substrate. Our hypothesis is substantiated by examining the plasmonic response of the electroless-deposited NPs using both electron energy loss spectroscopy and numerical calculations.

  3. Study of electroless Ni-W-P alloy coating on martensitic stainless steel

    Science.gov (United States)

    Nikitasari, Arini; Mabruri, Efendi

    2016-04-01

    Electroless nickel phospor (Ni-P) is widely used in many industries due to their corrosion and wear resistance, coating uniformity, and ability to coat non-conductive surfaces. The unique properties of tungsten such as high hardness, higher melting point, lower coefficient of linear thermal expansion, and high tensile strength have created a lot of interest in developing ternary Ni-W-P alloys. This article presents the study of electroless Ni-W-P alloys coating using acid or alkaline bath on martensitic stainless steel. Nickel sulfate and sodium tungstate were used as nickel and tungsten sources, respectively, and sodium hypophosphite was used as a reducing agent. Acid or alkaline bath refer to bath pH condition was adjusted by adding sulfuric acid. Martensitic stainless steel was immersed in Ni-W-P bath for 15, 30, and 60 minutes. The substrate of martensitic stainless steel was subjected to pre-treatment (polishing and cleaning) and activation prior to electroless plating. The plating characteristics were investigated for concentration ratio of nickel and hypophosphite (1:3), sodium tungstate concentration 0,1 M, immersion time (15 min, 30 min, 60 min), and bath condition (acid, alkaline). The electroless Ni-W-P plating was heat treated at 400°C for 1 hour. Deposits were characterized using scanning electron microscope (SEM) and corrosion measurement system (CMS).

  4. LY12铝合金表面预先活化处理化学镀镍工艺%Process of electroless nickel plating on previously activated LY12 aluminum alloy

    Institute of Scientific and Technical Information of China (English)

    张书第; 杨国生; 孙拓; 文松林

    2011-01-01

    研究了5种铝合金表面预活化处理工艺对随后化学镀镍层的光亮性及结合力的影响.确定了一种适用于LY12铝合金的碱性活化液配方,可代替浸锌处理.通过正交试验获得了化学镀镍的最佳配方及工艺条件为:硫酸镍25g/L,次磷酸钠22 g/L,柠檬酸钠30 g/L,UDIQ561稳定剂2 mg/L,UDIQ563复合添加剂0.2 mL/L,UDIQ562加速剂1.2 g/L,pH 4.8,温度90°C.该工艺沉积速率达3.50 gm/(cm.h),镀层显微硬度130~160 kgf/mm,镀层中磷含量可达15%(质量分数).获得的化学镀镍层致密、牢固、均匀性良好.该工艺简单,对环境影响不大.%Five processes for pre-activation of the surface of aluminum alloys were studied as related to the brightness and adhesion strength of electroless Ni coating prepared subsequently. An alkaline bath formulation suitable for activation of LY12 aluminum alloy was determined as an alternative to zinc immersion treatment. The optimal bath composition and process conditions were obtained by orthogonal test as follows: nickel sulfate 25 g/L, sodium hypophosphite 22 g/L, sodium citrate 30 g/L, UDIQ561 stabilizing agent 2 mg/L, UDlQ563 composite additive 0.2 mg/L, UDlQ562 accelerating agent 1.2 g/L, temperature 90 ℃ and pH 4.8. The process features deposition rate of 3.50 mg/(cm2.h), coating microhardness of 130-160 kgf/mm2 and phosphorus content of 15wt%. The electroless nickel coatings produced by the process are compact, well-adhered and uniform. The process has advantages of simpleness and environmental friendliness.

  5. Electroless Deposition of Nickel on Photografted Polymeric Microscale Patterns.

    Science.gov (United States)

    Carroll, Gregory T; Lancaster, Jeffrey R; Turro, Nicholas J; Koberstein, Jeffrey T; Mammana, Angela

    2017-01-01

    This report demonstrates the electroless deposition of Ni onto micropatterns of poly (acrylic acid) (PAA) photografted to phthalimide-terminated self-assembled monolayers (SAMs). PAA is spin-coated onto phthalimide SAMs and covered with a photomask. UV irradiation selectively binds PAA to exposed regions of the surface, allowing PAA on unexposed regions to be rinsed off. A Pd catalyst is then selectively adsorbed to regions of the surface where PAA is bound. The adsorbed catalyst selectively initiates Ni plating upon immersion of the substrate into a Ni(SO4 ) bath.

  6. Preparation of CoP films by ultrasonic electroless deposition at low initial temperature

    Institute of Scientific and Technical Information of China (English)

    Yundan Yu; Zhenlun Song; Hongliang Ge; Guoying Wei

    2014-01-01

    Electroless deposition technology has been considered as a kind of common ways to obtain cobalt alloy films. However, in order to get cobalt alloy films, high temperature (353 K) is necessary during the electroless deposition process which will increase costs and energy consumption. Ultrasonic was introduced during electroless plating process to obtain cobalt alloy films at lower initial temperature. It was found that the cobalt thin films could be prepared at lower initial temperature (323 K) with the introduction of ultrasonic. Therefore, different powers of ultrasonic were applied during the electroless deposition process to prepare CoP thin films on copper substrates from an alkaline bath in this investigation. The effects of different powers of ultrasonic on deposition rate, surface morphology, anticorrosion performance and magnetic property of films were studied. It was found that the deposition rate increased gradually with the rise in ultrasonic powers due to cavitation phenomenon. All the CoP films presented the typical spherical nodular structures with the impact of ultrasonic. Smaller and regular shaped structures could be observed when the films were deposited with higher power of ultrasonic which contributed directly to enhancement of anticorrosion performance. Saturation magnetization and coercivity of thin films increased gradually with the rise in ultrasonic powers during the electroless deposition process due to the higher amounts of cobalt.

  7. Electroless Ni-P Deposition on Magnesium Alloy from a Sulfate Bath

    Institute of Scientific and Technical Information of China (English)

    LI Guangyu; NIU Liyuan; JIANG Qing; JIANG Zhonghao; LIAN Jianshe

    2008-01-01

    A technology for electroless Ni-P deposition on AZ91D from a low cost plating bath containing sulfate nickel was proposed.The seal pretreatment was employed before the electroless Ni-P deposition for the sake of occluding the micro holes of the cast magnesium alloy and interdicting the bubble formation in the Ni-P coating during plating process.And pickling pretreatment can provide a better adhesion between the Ni-P deposition and AZ91D substrate.The deposition speed of the Ni-P coating is 29 um/h.The technology is employed to AZ91D magnesium alloy automobile parts and can provide high hardness and high wear-resistant.The weight losses of Ni-P plated and heat-treated Ni-P plated magnesium alloy specimen are only about I/6 and 1/10 that of bare magnesium alloy specimen after l0 min abrasion wear,respectively.The hardness of the electroless Ni-P plated brake pedal support brackets is 674.1 VHN and 935.7 VHN after 2 hours heat treatments at 180 C.The adhesion of Ni-P coatings on magnesium alloy substrates meets the demands of ISO Standards 2819.The technology is environment friendly and cannot cause hazard to environment because of absence of chromate in the whole process.

  8. Electrolytic Recovery of Nickel from Spent Electroless Nickel Bath Solution

    Directory of Open Access Journals (Sweden)

    R. Idhayachander

    2010-01-01

    Full Text Available Plating industry is one of the largest polluting small scale industries and nickel plating is among the important surface finishing process in this industry. The waste generated during this operation contains toxic nickel. Nickel removal and recovery is of great interest from spent bath for environmental and economic reasons. Spent electroless nickel solution from a reed relay switch manufacturing industry situated in Chennai was taken for electrolytic recovery of nickel. Electrolytic experiment was carried out with mild steel and gold coated mild steel as cathode and the different parameters such as current density, time, mixing and pH of the solution were varied and recovery and current efficiency was studied. It was noticed that there was an increase in current efficiency up to 5 A/dm2 and after that it declines. There is no significant improvement with mixing but with modified cathode there was some improvement. Removal of nickel from the spent electroless nickel bath was 81.81% at 5 A/dm2 and pH 4.23. Under this condition, the content of nickel was reduced to 0.94 g/L from 5.16 g/L. with 62.97% current efficiency.

  9. Magnetic Properties and Kinetics Parameters of Electroless Magnetic Loss CoFeB Films

    Institute of Scientific and Technical Information of China (English)

    LIU Chang-hui; HE Hua-hui; SHEN Xiang; LI Hai-hua

    2008-01-01

    Electroless CoFeB films with good soft magnetic properties were fabricated on polyester plastic substrate from sodium tartarate as a complexing agent. The plating rate of electroless CoFeB films is a function of concentration of sodium tetrahydroborate, pH of the plating bath, plating temperature and the metallic ratio. The estimated regression coefficient b0-b3 confidence interval, residual error r and confidence interval rint were confirmed by a computer program. The optimal composition of the plating bath was obtained and the dynamic electromagnetic parameters of films were measured in the 2-10 GHz range. At 2 GHz, the μ′, μ″ of the electroless CoFeB films were 304 and 76.6, respectively, as the concentration of reducer is 1 g/L. Magnetic hysteresis loop of the deposited CoFeB films show a remanence close to the saturation magnetization and coercivity of about 55.7-127.4 A/m. The loops along the hard axis display low anisotropic field Hk of 2 388-3 582 A/m.

  10. Reactions of Ni-B on printed Ag pattern by using nearly neutral electroless bath.

    Science.gov (United States)

    Rha, Sa-Kyun; Kim, Hyung Chul; Lee, Youn-Seoung

    2014-11-01

    In this study, we investigated the characteristics of a nearly neutral Ni source solution including dimethylamine borane (DMAB) used to develop the metal PCB (printed circuit board) of high power LED (light-emitting diode) package. In accordance with the bath temperature ranging from 50 degrees C to 75 degrees C, an electroless Ni-B plating on a screen-printed Ag pattern with an anodized Al substrate was carried out. The depositon rate of the electroless plated Ni-B film at bath temperature ranging from 50 degrees C to 75 degrees C was estimated by measurements of the thickness and the mass. The deposition rates by change of thickness and mass of the electroless plated Ni-B film at 50 degrees C were - 58 nm/min and 0.113 mg/min respectively. The activation energy obtained from slope of Arrhenius plot using these deposition rates was - 59 kJ/mol. Finally, selectively the film growth was achieved at all plating temperatures, without a damage of anodized Al substrate.

  11. Preparation and Corrosion Resistance of Electroless Plating Ni-W-P Alloy%化学镀Ni-W-P薄膜的制备及其耐蚀性能的研究

    Institute of Scientific and Technical Information of China (English)

    卢洁琴; 张晓莉; 卫国英; 余云丹

    2016-01-01

    Objective Ni-W-P coatings were prepared on copper-zinc alloy substrates by electroless deposition to study the anti-corrosion performance. Methods Ni-W-P coatings were prepared by electroless deposition using hypophosphite as reducing agent and sodium citrate as complexing agent in the alkaline solution (pH=11). The investigation was focused on the effects of chemical agents and reaction time on the performance of Ni-W-P coatings. The thickness, surface morphology and corrosion behavior of the coatings were analyzed by X-ray fluorescence analyzer, scanning electron microscopy ( SEM) and electrochemical workstation, re-spectively. Results With the increasing concentrations of reducing agent (0. 1~0. 4 mol/L) and complexing agent (0. 18~0. 28 mol/L), the thickness of the coatings reached the maximum. Especially, Ni-W-P coatings with thickness of 0. 2975 μm and 0. 1978 μm could be obtained respectively in the conditions of 0. 2 mol/L reducing agent and 0. 26 mol/L complexing agent. With the increasing concentration of reducing agent, the surface density increased while the porosity decreased. When the concentration of hypophosphite was 0. 1 mol/L, coatings with smaller particles and porous surface could be obtained. However, dense and uni-form coatings could be detected at the condition of 0. 4 mol/L hypophosphite. Corrosion current density reached the minimum when the reducing agent concentration was 0. 4 mol/L, and the complexing agent concentration was 0. 28 mol/L, which corresponded to 2. 38×10-6 A/cm2 and 2. 23×10-6 A/cm2, respectively. With the increasing concentrations of reducing agent and complexing a-gent, more compact coatings could be prepared. Moreover, along with the increasing reaction time, coating thickness changed sig-nificantly and the corrosion current density decreased. The corrosion current density reached the minimum and Ni-W-P with a thickness of 4. 14 μm could be prepared when the reaction time was 4 hours. Conclusion The coatings with

  12. Preparation of Crosslinked Poly(styrene-methyl methacrylate) Microspheres and Magnetization Processing on Their Surfaces by Electroless Nickel Plating%聚苯乙烯-甲基丙烯酸甲酯交联微球的制备及表面化学镀镍磁性化处理

    Institute of Scientific and Technical Information of China (English)

    华丽; 朱世明; 张蕾; 董桃杏

    2011-01-01

    Crosslinked poly(styrene-methyl methacrylate) microspheres(P(St-MMA))were prepared by dispersion polymerization of styrene(St) and methyl methacrylate(MMA) in mixed solvent of ethanol and deionized water,using azodiisobutyronitrile(AIBN) as the initiator,polyvinylpyrrolidone(PVP) as stabilizer and trimethylolpropane trimethylacrylate(TMPTMA) as crosslinking agent.Microspheres with 3—4 μm in diameter with narrow particle size distribution were achieved by feeding the second monomer under starved condition.Then electroless nickel plating on microspheres were carried out and magnetic microspheres were synthesized suceessfully.Morphology and content of microspheres before and after plating were analyzed by SEM technology coupled with EDAX analysis.The optimal plating condition was: using process II with gel palladium solution as activation step,acid plating solution B with pH of 6.0,adding rate of plating solution of 0.5 mL/min.Under the optimal condition,perfect nickel-plating layer was obtained,which were strongly adhere to macromolecule microspheres without break-off and crazed phenomena during ultrasound and centrifugal process.The mass density of plated Ni-P(St-MMA) microsphere was 2.3—2.5 g/cm3.The microspheres are as light as macromolecule material and show excellent nickel magnetism,which provides a novel adsorptive or catalytic degradation material for pollution control of industrial wastewater.%采用苯乙烯(St)、甲基丙烯酸甲酯(MMA)、偶氮二异丁腈(AIBN)为引发剂,聚乙烯基吡咯烷酮(PVP-K30)为分散剂,无水乙醇和去离子水混合溶液为分散介质,三羟甲基丙烷三甲基丙烯酸酯(TMPTMA)为交联剂,以饥饿态加料方式加入第2种单体,用单分散聚合法制备了粒径分布窄、平均粒径为3~4μm的聚苯乙烯-甲基丙烯酸甲酯(P(St-MMA))交联微球,并对微球表面进行化学镀镍,成功获得了磁性微球。采用扫

  13. Novel technology of electroless Ni-W-P on plastics and its interface behavior

    Institute of Scientific and Technical Information of China (English)

    WANG Tian-xu; HU Yong-jun; MENG Ji-long

    2004-01-01

    The electroless Ni-W-P coatings on polyoxymethylene(POM) were prepared. The POM was pretreated by hot spraying Al powder on it. Before the electroless Ni-W-P deposition, the POM with Al coating was flash plated in alkaline bath. The mechanism of Ni-W-P deposition was studied and the technology was optimized. The XRD analysis shows that the "as-deposited" Ni-W-P plating has mixed crystalline structure. The hardness value of deposits is more than HV700. The abrasion resistance of deposits is six times more than that of POM. Bending test was used to determine the cohesion between the deposits and the substrates. SEM was used to study the behavior of surface abrasion and interface bonding condition. The reason for the excellent cohesion was interpreted.

  14. Electroless fabrication and supercapacitor performance of CNT@NiO-nanosheet composite nanotubes.

    Science.gov (United States)

    Yu, W; Li, B Q; Ding, S J

    2016-02-19

    Composite nanostructures consisting of porous NiO nanosheets on carbon nanotubes (CNTs) are fabricated using a facile and low-cost electroless plating method. The CNTs, modified by a polymer, are adopted as the template upon which porous Ni nanosheets are grown using electroless plating. This is followed by removal of the polymer layer and oxidation of the Ni by controlled thermal annealing. The effect of reductant concentration on the morphology of the NiO nanosheets is studied. The electrochemical characteristics of the nanostructures are measured using chronopotentiometry. Experimental measurements show that the NiO nanosheet covered CNT composite nanostructures exhibit a relatively high specific capacitance of 1177 F g(-1) at a discharge current density of 2 A g(-1), while retaining 89.2% of its initial capacitance at a current density of 2 A g(-1) after 1000 cycles.

  15. Effect of Metalloid Elements on Composition, Structure and Cor-rosion of Electroless Plated Permalloy%类金属元素对化学沉积坡莫合金成分、结构及耐蚀性的影响

    Institute of Scientific and Technical Information of China (English)

    王玲玲; 赵立华; 黄桂芳; 袁晓俭; 张邦维; 张建勇

    2001-01-01

    用化学沉积法在铜和碳钢基体上施镀Ni-Fe-P和Ni-Fe-P-B坡莫合金镀层。X射线衍射测定结果及镀层的腐蚀试验结果表明,镀液中还原剂的浓度、金属盐比及pH值,对镀层成分、晶体结构及耐蚀性能有直接影响。使镀层具有非晶态结构和较强的钝化趋势,是获得耐蚀性良好的镀层的主要条件。适当提高Fe含量,在镀液中加入B元素,有利于提高镀层的耐蚀性。%Cailiao Baohu 2001, 34(1),12~14(Ch). The metalloid elements P, B had an obvious effects on the com-position, structure and corrosion of the electroless plated Permalloy. TheXRF, XRD and electrochemical experimental results showed that thedeposits with various compositions, amorphous or crystalline structurescould be obtained by controlling the pH value, NaH2PO2 and KBH4concentration, and salt ratio FeSO4/(FeSO4+NiSO4). The maximumiron content (38 atom percent) of the coating was obtained at 28 g/LNaH2P04, 0. 5 metallic salt ratio for Ni-Fe-P alloy and 0.4 g/L KBH4for Ni-Fe-P-B alloy deposits. The addition of trace KBH4 could improvethe corrosion resistance of Ni-Fe-P alloy coating in alkaline solution.

  16. EFFECT OF PROCESS OF ELECTROLESS PLATING ON INVESTMENT CASTING ZA93 MAGNESIUM ALLOY%熔模铸造ZA93镁合金的化学镀镍工艺研究

    Institute of Scientific and Technical Information of China (English)

    肖伟; 单大勇; 陈荣石

    2012-01-01

    The effects of the concentration of iodine ion,ammonium bifiuoride and lactic acid on the stability and deposition rate of Ni plating solution have been investigated using investment casting ZA93 alloy as base material.The composition of the plating solution was also optimized.SEM,EDX and XRD have been applied to analyze the microstructure,phase identification,and the elements distribution of the coating.The results showed that the ammonium bifiuoride and iodine ion increased both the stability of the plating solution and the deposition rate,but the effect of lactic acid on the plating solution was more complicated.Compared to the former one,the optimized plating solution showed higher deposition rate and was much more stable.The coating was homogeneous,compact with good adhesion to the base and the structure was amorphous.%以熔模铸造Mg-9 mass%Zn-3 mass%Al(ZA93)镁合金为基底,分别研究碘离子、乳酸和氟化氢铵对化学镀镍的镀液稳定性和镀层沉积速度的影响规律及其反应机理,并在此基础上优化了镀液配方。用扫描电子显微镜(SEM)、能谱(EDX)和X射线衍射(XRD)等方法对优化镀液中试镀得到的Ni-P镀层的显微组织、相结构以及元素组成进行了分析。结果表明,碘离子与氟化氢铵在一定浓度范围内,可以同时提高镀液的稳定性和镀层沉积速度,但乳酸对镀液的影响机制较为复杂。优化配方镀液的稳定性相对原镀液有了明显的提高,同时保持了较高的镀速,得到的镀层组织均匀、致密和结合良好,为非晶态结构。

  17. Effects of Two Purification Pretreatments on Electroless Copper Coating over Single-Walled Carbon Nanotubes

    OpenAIRE

    Zhong Zheng; Lianjie Li; Shijie Dong; Anchun Xiao; Shixuan Sun; Sinian Li

    2014-01-01

    To achieve the reinforcement of copper matrix composite by single-walled carbon nanotubes, a three-step-refluxing purification of carbon nanotubes sample with HNO3-NaOH-HCl was proposed and demonstrated. A previously reported purification process using an electromagnetic stirring with H2O2/HCl mixture was also repeated. Then, the purified carbon nanotubes were coated with copper by the same electroless plating process. At the end, the effects of the method on carbon nanotubes themselves and o...

  18. Towards an electroless deposition of gold on metallic substrates using ionic liquids as electrolytes

    OpenAIRE

    Sá, A. I. Correia de; Quaresma, S.; Eugénio, S.; Rangel, C. M.; Vilar, Rui

    2010-01-01

    Recent research has suggested a number of applications for gold in fuel cells and related hydrogen fuel processing, which include coatings for light weight corrosion resistance bipolar plates and the incorporation of gold as catalyst to provide improvements in electrode conductivity, among others. This paper reports on the electroless deposition of gold on copper substrates from a HAuCl4.3H2O solution in 1-butyl-1-methylpyrrolidinium dicyanamide (BMP-DCA), in normal atmospheric conditions. Th...

  19. Regenerative Electroless Etching of Silicon.

    Science.gov (United States)

    Kolasinski, Kurt W; Gimbar, Nathan J; Yu, Haibo; Aindow, Mark; Mäkilä, Ermei; Salonen, Jarno

    2017-01-09

    Regenerative electroless etching (ReEtching), described herein for the first time, is a method of producing nanostructured semiconductors in which an oxidant (Ox1 ) is used as a catalytic agent to facilitate the reaction between a semiconductor and a second oxidant (Ox2 ) that would be unreactive in the primary reaction. Ox2 is used to regenerate Ox1 , which is capable of initiating etching by injecting holes into the semiconductor valence band. Therefore, the extent of reaction is controlled by the amount of Ox2 added, and the rate of reaction is controlled by the injection rate of Ox2 . This general strategy is demonstrated specifically for the production of highly luminescent, nanocrystalline porous Si from the reaction of V2 O5 in HF(aq) as Ox1 and H2 O2 (aq) as Ox2 with Si powder and wafers.

  20. Direct Ni Electroless Metallization of Poly(etherimide) without Using Palladium as a Catalyst

    Institute of Scientific and Technical Information of China (English)

    MarleneCharbonnier; MauriceRomand; YvesGoepfert

    2004-01-01

    Nickel or copper electroless metallization of polymers needs the grafting of a catalyst (palladium in the Pd(0) oxidation state) on the substrate surface to be coated. Our previous works on this topic [1-5] have allowed to develop a simple, tin-free method to attach Pd(+2) species from a palladium chloride (PdCl2) solution on any insulating surface and subsequently to reduce them, in the wet way, into the Pd(0) oxidation state. This Pd(0) state of the catalyst allows an instantaneous initiation of the Ni or Cu deposit by immersion in a plating bath. As palladium is an expensive chemical, it appears interesting to replace it by Ni(0) or Cu(0) species which are catalysts of their own ion reduction. Concerning the direct Ni electroless plating, the polymer surface (PI) was made catalytic for the electroless process by deposition (spincoating or dipping) of an ultra-thin film of an organic nickel salt in an alcoholic solution. The chemical reduction of this salt, checked by XPS, was performed by chemical or photochemical ways and by plasma. Under these conditions, the initiation, by autocatalysis, of the Ni film deposition in an industrial plating bath was immediate i.e. without any initiation time. The film obtained was homogeneous, dense, bright, well-adhering up to thicknesses reaching 3μm.

  1. Direct Ni Electroless Metallization of Poly(etherimide) without Using Palladium as a Catalyst

    Institute of Scientific and Technical Information of China (English)

    Mariène Charbonnier; Maurice Romand; Yves Goepfert

    2004-01-01

    Nickel or copper electroless metallization of polymers needs the grafting of a catalyst (palladium in the Pd(0) oxidation state) on the substrate surface to be coated. Our previous works on this topic [1-5] have allowed to develop a simple, tin-free method to attach Pd(+2) species from a palladium chloride (PdCl2) solution on any insulating surface and subsequently to reduce them, in the wet way, into the Pd(0) oxidation state. This Pd(0) state of the catalyst allows an instantaneous initiation of the Ni or Cu deposit by immersion in a plating bath. As palladium is an expensive chemical, it appears interesting to replace it by Ni(0) or Cu(0) species which are catalysts of their own ion reduction. Concerning the direct Ni electroless plating, the polymer surface (PI) was made catalytic for the electroless process by deposition (spincoating or dipping) of an ultra-thin film of an organic nickel salt in an alcoholic solution. The chemical reduction of this salt, checked by XPS, was performed by chemical or photochemical ways and by plasma. Under these conditions, the initiation, by autocatalysis, of the Ni film deposition in an industrial plating bath was immediate i.e. without any initiation time. The film obtained was homogeneous, dense, bright, well-adhering up to thicknesses reaching 3 μm.

  2. 氧化锆陶瓷中温化学镀镍三元络合剂的研究%Study on Ternary Complexing Agent for Medium-temperature Electroless Nickel Plating on Zirconia Ceramics

    Institute of Scientific and Technical Information of China (English)

    刘鹏; 杨伏良

    2014-01-01

    Objective In order to obtain Ni-P coating with excellent performance, the ternary complexing agent for medium tem-perature was optimized. Methods By selecting lactic acid, glacial acetic acid and citric acid as complexing agents, using plating speed and phosphorus content as evaluation indicators, the effect of sodium phosphate, lactic acid, glacial acetic acid and citric acid concentration on the plating speed and phosphorus content was studied through designing L9(34 ) orthogonal experiments. Re-sults Considering the plating rate and phosphorus content, the optimal ternary complexing agent system was determined as follows:lactic acid 20 mL/ L, glacial acetic acid 15 mL/ L and citric acid 10 g/ L. The plating speed was 6. 4 milligram per hour and phos-phorus content was 8. 8wt% in this optimal system. Conclusion The results showed that even and compact Ni-P coating with good adhesion could be obtained in the optimized complexing agent system.%目的:优化中温化学镀镍三元络合剂体系,得到性能优良的化学镀镍层。方法选取乳酸、冰乙酸及柠檬酸作为络合剂组分,以镀速和含磷量为考察指标,通过设计 L9(34)正交实验,研究次亚磷酸钠、乳酸、冰乙酸及柠檬酸的浓度对化学镀镀速以及镀层磷含量的影响。结果综合考虑镀速和磷含量,得到的最佳三元络合剂体系为20 mL/ L 乳酸+15 mL/ L 冰乙酸+10 g/ L 柠檬酸,该条件下镀速为6.4 mg/ h,镀层磷质量分数为8.8%。结论采用优化的络合剂体系,可以获得致密均匀、结合力良好的化学镀镍层。

  3. 酸性化学镀法制备泡沫铝用Ni/TiH2包覆粉末发泡剂的工艺及性能研究%Preparation technology and properties of Ni/TiH2 foaming agent for aluminum foam by acidic electroless nickel plating process

    Institute of Scientific and Technical Information of China (English)

    李海普; 宋振伟; 秦春阳; 李星; 钟志辉

    2012-01-01

    The TiH2 foaming particles would show elevated hydrogen releasing temperature and sluggish gas releasing rate after coated with uniform nickel plating with controllable quality by the electroless nick-el plating process in acidic media. The results showed that NiSO4 is the main salt,NaH2PO2 ·H2O is re-ducing agents, Ni/TiH2 composite powder optimal technology conditions are as follows; NiSO4 30 g/L, NaH2PO2·H2O 30 g/L,pH 4. 5~4. 8 , buffer 20 g/L,stabilizer 0. 8 mg/L,complexing agent A 8 ml/L, complexing agent B 18 g/L, and reaction temperature 80℃. Consequently, the obtained TiH2 particles coated with 30% nickel showed better performance in increasing hydrogen releasing temperature by 300℃ when compared to the bare precursor. At the same time, the gas releasing rate was also decreased.%酸性条件下,对常用发泡剂TiH2粉末的表面进行均匀、质量比可控的Ni层包覆,提高其释氢温度并延缓释氢速率.结果表明,以硫酸镍为主盐,NaH2PO2·H2O为还原剂,制备Ni/TiH2复合粉体的最佳工艺条件为:硫酸镍质量浓度30 g/L,NaH2PO2·H2O质量浓度30 g/L,pH值4.5 ~4.8,缓冲剂浓度为20 g/L,稳定剂浓度为0.8 mg/L,络合剂A浓度为8 mL/L,络合剂B浓度为18 g/L,温度为80℃.Ni含量为30% Ni/TiH2复合粉体镀镍后,开始释氢温度比镀镍前提高300℃,同时释氢速率也得到明显减缓.

  4. Study on the electroless silver plating on mercapto modified PET fiber%巯基改性PET纤维及化学镀银电磁屏蔽布的研究

    Institute of Scientific and Technical Information of China (English)

    李莉莉; 王炜

    2011-01-01

    Polyester (PET) fabric was modified by 3-mercaptopropyltriethoxysilane (MPTS), and chemically plated with Ag.The influences of mass fraction of MPTS, the reaction time and the bath ratio of modification solution on the silver plating effect were discussed.The optimal modification process was obtained: w(MPTS)=1 %,120 min, the bath ratio of modification 1:60.The modified PET fabric had uniform and dense silver layer, excellent electroconductive result, and good rubbing resistance.%采用3-巯丙基三乙氧基硅烷(MPTS)对涤纶纤维表面进行巯基改性,并进行化学镀银.讨论改性处理中巯基硅烷的质量分数、反应时间以及改性液浴比对化学镀银效果的影响,优化的改性工艺:w(MPTS)=1%,120 min,浴比1:60.改性后织物表面生成了均匀致密的镀银层,得到效果优良的PET镀银导电布,耐摩擦性较好.

  5. 水曲柳单板化学镀Ni-Cu-P制备木质电磁屏蔽复合材料%Preparation of electromagnetic shielding wood-based composite by electroless Ni-Cu-P plating on fraxinus mandshurica veneer

    Institute of Scientific and Technical Information of China (English)

    惠彬; 李国梁; 李坚; 王立娟

    2014-01-01

    Electromagnetic shielding wood-based composite was prepared by direct electroless Ni-Cu-P plating on fraxinus mandshurica veneer as substrate pretreated with NaBH4 .The effects of NaBH4 concentration,immer-sion time and plating time on metal deposition and surface resistivity were investigated.The morphology and structure of the composite were analyzed by using scanning electron microscopy (SEM)and X-ray diffraction (XRD).Low-resistance measuring instrument and spectrum analyzer were used for measuring surface resistivi-ty and electromagnetic shielding effectiveness.The adhesion strength of layer was measured by vertical pulling method.The results show that the metal deposition and surface resistivity of the composite was 1 1 3 g/m2 and 3 1 8 mΩ/cm2 ,respectively,when the composite was prepared under the conditions that the substrate was trea-ted in 3 g/L NaBH4 solution for 8 min and plated for 25 min.SEM analysis indicates that the layer deposited was uniform,continuous and compact,and the surface of the plated veneer has obvious metallic sheen.XRD a-nalysis indicates that the layer deposited is microcrystalline state,and the adhesion strength between the layer and wood surface is very firm.The plated veneer exhibits electromagnetic shielding effectiveness around 55-60 dB in frequencies from 9 kHz to 1.5 GHz.%以水曲柳单板为基材,利用 NaBH4处理后直接化学镀Ni-Cu-P三元合金制备木质电磁屏蔽复合材料。研究了NaBH4浓度、浸渍时间和施镀时间对金属沉积量和表面电阻率的影响。分别用扫描电镜(SEM)和X射线衍射(XRD)分析了复合材料的表面形貌和组织结构,用低电阻测定仪和频谱仪测定了复合材料的表面电阻率和电磁屏蔽效能,用直拉法测定了镀层附着强度。结果表明,利用3 g/L的NaBH4溶液,前处理8 min,施镀时间25 min,此条件制备的复合材料的金属沉积量为113 g/m2,表面电阻率为318 mΩ/cm2。SEM观察发现镀层均匀、连续和致

  6. The New Plating Process on Plastics

    Institute of Scientific and Technical Information of China (English)

    MakotoImamura; JunOkada; KazuyaSatoh

    2004-01-01

    This process does not use general electroless plating solution containing formaldehyde(carcinogen) and phosphate(the object of waste water regulation). Furthermore. we succeeded in developing a new electroless copper plating solution which is usable semi-permanently by using the special reducing agent, The electroless deposition forms a very thin conductive film on substrate. Therefore, it can prevent some appearance defects (e.g. pits. pin-holes, laminations and inclusions) that occur in the conventional ones. In addition, it is possible to eliminate electroplating of copper from the process by applying the exclusive nickel solution in electroplating. Therefore, the obtained metal parts can be recycled as high quality stainless steel. Given this copper elecltoplating-free process, 25μ m-thick nickel deposition at the stage of electroplating, at least, enables the metal layers to show properties as versatile as those of the conventional(its total thickness is 25μm in the comparative conventional process).

  7. The New Plating Process on Plastics

    Institute of Scientific and Technical Information of China (English)

    Makoto Imamura; Jun Okada; Kazuya Satoh

    2004-01-01

    This process does not use general electroless plating solution containing formaldehyde(carcinogen) and phosphate(the object of waste water regulation). Furthermore, we succeeded in developing a new electroless copper plating solution which is usable semi-permanently by using the special reducing agent. The electroless deposition forms a very thin conductive film on substrate. Therefore, it can prevent some appearance defects (e.g. pits, pin-holes, laminations and inclusions) that occur in the conventional ones. In addition, it is possible to eliminate electroplating of copper from the process by applying the exclusive nickel solution in electroplating. Therefore, the obtained metal parts can be recycled as high quality stainless steel. Given this copper electroplating-free process, 25μ m-thick nickel deposition at the stage of electroplating, at least, enables the metal layers to show properties as versatile as those of the conventional(its total thickness is 25μ m in the comparative conventional process).

  8. A novel electroless silver depositing method for magnesium alloys

    Institute of Scientific and Technical Information of China (English)

    ZHAO Hui; CUI Jian-zhong

    2006-01-01

    Depositing silver on magnesium alloy by both electroless plating and organic coatings was studied. The organic coating was made by immersing samples in organosilicon heat-resisting varnish. In this method the organic coating acts as interlayer between the substrate and silver film. When the reaction starts, silver deposits directly on the interlayer. X-ray diffraction and SEM analysis were used to determine the composition and morphology of the interlayer and silver film. The potentiodynamic polarization curves for corrosion studies of coated magnesium alloys were performed in a corrosive environment of 3.5% NaCl(mass fraction) at neutral pH (6.9). The results indicate that compared with the substrate, the corrosion resistance of coated magnesium alloys increases greatly. Moreover, the method proposed in this work is environmentally friendly, non-toxic chemicals were used. In addition, it provides a new concept for the corrosion inhibition of magnesium alloys.

  9. 用于化学复合镀的Ni3.1B非晶态纳米合金粉体的制备%Preparation of Ni3.1B Amorphous Nano Alloy Particles for Electroless Composite Plating

    Institute of Scientific and Technical Information of China (English)

    王钰蓉; 王文昌; 石建华; 光崎尚利; 陈智栋

    2013-01-01

    Ni3.1B amorphous nano alloy particles used for electroless (Ni-P)-Ni3.1 B composite plating were prepared by chemical reducing method with borohydride(KBH4) as reducing agent.After investigted the effect of KBH4,thiourea and PVP concentration on the size of Ni3.1 B particle,the optimized preparation conditions were obtained as 0.02 mol/L NiCl2-6H2O,0.06 g/L KBH4,2 mg/L thiourea and 0.25 g/L PVP.By analyzing the dispersity and stability of Ni3.1 B particle in the Ni-P-B electrolyte,it was found that sodium alginate has a better coating effect to Ni3.1B particle.%利用化学还原法,以硼氢化钾为还原剂,制备了Ni3.1B非晶态纳米合金粉末,用于化学镀(Ni-P)-Ni3.1B合金镀层.通过对还原剂硼氢化钾、稳定剂硫脲和表面活性剂聚乙烯吡咯烷酮对Ni3.B纳米合金粉末的粒径的影响,确定化学还原法制备Ni3.1B的最佳条件为0.02 mol/L NiCl2 ·6H2O,0.06 g/L KBH4,2mg/L硫脲,0.25 g/L聚乙烯吡咯烷酮.通过对Ni3.1B粉体分散性和在化学镀Ni-P-B合金镀液中的稳定性的研究,发现海藻酸钠对Ni3.1B具有良好的包覆效果.

  10. 包覆Ni-Co-P的钡铁氧体红外-微波一体化隐身材料制备与性能%Preparation of IR and Microwave Absorbing Barium Ferrite Material by Electroless Ni -Co- P Plating

    Institute of Scientific and Technical Information of China (English)

    武晓威; 冯玉杰; 陈宇; 韦韩

    2011-01-01

    In order to obtain IR and microwave absorption properties, Ni - Co - P coated barium ferrite powder was prepared by electroless plating. The structure, micrograph , IR emissivity and microwave absorption properties of samples were characterized by X - ray diffractometer (XRD) , scanning electron microscope (SEM), Fourier transform infrared spectrometer (FT -IR) infrared emissivity measurement instrument and vector network analyzer. The results show that the Ni - Co - P coated barium ferrite powder was spherical. A uniform and compact coating on barium ferrite is obtained. The content of Ni - Co - P metal particles on the barium ferrite powder was 84.14%. The content of Ni was 51.93%. The content of Co was 25.78%. The content of P was 6.43%. IR emissivity of powder decreases to 0.6160, and the bandwidth (< l0dB) is about 3.6GHz at 8 ~ 11. 6GHz. The Ni - Co - P coated barium ferrite will be integrated infrared - microwave stealth materials with developing potential and industrial value.%为了使钡铁氧体粉末具有红外-微波多波段兼容的隐身性能,采用表面改性的方法在钡铁氧 体表面进行Ni - Co -P复合化学镀.借助XRD、SEM、EDX、IR -2双波段发射率测量仪、矢量网络分析仪对包覆前后样品的结构、表面形貌、红外发射率、微波吸收性能进行了表征.结果表明,在钡铁氧体表面包覆的Ni - Co -P合金呈球状,包覆比较均匀;在钡铁氧体粒子上镍钴磷固熔体质量分数约为84.14%,其中镍为51.93%,钴为25.78%,磷为6.43%;镀后样品的红外发射率降至0.6160,对电磁波的反射率小于10dB的频带可达3.6GHz(在8~11.6GHz范围内).本实验制备的钡铁氧体复合粒子有望成为一种极具发展潜力和工业价值的红外-微波一体化隐身材料.

  11. Experimental study on the formation and growth of electroless nickel-boron coatings from borohydride-reduced bath on mild steel

    Energy Technology Data Exchange (ETDEWEB)

    Vitry, Veronique, E-mail: veronique.vitry@umons.ac.be [Service de Metallurgie, Universite de Mons, Rue de l' Epargne 56, 7000 Mons (Belgium); Sens, Adeline [Service de Metallurgie, Universite de Mons, Rue de l' Epargne 56, 7000 Mons (Belgium); Kanta, Abdoul-Fatah [Service de Sciences des Materiaux, Universite de Mons, Rue de l' Epargne 56, 7000 Mons (Belgium); Delaunois, Fabienne [Service de Metallurgie, Universite de Mons, Rue de l' Epargne 56, 7000 Mons (Belgium)

    2012-12-15

    Highlights: Black-Right-Pointing-Pointer Initiation mechanism of electroless Ni-B on St-37 steel has been identified. Black-Right-Pointing-Pointer Different phases of the plating process were observed and identified. Black-Right-Pointing-Pointer Influence of chemical heterogeneity on coating morphology was revealed. Black-Right-Pointing-Pointer Batch replenishment of the plating bath induces new germination phase. - Abstract: Quality and homogeneity of electroless nickel-boron coatings are very important for applications in corrosion and electronics and are completely dependent on the formation of the deposit. The growth and formation process of electroless nickel-boron was investigated by immersing mild steel (St-37) samples in an un-replenished bath for various periods of time (from 5 s to 1 h). The coatings obtained at the different stages of the process were then characterized: thickness was measured by SEM, morphology was observed, weight gain was recorded and top composition of the coatings was obtained from XPS. Three main phases were identified during the coating formation and links between plating time, instantaneous deposition rate, chemistry of last formed deposit and morphology were established. The mechanism for initial deposition on steel substrate for borohydride-reduced electroless nickel bath was also observed. Those results were confronted with chemistry evolution in the unreplenished plating bath during the process. This allowed getting insight about phenomena occurring in the plating bath and their influence on coating formation.

  12. Electroless epitaxial etching for semiconductor applications

    Science.gov (United States)

    McCarthy, Anthony M.

    2002-01-01

    A method for fabricating thin-film single-crystal silicon on insulator substrates using electroless etching for achieving efficient etch stopping on epitaxial silicon substrates. Microelectric circuits and devices are prepared on epitaxial silicon wafers in a standard fabrication facility. The wafers are bonded to a holding substrate. The silicon bulk is removed using electroless etching leaving the circuit contained within the epitaxial layer remaining on the holding substrate. A photolithographic operation is then performed to define streets and wire bond pad areas for electrical access to the circuit.

  13. Preparation and Tribological Properties of Ni-P Electroless Composite Coating Containing Potassium Titanate Whisker

    Institute of Scientific and Technical Information of China (English)

    Yaxu JIN; Lin HUA

    2007-01-01

    Nickel-phosphorus (Ni-P) composite coatings containing potassium titanate (K2Ti6O13) whiskers (PTWs) were prepared by electroless plating. The surface morphology and component of coatings were investigated by scanning electron microscopy (SEM) and energy dispersive X-ray spectroscopy (EDX), respectively before and after wear test. The tribological performance was evaluated using a pin-on-disk wear tester under dry conditions. It is found that the Ni-P-PTWs composite coatings exhibit higher wear resistance than Ni-P and Ni-P-SiC electroless coatings. The favorable effects of PTWs on the tribological properties of the composite coatings are attributed to the super-strong mechanical properties and the specific tunneling structures of PTWs. The PTWs greatly reinforce the structure of the Ni-P-based composite coatings and thereby greatly reduce the adhesive and plough wear of Ni-P-PTWs composite coatings.

  14. Electroless ternary NiCeP coatings: Preparation and characterisation

    Energy Technology Data Exchange (ETDEWEB)

    Balaraju, J.N., E-mail: jnbalraj@nal.res.in [Surface Engineering Division, CSIR National Aerospace Laboratories, Post Bag No. 1779 Bangalore 560017, Karnataka (India); Chembath, Manju [Surface Engineering Division, CSIR National Aerospace Laboratories, Post Bag No. 1779 Bangalore 560017, Karnataka (India)

    2012-10-01

    Highlights: Black-Right-Pointing-Pointer Rare earth element (Ce) has been successfully codeposited in NiP matrix. Black-Right-Pointing-Pointer Surface analysis carried out by XPS showed that the Ce is present in +3 and +4 oxidation state. Black-Right-Pointing-Pointer Palladium stability test indicated that the Ce salts in electroless nickel bath has reduced the stability. Black-Right-Pointing-Pointer Cerium codeposition in NiP matrix has increased the microhardness both in as-plated and annealed conditions. Black-Right-Pointing-Pointer Higher thermal stability has been obtained by Ce incorporation. - Abstract: Electroless ternary NiCeP deposits were prepared from alkaline citrate bath containing nickel sulphate, cerium chloride and sodium hypophosphite. Concentration of rare earth cerium was varied from 1 to 2 g/L to obtain ternary deposits containing variable Ce and P contents. The influence of cerium on the deposit properties was analysed. The deposit exhibited a maximum cerium content of 6.2 {+-} 0.1 wt.% when the cerium chloride concentration was 2 g/L. The result of the Pd stability test showed that the stability of the bath was reduced due to Ce salt addition. The microhardness measurements made on both as-plated and heat treated samples exhibited a peak hardness of 1006 {+-} 11 VHN for cerium concentration of 1.5 g/L. The concept of kinetic strength analysis was proved to be applicable only for binary and not for ternary alloys due to multistep deposition mechanism with different kinetic energies. X-ray diffraction (XRD) patterns of as-plated and heat treated samples revealed peaks corresponding to Ni (1 1 1) and nickel phosphide (Ni{sub 3}P). Higher amount of Ce incorporation in NiP matrix increased the crystallisation temperature of the deposit which could be due to the suppression of nickel crystallisation prior to Ni{sub 3}P compound formation and thus increasing the activation energy for the formation of stable phases. Surface compositional analysis

  15. Impact of Specifically Adsorbing Anions on the Electroless Growth of Gold Nanotubes

    Directory of Open Access Journals (Sweden)

    Falk Muench

    2012-01-01

    Full Text Available Electroless metal deposition on nanochannel-containing templates is a versatile route towards metal nanotubes and nanowires if the plating reaction can be sufficiently controlled. In this study, disulfitoaurate-formaldehyde-based gold plating baths were modified by the addition of halides, pseudohalides, and EDTA. The introduction of specifically adsorbing anions strongly affected the heterogeneously autocatalyzed plating reaction and allowed the regulation of the reaction rate and the product morphology. The new plating baths showed enhanced stability and allowed the synthesis of homogeneous nanotubes of high aspect ratios (>150 in 30 μm thick ion track-etched polymer templates. Depending on the reaction conditions, solid and porous structures consisting of gold nanoparticles of differing size and shape were accessible. The presented strategy offers adapted gold thin films, nanotubes, and nanowires for applications in catalysis or sensing.

  16. Electroless deposition of metal nanoparticle clusters: Effect of pattern distance

    KAUST Repository

    Gentile, Francesco

    2014-04-03

    Electroless plating is a deposition technique in which metal ions are reduced as atoms on specific patterned sites of a silicon surface to form metal nanoparticles (NPs) aggregates with the desired characteristics. Those NPs, in turn, can be used as constituents of surface enhanced Raman spectroscopy substrates, which are devices where the electromagnetic field and effects thereof are giantly amplified. Here, the electroless formation of nanostructures was studied as a function of the geometry of the substrate. High resolution, electron beam lithography techniques were used to obtain nonperiodic arrays of circular patterns, in which the spacing of patterns was varied over a significant range. In depositing silver atoms in those circuits, the authors found that the characteristics of the aggregates vary with the pattern distance. When the patterns are in close proximity, the interference of different groups of adjacent aggregates cannot be disregarded and the overall growth is reduced. Differently from this, when the patterns are sufficiently distant, the formation of metal clusters of NPs is independent on the spacing of the patterns. For the particular subset of parameters used here, this critical correlation distance is about three times the pattern diameter. These findings were explained within the framework of a diffusion limited aggregation model, which is a simulation method that can decipher the formation of nanoaggregates at an atomic level. In the discussion, the authors showed how this concept can be used to fabricate ordered arrays of silver nanospheres, where the size of those spheres may be regulated on varying the pattern distance, for applications in biosensing and single molecule detection.

  17. Effect of gold immersion time on the electrochemical migration property of electroless nickel/immersion gold surface finishing.

    Science.gov (United States)

    Bui, Q V; Yoon, Jeong-Won; Jung, Seung-Boo

    2012-04-01

    In this study, the electrochemical performance of an electroless nickel/immersion gold (ENIG) surface finish was evaluated as a function of the Au immersion time by the water immersion migration test. As the Au plating time increased, the electroless nickel phosphorous (EN-P) changed from amorphous to crystalline and then increased in crystallinity. X-ray diffraction (XRD) was used to evaluate the crystallinity of the plating layer. The electrical resistance of the electrodes was tracked as the sample was immersed in water with a 5 V bias. The microstructures of the electrodes after the electrochemical migration test were observed by using secondary electron microscopy (SEM) and energy dispersive spectroscopy (EDS). As the Au immersion time increased, the EN-P's crystallinity and Au thickness increased. This enhanced the electrochemical migration protection of the surface finish layer.

  18. Effect of 3-Amino-5-mercapto-1,2,4-triazole on Electroless Nickel Deposition

    Institute of Scientific and Technical Information of China (English)

    2008-01-01

    The effects of organic additive, 3-amino-5-mercapto-1,2,4-triazole (AMTA) on bath stability, deposition rate,reaction activation energy, and Ni-P coating composition in acidic electroless nickel plating were investigated.Polarization curve method and infrared reflection spectroscopy were used to analyze the mechanism of the effect of AMTA on electroless nickel deposition. It was observed that AMTA improved bath stability, decreased the deposition rate, and increased the reaction activation energy. It was also revealed that AMTA decreased the phosphorus content and increased the sulfur content in Ni-P coating. In addition, AMTA inhibited the anodic oxidation of hypophosphite and accelerated the cathodic reduction of Ni2+. Infrared reflection spectroscopy result indicates that AMTA was adsorbed on the surface of Ni-P and interacted with Ni2+ to form an AMTA-Ni2+ compound. On the basis of the results of this study,the mechanism of the effect of AMTA on electroless nickel deposition was deduced.

  19. Electroless Plated Nanodiamond Coating for Stainless Steel Passivation

    Energy Technology Data Exchange (ETDEWEB)

    Li, D. [Savannah River Site (SRS), Aiken, SC (United States). Savannah River National Lab. (SRNL); Korinko, P. [Savannah River Site (SRS), Aiken, SC (United States). Savannah River National Lab. (SRNL); Spencer, W. [Savannah River Site (SRS), Aiken, SC (United States). Savannah River National Lab. (SRNL); Stein, E. [Savannah River Site (SRS), Aiken, SC (United States). Savannah River National Lab. (SRNL)

    2016-09-15

    Tritium gas sample bottles and manifold components require passivation surface treatments to minimize the interaction of the hydrogen isotopes with surface contamination on the stainless steel containment materials. Conventional passivation processes using chemical and electrochemical means are usually insufficient to passivate tritium containment vessels and piping. Previous work demonstrated that both nitric acid and citric acid passivation on stainless steel would not prevent the catalyzed isotope exchange reaction H2 + D2 → 2HD, while electropolishing passivation resulted in surfaces that did not catalyze this hydrogen isotope exchange. The current vendor for surface passivation treatment, Tek-Vac Industries Inc., provided the best passivation technology for the stainless steel components used at SRTE. However, this vendor recently built gas sample bottles that failed to meet site criteria and has since ceased operations. The loss of this vendor created a source gap, as well as a knowledge gap. A practical and reliable robust process to develop tritium passive surfaces is needed.

  20. SURFACE METALLIZATION OF CENOSPHERES AND PRECIPITATORS BY ELECTROLESS PLATING

    Institute of Scientific and Technical Information of China (English)

    Chujiang Cai; Zhigang Shen; Mingzhu Wang; Shulin Ma; Yushan Xing

    2003-01-01

    This paper reports the use of a colloidal Pd0 catalysis system to metallize the surface of precipitators separated from coal fly-ash, and metals such as Cu, Ni etc. are deposited on the precipitators surface. Alternatively,according to the characteristic surface of cenospheres, an Ag coating catalysis system is adopted to first deposit Ag on the cenospheres surface, followed, if necessary, by the deposition of other metals such as Cu, Ni, etc. on the Ag coating to produce monolayer and multilayer metal-coated cenospheres. The surface characteristics and the morphologies of the metal coatings are examined in detail with scanning electron microscopy (SEM), energy dispersive spectroscopy (EDX) and X-ray photoelectron spectroscopy (XPS) techniques. It can be shown that the quality of metal coatings derived from the Ag coating catalysis system, is better than that of the colloidal Pd0 catalysis system.

  1. Laser-induced prenucleation of alumina for electroless plating

    NARCIS (Netherlands)

    Shrivastva, P.B.; Harteveld, C.; Boose, C.A.; Kolster, B.H.

    1991-01-01

    This paper deals with the deposition of palladium from decomposition of a thin palladium acetate layer on rough and porous alumina ceramic surfaces by irradiating it with a UV excimer laser. The palladium acetate layer was formed from a combination of propyl glycol methyl ether acetate solvent and p

  2. Electroless plating of gold%金的化学镀

    Institute of Scientific and Technical Information of China (English)

    黎松强; 吴馥萍

    2005-01-01

    随着电子元器件和高密度、高精度多层印制电路板在航天、航空、航海、遥感等领域中获得广泛应用,化学镀金取得了惊人的进展,并有取代电镀金之趋势,为镀金业带来新的生机.文中针对化学镀金中镀液组分的主盐与络合剂、稳定剂和缓冲剂的筛选与优化等关键技术进行了研究和阐述.

  3. A plating method for metal coating of fiber Bragg grating

    Institute of Scientific and Technical Information of China (English)

    Yulong Li; Hua Zhang; Yan Feng; Gang Peng

    2009-01-01

    We present a method for metal coating optical fiber and in-fiber Bragg grating. The technology process which is based on electroless plating and electroplating method is described in detail. The fiber is firstly coated with a thin copper or nickel plate with electroless plating method. Then, a thicker nickel plate is coated on the surface of the conductive layer. Under the optimum conditions, the surfaces of chemical plating and electroplating coatings are all smooth and compact. There is no visible defect found in the cross-section. Using this two-step metallization method, the in-fiber Bragg grating can be well protected and its thermal sensitivity can be enhanced. After the metallization process, the fiber sensor is successfully embedded in the 42CrMo steel by brazing method. Thus a smart metal structure is achieved. The embedding results show that the plating method for metallization protection of in-fiber Bragg grating is effective.

  4. Selective Electroless Silver Deposition on Graphene Edges

    DEFF Research Database (Denmark)

    Durhuus, D.; Larsen, M. V.; Andryieuski, Andrei

    2015-01-01

    We demonstrate a method of electroless selective silver deposition on graphene edges or between graphene islands without covering the surface of graphene. Modifications of the deposition recipe allow for decoration of graphene edges with silver nanoparticles or filling holes in damaged graphene...... on silica substrate and thus potentially restoring electric connectivity with minimal influence on the overall graphene electrical and optical properties. The presented technique could find applications in graphene based transparent conductors as well as selective edge functionalization and can be extended...

  5. Highly adhesive metal plating on Zylon fiber via iodine pretreatment

    Energy Technology Data Exchange (ETDEWEB)

    Fatema, Ummul Khair [Faculty of Textile Science and Technology, Shinshu University, 3-15-1 Tokida, Ueda, Nagano 386-8567 (Japan); Gotoh, Yasuo, E-mail: ygotohy@shinshu-u.ac.jp [Faculty of Textile Science and Technology, Shinshu University, 3-15-1 Tokida, Ueda, Nagano 386-8567 (Japan)

    2011-11-01

    Highly adhesive metal plating was performed on poly(p-phenylene-2,6-benzobisoxazole) fiber named Zylon via iodine pretreatment followed by electroless plating. First, iodine components were selectively doped into the inner part of the fiber near the surface through iodine vapor exposure. The doped iodine was converted to palladium iodide particles by treating with palladium chloride solution. After the reduction of the iodide to metal palladium particles, electroless copper plating was conducted on the fiber. A uniform copper layer was deposited on the fiber surface and exhibited high durability in durability tests such as ultrasonic exposure, tape peeling-off, and corrosion in NaCl solution. This durability was attributed to the palladium particles formed at the fiber surface that served as an anchor for the plated layer as well as an electroless plating catalyst. The plated fibers also possessed electrical conductivity. Although the tensile strength of the Zylon fiber decreased from 5.8 to 4.9 GPa after undergoing the pretreatment and plating processes, the light shielding effect improved the light resistance of the plated fibers in terms of tensile properties. After 18 days of xenon lamp exposure, the plated fibers retained 74% of its initial strength, whereas that of untreated fibers decreased to 43%.

  6. An optimization analysis on electroless deposition of Al{sub 2}O{sub 3}/Cu core-shell nanostructures

    Energy Technology Data Exchange (ETDEWEB)

    Beygi, H., E-mail: hossein.beygi@stu-mail.um.ac.ir [Department of Materials Science and Metallurgical Engineering, Engineering Faculty, Ferdowsi University of Mashhad, Mashhad (Iran, Islamic Republic of); Sajjadi, S.A.; Zebarjad, S.M. [Department of Materials Science and Metallurgical Engineering, Engineering Faculty, Ferdowsi University of Mashhad, Mashhad (Iran, Islamic Republic of)

    2012-11-15

    Highlights: Black-Right-Pointing-Pointer Al{sub 2}O{sub 3}/Cu core-shell nanostructure fabricated by electroless copper plating on Al{sub 2}O{sub 3} particles. Black-Right-Pointing-Pointer Optimization on bath composition and electroless parameters performed by Taguchi method. Black-Right-Pointing-Pointer Using minimum chemicals usage, maximum plating rate of copper obtained. Black-Right-Pointing-Pointer Uniform copper shells with 10 nm thicknesses were fabricated on the Al{sub 2}O{sub 3} nanoparticles. - Abstract: In this study, Al{sub 2}O{sub 3}/Cu core-shell nanostructure was fabricated by electroless plating of copper on Al{sub 2}O{sub 3} particles. In order to reach to the maximum efficiency of electroless deposition, the influence of main effective parameters such as type of pretreatment process, HCHO/CuSO{sub 4}{center_dot}5H{sub 2}O molar ratio, C{sub 4}H{sub 4}O{sub 6}KNa{center_dot}4H{sub 2}O/CuSO{sub 4}{center_dot}5H{sub 2}O molar ratio, pH, pouring rate, concentration of Al{sub 2}O{sub 3} particles, bath temperature, plating time, stirring speed and Al{sub 2}O{sub 3} particle size were investigated. The morphology, uniformity, and chemical composition of the activated and Cu coated Al{sub 2}O{sub 3} particles were characterized by scanning electron microscopy (SEM), transmission electron microscopy (TEM), energy dispersive spectroscopy (EDS) and X-ray diffraction (XRD). The results show that, by optimization on the electroless bath composition and the process parameters, using minimum chemicals usage maximum copper plating rate of 19.51% on the surface of Al{sub 2}O{sub 3} particles is obtained. As result of copper deposition on the surface of Al{sub 2}O{sub 3} nanoparticles, uniform shells with about 10 nm thicknesses was fabricated on the Al{sub 2}O{sub 3} nanoparticles.

  7. 铝表面前处理及化学沉积镍初期行为%Initial Behavior of the Electroless Nickel Deposition on Pretreated Aluminum

    Institute of Scientific and Technical Information of China (English)

    杨丽坤; 杨防祖; 田中群; 周绍民

    2012-01-01

    利用开路电位-时间(EOCP-t)曲线,研究铝表面经浸镍和化学预镀镍前处理后,化学沉积镍的初期行为;通过扫描电子显微镜(SEM)观察铝表面经前处理后的表面形貌.结果表明:未经及经前处理的铝表面,化学沉积镍的初期行为都经历去氧化膜、活化、混合控制以及化学沉积过程.经过浸镍和化学预镀镍前处理后的铝表面附着细小的镍颗粒.依据EOCP-t和SEM的最佳实验结果,在含有络合剂和还原剂的碱性预镀镍溶液中,经二次化学预镀镍前处理,成功实现铝基底弱酸性化学镀镍.所获得的化学镀镍层与铝基底结合牢固,呈团颗粒状形貌和非晶态结构.%The initial behavior of electroless nickel deposition on aluminum pretreated by nickel immersion and electroless nickel pre-plating processes was studied measuring the open circuit potential (OCP) as a function of time (Eocp-f)- Scanning electron microscopy (SEM) was used to observe the surface morphology of the pretreated specimens. During the initial stages of the electroless nickel deposition, all pretreated and un-pretreated aluminum substrates experienced removal of the oxide film, activation, mixed control and electroless nickel deposition. After nickel immersion and electroless nickel pre-plating, fine nickel particles were attached to the surface of the aluminum. Our experimental results, including £ocp-f and SEM, indicate that electroless nickel plating in a weak acidic bath was successfully accomplished on the aluminum pretreated with a double treatment of electroless nickel pre-plating in an alkaline nickel solution containing a complexing agent and a reductant. The nickel coating obtained adhered to the aluminum substrate, had a granular appearance and an amorphous structure.

  8. Electroless nickel alloy deposition on SiO2 for application as a diffusion barrier and seed layer in 3D copper interconnect technology.

    Science.gov (United States)

    Kim, Tae-Yoo; Son, Hwa-Jin; Lim, Seung-Kyu; Song, Young-Il; Park, Hwa-Sun; Suh, Su-Jeong

    2014-12-01

    Electroless Ni-P films were investigated with the aim of application as barrier and seed layers in 3D interconnect technology. Different shapes of blind-via holes were fabricated with a deep reactive ion etcher and SiO2 formed on these holes as an insulating layer. The surface of the substrate has been made hydrophilic by O2 plasma treatment with 100 W of power for 20 min. Electroless Ni-P films were deposited as both a diffusion barrier and a seed layer for Cu filling process. Prior to plating, substrates were activated in a palladium chloride solution after sensitization in a tin chloride solution with various conditions in order to deposit uniform films in TSV. After the formation of the electroless barrier layer, electro Cu was plated directly on the barrier layer. Ni-P films fabricated in blind-via holes were observed by scanning electron microscope. Energy dispersive spectroscopy line scanning was carried out for evaluating the diffusion barrier properties of the Ni-P films. The electroless Ni-P layer worked well as a Cu diffusion barrier until 300 degrees C. However, Cu ions diffused into barrier layer when the annealing temperature increases over 400 degrees C.

  9. Characterization of electroless nickel as a seed layer for silicon solar cell metallization

    Indian Academy of Sciences (India)

    Mehul C Raval; Chetan S Solanki

    2015-02-01

    Electroless nickel plating is a suitable method for seed layer deposition in Ni–Cu-based solar cell metallization. Nickel silicide formation and hence contact resistivity of the interface is largely influenced by the plating process and annealing conditions. In the present work, a thin seed layer is deposited from neutral pH and alkaline electroless nickel baths which are annealed in the range of 400–420°C for silicide morphology and contact resistivity studies. A minimum contact resistivity of 7 m cm2 is obtained for seed layer deposited from alkaline bath. Silicide formation for Pd-activated samples leads to uniform surface morphology as compared with unactivated samples due to non-homogeneous migration of nickel atoms at the interface. Formation of nickel phosphides during annealing and the presence of SiO2 at Ni–Si interface creates isolated Ni2Si–Si interface with limited supply of silicon. Such an interface leads to the formation of high resistivity metal-rich Ni3Si silicide phase which limits the reduction in contact resistivity.

  10. Comparative Study of Electroless Copper Film on Different Self-Assembled Monolayers Modified ABS Substrate

    Directory of Open Access Journals (Sweden)

    Jiushuai Xu

    2014-04-01

    Full Text Available Copper films were grown on (3-Mercaptopropyltrimethoxysilane (MPTMS, (3-Aminopropyltriethoxysilane (APTES and 6-(3-(triethoxysilylpropylamino-1,3,5- triazine-2,4-dithiol monosodium (TES self-assembled monolayers (SAMs modified acrylonitrile-butadiene-styrene (ABS substrate via electroless copper plating. The copper films were examined using scanning electron microscopy (SEM and X-ray diffraction (XRD. Their individual deposition rate and contact angle were also investigated to compare the properties of SAMs and electroless copper films. The results indicated that the formation of copper nuclei on the TES-SAMs modified ABS substrate was faster than those on the MPTMS-SAMs and APTES-SAMs modified ABS substrate. SEM images revealed that the copper film on TES-SAM modified ABS substrate was smooth and uniform, and the density of copper nuclei was much higher. Compared with that of TES-SAMs modified resin, the coverage of copper nuclei on MPTMS and APTES modified ABS substrate was very limited and the copper particle size was too big. The adhesion property test demonstrated that all the SAMs enhanced the interfacial interaction between copper plating and ABS substrate. XRD analysis showed that the copper film deposited on SAM-modified ABS substrate had a structure with Cu(111 preferred orientation, and the copper film deposited on TES-SAMs modified ABS substrate is better than that deposited on MPTMS-SAMs or APTES-SAMs modified ABS resins in electromigrtion resistance.

  11. Comparative study of electroless copper film on different self-assembled monolayers modified ABS substrate.

    Science.gov (United States)

    Xu, Jiushuai; Fan, Ruibin; Wang, Jiaolong; Jia, Mengke; Xiong, Xuanrui; Wang, Fang

    2014-04-15

    Copper films were grown on (3-Mercaptopropyl)trimethoxysilane (MPTMS), (3-Aminopropyl)triethoxysilane (APTES) and 6-(3-(triethoxysilyl)propylamino)-1,3,5- triazine-2,4-dithiol monosodium (TES) self-assembled monolayers (SAMs) modified acrylonitrile-butadiene-styrene (ABS) substrate via electroless copper plating. The copper films were examined using scanning electron microscopy (SEM) and X-ray diffraction (XRD). Their individual deposition rate and contact angle were also investigated to compare the properties of SAMs and electroless copper films. The results indicated that the formation of copper nuclei on the TES-SAMs modified ABS substrate was faster than those on the MPTMS-SAMs and APTES-SAMs modified ABS substrate. SEM images revealed that the copper film on TES-SAM modified ABS substrate was smooth and uniform, and the density of copper nuclei was much higher. Compared with that of TES-SAMs modified resin, the coverage of copper nuclei on MPTMS and APTES modified ABS substrate was very limited and the copper particle size was too big. The adhesion property test demonstrated that all the SAMs enhanced the interfacial interaction between copper plating and ABS substrate. XRD analysis showed that the copper film deposited on SAM-modified ABS substrate had a structure with Cu(111) preferred orientation, and the copper film deposited on TES-SAMs modified ABS substrate is better than that deposited on MPTMS-SAMs or APTES-SAMs modified ABS resins in electromigrtion resistance.

  12. Microstructure and mechanical properties of Ni-P-Si3N4 nanowire electroless composite coatings

    Science.gov (United States)

    Wang, Shilong; Huang, Xuefei; Gong, Mengxiao; Huang, Weigang

    2015-12-01

    In this paper, a new Ni-P-Si3N4 nanowire composite coating has been successfully prepared on AZ31 Mg substrate through electroless deposition technique. The effect of Si3N4 nanowire concentration in the plating bath on the surface morphology, hardness and wear behavior of the composite coatings have been investigated. The results show that when the concentrations of Si3N4 nanowire is 1.5 g/L, the morphology of composite coating appears the fine nodular structure. Moreover, the Si3N4 nanowire is uniformly dispersed in the coating at the 1.5 g/L concentrations of Si3N4 nanowire. But when the concentrations of Si3N4 nanowire in bath over 1.5 g/L, the coatings surface morphology become roughness and some pores appear on the coating surface because of the agglomeration of Si3N4 nanowire. As seen from the experiments results, the microhardness of the composite coating were significantly increased to about 790HV200 as plating, the friction coefficient and wear weight loss of the composite coating is both decreased to the 1/6 of conventional Ni-P electroless coating. These improvements have been attributed to the dispersion strengthening effect of Si3N4 nanowire.

  13. Electroless Ni-P/Ni-B duplex coatings: preparation and evaluation of microhardness, wear and corrosion resistance

    Energy Technology Data Exchange (ETDEWEB)

    Narayanan, T.S.N. Sankara; Krishnaveni, K.; Seshadri, S.K

    2003-12-20

    The present work deals with the formation of Ni-P/Ni-B duplex coatings by electroless plating process and evaluation of their hardness, wear resistance and corrosion resistance. The Ni-P/Ni-B duplex coatings were prepared using dual baths (acidic hypophosphite- and alkaline borohydride-reduced electroless nickel baths) with both Ni-P and Ni-B as inner layers and with varying single layer thickness. Scanning electron microscopy (SEM) was used to assess the duplex interface. The microhardness, wear resistance and corrosion resistance of electroless nickel duplex coatings were compared with electroless Ni-P and Ni-B coatings of similar thickness. The study reveals that the Ni-P and Ni-B coatings are amorphous in their as-plated condition and upon heat-treatment at 450 deg. C for 1 h, both Ni-P and Ni-B coatings crystallize and produce nickel, nickel phosphide and nickel borides in the respective coatings. All the three phases are formed when Ni-P/Ni-B and Ni-B/Ni-P duplex coatings are heat-treated at 450 deg. C for 1 h. The duplex coatings are uniform and the compatibility between the layers is good. The microhardness, wear resistance and corrosion resistance of the duplex coating is higher than Ni-P and Ni-B coatings of similar thickness. Among the two types of duplex coatings studied, hardness and wear resistance is higher for coatings having Ni-B coating as the outer layer whereas better corrosion resistance is offered by coatings having Ni-P coating as the outer layer.

  14. 改善印制电路板化学镀镍耐蚀性的研究进展%Research progress of improvement of corrosion resistance of electroless nickel coating on printed circuit board

    Institute of Scientific and Technical Information of China (English)

    冯立; 何为; 黄雨新; 何杰; 徐缓

    2013-01-01

    在印制电路板化学镀镍/金过程中,镍、金原子固有的结构特征使镍镀层极易被氧化腐蚀,从而影响镀层的可焊性。从化学镀Ni-P基多元合金,引入纳米粒子和稀土材料,以及化学镀Ni-B合金三方面,介绍了改善印制电路板化学镀镍层耐蚀性的研究现状。对印制电路板化学镀镍耐蚀性的改善方法提出了建议。%Oxidation corrosion of nickel coating occurs easily during the electroless nickel/gold plating process on the surface of printed circuit board because of the inherent structure features of nickel and gold atoms, thus affecting the solderability of coating. The research progress of improvement of corrosion resistance of electroless nickel coating on printed circuit board was introduced from three aspects including electroless Ni-P-based multicomponent alloy plating, introduction of nanoparticles and rare earth materials, and electroless Ni-B alloy. Some suggestions about improvement method of corrosion resistance of electroless nickel coating on printed circuit board were proposed.

  15. Effect of temperature on structure and corrosion resistance for electroless NiWP coating

    Indian Academy of Sciences (India)

    M Q YU; Q QIAO; F YOU; C L LI; Y ZHAO; Z Z XIAO; H L LUO; Z F XU; KAZUHIRO MATSUGI; J K YU

    2016-04-01

    The effect of plating temperatures between 60 and 90$^{\\circ}$C on structure and corrosion resistance for electroless NiWP coatings on AZ91D magnesium alloy substrate was investigated. Results show that temperature has a significant influence on the surface morphology and corrosion resistance of the NiWP alloy coating. An increase in temperature will lead to an increase in coating thickness and form a more uniform and dense NiWP coatings. Moreover, cracks were observed by SEM in coating surface and interface at the plating temperature of 90$^{\\circ}$C. Coating corrosion resistance is highly dependent on temperature according to polarization curves. The optimum temperature isfound to be 80$^{\\circ}$C and the possible reasons of corrosion resistance for NiWP coating have been discussed.

  16. Study on Electroless Nickel on Foam Polyurethane%聚氨酯泡沫上化学镀镍研究

    Institute of Scientific and Technical Information of China (English)

    张景怀; 惠志林; 徐惠萍; 方正秋; 余成洲

    2001-01-01

    实验给出了聚氨酯泡沫的粗化和化学镀镍工艺参数;研究了对化学镀镍沉积速度影响的因素,发现温度、还原剂和金属镍盐浓度是主要影响因素,随着温度的升高及还原剂与镍盐浓度的增大,镀速增加.化学镀镍后经电镀、热解和热处理制得泡沫镍.%The process of electroless plating nickel on the polyurethane foam was studied. It was discovered that the main factors affecting plating nickel rate are temperature,concentration of reducing agent and nickel salt. As the temperature rises and the concentration of reducing agent and nickel salt increases,plating nickel rate increases too.Nickel foam was fabricated by electroforming,pyrolyzing and annealing after electroless plating nickel.

  17. GaN Nanowires Synthesized by Electroless Etching Method

    KAUST Repository

    Najar, Adel

    2012-01-01

    Ultra-long Gallium Nitride Nanowires is synthesized via metal-electroless etching method. The morphologies and optical properties of GaN NWs show a single crystal GaN with hexagonal Wurtzite structure and high luminescence properties.

  18. Comparative study of electroless nickel film on different organic acids modified cuprammonium fabric (CF)

    Energy Technology Data Exchange (ETDEWEB)

    Zhao, Hang; Lu, Yinxiang, E-mail: yxlu@fudan.edu.cn

    2016-01-30

    Graphical abstract: - Highlights: • An etchant-free and moderate surface pre-treatment process was studied. • Citric acid, malic acid and oxalic acid were selected as modification agents. • High adhesive nickel coating on cuprammonium fabric was obtained. • The electromagnetic parameters were evaluated from the experimental data. - Abstract: Nickel films were grown on citric acid (CA), malic acid (MA) and oxalic acid (OA) modified cuprammonium fabric (CF) substrates via electroless nickel deposition. The nickel films were examined using scanning electron microscopy (SEM) and X-ray diffraction (XRD). Their individual deposition rate and electromagnetic interference (EMI) shielding effectiveness (SE) were also investigated to compare the properties of electroless nickel films. SEM images illustrated that the nickel film on MA modified CF substrate was smooth and uniform, and the density of nickel nuclei was much higher. Compared with that of CA modified CF, the coverage of nickel nuclei on OA and MA modified CF substrate was very limited and the nickel particles size was too big. XRD analysis showed that the nickel films deposited on the different modified CF substrates had a structure with Ni (1 1 1) preferred orientation. All the nickel coatings via different acid modification were firmly adhered to the CF substrates, as demonstrated by an ultrasonic washing test. The result of tensile test indicated that the electroless nickel plating on CF has ability to strengthen the CF substrate while causes limited effect on tensile elongation. Moreover, the nickel film deposited on MA modified CF substrate showed more predominant in EMI SE than that deposited on CA or OA modified CF.

  19. Process and properties of electroless Ni-Cu-P-ZrO{sub 2} nanocomposite coatings

    Energy Technology Data Exchange (ETDEWEB)

    Ranganatha, S. [Department of Studies in Chemistry, School of Chemical Sciences, Kuvempu University, Shankaraghatta 577451, Shimoga, Karnataka (India); Venkatesha, T.V., E-mail: drtvvenkatesha@yahoo.co.uk [Department of Studies in Chemistry, School of Chemical Sciences, Kuvempu University, Shankaraghatta 577451, Shimoga, Karnataka (India); Vathsala, K. [Nanotribology Laboratory, Mechanical engineering department, Indian Institute of Science, Bangalore (India)

    2012-03-15

    Highlights: Black-Right-Pointing-Pointer The Ni-P and Ni-P-Cu-ZrO{sub 2} coatings were produced by electroless technique. Black-Right-Pointing-Pointer The influence of copper and ZrO{sub 2} nanoparticles on Ni-P was studied. Black-Right-Pointing-Pointer Surface morphology, structure and electrochemical behavior were evaluated. Black-Right-Pointing-Pointer The Ni-Cu-P-ZrO{sub 2} and Ni-P-ZrO{sub 2} coatings are more resistant to corrosion than Ni-P. Black-Right-Pointing-Pointer Introduction of Cu and ZrO{sub 2} in the matrix aids to the enhancement of microhardness. -- Abstract: Electroless Ni-Cu-P-ZrO{sub 2} composite coating was successfully obtained on low carbon steel matrix by electroless plating technique. Coatings with different compositions were obtained by varying copper as ternary metal and nano sized zirconium oxide particles so as to obtain elevated corrosion resistant Ni-P coating. Microstructure, crystal structure and composition of deposits were analyzed by SEM, EDX and XRD techniques. The corrosion behavior of the deposits was studied by anodic polarization, Tafel plots and electrochemical impedance spectroscopy (EIS) in 3.5% sodium chloride solution. The ZrO{sub 2} incorporated Ni-P coating showed higher corrosion resistance than plain Ni-P. The introduction of copper metal into Ni-P-ZrO{sub 2} enhanced the protection ability against corrosion. The influence of copper metal and nanoparticles on microhardness of coatings was evaluated.

  20. Enhancement of the corrosion protection of electroless Ni–P coating by deposition of sonosynthesized ZnO nanoparticles

    Energy Technology Data Exchange (ETDEWEB)

    Sharifalhoseini, Zahra [Sonochemical Research Center, Department of Chemistry, Faculty of Science, Ferdowsi University of Mashhad, 91779 Mashhad (Iran, Islamic Republic of); Entezari, Mohammad H., E-mail: entezari@um.ac.ir [Sonochemical Research Center, Department of Chemistry, Faculty of Science, Ferdowsi University of Mashhad, 91779 Mashhad (Iran, Islamic Republic of); Environmental Chemistry Research Center, Department of Chemistry, Faculty of Science, Ferdowsi University of Mashhad, 91779 Mashhad (Iran, Islamic Republic of)

    2015-10-01

    Graphical abstract: Enhancement of the corrosion protection of electroless Ni–P layer by ZnO nanoparticles deposition and the comparison with the classical and sonochemical Ni–P coatings. - Highlights: • Unique effects of ultrasound were investigated on the anticorrosive performance of electroless Ni–P coating. • Sonoynthesis of ZnO NPs and its deposition were performed on the surface of Ni–P coating. • ZnO as an anticorrosive has a critical role in the multifunctional surfaces. • Electrochemical properties of all fabricated samples were compared with each other. - Abstract: Ni–P coatings were deposited through electroless nickel plating in the presence and absence of ultrasound. The simultaneous synthesis of ZnO nanoparticle and its deposition under ultrasound were also carried out on the surface of Ni–P layer prepared by the classical method. The morphology of the surfaces and the chemical composition were determined by scanning electron microscopy(SEM) and energy dispersive spectroscopy (EDS), respectively. Electrochemical techniques were applied for the corrosion behavior studies. The Ni–P layer deposited by ultrasound showed a higher anticorrosive property than the layer deposited by the classical method. The ZnO nanoparticles deposited on the surface of Ni–P layer significantly improved the corrosion resistance.

  1. The pH-sensitive Pd nanoparticles as ink for ink-jet printing technology and electroless Cu metallic patterns on indium-doped tin oxide substrate

    Energy Technology Data Exchange (ETDEWEB)

    Tseng, Chun-Chieh; Lin, Yi [Medical Device Section, Medical Devices and Opto-Electronics Equipment Department, Metal Industries Research and Development Centre, Kaohsiung 802, Taiwan (China); Liu, Tsai-Yun [Department of Mechanical Engineering and Graduate Institute of Mechanical and Precision Engineering, National Kaohsiung University of Applied Sciences, Kaohsiung 807, Taiwan (China); Nian, Yan-Yu [Graduate School of Defense Science, Chung Cheng Institute of Technology, National Defense University, 335 Taiwan (China); Wang, Min-Wen, E-mail: mwwang@cc.kuas.edu.tw [Department of Mechanical Engineering and Graduate Institute of Mechanical and Precision Engineering, National Kaohsiung University of Applied Sciences, Kaohsiung 807, Taiwan (China); Ger, Ming-Der, E-mail: mingderger@gmail.com [Department of Chemical and Materials Engineering, Chung Cheng Institute of Technology, National Defense University, 335 Taiwan (China)

    2013-06-01

    In this work, a method to fabricate copper pattern on an indium-doped tin oxide (ITO) glass substrate is described. This method involves ink-jet printing of a pH-sensitive chitosan-g-polyvinyl acetate/Pd nanoparticle (CTS-g-PVAc-Pd) based ink on an untreated ITO plate to create the catalytic sites, onto which copper is subsequently deposited by an electroless plating method. To prepare the CTS-g-PVAc-Pd nanoparticles, a pH-sensitive chitosan-g-polyvinyl acetate (CTS-g-PVAc) copolymer is utilized to self-reduce Pd nanoparticles. The pH-sensitive CTS chains function as stabilizing agent for noble metal nanoparticles in acidic ink solution. On the other hand, CTS-g-PVAc copolymers convert to hydrophilic CTS-g-poly(vinyl alcohol) via alkali hydrolysis during the electroless copper plating. Therefore, the copper film with dramatically enhanced adhesion is formed on the surface of ITO glass without special pretreatment step before electroless deposition of copper film. Our results show that this process yields copper line with width down to 60 μm and ITO plated with the copper coating has good electrical conductivity, with an electrical resistivity of about 5.4 μΩ cm. - Highlights: • Chitosan-g-polyvinyl acetate copolymer provides reducing environment for Pd nanoparticles. • pH-sensitive Pd nanoparticles as ink for ink-jet printing. • Patterning Pd catalyst for the electroless deposition of copper patterns. • Method to fabricate copper patterns on In-doped tin oxide substrates. • Ink-jet printing can be directly and easily applied to fabricate metal patterns.

  2. Design, fabrication, and characterization of electroless Ni–P alloy films for micro heating devices

    Energy Technology Data Exchange (ETDEWEB)

    Liu, Bernard Haochih, E-mail: hcliu@mail.ncku.edu.tw [Department of Materials Science and Engineering, National Cheng Kung University, Taiwan (China); Promotion Center for Global Materials Research, National Cheng Kung University, Taiwan (China); Research Center for Energy Technology and Strategy, National Cheng Kung University, Taiwan (China); Liao, Fang-Yi; Chen, Jian-Hong [Department of Materials Science and Engineering, National Cheng Kung University, Taiwan (China)

    2013-06-30

    In this work electroless nickel–phosphorous coatings were used as the micro heaters for scanning thermal microscopy. The deposition of Ni–P alloys not only simplified the microelectromechanical system fabrication steps but also provided flexibility in the tuning of the resistance of the heating elements. Ni–P films were plated on patterned silicon substrates and silicon with a silicon nitride film. The pre-deposition reactive ion etch (RIE) treatment caused a change in surface roughness that enhanced the adhesion of Ni–P coatings. Optimization of RIE parameters and pH values could achieve selective deposition of Ni–P, thus helped the lift-off of a serpentine circuit pattern. The chemical composition and microstructure of Ni–P films affect the electrical properties of micro heaters. Energy-dispersive X-ray spectroscopy identified the Ni–P composition and confirmed its insignificant level of oxidation. The high-temperature X-ray diffraction indicated that the as-deposited film was crystalline Ni, which later transformed into Ni{sub 3}P at higher temperature. The resistivity of Ni–P films was tailored between 10{sup −5} and 10{sup −7} Ω m via a post-deposition annealing, which also obtained a stable temperature coefficient of resistance. Consequently, the performance of micro heaters could be designed with a high degree of flexibility. - Highlights: • We developed a process to fabricate micro heater by Ni–P electroless plating. • Reactive ion etch caused oscillating surface roughness and affected Ni–P adhesion. • Ni{sub 3}P phase precipitates during annealing and reduces resistivity of Ni–P alloys. • Resistivity of Ni–P is tunable from 10{sup −5} to 10{sup −7} Ω m by plating and annealing.

  3. Research on Electroless Silver Conductive Polyester Fabric%化学镀银导电涤纶织物的研究

    Institute of Scientific and Technical Information of China (English)

    董猛; 田俊莹; 江红

    2016-01-01

    Conductive polyester fabric was prepared by electroless silver plating with glucose as a reducing a-gent.The effects of concentration of silver nitrate, glucose concentration, ethanol concentration and reaction time on the conductive properties of polyester fabric were studied.The surface morphology and crystal structure of the silver coating were investigated by SEM and XRD.And electromagnetic shielding performance was also tested. The results showed that electroless silver plating polyester fabric had excellent electrical conductivity and electro-magnetic shielding performance of polyester fabric was remarkably improved by electroless silver plating.%以葡萄糖为还原剂,采用化学镀银法制备导电涤纶织物,研究了硝酸银浓度、葡萄糖浓度、乙醇浓度及反应时间对涤纶织物导电性能的影响,通过SEM和XRD图谱分析导电织物表面形貌与晶体结构,并测试其电磁屏蔽性能。结果表明,化学镀银涤纶织物具有优异的导电性能,且化学镀银后涤纶织物的电磁屏蔽性能明显增加。

  4. Electroless deposition of Ni on template of halloysite and its magnetic property

    Institute of Scientific and Technical Information of China (English)

    FU Yu-bin; ZHANG Li-de; ZHENG Ji-yong

    2004-01-01

    Halloysite template, a ceramic substrate, is of a hollow cylindric structure, on which the fine Pd nanoparticles are uniformly formed by the reduction of palldate chloride to initiate electroless deposition. The electroless deposition of Ni is catalyzed by the Pd particles, which results in a uniform layer of Ni-P alloy on halloysite. The alloy is of a nanocrystalline structure, of which the average diameter is about 6 nm. After being heat-treated at 400 ℃, it contains both Ni and Ni12P5 crystal, meanwhile, the Ni crystal gets larger with an average size of 51.9 nm.The content of phosphorous in the Ni layer has a great influence on crystal structure. The metallized halloysite has a higher inherent coercive force, and a much lower saturation magnetization in its as-plated state, while after heattreatment, the inherent coercive force decreases drastically. These magnetic properties have great relationship with the superparamagnetism of Ni nanocrystalline and the stress anisotropy in Ni layer.

  5. Anisotropic Electroless Deposition on DNA Origami Templates To Form Small Diameter Conductive Nanowires.

    Science.gov (United States)

    Uprety, Bibek; Westover, Tyler; Stoddard, Michael; Brinkerhoff, Kamron; Jensen, John; Davis, Robert C; Woolley, Adam T; Harb, John N

    2017-01-24

    An improved method for the metallization of DNA origami is examined in this work. DNA origami, a simple and robust method for creating a wide variety of nanostructured shapes and patterns, provides an enabling template for bottom-up fabrication of next-generation nanodevices. Selective metallization of these DNA templates is needed to make nanoelectronic devices. Here, we demonstrate a metallization process that uses gold nanorod seeds followed by anisotropic plating to provide improved morphology and greater control of the final metallized width of the structure. In our approach, gold nanorods are attached to an origami template to create a seed layer. Electroless gold deposition is then used to fill the gaps between seeds in order to create continuous, conductive nanowires. Importantly, growth during electroless deposition occurs preferentially in the length direction at a rate that is approximately 4 times the growth rate in the width direction, which enables fabrication of narrow, continuous wires. The electrical properties of 49 nanowires with widths ranging from 13 to 29 nm were characterized, and resistivity values as low as 8.9 × 10(-7) Ω·m were measured. The anisotropic metallization process presented here represents important progress toward the creation of nanoelectronic devices by molecularly directed placement of functional components onto self-assembled biological templates.

  6. Preparation and in-vitro Antibacterial Evaluation of Electroless Silver Coated Polymers.

    Science.gov (United States)

    Fazeli, Mohammad Reza; Hosseini, Vahid; Shamsa, Fazel; Jamalifar, Hossein

    2010-01-01

    Long-term use of indwelling medical catheters has often been hindered by catheter-associated nosocomial infections. In this study the effectiveness of silver coating of polystyrene and polyethylene polymers was investigated. Polymer pieces of 2 cm(2) each were coated with a thin layer of silver using electroless plating technique. Silver-coated polymers were challenged with cultures of four different microorganisms known for their involvement in nosocomial infections in both solid and broth media. The tested bacteria included Staphylococcus aureus, Staphylococcus epidermidis, Escherichia coli and Pseudomonas aeruginosa. Silver release from the coated polymers was 2-5 μg/cm(2) which was confirmed by chemical and biological methods. The silver coating thickness ranged between 20-450 nm. P. aeruginosa and S. aureus were the most adherent bacteria to polystyrene sheets while E. coli showed minimum adherence effect. The survival rate of different bacteria after 80 min in a time course experiment tended to dominate E. coli as the most sensitive bacteria to the effect of silver with zero survival rate while around 4% of P. aeruginosa were detected after same period. Silver coating of indwelling polymers by electroless technique seems promising in combating nosocomial infections due to long-term catheterization.

  7. Electroless Nickel Waste Treatment Status%化学镀镍废液处理研究现状

    Institute of Scientific and Technical Information of China (English)

    陈琳; 李俊儒

    2016-01-01

    The recent years at home and abroad by electrolysis,Progress electroless nickel plating waste liquid membrane separation,chemical precipitation,ion exchange,adsorption,catalytic reduction,and biological methods such treatment.%综述了近年来国内外采用电解法、膜分离法、化学沉淀法、离子交换法、吸附法、催化还原法和生物法等方法处理化学镀镍废液的研究进展。

  8. Ligand-optimized electroless synthesis of silver nanotubes and their activity in the reduction of 4-nitrophenol.

    Science.gov (United States)

    Muench, Falk; Rauber, Markus; Stegmann, Christian; Lauterbach, Stefan; Kunz, Ulrike; Kleebe, Hans-Joachim; Ensinger, Wolfgang

    2011-10-14

    A facile electroless plating procedure for the controlled synthesis of nanoscale silver thin films and derived structures such as silver nanotubes was developed and the products were characterized by SEM, TEM and EDS. The highly stable plating baths consist of AgNO(3) as the metal source, a suitable ligand and tartrate as an environmentally benign reducing agent. Next to the variation of the coordinative environment of the oxidizing component, the influence of the pH value was evaluated. These two governing factors strongly affect the plating rate and the morphology of the developing silver nanoparticle films and can be used to adapt the reaction to synthetic demands. The refined electroless deposition allows the fabrication of homogeneous high aspect-ratio nanotubes in ion track etched polycarbonate. Template-embedded metal nanotubes can be interpreted as parallelled microreactors. Following this concept, both the silver nanotubes and spongy gold nanotubes obtained by the use of the silver structures as sacrificial templates were applied in the reduction of 4-nitrophenol by sodium borohydride, proving to be extraordinarily effective catalysts.

  9. Mechanical and electrochemical properties of ultrasonic-assisted electroless deposition of Ni–B–TiO{sub 2} composite coatings

    Energy Technology Data Exchange (ETDEWEB)

    Niksefat, Vahid; Ghorbani, Mohammad, E-mail: ghorbani@sharif.edu

    2015-06-05

    Highlights: • Ni–B–TiO{sub 2} coatings developed by ultrasonic-assisted electroless method. • Titania improves corrosion resistance and hardness of the Ni–B as-plated coatings. • Titania increases the surface film resistance of the Ni–B as-plated coatings. - Abstract: Nickel–Boron–Titania (Ni–B–TiO{sub 2}) composite coatings were successfully obtained on mild steel (St-37) by simultaneous electroless deposition. TiO{sub 2} particles were dispersed in a suspension by ultrasonic irradiation. The surface morphology, particle size, elemental composition and phase analysis of the coatings were characterized by scanning electron microscopy (SEM), inductively coupled plasma (ICP) and X-ray diffraction (XRD). The hardness and friction coefficient of as- plated and heat treated Ni–B and Ni–B–TiO{sub 2} composite coatings were determined by Vickers diamond indentation and indentation scratch tests and compared with Ni–B coatings. As a result, the hardness (1263 HV) of the as-plated Ni–B–TiO{sub 2} coatings was improved significantly. In addition, the corrosion resistance behavior of the as-plated and heat treated Ni–B and Ni–B–TiO{sub 2} coatings were analyzed by anodic polarization and electrochemical impedance spectroscopic (EIS) studies in a 3.5 wt.% NaCl solution. The as-plated composite coatings (Ni–B–TiO{sub 2}) exhibited enhanced corrosion resistance (0.2 μA/cm{sup 2}) property over Ni–B coatings.

  10. Highly adhesive metal plating on Zylon ® fiber via iodine pretreatment

    Science.gov (United States)

    Fatema, Ummul Khair; Gotoh, Yasuo

    2011-11-01

    Highly adhesive metal plating was performed on poly(p-phenylene-2,6-benzobisoxazole) fiber named Zylon® via iodine pretreatment followed by electroless plating. First, iodine components were selectively doped into the inner part of the fiber near the surface through iodine vapor exposure. The doped iodine was converted to palladium iodide particles by treating with palladium chloride solution. After the reduction of the iodide to metal palladium particles, electroless copper plating was conducted on the fiber. A uniform copper layer was deposited on the fiber surface and exhibited high durability in durability tests such as ultrasonic exposure, tape peeling-off, and corrosion in NaCl solution. This durability was attributed to the palladium particles formed at the fiber surface that served as an anchor for the plated layer as well as an electroless plating catalyst. The plated fibers also possessed electrical conductivity. Although the tensile strength of the Zylon® fiber decreased from 5.8 to 4.9 GPa after undergoing the pretreatment and plating processes, the light shielding effect improved the light resistance of the plated fibers in terms of tensile properties. After 18 days of xenon lamp exposure, the plated fibers retained 74% of its initial strength, whereas that of untreated fibers decreased to 43%.

  11. Process and properties of electroless Ni-W-B amorphous electrical resistance film

    Institute of Scientific and Technical Information of China (English)

    ZHU Xiao-yun; GUO Zhong-cheng; XU Rui-dong

    2004-01-01

    The process and properties of electroless plating Ni-W-B alloy have been studied. The results show that the deposits containing W and B are obtained, and the deposition rate of the bath is increased with increase of W content when a certain amount of sodium tungstate solution is added in the Ni-B bath. The Ni-W-B alloy is amorphous as deposition and its resistivity increases directly with the increase of W content in the coating, but decreases gradually with increasing the deposit thickness. XRD and SEM show that the distributions of W and B in the Ni-W-B alloy film are very uniform and dispersed without any segregation.

  12. Copper/bamboo fabric composite prepared via a silver catalytic electroless deposition process for electromagnetic shielding

    Energy Technology Data Exchange (ETDEWEB)

    Liang, Qian; Lu, Yinxiang [Fudan Univ., Shanghai (China). Dept. of Materials Science

    2013-09-15

    Copper/bamboo fabric composite prepared via a silver catalytic electroless plating process is reported. The microstructure of the composite was analyzed by means of scanning electron microscopy, which illustrated that the copper coating was composed of spherical particles and clusters. The composition and chemical state of the metal layer were measured using X-ray diffraction and energy-dispersive X-ray analysis spectra; copper and a small amount of nickel were detected. Mechanical properties were measured based on a standard (ISO 13934-1:1999) for the fabrics with and without copper coating. The breaking force for the composite was improved by about 16.8% compared to uncoated bamboo fabric. The electromagnetic interference shielding effectiveness of the composite was more than 40 dB at frequencies ranging from 0.2 to 1000MHz. The copper coating on bamboo fabric passed the Scotch {sup registered} -tape test. (orig.)

  13. Electromagnetic Interference Shielding Properties of Electroless Nickel-coated Carbon Fiber Paper Reinforced Epoxy Composites

    Institute of Scientific and Technical Information of China (English)

    CHEN Wei; WANG Jun; WANG Tao; WANG Junpeng; XU Renxin; YANG Xiaoli

    2014-01-01

    Carbon fibers (CFs) were coated with a nickel-phosphorus (Ni-P) film using an electroless plating process. The morphology, elemental composition and phases in the coating layer of the CFs were investigated by scanning electron microscopy (SEM), energy dispersive spectroscopy (EDS) and X-ray diffraction (XRD), respectively. Wet paper-making method was used to prepare nickle coated carbon fiber paper (NCFP). Vacuum assisted infusion molding process (VAIMP) was employed to manufacture the NCFP reinforced epoxy composites, and carbon fiber paper (CFP) reinforced epoxy composites were also produced as a comparison. Electromagnetic interference (EMI) shielding properties of the composites were measured in the 3.22-4.9 GHz frequency range using waveguide method. Both NCFP and CFP reinforced epoxy composites of 0.5 mm thickness exhibited high EMI shielding effectiveness (SE) at 8wt%fiber content, 35 dB and 30 dB, respectively, and reflection was the dominant shielding mechanism.

  14. Periodic nanotemplating by selective deposition of electroless gold island films on particle-lithographed dimethyldichlorosilane layers.

    Science.gov (United States)

    Ahn, Wonmi; Roper, D Keith

    2010-07-27

    Uniform hexagonal arrays of diverse nanotemplated metal structures were formed via selective electroless gold plating on particle-lithographed dimethyldichlorosilane layers. Surface-associated water at silica bead interstices was shown to correlate with the formation of silane rings with outer ring diameters ranging from 522.5+/-29.7 to 1116.9+/-52.6 nm and/or spherical gold nanoparticles with diameters from 145.5+/-20.2 to 389.1+/-51.1 nm in the array. Reproducibility and millimeter-size scalability of the array were achieved without the need for expensive and sophisticated lithography or metal deposition equipment. The formation of each structure was explained on the basis of the silanization mechanism and microscopic characterization, as well as dimensional analysis of the nanostructures. This new, facile, and versatile method enables fine fabrication of regular metal nanoparticle array platforms to improve optical and plasmonic features in nanoelectronics and nanophotonic devices.

  15. STUDY ON THE PROPERTIES OF ELECTROLESS Ni-B%化学镀Ni-B合金镀层性能

    Institute of Scientific and Technical Information of China (English)

    邝刘伟; 范希梅; 郝军; 张会广

    2011-01-01

    In order to enhance the properties of electroless Ni-B, the changes in morphology and performance of electroless Ni-B alloy was studied by changing the contents of reducing agent and adding quantitative sodium acetate. The reasons of the morphology and performance of the electroless Ni-B were improved while adding sodium acetate 12 g/L are analyzed based on crystal structure, coating morphology, hardness, wear curves. It was found that sodium acetate as a buffer can reduce the deposition rate of the chemical plating Ni-B, increase the density of the chemical plating Ni-B, and improve the quality of coating in the process.%通过改变镀液还原剂的含量和加入定量的乙酸钠,研究对化学镀镍硼合金形貌和性能的变化。从晶体结构、镀层形貌、硬度和耐磨曲线等几方面来分析加入乙酸钠12g/L时,化学镀Ni—B合金镀层形貌和性能改善的原因。乙酸钠起到缓冲剂的作用,降低了化学镀Ni—B的镀速,提高了化学镀Ni-B的致密度,改善了镀层的质量从而提高镀层的各种性能。

  16. Kinetics of electroless deposition: the copper-dimethylamine borane system.

    Science.gov (United States)

    Plana, Daniela; Campbell, Andrew I; Patole, Samson N; Shul, Galyna; Dryfe, Robert A W

    2010-06-15

    A kinetic study of the electroless deposition of copper on gold, using dimethylamine borane (DMAB) as a reducing agent, has been carried out. The copper deposition rate in the electroless bath was determined to be 50 nm min(-1), through electrochemical stripping of the copper deposits as well as from direct measurements of the film thickness using atomic force microscopy (AFM). Comparison with a galvanic cell setup, where the two half-reactions were physically separated, yielded a lower deposition rate of 30 nm min(-1). An important kinetic effect of the surface on the oxidation of the reducing agent, and thus on the overall process, was therefore revealed. The efficiency of the process was measured over time, revealing the contribution of side reactions in the cathodic half-cell, particularly during the initial stages of the electroless process.

  17. 化学镍金生产中的问题探讨%Study of problems in the production of electroless nickel/immersion gold process

    Institute of Scientific and Technical Information of China (English)

    张彦峰; 代凤双; 张刚强

    2014-01-01

    This paper mainly discusses the problems encountered in the production of Electroless Nickel/Immersion Gold process, such as diffusion coating, leak-plated, gold surface roughness, combined with our actual situation, solutions and improvements in the process for electroless nickel gold production as well as accumulated valuable experience to improve our company ENIG production levels.%文章主要探讨了化学镍金生产中所遇到的问题,如渗镀、漏镀、金面粗糙问题,结合我公司实际情况,进行的解决和改善的过程,为化学镍金生产积累了宝贵的经验,提高了我公司化学镍金的生产水平。

  18. Optimizing growth conditions for electroless deposition of Au films on Si(111) substrates

    Indian Academy of Sciences (India)

    Bhuvana; G U Kulkarni

    2006-10-01

    Electroless deposition of Au films on Si(111) substrates from fluorinated-aurate plating solutions has been carried out at varying concentrations, deposition durations as well as bath temperatures, and the resulting films were characterized by X-ray diffraction, optical profilometry, atomic force microscopy and scanning electron microscopy. Depositions carried out with dilute plating solutions (< 0.1 mM) at 28°C for 30 min produce epitaxial films exhibiting a prominent Au(111) peak in the diffraction patterns, while higher concentrations or temperatures, or longer durations yield polycrystalline films. In both epitaxial and polycrystalline growth regimes, the film thickness increases linearly with time, however, in the latter case, at a rate an order of magnitude higher. Interestingly, the surface roughness measured using atomic force microscopy shows a similar trend. On subjecting to annealing at 250°C, the roughness of the film decreases gradually. Addition of poly (vinylpyrrolidone) to the plating solution is shown to produce a X-ray amorphous film with nanoparticulates capped with the polymer as evidenced by the core-level photoelectron spectrum. Nanoindentation using AFM has shown the hardness of the films to be much higher (∼ 2.19 GPa) than the bulk value.

  19. Determination of electroless deposition by chemical nickeling

    Directory of Open Access Journals (Sweden)

    M. Badida

    2013-07-01

    Full Text Available Increasing of technical level and reliability of machine products in compliance with the economical and ecological terms belongs to the main trends of the industrial development. During the utilisation of these products there arise their each other contacts and the interaction with the environment. That is the reason for their surface degradation by wear effect, corrosion and other influences. The chemical nickel-plating allows autocatalytic deposition of nickel from water solutions in the form of coherent, technically very profitable coating without usage of external source of electric current. The research was aimed at evaluating the surface changes after chemical nickel-plating at various changes of technological parameters.

  20. Preparation and characterization of electroless Ni–B/nano-SiO2, Al2O3, TiO2 and CuO composite coatings

    Indian Academy of Sciences (India)

    Dursun Ekmekci̇; Ferhat Bülbül

    2015-06-01

    Ni–B/SiO2, Al2O3, TiO2 and CuO composite coatings were successfully obtained by the electroless plating technique. Dispersible SiO2, Al2O3, TiO2 and CuO nanoparticles were co-deposited with electroless Ni–B coating onto AISI-304 steel substrates. Deposits were characterized for its structural properties by X-ray diffraction (XRD). XRD results showed a broad peak of Ni–B and low intensity composite nanoparticle peaks. The surface and cross-section morphology of samples were analysed using a scanning electron microscope (SEM). Surface analysis showed that the incorporation in Ni–B matrix of nano-SiO2, Al2O3, TiO2 and CuO particles increases the nodularity of composite coatings. The deposits are composed of a columnar structure grown along the vertical direction of the substrate surface. The results also show that electroless nanocomposite coatings tend to have greater microhardness compared with the coating without nanoparticles. The increase in the microhardness of the nanocomposite coatings reported in this study is attributed to an effect of dispersion strengthening of ceramic particles in the Ni–B matrix.

  1. Effect of rare element cerium on the morphology and corrosion resistance of electro-less Ni-P coatings

    Directory of Open Access Journals (Sweden)

    Fu Chuan-qi

    2015-01-01

    Full Text Available This paper reports an experimental study on the microstructure and corrosion resistance of electro-less Ni-P coatings with increasing content of the rare element cerium (Ce. Surface morphology and the composition of the electro-less Ni-P coatings were studied by scanning electron microscope (SEM, X-ray energy dispersed analysis (EDS and X-ray diffraction analysis (XRD. Hardness and Adhesive force are researched by a HX-200 Vickers diamond indenter micro-hardness tester. Furthermore, we study the adhesive force by using the Revetest scratch tester. We get the possession of Ce amorphous Ni-P coatings which has excellent properties in anti-corrosion. The effect of the rare element cerium concentration on corrosion resistance of the coatings was evaluated in the groundwater immersion test and porosity test, respectively. The results indicated that added little the rare element cerium into the plating bath increased the phosphorus content of the coatings, decreased the corrosion rates, it also decreases the porosity of the amorphous Ni-P coatings. The lowest corrosion rates of the amorphous Ni-P coatings in groundwater immersion test is 4.1 um · h-1, at the rare element cerium concentration of 0.12g · L-1.

  2. Corrosion and wear properties of Ni-Sn-P ternary deposits on mild steel via electroless method

    Directory of Open Access Journals (Sweden)

    A.P.I. Popoola

    2016-09-01

    Full Text Available The rising necessity to improve corrosion and wear resistance of metals for engineering applications cannot be over emphasized. This has led to employing diverse models, method and techniques to obtain better corrosion and wear resistances for metallic materials and components which will otherwise fail during service. This work investigated the effect of Ni-P binary and Ni-Sn-P ternary electroless depositions on the corrosion and wear behavior of mild steel. Micro-structural examination using scanning electron microscopy (SEM analysis shows finer and more evenly distributed particle orientation across the substrate surface. The Ni-Sn-P ternary deposits on the mild steel displayed from the linear polarization analysis a better corrosion resistance with corrosion rate values of 0.000246 mm/yr as compared with that of the Ni-P binary deposits with 0.016672 mm/yr. Also the coefficient of friction of the unplated sample varies between 0 and 0.08 while for the plated samples the coefficient of friction was relatively lesser and ranged from 0 to 0.02. Significant improvement in corrosion resistance was also indicated by a positive shift in potential. Sliding wear analysis demonstrates consistently enhanced wear resistance of the ternary deposits as well as the binary deposits, with the ternary Sn addition showing better resistance to wear. This work has established that Ni-Sn-P electroless coating of mild steel can be used to improve the corrosion and wear resistance for engineering applications.

  3. Preparation and Properties of Ni-plated Glass Beads/PVC Composite

    Institute of Scientific and Technical Information of China (English)

    ZHANG Wei; WANG Sijie; ZHAO Yang

    2014-01-01

    Ni-plated glass beads (GB) was obtained by electroless plating, based on PVC adhesive, Ni-plated GB/PVC composite was prepared. Temperature insulation, fire retardation and microwave absorption properties were tested, the results showed that the nickel coating was compact and continuous, Ni-plated GB/PVC composite is a kind of excellent temperature insulated, fire retardate and light-weight material, and especially for microwave absorption well;Reflectivity was lower than -2 dB in the frequency range of 11-17 GHz.

  4. Phase composition, microstructure and microhardness of electroless nickel composite coating co-deposited with SiC on cast aluminium LM24 alloy substrate

    OpenAIRE

    2013-01-01

    Electroless Ni–P (EN) and composite Ni–P–SiC (ENC) coatings were developed on cast aluminium alloy substrate, LM24. The coating phase composition, microstructure and microhardness were investigated using X-ray diffraction (XRD), scanning electron microscopy (SEM) and microhardness tester, respectively, on as-plated and heat-treated specimens. The original microstructure of the Ni–P matrix is not affected by the inclusion of the hard particles SiC. No formation of Ni–Si phase was observed up t...

  5. Characterisation of phase composition, microstructure and microhardness of electroless nickel composite coating co-deposited with SiC on casting aluminium LM24 alloy substrate

    OpenAIRE

    2013-01-01

    Electroless Ni-P (EN) and composite Ni-P-SiC (ENC) coatings were developed on cast aluminium alloy, LM24. The coating phase composition, microstructure and microhardness were investigated using X-ray diffraction (XRD), scanning electron microscopy (SEM) and microhardness tester, respectively, on as-plated and heat-treated specimens. The original microstructure of the Ni-P matrix is not affected by the inclusion of the hard particles SiC. No formation of Ni-Si phase was observed upto 500°C of ...

  6. Enhancement of porous silicon photoluminescence by electroless deposition of nickel

    Energy Technology Data Exchange (ETDEWEB)

    Amdouni, S. [Unité de nanomatériaux et photonique, Université El Manar, Faculté des Sciences de Tunis, Département de Physique, 2092 El Manar, Tunis Tunisia (Tunisia); Rahmani, M., E-mail: rahmanimehdi79@yahoo.com [Unité de nanomatériaux et photonique, Université El Manar, Faculté des Sciences de Tunis, Département de Physique, 2092 El Manar, Tunis Tunisia (Tunisia); Zaïbi, M.-A [Unité de nanomatériaux et photonique, Université El Manar, Faculté des Sciences de Tunis, Département de Physique, 2092 El Manar, Tunis Tunisia (Tunisia); Ecole Nationale Supérieure des Ingénieurs de Tunis, Université de Tunis, 5 Avenue Taha Hussein, 1008 Tunis (Tunisia); Oueslati, M. [Unité de nanomatériaux et photonique, Université El Manar, Faculté des Sciences de Tunis, Département de Physique, 2092 El Manar, Tunis Tunisia (Tunisia)

    2015-01-15

    Nickel-porous silicon nanocomposites (PS/Ni) are elaborated by an electroless deposition method using NiCl{sub 2} aqueous solution. The presence of nickel ions in the porous layer is confirmed by Fourier Transformed InfraRed spectroscopy (FTIR) and Raman spectroscopy. The photoluminescence (PL) spectra of PS/Ni, prepared at different electroless durations (t{sub edp}), are analyzed. A remarkable enhancement in the integrated PL intensity of PS containing nickel was observed. The lower t{sub edp} favor the deposition of nickel in PS, hence the silicon dangling bonds at the porous surface are quenched and this was increased the PL intensity. However, for the longer t{sub edp}, the PL intensity has been considerably decreased due to the destruction of some Si nanocrystallites. The PL spectra of PS/Ni, for t{sub edp} less than 8 min, show a multiband profile indicating the creation of new luminescent centers by Ni elements which induces a strong modification in the emission mechanisms. - Highlights: • Deposition of Ni ions into porous silicon (PS) layer using the electroless method. • Formation of Ni–O bonds on the porous layer. • The photoluminescence (PL) intensity of PS is enhanced after Ni deposition. • The increase of the PL is due to the contribution of radiative centers related to Ni.

  7. Carbon black dispersion pre-plating technology for printed wire board manufacturing. Final technology evaluation report

    Energy Technology Data Exchange (ETDEWEB)

    Folsom, D.W.; Gavaskar, A.R.; Jones, J.A.; Olfenbuttel, R.F.

    1993-10-01

    The project compared chemical use, waste generation, cost, and product quality between electroless copper and carbon-black-based preplating technologies at the printed wire board (PWB) manufacturing facility of McCurdy Circuits in Orange, CA. The carbon-black based preplating technology evaluated is used as an alternative process for electroless copper (EC) plating of through-holes before electrolytic copper plating. The specific process used at McCurdy is the BlackHole (BH) technology process, which uses a dispersion of carbon black in an aqueous solution to provide a conductive surface for subsequent electrolytic copper plating. The carbon-black dispersion technology provided effective waste reduction and long-term cost savings. The economic analysis determined that the new process was cost efficient because chemical use was reduced and the process proved more efficient; the payback period was less than 4 yrs.

  8. Colour-Difference Measurement Method for Evaluation of Quality of Electrolessly Deposited Copper on Polymer after Laser-Induced Selective Activation

    Science.gov (United States)

    Gedvilas, Mindaugas; Ratautas, Karolis; Kacar, Elif; Stankevičienė, Ina; Jagminienė, Aldona; Norkus, Eugenijus; Li Pira, Nello; Račiukaitis, Gediminas

    2016-03-01

    In this work a novel colour-difference measurement method for the quality evaluation of copper deposited on a polymer is proposed. Laser-induced selective activation (LISA) was performed onto the surface of the polycarbonate/acrylonitrile butadiene styrene (PC/ABS) polymer by using nanosecond laser irradiation. The laser activated PC/ABS polymer was copper plated by using the electroless copper plating (ECP) procedure. The sheet resistance measured by using a four-point probe technique was found to decrease by the power law with the colour-difference of the sample images after LISA and ECP procedures. The percolation theory of the electrical conductivity of the insulator conductor mixture has been adopted in order to explain the experimental results. The new proposed method was used to determine an optimal set of the laser processing parameters for best plating conditions.

  9. Corrosion Resistance of Electroless Ni-Cu-P Ternary Alloy Coatings in Acidic and Neutral Corrosive Mediums

    Directory of Open Access Journals (Sweden)

    Mbouillé Cissé

    2010-01-01

    Full Text Available Electroless Ni-Cu-P alloy coatings were deposited on the ordinary steel substrate in an acidic hypophosphite-type plating bath. These coatings were characterized by a scanning electron microscope (SEM and an X-ray diffraction. The micrograph shows that coating presents a nodular aspect and is relatively homogeneous and very smooth. The EDX analysis shows that the coating contains 12 wt.% of phosphorus element with a predominance of nickel element. In addition, the anticorrosion properties of the Ni-Cu-P coatings in 1 M HCl, 1 M H2SO4, and 3% NaCl solutions were investigated using Tafel polarization curves, electrochemical impedance spectroscopy, and SEM/EDX analysis. The result showed a marginal improvement in corrosion resistance in 3% NaCl solution compared to acidic medium. It also showed that the corrosion mechanism depends on the nature of the solution.

  10. 钕铁硼磁体表面化学镀 Ni-Cu-P 合金工艺及性能研究%Process and Performance Study on Electroless Plating Ni-Cu-P Alloy on Nd-Fe-B Magnet

    Institute of Scientific and Technical Information of China (English)

    王勇; 张祖军

    2013-01-01

    This paper studies the process of plating Ni‐Cu‐P alloy on Nd‐Fe‐B magnet surface .The scanning electron microscopy (SEM ) pictures display Ni‐Cu‐P alloy coating is homogeneous cell structure .X‐ray diffraction pattern analysis results show this coating is in microcrystalline state .Therefore ,the Ni‐Cu‐P alloy coating has good corrosion resistance and wear resistance ,being able to meet the requirement of industrial application .%  研究了Nd-Fe-B磁体表面化学镀Ni-Cu-P合金的工艺过程。扫描电镜照片显示Ni-Cu-P合金镀层呈胞状结构,颗粒较均匀;X射线衍射图谱分析,该镀层为微晶状态。通过该工艺得到的 Ni -Cu-P合金镀层有良好的耐腐蚀性和耐磨性能,符合工业应用要求。

  11. Effects of Two Purification Pretreatments on Electroless Copper Coating over Single-Walled Carbon Nanotubes

    Directory of Open Access Journals (Sweden)

    Zhong Zheng

    2014-01-01

    Full Text Available To achieve the reinforcement of copper matrix composite by single-walled carbon nanotubes, a three-step-refluxing purification of carbon nanotubes sample with HNO3-NaOH-HCl was proposed and demonstrated. A previously reported purification process using an electromagnetic stirring with H2O2/HCl mixture was also repeated. Then, the purified carbon nanotubes were coated with copper by the same electroless plating process. At the end, the effects of the method on carbon nanotubes themselves and on copper coating were determined by transmission electron microscope spectroscopy, scanning electron microscope spectroscopy, X-ray diffractometry, thermogravimetric analysis, Fourier transformed infrared spectroscopy, and energy dispersive spectrometry. It was clearly confirmed that both of the two processes could remove most of iron catalyst particles and carbonaceous impurities without significant damage to carbon nanotubes. The thermal stability of the sample purified by H2O2/HCl treatment was slightly higher than that purified by HNO3-NaOH-HCl treatment. Nevertheless, the purification by HNO3-NaOH-HCl treatment was more effective for carboxyl functionalization on nanotubes than that by H2O2/HCl treatment. The Cu-coating on carbon nanotubes purified by both purification processes was complete, homogenous, and continuous. However, the Cu-coating on carbon nanotubes purified by H2O2/HCl was oxidized more seriously than those on carbon nanotubes purified by HNO3-NaOH-HCl treatment.

  12. Polystyrene as a zwitter resist in electron beam lithography based electroless patterning of gold

    Indian Academy of Sciences (India)

    T Bhuvana; G U Kulkarni

    2008-06-01

    The resist action of polystyrene (w, 2,600,000) towards electroless deposition of gold on Si(100) surface following cross-linking by exposing to a 10 kV electron beam, has been investigated employing a scanning electron microscope equipped with electron beam lithography tool. With a low dose of electrons (21 C/cm2), the exposed regions inhibited the metal deposition from the plating solution due to cross-linking—typical of the negative resist behaviour of polystyrene, with metal depositing only on the developed Si surface. Upon increased electron dosage (160 C/cm2), however, Au deposition took place even in the exposed regions of the resist, thus turning it into a positive resist. Raman measurement revealed amorphous carbon present in the exposed region that promotes metal deposition. Further increase in dosage led successively to negative (220 C/cm2) and positive (13,500 C/cm2) resist states. The zwitter action of polystyrene resist has been exploited to create line gratings with pitch as low as 200 nm and gap electrodes down to 80 nm.

  13. Microstructure and corrosion behavior of electroless deposited Ni-P/CeO2 coating

    Institute of Scientific and Technical Information of China (English)

    Hui Ming Jin; Shi Hang Jiang; Lin Nan Zhang

    2008-01-01

    Electroless Ni-P/nano-CeO2 composite coating was prepared in acidic condition,and its microstructure and corrosive property were compared with its CeO2-free counterpart.Scanning electronic microscopy (SEM) and X-ray diffraction (XRD) spectrometer were used to examine surface morphology and structure of the as-plated coating.Differential scanning calorimeter (DSC) and transmission electronic microscopy (TEM) were used to study the coating's phase change at high temperature.The coating's corrosive behavior in 3%NaCI + 5%H2SO4 solution was also investigated.The results showed that Ni-P coating had partial amorphous structure mixed with nano-crystals,while the Ni-P/CeO2 coating had perfect amorphous structure.In high-temperature condition,Ni3P precipitation and Ni crystallization took place in both coatings but at different temperatures,while the Ni-P/CeO2 coating had sintered phase of NiCe2O4 spinels.The anti-corrosion property was better in the CeO2-containing coating,and this was due to its less liability to undergo local-cell corrosion than its CeO2-free counterpart.Ni-P/CeO2 coating's pure amorphous structure was the result of Ni's hindered crystal-typed deposition and P's promoted deposition.

  14. Stability of nonfouling electroless nickel-polytetrafluoroethylene coatings after exposure to commercial dairy equipment sanitizers.

    Science.gov (United States)

    Huang, Kang; Goddard, Julie M

    2015-09-01

    Application of nonfouling coatings on thermal processing equipment can improve operational efficiency. However, to enable effective commercial translation, a need exists for more comprehensive studies on the stability of nonfouling coatings after exposure to different sanitizers. In the current study, the influence of different commercial dairy equipment sanitizers on the nonfouling properties of stainless steel modified with electroless Ni-polytetrafluoroethylene (PTFE) coatings was determined. Surface properties, such as dynamic contact angle, surface energy, surface morphology, and elemental composition, were measured before and after the coupons were exposed to the sanitizers for 168 cleaning cycles. The fouling behavior of Ni-PTFE-modified stainless steel coupons after exposure was also evaluated by processing raw milk on a self-fabricated benchtop-scale plate heat exchanger. The results indicated that peroxide sanitizer had only minor effect on the Ni-PTFE-modified stainless steel surface, whereas chlorine- and iodine-based sanitizers influenced the surface properties drastically. The coupons after 168 cycles of exposure to peroxide sanitizer accumulated the least amount of fouling material (4.44±0.24mg/cm(2)) compared with the coupons exposed to the other 3 sanitizers. These observations indicated that the Ni-PTFE nonfouling coating retained antifouling properties after 168 cycles of exposure to peroxide-based sanitizer, supporting their potential application as nonfouling coatings for stainless steel dairy processing equipment.

  15. Electroless deposition of Cu on multiwalled carbon nanotubes

    Institute of Scientific and Technical Information of China (English)

    YUAN Dingsheng; LIU Yingliang

    2006-01-01

    Copper has been deposited on the surface of multiwalled carbon nanotubes (MWNTs) and inside MWNTs by electroless deposition. The as-prepared Cu-MWNT composite materials have been characterized by X-ray diffractometer(XRD), transmission electron microscopy (TEM), and electrochemical measurement. XRD analyses showed that Cu was a face-centered cubic (fcc) structure. The average size of Cu was calculated by Scherrer's formula from XRD data, and it was11 nm. TEM revealed that Cu grains on the surface of MWNTs were uniform with the sizes of about 30-60 nm. The electrochemical measurement indicated that Cu-MWNT composite materials possessed fine electron conductivity.

  16. A novel preparation of silver-plated polyacrylonitrile fibers functionalized with antibacterial and electromagnetic shielding properties

    Energy Technology Data Exchange (ETDEWEB)

    Wang, Wei; Li, Weiya; Gao, Cuicui; Tian, Weicheng [College of Chemistry, Chemical Engineering and Biotechnology, Donghua University, Shanghai 201620 (China); Sun, Bin [College of Material Science and Engineering, Donghua University, Shanghai 201620 (China); Yu, Dan, E-mail: yudan@dhu.edu.cn [College of Chemistry, Chemical Engineering and Biotechnology, Donghua University, Shanghai 201620 (China)

    2015-07-01

    Highlights: • We propose a novel modification method to initiate silver electroless plating on PAN fiber without noble metal catalyst. • The silver-plated fiber we fabricated has good electromagnetic shielding effectiveness and antibacterial properties. • The metal layer has good adhesion strength and the properties of the silver-plated fiber can stand 30 cycles of standard washing. - Abstract: Polyacrylonitrile (PAN) fibers with antibacterial, electromagnetic shielding and antistatic functionalities were fabricated in this paper through modifying PAN fibers with (3-aminopropyl)triethoxysilane (APTES) and 3-mercaptopropyltriethoxysilane (MPTES) sequentially and followed with silver electroless plating. The silver layer on PAN fiber surface was characterized by scanning electron microscopy (SEM), atomic force microscopy (AFM) and X-ray diffraction (XRD). The results show that the silver layer was plated uniformly and compactly. The surface resistance of plated fabric was about 40 mΩ/sq on average. The antibacterial tests demonstrate that silver-plated PAN fiber exhibits excellent antibacterial property against S. aureus and E. coli with a non-leaching characteristic. The antibacterial property remains good after 30 cycles of standard washing, which is a strong proof of a durable adhesion between metal layer and fiber. The shielding effectiveness (SE) of silver-plated PAN fabric before and after 30 cycles of standard washing was about 40–80 dB and 35–50 dB, respectively. This resultant fiber can be used in many occasions for reducing or preventing electromagnetic interference (EMI) and electromagnetic hazards.

  17. Comparison of galvanic displacement and electroless methods for deposition of gold nanoparticles on synthetic calcite

    Indian Academy of Sciences (India)

    Chamarthi K Srikanth; P Jeevanandam

    2012-11-01

    Gold nanoparticles have been deposited on synthetic calcite substrate by galvanic displacement reaction and electroless deposition methods. A comparative study has shown that electroless deposition is superior compared to galvanic displacement reaction for uniform deposition of gold nanoparticles on calcite. Characterization of the samples, prepared by two different deposition methods, was carried out by X-ray diffraction, transmission electron microscopy, field emission scanning electron microscopy (FE–SEM) and diffuse reflectance spectroscopy (DRS) measurements. FE–SEM studies prove that smaller nanoparticles of gold are deposited uniformly on calcite if electroless deposition method was employed and DRS measurements show the characteristic surface plasmon resonance of gold nanoparticles.

  18. Hybrid Antifouling and Antimicrobial Coatings Prepared by Electroless Co-Deposition of Fluoropolymer and Cationic Silica Nanoparticles on Stainless Steel: Efficacy against Listeria monocytogenes.

    Science.gov (United States)

    Huang, Kang; Chen, Juhong; Nugen, Sam R; Goddard, Julie M

    2016-06-29

    Controlling formation, establishment, and proliferation of microbial biofilms on surfaces is critical for ensuring public safety. Herein, we report on the synthesis of antimicrobial nanoparticles and their co-deposition along with fluorinated nanoparticles during electroless nickel plating of stainless steel. Plating bath composition is optimized to ensure sufficiently low surface energy to resist fouling and microbial adhesion as well as to exert significant (>99.99% reduction) antimicrobial activity against Listeria monocytogenes. The resulting coatings present hybrid antifouling and antimicrobial character, can be applied onto stainless steel, and do not rely on leaching or migration of the antimicrobial nanoparticles to be effective. Such coatings can support reducing public health issues related to microbial cross-contamination in areas such as food processing, hospitals, and water purification.

  19. Preparation of cuxinygazsen precursor films and powders by electroless deposition

    Science.gov (United States)

    Bhattacharya, Raghu N.; Batchelor, Wendi Kay; Wiesner, Holm; Ramanathan, Kannan; Noufi, Rommel

    1999-01-01

    A method for electroless deposition of Cu.sub.x In.sub.y Ga.sub.z Se.sub.n (x=0-2, y=0-2, z=0-2, n=0-3) precursor films and powders onto a metallic substrate comprising: preparing an aqueous bath solution of compounds selected from the group consisting of: I) a copper compound, a selenium compound, an indium compound and gallium compound; II) a copper compound, a selenium compound and an indium compound; III) a selenium compound, and indium compound and a gallium compound; IV) a selenium compound and a indium compound; and V) a copper compound and selenium compound; each compound being present in sufficient quantity to react with each other to produce Cu.sub.x In.sub.y Ga.sub.z Se.sub.n (x=0-2, y=0-2, z=0-2, n=0-3); adjusting the pH of the aqueous bath solution to an acidic value by the addition of a dilute acid; and initiating an electroless reaction with an oxidizing counterelectrode for a sufficient time to cause a deposit of Cu.sub.x In.sub.y Ga.sub.z Se.sub.n (x=0-2, y=0-2, z=0-2, n=0-3) from the aqueous bath solution onto a metallic substrate.

  20. Synthesis of silver nanotubes by electroless deposition in porous anodic aluminium oxide templates.

    Science.gov (United States)

    Zhang, Shu-Hong; Xie, Zhao-Xiong; Jiang, Zhi-Yuan; Xu, Xin; Xiang, Juan; Huang, Rong-Bin; Zheng, Lan-Sun

    2004-05-07

    An electroless deposition method has been employed for the synthesis of silver nanotubes using porous anodic aluminium oxide as templates, by which high-yield silver nanotubes with length over ten microns have been synthesized.

  1. Room temperature synthesis of indium tin oxide nanotubes with high precision wall thickness by electroless deposition

    OpenAIRE

    Mario Boehme; Emanuel Ionescu; Ganhua Fu; Wolfgang Ensinger

    2011-01-01

    Conductive nanotubes consisting of indium tin oxide (ITO) were fabricated by electroless deposition using ion track etched polycarbonate templates. To produce nanotubes (NTs) with thin walls and small surface roughness, the tubes were generated by a multi-step procedure under aqueous conditions. The approach reported below yields open end nanotubes with well defined outer diameter and wall thickness. In the past, zinc oxide films were mostly preferred and were synthesized using electroless de...

  2. Micro-scale abrasion behaviour of electroless Ni-P-SiC coating on aluminium alloy

    OpenAIRE

    2014-01-01

    Electroless nickel (EN) and electroless nickel composite (ENC) coatings were deposited on aluminium alloy substrate, LM24. The micro abrasion test was conducted to study the wear behaviour of the coatings with the effect of SiC concentration. Microhardness of the coatings was tested also. The wear scars were analysed using optical microscope and scanning electron microscope (SEM). The wear resistance was found to be improved in composite coating that has higher microhardness as compared to pa...

  3. Electrochemical Migration Behavior of Copper-Clad Laminate and Electroless Nickel/Immersion Gold Printed Circuit Boards under Thin Electrolyte Layers

    Directory of Open Access Journals (Sweden)

    Pan Yi

    2017-02-01

    Full Text Available The electrochemical migration (ECM behavior of copper-clad laminate (PCB-Cu and electroless nickel/immersion gold printed circuit boards (PCB-ENIG under thin electrolyte layers of different thicknesses containing 0.1 M Na2SO4 was studied. Results showed that, under the bias voltage of 12 V, the reverse migration of ions occurred. For PCB-Cu, both copper dendrites and sulfate precipitates were found on the surface of FR-4 (board material between two plates. Moreover, the Cu dendrite was produced between the two plates and migrated toward cathode. Compared to PCB-Cu, PCB-ENIG exhibited a higher tendency of ECM failure and suffered from seriously short circuit failure under high relative humidity (RH environment. SKP results demonstrated that surface potentials of the anode plates were greater than those of the cathode plates, and those potentials of the two plates exhibited a descending trend as the RH increased. At the end of the paper, an electrochemical migration corrosion failure model of PCB was proposed.

  4. Effect of Processing Parameters on the Protective Quality of Electroless Nickel-Phosphorus on Cast Aluminium Alloy

    Directory of Open Access Journals (Sweden)

    Olawale Olarewaju Ajibola

    2015-01-01

    Full Text Available The effects of temperature, pH, and time variations on the protective amount and quality of electroless nickel (EN deposition on cast aluminium alloy (CAA substrates were studied. The temperature, pH, and plating time were varied while the surface condition of the substrate was kept constant in acid or alkaline bath. Within solution pH of 5.0–5.5 range, the best quality is obtained in acid solution pH of 5.2. At lower pH (5.0–5.1, good adhesion characterised the EN deposition. Within the range of plating solution pH of 7.0 to 11.5, the highest quantity and quality of EN deposition are obtained on CAA substrate in solution pH of 10.5. It is characterised with few pores and discontinuous metallic EN film. The quantity of EN deposition is time dependent, whereas the adhesion and brightness are not time controlled. The best fit models were developed from the trends of result data obtained from the experiments. The surface morphologies and the chemical composition of the coating were studied using the Jeol JSM-7600F field emission scanning electron microscope.

  5. Electroless-plating technique for fabricating thin-wall convective heat-transfer models

    Science.gov (United States)

    Avery, D. E.; Ballard, G. K.; Wilson, M. L.

    1984-01-01

    A technique for fabricating uniform thin-wall metallic heat-transfer models and which simulates a Shuttle thermal protection system tile is described. Two 6- by 6- by 2.5-in. tiles were fabricated to obtain local heat transfer rates. The fabrication process is not limited to any particular geometry and results in a seamless thin-wall heat-transfer model which uses a one-wire thermocouple to obtain local cold-wall heat-transfer rates. The tile is relatively fragile because of the brittle nature of the material and the structural weakness of the flat-sided configuration; however, a method was developed and used for repairing a cracked tile.

  6. Improvement in Surface Characterisitcs of Polymers for Subsequent Electroless Plating Using Liquid Assisted Laser Processing

    DEFF Research Database (Denmark)

    Marla, Deepak; Zhang, Yang; Jabbaribehnam, Mirmasoud;

    2016-01-01

    Metallization of polymers is a widely used process in the electronic industry that involves their surface modification as a pre-treatment step. Laser-based surface modification is one of the commonly used techniques for polymers due to its speed and precision. The process involves laser heating...... of the polymer surface to generate a rough or porous surface. Laser processing in liquid generates superior surface characteristics that result in better metal deposition. In this study, a comparison of the surface characteristics obtained by laser processing in water vis-à-vis air along with the deposition...

  7. ELECTROLESS PLATING COMPOSITE COATINGS OF Ni-Ti-Re ON THE SURFACE OF DIAMOND

    Institute of Scientific and Technical Information of China (English)

    1999-01-01

    Diamondtoolsaremadegeneralythroughthepowdermetalurgicalsinterproces.Itisobviousthattheinterfaceenergybetwenthediamondandord...

  8. Electroless Ni-P plating with a phytic acid pretreatment on AZ91D magnesium alloy

    Energy Technology Data Exchange (ETDEWEB)

    Cui Xiufang, E-mail: cuixf97721@yahoo.com.cn [School of Materials Science and Chemical Engineering, Harbin Engineering University, 145 Nantong St., Harbin 150001 (China); State Key Laboratory for Corrosion and Protection, Institute of Metal Research, Chinese Academy of Sciences, 62 Wencui Road, Shenyang 110016 (China); Jin Guo; Li Qingfen; Yang Yuyun [School of Materials Science and Chemical Engineering, Harbin Engineering University, 145 Nantong St., Harbin 150001 (China); Li Ying [State Key Laboratory for Corrosion and Protection, Institute of Metal Research, Chinese Academy of Sciences, 62 Wencui Road, Shenyang 110016 (China); Wang Fuhui [School of Materials Science and Chemical Engineering, Harbin Engineering University, 145 Nantong St., Harbin 150001 (China); State Key Laboratory for Corrosion and Protection, Institute of Metal Research, Chinese Academy of Sciences, 62 Wencui Road, Shenyang 110016 (China)

    2010-05-15

    A phytic acid conversion film with especial functional groups was proposed as the pretreatment layer between Ni-P coating and AZ91D magnesium alloy substrate, to replace the traditional pretreatment. In the process, the silane coupling agent was adopted as connector between conversion film and palladium ion with catalysis. The microstructure of the phytic acid conversion coatings was observed using scanning electronic microscopy, while the composition and functional groups were analyzed by energy dispersive spectrometer and Fourier transform infrared spectroscopy. The bonding between Si-OH of the silane coupling agent and hydroxyl of phytic acid was validated by X-ray photoelectron spectroscopy, and the existence of palladium ion was also verified. The subsequent Ni-P deposited on the layer was also characterized by its structure, morphology, and corrosion resistance. The results show that the Ni-P coatings with the phytic acid pretreatment on AZ91D magnesium alloy have good corrosion resistance.

  9. Deposition of gold nanoparticles on silica spheres by electroless metal plating technique.

    Science.gov (United States)

    Kobayashi, Yoshio; Tadaki, Yohei; Nagao, Daisuke; Konno, Mikio

    2005-03-15

    A previously proposed method for metal deposition with silver [Kobayashi et al., Chem. Mater. 13 (2001) 1630] was extended to uniform deposition of gold nanoparticles on submicrometer-sized silica spheres. The present method consisted of three steps: (1) the adsorption of Sn(2+) ions took place on surface of silica particles, (2) Ag(+) ions added were reduced and simultaneously adsorbed to the surface, while Sn(2+) was oxidized to Sn(4+), and (3) Au(+) ions added were reduced and deposited on the Ag surface. TEM observation, X-ray diffractometry, and UV-vis absorption spectroscopy revealed that gold metal nanoparticles with an average particle size of 13 nm and a crystal size of 5.1 nm were formed on the silica spheres with a size of 273 nm at an Au concentration of 0.77 M.

  10. Research of Kinetics of Electroless Ni-Cu-P Alloy Plating on Polyester Fabric

    Institute of Scientific and Technical Information of China (English)

    CHEN Zhen-bing; CHEN Xiao-li

    2002-01-01

    All the variables that may affect the Ni- Cu-P alloy deposition rate on polyester fabric were studied, and the activation energy and the reaction orders were determined. The deposition rate equation was also derived.

  11. Fractal characterization and optimization of electroless Ni-P coatings

    Energy Technology Data Exchange (ETDEWEB)

    Sahoo, Prasanta [Department of Mechanical Engineering, Jadavpur University, Kolkata 700032 (India)

    2008-01-21

    This paper presents an experimental study of fractal characteristics of electroless Ni-P (EN) coatings and optimization of coating process parameters based on the Taguchi method. Experiments are carried out by utilizing the combination of process parameters based on the L{sub 27} Taguchi orthogonal design with three process parameters, namely, bath temperature, concentration of nickel source solution and concentration of reducing agent. It has been observed that the concentration of nickel source solution and the interaction of the bath temperature with the concentration of nickel source solution and reducing agent have a significant influence on controlling fractal dimension characteristics of EN coatings. The surface morphology and composition of coatings are also studied with the help of scanning electron microscopy, energy dispersed x-ray analysis and x-ray diffraction analysis.

  12. Electroless Nickel Deposition: An Alternative for Graphene Contacting.

    Science.gov (United States)

    Popescu, Sinziana M; Barlow, Anders J; Ramadan, Sami; Ganti, Srinivas; Ghosh, Biswajit; Hedley, John

    2016-11-16

    We report the first investigation into the potential of electroless nickel deposition to form ohmic contacts on single layer graphene. To minimize the contact resistance on graphene, a statistical model was used to improve metal purity, surface roughness, and coverage of the deposited film by controlling the nickel bath parameters (pH and temperature). The metalized graphene layers were patterned using photolithography and contacts deposited at temperatures as low as 60 °C. The contact resistance was 215 ± 23 Ω over a contact area of 200 μm × 200 μm, which improved upon rapid annealing to 107 ± 9 Ω. This method shows promise toward low-cost and large-scale graphene integration into functional devices such as flexible sensors and printed electronics.

  13. Investigation on a Non-cyanide Plating Process of Ni-P Coating on Magnesium Alloy AZ91D

    Institute of Scientific and Technical Information of China (English)

    Bonian HU; Gang YU; Jueling CHEN; Ying LI; Liyuan YE

    2005-01-01

    In this research we presented a non-cyanide plating process of Ni-P alloy coating on Mg alloy AZ91D. By applying a new process flow of electroless nickel plating in which zinc coating is used as transition of Ni-P coating on Mg alloy AZ91D, the process of copper transition coating plated in the cyanides bath can be replaced. A new bath composed of NiSO4 was established by orthogonal test. The results show that zinc transition coating can increase the adhesion and pH 4.0 and 95℃, respectively. The present process flow is composed of ultrasonic cleaning→alkaline cleaning→acid pickling→activation→double immersing zinc→electroplating zinc→electroless nickel plating→passivation treatment.The present non-cyanide process of electroless nickel plating is harmless to our surroundings and Ni-P coating on Mg alloy AZ91D produced by present process possesses good adhesion and corrosion resistance.

  14. A microchip-based flow injection-amperometry system with mercaptopropionic acid modified electroless gold microelectrode for the selective determination of dopamine.

    Science.gov (United States)

    Wang, Yi; Luo, Jie; Chen, Hengwu; He, Qiaohong; Gan, Nin; Li, Tianhua

    2008-09-12

    A novel chip-based flow injection analysis (FIA) system has been developed for automatic, rapid and selective determination of dopamine (DA) in the presence of ascorbic acid (AA). The system is composed of a polycarbonate (PC) microfluidic chip with an electrochemical detector (ED), a gravity pump, and an automatic sample loading and injection unit. The selectivity of the ED was improved by modification of the gold working microelectrode, which was fabricated on the PC chip by UV-directed electroless gold plating, with a self-assembled monolayer (SAM) of 3-mercaptopropionic acid (MPA). Postplating treatment methods for cleaning the surface of electroless gold microelectrodes were investigated to ensure the formation of high quality SAMs. The effects of detection potential, flow rate, and sampling volume on the performance of the chip-based FIA system were studied. Under optimum conditions, a detection limit of 74 nmol L(-1) for DA was achieved at the sample throughput rate of 180 h(-1). A RSD of 0.9% for peak heights was observed for 19 runs of a 100 micromol L(-1) DA solution. Interference-free determination of DA could be conducted if the concentration ratio of AA-DA was no more than 10.

  15. Synergistic effect between nano-ceramic lubricating additives and electroless deposited Ni-W-P coating

    Science.gov (United States)

    Chen, Min; Cheng, Wushan; Zhao, Zuxin; Huang, Xiaobo

    2013-01-01

    The major solving ways for the material wear are surface modification and lubrication. Currently, the researches at home and abroad are all limited to the single study of either nano-lubricating oil additive or electroless deposited coating. The surface coating has high hardness and high wear resistance, however, the friction reduction performance of the coating with high hardness is not good, the thickness of the coating is limited, and the coating can not regenerate after wearing. The nano-lubricating additives have good tribological performance and self-repair function, but under heavy load, the self-repair rate to the worn surface with the nano-additives is smaller than the wearing rate of the friction pair. To solve the above problems, the Ni-W-P alloy coating and deposition process with excellent anti-wear, and suitable for industrial application were developed, the optimum bath composition and process can be obtained by studying the influence of the bath composition, temperature and PH value to the deposition rate and the plating solution stability. The tribological properties as well as anti-wear and friction reduction mechanism of wear self-repair nano-ceramic lubricating additives are also studied. The ring-block abrasion testing machine and energy dispersive spectrometer are used to explore the internal relation between the coating and the nano-lubricating oil additives, and the tribology mechanism, to seek the synergetic effect between the two. The test results show that the wear resistance of Ni-W-P alloy coating (with heat treatment and in oil with nano-ceramic additives) has increased hundreds times than 45 steel as the metal substrate in basic oil, the friction reduction performance is improved. This research breaks through the bottleneck of previous separate research of the above-mentioned two methods, and explores the combination use of the two methods in industrial field.

  16. Plate tectonics

    Digital Repository Service at National Institute of Oceanography (India)

    Chaubey, A.K.

    Content-Type text/plain; charset=UTF-8 209 Plate Tectonics A. K. Chaubey National Institute of Oceanography, Dona Paula, Goa-403 004. chaubey@nio.org Introduction The theory of continental drift, which paved the way for discovery... of plate tectonics, was put forward by Alfred Lother Wegener - a meteorologist from Germany - in 1912. The theory states that continents are not fixed, but have been slowly wandering during the course of Earth’s geological history. Although Wegener...

  17. DETAILED INVESTIGATION OF THE REJUVENATION OF A SPENT ELECTROLESS NICKEL SOLUTION BY ELECTRODIALYSIS WITH A VIEW TO OPTIMIZING ELECTRODIALYSIS PERFORMANCE

    Science.gov (United States)

    The rejuvenation of spent electroless nickel baths by electrodialysis has received a considerable amount of attention over the past decade and the technique is being increasingly employed to extend electroless nickel bath life. However, thus far there has not been a detailed inve...

  18. PREPARATION AND ANALYSIS OF Ni-P-Zn ELECTROLESS DEPOSITION FROM ALKALT BATH

    Institute of Scientific and Technical Information of China (English)

    Y.S. Huang; F.Z. Cui

    2005-01-01

    Electroless Ni-P-Zn alloys deposited from alkali bath were investigated in this paper. The deposition bath contained nickel sulfate, zinc chloride and hypophosphate. The process parameters, such as temperature, pH and zinc salt concentration were presented and discussed.The microstructure of the coatings was studied by XRD and SEM. The cathode glowing discharge characters of Ni-P-Zn depositions were studied with luminous Neon lamps. Electrodes deposited by electroless Ni-P alloys were apt to sputter during luminous working hours. Electroless Ni-P-Zn depositions improved the discharge characters of the electrodes.With the concentration of zinc in the deposition rising to 4wt%, electrode sputter was largely restrained. The thickness of the deposition also influenced the discharge characters of the electrode. To avoid electrode sputter, the concentration of zinc has to rise with the thickness of the depositions.

  19. Development of process technologies for improvement of electroless nickel coatings properties

    Science.gov (United States)

    Barba-Pingarrón, A.; Bolarín-Miró, A.; Sánchez – de Jesús, F.; Vargas-Mendoza, L.; Trujillo-Barragán, M.; Molera-Sola, P.; Hernandez-Gallegos, M. A.; Valdez-Navarro, R.

    2013-06-01

    This paper describes research and technology developments that enable to improve nickel electroless coating properties. This work deals with: (a) different methods in order to achieve Ni-P-Mo coatings. (b) Other development is related with coatings with addition of hard particles such as SiC, WC or Al2O3,(c) Electroless nickel deposits on PBT and austempered ductile iron (ADI). (d) In addition, nickel coatings were deposited on powder metallic pieces and finally, electroless nickel coatings, in conjunction with layers from thermal spray process were formed. Characterization of all coatings by means of optical microscopy, scanning electron microscopy, micro-hardness, wear and corrosion tests were carried out. Results indicate positive increment in both mechanical and electrochemical properties which enhance field applications in Mexican industry.

  20. Graphdiyne oxides as excellent substrate for electroless deposition of Pd clusters with high catalytic activity.

    Science.gov (United States)

    Qi, Hetong; Yu, Ping; Wang, Yuexiang; Han, Guangchao; Liu, Huibiao; Yi, Yuanping; Li, Yuliang; Mao, Lanqun

    2015-04-29

    Graphdiyne (GDY), a novel kind of two-dimensional carbon allotrope consisting of sp- and sp(2)-hybridized carbon atoms, is found to be able to serve as the reducing agent and stabilizer for electroless deposition of highly dispersed Pd nanoparticles owing to its low reduction potential and highly conjugated electronic structure. Furthermore, we observe that graphdiyne oxide (GDYO), the oxidation form of GDY, can be used as an even excellent substrate for electroless deposition of ultrafine Pd clusters to form Pd/GDYO nanocomposite that exhibits a high catalytic performance toward the reduction of 4-nitrophenol. The high catalytic performance is considered to benefit from the rational design and electroless deposition of active metal catalysts with GDYO as the support.

  1. Fabrication of a pure, uniform electroless silver film using ultrafine silver aerosol particles.

    Science.gov (United States)

    Byeon, Jeong Hoon; Kim, Jang-Woo

    2010-07-20

    To obtain evenly distributed pure Ag particles with a narrow size distribution on a polymer membrane, a novel activation procedure with an environmentally friendly, cost-effective method was utilized as a pretreatment before electroless Ag deposition. The pretreatment was first performed on an untreated membrane surface by collecting ultrafine ambient spark-generated Ag aerosol particles. After annealing, the electroless Ag film was fabricated on the collected aerosol particles in the Ag electroless bath. Experimental characterizations showed that the ultrafine Ag particles were uniformly anchored onto the membrane surface through pretreatment, resulting in a pure Ag film of closely packed particles with a narrow size distribution on the membrane, and the properties were comparable to those of an Ag film on wet Sn-Ag-activated membranes.

  2. Solderability perservative coatings: Electroless tin vs. organic azoles

    Energy Technology Data Exchange (ETDEWEB)

    Artaki, I.; Ray, U.; Jackson, A.M.; Gordon, H.M. [AT and T Bell Labs., Princeton, NJ (United States); Vianco, P.T. [Sandia National Labs., Albuquerque, NM (United States)

    1993-07-01

    This paper compares the solderability performance and corrosions ion protection effectiveness of electroless tin coatings versus organic azole films after exposure to a series of humidity and thermal (lead-free solders) cycling conditions. The solderability of immersion tin is directly related to the tin oxide growth on the surface and is not affected by the formation of Sn-Cu intermetallic phases as long as the intermetallic phase is protected by a Sn layer. For a nominal tin thickness of 60{mu}inches, the typical thermal excursions associated with assembly are not sufficient to cause the intermetallic phase to consume the entire tin layer. Exposure to humidity at moderate to elevated temperatures promotes heavy tin oxide formation which leads to solderability loss. In contrast, thin azole films are more robust to humidity exposure; however upon heating in the presence of oxygen, they decompose and lead to severe solderability degradation. Evaluations of lead-free solder pastes for surface mount assembly applications indicate that immersion tin significantly improves the spreading of Sn:Ag and Sn:Bi alloys as compared to azole surface finishes.

  3. Electroless Ni-P-ferrite composite coatings for microwave applications

    Indian Academy of Sciences (India)

    Ramesh Chandra Agarwala

    2005-11-01

    Electroless, EL coating technique is one of the elegant ways of coating by controlling the temperature and pH of the coating bath in which there is no usage of electric current. It is estimated that the market for this chemistry will increase at a rate of about 15% per year. Use of microwave energy for synthesis of material with novel microstructures is an exciting new field in material science with enormous application. In this investigation, nanograined BaZn2-CoFe16O27 ( = 0.0, 0.4, 0.8, 1.2, 1.6 and 2.0) powders have been synthesized by citrate precursor method followed by heat treatment at various specified temperatures like 650, 750 and 850°C for 3 h in the furnace. In addition heat treatments are also carried out in the microwave oven of the power rating of 760 W. The powders thus produced have been characterized by SEM, EPMA, VSM, XRD and thermal analysis techniques. As a forward step towards EL nano-composite coatings, Ni-P- ( = BaZn2- CoFe16O27) coatings with thickness less than ∼ 0.1 mm thick has been produced. Such coating exhibits absorption of microwave in the range of 12-18 GHz up to about 20 db depending upon the volume fraction of the ferrite particles embedded in the Ni-P matrix.

  4. Electroless Functionalization of Silver Films by Its Molecular Doping.

    Science.gov (United States)

    Naor, Hadas; Avnir, David

    2015-12-09

    We present a methodology which by far extends the potential applications of thin conductive silver films achieved by an electroless molecular doping process of the metal with any of the endless functional molecules that the large library of organic molecules offer. The resulting metallic films within which the molecule is entrapped--molecule@Ag--carry both the classical chemical and physical properties of silver films, as well as the function of the entrapped molecule. Raman measurements of the organic molecules from within the silver films provide the first spectroscopic observations from within silver, and clearly show that entrapment, a three-dimensional process, and adsorption, a two-dimensional process, on silver films are distinctly different processes. Three organic molecules, the cationic Neutral red, the anionic Congo red, and the antibacterial agent chlorhexidine digluconate (CH), were used to demonstrate the generality of this method for various types of molecules. We studied the sensitivity of the film conductivity to the type of the molecule entrapped within the film, to its concentration, and to temperature. Dual functionality was demonstrated with CH@Ag films, which are both conductive and have prolonged and high antibacterial activity, a combination of properties that has been unknown so far.

  5. Investigation of the mechanism of electroless deposition of copper on functionalized alkanethiolate self-assembled monolayers adsorbed on gold.

    Science.gov (United States)

    Lu, Peng; Walker, Amy V

    2007-12-04

    We have investigated the reaction pathways involved in the unseeded electroless deposition of copper on self-assembled monolayers (SAMs) adsorbed on Au, using time-of-flight secondary ion mass spectrometry, optical microscopy, and scanning electron microscopy. At 22 degrees C copper deposits on both -CH3 and -COOH terminated SAMs. No copper deposition is observed on -OH terminated SAMs because the hydroxyl terminal groups react with formaldehyde in the plating solution, forming an acetal which prevents Cu deposition. At higher deposition temperatures (45 degrees C), no Cu is observed to deposit on -CH3 terminated SAMs because Cu2+ ions are not stabilized on the SAM surface. Copper complexes are still able to form with the -COOH terminal group at 45 degrees C, and so copper continues to be deposited on -COOH terminated SAMs. Copper also penetrates through -CH3 and -COOH terminated SAMs to the Au/S interface, suggesting that soft deposition techniques do not prevent the penetration of low-to-moderate reactivity metals through organic films.

  6. The Microstructure of Ni Layer on Single-Walled Carbon Nanotubes Prepared by an Electroless Coating Process

    Directory of Open Access Journals (Sweden)

    Weixue Li

    2011-01-01

    Full Text Available The single-walled carbon nanotubes (SWNTs, diameter: 2~3 nm, which were obtained in the suspension of purification solution, with Ni-P coating layers were obtained by an electroless deposition process. The SWNTs before and after coating were characterized by transmission electron microscopy (TEM and energy dispersive spectrometry (EDS. An Ni-P layer on individual nanotube with thickness of 20 nm can be obtained after the deposition process. The X-ray diffraction (XRD and selected area electron diffraction (SAED analysis of Ni-P SWNTs before and after heat treatment show that the heat treatment caused the transformation of the amorphous Ni-P layer to the nanocrystalline Ni-P (crystalline Ni and Ni3P intermetallic compound layer. The XRD pattern of SWNTs with Ni-P layers after heat treatment revealed that the crystal structures of Ni in plating layer contained: hexagonal close-packed (hcp structure and face-centered cubic (fcc structure. The lattice parameters of Ni (fcc and Ni3P are larger than the bulk's, indicting that the lattice expansion has taken place. However, the lattice parameter of Ni (hcp has no difference from the bulk's.

  7. Salt Spray Test to Determine Galvanic Corrosion Levels of Electroless Nickel Connectors Mounted on an Aluminum Bracket

    Science.gov (United States)

    Rolin, T. D.; Hodge, R. E.; Torres, P. D.; Jones, D. D.; Laird, K. R.

    2014-01-01

    During preliminary vehicle design reviews, requests were made to change flight termination systems from an electroless nickel (EN) connector coating to a zinc-nickel (ZN) plating. The reason for these changes was due to a new NASA-STD-6012 corrosion requirement where connectors must meet the performance requirement of 168 hr of exposure to salt spray. The specification for class F connectors, MIL-DTL-38999, certifies the EN coating will meet a 48-hr salt spray test, whereas the ZN is certified to meet a 168-hr salt spray test. The ZN finish is a concern because Marshall Space Flight Center has no flight experience with ZN-finished connectors, and MSFC-STD-3012 indicates that zinc and zinc alloys should not be used. The purpose of this test was to run a 168-hr salt spray test to verify the electrical and mechanical integrity of the EN connectors and officially document the results. The salt spray test was conducted per ASTM B117 on several MIL-DTL-38999 flight-like connectors mounted to an aluminum 6061-T6 bracket that was alodined. The configuration, mounting techniques, electrical checks, and materials used were typical of flight and ground support equipment.

  8. The Effect and Mechanism of Nano-Cu Lubricating Additives on the Electroless Deposited Ni-W-P Coating

    Institute of Scientific and Technical Information of China (English)

    CHEN Min; JIANG Xiaomin; ZHAO Zuxin; HUANG Xiaobo

    2012-01-01

    The coating and deposition process with excellent anti wear and suitable for industrial application were developed,and the optimum bath composition and process were obtained by studying the influence of the bath composition,temperature and pH value on the deposition rate and the plating solution stability.Moreover,the tribological properties of nano-Cu lubricating additives and electroless deposited Ni-W-P coating as well as their synergistic effect are researched using ring-block abrasion testing machine and energy dispersive spectrometer.Research results show that Ni-W-P alloy coating and nano-Cu lubricating additive have excellent synergistic effect,e g,the wear resistance of Ni-W-P alloy coating (with heat treatment and the oil with nano-Cu additives) has increased hundreds times than 45 steel as the metal substrate with the basic oil,and zero wear is achieved,which breaks through the bottleneck of previous separate research of the above-mentioned two aspects.

  9. Electroless deposition, post annealing and characterization of nickel films on silicon

    Indian Academy of Sciences (India)

    Subir Sabharwal; Siddharth Palit; R B Tokas; A K Poswal; Sangeeta

    2008-10-01

    Electroless deposition of nickel (EN) films on -type silicon has been investigated under different process conditions. The interface between the film and substrate has been characterized for electrical properties by probing the contact resistances. X-ray diffraction and atomic force microscopy have been performed to obtain information about the structural and morphological details of the films. As a comparative study, nickel films have also been sputter deposited on silicon substrates. An as-deposited electroless film is observed to form non-ohmic contact while in a sputtered film prepared without the application of substrate heating, the formation of metal–insulating–semiconductor type junction is seen.

  10. MONTE-CARLO SIMULATION FOR ATOMIC DEPOSITION OF AMORPHOUS ELECTROLESS Ni80P20 COATING

    Institute of Scientific and Technical Information of China (English)

    K.S. Guan; H.R. Bai; Z.W. Wang; Y.S. Yin

    2002-01-01

    Atomic growth process and structure of Amorphous Electroless Coating have beenstudied, using Monte-Carlo simulation method. The simulation results of amorphousNi80P20 coating show that PDFs are in accordance with practical values. The mi-grations of adatoms in coating's growth are different from that of solidification ofamorphous materials. In some cases, the migrated adatoms in the process of growthof amorphous coating are not enough to occupy all vacancies and traps, so the amor-phous coating is micro-porous. The immovable probability k and the largest migrationdistance of adatoms, which lie on the electroless bath components, affect the PDF,volume density and microporosity remarkably.

  11. Effect of temperature and silicon resistivity on the elaboration of silicon nanowires by electroless etching

    Energy Technology Data Exchange (ETDEWEB)

    Fellahi, Ouarda, E-mail: fellahi_warda@yahoo.fr [Silicon Technology Development Unit, 02 Bd Frantz Fanon, BP 140 Alger-7 Merveilles, Algiers (Algeria); Hadjersi, Toufik [Silicon Technology Development Unit, 02 Bd Frantz Fanon, BP 140 Alger-7 Merveilles, Algiers (Algeria); Maamache, Mustapha [Laboratoire de Physique Quantique et Systemes Dynamiques, Universite Ferhat Abbas de Setif (Algeria); Bouanik, Sihem; Manseri, Amar [Silicon Technology Development Unit, 02 Bd Frantz Fanon, BP 140 Alger-7 Merveilles, Algiers (Algeria)

    2010-11-01

    The morphology of silicon nanowire (SiNW) layers formed by Ag-assisted electroless etching in HF/H{sub 2}O{sub 2} solution was studied. Prior to the etching, the Ag nanoparticles were deposited on p-type Si(1 0 0) wafers by electroless metal deposition (EMD) in HF/AgNO{sub 3} solution at room temperature. The effect of etching temperature and silicon resistivity on the formation process of nanowires was studied. The secondary ion mass spectra (SIMS) technique is used to study the penetration of silver in the etched layers. The morphology of etched layers was investigated by scanning electron microscope (SEM).

  12. INTEGRATED USE OF RAPID PROTOTYPING AND METAL PLATING TECHNIQUES FOR DEVELOPMENT OF MICRO AIR VEHICLES

    Directory of Open Access Journals (Sweden)

    Dr. K. ELANGOVAN,

    2011-01-01

    Full Text Available This paper describes the synergistic application of rapid prototyping and metal plating technologies for development of micro air vehicles (MAV with high strength-to-weight characteristic. Stereolithography and fused deposition techniques are employed to fabricate complex thermoplastic MAV prototypes with significant time-compression in production cycle. Electroless and electrolytic deposition processes are custom developed to deposit thin metallic foils of nickel and chromium over thermoplastic MAV prototypes. Plating plant with inherent provision for variation of process parameters is established and proof-of-concept studies are carried on plating of MAV prototypes. Experiments are conducted on metal plated thermoplastic test specimens for evaluating the mechanical behaviour and structural integrity properties. Present study is a conclusive demonstration of the use of layered manufacturing techniques in quick realisation of flight-worthy MAV systems.

  13. Effect of Addition of Polytetrafluoroethylene (PTFE) and Silicon Carbide (SiC) on Properties of Electroless Nickel Alloy Coatings

    Institute of Scientific and Technical Information of China (English)

    WU Yu-cheng; HU Xiao-ye; WANG Wen-fang; HUANG Xin-min

    2004-01-01

    Electroless nickel (copper)-phosphorus-silicon carbide (SiC)-polytetrafluoroethylene (PTFE) composite coatings were prepared by adding SiC and PTFE into electroless nickel (copper)-phosphorus alloy baths. The effects of addition of SiC and PTFE on depositing rate, microhardness, wear resistance and anti-friction of the resulted composite coatings were studied. The results indicated that electroless nickel (copper)-phosphorus alloy coatings were greatly improved in depositing rate, microhardness, wear resistance and antifriction by co-deposited proper amount of SiC and PTFE.

  14. Investigation on the Thermal Conductivity and Anti-fouling Property of Ni-P-PTFE Electroless Composite Coating%Ni-P-PTFE化学复合镀层的导热及阻垢性能研究

    Institute of Scientific and Technical Information of China (English)

    何凯龙; 陈颖; 冯婧; 莫松平

    2013-01-01

    以T2铜片作基体进行Ni-P-PTFE化学复合镀实验,获得了相同镀层厚度的Ni-P-PTFE复合镀层试件,测量试件的导热系数.结果表明:在相同厚度下,Ni-P-PTFE复合镀层试件的整体导热系数主要受镀层中碳(C)、磷(P)和聚四氟乙烯(PTFE)成分含量的影响.试件的整体导热系数相比铜的导热系数有所降低,但不超过4.5%,依然保持高导热性能.由正交试验得到优化工艺,由此工艺获得的Ni-P-PTFE化学复合镀层的表面接触角为123.4°,表面能为9.9 mN/m.阻垢测试结果显示,相比铜表面,沉积在Ni-P-PTFE镀层表面的碳酸钙晶体数量与尺寸均有明显的减小.总的来说,Ni-P-PTFE镀层对材料的导热能力影响较小,却能有效地减缓水垢的沉积与聚集,起到阻垢的作用.%Ni-P-PTFE electroless composite coating which have the same thickness are got by electroles composite plating on T2 copper sheets,and the thermal conductivity is tested. The result shows that, the total thermal conductivity is mainly affected by the C,P and PTFE content of the Ni-P-PTFE electroless composite coating which have the same thickness. Compared with the copper sheets, the thermal conductivity decreased, but not exceeds 4%, which still have a high thermal conduction. Experimental is optimized by orthogonal process, and in this condition ,the contact angel of Ni-P-PTFE electroless composite coating is 123. 4°,mean while the surface free energy is 9. 9 mN/m. The result of anti-fouling tests show that, the number and size of calcum carbonate crystals increased after Ni-P-PTFE electroless plating. In general, the Ni-P-PTFE coatings affect the thermal conductivity of the material slightly, and show an excellent anti-fouling capacity by slow scale deposition and accumulation.

  15. Improving hardness of electroless Ni-B coatings using optimized deposition conditions and annealing

    Energy Technology Data Exchange (ETDEWEB)

    Oraon, B. [Department of Mechanical Engineering, Jadavpur University, Kolkata 700 032 (India)], E-mail: b_oraon_65@yahoo.co.in; Majumdar, G. [Department of Mechanical Engineering, Jadavpur University, Kolkata 700 032 (India); Ghosh, B. [Advanced Materials and Solar Photovoltaic Division, School of Energy Studies, Jadavpur University, Kolkata 700 032 (India)

    2008-07-01

    The alkaline borohydride-reduced bath has been used to deposit electroless nickel-boron (Ni-B) coatings on a pure (99.99%) copper substrate. The hardness of the Ni-B coatings has been improved using optimized deposition conditions and thereafter by annealing. The electroless Ni-B deposition per unit area has been considered as the response variable and response surface method (RSM) has been used to optimize the process parameters and the deposition per unit area. The electroless Ni-B coatings have again been formed at the optimized deposition conditions and the as-deposited coating hardness has been evaluated using an empirical model and regression analysis. It has been observed that there is a significant improvement in as-deposited coating hardness. The Ni-B coated specimens formed at optimized deposition conditions have also been annealed at different temperatures ranging from 100 deg. C to 500 deg. C. The hardness of the annealed specimens has been estimated for different annealing temperatures and has been observed that the coating hardness increases with annealing temperature and then further increase in annealing temperature reduces the coating hardness. The coating hardness becomes the highest for annealing temperature of about 300 deg. C. Both the as-deposited and annealed coating hardness have been observed to be significantly higher than that reported by many researchers for electroless Ni-B coatings.

  16. Principles of electroless photoetching of non-uniformly doped CaN; Kinetics and defect revealing

    NARCIS (Netherlands)

    Weyher, J.L.; van Dorp, D.H.; Kelly, J.J.

    2015-01-01

    When using electroless etching of semiconductors for quality control or device applications one must be aware of the possibility of galvanic interaction in the system. Here we show how highly doped (n++) GaN in a bilayer heterostructure dramatically increases the photoetch rate of the low doped (n)

  17. Effects of Pretreatment on the Structure And Properties of Electroless Nickel Coatings

    DEFF Research Database (Denmark)

    Møller, Per; Deng, Hong

    1994-01-01

    The pretreatment process can significantly affect the corrosion resistance of electroless nickel (EN) coatings One of the most important reasons is that different pretreatment processes can give different surface morphologies of the substrate. The scanning electron microscope (SEM) and the scanning...

  18. Effect of Rare Earth Metals on Structure and Properties of Electroless Co-B Alloy Coating

    Institute of Scientific and Technical Information of China (English)

    宣天鹏; 张雷; 黄秋华

    2002-01-01

    The effect of rare earth metals cerium, lanthanum and yttrium on chemical composition, structure and properties of electroless Co-B alloy coating was studied. By plasma transmitting spectrograph, electron energy spectrometer, X-ray diffractometter, micro-hardometer and vibratory sample magnetometer the chemical constitution, structure and properties of the alloy coatings were analyzed and inspected. The results show that with a tiny quantity of rare earth metal added into Co-B alloy coating, the content of boron is decreased in the alloy coatings, and the kinds of rare earth metal have enormous effect on the structure and properties of electroless Co-B alloy coating. At the same time electroless Co-B alloy with amorphous structure is transformed to electroless Co-B-RE alloy with microcrystalline or crystalline structure. In this way microhardness of the coatings is increased remarkably. Cerium and lanthanum would also increase the saturated magnetic intensity and decrease coercitive force of the coating. So soft magnetization of the coatings would be improved.

  19. Improvement of metal-semiconductor contact on silicon microstructured surface by electroless nickel technique

    Science.gov (United States)

    Long, Fei; Guo, Anran; Huang, Lieyun; Yu, Feng; Li, Wei

    2016-11-01

    Si micro-structures served as anti-reflection layer are widely employed in Si-based solar cells and detectors to enhance light harvesting. However, performance of these devices is suffered from the poor contact between the metal electrode and micro-structured surface. Conventional vacuum deposited metal electrode makes only superficial contact with the top of micro-structured surface and unable to fill the holes in the micro-structures. In this paper, instead, electroless nickel technique is applied to form low resistance ohmic contact. The surface micro-structures were fabricated by electrochemistry etching while the metal electrodes were deposited by sputtering and electroless pasting. Results show that only electroless nickel layer could fully fill the holes and achieve better ohmic contact than the sputtering ones before rapid annealing. Furthermore, a higher temperature rapid annealing process could improve the contact of all samples prepared by different ways. The specific contact resistance achieved by high alkalinity (pH=12) electroless nickel is 1.34×10-1Ω·cm2.

  20. Spontaneous Electroless Galvanic Cell Deposition of 3D Hierarchical and Interlaced S-M-S Heterostructures.

    Science.gov (United States)

    Tan, Chuan Fu; Azmansah, Siti Aishah Bte; Zhu, Hai; Xu, Qing-Hua; Ho, Ghim Wei

    2017-01-01

    One-pot electroless galvanic cell deposition of a 3D hierarchical semiconductor-metal-semiconductor interlaced nanoarray is demonstrated. The fabricated 3D photoanode deviates from the typical planar geometry, and aims to optimize the effective surface area for light harvesting and long-range charge transfer-collection pathways.

  1. Controlled Ag electroless deposition in bulk structures with complex three-dimensional profiles

    DEFF Research Database (Denmark)

    Malureanu, Radu; Zalkovskij, Maksim; Andryieuski, Andrei;

    2010-01-01

    are of high uniformity, having an average roughness of about 4 nm. The characterization of the metal deposition is done using both the scanning electron microscopy technique as well as by atomic force microscope measurements. The electroless technique can be easily implemented, providing the effective...

  2. Electroless porous silicon formation applied to fabrication of boron-silica-glass cantilevers

    DEFF Research Database (Denmark)

    Teva, Jordi; Davis, Zachary James; Hansen, Ole

    2010-01-01

    This work describes the characterization and optimization of anisotropic formation of porous silicon in large volumes (0.5-1 mm3) of silicon by an electroless wet etching technique. The main goal is to use porous silicon as a sacrificial volume for bulk micromachining processes, especially in cases...

  3. A novel electroless method to prepare a platinum electrocatalyst on diamond for fuel cell applications

    Science.gov (United States)

    Lyu, Xiao; Hu, Jingping; Foord, John S.; Wang, Qiang

    2013-11-01

    A novel electroless deposition method was demonstrated to prepare a platinum electrocatalyst on boron doped diamond (BDD) substrates without the need for pre-activation. This green method addresses the uniformity and particle size issues associated with electrodeposition and circumvents the pre-activation procedure which is necessary for conventional electroless deposition. The inert BDD substrate formed a galvanic couple with an iron wire, to overcome the activation barrier associated with conventional electroless deposition on diamond, leading to the formation of Pt nanoparticles on the electrode surface in a galvanic process coupled to a chemical process. When sodium hypophosphite was employed as the reducing agent to drive the electroless reaction Pt deposits which were contaminated with iron and phosphorus resulted. In contrast, the reducing agent ascorbic acid gave rise to high purity Pt nanoparticles. Optimal deposition conditions with respect to bath temperature, pH value and stabilizing additives are identified. Using this approach, high purity and uniformly distributed platinum nanoparticles are obtained on the diamond electrode surface, which demonstrate a high electrochemical activity towards methanol oxidation.

  4. Growth Plate Injuries

    Science.gov (United States)

    ... Growth Plate Injuries? Key Words Information Box The Salter-Harris Classification of Growth Plate Injuries What Is ... of Growth Plate Injuries? Since the 1960s, the Salter-Harris classification, which divides most growth plate fractures ...

  5. Platinum-ruthenium bimetallic clusters on graphite: a comparison of vapor deposition and electroless deposition methods.

    Science.gov (United States)

    Galhenage, Randima P; Xie, Kangmin; Diao, Weijian; Tengco, John Meynard M; Seuser, Grant S; Monnier, John R; Chen, Donna A

    2015-11-14

    Bimetallic Pt-Ru clusters have been grown on highly ordered pyrolytic graphite (HOPG) surfaces by vapor deposition and by electroless deposition. These studies help to bridge the material gap between well-characterized vapor deposited clusters and electrolessly deposited clusters, which are better suited for industrial catalyst preparation. In the vapor deposition experiments, bimetallic clusters were formed by the sequential deposition of Pt on Ru or Ru on Pt. Seed clusters of the first metal were grown on HOPG surfaces that were sputtered with Ar(+) to introduce defects, which act as nucleation sites for Pt or Ru. On the unmodified HOPG surface, both Pt and Ru clusters preferentially nucleated at the step edges, whereas on the sputtered surface, clusters with relatively uniform sizes and spatial distributions were formed. Low energy ion scattering experiments showed that the surface compositions of the bimetallic clusters are Pt-rich, regardless of the order of deposition, indicating that the interdiffusion of metals within the clusters is facile at room temperature. Bimetallic clusters on sputtered HOPG were prepared by the electroless deposition of Pt on Ru seed clusters from a Pt(+2) solution using dimethylamine borane as the reducing agent at pH 11 and 40 °C. After exposure to the electroless deposition bath, Pt was selectively deposited on Ru, as demonstrated by the detection of Pt on the surface by XPS, and the increase in the average cluster height without an increase in the number of clusters, indicating that Pt atoms are incorporated into the Ru seed clusters. Electroless deposition of Ru on Pt seed clusters was also achieved, but it should be noted that this deposition method is extremely sensitive to the presence of other metal ions in solution that have a higher reduction potential than the metal ion targeted for deposition.

  6. Ni-P化学镀层表面实现滴状冷凝传热%Dropwise condensation on the surface of Ni-P electroless coating

    Institute of Scientific and Technical Information of China (English)

    曾斌; 侯峰; 徐宏; 阮艺平

    2012-01-01

    In order to achieve the surface preparation techniques that promoted the formation of dropwise condensation heat transfer,Ni-P coating on carbon steel by electroless plating,and its condensation heat transfer performance were studied.The results showed that complete dropwise condensation was achieved on the surface of Ni-P electroless coating,the heat flux and heat transfer coefficient was 3 to 5 times higher than the values calculated by Nusselt film theory.Meantime,it was found that the amorphous of coating was the main reason for promoting the formation of dropwise condensation heat transfer.The co-existence state of dropwise and filmwise was obtained when the coating was crystallized by heat treatment.%为了探索能实现滴状冷凝传热的表面制备技术,采用化学镀技术在碳钢表面制备非晶态Ni-P化学镀层,对其冷凝传热性能进行了实验研究。结果表明,Ni-P化学镀层表面常压水蒸气下实现了完全的滴状冷凝传热,表面热通量和传热系数均比膜状冷凝Nusselt理论计算结果提高了3~5倍。同时发现,镀层的非晶态是实现滴状冷凝传热形态的主要原因,经过热处理晶化后,表面形成的是滴膜共存的冷凝传热形态,冷凝传热强化效果显著降低。

  7. Surface texturing for adaptive Ag/MoS_2 solid lubricant plating

    Institute of Scientific and Technical Information of China (English)

    2012-01-01

    The objective of this research is to prepare specially designed surface texture on hard steel surface by electrochemical micromachining (EM) and to incorporate electroless plated Ag/MoS2 solid lubricant coating into the dimples of EM textured steel surface to effectively reduce friction and wear of steel-steel contacts. The friction and wear behavior of the Ag/MoS2 solid lubricant coating on EM textured steel surface was evaluated in relation to the size and spacing of the dimples thereon. The microstructur...

  8. Wear behaviour of electroless Ni-P coatings and optimization of process parameters using Taguchi method

    Energy Technology Data Exchange (ETDEWEB)

    Sahoo, Prasanta [Department of Mechanical Engineering, Jadavpur University, Kolkata 700 032 (India)], E-mail: psahoo@vsnl.net

    2009-04-15

    This paper reports an experimental study of wear characteristics of electroless Ni-P coatings sliding against steel. Coating process parameters are optimized for minimum wear based on L{sub 27} Taguchi orthogonal design with four process parameters, viz., bath temperature, concentration of nickel source solution, concentration of reducing agent and annealing temperature. It is observed that annealing temperature and bath temperature have the most significant influence on wear characteristics of electroless Ni-P coating. The interaction of bath temperature and concentration of nickel source solution has some significant influence on wear. The surface morphology and composition of coatings are also studied with the help of scanning electron microscopy, energy dispersed X-ray analysis and X-ray diffraction analysis. The wear mechanism in EN coatings is found to be abrasive wear.

  9. Investigation of the magnetization reversal mechanism of electrolessly deposited Co-B nanotubes

    Directory of Open Access Journals (Sweden)

    David Richardson

    2016-05-01

    Full Text Available Co-B nanotubes were prepared via an electroless deposition method. The morphology, magnetic properties and the magnetization reversal mechanism of the nanotubes were investigated. Deposition was carried out in porous polycarbonate membranes leading to the formation of Co-B nanotubes with an average external diameter of 400 nm and lengths up to 6 μm. Electroless deposition resulted in the formation of alloys with composition Co70B30 and a specific magnetization of 65.6 J T−1kg−1, which is about 40 % of that of pure Co (161 J T−1kg−1. The transversal and vortex modes were identified as the mechanisms responsible for magnetization reversal in the nanotubes. A crossover between the two modes is observed at low angles and the results are in line with current models for switching mechanisms of nanotubes.

  10. Room temperature synthesis of indium tin oxide nanotubes with high precision wall thickness by electroless deposition

    Directory of Open Access Journals (Sweden)

    Mario Boehme

    2011-02-01

    Full Text Available Conductive nanotubes consisting of indium tin oxide (ITO were fabricated by electroless deposition using ion track etched polycarbonate templates. To produce nanotubes (NTs with thin walls and small surface roughness, the tubes were generated by a multi-step procedure under aqueous conditions. The approach reported below yields open end nanotubes with well defined outer diameter and wall thickness. In the past, zinc oxide films were mostly preferred and were synthesized using electroless deposition based on aqueous solutions. All these methods previously developed, are not adaptable in the case of ITO nanotubes, even with modifications. In the present work, therefore, we investigated the necessary conditions for the growth of ITO-NTs to achieve a wall thickness of around 10 nm. In addition, the effects of pH and reductive concentrations for the formation of ITO-NTs are also discussed.

  11. Synthesis of dense nano cobalt-hydroxyapatite by modified electroless deposition technique

    Science.gov (United States)

    Mohd Zaheruddin, K.; Rahmat, A.; Shamsul, J. B.; Mohd Nazree, B. D.; Aimi Noorliyana, H.

    2016-07-01

    Cobalt-hydroxyapatite (Co-HA) composites was successfully prepared by simple electroless deposition process of Co on the surface of hydroxyapatite (HA) particles. Co deposition was carried out in an alkaline bath with sodium hypophosphite as a reducing agent. The electroless process was carried out without sensitization and activation steps. The deposition of Co onto HA was characterized by scanning electron microscopy (SEM) and energy-dispersive X-ray spectroscopy (EDX). The Co-HA composite powder was compacted and sintered at 1250°C. The Co particles were homogeneously dispersed in the HA matrix after sintering and the mechanical properties of composites was enhanced to 100 % with 3 % wt Co and gradually decreased at higher Co content.

  12. Investigation of the magnetization reversal mechanism of electrolessly deposited Co-B nanotubes

    Science.gov (United States)

    Richardson, David; Kingston, Samuel; Rhen, Fernando M. F.

    2016-05-01

    Co-B nanotubes were prepared via an electroless deposition method. The morphology, magnetic properties and the magnetization reversal mechanism of the nanotubes were investigated. Deposition was carried out in porous polycarbonate membranes leading to the formation of Co-B nanotubes with an average external diameter of 400 nm and lengths up to 6 μm. Electroless deposition resulted in the formation of alloys with composition Co70B30 and a specific magnetization of 65.6 J T-1kg-1, which is about 40 % of that of pure Co (161 J T-1kg-1). The transversal and vortex modes were identified as the mechanisms responsible for magnetization reversal in the nanotubes. A crossover between the two modes is observed at low angles and the results are in line with current models for switching mechanisms of nanotubes.

  13. Fabrication of bimetallic nanostructures via aerosol-assisted electroless silver deposition for catalytic CO conversion.

    Science.gov (United States)

    Byeon, Jeong Hoon; Kim, Jang-Woo

    2014-03-12

    Bimetallic nanostructures were fabricated via aerosol-assisted electroless silver deposition for catalytic CO conversion. An ambient spark discharge was employed to produce nanocatalysts, and the particles were directly deposited on a polytetrafluoroethylene substrate for initiating silver deposition to form Pd-Ag, Pt-Ag, Au-Ag bimetallic nanostructures as well as a pure Ag nanostructure. Kinetics and morphological evolutions in the silver deposition with different nanocatalysts were comparatively studied. The Pt catalyst displayed the highest catalytic activity for electroless silver deposition, followed by the order Pd > Au > Ag. Another catalytic activity of the fabricated bimetallic structures in the carbon monoxide conversion was further evaluated at low-temperature conditions. The bimetallic systems showed significantly higher catalytic activity than that from a pure Ag system.

  14. Room temperature synthesis of indium tin oxide nanotubes with high precision wall thickness by electroless deposition.

    Science.gov (United States)

    Boehme, Mario; Ionescu, Emanuel; Fu, Ganhua; Ensinger, Wolfgang

    2011-01-01

    Conductive nanotubes consisting of indium tin oxide (ITO) were fabricated by electroless deposition using ion track etched polycarbonate templates. To produce nanotubes (NTs) with thin walls and small surface roughness, the tubes were generated by a multi-step procedure under aqueous conditions. The approach reported below yields open end nanotubes with well defined outer diameter and wall thickness. In the past, zinc oxide films were mostly preferred and were synthesized using electroless deposition based on aqueous solutions. All these methods previously developed, are not adaptable in the case of ITO nanotubes, even with modifications. In the present work, therefore, we investigated the necessary conditions for the growth of ITO-NTs to achieve a wall thickness of around 10 nm. In addition, the effects of pH and reductive concentrations for the formation of ITO-NTs are also discussed.

  15. Laser surface heat treatment of electroless Ni-P-SiC coating on Al356 alloy

    Science.gov (United States)

    Hashemi, Sayed Hamid; Shoja-Razavi, Reza

    2016-11-01

    Electroless Ni-P-SiC coatings are recognized for their hardness and wear resistance. In the present study, electroless Ni-P coatings containing SiC particles were co-deposited on Al356 substrate. Laser surface heat treatment was performed using 700 W Nd:YAG pulsed laser. Effects of different laser operating parameters, such as laser scan rate, laser average power and defocusing distance on microstructures were investigated by optical microscopy (OM), scanning electron microscopy (SEM), X-ray diffraction (XRD) and energy dispersive spectrometer (EDS). The results of microstructural characterization indicated that the laser treatment under different operating conditions produced composite coating contained nanocrystallined Ni-based matrix with SiC particles Ni3P, Ni12P5, Ni5P2, Ni8P3 precipitates. The microhardness measurements showed that the hardness of the coating was increased up to 60%, due to laser heat treatment, without effect on base metal.

  16. Stability of nano-/microsized particles in deionized water and electroless nickel solutions.

    Science.gov (United States)

    Necula, B S; Apachitei, I; Fratila-Apachitei, L E; Teodosiu, C; Duszczyk, J

    2007-10-15

    A major problem in the co-deposition of nano- and microsized particles within electroless NiP coatings is particle dispersion in the electroless nickel solution because of the strong tendency of particles toward agglomeration and sedimentation. The stability of colloidal Al(2)O(3), CeO(2), and BN particles and Al(2)O(3)CeO(2) and Al(2)O(3)BN particle mixtures in deionized water and electroless nickel solution was investigated by zeta potential measurements and sedimentation tests. Dispersions of Al(2)O(3) and CeO(2) particles showed good stability in deionized water with zeta potential values of 55 and 39 mV, respectively. BN dispersion in deionized water was found to be relatively unstable at pH 4 with zeta potential values of -13 mV, but at higher pH (i.e., pH 5.5), the values decreased up to about -40 mV. When the dispersions were made in electroless nickel solution, a significant decrease of the zeta potential values was observed for both single particles and mixtures of particles, indicating a change in the surface charge from high positive to low negative with detrimental effects on dispersion stability. Further, the findings suggested that the stability of particle mixtures is dominated by one type of particle, i.e., the Al(2)O(3)CeO(2) dispersion is governed by the single CeO(2) particles, whereas the Al(2)O(3)BN dispersion is governed by the Al(2)O(3) particles. All the zeta potential measurements were in line with the results of the sedimentation tests (i.e., low zeta potential values corresponded to short settling times, whereas high zeta potential values corresponded to long settling times).

  17. Electroless Gold-Modified Diatoms as Surface-Enhanced Raman Scattering Supports

    Science.gov (United States)

    Pannico, Marianna; Rea, Ilaria; Chandrasekaran, Soundarrajan; Musto, Pellegrino; Voelcker, Nicolas H.; De Stefano, Luca

    2016-06-01

    Porous biosilica from diatom frustules is well known for its peculiar optical and mechanical properties. In this work, gold-coated diatom frustules are used as low-cost, ready available, functional support for surface-enhanced Raman scattering. Due to the morphology of the nanostructured surface and the smoothness of gold deposition via an electroless process, an enhancement factor for the p-mercaptoaniline Raman signal of the order of 105 is obtained.

  18. Influence of Process Parameters on Microhardness of Electroless Ni-B Coatings

    Directory of Open Access Journals (Sweden)

    Suman Kalyan Das

    2012-01-01

    Full Text Available Electroless Ni-B coatings have found large applications due to their high hardness and wear resistance. The present paper tries to investigate the influence of coating process parameters on the microhardness of electroless Ni-B coating with the help of Taguchi analysis. Four parameters, namely, bath temperature, concentration of reducing agent, concentration of nickel source, and annealing temperature, are considered and fitted into an L27 orthogonal array to find out the optimized condition for improved hardness of the coating. The optimized condition is found to yield about 19% improvement in hardness of the coating compared to the initial condition. The significance of the process parameters and their interactions on the hardness of Ni-B coating is studied with the help of analysis of variance, which revealed that annealing temperature and concentration of reducing agent have significant influence over the hardness characteristics of electroless Ni-B coating. The compositional, microstructural, and phase structure analyses are conducted with the help of energy-dispersive X-ray analysis, scanning electron microscope, and X-ray diffraction analyzer, respectively.

  19. Preparation of Ni-Sn alloys by an electroless-deposition method

    Energy Technology Data Exchange (ETDEWEB)

    Shimauchi, Hidenori; Ozawa, Susumu; Tamura, Keiu; Osaka, Tetsuya (Waseda Univ., Tokyo (Japan). Dept. of Applied Chemistry)

    1994-06-01

    Ni-Sn alloy is expected for as a functional material, because of its excellent corrosion resistance, wear resistance, and solderability. Electroless-deposited Ni-Sn alloy films were investigated to increase tin content in the deposit. The maximum tin contents of electroless Ni-Sn-P and Ni-Sn-B were ca. 30 atom percent (a/o) and 42 a/o, respectively. The maximum tin contents in the case of Ni-Sn-B was nearly equal to that of electrodeposited Ni-Sn alloy already reported. The crystallinity of Ni-Sn-P and Ni-Sn-B alloys was raised up with an increase in tin content. The corrosion resistance of Ni-Sn-P and Ni-Sn-B alloys was between that of amorphous and crystalline electroless-deposited Ni-P. Codeposition of tin into Ni-P films improved solderability, but into the Ni-B films, the solderability of Ni-Sn-B films situated in the region between those of Ni-P and NiB, because the solderability of NiB is higher.

  20. Fabrication of antibacterial and hydrophilic electroless Ni-B coating on 316L stainless steel

    Science.gov (United States)

    Bülbül, Ferhat; Bülbül, Leman Elif

    2016-01-01

    Biomaterial-associated bacterial infection is one of the most common complications with medical vehicles and implants made of stainless steel. A surface coating treatment like electroless Ni-B deposition, a new candidate to be used in a broad range of engineering applications owing to many advantages such as low cost, thickness uniformity, good wear resistance, may improve the antibacterial activity and physical properties of biomedical devices made of stainless steel. In this study, the antibacterial property of the electroless Ni-B film coated on AISI 316L (UNS S31603) stainless steel is basically investigated. Inhibition halo diameter measurement after incubation at 37 °C and 24 h demonstrates the existence of antimicrobial activity of the electroless Ni-B coating deposited on 316L stainless steel over the Escherichia coli test bacteria. The results of X-ray diffraction, scanning electron microscopy, atomic force microscopy and microhardness measurement studies confirms that the coating deposited on the substrate has an uniform amorphous and a harder structure. Besides, the wettability property of the uncoated substrate and the coating was measured as the contact angle of water. The water contact angle reduced about from 97.7 to 69.25°.

  1. Processless offset printing plates

    Directory of Open Access Journals (Sweden)

    Sanja Mahović Poljaček

    2015-06-01

    Full Text Available With the implementation of platesetters in the offset printing plate making process, imaging of the printing plate became more stable and ensured increase of the printing plate quality. But as the chemical processing of the printing plates still highly influences the plate making process and the graphic reproduction workflow, development of printing plates that do not require chemical processing for offset printing technique has been one of the top interests in graphic technology in the last few years. The main reason for that came from the user experience, where majority of the problems with plate making process could be connected with the chemical processing of the printing plate. Furthermore, increased environmental standards lead to reducing of the chemicals used in the industrial processes. Considering these facts, different types of offset printing plates have been introduced to the market today. This paper presents some of the processless printing plates.

  2. Fractal Aggregation of Copper Particles using Electroless Cell

    Directory of Open Access Journals (Sweden)

    S.Q.Chishty

    2013-12-01

    Full Text Available A phenomenon In which the particles performing Brownian motion when hit the aggregates become the part of it is known as Diffusion limited aggregation (DLA, which produces a fractal shape. Experimental efforts are discussed through which some DLA shapes arc obtained. For this purpose different electrolytic solutions are used. Electro less cells are also designed and constructed using standard methods. The cells have to be flexible in the sense that changing of plates and solutions should be easier for photography. We used compounds of copper,. for growth of fractals. Within a very short time metallic dendrites appeared in the cell at different operating conditions. These images were photographed, while desired branching structures in copper sulphate solution were seen. Results thus obtained are compared with the growth of DLA.

  3. High sensitivity hydrogen sensing with Pt-decorated porous gallium nitride prepared by metal-assisted electroless etching.

    Science.gov (United States)

    Duan, Barrett K; Bohn, Paul W

    2010-05-01

    A unique hydrogen sensor structure based on Pt-decorated porous gallium nitride (PGaN) was fabricated by a two-step process consisting of metal-assisted electroless etching to produce PGaN with highly anisotropic pores followed by electroless deposition of Pt in the pores from an ammoniacal PtCl(6)(2-) solution. The Pt-decorated PGaN structure contains 50-100 nm diameter nanopores which are 400 nm to 1 microm deep and filled with Pt islands. Both electroless etching and deposition steps are done in solution and allow for large-scale production. An AC four-point probe conductivity measurement was implemented at f = 1 kHz, a frequency where the impedance of Pt-PGaN is nearly entirely resistive, and the change in conductance upon H(2) exposure was measured for three sample types: PGaN with a surface sputtered layer of Pt only; unetched GaN (CGaN) with both sputtered and electrolessly deposited Pt; and PGaN with both sputtered and electrolessly deposited Pt. The hydrogen sensing performance of the Pt-filled PGaN sensor was more than an order of magnitude better than either of the other two sample types under all experimental conditions, an observation attributed to the significant increase in Pt-GaN interfacial area in the electrolessly decorated PGaN samples, exhibiting a response to H2 concentrations as low as 1 ppm. The conductance changes are ascribed to adsorption-induced changes in interfacial polarization that produce changes in band bending and thus to the width of the space charge region near the Pt-GaN interface.

  4. Effect of pickling processes on the microstructure and properties of electroless Ni-P coating on Mg-7.5Li-2Zn-1Y alloy

    Institute of Scientific and Technical Information of China (English)

    Chunjie Xu; Liping Chen; Ling Yu; Jinxiao Zhang; Zhongming Zhang; Jincheng Wang

    2014-01-01

    The electroless plating Ni–P is prepared on the surface of Mg–7.5Li–2Zn–1Y alloys with different pickling processes. The microstructure and properties of Ni–P coating are investigated. The results show that the Ni–P coatings deposited using the different pickling processes have a different high phosphorus content amorphous Ni–P solid solution structure, and the Ni–P coatings exhibit higher hardness. There is higher phosphorus content of Ni–P amorphous coating using 125 g/L CrO3 and 110 ml/L HNO3 (w=68%) than using 180 g/L CrO3 and 1 g/L KF during pre-treatment, and the coating structure is more compact, and the Ni–P coatings exhibit more excellent adhesion with substrate (Fc up to 22 N). The corrosion potential of Ni–P coating is improved and exhibits good corrosion resistance. As a result, Mg-7.5Li-2Zn-1Y alloy is remarkably protected by the Ni–P coating.

  5. Preparation and Study of Electromagnetic Interference Shielding Materials Comprised of Ni-Co Coated on Web-Like Biocarbon Nanofibers via Electroless Deposition

    Directory of Open Access Journals (Sweden)

    Xiaohu Huang

    2015-01-01

    Full Text Available Electromagnetic interference (EMI shielding materials made of Ni-Co coated on web-like biocarbon nanofibers were successfully prepared by electroless plating. Biocarbon nanofibers (CF with a novel web-like structure comprised of entangled and interconnected carbon nanoribbons were obtained using bacterial cellulose pyrolyzed at 1200°C. Paraffin wax matrix composites filled with different loadings (10, 20, and 30 wt%, resp. of CF and Ni-Co coated CF (NCCF were prepared. The electrical conductivities and electromagnetic parameters of the composites were investigated by the four-probe method and vector network analysis. From these results, the EMI shielding efficiencies (SE of NCCF composites were shown to be significantly higher than that of CF at the same mass fraction. The paraffin wax composites containing 30 wt% NCCF showed the highest EMI SE of 41.2 dB (99.99% attenuation, which are attributed to the higher electrical conductivity and permittivity of the NCCF composites than the CF composites. Additionally, EMI SE increased with an increase in CF and NCCF loading and the absorption was determined to be the primary factor governing EMI shielding. This study conclusively reveals that NCCF composites have potential applications as EMI shielding materials.

  6. Effect of pickling processes on the microstructure and properties of electroless Ni–P coating on Mg–7.5Li–2Zn–1Y alloy

    Directory of Open Access Journals (Sweden)

    Chunjie Xu

    2014-12-01

    Full Text Available The electroless plating Ni–P is prepared on the surface of Mg–7.5Li–2Zn–1Y alloys with different pickling processes. The microstructure and properties of Ni–P coating are investigated. The results show that the Ni–P coatings deposited using the different pickling processes have a different high phosphorus content amorphous Ni–P solid solution structure, and the Ni–P coatings exhibit higher hardness. There is higher phosphorus content of Ni–P amorphous coating using 125 g/L CrO3 and 110 ml/L HNO3 (w=68% than using 180 g/L CrO3 and 1 g/L KF during pre-treatment, and the coating structure is more compact, and the Ni–P coatings exhibit more excellent adhesion with substrate (Fc up to 22 N. The corrosion potential of Ni–P coating is improved and exhibits good corrosion resistance. As a result, Mg-7.5Li-2Zn-1Y alloy is remarkably protected by the Ni–P coating.

  7. Inkjet-printing- and electroless-plating- based fabrication of RF circuit structures on high-frequency substrates

    NARCIS (Netherlands)

    Sridhar, A.; Reiding, J.; Adelaar, H.; Achterhoek, F.; Dijk, van D.J.; Akkerman, R.

    2009-01-01

    In this paper, a method to fabricate radio frequency (RF) circuit structures is described. This method involves inkjet printing of a silver nanoparticle-based ink on a functional substrate material to create the seed track (i.e., the seed layer), onto which copper is subsequently deposited by an ele

  8. Fabrication of RF Circuit Structures on a PCB Material Using Inkjet Printing-Electroless Plating and the Substrate Preparation Therefor

    NARCIS (Netherlands)

    Sridhar, A.; Perik, M.A.; Reiding, J.; Dijk, van D.J.; Akkerman, R.

    2009-01-01

    This paper describes the optimisation of the surface characteristics of a high-frequency substrate material widely used in the PCB (printed circuit board) industry by means of CF4/O2 plasma etching, in order to make it suitable for the fabrication of RF (radio frequency) circuit structures by a comb

  9. Influence of nonionic surfactant on electroless copper deposition%非离子型表面活性剂对化学沉铜的影响

    Institute of Scientific and Technical Information of China (English)

    余霞; 胡光辉; 潘湛昌; 庞文萍; 魏志钢; 肖楚民; 张晃初; 曾祥福

    2013-01-01

    Electroless copper plating was carried out with brass sheet as substrate. The basic bath composition and process conditions are as follows: CuSO4·5H2O 10 g/L, EDTA-2Na 40 g/L, NaOH 12 g/L, HCHO 10 mL/L, pH 13.0, temperature 35 ℃, and time 10 min. The effects of nonionic surfactants such as OP-10, Triton X-100, and Tween-80 on the starting time of copper deposition, deposition rate, ductility, and grain refinement of Cu coating were studied. The results showed that the three kinds of surfactant can reduce copper deposition rate. The ductility and grain refinement of copper coating are improved by Triton X-100 and OP-10 when their mass concentration is 1-9 mg/L, while the starting time of copper deposition is delayed. Tween-80 can reduce the deposition rate significantly but has little impact on the ductility of Cu coating. Compared to Triton X-100 and Tween-80, OP-10 is the favorable agent for ductility improvement of electroless Cu coating.%以黄铜片为基体进行化学镀铜,基础镀液组成和工艺条件为:CuSO4·5H2O 10 g/L,EDTA-2Na40 g/L,NaOH 12 g/L,HCHO 10 mL/L,pH 13.0,温度35℃,时间10 min.研究了非离子型表面活性剂OP-10、曲拉通X-100和吐温-80对起镀时间、沉积速率、铜镀层韧性和晶粒细化的影响.结果表明,3种表面活性剂都会降低铜的沉积速率.质量浓度为1 ~9 mg/L时,曲拉通X-100和OP-10都能使铜镀层的韧性改善和晶粒细化,同时延长起镀时间;吐温-80会显著降低铜的沉积速率,但对铜镀层韧性的影响不大.与曲拉通X-100和吐温-80相比,OP-10是较理想的沉铜韧性改善剂.

  10. Electroless Deposition of W-doped Ag Dendrites from HF Solution

    Institute of Scientific and Technical Information of China (English)

    YE Wei-Chun; MA Chuan-Li; CHANG Yan-Long; WANG Chun-Ming

    2008-01-01

    A simple method was developed for the preparation of W-doped Ag dendrites by using electroless deposition from hydrofluoride solution. The samples characterized by XPS, XRD, SEM and TEM techniques, show that the growth of silver is leading and can not be changed essentially by tungstate ions in the Ag-W binary system. A doping mode of W element was proposed, i.e., the doping of W may occur during silver deposition through chemi-sorption-chemical bonding of oxygen atoms of tungstate dimer with silver. Cyclic voltammetry was employed to determine the chemical bonding energy between silver and oxygen.

  11. Magnetic properties of electroless nickel-phosphorus coated multi-walled carbon nanotubes.

    Directory of Open Access Journals (Sweden)

    Bridget Ingham

    2008-06-01

    Full Text Available Nickel-phosphorus (EN deposited multi-walled carbon nanotubes (MWCNTs were prepared using an electroless platingtechnique. The D.C and A.C magnetic behavior of the composites showed that pre-acid treatment of the MWCNTs prior toelectroless deposition greatly enhanced the magnetic susceptibility at 5 K producing a composite with antiferromagneticcorrelations and a superparamagnetic transition at 65.5 K. Raman scattering analysis suggests that there is no directinteraction of the nickel-phosphorus deposit and the MWCNTs.

  12. Research Progress in Solderable Black Pad of Electroless Nickel/Immersion Gold

    Institute of Scientific and Technical Information of China (English)

    Liu Haiping; Li Ning; Bi Sifu; Li Deyu

    2007-01-01

    Electroless nickel/immersion gold (ENIG) technology is widely used as one of the surface final finish for electronics packaging substrate and printed circuit board (PCB), providing a protective, conductive and solderable surface. However, there is a solder joint interfacial brittle fracture (or solderability failure) of using the ENIG coating. The characteristics and the application of ENIG technology were narrated in this paper. The research progress on the solderability failure of ENIG was introduced. The mechanism of "black pad" and the possible measure of eliminating or alleviating the "black pad" were also introduced. The development direction and market prospects of ENIG were prospected.

  13. Electrochemical Tailoring of Fibrous Polyaniline and Electroless Decoration with Gold and Platinum Nanoparticles.

    Science.gov (United States)

    Abdelhamid, Muhammad E; Snook, Graeme A; O'Mullane, Anthony P

    2016-09-06

    Presented in this work is a facile and quick electrochemical method for controlling the morphology of thick polyaniline (PANi) films, without the use of templates. By stepping the polymerization potential from high voltages to a lower (or series of lower) voltage(s), we successfully controlled the morphology of the polymer, and fibrous structures, unique to each potential step, were achieved. In addition, the resultant film was tested electrochemically for its viability as an electrode material for flexible batteries and supercapacitors. Furthermore, the PANi film was decorated with gold and platinum nanoparticles via an electroless deposition process for possible electrocatalytic applications, whereby the oxidation of hydrazine at the composite was investigated.

  14. Growth Plate Fractures

    Science.gov (United States)

    ... the most widely used by doctors is the Salter-Harris system, described below. Type I Fractures These ... incidence of growth plate fractures peaks in adolescence. Salter-Harris classification of growth plate fractures. AAOS does ...

  15. Create Your Plate

    Medline Plus

    Full Text Available ... Planning Meals Diabetes Meal Plans Create Your Plate Gluten Free Diets Meal Planning for Vegetarian Diets Cook ... Create Your Plate Meal Planning for Vegetarian Diets Gluten Free Diets Holiday Meal Planning Cook with Heart- ...

  16. Create Your Plate

    Medline Plus

    Full Text Available ... steps to get started: Using your dinner plate, put a line down the middle of the plate. ... vegetables . Now in one of the small sections, put grains and starchy foods. See this list of ...

  17. Effect of Addition of Polytetrafluoroethylene (PTFE) and Silicon Carbide (SIC) on Properties of Electroless Nickel AHoy Coatings

    Institute of Scientific and Technical Information of China (English)

    WUYu-cheng; HUXiao-ye; WANGWen.fang; HUANGXin-min

    2004-01-01

    Electroless nickel (copper)-phosphorus-silicon carbide (SiC)-polytetrafluorocthylene(PTFE) composite coatigs were prepared by adding SiC and PTFE into electroless nickel(copper)-phosphorus alloy baths.The effects of addition of SiC and PTFE on depositing rate.microhardness.wear resistance and anti-fiction of the resulted composite coatings were studied.The results indicated that electroless nickel(copper).phosphorus alloy coatings were grealty improved in depositing rate,microhardness,wear resistance and antifriction by co-deposited proper amount of SiC and PTFE.

  18. Accelerated plate tectonics.

    Science.gov (United States)

    Anderson, D L

    1975-03-21

    The concept of a stressed elastic lithospheric plate riding on a viscous asthenosphere is used to calculate the recurrence interval of great earthquakes at convergent plate boundaries, the separation of decoupling and lithospheric earthquakes, and the migration pattern of large earthquakes along an arc. It is proposed that plate motions accelerate after great decoupling earthquakes and that most of the observed plate motions occur during short periods of time, separated by periods of relative quiescence.

  19. 代银镀层技术研究进展%Advances in Research on Plating Technology of Substitute for Silver Coating

    Institute of Scientific and Technical Information of China (English)

    王崇蕊; 郝建军; 董春艳; 刘新院

    2011-01-01

    Several plating methods of substitute for Silver coating such as tin electroplating with sulfate electrolyte, Sn-Ce and acid bright Sn-Ce-Bi alloy electroplating were described. Ni-P/Ni-B double-layer electroless plating, and tin electroless plating followed by Sn-Ce-Sb electroplating method were also introduced. The characteristics of these plating methods were briefly summarized, and the developing trends of these methods were put forward.%介绍了几种替代银镀层的镀覆方法,其中有硫酸盐电解液镀锡、电镀锡-铈合金、酸性光亮镀锡-铈-铋合金等.化学镀Ni-P/Ni-B双层合金镀层,电镀和化学镀相结合的方法有化学镀锡和电镀锡-铈-锑合金.并归纳了各种代银镀层方法的特点,指出了代银镀层技术的发展趋势.

  20. Obliquity along plate boundaries

    Science.gov (United States)

    Philippon, Mélody; Corti, Giacomo

    2016-12-01

    Most of the plate boundaries are activated obliquely with respect to the direction of far field stresses, as roughly only 8% of the plate boundaries total length shows a very low obliquity (ranging from 0 to 10°, sub-orthogonal to the plate displacement). The obliquity along plate boundaries is controlled by (i) lateral rheological variations within the lithosphere and (ii) consistency with the global plate circuit. Indeed, plate tectonics and magmatism drive rheological changes within the lithosphere and consequently influence strain localization. Geodynamical evolution controls large-scale mantle convection and plate formation, consumption, and re-organization, thus triggering plate kinematics variations, and the adjustment and re-orientation of far field stresses. These geological processes may thus result in plate boundaries that are not perpendicular but oblique to the direction of far field stresses. This paper reviews the global patterns of obliquity along plate boundaries. Using GPlate, we provide a statistical analysis of present-day obliquity along plate boundaries. Within this framework, by comparing natural examples and geological models, we discuss deformation patterns and kinematics recorded along oblique plate boundaries.

  1. Fabrication of silicon nanowire arrays by macroscopic galvanic cell-driven metal catalyzed electroless etching in aerated HF solution.

    Science.gov (United States)

    Liu, Lin; Peng, Kui-Qing; Hu, Ya; Wu, Xiao-Ling; Lee, Shuit-Tong

    2014-03-05

    Macroscopic galvanic cell-driven metal catalyzed electroless etching (MCEE) of silicon in aqueous hydrofluoric acid (HF) solution is devised to fabricate silicon nanowire (SiNW) arrays with dissolved oxygen acting as the one and only oxidizing agent. The key aspect of this strategy is the use of a graphite or other noble metal electrode that is electrically coupled with silicon substrate.

  2. Analysis of Platinum Content in Used Auto Catalytic Converter Carriers and the Possibility of its Recovery

    Directory of Open Access Journals (Sweden)

    Saternus M.

    2014-06-01

    Full Text Available Obecnie każdy wyprodukowany samochód musi być wyposażony w katalizator, w którym metale szlachetne takie jak platyna, pallad czy rod pełnią funkcje katalityczne. Czas życia katalizatorów jest ograniczony, zatem zostają one zastąpione nowymi, a stare stanowią ważne źródło platynowców. Zużyte katalizatory samochodowe przerabiane są hydrometalurgicznie lub pirometalurgicznie. Jednakże pierwszym etapem takiego przerobu powinna być analiza chemiczna. W pracy analizie na zawartość platyny poddano kilka różnych nośników katalitycznych pochodzących z różnych samochodów. Do tego celu posłużył elektronowy mikroskop skaningowy. Przedstawiono strukturę analizowanych nośników katalitycznych, ich analizę chemiczną jak również wykresy EDS (Energy Dispersive Spectrum. Przeprowadzono dyskusję wyników i możliwych metod odzysku platyny.

  3. Wear behavior of electroless Ni-P-W coating under lubricated condition - a Taguchi based approach

    Science.gov (United States)

    Mukhopadhyay, Arkadeb; Duari, Santanu; Barman, Tapan Kumar; Sahoo, Prasanta

    2016-09-01

    The present study aims to investigate the tribological behavior of electroless Ni-P-W coating under engine oil lubricated condition to ascertain its suitability in automotive applications. Coating is deposited onto mild steel specimens by the electroless method. The experiments are carried out on a pin - on - disc type tribo tester under lubrication. Three tribotesting parameters namely the applied normal load, sliding speed and sliding duration are varied at their three levels and their effects on the wear depth of the deposits are studied. The experiments are carried out based on the combinations available in Taguchi's L27 orthogonal array (OA). Optimization of the tribo-testing parameters is carried out using Taguchi's S/N ratio method to minimize the wear depth. Analysis of variance carried out at a confidence level of 99% indicates that the sliding speed is the most significant parameter in controlling the wear behavior of the deposits. Coating characterization is done using scanning electron microscope, energy dispersive X-ray analysis and X-ray diffraction techniques. It is seen that the wear mechanism under lubricated condition is abrasive in nature.

  4. Wear Performance Optimization of Electroless Ni-B Coating Using Taguchi Design of Experiments

    Directory of Open Access Journals (Sweden)

    S. K. DAS

    2010-12-01

    Full Text Available The present study outlines the use of Taguchi parameter design to minimize the wear performance of electroless Ni-B coating by optimizing the tribological testing parameters. The tests are carried out in a multi- tribotester and the three parameters viz. load (L, speed (S and time (T are considered with three levels each. An L27 array is used to accommodate the three factors as well as their interaction effects. The Taguchi experiments gave the optimal combination of parameters L1S2T1 (50 N for load, 60 rpm for speed and 5 minute for time. Furthermore, a statistical analysis of variance reveals that both load and time have significant influence over the wear behavior of electroless coating. Also the interaction between load and speed and that between load and time influence wear quite significantly. The coating is characterized using scanning electron microscopy, energy dispersive X-ray analysis and X-ray diffraction analysis. The wear mechanism is also studied and found to be abrasive in nature.

  5. Characterization of phase transformation behaviour and microstructural development of electroless Ni-B coating

    Energy Technology Data Exchange (ETDEWEB)

    Pal, Soupitak, E-mail: soupitak.pal@gmail.com [Department of Materials Engineering, Indian Institute of Science, C.V. Raman Avenue, Bangalore 560012 (India); Verma, Nisha; Jayaram, Vikram [Department of Materials Engineering, Indian Institute of Science, C.V. Raman Avenue, Bangalore 560012 (India); Biswas, Sanjay Kumar [Department of Mechanical Engineering, Indian Institute of Science, Bangalore 560012 (India); Riddle, Yancy [UCT Coatings Inc, FL (United States)

    2011-10-25

    Highlights: {yields} Phase transformation behaviour of electroless Ni-B coating in conjunction with microstructural development was studied. {yields} As deposited coating exhibits a novel phase separated microstructure of various length scales. {yields} Crystallization behaviour of the coating is strongly composition dependent. {yields} Deposition process itself induces compositional heterogeneity in the coating. - Abstract: Phase transformation behaviour of amorphous electroless Ni-B coating with a targeted composition of Ni-6 wt% B is characterized in conjunction with microstructural development and hardness. Microscopic observations of the as-deposited coating display a novel microstructure which is already phase separated at multiple length scales. Spherical colonies of {approx}5 {mu}m consist of 2-3 {mu}m nodular regions which are surrounded by {approx}2-3 {mu}m region that contains fine bands ranging from 10 to 70 nm in width. The appearance of three crystalline phases in this binary system at different stages of heat treatment and the concomitant variation in hardness are shown to arise from nanoscale fluctuations in the as-deposited boron content from 4 to 8 wt%. High temperature annealing reveals continuous crystallization up to 430 deg. C, overlapping with the domain of B loss due to diffusion into the substrate. The implications of such a microstructure for optimal heat treatment procedures are discussed.

  6. Fabrication of micro-Ni arrays by electroless and electrochemical depositions with etched porous aluminum template

    Indian Academy of Sciences (India)

    Houfang Lu; Kangping Yan; Jixin Yan; Jianzhong Wang

    2010-10-01

    Nickel micro-arrays were fabricated by electroless and electrochemical deposition in an etched porous aluminum membrane. The aluminum membrane with metal characteristic could be fabricated from high-purity aluminium by electrochemical method. The aluminum reduced Ni2+ into Ni and the formed Ni nuclei served as the catalyst for further reduction of Ni2+ in electroless solution. With the help of the membrane, nickel micro-columns of about 1–2 m diameter were obtained. The surface-deposited nickel layer served as a substrate for the nickel micro-columns, and the resulting material possessed strong mechanical strength. Electrochemical deposition was operated without preparing a conductive layer on the template due to the conductivity of the aluminum membrane. Nickel micro-tubes with an outer diameter of about 1–2 m and a wall thickness in the order of tens of nm were obtained. The nickel micro-arrays were characterized by scanning electron microscope (SEM), X-ray diffraction (XRD) and X-ray photoelectron spectroscopy (XPS).

  7. Hall Measurements on Carbon Nanotube Paper Modified With Electroless Deposited Platinum

    Directory of Open Access Journals (Sweden)

    Iwuoha Emmanuel

    2009-01-01

    Full Text Available Abstract Carbon nanotube paper, sometimes referred to as bucky paper, is a random arrangement of carbon nanotubes meshed into a single robust structure, which can be manipulated with relative ease. Multi-walled carbon nanotubes were used to make the nanotube paper, and were subsequently modified with platinum using an electroless deposition method based on substrate enhanced electroless deposition. This involves the use of a sacrificial metal substrate that undergoes electro-dissolution while the platinum metal deposits out of solution onto the nanotube paper via a galvanic displacement reaction. The samples were characterized using SEM/EDS, and Hall-effect measurements. The SEM/EDS analysis clearly revealed deposits of platinum (Pt distributed over the nanotube paper surface, and the qualitative elemental analysis revealed co-deposition of other elements from the metal substrates used. When stainless steel was used as sacrificial metal a large degree of Pt contamination with various other metals was observed. Whereas when pure sacrificial metals were used bimetallic Pt clusters resulted. The co-deposition of a bimetallic system upon carbon nanotubes was a function of the metal type and the time of exposure. Hall-effect measurements revealed some interesting fluctuations in sheet carrier density and the dominant carrier switched from N- to P-type when Pt was deposited onto the nanotube paper. Perspectives on the use of the nanotube paper as a replacement to traditional carbon cloth in water electrolysis systems are also discussed.

  8. Effect of strontium tantalate surface texture on nickel nanoparticle dispersion by electroless deposition

    Energy Technology Data Exchange (ETDEWEB)

    Compean-González, C.L. [Universidad Autónoma de Nuevo León, Facultad de Ingeniería Civil, Departamento de Ecomateriales y Energía, Av. Universidad s/n, Ciudad Universitaria, San Nicolás de los Garza, Nuevo León C.P. 66451 (Mexico); Arredondo-Torres, V.M. [Facultad de Químico Farmacobiología, Universidad Michoacana de San Nicolás de Hidalgo, Tzintzuntzan #173, Col. Matamoros, Morelia, Michoacán C.P. 58240 (Mexico); Zarazúa-Morin, M.E. [Universidad Autónoma de Nuevo León, Facultad de Ingeniería Civil, Departamento de Ecomateriales y Energía, Av. Universidad s/n, Ciudad Universitaria, San Nicolás de los Garza, Nuevo León C.P. 66451 (Mexico); Figueroa-Torres, M.Z., E-mail: m.zyzlila@gmail.com [Universidad Autónoma de Nuevo León, Facultad de Ingeniería Civil, Departamento de Ecomateriales y Energía, Av. Universidad s/n, Ciudad Universitaria, San Nicolás de los Garza, Nuevo León C.P. 66451 (Mexico)

    2015-09-15

    Highlights: • Efficient short-time procedure for nickel nanoparticles dispersion by electroless. • Nanoparticles are spherical in shape with an average size of 15 nm. • Influence of surface texture on deposition temperature and time was observed. • Nickel deposition can be done below 50 °C. - Abstract: The present work studies the effect of smooth and porous texture of Sr{sub 2}Ta{sub 2}O{sub 7} on its surface modification with nickel nanoparticles through electroless deposition technique. The influence of temperature to control Ni nanoparticles loading amount and dispersion were analyzed. Nitrogen adsorption isotherms were used to examine surface texture characteristics. The morphology was observed by scanning electron microscopy (MEB) equipped with an energy dispersive spectrometry system (EDS), which was used to determine the amount of deposited Ni. The material with smooth texture (SMT) consists of big agglomerates of semispherical shape particles of 400 nm. Whilst the porous texture (PRT) exhibit a pore-wall formed of needles shape particles of around 200 nm in size. Results indicated that texture characteristics strongly influence the deposition reaction rate; for PRT oxide, Ni deposition can be done from 20 °C while for SMT oxide deposition begins at 40 °C. Analysis of Sr{sub 2}Ta{sub 2}O{sub 7} surface indicated that in both textures, Ni nanoparticles with spherical shape in the range of 10–20 nm were obtained.

  9. Preparation of Nanostructured Microporous Metal Foams through Flow Induced Electroless Deposition

    Directory of Open Access Journals (Sweden)

    Galip Akay

    2015-01-01

    Full Text Available Monolithic nanostructured metallic porous structures with a hierarchy of pore size ranging from ca. 10 μm to 1 nm are processed for use as microreactors. The technique is based on flow induced electroless deposition of metals on a porous template known as PolyHIPE Polymer. The process is conducted in a purpose built flow reactor using a processing protocol to allow uniform and efficient metal deposition under flow. Nickel chloride and sodium hypophosphite were used as the metal and reducing agent, respectively. Electroless deposition occurs in the form of grains with a composition of NixPy in which the grain size range was ca. 20–0.2 μm depending on the composition of the metal deposition solution. Structure formation in the monoliths starts with heat treatment above 600°C resulting in the formation of a 3-dimensional network of capillary-like porous structures which form the walls of large arterial pores. These monoliths have a dense but porous surface providing mechanical strength for the monolith. The porous capillary-like arterial pore walls provide a large surface area for any catalytic activity. The mechanisms of metal deposition and nanostructure formation are evaluated using scanning electron microscopy, energy dispersive X-ray analysis, XRD, BET-surface area, and mercury intrusion porosimetry.

  10. From Nanowires to Nanopores: A Versatile Method for Electroless Deposition of Nanostructures on Micropatterned Organic Substrates.

    Science.gov (United States)

    Ellsworth, Ashley A; Walker, Amy V

    2016-03-22

    We demonstrate a fast, flexible, parallel, and highly controllable method by which to synthesize a variety of nanoscale and mesoscale structures. This method addresses one of the most significant challenges in nanoscience: the in situ parallel placement and synthesis of nano-objects over the mesoscale. The method is based on electroless nanowire deposition on micropatterned substrates (ENDOM). In ENDOM nanostructures are produced at the boundary between two unlike materials if two conditions are met: (a) deposition is kinetically preferred on one of the materials while (b) transport of reactants is favored on the other. In this study, copper structures were deposited on patterned -OH/-CH3-terminated alkanethiolate self-assembled monolayers (SAMs) by exploiting the different reaction rates of electroless deposition on these using the reducing agent dimethylamine borane (DMAB). We demonstrate production of nanowires (width < 100 nm), mesowires (100 nm < width < ∼3000 nm), nanorings, nanopores, and nanochannels. We show that a variety of experimental conditions can be employed, making this method compatible with many substrates. We have also studied the nucleation and growth kinetics of the ENDOM process. The width of the deposit grows exponentially with deposition time and can be modeled using classical nucleation theory. Although the deposit width increases, the height and grain size of the copper deposit is constant (to within experimental uncertainty) with deposition time. These observations indicate that the minimum deposit width is controlled by the nanoparticle dimensions and so can be controlled using the reaction conditions.

  11. Surface modification of battery electrodes via electroless deposition with improved performance for Na-ion batteries.

    Science.gov (United States)

    Lahiri, Abhishek; Olschewski, Mark; Gustus, René; Borisenko, Natalia; Endres, Frank

    2016-06-01

    Sodium-ion batteries (SIBs) are emerging as potential stationary energy storage devices due to the abundance and low cost of sodium. A simple and energy efficient strategy to develop electrodes for SIBs with a high charge/discharge rate is highly desirable. Here we demonstrate that by surface modification of Ge, using electroless deposition in SbCl3/ionic liquids, the stability and performance of the anode can be improved. This is due to the formation of GexSb1-x at the surface leading to better diffusion of Na, and the formation of a stable twin organic and inorganic SEI which protects the electrode. By judicious control of the surface modification, an improvement in the capacity to between 50% and 300% has been achieved at high current densities (0.83-8.4 A g(-1)) in an ionic liquid electrolyte NaFSI-[Py1,4]FSI. The results clearly demonstrate that an electroless deposition based surface modification strategy in ionic liquids offers exciting opportunities in developing superior energy storage devices.

  12. Hall measurements on carbon nanotube paper modified with electroless deposited platinum.

    Science.gov (United States)

    Petrik, Leslie; Ndungu, Patrick; Iwuoha, Emmanuel

    2009-09-18

    Carbon nanotube paper, sometimes referred to as bucky paper, is a random arrangement of carbon nanotubes meshed into a single robust structure, which can be manipulated with relative ease. Multi-walled carbon nanotubes were used to make the nanotube paper, and were subsequently modified with platinum using an electroless deposition method based on substrate enhanced electroless deposition. This involves the use of a sacrificial metal substrate that undergoes electro-dissolution while the platinum metal deposits out of solution onto the nanotube paper via a galvanic displacement reaction. The samples were characterized using SEM/EDS, and Hall-effect measurements. The SEM/EDS analysis clearly revealed deposits of platinum (Pt) distributed over the nanotube paper surface, and the qualitative elemental analysis revealed co-deposition of other elements from the metal substrates used. When stainless steel was used as sacrificial metal a large degree of Pt contamination with various other metals was observed. Whereas when pure sacrificial metals were used bimetallic Pt clusters resulted. The co-deposition of a bimetallic system upon carbon nanotubes was a function of the metal type and the time of exposure. Hall-effect measurements revealed some interesting fluctuations in sheet carrier density and the dominant carrier switched from N- to P-type when Pt was deposited onto the nanotube paper. Perspectives on the use of the nanotube paper as a replacement to traditional carbon cloth in water electrolysis systems are also discussed.

  13. Electroless deposition of NiCrB diffusion barrier layer film for ULSI-Cu metallization

    Science.gov (United States)

    Wang, Yuechun; Chen, Xiuhua; Ma, Wenhui; Shang, Yudong; Lei, Zhengtao; Xiang, Fuwei

    2017-02-01

    NiCrB films were deposited on Si substrates using electroless deposition as a diffusion barrier layer for Cu interconnections. Samples of the prepared NiCrB/SiO2/Si and NiCrB/Cu/NiCrB/SiO2/Si were annealed at temperatures ranging from 500 °C to 900 °C. The reaction mechanism of the electroless deposition of the NiCrB film, the failure temperature and the failure mechanism of the NiCrB diffusion barrier layer were investigated. The prepared samples were subjected to XRD, XPS, FPP and AFM to determine the phases, composition, sheet resistance and surface morphology of samples before and after annealing. The results of these analyses indicated that the failure temperature of the NiCrB barrier film was 900 °C and the failure mechanism led to crystallization and grain growth of the NiCrB barrier layer after high temperature annealing. It was found that this process caused Cu grains to reach Si substrate through the grain boundaries, and then the reaction between Cu and Si resulted in the formation of highly resistive Cu3Si.

  14. Electroless deposition of platinum nanoparticles in room-temperature ionic liquids.

    Science.gov (United States)

    Zhang, Da; Okajima, Takeyoshi; Lu, Dalin; Ohsaka, Takeo

    2013-09-24

    The electroless deposition of Pt nanoparticles (Pt-NPs) could be carried out by dissolving potassium tetrachloroplatinate(II) (K2[PtCl4]) in 1-ethyl-3-methylimidazolium (EMI(+)) room-temperature ionic liquids (RTILs) containing bis(trifluoromethylsulfonyl) imide (NTf2(-)) or tetrafluoroborate (BF4(-)) anion and small cations, such as H(+), K(+), and Li(+). In this case, no deposition of Pt-NPs occurred in RTILs without such small cations. The formation of Pt-NPs was only observed in RTILs containing trifluoromethanesulfonimide (HNTf2) and protons at high temperature (≥80 °C) when potassium hexachloroplatinate(IV) (K2[PtCl6]) was dissolved in the RTILs. The obtained Pt-NPs gave a characteristic absorption spectrum of ultrasmall Pt-NPs. The ultrasmall and uniform Pt-NPs of ca. 1-4 nm in diameter were produced and the Pt-NPs/EMI(+)NTf2(-) dispersion was kept stably for several months without adding any additional stabilizers or capping molecules. The identified Fourier-transform patterns along the [0 1 1] zone axis were observed for the TEM images of Pt-NPs. On the basis of the results obtained, a probable mechanism of the electroless formation of Pt-NPs is discussed.

  15. Nanoseeding via dual surface modification of alkyl monolayer for site-controlled electroless metallization.

    Science.gov (United States)

    Chen, Sung-Te; Chen, Giin-Shan

    2011-10-04

    In this work, an attempt to fabricate nanostructured metallization patterns on SiO(2) dielectric layers is made by using plasma-patterned self-assembled monolayers (SAMs), in conjunction with a novel aqueous seeding and electroless process. Taking octadecyltrichlorosilane (OTS) as a test material, the authors demonstrate that optimizing the N(2)-H(2) plasma conditions leads to the successive conversion of the topmost aliphatic chains of alkyl SAMs to carboxyl (COOH) and hydroxyl (C-OH) functional groups, which was previously found in alkyl SAMs only by exposure to "oxygen-based" plasma. Further modifying the plasma-exposed (either COOH or C-OH terminated) regions with an aqueous solution (SC-1) creates surface functionalities that are viable for site-controlled metallic seeding (e.g., Co or Ni) with an adsorption selectivity of greater than 1000:1. Neither the combination of costly PdCl(2) and complex additives nor the demerits of the associated aqueous chemistry (e.g., seed agglomeration and seed sparseness) are involved. Therefore, the seed particles are only 3 nm in size. Simultaneously, there are sufficient particle densities previously unattainable for electroless deposition to trigger highly resolved Cu metallization patterns with a film thickness of less than 10 nm. The formation of the seed-adsorbing sites is discussed, based on a plasma-dissociated, water-mediated chemical oxidation route.

  16. Analysis of Alkaline Pre-nickel Plating and Acidic Nickel Plating on Zinc Alloy%锌合金表面碱性预镀+酸性化学镀镍层分析

    Institute of Scientific and Technical Information of China (English)

    周华; 刘洪军; 王丽波

    2011-01-01

    The alkaline pre-nickel plating, acidic nickel plating, alkaline and acidic nickel layer was prepared. The effects of pre-nickel plating on the property of electroless nickel plating were studied. The results show that the alkaline pre-nickel plating can help the whole alkaline and acidic nickel layer achieve good quality. The surface morphology and interface condition of specimen heat treated at 350℃ for 1 h were observed, pre-nickel plating hasn't bad effects on the heat treatment of nickel plating.%制备碱性镀层、酸性单层、碱酸双层,研究预镀层对锌铝合金镀镍层性能的影响.实验结果表明,碱性镀层能有效保证整个碱酸镀层的质量.试样在350℃下热处理1h,然后观察试样表面形貌和界面状态,预镀层对镀层的热处理没有负面影响.

  17. A novel preparation of silver-plated polyacrylonitrile fibers functionalized with antibacterial and electromagnetic shielding properties

    Science.gov (United States)

    Wang, Wei; Li, Weiya; Gao, Cuicui; Tian, Weicheng; Sun, Bin; Yu, Dan

    2015-07-01

    Polyacrylonitrile (PAN) fibers with antibacterial, electromagnetic shielding and antistatic functionalities were fabricated in this paper through modifying PAN fibers with (3-aminopropyl)triethoxysilane (APTES) and 3-mercaptopropyltriethoxysilane (MPTES) sequentially and followed with silver electroless plating. The silver layer on PAN fiber surface was characterized by scanning electron microscopy (SEM), atomic force microscopy (AFM) and X-ray diffraction (XRD). The results show that the silver layer was plated uniformly and compactly. The surface resistance of plated fabric was about 40 mΩ/sq on average. The antibacterial tests demonstrate that silver-plated PAN fiber exhibits excellent antibacterial property against S. aureus and E. coli with a non-leaching characteristic. The antibacterial property remains good after 30 cycles of standard washing, which is a strong proof of a durable adhesion between metal layer and fiber. The shielding effectiveness (SE) of silver-plated PAN fabric before and after 30 cycles of standard washing was about 40-80 dB and 35-50 dB, respectively. This resultant fiber can be used in many occasions for reducing or preventing electromagnetic interference (EMI) and electromagnetic hazards.

  18. The Solution of Electroless Nickel Purification Equipment Online%电镀镍溶液在线净化设备的研究

    Institute of Scientific and Technical Information of China (English)

    李亚明; 于丽君

    2012-01-01

    通过对电镀镍溶液的重要性和杂质的影响性作分析后,介绍了一种便捷、可靠、有效的全自动在线净化电镀镍溶液的设备。%Analyzed by the importance of electroless nickel and influence of impurities, introduced one kind of simple, reliable and efficient electroless nickel device which purified on line automatically.

  19. Electroless copper on refractory and noble metal substrates with an ultra-thin plasma-assisted atomic layer deposited palladium layer

    Energy Technology Data Exchange (ETDEWEB)

    Kim, Young-Soon [Thin Film Technology Lab, School of Chemical Engineering, Chonbuk National University, Jeonju 561756 (Korea, Republic of); Kim, Hyung-Il [Thin Film Technology Lab, School of Chemical Engineering, Chonbuk National University, Jeonju 561756 (Korea, Republic of); Cho, Joong-Hee [Thin Film Technology Lab, School of Chemical Engineering, Chonbuk National University, Jeonju 561756 (Korea, Republic of); Seo, Hyung-Kee [Thin Film Technology Lab, School of Chemical Engineering, Chonbuk National University, Jeonju 561756 (Korea, Republic of); Dar, M.A. [Thin Film Technology Lab, School of Chemical Engineering, Chonbuk National University, Jeonju 561756 (Korea, Republic of); Shin, Hyung-Shik [Thin Film Technology Lab, School of Chemical Engineering, Chonbuk National University, Jeonju 561756 (Korea, Republic of); Ten Eyck, Gregory A. [Department of Physics, Rensselaer Polytechnic Institute, Troy, NY 12180 (United States); Lu, Toh-Ming [Department of Physics, Rensselaer Polytechnic Institute, Troy, NY 12180 (United States); Senkevich, Jay J. [Brewer Science Inc., Rolla, MO 65401 (United States)]. E-mail: jsenkevich@brewerscience.com

    2006-02-25

    Electroless Cu was investigated on refractory metal, W and TaN {sub X}, and Ir noble metal substrates with a plasma-assisted atomic layer deposited palladium layer for the potential back-end-of-the-line (BEOL) metallization of advanced integrated devices. The sodium and potassium-free Cu electroless bath consisted of: ethylenediamine tetraacetic acid (EDTA) as a chelating agent, glyoxylic acid as a reducing agent, and additional chemicals such as polyethylene glycol, 2,2'-dipyridine and RE-610 as surfactant, stabilizer and wetting agent respectively. The growth and chemical characterization of the Cu films was carried out with a field emission scanning electron microscope (FE-SEM), X-ray photoelectron spectroscopy (XPS), and Rutherford backscattering spectrometry (RBS). Group VIII metals such as Pt, Pd, etc., are stable in the electroless bath and catalytic towards the oxidation of glyoxylic acid and therefore work well for the electroless deposition of Cu. From RBS analysis, the amount of carbon and oxygen in Cu films were less than 1-3%. The Cu films were electroless deposited at 45-50 deg. C on patterned tantalum nitride with plasma-assisted atomic layer deposited (PA-ALD) Pd as a catalytic layer. Electroless Cu trench fill was successful with ultrasonic vibration, RE-610, and lowering the temperature to 45-50 deg. C on TaN {sub X} with the PA-ALD Pd catalytic layer.

  20. Effect of heat treatment duration on tribological behavior of electroless Ni-(high)P coatings

    Science.gov (United States)

    Biswas, A.; Das, S. K.; Sahoo, P.

    2016-09-01

    Electroless nickel coating occurs through an autocatalytic chemical reaction and without the aid of electricity. From tribological perspective, it is recommended due to its high hardness, wear resistance, lubricity and corrosion resistance properties. In this paper electroless Ni-P coatings with high phosphorous weight percentages are developed on mild steel (AISI 1040) substrates. The coatings are subjected to heat treatment at 300°C and 500°C for time durations up to 4 hours. The effect of heat treatment duration on the hardness as well as tribological properties is discussed in detail. Hardness is measured in a micro hardness tester while the tribological tests are carried out on a pin-on-disc tribotester. Wear is reported in the form of wear rates of the sample subjected to the test. As expected, heat treatment of electroless Ni-P coating results in enhancement in its hardness which in turn increases its wear resistance. The present study also finds that duration of heat treatment has quite an effect on the properties of the coating. Increase in heat treatment time in general results in increase in the hardness of the coating. Coefficient of friction is also found to be lesser for the samples heat treated for longer durations (4 hour). However, in case of wear, similar trend is not observed. Instead samples heat treated for 2 to 3 hour display better wear resistance compared to the same heat treated for 4 hour duration. The microstructure of the coating is also carried out to ensure about its proper development. From scanning electron microscopy (SEM), the coating is found to possess the conventional nodular structure while energy dispersive X-ray analysis (EDX) shows that the phosphorous content in the coating to be greater than 9%. This means that the current coating belongs to the high phosphorous category. From X-ray diffraction analysis (XRD), it is found that coating is amorphous in as-deposited condition but transforms into a crystalline structure with

  1. Generalized Fibonacci zone plates

    CERN Document Server

    Ke, Jie; Zhu, Jianqiang

    2015-01-01

    We propose a family of zone plates which are produced by the generalized Fibonacci sequences and their axial focusing properties are analyzed in detail. Compared with traditional Fresnel zone plates, the generalized Fibonacci zone plates present two axial foci with equal intensity. Besides, we propose an approach to adjust the axial locations of the two foci by means of different optical path difference, and further give the deterministic ratio of the two focal distances which attributes to their own generalized Fibonacci sequences. The generalized Fibonacci zone plates may allow for new applications in micro and nanophotonics.

  2. Synthesis of wirelike silicon nanostructures by dispersion of silicon on insulator using electroless etching

    Science.gov (United States)

    Mantey, Kevin; Shams, Somayeh; Nayfeh, Munir H.; Nayfeh, Osama; Alhoshan, Mansour; Alrokayan, Salman

    2010-12-01

    We employ electroless etching to disperse silicon on insulator (SOI) wafers in ionic silver HF into wirelike silicon nanostructures. The procedure allows detachment of the nanowires at the oxide interface and enables easy recovery of dispersions for subsequent controlled delivery. Nanowires 10 μm long and 50-100 nm thick are demonstrated using an SOI substrate of 10 μm device thickness. Direct material analysis shows no silver contamination after a wet-etch silver clean. Anodization treatment of the wires was conducted. Our measurements and analysis show that the wires are not amenable to anodization resulting from the fact that the nanowire radius is less than the thickness of depletion layer. The procedure has the potential of providing dispersions of arbitrarily long wirelike nanostructures which are useful for composite and energy applications.

  3. Improvement of silicon nanowire solar cells made by metal catalyzed electroless etching and nano imprint lithography

    Science.gov (United States)

    Chen, Junyi; Subramani, Thiyagu; Jevasuwan, Wipakorn; Fukata, Naoki

    2017-04-01

    Silicon nanowires were fabricated by metal catalyzed electroless etching (MCEE) and nano imprint lithography (NIL), then a shell p-type layer was grown by thermal chemical vapor deposition (CVD) techniques. To reduce back surface recombination and also to activate the dopant, we used two techniques, back surface field (BSF) treatment and rapid thermal annealing (RTA), to improve device performance. In this study, we investigated BSF and RTA treatments in silicon nanowire solar cells, and improved the device performance and efficiency from 4.1 to 7.4% (MCEE device) and from 1.1 to 6.6% (NIL device) after introducing BSF and RTA treatments. Moreover, to achieve better metal contact without sacrificing the reflectance after the shell formation, the selective-area etching method was investigated. Finally, after combining all processes, silicon nanowire solar cells fabricated via the MCEE process exhibited 8.7% efficiency.

  4. Fabrication of superhydrophobic and highly oleophobic silicon-based surfaces via electroless etching method

    Science.gov (United States)

    Nguyen, Thi Phuong Nhung; Dufour, Renaud; Thomy, Vincent; Senez, Vincent; Boukherroub, Rabah; Coffinier, Yannick

    2014-03-01

    This study reports on a simple method for the preparation of superhydrophobic and highly oleophobic nanostructured silicon surfaces. The technique relies on metal-assisted electroless etching of silicon in sodium tetrafluoroborate (NaBF4) aqueous solution. Then, silver particles were deposited on the obtained surfaces, changing their overall physical morphology. Finally, the surfaces were coated by either C4F8, a fluoropolymer deposited by plasma, or by SiOx overlayers chemically modified with 1H,1H,2H,2H-perfluorodecyltrichlorosilane (PFTS) through silanization reaction. All these surfaces exhibit a superhydrophobic character (large apparent contact angle and low hysteresis with respect to water). In addition, they present high oleophobic properties, i.e. a high repellency to low surface energy liquids with various contact angle hysteresis, both depending on the morphology and type of coating.

  5. Friction performance optimization of electroless Ni-P coatings using the Taguchi method

    Energy Technology Data Exchange (ETDEWEB)

    Sahoo, Prasanta [Department of Mechanical Engineering, Jadavpur University, Kolkata 700032 (India)], E-mail: psahoo@vsnl.net

    2008-05-07

    This paper presents an experimental study of friction characteristics of electroless Ni-P (EN) coatings sliding against steel and optimization of coating process parameters based on the Taguchi method. Experiments are carried out by utilizing the combination of process parameters based on the L{sub 27} Taguchi orthogonal design with four process parameters, namely, bath temperature, concentration of nickel source solution, concentration of reducing agent and annealing temperature. It is observed that concentration of nickel source solution has the most significant influence in controlling friction characteristics of EN coating. The optimum combination of process parameters for minimum friction coefficient is obtained from the analysis. The surface morphology and composition of coatings are also studied with the help of scanning electron microscopy, energy dispersed x-ray analysis and x-ray diffraction analysis.

  6. Tribological Performance Optimization of Electroless Ni-P-W Coating Using Weighted Principal Component Analysis

    Directory of Open Access Journals (Sweden)

    S. Roy

    2013-12-01

    Full Text Available The present investigation is an experimental approach to deposit electroless Ni-P-W coating on mild steel substrate and find out the optimum combination of various tribological performances on the basis of minimum friction and wear, using weighted principal component analysis (WPCA. In this study three main tribological parameters are chosen viz. load (A, speed (B and time(C. The responses are coefficient of friction and wear depth. Here Weighted Principal Component Analysis (WPCA method is adopted to convert the multi-responses into single performance index called multiple performance index (MPI and Taguchi L27 orthogonal array is used to design the experiment and to find the optimum combination of tribological parameters for minimum coefficient of friction and wear depth. ANOVA is performed to find the significance of the each tribological process parameters and their interactions. The EDX analysis, SEM and XRD are performed to study the composition and structural aspects.

  7. Effects of zincate treatment on adhesion of electroless Ni-P coating onto various aluminum alloys

    Institute of Scientific and Technical Information of China (English)

    Makoto HINO; Koji MURAKAMI; Yutaka MITOOKA; Ken MURAOKA; Teruto KANADANI

    2009-01-01

    The effects of alloying elements on zincate treatment and adhesion of electroless Ni-P coating onto various aluminum alloy substrates were examined. Surface morphology of zinc deposits in the 1st zincate treatment and its adhesion were changed depending on the alloying element. The zinc deposits in the 2nd zincate treatment became thinly uniform, and the adhesion between aluminum alloy substrate and Ni-P coating was improved irrespective of the alloying element. XPS analysis revealed the existence of zinc on the surface of each aluminum alloy substrate after the pickling in 5% nitric acid. This zinc on the surface should be an important factor influencing the morphology of zinc deposit at the 2nd zincate treatment and its adhesion.

  8. NiCo-lead zirconium titanate-NiCo trilayered magnetoelectric composites prepared by electroless deposition

    Energy Technology Data Exchange (ETDEWEB)

    Zhou, M. H.; Wang, Y. G.; Bi, K., E-mail: bike@bupt.edu.cn [State Key Laboratory of Information Photonics and Optical Communications and School of Science, Beijing University of Posts and Telecommunications, Beijing 100876 (China); Fan, H. P. [School of Mechanical and Electrical Engineering, Qingdao Technological University Qindao College, Qingdao 266106 (China); Zhao, Z. S. [Shandong Engineering Consulting Institute, Jinan 250013 (China)

    2015-04-15

    The NiCo layers with various Ni/Co atomic ratio have been successfully electroless deposited on PZT layers by varying the bath composition. As the cobalt atomic ratio in the deposited layer increases from 17.2 to 54.8 wt%, the magnetostrictive coefficient decreases. The magnetoelectric effect depends strongly on the magnetostrictive properties of magnetostrictive phase. The magnetoelectric coefficient of NiCo/PZT/NiCo trilayers increases with Ni/Co atomic ratio of the deposited NiCo layers increasing from 45:55 to 83:17. A maximum ME voltage coefficient of α{sub E,31} = 2.8 V ⋅ cm{sup −1} ⋅ Oe{sup −1} is obtained at a frequency of about 88 kHz, which makes these trilayers suitable for applications in actuators, transducers and sensors.

  9. NiCo-lead zirconium titanate-NiCo trilayered magnetoelectric composites prepared by electroless deposition

    Directory of Open Access Journals (Sweden)

    M. H. Zhou

    2015-04-01

    Full Text Available The NiCo layers with various Ni/Co atomic ratio have been successfully electroless deposited on PZT layers by varying the bath composition. As the cobalt atomic ratio in the deposited layer increases from 17.2 to 54.8 wt%, the magnetostrictive coefficient decreases. The magnetoelectric effect depends strongly on the magnetostrictive properties of magnetostrictive phase. The magnetoelectric coefficient of NiCo/PZT/NiCo trilayers increases with Ni/Co atomic ratio of the deposited NiCo layers increasing from 45:55 to 83:17. A maximum ME voltage coefficient of αE,31 = 2.8 V ⋅ cm−1 ⋅ Oe−1 is obtained at a frequency of about 88 kHz, which makes these trilayers suitable for applications in actuators, transducers and sensors.

  10. Silicon nanowire arrays coated with electroless Ag for increased surface-enhanced Raman scattering

    Directory of Open Access Journals (Sweden)

    Fan Bai

    2015-05-01

    Full Text Available The ordered Ag nanorod (AgNR arrays are fabricated through a simple electroless deposition technique using the isolated Si nanowire (SiNW arrays as the Ag-grown scaffold. The AgNR arrays have the single-crystallized structure and the plasmonic crystal feature. It is found that the formation of the AgNR arrays is strongly dependent on the filling ratio of SiNWs. A mechanism is proposed based on the selective nucleation and the synergistic growth of Ag nanoparticles on the top of the SiNWs. Moreover, the special AgNR arrays grown on the substrate of SiNWs exhibit a detection sensitivity of 10−15M for rhodamine 6G molecules, which have the potential application to the highly sensitive surface-enhanced Raman scattering sensors.

  11. Monodisperse gold nanoparticles formed on bacterial crystalline surface layers (S-layers) by electroless deposition

    Energy Technology Data Exchange (ETDEWEB)

    Dieluweit, S. [Center for Nanobiotechnology, University of Natural Resources and Applied Life Sciences (BOKU), Gregor Mendel-Strasse 33, A-1180 Vienna (Austria); Pum, D. [Center for Nanobiotechnology, University of Natural Resources and Applied Life Sciences (BOKU), Gregor Mendel-Strasse 33, A-1180 Vienna (Austria); Sleytr, U.B. [Center for Nanobiotechnology, University of Natural Resources and Applied Life Sciences (BOKU), Gregor Mendel-Strasse 33, A-1180 Vienna (Austria); Kautek, W. [Department for Physical Chemistry, University of Vienna, Waehringer Strasse 42, A-1090 Vienna (Austria)]. E-mail: wolfgang.kautek@univie.ac.at

    2005-12-15

    The fabrication of patterned arrays of nanoparticles whose electronic, optical and magnetic properties will find technological applications, such as ultra-high-density memories, is currently one of the most important objectives of inorganic material research. In this study, the in situ electroless nucleation of ordered two-dimensional arrays of gold nanoparticles (5 nm in size) by using bacterial S-layers as molecular templates and their characterization by small spot X-ray photoelectron emission spectroscopy (XPS) is presented. This yielded the elemental composition of the nanoclusters, which consisted of almost entirely elemental gold, and possible side reactions on the cluster and protein surface. The preferential deposition of the gold nanoparticles on the S-layer suggests that topography and functional groups are important for superlattice formation.

  12. Simple and low-cost fabrication of a metal nanoplug on various substrates by electroless deposition*

    Institute of Scientific and Technical Information of China (English)

    Cheng Kaifang; Yang Fuhua; Wang Xiaofeng; Wang Xiaodong; Zhang Jiayong; Ma Huili; Chen Xiaogang; Liu Bo; Song Zhitang; Feng Songlin

    2011-01-01

    An electroless deposition (ELD) method is introduced to fabricate a metal nanoplug for its advantages of simplicity, low cost and auto-selectivity. It was demonstrated that nanoplugs of less than 50 nm in diameter can be fabricated by ELD nickel on various substrates, such as silicon, tungsten and titanium nitride. The main composition of the ELD nanoplug was characterized as nickel by an energy dispersive X-ray microanalyzer. A functional vertical phase-change random access memory (PCRAM) device with a heater diameter of around 9μm was fabricated by using the ELD method. The Ⅰ-Ⅴ characteristics demonstrated that the threshold current is only 90.8 μA. This showed that the ELD process can satisfy the demands of PCRAM device application, as well as device performance improvement. The ELD process provides a promising method for the simple and low-cost fabrication of metal nanoplugs.

  13. Friction performance optimization of electroless Ni P coatings using the Taguchi method

    Science.gov (United States)

    Sahoo, Prasanta

    2008-05-01

    This paper presents an experimental study of friction characteristics of electroless Ni-P (EN) coatings sliding against steel and optimization of coating process parameters based on the Taguchi method. Experiments are carried out by utilizing the combination of process parameters based on the L27 Taguchi orthogonal design with four process parameters, namely, bath temperature, concentration of nickel source solution, concentration of reducing agent and annealing temperature. It is observed that concentration of nickel source solution has the most significant influence in controlling friction characteristics of EN coating. The optimum combination of process parameters for minimum friction coefficient is obtained from the analysis. The surface morphology and composition of coatings are also studied with the help of scanning electron microscopy, energy dispersed x-ray analysis and x-ray diffraction analysis.

  14. Preparation of superhydrophobic silver nano coatings with feather-like structures by electroless galvanic deposition

    Institute of Scientific and Technical Information of China (English)

    FENG XiaoJuan; SHI YanLong; WANG YongSheng; YUE GuoRen; YANG Wu

    2013-01-01

    Superhydrophobic silver nanocoatings with feather-like morphology are fabricated on copper substrates by electroless galvanic deposition.The coating exhibit superhydrophobicity with a contact angle of 156.4° and glide angle of 4° without any further surface modification.Scanning electron microscope (SEM),X-ray diffraction (XRD) and contact angle measurements are used to investigate the morphology,crystal structure and superhydrophobicity,respectively,of the coatings.The coatings exhibit high thermal stability; their water contact angle did not change when the coatings were heated to 200℃ for 2 h.The mechanism of superhydrophobicity of the silver coating is discussed based on the work of Amirfazli,Wenzel and Cassie.

  15. Preparation of Core-shell Cu-Ag Bimetallic Powder via Electroless Coating

    Institute of Scientific and Technical Information of China (English)

    XU Rui; ZHOU Kanggen; HU Minyi

    2009-01-01

    A novel method of electroless silver coating on copper powders was reported,in which hydrazine was used as the reducing agent,and had some advantages such was used as inhib-iting the substitution reaction and reducing consumption of copper powders.In the processes of sen-sitization and activation,AgNO_3 replaces the conventional PdCl_2,which solves the impurity of bath.Oxide film on the surface of copper powders was tested by chemical analysis.Ag element tested by XRD and XRF is in the form of Ag~0 and exists on the surface of copper powders,which acts as catalyzer in reduction reaction.Morphology and composition of the coating were characterized by SEM and XRD respectively.

  16. Study on the laser treatment of electroless Ni-P-SiC composite coatings

    Institute of Scientific and Technical Information of China (English)

    Honghong Shao; Xiaoyan Jiang; Lan Wang; Yinqun Hua

    2006-01-01

    Effect of the laser treatment on electroless Ni-P-SiC composite coatings was investigated. The microscopic structure, surface morphology, ingredient, and performance of the Ni-P-SiC composite coatings were synthetically analyzed by the use of X-ray diffraction apparatus, scanning electron microscope, energy distribution spectrometer, micro-hardness tester, wear tester and so on. It was found that the composite coatings did make crystalloblastic transformation after laser heating. Structural analysis confirmed that some new types of phase Ni2Si or Ni3Si compound would emerge in the Ni-P-SiC coatings after laser treatment. The micro-hardness measurement results showed that when the laser power was 450 W with scanning speed of 0.5 m/min, the hardness of the coating was superior to the coating obtained by the conventional furnace heating, and wear resistance of the composite coating after laser treating could also improve.

  17. Electroless synthesis of lepidocrocite ({gamma}-FeOOH) nanotubes in ion track etched polycarbonate templates

    Energy Technology Data Exchange (ETDEWEB)

    Neetzel, C., E-mail: Neetzel@ca.tu-darmstadt.de [Darmstadt University of Technology, Department of Materials Science, Materials Analysis Group, D-64287 Darmstadt (Germany); Gasi, T.; Ksenofontov, V.; Felser, C. [Johannes Gutenberg University of Mainz, Institute of Inorganic and Analytical Chemistry, D-55128 Mainz (Germany); Ionescu, E. [Darmstadt University of Technology, Department of Materials Science, Dispersive Solids, D-64287 Darmstadt (Germany); Ensinger, W. [Darmstadt University of Technology, Department of Materials Science, Materials Analysis Group, D-64287 Darmstadt (Germany)

    2012-07-01

    In this study, we describe the electroless synthesis of lepidocrocite ({gamma}-FeOOH) nanotubes produced in ion track etched polycarbonate foils. The foils act as templates after they had been irradiated with heavy ions to produce latent tracks that were etched with a desired diameter. Templates are used to fabricate shape formed 1D nanostructures in general. The synthesis of lepidocrocite nanotubes was carried out in a simple two-step method: firstly, particles were formed by precipitation in aqueous solution; secondly, nanotubes were produced by the deposition of the particles inside the nanochannels of the polycarbonate template. Solvent effects were considered to achieve homogeneous growth resulting in well-defined nanotubes of constant wall thickness along the tube axis. Lepidocrocite nanotubes were characterized by scanning electron microscopy (SEM), energy-dispersive X-ray (EDX), Raman, and Moessbauer spectroscopy.

  18. Copper-Coated Liquid-Crystalline Elastomer via Bioinspired Polydopamine Adhesion and Electroless Deposition.

    Science.gov (United States)

    Frick, Carl P; Merkel, Daniel R; Laursen, Christopher M; Brinckmann, Stephan A; Yakacki, Christopher M

    2016-12-01

    This study explores the functionalization of main-chain nematic elastomers with a conductive metallic surface layer using a polydopamine binder. Using a two-stage thiol-acrylate reaction, a programmed monodomain is achieved for thermoreversible actuation. A copper layer (≈155 nm) is deposited onto polymer samples using electroless deposition while the samples are in their elongated nematic state. Samples undergo 42% contraction when heated above the isotropic transition temperature. During the thermal cycle, buckling of the copper layer is seen in the direction perpendicular to contraction; however, transverse cracking occurs due to the large Poisson effect experienced during actuation. As a result, the electrical conductivity of the layer reduced quickly as a function of thermal cycling. However, samples do not show signs of delamination after 25 thermal cycles. These results demonstrate the ability to explore multifunctional liquid-crystalline composites using relatively facile synthesis, adhesion, and deposition techniques.

  19. Formation of aligned silicon nanowire on silicon by electroless etching in HF solution

    Energy Technology Data Exchange (ETDEWEB)

    Megouda, N.; Douani, R. [Faculte des Sciences, Universite Mouloud Mammeri, Tizi-Ouzou (Algeria); Hadjersi, T., E-mail: hadjersi@yahoo.co [Unite de Developpement de la Technologie du Silicium (UDTS), 2, Bd. Frantz Fanon, B.P. 140 Alger-7 merveilles, Alger (Algeria); Boukherroub, R. [Institut de Recherche Interdisciplinaire (IRI, FRE 2963), Institut d' Electronique, de Microelectronique et de Nanotechnologie (IEMN, CNRS-8520), Cite Scientifique, Avenue Poincare-B.P. 60069, 59652 Villeneuve d' Ascq (France)

    2009-12-15

    It was demonstrated that the etching in HF-based aqueous solution containing AgNO{sub 3} and Na{sub 2}S{sub 2}O{sub 8} as oxidizing agents or by Au-assisted electroless etching in HF/H{sub 2}O{sub 2} solution at 50 deg. C yields films composed of aligned Si nanowire (SiNW). SiNW of diameters {approx}10 nm were formed. The morphology and the photoluminescence (PL) of the etched layer as a function of etching solution composition were studied. The SiNW layers formed on silicon were investigated by scanning electron microscopy (SEM), energy-dispersive X-ray (EDX) and photoluminescence. It was demonstrated that the morphology and the photoluminescence of the etched layers strongly depends on the type of etching solution. Finally, a discussion on the formation process of the silicon nanowires is presented.

  20. Comparison of in situ and ex situ reduced graphene oxide reinforced electroless nickel phosphorus nanocomposite coating

    Energy Technology Data Exchange (ETDEWEB)

    Sadhir, M. Hasan; Saranya, M.; Aravind, M. [Department of Mechanical Engineering, College of Engineering Guindy, Anna University, Chennai 600025 (India); Srinivasan, A. [Departments of Chemistry, College of Engineering Guindy, Anna University, Chennai 600025 (India); Siddharthan, A., E-mail: sidharth@annauniv.edu [Department of Mechanical Engineering, College of Engineering Guindy, Anna University, Chennai 600025 (India); Department of Mechanical Engineering, CEG Campus, Anna University, Chennai 600025 (India); Rajendran, N. [Departments of Chemistry, College of Engineering Guindy, Anna University, Chennai 600025 (India)

    2014-11-30

    Highlights: • First kind of electroless nickel phosphorous (EN) reduced graphene oxide (rGO) coatings. • Change in preferential orientation of grain growth of heat treated in situ EN-rGO coating. • Better corrosion resistance of in situ EN-rGO coating. • 2 stages of reduction of Graphene (GE) to GO, during - coating and heat treatment. • Soft nature of GO for similar to polymer from low hardness of EN-GO coating. - Abstract: Electroless nickel-phosphorus (EN)–reduced graphene oxide (rGO) composite coating was carried out to compare the ex situ route of reinforcement of reduced GO in EN coating (EN-rGO) and in situ route of reinforced of rGO in EN coating (EN-GO). The coatings were characterized using X-ray diffraction (XRD) and attenuated total reflectance infrared spectroscopy (ATR-IR) for phase determination and to show the presence of reinforcement of rGO in the coatings respectively. ATR-IR spectra indicated that GO was chemically reduced in situ while deposition of EN-GO composite and thermal reduction during its heat treatment. XRD pattern of heat treated EN-GO coating show the change in preferred orientation of nickel deposit. Upon heat treatment, the hardness of EN and EN-GO and EN-rGO deposits increased while the corrosion resistance decreased except for EN-GO coating. The hardness of EN-rGO and EN-GO coating is approximately half the value of EN deposit. The electrochemical polarization studies indicated that EN-GO deposit was corrosive resistant than EN-rGO and EN deposit.