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Sample records for atlas slhc pixel

  1. Silicon Strip Detectors for the ATLAS sLHC Upgrade

    CERN Document Server

    Miñano, M; The ATLAS collaboration

    2011-01-01

    While the Large Hadron Collider (LHC) at CERN is continuing to deliver an ever-increasing luminosity to the experiments, plans for an upgraded machine called Super-LHC (sLHC) are progressing. The upgrade is foreseen to increase the LHC design luminosity by a factor ten. The ATLAS experiment will need to build a new tracker for sLHC operation, which needs to be suited to the harsh sLHC conditions in terms of particle rates. In order to cope with the increase in pile-up backgrounds at the higher luminosity, an all silicon detector is being designed. To successfully face the increased radiation dose, a new generation of extremely radiation hard silicon detectors is being designed. The left part of figure 1 shows the simulated layout for the ATLAS tracker upgrade to be installed in the volume taken up by the current ATLAS pixel, strip and transition radiation detectors. Silicon sensors with sufficient radiation hardness are the subject of an international R&D programme, working on pixel and strip sensors. The...

  2. Silicon Strip Detectors for the ATLAS sLHC Upgrade

    CERN Document Server

    Soldevila, U; The ATLAS collaboration

    2011-01-01

    While the Large Hadron Collider (LHC) at CERN is continuing to deliver an ever-increasing luminosity to the experiments, plans for an upgraded machine called Super-LHC (sLHC) are progressing. The upgrade is foreseen to increase the LHC design luminosity by a factor ten. The ATLAS experiment will need to build a new tracker for sLHC operation, which needs to be suited to the harsh sLHC conditions in terms of particle rates and radiation doses. In order to cope with the increase in pile-up backgrounds at the higher luminosity, an all silicon detector is being designed. To successfully face the increased radiation dose, a new generation of extremely radiation hard silicon detectors is being designed. Silicon sensors with sufficient radiation hardness are the subject of an international R&D programme, working on pixel and strip sensors. The efforts presented here concentrate on the innermost strip layers. We have developed a large number of prototype planar detectors produced on p-type wafers in a...

  3. The ATLAS Tracker Upgrade: Short Strips Detectors for the SLHC

    CERN Document Server

    Soldevila, U; Lacasta, C; Marti i García, S; Miñano, M

    2009-01-01

    It is foreseen to increase the luminosity of the Large Hadron Collider (LHC) at CERN around 2018 by about an order of magnitude, with the upgraded machine dubbed Super-LHC or sLHC. The ATLAS experiment will require a new tracker for SLHC operation. In order to cope with the order of magnitude increase in pile-up backgrounds at the higher luminosity, an all silicon detector is being designed. The new strip detector will use significantly shorter strips than the current SCT in order to minimise the occupancy. As the increased luminosity will mean a corresponding increase in radiation dose, a new generation of extremely radiation hard silicon detectors is required. A massive R&D programme is underway to develop silicon sensors with sufficient radiation hardness. New front-end electronics and readout systems are being designed to cope with the higher data rates. The challenges of powering and cooling a very large strip detector will be discussed. Ideas on possible schemes for the layout and support mechanics ...

  4. Operation of the ATLAS end-cap calorimeters at sLHC luminosities, an experimental study

    CERN Document Server

    Ferencei, J; The ATLAS collaboration

    2009-01-01

    The expected increase of luminosity at sLHC by a factor of ten with respect to LHC luminosities has serious consequences for the signal reconstruction, radiation hardness requirements and operations of the ATLAS liquid argon calorimeters (EMEC, HEC, FCAL) in the endcap, respectively forward region. Small modules of each type of calorimeter have been built. The layout and the components used are very close to the ones used in the construction of the ATLAS calorimeter. The goal is to simulate in the high intensity proton beam at IHEP /Protvino the particle impact as expected for ATLAS in sLHC. Depending on the position in pseudorapidity |η|, each forward calorimeter has to cope with a different particle and energy flux. Placing absorber elements in-between the various small calorimeter modules, the particle and energy flux as expected in ATLAS later - given the variation due to |η| and longitudinal position - can be simulated very well.

  5. ATLAS Liquid Argon Endcap Calorimeter R and D for sLHC

    CERN Document Server

    Schacht, P; The ATLAS collaboration

    2009-01-01

    The performance of the ATLAS liquid argon endcap has been studied for luminosities as expected for the operation at sLHC. The increase of integrated luminosity by a factor of ten has serious consequences for the signal reconstruction, radiation hardness requirements and operation of the forward liquid argon calorimeters. The response has been studied with small modules of the type as built for ATLAS in a very high intensity beam at IHEP/Protvino. The highest intensity obtained was well above the level of energy impact expected for ATLAS at sLHC. The signal processing of the ATLAS Hadronic Endcap Calorimeters employs the concept of 'active pads' which keeps the detector capacities at the input of the amplifiers small and thereby achieves a fast rise time of the signal. This concept is realized using highly integrated amplifier and summing chips in GaAs technology. With an increase of luminosity by a factor of ten the safety factor for the radiation hardness is essentially eliminated. Therefore new more radiati...

  6. ATLAS Liquid Argon Endcap Calorimeter R and D for sLHC

    CERN Document Server

    Schacht, P; The ATLAS collaboration

    2009-01-01

    The performance of the ATLAS liquid argon endcap has been studied for luminosities as expected for the operation at sLHC. The increase of integrated luminosity by a factor of ten has serious consequences for the signal reconstruction, radiation hardness requirements and operations of the forward liquid argon calorimeters. The response has been studied with small modules of the type as built for ATLAS in a very high intensity beam at IHEP/Protvino. The highest intensity obtained was well above the level of energy impact expected for ATLAS at sLHC. The signal processing of the ATLAS Hadronic Endcap Calorimeter employs the concept of 'active pads' which keeps the detector capacities at the input of the amplifiers small and thereby achieves a fast rise time of the signal. This concept is realized using highly integrated amplifier and summing chips in GaAs technology. With an increase of luminosity by a factor of ten the safety factor for the radiation hardness is essentially eliminated. Therefore new more radiati...

  7. ATLAS ITk Pixel detector

    CERN Document Server

    Gemme, Claudia; The ATLAS collaboration

    2016-01-01

    The high luminosity upgrade of the LHC (HL-LHC) in 2026 will provide new challenge to the ATLAS tracker. The current inner detector will be replaced with a whole silicon tracker which will consist of a five barrel layer Pixel detector surrounded by a four barrel layer Strip detector. The expected high radiation level are requiring the development of upgraded silicon sensors as well as new a front-end chip. The dense tracking environment will require finer granularity detectors. The data rates will require new technologies for high bandwidth data transmission and handling. The current status of the HL-LHC ATLA Pixel detector developments as well as the various layout options will be reviewed.

  8. The ATLAS Tracker Upgrade Short Strips Detectors for the sLHC

    CERN Document Server

    Soldevila, U; Lacasta, C; Marti i García, S; Miñano, M

    2010-01-01

    It is foreseen to increase the luminosity of the Large Hadron Collider (LHC) at CERN around 2018 by about an order of magnitude, with the upgraded machine dubbed Super-LHC or sLHC. The ATLAS experiment will require a new tracker for SLHC operation. In order to cope with the order of magnitude increase in pile-up backgrounds at the higher luminosity, an all silicon detector is being designed. The new strip detector will use significantly shorter strips than the current SCT in order to minimise the occupancy. As the increased luminosity will mean a corresponding increase in radiation dose, a new generation of extremely radiation hard silicon detectors is required. A massive R&D programme is underway to develop silicon sensors with sufficient radiation hardness. New front-end electronics and readout systems are being designed to cope with the higher data rates. The challenges of powering and cooling a very large strip detector will be discussed. Ideas on possible schemes for the layout and support mechanics ...

  9. Upgrade of the Cold Electronics of the ATLAS HEC Calorimeter for sLHC

    CERN Document Server

    Oberlack, H G; Fischer, A; Hambarzumjan, A; Pospelov, G; Reimann, O; Rudert, A; Schacht, P

    2009-01-01

    The signal amplification and summation electronics of the ATLAS Hadronic End-cap Calorimeter (HEC) is operated at the circumference of the HEC calorimeters inside the cryostats in liquid argon. The present electronics is designed to operate at irradiation levels expected for the LHC. For operation at the sLHC the irradiation levels are expected to be a factor 10 higher, therefore a new electronic system might be needed. The technological possibilities are investigated. From irradiation tests of the present HEC electronics it is known that it will operate up to a dose of 55 kGy of ionizing radiation and up to a neutron fluence of 3 * 10**14 n/cm**2, where it shows some degradation of performance. This matches well the requirements of up to 1.5 * 10**13 n/cm**2 for 10 years of LHC operation, including safety factors. For a subsequent sLHC running phase with 10 times higher expected irradiation levels, a more radiation hard HEC electronics will be needed. Therefore generic studies of different technologies have ...

  10. ATLAS IBL: a challenging first step for ATLAS Upgrade at the sLHC

    CERN Document Server

    La Rosa, Alessandro

    2011-01-01

    With the LHC collecting data at 7 TeV, plans are already advancing for a series of upgrades leading eventually to about five times the LHC design luminosity some 10 years from now in the High Luminosity LHC (HL-LHC) project. The upgrades for ATLAS detector will be staged in preparation for HL-LHC. The first upgrade for the Pixel detector will be the construction of a new pixel layer, which will be installed during the first shutdown of the LHC machine foreseen in 2013-14. The new detector, called the Insertable B-Layer (IBL) will be installed between the existing pixel detector and a new, smaller radius beam-pipe at the radius of 3.2 cm. The IBL will require the development of several new technologies to cope with increased radiation and pixel occupancy and also to improve the physics performance through reduction of the pixel size and more stringent material budget. Two different and promising Silicon sensor technologies (planar n-in-n and 3D) are currently under investigation for the IBL. An overview of the...

  11. ATLAS IBL: a challenging first step for ATLAS Upgrade at the sLHC.

    CERN Document Server

    La Rosa, A; The ATLAS collaboration

    2011-01-01

    With the LHC collecting data at 7 TeV, plans are already advancing for a series of upgrades leading eventually to about five times the LHC design luminosity some 10 years from now in the high luminosity LHC (HL-LHC) project. The upgrades for the ATLAS detector will be staged in preparation for HL-LHC. The first upgrade for the pixel detector will be the construction of a new pixel layer which will be installed during the first shutdown of the LHC machine foreseen in 2013-14. The new detector, called the Insertable B Layer (IBL) will be installed between the existing pixel detector and a new, smaller radius beam-pipe at a radius of 3.2 cm. The IBL will require the development of several new technologies to cope with increased radiation and pixel occupancy and also to improve the physics performance through reduction of the pixel size and a more stringent material budget. Two different and promising Silicon sensor technologies, planar n-in-n and 3D, are currently under investigation for the IBL. An overview of ...

  12. Development of new readout electronics for the ATLAS LAr Calorimeter at the sLHC

    CERN Document Server

    Strässner, A

    2009-01-01

    The readout of the ATLAS Liquid Argon (LAr) calorimeter is a complex multi-channel system to amplify, shape, digitize and process signals of the detector cells. The current on-detector electronics is not designed to sustain the ten times higher radiation levels expected at sLHC in the years beyond 2019/2020, and will be replaced by new electronics with a completely different readout scheme. The future on-detector electronics is planned to send out all data continuously at each bunch crossing, as opposed to the current system which only transfers data at a trigger-accept signal. Multiple high-speed and radiation-resistant optical links will transmit 100 Gb/s per front-end board. The off-detector processing units will not only process the data in real-time and provide digital data buffering, but will also implement trigger algorithms. An overview about the various components necessary to develop such a complex system is given. The current R&D activities and architectural studies of the LAr Calorimeter group...

  13. Development of new readout electronics for the ATLAS LAr calorimeter at the sLHC

    CERN Document Server

    Strässner, A

    2009-01-01

    The ATLAS Liquid Argon (LAr) calorimeter consists of 182,486 detector cells whose signals need to be read out, digitized and processed, in order to provide signal timing and the energy deposited in each detector element. The current readout electronics is not designed to sustain the ten times higher radiation levels expected at sLHC in the years beyond 2017, and will be replaced by new electronics with a completely different readout scheme. The future on-detector electronics is planned to send out all data continuously at each bunch crossing, as opposed to the current system which only transfers data at a trigger-accept signal. Multiple high-speed and radiation-resistant optical links will transmit 100 Gbps per front-end board, each covering 128 readout channels. The off-detector processing units will not only process the data in real-time and provide digital data buffering, but will also implement trigger algorithms. An overview about the various components necessary to develop such a complex system will be ...

  14. The ATLAS Silicon Pixel Sensors

    CERN Document Server

    Alam, M S; Einsweiler, K F; Emes, J; Gilchriese, M G D; Joshi, A; Kleinfelder, S A; Marchesini, R; McCormack, F; Milgrome, O; Palaio, N; Pengg, F; Richardson, J; Zizka, G; Ackers, M; Andreazza, A; Comes, G; Fischer, P; Keil, M; Klasen, V; Kühl, T; Meuser, S; Ockenfels, W; Raith, B; Treis, J; Wermes, N; Gössling, C; Hügging, F G; Wüstenfeld, J; Wunstorf, R; Barberis, D; Beccherle, R; Darbo, G; Gagliardi, G; Gemme, C; Morettini, P; Musico, P; Osculati, B; Parodi, F; Rossi, L; Blanquart, L; Breugnon, P; Calvet, D; Clemens, J-C; Delpierre, P A; Hallewell, G D; Laugier, D; Mouthuy, T; Rozanov, A; Valin, I; Aleppo, M; Caccia, M; Ragusa, F; Troncon, C; Lutz, Gerhard; Richter, R H; Rohe, T; Brandl, A; Gorfine, G; Hoeferkamp, M; Seidel, SC; Boyd, GR; Skubic, P L; Sícho, P; Tomasek, L; Vrba, V; Holder, M; Ziolkowski, M; D'Auria, S; del Papa, C; Charles, E; Fasching, D; Becks, K H; Lenzen, G; Linder, C

    2001-01-01

    Prototype sensors for the ATLAS silicon pixel detector have been developed. The design of the sensors is guided by the need to operate them in the severe LHC radiation environment at up to several hundred volts while maintaining a good signal-to-noise ratio, small cell size, and minimal multiple scattering. The ability to be operated under full bias for electrical characterization prior to the attachment of the readout integrated circuit electronics is also desired.

  15. Radiation hardness studies of n{sup +}-in-n planar pixel sensors for the ATLAS upgrades

    Energy Technology Data Exchange (ETDEWEB)

    Altenheiner, S.; Goessling, C.; Jentzsch, J.; Klingenberg, R. [Lehrstuhl fuer Experimentelle Physik IV, TU Dortmund, 44221 Dortmund (Germany); Muenstermann, D., E-mail: Daniel.Muenstermann@TU-Dortmund.de [Lehrstuhl fuer Experimentelle Physik IV, TU Dortmund, 44221 Dortmund (Germany); Rummler, A.; Troska, G.; Wittig, T. [Lehrstuhl fuer Experimentelle Physik IV, TU Dortmund, 44221 Dortmund (Germany)

    2011-12-01

    The ATLAS experiment at the LHC is planning upgrades of its pixel detector to cope with the luminosity increase foreseen in the coming years within the transition from LHC to Super-LHC (SLHC/HL-LHC). Associated with the increase in instantaneous luminosity is a rise of the target integrated luminosity from 730 to about 3000 fb{sup -1} which directly translates into significantly higher radiation damage. These upgrades consist of the installation of a 4th pixel layer, the insertable b-layer IBL, with a mean sensor radius of only 32 mm from the beam axis, before 2016/17. In addition, the complete pixel detector will be exchanged before 2020/21. Being very close to the beam, the radiation damage of the IBL sensors might be as high as 5 Multiplication-Sign 10{sup 15}n{sub eq}cm{sup -2} at their end-of-life. The total fluence of the innermost pixel layer after the SLHC upgrade might even reach 2 Multiplication-Sign 10{sup 16}n{sub eq}cm{sup -2}. To investigate the radiation hardness and suitability of the current ATLAS pixel sensors for these fluences, n{sup +}-in-n silicon pixel sensors from the ATLAS Pixel production have been irradiated by reactor neutrons to the IBL design fluence and been tested with pions at the SPS and with electrons from a {sup 90}Sr source in the laboratory. The collected charge after IBL fluences was found to exceed 10 000 electrons per MIP at 1 kV of bias voltage which is in agreement with data collected with strip sensors. After SLHC fluences, still reliable operation of the devices could be observed with a collected charge of more than 5000 electrons per MIP.

  16. ATLAS Pixel Opto-Electronics

    CERN Document Server

    Arms, K E; Gan, K K; Holder, M; Jackson, P; Johnson, M; Kagan, H; Kass, R; Rahimi, A M; Roggenbuck, A; Rush, C; Schade, P; Smith, S; Ter-Antonian, R; Ziolkowski, M; Zoeller, M M

    2005-01-01

    We have developed two radiation-hard ASICs for optical data transmission in the ATLAS pixel detector at the LHC at CERN: a driver chip for a Vertical Cavity Surface Emitting Laser (VCSEL) diode for 80 Mbit/s data transmission from the detector, and a Bi-Phase Mark decoder chip to recover the control data and 40 MHz clock received optically by a PIN diode. We have successfully implemented both ASICs in 0.25 micron CMOS technology using enclosed layout transistors and guard rings for increased radiation hardness. We present results of the performance of these chips, including irradiation with 24 GeV protons up to 61 Mrad (2.3 x 10e15 p/cm^2).

  17. Commissioning of the ATLAS pixel detector

    Energy Technology Data Exchange (ETDEWEB)

    ATLAS Collaboration; Golling, Tobias

    2008-09-01

    The ATLAS pixel detector is a high precision silicon tracking device located closest to the LHC interaction point. It belongs to the first generation of its kind in a hadron collider experiment. It will provide crucial pattern recognition information and will largely determine the ability of ATLAS to precisely track particle trajectories and find secondary vertices. It was the last detector to be installed in ATLAS in June 2007, has been fully connected and tested in-situ during spring and summer 2008, and is ready for the imminent LHC turn-on. The highlights of the past and future commissioning activities of the ATLAS pixel system are presented.

  18. Operational Experience with the ATLAS Pixel Detector

    CERN Document Server

    Lantzsch, Kerstin; The ATLAS collaboration

    2016-01-01

    Run 2 of the LHC is providing new challenges to track and vertex reconstruction with higher energies, denser jets and higher rates. Therefore the ATLAS experiment has constructed the first 4-layer Pixel detector in HEP, installing a new Pixel layer, also called Insertable B-Layer (IBL). In addition the Pixel detector was refurbished with new service quarter panels to recover about 3% of defective modules lost during run 1 and a new optical readout system to readout the data at higher speed while reducing the occupancy when running with increased luminosity. The commissioning, operation and performance of the 4-layer Pixel Detector will be presented.

  19. Pixel readout chip for the ATLAS experiment

    CERN Document Server

    Ackers, M; Blanquart, L; Bonzom, V; Comes, G; Fischer, P; Keil, M; Kühl, T; Meuser, S; Delpierre, P A; Treis, J; Raith, B A; Wermes, N

    1999-01-01

    Pixel detectors with a high granularity and a very large number of sensitive elements (cells) are a very recent development used for high precision particle detection. At the Large Hadron Collider LHC at CERN (Geneva) a pixel detector with 1.4*10/sup 8/ individual pixel cells is developed for the ATLAS detector. The concept is a hybrid detector. Consisting of a pixel sensor connected to a pixel electronics chip by bump and flip chip technology in one-to-one cell correspondence. The development and prototype results of the pixel front end chip are presented together with the physical and technical requirements to be met at LHC. Lab measurements are reported. (6 refs).

  20. ATLAS Tracker and Pixel Operational Experience

    CERN Document Server

    AUTHOR|(INSPIRE)INSPIRE-00222525; The ATLAS collaboration

    2016-01-01

    The tracking performance of the ATLAS detector relies critically on the silicon and gaseous tracking subsystems that form the ATLAS Inner Detector. Those subsystems have undergone significant hardware and software upgrades to meet the challenges imposed by the higher collision energy, pileup and luminosity that are being delivered by the LHC during Run2. The key status and performance metrics of the Pixel Detector and the Semi Conductor Tracker, are summarised, and the operational experience and requirements to ensure optimum data quality and data taking efficiency are described.

  1. Physics performance of the ATLAS Pixel Detector

    CERN Document Server

    Tsuno, Soshi; The ATLAS collaboration

    2016-01-01

    One noticeable upgrade from Run-1 to Run-2 with ATLAS detector in proton-proton collisions at LHC is the introduction of the new pixel detector, IBL, located on the beam pipe as the extra innermost pixel layer. The tracking and vertex reconstruction are significantly improved and good performance is expected in high level object such a $b$-quark jet tagging, in turn, it leads the better physics results. This note summarizes what is the impact on the IBL detector to the physics results especially focusing on the analyses using the $b$-quark jets throughout 2016 summer physics program.

  2. Physics performance of the ATLAS pixel detector

    Science.gov (United States)

    Tsuno, S.

    2017-01-01

    In preparation for LHC Run-2 the ATLAS detector introduced a new pixel detector, the Insertable B-Layer (IBL). This detector is located between the beampipe and what was the innermost pixel layer. The tracking and vertex reconstruction are significantly improved and good performance is expected in high level objects such a b-quark jet tagging. This in turn, leads to better physics results. This note summarizes the impact of the IBL detector on physics results, especially focusing on the analyses using b-quark jets throughout 2016 summer physics program.

  3. Étude des détecteurs planaires pixels durcis aux radiations pour la mise à jour du détecteur de vertex d'ATLAS

    CERN Document Server

    Benoit, Mathieu

    In this work, is presented a study, using TCAD simulation, of the possible methods of designing of a planar pixel sensors by reducing their inactive area and improving their radiation hardness for use in the Insertable B-Layer (IBL) project and for SLHC upgrade phase for the ATLAS experiment. Different physical models available have been studied to develop a coherent model of radiation damage in silicon that can be used to predict silicon pixel sensor behavior after exposure to radiation. The Multi-Guard Ring Structure,a protection structure used in pixel sensor design was studied to obtain guidelines for the reduction of inactive edges detrimental to detector operation while keeping a good sensor behavior through its lifetime in the ATLAS detector. A campaign of measurement of the sensor's process parameters and electrical behavior to validate and calibrate the TCAD simulation models and results are also presented. A model for diode charge collection in highly irradiated environment was developed to explain ...

  4. Development of thin sensors and a novel interconnection technology for the upgrade of the ATLAS pixel system

    Energy Technology Data Exchange (ETDEWEB)

    Beimforde, Michael

    2010-07-19

    To extend the discovery potential of the experiments at the LHC accelerator a two phase luminosity upgrade towards the super LHC (sLHC) with a maximum instantaneous luminosity of 10{sup 35}/cm{sup 2}s{sup 1} is planned. Retaining the reconstruction efficiency and spatial resolution of the ATLAS tracking detector at the sLHC, new pixel modules have to be developed that have a higher granularity, can be placed closer to the interaction point, and allow for a cost-efficient coverage of a larger pixel detector volume compared to the present one. The reduced distance to the interaction point calls for more compact modules that have to be radiation hard to supply a sufficient charge collection efficiency up to an integrated particle fluence equivalent to that of (1-2).10{sup 16} 1-MeV-neutrons per square centimeter (n{sub eq}/cm{sup 2}). Within this thesis a new module concept was partially realised and evaluated for the operation within an ATLAS pixel detector at the sLHC. This module concept utilizes a novel thin sensor production process for thin n-in-p silicon sensors which potentially allow for a higher radiation hardness at a reduced cost. Furthermore, the new 3D-integration technology ICV-SLID is explored which will allow for increasing the active area of the modules from 71% to about 90% and hence, for employing the modules in the innermost layer of the upgraded ATLAS pixel detector. A semiconductor simulation and measurements of irradiated test sensors are used to optimize the implantation parameters for the inter-pixel isolation of the thin sensors. These reduce the crosstalk between the pixel channels and should allow for operating the sensors during the whole runtime of the experiment without causing junction breakdowns. The characterization of the first production of sensors with active thicknesses of 75 {mu}m and 150 {mu}m proved that thin pixel sensors can be successfully produced with the new process technology. Thin pad sensors with a reduced inactive

  5. Upgrades of the ATLAS Pixel Detector

    CERN Document Server

    Hügging, F; The ATLAS collaboration

    2013-01-01

    The upgrade for the ATLAS detector will undergo different phases towards HL-LHC. The first upgrade for the Pixel Detector (Phase 1) consists in the construction of a new pixel layer, which will be installed during the 1st long shutdown of the LHC machine (LS1) in 2013/14. The new detector, called Insertable B-Layer (IBL), will be inserted between the existing pixel detector and a new (smaller radius) beam-pipe at a radius of about 3.2 cm. The IBL requires the development of several new technologies to cope with the increase of radiation and pixel occupancy as well as to improve the physics performance of the existing pixel detector. The pixel size is reduced and the material budget is minimized by using new lightweight mechanical support materials and a CO2 based cooling system. For Phase 2 upgrade of LHC a complete new 4-layer pixel system is planned as part of a new all silicon Inner Detector. The increase in luminosity to about $5\\cdot 10^{34}$cm$^{-2}$s$^{-1}$ together with a total expected lifetime of ab...

  6. ATLAS rewards two pixel detector suppliers

    CERN Multimedia

    2007-01-01

    Peter Jenni, ATLAS spokesperson, presented the ATLAS supplier award to Herbert Reichl, IZM director, and to Simonetta Di Gioia, from the SELEX company.Two of ATLAS’ suppliers were awarded prizes at a ceremony on Wednesday 13 June attended by representatives of the experiment’s management and of CERN. The prizes went to the Fraunhofer Institut für Zuverlässigkeit und Mikrointegration (IZM) in Berlin and the company SELEX Sistemi Integrati in Rome for the manufacture of modules for the ATLAS pixel detector. SELEX supplied 1500 of the modules for the tracker, while IZM produced a further 1300. The modules, each made up of 46080 channels, form the active part of the ATLAS pixel detector. IZM and SELEX received the awards for the excellent quality of their work: the average number of faulty channels per module was less than 2.10-3. They also stayed within budget and on schedule. The difficulty they faced was designing modules based on electronic components and sensor...

  7. Reliability and performance studies of DC-DC conversion powering scheme for the CMS pixel tracker at SLHC

    CERN Document Server

    Todri, A; Rivera, R; Kwan, S; 10.1088/1748-0221/5/12/C12010

    2010-01-01

    The upgrades of the Large Hadron Collider (LHC) introduce a significant challenge to the power distribution of the detectors. DC-DC conversion is the preferred powering scheme proposed to be integrated for the CMS tracker to deliver high input voltage levels and performing a step-down conversion nearby the detector modules. In this work, we propose a step-up/step-down powering scheme by performing voltage step up at the CAEN supply unit and voltage step down near the detector. We designed step-up converters and investigate the pixel performance and power loss on the FPIX power distribution system. Tests are performed using the PSI46 pixel readout chips on a forward pixel panel module and the DC-DC converters developed at CERN and Fermilab. Reliability studies include the voltage drop measurements on the readout chips and the power supply noise generated from the converter. Performance studies include pixel noise and threshold dispersion results. Comparison between step-down only and step-up/step-down conversi...

  8. Reliability and performance studies of DC-DC conversion powering scheme for the CMS pixel tracker at SLHC

    Energy Technology Data Exchange (ETDEWEB)

    Todri, A; Rivera, R; Kwan, S [Fermi National Accelerator Laboratory, Batavia, IL 60510 (United States); Perera, L, E-mail: atodri@gmail.co [University of Mississippi, University, MS 38677 (United States)

    2010-12-15

    The upgrades of the Large Hadron Collider (LHC) introduce a significant challenge to the power distribution of the detectors. DC-DC conversion is the preferred powering scheme proposed to be integrated for the CMS tracker to deliver high input voltage levels and performing a step-down conversion nearby the detector modules. In this work, we propose a step-up/step-down powering scheme by performing voltage step up at the CAEN supply unit and voltage step down near the detector. We designed step-up converters and investigate the pixel performance and power loss on the FPIX power distribution system. Tests are performed using the PSI46 pixel readout chips on a forward pixel panel module and the DC-DC converters developed at CERN and Fermilab. Reliability studies include the voltage drop measurements on the readout chips and the power supply noise generated from the converter. Performance studies include pixel noise and threshold dispersion results. Comparison between step-down only and step-up/step-down conversion powering schemes are provided.

  9. ATLAS LAr calorimeters readout electronics upgrade R&D for sLHC

    CERN Document Server

    Chen, Hucheng

    2010-01-01

    The ATLAS Liquid Argon (LAr) calorimeters consist of an electromagnetic barrel calorimeter and two end-caps with electromagnetic, hadronic and forward calorimeters. A total of 182,468 signals are digitized and processed real-time on detector, to provide energy and time deposited in each detector element at every occurrence of the Level-1 trigger. A luminosity upgrade of the LHC will occur in the years 2018. The current readout electronics will need to be upgraded to sustain the higher radiation levels. A completely innovative readout scheme is being developed. The front-end readout will send out data continuously at each bunch crossing through high speed radiation resistant optical links, the data will be processed real-time with the possibility of implementing trigger algorithms. This article is an overview of the R&D activities and architectural studies the ATLAS LAr Calorimeter Group is developing.

  10. ATLAS Pixel IBL: Stave Quality Assurance

    CERN Document Server

    The ATLAS collaboration

    2014-01-01

    For Run 2 of the LHC a fourth innermost Pixel Detector layer on a smaller radius beam pipe has been installed in the ATLAS Detector to add redundancy against radiation damage of the current Pixel Detector and to ensure a high quality tracking and b-tagging performance of the Inner Detector over the coming years until the High Luminosity Upgrade. State of the art components have been produced and assembled onto support structures known as staves over the last two years. In total, 20 staves have been built and qualified in a designated Quality Assurance setup at CERN of which 14 have been integrated onto the beam pipe. Results from the testing are presented.

  11. optical links for the atlas pixel detector

    CERN Document Server

    Stucci, Stefania Antonia; The ATLAS collaboration

    2015-01-01

    Optical links are necessary to satisfy the high speed readout over long distances for advanced silicon detector systems. We report on the optical readout used in the newly installed central pixel layer (IBL) in the ATLAS experiment. The off detector readout employs commercial optical to analog converters, which were extensively tested for this application. Performance measurements during installation and commissioning will be shown. With the increasing instantaneous luminosity in the next years, the next layers outwards of IBL of the ATLAS Pixel detector (Layer 1 and Layer 2) will reach their bandwidth limits. A plan to increase the bandwidth by upgrading the off detector readout chain is put in place. The plan also involves new optical readout components, in particular the optical receivers, for which commercial units cannot be used and a new design has been made. The latter allows for a wider operational range in term of data frequency and light input power to match the on-detector sending units on the pres...

  12. Optical links for the ATLAS Pixel detector

    CERN Document Server

    Stucci, Stefania Antonia; The ATLAS collaboration

    2015-01-01

    Optical links are necessary to satisfy the high speed readout over long distances for advanced silicon detector systems. We report on the optical readout used in the newly installed central pixel layer (IBL) in the ATLAS experiment. The off detector readout employs commercial optical to analog converters, which were extensively tested for this application. Performance measurements during installation and commissioning will be shown. With the increasing instantaneous luminosity in the next years, the next layers outwards of IBL of the ATLAS Pixel detector (Layer 1 and Layer 2) will reach their bandwidth limits. A plan to increase the bandwidth by upgrading the off detector readout chain is put in place. The plan also involves new optical readout components, in particular the optical receivers, for which commercial units cannot be used and a new design has been made. The latter allows for a wider operational range in term of data frequency and light input power to match the on-detector sending units on the pres...

  13. The Phase-2 ATLAS ITk Pixel Upgrade

    CERN Document Server

    Flick, Tobias; The ATLAS collaboration

    2016-01-01

    The entire tracking system of the ATLAS experiment will be replaced during the LHC Phase II shutdown (foreseen to take place around 2025) by an all-silicon detector called the “ITk” (Inner Tracker). The pixel detector will comprise the five innermost layers, and will be instrumented with new sensor and readout electronics technologies to improve the tracking performance and cope with the HL-LHC environment, which will be severe in terms of occupancy and radiation. The total surface area of silicon in the new pixel system could measure up to 14 m2, depending on the final layout choice, which is expected to take place in early 2017. Four layout options are being investigated at the moment, two with forward coverage to |eta| < 3.2 and two to |eta| < 4. For each coverage option, a layout with long barrel staves and a layout with novel inclined support structures in the barrel-endcap overlap region are considered. All potential layouts include modules mounted on ring-shaped supports in the endcap regions...

  14. The Phase II ATLAS ITk Pixel Upgrade

    CERN Document Server

    Terzo, Stefano; The ATLAS collaboration

    2017-01-01

    The entire tracking system of the ATLAS experiment will be replaced during the LHC Phase II shutdown (foreseen to take place around 2025) by an all-silicon detector called the "ITk" (Inner Tracker). The innermost portion of ITk will consist of a pixel detector with five layers in the barrel region and and ring-shaped supports in the endcap regions. It will be instrumented with new sensor and readout electronics technologies to improve the tracking performance and cope with the HL-LHC environment, which will be severe in terms of occupancy and radiation. The total surface area of silicon in the new pixel system could measure up to 14 m$^2$ , depending on the final layout choice, which is expected to take place in early 2017. Several layout options are being investigated at the moment, including some with novel inclined support structures in the barrel-endcap overlap region and others with very long innermost barrel layers. Forward coverage could be as high as $|\\eta| < 4$. Supporting structures will be ...

  15. DAQ hardware and software development for the ATLAS Pixel Detector

    CERN Document Server

    Stramaglia, Maria Elena; The ATLAS collaboration

    2015-01-01

    In 2014, the Pixel Detector of the ATLAS experiment has been extended by about 12 million pixels thanks to the installation of the Insertable B-Layer (IBL). Data-taking and tuning procedures have been implemented along with newly designed read-out hardware to support high bandwidth for data readout and calibration. The hardware is supported by an embedded software stack running on the read-out boards. The same boards will be used to upgrade the read-out bandwidth for the two outermost layers of the ATLAS Pixel Barrel (54 million pixels). We present the IBL read-out hardware and the supporting software architecture used to calibrate and operate the 4-layer ATLAS Pixel detector. We discuss the technical implementations and status for data taking, validation of the DAQ system in recent cosmic ray data taking, in-situ calibrations, and results from additional tests in preparation for Run 2 at the LHC.

  16. DAQ Hardware and software development for the ATLAS Pixel Detector

    CERN Document Server

    Stramaglia, Maria Elena; The ATLAS collaboration

    2015-01-01

    In 2014, the Pixel Detector of the ATLAS experiment was extended by about 12 million pixels with the installation of the Insertable B-Layer (IBL). Data-taking and tuning procedures have been implemented by employing newly designed read-out hardware, which supports the full detector bandwidth even for calibration. The hardware is supported by an embedded software stack running on the read-out boards. The same boards will be used to upgrade the read-out bandwidth for the two outermost layers of the ATLAS Pixel Barrel (54 million pixels). We present the IBL read-out hardware and the supporting software architecture used to calibrate and operate the 4-layer ATLAS Pixel detector. We discuss the technical implementations and status for data taking, validation of the DAQ system in recent cosmic ray data taking, in-situ calibrations, and results from additional tests in preparation for Run 2 at the LHC.

  17. ATLAS Pixel Radiation Monitoring with HVPP4 System

    CERN Document Server

    Gorelov, Igor; Seidel, Sally; Toms, Konstantin

    2009-01-01

    In this talk we present the basis for the protocol for radiation monitoring of the ATLAS Pixel Sensors. The monitoring is based on a current measurement system, HVPP4. The status on the ATLAS HVPP4 system development is also presented.

  18. Neural network based cluster creation in the ATLAS Pixel Detector

    CERN Document Server

    Andreazza, A; The ATLAS collaboration

    2012-01-01

    The read-out from individual pixels on planar semi-conductor sensors are grouped into clusters to reconstruct the location where a charged particle passed through the sensor. The resolution given by individual pixel sizes is significantly improved by using the information from the charge sharing be- tween pixels. Such analog cluster creation techniques have been used by the ATLAS experiment for many years to obtain an excellent performance. How- ever, in dense environments, such as those inside high-energy jets, clusters have an increased probability of merging the charge deposited by multiple particles. Recently, a neural network based algorithm which estimates both the cluster position and whether a cluster should be split has been developed for the ATLAS Pixel Detector. The algorithm significantly reduces ambigui- ties in the assignment of pixel detector measurement to tracks and improves the position accuracy with respect to standard techniques by taking into account the 2-dimensional charge distribution.

  19. ATLAS Inner Detector (Pixel Detector and Silicon Tracker)

    CERN Multimedia

    ATLAS Outreach

    2006-01-01

    To raise awareness of the basic functions of the Pixel Detector and Silicon Tracker in the ATLAS detector on the LHC at CERN. This colorful 3D animation is an excerpt from the film "ATLAS-Episode II, The Particles Strike Back." Shot with a bug's eye view of the inside of the detector. The viewer is taken on a tour of the inner workings of the detector, seeing critical pieces of the detector and hearing short explanations of how each works.

  20. Irradiation and beam tests qualification for ATLAS IBL Pixel Modules.

    CERN Document Server

    Rubinskiy, Igor; The ATLAS collaboration

    2011-01-01

    The upgrade for the ATLAS detector will undergo different phases towards HL-LHC. The first upgrade for the Pixel Detector will consist in the construction of a new pixel layer which will be installed during the first shutdown of the LHC machine (foreseen for 2013-14). The new detector, called Insertable B-Layer (IBL), will be inserted between the existing pixel detector and a new (smaller radius) beam-pipe at a radius of 3.2 cm. The IBL will require the development of several new technologies to cope with increase of radiation or pixel occupancy and also to improve the physics performance which will be achieved by reduction of the pixel size and of the material budget. Two different promising Silicon sensor technologies (Planar n-in-n and 3D) are currently under investigation for the pixel detector. An overview of the sensor technologies qualification with particular emphasis on irradiation and beam tests will be presented.

  1. Irradiation and beam tests qualification for ATLAS IBL Pixel Modules

    CERN Document Server

    Rubinskiy, I

    2013-01-01

    The upgrade for the ATLAS detector will have different steps towards HL-LHC. The first upgrade for the Pixel Detector will consist in the construction of a new pixel layer which will be installed during the first shutdown of the LHC machine (foreseen for 2013–2014). The new detector, called Insertable B-Layer (IBL), will be inserted between the existing Pixel Detector and a new (smaller radius) beam-pipe at a radius of 33 mm. The IBL will require the development of several new technologies to cope with the increase in the radiation damage and the pixel occupancy and also to improve the physics performance, which will be achieved by reduction of the pixel size and of the material budget. Two different promising silicon sensor technologies (Planar n-in-n and 3D) are currently under investigation for the Pixel Detector. An overview of the sensor technologies' qualification with particular emphasis on irradiation and beam tests is presented.

  2. Irradiation and beam tests qualification for ATLAS IBL Pixel Modules

    CERN Document Server

    Rubinskiy, Igor

    2013-01-01

    The upgrade for the ATLAS detector will have different steps towards HL-LHC. The first upgrade for the Pixel Detector will consist in the construction of a new pixel layer which will be installed during the first shutdown of the LHC machine (foreseen for 2013-14). The new detector, called Insertable B-Layer (IBL), will be inserted between the existing pixel detector and a new (smaller radius) beam-pipe at a radius of 33 mm. The IBL will require the development of several new technologies to cope with the increase of the radiation damage and the pixel occupancy and also to improve the physics performance, which will be achieved by reduction of the pixel size and of the material budget. Two different promising silicon sensor technologies (Planar n-in-n and 3D) are currently under investigation for the pixel detector. An overview of the sensor technologies’ qualification with particular emphasis on irradiation and beam tests are presented.

  3. Fabrication of ATLAS pixel detector prototypes at IRST

    CERN Document Server

    Boscardin, M; Gregori, P; Zen, M; Zori, N

    2001-01-01

    We report on the development of a fabrication technology for n-on-n silicon pixel detectors oriented to the ATLAS experiment at LHC. The main processing issues and some selected results from the electrical characterization of detector prototypes and related test structures are presented and discussed. (5 refs).

  4. Overview of the ATLAS Insertable B-Layer Pixel Detector

    CERN Document Server

    Pernegger, H; The ATLAS collaboration

    2011-01-01

    ATLAS currently develops a new pixel detector for the first upgrade of its tracking system: The ATLAS Insertable B-Layer Pixel detector (IBL). The new layer will be inserted between the inner most layer of the current pixel detector and a new beam pipe. The sensors are placed at a radius of 3.4cm. The expected high radiation levels and high hit occupancy require new developments for front-end chip and the sensor which can stand radiation levels beyond 5E15 neq/cm2. ATLAS has developed the new FEI4 and new silicon sensors to be used as pixel modules. Furthermore a new lightweight support and cooling structure was developed, which minimizes the overall radiation and allows detector cooling with CO2 at -40C coolant temperature. Currently the overall integration and installation procedure is being developed and test ready for installation in ATLAS in 2013. The presentation summarizes the current state of development of IBL modules, first preliminary test results of the new chip with new sensors, the construction ...

  5. Operational Experience with the ATLAS Pixel Detector at LHC

    CERN Document Server

    Keil, M

    2013-01-01

    The ATLAS Pixel Detector is the innermost detector of the ATLAS experiment at the Large Hadron Collider at CERN, providing high-resolution measurements of charged particle tracks in the high radiation environment close to the collision region. This capability is vital for the identification and measurement of proper decay times of long-lived particles such as b-hadrons, and thus crucial for the ATLAS physics program. The detector provides hermetic coverage with three cylindrical layers and three layers of forward and backward pixel detectors. It consists of approximately 80 million pixels that are individually read out via front-end chips bump-bonded to 1744 n-on-n silicon substrates. In this paper results from the successful operation of the Pixel Detector at the LHC will be presented, including calibration procedures, detector performance and measurements of radiation damage. The detector performance is excellent: more than 95% of the pixels are operational, noise occupancy and hit efficiency exceed the des...

  6. Silicon microstrip detectors in 3D technology for the sLHC

    Energy Technology Data Exchange (ETDEWEB)

    Parzefall, Ulrich [Physikalisches Institut, Universitaet Freiburg, Hermann-Herder-Str. 3, D-79104 Freiburg (Germany)], E-mail: ulrich.parzefall@physik.uni-freiburg.de; Dalla Betta, Gian-Franco [INFN and Universita' di Trento, via Sommarive 14, 38050 Povo di Trento (Italy); Eckert, Simon [Physikalisches Institut, Universitaet Freiburg, Hermann-Herder-Str. 3, D-79104 Freiburg (Germany); Eklund, Lars; Fleta, Celeste [University of Glasgow, Department of Physics and Astronomy, Glasgow G12 8QQ (United Kingdom); Jakobs, Karl; Kuehn, Susanne; Pahn, Gregor [Physikalisches Institut, Universitaet Freiburg, Hermann-Herder-Str. 3, D-79104 Freiburg (Germany); Parkes, Chris; Pennicard, David [University of Glasgow, Department of Physics and Astronomy, Glasgow G12 8QQ (United Kingdom); Ronchin, Sabina [FBK-irst, Center for Materials and Microsystems, via Sommarive 18, 38050 Povo di Trento (Italy); Zoboli, Andrea [INFN and Universita' di Trento, via Sommarive 14, 38050 Povo di Trento (Italy); Zorzi, Nicola [FBK-irst, Center for Materials and Microsystems, via Sommarive 18, 38050 Povo di Trento (Italy)

    2009-08-01

    The projected luminosity upgrade of the large hadron collider (LHC), the sLHC, will constitute a challenging radiation environment for tracking detectors. Massive improvements in radiation hardness are required with respect to the LHC. In the layout for the new ATLAS tracker, silicon strip detectors (SSDs) with short strips cover the region from 28 to 60 cm distance to the beam. These SSDs will be exposed to fluences up to 10{sup 15}N{sub eq}/cm{sup 2}, hence radiation resistance is the major concern. It is advantageous to fuse the superior radiation hardness of the 3D design originally conceived for pixel-style applications with the benefits of the well-known planar technology for strip detectors. This is achieved by ganging rows of 3D columns together to form strips. Several prototype sLHC detector modules using 3D SSD with short strips, processed on p-type silicon, and LHC-speed front-end electronics from the present ATLAS semi-conductor tracker (SCT) were built. The modules were tested before and after irradiation to fluences of 10{sup 15}N{sub eq}/cm{sup 2}. The tests were performed with three systems: a highly focused IR-laser with 5{mu}m spot size to make position-resolved scans of the charge collection efficiency (CCE), a Sr{sup 90}{beta}-source set-up to measure the signal levels for a minimum ionizing particles (MIPs), and a beam test with 180 GeV pions at CERN. This article gives a brief overview of the performance of these 3D modules, and draws conclusions about options for using 3D strip sensors as tracking detectors at the sLHC.

  7. Planar Pixel Sensors for the ATLAS Upgrade: Beam Tests results

    CERN Document Server

    Weingarten, J; Beimforde, M; Benoit, M; Bomben, M; Calderini, G; Gallrapp, C; George, M; Gibson, S; Grinstein, S; Janoska, Z; Jentzsch, J; Jinnouchi, O; Kishida, T; La Rosa, A; Libov, V; Macchiolo, A; Marchiori, G; Münstermann, D; Nagai, R; Piacquadio, G; Ristic, B; Rubinskiy, I; Rummler, A; Takubo, Y; Troska, G; Tsiskaridtze, S; Tsurin, I; Unno, Y; Weigel, P; Wittig, T

    2012-01-01

    Results of beam tests with planar silicon pixel sensors aimed towards the ATLAS Insertable B-Layer and High Luminosity LHC (HL-LHC) upgrades are presented. Measurements include spatial resolution, charge collection performance and charge sharing between neighbouring cells as a function of track incidence angle for different bulk materials. Measurements of n-in-n pixel sensors are presented as a function of fluence for different irradiations. Furthermore p-type silicon sensors from several vendors with slightly differing layouts were tested. All tested sensors were connected by bump-bonding to the ATLAS Pixel read-out chip. We show that both n-type and p-type tested planar sensors are able to collect significant charge even after integrated fluences expected at HL-LHC.

  8. Online calibrations and performance of the ATLAS Pixel Detector

    CERN Document Server

    Keil, M; The ATLAS collaboration

    2010-01-01

    The ATLAS Pixel Detector is the innermost detector of the ATLAS experiment at the Large Hadron Collider at CERN. It consists of 1744 silicon sensors equipped with approximately 80 M electronic channels, providing typically three measurement points with high resolution for particles emerging from the beam-interaction region, thus allowing measuring particle tracks and secondary vertices with very high precision. The readout system of the Pixel Detector is based on a bi-directional optical data transmission system between the detector and the data acquisition system with an individual link for each of the 1744 modules. Signal conversion components are located on both ends, approximately 80 m apart. The talk will give an overview of the calibration and performance of both the detector and its optical readout. The most basic parameter to be tuned and calibrated for the detector electronics is the readout threshold of the individual pixel channels. These need to be carefully tuned to optimise position resolution a...

  9. The ATLAS Insertable B-Layer Pixel Detector

    CERN Document Server

    Pernegger, H; The ATLAS collaboration

    2011-01-01

    ATLAS currently develops a new pixel detector for the first upgrade of its tracking system: The ATLAS Insertable B-Layer Pixel detector (IBL). The new layer will be inserted between the inner most layer of the current pixel detector and a new beam pipe. The sensors are placed at a radius of 3.4 cm. The expected high radiation levels and high hit occupancy require new developments for front-end chip and sensors which can stand radiation levels beyond 5$ imes$10$^{15}$ n$_{eq}$/cm$^{2}$ . ATLAS has developed the new FEI4 chip and new silicon sensors to be used as pixel modules. Furthermore a new lightweight support and cooling structure was developed, which minimizes the overall radiation length and allows detector cooling with CO$_{2}$ at -40 $^{circ}$C coolant temperature. Currently the overall integration and installation procedure is being developed and tested ready for installation in 2013. The paper summarizes the current state of development of IBL modules, first preliminary test results of the new chip ...

  10. Improvement of Event Synchronization in the ATLAS Pixel Readout Development

    Science.gov (United States)

    Adams, Logan; Atlas Collaboration

    2017-01-01

    As the LHC continues in Run2, the B-Layer still uses the Atlas-SiROD Pixel readout system initially developed for Run 1. The higher luminosity occurring during Run 2 results in higher occupancy causing increased desynchronization errors in the Pixel Readout. In order to ensure lasting operation of the B-Layer until it is replaced after Run 3, changes were made to the firmware and software to add debug capabilities to identify when the errors are crossing certain thresholds and change the internal control logic accordingly. These features also allow for better debugging of the Event Counter Reset addition to the firmware. This talk will focus on the features implemented and measurements to demonstrate the positive impact on the Pixel DAQ system. A Pixel front-end chip emulator which can be used for readout system development beyond Run 3 will also be discussed. Presenter is Logan Adams, University of Washington.

  11. Robustness of the ATLAS pixel clustering neural network algorithm

    CERN Document Server

    AUTHOR|(INSPIRE)INSPIRE-00407780; The ATLAS collaboration

    2016-01-01

    Proton-proton collisions at the energy frontier puts strong constraints on track reconstruction algorithms. In the ATLAS track reconstruction algorithm, an artificial neural network is utilised to identify and split clusters of neighbouring read-out elements in the ATLAS pixel detector created by multiple charged particles. The robustness of the neural network algorithm is presented, probing its sensitivity to uncertainties in the detector conditions. The robustness is studied by evaluating the stability of the algorithm's performance under a range of variations in the inputs to the neural networks. Within reasonable variation magnitudes, the neural networks prove to be robust to most variation types.

  12. ATLAS Pixel Group - Photo Gallery from Irradiation

    CERN Multimedia

    2001-01-01

    Photos 1,2,3,4,5,6,7 - Photos taken before irradiation of Pixel Test Analog Chip and Pmbars (April 2000) Photos 8,9,10,11 - Irradiation of VDC chips (May 2000) Photos 12, 13 - Irradiation of Passive Components (June 2000) Photos 14,15, 16 - Irradiation of Marebo Chip (November 1999)

  13. Online Calibration and Performance of the ATLAS Pixel Detector

    CERN Document Server

    Keil, M

    2011-01-01

    The ATLAS Pixel Detector is the innermost detector of the ATLAS experiment at the Large Hadron Collider at CERN. It consists of 1744 silicon sensors equipped with approximately 80 million electronic channels, providing typically three measurement points with high resolution for particles emerging from the beam-interaction region, thus allowing measuring particle tracks and secondary vertices with very high precision. The readout system of the Pixel Detector is based on a bi-directional optical data transmission system between the detector and the data acquisition system with an individual link for each of the 1744 modules. Signal conversion components are located on both ends, approximately 80 m apart. This paper describes the tuning and calibration of the optical links and the detector modules, including measurements of threshold, noise, charge measurement, timing performance and the sensor leakage current.

  14. The ATLAS tracker Pixel detector for HL-LHC

    CERN Document Server

    Gemme, Claudia; The ATLAS collaboration

    2017-01-01

    The high luminosity upgrade of the LHC (HL-LHC) in 2026 will provide new challenges to the ATLAS tracker. The current Inner Detector will be replaced with a whole silicon tracker which will consist of a five barrel layer Pixel detector surrounded by a four barrel layer Strip detector. The expected high radiation levels are requiring the development of upgraded silicon sensors as well as new a front-end chip. The dense tracking environment will require finer granularity detectors. The data rates will require new technologies for high bandwidth data transmission and handling. The current status of the HL-LHC ATLAS Pixel detector developments as well as the various layout options are reviewed.

  15. Optical Links for the ATLAS Pixel Detector

    CERN Document Server

    Gregor, Ingrid-Maria

    In der vorliegenden Dissertation wird eine strahlentolerante optische Datenstrecke mit hoher Datenrate für den Einsatz in dem Hochenergiephysikexperiment Atlas am Lhc Beschleuniger entwickelt. Da die Lhc-Experimente extremen Strahlenbelastungen ausgesetzt sind, müssen die Komponenten spezielle Ansprüche hinsichtlich der Strahlentoleranz erfüllen. Die Qualifikation der einzelnen Bauteile wurde im Rahmen dieser Arbeit durchgeführt. Die zu erwartenden Fluenzen im Atlas Inner Detector für Silizium und Gallium Arsenid (GaAs) wurden berechnet. Siliziumbauteile werden einer Fluenz von bis zu 1.1.1015neq /cm2 in 1 MeV äquivalenten Neutronen ausgesetzt sein, wohingegen GaAs Bauteile bis zu 7.8.1015neq /cm2 ausgesetzt sein werden. Die Strahlentoleranz der einzelnen benötigten Komponenten wie z.B. der Laserdioden sowie der jeweiligen Treiberchips wurde untersucht. Sowohl die Photo- als auch die Laserdioden haben sich als strahlentolerant für die Fluenzen an dem vorgesehenen Radius erwiesen. Aus de...

  16. Monitoring Radiation Damage in the ATLAS Pixel Detector

    CERN Document Server

    Schorlemmer, André Lukas; Große-Knetter, Jörn; Rembser, Christoph; Di Girolamo, Beniamino

    2014-11-05

    Radiation hardness is one of the most important features of the ATLAS pixel detector in order to ensure a good performance and a long lifetime. Monitoring of radiation damage is crucial in order to assess and predict the expected performance of the detector. Key values for the assessment of radiation damage in silicon, such as the depletion voltage and depletion depth in the sensors, are measured on a regular basis during operations. This thesis summarises the monitoring program that is conducted in order to assess the impact of radiation damage and compares it to model predictions. In addition, the physics performance of the ATLAS detector highly depends on the amount of disabled modules in the ATLAS pixel detector. A worrying amount of module failures was observed during run I. Thus it was decided to recover repairable modules during the long shutdown (LS1) by extracting the pixel detector. The impact of the module repairs and module failures on the detector performance is analysed in this thesis.

  17. Calibration Analysis Software for the ATLAS Pixel Detector

    CERN Document Server

    Stramaglia, Maria Elena; The ATLAS collaboration

    2015-01-01

    The calibration of the ATLAS Pixel detector at LHC fulfils two main purposes: to tune the front-end configuration parameters for establishing the best operational settings and to measure the tuning performance through a subset of scans. An analysis framework has been set up in order to take actions on the detector given the outcome of a calibration scan (e.g. to create a mask for disabling noisy pixels). The software framework to control all aspects of the Pixel detector scans and analyses is called Calibration Console. The introduction of a new layer, equipped with new Front End-I4 Chips, required an update the Console architecture. It now handles scans and scans analyses applied together to chips with different characteristics. An overview of the newly developed Calibration Analysis Software will be presented, together with some preliminary result.

  18. Calibration analysis software for the ATLAS Pixel Detector

    Science.gov (United States)

    Stramaglia, Maria Elena

    2016-07-01

    The calibration of the ATLAS Pixel Detector at LHC fulfils two main purposes: to tune the front-end configuration parameters for establishing the best operational settings and to measure the tuning performance through a subset of scans. An analysis framework has been set up in order to take actions on the detector given the outcome of a calibration scan (e.g. to create a mask for disabling noisy pixels). The software framework to control all aspects of the Pixel Detector scans and analyses is called calibration console. The introduction of a new layer, equipped with new FE-I4 chips, required an update of the console architecture. It now handles scans and scan analyses applied together to chips with different characteristics. An overview of the newly developed calibration analysis software will be presented, together with some preliminary results.

  19. Pixel detector modules performance for ATLAS IBL and future pixel detectors

    CERN Document Server

    AUTHOR|(INSPIRE)INSPIRE-00355104; Pernegger, Heinz

    2015-11-06

    The ATLAS Detector is one of the four big particle physics experiments at CERN’s LHC. Its innermost tracking system consisted of the 3-Layer silicon Pixel Detector (~80M readout channels) in the first run (2010-2012). Over the past two years it was refurbished and equipped with new services as well as a new beam monitor. The major upgrade, however, was the Insertable B-Layer (IBL). It adds ~12M readout channels for improved vertexing, tracking robustness and b-tagging performance for the upcoming runs, before the high luminosity upgrade of the LHC will take place. This thesis covers two main aspects of Pixel detector performance studies: The main work was the planning, commissioning and operation of a test bench that meets the requirements of current pixel detector components. Each newly built ATLAS IBL stave was thoroughly tested, following a specifically developed procedure, and initially calibrated in that setup. A variety of production accompanying measurements as well as preliminary results after integ...

  20. Module and electronics developments for the ATLAS ITK pixel system

    CERN Document Server

    Nellist, Clara; The ATLAS collaboration

    2016-01-01

    Summary ATLAS is preparing for an extensive modification of its detector in the course of the planned HL‐ LHC accelerator upgrade around 2025 which includes a replacement of the entire tracking system by an all‐silicon detector (Inner Tracker, ITk). A revised trigger and data taking system is foreseen with triggers expected at lowest level at an average rate of 1 MHz. The five innermost layers of ITk will comprise of a pixel detector built of new sensor and readout electronics technologies to improve the tracking performance and cope with the severe HL‐LHC environment in terms of occupancy and radiation. The total area of the new pixel system could measure up to 14 m2, depending on the final layout choice that is expected to take place in early 2017. A new on‐detector readout chip is designed in the context of the RD53 collaboration in 65 nm CMOS technology. This paper will present the on‐going R&D within the ATLAS ITK project towards the new pixel modules and the off‐detector electronics. Pla...

  1. Development of a Micro Pixel Chamber for the ATLAS Upgrade

    CERN Document Server

    Ochi, Atsuhiko; Komai, Hidetoshi; Edo, Yuki; Yamaguchi, Takahiro

    2012-01-01

    The Micro Pixel Chamber (μ-PIC) is being developed a sacandidate for the muon system of the ATLAS detector for upgrading in LHC experiments. The μ-PIC is a micro-pattern gaseous detector that doesn’t have floating structure such as wires, mesh, or foil. This detector can be made by printed-circuit-board (PCB) technology, which is commercially available and suited for mass production. Operation tests have been performed under high flux neutrons under similar conditions to the ATLAS cavern. Spark rates are measured using several gas mixtures under 7 MeV neutron irradiation, and good properties were observed using neon, ethane, and CF4 mixture of gases.Using resistive materials as electrodes, we are also developing a new μ-PIC, which is not expected to damage the electrodes in the case of discharge sparks.

  2. ATLAS Phase-II-Upgrade Pixel Data Transmission Development

    CERN Document Server

    Wensing, Marius; The ATLAS collaboration

    2016-01-01

    The ATLAS tracking system will be replaced by an all-silicon detector (ITk) in the course of the planned HL-LHC accelerator upgrade around 2025. The readout of the ITk pixel system will be most challenging in terms of data rate and readout speed. Simulation of the on-detector electronics based on the currently foreseen trigger rate of 1 MHz indicate that a readout speed of up to 5 Gbps per data link is necessary. Due to radiation levels, the first part of transmission has to be implemented electrically. System simulation and test results of cable candidates will be presented.

  3. Robustness of the ATLAS pixel clustering neural network algorithm

    CERN Document Server

    Sidebo, Per Edvin; The ATLAS collaboration

    2016-01-01

    Proton-proton collisions at the energy frontier puts strong constraints on track reconstruction algorithms. The algorithms depend heavily on accurate estimation of the position of particles as they traverse the inner detector elements. An artificial neural network algorithm is utilised to identify and split clusters of neighbouring read-out elements in the ATLAS pixel detector created by multiple charged particles. The method recovers otherwise lost tracks in dense environments where particles are separated by distances comparable to the size of the detector read-out elements. Such environments are highly relevant for LHC run 2, e.g. in searches for heavy resonances. Within the scope of run 2 track reconstruction performance and upgrades, the robustness of the neural network algorithm will be presented. The robustness has been studied by evaluating the stability of the algorithm’s performance under a range of variations in the pixel detector conditions.

  4. Validation studies of the ATLAS pixel detector control system

    Energy Technology Data Exchange (ETDEWEB)

    Schultes, Joachim [University of Wuppertal, Gaussstr. 20, 42097 Wuppertal (Germany)]. E-mail: schultes@physik.uni-wuppertal.de; Becks, Karl-Heinz [University of Wuppertal, Gaussstr. 20, 42097 Wuppertal (Germany); Flick, Tobias [University of Wuppertal, Gaussstr. 20, 42097 Wuppertal (Germany); Henss, Tobias [University of Wuppertal, Gaussstr. 20, 42097 Wuppertal (Germany); Imhaeuser, Martin [University of Wuppertal, Gaussstr. 20, 42097 Wuppertal (Germany); Kersten, Susanne [University of Wuppertal, Gaussstr. 20, 42097 Wuppertal (Germany); Kind, Peter [University of Wuppertal, Gaussstr. 20, 42097 Wuppertal (Germany); Lantzsch, Kerstin [University of Wuppertal, Gaussstr. 20, 42097 Wuppertal (Germany); Maettig, Peter [University of Wuppertal, Gaussstr. 20, 42097 Wuppertal (Germany); Reeves, Kendall [University of Wuppertal, Gaussstr. 20, 42097 Wuppertal (Germany); Weingarten, Jens [University of Bonn, Nussallee 12, 53115 Bonn (Germany)

    2006-09-01

    The ATLAS pixel detector consists of 1744 identical silicon pixel modules arranged in three barrel layers providing coverage for the central region, and three disk layers on either side of the primary interaction point providing coverage of the forward regions. Once deployed into the experiment, the detector will employ optical data transfer, with the requisite powering being provided by a complex system of commercial and custom-made power supplies. However, during normal performance and production tests in the laboratory, only single modules are operated and electrical readout is used. In addition, standard laboratory power supplies are used. In contrast to these normal tests, the data discussed here were obtained from a multi-module assembly which was powered and read out using production items: the optical data path, the final design power supply system using close to final services, and the Detector Control System (DCS)

  5. Module and Electronics Developments for the ATLAS ITK Pixel System

    CERN Document Server

    Nellist, Clara; The ATLAS collaboration

    2016-01-01

    ATLAS is preparing for an extensive modification of its detector in the course of the planned HL-LHC accelerator upgrade around 2025 which includes a replacement of the entire tracking system by an all-silicon detector (Inner Tracker, ITk). The five innermost layers of ITk will comprise of a pixel detector built of new sensor and readout electronics technologies to improve the tracking performance and cope with the severe HL-LHC environment in terms of occupancy and radiation. The total area of the new pixel system could measure up to 14 m$^{2}$, depending on the final layout choice that is expected to take place in early 2017. An intense R\\&D activity is taking place in the field of planar, 3D, CMOS sensors to identify the optimal technology for the different pixel layers. In parallel various sensor-chip interconnection options are explored to identify reliable technologies when employing 100-150~$\\mu$m thin chips. While the new read-out chip is being developed by the RD53 Collaboration, the pixel off de...

  6. Module and Electronics Developments for the ATLAS ITK Pixel System

    CERN Document Server

    Rummler, Andr{e}; The ATLAS collaboration

    2016-01-01

    The entire tracking system of the ATLAS experiment will be replaced during the LHC Phase II shutdown around 2025 by an all-silicon detector (Inner Tracker, ITk). The pixel detector will be composed by the five innermost layers, instrumented with new sensor and readout electronics technologies to improve the tracking performance and cope with the severe HL-LHC environment in terms of occupancy and radiation. The total area of the new pixel system could measure up to 14 m^2, depending on the final layout choice that is expected to take place in early 2017. Different designs of planar, 3D, CMOS sensors are being investigated to identify the optimal technology for the different pixel layers. In parallel sensor-chip interconnection options are evaluated in collaboration with industrial partners to identify reliable technologies when employing 100-150 μm thin chips. While the new read-out chip is being developed by the RD53 Collaboration, the pixel off detector read-out electronics will be implemented in the frame...

  7. Pixel-Cluster Counting Luminosity Measurement In ATLAS

    CERN Document Server

    McCormack, William Patrick; The ATLAS collaboration

    2016-01-01

    A precision measurement of the delivered luminosity is a key component of the ATLAS physics program at the Large Hadron Collider (LHC). A fundamental ingredient of the strategy to control the systematic uncertainties affecting the absolute luminosity has been to compare the measure- ments of several luminometers, most of which use more than one counting technique. The level of consistency across the various methods provides valuable cross-checks as well as an estimate of the detector-related systematic uncertainties. This poster describes the development of a luminosity algorithm based on pixel-cluster counting in the recently installed ATLAS inner b-layer (IBL), using data recorded during the 2015 pp run at the LHC. The noise and background contamination of the luminosity-associated cluster count is minimized by a multi-component fit to the measured cluster-size distribution in the forward pixel modules of the IBL. The linearity, long-term stability and statistical precision of the cluster- counting method a...

  8. Pixel-Cluster Counting Luminosity Measurement in ATLAS

    CERN Document Server

    McCormack, William Patrick; The ATLAS collaboration

    2016-01-01

    A precision measurement of the delivered luminosity is a key component of the ATLAS physics program at the Large Hadron Collider (LHC). A fundamental ingredient of the strategy to control the systematic uncertainties affecting the absolute luminosity has been to compare the measurements of several luminometers, most of which use more than one counting technique. The level of consistency across the various methods provides valuable cross-checks as well as an estimate of the detector-related systematic uncertainties. This poster describes the development of a luminosity algorithm based on pixel-cluster counting in the recently installed ATLAS inner b-layer (IBL), using data recorded during the 2015 pp run at the LHC. The noise and background contamination of the luminosity-associated cluster count is minimized by a multi-component fit to the measured cluster-size distribution in the forward pixel modules of the IBL. The linearity, long-term stability and statistical precision of the cluster-counting method are ...

  9. ATLAS Pixel Detector Design For HL-LHC

    CERN Document Server

    Smart, Ben; The ATLAS collaboration

    2016-01-01

    The ATLAS Inner Detector will be replaced for the High-Luminosity LHC (HL-LHC) running in 2026. The new Inner Detector will be called the Inner Tracker (ITk). The ITk will cover an extended eta-range: at least to |eta|<3.2, and likely up to |eta|<4.0. The ITk will be an all-Silicon based detector, consisting of a Silicon strip detector outside of a radius of 362 mm, and a Silicon pixel detector inside of this radius. Several novel designs are being considered for the ITk pixel detector, to cope with high-eta charged particle tracks. These designs are grouped into 'extended' and 'inclined' design-types. Extended designs have long pixel staves with sensors parallel to the beamline, while inclined designs have sensors angled such that they point towards the interaction point. The relative advantages and challenges of these two classes of designs will be examined in this paper, along with the mechanical solutions being considered. Thermal management, radiation-length mapping, and electrical services will al...

  10. ATLAS Pixel Detector Design For HL-LHC

    CERN Document Server

    Smart, Ben; The ATLAS collaboration

    2016-01-01

    The ATLAS Inner Detector will be replaced for the High-Luminosity LHC (HL-LHC) running in 2026. The new Inner Detector will be called the Inner Tracker (ITk). The ITk will cover an extended eta-range: at least to |eta|<3.2, and likely up to |eta|<4.0. The ITk will be an all-Silicon based detector, consisting of a Silicon strip detector outside of a radius of 362mm, and a Silicon pixel detector inside of this radius. Several novel designs are being considered for the ITk pixel detector, to cope with high-eta charged particle tracks. These designs are grouped into 'extended' and 'inclined' design-types. Extended designs have long pixel staves with sensors parallel to the beamline. High-eta particles will therefore hit these sensors at shallow angles, leaving elongated charge clusters. The length of such a charge cluster can be used to estimate the angle of the passing particle. This information can then be used in track reconstruction to improve tracking efficiency and reduce fake rates. Inclined designs ...

  11. ATLAS pixel detector design for the HL-LHC

    Science.gov (United States)

    Smart, B.

    2017-02-01

    The ATLAS Inner Detector will be replaced for the High-Luminosity LHC (HL-LHC) running in 2026. The new Inner Detector is called the Inner Tracker (ITk). The ITk will cover an extended η-range: at least to |η|<3.2, and likely up to 0|η|<4.. The ITk will be an all-Silicon based detector, consisting of a Silicon strip detector outside of a radius of 362 mm, and a Silicon pixel detector inside of this radius. Several novel designs are being considered for the ITk pixel detector, to cope with high-eta charged particle tracks. These designs are grouped into `extended' and `inclined' design-types. Extended designs have long pixel staves with sensors parallel to the beamline, while inclined designs have sensors angled such that they point towards the interaction point. The relative advantages and challenges of these two classes of designs will be examined in this paper, along with the mechanical solutions being considered. Thermal management, radiation-length mapping, and electrical services will also be discussed.

  12. Development and characterization of diamond and 3D-silicon pixel detectors with ATLAS-pixel readout electronics

    Energy Technology Data Exchange (ETDEWEB)

    Mathes, Markus

    2008-12-15

    Hybrid pixel detectors are used for particle tracking in the innermost layers of current high energy experiments like ATLAS. After the proposed luminosity upgrade of the LHC, they will have to survive very high radiation fluences of up to 10{sup 16} particles per cm{sup 2} per life time. New sensor concepts and materials are required, which promise to be more radiation tolerant than the currently used planar silicon sensors. Most prominent candidates are so-called 3D-silicon and single crystal or poly-crystalline diamond sensors. Using the ATLAS pixel electronics different detector prototypes with a pixel geometry of 400 x 50 {mu}m{sup 2} have been built. In particular three devices have been studied in detail: a 3D-silicon and a single crystal diamond detector with an active area of about 1 cm{sup 2} and a poly-crystalline diamond detector of the same size as a current ATLAS pixel detector module (2 x 6 cm{sup 2}). To characterize the devices regarding their particle detection efficiency and spatial resolution, the charge collection inside a pixel cell as well as the charge sharing between adjacent pixels was studied using a high energy particle beam. (orig.)

  13. The Phase II ATLAS Pixel Upgrade: The Inner Tracker (ITk)

    CERN Document Server

    Flick, Tobias; The ATLAS collaboration

    2016-01-01

    The entire tracking system of the ATLAS experiment will be replaced during the LHC Phase II shutdown (foreseen to take place around 2025) by an all-silicon detector called the ITk (Inner Tracker). The pixel detector will comprise the five innermost layers, and will be instrumented with new sensor and readout electronics technologies to improve the tracking performance and cope with the HL-LHC environment, which will be severe in terms of occupancy and radiation. The total surface area of silicon in the new pixel system could measure up to 14 m^2, depending on the final layout choice, which is expected to take place in early 2017. Four layout options are being investigated at the moment, two with forward coverage to eta < 3.2 and two to eta < 4. For each coverage option, a layout with long barrel staves and a layout with novel inclined support structures in the barrel-endcap overlap region are considered. All potential layouts include modules mounted on ring-shaped supports in the endcap regions. Support...

  14. ATLAS Pixel-Optoboard Production and Simulation Studies

    CERN Document Server

    Nderitu, Simon

    At CERN, a Large collider will collide protons at high energies. There are four experiments being built to study the particle properties from the collision. The ATLAS experiment is the largest. It has many sub detectors among which is the Pixel detector which is the innermost part. The Pixel detector has eighty million channels that have to be read out. An optical link is utilized for the read out. It has optical to electronic interfaces both on the detector and off the detector at the counting room. The component on the detector in called the opto-board. This work discusses the production testing of the opto-boards to be installed on the detector. A total of 300 opto-boards including spares have been produced. The production was done in three laboratories among which is the laboratory at the University of Wuppertal which had the responsibility of Post production testing of all the one third of the total opto-boards. The results are discussed in this work. The analysis of the results from the total productio...

  15. Simulations of 3D-Si sensors for the innermost layer of the ATLAS pixel upgrade

    Science.gov (United States)

    Baselga, M.; Pellegrini, G.; Quirion, D.

    2017-03-01

    The LHC is expected to reach luminosities up to 3000 fb-1 and the innermost layer of the ATLAS upgrade plans to cope with higher occupancy and to decrease the pixel size. 3D-Si sensors are a good candidate for the innermost layer of the ATLAS pixel upgrade since they exhibit good performance under high fluences and the new designs will have smaller pixel size to fulfill the electronics expectations. This paper reports TCAD simulations of the 3D-Si sensors designed at IMB-CNM with non-passing-through columns that are being fabricated for the next innermost layer of the ATLAS pixel upgrade. It shows the charge collection response before and after irradiation, and the response of 3D-Si sensors located at large η angles.

  16. Simulations of 3D-Si sensors for the innermost layer of the ATLAS pixel upgrade

    CERN Document Server

    Baselga, Marta

    2017-01-01

    The LHC is expected to reach luminosities up to 3000fb-1 and the innermost layer of the ATLAS upgrade plans to cope with higher occupancy and to decrease the pixel size. 3D-Si sensors are a good candidate for the innermost layer of the ATLAS pixel upgrade since they exhibit good performance under high fluences and the new designs will have smaller pixel size to fulfill the electronics expectations. This paper reports TCAD simulations of the 3D-Si sensors designed at IMB-CNM with non passing-through columns that are being fabricated for the next innermost layer of the ATLAS pixel upgrade, shows the charge collection response before and after irradiation, and the response of 3D-Si sensors located at large $\\eta$ angles.

  17. The upgraded Pixel Detector of the ATLAS Experiment for Run 2 at the Large Hadron Collider

    Energy Technology Data Exchange (ETDEWEB)

    Backhaus, M., E-mail: malte.backhaus@cern.ch

    2016-09-21

    During Run 1 of the Large Hadron Collider (LHC), the ATLAS Pixel Detector has shown excellent performance. The ATLAS collaboration took advantage of the first long shutdown of the LHC during 2013 and 2014 and extracted the ATLAS Pixel Detector from the experiment, brought it to surface and maintained the services. This included the installation of new service quarter panels, the repair of cables, and the installation of the new Diamond Beam Monitor (DBM). Additionally, a completely new innermost pixel detector layer, the Insertable B-Layer (IBL), was constructed and installed in May 2014 between a new smaller beam pipe and the existing Pixel Detector. With a radius of 3.3 cm the IBL is located extremely close to the interaction point. Therefore, a new readout chip and two new sensor technologies (planar and 3D) are used in the IBL. In order to achieve best possible physics performance the material budget was improved with respect to the existing Pixel Detector. This is realized using lightweight staves for mechanical support and a CO{sub 2} based cooling system. This paper describes the improvements achieved during the maintenance of the existing Pixel Detector as well as the performance of the IBL during the construction and commissioning phase. Additionally, first results obtained during the LHC Run 2 demonstrating the distinguished tracking performance of the new Four Layer ATLAS Pixel Detector are presented.

  18. Performance of silicon pixel detectors at small track incidence angles for the ATLAS Inner Tracker upgrade

    Energy Technology Data Exchange (ETDEWEB)

    Viel, Simon, E-mail: sviel@lbl.gov [Physics Division, Lawrence Berkeley National Laboratory and University of California, Berkeley, CA, United States of America (United States); Banerjee, Swagato [Department of Physics, University of Wisconsin, Madison, WI, United States of America (United States); Brandt, Gerhard; Carney, Rebecca; Garcia-Sciveres, Maurice [Physics Division, Lawrence Berkeley National Laboratory and University of California, Berkeley, CA, United States of America (United States); Hard, Andrew Straiton; Kaplan, Laser Seymour; Kashif, Lashkar [Department of Physics, University of Wisconsin, Madison, WI, United States of America (United States); Pranko, Aliaksandr [Physics Division, Lawrence Berkeley National Laboratory and University of California, Berkeley, CA, United States of America (United States); Rieger, Julia [Physics Division, Lawrence Berkeley National Laboratory and University of California, Berkeley, CA, United States of America (United States); II Physikalisches Institut, Georg-August-Universität, Göttingen (Germany); Wolf, Julian [Physics Division, Lawrence Berkeley National Laboratory and University of California, Berkeley, CA, United States of America (United States); Wu, Sau Lan; Yang, Hongtao [Department of Physics, University of Wisconsin, Madison, WI, United States of America (United States)

    2016-09-21

    In order to enable the ATLAS experiment to successfully track charged particles produced in high-energy collisions at the High-Luminosity Large Hadron Collider, the current ATLAS Inner Detector will be replaced by the Inner Tracker (ITk), entirely composed of silicon pixel and strip detectors. An extension of the tracking coverage of the ITk to very forward pseudorapidity values is proposed, using pixel modules placed in a long cylindrical layer around the beam pipe. The measurement of long pixel clusters, detected when charged particles cross the silicon sensor at small incidence angles, has potential to significantly improve the tracking efficiency, fake track rejection, and resolution of the ITk in the very forward region. The performance of state-of-the-art pixel modules at small track incidence angles is studied using test beam data collected at SLAC and CERN. - Highlights: • Extended inner pixel barrel layers are proposed for the ATLAS ITk upgrade. • Test beam results at small track incidence angles validate this ATLAS ITk design. • Long pixel clusters are reconstructed with high efficiency at low threshold values. • Excellent angular resolution is achieved using pixel cluster length information.

  19. Neural network based cluster creation in the ATLAS silicon Pixel Detector

    CERN Document Server

    Andreazza, A; The ATLAS collaboration

    2013-01-01

    The read-out from individual pixels on planar semi-conductor sensors are grouped into clusters to reconstruct the location where a charged particle passed through the sensor. The resolution given by individual pixel sizes is significantly improved by using the information from the charge sharing between pixels. Such analog cluster creation techniques have been used by the ATLAS experiment for many years to obtain an excellent performance. However, in dense environments, such as those inside high-energy jets, clusters have an increased probability of merging the charge deposited by multiple particles. Recently, a neural network based algorithm which estimates both the cluster position and whether a cluster should be split has been developed for the ATLAS Pixel Detector. The algorithm significantly reduces ambiguities in the assignment of pixel detector measurement to tracks within jets and improves the position accuracy with respect to standard interpolation techniques by taking into account the 2-dimensional ...

  20. Neural network based cluster creation in the ATLAS silicon Pixel Detector

    CERN Document Server

    Perez Cavalcanti, T; The ATLAS collaboration

    2012-01-01

    The hit signals read out from pixels on planar semi-conductor sensors are grouped into clusters, to reconstruct the location where a charged particle passed through. The resolution of the individual pixel sizes can be improved significantly using the information from the cluster of adjacent pixels. Such analog cluster creation techniques have been used by the ATLAS experiment for many years giving an excellent performance. However, in dense environments, such as those inside high-energy jets, is likely that the charge deposited by two or more close-by tracks merges into one single cluster. A new pattern recognition algorithm based on neural network methods has been developed for the ATLAS Pixel Detector. This can identify the shared clusters, split them if necessary, and estimate the positions of all particles traversing the cluster. The algorithm significantly reduces ambiguities in the assignment of pixel detector measurements to tracks within jets, and improves the positional accuracy with respect to stand...

  1. DC-DC conversion powering for the CMS tracker at SLHC

    Energy Technology Data Exchange (ETDEWEB)

    Feld, L., E-mail: Lutz.Feld@cern.c [RWTH Aachen University, Sommerfeldstrasse 14, D-52074 Aachen (Germany); Jussen, R.; Karpinski, W.; Klein, K.; Merz, J.; Sammet, J. [RWTH Aachen University, Sommerfeldstrasse 14, D-52074 Aachen (Germany)

    2011-02-01

    A tracker powering scheme based on DC-DC converters close to the detector modules can supply more power through thinner cables. This will allow to satisfy the increased power demands of tracking systems at the SLHC. This article describes the development of DC-DC converters for upgrades of the CMS pixel and tracking systems and addresses system integration issues.

  2. DC-DC Conversion Powering for the CMS Tracker at SLHC

    CERN Document Server

    Feld, Lutz

    2010-01-01

    A tracker powering scheme based on DC-DC converters close to the detector modules can supply more power through thinner cables. This will allow to satisfy the increased power demands of tracking systems at the SLHC. This article describes the development of DC-DC converters for upgrades of the CMS pixel and tracking systems and addresses system integration issues.

  3. Test Beam Results of 3D Silicon Pixel Sensors for the ATLAS upgrade

    CERN Document Server

    Grenier, P; Barbero, M; Bates, R; Bolle, E; Borri, M; Boscardin, M; Buttar, C; Capua, M; Cavalli-Sforza, M; Cobal, M; Cristofoli, A; Dalla Betta, G F; Darbo, G; Da Via, C; Devetak, E; DeWilde, B; Di Girolamo, B; Dobos, D; Einsweiler, K; Esseni, D; Fazio, S; Fleta, C; Freestone, J; Gallrapp, C; Garcia-Sciveres, M; Gariano, G; Gemme, C; Giordani, M P; Gjersdal, H; Grinstein, S; Hansen, T; Hansen, T E; Hansson, P; Hasi, J; Helle, K; Hoeferkamp, M; Hugging, F; Jackson, P; Jakobs, K; Kalliopuska, J; Karagounis, M; Kenney, C; Köhler, M; Kocian, M; Kok, A; Kolya, S; Korokolov, I; Kostyukhin, V; Krüger, H; La Rosa, A; Lai, C H; Lietaer, N; Lozano, M; Mastroberardino, A; Micelli, A; Nellist, C; Oja, A; Oshea, V; Padilla, C; Palestri, P; Parker, S; Parzefall, U; Pater, J; Pellegrini, G; Pernegger, H; Piemonte, C; Pospisil, S; Povoli, M; Roe, S; Rohne, O; Ronchin, S; Rovani, A; Ruscino, E; Sandaker, H; Seidel, S; Selmi, L; Silverstein, D; Sjøbaek, K; Slavicek, T; Stapnes, S; Stugu, B; Stupak, J; Su, D; Susinno, G; Thompson, R; Tsung, J W; Tsybychev, D; Watts, S J; Wermes, N; Young, C; Zorzi, N

    2011-01-01

    Results on beam tests of 3D silicon pixel sensors aimed at the ATLAS Insertable-B-Layer and High Luminosity LHC (HL-LHC)) upgrades are presented. Measurements include charge collection, tracking efficiency and charge sharing between pixel cells, as a function of track incident angle, and were performed with and without a 1.6 T magnetic field oriented as the ATLAS Inner Detector solenoid field. Sensors were bump bonded to the front-end chip currently used in the ATLAS pixel detector. Full 3D sensors, with electrodes penetrating through the entire wafer thickness and active edge, and double-sided 3D sensors with partially overlapping bias and read-out electrodes were tested and showed comparable performance.

  4. Test beam results of 3D silicon pixel sensors for the ATLAS upgrade

    Energy Technology Data Exchange (ETDEWEB)

    Grenier, P., E-mail: grenier@slac.stanford.ed [SLAC National Accelerator Laboratory (United States); Alimonti, G. [INFN Sezione di Milano (Italy); Barbero, M. [Bonn University (Germany); Bates, R. [Glasgow University (United Kingdom); Bolle, E. [Oslo University (Norway); Borri, M. [University of Manchester (United Kingdom); Boscardin, M. [FBK-irst, Trento (Italy); Buttar, C. [Glasgow University (United Kingdom); Capua, M. [INFN Gruppo Collegato di Cosenza and Universita della Calabria (Italy); Cavalli-Sforza, M. [IFAE Barcelona (Spain); Cobal, M.; Cristofoli, A. [INFN Gruppo Collegato di Udine and Universita di Udine (Italy); Dalla Betta, G.-F. [INFN Gruppo Collegato di Trento and DISI Universita di Trento (Italy); Darbo, G. [INFN Sezione di Genova (Italy); Da Via, C. [University of Manchester (United Kingdom); Devetak, E.; DeWilde, B. [Stony Brook University (United States); Di Girolamo, B.; Dobos, D. [CERN (Switzerland); Einsweiler, K. [Lawrence Berkeley National Laboratory (United States)

    2011-05-11

    Results on beam tests of 3D silicon pixel sensors aimed at the ATLAS Insertable B-Layer and High Luminosity LHC (HL-LHC) upgrades are presented. Measurements include charge collection, tracking efficiency and charge sharing between pixel cells, as a function of track incident angle, and were performed with and without a 1.6 T magnetic field oriented as the ATLAS inner detector solenoid field. Sensors were bump-bonded to the front-end chip currently used in the ATLAS pixel detector. Full 3D sensors, with electrodes penetrating through the entire wafer thickness and active edge, and double-sided 3D sensors with partially overlapping bias and read-out electrodes were tested and showed comparable performance.

  5. Recent results of the ATLAS Upgrade Planar Pixel Sensors R&D Project

    CERN Document Server

    AUTHOR|(CDS)2073610

    2011-01-01

    The ATLAS detector has to undergo significant updates at the end of the current decade, in order to withstand the increased occupancy and radiation damage that will be produced by the high-luminosity upgrade of the Large Hadron Collider. In this presentation we give an overview of the recent accomplishments of the R&D activity on the planar pixel sensors for the ATLAS Inner Detector upgrade.

  6. dE/dx measurement in the ATLAS Pixel Detector and its use for particle identification

    CERN Document Server

    The ATLAS collaboration

    2011-01-01

    The ATLAS Pixel Detector provides a measurement of the charge deposited by each track crossing it. This note presents a study of how this information can be used to identify low beta particles. This study uses hits recorded in the 7 TeV proton-proton collisions during the 2010 run period and the corresponding Monte Carlo simulation. The track reconstruction has been done in the standard ATLAS software environment.

  7. Performance of silicon pixel detectors at small track incidence angles for the ATLAS Inner Tracker upgrade

    Science.gov (United States)

    Viel, Simon; Banerjee, Swagato; Brandt, Gerhard; Carney, Rebecca; Garcia-Sciveres, Maurice; Hard, Andrew Straiton; Kaplan, Laser Seymour; Kashif, Lashkar; Pranko, Aliaksandr; Rieger, Julia; Wolf, Julian; Wu, Sau Lan; Yang, Hongtao

    2016-09-01

    In order to enable the ATLAS experiment to successfully track charged particles produced in high-energy collisions at the High-Luminosity Large Hadron Collider, the current ATLAS Inner Detector will be replaced by the Inner Tracker (ITk), entirely composed of silicon pixel and strip detectors. An extension of the tracking coverage of the ITk to very forward pseudorapidity values is proposed, using pixel modules placed in a long cylindrical layer around the beam pipe. The measurement of long pixel clusters, detected when charged particles cross the silicon sensor at small incidence angles, has potential to significantly improve the tracking efficiency, fake track rejection, and resolution of the ITk in the very forward region. The performance of state-of-the-art pixel modules at small track incidence angles is studied using test beam data collected at SLAC and CERN.

  8. Performance of Silicon Pixel Detectors at Small Track Incidence Angles for the ATLAS Inner Tracker Upgrade

    CERN Document Server

    Viel, Simon; The ATLAS collaboration; Brandt, Gerhard; Carney, Rebecca; Garcia-Sciveres, Maurice; Hard, Andrew; Kaplan, Laser Seymour; Kashif, Lashkar; Pranko, Aliaksandr; Rieger, Julia; Wolf, Julian Choate; Wu, Sau Lan; Yang, Hongtao

    2015-01-01

    In order to enable the ATLAS experiment to successfully track charged particles produced in high-energy collisions at the High-Luminosity Large Hadron Collider, the current ATLAS Inner Detector will be replaced by the Inner Tracker (ITk), entirely composed of silicon pixel and strip detectors. An extension of the tracking coverage of the ITk to very forward pseudorapidity values is proposed, using pixel modules placed in a long cylindrical layer around the beam pipe. The measurement of long pixel clusters, detected when charged particles cross the silicon sensor at small incidence angles, has potential to significantly improve the tracking efficiency, fake track rejection, and resolution of the ITk in the very forward region. The performance of state-of-the-art pixel modules at small track incidence angles is studied using test beam data collected at SLAC and CERN.

  9. Pixel architectures in a HV-CMOS process for the ATLAS inner detector upgrade

    Science.gov (United States)

    Degerli, Y.; Godiot, S.; Guilloux, F.; Hemperek, T.; Krüger, H.; Lachkar, M.; Liu, J.; Orsini, F.; Pangaud, P.; Rymaszewski, P.; Wang, T.

    2016-12-01

    In this paper, design details and simulation results of new pixel architectures designed in LFoundry 150 nm high voltage CMOS process in the framework of the ATLAS high luminosity inner detector upgrade are presented. These pixels can be connected to the FE-I4 readout chip via bump bonding or glue and some of them can also be tested without a readout chip. Negative high voltage is applied to the high resistivity (> 2 kΩ .cm) substrate in order to deplete the deep n-well charge collection diode, ensuring good charge collection and radiation tolerance. In these pixels, the front-end has been implemented inside the diode using both NMOS and PMOS transistors. The pixel pitch is 50 μm × 250 μm for all pixels. These pixels have been implemented in a demonstrator chip called LFCPIX.

  10. Planar n{sup +}-in-n silicon pixel sensors for the ATLAS IBL upgrade

    Energy Technology Data Exchange (ETDEWEB)

    Goessling, C.; Klingenberg, R. [Lehrstuhl fuer Experimentelle Physik IV, TU Dortmund, 44221 Dortmund (Germany); Muenstermann, D., E-mail: Daniel.Muenstermann@TU-Dortmund.de [Lehrstuhl fuer Experimentelle Physik IV, TU Dortmund, 44221 Dortmund (Germany); Rummler, A.; Troska, G.; Wittig, T. [Lehrstuhl fuer Experimentelle Physik IV, TU Dortmund, 44221 Dortmund (Germany)

    2011-09-11

    The ATLAS experiment at the LHC is planning to upgrade its pixel detector by the installation of a 4th pixel layer, the insertable b-layer IBL with a mean sensor radius of only 32 mm from the beam axis. Being very close to the beam, the radiation damage of the IBL sensors might be as high as 5x10{sup 15} n{sub eq} cm{sup -2} at their end-of-life. To investigate the radiation hardness and suitability of the current ATLAS pixel sensors for IBL fluences, n{sup +}-in-n silicon pixel sensors from the ATLAS Pixel production have been irradiated by reactor neutrons to the IBL design fluence and been tested with pions at the SPS and with electrons from a {sup 90}Sr source in the laboratory. The collected charge was found to exceed 10 000 electrons per MIP at 1 kV of bias voltage which is in agreement with data collected with strip sensors. With an expected threshold of 3000-4000 electrons, this result suggests that planar n{sup +}-in-n pixel sensors are radiation hard enough to be used as IBL sensor technology.

  11. Development of planar pixel modules for the ATLAS high luminosity LHC tracker upgrade

    Energy Technology Data Exchange (ETDEWEB)

    Allport, P.P. [Department of Physics, University of Liverpool (United Kingdom); Ashby, J.; Bates, R.L.; Blue, A. [SUPA, School of Physics and Astronomy, University of Glasgow (United Kingdom); Burdin, S. [Department of Physics, University of Liverpool (United Kingdom); Buttar, C.M., E-mail: craig.buttar@glasgow.ac.uk [SUPA, School of Physics and Astronomy, University of Glasgow (United Kingdom); Casse, G.; Dervan, P. [Department of Physics, University of Liverpool (United Kingdom); Doonan, K. [SUPA, School of Physics and Astronomy, University of Glasgow (United Kingdom); Forshaw, D. [Department of Physics, University of Liverpool (United Kingdom); Lipp, J. [The Science and Technology Facilities Council, Rutherford Appleton Laboratory (United Kingdom); McMullen, T. [SUPA, School of Physics and Astronomy, University of Glasgow (United Kingdom); Pater, J. [School of Physics and Astronomy, University of Manchester (United Kingdom); Stewart, A. [SUPA, School of Physics and Astronomy, University of Glasgow (United Kingdom); Tsurin, I. [Department of Physics, University of Liverpool (United Kingdom)

    2014-11-21

    The high-luminosity LHC will present significant challenges for tracking systems. ATLAS is preparing to upgrade the entire tracking system, which will include a significantly larger pixel detector. This paper reports on the development of large area planar detectors for the outer pixel layers and the pixel endcaps. Large area sensors have been fabricated and mounted onto 4 FE-I4 readout ASICs, the so-called quad-modules, and their performance evaluated in the laboratory and testbeam. Results from characterisation of sensors prior to assembly, experience with module assembly, including bump-bonding and results from laboratory and testbeam studies are presented.

  12. Optical Readout in a Multi-Module System Test for the ATLAS Pixel Detector

    CERN Document Server

    Flick, T; Gerlach, P; Kersten, S; Mättig, P; Kirichu, S N; Reeves, K; Richter, J; Schultes, J; Flick, Tobias; Becks, Karl-Heinz; Gerlach, Peter; Kersten, Susanne; Maettig, Peter; Kirichu, Simon Nderitu; Reeves, Kendall; Richter, Jennifer; Schultes, Joachim

    2006-01-01

    The innermost part of the ATLAS experiment at the LHC, CERN, will be a pixel detector. The command messages and the readout data of the detector are transmitted over an optical data path. The readout chain consists of many components which are produced at several locations around the world, and must work together in the pixel detector. To verify that these parts are working together as expected a system test has been built up. In this paper the system test setup and the operation of the readout chain is described. Also, some results of tests using the final pixel detector readout chain are given.

  13. FE-I4 Chip Development for Upgraded ATLAS Pixel Detector at LHC

    CERN Document Server

    Barbero, M; The ATLAS collaboration

    2010-01-01

    A new ATLAS pixel chip FE-I4 has been developed for use in upgraded LHC luminosity environments, including the near-term Insertable B-Layer upgrade. FE-I4 is designed in a 130 nm CMOS technology, presenting advantages in terms of radiation tolerance and digital logic density compared to the 0.25 μm CMOS technology used for the current ATLAS pixel IC, FE-I3. FE-I4 architecture is based on an array of 80×336 pixels, each 50×250 μm2, consisting of analog and digital sections. The analog pixel section is designed for low power consumption and compatibility to several sensor candidates. It is based on a two-stage architecture with a pre-amp AC-coupled to a second stage of amplification. It features leakage current compensation circuitry, local 4-bit pre-amp feedback tuning and a discriminator locally adjusted through 5 configuration bits. The digital architecture is based on a 4-pixel unit called Pixel Digital Region (PDR) allowing for local storage of hits in 5-deep data buffers at pixel level for the duratio...

  14. The upgraded Pixel Detector of the ATLAS Experiment for Run 2 at the Large Hadron Collider

    CERN Document Server

    Backhaus, M

    2016-01-01

    During Run 1 of the Large Hadron Collider (LHC), the ATLAS Pixel Detector has shown excellent performance. The ATLAS collaboration took advantage of the first long shutdown of the LHC during 2013 and 2014 and extracted the ATLAS Pixel Detector from the experiment, brought it to surface and maintained the services. This included the installation of new service quarter panels, the repair of cables, and the installation of the new Diamond Beam Monitor (DBM). Additionally, a completely new innermost pixel detector layer, the Insertable B-Layer (IBL), was constructed and installed in May 2014 between a new smaller beam pipe and the existing Pixel Detector. With a radius of 3.3 cm the IBL is located extremely close to the interaction point. Therefore, a new readout chip and two new sensor technologies (planar and 3D) are used in the IBL. In order to achieve best possible physics performance the material budget was improved with respect to the existing Pixel Detector. This is realized using lightweight staves for me...

  15. Novel silicon n-in-p pixel sensors for the future ATLAS upgrades

    Energy Technology Data Exchange (ETDEWEB)

    La Rosa, A., E-mail: alessandro.larosa@cern.ch [Section de Physique (DPNC), Université de Genève, 24 quai Ernest Ansermet, Genève 4, CH-1211 (Switzerland); Gallrapp, C. [CERN, Geneva 23, CH-1211 (Switzerland); Macchiolo, A.; Nisius, R. [Max-Planck-Institut für Physik (Werner-Heisenberg-Institut) Föhringer Ring 6, D-80805 München (Germany); Pernegger, H. [CERN, Geneva 23, CH-1211 (Switzerland); Richter, R.H. [Max-Planck-Institut Halbleiterlabor, Otto Hahn Ring 6, D-81739 München (Germany); Weigell, P. [Max-Planck-Institut für Physik (Werner-Heisenberg-Institut) Föhringer Ring 6, D-80805 München (Germany)

    2013-08-01

    In view of the LHC upgrade phases towards HL-LHC the ATLAS experiment plans to upgrade the inner detector with an all silicon system. The n-in-p silicon technology is a promising candidate for the pixel upgrade thanks to its radiation hardness and cost effectiveness that allow for enlarging the area instrumented with pixel detectors. We present the characterization and performance of novel n-in-p planar pixel sensors produced by CiS (Germany) connected by bump bonding to the ATLAS readout chip FE-I3. These results are obtained before and after irradiation up to a fluence of 10{sup 16}1-MeV n{sub eq}cm{sup −2}, and prove the operability of this kind of sensors in the harsh radiation environment foreseen for the pixel system at HL-LHC. We also present an overview of the new pixel production, which is on-going at CiS for sensors compatible with the new ATLAS readout chip FE-I4.

  16. The upgraded Pixel Detector of the ATLAS Experiment for Run2 at the Large Hadron Collider

    CERN Document Server

    Backhaus, Malte; The ATLAS collaboration

    2015-01-01

    During Run-1 of the Large Hadron Collider (LHC), the ATLAS Pixel Detector has shown excellent performance. The ATLAS collaboration took advantage of the first long shutdown of the LHC during 2013 and 2014 and extracted the ATLAS Pixel Detector from the experiment, brought it to surface and maintained the services. This includes the installation of new service quarter panels, the repair of cables, and the installation of the new Diamond Beam Monitor (DBM). Additionally a completely new innermost pixel detector layer, the Insertable B-Layer (IBL), was constructed and installed in May 2014 between a new smaller beam pipe and the existing Pixel Detector. With a radius of 3.3 cm the IBL is located extremely close to the interaction point. Therefore a new readout chip and two new sensor technologies (planar and 3D) are used in IBL. In order to achieve best possible physics performance the material budget was improved with respect to the existing Pixel Detector. This is realized using lightweight staves for mechanic...

  17. Operational Performance and Status of the ATLAS Pixel Detector at the LHC

    CERN Document Server

    Jentzsch, J; The ATLAS collaboration

    2014-01-01

    The ATLAS Pixel Detector is the innermost detector of the ATLAS experi- ment at the Large Hadron Collider at CERN. The detector provides hermetic coverage with three cylindrical layers and three layers of forward and backward pixel detectors. It consists of approximately 80 million pixels that are individu- ally read out via chips bump-bonded to 1744 n+-in-n silicon substrates. In this talk, results from the successful operation of the Pixel Detector at the LHC and its status after three years of operation will be presented, including moni- toring, calibration procedures, timing optimization and detector performance. The record breaking instantaneous luminosities of 7.7 · 1033 cm−2s−1 recently surpassed at the Large Hadron Collider generate a rapidly increasing particle fluence in the ATLAS Pixel Detector. As the radiation dose accumulates, the first effects of radiation damage are now observable in the silicon sensors. A regular monitoring program has been conducted and reveals an increase in the silico...

  18. Test Beam Results of 3D Silicon Pixel Sensors for the ATLAS upgrade

    Energy Technology Data Exchange (ETDEWEB)

    Grenier, P.; /SLAC; Alimonti, G.; /INFN, Milan; Barbero, M.; /Bonn U.; Bates, R.; /Glasgow U.; Bolle, E.; /Oslo U.; Borri, M.; /Manchester U.; Boscardin, M.; /Fond. Bruno Kessler, Povo; Buttar, C.; /Glasgow U.; Capua, M.; /Calabria U. /INFN, Cosenza; Cavalli-Sforza, M.; /Barcelona, IFAE; Cobal, M.; /Udine U. /INFN, Udine; Cristofoli, A.; /Udine U. /INFN, Udine; Dalla Betta, G.F.; /Trento U. /INFN, Trento; Darbo, G.; /INFN, Genoa; Da Via, C.; /Manchester U.; Devetak, E.; /SUNY, Stony Brook; DeWilde, B.; /SUNY, Stony Brook; Di Girolamo, B.; /CERN; Dobos, D.; /CERN; Einsweiler, K.; /LBL, Berkeley; Esseni, D.; /Udine U. /INFN, Udine /Calabria U. /INFN, Cosenza /Barcelona, Inst. Microelectron. /Manchester U. /CERN /LBL, Berkeley /INFN, Genoa /INFN, Genoa /Udine U. /INFN, Udine /Oslo U. /ICREA, Barcelona /Barcelona, IFAE /SINTEF, Oslo /SINTEF, Oslo /SLAC /SLAC /Bergen U. /New Mexico U. /Bonn U. /SLAC /Freiburg U. /VTT Electronics, Espoo /Bonn U. /SLAC /Freiburg U. /SLAC /SINTEF, Oslo /Manchester U. /Barcelona, IFAE /Bonn U. /Bonn U. /CERN /Manchester U. /SINTEF, Oslo /Barcelona, Inst. Microelectron. /Calabria U. /INFN, Cosenza /Udine U. /INFN, Udine /Manchester U. /VTT Electronics, Espoo /Glasgow U. /Barcelona, IFAE /Udine U. /INFN, Udine /Hawaii U. /Freiburg U. /Manchester U. /Barcelona, Inst. Microelectron. /CERN /Fond. Bruno Kessler, Povo /Prague, Tech. U. /Trento U. /INFN, Trento /CERN /Oslo U. /Fond. Bruno Kessler, Povo /INFN, Genoa /INFN, Genoa /Bergen U. /New Mexico U. /Udine U. /INFN, Udine /SLAC /Oslo U. /Prague, Tech. U. /Oslo U. /Bergen U. /SUNY, Stony Brook /SLAC /Calabria U. /INFN, Cosenza /Manchester U. /Bonn U. /SUNY, Stony Brook /Manchester U. /Bonn U. /SLAC /Fond. Bruno Kessler, Povo

    2011-08-19

    Results on beam tests of 3D silicon pixel sensors aimed at the ATLAS Insertable-B-Layer and High Luminosity LHC (HL-LHC) upgrades are presented. Measurements include charge collection, tracking efficiency and charge sharing between pixel cells, as a function of track incident angle, and were performed with and without a 1.6 T magnetic field oriented as the ATLAS Inner Detector solenoid field. Sensors were bump bonded to the front-end chip currently used in the ATLAS pixel detector. Full 3D sensors, with electrodes penetrating through the entire wafer thickness and active edge, and double-sided 3D sensors with partially overlapping bias and read-out electrodes were tested and showed comparable performance. Full and partial 3D pixel detectors have been tested, with and without a 1.6T magnetic field, in high energy pion beams at the CERN SPS North Area in 2009. Sensors characteristics have been measured as a function of the beam incident angle and compared to a regular planar pixel device. Overall full and partial 3D devices have similar behavior. Magnetic field has no sizeable effect on 3D performances. Due to electrode inefficiency 3D devices exhibit some loss of tracking efficiency for normal incident tracks but recover full efficiency with tilted tracks. As expected due to the electric field configuration 3D sensors have little charge sharing between cells.

  19. Novel Silicon n-in-p Pixel Sensors for the future ATLAS Upgrades

    CERN Document Server

    La Rosa, A; Macchiolo, A; Nisius, R; Pernegger, H; Richter,R H; Weigell, P

    2013-01-01

    In view of the LHC upgrade phases towards HL-LHC the ATLAS experiment plans to upgrade the Inner Detector with an all silicon system. The n-in-p silicon technology is a promising candidate for the pixel upgrade thanks to its radiation hardness and cost eectiveness, that allow for enlarging the area instrumented with pixel detectors. We present the characterization and performance of novel n-in-p planar pixel sensors produced by CiS (Germany) connected by bump bonding to the ATLAS readout chip FE-I3. These results are obtained before and after irradiation up to a fluence of 1016 1-MeV $n_{eq}cm^{-2}$, and prove the operability of this kind of sensors in the harsh radiation environment foreseen for the pixel system at HL-LHC. We also present an overview of the new pixel production, which is on-going at CiS for sensors compatible with the new ATLAS readout chip FE-I4.

  20. Operational performance and status of the ATLAS pixel detector at the LHC

    CERN Document Server

    Ince, T; The ATLAS collaboration

    2013-01-01

    The ATLAS Pixel Detector is the innermost detector of the ATLAS experiment at the Large Hadron Collider at CERN. The detector provides hermetic coverage with three cylindrical layers and three layers of forward and backward pixel detectors. It consists of approximately 80 million pixels that are individually read out via chips bump-bonded to 1744 n-in-n silicon substrates. In this talk, results from the successful operation of the Pixel Detector at the LHC and its status after three years of operation will be presented, including monitoring, calibration procedures, timing optimization and detector performance. The record breaking instantaneous luminosities of 7.7 x 10^33 cm-2 s-1 recently surpassed at the Large Hadron Collider generate a rapidly increasing particle fluence in the ATLAS Pixel Detector. As the radiation dose accumulates, the first effects of radiation damage are now observable in the silicon sensors. A regular monitoring program has been conducted and reveals an increase in the silicon leakage ...

  1. Status and future of the ATLAS Pixel Detector at the LHC

    CERN Document Server

    Rozanov, A; The ATLAS collaboration

    2013-01-01

    The ATLAS Pixel Detector is the innermost detector of the ATLAS experiment at the Large Hadron Collider at CERN. The detector provides hermetic coverage with three cylindrical layers and three layers of forward and backward pixel detectors. It consists of approximately 80 million pixels that are individually read out via chips bump-bonded to 1744 n-in-n silicon substrates. In this talk, results from the successful operation of the Pixel Detector at the LHC and its status after three years of operation will be presented, including monitoring, calibration procedures, timing optimization and detector performance. The record breaking instantaneous luminosities of 7.7 x 10^33 cm-2 s-1 recently surpassed at the Large Hadron Collider generate a rapidly increasing particle fluence in the ATLAS Pixel Detector. As the radiation dose accumulates, the first effects of radiation damage are now observable in the silicon sensors. A regular monitoring program has been conducted and reveals an increase in the silicon leakage ...

  2. Operational Performance and Status of the ATLAS Pixel Detector at the LHC

    CERN Document Server

    Jentzsch, J; The ATLAS collaboration

    2013-01-01

    The ATLAS Pixel Detector is the innermost detector of the ATLAS experiment at the Large Hadron Collider at CERN. The detector provides hermetic coverage with three cylindrical layers and three layers of forward and backward pixel detectors. It consists of approximately 80 million pixels that are individually read out via chips bump-bonded to 1744 n-in-n silicon substrates. In this talk, results from the successful operation of the Pixel Detector at the LHC and its status after three years of operation will be presented, including monitoring, calibration procedures, timing optimization and detector performance. The record breaking instantaneous luminosities of 7.7 x 10^33 cm-2 s-1 recently surpassed at the Large Hadron Collider generate a rapidly increasing particle fluence in the ATLAS Pixel Detector. As the radiation dose accumulates, the first effects of radiation damage are now observable in the silicon sensors. A regular monitoring program has been conducted and reveals an increase in the silicon leakage ...

  3. Achievements of the ATLAS Upgrade Planar Pixel Sensors R&D Project

    CERN Document Server

    Nellist, C

    2015-01-01

    In the framework of the HL-LHC upgrade, the ATLAS experiment plans to introduce an all-silicon inner tracker to cope with the elevated occupancy. To investigate the suitability of pixel sensors using the proven planar technology for the upgraded tracker, the ATLAS Planar Pixel Sensor R&D Project (PPS) was established comprising 19 institutes and more than 90 scientists. The paper provides an overview of the research and development project and highlights accomplishments, among them: beam test results with planar sensors up to innermost layer fluences (> 10^16 n_eq cm^2); measurements obtained with irradiated thin edgeless n-in-p pixel assemblies; recent studies of the SCP technique to obtain almost active edges by postprocessing already existing sensors based on scribing, cleaving and edge passivation; an update on prototyping efforts for large areas: sensor design improvements and concepts for low-cost hybridisation; comparison between Secondary Ion Mass Spectrometry results and TCAD simulations. Togethe...

  4. Thin n-in-p planar pixel modules for the ATLAS upgrade at HL-LHC

    Science.gov (United States)

    Savic, N.; Bergbreiter, L.; Breuer, J.; La Rosa, A.; Macchiolo, A.; Nisius, R.; Terzo, S.

    2017-02-01

    The ATLAS experiment will undergo a major upgrade of the tracker system in view of the high luminosity phase of the LHC (HL-LHC) foreseen to start around 2025. Thin planar pixel modules are promising candidates to instrument the new pixel system, thanks to the reduced contribution to the material budget and their high charge collection efficiency after irradiation. New designs of the pixel cells, with an optimized biasing structure, have been implemented in n-in-p planar pixel productions with sensor thicknesses of 270 μm. Using beam tests, the gain in hit efficiency is investigated as a function of the received irradiation fluence. The outlook for future thin planar pixel sensor productions will be discussed, with a focus on thin sensors with a thickness of 100 and 150 μm and a novel design with the optimized biasing structure and small pixel cells (50×50 and 25×100 μm2). These dimensions are foreseen for the new ATLAS read-out chip in 65 nm CMOS technology and the fine segmentation will represent a challenge for the tracking in the forward region of the pixel system at HL-LHC. To predict the performance of 50×50 μm2 pixels at high η, FE-I4 compatible planar pixel sensors have been studied before and after irradiation in beam tests at high incidence angle with respect to the short pixel direction. Results on cluster shapes, charge collection- and hit efficiency will be shown.

  5. Thin n-in-p planar pixel modules for the ATLAS upgrade at HL-LHC

    CERN Document Server

    INSPIRE-00517212; Breuer, J.; La Rosa, A.; Macchiolo, A.; Nisius, R.; Terzo, S.

    2016-01-01

    The ATLAS experiment will undergo a major upgrade of the tracker system in view of the high luminosity phase of the LHC (HL-LHC) foreseen to start around 2025. Thin planar pixel modules are promising candidates to instrument the new pixel system, thanks to the reduced contribution to the material budget and their high charge collection efficiency after irradiation. New designs of the pixel cells, with an optimized biasing structure, have been implemented in n-in-p planar pixel productions with sensor thicknesses of 270 um. Using beam tests, the gain in hit efficiency is investigated as a function of the received irradiation fluence. The outlook for future thin planar pixel sensor productions will be discussed, with a focus on thin sensors with a thickness of 100 and 150 um and a novel design with the optimized biasing structure and small pixel cells (50 um x 50 um and 25 um x 100 um). These dimensions are foreseen for the new ATLAS read-out chip in 65 nm CMOS technology and the fine segmentation will represen...

  6. Evaluation of the breakdown behaviour of ATLAS silicon pixel sensors after partial guard-ring removal

    Energy Technology Data Exchange (ETDEWEB)

    Goessling, C.; Klingenberg, R. [Lehrstuhl fuer Experimentelle Physik IV, TU Dortmund, 44221 Dortmund (Germany); Muenstermann, D., E-mail: Daniel.Muenstermann@TU-Dortmund.d [Lehrstuhl fuer Experimentelle Physik IV, TU Dortmund, 44221 Dortmund (Germany); Wittig, T. [Lehrstuhl fuer Experimentelle Physik IV, TU Dortmund, 44221 Dortmund (Germany)

    2010-12-11

    To avoid geometrical inefficiencies in the ATLAS pixel detector, the concept of shingling is used up to now in the barrel section. For the upgrades of ATLAS, it is desired to avoid this as it increases the volume and material budget of the pixel layers and complicates the cooling. A direct planar edge-to-edge arrangement of pixel modules has not been possible in the past due to about 1100{mu}m of inactive edge composed of approximately 600{mu}m of guard rings and 500{mu}m of safety margin. In this work, the safety margin and guard rings of ATLAS SingleChip sensors were cut at different positions using a standard diamond dicing saw and irradiated afterwards to explore the breakdown behaviour and the leakage current development. It is found that the inactive edge can be reduced to about 400{mu}m of guard rings with almost no reduction in pre-irradiation testability and leakage current performance. This is in particular important for the insertable b-layer upgrade of ATLAS (IBL) where inactive edges of less than 450{mu}m width are required.

  7. Calibration Analysis Software for the ATLAS Pixel Detector

    CERN Document Server

    Stramaglia, Maria Elena; The ATLAS collaboration

    2015-01-01

    The calibration of the Pixel detector fulfills two main purposes: to tune front-end registers for establishing the best operational settings and to measure the tuning performance through a subset of scans. An analysis framework has been set up in order to take actions on the detector given the outcome of a calibration scan (e.g. to create a mask for disabling noisy pixels). The software framework to control all aspects of the Pixel detector scans and analyses is called Calibration Console. The introduction of a new layer, equipped with new Front End-I4 Chips, required an update the Console architecture. It now handles scans and scans analyses applied toghether to chips with dierent characteristics. An overview of the newly developed Calibration Analysis Software will be presented, together with some preliminary result.

  8. Spatial and vertex resolution studies on the ATLAS Pixel Detector based on Combined Testbeam 2004 data

    CERN Document Server

    Reisinger, Ingo; Klingenberg, Reiner

    2006-01-01

    This diploma thesis deals with spatial and vertex resolution studies on the ATLAS Pixel detector based on real data taken during the Combined Testbeam period 2004 (17th May - 15th November). For the Combined Testbeam a barrel segment of the ATLAS Detector was build up and tested under real experimental conditions. Several data sets, being recorded during that time, are reconstructed by the ATLAS control framework called ATHENA. The input information for the reconstruction of the particle tracks through the Pixel Detector are the so-called spacepoints. Their uncertainty affects the resolution of the reconstructed particle tracks and thus, also the accuracy of the vertex reconstruction. Since traversing particles deposite their charge mostly (but not compellingly) within more than one pixel, all pixels corresponding to one hit have to be grouped together to a cluster. To compute the spacepoint from the cluster information two different strategies can be performed. The first one is a digital clustering, w...

  9. Operational Experience of the ATLAS SemiConductor Tracker and Pixel Detector

    CERN Document Server

    Robinson, Dave; The ATLAS collaboration

    2016-01-01

    The tracking performance of the ATLAS detector relies critically on the silicon and gaseous tracking subsystems that form the ATLAS Inner Detector. Those subsystems have undergone significant hardware and software upgrades to meet the challenges imposed by the higher collision energy, pileup and luminosity that are being delivered by the LHC during Run2. The key status and performance metrics of the Pixel Detector and the Semi Conductor Tracker are summarised, and the operational experience and requirements to ensure optimum data quality and data taking efficiency are described.

  10. ATLAS pixel IBL modules construction experience and developments for future upgrade

    Energy Technology Data Exchange (ETDEWEB)

    Gaudiello, A.

    2015-10-01

    The first upgrade of the ATLAS Pixel Detector is the Insertable B-Layer (IBL), installed in May 2014 in the core of ATLAS. Two different silicon sensor technologies, planar n-in-n and 3D, are used. Sensors are connected with the new generation 130 nm IBM CMOS FE-I4 read-out chip via solder bump-bonds. Production quality control tests were set up to verify and rate the performance of the modules before integration into staves. An overview of module design and construction, the quality control results and production yield will be discussed, as well as future developments foreseen for future detector upgrades.

  11. Characterization of new hybrid pixel module concepts for the ATLAS Insertable B-Layer upgrade

    CERN Document Server

    Backhaus, Malte

    2012-01-01

    The ATLAS Insertable B-Layer (IBL) collaboration plans to insert a fourth pixel layer inside the present Pixel Detector to recover from eventual failures in the current pixel system, especially the b-layer. Additionally the IBL will ensure excellent tracking, vertexing and b-tagging performance during the LHC phase I and add robustness in tracking with high luminosity pile-up. The expected peak luminosity for IBL is 2 to 3centerdot1034 cm-2s-1 and IBL is designed for an integrated luminosity of 700 fb-1. This corresponds to an expected fluence of 5centerdot1015 1 MeV neqcm-2 and a total ionizing dose of 250 MRad. In order to cope with these requirements, two new module concepts are under investigation, both based on a new front end IC, called FE-I4. This IC was designed as readout chip for future ATLAS Pixel Detectors and its first application will be the IBL. The planar pixel sensor (PPS) based module concept benefits from its well understood design, which is kept as similar as possible to the design of the ...

  12. Characterization of new hybrid pixel module concepts for the ATLAS Insertable B-Layer upgrade

    CERN Document Server

    Backhaus, M

    2012-01-01

    The ATLAS Insertable B-Layer (IBL) collaboration plans to insert a fourth pixel layer inside the present Pixel Detector to recover from eventual failures in the current pixel system, especially the b-layer. Additionally the IBL will ensure excellent tracking, vertexing and b-tagging performance during the LHC phase I and add robustness in tracking with high luminosity pile-up. The expected peak luminosity for IBL is 2 to 3•10^34 cm^−2 s^ −1 and IBL is designed for an integrated luminosity of 700 fb^−1 . This corresponds to an expected fluence of 5 • 10^15 1 MeV n_eqcm^−2 and a total ionizing dose of 250 MRad. In order to cope with these requirements, two new module concepts are under investigation, both based on a new front end IC, called FE-I4. This IC was designed as readout chip for future ATLAS Pixel Detectors and its first application will be the IBL. The planar pixel sensor (PPS) based module concept benefits from its well understood design, which is kept as similar as possible to the design...

  13. FE-I4, the new ATLAS pixel chip for upgraded LHC luminosities

    Energy Technology Data Exchange (ETDEWEB)

    Arutinov, David; Barbero, Marlon; Gronewald, Markus; Hemperek, Tomasz; Karagounis, Michael; Krueger, Hans; Kruth, Andre; Wermes, Norbert [Physikalisches Institut, Universitaet Bonn, Nussallee 12, D-53115 Bonn (Germany)

    2010-07-01

    The new ATLAS pixel chip FE-I4 is being developed for use in upgraded luminosity environments, in the framework of the Insertable B-Layer (IBL) project and the outer pixel layers of Super-LHC. FE-I4 is designed in a 130 nm CMOS technology and is based on an array of 80 x 336 pixels, each 50 x x250 {mu}m2 and consisting of analog and digital sections. The analog pixel section is designed for low power consumption. The digital architecture is based on a 4 pixel unit called region, which allows for a power-efficient, low recording inefficiency design, and provides a handle to the problem of timewalk. The chip periphery contains a digital control block, a command decoder, powering blocks, a data reformatting unit, an 8b10b coder and a clock multiplier unit, which handles data transmission up to 160 Mb/s for the IBL. Increased power consumption in the inner layers of ATLAS translates into more material for cooling and power routing, which degrades the tracking and the b-tagging quality. As a consequence the FE-I4 collaboration places severe constraints on the power consumption of all blocks. First full scale FE-I4 submission will occur beginning 2010.

  14. A Leakage Current-based Measurement of the Radiation Damage in the ATLAS Pixel Detector

    CERN Document Server

    Gorelov, Igor; The ATLAS collaboration

    2015-01-01

    A measurement has been made of the radiation damage incurred by the ATLAS Pixel Detector barrel silicon modules from the beginning of operations through the end of 2012. This translates to hadronic fluence received over the full period of operation at energies up to and including 8 TeV. The measurement is based on a per-module measurement of the silicon sensor leakage current. The results are presented as a function of integrated luminosity and compared to predictions by the Hamburg Model. This information can be used to predict limits on the lifetime of the Pixel Detector due to current, for various operating scenarios.

  15. Development of 3D-DDTC pixel detectors for the ATLAS upgrade

    Energy Technology Data Exchange (ETDEWEB)

    Dalla Betta, Gian-Franco, E-mail: dallabe@disi.unitn.it [INFN, Sezione di Padova (Gruppo Collegato di Trento), and DISI, Universita di Trento, Via Sommarive 14, 38123 Povo di Trento (Italy); Boscardin, Maurizio [Fondazione Bruno Kessler (FBK-irst), Via Sommarive 18, 38123 Povo di Trento (Italy); Darbo, Giovanni; Gemme, Claudia [INFN, Sezione di Genova, Via Dodecaneso 33, 16146 Genova (Italy); La Rosa, Alessandro; Pernegger, Heinz [CERN-PH, CH-1211 Geneve 23 (Switzerland); Piemonte, Claudio [Fondazione Bruno Kessler (FBK-irst), Via Sommarive 18, 38123 Povo di Trento (Italy); Povoli, Marco [INFN, Sezione di Padova (Gruppo Collegato di Trento), and DISI, Universita di Trento, Via Sommarive 14, 38123 Povo di Trento (Italy); Ronchin, Sabina [Fondazione Bruno Kessler (FBK-irst), Via Sommarive 18, 38123 Povo di Trento (Italy); Zoboli, Andrea [INFN, Sezione di Padova (Gruppo Collegato di Trento), and DISI, Universita di Trento, Via Sommarive 14, 38123 Povo di Trento (Italy); Zorzi, Nicola [Fondazione Bruno Kessler (FBK-irst), Via Sommarive 18, 38123 Povo di Trento (Italy)

    2011-04-21

    We report on the development of n-on-p, 3D Double-Side Double Type Column (3D-DDTC) pixel detectors fabricated at FBK-irst (Trento, Italy) and oriented to the ATLAS upgrade. The considered fabrication technology is simpler than that required for full 3D detectors with active edge, but the detector efficiency and radiation hardness critically depend on the columnar electrode overlap and should be carefully evaluated. The first assemblies of these sensors (featuring 2, 3, or 4 columns per pixel) with the ATLAS FEI3 read-out chip have been tested in laboratory. Selected results from the electrical and functional characterization with radioactive sources are discussed here.

  16. Development of 3D-DDTC pixel detectors for the ATLAS upgrade

    CERN Document Server

    Betta, G -F Dalla; Darbo, G; Gemme, C; La Rosa, A; Pernegger, H; Piemonte, C; Povoli, M; Ronchin, S; Zoboli, A; Zorzi, N

    2011-01-01

    We report on the development of n-on-p, 3D Double-Side Double Type Column (3D-DDTC) pixel detectors fabricated at FBK-irst (Trento, Italy) and oriented to the ATLAS upgrade. The considered fabrication technology is simpler than that required for full 3D detectors with active edge, but the detector efficiency and radiation hardness critically depend on the columnar electrode overlap and should be carefully evaluated. The first assemblies of these sensors (featuring 2, 3, or 4 columns per pixel) with the ATLAS FEI3 read-out chip have been tested in laboratory. Selected results from the electrical and functional characterization with radioactive sources are here discussed.

  17. Studies for the detector control system of the ATLAS pixel at the HL-LHC

    CERN Document Server

    Püllen, L; Boek, J; Kersten, S; Kind, P; Mättig, P; Zeitnitz, C

    2012-01-01

    experiment will be replaced completely. As part of this redesign there will also be a new pixel detector. This new pixel detector requires a control system which meets the strict space requirements for electronics in the ATLAS experiment. To accomplish this goal we propose a DCS (Detector Control System) network with the smallest form factor currently available. This network consists of a DCS chip located in close proximity to the interaction point and a DCS controller located in the outer regions of the ATLAS detector. These two types of chips form a star shaped network with several DCS chips being controlled by one DCS controller. Both chips are manufactured in deep sub-micron technology. We present prototypes with emphasis on studies concerning single event upsets.

  18. The Pixels find their way to the heart of ATLAS

    CERN Multimedia

    Kevin Einsweiler

    Since the last e-news article on the Pixel Detector in December 2006, there has been much progress. At that time, we were just about to receive the Beryllium beampipe, and to integrate the innermost layer of the Pixel Detector around it. This innermost layer is referred to as the B-layer because of the powerful role it plays in finding the secondary vertices that are the key signature for the presence of b-quarks, and with somewhat greater difficulty, c-quarks and tau leptons. The integration of the central 7m long beampipe into the Pixel Detector was completed in December, and the B-layer was successfully integrated around it. In January this year, we had largely completed the central 1.5m long detector, including the three barrel layers and the three disk layers on each end of the barrel. Although this region contains all of the 80 million readout channels, it cannot be integrated into the Inner Detector without additional services and infrastructure. Therefore, the next step was to add the Service Panels...

  19. Beam Test Studies of 3D Pixel Sensors Irradiated Non-Uniformly for the ATLAS Forward Physics Detector

    Science.gov (United States)

    2013-02-21

    removal of pile up protons. The AFP tracker unit will consist of an array of six pixel sensors placed at 2-3 mm from the Large Hadron Collider (LHC...Experiment at the CERN Large Hadron Collider ”, JINST 3 S08003 (2008). [2] The ATLAS Collaboration, “Letter of Intent for the Phase-I Upgrade of the ATLAS

  20. DC-DC buck converters for the CMS Tracker upgrade at SLHC

    Energy Technology Data Exchange (ETDEWEB)

    Feld, L; Jussen, R; Karpinski, W; Klein, K; Sammet, J, E-mail: Katja.Klein@cern.ch [1. Physikalisches Institut B, RWTH Aachen University, Sommerfeldstrasse 14, 52074 Aachen (Germany)

    2011-01-15

    The CMS experiment at the Large Hadron Collider (LHC) at CERN, Geneva, is planning major upgrades of its current pixel and strip detectors for the LHC luminosity upgrade, known as the SLHC. Due to the larger channel count and - in case of the strip tracker - increased functionality, the powering scheme adopted today, namely parallel powering of several detector modules, has to be abandoned. Instead, a powering scheme based on the DC-DC conversion technique is foreseen, which would lead to lower power losses in the supply cables, and would allow to reduce the material budget of cables and associated electronic boards in the sensitive detector volume. This paper deals with the development, characterisation and optimisation of DC-DC buck converter prototypes for the upgrades of the CMS pixel and strip detectors at the SLHC.

  1. Development of n-in-p pixel modules for the ATLAS upgrade at HL-LHC

    Science.gov (United States)

    Macchiolo, A.; Nisius, R.; Savic, N.; Terzo, S.

    2016-09-01

    Thin planar pixel modules are promising candidates to instrument the inner layers of the new ATLAS pixel detector for HL-LHC, thanks to the reduced contribution to the material budget and their high charge collection efficiency after irradiation. 100-200 μm thick sensors, interconnected to FE-I4 read-out chips, have been characterized with radioactive sources and beam tests at the CERN-SPS and DESY. The results of these measurements are reported for devices before and after irradiation up to a fluence of 14 ×1015 neq /cm2 . The charge collection and tracking efficiency of the different sensor thicknesses are compared. The outlook for future planar pixel sensor production is discussed, with a focus on sensor design with the pixel pitches (50×50 and 25×100 μm2) foreseen for the RD53 Collaboration read-out chip in 65 nm CMOS technology. An optimization of the biasing structures in the pixel cells is required to avoid the hit efficiency loss presently observed in the punch-through region after irradiation. For this purpose the performance of different layouts have been compared in FE-I4 compatible sensors at various fluence levels by using beam test data. Highly segmented sensors will represent a challenge for the tracking in the forward region of the pixel system at HL-LHC. In order to reproduce the performance of 50×50 μm2 pixels at high pseudo-rapidity values, FE-I4 compatible planar pixel sensors have been studied before and after irradiation in beam tests at high incidence angle (80°) with respect to the short pixel direction. Results on cluster shapes, charge collection and hit efficiency will be shown.

  2. Diamond Pixel Modules and the ATLAS Beam Conditions Monitor

    CERN Document Server

    Dobos, D

    2011-01-01

    The ATLAS Beam Conditions Monitor’s (BCM) main purpose is to protect the experiments silicon tracker from beam incidents. In total 16 1x1 cm^2 500 um thick diamond pCVD sensors are used in eight positions around the LHC interaction point. They perform time difference measurements with sub nanosecond resolution to distinguish between particles from a collision and spray particles from a beam incident; an abundance of the latter can lead the BCM to provoke an abort of LHC beam. The BCM diamond detector modules, their readout system and the algorithms used to detect beam incidents are described. Results of the BCM operation with circulating LHC beams and it’s commissioning with first LHC collisions are reported.

  3. The Pixel Detector of the ATLAS experiment for the Run2 at the Large Hadron Collider

    CERN Document Server

    INSPIRE-00237659

    2015-01-01

    The Pixel Detector of the ATLAS experiment has shown excellent performance during the whole Run-1 of LHC. Taking advantage of the long showdown, the detector was extracted from the experiment and brought to surface, to equip it with new service quarter panels, to repair modules and to ease installation of the Insertable B-Layer (IBL). IBL is a fourth layer of pixel detectors, and has been installed in May 2014 between the existing Pixel Detector and a new smaller radius beam-pipe at a radius of 3.3 cm. To cope with the high radiation and pixel occupancy due to the proximity to the interaction point, a new read-out chip and two different silicon sensor technologies (planar and 3D) have been developed. Furthermore, the physics performance will be improved through the reduction of pixel size while, targeting for a low material budget, a new mechanical support using lightweight staves and a CO2 based cooling system have been adopted. An overview of the refurbishing of the Pixel Detect or and of the IBL project as...

  4. Study of FPGA and GPU based pixel calibration for ATLAS IBL

    CERN Document Server

    Dopke, J; The ATLAS collaboration; Flick, T; Gabrielli, A; Grosse-Knetter, J; Krieger, N; Kugel, A; Polini, A; Schroer, N

    2010-01-01

    The insertable B-layer (IBL) is a new stage of the ATLAS pixel detector to be installed around 2014. 12 million pixel are attached to new FE-I4 readout ASICs, each controlling 26680 pixel. Compared to the existing FE-I3 based detector the new system features higher readout speed of 160Mbit/s per ASIC and simplified control. For calibration defined charges are applied to all pixels and the resulting time-over-threshold values are evaluated. In the present system multiple sets of two custom VME cards which employ a combination of FPGA and DSP technology are used for I/O interfacing, formatting and processing. The execution time of 51s to perform a threshold scan on a FE-I3 module of 46080 pixel is composed of 8s control, 29s transfer, 7.5s histogramming and 7s analysis. Extrapolating to FE-I4 the times per module of 53760 pixels are 12ms, 5.8s, 9.4s and 8.3s, a total of 23.5s. We present a proposal for a novel approach to the dominant tasks for FE-I4: histogramming and ananlysis. An FPGA-based histogramming uni...

  5. The upgraded Pixel Detector of the ATLAS experiment for Run-2 at the Large Hadron Collider

    CERN Document Server

    Giordani, MarioPaolo; The ATLAS collaboration

    2016-01-01

    Run-2 of the LHC is providing new challenges to track and vertex reconstruction with higher energies, denser jets and higher rates. Therefore the ATLAS experiment has constructed the first 4-layer Pixel detector in HEP, installing a new Pixel layer, also called Insertable B-Layer (IBL). IBL is a fourth layer of pixel detectors, and has been installed in May 2014 at a radius of 3.3 cm between the existing Pixel Detector and a new smaller radius beam-pipe. The new detector, built to cope with high radiation and expected occupancy, is the first large scale application of 3D detectors and CMOS 130nm technology. In addition the Pixel detector was refurbished with a new service quarter panel to recover about 3% of defective modules lost during run-1 and a new optical readout system to readout the data at higher speed while reducing the occupancy when running with increased luminosity. The commissioning and performance of the 4-layer Pixel Detector, in particular the IBL, will be presented, using collision data.

  6. The ATLAS Pixel Detector for Run II at the Large Hadron Collider

    CERN Document Server

    Marx, Marilyn; The ATLAS collaboration

    2014-01-01

    The Pixel Detector of the ATLAS experiment has shown excellent performance during the whole Run-1 of LHC. Taking advantage of the long showdown, the detector was extracted from the experiment and brought to surface, to equip it with new service quarter panels, to repair modules and to ease installation of the Insertable B-Layer (IBL). IBL is a fourth layer of pixel detectors, and has been installed in May 2014 between the existing Pixel Detector and a new smaller radius beam-pipe at a radius of 3.3 cm. To cope with the high radiation and pixel occupancy due to the proximity to the interaction point, a new read-out chip and two different silicon sensor technologies (planar and 3D) have been developed. Furthermore, the physics performance will be improved through the reduction of pixel size while, targeting for a low material budget, a new mechanical support using lightweight staves and a CO2 based cooling system have been adopted. An overview of the refurbishing of the Pixel Detector and of the IBL project as ...

  7. The upgraded Pixel Detector of the ATLAS Experiment for Run2 at the Large Hadron Collider

    CERN Document Server

    Backhaus, Malte; The ATLAS collaboration

    2015-01-01

    Run-2 of the LHC will provide new challenges to track and vertex reconstruction with higher energies, denser jets and higher rates. Therefore the ATLAS experiment has constructed the first 4-layer Pixel detector in HEP, installing a new Pixel layer, also called Insertable B-Layer (IBL). IBL is a fourth layer of pixel detectors, and has been installed in May 2014 at a radius of 3.3 cm between the existing Pixel Detector and a new smaller radius beam-pipe. To cope with the high radiation and pixel occupancy due to the proximity to the interaction point, two different silicon sensor technologies (planar and 3D) have been developed as well as a new read-out chip within CMOS 130nm technology and with larger area, smaller pixel size and faster readout capability. The new detector is the first large scale application of of 3D detectors and CMOS 130nm technology. An overview of the lessons learned during the IBL project will be presented, focusing on the challenges and highlighting the issues met during the productio...

  8. The Upgraded Pixel Detector of the ATLAS Experiment for Run-2 at the LHC

    CERN Document Server

    Giordani, MarioPaolo; The ATLAS collaboration

    2016-01-01

    Run-2 of the LHC is providing new challenges to track and vertex reconstruction with higher energies, denser jets and higher rates. Therefore the ATLAS experiment has constructed the first 4-layer Pixel detector in HEP, installing a new Pixel layer, also called Insertable B-Layer (IBL). IBL is a fourth layer of pixel detectors, and has been installed in May 2014 at a radius of 3.3 cm between the existing Pixel Detector and a new smaller radius beam-pipe. The new detector, built to cope with high radiation and expected occupancy, is the first large scale application of 3D detectors and CMOS 130 nm technology. In addition the Pixel detector was refurbished with a new service quarter panel to recover about 3% of defective modules lost during run-1 and a new optical readout system to readout the data at higher speed while reducing the occupancy when running with increased luminosity. The commissioning and performance of the 4-layer Pixel Detector, in particular the IBL, will be presented using collision data.

  9. The Upgraded Pixel Detector of the ATLAS Experiment for Run-2

    CERN Document Server

    Ferrere, Didier; The ATLAS collaboration

    2016-01-01

    Run-2 of the LHC is providing new challenges to track and vertex reconstruction with higher energies, denser jets and higher rates. Therefore the ATLAS experiment has constructed the first 4-layer Pixel detector in HEP, installing a new Pixel layer, also called Insertable B-Layer (IBL). IBL is a fourth layer of pixel detectors, and has been installed in May 2014 at a radius of 3.3 cm between the existing Pixel Detector and a new smaller radius beam-pipe. The new detector, built to cope with high radiation and expected occupancy, is the first large scale application of 3D detectors and CMOS 130nm technology. In addition the Pixel detector was refurbished with a new service quarter panel to recover about 3% of defective modules lost during run-1 and a new optical readout system to readout the data at higher speed while reducing the occupancy when running with increased luminosity. The commissioning and performance of the 4-layer Pixel Detector, in particular the IBL, will be presented, using collision data.

  10. The Layer 1 / Layer 2 readout upgrade for the ATLAS Pixel Detector

    CERN Document Server

    Mullier, Geoffrey; The ATLAS collaboration

    2016-01-01

    The Pixel Detector of the ATLAS experiment has shown excellent performance during the whole Run-1 of the Large Hadron Collider (LHC). The increase of instantaneous luminosity foreseen during the LHC Run 2, will lead to an increased detector occupancy that is expected to saturate the readout links of the outermost layers of the pixel detector: Layers 1 and 2. To ensure a smooth data taking under such conditions, the read out system of the recently installed fourth innermost pixel layer, the Insertable B-Layer, was modified to accomodate the needs of the older detector. The Layer 2 upgrade installation took place during the 2015 winter shutdown, with the Layer 1 installation scheduled for 2016. A report of the successful installation, together with the design of novel dedicated optical to electrical converters and the software and firmware updates will be presented.

  11. Digital column readout architecture for the ATLAS pixel 025 mum front end IC

    CERN Document Server

    Mandelli, E; Blanquart, L; Comes, G; Denes, P; Einsweiler, Kevin F; Fischer, P; Marchesini, R; Meddeler, G; Peric, I

    2002-01-01

    A fast low noise, limited power, radiation-hard front-end chip was developed for reading out the Atlas Pixel Silicon Detector. As in the past prototypes, every chip is used to digitize and read out charge and time information from hits on each one of its 2880 inputs. The basic column readout architecture idea was adopted and modified to allow a safe transition to quarter micron technology. Each pixel cell, organized in a 160 multiplied by 18 matrix, can be independently enabled and configured in order to optimize the analog signal response and to prevent defective pixels from saturating the readout. The digital readout organizes hit data coming from each column, with respect to time, and output them on a low-level serial interface. A considerable effort was made to design state machines free of undefined states, where single-point defects and charge deposited by heavy ions in the silicon could have led to unpredicted forbidden states. 7 Refs.

  12. Spectroscopic measurements with the ATLAS FE-I4 pixel readout chip

    Energy Technology Data Exchange (ETDEWEB)

    Pohl, David-Leon; Janssen, Jens; Hemperek, Tomasz; Huegging, Fabian; Wermes, Norbert [Physikalisches Institut der Univeristaet Bonn (Germany)

    2015-07-01

    The ATLAS FE-I4 pixel readout chip is a large (2 x 2 cm{sup 2}) state of the art ASIC used in high energy physics experiments as well as for research and development purposes. While the FE-I4 is optimized for high hit rates it provides very limited charge resolution. Therefore two methods were developed to obtain high resolution single pixel charge spectra with the ATLAS FE-I4. The first method relies on the ability to change the detection threshold in small steps while counting hits from a particle source and has a resolution limited by electronic noise only. The other method uses a FPGA based time-to-digital-converter to digitize the analog charge signal with high precision. The feasibility, performance and challenges of these methods are discussed. First results of sensor characterizations from radioactive sources and test beams with the ATLAS FE-I4 in view of the charge collection efficiency after irradiation are presented.

  13. The Pixel Detector of the ATLAS experiment for the Run 2 at the Large Hadron Collider

    CERN Document Server

    Oide, H; The ATLAS collaboration

    2014-01-01

    The Pixel Detector of the ATLAS experiment has shown excellent performance during the whole Run 1 of LHC. Taking advantage of the long shutdown, the detector was extracted from the experiment and brought to surface, to equip it with new service quarter panels, to repair modules and to ease installation of the Insertable B-Layer (IBL). The IBL is the fourth layer of the Run 2 Pixel Detector, and it was installed in May 2014 between the existing Pixel Detector and the new smaller-radius beam pipe at a radius of 3.3 cm. To cope with the high radiation and pixel occupancy due to the proximity to the interaction point, a new read-out chip and two different silicon sensor technologies (planar and 3D) have been developed. Furthermore, the physics performance will be improved through the reduction of pixel size while, targeting for a low material budget, a new mechanical support using lightweight staves and a CO2 based cooling system have been adopted. IBL construction is now completed. An overview of the IBL project...

  14. Development of n-in-p pixel modules for the ATLAS Upgrade at HL-LHC

    CERN Document Server

    Macchiolo, Anna; Savic, Natascha; Terzo, Stefano

    2016-01-01

    Thin planar pixel modules are promising candidates to instrument the inner layers of the new ATLAS pixel detector for HL-LHC, thanks to the reduced contribution to the material budget and their high charge collection efficiency after irradiation. 100-200 $\\mu$m thick sensors, interconnected to FE-I4 read-out chips, have been characterized with radioactive sources and beam tests at the CERN-SPS and DESY. The results of these measurements are reported for devices before and after irradiation up to a fluence of $14\\times10^{15}$ n$_{eq}$/cm$^2$. The charge collection and tracking efficiency of the different sensor thicknesses are compared. The outlook for future planar pixel sensor production is discussed, with a focus on sensor design with the pixel pitches (50x50 and 25x100 $\\mu$m$^2$) foreseen for the RD53 Collaboration read-out chip in 65 nm CMOS technology. An optimization of the biasing structures in the pixel cells is required to avoid the hit efficiency loss presently observed in the punch-through region...

  15. The upgraded Pixel Detector of the ATLAS Experiment for Run2 at the Large Hadron Collider

    CERN Document Server

    Mullier, Geoffrey Andre; The ATLAS collaboration

    2015-01-01

    The Pixel Detector of the ATLAS experiment has shown excellent performance during the whole Run-1 of LHC. Taking advantage of the long showdown, the detector was extracted from the experiment and brought to surface, to equip it with new service quarter panels, to repair modules and to ease installation of the Insertable B-Layer (IBL), a fourth layer of pixel detectors, installed in May 2014 between the existing Pixel Detector and a new smaller radius beam-pipe at a radius of 3.3 cm. To cope with the high radiation and increased pixel occupancy due to the proximity to the interaction point, two different silicon sensor technologies (planar and 3D) have been developed. A new readout chip has been developed within CMOS 130nm technology with larger area, smaller pixel size and faster readout capability. Dedicated design features in combination with a new composite material were considered and used in order to reduce the material budget of the support structure while keeping the optimal thermo-mechanical performan...

  16. Pixel sensors with different pitch layouts for ATLAS Phase-II upgrade

    CERN Document Server

    Dervan, Paul

    2014-01-01

    Different pitch layouts are considered for the pixel detector being designed for the ATLAS up- graded tracking system which will be operating at the High Luminosity LHC. The tracking per- formance in the Endcap pixel regions could benefit from pixel layouts which differ from the ge- ometries used in the barrel region. Also, the performance in different barrel layers and eta regions could be optimised using different pixel sizes. This presentation will report on the development and tests of pitch layouts which could be readout by the FE-I4 ASICs. The pixel geometries in- clude 50 250 m m 2 , 25 500 m m 2 , 100 125 m m 2 , 125 167 m m 2 , 50 2000 m m 2 and 25 2000 m m 2 . The sensors with geometries 50 250 m m 2 , 25 500 m m 2 and 100 125 m m 2 were irradiated and tested at the DESY testbeam. These and other testbeam results as well as results from characterisation of these sensors in the laboratory will be presented

  17. FE-I4, the New ATLAS Pixel Chip for Upgraded LHC Luminosities

    CERN Document Server

    "Barbero, M; The ATLAS collaboration

    2009-01-01

    The new ATLAS pixel chip FE-I4 is being developed for use in upgraded luminosity environments, in the framework of the Insertable B-Layer (IBL) project but also for the outer pixel layers of Super-LHC. FE-I4 is designed in a 130 nm technology and is based on an array of 80 by 336 pixels, each 50×250 μm2 and consisting of analog and digital sections. The analog pixel section is designed for low power consumption and compatibility to several sensor candidates. The digital architecture is based on a 4 pixel unit called region, which allows for a power-efficient, low recording inefficiency design, and provides an elegant solution to the problem of timewalk. The chip periphery contains a control block, powering blocks, a data reformatting unit, an asynchronous storage FIFO, an 8b10b coder and a clock multiplier unit, which handles data transmission up to 160 Mb/s for the IBL.

  18. Recent Results of the ATLAS Upgrade Planar Pixel Sensors R&D Project

    CERN Document Server

    Weigell, Philipp

    2013-01-01

    To cope with the higher occupancy and radiation damage at the HL-LHC also the LHC experiments will be upgraded. The ATLAS Planar Pixel Sensor R&D Project (PPS) is an international collaboration of 17 institutions and more than 80 scientists, exploring the feasibility of employing planar pixel sensors for this scenario. Depending on the radius, different pixel concepts are investigated using laboratory and beam test measurements. At small radii the extreme radiation environment and strong space constraints are addressed with very thin pixel sensors active thickness in the range of (75-150) mum, and the development of slim as well as active edges. At larger radii the main challenge is the cost reduction to allow for instrumenting the large area of (7-10) m^2. To reach this goal the pixel productions are being transferred to 6 inch production lines. Additionally, investigated are more cost-efficient and industrialised interconnection techniques as well as the n-in-p technology, which, being a single-sided pr...

  19. 3D silicon pixel detectors for the ATLAS Forward Physics experiment

    CERN Document Server

    INSPIRE-00397348; Cavallaro, E.; Grinstein, S.; López Paz, I.

    2015-01-01

    The ATLAS Forward Physics (AFP) project plans to install 3D silicon pixel detectors about 210 m away from the interaction point and very close to the beamline (2-3 mm). This implies the need of slim edges of about 100-200 $\\mu$m width for the sensor side facing the beam to minimise the dead area. Another challenge is an expected non-uniform irradiation of the pixel sensors. It is studied if these requirements can be met using slightly-modified FE-I4 3D pixel sensors from the ATLAS Insertable B-Layer production. AFP-compatible slim edges are obtained with a simple diamond-saw cut. Electrical characterisations and beam tests are carried out and no detrimental impact on the leakage current and hit efficiency is observed. For devices without a 3D guard ring a remaining insensitive edge of less than 15 $\\mu$m width is found. Moreover, 3D detectors are non-uniformly irradiated up to fluences of several 10$^{15}$ n$_{eq}$/cm$^2$ with either a focussed 23 GeV proton beam or a 23 MeV proton beam through holes in Al ma...

  20. SLID-ICV Vertical Integration Technology for the ATLAS Pixel Upgrades

    CERN Document Server

    Macchiolo, A; Moser, H G; Nisius, R; Richter, R H; Weigell, P

    2012-01-01

    We present the results of the characterization of pixel modules composed of 75 μm thick n-in-p sensors and ATLAS FE-I3 chips, interconnected with the SLID (Solid Liquid Inter-Diffusion) technology. This technique, developed at Fraunhofer-EMFT, is explored as an alternative to the bump-bonding process. These modules have been designed to demonstrate the feasibility of a very compact detector to be employed in the future ATLAS pixel upgrades, making use of vertical integration technologies. This module concept also envisages Inter-Chip-Vias (ICV) to extract the signals from the backside of the chips, thereby achieving a higher fraction of active area with respect to the present pixel module design. In the case of the demonstrator module, ICVs are etched over the original wire bonding pads of the FE-I3 chip. In the modules with ICVs the FE-I3 chips will be thinned down to 50 um. The status of the ICV preparation is presented.

  1. A neural network clustering algorithm for the ATLAS silicon pixel detector

    CERN Document Server

    Aad, Georges; Abdallah, Jalal; Abdel Khalek, Samah; Abdinov, Ovsat; Aben, Rosemarie; Abi, Babak; Abolins, Maris; AbouZeid, Ossama; Abramowicz, Halina; Abreu, Henso; Abreu, Ricardo; Abulaiti, Yiming; Acharya, Bobby Samir; Adamczyk, Leszek; Adams, David; Adelman, Jahred; Adomeit, Stefanie; Adye, Tim; Agatonovic-Jovin, Tatjana; Aguilar-Saavedra, Juan Antonio; Agustoni, Marco; Ahlen, Steven; Ahmadov, Faig; Aielli, Giulio; Akerstedt, Henrik; Åkesson, Torsten Paul Ake; Akimoto, Ginga; Akimov, Andrei; Alberghi, Gian Luigi; Albert, Justin; Albrand, Solveig; Alconada Verzini, Maria Josefina; Aleksa, Martin; Aleksandrov, Igor; Alexa, Calin; Alexander, Gideon; Alexandre, Gauthier; Alexopoulos, Theodoros; Alhroob, Muhammad; Alimonti, Gianluca; Alio, Lion; Alison, John; Allbrooke, Benedict; Allison, Lee John; Allport, Phillip; Almond, John; Aloisio, Alberto; Alonso, Alejandro; Alonso, Francisco; Alpigiani, Cristiano; Altheimer, Andrew David; Alvarez Gonzalez, Barbara; Alviggi, Mariagrazia; Amako, Katsuya; Amaral Coutinho, Yara; Amelung, Christoph; Amidei, Dante; Amor Dos Santos, Susana Patricia; Amorim, Antonio; Amoroso, Simone; Amram, Nir; Amundsen, Glenn; Anastopoulos, Christos; Ancu, Lucian Stefan; Andari, Nansi; Andeen, Timothy; Anders, Christoph Falk; Anders, Gabriel; Anderson, Kelby; Andreazza, Attilio; Andrei, George Victor; Anduaga, Xabier; Angelidakis, Stylianos; Angelozzi, Ivan; Anger, Philipp; Angerami, Aaron; Anghinolfi, Francis; Anisenkov, Alexey; Anjos, Nuno; Annovi, Alberto; Antonaki, Ariadni; Antonelli, Mario; Antonov, Alexey; Antos, Jaroslav; Anulli, Fabio; Aoki, Masato; Aperio Bella, Ludovica; Apolle, Rudi; Arabidze, Giorgi; Aracena, Ignacio; Arai, Yasuo; Araque, Juan Pedro; Arce, Ayana; Arguin, Jean-Francois; Argyropoulos, Spyridon; Arik, Metin; Armbruster, Aaron James; Arnaez, Olivier; Arnal, Vanessa; Arnold, Hannah; Arratia, Miguel; Arslan, Ozan; Artamonov, Andrei; Artoni, Giacomo; Asai, Shoji; Asbah, Nedaa; Ashkenazi, Adi; Åsman, Barbro; Asquith, Lily; Assamagan, Ketevi; Astalos, Robert; Atkinson, Markus; Atlay, Naim Bora; Auerbach, Benjamin; Augsten, Kamil; Aurousseau, Mathieu; Avolio, Giuseppe; Azuelos, Georges; Azuma, Yuya; Baak, Max; Baas, Alessandra; Bacci, Cesare; Bachacou, Henri; Bachas, Konstantinos; Backes, Moritz; Backhaus, Malte; Backus Mayes, John; Badescu, Elisabeta; Bagiacchi, Paolo; Bagnaia, Paolo; Bai, Yu; Bain, Travis; Baines, John; Baker, Oliver Keith; Balek, Petr; Balli, Fabrice; Banas, Elzbieta; Banerjee, Swagato; Bannoura, Arwa A E; Bansal, Vikas; Bansil, Hardeep Singh; Barak, Liron; Baranov, Sergei; Barberio, Elisabetta Luigia; Barberis, Dario; Barbero, Marlon; Barillari, Teresa; Barisonzi, Marcello; Barklow, Timothy; Barlow, Nick; Barnett, Bruce; Barnett, Michael; Barnovska, Zuzana; Baroncelli, Antonio; Barone, Gaetano; Barr, Alan; Barreiro, Fernando; Barreiro Guimarães da Costa, João; Bartoldus, Rainer; Barton, Adam Edward; Bartos, Pavol; Bartsch, Valeria; Bassalat, Ahmed; Basye, Austin; Bates, Richard; Batkova, Lucia; Batley, Richard; Battaglia, Marco; Battistin, Michele; Bauer, Florian; Bawa, Harinder Singh; Beau, Tristan; Beauchemin, Pierre-Hugues; Beccherle, Roberto; Bechtle, Philip; Beck, Hans Peter; Becker, Anne Kathrin; Becker, Sebastian; Beckingham, Matthew; Becot, Cyril; Beddall, Andrew; Beddall, Ayda; Bedikian, Sourpouhi; Bednyakov, Vadim; Bee, Christopher; Beemster, Lars; Beermann, Thomas; Begel, Michael; Behr, Katharina; Belanger-Champagne, Camille; Bell, Paul; Bell, William; Bella, Gideon; Bellagamba, Lorenzo; Bellerive, Alain; Bellomo, Massimiliano; Belotskiy, Konstantin; Beltramello, Olga; Benary, Odette; Benchekroun, Driss; Bendtz, Katarina; Benekos, Nektarios; Benhammou, Yan; Benhar Noccioli, Eleonora; Benitez Garcia, Jorge-Armando; Benjamin, Douglas; Bensinger, James; Benslama, Kamal; Bentvelsen, Stan; Berge, David; Bergeaas Kuutmann, Elin; Berger, Nicolas; Berghaus, Frank; Beringer, Jürg; Bernard, Clare; Bernat, Pauline; Bernius, Catrin; Bernlochner, Florian Urs; Berry, Tracey; Berta, Peter; Bertella, Claudia; Bertoli, Gabriele; Bertolucci, Federico; Bertsche, David; Besana, Maria Ilaria; Besjes, Geert-Jan; Bessidskaia, Olga; Bessner, Martin Florian; Besson, Nathalie; Betancourt, Christopher; Bethke, Siegfried; Bhimji, Wahid; Bianchi, Riccardo-Maria; Bianchini, Louis; Bianco, Michele; Biebel, Otmar; Bieniek, Stephen Paul; Bierwagen, Katharina; Biesiada, Jed; Biglietti, Michela; Bilbao De Mendizabal, Javier; Bilokon, Halina; Bindi, Marcello; Binet, Sebastien; Bingul, Ahmet; Bini, Cesare; Black, Curtis; Black, James; Black, Kevin; Blackburn, Daniel; Blair, Robert; Blanchard, Jean-Baptiste; Blazek, Tomas; Bloch, Ingo; Blocker, Craig; Blum, Walter; Blumenschein, Ulrike; Bobbink, Gerjan; Bobrovnikov, Victor; Bocchetta, Simona Serena; Bocci, Andrea; Bock, Christopher; Boddy, Christopher Richard; Boehler, Michael; Boek, Thorsten Tobias; Bogaerts, Joannes Andreas; Bogdanchikov, Alexander; Bogouch, Andrei; Bohm, Christian; Bohm, Jan; Boisvert, Veronique; Bold, Tomasz; Boldea, Venera; Boldyrev, Alexey; Bomben, Marco; Bona, Marcella; Boonekamp, Maarten; Borisov, Anatoly; Borissov, Guennadi; Borri, Marcello; Borroni, Sara; Bortfeldt, Jonathan; Bortolotto, Valerio; Bos, Kors; Boscherini, Davide; Bosman, Martine; Boterenbrood, Hendrik; Boudreau, Joseph; Bouffard, Julian; Bouhova-Thacker, Evelina Vassileva; Boumediene, Djamel Eddine; Bourdarios, Claire; Bousson, Nicolas; Boutouil, Sara; Boveia, Antonio; Boyd, James; Boyko, Igor; Bracinik, Juraj; Brandt, Andrew; Brandt, Gerhard; Brandt, Oleg; Bratzler, Uwe; Brau, Benjamin; Brau, James; Braun, Helmut; Brazzale, Simone Federico; Brelier, Bertrand; Brendlinger, Kurt; Brennan, Amelia Jean; Brenner, Richard; Bressler, Shikma; Bristow, Kieran; Bristow, Timothy Michael; Britton, Dave; Brochu, Frederic; Brock, Ian; Brock, Raymond; Bromberg, Carl; Bronner, Johanna; Brooijmans, Gustaaf; Brooks, Timothy; Brooks, William; Brosamer, Jacquelyn; Brost, Elizabeth; Brown, Jonathan; Bruckman de Renstrom, Pawel; Bruncko, Dusan; Bruneliere, Renaud; Brunet, Sylvie; Bruni, Alessia; Bruni, Graziano; Bruschi, Marco; Bryngemark, Lene; Buanes, Trygve; Buat, Quentin; Bucci, Francesca; Buchholz, Peter; Buckingham, Ryan; Buckley, Andrew; Buda, Stelian Ioan; Budagov, Ioulian; Buehrer, Felix; Bugge, Lars; Bugge, Magnar Kopangen; Bulekov, Oleg; Bundock, Aaron Colin; Burckhart, Helfried; Burdin, Sergey; Burghgrave, Blake; Burke, Stephen; Burmeister, Ingo; Busato, Emmanuel; Büscher, Daniel; Büscher, Volker; Bussey, Peter; Buszello, Claus-Peter; Butler, Bart; Butler, John; Butt, Aatif Imtiaz; Buttar, Craig; Butterworth, Jonathan; Butti, Pierfrancesco; Buttinger, William; Buzatu, Adrian; Byszewski, Marcin; Cabrera Urbán, Susana; Caforio, Davide; Cakir, Orhan; Calafiura, Paolo; Calandri, Alessandro; Calderini, Giovanni; Calfayan, Philippe; Calkins, Robert; Caloba, Luiz; Calvet, David; Calvet, Samuel; Camacho Toro, Reina; Camarda, Stefano; Cameron, David; Caminada, Lea Michaela; Caminal Armadans, Roger; Campana, Simone; Campanelli, Mario; Campoverde, Angel; Canale, Vincenzo; Canepa, Anadi; Cano Bret, Marc; Cantero, Josu; Cantrill, Robert; Cao, Tingting; Capeans Garrido, Maria Del Mar; Caprini, Irinel; Caprini, Mihai; Capua, Marcella; Caputo, Regina; Cardarelli, Roberto; Carli, Tancredi; Carlino, Gianpaolo; Carminati, Leonardo; Caron, Sascha; Carquin, Edson; Carrillo-Montoya, German D; Carter, Janet; Carvalho, João; Casadei, Diego; Casado, Maria Pilar; Casolino, Mirkoantonio; Castaneda-Miranda, Elizabeth; Castelli, Angelantonio; Castillo Gimenez, Victoria; Castro, Nuno Filipe; Catastini, Pierluigi; Catinaccio, Andrea; Catmore, James; Cattai, Ariella; Cattani, Giordano; Caughron, Seth; Cavaliere, Viviana; Cavalli, Donatella; Cavalli-Sforza, Matteo; Cavasinni, Vincenzo; Ceradini, Filippo; Cerio, Benjamin; Cerny, Karel; Cerqueira, Augusto Santiago; Cerri, Alessandro; Cerrito, Lucio; Cerutti, Fabio; Cerv, Matevz; Cervelli, Alberto; Cetin, Serkant Ali; Chafaq, Aziz; Chakraborty, Dhiman; Chalupkova, Ina; Chang, Philip; Chapleau, Bertrand; Chapman, John Derek; Charfeddine, Driss; Charlton, Dave; Chau, Chav Chhiv; Chavez Barajas, Carlos Alberto; Cheatham, Susan; Chegwidden, Andrew; Chekanov, Sergei; Chekulaev, Sergey; Chelkov, Gueorgui; Chelstowska, Magda Anna; Chen, Chunhui; Chen, Hucheng; Chen, Karen; Chen, Liming; Chen, Shenjian; Chen, Xin; Chen, Yujiao; Cheng, Hok Chuen; Cheng, Yangyang; Cheplakov, Alexander; Cherkaoui El Moursli, Rajaa; Chernyatin, Valeriy; Cheu, Elliott; Chevalier, Laurent; Chiarella, Vitaliano; Chiefari, Giovanni; Childers, John Taylor; Chilingarov, Alexandre; Chiodini, Gabriele; Chisholm, Andrew; Chislett, Rebecca Thalatta; Chitan, Adrian; Chizhov, Mihail; Chouridou, Sofia; Chow, Bonnie Kar Bo; Chromek-Burckhart, Doris; Chu, Ming-Lee; Chudoba, Jiri; Chwastowski, Janusz; Chytka, Ladislav; Ciapetti, Guido; Ciftci, Abbas Kenan; Ciftci, Rena; Cinca, Diane; Cindro, Vladimir; Ciocio, Alessandra; Cirkovic, Predrag; Citron, Zvi Hirsh; Citterio, Mauro; Ciubancan, Mihai; Clark, Allan G; Clark, Philip James; Clarke, Robert; Cleland, Bill; Clemens, Jean-Claude; Clement, Christophe; Coadou, Yann; Cobal, Marina; Coccaro, Andrea; Cochran, James H; Coffey, Laurel; Cogan, Joshua Godfrey; Coggeshall, James; Cole, Brian; Cole, Stephen; Colijn, Auke-Pieter; Collot, Johann; Colombo, Tommaso; Colon, German; Compostella, Gabriele; Conde Muiño, Patricia; Coniavitis, Elias; Conidi, Maria Chiara; Connell, Simon Henry; Connelly, Ian; Consonni, Sofia Maria; Consorti, Valerio; Constantinescu, Serban; Conta, Claudio; Conti, Geraldine; Conventi, Francesco; Cooke, Mark; Cooper, Ben; Cooper-Sarkar, Amanda; Cooper-Smith, Neil; Copic, Katherine; Cornelissen, Thijs; Corradi, Massimo; Corriveau, Francois; Corso-Radu, Alina; Cortes-Gonzalez, Arely; Cortiana, Giorgio; Costa, Giuseppe; Costa, María José; Costanzo, Davide; Côté, David; Cottin, Giovanna; Cowan, Glen; Cox, Brian; Cranmer, Kyle; Cree, Graham; Crépé-Renaudin, Sabine; Crescioli, Francesco; Cribbs, Wayne Allen; Crispin Ortuzar, Mireia; Cristinziani, Markus; Croft, Vince; Crosetti, Giovanni; Cuciuc, Constantin-Mihai; Cuhadar Donszelmann, Tulay; Cummings, Jane; Curatolo, Maria; Cuthbert, Cameron; Czirr, Hendrik; Czodrowski, Patrick; Czyczula, Zofia; D'Auria, Saverio; D'Onofrio, Monica; Da Cunha Sargedas De Sousa, Mario Jose; Da Via, Cinzia; Dabrowski, Wladyslaw; Dafinca, Alexandru; Dai, Tiesheng; Dale, Orjan; Dallaire, Frederick; Dallapiccola, Carlo; Dam, Mogens; Daniells, Andrew Christopher; Dano Hoffmann, Maria; Dao, Valerio; Darbo, Giovanni; Darmora, Smita; Dassoulas, James; Dattagupta, Aparajita; Davey, Will; David, Claire; Davidek, Tomas; Davies, Eleanor; Davies, Merlin; Davignon, Olivier; Davison, Adam; Davison, Peter; Davygora, Yuriy; Dawe, Edmund; Dawson, Ian; Daya-Ishmukhametova, Rozmin; De, Kaushik; de Asmundis, Riccardo; De Castro, Stefano; De Cecco, Sandro; De Groot, Nicolo; de Jong, Paul; De la Torre, Hector; De Lorenzi, Francesco; De Nooij, Lucie; De Pedis, Daniele; De Salvo, Alessandro; De Sanctis, Umberto; De Santo, Antonella; De Vivie De Regie, Jean-Baptiste; Dearnaley, William James; Debbe, Ramiro; Debenedetti, Chiara; Dechenaux, Benjamin; Dedovich, Dmitri; Deigaard, Ingrid; Del Peso, Jose; Del Prete, Tarcisio; Deliot, Frederic; Delitzsch, Chris Malena; Deliyergiyev, Maksym; Dell'Acqua, Andrea; Dell'Asta, Lidia; Dell'Orso, Mauro; Della Pietra, Massimo; della Volpe, Domenico; Delmastro, Marco; Delsart, Pierre-Antoine; Deluca, Carolina; Demers, Sarah; Demichev, Mikhail; Demilly, Aurelien; Denisov, Sergey; Derendarz, Dominik; Derkaoui, Jamal Eddine; Derue, Frederic; Dervan, Paul; Desch, Klaus Kurt; Deterre, Cecile; Deviveiros, Pier-Olivier; Dewhurst, Alastair; Dhaliwal, Saminder; Di Ciaccio, Anna; Di Ciaccio, Lucia; Di Domenico, Antonio; Di Donato, Camilla; Di Girolamo, Alessandro; Di Girolamo, Beniamino; Di Mattia, Alessandro; Di Micco, Biagio; Di Nardo, Roberto; Di Simone, Andrea; Di Sipio, Riccardo; Di Valentino, David; Dias, Flavia; Diaz, Marco Aurelio; Diehl, Edward; Dietrich, Janet; Dietzsch, Thorsten; Diglio, Sara; Dimitrievska, Aleksandra; Dingfelder, Jochen; Dionisi, Carlo; Dita, Petre; Dita, Sanda; Dittus, Fridolin; Djama, Fares; Djobava, Tamar; do Vale, Maria Aline Barros; Do Valle Wemans, André; Doan, Thi Kieu Oanh; Dobos, Daniel; Doglioni, Caterina; Doherty, Tom; Dohmae, Takeshi; Dolejsi, Jiri; Dolezal, Zdenek; Dolgoshein, Boris; Donadelli, Marisilvia; Donati, Simone; Dondero, Paolo; Donini, Julien; Dopke, Jens; Doria, Alessandra; Dova, Maria-Teresa; Doyle, Tony; Dris, Manolis; Dubbert, Jörg; Dube, Sourabh; Dubreuil, Emmanuelle; Duchovni, Ehud; Duckeck, Guenter; Ducu, Otilia Anamaria; Duda, Dominik; Dudarev, Alexey; Dudziak, Fanny; Duflot, Laurent; Duguid, Liam; Dührssen, Michael; Dunford, Monica; Duran Yildiz, Hatice; Düren, Michael; Durglishvili, Archil; Dwuznik, Michal; Dyndal, Mateusz; Ebke, Johannes; Edson, William; Edwards, Nicholas Charles; Ehrenfeld, Wolfgang; Eifert, Till; Eigen, Gerald; Einsweiler, Kevin; Ekelof, Tord; El Kacimi, Mohamed; Ellert, Mattias; Elles, Sabine; Ellinghaus, Frank; Ellis, Nicolas; Elmsheuser, Johannes; Elsing, Markus; Emeliyanov, Dmitry; Enari, Yuji; Endner, Oliver Chris; Endo, Masaki; Engelmann, Roderich; Erdmann, Johannes; Ereditato, Antonio; Eriksson, Daniel; Ernis, Gunar; Ernst, Jesse; Ernst, Michael; Ernwein, Jean; Errede, Deborah; Errede, Steven; Ertel, Eugen; Escalier, Marc; Esch, Hendrik; Escobar, Carlos; Esposito, Bellisario; Etienvre, Anne-Isabelle; Etzion, Erez; Evans, Hal; Ezhilov, Alexey; Fabbri, Laura; Facini, Gabriel; Fakhrutdinov, Rinat; Falciano, Speranza; Falla, Rebecca Jane; Faltova, Jana; Fang, Yaquan; Fanti, Marcello; Farbin, Amir; Farilla, Addolorata; Farooque, Trisha; Farrell, Steven; Farrington, Sinead; Farthouat, Philippe; Fassi, Farida; Fassnacht, Patrick; Fassouliotis, Dimitrios; Favareto, Andrea; Fayard, Louis; Federic, Pavol; Fedin, Oleg; Fedorko, Wojciech; Fehling-Kaschek, Mirjam; Feigl, Simon; Feligioni, Lorenzo; Feng, Cunfeng; Feng, Eric; Feng, Haolu; Fenyuk, Alexander; Fernandez Perez, Sonia; Ferrag, Samir; Ferrando, James; Ferrari, Arnaud; Ferrari, Pamela; Ferrari, Roberto; Ferreira de Lima, Danilo Enoque; Ferrer, Antonio; Ferrere, Didier; Ferretti, Claudio; Ferretto Parodi, Andrea; Fiascaris, Maria; Fiedler, Frank; Filipčič, Andrej; Filipuzzi, Marco; Filthaut, Frank; Fincke-Keeler, Margret; Finelli, Kevin Daniel; Fiolhais, Miguel; Fiorini, Luca; Firan, Ana; Fischer, Adam; Fischer, Julia; Fisher, Wade Cameron; Fitzgerald, Eric Andrew; Flechl, Martin; Fleck, Ivor; Fleischmann, Philipp; Fleischmann, Sebastian; Fletcher, Gareth Thomas; Fletcher, Gregory; Flick, Tobias; Floderus, Anders; Flores Castillo, Luis; Florez Bustos, Andres Carlos; Flowerdew, Michael; Formica, Andrea; Forti, Alessandra; Fortin, Dominique; Fournier, Daniel; Fox, Harald; Fracchia, Silvia; Francavilla, Paolo; Franchini, Matteo; Franchino, Silvia; Francis, David; Franklin, Melissa; Franz, Sebastien; Fraternali, Marco; French, Sky; Friedrich, Conrad; Friedrich, Felix; Froidevaux, Daniel; Frost, James; Fukunaga, Chikara; Fullana Torregrosa, Esteban; Fulsom, Bryan Gregory; Fuster, Juan; Gabaldon, Carolina; Gabizon, Ofir; Gabrielli, Alessandro; Gabrielli, Andrea; Gadatsch, Stefan; Gadomski, Szymon; Gagliardi, Guido; Gagnon, Pauline; Galea, Cristina; Galhardo, Bruno; Gallas, Elizabeth; Gallo, Valentina Santina; Gallop, Bruce; Gallus, Petr; Galster, Gorm Aske Gram Krohn; Gan, KK; Gandrajula, Reddy Pratap; Gao, Jun; Gao, Yongsheng; Garay Walls, Francisca; Garberson, Ford; García, Carmen; García Navarro, José Enrique; Garcia-Sciveres, Maurice; Gardner, Robert; Garelli, Nicoletta; Garonne, Vincent; Gatti, Claudio; Gaudio, Gabriella; Gaur, Bakul; Gauthier, Lea; Gauzzi, Paolo; Gavrilenko, Igor; Gay, Colin; Gaycken, Goetz; Gazis, Evangelos; Ge, Peng; Gecse, Zoltan; Gee, Norman; Geerts, Daniël Alphonsus Adrianus; Geich-Gimbel, Christoph; Gellerstedt, Karl; Gemme, Claudia; Gemmell, Alistair; Genest, Marie-Hélène; Gentile, Simonetta; George, Matthias; George, Simon; Gerbaudo, Davide; Gershon, Avi; Ghazlane, Hamid; Ghodbane, Nabil; Giacobbe, Benedetto; Giagu, Stefano; Giangiobbe, Vincent; Giannetti, Paola; Gianotti, Fabiola; Gibbard, Bruce; Gibson, Stephen; Gilchriese, Murdock; Gillam, Thomas; Gillberg, Dag; Gilles, Geoffrey; Gingrich, Douglas; Giokaris, Nikos; Giordani, MarioPaolo; Giordano, Raffaele; Giorgi, Filippo Maria; Giorgi, Francesco Michelangelo; Giraud, Pierre-Francois; Giugni, Danilo; Giuliani, Claudia; Giulini, Maddalena; Gjelsten, Børge Kile; Gkaitatzis, Stamatios; Gkialas, Ioannis; Gladilin, Leonid; Glasman, Claudia; Glatzer, Julian; Glaysher, Paul; Glazov, Alexandre; Glonti, George; Goblirsch-Kolb, Maximilian; Goddard, Jack Robert; Godfrey, Jennifer; Godlewski, Jan; Goeringer, Christian; Goldfarb, Steven; Golling, Tobias; Golubkov, Dmitry; Gomes, Agostinho; Gomez Fajardo, Luz Stella; Gonçalo, Ricardo; Goncalves Pinto Firmino Da Costa, Joao; Gonella, Laura; González de la Hoz, Santiago; Gonzalez Parra, Garoe; Gonzalez-Sevilla, Sergio; Goossens, Luc; Gorbounov, Petr Andreevich; Gordon, Howard; Gorelov, Igor; Gorini, Benedetto; Gorini, Edoardo; Gorišek, Andrej; Gornicki, Edward; Goshaw, Alfred; Gössling, Claus; Gostkin, Mikhail Ivanovitch; Gouighri, Mohamed; Goujdami, Driss; Goulette, Marc Phillippe; Goussiou, Anna; Goy, Corinne; Gozpinar, Serdar; Grabas, Herve Marie Xavier; Graber, Lars; Grabowska-Bold, Iwona; Grafström, Per; Grahn, Karl-Johan; Gramling, Johanna; Gramstad, Eirik; Grancagnolo, Sergio; Grassi, Valerio; Gratchev, Vadim; Gray, Heather; Graziani, Enrico; Grebenyuk, Oleg; Greenwood, Zeno Dixon; Gregersen, Kristian; Gregor, Ingrid-Maria; Grenier, Philippe; Griffiths, Justin; Grillo, Alexander; Grimm, Kathryn; Grinstein, Sebastian; Gris, Philippe Luc Yves; Grishkevich, Yaroslav; Grivaz, Jean-Francois; Grohs, Johannes Philipp; Grohsjean, Alexander; Gross, Eilam; Grosse-Knetter, Joern; Grossi, Giulio Cornelio; Groth-Jensen, Jacob; Grout, Zara Jane; Guan, Liang; Guescini, Francesco; Guest, Daniel; Gueta, Orel; Guicheney, Christophe; Guido, Elisa; Guillemin, Thibault; Guindon, Stefan; Gul, Umar; Gumpert, Christian; Gunther, Jaroslav; Guo, Jun; Gupta, Shaun; Gutierrez, Phillip; Gutierrez Ortiz, Nicolas Gilberto; Gutschow, Christian; Guttman, Nir; Guyot, Claude; Gwenlan, Claire; Gwilliam, Carl; Haas, Andy; Haber, Carl; Hadavand, Haleh Khani; Haddad, Nacim; Haefner, Petra; Hageböck, Stephan; Hajduk, Zbigniew; Hakobyan, Hrachya; Haleem, Mahsana; Hall, David; Halladjian, Garabed; Hamacher, Klaus; Hamal, Petr; Hamano, Kenji; Hamer, Matthias; Hamilton, Andrew; Hamilton, Samuel; Hamnett, Phillip George; Han, Liang; Hanagaki, Kazunori; Hanawa, Keita; Hance, Michael; Hanke, Paul; Hanna, Remie; Hansen, Jørgen Beck; Hansen, Jorn Dines; Hansen, Peter Henrik; Hara, Kazuhiko; Hard, Andrew; Harenberg, Torsten; Hariri, Faten; Harkusha, Siarhei; Harper, Devin; Harrington, Robert; Harris, Orin; Harrison, Paul Fraser; Hartjes, Fred; Hasegawa, Satoshi; Hasegawa, Yoji; Hasib, A; Hassani, Samira; Haug, Sigve; Hauschild, Michael; Hauser, Reiner; Havranek, Miroslav; Hawkes, Christopher; Hawkings, Richard John; Hawkins, Anthony David; Hayashi, Takayasu; Hayden, Daniel; Hays, Chris; Hayward, Helen; Haywood, Stephen; Head, Simon; Heck, Tobias; Hedberg, Vincent; Heelan, Louise; Heim, Sarah; Heim, Timon; Heinemann, Beate; Heinrich, Lukas; Hejbal, Jiri; Helary, Louis; Heller, Claudio; Heller, Matthieu; Hellman, Sten; Hellmich, Dennis; Helsens, Clement; Henderson, James; Henderson, Robert; Heng, Yang; Hengler, Christopher; Henrichs, Anna; Henriques Correia, Ana Maria; Henrot-Versille, Sophie; Hensel, Carsten; Herbert, Geoffrey Henry; Hernández Jiménez, Yesenia; Herrberg-Schubert, Ruth; Herten, Gregor; Hertenberger, Ralf; Hervas, Luis; Hesketh, Gavin Grant; Hessey, Nigel; Hickling, Robert; Higón-Rodriguez, Emilio; Hill, Ewan; Hill, John; Hiller, Karl Heinz; Hillert, Sonja; Hillier, Stephen; Hinchliffe, Ian; Hines, Elizabeth; Hirose, Minoru; Hirschbuehl, Dominic; Hobbs, John; Hod, Noam; Hodgkinson, Mark; Hodgson, Paul; Hoecker, Andreas; Hoeferkamp, Martin; Hoffman, Julia; Hoffmann, Dirk; Hofmann, Julia Isabell; Hohlfeld, Marc; Holmes, Tova Ray; Hong, Tae Min; Hooft van Huysduynen, Loek; Hostachy, Jean-Yves; Hou, Suen; Hoummada, Abdeslam; Howard, Jacob; Howarth, James; Hrabovsky, Miroslav; Hristova, Ivana; Hrivnac, Julius; Hryn'ova, Tetiana; Hsu, Catherine; Hsu, Pai-hsien Jennifer; Hsu, Shih-Chieh; Hu, Diedi; Hu, Xueye; Huang, Yanping; Hubacek, Zdenek; Hubaut, Fabrice; Huegging, Fabian; Huffman, Todd Brian; Hughes, Emlyn; Hughes, Gareth; Huhtinen, Mika; Hülsing, Tobias Alexander; Hurwitz, Martina; Huseynov, Nazim; Huston, Joey; Huth, John; Iacobucci, Giuseppe; Iakovidis, Georgios; Ibragimov, Iskander; Iconomidou-Fayard, Lydia; Ideal, Emma; Iengo, Paolo; Igonkina, Olga; Iizawa, Tomoya; Ikegami, Yoichi; Ikematsu, Katsumasa; Ikeno, Masahiro; Ilchenko, Iurii; Iliadis, Dimitrios; Ilic, Nikolina; Inamaru, Yuki; Ince, Tayfun; Ioannou, Pavlos; Iodice, Mauro; Iordanidou, Kalliopi; Ippolito, Valerio; Irles Quiles, Adrian; Isaksson, Charlie; Ishino, Masaya; Ishitsuka, Masaki; Ishmukhametov, Renat; Issever, Cigdem; Istin, Serhat; Iturbe Ponce, Julia Mariana; Iuppa, Roberto; Ivarsson, Jenny; Iwanski, Wieslaw; Iwasaki, Hiroyuki; Izen, Joseph; Izzo, Vincenzo; Jackson, Brett; Jackson, Matthew; Jackson, Paul; Jaekel, Martin; Jain, Vivek; Jakobs, Karl; Jakobsen, Sune; Jakoubek, Tomas; Jakubek, Jan; Jamin, David Olivier; Jana, Dilip; Jansen, Eric; Jansen, Hendrik; Janssen, Jens; Janus, Michel; Jarlskog, Göran; Javadov, Namig; Javůrek, Tomáš; Jeanty, Laura; Jejelava, Juansher; Jeng, Geng-yuan; Jennens, David; Jenni, Peter; Jentzsch, Jennifer; Jeske, Carl; Jézéquel, Stéphane; Ji, Haoshuang; Ji, Weina; Jia, Jiangyong; Jiang, Yi; Jimenez Belenguer, Marcos; Jin, Shan; Jinaru, Adam; Jinnouchi, Osamu; Joergensen, Morten Dam; Johansson, Erik; Johansson, Per; Johns, Kenneth; Jon-And, Kerstin; Jones, Graham; Jones, Roger; Jones, Tim; Jongmanns, Jan; Jorge, Pedro; Joshi, Kiran Daniel; Jovicevic, Jelena; Ju, Xiangyang; Jung, Christian; Jungst, Ralph Markus; Jussel, Patrick; Juste Rozas, Aurelio; Kaci, Mohammed; Kaczmarska, Anna; Kado, Marumi; Kagan, Harris; Kagan, Michael; Kajomovitz, Enrique; Kalderon, Charles William; Kama, Sami; Kamenshchikov, Andrey; Kanaya, Naoko; Kaneda, Michiru; Kaneti, Steven; Kantserov, Vadim; Kanzaki, Junichi; Kaplan, Benjamin; Kapliy, Anton; Kar, Deepak; Karakostas, Konstantinos; Karastathis, Nikolaos; Karnevskiy, Mikhail; Karpov, Sergey; Karpova, Zoya; Karthik, Krishnaiyengar; Kartvelishvili, Vakhtang; Karyukhin, Andrey; Kashif, Lashkar; Kasieczka, Gregor; Kass, Richard; Kastanas, Alex; Kataoka, Yousuke; Katre, Akshay; Katzy, Judith; Kaushik, Venkatesh; Kawagoe, Kiyotomo; Kawamoto, Tatsuo; Kawamura, Gen; Kazama, Shingo; Kazanin, Vassili; Kazarinov, Makhail; Keeler, Richard; Kehoe, Robert; Keil, Markus; Keller, John; Kempster, Jacob Julian; Keoshkerian, Houry; Kepka, Oldrich; Kerševan, Borut Paul; Kersten, Susanne; Kessoku, Kohei; Keung, Justin; Khalil-zada, Farkhad; Khandanyan, Hovhannes; Khanov, Alexander; Khodinov, Alexander; Khomich, Andrei; Khoo, Teng Jian; Khoriauli, Gia; Khoroshilov, Andrey; Khovanskiy, Valery; Khramov, Evgeniy; Khubua, Jemal; Kim, Hee Yeun; Kim, Hyeon Jin; Kim, Shinhong; Kimura, Naoki; Kind, Oliver; King, Barry; King, Matthew; King, Robert Steven Beaufoy; King, Samuel Burton; Kirk, Julie; Kiryunin, Andrey; Kishimoto, Tomoe; Kisielewska, Danuta; Kiss, Florian; Kittelmann, Thomas; Kiuchi, Kenji; Kladiva, Eduard; Klein, Max; Klein, Uta; Kleinknecht, Konrad; Klimek, Pawel; Klimentov, Alexei; Klingenberg, Reiner; Klinger, Joel Alexander; Klioutchnikova, Tatiana; Klok, Peter; Kluge, Eike-Erik; Kluit, Peter; Kluth, Stefan; Kneringer, Emmerich; Knoops, Edith; Knue, Andrea; Kobayashi, Dai; Kobayashi, Tomio; Kobel, Michael; Kocian, Martin; Kodys, Peter; Koevesarki, Peter; Koffas, Thomas; Koffeman, Els; Kogan, Lucy Anne; Kohlmann, Simon; Kohout, Zdenek; Kohriki, Takashi; Koi, Tatsumi; Kolanoski, Hermann; Koletsou, Iro; Koll, James; Komar, Aston; Komori, Yuto; Kondo, Takahiko; Kondrashova, Nataliia; Köneke, Karsten; König, Adriaan; König, Sebastian; Kono, Takanori; Konoplich, Rostislav; Konstantinidis, Nikolaos; Kopeliansky, Revital; Koperny, Stefan; Köpke, Lutz; Kopp, Anna Katharina; Korcyl, Krzysztof; Kordas, Kostantinos; Korn, Andreas; Korol, Aleksandr; Korolkov, Ilya; Korolkova, Elena; Korotkov, Vladislav; Kortner, Oliver; Kortner, Sandra; Kostyukhin, Vadim; Kotov, Vladislav; Kotwal, Ashutosh; Kourkoumelis, Christine; Kouskoura, Vasiliki; Koutsman, Alex; Kowalewski, Robert Victor; Kowalski, Tadeusz; Kozanecki, Witold; Kozhin, Anatoly; Kral, Vlastimil; Kramarenko, Viktor; Kramberger, Gregor; Krasnopevtsev, Dimitriy; Krasny, Mieczyslaw Witold; Krasznahorkay, Attila; Kraus, Jana; Kravchenko, Anton; Kreiss, Sven; Kretz, Moritz; Kretzschmar, Jan; Kreutzfeldt, Kristof; Krieger, Peter; Kroeninger, Kevin; Kroha, Hubert; Kroll, Joe; Kroseberg, Juergen; Krstic, Jelena; Kruchonak, Uladzimir; Krüger, Hans; Kruker, Tobias; Krumnack, Nils; Krumshteyn, Zinovii; Kruse, Amanda; Kruse, Mark; Kruskal, Michael; Kubota, Takashi; Kuday, Sinan; Kuehn, Susanne; Kugel, Andreas; Kuhl, Andrew; Kuhl, Thorsten; Kukhtin, Victor; Kulchitsky, Yuri; Kuleshov, Sergey; Kuna, Marine; Kunkle, Joshua; Kupco, Alexander; Kurashige, Hisaya; Kurochkin, Yurii; Kurumida, Rie; Kus, Vlastimil; Kuwertz, Emma Sian; Kuze, Masahiro; Kvita, Jiri; La Rosa, Alessandro; La Rotonda, Laura; Lacasta, Carlos; Lacava, Francesco; Lacey, James; Lacker, Heiko; Lacour, Didier; Lacuesta, Vicente Ramón; Ladygin, Evgueni; Lafaye, Remi; Laforge, Bertrand; Lagouri, Theodota; Lai, Stanley; Laier, Heiko; Lambourne, Luke; Lammers, Sabine; Lampen, Caleb; Lampl, Walter; Lançon, Eric; Landgraf, Ulrich; Landon, Murrough; Lang, Valerie Susanne; Lankford, Andrew; Lanni, Francesco; Lantzsch, Kerstin; Laplace, Sandrine; Lapoire, Cecile; Laporte, Jean-Francois; Lari, Tommaso; Lassnig, Mario; Laurelli, Paolo; Lavrijsen, Wim; Law, Alexander; Laycock, Paul; Le, Bao Tran; Le Dortz, Olivier; Le Guirriec, Emmanuel; Le Menedeu, Eve; LeCompte, Thomas; Ledroit-Guillon, Fabienne Agnes Marie; Lee, Claire, Alexandra; Lee, Hurng-Chun; Lee, Jason; Lee, Shih-Chang; Lee, Lawrence; Lefebvre, Guillaume; Lefebvre, Michel; Legger, Federica; Leggett, Charles; Lehan, Allan; Lehmacher, Marc; Lehmann Miotto, Giovanna; Lei, Xiaowen; Leight, William Axel; Leisos, Antonios; Leister, Andrew Gerard; Leite, Marco Aurelio Lisboa; Leitner, Rupert; Lellouch, Daniel; Lemmer, Boris; Leney, Katharine; Lenz, Tatjana; Lenzen, Georg; Lenzi, Bruno; Leone, Robert; Leone, Sandra; Leonhardt, Kathrin; Leonidopoulos, Christos; Leontsinis, Stefanos; Leroy, Claude; Lester, Christopher; Lester, Christopher Michael; Levchenko, Mikhail; Levêque, Jessica; Levin, Daniel; Levinson, Lorne; Levy, Mark; Lewis, Adrian; Lewis, George; Leyko, Agnieszka; Leyton, Michael; Li, Bing; Li, Bo; Li, Haifeng; Li, Ho Ling; Li, Lei; Li, Liang; Li, Shu; Li, Yichen; Liang, Zhijun; Liao, Hongbo; Liberti, Barbara; Lichard, Peter; Lie, Ki; Liebal, Jessica; Liebig, Wolfgang; Limbach, Christian; Limosani, Antonio; Lin, Simon; Lin, Tai-Hua; Linde, Frank; Lindquist, Brian Edward; Linnemann, James; Lipeles, Elliot; Lipniacka, Anna; Lisovyi, Mykhailo; Liss, Tony; Lissauer, David; Lister, Alison; Litke, Alan; Liu, Bo; Liu, Dong; Liu, Jianbei; Liu, Kun; Liu, Lulu; Liu, Miaoyuan; Liu, Minghui; Liu, Yanwen; Livan, Michele; Livermore, Sarah; Lleres, Annick; Llorente Merino, Javier; Lloyd, Stephen; Lo Sterzo, Francesco; Lobodzinska, Ewelina; Loch, Peter; Lockman, William; Loddenkoetter, Thomas; Loebinger, Fred; Loevschall-Jensen, Ask Emil; Loginov, Andrey; Loh, Chang Wei; Lohse, Thomas; Lohwasser, Kristin; Lokajicek, Milos; Lombardo, Vincenzo Paolo; Long, Brian Alexander; Long, Jonathan; Long, Robin Eamonn; Lopes, Lourenco; Lopez Mateos, David; Lopez Paredes, Brais; Lopez Paz, Ivan; Lorenz, Jeanette; Lorenzo Martinez, Narei; Losada, Marta; Loscutoff, Peter; Lou, XinChou; Lounis, Abdenour; Love, Jeremy; Love, Peter; Lowe, Andrew; Lu, Feng; Lubatti, Henry; Luci, Claudio; Lucotte, Arnaud; Luehring, Frederick; Lukas, Wolfgang; Luminari, Lamberto; Lundberg, Olof; Lund-Jensen, Bengt; Lungwitz, Matthias; Lynn, David; Lysak, Roman; Lytken, Else; Ma, Hong; Ma, Lian Liang; Maccarrone, Giovanni; Macchiolo, Anna; Machado Miguens, Joana; Macina, Daniela; Madaffari, Daniele; Madar, Romain; Maddocks, Harvey Jonathan; Mader, Wolfgang; Madsen, Alexander; Maeno, Mayuko; Maeno, Tadashi; Magradze, Erekle; Mahboubi, Kambiz; Mahlstedt, Joern; Mahmoud, Sara; Maiani, Camilla; Maidantchik, Carmen; Maier, Andreas Alexander; Maio, Amélia; Majewski, Stephanie; Makida, Yasuhiro; Makovec, Nikola; Mal, Prolay; Malaescu, Bogdan; Malecki, Pawel; Maleev, Victor; Malek, Fairouz; Mallik, Usha; Malon, David; Malone, Caitlin; Maltezos, Stavros; Malyshev, Vladimir; Malyukov, Sergei; Mamuzic, Judita; Mandelli, Beatrice; Mandelli, Luciano; Mandić, Igor; Mandrysch, Rocco; Maneira, José; Manfredini, Alessandro; Manhaes de Andrade Filho, Luciano; Manjarres Ramos, Joany Andreina; Mann, Alexander; Manning, Peter; Manousakis-Katsikakis, Arkadios; Mansoulie, Bruno; Mantifel, Rodger; Mapelli, Livio; March, Luis; Marchand, Jean-Francois; Marchiori, Giovanni; Marcisovsky, Michal; Marino, Christopher; Marjanovic, Marija; Marques, Carlos; Marroquim, Fernando; Marsden, Stephen Philip; Marshall, Zach; Marti, Lukas Fritz; Marti-Garcia, Salvador; Martin, Brian; Martin, Brian; Martin, Tim; Martin, Victoria Jane; Martin dit Latour, Bertrand; Martinez, Homero; Martinez, Mario; Martin-Haugh, Stewart; Martyniuk, Alex; Marx, Marilyn; Marzano, Francesco; Marzin, Antoine; Masetti, Lucia; Mashimo, Tetsuro; Mashinistov, Ruslan; Masik, Jiri; Maslennikov, Alexey; Massa, Ignazio; Massol, Nicolas; Mastrandrea, Paolo; Mastroberardino, Anna; Masubuchi, Tatsuya; Mättig, Peter; Mattmann, Johannes; Maurer, Julien; Maxfield, Stephen; Maximov, Dmitriy; Mazini, Rachid; Mazzaferro, Luca; Mc Goldrick, Garrin; Mc Kee, Shawn Patrick; McCarn, Allison; McCarthy, Robert; McCarthy, Tom; McCubbin, Norman; McFarlane, Kenneth; Mcfayden, Josh; Mchedlidze, Gvantsa; McMahon, Steve; McPherson, Robert; Meade, Andrew; Mechnich, Joerg; Medinnis, Michael; Meehan, Samuel; Mehlhase, Sascha; Mehta, Andrew; Meier, Karlheinz; Meineck, Christian; Meirose, Bernhard; Melachrinos, Constantinos; Mellado Garcia, Bruce Rafael; Meloni, Federico; Mengarelli, Alberto; Menke, Sven; Meoni, Evelin; Mercurio, Kevin Michael; Mergelmeyer, Sebastian; Meric, Nicolas; Mermod, Philippe; Merola, Leonardo; Meroni, Chiara; Merritt, Frank; Merritt, Hayes; Messina, Andrea; Metcalfe, Jessica; Mete, Alaettin Serhan; Meyer, Carsten; Meyer, Christopher; Meyer, Jean-Pierre; Meyer, Jochen; Middleton, Robin; Migas, Sylwia; Mijović, Liza; Mikenberg, Giora; Mikestikova, Marcela; Mikuž, Marko; Milic, Adriana; Miller, David; Mills, Corrinne; Milov, Alexander; Milstead, David; Milstein, Dmitry; Minaenko, Andrey; Minashvili, Irakli; Mincer, Allen; Mindur, Bartosz; Mineev, Mikhail; Ming, Yao; Mir, Lluisa-Maria; Mirabelli, Giovanni; Mitani, Takashi; Mitrevski, Jovan; Mitsou, Vasiliki A; Mitsui, Shingo; Miucci, Antonio; Miyagawa, Paul; Mjörnmark, Jan-Ulf; Moa, Torbjoern; Mochizuki, Kazuya; Mohapatra, Soumya; Mohr, Wolfgang; Molander, Simon; Moles-Valls, Regina; Mönig, Klaus; Monini, Caterina; Monk, James; Monnier, Emmanuel; Montejo Berlingen, Javier; Monticelli, Fernando; Monzani, Simone; Moore, Roger; Moraes, Arthur; Morange, Nicolas; Moreno, Deywis; Moreno Llácer, María; Morettini, Paolo; Morgenstern, Marcus; Morii, Masahiro; Moritz, Sebastian; Morley, Anthony Keith; Mornacchi, Giuseppe; Morris, John; Morvaj, Ljiljana; Moser, Hans-Guenther; Mosidze, Maia; Moss, Josh; Motohashi, Kazuki; Mount, Richard; Mountricha, Eleni; Mouraviev, Sergei; Moyse, Edward; Muanza, Steve; Mudd, Richard; Mueller, Felix; Mueller, James; Mueller, Klemens; Mueller, Thibaut; Mueller, Timo; Muenstermann, Daniel; Munwes, Yonathan; Murillo Quijada, Javier Alberto; Murray, Bill; Musheghyan, Haykuhi; Musto, Elisa; Myagkov, Alexey; Myska, Miroslav; Nackenhorst, Olaf; Nadal, Jordi; Nagai, Koichi; Nagai, Ryo; Nagai, Yoshikazu; Nagano, Kunihiro; Nagarkar, Advait; Nagasaka, Yasushi; Nagel, Martin; Nairz, Armin Michael; Nakahama, Yu; Nakamura, Koji; Nakamura, Tomoaki; Nakano, Itsuo; Namasivayam, Harisankar; Nanava, Gizo; Narayan, Rohin; Nattermann, Till; Naumann, Thomas; Navarro, Gabriela; Nayyar, Ruchika; Neal, Homer; Nechaeva, Polina; Neep, Thomas James; Nef, Pascal Daniel; Negri, Andrea; Negri, Guido; Negrini, Matteo; Nektarijevic, Snezana; Nelson, Andrew; Nelson, Timothy Knight; Nemecek, Stanislav; Nemethy, Peter; Nepomuceno, Andre Asevedo; Nessi, Marzio; Neubauer, Mark; Neumann, Manuel; Neves, Ricardo; Nevski, Pavel; Newman, Paul; Nguyen, Duong Hai; Nickerson, Richard; Nicolaidou, Rosy; Nicquevert, Bertrand; Nielsen, Jason; Nikiforou, Nikiforos; Nikiforov, Andriy; Nikolaenko, Vladimir; Nikolic-Audit, Irena; Nikolics, Katalin; Nikolopoulos, Konstantinos; Nilsson, Paul; Ninomiya, Yoichi; Nisati, Aleandro; Nisius, Richard; Nobe, Takuya; Nodulman, Lawrence; Nomachi, Masaharu; Nomidis, Ioannis; Norberg, Scarlet; Nordberg, Markus; Novgorodova, Olga; Nowak, Sebastian; Nozaki, Mitsuaki; Nozka, Libor; Ntekas, Konstantinos; Nunes Hanninger, Guilherme; Nunnemann, Thomas; Nurse, Emily; Nuti, Francesco; O'Brien, Brendan Joseph; O'grady, Fionnbarr; O'Neil, Dugan; O'Shea, Val; Oakham, Gerald; Oberlack, Horst; Obermann, Theresa; Ocariz, Jose; Ochi, Atsuhiko; Ochoa, Ines; Oda, Susumu; Odaka, Shigeru; Ogren, Harold; Oh, Alexander; Oh, Seog; Ohm, Christian; Ohman, Henrik; Ohshima, Takayoshi; Okamura, Wataru; Okawa, Hideki; Okumura, Yasuyuki; Okuyama, Toyonobu; Olariu, Albert; Olchevski, Alexander; Olivares Pino, Sebastian Andres; Oliveira Damazio, Denis; Oliver Garcia, Elena; Olszewski, Andrzej; Olszowska, Jolanta; Onofre, António; Onyisi, Peter; Oram, Christopher; Oreglia, Mark; Oren, Yona; Orestano, Domizia; Orlando, Nicola; Oropeza Barrera, Cristina; Orr, Robert; Osculati, Bianca; Ospanov, Rustem; Otero y Garzon, Gustavo; Otono, Hidetoshi; Ouchrif, Mohamed; Ouellette, Eric; Ould-Saada, Farid; Ouraou, Ahmimed; Oussoren, Koen Pieter; Ouyang, Qun; Ovcharova, Ana; Owen, Mark; Ozcan, Veysi Erkcan; Ozturk, Nurcan; Pachal, Katherine; Pacheco Pages, Andres; Padilla Aranda, Cristobal; Pagáčová, Martina; Pagan Griso, Simone; Paganis, Efstathios; Pahl, Christoph; Paige, Frank; Pais, Preema; Pajchel, Katarina; Palacino, Gabriel; Palestini, Sandro; Palka, Marek; Pallin, Dominique; Palma, Alberto; Palmer, Jody; Pan, Yibin; Panagiotopoulou, Evgenia; Panduro Vazquez, William; Pani, Priscilla; Panikashvili, Natalia; Panitkin, Sergey; Pantea, Dan; Paolozzi, Lorenzo; Papadopoulou, Theodora; Papageorgiou, Konstantinos; Paramonov, Alexander; Paredes Hernandez, Daniela; Parker, Michael Andrew; Parodi, Fabrizio; Parsons, John; Parzefall, Ulrich; Pasqualucci, Enrico; Passaggio, Stefano; Passeri, Antonio; Pastore, Fernanda; Pastore, Francesca; Pásztor, Gabriella; Pataraia, Sophio; Patel, Nikhul; Pater, Joleen; Patricelli, Sergio; Pauly, Thilo; Pearce, James; Pedersen, Maiken; Pedraza Lopez, Sebastian; Pedro, Rute; Peleganchuk, Sergey; Pelikan, Daniel; Peng, Haiping; Penning, Bjoern; Penwell, John; Perepelitsa, Dennis; Perez Codina, Estel; Pérez García-Estañ, María Teresa; Perez Reale, Valeria; Perini, Laura; Pernegger, Heinz; Perrino, Roberto; Peschke, Richard; Peshekhonov, Vladimir; Peters, Krisztian; Peters, Yvonne; Petersen, Brian; Petersen, Troels; Petit, Elisabeth; Petridis, Andreas; Petridou, Chariclia; Petrolo, Emilio; Petrucci, Fabrizio; Pettersson, Nora Emilia; Pezoa, Raquel; Phillips, Peter William; Piacquadio, Giacinto; Pianori, Elisabetta; Picazio, Attilio; Piccaro, Elisa; Piccinini, Maurizio; Piegaia, Ricardo; Pignotti, David; Pilcher, James; Pilkington, Andrew; Pina, João Antonio; Pinamonti, Michele; Pinder, Alex; Pinfold, James; Pingel, Almut; Pinto, Belmiro; Pires, Sylvestre; Pitt, Michael; Pizio, Caterina; Plazak, Lukas; Pleier, Marc-Andre; Pleskot, Vojtech; Plotnikova, Elena; Plucinski, Pawel; Poddar, Sahill; Podlyski, Fabrice; Poettgen, Ruth; Poggioli, Luc; Pohl, David-leon; Pohl, Martin; Polesello, Giacomo; Policicchio, Antonio; Polifka, Richard; Polini, Alessandro; Pollard, Christopher Samuel; Polychronakos, Venetios; Pommès, Kathy; Pontecorvo, Ludovico; Pope, Bernard; Popeneciu, Gabriel Alexandru; Popovic, Dragan; Poppleton, Alan; Portell Bueso, Xavier; Pospisil, Stanislav; Potamianos, Karolos; Potrap, Igor; Potter, Christina; Potter, Christopher; Poulard, Gilbert; Poveda, Joaquin; Pozdnyakov, Valery; Pralavorio, Pascal; Pranko, Aliaksandr; Prasad, Srivas; Pravahan, Rishiraj; Prell, Soeren; Price, Darren; Price, Joe; Price, Lawrence; Prieur, Damien; Primavera, Margherita; Proissl, Manuel; Prokofiev, Kirill; Prokoshin, Fedor; Protopapadaki, Eftychia-sofia; Protopopescu, Serban; Proudfoot, James; Przybycien, Mariusz; Przysiezniak, Helenka; Ptacek, Elizabeth; Puddu, Daniele; Pueschel, Elisa; Puldon, David; Purohit, Milind; Puzo, Patrick; Qian, Jianming; Qin, Gang; Qin, Yang; Quadt, Arnulf; Quarrie, David; Quayle, William; Queitsch-Maitland, Michaela; Quilty, Donnchadha; Qureshi, Anum; Radeka, Veljko; Radescu, Voica; Radhakrishnan, Sooraj Krishnan; Radloff, Peter; Rados, Pere; Ragusa, Francesco; Rahal, Ghita; Rajagopalan, Srinivasan; Rammensee, Michael; Randle-Conde, Aidan Sean; Rangel-Smith, Camila; Rao, Kanury; Rauscher, Felix; Rave, Tobias Christian; Ravenscroft, Thomas; Raymond, Michel; Read, Alexander Lincoln; Readioff, Nathan Peter; Rebuzzi, Daniela; Redelbach, Andreas; Redlinger, George; Reece, Ryan; Reeves, Kendall; Rehnisch, Laura; Reisin, Hernan; Relich, Matthew; Rembser, Christoph; Ren, Huan; Ren, Zhongliang; Renaud, Adrien; Rescigno, Marco; Resconi, Silvia; Rezanova, Olga; Reznicek, Pavel; Rezvani, Reyhaneh; Richter, Robert; Ridel, Melissa; Rieck, Patrick; Rieger, Julia; Rijssenbeek, Michael; Rimoldi, Adele; Rinaldi, Lorenzo; Ritsch, Elmar; Riu, Imma; Rizatdinova, Flera; Rizvi, Eram; Robertson, Steven; Robichaud-Veronneau, Andree; Robinson, Dave; Robinson, James; Robson, Aidan; Roda, Chiara; Rodrigues, Luis; Roe, Shaun; Røhne, Ole; Rolli, Simona; Romaniouk, Anatoli; Romano, Marino; Romero Adam, Elena; Rompotis, Nikolaos; Roos, Lydia; Ros, Eduardo; Rosati, Stefano; Rosbach, Kilian; Rose, Matthew; Rosendahl, Peter Lundgaard; Rosenthal, Oliver; Rossetti, Valerio; Rossi, Elvira; Rossi, Leonardo Paolo; Rosten, Rachel; Rotaru, Marina; Roth, Itamar; Rothberg, Joseph; Rousseau, David; Royon, Christophe; Rozanov, Alexandre; Rozen, Yoram; Ruan, Xifeng; Rubbo, Francesco; Rubinskiy, Igor; Rud, Viacheslav; Rudolph, Christian; Rudolph, Matthew Scott; Rühr, Frederik; Ruiz-Martinez, Aranzazu; Rurikova, Zuzana; Rusakovich, Nikolai; Ruschke, Alexander; Rutherfoord, John; Ruthmann, Nils; Ryabov, Yury; Rybar, Martin; Rybkin, Grigori; Ryder, Nick; Saavedra, Aldo; Sacerdoti, Sabrina; Saddique, Asif; Sadeh, Iftach; Sadrozinski, Hartmut; Sadykov, Renat; Safai Tehrani, Francesco; Sakamoto, Hiroshi; Sakurai, Yuki; Salamanna, Giuseppe; Salamon, Andrea; Saleem, Muhammad; Salek, David; Sales De Bruin, Pedro Henrique; Salihagic, Denis; Salnikov, Andrei; Salt, José; Salvachua Ferrando, Belén; Salvatore, Daniela; Salvatore, Pasquale Fabrizio; Salvucci, Antonio; Salzburger, Andreas; Sampsonidis, Dimitrios; Sanchez, Arturo; Sánchez, Javier; Sanchez Martinez, Victoria; Sandaker, Heidi; Sandbach, Ruth Laura; Sander, Heinz Georg; Sanders, Michiel; Sandhoff, Marisa; Sandoval, Tanya; Sandoval, Carlos; Sandstroem, Rikard; Sankey, Dave; Sansoni, Andrea; Santoni, Claudio; Santonico, Rinaldo; Santos, Helena; Santoyo Castillo, Itzebelt; Sapp, Kevin; Sapronov, Andrey; Saraiva, João; Sarrazin, Bjorn; Sartisohn, Georg; Sasaki, Osamu; Sasaki, Yuichi; Sauvage, Gilles; Sauvan, Emmanuel; Savard, Pierre; Savu, Dan Octavian; Sawyer, Craig; Sawyer, Lee; Saxon, David; Saxon, James; Sbarra, Carla; Sbrizzi, Antonio; Scanlon, Tim; Scannicchio, Diana; Scarcella, Mark; Scarfone, Valerio; Schaarschmidt, Jana; Schacht, Peter; Schaefer, Douglas; Schaefer, Ralph; Schaepe, Steffen; Schaetzel, Sebastian; Schäfer, Uli; Schaffer, Arthur; Schaile, Dorothee; Schamberger, R. Dean; Scharf, Veit; Schegelsky, Valery; Scheirich, Daniel; Schernau, Michael; Scherzer, Max; Schiavi, Carlo; Schieck, Jochen; Schillo, Christian; Schioppa, Marco; Schlenker, Stefan; Schmidt, Evelyn; Schmieden, Kristof; Schmitt, Christian; Schmitt, Christopher; Schmitt, Sebastian; Schneider, Basil; Schnellbach, Yan Jie; Schnoor, Ulrike; Schoeffel, Laurent; Schoening, Andre; Schoenrock, Bradley Daniel; Schorlemmer, Andre Lukas; Schott, Matthias; Schouten, Doug; Schovancova, Jaroslava; Schramm, Steven; Schreyer, Manuel; Schroeder, Christian; Schuh, Natascha; Schultens, Martin Johannes; Schultz-Coulon, Hans-Christian; Schulz, Holger; Schumacher, Markus; Schumm, Bruce; Schune, Philippe; Schwanenberger, Christian; Schwartzman, Ariel; Schwegler, Philipp; Schwemling, Philippe; Schwienhorst, Reinhard; Schwindling, Jerome; Schwindt, Thomas; Schwoerer, Maud; Sciacca, Gianfranco; Scifo, Estelle; Sciolla, Gabriella; Scott, Bill; Scuri, Fabrizio; Scutti, Federico; Searcy, Jacob; Sedov, George; Sedykh, Evgeny; Seidel, Sally; Seiden, Abraham; Seifert, Frank; Seixas, José; Sekhniaidze, Givi; Sekula, Stephen; Selbach, Karoline Elfriede; Seliverstov, Dmitry; Sellers, Graham; Semprini-Cesari, Nicola; Serfon, Cedric; Serin, Laurent; Serkin, Leonid; Serre, Thomas; Seuster, Rolf; Severini, Horst; Sfiligoj, Tina; Sforza, Federico; Sfyrla, Anna; Shabalina, Elizaveta; Shamim, Mansoora; Shan, Lianyou; Shang, Ruo-yu; Shank, James; Shapiro, Marjorie; Shatalov, Pavel; Shaw, Kate; Shehu, Ciwake Yusufu; Sherwood, Peter; Shi, Liaoshan; Shimizu, Shima; Shimmin, Chase Owen; Shimojima, Makoto; Shiyakova, Mariya; Shmeleva, Alevtina; Shochet, Mel; Short, Daniel; Shrestha, Suyog; Shulga, Evgeny; Shupe, Michael; Shushkevich, Stanislav; Sicho, Petr; Sidiropoulou, Ourania; Sidorov, Dmitri; Sidoti, Antonio; Siegert, Frank; Sijacki, Djordje; Silva, José; Silver, Yiftah; Silverstein, Daniel; Silverstein, Samuel; Simak, Vladislav; Simard, Olivier; Simic, Ljiljana; Simion, Stefan; Simioni, Eduard; Simmons, Brinick; Simoniello, Rosa; Simonyan, Margar; Sinervo, Pekka; Sinev, Nikolai; Sipica, Valentin; Siragusa, Giovanni; Sircar, Anirvan; Sisakyan, Alexei; Sivoklokov, Serguei; Sjölin, Jörgen; Sjursen, Therese; Skottowe, Hugh Philip; Skovpen, Kirill; Skubic, Patrick; Slater, Mark; Slavicek, Tomas; Sliwa, Krzysztof; Smakhtin, Vladimir; Smart, Ben; Smestad, Lillian; Smirnov, Sergei; Smirnov, Yury; Smirnova, Lidia; Smirnova, Oxana; Smith, Kenway; Smizanska, Maria; Smolek, Karel; Snesarev, Andrei; Snidero, Giacomo; Snyder, Scott; Sobie, Randall; Socher, Felix; Soffer, Abner; Soh, Dart-yin; Solans, Carlos; Solar, Michael; Solc, Jaroslav; Soldatov, Evgeny; Soldevila, Urmila; Solfaroli Camillocci, Elena; Solodkov, Alexander; Soloshenko, Alexei; Solovyanov, Oleg; Solovyev, Victor; Sommer, Philip; Song, Hong Ye; Soni, Nitesh; Sood, Alexander; Sopczak, Andre; Sopko, Bruno; Sopko, Vit; Sorin, Veronica; Sosebee, Mark; Soualah, Rachik; Soueid, Paul; Soukharev, Andrey; South, David; Spagnolo, Stefania; Spanò, Francesco; Spearman, William Robert; Spettel, Fabian; Spighi, Roberto; Spigo, Giancarlo; Spousta, Martin; Spreitzer, Teresa; Spurlock, Barry; St Denis, Richard Dante; Staerz, Steffen; Stahlman, Jonathan; Stamen, Rainer; Stanecka, Ewa; Stanek, Robert; Stanescu, Cristian; Stanescu-Bellu, Madalina; Stanitzki, Marcel Michael; Stapnes, Steinar; Starchenko, Evgeny; Stark, Jan; Staroba, Pavel; Starovoitov, Pavel; Staszewski, Rafal; Stavina, Pavel; Steinberg, Peter; Stelzer, Bernd; Stelzer, Harald Joerg; Stelzer-Chilton, Oliver; Stenzel, Hasko; Stern, Sebastian; Stewart, Graeme; Stillings, Jan Andre; Stockton, Mark; Stoebe, Michael; Stoicea, Gabriel; Stolte, Philipp; Stonjek, Stefan; Stradling, Alden; Straessner, Arno; Stramaglia, Maria Elena; Strandberg, Jonas; Strandberg, Sara; Strandlie, Are; Strauss, Emanuel; Strauss, Michael; Strizenec, Pavol; Ströhmer, Raimund; Strom, David; Stroynowski, Ryszard; Stucci, Stefania Antonia; Stugu, Bjarne; Styles, Nicholas Adam; Su, Dong; Su, Jun; Subramania, Halasya Siva; Subramaniam, Rajivalochan; Succurro, Antonella; Sugaya, Yorihito; Suhr, Chad; Suk, Michal; Sulin, Vladimir; Sultansoy, Saleh; Sumida, Toshi; Sun, Xiaohu; Sundermann, Jan Erik; Suruliz, Kerim; Susinno, Giancarlo; Sutton, Mark; Suzuki, Yu; Svatos, Michal; Swedish, Stephen; Swiatlowski, Maximilian; Sykora, Ivan; Sykora, Tomas; Ta, Duc; Taccini, Cecilia; Tackmann, Kerstin; Taenzer, Joe; Taffard, Anyes; Tafirout, Reda; Taiblum, Nimrod; Takahashi, Yuta; Takai, Helio; Takashima, Ryuichi; Takeda, Hiroshi; Takeshita, Tohru; Takubo, Yosuke; Talby, Mossadek; Talyshev, Alexey; Tam, Jason; Tan, Kong Guan; Tanaka, Junichi; Tanaka, Reisaburo; Tanaka, Satoshi; Tanaka, Shuji; Tanasijczuk, Andres Jorge; Tannenwald, Benjamin Bordy; Tannoury, Nancy; Tapprogge, Stefan; Tarem, Shlomit; Tarrade, Fabien; Tartarelli, Giuseppe Francesco; Tas, Petr; Tasevsky, Marek; Tashiro, Takuya; Tassi, Enrico; Tavares Delgado, Ademar; Tayalati, Yahya; Taylor, Frank; Taylor, Geoffrey; Taylor, Wendy; Teischinger, Florian Alfred; Teixeira Dias Castanheira, Matilde; Teixeira-Dias, Pedro; Temming, Kim Katrin; Ten Kate, Herman; Teng, Ping-Kun; Teoh, Jia Jian; Terada, Susumu; Terashi, Koji; Terron, Juan; Terzo, Stefano; Testa, Marianna; Teuscher, Richard; Therhaag, Jan; Theveneaux-Pelzer, Timothée; Thomas, Juergen; Thomas-Wilsker, Joshuha; Thompson, Emily; Thompson, Paul; Thompson, Peter; Thompson, Stan; Thomsen, Lotte Ansgaard; Thomson, Evelyn; Thomson, Mark; Thong, Wai Meng; Thun, Rudolf; Tian, Feng; Tibbetts, Mark James; Tikhomirov, Vladimir; Tikhonov, Yury; Timoshenko, Sergey; Tiouchichine, Elodie; Tipton, Paul; Tisserant, Sylvain; Todorov, Theodore; Todorova-Nova, Sharka; Toggerson, Brokk; Tojo, Junji; Tokár, Stanislav; Tokushuku, Katsuo; Tollefson, Kirsten; Tomlinson, Lee; Tomoto, Makoto; Tompkins, Lauren; Toms, Konstantin; Topilin, Nikolai; Torrence, Eric; Torres, Heberth; Torró Pastor, Emma; Toth, Jozsef; Touchard, Francois; Tovey, Daniel; Tran, Huong Lan; Trefzger, Thomas; Tremblet, Louis; Tricoli, Alessandro; Trigger, Isabel Marian; Trincaz-Duvoid, Sophie; Tripiana, Martin; Triplett, Nathan; Trischuk, William; Trocmé, Benjamin; Troncon, Clara; Trottier-McDonald, Michel; Trovatelli, Monica; True, Patrick; Trzebinski, Maciej; Trzupek, Adam; Tsarouchas, Charilaos; Tseng, Jeffrey; Tsiareshka, Pavel; Tsionou, Dimitra; Tsipolitis, Georgios; Tsirintanis, Nikolaos; Tsiskaridze, Shota; Tsiskaridze, Vakhtang; Tskhadadze, Edisher; Tsukerman, Ilya; Tsulaia, Vakhtang; Tsuno, Soshi; Tsybychev, Dmitri; Tudorache, Alexandra; Tudorache, Valentina; Tuna, Alexander Naip; Tupputi, Salvatore; Turchikhin, Semen; Turecek, Daniel; Turk Cakir, Ilkay; Turra, Ruggero; Tuts, Michael; Tykhonov, Andrii; Tylmad, Maja; Tyndel, Mike; Uchida, Kirika; Ueda, Ikuo; Ueno, Ryuichi; Ughetto, Michael; Ugland, Maren; Uhlenbrock, Mathias; Ukegawa, Fumihiko; Unal, Guillaume; Undrus, Alexander; Unel, Gokhan; Ungaro, Francesca; Unno, Yoshinobu; Urbaniec, Dustin; Urquijo, Phillip; Usai, Giulio; Usanova, Anna; Vacavant, Laurent; Vacek, Vaclav; Vachon, Brigitte; Valencic, Nika; Valentinetti, Sara; Valero, Alberto; Valery, Loic; Valkar, Stefan; Valladolid Gallego, Eva; Vallecorsa, Sofia; Valls Ferrer, Juan Antonio; Van Den Wollenberg, Wouter; Van Der Deijl, Pieter; van der Geer, Rogier; van der Graaf, Harry; Van Der Leeuw, Robin; van der Ster, Daniel; van Eldik, Niels; van Gemmeren, Peter; Van Nieuwkoop, Jacobus; van Vulpen, Ivo; van Woerden, Marius Cornelis; Vanadia, Marco; Vandelli, Wainer; Vanguri, Rami; Vaniachine, Alexandre; Vankov, Peter; Vannucci, Francois; Vardanyan, Gagik; Vari, Riccardo; Varnes, Erich; Varol, Tulin; Varouchas, Dimitris; Vartapetian, Armen; Varvell, Kevin; Vazeille, Francois; Vazquez Schroeder, Tamara; Veatch, Jason; Veloso, Filipe; Veneziano, Stefano; Ventura, Andrea; Ventura, Daniel; Venturi, Manuela; Venturi, Nicola; Venturini, Alessio; Vercesi, Valerio; Verducci, Monica; Verkerke, Wouter; Vermeulen, Jos; Vest, Anja; Vetterli, Michel; Viazlo, Oleksandr; Vichou, Irene; Vickey, Trevor; Vickey Boeriu, Oana Elena; Viehhauser, Georg; Viel, Simon; Vigne, Ralph; Villa, Mauro; Villaplana Perez, Miguel; Vilucchi, Elisabetta; Vincter, Manuella; Vinogradov, Vladimir; Virzi, Joseph; Vivarelli, Iacopo; Vives Vaque, Francesc; Vlachos, Sotirios; Vladoiu, Dan; Vlasak, Michal; Vogel, Adrian; Vogel, Marcelo; Vokac, Petr; Volpi, Guido; Volpi, Matteo; von der Schmitt, Hans; von Radziewski, Holger; von Toerne, Eckhard; Vorobel, Vit; Vorobev, Konstantin; Vos, Marcel; Voss, Rudiger; Vossebeld, Joost; Vranjes, Nenad; Vranjes Milosavljevic, Marija; Vrba, Vaclav; Vreeswijk, Marcel; Vu Anh, Tuan; Vuillermet, Raphael; Vukotic, Ilija; Vykydal, Zdenek; Wagner, Peter; Wagner, Wolfgang; Wahlberg, Hernan; Wahrmund, Sebastian; Wakabayashi, Jun; Walder, James; Walker, Rodney; Walkowiak, Wolfgang; Wall, Richard; Waller, Peter; Walsh, Brian; Wang, Chao; Wang, Chiho; Wang, Fuquan; Wang, Haichen; Wang, Hulin; Wang, Jike; Wang, Jin; Wang, Kuhan; Wang, Rui; Wang, Song-Ming; Wang, Tan; Wang, Xiaoxiao; Wanotayaroj, Chaowaroj; Warburton, Andreas; Ward, Patricia; Wardrope, David Robert; Warsinsky, Markus; Washbrook, Andrew; Wasicki, Christoph; Watkins, Peter; Watson, Alan; Watson, Ian; Watson, Miriam; Watts, Gordon; Watts, Stephen; Waugh, Ben; Webb, Samuel; Weber, Michele; Weber, Stefan Wolf; Webster, Jordan S; Weidberg, Anthony; Weigell, Philipp; Weinert, Benjamin; Weingarten, Jens; Weiser, Christian; Weits, Hartger; Wells, Phillippa; Wenaus, Torre; Wendland, Dennis; Weng, Zhili; Wengler, Thorsten; Wenig, Siegfried; Wermes, Norbert; Werner, Matthias; Werner, Per; Wessels, Martin; Wetter, Jeffrey; Whalen, Kathleen; White, Andrew; White, Martin; White, Ryan; White, Sebastian; Whiteson, Daniel; Wicke, Daniel; Wickens, Fred; Wiedenmann, Werner; Wielers, Monika; Wienemann, Peter; Wiglesworth, Craig; Wiik-Fuchs, Liv Antje Mari; Wijeratne, Peter Alexander; Wildauer, Andreas; Wildt, Martin Andre; Wilkens, Henric George; Will, Jonas Zacharias; Williams, Hugh; Williams, Sarah; Willis, Christopher; Willocq, Stephane; Wilson, Alan; Wilson, John; Wingerter-Seez, Isabelle; Winklmeier, Frank; Winter, Benedict Tobias; Wittgen, Matthias; Wittig, Tobias; Wittkowski, Josephine; Wollstadt, Simon Jakob; Wolter, Marcin Wladyslaw; Wolters, Helmut; Wosiek, Barbara; Wotschack, Jorg; Woudstra, Martin; Wozniak, Krzysztof; Wright, Michael; Wu, Mengqing; Wu, Sau Lan; Wu, Xin; Wu, Yusheng; Wulf, Evan; Wyatt, Terry Richard; Wynne, Benjamin; Xella, Stefania; Xiao, Meng; Xu, Da; Xu, Lailin; Yabsley, Bruce; Yacoob, Sahal; Yamada, Miho; Yamaguchi, Hiroshi; Yamaguchi, Yohei; Yamamoto, Akira; Yamamoto, Kyoko; Yamamoto, Shimpei; Yamamura, Taiki; Yamanaka, Takashi; Yamauchi, Katsuya; Yamazaki, Yuji; Yan, Zhen; Yang, Haijun; Yang, Hongtao; Yang, Un-Ki; Yang, Yi; Yanush, Serguei; Yao, Liwen; Yao, Weiming; Yasu, Yoshiji; Yatsenko, Elena; Yau Wong, Kaven Henry; Ye, Jingbo; Ye, Shuwei; Yen, Andy L; Yildirim, Eda; Yilmaz, Metin; Yoosoofmiya, Reza; Yorita, Kohei; Yoshida, Rikutaro; Yoshihara, Keisuke; Young, Charles; Young, Christopher John; Youssef, Saul; Yu, David Ren-Hwa; Yu, Jaehoon; Yu, Jiaming; Yu, Jie; Yuan, Li; Yurkewicz, Adam; Yusuff, Imran; Zabinski, Bartlomiej; Zaidan, Remi; Zaitsev, Alexander; Zaman, Aungshuman; Zambito, Stefano; Zanello, Lucia; Zanzi, Daniele; Zeitnitz, Christian; Zeman, Martin; Zemla, Andrzej; Zengel, Keith; Zenin, Oleg; Ženiš, Tibor; Zerwas, Dirk; Zevi della Porta, Giovanni; Zhang, Dongliang; Zhang, Fangzhou; Zhang, Huaqiao; Zhang, Jinlong; Zhang, Lei; Zhang, Xueyao; Zhang, Zhiqing; Zhao, Zhengguo; Zhemchugov, Alexey; Zhong, Jiahang; Zhou, Bing; Zhou, Lei; Zhou, Ning; Zhu, Cheng Guang; Zhu, Hongbo; Zhu, Junjie; Zhu, Yingchun; Zhuang, Xuai; Zhukov, Konstantin; Zibell, Andre; Zieminska, Daria; Zimine, Nikolai; Zimmermann, Christoph; Zimmermann, Robert; Zimmermann, Simone; Zimmermann, Stephanie; Zinonos, Zinonas; Ziolkowski, Michael; Zobernig, Georg; Zoccoli, Antonio; zur Nedden, Martin; Zurzolo, Giovanni; Zutshi, Vishnu; Zwalinski, Lukasz

    2014-01-01

    A novel technique to identify and split clusters created by multiple charged particles in the ATLAS pixel detector using a set of artificial neural networks is presented. Such merged clusters are a common feature of tracks originating from highly energetic objects, such as jets. Neural networks are trained using Monte Carlo samples produced with a detailed detector simulation. This technique replaces the former clustering approach based on a connected component analysis and charge interpolation. The performance of the neural network splitting technique is quantified using data from proton-proton collisions at the LHC collected by the ATLAS detector in 2011 and from Monte Carlo simulations. This technique reduces the number of clusters shared between tracks in highly energetic jets by up to a factor of three. It also provides more precise position and error estimates of the clusters in both the transverse and longitudinal impact parameter resolution.

  2. The phase-II ATLAS pixel tracker upgrade: layout and mechanics.

    CERN Document Server

    Sharma, Abhishek; The ATLAS collaboration

    2016-01-01

    The ATLAS experiment will upgrade its tracking detector during the Phase-II LHC shutdown, to better take advantage of the increased luminosity of the HL-LHC. The upgraded tracker will consist of silicon-strip modules surrounding a pixel detector, and will likely cover an extended eta range, perhaps as far as |eta|<4.0. A number of layout and supporting-structure options are being considered for the pixel detector, with the final choice expected to be made in early 2017. The proposed supporting structures are based on lightweight, highly-thermally-conductive carbon-based materials and are cooled by evaporative carbon dioxide. The various layouts will be described and a description of the supporting structures will be presented, along with results from testing of prototypes.

  3. Prototypes for components of a control system for the ATLAS pixel detector at the HL-LHC

    CERN Document Server

    Boek, J; Kind, P; Mättig, P; Püllen, L; Zeitnitz, C

    2013-01-01

    inner detector of the ATLAS experiment will be replaced entirely including the pixel detector. This new pixel detector requires a specific control system which complies with the strict requirements in terms of radiation hardness, material budget and space for the electronics in the ATLAS experiment. The University ofWuppertal is developing a concept for a DCS (Detector Control System) network consisting of two kinds of ASICs. The first ASIC is the DCS Chip which is located on the pixel detector, very close to the interaction point. The second ASIC is the DCS Controller which is controlling 4x4 DCS Chips from the outer regions of ATLAS via differential data lines. Both ASICs are manufactured in 130 nm deep sub micron technology. We present results from measurements from new prototypes of components for the DCS network.

  4. Slim edge studies, design and quality control of planar ATLAS IBL pixel sensors

    Energy Technology Data Exchange (ETDEWEB)

    Wittig, Tobias

    2013-05-08

    One of the four large experiments at the LHC at CERN is the ATLAS detector, a multi purpose detector. Its pixel detector, composed of three layers, is the innermost part of the tracker. As it is closest to the interaction point, it represents a basic part of the track reconstruction. Besides the requested high resolution one main requirement is the radiation hardness. In the coming years the radiation damage will cause deteriorations of the detector performance. With the planned increase of the luminosity, especially after the upgrade to the High Luminosity LHC, this radiation damage will be even intensified. This circumstance necessitates a new pixel detector featuring improved radiation hard sensors and read-out chips. The present shutdown of the LHC is already utilized to insert an additional b-layer (IBL) into the existing ATLAS pixel detector. The current n-in-n pixel sensor design had to be adapted to the new read-out chip and the module specifications. The new stave geometry requests a reduction of the inactive sensor edge. In a prototype wafer production all modifications have been implemented. The sensor quality control was supervised which led to the decision of the final sensor thickness. In order to evaluate the performance of the sensor chip assemblies with an innovative slim edge design, they have been operated in test beam setups before and after irradiation. Furthermore, the quality control of the planar IBL sensor wafer production was supervised from the stage of wafer delivery to that before the flip chip process to ensure a sufficient amount of functional sensors for the module production.

  5. The Pixel Detector of the ATLAS Experiment for the Run-2 at the Large Hadron Collider

    CERN Document Server

    Guescini, F; The ATLAS collaboration

    2014-01-01

    The Pixel Detector of the ATLAS experiment has shown excellent performance during the whole Run-1 of LHC. Taking advantage of the long showdown, the detector was extracted from the experiment and brought to surface, to equip it with new service quarter panels, to repair modules and to ease installation of the Insertable B-Layer (IBL). IBL is a fourth layer of pixel detectors, and has been installed in May 2014 between the existing Pixel Detector and a new smaller radius beam-pipe at a radial distance of 3.3 cm from the beam axis. The realization of the IBL required the development of several new technologies and solutions in order to overcome the challenges introduced by the extreme environment and working conditions, such as the high radiation levels, the high pixel occupancy and the need of an exceptionally low material budget. Two silicon sensor technologies have been adopted for the IBL modules: planar n-in-n and 3D. Both of these are connected via bump bonding to the new generation 130 nm IBM CMOS FE-I4 ...

  6. Investigation of thin n-in-p planar pixel modules for the ATLAS upgrade

    CERN Document Server

    Savic, N

    2016-01-01

    In view of the High Luminosity upgrade of the Large Hadron Collider (HL-LHC), planned to start around 2023-2025, the ATLAS experiment will undergo a replacement of the Inner Detector. A higher luminosity will imply higher irradiation levels and hence will demand more ra- diation hardness especially in the inner layers of the pixel system. The n-in-p silicon technology is a promising candidate to instrument this region, also thanks to its cost-effectiveness because it only requires a single sided processing in contrast to the n-in-n pixel technology presently employed in the LHC experiments. In addition, thin sensors were found to ensure radiation hardness at high fluences. An overview is given of recent results obtained with not irradiated and irradiated n-in-p planar pixel modules. The focus will be on n-in-p planar pixel sensors with an active thickness of 100 and 150 {\\mu}m recently produced at ADVACAM. To maximize the active area of the sensors, slim and active edges are implemented. The performance of th...

  7. Status of the ATLAS Pixel Detector at the LHC and its performance after three years of operation

    CERN Document Server

    Andreazza, A; The ATLAS collaboration

    2012-01-01

    The ATLAS Pixel Detector is the innermost detector of the ATLAS experi- ment at the Large Hadron Collider at CERN, providing high-resolution mea- surements of charged particle tracks in the high radiation environment close to the collision region. The detector provides hermetic coverage with three cylindrical layers and three layers of forward and backward pixel detectors. It consists of approximately 80 million pixels that are individually read out via chips bump-bonded to 1744 n-in-n silicon substrates. After three years of operation the detector performance is excellent: 96% of the pixels are opera- tional, at 3500 e threshold noise occupancy and efficiency exceed the design specification. The effect of radiation on the silicon sensor is measured and compared with model of radiation damage.

  8. Silicon strip detectors for the ATLAS HL-LHC upgrade

    CERN Document Server

    Bernabeu, J; The ATLAS collaboration

    2011-01-01

    While the Large Hadron Collider (LHC) at CERN is continuing to deliver an ever-increasing luminosity to the experiments, plans for an upgraded machine called Super-LHC (sLHC) are progressing. The upgrade is foreseen to increase the LHC design luminosity by a factor ten. The ATLAS experiment will need to build a new tracker for sLHC operation, which needs to be suited to the harsh sLHC conditions in terms of particle rates and radiation doses. In order to cope with the increase in pile-up backgrounds at the higher luminosity, an all silicon detector is being designed. To successfully face the increased radiation dose, a new generation of extremely radiation hard silicon detectors is being designed. Silicon sensors with sufficient radiation hardness are the subject of an international R&D programme, working on pixel and strip sensors. The efforts presented here concentrate on the innermost strip layers. We have developed a large number of prototype planar detectors produced on p-type wafers in a number of d...

  9. Firmware development and testing of the ATLAS Pixel Detector / IBL ROD card

    CERN Document Server

    Gabrielli, Alessandro; The ATLAS collaboration; Balbi, Gabriele; Bindi, Marcello; Chen, Shaw-pin; Falchieri, Davide; Flick, Tobias; Hauck, Scott Alan; Hsu, Shih-Chieh; Kretz, Moritz; Kugel, Andreas; Lama, Luca; Travaglini, Riccardo; Wensing, Marius; ATLAS Pixel Collaboration

    2015-01-01

    The ATLAS Experiment is reworking and upgrading systems during the current LHC shut down. In particular, the Pixel detector has inserted an additional inner layer called Insertable B-Layer (IBL). The Readout-Driver card (ROD), the Back-of-Crate card (BOC), and the S-Link together form the essential frontend data path of the IBL’s off-detector DAQ system. The strategy for IBL ROD firmware development was three-fold: keeping as much of the Pixel ROD datapath firmware logic as possible, employing a complete new scheme of steering and calibration firmware and designing the overall system to prepare for a future unified code version integrating IBL and Pixel layers. Essential features such as data formatting, frontend-specific error handling, and calibration are added to the ROD data path. An IBL DAQ testbench using realistic frontend chip model was created to serve as an initial framework for full offline electronic system simulation. In this document, major firmware achievements concerning the IBL ROD data pat...

  10. Firmware development and testing of the ATLAS Pixel Detector / IBL ROD card

    CERN Document Server

    Balbi, G; The ATLAS collaboration; Gabrielli, A; Lama, L; Travaglini, R; Backhaus, M; Bindi, M; Chen, S-P; Flick, T; Kretz, M; Kugel, A; Wensing, M

    2014-01-01

    The ATLAS Experiment is reworking and upgrading systems during the current LHC shut down. In particular, the Pixel detector has inserted an additional inner layer called Insertable B-Layer (IBL). The Readout-Driver card (ROD), the Back-of-Crate card (BOC), and the S-Link together form the essential frontend data path of the IBL’s off-detector DAQ system. The strategy for IBLROD firmware development was three-fold: keeping as much of the PixelROD datapath firmware logic as possible, employing a complete new scheme of steering and calibration firmware and designing the overall system to prepare for a future unified code version integrating IBL and Pixel layers. Essential features such as data formatting, frontend-specific error handling, and calibration are added to the ROD data path. An IBLDAQ testbench using realistic frontend chip model was created to serve as an initial framework for full offline electronic system simulation. In this document, major firmware achievements concerning the IBLROD data path im...

  11. System test and noise performance studies at the ATLAS pixel detector

    Energy Technology Data Exchange (ETDEWEB)

    Weingarten, J.

    2007-09-15

    The central component of the ATLAS Inner Tracker is the pixel detector. It consists of three barrel layers and three disk-layers in the end-caps in both forward directions. The innermost barrel layer is mounted at a distance of about 5 cm from the interaction region. With its very high granularity, truly two-dimensional hit information, and fast readout it is well suited to cope with the high densities of charged tracks, expected this close to the interaction region. The huge number of readout channels necessitates a very complex services infrastructure for powering, readout and safety. After a description of the pixel detector and its services infrastructure, key results from the system test at CERN are presented. Furthermore the noise performance of the pixel detector, crucial for high tracking and vertexing efficiencies, is studied. Measurements of the single-channel random noise are presented together with studies of common mode noise and measurements of the noise occupancy using a random trigger generator. (orig.)

  12. Studio di un algoritmo lineare di ricostruzione analogica della posizione per il rivelatore a pixel di ATLAS

    CERN Document Server

    Arelli-Maffioli, A; Troncon, C; Lari, T

    2007-01-01

    A detailed study of spatial resolution of Atlas pixel sensors prototypes was performed. Charge interpolation was used and allowed for a significant improvement with respect to digital resolution. A simplified algorithm for charge interpolation was developed. Its application to both unirradiated and irradiated sensors is presented and discussed.

  13. Status of the ATLAS Pixel Detector at the LHC and its performance after three years of operation.

    CERN Document Server

    Heim, Timon; The ATLAS collaboration

    2013-01-01

    The ATLAS Pixel Detector is the innermost detector of the ATLAS experiment at the Large Hadron Collider at CERN. The detector provides hermetic coverage with three cylindrical layers and three layers of forward and backward pixel detectors. It consists of approximately 80 million pixels that are individually read out via chips bump-bonded to 1744 n-in-n silicon substrates. In this talk, results from the successful operation of the Pixel Detector at the LHC and its status after three years of operation will be presented, including monitoring, calibration procedures, timing optimization and detector performance. The record breaking instantaneous luminosities of 7.7 x 10^33 cm-2 s-1 recently surpassed at the Large Hadron Collider generate a rapidly increasing particle fluence in the ATLAS Pixel Detector. As the radiation dose accumulates, the first effects of radiation damage are now observable in the silicon sensors. A regular monitoring program has been conducted and reveals an increase in the silicon leakage ...

  14. Beam Test Studies of 3D Pixel Sensors Irradiated Non-Uniformly for the ATLAS Forward Physics Detector

    CERN Document Server

    Grinstein, S; Boscardin, M; Christophersen, M; Da Via, C; Betta, G -F Dalla; Darbo, G; Fadeyev, V; Fleta, C; Gemme, C; Grenier, P; Jimenez, A; Lopez, I; Micelli, A; Nelist, C; Parker, S; Pellegrini, G; Phlips, B; Pohl, D L; Sadrozinski, H F -W; Sicho, P; Tsiskaridze, S

    2013-01-01

    Pixel detectors with cylindrical electrodes that penetrate the silicon substrate (so called 3D detectors) offer advantages over standard planar sensors in terms of radiation hardness, since the electrode distance is decoupled from the bulk thickness. In recent years significant progress has been made in the development of 3D sensors, which culminated in the sensor production for the ATLAS Insertable B-Layer (IBL) upgrade carried out at CNM (Barcelona, Spain) and FBK (Trento, Italy). Based on this success, the ATLAS Forward Physics (AFP) experiment has selected the 3D pixel sensor technology for the tracking detector. The AFP project presents a new challenge due to the need for a reduced dead area with respect to IBL, and the in-homogeneous nature of the radiation dose distribution in the sensor. Electrical characterization of the first AFP prototypes and beam test studies of 3D pixel devices irradiated non-uniformly are presented in this paper.

  15. Beam test studies of 3D pixel sensors irradiated non-uniformly for the ATLAS forward physics detector

    Energy Technology Data Exchange (ETDEWEB)

    Grinstein, S., E-mail: sgrinstein@ifae.es [ICREA and Institut de Física d' Altes Energies (IFAE), Barcelona (Spain); Baselga, M. [Centro Nacional de Microelectronica, CNM-IMB (CSIC), Barcelona (Spain); Boscardin, M. [Fondazione Bruno Kessler, FBK-CMM, Trento (Italy); Christophersen, M. [U.S. Naval Research Laboratory, Washington (United States); Da Via, C. [School of Physics and Astronomy, University of Manchester, Manchester (United Kingdom); Dalla Betta, G.-F. [Universita degli Studi di Trento and INFN, Trento (Italy); Darbo, G. [INFN Sezione di Genova, Genova (Italy); Fadeyev, V. [Santa Cruz Institute for Particle Physics, University of California, Santa Cruz (United States); Fleta, C. [Centro Nacional de Microelectronica, CNM-IMB (CSIC), Barcelona (Spain); Gemme, C. [Universita degli Studi di Trento and INFN, Trento (Italy); Grenier, P. [SLAC National Accelerator Laboratory, Menlo Park (United States); Jimenez, A.; Lopez, I.; Micelli, A. [ICREA and Institut de Física d' Altes Energies (IFAE), Barcelona (Spain); Nelist, C. [INFN Sezione di Genova, Genova (Italy); Parker, S. [University of Hawaii, c/o Lawrence Berkeley Laboratory, Berkeley (United States); Pellegrini, G. [Centro Nacional de Microelectronica, CNM-IMB (CSIC), Barcelona (Spain); Phlips, B. [U.S. Naval Research Laboratory, Washington (United States); Pohl, D.-L. [University of Bonn, Bonn (Germany); Sadrozinski, H.F.-W. [Santa Cruz Institute for Particle Physics, University of California, Santa Cruz (United States); and others

    2013-12-01

    Pixel detectors with cylindrical electrodes that penetrate the silicon substrate (so called 3D detectors) offer advantages over standard planar sensors in terms of radiation hardness, since the electrode distance is decoupled from the bulk thickness. In recent years significant progress has been made in the development of 3D sensors, which culminated in the sensor production for the ATLAS Insertable B-Layer (IBL) upgrade carried out at CNM (Barcelona, Spain) and FBK (Trento, Italy). Based on this success, the ATLAS Forward Physics (AFP) experiment has selected the 3D pixel sensor technology for the tracking detector. The AFP project presents a new challenge due to the need for a reduced dead area with respect to IBL, and the in-homogeneous nature of the radiation dose distribution in the sensor. Electrical characterization of the first AFP prototypes and beam test studies of 3D pixel devices irradiated non-uniformly are presented in this paper.

  16. Preliminary results of 3D-DDTC pixel detectors for the ATLAS upgrade

    CERN Document Server

    La Rosa, Alessandro; Dalla Betta, G F; Darbo, G; Gemme, C; Pernegger, H; Piemonte, C; Povoli, M; Ronchin, S; Zoboli, A; Zorzi, N; Bolle, E; Borri, M; Da Via, C; Dong, S; Fazio, S; Grenier, P; Grinstein, S; Gjersdal, H; Hansson, P; Huegging, F; Jackson, P; Kocian, M; Rivero, F; Rohne, O; Sandaker, H; Sjobak, K; Slavicek, T; Tsung, W; Tsybychev, D; Wermes, N; Young, C

    2009-01-01

    3D Silicon sensors fabricated at FBK-irst with the Double-side Double Type Column (DDTC) approach and columnar electrodes only partially etched through p-type substrates were tested in laboratory and in a 1.35 Tesla magnetic field with a 180GeV pion beam at CERN SPS. The substrate thickness of the sensors is about 200um, and different column depths are available, with overlaps between junction columns (etched from the front side) and ohmic columns (etched from the back side) in the range from 110um to 150um. The devices under test were bump bonded to the ATLAS Pixel readout chip (FEI3) at SELEX SI (Rome, Italy). We report leakage current and noise measurements, results of functional tests with Am241 gamma-ray sources, charge collection tests with Sr90 beta-source and an overview of preliminary results from the CERN beam test.

  17. Preliminary Results of 3D-DDTC Pixel Detectors for the ATLAS Upgrade

    Energy Technology Data Exchange (ETDEWEB)

    La Rosa, Alessandro; /CERN; Boscardin, M.; /Fond. Bruno Kessler, Povo; Dalla Betta, G.-F.; /Trento U. /INFN, Trento; Darbo, G.; Gemme, C.; /INFN, Genoa; Pernegger, H.; /CERN; Piemonte, C.; /Fond. Bruno Kessler, Povo; Povoli, M.; /Trento U. /INFN, Trento; Ronchin, S.; /Fond. Bruno Kessler, Povo; Zoboli, A.; /Trento U. /INFN, Trento; Zorzi, N.; /Fond. Bruno Kessler, Povo; Bolle, E.; /Oslo U.; Borri, M.; /INFN, Turin /Turin U.; Da Via, C.; /Manchester U.; Dong, S.; /SLAC; Fazio, S.; /Calabria U.; Grenier, P.; /SLAC; Grinstein, S.; /Barcelona, IFAE; Gjersdal, H.; /Oslo U.; Hansson, P.; /SLAC; Huegging, F.; /Bonn U. /SLAC /INFN, Turin /Turin U. /Oslo U. /Bergen U. /Oslo U. /Prague, Tech. U. /Bonn U. /SUNY, Stony Brook /Bonn U. /SLAC

    2012-04-04

    3D Silicon sensors fabricated at FBK-irst with the Double-side Double Type Column (DDTC) approach and columnar electrodes only partially etched through p-type substrates were tested in laboratory and in a 1.35 Tesla magnetic field with a 180 GeV pion beam at CERN SPS. The substrate thickness of the sensors is about 200 {mu}m, and different column depths are available, with overlaps between junction columns (etched from the front side) and ohmic columns (etched from the back side) in the range from 110 {mu}m to 150 {mu}m. The devices under test were bump bonded to the ATLAS Pixel readout chip (FEI3) at SELEX SI (Rome, Italy). We report leakage current and noise measurements, results of functional tests with Am{sup 241} {gamma}-ray sources, charge collection tests with Sr90 {beta}-source and an overview of preliminary results from the CERN beam test.

  18. Alignment of the Pixel and SCT Modules for the 2004 ATLAS Combined Test Beam

    Energy Technology Data Exchange (ETDEWEB)

    ATLAS Collaboration; Ahmad, A.; Andreazza, A.; Atkinson, T.; Baines, J.; Barr, A.J.; Beccherle, R.; Bell, P.J.; Bernabeu, J.; Broklova, Z.; Bruckman de Renstrom, P.A.; Cauz, D.; Chevalier, L.; Chouridou, S.; Citterio, M.; Clark, A.; Cobal, M.; Cornelissen, T.; Correard, S.; Costa, M.J.; Costanzo, D.; Cuneo, S.; Dameri, M.; Darbo, G.; de Vivie, J.B.; Di Girolamo, B.; Dobos, D.; Drasal, Z.; Drohan, J.; Einsweiler, K.; Elsing, M.; Emelyanov, D.; Escobar, C.; Facius, K.; Ferrari, P.; Fergusson, D.; Ferrere, D.; Flick,, T.; Froidevaux, D.; Gagliardi, G.; Gallas, M.; Gallop, B.J.; Gan, K.K.; Garcia, C.; Gavrilenko, I.L.; Gemme, C.; Gerlach, P.; Golling, T.; Gonzalez-Sevilla, S.; Goodrick, M.J.; Gorfine, G.; Gottfert, T.; Grosse-Knetter, J.; Hansen, P.H.; Hara, K.; Hartel, R.; Harvey, A.; Hawkings, R.J.; Heinemann, F.E.W.; Henss, T.; Hill, J.C.; Huegging, F.; Jansen, E.; Joseph, J.; Unel, M. Karagoz; Kataoka, M.; Kersten, S.; Khomich, A.; Klingenberg, R.; Kodys, P.; Koffas, T.; Konstantinidis, N.; Kostyukhin, V.; Lacasta, C.; Lari, T.; Latorre, S.; Lester, C.G.; Liebig, W.; Lipniacka, A.; Lourerio, K.F.; Mangin-Brinet, M.; Marti i Garcia, S.; Mathes, M.; Meroni, C.; Mikulec, B.; Mindur, B.; Moed, S.; Moorhead, G.; Morettini, P.; Moyse, E.W.J.; Nakamura, K.; Nechaeva, P.; Nikolaev, K.; Parodi, F.; Parzhitskiy, S.; Pater, J.; Petti, R.; Phillips, P.W.; Pinto, B.; Poppleton, A.; Reeves, K.; Reisinger, I.; Reznicek, P.; Risso, P.; Robinson, D.; Roe, S.; Rozanov, A.; Salzburger, A.; Sandaker, H.; Santi, L.; Schiavi, C.; Schieck, J.; Schultes, J.; Sfyrla, A.; Shaw, C.; Tegenfeldt, F.; Timmermans, C.J.W.P.; Toczek, B.; Troncon, C.; Tyndel, M.; Vernocchi, F.; Virzi, J.; Anh, T. Vu; Warren, M.; Weber, J.; Weber, M.; Weidberg, A.R.; Weingarten, J.; Wellsf, P.S.; Zhelezkow, A.

    2008-06-02

    A small set of final prototypes of the ATLAS Inner Detector silicon tracking system(Pixel Detector and SemiConductor Tracker), were used to take data during the 2004 Combined Test Beam. Data were collected from runs with beams of different flavour (electrons, pions, muons and photons) with a momentum range of 2 to 180 GeV/c. Four independent methods were used to align the silicon modules. The corrections obtained were validated using the known momenta of the beam particles and were shown to yield consistent results among the different alignment approaches. From the residual distributions, it is concluded that the precision attained in the alignmentof the silicon modules is of the order of 5 mm in their most precise coordinate.

  19. Characterization of silicon 3D pixel detectors for the ATLAS Forward Physics experiment

    Energy Technology Data Exchange (ETDEWEB)

    Lopez Paz, I.; Cavallaro, E.; Lange, J. [Institut de Fisica d' Altes Energies - IFAE, 08193 Bellaterra, Barcelona (Spain); Grinstein, S. [Institut de Fisica d' Altes Energies - IFAE, 08193 Bellaterra, Barcelona (Spain); Catalan Institution for Research and Advanced Studies - ICREA, Barcelona (Spain)

    2015-07-01

    The ATLAS Forward Physics (AFP) project aims to measure protons scattered under a small angle from the pp collisions in ATLAS. In order to perform such measurements, a new silicon tracker, together with a time-of-flight detector for pile-up removal, are planned to be installed at ∼210 m from the interaction point and at 2-3 mm from the LHC proton beam. To cope with such configuration and maximize the physics outcome, the tracker has to fulfil three main requirements: endure highly non-uniform radiation doses, due to the very inhomogeneous beam profile, have slim and efficient edges to improve the acceptance of the tracker, and provide good position resolution. Recent laboratory and beam test characterization results of AFP prototypes will be presented. Slim-edged 3D pixel detectors down to 100-200 μm were studied and later non-uniformly irradiated (with a peak fluence of several 10{sup 15} n{sub eq}/cm{sup 2}) to determine the fulfilment of the AFP requirements. (authors)

  20. Radiation-hard ASICs for optical data transmission in the ATLAS pixel detector

    CERN Document Server

    Ziolkowski, M; Buchholz, P; Ciliox, A; Gan, K K; Holder, M; Johnson, M; Kagan, H; Kass, R; Nderitu, S; Rahimi, A; Rush, C J; Smith, S; Ter-Antonian, R; Zoeller, M M

    2004-01-01

    We have developed two radiation-hard ASICs for optical data transmission in the ATLAS pixel detector at the CERN Large Hadron Collider (LHC). The first circuit is a driver chip for a Vertical Cavity Surface Emitting Laser (VCSEL) diode to be used for 80 Mbit/s data transmission from the detector. The second circuit is a Bi-Phase Mark, decoder chip to recover the control data and 40 MHz clock received optically by a PIN diode on the detector side. During ten years of operation at the LHC, the ATLAS optical link circuitry will be exposed to a maximum total fluence of 10/sup 15/ 1-MeV-equivalent neutrons per cm/sup 2/. We have successfully implemented both ASICs in a commercial 0.25 mu m CMOS technology using standard layout techniques to enhance the radiation tolerance. Both chips are four- channel devices compatible with common cathode PIN and VCSEL arrays. We present results from final prototype circuits and from irradiation studies of both circuits with 24 GeV protons up to a total dose of 57 Mrad. (3 refs).

  1. Characterization and Performance of Silicon n-in-p Pixel Detectors for the ATLAS Upgrades

    CERN Document Server

    Weigell, Philipp; Gallrapp, Christian; La Rosa, Alessandro; Macchiolo, Anna; Nisius, Richard; Pernegger, Heinz; Richter, Rainer

    2011-01-01

    The existing ATLAS Tracker will be at its functional limit for particle fluences of 10^15 neq/cm^2 (LHC). Thus for the upgrades at smaller radii like in the case of the planned Insertable B-Layer (IBL) and for increased LHC luminosities (super LHC) the development of new structures and materials which can cope with the resulting particle fluences is needed. N-in-p silicon devices are a promising candidate for tracking detectors to achieve these goals, since they are radiation hard, cost efficient and are not type inverted after irradiation. A n-in-p pixel production based on a MPP/HLL design and performed by CiS (Erfurt, Germany) on 300 \\mu m thick Float-Zone material is characterised and the electrical properties of sensors and single chip modules (SCM) are presented, including noise, charge collection efficiencies, and measurements with MIPs as well as an 241Am source. The SCMs are built with sensors connected to the current the ATLAS read-out chip FE-I3. The characterisation has been performed with the ATL...

  2. Three Generations of FPGA DAQ Development for the ATLAS Pixel Detector

    CERN Document Server

    AUTHOR|(CDS)2091916; Hsu, Shih-Chieh; Hauck, Scott Alan

    The Large Hadron Collider (LHC) at the European Center for Nuclear Research (CERN) tracks a schedule of long physics runs, followed by periods of inactivity known as Long Shutdowns (LS). During these LS phases both the LHC, and the experiments around its ring, undergo maintenance and upgrades. For the LHC these upgrades improve their ability to create data for physicists; the more data the LHC can create the more opportunities there are for rare events to appear that physicists will be interested in. The experiments upgrade so they can record the data and ensure the event won’t be missed. Currently the LHC is in Run 2 having completed the first LS of three. This thesis focuses on the development of Field-Programmable Gate Array (FPGA)-based readout systems that span across three major tasks of the ATLAS Pixel data acquisition (DAQ) system. The evolution of Pixel DAQ’s Readout Driver (ROD) card is presented. Starting from improvements made to the new Insertable B-Layer (IBL) ROD design, which was part of t...

  3. Studio di Rivelatori a Pixel di nuova generazione per il Sistema di Tracciamento di ATLAS.

    CERN Document Server

    Gaudiello, Andrea; Schiavi, Carlo

    In 2013 the LHC will undergo a long shutdown (Phase 0) in preparation for a an energy and luminosity upgrade. During this period the ATLAS Pixel Detector (that is the tracking detector closest to the beamline) will be upgraded. The new detector, called Insertable B-Layer (IBL), will be installed between the existing pixel detector and a new beam-pipe of smaller radius in order to ensure and maintain excellent performance of tracking, vertexing and jet flavor tagging. To satisfy the new requirements a new electronic front- end (FE-I4) and 2 sensor technologies have been developed: Planar and 3D. Genova is one of two sites dedicated to the assembly of the modules of IBL. The work is then carried out in two parallel directions: on one hand the production and its optimization; on the other the comparison and testing of these new technologies. Chapter 1 gives an overview of the theoretical framework needed to understand the importance and the goals of the experiments operating at the Large Hadron Collider (LHC), w...

  4. Silvaco ATLAS model of ESA's Gaia satellite e2v CCD91-72 pixels

    CERN Document Server

    Seabroke, G M; Burt, D; Robbins, M S; 10.1117/12.856958

    2010-01-01

    The Gaia satellite is a high-precision astrometry, photometry and spectroscopic ESA cornerstone mission, currently scheduled for launch in 2012. Its primary science drivers are the composition, formation and evolution of the Galaxy. Gaia will achieve its unprecedented accuracy requirements with detailed calibration and correction for CCD radiation damage and CCD geometric distortion. In this paper, the third of the series, we present our 3D Silvaco ATLAS model of the Gaia e2v CCD91-72 pixel. We publish e2v's design model predictions for the capacities of one of Gaia's pixel features, the supplementary buried channel (SBC), for the first time. Kohley et al. (2009) measured the SBC capacities of a Gaia CCD to be an order of magnitude smaller than e2v's design. We have found the SBC doping widths that yield these measured SBC capacities. The widths are systematically 2 {\\mu}m offset to the nominal widths. These offsets appear to be uncalibrated systematic offsets in e2v photolithography, which could either be du...

  5. Simulation of the depletion voltage evolution of the ATLAS Pixel Detector

    CERN Document Server

    Beyer, Julien-christopher; The ATLAS collaboration

    2017-01-01

    The ATLAS Pixel detector has been operating since 2010 and consists of hybrid pixel modules where the sensitive elements are planar n-in-n sensors. In order to investigate and predict the evolution of the depletion voltage and of the leakage current in the different layers, a fully analytical implementation of the Hamburg model was derived. The parameters of the model, describing the dependence of the depletion voltage (U_depl) on fluence, temperature and time were tuned with a fit to the available measurements of Udepl in the last years of operation. A particular emphasis is put on the B-Layer, where the highest fluence has been accumulated up to now. A precise input of temperature and radiation dose is generated from the on-module temperature monitoring and the luminosity data. The analysis is then also extended to the Insertable B-Layer (IBL), installed at the end of Run-1, where we expect the fastest evolution of the radiation damage with luminosity, due to its closer position to the interaction point. Di...

  6. ATLAS-TPX: a two-layer pixel detector setup for neutron detection and radiation field characterization

    Science.gov (United States)

    Bergmann, B.; Caicedo, I.; Leroy, C.; Pospisil, S.; Vykydal, Z.

    2016-10-01

    A two-layer pixel detector setup (ATLAS-TPX), designed for thermal and fast neutron detection and radiation field characterization is presented. It consists of two segmented silicon detectors (256 × 256 pixels, pixel pitch 55 μm, thicknesses 300 μm and 500 μm) facing each other. To enhance the neutron detection efficiency a set of converter layers is inserted in between these detectors. The pixelation and the two-layer design allow a discrimination of neutrons against γs by pattern recognition and against charged particles by using the coincidence and anticoincidence information. The neutron conversion and detection efficiencies are measured in a thermal neutron field and fast neutron fields with energies up to 600 MeV. A Geant4 simulation model is presented, which is validated against the measured detector responses. The reliability of the coincidence and anticoincidence technique is demonstrated and possible applications of the detector setup are briefly outlined.

  7. Total Ionising Dose effects in the FE-I4 front-end chip of the ATLAS Pixel IBL detector

    CERN Document Server

    AUTHOR|(INSPIRE)INSPIRE-00439451

    2016-01-01

    The ATLAS Pixel Insertable B-Layer (IBL) detector was installed into the ATLAS experiment in 2014 and has been in operation since 2015. During the first year of data taking, an increase of the LV current, produced by the FE-I4 chip, was observed. This increase was traced back to radiation damage in the chip. The dependence of the current from the Total Ionizing Dose (TID) and temperature has been tested with X-ray irradiations. This report presents the measurement results and gives a parameterisation of the leakage current and detector operation guidelines.

  8. Optimization of thin n-in-p planar pixel modules for the ATLAS upgrade at HL-LHC

    Science.gov (United States)

    Macchiolo, A.; Beyer, J.; La Rosa, A.; Nisius, R.; Savic, N.

    2017-01-01

    The ATLAS experiment will undergo around the year 2025 a replacement of the tracker system in view of the high luminosity phase of the LHC (HL-LHC) with a new 5-layer pixel system. Thin planar pixel sensors are promising candidates to instrument the innermost region of the new pixel system, thanks to the reduced contribution to the material budget and their high charge collection efficiency after irradiation. The sensors of 50-150 μm thickness, interconnected to FE-I4 read-out chips, have been characterized with radioactive sources and beam tests. In particular active edge sensors have been investigated. The performance of two different versions of edge designs are compared: the first with a bias ring, and the second one where only a floating guard ring has been implemented. The hit efficiency at the edge has also been studied after irradiation at a fluence of 1015 neq/cm2. Highly segmented sensors will represent a challenge for the tracking in the forward region of the pixel system at HL-LHC. In order to reproduce the performance of 50x50 μm2 pixels at high pseudo-rapidity values, FE-I4 compatible planar pixel sensors have been studied before and after irradiation in beam tests at high incidence angles with respect to the short pixel direction. Results on the hit efficiency in this configuration are discussed for different sensor thicknesses.

  9. Radiation hardness and timing studies of a monolithic TowerJazz pixel design for the new ATLAS Inner Tracker

    Science.gov (United States)

    Riegel, C.; Backhaus, M.; Van Hoorne, J. W.; Kugathasan, T.; Musa, L.; Pernegger, H.; Riedler, P.; Schaefer, D.; Snoeys, W.; Wagner, W.

    2017-01-01

    A part of the upcoming HL-LHC upgrade of the ATLAS Detector is the construction of a new Inner Tracker. This upgrade opens new possibilities, but also presents challenges in terms of occupancy and radiation tolerance. For the pixel detector inside the inner tracker, hybrid modules containing passive silicon sensors and connected readout chips are presently used, but require expensive assembly techniques like fine-pitch bump bonding. Silicon devices fabricated in standard commercial CMOS technologies, which include part or all of the readout chain, are also investigated offering a reduced cost as they are cheaper per unit area than traditional silicon detectors. If they contain the full readout chain, as for a fully monolithic approach, there is no need for the expensive flip-chip assembly, resulting in a further cost reduction and material savings. In the outer pixel layers of the ATLAS Inner Tracker, the pixel sensors must withstand non-ionising energy losses of up to 1015 n/cm2 and offer a timing resolution of 25 ns or less. This paper presents test results obtained on a monolithic test chip, the TowerJazz 180nm Investigator, towards these specifications. The presented program of radiation hardness and timing studies has been launched to investigate this technology's potential for the new ATLAS Inner Tracker.

  10. Submission of the first full scale prototype chip for upgraded ATLAS pixel detector at LHC, FE-I4A

    Energy Technology Data Exchange (ETDEWEB)

    Barbero, Marlon, E-mail: barbero@physik.uni-bonn.de [Physikalisches Institut Universitaet Bonn, Nussallee 12, 53115 Bonn (Germany); Arutinov, David [Physikalisches Institut Universitaet Bonn, Nussallee 12, 53115 Bonn (Germany); Beccherle, Roberto; Darbo, Giovanni [INFN Genova, via Dodecaseno 33, IT-16146 Genova (Italy); Dube, Sourabh; Elledge, David; Fleury, Julien [Lawrence Berkeley National Laboratory, 1 Cyclotron Road, CA 94720 (United States); Fougeron, Denis [CPPM Aix-Marseille Universite, CNRS/IN2P3, Marseille (France); Garcia-Sciveres, Maurice [Lawrence Berkeley National Laboratory, 1 Cyclotron Road, CA 94720 (United States); Gensolen, Fabrice [CPPM Aix-Marseille Universite, CNRS/IN2P3, Marseille (France); Gnani, Dario [Lawrence Berkeley National Laboratory, 1 Cyclotron Road, CA 94720 (United States); Gromov, Vladimir [NIKHEF, Science Park 105, 1098 XG Amsterdam (Netherlands); Jensen, Frank [Lawrence Berkeley National Laboratory, 1 Cyclotron Road, CA 94720 (United States); Hemperek, Tomasz; Karagounis, Michael [Physikalisches Institut Universitaet Bonn, Nussallee 12, 53115 Bonn (Germany); Kluit, Ruud [NIKHEF, Science Park 105, 1098 XG Amsterdam (Netherlands); Kruth, Andre [Physikalisches Institut Universitaet Bonn, Nussallee 12, 53115 Bonn (Germany); Mekkaoui, Abderrezak [Lawrence Berkeley National Laboratory, 1 Cyclotron Road, CA 94720 (United States); Menouni, Mohsine [CPPM Aix-Marseille Universite, CNRS/IN2P3, Marseille (France); Schipper, Jan David [NIKHEF, Science Park 105, 1098 XG Amsterdam (Netherlands); and others

    2011-09-11

    A new ATLAS pixel chip FE-I4 is being developed for use in upgraded LHC luminosity environments, including the near-term Insertable B-Layer (IBL) upgrade. FE-I4 is designed in a 130 nm CMOS technology, presenting advantages in terms of radiation tolerance and digital logic density compared to the 0.25{mu}m CMOS technology used for the current ATLAS pixel IC, FE-I3. The FE-I4 architecture is based on an array of 80x336 pixels, each 50x250{mu}m{sup 2}, consisting of analog and digital sections. In the summer 2010, a first full scale prototype FE-I4A was submitted for an engineering run. This IC features the full scale pixel array as well as the complex periphery of the future full-size FE-I4. The FE-I4A contains also various extra test features which should prove very useful for the chip characterization, but deviate from the needs for standard operation of the final FE-I4 for IBL. In this paper, focus will be brought to the various features implemented in the FE-I4A submission, while also underlining the main differences between the FE-I4A IC and the final FE-I4 as envisioned for IBL.

  11. Active Pixel Sensors in ams H18/H35 HV-CMOS Technology for the ATLAS HL-LHC Upgrade

    CERN Document Server

    Ristic, Branislav

    2016-01-01

    Deep sub micron HV-CMOS processes offer the opportunity for sensors built by industry standard techniques while being HV tolerant, making them good candidates for drift-based, fast collecting, thus radiation-hard pixel detectors. For the upgrade of the ATLAS Pixel Detector towards the HL-LHC requirements, active pixel sensors in HV-CMOS technology were investigated. These implement amplifier and discriminator stages directly in insulating deep n-wells, which also act as collecting electrodes. The deep n-wells allow for bias voltages up to 150V leading to a depletion depth of several 10um. Prototype sensors in the ams H18 180nm and H35 350nm HV-CMOS processes have been manufactured, acting as a potential drop-in replacement for the current ATLAS Pixel sensors, thus leaving higher level processing such as trigger handling to dedicated read-out chips. Sensors were thoroughly tested in lab measurements as well as in testbeam experiments. Irradiation with X-rays and protons revealed a tolerance to ionizing doses o...

  12. Measurements and TCAD simulation of novel ATLAS planar pixel detector structures for the HL-LHC upgrade

    CERN Document Server

    INSPIRE-00304438; Gkougkousis, E.; Lounis, A.

    2015-01-01

    The LHC accelerator complex will be upgraded between 2020-2022, to the High-Luminosity-LHC, to considerably increase statistics for the various physics analyses. To operate under these challenging new conditions, and maintain excellent performance in track reconstruction and vertex location, the ATLAS pixel detector must be substantially upgraded and a full replacement is expected. Processing techniques for novel pixel designs are optimised through characterisation of test structures in a clean room and also through simulations with Technology Computer Aided Design (TCAD). A method to study non-perpendicular tracks through a pixel device is discussed. Comparison of TCAD simulations with Secondary Ion Mass Spectrometry (SIMS) measurements to investigate the doping profile of structures and validate the simulation process is also presented.

  13. The upgraded Pixel Detector of the ATLAS Experiment for Run-II at the Large Hadron Collider

    CERN Document Server

    AUTHOR|(INSPIRE)INSPIRE-00407702

    2016-01-01

    The Pixel Detector of the ATLAS experiment has shown excellent performance during the whole Run-1 of the LHC. Taking advantage of the detector development period 2013 – 2014, the detector was extracted from the experiment and brought to surface to equip it with new service panels and to repair modules furthermore this helped with the installation of the Insertable B-Layer (IBL), fourth layer of pixel, installed in between the existing Pixel Detector and a new beam-pipe at a radius of 3.3 cm. To cope with the high radiation and increased pixel occupancy due to the proximity to the interaction point, two different silicon sensor technologies (planar and 3D) have been used. A new readout chip has been designed with CMOS 130nm technology with larger area, smaller pixel size and faster readout capability. Dedicated design features in combination with a new composite material were considered and used in order to reduce the material budget of the support structure while keeping the optimal thermo-mechanical perfor...

  14. Tracking and flavour-tagging performance for HV-CMOS sensors in the context of the ATLAS ITK pixel simulation program

    Science.gov (United States)

    Calandri, A.; Vacavant, L.; Barbero, M.; Rozanov, A.; Djama, F.

    2016-12-01

    The HV-CMOS (High Voltage - Complementary Metal-Oxide Semiconductor) pixel technology has recently risen interest for the upgrade of the pixel detector of the ATLAS experiment towards the High Luminosity phase of the Large Hadron Collider (LHC) . HV-CMOS sensors can be employed in the pixel outer layers (R >15 cm), where the radiation hardness requirements are less stringent, as they could instrument large areas at a relatively low cost. In addition, smaller pixel granularity can be achieved by exploiting sub-pixel encoding technology. Therefore, the largest impact on physics performance, tracking and flavour tagging, could be reached if exploited in the innermost layer (in place of the current IBL) or in the next-to-innermost layer. This proceeding will present studies on tracking and flavour-tagging performance in presence of HV-CMOS sensors in the innermost layer of the ATLAS detector.

  15. A Parallel FPGA Implementation for Real-Time 2D Pixel Clustering for the ATLAS Fast TracKer Processor

    CERN Document Server

    Sotiropoulou, C-L; The ATLAS collaboration; Annovi, A; Beretta, M; Kordas, K; Nikolaidis, S; Petridou, C; Volpi, G

    2014-01-01

    The parallel 2D pixel clustering FPGA implementation used for the input system of the ATLAS Fast TracKer (FTK) processor is presented. The input system for the FTK processor will receive data from the Pixel and micro-strip detectors from inner ATLAS read out drivers (RODs) at full rate, for total of 760Gbs, as sent by the RODs after level-1 triggers. Clustering serves two purposes, the first is to reduce the high rate of the received data before further processing, the second is to determine the cluster centroid to obtain the best spatial measurement. For the pixel detectors the clustering is implemented by using a 2D-clustering algorithm that takes advantage of a moving window technique to minimize the logic required for cluster identification. The cluster detection window size can be adjusted for optimizing the cluster identification process. Additionally, the implementation can be parallelized by instantiating multiple cores to identify different clusters independently thus exploiting more FPGA resources. ...

  16. A Parallel FPGA Implementation for Real-Time 2D Pixel Clustering for the ATLAS Fast TracKer Processor

    CERN Document Server

    Sotiropoulou, C-L; The ATLAS collaboration; Annovi, A; Beretta, M; Kordas, K; Nikolaidis, S; Petridou, C; Volpi, G

    2014-01-01

    The parallel 2D pixel clustering FPGA implementation used for the input system of the ATLAS Fast TracKer (FTK) processor is presented. The input system for the FTK processor will receive data from the Pixel and micro-strip detectors from inner ATLAS read out drivers (RODs) at full rate, for total of 760Gbs, as sent by the RODs after level1 triggers. Clustering serves two purposes, the first is to reduce the high rate of the received data before further processing, the second is to determine the cluster centroid to obtain the best spatial measurement. For the pixel detectors the clustering is implemented by using a 2D-clustering algorithm that takes advantage of a moving window technique to minimize the logic required for cluster identification. The cluster detection window size can be adjusted for optimizing the cluster identification process. Additionally, the implementation can be parallelized by instantiating multiple cores to identify different clusters independently thus exploiting more FPGA resources. T...

  17. Performance and description of the upgraded readout with the new back-end electronics for the ATLAS Pixel detector

    CERN Document Server

    Yajima, Kazuki; The ATLAS collaboration

    2017-01-01

    LHC increased drastically its performance during the RUN2 data taking, starting from a peak instantaneous luminosity of up to $5\\times10^{33} \\mathrm{cm}^{-2} \\mathrm{s}^{-1}$ in 2015 to conclude with the record value of $1.4\\times10^{34} \\mathrm{cm}^{-2} \\mathrm{s}^{-1}$ in November 2016. The concurrent increase of the trigger rate and event size forced the ATLAS experiment to exploit its sub-detectors to the maximum, approaching and possibly overcoming the design parameters. The ATLAS Pixel data acquisition system was upgraded to avoid possible bandwidth limitations. Two upgrades of the read-out electronics have been done. The first one during 2015/16 YETS, when the outermost pixel layer (Layer-2) was upgraded and its bandwidth was doubled. This upgrade partly contributed to maintain the data taking efficiency of the Pixel detector at a relatively high level ($\\sim$99%) during the 2016 run. A similar upgrade of the read-out system for the middle layer (Layer-1) is ongoing during 2016/17 EYETS. The details o...

  18. Thin n-in-p planar pixel sensors and active edge sensors for the ATLAS upgrade at HL-LHC

    CERN Document Server

    Terzo, Stefano; Nisius, R.; Paschen, B.

    2014-01-01

    Silicon pixel modules employing n-in-p planar sensors with an active thickness of 200 $\\mu$m, produced at CiS, and 100-200 $\\mu$m thin active/slim edge sensor devices, produced at VTT in Finland have been interconnected to ATLAS FE-I3 and FE-I4 read-out chips. The thin sensors are designed for high energy physics collider experiments to ensure radiation hardness at high fluences. Moreover, the active edge technology of the VTT production maximizes the sensitive region of the assembly, allowing for a reduced overlap of the modules in the pixel layer close to the beam pipe. The CiS production includes also four chip sensors according to the module geometry planned for the outer layers of the upgraded ATLAS pixel detector to be operated at the HL-LHC. The modules have been characterized using radioactive sources in the laboratory and with high precision measurements at beam tests to investigate the hit efficiency and charge collection properties at different bias voltages and particle incidence angles. The perfo...

  19. Selected results from the static characterization of edgeless n-on-p planar pixel sensors for ATLAS upgrades

    CERN Document Server

    Giacomini, Gabriele; Bomben, Marco; Boscardin, Maurizio; Bosisio, Luciano; Calderini, Giovanni; Chauveau, Jacques; La Rosa, Alessandro; Marchiori, Giovanni; Zorzi, Nicola

    2014-01-01

    In view of the LHC upgrade for the High Luminosity Phase (HL-LHC), the ATLAS experiment is planning to replace the Inner Detector with an all-Silicon system. The n-on-p technology represents a valid solution for the modules of most of the layers, given the significant radiation hardness of this option and the reduced cost. There is also the demand to reduce the inactive areas to a minimum. The ATLAS LPNHE Paris group and FBK Trento started a collaboration for the development on a novel n-on-p edgeless planar pixel design, based on the deep-trench process which can cope with all these requirements. This paper reports selected results from the electrical characterization, both before and after irradiation, of test structures from the first production batch.

  20. Development of Edgeless Silicon Pixel Sensors on p-type substrate for the ATLAS High-Luminosity Upgrade

    CERN Document Server

    Calderini, G; Bomben, M; Boscardin, M; Bosisio, L; Chauveau, J; Giacomini, G; La Rosa, A; Marchiori, G; Zorzi, N

    2014-01-01

    In view of the LHC upgrade for the high luminosity phase (HL-LHC), the ATLAS experiment is planning to replace the inner detector with an all-silicon system. The n-in-p bulk technology represents a valid solution for the modules of most of the layers, given the significant radiation hardness of this option and the reduced cost. The large area necessary to instrument the outer layers will demand to tile the sensors, a solution for which the inefficient region at the border of each sensor needs to be reduced to the minimum size. This paper reports on a joint R&D project by the ATLAS LPNHE Paris group and FBK Trento on a novel n-in-p edgeless planar pixel design, based on the deep-trench process available at FBK.

  1. Chip development in 65 nm CMOS technology for the high luminosity upgrade of the ATLAS pixel detector

    Energy Technology Data Exchange (ETDEWEB)

    Germic, Leonard; Hemperek, Tomasz; Kishishita, Tetsuichi; Krueger, Hans; Rymaszewski, Piotr; Wermes, Norbert [University of Bonn, Bonn (Germany)

    2016-07-01

    The LHC High Luminosity upgrade will result in a significant change of environment in which particle detectors are going to operate, especially for devices very close to the interaction point like pixel detector electronics. Challenges arising from the increased hit rate will have to be solved by designing faster and more complex readout electronics that will also have to withstand unprecedented radiation doses. Developing such integrated circuit requires a significant R and D effort and resources, therefore a joint development project between several institutes (including ours) was started. This collaboration, named RD53, aims to develop a pixel readout chip suitable for ATLAS' and CMS' upgrades using a 65nm CMOS technology. During this presentation motivations and benefits of using this very deep-submicron technology are discussed. Most of the talk is allocated to presenting some of the circuits designed by our group (focusing on developments connected to RD53 collaboration), along with their performance measurement results.

  2. Performance of Edgeless Silicon Pixel Sensors on p-type substrate for the ATLAS High-Luminosity Upgrade

    CERN Document Server

    INSPIRE-00052711; Boscardin, Maurizio; Bosisio, Luciano; Calderini, Giovanni; Chauveau, Jacques; Ducourthial, Audrey; Giacomini, Gabriele; Marchiori, Giovanni; Zorzi, Nicola

    2016-01-01

    In view of the LHC upgrade phases towards the High Luminosity LHC (HL-LHC), the ATLAS experiment plans to upgrade the Inner Detector with an all-silicon system. The n-on-p silicon technology is a promising candidate to achieve a large area instrumented with pixel sensors, since it is radiation hard and cost effective. The paper reports on the performance of novel n-on-p edgeless planar pixel sensors produced by FBK-CMM, making use of the active trench for the reduction of the dead area at the periphery of the device. After discussing the sensor technology an overview of the first beam test results will be given.

  3. Development of Edgeless Silicon Pixel Sensors on p-type substrate for the ATLAS High-Luminosity Upgrade

    Energy Technology Data Exchange (ETDEWEB)

    Calderini, G. [Laboratoire de Physique Nucléaire et des Hautes Energies (LPNHE), Paris (France); Dipartimento di Fisica E. Fermi, Universitá di Pisa, Pisa (Italy); Bagolini, A. [Fondazione Bruno Kessler, Centro per i Materiali e i Microsistemi (FBK-CMM), Povo di Trento (Italy); Beccherle, R. [Istituto Nazionale di Fisica Nucleare, Sez. di Pisa (Italy); Bomben, M. [Laboratoire de Physique Nucléaire et des Hautes Energies (LPNHE), Paris (France); Boscardin, M. [Fondazione Bruno Kessler, Centro per i Materiali e i Microsistemi (FBK-CMM), Povo di Trento (Italy); Bosisio, L. [Università degli studi di Trieste (Italy); INFN-Trieste (Italy); Chauveau, J. [Laboratoire de Physique Nucléaire et des Hautes Energies (LPNHE), Paris (France); Giacomini, G. [Fondazione Bruno Kessler, Centro per i Materiali e i Microsistemi (FBK-CMM), Povo di Trento (Italy); La Rosa, A. [Section de Physique (DPNC), Universitè de Geneve, Geneve (Switzerland); Marchiori, G. [Laboratoire de Physique Nucléaire et des Hautes Energies (LPNHE), Paris (France); Zorzi, N. [Fondazione Bruno Kessler, Centro per i Materiali e i Microsistemi (FBK-CMM), Povo di Trento (Italy)

    2016-09-21

    In view of the LHC upgrade phases towards the High Luminosity LHC (HL-LHC), the ATLAS experiment plans to upgrade the Inner Detector with an all-silicon system. The n-on-p silicon technology is a promising candidate to achieve a large area instrumented with pixel sensors, since it is radiation hard and cost effective. The presentation describes the performance of novel n-in-p edgeless planar pixel sensors produced by FBK-CMM, making use of the active trench for the reduction of the dead area at the periphery of the device. After discussing the sensor technology, some feedback from preliminary results of the first beam test will be discussed.

  4. Development of Edgeless Silicon Pixel Sensors on p-type substrate for the ATLAS High-Luminosity Upgrade

    Science.gov (United States)

    Calderini, G.; Bagolini, A.; Beccherle, R.; Bomben, M.; Boscardin, M.; Bosisio, L.; Chauveau, J.; Giacomini, G.; La Rosa, A.; Marchiori, G.; Zorzi, N.

    2016-09-01

    In view of the LHC upgrade phases towards the High Luminosity LHC (HL-LHC), the ATLAS experiment plans to upgrade the Inner Detector with an all-silicon system. The n-on-p silicon technology is a promising candidate to achieve a large area instrumented with pixel sensors, since it is radiation hard and cost effective. The presentation describes the performance of novel n-in-p edgeless planar pixel sensors produced by FBK-CMM, making use of the active trench for the reduction of the dead area at the periphery of the device. After discussing the sensor technology, some feedback from preliminary results of the first beam test will be discussed.

  5. High speed data transmission on small gauge cables for the ATLAS Phase-II Pixel detector upgrade

    Science.gov (United States)

    Shahinian, J.; Volk, J.; Fadeyev, V.; Grillo, A. A.; Meimban, B.; Nielsen, J.; Wilder, M.

    2016-03-01

    The High Luminosity LHC will present a number of challenges for the upgraded ATLAS detector. In particular, data transmission requirements for the upgrade of the ATLAS Pixel detector will be difficult to meet. The expected trigger rate and occupancy imply multi-gigabit per second transmission rates will be required but radiation levels at the smallest radius preclude completely optical solutions. Electrical transmission up to distances of 7m will be necessary to move optical components to an area with lower radiation levels. Here, we explore the use of small gauge electrical cables as a high-bandwidth, radiation hard solution with a sufficiently small radiation length. In particular, we present a characterization of various twisted wire pair (TWP) configurations of various material structures, including measurements of their bandwidth, crosstalk, and radiation hardness. We find that a custom ``hybrid'' cable consisting of 1m of a multi-stranded TWP with Poly-Ether-Ether-Ketone (PEEK) insulation and a thin Al shield followed by 6m of a thin twin-axial cable presents a low-mass solution that fulfills bandwidth requirements and is expected to be sufficiently radiation hard. Additionally, we discuss preliminary results of using measured S-parameters to produce a SPICE model for a 1m sample of the custom TWP to be used for the development of new pixel readout chips.

  6. High-voltage pixel detectors in commercial CMOS technologies for ATLAS, CLIC and Mu3e experiments

    CERN Document Server

    Peric, Ivan; Backhaus, Malte; Barbero, Marlon; Benoit, Mathieu; Berger, Niklaus; Bompard, Frederic; Breugnon, Patrick; Clemens, Jean-Claude; Dannheim, Dominik; Dierlamm, Alexander; Feigl, Simon; Fischer, Peter; Fougeron, Denis; Garcia-Sciveres, Maurice; Heim, Timon; Hügging, Fabian; Kiehn, Moritz; Kreidl, Christian; Krüger, Hans; La Rosa, Alessandro; Liu, Jian; Lütticke, Florian; Mariñas, Carlos; Meng, Lingxin; Miucci, Antonio; Münstermann, Daniel; Nguyen, Hong Hanh; Obermann, Theresa; Pangaud, Patrick; Perrevoort, Ann-Kathrin; Rozanov, Alexandre; Schöning, André; Schwenker, Benjamin; Wiedner, Dirk

    2013-01-01

    High-voltage particle detectors in commercial CMOS technologies are a detector family that allows implementation of low-cost, thin and radiation-tolerant detectors with a high time resolution. In the R/D phase of the development, a radiation tolerance of 10 15 n eq = cm 2 , nearly 100% detection ef fi ciency and a spatial resolution of about 3 μ m were demonstrated. Since 2011 the HV detectors have fi rst applications: the technology is presently the main option for the pixel detector of the planned Mu3e experiment at PSI (Switzerland). Several prototype sensors have been designed in a standard 180 nm HV CMOS process and successfully tested. Thanks to its high radiation tolerance, the HV detectors are also seen at CERN as a promising alternative to the standard options for ATLAS upgrade and CLIC. In order to test the concept, within ATLAS upgrade R/D, we are currently exploring an active pixel detector demonstrator HV2FEI4; also implemented in the 180 nm HV process

  7. High-voltage pixel detectors in commercial CMOS technologies for ATLAS, CLIC and Mu3e experiments

    CERN Document Server

    Peric,I et al.

    2013-01-01

    High-voltage particle detectors in commercial CMOS technologies are a detector family that allows implementation of low-cost, thin and radiation-tolerant detectors with a high time resolution. In the R/D phase of the development, a radiation tolerance of 1015 neq=cm2 , nearly 100% detection efficiency and a spatial resolution of about 3 μm were demonstrated. Since 2011 the HV detectors have first applications: the technology is presently the main option for the pixel detector of the planned Mu3e experiment at PSI (Switzerland). Several prototype sensors have been designed in a standard 180 nm HV CMOS process and successfully tested. Thanks to its high radiation tolerance, the HV detectors are also seen at CERN as a promising alternative to the standard options for ATLAS upgrade and CLIC. In order to test the concept, within ATLAS upgrade R/D, we are currently exploring an active pixel detector demonstrator HV2FEI4; also implemented in the 180 nm HV process.

  8. 3D silicon sensors: Design, large area production and quality assurance for the ATLAS IBL pixel detector upgrade

    Energy Technology Data Exchange (ETDEWEB)

    Da Via, Cinzia [School of Physics and Astronomy, University of Manchester, Oxford Road, Manchester, M13 9PL (United Kingdom); Boscardin, Maurizio [Fondazione Bruno Kessler, FBK-CMM, Via Sommarive 18, I-38123 Trento (Italy); Dalla Betta, Gian-Franco, E-mail: dallabe@disi.unitn.it [DISI, Universita degli Studi di Trento and INFN, Via Sommarive 14, I-38123 Trento (Italy); Darbo, Giovanni [INFN Sezione di Genova, Via Dodecaneso 33, I-14146 Genova (Italy); Fleta, Celeste [Centro Nacional de Microelectronica, CNM-IMB (CSIC), Barcelona E-08193 (Spain); Gemme, Claudia [INFN Sezione di Genova, Via Dodecaneso 33, I-14146 Genova (Italy); Grenier, Philippe [SLAC National Accelerator Laboratory, 2575 Sand Hill Road, Menlo Park, CA 94025 (United States); Grinstein, Sebastian [Institut de Fisica d' Altes Energies (IFAE) and ICREA, Universitat Autonoma de Barcelona (UAB), E-08193 Bellaterra, Barcelona (Spain); Hansen, Thor-Erik [SINTEF MiNaLab, Blindern, N-0314 Oslo (Norway); Hasi, Jasmine; Kenney, Chris [SLAC National Accelerator Laboratory, 2575 Sand Hill Road, Menlo Park, CA 94025 (United States); Kok, Angela [SINTEF MiNaLab, Blindern, N-0314 Oslo (Norway); Parker, Sherwood [University of Hawaii, c/o Lawrence Berkeley Laboratory, Berkeley, CA 94720 (United States); Pellegrini, Giulio [Centro Nacional de Microelectronica, CNM-IMB (CSIC), Barcelona E-08193 (Spain); Vianello, Elisa; Zorzi, Nicola [Fondazione Bruno Kessler, FBK-CMM, Via Sommarive 18, I-38123 Trento (Italy)

    2012-12-01

    3D silicon sensors, where electrodes penetrate the silicon substrate fully or partially, have successfully been fabricated in different processing facilities in Europe and USA. The key to 3D fabrication is the use of plasma micro-machining to etch narrow deep vertical openings allowing dopants to be diffused in and form electrodes of pin junctions. Similar openings can be used at the sensor's edge to reduce the perimeter's dead volume to as low as {approx}4 {mu}m. Since 2009 four industrial partners of the 3D ATLAS R and D Collaboration started a joint effort aimed at one common design and compatible processing strategy for the production of 3D sensors for the LHC Upgrade and in particular for the ATLAS pixel Insertable B-Layer (IBL). In this project, aimed for installation in 2013, a new layer will be inserted as close as 3.4 cm from the proton beams inside the existing pixel layers of the ATLAS experiment. The detector proximity to the interaction point will therefore require new radiation hard technologies for both sensors and front end electronics. The latter, called FE-I4, is processed at IBM and is the biggest front end of this kind ever designed with a surface of {approx}4 cm{sup 2}. The performance of 3D devices from several wafers was evaluated before and after bump-bonding. Key design aspects, device fabrication plans and quality assurance tests during the 3D sensors prototyping phase are discussed in this paper.

  9. Active pixel sensors in AMS H18/H35 HV-CMOS technology for the ATLAS HL-LHC upgrade

    Science.gov (United States)

    Ristic, Branislav

    2016-09-01

    Deep sub micron HV-CMOS processes offer the opportunity for sensors built by industry standard techniques while being HV tolerant, making them good candidates for drift-based, fast collecting, thus radiation-hard pixel detectors. For the upgrade of the ATLAS Pixel Detector towards the HL-LHC requirements, active pixel sensors in HV-CMOS technology were investigated. These implement signal processing electronics in deep n-wells, which also act as collecting electrodes. The deep n-wells allow for bias voltages up to 150 V leading to a depletion depth of several 10 μm. Prototype sensors in the AMS H18 180 nm and H35 350 nm HV-CMOS processes were thoroughly tested in lab measurements as well as in testbeam experiments. Irradiations with X-rays and protons revealed a tolerance to ionizing doses of 1 Grad while Edge-TCT studies assessed the effects of radiation on the charge collection. The sensors showed high detection efficiencies after neutron irradiation to 1015neq cm-2 in testbeam experiments. A full reticle size demonstrator chip, implemented in the H35 process is being submitted to prove the large scale feasibility of the HV-CMOS concept.

  10. Design and development of the IBL-BOC firmware for the ATLAS Pixel IBL optical datalink system

    CERN Document Server

    AUTHOR|(INSPIRE)INSPIRE-00356268

    The Insertable $b$-Layer (IBL) is the first upgrade of the ATLAS Pixel detector at the LHC. It will be installed in the Pixel detector in 2013. The IBL will use a new sensor and readout technology, therefore the readout components of the current Pixel detector are redesigned for the readout of the IBL. In this diploma thesis the design and development of the firmware for the new IBL Back-of-Crate card (IBL-BOC) are described. The IBL-BOC is located on the off-detector side of the readout and performs the optical-electrical conversion and vice versa for the optical connection to and from the detector. To process the data transmitted to and received from the detector, the IBL-BOC uses multiple Field Programmable Gate Arrays (FPGA). The transmitted signal is a 40~Mb/s BiPhase Mark (BPM) encoded data stream, providing the timing, trigger and control to the detector. The received signal is a 160~Mb/s 8b10b encoded data stream, containing data from the detector. The IBL-BOC encodes and decodes these data streams. T...

  11. Thermal Grease Evaluation for ATLAS Upgrade Micro-Strip Detector.

    CERN Document Server

    Barbier, G; The ATLAS collaboration; Clark, A; Ferrère, D; Pernecker, S; Perrin, E; Streit, KP; Weber, M

    2010-01-01

    The ATLAS upgrade detector foreseen at the phase 2 upgrade of LHC requires a complete new inner detector using silicon pixel and strip detectors. For both technologies, a specific mechanical and thermal design is required. Such a design may use soft thermal interfaces such as grease between the various parts. One foreseeable use would be between the cooling pipe and the thermal block allowing the strip modules to be decoupled from the mechanical and cooling structure. This note describes the technique used and the results obtained when characterizing a few grease samples. The results have been compared with thermal FEA simulations. A thermal conductivity measurement for each sample could be extracted from the measurements, with a systematic uncertainty of less than 6%. Some samples were irradiated to the expected fluence at sLHC and their resulting thermal conductivity compared with the non-irradiated samples.

  12. Low noise DC to DC converters for the sLHC experiments

    Energy Technology Data Exchange (ETDEWEB)

    Allongue, B; Blanchot, G; Faccio, F; Fuentes, C; Michelis, S; Orlandi, S, E-mail: georges.blanchot@cern.c [CERN, Route de Meyrin, CH-1211 Geneva 23 (Switzerland)

    2010-11-15

    The development of front-end systems for the ATLAS tracker at the sLHC is now in progress and the availability of radiation tolerant buck converter ASICs enables the implementation of DC to DC converter based powering schemes. The front-end systems powered in this manner will be exposed to the radiated and conducted noise emitted by the converters. The electromagnetic compatibility between DC to DC converters and ATLAS short strip tracker hybrid prototypes has been studied with specific susceptibility tests. Different DC to DC converter prototypes have been designed following a noise optimization methodology to match the noise requirements of these front-end systems. The DC to DC converter developed in this manner presents a negligible emission of noise that was confirmed by system tests on an ATLAS tracker front-end module prototype. As a result of this, power converters can now be integrated in close vicinity of front-end chips without compromising their overall noise performance.

  13. Ultra-light and stable composite structure to support and cool the ATLAS pixel detector barrel electronics modules

    CERN Document Server

    Olcese, M; Castiglioni, G; Cereseto, R; Cuneo, S; Dameri, M; Gemme, C; Glitza, K W; Lenzen, G; Mora, F; Netchaeva, P; Ockenfels, W; Piano, E; Pizzorno, C; Puppo, R; Rebora, A; Rossi, L; Thadome, J; Vernocchi, F; Vigeolas, E; Vinci, A

    2004-01-01

    The design of an ultra light structure, the so-called "stave", to support and cool the sensitive elements of the Barrel Pixel detector, the innermost part of the ATLAS detector to be installed on the new Large Hadron Collider at CERN (Geneva), is presented. Very high- dimensional stability, minimization of the material and ability of operating 10 years in a high radiation environment are the key design requirements. The proposed solution consists of a combination of different carbon-based materials (impregnated carbon-carbon, ultra high modulus carbon fibre composites) coupled to a thin aluminum tube to form a very light support with an integrated cooling channel. Our design has proven to successfully fulfil the requirements. The extensive prototyping and testing program to fully qualify the design and release the production are discussed.

  14. The Phase-II ATLAS Pixel Tracker Upgrade: Layout and Mechanics

    CERN Document Server

    Sharma, Abhishek; The ATLAS collaboration

    2016-01-01

    In early 2017 a new layout will be decided for the ATLAS experiment as it undergoes an upgrade of its tracking detector during the Phase-II LHC shutdown, to better take advantage of the increased luminosity of the HL-LHC. The various layouts are described and a description of the supporting structures are presented, along with results from testing of prototypes.

  15. A module concept for the upgrades of the ATLAS pixel system using the novel SLID-ICV vertical integration technology

    CERN Document Server

    Beimforde, M; Macchiolo, A; Moser, H G; Nisius, R; Richter, R H; Weigell, P; 10.1088/1748-0221/5/12/C12025

    2010-01-01

    The presented R&D activity is focused on the development of a new pixel module concept for the foreseen upgrades of the ATLAS detector towards the Super LHC employing thin n-in-p silicon sensors together with a novel vertical integration technology. A first set of pixel sensors with active thicknesses of 75 μm and 150 μm has been produced using a thinning technique developed at the Max-Planck-Institut für Physik (MPP) and the MPI Semiconductor Laboratory (HLL). Charge Collection Efficiency (CCE) measurements of these sensors irradiated with 26 MeV protons up to a particle fluence of 1016neqcm−2 have been performed, yielding higher values than expected from the present radiation damage models. The novel integration technology, developed by the Fraunhofer Institut EMFT, consists of the Solid-Liquid InterDiffusion (SLID) interconnection, being an alternative to the standard solder bump-bonding, and Inter-Chip Vias (ICVs) for routing signals vertically through electronics. This allows for extracting the ...

  16. Qualification measurements of the voltage supply system as well as conceptionation of a state machine for the detector control of the ATLAS pixel detector; Qualifizierungsmessungen des Spannungsversorgungssystems sowie Konzeptionierung einer Zustandsmaschine fuer die Detektorkontrolle des ATLAS-Pixeldetektors

    Energy Technology Data Exchange (ETDEWEB)

    Schultes, Joachim

    2007-02-15

    The supply system and the control system of the ATLAS pixel detector represent important building blocks of the pixel detector. Corresponding studies of the supply system, which were performed within a comprehensive test system, the so-called system test, with nearly all final components and the effects on the pixel detector are object of this thesis. A further point of this thesis is the coordination and further development of the detector-control-system software under regardment of the different partial systems. A main topic represents thereby the conceptionation of the required state machine as interface for the users and the connection to the data acquisition system.

  17. Development of a Detector Control System for the ATLAS Pixel detector in the HL-LHC

    Science.gov (United States)

    Lehmann, N.; Karagounis, M.; Kersten, S.; Zeitnitz, C.

    2016-11-01

    The upgrade of the LHC to the HL-LHC requires a new ITk detector. The innermost part of this new tracker is a pixel detector. The University of Wuppertal is developing a new DCS to monitor and control this new pixel detector. The current concept envisions three parallel paths of the DCS. The first path, called security path, is hardwired and provides an interlock system to guarantee the safety of the detector and human beings. The second path is a control path. This path is used to supervise the entire detector. The control path has its own communication lines independent from the regular data readout for reliable operation. The third path is for diagnostics and provides information on demand. It is merged with the regular data readout and provides the highest granularity and most detailed information. To reduce the material budget, a serial power scheme is the baseline for the pixel modules. A new ASIC used in the control path is in development at Wuppertal for this serial power chain. A prototype exists already and a proof of principle was demonstrated. Development and research is ongoing to guarantee the correct operation of the new ASIC in the harsh environment of the HL-LHC. The concept for the new DCS will be presented in this paper. A focus will be made on the development of the DCS chip, used for monitoring and control of pixel modules in a serial power chain.

  18. Fluorocarbon evaporative cooling developments for the ATLAS pixel and semiconductor tracking detectors

    CERN Document Server

    Anderssen, E; Berry, S; Bonneau, P; Bosteels, Michel; Bouvier, P; Cragg, D; English, R; Godlewski, J; Górski, B; Grohmann, S; Hallewell, G D; Hayler, T; Ilie, S; Jones, T; Kadlec, J; Lindsay, S; Miller, W; Niinikoski, T O; Olcese, M; Olszowska, J; Payne, B; Pilling, A; Perrin, E; Sandaker, H; Seytre, J F; Thadome, J; Vacek, V

    1999-01-01

    Heat transfer coefficients 2-5.103 Wm-2K-1 have been measured in a 3.6 mm I.D. heated tube dissipating 100 Watts - close to the full equivalent power (~110 W) of a barrel SCT detector "stave" - over a range of power dissipations and mass flows in the above fluids. Aspects of full-scale evaporative cooling circulator design for the ATLAS experiment are discussed, together with plans for future development.

  19. Development of a detector control system for the serially powered ATLAS pixel detector at the HL-LHC

    Energy Technology Data Exchange (ETDEWEB)

    Puellen, Lukas

    2015-02-10

    In the years around 2020 the LHC will be upgraded to the HL-LHC. In terms of this upgrade, the ATLAS detector will also be upgraded. This also includes the pixel detector, the innermost of the sub-detectors in ATLAS. Thereby the powering concept of the pixel detector will be changed to reduce the material budget of the detector. From individual powering of each detector module, the concept changes to serial powering, where all modules of a powering group are connected in series. This change makes the development of a new detector control system (DCS) mandatory. Therefore, a new concept for the ATLAS pixel DCS is being developed at the University of Wuppertal. This concept is split into three paths: a safety path, a control path, and a diagnostics path. The safety path is a hard wired interlock system. The concept of this system will not differ significantly, compared to the interlock system of the current detector. The diagnostics path is embedded into the optical data read-out of the detector and will be used for detector tuning with high precision and granularity. The control path supervises the detector and provides a user interface to the hardware components. A concept for this path, including a prototype and proof-of-principle studies, has been developed in terms of this thesis. The control path consists of the DCS network, a read-out and controlling topology created by two types of ASICs: the DCS controller and the DCS chip. These ASICs measure and control all values, necessary for a safe detector operation in situ. This reduces the number of required cables and hence the material budget of the system. For the communication between these ASICs, two very fault tolerant bus protocols have been chosen: CAN bus carries data from the DCS computers, outside of the detector, to the DCS controllers at the edge of the pixel detector. For the communication between the DCS controller and the DCS chip, which is located close to each detector module, an enhanced I2C

  20. Opto-box: Optical modules and mini-crate for ATLAS pixel and IBL detectors

    Science.gov (United States)

    Bertsche, David

    2016-11-01

    The opto-box is a custom mini-crate for housing optical modules which process and transfer optoelectronic data. Many novel solutions were developed for the custom design and manufacturing. The system tightly integrates electrical, mechanical, and thermal functionality into a small package of size 35×10x8 cm3. Special attention was given to ensure proper shielding, grounding, cooling, high reliability, and environmental tolerance. The custom modules, which incorporate Application Specific Integrated Circuits, were developed through a cycle of rigorous testing and redesign. In total, fourteen opto-boxes have been installed and loaded with modules on the ATLAS detector. They are currently in operation as part of the LHC run 2 data read-out chain. This conference proceeding is in support of the poster presented at the International Conference on New Frontiers in Physics (ICNFP) 2015 [1].

  1. Opto-box: Optical modules and mini-crate for ATLAS pixel and IBL detectors

    Directory of Open Access Journals (Sweden)

    Bertsche David

    2016-01-01

    Full Text Available The opto-box is a custom mini-crate for housing optical modules which process and transfer optoelectronic data. Many novel solutions were developed for the custom design and manufacturing. The system tightly integrates electrical, mechanical, and thermal functionality into a small package of size 35×10x8 cm3. Special attention was given to ensure proper shielding, grounding, cooling, high reliability, and environmental tolerance. The custom modules, which incorporate Application Specific Integrated Circuits, were developed through a cycle of rigorous testing and redesign. In total, fourteen opto-boxes have been installed and loaded with modules on the ATLAS detector. They are currently in operation as part of the LHC run 2 data read-out chain. This conference proceeding is in support of the poster presented at the International Conference on New Frontiers in Physics (ICNFP 2015 [1].

  2. Charge Pump Clock Generation PLL for the Data Output Block of the Upgraded ATLAS Pixel Front-End in 130 nm CMOS

    CERN Document Server

    Kruth, A; Arutinov, D; Barbero, M; Gronewald, M; Hemperek, T; Karagounis, M; Krueger, H; Wermes, N; Fougeron, D; Menouni, M; Beccherle, R; Dube, S; Ellege, D; Garcia-Sciveres, M; Gnani, D; Mekkaoui, A; Gromov, V; Kluit, R; Schipper, J

    2009-01-01

    FE-I4 is the 130 nm ATLAS pixel IC currently under development for upgraded Large Hadron Collider (LHC) luminosities. FE-I4 is based on a low-power analog pixel array and digital architecture concepts tuned to higher hit rates [1]. An integrated Phase Locked Loop (PLL) has been developed that locally generates a clock signal for the 160 Mbit/s output data stream from the 40 MHz bunch crossing reference clock. This block is designed for low power, low area consumption and recovers quickly from loss of lock related to single-event transients in the high radiation environment of the ATLAS pixel detector. After a general introduction to the new FE-I4 pixel front-end chip, this work focuses on the FE-I4 output blocks and on a first PLL prototype test chip submitted in early 2009. The PLL is nominally operated from a 1.2V supply and consumes 3.84mW of DC power. Under nominal operating conditions, the control voltage settles to within 2% of its nominal value in less than 700 ns. The nominal operating frequency for t...

  3. Analog front-end cell designed in a commercial 025 mu m process for the ATLAS pixel detector at LHC

    CERN Document Server

    Blanquart, L; Comes, G; Denes, P; Einsweiler, Kevin F; Fischer, P; Mandelli, E; Meddeler, G; Peric, I; Richardson, J

    2002-01-01

    A new analog pixel front-end cell has been developed for the ATLAS detector at the future Large Hadron Collider (LHC) at the European Laboratory for Particle Physics (CERN). This analog cell has been submitted in two commercial 0.25 mu m CMOS processes (in an analog test chip format), using special layout techniques for radiation hardness purposes. It is composed of two cascaded amplifiers followed by a fast discriminator featuring a detection threshold within the range of 1000 to 10000 electrons. The first preamplifier has the principal role of providing a large bandwidth, low input impedance, and fast rise time in order to enhance the time-walk and crosstalk performance, whereas the second fully differential amplifier is aimed at delivering a sufficiently high-voltage gain for optimum comparison. A new do feedback concept renders the cell tolerant of sensor leakage current up to 300 nA and provides monitoring of this current. Two 5-bit digital-to-analog converters tolerant to single- event upset have been i...

  4. Studies on irradiated pixel detectors for the ATLAS IBL and HL-LHC upgrade

    CERN Document Server

    AUTHOR|(INSPIRE)INSPIRE-00371978; Gößling, Claus; Pernegger, Heinz

    The constant demand for higher luminosity in high energy physics is the reason for the continuous effort to adapt the accelerators and the experiments. The upgrade program for the experiments and the accelerators at CERN already includes several expansion stages of the Large Hadron Collider (LHC) which will increase the luminosity and the energy of the accelerator. Simultaneously the LHC experiments prepare the individual sub-detectors for the increasing demands in the coming years. Especially the tracking detectors have to cope with fluence levels unprecedented for high energy physics experiments. Correspondingly to the fluence increases the impact of the radiation damage which reduces the life time of the detectors by decreasing the detector performance and efficiency. To cope with this effect new and more radiation hard detector concepts become necessary to extend the life time. This work concentrates on the impact of radiation damage on the pixel sensor technologies to be used in the next upgrade of the ...

  5. Development of pixel detectors for the IBL and HL-LHC ATLAS experiment upgrade

    CERN Document Server

    Baselga Bacardit, Marta

    2016-03-18

    This thesis presents the development of advanced silicon technology detectors fabricated at CNM-Barcelona for High Energy Physics (HEP) experiments. The pixel size of the tracking silicon detectors for the upgrade of the HL-LHC will have to decrease in size in order to enhance the resolution in position for the measurements and they need to have lower occupancy for the electronics. The future experiments at CERN will cope with fuences up to 2 x 10^^16 neq/cm2, and the smaller 3D silicon detectors will have less trapping of the electron-holes generated in the bulk leading to a better performance under high radiation environment. This thesis studies silicon detectors fabricated at CNM-Barcelona applied to HEP experiments with two different kinds of novel technologies: 3D and Low Gain Avalanche Detectors (LGAD). The 3D detectors make it possible to reduce the size of the depleted region inside the detector and to work at lower voltages, whereas the LGAD detectors have an intrinsic gain which increases the collec...

  6. The upgraded Pixel detector and the commissioning of the Inner Detector tracking of the ATLAS experiment for Run-2 at the Large Hadron Collider

    CERN Document Server

    AUTHOR|(INSPIRE)INSPIRE-00019188; The ATLAS collaboration

    2016-01-01

    Run-2 of the Large Hadron Collider (LHC) will provide new challenges to track and vertex reconstruction with higher energies, denser jets and higher rates. Therefore the ATLAS experiment has constructed the first 4-layer Pixel detector in HEP, installing a new Pixel layer, also called Insertable B-Layer (IBL). The IBL is a fourth layer of pixel detectors, and has been installed in May 2014 at a radius of 3.3 cm between the existing Pixel Detector and a new smaller radius beam-pipe. The new detector, built to cope with the high radiation and expected occupancy, is the first large scale application of 3D detectors and CMOS 130~nm technology. In addition, the Pixel detector was refurbished with a new service quarter panel to recover about 3% of defective modules lost during Run-1 and a new optical readout system to readout the data at higher speed while reducing the occupancy when running with increased luminosity. Complementing detector improvements, many improvements to Inner Detector track and vertex reconstr...

  7. Thin n-in-p pixel sensors and the SLID-ICV vertical integration technology for the ATLAS upgrade at the HL-LHC

    CERN Document Server

    Macchiolo, A

    2013-01-01

    The R&D activity presented is focused on the development of new modules for the upgrade of the ATLAS pixel system at the High Luminosity LHC (HL-LHC). The performance after irradiation of n-in-p pixel sensors of different active thicknesses is studied, together with an investigation of a novel interconnection technique offered by the Fraunhofer Institute EMFT in Munich, the Solid-Liquid-InterDiffusion (SLID), which is an alternative to the standard solder bump-bonding. The pixel modules are based on thin n-in-p sensors, with an active thickness of 75 um or 150 um, produced at the MPI Semiconductor Laboratory (MPI HLL) and on 100 um thick sensors with active edges, fabricated at VTT, Finland. Hit efficiencies are derived from beam test data for thin devices irradiated up to a fluence of 4e15 neq/cm^2. For the active edge devices, the charge collection properties of the edge pixels before irradiation is discussed in detail, with respect to the inner ones, using measurements with radioactive sources. Beyond ...

  8. Performance of the Insertable B-Layer for the ATLAS Pixel Detector during Quality Assurance and a Novel Pixel Detector Readout Concept based on PCIe

    CERN Document Server

    AUTHOR|(INSPIRE)INSPIRE-00356268; Pernegger, Heinz

    2016-07-27

    During the first long shutdown of the LHC the Pixel detector has been upgraded with a new 4th innermost layer, the Insertable B-Layer (IBL). The IBL will increase the tracking performance and help with higher than nominal luminosity the LHC will produce. The IBL is made up of 14 staves and in total 20 staves have been produced for the IBL. This thesis presents the results of the final quality tests performed on these staves in an detector-like environment, in order to select the 14 best of the 20 staves for integration onto the detector. The test setup as well as the testing procedure is introduced and typical results of each testing stage are shown and discussed. The overall performance of all staves is presented in regards to: tuning performance, radioactive source measurements, and number of failing pixels. Other measurement, which did not directly impact the selection of staves, but will be important for the operation of the detector or production of a future detector, are included. Based on the experienc...

  9. EnviroAtlas - MSPA connectivity with water as foreground and 1-pixel edge width for the conterminous United States

    Data.gov (United States)

    U.S. Environmental Protection Agency — This EnviroAtlas dataset categorizes land cover into structural elements (e.g. core, edge, connector, etc.). It depicts core areas of natural land cover, core...

  10. EnviroAtlas - MSPA connectivity with water as background and 1-pixel edge width for the conterminous United States

    Data.gov (United States)

    U.S. Environmental Protection Agency — This EnviroAtlas dataset categorizes land cover into structural elements (e.g. core, edge, connector, etc.). It depicts core areas of natural land cover, core...

  11. EnviroAtlas - MSPA connectivity with water as foreground and 3-pixel edge width for the conterminous United States

    Data.gov (United States)

    U.S. Environmental Protection Agency — This EnviroAtlas dataset categorizes land cover into structural elements (e.g. core, edge, connector, etc.). It depicts core areas of natural land cover, core...

  12. EnviroAtlas - MSPA connectivity with water as missing and 1-pixel edge width for the conterminous United States

    Data.gov (United States)

    U.S. Environmental Protection Agency — This EnviroAtlas dataset categorizes land cover into structural elements (e.g. core, edge, connector, etc.). It depicts core areas of natural land cover, core...

  13. EnviroAtlas - MSPA connectivity with water as missing and 3-pixel edge width for the conterminous United States

    Data.gov (United States)

    U.S. Environmental Protection Agency — This EnviroAtlas dataset categorizes land cover into structural elements (e.g. core, edge, connector, etc.). It depicts core areas of natural land cover, core...

  14. EnviroAtlas - MSPA connectivity with water as background and 3-pixel edge width for the conterminous United States

    Data.gov (United States)

    U.S. Environmental Protection Agency — This EnviroAtlas dataset categorizes land cover into structural elements (e.g. core, edge, connector, etc.). It depicts core areas of natural land cover, core...

  15. A High Performance Multi-Core FPGA Implementation for 2D Pixel Clustering for the ATLAS Fast TracKer (FTK) Processor

    CERN Document Server

    Sotiropoulou, C-L; The ATLAS collaboration; Beretta, M; Gkaitatzis, S; Kordas, K; Nikolaidis, S; Petridou, C; Volpi, G

    2014-01-01

    The high performance multi-core 2D pixel clustering FPGA implementation used for the input system of the ATLAS Fast TracKer (FTK) processor is presented. The input system for the FTK processor will receive data from the Pixel and micro-strip detectors read out drivers (RODs) at 760Gbps, the full rate of level 1 triggers. Clustering is required as a method to reduce the high rate of the received data before further processing, as well as to determine the cluster centroid for obtaining obtain the best spatial measurement. Our implementation targets the pixel detectors and uses a 2D-clustering algorithm that takes advantage of a moving window technique to minimize the logic required for cluster identification. The design is fully generic and the cluster detection window size can be adjusted for optimizing the cluster identification process. Τhe implementation can be parallelized by instantiating multiple cores to identify different clusters independently thus exploiting more FPGA resources. This flexibility mak...

  16. Characterization of the FE-I4B pixel readout chip production run for the ATLAS Insertable B-layer upgrade

    CERN Document Server

    Backhaus, M

    2013-01-01

    The Insertable B-layer (IBL) is a fourth pixel layer that will be added inside the existing ATLAS pixel detector during the long LHC shutdown of 2013 and 2014. The new four layer pixel system will ensure excellent tracking, vertexing and b-tagging performance in the high luminosity pile-up conditions projected for the next LHC run. The peak luminosity is expected to reach 3• 10^34 cm^−2 s ^−1with an integrated luminosity over the IBL lifetime of 300 fb^−1 corresponding to a design lifetime fluence of 5 • 10^15 n_eqcm^−2 and ionizing dose of 250 Mrad including safety factors. The production front-end electronics FE-I4B for the IBL has been fabricated at the end of 2011 and has been extensively characterized on diced ICs as well as at the wafer level. The production tests at the wafer level were performed during 2012. Selected results of the diced IC characterization are presented, including measurements of the on-chip voltage regulators. The IBL powering scheme, which was chosen based on these resu...

  17. Measurement of charm and beauty-production in deep inelastic scattering at HERA and test beam studies of ATLAS pixel sensors

    Energy Technology Data Exchange (ETDEWEB)

    Libov, Vladyslav

    2013-08-15

    A measurement of charm and beauty production in Deep Inelastic Scattering at HERA is presented. The analysis is based on the data sample collected by the ZEUS detector in the period from 2003 to 2007 corresponding to an integrated luminosity of 354 pb{sup -1}. The kinematic region of the measurement is given by 54.2(5) GeV for charm (beauty) and -1.6<{eta}{sup jet}<2.2 for both charm and beauty, where E{sup jet}{sub T} and {eta}{sup jet} are the transverse energy and pseudorapidity of the jet, respectively. The significance of the decay length and the invariant mass of charged tracks associated with the secondary vertex are used as discriminating variables to distinguish between signal and background. Differential cross sections of jet production in charm and beauty events as a function of Q{sup 2}, y, E{sup jet}{sub T} and {eta}{sup jet} are measured. Results are compared to Next-to-Leading Order (NLO) predictions from Quantum Chromodynamics (QCD) in the fixed flavour number scheme. Good agreement between data and theory is observed. Contributions of the charm and beauty production to the inclusive proton structure function, F{sup cbar} {sup c}{sub 2} and F{sup b} {sup anti} {sup b}{sub 2}, are determined by extrapolating the double differential cross sections using NLO QCD predictions. Contributions to the test beam program for the Insertable B-Layer upgrade project of the ATLAS pixel detector are discussed. The test beam data analysis software package EUTelescope was extended, which allowed an efficient analysis of ATLAS pixel sensors. The USBPix DAQ system was integrated into the EUDET telescope allowing test beam

  18. Cryogenic Si detectors for ultra radiation hardness in SLHC environment

    Science.gov (United States)

    Li, Zheng; Abreu, M.; Anbinderis, P.; Anbinderis, T.; Ambrosio, N. D.'.; de Boer, W.; Borchi, E.; Borer, K.; Bruzzi, M.; Buontempo, S.; Chen, W.; Cindro, V.; Dierlamm, A.; Eremin, V.; Gaubas, E.; Gorbatenko, V.; Grigoriev, E.; Hauler, F.; Heijne, E.; Heising, S.; Hempel, O.; Herzog, R.; Härkönen, J.; Ilyashenko, I.; Janos, S.; Jungermann, L.; Kalesinskas, V.; Kapturauskas, J.; Laiho, R.; Luukka, P.; Mandic, I.; De Masi, Rita; Menichelli, D.; Mikuz, M.; Militaru, O.; Niinikosky, T. O.; Shea, V. O.'.; Pagano, S.; Paul, S.; Piotrzkowski, K.; Pretzl, K.; Rato Mendes, P.; Rouby, X.; Ruggiero, G.; Smith, K.; Sonderegger, P.; Sousa, P.; Tuominen, E.; Tuovinen, E.; Verbitskaya, E.; Vaitkus, J.; Wobst, E.; Zavrtanik, M.

    2007-09-01

    Radiation hardness up to 10 16 neq/cm 2 is required in the future HEP experiments for most inner detectors. However, 10 16 neq/cm 2 fluence is well beyond the radiation tolerance of even the most advanced semiconductor detectors fabricated by commonly adopted technologies: the carrier trapping will limit the charge collection depth to an effective range of 20-30 μm regardless of depletion depth. Significant improvement of the radiation hardness of silicon sensors has been taken place within RD39. Fortunately the cryogenic tool we have been using provides us a convenient way to solve the detector charge collection efficiency (CCE) problem at SLHC radiation level (10 16 neq/cm 2). There are two key approaches in our efforts: (1) use of the charge/current injection to manipulate the detector internal electric field in such a way that it can be depleted at a modest bias voltage at cryogenic temperature range (⩽230 K); and (2) freezing out of the trapping centers that affects the CCE at cryogenic temperatures lower than that of the LN 2 temperature. In our first approach, we have developed the advanced radiation hard detectors using charge or current injection, the current injected diodes (CID). In a CID, the electric field is controlled by injected current, which is limited by the space charge, yielding a nearly uniform electric field in the detector, independent of the radiation fluence. In our second approach, we have developed models of radiation-induced trapping levels and the physics of their freezing out at cryogenic temperatures. In this approach, we intend to study the trapping effect at temperatures below LN 2 temperature. A freeze-out of trapping can certainly help in the development of ultra-radiation hard Si detectors for SLHC. A detector CCE measurement system using ultra-fast picosecond laser with a He cryostat has been built at CERN. This system can be used to find out the practical cryogenic temperature range that can be used to freeze out the

  19. Cryogenic Si detectors for ultra radiation hardness in SLHC environment

    Energy Technology Data Exchange (ETDEWEB)

    Li Zheng [Brookhaven National Laboratory, Upton, NY 11973-5000 (United States); Abreu, M. [LIP, Av. E. Garcia, P-1000 Lisbon (Portugal); Anbinderis, P.; Anbinderis, T. [University of Vilnius, Institute of Materials Science and Applied Research, 2040 Vilnius (Lithuania); Ambrosio, N.D' . [Instiuto di Cibernetica ' E. Caianiello' , 80078 Pozzuoli (Italy); Boer, W. de [IEKP University of Karlsruhe, D-76128 Karlsruhe (Germany); Borchi, E. [Dipartimento di Energetica, Universita di Firenze, I-50139 Florence (Italy); Borer, K. [Laboratorium fuer Hochenergiephysik der Universitaet Bern, Sidlerstarsse 5, CH-3012 Bern (Switzerland); Bruzzi, M. [Dipartimento di Energetica, Universita di Firenze, I-50139 Firenze (Italy); Buontempo, S. [Instiuto di Cibernetica ' E. Caianiello' , 80078 Pozzuoli (Italy); Chen, W. [Brookhaven National Laboratory, Upton, NY 11973-5000 (United States); Cindro, V. [Jozef Stefan Institute, Exp. Particle Physics Department, PO. Box 3000, 1001 Ljubljana (Slovenia); Dierlamm, A. [IEKP University of Karlsruhe, D-76128 Karlsruhe (Germany); Eremin, V. [Ioffe Physico-Technical Institute, Russian Academy of Sciences, St. Petersburg 194021 (Russian Federation); Gaubas, E.; Gorbatenko, V. [University of Vilnius, Institute of Materials Science and Applied Research, 2040 Vilnius (Lithuania); Grigoriev, E. [IEKP University of Karlsruhe, D-76128 Karlsruhe (Germany); Department de Radiologie, Universite de Geneve, CH-1211 Geneva (Switzerland); Hauler, F. [IEKP University of Karlsruhe, D-76128 Karlsruhe (Germany); Heijne, E. [CERN, CH-1211 Geneva (Switzerland); Heising, S. [IEKP University of Karlsruhe, D-76128 Karlsruhe (Germany)] (and others)

    2007-09-01

    Radiation hardness up to 10{sup 16} n{sub eq}/cm{sup 2} is required in the future HEP experiments for most inner detectors. However, 10{sup 16} n{sub eq}/cm{sup 2} fluence is well beyond the radiation tolerance of even the most advanced semiconductor detectors fabricated by commonly adopted technologies: the carrier trapping will limit the charge collection depth to an effective range of 20-30 {mu}m regardless of depletion depth. Significant improvement of the radiation hardness of silicon sensors has been taken place within RD39. Fortunately the cryogenic tool we have been using provides us a convenient way to solve the detector charge collection efficiency (CCE) problem at SLHC radiation level (10{sup 16} n{sub eq}/cm{sup 2}). There are two key approaches in our efforts: (1) use of the charge/current injection to manipulate the detector internal electric field in such a way that it can be depleted at a modest bias voltage at cryogenic temperature range ({<=}230 K); and (2) freezing out of the trapping centers that affects the CCE at cryogenic temperatures lower than that of the LN{sub 2} temperature. In our first approach, we have developed the advanced radiation hard detectors using charge or current injection, the current injected diodes (CID). In a CID, the electric field is controlled by injected current, which is limited by the space charge, yielding a nearly uniform electric field in the detector, independent of the radiation fluence. In our second approach, we have developed models of radiation-induced trapping levels and the physics of their freezing out at cryogenic temperatures. In this approach, we intend to study the trapping effect at temperatures below LN{sub 2} temperature. A freeze-out of trapping can certainly help in the development of ultra-radiation hard Si detectors for SLHC. A detector CCE measurement system using ultra-fast picosecond laser with a He cryostat has been built at CERN. This system can be used to find out the practical

  20. Chip development in 65 nm CMOS technology for the high luminosity upgrade of the ATLAS pixel detector

    Energy Technology Data Exchange (ETDEWEB)

    Germic, Leonard; Hemperek, Tomasz; Kishishita, Testsuichi; Krueger, Hans; Rymaszewski, Piotr; Wermes, Norbert [University of Bonn, Bonn (Germany); Havranek, Miroslav [University of Bonn, Bonn (Germany); Institute of Physics of the Academy of Sciences, Prague (Czech Republic)

    2015-07-01

    The LHC High Luminosity upgrade will result in a significant change of environment in which particle detectors are going to operate, especially for devices very close to the interaction point like pixel detector electronics. Challenges coming from the higher hit rate will have to be solved by designing faster and more complex circuits, while at the same time keeping in mind very high radiation hardness requirements. Therefore matching the specification set by the high luminosity upgrade requires a large R and D effort. Our group is participating in such a joint development * namely the RD53 collaboration * which goal is to design a new pixel chip using an advanced 65 nm CMOS technology. During this presentation motivations and benefits of using this very deep-submicron technology will be shown together with a comparison with older technologies (130 nm, 250 nm). Most of the talk is allocated to presenting some of the circuits designed by our group, along with their performance measurement results.

  1. Multi-chip module development for the ATLAS pixel detector. Analysis of the front-end chip electronics in radiation hard 0.25-{mu}m technology as well as development and realization of a serial power concept; Multi-Chip-Modul-Entwicklung fuer den ATLAS-Pixeldetektor. Analyse der Front-End-Chip-Elektronik in strahlenharter0,25-{mu}m-Technologie sowie Entwicklung und Realisierung eines Serial-Powering-Konzeptes

    Energy Technology Data Exchange (ETDEWEB)

    Stockmanns, T.

    2004-08-01

    The innermost layer of the ATLAS tracking system is a silicon pixel detector. The use of radiation tolerant components is mandatory due to the harsh radiation environment. The smallest independent component of the pixel detector is a hybride pixel module consisting of a large oxygen enriched silicon sensor and 16 specifically developed ASICs. To achieve the necessary radiation tolerance the ASICs are produced in a 0.25 {mu}m technology in combination with special design techniques. The measurements of the readout electronics during all stages of production of a full module are presented and the performance of the modules is compared with the strict requirements of the ATLAS pixel detector. Furthermore a new powering scheme for pixel detectors is presented, aiming at reducing the total power consumption, the material for the electrical services and the amount of power cables. The advantages and disadvantages of this concept are discussed on the example of the ATLAS pixel detector with pixel modules modified accounting to the new powering scheme. The performance of six of those modules operating at the same time in a small system test is compared to that of normal ATLAS pixel modules. (orig.)

  2. R&D for the local support structure and cooling channel for the ATLAS PIXEL Detector Insertable B-Layer (IBL)

    CERN Document Server

    Coelli, S; The ATLAS collaboration

    2010-01-01

    ABSTRACT: The scope of the present R&D is to develop an innovative support, with an integrated cooling and based on carbon composites, for the electronic sensors of the Silicon Pixel Tracker, to be installed into the ATLAS Experiment on the Large Hadron Collider at CERN. The inner layer of the detector is installed immediately outside the Beryllium beam pipe at a distance of 50 mm from the Interaction Point, where the high energy protons collide: the intense radiation field induce a radiation damage on the sensors so that a cooling system is necessary to remove the electrical power dissipated as heat, maintaining the sensor temperature sufficiently low. The task of the support system is to hold the detector modules in positions with high accuracy, minimizing the deformation induced by the cooling; this must be done with the lower possible mass because there are tight requirements in terms of material budget. An evaporative boiling system to remove the power dissipated by the sensors is incorporated in the...

  3. What's A Pixel Particle Sensor Chip?

    CERN Multimedia

    2008-01-01

    ATLAS particle physics experiment aided with collaboration ON Semiconductor was recently honored by the European Council for Nuclear Research (CERN), with an Industrial Award recognizing the company's contribution in supplying complex "Pixel Particle Sensor" chips for use in CERN's ATLAS particle physics experiment.

  4. Inductor based switching DC-DC converter for low voltage power distribution in SLHC

    CERN Document Server

    Michelis, S; Marchioro, A; Kayal, M; PH-EP

    2007-01-01

    In view of a power distribution scheme compatible with the requirements of the SLHC environment, we are evaluating the feasibility of on-board inductor-based DC-DC step-down conversion. Such converter should be an integrated circuit and capable of operating in harsh radiation environments and in the high magnetic field of the experiments. In this paper we present results concerning the choice of the technology, the search for the magnetic components and the calculations of the expected efficiency.

  5. Custom DC-DC converters for distributing power in SLHC trackers

    CERN Document Server

    Allongue, B; Blanchot, G; Faccio, F; Fuentes, C; Mattavelli, P; Michelis, S; Orlandis, S; Spiazzi, G

    2008-01-01

    A power distribution scheme based on the use of on-board DC-DC converters is proposed to efficiently distribute power to the on-detector electronics of SLHC trackers. A comparative analysis of different promising converter topologies is presented, leading to the choice of a magneticbased buck converter as a first conversion stage followed by an on-chip switched capacitors converter. An overall efficiency above 80% is estimated for the practical implementation proposed.

  6. The GBT-SCA, a radiation tolerant ASIC for detector control applications in SLHC experiments

    CERN Document Server

    Gabrielli, A; Kloukinas, K; Marchioro, A; Moreira, P; Ranieri, A; De Robertis, D

    2009-01-01

    This work describes the architecture of the GigaBit Transceiver – Slow Control Adapter (GBT–SCA) ASIC suitable for the control and monitoring applications of the embedded front-end electronics in the future SLHC experiments. The GBT–SCA is part the GBT chipset currently under development for the SLHC detector upgrades. It is designed for radiation tolerance and it will be fabricated in a commercial 130 nm CMOS technology. The paper discusses the GBT-SCA architecture, the data transfer protocol, the ASIC interfaces, and its integration with the GBT optical link. The GBT–SCA is one the components of the GBT system chipset. It is proposed for the future SLHC experiments and is designed to be configurable matching different front-end system requirements. The GBT-SCA is intended for the slow control and monitoring of the embedded front end electronics and implements a point-to-multi point connection between one GBT optical link ASIC and several front end ASICs. The GBT-SCA connects to a dedicated electrica...

  7. Pixel Experiments

    DEFF Research Database (Denmark)

    Petersen, Kjell Yngve; Søndergaard, Karin; Augustesen, Christina

    2015-01-01

    Pixel Experiments The term pixel is traditionally defined as any of the minute elements that together constitute a larger context or image. A pixel has its own form and is the smallest unit seen within a larger structure. In working with the potentials of LED technology in architectural lighting...... design it became relevant to investigate the use of LEDs as the physical equivalent of a pixel as a design approach. In this book our interest has been in identifying how the qualities of LEDs can be used in lighting applications. With experiences in the planning and implementation of architectural...... elucidate and exemplify already well-known problems in relation to the experience of vertical and horizontal lighting. Pixel Experiments exist as a synergy between speculative test setups and lighting design in practice. This book is one of four books that is published in connection with the research...

  8. ATLAS

    Data.gov (United States)

    Federal Laboratory Consortium — ATLAS is a particle physics experiment at the Large Hadron Collider at CERN, the European Organization for Nuclear Research. Scientists from Brookhaven have played...

  9. Progress with the single-sided module prototypes for the ATLAS tracker upgrade stave

    CERN Document Server

    Allport, P P; Wiik, L; Dressnandt, N; Matheson, J; Li, Z; Viehhauser, G; Gallop, B; Jones, T J; Dwuznik, M; Greenall, A; Eklund, L; Maddock, P; Pernecker, S; Wright, J; Puldon, D; Jakobs, K; Holt, R; Sevilla, S G; Koffeman, E; Dabrowski, W; Gilchriese, M; Wastie, R; Gibson, M; Robinson, D; Fadeyev, V; Gerling, M; Betancourt, C; Dawson, N; Bates, R; French, R; Kierstead, J; Anghinolfi, F; Weidberg, A; Martinez-McKinney, F; Paganis, S; Sutcliffe, P; Maunu, R; Newcomer, M; Weber, M; Parzefall, U; Clark, A; Colijn, A P; Xu, D; la Marra, D; Buttar, C; Grillo, A A; Schamberger, D; DeWilde, B; Poltorak, K; Affolder, A A; Tsionou, D; Hessey, N P; Casse, G; Fox, H; Ferrere, D; Villani, E G; Seiden, A; Tyndel, M; Sadrozinski, H F W; Wiimut, I; Carter, J R; Lacasta, C; Chilingarov, A; Santoyo, D; Lynn, D; Garcia, C; Haber, C H; Hommels, L B A; Dhawan, S; Lindgren, S; Farthouat, P; Nickerson, R; Chen, H; Kohler, M; Sattari, S; Civera, J V; McCarthy, R; Phillips, P; Unno, Y; Kaplon, J; Swientek, K; Wormald, M; Goodrick, M; Von Wilpert, J; Mahboubi, K

    2011-01-01

    The ATLAS experiment is preparing for the planned luminosity upgrade of the LHC (the super-luminous LHC or sLHC) with a programme of development for tracking able to withstand an order of greater magnitude radiation fluence and much greater hit occupancy rates than the current detector. This has led to the concept of an all-silicon tracker with an enhanced performance pixel-based inner region and short-strips for much of the higher radii. Both sub-systems employ many common technologies, including the proposed ``stave{''} concept for integrated cooling and support. For the short-strip region, use of this integrated stave concept requires single-sided modules mounted on either side of a thin central lightweight support. Each sensor is divided into four rows of 23.82 mm length strips; within each row, there are 1280 strips of 74.5 mu m pitch. Well over a hundred prototype sensors are being delivered by Hamamatsu Photonics (HPK) to Japan, Europe and the US. We present results of the first 20 chip ABCN25 ASIC hyb...

  10. Pixel Detectors

    OpenAIRE

    Wermes, Norbert

    2005-01-01

    Pixel detectors for precise particle tracking in high energy physics have been developed to a level of maturity during the past decade. Three of the LHC detectors will use vertex detectors close to the interaction point based on the hybrid pixel technology which can be considered the state of the art in this field of instrumentation. A development period of almost 10 years has resulted in pixel detector modules which can stand the extreme rate and timing requirements as well as the very harsh...

  11. ATLAS

    CERN Multimedia

    2002-01-01

    Barrel and END-CAP Toroids In order to produce a powerful magnetic field to bend the paths of the muons, the ATLAS detector uses an exceptionally large system of air-core toroids arranged outside the calorimeter volumes. The large volume magnetic field has a wide angular coverage and strengths of up to 4.7tesla. The toroids system contains over 100km of superconducting wire and has a design current of 20 500 amperes. (ATLAS brochure: The Technical Challenges)

  12. Recent advancements in the development of radiation hard semiconductor detectors for S-LHC

    CERN Document Server

    Fretwurst, E; Al-Ajili, A A; Alfieri, G; Allport, P P; Artuso, M; Assouak, S; Avset, B S; Barabash, L; Barcz, A; Bates, R; Biagi, S F; Bilei, G M; Bisello, D; Blue, A; Blumenau, A; Boisvert, V; Bölla, G; Bondarenko, G B; Borchi, E; Borrello, L; Bortoletto, D; Boscardin, M; Bosisio, L; Bowcock, T J V; Brodbeck, T J; Broz, J; Bruzzi, M; Brzozowski, A; Buda, M; Buhmann, P; Buttar, C; Campabadal, F; Campbell, D; Candelori, A; Casse, G; Cavallini, A; Charron, S; Chilingarov, A G; Chren, D; Cindro, V; Collins, P; Coluccia, R; Contarato, D; Coutinho, J; Creanza, D; Cunningham, L; Dalla Betta, G F; Dawson, I; de Boer, Wim; De Palma, M; Demina, R; Dervan, P; Dittongo, S; Dolezal, Z; Dolgolenko, A; Eberlein, T; Eremin, V; Fall, C; Fasolo, F; Ferbel, T; Fizzotti, F; Fleta, C; Focardi, E; Forton, E; García, C; García-Navarro, J E; Gaubas, E; Genest, M H; Gill, K A; Giolo, K; Glaser, M; Gössling, C; Golovine, V; González-Sevilla, S; Gorelov,I; Goss, J; Gouldwell-Bates, A; Grégoire, G; Gregori, P; Grigoriev, E; Grillo, A A; Groza, A; Guskov, J; Haddad, L; Härkönen, J; Hauler, F; Hoeferkamp, M; Honniger, F; Horazdovsky, T; Horisberger, R P; Horn, M; Houdayer, A; Hourahine, B; Hughes, G; Ilyashenko, Yu S; Irmscher, K; Ivanov, A; Jarasiunas, K; Johansen, K M H; Jones, B K; Jones, R; Joram, C; Jungermann, L; Kalinina, E; Kaminski, P; Karpenko, A; Karpov, A; Kazlauskiene, V; Kazukauskas, V; Khivrich, V; Khomenkov, V P; Kierstead, J A; Klaiber Lodewigs, J M; Klingenberg, R; Kodys, P; Kohout, Z; Korjenevski, S; Koski, M; Kozlowski, R; Kozodaev, M; Kramberger, G; Krasel, O; Kuznetsov, A; Kwan, S; Lagomarsino, S; Lassila-Perini, K M; Lastovetsky, V F; Latino, G; Lazanu, I; Lazanu, S; Lebedev, A; Lebel, C; Leinonen, K; Leroy, C; Li, Z; Lindström, G; Linhart, V; Litovchenko, P G; Litovchenko, A P; Lo Giudice, A; Lozano, M; Luczynski, Z; Luukka, Panja; Macchiolo, A; Makarenko, L F; Mandic, I; Manfredotti, C; Manna, N; Martí i García, S; Marunko, S; Mathieson, K; Melone, J; Menichelli, D; Messineo, A; Metcalfe, J; Miglio, S; Mikuz, M; Miyamoto, J; Moll, M; Monakhov, E; Moscatelli, F; Naoumov, D; Nossarzhevska, E; Nysten, J; Olivero, P; O'Shea, V; Palviainen, T; Paolini, C; Parkes, C; Passeri, D; Pein, U; Pellegrini, G; Perera, L; Petasecca, M; Piemonte, C; Pignatel, G U; Pinho, N; Pintilie, I; Pintilie, L; Polivtsev, L; Polozov, P; Popa, A; Populea, J; Pospísil, S; Pozza, A; Radicci, V; Rafí, J M; Rando, R; Röder, R; Rohe, T; Ronchin, S; Rott, C; Roy, A; Ruzin, A; Sadrozinski, H F W; Sakalauskas, S; Scaringella, M; Schiavulli, L; Schnetzer, S; Schumm, B; Sciortino, S; Scorzoni, A; Segneri, G; Seidela, S; Seiden, A; Sellberg, G; Sellin, P J; Sentenac, D; Shipsey, I; Sícho, P; Sloan, T; Solar, M; Son, S; Sopko, B; Sopko, V; Spencer, N; Stahl, J; Stolze, D; Stone, R; Storasta, J; Strokan, N; Sudzius, M; Surma, B; Suvorov, A; Svensson, B G; Tipton, P; Tomasek, M; Tsvetkov, A; Tuominen, E; Tuovinen, E; Tuuva, T; Tylchin, M; Uebersee, H; Uher, J; Ullán, M; Vaitkus, J V; Velthuis, J; Verbitskaya, E; Vrba, V; Wagner, G; Wilhelm, I; Worm, S; Wright, V; Wunstorf, R; Yiuri, Y; Zabierowski, P; Zaluzhny, A; Zavrtanik, M; Zen, M; Zhukov, V; Zorzi, N

    2005-01-01

    The proposed luminosity upgrade of the Large Hadron Collider (S-LHC) at CERN will demand the innermost layers of the vertex detectors to sustain fluences of about 1016 hadrons/cm2. Due to the high multiplicity of tracks, the required spatial resolution and the extremely harsh radiation field new detector concepts and semiconductor materials have to be explored for a possible solution of this challenge. The CERN RD50 collaboration “Development of Radiation Hard Semiconductor Devices for Very High Luminosity Colliders” has started in 2002 an R&D program for the development of detector technologies that will fulfill the requirements of the S-LHC. Different strategies are followed by RD50 to improve the radiation tolerance. These include the development of defect engineered silicon like Czochralski, epitaxial and oxygen-enriched silicon and of other semiconductor materials like SiC and GaN as well as extensive studies of the microscopic defects responsible for the degradation of irradiated sensors. Furthe...

  13. Progress on DC-DC Converters for a Silicon Tracker for the sLHC Upgrade

    CERN Document Server

    Dhawan, S; Chen, H; Khanna, R; Kierstead, J; Lanni, F; Lynn, D; Musso, C; Rescia, S; Smith, H; Tipton, P; M. Weber, M

    2009-01-01

    There is a need for DC-DC converters which can operate in the extremely harsh environment of the sLHC Si Tracker. The environment requires radiation qualification to a total ionizing radiation dose of 50 Mrad and a displacement damage fluence of 5 x 1014 /cm2 of 1 MeV equivalent neutrons. In addition a static magnetic field of 2 Tesla or greater prevents the use of any magnetic components or materials. In February 2007 an Enpirion EN5360 was qualified for the sLHC radiation dosage but the converter has an input voltage limited to a maximum of 5.5V. From a systems point of view this input voltage was not sufficient for the application. Commercial LDMOS FETs have developed using a 0.25 μm process which provided a 12 volt input and were still radiation hard. These results are reported here and in previous papers. Plug in power cards with ×10 voltage ratio are being developed for testing the hybrids with ABCN chips. These plug-in cards have air coils but use commercial chips that are not designed to be radiatio...

  14. Development of pixel readout integrated circuits for extreme rate and radiation

    CERN Document Server

    Garcia-Sciveres, M; CERN. Geneva. The LHC experiments Committee; LHCC

    2013-01-01

    Letter of Intent for RD Collaboration Proposal focused on development of a next generation pixel readout integrated circuits needed for high luminosity LHC detector upgrades. Brings together ATLAS and CMS pixel chip design communities.

  15. Pixel detectors

    CERN Document Server

    Passmore, M S

    2001-01-01

    positions on the detector. The loss of secondary electrons follows the profile of the detector and increases with higher energy ions. studies of the spatial resolution predict a value of 5.3 lp/mm. The image noise in photon counting systems is investigated theoretically and experimentally and is shown to be given by Poisson statistics. The rate capability of the LAD1 was measured to be 250 kHz per pixel. Theoretical and experimental studies of the difference in contrast for ideal charge integrating and photon counting imaging systems were carried out. It is shown that the contrast differs and that for the conventional definition (contrast = (background - signal)/background) the photon counting device will, in some cases, always give a better contrast than the integrating system. Simulations in MEDICI are combined with analytical calculations to investigate charge collection efficiencies (CCE) in semiconductor detectors. Different pixel sizes and biasing conditions are considered. The results show charge shari...

  16. ATLAS

    CERN Multimedia

    Akhnazarov, V; Canepa, A; Bremer, J; Burckhart, H; Cattai, A; Voss, R; Hervas, L; Kaplon, J; Nessi, M; Werner, P; Ten kate, H; Tyrvainen, H; Vandelli, W; Krasznahorkay, A; Gray, H; Alvarez gonzalez, B; Eifert, T F; Rolando, G; Oide, H; Barak, L; Glatzer, J; Backhaus, M; Schaefer, D M; Maciejewski, J P; Milic, A; Jin, S; Von torne, E; Limbach, C; Medinnis, M J; Gregor, I; Levonian, S; Schmitt, S; Waananen, A; Monnier, E; Muanza, S G; Pralavorio, P; Talby, M; Tiouchichine, E; Tocut, V M; Rybkin, G; Wang, S; Lacour, D; Laforge, B; Ocariz, J H; Bertoli, W; Malaescu, B; Sbarra, C; Yamamoto, A; Sasaki, O; Koriki, T; Hara, K; Da silva gomes, A; Carvalho maneira, J; Marcalo da palma, A; Chekulaev, S; Tikhomirov, V; Snesarev, A; Buzykaev, A; Maslennikov, A; Peleganchuk, S; Sukharev, A; Kaplan, B E; Swiatlowski, M J; Nef, P D; Schnoor, U; Oakham, G F; Ueno, R; Orr, R S; Abouzeid, O; Haug, S; Peng, H; Kus, V; Vitek, M; Temming, K K; Dang, N P; Meier, K; Schultz-coulon, H; Geisler, M P; Sander, H; Schaefer, U; Ellinghaus, F; Rieke, S; Nussbaumer, A; Liu, Y; Richter, R; Kortner, S; Fernandez-bosman, M; Ullan comes, M; Espinal curull, J; Chiriotti alvarez, S; Caubet serrabou, M; Valladolid gallego, E; Kaci, M; Carrasco vela, N; Lancon, E C; Besson, N E; Gautard, V; Bracinik, J; Bartsch, V C; Potter, C J; Lester, C G; Moeller, V A; Rosten, J; Crooks, D; Mathieson, K; Houston, S C; Wright, M; Jones, T W; Harris, O B; Byatt, T J; Dobson, E; Hodgson, P; Hodgkinson, M C; Dris, M; Karakostas, K; Ntekas, K; Oren, D; Duchovni, E; Etzion, E; Oren, Y; Ferrer, L M; Testa, M; Doria, A; Merola, L; Sekhniaidze, G; Giordano, R; Ricciardi, S; Milazzo, A; Falciano, S; De pedis, D; Dionisi, C; Veneziano, S; Cardarelli, R; Verzegnassi, C; Soualah, R; Ochi, A; Ohshima, T; Kishiki, S; Linde, F L; Vreeswijk, M; Werneke, P; Muijs, A; Vankov, P H; Jansweijer, P P M; Dale, O; Lund, E; Bruckman de renstrom, P; Dabrowski, W; Adamek, J D; Wolters, H; Micu, L; Pantea, D; Tudorache, V; Mjoernmark, J; Klimek, P J; Ferrari, A; Abdinov, O; Akhoundov, A; Hashimov, R; Shelkov, G; Khubua, J; Ladygin, E; Lazarev, A; Glagolev, V; Dedovich, D; Lykasov, G; Zhemchugov, A; Zolnikov, Y; Ryabenko, M; Sivoklokov, S; Vasilyev, I; Shalimov, A; Lobanov, M; Paramoshkina, E; Mosidze, M; Bingul, A; Nodulman, L J; Guarino, V J; Yoshida, R; Drake, G R; Calafiura, P; Haber, C; Quarrie, D R; Alonso, J R; Anderson, C; Evans, H; Lammers, S W; Baubock, M; Anderson, K; Petti, R; Suhr, C A; Linnemann, J T; Richards, R A; Tollefson, K A; Holzbauer, J L; Stoker, D P; Pier, S; Nelson, A J; Isakov, V; Martin, A J; Adelman, J A; Paganini, M; Gutierrez, P; Snow, J M; Pearson, B L; Cleland, W E; Savinov, V; Wong, W; Goodson, J J; Li, H; Lacey, R A; Gordeev, A; Gordon, H; Lanni, F; Nevski, P; Rescia, S; Kierstead, J A; Liu, Z; Yu, W W H; Bensinger, J; Hashemi, K S; Bogavac, D; Cindro, V; Hoeferkamp, M R; Coelli, S; Iodice, M; Piegaia, R N; Alonso, F; Wahlberg, H P; Barberio, E L; Limosani, A; Rodd, N L; Jennens, D T; Hill, E C; Pospisil, S; Smolek, K; Schaile, D A; Rauscher, F G; Adomeit, S; Mattig, P M; Wahlen, H; Volkmer, F; Calvente lopez, S; Sanchis peris, E J; Pallin, D; Podlyski, F; Says, L; Boumediene, D E; Scott, W; Phillips, P W; Greenall, A; Turner, P; Gwilliam, C B; Kluge, T; Wrona, B; Sellers, G J; Millward, G; Adragna, P; Hartin, A; Alpigiani, C; Piccaro, E; Bret cano, M; Hughes jones, R E; Mercer, D; Oh, A; Chavda, V S; Carminati, L; Cavasinni, V; Fedin, O; Patrichev, S; Ryabov, Y; Nesterov, S; Grebenyuk, O; Sasso, J; Mahmood, H; Polsdofer, E; Dai, T; Ferretti, C; Liu, H; Hegazy, K H; Benjamin, D P; Zobernig, G; Ban, J; Brooijmans, G H; Keener, P; Williams, H H; Le geyt, B C; Hines, E J; Fadeyev, V; Schumm, B A; Law, A T; Kuhl, A D; Neubauer, M S; Shang, R; Gagliardi, G; Calabro, D; Conta, C; Zinna, M; Jones, G; Li, J; Stradling, A R; Hadavand, H K; Mcguigan, P; Chiu, P; Baldelomar, E; Stroynowski, R A; Kehoe, R L; De groot, N; Timmermans, C; Lach-heb, F; Addy, T N; Nakano, I; Moreno lopez, D; Grosse-knetter, J; Tyson, B; Rude, G D; Tafirout, R; Benoit, P; Danielsson, H O; Elsing, M; Fassnacht, P; Froidevaux, D; Ganis, G; Gorini, B; Lasseur, C; Lehmann miotto, G; Kollar, D; Aleksa, M; Sfyrla, A; Duehrssen-debling, K; Fressard-batraneanu, S; Van der ster, D C; Bortolin, C; Schumacher, J; Mentink, M; Geich-gimbel, C; Yau wong, K H; Lafaye, R; Crepe-renaudin, S; Albrand, S; Hoffmann, D; Pangaud, P; Meessen, C; Hrivnac, J; Vernay, E; Perus, A; Henrot versille, S L; Le dortz, O; Derue, F; Piccinini, M; Polini, A; Terada, S; Arai, Y; Ikeno, M; Fujii, H; Nagano, K; Ukegawa, F; Aguilar saavedra, J A; Conde muino, P; Castro, N F; Eremin, V; Kopytine, M; Sulin, V; Tsukerman, I; Korol, A; Nemethy, P; Bartoldus, R; Glatte, A; Chelsky, S; Van nieuwkoop, J; Bellerive, A; Sinervo, J K; Battaglia, A; Barbier, G J; Pohl, M; Rosselet, L; Alexandre, G B; Prokoshin, F; Pezoa rivera, R A; Batkova, L; Kladiva, E; Stastny, J; Kubes, T; Vidlakova, Z; Esch, H; Homann, M; Herten, L G; Zimmermann, S U; Pfeifer, B; Stenzel, H; Andrei, G V; Wessels, M; Buescher, V; Kleinknecht, K; Fiedler, F M; Schroeder, C D; Fernandez, E; Mir martinez, L; Vorwerk, V; Bernabeu verdu, J; Salt, J; Civera navarrete, J V; Bernard, R; Berriaud, C P; Chevalier, L P; Hubbard, R; Schune, P; Nikolopoulos, K; Batley, J R; Brochu, F M; Phillips, A W; Teixeira-dias, P J; Rose, M B D; Buttar, C; Buckley, A G; Nurse, E L; Larner, A B; Boddy, C; Henderson, J; Costanzo, D; Tarem, S; Maccarrone, G; Laurelli, P F; Alviggi, M; Chiaramonte, R; Izzo, V; Palumbo, V; Fraternali, M; Crosetti, G; Marchese, F; Yamaguchi, Y; Hessey, N P; Mechnich, J M; Liebig, W; Kastanas, K A; Sjursen, T B; Zalieckas, J; Cameron, D G; Banka, P; Kowalewska, A B; Dwuznik, M; Mindur, B; Boldea, V; Hedberg, V; Smirnova, O; Sellden, B; Allahverdiyev, T; Gornushkin, Y; Koultchitski, I; Tokmenin, V; Chizhov, M; Gongadze, A; Khramov, E; Sadykov, R; Krasnoslobodtsev, I; Smirnova, L; Kramarenko, V; Minaenko, A; Zenin, O; Beddall, A J; Ozcan, E V; Hou, S; Wang, S; Moyse, E; Willocq, S; Chekanov, S; Le compte, T J; Love, J R; Ciocio, A; Hinchliffe, I; Tsulaia, V; Gomez, A; Luehring, F; Zieminska, D; Huth, J E; Gonski, J L; Oreglia, M; Tang, F; Shochet, M J; Costin, T; Mcleod, A; Uzunyan, S; Martin, S P; Pope, B G; Schwienhorst, R H; Brau, J E; Ptacek, E S; Milburn, R H; Sabancilar, E; Lauer, R; Saleem, M; Mohamed meera lebbai, M R; Lou, X; Reeves, K B; Rijssenbeek, M; Novakova, P N; Rahm, D; Steinberg, P A; Wenaus, T J; Paige, F; Ye, S; Kotcher, J R; Assamagan, K A; Oliveira damazio, D; Maeno, T; Henry, A; Dushkin, A; Costa, G; Meroni, C; Resconi, S; Lari, T; Biglietti, M; Lohse, T; Gonzalez silva, M L; Monticelli, F G; Saavedra, A F; Patel, N D; Ciodaro xavier, T; Asevedo nepomuceno, A; Lefebvre, M; Albert, J E; Kubik, P; Faltova, J; Turecek, D; Solc, J; Schaile, O; Ebke, J; Losel, P J; Zeitnitz, C; Sturm, P D; Barreiro alonso, F; Modesto alapont, P; Soret medel, J; Garzon alama, E J; Gee, C N; Mccubbin, N A; Sankey, D; Emeliyanov, D; Dewhurst, A L; Houlden, M A; Klein, M; Burdin, S; Lehan, A K; Eisenhandler, E; Lloyd, S; Traynor, D P; Ibbotson, M; Marshall, R; Pater, J; Freestone, J; Masik, J; Haughton, I; Manousakis katsikakis, A; Sampsonidis, D; Krepouri, A; Roda, C; Sarri, F; Fukunaga, C; Nadtochiy, A; Kara, S O; Timm, S; Alam, S M; Rashid, T; Goldfarb, S; Espahbodi, S; Marley, D E; Rau, A W; Dos anjos, A R; Haque, S; Grau, N C; Havener, L B; Thomson, E J; Newcomer, F M; Hansl-kozanecki, G; Deberg, H A; Takeshita, T; Goggi, V; Ennis, J S; Olness, F I; Kama, S; Ordonez sanz, G; Koetsveld, F; Elamri, M; Mansoor-ul-islam, S; Lemmer, B; Kawamura, G; Bindi, M; Schulte, S; Kugel, A; Kretz, M P; Kurchaninov, L; Blanchot, G; Chromek-burckhart, D; Di girolamo, B; Francis, D; Gianotti, F; Nordberg, M Y; Pernegger, H; Roe, S; Boyd, J; Wilkens, H G; Pauly, T; Fabre, C; Tricoli, A; Bertet, D; Ruiz martinez, M A; Arnaez, O L; Lenzi, B; Boveia, A J; Gillberg, D I; Davies, J M; Zimmermann, R; Uhlenbrock, M; Kraus, J K; Narayan, R T; John, A; Dam, M; Padilla aranda, C; 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Murillo quijada, J A; Grout, Z J; Chapman, J D; Cowan, G D; George, S; Boisvert, V; Mcmahon, T R; Doyle, A T; Thompson, S A; Britton, D; Smizanska, M; Campanelli, M; Butterworth, J M; Loken, J; Renton, P; Barr, A J; Issever, C; Short, D; Crispin ortuzar, M; Tovey, D R; French, R; Rozen, Y; Alexander, G; Kreisel, A; Conventi, F; Raulo, A; Schioppa, M; Susinno, G; Tassi, E; Giagu, S; Luci, C; Nisati, A; Cobal, M; Ishikawa, A; Jinnouchi, O; Bos, K; Verkerke, W; Vermeulen, J; Van vulpen, I B; Kieft, G; Mora, K D; Olsen, F; Rohne, O M; Pajchel, K; Nilsen, J K; Wosiek, B K; Wozniak, K W; Badescu, E; Jinaru, A; Bohm, C; Johansson, E K; Sjoelin, J B R; Clement, C; Buszello, C P; Huseynova, D; Boyko, I; Popov, B; Poukhov, O; Vinogradov, V; Tsiareshka, P; Skvorodnev, N; Soldatov, A; Chuguev, A; Gushchin, V; Yazici, E; Lutz, M S; Malon, D; Vanyashin, A; Lavrijsen, W; Spieler, H; Biesiada, J L; Bahr, M; Kong, J; Tatarkhanov, M; Ogren, H; Van kooten, R J; Cwetanski, P; Butler, J M; Shank, J T; Chakraborty, D; Ermoline, I; Sinev, N; Whiteson, D O; Corso radu, A; Huang, J; Werth, M P; Kastoryano, M; Meirose da silva costa, B; Namasivayam, H; Hobbs, J D; Schamberger jr, R D; Guo, F; Potekhin, M; Popovic, D; Gorisek, A; Sokhrannyi, G; Hofsajer, I W; Mandelli, L; Ceradini, F; Graziani, E; Giorgi, F; Zur nedden, M E G; Grancagnolo, S; Volpi, M; Nunes hanninger, G; Rados, P K; Milesi, M; Cuthbert, C J; Black, C W; Fink grael, F; Fincke-keeler, M; Keeler, R; Kowalewski, R V; Berghaus, F O; Qi, M; Davidek, T; Tas, P; Jakubek, J; Duckeck, G; Walker, R; Mitterer, C A; Harenberg, T; Sandvoss, S A; Del peso, J; Llorente merino, J; Gonzalez millan, V; Irles quiles, A; Crouau, M; Gris, P L Y; Liauzu, S; Romano saez, S M; Gallop, B J; Jones, T J; Austin, N C; Morris, J; Duerdoth, I; Thompson, R J; Kelly, M P; Leisos, A; Garas, A; Pizio, C; Venda pinto, B A; Kudin, L; Qian, J; Wilson, A W; Mietlicki, D; Long, J D; Sang, Z; Arms, K E; Rahimi, A M; Moss, J J; Oh, S H; Parker, S I; Parsons, J; Cunitz, H; Vanguri, R S; Sadrozinski, H; Lockman, W S; Martinez-mc kinney, G; Goussiou, A; Jones, A; Lie, K; Hasegawa, Y; Olcese, M; Gilewsky, V; Harrison, P F; Janus, M; Spangenberg, M; De, K; Ozturk, N; Pal, A K; Darmora, S; Bullock, D J; Oviawe, O; Derkaoui, J E; Rahal, G; Sircar, A; Frey, A S; Stolte, P; Rosien, N; Zoch, K; Li, L; Schouten, D W; Catinaccio, A; Ciapetti, M; Delruelle, N; Ellis, N; Farthouat, P; Hoecker, A; Klioutchnikova, T; Macina, D; Malyukov, S; Spiwoks, R D; Unal, G P; Vandoni, G; Petersen, B A; Pommes, K; Nairz, A M; Wengler, T; Mladenov, D; Solans sanchez, C A; Lantzsch, K; Schmieden, K; Jakobsen, S; Ritsch, E; Sciuccati, A; Alves dos santos, A M; Ouyang, Q; Zhou, M; Brock, I C; Janssen, J; Katzy, J; Anders, C F; Nilsson, B S; Bazan, A; Di ciaccio, L; Yildizkaya, T; Collot, J; Malek, F; Trocme, B S; Breugnon, P; Godiot, S; Adam bourdarios, C; Coulon, J; Duflot, L; Petroff, P G; Zerwas, D; Lieuvin, M; Calderini, G; Laporte, D; Ocariz, J; Gabrielli, A; Ohska, T K; Kurochkin, Y; Kantserov, V; Vasilyeva, L; Speransky, M; Smirnov, S; Antonov, A; Bulekov, O; Tikhonov, Y; Sargsyan, L; Vardanyan, G; Budick, B; Kocian, M L; Luitz, S; Young, C C; Grenier, P J; Kelsey, M; Black, J E; Kneringer, E; Jussel, P; Horton, A J; Beaudry, J; Chandra, A; Ereditato, A; Topfel, C M; Mathieu, R; Bucci, F; Muenstermann, D; White, R M; He, M; Urban, J; Straka, M; Vrba, V; Schumacher, M; Parzefall, U; Mahboubi, K; Sommer, P O; Koepke, L H; Bethke, S; Moser, H; Wiesmann, M; Walkowiak, W A; Fleck, I J; Martinez-perez, M; Sanchez sanchez, C A; Jorgensen roca, S; Accion garcia, E; Sainz ruiz, C A; Valls ferrer, J A; Amoros vicente, G; Vives torrescasana, R; Ouraou, A; Formica, A; Hassani, S; Watson, M F; Cottin buracchio, G F; Bussey, P J; Saxon, D; Ferrando, J E; Collins-tooth, C L; Hall, D C; Cuhadar donszelmann, T; Dawson, I; Duxfield, R; Argyropoulos, T; Brodet, E; Livneh, R; Shougaev, K; Reinherz, E I; Guttman, N; Beretta, M M; Vilucchi, E; Aloisio, A; Patricelli, S; Caprio, M; Cevenini, F; De vecchi, C; Livan, M; Rimoldi, A; Vercesi, V; Ayad, R; Mastroberardino, A; Ciapetti, G; Luminari, L; Rescigno, M; Santonico, R; Salamon, A; Del papa, C; Kurashige, H; Homma, Y; Tomoto, M; Horii, Y; Sugaya, Y; Hanagaki, K; Bobbink, G; Kluit, P M; Koffeman, E N; Van eijk, B; Lee, H; Eigen, G; Dorholt, O; Strandlie, A; Strzempek, P B; Dita, S; Stoicea, G; Chitan, A; Leven, S S; Moa, T; Brenner, R; Ekelof, T J C; Olshevskiy, A; Roumiantsev, V; Chlachidze, G; Zimine, N; Gusakov, Y; Grigalashvili, N; Mineev, M; Potrap, I; Barashkou, A; Shoukavy, D; Shaykhatdenov, B; Pikelner, A; Gladilin, L; Ammosov, V; Abramov, A; Arik, M; Sahinsoy, M; Uysal, Z; Azizi, K; Hotinli, S C; Zhou, S; Berger, E; Blair, R; Underwood, D G; Einsweiler, K; Garcia-sciveres, M A; Siegrist, J L; Kipnis, I; Dahl, O; Holland, S; Barbaro galtieri, A; Smith, P T; Parua, N; Franklin, M; Mercurio, K M; Tong, B; Pod, E; Cole, S G; Hopkins, W H; Guest, D H; Severini, H; Marsicano, J J; Abbott, B K; Wang, Q; Lissauer, D; Ma, H; Takai, H; Rajagopalan, S; Protopopescu, S D; Snyder, S S; Undrus, A; Popescu, R N; Begel, M A; Blocker, C A; Amelung, C; Mandic, I; Macek, B; Tucker, B H; Citterio, M; Troncon, C; Orestano, D; Taccini, C; Romeo, G L; Dova, M T; Taylor, G N; Gesualdi manhaes, A; Mcpherson, R A; Sobie, R; Taylor, R P; Dolezal, Z; Kodys, P; Slovak, R; Sopko, B; Vacek, V; Sanders, M P; Hertenberger, R; Meineck, C; Becks, K; Kind, P; Sandhoff, M; Cantero garcia, J; De la torre perez, H; Castillo gimenez, V; Ros, E; Hernandez jimenez, Y; Chadelas, R; Santoni, C; Washbrook, A J; O'brien, B J; Wynne, B M; Mehta, A; Vossebeld, J H; Landon, M; Teixeira dias castanheira, M; Cerrito, L; Keates, J R; Fassouliotis, D; Chardalas, M; Manousos, A; Grachev, V; Seliverstov, D; Sedykh, E; Cakir, O; Ciftci, R; Edson, W; Prell, S A; Rosati, M; Stroman, T; Jiang, H; Neal, H A; Li, X; Gan, K K; Smith, D S; Kruse, M C; Ko, B R; Leung fook cheong, A M; Cole, B; Angerami, A R; Greene, Z S; Kroll, J I; Van berg, R P; Forbush, D A; Lubatti, H; Raisher, J; Shupe, M A; Wolin, S; Oshita, H; Gaudio, G; Das, R; Konig, A C; Croft, V A; Harvey, A; Maaroufi, F; Melo, I; Greenwood jr, Z D; Shabalina, E; Mchedlidze, G; Drechsler, E; Rieger, J K; Blackston, M; Colombo, T

    2002-01-01

    % ATLAS \\\\ \\\\ ATLAS is a general-purpose experiment for recording proton-proton collisions at LHC. The ATLAS collaboration consists of 144 participating institutions (June 1998) with more than 1750~physicists and engineers (700 from non-Member States). The detector design has been optimized to cover the largest possible range of LHC physics: searches for Higgs bosons and alternative schemes for the spontaneous symmetry-breaking mechanism; searches for supersymmetric particles, new gauge bosons, leptoquarks, and quark and lepton compositeness indicating extensions to the Standard Model and new physics beyond it; studies of the origin of CP violation via high-precision measurements of CP-violating B-decays; high-precision measurements of the third quark family such as the top-quark mass and decay properties, rare decays of B-hadrons, spectroscopy of rare B-hadrons, and $ B ^0 _{s} $-mixing. \\\\ \\\\The ATLAS dectector, shown in the Figure includes an inner tracking detector inside a 2~T~solenoid providing an axial...

  17. Design and implementation of an expert system for the detector control systems of the ATLAS pixel detector; Entwurf und Implementation eines Expertensystems fuer das Detektorkontrollsystem des ATLAS-Pixeldetektors

    Energy Technology Data Exchange (ETDEWEB)

    Henss, Tobias

    2008-12-15

    In the framework of this thesis an expert system ''Pixel-Advisor'' for the control system of the pixel detector was designed and implemented. This supports the operational personnel in the diagnosis and removal of possible problems, which are in connection with the detector control system and unburdens the few available DCS experts.

  18. Status report on a MicroTCA card for HCAL trigger and readout at SLHC

    Energy Technology Data Exchange (ETDEWEB)

    Mans, J; Frahm, E, E-mail: frahm@physics.umn.edu [University of Minnesota, Minneapolis, MN 55455 (United States)

    2010-12-15

    We present recent measurements performed using a prototype MicroTCA card for CMS-HCAL Trigger and Readout at SLHC. Our second generation prototype uses a Xilinx XC5VFX70T FPGA to perform the high-speed communication and data processing for up to eight Readout Module fibers that are streaming data at 4.8 Gbps each. The FPGA also uses two SFP+ optical interfaces at 6.4 Gbps each for data transfer to the Trigger System. A local DAQ interface in the FPGA communicates via Gigabit Ethernet with the MicroTCA MCH. Bit Error Rate Test (BERT) results and data integrity analyses are presented in challenging clocking environments including a legacy TTC system. In addition, the status of the IPbus concept for control of deeply embedded devices is presented.

  19. Status report on a MicroTCA card for HCAL trigger and readout at SLHC

    CERN Document Server

    Mans, J; 10.1088/1748-0221/5/12/C12027

    2010-01-01

    We present recent measurements performed using a prototype MicroTCA card for CMS-HCAL Trigger and Readout at SLHC. Our second generation prototype uses a Xilinx XC5VFX70T FPGA to perform the high-speed communication and data processing for up to eight Readout Module fibers that are streaming data at 4.8 Gbps each. The FPGA also uses two SFP+ optical interfaces at 6.4 Gbps each for data transfer to the Trigger System. A local DAQ interface in the FPGA communicates via Gigabit Ethernet with the MicroTCA MCH. Bit Error Rate Test (BERT) results and data integrity analyses are presented in challenging clocking environments including a legacy TTC system. In addition, the status of the IPbus concept for control of deeply embedded devices is presented

  20. Design and development of micro-strip stacked module prototypes for tracking at S-LHC

    Energy Technology Data Exchange (ETDEWEB)

    Bernardini, J [Scuola Normale Superiore (SNS) di Pisa, P.zza Cavalieri 7, Pisa (Italy); Bosi, F; Dell' Orso, R; Fiori, F; Messineo, A; Palla, F; Profeti, A; Verdini, P G, E-mail: francesco.fiori@pi.infn.i [Istituto Nazionale di Fisica Nucleare (INFN) Pisa, L.go B. Pontecorvo 3, Pisa (Italy)

    2010-11-15

    Experience at high luminosity hadron collider experiments shows that tracking information enhances the trigger rejection capabilities while retaining high efficiency for interesting physics events [1]. The design of a tracking based trigger for Super LHC (S-LHC), the high luminosity upgrade of the LHC collider [2], is an extremely challenging task requiring the identification of high-momentum tracks as a part of the Level 1 trigger decision. Simulation studies show that this can be achieved by correlating hits on two closely spaced silicon strip sensors. This paper focuses on the design and development of micro-strip stacked prototype modules and their performance. The prototypes have been built with the silicon sensors and electronics used to equip the present CMS Tracker [3]. Correlation of signals collected from sensors are processed off detector. Preliminary results in terms of signal over noise and tracking performance with cosmic rays will be also shown.

  1. Gamma and neutron massive irradiation tests of the ATLAS MDT chambers

    Energy Technology Data Exchange (ETDEWEB)

    Meoni, Evelin [Dipartimento di Fisica, Universita degli Studi della Calabria and INFN, Cosenza (Italy)]. E-mail: meoni@fis.unical.it; Branchini, Paolo [Dipartimento di Fisica, Universita Roma Tre and INFN Sezione di Roma III, Rome (Italy); Di Luise, Silvestro [Dipartimento di Fisica, Universita Roma Tre and INFN Sezione di Roma III, Rome (Italy); Graziani, Enrico [Dipartimento di Fisica, Universita Roma Tre and INFN Sezione di Roma III, Rome (Italy); La Rotonda, Laura [Dipartimento di Fisica, Universita degli Studi della Calabria and INFN, Cosenza (Italy); Mazzotta, Concetta [Dipartimento di Fisica, Universita degli Studi della Calabria and INFN, Cosenza (Italy); Morello, Gianfranco [Dipartimento di Fisica, Universita degli Studi della Calabria and INFN, Cosenza (Italy); Passeri, Antonio [Dipartimento di Fisica, Universita Roma Tre and INFN Sezione di Roma III, Rome (Italy); Petrucci, Fabrizio [Dipartimento di Fisica, Universita Roma Tre and INFN Sezione di Roma III, Rome (Italy); Policicchio, Antonio [Dipartimento di Fisica, Universita degli Studi della Calabria and INFN, Cosenza (Italy); Salvatore, Daniela [Dipartimento di Fisica, Universita degli Studi della Calabria and INFN, Cosenza (Italy); Schioppa, Marco [Dipartimento di Fisica, Universita degli Studi della Calabria and INFN, Cosenza (Italy); Tonazzo, Alessandra [Dipartimento di Fisica, Universita Roma Tre and INFN Sezione di Roma III, Rome (Italy)

    2007-03-01

    MDT chambers, the precision tracking system of the ATLAS muon spectrometer, have to operate for 10 years in the harsh LHC background environment mainly due to low energy photons and neutrons. The expected overall maximum count rate is 500Hz/cm{sup 2}. Moreover the upgrades for S-LHC will involve fluxes ten times higher than that at LHC. To study the behavior of MDT chambers under massive irradiation of gammas and neutrons at level of S-LHC, three extensive tests were performed at the ENEA-Casaccia Research Centre Facilities, irradiating several test detectors. The results about the drift properties, gas gain and tracking performances, both at high rates and after massive irradiation, are given.

  2. Diamond pixel modules

    CERN Document Server

    Gan, K K; Robichaud, A; Potenza, R; Kuleshov, S; Kagan, H; Kass, R; Wermes, N; Dulinski, W; Eremin, V; Smith, S; Sopko, B; Olivero, P; Gorisek, A; Chren, D; Kramberger, G; Schnetzer, S; Weilhammer, P; Martemyanov, A; Hugging, F; Pernegger, H; Lagomarsino, S; Manfredotti, C; Mishina, M; Trischuk, W; Dobos, D; Cindro, V; Belyaev, V; Duris, J; Claus, G; Wallny, R; Furgeri, A; Tuve, C; Goldstein, J; Sciortino, S; Sutera, C; Asner, D; Mikuz, M; Lo Giudice, A; Velthuis, J; Hits, D; Griesmayer, E; Oakham, G; Frais-Kolbl, H; Bellini, V; D'Alessandro, R; Cristinziani, M; Barbero, M; Schaffner, D; Costa, S; Goffe, M; La Rosa, A; Bruzzi, M; Schreiner, T; de Boer, W; Parrini, G; Roe, S; Randrianarivony, K; Dolenc, I; Moss, J; Brom, J M; Golubev, A; Mathes, M; Eusebi, R; Grigoriev, E; Tsung, J W; Mueller, S; Mandic, I; Stone, R; Menichelli, D

    2011-01-01

    With the commissioning of the LHC in 2010 and upgrades expected in 2015, ATLAS and CMS are planning to upgrade their innermost tracking layers with radiation hard technologies. Chemical Vapor Deposition diamond has been used extensively in beam conditions monitors as the innermost detectors in the highest radiation areas of BaBar, Belle, CDF and all LHC experiments. This material is now being considered as a sensor material for use very close to the interaction region where the most extreme radiation conditions exist Recently the RD42 collaboration constructed, irradiated and tested polycrystalline and single-crystal chemical vapor deposition diamond sensors to the highest fluences expected at the super-LHC. We present beam test results of chemical vapor deposition diamond up to fluences of 1.8 x 10(16) protons/cm(2) illustrating that both polycrystalline and single-crystal chemical vapor deposition diamonds follow a single damage curve. We also present beam test results of irradiated complete diamond pixel m...

  3. System Tests with DC-DC Converters for the CMS Silicon Strip Tracker at SLHC

    CERN Document Server

    Klein, K; Karpinski, W; Merz, J; Sammet, J

    2008-01-01

    The delivery of power is considered to be one of the major challenges for the upgrade of the CMS silicon strip tracker for SLHC. The inevitable increase in granularity and complexity of the device is expected to result in a power consumption comparable or even higher than the power consumption of todays' strip tracker. However, the space available for cables will remain the same. In addition, a further increase of the tracker material budget due to cables and cooling is considered inacceptable, as the performance of the CMS detector must not be compromised for the upgrade. Novel powering schemes such as serial powering or usage of DC-DC converters have been proposed to solve the problem. To test the second option, substructures of the current CMS silicon strip tracker have been operated for the first time with off-the-shelf DC-DC buck converters as well as with first prototypes of custom-designed DC-DC converters. The tests are described and the results are discussed.

  4. Two ATLAS suppliers honoured

    CERN Multimedia

    2007-01-01

    The ATLAS experiment has recognised the outstanding contribution of two firms to the pixel detector. Recipients of the supplier award with Peter Jenni, ATLAS spokesperson, and Maximilian Metzger, CERN Secretary-General.At a ceremony held at CERN on 28 November, the ATLAS collaboration presented awards to two of its suppliers that had produced sensor wafers for the pixel detector. The CiS Institut für Mikrosensorik of Erfurt in Germany has supplied 655 sensor wafers containing a total of 1652 sensor tiles and the firm ON Semiconductor has supplied 515 sensor wafers (1177 sensor tiles) from its foundry at Roznov in the Czech Republic. Both firms have successfully met the very demanding requirements. ATLAS’s huge pixel detector is very complicated, requiring expertise in highly specialised integrated microelectronics and precision mechanics. Pixel detector project leader Kevin Einsweiler admits that when the project was first propo...

  5. The FE-I4 pixel readout integrated circuit

    Energy Technology Data Exchange (ETDEWEB)

    Garcia-Sciveres, M., E-mail: mgarcia-sciveres@bl.gov [Lawrence Berkeley National Laboratory, Berkeley, CA (United States); Arutinov, D.; Barbero, M. [University of Bonn, Bonn (Germany); Beccherle, R. [Istituto Nazionale di Fisica Nucleare Sezione di Genova, Genova (Italy); Dube, S.; Elledge, D. [Lawrence Berkeley National Laboratory, Berkeley, CA (United States); Fleury, J. [Laboratoire de l' Accelerateur Lineaire, Orsay (France); Fougeron, D.; Gensolen, F. [Centre de Physique des Particules de Marseille, Marseille (France); Gnani, D. [Lawrence Berkeley National Laboratory, Berkeley, CA (United States); Gromov, V. [Nationaal Instituut voor Subatomaire Fysica, Amsterdam (Netherlands); Hemperek, T.; Karagounis, M. [University of Bonn, Bonn (Germany); Kluit, R. [Nationaal Instituut voor Subatomaire Fysica, Amsterdam (Netherlands); Kruth, A. [University of Bonn, Bonn (Germany); Mekkaoui, A. [Lawrence Berkeley National Laboratory, Berkeley, CA (United States); Menouni, M. [Centre de Physique des Particules de Marseille, Marseille (France); Schipper, J.-D. [Nationaal Instituut voor Subatomaire Fysica, Amsterdam (Netherlands)

    2011-04-21

    A new pixel readout integrated circuit denominated FE-I4 is being designed to meet the requirements of ATLAS experiment upgrades. It will be the largest readout IC produced to date for particle physics applications, filling the maximum allowed reticle area. This will significantly reduce the cost of future hybrid pixel detectors. In addition, FE-I4 will have smaller pixels and higher rate capability than the present generation of LHC pixel detectors. Design features are described along with simulation and test results, including low power and high rate readout architecture, mixed signal design strategy, and yield hardening.

  6. Electrical Characteristics of Silicon Pixel Sensors

    CERN Document Server

    Gorelov, I; Hoeferkamp, M; Mata-Bruni, V; Santistevan, G; Seidel, S C; Ciocio, A; Einsweiler, K F; Emes, J; Gilchriese, M G D; Joshi, A; Kleinfelder, S A; Marchesini, R; McCormack, F; Milgrome, O; Palaio, N; Pengg, F; Richardson, J; Zizka, G; Ackers, M; Comes, G; Fischer, P; Keil, M; Klasen, V; Kühl, T; Meuser, S; Ockenfels, W; Raith, B; Treis, J; Wermes, N; Gössling, C; Hügging, F G; Klaiber Lodewigs, Jonas M; Krasel, O; Wüstenfeld, J; Wunstorf, R; Barberis, D; Beccherle, R; Caso, Carlo; Cervetto, M; Darbo, G; Gagliardi, G; Gemme, C; Morettini, P; Netchaeva, P; Osculati, B; Rossi, L; Charles, E; Fasching, D; Blanquart, L; Breugnon, P; Calvet, D; Clemens, J-C; Delpierre, P A; Hallewell, G D; Laugier, D; Mouthuy, T; Rozanov, A; Valin, I; Andreazza, A; Caccia, M; Citterio, M; Lari, T; Meroni, C; Ragusa, F; Troncon, C; Vegni, G; Lutz, Gerhard; Richter, R H; Rohe, T; Boyd, GR; Skubic, P L; Sícho, P; Tomasek, L; Vrba, V; Holder, M; Ziolkowski, M; Cauz, D; Cobal-Grassmann, M; D'Auria, S; De Lotto, B; del Papa, C; Grassmann, H; Santi, L; Becks, K H; Lenzen, G; Linder, C

    2001-01-01

    Prototype sensors for the ATLAS silicon pixel detector have been electrically characterized. The current and voltage characteristics, charge collection efficiencies, and resolutions have been examined. Devices were fabricated on oxygenated and standard detector-grade silicon wafers. Results from prototypes which examine p-stop and standard and moderated p-spray isolation are presented for a variety of geometrical options. Some of the comparisons relate unirradiated sensors with those that have received fluences relevant to LHC operation.

  7. Performance of silicon pixel detectors at small track incidence angles

    CERN Document Server

    Viel, Simon; The ATLAS collaboration

    2015-01-01

    In order to enable the ATLAS experiment to successfully track charged particles produced in high-energy collisions at the High-Luminosity Large Hadron Collider, the current ATLAS Inner Detector will be replaced by the Inner Tracker (ITk), entirely composed of silicon pixel and strip detectors. An extension of the tracking coverage of ITk to very forward pseudorapidity values is proposed, using pixel modules placed in a long cylindrical layer around the beam pipe. The measurement of long pixel clusters, detected when charged particles cross the silicon sensor at small incidence angles, has potential to significantly improve the tracking efficiency, fake track rejection, and resolution of ITk in the very forward region. The performance of state-of-the-art pixel modules at small track incidence angles is studied using test beam data collected at SLAC and CERN, as well as simulated data.

  8. Simulation study of pixel detector charge digitization

    Science.gov (United States)

    Wang, Fuyue; Nachman, Benjamin; Sciveres, Maurice; Lawrence Berkeley National Laboratory Team

    2017-01-01

    Reconstruction of tracks from nearly overlapping particles, called Tracking in Dense Environments (TIDE), is an increasingly important component of many physics analyses at the Large Hadron Collider as signatures involving highly boosted jets are investigated. TIDE makes use of the charge distribution inside a pixel cluster to resolve tracks that share one of more of their pixel detector hits. In practice, the pixel charge is discretized using the Time-over-Threshold (ToT) technique. More charge information is better for discrimination, but more challenging for designing and operating the detector. A model of the silicon pixels has been developed in order to study the impact of the precision of the digitized charge distribution on distinguishing multi-particle clusters. The output of the GEANT4-based simulation is used to train neutral networks that predict the multiplicity and location of particles depositing energy inside one cluster of pixels. By studying the multi-particle cluster identification efficiency and position resolution, we quantify the trade-off between the number of ToT bits and low-level tracking inputs. As both ATLAS and CMS are designing upgraded detectors, this work provides guidance for the pixel module designs to meet TIDE needs. Work funded by the China Scholarship Council and the Office of High Energy Physics of the U.S. Department of Energy under contract DE-AC02-05CH11231.

  9. ATLAS IBL sensor qualifiaction

    CERN Document Server

    Weingarten, J; The ATLAS collaboration

    2011-01-01

    The upgrade for the ATLAS detector will undergo different phases towards HL-LHC. The first upgrade for the Pixel Detector will consist in the construction of a new pixel layer which will be installed during the first shutdown of the LHC machine (foreseen for 2013-14). The new detector, called Insertable B-Layer (IBL), will be inserted between the existing pixel detector and a new (smaller radius) beam-pipe at a radius of 3.2 cm. The IBL will require the development of several new technologies to cope with increase of radiation or pixel occupancy and also to improve the physics performance which will be achieved by reduction of the pixel size and of the material budget. Two different promising Silicon sensor technologies (Planar n-in-n and 3D) are currently under investigation for the pixel detector. An overview of the sensor technologies qualification with particular emphasis on irradiation and beam tests will be presented.

  10. ATLAS IBL Sensor Qualification

    CERN Document Server

    Weingarten, J; The ATLAS collaboration

    2011-01-01

    The upgrade for the ATLAS detector will undergo different phases towards HL-LHC. The first upgrade for the Pixel Detector will consist in the construction of a new pixel layer which will be installed during the first shutdown of the LHC machine (foreseen for 2013-14). The new detector, called Insertable B-Layer (IBL), will be inserted between the existing pixel detector and a new (smaller radius) beam-pipe at a radius of 3.2 cm. The IBL will require the development of several new technologies to cope with increase of radiation or pixel occupancy and also to improve the physics performance which will be achieved by reduction of the pixel size and of the material budget. Two different promising Silicon sensor technologies (Planar n-in-n and 3D) are currently under investigation for the pixel detector. An overview of the sensor technologies qualification with particular emphasis on irradiation and beam tests will be presented.

  11. The Pixels system: last but not late!

    CERN Multimedia

    Kevin Einsweiler

    The Pixel Detector for ATLAS is one of the smallest, but most challenging components of the experiment. It lives in the dangerous territory directly outside the beampipe, where the radiation environment is particularly fierce, and it must be roughly one million times more radiation-hard than its human designers. Starting at a radius of just 5cm from the interaction point where the proton beams collide, it occupies a volume of slightly more than one meter in length and a half meter in diameter. In this compact region, there are eighty million channels of electronics (most of the electronics channels in ATLAS!), each capable of measuring the charge deposited by a track in a silicon pixel measuring only 50 microns by 400 microns in size (a volume of 0.005 cubic millimeters). A total cooling capacity of 15 KWatts is available to keep it operating comfortably at -5C. This detector is built around, and provides the support for, the central beampipe of ATLAS. It is supported on carbon fiber rails inside of the Pix...

  12. Pixel Vertex Detectors

    OpenAIRE

    Wermes, Norbert

    2006-01-01

    Pixel vertex detectors are THE instrument of choice for the tracking of charged particles close to the interaction point at the LHC. Hybrid pixel detectors, in which sensor and read-out IC are separate entities, constitute the present state of the art in detector technology. Three of the LHC detectors use vertex detectors based on this technology. A development period of almost 10 years has resulted in pixel detector modules which can stand the extreme rate and timing requirements as well as ...

  13. Readout of TPC Tracking Chambers with GEMs and Pixel Chip

    Energy Technology Data Exchange (ETDEWEB)

    Kadyk, John; Kim, T.; Freytsis, M.; Button-Shafer, J.; Kadyk, J.; Vahsen, S.E.; Wenzel, W.A.

    2007-12-21

    Two layers of GEMs and the ATLAS Pixel Chip, FEI3, have been combined and tested as a prototype for Time Projection Chamber (TPC) readout at the International Linear Collider (ILC). The double-layer GEM system amplifies charge with gain sufficient to detect all track ionization. The suitability of three gas mixtures for this application was investigated, and gain measurements are presented. A large sample of cosmic ray tracks was reconstructed in 3D by using the simultaneous timing and 2D spatial information from the pixel chip. The chip provides pixel charge measurement as well as timing. These results demonstrate that a double GEM and pixel combination, with a suitably modified pixel ASIC, could meet the stringent readout requirements of the ILC.

  14. EnviroAtlas Estimated Intersection Density of Walkable Roads Web Service

    Data.gov (United States)

    U.S. Environmental Protection Agency — This EnviroAtlas dataset estimates the intersection density of walkable roads within a 750 meter radius of any given 10 meter pixel in each EnviroAtlas community....

  15. Towards third generation pixel readout chips

    Energy Technology Data Exchange (ETDEWEB)

    Garcia-Sciveres, M., E-mail: mgarcia-sciveres@lbl.gov; Mekkaoui, A.; Ganani, D.

    2013-12-11

    We present concepts and prototyping results towards a third generation pixel readout chip. We consider the 130 nm feature size FE-I4 chip, in production for the ATLAS IBL upgrade, to be a second generation chip. A third generation chip would have to go significantly further. A possible direction is to make the IC design generic so that different experiments can configure it to meet significantly different requirements, without the need for everybody to develop their own ASIC from the ground up. In terms of target technology, a demonstrator 500-pixel matrix containing analog front ends only (no complex functionality), was designed and fabricated in 65 nm CMOS and irradiated with protons in December 2011 and May 2012.

  16. The ATLAS IBL CO2 Cooling System

    CERN Document Server

    Verlaat, Bartholomeus; The ATLAS collaboration

    2016-01-01

    The Atlas Pixel detector has been equipped with an extra B-layer in the space obtained by a reduced beam pipe. This new pixel detector called the ATLAS Insertable B-Layer (IBL) is installed in 2014 and is operational in the current ATLAS data taking. The IBL detector is cooled with evaporative CO2 and is the first of its kind in ATLAS. The ATLAS IBL CO2 cooling system is designed for lower temperature operation (<-35⁰C) than the previous developed CO2 cooling systems in High Energy Physics experiments. The cold temperatures are required to protect the pixel sensors for the high expected radiation dose up to 550 fb^-1 integrated luminosity. This paper describes the design, development, construction and commissioning of the IBL CO2 cooling system. It describes the challenges overcome and the important lessons learned for the development of future systems which are now under design for the Phase-II upgrade detectors.

  17. The ATLAS IBL CO2 Cooling System

    CERN Document Server

    Verlaat, Bartholomeus; The ATLAS collaboration

    2016-01-01

    The ATLAS Pixel detector has been equipped with an extra B-layer in the space obtained by a reduced beam pipe. This new pixel detector called the ATLAS Insertable B-Layer (IBL) is installed in 2014 and is operational in the current ATLAS data taking. The IBL detector is cooled with evaporative CO2 and is the first of its kind in ATLAS. The ATLAS IBL CO2 cooling system is designed for lower temperature operation (<-35⁰C) than the previous developed CO2 cooling systems in High Energy Physics experiments. The cold temperatures are required to protect the pixel sensors for the high expected radiation dose up to 550 fb^-1 integrated luminosity.

  18. The ATLAS IBL CO2 cooling system

    Science.gov (United States)

    Verlaat, B.; Ostrega, M.; Zwalinski, L.; Bortolin, C.; Vogt, S.; Godlewski, J.; Crespo-Lopez, O.; Van Overbeek, M.; Blaszcyk, T.

    2017-02-01

    The ATLAS Pixel detector has been equipped with an extra pixel layer in the space obtained by a smaller radius beam pipe. This new pixel layer called the Insertable B-Layer (IBL) was installed in 2014 and is operational in the current ATLAS data taking. The IBL detector is cooled with evaporative CO2 and is the first of its kind in ATLAS. The ATLAS IBL CO2 cooling system is designed for lower temperature operation (systems in High Energy Physics experiments. The cold temperatures are required to protect the pixel sensors for the expected high radiation dose received at an integrated luminosity of 550 fb1. This paper describes the design, development, construction and commissioning of the IBL CO2 cooling system. It describes the challenges overcome and the important lessons learned for the development of future systems which are now under design for the Phase-II upgrade detectors.

  19. The FE-I4 Pixel Readout Chip and the IBL Module

    CERN Document Server

    Barbero, Marlon; Backhaus, Malte; Fang, Xiaochao; Gonella, Laura; Hemperek, Tomasz; Karagounis, Michael; Krueger, Hans; Kruth, Andre; Wermes, Norbert; Breugnon, Patrick; Fougeron, Denis; Gensolen, Fabrice; Menouni, Mohsine; Rozanov, Sasha; Caminada, Lea; Dube, Sourabh; Fleury, Julien; Gnani, Dario; Garcia-Sciveres, Maurice; Jensen, Frank; Lu, Yunpeng; Mekkaoui, Abderrezak; Gromov, Vladimir; Kluit, Ruud; Schipper, Jan David; Zivkovic, Vladimir; Grosse-Knetter, Joern; Weingarten; Kocian, Martin

    2011-01-01

    FE-I4 is the new ATLAS pixel readout chip for the upgraded ATLAS pixel detector. Designed in a CMOS 130 nm feature size process, the IC is able to withstand higher radiation levels compared to the present generation of ATLAS pixel Front-End FE-I3, and can also cope with higher hit rate. It is thus suitable for intermediate radii pixel detector layers in the High Luminosity LHC environment, but also for the inserted layer at 3.3 cm known as the “Insertable B-Layer” project (IBL), at a shorter timescale. In this paper, an introduction to the FE-I4 will be given, focusing on test results from the first full size FE-I4A prototype which has been available since fall 2010. The IBL project will be introduced, with particular emphasis on the FE-I4-based module concept.

  20. The FE-I4 Pixel Readout Chip and the IBL Module

    Energy Technology Data Exchange (ETDEWEB)

    Barbero, Marlon; Arutinov, David; Backhaus, Malte; Fang, Xiao-Chao; Gonella, Laura; Hemperek, Tomasz; Karagounis, Michael; Hans, Kruger; Kruth, Andre; Wermes, Norbert; /Bonn U.; Breugnon, Patrick; Fougeron, Denis; Gensolen, Fabrice; Menouni, Mohsine; Rozanov, Alexander; /Marseille, CPPM; Beccherle, Roberto; Darbo, Giovanni; /INFN, Genoa; Caminada, Lea; Dube, Sourabh; Fleury, Julien; Gnani, Dario; /LBL, Berkeley /NIKHEF, Amsterdam /Gottingen U. /SLAC

    2012-05-01

    FE-I4 is the new ATLAS pixel readout chip for the upgraded ATLAS pixel detector. Designed in a CMOS 130 nm feature size process, the IC is able to withstand higher radiation levels compared to the present generation of ATLAS pixel Front-End FE-I3, and can also cope with higher hit rate. It is thus suitable for intermediate radii pixel detector layers in the High Luminosity LHC environment, but also for the inserted layer at 3.3 cm known as the 'Insertable B-Layer' project (IBL), at a shorter timescale. In this paper, an introduction to the FE-I4 will be given, focusing on test results from the first full size FE-I4A prototype which has been available since fall 2010. The IBL project will be introduced, with particular emphasis on the FE-I4-based module concept.

  1. Planar pixel sensors in commercial CMOS technologies

    Energy Technology Data Exchange (ETDEWEB)

    Gonella, Laura; Hemperek, Tomasz; Huegging, Fabian; Krueger, Hans; Wermes, Norbert [Physikalisches Institut der Universitaet Bonn, Nussallee 12, 53115 Bonn (Germany); Macchiolo, Anna [Max-Planck-Institut fuer Physik, Foehringer Ring 6, 80805 Muenchen (Germany)

    2015-07-01

    For the upgrade of the ATLAS experiment at the high luminosity LHC, an all-silicon tracker is foreseen to cope with the increased rate and radiation levels. Pixel and strip detectors will have to cover an area of up to 200m2. To produce modules in high number at reduced costs, new sensor and bonding technologies have to be investigated. Commercial CMOS technologies on high resistive substrates can provide significant advantages in this direction. They offer cost effective, large volume sensor production. In addition to this, production is done on 8'' wafers allowing wafer-to-wafer bonding to the electronics, an interconnection technology substantially cheaper than the bump bonding process used for hybrid pixel detectors at the LHC. Both active and passive n-in-p pixel sensor prototypes have been submitted in a 150 nm CMOS technology on a 2kΩ cm substrate. The passive sensor design will be used to characterize sensor properties and to investigate wafer-to-wafer bonding technologies. This first prototype is made of a matrix of 36 x 16 pixels of size compatible with the FE-I4 readout chip (i.e. 50 μm x 250 μm). Results from lab characterization of this first submission are shown together with TCAD simulations. Work towards a full size FE-I4 sensor for wafer-to-wafer bonding is discussed.

  2. The pixelated detector

    CERN Multimedia

    Sutton, C

    1990-01-01

    "Collecting data as patterns of light or subatomic particles is vitally important in all the sciences. The new generation of solid-state detectors called pixel devices could transform experimental research at all levels" (4 pages).

  3. RD Collaboration Proposal: Development of pixel readout integrated circuits for extreme rate and radiation

    CERN Document Server

    Chistiansen, J (CERN)

    2013-01-01

    This proposal describes a new RD collaboration to develop the next genrration of hybrid pixel readout chips for use in ATLAS and CMS PHase 2 upgrades. extrapolation of hybrid pixel technology to the HL-LHC presents major challenges on several fronts. Challenges include: smaller pixels to resolve tracks in boosted jets, much higher hit rates (1-2 GHz/cm2 ), unprecedented radiation tolerance (10 MGy), much higher output bandwidth, and large IC format with low power consumption in order to instrument large areas while keeping the material budget low. This collaboration is specifically focused on design of hybrid pixel readout chips, and not on more general chip design or on other aspects of hybrid pixel technology. Participants include 7 institutes on ATLAS and 7 on CMS, plus 2 on both experiments.

  4. System Test Measurements with a DC-DC Conversion Powering Scheme for the CMS Tracker at SLHC

    CERN Document Server

    Sammet, Jan; Feld, Lutz

    2009-01-01

    A potential luminosity upgrade of the LHC, the so-called SLHC implies challenging upgrades for the experiments at the LHC. Concerning the upgrade of the CMS silicon strip tracker, the delivery of power isconsidered to be one of the major challenges. The higher instantaneous luminosity makes an increase ingranularity and complexity of the device inevitable. Both are expected to result in a power consumptioncomparable or even higher than the power consumption of today’s strip tracker. However, the space availablefor cables will remain the same. In addition, a further increase of the tracker material budget due to cablesand cooling is considered unacceptable, as the performance of the CMS detector must not be compromisedfor the upgrade. Novel powering schemes such as serial powering or the usage of DC-DC converters havebeen proposed to solve the problem. To test the second option, substructures of the current CMS siliconstrip tracker have been operated for the first time with off-the-shelf DC-DC buck convert...

  5. A 3D photograph with 92 million pixels for tagging particles

    CERN Multimedia

    Antonella Del Rosso

    2013-01-01

    Where was a given particle born? How can we tag it precisely enough to be able to then follow it along its track and through its decays? This is the job of the pixel detector installed at the heart of the ATLAS detector, only centimeters away from the LHC collisions. In order to improve its identification and tagging capabilities, the ATLAS collaboration has recently taken a big step towards the completion of the upgrade of its Pixel detector, which will include the insertion of a brand-new layer of 12 million pixels.   The 7 metre long beryllium beam pipe inserted in the carbon-fibre positioning tool is being prepared ready for the new innermost layer of the Pixel detector to be mounted. Photo: ATLAS Collaboration. With its three layers and 80 million channels concentrated in 2.2 square metres, the ATLAS pixel detector was already the world’s largest pixel-based system used in particle physics. Its excellent performance was instrumental in the discovery of the Higgs boson in July ...

  6. Diamond and silicon pixel detectors in high radiation environments

    Energy Technology Data Exchange (ETDEWEB)

    Tsung, Jieh-Wen

    2012-10-15

    Diamond pixel detector is a promising candidate for tracking of collider experiments because of the good radiation tolerance of diamond. The diamond pixel detector must withstand the radiation damage from 10{sup 16} particles per cm{sup 2}, which is the expected total fluence in High Luminosity Large Hadron Collider. The performance of diamond and silicon pixel detectors are evaluated in this research in terms of the signal-to-noise ratio (SNR). Single-crystal diamond pixel detectors with the most recent readout chip ATLAS FE-I4 are produced and characterized. Based on the results of the measurement, the SNR of diamond pixel detector is evaluated as a function of radiation fluence, and compared to that of planar-silicon ones. The deterioration of signal due to radiation damage is formulated using the mean free path of charge carriers in the sensor. The noise from the pixel readout circuit is simulated and calculated with leakage current and input capacitance to the amplifier as important parameters. The measured SNR shows good agreement with the calculated and simulated results, proving that the performance of diamond pixel detectors can exceed the silicon ones if the particle fluence is more than 10{sup 15} particles per cm{sup 2}.

  7. 3D silicon pixel sensors: Recent test beam results

    CERN Document Server

    Hansson, P; Sandaker, H; Korolkov, I; Barrera, C; Wermes, N; Borri, M; Grinstein, S; Troyano, I; Grenier, P; Devetak, E; Fleta, C; Kenney, C; Tsybychev, D; Nellist, C; Chmeissan, M; Su, D; DeWilde, B; Silverstein, D; Dorholt, O; Tsung, J; Sjoebaek, K; Stupak, J; Slaviec, T; Micelli, A; Helle, K; Bolle, E; Huegging, F; Kocian, M; Fazio, S; Balbuena, J; Dalla Betta, G F; La Rosa, A; Rivero, F; Mastroberardino, A; Hasi, J; Darbo, G; Boscardin, M; Da Via, C; Nordahl, P; Giordani, M; Jackson, P; Rohne, O; Gemme, C; Young, C

    2011-01-01

    The 3D silicon sensors aimed for the ATLAS pixel detector upgrade have been tested with a high energy pion beam at the CERN SPS in 2009. Two types of sensor layouts were tested: full-3D assemblies fabricated in Stanford, where the electrodes penetrate the entire silicon wafer thickness, and modified-3D assemblies fabricated at FBK-irst with partially overlapping electrodes. In both cases three read-out electrodes are ganged together to form pixels of dimension 50 x 400 mu m(2). Data on the pulse height distribution, tracking efficiency and resolution were collected for various particle incident angles, with and without a 1.6 T magnetic field. Data from a planar sensor of the type presently used in the ATLAS detector were used at the same time to give comparison. Published by Elsevier B.V.

  8. 3D silicon pixel sensors: Recent test beam results

    Energy Technology Data Exchange (ETDEWEB)

    Hansson, P., E-mail: phansson@cern.c [University of Oslo (Norway); Balbuena, J.; Barrera, C. [CNM Barcelona (Spain); Bolle, E. [University of Oslo (Norway); Borri, M. [Torino University (Italy); Boscardin, M. [FBK Trento (Italy); Chmeissan, M. [IFAE Barcelona (Spain); Dalla Betta, G.-F. [Universita di Trento and INFN Trento (Italy); Darbo, G. [INFN Genova (Italy); Da Via, C. [University of Manchester (United Kingdom); Devetak, E.; DeWilde, B. [Stony Brook University (United States); Su, D. [SLAC (United States); Dorholt, O. [University of Oslo (Norway); Fazio, S. [Calabria University (Italy); Fleta, C. [CNM Barcelona (Spain); Gemme, C. [INFN Genova (Italy); Giordani, M. [University of Udine and INFN Udine (Italy); Gjersdal, H. [University of Oslo (Norway); Grenier, P. [SLAC (United States)

    2011-02-01

    The 3D silicon sensors aimed for the ATLAS pixel detector upgrade have been tested with a high energy pion beam at the CERN SPS in 2009. Two types of sensor layouts were tested: full-3D assemblies fabricated in Stanford, where the electrodes penetrate the entire silicon wafer thickness, and modified-3D assemblies fabricated at FBK-irst with partially overlapping electrodes. In both cases three read-out electrodes are ganged together to form pixels of dimension 50x400{mu}m{sup 2}. Data on the pulse height distribution, tracking efficiency and resolution were collected for various particle incident angles, with and without a 1.6 T magnetic field. Data from a planar sensor of the type presently used in the ATLAS detector were used at the same time to give comparison.

  9. TCT and TFM measurements for ATLAS ITK

    CERN Document Server

    Dungs, Sascha

    2016-01-01

    The ATLAS ITK Pixel detector for the Phase-II upgrade of LHC is in a prototyping phase. The CERN ATLAS Pixel group is involved in different activities. One activity is the characterization of pixel sensors with an infrared Laser using a transient current technique (TCT) to measure the depletion depth and charge collection properties and compare it to effective field theory simulations. Another activity is the measurement of the Thermal Figure of Merit (TFM) of different stave prototypes using silicon heaters and an evaporative CO2 cooling system. This document describes the contributions to each of the two activities.

  10. ATLAS Fact Sheet : To raise awareness of the ATLAS detector and collaboration on the LHC

    CERN Multimedia

    ATLAS Outreach

    2010-01-01

    Facts on the Detector, Calorimeters, Muon System, Inner Detector, Pixel Detector, Semiconductor Tracker, Transition Radiation Tracker,, Surface hall, Cavern, Detector, Magnet system, Solenoid, Toroid, Event rates, Physics processes, Supersymmetric particles, Comparing LHC with Cosmic rays, Heavy ion collisions, Trigger and Data Acquisition TDAQ, Computing, the LHC and the ATLAS collaboration. This fact sheet also contains images of ATLAS and the collaboration as well as a short list of videos on ATLAS available for viewing.

  11. Ideas on DC-DC Converters for Delivery of Low Voltage and High Currents for the SLHC / ILC Detector Electronics in Magnetic field and Radiation environments

    CERN Document Server

    Dhawan, Satish; Neal, H; Sumner, R; Weber, M; Weber, R

    2007-01-01

    For more efficient power transport to the electronics embedded inside large colliding beam detectors, we explore the feasibility of supplying 48 Volts DC and using local DCDC conversion to 2 V (or lower, depending upon on the lithography of the embedded electronics) using switch mode regulators located very close to the front end electronics. These devices will be exposed to high radiation and high magnetic fields, 10 – 100 Mrads and 2 - 4 Tesla at the SLHC, and 20 Krads and 6 Tesla at the ILC.

  12. Multi-scale feature learning on pixels and super-pixels for seminal vesicles MRI segmentation

    Science.gov (United States)

    Gao, Qinquan; Asthana, Akshay; Tong, Tong; Rueckert, Daniel; Edwards, Philip "Eddie"

    2014-03-01

    We propose a learning-based approach to segment the seminal vesicles (SV) via random forest classifiers. The proposed discriminative approach relies on the decision forest using high-dimensional multi-scale context-aware spatial, textual and descriptor-based features at both pixel and super-pixel level. After affine transformation to a template space, the relevant high-dimensional multi-scale features are extracted and random forest classifiers are learned based on the masked region of the seminal vesicles from the most similar atlases. Using these classifiers, an intermediate probabilistic segmentation is obtained for the test images. Then, a graph-cut based refinement is applied to this intermediate probabilistic representation of each voxel to get the final segmentation. We apply this approach to segment the seminal vesicles from 30 MRI T2 training images of the prostate, which presents a particularly challenging segmentation task. The results show that the multi-scale approach and the augmentation of the pixel based features with the super-pixel based features enhances the discriminative power of the learnt classifier which leads to a better quality segmentation in some very difficult cases. The results are compared to the radiologist labeled ground truth using leave-one-out cross-validation. Overall, the Dice metric of 0:7249 and Hausdorff surface distance of 7:0803 mm are achieved for this difficult task.

  13. Pixel detector readout chip

    CERN Multimedia

    1991-01-01

    Close-up of a pixel detector readout chip. The photograph shows an aera of 1 mm x 2 mm containing 12 separate readout channels. The entire chip contains 1000 readout channels (around 80 000 transistors) covering a sensitive area of 8 mm x 5 mm. The chip has been mounted on a silicon detector to detect high energy particles.

  14. ALICE Silicon Pixel Detector

    CERN Multimedia

    Manzari, V

    2013-01-01

    The Silicon Pixel Detector (SPD) forms the innermost two layers of the 6-layer barrel Inner Tracking System (ITS). The SPD plays a key role in the determination of the position of the primary collision and in the reconstruction of the secondary vertices from particle decays.

  15. Pixel detector insertion

    CERN Multimedia

    CMS

    2015-01-01

    Insertion of the Pixel Tracker, the 66-million-channel device used to pinpoint the vertex of each colliding proton pair, located at the heart of the detector. The geometry of CMS is a cylinder lying on its side (22 meters long and 15 meters high in dia

  16. Beam test measurements with planar and 3D silicon strip detectors irradiated to sLHC fluences

    Energy Technology Data Exchange (ETDEWEB)

    Kohler, Michael; Wiik, Liv; /Freiburg U.; Bates, Richard; /Glasgow U.; Dalla Betta, Gian-Franco; /INFN, Trento /Trento U.; Fleta, Celeste; /Barcelona, Inst. Microelectron.; Harkonen, Jaakko; /Helsinki Inst. of Phys.; Jakobs, Karl; /Freiburg U.; Lozano, Manuel; /Barcelona, Inst. Microelectron.; Maenpaa, Teppo; Moilanen, Henri; /Helsinki Inst. of Phys.; Parkes, Chris; /Glasgow U. /Freiburg U. /Barcelona, Inst. Microelectron. /Fermilab

    2011-01-01

    The planned luminosity upgrade of the CERN LHC to the super LHC (sLHC) requires investigation of new radiation hard tracking detectors. Compared to the LHC, tracking detectors must withstand a 5-10 times higher radiation fluence. Promising radiation hard options are planar silicon detectors with n-side readout and silicon detectors in 3D technology, where columnar electrodes are etched into the silicon substrate. This article presents beam test measurements per formed with planar and 3D n-in-p silicon strip detectors. The detectors were irradiated to different fluences, where the maximum fluence was 3 x 10{sup 15} 1 MeV neutron equivalent particles per square centimeter (n{sub eq}/cm{sup 2}) for the planar detectors and 2 x 10{sup 15} n{sub eq}/cm{sup 2} for the 3D detectors. In addition to signal measurements, charge sharing and resolution of both detector technologies are compared. An increased signal from the irradiated 3D detectors at high bias voltages compared to the signal from the unirradiated detector indicates that charge multiplication effects occur in the 3D detectors. At a bias voltage of 260 V, the 3D detector irradiated to 2 x 10{sup 15} n{sub eq}/cm{sup 2} yields a signal almost twice as high as the signal of the unirradiated detector. Only 30% of the signal of an unirradiated detector could be measured with the planar detector irradiated to 3 x 10{sup 15} n{sub eq}/cm{sup 2} at a bias voltage of 600 V, which was the highest bias voltage applied to this sensor.

  17. Alpine Pixel Detector Layout

    CERN Document Server

    Delebecque, P; The ATLAS collaboration; Geffroy, N; Massol, N; Rambure, T; Todorov, T

    2013-01-01

    A description of an optimized layout of pixel sensors based on a stave that combines both barrel and endcap module orientations. The mechanical stiffness of the structure is provided by carbon fiber shells spaced by carbon foam. The cooling of the modules is provided by two-phase $CO_{2}$ flowing in a thin titanium pipe glued inside the carbon fiber foam. The electrical services of all modules are provided by a single stave flex. This layout eliminates the need for separate barrel and endcap detector structures, and therefore the barrel services material in front of the endcap. The transition from barrel to endcap module orientation is optimized separately for each layer in order to minimize the active pixel area and the traversed material. The sparse module spacing in the endcap part of the stave allows for multiple fixation points, and for a stiff overall structure composed only of staves interconnected by stiff disks.

  18. A method for precise charge reconstruction with pixel detectors using binary hit information

    CERN Document Server

    Pohl, David-Leon; Hemperek, Tomasz; Hügging, Fabian; Wermes, Norbert

    2014-01-01

    A method is presented to precisely reconstruct charge spectra with pixel detectors using binary hit information of individual pixels. The method is independent of the charge information provided by the readout circuitry and has a resolution mainly limited by the electronic noise. It relies on the ability to change the detection threshold in small steps while counting hits from a particle source. The errors are addressed and the performance of the method is shown based on measurements with the ATLAS pixel chip FE-I4 bump bonded to a 230 {\\mu}m 3D-silicon sensor. Charge spectra from radioactive sources and from electron beams are presented serving as examples. It is demonstrated that a charge resolution ({\\sigma}<200 e) close to the electronic noise of the ATLAS FE-I4 pixel chip can be achieved.

  19. Pixel front-end development in 65 nm CMOS technology

    CERN Document Server

    Havránek, M; Kishishita, T; Krüger, H; Wermes, N

    2014-01-01

    Luminosity upgrade of the LHC (HL-LHC) imposes severe constraints on the detector tracking systems in terms of radiation hardness and capability to cope with higher hit rates. One possible way of keeping track with increasing luminosity is the usage of more advanced technologies. Ultra deep sub-micron CMOS technologies allow a design of complex and high speed electronics with high integration density. In addition, these technologies are inherently radiation hard. We present a prototype of analog pixel front-end integrated circuit designed in 65 nm CMOS technology with applications oriented towards the ATLAS Pixel Detector upgrade. The aspects of ultra deep sub-micron design and performance of the analog pixel front-end circuits will be discussed.

  20. Digital Power Consumption Estimations for CHIPIX65 Pixel Readout Chip

    CERN Document Server

    Marcotulli, Andrea

    2016-01-01

    New hybrid pixel detectors with improved resolution capable of dealing with hit rates up to 3 GHz/cm2 will be required for future High Energy Physics experiments in the Large Hadron Collider (LHC) at CERN. Given this, the RD53 collaboration works on the design of the next generation pixel readout chip needed for both the ATLAS and CMS detector phase 2 pixel upgrades. For the RD53 demonstrator chip in 65nm CMOS technology, different architectures are considered. In particular the purpose of this work is estimating the power consumption of the digital architecture of the readout ASIC developed by CHIPIX65 project of the INFN National Scientific Committee. This has been done with modern chip design tools integrated with the VEPIX53 simulation framework that has been developed within the RD53 collaboration in order to assess the performance of the system in very high rate, high energy physics experiments.

  1. Studien für eine initiale Messung der Topquarkmasse mit ATLAS in dem Lepton+Jets $t\\overline{t}$ Zerfallskanal und Alignment der Pixel und SCT Teildetektoren

    CERN Document Server

    Härtel, Roland; Bethke, Siegfried

    2009-01-01

    The main topic of this thesis is a commissioning style top quark mass analysis using the ATLAS experiment at CERN. The analysis focusses on top quark pair decays in the lepton+jets decay channel. Only kinematic selection cuts and no b-tagging information is used for the event selection. This analysis is suitable for the commissioning phase of the ATLAS detector, with not yet final calibration and an incomplete understanding of the detector performance. Different methods for the reconstruction of the hadronic side of the top quark pair decays are studied and the effect of imposing the known W boson mass as constraint on the reconstruction is investigated. The analysis is modified in several ways to estimate the influence of systematic effects. The influence of the jet selection kinematics on the reconstructed top quark mass is studied, as well as the underlying jet algorithm definition and variations of the jet energy scale. The different jet algorithms under consideration are cone type and kT type algorithms ...

  2. Development of pixel readout integrated circuits for extreme rate and radiation

    CERN Multimedia

    Tomasek, L; Loddo, F; Liberali, V; Rizzi, A; Re, V; Minuti, M; Pangaud, P; Barbero, M B; Le dortz, O; Pacher, L; Kluit, R; Hinchliffe, I; Giubilato, P; Faccio, F; Pernegger, H; Krueger, H; Gensolen, F D; Prydderch, M L; Bilei, G M; Da rocha rolo, M D; Fanucci, L; Grillo, A A; Bellazzini, R; Manghisoni, M; Michelis, S; Huegging, F G; Kishishita, T; Marchiori, G; Christian, D C; Kaestli, H C; Meier, B; Key-charriere, M; Andreazza, A; Traversi, G; De canio, F; Linssen, L; Dannheim, D; Conti, E; Hemperek, T; Menouni, M; Fougeron, D; Genat, J; Bomben, M; Marzocca, C; Demaria, N; Mazza, G; Monteil, E; Van bakel, N A; Palla, F; Grippo, M T; Magazzu, G; Ratti, L; Abbaneo, D; Crescioli, F; Deptuch, G W; Neue, G; De robertis, G; Passeri, D; Placidi, P; Gromov, V; Morsani, F; Bisello, D; Paccagnella, A; Christiansen, J; Dho, E; Wermes, N; Rymaszewski, P; Rozanov, A; Wang, A; Lipton, R J; Havranek, M; Neviani, A; Karagounis, M; Godiot, S; Calderini, G; Seidel, S C; Horisberger, R P; Garcia-sciveres, M A; Stabile, A; Shojaii, S R; Beccherle, R; Bacchetta, N

    The present hybrid pixel detectors in operation at the LHC represent a major achievement. They deployed a new technology on an unprecedented scale and their success firmly established pixel tracking as indispensable for future HEP experiments. However, extrapolation of hybrid pixel technology to the HL-LHC presents major challenges on several fronts. We propose a new RD collaboration specifically focused on the development of pixel readout Integrated Circuits (IC). The IC challenges include: smaller pixels to resolve tracks in boosted jets, much higher hit rates (1-2 GHz/cm$^{2}$), unprecedented radiation tolerance (10 MGy), much higher output bandwidth, and large IC format with low power consumption in order to instrument large areas while keeping the material budget low. We propose a collaboration to design the next generation of hybrid pixel readout chips to enable the ATLAS and CMS Phase 2 pixel upgrades. This does not imply that ATLAS and CMS must use the same exact pixel readout chip, as most of the dev...

  3. EnviroAtlas - Dasymetric Population for the Conterminous United States

    Data.gov (United States)

    U.S. Environmental Protection Agency — This EnviroAtlas dataset intelligently reallocates 2010 population from census blocks to 30 meter pixels based on land cover and slope. This dataset was produced by...

  4. LAPAS: A SiGe Front End Prototype for the Upgraded ATLAS LAr Calorimeter

    CERN Document Server

    Dressnandt, N; Rescia, S; Vernon, E

    2009-01-01

    We have designed and fabricated a very low noise preamplifier and shaper to replace the existing ATLAS Liquid Argon readout for use at the Large Hadron Collider upgrade (sLHC). IBM’s 8WL 130nm SiGe process was chosen for it’s radiation tolerance, low noise bipolar NPN devices, wide voltage rand and potential use in other sLHC detector subsystems. Although the requirements for the final design can not be set at this time, the prototype was designed to accommodate a 16 bit dynamic range. This was accomplished by using a single stage, low noise, wide dynamic range preamp followed by a dual range shaper. The low noise of the preamp is made possible by the low base spreading resistance of the Silicon Germanium NPN bipolar transistors. The relatively high voltage rating of the NPN transistors is exploited to allow a gain of 650V/A in the preamplifier which eases the input voltage noise requirement on the shaper. Each shaper stage is designed as a cascaded differential operational amplifier doublet with a common...

  5. Pixelated neutron image plates

    Science.gov (United States)

    Schlapp, M.; Conrad, H.; von Seggern, H.

    2004-09-01

    Neutron image plates (NIPs) have found widespread application as neutron detectors for single-crystal and powder diffraction, small-angle scattering and tomography. After neutron exposure, the image plate can be read out by scanning with a laser. Commercially available NIPs consist of a powder mixture of BaFBr : Eu2+ and Gd2O3 dispersed in a polymer matrix and supported by a flexible polymer sheet. Since BaFBr : Eu2+ is an excellent x-ray storage phosphor, these NIPs are particularly sensitive to ggr-radiation, which is always present as a background radiation in neutron experiments. In this work we present results on NIPs consisting of KCl : Eu2+ and LiF that were fabricated into ceramic image plates in which the alkali halides act as a self-supporting matrix without the necessity for using a polymeric binder. An advantage of this type of NIP is the significantly reduced ggr-sensitivity. However, the much lower neutron absorption cross section of LiF compared with Gd2O3 demands a thicker image plate for obtaining comparable neutron absorption. The greater thickness of the NIP inevitably leads to a loss in spatial resolution of the image plate. However, this reduction in resolution can be restricted by a novel image plate concept in which a ceramic structure with square cells (referred to as a 'honeycomb') is embedded in the NIP, resulting in a pixelated image plate. In such a NIP the read-out light is confined to the particular illuminated pixel, decoupling the spatial resolution from the optical properties of the image plate material and morphology. In this work, a comparison of experimentally determined and simulated spatial resolutions of pixelated and unstructured image plates for a fixed read-out laser intensity is presented, as well as simulations of the properties of these NIPs at higher laser powers.

  6. The Kepler Pixel Response Function

    CERN Document Server

    Bryson, Stephen T; Jenkins, Jon M; Chandrasekaran, Hema; Klaus, Todd; Caldwell, Douglas A; Gilliland, Ronald L; Haas, Michael R; Dotson, Jessie L; Koch, David G; Borucki, William J

    2010-01-01

    Kepler seeks to detect sequences of transits of Earth-size exoplanets orbiting Solar-like stars. Such transit signals are on the order of 100 ppm. The high photometric precision demanded by Kepler requires detailed knowledge of how the Kepler pixels respond to starlight during a nominal observation. This information is provided by the Kepler pixel response function (PRF), defined as the composite of Kepler's optical point spread function, integrated spacecraft pointing jitter during a nominal cadence and other systematic effects. To provide sub-pixel resolution, the PRF is represented as a piecewise-continuous polynomial on a sub-pixel mesh. This continuous representation allows the prediction of a star's flux value on any pixel given the star's pixel position. The advantages and difficulties of this polynomial representation are discussed, including characterization of spatial variation in the PRF and the smoothing of discontinuities between sub-pixel polynomial patches. On-orbit super-resolution measurement...

  7. Design and Realisation of Integrated Circuits for the Readout of Pixel Sensors in High Energy Physics and Biomedical Imaging

    CERN Document Server

    Peric, Ivan

    2004-01-01

    Several application specific microchips (ASICs) for the readout of pixel detectors have been designed, tested and described in this thesis. The first chapter gives the detailed description of the pixel-readout chip for the ATLAS pixel detector (FEI). The chip is now in operation as the innermost electronic component of the ATLAS detector. The chip for steering of DEPFET matrix (SWITCHER) is described in the second chapter. The chip is implemented in a high-voltage CMOS technology, it generates fast high voltage signals. Finally, a novel pixel readout chip for a hybrid x-ray pixel detector based on direct conversion is introduced. The chip (CIX) has joint photon counting and integrating capability.

  8. Modelling semiconductor pixel detectors

    CERN Document Server

    Mathieson, K

    2001-01-01

    expected after 200 ps in most cases. The effect of reducing the charge carrier lifetime and examining the charge collection efficiency has been utilised to explore how these detectors would respond in a harsh radiation environment. It is predicted that over critical carrier lifetimes (10 ps to 0.1 ns) an improvement of 40 % over conventional detectors can be expected. This also has positive implications for fabricating detectors, in this geometry, from materials which might otherwise be considered substandard. An analysis of charge transport in CdZnTe pixel detectors has been performed. The analysis starts with simulation studies into the formation of contacts and their influence on the internal electric field of planar detectors. The models include a number of well known defect states and these are balanced to give an agreement with a typical experimental I-V curve. The charge transport study extends to the development of a method for studying the effect of charge sharing in highly pixellated detectors. The ...

  9. The ALICE pixel detector

    CERN Document Server

    Mercado Perez, J

    2002-01-01

    The present document is a brief summary of the performed activities during the 2001 Summer Student Programme at CERN under the Scientific Summer at Foreign Laboratories Program organized by the Particles and Fields Division of the Mexican Physical Society (Sociedad Mexicana de Fisica). In this case, the activities were related with the ALICE Pixel Group of the EP-AIT Division, under the supervision of Jeroen van Hunen, research fellow in this group. First, I give an introduction and overview to the ALICE experiment; followed by a description of wafer probing. A brief summary of the test beam that we had from July 13th to July 25th is given as well. (3 refs).

  10. Pixelated gamma detector

    Energy Technology Data Exchange (ETDEWEB)

    Dolinsky, Sergei Ivanovich; Yanoff, Brian David; Guida, Renato; Ivan, Adrian

    2016-12-27

    A pixelated gamma detector includes a scintillator column assembly having scintillator crystals and optical transparent elements alternating along a longitudinal axis, a collimator assembly having longitudinal walls separated by collimator septum, the collimator septum spaced apart to form collimator channels, the scintillator column assembly positioned adjacent to the collimator assembly so that the respective ones of the scintillator crystal are positioned adjacent to respective ones of the collimator channels, the respective ones of the optical transparent element are positioned adjacent to respective ones of the collimator septum, and a first photosensor and a second photosensor, the first and the second photosensor each connected to an opposing end of the scintillator column assembly. A system and a method for inspecting and/or detecting defects in an interior of an object are also disclosed.

  11. Planar Pixelations and Image Recognition

    CERN Document Server

    Rowekamp, Brandon

    2011-01-01

    Any subset of the plane can be approximated by a set of square pixels. This transition from a shape to its pixelation is rather brutal since it destroys geometric and topological information about the shape. Using a technique inspired by Morse Theory, we algorithmically produce a PL approximation of the original shape using only information from its pixelation. This approximation converges to the original shape in a very strong sense: as the size of the pixels goes to zero we can recover important geometric and topological invariants of the original shape such as Betti numbers, area, perimeter and curvature measures.

  12. Optimization of the thermal performances of the Alpine Pixel Detector

    CERN Document Server

    Zhang, Zhan; Di Ciaccio, Lucia

    The ATLAS (A Toroidal LHC ApparatuS) detector is the largest detector of the Large Hadron Collider (LHC). One of the most important goals of ATLAS was to search for the missing piece of the Standard Model, the Higgs boson that had been found in 2012. In order to keep looking for the unknowns, it is planned to upgrade the LHC. The High Luminosity LHC (HL-LHC) is a novel configuration of the accelerator, aiming at increasing the luminosity by a factor five or more above the nominal LHC design. In parallel with the accelerator upgrade also the ATLAS will be upgraded to cope with detector aging and to achieve the same or better performance under increased event rate and radiation dose expected at the HL-LHC. This thesis discusses a novel design for the ATLAS Pixel Detector called the "Alpine" layout for the HL-LHC. To support this design, a local support structure is proposed, optimized and tested with an advanced CO2 evaporative cooling system. A numerical program called “CoBra” simulating the twophase heat ...

  13. Development of radiation hard CMOS active pixel sensors for HL-LHC

    Energy Technology Data Exchange (ETDEWEB)

    Pernegger, Heinz, E-mail: heinz.pernegger@cern.ch

    2016-07-11

    New pixel detectors, based on commercial high voltage and/or high resistivity full CMOS processes, hold promise as next-generation active pixel sensors for inner and intermediate layers of the upgraded ATLAS tracker. The use of commercial CMOS processes allow cost-effective detector construction and simpler hybridisation techniques. The paper gives an overview of the results obtained on AMS-produced CMOS sensors coupled to the ATLAS Pixel FE-I4 readout chips. The SOI (silicon-on-insulator) produced sensors by XFAB hold great promise as radiation hard SOI-CMOS sensors due to their combination of partially depleted SOI transistors reducing back-gate effects. The test results include pre-/post-irradiation comparison, measurements of charge collection regions as well as test beam results.

  14. From Pixels to Planets

    Science.gov (United States)

    Brownston, Lee; Jenkins, Jon M.

    2015-01-01

    The Kepler Mission was launched in 2009 as NASAs first mission capable of finding Earth-size planets in the habitable zone of Sun-like stars. Its telescope consists of a 1.5-m primary mirror and a 0.95-m aperture. The 42 charge-coupled devices in its focal plane are read out every half hour, compressed, and then downlinked monthly. After four years, the second of four reaction wheels failed, ending the original mission. Back on earth, the Science Operations Center developed the Science Pipeline to analyze about 200,000 target stars in Keplers field of view, looking for evidence of periodic dimming suggesting that one or more planets had crossed the face of its host star. The Pipeline comprises several steps, from pixel-level calibration, through noise and artifact removal, to detection of transit-like signals and the construction of a suite of diagnostic tests to guard against false positives. The Kepler Science Pipeline consists of a pipeline infrastructure written in the Java programming language, which marshals data input to and output from MATLAB applications that are executed as external processes. The pipeline modules, which underwent continuous development and refinement even after data started arriving, employ several analytic techniques, many developed for the Kepler Project. Because of the large number of targets, the large amount of data per target and the complexity of the pipeline algorithms, the processing demands are daunting. Some pipeline modules require days to weeks to process all of their targets, even when run on NASA's 128-node Pleiades supercomputer. The software developers are still seeking ways to increase the throughput. To date, the Kepler project has discovered more than 4000 planetary candidates, of which more than 1000 have been independently confirmed or validated to be exoplanets. Funding for this mission is provided by NASAs Science Mission Directorate.

  15. Silicon sensor technologies for ATLAS IBL upgrade

    CERN Document Server

    Grenier, P; The ATLAS collaboration

    2011-01-01

    New pixel sensors are currently under development for ATLAS Upgrades. The first upgrade stage will consist in the construction of a new pixel layer that will be installed in the detector during the 2013 LHC shutdown. The new layer (Insertable-B-Layer, IBL) will be inserted between the inner most layer of the current pixel detector and the beam pipe at a radius of 3.2cm. The expected high radiation levels require the use of radiation hard technology for both the front-end chip and the sensor. Two different pixel sensor technologies are envisaged for the IBL. The sensor choice will occur in July 2011. One option is developed by the ATLAS Planar Pixel Sensor (PPS) Collaboration and is based on classical n-in-n planar silicon sensors which have been used for the ATLAS Pixel detector. For the IBL, two changes were required: The thickness was reduced from 250 um to 200 um to improve the radiation hardness. In addition, so-called "slim edges" were designed to reduce the inactive edge of the sensors from 1100 um to o...

  16. CMS upgrades for SLHC

    CERN Document Server

    Palla, Fabrizio

    2006-01-01

    I will discuss the impact of the LHC luminosity upgrade on CMS detector. While most of the CMS can possibly cope with the increased luminosity, the Tracker must undergo a major redesign in technology both in terms of detector substrates as well as in the data transfer links. I will show the impact on CMS of reduced bunch length and machine elements close to the interaction point.

  17. Design and realisation of integrated circuits for the readout of pixel sensors in high-energy physics and biomedical imaging

    Energy Technology Data Exchange (ETDEWEB)

    Peric, I.

    2004-08-01

    Radiation tolerant pixel-readout chip for the ATLAS pixel detector has been designed, implemented in a deep-submicron CMOS technology and successfully tested. The chip contains readout-channels with complex analog and digital circuits. Chip for steering of the DEPFET active-pixel matrix has been implemented in a high-voltage CMOS technology. The chip contains channels which generate fast sequences of high-voltage signals. Detector containing this chip has been successfully tested. Pixel-readout test chip for an X-ray imaging pixel sensor has been designed, implemented in a CMOS technology and tested. Pixel-readout channels are able to simultaneously count the signals generated by passage of individual photons and to sum the total charge generated during exposure time. (orig.)

  18. Bump bonding of pixel systems

    Energy Technology Data Exchange (ETDEWEB)

    Lozano, M. E-mail: manuel.lozano@cnm.es; Cabruja, E.; Collado, A.; Santander, J.; Ullan, M

    2001-11-01

    A pixel detector consists of an array of radiation sensing elements which is connected to an electronic read-out unit. Many different ways of making this connection between these two different devices are currently being used or considered to be used in the next future. Bonding techniques such as flip chip technology can present real advantages because they allow very fine pitch and a high number of I/Os. This paper presents a review of the different flip chip technologies available and their suitability for manufacturing pixel detectors. The particular problems concerning testing of pixel detectors and thermal issues related to them are pointed out.

  19. Bump bonding of pixel systems

    CERN Document Server

    Lozano, M; Collado, A; Santander, J; Ullán, M

    2001-01-01

    A pixel detector consists of an array of radiation sensing elements which is connected to an electronic read-out unit. Many different ways of making this connection between these two different devices are currently being used or considered to be used in the next future. Bonding techniques such as flip chip technology can present real advantages because they allow very fine pitch and a high number of I/Os. This paper presents a review of the different flip chip technologies available and their suitability for manufacturing pixel detectors. The particular problems concerning testing of pixel detectors and thermal issues related to them are pointed out.

  20. ATLAS IBL operational experience

    CERN Document Server

    Takubo, Yosuke; The ATLAS collaboration

    2016-01-01

    The Insertable B-Layer (IBL) is the inner most pixel layer in the ATLAS experiment, which was installed at 3.3 cm radius from the beam axis in 2014 to improve the tracking performance. To cope with the high radiation and hit occupancy due to proximity to the interaction point, a new read-out chip and two different silicon sensor technologies (planar and 3D) have been developed for the IBL. After the long shut-down period over 2013 and 2014, the ATLAS experiment started data-taking in May 2015 for Run-2 of the Large Hadron Collider (LHC). The IBL has been operated successfully since the beginning of Run-2 and shows excellent performance with the low dead module fraction, high data-taking efficiency and improved tracking capability. The experience and challenges in the operation of the IBL is described as well as its performance.

  1. ATLAS TV PROJECT

    CERN Multimedia

    2005-01-01

    CPPM Laboratory Marseille Starting with the Workshop- adding modules to the strip 00:09:19 Exterior-entering the lab site by car, Sascha Rosanov and a PR lady walking, Lab sign on building -Physique des Particules de Marseille 00:20:00 Interviews of the ATLAS pixel work for bio-mediacal research 00:34:00 Interview of Roy Aleksov, Head of CPPM Laboratory, Working in international team, working with CERN and GRID The rest of the film inclusdes lab testingand some exterior shots.

  2. Thin hybrid pixel assembly fabrication development with backside compensation layer

    Science.gov (United States)

    Bates, R.; Buttar, C.; McMullen, T.; Cunningham, L.; Ashby, J.; Doherty, F.; Pares, G.; Vignoud, L.; Kholti, B.; Vahanen, S.

    2017-02-01

    The ATLAS and CMS experiments will both replace their entire tracking systems for operation at the HL-LHC in 2026. This will include a significantly larger pixel systems, for example, for ATLAS approximately 15 m2. To keep the tracker material budget low it is crucial to minimize the mass of the pixel modules via thinning both the sensor and readout chip to about 150 μm each. The bump yield of thin module assemblies using solder based bump bonding can be problematic due to wafer bowing during solder reflow at high temperature. A new bump-bonding process using backside compensation on the readout chip to address the issue of low yield will be presented. The objective is to compensate dynamically the stress of the front side stack by adding a compensating layer to the backside of the wafer. A SiN and Al:Si stack has been chosen for the backside layer. The bow reducing effect of applying a backside compensation layer will be demonstrated using the FE-I4 wafer. The world's first results from assemblies produced from readout wafers thinned to 100 μm with a stress compensation layer are presented with bond yields close to 100% measured using the FE-I4 readout chip.

  3. Pre- and post-irradiation performance of FBK 3D silicon pixel detectors for CMS

    Energy Technology Data Exchange (ETDEWEB)

    Krzywda, A., E-mail: akrzywda@purdue.edu [Purdue University, Department of Physics and Astronomy, West Lafayette, IN 47907-2036 (United States); Alagoz, E.; Bubna, M. [Purdue University, Department of Physics and Astronomy, West Lafayette, IN 47907-2036 (United States); Obertino, M. [Università del Piemonte Orientale, Novara (Italy); INFN, Sezione di Torino, Torino (Italy); Solano, A. [Università di Torino, Torino (Italy); INFN, Sezione di Torino, Torino (Italy); Arndt, K. [Purdue University, Department of Physics and Astronomy, West Lafayette, IN 47907-2036 (United States); Uplegger, L. [Fermi National Accelerator Laboratory, Batavia, IL 60510-5011 (United States); Betta, G.F. Dalla [TIFPA INFN and Dipartimento di Ingegneria Industriale, Università di Trento, Via Sommarive 9, I-38123 Povo di Trento, TN (Italy); Boscardin, M. [Centro per Materiali e i Microsistemi Fondazione Bruno Kessler (FBK), Trento, Via Sommarive 18, I-38123 Povo di Trento, TN (Italy); Ngadiuba, J. [Università di Milano-Bicocca, Milan (Italy); Rivera, R. [Fermi National Accelerator Laboratory, Batavia, IL 60510-5011 (United States); Menasce, D.; Moroni, L.; Terzo, S. [Università di Milano-Bicocca, Milan (Italy); Bortoletto, D. [Purdue University, Department of Physics and Astronomy, West Lafayette, IN 47907-2036 (United States); Prosser, A.; Adreson, J.; Kwan, S. [Fermi National Accelerator Laboratory, Batavia, IL 60510-5011 (United States); Osipenkov, I. [Texas A and M University, Department of Physics, College Station, TX 77843 (United States); Bolla, G. [Purdue University, Department of Physics and Astronomy, West Lafayette, IN 47907-2036 (United States); and others

    2014-11-01

    In preparation for the tenfold luminosity upgrade of the Large Hadron Collider (the HL-LHC) around 2020, three-dimensional (3D) silicon pixel sensors are being developed as a radiation-hard candidate to replace the planar ones currently being used in the CMS pixel detector. This study examines an early batch of FBK sensors (named ATLAS08) of three 3D pixel geometries: 1E, 2E, and 4E, which respectively contain one, two, and four readout electrodes for each pixel, passing completely through the bulk. We present electrical characteristics and beam test performance results for each detector before and after irradiation. The maximum fluence applied is 3.5×10{sup 15} n {sub eq}/cm{sup 2}.

  4. Expected performance of the ATLAS Inner Tracker

    CERN Document Server

    Viel, Simon; The ATLAS collaboration

    2016-01-01

    These slides present the expected tracking performance of the ATLAS Inner Tracker, based on the latest available public results (scoping document). More recent layout designs currently under consideration are also shown. The extended inner pixel barrel concept is discussed in more detail, along with test beam results demonstrating the proof-of-principle.

  5. Anatomy atlases.

    Science.gov (United States)

    Rosse, C

    1999-01-01

    Anatomy atlases are unlike other knowledge sources in the health sciences in that they communicate knowledge through annotated images without the support of narrative text. An analysis of the knowledge component represented by images and the history of anatomy atlases suggest some distinctions that should be made between atlas and textbook illustrations. Textbook and atlas should synergistically promote the generation of a mental model of anatomy. The objective of such a model is to support anatomical reasoning and thereby replace memorization of anatomical facts. Criteria are suggested for selecting anatomy texts and atlases that complement one another, and the advantages and disadvantages of hard copy and computer-based anatomy atlases are considered.

  6. EnviroAtlas - Memphis, TN - Estimated Intersection Density of Walkable Roads

    Data.gov (United States)

    U.S. Environmental Protection Agency — This EnviroAtlas dataset estimates the intersection density of walkable roads within a 750 meter radius of any given 10 meter pixel in the community. Intersections...

  7. EnviroAtlas - Cleveland, OH - Estimated Intersection Density of Walkable Roads

    Data.gov (United States)

    U.S. Environmental Protection Agency — This EnviroAtlas dataset estimates the intersection density of walkable roads within a 750 meter radius of any given 10 meter pixel in the community. Intersections...

  8. EnviroAtlas - Fresno, CA - Estimated Intersection Density of Walkable Roads

    Data.gov (United States)

    U.S. Environmental Protection Agency — This EnviroAtlas dataset estimates the intersection density of walkable roads within a 750 meter radius of any given 10 meter pixel in the community. Intersections...

  9. EnviroAtlas - Green Bay, WI - Estimated Intersection Density of Walkable Roads

    Data.gov (United States)

    U.S. Environmental Protection Agency — This EnviroAtlas dataset estimates the intersection density of walkable roads within a 750 meter radius of any given 10 meter pixel in the community. Intersections...

  10. EnviroAtlas - Tampa, FL - Estimated Intersection Density of Walkable Roads

    Data.gov (United States)

    U.S. Environmental Protection Agency — This EnviroAtlas dataset estimates the intersection density of walkable roads within a 750 meter radius of any given 10 meter pixel in the community. Intersections...

  11. EnviroAtlas - Portland, ME - Estimated Intersection Density of Walkable Roads

    Data.gov (United States)

    U.S. Environmental Protection Agency — This EnviroAtlas dataset estimates the intersection density of walkable roads within a 750 meter radius of any given 10 meter pixel in the community. Intersections...

  12. EnviroAtlas - Paterson, NJ - Estimated Intersection Density of Walkable Roads

    Data.gov (United States)

    U.S. Environmental Protection Agency — This EnviroAtlas dataset estimates the intersection density of walkable roads within a 750 meter radius of any given 10 meter pixel in the community. Intersections...

  13. EnviroAtlas - Minneapolis/St. Paul, MN - Estimated Intersection Density of Walkable Roads

    Data.gov (United States)

    U.S. Environmental Protection Agency — This EnviroAtlas dataset estimates the intersection density of walkable roads within a 750 meter radius of any given 10 meter pixel in the community. Intersections...

  14. EnviroAtlas - New Bedford, MA - Estimated Intersection Density of Walkable Roads

    Data.gov (United States)

    U.S. Environmental Protection Agency — This EnviroAtlas dataset estimates the intersection density of walkable roads within a 750 meter radius of any given 10 meter pixel in the community. Intersections...

  15. EnviroAtlas - Pittsburgh, PA - Estimated Intersection Density of Walkable Roads

    Data.gov (United States)

    U.S. Environmental Protection Agency — This EnviroAtlas dataset estimates the intersection density of walkable roads within a 750 meter radius of any given 10 meter pixel in the community. Intersections...

  16. EnviroAtlas - New York, NY - Estimated Intersection Density of Walkable Roads

    Data.gov (United States)

    U.S. Environmental Protection Agency — This EnviroAtlas dataset estimates the intersection density of walkable roads within a 750 meter radius of any given 10 meter pixel in the community. Intersections...

  17. EnviroAtlas - Des Moines, IA - Estimated Intersection Density of Walkable Roads

    Data.gov (United States)

    U.S. Environmental Protection Agency — This EnviroAtlas dataset estimates the intersection density of walkable roads within a 750 meter radius of any given 10 meter pixel in the community. Intersections...

  18. EnviroAtlas - Austin, TX - Estimated Intersection Density of Walkable Roads

    Data.gov (United States)

    U.S. Environmental Protection Agency — This EnviroAtlas dataset estimates the intersection density of walkable roads within a 750 meter radius of any given 10 meter pixel in the community. Intersections...

  19. EnviroAtlas - Woodbine, IA - Estimated Intersection Density of Walkable Roads

    Data.gov (United States)

    U.S. Environmental Protection Agency — This EnviroAtlas dataset estimates the intersection density of walkable roads within a 750 meter radius of any given 10 meter pixel in the community. Intersections...

  20. EnviroAtlas - Milwaukee, WI - Estimated Intersection Density of Walkable Roads

    Data.gov (United States)

    U.S. Environmental Protection Agency — This EnviroAtlas dataset estimates the intersection density of walkable roads within a 750 meter radius of any given 10 meter pixel in the community. Intersections...

  1. EnviroAtlas - Portland, OR - Estimated Intersection Density of Walkable Roads

    Data.gov (United States)

    U.S. Environmental Protection Agency — This EnviroAtlas dataset estimates the intersection density of walkable roads within a 750 meter radius of any given 10 meter pixel in the community. Intersections...

  2. EnviroAtlas - Durham, NC - Estimated Intersection Density of Walkable Roads

    Data.gov (United States)

    U.S. Environmental Protection Agency — This EnviroAtlas dataset estimates the intersection density of walkable roads within a 750 meter radius of any given 10 meter pixel in the community. Intersections...

  3. EnviroAtlas - Phoenix, AZ - Estimated Intersection Density of Walkable Roads

    Data.gov (United States)

    U.S. Environmental Protection Agency — This EnviroAtlas dataset estimates the intersection density of walkable roads within a 750 meter radius of any given 10 meter pixel in the community. Intersections...

  4. Diamond Pixel Detectors and 3D Diamond Devices

    Science.gov (United States)

    Venturi, N.

    2016-12-01

    Results from detectors of poly-crystalline chemical vapour deposited (pCVD) diamond are presented. These include the first analysis of data of the ATLAS Diamond Beam Monitor (DBM). The DBM module consists of pCVD diamond sensors instrumented with pixellated FE-I4 front-end electronics. Six diamond telescopes, each with three modules, are placed symmetrically around the ATLAS interaction point. The DBM tracking capabilities allow it to discriminate between particles coming from the interaction point and background particles passing through the ATLAS detector. Also, analysis of test beam data of pCVD DBM modules are presented. A new low threshold tuning algorithm based on noise occupancy was developed which increases the DBM module signal to noise ratio significantly. Finally first results from prototypes of a novel detector using pCVD diamond and resistive electrodes in the bulk, forming a 3D diamond device, are discussed. 3D devices based on pCVD diamond were successfully tested with test beams at CERN. The measured charge is compared to that of a strip detector mounted on the same pCVD diamond showing that the 3D device collects significantly more charge than the planar device.

  5. The ATLAS Beam Condition Monitor Commissioning

    CERN Document Server

    Gorisek, A

    2008-01-01

    The ATLAS Beam Condition Monitor (BCM) based on radiation hard pCVD diamond sensors and event-by-event measurements of environment close to interaction point (z=±184 cm, r=5.5 cm) has been installed in the Pixel detector since early 2008 and together with the Pixel detector in the ATLAS cavern since June 2008. The sensors and front end electronics were shown to withstand 50 Mrad and 1015 particles/cm2 expected in LHC lifetime. Recently the full readout chain, partly made of radiation tolerant electronics, still inside of the ATLAS spectrometer and partly in the electronics room, was completed and the system was operated in time of the first LHC single beams and is ready now for the first collisions which will follow after the LHC repair.

  6. Virtual Visit to the ATLAS Control Room by the Genova University

    CERN Multimedia

    2013-01-01

    The ATLAS Virtual Visit is included in the program of the Course in Particle and Nuclear Experimental Physics at the Physics Department of the Genova University. Students are introduced to experimental techniques and instrumentation and run few experiences in the laboratory. Besides that, they visit the Department groups that are involved both in Nuclear or High Energy Particle physics experiments. In this context, the ATLAS team will open them the doors to laboratory where ~1/3 of the Pixel detector has been built and where we are currently assembling and qualifying part of the electrical services and modules for the Insertable B layer (IBL) that will be installed in 2014 in ATLAS. Students will be introduced to LHC, ATLAS and the physics program before having the possibility to meet ATLAS physicists in ATLAS control room. http://atlas-live-virtual-visit.web.cern.ch/atlas-live-virtual-visit/2013/Genova-2013_1.html

  7. Virtual Visit to the ATLAS Control Room by the University of Genova

    CERN Multimedia

    ATLAS Experiment

    2012-01-01

    The ATLAS Virtual Visit is included in the program of the Course in Particle and Nuclear Experimental Physics at the Physics Department of the Genova University. Students are introduced to experimental techniques and instrumentation and run few experiences in the laboratory. Besides that, they visit the Department groups that are involved both in Nuclear or High Energy Particle physics experiments. In this context, the ATLAS team will open them the doors to laboratory where ~1/3 of the Pixel detector has been built and where we are currently assembling and qualifying part of the electrical services and modules for the Insertable B layer (IBL) that will be installed in 2014 in ATLAS. Students will be introduced to LHC, ATLAS and the physics program before having the possibility to meet ATLAS physicists in ATLAS control room. http://atlas-live-virtual-visit.web.cern.ch/atlas-live-virtual-visit/2012/Genova-2012.html

  8. Virtual Visit to the ATLAS Control Room by the Genova University

    CERN Multimedia

    2013-01-01

    The ATLAS Virtual Visit is included in the program of the Course in Particle and Nuclear Experimental Physics at the Physics Department of the Genova University. Students are introduced to experimental techniques and instrumentation and run few experiences in the laboratory. Besides that, they visit the Department groups that are involved both in Nuclear or High Energy Particle physics experiments. In this context, the ATLAS team will open them the doors to laboratory where ~1/3 of the Pixel detector has been built and where we are currently assembling and qualifying part of the electrical services and modules for the Insertable B layer (IBL) that will be installed in 2014 in ATLAS. Students will be introduced to LHC, ATLAS and the physics program before having the possibility to meet ATLAS physicists in ATLAS control room. http://atlas-live-virtual-visit.web.cern.ch/atlas-live-virtual-visit/2013/Genova-2013_2.html

  9. SNOWMASS WHITE PAPER - SLHC Endcap 1.4

    CERN Document Server

    Bilki, Burak; Winn, David R; Yetkin, Taylan

    2013-01-01

    Radiation damage in the plastic scintillator and/or readout WLS fibers in the HE endcap calorimeter 1.4SLHC will require remediation after 2018. We describe one alternative using the existing brass absorber in the Endcap calorimeter, to replace the plastic scintillator tiles with BaF2 tiles, or quartz tiles coated with thin(1-5 micron) films of radiation-hard pTerphenyl(pTP) or the fast phosphor ZnO:Ga. These tiles would be read-out by easily replaceable arrays of straight, parallel WLS fibers coupled to clear plastic-cladded quartz fibers of proven radiation resistance. We describe a second alternative with a new absorber matrix extending to 1.4

  10. Development of active edge pixel sensors and four-side buttable modules using vertical integration technologies

    CERN Document Server

    INSPIRE-00219560; Moser, H.-G.; Nisius, R.; Richter, R.H.; Terzo, S.; Weigell, P.

    2014-01-01

    We present an R&D activity focused on the development of novel modules for the upgrade of the ATLAS pixel system at the High Luminosity LHC (HL-LHC). The modules consist of n-in-p pixel sensors, 100 or 200 $\\mu$m thick, produced at VTT (Finland) with an active edge technology, which considerably reduces the dead area at the periphery of the device. The sensors are interconnected with solder bump-bonding to the ATLAS FE-I3 and FE-I4 read-out chips, and characterized with radioactive sources and beam tests at the CERN-SPS and DESY. The results of these measurements will be discussed for devices before and after irradiation up to a fluence of $5\\times 10^{15}$ \

  11. Characterization of proton irradiated 3D-DDTC pixel sensor prototypes fabricated at FBK

    Energy Technology Data Exchange (ETDEWEB)

    La Rosa, A., E-mail: alessandro.larosa@cern.ch [CERN, Geneva 23, CH-1211 (Switzerland); Boscardin, M. [Fondazione Bruno Kessler, FBK-CMM, Via Sommarive 18, I-38123 Trento (Italy); Cobal, M. [Universita degli Studi di Udine and INFN Trieste, Gruppo Collegato di Udine, Via delle Scienze 208, I-33100 Udine (Italy); Dalla Betta, G.-F. [DISI, Universita degli Studi di Trento and INFN Padova, Gruppo Collegato d Trento, Via Sommarive 14, I-38123 Trento (Italy); Da Via, C. [School of Physics and Astronomy, University of Manchester, Oxford Road, Manchester M13 9PL (United Kingdom); Darbo, G. [INFN Sezione di Genova, Via Dodecaneso 33, I-14146 Genova (Italy); Gallrapp, C. [CERN, Geneva 23, CH-1211 (Switzerland); Gemme, C. [INFN Sezione di Genova, Via Dodecaneso 33, I-14146 Genova (Italy); Huegging, F.; Janssen, J. [Physikalisches Institut, Universitaet Bonn, Nussallee 12, D-53115 Bonn (Germany); Micelli, A. [Universita degli Studi di Udine and INFN Trieste, Gruppo Collegato di Udine, Via delle Scienze 208, I-33100 Udine (Italy); Pernegger, H. [CERN, Geneva 23, CH-1211 (Switzerland); Povoli, M. [DISI, Universita degli Studi di Trento and INFN Padova, Gruppo Collegato d Trento, Via Sommarive 14, I-38123 Trento (Italy); Wermes, N. [Physikalisches Institut, Universitaet Bonn, Nussallee 12, D-53115 Bonn (Germany); Zorzi, N. [Fondazione Bruno Kessler, FBK-CMM, Via Sommarive 18, I-38123 Trento (Italy)

    2012-07-21

    In this paper we discuss results relevant to 3D Double-Side Double Type Column (3D-DDTC) pixel sensors fabricated at FBK (Trento, Italy) and oriented to the ATLAS upgrade. Some assemblies of these sensors featuring different columnar electrode configurations (2, 3, or 4 columns per pixel) and coupled to the ATLAS FEI3 read-out chip were irradiated up to large proton fluences and tested in laboratory with radioactive sources. In spite of the non-optimized columnar electrode overlap, sensors exhibit reasonably good charge collection properties up to an irradiation fluence of 2 Multiplication-Sign 10{sup 15}n{sub eq}cm{sup -2}, while requiring bias voltages in the order of 100 V. Sensor operation is further investigated by means of TCAD simulations which can effectively explain the basic mechanisms responsible for charge loss after irradiation.

  12. Characterization of proton irradiated 3D-DDTC pixel sensor prototypes fabricated at FBK

    CERN Document Server

    La Rosa, A; Cobal, M; Betta, G -F Dalla; Da Via, C; Darbo, G; Gallrapp, C; Gemme, C; Huegging, F; Janssen, J; Micelli, A; Pernegger, H; Povoli, M; Wermes, N; Zorzi, N

    2012-01-01

    In this paper we discuss results relevant to 3D Double-Side Double Type Column (3D-DDTC) pixel sensors fabricated at FBK (Trento, Italy) and oriented to the ATLAS upgrade. Some assemblies of these sensors featuring different columnar electrode configurations (2, 3, or 4 columns per pixel) and coupled to the ATLAS FEI3 read-out chip were irradiated up to large proton fluences and tested in laboratory with radioactive sources. In spite of the non optimized columnar electrode overlap, sensors exhibit reasonably good charge collection properties up to an irradiation fluence of 2 x 10**15 neq/cm2, while requiring bias voltages in the order of 100 V. Sensor operation is further investigated by means of TCAD simulations which can effectively explain the basic mechanisms responsible for charge loss after irradiation.

  13. Functional characterization of irradiated 3D-DDTC pixel sensor prototypes fabricated at FBK

    CERN Document Server

    La Rosa, A; Cobal, M; Da Viá, C; Betta, G F Dalla; Darbo, G; Gallrapp, C; Gemme, C; Huegging, F; Janssen, J; Micelli, A; Pernegger, H; Povoli, M; Wermes, N; Zorzi, N

    2011-01-01

    In this paper we discuss results relevant to 3D Double-Side Double Type Column (3D-DDTC) pixel sensors fabricated at FBK (Trento, Italy) and oriented to the ATLAS upgrade. Several assemblies of these sensors featuring various columnar electrode configurations (2, 3, or 4 columns per pixel) and coupled to the ATLAS FE-I3 read-out chip were irradiated up to large particle fluences and tested in laboratory with radioactive sources. In spite of the non optimized columnar electrode overlap, sensors exhibit reasonably good charge collection properties up to an irradiation fluence of 2 10**15 neq/cm2 while requiring bias voltages of at most 160V. Sensor operation is further investigated by means of TCAD simulations which can effectively explain the basic mechanisms responsible for charge loss after irradiation.

  14. WFC3 Pixel Area Maps

    Science.gov (United States)

    Kalirai, J. S.; Cox, C.; Dressel, L.; Fruchter, A.; Hack, W.; Kozhurina-Platais, V.; Mack, J.

    2010-04-01

    We present the pixel area maps (PAMs) for the WFC3/UVIS and WFC3/IR detectors, and discuss the normalization of these images. HST processed flt images suffer from geometric distortion and therefore have pixel areas that vary on the sky. The counts (electrons) measured for a source on these images depends on the position of the source on the detector, an effect that is implicitly corrected when these images are multidrizzled into drz files. The flt images can be multiplied by the PAMs to yield correct and uniform counts for a given source irrespective of its location on the image. To ensure consistency between the count rate measured for sources in drz images and near the center of flt images, we set the normalization of the PAMs to unity at a reference pixel near the center of the UVIS mosaic and IR detector, and set the SCALE in the IDCTAB equal to the square root of the area of this reference pixel. The implications of this choice for photometric measurements are discussed.

  15. VNR CMS Pixel detector replacement

    CERN Multimedia

    2017-01-01

    Joel Butler, spokesperson of the CMS collaboration explains how a team from many different partner institutes installed a new detector in CMS. This detector is the silicon pixel detector and they’ve been working on it for about five years, to replace one of our existing detectors. This detectors measures particles closer to the beam than any of the other components of this huge detector behind me. It gives us the most precise picture of tracks as they come out of the collisions and expand and travel through the detector. This particular device has twice as many pixels, 120 million, as opposed to about 68 million in the old detector and it can take data faster and pump it out to the analysis more quickly. 00’53’’ Images of the descent, insertion and installation of first piece of the Pixel detector on Tue Feb 28. Images of the descent, insertion and installation of second piece of the Pixel and the two cylinders being joined.

  16. Serial powering Proof of principle demonstration of a scheme for the operation of a large pixel detector at the LHC

    CERN Document Server

    Ta, D B; Hugging, F; Fischer, P; Grosse-Knetter, J; Runólfsson, O; Wermes, N

    2006-01-01

    Large detectors in high-energy physics experiments are mostly built from many identical individual building blocks, called modules, which possess individual parts of the services. The modules are usually also powered by parallel power lines such that they can be individually operated. The main disadvantage of such a parallel powering scheme is the vast amount of necessary power cables which constitutes also a large amount of material in the path of the particles to be detected. For the LHC experiments already now this is a major problem for the optimal performance of the detectors and it has become evident, that for an upgrade programme alternative powering schemes must be investigated. We prove and demonstrate here for the example of the large scale pixel detector of ATLAS that Serial Powering of pixel modules is a viable alternative. A powering scheme using dedicated voltage regulators and modified flex hybrid circuits has been devised and implemented for ATLAS pixel modules. The modules have been intensive...

  17. Heavily Irradiated N-in-p Thin Planar Pixel Sensors with and without Active Edges

    CERN Document Server

    Terzo, S; Macchiolo, A; Moser, H G; Nisius, R; Richter, R H; Weigell, P

    2014-01-01

    We present the results of the characterization of silicon pixel modules employing n-in-p planar sensors with an active thickness of 150 $\\mathrm{\\mu}$m, produced at MPP/HLL, and 100-200 $\\mathrm{\\mu}$m thin active edge sensor devices, produced at VTT in Finland. These thin sensors are designed as candidates for the ATLAS pixel detector upgrade to be operated at the HL-LHC, as they ensure radiation hardness at high fluences. They are interconnected to the ATLAS FE-I3 and FE-I4 read-out chips. Moreover, the n-in-p technology only requires a single side processing and thereby it is a cost-effective alternative to the n-in-n pixel technology presently employed in the LHC experiments. High precision beam test measurements of the hit efficiency have been performed on these devices both at the CERN SpS and at DESY, Hamburg. We studied the behavior of these sensors at different bias voltages and different beam incident angles up to the maximum one expected for the new Insertable B-Layer of ATLAS and for HL-LHC detect...

  18. Expected performance of the ATLAS Inner Tracker upgrade

    CERN Document Server

    Viel, Simon; The ATLAS collaboration

    2016-01-01

    The design of the ATLAS Inner Tracker upgrade is underway. This tracking detector, consisting of silicon pixel and strip modules, will replace the current ATLAS Inner Detector to reconstruct tracks from charged particles produced at the very high collision rate expected from the High-Luminosity Large Hadron Collider. The latest Inner Tracker designs considered, and the most recent expected performance results from simulation are presented.

  19. The alignment of the ATLAS Inner Detector in Run 2

    CERN Document Server

    Ripellino, Giulia; The ATLAS collaboration

    2016-01-01

    The ATLAS reconstruction of charged particle trajectories relies on the Inner Detector tracking system. The accuracy of the reconstruction is limited by the finite resolution of the detector elements and the imperfect knowledge about their positions. A precise alignment of the detector is therefore essential. Here, the strategy and the status of the Inner Detector alignment in ATLAS during the LHC Run 2 are presented and the alignment challenges related to the distortion of the new innermost Pixel layer, the IBL, are discussed.

  20. Thin hybrid pixel assembly with backside compensation layer on ROIC

    Science.gov (United States)

    Bates, R.; Buttar, C.; McMullen, T.; Cunningham, L.; Ashby, J.; Doherty, F.; Gray, C.; Pares, G.; Vignoud, L.; Kholti, B.; Vahanen, S.

    2017-01-01

    The entire ATLAS inner tracking system will be replaced for operation at the HL-LHC . This will include a significantly larger pixel detector of approximately 15 m2. For this project, it is critical to reduce the mass of the hybrid pixel modules and this requires thinning both the sensor and readout chips to about 150 micrometres each. The thinning of the silicon chips leads to low bump yield for SnAg bumps due to bad co-planarity of the two chips at the solder reflow stage creating dead zones within the pixel array. In the case of the ATLAS FEI4 pixel readout chip thinned to 100 micrometres, the chip is concave, with the front side in compression, with a bow of +100 micrometres at room temperature which varies to a bow of -175 micrometres at the SnAg solder reflow temperature, caused by the CTE mismatch between the materials in the CMOS stack and the silicon substrate. A new wafer level process to address the issue of low bump yield be controlling the chip bow has been developed. A back-side dielectric and metal stack of SiN and Al:Si has been deposited on the readout chip wafer to dynamically compensate the stress of the front side stack. In keeping with a 3D process the materials used are compatible with Through Silicon Via (TSV) technology with a TSV last approach which is under development for this chip. It is demonstrated that the amplitude of the correction can be manipulated by the deposition conditions and thickness of the SiN/Al:Si stack. The bow magnitude over the temperature range for the best sample to date is reduced by almost a factor of 4 and the sign of the bow (shape of the die) remains constant. Further development of the backside deposition conditions is on-going with the target of close to zero bow at the solder reflow temperature and a minimal bow magnitude throughout the temperature range. Assemblies produced from FEI4 readout wafers thinned to 100 micrometres with the backside compensation layer have been made for the first time and

  1. 3D silicon pixel detectors for the High-Luminosity LHC

    CERN Document Server

    Lange, J.

    2016-01-01

    3D silicon pixel detectors have been investigated as radiation-hard candidates for the innermost layers of the HL-LHC upgrade of the ATLAS pixel detector. 3D detectors are already in use today in the ATLAS IBL and AFP experiments. These are based on 50x250 um2 large pixels connected to the FE-I4 readout chip. Detectors of this generation were irradiated to HL-LHC fluences and demonstrated excellent radiation hardness with operational voltages as low as 180 V and power dissipation of 12--15 mW/cm2 at a fluence of about 1e16 neq/cm2, measured at -25 degree C. Moreover, to cope with the higher occupancies expected at the HL-LHC, a first run of a new generation of 3D detectors designed for the HL-LHC was produced at CNM with small pixel sizes of 50x50 and 25x100 um2, matched to the FE-I4 chip. They demonstrated a good performance in the laboratory and in beam tests with hit efficiencies of about 97% at already 1--2V before irradiation.

  2. Testbeam results of irradiated ams H18 HV-CMOS pixel sensor prototypes

    CERN Document Server

    INSPIRE-00211411; Braccini, S.; Casse, G.; Chen, H.; Chen, K.; Di Bello, F.A.; Ferrere, D.; Golling, T.; Gonzalez-Sevilla, S.; Iacobucci, G.; Kiehn, M.; Lanni, F.; Liu, H.; Meng, L.; Merlassino, C.; Miucci, A.; Muenstermann, D.; Nessi, M.; Okawa, H.; Peric, I.; Rimoldi, M.; Ristic, B.; Vicente Barrero Pinto, M.; Vossebeld, J.; Weber, M.; Weston, T.; Wu, W.; Xu, L.; Zaffaroni, E.

    2016-01-01

    HV-CMOS pixel sensors are a promising option for the tracker upgrade of the ATLAS experiment at the LHC, as well as for other future tracking applications in which large areas are to be instrumented with radiation-tolerant silicon pixel sensors. We present results of testbeam characterisations of the $4^{\\mathrm{th}}$ generation of Capacitively Coupled Pixel Detectors (CCPDv4) produced with the ams H18 HV-CMOS process that have been irradiated with different particles (reactor neutrons and 18 MeV protons) to fluences between $1\\cdot 10^{14}$ and $5\\cdot 10^{15}$ 1-MeV-n$_\\textrm{eq}$/cm$^2$. The sensors were glued to ATLAS FE-I4 pixel readout chips and measured at the CERN SPS H8 beamline using the FE-I4 beam telescope. Results for all fluences are very encouraging with all hit efficiencies being better than 97% for bias voltages of $85\\,$V. The sample irradiated to a fluence of $1\\cdot 10^{15}$ n$_\\textrm{eq}$/cm$^2$ - a relevant value for a large volume of the upgraded tracker - exhibited 99.7% average hit ...

  3. 3D silicon pixel detectors for the High-Luminosity LHC

    Science.gov (United States)

    Lange, J.; Carulla Areste, M.; Cavallaro, E.; Förster, F.; Grinstein, S.; López Paz, I.; Manna, M.; Pellegrini, G.; Quirion, D.; Terzo, S.; Vázquez Furelos, D.

    2016-11-01

    3D silicon pixel detectors have been investigated as radiation-hard candidates for the innermost layers of the HL-LHC upgrade of the ATLAS pixel detector. 3D detectors are already in use today in the ATLAS IBL and AFP experiments. These are based on 50 × 250 μm2 large pixels connected to the FE-I4 readout chip. Detectors of this generation were irradiated to HL-LHC fluences and demonstrated excellent radiation hardness with operational voltages as low as 180 V and power dissipation of 12-15 mW/cm2 at a fluence of about 1016 neq/cm2, measured at -25°C. Moreover, to cope with the higher occupancies expected at the HL-LHC, a first run of a new generation of 3D detectors designed for the HL-LHC was produced at CNM with small pixel sizes of 50 × 50 and 25 × 100 μm2, matched to the FE-I4 chip. They demonstrated a good performance in the laboratory and in beam tests with hit efficiencies of about 97% at already 1-2 V before irradiation.

  4. SAR Image Complex Pixel Representations

    Energy Technology Data Exchange (ETDEWEB)

    Doerry, Armin W. [Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)

    2015-03-01

    Complex pixel values for Synthetic Aperture Radar (SAR) images of uniform distributed clutter can be represented as either real/imaginary (also known as I/Q) values, or as Magnitude/Phase values. Generally, these component values are integers with limited number of bits. For clutter energy well below full-scale, Magnitude/Phase offers lower quantization noise than I/Q representation. Further improvement can be had with companding of the Magnitude value.

  5. The INFN-FBK pixel R&D program for HL-LHC

    Science.gov (United States)

    Meschini, M.; Dalla Betta, G. F.; Boscardin, M.; Calderini, G.; Darbo, G.; Giacomini, G.; Messineo, A.; Ronchin, S.

    2016-09-01

    We report on the ATLAS and CMS joint research activity, which is aiming at the development of new, thin silicon pixel detectors for the Large Hadron Collider Phase-2 detector upgrades. This R&D is performed under special agreement between Istituto Nazionale di Fisica Nucleare and FBK foundation (Trento, Italy). New generations of 3D and planar pixel sensors with active edges are being developed in the R&D project, and will be fabricated at FBK. A first planar pixel batch, which was produced by the end of year 2014, will be described in this paper. First clean room measurement results on planar sensors obtained before and after neutron irradiation will be presented.

  6. The INFN-FBK pixel R&D program for HL-LHC

    Energy Technology Data Exchange (ETDEWEB)

    Meschini, M., E-mail: marco.meschini@cern.ch [INFN Sezione di Firenze, Sesto Fiorentino (Italy); Dalla Betta, G.F. [Università di Trento, Dipartimento di Ingegneria Industriale, Trento (Italy); TIFPA INFN, Trento (Italy); Boscardin, M. [Fondazione Bruno Kessler (FBK), Trento (Italy); TIFPA INFN, Trento (Italy); Calderini, G. [Laboratoire de Physique Nucleaire et de Hautes Énergies (LPNHE), Paris (France); Darbo, G. [INFN Sezione di Genova, Genova (Italy); Giacomini, G. [Fondazione Bruno Kessler (FBK), Trento (Italy); Messineo, A. [Università di Pisa, Dipartimento di Fisica, Pisa (Italy); INFN, Pisa (Italy); Ronchin, S. [Fondazione Bruno Kessler (FBK), Trento (Italy)

    2016-09-21

    We report on the ATLAS and CMS joint research activity, which is aiming at the development of new, thin silicon pixel detectors for the Large Hadron Collider Phase-2 detector upgrades. This R&D is performed under special agreement between Istituto Nazionale di Fisica Nucleare and FBK foundation (Trento, Italy). New generations of 3D and planar pixel sensors with active edges are being developed in the R&D project, and will be fabricated at FBK. A first planar pixel batch, which was produced by the end of year 2014, will be described in this paper. First clean room measurement results on planar sensors obtained before and after neutron irradiation will be presented.

  7. CMOS digital pixel sensors: technology and applications

    Science.gov (United States)

    Skorka, Orit; Joseph, Dileepan

    2014-04-01

    CMOS active pixel sensor technology, which is widely used these days for digital imaging, is based on analog pixels. Transition to digital pixel sensors can boost signal-to-noise ratios and enhance image quality, but can increase pixel area to dimensions that are impractical for the high-volume market of consumer electronic devices. There are two main approaches to digital pixel design. The first uses digitization methods that largely rely on photodetector properties and so are unique to imaging. The second is based on adaptation of a classical analog-to-digital converter (ADC) for in-pixel data conversion. Imaging systems for medical, industrial, and security applications are emerging lower-volume markets that can benefit from these in-pixel ADCs. With these applications, larger pixels are typically acceptable, and imaging may be done in invisible spectral bands.

  8. Overview of the ATLAS Insertable B-Layer (IBL) Project

    CERN Document Server

    Djama, F; The ATLAS collaboration

    2012-01-01

    The upgrades for the ATLAS Pixel Detector will be staged in preparation for high luminosity LHC. The first upgrade for the Pixel Detector will be the construction of a new pixel layer which will be installed during the first shutdown of the LHC machine, foreseen in 2013-14. The new detector, called the Insertable B-layer (IBL), will be installed between the existing Pixel Detector and a new, smaller radius beam-pipe at a radius of 3.3 cm. The IBL will require the development of several new technologies to cope with increased radiation and pixel occupancy and also to improve the physics performance through reduction of the pixel size and a more stringent material budget. Two different and promising silicon sensor technologies, planar n-in-n and 3D, are currently under investigation for the IBL. An overview of the IBL project, of the module design and qualification with particular emphasis on irradiation tests will be presented.

  9. Overview of the ATLAS Insertable B-Layer (IBL) Project

    CERN Document Server

    Kagan, M; The ATLAS collaboration

    2013-01-01

    The upgrades for the ATLAS Pixel Detector will be staged in preparation for high luminosity LHC. The first upgrade for the Pixel Detector will be the construction of a new pixel layer which is currently under construction and will be installed during the first shutdown of the LHC machine, in 2013-14. The new detector, called the Insertable B-layer (IBL), will be installed between the existing Pixel Detector and a new, smaller radius beam-pipe at a radius of 3.3 cm. The IBL required the development of several new technologies to cope with increased radiation and pixel occupancy and also to improve the physics performance through reduction of the pixel size and a more stringent material budget. Two different silicon sensor technologies, planar n-in-n and 3D, will be used, connected with the new generation 130nm IBM CMOS FE-I4 readout chip via solder bump-bonds. 32 \

  10. Overview of the ATLAS Insertable B-Layer (IBL) Project

    CERN Document Server

    Djama, F; The ATLAS collaboration

    2012-01-01

    The upgrades for the ATLAS Pixel Detector will be staged in preparation for high luminosity LHC. The first upgrade for the Pixel Detector will be the construction of a new pixel layer which will be installed during the first shutdown of the LHC machine, foreseen in 2013-14. The new detector, called the Insertable B-layer (IBL), will be installed between the existing Pixel Detector and a new, smaller radius beampipe at a radius of 3.3 cm. The IBL will require the development of several new technologies to cope with increased radiation and pixel occupancy and also to improve the physics performance through reduction of the pixel size and a more stringent material budget. Two different and promising silicon sensor technologies, planar n-in-n and 3D, are currently under investigation for the IBL. An overview of the IBL project, of the module design and qualification with particular emphasis on irradiation tests will be presented.

  11. Mapping Electrical Crosstalk in Pixelated Sensor Arrays

    Science.gov (United States)

    Seshadri, Suresh (Inventor); Cole, David (Inventor); Smith, Roger M. (Inventor); Hancock, Bruce R. (Inventor)

    2017-01-01

    The effects of inter pixel capacitance in a pixilated array may be measured by first resetting all pixels in the array to a first voltage, where a first image is read out, followed by resetting only a subset of pixels in the array to a second voltage, where a second image is read out, where the difference in the first and second images provide information about the inter pixel capacitance. Other embodiments are described and claimed.

  12. Mapping Electrical Crosstalk in Pixelated Sensor Arrays

    Science.gov (United States)

    Seshadri, Suresh (Inventor); Cole, David (Inventor); Smith, Roger M (Inventor); Hancock, Bruce R. (Inventor)

    2013-01-01

    The effects of inter pixel capacitance in a pixilated array may be measured by first resetting all pixels in the array to a first voltage, where a first image is read out, followed by resetting only a subset of pixels in the array to a second voltage, where a second image is read out, where the difference in the first and second images provide information about the inter pixel capacitance. Other embodiments are described and claimed.

  13. Silicon sensor technologies for the ATLAS IBL upgrade.

    CERN Document Server

    Grenier, P

    2012-01-01

    An overview of radiation hard planar and 3D pixel sensor technologies currently under development for ATLAS upgrades is presented. The first upgrade will be the installation in 2013 of an additional pixel layer inside the current inner detector, the Insertable B Layer (IBL). The two technologies are competing to equip the IBL. The IBL sensor qualification procedure is described. Beam test results of un-irradiated and irradiated planar and 3D sensors are presented.

  14. CMS has a heart of pixels

    CERN Multimedia

    2003-01-01

    In the immediate vicinity of the collision point, CMS will be equipped with pixel detectors consisting of no fewer than 50 million pixels measuring 150 microns along each side. Each of the pixels, which receive the signal, is connected to its own electronic circuit by a tiny sphere (seen here in the electron microscope image) measuring 15 to 20 microns in diameter.

  15. CVD diamond pixel detectors for LHC experiments

    Energy Technology Data Exchange (ETDEWEB)

    Wedenig, R.; Adam, W.; Bauer, C.; Berdermann, E.; Bergonzo, P.; Bogani, F.; Borchi, E.; Brambilla, A.; Bruzzi, M.; Colledani, C.; Conway, J.; Dabrowski, W.; Delpierre, P.; Deneuville, A.; Dulinski, W.; Eijk, B. van; Fallou, A.; Fizzotti, F.; Foulon, F.; Friedl, M.; Gan, K.K.; Gheeraert, E.; Grigoriev, E.; Hallewell, G.; Hall-Wilton, R.; Han, S.; Hartjes, F.; Hrubec, J.; Husson, D.; Kagan, H.; Kania, D.; Kaplon, J.; Karl, C.; Kass, R.; Knoepfle, K.T.; Krammer, M.; Logiudice, A.; Lu, R.; Manfredi, P.F.; Manfredotti, C.; Marshall, R.D.; Meier, D.; Mishina, M.; Oh, A.; Pan, L.S.; Palmieri, V.G.; Pernicka, M.; Peitz, A.; Pirollo, S.; Polesello, P.; Pretzl, K.; Procario, M.; Re, V.; Riester, J.L.; Roe, S.; Roff, D.; Rudge, A.; Runolfsson, O.; Russ, J.; Schnetzer, S.; Sciortino, S.; Speziali, V.; Stelzer, H.; Stone, R.; Suter, B.; Tapper, R.J.; Tesarek, R.; Trawick, M.; Trischuk, W.; Vittone, E.; Wagner, A.; Walsh, A.M.; Weilhammer, P.; White, C.; Zeuner, W.; Ziock, H.; Zoeller, M.; Blanquart, L.; Breugnion, P.; Charles, E.; Ciocio, A.; Clemens, J.C.; Dao, K.; Einsweiler, K.; Fasching, D.; Fischer, P.; Joshi, A.; Keil, M.; Klasen, V.; Kleinfelder, S.; Laugier, D.; Meuser, S.; Milgrome, O.; Mouthuy, T.; Richardson, J.; Sinervo, P.; Treis, J.; Wermes, N

    1999-08-01

    This paper reviews the development of CVD diamond pixel detectors. The preparation of the diamond pixel sensors for bump-bonding to the pixel readout electronics for the LHC and the results from beam tests carried out at CERN are described.

  16. Studies of the ATLAS Inner Detector material using $\\sqrt{s}=$13 TeV $pp$ collision data

    CERN Document Server

    The ATLAS collaboration

    2015-01-01

    The ATLAS Inner Detector comprises three different technologies: the Pixel detector (Pixel), the silicon strip tracker (SCT), and the transition radiation drift tube tracker (TRT). The material in the ATLAS Inner Detector is studied with several methods, using the $pp$ collision sample collected at $\\sqrt{s}=$13 TeV in 2015. The material within the innermost barrel regions of the ATLAS Inner Detector is studied using reconstructed hadronic interaction and photon conversion vertices from samples of minimum bias events. It was found that the description of the Insertable B-Layer, which is the new, innermost Pixel layer installed in 2014, in the geometry model was missing some material components. After updating the model, data and simulation show good agreement at the barrel region. The Pixel services (cables, cooling pipes, support trays) were modified between the Pixel and SCT detectors in 2014. The material in this region is also studied by investigating the efficiency with which tracks reconstructed only in...

  17. Making a trillion pixels dance

    Science.gov (United States)

    Singh, Vivek; Hu, Bin; Toh, Kenny; Bollepalli, Srinivas; Wagner, Stephan; Borodovsky, Yan

    2008-03-01

    In June 2007, Intel announced a new pixelated mask technology. This technology was created to address the problem caused by the growing gap between the lithography wavelength and the feature sizes patterned with it. As this gap has increased, the quality of the image has deteriorated. About a decade ago, Optical Proximity Correction (OPC) was introduced to bridge this gap, but as this gap continued to increase, one could not rely on the same basic set of techniques to maintain image quality. The computational lithography group at Intel sought to alleviate this problem by experimenting with additional degrees of freedom within the mask. This paper describes the resulting pixelated mask technology, and some of the computational methods used to create it. The first key element of this technology is a thick mask model. We realized very early in the development that, unlike traditional OPC methods, the pixelated mask would require a very accurate thick mask model. Whereas in the traditional methods, one can use the relatively coarse approximations such as the boundary layer method, use of such techniques resulted not just in incorrect sizing of parts of the pattern, but in whole features missing. We built on top of previously published domain decomposition methods, and incorporated limitations of the mask manufacturing process, to create an accurate thick mask model. Several additional computational techniques were invoked to substantially increase the speed of this method to a point that it was feasible for full chip tapeout. A second key element of the computational scheme was the comprehension of mask manufacturability, including the vital issue of the number of colors in the mask. While it is obvious that use of three or more colors will give the best image, one has to be practical about projecting mask manufacturing capabilities for such a complex mask. To circumvent this serious issue, we eventually settled on a two color mask - comprising plain glass and etched

  18. Development of SOI pixel detector in Cracow

    CERN Document Server

    Bugiel, Szymon; Glab, Sebastian; Idzik, Marek; Moron, Jakub; Kapusta, Piotr Julian; Kucewicz, Wojciech; Turala, Michal

    2015-01-01

    This paper presents the design of a new monolithic Silicon-On-Insulator pixel sensor in $200~nm$ SOI CMOS technology. The main application of the proposed pixel detector is the spectroscopy, but it can also be used for the minimum ionizing particle (MIP) tracking in particle physics experiments. For this reason few different versions of pixel cells are developed: a source-follower based pixel for tracking, a low noise pixel with preamplifier for spectroscopy, and a self-triggering pixel for time and amplitude measurements. In addition the design of a Successive Approximation Register Analog-to-Digital Converter (SAR ADC) is also presented. A 10-bit SAR ADC is developed for spectroscopic measurements and a lower resolution 6-bit SAR ADC is integrated in the pixel matrix as a column ADC, for tracking applications.

  19. Pixel Hybridization Technologies for the HL-LHC

    Science.gov (United States)

    Alimonti, G.; Biasotti, M.; Ceriale, V.; Darbo, G.; Gariano, G.; Gaudiello, A.; Gemme, C.; Rossi, L.; Rovani, A.; Ruscino, E.

    2016-12-01

    During the 2024-2025 shut-down, the Large Hadron Collider (LHC) will be upgraded to reach an instantaneous luminosity up to 7×1034 cm-2s-1. This upgrade of the collider is called High-Luminosity LHC (HL-LHC). ATLAS and CMS detectors will be upgraded to meet the new challenges of HL-LHC: an average of 200 pile-up events in every bunch crossing and an integrated luminosity of 3000 fb-1 over ten years. In particular, the current trackers will be completely replaced. In HL-LHC the trackers should operate under high fluences (up to 1.4 × 1016 neq cm-2), with a correlated high radiation damage. The pixel detectors, the innermost part of the trackers, needed a completely new design in the readout electronics, sensors and interconnections. A new 65 nm front-end (FE) electronics is being developed by the RD53 collaboration compatible with smaller pixel sizes than the actual ones to cope with the high track densities. Consequently the bump density will increase up to 4 ·104 bumps/cm2. Preliminary results of two hybridization technologies study are presented in this paper. In particular, the on-going bump-bonding qualification program at Leonardo-Finmeccanica is discussed, together with alternative hybridization techniques, as the capacitive coupling for HV-CMOS detectors.

  20. The ALICE pixel detector upgrade

    Science.gov (United States)

    Reidt, F.

    2016-12-01

    The ALICE experiment at the CERN LHC is designed to study the physics of strongly interacting matter, and in particular the properties of the Quark-Gluon Plasma, using proton-proton, proton-nucleus and nucleus-nucleus collisions. The ALICE collaboration is preparing a major upgrade of the experimental apparatus to be installed during the second long LHC shutdown in the years 2019-2020. A key element of the ALICE upgrade is the new, ultra-light, high-resolution Inner Tracking System. With respect to the current detector, the new Inner Tracking System will significantly enhance the pointing resolution, the tracking efficiency at low transverse momenta, and the read-out rate capabilities. This will be obtained by seven concentric detector layers based on a Monolithic Active Pixel Sensor with a pixel pitch of about 30×30 μm2. A key feature of the new Inner Tracking System, which is optimised for high tracking accuracy at low transverse momenta, is the very low mass of the three innermost layers, which feature a material budget of 0.3% X0 per layer. This contribution presents the design goals and layout of the upgraded ALICE Inner Tracking System, summarises the R&D activities focussing on the technical implementation of the main detector components, and the projected detector performance.

  1. Supporting ATLAS

    CERN Multimedia

    maximilien brice

    2003-01-01

    Eighteen feet made of stainless steel will support the barrel ATLAS detector in the cavern at Point 1. In total, the ATLAS feet system will carry approximately 6000 tons, and will give the same inclination to the detector as the LHC accelerator.

  2. Proceedings of PIXEL98 -- International pixel detector workshop

    Energy Technology Data Exchange (ETDEWEB)

    Anderson, D.F.; Kwan, S. [eds.

    1998-08-01

    Experiments around the globe face new challenges of more precision in the face of higher interaction rates, greater track densities, and higher radiation doses, as they look for rarer and rarer processes, leading many to incorporate pixelated solid-state detectors into their plans. The highest-readout rate devices require new technologies for implementation. This workshop reviewed recent, significant progress in meeting these technical challenges. Participants presented many new results; many of them from the weeks--even days--just before the workshop. Brand new at this workshop were results on cryogenic operation of radiation-damaged silicon detectors (dubbed the Lazarus effect). Other new work included a diamond sensor with 280-micron collection distance; new results on breakdown in p-type silicon detectors; testing of the latest versions of read-out chip and interconnection designs; and the radiation hardness of deep-submicron processes.

  3. Supporting ATLAS

    CERN Multimedia

    2003-01-01

    Eighteen feet made of stainless steel will support the barrel ATLAS detector in the cavern at Point 1. In total, the ATLAS feet system will carry approximately 6000 tons, and will give the same inclination to the detector as the LHC accelerator. The installation of the feet is scheduled to finish during January 2004 with an installation precision at the 1 mm level despite their height of 5.3 metres. The manufacture was carried out in Russia (Company Izhorskiye Zavody in St. Petersburg), as part of a Russian and JINR Dubna in-kind contribution to ATLAS. Involved in the installation is a team from IHEP-Protvino (Russia), the ATLAS technical co-ordination team at CERN, and the CERN survey team. In all, about 15 people are involved. After the feet are in place, the barrel toroid magnet and the barrel calorimeters will be installed. This will keep the ATLAS team busy for the entire year 2004.

  4. Serial Pixel Analog-to-Digital Converter

    Energy Technology Data Exchange (ETDEWEB)

    Larson, E D

    2010-02-01

    This method reduces the data path from the counter to the pixel register of the analog-to-digital converter (ADC) from as many as 10 bits to a single bit. The reduction in data path width is accomplished by using a coded serial data stream similar to a pseudo random number (PRN) generator. The resulting encoded pixel data is then decoded into a standard hexadecimal format before storage. The high-speed serial pixel ADC concept is based on the single-slope integrating pixel ADC architecture. Previous work has described a massively parallel pixel readout of a similar architecture. The serial ADC connection is similar to the state-of-the art method with the exception that the pixel ADC register is a shift register and the data path is a single bit. A state-of-the-art individual-pixel ADC uses a single-slope charge integration converter architecture with integral registers and “one-hot” counters. This implies that parallel data bits are routed among the counter and the individual on-chip pixel ADC registers. The data path bit-width to the pixel is therefore equivalent to the pixel ADC bit resolution.

  5. Penrose Pixels for Super-Resolution.

    Science.gov (United States)

    Ben-Ezra, M; Lin, Zhouchen; Wilburn, Bennett; Zhang, Wei

    2011-07-01

    We present a novel approach to reconstruction-based super-resolution that uses aperiodic pixel tilings, such as a Penrose tiling or a biological retina, for improved performance. To this aim, we develop a new variant of the well-known error back projection super-resolution algorithm that makes use of the exact detector model in its back projection operator for better accuracy. Pixels in our model can vary in shape and size, and there may be gaps between adjacent pixels. The algorithm applies equally well to periodic or aperiodic pixel tilings. We present analysis and extensive tests using synthetic and real images to show that our approach using aperiodic layouts substantially outperforms existing reconstruction-based algorithms for regular pixel arrays. We close with a discussion of the feasibility of manufacturing CMOS or CCD chips with pixels arranged in Penrose tilings.

  6. Dead pixel replacement in LWIR microgrid polarimeters.

    Science.gov (United States)

    Ratliff, Bradley M; Tyo, J Scott; Boger, James K; Black, Wiley T; Bowers, David L; Fetrow, Matthew P

    2007-06-11

    LWIR imaging arrays are often affected by nonresponsive pixels, or "dead pixels." These dead pixels can severely degrade the quality of imagery and often have to be replaced before subsequent image processing and display of the imagery data. For LWIR arrays that are integrated with arrays of micropolarizers, the problem of dead pixels is amplified. Conventional dead pixel replacement (DPR) strategies cannot be employed since neighboring pixels are of different polarizations. In this paper we present two DPR schemes. The first is a modified nearest-neighbor replacement method. The second is a method based on redundancy in the polarization measurements.We find that the redundancy-based DPR scheme provides an order-of-magnitude better performance for typical LWIR polarimetric data.

  7. The ATLAS Insertable B-Layer: from construction to operation

    CERN Document Server

    La Rosa, Alessandro; The ATLAS collaboration

    2016-01-01

    The ATLAS Insertable B-Layer (IBL) is a fourth layer of pixel detectors, and has been installed in May 2014 at a radius of 3.3 cm between the existing Pixel Detector and a new smaller radius beam-pipe. The new detector, built to cope with high radiation and occupancy, is the first large scale application of 3D detectors and CMOS 130nm technology. The IBL detector construction was achieved within about two years starting from mid-2012 to the May 2014 installation in ATLAS, a very tight schedule to meet the ATLAS installation and detector closure before starting the Run2 in Spring 2015. The key features and challenges met during the IBL project will be presented, as well as its commissioning and operational experience in LHC.

  8. The ATLAS Insertable B-Layer: from construction to operation

    CERN Document Server

    La Rosa, Alessandro

    2016-01-01

    The ATLAS Insertable B-Layer (IBL) is a fourth layer of pixel detectors, and has been installed in May 2014 at a radius of 3.3 cm from the beam axis and between the existing Pixel detector and a new smaller radius beam-pipe. The new detector, built to cope with high radiation and occupancy, is the first large scale application of 3D detectors and CMOS 130 nm technology. The IBL detector construction was achieved within about two years starting from mid-2012 to the May 2014 installation in ATLAS, a very tight schedule to meet the ATLAS installation and detector closure before starting the Run2 in Spring 2015. The key features and challenges met during the IBL project will be presented, as well as its commissioning and operational experience at the LHC.

  9. Chronopixels: particle detector R&D for the ATLAS phase 2 upgrade

    Science.gov (United States)

    Weber, Christian; Baker, Keith; Barker, Thomas; Baltay, Charles; Sinev, Nikolai; Brau, Jim; Strom, David; Atlas Collaboration

    2017-01-01

    The pixel detector comprises the innermost part of the ATLAS detector. Its proximity to the interaction point together with its micrometer resolution allow for impact parameter determination and vertex fitting. This proximity however exposes it also to the highest radiation fluences and particle densities. The latter poses a challenge in inferring particle tracks from hit pixels, while the former leads to progressive radiation damage of the pixel detector itself. These problems will worsen after the LHC's third long shutdown in 2025 when it will operate in high luminosity mode at about five times the current instantaneous luminosity. These conditions will require the pixel detector to be replaced by one staffed with pixel modules capable of enduring the harsher radiation environment, and with finer granularity to cope with the increased pileup. Several efforts in the community are on their way to produce such a pixel module. We are presenting here the current status of our R&D on such a pixel module: The Chronopixel for ATLAS phase 2, a fully monolithic active pixel sensor in CMOS technology. Sensing and readout electronics are included in each pixel here. As such it does not require expensive and labor intensive bump-bonding to a separate readout chip, reducing cost and material in the pixel detector. We gratefully acknowledge support by the Department of Energy, Office of High Energy Physics.

  10. Overview of the ATLAS Insertable B-Layer (IBL) Project

    CERN Document Server

    Grinstein, S; The ATLAS collaboration

    2012-01-01

    The upgrades for the ATLAS Pixel Detector will be staged in preparation for high luminosity LHC. The first upgrade will be the construction of a new pixel layer which will be installed during the first shutdown of the LHC machine, foreseen in 2013-14. The new detector, called the Insertable B-layer (IBL), will be installed between the existing Pixel Detector and a new, smaller radius beam-pipe at a radius of 3.3 cm. The IBL will require the development of several new technologies to cope with increased radiation and pixel occupancy and also to improve the physics performance through reduction of the pixel size and a more stringent material budget. Two silicon sensor technologies, planar and 3D, are currently under investigation for the IBL. An overview of the IBL project, of the module design and the qualification for these sensor technologies will be presented.

  11. Implementation of TDI based digital pixel ROIC with 15μm pixel pitch

    Science.gov (United States)

    Ceylan, Omer; Shafique, Atia; Burak, A.; Caliskan, Can; Abbasi, Shahbaz; Yazici, Melik; Gurbuz, Yasar

    2016-05-01

    A 15um pixel pitch digital pixel for LWIR time delay integration (TDI) applications is implemented which occupies one fourth of pixel area compared to previous digital TDI implementation. TDI is implemented on 8 pixels with oversampling rate of 2. ROIC provides 16 bits output with 8 bits of MSB and 8 bits of LSB. Pixel can store 75 M electrons with a quantization noise of 500 electrons. Digital pixel TDI implementation is advantageous over analog counterparts considering power consumption, chip area and signal-to-noise ratio. Digital pixel TDI ROIC is fabricated with 0.18um CMOS process. In digital pixel TDI implementation photocurrent is integrated on a capacitor in pixel and converted to digital data in pixel. This digital data triggers the summation counters which implements TDI addition. After all pixels in a row contribute, the summed data is divided to the number of TDI pixels(N) to have the actual output which is square root of N improved version of a single pixel output in terms of signal-to-noise-ratio (SNR).

  12. Mongolian Atlas

    Data.gov (United States)

    National Oceanic and Atmospheric Administration, Department of Commerce — Climatic atlas dated 1985, in Mongolian, with introductory material also in Russian and English. One hundred eight pages in single page PDFs.

  13. Land Cover Heterogeneity Effects on Sub-Pixel and Per-Pixel Classifications

    Directory of Open Access Journals (Sweden)

    Trung V. Tran

    2014-04-01

    Full Text Available Per-pixel and sub-pixel are two common classification methods in land cover studies. The characteristics of a landscape, particularly the land cover itself, can affect the accuracies of both methods. The objectives of this study were to: (1 compare the performance of sub-pixel vs. per-pixel classification methods for a broad heterogeneous region; and (2 analyze the impact of land cover heterogeneity (i.e., the number of land cover classes per pixel on both classification methods. The results demonstrated that the accuracy of both per-pixel and sub-pixel classification methods were generally reduced by increasing land cover heterogeneity. Urban areas, for example, were found to have the lowest accuracy for the per-pixel method, because they had the highest heterogeneity. Conversely, rural areas dominated by cropland and grassland had low heterogeneity and high accuracy. When a sub-pixel method was used, the producer’s accuracy for artificial surfaces was increased by more than 20%. For all other land cover classes, sub-pixel and per-pixel classification methods performed similarly. Thus, the sub-pixel classification was only advantageous for heterogeneous urban landscapes. Both creators and users of land cover datasets should be aware of the inherent landscape heterogeneity and its potential effect on map accuracy.

  14. ISPA (imaging silicon pixel array) experiment

    CERN Multimedia

    Patrice Loïez

    2002-01-01

    The bump-bonded silicon pixel detector, developed at CERN by the EP-MIC group, is shown here in its ceramic carrier. Both represent the ISPA-tube anode. The chip features between 1024 (called OMEGA-1) and 8196 (ALICE-1) active pixels.

  15. Module production of the one-arm AFP 3D pixel tracker

    CERN Document Server

    Grinstein, S.; Chmeissani, M.; Dorholt, O.; Förster, F.; Lange, J.; Lopez Paz, I.; Manna, M.; Pellegrini, G.; Quirion, D.; Rijssenbeek, M.; Rohne, O.; Stugu, B.

    2016-01-01

    The ATLAS Forward Proton (AFP) detector is designed to identify events in which one or two protons emerge intact from the LHC collisions. AFP will consist of a tracking detector, to measure the momentum of the protons, and a time of flight system to reduce the background from multiple proton-proton interactions. Following an extensive qualification period, 3D silicon pixel sensors were selected for the AFP tracker. The sensors were produced at CNM (Barcelona) during 2014. The tracker module assembly and quality control was performed at IFAE during 2015. The assembly of the first AFP arm and the following installation in the LHC tunnel took place in February 2016. This paper reviews the fabrication process of the AFP tracker focusing on the pixel modules.

  16. 3D-FBK pixel sensors with CMS readout: First test results

    Energy Technology Data Exchange (ETDEWEB)

    Obertino, M., E-mail: margherita.obertino@cern.ch [Università del Piemonte Orientale, Novara, and INFN, Torino (Italy); Solano, A. [Università di Torino and INFN, Torino (Italy); Vilela Pereira, A. [INFN, Torino (Italy); Alagoz, E. [Physics Department, Purdue University, West Lafayette, IN (United States); Andresen, J. [Colorado University, Colorado (United States); Arndt, K.; Bolla, G.; Bortoletto, D. [Physics Department, Purdue University, West Lafayette, IN (United States); Boscardin, M. [Centro per i Materiali e i Microsistemi Fondazione Bruno Kessler (FBK), Povo di Trento (Italy); Brosius, R. [SUNY, Buffalo (United States); Bubna, M. [Physics Department, Purdue University, West Lafayette, IN (United States); Dalla Betta, G.-F. [INFN Padova (Gruppo Collegato di Trento) and Università di Trento, Povo di Trento (Italy); Jensen, F. [Colorado University, Colorado (United States); Krzywda, A. [Physics Department, Purdue University, West Lafayette, IN (United States); Kumar, A. [SUNY, Buffalo (United States); Kwan, S. [Università di Milano Bicocca and INFN, Milano (Italy); Lei, C.M. [Colorado University, Colorado (United States); Menasce, D.; Moroni, L. [INFN Milano Bicocca, Milano (Italy); Ngadiuba, J. [Università di Milano Bicocca and INFN, Milano (Italy); and others

    2013-08-01

    Silicon 3D detectors consist of an array of columnar electrodes of both doping types which penetrate entirely in the detector bulk, perpendicularly to the surface. They are emerging as one of the most promising technologies for innermost layers of tracking devices for the foreseen upgrades of the LHC. Until recently, properties of 3D sensors have been investigated mostly with ATLAS readout electronics. 3D pixel sensors compatible with the CMS readout were first fabricated at SINTEF (Oslo, Norway), and more recently at FBK (Trento, Italy) and CNM (Barcelona, Spain). Several sensors with different electrode configurations, bump-bonded with the CMS pixel PSI46 readout chip, were characterized in laboratory and tested at Fermilab with a proton beam of 120 GeV/c. Preliminary results of the data analysis are presented.

  17. Module production of the one-arm AFP 3D pixel tracker

    Science.gov (United States)

    Grinstein, S.; Cavallaro, E.; Chmeissani, M.; Dorholt, O.; Förster, F.; Lange, J.; Lopez Paz, I.; Manna, M.; Pellegrini, G.; Quirion, D.; Rijssenbeek, M.; Rohne, O.; Stugu, B.

    2017-01-01

    The ATLAS Forward Proton (AFP) detector is designed to identify events in which one or two protons emerge intact from the LHC collisions. AFP will consist of a tracking detector, to measure the momentum of the protons, and a time of flight system to reduce the background from multiple proton-proton interactions. Following an extensive qualification period, 3D silicon pixel sensors were selected for the AFP tracker. The sensors were produced at CNM (Barcelona) during 2014. The tracker module assembly and quality control was performed at IFAE during 2015. The assembly of the first AFP arm and the following installation in the LHC tunnel took place in February 2016. This paper reviews the fabrication process of the AFP tracker focusing on the pixel modules.

  18. It's not the pixel count, you fool

    Science.gov (United States)

    Kriss, Michael A.

    2012-01-01

    The first thing a "marketing guy" asks the digital camera engineer is "how many pixels does it have, for we need as many mega pixels as possible since the other guys are killing us with their "umpteen" mega pixel pocket sized digital cameras. And so it goes until the pixels get smaller and smaller in order to inflate the pixel count in the never-ending pixel-wars. These small pixels just are not very good. The truth of the matter is that the most important feature of digital cameras in the last five years is the automatic motion control to stabilize the image on the sensor along with some very sophisticated image processing. All the rest has been hype and some "cool" design. What is the future for digital imaging and what will drive growth of camera sales (not counting the cell phone cameras which totally dominate the market in terms of camera sales) and more importantly after sales profits? Well sit in on the Dark Side of Color and find out what is being done to increase the after sales profits and don't be surprised if has been done long ago in some basement lab of a photographic company and of course, before its time.

  19. Production and Characterisation of SLID Interconnected n-in-p Pixel Modules with 75 Micrometer Thin Silicon Sensors

    CERN Document Server

    Andricek, L; Macchiolo, A.; Moser, H.-G.; Nisius, R.; Richter, R.H.; Terzo, S.; Weigell, P.

    2014-01-01

    The performance of pixel modules built from 75 micrometer thin silicon sensors and ATLAS read-out chips employing the Solid Liquid InterDiffusion (SLID) interconnection technology is presented. This technology, developed by the Fraunhofer EMFT, is a possible alternative to the standard bump-bonding. It allows for stacking of different interconnected chip and sensor layers without destroying the already formed bonds. In combination with Inter-Chip-Vias (ICVs) this paves the way for vertical integration. Both technologies are combined in a pixel module concept which is the basis for the modules discussed in this paper. Mechanical and electrical parameters of pixel modules employing both SLID interconnections and sensors of 75 micrometer thickness are covered. The mechanical features discussed include the interconnection efficiency, alignment precision and mechanical strength. The electrical properties comprise the leakage currents, tunability, charge collection, cluster sizes and hit efficiencies. Targeting at ...

  20. Fabrication of a high-density MCM-D for a pixel detector system using a BCB/Cu technology

    CERN Document Server

    Topper, M; Engelmann, G; Fehlberg, S; Gerlach, P; Wolf, J; Ehrmann, O; Becks, K H; Reichl, H

    1999-01-01

    The MCM-D which is described here is a prototype for a pixel detector system for the planned Large Hadron Collider (LHC) at CERN, Geneva. The project is within the ATLAS experiment. The module consists of a sensor tile with an active area of 16.4 mm*60.4 mm, 16 readout chips, each serving 24*160 pixel unit cells, a module controller chip, an optical transceiver and the local signal interconnection and power distribution buses. The extremely high wiring density which is necessary to interconnect the readout chips was achieved using a thin film copper/photo-BCB process above the pixel array. The bumping of the readout chips was done by PbSn electroplating. All dice are then attached by flip-chip assembly to the sensor diodes and the local buses. The focus of this paper is a detailed description of the technologies for the fabrication of this advanced MCM-D. (10 refs).

  1. LISe pixel detector for neutron imaging

    Science.gov (United States)

    Herrera, Elan; Hamm, Daniel; Wiggins, Brenden; Milburn, Rob; Burger, Arnold; Bilheux, Hassina; Santodonato, Louis; Chvala, Ondrej; Stowe, Ashley; Lukosi, Eric

    2016-10-01

    Semiconducting lithium indium diselenide, 6LiInSe2 or LISe, has promising characteristics for neutron detection applications. The 95% isotopic enrichment of 6Li results in a highly efficient thermal neutron-sensitive material. In this study, we report on a proof-of-principle investigation of a semiconducting LISe pixel detector to demonstrate its potential as an efficient neutron imager. The LISe pixel detector had a 4×4 of pixels with a 550 μm pitch on a 5×5×0.56 mm3 LISe substrate. An experimentally verified spatial resolution of 300 μm was observed utilizing a super-sampling technique.

  2. Anode readout for pixellated CZT detectors

    Science.gov (United States)

    Narita, Tomohiko; Grindlay, Jonathan E.; Hong, Jaesub; Niestemski, Francis C.

    2004-02-01

    Determination of the photon interaction depth offers numerous advantages for an astronomical hard X-ray telescope. The interaction depth is typically derived from two signals: anode and cathode, or collecting and non-collecting electrodes. We present some preliminary results from our depth sensing detectors using only the anode pixel signals. By examining several anode pixel signals simultaneously, we find that we can estimate the interaction depth, and get sub-pixel 2-D position resolution. We discuss our findings and the requirements for future ASIC development.

  3. Pixelated CdZnTe drift detectors

    DEFF Research Database (Denmark)

    Kuvvetli, Irfan; Budtz-Jørgensen, Carl

    2005-01-01

    A technique, the so-called Drift Strip Method (DSM), for improving the CdZnTe detector energy response to hard X-rays and gamma-rays was applied as a pixel geometry. First tests have confirmed that this detector type provides excellent energy resolution and imaging performance. We specifically...... report on the performance of 3 mm thick prototype CZT drift pixel detectors fabricated using material from eV-products. We discuss issues associated with detector module performance. Characterization results obtained from several prototype drift pixel detectors are presented. Results of position...

  4. Pixel detectors from fundamentals to applications

    CERN Document Server

    Rossi, Leonardo; Rohe, Tilman; Wermes, Norbert

    2006-01-01

    Pixel detectors are a particularly important class of particle and radiation detection devices. They have an extremely broad spectrum of applications, ranging from high-energy physics to the photo cameras of everyday life. This book is a general purpose introduction into the fundamental principles of pixel detector technology and semiconductor-based hybrid pixel devices. Although these devices were developed for high-energy ionizing particles and radiation beyond visible light, they are finding new applications in many other areas. This book will therefore benefit all scientists and engineers working in any laboratory involved in developing or using particle detection.

  5. Adopt a Pixel Photographs: 2013-Present

    Data.gov (United States)

    U.S. Geological Survey, Department of the Interior — The photographs in the Adopt a Pixel collection were provided by volunteers with a digital camera, a Global Positioning System (GPS), and a compass or a smart mobile...

  6. Adopt a Pixel Photographs: 2013-Present

    Data.gov (United States)

    U.S. Geological Survey, Department of the Interior — The photographs in the Adopt a Pixel collection were provided by volunteers with a digital camera, a Global Positioning System (GPS), and a compass or a smart...

  7. Dense Iterative Contextual Pixel Classification using Kriging

    DEFF Research Database (Denmark)

    Ganz, Melanie; Loog, Marco; Brandt, Sami

    2009-01-01

    In medical applications, segmentation has become an ever more important task. One of the competitive schemes to perform such segmentation is by means of pixel classification. Simple pixel-based classification schemes can be improved by incorporating contextual label information. Various methods h...... relatively long range interactions may play a role. We propose a new method based on Kriging that makes it possible to include such long range interactions, while keeping the computations manageable when dealing with large medical images....

  8. Development of an ASD IC for the Micro Pixel Chamber

    CERN Document Server

    Orito, R; Kubo, H; Miuchi, K; Nagayoshi, T; Okada, Y; Takada, A; Takeda, A; Tanimori, T; Ueno, M

    2004-01-01

    A new amplifier-shaper-discriminator (ASD) chip was designed and manufactured for the Micro Pixel Chamber ($\\mu$-PIC). The design of this ASD IC is based on the ASD IC (TGC-ASD) for the Thin Gap Chamber in the LHC Atlas Experiment. The decay time constant of the preamplifier is 5-times longer than that of the TGC-ASD, and some other modifications have been made in order to improve the signal-to-noise ratio of the $\\mu$-PIC. The ASD IC uses SONY Analog Master Slice bipolar technology. The IC contains 4 channels in a QFP48 package. The decay time constant of the preamplifier is 80 ns and its gain is approximately 0.8 V/pC. The output from the preamplifier is received by a shaper (main-amplifier) with a gain of 7. A baseline restoration circuit is incorporated in the main-amplifier, and the current used for the baseline restoration is 5-times smaller than that of the TGC-ASD. The threshold voltage for the discriminator section is common to the 4 channels and their digital output level is LVDS-compatible. The ASD...

  9. Steganography based on pixel intensity value decomposition

    Science.gov (United States)

    Abdulla, Alan Anwar; Sellahewa, Harin; Jassim, Sabah A.

    2014-05-01

    This paper focuses on steganography based on pixel intensity value decomposition. A number of existing schemes such as binary, Fibonacci, Prime, Natural, Lucas, and Catalan-Fibonacci (CF) are evaluated in terms of payload capacity and stego quality. A new technique based on a specific representation is proposed to decompose pixel intensity values into 16 (virtual) bit-planes suitable for embedding purposes. The proposed decomposition has a desirable property whereby the sum of all bit-planes does not exceed the maximum pixel intensity value, i.e. 255. Experimental results demonstrate that the proposed technique offers an effective compromise between payload capacity and stego quality of existing embedding techniques based on pixel intensity value decomposition. Its capacity is equal to that of binary and Lucas, while it offers a higher capacity than Fibonacci, Prime, Natural, and CF when the secret bits are embedded in 1st Least Significant Bit (LSB). When the secret bits are embedded in higher bit-planes, i.e., 2nd LSB to 8th Most Significant Bit (MSB), the proposed scheme has more capacity than Natural numbers based embedding. However, from the 6th bit-plane onwards, the proposed scheme offers better stego quality. In general, the proposed decomposition scheme has less effect in terms of quality on pixel value when compared to most existing pixel intensity value decomposition techniques when embedding messages in higher bit-planes.

  10. LAPAS: A SiGe Front End Prototype for the Upgraded ATLAS LAr

    CERN Document Server

    Rescia, S; Newcomer, F M; Dressnandt, N

    2009-01-01

    We have designed and fabricated a very low noise preamplifier and shaper with a (RC)2 – CR response to replace the existing ATLAS Liquid Argon readout for use at SLHC. IBM’s 8WL 130nm SiGe process was chosen for its radiation tolerance wide voltage range and potential for use in other LHC detector subsystems. The required dynamic range of 15 bits is accomplished by utilization of a single stage, low noise, wide dynamic range preamp connected to a dual range shaper. The low noise of the preamp (~.01nA / √Hz) is achieved by utilizing the process Silicon Germanium bipolar transistors. The relatively high voltage rating of the npn transistors is exploited to allow a gain of 650V/A. With this gain the equivalent input voltage noise requirement on the shaper to about 2.2nV/ √Hz. Each shaper stage is designed as a cascaded differential op amp doublet with a common mode operating point regulated by an internal feedback loop. The shaper outputs are designed to be compatible with the 130nm CMOS ADC being develo...

  11. Focal plane array with modular pixel array components for scalability

    Energy Technology Data Exchange (ETDEWEB)

    Kay, Randolph R; Campbell, David V; Shinde, Subhash L; Rienstra, Jeffrey L; Serkland, Darwin K; Holmes, Michael L

    2014-12-09

    A modular, scalable focal plane array is provided as an array of integrated circuit dice, wherein each die includes a given amount of modular pixel array circuitry. The array of dice effectively multiplies the amount of modular pixel array circuitry to produce a larger pixel array without increasing die size. Desired pixel pitch across the enlarged pixel array is preserved by forming die stacks with each pixel array circuitry die stacked on a separate die that contains the corresponding signal processing circuitry. Techniques for die stack interconnections and die stack placement are implemented to ensure that the desired pixel pitch is preserved across the enlarged pixel array.

  12. Prototype ATLAS IBL Modules using the FE-I4A Front-End Readout Chip

    CERN Document Server

    Albert, J; Alimonti, Gianluca; Allport, Phil; Altenheiner, Silke; Ancu, Lucian; Andreazza, Attilio; Arguin, Jean-Francois; Arutinov, David; Backhaus, Malte; Bagolini, Alvise; Ballansat, Jacques; Barbero, Marlon; Barbier, Gérard; Bates, Richard; Battistin, Michele; Baudin, Patrick; Beau, Tristan; Beccherle, Roberto; Beck, Hans Peter; Benoit, Mathieu; Bensinger, Jim; Bomben, Marco; Borri, Marcello; Boscardin, Maurizio; Botelho Direito, Jose Antonio; Bousson, Nicolas; Boyd, George Russell Jr; Breugnon, Patrick; Bruni, Graziano; Bruschi, Marco; Buchholz, Peter; Buttar, Craig; Cadoux, Franck; Calderini, Giovanni; Caminada, Leah; Capeans, Mar; Casse, Gianluigi; Catinaccio, Andrea; Cavalli-Sforza, Matteo; Chauveau, Jacques; Chu, Ming-Lee; Ciapetti, Marco; Cindro, Vladimir; Citterio, Mauro; Clark, Allan; Cobal, Marina; Coelli, Simone; Colijn, Auke-Pieter; Colin, Daly; Collot, Johann; Crespo-Lopez, Olivier; Dalla Betta, Gian-Franco; Darbo, Giovanni; DaVia, Cinzia; David, Pierre-Yves; Debieux, Stéphane; Delebecque, Pierre; Devetak, Erik; DeWilde, Burton; Di Girolamo, Beniamino; Dinu, Nicoleta; Dittus, Fridolin; Diyakov, Denis; Djama, Fares; Dobos, Daniel Adam; Doonan, Kate; Dopke, Jens; Dorholt, Ole; Dube, Sourabh; Dushkin, Andrey; Dzahini, Daniel; Egorov, Kirill; Ehrmann, Oswin; Elldge, David; Elles, Sabine; Elsing, Markus; Eraud, Ludovic; Ereditato, Antonio; Eyring, Andreas; Falchieri, Davide; Falou, Aboud; Fang, Xiaochao; Fausten, Camille; Favre, Yannick; Ferrere, Didier; Fleta, Celeste; Fleury, Julien; Flick, Tobias; Forshaw, Dean; Fougeron, Denis; Fritzsch, Thomas; Gabrielli, Alessandro; Gaglione, Renaud; Gallrapp, Christian; Gan, K; Garcia-Sciveres, Maurice; Gariano, Giuseppe; Gastaldi, Thibaut; Gemme, Claudia; Gensolen, Fabrice; George, Matthias; Ghislain, Patrick; Giacomini, Gabriele; Gibson, Stephen; Giordani, Mario Paolo; Giugni, Danilo; Gjersdal, Håvard; Glitza, Karl Walter; Gnani, Dario; Godlewski, Jan; Gonella, Laura; Gorelov, Igor; Gorišek, Andrej; Gössling, Claus; Grancagnolo, Sergio; Gray, Heather; Gregor, Ingrid-Maria; Grenier, Philippe; Grinstein, Sebastian; Gromov, Vladimir; Grondin, Denis; Grosse-Knetter, Jörn; Hansen, Thor-Erik; Hansson, Per; Harb, Ali; Hartman, Neal; Hasi, Jasmine; Hegner, Franziska; Heim, Timon; Heinemann, Beate; Hemperek, Tomasz; Hessey, Nigel; Hetmánek, Martin; Hoeferkamp, Martin; Hostachy, Jean-Yves; Hügging, Fabian; Husi, Coralie; Iacobucci, Giuseppe; Idarraga, John; Ikegami, Yoichi; Janoška, Zdenko; Jansen, Jens; Jansen, Luc; Jensen, Frank; Jentzsch, Jennifer; Joseph, John; Kagan, Harris; Karagounis, Michael; Kass, Richard; Kenney, Christopher J; Kersten, Susanne; Kind, Peter; Klingenberg, Reiner; Kluit, Ruud; Kocian, Martin; Koffeman, Els; Kok, Angela; Korchak, Oleksandr; Korolkov, Ilya; Kostyukhin, Vadim; Krieger, Nina; Krüger, Hans; Kruth, Andre; Kugel, Andreas; Kuykendall, William; La Rosa, Alessandro; Lai, Chung-Hang; Lantzsch, Kerstin; Laporte, Didier; Lapsien, Tobias; Lounis, abdenour; Lozano, Manuel; Lu, Yunpeng; Lubatti, Henry; Macchiolo, Anna; Mallik, Usha; Mandić, Igor; Marchand, Denis; Marchiori, Giovanni; Massol, Nicolas; Matthias, Wittgen; Mättig, Peter; Mekkaoui, Abderrazak; Menouni, Mohsine; Menu, Johann; Meroni, Chiara; Mesa, Javier; Micelli, Andrea; Michal, Sébastien; Miglioranzi, Silvia; Mikuž, Marko; Mitsui, Shingo; Monti, Mauro; Moore, J; Morettini, Paolo; Muenstermann, Daniel; Murray, Peyton; Nellist, Clara; Nelson, David J; Nessi, Marzio; Neumann, Manuel; Nisius, Richard; Nordberg, Markus; Nuiry, Francois-Xavier; Oppermann, Hermann; Oriunno, Marco; Padilla, Cristobal; Parker, Sherwood; Pellegrini, Giulio; Pelleriti, Gabriel; Pernegger, Heinz; Piacquadio, Nicola Giacinto; Picazio, Attilio; Pohl, David; Polini, Alessandro; Popule, Jiří; Portell Bueso, Xavier; Povoli, Marco; Puldon, David; Pylypchenko, Yuriy; Quadt, Arnulf; Quirion, David; Ragusa, Francesco; Rambure, Thibaut; Richards, Erik; Ristic, Branislav; Røhne, Ole; Rothermund, Mario; Rovani, Alessandro; Rozanov, Alexandre; Rubinskiy, Igor; Rudolph, Matthew Scott; Rummler, André; Ruscino, Ettore; Salek, David; Salzburger, Andreas; Sandaker, Heidi; Schipper, Jan-David; Schneider, Basil; Schorlemmer, Andre; Schroer, Nicolai; Schwemling, Philippe; Seidel, Sally; Seiden, Abraham; Šícho, Petr; Skubic, Patrick; Sloboda, Michal; Smith, D; Sood, Alex; Spencer, Edwin; Strang, Michael; Stugu, Bjarne; Stupak, John; Su, Dong; Takubo, Yosuke; Tassan, Jean; Teng, Ping-Kun; Terada, Susumu; Todorov, Theodore; Tomášek, Michal; Toms, Konstantin; Travaglini, Riccardo; Trischuk, William; Troncon, Clara; Troska, Georg; Tsiskaridze, Shota; Tsurin, Ilya; Tsybychev, Dmitri; Unno, Yoshinobu; Vacavant, Laurent; Verlaat, Bart; Vianello, Elisa; Vigeolas, Eric; von Kleist, Stephan; Vrba, Václav; Vuillermet, Raphaël; Wang, Rui; Watts, Stephen; Weber, Michele; Weber, Marteen; Weigell, Philipp; Weingarten, Jens; Welch, Steven David; Wenig, Siegfried; Wermes, Norbert; Wiese, Andreas; Wittig, Tobias; Yildizkaya, Tamer; Zeitnitz, Christian; Ziolkowski, Michal; Zivkovic, Vladimir; Zoccoli, Antonio; Zorzi, Nicola; Zwalinski, Lukasz

    2012-01-01

    The ATLAS Collaboration will upgrade its semiconductor pixel tracking detector with a new Insertable B-layer (IBL) between the existing pixel detector and the vacuum pipe of the Large Hadron Collider. The extreme operating conditions at this location have necessitated the development of new radiation hard pixel sensor technologies and a new front-end readout chip, called the FE-I4. Planar pixel sensors and 3D pixel sensors have been investigated to equip this new pixel layer, and prototype modules using the FE-I4A have been fabricated and characterized using 120 GeV pions at the CERN SPS and 4 GeV positrons at DESY, before and after module irradiation. Beam test results are presented, including charge collection efficiency, tracking efficiency and charge sharing.

  13. Region based elimination of noise pixels towards optimized classifier models for skin pixel detection

    Directory of Open Access Journals (Sweden)

    Gagandeep Kaur

    2015-03-01

    Full Text Available The extraction of the skin pixels in a human image and rejection of non-skin pixels is called the skin segmentation. Skin pixel detection is the process of extracting the skin pixels in a human image which is typically used as a pre-processing step to extract the face regions from human image. In past, there are several computer vision approaches and techniques have been developed for skin pixel detection. In the process of skin detection, given pixels are been transformed into an appropriate color space such as RGB, HSV etc. And then skin classifier model have been applied to label the pixel into skin or non-skin regions. Here in this research a “Region based elimination of noise pixels and performance analysis of classifier models for skin pixel detection applied on human images” would be performed which involve the process of image representation in color models, elimination of non-skin pixels in the image, and then pre-processing and cleansing of the collected data, feature selection of the human image and then building the model for classifier. In this research and implementation of skin pixels classifier models are proposed with their comparative performance analysis. The definition of the feature vector is simply the selection of skin pixels from the human image or stack of human images. The performance is evaluated by comparing and analysing skin colour segmentation algorithms. During the course of research implementation, efforts are iterative which help in selection of optimized skin classifier based on the machine learning algorithms and their performance analysis.

  14. FE-I4 pixel chip characterization with USBpix3 test system

    Energy Technology Data Exchange (ETDEWEB)

    Filimonov, Viacheslav; Gonella, Laura; Hemperek, Tomasz; Huegging, Fabian; Janssen, Jens; Krueger, Hans; Pohl, David-Leon; Wermes, Norbert [University of Bonn, Bonn (Germany)

    2015-07-01

    The USBpix readout system is a small and light weighting test system for the ATLAS pixel readout chips. It is widely used to operate and characterize FE-I4 pixel modules in lab and test beam environments. For multi-chip modules the resources on the Multi-IO board, that is the central control unit of the readout system, are coming to their limits, which makes the simultaneous readout of more than one chip at a time challenging. Therefore an upgrade of the current USBpix system has been developed. The upgraded system is called USBpix3 - the main focus of the talk. Characterization of single chip FE-I4 modules was performed with USBpix3 prototype (digital, analog, threshold and source scans; tuning). PyBAR (Bonn ATLAS Readout in Python scripting language) was used as readout software. PyBAR consists of FEI4 DAQ and Data Analysis Libraries in Python. The presentation describes the USBpix3 system, results of FE-I4 modules characterization and preparation for the multi-chip module and multi-module readout with USBpix3.

  15. First operation of a pixel imaging matrix based on DEPFET pixels

    CERN Document Server

    Fischer, P; Klein, P; Löcker, M; Lutz, Gerhard; Neeser, W; Strüder, L; Wermes, N

    2000-01-01

    In the DEPFET pixel concept the detected incident radiation is directly sensed and amplified by a JFET integrated in every pixel cell. While the DEPFET detector principle has already been demonstrated previously on single pixel structures, we present here the first successful operation of a large $32 \\times 32$ DEPFET pixel matrix as an imaging device. The matrix has been exposed to 60 keV gamma rays of a $^{241}$Am source and has been scanned using an IR laser. The principle of operation as well as the charge collection in the structure and possible improvements are discussed.

  16. Status of the ATLAS Forward Physics (AFP) Project

    CERN Document Server

    Chytka, L; The ATLAS collaboration

    2012-01-01

    The ATLAS Forward Physics (AFP) project plans to add a set of detectors --- silicon 3D pixel tracking detectors and QUARTIC time of flight detectors --- in the forward region of the ATLAS experiment at the LHC. The AFP detectors will be placed around 210 m from the interaction point and are meant to detect protons produced at small angles. The detectors are to be housed in the so called Hamburg beam pipe --- a movable beam pipe allowing horizontal movement of the detectors. The AFP is currently under approval with possible installation in 2014/15.

  17. ATLAS Outreach Highlights

    CERN Document Server

    Cheatham, Susan; The ATLAS collaboration

    2016-01-01

    The ATLAS outreach team is very active, promoting particle physics to a broad range of audiences including physicists, general public, policy makers, students and teachers, and media. A selection of current outreach activities and new projects will be presented. Recent highlights include the new ATLAS public website and ATLAS Open Data, the very recent public release of 1 fb-1 of ATLAS data.

  18. Spatial clustering of pixels of a multispectral image

    Energy Technology Data Exchange (ETDEWEB)

    Conger, James Lynn

    2014-08-19

    A method and system for clustering the pixels of a multispectral image is provided. A clustering system computes a maximum spectral similarity score for each pixel that indicates the similarity between that pixel and the most similar neighboring. To determine the maximum similarity score for a pixel, the clustering system generates a similarity score between that pixel and each of its neighboring pixels and then selects the similarity score that represents the highest similarity as the maximum similarity score. The clustering system may apply a filtering criterion based on the maximum similarity score so that pixels with similarity scores below a minimum threshold are not clustered. The clustering system changes the current pixel values of the pixels in a cluster based on an averaging of the original pixel values of the pixels in the cluster.

  19. ATLAS Story

    CERN Multimedia

    Nordberg, Markus

    2012-01-01

    This film produced in July 2012 explains how fundamental research connects to Society and what benefits collaborative way of working can and may generate in the future, using ATLAS Collaboration as a case study. The film is intellectually inspired by the book "Collisions and Collaboration" (OUP) by Max Boisot (ed.), see: collisionsandcollaboration.com. The film is directed by Andrew Millington (OMNI Communications)

  20. Probabilistic liver atlas construction

    OpenAIRE

    Dura, Esther; Domingo, Juan; Ayala, Guillermo; Marti-Bonmati, Luis; Goceri, E.

    2017-01-01

    Background Anatomical atlases are 3D volumes or shapes representing an organ or structure of the human body. They contain either the prototypical shape of the object of interest together with other shapes representing its statistical variations (statistical atlas) or a probability map of belonging to the object (probabilistic atlas). Probabilistic atlases are mostly built with simple estimations only involving the data at each spatial location. Results A new method for probabilistic atlas con...

  1. A logarithmic low dark current CMOS pixel

    Science.gov (United States)

    Brunetti, Alessandro Michel; Choubey, Bhaskar

    2016-04-01

    High dynamic range pixels are required in a number of automotive and scientific applications. CMOS pixels provide different approaches to achieve this. However, these suffer from poor performance under low light conditions due to inherently high leakage current that is present in CMOS processes, also known as dark current. The typical approach to reduce this dark current involves process modifications. Nevertheless, energy considerations suggest that the leakage current will be close to zero at a close to zero voltage on the photodiode. Hence, the reduction in dark current can be achieved by forcing a zero voltage across the photodiode. In this paper, a novel logarithmic CMOS pixel design capable of reducing dark current without any process modifications is proposed. This pixel is also able to produce a wide dynamic range response. This circuit utilizes two current mirrors to force the in-pixel photodiode at a close to zero voltage. Additionally, a bias voltage is used to reduce a higher order effect known as Drain Induced Barrier Lowering (DIBL). In fact, the contribution of this effect can be compensated by increasing the body effect. In this paper, we studied the consequences of a negative bias voltage applied to the body of the current mirror pair to compensate for the DIBL effect thereby achieving a very small voltage drop on the photodiode and consequently, a higher sensitivity in low light conditions.

  2. Radiation Tolerance of CMOS Monolithic Active Pixel Sensors with Self-Biased Pixels

    CERN Document Server

    Deveaux, M; Besson, A; Claus, G; Colledani, C; Dorokhov, M; Dritsa, C; Dulinski, W; Fröhlich, I; Goffe, M; Grandjean, D; Heini, S; Himmi, A; Hu, C; Jaaskelainen, K; Müntz, C; Shabetai, A; Stroth, J; Szelezniak, M; Valin, I; Winter, M

    2009-01-01

    CMOS Monolithic Active Pixel Sensors (MAPS) are proposed as a technology for various vertex detectors in nuclear and particle physics. We discuss the mechanisms of ionizing radiation damage on MAPS hosting the the dead time free, so-called self bias pixel. Moreover, we discuss radiation hardened sensor designs which allow operating detectors after exposing them to irradiation doses above 1 Mrad

  3. The ATLAS Insertable B-Layer: from construction to operation

    CERN Document Server

    La Rosa, Alessandro; The ATLAS collaboration

    2016-01-01

    The ATLAS Insertable B-Layer (IBL) is the innermost layer of pixel detectors, and was installed in May 2014 at a radius of 3.3 cm from the beam axis, between the existing Pixel detector and a new smaller radius beam-pipe. The new detector, built to cope with high radiation and occupancy, is the first large scale application of 3D sensors and CMOS 130 nm technology. The IBL detector construction was completed within about two years (2012-2014), and the key features and challenges met during the IBL project are presented, as well as its commissioning and operational experience at the LHC

  4. The ATLAS Insertable B-Layer: from construction to operation

    Science.gov (United States)

    La Rosa, A.

    2016-12-01

    The ATLAS Insertable B-Layer (IBL) is the innermost layer of pixel detectors, and was installed in May 2014 at a radius of 3.3 cm from the beam axis, between the existing Pixel detector and a new smaller radius beam-pipe. The new detector, built to cope with high radiation and occupancy, is the first large scale application of 3D sensors and CMOS 130 nm technology. The IBL detector construction was completed within about two years (2012 – 2014), and the key features and challenges met during the IBL project are presented, as well as its commissioning and operational experience at the LHC.

  5. Development of CMOS Pixel Sensors with digital pixel dedicated to future particle physics experiments

    Science.gov (United States)

    Zhao, W.; Wang, T.; Pham, H.; Hu-Guo, C.; Dorokhov, A.; Hu, Y.

    2014-02-01

    Two prototypes of CMOS pixel sensor with in-pixel analog to digital conversion have been developed in a 0.18 μm CIS process. The first design integrates a discriminator into each pixel within an area of 22 × 33 μm2 in order to meet the requirements of the ALICE inner tracking system (ALICE-ITS) upgrade. The second design features 3-bit charge encoding inside a 35 × 35 μm2 pixel which is motivated by the specifications of the outer layers of the ILD vertex detector (ILD-VXD). This work aims to validate the concept of in-pixel digitization which offers higher readout speed, lower power consumption and less dead zone compared with the column-level charge encoding.

  6. Operational Experience with the CMS Pixel Detector

    CERN Document Server

    Karancsi, Janos

    2016-01-01

    The CMS pixel detector was repaired successfully, calibrated and commissioned for the second run of Large Hadron Collider during the first long shutdown between 2013 and 2015. The replaced pixel modules were calibrated separately and show the expected behavior of an un-irradiated detector. In 2015, the system performed very well with an even improved spatial resolution compared to 2012. During this time, the operational team faced various challenges including the loss of a sector in one half shell which was only partially recovered. In 2016, the detector is expected to withstand instantaneous luminosities beyond the design limits and will need a combined effort of both online and offline teams in order to provide the high quality data that is required to reach the physics goals of CMS. We present the operational experience gained during the second run of the LHC and show the latest performance results of the CMS pixel detector.

  7. Active Pixel Sensors: Are CCD's Dinosaurs?

    Science.gov (United States)

    Fossum, Eric R.

    1993-01-01

    Charge-coupled devices (CCD's) are presently the technology of choice for most imaging applications. In the 23 years since their invention in 1970, they have evolved to a sophisticated level of performance. However, as with all technologies, we can be certain that they will be supplanted someday. In this paper, the Active Pixel Sensor (APS) technology is explored as a possible successor to the CCD. An active pixel is defined as a detector array technology that has at least one active transistor within the pixel unit cell. The APS eliminates the need for nearly perfect charge transfer -- the Achilles' heel of CCDs. This perfect charge transfer makes CCD's radiation 'soft,' difficult to use under low light conditions, difficult to manufacture in large array sizes, difficult to integrate with on-chip electronics, difficult to use at low temperatures, difficult to use at high frame rates, and difficult to manufacture in non-silicon materials that extend wavelength response.

  8. Towards spark-proof gaseous pixel detectors

    Science.gov (United States)

    Tsigaridas, S.; Beuzekom, M. v.; Chan, H. W.; Graaf, H. v. d.; Hartjes, F.; Heijhoff, K.; Hessey, N. P.; Prodanovic, V.

    2016-11-01

    The micro-pattern gaseous pixel detector, is a promising technology for imaging and particle tracking applications. It is a combination of a gas layer acting as detection medium and a CMOS pixelated readout-chip. As a prevention against discharges we deposit a protection layer on the chip and then integrate on top a micromegas-like amplification structure. With this technology we are able to reconstruct 3D track segments of particles passing through the gas thanks to the functionality of the chip. We have turned a Timepix3 chip into a gaseous pixel detector and tested it at the SPS at Cern. The preliminary results are promising and within the expectations. However, the spark protection layer needs further improvement to make reliable detectors. For this reason, we have created a setup for spark-testing. We present the first results obtained from the lab-measurements along with preliminary results from the testbeam.

  9. Per-Pixel Lighting Data Analysis

    Energy Technology Data Exchange (ETDEWEB)

    Inanici, Mehlika

    2005-08-01

    This report presents a framework for per-pixel analysis of the qualitative and quantitative aspects of luminous environments. Recognizing the need for better lighting analysis capabilities and appreciating the new measurement abilities developed within the LBNL Lighting Measurement and Simulation Toolbox, ''Per-pixel Lighting Data Analysis'' project demonstrates several techniques for analyzing luminance distribution patterns, luminance ratios, adaptation luminance and glare assessment. The techniques are the syntheses of the current practices in lighting design and the unique practices that can be done with per-pixel data availability. Demonstrated analysis techniques are applicable to both computer-generated and digitally captured images (physically-based renderings and High Dynamic Range photographs).

  10. Infrared single-pixel imaging utilising microscanning

    CERN Document Server

    Sun, Ming-Jie; Phillips, David B; Gibson, Graham M; Padgett, Miles J

    2015-01-01

    Since the invention of digital cameras there has been a concerted drive towards detector arrays with higher spatial resolution. Microscanning is a technique that provides a final higher resolution image by combining multiple images of a lower resolution. Each of these low resolution images is subject to a sub-pixel sized lateral displacement. In this work we apply the microscanning approach to an infrared single-pixel camera. For the same final resolution and measurement resource, we show that microscanning improves the signal-to-noise ratio (SNR) of reconstructed images by approximately 50%. In addition, this strategy also provides access to a stream of low-resolution 'preview' images throughout each high-resolution acquisition. Our work demonstrates an additional degree of flexibility in the trade-off between SNR and spatial resolution in single-pixel imaging techniques.

  11. Performance tests during the ATLAS IBL Stave Integration

    CERN Document Server

    Jentzsch, Jennifer; The ATLAS collaboration

    2015-01-01

    In preparation of the ATLAS Pixel Insertable B-Layer integration, detector components, so called staves, were mounted around the Beryllium ATLAS beam pipe and tested using production quality assurance measurements as well as dedicated data taking runs to validate a correct grounding and shielding schema. Each stave consists of 32 FE-I4 readout chips of roughly 2x2cm size which sums up to over 860k pixels per stave. The integration tests include verification that neither the silicon n-in-n nor the silicon 3D sensors were damaged by mechanical stress, and that their readout chips, including their bump bond and wire bond connections, did not suffered from the integration process. Evolution of the IBL performance during its integration will be discussed as well as its final performance before installation.

  12. 3D-FBK Pixel sensors: recent beam tests results with irradiated devices

    CERN Document Server

    Micelli, A; Sandaker, H; Stugu, B; Barbero, M; Hugging, F; Karagounis, M; Kostyukhin, V; Kruger, H; Tsung, J W; Wermes, N; Capua, M; Fazio, S; Mastroberardino, A; Susinno, G; Gallrapp, C; Di Girolamo, B; Dobos, D; La Rosa, A; Pernegger, H; Roe, S; Slavicek, T; Pospisil, S; Jakobs, K; Kohler, M; Parzefall, U; Darbo, G; Gariano, G; Gemme, C; Rovani, A; Ruscino, E; Butter, C; Bates, R; Oshea, V; Parker, S; Cavalli-Sforza, M; Grinstein, S; Korokolov, I; Pradilla, C; Einsweiler, K; Garcia-Sciveres, M; Borri, M; Da Via, C; Freestone, J; Kolya, S; Lai, C H; Nellist, C; Pater, J; Thompson, R; Watts, S J; Hoeferkamp, M; Seidel, S; Bolle, E; Gjersdal, H; Sjobaek, K N; Stapnes, S; Rohne, O; Su, D; Young, C; Hansson, P; Grenier, P; Hasi, J; Kenney, C; Kocian, M; Jackson, P; Silverstein, D; Davetak, H; DeWilde, B; Tsybychev, D; Dalla Betta, G F; Gabos, P; Povoli, M; Cobal, M; Giordani, M P; Selmi, L; Cristofoli, A; Esseni, D; Palestri, P; Fleta, C; Lozano, M; Pellegrini, G; Boscardin, M; Bagolini, A; Piemonte, C; Ronchin, S; Zorzi, N; Hansen, T E; Hansen, T; Kok, A; Lietaer, N; Kalliopuska, J; Oja, A

    2011-01-01

    The Pixel detector is the innermost part of the ATLAS experiment tracking device at the Large Hadron Collider (LHC), and plays a key role in the reconstruction of the primary and secondary vertices of short-lived particles. To cope with the high level of radiation produced during the collider operation, it is planned to add to the present three layers of silicon pixel sensors which constitute the Pixel Detector, an additional layer (Insertable B-Layer, or IBL) of sensors. 3D silicon sensors are one of the technologies which are under study for the IBL. 3D silicon technology is an innovative combination of very-large-scale integration (VLSI) and Micro-Electro-Mechanical-Systems (MEMS) where electrodes are fabricated inside the silicon bulk instead of being implanted on the wafer surfaces. 3D sensors, with electrodes fully or partially penetrating the silicon substrate, are currently fabricated at different processing facilities in Europe and USA. This paper reports on the 2010 June beam test results for irradi...

  13. Results with p-type pixel sensors with different geometries for the HL-LHC

    Energy Technology Data Exchange (ETDEWEB)

    Allport, P.P. [Department of Physics, University of Liverpool, Oxford Road, Liverpool, L69 7ZE (United Kingdom); Bates, R.; Butter, C. [Department of Physics and Astronomy, University of Glasgow, Glasgow G12 8QQ (United Kingdom); Casse, G. [Department of Physics, University of Liverpool, Oxford Road, Liverpool, L69 7ZE (United Kingdom); Dervan, P.J., E-mail: Paul.Dervan@cern.ch [Department of Physics, University of Liverpool, Oxford Road, Liverpool, L69 7ZE (United Kingdom); Forshaw, D.; Tsurin, I. [Department of Physics, University of Liverpool, Oxford Road, Liverpool, L69 7ZE (United Kingdom)

    2013-12-11

    Pixel detectors will be extensively used for the four innermost layers of the upgraded ATLAS experiment at the future High Luminosity LHC (HL-LHC) at CERN. The total area of pixel sensors will be over 5 m{sup 2}. The silicon sensors that will instrument the pixel volume will have to face several technology challenges. They will have to withstand doses up to 2×10{sup 16} n{sub eq}cm{sup −2}, to have a reduced inactive area at the edge of the sensors still being able to hold 1000 V bias voltage and to be relatively low cost considering the large area to be covered. N-side readout on p-type bulk is the most promising technology for satisfying the various requirements. Several sensor types have been produced in the UK, conceived for various readout systems, for studying the properties of n-in-p and n-in-n sensors before and after irradiation with test beam and laboratory measurements. The status of these studies is presented here.

  14. A 65 nm CMOS analog processor with zero dead time for future pixel detectors

    Science.gov (United States)

    Gaioni, L.; Braga, D.; Christian, D. C.; Deptuch, G.; Fahim, F.; Nodari, B.; Ratti, L.; Re, V.; Zimmerman, T.

    2017-02-01

    Next generation pixel chips at the High-Luminosity (HL) LHC will be exposed to extremely high levels of radiation and particle rates. In the so-called Phase II upgrade, ATLAS and CMS will need a completely new tracker detector, complying with the very demanding operating conditions and the delivered luminosity (up to 5×1034 cm-2 s-1 in the next decade). This work is concerned with the design of a synchronous analog processor with zero dead time developed in a 65 nm CMOS technology, conceived for pixel detectors at the HL-LHC experiment upgrades. It includes a low noise, fast charge sensitive amplifier featuring a detector leakage compensation circuit, and a compact, single ended comparator that guarantees very good performance in terms of channel-to-channel dispersion of threshold without needing any pixel-level trimming. A flash ADC is exploited for digital conversion immediately after the charge amplifier. A thorough discussion on the design of the charge amplifier and the comparator is provided along with an exhaustive set of simulation results.

  15. Low mass hybrid pixel detectors for the high luminosity LHC upgrade

    Energy Technology Data Exchange (ETDEWEB)

    Gonella, Laura

    2013-10-15

    Reducing material in silicon trackers is of major importance for a good overall detector performance, and poses severe challenges to the design of the tracking system. To match the low mass constraints for trackers in High Energy Physics experiments at high luminosity, dedicated technological developments are required. This dissertation presents three technologies to design low mass hybrid pixel detectors for the high luminosity upgrades of the LHC. The work targets specifically the reduction of the material from the detector services and modules, with novel powering schemes, flip chip and interconnection technologies. A serial powering scheme is prototyped, featuring a new regulator concept, a control and protection element, and AC-coupled data transmission. A modified flip chip technology is developed for thin, large area Front-End chips, and a via last Through Silicon Via process is demonstrated on existing pixel modules. These technologies, their developments, and the achievable material reduction are discussed using the upgrades of the ATLAS pixel detector as a case study.

  16. Advanced Alignment of the ATLAS Tracking System

    CERN Document Server

    Butti, P; The ATLAS collaboration

    2014-01-01

    In order to reconstruct the trajectories of charged particles, the ATLAS experiment exploits a tracking system built using different technologies, planar silicon modules or microstrips (PIX and SCT detectors) and gaseous drift tubes (TRT), all embedded in a 2T solenoidal magnetic field. Misalignments and deformations of the active detector elements deteriorate the track reconstruction resolution and lead to systematic biases on the measured track parameters. The alignment procedures exploits various advanced tools and techniques in order to determine for module positions and correct for deformations. For the LHC Run II, the system is being upgraded with the installation of a new pixel layer, the Insertable B-layer (IBL).

  17. The LHC Luminosity Upgrade and Related ATLAS Detector Plans

    CERN Document Server

    Hartjes, F; The ATLAS collaboration

    2009-01-01

    3rd draft of the proposed talk about Atlas Upgrade for MPGD2009 (Instrumentation conference on gaseous pixel detectors) on Friday June 12, 2009. I concentrated my presentation on the upgrade plans and schedule of the LHC and on detector technologies for the new Inner Tracker, putting less emphasis on other subdetectors. Compared to the 2nd draft I modified and clarified a few items about trigger, muon detection and calorimetry and did a number of cosmetic adaptions.

  18. From Hybrid to CMOS Pixels ... a possibility for LHC's pixel future?

    CERN Document Server

    Wermes, Norbert

    2015-01-01

    Hybrid pixel detectors have been invented for the LHC to make tracking and vertexing possible at all in LHC's radiation intense environment. The LHC pixel detectors have meanwhile very successfully fulfilled their promises and R\\&D for the planned HL-LHC upgrade is in full swing, targeting even higher ionising doses and non-ionising fluences. In terms of rate and radiation tolerance hybrid pixels are unrivaled. But they have disadvantages as well, most notably material thickness, production complexity, and cost. Meanwhile also active pixel sensors (DEPFET, MAPS) have become real pixel detectors but they would by far not stand the rates and radiation faced from HL-LHC. New MAPS developments, so-called DMAPS (depleted MAPS) which are full CMOS-pixel structures with charge collection in a depleted region have come in the R\\&D focus for pixels at high rate/radiation levels. This goal can perhaps be realised exploiting HV technologies, high ohmic substrates and/or SOI based technologies. The paper covers t...

  19. ATLAS Recordings

    CERN Multimedia

    Steven Goldfarb; Mitch McLachlan; Homer A. Neal

    Web Archives of ATLAS Plenary Sessions, Workshops, Meetings, and Tutorials from 2005 until this past month are available via the University of Michigan portal here. Most recent additions include the Trigger-Aware Analysis Tutorial by Monika Wielers on March 23 and the ROOT Workshop held at CERN on March 26-27.Viewing requires a standard web browser with RealPlayer plug-in (included in most browsers automatically) and works on any major platform. Lectures can be viewed directly over the web or downloaded locally.In addition, you will find access to a variety of general tutorials and events via the portal.Feedback WelcomeOur group is making arrangements now to record plenary sessions, tutorials, and other important ATLAS events for 2007. Your suggestions for potential recording, as well as your feedback on existing archives is always welcome. Please contact us at wlap@umich.edu. Thank you.Enjoy the Lectures!

  20. CMS has a heart of pixels

    CERN Multimedia

    2003-01-01

    At the core of CMS, particles will come into contact with tiny detector components, known as pixels, which are almost invisible to the naked eye. With these elementary cells measuring a mere 150 microns (or about 1/10 of a millimetre) along each side, a real technological leap has been made.

  1. Sensor development for the CMS pixel detector

    CERN Document Server

    Bölla, G; Horisberger, R P; Kaufmann, R; Rohe, T; Roy, A

    2002-01-01

    The CMS experiment which is currently under construction at the Large Hadron Collider (LHC) at CERN (Geneva, Switzerland) will contain a pixel detector which provides in its final configuration three space points per track close to the interaction point of the colliding beams. Because of the harsh radiation environment of the LHC, the technical realization of the pixel detector is extremely challenging. The readout chip as the most damageable part of the system is believed to survive a particle fluence of 6x10 sup 1 sup 4 n sub e sub q /cm sup 2 (All fluences are normalized to 1 MeV neutrons and therefore all components of the hybrid pixel detector have to perform well up to at least this fluence. As this requires a partially depleted operation of the silicon sensors after irradiation-induced type inversion of the substrate, an ''n in n'' concept has been chosen. In order to perform IV-tests on wafer level and to hold accidentally unconnected pixels close to ground potential, a resistive path between the pixe...

  2. Dynamic holography using pixelated light modulators.

    Science.gov (United States)

    Zwick, Susanne; Haist, Tobias; Warber, Michael; Osten, Wolfgang

    2010-09-01

    Dynamic holography using spatial light modulators is a very flexible technique that offers various new applications compared to static holography. We give an overview on the technical background of dynamic holography focusing on pixelated spatial light modulators and their technical restrictions, and we present a selection of the numerous applications of dynamic holography.

  3. ATLAS UPGRADES

    CERN Document Server

    Lacasta, C; The ATLAS collaboration

    2014-01-01

    After the successful LHC operation at the center-of-mass energies of 7 and 8 TeV in 2010 - 2012, plans are actively advancing for a series of upgrades of the accelerator, culminating roughly ten years from now in the high luminosity LHC (HL-LHC) project, delivering of the order of five times the LHC nominal instantaneous luminosity along with luminosity leveling. The final goal is to extend the dataset from about few hundred fb−1 expected for LHC running to 3000 fb−1 by around 2035 for ATLAS and CMS. In parallel the experiments need to be keep lockstep with the accelerator to accommodate running beyond the nominal luminosity this decade. Current planning in ATLAS envisions significant upgrades to the detector during the consolidation of the LHC to reach full LHC energy and further upgrades. The challenge of coping with the HL-LHC instantaneous and integrated luminosity, along with the associated radiation levels, requires further major changes to the ATLAS detector. The designs are developing rapidly for ...

  4. The FE-I4 pixel readout system-on-chip resubmission for the insertable B-Layer project

    CERN Document Server

    Zivkovic, V; Garcia-Sciveres, M; Mekkaoui, A; Barbero, M; Darbo, G; Gnani, D; Hemperek, T; Menouni, M; Fougeron, D; Gensolen, F; Jensen, F; Caminada, L; Gromov, V; Kluit, R; Fleury, J; Krüger, H; Backhaus, M; Fang, X; Gonella, L; Rozanove, A; Arutinov, D

    2012-01-01

    The FE-I4 is a new pixel readout integrated circuit designed to meet the requirements of ATLAS experiment upgrades. The first samples of the FE-I4 engineering run (called FE-I4A) delivered promising results in terms of the requested performances. The FE-I4 team envisaged a number of modifications and fine-tuning before the actual exploitation, planned within the Insertable B-Layer (IBL) of ATLAS. As the IBL schedule was pushed significantly forward, a quick and efficient plan had to be devised for the FE-I4 redesign. This article will present the main objectives of the resubmission, together with the major changes that were a driving factor for this redesign. In addition, the top-level verification and test efforts of the FE-I4 will also be addressed.

  5. Adaptive bad pixel correction algorithm for IRFPA based on PCNN

    Science.gov (United States)

    Leng, Hanbing; Zhou, Zuofeng; Cao, Jianzhong; Yi, Bo; Yan, Aqi; Zhang, Jian

    2013-10-01

    Bad pixels and response non-uniformity are the primary obstacles when IRFPA is used in different thermal imaging systems. The bad pixels of IRFPA include fixed bad pixels and random bad pixels. The former is caused by material or manufacture defect and their positions are always fixed, the latter is caused by temperature drift and their positions are always changing. Traditional radiometric calibration-based bad pixel detection and compensation algorithm is only valid to the fixed bad pixels. Scene-based bad pixel correction algorithm is the effective way to eliminate these two kinds of bad pixels. Currently, the most used scene-based bad pixel correction algorithm is based on adaptive median filter (AMF). In this algorithm, bad pixels are regarded as image noise and then be replaced by filtered value. However, missed correction and false correction often happens when AMF is used to handle complex infrared scenes. To solve this problem, a new adaptive bad pixel correction algorithm based on pulse coupled neural networks (PCNN) is proposed. Potential bad pixels are detected by PCNN in the first step, then image sequences are used periodically to confirm the real bad pixels and exclude the false one, finally bad pixels are replaced by the filtered result. With the real infrared images obtained from a camera, the experiment results show the effectiveness of the proposed algorithm.

  6. Entwurf und Implementation eines Expertensystems für das Detektorkontrollsystem des ATLAS-Pixeldetektors

    CERN Document Server

    Henß, Tobias

    This thesis describes the design and implementation of an Expert System for the Detector Control System of the ATLAS Pixel Detector at the European center for particle physics, CERN. The ATLAS-Experiment is one of four big experiments installed at the Large Hadron Collider and is itself composed of multiple particle detectors. The innermost of these sub-detectors is the ATLAS Pixel detector, whose more than 30000 operating parameters impose high requirements on the hard- and software of the Detector Control System. In order to support the shift personnel during regular detector operation, an Expert System for the Detector Control System, which provides troubleshooting instructions, was developed within the scope of this work. To allow for a precise mapping of the available human experts knowledge to the Expert System, a rule based and easily adaptable system was designed. The use of the DIM protocol furthermore enables the adoption for other detectors or the data acquisition system. Special emphasis was pu...

  7. Alignment of the ATLAS Inner Detector in the LHC Run II

    CERN Document Server

    Barranco Navarro, Laura; The ATLAS collaboration

    2015-01-01

    ATLAS physics goals require excellent resolution, unbiased measurement of all charged particle kinematic parameters. These critically depend on the layout and performance of the tracking system and on the quality of its offline alignment. ATLAS is equipped with a tracking system built using different technologies, silicon planar sensors (pixel and micro-strip) and gaseous drift- tubes, all embedded in a 2T solenoidal magnetic field. For the Run II of the LHC, the system was upgraded with the installation of a new pixel layer, the Insertable B-layer (IBL). An outline of the track based alignment approach and its implementation within the ATLAS software will be presented. Special attention will be paid to integration of the IBL into the alignment framework, techniques allowing to identify and eliminate tracking systematics as well as strategies to deal with time-dependent alignment. Performance from the commissioning of Cosmic data and potentially early LHC Run II proton-proton collisions will be discussed.

  8. Design Methodology: ASICs with complex in-pixel processing for Pixel Detectors

    Energy Technology Data Exchange (ETDEWEB)

    Fahim, Farah [Fermilab

    2014-10-31

    The development of Application Specific Integrated Circuits (ASIC) for pixel detectors with complex in-pixel processing using Computer Aided Design (CAD) tools that are, themselves, mainly developed for the design of conventional digital circuits requires a specialized approach. Mixed signal pixels often require parasitically aware detailed analog front-ends and extremely compact digital back-ends with more than 1000 transistors in small areas below 100μm x 100μm. These pixels are tiled to create large arrays, which have the same clock distribution and data readout speed constraints as in, for example, micro-processors. The methodology uses a modified mixed-mode on-top digital implementation flow to not only harness the tool efficiency for timing and floor-planning but also to maintain designer control over compact parasitically aware layout.

  9. Analysis of the Radiation Field in ATLAS Using 2008 2011 Data from the ATLAS-MPX Network

    CERN Document Server

    Campbell, M; The ATLAS collaboration; Leroy, C; Martin, J-P; Mornacchi, G; Nessi, M; Pospisil, S; Solc, J; Soueid, P; Suk, M; Turecek, D; Vykydal, Z

    2013-01-01

    The ATLAS-MPX collaboration has installed a network of 16 Medipix2 pixel detector based, single-quantum-sensitive devices before the LHC start-up in 2008 at various positions in the ATLAS experimental and technical caverns. The aim of the network is to perform real-time measurements of spectral characteristics and composition of the radiation environment inside the ATLAS detector during its operation and in particular already in the early stages with low luminosity. The detectors are generally sensitive to all radiation species capable to deposit energy of at least 8 keV per single pixel. With the devices, in two different modes of operation, a large dynamic range of particle flux can be covered, of at least 9 orders of magnitude, which corresponds to the highest luminosity, while also background measurement can be made. An important goal is the determination of the neutron component of the mixed radiation field. To identify different types of neutrons, the 300 μm thick silicon sensor area of each ATLAS-MPX ...

  10. Design methodology: edgeless 3D ASICs with complex in-pixel processing for pixel detectors

    Energy Technology Data Exchange (ETDEWEB)

    Fahim Farah, Fahim Farah [Northwestern U. (main); Deptuch, Grzegorz W. [Fermilab; Hoff, James R. [Fermilab; Mohseni, Hooman [Northwestern U. (main)

    2015-08-28

    The design methodology for the development of 3D integrated edgeless pixel detectors with in-pixel processing using Electronic Design Automation (EDA) tools is presented. A large area 3 tier 3D detector with one sensor layer and two ASIC layers containing one analog and one digital tier, is built for x-ray photon time of arrival measurement and imaging. A full custom analog pixel is 65μm x 65μm. It is connected to a sensor pixel of the same size on one side, and on the other side it has approximately 40 connections to the digital pixel. A 32 x 32 edgeless array without any peripheral functional blocks constitutes a sub-chip. The sub-chip is an indivisible unit, which is further arranged in a 6 x 6 array to create the entire 1.248cm x 1.248cm ASIC. Each chip has 720 bump-bond I/O connections, on the back of the digital tier to the ceramic PCB. All the analog tier power and biasing is conveyed through the digital tier from the PCB. The assembly has no peripheral functional blocks, and hence the active area extends to the edge of the detector. This was achieved by using a few flavors of almost identical analog pixels (minimal variation in layout) to allow for peripheral biasing blocks to be placed within pixels. The 1024 pixels within a digital sub-chip array have a variety of full custom, semi-custom and automated timing driven functional blocks placed together. The methodology uses a modified mixed-mode on-top digital implementation flow to not only harness the tool efficiency for timing and floor-planning but also to maintain designer control over compact parasitically aware layout. The methodology uses the Cadence design platform, however it is not limited to this tool.

  11. PixelSNE: Visualizing Fast with Just Enough Precision via Pixel-Aligned Stochastic Neighbor Embedding

    OpenAIRE

    Kim, Minjeong; Choi, Minsuk; Lee, Sunwoong; Tang, Jian; Park, Haesun; Choo, Jaegul

    2016-01-01

    Embedding and visualizing large-scale high-dimensional data in a two-dimensional space is an important problem since such visualization can reveal deep insights out of complex data. Most of the existing embedding approaches, however, run on an excessively high precision, ignoring the fact that at the end, embedding outputs are converted into coarse-grained discrete pixel coordinates in a screen space. Motivated by such an observation and directly considering pixel coordinates in an embedding ...

  12. Atlases: Complex models of geospace

    Directory of Open Access Journals (Sweden)

    Ikonović Vesna

    2005-01-01

    Full Text Available Atlas is modeled contexture contents of treated thematic of space on optimal map union. Atlases are higher form of cartography. Atlases content composition of maps which are different by projection, scale, format methods, contents, usage and so. Atlases can be classified by multi criteria. Modern classification of atlases by technology of making would be on: 1. classical or traditional (printed on paper and 2. electronic (made on electronic media - computer or computer station. Electronic atlases divided in three large groups: view-only electronic atlases, 2. interactive electronic atlases and 3. analytical electronic atlases.

  13. ACS/WFC Pixel Stability - Bringing the Pixels Back to the Science

    Science.gov (United States)

    Borncamp, David; Grogin, Norman A.; Bourque, Matthew; Ogaz, Sara

    2016-06-01

    Electrical current that has been trapped within the lattice structure of a Charged Coupled Device (CCD) can be present through multiple exposures, which will have an adverse effect on its science performance. The traditional way to correct for this extra charge is to take an image with the camera shutter closed periodically throughout the lifetime of the instrument. These images, generally referred to as dark images, allow for the characterization of the extra charge that is trapped within the CCD at the time of observation. This extra current can then be subtracted out of science images to correct for the extra charge that was there at this time. Pixels that have a charge above a certain threshold of current are marked as “hot” and flagged in the data quality array. However, these pixels may not be "bad" in the traditional sense that they cannot be reliably dark-subtracted. If these pixels are shown to be stable over an anneal period, the charge can be properly subtracted and the extra noise from this dark current can be taken into account. We present the results of a pixel history study that analyzes every pixel of ACS/WFC individually and allows pixels that were marked as bad to be brought back into the science image.

  14. Recent ATLAS Articles on WLAP

    CERN Multimedia

    J. Herr

    As reported in the September 2004 ATLAS eNews, the Web Lecture Archive Project is a system for the archiving and publishing of multimedia presentations, using the Web as medium. We list here newly available WLAP items relating to ATLAS: Atlas Physics Workshop 6-11 June 2005 June 2005 ATLAS Week Plenary Session Click here to browse WLAP for all ATLAS lectures.

  15. Report to users of ATLAS

    Energy Technology Data Exchange (ETDEWEB)

    Ahmad, I.; Glagola, B. [eds.

    1995-05-01

    This report contains discussing in the following areas: Status of the Atlas accelerator; highlights of recent research at Atlas; concept for an advanced exotic beam facility based on Atlas; program advisory committee; Atlas executive committee; and Atlas and ANL physics division on the world wide web.

  16. Monolithic pixel detectors for high energy physics

    CERN Document Server

    Snoeys, W

    2013-01-01

    Monolithic pixel detectors integrating sensor matrix and readout in one piece of silicon have revolutionized imaging for consumer applications, but despite years of research they have not yet been widely adopted for high energy physics. Two major requirements for this application, radiation tolerance and low power consumption, require charge collection by drift for the most extreme radiation levels and an optimization of the collected signal charge over input capacitance ratio ( Q / C ). It is shown that monolithic detectors can achieve Q / C for low analog power consumption and even carryout the promise to practically eliminate analog power consumption, but combining suf fi cient Q / C , collection by drift, and integration of readout circuitry within the pixel remains a challenge. An overview is given of different approaches to address this challenge, with possible advantages and disadvantages.

  17. Advanced monolithic pixel sensors using SOI technology

    Science.gov (United States)

    Miyoshi, Toshinobu; Arai, Yasuo; Asano, Mari; Fujita, Yowichi; Hamasaki, Ryutaro; Hara, Kazuhiko; Honda, Shunsuke; Ikegami, Yoichi; Kurachi, Ikuo; Mitsui, Shingo; Nishimura, Ryutaro; Tauchi, Kazuya; Tobita, Naoshi; Tsuboyama, Toru; Yamada, Miho

    2016-07-01

    We are developing advanced pixel sensors using silicon-on-insulator (SOI) technology. A SOI wafer is used; top silicon is used for electric circuit and bottom silicon is used as a sensor. Target applications are high-energy physics, X-ray astronomy, material science, non-destructive inspection, medical application and so on. We have developed two integration-type pixel sensors, FPIXb and INTPIX7. These sensors were processed on single SOI wafers with various substrates in n- or p-type and double SOI wafers. The development status of double SOI sensors and some up-to-date test results of n-type and p-type SOI sensors are shown.

  18. Noise in a CMOS digital pixel sensor

    Institute of Scientific and Technical Information of China (English)

    Zhang Chi; Yao Suying; Xu Jiangtao

    2011-01-01

    Based on the study of noise performance in CMOS digital pixel sensor (DPS),a mathematical model of noise is established with the pulse-width-modulation (PWM) principle.Compared with traditional CMOS image sensors,the integration time is different and A/D conversion is implemented in each PWM DPS pixel.Then,the quantitative calculating formula of system noise is derived.It is found that dark current shot noise is the dominant noise source in low light region while photodiode shot noise becomes significantly important in the bright region.In this model,photodiode shot noise does not vary with luminance,but dark current shot noise does.According to increasing photodiode capacitance and the comparator's reference voltage or optimizing the mismatch in the comparator,the total noise can be reduced.These results serve as a guideline for the design of PWM DPS.

  19. ATLAS Data Access Policy

    CERN Document Server

    The ATLAS collaboration

    2015-01-01

    ATLAS has fully supported the principle of open access in its publication policy. This document outlines the policy of ATLAS as regards open access to data at different levels as described in the DPHEP model. The main objective is to make the data available in a usable way to people external to the ATLAS collaboration.

  20. Production chain of CMS pixel modules

    CERN Multimedia

    2006-01-01

    The pictures show the production chain of pixel modules for the CMS detector. Fig.1: overview of the assembly procedure. Fig.2: bump bonding with ReadOut Chip (ROC) connected to the sensor. Fig.3: glueing a raw module onto the baseplate strips. Fig.4: glueing of the High Density Interconnect (HDI) onto a raw module. Fig.5: pull test after heat reflow. Fig.6: wafer sensor processing, Indium evaporation.

  1. The Belle II DEPFET pixel detector

    Energy Technology Data Exchange (ETDEWEB)

    Moser, Hans-Günther, E-mail: moser@mpp.mpg.de

    2016-09-21

    The Belle II experiment at KEK (Tsukuba, Japan) will explore heavy flavour physics (B, charm and tau) at the starting of 2018 with unprecedented precision. Charged particles are tracked by a two-layer DEPFET pixel device (PXD), a four-layer silicon strip detector (SVD) and the central drift chamber (CDC). The PXD will consist of two layers at radii of 14 mm and 22 mm with 8 and 12 ladders, respectively. The pixel sizes will vary, between 50 μm×(55–60) μm in the first layer and between 50 μm×(70–85) μm in the second layer, to optimize the charge sharing efficiency. These innermost layers have to cope with high background occupancy, high radiation and must have minimal material to reduce multiple scattering. These challenges are met using the DEPFET technology. Each pixel is a FET integrated on a fully depleted silicon bulk. The signal charge collected in the ‘internal gate’ modulates the FET current resulting in a first stage amplification and therefore very low noise. This allows very thin sensors (75 μm) reducing the overall material budget of the detector (0.21% X{sub 0}). Four fold multiplexing of the column parallel readout allows read out a full frame of the pixel matrix in only 20 μs while keeping the power consumption low enough for air cooling. Only the active electronics outside the detector acceptance has to be cooled actively with a two phase CO{sub 2} system. Furthermore the DEPFET technology offers the unique feature of an electronic shutter which allows the detector to operate efficiently in the continuous injection mode of superKEKB.

  2. Efficient segmentation by sparse pixel classification

    DEFF Research Database (Denmark)

    Dam, Erik B; Loog, Marco

    2008-01-01

    Segmentation methods based on pixel classification are powerful but often slow. We introduce two general algorithms, based on sparse classification, for optimizing the computation while still obtaining accurate segmentations. The computational costs of the algorithms are derived......, and they are demonstrated on real 3-D magnetic resonance imaging and 2-D radiograph data. We show that each algorithm is optimal for specific tasks, and that both algorithms allow a speedup of one or more orders of magnitude on typical segmentation tasks....

  3. The Belle II DEPFET pixel detector

    Science.gov (United States)

    Moser, Hans-Günther

    2016-09-01

    The Belle II experiment at KEK (Tsukuba, Japan) will explore heavy flavour physics (B, charm and tau) at the starting of 2018 with unprecedented precision. Charged particles are tracked by a two-layer DEPFET pixel device (PXD), a four-layer silicon strip detector (SVD) and the central drift chamber (CDC). The PXD will consist of two layers at radii of 14 mm and 22 mm with 8 and 12 ladders, respectively. The pixel sizes will vary, between 50 μm×(55-60) μm in the first layer and between 50 μm×(70-85) μm in the second layer, to optimize the charge sharing efficiency. These innermost layers have to cope with high background occupancy, high radiation and must have minimal material to reduce multiple scattering. These challenges are met using the DEPFET technology. Each pixel is a FET integrated on a fully depleted silicon bulk. The signal charge collected in the 'internal gate' modulates the FET current resulting in a first stage amplification and therefore very low noise. This allows very thin sensors (75 μm) reducing the overall material budget of the detector (0.21% X0). Four fold multiplexing of the column parallel readout allows read out a full frame of the pixel matrix in only 20 μs while keeping the power consumption low enough for air cooling. Only the active electronics outside the detector acceptance has to be cooled actively with a two phase CO2 system. Furthermore the DEPFET technology offers the unique feature of an electronic shutter which allows the detector to operate efficiently in the continuous injection mode of superKEKB.

  4. Pixel Dynamics Analysis of Photospheric Spectral Data

    Science.gov (United States)

    2014-11-13

    corresponding Doppler blueshift (redshift) integrated over the pixel. Variations in the line width δλm may indicate variations in temperature or changes in...skewness of their absorption line redshift/ blueshift and asymmetry PFDs, as well as by the spatial average for each region. These three time-varying... blueshift PFD variance and skewness plots). These oscillations, associated with the AR regions exhibiting solar eruptions, occur with a period of ∼ 10

  5. EnviroAtlas - Portland, OR - Atlas Area Boundary

    Data.gov (United States)

    U.S. Environmental Protection Agency — This EnviroAtlas dataset shows the boundary of the Portland, OR Atlas Area. It represents the outside edge of all the block groups included in the EnviroAtlas Area....

  6. EnviroAtlas - Green Bay, WI - Atlas Area Boundary

    Data.gov (United States)

    U.S. Environmental Protection Agency — This EnviroAtlas dataset shows the boundary of the Green Bay, WI Atlas Area. It represents the outside edge of all the block groups included in the EnviroAtlas Area....

  7. EnviroAtlas - Paterson, NJ - Atlas Area Boundary

    Data.gov (United States)

    U.S. Environmental Protection Agency — This EnviroAtlas dataset shows the boundary of the Paterson, NJ Atlas Area. It represents the outside edge of all the block groups included in the EnviroAtlas Area....

  8. EnviroAtlas - Austin, TX - Atlas Area Boundary

    Data.gov (United States)

    U.S. Environmental Protection Agency — This EnviroAtlas dataset shows the boundary of the Austin, TX Atlas Area. It represents the outside edge of all the block groups included in the EnviroAtlas...

  9. EnviroAtlas - Phoenix, AZ - Atlas Area Boundary

    Data.gov (United States)

    U.S. Environmental Protection Agency — This EnviroAtlas dataset shows the boundary of the Phoenix, AZ Atlas Area. It represents the outside edge of all the block groups included in the EnviroAtlas Area....

  10. Photovoltaic retinal prosthesis with high pixel density

    Science.gov (United States)

    Mathieson, Keith; Loudin, James; Goetz, Georges; Huie, Philip; Wang, Lele; Kamins, Theodore I.; Galambos, Ludwig; Smith, Richard; Harris, James S.; Sher, Alexander; Palanker, Daniel

    2012-06-01

    Retinal degenerative diseases lead to blindness due to loss of the `image capturing' photoreceptors, while neurons in the `image-processing' inner retinal layers are relatively well preserved. Electronic retinal prostheses seek to restore sight by electrically stimulating the surviving neurons. Most implants are powered through inductive coils, requiring complex surgical methods to implant the coil-decoder-cable-array systems that deliver energy to stimulating electrodes via intraocular cables. We present a photovoltaic subretinal prosthesis, in which silicon photodiodes in each pixel receive power and data directly through pulsed near-infrared illumination and electrically stimulate neurons. Stimulation is produced in normal and degenerate rat retinas, with pulse durations of 0.5-4 ms, and threshold peak irradiances of 0.2-10 mW mm-2, two orders of magnitude below the ocular safety limit. Neural responses were elicited by illuminating a single 70 µm bipolar pixel, demonstrating the possibility of a fully integrated photovoltaic retinal prosthesis with high pixel density.

  11. Baryon Acoustic Oscillations reconstruction with pixels

    CERN Document Server

    Obuljen, Andrej; Castorina, Emanuele; Viel, Matteo

    2016-01-01

    Gravitational non-linear evolution induces a shift in the position of the baryon acoustic oscillations (BAO) peak together with a damping and broadening of its shape that bias and degrades the accuracy with which the position of the peak can be determined. BAO reconstruction is a technique developed to undo part of the effect of non-linearities. We present a new reconstruction method that consists in displacing pixels instead of galaxies and whose implementation is easier than the standard reconstruction method. We show that our method is equivalent to the standard reconstruction technique in the limit where the number of pixels becomes very large. This method is particularly useful in surveys where individual galaxies are not resolved, as in 21cm intensity mapping observations. We validate our method by reconstructing mock pixelated maps, that we build from the distribution of matter and halos in real- and redshift-space, from a large set of numerical simulations. We find that our method is able to decrease ...

  12. Readout Architecture for Hybrid Pixel Readout Chips

    CERN Document Server

    AUTHOR|(SzGeCERN)694170; Westerlund, Tomi; Wyllie, Ken

    The original contribution of this thesis to knowledge are novel digital readout architectures for hybrid pixel readout chips. The thesis presents asynchronous bus-based architecture, a data-node based column architecture and a network-based pixel matrix architecture for data transportation. It is shown that the data-node architecture achieves readout efficiency 99 % with half the output rate as a bus-based system. The network-based solution avoids ``broken'' columns due to some manufacturing errors, and it distributes internal data traffic more evenly across the pixel matrix than column-based architectures. An improvement of $>$ 10 % to the efficiency is achieved with uniform and non-uniform hit occupancies. Architectural design has been done using transaction level modeling ($TLM$) and sequential high-level design techniques for reducing the design and simulation time. It has been possible to simulate tens of column and full chip architectures using the high-level techniques. A decrease of $>$ 10 in run-time...

  13. Characterization of the CMS Pixel Detectors

    CERN Document Server

    Gu, Weihua

    2002-01-01

    In 2005 the Large Hadron Collider (LHC) will start the pp collisions at a high luminosity and at a center of mass energy of 14 TeV. The primary goal of the experimental programme is the search of the Higgs boson(s) and the supersymmetric particles. The programme is also proposed to detect a range of diverse signatures in order to provide guidance for future physics. The pixel detector system makes up the innermost part of the CMS experiment, which is one of the two general purpose detectors at the LHC. The main tasks of the system are vertex detection and flavor tagging. The high luminosity and the high particle multiplicity as well as the small bunch spacing at the LHC impose great challenges on the pixel detectors: radiation hardness of sensors and electronics, fast signal processing and a high granularity are the essential requirements. This thesis concentrates on the study of the suitability of two test stands, which are implemented to characterize the CMS pixel detectors: one is con-cerned with test puls...

  14. [Atlas fractures].

    Science.gov (United States)

    Schären, S; Jeanneret, B

    1999-05-01

    Fractures of the atlas account for 1-2% of all vertebral fractures. We divide atlas fractures into 5 groups: isolated fractures of the anterior arch of the atlas, isolated fractures of the posterior arch, combined fractures of the anterior and posterior arch (so-called Jefferson fractures), isolated fractures of the lateral mass and fractures of the transverse process. Isolated fractures of the anterior or posterior arch are benign and are treated conservatively with a soft collar until the neck pain has disappeared. Jefferson fractures are divided into stable and unstable fracture depending on the integrity of the transverse ligament. Stable Jefferson fractures are treated conservatively with good outcome while unstable Jefferson fractures are probably best treated operatively with a posterior atlanto-axial or occipito-axial stabilization and fusion. The authors preferred treatment modality is the immediate open reduction of the dislocated lateral masses combined with a stabilization in the reduced position using a transarticular screw fixation C1/C2 according to Magerl. This has the advantage of saving the atlanto-occipital joints and offering an immediate stability which makes immobilization in an halo or Minerva cast superfluous. In late instabilities C1/2 with incongruency of the lateral masses occurring after primary conservative treatment, an occipito-cervical fusion is indicated. Isolated fractures of the lateral masses are very rare and may, if the lateral mass is totally destroyed, be a reason for an occipito-cervical fusion. Fractures of the transverse processes may be the cause for a thrombosis of the vertebral artery. No treatment is necessary for the fracture itself.

  15. Overview of the ATLAS Insertable B-Layer (IBL) Project

    CERN Document Server

    Grosse-Knetter, J; The ATLAS collaboration

    2011-01-01

    The upgrades for the ATLAS Pixel Detector will be staged in preparation for high luminosity LHC. The first upgrade for the Pixel Detector will be the construction of a new pixel layer which will be installed during the first shutdown of the LHC machine, foreseen in 2013-14. The new detector, called the Insertable B-layer (IBL), will be installed between the existing Pixel Detector and a new, smaller radius beam-pipe at a radius of 3.2 cm. The IBL will require the development of several new technologies to cope with increased radiation and pixel occupancy and also to improve the physics performance through reduction of the pixel size and a more stringent material budget. Two different and promising silicon sensor technologies, planar n-in-n and 3D, are currently under investigation for the IBL. An overview of the IBL project, of the module design and the qualification for these sensor technologies with particular emphasis on irradiation and beam tests will be presented.

  16. Overview of the ATLAS Insertable B-Layer (IBL) Project

    CERN Document Server

    Gallrapp, C; The ATLAS collaboration

    2012-01-01

    The upgrades for the ATLAS Pixel Detector will be staged in preparation for high luminosity LHC. The first upgrade for the Pixel Detector will be the construction of a new pixel layer which will be installed during the first shutdown of the LHC machine, foreseen in 2013-14. The new detector, called the Insertable B-layer (IBL), will be installed between the existing Pixel Detector and a new, smaller radius beam-pipe at a radius of 3.3 cm. The IBL will require the development of several new technologies to cope with increased radiation and pixel occupancy and also to improve the physics performance through reduction of the pixel size and a more stringent material budget. Two different and promising silicon sensor technologies, planar n-in-n and 3D, are currently under investigation for the IBL. An overview of the IBL project, of the module design and their qualification with particular emphasis on irradiation tests will be presented.

  17. Overview of the ATLAS Insertable B-Layer (IBL) Project

    CERN Document Server

    Giordani, M; The ATLAS collaboration

    2012-01-01

    The upgrades for the ATLAS Pixel Detector will be staged in preparation for high luminosity LHC. The first upgrade for the Pixel Detector will be the construction of a new pixel layer which will be installed during the first shutdown of the LHC machine, foreseen in 2013-14. The new detector, called the Insertable B-layer (IBL), will be installed between the existing Pixel Detector and a new, smaller radius beam-pipe at a radius of 3.3cm. The IBL will require the development of several new technologies to cope with increased radiation and pixel occupancy and also to improve the physics performance through reduction of the pixel size and a more stringent material budget. Two different and promising silicon sensor technologies, planar n-in-n and 3D, are currently under investigation for the IBL. An overview of the IBL project, of the module design and their qualification with particular emphasis on irradiation tests will be presented.

  18. Overview of the ATLAS Insertable B-Layer (IBL) Project

    CERN Document Server

    Pohl, D-L; The ATLAS collaboration

    2013-01-01

    The upgrades for the ATLAS Pixel Detector will be staged in preparation for high luminosity LHC. The first upgrade for the Pixel Detector will be the construction of a new pixel layer which is currently under construction and will be installed during the first shutdown of the LHC machine, in 2013-14. The new detector, called the Insertable B-layer (IBL), will be installed between the existing Pixel Detector and a new, smaller radius beam-pipe at a radius of 3.3 cm. The IBL required the development of several new technologies to cope with increased radiation and pixel occupancy and also to improve the physics performance through reduction of the pixel size and a more stringent material budget. Two different silicon sensor technologies, planar n-in-n and 3D, will be used, connected with the new generation 130nm IBM CMOS FE-I4 readout chip via solder bump-bonds. 32 FEs with sensors are glued to a light weight carbon-carbon structure which incorporates a titanium cooling tube for a CO2 cooling system. In total th...

  19. Sky pixelization for the analysis of extended emission

    Science.gov (United States)

    Verkhodanov, O. V.; Doroshkevich, A. G.

    2013-08-01

    Spherical pixelization schemes are reviewed that allow analyzing extended emission and, in particular, the cosmic microwave background. Problems with implementing different schemes are considered. The nonhierarchical Gauss-Legendre sky pixelization (GLESP) approach is discussed in detail.

  20. ATLAS experimentet

    CERN Multimedia

    ATLAS Outreach Committee

    2000-01-01

    Filmen innehåller mycket information om fysik och varför LHC behövs tilsammans med stora detektorer och specielt om behovet av ATLAS Experimentet. Mycket bra film för att förklara det okända- som man undersöker i CERN för att ge svar på frågor som människor har försökt förklara under flere tusen år.

  1. Tracking in dense environments and its inefficiency measurement using pixel $dE/dx$

    CERN Document Server

    Mansour, Jason Dhia; The ATLAS collaboration

    2016-01-01

    We present a measurement of the charged particle reconstruction inefficiency inside of jet cores, using data collected by the ATLAS experiment in 2015 of $pp$ collisions produced at the LHC, at a center of mass energy of 13 TeV. The determination of this inefficiency is important for jet energy scale and mass calibration, as well as multiple other performance studies and analyses. A data driven method is used, where the fraction of lost particle tracks is determined from energy deposition $dE/dx$ in the pixel detector. The fraction of lost tracks is found to be less than 5%, which is an improvement since the previous study, and agrees well within systematic uncertainties with a Monte Carlo simulation.

  2. Tests of gases in a mini-TPC with pixel chip readout

    Energy Technology Data Exchange (ETDEWEB)

    Vahsen, S. [University of Hawaii, 2505 Correa Road, Honolulu, HI 96822 (United States); Oliver-Mallory, K.; Lopez-Thibodeaux, M. [Lawrence Berkeley National Laboratory, 1 Cyclotron Road, Berkeley, CA 94720 (United States); Kadyk, J., E-mail: jakadyk@lbl.gov [Lawrence Berkeley National Laboratory, 1 Cyclotron Road, Berkeley, CA 94720 (United States); Garcia-Sciveres, M. [Lawrence Berkeley National Laboratory, 1 Cyclotron Road, Berkeley, CA 94720 (United States)

    2014-02-21

    Gases for potential use as targets for directional dark matter detection were tested in a prototype detector using two sequential Gas Electron Multipliers, or GEMs. The sensitive volume consists of a mini-TPC of 12 cm length and 7.5 cm diameter. An FEI3 pixel chip, developed for the ATLAS experiment, was used to produce spatial measurements with high resolution. An Fe55 source produced photoelectrons by X-ray conversions in the sensitive volume, and images of these were recorded by the chip. Spatial resolution plots are shown for the gases, which include the practical electron range of the photoelectrons and the effects of diffusion in the mini-TPC. Avalanche gain and gain resolution measurements were made for the four gases tested, at atmospheric and sub-atmospheric pressures: Ar(70)/CO{sub 2}(30), CF{sub 4}, He(80)/CF{sub 4}(20) and He(80)/isobutane(20)

  3. Characterization and performance studies of high-voltage CMOS based pixel sensors

    CERN Document Server

    Smaranda, Dumitru Dan

    2015-01-01

    The high luminosity upgrade of the LHC will push the limits for detectors, specially the silicon trackers which are closest to the interaction point. The ATLAS CMOS Sensor R&D efort is investigating a new technology using high-voltage CMOS processes for producing pixel and strip sensors. In contrast to the currently used technology these devices implement active electronics on the sensor itself, offering a multitude of tuning parameters for achieving the best performance. My summer project revolved around characterising existing samples along with assembling and debugging hardware required for their improvement and functionality. Other tasks involved writing communication protocols using pyBAR to remotely control injection circuitry on a GPAC card, and helping various members of the group with data collection and analysis. Through the summer student programme I have had the opportunity to be part of a vibrant scientic community at the forefront of research, to create bonds with fellow students from univ...

  4. A PFM based digital pixel with off-pixel residue measurement for 15μm pitch MWIR FPAs

    Science.gov (United States)

    Abbasi, Shahbaz; Shafique, Atia; Galioglu, Arman; Ceylan, Omer; Yazici, Melik; Gurbuz, Yasar

    2016-05-01

    Digital pixels based on pulse frequency modulation (PFM) employ counting techniques to achieve very high charge handling capability compared to their analog counterparts. Moreover, extended counting methods making use of leftover charge (residue) on the integration capacitor help improve the noise performance of these pixels. However, medium wave infrared (MWIR) focal plane arrays (FPAs) having smaller pixel pitch are constrained in terms of pixel area which makes it difficult to add extended counting circuitry to the pixel. Thus, this paper investigates the performance of digital pixels employing off-pixel residue measurement. A circuit prototype of such a pixel has been designed for 15μm pixel pitch and fabricated in 90nm CMOS. The prototype is composed of a pixel front-end based on a PFM loop. The frontend is a modified version of conventional design providing a means for buffering the signal that needs to be converted to a digital value by an off-pixel ADC. The pixel has an integration phase and a residue measurement phase. Measured integration performance of the pixel has been reported in this paper for various detector currents and integration times.

  5. PIXELS: Using field-based learning to investigate students' concepts of pixels and sense of scale

    Science.gov (United States)

    Pope, A.; Tinigin, L.; Petcovic, H. L.; Ormand, C. J.; LaDue, N.

    2015-12-01

    Empirical work over the past decade supports the notion that a high level of spatial thinking skill is critical to success in the geosciences. Spatial thinking incorporates a host of sub-skills such as mentally rotating an object, imagining the inside of a 3D object based on outside patterns, unfolding a landscape, and disembedding critical patterns from background noise. In this study, we focus on sense of scale, which refers to how an individual quantified space, and is thought to develop through kinesthetic experiences. Remote sensing data are increasingly being used for wide-reaching and high impact research. A sense of scale is critical to many areas of the geosciences, including understanding and interpreting remotely sensed imagery. In this exploratory study, students (N=17) attending the Juneau Icefield Research Program participated in a 3-hour exercise designed to study how a field-based activity might impact their sense of scale and their conceptions of pixels in remotely sensed imagery. Prior to the activity, students had an introductory remote sensing lecture and completed the Sense of Scale inventory. Students walked and/or skied the perimeter of several pixel types, including a 1 m square (representing a WorldView sensor's pixel), a 30 m square (a Landsat pixel) and a 500 m square (a MODIS pixel). The group took reflectance measurements using a field radiometer as they physically traced out the pixel. The exercise was repeated in two different areas, one with homogenous reflectance, and another with heterogeneous reflectance. After the exercise, students again completed the Sense of Scale instrument and a demographic survey. This presentation will share the effects and efficacy of the field-based intervention to teach remote sensing concepts and to investigate potential relationships between students' concepts of pixels and sense of scale.

  6. ATLAS welcomes a new Palestinian student

    CERN Multimedia

    Antonella Del Rosso

    2014-01-01

    Mahmoud Ibrahim Alstaty, from near Jenin, is starting a PhD studentship at CERN, where he will be working on the new inner layer of the ATLAS pixel detector. He joins a growing number of other Palestinian researchers who are working at CERN.   Mahmoud Ibrahim Alstaty. Mahmoud Alstaty's PhD scholarship is supported by the Sharing Knowledge Foundation. In 2013, Robert Klapisch, president of the foundation and former Director of Research at CERN, signed a framework agreement with CERN to open the Doctoral Student programme to countries from the Middle East and North Africa (MENA). Mahmoud is the second student to benefit from such an opportunity, following Mohamed Gouighri from Morocco. “Mahmoud will work on the ATLAS experiment on the commissioning and performance of the new inner layer of the pixel detector (IBL) and on the search for new physics, including leptons in the final state, under the supervision of Fares Djama and myself”, says Pascal Pralavorio from Cen...

  7. 4T CMOS Active Pixel Sensors under Ionizing Radiation

    NARCIS (Netherlands)

    Tan, J.

    2013-01-01

    This thesis investigates the ionizing radiation effects on 4T pixels and the elementary in-pixel test devices with regard to the electrical performance and the optical performance. In addition to an analysis of the macroscopic pixel parameter degradation, the radiation-induced degradation mechanisms

  8. Comprehensive cellular-resolution atlas of the adult human brain.

    Science.gov (United States)

    Ding, Song-Lin; Royall, Joshua J; Sunkin, Susan M; Ng, Lydia; Facer, Benjamin A C; Lesnar, Phil; Guillozet-Bongaarts, Angie; McMurray, Bergen; Szafer, Aaron; Dolbeare, Tim A; Stevens, Allison; Tirrell, Lee; Benner, Thomas; Caldejon, Shiella; Dalley, Rachel A; Dee, Nick; Lau, Christopher; Nyhus, Julie; Reding, Melissa; Riley, Zackery L; Sandman, David; Shen, Elaine; van der Kouwe, Andre; Varjabedian, Ani; Write, Michelle; Zollei, Lilla; Dang, Chinh; Knowles, James A; Koch, Christof; Phillips, John W; Sestan, Nenad; Wohnoutka, Paul; Zielke, H Ronald; Hohmann, John G; Jones, Allan R; Bernard, Amy; Hawrylycz, Michael J; Hof, Patrick R; Fischl, Bruce; Lein, Ed S

    2016-11-01

    Detailed anatomical understanding of the human brain is essential for unraveling its functional architecture, yet current reference atlases have major limitations such as lack of whole-brain coverage, relatively low image resolution, and sparse structural annotation. We present the first digital human brain atlas to incorporate neuroimaging, high-resolution histology, and chemoarchitecture across a complete adult female brain, consisting of magnetic resonance imaging (MRI), diffusion-weighted imaging (DWI), and 1,356 large-format cellular resolution (1 µm/pixel) Nissl and immunohistochemistry anatomical plates. The atlas is comprehensively annotated for 862 structures, including 117 white matter tracts and several novel cyto- and chemoarchitecturally defined structures, and these annotations were transferred onto the matching MRI dataset. Neocortical delineations were done for sulci, gyri, and modified Brodmann areas to link macroscopic anatomical and microscopic cytoarchitectural parcellations. Correlated neuroimaging and histological structural delineation allowed fine feature identification in MRI data and subsequent structural identification in MRI data from other brains. This interactive online digital atlas is integrated with existing Allen Institute for Brain Science gene expression atlases and is publicly accessible as a resource for the neuroscience community. J. Comp. Neurol. 524:3127-3481, 2016. © 2016 The Authors The Journal of Comparative Neurology Published by Wiley Periodicals, Inc.

  9. The ATLAS tracker strip detector for HL-LHC

    CERN Document Server

    Cormier, Kyle James Read; The ATLAS collaboration

    2016-01-01

    As part of the ATLAS upgrades for the High Luminsotiy LHC (HL-LHC) the current ATLAS Inner Detector (ID) will be replaced by a new Inner Tracker (ITk). The ITk will consist of two main components: semi-conductor pixels at the innermost radii, and silicon strips covering larger radii out as far as the ATLAS solenoid magnet including the volume currently occupied by the ATLAS Transition Radiation Tracker (TRT). The primary challenges faced by the ITk are the higher planned read out rate of ATLAS, the high density of charged particles in HL-LHC conditions for which tracks need to be resolved, and the corresponding high radiation doses that the detector and electronics will receive. The ITk strips community is currently working on designing and testing all aspects of the sensors, readout, mechanics, cooling and integration to meet these goals and a Technical Design Report is being prepared. This talk is an overview of the strip detector component of the ITk, highlighting the current status and the road ahead.

  10. ATLAS Recordings

    CERN Document Server

    Jeremy Herr; Homer A. Neal; Mitch McLachlan

    The University of Michigan Web Archives for the 2006 ATLAS Week Plenary Sessions, as well as the first of 2007, are now online. In addition, there are a wide variety of Software and Physics Tutorial sessions, recorded over the past couple years, to chose from. All ATLAS-specific archives are accessible here.Viewing requires a standard web browser with RealPlayer plug-in (included in most browsers automatically) and works on any major platform. Lectures can be viewed directly over the web or downloaded locally.In addition, you will find access to a variety of general tutorials and events via the portal. Shaping Collaboration 2006The Michigan group is happy to announce a complete set of recordings from the Shaping Collaboration conference held last December at the CICG in Geneva.The event hosted a mix of Collaborative Tool experts and LHC Users, and featured presentations by the CERN Deputy Director General, Prof. Jos Engelen, the President of Internet2, and chief developers from VRVS/EVO, WLAP, and other tools...

  11. ATLAS Distributed Computing Automation

    CERN Document Server

    Schovancova, J; The ATLAS collaboration; Borrego, C; Campana, S; Di Girolamo, A; Elmsheuser, J; Hejbal, J; Kouba, T; Legger, F; Magradze, E; Medrano Llamas, R; Negri, G; Rinaldi, L; Sciacca, G; Serfon, C; Van Der Ster, D C

    2012-01-01

    The ATLAS Experiment benefits from computing resources distributed worldwide at more than 100 WLCG sites. The ATLAS Grid sites provide over 100k CPU job slots, over 100 PB of storage space on disk or tape. Monitoring of status of such a complex infrastructure is essential. The ATLAS Grid infrastructure is monitored 24/7 by two teams of shifters distributed world-wide, by the ATLAS Distributed Computing experts, and by site administrators. In this paper we summarize automation efforts performed within the ATLAS Distributed Computing team in order to reduce manpower costs and improve the reliability of the system. Different aspects of the automation process are described: from the ATLAS Grid site topology provided by the ATLAS Grid Information System, via automatic site testing by the HammerCloud, to automatic exclusion from production or analysis activities.

  12. Fabrication and Test of Pixelated CZT Detectors with Different Pixel Pitches and Thicknesses

    CERN Document Server

    Li, Q; Dowkontt, P; Martín, J; Beilicke, M; Jung, I; Groza, M; Bürger, A; De Geronimo, G; Krawczynski, H

    2008-01-01

    The main methods grown Cadmium Zinc Telluride (CZT) crystals with high yield and excellent homogeneity are Modified Horizontal Bridgman (MHB) and High Pressure Bridgman (HPB) processes, respectively. In this contribution, the readout system based on two 32-channel NCI-ASICs for pixellated CZT detector arrays has been developed and tested. The CZT detectors supplied by Orbotech (MHB) and eV products (HPB) are tested by NCI-ASIC readout system. The CZT detectors have an array of 8x8 or 11x11 pixel anodes fabricated on the anode surface with the area up to 2 cm x2 cm and the thickness of CZT detectors ranges from 0.5 cm to 1 cm. Energy spectra resolution and electron mobility-lifetime products of 8x8 pixels CZT detector with different thicknesses have been investigated.

  13. Fast Sub-Pixel Motion Estimation Algorithm For H.264

    Institute of Scientific and Technical Information of China (English)

    2007-01-01

    A novel fast sub-pixel search algorithm is proposed to accelerate sub-pixel search. Based on the features of predicted motion vector (PMV) and texture direction observed, the proposed method effectively filters out impossible points and thus decreases 11 searched points in average during the sub-pixel search stage. A threshold is also adopted to early terminate the sub-pixel search. Simulation results show that the proposed method can achieve up to 4.8 times faster than full sub-pixel motion search scheme (FSPS) with less than 0.025 dB PSNR losses and 2.2% bitlength increases.

  14. A study in GUI aesthetics for modern pixel art games.

    OpenAIRE

    Grahn, Emma

    2013-01-01

    The clarity and usability of the graphical user interface is very important for the enjoyment of a digital game. Pixel art is an art style with low resolution consisting of a precise placing of pixels, the smallest unit of colour that a screen can display. Pixel art has the potential of being cheap, easy to make and nostalgic, but it takes some skill to handle. However the great weakness of pixel art is displaying letters, and small details with clarity. So is there a place for pixel art in m...

  15. CMB component separation in the pixel domain

    OpenAIRE

    Doroshkevich, A.; Verkhodanov, O.

    2010-01-01

    We show that the popular ILC approach is unstable in respect to the division of the sample of map pixels to the set of ``homogeneous'' subsamples. For suitable choice of such subsamples we can obtain the restored CMB signal with amplitudes ranged from zero to the amplitudes of the observed signal. We propose approach which allows us to obtain reasonable estimates of $C_\\ell$ at $\\ell\\leq 30$ and similar to WMAP $C_\\ell$ for larger $\\ell$. With this approach we reduce some anomalies of the WMA...

  16. ISPA (imaging silicon pixel array) experiment

    CERN Multimedia

    Patrice Loïez

    2002-01-01

    The ISPA tube is a position-sensitive photon detector. It belongs to the family of hybrid photon detectors (HPD), recently developed by CERN and INFN with leading photodetector firms. HPDs confront in a vacuum envelope a photocathode and a silicon detector. This can be a single diode or a pixelized detector. The electrons generated by the photocathode are efficiently detected by the silicon anode by applying a high-voltage difference between them. ISPA tube can be used in high-energy applications as well as bio-medical and imaging applications.

  17. A neighbor pixel communication filtering structure for Dynamic Vision Sensors

    Science.gov (United States)

    Xu, Yuan; Liu, Shiqi; Lu, Hehui; Zhang, Zilong

    2017-02-01

    For Dynamic Vision Sensors (DVS), thermal noise and junction leakage current induced Background Activity (BA) is the major cause of the deterioration of images quality. Inspired by the smoothing filtering principle of horizontal cells in vertebrate retina, A DVS pixel with Neighbor Pixel Communication (NPC) filtering structure is proposed to solve this issue. The NPC structure is designed to judge the validity of pixel's activity through the communication between its 4 adjacent pixels. The pixel's outputs will be suppressed if its activities are determined not real. The proposed pixel's area is 23.76×24.71μm2 and only 3ns output latency is introduced. In order to validate the effectiveness of the structure, a 5×5 pixel array has been implemented in SMIC 0.13μm CIS process. 3 test cases of array's behavioral model show that the NPC-DVS have an ability of filtering the BA.

  18. Performance limits of a single photon counting pixel system

    Energy Technology Data Exchange (ETDEWEB)

    Chmeissani, M.; Mikulec, B. E-mail: bettina.mikulec@cern.ch

    2001-03-11

    X-ray imaging using hybrid pixel detectors in single photon counting mode is a relatively recent and exciting development. The photon counting mode implies that each pixel has a threshold in energy above which a hit is recorded. Sharing of charge between adjacent pixels would therefore lead to a loss of registered hits and for medical imaging applications to a higher patient dose. This explains why the demand for high spatial resolution and consequently small pixel sizes (<100 {mu}m) motivates the Medipix2 collaboration to study the effects of charge sharing between pixels on system performance. Two different simulation codes are used to simulate the energy loss inside the detector and the charge transport towards the pixel electrodes. The largest contribution to the lateral spreading of charge comes from diffusion and can result in a considerable loss of detection efficiency in photon counting systems for small pixel sizes.

  19. Development of readout system for FE-I4 pixel module using SiTCP

    Science.gov (United States)

    Teoh, J. J.; Hanagaki, K.; Ikegami, Y.; Takubo, Y.; Terada, S.; Unno, Y.

    2013-12-01

    The ATLAS pixel detector will be replaced in the future High Luminosity-Large Hadron Collider (HL-LHC) upgrade to preserve or improve the detector performance at high luminosity environment. To meet the tight requirements of the upgrade, a new pixel Front-End (FE) Integrated Circuit (IC) called FE-I4 has been developed. We have then devised a readout system for the new FE IC. Our system incorporates Silicon Transmission Control Protocol (SiTCP) technology (Uchida, 2008 [1]) which utilizes the standard TCP/IP and UDP communication protocols. This technology allows direct data access and transfer between a readout hardware chain and PC via a high speed Ethernet. In addition, the communication protocols are small enough to be implemented in a single Field-Programable Gate Array (FPGA). Relying on this technology, we have been able to construct a very compact, versatile and fast readout system. We have developed a firmware and software together with the readout hardware chain. We also have established basic functionalities for reading out FE-I4.

  20. A new method to improve multiplication factor in micro-pixel avalanche photodiodes with high pixel density

    Energy Technology Data Exchange (ETDEWEB)

    Sadygov, Z. [National Nuclear Research Center, Baku (Azerbaijan); Joint Institute for Nuclear Research, Dubna (Russian Federation); Ahmadov, F. [National Nuclear Research Center, Baku (Azerbaijan); Khorev, S. [Zecotek Photonics Inc., Vancouver (Canada); Sadigov, A., E-mail: saazik@yandex.ru [National Nuclear Research Center, Baku (Azerbaijan); Suleymanov, S. [National Nuclear Research Center, Baku (Azerbaijan); Madatov, R.; Mehdiyeva, R. [Institute of Radiation Problems, Baku (Azerbaijan); Zerrouk, F. [Zecotek Photonics Inc., Vancouver (Canada)

    2016-07-11

    Presented is a new model describing development of the avalanche process in time, taking into account the dynamics of electric field within the depleted region of the diode and the effect of parasitic capacitance shunting individual quenching micro-resistors on device parameters. Simulations show that the effective capacitance of a single pixel, which defines the multiplication factor, is the sum of the pixel capacitance and a parasitic capacitance shunting its quenching micro-resistor. Conclusions obtained as a result of modeling open possibilities of improving the pixel gain in micropixel avalanche photodiodes with high pixel density (or low pixel capacitance).

  1. The ALICE Silicon Pixel Detector System

    CERN Document Server

    Fadmar Osmic, FO

    2006-01-01

    The European Organization for Particle Physics (CERN) in Geneva is currently constructing the Large Hadron Collider (LHC), which will allow the study of the subnuclear ranges of physics with an accuracy never achieved before. Within the LHC project, ALICE is to the study of strongly interacting matter at extreme densities and high temperatures. ALICE as many other modern High Energy Physics (HEP) experiments uses silicon pixel detectors for tracking close to the interaction point (IP). The ALICE Silicon Pixel Detector (SPD) will constitute the two innermost layers of ALICE, and will due to its high granularity provide precise tracking information. In heavy ion collisions, the track density could be as high as 80 tracks/cm2 in the first SPD layer. The SPD will provide tracking information at radii of 3.9 and 7.6 cm from the IP. It is a fundamental element for the study of the weak decays of the particles carrying heavy flavour, whose typical signature will be a secondary vertex separated from the primary verte...

  2. Further applications for mosaic pixel FPA technology

    Science.gov (United States)

    Liddiard, Kevin C.

    2011-06-01

    In previous papers to this SPIE forum the development of novel technology for next generation PIR security sensors has been described. This technology combines the mosaic pixel FPA concept with low cost optics and purpose-designed readout electronics to provide a higher performance and affordable alternative to current PIR sensor technology, including an imaging capability. Progressive development has resulted in increased performance and transition from conventional microbolometer fabrication to manufacture on 8 or 12 inch CMOS/MEMS fabrication lines. A number of spin-off applications have been identified. In this paper two specific applications are highlighted: high performance imaging IRFPA design and forest fire detection. The former involves optional design for small pixel high performance imaging. The latter involves cheap expendable sensors which can detect approaching fire fronts and send alarms with positional data via mobile phone or satellite link. We also introduce to this SPIE forum the application of microbolometer IR sensor technology to IoT, the Internet of Things.

  3. Efficient single pixel imaging in Fourier space

    Science.gov (United States)

    Bian, Liheng; Suo, Jinli; Hu, Xuemei; Chen, Feng; Dai, Qionghai

    2016-08-01

    Single pixel imaging (SPI) is a novel technique capturing 2D images using a bucket detector with a high signal-to-noise ratio, wide spectrum range and low cost. Conventional SPI projects random illumination patterns to randomly and uniformly sample the entire scene’s information. Determined by Nyquist sampling theory, SPI needs either numerous projections or high computation cost to reconstruct the target scene, especially for high-resolution cases. To address this issue, we propose an efficient single pixel imaging technique (eSPI), which instead projects sinusoidal patterns for importance sampling of the target scene’s spatial spectrum in Fourier space. Specifically, utilizing the centrosymmetric conjugation and sparsity priors of natural images’ spatial spectra, eSPI sequentially projects two \\tfrac{π }{2}-phase-shifted sinusoidal patterns to obtain each Fourier coefficient in the most informative spatial frequency bands. eSPI can reduce requisite patterns by two orders of magnitude compared to conventional SPI, which helps a lot for fast and high-resolution SPI.

  4. Pixel-Tilecal-MDT Combined Test Beam

    CERN Multimedia

    B. Di Girolamo

    A test with many expectations When an additional week of running (from September 11th to 18th) was allocated for the test-beam, it was decided to give priority to a combined run with the participation of the Pixel, Tilecal and MDT sub-detectors. The integration of these three sub-detectors was possible as they all use the baseline (DAQ-1/EF based) DAQ for test beams (as reported in a previous e-news). The tests and the addition of a common trigger and busy were organized in a short timescale by experts from the three sub-detectors and DAQ/EF. The expectations were many; both looking for problems and finding solutions. The setup The setup, shown in the figure, consisted of the Pixel telescope normally used during the sub-detector tests, two Tilecal barrel modules, two Tilecal extended barrel modules, and six MDT barrel chambers. This fully occupied a length of some 30 meters in the H8 line of the SPS North Area. Each sub-detector used their own specialized front-end electronics. The data collected by modu...

  5. The Phase1 CMS Pixel detector upgrade

    CERN Document Server

    Tavolaro, Vittorio Raoul

    2016-01-01

    The pixel detector of the CMS experiment will be replaced in an extended end-of-year shutdown during winter 2016/2017 with an upgraded one able to cope with peak instantaneous luminosities beyond the nominal LHC instantaneous luminosity of $1 \\times 10^{34}$ cm$^{-2}$ s$^{-1}$. Under the conditions expected in the coming years, which will see an increase of a factor two in instantaneous luminosity, the present system would experience a dynamic inefficiency caused mainly by data losses due to buffer overflows. The Phase I upgrade of the CMS pixel detector, described in this paper, will operate at full efficiency at an instantaneous luminosity of $2 \\times 10^{34}$ cm$^{-2}$ s$^{-1}$, thanks to a new readout chip. The new detector will feature one additional tracking point both in the barrel and in the forward regions, while reducing the material budget as a result of a new CO$_{2}$ cooling system and optimised layout of the services. In this paper, the design and the technological choices of the Phase I detect...

  6. Silicon pixel R&D for CLIC

    CERN Document Server

    AUTHOR|(SzGeCERN)754303

    2016-01-01

    Challenging detector requirements are imposed by the physics goals at the future multi-TeV e+e- Compact Linear Collider (CLIC). A single point resolution of 3μm for the vertex detector and 7μm for the tracker is required. Moreover, the CLIC vertex detector and tracker need to be extremely light weighted with a material budget of 0.2 % X0 per layer in the ver- tex detector and 1-2%X0 in the tracker. A fast time slicing of 10ns is further required to suppress background from beam-beam interactions. A wide range of sensor and readout ASIC technologies are investigated within the CLIC silicon pixel R&D effort. Various hybrid planar sensor assemblies with a pixel size of 25x25μm2 and 55x55μm2 have been produced and characterised by laboratory measurements and during test-beam campaigns. Experimental and simulation results for thin (50μm-500μm) slim edge and active-edge planar, and High-Voltage CMOS sensors hybridised to various readout ASICs (Timepix, Timepix3, CLICpix) are presented.

  7. Silicon pixel R&D for CLIC

    Science.gov (United States)

    Munker, M.

    2017-01-01

    Challenging detector requirements are imposed by the physics goals at the future multi-TeV e+ e‑ Compact Linear Collider (CLIC). A single point resolution of 3 μm for the vertex detector and 7 μm for the tracker is required. Moreover, the CLIC vertex detector and tracker need to be extremely light weighted with a material budget of 0.2% X0 per layer in the vertex detector and 1–2% X0 in the tracker. A fast time slicing of 10 ns is further required to suppress background from beam-beam interactions. A wide range of sensor and readout ASIC technologies are investigated within the CLIC silicon pixel R&D effort. Various hybrid planar sensor assemblies with a pixel size of 25×25 μm2 and 55×55 μm2 have been produced and characterised by laboratory measurements and during test-beam campaigns. Experimental and simulation results for thin (50 μm–500 μm) slim edge and active-edge planar, and High-Voltage CMOS sensors hybridised to various readout ASICs (Timepix, Timepix3, CLICpix) are presented.

  8. The ATLAS IBL BOC Prototype Evaluation

    CERN Document Server

    Schroer, N; The ATLAS collaboration; Bruni, G; Joseph, J; Krieger, N; Kugel, A; Morettini, P; Neumann, M; Polini, A; Rizzi, M; Travaglini, R; Zannoli, S; Zoccoli, A; Bruschi, M; Dantone, I; Falchieri, D; Dopke, J; Flick, T; Gabrielli, A; Grosse-Knetter, J; Heim, T

    2012-01-01

    In 2013 an additional layer, the Insertable B-Layer (IBL) will be added to the pixel detector of the ATLAS experiment at the LHC at CERN. For this fourth and innermost layer 448 newly developed pixel sensor readout chips (FE-I4) are used which will provide data from about 12 million pixel. For the readout of the IBL new off-detector electronic components are needed as the FE-I4s feature an increased readout bandwidth which can not be handled by the current system. To provide a degree of backward compatibility the new system will keep the structure of VME card pairs: The back of crate card (BOC) establishes the optical interfaces to the detector front end as well as to the read out system (ROS) while the read out driver (ROD) manages data processing and calibration. Both cards, the BOC and the ROD, have been redesigned and feature modern FPGA technology, yielding an integration four times higher than the current system. Regarding the new BOC this is achieved by replacing custom made optical and electrical (e.g...

  9. Studies Concerning the ATLAS IBL Calibration Architecture

    CERN Document Server

    Kretz, Moritz; Kugel, Andreas

    With the commissioning of the Insertable B-Layer (IBL) in 2013 at the ATLAS experiment 12~million additional pixels will be added to the current Pixel Detector. While the idea of employing pairs of VME based Read-Out Driver (ROD) and Back of Crate (BOC) cards in the read-out chain remains unchanged, modifications regarding the IBL calibration procedure were introduced to overcome current hardware limitations. The analysis of calibration histograms will no longer be performed on the RODs, but on an external computing farm that is connected to the RODs via Ethernet. This thesis contributes to the new IBL calibration procedure and presents a concept for a scalable software and hardware architecture. An embedded system targeted to the ROD FPGAs is realized for sending data from the RODs to the fit farm servers and benchmarks are carried out with a Linux based networking stack, as well as a standalone software stack. Furthermore, the histogram fitting algorithm currently being employed on the Pixel Detector RODs i...

  10. Pixel-level Analog-To-Digital Converters for Hybrid Pixel Detectors with energy sensitivity

    NARCIS (Netherlands)

    San Segundo Bello, David; Nauta, Bram; Visschers, Jan

    2000-01-01

    Single-photon counting hybrid pixel detectors have shown to be a valid alternative to other types of X-ray imaging devices due to their high sensitivity, low noise, linear behavior and wide dynamic range. One important advantage of these devices is the fact that detector and readout electronics are

  11. Design of pixel-level ADCs for energy-sensitive hybrid pixel detectors

    NARCIS (Netherlands)

    San Segundo Bello, David; Nauta, Bram; Visschers, Jan

    2000-01-01

    Single-photon counting hybrid pixel detectors have shown to be a valid alternative to other types of X-ray imaging devices due to their high sensitivity, low noise, linear behavior and wide dynamic range. One important advantage of these devices is the fact that detector and readout electronics are

  12. Serial pixel analog-to-digital converter (ADC)

    Science.gov (United States)

    Larson, Eric D.

    2010-02-01

    This method reduces the data path from the counter to the pixel register of the analog-to-digital converter (ADC) from as many as 10 bits to a single bit. The reduction in data path width is accomplished by using a coded serial data stream similar to a pseudo random number (PRN) generator. The resulting encoded pixel data is then decoded into a standard hexadecimal format before storage. The high-speed serial pixel ADC concept is based on the single-slope integrating pixel ADC architecture. Previous work has described a massively parallel pixel readout of a similar architecture. The serial ADC connection is similar to the state-of-the art method with the exception that the pixel ADC register is a shift register and the data path is a single bit. A state-of-the-art individual-pixel ADC uses a single-slope charge integration converter architecture with integral registers and "one-hot" counters. This implies that parallel data bits are routed among the counter and the individual on-chip pixel ADC registers. The data path bit-width to the pixel is therefore equivalent to the pixel ADC bit resolution.

  13. Edge pixel response studies of edgeless silicon sensor technology for pixellated imaging detectors

    Science.gov (United States)

    Maneuski, D.; Bates, R.; Blue, A.; Buttar, C.; Doonan, K.; Eklund, L.; Gimenez, E. N.; Hynds, D.; Kachkanov, S.; Kalliopuska, J.; McMullen, T.; O'Shea, V.; Tartoni, N.; Plackett, R.; Vahanen, S.; Wraight, K.

    2015-03-01

    Silicon sensor technologies with reduced dead area at the sensor's perimeter are under development at a number of institutes. Several fabrication methods for sensors which are sensitive close to the physical edge of the device are under investigation utilising techniques such as active-edges, passivated edges and current-terminating rings. Such technologies offer the goal of a seamlessly tiled detection surface with minimum dead space between the individual modules. In order to quantify the performance of different geometries and different bulk and implant types, characterisation of several sensors fabricated using active-edge technology were performed at the B16 beam line of the Diamond Light Source. The sensors were fabricated by VTT and bump-bonded to Timepix ROICs. They were 100 and 200 μ m thick sensors, with the last pixel-to-edge distance of either 50 or 100 μ m. The sensors were fabricated as either n-on-n or n-on-p type devices. Using 15 keV monochromatic X-rays with a beam spot of 2.5 μ m, the performance at the outer edge and corners pixels of the sensors was evaluated at three bias voltages. The results indicate a significant change in the charge collection properties between the edge and 5th (up to 275 μ m) from edge pixel for the 200 μ m thick n-on-n sensor. The edge pixel performance of the 100 μ m thick n-on-p sensors is affected only for the last two pixels (up to 110 μ m) subject to biasing conditions. Imaging characteristics of all sensor types investigated are stable over time and the non-uniformities can be minimised by flat-field corrections. The results from the synchrotron tests combined with lab measurements are presented along with an explanation of the observed effects.

  14. Der ATLAS Pixelsensor Der state-of-the art Pixelsensor für teilchenphysikalische Anwendungen mit extrem hohen Strahlungsfeldern

    CERN Document Server

    Hügging, F G

    2001-01-01

    The innermost subdetector of the ATLAS Experiment is a hybrid pixel detector which consists of about 150 million pixel on roughly 2000 modules for a high resolution tracking and b-tagging in the LHC enviroment. The scope of this theses is the successful development of silicon pixel sensors for the ATLAS Pixel Detector. The main attention for the design was given to survivability in the harsh radiation enviroment of LHC up to a fluence 10^{15} n_{eq}/cm^2during 10 years of operation. This leads to the need of long term operation at several hundreds of volts, partially depleted while maintaining good charge collection, small cell size and thin sensors reducing multiple scattering. Additionally, a punch through bias grid for testing the sensors before assembly under realistic bias conditions is implemented to allow a quality assurance. The design of the ATLAS pixel sensor is explained in detail and the results of the prototype sensors showing the capability of the chosen sensor design to cope with the challengin...

  15. ATLAS' inner silicon tracker on track for completion

    CERN Multimedia

    2005-01-01

    Last week, the team working at the SR1 facility on the inner detector of the ATLAS experiment reached a project milestone after the delivery of the last Semi-conductor Tracker (SCT) barrel to CERN. The third barrel before its insertion into the support structure.The insertion of a completed barrel to its support structure is one of the highlights of the assembly and test sequence of the SCT in SR1. The inner detector will eventually sit in the 2 teslas magnetic field of the ATLAS solenoid, tracking charged particles from proton-proton collisions at the centre of ATLAS. The particles will be measured by a pixel detector (consisting of 3 pixel layers), an SCT (4 silicon strip layers) and a transition radiation tracker (TRT) (consisting of more than 52,000 straw tubes - see Bulletin 14/2005). The SCT has a silicon surface area of 61m2 with about 6 million operational channels so that all tracks can be identified and precisely measured. During 2004 a team of physicists, engineers, and technicians from several...

  16. The ATLAS Analysis Model

    CERN Multimedia

    Amir Farbin

    The ATLAS Analysis Model is a continually developing vision of how to reconcile physics analysis requirements with the ATLAS offline software and computing model constraints. In the past year this vision has influenced the evolution of the ATLAS Event Data Model, the Athena software framework, and physics analysis tools. These developments, along with the October Analysis Model Workshop and the planning for CSC analyses have led to a rapid refinement of the ATLAS Analysis Model in the past few months. This article introduces some of the relevant issues and presents the current vision of the future ATLAS Analysis Model. Event Data Model The ATLAS Event Data Model (EDM) consists of several levels of details, each targeted for a specific set of tasks. For example the Event Summary Data (ESD) stores calorimeter cells and tracking system hits thereby permitting many calibration and alignment tasks, but will be only accessible at particular computing sites with potentially large latency. In contrast, the Analysis...

  17. How big is an OMI pixel?

    Science.gov (United States)

    de Graaf, Martin; Sihler, Holger; Tilstra, Lieuwe G.; Stammes, Piet

    2016-08-01

    The Ozone Monitoring Instrument (OMI) is a push-broom imaging spectrometer, observing solar radiation backscattered by the Earth's atmosphere and surface. The incoming radiation is detected using a static imaging CCD (charge-coupled device) detector array with no moving parts, as opposed to most of the previous satellite spectrometers, which used a moving mirror to scan the Earth in the across-track direction. The field of view (FoV) of detector pixels is the solid angle from which radiation is observed, averaged over the integration time of a measurement. The OMI FoV is not quadrangular, which is common for scanning instruments, but rather super-Gaussian shaped and overlapping with the FoV of neighbouring pixels. This has consequences for pixel-area-dependent applications, like cloud fraction products, and visualisation.The shapes and sizes of OMI FoVs were determined pre-flight by theoretical and experimental tests but never verified after launch. In this paper the OMI FoV is characterised using collocated MODerate resolution Imaging Spectroradiometer (MODIS) reflectance measurements. MODIS measurements have a much higher spatial resolution than OMI measurements and spectrally overlap at 469 nm. The OMI FoV was verified by finding the highest correlation between MODIS and OMI reflectances in cloud-free scenes, assuming a 2-D super-Gaussian function with varying size and shape to represent the OMI FoV. Our results show that the OMPIXCOR product 75FoV corner coordinates are accurate as the full width at half maximum (FWHM) of a super-Gaussian FoV model when this function is assumed. The softness of the function edges, modelled by the super-Gaussian exponents, is different in both directions and is view angle dependent.The optimal overlap function between OMI and MODIS reflectances is scene dependent and highly dependent on time differences between overpasses, especially with clouds in the scene. For partially clouded scenes, the optimal overlap function was

  18. ATLAS Inner Tracker Performance at the beginning of LHC Run-2.

    CERN Document Server

    Stanecka, Ewa; The ATLAS collaboration

    2016-01-01

    The ATLAS experiment performs studies of proton-proton collisions at the Large Hadron Collider (LHC) at CERN. The Inner Detector is a part of the ATLAS apparatus placed nearest the interaction point, designed to measure charged particles momenta and their trajectories, and to reconstruct vertices of decays of physics objects created in the collisions. During the LHC technical stop 2013-2015, the Inner Detector underwent several upgrades and improvements, most notably an additional Pixel Detector layer was installed. This document describes the improvements done in the Inner Detector and its combined performance in the first year of data taking after the LHC restart in 2015.

  19. The Irish Wind Atlas

    Energy Technology Data Exchange (ETDEWEB)

    Watson, R. [Univ. College Dublin, Dept. of Electronic and Electrical Engineering, Dublin (Ireland); Landberg, L. [Risoe National Lab., Meteorology and Wind Energy Dept., Roskilde (Denmark)

    1999-03-01

    The development work on the Irish Wind Atlas is nearing completion. The Irish Wind Atlas is an updated improved version of the Irish section of the European Wind Atlas. A map of the irish wind resource based on a WA{sup s}P analysis of the measured data and station description of 27 measuring stations is presented. The results of previously presented WA{sup s}P/KAMM runs show good agreement with these results. (au)

  20. Image Pixel Fusion for Human Face Recognition

    CERN Document Server

    Bhowmik, Mrinal Kanti; Nasipuri, Mita; Basu, Dipak Kumar; Kundu, Mahantapas

    2010-01-01

    In this paper we present a technique for fusion of optical and thermal face images based on image pixel fusion approach. Out of several factors, which affect face recognition performance in case of visual images, illumination changes are a significant factor that needs to be addressed. Thermal images are better in handling illumination conditions but not very consistent in capturing texture details of the faces. Other factors like sunglasses, beard, moustache etc also play active role in adding complicacies to the recognition process. Fusion of thermal and visual images is a solution to overcome the drawbacks present in the individual thermal and visual face images. Here fused images are projected into an eigenspace and the projected images are classified using a radial basis function (RBF) neural network and also by a multi-layer perceptron (MLP). In the experiments Object Tracking and Classification Beyond Visible Spectrum (OTCBVS) database benchmark for thermal and visual face images have been used. Compar...