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Sample records for atlas slhc pixel

  1. TCAD Simulations of ATLAS Pixel Guard Ring and Edge Structure for SLHC Upgrade

    CERN Document Server

    Lounis, A; The ATLAS collaboration; Calderini, G; Marchiori, G; Benoit, M; Dinu, N

    2010-01-01

    In this work, the magnitude of the electric field and the depletion inside a simplified two dimensional model of the ATLAS planar pixel sensor for the insertable b-layer and the super-LHC upgrade have been studied. The parameters influencing the breakdown behavior were studied using a finite-element method to solve the drift-diffusion equations coupled to Poisson's equation. Using these models, the number of guard rings, dead edge width and sensor's thickness were modified with respect to the ATLAS actual pixel sensor to investigate their influence on the sensor's depletion at the edge and on its internal electrical field distribution. The goal of the simulation is to establish a model to discriminate between different designs and to select the most optimized to fit the needs in radiation hardness and low material budget of ATLAS inner detector during super-LHC operation. A three defects level model has been implemented in the simulations to study the behavior of such sensors under different level of irradiat...

  2. SLHC and ATLAS, Initial Plans

    CERN Document Server

    Nessi, M

    2008-01-01

    The recent developments in the plans and scenarios proposed by the LHC machine experts towards the SLHC, have triggered various concerns and reserves in the ATLAS community. In particular the eventual need to insert dipoles, quadrupoles and protection elements inside the detector creates major concerns, because of its complex logistics and the risk of reducing the effectiveness of the ATLAS internal radiation shielding. Justifications and constraints on how to best use this space are given.

  3. Silicon Strip Detectors for the ATLAS sLHC Upgrade

    CERN Document Server

    Soldevila, U; The ATLAS collaboration

    2011-01-01

    While the Large Hadron Collider (LHC) at CERN is continuing to deliver an ever-increasing luminosity to the experiments, plans for an upgraded machine called Super-LHC (sLHC) are progressing. The upgrade is foreseen to increase the LHC design luminosity by a factor ten. The ATLAS experiment will need to build a new tracker for sLHC operation, which needs to be suited to the harsh sLHC conditions in terms of particle rates and radiation doses. In order to cope with the increase in pile-up backgrounds at the higher luminosity, an all silicon detector is being designed. To successfully face the increased radiation dose, a new generation of extremely radiation hard silicon detectors is being designed. Silicon sensors with sufficient radiation hardness are the subject of an international R&D programme, working on pixel and strip sensors. The efforts presented here concentrate on the innermost strip layers. We have developed a large number of prototype planar detectors produced on p-type wafers in a...

  4. Silicon Strip Detectors for ATLAS sLHC Upgrade

    CERN Document Server

    Affolder, A; The ATLAS collaboration

    2011-01-01

    While the Large Hadron Collider (LHC) at CERN is continuing to deliver an ever-increasing luminosity to the experiments, plans for an upgraded machine called Super-LHC (sLHC) are progressing. The upgrade is foreseen to increase the LHC design luminosity by a factor ten. The ATLAS experiment will need to build a new tracker for sLHC operation, which needs to be suited to the harsh sLHC conditions in terms of particle rates and radiation doses. In order to cope with the increase in pile-up backgrounds at the higher luminosity, an all silicon detector is being designed. To successfully face the increased radiation dose, a new generation of extremely radiation hard silicon detectors is being designed. Silicon sensors with sufficient radiation hardness are the subject of an international R&D programme, working on pixel and strip sensors. The efforts presented here concentrate on the innermost strip layers. We have developed a large number of prototype planar detectors produced on p-type wafers in a number of d...

  5. ATLAS Tracker Upgrade: Silicon Strip Detectors for the sLHC

    CERN Document Server

    Dawson, I

    2010-01-01

    It is foreseen to increase the luminosity of the Large Hadron Collider (LHC) at CERN around 2020 by about an order of magnitude to the sLHC. As the existing silicon tracking in ATLAS (pixel and strip detectors) is designed to withstand the radiation doses of the LHC only, the tracking detector (Inner Detector or ID) will need to be replaced. In order to cope with the order of magnitude increase in pile-up backgrounds at the higher luminosity, an all-silicon tracking detector is being designed. The new strip detector will use significantly shorter strips than the current Semiconductor Tracker (SCT) in order to keep the occupancy low enough. As the increased luminosity will mean a corresponding increase in radiation dose, a new generation of extremely radiation hard silicon detectors is required. A number of ATLAS R&D projects aimed at developing the sLHC layout of the ID, silicon sensors with sufficient radiation hardness, radiation-hard front-end electronics, and readout systems are ongoing to cope wi...

  6. The ATLAS pixel detector

    OpenAIRE

    Cristinziani, M.

    2007-01-01

    After a ten years planning and construction phase, the ATLAS pixel detector is nearing its completion and is scheduled to be integrated into the ATLAS detector to take data with the first LHC collisions in 2007. An overview of the construction is presented with particular emphasis on some of the major and most recent problems encountered and solved.

  7. ATLAS Tracker Upgrade: Silicon Strip Detectors and Modules for the sLHC

    International Nuclear Information System (INIS)

    It is foreseen to increase the luminosity of the Large Hadron Collider (LHC) at CERN by a factor ten, with the upgraded machine dubbed Super-LHC or sLHC. The ATLAS experiment will require a new tracker for sLHC operation. In order to cope with the increase in pile-up backgrounds at the higher luminosity, an all silicon detector is being designed. The new strip detector will use significantly shorter strips than the current SCT in order to minimise the occupancy. As the increased luminosity will mean a corresponding increase in radiation dose, a new generation of extremely radiation hard silicon detectors is required. Extensive R programmes are underway to develop silicon sensors with sufficient radiation hardness. In parallel, new front-end electronics and readout systems are being designed to cope with the higher data rates. The challenges of powering and cooling a very large strip detector will be discussed. Ideas on possible schemes for the layout and support mechanics will be shown. (authors)

  8. The ATLAS pixel stave emulator for serial powering

    International Nuclear Information System (INIS)

    A serial powering scheme is being developed for the upgrade of the ATLAS pixel detector in view of sLHC. It offers in fact significant advantages over the presently used parallel powering scheme, namely reduced material budget in active area and power losses on cables, smaller number of power supplies, and no need for external, distant regulation of voltages. The development of this powering scheme requires not only the design of custom-developed voltage regulators, the basic elements of serial powering, but also the early study of system aspects connected to it, for instance the safety of the powering chain and AC-coupled data transmission. To this aim a test system emulating an ATLAS pixel stave is being developed. It will provide a realistic environment to test both concepts and sub-components. Due to its flexibility, it will offer the possibility to study not only serial powering concepts, but more generally system aspects related to the ATLAS pixel detector. In particular alternative powering schemes, data coding schemes, physical layer data transmission, and Detector Control System concepts will also be evaluated with this test system. The description and development of the ATLAS pixel stave emulator are presented and first results are discussed

  9. ATLAS Upgrade for the sLHC: meeting the challenges of a five-fold increase in collision rate

    International Nuclear Information System (INIS)

    With the LHC collecting first data at 7 TeV, plans are already advancing for a series of upgrades leading eventually to about five times the LHC design-luminosity some 10 years from now in the super-LHC (sLHC) project. The goal is to extend the data set from about 500 fb-1 proposed for the LHC to 3000 fb-1 by around 2030. Coping with the high instantaneous and integrated luminosity will require many changes to the ATLAS detector. The designs are developing rapidly for an all-new inner-tracker, big changes in the calorimeter and muon systems, as well as improved triggers. This talk summarises the environment expected at the sLHC and the status of the improvements to the ATLAS detector. (author)

  10. ATLAS Pixel Detector Operational Experience

    CERN Document Server

    Di Girolamo, B; The ATLAS collaboration

    2011-01-01

    The ATLAS Pixel Detector is the innermost detector of the ATLAS experiment at the Large Hadron Collider at CERN, providing high-resolution measurements of charged particle tracks in the high radiation environment close to the collision region. This capability is vital for the identification and measurement of proper decay times of long-lived particles such as b-hadrons, and thus vital for the ATLAS physics program. The detector provides hermetic coverage with three cylindrical layers and three layers of forward and backward pixel detectors. It consists of approximately 80 million pixels that are individually read out via chips bump-bonded to 1744 n-in-n silicon substrates. In this talk, results from the successful operation of the Pixel Detector at the LHC will be presented, including monitoring, calibration procedures, timing optimization and detector performance. The detector performance is excellent: 96.9% of the pixels are operational, noise occupancy and hit efficiency exceed the design specification, an...

  11. Sensor studies of n+-in-n planar pixel sensors for the ATLAS upgrades

    International Nuclear Information System (INIS)

    The ATLAS experiment at the LHC is planning upgrades of its pixel detector to cope with the luminosity increase foreseen in the coming years within the transition from LHC to Super-LHC (SLHC/HL-LHC). Associated with an increase in instantaneous luminosity is a rise of the target integrated luminosity from 730 fb-1 to about 3000 fb-1 which directly translates into significantly higher radiation damage. These upgrades consist of the installation of a 4th pixel layer, the insertable b-layer IBL, with a mean sensor radius of only 32 mm from the beam axis, before 2016/17. In addition, the complete pixel detector will be exchanged before 2020/21. Being very close to the beam, the radiation damage of the IBL sensors might be as high as 5.1015neqcm-2 at their end-of-life. The total fluence of the innermost pixel layer after the SLHC upgrade might even reach 2.1016neqcm-2. We have performed systematic measurements of planar pixel detectors based on the current ATLAS readout chip FE-I3 and obtained first experience with the new IBL readout chip FE-I4. First results will be presented.

  12. The ATLAS Silicon Pixel Sensors

    CERN Document Server

    Alam, M S; Einsweiler, K F; Emes, J; Gilchriese, M G D; Joshi, A; Kleinfelder, S A; Marchesini, R; McCormack, F; Milgrome, O; Palaio, N; Pengg, F; Richardson, J; Zizka, G; Ackers, M; Andreazza, A; Comes, G; Fischer, P; Keil, M; Klasen, V; Kühl, T; Meuser, S; Ockenfels, W; Raith, B; Treis, J; Wermes, N; Gössling, C; Hügging, F G; Wüstenfeld, J; Wunstorf, R; Barberis, D; Beccherle, R; Darbo, G; Gagliardi, G; Gemme, C; Morettini, P; Musico, P; Osculati, B; Parodi, F; Rossi, L; Blanquart, L; Breugnon, P; Calvet, D; Clemens, J-C; Delpierre, P A; Hallewell, G D; Laugier, D; Mouthuy, T; Rozanov, A; Valin, I; Aleppo, M; Caccia, M; Ragusa, F; Troncon, C; Lutz, Gerhard; Richter, R H; Rohe, T; Brandl, A; Gorfine, G; Hoeferkamp, M; Seidel, SC; Boyd, GR; Skubic, P L; Sícho, P; Tomasek, L; Vrba, V; Holder, M; Ziolkowski, M; D'Auria, S; del Papa, C; Charles, E; Fasching, D; Becks, K H; Lenzen, G; Linder, C

    2001-01-01

    Prototype sensors for the ATLAS silicon pixel detector have been developed. The design of the sensors is guided by the need to operate them in the severe LHC radiation environment at up to several hundred volts while maintaining a good signal-to-noise ratio, small cell size, and minimal multiple scattering. The ability to be operated under full bias for electrical characterization prior to the attachment of the readout integrated circuit electronics is also desired.

  13. Status of the ATLAS pixel detector

    CERN Document Server

    Saavedra Aldo, F

    2005-01-01

    The ATLAS pixel detector is currently being constructed and will be installed in 2006 to be ready for commissioning at the Large Hadron Collider. The complete pixel detector is composed of three concentric barrels and six disks that are populated by 1744 ATLAS Pixel modules. The main components of the pixel module are the readout electronics and the silicon sensor whose active region is instrumented with rectangular pixels. The module has been designed to be able to survive 10 years of operation within the ATLAS detector. A brief description of the pixel detector will be presented with results and problems encountered during the production stage.

  14. Commissioning of the ATLAS pixel detector

    Energy Technology Data Exchange (ETDEWEB)

    ATLAS Collaboration; Golling, Tobias

    2008-09-01

    The ATLAS pixel detector is a high precision silicon tracking device located closest to the LHC interaction point. It belongs to the first generation of its kind in a hadron collider experiment. It will provide crucial pattern recognition information and will largely determine the ability of ATLAS to precisely track particle trajectories and find secondary vertices. It was the last detector to be installed in ATLAS in June 2007, has been fully connected and tested in-situ during spring and summer 2008, and is ready for the imminent LHC turn-on. The highlights of the past and future commissioning activities of the ATLAS pixel system are presented.

  15. Operational experience of the ATLAS Pixel Detector

    CERN Document Server

    Marcisovsky, M; The ATLAS collaboration

    2011-01-01

    The ATLAS Pixel Detector is the innermost detector of the ATLAS experiment at the Large Hadron Collider at CERN, providing high-resolution measurements of charged particle tracks in the high radiation environment close to the collision region. This capability is vital for the identification and measurement of proper decay times of long-lived particles such as b-hadrons, and thus vital for the ATLAS physics program. The detector provides hermetic coverage with three cylindrical layers and three layers of forward and backward pixel detectors. It consists of approximately 80 million pixels that are individually read out via chips bump-bonded to 1744 n-in-n silicon substrates. In this talk, results from the successful operation of the Pixel Detector at the LHC will be presented, including monitoring, calibration procedures, timing optimization and detector performance. The detector performance is excellent: 97,5% of the pixels are operational, noise occupancy and hit efficiency exceed the design specification, an...

  16. Operational experience of the ATLAS Pixel detector

    CERN Document Server

    Hirschbuehl, D; The ATLAS collaboration

    2011-01-01

    The ATLAS Pixel Detector is the innermost detector of the ATLAS experiment at the Large Hadron Collider at CERN, providing high-resolution measurements of charged particle tracks in the high radiation environment close to the collision region. This capability is vital for the identification and measurement of proper decay times of long-lived particles such as b-hadrons, and thus vital for the ATLAS physics program. The detector provides hermetic coverage with three cylindrical layers and three layers of forward and backward pixel detectors. It consists of approximately 80 million pixels that are individually read out via chips bump-bonded to 1744 n-in-n silicon substrates. In this talk, results from the successful operation of the Pixel Detector at the LHC will be presented, including monitoring, calibration procedures, timing optimization and detector performance. The detector performance is excellent: 97,5% of the pixels are operational, noise occupancy and hit efficiency exceed the design specification, an...

  17. Operational experience with the ATLAS Pixel Detector

    CERN Document Server

    Ince, T; The ATLAS collaboration

    2012-01-01

    The ATLAS Pixel Detector is the innermost element of the ATLAS experiment at the Large Hadron Collider at CERN, providing high-resolution measurements of charged particle tracks in the high radiation environment close to the collision region. This capability is vital for the identification and measurement of proper decay times of long-lived particles such as b-hadrons, and thus vital for the ATLAS physics program. The detector provides hermetic coverage with three cylindrical layers and three layers of forward and backward pixel detectors. It consists of approximately 80 million pixels that are individually read out via chips bump-bonded to 1744 n-in-n silicon substrates. In this paper, results from the successful operation of the Pixel Detector at the LHC will be presented, including monitoring, calibration procedures, timing optimization and detector performance. The detector performance is excellent: 96.2% of the pixels are operational, noise occupancy and hit efficiency exceed the design specification, an...

  18. Commissioning of the ATLAS Pixel Detector

    OpenAIRE

    Golling, Tobias; ATLAS Collaboration

    2008-01-01

    The ATLAS pixel detector is a high precision silicon tracking device located closest to the LHC interaction point. It belongs to the first generation of its kind in a hadron collider experiment. It will provide crucial pattern recognition information and will largely determine the ability of ATLAS to precisely track particle trajectories and find secondary vertices. It was the last detector to be installed in ATLAS in June 2007, has been fully connected and tested in-situ during spring and su...

  19. Study of planar pixel sensors hardener to radiations for the upgrade of the ATLAS vertex detector

    International Nuclear Information System (INIS)

    In this work, we present a study, using TCAD (Technology Computer-Assisted Design) simulation, of the possible methods of designing planar pixel sensors by reducing their inactive area and improving their radiation hardness for use in the Insertable B-Layer (IBL) project and for SLHC upgrade phase for the ATLAS experiment. Different physical models available have been studied to develop a coherent model of radiation damage in silicon that can be used to predict silicon pixel sensor behavior after exposure to radiation. The Multi-Guard Ring Structure, a protection structure used in pixel sensor design was studied to obtain guidelines for the reduction of inactive edges detrimental to detector operation while keeping a good sensor behavior through its lifetime in the ATLAS detector. A campaign of measurement of the sensor process parameters and electrical behavior to validate and calibrate the TCAD simulation models and results are also presented. A model for diode charge collection in highly irradiated environment was developed to explain the high charge collection observed in highly irradiated devices. A simple planar pixel sensor digitization model to be used in test beam and full detector system is detailed. It allows for easy comparison between experimental data and prediction by the various radiation damage models available. The digitizer has been validated using test beam data for unirradiated sensors and can be used to produce the first full scale simulation of the ATLAS detector with the IBL that include sensor effects such as slim edge and thinning of the sensor. (author)

  20. Operational Experience with the ATLAS Pixel Detector

    CERN Document Server

    Lantzsch, Kerstin; The ATLAS collaboration

    2016-01-01

    Run 2 of the LHC is providing new challenges to track and vertex reconstruction with higher energies, denser jets and higher rates. Therefore the ATLAS experiment has constructed the first 4-layer Pixel detector in HEP, installing a new Pixel layer, also called Insertable B-Layer (IBL). In addition the Pixel detector was refurbished with new service quarter panels to recover about 3% of defective modules lost during run 1 and a new optical readout system to readout the data at higher speed while reducing the occupancy when running with increased luminosity. The commissioning, operation and performance of the 4-layer Pixel Detector will be presented.

  1. Upgrades of the ATLAS Pixel Detector

    CERN Document Server

    Hügging, F; The ATLAS collaboration

    2013-01-01

    The upgrade for the ATLAS detector will undergo different phases towards HL-LHC. The first upgrade for the Pixel Detector (Phase 1) consists in the construction of a new pixel layer, which will be installed during the 1st long shutdown of the LHC machine (LS1) in 2013/14. The new detector, called Insertable B-Layer (IBL), will be inserted between the existing pixel detector and a new (smaller radius) beam-pipe at a radius of about 3.2 cm. The IBL requires the development of several new technologies to cope with the increase of radiation and pixel occupancy as well as to improve the physics performance of the existing pixel detector. The pixel size is reduced and the material budget is minimized by using new lightweight mechanical support materials and a CO2 based cooling system. For Phase 2 upgrade of LHC a complete new 4-layer pixel system is planned as part of a new all silicon Inner Detector. The increase in luminosity to about $5\\cdot 10^{34}$cm$^{-2}$s$^{-1}$ together with a total expected lifetime of ab...

  2. Optical Link of the Atlas Pixel Detector

    OpenAIRE

    Gan, K. K.

    2007-01-01

    The on-detector optical link of the ATLAS pixel detector contains radiation-hard receiver chips to decode bi-phase marked signals received on PIN arrays and data transmitter chips to drive VCSEL arrays. The components are mounted on hybrid boards (opto-boards). We present results from the irradiation studies with 24 GeV protons up to 32 Mrad (1.2 x 10^15 p/cm^2) and the experience from the production.

  3. ATLAS rewards two pixel detector suppliers

    CERN Multimedia

    2007-01-01

    Peter Jenni, ATLAS spokesperson, presented the ATLAS supplier award to Herbert Reichl, IZM director, and to Simonetta Di Gioia, from the SELEX company.Two of ATLAS’ suppliers were awarded prizes at a ceremony on Wednesday 13 June attended by representatives of the experiment’s management and of CERN. The prizes went to the Fraunhofer Institut für Zuverlässigkeit und Mikrointegration (IZM) in Berlin and the company SELEX Sistemi Integrati in Rome for the manufacture of modules for the ATLAS pixel detector. SELEX supplied 1500 of the modules for the tracker, while IZM produced a further 1300. The modules, each made up of 46080 channels, form the active part of the ATLAS pixel detector. IZM and SELEX received the awards for the excellent quality of their work: the average number of faulty channels per module was less than 2.10-3. They also stayed within budget and on schedule. The difficulty they faced was designing modules based on electronic components and sensor...

  4. Development of thin sensors and a novel interconnection technology for the upgrade of the ATLAS pixel system

    Energy Technology Data Exchange (ETDEWEB)

    Beimforde, Michael

    2010-07-19

    To extend the discovery potential of the experiments at the LHC accelerator a two phase luminosity upgrade towards the super LHC (sLHC) with a maximum instantaneous luminosity of 10{sup 35}/cm{sup 2}s{sup 1} is planned. Retaining the reconstruction efficiency and spatial resolution of the ATLAS tracking detector at the sLHC, new pixel modules have to be developed that have a higher granularity, can be placed closer to the interaction point, and allow for a cost-efficient coverage of a larger pixel detector volume compared to the present one. The reduced distance to the interaction point calls for more compact modules that have to be radiation hard to supply a sufficient charge collection efficiency up to an integrated particle fluence equivalent to that of (1-2).10{sup 16} 1-MeV-neutrons per square centimeter (n{sub eq}/cm{sup 2}). Within this thesis a new module concept was partially realised and evaluated for the operation within an ATLAS pixel detector at the sLHC. This module concept utilizes a novel thin sensor production process for thin n-in-p silicon sensors which potentially allow for a higher radiation hardness at a reduced cost. Furthermore, the new 3D-integration technology ICV-SLID is explored which will allow for increasing the active area of the modules from 71% to about 90% and hence, for employing the modules in the innermost layer of the upgraded ATLAS pixel detector. A semiconductor simulation and measurements of irradiated test sensors are used to optimize the implantation parameters for the inter-pixel isolation of the thin sensors. These reduce the crosstalk between the pixel channels and should allow for operating the sensors during the whole runtime of the experiment without causing junction breakdowns. The characterization of the first production of sensors with active thicknesses of 75 {mu}m and 150 {mu}m proved that thin pixel sensors can be successfully produced with the new process technology. Thin pad sensors with a reduced inactive

  5. Development of thin sensors and a novel interconnection technology for the upgrade of the ATLAS pixel system

    International Nuclear Information System (INIS)

    To extend the discovery potential of the experiments at the LHC accelerator a two phase luminosity upgrade towards the super LHC (sLHC) with a maximum instantaneous luminosity of 1035/cm2s1 is planned. Retaining the reconstruction efficiency and spatial resolution of the ATLAS tracking detector at the sLHC, new pixel modules have to be developed that have a higher granularity, can be placed closer to the interaction point, and allow for a cost-efficient coverage of a larger pixel detector volume compared to the present one. The reduced distance to the interaction point calls for more compact modules that have to be radiation hard to supply a sufficient charge collection efficiency up to an integrated particle fluence equivalent to that of (1-2).1016 1-MeV-neutrons per square centimeter (neq/cm2). Within this thesis a new module concept was partially realised and evaluated for the operation within an ATLAS pixel detector at the sLHC. This module concept utilizes a novel thin sensor production process for thin n-in-p silicon sensors which potentially allow for a higher radiation hardness at a reduced cost. Furthermore, the new 3D-integration technology ICV-SLID is explored which will allow for increasing the active area of the modules from 71% to about 90% and hence, for employing the modules in the innermost layer of the upgraded ATLAS pixel detector. A semiconductor simulation and measurements of irradiated test sensors are used to optimize the implantation parameters for the inter-pixel isolation of the thin sensors. These reduce the crosstalk between the pixel channels and should allow for operating the sensors during the whole runtime of the experiment without causing junction breakdowns. The characterization of the first production of sensors with active thicknesses of 75 μm and 150 μm proved that thin pixel sensors can be successfully produced with the new process technology. Thin pad sensors with a reduced inactive edge demonstrate that the active sensor

  6. Analysis methods of testbeam data of irradiated ATLAS Planar Pixel Sensors

    International Nuclear Information System (INIS)

    The ATLAS Pixel detector is the innermost subdetector of the ATLAS-Experiment at CERN. The development of new sensor technologies is going on as detector-upgrades are foreseen to cope with higher fluences and more pile-up-events after accelerator upgrades (SLHC). For testing properties of sensors, testbeams are used. Beam-telescopes such as the EUDET-Telescope have been used for measuring the exact position of beam-tracks to determine the properties of different sensor technologies. Several sensors with different designs (e.g. slim edges) were read-out in testbeam after irradiation at differing fluences (up to 2.1016 neqcm-2) and voltages (up to 1500 V) to observe the performance of the sensors under conditions up to the end-lifetime of the ATLAS detector. The reconstruction chain of the so called Eutelescope framework including adaptions and the evaluation of the reconstructed data are presented. Typical results including hit- and charge-efficiency plots are shown and interpreted.

  7. Module concepts with (Ultra-) thin chips for ATLAS IBL and sLHC

    International Nuclear Information System (INIS)

    Material budget is a crucial issue in vertex detectors for High Energy Physics experiments. For the Insertable B-Layer (IBL) project, a new front-end chip (FE-I4) is designed with an area of 18.8 x 20.2 mm2, almost 5 times larger than the present FE chip (FE-I3). A thickness of 300 to 350 μm would be required to avoid bending of this large chip at the high temperatures used in a standard flip-chip process, leading to a significant contribution of the chip to the material budget. A new flip-chip process is thus under development with IZM Berlin to allow for flip-chip using FE-I4 chips thinned down to about 100 μm. Results on flip-chip assemblies of 90 μm thin 2 x 2 FE-I3 dies to dummy sensors are encouraging, showing only some small issues that could be solved with minor process modifications or with slightly thicker chips. Both possibilities are studied to reach the goal of having thinned down FE-I4 to 100-200 μm. Bumped thin chips will also enable usage of Through Silicon Vias (TSV) in pixel modules. TSV is a via-last 3D integration technique which allows routing of signals on the backside of the FE. Two different types of vias are studied, Straight Side Walls and Tapered Side Wall. The development of a module with Tapered Side Wall TSV and simple backside metallization connected to a flex hybrid has started with IZM Berlin.

  8. Reliability and performance studies of DC-DC conversion powering scheme for the CMS pixel tracker at SLHC

    International Nuclear Information System (INIS)

    The upgrades of the Large Hadron Collider (LHC) introduce a significant challenge to the power distribution of the detectors. DC-DC conversion is the preferred powering scheme proposed to be integrated for the CMS tracker to deliver high input voltage levels and performing a step-down conversion nearby the detector modules. In this work, we propose a step-up/step-down powering scheme by performing voltage step up at the CAEN supply unit and voltage step down near the detector. We designed step-up converters and investigate the pixel performance and power loss on the FPIX power distribution system. Tests are performed using the PSI46 pixel readout chips on a forward pixel panel module and the DC-DC converters developed at CERN and Fermilab. Reliability studies include the voltage drop measurements on the readout chips and the power supply noise generated from the converter. Performance studies include pixel noise and threshold dispersion results. Comparison between step-down only and step-up/step-down conversion powering schemes are provided.

  9. Reliability and performance studies of DC-DC conversion powering scheme for the CMS pixel tracker at SLHC

    Science.gov (United States)

    Todri, A.; Perera, L.; Rivera, R.; Kwan, S.

    2010-12-01

    The upgrades of the Large Hadron Collider (LHC) introduce a significant challenge to the power distribution of the detectors. DC-DC conversion is the preferred powering scheme proposed to be integrated for the CMS tracker to deliver high input voltage levels and performing a step-down conversion nearby the detector modules. In this work, we propose a step-up/step-down powering scheme by performing voltage step up at the CAEN supply unit and voltage step down near the detector. We designed step-up converters and investigate the pixel performance and power loss on the FPIX power distribution system. Tests are performed using the PSI46 pixel readout chips on a forward pixel panel module and the DC-DC converters developed at CERN and Fermilab. Reliability studies include the voltage drop measurements on the readout chips and the power supply noise generated from the converter. Performance studies include pixel noise and threshold dispersion results. Comparison between step-down only and step-up/step-down conversion powering schemes are provided.

  10. Reliability and performance studies of DC-DC conversion powering scheme for the CMS pixel tracker at SLHC

    CERN Document Server

    Todri, A; Rivera, R; Kwan, S; 10.1088/1748-0221/5/12/C12010

    2010-01-01

    The upgrades of the Large Hadron Collider (LHC) introduce a significant challenge to the power distribution of the detectors. DC-DC conversion is the preferred powering scheme proposed to be integrated for the CMS tracker to deliver high input voltage levels and performing a step-down conversion nearby the detector modules. In this work, we propose a step-up/step-down powering scheme by performing voltage step up at the CAEN supply unit and voltage step down near the detector. We designed step-up converters and investigate the pixel performance and power loss on the FPIX power distribution system. Tests are performed using the PSI46 pixel readout chips on a forward pixel panel module and the DC-DC converters developed at CERN and Fermilab. Reliability studies include the voltage drop measurements on the readout chips and the power supply noise generated from the converter. Performance studies include pixel noise and threshold dispersion results. Comparison between step-down only and step-up/step-down conversi...

  11. Survey of the ATLAS Pixel Detector Components

    International Nuclear Information System (INIS)

    This document provides a description of the survey performed on different components of the ATLAS Pixel Detector at different stages of its assembly. During the production of the ATLAS pixel detector great care was put in the geometrical survey of the location of the sensitive area of modules. This had a double purpose: (1) to provide a check of the quality of the assembly procedure and assure tolerances in the geometrical assembly were met; and (2) to provide an initial point for the alignment (the so called 'as-built detector'), better than the ideal geometry. Since direct access to the sensitive area becomes more and more difficult with the progress of the assembly, the survey needed to be performed at different stages: after module loading on the local supports (sectors and staves) and after assembly of the local supports in disks or halfshells. Different techniques were used, including both optical 2D and 3D surveys and mechanical survey. This document summarizes the survey procedures, the analysis done on the collected data and how survey data are stored in case they will need to be accessed in the future

  12. Optical links for the ATLAS Pixel detector

    CERN Document Server

    Stucci, Stefania Antonia; The ATLAS collaboration

    2015-01-01

    Optical links are necessary to satisfy the high speed readout over long distances for advanced silicon detector systems. We report on the optical readout used in the newly installed central pixel layer (IBL) in the ATLAS experiment. The off detector readout employs commercial optical to analog converters, which were extensively tested for this application. Performance measurements during installation and commissioning will be shown. With the increasing instantaneous luminosity in the next years, the next layers outwards of IBL of the ATLAS Pixel detector (Layer 1 and Layer 2) will reach their bandwidth limits. A plan to increase the bandwidth by upgrading the off detector readout chain is put in place. The plan also involves new optical readout components, in particular the optical receivers, for which commercial units cannot be used and a new design has been made. The latter allows for a wider operational range in term of data frequency and light input power to match the on-detector sending units on the pres...

  13. optical links for the atlas pixel detector

    CERN Document Server

    Stucci, Stefania Antonia; The ATLAS collaboration

    2015-01-01

    Optical links are necessary to satisfy the high speed readout over long distances for advanced silicon detector systems. We report on the optical readout used in the newly installed central pixel layer (IBL) in the ATLAS experiment. The off detector readout employs commercial optical to analog converters, which were extensively tested for this application. Performance measurements during installation and commissioning will be shown. With the increasing instantaneous luminosity in the next years, the next layers outwards of IBL of the ATLAS Pixel detector (Layer 1 and Layer 2) will reach their bandwidth limits. A plan to increase the bandwidth by upgrading the off detector readout chain is put in place. The plan also involves new optical readout components, in particular the optical receivers, for which commercial units cannot be used and a new design has been made. The latter allows for a wider operational range in term of data frequency and light input power to match the on-detector sending units on the pres...

  14. Pixel electronics for the ATLAS experiment

    CERN Document Server

    Fischer, P

    2001-01-01

    The ATLAS experiment at LHC will use 3 barrel layers and 2*5 disks of silicon pixel detectors as the innermost elements of the semiconductor tracker. The basic building blocks are pixel modules with an active area of 16.4 mm*60.8 mm which include an n/sup +/ on n-type silicon sensor and 16 VLSI front-end (FE) chips. Every FE chip contains a low power, high speed charge sensitive preamplifier, a fast discriminator, and a readout system which operates at the 40 MHz rate of LHC. The addresses of hit pixels (as well as a low resolution pulse height information) are stored on the FE chips until arrival of a level 1 trigger signal. Hits are then transferred to a module controller chip (MCC) which collects the data of all 16 FE chips, builds complete events and sends the data through two optical links to the data acquisition system. The MCC receives clock and data through an additional optical link and provides timing and configuration information for the FE chips. Two additional chips are used to amplify and decode...

  15. Operational experience with the ATLAS Pixel Detector at the LHC

    Science.gov (United States)

    Lapoire, C.; Atlas Collaboration

    2013-01-01

    The ATLAS Pixel Detector is the innermost detector of the ATLAS experiment at the Large Hadron Collider at CERN, providing high-resolution measurements of charged particle tracks in the high radiation environment close to the collision region. This capability is vital for the identification and measurement of proper decay times of long-lived particles such as B-hadrons, and thus vital for the ATLAS physics program. The detector provides hermetic coverage with three cylindrical layers and three layers of forward and backward pixel detectors. It consists of approximately 80 million pixels that are individually read out via chips bump-bonded to 1744 n-in-n silicon substrates. In this paper, results from the successful operation of the Pixel Detector at the LHC will be presented, including monitoring, calibration procedures and detector performance. The detector performance is excellent: 96.2% of the pixels are operational, noise occupancy is sufficiently low and hit efficiency exceed the design specification.

  16. Operational experience with the ATLAS Pixel Detector at the LHC

    CERN Document Server

    Hirschbuehl, D; The ATLAS collaboration

    2011-01-01

    The ATLAS Pixel Detector is the innermost detector of the ATLAS experiment at the Large Hadron Collider at CERN, providing high-resolution measurements of charged particle tracks in the high radiation environment close to the collision region. This capability is vital for the identification and measurement of proper decay times of long-lived particles such as b-hadrons, and thus vital for the ATLAS physics program. The detector provides hermetic coverage with three cylindrical layers and three layers of forward and backward pixel detectors. It consists of approximately 80 million pixels that are individually read out via chips bump-bonded to 1744 n-in-n silicon substrates. In this paper results from the successful operation of the Pixel Detector at the LHC will be presented, including monitoring, calibration procedures, timing optimization and detector performance. The detector performance is excellent: 96.7% of the pixels are operational, noise occupancy and hit efficiency exceed the design specification, an...

  17. Operational Experience with the ATLAS Pixel Detector at the LHC

    CERN Document Server

    Keil, M; The ATLAS collaboration

    2011-01-01

    The ATLAS Pixel Detector is the innermost detector of the ATLAS experiment at the Large Hadron Collider at CERN, providing high-resolution measurements of charged particle tracks in the high radiation environment close to the collision region. This capability is vital for the identification and measurement of proper decay times of long-lived particles such as b-hadrons, and thus vital for the ATLAS physics program. The detector provides hermetic coverage with three cylindrical layers and three layers of forward and backward pixel detectors. It consists of approximately 80 million pixels that are individually read out via chips bump-bonded to 1744 n-in-n silicon substrates. In this talk, results from the successful operation of the Pixel Detector at the LHC will be presented, including monitoring, calibration procedures, timing optimization and detector performance. The detector performance is excellent: 97,5% of the pixels are operational, noise occupancy and hit efficiency exceed the design specification, an...

  18. Operational experience with the ATLAS Pixel detector at the LHC

    CERN Document Server

    Deluca, C; The ATLAS collaboration

    2011-01-01

    The ATLAS Pixel Detector is the innermost detector of the ATLAS experiment at the Large Hadron Collider at CERN, providing high-resolution measurements of charged particle tracks in the high radiation environment close to the collision region. This capability is vital for the identification and measurement of proper decay times of long-lived particles such as b-hadrons, and thus vital for the ATLAS physics program. The detector provides hermetic coverage with three cylindrical layers and three layers of forward and backward pixel detectors. It consists of approximately 80 million pixels that are individually read out via chips bump-bonded to 1744 n-in-n silicon substrates. In this paper, results from the successful operation of the Pixel Detector at the LHC will be presented, including monitoring, calibration procedures, timing optimization and detector performance. The detector performance is excellent: 97,5\\% of the pixels are operational, noise occupancy and hit efficiency exceed the design specification, ...

  19. Operational experience with the ATLAS Pixel Detector at the LHC

    CERN Document Server

    Ince, T; The ATLAS collaboration

    2011-01-01

    The ATLAS Pixel Detector is the innermost detector of the ATLAS experiment at the Large Hadron Collider at CERN, providing high-resolution measurements of charged particle tracks in the high radiation environment close to the collision region. This capability is vital for the identification and measurement of proper decay times of long-lived particles such as b-hadrons, and thus vital for the ATLAS physics program. The detector provides hermetic coverage with three cylindrical layers and three layers of forward and backward pixel detectors. It consists of approximately 80 million pixels that are individually read out via chips bump-bonded to 1744 n-in-n silicon substrates. In this talk, results from the successful operation of the Pixel Detector at the LHC will be presented, including monitoring, calibration procedures, timing optimization and detector performance. The detector performance is excellent: 96.8% of the pixels are operational, noise occupancy and hit efficiency exceed the design specification, an...

  20. Operational experience with the ATLAS Pixel Detector at the LHC

    CERN Document Server

    Lapoire, C; The ATLAS collaboration

    2011-01-01

    The ATLAS Pixel Detector is the innermost detector of the ATLAS experiment at the Large Hadron Collider at CERN, providing high-resolution measurements of charged particle tracks in the high radiation environment close to the collision region. This capability is vital for the identification and measurement of proper decay times of long-lived particles such as b-hadrons, and thus vital for the ATLAS physics program. The detector provides hermetic coverage with three cylindrical layers and three layers of forward and backward pixel detectors. It consists of approximately 80 million pixels that are individually read out via chips bump-bonded to 1744 n-in-n silicon substrates. In this talk, results from the successful operation of the Pixel Detector at the LHC will be presented, including monitoring, calibration procedures, timing optimization and detector performance. The detector performance is excellent: 97,5% of the pixels are operational, noise occupancy and hit efficiency exceed the design specification, an...

  1. Operational Experience with the ATLAS Pixel Detector at the LHC

    CERN Document Server

    Lapoire, C; The ATLAS collaboration

    2012-01-01

    The ATLAS Pixel Detector is the innermost detector of the ATLAS experiment at the Large Hadron Collider at CERN, providing high-resolution measurements of charged particle tracks in the high radiation environment close to the collision region. This capability is vital for the identification and measurement of proper decay times of long-lived particles such as B-hadrons, and thus vital for the ATLAS physics program. The detector provides hermetic coverage with three cylindrical layers and three layers of forward and backward pixel detectors. It consists of approximately 80 million pixels that are individually read out via chips bump-bonded to 1744 n-in-n silicon substrates. In this paper, results from the successful operation of the Pixel Detector at the LHC will be presented, including monitoring, calibration procedures and detector performance. The detector performance is excellent: 96.2% of the pixels are operational, noise occupancy and hit efficiency exceed the design specification.

  2. Operational Experience with the ATLAS Pixel Detector at the LHC

    CERN Document Server

    Lange, C; The ATLAS collaboration

    2011-01-01

    The ATLAS Pixel Detector is the innermost detector of the ATLAS experiment at the Large Hadron Collider at CERN, providing high-resolution measurements of charged particle tracks in the high radiation environment close to the collision region. This capability is vital for the identification and measurement of proper decay times of long-lived particles such as b-hadrons, and thus vital for the ATLAS physics program. The detector provides hermetic coverage with three cylindrical layers and three layers of forward and backward pixel detectors. It consists of approximately 80 million pixels that are individually read out via chips bump- bonded to 1744 n-in-n silicon substrates. In this talk, results from the successful operation of the Pixel Detector at the LHC will be presented, including monitoring, calibration procedures, timing optimization and detector performance. The detector performance is excellent: 97,5% of the pixels are operational, noise occupancy and hit efficiency exceed the design specification, a...

  3. Operational experience with the ATLAS Pixel detector at the LHC

    CERN Document Server

    Deluca, C; The ATLAS collaboration

    2011-01-01

    The ATLAS Pixel Detector is the innermost detector of the ATLAS experiment at the Large Hadron Collider at CERN, providing high-resolution measurements of charged particle tracks in the high radiation environment close to the collision region. This capability is vital for the identification and measurement of proper decay times of long-lived particles such as b-hadrons, and thus vital for the ATLAS physics program. The detector provides hermetic coverage with three cylindrical layers and three layers of forward and backward pixel detectors. It consists of approximately 80 million pixels that are individually read out via chips bump-bonded to 1744 n-in-n silicon substrates. In this talk, results from the successful operation of the Pixel Detector at the LHC will be presented, including monitoring, calibration procedures, timing optimization and detector performance. The detector performance is excellent: 97,5% of the pixels are operational, noise occupancy and hit efficiency exceed the design specification, an...

  4. DAQ Hardware and software development for the ATLAS Pixel Detector

    CERN Document Server

    Stramaglia, Maria Elena; The ATLAS collaboration

    2015-01-01

    In 2014, the Pixel Detector of the ATLAS experiment was extended by about 12 million pixels with the installation of the Insertable B-Layer (IBL). Data-taking and tuning procedures have been implemented by employing newly designed read-out hardware, which supports the full detector bandwidth even for calibration. The hardware is supported by an embedded software stack running on the read-out boards. The same boards will be used to upgrade the read-out bandwidth for the two outermost layers of the ATLAS Pixel Barrel (54 million pixels). We present the IBL read-out hardware and the supporting software architecture used to calibrate and operate the 4-layer ATLAS Pixel detector. We discuss the technical implementations and status for data taking, validation of the DAQ system in recent cosmic ray data taking, in-situ calibrations, and results from additional tests in preparation for Run 2 at the LHC.

  5. DAQ hardware and software development for the ATLAS Pixel Detector

    CERN Document Server

    Stramaglia, Maria Elena; The ATLAS collaboration

    2015-01-01

    In 2014, the Pixel Detector of the ATLAS experiment has been extended by about 12 million pixels thanks to the installation of the Insertable B-Layer (IBL). Data-taking and tuning procedures have been implemented along with newly designed read-out hardware to support high bandwidth for data readout and calibration. The hardware is supported by an embedded software stack running on the read-out boards. The same boards will be used to upgrade the read-out bandwidth for the two outermost layers of the ATLAS Pixel Barrel (54 million pixels). We present the IBL read-out hardware and the supporting software architecture used to calibrate and operate the 4-layer ATLAS Pixel detector. We discuss the technical implementations and status for data taking, validation of the DAQ system in recent cosmic ray data taking, in-situ calibrations, and results from additional tests in preparation for Run 2 at the LHC.

  6. Initial Measurements on Pixel Detector Modules for the ATLAS Upgrades

    CERN Document Server

    Gallrapp, C; The ATLAS collaboration

    2011-01-01

    Delicate conditions in terms of peak and integrated luminosity in the Large Hadron Collider (LHC) will raise the ATLAS Pixel Detector to its performance limits. Silicon planar, silicon 3D and diamond pixel sensors are three possible sensor technologies which could be implemented in the upcoming Pixel Detector upgrades of the ATLAS experiment. Measurements of the IV-behavior and measurements with radioactive Americium-241 and Strontium-90 are used to characterize the sensor properties and to understand the interaction between the ATLAS FE-I4 front-end chip and the sensor. Comparisons of results from before and after irradiation for silicon planar and 3D pixel sensors, which give a first impression on the charge collection properties of the different sensor technologies, are presented.

  7. DAQ hardware and software development for the ATLAS Pixel Detector

    Science.gov (United States)

    Stramaglia, Maria Elena

    2016-07-01

    In 2014, the Pixel Detector of the ATLAS experiment has been extended by about 12 million pixels thanks to the installation of the Insertable B-Layer (IBL). Data-taking and tuning procedures have been implemented along with newly designed readout hardware to support high bandwidth for data readout and calibration. The hardware is supported by an embedded software stack running on the readout boards. The same boards will be used to upgrade the readout bandwidth for the two outermost barrel layers of the ATLAS Pixel Detector. We present the IBL readout hardware and the supporting software architecture used to calibrate and operate the 4-layer ATLAS Pixel Detector. We discuss the technical implementations and status for data taking, validation of the DAQ system in recent cosmic ray data taking, in-situ calibrations, and results from additional tests in preparation for Run 2 at the LHC.

  8. Initial Measurements On Pixel Detector Modules For The ATLAS Upgrades

    CERN Document Server

    Gallrapp, C; The ATLAS collaboration

    2011-01-01

    Sophisticated conditions in terms of peak and integrated luminosity in the Large Hadron Collider (LHC) will raise the ATLAS Pixel detector to its performance limits. Silicon planar, silicon 3D and diamond pixel sensors are three possible sensor technologies which could be implemented in the upcoming pixel detector upgrades of the ATLAS experiment. Measurements of the IV-behavior and measurements with radioactive Americium-241 and Strontium-90 are used to characterize the sensor properties and to understand the interaction between the ATLAS FE-I4 front-end chip and the sensor. Comparisons of results from before and after irradiation, which give a first impression on the charge collection properties of the different sensor technologies are presented.

  9. Vertex measurement at a hadron collider. The ATLAS pixel detector

    International Nuclear Information System (INIS)

    The ATLAS Pixel Detector is the innermost layer of the ATLAS tracking system and will contribute significantly to the ATLAS track and vertex reconstruction. The detector consists of identical sensor-chip-hybrid modules, arranged in three barrels in the centre and three disks on either side for the forward region. The position of the Pixel Detector near the interaction point requires excellent radiation hardness, fast read-out, mechanical and thermal robustness, good long-term stability, all combined with a low material budget. The new design concepts used to meet the challenging requirements are discussed with their realisation in the Pixel Detector, followed by a description of a refined and extensive set of measurements to assess the detector performance during and after its construction. (orig.)

  10. ATLAS Inner Detector (Pixel Detector and Silicon Tracker)

    CERN Multimedia

    ATLAS Outreach

    2006-01-01

    To raise awareness of the basic functions of the Pixel Detector and Silicon Tracker in the ATLAS detector on the LHC at CERN. This colorful 3D animation is an excerpt from the film "ATLAS-Episode II, The Particles Strike Back." Shot with a bug's eye view of the inside of the detector. The viewer is taken on a tour of the inner workings of the detector, seeing critical pieces of the detector and hearing short explanations of how each works.

  11. Front-End electronics and integration of ATLAS pixel modules

    Science.gov (United States)

    Hügging, F.; ATLAS Pixel Collaboration

    2005-09-01

    For the ATLAS Pixel Detector fast readout electronics has been successfully developed and tested. Main attention was given to the ability to detect small charges in the order of 5,000 e - within 25 ns in the harsh radiation environment of LHC together with the challenge to cope with the huge amount of data generated by the 80 million channels of the Pixel detector. For the integration of the 50 μm pitch hybrid pixel detector, reliable bump bonding techniques using either lead-tin or indium bumps has been developed and has been successfully tested for large-scale production.

  12. Front-End electronics and integration of ATLAS pixel modules

    CERN Document Server

    Hügging, F G

    2005-01-01

    For the ATLAS Pixel Detector fast readout electronics has been successfully developed and tested. Main attention was given to the ability to detect small charges in the order of 5,000 electrons within 25 ns in the harsh radiation environment of LHC together with the challenge to cope with the huge amount of data generated by the 80 millions channels of the Pixel detector. For the integration of the 50 micron pitch hybrid pixel detector reliable bump bonding techniques using either lead-tin or indium bumps has been developed and has been successfully tested for large scale production.

  13. The ATLAS muon Micromegas R&D project towards large-size chambers for the s-LHC

    CERN Document Server

    Alexopoulos, T; Alviggi, M; Arik, M; Cetin, S A; Chernyatine, V; Cheu, E; Della Volpe, D; Dris, M; Fassouliotis, D; Gazis, E N; Giordano, R; Gratchev, V; Guan, L; Iengo, P; Ioannou, P; Li, C; Kaushik, V; Khodinov, A; Kourkoumelis, C; Maltezos, S; Mermigka, K; Müller, H; Nikolopoulos, K; Park, W; Persembe, S; Petridou, C; Petti, R; Polychronakos, V; Purohit, M V; Sampsonidis, D; Sekhniaidze, G; Shao, M; Sun, Y J; Tsipolitis, G; Veenhof, R; Wang, X L; Wotschack, J; Wu, S X; Zhao, T; Zhao, Z G

    2009-01-01

    Detectors based on the bulk-Micromegas technology exhibit position resolution better than 100 μm at counting rates of up to several tens of kHz/cm2, along with trigger capabilities. These characteristics, combined with the detector's mechanical robustness and the possibility for cost-effective industrial production, makes them a promising candidate for the ATLAS Muon Spectrometer upgrade in a future luminosity enhancement of the LHC. The R&D project status will be presented together with the obtained results in the effort to define the baseline system specifications.

  14. Planar pixel sensors for the ATLAS upgrade: beam tests results

    International Nuclear Information System (INIS)

    The performance of planar silicon pixel sensors, in development for the ATLAS Insertable B-Layer and High Luminosity LHC (HL-LHC) upgrades, has been examined in a series of beam tests at the CERN SPS facilities since 2009. Salient results are reported on the key parameters, including the spatial resolution, the charge collection and the charge sharing between adjacent cells, for different bulk materials and sensor geometries. Measurements are presented for n+-in-n pixel sensors irradiated with a range of fluences and for p-type silicon sensors with various layouts from different vendors. All tested sensors were connected via bump-bonding to the ATLAS Pixel read-out chip. The tests reveal that both n-type and p-type planar sensors are able to collect significant charge even after the lifetime fluence expected at the HL-LHC.

  15. High-voltage pixel sensors for ATLAS upgrade

    Science.gov (United States)

    Perić, I.; Kreidl, C.; Fischer, P.; Bompard, F.; Breugnon, P.; Clemens, J.-C.; Fougeron, D.; Liu, J.; Pangaud, P.; Rozanov, A.; Barbero, M.; Feigl, S.; Capeans, M.; Ferrere, D.; Pernegger, H.; Ristic, B.; Muenstermann, D.; Gonzalez Sevilla, S.; La Rosa, A.; Miucci, A.; Nessi, M.; Iacobucci, G.; Backhaus, M.; Hügging, Fabian; Krüger, H.; Hemperek, T.; Obermann, T.; Wermes, N.; Garcia-Sciveres, M.; Quadt, A.; Weingarten, J.; George, M.; Grosse-Knetter, J.; Rieger, J.; Bates, R.; Blue, A.; Buttar, C.; Hynds, D.

    2014-11-01

    The high-voltage (HV-) CMOS pixel sensors offer several good properties: a fast charge collection by drift, the possibility to implement relatively complex CMOS in-pixel electronics and the compatibility with commercial processes. The sensor element is a deep n-well diode in a p-type substrate. The n-well contains CMOS pixel electronics. The main charge collection mechanism is drift in a shallow, high field region, which leads to a fast charge collection and a high radiation tolerance. We are currently evaluating the use of the high-voltage detectors implemented in 180 nm HV-CMOS technology for the high-luminosity ATLAS upgrade. Our approach is replacing the existing pixel and strip sensors with the CMOS sensors while keeping the presently used readout ASICs. By intelligence we mean the ability of the sensor to recognize a particle hit and generate the address information. In this way we could benefit from the advantages of the HV sensor technology such as lower cost, lower mass, lower operating voltage, smaller pitch, smaller clusters at high incidence angles. Additionally we expect to achieve a radiation hardness necessary for ATLAS upgrade. In order to test the concept, we have designed two HV-CMOS prototypes that can be readout in two ways: using pixel and strip readout chips. In the case of the pixel readout, the connection between HV-CMOS sensor and the readout ASIC can be established capacitively.

  16. ATLAS Pixel Group - Photo Gallery from Irradiation

    CERN Multimedia

    2001-01-01

    Photos 1,2,3,4,5,6,7 - Photos taken before irradiation of Pixel Test Analog Chip and Pmbars (April 2000) Photos 8,9,10,11 - Irradiation of VDC chips (May 2000) Photos 12, 13 - Irradiation of Passive Components (June 2000) Photos 14,15, 16 - Irradiation of Marebo Chip (November 1999)

  17. Robustness of the ATLAS pixel clustering neural network algorithm

    CERN Document Server

    Sidebo, Per Edvin; The ATLAS collaboration

    2016-01-01

    Proton-proton collisions at the energy frontier puts strong constraints on track reconstruction algorithms. In the ATLAS track reconstruction algorithm, an artificial neural network is utilised to identify and split clusters of neighbouring read-out elements in the ATLAS pixel detector created by multiple charged particles. The robustness of the neural network algorithm is presented, probing its sensitivity to uncertainties in the detector conditions. The robustness is studied by evaluating the stability of the algorithm's performance under a range of variations in the inputs to the neural networks. Within reasonable variation magnitudes, the neural networks prove to be robust to most variation types.

  18. Optical Links for the ATLAS Pixel Detector

    CERN Document Server

    Gregor, Ingrid-Maria

    In der vorliegenden Dissertation wird eine strahlentolerante optische Datenstrecke mit hoher Datenrate für den Einsatz in dem Hochenergiephysikexperiment Atlas am Lhc Beschleuniger entwickelt. Da die Lhc-Experimente extremen Strahlenbelastungen ausgesetzt sind, müssen die Komponenten spezielle Ansprüche hinsichtlich der Strahlentoleranz erfüllen. Die Qualifikation der einzelnen Bauteile wurde im Rahmen dieser Arbeit durchgeführt. Die zu erwartenden Fluenzen im Atlas Inner Detector für Silizium und Gallium Arsenid (GaAs) wurden berechnet. Siliziumbauteile werden einer Fluenz von bis zu 1.1.1015neq /cm2 in 1 MeV äquivalenten Neutronen ausgesetzt sein, wohingegen GaAs Bauteile bis zu 7.8.1015neq /cm2 ausgesetzt sein werden. Die Strahlentoleranz der einzelnen benötigten Komponenten wie z.B. der Laserdioden sowie der jeweiligen Treiberchips wurde untersucht. Sowohl die Photo- als auch die Laserdioden haben sich als strahlentolerant für die Fluenzen an dem vorgesehenen Radius erwiesen. Aus de...

  19. Radiation damage monitoring of the ATLAS pixel detector

    CERN Document Server

    Seidel, Sally; The ATLAS collaboration

    2015-01-01

    A measurement has been made of the radiation damage incurred by the ATLAS Pixel Detector barrel silicon modules from the beginning of operations through the end of 2012. This translates to hadronic fluence received over the full period of operation at energies up to and including 8 TeV. The measurement is based on a per-module record of the silicon sensor leakage current. The results are presented as a function of integrated luminosity and compared to predictions by the Hamburg Model. This information can be used to predict limits on the lifetime of the Pixel Detector due to current, for various operating scenarios.

  20. Monitoring Radiation Damage in the ATLAS Pixel Detector

    CERN Document Server

    Schorlemmer, André Lukas; Große-Knetter, Jörn; Rembser, Christoph; Di Girolamo, Beniamino

    2014-11-05

    Radiation hardness is one of the most important features of the ATLAS pixel detector in order to ensure a good performance and a long lifetime. Monitoring of radiation damage is crucial in order to assess and predict the expected performance of the detector. Key values for the assessment of radiation damage in silicon, such as the depletion voltage and depletion depth in the sensors, are measured on a regular basis during operations. This thesis summarises the monitoring program that is conducted in order to assess the impact of radiation damage and compares it to model predictions. In addition, the physics performance of the ATLAS detector highly depends on the amount of disabled modules in the ATLAS pixel detector. A worrying amount of module failures was observed during run I. Thus it was decided to recover repairable modules during the long shutdown (LS1) by extracting the pixel detector. The impact of the module repairs and module failures on the detector performance is analysed in this thesis.

  1. Calibration analysis software for the ATLAS Pixel Detector

    Science.gov (United States)

    Stramaglia, Maria Elena

    2016-07-01

    The calibration of the ATLAS Pixel Detector at LHC fulfils two main purposes: to tune the front-end configuration parameters for establishing the best operational settings and to measure the tuning performance through a subset of scans. An analysis framework has been set up in order to take actions on the detector given the outcome of a calibration scan (e.g. to create a mask for disabling noisy pixels). The software framework to control all aspects of the Pixel Detector scans and analyses is called calibration console. The introduction of a new layer, equipped with new FE-I4 chips, required an update of the console architecture. It now handles scans and scan analyses applied together to chips with different characteristics. An overview of the newly developed calibration analysis software will be presented, together with some preliminary results.

  2. Calibration Analysis Software for the ATLAS Pixel Detector

    CERN Document Server

    Stramaglia, Maria Elena; The ATLAS collaboration

    2015-01-01

    The calibration of the ATLAS Pixel detector at LHC fulfils two main purposes: to tune the front-end configuration parameters for establishing the best operational settings and to measure the tuning performance through a subset of scans. An analysis framework has been set up in order to take actions on the detector given the outcome of a calibration scan (e.g. to create a mask for disabling noisy pixels). The software framework to control all aspects of the Pixel detector scans and analyses is called Calibration Console. The introduction of a new layer, equipped with new Front End-I4 Chips, required an update the Console architecture. It now handles scans and scans analyses applied together to chips with different characteristics. An overview of the newly developed Calibration Analysis Software will be presented, together with some preliminary result.

  3. Planar pixel detector module development for the HL-LHC ATLAS pixel system

    Energy Technology Data Exchange (ETDEWEB)

    Bates, Richard L., E-mail: richard.bates@glasgow.ac.uk [SUPA School of Physics and Astronomy, University of Glasgow, Glasgow G12 8QQ (United Kingdom); Buttar, C.; Stewart, A.; Blue, A.; Doonan, K.; Ashby, J. [SUPA School of Physics and Astronomy, University of Glasgow, Glasgow G12 8QQ (United Kingdom); Casse, G.; Dervan, P.; Forshaw, D.; Tsurin, I. [The University of Liverpool, Liverpool (United Kingdom); Brown, S.; Pater, J. [The Univiersty of Manchester, Manchester (United Kingdom)

    2013-12-11

    The ATLAS pixel detector for the HL-LHC requires the development of large area pixel modules that can withstand doses up to 10{sup 16} 1 MeV n{sub eq} cm{sup −2}. The area of the pixel detector system will be over 5 m{sup 2} and as such low cost, large area modules are required. The development of a quad module based on 4 FE-I4 readout integrated chips (ROIC) will be discussed. The FE-I4 ROIC is a large area chip and the yield of the flip-chip process to form an assembly is discussed for single chip assemblies. The readout of the quad module for laboratory tests will be reported.

  4. Planar pixel detector module development for the HL-LHC ATLAS pixel system

    Science.gov (United States)

    Bates, Richard L.; Buttar, C.; Stewart, A.; Blue, A.; Doonan, K.; Ashby, J.; Casse, G.; Dervan, P.; Forshaw, D.; Tsurin, I.; Brown, S.; Pater, J.

    2013-12-01

    The ATLAS pixel detector for the HL-LHC requires the development of large area pixel modules that can withstand doses up to 1016 1 MeV neq cm-2. The area of the pixel detector system will be over 5 m2 and as such low cost, large area modules are required. The development of a quad module based on 4 FE-I4 readout integrated chips (ROIC) will be discussed. The FE-I4 ROIC is a large area chip and the yield of the flip-chip process to form an assembly is discussed for single chip assemblies. The readout of the quad module for laboratory tests will be reported.

  5. Planar pixel detector module development for the HL-LHC ATLAS pixel system

    International Nuclear Information System (INIS)

    The ATLAS pixel detector for the HL-LHC requires the development of large area pixel modules that can withstand doses up to 1016 1 MeV neq cm−2. The area of the pixel detector system will be over 5 m2 and as such low cost, large area modules are required. The development of a quad module based on 4 FE-I4 readout integrated chips (ROIC) will be discussed. The FE-I4 ROIC is a large area chip and the yield of the flip-chip process to form an assembly is discussed for single chip assemblies. The readout of the quad module for laboratory tests will be reported

  6. Pixel detector modules performance for ATLAS IBL and future pixel detectors

    CERN Document Server

    AUTHOR|(INSPIRE)INSPIRE-00355104; Pernegger, Heinz

    2015-11-06

    The ATLAS Detector is one of the four big particle physics experiments at CERN’s LHC. Its innermost tracking system consisted of the 3-Layer silicon Pixel Detector (~80M readout channels) in the first run (2010-2012). Over the past two years it was refurbished and equipped with new services as well as a new beam monitor. The major upgrade, however, was the Insertable B-Layer (IBL). It adds ~12M readout channels for improved vertexing, tracking robustness and b-tagging performance for the upcoming runs, before the high luminosity upgrade of the LHC will take place. This thesis covers two main aspects of Pixel detector performance studies: The main work was the planning, commissioning and operation of a test bench that meets the requirements of current pixel detector components. Each newly built ATLAS IBL stave was thoroughly tested, following a specifically developed procedure, and initially calibrated in that setup. A variety of production accompanying measurements as well as preliminary results after integ...

  7. Development of a Micro Pixel Chamber for the ATLAS Upgrade

    CERN Document Server

    Ochi, Atsuhiko; Komai, Hidetoshi; Edo, Yuki; Yamaguchi, Takahiro

    2012-01-01

    The Micro Pixel Chamber (μ-PIC) is being developed a sacandidate for the muon system of the ATLAS detector for upgrading in LHC experiments. The μ-PIC is a micro-pattern gaseous detector that doesn’t have floating structure such as wires, mesh, or foil. This detector can be made by printed-circuit-board (PCB) technology, which is commercially available and suited for mass production. Operation tests have been performed under high flux neutrons under similar conditions to the ATLAS cavern. Spark rates are measured using several gas mixtures under 7 MeV neutron irradiation, and good properties were observed using neon, ethane, and CF4 mixture of gases.Using resistive materials as electrodes, we are also developing a new μ-PIC, which is not expected to damage the electrodes in the case of discharge sparks.

  8. Robustness of the ATLAS pixel clustering neural network algorithm

    CERN Document Server

    Sidebo, Per Edvin; The ATLAS collaboration

    2016-01-01

    Proton-proton collisions at the energy frontier puts strong constraints on track reconstruction algorithms. The algorithms depend heavily on accurate estimation of the position of particles as they traverse the inner detector elements. An artificial neural network algorithm is utilised to identify and split clusters of neighbouring read-out elements in the ATLAS pixel detector created by multiple charged particles. The method recovers otherwise lost tracks in dense environments where particles are separated by distances comparable to the size of the detector read-out elements. Such environments are highly relevant for LHC run 2, e.g. in searches for heavy resonances. Within the scope of run 2 track reconstruction performance and upgrades, the robustness of the neural network algorithm will be presented. The robustness has been studied by evaluating the stability of the algorithm’s performance under a range of variations in the pixel detector conditions.

  9. ATLAS Pixel Detector Design For HL-LHC

    CERN Document Server

    Smart, Ben; The ATLAS collaboration

    2016-01-01

    The ATLAS Inner Detector will be replaced for the High-Luminosity LHC (HL-LHC) running in 2026. The new Inner Detector will be called the Inner Tracker (ITk). The ITk will cover an extended eta-range: at least to |eta|<3.2, and likely up to |eta|<4.0. The ITk will be an all-Silicon based detector, consisting of a Silicon strip detector outside of a radius of 362mm, and a Silicon pixel detector inside of this radius. Several novel designs are being considered for the ITk pixel detector, to cope with high-eta charged particle tracks. These designs are grouped into 'extended' and 'inclined' design-types. Extended designs have long pixel staves with sensors parallel to the beamline. High-eta particles will therefore hit these sensors at shallow angles, leaving elongated charge clusters. The length of such a charge cluster can be used to estimate the angle of the passing particle. This information can then be used in track reconstruction to improve tracking efficiency and reduce fake rates. Inclined designs ...

  10. ATLAS pixel detector timing optimisation with the back of crate card of the optical pixel readout system

    Energy Technology Data Exchange (ETDEWEB)

    Flick, T; Gerlach, P; Reeves, K; Maettig, P [Department of Physics, Bergische Universitaet Wuppertal (Germany)

    2007-04-15

    As with all detector systems at the Large Hadron Collider (LHC), the assignment of data to the correct bunch crossing, where bunch crossings will be separated in time by 25 ns, is one of the challenges for the ATLAS pixel detector. This document explains how the detector system will accomplish this by describing the general strategy, its implementation, the optimisation of the parameters, and the results obtained during a combined testbeam of all ATLAS subdetectors.

  11. ATLAS Pixel-Optoboard Production and Simulation Studies

    CERN Document Server

    Nderitu, Simon

    At CERN, a Large collider will collide protons at high energies. There are four experiments being built to study the particle properties from the collision. The ATLAS experiment is the largest. It has many sub detectors among which is the Pixel detector which is the innermost part. The Pixel detector has eighty million channels that have to be read out. An optical link is utilized for the read out. It has optical to electronic interfaces both on the detector and off the detector at the counting room. The component on the detector in called the opto-board. This work discusses the production testing of the opto-boards to be installed on the detector. A total of 300 opto-boards including spares have been produced. The production was done in three laboratories among which is the laboratory at the University of Wuppertal which had the responsibility of Post production testing of all the one third of the total opto-boards. The results are discussed in this work. The analysis of the results from the total productio...

  12. Development and characterization of diamond and 3D-silicon pixel detectors with ATLAS-pixel readout electronics

    International Nuclear Information System (INIS)

    Hybrid pixel detectors are used for particle tracking in the innermost layers of current high energy experiments like ATLAS. After the proposed luminosity upgrade of the LHC, they will have to survive very high radiation fluences of up to 1016 particles per cm2 per life time. New sensor concepts and materials are required, which promise to be more radiation tolerant than the currently used planar silicon sensors. Most prominent candidates are so-called 3D-silicon and single crystal or poly-crystalline diamond sensors. Using the ATLAS pixel electronics different detector prototypes with a pixel geometry of 400 x 50 μm2 have been built. In particular three devices have been studied in detail: a 3D-silicon and a single crystal diamond detector with an active area of about 1 cm2 and a poly-crystalline diamond detector of the same size as a current ATLAS pixel detector module (2 x 6 cm2). To characterize the devices regarding their particle detection efficiency and spatial resolution, the charge collection inside a pixel cell as well as the charge sharing between adjacent pixels was studied using a high energy particle beam. (orig.)

  13. Development and characterization of diamond and 3D-silicon pixel detectors with ATLAS-pixel readout electronics

    Energy Technology Data Exchange (ETDEWEB)

    Mathes, Markus

    2008-12-15

    Hybrid pixel detectors are used for particle tracking in the innermost layers of current high energy experiments like ATLAS. After the proposed luminosity upgrade of the LHC, they will have to survive very high radiation fluences of up to 10{sup 16} particles per cm{sup 2} per life time. New sensor concepts and materials are required, which promise to be more radiation tolerant than the currently used planar silicon sensors. Most prominent candidates are so-called 3D-silicon and single crystal or poly-crystalline diamond sensors. Using the ATLAS pixel electronics different detector prototypes with a pixel geometry of 400 x 50 {mu}m{sup 2} have been built. In particular three devices have been studied in detail: a 3D-silicon and a single crystal diamond detector with an active area of about 1 cm{sup 2} and a poly-crystalline diamond detector of the same size as a current ATLAS pixel detector module (2 x 6 cm{sup 2}). To characterize the devices regarding their particle detection efficiency and spatial resolution, the charge collection inside a pixel cell as well as the charge sharing between adjacent pixels was studied using a high energy particle beam. (orig.)

  14. Simulation of gas mixture drift properties for GasPixel detector for modernization of ATLAS

    International Nuclear Information System (INIS)

    Results of simulation of gas mixture drift properties for GasPixel detector are presented. The properties of gaseous mixtures for the GasPixel detector have been studied in view of its use in high luminosity tracking applications for the ATLAS Inner Detector in a future super-LHC collider

  15. Development and Characterization of Diamond and 3D-Silicon Pixel Detectors with ATLAS-Pixel Readout Electronics

    CERN Document Server

    Mathes, Markus

    2008-01-01

    Abstract: Hybrid pixel detectors are used for particle tracking in the innermost layers of current high energy experiments like ATLAS. After the proposed luminosity upgrade of the LHC, they will have to survive very high radiation fluences of up to 10^16 particles per cm^2 per life time. New sensor concepts and materials are required, which promise to be more radiation tolerant than the currently used planar silicon sensors. Most prominent candidates are so-called 3D-silicon and single crystal or poly-crystalline diamond sensors. Using the ATLAS pixel electronics different detector prototypes with a pixel geometry of 400 × 50 um^2 have been built. In particular three devices have been studied in detail: a 3D-silicon and a single crystal diamond detector with an active area of about 1 cm^2 and a poly-crystalline diamond detector of the same size as a current ATLAS pixel detector module (2 × 6 cm^2). To characterize the devices regarding their particle detection efficiency and spatial resolution, the charge c...

  16. Radiation Damage of the ATLAS Pixel Sensors Using Leakage Current Measurement System

    CERN Document Server

    Gorelov, I; The ATLAS collaboration

    2013-01-01

    The current measurement system measures directly the leakage current in pixel sensors. The system is integrated with the ATLAS Pixel high voltage delivery system. The system runs as a monitor of a radiation damage of the pixel sensors. The leakage current data collected for the completed data taking period are analyzed. The recent status of the sensor's radiation damage and a comparison with the theoretical predictions are presented.

  17. Simulations of 3D-Si sensors for the innermost layer of the ATLAS pixel upgrade

    CERN Document Server

    Baselga, Marta; Quirion, David

    2016-01-01

    The LHC is expected to reach luminosities up to 3000fb-1 and the innermost layer of the ATLAS upgrade plans to cope with higher occupancy and to decrease the pixel size. 3D-Si sensors are a good candidate for the innermost layer of the ATLAS pixel upgrade since they exhibit good performance under high fluences and the new designs will have smaller pixel size to fulfill the electronics expectations. This paper reports TCAD simulations of the 3D-Si sensors designed at IMB-CNM with non passing-through columns that are being fabricated for the next innermost layer of the ATLAS pixel upgrade, shows the charge collection response before and after irradiation, and the response of 3D-Si sensors located at large $\\eta$ angles.

  18. Quality control on planar n-in-n pixel sensors — Recent progress of ATLAS planar pixel sensors

    International Nuclear Information System (INIS)

    To extend the physics reach of the Large Hadron Collider (LHC), upgrades to the accelerator are planned which will increase the peak luminosity by a factor 5–10. To cope with the increased occupancy and radiation damage, the ATLAS experiment plans to introduce an all-silicon inner tracker with the high luminosity upgrade (HL-LHC). To investigate the suitability of pixel sensors using the proven planar technology for the upgraded tracker, the ATLAS Upgrade Planar Pixel Sensor (PPS) R and D Project was established. Main areas of research are the performance of planar pixel sensors at highest fluences, the exploration of possibilities for cost reduction to enable the instrumentation of large areas, the achievement of slim or active edges to provide low geometric inefficiencies without the need for shingling of modules and the investigation of the operation of highly irradiated sensors at low thresholds to increase the efficiency. The Insertable b-layer (IBL) is the first upgrade project within the ATLAS experiment and will employ a new detector layer consisting of silicon pixel sensors, which were improved and prototyped in the framework of the planar pixel sensor R and D project. A special focus of this paper is the status of the development and testing of planar n-in-n pixel sensors including the quality control of the on-going series production and postprocessing of sensor wafers. A high yield of produced planar sensor wafers and FE-I4 double chip sensors after first steps of post-processing including under bump metallization and dicing is observed. -- Highlights: ► Prototypes of irradiated planar n-in-n sensors have been successfully tested under laboratory conditions. ► A quality assurance programme on the series production of planar sensors for the IBL has started. ► A high yield of double chip sensors during the series production is observed which are compatible to the specifications to this detector component.

  19. Status and future of the ATLAS Pixel Detector at the LHC

    International Nuclear Information System (INIS)

    The ATLAS Pixel Detector is the innermost detector of the ATLAS experiment at the Large Hadron Collider at CERN. The detector provides hermetic coverage with three cylindrical layers and three layers of disks in each forward end-cap. It consists of approximately 80 million pixels that are individually read out via chips bump-bonded to 1744 n-on-n silicon substrates. Intensive calibration, tuning, timing optimization and monitoring resulted in the successful five years of operation with good detector performance. The record breaking instantaneous luminosities of 7.7×1033cm−2s−1 recently surpassed at the LHC generated a rapidly increasing particle fluence in the ATLAS Pixel Detector. As the radiation dose accumulated, the first effects of radiation damage became observable in the silicon sensors as an increase in the silicon leakage current and the change of the voltage required to fully deplete the sensor. A fourth pixel layer at a radius of 3.3 cm will be added during the long shutdown (2013–2014) together with the replacement of pixel services. A letter of intent was submitted for a completely new Pixel Detector after 2023, capable to take data with extremely high leveled luminosities of 5×1034cm−2s−1 at the high luminosity LHC. -- Highlights: •The ATLAS Pixel Detector provides hermetic coverage with three layers with 80 million pixels. •Calibration, tuning, timing optimization and monitoring resulted in the successful five years of operation with good detector performance. •First effects of radiation damage became observable in the silicon sensors. •A fourth pixel layer at a radius of 3.3 cm will be added during the long shutdown (2013–2014). •Replacement of pixel services in 2013–2014. •A letter of intent was submitted for new Pixel Detector after 2023 for high luminosity LHC

  20. Test-beam studies of diamond sensors for SLHC

    Science.gov (United States)

    Uplegger, Lorenzo; Ngadiuba, Jennifer; Alagoz, Enver; Andresen, Jeff; Arndt, Kirk; Bolla, Gino; Bortoletto, Daniela; Marie Brom, Jean; Brosius, Richard; Bubna, Mayur; Chramowicz, John; Cumalat, John; Jensen, Frank; Krzywda, Alex; Kumar, Ashish; Kwan, Simon; Lei, C. M.; Menasce, Dario; Moroni, Luigi; Obertino, Margherita; Osipenkov, Ilya; Perera, Lalith; Prosser, Alan; Rivera, Ryan; Solano, Ada; Tan, Ping; Terzo, Stefano; Tran, Nhan; Robert Wagner, Stephen

    2013-08-01

    Diamond sensors are studied as an alternative to silicon sensors to withstand the high radiation doses that are expected in future upgrades of the pixel detectors for the SLHC. Diamond pixel sensors are intrinsically radiation hard and are considered as a possible solution for the innermost tracker layers close to the interaction point where current silicon sensors cannot cope with the harsh radiation environment.An effort to study possible candidates for the upgrades is undergoing using the Fermilab test-beam facility (FTBF), where diamonds and 3D silicon sensors have been studied. Using a CMS pixel-based telescope built and installed at the FTBF, we are studying charge collection efficiencies for un-irradiated and irradiated devices bump-bonded to the CMS PSI46 pixel readout chip. A description of the test-beam effort and preliminary results on diamond sensors will be presented.

  1. Results on 0.7% X0 thick pixel modules for the ATLAS detector

    CERN Document Server

    Netchaeva, P; Darbo, G; Einsweiler, Kevin F; Gagliardi, G; Gemme, C; Gilchriese, M G D; Oppizzi, P; Richardson, J; Rossi, L; Ruscino, E; Vernocchi, F; Znizka, G

    2001-01-01

    Modules are the basic building blocks of the ATLAS pixel detector system, they are made of a silicon sensor tile containing ~46000 pixel cells of 50 mu m*400 mu m, 16 front-end chips connected to the sensor through bump bonding, a kapton flex circuit and the module controller chip. The pixel detector is the first to encounter particles emerging from LHC interactions, minimization of radiation length of pixel modules is therefore very important. We report here on the construction techniques and on the operation of the first ATLAS pixel modules of 0.7% radiation length thickness. We have operated these modules with threshold of 3700*10+or-300*10, mean noise value of 225*10 and 0.3% dead channels. (3 refs).

  2. Results on 0.7% X0 thick pixel modules for the ATLAS detector

    International Nuclear Information System (INIS)

    Modules are the basic building blocks of the ATLAS pixel detector system, they are made of a silicon sensor tile containing ∼46 000 pixel cells of 50 μmx400 μm, 16 front-end chips connected to the sensor through bump bonding, a kapton flex circuit and the module controller chip. The Pixel detector is the first to encounter particles emerging from LHC interactions, minimization of radiation length of pixel modules is therefore very important. We report here on the construction techniques and on the operation of the first ATLAS pixel modules of 0.7% radiation length thickness. We have operated these modules with threshold of 3700x10±300x10, mean noise value of 225x10 and 0.3% dead channels

  3. A New Pixel Layer for ATLAS: The IBL

    CERN Document Server

    Kehal, Asma

    2013-01-01

    This report represents the main work in our intership at CERN we investegated the quality assurance of some staves by analyzed data . In this work, we briefly review the ATLAS detector, then we taken about IBL wish play an important role at ATLAS upgrade. And finally we analyzed data with Root to check the validity of the staves .

  4. Test Beam Results of 3D Silicon Pixel Sensors for the ATLAS upgrade

    CERN Document Server

    Grenier, P; Barbero, M; Bates, R; Bolle, E; Borri, M; Boscardin, M; Buttar, C; Capua, M; Cavalli-Sforza, M; Cobal, M; Cristofoli, A; Dalla Betta, G F; Darbo, G; Da Via, C; Devetak, E; DeWilde, B; Di Girolamo, B; Dobos, D; Einsweiler, K; Esseni, D; Fazio, S; Fleta, C; Freestone, J; Gallrapp, C; Garcia-Sciveres, M; Gariano, G; Gemme, C; Giordani, M P; Gjersdal, H; Grinstein, S; Hansen, T; Hansen, T E; Hansson, P; Hasi, J; Helle, K; Hoeferkamp, M; Hugging, F; Jackson, P; Jakobs, K; Kalliopuska, J; Karagounis, M; Kenney, C; Köhler, M; Kocian, M; Kok, A; Kolya, S; Korokolov, I; Kostyukhin, V; Krüger, H; La Rosa, A; Lai, C H; Lietaer, N; Lozano, M; Mastroberardino, A; Micelli, A; Nellist, C; Oja, A; Oshea, V; Padilla, C; Palestri, P; Parker, S; Parzefall, U; Pater, J; Pellegrini, G; Pernegger, H; Piemonte, C; Pospisil, S; Povoli, M; Roe, S; Rohne, O; Ronchin, S; Rovani, A; Ruscino, E; Sandaker, H; Seidel, S; Selmi, L; Silverstein, D; Sjøbaek, K; Slavicek, T; Stapnes, S; Stugu, B; Stupak, J; Su, D; Susinno, G; Thompson, R; Tsung, J W; Tsybychev, D; Watts, S J; Wermes, N; Young, C; Zorzi, N

    2011-01-01

    Results on beam tests of 3D silicon pixel sensors aimed at the ATLAS Insertable-B-Layer and High Luminosity LHC (HL-LHC)) upgrades are presented. Measurements include charge collection, tracking efficiency and charge sharing between pixel cells, as a function of track incident angle, and were performed with and without a 1.6 T magnetic field oriented as the ATLAS Inner Detector solenoid field. Sensors were bump bonded to the front-end chip currently used in the ATLAS pixel detector. Full 3D sensors, with electrodes penetrating through the entire wafer thickness and active edge, and double-sided 3D sensors with partially overlapping bias and read-out electrodes were tested and showed comparable performance.

  5. Test beam results of 3D silicon pixel sensors for the ATLAS upgrade

    International Nuclear Information System (INIS)

    Results on beam tests of 3D silicon pixel sensors aimed at the ATLAS Insertable B-Layer and High Luminosity LHC (HL-LHC) upgrades are presented. Measurements include charge collection, tracking efficiency and charge sharing between pixel cells, as a function of track incident angle, and were performed with and without a 1.6 T magnetic field oriented as the ATLAS inner detector solenoid field. Sensors were bump-bonded to the front-end chip currently used in the ATLAS pixel detector. Full 3D sensors, with electrodes penetrating through the entire wafer thickness and active edge, and double-sided 3D sensors with partially overlapping bias and read-out electrodes were tested and showed comparable performance.

  6. Testbeam Measurements with Pixel Sensors for the ATLAS Insertable b-Layer Project

    CERN Document Server

    George, Matthias; Quadt, Arnulf

    During the current long machine shutdown of the Large Hadron Collider (LHC) at CERN (Geneva), the innermost part of the ATLAS experiment, the pixel detector, is upgraded. The existing ATLAS pixel system is equipped with silicon sensors, organized in three barrel layers and three end cap disks on either side. To cope with the higher instantaneous luminosity in the future and for compensation of radiation damages due to past and near future running time of the experiment, a new fourth pixel detector layer is inserted into the existing system. This additional pixel layer is called “Insertable b-Layer” (IBL). The IBL is a detector system, based on silicon pixel sensors. Due to the smaller radius, compared to all other detectors of the ATLAS experiment, it has to be more radiation tolerant, than e.g. the current pixel layers. Furthermore, a reduced pixel size is necessary to cope with the expected higher particle flux. During the planning phase for the IBL upgrade, three different sensor technologies were comp...

  7. SLHC: The LHC luminosity upgrade

    International Nuclear Information System (INIS)

    The LHC will provide unprecedented sensitivity to Standard Model and beyond the Standard Model Physics. However, some important Standard Model measurements as well as a wide part of the spectrum of particles predicted by many promising theoretical models of New Physics are likely beyond the LHC reach. For such observations, a factor-of-ten increase in LHC statistics will have a major impact. A luminosity upgrade is therefore planned for the LHC. The SLHC as well as offering the possibility to increase the Physics potential will create an extreme operating environment for the detectors, particularly the tracking devices. An increase in the number of minimum bias events per beam crossing by at least an order of magnitude beyond the levels envisioned for LHC design luminosity creates the need to handle much higher occupancies and for the innermost layers unprecedented levels of radiation. This will require a fully upgraded tracking system giving a higher granularity, while trying not to exceed the material budget and power levels of the current trackers. The much higher rate of interactions may also push the limits of the Level-1 trigger system. Efforts have already begun to address these issues. This paper presents the possible Physics reaches at SLHC and the current understanding of what systems will need to be upgraded.

  8. Simulations of planar pixel sensors for the ATLAS high luminosity upgrade

    OpenAIRE

    Calderini, G.; Benoit, M; Dinu, N.; Lounis, A.; Marchiori, G.

    2011-01-01

    A physics-based device simulation was used to study the charge carrier distribution and the electric field configuration inside simplified two-dimensional models for pixel layouts based on the ATLAS pixel sensor. In order to study the behavior of such detectors under different levels of irradiation, a three-level defect model was implemented into the simulation. Using these models, the number of guard rings, the dead edge width and the detector thickness were modified to investigate their inf...

  9. Commissioning and Operation of the ATLAS Pixel Detector at the CERN LHC Collider

    CERN Document Server

    Djama, F; The ATLAS collaboration

    2010-01-01

    Physics program at the CERN LHC collider started in autumn 2009. Since then, LHC daily delivers collisions between its two proton beams. This talk was devoted to the commissioning and early operation of the ATLAS Pixel Detector. The Pixel Detector is working nicely and all the required performances like efficiency, resolution and low noise were met. The fraction of working modules is as high as 97.4 %. The Pixel Detector fully participates in the reconstruction of charged particles trajectories, and is a key element in finding primary and secondary verticies and in tagging of short-lived particles.

  10. FE-I4 Chip Development for Upgraded ATLAS Pixel Detector at LHC

    CERN Document Server

    Barbero, M; The ATLAS collaboration

    2010-01-01

    A new ATLAS pixel chip FE-I4 has been developed for use in upgraded LHC luminosity environments, including the near-term Insertable B-Layer upgrade. FE-I4 is designed in a 130 nm CMOS technology, presenting advantages in terms of radiation tolerance and digital logic density compared to the 0.25 μm CMOS technology used for the current ATLAS pixel IC, FE-I3. FE-I4 architecture is based on an array of 80×336 pixels, each 50×250 μm2, consisting of analog and digital sections. The analog pixel section is designed for low power consumption and compatibility to several sensor candidates. It is based on a two-stage architecture with a pre-amp AC-coupled to a second stage of amplification. It features leakage current compensation circuitry, local 4-bit pre-amp feedback tuning and a discriminator locally adjusted through 5 configuration bits. The digital architecture is based on a 4-pixel unit called Pixel Digital Region (PDR) allowing for local storage of hits in 5-deep data buffers at pixel level for the duratio...

  11. Studies for the detector control system of the ATLAS pixel at the HL-LHC

    International Nuclear Information System (INIS)

    In the context of the LHC upgrade to the HL-LHC the inner detector of the ATLAS experiment will be replaced completely. As part of this redesign there will also be a new pixel detector. This new pixel detector requires a control system which meets the strict space requirements for electronics in the ATLAS experiment. To accomplish this goal we propose a DCS (Detector Control System) network with the smallest form factor currently available. This network consists of a DCS chip located in close proximity to the interaction point and a DCS controller located in the outer regions of the ATLAS detector. These two types of chips form a star shaped network with several DCS chips being controlled by one DCS controller. Both chips are manufactured in deep sub-micron technology. We present prototypes with emphasis on studies concerning single event upsets.

  12. Novel silicon n-in-p pixel sensors for the future ATLAS upgrades

    International Nuclear Information System (INIS)

    In view of the LHC upgrade phases towards HL-LHC the ATLAS experiment plans to upgrade the inner detector with an all silicon system. The n-in-p silicon technology is a promising candidate for the pixel upgrade thanks to its radiation hardness and cost effectiveness that allow for enlarging the area instrumented with pixel detectors. We present the characterization and performance of novel n-in-p planar pixel sensors produced by CiS (Germany) connected by bump bonding to the ATLAS readout chip FE-I3. These results are obtained before and after irradiation up to a fluence of 10161-MeV neqcm−2, and prove the operability of this kind of sensors in the harsh radiation environment foreseen for the pixel system at HL-LHC. We also present an overview of the new pixel production, which is on-going at CiS for sensors compatible with the new ATLAS readout chip FE-I4

  13. Novel Silicon n-in-p Pixel Sensors for the future ATLAS Upgrades

    CERN Document Server

    La Rosa, A; Macchiolo, A; Nisius, R; Pernegger, H; Richter,R H; Weigell, P

    2013-01-01

    In view of the LHC upgrade phases towards HL-LHC the ATLAS experiment plans to upgrade the Inner Detector with an all silicon system. The n-in-p silicon technology is a promising candidate for the pixel upgrade thanks to its radiation hardness and cost eectiveness, that allow for enlarging the area instrumented with pixel detectors. We present the characterization and performance of novel n-in-p planar pixel sensors produced by CiS (Germany) connected by bump bonding to the ATLAS readout chip FE-I3. These results are obtained before and after irradiation up to a fluence of 1016 1-MeV $n_{eq}cm^{-2}$, and prove the operability of this kind of sensors in the harsh radiation environment foreseen for the pixel system at HL-LHC. We also present an overview of the new pixel production, which is on-going at CiS for sensors compatible with the new ATLAS readout chip FE-I4.

  14. Novel silicon n-in-p pixel sensors for the future ATLAS upgrades

    Science.gov (United States)

    La Rosa, A.; Gallrapp, C.; Macchiolo, A.; Nisius, R.; Pernegger, H.; Richter, R. H.; Weigell, P.

    2013-08-01

    In view of the LHC upgrade phases towards HL-LHC the ATLAS experiment plans to upgrade the inner detector with an all silicon system. The n-in-p silicon technology is a promising candidate for the pixel upgrade thanks to its radiation hardness and cost effectiveness that allow for enlarging the area instrumented with pixel detectors. We present the characterization and performance of novel n-in-p planar pixel sensors produced by CiS (Germany) connected by bump bonding to the ATLAS readout chip FE-I3. These results are obtained before and after irradiation up to a fluence of 10161-MeV neq cm-2, and prove the operability of this kind of sensors in the harsh radiation environment foreseen for the pixel system at HL-LHC. We also present an overview of the new pixel production, which is on-going at CiS for sensors compatible with the new ATLAS readout chip FE-I4.

  15. The upgraded Pixel Detector of the ATLAS Experiment for Run2 at the Large Hadron Collider

    CERN Document Server

    Backhaus, Malte; The ATLAS collaboration

    2015-01-01

    During Run-1 of the Large Hadron Collider (LHC), the ATLAS Pixel Detector has shown excellent performance. The ATLAS collaboration took advantage of the first long shutdown of the LHC during 2013 and 2014 and extracted the ATLAS Pixel Detector from the experiment, brought it to surface and maintained the services. This includes the installation of new service quarter panels, the repair of cables, and the installation of the new Diamond Beam Monitor (DBM). Additionally a completely new innermost pixel detector layer, the Insertable B-Layer (IBL), was constructed and installed in May 2014 between a new smaller beam pipe and the existing Pixel Detector. With a radius of 3.3 cm the IBL is located extremely close to the interaction point. Therefore a new readout chip and two new sensor technologies (planar and 3D) are used in IBL. In order to achieve best possible physics performance the material budget was improved with respect to the existing Pixel Detector. This is realized using lightweight staves for mechanic...

  16. Commissioning of the upgraded ATLAS Pixel Detector for Run2 at LHC

    CERN Document Server

    Dobos, Daniel; The ATLAS collaboration

    2015-01-01

    The Pixel Detector of the ATLAS experiment has shown excellent performance during the whole Run-1 of LHC. Taking advantage of the long showdown, the detector was extracted from the experiment and brought to surface, to equip it with new service quarter panels, to repair modules and to ease installation of the Insertable B-Layer (IBL), a fourth layer of pixel detectors, installed in May 2014 between the existing Pixel Detector and a new smaller radius beam-pipe at a radius of 3.3 cm. To cope with the high radiation and pixel occupancy due to the proximity to the interaction point, a new read-out chip and two different silicon sensor technologies (planar and 3D) have been developed. An overview of the refurbishing of the Pixel Detector and of the IBL project as well as early performance tests using cosmic rays and beam data will be presented.

  17. Achievements of the ATLAS Upgrade Planar Pixel Sensors R&D Project

    CERN Document Server

    Nellist, C

    2015-01-01

    In the framework of the HL-LHC upgrade, the ATLAS experiment plans to introduce an all-silicon inner tracker to cope with the elevated occupancy. To investigate the suitability of pixel sensors using the proven planar technology for the upgraded tracker, the ATLAS Planar Pixel Sensor R&D Project (PPS) was established comprising 19 institutes and more than 90 scientists. The paper provides an overview of the research and development project and highlights accomplishments, among them: beam test results with planar sensors up to innermost layer fluences (> 10^16 n_eq cm^2); measurements obtained with irradiated thin edgeless n-in-p pixel assemblies; recent studies of the SCP technique to obtain almost active edges by postprocessing already existing sensors based on scribing, cleaving and edge passivation; an update on prototyping efforts for large areas: sensor design improvements and concepts for low-cost hybridisation; comparison between Secondary Ion Mass Spectrometry results and TCAD simulations. Togethe...

  18. Calibration Analysis Software for the ATLAS Pixel Detector

    CERN Document Server

    Stramaglia, Maria Elena; The ATLAS collaboration

    2015-01-01

    The calibration of the Pixel detector fulfills two main purposes: to tune front-end registers for establishing the best operational settings and to measure the tuning performance through a subset of scans. An analysis framework has been set up in order to take actions on the detector given the outcome of a calibration scan (e.g. to create a mask for disabling noisy pixels). The software framework to control all aspects of the Pixel detector scans and analyses is called Calibration Console. The introduction of a new layer, equipped with new Front End-I4 Chips, required an update the Console architecture. It now handles scans and scans analyses applied toghether to chips with dierent characteristics. An overview of the newly developed Calibration Analysis Software will be presented, together with some preliminary result.

  19. Thin n-in-p planar pixel modules for the ATLAS upgrade at HL-LHC

    CERN Document Server

    Savic, N; Breuer, J; La Rosa, A; Macchiolo, A; Nisius, R; Terzo, S

    2016-01-01

    The ATLAS experiment will undergo a major upgrade of the tracker system in view of the high luminosity phase of the LHC (HL-LHC) foreseen to start around 2025. Thin planar pixel modules are promising candidates to instrument the new pixel system, thanks to the reduced contribution to the material budget and their high charge collection efficiency after irradiation. New designs of the pixel cells, with an optimized biasing structure, have been implemented in n-in-p planar pixel productions with sensor thicknesses of 270 um. Using beam tests, the gain in hit efficiency is investigated as a function of the received irradiation fluence. The outlook for future thin planar pixel sensor productions will be discussed, with a focus on thin sensors with a thickness of 100 and 150 um and a novel design with the optimized biasing structure and small pixel cells (50 um x 50 um and 25 um x 100 um). These dimensions are foreseen for the new ATLAS read-out chip in 65 nm CMOS technology and the fine segmentation will represen...

  20. Evaluation of the breakdown behaviour of ATLAS silicon pixel sensors after partial guard-ring removal

    International Nuclear Information System (INIS)

    To avoid geometrical inefficiencies in the ATLAS pixel detector, the concept of shingling is used up to now in the barrel section. For the upgrades of ATLAS, it is desired to avoid this as it increases the volume and material budget of the pixel layers and complicates the cooling. A direct planar edge-to-edge arrangement of pixel modules has not been possible in the past due to about 1100μm of inactive edge composed of approximately 600μm of guard rings and 500μm of safety margin. In this work, the safety margin and guard rings of ATLAS SingleChip sensors were cut at different positions using a standard diamond dicing saw and irradiated afterwards to explore the breakdown behaviour and the leakage current development. It is found that the inactive edge can be reduced to about 400μm of guard rings with almost no reduction in pre-irradiation testability and leakage current performance. This is in particular important for the insertable b-layer upgrade of ATLAS (IBL) where inactive edges of less than 450μm width are required.

  1. Evaluation of the breakdown behaviour of ATLAS silicon pixel sensors after partial guard-ring removal

    Science.gov (United States)

    Goessling, C.; Klingenberg, R.; Muenstermann, D.; Wittig, T.

    2010-12-01

    To avoid geometrical inefficiencies in the ATLAS pixel detector, the concept of shingling is used up to now in the barrel section. For the upgrades of ATLAS, it is desired to avoid this as it increases the volume and material budget of the pixel layers and complicates the cooling. A direct planar edge-to-edge arrangement of pixel modules has not been possible in the past due to about 1100 μm of inactive edge composed of approximately 600 μm of guard rings and 500 μm of safety margin. In this work, the safety margin and guard rings of ATLAS SingleChip sensors were cut at different positions using a standard diamond dicing saw and irradiated afterwards to explore the breakdown behaviour and the leakage current development. It is found that the inactive edge can be reduced to about 400 μm of guard rings with almost no reduction in pre-irradiation testability and leakage current performance. This is in particular important for the insertable b-layer upgrade of ATLAS (IBL) where inactive edges of less than 450 μm width are required.

  2. Evaluation of the breakdown behaviour of ATLAS silicon pixel sensors after partial guard-ring removal

    Energy Technology Data Exchange (ETDEWEB)

    Goessling, C.; Klingenberg, R. [Lehrstuhl fuer Experimentelle Physik IV, TU Dortmund, 44221 Dortmund (Germany); Muenstermann, D., E-mail: Daniel.Muenstermann@TU-Dortmund.d [Lehrstuhl fuer Experimentelle Physik IV, TU Dortmund, 44221 Dortmund (Germany); Wittig, T. [Lehrstuhl fuer Experimentelle Physik IV, TU Dortmund, 44221 Dortmund (Germany)

    2010-12-11

    To avoid geometrical inefficiencies in the ATLAS pixel detector, the concept of shingling is used up to now in the barrel section. For the upgrades of ATLAS, it is desired to avoid this as it increases the volume and material budget of the pixel layers and complicates the cooling. A direct planar edge-to-edge arrangement of pixel modules has not been possible in the past due to about 1100{mu}m of inactive edge composed of approximately 600{mu}m of guard rings and 500{mu}m of safety margin. In this work, the safety margin and guard rings of ATLAS SingleChip sensors were cut at different positions using a standard diamond dicing saw and irradiated afterwards to explore the breakdown behaviour and the leakage current development. It is found that the inactive edge can be reduced to about 400{mu}m of guard rings with almost no reduction in pre-irradiation testability and leakage current performance. This is in particular important for the insertable b-layer upgrade of ATLAS (IBL) where inactive edges of less than 450{mu}m width are required.

  3. ATLAS pixel IBL modules construction experience and developments for future upgrade

    International Nuclear Information System (INIS)

    The first upgrade of the ATLAS Pixel Detector is the Insertable B-Layer (IBL), installed in May 2014 in the core of ATLAS. Two different silicon sensor technologies, planar n-in-n and 3D, are used. Sensors are connected with the new generation 130 nm IBM CMOS FE-I4 read-out chip via solder bump-bonds. Production quality control tests were set up to verify and rate the performance of the modules before integration into staves. An overview of module design and construction, the quality control results and production yield will be discussed, as well as future developments foreseen for future detector upgrades

  4. ATLAS pixel IBL modules construction experience and developments for future upgrade

    Energy Technology Data Exchange (ETDEWEB)

    Gaudiello, A.

    2015-10-01

    The first upgrade of the ATLAS Pixel Detector is the Insertable B-Layer (IBL), installed in May 2014 in the core of ATLAS. Two different silicon sensor technologies, planar n-in-n and 3D, are used. Sensors are connected with the new generation 130 nm IBM CMOS FE-I4 read-out chip via solder bump-bonds. Production quality control tests were set up to verify and rate the performance of the modules before integration into staves. An overview of module design and construction, the quality control results and production yield will be discussed, as well as future developments foreseen for future detector upgrades.

  5. ATLAS Pixel IBL Modules Construction Experience and Developments for Future Upgrade

    CERN Document Server

    Gaudiello, Andrea; The ATLAS collaboration

    2015-01-01

    The first upgrade of the ATLAS Pixel Detector is the Insertable B-Layer (IBL), just installed in May 2014 in the core of ATLAS. Two different silicon sensor technologies, planar n-in-n and 3D, were used, connected with the new generation 130nm IBM CMOS FE-I4 readout chip via solder bump-bonds. Production quality control tests were set up to verify and rate the performance of the modules before integration into staves. An overview of module design and construction, the quality control results and production yield will be discussed, as well as future developments foreseen for future detector upgrades.

  6. ATLAS Pixel IBL modules construction experience and developments for future upgrade

    CERN Document Server

    Gaudiello, A; The ATLAS collaboration

    2014-01-01

    The first upgrade of the ATLAS Pixel Detector is the Insertable B-Layer (IBL), just installed in May 2014 in the core of ATLAS. Two different silicon sensor technologies, planar n-in-n and 3D, were used, connected with the new generation 130nm IBM CMOS FE-I4 readout chip via solder bump-bonds. Production quality control tests were set up to verify and rate the performance of the modules before integration into staves. An overview of module design and construction, the quality control results and production yield will be discussed, as well as future developments foreseen for future detector upgrades.

  7. The Pixels find their way to the heart of ATLAS

    CERN Multimedia

    Kevin Einsweiler

    Since the last e-news article on the Pixel Detector in December 2006, there has been much progress. At that time, we were just about to receive the Beryllium beampipe, and to integrate the innermost layer of the Pixel Detector around it. This innermost layer is referred to as the B-layer because of the powerful role it plays in finding the secondary vertices that are the key signature for the presence of b-quarks, and with somewhat greater difficulty, c-quarks and tau leptons. The integration of the central 7m long beampipe into the Pixel Detector was completed in December, and the B-layer was successfully integrated around it. In January this year, we had largely completed the central 1.5m long detector, including the three barrel layers and the three disk layers on each end of the barrel. Although this region contains all of the 80 million readout channels, it cannot be integrated into the Inner Detector without additional services and infrastructure. Therefore, the next step was to add the Service Panels...

  8. The Pixel Detector of the ATLAS Experiment for the Run 2 at the Large Hadron Collider

    CERN Document Server

    Mandelli, B; The ATLAS collaboration

    2014-01-01

    The Pixel Detector of the ATLAS experiment has shown excellent performance during the whole Run 1 of LHC. Taking advantage of the long shutdown, the detector was extracted from the experiment and brought to surface, to equip it with new service quarter panels, to repair modules and to ease installation of the Insertable B-Layer (IBL). The IBL is a fourth layer of pixel detectors, and has been installed in May 2014 between the existing Pixel Detector and a new smaller radius beam-pipe. To cope with the high radiation and pixel occupancy due to the proximity to the interaction point, a new read-out chip and two different silicon sensor technologies (planar and 3D) have been developed. Furthermore, the physics performance will be improved through the reduction of pixel size while, targeting for a low material budget, a new mechanical support using lightweight staves and a CO$_2$ based cooling system have been adopted. The IBL construction and installation in the ATLAS Experiment has been completed very successfu...

  9. Neural network based cluster reconstruction in the ATLAS silicon Pixel Detector

    International Nuclear Information System (INIS)

    The hit signals read out from pixels on planar semi-conductor sensors are grouped into clusters, to reconstruct the location where a charged particle passed through. The spatial resolution of the pixel detector can be improved significantly using the information from the cluster of adjacent pixels. Such analogue cluster creation techniques have been used by the ATLAS experiment for many years giving an excellent performance. However, in dense environments, such as those inside high-energy jets, it is likely that the charge deposited by two or more close-by tracks merges into one single cluster. A clusterization algorithm based on neural network methods has been developed for the ATLAS Pixel Detector. This can identify the shared clusters, split them if necessary, and estimate the positions of all particles traversing the cluster. The algorithm significantly reduces ambiguities in the assignment of pixel detector measurements to tracks within jets, and improves the positional accuracy with respect to standard interpolation techniques, by the use of the 2-dimensional charge distribution information. The reconstruction using the neural network reduces strongly the number of hits shared by more than one track and improves the resolution of the impact parameter by about 15%.

  10. A Leakage Current-based Measurement of the Radiation Damage in the ATLAS Pixel Detector

    CERN Document Server

    Gorelov, Igor; The ATLAS collaboration

    2015-01-01

    A measurement has been made of the radiation damage incurred by the ATLAS Pixel Detector barrel silicon modules from the beginning of operations through the end of 2012. This translates to hadronic fluence received over the full period of operation at energies up to and including 8 TeV. The measurement is based on a per-module measurement of the silicon sensor leakage current. The results are presented as a function of integrated luminosity and compared to predictions by the Hamburg Model. This information can be used to predict limits on the lifetime of the Pixel Detector due to current, for various operating scenarios.

  11. Simulation of guard ring influence on the performance of ATLAS pixel detectors for inner layer replacement

    Energy Technology Data Exchange (ETDEWEB)

    Benoit, M; Lounis, A; Dinu, N [Laboratoire de l' accelerateur lineaire, Orsay (France)], E-mail: Benoit@lal.in2p3.fr

    2009-03-15

    Electric field magnitude and depletion in the bulk of silicon pixel detectors, which influence its breakdown behaviour, was studied using finite-element method to solve the drift-diffusion equation coupled to Poisson's equation in a simplified two dimensional model of the ATLAS pixel sensor. Based on this model, the number of guard rings and dead edges width were modified to investigate their influence on the detector's depletion at the edge and on its internal electrical field distribution. Finally, the 3 level model was implemented into the simulation to study the behaviour of such detector under different level of irradiation.

  12. Studies for the detector control system of the ATLAS pixel at the HL-LHC

    CERN Document Server

    Püllen, L; Boek, J; Kersten, S; Kind, P; Mättig, P; Zeitnitz, C

    2012-01-01

    experiment will be replaced completely. As part of this redesign there will also be a new pixel detector. This new pixel detector requires a control system which meets the strict space requirements for electronics in the ATLAS experiment. To accomplish this goal we propose a DCS (Detector Control System) network with the smallest form factor currently available. This network consists of a DCS chip located in close proximity to the interaction point and a DCS controller located in the outer regions of the ATLAS detector. These two types of chips form a star shaped network with several DCS chips being controlled by one DCS controller. Both chips are manufactured in deep sub-micron technology. We present prototypes with emphasis on studies concerning single event upsets.

  13. Physics performance and upgrade for Run II of the ATLAS pixel detector

    International Nuclear Information System (INIS)

    The ATLAS pixel detector is the innermost detector of the ATLAS experiment at the Large Hadron Collider at CERN, providing high-resolution measurements of charged particle trajectories in the high radiation environment close to the collision region. The operation and performance of the pixel detector during the first years of LHC running are described. More than 96% of the detector modules were operational during this period, with an average intrinsic hit efficiency larger than 99%. The alignment of the detector was found to be stable at the few-micron level over long periods of time. Detector material description, tracking performances in Run I and expectations for the upcoming Run II are presented

  14. The ATLAS Pixel nSQP Readout Chain

    CERN Document Server

    Welch, S; The ATLAS collaboration

    2012-01-01

    Concerns regarding the failure of off detector optical components caused concern that on detector optical components would begin to fail in the same way. Therefor, replacements for the current Pixel Detector Service Quarter Panels have been designed and are under construction. The design challenges of the nSQP project are discussed and an overview of the changes is given. The nSQP project allows a few other upgrades to the current detector which are described. Finally a description of the design validation and testing on the new components is given.

  15. Status of the ATLAS Pixel Detector at the LHC and its performance after three years of operation

    CERN Document Server

    Andreazza, A; The ATLAS collaboration

    2012-01-01

    The ATLAS Pixel Detector is the innermost detector of the ATLAS experiment at the Large Hadron Collider at CERN, providing high-resolution measurements of charged particle tracks in the high radiation environment close to the collision region. This capability is vital for the identification and measurement of proper decay times of long-lived particles such as b-hadrons, and thus vital for the ATLAS physics program. The detector provides hermetic coverage with three cylindrical layers and three layers of forward and backward pixel detectors. It consists of approximately 80 million pixels that are individually read out via chips bump-bonded to 1744 n-in-n silicon substrates. In this talk, results from the successful operation of the Pixel Detector at the LHC and its status after three years of operation will be presented, including monitoring, calibration procedures, timing optimization and detector performance. The detector performance is excellent: ~96 % of the pixels are operational, noise occupancy and hit ...

  16. Radiation-Hard Opto-Link for the Atlas Pixel Detector

    OpenAIRE

    Gan, K. K.

    2004-01-01

    The on-detector optical link of the ATLAS pixel detector contains radiation-hard receiver chips to decode bi-phase marked signals received on PIN arrays and data transmitter chips to drive VCSEL arrays. The components are mounted on hybrid boards (opto-boards). We present results from the opto-boards and from irradiation studies with 24 GeV protons up to 33 Mrad (1.2 x 10^15 p/cm^2).

  17. Robustness of the Artificial Neural Networks Used for Clustering in the ATLAS Pixel Detector

    CERN Document Server

    The ATLAS collaboration

    2015-01-01

    A study of the robustness of the ATLAS pixel neural network clustering algorithm is presented. The sensitivity to variations to its input is evaluated. These variations are motivated by potential discrepancies between data and simulation due to uncertainties in the modelling of pixel clusters in simulation, as well as uncertainties from the detector calibration. Within reasonable variation magnitudes, the neural networks prove to be robust to most variations. The neural network used to identify pixel clusters created by multiple charged particles, is most sensitive to variations affecting the total amount of charge collected in the cluster. Modifying the read-out threshold has the biggest effect on the clustering's ability to estimate the position of the particle's intersection with the detector.

  18. The Layer 1 / Layer 2 readout upgrade for the ATLAS Pixel Detector

    CERN Document Server

    Mullier, Geoffrey; The ATLAS collaboration

    2016-01-01

    The Pixel Detector of the ATLAS experiment has shown excellent performance during the whole Run-1 of the Large Hadron Collider (LHC). The increase of instantaneous luminosity foreseen during the LHC Run 2, will lead to an increased detector occupancy that is expected to saturate the readout links of the outermost layers of the pixel detector: Layers 1 and 2. To ensure a smooth data taking under such conditions, the read out system of the recently installed fourth innermost pixel layer, the Insertable B-Layer, was modified to accomodate the needs of the older detector. The Layer 2 upgrade installation took place during the 2015 winter shutdown, with the Layer 1 installation scheduled for 2016. A report of the successful installation, together with the design of novel dedicated optical to electrical converters and the software and firmware updates will be presented.

  19. The Upgraded Pixel Detector of the ATLAS Experiment for Run-2

    CERN Document Server

    Ferrere, Didier; The ATLAS collaboration

    2016-01-01

    Run-2 of the LHC is providing new challenges to track and vertex reconstruction with higher energies, denser jets and higher rates. Therefore the ATLAS experiment has constructed the first 4-layer Pixel detector in HEP, installing a new Pixel layer, also called Insertable B-Layer (IBL). IBL is a fourth layer of pixel detectors, and has been installed in May 2014 at a radius of 3.3 cm between the existing Pixel Detector and a new smaller radius beam-pipe. The new detector, built to cope with high radiation and expected occupancy, is the first large scale application of 3D detectors and CMOS 130nm technology. In addition the Pixel detector was refurbished with a new service quarter panel to recover about 3% of defective modules lost during run-1 and a new optical readout system to readout the data at higher speed while reducing the occupancy when running with increased luminosity. The commissioning and performance of the 4-layer Pixel Detector, in particular the IBL, will be presented, using collision data.

  20. The Pixel Detector of the ATLAS Experiment for LHC Run-2

    CERN Document Server

    Pernegger, H; The ATLAS collaboration

    2014-01-01

    The Pixel Detector of the ATLAS experiment has shown excellent performance during the whole Run-1 of LHC. Taking advantage of the long showdown, the detector was extracted from the experiment and brought to surface, to equip it with new service quarter panels, to repair modules and to ease installation of the Insertable B-Layer (IBL). IBL is a fourth layer of pixel detectors, and has been installed in May 2014 between the existing Pixel Detector and a new smaller radius beam-pipe at a radius of 3.3 cm. To cope with the high radiation and pixel occupancy due to the proximity to the interaction point, a new read-out chip and two different silicon sensor technologies (planar and 3D) have been developed. Furthermore, the physics performance will be improved through the reduction of pixel size while, targeting for a low material budget, a new mechanical support using lightweight staves and a CO2 based cooling system have been adopted. An overview of the refurbishing of the Pixel Detector and of the IBL project as ...

  1. The Pixel Detector of the ATLAS experiment for the Run2 at the Large Hadron Collider

    CERN Document Server

    Takubo, Yosuke

    2015-01-01

    The Pixel Detector of the ATLAS experiment has shown excellent performance during the whole Run-1 of LHC. Taking advantage of the long showdown, the detector was extracted from the experiment and brought to surface, to equip it with new service quarter panels, to repair modules and to ease installation of the Insertable B-Layer (IBL). IBL is a fourth layer of pixel detectors, and has been installed in May 2014 between the existing Pixel Detector and a new smaller radius beam-pipe at a radius of 3.3 cm. To cope with the high radiation and pixel occupancy due to the proximity to the interaction point, a new read-out chip and two different silicon sensor technologies (planar and 3D) have been developed. Furthermore, the physics performance will be improved through the reduction of pixel size while, targeting for a low material budget, a new mechanical support using lightweight staves and a CO2 based cooling system have been adopted. An overview of the refurbishing of the Pixel Detect or and of the IBL project as...

  2. The ATLAS Pixel Detector for Run II at the Large Hadron Collider

    CERN Document Server

    Marx, Marilyn; The ATLAS collaboration

    2014-01-01

    The Pixel Detector of the ATLAS experiment has shown excellent performance during the whole Run-1 of LHC. Taking advantage of the long showdown, the detector was extracted from the experiment and brought to surface, to equip it with new service quarter panels, to repair modules and to ease installation of the Insertable B-Layer (IBL). IBL is a fourth layer of pixel detectors, and has been installed in May 2014 between the existing Pixel Detector and a new smaller radius beam-pipe at a radius of 3.3 cm. To cope with the high radiation and pixel occupancy due to the proximity to the interaction point, a new read-out chip and two different silicon sensor technologies (planar and 3D) have been developed. Furthermore, the physics performance will be improved through the reduction of pixel size while, targeting for a low material budget, a new mechanical support using lightweight staves and a CO2 based cooling system have been adopted. An overview of the refurbishing of the Pixel Detector and of the IBL project as ...

  3. The upgraded Pixel Detector of the ATLAS experiment for Run-2 at the Large Hadron Collider

    International Nuclear Information System (INIS)

    The Pixel Detector of the ATLAS experiment has shown excellent performance during the whole Run-1 of the Large Hadron Collider (LHC) . Taking advantage of Long Shutdown 1 (LS1) during 2014/2015, the Pixel Detector was brought to surface to equip it with new service panels and to repair modules. The Insertable B-Layer (IBL), a fourth layer of pixel sensors, was installed in-between the existing Pixel Detector and a new beam-pipe at a radius of 3.3 cm. To cope with the high radiation and increased pixel occupancy due to the proximity to the interaction point, two different silicon sensor technologies (planar and 3D) were used and a new readout chip has been designed with CMOS 130 nm technology with larger area, smaller pixel size and faster readout capability. Dedicated design features in combination with a new composite material were considered and used in order to reduce the material budget of the support structure while keeping the optimal thermo-mechanical performance. An overview of the lessons learned during the IBL project is presented, focusing on the challenges and highlighting the issues met during the production, integration, installation and commissioning phases of the detector. Early performance tests using cosmic and beam data are also presented

  4. Study of FPGA and GPU based pixel calibration for ATLAS IBL

    CERN Document Server

    Dopke, J; The ATLAS collaboration; Flick, T; Gabrielli, A; Grosse-Knetter, J; Krieger, N; Kugel, A; Polini, A; Schroer, N

    2010-01-01

    The insertable B-layer (IBL) is a new stage of the ATLAS pixel detector to be installed around 2014. 12 million pixel are attached to new FE-I4 readout ASICs, each controlling 26680 pixel. Compared to the existing FE-I3 based detector the new system features higher readout speed of 160Mbit/s per ASIC and simplified control. For calibration defined charges are applied to all pixels and the resulting time-over-threshold values are evaluated. In the present system multiple sets of two custom VME cards which employ a combination of FPGA and DSP technology are used for I/O interfacing, formatting and processing. The execution time of 51s to perform a threshold scan on a FE-I3 module of 46080 pixel is composed of 8s control, 29s transfer, 7.5s histogramming and 7s analysis. Extrapolating to FE-I4 the times per module of 53760 pixels are 12ms, 5.8s, 9.4s and 8.3s, a total of 23.5s. We present a proposal for a novel approach to the dominant tasks for FE-I4: histogramming and ananlysis. An FPGA-based histogramming uni...

  5. The upgraded Pixel Detector of the ATLAS Experiment for Run2 at the Large Hadron Collider

    CERN Document Server

    Backhaus, Malte; The ATLAS collaboration

    2015-01-01

    Run-2 of the LHC will provide new challenges to track and vertex reconstruction with higher energies, denser jets and higher rates. Therefore the ATLAS experiment has constructed the first 4-layer Pixel detector in HEP, installing a new Pixel layer, also called Insertable B-Layer (IBL). IBL is a fourth layer of pixel detectors, and has been installed in May 2014 at a radius of 3.3 cm between the existing Pixel Detector and a new smaller radius beam-pipe. To cope with the high radiation and pixel occupancy due to the proximity to the interaction point, two different silicon sensor technologies (planar and 3D) have been developed as well as a new read-out chip within CMOS 130nm technology and with larger area, smaller pixel size and faster readout capability. The new detector is the first large scale application of of 3D detectors and CMOS 130nm technology. An overview of the lessons learned during the IBL project will be presented, focusing on the challenges and highlighting the issues met during the productio...

  6. The Pixel Detector of the ATLAS experiment for the Run2 at the Large Hadron Collider

    CERN Document Server

    Takubo, Y; The ATLAS collaboration

    2014-01-01

    The Pixel Detector of the ATLAS experiment has shown excellent performance during the whole Run-1 of LHC. Taking advantage of the long shutdown, the detector was extracted from the experiment and brought to surface, to equip it with new service quarter panels, to repair the modules and to ease installation of the Insertable B-Layer (IBL). The IBL is a fourth layer of pixel detectors, and has been installed in May 2014 between the existing Pixel Detector and a new smaller radius beam-pipe at a radius of 3.3 cm. To cope with the high radiation and pixel occupancy due to the proximity to the interaction point, a new read-out chip and two different silicon sensor technologies (planar and 3D) have been developed. Furthermore, the physics performance will be improved through the reduction of pixel size while, targeting for a low material budget, a new mechanical support using light weight staves and CO$_{2}$ based cooling system have been adopted. An overview of the refurbishing of the Pixel Detector and the IBL pr...

  7. Commissioning of the upgraded ATLAS Pixel Detector for Run2 at LHC

    CERN Document Server

    ATLAS Pixel Collaboration; The ATLAS collaboration

    2015-01-01

    The Pixel Detector of the ATLAS experiment has shown excellent performance during the whole Run-1 of LHC. Taking advantage of the long showdown, the detector was extracted from the experiment and brought to surface, to equip it with new service quarter panels, to repair modules and to ease installation of the Insertable B-Layer (IBL). IBL is a fourth layer of pixel detectors, and has been installed in May 2014 between the existing Pixel Detector and a new smaller radius beam-pipe at a radius of 3.3 cm. To cope with the high radiation and pixel occupancy due to the proximity to the interaction point, a new read-out chip and two different silicon sensor technologies (planar and 3D) have been developed. Furthermore, the physics performance will be improved through the reduction of pixel size while, targeting for a low material budget, a new mechanical support using lightweight staves and a CO2 based cooling system have been adopted. An overview of the refurbishing of the Pixel Detector and of the IBL project as ...

  8. Recent results of the ATLAS upgrade planar pixel sensors R&D project

    Science.gov (United States)

    Weigell, Philipp

    2013-12-01

    To extend the physics reach of the LHC experiments, several upgrades to the accelerator complex are planned, culminating in the HL-LHC, which eventually leads to an increase of the peak luminosity by a factor of five to ten compared to the LHC design value. To cope with the higher occupancy and radiation damage also the LHC experiments will be upgraded. The ATLAS Planar Pixel Sensor R&D Project is an international collaboration of 17 institutions and more than 80 scientists, exploring the feasibility of employing planar pixel sensors for this scenario. Depending on the radius, different pixel concepts are investigated using laboratory and beam test measurements. At small radii the extreme radiation environment and strong space constraints are addressed with very thin pixel sensors active thickness in the range of (75-150) μm, and the development of slim as well as active edges. At larger radii the main challenge is the cost reduction to allow for instrumenting the large area of (7-10) m2. To reach this goal the pixel productions are being transferred to 6 in production lines and more cost-efficient and industrialised interconnection techniques are investigated. Additionally, the n-in-p technology is employed, which requires less production steps since it relies on a single-sided process. An overview of the recent accomplishments obtained within the ATLAS Planar Pixel Sensor R&D Project is given. The performance in terms of charge collection and tracking efficiency, obtained with radioactive sources in the laboratory and at beam tests, is presented for devices built from sensors of different vendors connected to either the present ATLAS read-out chip FE-I3 or the new Insertable B-Layer read-out chip FE-I4. The devices, with a thickness varying between 75 μm and 300 μm, were irradiated to several fluences up to 2×1016 neq/cm2. Finally, the different approaches followed inside the collaboration to achieve slim or active edges for planar pixel sensors are presented.

  9. Spectroscopic measurements with the ATLAS FE-I4 pixel readout chip

    Energy Technology Data Exchange (ETDEWEB)

    Pohl, David-Leon; Janssen, Jens; Hemperek, Tomasz; Huegging, Fabian; Wermes, Norbert [Physikalisches Institut der Univeristaet Bonn (Germany)

    2015-07-01

    The ATLAS FE-I4 pixel readout chip is a large (2 x 2 cm{sup 2}) state of the art ASIC used in high energy physics experiments as well as for research and development purposes. While the FE-I4 is optimized for high hit rates it provides very limited charge resolution. Therefore two methods were developed to obtain high resolution single pixel charge spectra with the ATLAS FE-I4. The first method relies on the ability to change the detection threshold in small steps while counting hits from a particle source and has a resolution limited by electronic noise only. The other method uses a FPGA based time-to-digital-converter to digitize the analog charge signal with high precision. The feasibility, performance and challenges of these methods are discussed. First results of sensor characterizations from radioactive sources and test beams with the ATLAS FE-I4 in view of the charge collection efficiency after irradiation are presented.

  10. Studies on irradiated pixel detectors for the ATLAS IBL and HL-LHC upgrade

    International Nuclear Information System (INIS)

    The constant demand for higher luminosity in high energy physics is the reason for the continuous effort to adapt the accelerators and the experiments. The upgrade program for the experiments and the accelerators at CERN already includes several expansion stages of the Large Hadron Collider (LHC) which will increase the luminosity and the energy of the accelerator. Simultaneously the LHC experiments prepare the individual sub-detectors for the increasing demands in the coming years. Especially the tracking detectors have to cope with fluence levels unprecedented for high energy physics experiments. Correspondingly to the fluence increases the impact of the radiation damage which reduces the life time of the detectors by decreasing the detector performance and efficiency. To cope with this effect new and more radiation hard detector concepts become necessary to extend the life time. This work concentrates on the impact of radiation damage on the pixel sensor technologies to be used in the next upgrade of the ATLAS Pixel Detector as well as for applications in the ATLAS Experiment at HL-LHC conditions. The sensors considered in this work include various designs based on silicon and diamond as sensor material. The investigated designs include a planar silicon pixel design currently used in the ATLAS Experiment as well as a 3D pixel design which uses electrodes penetrating the entire sensor material. The diamond designs implement electrodes similar to the design used by the planar technology with diamond sensors made out of single- and poly-crystalline material. To investigate the sensor properties characterization tests are performed before and after irradiation with protons or neutrons. The measurements are used to determine the interaction between the read-out electronics and the sensors to ensure the signal transfer after irradiation. Further tests focus on the sensor performance itself which includes the analysis of the leakage current behavior and the charge

  11. The Pixel Detector of the ATLAS experiment for the Run2 at the Large Hadron Collider

    CERN Document Server

    Mandelli, B; The ATLAS collaboration

    2014-01-01

    The Pixel Detector of the ATLAS experiment has shown excellent performance during the whole Run-1 of LHC. Taking advantage of the long shutdown, the detector was extracted from the experiment and brought to surface, to equip it with new service quarter panels, to repair modules and to ease installation of the Insertable B-Layer (IBL). IBL is a fourth layer of pixel detectors, and will be installed in May 2014 between the existing Pixel Detector and a new smaller radius beam-pipe at a radius of 3.3 cm. To cope with the high radiation and pixel occupancy due to the proximity to the interaction point, a new read-out chip and two different silicon sensor technologies (planar and 3D) have been developed. Furthermore, the physics performance will be improved through the reduction of pixel size while, targeting for a low material budget, a new mechanical support using lightweight staves and a CO2 based cooling system have been adopted. IBL construction is now completed. An overview of the IBL project as well as the ...

  12. The Pixel Detector of the ATLAS experiment for the Run2 at the Large Hadron Collider

    CERN Document Server

    Oide, H; The ATLAS collaboration

    2014-01-01

    The Pixel Detector of the ATLAS experiment has shown excellent performance during the whole Run-1 of LHC. Taking advantage of the long showdown, the detector was extracted from the experiment and brought to surface, to equip it with new service quarter panels, to repair modules and to ease installation of the Insertable B-Layer (IBL). IBL is a fourth layer of pixel detectors, and will be installed in May 2014 between the existing Pixel Detector and a new smaller radius beam-pipe at a radius of 3.3 cm. To cope with the high radiation and pixel occupancy due to the proximity to the interaction point, a new read-out chip and two different silicon sensor technologies (planar and 3D) have been developed. Furthermore, the physics performance will be improved through the reduction of pixel size while, targeting for a low material budget, a new mechanical support using lightweight staves and a CO2 based cooling system have been adopted. IBL construction is now completed. An overview of the IBL project as well as the ...

  13. The Pixel Detector of the ATLAS experiment for the Run 2 at the Large Hadron Collider

    CERN Document Server

    Oide, H; The ATLAS collaboration

    2014-01-01

    The Pixel Detector of the ATLAS experiment has shown excellent performance during the whole Run 1 of LHC. Taking advantage of the long shutdown, the detector was extracted from the experiment and brought to surface, to equip it with new service quarter panels, to repair modules and to ease installation of the Insertable B-Layer (IBL). The IBL is the fourth layer of the Run 2 Pixel Detector, and it was installed in May 2014 between the existing Pixel Detector and the new smaller-radius beam pipe at a radius of 3.3 cm. To cope with the high radiation and pixel occupancy due to the proximity to the interaction point, a new read-out chip and two different silicon sensor technologies (planar and 3D) have been developed. Furthermore, the physics performance will be improved through the reduction of pixel size while, targeting for a low material budget, a new mechanical support using lightweight staves and a CO2 based cooling system have been adopted. IBL construction is now completed. An overview of the IBL project...

  14. The Pixel Detector of the ATLAS Experiment for LHC Run-2

    CERN Document Server

    Pernegger, Heinz; The ATLAS collaboration

    2015-01-01

    The Pixel Detector of the ATLAS experiment has shown excellent performance during the whole Run-1 of LHC. Taking advantage of the long shutdown, the detector was extracted from the experiment and brought to surface, to equip it with new service quarter panels, to repair modules and to ease installation of the Insertable B-Layer (IBL). IBL is a fourth layer of pixel detectors, and has been installed in May 2014 between the existing Pixel Detector and a new smaller radius beam-pipe at a radius of 3.3 cm. To cope with the high radiation and hit occupancy due to the proximity to the interaction point, a new read-out chip and two different silicon sensor technologies (planar and 3D) have been developed. Furthermore, the physics performance will be improved through the reduction of pixel size while, targeting for a low material budget, a new mechanical support using lightweight staves and a CO2 based cooling system have been adopted. An overview of the refurbishing of the Pixel Detector and of the IBL project as we...

  15. Development of n-in-p pixel modules for the ATLAS Upgrade at HL-LHC

    CERN Document Server

    Macchiolo, Anna; Savic, Natascha; Terzo, Stefano

    2016-01-01

    Thin planar pixel modules are promising candidates to instrument the inner layers of the new ATLAS pixel detector for HL-LHC, thanks to the reduced contribution to the material budget and their high charge collection efficiency after irradiation. 100-200 $\\mu$m thick sensors, interconnected to FE-I4 read-out chips, have been characterized with radioactive sources and beam tests at the CERN-SPS and DESY. The results of these measurements are reported for devices before and after irradiation up to a fluence of $14\\times10^{15}$ n$_{eq}$/cm$^2$. The charge collection and tracking efficiency of the different sensor thicknesses are compared. The outlook for future planar pixel sensor production is discussed, with a focus on sensor design with the pixel pitches (50x50 and 25x100 $\\mu$m$^2$) foreseen for the RD53 Collaboration read-out chip in 65 nm CMOS technology. An optimization of the biasing structures in the pixel cells is required to avoid the hit efficiency loss presently observed in the punch-through region...

  16. Development of n-in-p pixel modules for the ATLAS upgrade at HL-LHC

    CERN Document Server

    Macchiolo, A.; Savic, N.; Terzo, S.

    2016-01-01

    Thin planar pixel modules are promising candidates to instrument the inner layers of the new ATLAS pixel detector for HL-LHC, thanks to the reduced contribution to the material budget and their high charge collection efficiency after irradiation. 100–200 μm thick sensors, interconnected to FE-I4 read-out chips, have been characterized with radioactive sources and beam tests at the CERN-SPS and DESY. The results of these measurements are reported for devices before and after irradiation up to a fluence of 14×1015 neq/cm2. The charge collection and tracking efficiency of the different sensor thicknesses are compared. The outlook for future planar pixel sensor production is discussed, with a focus on sensor design with the pixel pitches (50×50 and 25×100 μm2) foreseen for the RD53 Collaboration read-out chip in 65 nm CMOS technology. An optimization of the biasing structures in the pixel cells is required to avoid the hit efficiency loss presently observed in the punch-through region after irradiation. F...

  17. Recent Results of the ATLAS Upgrade Planar Pixel Sensors R&D Project

    CERN Document Server

    Weigell, Philipp

    2013-01-01

    To cope with the higher occupancy and radiation damage at the HL-LHC also the LHC experiments will be upgraded. The ATLAS Planar Pixel Sensor R&D Project (PPS) is an international collaboration of 17 institutions and more than 80 scientists, exploring the feasibility of employing planar pixel sensors for this scenario. Depending on the radius, different pixel concepts are investigated using laboratory and beam test measurements. At small radii the extreme radiation environment and strong space constraints are addressed with very thin pixel sensors active thickness in the range of (75-150) mum, and the development of slim as well as active edges. At larger radii the main challenge is the cost reduction to allow for instrumenting the large area of (7-10) m^2. To reach this goal the pixel productions are being transferred to 6 inch production lines. Additionally, investigated are more cost-efficient and industrialised interconnection techniques as well as the n-in-p technology, which, being a single-sided pr...

  18. The upgraded Pixel Detector of the ATLAS Experiment for Run2 at the Large Hadron Collider

    CERN Document Server

    Mullier, Geoffrey Andre; The ATLAS collaboration

    2015-01-01

    The Pixel Detector of the ATLAS experiment has shown excellent performance during the whole Run-1 of LHC. Taking advantage of the long showdown, the detector was extracted from the experiment and brought to surface, to equip it with new service quarter panels, to repair modules and to ease installation of the Insertable B-Layer (IBL), a fourth layer of pixel detectors, installed in May 2014 between the existing Pixel Detector and a new smaller radius beam-pipe at a radius of 3.3 cm. To cope with the high radiation and increased pixel occupancy due to the proximity to the interaction point, two different silicon sensor technologies (planar and 3D) have been developed. A new readout chip has been developed within CMOS 130nm technology with larger area, smaller pixel size and faster readout capability. Dedicated design features in combination with a new composite material were considered and used in order to reduce the material budget of the support structure while keeping the optimal thermo-mechanical performan...

  19. High bandwidth pixel detector modules for the ATLAS Insertable B-Layer

    International Nuclear Information System (INIS)

    The investigation of the nature of the recently discovered electro-weak symmetry breaking mechanism of the standard model of particle physics as well as the search for physics beyond the standard model with the LHC require to collect even more data. To achieve this goal, the luminosity of the LHC will be increased in two steps. The increased luminosity results in serious challenges for the inner tracking systems of the experiments at the LHC. The ATLAS pixel detector will also be upgraded in a two stage program. During the shutdown in 2013 and 2014 a fourth hybrid pixel detector layer, the socalled Insertable B-Layer (IBL) is inserted inside the existing pixel detector. This thesis focuses on the characterization, performance measurement, and production quality assurance of the central sensitive elements of the IBL, the modules. This includes a full characterization of the readout chip (FE-I4) and of the assembled modules. A completely new inner tracking system is mandatory in ATLAS after the second luminosity increase in the shutdown of 2022 and 2023. The final chapter of this thesis introduces a new module concept that uses an industrial high voltage CMOS technology as sensor layer, which is capacitively coupled to the FE-I4 readout chip.

  20. High bandwidth pixel detector modules for the ATLAS Insertable B-Layer

    Energy Technology Data Exchange (ETDEWEB)

    Backhaus, Malte

    2014-01-15

    The investigation of the nature of the recently discovered electro-weak symmetry breaking mechanism of the standard model of particle physics as well as the search for physics beyond the standard model with the LHC require to collect even more data. To achieve this goal, the luminosity of the LHC will be increased in two steps. The increased luminosity results in serious challenges for the inner tracking systems of the experiments at the LHC. The ATLAS pixel detector will also be upgraded in a two stage program. During the shutdown in 2013 and 2014 a fourth hybrid pixel detector layer, the socalled Insertable B-Layer (IBL) is inserted inside the existing pixel detector. This thesis focuses on the characterization, performance measurement, and production quality assurance of the central sensitive elements of the IBL, the modules. This includes a full characterization of the readout chip (FE-I4) and of the assembled modules. A completely new inner tracking system is mandatory in ATLAS after the second luminosity increase in the shutdown of 2022 and 2023. The final chapter of this thesis introduces a new module concept that uses an industrial high voltage CMOS technology as sensor layer, which is capacitively coupled to the FE-I4 readout chip.

  1. High bandwidth pixel detector modules for the ATLAS Insertable B-Layer

    CERN Document Server

    Backhaus, Malte

    2014-02-19

    The investigation of the nature of the recently discovered electro-weak symmetry breaking mechanism of the standard model of particle physics as well as the search for physics beyond the standard model with the LHC require to collect even more data. To achieve this goal, the luminosity of the LHC will be increased in two steps. The increased luminosity results in serious challenges for the inner tracking systems of the experiments at the LHC. The ATLAS pixel detector will also be upgraded in a two stage program. During the shutdown in 2013 and 2014 a fourth hybrid pixel detector layer, the so-called Insertable B-Layer (IBL) is inserted inside the existing pixel detector. This thesis focuses on the characterization, performance measurement, and production quality assurance of the central sensitive elements of the IBL, the modules. This includes a full characterization of the readout chip (FE-I4) and of the assembled modules. A completely new inner tracking system is mandatory in ATLAS after the second luminosi...

  2. Simulations of planar pixel sensors for the ATLAS high luminosity upgrade

    CERN Document Server

    Calderini, G; Dinu, N; Lounis, A; Marchiori, G

    2011-01-01

    A physics-based device simulation was used to study the charge carrier distribution and the electric field configuration inside simplified two-dimensional models for pixel layouts based on the ATLAS pixel sensor. In order to study the behavior of such detectors under different levels of irradiation, a three-level defect model was implemented into the simulation. Using these models, the number of guard rings, the dead edge width and the detector thickness were modified to investigate their influence on the detector depletion at the edge and on its internal electric field distribution in order to optimize the layout parameters. Simulations indicate that the number of guard rings can be reduced by a few hundred microns with respect to the layout used for the present ATLAS sensors, with a corresponding extension of the active area of the sensors. A study of the inter-pixel capacitance and of the capacitance between the implants and the high-voltage contact as a function of several parameters affecting the geometr...

  3. 3D silicon pixel detectors for the ATLAS Forward Physics experiment

    CERN Document Server

    Lange, Jörn; Grinstein, Sebastian; Paz, Ivan Lopez

    2015-01-01

    The ATLAS Forward Physics (AFP) project plans to install 3D silicon pixel detectors about 210 m away from the interaction point and very close to the beamline (2-3 mm). This implies the need of slim edges of about 100-200 $\\mu$m width for the sensor side facing the beam to minimise the dead area. Another challenge is an expected non-uniform irradiation of the pixel sensors. It is studied if these requirements can be met using slightly-modified FE-I4 3D pixel sensors from the ATLAS Insertable B-Layer production. AFP-compatible slim edges are obtained with a simple diamond-saw cut. Electrical characterisations and beam tests are carried out and no detrimental impact on the leakage current and hit efficiency is observed. For devices without a 3D guard ring a remaining insensitive edge of less than 15 $\\mu$m width is found. Moreover, 3D detectors are non-uniformly irradiated up to fluences of several 10$^{15}$ n$_{eq}$/cm$^2$ with either a focussed 23 GeV proton beam or a 23 MeV proton beam through holes in Al ma...

  4. A neural network clustering algorithm for the ATLAS silicon pixel detector

    CERN Document Server

    Aad, Georges; Abdallah, Jalal; Abdel Khalek, Samah; Abdinov, Ovsat; Aben, Rosemarie; Abi, Babak; Abolins, Maris; AbouZeid, Ossama; Abramowicz, Halina; Abreu, Henso; Abreu, Ricardo; Abulaiti, Yiming; Acharya, Bobby Samir; Adamczyk, Leszek; Adams, David; Adelman, Jahred; Adomeit, Stefanie; Adye, Tim; Agatonovic-Jovin, Tatjana; Aguilar-Saavedra, Juan Antonio; Agustoni, Marco; Ahlen, Steven; Ahmadov, Faig; Aielli, Giulio; Akerstedt, Henrik; Åkesson, Torsten Paul Ake; Akimoto, Ginga; Akimov, Andrei; Alberghi, Gian Luigi; Albert, Justin; Albrand, Solveig; Alconada Verzini, Maria Josefina; Aleksa, Martin; Aleksandrov, Igor; Alexa, Calin; Alexander, Gideon; Alexandre, Gauthier; Alexopoulos, Theodoros; Alhroob, Muhammad; Alimonti, Gianluca; Alio, Lion; Alison, John; Allbrooke, Benedict; Allison, Lee John; Allport, Phillip; Almond, John; Aloisio, Alberto; Alonso, Alejandro; Alonso, Francisco; Alpigiani, Cristiano; Altheimer, Andrew David; Alvarez Gonzalez, Barbara; Alviggi, Mariagrazia; Amako, Katsuya; Amaral Coutinho, Yara; Amelung, Christoph; Amidei, Dante; Amor Dos Santos, Susana Patricia; Amorim, Antonio; Amoroso, Simone; Amram, Nir; Amundsen, Glenn; Anastopoulos, Christos; Ancu, Lucian Stefan; Andari, Nansi; Andeen, Timothy; Anders, Christoph Falk; Anders, Gabriel; Anderson, Kelby; Andreazza, Attilio; Andrei, George Victor; Anduaga, Xabier; Angelidakis, Stylianos; Angelozzi, Ivan; Anger, Philipp; Angerami, Aaron; Anghinolfi, Francis; Anisenkov, Alexey; Anjos, Nuno; Annovi, Alberto; Antonaki, Ariadni; Antonelli, Mario; Antonov, Alexey; Antos, Jaroslav; Anulli, Fabio; Aoki, Masato; Aperio Bella, Ludovica; Apolle, Rudi; Arabidze, Giorgi; Aracena, Ignacio; Arai, Yasuo; Araque, Juan Pedro; Arce, Ayana; Arguin, Jean-Francois; Argyropoulos, Spyridon; Arik, Metin; Armbruster, Aaron James; Arnaez, Olivier; Arnal, Vanessa; Arnold, Hannah; Arratia, Miguel; Arslan, Ozan; Artamonov, Andrei; Artoni, Giacomo; Asai, Shoji; Asbah, Nedaa; Ashkenazi, Adi; Åsman, Barbro; Asquith, Lily; Assamagan, Ketevi; Astalos, Robert; Atkinson, Markus; Atlay, Naim Bora; Auerbach, Benjamin; Augsten, Kamil; Aurousseau, Mathieu; Avolio, Giuseppe; Azuelos, Georges; Azuma, Yuya; Baak, Max; Baas, Alessandra; Bacci, Cesare; Bachacou, Henri; Bachas, Konstantinos; Backes, Moritz; Backhaus, Malte; Backus Mayes, John; Badescu, Elisabeta; Bagiacchi, Paolo; Bagnaia, Paolo; Bai, Yu; Bain, Travis; Baines, John; Baker, Oliver Keith; Balek, Petr; Balli, Fabrice; Banas, Elzbieta; Banerjee, Swagato; Bannoura, Arwa A E; Bansal, Vikas; Bansil, Hardeep Singh; Barak, Liron; Baranov, Sergei; Barberio, Elisabetta Luigia; Barberis, Dario; Barbero, Marlon; Barillari, Teresa; Barisonzi, Marcello; Barklow, Timothy; Barlow, Nick; Barnett, Bruce; Barnett, Michael; Barnovska, Zuzana; Baroncelli, Antonio; Barone, Gaetano; Barr, Alan; Barreiro, Fernando; Barreiro Guimarães da Costa, João; Bartoldus, Rainer; Barton, Adam Edward; Bartos, Pavol; Bartsch, Valeria; Bassalat, Ahmed; Basye, Austin; Bates, Richard; Batkova, Lucia; Batley, Richard; Battaglia, Marco; Battistin, Michele; Bauer, Florian; Bawa, Harinder Singh; Beau, Tristan; Beauchemin, Pierre-Hugues; Beccherle, Roberto; Bechtle, Philip; Beck, Hans Peter; Becker, Anne Kathrin; Becker, Sebastian; Beckingham, Matthew; Becot, Cyril; Beddall, Andrew; Beddall, Ayda; Bedikian, Sourpouhi; Bednyakov, Vadim; Bee, Christopher; Beemster, Lars; Beermann, Thomas; Begel, Michael; Behr, Katharina; Belanger-Champagne, Camille; Bell, Paul; Bell, William; Bella, Gideon; Bellagamba, Lorenzo; Bellerive, Alain; Bellomo, Massimiliano; Belotskiy, Konstantin; Beltramello, Olga; Benary, Odette; Benchekroun, Driss; Bendtz, Katarina; Benekos, Nektarios; Benhammou, Yan; Benhar Noccioli, Eleonora; Benitez Garcia, Jorge-Armando; Benjamin, Douglas; Bensinger, James; Benslama, Kamal; Bentvelsen, Stan; Berge, David; Bergeaas Kuutmann, Elin; Berger, Nicolas; Berghaus, Frank; Beringer, Jürg; Bernard, Clare; Bernat, Pauline; Bernius, Catrin; Bernlochner, Florian Urs; Berry, Tracey; Berta, Peter; Bertella, Claudia; Bertoli, Gabriele; Bertolucci, Federico; Bertsche, David; Besana, Maria Ilaria; Besjes, Geert-Jan; Bessidskaia, Olga; Bessner, Martin Florian; Besson, Nathalie; Betancourt, Christopher; Bethke, Siegfried; Bhimji, Wahid; Bianchi, Riccardo-Maria; Bianchini, Louis; Bianco, Michele; Biebel, Otmar; Bieniek, Stephen Paul; Bierwagen, Katharina; Biesiada, Jed; Biglietti, Michela; Bilbao De Mendizabal, Javier; Bilokon, Halina; Bindi, Marcello; Binet, Sebastien; Bingul, Ahmet; Bini, Cesare; Black, Curtis; Black, James; Black, Kevin; Blackburn, Daniel; Blair, Robert; Blanchard, Jean-Baptiste; Blazek, Tomas; Bloch, Ingo; Blocker, Craig; Blum, Walter; Blumenschein, Ulrike; Bobbink, Gerjan; Bobrovnikov, Victor; Bocchetta, Simona Serena; Bocci, Andrea; Bock, Christopher; Boddy, Christopher Richard; Boehler, Michael; Boek, Thorsten Tobias; Bogaerts, Joannes Andreas; Bogdanchikov, Alexander; Bogouch, Andrei; Bohm, Christian; Bohm, Jan; Boisvert, Veronique; Bold, Tomasz; Boldea, Venera; Boldyrev, Alexey; Bomben, Marco; Bona, Marcella; Boonekamp, Maarten; Borisov, Anatoly; Borissov, Guennadi; Borri, Marcello; Borroni, Sara; Bortfeldt, Jonathan; Bortolotto, Valerio; Bos, Kors; Boscherini, Davide; Bosman, Martine; Boterenbrood, Hendrik; Boudreau, Joseph; Bouffard, Julian; Bouhova-Thacker, Evelina Vassileva; Boumediene, Djamel Eddine; Bourdarios, Claire; Bousson, Nicolas; Boutouil, Sara; Boveia, Antonio; Boyd, James; Boyko, Igor; Bracinik, Juraj; Brandt, Andrew; Brandt, Gerhard; Brandt, Oleg; Bratzler, Uwe; Brau, Benjamin; Brau, James; Braun, Helmut; Brazzale, Simone Federico; Brelier, Bertrand; Brendlinger, Kurt; Brennan, Amelia Jean; Brenner, Richard; Bressler, Shikma; Bristow, Kieran; Bristow, Timothy Michael; Britton, Dave; Brochu, Frederic; Brock, Ian; Brock, Raymond; Bromberg, Carl; Bronner, Johanna; Brooijmans, Gustaaf; Brooks, Timothy; Brooks, William; Brosamer, Jacquelyn; Brost, Elizabeth; Brown, Jonathan; Bruckman de Renstrom, Pawel; Bruncko, Dusan; Bruneliere, Renaud; Brunet, Sylvie; Bruni, Alessia; Bruni, Graziano; Bruschi, Marco; Bryngemark, Lene; Buanes, Trygve; Buat, Quentin; Bucci, Francesca; Buchholz, Peter; Buckingham, Ryan; Buckley, Andrew; Buda, Stelian Ioan; Budagov, Ioulian; Buehrer, Felix; Bugge, Lars; Bugge, Magnar Kopangen; Bulekov, Oleg; Bundock, Aaron Colin; Burckhart, Helfried; Burdin, Sergey; Burghgrave, Blake; Burke, Stephen; Burmeister, Ingo; Busato, Emmanuel; Büscher, Daniel; Büscher, Volker; Bussey, Peter; Buszello, Claus-Peter; Butler, Bart; Butler, John; Butt, Aatif Imtiaz; Buttar, Craig; Butterworth, Jonathan; Butti, Pierfrancesco; Buttinger, William; Buzatu, Adrian; Byszewski, Marcin; Cabrera Urbán, Susana; Caforio, Davide; Cakir, Orhan; Calafiura, Paolo; Calandri, Alessandro; Calderini, Giovanni; Calfayan, Philippe; Calkins, Robert; Caloba, Luiz; Calvet, David; Calvet, Samuel; Camacho Toro, Reina; Camarda, Stefano; Cameron, David; Caminada, Lea Michaela; Caminal Armadans, Roger; Campana, Simone; Campanelli, Mario; Campoverde, Angel; Canale, Vincenzo; Canepa, Anadi; Cano Bret, Marc; Cantero, Josu; Cantrill, Robert; Cao, Tingting; Capeans Garrido, Maria Del Mar; Caprini, Irinel; Caprini, Mihai; Capua, Marcella; Caputo, Regina; Cardarelli, Roberto; Carli, Tancredi; Carlino, Gianpaolo; Carminati, Leonardo; Caron, Sascha; Carquin, Edson; Carrillo-Montoya, German D; Carter, Janet; Carvalho, João; Casadei, Diego; Casado, Maria Pilar; Casolino, Mirkoantonio; Castaneda-Miranda, Elizabeth; Castelli, Angelantonio; Castillo Gimenez, Victoria; Castro, Nuno Filipe; Catastini, Pierluigi; Catinaccio, Andrea; Catmore, James; Cattai, Ariella; Cattani, Giordano; Caughron, Seth; Cavaliere, Viviana; Cavalli, Donatella; Cavalli-Sforza, Matteo; Cavasinni, Vincenzo; Ceradini, Filippo; Cerio, Benjamin; Cerny, Karel; Cerqueira, Augusto Santiago; Cerri, Alessandro; Cerrito, Lucio; Cerutti, Fabio; Cerv, Matevz; Cervelli, Alberto; Cetin, Serkant Ali; Chafaq, Aziz; Chakraborty, Dhiman; Chalupkova, Ina; Chang, Philip; Chapleau, Bertrand; Chapman, John Derek; Charfeddine, Driss; Charlton, Dave; Chau, Chav Chhiv; Chavez Barajas, Carlos Alberto; Cheatham, Susan; Chegwidden, Andrew; Chekanov, Sergei; Chekulaev, Sergey; Chelkov, Gueorgui; Chelstowska, Magda Anna; Chen, Chunhui; Chen, Hucheng; Chen, Karen; Chen, Liming; Chen, Shenjian; Chen, Xin; Chen, Yujiao; Cheng, Hok Chuen; Cheng, Yangyang; Cheplakov, Alexander; Cherkaoui El Moursli, Rajaa; Chernyatin, Valeriy; Cheu, Elliott; Chevalier, Laurent; Chiarella, Vitaliano; Chiefari, Giovanni; Childers, John Taylor; Chilingarov, Alexandre; Chiodini, Gabriele; Chisholm, Andrew; Chislett, Rebecca Thalatta; Chitan, Adrian; Chizhov, Mihail; Chouridou, Sofia; Chow, Bonnie Kar Bo; Chromek-Burckhart, Doris; Chu, Ming-Lee; Chudoba, Jiri; Chwastowski, Janusz; Chytka, Ladislav; Ciapetti, Guido; Ciftci, Abbas Kenan; Ciftci, Rena; Cinca, Diane; Cindro, Vladimir; Ciocio, Alessandra; Cirkovic, Predrag; Citron, Zvi Hirsh; Citterio, Mauro; Ciubancan, Mihai; Clark, Allan G; Clark, Philip James; Clarke, Robert; Cleland, Bill; Clemens, Jean-Claude; Clement, Christophe; Coadou, Yann; Cobal, Marina; Coccaro, Andrea; Cochran, James H; Coffey, Laurel; Cogan, Joshua Godfrey; Coggeshall, James; Cole, Brian; Cole, Stephen; Colijn, Auke-Pieter; Collot, Johann; Colombo, Tommaso; Colon, German; Compostella, Gabriele; Conde Muiño, Patricia; Coniavitis, Elias; Conidi, Maria Chiara; Connell, Simon Henry; Connelly, Ian; Consonni, Sofia Maria; Consorti, Valerio; Constantinescu, Serban; Conta, Claudio; Conti, Geraldine; Conventi, Francesco; Cooke, Mark; Cooper, Ben; Cooper-Sarkar, Amanda; Cooper-Smith, Neil; Copic, Katherine; Cornelissen, Thijs; Corradi, Massimo; Corriveau, Francois; Corso-Radu, Alina; Cortes-Gonzalez, Arely; Cortiana, Giorgio; Costa, Giuseppe; Costa, María José; Costanzo, Davide; Côté, David; Cottin, Giovanna; Cowan, Glen; Cox, Brian; Cranmer, Kyle; Cree, Graham; Crépé-Renaudin, Sabine; Crescioli, Francesco; Cribbs, Wayne Allen; Crispin Ortuzar, Mireia; Cristinziani, Markus; Croft, Vince; Crosetti, Giovanni; Cuciuc, Constantin-Mihai; Cuhadar Donszelmann, Tulay; Cummings, Jane; Curatolo, Maria; Cuthbert, Cameron; Czirr, Hendrik; Czodrowski, Patrick; Czyczula, Zofia; D'Auria, Saverio; D'Onofrio, Monica; Da Cunha Sargedas De Sousa, Mario Jose; Da Via, Cinzia; Dabrowski, Wladyslaw; Dafinca, Alexandru; Dai, Tiesheng; Dale, Orjan; Dallaire, Frederick; Dallapiccola, Carlo; Dam, Mogens; Daniells, Andrew Christopher; Dano Hoffmann, Maria; Dao, Valerio; Darbo, Giovanni; Darmora, Smita; Dassoulas, James; Dattagupta, Aparajita; Davey, Will; David, Claire; Davidek, Tomas; Davies, Eleanor; Davies, Merlin; Davignon, Olivier; Davison, Adam; Davison, Peter; Davygora, Yuriy; Dawe, Edmund; Dawson, Ian; Daya-Ishmukhametova, Rozmin; De, Kaushik; de Asmundis, Riccardo; De Castro, Stefano; De Cecco, Sandro; De Groot, Nicolo; de Jong, Paul; De la Torre, Hector; De Lorenzi, Francesco; De Nooij, Lucie; De Pedis, Daniele; De Salvo, Alessandro; De Sanctis, Umberto; De Santo, Antonella; De Vivie De Regie, Jean-Baptiste; Dearnaley, William James; Debbe, Ramiro; Debenedetti, Chiara; Dechenaux, Benjamin; Dedovich, Dmitri; Deigaard, Ingrid; Del Peso, Jose; Del Prete, Tarcisio; Deliot, Frederic; Delitzsch, Chris Malena; Deliyergiyev, Maksym; Dell'Acqua, Andrea; Dell'Asta, Lidia; Dell'Orso, Mauro; Della Pietra, Massimo; della Volpe, Domenico; Delmastro, Marco; Delsart, Pierre-Antoine; Deluca, Carolina; Demers, Sarah; Demichev, Mikhail; Demilly, Aurelien; Denisov, Sergey; Derendarz, Dominik; Derkaoui, Jamal Eddine; Derue, Frederic; Dervan, Paul; Desch, Klaus Kurt; Deterre, Cecile; Deviveiros, Pier-Olivier; Dewhurst, Alastair; Dhaliwal, Saminder; Di Ciaccio, Anna; Di Ciaccio, Lucia; Di Domenico, Antonio; Di Donato, Camilla; Di Girolamo, Alessandro; Di Girolamo, Beniamino; Di Mattia, Alessandro; Di Micco, Biagio; Di Nardo, Roberto; Di Simone, Andrea; Di Sipio, Riccardo; Di Valentino, David; Dias, Flavia; Diaz, Marco Aurelio; Diehl, Edward; Dietrich, Janet; Dietzsch, Thorsten; Diglio, Sara; Dimitrievska, Aleksandra; Dingfelder, Jochen; Dionisi, Carlo; Dita, Petre; Dita, Sanda; Dittus, Fridolin; Djama, Fares; Djobava, Tamar; do Vale, Maria Aline Barros; Do Valle Wemans, André; Doan, Thi Kieu Oanh; Dobos, Daniel; Doglioni, Caterina; Doherty, Tom; Dohmae, Takeshi; Dolejsi, Jiri; Dolezal, Zdenek; Dolgoshein, Boris; Donadelli, Marisilvia; Donati, Simone; Dondero, Paolo; Donini, Julien; Dopke, Jens; Doria, Alessandra; Dova, Maria-Teresa; Doyle, Tony; Dris, Manolis; Dubbert, Jörg; Dube, Sourabh; Dubreuil, Emmanuelle; Duchovni, Ehud; Duckeck, Guenter; Ducu, Otilia Anamaria; Duda, Dominik; Dudarev, Alexey; Dudziak, Fanny; Duflot, Laurent; Duguid, Liam; Dührssen, Michael; Dunford, Monica; Duran Yildiz, Hatice; Düren, Michael; Durglishvili, Archil; Dwuznik, Michal; Dyndal, Mateusz; Ebke, Johannes; Edson, William; Edwards, Nicholas Charles; Ehrenfeld, Wolfgang; Eifert, Till; Eigen, Gerald; Einsweiler, Kevin; Ekelof, Tord; El Kacimi, Mohamed; Ellert, Mattias; Elles, Sabine; Ellinghaus, Frank; Ellis, Nicolas; Elmsheuser, Johannes; Elsing, Markus; Emeliyanov, Dmitry; Enari, Yuji; Endner, Oliver Chris; Endo, Masaki; Engelmann, Roderich; Erdmann, Johannes; Ereditato, Antonio; Eriksson, Daniel; Ernis, Gunar; Ernst, Jesse; Ernst, Michael; Ernwein, Jean; Errede, Deborah; Errede, Steven; Ertel, Eugen; Escalier, Marc; Esch, Hendrik; Escobar, Carlos; Esposito, Bellisario; Etienvre, Anne-Isabelle; Etzion, Erez; Evans, Hal; Ezhilov, Alexey; Fabbri, Laura; Facini, Gabriel; Fakhrutdinov, Rinat; Falciano, Speranza; Falla, Rebecca Jane; Faltova, Jana; Fang, Yaquan; Fanti, Marcello; Farbin, Amir; Farilla, Addolorata; Farooque, Trisha; Farrell, Steven; Farrington, Sinead; Farthouat, Philippe; Fassi, Farida; Fassnacht, Patrick; Fassouliotis, Dimitrios; Favareto, Andrea; Fayard, Louis; Federic, Pavol; Fedin, Oleg; Fedorko, Wojciech; Fehling-Kaschek, Mirjam; Feigl, Simon; Feligioni, Lorenzo; Feng, Cunfeng; Feng, Eric; Feng, Haolu; Fenyuk, Alexander; Fernandez Perez, Sonia; Ferrag, Samir; Ferrando, James; Ferrari, Arnaud; Ferrari, Pamela; Ferrari, Roberto; Ferreira de Lima, Danilo Enoque; Ferrer, Antonio; Ferrere, Didier; Ferretti, Claudio; Ferretto Parodi, Andrea; Fiascaris, Maria; Fiedler, Frank; Filipčič, Andrej; Filipuzzi, Marco; Filthaut, Frank; Fincke-Keeler, Margret; Finelli, Kevin Daniel; Fiolhais, Miguel; Fiorini, Luca; Firan, Ana; Fischer, Adam; Fischer, Julia; Fisher, Wade Cameron; Fitzgerald, Eric Andrew; Flechl, Martin; Fleck, Ivor; Fleischmann, Philipp; Fleischmann, Sebastian; Fletcher, Gareth Thomas; Fletcher, Gregory; Flick, Tobias; Floderus, Anders; Flores Castillo, Luis; Florez Bustos, Andres Carlos; Flowerdew, Michael; Formica, Andrea; Forti, Alessandra; Fortin, Dominique; Fournier, Daniel; Fox, Harald; Fracchia, Silvia; Francavilla, Paolo; Franchini, Matteo; Franchino, Silvia; Francis, David; Franklin, Melissa; Franz, Sebastien; Fraternali, Marco; French, Sky; Friedrich, Conrad; Friedrich, Felix; Froidevaux, Daniel; Frost, James; Fukunaga, Chikara; Fullana Torregrosa, Esteban; Fulsom, Bryan Gregory; Fuster, Juan; Gabaldon, Carolina; Gabizon, Ofir; Gabrielli, Alessandro; Gabrielli, Andrea; Gadatsch, Stefan; Gadomski, Szymon; Gagliardi, Guido; Gagnon, Pauline; Galea, Cristina; Galhardo, Bruno; Gallas, Elizabeth; Gallo, Valentina Santina; Gallop, Bruce; Gallus, Petr; Galster, Gorm Aske Gram Krohn; Gan, KK; Gandrajula, Reddy Pratap; Gao, Jun; Gao, Yongsheng; Garay Walls, Francisca; Garberson, Ford; García, Carmen; García Navarro, José Enrique; Garcia-Sciveres, Maurice; Gardner, Robert; Garelli, Nicoletta; Garonne, Vincent; Gatti, Claudio; Gaudio, Gabriella; Gaur, Bakul; Gauthier, Lea; Gauzzi, Paolo; Gavrilenko, Igor; Gay, Colin; Gaycken, Goetz; Gazis, Evangelos; Ge, Peng; Gecse, Zoltan; Gee, Norman; Geerts, Daniël Alphonsus Adrianus; Geich-Gimbel, Christoph; Gellerstedt, Karl; Gemme, Claudia; Gemmell, Alistair; Genest, Marie-Hélène; Gentile, Simonetta; George, Matthias; George, Simon; Gerbaudo, Davide; Gershon, Avi; Ghazlane, Hamid; Ghodbane, Nabil; Giacobbe, Benedetto; Giagu, Stefano; Giangiobbe, Vincent; Giannetti, Paola; Gianotti, Fabiola; Gibbard, Bruce; Gibson, Stephen; Gilchriese, Murdock; Gillam, Thomas; Gillberg, Dag; Gilles, Geoffrey; Gingrich, Douglas; Giokaris, Nikos; Giordani, MarioPaolo; Giordano, Raffaele; Giorgi, Filippo Maria; Giorgi, Francesco Michelangelo; Giraud, Pierre-Francois; Giugni, Danilo; Giuliani, Claudia; Giulini, Maddalena; Gjelsten, Børge Kile; Gkaitatzis, Stamatios; Gkialas, Ioannis; Gladilin, Leonid; Glasman, Claudia; Glatzer, Julian; Glaysher, Paul; Glazov, Alexandre; Glonti, George; Goblirsch-Kolb, Maximilian; Goddard, Jack Robert; Godfrey, Jennifer; Godlewski, Jan; Goeringer, Christian; Goldfarb, Steven; Golling, Tobias; Golubkov, Dmitry; Gomes, Agostinho; Gomez Fajardo, Luz Stella; Gonçalo, Ricardo; Goncalves Pinto Firmino Da Costa, Joao; Gonella, Laura; González de la Hoz, Santiago; Gonzalez Parra, Garoe; Gonzalez-Sevilla, Sergio; Goossens, Luc; Gorbounov, Petr Andreevich; Gordon, Howard; Gorelov, Igor; Gorini, Benedetto; Gorini, Edoardo; Gorišek, Andrej; Gornicki, Edward; Goshaw, Alfred; Gössling, Claus; Gostkin, Mikhail Ivanovitch; Gouighri, Mohamed; Goujdami, Driss; Goulette, Marc Phillippe; Goussiou, Anna; Goy, Corinne; Gozpinar, Serdar; Grabas, Herve Marie Xavier; Graber, Lars; Grabowska-Bold, Iwona; Grafström, Per; Grahn, Karl-Johan; Gramling, Johanna; Gramstad, Eirik; Grancagnolo, Sergio; Grassi, Valerio; Gratchev, Vadim; Gray, Heather; Graziani, Enrico; Grebenyuk, Oleg; Greenwood, Zeno Dixon; Gregersen, Kristian; Gregor, Ingrid-Maria; Grenier, Philippe; Griffiths, Justin; Grillo, Alexander; Grimm, Kathryn; Grinstein, Sebastian; Gris, Philippe Luc Yves; Grishkevich, Yaroslav; Grivaz, Jean-Francois; Grohs, Johannes Philipp; Grohsjean, Alexander; Gross, Eilam; Grosse-Knetter, Joern; Grossi, Giulio Cornelio; Groth-Jensen, Jacob; Grout, Zara Jane; Guan, Liang; Guescini, Francesco; Guest, Daniel; Gueta, Orel; Guicheney, Christophe; Guido, Elisa; Guillemin, Thibault; Guindon, Stefan; Gul, Umar; Gumpert, Christian; Gunther, Jaroslav; Guo, Jun; Gupta, Shaun; Gutierrez, Phillip; Gutierrez Ortiz, Nicolas Gilberto; Gutschow, Christian; Guttman, Nir; Guyot, Claude; Gwenlan, Claire; Gwilliam, Carl; Haas, Andy; Haber, Carl; Hadavand, Haleh Khani; Haddad, Nacim; Haefner, Petra; Hageböck, Stephan; Hajduk, Zbigniew; Hakobyan, Hrachya; Haleem, Mahsana; Hall, David; Halladjian, Garabed; Hamacher, Klaus; Hamal, Petr; Hamano, Kenji; Hamer, Matthias; Hamilton, Andrew; Hamilton, Samuel; Hamnett, Phillip George; Han, Liang; Hanagaki, Kazunori; Hanawa, Keita; Hance, Michael; Hanke, Paul; Hanna, Remie; Hansen, Jørgen Beck; Hansen, Jorn Dines; Hansen, Peter Henrik; Hara, Kazuhiko; Hard, Andrew; Harenberg, Torsten; Hariri, Faten; Harkusha, Siarhei; Harper, Devin; Harrington, Robert; Harris, Orin; Harrison, Paul Fraser; Hartjes, Fred; Hasegawa, Satoshi; Hasegawa, Yoji; Hasib, A; Hassani, Samira; Haug, Sigve; Hauschild, Michael; Hauser, Reiner; Havranek, Miroslav; Hawkes, Christopher; Hawkings, Richard John; Hawkins, Anthony David; Hayashi, Takayasu; Hayden, Daniel; Hays, Chris; Hayward, Helen; Haywood, Stephen; Head, Simon; Heck, Tobias; Hedberg, Vincent; Heelan, Louise; Heim, Sarah; Heim, Timon; Heinemann, Beate; Heinrich, Lukas; Hejbal, Jiri; Helary, Louis; Heller, Claudio; Heller, Matthieu; Hellman, Sten; Hellmich, Dennis; Helsens, Clement; Henderson, James; Henderson, Robert; Heng, Yang; Hengler, Christopher; Henrichs, Anna; Henriques Correia, Ana Maria; Henrot-Versille, Sophie; Hensel, Carsten; Herbert, Geoffrey Henry; Hernández Jiménez, Yesenia; Herrberg-Schubert, Ruth; Herten, Gregor; Hertenberger, Ralf; Hervas, Luis; Hesketh, Gavin Grant; Hessey, Nigel; Hickling, Robert; Higón-Rodriguez, Emilio; Hill, Ewan; Hill, John; Hiller, Karl Heinz; Hillert, Sonja; Hillier, Stephen; Hinchliffe, Ian; Hines, Elizabeth; Hirose, Minoru; Hirschbuehl, Dominic; Hobbs, John; Hod, Noam; Hodgkinson, Mark; Hodgson, Paul; Hoecker, Andreas; Hoeferkamp, Martin; Hoffman, Julia; Hoffmann, Dirk; Hofmann, Julia Isabell; Hohlfeld, Marc; Holmes, Tova Ray; Hong, Tae Min; Hooft van Huysduynen, Loek; Hostachy, Jean-Yves; Hou, Suen; Hoummada, Abdeslam; Howard, Jacob; Howarth, James; Hrabovsky, Miroslav; Hristova, Ivana; Hrivnac, Julius; Hryn'ova, Tetiana; Hsu, Catherine; Hsu, Pai-hsien Jennifer; Hsu, Shih-Chieh; Hu, Diedi; Hu, Xueye; Huang, Yanping; Hubacek, Zdenek; Hubaut, Fabrice; Huegging, Fabian; Huffman, Todd Brian; Hughes, Emlyn; Hughes, Gareth; Huhtinen, Mika; Hülsing, Tobias Alexander; Hurwitz, Martina; Huseynov, Nazim; Huston, Joey; Huth, John; Iacobucci, Giuseppe; Iakovidis, Georgios; Ibragimov, Iskander; Iconomidou-Fayard, Lydia; Ideal, Emma; Iengo, Paolo; Igonkina, Olga; Iizawa, Tomoya; Ikegami, Yoichi; Ikematsu, Katsumasa; Ikeno, Masahiro; Ilchenko, Iurii; Iliadis, Dimitrios; Ilic, Nikolina; Inamaru, Yuki; Ince, Tayfun; Ioannou, Pavlos; Iodice, Mauro; Iordanidou, Kalliopi; Ippolito, Valerio; Irles Quiles, Adrian; Isaksson, Charlie; Ishino, Masaya; Ishitsuka, Masaki; Ishmukhametov, Renat; Issever, Cigdem; Istin, Serhat; Iturbe Ponce, Julia Mariana; Iuppa, Roberto; Ivarsson, Jenny; Iwanski, Wieslaw; Iwasaki, Hiroyuki; Izen, Joseph; Izzo, Vincenzo; Jackson, Brett; Jackson, Matthew; Jackson, Paul; Jaekel, Martin; Jain, Vivek; Jakobs, Karl; Jakobsen, Sune; Jakoubek, Tomas; Jakubek, Jan; Jamin, David Olivier; Jana, Dilip; Jansen, Eric; Jansen, Hendrik; Janssen, Jens; Janus, Michel; Jarlskog, Göran; Javadov, Namig; Javůrek, Tomáš; Jeanty, Laura; Jejelava, Juansher; Jeng, Geng-yuan; Jennens, David; Jenni, Peter; Jentzsch, Jennifer; Jeske, Carl; Jézéquel, Stéphane; Ji, Haoshuang; Ji, Weina; Jia, Jiangyong; Jiang, Yi; Jimenez Belenguer, Marcos; Jin, Shan; Jinaru, Adam; Jinnouchi, Osamu; Joergensen, Morten Dam; Johansson, Erik; Johansson, Per; Johns, Kenneth; Jon-And, Kerstin; Jones, Graham; Jones, Roger; Jones, Tim; Jongmanns, Jan; Jorge, Pedro; Joshi, Kiran Daniel; Jovicevic, Jelena; Ju, Xiangyang; Jung, Christian; Jungst, Ralph Markus; Jussel, Patrick; Juste Rozas, Aurelio; Kaci, Mohammed; Kaczmarska, Anna; Kado, Marumi; Kagan, Harris; Kagan, Michael; Kajomovitz, Enrique; Kalderon, Charles William; Kama, Sami; Kamenshchikov, Andrey; Kanaya, Naoko; Kaneda, Michiru; Kaneti, Steven; Kantserov, Vadim; Kanzaki, Junichi; Kaplan, Benjamin; Kapliy, Anton; Kar, Deepak; Karakostas, Konstantinos; Karastathis, Nikolaos; Karnevskiy, Mikhail; Karpov, Sergey; Karpova, Zoya; Karthik, Krishnaiyengar; Kartvelishvili, Vakhtang; Karyukhin, Andrey; Kashif, Lashkar; Kasieczka, Gregor; Kass, Richard; Kastanas, Alex; Kataoka, Yousuke; Katre, Akshay; Katzy, Judith; Kaushik, Venkatesh; Kawagoe, Kiyotomo; Kawamoto, Tatsuo; Kawamura, Gen; Kazama, Shingo; Kazanin, Vassili; Kazarinov, Makhail; Keeler, Richard; Kehoe, Robert; Keil, Markus; Keller, John; Kempster, Jacob Julian; Keoshkerian, Houry; Kepka, Oldrich; Kerševan, Borut Paul; Kersten, Susanne; Kessoku, Kohei; Keung, Justin; Khalil-zada, Farkhad; Khandanyan, Hovhannes; Khanov, Alexander; Khodinov, Alexander; Khomich, Andrei; Khoo, Teng Jian; Khoriauli, Gia; Khoroshilov, Andrey; Khovanskiy, Valery; Khramov, Evgeniy; Khubua, Jemal; Kim, Hee Yeun; Kim, Hyeon Jin; Kim, Shinhong; Kimura, Naoki; Kind, Oliver; King, Barry; King, Matthew; King, Robert Steven Beaufoy; King, Samuel Burton; Kirk, Julie; Kiryunin, Andrey; Kishimoto, Tomoe; Kisielewska, Danuta; Kiss, Florian; Kittelmann, Thomas; Kiuchi, Kenji; Kladiva, Eduard; Klein, Max; Klein, Uta; Kleinknecht, Konrad; Klimek, Pawel; Klimentov, Alexei; Klingenberg, Reiner; Klinger, Joel Alexander; Klioutchnikova, Tatiana; Klok, Peter; Kluge, Eike-Erik; Kluit, Peter; Kluth, Stefan; Kneringer, Emmerich; Knoops, Edith; Knue, Andrea; Kobayashi, Dai; Kobayashi, Tomio; Kobel, Michael; Kocian, Martin; Kodys, Peter; Koevesarki, Peter; Koffas, Thomas; Koffeman, Els; Kogan, Lucy Anne; Kohlmann, Simon; Kohout, Zdenek; Kohriki, Takashi; Koi, Tatsumi; Kolanoski, Hermann; Koletsou, Iro; Koll, James; Komar, Aston; Komori, Yuto; Kondo, Takahiko; Kondrashova, Nataliia; Köneke, Karsten; König, Adriaan; König, Sebastian; Kono, Takanori; Konoplich, Rostislav; Konstantinidis, Nikolaos; Kopeliansky, Revital; Koperny, Stefan; Köpke, Lutz; Kopp, Anna Katharina; Korcyl, Krzysztof; Kordas, Kostantinos; Korn, Andreas; Korol, Aleksandr; Korolkov, Ilya; Korolkova, Elena; Korotkov, Vladislav; Kortner, Oliver; Kortner, Sandra; Kostyukhin, Vadim; Kotov, Vladislav; Kotwal, Ashutosh; Kourkoumelis, Christine; Kouskoura, Vasiliki; Koutsman, Alex; Kowalewski, Robert Victor; Kowalski, Tadeusz; Kozanecki, Witold; Kozhin, Anatoly; Kral, Vlastimil; Kramarenko, Viktor; Kramberger, Gregor; Krasnopevtsev, Dimitriy; Krasny, Mieczyslaw Witold; Krasznahorkay, Attila; Kraus, Jana; Kravchenko, Anton; Kreiss, Sven; Kretz, Moritz; Kretzschmar, Jan; Kreutzfeldt, Kristof; Krieger, Peter; Kroeninger, Kevin; Kroha, Hubert; Kroll, Joe; Kroseberg, Juergen; Krstic, Jelena; Kruchonak, Uladzimir; Krüger, Hans; Kruker, Tobias; Krumnack, Nils; Krumshteyn, Zinovii; Kruse, Amanda; Kruse, Mark; Kruskal, Michael; Kubota, Takashi; Kuday, Sinan; Kuehn, Susanne; Kugel, Andreas; Kuhl, Andrew; Kuhl, Thorsten; Kukhtin, Victor; Kulchitsky, Yuri; Kuleshov, Sergey; Kuna, Marine; Kunkle, Joshua; Kupco, Alexander; Kurashige, Hisaya; Kurochkin, Yurii; Kurumida, Rie; Kus, Vlastimil; Kuwertz, Emma Sian; Kuze, Masahiro; Kvita, Jiri; La Rosa, Alessandro; La Rotonda, Laura; Lacasta, Carlos; Lacava, Francesco; Lacey, James; Lacker, Heiko; Lacour, Didier; Lacuesta, Vicente Ramón; Ladygin, Evgueni; Lafaye, Remi; Laforge, Bertrand; Lagouri, Theodota; Lai, Stanley; Laier, Heiko; Lambourne, Luke; Lammers, Sabine; Lampen, Caleb; Lampl, Walter; Lançon, Eric; Landgraf, Ulrich; Landon, Murrough; Lang, Valerie Susanne; Lankford, Andrew; Lanni, Francesco; Lantzsch, Kerstin; Laplace, Sandrine; Lapoire, Cecile; Laporte, Jean-Francois; Lari, Tommaso; Lassnig, Mario; Laurelli, Paolo; Lavrijsen, Wim; Law, Alexander; Laycock, Paul; Le, Bao Tran; Le Dortz, Olivier; Le Guirriec, Emmanuel; Le Menedeu, Eve; LeCompte, Thomas; Ledroit-Guillon, Fabienne Agnes Marie; Lee, Claire, Alexandra; Lee, Hurng-Chun; Lee, Jason; Lee, Shih-Chang; Lee, Lawrence; Lefebvre, Guillaume; Lefebvre, Michel; Legger, Federica; Leggett, Charles; Lehan, Allan; Lehmacher, Marc; Lehmann Miotto, Giovanna; Lei, Xiaowen; Leight, William Axel; Leisos, Antonios; Leister, Andrew Gerard; Leite, Marco Aurelio Lisboa; Leitner, Rupert; Lellouch, Daniel; Lemmer, Boris; Leney, Katharine; Lenz, Tatjana; Lenzen, Georg; Lenzi, Bruno; Leone, Robert; Leone, Sandra; Leonhardt, Kathrin; Leonidopoulos, Christos; Leontsinis, Stefanos; Leroy, Claude; Lester, Christopher; Lester, Christopher Michael; Levchenko, Mikhail; Levêque, Jessica; Levin, Daniel; Levinson, Lorne; Levy, Mark; Lewis, Adrian; Lewis, George; Leyko, Agnieszka; Leyton, Michael; Li, Bing; Li, Bo; Li, Haifeng; Li, Ho Ling; Li, Lei; Li, Liang; Li, Shu; Li, Yichen; Liang, Zhijun; Liao, Hongbo; Liberti, Barbara; Lichard, Peter; Lie, Ki; Liebal, Jessica; Liebig, Wolfgang; Limbach, Christian; Limosani, Antonio; Lin, Simon; Lin, Tai-Hua; Linde, Frank; Lindquist, Brian Edward; Linnemann, James; Lipeles, Elliot; Lipniacka, Anna; Lisovyi, Mykhailo; Liss, Tony; Lissauer, David; Lister, Alison; Litke, Alan; Liu, Bo; Liu, Dong; Liu, Jianbei; Liu, Kun; Liu, Lulu; Liu, Miaoyuan; Liu, Minghui; Liu, Yanwen; Livan, Michele; Livermore, Sarah; Lleres, Annick; Llorente Merino, Javier; Lloyd, Stephen; Lo Sterzo, Francesco; Lobodzinska, Ewelina; Loch, Peter; Lockman, William; Loddenkoetter, Thomas; Loebinger, Fred; Loevschall-Jensen, Ask Emil; Loginov, Andrey; Loh, Chang Wei; Lohse, Thomas; Lohwasser, Kristin; Lokajicek, Milos; Lombardo, Vincenzo Paolo; Long, Brian Alexander; Long, Jonathan; Long, Robin Eamonn; Lopes, Lourenco; Lopez Mateos, David; Lopez Paredes, Brais; Lopez Paz, Ivan; Lorenz, Jeanette; Lorenzo Martinez, Narei; Losada, Marta; Loscutoff, Peter; Lou, XinChou; Lounis, Abdenour; Love, Jeremy; Love, Peter; Lowe, Andrew; Lu, Feng; Lubatti, Henry; Luci, Claudio; Lucotte, Arnaud; Luehring, Frederick; Lukas, Wolfgang; Luminari, Lamberto; Lundberg, Olof; Lund-Jensen, Bengt; Lungwitz, Matthias; Lynn, David; Lysak, Roman; Lytken, Else; Ma, Hong; Ma, Lian Liang; Maccarrone, Giovanni; Macchiolo, Anna; Machado Miguens, Joana; Macina, Daniela; Madaffari, Daniele; Madar, Romain; Maddocks, Harvey Jonathan; Mader, Wolfgang; Madsen, Alexander; Maeno, Mayuko; Maeno, Tadashi; Magradze, Erekle; Mahboubi, Kambiz; Mahlstedt, Joern; Mahmoud, Sara; Maiani, Camilla; Maidantchik, Carmen; Maier, Andreas Alexander; Maio, Amélia; Majewski, Stephanie; Makida, Yasuhiro; Makovec, Nikola; Mal, Prolay; Malaescu, Bogdan; Malecki, Pawel; Maleev, Victor; Malek, Fairouz; Mallik, Usha; Malon, David; Malone, Caitlin; Maltezos, Stavros; Malyshev, Vladimir; Malyukov, Sergei; Mamuzic, Judita; Mandelli, Beatrice; Mandelli, Luciano; Mandić, Igor; Mandrysch, Rocco; Maneira, José; Manfredini, Alessandro; Manhaes de Andrade Filho, Luciano; Manjarres Ramos, Joany Andreina; Mann, Alexander; Manning, Peter; Manousakis-Katsikakis, Arkadios; Mansoulie, Bruno; Mantifel, Rodger; Mapelli, Livio; March, Luis; Marchand, Jean-Francois; Marchiori, Giovanni; Marcisovsky, Michal; Marino, Christopher; Marjanovic, Marija; Marques, Carlos; Marroquim, Fernando; Marsden, Stephen Philip; Marshall, Zach; Marti, Lukas Fritz; Marti-Garcia, Salvador; Martin, Brian; Martin, Brian; Martin, Tim; Martin, Victoria Jane; Martin dit Latour, Bertrand; Martinez, Homero; Martinez, Mario; Martin-Haugh, Stewart; Martyniuk, Alex; Marx, Marilyn; Marzano, Francesco; Marzin, Antoine; Masetti, Lucia; Mashimo, Tetsuro; Mashinistov, Ruslan; Masik, Jiri; Maslennikov, Alexey; Massa, Ignazio; Massol, Nicolas; Mastrandrea, Paolo; Mastroberardino, Anna; Masubuchi, Tatsuya; Mättig, Peter; Mattmann, Johannes; Maurer, Julien; Maxfield, Stephen; Maximov, Dmitriy; Mazini, Rachid; Mazzaferro, Luca; Mc Goldrick, Garrin; Mc Kee, Shawn Patrick; McCarn, Allison; McCarthy, Robert; McCarthy, Tom; McCubbin, Norman; McFarlane, Kenneth; Mcfayden, Josh; Mchedlidze, Gvantsa; McMahon, Steve; McPherson, Robert; Meade, Andrew; Mechnich, Joerg; Medinnis, Michael; Meehan, Samuel; Mehlhase, Sascha; Mehta, Andrew; Meier, Karlheinz; Meineck, Christian; Meirose, Bernhard; Melachrinos, Constantinos; Mellado Garcia, Bruce Rafael; Meloni, Federico; Mengarelli, Alberto; Menke, Sven; Meoni, Evelin; Mercurio, Kevin Michael; Mergelmeyer, Sebastian; Meric, Nicolas; Mermod, Philippe; Merola, Leonardo; Meroni, Chiara; Merritt, Frank; Merritt, Hayes; Messina, Andrea; Metcalfe, Jessica; Mete, Alaettin Serhan; Meyer, Carsten; Meyer, Christopher; Meyer, Jean-Pierre; Meyer, Jochen; Middleton, Robin; Migas, Sylwia; Mijović, Liza; Mikenberg, Giora; Mikestikova, Marcela; Mikuž, Marko; Milic, Adriana; Miller, David; Mills, Corrinne; Milov, Alexander; Milstead, David; Milstein, Dmitry; Minaenko, Andrey; Minashvili, Irakli; Mincer, Allen; Mindur, Bartosz; Mineev, Mikhail; Ming, Yao; Mir, Lluisa-Maria; Mirabelli, Giovanni; Mitani, Takashi; Mitrevski, Jovan; Mitsou, Vasiliki A; Mitsui, Shingo; Miucci, Antonio; Miyagawa, Paul; Mjörnmark, Jan-Ulf; Moa, Torbjoern; Mochizuki, Kazuya; Mohapatra, Soumya; Mohr, Wolfgang; Molander, Simon; Moles-Valls, Regina; Mönig, Klaus; Monini, Caterina; Monk, James; Monnier, Emmanuel; Montejo Berlingen, Javier; Monticelli, Fernando; Monzani, Simone; Moore, Roger; Moraes, Arthur; Morange, Nicolas; Moreno, Deywis; Moreno Llácer, María; Morettini, Paolo; Morgenstern, Marcus; Morii, Masahiro; Moritz, Sebastian; Morley, Anthony Keith; Mornacchi, Giuseppe; Morris, John; Morvaj, Ljiljana; Moser, Hans-Guenther; Mosidze, Maia; Moss, Josh; Motohashi, Kazuki; Mount, Richard; Mountricha, Eleni; Mouraviev, Sergei; Moyse, Edward; Muanza, Steve; Mudd, Richard; Mueller, Felix; Mueller, James; Mueller, Klemens; Mueller, Thibaut; Mueller, Timo; Muenstermann, Daniel; Munwes, Yonathan; Murillo Quijada, Javier Alberto; Murray, Bill; Musheghyan, Haykuhi; Musto, Elisa; Myagkov, Alexey; Myska, Miroslav; Nackenhorst, Olaf; Nadal, Jordi; Nagai, Koichi; Nagai, Ryo; Nagai, Yoshikazu; Nagano, Kunihiro; Nagarkar, Advait; Nagasaka, Yasushi; Nagel, Martin; Nairz, Armin Michael; Nakahama, Yu; Nakamura, Koji; Nakamura, Tomoaki; Nakano, Itsuo; Namasivayam, Harisankar; Nanava, Gizo; Narayan, Rohin; Nattermann, Till; Naumann, Thomas; Navarro, Gabriela; Nayyar, Ruchika; Neal, Homer; Nechaeva, Polina; Neep, Thomas James; Nef, Pascal Daniel; Negri, Andrea; Negri, Guido; Negrini, Matteo; Nektarijevic, Snezana; Nelson, Andrew; Nelson, Timothy Knight; Nemecek, Stanislav; Nemethy, Peter; Nepomuceno, Andre Asevedo; Nessi, Marzio; Neubauer, Mark; Neumann, Manuel; Neves, Ricardo; Nevski, Pavel; Newman, Paul; Nguyen, Duong Hai; Nickerson, Richard; Nicolaidou, Rosy; Nicquevert, Bertrand; Nielsen, Jason; Nikiforou, Nikiforos; Nikiforov, Andriy; Nikolaenko, Vladimir; Nikolic-Audit, Irena; Nikolics, Katalin; Nikolopoulos, Konstantinos; Nilsson, Paul; Ninomiya, Yoichi; Nisati, Aleandro; Nisius, Richard; Nobe, Takuya; Nodulman, Lawrence; Nomachi, Masaharu; Nomidis, Ioannis; Norberg, Scarlet; Nordberg, Markus; Novgorodova, Olga; Nowak, Sebastian; Nozaki, Mitsuaki; Nozka, Libor; Ntekas, Konstantinos; Nunes Hanninger, Guilherme; Nunnemann, Thomas; Nurse, Emily; Nuti, Francesco; O'Brien, Brendan Joseph; O'grady, Fionnbarr; O'Neil, Dugan; O'Shea, Val; Oakham, Gerald; Oberlack, Horst; Obermann, Theresa; Ocariz, Jose; Ochi, Atsuhiko; Ochoa, Ines; Oda, Susumu; Odaka, Shigeru; Ogren, Harold; Oh, Alexander; Oh, Seog; Ohm, Christian; Ohman, Henrik; Ohshima, Takayoshi; Okamura, Wataru; Okawa, Hideki; Okumura, Yasuyuki; Okuyama, Toyonobu; Olariu, Albert; Olchevski, Alexander; Olivares Pino, Sebastian Andres; Oliveira Damazio, Denis; Oliver Garcia, Elena; Olszewski, Andrzej; Olszowska, Jolanta; Onofre, António; Onyisi, Peter; Oram, Christopher; Oreglia, Mark; Oren, Yona; Orestano, Domizia; Orlando, Nicola; Oropeza Barrera, Cristina; Orr, Robert; Osculati, Bianca; Ospanov, Rustem; Otero y Garzon, Gustavo; Otono, Hidetoshi; Ouchrif, Mohamed; Ouellette, Eric; Ould-Saada, Farid; Ouraou, Ahmimed; Oussoren, Koen Pieter; Ouyang, Qun; Ovcharova, Ana; Owen, Mark; Ozcan, Veysi Erkcan; Ozturk, Nurcan; Pachal, Katherine; Pacheco Pages, Andres; Padilla Aranda, Cristobal; Pagáčová, Martina; Pagan Griso, Simone; Paganis, Efstathios; Pahl, Christoph; Paige, Frank; Pais, Preema; Pajchel, Katarina; Palacino, Gabriel; Palestini, Sandro; Palka, Marek; Pallin, Dominique; Palma, Alberto; Palmer, Jody; Pan, Yibin; Panagiotopoulou, Evgenia; Panduro Vazquez, William; Pani, Priscilla; Panikashvili, Natalia; Panitkin, Sergey; Pantea, Dan; Paolozzi, Lorenzo; Papadopoulou, Theodora; Papageorgiou, Konstantinos; Paramonov, Alexander; Paredes Hernandez, Daniela; Parker, Michael Andrew; Parodi, Fabrizio; Parsons, John; Parzefall, Ulrich; Pasqualucci, Enrico; Passaggio, Stefano; Passeri, Antonio; Pastore, Fernanda; Pastore, Francesca; Pásztor, Gabriella; Pataraia, Sophio; Patel, Nikhul; Pater, Joleen; Patricelli, Sergio; Pauly, Thilo; Pearce, James; Pedersen, Maiken; Pedraza Lopez, Sebastian; Pedro, Rute; Peleganchuk, Sergey; Pelikan, Daniel; Peng, Haiping; Penning, Bjoern; Penwell, John; Perepelitsa, Dennis; Perez Codina, Estel; Pérez García-Estañ, María Teresa; Perez Reale, Valeria; Perini, Laura; Pernegger, Heinz; Perrino, Roberto; Peschke, Richard; Peshekhonov, Vladimir; Peters, Krisztian; Peters, Yvonne; Petersen, Brian; Petersen, Troels; Petit, Elisabeth; Petridis, Andreas; Petridou, Chariclia; Petrolo, Emilio; Petrucci, Fabrizio; Pettersson, Nora Emilia; Pezoa, Raquel; Phillips, Peter William; Piacquadio, Giacinto; Pianori, Elisabetta; Picazio, Attilio; Piccaro, Elisa; Piccinini, Maurizio; Piegaia, Ricardo; Pignotti, David; Pilcher, James; Pilkington, Andrew; Pina, João Antonio; Pinamonti, Michele; Pinder, Alex; Pinfold, James; Pingel, Almut; Pinto, Belmiro; Pires, Sylvestre; Pitt, Michael; Pizio, Caterina; Plazak, Lukas; Pleier, Marc-Andre; Pleskot, Vojtech; Plotnikova, Elena; Plucinski, Pawel; Poddar, Sahill; Podlyski, Fabrice; Poettgen, Ruth; Poggioli, Luc; Pohl, David-leon; Pohl, Martin; Polesello, Giacomo; Policicchio, Antonio; Polifka, Richard; Polini, Alessandro; Pollard, Christopher Samuel; Polychronakos, Venetios; Pommès, Kathy; Pontecorvo, Ludovico; Pope, Bernard; Popeneciu, Gabriel Alexandru; Popovic, Dragan; Poppleton, Alan; Portell Bueso, Xavier; Pospisil, Stanislav; Potamianos, Karolos; Potrap, Igor; Potter, Christina; Potter, Christopher; Poulard, Gilbert; Poveda, Joaquin; Pozdnyakov, Valery; Pralavorio, Pascal; Pranko, Aliaksandr; Prasad, Srivas; Pravahan, Rishiraj; Prell, Soeren; Price, Darren; Price, Joe; Price, Lawrence; Prieur, Damien; Primavera, Margherita; Proissl, Manuel; Prokofiev, Kirill; Prokoshin, Fedor; Protopapadaki, Eftychia-sofia; Protopopescu, Serban; Proudfoot, James; Przybycien, Mariusz; Przysiezniak, Helenka; Ptacek, Elizabeth; Puddu, Daniele; Pueschel, Elisa; Puldon, David; Purohit, Milind; Puzo, Patrick; Qian, Jianming; Qin, Gang; Qin, Yang; Quadt, Arnulf; Quarrie, David; Quayle, William; Queitsch-Maitland, Michaela; Quilty, Donnchadha; Qureshi, Anum; Radeka, Veljko; Radescu, Voica; Radhakrishnan, Sooraj Krishnan; Radloff, Peter; Rados, Pere; Ragusa, Francesco; Rahal, Ghita; Rajagopalan, Srinivasan; Rammensee, Michael; Randle-Conde, Aidan Sean; Rangel-Smith, Camila; Rao, Kanury; Rauscher, Felix; Rave, Tobias Christian; Ravenscroft, Thomas; Raymond, Michel; Read, Alexander Lincoln; Readioff, Nathan Peter; Rebuzzi, Daniela; Redelbach, Andreas; Redlinger, George; Reece, Ryan; Reeves, Kendall; Rehnisch, Laura; Reisin, Hernan; Relich, Matthew; Rembser, Christoph; Ren, Huan; Ren, Zhongliang; Renaud, Adrien; Rescigno, Marco; Resconi, Silvia; Rezanova, Olga; Reznicek, Pavel; Rezvani, Reyhaneh; Richter, Robert; Ridel, Melissa; Rieck, Patrick; Rieger, Julia; Rijssenbeek, Michael; Rimoldi, Adele; Rinaldi, Lorenzo; Ritsch, Elmar; Riu, Imma; Rizatdinova, Flera; Rizvi, Eram; Robertson, Steven; Robichaud-Veronneau, Andree; Robinson, Dave; Robinson, James; Robson, Aidan; Roda, Chiara; Rodrigues, Luis; Roe, Shaun; Røhne, Ole; Rolli, Simona; Romaniouk, Anatoli; Romano, Marino; Romero Adam, Elena; Rompotis, Nikolaos; Roos, Lydia; Ros, Eduardo; Rosati, Stefano; Rosbach, Kilian; Rose, Matthew; Rosendahl, Peter Lundgaard; Rosenthal, Oliver; Rossetti, Valerio; Rossi, Elvira; Rossi, Leonardo Paolo; Rosten, Rachel; Rotaru, Marina; Roth, Itamar; Rothberg, Joseph; Rousseau, David; Royon, Christophe; Rozanov, Alexandre; Rozen, Yoram; Ruan, Xifeng; Rubbo, Francesco; Rubinskiy, Igor; Rud, Viacheslav; Rudolph, Christian; Rudolph, Matthew Scott; Rühr, Frederik; Ruiz-Martinez, Aranzazu; Rurikova, Zuzana; Rusakovich, Nikolai; Ruschke, Alexander; Rutherfoord, John; Ruthmann, Nils; Ryabov, Yury; Rybar, Martin; Rybkin, Grigori; Ryder, Nick; Saavedra, Aldo; Sacerdoti, Sabrina; Saddique, Asif; Sadeh, Iftach; Sadrozinski, Hartmut; Sadykov, Renat; Safai Tehrani, Francesco; Sakamoto, Hiroshi; Sakurai, Yuki; Salamanna, Giuseppe; Salamon, Andrea; Saleem, Muhammad; Salek, David; Sales De Bruin, Pedro Henrique; Salihagic, Denis; Salnikov, Andrei; Salt, José; Salvachua Ferrando, Belén; Salvatore, Daniela; Salvatore, Pasquale Fabrizio; Salvucci, Antonio; Salzburger, Andreas; Sampsonidis, Dimitrios; Sanchez, Arturo; Sánchez, Javier; Sanchez Martinez, Victoria; Sandaker, Heidi; Sandbach, Ruth Laura; Sander, Heinz Georg; Sanders, Michiel; Sandhoff, Marisa; Sandoval, Tanya; Sandoval, Carlos; Sandstroem, Rikard; Sankey, Dave; Sansoni, Andrea; Santoni, Claudio; Santonico, Rinaldo; Santos, Helena; Santoyo Castillo, Itzebelt; Sapp, Kevin; Sapronov, Andrey; Saraiva, João; Sarrazin, Bjorn; Sartisohn, Georg; Sasaki, Osamu; Sasaki, Yuichi; Sauvage, Gilles; Sauvan, Emmanuel; Savard, Pierre; Savu, Dan Octavian; Sawyer, Craig; Sawyer, Lee; Saxon, David; Saxon, James; Sbarra, Carla; Sbrizzi, Antonio; Scanlon, Tim; Scannicchio, Diana; Scarcella, Mark; Scarfone, Valerio; Schaarschmidt, Jana; Schacht, Peter; Schaefer, Douglas; Schaefer, Ralph; Schaepe, Steffen; Schaetzel, Sebastian; Schäfer, Uli; Schaffer, Arthur; Schaile, Dorothee; Schamberger, R. Dean; Scharf, Veit; Schegelsky, Valery; Scheirich, Daniel; Schernau, Michael; Scherzer, Max; Schiavi, Carlo; Schieck, Jochen; Schillo, Christian; Schioppa, Marco; Schlenker, Stefan; Schmidt, Evelyn; Schmieden, Kristof; Schmitt, Christian; Schmitt, Christopher; Schmitt, Sebastian; Schneider, Basil; Schnellbach, Yan Jie; Schnoor, Ulrike; Schoeffel, Laurent; Schoening, Andre; Schoenrock, Bradley Daniel; Schorlemmer, Andre Lukas; Schott, Matthias; Schouten, Doug; Schovancova, Jaroslava; Schramm, Steven; Schreyer, Manuel; Schroeder, Christian; Schuh, Natascha; Schultens, Martin Johannes; Schultz-Coulon, Hans-Christian; Schulz, Holger; Schumacher, Markus; Schumm, Bruce; Schune, Philippe; Schwanenberger, Christian; Schwartzman, Ariel; Schwegler, Philipp; Schwemling, Philippe; Schwienhorst, Reinhard; Schwindling, Jerome; Schwindt, Thomas; Schwoerer, Maud; Sciacca, Gianfranco; Scifo, Estelle; Sciolla, Gabriella; Scott, Bill; Scuri, Fabrizio; Scutti, Federico; Searcy, Jacob; Sedov, George; Sedykh, Evgeny; Seidel, Sally; Seiden, Abraham; Seifert, Frank; Seixas, José; Sekhniaidze, Givi; Sekula, Stephen; Selbach, Karoline Elfriede; Seliverstov, Dmitry; Sellers, Graham; Semprini-Cesari, Nicola; Serfon, Cedric; Serin, Laurent; Serkin, Leonid; Serre, Thomas; Seuster, Rolf; Severini, Horst; Sfiligoj, Tina; Sforza, Federico; Sfyrla, Anna; Shabalina, Elizaveta; Shamim, Mansoora; Shan, Lianyou; Shang, Ruo-yu; Shank, James; Shapiro, Marjorie; Shatalov, Pavel; Shaw, Kate; Shehu, Ciwake Yusufu; Sherwood, Peter; Shi, Liaoshan; Shimizu, Shima; Shimmin, Chase Owen; Shimojima, Makoto; Shiyakova, Mariya; Shmeleva, Alevtina; Shochet, Mel; Short, Daniel; Shrestha, Suyog; Shulga, Evgeny; Shupe, Michael; Shushkevich, Stanislav; Sicho, Petr; Sidiropoulou, Ourania; Sidorov, Dmitri; Sidoti, Antonio; Siegert, Frank; Sijacki, Djordje; Silva, José; Silver, Yiftah; Silverstein, Daniel; Silverstein, Samuel; Simak, Vladislav; Simard, Olivier; Simic, Ljiljana; Simion, Stefan; Simioni, Eduard; Simmons, Brinick; Simoniello, Rosa; Simonyan, Margar; Sinervo, Pekka; Sinev, Nikolai; Sipica, Valentin; Siragusa, Giovanni; Sircar, Anirvan; Sisakyan, Alexei; Sivoklokov, Serguei; Sjölin, Jörgen; Sjursen, Therese; Skottowe, Hugh Philip; Skovpen, Kirill; Skubic, Patrick; Slater, Mark; Slavicek, Tomas; Sliwa, Krzysztof; Smakhtin, Vladimir; Smart, Ben; Smestad, Lillian; Smirnov, Sergei; Smirnov, Yury; Smirnova, Lidia; Smirnova, Oxana; Smith, Kenway; Smizanska, Maria; Smolek, Karel; Snesarev, Andrei; Snidero, Giacomo; Snyder, Scott; Sobie, Randall; Socher, Felix; Soffer, Abner; Soh, Dart-yin; Solans, Carlos; Solar, Michael; Solc, Jaroslav; Soldatov, Evgeny; Soldevila, Urmila; Solfaroli Camillocci, Elena; Solodkov, Alexander; Soloshenko, Alexei; Solovyanov, Oleg; Solovyev, Victor; Sommer, Philip; Song, Hong Ye; Soni, Nitesh; Sood, Alexander; Sopczak, Andre; Sopko, Bruno; Sopko, Vit; Sorin, Veronica; Sosebee, Mark; Soualah, Rachik; Soueid, Paul; Soukharev, Andrey; South, David; Spagnolo, Stefania; Spanò, Francesco; Spearman, William Robert; Spettel, Fabian; Spighi, Roberto; Spigo, Giancarlo; Spousta, Martin; Spreitzer, Teresa; Spurlock, Barry; St Denis, Richard Dante; Staerz, Steffen; Stahlman, Jonathan; Stamen, Rainer; Stanecka, Ewa; Stanek, Robert; Stanescu, Cristian; Stanescu-Bellu, Madalina; Stanitzki, Marcel Michael; Stapnes, Steinar; Starchenko, Evgeny; Stark, Jan; Staroba, Pavel; Starovoitov, Pavel; Staszewski, Rafal; Stavina, Pavel; Steinberg, Peter; Stelzer, Bernd; Stelzer, Harald Joerg; Stelzer-Chilton, Oliver; Stenzel, Hasko; Stern, Sebastian; Stewart, Graeme; Stillings, Jan Andre; Stockton, Mark; Stoebe, Michael; Stoicea, Gabriel; Stolte, Philipp; Stonjek, Stefan; Stradling, Alden; Straessner, Arno; Stramaglia, Maria Elena; Strandberg, Jonas; Strandberg, Sara; Strandlie, Are; Strauss, Emanuel; Strauss, Michael; Strizenec, Pavol; Ströhmer, Raimund; Strom, David; Stroynowski, Ryszard; Stucci, Stefania Antonia; Stugu, Bjarne; Styles, Nicholas Adam; Su, Dong; Su, Jun; Subramania, Halasya Siva; Subramaniam, Rajivalochan; Succurro, Antonella; Sugaya, Yorihito; Suhr, Chad; Suk, Michal; Sulin, Vladimir; Sultansoy, Saleh; Sumida, Toshi; Sun, Xiaohu; Sundermann, Jan Erik; Suruliz, Kerim; Susinno, Giancarlo; Sutton, Mark; Suzuki, Yu; Svatos, Michal; Swedish, Stephen; Swiatlowski, Maximilian; Sykora, Ivan; Sykora, Tomas; Ta, Duc; Taccini, Cecilia; Tackmann, Kerstin; Taenzer, Joe; Taffard, Anyes; Tafirout, Reda; Taiblum, Nimrod; Takahashi, Yuta; Takai, Helio; Takashima, Ryuichi; Takeda, Hiroshi; Takeshita, Tohru; Takubo, Yosuke; Talby, Mossadek; Talyshev, Alexey; Tam, Jason; Tan, Kong Guan; Tanaka, Junichi; Tanaka, Reisaburo; Tanaka, Satoshi; Tanaka, Shuji; Tanasijczuk, Andres Jorge; Tannenwald, Benjamin Bordy; Tannoury, Nancy; Tapprogge, Stefan; Tarem, Shlomit; Tarrade, Fabien; Tartarelli, Giuseppe Francesco; Tas, Petr; Tasevsky, Marek; Tashiro, Takuya; Tassi, Enrico; Tavares Delgado, Ademar; Tayalati, Yahya; Taylor, Frank; Taylor, Geoffrey; Taylor, Wendy; Teischinger, Florian Alfred; Teixeira Dias Castanheira, Matilde; Teixeira-Dias, Pedro; Temming, Kim Katrin; Ten Kate, Herman; Teng, Ping-Kun; Teoh, Jia Jian; Terada, Susumu; Terashi, Koji; Terron, Juan; Terzo, Stefano; Testa, Marianna; Teuscher, Richard; Therhaag, Jan; Theveneaux-Pelzer, Timothée; Thomas, Juergen; Thomas-Wilsker, Joshuha; Thompson, Emily; Thompson, Paul; Thompson, Peter; Thompson, Stan; Thomsen, Lotte Ansgaard; Thomson, Evelyn; Thomson, Mark; Thong, Wai Meng; Thun, Rudolf; Tian, Feng; Tibbetts, Mark James; Tikhomirov, Vladimir; Tikhonov, Yury; Timoshenko, Sergey; Tiouchichine, Elodie; Tipton, Paul; Tisserant, Sylvain; Todorov, Theodore; Todorova-Nova, Sharka; Toggerson, Brokk; Tojo, Junji; Tokár, Stanislav; Tokushuku, Katsuo; Tollefson, Kirsten; Tomlinson, Lee; Tomoto, Makoto; Tompkins, Lauren; Toms, Konstantin; Topilin, Nikolai; Torrence, Eric; Torres, Heberth; Torró Pastor, Emma; Toth, Jozsef; Touchard, Francois; Tovey, Daniel; Tran, Huong Lan; Trefzger, Thomas; Tremblet, Louis; Tricoli, Alessandro; Trigger, Isabel Marian; Trincaz-Duvoid, Sophie; Tripiana, Martin; Triplett, Nathan; Trischuk, William; Trocmé, Benjamin; Troncon, Clara; Trottier-McDonald, Michel; Trovatelli, Monica; True, Patrick; Trzebinski, Maciej; Trzupek, Adam; Tsarouchas, Charilaos; Tseng, Jeffrey; Tsiareshka, Pavel; Tsionou, Dimitra; Tsipolitis, Georgios; Tsirintanis, Nikolaos; Tsiskaridze, Shota; Tsiskaridze, Vakhtang; Tskhadadze, Edisher; Tsukerman, Ilya; Tsulaia, Vakhtang; Tsuno, Soshi; Tsybychev, Dmitri; Tudorache, Alexandra; Tudorache, Valentina; Tuna, Alexander Naip; Tupputi, Salvatore; Turchikhin, Semen; Turecek, Daniel; Turk Cakir, Ilkay; Turra, Ruggero; Tuts, Michael; Tykhonov, Andrii; Tylmad, Maja; Tyndel, Mike; Uchida, Kirika; Ueda, Ikuo; Ueno, Ryuichi; Ughetto, Michael; Ugland, Maren; Uhlenbrock, Mathias; Ukegawa, Fumihiko; Unal, Guillaume; Undrus, Alexander; Unel, Gokhan; Ungaro, Francesca; Unno, Yoshinobu; Urbaniec, Dustin; Urquijo, Phillip; Usai, Giulio; Usanova, Anna; Vacavant, Laurent; Vacek, Vaclav; Vachon, Brigitte; Valencic, Nika; Valentinetti, Sara; Valero, Alberto; Valery, Loic; Valkar, Stefan; Valladolid Gallego, Eva; Vallecorsa, Sofia; Valls Ferrer, Juan Antonio; Van Den Wollenberg, Wouter; Van Der Deijl, Pieter; van der Geer, Rogier; van der Graaf, Harry; Van Der Leeuw, Robin; van der Ster, Daniel; van Eldik, Niels; van Gemmeren, Peter; Van Nieuwkoop, Jacobus; van Vulpen, Ivo; van Woerden, Marius Cornelis; Vanadia, Marco; Vandelli, Wainer; Vanguri, Rami; Vaniachine, Alexandre; Vankov, Peter; Vannucci, Francois; Vardanyan, Gagik; Vari, Riccardo; Varnes, Erich; Varol, Tulin; Varouchas, Dimitris; Vartapetian, Armen; Varvell, Kevin; Vazeille, Francois; Vazquez Schroeder, Tamara; Veatch, Jason; Veloso, Filipe; Veneziano, Stefano; Ventura, Andrea; Ventura, Daniel; Venturi, Manuela; Venturi, Nicola; Venturini, Alessio; Vercesi, Valerio; Verducci, Monica; Verkerke, Wouter; Vermeulen, Jos; Vest, Anja; Vetterli, Michel; Viazlo, Oleksandr; Vichou, Irene; Vickey, Trevor; Vickey Boeriu, Oana Elena; Viehhauser, Georg; Viel, Simon; Vigne, Ralph; Villa, Mauro; Villaplana Perez, Miguel; Vilucchi, Elisabetta; Vincter, Manuella; Vinogradov, Vladimir; Virzi, Joseph; Vivarelli, Iacopo; Vives Vaque, Francesc; Vlachos, Sotirios; Vladoiu, Dan; Vlasak, Michal; Vogel, Adrian; Vogel, Marcelo; Vokac, Petr; Volpi, Guido; Volpi, Matteo; von der Schmitt, Hans; von Radziewski, Holger; von Toerne, Eckhard; Vorobel, Vit; Vorobev, Konstantin; Vos, Marcel; Voss, Rudiger; Vossebeld, Joost; Vranjes, Nenad; Vranjes Milosavljevic, Marija; Vrba, Vaclav; Vreeswijk, Marcel; Vu Anh, Tuan; Vuillermet, Raphael; Vukotic, Ilija; Vykydal, Zdenek; Wagner, Peter; Wagner, Wolfgang; Wahlberg, Hernan; Wahrmund, Sebastian; Wakabayashi, Jun; Walder, James; Walker, Rodney; Walkowiak, Wolfgang; Wall, Richard; Waller, Peter; Walsh, Brian; Wang, Chao; Wang, Chiho; Wang, Fuquan; Wang, Haichen; Wang, Hulin; Wang, Jike; Wang, Jin; Wang, Kuhan; Wang, Rui; Wang, Song-Ming; Wang, Tan; Wang, Xiaoxiao; Wanotayaroj, Chaowaroj; Warburton, Andreas; Ward, Patricia; Wardrope, David Robert; Warsinsky, Markus; Washbrook, Andrew; Wasicki, Christoph; Watkins, Peter; Watson, Alan; Watson, Ian; Watson, Miriam; Watts, Gordon; Watts, Stephen; Waugh, Ben; Webb, Samuel; Weber, Michele; Weber, Stefan Wolf; Webster, Jordan S; Weidberg, Anthony; Weigell, Philipp; Weinert, Benjamin; Weingarten, Jens; Weiser, Christian; Weits, Hartger; Wells, Phillippa; Wenaus, Torre; Wendland, Dennis; Weng, Zhili; Wengler, Thorsten; Wenig, Siegfried; Wermes, Norbert; Werner, Matthias; Werner, Per; Wessels, Martin; Wetter, Jeffrey; Whalen, Kathleen; White, Andrew; White, Martin; White, Ryan; White, Sebastian; Whiteson, Daniel; Wicke, Daniel; Wickens, Fred; Wiedenmann, Werner; Wielers, Monika; Wienemann, Peter; Wiglesworth, Craig; Wiik-Fuchs, Liv Antje Mari; Wijeratne, Peter Alexander; Wildauer, Andreas; Wildt, Martin Andre; Wilkens, Henric George; Will, Jonas Zacharias; Williams, Hugh; Williams, Sarah; Willis, Christopher; Willocq, Stephane; Wilson, Alan; Wilson, John; Wingerter-Seez, Isabelle; Winklmeier, Frank; Winter, Benedict Tobias; Wittgen, Matthias; Wittig, Tobias; Wittkowski, Josephine; Wollstadt, Simon Jakob; Wolter, Marcin Wladyslaw; Wolters, Helmut; Wosiek, Barbara; Wotschack, Jorg; Woudstra, Martin; Wozniak, Krzysztof; Wright, Michael; Wu, Mengqing; Wu, Sau Lan; Wu, Xin; Wu, Yusheng; Wulf, Evan; Wyatt, Terry Richard; Wynne, Benjamin; Xella, Stefania; Xiao, Meng; Xu, Da; Xu, Lailin; Yabsley, Bruce; Yacoob, Sahal; Yamada, Miho; Yamaguchi, Hiroshi; Yamaguchi, Yohei; Yamamoto, Akira; Yamamoto, Kyoko; Yamamoto, Shimpei; Yamamura, Taiki; Yamanaka, Takashi; Yamauchi, Katsuya; Yamazaki, Yuji; Yan, Zhen; Yang, Haijun; Yang, Hongtao; Yang, Un-Ki; Yang, Yi; Yanush, Serguei; Yao, Liwen; Yao, Weiming; Yasu, Yoshiji; Yatsenko, Elena; Yau Wong, Kaven Henry; Ye, Jingbo; Ye, Shuwei; Yen, Andy L; Yildirim, Eda; Yilmaz, Metin; Yoosoofmiya, Reza; Yorita, Kohei; Yoshida, Rikutaro; Yoshihara, Keisuke; Young, Charles; Young, Christopher John; Youssef, Saul; Yu, David Ren-Hwa; Yu, Jaehoon; Yu, Jiaming; Yu, Jie; Yuan, Li; Yurkewicz, Adam; Yusuff, Imran; Zabinski, Bartlomiej; Zaidan, Remi; Zaitsev, Alexander; Zaman, Aungshuman; Zambito, Stefano; Zanello, Lucia; Zanzi, Daniele; Zeitnitz, Christian; Zeman, Martin; Zemla, Andrzej; Zengel, Keith; Zenin, Oleg; Ženiš, Tibor; Zerwas, Dirk; Zevi della Porta, Giovanni; Zhang, Dongliang; Zhang, Fangzhou; Zhang, Huaqiao; Zhang, Jinlong; Zhang, Lei; Zhang, Xueyao; Zhang, Zhiqing; Zhao, Zhengguo; Zhemchugov, Alexey; Zhong, Jiahang; Zhou, Bing; Zhou, Lei; Zhou, Ning; Zhu, Cheng Guang; Zhu, Hongbo; Zhu, Junjie; Zhu, Yingchun; Zhuang, Xuai; Zhukov, Konstantin; Zibell, Andre; Zieminska, Daria; Zimine, Nikolai; Zimmermann, Christoph; Zimmermann, Robert; Zimmermann, Simone; Zimmermann, Stephanie; Zinonos, Zinonas; Ziolkowski, Michael; Zobernig, Georg; Zoccoli, Antonio; zur Nedden, Martin; Zurzolo, Giovanni; Zutshi, Vishnu; Zwalinski, Lukasz

    2014-01-01

    A novel technique to identify and split clusters created by multiple charged particles in the ATLAS pixel detector using a set of artificial neural networks is presented. Such merged clusters are a common feature of tracks originating from highly energetic objects, such as jets. Neural networks are trained using Monte Carlo samples produced with a detailed detector simulation. This technique replaces the former clustering approach based on a connected component analysis and charge interpolation. The performance of the neural network splitting technique is quantified using data from proton-proton collisions at the LHC collected by the ATLAS detector in 2011 and from Monte Carlo simulations. This technique reduces the number of clusters shared between tracks in highly energetic jets by up to a factor of three. It also provides more precise position and error estimates of the clusters in both the transverse and longitudinal impact parameter resolution.

  5. Test su fascio di prototipi del rivelatore a pixel per l'esperimento ATLAS

    CERN Document Server

    Matera, Andrea; Andreazza, A

    2005-01-01

    Silicon pixel detectors, developed to meet LHC requirements, were tested within the ATLAS collaboration in the H8 beam at CERN. Different sensor designs were studied using various versions of front end electronics developed during the R&D process. In this thesis a detailed experimental study of the overall performance of both irradiated and unirradiated detectors is presented, with special enphasis on efficiency, charge collection and spatial resolution. For the first time their dependence on timewalk is carefully investigated. Possible solutions to avoid spatial resolution deterioration due to timewalk are presented and discussed.

  6. Experiences with module-production and system tests for the ATLAS Pixel Detector

    Science.gov (United States)

    Grosse-Knetter, Jörn; Hügging, Fabian; Mättig, Peter; Reeves, Kendall; Schultes, Joachim; Weingarten, Jens; Wermes, Norbert

    2006-09-01

    The ATLAS pixel detector is built from 1744 modules which are organized in three barrel layers and three disk layers in forward direction. The modules consist of an oxygen-enriched silicon sensor with an active area of 60.8×16.4 mm2. Its 46 080 pixels are read out by 16 frontend chips, bump bonded to the sensor using a state-of-the-art hybridization technique. After extensive characterization of the single modules they are mounted on support structures, made from a carbon-carbon composite material, which make up the barrel or the disc layers. The first of these assemblies are used to study the behavior of the modules outside the lab environment.

  7. Design, production, and reliability of the new ATLAS pixel opto-boards

    International Nuclear Information System (INIS)

    New fiber optical transceivers, opto-boards, were designed and produced to replace the first generation opto-boards installed in the ATLAS pixel detector and for the new pixel layer, the insertable barrel layer (IBL). Each opto-board contains one 12-channel PIN array and two 12-channel VCSEL arrays along with associated receiver and driver ASICs. The new opto-board design benefits from the production and operational experience of the first generation opto-boards and contains several improvements. The new opto-boards have been successfully installed. Additionally, a set of the new opto-boards have been subjected to an accelerated lifetime experiment at 85 C and 85% relative humidity for over 1,000 hours. No failures were observed. We are cautiously optimistic that the new opto-boards will survive until the shutdown for the detector upgrade for the high-luminosity Large Hadron Collider (HL-LHC)

  8. Slim edge studies, design and quality control of planar ATLAS IBL pixel sensors

    International Nuclear Information System (INIS)

    One of the four large experiments at the LHC at CERN is the ATLAS detector, a multi purpose detector. Its pixel detector, composed of three layers, is the innermost part of the tracker. As it is closest to the interaction point, it represents a basic part of the track reconstruction. Besides the requested high resolution one main requirement is the radiation hardness. In the coming years the radiation damage will cause deteriorations of the detector performance. With the planned increase of the luminosity, especially after the upgrade to the High Luminosity LHC, this radiation damage will be even intensified. This circumstance necessitates a new pixel detector featuring improved radiation hard sensors and read-out chips. The present shutdown of the LHC is already utilized to insert an additional b-layer (IBL) into the existing ATLAS pixel detector. The current n-in-n pixel sensor design had to be adapted to the new read-out chip and the module specifications. The new stave geometry requests a reduction of the inactive sensor edge. In a prototype wafer production all modifications have been implemented. The sensor quality control was supervised which led to the decision of the final sensor thickness. In order to evaluate the performance of the sensor chip assemblies with an innovative slim edge design, they have been operated in test beam setups before and after irradiation. Furthermore, the quality control of the planar IBL sensor wafer production was supervised from the stage of wafer delivery to that before the flip chip process to ensure a sufficient amount of functional sensors for the module production.

  9. Slim edge studies, design and quality control of planar ATLAS IBL pixel sensors

    Energy Technology Data Exchange (ETDEWEB)

    Wittig, Tobias

    2013-05-08

    One of the four large experiments at the LHC at CERN is the ATLAS detector, a multi purpose detector. Its pixel detector, composed of three layers, is the innermost part of the tracker. As it is closest to the interaction point, it represents a basic part of the track reconstruction. Besides the requested high resolution one main requirement is the radiation hardness. In the coming years the radiation damage will cause deteriorations of the detector performance. With the planned increase of the luminosity, especially after the upgrade to the High Luminosity LHC, this radiation damage will be even intensified. This circumstance necessitates a new pixel detector featuring improved radiation hard sensors and read-out chips. The present shutdown of the LHC is already utilized to insert an additional b-layer (IBL) into the existing ATLAS pixel detector. The current n-in-n pixel sensor design had to be adapted to the new read-out chip and the module specifications. The new stave geometry requests a reduction of the inactive sensor edge. In a prototype wafer production all modifications have been implemented. The sensor quality control was supervised which led to the decision of the final sensor thickness. In order to evaluate the performance of the sensor chip assemblies with an innovative slim edge design, they have been operated in test beam setups before and after irradiation. Furthermore, the quality control of the planar IBL sensor wafer production was supervised from the stage of wafer delivery to that before the flip chip process to ensure a sufficient amount of functional sensors for the module production.

  10. ATLAS SemiConductor Tracker and Pixel Detector: Status and Performance

    CERN Document Server

    Reeves, K; The ATLAS collaboration

    2012-01-01

    The Semi-Conductor Tracker (SCT) and the Pixel Detector are the key precision tracking devices in the Inner Detector of the ATLAS experiment at CERN LHC. The SCT is a silicon strip detector and is constructed of 4088 silicon detector modules for a total of 6.3 million strips. Each module is designed, constructed and tested to operate as a stand-alone unit, mechanically, electrically, optically and thermally. The SCT silicon micro-strip sensors are processed in the planar p-in-n technology. The signals from the strips are processed in the front-end ASICS ABCD3TA, working in the binary readout mode. The Pixel Detector consists of approximately 80 million pixels that are individually read out via chips bump-bonded to 1744 n-in-n silicon substrates. In the talk the current status of the SCT and Pixel Detector will be reviewed. We will report on the operation of the detectors including an overview of the issues we encountered and the observation of significant increases in leakage currents (as expected) from bulk ...

  11. The Pixel Detector of the ATLAS Experiment for the Run-2 at the Large Hadron Collider

    CERN Document Server

    Guescini, F; The ATLAS collaboration

    2014-01-01

    The Pixel Detector of the ATLAS experiment has shown excellent performance during the whole Run-1 of LHC. Taking advantage of the long showdown, the detector was extracted from the experiment and brought to surface, to equip it with new service quarter panels, to repair modules and to ease installation of the Insertable B-Layer (IBL). IBL is a fourth layer of pixel detectors, and has been installed in May 2014 between the existing Pixel Detector and a new smaller radius beam-pipe at a radial distance of 3.3 cm from the beam axis. The realization of the IBL required the development of several new technologies and solutions in order to overcome the challenges introduced by the extreme environment and working conditions, such as the high radiation levels, the high pixel occupancy and the need of an exceptionally low material budget. Two silicon sensor technologies have been adopted for the IBL modules: planar n-in-n and 3D. Both of these are connected via bump bonding to the new generation 130 nm IBM CMOS FE-I4 ...

  12. Firmware development and testing of the ATLAS Pixel Detector / IBL ROD card

    Science.gov (United States)

    Gabrielli, A.; Backhaus, M.; Balbi, G.; Bindi, M.; Chen, S. P.; Falchieri, D.; Flick, T.; Hauck, S.; Hsu, S. C.; Kretz, M.; Kugel, A.; Lama, L.; Travaglini, R.; Wensing, M.

    2015-03-01

    The ATLAS Experiment is reworking and upgrading systems during the current LHC shut down. In particular, the Pixel detector has inserted an additional inner layer called the Insertable B-Layer (IBL). The Readout-Driver card (ROD), the Back-of-Crate card (BOC), and the S-Link together form the essential frontend data path of the IBL's off-detector DAQ system. The strategy for IBL ROD firmware development was three-fold: keeping as much of the Pixel ROD datapath firmware logic as possible, employing a complete new scheme of steering and calibration firmware, and designing the overall system to prepare for a future unified code version integrating IBL and Pixel layers. Essential features such as data formatting, frontend-specific error handling, and calibration are added to the ROD data path. An IBL DAQ test bench using a realistic front-end chip model was created to serve as an initial framework for full offline electronic system simulation. In this document, major firmware achievements concerning the IBL ROD data path implementation, test on the test bench and ROD prototypes, will be reported. Recent Pixel collaboration efforts focus on finalizing hardware and firmware tests for the IBL. The plan is to approach a complete IBL DAQ hardware-software installation by the end of 2014.

  13. Firmware development and testing of the ATLAS Pixel Detector / IBL ROD card

    International Nuclear Information System (INIS)

    The ATLAS Experiment is reworking and upgrading systems during the current LHC shut down. In particular, the Pixel detector has inserted an additional inner layer called the Insertable B-Layer (IBL). The Readout-Driver card (ROD), the Back-of-Crate card (BOC), and the S-Link together form the essential frontend data path of the IBL's off-detector DAQ system. The strategy for IBL ROD firmware development was three-fold: keeping as much of the Pixel ROD datapath firmware logic as possible, employing a complete new scheme of steering and calibration firmware, and designing the overall system to prepare for a future unified code version integrating IBL and Pixel layers. Essential features such as data formatting, frontend-specific error handling, and calibration are added to the ROD data path. An IBL DAQ test bench using a realistic front-end chip model was created to serve as an initial framework for full offline electronic system simulation. In this document, major firmware achievements concerning the IBL ROD data path implementation, test on the test bench and ROD prototypes, will be reported. Recent Pixel collaboration efforts focus on finalizing hardware and firmware tests for the IBL. The plan is to approach a complete IBL DAQ hardware-software installation by the end of 2014

  14. Prototypes for components of a control system for the ATLAS pixel detector at the HL-LHC

    CERN Document Server

    Boek, J; Kind, P; Mättig, P; Püllen, L; Zeitnitz, C

    2013-01-01

    inner detector of the ATLAS experiment will be replaced entirely including the pixel detector. This new pixel detector requires a specific control system which complies with the strict requirements in terms of radiation hardness, material budget and space for the electronics in the ATLAS experiment. The University ofWuppertal is developing a concept for a DCS (Detector Control System) network consisting of two kinds of ASICs. The first ASIC is the DCS Chip which is located on the pixel detector, very close to the interaction point. The second ASIC is the DCS Controller which is controlling 4x4 DCS Chips from the outer regions of ATLAS via differential data lines. Both ASICs are manufactured in 130 nm deep sub micron technology. We present results from measurements from new prototypes of components for the DCS network.

  15. Silicon strip detectors for the ATLAS HL-LHC upgrade

    CERN Document Server

    Bernabeu, J; The ATLAS collaboration

    2011-01-01

    While the Large Hadron Collider (LHC) at CERN is continuing to deliver an ever-increasing luminosity to the experiments, plans for an upgraded machine called Super-LHC (sLHC) are progressing. The upgrade is foreseen to increase the LHC design luminosity by a factor ten. The ATLAS experiment will need to build a new tracker for sLHC operation, which needs to be suited to the harsh sLHC conditions in terms of particle rates and radiation doses. In order to cope with the increase in pile-up backgrounds at the higher luminosity, an all silicon detector is being designed. To successfully face the increased radiation dose, a new generation of extremely radiation hard silicon detectors is being designed. Silicon sensors with sufficient radiation hardness are the subject of an international R&D programme, working on pixel and strip sensors. The efforts presented here concentrate on the innermost strip layers. We have developed a large number of prototype planar detectors produced on p-type wafers in a number of d...

  16. Silicon Strip Detectors for the ATLAS HL-LHC Upgrade

    CERN Document Server

    Dervan, Paul; The ATLAS collaboration

    2011-01-01

    While the Large Hadron Collider (LHC) at CERN is continuing to deliver an ever-increasing luminosity to the experiments, plans for an upgraded machine called Super-LHC (sLHC) are progressing. The upgrade is foreseen to increase the LHC design luminosity by a factor ten. The ATLAS experiment will need to build a new tracker for sLHC operation, which needs to be suited to the harsh sLHC conditions in terms of particle rates and radiation doses. In order to cope with the increase in pile-up backgrounds at the higher luminosity, an all silicon detector is being designed. To successfully face the increased radiation dose, a new generation of extremely radiation hard silicon detectors is being designed. Silicon sensors with sufficient radiation hardness are the subject of an international R&D programme, working on pixel and strip sensors. The efforts presented here concentrate on the innermost strip layers. We have developed a large number of prototype planar detectors produced on p-type wafers in a num...

  17. Tracking and b-tagging with pixel vertex detector in ATLAS experiment at LHC

    International Nuclear Information System (INIS)

    The capability of the ATLAS detector to tag b-jets is studied, using the impact parameter of charged tracks. High b-tagging performance is needed at LHC, especially during the first years of running, in order to see evidence of the Higgs boson if its mass lies between 80 and 120 GeV/c2. A pattern-recognition algorithm has been developed for this purpose, using a detailed simulation of the ATLAS inner detector. Track-finding starts from the pixel detector layers. A 'hyper-plane' concept allows the use of a simple tracking algorithm though the complex geometry. High track-finding efficiency and reconstruction quality ensure the discrimination of b-jets from other kinds of jets. After full simulation and reconstruction of H → bb-bar, H → gg, H → uu-bar, H → ss-bar and H → cc-bar events (mH = 100 GeV/c2), the mean rejections achieved against non-b-jets for a 50% b-jet tagging efficiency are as follows: Rg=39±5 Ru = 60 ± 9 Rs = 38 ± 5 Rc = 9 ± 1 The analysis of data from the first radiation-hard pixel detector prototypes justifies the potential of these detectors for track-finding and high-precision impact parameter measurement at LHC. (author)

  18. The ATLAS Insertable B-Layer Detector (IBL)

    CERN Document Server

    Huegging, F; The ATLAS collaboration

    2010-01-01

    The upgrade for the ATLAS detector will undergo different phases towards SLHC. The first upgrade for the Pixel Detector will consist in the construction of a new pixel layer which will be installed during a longer shutdown of the LHC machine, the so-called Phase I Upgrade. The new detector, called Insertable B-Layer (IBL), will be inserted between the existing pixel detector and a new (smaller radius) beam-pipe at a radius of about 3.2 cm. The IBL requires the development of several new technologies to cope with the increase of radiation and pixel occupancy as well as to improve the physics performance of the existing pixel detector. In order to achieve these goals the pixel size is reduced and the material budget is minimized by using new lightweight mechanical support materials and a CO2 based cooling system. Main component of the module development for the IBL is the new ATLAS pixel readout chip, FE-I4, designed in 130 nm technology which features an array of 80 by 336 pixels with a pixel size of 50x250 µ...

  19. 3D silicon pixel detectors for the ATLAS Forward Physics experiment

    International Nuclear Information System (INIS)

    The ATLAS Forward Physics (AFP) project plans to install 3D silicon pixel detectors about 210 m away from the interaction point and very close to the beamline (2–3 mm). This implies the need of slim edges of about 100–200 μm width for the sensor side facing the beam to minimise the dead area. Another challenge is an expected non-uniform irradiation of the pixel sensors. It is studied if these requirements can be met using slightly-modified FE-I4 3D pixel sensors from the ATLAS Insertable B-Layer production. AFP-compatible slim edges are obtained with a simple diamond-saw cut. Electrical characterisations and beam tests are carried out and no detrimental impact on the leakage current and hit efficiency is observed. For devices without a 3D guard ring a remaining insensitive edge of less than 15 μm width is found. Moreover, 3D detectors are non-uniformly irradiated up to fluences of several 1015 neq/cm2 with either a focussed 23 GeV proton beam or a 23 MeV proton beam through holes in Al masks. The efficiency in the irradiated region is found to be similar to the one in the non-irradiated region and exceeds 97% in case of favourable chip-parameter settings. Only in a narrow transition area at the edge of the hole in the Al mask, a significantly lower efficiency is seen. A follow-up study of this effect using arrays of small pad diodes for position-resolved dosimetry via the leakage current is carried out

  20. ATLAS Pixel Detector ROD card from IBL towards Layers 2 and 1

    Science.gov (United States)

    Balbi, G.; Falchieri, D.; Gabrielli, A.; Lama, L.; Giangiacomi, N.; Travaglini, R.

    2016-01-01

    The incoming and future upgrades of LHC will require better performance by the data acquisition system, especially in terms of throughput due to the higher luminosity that is expected. For this reason, during the first shutdown of the LHC collider in 2013/14, the ATLAS Pixel Detector has been equipped with a fourth layer— the Insertable B-Layer or IBL—located at a radius smaller than the present three layers. To read out the new layer of pixels, with a smaller pixel size with respect to the other outer layers, a front end ASIC (FE-I4) was designed as well as a new off-detector read-out chain. The latter, accordingly to the structure of the other layers of pixels, is composed mainly of two 9U-VME read-out off-detector cards called the Back-Of-Crate (BOC) and Read-Out Driver (ROD). The ROD is used for data and event formatting and for configuration and control of the overall read-out electronics. After some prototyping samples were completed, a pre-production batch of 5 ROD cards was delivered with the final layout. Another production of 15 ROD cards was done in Fall 2013, and commissioning was completed in 2014. Altogether 14 cards are necessary for the 14 staves of the IBL detector, one additional card is required by the Diamond Beam Monitor (DBM), and additional spare ROD cards were produced for a total initial batch of 20 boards. This paper describes some integration tests that were performed and our plan to install the new DAQ chain for the layer 2, which is the outermost, and layer 1, which is external to the B-layer. This latter is the only layer that will not be upgraded to a higher readout speed. Rather, it will be switched off in the near future as it has too many damaged sensors that were not possible to rework. To do that, slices of the IBL read-out chain have been instrumented, and ROD performance is verified on a test bench mimicking a small-sized final setup. Thus, this contribution reports also how the adoption of the IBL ROD for ATLAS Pixel

  1. Firmware development and testing of the ATLAS Pixel Detector / IBL ROD card

    CERN Document Server

    Gabrielli, Alessandro; The ATLAS collaboration; Balbi, Gabriele; Bindi, Marcello; Chen, Shaw-pin; Falchieri, Davide; Flick, Tobias; Hauck, Scott Alan; Hsu, Shih-Chieh; Kretz, Moritz; Kugel, Andreas; Lama, Luca; Travaglini, Riccardo; Wensing, Marius; ATLAS Pixel Collaboration

    2015-01-01

    The ATLAS Experiment is reworking and upgrading systems during the current LHC shut down. In particular, the Pixel detector has inserted an additional inner layer called Insertable B-Layer (IBL). The Readout-Driver card (ROD), the Back-of-Crate card (BOC), and the S-Link together form the essential frontend data path of the IBL’s off-detector DAQ system. The strategy for IBL ROD firmware development was three-fold: keeping as much of the Pixel ROD datapath firmware logic as possible, employing a complete new scheme of steering and calibration firmware and designing the overall system to prepare for a future unified code version integrating IBL and Pixel layers. Essential features such as data formatting, frontend-specific error handling, and calibration are added to the ROD data path. An IBL DAQ testbench using realistic frontend chip model was created to serve as an initial framework for full offline electronic system simulation. In this document, major firmware achievements concerning the IBL ROD data pat...

  2. Firmware development and testing of the ATLAS Pixel Detector / IBL ROD card

    CERN Document Server

    Balbi, G; The ATLAS collaboration; Gabrielli, A; Lama, L; Travaglini, R; Backhaus, M; Bindi, M; Chen, S-P; Flick, T; Kretz, M; Kugel, A; Wensing, M

    2014-01-01

    The ATLAS Experiment is reworking and upgrading systems during the current LHC shut down. In particular, the Pixel detector has inserted an additional inner layer called Insertable B-Layer (IBL). The Readout-Driver card (ROD), the Back-of-Crate card (BOC), and the S-Link together form the essential frontend data path of the IBL’s off-detector DAQ system. The strategy for IBLROD firmware development was three-fold: keeping as much of the PixelROD datapath firmware logic as possible, employing a complete new scheme of steering and calibration firmware and designing the overall system to prepare for a future unified code version integrating IBL and Pixel layers. Essential features such as data formatting, frontend-specific error handling, and calibration are added to the ROD data path. An IBLDAQ testbench using realistic frontend chip model was created to serve as an initial framework for full offline electronic system simulation. In this document, major firmware achievements concerning the IBLROD data path im...

  3. System test and noise performance studies at the ATLAS pixel detector

    International Nuclear Information System (INIS)

    The central component of the ATLAS Inner Tracker is the pixel detector. It consists of three barrel layers and three disk-layers in the end-caps in both forward directions. The innermost barrel layer is mounted at a distance of about 5 cm from the interaction region. With its very high granularity, truly two-dimensional hit information, and fast readout it is well suited to cope with the high densities of charged tracks, expected this close to the interaction region. The huge number of readout channels necessitates a very complex services infrastructure for powering, readout and safety. After a description of the pixel detector and its services infrastructure, key results from the system test at CERN are presented. Furthermore the noise performance of the pixel detector, crucial for high tracking and vertexing efficiencies, is studied. Measurements of the single-channel random noise are presented together with studies of common mode noise and measurements of the noise occupancy using a random trigger generator. (orig.)

  4. System test and noise performance studies at the ATLAS pixel detector

    Energy Technology Data Exchange (ETDEWEB)

    Weingarten, J.

    2007-09-15

    The central component of the ATLAS Inner Tracker is the pixel detector. It consists of three barrel layers and three disk-layers in the end-caps in both forward directions. The innermost barrel layer is mounted at a distance of about 5 cm from the interaction region. With its very high granularity, truly two-dimensional hit information, and fast readout it is well suited to cope with the high densities of charged tracks, expected this close to the interaction region. The huge number of readout channels necessitates a very complex services infrastructure for powering, readout and safety. After a description of the pixel detector and its services infrastructure, key results from the system test at CERN are presented. Furthermore the noise performance of the pixel detector, crucial for high tracking and vertexing efficiencies, is studied. Measurements of the single-channel random noise are presented together with studies of common mode noise and measurements of the noise occupancy using a random trigger generator. (orig.)

  5. Studio di un algoritmo lineare di ricostruzione analogica della posizione per il rivelatore a pixel di ATLAS

    CERN Document Server

    Arelli-Maffioli, A; Troncon, C; Lari, T

    2007-01-01

    A detailed study of spatial resolution of Atlas pixel sensors prototypes was performed. Charge interpolation was used and allowed for a significant improvement with respect to digital resolution. A simplified algorithm for charge interpolation was developed. Its application to both unirradiated and irradiated sensors is presented and discussed.

  6. Ongoing studies for the control system of a serially powered ATLAS pixel detector at the HL-LHC

    Science.gov (United States)

    Kersten, S.; Püllen, L.; Zeitnitz, C.

    2016-02-01

    In terms of the phase-2 upgrade of the ATLAS detector, the entire inner tracker (ITk) of ATLAS will be replaced. This includes the pixel detector and the corresponding detector control system (DCS). The current baseline is a serial powering scheme of the detector modules. Therefore a new detector control system is being developed with emphasis on the supervision of serially powered modules. Previous chips had been designed to test the radiation hardness of the technology and the implementation of the modified I2C as well as the implementation of the logic of the CAN protocol. This included tests with triple redundant registers. The described chip is focusing on the implementation in a serial powering scheme. It was designed for laboratory tests, aiming for the proof of principle. The concept of the DCS for ATLAS pixel after the phase-2 upgrade is presented as well as the status of development including tests with the prototype ASIC.

  7. Experience in fabrication of multichip-modules for the ATLAS pixel detector

    International Nuclear Information System (INIS)

    About 1100 ATLAS bare modules will be assembled at Fraunhofer IZM. The bumping and assembly technology of these multichip-modules is described in this paper. Pixel contacts and lead-tin interconnection bumps are deposited by electroplating. A high yield manufacturing technology requires electrical test and optical inspection on wafer level as well as on chip level. In this paper, the result of optical inspection of more than 7600 readout chips is presented. Handling mistakes are the main reason for rejection of chips before flip chip assembly. A reliable process technology, the assembly of electrical Known Good Die (KGD), optical inspection after bumping and the development of a single chip repair technology result in 98% of good modules after flip chip assembly. The reliability of the bump interconnections was even checked by thermal cycling and accelerated thermal aging

  8. Beam test studies of 3D pixel sensors irradiated non-uniformly for the ATLAS forward physics detector

    International Nuclear Information System (INIS)

    Pixel detectors with cylindrical electrodes that penetrate the silicon substrate (so called 3D detectors) offer advantages over standard planar sensors in terms of radiation hardness, since the electrode distance is decoupled from the bulk thickness. In recent years significant progress has been made in the development of 3D sensors, which culminated in the sensor production for the ATLAS Insertable B-Layer (IBL) upgrade carried out at CNM (Barcelona, Spain) and FBK (Trento, Italy). Based on this success, the ATLAS Forward Physics (AFP) experiment has selected the 3D pixel sensor technology for the tracking detector. The AFP project presents a new challenge due to the need for a reduced dead area with respect to IBL, and the in-homogeneous nature of the radiation dose distribution in the sensor. Electrical characterization of the first AFP prototypes and beam test studies of 3D pixel devices irradiated non-uniformly are presented in this paper

  9. Beam test studies of 3D pixel sensors irradiated non-uniformly for the ATLAS forward physics detector

    Energy Technology Data Exchange (ETDEWEB)

    Grinstein, S., E-mail: sgrinstein@ifae.es [ICREA and Institut de Física d' Altes Energies (IFAE), Barcelona (Spain); Baselga, M. [Centro Nacional de Microelectronica, CNM-IMB (CSIC), Barcelona (Spain); Boscardin, M. [Fondazione Bruno Kessler, FBK-CMM, Trento (Italy); Christophersen, M. [U.S. Naval Research Laboratory, Washington (United States); Da Via, C. [School of Physics and Astronomy, University of Manchester, Manchester (United Kingdom); Dalla Betta, G.-F. [Universita degli Studi di Trento and INFN, Trento (Italy); Darbo, G. [INFN Sezione di Genova, Genova (Italy); Fadeyev, V. [Santa Cruz Institute for Particle Physics, University of California, Santa Cruz (United States); Fleta, C. [Centro Nacional de Microelectronica, CNM-IMB (CSIC), Barcelona (Spain); Gemme, C. [Universita degli Studi di Trento and INFN, Trento (Italy); Grenier, P. [SLAC National Accelerator Laboratory, Menlo Park (United States); Jimenez, A.; Lopez, I.; Micelli, A. [ICREA and Institut de Física d' Altes Energies (IFAE), Barcelona (Spain); Nelist, C. [INFN Sezione di Genova, Genova (Italy); Parker, S. [University of Hawaii, c/o Lawrence Berkeley Laboratory, Berkeley (United States); Pellegrini, G. [Centro Nacional de Microelectronica, CNM-IMB (CSIC), Barcelona (Spain); Phlips, B. [U.S. Naval Research Laboratory, Washington (United States); Pohl, D.-L. [University of Bonn, Bonn (Germany); Sadrozinski, H.F.-W. [Santa Cruz Institute for Particle Physics, University of California, Santa Cruz (United States); and others

    2013-12-01

    Pixel detectors with cylindrical electrodes that penetrate the silicon substrate (so called 3D detectors) offer advantages over standard planar sensors in terms of radiation hardness, since the electrode distance is decoupled from the bulk thickness. In recent years significant progress has been made in the development of 3D sensors, which culminated in the sensor production for the ATLAS Insertable B-Layer (IBL) upgrade carried out at CNM (Barcelona, Spain) and FBK (Trento, Italy). Based on this success, the ATLAS Forward Physics (AFP) experiment has selected the 3D pixel sensor technology for the tracking detector. The AFP project presents a new challenge due to the need for a reduced dead area with respect to IBL, and the in-homogeneous nature of the radiation dose distribution in the sensor. Electrical characterization of the first AFP prototypes and beam test studies of 3D pixel devices irradiated non-uniformly are presented in this paper.

  10. Beam Test Studies of 3D Pixel Sensors Irradiated Non-Uniformly for the ATLAS Forward Physics Detector

    CERN Document Server

    Grinstein, S; Boscardin, M; Christophersen, M; Da Via, C; Betta, G -F Dalla; Darbo, G; Fadeyev, V; Fleta, C; Gemme, C; Grenier, P; Jimenez, A; Lopez, I; Micelli, A; Nelist, C; Parker, S; Pellegrini, G; Phlips, B; Pohl, D L; Sadrozinski, H F -W; Sicho, P; Tsiskaridze, S

    2013-01-01

    Pixel detectors with cylindrical electrodes that penetrate the silicon substrate (so called 3D detectors) offer advantages over standard planar sensors in terms of radiation hardness, since the electrode distance is decoupled from the bulk thickness. In recent years significant progress has been made in the development of 3D sensors, which culminated in the sensor production for the ATLAS Insertable B-Layer (IBL) upgrade carried out at CNM (Barcelona, Spain) and FBK (Trento, Italy). Based on this success, the ATLAS Forward Physics (AFP) experiment has selected the 3D pixel sensor technology for the tracking detector. The AFP project presents a new challenge due to the need for a reduced dead area with respect to IBL, and the in-homogeneous nature of the radiation dose distribution in the sensor. Electrical characterization of the first AFP prototypes and beam test studies of 3D pixel devices irradiated non-uniformly are presented in this paper.

  11. Studio di Rivelatori a Pixel di nuova generazione per il Sistema di Tracciamento di ATLAS.

    CERN Document Server

    Gaudiello, Andrea; Schiavi, Carlo

    In 2013 the LHC will undergo a long shutdown (Phase 0) in preparation for a an energy and luminosity upgrade. During this period the ATLAS Pixel Detector (that is the tracking detector closest to the beamline) will be upgraded. The new detector, called Insertable B-Layer (IBL), will be installed between the existing pixel detector and a new beam-pipe of smaller radius in order to ensure and maintain excellent performance of tracking, vertexing and jet flavor tagging. To satisfy the new requirements a new electronic front- end (FE-I4) and 2 sensor technologies have been developed: Planar and 3D. Genova is one of two sites dedicated to the assembly of the modules of IBL. The work is then carried out in two parallel directions: on one hand the production and its optimization; on the other the comparison and testing of these new technologies. Chapter 1 gives an overview of the theoretical framework needed to understand the importance and the goals of the experiments operating at the Large Hadron Collider (LHC), w...

  12. Three Generations of FPGA DAQ Development for the ATLAS Pixel Detector

    CERN Document Server

    AUTHOR|(CDS)2091916; Hsu, Shih-Chieh; Hauck, Scott Alan

    The Large Hadron Collider (LHC) at the European Center for Nuclear Research (CERN) tracks a schedule of long physics runs, followed by periods of inactivity known as Long Shutdowns (LS). During these LS phases both the LHC, and the experiments around its ring, undergo maintenance and upgrades. For the LHC these upgrades improve their ability to create data for physicists; the more data the LHC can create the more opportunities there are for rare events to appear that physicists will be interested in. The experiments upgrade so they can record the data and ensure the event won’t be missed. Currently the LHC is in Run 2 having completed the first LS of three. This thesis focuses on the development of Field-Programmable Gate Array (FPGA)-based readout systems that span across three major tasks of the ATLAS Pixel data acquisition (DAQ) system. The evolution of Pixel DAQ’s Readout Driver (ROD) card is presented. Starting from improvements made to the new Insertable B-Layer (IBL) ROD design, which was part of t...

  13. Silvaco ATLAS model of ESA's Gaia satellite e2v CCD91-72 pixels

    CERN Document Server

    Seabroke, G M; Burt, D; Robbins, M S; 10.1117/12.856958

    2010-01-01

    The Gaia satellite is a high-precision astrometry, photometry and spectroscopic ESA cornerstone mission, currently scheduled for launch in 2012. Its primary science drivers are the composition, formation and evolution of the Galaxy. Gaia will achieve its unprecedented accuracy requirements with detailed calibration and correction for CCD radiation damage and CCD geometric distortion. In this paper, the third of the series, we present our 3D Silvaco ATLAS model of the Gaia e2v CCD91-72 pixel. We publish e2v's design model predictions for the capacities of one of Gaia's pixel features, the supplementary buried channel (SBC), for the first time. Kohley et al. (2009) measured the SBC capacities of a Gaia CCD to be an order of magnitude smaller than e2v's design. We have found the SBC doping widths that yield these measured SBC capacities. The widths are systematically 2 {\\mu}m offset to the nominal widths. These offsets appear to be uncalibrated systematic offsets in e2v photolithography, which could either be du...

  14. Development of Edgeless n-on-p Planar Pixel Sensors for future ATLAS Upgrades

    CERN Document Server

    Bomben, M; Boscardin, M; Bosisio, L; Calderini, G; Chauveau, J; Giacomini, G; La Rosa, A; Marchori, G; Zorzi, N

    2012-01-01

    The development of n-on-p "edgeless" planar pixel sensors being fabricated at FBK (Trento, Italy), aimed at the upgrade of the ATLAS Inner Detector for the High Luminosity phase of the Large Hadron Collider (HL-LHC), is reported. A characterizing feature of the devices is the reduced dead area at the edge, achieved by adopting the "active edge" technology, based on a deep etched trench, suitably doped to make an ohmic contact to the substrate. The project is presented, along with the active edge process, the sensor design for this first n-on-p production and a selection of simulation results, including the expected charge collection efficiency after radiation fluence of $1 \\times 10^{15} {\\rm n_{eq}}/{\\rm cm}^2$ comparable to those expected at HL-LHC (about ten years of running, with an integrated luminosity of 3000 fb$^{-1}$) for the outer pixel layers. We show that, after irradiation, more than 50% of the signal should be collected in the edge region; this confirms the validity of the active edge approach.

  15. Development of Edgeless n-on-p Planar Pixel Sensors for future ATLAS Upgrades

    CERN Document Server

    Bomben, M

    2013-01-01

    The development of n-on-p “edgeless” planar pixel sensors being fabricated at FBK (Trento, Italy), aimed at the upgrade of the ATLAS Inner Detector for the High Luminosity phase of the Large Hadron Collider (HL-LHC), is reported. A characterizing feature of the devices is the reduced dead area at the edge, achieved by adopting the “active edge” technology, based on a deep etched trench, suitably doped to make an ohmic contact to the substrate. The project is presented, along with the active edge process, the sensor design for this first n-on-p production and a selection of simulation results, including the expected charge collection efficiency after radiation fluence of View the MathML source1×1015neq/cm2 comparable to those expected at HL-LHC (about ten years of running, with an integrated luminosity of 3000 fb−1) for the outer pixel layers. We show that, after irradiation and at a bias voltage of 500 V, more than 50% of the signal should be collected in the edge region; this confirms the validity...

  16. Development of edgeless n-on-p planar pixel sensors for future ATLAS upgrades

    Science.gov (United States)

    Bomben, Marco; Bagolini, Alvise; Boscardin, Maurizio; Bosisio, Luciano; Calderini, Giovanni; Chauveau, Jacques; Giacomini, Gabriele; La Rosa, Alessandro; Marchiori, Giovanni; Zorzi, Nicola

    2013-06-01

    The development of n-on-p "edgeless" planar pixel sensors being fabricated at FBK (Trento, Italy), aimed at the upgrade of the ATLAS Inner Detector for the High Luminosity phase of the Large Hadron Collider (HL-LHC), is reported. A characterizing feature of the devices is the reduced dead area at the edge, achieved by adopting the "active edge" technology, based on a deep etched trench, suitably doped to make an ohmic contact to the substrate. The project is presented, along with the active edge process, the sensor design for this first n-on-p production and a selection of simulation results, including the expected charge collection efficiency after radiation fluence of 1×1015 neq/cm2 comparable to those expected at HL-LHC (about ten years of running, with an integrated luminosity of 3000 fb-1) for the outer pixel layers. We show that, after irradiation and at a bias voltage of 500 V, more than 50% of the signal should be collected in the edge region; this confirms the validity of the active edge approach.

  17. Commissioning of the Atlas pixel detector and search of the Higgs boson in the tt-H, H → bb- channel with the Atlas experiment at the LHC

    International Nuclear Information System (INIS)

    The global fit of Higgs boson quantum contributions to the electroweak experimental observables, computed within the Standard Model, favors a light Higgs boson with a mass of mH = 90-27+36 GeV, on the edge of the 95% Confidence Level region excluded by LEP. Finding a light Higgs boson at LHC is experimentally difficult and several channels with various signatures will be sought for. The associated production of the Higgs boson with a pair of top quarks, with the subsequent decay of the Higgs boson into b-quark pairs (dominant for mH <135 GeV), is one of the channels considered. This channel opens the possibility of measuring the top and b-quark Yukawa couplings. The potential of the ATLAS detector to observe this channel is described. Several ingredients are crucial: the reconstruction of the top-anti-top system with a high-purity, excellent b-tagging capabilities and good knowledge of the tt-bar+jets background. The pixel detector is the most important ATLAS sub-detectors for tagging b -jets. The ATLAS detector was commissioned with cosmic muon rays in autumn 2008. The pixel detector dead channels, calibration constants and slow control informations are described for this period. A detailed study about pixel noise determination and suppression is presented. Finally, the pixel detection efficiency is measured using cosmic muon rays. (author)

  18. TFA pixel sensor technology for vertex detectors

    OpenAIRE

    Jarron, P.; Moraes, D.; Despeisse, M.; Dissertori, G.; Dunand, S.; Kaplon. J.; Miazza, C.; Shah, Arvind; Viertel, G M.; Wyrsch, Nicolas

    2008-01-01

    Pixel microvertex detectors at the SLHC and a future linear collider face very challenging issues: extreme radiation hardness, cooling design, interconnections density and fabrication cost. As an alternative approach we present a novel pixel detector based on the deposition of a Hydrogenated Amorphous Silicon (a-Si:H) film on top of a readout ASIC. The Thin-Film on ASIC (TFA) technology is inspired by an emerging microelectronic technology envisaged for visible light Active Pixel Sensor (APS)...

  19. Module concepts with ultra thin FE chips and Through Silicon Vias for the upgrades of the ATLAS pixel detector

    International Nuclear Information System (INIS)

    The development of trackers for High Energy Physics experiments at high luminosity poses strict requirements on the material budget to allow good vertexing and b-tagging performance. State-of-the-art silicon technologies offer a variety of processes that can be used to achieve light modules design. Together with IZM Berlin we investigated the thinning of FE (Front-End) chips down to 90 μm, and developed a dedicated flip chip process to assure a reliable mechanical and electrical connection between thin FE chips and sensor. The selected flip chip method is currently used for the production of modules for the IBL (Insertable B-Layer) project, the first ATLAS pixel detector upgrade. Results from the characterization of IBL modules with 100 and 150 μm thin FE chip are shown. For future upgrades of the ATLAS pixel detector we propose more advanced module concepts with Through Silicon Vias (TSVs). IZM offers two via last TSV processes, Straight Side Wall TSVs and Tapered Side Wall TSVs. Both processes were successfully demonstrated with ATLAS pixel readout electronics (FE-I2/3). Results from prototype modules with planar sensor and 90 μm thin FE-I2 with Tapered TSV and back side redistribution layer are shown.

  20. Prototypes for components of a control system for the ATLAS pixel detector at the HL-LHC

    International Nuclear Information System (INIS)

    In the years around 2020 an upgrade of the LHC to the HL-LHC is scheduled, which will increase the accelerator's instantaneous luminosity by a factor of 5 and the integrated luminosity by a factor of 10. In the context of this upgrade, the inner detector (including the pixel detector) of the ATLAS experiment will be replaced. This new pixel detector requires a specific control system which complies with strict requirements in terms of radiation hardness, material budget and space for the electronics in the ATLAS experiment. The University of Wuppertal is developing a concept for a DCS (Detector Control System) network consisting of two kinds of ASICs. The first ASIC is the DCS chip which is located on the pixel detector, very close to the interaction point. The second ASIC is the DCS Controller which is controlling 4×4 DCS chips from the outer regions of ATLAS via differential data lines. Both ASICs are manufactured in 130 nm deep sub-micron technology. We present results from reliability measurements under irradiation from new prototypes of components for the DCS network.

  1. Atlas pixel opto-board production and analysis and optolink simulation studies

    International Nuclear Information System (INIS)

    At CERN, a Large collider will collide protons at high energies. There are four experiments being built to study the particle properties from the collision. The ATLAS experiment is the largest. It has many sub detectors among which is the Pixel detector which is the innermost part. The Pixel detector has eighty million channels that have to be read out. An optical link is utilized for the read out. It has optical to electronic interfaces both on the detector and off the detector at the counting room. The component on the detector in called the opto-board. This work discusses the production testing of the opto-boards to be installed on the detector. A total of 300 opto-boards including spares have been produced. The production was done in three laboratories among which is the laboratory at the University of Wuppertal which had the responsibility of Post production testing of all the one third of the total opto-boards. The results are discussed in this work. The analysis of the results from the total production process has been done in the scope of this work as well. In addition to the production, a study by simulation of the communication links optical signal has been done. This has enabled an assessment of the sufficiency of the optical signal against the transmission attenuation and irradiation degradation. A System Test set up has been put up at Wuppertal to enhance general studies for better understanding of the Pixel read out system. Among other studies is the study of the timing parameters behavior of the System which has been done in this work and enhanced by a simulation. These parameters are namely the mark to space ratio and the fine delay and their relatedness during the optolink tuning. A bit error rate test based on the System has also been done which enabled assessment of the transmission quality utilizing the tools inbuilt in the System Test. These results have been presented in this work. (orig.)

  2. The Pixel Detector of the ATLAS experiment for the Run2 at the Large Hadron Collider -- Plot Approval (Pixel, IBL) : This is a submission of plot approval request for Pixel+IBL, facing on a talk at ICHEP 2014 conference

    CERN Document Server

    Mandelli, B; The ATLAS collaboration

    2014-01-01

    The Pixel Detector of the ATLAS experiment has shown excellent performance during the whole Run-1 of LHC. Taking advantage of the long showdown, the detector was extracted from the experiment and brought to surface, to equip it with new service quarter panels, to repair modules and to ease installation of the Insertable B-Layer (IBL). IBL is a fourth layer of pixel detectors, and will be installed in May 2014 between the existing Pixel Detector and a new smaller radius beam-pipe at a radius of 3.3 cm. To cope with the high radiation and pixel occupancy due to the proximity to the interaction point, a new read-out chip and two different silicon sensor technologies (planar and 3D) have been developed. Furthermore, the physics performance will be improved through the reduction of pixel size while, targeting for a low material budget, a new mechanical support using lightweight staves and a CO2 based cooling system have been adopted. IBL construction is now completed. An overview of the IBL project as well as the ...

  3. Active Pixel Sensors in ams H18/H35 HV-CMOS Technology for the ATLAS HL-LHC Upgrade

    CERN Document Server

    Ristic, Branislav

    2016-01-01

    Deep sub micron HV-CMOS processes offer the opportunity for sensors built by industry standard techniques while being HV tolerant, making them good candidates for drift-based, fast collecting, thus radiation-hard pixel detectors. For the upgrade of the ATLAS Pixel Detector towards the HL-LHC requirements, active pixel sensors in HV-CMOS technology were investigated. These implement amplifier and discriminator stages directly in insulating deep n-wells, which also act as collecting electrodes. The deep n-wells allow for bias voltages up to 150V leading to a depletion depth of several 10um. Prototype sensors in the ams H18 180nm and H35 350nm HV-CMOS processes have been manufactured, acting as a potential drop-in replacement for the current ATLAS Pixel sensors, thus leaving higher level processing such as trigger handling to dedicated read-out chips. Sensors were thoroughly tested in lab measurements as well as in testbeam experiments. Irradiation with X-rays and protons revealed a tolerance to ionizing doses o...

  4. Submission of the First Full Scale Prototype Chip for Upgraded ATLAS Pixel Detector at LHC, FE-I4A

    CERN Document Server

    Barbero, M; The ATLAS collaboration; Beccherle, R; Darbo, G; Dube, S; Elledge, D; Fleury, J; Fougeron, D; Garcia-Sciveres, M; Gensolen, F; Gnani, D; Gromov, V; Jensen, F; Hemperek, T; Karagounis, M; Kluit, R; Kruth, A; Mekkaoui, A; Menouni, M; Schipper, JD; Wermes, N; Zivkovic, V

    2010-01-01

    A new ATLAS pixel chip FE-I4 is being developed for use in upgraded LHC luminosity environments, including the near-term Insertable B-Layer (IBL) upgrade. FE-I4 is designed in a 130nm CMOS technology, presenting advantages in terms of radiation tolerance and digital logic density compared to the 250nm CMOS technology used for the current ATLAS pixel IC, FE-I3. The FE-I4 architecture is based on an array of 80x336 pixels, each 50x250um^2, consisting of analog and digital sections. In the summer 2010, a first full scale prototype FE-I4A was submitted for an engineering run. This IC features the full scale pixel array as well as the complex periphery of the future full-size FE-I4. The FE-I4A contains also various extra test features which should prove very useful for the chip characterization, but deviate from the needs for standard operation of the final FE-I4 for IBL. In this paper, focus will be brought to the various features implemented in the FE-I4A submission, while also underlining the main differences b...

  5. Experience with 3D integration technologies in the framework of the ATLAS pixel detector upgrade for the HL-LHC

    CERN Document Server

    Aruntinov, D; Gonella, L; Hemperek, T; Hügging, F; Krüger, H; Wermes, N; Breugnon, P; Chantepie, B; Clemens, J.C; Fei, R; Fougeron, D; Godiot, S; Pangaud, P; Rozanov, A; Garcia-Sciveres, M; Mekkaoui, A

    2013-01-01

    3D technologies are investigated for the upgrade of the ATLAS pixel detector at the HL-LHC. R&D focuses on both, IC design in 3D, as well as on post-processing 3D technologies such as Through Silicon Via (TSV). The first one uses a so-called via first technology, featuring the insertion of small aspect ratio TSV at the pixel level. As discussed in the paper, this technology can still present technical challenges for the industrial partners. The second one consists of etching the TSV via last. This technology is investigated to enable 4-side abuttable module concepts, using today's pixel detector technology. Both approaches are presented in this paper and results from first available prototypes are discussed.

  6. Measurements and TCAD simulation of novel ATLAS planar pixel detector structures for the HL-LHC upgrade

    CERN Document Server

    Nellist, C; Gkougkousis, E; Lounis, A

    2015-01-01

    The LHC accelerator complex will be upgraded between 2020-2022, to the High-Luminosity-LHC, to considerably increase statistics for the various physics analyses. To operate under these challenging new conditions, and maintain excellent performance in track reconstruction and vertex location, the ATLAS pixel detector must be substantially upgraded and a full replacement is expected. Processing techniques for novel pixel designs are optimised through characterisation of test structures in a clean room and also through simulations with Technology Computer Aided Design (TCAD). A method to study non-perpendicular tracks through a pixel device is discussed. Comparison of TCAD simulations with Secondary Ion Mass Spectrometry (SIMS) measurements to investigate the doping profile of structures and validate the simulation process is also presented.

  7. Measurements and TCAD simulation of novel ATLAS planar pixel detector structures for the HL-LHC upgrade

    International Nuclear Information System (INIS)

    The LHC accelerator complex will be upgraded between 2020–2022, to the High-Luminosity-LHC, to considerably increase statistics for the various physics analyses. To operate under these challenging new conditions, and maintain excellent performance in track reconstruction and vertex location, the ATLAS pixel detector must be substantially upgraded and a full replacement is expected. Processing techniques for novel pixel designs are optimised through characterisation of test structures in a clean room and also through simulations with Technology Computer Aided Design (TCAD). A method to study non-perpendicular tracks through a pixel device is discussed. Comparison of TCAD simulations with Secondary Ion Mass Spectrometry (SIMS) measurements to investigate the doping profile of structures and validate the simulation process is also presented

  8. Development of hybrid pixel detectors for proton-proton collisions in the ATLAS experiment at the Large Hadron Collider at CERN

    International Nuclear Information System (INIS)

    The ATLAS experiment at the future large hadron collider at CERN uses a silicon pixel detector as the innermost tracking device. The detector is built using ∼2000 modules which consist of a silicon sensor and 16 bump bonded VLSI electronic readout chips with ∼3000 channels per chip. The requirements for the sensor and the 1.4 x 108 preamplifier channels are discussed. The architectures of several existing readout chips are described. Detailed laboratory measurements have been performed on all chips and the results are compared to the requirements of ATLAS. The performance of a first ATLAS compatible pixel detector assembly in a test beam at CERN is presented. (orig.)

  9. 3D silicon sensors: Design, large area production and quality assurance for the ATLAS IBL pixel detector upgrade

    International Nuclear Information System (INIS)

    3D silicon sensors, where electrodes penetrate the silicon substrate fully or partially, have successfully been fabricated in different processing facilities in Europe and USA. The key to 3D fabrication is the use of plasma micro-machining to etch narrow deep vertical openings allowing dopants to be diffused in and form electrodes of pin junctions. Similar openings can be used at the sensor's edge to reduce the perimeter's dead volume to as low as ∼4 μm. Since 2009 four industrial partners of the 3D ATLAS R and D Collaboration started a joint effort aimed at one common design and compatible processing strategy for the production of 3D sensors for the LHC Upgrade and in particular for the ATLAS pixel Insertable B-Layer (IBL). In this project, aimed for installation in 2013, a new layer will be inserted as close as 3.4 cm from the proton beams inside the existing pixel layers of the ATLAS experiment. The detector proximity to the interaction point will therefore require new radiation hard technologies for both sensors and front end electronics. The latter, called FE-I4, is processed at IBM and is the biggest front end of this kind ever designed with a surface of ∼4 cm2. The performance of 3D devices from several wafers was evaluated before and after bump-bonding. Key design aspects, device fabrication plans and quality assurance tests during the 3D sensors prototyping phase are discussed in this paper.

  10. The upgraded Pixel Detector of the ATLAS Experiment for Run-II at the Large Hadron Collider

    CERN Document Server

    Mullier, Geoffrey; The ATLAS collaboration

    2015-01-01

    The Pixel Detector of the ATLAS experiment has shown excellent performance during the whole Run-1 of the LHC. Taking advantage of the detector development period 2013 – 2014, the detector was extracted from the experiment and brought to surface to equip it with new service panels and to repair modules furthermore this helped with the installation of the Insertable B-Layer (IBL), fourth layer of pixel, installed in between the existing Pixel Detector and a new beam-pipe at a radius of 3.3 cm. To cope with the high radiation and increased pixel occupancy due to the proximity to the interaction point, two different silicon sensor technologies (planar and 3D) have been used. A new readout chip has been designed with CMOS 130nm technology with larger area, smaller pixel size and faster readout capability. Dedicated design features in combination with a new composite material were considered and used in order to reduce the material budget of the support structure while keeping the optimal thermo-mechanical perfor...

  11. A Parallel FPGA Implementation for Real-Time 2D Pixel Clustering for the ATLAS Fast TracKer Processor

    CERN Document Server

    Sotiropoulou, C-L; The ATLAS collaboration; Annovi, A; Beretta, M; Kordas, K; Nikolaidis, S; Petridou, C; Volpi, G

    2014-01-01

    The parallel 2D pixel clustering FPGA implementation used for the input system of the ATLAS Fast TracKer (FTK) processor is presented. The input system for the FTK processor will receive data from the Pixel and micro-strip detectors from inner ATLAS read out drivers (RODs) at full rate, for total of 760Gbs, as sent by the RODs after level-1 triggers. Clustering serves two purposes, the first is to reduce the high rate of the received data before further processing, the second is to determine the cluster centroid to obtain the best spatial measurement. For the pixel detectors the clustering is implemented by using a 2D-clustering algorithm that takes advantage of a moving window technique to minimize the logic required for cluster identification. The cluster detection window size can be adjusted for optimizing the cluster identification process. Additionally, the implementation can be parallelized by instantiating multiple cores to identify different clusters independently thus exploiting more FPGA resources. ...

  12. A Parallel FPGA Implementation for Real-Time 2D Pixel Clustering for the ATLAS Fast TracKer Processor

    CERN Document Server

    Sotiropoulou, C-L; The ATLAS collaboration; Annovi, A; Beretta, M; Kordas, K; Nikolaidis, S; Petridou, C; Volpi, G

    2014-01-01

    The parallel 2D pixel clustering FPGA implementation used for the input system of the ATLAS Fast TracKer (FTK) processor is presented. The input system for the FTK processor will receive data from the Pixel and micro-strip detectors from inner ATLAS read out drivers (RODs) at full rate, for total of 760Gbs, as sent by the RODs after level1 triggers. Clustering serves two purposes, the first is to reduce the high rate of the received data before further processing, the second is to determine the cluster centroid to obtain the best spatial measurement. For the pixel detectors the clustering is implemented by using a 2D-clustering algorithm that takes advantage of a moving window technique to minimize the logic required for cluster identification. The cluster detection window size can be adjusted for optimizing the cluster identification process. Additionally, the implementation can be parallelized by instantiating multiple cores to identify different clusters independently thus exploiting more FPGA resources. T...

  13. Thin n-in-p planar pixel sensors and active edge sensors for the ATLAS upgrade at HL-LHC

    CERN Document Server

    Terzo, S; Nisius, R; Paschen, B

    2014-01-01

    Silicon pixel modules employing n-in-p planar sensors with an active thickness of 200 $\\mu$m, produced at CiS, and 100-200 $\\mu$m thin active/slim edge sensor devices, produced at VTT in Finland have been interconnected to ATLAS FE-I3 and FE-I4 read-out chips. The thin sensors are designed for high energy physics collider experiments to ensure radiation hardness at high fluences. Moreover, the active edge technology of the VTT production maximizes the sensitive region of the assembly, allowing for a reduced overlap of the modules in the pixel layer close to the beam pipe. The CiS production includes also four chip sensors according to the module geometry planned for the outer layers of the upgraded ATLAS pixel detector to be operated at the HL-LHC. The modules have been characterized using radioactive sources in the laboratory and with high precision measurements at beam tests to investigate the hit efficiency and charge collection properties at different bias voltages and particle incidence angles. The perfo...

  14. Thin n-in-p planar pixel sensors and active edge sensors for the ATLAS upgrade at HL-LHC

    Science.gov (United States)

    Terzo, S.; Macchiolo, A.; Nisius, R.; Paschen, B.

    2014-12-01

    Silicon pixel modules employing n-in-p planar sensors with an active thickness of 200 μm, produced at CiS, and 100-200 μm thin active/slim edge sensor devices, produced at VTT in Finland have been interconnected to ATLAS FE-I3 and FE-I4 read-out chips. The thin sensors are designed for high energy physics collider experiments to ensure radiation hardness at high fluences. Moreover, the active edge technology of the VTT production maximizes the sensitive region of the assembly, allowing for a reduced overlap of the modules in the pixel layer close to the beam pipe. The CiS production includes also four chip sensors according to the module geometry planned for the outer layers of the upgraded ATLAS pixel detector to be operated at the HL-LHC. The modules have been characterized using radioactive sources in the laboratory and with high precision measurements at beam tests to investigate the hit efficiency and charge collection properties at different bias voltages and particle incidence angles. The performance of the different sensor thicknesses and edge designs are compared before and after irradiation up to a fluence of 1.4 × 1016 neq/cm2.

  15. Thin n-in-p planar pixel sensors and active edge sensors for the ATLAS upgrade at HL-LHC

    International Nuclear Information System (INIS)

    Silicon pixel modules employing n-in-p planar sensors with an active thickness of 200 μm, produced at CiS, and 100-200 μm thin active/slim edge sensor devices, produced at VTT in Finland have been interconnected to ATLAS FE-I3 and FE-I4 read-out chips. The thin sensors are designed for high energy physics collider experiments to ensure radiation hardness at high fluences. Moreover, the active edge technology of the VTT production maximizes the sensitive region of the assembly, allowing for a reduced overlap of the modules in the pixel layer close to the beam pipe. The CiS production includes also four chip sensors according to the module geometry planned for the outer layers of the upgraded ATLAS pixel detector to be operated at the HL-LHC. The modules have been characterized using radioactive sources in the laboratory and with high precision measurements at beam tests to investigate the hit efficiency and charge collection properties at different bias voltages and particle incidence angles. The performance of the different sensor thicknesses and edge designs are compared before and after irradiation up to a fluence of 1.4 × 1016 neq/cm2

  16. Development of Edgeless Silicon Pixel Sensors on p-type substrate for the ATLAS High-Luminosity Upgrade

    CERN Document Server

    Calderini, G; Bomben, M; Boscardin, M; Bosisio, L; Chauveau, J; Giacomini, G; La Rosa, A; Marchiori, G; Zorzi, N

    2014-01-01

    In view of the LHC upgrade for the high luminosity phase (HL-LHC), the ATLAS experiment is planning to replace the inner detector with an all-silicon system. The n-in-p bulk technology represents a valid solution for the modules of most of the layers, given the significant radiation hardness of this option and the reduced cost. The large area necessary to instrument the outer layers will demand to tile the sensors, a solution for which the inefficient region at the border of each sensor needs to be reduced to the minimum size. This paper reports on a joint R&D project by the ATLAS LPNHE Paris group and FBK Trento on a novel n-in-p edgeless planar pixel design, based on the deep-trench process available at FBK.

  17. Selected results from the static characterization of edgeless n-on-p planar pixel sensors for ATLAS upgrades

    CERN Document Server

    Giacomini, Gabriele; Bomben, Marco; Boscardin, Maurizio; Bosisio, Luciano; Calderini, Giovanni; Chauveau, Jacques; La Rosa, Alessandro; Marchiori, Giovanni; Zorzi, Nicola

    2014-01-01

    In view of the LHC upgrade for the High Luminosity Phase (HL-LHC), the ATLAS experiment is planning to replace the Inner Detector with an all-Silicon system. The n-on-p technology represents a valid solution for the modules of most of the layers, given the significant radiation hardness of this option and the reduced cost. There is also the demand to reduce the inactive areas to a minimum. The ATLAS LPNHE Paris group and FBK Trento started a collaboration for the development on a novel n-on-p edgeless planar pixel design, based on the deep-trench process which can cope with all these requirements. This paper reports selected results from the electrical characterization, both before and after irradiation, of test structures from the first production batch.

  18. Thin n-in-p planar pixel sensors and active edge sensors for the ATLAS upgrade at HL-LHC

    OpenAIRE

    Terzo, S.; Macchiolo, A; Nisius, R.; Paschen, B.

    2014-01-01

    Silicon pixel modules employing n-in-p planar sensors with an active thickness of 200 $\\mu$m, produced at CiS, and 100-200 $\\mu$m thin active/slim edge sensor devices, produced at VTT in Finland have been interconnected to ATLAS FE-I3 and FE-I4 read-out chips. The thin sensors are designed for high energy physics collider experiments to ensure radiation hardness at high fluences. Moreover, the active edge technology of the VTT production maximizes the sensitive region of the assembly, allowin...

  19. Performance of Edgeless Silicon Pixel Sensors on p-type substrate for the ATLAS High-Luminosity Upgrade

    CERN Document Server

    Bomben, Marco; Boscardin, Maurizio; Bosisio, Luciano; Calderini, Giovanni; Chauveau, Jacques; Ducourthial, Audrey; Giacomini, Gabriele; Marchiori, Giovanni; Zorzi, Nicola

    2016-01-01

    In view of the LHC upgrade phases towards the High Luminosity LHC (HL-LHC), the ATLAS experiment plans to upgrade the Inner Detector with an all-silicon system. The n-on-p silicon technology is a promising candidate to achieve a large area instrumented with pixel sensors, since it is radiation hard and cost effective. The paper reports on the performance of novel n-on-p edgeless planar pixel sensors produced by FBK-CMM, making use of the active trench for the reduction of the dead area at the periphery of the device. After discussing the sensor technology an overview of the first beam test results will be given.

  20. A parallel FPGA implementation for real-time 2D pixel clustering for the ATLAS Fast Tracker Processor

    Science.gov (United States)

    Sotiropoulou, C. L.; Gkaitatzis, S.; Annovi, A.; Beretta, M.; Kordas, K.; Nikolaidis, S.; Petridou, C.; Volpi, G.

    2014-10-01

    The parallel 2D pixel clustering FPGA implementation used for the input system of the ATLAS Fast TracKer (FTK) processor is presented. The input system for the FTK processor will receive data from the Pixel and micro-strip detectors from inner ATLAS read out drivers (RODs) at full rate, for total of 760Gbs, as sent by the RODs after level-1 triggers. Clustering serves two purposes, the first is to reduce the high rate of the received data before further processing, the second is to determine the cluster centroid to obtain the best spatial measurement. For the pixel detectors the clustering is implemented by using a 2D-clustering algorithm that takes advantage of a moving window technique to minimize the logic required for cluster identification. The cluster detection window size can be adjusted for optimizing the cluster identification process. Additionally, the implementation can be parallelized by instantiating multiple cores to identify different clusters independently thus exploiting more FPGA resources. This flexibility makes the implementation suitable for a variety of demanding image processing applications. The implementation is robust against bit errors in the input data stream and drops all data that cannot be identified. In the unlikely event of missing control words, the implementation will ensure stable data processing by inserting the missing control words in the data stream. The 2D pixel clustering implementation is developed and tested in both single flow and parallel versions. The first parallel version with 16 parallel cluster identification engines is presented. The input data from the RODs are received through S-Links and the processing units that follow the clustering implementation also require a single data stream, therefore data parallelizing (demultiplexing) and serializing (multiplexing) modules are introduced in order to accommodate the parallelized version and restore the data stream afterwards. The results of the first hardware tests of

  1. High-voltage pixel detectors in commercial CMOS technologies for ATLAS, CLIC and Mu3e experiments

    CERN Document Server

    Peric,I et al.

    2013-01-01

    High-voltage particle detectors in commercial CMOS technologies are a detector family that allows implementation of low-cost, thin and radiation-tolerant detectors with a high time resolution. In the R/D phase of the development, a radiation tolerance of 1015 neq=cm2 , nearly 100% detection efficiency and a spatial resolution of about 3 μm were demonstrated. Since 2011 the HV detectors have first applications: the technology is presently the main option for the pixel detector of the planned Mu3e experiment at PSI (Switzerland). Several prototype sensors have been designed in a standard 180 nm HV CMOS process and successfully tested. Thanks to its high radiation tolerance, the HV detectors are also seen at CERN as a promising alternative to the standard options for ATLAS upgrade and CLIC. In order to test the concept, within ATLAS upgrade R/D, we are currently exploring an active pixel detector demonstrator HV2FEI4; also implemented in the 180 nm HV process.

  2. High-voltage pixel detectors in commercial CMOS technologies for ATLAS, CLIC and Mu3e experiments

    CERN Document Server

    Peric, Ivan; Backhaus, Malte; Barbero, Marlon; Benoit, Mathieu; Berger, Niklaus; Bompard, Frederic; Breugnon, Patrick; Clemens, Jean-Claude; Dannheim, Dominik; Dierlamm, Alexander; Feigl, Simon; Fischer, Peter; Fougeron, Denis; Garcia-Sciveres, Maurice; Heim, Timon; Hügging, Fabian; Kiehn, Moritz; Kreidl, Christian; Krüger, Hans; La Rosa, Alessandro; Liu, Jian; Lütticke, Florian; Mariñas, Carlos; Meng, Lingxin; Miucci, Antonio; Münstermann, Daniel; Nguyen, Hong Hanh; Obermann, Theresa; Pangaud, Patrick; Perrevoort, Ann-Kathrin; Rozanov, Alexandre; Schöning, André; Schwenker, Benjamin; Wiedner, Dirk

    2013-01-01

    High-voltage particle detectors in commercial CMOS technologies are a detector family that allows implementation of low-cost, thin and radiation-tolerant detectors with a high time resolution. In the R/D phase of the development, a radiation tolerance of 10 15 n eq = cm 2 , nearly 100% detection ef fi ciency and a spatial resolution of about 3 μ m were demonstrated. Since 2011 the HV detectors have fi rst applications: the technology is presently the main option for the pixel detector of the planned Mu3e experiment at PSI (Switzerland). Several prototype sensors have been designed in a standard 180 nm HV CMOS process and successfully tested. Thanks to its high radiation tolerance, the HV detectors are also seen at CERN as a promising alternative to the standard options for ATLAS upgrade and CLIC. In order to test the concept, within ATLAS upgrade R/D, we are currently exploring an active pixel detector demonstrator HV2FEI4; also implemented in the 180 nm HV process

  3. High speed data transmission on small gauge cables for the ATLAS Phase-II Pixel detector upgrade

    Science.gov (United States)

    Shahinian, J.; Volk, J.; Fadeyev, V.; Grillo, A. A.; Meimban, B.; Nielsen, J.; Wilder, M.

    2016-03-01

    The High Luminosity LHC will present a number of challenges for the upgraded ATLAS detector. In particular, data transmission requirements for the upgrade of the ATLAS Pixel detector will be difficult to meet. The expected trigger rate and occupancy imply multi-gigabit per second transmission rates will be required but radiation levels at the smallest radius preclude completely optical solutions. Electrical transmission up to distances of 7m will be necessary to move optical components to an area with lower radiation levels. Here, we explore the use of small gauge electrical cables as a high-bandwidth, radiation hard solution with a sufficiently small radiation length. In particular, we present a characterization of various twisted wire pair (TWP) configurations of various material structures, including measurements of their bandwidth, crosstalk, and radiation hardness. We find that a custom ``hybrid'' cable consisting of 1m of a multi-stranded TWP with Poly-Ether-Ether-Ketone (PEEK) insulation and a thin Al shield followed by 6m of a thin twin-axial cable presents a low-mass solution that fulfills bandwidth requirements and is expected to be sufficiently radiation hard. Additionally, we discuss preliminary results of using measured S-parameters to produce a SPICE model for a 1m sample of the custom TWP to be used for the development of new pixel readout chips.

  4. High speed data transmission on small gauge cables for the ATLAS Phase-II Pixel detector upgrade

    International Nuclear Information System (INIS)

    The High Luminosity LHC will present a number of challenges for the upgraded ATLAS detector. In particular, data transmission requirements for the upgrade of the ATLAS Pixel detector will be difficult to meet. The expected trigger rate and occupancy imply multi-gigabit per second transmission rates will be required but radiation levels at the smallest radius preclude completely optical solutions. Electrical transmission up to distances of 7m will be necessary to move optical components to an area with lower radiation levels. Here, we explore the use of small gauge electrical cables as a high-bandwidth, radiation hard solution with a sufficiently small radiation length. In particular, we present a characterization of various twisted wire pair (TWP) configurations of various material structures, including measurements of their bandwidth, crosstalk, and radiation hardness. We find that a custom ''hybrid'' cable consisting of 1m of a multi-stranded TWP with Poly-Ether-Ether-Ketone (PEEK) insulation and a thin Al shield followed by 6m of a thin twin-axial cable presents a low-mass solution that fulfills bandwidth requirements and is expected to be sufficiently radiation hard. Additionally, we discuss preliminary results of using measured S-parameters to produce a SPICE model for a 1m sample of the custom TWP to be used for the development of new pixel readout chips

  5. Development of a Standardised Readout System for Active Pixel Sensors in HV/HR-CMOS Technologies for ATLAS Inner Detector Upgrades

    International Nuclear Information System (INIS)

    The LHC Phase-II Upgrade results in new challenges for tracking detectors for example in terms of cost effectiveness, resolution and radiation hardness. Active Pixel Sensors in HV/HR-CMOS technologies show promising results coping with these challenges. In order to demonstrate the feasibility of hybrid modules with active CMOS sensors and readout chips for the future ATLAS Inner Tracker, ATLAS R and D activities have started. After introducing the basic concepts and the demonstrator program, the development of an ATLAS compatible readout system will be presented as well as tuning procedures and measurements with demonstrator modules to test the readout system

  6. Design and development of the IBL-BOC firmware for the ATLAS Pixel IBL optical datalink system

    CERN Document Server

    AUTHOR|(INSPIRE)INSPIRE-00356268

    The Insertable $b$-Layer (IBL) is the first upgrade of the ATLAS Pixel detector at the LHC. It will be installed in the Pixel detector in 2013. The IBL will use a new sensor and readout technology, therefore the readout components of the current Pixel detector are redesigned for the readout of the IBL. In this diploma thesis the design and development of the firmware for the new IBL Back-of-Crate card (IBL-BOC) are described. The IBL-BOC is located on the off-detector side of the readout and performs the optical-electrical conversion and vice versa for the optical connection to and from the detector. To process the data transmitted to and received from the detector, the IBL-BOC uses multiple Field Programmable Gate Arrays (FPGA). The transmitted signal is a 40~Mb/s BiPhase Mark (BPM) encoded data stream, providing the timing, trigger and control to the detector. The received signal is a 160~Mb/s 8b10b encoded data stream, containing data from the detector. The IBL-BOC encodes and decodes these data streams. T...

  7. Development of thin sensors and a novel interconnection technology for the upgrade of the ATLAS pixel system

    International Nuclear Information System (INIS)

    A new pixel module concept is presented utilizing thin sensors and a novel vertical integration technique for the ATLAS pixel detector in view of the foreseen LHC luminosity upgrades. A first set of pixel sensors with active thicknesses of 75 and 150μm has been produced from wafers of standard thickness using a thinning process developed at the Max-Planck-Institut Halbleiterlabor (HLL) and the Max-Planck-Institut fuer Physik (MPP). Pre-irradiation characterizations of these sensors show a very good device yield and high break down voltage. First proton irradiations up to a fluence of 1015 neq cm-2 have been carried out and their impact on the electrical properties of thin sensors has been studied. The novel ICV-SLID vertical integration technology will allow for routing signals vertically to the back side of the readout chips. With this, four-side buttable detector devices with an increased active area fraction are made possible. A first production of SLID test structures was performed and showed a high connection efficiency for different pad sizes and a mild sensitivity to disturbances of the surface planarity.

  8. Qualification measurements of the voltage supply system as well as conceptionation of a state machine for the detector control of the ATLAS pixel detector

    International Nuclear Information System (INIS)

    The supply system and the control system of the ATLAS pixel detector represent important building blocks of the pixel detector. Corresponding studies of the supply system, which were performed within a comprehensive test system, the so-called system test, with nearly all final components and the effects on the pixel detector are object of this thesis. A further point of this thesis is the coordination and further development of the detector-control-system software under regardment of the different partial systems. A main topic represents thereby the conceptionation of the required state machine as interface for the users and the connection to the data acquisition system

  9. A neural network clustering algorithm for the ATLAS silicon pixel detector

    Czech Academy of Sciences Publication Activity Database

    Aad, G.; Abbott, B.; Abdallah, J.; Böhm, Jan; Chudoba, Jiří; Havránek, Miroslav; Hejbal, Jiří; Jakoubek, Tomáš; Kepka, Oldřich; Kupčo, Alexander; Kůs, Vlastimil; Lokajíček, Miloš; Lysák, Roman; Marčišovský, Michal; Mikeštíková, Marcela; Myška, M.; Němeček, Stanislav; Šícho, Petr; Staroba, Pavel; Svatoš, Michal; Taševský, Marek; Vrba, Václav

    2014-01-01

    Roč. 9, Sep (2014), s. 1-38. ISSN 1748-0221 R&D Projects: GA MŠk(CZ) LG13009 Institutional support: RVO:68378271 Keywords : Monte Carlo * resolution * impact parameter * cluster * ATLAS * tracks * charged particle * CERN LHC Coll * longitudinal * transverse * splitting Subject RIV: BF - Elementary Particles and High Energy Physics Impact factor: 1.399, year: 2014

  10. Radiationhard components for the control system of a future ATLAS pixel detector

    CERN Document Server

    Becker, K; Kersten, S; Kind, P; Mättig, P; Püllen, L; Zeitnitz, C

    2015-01-01

    will include a new pixel detector. A completely new detector control system (DCS) for this pixel detector will be required in order to cope with the substantial increase in radiation at the HL-LHC. The DCS has to have a very high reliability and all components installed within the detector volume have to be radiationhard. This will ensure a safe operation of the pixel detector and the experiment. A further design constraint is the minimization of the used material and cables in order to limit the impact on the tracking performance to a minimum. To meet these requirements we propose a DCS network which consists of a DCS chip and a DCS controller. In the following we present the development of the first prototypes for the DCS chip and the DCS controller with a special focus on the communication interface, radiation hardness and robustness against single event upsets.

  11. Qualification measurements of the voltage supply system as well as conceptionation of a state machine for the detector control of the ATLAS pixel detector; Qualifizierungsmessungen des Spannungsversorgungssystems sowie Konzeptionierung einer Zustandsmaschine fuer die Detektorkontrolle des ATLAS-Pixeldetektors

    Energy Technology Data Exchange (ETDEWEB)

    Schultes, Joachim

    2007-02-15

    The supply system and the control system of the ATLAS pixel detector represent important building blocks of the pixel detector. Corresponding studies of the supply system, which were performed within a comprehensive test system, the so-called system test, with nearly all final components and the effects on the pixel detector are object of this thesis. A further point of this thesis is the coordination and further development of the detector-control-system software under regardment of the different partial systems. A main topic represents thereby the conceptionation of the required state machine as interface for the users and the connection to the data acquisition system.

  12. A module concept for the upgrades of the ATLAS pixel system using the novel SLID-ICV vertical integration technology

    CERN Document Server

    Beimforde, M; Macchiolo, A; Moser, H G; Nisius, R; Richter, R H; Weigell, P; 10.1088/1748-0221/5/12/C12025

    2010-01-01

    The presented R&D activity is focused on the development of a new pixel module concept for the foreseen upgrades of the ATLAS detector towards the Super LHC employing thin n-in-p silicon sensors together with a novel vertical integration technology. A first set of pixel sensors with active thicknesses of 75 μm and 150 μm has been produced using a thinning technique developed at the Max-Planck-Institut für Physik (MPP) and the MPI Semiconductor Laboratory (HLL). Charge Collection Efficiency (CCE) measurements of these sensors irradiated with 26 MeV protons up to a particle fluence of 1016neqcm−2 have been performed, yielding higher values than expected from the present radiation damage models. The novel integration technology, developed by the Fraunhofer Institut EMFT, consists of the Solid-Liquid InterDiffusion (SLID) interconnection, being an alternative to the standard solder bump-bonding, and Inter-Chip Vias (ICVs) for routing signals vertically through electronics. This allows for extracting the ...

  13. Evaluation of novel KEK/HPK n-in-p pixel sensors for ATLAS upgrade with testbeam

    International Nuclear Information System (INIS)

    A new type of n-in-p planar pixel sensors have been developed at KEK/HPK in order to cope with the maximum particle fluence of 1–3×1016 1 MeV equivalent neutrons per square centimeter (neq/cm2) in the upcoming LHC upgrades. Four n-in-p devices were connected by bump-bonding to the new ATLAS Pixel front-end chip (FE-I4A) and characterized before and after the irradiation to 2×1015neq/cm2. These planar sensors are 150μm thick, using biasing structures made out of polysilicon or punch-through dot and isolation structures of common or individual p-stop. Results of measurements with radioactive 90Sr source and with a 120 GeV/c momentum pion beam at the CERN Super Proton Synchrotron (SPS) are presented. The common p-stop isolation structure shows a better performance than the individual p-stop design, after the irradiation. The flat distribution of the collected charge in the depth direction after the irradiation implies that the effect of charge trapping is small, at the fluence, with the bias voltage well above the full depletion voltage.

  14. The Read-Out Driver (ROD) card for the ATLAS experiment: commissioning for the IBL detector and upgrade studies for the Pixel Layers 1 and 2

    CERN Document Server

    Travaglini, R; The ATLAS collaboration; Bindi, M; Falchieri, D; Gabrielli, A; Lama, L; Chen, S P; Hsu, S C; Hauck, S; Kugel, A; Flick, T; Wensing, M

    2013-01-01

    The upgrade of the ATLAS experiment at LHC foresees the insertion of an innermost silicon layer, called Insertable B-layer (IBL). IBL read-out system will be equipped with new electronics. The Readout-Driver card (ROD) is a VME board devoted to data processing, configuration and control. A pre-production batch has been delivered in order to perform tests with instrumented slices of the overall acquisition chain, aiming to finalize strategies for system commissioning. In this contribution both setups and results will be described, as well as preliminary studies on changes in order to adopt the ROD for the ATLAS Pixel Layers 1 and 2.

  15. Measurement of performance of the pixel neural network clustering algorithm of the ATLAS experiment at $\\sqrt{s}$ = 13 TeV

    CERN Document Server

    The ATLAS collaboration

    2015-01-01

    The properties of pixel clusters in dense environments are studied with $\\sqrt{s}$ = 13 TeV proton-proton collisions from the LHC, recorded by ATLAS from June to July 2015. A novel method to evaluate the performance of the artificial neural network used for identifying pixel clusters created by multiple particles is presented. Using this method, the results in data and Monte Carlo simulation are compared. The neural network, as part of the track reconstruction, shows the expected response when used on collimated tracks.

  16. Development of a detector control system for the serially powered ATLAS pixel detector at the HL-LHC

    Energy Technology Data Exchange (ETDEWEB)

    Puellen, Lukas

    2015-02-10

    In the years around 2020 the LHC will be upgraded to the HL-LHC. In terms of this upgrade, the ATLAS detector will also be upgraded. This also includes the pixel detector, the innermost of the sub-detectors in ATLAS. Thereby the powering concept of the pixel detector will be changed to reduce the material budget of the detector. From individual powering of each detector module, the concept changes to serial powering, where all modules of a powering group are connected in series. This change makes the development of a new detector control system (DCS) mandatory. Therefore, a new concept for the ATLAS pixel DCS is being developed at the University of Wuppertal. This concept is split into three paths: a safety path, a control path, and a diagnostics path. The safety path is a hard wired interlock system. The concept of this system will not differ significantly, compared to the interlock system of the current detector. The diagnostics path is embedded into the optical data read-out of the detector and will be used for detector tuning with high precision and granularity. The control path supervises the detector and provides a user interface to the hardware components. A concept for this path, including a prototype and proof-of-principle studies, has been developed in terms of this thesis. The control path consists of the DCS network, a read-out and controlling topology created by two types of ASICs: the DCS controller and the DCS chip. These ASICs measure and control all values, necessary for a safe detector operation in situ. This reduces the number of required cables and hence the material budget of the system. For the communication between these ASICs, two very fault tolerant bus protocols have been chosen: CAN bus carries data from the DCS computers, outside of the detector, to the DCS controllers at the edge of the pixel detector. For the communication between the DCS controller and the DCS chip, which is located close to each detector module, an enhanced I2C

  17. Development of a detector control system for the serially powered ATLAS pixel detector at the HL-LHC

    International Nuclear Information System (INIS)

    In the years around 2020 the LHC will be upgraded to the HL-LHC. In terms of this upgrade, the ATLAS detector will also be upgraded. This also includes the pixel detector, the innermost of the sub-detectors in ATLAS. Thereby the powering concept of the pixel detector will be changed to reduce the material budget of the detector. From individual powering of each detector module, the concept changes to serial powering, where all modules of a powering group are connected in series. This change makes the development of a new detector control system (DCS) mandatory. Therefore, a new concept for the ATLAS pixel DCS is being developed at the University of Wuppertal. This concept is split into three paths: a safety path, a control path, and a diagnostics path. The safety path is a hard wired interlock system. The concept of this system will not differ significantly, compared to the interlock system of the current detector. The diagnostics path is embedded into the optical data read-out of the detector and will be used for detector tuning with high precision and granularity. The control path supervises the detector and provides a user interface to the hardware components. A concept for this path, including a prototype and proof-of-principle studies, has been developed in terms of this thesis. The control path consists of the DCS network, a read-out and controlling topology created by two types of ASICs: the DCS controller and the DCS chip. These ASICs measure and control all values, necessary for a safe detector operation in situ. This reduces the number of required cables and hence the material budget of the system. For the communication between these ASICs, two very fault tolerant bus protocols have been chosen: CAN bus carries data from the DCS computers, outside of the detector, to the DCS controllers at the edge of the pixel detector. For the communication between the DCS controller and the DCS chip, which is located close to each detector module, an enhanced I2C

  18. Analog front-end cell designed in a commercial 025 mu m process for the ATLAS pixel detector at LHC

    CERN Document Server

    Blanquart, L; Comes, G; Denes, P; Einsweiler, Kevin F; Fischer, P; Mandelli, E; Meddeler, G; Peric, I; Richardson, J

    2002-01-01

    A new analog pixel front-end cell has been developed for the ATLAS detector at the future Large Hadron Collider (LHC) at the European Laboratory for Particle Physics (CERN). This analog cell has been submitted in two commercial 0.25 mu m CMOS processes (in an analog test chip format), using special layout techniques for radiation hardness purposes. It is composed of two cascaded amplifiers followed by a fast discriminator featuring a detection threshold within the range of 1000 to 10000 electrons. The first preamplifier has the principal role of providing a large bandwidth, low input impedance, and fast rise time in order to enhance the time-walk and crosstalk performance, whereas the second fully differential amplifier is aimed at delivering a sufficiently high-voltage gain for optimum comparison. A new do feedback concept renders the cell tolerant of sensor leakage current up to 300 nA and provides monitoring of this current. Two 5-bit digital-to-analog converters tolerant to single- event upset have been i...

  19. Studies on irradiated pixel detectors for the ATLAS IBL and HL-LHC upgrade

    CERN Document Server

    AUTHOR|(INSPIRE)INSPIRE-00371978; Gößling, Claus; Pernegger, Heinz

    The constant demand for higher luminosity in high energy physics is the reason for the continuous effort to adapt the accelerators and the experiments. The upgrade program for the experiments and the accelerators at CERN already includes several expansion stages of the Large Hadron Collider (LHC) which will increase the luminosity and the energy of the accelerator. Simultaneously the LHC experiments prepare the individual sub-detectors for the increasing demands in the coming years. Especially the tracking detectors have to cope with fluence levels unprecedented for high energy physics experiments. Correspondingly to the fluence increases the impact of the radiation damage which reduces the life time of the detectors by decreasing the detector performance and efficiency. To cope with this effect new and more radiation hard detector concepts become necessary to extend the life time. This work concentrates on the impact of radiation damage on the pixel sensor technologies to be used in the next upgrade of the ...

  20. Charge Pump Clock Generation PLL for the Data Output Block of the Upgraded ATLAS Pixel Front-End in 130 nm CMOS

    CERN Document Server

    Kruth, A; Arutinov, D; Barbero, M; Gronewald, M; Hemperek, T; Karagounis, M; Krueger, H; Wermes, N; Fougeron, D; Menouni, M; Beccherle, R; Dube, S; Ellege, D; Garcia-Sciveres, M; Gnani, D; Mekkaoui, A; Gromov, V; Kluit, R; Schipper, J

    2009-01-01

    FE-I4 is the 130 nm ATLAS pixel IC currently under development for upgraded Large Hadron Collider (LHC) luminosities. FE-I4 is based on a low-power analog pixel array and digital architecture concepts tuned to higher hit rates [1]. An integrated Phase Locked Loop (PLL) has been developed that locally generates a clock signal for the 160 Mbit/s output data stream from the 40 MHz bunch crossing reference clock. This block is designed for low power, low area consumption and recovers quickly from loss of lock related to single-event transients in the high radiation environment of the ATLAS pixel detector. After a general introduction to the new FE-I4 pixel front-end chip, this work focuses on the FE-I4 output blocks and on a first PLL prototype test chip submitted in early 2009. The PLL is nominally operated from a 1.2V supply and consumes 3.84mW of DC power. Under nominal operating conditions, the control voltage settles to within 2% of its nominal value in less than 700 ns. The nominal operating frequency for t...

  1. Multi-chip module development for the ATLAS pixel detector. Analysis of the front-end chip electronics in radiation hard 0.25-μm technology as well as development and realization of a serial power concept

    International Nuclear Information System (INIS)

    The innermost layer of the ATLAS tracking system is a silicon pixel detector. The use of radiation tolerant components is mandatory due to the harsh radiation environment. The smallest independent component of the pixel detector is a hybride pixel module consisting of a large oxygen enriched silicon sensor and 16 specifically developed ASICs. To achieve the necessary radiation tolerance the ASICs are produced in a 0.25 μm technology in combination with special design techniques. The measurements of the readout electronics during all stages of production of a full module are presented and the performance of the modules is compared with the strict requirements of the ATLAS pixel detector. Furthermore a new powering scheme for pixel detectors is presented, aiming at reducing the total power consumption, the material for the electrical services and the amount of power cables. The advantages and disadvantages of this concept are discussed on the example of the ATLAS pixel detector with pixel modules modified accounting to the new powering scheme. The performance of six of those modules operating at the same time in a small system test is compared to that of normal ATLAS pixel modules. (orig.)

  2. Development of pixel detectors for the IBL and HL-LHC ATLAS experiment upgrade

    CERN Document Server

    Baselga Bacardit, Marta

    2016-03-18

    This thesis presents the development of advanced silicon technology detectors fabricated at CNM-Barcelona for High Energy Physics (HEP) experiments. The pixel size of the tracking silicon detectors for the upgrade of the HL-LHC will have to decrease in size in order to enhance the resolution in position for the measurements and they need to have lower occupancy for the electronics. The future experiments at CERN will cope with fuences up to 2 x 10^^16 neq/cm2, and the smaller 3D silicon detectors will have less trapping of the electron-holes generated in the bulk leading to a better performance under high radiation environment. This thesis studies silicon detectors fabricated at CNM-Barcelona applied to HEP experiments with two different kinds of novel technologies: 3D and Low Gain Avalanche Detectors (LGAD). The 3D detectors make it possible to reduce the size of the depleted region inside the detector and to work at lower voltages, whereas the LGAD detectors have an intrinsic gain which increases the collec...

  3. The upgraded Pixel detector and the commissioning of the Inner Detector tracking of the ATLAS experiment for Run-2 at the Large Hadron Collider

    CERN Document Server

    AUTHOR|(INSPIRE)INSPIRE-00019188; The ATLAS collaboration

    2016-01-01

    Run-2 of the Large Hadron Collider (LHC) will provide new challenges to track and vertex reconstruction with higher energies, denser jets and higher rates. Therefore the ATLAS experiment has constructed the first 4-layer Pixel detector in HEP, installing a new Pixel layer, also called Insertable B-Layer (IBL). The IBL is a fourth layer of pixel detectors, and has been installed in May 2014 at a radius of 3.3 cm between the existing Pixel Detector and a new smaller radius beam-pipe. The new detector, built to cope with the high radiation and expected occupancy, is the first large scale application of 3D detectors and CMOS 130~nm technology. In addition, the Pixel detector was refurbished with a new service quarter panel to recover about 3% of defective modules lost during Run-1 and a new optical readout system to readout the data at higher speed while reducing the occupancy when running with increased luminosity. Complementing detector improvements, many improvements to Inner Detector track and vertex reconstr...

  4. Test results of the first 3D-IC prototype chip developed in the framework of HL-LHC/ATLAS hybrid pixel upgrade

    CERN Document Server

    Pangaud, P; Barbero, M; Bompard, F; Breugnon, P; Clemens, J C; Fougeron, D; Garcia-Sciveres, M; Godiot, S; Hemperek, T; Krüger, H; Obermann, T; Rozanov, S; Wermes, N

    2014-01-01

    The ATLAS pixel detector needs to handle this new challenging environment. As a consequence, 3D integrated technologies are pursued with the target of offering higher spatial resolution, very good signal to noise ratio and unprecedented radiation hardness. We present here the test results of the first 3D prototype chip developed in the GlobalFoundries 130 nm technology processed by the Tezzaron Company, submitted within the 3D-IC consortium for which a qualification program was developed. Reliability and influence on the behavior of the integrated devices due to the presence of the Bond Interface (BI) and of the Through Silicon Via (TSV) connections, ...

  5. Thin n-in-p pixel sensors and the SLID-ICV vertical integration technology for the ATLAS upgrade at the HL-LHC

    CERN Document Server

    Macchiolo, A

    2013-01-01

    The R&D activity presented is focused on the development of new modules for the upgrade of the ATLAS pixel system at the High Luminosity LHC (HL-LHC). The performance after irradiation of n-in-p pixel sensors of different active thicknesses is studied, together with an investigation of a novel interconnection technique offered by the Fraunhofer Institute EMFT in Munich, the Solid-Liquid-InterDiffusion (SLID), which is an alternative to the standard solder bump-bonding. The pixel modules are based on thin n-in-p sensors, with an active thickness of 75 um or 150 um, produced at the MPI Semiconductor Laboratory (MPI HLL) and on 100 um thick sensors with active edges, fabricated at VTT, Finland. Hit efficiencies are derived from beam test data for thin devices irradiated up to a fluence of 4e15 neq/cm^2. For the active edge devices, the charge collection properties of the edge pixels before irradiation is discussed in detail, with respect to the inner ones, using measurements with radioactive sources. Beyond ...

  6. Performance of the Insertable B-Layer for the ATLAS Pixel Detector during Quality Assurance and a Novel Pixel Detector Readout Concept based on PCIe

    CERN Document Server

    AUTHOR|(INSPIRE)INSPIRE-00356268; Pernegger, Heinz

    2016-07-27

    During the first long shutdown of the LHC the Pixel detector has been upgraded with a new 4th innermost layer, the Insertable B-Layer (IBL). The IBL will increase the tracking performance and help with higher than nominal luminosity the LHC will produce. The IBL is made up of 14 staves and in total 20 staves have been produced for the IBL. This thesis presents the results of the final quality tests performed on these staves in an detector-like environment, in order to select the 14 best of the 20 staves for integration onto the detector. The test setup as well as the testing procedure is introduced and typical results of each testing stage are shown and discussed. The overall performance of all staves is presented in regards to: tuning performance, radioactive source measurements, and number of failing pixels. Other measurement, which did not directly impact the selection of staves, but will be important for the operation of the detector or production of a future detector, are included. Based on the experienc...

  7. Design and implementation of an expert system for the detector control systems of the ATLAS pixel detector

    International Nuclear Information System (INIS)

    In the framework of this thesis an expert system ''Pixel-Advisor'' for the control system of the pixel detector was designed and implemented. This supports the operational personnel in the diagnosis and removal of possible problems, which are in connection with the detector control system and unburdens the few available DCS experts

  8. Cryogenic Si detectors for ultra radiation hardness in SLHC environment

    International Nuclear Information System (INIS)

    Radiation hardness up to 1016 neq/cm2 is required in the future HEP experiments for most inner detectors. However, 1016 neq/cm2 fluence is well beyond the radiation tolerance of even the most advanced semiconductor detectors fabricated by commonly adopted technologies: the carrier trapping will limit the charge collection depth to an effective range of 20-30 μm regardless of depletion depth. Significant improvement of the radiation hardness of silicon sensors has been taken place within RD39. Fortunately the cryogenic tool we have been using provides us a convenient way to solve the detector charge collection efficiency (CCE) problem at SLHC radiation level (1016 neq/cm2). There are two key approaches in our efforts: (1) use of the charge/current injection to manipulate the detector internal electric field in such a way that it can be depleted at a modest bias voltage at cryogenic temperature range (≤230 K); and (2) freezing out of the trapping centers that affects the CCE at cryogenic temperatures lower than that of the LN2 temperature. In our first approach, we have developed the advanced radiation hard detectors using charge or current injection, the current injected diodes (CID). In a CID, the electric field is controlled by injected current, which is limited by the space charge, yielding a nearly uniform electric field in the detector, independent of the radiation fluence. In our second approach, we have developed models of radiation-induced trapping levels and the physics of their freezing out at cryogenic temperatures. In this approach, we intend to study the trapping effect at temperatures below LN2 temperature. A freeze-out of trapping can certainly help in the development of ultra-radiation hard Si detectors for SLHC. A detector CCE measurement system using ultra-fast picosecond laser with a He cryostat has been built at CERN. This system can be used to find out the practical cryogenic temperature range that can be used to freeze out the radiation

  9. A High Performance Multi-Core FPGA Implementation for 2D Pixel Clustering for the ATLAS Fast TracKer (FTK) Processor

    CERN Document Server

    Sotiropoulou, C-L; The ATLAS collaboration; Beretta, M; Gkaitatzis, S; Kordas, K; Nikolaidis, S; Petridou, C; Volpi, G

    2014-01-01

    The high performance multi-core 2D pixel clustering FPGA implementation used for the input system of the ATLAS Fast TracKer (FTK) processor is presented. The input system for the FTK processor will receive data from the Pixel and micro-strip detectors read out drivers (RODs) at 760Gbps, the full rate of level 1 triggers. Clustering is required as a method to reduce the high rate of the received data before further processing, as well as to determine the cluster centroid for obtaining obtain the best spatial measurement. Our implementation targets the pixel detectors and uses a 2D-clustering algorithm that takes advantage of a moving window technique to minimize the logic required for cluster identification. The design is fully generic and the cluster detection window size can be adjusted for optimizing the cluster identification process. Τhe implementation can be parallelized by instantiating multiple cores to identify different clusters independently thus exploiting more FPGA resources. This flexibility mak...

  10. Characterization of the FE-I4B pixel readout chip production run for the ATLAS Insertable B-layer upgrade

    CERN Document Server

    Backhaus, M

    2013-01-01

    The Insertable B-layer (IBL) is a fourth pixel layer that will be added inside the existing ATLAS pixel detector during the long LHC shutdown of 2013 and 2014. The new four layer pixel system will ensure excellent tracking, vertexing and b-tagging performance in the high luminosity pile-up conditions projected for the next LHC run. The peak luminosity is expected to reach 3• 10^34 cm^−2 s ^−1with an integrated luminosity over the IBL lifetime of 300 fb^−1 corresponding to a design lifetime fluence of 5 • 10^15 n_eqcm^−2 and ionizing dose of 250 Mrad including safety factors. The production front-end electronics FE-I4B for the IBL has been fabricated at the end of 2011 and has been extensively characterized on diced ICs as well as at the wafer level. The production tests at the wafer level were performed during 2012. Selected results of the diced IC characterization are presented, including measurements of the on-chip voltage regulators. The IBL powering scheme, which was chosen based on these resu...

  11. Measurement of charm and beauty-production in deep inelastic scattering at HERA and test beam studies of ATLAS pixel sensors

    International Nuclear Information System (INIS)

    A measurement of charm and beauty production in Deep Inelastic Scattering at HERA is presented. The analysis is based on the data sample collected by the ZEUS detector in the period from 2003 to 2007 corresponding to an integrated luminosity of 354 pb-1. The kinematic region of the measurement is given by 522 and 0.022 is the photon virtuality and y is the inelasticity. A lifetime technique is used to tag the production of charm and beauty quarks. Secondary vertices due to decays of charm and beauty hadrons are reconstructed, in association with jets. The jet kinematics is defined by EjetT>4.2(5) GeV for charm (beauty) and -1.6jetjetT and ηjet are the transverse energy and pseudorapidity of the jet, respectively. The significance of the decay length and the invariant mass of charged tracks associated with the secondary vertex are used as discriminating variables to distinguish between signal and background. Differential cross sections of jet production in charm and beauty events as a function of Q2, y, EjetT and ηjet are measured. Results are compared to Next-to-Leading Order (NLO) predictions from Quantum Chromodynamics (QCD) in the fixed flavour number scheme. Good agreement between data and theory is observed. Contributions of the charm and beauty production to the inclusive proton structure function, Fcbarc2 and Fbantib2, are determined by extrapolating the double differential cross sections using NLO QCD predictions. Contributions to the test beam program for the Insertable B-Layer upgrade project of the ATLAS pixel detector are discussed. The test beam data analysis software package EUTelescope was extended, which allowed an efficient analysis of ATLAS pixel sensors. The USBPix DAQ system was integrated into the EUDET telescope allowing test beam measurements with the front end chip FE-I4. Planar and 3D ATLAS pixel sensors were studied at the first IBL test beam at the CERN SPS.

  12. Measurement of charm and beauty-production in deep inelastic scattering at HERA and test beam studies of ATLAS pixel sensors

    Energy Technology Data Exchange (ETDEWEB)

    Libov, Vladyslav

    2013-08-15

    A measurement of charm and beauty production in Deep Inelastic Scattering at HERA is presented. The analysis is based on the data sample collected by the ZEUS detector in the period from 2003 to 2007 corresponding to an integrated luminosity of 354 pb{sup -1}. The kinematic region of the measurement is given by 54.2(5) GeV for charm (beauty) and -1.6<{eta}{sup jet}<2.2 for both charm and beauty, where E{sup jet}{sub T} and {eta}{sup jet} are the transverse energy and pseudorapidity of the jet, respectively. The significance of the decay length and the invariant mass of charged tracks associated with the secondary vertex are used as discriminating variables to distinguish between signal and background. Differential cross sections of jet production in charm and beauty events as a function of Q{sup 2}, y, E{sup jet}{sub T} and {eta}{sup jet} are measured. Results are compared to Next-to-Leading Order (NLO) predictions from Quantum Chromodynamics (QCD) in the fixed flavour number scheme. Good agreement between data and theory is observed. Contributions of the charm and beauty production to the inclusive proton structure function, F{sup cbar} {sup c}{sub 2} and F{sup b} {sup anti} {sup b}{sub 2}, are determined by extrapolating the double differential cross sections using NLO QCD predictions. Contributions to the test beam program for the Insertable B-Layer upgrade project of the ATLAS pixel detector are discussed. The test beam data analysis software package EUTelescope was extended, which allowed an efficient analysis of ATLAS pixel sensors. The USBPix DAQ system was integrated into the EUDET telescope allowing test beam

  13. Thin n-in-p pixel sensors and the SLID-ICV vertical integration technology for the ATLAS upgrade at the HL-LHC

    Science.gov (United States)

    Macchiolo, A.; Andricek, L.; Ellenburg, M.; Moser, H. G.; Nisius, R.; Richter, R. H.; Terzo, S.; Weigell, P.

    2013-12-01

    This R&D activity is focused on the development of new modules for the upgrade of the ATLAS pixel system at the High Luminosity LHC (HL-LHC). The performance after irradiation of n-in-p pixel sensors of different active thicknesses is studied, together with an investigation of a novel interconnection technique offered by the Fraunhofer Institute EMFT in Munich, the Solid-Liquid-InterDiffusion (SLID), which is an alternative to the standard solder bump-bonding. The pixel modules are based on thin n-in-p sensors, with an active thickness of 75 μm or 150 μm, produced at the MPI Semiconductor Laboratory (MPI HLL) and on 100 μm thick sensors with active edges, fabricated at VTT, Finland. Hit efficiencies are derived from beam test data for thin devices irradiated up to a fluence of 4×1015 neq/cm2. For the active edge devices, the charge collection properties of the edge pixels before irradiation are discussed in detail, with respect to the inner ones, using measurements with radioactive sources. Beyond the active edge sensors, an additional ingredient needed to design four side buttable modules is the possibility of moving the wire bonding area from the chip surface facing the sensor to the backside, avoiding the implementation of the cantilever extruding beyond the sensor area. The feasibility of this process is under investigation with the FE-I3 SLID modules, where Inter Chip Vias are etched, employing an EMFT technology, with a cross section of 3 μm×10 μm, at the positions of the original wire bonding pads.

  14. TFA pixel sensor technology for vertex detectors

    Energy Technology Data Exchange (ETDEWEB)

    Jarron, P. [CERN, CH-1211 Geneva 23 (Switzerland)]. E-mail: Pierre.Jarron@cern.ch; Moraes, D. [CERN, CH-1211 Geneva 23 (Switzerland)]. E-mail: Danielle.Moraes@cern.ch; Despeisse, M. [CERN, CH-1211 Geneva 23 (Switzerland); Dissertori, G. [ETH-Zurich, CH-8093 Zurich (Switzerland); Dunand, S. [IMT, Rue A.-L. Breguet 2, CH-2000 Neuchatel (Switzerland); Kaplon, J. [CERN, CH-1211 Geneva 23 (Switzerland); Miazza, C. [IMT, Rue A.-L. Breguet 2, CH-2000 Neuchatel (Switzerland); Shah, A. [IMT, Rue A.-L. Breguet 2, CH-2000 Neuchatel (Switzerland); Viertel, G.M. [ETH-Zurich, CH-8093 Zurich (Switzerland); Wyrsch, N. [IMT, Rue A.-L. Breguet 2, CH-2000 Neuchatel (Switzerland)

    2006-05-01

    Pixel microvertex detectors at the SLHC and a future linear collider face very challenging issues: extreme radiation hardness, cooling design, interconnections density and fabrication cost. As an alternative approach we present a novel pixel detector based on the deposition of a Hydrogenated Amorphous Silicon (a-Si:H) film on top of a readout ASIC. The Thin-Film on ASIC (TFA) technology is inspired by an emerging microelectronic technology envisaged for visible light Active Pixel Sensor (APS) devices. We present results obtained with a-Si:H sensor films deposited on a glass substrate and on ASIC, including the radiation hardness of this material up to a fluence of 3.5x10{sup 15} p/cm{sup 2}.

  15. TFA pixel sensor technology for vertex detectors

    International Nuclear Information System (INIS)

    Pixel microvertex detectors at the SLHC and a future linear collider face very challenging issues: extreme radiation hardness, cooling design, interconnections density and fabrication cost. As an alternative approach we present a novel pixel detector based on the deposition of a Hydrogenated Amorphous Silicon (a-Si:H) film on top of a readout ASIC. The Thin-Film on ASIC (TFA) technology is inspired by an emerging microelectronic technology envisaged for visible light Active Pixel Sensor (APS) devices. We present results obtained with a-Si:H sensor films deposited on a glass substrate and on ASIC, including the radiation hardness of this material up to a fluence of 3.5x1015 p/cm2

  16. Commissioning of the read-out driver (ROD) card for the ATLAS IBL detector and upgrade studies for the pixel Layers 1 and 2

    Energy Technology Data Exchange (ETDEWEB)

    Balbi, G.; Bindi, M. [Istituto Nazionale di Fisica Nucleare (INFN), Bologna (Italy); Falchieri, D. [Istituto Nazionale di Fisica Nucleare (INFN), Bologna (Italy); Department of Physics and Astronomy, University of Bologna (Italy); Gabrielli, A., E-mail: alessandro.gabrielli@bo.infn.it [Istituto Nazionale di Fisica Nucleare (INFN), Bologna (Italy); Department of Physics and Astronomy, University of Bologna (Italy); Travaglini, R. [Istituto Nazionale di Fisica Nucleare (INFN), Bologna (Italy); Chen, S.-P.; Hsu, S.-C.; Hauck, S. [University of Washington, Seattle (United States); Kugel, A. [ZITI – Institute for Computer Engineering, University of Heidelberg at Mannheim (Germany)

    2014-11-21

    The higher luminosity that is expected for the LHC after future upgrades will require better performance by the data acquisition system, especially in terms of throughput. In particular, during the first shutdown of the LHC collider in 2013/14, the ATLAS Pixel Detector will be equipped with a fourth layer – the Insertable B-Layer or IBL – located at a radius smaller than the present three layers. Consequently, a new front end ASIC (FE-I4) was designed as well as a new off-detector chain. The latter is composed mainly of two 9U-VME cards called the Back-Of-Crate (BOC) and Read-Out Driver (ROD). The ROD is used for data and event formatting and for configuration and control of the overall read-out electronics. After some prototyping samples were completed, a pre-production batch of 5 ROD cards was delivered with the final layout. Actual production of another 15 ROD cards is ongoing in Fall 2013, and commissioning is scheduled in 2014. Altogether 14 cards are necessary for the 14 staves of the IBL detector, one additional card is required by the Diamond Beam Monitor (DBM), and additional spare ROD cards will be produced for a total of 20 boards. This paper describes some integration tests that were performed and our plan to test the production of the ROD cards. Slices of the IBL read-out chain have been instrumented, and ROD performance is verified on a test bench mimicking a small-sized final setup. This contribution will report also one view on the possible adoption of the IBL ROD for ATLAS Pixel Detector Layer 2 (firstly) and, possibly, in the future, for Layer 1.

  17. Commissioning of the read-out driver (ROD) card for the ATLAS IBL detector and upgrade studies for the pixel Layers 1 and 2

    International Nuclear Information System (INIS)

    The higher luminosity that is expected for the LHC after future upgrades will require better performance by the data acquisition system, especially in terms of throughput. In particular, during the first shutdown of the LHC collider in 2013/14, the ATLAS Pixel Detector will be equipped with a fourth layer – the Insertable B-Layer or IBL – located at a radius smaller than the present three layers. Consequently, a new front end ASIC (FE-I4) was designed as well as a new off-detector chain. The latter is composed mainly of two 9U-VME cards called the Back-Of-Crate (BOC) and Read-Out Driver (ROD). The ROD is used for data and event formatting and for configuration and control of the overall read-out electronics. After some prototyping samples were completed, a pre-production batch of 5 ROD cards was delivered with the final layout. Actual production of another 15 ROD cards is ongoing in Fall 2013, and commissioning is scheduled in 2014. Altogether 14 cards are necessary for the 14 staves of the IBL detector, one additional card is required by the Diamond Beam Monitor (DBM), and additional spare ROD cards will be produced for a total of 20 boards. This paper describes some integration tests that were performed and our plan to test the production of the ROD cards. Slices of the IBL read-out chain have been instrumented, and ROD performance is verified on a test bench mimicking a small-sized final setup. This contribution will report also one view on the possible adoption of the IBL ROD for ATLAS Pixel Detector Layer 2 (firstly) and, possibly, in the future, for Layer 1

  18. ATLAS

    Data.gov (United States)

    Federal Laboratory Consortium — ATLAS is a particle physics experiment at the Large Hadron Collider at CERN, the European Organization for Nuclear Research. Scientists from Brookhaven have played...

  19. Radiation-hard ASICS for sLHC optical data transmission

    International Nuclear Information System (INIS)

    High-speed data transmission in a high radiation environment poses an immense challenge in the detector design. We investigate the feasibility of using optical links for the silicon trackers of the ATLAS experiment for the planned upgrade of the LHC. The planned upgrade with ten times higher collision rate will produce a similar increase in the radiation. One possibility for the optical transmission is to use VCSEL arrays operating at 850 nm to transmit optical signals while using PIN arrays to convert the optical signals into electrical signals. We have designed a prototype chip containing building blocks for future SLHC optical links using a 130 nm CMOS 8RF process. The chip contains four main blocks; a VCSEL driver optimized for operation at 640 Mb/s, a VCSEL driver optimized for 3.2 Gb/s, a PIN receiver with a clock/data recovery circuit for operation at 40, 160, and 320 Mb/s, and two clock multipliers designed to operate at 640 Mb/s. The clock multiplier is designed to produce the high speed clock to serialize the data for transmission. All circuitry was designed following test results and guidelines from CERN on radiation tolerant design for the process. We have irradiated the chips with 24 GeV protons at CERN. For the VDC, the duty cycle of the output signal and the current consumption of the LVDS receiver remained constant during the irradiation. However, we observed significant decreases in the current consumption of the VCSEL driver circuit and the output drive current. This indicated that the think oxide layout used in the VCSEL driver portion of the chip might not be as radiation-hard and the circuit had been redesigned to minimize this sensitivity. For the PIN receiver, we found that the radiation produced no significant degradation, including the single event upset rate. The upset rate decreased with larger PIN current and was higher for a chip coupled to a PIN diode as expected. For the clock multipliers, we observed that the clocks of some chips

  20. Progress with the single-sided module prototypes for the ATLAS tracker upgrade stave

    Science.gov (United States)

    Allport, P. P.; Affolder, A. A.; Anghinolfi, F.; Bates, R.; Betancourt, C.; Buttar, C.; Carter, J. R.; Casse, G.; Chen, H.; Chilingarov, A.; Civera, J. V.; Clark, A.; Colijn, A. P.; Dabrowski, W.; Dawson, N.; Dewilde, B.; Dhawan, S.; Dressnandt, N.; Dwužnik, M.; Eklund, L.; Fadeyev, V.; Farthouat, P.; Ferrère, D.; Fox, H.; French, R.; Gallop, B.; García, C.; Gerling, M.; Gibson, M.; Gilchriese, M.; Gonzalez Sevilla, S.; Goodrick, M.; Greenall, A.; Grillo, A. A.; Haber, C. H.; Hessey, N. P.; Holt, R.; Hommels, L. B. A.; Jakobs, K.; Jones, T. J.; Kaplon, J.; Kierstead, J.; Koffeman, E.; Köhler, M.; Lacasta, C.; La Marra, D.; Li, Z.; Lindgren, S.; Lynn, D.; Maddock, P.; Mahboubi, K.; Martinez-McKinney, F.; Matheson, J.; Maunu, R.; McCarthy, R.; Newcomer, M.; Nickerson, R.; O'Shea, V.; Paganis, S.; Parzefall, U.; Pernecker, S.; Phillips, P.; Poltorak, K.; Puldon, D.; Robinson, D.; Sadrozinski, H. F.-W.; Santoyo, D.; Sattari, S.; Schamberger, D.; Seiden, A.; Sutcliffe, P.; Swientek, K.; Tsionou, D.; Tyndel, M.; Unno, Y.; Viehhauser, G.; Villani, E. G.; von Wilpert, J.; Wastie, R.; Weber, M.; Weidberg, A.; Wiik, L.; Wilmut, I.; Wormald, M.; Wright, J.; Xu, D.

    2011-04-01

    The ATLAS experiment is preparing for the planned luminosity upgrade of the LHC (the super-luminous LHC or sLHC) with a programme of development for tracking able to withstand an order of greater magnitude radiation fluence and much greater hit occupancy rates than the current detector. This has led to the concept of an all-silicon tracker with an enhanced performance pixel-based inner region and short-strips for much of the higher radii. Both sub-systems employ many common technologies, including the proposed “stave” concept for integrated cooling and support. For the short-strip region, use of this integrated stave concept requires single-sided modules mounted on either side of a thin central lightweight support.Each sensor is divided into four rows of 23.82 mm length strips; within each row, there are 1280 strips of 74.5μm pitch. Well over a hundred prototype sensors are being delivered by Hamamatsu Photonics (HPK) to Japan, Europe and the US.We present results of the first 20 chip ABCN25 ASIC hybrids for these sensors, results of the first prototype 5120 strip module built with 40 ABCN25 read-out ASICs, and the status of the hybrids and modules being developed for the ATLAS tracker upgrade stave programme.

  1. Progress with the single-sided module prototypes for the ATLAS tracker upgrade stave

    International Nuclear Information System (INIS)

    The ATLAS experiment is preparing for the planned luminosity upgrade of the LHC (the super-luminous LHC or sLHC) with a programme of development for tracking able to withstand an order of greater magnitude radiation fluence and much greater hit occupancy rates than the current detector. This has led to the concept of an all-silicon tracker with an enhanced performance pixel-based inner region and short-strips for much of the higher radii. Both sub-systems employ many common technologies, including the proposed 'stave' concept for integrated cooling and support. For the short-strip region, use of this integrated stave concept requires single-sided modules mounted on either side of a thin central lightweight support. Each sensor is divided into four rows of 23.82 mm length strips; within each row, there are 1280 strips of 74.5μm pitch. Well over a hundred prototype sensors are being delivered by Hamamatsu Photonics (HPK) to Japan, Europe and the US. We present results of the first 20 chip ABCN25 ASIC hybrids for these sensors, results of the first prototype 5120 strip module built with 40 ABCN25 read-out ASICs, and the status of the hybrids and modules being developed for the ATLAS tracker upgrade stave programme.

  2. ''The Read-Out Driver'' ROD card for the Insertable B-layer (IBL) detector of the ATLAS experiment: commissioning and upgrade studies for the Pixel Layers 1 and 2

    International Nuclear Information System (INIS)

    The upgrade of the ATLAS experiment at LHC foresees the insertion of an innermost silicon layer, called the Insertable B-layer (IBL). The IBL read-out system will be equipped with new electronics. The Readout-Driver card (ROD) is a VME board devoted to data processing, configuration and control. A pre-production batch has been delivered for testing with instrumented slices of the overall acquisition chain, aiming to finalize strategies for system commissioning. In this paper system setups and results will be described, as well as preliminary studies on changes needed to adopt the ROD for the ATLAS Pixel Layers 1 and 2

  3. Multi-chip module development for the ATLAS pixel detector. Analysis of the front-end chip electronics in radiation hard 0.25-{mu}m technology as well as development and realization of a serial power concept; Multi-Chip-Modul-Entwicklung fuer den ATLAS-Pixeldetektor. Analyse der Front-End-Chip-Elektronik in strahlenharter0,25-{mu}m-Technologie sowie Entwicklung und Realisierung eines Serial-Powering-Konzeptes

    Energy Technology Data Exchange (ETDEWEB)

    Stockmanns, T.

    2004-08-01

    The innermost layer of the ATLAS tracking system is a silicon pixel detector. The use of radiation tolerant components is mandatory due to the harsh radiation environment. The smallest independent component of the pixel detector is a hybride pixel module consisting of a large oxygen enriched silicon sensor and 16 specifically developed ASICs. To achieve the necessary radiation tolerance the ASICs are produced in a 0.25 {mu}m technology in combination with special design techniques. The measurements of the readout electronics during all stages of production of a full module are presented and the performance of the modules is compared with the strict requirements of the ATLAS pixel detector. Furthermore a new powering scheme for pixel detectors is presented, aiming at reducing the total power consumption, the material for the electrical services and the amount of power cables. The advantages and disadvantages of this concept are discussed on the example of the ATLAS pixel detector with pixel modules modified accounting to the new powering scheme. The performance of six of those modules operating at the same time in a small system test is compared to that of normal ATLAS pixel modules. (orig.)

  4. R&D for the local support structure and cooling channel for the ATLAS PIXEL Detector Insertable B-Layer (IBL)

    CERN Document Server

    Coelli, S; The ATLAS collaboration

    2010-01-01

    ABSTRACT: The scope of the present R&D is to develop an innovative support, with an integrated cooling and based on carbon composites, for the electronic sensors of the Silicon Pixel Tracker, to be installed into the ATLAS Experiment on the Large Hadron Collider at CERN. The inner layer of the detector is installed immediately outside the Beryllium beam pipe at a distance of 50 mm from the Interaction Point, where the high energy protons collide: the intense radiation field induce a radiation damage on the sensors so that a cooling system is necessary to remove the electrical power dissipated as heat, maintaining the sensor temperature sufficiently low. The task of the support system is to hold the detector modules in positions with high accuracy, minimizing the deformation induced by the cooling; this must be done with the lower possible mass because there are tight requirements in terms of material budget. An evaporative boiling system to remove the power dissipated by the sensors is incorporated in the...

  5. Simulation of electrical parameters of new design of SLHC silicon sensors for large radii

    OpenAIRE

    Militaru, O.; González Sánchez, F. J.; Jaramillo, R.; Moya, D; Rodrigo, Teresa; López Virto, A.; Vila, Iván

    2010-01-01

    As are sult of the high luminosity phase of the SLHC, for CMS a tracking system with very high granularity is mandatory and the sensors will have to with stand a next remeradiation environment of up to 1016 part/2. On this basis, a new geometry with silicon short strip sensors (strixels) is proposed. Tounder stand their performances, test geometries are developed whose parameters can be verified and optimized using simulation of semiconductor structures. We have used the TCAD-ISE ...

  6. The GBT-SCA, a radiation tolerant ASIC for detector control applications in SLHC experiments

    CERN Document Server

    Gabrielli, A; Kloukinas, K; Marchioro, A; Moreira, P; Ranieri, A; De Robertis, D

    2009-01-01

    This work describes the architecture of the GigaBit Transceiver – Slow Control Adapter (GBT–SCA) ASIC suitable for the control and monitoring applications of the embedded front-end electronics in the future SLHC experiments. The GBT–SCA is part the GBT chipset currently under development for the SLHC detector upgrades. It is designed for radiation tolerance and it will be fabricated in a commercial 130 nm CMOS technology. The paper discusses the GBT-SCA architecture, the data transfer protocol, the ASIC interfaces, and its integration with the GBT optical link. The GBT–SCA is one the components of the GBT system chipset. It is proposed for the future SLHC experiments and is designed to be configurable matching different front-end system requirements. The GBT-SCA is intended for the slow control and monitoring of the embedded front end electronics and implements a point-to-multi point connection between one GBT optical link ASIC and several front end ASICs. The GBT-SCA connects to a dedicated electrica...

  7. ATLAS

    CERN Multimedia

    Akhnazarov, V; Canepa, A; Bremer, J; Burckhart, H; Cattai, A; Voss, R; Hervas, L; Kaplon, J; Nessi, M; Werner, P; Ten kate, H; Tyrvainen, H; Vandelli, W; Krasznahorkay, A; Gray, H; Alvarez gonzalez, B; Eifert, T F; Rolando, G; Oide, H; Barak, L; Glatzer, J; Backhaus, M; Schaefer, D M; Maciejewski, J P; Milic, A; Jin, S; Von torne, E; Limbach, C; Medinnis, M J; Gregor, I; Levonian, S; Schmitt, S; Waananen, A; Monnier, E; Muanza, S G; Pralavorio, P; Talby, M; Tiouchichine, E; Tocut, V M; Rybkin, G; Wang, S; Lacour, D; Laforge, B; Ocariz, J H; Bertoli, W; Malaescu, B; Sbarra, C; Yamamoto, A; Sasaki, O; Koriki, T; Hara, K; Da silva gomes, A; Carvalho maneira, J; Marcalo da palma, A; Chekulaev, S; Tikhomirov, V; Snesarev, A; Buzykaev, A; Maslennikov, A; Peleganchuk, S; Sukharev, A; Kaplan, B E; Swiatlowski, M J; Nef, P D; Schnoor, U; Oakham, G F; Ueno, R; Orr, R S; Abouzeid, O; Haug, S; Peng, H; Kus, V; Vitek, M; Temming, K K; Dang, N P; Meier, K; Schultz-coulon, H; Geisler, M P; Sander, H; Schaefer, U; Ellinghaus, F; Rieke, S; Nussbaumer, A; Liu, Y; Richter, R; Kortner, S; Fernandez-bosman, M; Ullan comes, M; Espinal curull, J; Chiriotti alvarez, S; Caubet serrabou, M; Valladolid gallego, E; Kaci, M; Carrasco vela, N; Lancon, E C; Besson, N E; Gautard, V; Bracinik, J; Bartsch, V C; Potter, C J; Lester, C G; Moeller, V A; Rosten, J; Crooks, D; Mathieson, K; Houston, S C; Wright, M; Jones, T W; Harris, O B; Byatt, T J; Dobson, E; Hodgson, P; Hodgkinson, M C; Dris, M; Karakostas, K; Ntekas, K; Oren, D; Duchovni, E; Etzion, E; Oren, Y; Ferrer, L M; Testa, M; Doria, A; Merola, L; Sekhniaidze, G; Giordano, R; Ricciardi, S; Milazzo, A; Falciano, S; De pedis, D; Dionisi, C; Veneziano, S; Cardarelli, R; Verzegnassi, C; Soualah, R; Ochi, A; Ohshima, T; Kishiki, S; Linde, F L; Vreeswijk, M; Werneke, P; Muijs, A; Vankov, P H; Jansweijer, P P M; Dale, O; Lund, E; Bruckman de renstrom, P; Dabrowski, W; Adamek, J D; Wolters, H; Micu, L; Pantea, D; Tudorache, V; Mjoernmark, J; Klimek, P J; Ferrari, A; Abdinov, O; Akhoundov, A; Hashimov, R; Shelkov, G; Khubua, J; Ladygin, E; Lazarev, A; Glagolev, V; Dedovich, D; Lykasov, G; Zhemchugov, A; Zolnikov, Y; Ryabenko, M; Sivoklokov, S; Vasilyev, I; Shalimov, A; Lobanov, M; Paramoshkina, E; Mosidze, M; Bingul, A; Nodulman, L J; Guarino, V J; Yoshida, R; Drake, G R; Calafiura, P; Haber, C; Quarrie, D R; Alonso, J R; Anderson, C; Evans, H; Lammers, S W; Baubock, M; Anderson, K; Petti, R; Suhr, C A; Linnemann, J T; Richards, R A; Tollefson, K A; Holzbauer, J L; Stoker, D P; Pier, S; Nelson, A J; Isakov, V; Martin, A J; Adelman, J A; Paganini, M; Gutierrez, P; Snow, J M; Pearson, B L; Cleland, W E; Savinov, V; Wong, W; Goodson, J J; Li, H; Lacey, R A; Gordeev, A; Gordon, H; Lanni, F; Nevski, P; Rescia, S; Kierstead, J A; Liu, Z; Yu, W W H; Bensinger, J; Hashemi, K S; Bogavac, D; Cindro, V; Hoeferkamp, M R; Coelli, S; Iodice, M; Piegaia, R N; Alonso, F; Wahlberg, H P; Barberio, E L; Limosani, A; Rodd, N L; Jennens, D T; Hill, E C; Pospisil, S; Smolek, K; Schaile, D A; Rauscher, F G; Adomeit, S; Mattig, P M; Wahlen, H; Volkmer, F; Calvente lopez, S; Sanchis peris, E J; Pallin, D; Podlyski, F; Says, L; Boumediene, D E; Scott, W; Phillips, P W; Greenall, A; Turner, P; Gwilliam, C B; Kluge, T; Wrona, B; Sellers, G J; Millward, G; Adragna, P; Hartin, A; Alpigiani, C; Piccaro, E; Bret cano, M; Hughes jones, R E; Mercer, D; Oh, A; Chavda, V S; Carminati, L; Cavasinni, V; Fedin, O; Patrichev, S; Ryabov, Y; Nesterov, S; Grebenyuk, O; Sasso, J; Mahmood, H; Polsdofer, E; Dai, T; Ferretti, C; Liu, H; Hegazy, K H; Benjamin, D P; Zobernig, G; Ban, J; Brooijmans, G H; Keener, P; Williams, H H; Le geyt, B C; Hines, E J; Fadeyev, V; Schumm, B A; Law, A T; Kuhl, A D; Neubauer, M S; Shang, R; Gagliardi, G; Calabro, D; Conta, C; Zinna, M; Jones, G; Li, J; Stradling, A R; Hadavand, H K; Mcguigan, P; Chiu, P; Baldelomar, E; Stroynowski, R A; Kehoe, R L; De groot, N; Timmermans, C; Lach-heb, F; Addy, T N; Nakano, I; Moreno lopez, D; Grosse-knetter, J; Tyson, B; Rude, G D; Tafirout, R; Benoit, P; Danielsson, H O; Elsing, M; Fassnacht, P; Froidevaux, D; Ganis, G; Gorini, B; Lasseur, C; Lehmann miotto, G; Kollar, D; Aleksa, M; Sfyrla, A; Duehrssen-debling, K; Fressard-batraneanu, S; Van der ster, D C; Bortolin, C; Schumacher, J; Mentink, M; Geich-gimbel, C; Yau wong, K H; Lafaye, R; Crepe-renaudin, S; Albrand, S; Hoffmann, D; Pangaud, P; Meessen, C; Hrivnac, J; Vernay, E; Perus, A; Henrot versille, S L; Le dortz, O; Derue, F; Piccinini, M; Polini, A; Terada, S; Arai, Y; Ikeno, M; Fujii, H; Nagano, K; Ukegawa, F; Aguilar saavedra, J A; Conde muino, P; Castro, N F; Eremin, V; Kopytine, M; Sulin, V; Tsukerman, I; Korol, A; Nemethy, P; Bartoldus, R; Glatte, A; Chelsky, S; Van nieuwkoop, J; Bellerive, A; Sinervo, J K; Battaglia, A; Barbier, G J; Pohl, M; Rosselet, L; Alexandre, G B; Prokoshin, F; Pezoa rivera, R A; Batkova, L; Kladiva, E; Stastny, J; Kubes, T; Vidlakova, Z; Esch, H; Homann, M; Herten, L G; Zimmermann, S U; Pfeifer, B; Stenzel, H; Andrei, G V; Wessels, M; Buescher, V; Kleinknecht, K; Fiedler, F M; Schroeder, C D; Fernandez, E; Mir martinez, L; Vorwerk, V; Bernabeu verdu, J; Salt, J; Civera navarrete, J V; Bernard, R; Berriaud, C P; Chevalier, L P; Hubbard, R; Schune, P; Nikolopoulos, K; Batley, J R; Brochu, F M; Phillips, A W; Teixeira-dias, P J; Rose, M B D; Buttar, C; Buckley, A G; Nurse, E L; Larner, A B; Boddy, C; Henderson, J; Costanzo, D; Tarem, S; Maccarrone, G; Laurelli, P F; Alviggi, M; Chiaramonte, R; Izzo, V; Palumbo, V; Fraternali, M; Crosetti, G; Marchese, F; Yamaguchi, Y; Hessey, N P; Mechnich, J M; Liebig, W; Kastanas, K A; Sjursen, T B; Zalieckas, J; Cameron, D G; Banka, P; Kowalewska, A B; Dwuznik, M; Mindur, B; Boldea, V; Hedberg, V; Smirnova, O; Sellden, B; Allahverdiyev, T; Gornushkin, Y; Koultchitski, I; Tokmenin, V; Chizhov, M; Gongadze, A; Khramov, E; Sadykov, R; Krasnoslobodtsev, I; Smirnova, L; Kramarenko, V; Minaenko, A; Zenin, O; Beddall, A J; Ozcan, E V; Hou, S; Wang, S; Moyse, E; Willocq, S; Chekanov, S; Le compte, T J; Love, J R; Ciocio, A; Hinchliffe, I; Tsulaia, V; Gomez, A; Luehring, F; Zieminska, D; Huth, J E; Gonski, J L; Oreglia, M; Tang, F; Shochet, M J; Costin, T; Mcleod, A; Uzunyan, S; Martin, S P; Pope, B G; Schwienhorst, R H; Brau, J E; Ptacek, E S; Milburn, R H; Sabancilar, E; Lauer, R; Saleem, M; Mohamed meera lebbai, M R; Lou, X; Reeves, K B; Rijssenbeek, M; Novakova, P N; Rahm, D; Steinberg, P A; Wenaus, T J; Paige, F; Ye, S; Kotcher, J R; Assamagan, K A; Oliveira damazio, D; Maeno, T; Henry, A; Dushkin, A; Costa, G; Meroni, C; Resconi, S; Lari, T; Biglietti, M; Lohse, T; Gonzalez silva, M L; Monticelli, F G; Saavedra, A F; Patel, N D; Ciodaro xavier, T; Asevedo nepomuceno, A; Lefebvre, M; Albert, J E; Kubik, P; Faltova, J; Turecek, D; Solc, J; Schaile, O; Ebke, J; Losel, P J; Zeitnitz, C; Sturm, P D; Barreiro alonso, F; Modesto alapont, P; Soret medel, J; Garzon alama, E J; Gee, C N; Mccubbin, N A; Sankey, D; Emeliyanov, D; Dewhurst, A L; Houlden, M A; Klein, M; Burdin, S; Lehan, A K; Eisenhandler, E; Lloyd, S; Traynor, D P; Ibbotson, M; Marshall, R; Pater, J; Freestone, J; Masik, J; Haughton, I; Manousakis katsikakis, A; Sampsonidis, D; Krepouri, A; Roda, C; Sarri, F; Fukunaga, C; Nadtochiy, A; Kara, S O; Timm, S; Alam, S M; Rashid, T; Goldfarb, S; Espahbodi, S; Marley, D E; Rau, A W; Dos anjos, A R; Haque, S; Grau, N C; Havener, L B; Thomson, E J; Newcomer, F M; Hansl-kozanecki, G; Deberg, H A; Takeshita, T; Goggi, V; Ennis, J S; Olness, F I; Kama, S; Ordonez sanz, G; Koetsveld, F; Elamri, M; Mansoor-ul-islam, S; Lemmer, B; Kawamura, G; Bindi, M; Schulte, S; Kugel, A; Kretz, M P; Kurchaninov, L; Blanchot, G; Chromek-burckhart, D; Di girolamo, B; Francis, D; Gianotti, F; Nordberg, M Y; Pernegger, H; Roe, S; Boyd, J; Wilkens, H G; Pauly, T; Fabre, C; Tricoli, A; Bertet, D; Ruiz martinez, M A; Arnaez, O L; Lenzi, B; Boveia, A J; Gillberg, D I; Davies, J M; Zimmermann, R; Uhlenbrock, M; Kraus, J K; Narayan, R T; John, A; Dam, M; Padilla aranda, C; Bellachia, F; Le flour chollet, F M; Jezequel, S; Dumont dayot, N; Fede, E; Mathieu, M; Gensolen, F D; Alio, L; Arnault, C; Bouchel, M; Ducorps, A; Kado, M M; Lounis, A; Zhang, Z P; De vivie de regie, J; Beau, T; Bruni, A; Bruni, G; Grafstrom, P; Romano, M; Lasagni manghi, F; Massa, L; Shaw, K; Ikegami, Y; Tsuno, S; Kawanishi, Y; Benincasa, G; Blagov, M; Fedorchuk, R; Shatalov, P; Romaniouk, A; Belotskiy, K; Timoshenko, S; Hooft van huysduynen, L; Lewis, G H; Wittgen, M M; Mader, W F; Rudolph, C J; Gumpert, C; Mamuzic, J; Rudolph, G; Schmid, P; Corriveau, F; Belanger-champagne, C; Yarkoni, S; Leroy, C; Koffas, T; Harack, B D; Weber, M S; Beck, H; Leger, A; Gonzalez sevilla, S; Zhu, Y; Gao, J; Zhang, X; Blazek, T; Rames, J; Sicho, P; Kouba, T; Sluka, T; Lysak, R; Ristic, B; Kompatscher, A E; Von radziewski, H; Groll, M; Meyer, C P; Oberlack, H; Stonjek, S M; Cortiana, G; Werthenbach, U; Ibragimov, I; Czirr, H S; Cavalli-sforza, M; Puigdengoles olive, C; Tallada crespi, P; Marti i garcia, S; Gonzalez de la hoz, S; Guyot, C; Meyer, J; Schoeffel, L O; Garvey, J; Hawkes, C; Hillier, S J; Staley, R J; Salvatore, P F; Santoyo castillo, I; Carter, J; Yusuff, I B; Barlow, N R; Berry, T S; Savage, G; Wraight, K G; Steele, G E; Hughes, G; Walder, J W; Love, P A; Crone, G J; Waugh, B M; Boeser, S; Sarkar, A M; Holmes, A; Massey, R; Pinder, A; Nicholson, R; Korolkova, E; Katsoufis, I; Maltezos, S; Tsipolitis, G; Leontsinis, S; Levinson, L J; Shoa, M; Abramowicz, H E; Bella, G; Gershon, A; Urkovsky, E; Taiblum, N; Gatti, C; Della pietra, M; Lanza, A; Negri, A; Flaminio, V; Lacava, F; Petrolo, E; Pontecorvo, L; Rosati, S; Zanello, L; Pasqualucci, E; Di ciaccio, A; Giordani, M; Yamazaki, Y; Jinno, T; Nomachi, M; De jong, P J; Ferrari, P; Homma, J; Van der graaf, H; Igonkina, O B; Stugu, B S; Buanes, T; Pedersen, M; Turala, M; Olszewski, A J; Koperny, S Z; Onofre, A; Castro nunes fiolhais, M; Alexa, C; Cuciuc, C M; Akesson, T P A; Hellman, S L; Milstead, D A; Bondyakov, A; Pushnova, V; Budagov, Y; Minashvili, I; Romanov, V; Sniatkov, V; Tskhadadze, E; Kalinovskaya, L; Shalyugin, A; Tavkhelidze, A; Rumyantsev, L; Karpov, S; Soloshenko, A; Vostrikov, A; Borissov, E; Solodkov, A; Vorob'ev, A; Sidorov, S; Malyaev, V; Lee, S; Grudzinski, J J; Virzi, J S; Vahsen, S E; Lys, J; Penwell, J W; Yan, Z; Bernard, C S; Barreiro guimaraes da costa, J P; Oliver, J N; Merritt, F S; Brubaker, E M; Kapliy, A; Kim, J; Zutshi, V V; Burghgrave, B O; Abolins, M A; Arabidze, G; Caughron, S A; Frey, R E; Radloff, P T; Schernau, M; Murillo garcia, R; Porter, R A; Mccormick, C A; Karn, P J; Sliwa, K J; Demers konezny, S M; Strauss, M G; Mueller, J A; Izen, J M; Klimentov, A; Lynn, D; Polychronakos, V; Radeka, V; Sondericker, J I I I; Bathe, S; Duffin, S; Chen, H; De castro faria salgado, P E; Kersevan, B P; Lacker, H M; Schulz, H; Kubota, T; Tan, K G; Yabsley, B D; Nunes de moura junior, N; Pinfold, J; Soluk, R A; Ouellette, E A; Leitner, R; Sykora, T; Solar, M; Sartisohn, G; Hirschbuehl, D; Huning, D; Fischer, J; Terron cuadrado, J; Glasman kuguel, C B; Lacasta llacer, C; Lopez-amengual, J; Calvet, D; Chevaleyre, J; Daudon, F; Montarou, G; Guicheney, C; Calvet, S P J; Tyndel, M; Dervan, P J; Maxfield, S J; Hayward, H S; Beck, G; Cox, B; Da via, C; Paschalias, P; Manolopoulou, M; Ragusa, F; Cimino, D; Ezzi, M; Fiuza de barros, N F; Yildiz, H; Ciftci, A K; Turkoz, S; Zain, S B; Tegenfeldt, F; Chapman, J W; Panikashvili, N; Bocci, A; Altheimer, A D; Martin, F F; Fratina, S; Jackson, B D; Grillo, A A; Seiden, A; Watts, G T; Mangiameli, S; Johns, K A; O'grady, F T; Errede, D R; Darbo, G; Ferretto parodi, A; Leahu, M C; Farbin, A; Ye, J; Liu, T; Wijnen, T A; Naito, D; Takashima, R; Sandoval usme, C E; Zinonos, Z; Moreno llacer, M; Agricola, J B; Mcgovern, S A; Sakurai, Y; Trigger, I M; Qing, D; De silva, A S; Butin, F; Dell'acqua, A; Hawkings, R J; Lamanna, M; Mapelli, L; Passardi, G; Rembser, C; Tremblet, L; Andreazza, W; Dobos, D A; Koblitz, B; Bianco, M; Dimitrov, G V; Schlenker, S; Armbruster, A J; Rammensee, M C; Romao rodrigues, L F; Peters, K; Pozo astigarraga, M E; Yi, Y; Desch, K K; Huegging, F G; Muller, K K; Stillings, J A; Schaetzel, S; Xella, S; Hansen, J D; Colas, J; Daguin, G; Wingerter, I; Ionescu, G D; Ledroit, F; Lucotte, A; Clement, B E; Stark, J; Clemens, J; Djama, F; Knoops, E; Coadou, Y; Vigeolas-choury, E; Feligioni, L; Iconomidou-fayard, L; Imbert, P; Schaffer, A C; Nikolic, I; Trincaz-duvoid, S; Warin, P; Camard, A F; Ridel, M; Pires, S; Giacobbe, B; Spighi, R; Villa, M; Negrini, M; Sato, K; Gavrilenko, I; Akimov, A; Khovanskiy, V; Talyshev, A; Voronkov, A; Hakobyan, H; Mallik, U; Shibata, A; Konoplich, R; Barklow, T L; Koi, T; Straessner, A; Stelzer, B; Robertson, S H; Vachon, B; Stoebe, M; Keyes, R A; Wang, K; Billoud, T R V; Strickland, V; Batygov, M; Krieger, P; Palacino caviedes, G D; Gay, C W; Jiang, Y; Han, L; Liu, M; Zenis, T; Lokajicek, M; Staroba, P; Tasevsky, M; Popule, J; Svatos, M; Seifert, F; Landgraf, U; Lai, S T; Schmitt, K H; Achenbach, R; Schuh, N; Kiesling, C; Macchiolo, A; Nisius, R; Schacht, P; Von der schmitt, J G; Kortner, O; Atlay, N B; Segura sole, E; Grinstein, S; Neissner, C; Bruckner, D M; Oliver garcia, E; Boonekamp, M; Perrin, P; Gaillot, F M; Wilson, J A; Thomas, J P; Thompson, P D; Palmer, J D; Falk, I E; Chavez barajas, C A; Sutton, M R; Robinson, D; Kaneti, S A; Wu, T; Robson, A; Shaw, C; Buzatu, A; Qin, G; Jones, R; Bouhova-thacker, E V; Viehhauser, G; Weidberg, A R; Gilbert, L; Johansson, P D C; Orphanides, M; Vlachos, S; Behar harpaz, S; Papish, O; Lellouch, D J H; Turgeman, D; Benary, O; La rotonda, L; Vena, R; Tarasio, A; Marzano, F; Gabrielli, A; Di stante, L; Liberti, B; Aielli, G; Oda, S; Nozaki, M; Takeda, H; Hayakawa, T; Miyazaki, K; Maeda, J; Sugimoto, T; Pettersson, N E; Bentvelsen, S; Groenstege, H L; Lipniacka, A; Vahabi, M; Ould-saada, F; Chwastowski, J J; Hajduk, Z; Kaczmarska, A; Olszowska, J B; Trzupek, A; Staszewski, R P; Palka, M; Constantinescu, S; Jarlskog, G; Lundberg, B L A; Pearce, M; Ellert, M F; Bannikov, A; Fechtchenko, A; Iambourenko, V; Kukhtin, V; Pozdniakov, V; Topilin, N; Vorozhtsov, S; Khassanov, A; Fliaguine, V; Kharchenko, D; Nikolaev, K; Kotenov, K; Kozhin, A; Zenin, A; Ivashin, A; Golubkov, D; Beddall, A; Su, D; Dallapiccola, C J; Cranshaw, J M; Price, L; Stanek, R W; Gieraltowski, G; Zhang, J; Gilchriese, M; Shapiro, M; Ahlen, S; Morii, M; Taylor, F E; Miller, R J; Phillips, F H; Torrence, E C; Wheeler, S J; Benedict, B H; Napier, A; Hamilton, S F; Petrescu, T A; Boyd, G R J; Jayasinghe, A L; Smith, J M; Mc carthy, R L; Adams, D L; Le vine, M J; Zhao, X; Patwa, A M; Baker, M; Kirsch, L; Krstic, J; Simic, L; Filipcic, A; Seidel, S C; Cantore-cavalli, D; Baroncelli, A; Kind, O M; Scarcella, M J; Maidantchik, C L L; Seixas, J; Balabram filho, L E; Vorobel, V; Spousta, M; Strachota, P; Vokac, P; Slavicek, T; Bergmann, B L; Biebel, O; Kersten, S; Srinivasan, M; Trefzger, T; Vazeille, F; Insa, C; Kirk, J; Middleton, R; Burke, S; Klein, U; Morris, J D; Ellis, K V; Millward, L R; Giokaris, N; Ioannou, P; Angelidakis, S; Bouzakis, K; Andreazza, A; Perini, L; Chtcheguelski, V; Spiridenkov, E; Yilmaz, M; Kaya, U; Ernst, J; Mahmood, A; Saland, J; Kutnink, T; Holler, J; Kagan, H P; Wang, C; Pan, Y; Xu, N; Ji, H; Willis, W J; Tuts, P M; Litke, A; Wilder, M; Rothberg, J; Twomey, M S; Rizatdinova, F; Loch, P; Rutherfoord, J P; Varnes, E W; Barberis, D; Osculati-becchi, B; Brandt, A G; Turvey, A J; Benchekroun, D; Nagasaka, Y; Thanakornworakij, T; Quadt, A; Nadal serrano, J; Magradze, E; Nackenhorst, O; Musheghyan, H; Kareem, M; Chytka, L; Perez codina, E; Stelzer-chilton, O; Brunel, B; Henriques correia, A M; Dittus, F; Hatch, M; Haug, F; Hauschild, M; Huhtinen, M; Lichard, P; Schuh-erhard, S; Spigo, G; Avolio, G; Tsarouchas, C; Ahmad, I; Backes, M P; Barisits, M; Gadatsch, S; Cerv, M; Sicoe, A D; Nattamai sekar, L P; Fazio, D; Shan, L; Sun, X; Gaycken, G F; Hemperek, T; Petersen, T C; Alonso diaz, A; Moynot, M; Werlen, M; Hryn'ova, T; Gallin-martel, M; Wu, M; Touchard, F; Menouni, M; Fougeron, D; Le guirriec, E; Chollet, J C; Veillet, J; Barrillon, P; Prat, S; Krasny, M W; Roos, L; Boudarham, G; Lefebvre, G; Boscherini, D; Valentinetti, S; Acharya, B S; Miglioranzi, S; Kanzaki, J; Unno, Y; Yasu, Y; Iwasaki, H; Tokushuku, K; Maio, A; Rodrigues fernandes, B J; Pinto figueiredo raimundo ribeiro, N M; Bot, A; Shmeleva, A; Zaidan, R; Djilkibaev, R; Mincer, A I; Salnikov, A; Aracena, I A; Schwartzman, A G; Silverstein, D J; Fulsom, B G; Anulli, F; Kuhn, D; White, M J; Vetterli, M J; Stockton, M C; Mantifel, R L; Azuelos, G; Shoaleh saadi, D; Savard, P; Clark, A; Ferrere, D; Gaumer, O P; Diaz gutierrez, M A; Liu, Y; Dubnickova, A; Sykora, I; Strizenec, P; Weichert, J; Zitek, K; Naumann, T; Goessling, C; Klingenberg, R; Jakobs, K; Rurikova, Z; Werner, M W; Arnold, H R; Buscher, D; Hanke, P; Stamen, R; Dietzsch, T A; Kiryunin, A; Salihagic, D; Buchholz, P; Pacheco pages, A; Sushkov, S; Porto fernandez, M D C; Cruz josa, R; Vos, M A; Schwindling, J; Ponsot, P; Charignon, C; Kivernyk, O; Goodrick, M J; Hill, J C; Green, B J; Quarman, C V; Bates, R L; Allwood-spiers, S E; Quilty, D; Chilingarov, A; Long, R E; Barton, A E; Konstantinidis, N; Simmons, B; Davison, A R; Christodoulou, V; Wastie, R L; Gallas, E J; Cox, J; Dehchar, M; Behr, J K; Pickering, M A; Filippas, A; Panagoulias, I; Tenenbaum katan, Y D; Roth, I; Pitt, M; Citron, Z H; Benhammou, Y; Amram, N Y N; Soffer, A; Gorodeisky, R; Antonelli, M; Chiarella, V; Curatolo, M; Esposito, B; Nicoletti, G; Martini, A; Sansoni, A; Carlino, G; Del prete, T; Bini, C; Vari, R; Kuna, M; Pinamonti, M; Itoh, Y; Colijn, A P; Klous, S; Garitaonandia elejabarrieta, H; Rosendahl, P L; Taga, A V; Malecki, P; Malecki, P; Wolter, M W; Kowalski, T; Korcyl, G M; Caprini, M; Caprini, I; Dita, P; Olariu, A; Tudorache, A; Lytken, E; Hidvegi, A; Aliyev, M; Alexeev, G; Bardin, D; Kakurin, S; Lebedev, A; Golubykh, S; Chepurnov, V; Gostkin, M; Kolesnikov, V; Karpova, Z; Davkov, K I; Yeletskikh, I; Grishkevich, Y; Rud, V; Myagkov, A; Nikolaenko, V; Starchenko, E; Zaytsev, A; Fakhrutdinov, R; Cheine, I; Istin, S; Sahin, S; Teng, P; Chu, M L; Trilling, G H; Heinemann, B; Richoz, N; Degeorge, C; Youssef, S; Pilcher, J; Cheng, Y; Purohit, M V; Kravchenko, A; Calkins, R E; Blazey, G; Hauser, R; Koll, J D; Reinsch, A; Brost, E C; Allen, B W; Lankford, A J; Ciobotaru, M D; Slagle, K J; Haffa, B; Mann, A; Loginov, A; Cummings, J T; Loyal, J D; Skubic, P L; Boudreau, J F; Lee, B E; Redlinger, G; Wlodek, T; Carcassi, G; Sexton, K A; Yu, D; Deng, W; Metcalfe, J E; Panitkin, S; Sijacki, D; Mikuz, M; Kramberger, G; Tartarelli, G F; Farilla, A; Stanescu, C; Herrberg, R; Alconada verzini, M J; Brennan, A J; Varvell, K; Marroquim, F; Gomes, A A; Do amaral coutinho, Y; Gingrich, D; Moore, R W; Dolejsi, J; Valkar, S; Broz, J; Jindra, T; Kohout, Z; Kral, V; Mann, A W; Calfayan, P P; Langer, T; Hamacher, K; Sanny, B; Wagner, W; Flick, T; Redelbach, A R; Ke, Y; Higon-rodriguez, E; Donini, J N; Lafarguette, P; Adye, T J; Baines, J; Barnett, B; Wickens, F J; Martin, V J; Jackson, J N; Prichard, P; Kretzschmar, J; Martin, A J; Walker, C J; Potter, K M; Kourkoumelis, C; Tzamarias, S; Houiris, A G; Iliadis, D; Fanti, M; Bertolucci, F; Maleev, V; Sultanov, S; Rosenberg, E I; Krumnack, N E; Bieganek, C; Diehl, E B; Mc kee, S P; Eppig, A P; Harper, D R; Liu, C; Schwarz, T A; Mazor, B; Looper, K A; Wiedenmann, W; Huang, P; Stahlman, J M; Battaglia, M; Nielsen, J A; Zhao, T; Khanov, A; Kaushik, V S; Vichou, E; Liss, A M; Gemme, C; Morettini, P; Parodi, F; Passaggio, S; Rossi, L; Kuzhir, P; Ignatenko, A; Ferrari, R; Spairani, M; Pianori, E; Sekula, S J; Firan, A I; Cao, T; Hetherly, J W; Gouighri, M; Vassilakopoulos, V; Long, M C; Shimojima, M; Sawyer, L H; Brummett, R E; Losada, M A; Schorlemmer, A L; Mantoani, M; Bawa, H S; Mornacchi, G; Nicquevert, B; Palestini, S; Stapnes, S; Veness, R; Kotamaki, M J; Sorde, C; Iengo, P; Campana, S; Goossens, L; Zajacova, Z; Pribyl, L; Poveda torres, J; Marzin, A; Conti, G; Carrillo montoya, G D; Kroseberg, J; Gonella, L; Velz, T; Schmitt, S; Lobodzinska, E M; Lovschall-jensen, A E; Galster, G; Perrot, G; Cailles, M; Berger, N; Barnovska, Z; Delsart, P; Lleres, A; Tisserant, S; Grivaz, J; Matricon, P; Bellagamba, L; Bertin, A; Bruschi, M; De castro, S; Semprini cesari, N; Fabbri, L; Rinaldi, L; Quayle, W B; Truong, T N L; Kondo, T; Haruyama, T; Ng, C; Do valle wemans, A; Almeida veloso, F M; Konovalov, S; Ziegler, J M; Su, D; Lukas, W; Prince, S; Ortega urrego, E J; Teuscher, R J; Knecht, N; Pretzl, K; Borer, C; Gadomski, S; Koch, B; Kuleshov, S; Brooks, W K; Antos, J; Kulkova, I; Chudoba, J; Chyla, J; Tomasek, L; Bazalova, M; Messmer, I; Tobias, J; Sundermann, J E; Kuehn, S S; Kluge, E; Scharf, V L; Barillari, T; Kluth, S; Menke, S; Weigell, P; Schwegler, P; Ziolkowski, M; Casado lechuga, P M; Garcia, C; Sanchez, J; Costa mezquita, M J; Valero biot, J A; Laporte, J; Nikolaidou, R; Virchaux, M; Nguyen, V T H; Charlton, D; Harrison, K; Slater, M W; Newman, P R; Parker, A M; Ward, P; Mcgarvie, S A; Kilvington, G J; D'auria, S; O'shea, V; Mcglone, H M; Fox, H; Henderson, R; Kartvelishvili, V; Davies, B; Sherwood, P; Fraser, J T; Lancaster, M A; Tseng, J C; Hays, C P; Apolle, R; Dixon, S D; Parker, K A; Gazis, E; Papadopoulou, T; Panagiotopoulou, E; Karastathis, N; Hershenhorn, A D; Milov, A; Groth-jensen, J; Bilokon, H; Miscetti, S; Canale, V; Rebuzzi, D M; Capua, M; Bagnaia, P; De salvo, A; Gentile, S; Safai tehrani, F; Solfaroli camillocci, E; Sasao, N; Tsunada, K; Massaro, G; Magrath, C A; Van kesteren, Z; Beker, M G; Van den wollenberg, W; Bugge, L; Buran, T; Read, A L; Gjelsten, B K; Banas, E A; Turnau, J; Derendarz, D K; Kisielewska, D; Chesneanu, D; Rotaru, M; Maurer, J B; Wong, M L; Lund-jensen, B; Asman, B; Jon-and, K B; Silverstein, S B; Johansen, M; Alexandrov, I; Iatsounenko, I; Krumshteyn, Z; Peshekhonov, V; Rybaltchenko, K; Samoylov, V; Cheplakov, A; Kekelidze, G; Lyablin, M; Teterine, V; Bednyakov, V; Kruchonak, U; Shiyakova, M M; Demichev, M; Denisov, S P; Fenyuk, A; Djobava, T; Salukvadze, G; Cetin, S A; Brau, B P; Pais, P R; Proudfoot, J; Van gemmeren, P; Zhang, Q; Beringer, J A; Ely, R; Leggett, C; Pengg, F X; Barnett, M R; Quick, R E; Williams, S; Gardner jr, R W; Huston, J; Brock, R; Wanotayaroj, C; Unel, G N; Taffard, A C; Frate, M; Baker, K O; Tipton, P L; Hutchison, A; Walsh, B J; Norberg, S R; Su, J; Tsybyshev, D; Caballero bejar, J; Ernst, M U; Wellenstein, H; Vudragovic, D; Vidic, I; Gorelov, I V; Toms, K; Alimonti, G; Petrucci, F; Kolanoski, H; Smith, J; Jeng, G; Watson, I J; Guimaraes ferreira, F; Miranda vieira xavier, F; Araujo pereira, R; Poffenberger, P; Sopko, V; Elmsheuser, J; Wittkowski, J; Glitza, K; Gorfine, G W; Ferrer soria, A; Fuster verdu, J A; Sanchis lozano, A; Reinmuth, G; Busato, E; Haywood, S J; Mcmahon, S J; Qian, W; Villani, E G; Laycock, P J; Poll, A J; Rizvi, E S; Foster, J M; Loebinger, F; Forti, A; Plano, W G; Brown, G J A; Kordas, K; Vegni, G; Ohsugi, T; Iwata, Y; Cherkaoui el moursli, R; Sahin, M; Akyazi, E; Carlsen, A; Kanwal, B; Cochran jr, J H; Aronnax, M V; Lockner, M J; Zhou, B; Levin, D S; Weaverdyck, C J; Grom, G F; Rudge, A; Ebenstein, W L; Jia, B; Yamaoka, J; Jared, R C; Wu, S L; Banerjee, S; Lu, Q; Hughes, E W; Alkire, S P; Degenhardt, J D; Lipeles, E D; Spencer, E N; Savine, A; Cheu, E C; Lampl, W; Veatch, J R; Roberts, K; Atkinson, M J; Odino, G A; Polesello, G; Martin, T; White, A P; Stephens, R; Grinbaum sarkisyan, E; Vartapetian, A; Yu, J; Sosebee, M; Thilagar, P A; Spurlock, B; Bonde, R; Filthaut, F; Klok, P; Hoummada, A; Ouchrif, M; Pellegrini, G; Rafi tatjer, J M; Navarro, G A; Blumenschein, U; Weingarten, J C; Mueller, D; Graber, L; Gao, Y; Bode, A; Capeans garrido, M D M; Carli, T; Wells, P; Beltramello, O; Vuillermet, R; Dudarev, A; Salzburger, A; Torchiani, C I; Serfon, C L G; Sloper, J E; Duperrier, G; Lilova, P T; Knecht, M O; Lassnig, M; Anders, G; Deviveiros, P; Young, C; Sforza, F; Shaochen, C; Lu, F; Wermes, N; Wienemann, P; Schwindt, T; Hansen, P H; Hansen, J B; Pingel, A M; Massol, N; Elles, S L; Hallewell, G D; Rozanov, A; Vacavant, L; Fournier, D A; Poggioli, L; Puzo, P M; Tanaka, R; Escalier, M A; Makovec, N; Rezynkina, K; De cecco, S; Cavalleri, P G; Massa, I; Zoccoli, A; Tanaka, S; Odaka, S; Mitsui, S; Tomasio pina, J A; Santos, H F; Satsounkevitch, I; Harkusha, S; Baranov, S; Nechaeva, P; Kayumov, F; Kazanin, V; Asai, M; Mount, R P; Nelson, T K; Smith, D; Kenney, C J; Malone, C M; Kobel, M; Friedrich, F; Grohs, J P; Jais, W J; O'neil, D C; Warburton, A T; Vincter, M; Mccarthy, T G; Groer, L S; Pham, Q T; Taylor, W J; La marra, D; Perrin, E; Wu, X; Bell, W H; Delitzsch, C M; Feng, C; Zhu, C; Tokar, S; Bruncko, D; Kupco, A; Marcisovsky, M; Jakoubek, T; Bruneliere, R; Aktas, A; Narrias villar, D I; Tapprogge, S; Mattmann, J; Kroha, H; Crespo, J; Korolkov, I; Cavallaro, E; Cabrera urban, S; Mitsou, V; Kozanecki, W; Mansoulie, B; Pabot, Y; Etienvre, A; Bauer, F; Chevallier, F; Bouty, A R; Watkins, P; Watson, A; Faulkner, P J W; Curtis, C J; Murillo quijada, J A; Grout, Z J; Chapman, J D; Cowan, G D; George, S; Boisvert, V; Mcmahon, T R; Doyle, A T; Thompson, S A; Britton, D; Smizanska, M; Campanelli, M; Butterworth, J M; Loken, J; Renton, P; Barr, A J; Issever, C; Short, D; Crispin ortuzar, M; Tovey, D R; French, R; Rozen, Y; Alexander, G; Kreisel, A; Conventi, F; Raulo, A; Schioppa, M; Susinno, G; Tassi, E; Giagu, S; Luci, C; Nisati, A; Cobal, M; Ishikawa, A; Jinnouchi, O; Bos, K; Verkerke, W; Vermeulen, J; Van vulpen, I B; Kieft, G; Mora, K D; Olsen, F; Rohne, O M; Pajchel, K; Nilsen, J K; Wosiek, B K; Wozniak, K W; Badescu, E; Jinaru, A; Bohm, C; Johansson, E K; Sjoelin, J B R; Clement, C; Buszello, C P; Huseynova, D; Boyko, I; Popov, B; Poukhov, O; Vinogradov, V; Tsiareshka, P; Skvorodnev, N; Soldatov, A; Chuguev, A; Gushchin, V; Yazici, E; Lutz, M S; Malon, D; Vanyashin, A; Lavrijsen, W; Spieler, H; Biesiada, J L; Bahr, M; Kong, J; Tatarkhanov, M; Ogren, H; Van kooten, R J; Cwetanski, P; Butler, J M; Shank, J T; Chakraborty, D; Ermoline, I; Sinev, N; Whiteson, D O; Corso radu, A; Huang, J; Werth, M P; Kastoryano, M; Meirose da silva costa, B; Namasivayam, H; Hobbs, J D; Schamberger jr, R D; Guo, F; Potekhin, M; Popovic, D; Gorisek, A; Sokhrannyi, G; Hofsajer, I W; Mandelli, L; Ceradini, F; Graziani, E; Giorgi, F; Zur nedden, M E G; Grancagnolo, S; Volpi, M; Nunes hanninger, G; Rados, P K; Milesi, M; Cuthbert, C J; Black, C W; Fink grael, F; Fincke-keeler, M; Keeler, R; Kowalewski, R V; Berghaus, F O; Qi, M; Davidek, T; Tas, P; Jakubek, J; Duckeck, G; Walker, R; Mitterer, C A; Harenberg, T; Sandvoss, S A; Del peso, J; Llorente merino, J; Gonzalez millan, V; Irles quiles, A; Crouau, M; Gris, P L Y; Liauzu, S; Romano saez, S M; Gallop, B J; Jones, T J; Austin, N C; Morris, J; Duerdoth, I; Thompson, R J; Kelly, M P; Leisos, A; Garas, A; Pizio, C; Venda pinto, B A; Kudin, L; Qian, J; Wilson, A W; Mietlicki, D; Long, J D; Sang, Z; Arms, K E; Rahimi, A M; Moss, J J; Oh, S H; Parker, S I; Parsons, J; Cunitz, H; Vanguri, R S; Sadrozinski, H; Lockman, W S; Martinez-mc kinney, G; Goussiou, A; Jones, A; Lie, K; Hasegawa, Y; Olcese, M; Gilewsky, V; Harrison, P F; Janus, M; Spangenberg, M; De, K; Ozturk, N; Pal, A K; Darmora, S; Bullock, D J; Oviawe, O; Derkaoui, J E; Rahal, G; Sircar, A; Frey, A S; Stolte, P; Rosien, N; Zoch, K; Li, L; Schouten, D W; Catinaccio, A; Ciapetti, M; Delruelle, N; Ellis, N; Farthouat, P; Hoecker, A; Klioutchnikova, T; Macina, D; Malyukov, S; Spiwoks, R D; Unal, G P; Vandoni, G; Petersen, B A; Pommes, K; Nairz, A M; Wengler, T; Mladenov, D; Solans sanchez, C A; Lantzsch, K; Schmieden, K; Jakobsen, S; Ritsch, E; Sciuccati, A; Alves dos santos, A M; Ouyang, Q; Zhou, M; Brock, I C; Janssen, J; Katzy, J; Anders, C F; Nilsson, B S; Bazan, A; Di ciaccio, L; Yildizkaya, T; Collot, J; Malek, F; Trocme, B S; Breugnon, P; Godiot, S; Adam bourdarios, C; Coulon, J; Duflot, L; Petroff, P G; Zerwas, D; Lieuvin, M; Calderini, G; Laporte, D; Ocariz, J; Gabrielli, A; Ohska, T K; Kurochkin, Y; Kantserov, V; Vasilyeva, L; Speransky, M; Smirnov, S; Antonov, A; Bulekov, O; Tikhonov, Y; Sargsyan, L; Vardanyan, G; Budick, B; Kocian, M L; Luitz, S; Young, C C; Grenier, P J; Kelsey, M; Black, J E; Kneringer, E; Jussel, P; Horton, A J; Beaudry, J; Chandra, A; Ereditato, A; Topfel, C M; Mathieu, R; Bucci, F; Muenstermann, D; White, R M; He, M; Urban, J; Straka, M; Vrba, V; Schumacher, M; Parzefall, U; Mahboubi, K; Sommer, P O; Koepke, L H; Bethke, S; Moser, H; Wiesmann, M; Walkowiak, W A; Fleck, I J; Martinez-perez, M; Sanchez sanchez, C A; Jorgensen roca, S; Accion garcia, E; Sainz ruiz, C A; Valls ferrer, J A; Amoros vicente, G; Vives torrescasana, R; Ouraou, A; Formica, A; Hassani, S; Watson, M F; Cottin buracchio, G F; Bussey, P J; Saxon, D; Ferrando, J E; Collins-tooth, C L; Hall, D C; Cuhadar donszelmann, T; Dawson, I; Duxfield, R; Argyropoulos, T; Brodet, E; Livneh, R; Shougaev, K; Reinherz, E I; Guttman, N; Beretta, M M; Vilucchi, E; Aloisio, A; Patricelli, S; Caprio, M; Cevenini, F; De vecchi, C; Livan, M; Rimoldi, A; Vercesi, V; Ayad, R; Mastroberardino, A; Ciapetti, G; Luminari, L; Rescigno, M; Santonico, R; Salamon, A; Del papa, C; Kurashige, H; Homma, Y; Tomoto, M; Horii, Y; Sugaya, Y; Hanagaki, K; Bobbink, G; Kluit, P M; Koffeman, E N; Van eijk, B; Lee, H; Eigen, G; Dorholt, O; Strandlie, A; Strzempek, P B; Dita, S; Stoicea, G; Chitan, A; Leven, S S; Moa, T; Brenner, R; Ekelof, T J C; Olshevskiy, A; Roumiantsev, V; Chlachidze, G; Zimine, N; Gusakov, Y; Grigalashvili, N; Mineev, M; Potrap, I; Barashkou, A; Shoukavy, D; Shaykhatdenov, B; Pikelner, A; Gladilin, L; Ammosov, V; Abramov, A; Arik, M; Sahinsoy, M; Uysal, Z; Azizi, K; Hotinli, S C; Zhou, S; Berger, E; Blair, R; Underwood, D G; Einsweiler, K; Garcia-sciveres, M A; Siegrist, J L; Kipnis, I; Dahl, O; Holland, S; Barbaro galtieri, A; Smith, P T; Parua, N; Franklin, M; Mercurio, K M; Tong, B; Pod, E; Cole, S G; Hopkins, W H; Guest, D H; Severini, H; Marsicano, J J; Abbott, B K; Wang, Q; Lissauer, D; Ma, H; Takai, H; Rajagopalan, S; Protopopescu, S D; Snyder, S S; Undrus, A; Popescu, R N; Begel, M A; Blocker, C A; Amelung, C; Mandic, I; Macek, B; Tucker, B H; Citterio, M; Troncon, C; Orestano, D; Taccini, C; Romeo, G L; Dova, M T; Taylor, G N; Gesualdi manhaes, A; Mcpherson, R A; Sobie, R; Taylor, R P; Dolezal, Z; Kodys, P; Slovak, R; Sopko, B; Vacek, V; Sanders, M P; Hertenberger, R; Meineck, C; Becks, K; Kind, P; Sandhoff, M; Cantero garcia, J; De la torre perez, H; Castillo gimenez, V; Ros, E; Hernandez jimenez, Y; Chadelas, R; Santoni, C; Washbrook, A J; O'brien, B J; Wynne, B M; Mehta, A; Vossebeld, J H; Landon, M; Teixeira dias castanheira, M; Cerrito, L; Keates, J R; Fassouliotis, D; Chardalas, M; Manousos, A; Grachev, V; Seliverstov, D; Sedykh, E; Cakir, O; Ciftci, R; Edson, W; Prell, S A; Rosati, M; Stroman, T; Jiang, H; Neal, H A; Li, X; Gan, K K; Smith, D S; Kruse, M C; Ko, B R; Leung fook cheong, A M; Cole, B; Angerami, A R; Greene, Z S; Kroll, J I; Van berg, R P; Forbush, D A; Lubatti, H; Raisher, J; Shupe, M A; Wolin, S; Oshita, H; Gaudio, G; Das, R; Konig, A C; Croft, V A; Harvey, A; Maaroufi, F; Melo, I; Greenwood jr, Z D; Shabalina, E; Mchedlidze, G; Drechsler, E; Rieger, J K; Blackston, M; Colombo, T

    2002-01-01

    % ATLAS \\\\ \\\\ ATLAS is a general-purpose experiment for recording proton-proton collisions at LHC. The ATLAS collaboration consists of 144 participating institutions (June 1998) with more than 1750~physicists and engineers (700 from non-Member States). The detector design has been optimized to cover the largest possible range of LHC physics: searches for Higgs bosons and alternative schemes for the spontaneous symmetry-breaking mechanism; searches for supersymmetric particles, new gauge bosons, leptoquarks, and quark and lepton compositeness indicating extensions to the Standard Model and new physics beyond it; studies of the origin of CP violation via high-precision measurements of CP-violating B-decays; high-precision measurements of the third quark family such as the top-quark mass and decay properties, rare decays of B-hadrons, spectroscopy of rare B-hadrons, and $ B ^0 _{s} $-mixing. \\\\ \\\\The ATLAS dectector, shown in the Figure includes an inner tracking detector inside a 2~T~solenoid providing an axial...

  8. Measurement of track reconstruction inefficiencies in the core of jets via pixel dE/dx with the ATLAS experiment using $\\sqrt{s}=13$ TeV $\\textit{pp}$ collision data

    CERN Document Server

    The ATLAS collaboration

    2016-01-01

    The inefficiency of the ATLAS charged particle reconstruction in the core of jets is studied as a function of the transverse momentum of the jet between 200 GeV and 1600 GeV, using proton-proton data collected by the ATLAS experiment from the LHC in 2015 at a center-of-mass energy of $\\sqrt{s}=13$ TeV. Quantifying such an inefficiency is important for numerous performance studies and physics analyses, including calibration of the jet energy scale and mass. A fully data driven method to measure the fraction of lost tracks using the energy loss, dE/dx, of charged particles in the pixel detector is presented. The fraction of lost tracks is at most $5\\%$ as a function of jet transverse momentum. The fraction of lost tracks estimated from Monte Carlo simulation samples are compared to the results and found to agree within $25\\%$.

  9. Progress with the single-sided module prototypes for the ATLAS tracker upgrade stave

    CERN Document Server

    Allport, P P; Wiik, L; Dressnandt, N; Matheson, J; Li, Z; Viehhauser, G; Gallop, B; Jones, T J; Dwuznik, M; Greenall, A; Eklund, L; Maddock, P; Pernecker, S; Wright, J; Puldon, D; Jakobs, K; Holt, R; Sevilla, S G; Koffeman, E; Dabrowski, W; Gilchriese, M; Wastie, R; Gibson, M; Robinson, D; Fadeyev, V; Gerling, M; Betancourt, C; Dawson, N; Bates, R; French, R; Kierstead, J; Anghinolfi, F; Weidberg, A; Martinez-McKinney, F; Paganis, S; Sutcliffe, P; Maunu, R; Newcomer, M; Weber, M; Parzefall, U; Clark, A; Colijn, A P; Xu, D; la Marra, D; Buttar, C; Grillo, A A; Schamberger, D; DeWilde, B; Poltorak, K; Affolder, A A; Tsionou, D; Hessey, N P; Casse, G; Fox, H; Ferrere, D; Villani, E G; Seiden, A; Tyndel, M; Sadrozinski, H F W; Wiimut, I; Carter, J R; Lacasta, C; Chilingarov, A; Santoyo, D; Lynn, D; Garcia, C; Haber, C H; Hommels, L B A; Dhawan, S; Lindgren, S; Farthouat, P; Nickerson, R; Chen, H; Kohler, M; Sattari, S; Civera, J V; McCarthy, R; Phillips, P; Unno, Y; Kaplon, J; Swientek, K; Wormald, M; Goodrick, M; Von Wilpert, J; Mahboubi, K

    2011-01-01

    The ATLAS experiment is preparing for the planned luminosity upgrade of the LHC (the super-luminous LHC or sLHC) with a programme of development for tracking able to withstand an order of greater magnitude radiation fluence and much greater hit occupancy rates than the current detector. This has led to the concept of an all-silicon tracker with an enhanced performance pixel-based inner region and short-strips for much of the higher radii. Both sub-systems employ many common technologies, including the proposed ``stave{''} concept for integrated cooling and support. For the short-strip region, use of this integrated stave concept requires single-sided modules mounted on either side of a thin central lightweight support. Each sensor is divided into four rows of 23.82 mm length strips; within each row, there are 1280 strips of 74.5 mu m pitch. Well over a hundred prototype sensors are being delivered by Hamamatsu Photonics (HPK) to Japan, Europe and the US. We present results of the first 20 chip ABCN25 ASIC hyb...

  10. What's A Pixel Particle Sensor Chip?

    CERN Multimedia

    2008-01-01

    ATLAS particle physics experiment aided with collaboration ON Semiconductor was recently honored by the European Council for Nuclear Research (CERN), with an Industrial Award recognizing the company's contribution in supplying complex "Pixel Particle Sensor" chips for use in CERN's ATLAS particle physics experiment.

  11. Progress on DC-DC Converters for a Silicon Tracker for the sLHC Upgrade

    CERN Document Server

    Dhawan, S; Chen, H; Khanna, R; Kierstead, J; Lanni, F; Lynn, D; Musso, C; Rescia, S; Smith, H; Tipton, P; M. Weber, M

    2009-01-01

    There is a need for DC-DC converters which can operate in the extremely harsh environment of the sLHC Si Tracker. The environment requires radiation qualification to a total ionizing radiation dose of 50 Mrad and a displacement damage fluence of 5 x 1014 /cm2 of 1 MeV equivalent neutrons. In addition a static magnetic field of 2 Tesla or greater prevents the use of any magnetic components or materials. In February 2007 an Enpirion EN5360 was qualified for the sLHC radiation dosage but the converter has an input voltage limited to a maximum of 5.5V. From a systems point of view this input voltage was not sufficient for the application. Commercial LDMOS FETs have developed using a 0.25 μm process which provided a 12 volt input and were still radiation hard. These results are reported here and in previous papers. Plug in power cards with ×10 voltage ratio are being developed for testing the hybrids with ABCN chips. These plug-in cards have air coils but use commercial chips that are not designed to be radiatio...

  12. Status report on a MicroTCA card for HCAL trigger and readout at SLHC

    Energy Technology Data Exchange (ETDEWEB)

    Mans, J; Frahm, E, E-mail: frahm@physics.umn.edu [University of Minnesota, Minneapolis, MN 55455 (United States)

    2010-12-15

    We present recent measurements performed using a prototype MicroTCA card for CMS-HCAL Trigger and Readout at SLHC. Our second generation prototype uses a Xilinx XC5VFX70T FPGA to perform the high-speed communication and data processing for up to eight Readout Module fibers that are streaming data at 4.8 Gbps each. The FPGA also uses two SFP+ optical interfaces at 6.4 Gbps each for data transfer to the Trigger System. A local DAQ interface in the FPGA communicates via Gigabit Ethernet with the MicroTCA MCH. Bit Error Rate Test (BERT) results and data integrity analyses are presented in challenging clocking environments including a legacy TTC system. In addition, the status of the IPbus concept for control of deeply embedded devices is presented.

  13. Design and implementation of an expert system for the detector control systems of the ATLAS pixel detector; Entwurf und Implementation eines Expertensystems fuer das Detektorkontrollsystem des ATLAS-Pixeldetektors

    Energy Technology Data Exchange (ETDEWEB)

    Henss, Tobias

    2008-12-15

    In the framework of this thesis an expert system ''Pixel-Advisor'' for the control system of the pixel detector was designed and implemented. This supports the operational personnel in the diagnosis and removal of possible problems, which are in connection with the detector control system and unburdens the few available DCS experts.

  14. Pixel Experiments

    DEFF Research Database (Denmark)

    Petersen, Kjell Yngve; Søndergaard, Karin; Augustesen, Christina

    2015-01-01

    Pixel Experiments The term pixel is traditionally defined as any of the minute elements that together constitute a larger context or image. A pixel has its own form and is the smallest unit seen within a larger structure. In working with the potentials of LED technology in architectural lighting...... design it became relevant to investigate the use of LEDs as the physical equivalent of a pixel as a design approach. In this book our interest has been in identifying how the qualities of LEDs can be used in lighting applications. With experiences in the planning and implementation of architectural...... lighting design in practice, one quickly experiences and realises that there are untapped potentials in the attributes of LED technology. In this research, speculative studies have been made working with the attributes of LEDs in architectural contexts, with the ambition to ascertain new strategies for...

  15. Gamma and neutron massive irradiation tests of the ATLAS MDT chambers

    Energy Technology Data Exchange (ETDEWEB)

    Meoni, Evelin [Dipartimento di Fisica, Universita degli Studi della Calabria and INFN, Cosenza (Italy)]. E-mail: meoni@fis.unical.it; Branchini, Paolo [Dipartimento di Fisica, Universita Roma Tre and INFN Sezione di Roma III, Rome (Italy); Di Luise, Silvestro [Dipartimento di Fisica, Universita Roma Tre and INFN Sezione di Roma III, Rome (Italy); Graziani, Enrico [Dipartimento di Fisica, Universita Roma Tre and INFN Sezione di Roma III, Rome (Italy); La Rotonda, Laura [Dipartimento di Fisica, Universita degli Studi della Calabria and INFN, Cosenza (Italy); Mazzotta, Concetta [Dipartimento di Fisica, Universita degli Studi della Calabria and INFN, Cosenza (Italy); Morello, Gianfranco [Dipartimento di Fisica, Universita degli Studi della Calabria and INFN, Cosenza (Italy); Passeri, Antonio [Dipartimento di Fisica, Universita Roma Tre and INFN Sezione di Roma III, Rome (Italy); Petrucci, Fabrizio [Dipartimento di Fisica, Universita Roma Tre and INFN Sezione di Roma III, Rome (Italy); Policicchio, Antonio [Dipartimento di Fisica, Universita degli Studi della Calabria and INFN, Cosenza (Italy); Salvatore, Daniela [Dipartimento di Fisica, Universita degli Studi della Calabria and INFN, Cosenza (Italy); Schioppa, Marco [Dipartimento di Fisica, Universita degli Studi della Calabria and INFN, Cosenza (Italy); Tonazzo, Alessandra [Dipartimento di Fisica, Universita Roma Tre and INFN Sezione di Roma III, Rome (Italy)

    2007-03-01

    MDT chambers, the precision tracking system of the ATLAS muon spectrometer, have to operate for 10 years in the harsh LHC background environment mainly due to low energy photons and neutrons. The expected overall maximum count rate is 500Hz/cm{sup 2}. Moreover the upgrades for S-LHC will involve fluxes ten times higher than that at LHC. To study the behavior of MDT chambers under massive irradiation of gammas and neutrons at level of S-LHC, three extensive tests were performed at the ENEA-Casaccia Research Centre Facilities, irradiating several test detectors. The results about the drift properties, gas gain and tracking performances, both at high rates and after massive irradiation, are given.

  16. Gamma and neutron massive irradiation tests of the ATLAS MDT chambers

    International Nuclear Information System (INIS)

    MDT chambers, the precision tracking system of the ATLAS muon spectrometer, have to operate for 10 years in the harsh LHC background environment mainly due to low energy photons and neutrons. The expected overall maximum count rate is 500Hz/cm2. Moreover the upgrades for S-LHC will involve fluxes ten times higher than that at LHC. To study the behavior of MDT chambers under massive irradiation of gammas and neutrons at level of S-LHC, three extensive tests were performed at the ENEA-Casaccia Research Centre Facilities, irradiating several test detectors. The results about the drift properties, gas gain and tracking performances, both at high rates and after massive irradiation, are given

  17. Two ATLAS suppliers honoured

    CERN Document Server

    2007-01-01

    The ATLAS experiment has recognised the outstanding contribution of two firms to the pixel detector. Recipients of the supplier award with Peter Jenni, ATLAS spokesperson, and Maximilian Metzger, CERN Secretary-General.At a ceremony held at CERN on 28 November, the ATLAS collaboration presented awards to two of its suppliers that had produced sensor wafers for the pixel detector. The CiS Institut für Mikrosensorik of Erfurt in Germany has supplied 655 sensor wafers containing a total of 1652 sensor tiles and the firm ON Semiconductor has supplied 515 sensor wafers (1177 sensor tiles) from its foundry at Roznov in the Czech Republic. Both firms have successfully met the very demanding requirements. ATLAS’s huge pixel detector is very complicated, requiring expertise in highly specialised integrated microelectronics and precision mechanics. Pixel detector project leader Kevin Einsweiler admits that when the project was first propo...

  18. CMS hadron calorimeter front-end upgrade for SLHC phase I

    Energy Technology Data Exchange (ETDEWEB)

    Whitmore, Juliana; /Fermilab

    2009-09-01

    We present an upgrade plan for the CMS HCAL detector. The HCAL upgrade is required for the increased luminosity (3 * 10E34) of SLHC Phase I which is targeted for 2014. A key aspect of the HCAL upgrade is to add longitudinal segmentation to improve background rejection, energy resolution, and electron isolation at the L1 trigger. The increased segmentation is achieved by replacing the hybrid photodiodes (HPDs) with silicon PMTs (SIPMs). We plan to instrument each fiber of the calorimeter with an SIPM (103,000 total). We will then electrically sum outputs from selected SIPMs to form the longitudinal readout segments. In addition to having more longitudinal information, the upgrade plans include a new custom ADC with matched sensitivity and timing information. The increased data volume requires higher speed transmitters and the additional power dissipation for the readout electronics requires better thermal design, since much of the on-detector infrastructure (front-end electronics crates, cooling pipes, optical fiber plant, etc.) will remain the same. We will report on the preliminary designs for these upgraded systems, along with performance requirements and initial design studies.

  19. Pixel detectors

    CERN Document Server

    Passmore, M S

    2001-01-01

    positions on the detector. The loss of secondary electrons follows the profile of the detector and increases with higher energy ions. studies of the spatial resolution predict a value of 5.3 lp/mm. The image noise in photon counting systems is investigated theoretically and experimentally and is shown to be given by Poisson statistics. The rate capability of the LAD1 was measured to be 250 kHz per pixel. Theoretical and experimental studies of the difference in contrast for ideal charge integrating and photon counting imaging systems were carried out. It is shown that the contrast differs and that for the conventional definition (contrast = (background - signal)/background) the photon counting device will, in some cases, always give a better contrast than the integrating system. Simulations in MEDICI are combined with analytical calculations to investigate charge collection efficiencies (CCE) in semiconductor detectors. Different pixel sizes and biasing conditions are considered. The results show charge shari...

  20. Performance of the ATLAS Inner Tracker

    CERN Document Server

    Marti-Garcia, S; The ATLAS collaboration

    2011-01-01

    ATLAS is a one of the four multipurpose experiments that records the products of the LHC proton-proton collisions at the LHC. In order to reconstruct the trajectories of charged particles, ATLAS is equipped, among others, with an inner charged particle tracking system built on two different technologies on silicon planar sensors (pixel and microstrips) plus drift-tube based detectors, all embedded in a 2 T solenoidal field. In order to achieve its scientific goals, ATLAS has quite demanding tracking performance requirements. Therefore, ATLAS is equipped, among others, with a charged particle tracking system built on two different technologies: silicon planar sensors and drift-tube based detectors constituting the ATLAS Inner Detector (ID). The ATLAS ID consists of about 6000 modules in its Silicon Tracker combined with several hundred drift tube based detector modules. The silicon modules use both technologies: pixel and microstrip. Pixel modules determine the position of passing particle tracks with an accur...

  1. Electrical characteristics of silicon pixel detectors

    Energy Technology Data Exchange (ETDEWEB)

    Gorelov, I.; Gorfine, G.; Hoeferkamp, M.; Mata-Bruni, V.; Santistevan, G.; Seidel, S.C. E-mail: seidel@dot.phys.unm.edu; Ciocio, A.; Einsweiler, K.; Emes, J.; Gilchriese, M.; Joshi, A.; Kleinfelder, S.; Marchesini, R.; McCormack, F.; Milgrome, O.; Palaio, N.; Pengg, F.; Richardson, J.; Zizka, G.; Ackers, M.; Comes, G.; Fischer, P.; Keil, M.; Martinez, G.; Peric, I.; Runolfsson, O.; Stockmanns, T.; Treis, J.; Wermes, N.; Goessling, C.; Huegging, F.; Klaiber-Lodewigs, J.; Krasel, O.; Wuestenfeld, J.; Wunstorf, R.; Barberis, D.; Beccherle, R.; Caso, C.; Cervetto, M.; Darbo, G.; Gagliardi, G.; Gemme, C.; Morettini, P.; Netchaeva, P.; Osculati, B.; Rossi, L.; Charles, E.; Fasching, D.; Blanquart, L.; Breugnon, P.; Calvet, D.; Clemens, J.-C.; Delpierre, P.; Hallewell, G.; Laugier, D.; Mouthuy, T.; Rozanov, A.; Valin, I.; Andreazza, A.; Caccia, M.; Citterio, M.; Lari, T.; Meroni, C.; Ragusa, F.; Troncon, C.; Vegni, G.; Lutz, G.; Richter, R.H.; Rohe, T.; Boyd, G.R.; Skubic, P.L.; Sicho, P.; Tomasek, L.; Vrba, V.; Holder, M.; Ziolkowski, M.; Cauz, D.; Cobal-Grassmann, M.; D' Auria, S.; De Lotto, B.; Del Papa, C.; Grassmann, H.; Santi, L.; Becks, K.H.; Lenzen, G.; Linder, C

    2002-08-21

    Prototype sensors for the ATLAS silicon pixel detector have been electrically characterized. The current and voltage characteristics, charge-collection efficiencies, and resolutions have been examined. Devices were fabricated on oxygenated and standard detector-grade silicon wafers. Results from prototypes which examine p-stop and standard and moderated p-spray isolation are presented for a variety of geometrical options. Some of the comparisons relate unirradiated sensors with those that have received fluences relevant to LHC operation.

  2. Electrical Characteristics of Silicon Pixel Sensors

    CERN Document Server

    Gorelov, I; Hoeferkamp, M; Mata-Bruni, V; Santistevan, G; Seidel, S C; Ciocio, A; Einsweiler, K F; Emes, J; Gilchriese, M G D; Joshi, A; Kleinfelder, S A; Marchesini, R; McCormack, F; Milgrome, O; Palaio, N; Pengg, F; Richardson, J; Zizka, G; Ackers, M; Comes, G; Fischer, P; Keil, M; Klasen, V; Kühl, T; Meuser, S; Ockenfels, W; Raith, B; Treis, J; Wermes, N; Gössling, C; Hügging, F G; Klaiber Lodewigs, Jonas M; Krasel, O; Wüstenfeld, J; Wunstorf, R; Barberis, D; Beccherle, R; Caso, Carlo; Cervetto, M; Darbo, G; Gagliardi, G; Gemme, C; Morettini, P; Netchaeva, P; Osculati, B; Rossi, L; Charles, E; Fasching, D; Blanquart, L; Breugnon, P; Calvet, D; Clemens, J-C; Delpierre, P A; Hallewell, G D; Laugier, D; Mouthuy, T; Rozanov, A; Valin, I; Andreazza, A; Caccia, M; Citterio, M; Lari, T; Meroni, C; Ragusa, F; Troncon, C; Vegni, G; Lutz, Gerhard; Richter, R H; Rohe, T; Boyd, GR; Skubic, P L; Sícho, P; Tomasek, L; Vrba, V; Holder, M; Ziolkowski, M; Cauz, D; Cobal-Grassmann, M; D'Auria, S; De Lotto, B; del Papa, C; Grassmann, H; Santi, L; Becks, K H; Lenzen, G; Linder, C

    2001-01-01

    Prototype sensors for the ATLAS silicon pixel detector have been electrically characterized. The current and voltage characteristics, charge collection efficiencies, and resolutions have been examined. Devices were fabricated on oxygenated and standard detector-grade silicon wafers. Results from prototypes which examine p-stop and standard and moderated p-spray isolation are presented for a variety of geometrical options. Some of the comparisons relate unirradiated sensors with those that have received fluences relevant to LHC operation.

  3. The ATLAS IBL CO2 Cooling System

    CERN Document Server

    Verlaat, Bartholomeus; The ATLAS collaboration

    2016-01-01

    The Atlas Pixel detector has been equipped with an extra B-layer in the space obtained by a reduced beam pipe. This new pixel detector called the ATLAS Insertable B-Layer (IBL) is installed in 2014 and is operational in the current ATLAS data taking. The IBL detector is cooled with evaporative CO2 and is the first of its kind in ATLAS. The ATLAS IBL CO2 cooling system is designed for lower temperature operation (<-35⁰C) than the previous developed CO2 cooling systems in High Energy Physics experiments. The cold temperatures are required to protect the pixel sensors for the high expected radiation dose up to 550 fb^-1 integrated luminosity. This paper describes the design, development, construction and commissioning of the IBL CO2 cooling system. It describes the challenges overcome and the important lessons learned for the development of future systems which are now under design for the Phase-II upgrade detectors.

  4. Diamond Pixel Detectors

    Energy Technology Data Exchange (ETDEWEB)

    Adam, W.; Berdermann, E.; Bergonzo, P.; Bertuccio, G.; Bogani, F.; Borchi, E.; Brambilla, A.; Bruzzi, M.; Colledani, C.; Conway, J.; D' Angelo, P.; Dabrowski, W.; Delpierre, P.; Deneuville, A.; Doroshenko, J.; Dulinski, W.; Eijk, B. van; Fallou, A.; Fizzotti, F.; Foster, J.; Foulon, F.; Friedl, M.; Gan, K.K.; Gheeraert, E.; Gobbi, B.; Grim, G.P.; Hallewell, G.; Han, S.; Hartjes, F.; Hrubec, J.; Husson, D.; Kagan, H.; Kania, D.; Kaplon, J.; Kass, R.; Koeth, T.; Krammer, M.; Lander, R.; Logiudice, A.; Lu, R.; Lynne, L.M.; Manfredotti, C.; Meier, D.; Mishina, M.; Moroni, L.; Oh, A.; Pan, L.S.; Pernicka, M.; Perera, L. E-mail: perera@physics.rutgers.edu; Pirollo, S.; Plano, R.; Procario, M.; Riester, J.L.; Roe, S.; Rott, C.; Rousseau, L.; Rudge, A.; Russ, J.; Sala, S.; Sampietro, M.; Schnetzer, S.; Sciortino, S.; Stelzer, H.; Stone, R.; Suter, B.; Tapper, R.J.; Tesarek, R.; Trischuk, W.; Tromson, D.; Vittone, E.; Wedenig, R.; Weilhammer, P.; White, C.; Zeuner, W.; Zoeller, M

    2001-06-01

    Diamond based pixel detectors are a promising radiation-hard technology for use at the LHC. We present first results on a CMS diamond pixel sensor. With a threshold setting of 2000 electrons, an average pixel efficiency of 78% was obtained for normally incident minimum ionizing particles.

  5. Diamond pixel detectors

    CERN Document Server

    Adam, W; Bergonzo, P; Bertuccio, G; Bognai, F; Borchi, E; Brambilla, A; Bruzzi, Mara; Colledani, C; Conway, J; D'Angelo, P; Dabrowski, W; Delpierre, P A; Deneuville, A; Doroshenko, J; Dulinski, W; van Eijk, B; Fallou, A; Fizzotti, F; Foster, J; Foulon, F; Friedl, M; Gan, K K; Gheeraert, E; Gobbi, B; Grim, G P; Hallewell, G D; Han, S; Hartjes, F G; Hrubec, Josef; Husson, D; Kagan, H; Kania, D R; Kaplon, J; Kass, R; Koeth, T W; Krammer, Manfred; Lander, R; Lo Giudice, A; Lü, R; MacLynne, L; Manfredotti, C; Meier, D; Mishina, M; Moroni, L; Oh, A; Pan, L S; Pernicka, Manfred; Perera, L P; Pirollo, S; Plano, R; Procario, M; Riester, J L; Roe, S; Rott, C; Rousseau, L; Rudge, A; Russ, J; Sala, S; Sampietro, M; Schnetzer, S; Sciortino, S; Stelzer, H; Stone, R; Suter, B; Tapper, R J; Tesarek, R; Trischuk, W; Tromson, D; Vittone, E; Wedenig, R; Weilhammer, Peter; White, C; Zeuner, W; Zöller, M

    2001-01-01

    Diamond based pixel detectors are a promising radiation-hard technology for use at the LHC. We present first results on a CMS diamond pixel sensor. With a threshold setting of 2000 electrons, an average pixel efficiency of 78% was obtained for normally incident minimum ionizing particles. (3 refs).

  6. Diamond Pixel Detectors

    International Nuclear Information System (INIS)

    Diamond based pixel detectors are a promising radiation-hard technology for use at the LHC. We present first results on a CMS diamond pixel sensor. With a threshold setting of 2000 electrons, an average pixel efficiency of 78% was obtained for normally incident minimum ionizing particles

  7. Design and submission of rad-tolerant circuits for future front-end electronics at S-LHC

    International Nuclear Information System (INIS)

    This work is aimed at defining the architecture of a new digital ASIC, namely Slow Control Architecture (SCA), which will be designed and fabricated in a commercial 130 nm CMOS technology. This chip will be embedded within a high-speed data acquisition optical link (GBT) to control and monitor the front-end electronics proposed for future high-energy physics experiments at the Super-Large Hadron Collider (SLHC), CERN, Geneva. The GBT link provides a transparent transport layer between the SCA and the control electronics in the counting room. It will be provided with rad-hard redundant logic for critical circuits. The project follows a set of designs that were recently developed via a 250 nm CMOS technology for LHC experiments. Since this 250 nm specific technology used to design ASICs for the LHC will no longer be available as it was in the past, requesting an update technology for future experiments must be satisfied in any case. A test chip that implements three different redundant methodologies against single event effects is also described.

  8. Design and submission of rad-tolerant circuits for future front-end electronics at S-LHC

    Energy Technology Data Exchange (ETDEWEB)

    Gabrielli, A., E-mail: alessandro.gabrielli@bo.infn.i [INFN and Physics Department University of Bologna, Viale Berti Pichat 6/2 40127 Bologna (Italy); Loddo, F.; Ranieri, A.; De Robertis, G. [INFN Bari, Via Orabona 4, 70126 Bari (Italy)

    2010-01-11

    This work is aimed at defining the architecture of a new digital ASIC, namely Slow Control Architecture (SCA), which will be designed and fabricated in a commercial 130 nm CMOS technology. This chip will be embedded within a high-speed data acquisition optical link (GBT) to control and monitor the front-end electronics proposed for future high-energy physics experiments at the Super-Large Hadron Collider (SLHC), CERN, Geneva. The GBT link provides a transparent transport layer between the SCA and the control electronics in the counting room. It will be provided with rad-hard redundant logic for critical circuits. The project follows a set of designs that were recently developed via a 250 nm CMOS technology for LHC experiments. Since this 250 nm specific technology used to design ASICs for the LHC will no longer be available as it was in the past, requesting an update technology for future experiments must be satisfied in any case. A test chip that implements three different redundant methodologies against single event effects is also described.

  9. PIXEL 2010 - a Resume

    CERN Document Server

    Wermes, Norbert

    2010-01-01

    The Pixel 2010 conference focused on semiconductor pixel detectors for particle tracking/vertexing as well as for imaging, in particular for synchrotron light sources and XFELs. The big LHC hybrid pixel detectors have impressively started showing their capabilities. X-ray imaging detectors, also using the hybrid pixel technology, have greatly advanced the experimental possibilities for diiffraction experiments. Monolithic or semi-monolithic devices like CMOS active pixels and DEPFET pixels have now reached a state such that complete vertex detectors for RHIC and superKEKB are being built with these technologies. Finally, new advances towards fully monolithic active pixel detectors, featuring full CMOS electronics merged with efficient signal charge collection, exploiting standard CMOS technologies, SOI and/or 3D integration, show the path for the future. This r\\'esum\\'e attempts to extract the main statements of the results and developments presented at this conference.

  10. SOI monolithic pixel detector

    Science.gov (United States)

    Miyoshi, T.; Ahmed, M. I.; Arai, Y.; Fujita, Y.; Ikemoto, Y.; Takeda, A.; Tauchi, K.

    2014-05-01

    We are developing monolithic pixel detector using fully-depleted (FD) silicon-on-insulator (SOI) pixel process technology. The SOI substrate is high resistivity silicon with p-n junctions and another layer is a low resistivity silicon for SOI-CMOS circuitry. Tungsten vias are used for the connection between two silicons. Since flip-chip bump bonding process is not used, high sensor gain in a small pixel area can be obtained. In 2010 and 2011, high-resolution integration-type SOI pixel sensors, DIPIX and INTPIX5, have been developed. The characterizations by evaluating pixel-to-pixel crosstalk, quantum efficiency (QE), dark noise, and energy resolution were done. A phase-contrast imaging was demonstrated using the INTPIX5 pixel sensor for an X-ray application. The current issues and future prospect are also discussed.

  11. PIXEL 2010 - A Resume

    International Nuclear Information System (INIS)

    The Pixel 2010 conference focused on semiconductor pixel detectors for particle tracking/vertexing as well as for imaging, in particular for synchrotron light sources and XFELs. The big LHC hybrid pixel detectors have impressively started showing their capabilities. X-ray imaging detectors, also using the hybrid pixel technology, have greatly advanced the experimental possibilities for diffraction experiments. Monolithic or semi-monolithic devices like CMOS active pixels and DEPFET pixels have now reached a state such that complete vertex detectors for RHIC and superKEKB are being built with these technologies. Finally, new advances towards fully monolithic active pixel detectors, featuring full CMOS electronics merged with efficient signal charge collection, exploiting standard CMOS technologies, SOI and/or 3D integration, show the path for the future. This resume attempts to extract the main statements of the results and developments presented at this conference.

  12. The Pixels system: last but not late!

    CERN Multimedia

    Kevin Einsweiler

    The Pixel Detector for ATLAS is one of the smallest, but most challenging components of the experiment. It lives in the dangerous territory directly outside the beampipe, where the radiation environment is particularly fierce, and it must be roughly one million times more radiation-hard than its human designers. Starting at a radius of just 5cm from the interaction point where the proton beams collide, it occupies a volume of slightly more than one meter in length and a half meter in diameter. In this compact region, there are eighty million channels of electronics (most of the electronics channels in ATLAS!), each capable of measuring the charge deposited by a track in a silicon pixel measuring only 50 microns by 400 microns in size (a volume of 0.005 cubic millimeters). A total cooling capacity of 15 KWatts is available to keep it operating comfortably at -5C. This detector is built around, and provides the support for, the central beampipe of ATLAS. It is supported on carbon fiber rails inside of the Pix...

  13. ATLAS Fact Sheet : To raise awareness of the ATLAS detector and collaboration on the LHC

    CERN Multimedia

    ATLAS Outreach

    2010-01-01

    Facts on the Detector, Calorimeters, Muon System, Inner Detector, Pixel Detector, Semiconductor Tracker, Transition Radiation Tracker,, Surface hall, Cavern, Detector, Magnet system, Solenoid, Toroid, Event rates, Physics processes, Supersymmetric particles, Comparing LHC with Cosmic rays, Heavy ion collisions, Trigger and Data Acquisition TDAQ, Computing, the LHC and the ATLAS collaboration. This fact sheet also contains images of ATLAS and the collaboration as well as a short list of videos on ATLAS available for viewing.

  14. Pixel readout development in 65 nm CMOS technology

    International Nuclear Information System (INIS)

    Continuous trend of increasing luminosity of particle accelerators places severe constraints on detector tracking systems in terms of radiation hardness and ability to cope with high hit rates. One possible way for particle detectors to keep track with increasing luminosity is using of more advanced technologies. Ultra deep sub-micron CMOS technologies allow design of complex and high speed electronics with high integration density. In addition these technologies are inherently radiation hard. We present two prototypes of analog pixel front-end designed in 65 nm CMOS technology with applications oriented to upgrade of the ATLAS Pixel Detector. The silicon area of the pixel front-end prototypes is shared with other test circuits designed for applications in upgrade of the Pixel Vertex Detector of the Belle II experiment. Aspects of ultra deep sub-micron design and performance of the analog pixel front-end circuits are presented.

  15. Planar pixel sensors in commercial CMOS technologies

    International Nuclear Information System (INIS)

    For the upgrade of the ATLAS experiment at the high luminosity LHC, an all-silicon tracker is foreseen to cope with the increased rate and radiation levels. Pixel and strip detectors will have to cover an area of up to 200m2. To produce modules in high number at reduced costs, new sensor and bonding technologies have to be investigated. Commercial CMOS technologies on high resistive substrates can provide significant advantages in this direction. They offer cost effective, large volume sensor production. In addition to this, production is done on 8'' wafers allowing wafer-to-wafer bonding to the electronics, an interconnection technology substantially cheaper than the bump bonding process used for hybrid pixel detectors at the LHC. Both active and passive n-in-p pixel sensor prototypes have been submitted in a 150 nm CMOS technology on a 2kΩ cm substrate. The passive sensor design will be used to characterize sensor properties and to investigate wafer-to-wafer bonding technologies. This first prototype is made of a matrix of 36 x 16 pixels of size compatible with the FE-I4 readout chip (i.e. 50 μm x 250 μm). Results from lab characterization of this first submission are shown together with TCAD simulations. Work towards a full size FE-I4 sensor for wafer-to-wafer bonding is discussed.

  16. The ATLAS Diamond Beam Monitor

    CERN Document Server

    Schaefer, Douglas; The ATLAS collaboration

    2015-01-01

    After the first three years of the LHC running the ATLAS experiment extracted it's pixel detector system to refurbish and re-position the optical readout drivers and install a new barrel layer of pixels. The experiment has also taken advantage of this access to also install a set of beam monitoring telescopes with pixel sensors, four each in the forward and backward regions. These telescopes were assembled based on chemical vapour deposited (CVD) diamond sensors to survive in this high radiation environment without needing extensive cooling. This talk will describe the lessons learned in construction and commissioning of the ATLAS x Diamond Beam Monitor (DBM). We will show results from the construction quality assurance tests, commissioning performance, including results from cosmic ray running in early 2015 and also expected first results from LHC run 2 collisions.

  17. Track parameter resolution study of a pixel only detector for LHC geometry and future high rate experiments

    International Nuclear Information System (INIS)

    Recent progress in pixel detector technology in general and in the HV-MAPS technology in particular make it feasible to construct an all-silicon pixel detector for large scale particle experiments like ATLAS or CMS. Previous studies have indicated that six to nine layers of pixel sensors, in comparison to the 14 detector layers planned for Inner Tracker ATLAS upgrade, are sufficient to reliably reconstruct particle trajectories. The performance of an all-pixel detector and the minimum number of required pixel layers is studied based on a full GEANT simulation for high luminosity conditions at the upgraded LHC. Furthermore, the ability of an all-pixel detector to form trigger decisions using a special triplet pixel layer design is studied. Such a design could be used to reconstruct all tracks originating from the proton-proton interaction at the first hardware level at 40 MHz collision frequency.

  18. Track parameter resolution study of a pixel only detector for LHC geometry and future high rate experiments

    Energy Technology Data Exchange (ETDEWEB)

    Blago, Michele Piero; Schoening, Andre [Physikalisches Institut, Heidelberg Univ. (Germany)

    2015-07-01

    Recent progress in pixel detector technology in general and in the HV-MAPS technology in particular make it feasible to construct an all-silicon pixel detector for large scale particle experiments like ATLAS or CMS. Previous studies have indicated that six to nine layers of pixel sensors, in comparison to the 14 detector layers planned for Inner Tracker ATLAS upgrade, are sufficient to reliably reconstruct particle trajectories. The performance of an all-pixel detector and the minimum number of required pixel layers is studied based on a full GEANT simulation for high luminosity conditions at the upgraded LHC. Furthermore, the ability of an all-pixel detector to form trigger decisions using a special triplet pixel layer design is studied. Such a design could be used to reconstruct all tracks originating from the proton-proton interaction at the first hardware level at 40 MHz collision frequency.

  19. EnviroAtlas - Dasymetric Population for the Conterminous United States

    Data.gov (United States)

    U.S. Environmental Protection Agency — This EnviroAtlas dataset intelligently reallocates 2010 population from census blocks to 30 meter pixels based on land cover and slope. This dataset was produced by...

  20. The pixelated detector

    CERN Multimedia

    Sutton, C

    1990-01-01

    "Collecting data as patterns of light or subatomic particles is vitally important in all the sciences. The new generation of solid-state detectors called pixel devices could transform experimental research at all levels" (4 pages).

  1. RD Collaboration Proposal: Development of pixel readout integrated circuits for extreme rate and radiation

    CERN Document Server

    Chistiansen, J (CERN)

    2013-01-01

    This proposal describes a new RD collaboration to develop the next genrration of hybrid pixel readout chips for use in ATLAS and CMS PHase 2 upgrades. extrapolation of hybrid pixel technology to the HL-LHC presents major challenges on several fronts. Challenges include: smaller pixels to resolve tracks in boosted jets, much higher hit rates (1-2 GHz/cm2 ), unprecedented radiation tolerance (10 MGy), much higher output bandwidth, and large IC format with low power consumption in order to instrument large areas while keeping the material budget low. This collaboration is specifically focused on design of hybrid pixel readout chips, and not on more general chip design or on other aspects of hybrid pixel technology. Participants include 7 institutes on ATLAS and 7 on CMS, plus 2 on both experiments.

  2. OCR Based Pixel Fusion

    OpenAIRE

    Rami Al-Hmouz

    2012-01-01

    Character recognition is the process that allows the automatic identification of character images, which is generally referred as Optical Character Recognition (OCR). The characters are either handwritten or typed. This study proposed a novel OCR approach based on the likelihood functions of pixels, which were obtained by averaging a trained set of character images. A Bayesian fusion process for all pixel probabilities decides the recognition of characters. Further tests using Support V...

  3. Pixel-One

    Science.gov (United States)

    Pedichini, F.; Di Paola, A.; Testa, V.

    2010-07-01

    The early future of astronomy will be dominated by Extremely Large Telescopes where the focal lengths will be of the order of several hundred meters. This yields focal plane sizes of roughly one square meter to obtain a field of view of about 5 x 5 arcmin. When operated in seeing limited mode this field is correctly sampled with 1x1mm pixels. Such a sampling can be achieved using a peculiar array of tiny CMOS active photodiodes illuminated through microlenses or lightpipes. If the photodiode is small enough and utilizes the actual pixel technology, its dark current can be kept well below the sky background photocurrent, thus avoiding the use of cumbersome cryogenics systems. An active smart electronics will manage each pixel up to the A/D conversion and data transfer. This modular block is the Pixel-One. A 30x30 mm tile filled with 1000 Pixel-Ones could be the basic unit to mosaic very large focal planes. By inserting dispersion elements inside the optical path of the lenslet array one could also produce a low dispersed spectrum of each focal plane sub-aperture and, by using an array of few smart photodiodes, also get multi-wavelength information in the optical band for each equivalent focal plane pixel. An application to the E-ELT is proposed.

  4. A 3D photograph with 92 million pixels for tagging particles

    CERN Document Server

    Antonella Del Rosso

    2013-01-01

    Where was a given particle born? How can we tag it precisely enough to be able to then follow it along its track and through its decays? This is the job of the pixel detector installed at the heart of the ATLAS detector, only centimeters away from the LHC collisions. In order to improve its identification and tagging capabilities, the ATLAS collaboration has recently taken a big step towards the completion of the upgrade of its Pixel detector, which will include the insertion of a brand-new layer of 12 million pixels.   The 7 metre long beryllium beam pipe inserted in the carbon-fibre positioning tool is being prepared ready for the new innermost layer of the Pixel detector to be mounted. Photo: ATLAS Collaboration. With its three layers and 80 million channels concentrated in 2.2 square metres, the ATLAS pixel detector was already the world’s largest pixel-based system used in particle physics. Its excellent performance was instrumental in the discovery of the Higgs boson in July ...

  5. Diamond and silicon pixel detectors in high radiation environments

    Energy Technology Data Exchange (ETDEWEB)

    Tsung, Jieh-Wen

    2012-10-15

    Diamond pixel detector is a promising candidate for tracking of collider experiments because of the good radiation tolerance of diamond. The diamond pixel detector must withstand the radiation damage from 10{sup 16} particles per cm{sup 2}, which is the expected total fluence in High Luminosity Large Hadron Collider. The performance of diamond and silicon pixel detectors are evaluated in this research in terms of the signal-to-noise ratio (SNR). Single-crystal diamond pixel detectors with the most recent readout chip ATLAS FE-I4 are produced and characterized. Based on the results of the measurement, the SNR of diamond pixel detector is evaluated as a function of radiation fluence, and compared to that of planar-silicon ones. The deterioration of signal due to radiation damage is formulated using the mean free path of charge carriers in the sensor. The noise from the pixel readout circuit is simulated and calculated with leakage current and input capacitance to the amplifier as important parameters. The measured SNR shows good agreement with the calculated and simulated results, proving that the performance of diamond pixel detectors can exceed the silicon ones if the particle fluence is more than 10{sup 15} particles per cm{sup 2}.

  6. Selecting Pixels for Kepler Downlink

    Science.gov (United States)

    Bryson, Stephen T.; Jenkins, Jon M.; Klaus, Todd C.; Cote, Miles T.; Quintana, Elisa V.; Hall, Jennifer R.; Ibrahim, Khadeejah; Chandrasekaran, Hema; Caldwell, Douglas A.; Van Cleve, Jeffrey E.; Haas, Michael R.

    2010-01-01

    The Kepler mission monitors > 100,000 stellar targets using 42 2200 1024 pixel CCDs. Bandwidth constraints prevent the downlink of all 96 million pixels per 30-minute cadence, so the Kepler spacecraft downlinks a specified collection of pixels for each target. These pixels are selected by considering the object brightness, background and the signal-to-noise of each pixel, and are optimized to maximize the signal-to-noise ratio of the target. This paper describes pixel selection, creation of spacecraft apertures that efficiently capture selected pixels, and aperture assignment to a target. Diagnostic apertures, short-cadence targets and custom specified shapes are discussed.

  7. Lapis SOI Pixel Process

    CERN Document Server

    Okihara, Masao; Miura, Noriyuki; Kuriyama, Naoya; Nagatomo, Yoshiki

    2015-01-01

    0.2 um fully-depleted SOI technology has been developed a for X-ray pixel detectors. To improve the detector performance, some advanced process technologies are developing continuously. To utilize the high resistivity FZ-SOI, slow ramp up and ramp down recipes are applied for the thermal processes in both of SOI wafer fabrication and pixel detector process. The suitable backside treatment is also applied to prevent increase of leakage current at backside damaged layer in the case of full depletion of substrate. Large detector chip about 66mm width and 30mm height can be obtained by stitching exposure technique for large detector chip. To improve cross-talk and radiation tolerance, the nested well structure and double- SOI wafer are now under investigation for advanced pixel structure.

  8. OCR Based Pixel Fusion

    Directory of Open Access Journals (Sweden)

    Rami Al-Hmouz

    2012-01-01

    Full Text Available Character recognition is the process that allows the automatic identification of character images, which is generally referred as Optical Character Recognition (OCR. The characters are either handwritten or typed. This study proposed a novel OCR approach based on the likelihood functions of pixels, which were obtained by averaging a trained set of character images. A Bayesian fusion process for all pixel probabilities decides the recognition of characters. Further tests using Support Vector Machine (SVM classifier were carried out on characters with the same shape. This method was used to test noisy images and achieved an accuracy of 97.95%, thus, outperforming other OCR methods.

  9. Lapis SOI Pixel Process

    OpenAIRE

    Okihara, Masao; Kasai, Hiroki; Miura, Noriyuki; Kuriyama, Naoya; Nagatomo, Yoshiki

    2015-01-01

    0.2 um fully-depleted SOI technology has been developed a for X-ray pixel detectors. To improve the detector performance, some advanced process technologies are developing continuously. To utilize the high resistivity FZ-SOI, slow ramp up and ramp down recipes are applied for the thermal processes in both of SOI wafer fabrication and pixel detector process. The suitable backside treatment is also applied to prevent increase of leakage current at backside damaged layer in the case of full depl...

  10. Pixel detector insertion

    CERN Multimedia

    CMS

    2015-01-01

    Insertion of the Pixel Tracker, the 66-million-channel device used to pinpoint the vertex of each colliding proton pair, located at the heart of the detector. The geometry of CMS is a cylinder lying on its side (22 meters long and 15 meters high in dia

  11. Pixel detector readout chip

    CERN Multimedia

    1991-01-01

    Close-up of a pixel detector readout chip. The photograph shows an aera of 1 mm x 2 mm containing 12 separate readout channels. The entire chip contains 1000 readout channels (around 80 000 transistors) covering a sensitive area of 8 mm x 5 mm. The chip has been mounted on a silicon detector to detect high energy particles.

  12. ALICE Silicon Pixel Detector

    CERN Multimedia

    Manzari, V

    2013-01-01

    The Silicon Pixel Detector (SPD) forms the innermost two layers of the 6-layer barrel Inner Tracking System (ITS). The SPD plays a key role in the determination of the position of the primary collision and in the reconstruction of the secondary vertices from particle decays.

  13. ATLAS TV PROJECT

    CERN Multimedia

    OMNI communication

    2005-01-01

    CPPM Laboratory Marseille Starting with the Workshop- adding modules to the strip 00:09:19 Exterior-entering the lab site by car, Sascha Rosanov and a PR lady walking, Lab sign on building -Physique des Particules de Marseille 00:20:00 Interviews of the ATLAS pixel work for bio-mediacal research 00:34:00 Interview of Roy Aleksov, Head of CPPM Laboratory, Working in international team, working with CERN and GRID The rest of the film inclusdes lab testingand some exterior shots.

  14. ATLAS Inner Detector developments

    CERN Document Server

    Barberis, D

    2000-01-01

    The ATLAS Inner Detector consists of three layers of silicon pixels, four double layers of silicon microstrips and a Transition Radiation Tracker (straw tubes). The good performance of the track and vertex reconstruction algorithms is a direct consequence of the small radius (4.3, 10.1 and 13.2 cm), fine pitch ($50 \\times 300~\\mu$m) and low occupancy ($<3 \\times 10^{-4}$ at design luminosity) of the pixel detectors, and of the good tracking capabilities of the SCT and the TRT. The full detector simulation is used to evaluate the performance of the detector and of the reconstruction algorithms. Results are presented on track and vertex reconstruction efficiencies and resolutions, and on the separation between $b$-jets and jets produced by light quarks.

  15. ATLAS insertable B-layer

    Czech Academy of Sciences Publication Activity Database

    Marčišovský, Michal

    2011-01-01

    Roč. 633, č. 1 (2011), "S224"-"S225". ISSN 0168-9002. [International workshop on radiation imaging detector s /11./. Praha, 26.06.2009-02.07.2009] R&D Projects: GA MŠk LA08015; GA MŠk LA08032 Institutional research plan: CEZ:AV0Z10100502 Keywords : ATLAS * pixel detector * insertable B-layer Subject RIV: BF - Elementary Particles and High Energy Physics Impact factor: 1.207, year: 2011

  16. Last ATLAS TRT module installed

    CERN Multimedia

    2005-01-01

    The ATLAS transition radiation tracker (TRT) consists of 96 modules and will join the pixel detector and silicon tracker at the heart of the experiment to map the trajectories of particles and identify electrons produced when proton beams collide. Images with the team responsible for assembly : Kirill Egorov (Petersburg Nuclear Physics Institute), Pauline Gagnon (Indiana University), Ben Legeyt (University of Pennsylvania), Chuck Long (Hampton University), John Callahan (Indiana University) and Alex High (University of Pennsylvania).

  17. 3D electronics for hybrid pixel detectors – TWEPP-09

    CERN Document Server

    Godiot, S; Chantepie, B; Clémens, J C; Fei, R; Fleury, J; Fougeron, D; Garcia-Sciveres, M; Hemperek, T; Karagounis, M; Krueger, H; Mekkaoui, A; Pangaud, P; Rozanov, A; Wermes, N

    2009-01-01

    Future hybrid pixel detectors are asking for smaller pixels in order to improve spatial resolution and to deal with an increasing counting rate. Facing these requirements is foreseen to be done by microelectronics technology shrinking. However, this straightforward approach presents some disadvantages in term of performances and cost. New 3D technologies offer an alternative way with the advantage of technology mixing. For the upgrade of ATLAS pixel detector, a 3D conception of the read-out chip appeared as an interesting solution. Splitting the pixel functionalities into two separate levels will reduce pixel size and open the opportunity to take benefit of technology's mixing. Based on a previous prototype of the read-out chip FE-I4 (IBM 130nm), this paper presents the design of a hybrid pixel read-out chip using threedimensional Tezzaron-Chartered technology. In order to disentangle effects due to Chartered 130nm technology from effects involved by 3D architecture, a first translation of FEI4 prototype had ...

  18. Spectrally tunable pixel sensors

    Science.gov (United States)

    Langfelder, G.; Buffa, C.; Longoni, A. F.; Zaraga, F.

    2013-01-01

    They are here reported the developments and experimental results of fully operating matrices of spectrally tunable pixels based on the Transverse Field Detector (TFD). Unlike several digital imaging sensors based on color filter arrays or layered junctions, the TFD has the peculiar feature of having electrically tunable spectral sensitivities. In this way the sensor color space is not fixed a priori but can be real-time adjusted, e.g. for a better adaptation to the scene content or for multispectral capture. These advantages come at the cost of an increased complexity both for the photosensitive elements and for the readout electronics. The challenges in the realization of a matrix of TFD pixels are analyzed in this work. First experimental results on an 8x8 (x 3 colors) and on a 64x64 (x 3 colors) matrix will be presented and analyzed in terms of colorimetric and noise performance, and compared to simulation predictions.

  19. Alpine Pixel Detector Layout

    CERN Document Server

    Delebecque, P; The ATLAS collaboration; Geffroy, N; Massol, N; Rambure, T; Todorov, T

    2013-01-01

    A description of an optimized layout of pixel sensors based on a stave that combines both barrel and endcap module orientations. The mechanical stiffness of the structure is provided by carbon fiber shells spaced by carbon foam. The cooling of the modules is provided by two-phase $CO_{2}$ flowing in a thin titanium pipe glued inside the carbon fiber foam. The electrical services of all modules are provided by a single stave flex. This layout eliminates the need for separate barrel and endcap detector structures, and therefore the barrel services material in front of the endcap. The transition from barrel to endcap module orientation is optimized separately for each layer in order to minimize the active pixel area and the traversed material. The sparse module spacing in the endcap part of the stave allows for multiple fixation points, and for a stiff overall structure composed only of staves interconnected by stiff disks.

  20. Painting the Pixel

    OpenAIRE

    Goodfellow, Paul

    2014-01-01

    PAINTING THE PIXEL includes the work of nine international artists who are navigating the inherent paradoxes between the computer's immaterial, encoded matrix and the handmade. The exhibition investigates how digital technology is used as a conceptual tool in painting, how the virtual 'non-space' is reconfigured through the material presence of paint, and how the cultural currency of the image has shifted in relation to the phenomenon of the Internet. Curated by Rachel Sharp as part of her pr...

  1. Development of pixel readout integrated circuits for extreme rate and radiation

    CERN Multimedia

    Loddo, F; Liberali, V; Rizzi, A; Bellazzini, R; Re, V; Minuti, M; Alipour tehrani, N; Pangaud, P; Barbero, M B; Le dortz, O; Pacher, L; Hessey, N P; Kluit, R; Hinchliffe, I; Giubilato, P; Faccio, F; Pernegger, H; Krueger, H; Gensolen, F D; Prydderch, M L; Bilei, G M; Da rocha rolo, M D; Fanucci, L; Grillo, A A; Michelis, S; Huegging, F G; Kishishita, T; Marchiori, G; Christian, D C; Seidel, S C; Kaestli, H C; Meier, B; Key-charriere, M; Andreazza, A; Traversi, G; De canio, F; Linssen, L; Dannheim, D; Conti, E; Hemperek, T; Menouni, M; Fougeron, D; Genat, J; Bomben, M; Marzocca, C; Demaria, N; Mazza, G; Monteil, E; Van bakel, N A; Palla, F; Grippo, M T; Magazzu, G; Ratti, L; Abbaneo, D; Crescioli, F; Deptuch, G W; Tomasek, L; Havranek, M; Neue, G; De robertis, G; Passeri, D; Placidi, P; Gromov, V; Morsani, F; Bisello, D; Paccagnella, A; Christiansen, J; Dho, E; Wermes, N; Rymaszewski, P; Rozanov, A; Wang, A; Lipton, R J; Neviani, A; Karagounis, M; Godiot, S; Calderini, G; Horisberger, R P; Vrba, V; Garcia-sciveres, M A; Stabile, A; Shojaii, S R; Beccherle, R; Manghisoni, M; Bacchetta, N

    The present hybrid pixel detectors in operation at the LHC represent a major achievement. They deployed a new technology on an unprecedented scale and their success firmly established pixel tracking as indispensable for future HEP experiments. However, extrapolation of hybrid pixel technology to the HL-LHC presents major challenges on several fronts. We propose a new RD collaboration specifically focused on the development of pixel readout Integrated Circuits (IC). The IC challenges include: smaller pixels to resolve tracks in boosted jets, much higher hit rates (1-2 GHz/cm$^{2}$), unprecedented radiation tolerance (10 MGy), much higher output bandwidth, and large IC format with low power consumption in order to instrument large areas while keeping the material budget low. We propose a collaboration to design the next generation of hybrid pixel readout chips to enable the ATLAS and CMS Phase 2 pixel upgrades. This does not imply that ATLAS and CMS must use the same exact pixel readout chip, as most of the dev...

  2. Imaging properties of pixellated scintillators with deep pixels

    OpenAIRE

    Barber, H. Bradford; Fastje, David; Lemieux, Daniel; Grim, Gary P.; Furenlid, Lars R.; Miller, Brian W.; Parkhurst, Philip; Nagarkar, Vivek V.

    2014-01-01

    We have investigated the light-transport properties of scintillator arrays with long, thin pixels (deep pixels) for use in high-energy gamma-ray imaging. We compared 10×10 pixel arrays of YSO:Ce, LYSO:Ce and BGO (1mm × 1mm × 20 mm pixels) made by Proteus, Inc. with similar 10×10 arrays of LSO:Ce and BGO (1mm × 1mm × 15mm pixels) loaned to us by Saint-Gobain. The imaging and spectroscopic behaviors of these scintillator arrays are strongly affected by the choice of a reflector used as an inter...

  3. Expected performance of the ATLAS Inner Tracker

    CERN Document Server

    Viel, Simon; The ATLAS collaboration

    2016-01-01

    These slides present the expected tracking performance of the ATLAS Inner Tracker, based on the latest available public results (scoping document). More recent layout designs currently under consideration are also shown. The extended inner pixel barrel concept is discussed in more detail, along with test beam results demonstrating the proof-of-principle.

  4. The Kepler Pixel Response Function

    CERN Document Server

    Bryson, Stephen T; Jenkins, Jon M; Chandrasekaran, Hema; Klaus, Todd; Caldwell, Douglas A; Gilliland, Ronald L; Haas, Michael R; Dotson, Jessie L; Koch, David G; Borucki, William J

    2010-01-01

    Kepler seeks to detect sequences of transits of Earth-size exoplanets orbiting Solar-like stars. Such transit signals are on the order of 100 ppm. The high photometric precision demanded by Kepler requires detailed knowledge of how the Kepler pixels respond to starlight during a nominal observation. This information is provided by the Kepler pixel response function (PRF), defined as the composite of Kepler's optical point spread function, integrated spacecraft pointing jitter during a nominal cadence and other systematic effects. To provide sub-pixel resolution, the PRF is represented as a piecewise-continuous polynomial on a sub-pixel mesh. This continuous representation allows the prediction of a star's flux value on any pixel given the star's pixel position. The advantages and difficulties of this polynomial representation are discussed, including characterization of spatial variation in the PRF and the smoothing of discontinuities between sub-pixel polynomial patches. On-orbit super-resolution measurement...

  5. Gallium arsenide pixel detectors

    Energy Technology Data Exchange (ETDEWEB)

    Bates, R.; DaVia, C.; O`Shea, V.; Raine, C.; Smith, K. [Glasgow Univ. (United Kingdom). Dept. of Physics and Astronomy; Campbell, M.; Cantatore, E.; Heijne, E.M.; Middelkamp, P.; Ropotar, I.; Scharfetter, L.; Snoeys, W. [CERN, ECP Div., CH-1211 Geneva 23 (Switzerland); D`Auria, S.; Papa, C. del [Department of Physics, University of Udine and INFN Trieste, Via delle Scienze 208, I-33100 Udine (Italy); RD8 Collaboration

    1998-06-01

    GaAs detectors can be fabricated with bidimensional single-sided electrode segmentation. They have been successfully bonded using flip-chip technology to the Omega-3 silicon read-out chip. We present here the design features of the GaAs pixel detectors and results from a test performed at the CERN SpS with a 120 GeV {pi}{sup -} beam. The detection efficiency was 99.2% with a nominal threshold of 5000 e{sup -}. (orig.) 10 refs.

  6. The ALICE Pixel Detector

    International Nuclear Information System (INIS)

    The present document is a brief summary of the performed activities during the 2001 Summer Student Programme at CERN under the Scientific Summer at Foreign Laboratories Program organized by the Particles and Fields Division of the Mexican Physical Society (Sociedad Mexicana de Fisica). In this case, the activities were related with the ALICE Pixel Group of the EP-AIT Division, under the supervision of Jeroen van Hunen, research fellow in this group. First, I give an introduction and overview to the ALICE experiment; followed by a description of wafer probing. A brief summary of the test beam that we had from July 13th to July 25th is given as well

  7. Beam test results of the BTeV silicon pixel detector

    Energy Technology Data Exchange (ETDEWEB)

    Gabriele Chiodini et al.

    2000-09-28

    The authors have described the results of the BTeV silicon pixel detector beam test. The pixel detectors under test used samples of the first two generations of Fermilab pixel readout chips, FPIX0 and FPIX1, (indium bump-bonded to ATLAS sensor prototypes). The spatial resolution achieved using analog charge information is excellent for a large range of track inclination. The resolution is still very good using only 2-bit charge information. A relatively small dependence of the resolution on bias voltage is observed. The resolution is observed to depend dramatically on the discriminator threshold, and it deteriorates rapidly for threshold above 4000e{sup {minus}}.

  8. Modelling semiconductor pixel detectors

    CERN Document Server

    Mathieson, K

    2001-01-01

    expected after 200 ps in most cases. The effect of reducing the charge carrier lifetime and examining the charge collection efficiency has been utilised to explore how these detectors would respond in a harsh radiation environment. It is predicted that over critical carrier lifetimes (10 ps to 0.1 ns) an improvement of 40 % over conventional detectors can be expected. This also has positive implications for fabricating detectors, in this geometry, from materials which might otherwise be considered substandard. An analysis of charge transport in CdZnTe pixel detectors has been performed. The analysis starts with simulation studies into the formation of contacts and their influence on the internal electric field of planar detectors. The models include a number of well known defect states and these are balanced to give an agreement with a typical experimental I-V curve. The charge transport study extends to the development of a method for studying the effect of charge sharing in highly pixellated detectors. The ...

  9. EnviroAtlas - Phoenix, AZ - Estimated Intersection Density of Walkable Roads

    Data.gov (United States)

    U.S. Environmental Protection Agency — This EnviroAtlas dataset estimates the intersection density of walkable roads within a 750 meter radius of any given 10 meter pixel in the community. Intersections...

  10. EnviroAtlas - Austin, TX - Estimated Intersection Density of Walkable Roads

    Data.gov (United States)

    U.S. Environmental Protection Agency — This EnviroAtlas dataset estimates the intersection density of walkable roads within a 750 meter radius of any given 10 meter pixel in the community. Intersections...

  11. EnviroAtlas - New Bedford, MA - Estimated Intersection Density of Walkable Roads

    Data.gov (United States)

    U.S. Environmental Protection Agency — This EnviroAtlas dataset estimates the intersection density of walkable roads within a 750 meter radius of any given 10 meter pixel in the community. Intersections...

  12. EnviroAtlas - Portland, OR - Estimated Intersection Density of Walkable Roads

    Data.gov (United States)

    U.S. Environmental Protection Agency — This EnviroAtlas dataset estimates the intersection density of walkable roads within a 750 meter radius of any given 10 meter pixel in the community. Intersections...

  13. EnviroAtlas - Pittsburgh, PA - Estimated Intersection Density of Walkable Roads

    Data.gov (United States)

    U.S. Environmental Protection Agency — This EnviroAtlas dataset estimates the intersection density of walkable roads within a 750 meter radius of any given 10 meter pixel in the community. Intersections...

  14. EnviroAtlas - Memphis, TN - Estimated Intersection Density of Walkable Roads

    Data.gov (United States)

    U.S. Environmental Protection Agency — This EnviroAtlas dataset estimates the intersection density of walkable roads within a 750 meter radius of any given 10 meter pixel in the community. Intersections...

  15. EnviroAtlas - Portland, ME - Estimated Intersection Density of Walkable Roads

    Data.gov (United States)

    U.S. Environmental Protection Agency — This EnviroAtlas dataset estimates the intersection density of walkable roads within a 750 meter radius of any given 10 meter pixel in the community. Intersections...

  16. EnviroAtlas - Des Moines, IA - Estimated Intersection Density of Walkable Roads

    Data.gov (United States)

    U.S. Environmental Protection Agency — This EnviroAtlas dataset estimates the intersection density of walkable roads within a 750 meter radius of any given 10 meter pixel in the community. Intersections...

  17. EnviroAtlas - Paterson, NJ - Estimated Intersection Density of Walkable Roads

    Data.gov (United States)

    U.S. Environmental Protection Agency — This EnviroAtlas dataset estimates the intersection density of walkable roads within a 750 meter radius of any given 10 meter pixel in the community. Intersections...

  18. EnviroAtlas - Tampa, FL - Estimated Intersection Density of Walkable Roads

    Data.gov (United States)

    U.S. Environmental Protection Agency — This EnviroAtlas dataset estimates the intersection density of walkable roads within a 750 meter radius of any given 10 meter pixel in the community. Intersections...

  19. SNOWMASS WHITE PAPER - SLHC Endcap 1.4

    CERN Document Server

    Bilki, Burak; Winn, David R; Yetkin, Taylan

    2013-01-01

    Radiation damage in the plastic scintillator and/or readout WLS fibers in the HE endcap calorimeter 1.4SLHC will require remediation after 2018. We describe one alternative using the existing brass absorber in the Endcap calorimeter, to replace the plastic scintillator tiles with BaF2 tiles, or quartz tiles coated with thin(1-5 micron) films of radiation-hard pTerphenyl(pTP) or the fast phosphor ZnO:Ga. These tiles would be read-out by easily replaceable arrays of straight, parallel WLS fibers coupled to clear plastic-cladded quartz fibers of proven radiation resistance. We describe a second alternative with a new absorber matrix extending to 1.4

  20. The ALICE pixel detector

    CERN Document Server

    Mercado Perez, J

    2002-01-01

    The present document is a brief summary of the performed activities during the 2001 Summer Student Programme at CERN under the Scientific Summer at Foreign Laboratories Program organized by the Particles and Fields Division of the Mexican Physical Society (Sociedad Mexicana de Fisica). In this case, the activities were related with the ALICE Pixel Group of the EP-AIT Division, under the supervision of Jeroen van Hunen, research fellow in this group. First, I give an introduction and overview to the ALICE experiment; followed by a description of wafer probing. A brief summary of the test beam that we had from July 13th to July 25th is given as well. (3 refs).

  1. Supporting ATLAS

    CERN Multimedia

    maximilien brice

    2003-01-01

    Eighteen feet made of stainless steel will support the barrel ATLAS detector in the cavern at Point 1. In total, the ATLAS feet system will carry approximately 6000 tons, and will give the same inclination to the detector as the LHC accelerator.

  2. Heavily irradiated N-in-p thin planar pixel sensors with and without active edges

    Science.gov (United States)

    Terzo, S.; Andricek, L.; Macchiolo, A.; Moser, H. G.; Nisius, R.; Richter, R. H.; Weigell, P.

    2014-05-01

    We present the results of the characterization of silicon pixel modules employing n-in-p planar sensors with an active thickness of 150 μm, produced at MPP/HLL, and 100-200 μm thin active edge sensor devices, produced at VTT in Finland. These thin sensors are designed as candidates for the ATLAS pixel detector upgrade to be operated at the HL-LHC, as they ensure radiation hardness at high fluences. They are interconnected to the ATLAS FE-I3 and FE-I4 read-out chips. Moreover, the n-in-p technology only requires a single side processing and thereby it is a cost-effective alternative to the n-in-n pixel technology presently employed in the LHC experiments. High precision beam test measurements of the hit efficiency have been performed on these devices both at the CERN SpS and at DESY, Hamburg. We studied the behavior of these sensors at different bias voltages and different beam incident angles up to the maximum one expected for the new Insertable B-Layer of ATLAS and for HL-LHC detectors. Results obtained with 150 μm thin sensors, assembled with the new ATLAS FE-I4 chip and irradiated up to a fluence of 4 × 1015 neq/cm2, show that they are excellent candidates for larger radii of the silicon pixel tracker in the upgrade of the ATLAS detector at HL-LHC. In addition, the active edge technology of the VTT devices maximizes the active area of the sensor and reduces the material budget to suit the requirements for the innermost layers. The edge pixel performance of VTT modules has been investigated at beam test experiments and the analysis after irradiation up to a fluence of 5 × 1015 neq/cm2 has been performed using radioactive sources in the laboratory.

  3. Virtual Visit to the ATLAS Control Room by the Genova University

    CERN Multimedia

    2013-01-01

    The ATLAS Virtual Visit is included in the program of the Course in Particle and Nuclear Experimental Physics at the Physics Department of the Genova University. Students are introduced to experimental techniques and instrumentation and run few experiences in the laboratory. Besides that, they visit the Department groups that are involved both in Nuclear or High Energy Particle physics experiments. In this context, the ATLAS team will open them the doors to laboratory where ~1/3 of the Pixel detector has been built and where we are currently assembling and qualifying part of the electrical services and modules for the Insertable B layer (IBL) that will be installed in 2014 in ATLAS. Students will be introduced to LHC, ATLAS and the physics program before having the possibility to meet ATLAS physicists in ATLAS control room. http://atlas-live-virtual-visit.web.cern.ch/atlas-live-virtual-visit/2013/Genova-2013_2.html

  4. Virtual Visit to the ATLAS Control Room by the Genova University

    CERN Multimedia

    2013-01-01

    The ATLAS Virtual Visit is included in the program of the Course in Particle and Nuclear Experimental Physics at the Physics Department of the Genova University. Students are introduced to experimental techniques and instrumentation and run few experiences in the laboratory. Besides that, they visit the Department groups that are involved both in Nuclear or High Energy Particle physics experiments. In this context, the ATLAS team will open them the doors to laboratory where ~1/3 of the Pixel detector has been built and where we are currently assembling and qualifying part of the electrical services and modules for the Insertable B layer (IBL) that will be installed in 2014 in ATLAS. Students will be introduced to LHC, ATLAS and the physics program before having the possibility to meet ATLAS physicists in ATLAS control room. http://atlas-live-virtual-visit.web.cern.ch/atlas-live-virtual-visit/2013/Genova-2013_1.html

  5. Virtual Visit to the ATLAS Control Room by the University of Genova

    CERN Multimedia

    ATLAS Experiment

    2012-01-01

    The ATLAS Virtual Visit is included in the program of the Course in Particle and Nuclear Experimental Physics at the Physics Department of the Genova University. Students are introduced to experimental techniques and instrumentation and run few experiences in the laboratory. Besides that, they visit the Department groups that are involved both in Nuclear or High Energy Particle physics experiments. In this context, the ATLAS team will open them the doors to laboratory where ~1/3 of the Pixel detector has been built and where we are currently assembling and qualifying part of the electrical services and modules for the Insertable B layer (IBL) that will be installed in 2014 in ATLAS. Students will be introduced to LHC, ATLAS and the physics program before having the possibility to meet ATLAS physicists in ATLAS control room. http://atlas-live-virtual-visit.web.cern.ch/atlas-live-virtual-visit/2012/Genova-2012.html

  6. Development of radiation hard CMOS active pixel sensors for HL-LHC

    Science.gov (United States)

    Pernegger, Heinz

    2016-07-01

    New pixel detectors, based on commercial high voltage and/or high resistivity full CMOS processes, hold promise as next-generation active pixel sensors for inner and intermediate layers of the upgraded ATLAS tracker. The use of commercial CMOS processes allow cost-effective detector construction and simpler hybridisation techniques. The paper gives an overview of the results obtained on AMS-produced CMOS sensors coupled to the ATLAS Pixel FE-I4 readout chips. The SOI (silicon-on-insulator) produced sensors by XFAB hold great promise as radiation hard SOI-CMOS sensors due to their combination of partially depleted SOI transistors reducing back-gate effects. The test results include pre-/post-irradiation comparison, measurements of charge collection regions as well as test beam results.

  7. Supporting ATLAS

    CERN Multimedia

    2003-01-01

    Eighteen feet made of stainless steel will support the barrel ATLAS detector in the cavern at Point 1. In total, the ATLAS feet system will carry approximately 6000 tons, and will give the same inclination to the detector as the LHC accelerator. The installation of the feet is scheduled to finish during January 2004 with an installation precision at the 1 mm level despite their height of 5.3 metres. The manufacture was carried out in Russia (Company Izhorskiye Zavody in St. Petersburg), as part of a Russian and JINR Dubna in-kind contribution to ATLAS. Involved in the installation is a team from IHEP-Protvino (Russia), the ATLAS technical co-ordination team at CERN, and the CERN survey team. In all, about 15 people are involved. After the feet are in place, the barrel toroid magnet and the barrel calorimeters will be installed. This will keep the ATLAS team busy for the entire year 2004.

  8. THE KEPLER PIXEL RESPONSE FUNCTION

    International Nuclear Information System (INIS)

    Kepler seeks to detect sequences of transits of Earth-size exoplanets orbiting solar-like stars. Such transit signals are on the order of 100 ppm. The high photometric precision demanded by Kepler requires detailed knowledge of how the Kepler pixels respond to starlight during a nominal observation. This information is provided by the Kepler pixel response function (PRF), defined as the composite of Kepler's optical point-spread function, integrated spacecraft pointing jitter during a nominal cadence and other systematic effects. To provide sub-pixel resolution, the PRF is represented as a piecewise-continuous polynomial on a sub-pixel mesh. This continuous representation allows the prediction of a star's flux value on any pixel given the star's pixel position. The advantages and difficulties of this polynomial representation are discussed, including characterization of spatial variation in the PRF and the smoothing of discontinuities between sub-pixel polynomial patches. On-orbit super-resolution measurements of the PRF across the Kepler field of view are described. Two uses of the PRF are presented: the selection of pixels for each star that maximizes the photometric signal-to-noise ratio for that star, and PRF-fitted centroids which provide robust and accurate stellar positions on the CCD, primarily used for attitude and plate scale tracking. Good knowledge of the PRF has been a critical component for the successful collection of high-precision photometry by Kepler.

  9. Development of a counting pixel detector for 'Digitales Roentgen'

    International Nuclear Information System (INIS)

    The development of a single photon counting X-ray imaging detector for medical applications using hybrid pixel detectors is reported. The electronics development from the first prototype derived from detector development for particle physics experiments (ATLAS) to the imaging chip MPEC (multi picture element counters) for medical applications is described. This chip consists of 32 x 32 pixels of 200 μm x 200 μm size, each containing the complete read out electronics, i.e. an amplifier, two discriminators with adjustable thresholds and two 18-bit linear feedback shift-counters allowing energy windowing for contrast increase. Results on electronics performance are shown as well as measurements with several semiconductor materials (Si, GaAs, CdTe). Important aspects like detection efficiency, sensor homogeneity, linearity and spatial resolution are discussed. (orig.)

  10. Expected performance of the ATLAS Inner Tracker upgrade

    CERN Document Server

    Viel, Simon; The ATLAS collaboration

    2016-01-01

    The design of the ATLAS Inner Tracker upgrade is underway. This tracking detector, consisting of silicon pixel and strip modules, will replace the current ATLAS Inner Detector to reconstruct tracks from charged particles produced at the very high collision rate expected from the High-Luminosity Large Hadron Collider. The latest Inner Tracker designs considered, and the most recent expected performance results from simulation are presented.

  11. The alignment of the ATLAS Inner Detector in Run 2

    CERN Document Server

    Ripellino, Giulia; The ATLAS collaboration

    2016-01-01

    The ATLAS reconstruction of charged particle trajectories relies on the Inner Detector tracking system. The accuracy of the reconstruction is limited by the finite resolution of the detector elements and the imperfect knowledge about their positions. A precise alignment of the detector is therefore essential. Here, the strategy and the status of the Inner Detector alignment in ATLAS during the LHC Run 2 are presented and the alignment challenges related to the distortion of the new innermost Pixel layer, the IBL, are discussed.

  12. Design and realisation of integrated circuits for the readout of pixel sensors in high-energy physics and biomedical imaging

    International Nuclear Information System (INIS)

    Radiation tolerant pixel-readout chip for the ATLAS pixel detector has been designed, implemented in a deep-submicron CMOS technology and successfully tested. The chip contains readout-channels with complex analog and digital circuits. Chip for steering of the DEPFET active-pixel matrix has been implemented in a high-voltage CMOS technology. The chip contains channels which generate fast sequences of high-voltage signals. Detector containing this chip has been successfully tested. Pixel-readout test chip for an X-ray imaging pixel sensor has been designed, implemented in a CMOS technology and tested. Pixel-readout channels are able to simultaneously count the signals generated by passage of individual photons and to sum the total charge generated during exposure time. (orig.)

  13. Design and realisation of integrated circuits for the readout of pixel sensors in high-energy physics and biomedical imaging

    Energy Technology Data Exchange (ETDEWEB)

    Peric, I.

    2004-08-01

    Radiation tolerant pixel-readout chip for the ATLAS pixel detector has been designed, implemented in a deep-submicron CMOS technology and successfully tested. The chip contains readout-channels with complex analog and digital circuits. Chip for steering of the DEPFET active-pixel matrix has been implemented in a high-voltage CMOS technology. The chip contains channels which generate fast sequences of high-voltage signals. Detector containing this chip has been successfully tested. Pixel-readout test chip for an X-ray imaging pixel sensor has been designed, implemented in a CMOS technology and tested. Pixel-readout channels are able to simultaneously count the signals generated by passage of individual photons and to sum the total charge generated during exposure time. (orig.)

  14. Alignment of the ATLAS Inner Detector tracking system

    CERN Document Server

    Moles-Valls, R; The ATLAS collaboration

    2010-01-01

    ATLAS is a multipurpose experiment that records the products of the LHC collisions. In order to reconstruct trajectories of charged particles produced in these collisions, ATLAS is equipped with a tracking system built on silicon planar sensors (Pixels and microstrips) and drift-tube based detectors. They constitute the ATLAS Inner Detector. It contains 1744 pixel modules (1456 in 3 barrel layers and 288 in 6 end cap disks). The pixel size is 50x400 squared microns. In order to achieve its scientific goals, the alignment of the ATLAS tracking system requires the determination of its almost 36000 degrees of freedom (DoF) with high accuracy. Thus the demanded precision for the alignment of the pixel and microstrip sensors is below 10 micrometers. This implies to use a large sample of high momentum and isolated charge particle tracks. The high level trigger selects those tracks online. Tracks from cosmic trigger during empty LHC bunches are also used as input for the alignment if they cross the pixel detector vo...

  15. From Pixels to Planets

    Science.gov (United States)

    Brownston, Lee; Jenkins, Jon M.

    2015-01-01

    The Kepler Mission was launched in 2009 as NASAs first mission capable of finding Earth-size planets in the habitable zone of Sun-like stars. Its telescope consists of a 1.5-m primary mirror and a 0.95-m aperture. The 42 charge-coupled devices in its focal plane are read out every half hour, compressed, and then downlinked monthly. After four years, the second of four reaction wheels failed, ending the original mission. Back on earth, the Science Operations Center developed the Science Pipeline to analyze about 200,000 target stars in Keplers field of view, looking for evidence of periodic dimming suggesting that one or more planets had crossed the face of its host star. The Pipeline comprises several steps, from pixel-level calibration, through noise and artifact removal, to detection of transit-like signals and the construction of a suite of diagnostic tests to guard against false positives. The Kepler Science Pipeline consists of a pipeline infrastructure written in the Java programming language, which marshals data input to and output from MATLAB applications that are executed as external processes. The pipeline modules, which underwent continuous development and refinement even after data started arriving, employ several analytic techniques, many developed for the Kepler Project. Because of the large number of targets, the large amount of data per target and the complexity of the pipeline algorithms, the processing demands are daunting. Some pipeline modules require days to weeks to process all of their targets, even when run on NASA's 128-node Pleiades supercomputer. The software developers are still seeking ways to increase the throughput. To date, the Kepler project has discovered more than 4000 planetary candidates, of which more than 1000 have been independently confirmed or validated to be exoplanets. Funding for this mission is provided by NASAs Science Mission Directorate.

  16. Mongolian Atlas

    Data.gov (United States)

    National Oceanic and Atmospheric Administration, Department of Commerce — Climatic atlas dated 1985, in Mongolian, with introductory material also in Russian and English. One hundred eight pages in single page PDFs.

  17. A Sub Pixel Resolution Method

    OpenAIRE

    Khademi, Siamak; Darudi, Ahmad; ABBASI, Zahra

    2012-01-01

    One of the main limitations for the resolution of optical instruments is the size of the sensor's pixels. In this paper we introduce a new sub pixel resolution algorithm to enhance the resolution of images. This method is based on the analysis of multi-images which are fast recorded during the fine relative motion of image and pixel arrays of CCDs. It is shown that by applying this method for a sample noise free image one will enhance the resolution with order of error.

  18. Overview of the ATLAS Insertable B-Layer (IBL) Project

    CERN Document Server

    Kagan, M; The ATLAS collaboration

    2013-01-01

    The upgrades for the ATLAS Pixel Detector will be staged in preparation for high luminosity LHC. The first upgrade for the Pixel Detector will be the construction of a new pixel layer which is currently under construction and will be installed during the first shutdown of the LHC machine, in 2013-14. The new detector, called the Insertable B-layer (IBL), will be installed between the existing Pixel Detector and a new, smaller radius beam-pipe at a radius of 3.3 cm. The IBL required the development of several new technologies to cope with increased radiation and pixel occupancy and also to improve the physics performance through reduction of the pixel size and a more stringent material budget. Two different silicon sensor technologies, planar n-in-n and 3D, will be used, connected with the new generation 130nm IBM CMOS FE-I4 readout chip via solder bump-bonds. 32 \

  19. Planar pixel sensors for the ATLAS upgrade: beam tests results

    Czech Academy of Sciences Publication Activity Database

    Weingarten, J.; Altenheiner, S.; Beimforde, M.; Benoit, M.; Bomben, M.; Calderini, G.; Gallrapp, C.; George, M.; Gibson, S.; Grinstein, S.; Janoška, Zdenko; Jentzsch, J.; Jinnouchi, O.; Kishida, T.; La Rosa, A.; Libov, V.; Macchiolo, A.; Marchiori, G.; Muenstermann, D.; Nagai, R.; Piacquadio, G.; Ristic, B.; Rubinskiy, I.; Rummler, A.; Takubo, Y.; Troska, G.; Tsiskaridtze, S.; Tsurin, I.; Unno, Y.; Weigell, P.; Wittig, T.

    2012-01-01

    Roč. 7, Oct (2012), "P10028-1"-"P10028-26". ISSN 1748-0221 Institutional support: RVO:68378271 Keywords : particle tracking detectors * solid state detectors * radiation -hard detectors Subject RIV: BL - Plasma and Gas Discharge Physics Impact factor: 1.869, year: 2011

  20. Studies on the Optical Readout for the ATLAS Pixel Detector

    CERN Document Server

    Flick, Tobias

    The particle physics is concentrating on the research of the structure of the matter which is observable in our world. How is this world built. Which particles exist, which are necessary to build up the world? How is this matter kept together, what are the interactions between the known particles? The answers to these questions are obtained by observing the known particles, to study their properties, and to search new for particles. Models are developed to describe all the observations. Experiments are performed to proove the models. The best prooven model to describe many of the observations is the Standard Model. The Standard Model is elucidated in Chapter 1. It is tested very precisely by experimental measurements in the last years, but cannot explain all phenomena of nature. To discover the last not observed particle of the Standard Model, the Higgs boson, and to extend the model further experiments are needed. To study the elementary particles machines and instruments are necessary to produce and measur...

  1. Development of pixel front-end electronics using advanced deep submicron CMOS technologies

    International Nuclear Information System (INIS)

    The content of this thesis is oriented on the R and D of microelectronic integrated circuits for processing the signal from particle sensors and partially on the sensors themselves. This work is motivated by ongoing upgrades of the ATLAS Pixel Detector at CERN laboratory and by exploration of new technologies for the future experiments in particle physics. Evolution of technologies for the fabrication of microelectronic circuits follows Moore's laws. Transistors become smaller and electronic chips reach higher complexity. Apart from this, silicon foundries become more open to smaller customers and often provide non-standard process options. Two new directions in pixel technologies are explored in this thesis: design of pixel electronics using ultra deep submicron (65 nm) CMOS technology and Depleted Monolithic Active Pixel Sensors (DMAPS). An independent project concerning the measurement of pixel capacitance with a dedicated measurement chip is a part of this thesis. Pixel capacitance is one of the key parameters for design of the pixel front-end electronics and thus it is closely related to the content of the thesis. The theoretical background, aspects of chip design, performance of chip prototypes and prospect for design of large pixel chips are comprehensively described in five chapters of the thesis.

  2. The ATLAS IBL BOC prototype

    International Nuclear Information System (INIS)

    The Pixel Detector of the ATLAS experiment at CERN will be upgraded with an Insertable B-Layer (IBL) in 2013. To handle the data readout the currently used VME card pairs consisting of a back of crate card (BOC) and a read out driver (ROD) are being redesigned. This paper presents details of the hardware design of the new BOC prototype, which takes advantage from modern FPGA technology and commercial optical modules and abandons the need for a variety of custom components used on the old card. Also the throughput is four times higher and additional features are implemented.

  3. Parallel encoders for pixel detectors

    International Nuclear Information System (INIS)

    A new method of fast encoding and determining the multiplicity and coordinates of fired pixels is described. A specific example construction of parallel encodes and MCC for n=49 and t=2 is given. 16 refs.; 6 figs.; 2 tabs

  4. Pre- and post-irradiation performance of FBK 3D silicon pixel detectors for CMS

    Energy Technology Data Exchange (ETDEWEB)

    Krzywda, A., E-mail: akrzywda@purdue.edu [Purdue University, Department of Physics and Astronomy, West Lafayette, IN 47907-2036 (United States); Alagoz, E.; Bubna, M. [Purdue University, Department of Physics and Astronomy, West Lafayette, IN 47907-2036 (United States); Obertino, M. [Università del Piemonte Orientale, Novara (Italy); INFN, Sezione di Torino, Torino (Italy); Solano, A. [Università di Torino, Torino (Italy); INFN, Sezione di Torino, Torino (Italy); Arndt, K. [Purdue University, Department of Physics and Astronomy, West Lafayette, IN 47907-2036 (United States); Uplegger, L. [Fermi National Accelerator Laboratory, Batavia, IL 60510-5011 (United States); Betta, G.F. Dalla [TIFPA INFN and Dipartimento di Ingegneria Industriale, Università di Trento, Via Sommarive 9, I-38123 Povo di Trento, TN (Italy); Boscardin, M. [Centro per Materiali e i Microsistemi Fondazione Bruno Kessler (FBK), Trento, Via Sommarive 18, I-38123 Povo di Trento, TN (Italy); Ngadiuba, J. [Università di Milano-Bicocca, Milan (Italy); Rivera, R. [Fermi National Accelerator Laboratory, Batavia, IL 60510-5011 (United States); Menasce, D.; Moroni, L.; Terzo, S. [Università di Milano-Bicocca, Milan (Italy); Bortoletto, D. [Purdue University, Department of Physics and Astronomy, West Lafayette, IN 47907-2036 (United States); Prosser, A.; Adreson, J.; Kwan, S. [Fermi National Accelerator Laboratory, Batavia, IL 60510-5011 (United States); Osipenkov, I. [Texas A and M University, Department of Physics, College Station, TX 77843 (United States); Bolla, G. [Purdue University, Department of Physics and Astronomy, West Lafayette, IN 47907-2036 (United States); and others

    2014-11-01

    In preparation for the tenfold luminosity upgrade of the Large Hadron Collider (the HL-LHC) around 2020, three-dimensional (3D) silicon pixel sensors are being developed as a radiation-hard candidate to replace the planar ones currently being used in the CMS pixel detector. This study examines an early batch of FBK sensors (named ATLAS08) of three 3D pixel geometries: 1E, 2E, and 4E, which respectively contain one, two, and four readout electrodes for each pixel, passing completely through the bulk. We present electrical characteristics and beam test performance results for each detector before and after irradiation. The maximum fluence applied is 3.5×10{sup 15} n {sub eq}/cm{sup 2}.

  5. The radiation hardness of specific multi-mode and single-mode optical fibres at -250C beyond a full SLHC dose to a dose of 500 kGy(Si)

    International Nuclear Information System (INIS)

    The optical fibres that will be used in SLHC detectors will be exposed to high doses and low temperatures in the inner detectors. A number of Single-Mode (SM) and Multi-Mode (MM) fibres have been tested for radiation hardness by exposure beyond a full SLHC dose to 500 kGy(Si) in the -250C operating temperatures expected in the upgraded inner detectors. From these measurements conservative estimates of the level of Radiation Induced Absorption (RIA) have been calculated for these fibres in realistic paths through an upgraded inner detector. Two SM fibres have been found whose total calculated RIAs were much lower than the budgeted 1 dB, despite the high dose rates used in the experiment. The RIAs for the DrakaElite Super RadHard Single-Mode Fiber and Fibre X were calculated to be 0.142 and 0.064 dB respectively. Another SM and a MM fibre showed high levels of RIA during the experiment, however they cannot be ruled out as candidate fibres due the the high dose rate of 27 kGy(Si)/hr used.

  6. Last ATLAS transition radiation tracker module installed

    CERN Multimedia

    Maximilien Brice

    2005-01-01

    The ATLAS transition radiation tracker consists of 96 modules and will join the pixel detector and silicon tracker at the heart of the experiment to map the trajectories of particles and identify electrons produced when proton beams collide. In the last image the team responsible for assembly are shown from left to right: Kirill Egorov (Petersburg Nuclear Physics Institute), Pauline Gagnon (Indiana University), Ben Legeyt (University of Pennsylvania), Chuck Long (Hampton University), John Callahan (Indiana University) and Alex High (University of Pennsylvania).

  7. Studies of the ATLAS Inner Detector material using $\\sqrt{s}=$13 TeV $pp$ collision data

    CERN Document Server

    The ATLAS collaboration

    2015-01-01

    The ATLAS Inner Detector comprises three different technologies: the Pixel detector (Pixel), the silicon strip tracker (SCT), and the transition radiation drift tube tracker (TRT). The material in the ATLAS Inner Detector is studied with several methods, using the $pp$ collision sample collected at $\\sqrt{s}=$13 TeV in 2015. The material within the innermost barrel regions of the ATLAS Inner Detector is studied using reconstructed hadronic interaction and photon conversion vertices from samples of minimum bias events. It was found that the description of the Insertable B-Layer, which is the new, innermost Pixel layer installed in 2014, in the geometry model was missing some material components. After updating the model, data and simulation show good agreement at the barrel region. The Pixel services (cables, cooling pipes, support trays) were modified between the Pixel and SCT detectors in 2014. The material in this region is also studied by investigating the efficiency with which tracks reconstructed only in...

  8. Development of active edge pixel sensors and four-side buttable modules using vertical integration technologies

    CERN Document Server

    Macchiolo, A; Moser, H-G; Nisius, R; Richter, R H; Terzo, S; Weigell, P

    2014-01-01

    We present an R&D activity focused on the development of novel modules for the upgrade of the ATLAS pixel system at the High Luminosity LHC (HL-LHC). The modules consist of n-in-p pixel sensors, 100 or 200 $\\mu$m thick, produced at VTT (Finland) with an active edge technology, which considerably reduces the dead area at the periphery of the device. The sensors are interconnected with solder bump-bonding to the ATLAS FE-I3 and FE-I4 read-out chips, and characterized with radioactive sources and beam tests at the CERN-SPS and DESY. The results of these measurements will be discussed for devices before and after irradiation up to a fluence of $5\\times 10^{15}$ \

  9. Overview of the ATLAS Insertable B-Layer (IBL) Project

    International Nuclear Information System (INIS)

    The upgrades for the ATLAS Pixel Detector will be staged in preparation for high luminosity LHC. The first upgrade for the Pixel Detector is the construction of a new pixel layer which will be installed during the first shutdown of the LHC machine, in 2013–2014. The new detector, called the Insertable B-Layer (IBL), will be installed between the existing Pixel Detector and a new, smaller radius beam-pipe at a radius of 3.3 cm. The IBL has required the development of several new technologies to cope with increased radiation and pixel occupancy and also to improve the physics performance through reduction of the pixel size and a more stringent material budget. The IBL presents several changes to the design of the present ATLAS Pixel Detector: two different and promising silicon sensor technologies, planar n-in-n and 3D, will be used for the IBL. A new read-out chip FE-I4 has been designed in 130 nm technology, the material budget is minimized by using new lightweight mechanical support materials and a CO2 based cooling system has been developed. An overview of the IBL project, of the module design and the qualification for these sensor technologies with particular emphasis on irradiation and beam tests will be presented

  10. Experience on 3D Silicon Sensors for ATLAS IBL

    CERN Document Server

    Darbo, Giovanni

    2015-01-01

    3D silicon sensors, where plasma micro-machining is used to etch deep narrow apertures in the silicon substrate to form electrodes of PIN junctions, represent possible solutions for inner pixel layers of the tracking detectors in high energy physics experiments. This type of sensors has been developed for the Insertable B-Layer (IBL), an additional pixel layer that has been installed in ATLAS during the present shutdown of the LHC collider at CERN. It is presented here the experience in designing, testing and qualifying sensors and detector modules that have been used to equip part of the IBL. Based on the gained experience with 3D silicon sensors for the ATLAS IBL, we discuss possible new developments for the upgrade of ATLAS and CMS at the high-luminosity LHC (HL-LHC).

  11. Experience on 3D silicon sensors for ATLAS IBL

    International Nuclear Information System (INIS)

    3D silicon sensors, where plasma micro-machining is used to etch deep narrow apertures in the silicon substrate to form electrodes of PIN junctions, represent possible solutions for inner pixel layers of the tracking detectors in high energy physics experiments. This type of sensors has been developed for the Insertable B-Layer (IBL), an additional pixel layer that has been installed in ATLAS during the present shutdown of the LHC collider at CERN. It is presented here the experience in designing, testing and qualifying sensors and detector modules that have been used to equip part of the IBL. Based on the gained experience with 3D silicon sensors for the ATLAS IBL, we discuss possible new developments for the upgrade of ATLAS and CMS at the high-luminosity LHC (HL-LHC)

  12. Experience on 3D silicon sensors for ATLAS IBL

    Science.gov (United States)

    Darbo, G.

    2015-05-01

    3D silicon sensors, where plasma micro-machining is used to etch deep narrow apertures in the silicon substrate to form electrodes of PIN junctions, represent possible solutions for inner pixel layers of the tracking detectors in high energy physics experiments. This type of sensors has been developed for the Insertable B-Layer (IBL), an additional pixel layer that has been installed in ATLAS during the present shutdown of the LHC collider at CERN. It is presented here the experience in designing, testing and qualifying sensors and detector modules that have been used to equip part of the IBL. Based on the gained experience with 3D silicon sensors for the ATLAS IBL, we discuss possible new developments for the upgrade of ATLAS and CMS at the high-luminosity LHC (HL-LHC).

  13. The ATLAS Insertable B-Layer: from construction to operation

    CERN Document Server

    La Rosa, Alessandro; The ATLAS collaboration

    2016-01-01

    The ATLAS Insertable B-Layer (IBL) is a fourth layer of pixel detectors, and has been installed in May 2014 at a radius of 3.3 cm between the existing Pixel Detector and a new smaller radius beam-pipe. The new detector, built to cope with high radiation and occupancy, is the first large scale application of 3D detectors and CMOS 130nm technology. The IBL detector construction was achieved within about two years starting from mid-2012 to the May 2014 installation in ATLAS, a very tight schedule to meet the ATLAS installation and detector closure before starting the Run2 in Spring 2015. The key features and challenges met during the IBL project will be presented, as well as its commissioning and operational experience in LHC.

  14. Overview of the BTeV Pixel Detector

    International Nuclear Information System (INIS)

    BTeV is a new Fermilab beauty and charm experiment designed to operate in the CZero region of the Tevatron collider. Critical to the success of BTeV is its pixel detector. The unique features of this pixel detector include its proximity to the beam, its operation with a beam crossing time of 132 ns, and the need for the detector information to be read out quickly enough to be used for the lowest level trigger. This talk presents an overview of the pixel detector design, giving the motivations for the technical choices made. The status of the current RandD on detector components is also reviewed. Additional Pixel 2002 talks on the BTeV pixel detector are given by Dave Christian[1], Mayling Wong[2], and Sergio Zimmermann[3]. Table 1 gives a selection of pixel detector parameters for the ALICE, ATLAS, BTeV, and CMS experiments. Comparing the progression of this table, which I have been updating for the last several years, has shown a convergence of specifications. Nevertheless, significant differences endure. The BTeV data-driven readout, horizontal and vertical position resolution better than 9 (micro)m with the ± 300 mr forward acceptance, and positioning in vacuum and as close as 6 mm from the circulating beams remain unique. These features are driven by the physics goals of the BTeV experiment. Table 2 demonstrates that the vertex trigger performance made possible by these features is requisite for a very large fraction of the B meson decay physics which is so central to the motivation for BTeV. For most of the physics quantities of interest listed in the table, the vertex trigger is essential. The performance of the BTeV pixel detector may be summarized by looking at particular physics examples; e.g., the Bs meson decay Bs → Ds- K+. For that decay, studies using GEANT3 simulations provide quantitative measures of performance. For example, the separation between the Bs decay point and the primary proton-antiproton interaction can be measured with an rms

  15. ATLAS Story

    CERN Multimedia

    Nordberg, Markus

    2012-01-01

    This film produced in July 2012 explains how fundamental research connects to Society and what benefits collaborative way of working can and may generate in the future, using ATLAS Collaboration as a case study. The film is intellectually inspired by the book "Collisions and Collaboration" (OUP) by Max Boisot (ed.), see: collisionsandcollaboration.com. The film is directed by Andrew Millington (OMNI Communications)

  16. Development of active edge pixel sensors and four-side buttable modules using vertical integration technologies

    Science.gov (United States)

    Macchiolo, A.; Andricek, L.; Moser, H.-G.; Nisius, R.; Richter, R. H.; Terzo, S.; Weigell, P.

    2014-11-01

    We present an R&D activity focused on the development of novel modules for the upgrade of the ATLAS pixel system at the High Luminosity LHC (HL-LHC). The modules consist of n-in-p pixel sensors, 100 or 200 μm thick, produced at VTT (Finland) with an active edge technology, which considerably reduces the dead area at the periphery of the device. The sensors are interconnected with solder bump-bonding to the ATLAS FE-I3 and FE-I4 read-out chips, and characterised with radioactive sources and beam tests at the CERN-SPS and DESY. The results of these measurements will be discussed for devices before and after irradiation up to a fluence of 5 ×1015neq /cm2. We will also report on the R&D activity to obtain Inter Chip Vias (ICVs) on the ATLAS read-out chip in collaboration with the Fraunhofer Institute EMFT. This step is meant to prove the feasibility of the signal transport to the newly created readout pads on the backside of the chips allowing for four side buttable devices without the presently used cantilever for wire bonding. The read-out chips with ICVs will be interconnected to thin pixel sensors, 75 μm and 150 μm thick, with the Solid Liquid Interdiffusion (SLID) technology, which is an alternative to the standard solder bump-bonding.

  17. Heavily Irradiated N-in-p Thin Planar Pixel Sensors with and without Active Edges

    CERN Document Server

    Terzo, S; Macchiolo, A; Moser, H G; Nisius, R; Richter, R H; Weigell, P

    2014-01-01

    We present the results of the characterization of silicon pixel modules employing n-in-p planar sensors with an active thickness of 150 $\\mathrm{\\mu}$m, produced at MPP/HLL, and 100-200 $\\mathrm{\\mu}$m thin active edge sensor devices, produced at VTT in Finland. These thin sensors are designed as candidates for the ATLAS pixel detector upgrade to be operated at the HL-LHC, as they ensure radiation hardness at high fluences. They are interconnected to the ATLAS FE-I3 and FE-I4 read-out chips. Moreover, the n-in-p technology only requires a single side processing and thereby it is a cost-effective alternative to the n-in-n pixel technology presently employed in the LHC experiments. High precision beam test measurements of the hit efficiency have been performed on these devices both at the CERN SpS and at DESY, Hamburg. We studied the behavior of these sensors at different bias voltages and different beam incident angles up to the maximum one expected for the new Insertable B-Layer of ATLAS and for HL-LHC detect...

  18. Development of active edge pixel sensors and four-side buttable modules using vertical integration technologies

    Energy Technology Data Exchange (ETDEWEB)

    Macchiolo, A., E-mail: Anna.Macchiolo@mpp.mpg.de [Max-Planck-Institut for Physics, Föhringer Ring 6, D-80805 Munich (Germany); Andricek, L. [Semiconductor Laboratory of the Max-Planck-Society, Otto Hahn Ring 6, D-81739 Munich (Germany); Moser, H.-G.; Nisius, R. [Max-Planck-Institut for Physics, Föhringer Ring 6, D-80805 Munich (Germany); Richter, R.H. [Semiconductor Laboratory of the Max-Planck-Society, Otto Hahn Ring 6, D-81739 Munich (Germany); Terzo, S.; Weigell, P. [Max-Planck-Institut for Physics, Föhringer Ring 6, D-80805 Munich (Germany)

    2014-11-21

    We present an R and D activity focused on the development of novel modules for the upgrade of the ATLAS pixel system at the High Luminosity LHC (HL-LHC). The modules consist of n-in-p pixel sensors, 100 or 200 μm thick, produced at VTT (Finland) with an active edge technology, which considerably reduces the dead area at the periphery of the device. The sensors are interconnected with solder bump-bonding to the ATLAS FE-I3 and FE-I4 read-out chips, and characterised with radioactive sources and beam tests at the CERN-SPS and DESY. The results of these measurements will be discussed for devices before and after irradiation up to a fluence of 5×10{sub 15}n{sub eq}/cm{sup 2}. We will also report on the R and D activity to obtain Inter Chip Vias (ICVs) on the ATLAS read-out chip in collaboration with the Fraunhofer Institute EMFT. This step is meant to prove the feasibility of the signal transport to the newly created readout pads on the backside of the chips allowing for four side buttable devices without the presently used cantilever for wire bonding. The read-out chips with ICVs will be interconnected to thin pixel sensors, 75 μm and 150 μm thick, with the Solid Liquid Interdiffusion (SLID) technology, which is an alternative to the standard solder bump-bonding.

  19. Development of active edge pixel sensors and four-side buttable modules using vertical integration technologies

    International Nuclear Information System (INIS)

    We present an R and D activity focused on the development of novel modules for the upgrade of the ATLAS pixel system at the High Luminosity LHC (HL-LHC). The modules consist of n-in-p pixel sensors, 100 or 200 μm thick, produced at VTT (Finland) with an active edge technology, which considerably reduces the dead area at the periphery of the device. The sensors are interconnected with solder bump-bonding to the ATLAS FE-I3 and FE-I4 read-out chips, and characterised with radioactive sources and beam tests at the CERN-SPS and DESY. The results of these measurements will be discussed for devices before and after irradiation up to a fluence of 5×1015neq/cm2. We will also report on the R and D activity to obtain Inter Chip Vias (ICVs) on the ATLAS read-out chip in collaboration with the Fraunhofer Institute EMFT. This step is meant to prove the feasibility of the signal transport to the newly created readout pads on the backside of the chips allowing for four side buttable devices without the presently used cantilever for wire bonding. The read-out chips with ICVs will be interconnected to thin pixel sensors, 75 μm and 150 μm thick, with the Solid Liquid Interdiffusion (SLID) technology, which is an alternative to the standard solder bump-bonding

  20. The ATLAS Insertable B-Layer (IBL) Project

    CERN Document Server

    Bilbao de Mendizabal, J; The ATLAS collaboration

    2012-01-01

    Preparing the hight luminosity LHC phase, the ATLAS experiment will upgrade his Pixel tracking system with the installation of a new pixel layer. The new sub detector, called the Insertable B-layer (IBL), will be installed during the LHC first shut down in 2013-2014, in between the innermost actual pixel layer and the beampipe. To cope with the high radiation and pixel occupancy due to the proximity to the interaction point, a new read-out chip FE-I4 and two different silicon sensor technologies, planar and 3D have been developed. Furthermore, the physics performance should be improved through the reduction of pixel size and a new mechanical support using lightweight staves. Two pre-series staves were made in order to qualify the assembly procedure, the loaded module electrical integrity and the read-out chain before going into production.

  1. Overview of HVCMOS pixel sensors

    International Nuclear Information System (INIS)

    High voltage CMOS (HVCMOS) sensors are presently considered for the use in Mu3e experiment, ATLAS and CLIC. These sensors can be implemented in commercial HVCMOS processes. HVCMOS sensors feature fast charge collection by drift and high radiation tolerance. The sensor element is an n-well/p-type diode. This proceeding-paper gives an overview of HVCMOS projects and the recent results

  2. The ATLAS Diamond Beam Monitor : Luminosity Detector on the LHC

    CERN Document Server

    Schaefer, Douglas; The ATLAS collaboration

    2015-01-01

    After the first three years of the LHC running the ATLAS experiment extracted it's pixel detector system to refurbish and re-position the optical readout drivers and install a new barrel layer of pixels. The experiment has also taken advantage of this access to also install a set of beam monitoring telescopes with pixel sensors, four each in the forward and backward regions. These telescopes were assembled based on chemical vapour deposited (CVD) diamond sensors to survive in this high radiation environment without needing extensive cooling. This talk will describe the lessons learned in construction and commissioning of the ATLAS x Diamond Beam Monitor (DBM). We will show results from the construction quality assurance tests, commissioning performance, including results from cosmic ray running in early 2015 and also expected first results from LHC run 2 collisions.

  3. The ATLAS Diamond Beam Monitor: Luminosity detector at the LHC

    Science.gov (United States)

    Schaefer, D. M.

    2016-07-01

    After the first three years of the LHC running, the ATLAS experiment extracted its pixel detector system to refurbish and re-position the optical readout drivers and install a new barrel layer of pixels. The experiment has also taken advantage of this access to install a set of beam monitoring telescopes with pixel sensors, four each in the forward and backward regions. These telescopes are based on chemical vapor deposited (CVD) diamond sensors to survive in this high radiation environment without needing extensive cooling. This paper describes the lessons learned in construction and commissioning of the ATLAS Diamond Beam Monitor (DBM). We show results from the construction quality assurance tests and commissioning performance, including results from cosmic ray running in early 2015.

  4. Alignment of the ATLAS Inner Detector Tracking System

    CERN Document Server

    Heller, C; The ATLAS collaboration

    2011-01-01

    ATLAS is one of the multipurpose experiments that records the products of the LHC proton-proton and heavy ion collisions. In order to reconstruct trajectories of charged particles produced in these collisions, ATLAS is equipped with a tracking system built using two different technologies, silicon planar sensors (pixel and microstrips) and drift-tube based detectors. Together they constitute the ATLAS Inner Detector, which is embedded in a 2 T axial field. Efficiently reconstructing tracks from charged particles traversing the detector, and precisely measure their momenta is of crucial importance for physics analyses. In order to achieve its scientific goals, an alignment of the ATLAS Inner Detector is required to accurately determine its more than 700,000 degrees of freedom. The goal of the alignment is set such that the limited knowledge of the sensor locations should not deteriorate the resolution of track parameters by more than 20% with respect to the intrinsic tracker resolution. The implementation of t...

  5. Alignment of the ATLAS Inner Detector Tracking System

    CERN Document Server

    Heller, C; The ATLAS collaboration

    2011-01-01

    ATLAS is one of four multipurpose experiments that records the products of the LHC proton-proton collisions. In order to reconstruct trajectories of charged particles produced in these collisions, ATLAS is equipped with a tracking system built using two different technologies, silicon planar sensors (pixel and microstrips) and drift-tube based detectors. Together they constitute the ATLAS Inner Detector, which is embedded in a 2 T solenoidal field. Efficiently reconstructing tracks from charged particles traversing the detector, and precisely measure their momenta, is of crucial importance for physics analyses. In order to achieve its scientific goals, an alignment of the ATLAS Inner Detector is required to accurately determine its almost 36,000 degrees of freedom. The goal of the alignment is set such that the limited knowledge of the sensor locations should not deteriorate the resolution of track parameters by more than 20% with respect to the intrinsic tracker resolution. The resulting required precision f...

  6. Development of SOI pixel detector in Cracow

    OpenAIRE

    Bugiel, Szymon; Dasgupta, Roma; Glab, Sebastian; Idzik, Marek; Moron, Jakub; Kapusta, Piotr Julian; Kucewicz, Wojciech; Turala, Michal

    2015-01-01

    This paper presents the design of a new monolithic Silicon-On-Insulator pixel sensor in $200~nm$ SOI CMOS technology. The main application of the proposed pixel detector is the spectroscopy, but it can also be used for the minimum ionizing particle (MIP) tracking in particle physics experiments. For this reason few different versions of pixel cells are developed: a source-follower based pixel for tracking, a low noise pixel with preamplifier for spectroscopy, and a self-triggering pixel for t...

  7. ATLAS Recordings

    CERN Multimedia

    Steven Goldfarb; Mitch McLachlan; Homer A. Neal

    Web Archives of ATLAS Plenary Sessions, Workshops, Meetings, and Tutorials from 2005 until this past month are available via the University of Michigan portal here. Most recent additions include the Trigger-Aware Analysis Tutorial by Monika Wielers on March 23 and the ROOT Workshop held at CERN on March 26-27.Viewing requires a standard web browser with RealPlayer plug-in (included in most browsers automatically) and works on any major platform. Lectures can be viewed directly over the web or downloaded locally.In addition, you will find access to a variety of general tutorials and events via the portal.Feedback WelcomeOur group is making arrangements now to record plenary sessions, tutorials, and other important ATLAS events for 2007. Your suggestions for potential recording, as well as your feedback on existing archives is always welcome. Please contact us at wlap@umich.edu. Thank you.Enjoy the Lectures!

  8. SAR Image Complex Pixel Representations

    Energy Technology Data Exchange (ETDEWEB)

    Doerry, Armin W. [Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)

    2015-03-01

    Complex pixel values for Synthetic Aperture Radar (SAR) images of uniform distributed clutter can be represented as either real/imaginary (also known as I/Q) values, or as Magnitude/Phase values. Generally, these component values are integers with limited number of bits. For clutter energy well below full-scale, Magnitude/Phase offers lower quantization noise than I/Q representation. Further improvement can be had with companding of the Magnitude value.

  9. Exploring properties of the integrating pixels

    CERN Document Server

    Kapusta, Piotr Julian; Bugiel, Szymon; Dasgupta, Roma; Glab, Sebastian; Idzik, Marek; Kucewicz, Wojciech; Miyoshi, Toshinobu; Turala, Michal

    2015-01-01

    This paper presents some observations and ideas collected during the tests of the SOI sensors, based on the integration type pixels. First, it contains a rough analysis of the Correlated Double Sampling filtering properties with respect to different noise sources and long sampling intervals, which are typical for the pixels under consideration. Second, results of the pixel leakage current measurements in the pix_2012 and DIPIX pixel detector chips are presented.

  10. Mapping Electrical Crosstalk in Pixelated Sensor Arrays

    Science.gov (United States)

    Seshadri, Suresh (Inventor); Cole, David (Inventor); Smith, Roger M (Inventor); Hancock, Bruce R. (Inventor)

    2013-01-01

    The effects of inter pixel capacitance in a pixilated array may be measured by first resetting all pixels in the array to a first voltage, where a first image is read out, followed by resetting only a subset of pixels in the array to a second voltage, where a second image is read out, where the difference in the first and second images provide information about the inter pixel capacitance. Other embodiments are described and claimed.

  11. CMS has a heart of pixels

    CERN Multimedia

    2003-01-01

    In the immediate vicinity of the collision point, CMS will be equipped with pixel detectors consisting of no fewer than 50 million pixels measuring 150 microns along each side. Each of the pixels, which receive the signal, is connected to its own electronic circuit by a tiny sphere (seen here in the electron microscope image) measuring 15 to 20 microns in diameter.

  12. CVD diamond pixel detectors for LHC experiments

    International Nuclear Information System (INIS)

    This paper reviews the development of CVD diamond pixel detectors. The preparation of the diamond pixel sensors for bump-bonding to the pixel readout electronics for the LHC and the results from beam tests carried out at CERN are described

  13. CVD diamond pixel detectors for LHC experiments

    CERN Document Server

    Wedenig, R; Bauer, C; Berdermann, E; Bergonzo, P; Bogani, F; Borchi, E; Brambilla, A; Bruzzi, Mara; Colledani, C; Conway, J; Dabrowski, W; Delpierre, P A; Deneuville, A; Dulinski, W; van Eijk, B; Fallou, A; Fizzotti, F; Foulon, F; Friedl, M; Gan, K K; Gheeraert, E; Grigoriev, E; Hallewell, G D; Hall-Wilton, R; Han, S; Hartjes, F G; Hrubec, Josef; Husson, D; Kagan, H; Kania, D R; Kaplon, J; Karl, C; Kass, R; Knöpfle, K T; Krammer, Manfred; Lo Giudice, A; Lü, R; Manfredi, P F; Manfredotti, C; Marshall, R D; Meier, D; Mishina, M; Oh, A; Pan, L S; Palmieri, V G; Pernicka, Manfred; Peitz, A; Pirollo, S; Polesello, P; Pretzl, Klaus P; Procario, M; Re, V; Riester, J L; Roe, S; Roff, D G; Rudge, A; Runólfsson, O; Russ, J; Schnetzer, S R; Sciortino, S; Speziali, V; Stelzer, H; Stone, R; Suter, B; Tapper, R J; Tesarek, R J; Trawick, M L; Trischuk, W; Vittone, E; Wagner, A; Walsh, A M; Weilhammer, Peter; White, C; Zeuner, W; Ziock, H J; Zöller, M

    1999-01-01

    This paper reviews the development of CVD diamond pixel detectors. The preparation of the diamond pixel sensors for bump-bonding to the pixel readout electronics for the LHC and the results from beam tests carried out at CERN are described. (9 refs).

  14. CVD diamond pixel detectors for LHC experiments

    Energy Technology Data Exchange (ETDEWEB)

    Wedenig, R.; Adam, W.; Bauer, C.; Berdermann, E.; Bergonzo, P.; Bogani, F.; Borchi, E.; Brambilla, A.; Bruzzi, M.; Colledani, C.; Conway, J.; Dabrowski, W.; Delpierre, P.; Deneuville, A.; Dulinski, W.; Eijk, B. van; Fallou, A.; Fizzotti, F.; Foulon, F.; Friedl, M.; Gan, K.K.; Gheeraert, E.; Grigoriev, E.; Hallewell, G.; Hall-Wilton, R.; Han, S.; Hartjes, F.; Hrubec, J.; Husson, D.; Kagan, H.; Kania, D.; Kaplon, J.; Karl, C.; Kass, R.; Knoepfle, K.T.; Krammer, M.; Logiudice, A.; Lu, R.; Manfredi, P.F.; Manfredotti, C.; Marshall, R.D.; Meier, D.; Mishina, M.; Oh, A.; Pan, L.S.; Palmieri, V.G.; Pernicka, M.; Peitz, A.; Pirollo, S.; Polesello, P.; Pretzl, K.; Procario, M.; Re, V.; Riester, J.L.; Roe, S.; Roff, D.; Rudge, A.; Runolfsson, O.; Russ, J.; Schnetzer, S.; Sciortino, S.; Speziali, V.; Stelzer, H.; Stone, R.; Suter, B.; Tapper, R.J.; Tesarek, R.; Trawick, M.; Trischuk, W.; Vittone, E.; Wagner, A.; Walsh, A.M.; Weilhammer, P.; White, C.; Zeuner, W.; Ziock, H.; Zoeller, M.; Blanquart, L.; Breugnion, P.; Charles, E.; Ciocio, A.; Clemens, J.C.; Dao, K.; Einsweiler, K.; Fasching, D.; Fischer, P.; Joshi, A.; Keil, M.; Klasen, V.; Kleinfelder, S.; Laugier, D.; Meuser, S.; Milgrome, O.; Mouthuy, T.; Richardson, J.; Sinervo, P.; Treis, J.; Wermes, N

    1999-08-01

    This paper reviews the development of CVD diamond pixel detectors. The preparation of the diamond pixel sensors for bump-bonding to the pixel readout electronics for the LHC and the results from beam tests carried out at CERN are described.

  15. The ATLAS Insertable B-Layer Project

    CERN Document Server

    Miucci, A; The ATLAS collaboration

    2014-01-01

    The ATLAS experiment will upgrade its Pixel Detector with the installation of a new pixel layer in 2013-14. The new sub-detector, named Insertable B-layer (IBL), will be installed between the existing Pixel Detector and a new smaller radius beam-pipe at a radius of 3.3 cm. To cope with the high radiation and pixel occupancy due to the proximity to the interaction point, a new read-out chip and two different silicon sensor technologies (planar and 3D) have been de- veloped. Furthermore, the physics performance should be improved through the reduction of pixel size while a low material budget should be imposed. A new mechanical support using lightweight staves and a CO2 based cooling system is used. An overview of the IBL project and the status of the production of staves and the qualification of the assembly procedure, the loaded module electrical integrity and the read-out chain will be presented.

  16. The Upgrade of the ATLAS Inner Detector

    CERN Document Server

    Ferrere, D; The ATLAS collaboration

    2012-01-01

    With the Large Hadron Collider (LHC) successfully collecting data at 7 TeV and even at 8 TeV since April 2012, plans are actively advancing for a series of upgrades in phase with the three long shutdown periods leading to detector improvement. The ATLAS collaboration will upgrade at the next shutdown in 2013-2014 its semiconductor pixel tracking detector with a new Insertable BLayer (IBL) between the existing innermost pixel layer and the vacuum pipe of the LHC. The extreme operating conditions at this location led considering the development of new radiation hard pixel sensor technologies and a new front-end readout chip. The IBL community is currently working for producing modules with silicon planar and 3D technology towards the loading on 14 local stave structures as well as the integration around the beam pipe and in the ATLAS detector. The High-Luminosity LHC (HL-LHC) will eventually increase to about five times the LHC design-luminosity some 10-years from now requiring a complete Inner Detector replace...

  17. The pixel detector for the CMS phase-II upgrade

    International Nuclear Information System (INIS)

    The high luminosity phase of the Large Hadron Collider (HL-LHC) requires a major pixel detector R and D effort to develop both readout chip and sensor that are capable to withstand unprecedented extremely high radiation. The target integrated luminosity of 3000 fb−1, that the HL-LHC is expected to deliver over about 10 years of operation, translates into a hadron fluence of 2×1016 1 MeV eq.n. / cm2, or equivalently 10 MGy of radiation dose in silicon, at about 3 cm from the interaction region where the first layer of the pixel detector could be located. The CMS collaboration has undertaken two baseline sensor R and D programs on thin n-on-p planar and 3D silicon sensor technologies. Together with the ATLAS collaboration it has also been established a common R and D effort for the development of the readout chip in the 65 nm CMOS technology. Status, progresses, and prospects of the CMS R and D effort are presented and discussed in this article

  18. The pixel detector for the CMS phase-II upgrade

    CERN Document Server

    Dinardo, Mauro

    2015-01-01

    The high luminosity phase of the Large Hadron Collider (HL-LHC) requires a major pixel detector R\\&D effort to develop both readout chip and sensor that are capable to withstand unprecedented extremely high radiation. The target integrated luminosity of 3000~fb$^{-1}$, that the HL-LHC is expected to deliver over about 10 years of operation, translates into a hadron fluence of $2\\times10^{16}$~1MeV~eq.n.~/~cm$^2$, or equivalently 10~MGy of radiation dose in silicon, at about 3~cm from the interaction region where the first layer of the pixel detector could be located. The CMS collaboration has undertaken two baseline sensor R\\&D programs on thin n-on-p planar and 3D silicon sensor technologies. Together with the ATLAS collaboration it has also been established a common R\\&D effort for the development of the readout chip in the 65~nm CMOS technology. Status, progresses, and prospects of the CMS R\\&D effort are presented and discussed in this article.

  19. The pixel detector for the CMS phase-II upgrade

    Science.gov (United States)

    Dinardo, M. E.

    2015-04-01

    The high luminosity phase of the Large Hadron Collider (HL-LHC) requires a major pixel detector R&D effort to develop both readout chip and sensor that are capable to withstand unprecedented extremely high radiation. The target integrated luminosity of 3000 fb-1, that the HL-LHC is expected to deliver over about 10 years of operation, translates into a hadron fluence of 2×1016 1 MeV eq.n. / cm2, or equivalently 10 MGy of radiation dose in silicon, at about 3 cm from the interaction region where the first layer of the pixel detector could be located. The CMS collaboration has undertaken two baseline sensor R&D programs on thin n-on-p planar and 3D silicon sensor technologies. Together with the ATLAS collaboration it has also been established a common R&D effort for the development of the readout chip in the 65 nm CMOS technology. Status, progresses, and prospects of the CMS R&D effort are presented and discussed in this article.

  20. Making a trillion pixels dance

    Science.gov (United States)

    Singh, Vivek; Hu, Bin; Toh, Kenny; Bollepalli, Srinivas; Wagner, Stephan; Borodovsky, Yan

    2008-03-01

    In June 2007, Intel announced a new pixelated mask technology. This technology was created to address the problem caused by the growing gap between the lithography wavelength and the feature sizes patterned with it. As this gap has increased, the quality of the image has deteriorated. About a decade ago, Optical Proximity Correction (OPC) was introduced to bridge this gap, but as this gap continued to increase, one could not rely on the same basic set of techniques to maintain image quality. The computational lithography group at Intel sought to alleviate this problem by experimenting with additional degrees of freedom within the mask. This paper describes the resulting pixelated mask technology, and some of the computational methods used to create it. The first key element of this technology is a thick mask model. We realized very early in the development that, unlike traditional OPC methods, the pixelated mask would require a very accurate thick mask model. Whereas in the traditional methods, one can use the relatively coarse approximations such as the boundary layer method, use of such techniques resulted not just in incorrect sizing of parts of the pattern, but in whole features missing. We built on top of previously published domain decomposition methods, and incorporated limitations of the mask manufacturing process, to create an accurate thick mask model. Several additional computational techniques were invoked to substantially increase the speed of this method to a point that it was feasible for full chip tapeout. A second key element of the computational scheme was the comprehension of mask manufacturability, including the vital issue of the number of colors in the mask. While it is obvious that use of three or more colors will give the best image, one has to be practical about projecting mask manufacturing capabilities for such a complex mask. To circumvent this serious issue, we eventually settled on a two color mask - comprising plain glass and etched

  1. Pixelated filters for spatial imaging

    Science.gov (United States)

    Mathieu, Karine; Lequime, Michel; Lumeau, Julien; Abel-Tiberini, Laetitia; Savin De Larclause, Isabelle; Berthon, Jacques

    2015-10-01

    Small satellites are often used by spatial agencies to meet scientific spatial mission requirements. Their payloads are composed of various instruments collecting an increasing amount of data, as well as respecting the growing constraints relative to volume and mass; So small-sized integrated camera have taken a favored place among these instruments. To ensure scene specific color information sensing, pixelated filters seem to be more attractive than filter wheels. The work presented here, in collaboration with Institut Fresnel, deals with the manufacturing of this kind of component, based on thin film technologies and photolithography processes. CCD detectors with a pixel pitch about 30 μm were considered. In the configuration where the matrix filters are positioned the closest to the detector, the matrix filters are composed of 2x2 macro pixels (e.g. 4 filters). These 4 filters have a bandwidth about 40 nm and are respectively centered at 550, 700, 770 and 840 nm with a specific rejection rate defined on the visible spectral range [500 - 900 nm]. After an intense design step, 4 thin-film structures have been elaborated with a maximum thickness of 5 μm. A run of tests has allowed us to choose the optimal micro-structuration parameters. The 100x100 matrix filters prototypes have been successfully manufactured with lift-off and ion assisted deposition processes. High spatial and spectral characterization, with a dedicated metrology bench, showed that initial specifications and simulations were globally met. These excellent performances knock down the technological barriers for high-end integrated specific multi spectral imaging.

  2. PIXEL 2010 - A Résumé

    Science.gov (United States)

    Wermes, N.

    2011-09-01

    The Pixel 2010 conference focused on semiconductor pixel detectors for particle tracking/vertexing as well as for imaging, in particular for synchrotron light sources and XFELs. The big LHC hybrid pixel detectors have impressively started showing their capabilities. X-ray imaging detectors, also using the hybrid pixel technology, have greatly advanced the experimental possibilities for diffraction experiments. Monolithic or semi-monolithic devices like CMOS active pixels and DEPFET pixels have now reached a state such that complete vertex detectors for RHIC and superKEKB are being built with these technologies. Finally, new advances towards fully monolithic active pixel detectors, featuring full CMOS electronics merged with efficient signal charge collection, exploiting standard CMOS technologies, SOI and/or 3D integration, show the path for the future. This résumé attempts to extract the main statements of the results and developments presented at this conference.

  3. Development of SOI pixel detector in Cracow

    CERN Document Server

    Bugiel, Szymon; Glab, Sebastian; Idzik, Marek; Moron, Jakub; Kapusta, Piotr Julian; Kucewicz, Wojciech; Turala, Michal

    2015-01-01

    This paper presents the design of a new monolithic Silicon-On-Insulator pixel sensor in $200~nm$ SOI CMOS technology. The main application of the proposed pixel detector is the spectroscopy, but it can also be used for the minimum ionizing particle (MIP) tracking in particle physics experiments. For this reason few different versions of pixel cells are developed: a source-follower based pixel for tracking, a low noise pixel with preamplifier for spectroscopy, and a self-triggering pixel for time and amplitude measurements. In addition the design of a Successive Approximation Register Analog-to-Digital Converter (SAR ADC) is also presented. A 10-bit SAR ADC is developed for spectroscopic measurements and a lower resolution 6-bit SAR ADC is integrated in the pixel matrix as a column ADC, for tracking applications.

  4. Pixel-Level Domain Transfer

    OpenAIRE

    Yoo, Donggeun; Kim, Namil; Park, Sunggyun; Paek, Anthony S.; Kweon, In So

    2016-01-01

    We present an image-conditional image generation model. The model transfers an input domain to a target domain in semantic level, and generates the target image in pixel level. To generate realistic target images, we employ the real/fake-discriminator in Generative Adversarial Nets, but also introduce a novel domain-discriminator to make the generated image relevant to the input image. We verify our model through a challenging task of generating a piece of clothing from an input image of a dr...

  5. Status of the ATLAS Forward Physics (AFP) project

    Science.gov (United States)

    Chytka, Ladislav; Atlas Collaboration

    2013-04-01

    The ATLAS Forward Physics (AFP) project plans to add a set of detectors - silicon 3D pixel tracking detectors and QUARTIC time of flight detectors - in the forward region of the ATLAS experiment at the LHC. The AFP detectors will be placed around 210 m from the interaction point and are meant to detect protons produced at small angles. The detectors are to be housed in the so called Hamburg beam pipe - a movable beam pipe allowing horizontal movement of the detectors. The AFP is currently under approval with possible installation in 2014/15.

  6. Status of the ATLAS Forward Physics (AFP) Project

    CERN Document Server

    Chytka, L; The ATLAS collaboration

    2012-01-01

    The ATLAS Forward Physics (AFP) project plans to add a set of detectors --- silicon 3D pixel tracking detectors and QUARTIC time of flight detectors --- in the forward region of the ATLAS experiment at the LHC. The AFP detectors will be placed around 210 m from the interaction point and are meant to detect protons produced at small angles. The detectors are to be housed in the so called Hamburg beam pipe --- a movable beam pipe allowing horizontal movement of the detectors. The AFP is currently under approval with possible installation in 2014/15.

  7. Performance of the ATLAS track reconstruction

    CERN Document Server

    Miglioranzi, Silvia; The ATLAS collaboration

    2015-01-01

    Performance of the ATLAS track reconstruction. Run-2 of the LHC will provide new challenges to track and vertex reconstruction with higher energies, denser jets and higher rates. In addition, the Insertable B-layer (IBL) is a fourth pixel layer, which has been inserted at the centre of ATLAS during the shutdown of the LHC. We will discuss improvements to track reconstruction developed during the two year shutdown of the LHC. These include novel techniques developed to improve the performance in the dense cores of jets, optimisation for the expected conditions, and a big software campaign which lead to a factor of three decrease in the CPU time needed to process each recorded event. The commissioning of the detector using cosmic data and, if available, collision data will also be discussed.

  8. ATLAS Recordings

    CERN Multimedia

    Jeremy Herr; Homer A. Neal; Mitch McLachlan

    The University of Michigan Web Archives for the 2006 ATLAS Week Plenary Sessions, as well as the first of 2007, are now online. In addition, there are a wide variety of Software and Physics Tutorial sessions, recorded over the past couple years, to chose from. All ATLAS-specific archives are accessible here.Viewing requires a standard web browser with RealPlayer plug-in (included in most browsers automatically) and works on any major platform. Lectures can be viewed directly over the web or downloaded locally.In addition, you will find access to a variety of general tutorials and events via the portal. Shaping Collaboration 2006The Michigan group is happy to announce a complete set of recordings from the Shaping Collaboration conference held last December at the CICG in Geneva.The event hosted a mix of Collaborative Tool experts and LHC Users, and featured presentations by the CERN Deputy Director General, Prof. Jos Engelen, the President of Internet2, and chief developers from VRVS/EVO, WLAP, and other tools...

  9. Electroweak Physics with ATLAS

    OpenAIRE

    Akhundov, Arif

    2008-01-01

    The precision measurements of electroweak parameters of the Standard Model with the ATLAS detector at LHC are reviewed. An emphasis is put on the bridge connecting the ATLAS measurements with the SM analysis at LEP/SLC and the Tevatron.

  10. Proceedings of PIXEL98 -- International pixel detector workshop

    Energy Technology Data Exchange (ETDEWEB)

    Anderson, D.F.; Kwan, S. [eds.

    1998-08-01

    Experiments around the globe face new challenges of more precision in the face of higher interaction rates, greater track densities, and higher radiation doses, as they look for rarer and rarer processes, leading many to incorporate pixelated solid-state detectors into their plans. The highest-readout rate devices require new technologies for implementation. This workshop reviewed recent, significant progress in meeting these technical challenges. Participants presented many new results; many of them from the weeks--even days--just before the workshop. Brand new at this workshop were results on cryogenic operation of radiation-damaged silicon detectors (dubbed the Lazarus effect). Other new work included a diamond sensor with 280-micron collection distance; new results on breakdown in p-type silicon detectors; testing of the latest versions of read-out chip and interconnection designs; and the radiation hardness of deep-submicron processes.

  11. The Measurement of Spectral Characteristics and Composition of Radiation in ATLAS with MEDIPIX2-USB Devices

    CERN Document Server

    Campbell, M.; Greiffenberg, D.; Heijne, E.; Holy, T.; Idárraga, J.; Jakubek, J.; Král, V.; Králík, M.; Lebel, C.; Leroy, C.; Llopart, X.; Lord, G.; Maneuski, D.; Ouellette, O.; Sochor, V.; Prospísil, S.; Suk, M; Tlustos, L.; Vykydal, Z.; Wilhelm, I.

    2008-01-01

    A network of devices to perform real-time measurements of the spectral characteristics and composition of radiation in the ATLAS detector and cavern during its operation is being built. This system of detectors will be a stand alone system fully capable of delivering real-time images of fluxes and spectral composition of different particle species including slow and fast neutrons. The devices are based on MEDIPIX2 pixel silicon detectors that will be operated via active USB cables and USB-Ethernet extenders through an Ethernet network by a PC located in the USA15 ATLAS control room. The installation of 14 devices inside ATLAS (detector and cavern) is in progress.

  12. Electrical simulation of a DEPFET pixel matrix

    International Nuclear Information System (INIS)

    The Belle II experiment will use two layers of pixel detectors to achieve a good vertex resolution. The two layers will consist of 40 pixel sensors each with roughly 190.000 DEPFET pixels to provide the necessary spatial resolution. In addition to the array of DEPFET pixels steering and read-out ASICs are bump bonded on the pixel sensor. The high luminosity of the Belle-II experiment requires a fast and parallel read-out. The pixel sensor will be read-out in rolling shutter-mode with a row read-out time of 100 ns and a frame time of 20 μs. To find design solutions which allow such short read-out times simulations and measurements of prototypes are performed. The electrical simulations incorporating the ASICs and DEPFET pixel array allow early investigations on the interaction between the chips and the pixel array e.g. the pixel output signal depending on the position of the pixel within the array. In the following a model describing the DEPFETs intrinsic properties like the MOS-FET characteristic, the internal amplification and the reset mechanism as well as parasitic resistive and capacitive elements is presented and simulation results are discussed.

  13. Prototype ATLAS IBL Modules using the FE-I4A Front-End Readout Chip

    CERN Document Server

    Albert, J; Alimonti, Gianluca; Allport, Phil; Altenheiner, Silke; Ancu, Lucian; Andreazza, Attilio; Arguin, Jean-Francois; Arutinov, David; Backhaus, Malte; Bagolini, Alvise; Ballansat, Jacques; Barbero, Marlon; Barbier, Gérard; Bates, Richard; Battistin, Michele; Baudin, Patrick; Beau, Tristan; Beccherle, Roberto; Beck, Hans Peter; Benoit, Mathieu; Bensinger, Jim; Bomben, Marco; Borri, Marcello; Boscardin, Maurizio; Botelho Direito, Jose Antonio; Bousson, Nicolas; Boyd, George Russell Jr; Breugnon, Patrick; Bruni, Graziano; Bruschi, Marco; Buchholz, Peter; Buttar, Craig; Cadoux, Franck; Calderini, Giovanni; Caminada, Leah; Capeans, Mar; Casse, Gianluigi; Catinaccio, Andrea; Cavalli-Sforza, Matteo; Chauveau, Jacques; Chu, Ming-Lee; Ciapetti, Marco; Cindro, Vladimir; Citterio, Mauro; Clark, Allan; Cobal, Marina; Coelli, Simone; Colijn, Auke-Pieter; Colin, Daly; Collot, Johann; Crespo-Lopez, Olivier; Dalla Betta, Gian-Franco; Darbo, Giovanni; DaVia, Cinzia; David, Pierre-Yves; Debieux, Stéphane; Delebecque, Pierre; Devetak, Erik; DeWilde, Burton; Di Girolamo, Beniamino; Dinu, Nicoleta; Dittus, Fridolin; Diyakov, Denis; Djama, Fares; Dobos, Daniel Adam; Doonan, Kate; Dopke, Jens; Dorholt, Ole; Dube, Sourabh; Dushkin, Andrey; Dzahini, Daniel; Egorov, Kirill; Ehrmann, Oswin; Elldge, David; Elles, Sabine; Elsing, Markus; Eraud, Ludovic; Ereditato, Antonio; Eyring, Andreas; Falchieri, Davide; Falou, Aboud; Fang, Xiaochao; Fausten, Camille; Favre, Yannick; Ferrere, Didier; Fleta, Celeste; Fleury, Julien; Flick, Tobias; Forshaw, Dean; Fougeron, Denis; Fritzsch, Thomas; Gabrielli, Alessandro; Gaglione, Renaud; Gallrapp, Christian; Gan, K; Garcia-Sciveres, Maurice; Gariano, Giuseppe; Gastaldi, Thibaut; Gemme, Claudia; Gensolen, Fabrice; George, Matthias; Ghislain, Patrick; Giacomini, Gabriele; Gibson, Stephen; Giordani, Mario Paolo; Giugni, Danilo; Gjersdal, Håvard; Glitza, Karl Walter; Gnani, Dario; Godlewski, Jan; Gonella, Laura; Gorelov, Igor; Gorišek, Andrej; Gössling, Claus; Grancagnolo, Sergio; Gray, Heather; Gregor, Ingrid-Maria; Grenier, Philippe; Grinstein, Sebastian; Gromov, Vladimir; Grondin, Denis; Grosse-Knetter, Jörn; Hansen, Thor-Erik; Hansson, Per; Harb, Ali; Hartman, Neal; Hasi, Jasmine; Hegner, Franziska; Heim, Timon; Heinemann, Beate; Hemperek, Tomasz; Hessey, Nigel; Hetmánek, Martin; Hoeferkamp, Martin; Hostachy, Jean-Yves; Hügging, Fabian; Husi, Coralie; Iacobucci, Giuseppe; Idarraga, John; Ikegami, Yoichi; Janoška, Zdenko; Jansen, Jens; Jansen, Luc; Jensen, Frank; Jentzsch, Jennifer; Joseph, John; Kagan, Harris; Karagounis, Michael; Kass, Richard; Kenney, Christopher J; Kersten, Susanne; Kind, Peter; Klingenberg, Reiner; Kluit, Ruud; Kocian, Martin; Koffeman, Els; Kok, Angela; Korchak, Oleksandr; Korolkov, Ilya; Kostyukhin, Vadim; Krieger, Nina; Krüger, Hans; Kruth, Andre; Kugel, Andreas; Kuykendall, William; La Rosa, Alessandro; Lai, Chung-Hang; Lantzsch, Kerstin; Laporte, Didier; Lapsien, Tobias; Lounis, abdenour; Lozano, Manuel; Lu, Yunpeng; Lubatti, Henry; Macchiolo, Anna; Mallik, Usha; Mandić, Igor; Marchand, Denis; Marchiori, Giovanni; Massol, Nicolas; Matthias, Wittgen; Mättig, Peter; Mekkaoui, Abderrazak; Menouni, Mohsine; Menu, Johann; Meroni, Chiara; Mesa, Javier; Micelli, Andrea; Michal, Sébastien; Miglioranzi, Silvia; Mikuž, Marko; Mitsui, Shingo; Monti, Mauro; Moore, J; Morettini, Paolo; Muenstermann, Daniel; Murray, Peyton; Nellist, Clara; Nelson, David J; Nessi, Marzio; Neumann, Manuel; Nisius, Richard; Nordberg, Markus; Nuiry, Francois-Xavier; Oppermann, Hermann; Oriunno, Marco; Padilla, Cristobal; Parker, Sherwood; Pellegrini, Giulio; Pelleriti, Gabriel; Pernegger, Heinz; Piacquadio, Nicola Giacinto; Picazio, Attilio; Pohl, David; Polini, Alessandro; Popule, Jiří; Portell Bueso, Xavier; Povoli, Marco; Puldon, David; Pylypchenko, Yuriy; Quadt, Arnulf; Quirion, David; Ragusa, Francesco; Rambure, Thibaut; Richards, Erik; Ristic, Branislav; Røhne, Ole; Rothermund, Mario; Rovani, Alessandro; Rozanov, Alexandre; Rubinskiy, Igor; Rudolph, Matthew Scott; Rummler, André; Ruscino, Ettore; Salek, David; Salzburger, Andreas; Sandaker, Heidi; Schipper, Jan-David; Schneider, Basil; Schorlemmer, Andre; Schroer, Nicolai; Schwemling, Philippe; Seidel, Sally; Seiden, Abraham; Šícho, Petr; Skubic, Patrick; Sloboda, Michal; Smith, D; Sood, Alex; Spencer, Edwin; Strang, Michael; Stugu, Bjarne; Stupak, John; Su, Dong; Takubo, Yosuke; Tassan, Jean; Teng, Ping-Kun; Terada, Susumu; Todorov, Theodore; Tomášek, Michal; Toms, Konstantin; Travaglini, Riccardo; Trischuk, William; Troncon, Clara; Troska, Georg; Tsiskaridze, Shota; Tsurin, Ilya; Tsybychev, Dmitri; Unno, Yoshinobu; Vacavant, Laurent; Verlaat, Bart; Vianello, Elisa; Vigeolas, Eric; von Kleist, Stephan; Vrba, Václav; Vuillermet, Raphaël; Wang, Rui; Watts, Stephen; Weber, Michele; Weber, Marteen; Weigell, Philipp; Weingarten, Jens; Welch, Steven David; Wenig, Siegfried; Wermes, Norbert; Wiese, Andreas; Wittig, Tobias; Yildizkaya, Tamer; Zeitnitz, Christian; Ziolkowski, Michal; Zivkovic, Vladimir; Zoccoli, Antonio; Zorzi, Nicola; Zwalinski, Lukasz

    2012-01-01

    The ATLAS Collaboration will upgrade its semiconductor pixel tracking detector with a new Insertable B-layer (IBL) between the existing pixel detector and the vacuum pipe of the Large Hadron Collider. The extreme operating conditions at this location have necessitated the development of new radiation hard pixel sensor technologies and a new front-end readout chip, called the FE-I4. Planar pixel sensors and 3D pixel sensors have been investigated to equip this new pixel layer, and prototype modules using the FE-I4A have been fabricated and characterized using 120 GeV pions at the CERN SPS and 4 GeV positrons at DESY, before and after module irradiation. Beam test results are presented, including charge collection efficiency, tracking efficiency and charge sharing.

  14. Advanced Alignment of the ATLAS Tracking System

    CERN Document Server

    Butti, P; The ATLAS collaboration

    2014-01-01

    In order to reconstruct the trajectories of charged particles, the ATLAS experiment exploits a tracking system built using different technologies, planar silicon modules or microstrips (PIX and SCT detectors) and gaseous drift tubes (TRT), all embedded in a 2T solenoidal magnetic field. Misalignments and deformations of the active detector elements deteriorate the track reconstruction resolution and lead to systematic biases on the measured track parameters. The alignment procedures exploits various advanced tools and techniques in order to determine for module positions and correct for deformations. For the LHC Run II, the system is being upgraded with the installation of a new pixel layer, the Insertable B-layer (IBL).

  15. Atlases: Complex models of geospace

    Directory of Open Access Journals (Sweden)

    Ikonović Vesna

    2005-01-01

    Full Text Available Atlas is modeled contexture contents of treated thematic of space on optimal map union. Atlases are higher form of cartography. Atlases content composition of maps which are different by projection, scale, format methods, contents, usage and so. Atlases can be classified by multi criteria. Modern classification of atlases by technology of making would be on: 1. classical or traditional (printed on paper and 2. electronic (made on electronic media - computer or computer station. Electronic atlases divided in three large groups: view-only electronic atlases, 2. interactive electronic atlases and 3. analytical electronic atlases.

  16. Pixel-clarity-based multifocus image fusion

    Institute of Scientific and Technical Information of China (English)

    Zhenhua Li(李振华); Zhongliang Jing(敬忠良); Shaoyuan Sun(孙韶媛)

    2004-01-01

    @@ Due to the limited depth-of-field of optical lenses,it is difficult to get an image with all objects in focus.One way to overcome this problem is to take several images with different focus points and combine theminto a single composite which contains all the regions full focused.This paper describes a pixel-clarity-based multifocus image fusion algorithm.The characteristic of this approach is that the pixels of the fusedimage are selected from the clearest pixels in the input images according to pixel clarity criteria.For eachpixel in the source images,the pixel clarity is calculated.The fusion procedure is performed by a selectionmode according to the magnitude of pixel clarity.Consistency verification is performed on the selectedpixels.Experiments show that the proposed algorithm works well in multifocus image fusion.

  17. Advanced pixel architectures for scientific image sensors

    CERN Document Server

    Coath, R; Godbeer, A; Wilson, M; Turchetta, R

    2009-01-01

    We present recent developments from two projects targeting advanced pixel architectures for scientific applications. Results are reported from FORTIS, a sensor demonstrating variants on a 4T pixel architecture. The variants include differences in pixel and diode size, the in-pixel source follower transistor size and the capacitance of the readout node to optimise for low noise and sensitivity to small amounts of charge. Results are also reported from TPAC, a complex pixel architecture with ~160 transistors per pixel. Both sensors were manufactured in the 0.18μm INMAPS process, which includes a special deep p-well layer and fabrication on a high resistivity epitaxial layer for improved charge collection efficiency.

  18. Region based elimination of noise pixels towards optimized classifier models for skin pixel detection

    OpenAIRE

    Gagandeep Kaur; Seema Pahwa

    2015-01-01

    The extraction of the skin pixels in a human image and rejection of non-skin pixels is called the skin segmentation. Skin pixel detection is the process of extracting the skin pixels in a human image which is typically used as a pre-processing step to extract the face regions from human image. In past, there are several computer vision approaches and techniques have been developed for skin pixel detection. In the process of skin detection, given pixels are been transformed into an...

  19. Equivalence of a Bit Pixel Image to a Quantum Pixel Image

    Science.gov (United States)

    Ortega, Laurel Carlos; Dong, Shi-Hai; Cruz-Irisson, M.

    2015-11-01

    We propose a new method to transform a pixel image to the corresponding quantum-pixel using a qubit per pixel to represent each pixels classical weight in a quantum image matrix weight. All qubits are linear superposition, changing the coefficients level by level to the entire longitude of the gray scale with respect to the base states of the qubit. Classically, these states are just bytes represented in a binary matrix, having code combinations of 1 or 0 at all pixel locations. This method introduces a qubit-pixel image representation of images captured by classical optoelectronic methods. Supported partially by the project 20150964-SIP-IPN, Mexico

  20. Infrared astronomy - Pixels to spare

    International Nuclear Information System (INIS)

    An infrared CCD camera containing an array with 311,040 pixels arranged in 486 rows of 640 each is tested. The array is a chip of platinum silicide (PtSi), sensitive to photons with wavelengths between 1 and 6 microns. Observations of the Hubble Space Telescope, Mars, Pluto and moon are reported. It is noted that the satellite's twin solar-cell arrays, at an apparent separation of about 1 1/4 arc second, are well resolved. Some two dozen video frames were stacked to make each presented image of Mars at 1.6 microns; at this wavelength Mars appears much as it does in visible light. A stack of 11 images at a wavelength of 1.6 microns is used for an image of Jupiter with its Great Red Spot and moons Io and Europa

  1. Infrared astronomy - Pixels to spare

    Science.gov (United States)

    McCaughrean, Mark

    1991-07-01

    An infrared CCD camera containing an array with 311,040 pixels arranged in 486 rows of 640 each is tested. The array is a chip of platinum silicide (PtSi), sensitive to photons with wavelengths between 1 and 6 microns. Observations of the Hubble Space Telescope, Mars, Plato, and moon are reported. It is noted that the satellite's twin solar-cell arrays, at an apparent separation of about 1 1/4 arc second, are well resolved. Some two dozen video frames were stacked to make each presented image of Mars at 1.6 microns; at this wavelength Mars appears much as it does in visible light. A stack of 11 images at a wavelength of 1.6 microns is used for an image of Jupiter with its Great Red Spot and moons Io and Europa.

  2. Advanced alignment of the ATLAS tracking system

    CERN Document Server

    Butti, Pierfrancesco; The ATLAS collaboration

    2014-01-01

    In order to reconstruct the trajectories of charged particles, the ATLAS experiment exploits a tracking system built using different technologies, silicon planar modules or microstrips (PIX and SCT detectors) and gaseous drift tubes (TRT), all embedded in a 2T solenoidal magnetic field. Misalignments of the active detector elements and deformations of the structures (which can lead to \\textit{Weak Modes}) deteriorate resolution of the track reconstruction and lead to systematic biases on the measured track parameters. The applied alignment procedures exploit various advanced techniques in order to minimise track-hit residuals and remove detector deformations. For the LHC Run II, the Pixel Detector has been refurbished and upgraded with the installation of a new pixel layer, the Insertable B-layer (IBL).

  3. Performance of the ATLAS vertex detector

    CERN Document Server

    Barberis, D

    1999-01-01

    The ATLAS inner detector consists of three layers of silicon pixels, four double layers of silicon microstrips and a transition radiation tracker (straw tubes). The good performance of the track and vertex reconstruction algorithms is a direct consequence of the small radius (4.3, 10.1 and 13.2 cm), fine pitch (50*300 mu m) and low occupancy (<3*10/sup -4/ at design luminosity) of the pixel detectors. The full (GEANT3) detector simulation is used to evaluate the performance of the detector and of the reconstruction algorithms. Results are presented on track and vertex reconstruction efficiencies and resolutions, and on the separation between b-jets and jets produced by light quarks. (8 refs).

  4. Optimisation de la Performance Thermique du Détecteur Pixel Alpine

    CERN Document Server

    Zhang, Zhan

    The ATLAS (A Toroidal LHC ApparatuS) detector is the largest detector of the Large Hadron Collider (LHC). One of the most important goals of ATLAS was to search for the missing piece of the Standard Model, the Higgs boson that had been found in 2012. In order to keep looking for the unknowns, it is planned to upgrade the LHC. The High Luminosity LHC (HL-LHC) is a novel configuration of the accelerator, aiming at increasing the luminosity by a factor five or more above the nominal LHC design. In parallel with the accelerator upgrade also the ATLAS will be upgraded to cope with detector aging and to achieve the same or better performance under increased event rate and radiation dose expected at the HL-LHC. This thesis discusses a novel design for the ATLAS Pixel Detector called the "Alpine" layout for the HL-LHC. To support this design, a local support structure is proposed, optimized and tested with an advanced CO2 evaporative cooling system. A numerical program called “CoBra” simulating the twophase heat ...

  5. Performance tests during the ATLAS IBL Stave Integration

    International Nuclear Information System (INIS)

    In preparation of the ATLAS Pixel Insertable B-Layer integration, detector components, so called staves, were mounted around the Beryllium ATLAS beam pipe and tested using production quality assurance measurements as well as dedicated data taking runs to validate a correct grounding and shielding schema. Each stave consists of 32 new generation readout chips which sum up to over 860k pixels per stave. The integration tests include verification that neither the silicon planar n+-in-n nor the silicon 3D sensors were damaged by mechanical stress, and that their readout chips, including their bump-bond and wire-bond connections, did not suffer from the integration process. Evolution of the detector performance during its integration will be discussed as well as its final performance before installation

  6. The ATLAS IBL BOC Demonstrator

    CERN Document Server

    Ancu, J; The ATLAS collaboration; Falchieri, D; Flick, T; Gabrielli, A; Grosse-Knetter, J; Heim, T; Joseph, J; Krieger, N; Kugel, A; Morettini, P; Neumann, M; Polini, A; Schneider, B; Schroer, N

    2011-01-01

    The Insertable-B-Layer (IBL) is a new pixel detector layer to be installed at the ATLAS experiment at the LHC, CERN in 2013. It will be integrated into the general pixel readout and software framework, hence the off-detector readout electronics has to support the new front-end electronics whilst maintaining a high degree of interoperability to the components of the existing system. The off-detector readout is realised using a number of VME card pairs – ROD and BOC – plus a VME crate controller and a custom timing distribution system. The main elements of the new BOC design comprise optical interfaces towards the detector, signal conditioning and data recovery logic. We present the demonstrator used to verify the design approach. The demonstrator is based on a XILINX SP605 FPGA evaluation board and uses a Microblaze processor inside the FPGA to provide easy and flexible access to all essential BOC functions and the corresponding emulator modules, which enable full test of the entire BOC functionality even ...

  7. The ALICE Silicon Pixel Detector System (SPD)

    CERN Document Server

    Kluge, A; Antinori, Federico; Burns, M; Cali, I A; Campbell, M; Caselle, M; Ceresa, S; Dima, R; Elias, D; Fabris, D; Krivda, Marian; Librizzi, F; Manzari, Vito; Morel, M; Moretto, Sandra; Osmic, F; Pappalardo, G S; Pepato, Adriano; Pulvirenti, A; Riedler, P; Riggi, F; Santoro, R; Stefanini, G; Torcato De Matos, C; Turrisi, R; Tydesjo, H; Viesti, G; PH-EP

    2007-01-01

    The ALICE silicon pixel detector (SPD) comprises the two innermost layers of the ALICE inner tracker system. The SPD includes 120 detector modules (half-staves) each consisting of 10 ALICE pixel chips bump bonded to two silicon sensors and one multi-chip read-out module. Each pixel chip contains 8192 active cells, so that the total number of pixel cells in the SPD is ≈ 107. The on-detector read-out is based on a multi-chip-module containing 4 ASICs and an optical transceiver module. The constraints on material budget and detector module dimensions are very demanding.

  8. Overview of the ATLAS Insertable B-Layer (IBL) Project

    CERN Document Server

    Rohne, O; The ATLAS collaboration

    2012-01-01

    The upgrades for the ATLAS Pixel Detector will be staged in preparation for high luminosity LHC. The first upgrade for the Pixel Detector is the construction of a new pixel layer which will be installed during the first shutdown of the LHC machine, in 2013-14. The new detector, called the Insertable B-layer (IBL), will be installed between the existing Pixel Detector and a new, smaller radius beam-pipe at a radius of 3.3 cm. The IBL has required the development of several new technologies to cope with increased radiation and pixel occupancy and also to improve the physics performance through reduction of the pixel size and a more stringent material budget. The IBL presents several changes to the design of the present hybrid pixel system: two different and promising silicon sensor technologies, planar n-in-n and 3D, will be used for the IBL. A new read-out chip FE-I4 has been designed in 130 nm technology, the material budget is minimized by using new lightweight mechanical support materials and a CO2 based co...

  9. EnviroAtlas - Phoenix, AZ - Atlas Area Boundary

    Data.gov (United States)

    U.S. Environmental Protection Agency — This EnviroAtlas dataset shows the boundary of the Phoenix, AZ Atlas Area. It represents the outside edge of all the block groups included in the EnviroAtlas Area....

  10. EnviroAtlas - Portland, OR - Atlas Area Boundary

    Data.gov (United States)

    U.S. Environmental Protection Agency — This EnviroAtlas dataset shows the boundary of the Portland, OR Atlas Area. It represents the outside edge of all the block groups included in the EnviroAtlas Area....

  11. The LHC Luminosity Upgrade and Related ATLAS Detector Plans

    CERN Document Server

    Hartjes, F; The ATLAS collaboration

    2009-01-01

    3rd draft of the proposed talk about Atlas Upgrade for MPGD2009 (Instrumentation conference on gaseous pixel detectors) on Friday June 12, 2009. I concentrated my presentation on the upgrade plans and schedule of the LHC and on detector technologies for the new Inner Tracker, putting less emphasis on other subdetectors. Compared to the 2nd draft I modified and clarified a few items about trigger, muon detection and calorimetry and did a number of cosmetic adaptions.

  12. The ATLAS Insertable B-Layer

    CERN Document Server

    Alkire, S P; The ATLAS collaboration

    2014-01-01

    During the first shutdown of LHC, the ATLAS detector is undergoing an upgrade of the Pixel Detector in preparation for high luminosity LHC. This upgrade consists of a new pixel layer, called the Insertable B-Layer (IBL), which is positioned between the former inner layer of the Pixel Detector (B-Layer) and a new, smaller, beam pipe, at a radial distance of 3.3 cm from the beam axis. The realization of the IBL required the development of several new technologies and solutions in order to overcome the challenges introduced by the extreme environment and working conditions, such as the high radiation levels, the high pixel occupancy and the need of an exceptionally low material budget. Two silicon sensor technologies have been adopted for the IBL modules: planar n-in-n and 3D. Both of these are connected via bump bonding to the new generation 130 nm IBM CMOS FE-I4 front-end read-out chip. An overview of the IBL project, module design, the qualification tests, data acquisition, results and performance is presente...

  13. ATLAS Distributed Computing Automation

    CERN Document Server

    Schovancova, J; The ATLAS collaboration; Borrego, C; Campana, S; Di Girolamo, A; Elmsheuser, J; Hejbal, J; Kouba, T; Legger, F; Magradze, E; Medrano Llamas, R; Negri, G; Rinaldi, L; Sciacca, G; Serfon, C; Van Der Ster, D C

    2012-01-01

    The ATLAS Experiment benefits from computing resources distributed worldwide at more than 100 WLCG sites. The ATLAS Grid sites provide over 100k CPU job slots, over 100 PB of storage space on disk or tape. Monitoring of status of such a complex infrastructure is essential. The ATLAS Grid infrastructure is monitored 24/7 by two teams of shifters distributed world-wide, by the ATLAS Distributed Computing experts, and by site administrators. In this paper we summarize automation efforts performed within the ATLAS Distributed Computing team in order to reduce manpower costs and improve the reliability of the system. Different aspects of the automation process are described: from the ATLAS Grid site topology provided by the ATLAS Grid Information System, via automatic site testing by the HammerCloud, to automatic exclusion from production or analysis activities.

  14. Ceres Survey Atlas derived from Dawn Framing Camera images

    Science.gov (United States)

    Roatsch, Th.; Kersten, E.; Matz, K.-D.; Preusker, F.; Scholten, F.; Jaumann, R.; Raymond, C. A.; Russell, C. T.

    2016-02-01

    The Dawn Framing Camera (FC) acquired almost 900 clear filter images of Ceres with a resolution of about 400 m/pixels during the seven cycles in the Survey orbit in June 2015. We ortho-rectified 42 images from the third cycle and produced a global, high-resolution, controlled mosaic of Ceres. This global mosaic is the basis for a high-resolution Ceres atlas that consists of 3 tiles mapped at a scale of 1:2,000,000. The nomenclature used in this atlas was proposed by the Dawn team and was approved by the International Astronomical Union (IAU). The whole atlas is available to the public through the Dawn GIS web page.

  15. Charged track reconstruction and b-tagging performance in ATLAS

    CERN Document Server

    Favareto, A; The ATLAS collaboration

    2012-01-01

    The ATLAS Inner Detector is designed to provide precision tracking informa- tion at LHC luminosities with a hermetic detector covering 5 units in pseudo- rapidity. It features a large silicon tracker subdivided into a pixel and a strip system for precise tracking and primary/secondary vertex reconstruction and to provide excellent b-tagging capabilities. A Transition Radiation Tracker improves the momentum reconstruction and provides electron identification information. The subject of these proceedings is the performance of the ATLAS Inner Detector achieved after its first 2 years of operation. The excellent detector performance and more than a decade of simulation studies provided a good basis for the commissioning of the offline track and vertex reconstruction. Early studies with cosmic events and the ever increasing amount of high quality p-p collision data allowed for rapid progress in understanding of the detector. Today the ATLAS Inner Detector approaches its design values in most relevant performance c...

  16. Pixelated CdZnTe drift detectors

    DEFF Research Database (Denmark)

    Kuvvetli, Irfan; Budtz-Jørgensen, Carl

    2005-01-01

    report on the performance of 3 mm thick prototype CZT drift pixel detectors fabricated using material from eV-products. We discuss issues associated with detector module performance. Characterization results obtained from several prototype drift pixel detectors are presented. Results of position...

  17. ISPA (imaging silicon pixel array) experiment

    CERN Multimedia

    Patrice Loïez

    2002-01-01

    The bump-bonded silicon pixel detector, developed at CERN by the EP-MIC group, is shown here in its ceramic carrier. Both represent the ISPA-tube anode. The chip features between 1024 (called OMEGA-1) and 8196 (ALICE-1) active pixels.

  18. Cooling Tests for the Silion Pixel Detectors

    CERN Document Server

    Pepato, Adriano; CERN. Geneva; Giarin, M; Antinori, Federico; Carrer, N; Morando, M; Soramel, F; Segato, G F; Turrisi, R; Scarlassara, F

    2000-01-01

    Abstract Cooling tests have been performed on dummy prototypes of the Silicon Pixel Detector ladders of the Inner Tracking System of ALICE, in order to assess the merits of the proposed cooling schemes. The tests provide insight into the problems of cooling of the pixel detectors and also yield experimental parameters necessary for a numerical simulation.

  19. 3D-FBK pixel sensors with CMS readout: First test results

    Energy Technology Data Exchange (ETDEWEB)

    Obertino, M., E-mail: margherita.obertino@cern.ch [Università del Piemonte Orientale, Novara, and INFN, Torino (Italy); Solano, A. [Università di Torino and INFN, Torino (Italy); Vilela Pereira, A. [INFN, Torino (Italy); Alagoz, E. [Physics Department, Purdue University, West Lafayette, IN (United States); Andresen, J. [Colorado University, Colorado (United States); Arndt, K.; Bolla, G.; Bortoletto, D. [Physics Department, Purdue University, West Lafayette, IN (United States); Boscardin, M. [Centro per i Materiali e i Microsistemi Fondazione Bruno Kessler (FBK), Povo di Trento (Italy); Brosius, R. [SUNY, Buffalo (United States); Bubna, M. [Physics Department, Purdue University, West Lafayette, IN (United States); Dalla Betta, G.-F. [INFN Padova (Gruppo Collegato di Trento) and Università di Trento, Povo di Trento (Italy); Jensen, F. [Colorado University, Colorado (United States); Krzywda, A. [Physics Department, Purdue University, West Lafayette, IN (United States); Kumar, A. [SUNY, Buffalo (United States); Kwan, S. [Università di Milano Bicocca and INFN, Milano (Italy); Lei, C.M. [Colorado University, Colorado (United States); Menasce, D.; Moroni, L. [INFN Milano Bicocca, Milano (Italy); Ngadiuba, J. [Università di Milano Bicocca and INFN, Milano (Italy); and others

    2013-08-01

    Silicon 3D detectors consist of an array of columnar electrodes of both doping types which penetrate entirely in the detector bulk, perpendicularly to the surface. They are emerging as one of the most promising technologies for innermost layers of tracking devices for the foreseen upgrades of the LHC. Until recently, properties of 3D sensors have been investigated mostly with ATLAS readout electronics. 3D pixel sensors compatible with the CMS readout were first fabricated at SINTEF (Oslo, Norway), and more recently at FBK (Trento, Italy) and CNM (Barcelona, Spain). Several sensors with different electrode configurations, bump-bonded with the CMS pixel PSI46 readout chip, were characterized in laboratory and tested at Fermilab with a proton beam of 120 GeV/c. Preliminary results of the data analysis are presented.

  20. Firmware development and testing of the ATLAS IBL Back-Of-Crate card

    CERN Document Server

    Wensing, M; The ATLAS collaboration; Mättig, P; Kugel, A; Falchieri, D; Travaglini, R; Gabrielli, A; Heim, T; Potamianos, K; Grosse-Knetter, J; Bindi, M

    2014-01-01

    For the new innermost layer of the ATLAS Pixel-Detector at CERN new off-detector hardware needs to be developed. The Back-Of-Crate card (BOC) is driving the optical interface to the detector and distributing the LHC clock to all detector components. A brief overview of the firmware and test results from production and system test will be presented.

  1. 3D sensors for the Insertable B-Layer of the ATLAS experiment at the CERN LHC

    CERN Document Server

    Micelli, Andrea; Gemme, Claudia

    The work is centered on the 3D Silicon sensors proposed for the Pixel Detector upgrade of the ATLAS experimen at the ATLAS LHC. After an introduction about the ugrade project, the first laboratory measurement results for the characterization of the sensors performance with the read-out electronics are presented. This, together with the beam tests described in the last part, has represented an important step in the study of the sensor performance

  2. ATLAS welcomes a new Palestinian student

    CERN Multimedia

    Antonella Del Rosso

    2014-01-01

    Mahmoud Ibrahim Alstaty, from near Jenin, is starting a PhD studentship at CERN, where he will be working on the new inner layer of the ATLAS pixel detector. He joins a growing number of other Palestinian researchers who are working at CERN.   Mahmoud Ibrahim Alstaty. Mahmoud Alstaty's PhD scholarship is supported by the Sharing Knowledge Foundation. In 2013, Robert Klapisch, president of the foundation and former Director of Research at CERN, signed a framework agreement with CERN to open the Doctoral Student programme to countries from the Middle East and North Africa (MENA). Mahmoud is the second student to benefit from such an opportunity, following Mohamed Gouighri from Morocco. “Mahmoud will work on the ATLAS experiment on the commissioning and performance of the new inner layer of the pixel detector (IBL) and on the search for new physics, including leptons in the final state, under the supervision of Fares Djama and myself”, says Pascal Pralavorio from Cen...

  3. Fabrication of a high-density MCM-D for a pixel detector system using a BCB/Cu technology

    CERN Document Server

    Topper, M; Engelmann, G; Fehlberg, S; Gerlach, P; Wolf, J; Ehrmann, O; Becks, K H; Reichl, H

    1999-01-01

    The MCM-D which is described here is a prototype for a pixel detector system for the planned Large Hadron Collider (LHC) at CERN, Geneva. The project is within the ATLAS experiment. The module consists of a sensor tile with an active area of 16.4 mm*60.4 mm, 16 readout chips, each serving 24*160 pixel unit cells, a module controller chip, an optical transceiver and the local signal interconnection and power distribution buses. The extremely high wiring density which is necessary to interconnect the readout chips was achieved using a thin film copper/photo-BCB process above the pixel array. The bumping of the readout chips was done by PbSn electroplating. All dice are then attached by flip-chip assembly to the sensor diodes and the local buses. The focus of this paper is a detailed description of the technologies for the fabrication of this advanced MCM-D. (10 refs).

  4. Optimization of radiation hardness and charge collection of edgeless silicon pixel sensors for photon science

    CERN Document Server

    Zhang, Jiaguo; Pennicard, David; Sarajlic, Milija; Graafsma, Heinz

    2014-01-01

    Recent progress in active-edge technology of silicon sensors enables the development of large-area tiled silicon pixel detectors with small dead space between modules by utilizing edgeless sensors. Such technology has been proven in successful productions of ATLAS and Medipix-based silicon pixel sensors by a few foundries. However, the drawbacks of edgeless sensors are poor radiation hardness for ionizing radiation and non-uniform charge collection by edge pixels. In this work, the radiation hardness of edgeless sensors with different polarities has been investigated using Synopsys TCAD with X-ray radiation-damage parameters implemented. Results show that if no conventional guard ring is present, none of the current designs are able to achieve a high breakdown voltage (typically < 30 V) after irradiation to a dose of ~10 MGy. In addition, a charge-collection model has been developed and was used to calculate the charges collected by the edge pixels of edgeless sensors when illuminated with X-rays. The mode...

  5. Entwurf und Implementation eines Expertensystems für das Detektorkontrollsystem des ATLAS-Pixeldetektors

    CERN Document Server

    Henß, Tobias

    This thesis describes the design and implementation of an Expert System for the Detector Control System of the ATLAS Pixel Detector at the European center for particle physics, CERN. The ATLAS-Experiment is one of four big experiments installed at the Large Hadron Collider and is itself composed of multiple particle detectors. The innermost of these sub-detectors is the ATLAS Pixel detector, whose more than 30000 operating parameters impose high requirements on the hard- and software of the Detector Control System. In order to support the shift personnel during regular detector operation, an Expert System for the Detector Control System, which provides troubleshooting instructions, was developed within the scope of this work. To allow for a precise mapping of the available human experts knowledge to the Expert System, a rule based and easily adaptable system was designed. The use of the DIM protocol furthermore enables the adoption for other detectors or the data acquisition system. Special emphasis was pu...

  6. Alignment of the ATLAS Inner Detector in the LHC Run II

    CERN Document Server

    Barranco Navarro, Laura; The ATLAS collaboration

    2015-01-01

    ATLAS physics goals require excellent resolution, unbiased measurement of all charged particle kinematic parameters. These critically depend on the layout and performance of the tracking system and on the quality of its offline alignment. ATLAS is equipped with a tracking system built using different technologies, silicon planar sensors (pixel and micro-strip) and gaseous drift- tubes, all embedded in a 2T solenoidal magnetic field. For the Run II of the LHC, the system was upgraded with the installation of a new pixel layer, the Insertable B-layer (IBL). An outline of the track based alignment approach and its implementation within the ATLAS software will be presented. Special attention will be paid to integration of the IBL into the alignment framework, techniques allowing to identify and eliminate tracking systematics as well as strategies to deal with time-dependent alignment. Performance from the commissioning of Cosmic data and potentially early LHC Run II proton-proton collisions will be discussed.

  7. The ATLAS Analysis Model

    CERN Multimedia

    Amir Farbin

    The ATLAS Analysis Model is a continually developing vision of how to reconcile physics analysis requirements with the ATLAS offline software and computing model constraints. In the past year this vision has influenced the evolution of the ATLAS Event Data Model, the Athena software framework, and physics analysis tools. These developments, along with the October Analysis Model Workshop and the planning for CSC analyses have led to a rapid refinement of the ATLAS Analysis Model in the past few months. This article introduces some of the relevant issues and presents the current vision of the future ATLAS Analysis Model. Event Data Model The ATLAS Event Data Model (EDM) consists of several levels of details, each targeted for a specific set of tasks. For example the Event Summary Data (ESD) stores calorimeter cells and tracking system hits thereby permitting many calibration and alignment tasks, but will be only accessible at particular computing sites with potentially large latency. In contrast, the Analysis...

  8. It's not the pixel count, you fool

    Science.gov (United States)

    Kriss, Michael A.

    2012-01-01

    The first thing a "marketing guy" asks the digital camera engineer is "how many pixels does it have, for we need as many mega pixels as possible since the other guys are killing us with their "umpteen" mega pixel pocket sized digital cameras. And so it goes until the pixels get smaller and smaller in order to inflate the pixel count in the never-ending pixel-wars. These small pixels just are not very good. The truth of the matter is that the most important feature of digital cameras in the last five years is the automatic motion control to stabilize the image on the sensor along with some very sophisticated image processing. All the rest has been hype and some "cool" design. What is the future for digital imaging and what will drive growth of camera sales (not counting the cell phone cameras which totally dominate the market in terms of camera sales) and more importantly after sales profits? Well sit in on the Dark Side of Color and find out what is being done to increase the after sales profits and don't be surprised if has been done long ago in some basement lab of a photographic company and of course, before its time.

  9. Heavy Ion Physics at the ATLAS Detector

    CERN Document Server

    Takai, H; The ATLAS collaboration

    2009-01-01

    The ATLAS detector is one of the two large detectors built to carry on high pT physics  at the Large Hadron Collider. The detector is designed to perform optimally at the challenging nominal LHC machine luminosity of 10^34 cm-2s-1. ATLAS has a finely segmented electromagnetic and hadronic calorimeters covering 10 units of rapidity. The inner tracking system is composed of  sicilicon pixel detector, silicon central tracker, transition radiation tracker and a 2T solenoidal magnet, covering 5 units of rapidity. The muon spectrometer is located outside the calorimeter volume. Muon chambers and air core toroids are used to track muons of momentum larger than 4 GeV.  The ATLAS detector has a superb performance for jet physics because of its calorimeters. Simulation studies also indicate that it will be possible to tag b-jets in the heavy ion environment. Upsilon and J/Psi can be reconstructed through the di-muon decay channel. The detector is ideal for the study of global variables, namely total energy flow and ...

  10. Optimization of radiation hardness and charge collection of edgeless silicon pixel sensors for photon science

    International Nuclear Information System (INIS)

    Recent progress in active-edge technology of silicon sensors enables the development of large-area tiled silicon pixel detectors with small dead space between modules by utilizing edgeless sensors. Such technology has been proven in successful productions of ATLAS and Medipix-based silicon pixel sensors by a few foundries. However, the drawbacks of edgeless sensors are poor radiation hardness for ionizing radiation and non-uniform charge collection by edge pixels. In this work, the radiation hardness of edgeless sensors with different polarities has been investigated using Synopsys TCAD with X-ray radiation-damage parameters implemented. Results show that if no conventional guard ring is present, none of the current designs are able to achieve a high breakdown voltage (typically < 30 V) after irradiation to a dose of ∼ 10 MGy. In addition, a charge-collection model has been developed and was used to calculate the charges collected by the edge pixels of edgeless sensors when illuminated with X-rays. The model takes into account the electric field distribution inside the pixel sensor, the absorption of X-rays, drift and diffusion of electrons and holes, charge sharing effects, and threshold settings in ASICs. It is found that the non-uniform charge collection of edge pixels is caused by the strong bending of the electric field and the non-uniformity depends on bias voltage, sensor thickness and distance from active edge to the last pixel (''edge space). In particular, the last few pixels close to the active edge of the sensor are not sensitive to low-energy X-rays ( < 10 keV), especially for sensors with thicker Si and smaller edge space. The results from the model calculation have been compared to measurements and good agreement was obtained. The model can be used to optimize the edge design. From the edge optimization, it is found that in order to guarantee the sensitivity of the last few pixels to low-energy X-rays, the edge space should be kept at

  11. The Irish Wind Atlas

    Energy Technology Data Exchange (ETDEWEB)

    Watson, R. [Univ. College Dublin, Dept. of Electronic and Electrical Engineering, Dublin (Ireland); Landberg, L. [Risoe National Lab., Meteorology and Wind Energy Dept., Roskilde (Denmark)

    1999-03-01

    The development work on the Irish Wind Atlas is nearing completion. The Irish Wind Atlas is an updated improved version of the Irish section of the European Wind Atlas. A map of the irish wind resource based on a WA{sup s}P analysis of the measured data and station description of 27 measuring stations is presented. The results of previously presented WA{sup s}P/KAMM runs show good agreement with these results. (au)

  12. Pixel Hit Reconstruction with the CMS Detector

    CERN Document Server

    Giurgiu, Gavril; Maksimovic, P; Swartz, M

    2008-01-01

    We present a new technique for pixel hit reconstruction with the CMS pixel detector. The technique is based on fitting the pixel cluster projections to templates obtained using a detailed simulation called Pixelav. Pixelav successfully describes the profiles of clusters measured in beam tests of radiation-damaged sensors. Originally developed to optimally estimate the coordinates of hits after the radiation damage, the technique has superior performance before irradiation as well, reducing the resolution tails of reconstructed track parameters and significantly reducing the light quark background of tagged b-quarks. It is the only technique currently available to simulate hits from a radiation-damaged detector.

  13. Pixel detectors from fundamentals to applications

    CERN Document Server

    Rossi, Leonardo; Rohe, Tilman; Wermes, Norbert

    2006-01-01

    Pixel detectors are a particularly important class of particle and radiation detection devices. They have an extremely broad spectrum of applications, ranging from high-energy physics to the photo cameras of everyday life. This book is a general purpose introduction into the fundamental principles of pixel detector technology and semiconductor-based hybrid pixel devices. Although these devices were developed for high-energy ionizing particles and radiation beyond visible light, they are finding new applications in many other areas. This book will therefore benefit all scientists and engineers working in any laboratory involved in developing or using particle detection.

  14. The ATLAS Insertable B-Layer (IBL) Project

    CERN Document Server

    Bilbao de Mendizabal, J; The ATLAS collaboration

    2012-01-01

    The upgrades for the ATLAS Pixel Detector will be staged in preparation for high luminosity LHC. The Pixel detector upgrade will start with the construction of a new layer which will be installed during the first shutdown of the LHC machine, in 2013-14. The new sub-detector, called the Insertable B-layer (IBL), will be installed between the existing Pixel Detector and a new smaller radius beam-pipe at a radius of 3.3 cm. To cope with the hight radiation and pixel occupancy due to the proximity to the interaction point, the development of several new technologies has been required. The IBL design, which is different to the current pixel design, is using a new read-out chip FE-I4 designed in 130 nm technology, and two different and promising silicon sensor technologies, planar n-in-n and 3D. Furthermore, the physics performance should be improved through the reduction of pixel size while targeting for a low material budget should be imposed, pushing for a new mechanical support using lightweight staves and a CO...

  15. Overview of the ATLAS Insertable B-Layer (IBL) Project

    CERN Document Server

    Pohl, D-L; The ATLAS collaboration

    2013-01-01

    The upgrades for the ATLAS Pixel Detector will be staged in preparation for high luminosity LHC. The first upgrade for the Pixel Detector will be the construction of a new pixel layer which is currently under construction and will be installed during the first shutdown of the LHC machine, in 2013-14. The new detector, called the Insertable B-layer (IBL), will be installed between the existing Pixel Detector and a new, smaller radius beam-pipe at a radius of 3.3 cm. The IBL required the development of several new technologies to cope with increased radiation and pixel occupancy and also to improve the physics performance through reduction of the pixel size and a more stringent material budget. Two different silicon sensor technologies, planar n-in-n and 3D, will be used, connected with the new generation 130nm IBM CMOS FE-I4 readout chip via solder bump-bonds. 32 FEs with sensors are glued to a light weight carbon-carbon structure which incorporates a titanium cooling tube for a CO2 cooling system. In total th...

  16. Development of an ASD IC for the Micro Pixel Chamber

    CERN Document Server

    Orito, R; Kubo, H; Miuchi, K; Nagayoshi, T; Okada, Y; Takada, A; Takeda, A; Tanimori, T; Ueno, M

    2004-01-01

    A new amplifier-shaper-discriminator (ASD) chip was designed and manufactured for the Micro Pixel Chamber ($\\mu$-PIC). The design of this ASD IC is based on the ASD IC (TGC-ASD) for the Thin Gap Chamber in the LHC Atlas Experiment. The decay time constant of the preamplifier is 5-times longer than that of the TGC-ASD, and some other modifications have been made in order to improve the signal-to-noise ratio of the $\\mu$-PIC. The ASD IC uses SONY Analog Master Slice bipolar technology. The IC contains 4 channels in a QFP48 package. The decay time constant of the preamplifier is 80 ns and its gain is approximately 0.8 V/pC. The output from the preamplifier is received by a shaper (main-amplifier) with a gain of 7. A baseline restoration circuit is incorporated in the main-amplifier, and the current used for the baseline restoration is 5-times smaller than that of the TGC-ASD. The threshold voltage for the discriminator section is common to the 4 channels and their digital output level is LVDS-compatible. The ASD...

  17. FE-I4 pixel chip characterization with USBpix3 test system

    Energy Technology Data Exchange (ETDEWEB)

    Filimonov, Viacheslav; Gonella, Laura; Hemperek, Tomasz; Huegging, Fabian; Janssen, Jens; Krueger, Hans; Pohl, David-Leon; Wermes, Norbert [University of Bonn, Bonn (Germany)

    2015-07-01

    The USBpix readout system is a small and light weighting test system for the ATLAS pixel readout chips. It is widely used to operate and characterize FE-I4 pixel modules in lab and test beam environments. For multi-chip modules the resources on the Multi-IO board, that is the central control unit of the readout system, are coming to their limits, which makes the simultaneous readout of more than one chip at a time challenging. Therefore an upgrade of the current USBpix system has been developed. The upgraded system is called USBpix3 - the main focus of the talk. Characterization of single chip FE-I4 modules was performed with USBpix3 prototype (digital, analog, threshold and source scans; tuning). PyBAR (Bonn ATLAS Readout in Python scripting language) was used as readout software. PyBAR consists of FEI4 DAQ and Data Analysis Libraries in Python. The presentation describes the USBpix3 system, results of FE-I4 modules characterization and preparation for the multi-chip module and multi-module readout with USBpix3.

  18. FE-I4 pixel chip characterization with USBpix3 test system

    International Nuclear Information System (INIS)

    The USBpix readout system is a small and light weighting test system for the ATLAS pixel readout chips. It is widely used to operate and characterize FE-I4 pixel modules in lab and test beam environments. For multi-chip modules the resources on the Multi-IO board, that is the central control unit of the readout system, are coming to their limits, which makes the simultaneous readout of more than one chip at a time challenging. Therefore an upgrade of the current USBpix system has been developed. The upgraded system is called USBpix3 - the main focus of the talk. Characterization of single chip FE-I4 modules was performed with USBpix3 prototype (digital, analog, threshold and source scans; tuning). PyBAR (Bonn ATLAS Readout in Python scripting language) was used as readout software. PyBAR consists of FEI4 DAQ and Data Analysis Libraries in Python. The presentation describes the USBpix3 system, results of FE-I4 modules characterization and preparation for the multi-chip module and multi-module readout with USBpix3.

  19. Efficient segmentation by sparse pixel classification

    DEFF Research Database (Denmark)

    Dam, Erik B; Loog, Marco

    2008-01-01

    Segmentation methods based on pixel classification are powerful but often slow. We introduce two general algorithms, based on sparse classification, for optimizing the computation while still obtaining accurate segmentations. The computational costs of the algorithms are derived, and they are...

  20. Adopt a Pixel Photographs: 2013-Present

    Data.gov (United States)

    U.S. Geological Survey, Department of the Interior — The photographs in the Adopt a Pixel collection were provided by volunteers with a digital camera, a Global Positioning System (GPS), and a compass or a smart...

  1. Dense Iterative Contextual Pixel Classification using Kriging

    DEFF Research Database (Denmark)

    Ganz, Melanie; Loog, Marco; Brandt, Sami;

    2009-01-01

    In medical applications, segmentation has become an ever more important task. One of the competitive schemes to perform such segmentation is by means of pixel classification. Simple pixel-based classification schemes can be improved by incorporating contextual label information. Various methods h...... relatively long range interactions may play a role. We propose a new method based on Kriging that makes it possible to include such long range interactions, while keeping the computations manageable when dealing with large medical images....

  2. Infrared single-pixel imaging utilising microscanning

    OpenAIRE

    Sun, Ming-Jie; Edgar, Matthew P.; Phillips, David B.; Gibson, Graham M.; Padgett, Miles J.

    2015-01-01

    Since the invention of digital cameras there has been a concerted drive towards detector arrays with higher spatial resolution. Microscanning is a technique that provides a final higher resolution image by combining multiple images of a lower resolution. Each of these low resolution images is subject to a sub-pixel sized lateral displacement. In this work we apply the microscanning approach to an infrared single-pixel camera. For the same final resolution and measurement resource, we show tha...

  3. Hybrid pixel detector development for medical radiography

    International Nuclear Information System (INIS)

    A 7-year project has been initiated to develop hybrid pixel detectors for medical radiography. Crystalline semiconductor will be bonded to a pixellated readout chip where individual integrated circuits process each event, transferring the position, energy and timing information to the data acquisition controller. Chips will be tiled to produce a large area detector, capable of energy dispersive photon counting at moderate spatial resolution. Preliminary results from studies examining the design features and operation of the device are presented

  4. Design of the small pixel pitch ROIC

    Science.gov (United States)

    Liang, Qinghua; Jiang, Dazhao; Chen, Honglei; Zhai, Yongcheng; Gao, Lei; Ding, Ruijun

    2014-11-01

    Since the technology trend of the third generation IRFPA towards resolution enhancing has steadily progressed,the pixel pitch of IRFPA has been greatly reduced.A 640×512 readout integrated circuit(ROIC) of IRFPA with 15μm pixel pitch is presented in this paper.The 15μm pixel pitch ROIC design will face many challenges.As we all known,the integrating capacitor is a key performance parameter when considering pixel area,charge capacity and dynamic range,so we adopt the effective method of 2 by 2 pixels sharing an integrating capacitor to solve this problem.The input unit cell architecture will contain two paralleled sample and hold parts,which not only allow the FPA to be operated in full frame snapshot mode but also save relatively unit circuit area.Different applications need more matching input unit circuits. Because the dimension of 2×2 pixels is 30μm×30μm, an input stage based on direct injection (DI) which has medium injection ratio and small layout area is proved to be suitable for middle wave (MW) while BDI with three-transistor cascode amplifier for long wave(LW). By adopting the 0.35μm 2P4M mixed signal process, the circuit architecture can make the effective charge capacity of 7.8Me- per pixel with 2.2V output range for MW and 7.3 Me- per pixel with 2.6V output range for LW. According to the simulation results, this circuit works well under 5V power supply and achieves less than 0.1% nonlinearity.

  5. Charge sharing in silicon pixel detectors

    CERN Document Server

    Mathieson, K; Seller, P; Prydderch, M L; O'Shea, V; Bates, R L; Smith, K M; Rahman, M

    2002-01-01

    We used a pixellated hybrid silicon X-ray detector to study the effect of the sharing of generated charge between neighbouring pixels over a range of incident X-ray energies, 13-36 keV. The system is a room temperature, energy resolving detector with a Gaussian FWHM of 265 eV at 5.9 keV. Each pixel is 300 mu m square, 300 mu m deep and is bump bonded to matching read out electronics. The modelling packages MEDICI and MCNP were used to model the complete X-ray interaction and the subsequent charge transport. Using this software a model is developed which reproduces well the experimental results. The simulations are then altered to explore smaller pixel sizes and different X-ray energies. Charge sharing was observed experimentally to be 2% at 13 keV rising to 4.5% at 36 keV, for an energy threshold of 4 keV. The models predict that up to 50% of charge may be lost to the neighbouring pixels, for an X-ray energy of 36 keV, when the pixel size is reduced to 55 mu m.

  6. Overview of the CMS Pixel Detector

    CERN Document Server

    Cerati, Giuseppe B

    2008-01-01

    The Compact Muon Solenoid Experiment (CMS) will start taking data at the Large Hadron Collider (LHC) in 2009. It will investigate the proton-proton collisions at $14~TeV$. A robust tracking combined with a precise vertex reconstruction is crucial to address the physics challenge of proton collisions at this energy. To this extent an all-silicon tracking system with very fine granularity has been built and now is in the final commissioning phase. It represents the largest silicon tracking detector ever built. The system is composed by an outer part, made of micro-strip detectors, and an inner one, made of pixel detectors. The pixel detector consists of three pixel barrel layers and two forward disks at each side of the interaction region. Each pixel sensor, both for the barrel and forward detectors, has $100 \\times 150$ $\\mu m^2$ cells for a total of 66 million pixels covering a total area of about $1~m^2$. The pixel detector will play a crucial role in the pattern recognition and the track reconstruction both...

  7. Small pixel oversampled IR focal plane arrays

    Science.gov (United States)

    Caulfield, John; Curzan, Jon; Lewis, Jay; Dhar, Nibir

    2015-06-01

    We report on a new high definition high charge capacity 2.1 Mpixel MWIR Infrared Focal Plane Array. This high definition (HD) FPA utilizes a small 5 um pitch pixel size which is below the Nyquist limit imposed by the optical systems Point Spread Function (PSF). These smaller sub diffraction limited pixels allow spatial oversampling of the image. We show that oversampling IRFPAs enables improved fidelity in imaging including resolution improvements, advanced pixel correlation processing to reduce false alarm rates, improved detection ranges, and an improved ability to track closely spaced objects. Small pixel HD arrays are viewed as the key component enabling lower size, power and weight of the IR Sensor System. Small pixels enables a reduction in the size of the systems components from the smaller detector and ROIC array, the reduced optics focal length and overall lens size, resulting in an overall compactness in the sensor package, cooling and associated electronics. The highly sensitive MWIR small pixel HD FPA has the capability to detect dimmer signals at longer ranges than previously demonstrated.

  8. Steganography based on pixel intensity value decomposition

    Science.gov (United States)

    Abdulla, Alan Anwar; Sellahewa, Harin; Jassim, Sabah A.

    2014-05-01

    This paper focuses on steganography based on pixel intensity value decomposition. A number of existing schemes such as binary, Fibonacci, Prime, Natural, Lucas, and Catalan-Fibonacci (CF) are evaluated in terms of payload capacity and stego quality. A new technique based on a specific representation is proposed to decompose pixel intensity values into 16 (virtual) bit-planes suitable for embedding purposes. The proposed decomposition has a desirable property whereby the sum of all bit-planes does not exceed the maximum pixel intensity value, i.e. 255. Experimental results demonstrate that the proposed technique offers an effective compromise between payload capacity and stego quality of existing embedding techniques based on pixel intensity value decomposition. Its capacity is equal to that of binary and Lucas, while it offers a higher capacity than Fibonacci, Prime, Natural, and CF when the secret bits are embedded in 1st Least Significant Bit (LSB). When the secret bits are embedded in higher bit-planes, i.e., 2nd LSB to 8th Most Significant Bit (MSB), the proposed scheme has more capacity than Natural numbers based embedding. However, from the 6th bit-plane onwards, the proposed scheme offers better stego quality. In general, the proposed decomposition scheme has less effect in terms of quality on pixel value when compared to most existing pixel intensity value decomposition techniques when embedding messages in higher bit-planes.

  9. Region based elimination of noise pixels towards optimized classifier models for skin pixel detection

    Directory of Open Access Journals (Sweden)

    Gagandeep Kaur

    2015-03-01

    Full Text Available The extraction of the skin pixels in a human image and rejection of non-skin pixels is called the skin segmentation. Skin pixel detection is the process of extracting the skin pixels in a human image which is typically used as a pre-processing step to extract the face regions from human image. In past, there are several computer vision approaches and techniques have been developed for skin pixel detection. In the process of skin detection, given pixels are been transformed into an appropriate color space such as RGB, HSV etc. And then skin classifier model have been applied to label the pixel into skin or non-skin regions. Here in this research a “Region based elimination of noise pixels and performance analysis of classifier models for skin pixel detection applied on human images” would be performed which involve the process of image representation in color models, elimination of non-skin pixels in the image, and then pre-processing and cleansing of the collected data, feature selection of the human image and then building the model for classifier. In this research and implementation of skin pixels classifier models are proposed with their comparative performance analysis. The definition of the feature vector is simply the selection of skin pixels from the human image or stack of human images. The performance is evaluated by comparing and analysing skin colour segmentation algorithms. During the course of research implementation, efforts are iterative which help in selection of optimized skin classifier based on the machine learning algorithms and their performance analysis.

  10. Studies Concerning the ATLAS IBL Calibration Architecture

    CERN Document Server

    Kretz, Moritz; Kugel, Andreas

    With the commissioning of the Insertable B-Layer (IBL) in 2013 at the ATLAS experiment 12~million additional pixels will be added to the current Pixel Detector. While the idea of employing pairs of VME based Read-Out Driver (ROD) and Back of Crate (BOC) cards in the read-out chain remains unchanged, modifications regarding the IBL calibration procedure were introduced to overcome current hardware limitations. The analysis of calibration histograms will no longer be performed on the RODs, but on an external computing farm that is connected to the RODs via Ethernet. This thesis contributes to the new IBL calibration procedure and presents a concept for a scalable software and hardware architecture. An embedded system targeted to the ROD FPGAs is realized for sending data from the RODs to the fit farm servers and benchmarks are carried out with a Linux based networking stack, as well as a standalone software stack. Furthermore, the histogram fitting algorithm currently being employed on the Pixel Detector RODs i...

  11. Design and tests of offset-compensated in-pixel amplifiers for CMOS pixel sensors

    International Nuclear Information System (INIS)

    This paper presents novel in-pixel amplifiers for CMOS pixel sensors. Two kinds of offset-compensated amplifiers allow the sensors to achieve a high signal-to-noise ratio. Based on theoretical analysis, the gain of the input offset-compensated amplifier is less sensitive to threshold voltage variation than the output offset-compensated amplifier. A 12μm pitch CMOS pixel sensor with the input offset-compensated amplifier was therefore designed and fabricated in a 0.13μm CMOS technology. Measurements indicate that the implementation of this amplifier can result in a high signal-to-noise ratio for a CMOS pixel sensor.

  12. ATLAS Thesis Awards 2015

    CERN Multimedia

    Biondi, Silvia

    2016-01-01

    Winners of the ATLAS Thesis Award were presented with certificates and glass cubes during a ceremony on Thursday 25 February. The winners also presented their work in front of members of the ATLAS Collaboration. Winners: Javier Montejo Berlingen, Barcelona (Spain), Ruth Pöttgen, Mainz (Germany), Nils Ruthmann, Freiburg (Germany), and Steven Schramm, Toronto (Canada).

  13. ATLAS-Hadronic Calorimeter

    CERN Multimedia

    2003-01-01

    Hall 180 work on Hadronic Calorimeter The ATLAS hadronic tile calorimeter The Tile Calorimeter, which constitutes the central section of the ATLAS hadronic calorimeter, is a non-compensating sampling device made of iron and scintillating tiles. (IEEE Trans. Nucl. Sci. 53 (2006) 1275-81)

  14. ATLAS TV PROJECT

    CERN Multimedia

    2005-01-01

    La Givrine near St Cergue Cross Country Skiing and Fondue at Basse Ruche with M Nordberg, P Jenni, M Nessi, F Gianotti and Co. ATLAS Management Fondu dinner, reviewing state of play of the experiment Many fun scenes from cross country skiing and after 41 minutes of the film starts the fondue dinner in a nice chalet with many persons working for ATLAS experiment

  15. ATLAS TV PROJECT

    CERN Multimedia

    2005-01-01

    Budker Nuclear Physics Institute, Novosibirsk Sequence 1 Shots of aircraft factory where machining for ATLAS is done Shots of aircraft Work on components for ATLAS big wheel Discussions between Tikhonov and Nordberg in workshop Sequence 2 Shots of downtown Novosibirsk, including little church which is mid-point of Russian Federation Sequence 3 Interview of Yuri Tikhonov by Andrew Millington

  16. A Slice of ATLAS

    CERN Multimedia

    2004-01-01

    An entire section of the ATLAS detector is being assembled at Prévessin. Since May the components have been tested using a beam from the SPS, giving the ATLAS team valuable experience of operating the detector as well as an opportunity to debug the system.

  17. ATLAS brochure (Spanish version)

    CERN Multimedia

    Lefevre, C

    2008-01-01

    ATLAS is the largest detector at the LHC, the most powerful particle accelerator in the world, which will start up in 2008. ATLAS is a multi-purpose detector, designed to throw light on fundamental questions such as the origin of mass and the nature of the Universe's dark matter.

  18. ATLAS Visitors Centre

    CERN Multimedia

    claudia Marcelloni

    2009-01-01

    ATLAS Visitors Centre has opened its shiny new doors to the public. Officially launched on Monday February 23rd, 2009, the permanent exhibition at Point 1 was conceived as a tour resource for ATLAS guides, and as a way to preserve the public’s opportunity to get a close-up look at the experiment in action when the cavern is sealed.

  19. ATLAS people can run!

    CERN Multimedia

    Claudia Marcelloni de Oliveira; Pauline Gagnon

    It must be all the training we are getting every day, running around trying to get everything ready for the start of the LHC next year. This year, the ATLAS runners were in fine form and came in force. Nine ATLAS teams signed up for the 37th Annual CERN Relay Race with six runners per team. Under a blasting sun on Wednesday 23rd May 2007, each team covered the distances of 1000m, 800m, 800m, 500m, 500m and 300m taking the runners around the whole Meyrin site, hills included. A small reception took place in the ATLAS secretariat a week later to award the ATLAS Cup to the best ATLAS team. For the details on this complex calculation which takes into account the age of each runner, their gender and the color of their shoes, see the July 2006 issue of ATLAS e-news. The ATLAS Running Athena Team, the only all-women team enrolled this year, won the much coveted ATLAS Cup for the second year in a row. In fact, they are so good that Peter Schmid and Patrick Fassnacht are wondering about reducing the women's bonus in...

  20. The ATLAS tile calorimeter

    CERN Multimedia

    Maximilien Brice

    2003-01-01

    Louis Rose-Dulcina, a technician from the ATLAS collaboration, works on the ATLAS tile calorimeter. Special manufacturing techniques were developed to mass produce the thousands of elements in this detector. Tile detectors are made in a sandwich-like structure where these scintillator tiles are placed between metal sheets.

  1. ATLAS rewards industry

    CERN Multimedia

    Maximilien Brice

    2006-01-01

    For contributing vital pieces to the ATLAS puzzle, three industries were recognized on Friday 5 May during a supplier awards ceremony. After a welcome and overview of the ATLAS experiment by spokesperson Peter Jenni, CERN Secretary-General Maximilian Metzger stressed the importance of industry to CERN's scientific goals. Picture 30 : representatives of the three award-wining companies after the ceremony

  2. ATLAS brochure (German version)

    CERN Multimedia

    Lefevre, C

    2012-01-01

    ATLAS is the largest detector at the LHC, the most powerful particle accelerator in the world. ATLAS is a multi-purpose detector, designed to throw light on fundamental questions such as the origin of mass and the nature of the Universe's dark matter.

  3. ATLAS brochure (French version)

    CERN Multimedia

    Lefevre, C

    2012-01-01

    ATLAS is the largest detector at the LHC, the most powerful particle accelerator in the world. ATLAS is a multi-purpose detector, designed to throw light on fundamental questions such as the origin of mass and the nature of the Universe's dark matter.

  4. Spatial clustering of pixels of a multispectral image

    Science.gov (United States)

    Conger, James Lynn

    2014-08-19

    A method and system for clustering the pixels of a multispectral image is provided. A clustering system computes a maximum spectral similarity score for each pixel that indicates the similarity between that pixel and the most similar neighboring. To determine the maximum similarity score for a pixel, the clustering system generates a similarity score between that pixel and each of its neighboring pixels and then selects the similarity score that represents the highest similarity as the maximum similarity score. The clustering system may apply a filtering criterion based on the maximum similarity score so that pixels with similarity scores below a minimum threshold are not clustered. The clustering system changes the current pixel values of the pixels in a cluster based on an averaging of the original pixel values of the pixels in the cluster.

  5. ATLAS' major cooling project

    CERN Document Server

    2005-01-01

    In 2005, a considerable effort has been put into commissioning the various units of ATLAS' complex cryogenic system. This is in preparation for the imminent cooling of some of the largest components of the detector in their final underground configuration. The liquid helium and nitrogen ATLAS refrigerators in USA 15. Cryogenics plays a vital role in operating massive detectors such as ATLAS. In many ways the liquefied argon, nitrogen and helium are the life-blood of the detector. ATLAS could not function without cryogens that will be constantly pumped via proximity systems to the superconducting magnets and subdetectors. In recent weeks compressors at the surface and underground refrigerators, dewars, pumps, linkages and all manner of other components related to the cryogenic system have been tested and commissioned. Fifty metres underground The helium and nitrogen refrigerators, installed inside the service cavern, are an important part of the ATLAS cryogenic system. Two independent helium refrigerators ...

  6. ATLAS Virtual Visits

    CERN Document Server

    Goldfarb, Steven; The ATLAS collaboration

    2015-01-01

    ATLAS Virtual Visits is a project initiated in 2011 for the Education & Outreach program of the ATLAS Experiment at CERN. Its goal is to promote public appreciation of the LHC physics program and particle physics, in general, through direct dialogue between ATLAS physicists and remote audiences. A Virtual Visit is an IP-based videoconference, coupled with a public webcast and video recording, between ATLAS physicists and remote locations around the world, that typically include high school or university classrooms, Masterclasses, science fairs, or other special events, usually hosted by collaboration members. Over the past two years, more than 10,000 people, from all of the world’s continents, have actively participated in ATLAS Virtual Visits, with many more enjoying the experience from the publicly available webcasts and recordings. We present an overview of our experience and discuss potential development for the future.

  7. Software Validation in ATLAS

    International Nuclear Information System (INIS)

    The ATLAS collaboration operates an extensive set of protocols to validate the quality of the offline software in a timely manner. This is essential in order to process the large amounts of data being collected by the ATLAS detector in 2011 without complications on the offline software side. We will discuss a number of different strategies used to validate the ATLAS offline software; running the ATLAS framework software, Athena, in a variety of configurations daily on each nightly build via the ATLAS Nightly System (ATN) and Run Time Tester (RTT) systems; the monitoring of these tests and checking the compilation of the software via distributed teams of rotating shifters; monitoring of and follow up on bug reports by the shifter teams and periodic software cleaning weeks to improve the quality of the offline software further.

  8. Dear ATLAS colleagues,

    CERN Multimedia

    PH Department

    2008-01-01

    We are collecting old pairs of glasses to take out to Mali, where they can be re-used by people there. The price for a pair of glasses can often exceed 3 months salary, so they are prohibitively expensive for many people. If you have any old spectacles you can donate, please put them in the special box in the ATLAS secretariat, bldg.40-4-D01 before the Christmas closure on 19 December so we can take them with us when we leave for Africa at the end of the month. (more details in ATLAS e-news edition of 29 September 2008: http://atlas-service-enews.web.cern.ch/atlas-service-enews/news/news_mali.php) many thanks! Katharine Leney co-driver of the ATLAS car on the Charity Run to Mali

  9. Development of n-in-p silicon planar pixel sensors and flip-chip modules for very high radiation environments

    Science.gov (United States)

    Unno, Y.; Ikegami, Y.; Terada, S.; Mitsui, S.; Jinnouchi, O.; Kamada, S.; Yamamura, K.; Ishida, A.; Ishihara, M.; Inuzuka, T.; Hanagaki, K.; Hara, K.; Kondo, T.; Kimura, N.; Nakano, I.; Nagai, K.; Takashima, R.; Tojo, J.; Yorita, K.

    2011-09-01

    In this paper we present R&D of n-in-p pixel sensors, aiming for a very high radiation environment up to a fluence of 10 16 n eq/cm 2. To fabricate these sensors, two batches with different mask sets were employed: the first resulted in pixel sensors compatible with the ATLAS pixel readout frontend chip called FE-I3, and the second in FE-I3 and a new frontend chip, FE-I4, compatible sensors; small diodes were employed to investigate the width from the active diode to the dicing edge and the guard rings. Tests involving the diodes showed that the strong increase of leakage current was attributed to the edge current when the lateral depletion zone reaches the dicing edge and the lateral depletion along the silicon surface was correlated with the 'field' width. The onset was observed at a voltage of 1000 V when the width was equal to ˜400 μm. The pixel sensors that were diced at a width of 450 μm could successfully maintain a bias voltage of 1000 V. Hybrid flip-chip pixel modules with dummy and real chips were also fabricated. Lead (PbSn) solder bump bonding proved to be successful. However, lead-free (SnAg) solder bump bonding requires further optimization.

  10. ATLAS' inner silicon tracker on track for completion

    CERN Multimedia

    2005-01-01

    Last week, the team working at the SR1 facility on the inner detector of the ATLAS experiment reached a project milestone after the delivery of the last Semi-conductor Tracker (SCT) barrel to CERN. The third barrel before its insertion into the support structure.The insertion of a completed barrel to its support structure is one of the highlights of the assembly and test sequence of the SCT in SR1. The inner detector will eventually sit in the 2 teslas magnetic field of the ATLAS solenoid, tracking charged particles from proton-proton collisions at the centre of ATLAS. The particles will be measured by a pixel detector (consisting of 3 pixel layers), an SCT (4 silicon strip layers) and a transition radiation tracker (TRT) (consisting of more than 52,000 straw tubes - see Bulletin 14/2005). The SCT has a silicon surface area of 61m2 with about 6 million operational channels so that all tracks can be identified and precisely measured. During 2004 a team of physicists, engineers, and technicians from several...

  11. Radiation Tolerance of CMOS Monolithic Active Pixel Sensors with Self-Biased Pixels

    CERN Document Server

    Deveaux, M; Besson, A; Claus, G; Colledani, C; Dorokhov, M; Dritsa, C; Dulinski, W; Fröhlich, I; Goffe, M; Grandjean, D; Heini, S; Himmi, A; Hu, C; Jaaskelainen, K; Müntz, C; Shabetai, A; Stroth, J; Szelezniak, M; Valin, I; Winter, M

    2009-01-01

    CMOS Monolithic Active Pixel Sensors (MAPS) are proposed as a technology for various vertex detectors in nuclear and particle physics. We discuss the mechanisms of ionizing radiation damage on MAPS hosting the the dead time free, so-called self bias pixel. Moreover, we discuss radiation hardened sensor designs which allow operating detectors after exposing them to irradiation doses above 1 Mrad

  12. 3D-FBK Pixel sensors: recent beam tests results with irradiated devices

    CERN Document Server

    Micelli, A; Sandaker, H; Stugu, B; Barbero, M; Hugging, F; Karagounis, M; Kostyukhin, V; Kruger, H; Tsung, J W; Wermes, N; Capua, M; Fazio, S; Mastroberardino, A; Susinno, G; Gallrapp, C; Di Girolamo, B; Dobos, D; La Rosa, A; Pernegger, H; Roe, S; Slavicek, T; Pospisil, S; Jakobs, K; Kohler, M; Parzefall, U; Darbo, G; Gariano, G; Gemme, C; Rovani, A; Ruscino, E; Butter, C; Bates, R; Oshea, V; Parker, S; Cavalli-Sforza, M; Grinstein, S; Korokolov, I; Pradilla, C; Einsweiler, K; Garcia-Sciveres, M; Borri, M; Da Via, C; Freestone, J; Kolya, S; Lai, C H; Nellist, C; Pater, J; Thompson, R; Watts, S J; Hoeferkamp, M; Seidel, S; Bolle, E; Gjersdal, H; Sjobaek, K N; Stapnes, S; Rohne, O; Su, D; Young, C; Hansson, P; Grenier, P; Hasi, J; Kenney, C; Kocian, M; Jackson, P; Silverstein, D; Davetak, H; DeWilde, B; Tsybychev, D; Dalla Betta, G F; Gabos, P; Povoli, M; Cobal, M; Giordani, M P; Selmi, L; Cristofoli, A; Esseni, D; Palestri, P; Fleta, C; Lozano, M; Pellegrini, G; Boscardin, M; Bagolini, A; Piemonte, C; Ronchin, S; Zorzi, N; Hansen, T E; Hansen, T; Kok, A; Lietaer, N; Kalliopuska, J; Oja, A

    2011-01-01

    The Pixel detector is the innermost part of the ATLAS experiment tracking device at the Large Hadron Collider (LHC), and plays a key role in the reconstruction of the primary and secondary vertices of short-lived particles. To cope with the high level of radiation produced during the collider operation, it is planned to add to the present three layers of silicon pixel sensors which constitute the Pixel Detector, an additional layer (Insertable B-Layer, or IBL) of sensors. 3D silicon sensors are one of the technologies which are under study for the IBL. 3D silicon technology is an innovative combination of very-large-scale integration (VLSI) and Micro-Electro-Mechanical-Systems (MEMS) where electrodes are fabricated inside the silicon bulk instead of being implanted on the wafer surfaces. 3D sensors, with electrodes fully or partially penetrating the silicon substrate, are currently fabricated at different processing facilities in Europe and USA. This paper reports on the 2010 June beam test results for irradi...

  13. Low mass hybrid pixel detectors for the high luminosity LHC upgrade

    Energy Technology Data Exchange (ETDEWEB)

    Gonella, Laura

    2013-10-15

    Reducing material in silicon trackers is of major importance for a good overall detector performance, and poses severe challenges to the design of the tracking system. To match the low mass constraints for trackers in High Energy Physics experiments at high luminosity, dedicated technological developments are required. This dissertation presents three technologies to design low mass hybrid pixel detectors for the high luminosity upgrades of the LHC. The work targets specifically the reduction of the material from the detector services and modules, with novel powering schemes, flip chip and interconnection technologies. A serial powering scheme is prototyped, featuring a new regulator concept, a control and protection element, and AC-coupled data transmission. A modified flip chip technology is developed for thin, large area Front-End chips, and a via last Through Silicon Via process is demonstrated on existing pixel modules. These technologies, their developments, and the achievable material reduction are discussed using the upgrades of the ATLAS pixel detector as a case study.

  14. Low mass hybrid pixel detectors for the high luminosity LHC upgrade

    International Nuclear Information System (INIS)

    Reducing material in silicon trackers is of major importance for a good overall detector performance, and poses severe challenges to the design of the tracking system. To match the low mass constraints for trackers in High Energy Physics experiments at high luminosity, dedicated technological developments are required. This dissertation presents three technologies to design low mass hybrid pixel detectors for the high luminosity upgrades of the LHC. The work targets specifically the reduction of the material from the detector services and modules, with novel powering schemes, flip chip and interconnection technologies. A serial powering scheme is prototyped, featuring a new regulator concept, a control and protection element, and AC-coupled data transmission. A modified flip chip technology is developed for thin, large area Front-End chips, and a via last Through Silicon Via process is demonstrated on existing pixel modules. These technologies, their developments, and the achievable material reduction are discussed using the upgrades of the ATLAS pixel detector as a case study.

  15. Development of CMOS Pixel Sensors with digital pixel dedicated to future particle physics experiments

    Science.gov (United States)

    Zhao, W.; Wang, T.; Pham, H.; Hu-Guo, C.; Dorokhov, A.; Hu, Y.

    2014-02-01

    Two prototypes of CMOS pixel sensor with in-pixel analog to digital conversion have been developed in a 0.18 μm CIS process. The first design integrates a discriminator into each pixel within an area of 22 × 33 μm2 in order to meet the requirements of the ALICE inner tracking system (ALICE-ITS) upgrade. The second design features 3-bit charge encoding inside a 35 × 35 μm2 pixel which is motivated by the specifications of the outer layers of the ILD vertex detector (ILD-VXD). This work aims to validate the concept of in-pixel digitization which offers higher readout speed, lower power consumption and less dead zone compared with the column-level charge encoding.

  16. The ATLAS Insertable B-Layer (IBL) Project.

    CERN Document Server

    La Rosa, A; The ATLAS collaboration

    2013-01-01

    The ATLAS experiment will upgrade its Pixel Detector with the installation of a new pixel layer in 2013-14. The new sub-detector, named Insertable B-layer (IBL), will be installed between the existing Pixel Detector and a new smaller radius beam-pipe at a radius of 3.3 cm. To cope with the high radiation and pixel occupancy due to the proximity to the interaction point, a new read-out chip and two different silicon sensor technologies (planar and 3D) have been developed. Furthermore, the physics performance should be improved through the reduction of pixel size while targeting for a low material budget should be imposed, pushing for a new mechanical support using lightweight staves and a CO2 based cooling system. An overview of the IBL project and the status of the two pre-series staves made before going into production in order to qualify the assembly procedure, the loaded module electrical integrity and the read-out chain will be presented.

  17. Infrared single-pixel imaging utilising microscanning

    CERN Document Server

    Sun, Ming-Jie; Phillips, David B; Gibson, Graham M; Padgett, Miles J

    2015-01-01

    Since the invention of digital cameras there has been a concerted drive towards detector arrays with higher spatial resolution. Microscanning is a technique that provides a final higher resolution image by combining multiple images of a lower resolution. Each of these low resolution images is subject to a sub-pixel sized lateral displacement. In this work we apply the microscanning approach to an infrared single-pixel camera. For the same final resolution and measurement resource, we show that microscanning improves the signal-to-noise ratio (SNR) of reconstructed images by approximately 50%. In addition, this strategy also provides access to a stream of low-resolution 'preview' images throughout each high-resolution acquisition. Our work demonstrates an additional degree of flexibility in the trade-off between SNR and spatial resolution in single-pixel imaging techniques.

  18. Readout architecture of the CMS pixel detector

    CERN Document Server

    Baur, R

    2001-01-01

    In this paper we describe the readout architecture of the CMS pixel chip. In column drain architecture the complex tasks of data buffering and trigger verification are performed in the circuit periphery. This allows to use a rather simple pixel unit cell which requires only a small number of transistors. The column periphery logic is designed for readout and trigger rates expected for full LHC luminosity. At LHC the high particle flux can create single event upsets in the readout chips. At small radii the upsets of logic cells could severely affect the performance of the pixel detector readout. We have therefore performed a measurement of the upset rate at the PSI pion beam and describe the consequences for the design of the readout chip. (5 refs).

  19. Design considerations for pixel readout chips

    CERN Document Server

    Fischer, P

    2003-01-01

    Pixel detectors are becoming a standard tracking component in modern particle physics experiment and find first applications in X-ray diffraction, medical imaging and astronomy. The amplification and the readout of the small signal charges from the pixel sensor require highly integrated ASICs in which several thousand low-noise charge-sensitive amplifiers are densely interspersed with fast data-processing logic. The reduction of crosstalk from the digital to the analog section is therefore crucial. The frequent demand for radiation tolerance requires special chip technologies or the use of deep sub-micron processes with suited design rules. This paper summarizes a few designs aspects particularly important for pixel readout chips.

  20. Likelihood Analysis for Mega Pixel Maps

    Science.gov (United States)

    Kogut, Alan J.

    1999-01-01

    The derivation of cosmological parameters from astrophysical data sets routinely involves operations counts which scale as O(N(exp 3) where N is the number of data points. Currently planned missions, including MAP and Planck, will generate sky maps with N(sub d) = 10(exp 6) or more pixels. Simple "brute force" analysis, applied to such mega-pixel data, would require years of computing even on the fastest computers. We describe an algorithm which allows estimation of the likelihood function in the direct pixel basis. The algorithm uses a conjugate gradient approach to evaluate X2 and a geometric approximation to evaluate the determinant. Monte Carlo simulations provide a correction to the determinant, yielding an unbiased estimate of the likelihood surface in an arbitrary region surrounding the likelihood peak. The algorithm requires O(N(sub d)(exp 3/2) operations and O(Nd) storage for each likelihood evaluation, and allows for significant parallel computation.

  1. Power Studies for the CMS Pixel Tracker

    International Nuclear Information System (INIS)

    The Electronic Systems Engineering Department of the Computing Division at the Fermi National Accelerator Laboratory is carrying out R and D investigations for the upgrade of the power distribution system of the Compact Muon Solenoid (CMS) Pixel Tracker at the Large Hadron Collider (LHC). Among the goals of this effort is that of analyzing the feasibility of alternative powering schemes for the forward tracker, including DC to DC voltage conversion techniques using commercially available and custom switching regulator circuits. Tests of these approaches are performed using the PSI46 pixel readout chip currently in use at the CMS Tracker. Performance measures of the detector electronics will include pixel noise and threshold dispersion results. Issues related to susceptibility to switching noise will be studied and presented. In this paper, we describe the current power distribution network of the CMS Tracker, study the implications of the proposed upgrade with DC-DC converters powering scheme and perform noise susceptibility analysis.

  2. Characterisation and mitigation of beam-induced backgrounds observed in the ATLAS detector during the 2011 proton-proton run

    Czech Academy of Sciences Publication Activity Database

    Aad, G.; Abajyan, T.; Abbott, B.; Böhm, Jan; Chudoba, Jiří; Gallus, Petr; Gunther, Jaroslav; Jakoubek, Tomáš; Juránek, Vojtěch; Kepka, Oldřich; Kupčo, Alexander; Kůs, Vlastimil; Lokajíček, Miloš; Marčišovský, Michal; Mikeštíková, Marcela; Myška, Miroslav; Němeček, Stanislav; Růžička, Pavel; Schovancová, Jaroslava; Šícho, Petr; Staroba, Pavel; Svatoš, Michal; Taševský, Marek; Tic, Tomáš; Valenta, J.; Vrba, Václav

    2013-01-01

    Roč. 8, Jul (2013), s. 1-58. ISSN 1748-0221 R&D Projects: GA MŠk(CZ) LG13009 Institutional support: RVO:68378271 Keywords : background * induced * semiconductor detector * pixel * muon * spectrometer * jet * single production * ATLAS * calorimeter * new physics * beam Subject RIV: BG - Nuclear, Atomic and Molecular Physics, Colliders Impact factor: 1.526, year: 2013

  3. A photon counting pixel detector for X-ray imaging

    International Nuclear Information System (INIS)

    Hybrid semiconductor pixel detector technology is presented in this thesis as an alternative to current imaging systems in medical imaging and synchrotron radiation applications. The technology has been developed from research performed in High Energy Physics, in particular, for the ATLAS experiment at the LHC, planned for 2005. This thesis describes work done by the author on behalf of the MEDIPIX project, a collaboration between 13 international institutions for the development of hybrid pixel detectors for non-HEP applications. Chapter 1 describes the motivation for these detectors, the origin of the technology, and the current state of the art in imaging devices. A description of the requirements of medical imaging on X-ray sensors is described, and the properties of film and CCDs are discussed. The work of the RD19 collaboration is introduced to show the evolution of these devices. Chapter 2 presents the basic semiconductor theory required to understand the operation of these detectors, and a section on image theory introduces the fundamental parameters which are necessary to define the quality of an imaging device. Chapter 3 presents measurements made by the author on a photon counting detector (PCD1) comprising a PCC1 (MEDIPIX1) readout chip bumpbonded to silicon and gallium arsenide pixel detectors. Tests on the seperate readout chip and the bump-bonded assembly are shown with comparisons between the performance of the two materials. Measurements of signal-to-noise ratio, detection efficiency and noise performance are presented, along with an MTF measurement made by the Freiburg group. The X-ray tube energy spectrum was calibrated by REGAM. The performance of the PCD in a powder diffraction experiment using a synchrotron radiation source is described in chapter 4. This chapter reports the first use of a true 2-D hybrid pixel detector in a synchrotron application, and a comparison with the existing scintillator based technology is made. The measurements made

  4. Development of a custom on-line ultrasonic vapour analyzer and flow meter for the ATLAS inner detector, with application to Cherenkov and gaseous charged particle detectors

    OpenAIRE

    Alhrooba, M.; Batesb, R.; Degeorged, C.; Deterree, C.; DiGirolamoc, B.; Doubekf, M.; Favrec, G.; Godlewskib, J.; Hallewellg, G.; Hasiba, A.; Katuninh, S.; Langeving, N.; Battistinc, M.; Lombardc, D.; Mathieug, M.

    2015-01-01

    Precision sound velocity measurements can simultaneously determine binary gas composition and flow. We have developed an analyzer with custom microcontroller-based electronics, currently used in the ATLAS Detector Control System, with numerous potential applications. Three instruments monitor C3F8 and CO2 coolant leak rates into the nitrogen envelopes of the ATLAS silicon microstrip and Pixel detectors. Two further instruments will aid operation of the new thermosiphon coolant recirculator: o...

  5. Quality control and functionality tests during ATLAS IBL production

    International Nuclear Information System (INIS)

    To improve performance of the ATLAS inner tracker, a fourth Pixel layer, called the Insertable B-layer (IBL), will be installed on a new beam pipe in 2014. This detector uses both conventional planar and 3D pixel sensors bump-bonded to a new readout chip, the FE-I4, in a novel stave design. Therefore, a production QA test bench has been established to test all production staves before integration with the new beam pipe. This setup combines former ATLAS Pixel services and a new readout system, namely the RCE (Reconfigurable Cluster Element) system developed at SLAC. With this setup all production staves will be tested to ensure the installation of only those staves which fulfill the IBL criteria. Quality assurance measurements under cleanroom conditions, including temperature and humidity control, are performed during the various production steps of the IBL, namely connectivity as well as electrical tests and signal probing on assembled subsystems. The capabilities of the stave qualification setup, and recent results from testing prototype staves are presented and discussed.

  6. Development of a CMOS SOI pixel detector

    CERN Document Server

    Ishino, Hirokazu; Hazumi, M; Ikegami, Y; Kohriki, T; Tajima, O; Terada, S; Tsuboyama, T; Unno, Y; Ushiroda, Y; Ikeda, H; Hara, K; Ishino, H; Kawasaki, T; Miyake, H; Martin, E; Varner, G; Tajima, H; Ohno, M; Fukuda, K; Komatsubara, H; Ida, J

    2007-01-01

    We have developed a monolithic radiation pixel detector using silicon on insulator (SOI) with a commercial 0.15 m fullydepleted- SOI technology and a Czochralski high resistivity silicon substrate in place of a handle wafer. The SOI TEG (Test Element Group) chips with a size of 2.5 x 2.5mm2 consisting of 20 x 20 um2 pixels have been designed and manufactured. Performance tests with a laser light illumination and a . ray radioactive source indicate successful operation of the detector. We also brie y discuss the back gate effect as well as the simulation study.

  7. Performance of large area Micro Pixel Chamber

    OpenAIRE

    Nagayoshi, T.; Kubo, H.; Miuchi, K; Ochi, A.; Orito, R.; Takada, A; Tanimori, T.; Ueno, M

    2003-01-01

    A novel gaseous two-dimensional imaging detector "Micro Pixel Chamber (micro-PIC)" has been developed. This detector is based on double sided printed circuit board (PCB). We have developed large area (10cm x 10cm) micro-PICs with 65536 pixel anodes of 400um pitch on a 100um thick insulating substrate. Achieved energy resolution was 30% (FWHM) at 5.9keV, and a gas gain of 7000 was obtained with argon ethane (8:2) gas mixture. This gain is high enough to detect minimum ionizing particles with s...

  8. ATLAS Forward Detectors and Physics

    CERN Document Server

    Soni, N

    2010-01-01

    In this communication I describe the ATLAS forward physics program and the detectors, LUCID, ZDC and ALFA that have been designed to meet this experimental challenge. In addition to their primary role in the determination of ATLAS luminosity these detectors - in conjunction with the main ATLAS detector - will be used to study soft QCD and diffractive physics in the initial low luminosity phase of ATLAS running. Finally, I will briefly describe the ATLAS Forward Proton (AFP) project that currently represents the future of the ATLAS forward physics program.

  9. The FE-I4 pixel readout system-on-chip resubmission for the insertable B-Layer project

    CERN Document Server

    Zivkovic, V; Garcia-Sciveres, M; Mekkaoui, A; Barbero, M; Darbo, G; Gnani, D; Hemperek, T; Menouni, M; Fougeron, D; Gensolen, F; Jensen, F; Caminada, L; Gromov, V; Kluit, R; Fleury, J; Krüger, H; Backhaus, M; Fang, X; Gonella, L; Rozanove, A; Arutinov, D

    2012-01-01

    The FE-I4 is a new pixel readout integrated circuit designed to meet the requirements of ATLAS experiment upgrades. The first samples of the FE-I4 engineering run (called FE-I4A) delivered promising results in terms of the requested performances. The FE-I4 team envisaged a number of modifications and fine-tuning before the actual exploitation, planned within the Insertable B-Layer (IBL) of ATLAS. As the IBL schedule was pushed significantly forward, a quick and efficient plan had to be devised for the FE-I4 redesign. This article will present the main objectives of the resubmission, together with the major changes that were a driving factor for this redesign. In addition, the top-level verification and test efforts of the FE-I4 will also be addressed.

  10. The Fast Tracker Real Time Processor and Its Impact on the Muon Isolation, Tau amp; b-Jet Online Selections at ATLAS

    CERN Document Server

    Giannetti, P; The ATLAS collaboration; Crescioli, F

    2011-01-01

    As the LHC luminosity is ramped up to the SLHC Phase I level and beyond, the high rates, multiplicities, and energies of particles seen by the detectors will pose a unique challenge. Only a tiny fraction of the produced collisions can be stored on tape and immense real-time data reduction is needed. An effective trigger system must maintain high trigger efficiencies for the physics we are most interested in, and at the same time suppress the enormous QCD backgrounds. This requires massive computing power to minimize the online execution time of complex algorithms. A multi-level trigger is an effective solution for an otherwise impossible problem. The Fast Tracker (FTK)[1], is a proposed upgrade to the current ATLAS trigger system that will operate at full Level-1 output rates and provide high quality tracks reconstructed over the entire detector by the start of processing in Level-2. FTK solves the combinatorial challenge inherent to tracking by exploiting massive parallelism of associative memories [2] that ...

  11. ATLAS Inner Tracker Performance at the beginning of LHC Run-2.

    CERN Document Server

    Stanecka, Ewa; The ATLAS collaboration

    2016-01-01

    The ATLAS experiment performs studies of proton-proton collisions at the Large Hadron Collider (LHC) at CERN. The Inner Detector is a part of the ATLAS apparatus placed nearest the interaction point, designed to measure charged particles momenta and their trajectories, and to reconstruct vertices of decays of physics objects created in the collisions. During the LHC technical stop 2013-2015, the Inner Detector underwent several upgrades and improvements, most notably an additional Pixel Detector layer was installed. This document describes the improvements done in the Inner Detector and its combined performance in the first year of data taking after the LHC restart in 2015.

  12. EnviroAtlas - Memphis, TN - EnviroAtlas Community Boundary

    Data.gov (United States)

    U.S. Environmental Protection Agency — This EnviroAtlas dataset shows the boundary of the Memphis, TN EnviroAtlas Community. It represents the outside edge of all the block groups included in the...

  13. From hybrid to CMOS pixels ... a possibility for LHC's pixel future?

    International Nuclear Information System (INIS)

    Hybrid pixel detectors have been invented for the LHC to make tracking and vertexing possible at all in LHC's radiation intense environment. The LHC pixel detectors have meanwhile very successfully fulfilled their promises and R and D for the planned HL-LHC upgrade is in full swing, targeting even higher ionising doses and non-ionising fluences. In terms of rate and radiation tolerance hybrid pixels are unrivaled. But they have disadvantages as well, most notably material thickness, production complexity, and cost. Meanwhile also active pixel sensors (DEPFET, MAPS) have become real pixel detectors but they would by far not stand the rates and radiation faced from HL-LHC. New MAPS developments, so-called DMAPS (depleted MAPS) which are full CMOS-pixel structures with charge collection in a depleted region have come in the R and D focus for pixels at high rate/radiation levels. This goal can perhaps be realised exploiting HV technologies, high ohmic substrates and/or SOI based technologies. The paper covers the main ideas and some encouraging results from prototyping R and D, not hiding the difficulties

  14. From Hybrid to CMOS Pixels ... a possibility for LHC's pixel future?

    CERN Document Server

    Wermes, Norbert

    2015-01-01

    Hybrid pixel detectors have been invented for the LHC to make tracking and vertexing possible at all in LHC's radiation intense environment. The LHC pixel detectors have meanwhile very successfully fulfilled their promises and R\\&D for the planned HL-LHC upgrade is in full swing, targeting even higher ionising doses and non-ionising fluences. In terms of rate and radiation tolerance hybrid pixels are unrivaled. But they have disadvantages as well, most notably material thickness, production complexity, and cost. Meanwhile also active pixel sensors (DEPFET, MAPS) have become real pixel detectors but they would by far not stand the rates and radiation faced from HL-LHC. New MAPS developments, so-called DMAPS (depleted MAPS) which are full CMOS-pixel structures with charge collection in a depleted region have come in the R\\&D focus for pixels at high rate/radiation levels. This goal can perhaps be realised exploiting HV technologies, high ohmic substrates and/or SOI based technologies. The paper covers t...

  15. From hybrid to CMOS pixels ... a possibility for LHC's pixel future?

    Science.gov (United States)

    Wermes, N.

    2015-12-01

    Hybrid pixel detectors have been invented for the LHC to make tracking and vertexing possible at all in LHC's radiation intense environment. The LHC pixel detectors have meanwhile very successfully fulfilled their promises and R&D for the planned HL-LHC upgrade is in full swing, targeting even higher ionising doses and non-ionising fluences. In terms of rate and radiation tolerance hybrid pixels are unrivaled. But they have disadvantages as well, most notably material thickness, production complexity, and cost. Meanwhile also active pixel sensors (DEPFET, MAPS) have become real pixel detectors but they would by far not stand the rates and radiation faced from HL-LHC. New MAPS developments, so-called DMAPS (depleted MAPS) which are full CMOS-pixel structures with charge collection in a depleted region have come in the R&D focus for pixels at high rate/radiation levels. This goal can perhaps be realised exploiting HV technologies, high ohmic substrates and/or SOI based technologies. The paper covers the main ideas and some encouraging results from prototyping R&D, not hiding the difficulties.

  16. Uncooled infrared detectors toward smaller pixel pitch with newly proposed pixel structure

    Science.gov (United States)

    Tohyama, Shigeru; Sasaki, Tokuhito; Endoh, Tsutomu; Sano, Masahiko; Kato, Koji; Kurashina, Seiji; Miyoshi, Masaru; Yamazaki, Takao; Ueno, Munetaka; Katayama, Haruyoshi; Imai, Tadashi

    2013-12-01

    An uncooled infrared (IR) focal plane array (FPA) with 23.5 μm pixel pitch has been successfully demonstrated and has found wide commercial applications in the areas of thermography, security cameras, and other applications. One of the key issues for uncooled IRFPA technology is to shrink the pixel pitch because the size of the pixel pitch determines the overall size of the FPA, which, in turn, determines the cost of the IR camera products. This paper proposes an innovative pixel structure with a diaphragm and beams placed in different levels to realize an uncooled IRFPA with smaller pixel pitch (≦17 μm). The upper level consists of a diaphragm with VOx bolometer and IR absorber layers, while the lower level consists of the two beams, which are designed to be placed on the adjacent pixels. The test devices of this pixel design with 12, 15, and 17 μm pitch have been fabricated on the Si read-out integrated circuit (ROIC) of quarter video graphics array (QVGA) (320×240) with 23.5 μm pitch. Their performances are nearly equal to those of the IRFPA with 23.5 μm pitch. For example, a noise equivalent temperature difference of 12 μm pixel is 63.1 mK for F/1 optics with the thermal time constant of 14.5 ms. Then, the proposed structure is shown to be effective for the existing IRFPA with 23.5 μm pitch because of the improvements in IR sensitivity. Furthermore, the advanced pixel structure that has the beams composed of two levels are demonstrated to be realizable.

  17. ATLAS Event - First Splash of Particles in ATLAS

    CERN Multimedia

    ATLAS Outreach

    2008-01-01

    A simulated event. September 10, 2008 - The ATLAS detector lit up as a flood of particles traversed the detector when the beam was occasionally directed at a target near ATLAS. This allowed ATLAS physicists to study how well the various components of the detector were functioning in preparation for the forthcoming collisions. The first ATLAS data recorded on September 10, 2008 is seen here. Running time 24 seconds

  18. High efficiency pixellated CdTe detector

    International Nuclear Information System (INIS)

    Position sensitive detectors constructed from compound semiconductors (CdTe, CdZnTe, HgI2) are being developed for a variety of applications where high sensitivity and improved energy resolution are significant advantages over scintillator or gas based systems. We have investigated the possibility of using a CdTe detector array in a SPECT gamma camera that would require a high efficiency at 140 keV. The problem of worsening photopeak efficiencies in thick detectors (due to incomplete charge collection) makes it difficult to maintain a high efficiency which, ironically, is the primary reason for choosing a thicker detector. Recent research has shown that following a simple geometrical design criterion can greatly reduce this deleterious effect. This paper reports on the results from a small prototype pixellated array fabricated using this design. We verify the 'small pixel effect' for a detector thickness and pixel size significantly larger than those used in most other work. A 9-element detector (1 x 1 mm pixels, 4 mm thick) has been fabricated and characterized in terms of energy resolution, peak-to-valley ratio and detection efficiency. Testing of the detector in a fast pulse mode to obtain its high count rate response has also been performed. (orig.)

  19. CMS has a heart of pixels

    CERN Multimedia

    2003-01-01

    At the core of CMS, particles will come into contact with tiny detector components, known as pixels, which are almost invisible to the naked eye. With these elementary cells measuring a mere 150 microns (or about 1/10 of a millimetre) along each side, a real technological leap has been made.

  20. Alternative glues for the production of ATLAS silicon strip modules for the Phase-II upgrade of the ATLAS Inner Detector

    OpenAIRE

    Poley, Luise; Bloch, Ingo; Edwards, Sam; Friedrich, Conrad; Gregor, Ingrid-Maria; Jones, Tim; Lacker, Heiko; Pyatt, Simon; Rehnisch, Laura; Sperlich, Dennis; Wilson, John

    2015-01-01

    The Phase-II upgrade of the ATLAS detector for the High Luminosity Large Hadron Collider (HL-LHC) includes the replacement of the current Inner Detector with an all-silicon tracker consisting of pixel and strip detectors. The current Phase-II detector layout requires the construction of 20,000 strip detector modules consisting of sensor, circuit boards and readout chips, which are connected mechanically using adhesives. The adhesive between readout chips and circuit board is a silver epoxy gl...