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Sample records for atlas pixel detector

  1. ATLAS ITk Pixel detector

    CERN Document Server

    Gemme, Claudia; The ATLAS collaboration

    2016-01-01

    The high luminosity upgrade of the LHC (HL-LHC) in 2026 will provide new challenge to the ATLAS tracker. The current inner detector will be replaced with a whole silicon tracker which will consist of a five barrel layer Pixel detector surrounded by a four barrel layer Strip detector. The expected high radiation level are requiring the development of upgraded silicon sensors as well as new a front-end chip. The dense tracking environment will require finer granularity detectors. The data rates will require new technologies for high bandwidth data transmission and handling. The current status of the HL-LHC ATLA Pixel detector developments as well as the various layout options will be reviewed.

  2. Commissioning of the ATLAS pixel detector

    Energy Technology Data Exchange (ETDEWEB)

    ATLAS Collaboration; Golling, Tobias

    2008-09-01

    The ATLAS pixel detector is a high precision silicon tracking device located closest to the LHC interaction point. It belongs to the first generation of its kind in a hadron collider experiment. It will provide crucial pattern recognition information and will largely determine the ability of ATLAS to precisely track particle trajectories and find secondary vertices. It was the last detector to be installed in ATLAS in June 2007, has been fully connected and tested in-situ during spring and summer 2008, and is ready for the imminent LHC turn-on. The highlights of the past and future commissioning activities of the ATLAS pixel system are presented.

  3. Operational Experience with the ATLAS Pixel Detector

    CERN Document Server

    Lantzsch, Kerstin; The ATLAS collaboration

    2016-01-01

    Run 2 of the LHC is providing new challenges to track and vertex reconstruction with higher energies, denser jets and higher rates. Therefore the ATLAS experiment has constructed the first 4-layer Pixel detector in HEP, installing a new Pixel layer, also called Insertable B-Layer (IBL). In addition the Pixel detector was refurbished with new service quarter panels to recover about 3% of defective modules lost during run 1 and a new optical readout system to readout the data at higher speed while reducing the occupancy when running with increased luminosity. The commissioning, operation and performance of the 4-layer Pixel Detector will be presented.

  4. Physics performance of the ATLAS pixel detector

    Science.gov (United States)

    Tsuno, S.

    2017-01-01

    In preparation for LHC Run-2 the ATLAS detector introduced a new pixel detector, the Insertable B-Layer (IBL). This detector is located between the beampipe and what was the innermost pixel layer. The tracking and vertex reconstruction are significantly improved and good performance is expected in high level objects such a b-quark jet tagging. This in turn, leads to better physics results. This note summarizes the impact of the IBL detector on physics results, especially focusing on the analyses using b-quark jets throughout 2016 summer physics program.

  5. Physics performance of the ATLAS Pixel Detector

    CERN Document Server

    Tsuno, Soshi; The ATLAS collaboration

    2016-01-01

    One noticeable upgrade from Run-1 to Run-2 with ATLAS detector in proton-proton collisions at LHC is the introduction of the new pixel detector, IBL, located on the beam pipe as the extra innermost pixel layer. The tracking and vertex reconstruction are significantly improved and good performance is expected in high level object such a $b$-quark jet tagging, in turn, it leads the better physics results. This note summarizes what is the impact on the IBL detector to the physics results especially focusing on the analyses using the $b$-quark jets throughout 2016 summer physics program.

  6. ATLAS Inner Detector (Pixel Detector and Silicon Tracker)

    CERN Multimedia

    ATLAS Outreach

    2006-01-01

    To raise awareness of the basic functions of the Pixel Detector and Silicon Tracker in the ATLAS detector on the LHC at CERN. This colorful 3D animation is an excerpt from the film "ATLAS-Episode II, The Particles Strike Back." Shot with a bug's eye view of the inside of the detector. The viewer is taken on a tour of the inner workings of the detector, seeing critical pieces of the detector and hearing short explanations of how each works.

  7. Upgrades of the ATLAS Pixel Detector

    CERN Document Server

    Hügging, F; The ATLAS collaboration

    2013-01-01

    The upgrade for the ATLAS detector will undergo different phases towards HL-LHC. The first upgrade for the Pixel Detector (Phase 1) consists in the construction of a new pixel layer, which will be installed during the 1st long shutdown of the LHC machine (LS1) in 2013/14. The new detector, called Insertable B-Layer (IBL), will be inserted between the existing pixel detector and a new (smaller radius) beam-pipe at a radius of about 3.2 cm. The IBL requires the development of several new technologies to cope with the increase of radiation and pixel occupancy as well as to improve the physics performance of the existing pixel detector. The pixel size is reduced and the material budget is minimized by using new lightweight mechanical support materials and a CO2 based cooling system. For Phase 2 upgrade of LHC a complete new 4-layer pixel system is planned as part of a new all silicon Inner Detector. The increase in luminosity to about $5\\cdot 10^{34}$cm$^{-2}$s$^{-1}$ together with a total expected lifetime of ab...

  8. ATLAS rewards two pixel detector suppliers

    CERN Multimedia

    2007-01-01

    Peter Jenni, ATLAS spokesperson, presented the ATLAS supplier award to Herbert Reichl, IZM director, and to Simonetta Di Gioia, from the SELEX company.Two of ATLAS’ suppliers were awarded prizes at a ceremony on Wednesday 13 June attended by representatives of the experiment’s management and of CERN. The prizes went to the Fraunhofer Institut für Zuverlässigkeit und Mikrointegration (IZM) in Berlin and the company SELEX Sistemi Integrati in Rome for the manufacture of modules for the ATLAS pixel detector. SELEX supplied 1500 of the modules for the tracker, while IZM produced a further 1300. The modules, each made up of 46080 channels, form the active part of the ATLAS pixel detector. IZM and SELEX received the awards for the excellent quality of their work: the average number of faulty channels per module was less than 2.10-3. They also stayed within budget and on schedule. The difficulty they faced was designing modules based on electronic components and sensor...

  9. optical links for the atlas pixel detector

    CERN Document Server

    Stucci, Stefania Antonia; The ATLAS collaboration

    2015-01-01

    Optical links are necessary to satisfy the high speed readout over long distances for advanced silicon detector systems. We report on the optical readout used in the newly installed central pixel layer (IBL) in the ATLAS experiment. The off detector readout employs commercial optical to analog converters, which were extensively tested for this application. Performance measurements during installation and commissioning will be shown. With the increasing instantaneous luminosity in the next years, the next layers outwards of IBL of the ATLAS Pixel detector (Layer 1 and Layer 2) will reach their bandwidth limits. A plan to increase the bandwidth by upgrading the off detector readout chain is put in place. The plan also involves new optical readout components, in particular the optical receivers, for which commercial units cannot be used and a new design has been made. The latter allows for a wider operational range in term of data frequency and light input power to match the on-detector sending units on the pres...

  10. Optical links for the ATLAS Pixel detector

    CERN Document Server

    Stucci, Stefania Antonia; The ATLAS collaboration

    2015-01-01

    Optical links are necessary to satisfy the high speed readout over long distances for advanced silicon detector systems. We report on the optical readout used in the newly installed central pixel layer (IBL) in the ATLAS experiment. The off detector readout employs commercial optical to analog converters, which were extensively tested for this application. Performance measurements during installation and commissioning will be shown. With the increasing instantaneous luminosity in the next years, the next layers outwards of IBL of the ATLAS Pixel detector (Layer 1 and Layer 2) will reach their bandwidth limits. A plan to increase the bandwidth by upgrading the off detector readout chain is put in place. The plan also involves new optical readout components, in particular the optical receivers, for which commercial units cannot be used and a new design has been made. The latter allows for a wider operational range in term of data frequency and light input power to match the on-detector sending units on the pres...

  11. DAQ Hardware and software development for the ATLAS Pixel Detector

    CERN Document Server

    Stramaglia, Maria Elena; The ATLAS collaboration

    2015-01-01

    In 2014, the Pixel Detector of the ATLAS experiment was extended by about 12 million pixels with the installation of the Insertable B-Layer (IBL). Data-taking and tuning procedures have been implemented by employing newly designed read-out hardware, which supports the full detector bandwidth even for calibration. The hardware is supported by an embedded software stack running on the read-out boards. The same boards will be used to upgrade the read-out bandwidth for the two outermost layers of the ATLAS Pixel Barrel (54 million pixels). We present the IBL read-out hardware and the supporting software architecture used to calibrate and operate the 4-layer ATLAS Pixel detector. We discuss the technical implementations and status for data taking, validation of the DAQ system in recent cosmic ray data taking, in-situ calibrations, and results from additional tests in preparation for Run 2 at the LHC.

  12. DAQ hardware and software development for the ATLAS Pixel Detector

    CERN Document Server

    Stramaglia, Maria Elena; The ATLAS collaboration

    2015-01-01

    In 2014, the Pixel Detector of the ATLAS experiment has been extended by about 12 million pixels thanks to the installation of the Insertable B-Layer (IBL). Data-taking and tuning procedures have been implemented along with newly designed read-out hardware to support high bandwidth for data readout and calibration. The hardware is supported by an embedded software stack running on the read-out boards. The same boards will be used to upgrade the read-out bandwidth for the two outermost layers of the ATLAS Pixel Barrel (54 million pixels). We present the IBL read-out hardware and the supporting software architecture used to calibrate and operate the 4-layer ATLAS Pixel detector. We discuss the technical implementations and status for data taking, validation of the DAQ system in recent cosmic ray data taking, in-situ calibrations, and results from additional tests in preparation for Run 2 at the LHC.

  13. Online calibrations and performance of the ATLAS Pixel Detector

    CERN Document Server

    Keil, M; The ATLAS collaboration

    2010-01-01

    The ATLAS Pixel Detector is the innermost detector of the ATLAS experiment at the Large Hadron Collider at CERN. It consists of 1744 silicon sensors equipped with approximately 80 M electronic channels, providing typically three measurement points with high resolution for particles emerging from the beam-interaction region, thus allowing measuring particle tracks and secondary vertices with very high precision. The readout system of the Pixel Detector is based on a bi-directional optical data transmission system between the detector and the data acquisition system with an individual link for each of the 1744 modules. Signal conversion components are located on both ends, approximately 80 m apart. The talk will give an overview of the calibration and performance of both the detector and its optical readout. The most basic parameter to be tuned and calibrated for the detector electronics is the readout threshold of the individual pixel channels. These need to be carefully tuned to optimise position resolution a...

  14. Fabrication of ATLAS pixel detector prototypes at IRST

    CERN Document Server

    Boscardin, M; Gregori, P; Zen, M; Zori, N

    2001-01-01

    We report on the development of a fabrication technology for n-on-n silicon pixel detectors oriented to the ATLAS experiment at LHC. The main processing issues and some selected results from the electrical characterization of detector prototypes and related test structures are presented and discussed. (5 refs).

  15. Operational Experience with the ATLAS Pixel Detector at LHC

    CERN Document Server

    Keil, M

    2013-01-01

    The ATLAS Pixel Detector is the innermost detector of the ATLAS experiment at the Large Hadron Collider at CERN, providing high-resolution measurements of charged particle tracks in the high radiation environment close to the collision region. This capability is vital for the identification and measurement of proper decay times of long-lived particles such as b-hadrons, and thus crucial for the ATLAS physics program. The detector provides hermetic coverage with three cylindrical layers and three layers of forward and backward pixel detectors. It consists of approximately 80 million pixels that are individually read out via front-end chips bump-bonded to 1744 n-on-n silicon substrates. In this paper results from the successful operation of the Pixel Detector at the LHC will be presented, including calibration procedures, detector performance and measurements of radiation damage. The detector performance is excellent: more than 95% of the pixels are operational, noise occupancy and hit efficiency exceed the des...

  16. Neural network based cluster creation in the ATLAS Pixel Detector

    CERN Document Server

    Andreazza, A; The ATLAS collaboration

    2012-01-01

    The read-out from individual pixels on planar semi-conductor sensors are grouped into clusters to reconstruct the location where a charged particle passed through the sensor. The resolution given by individual pixel sizes is significantly improved by using the information from the charge sharing be- tween pixels. Such analog cluster creation techniques have been used by the ATLAS experiment for many years to obtain an excellent performance. How- ever, in dense environments, such as those inside high-energy jets, clusters have an increased probability of merging the charge deposited by multiple particles. Recently, a neural network based algorithm which estimates both the cluster position and whether a cluster should be split has been developed for the ATLAS Pixel Detector. The algorithm significantly reduces ambigui- ties in the assignment of pixel detector measurement to tracks and improves the position accuracy with respect to standard techniques by taking into account the 2-dimensional charge distribution.

  17. Online Calibration and Performance of the ATLAS Pixel Detector

    CERN Document Server

    Keil, M

    2011-01-01

    The ATLAS Pixel Detector is the innermost detector of the ATLAS experiment at the Large Hadron Collider at CERN. It consists of 1744 silicon sensors equipped with approximately 80 million electronic channels, providing typically three measurement points with high resolution for particles emerging from the beam-interaction region, thus allowing measuring particle tracks and secondary vertices with very high precision. The readout system of the Pixel Detector is based on a bi-directional optical data transmission system between the detector and the data acquisition system with an individual link for each of the 1744 modules. Signal conversion components are located on both ends, approximately 80 m apart. This paper describes the tuning and calibration of the optical links and the detector modules, including measurements of threshold, noise, charge measurement, timing performance and the sensor leakage current.

  18. The ATLAS tracker Pixel detector for HL-LHC

    CERN Document Server

    Gemme, Claudia; The ATLAS collaboration

    2017-01-01

    The high luminosity upgrade of the LHC (HL-LHC) in 2026 will provide new challenges to the ATLAS tracker. The current Inner Detector will be replaced with a whole silicon tracker which will consist of a five barrel layer Pixel detector surrounded by a four barrel layer Strip detector. The expected high radiation levels are requiring the development of upgraded silicon sensors as well as new a front-end chip. The dense tracking environment will require finer granularity detectors. The data rates will require new technologies for high bandwidth data transmission and handling. The current status of the HL-LHC ATLAS Pixel detector developments as well as the various layout options are reviewed.

  19. Overview of the ATLAS Insertable B-Layer Pixel Detector

    CERN Document Server

    Pernegger, H; The ATLAS collaboration

    2011-01-01

    ATLAS currently develops a new pixel detector for the first upgrade of its tracking system: The ATLAS Insertable B-Layer Pixel detector (IBL). The new layer will be inserted between the inner most layer of the current pixel detector and a new beam pipe. The sensors are placed at a radius of 3.4cm. The expected high radiation levels and high hit occupancy require new developments for front-end chip and the sensor which can stand radiation levels beyond 5E15 neq/cm2. ATLAS has developed the new FEI4 and new silicon sensors to be used as pixel modules. Furthermore a new lightweight support and cooling structure was developed, which minimizes the overall radiation and allows detector cooling with CO2 at -40C coolant temperature. Currently the overall integration and installation procedure is being developed and test ready for installation in ATLAS in 2013. The presentation summarizes the current state of development of IBL modules, first preliminary test results of the new chip with new sensors, the construction ...

  20. Pixel detector modules performance for ATLAS IBL and future pixel detectors

    CERN Document Server

    AUTHOR|(INSPIRE)INSPIRE-00355104; Pernegger, Heinz

    2015-11-06

    The ATLAS Detector is one of the four big particle physics experiments at CERN’s LHC. Its innermost tracking system consisted of the 3-Layer silicon Pixel Detector (~80M readout channels) in the first run (2010-2012). Over the past two years it was refurbished and equipped with new services as well as a new beam monitor. The major upgrade, however, was the Insertable B-Layer (IBL). It adds ~12M readout channels for improved vertexing, tracking robustness and b-tagging performance for the upcoming runs, before the high luminosity upgrade of the LHC will take place. This thesis covers two main aspects of Pixel detector performance studies: The main work was the planning, commissioning and operation of a test bench that meets the requirements of current pixel detector components. Each newly built ATLAS IBL stave was thoroughly tested, following a specifically developed procedure, and initially calibrated in that setup. A variety of production accompanying measurements as well as preliminary results after integ...

  1. Optical Links for the ATLAS Pixel Detector

    CERN Document Server

    Gregor, Ingrid-Maria

    In der vorliegenden Dissertation wird eine strahlentolerante optische Datenstrecke mit hoher Datenrate für den Einsatz in dem Hochenergiephysikexperiment Atlas am Lhc Beschleuniger entwickelt. Da die Lhc-Experimente extremen Strahlenbelastungen ausgesetzt sind, müssen die Komponenten spezielle Ansprüche hinsichtlich der Strahlentoleranz erfüllen. Die Qualifikation der einzelnen Bauteile wurde im Rahmen dieser Arbeit durchgeführt. Die zu erwartenden Fluenzen im Atlas Inner Detector für Silizium und Gallium Arsenid (GaAs) wurden berechnet. Siliziumbauteile werden einer Fluenz von bis zu 1.1.1015neq /cm2 in 1 MeV äquivalenten Neutronen ausgesetzt sein, wohingegen GaAs Bauteile bis zu 7.8.1015neq /cm2 ausgesetzt sein werden. Die Strahlentoleranz der einzelnen benötigten Komponenten wie z.B. der Laserdioden sowie der jeweiligen Treiberchips wurde untersucht. Sowohl die Photo- als auch die Laserdioden haben sich als strahlentolerant für die Fluenzen an dem vorgesehenen Radius erwiesen. Aus de...

  2. Monitoring Radiation Damage in the ATLAS Pixel Detector

    CERN Document Server

    Schorlemmer, André Lukas; Große-Knetter, Jörn; Rembser, Christoph; Di Girolamo, Beniamino

    2014-11-05

    Radiation hardness is one of the most important features of the ATLAS pixel detector in order to ensure a good performance and a long lifetime. Monitoring of radiation damage is crucial in order to assess and predict the expected performance of the detector. Key values for the assessment of radiation damage in silicon, such as the depletion voltage and depletion depth in the sensors, are measured on a regular basis during operations. This thesis summarises the monitoring program that is conducted in order to assess the impact of radiation damage and compares it to model predictions. In addition, the physics performance of the ATLAS detector highly depends on the amount of disabled modules in the ATLAS pixel detector. A worrying amount of module failures was observed during run I. Thus it was decided to recover repairable modules during the long shutdown (LS1) by extracting the pixel detector. The impact of the module repairs and module failures on the detector performance is analysed in this thesis.

  3. The ATLAS Insertable B-Layer Pixel Detector

    CERN Document Server

    Pernegger, H; The ATLAS collaboration

    2011-01-01

    ATLAS currently develops a new pixel detector for the first upgrade of its tracking system: The ATLAS Insertable B-Layer Pixel detector (IBL). The new layer will be inserted between the inner most layer of the current pixel detector and a new beam pipe. The sensors are placed at a radius of 3.4 cm. The expected high radiation levels and high hit occupancy require new developments for front-end chip and sensors which can stand radiation levels beyond 5$ imes$10$^{15}$ n$_{eq}$/cm$^{2}$ . ATLAS has developed the new FEI4 chip and new silicon sensors to be used as pixel modules. Furthermore a new lightweight support and cooling structure was developed, which minimizes the overall radiation length and allows detector cooling with CO$_{2}$ at -40 $^{circ}$C coolant temperature. Currently the overall integration and installation procedure is being developed and tested ready for installation in 2013. The paper summarizes the current state of development of IBL modules, first preliminary test results of the new chip ...

  4. Calibration Analysis Software for the ATLAS Pixel Detector

    CERN Document Server

    Stramaglia, Maria Elena; The ATLAS collaboration

    2015-01-01

    The calibration of the ATLAS Pixel detector at LHC fulfils two main purposes: to tune the front-end configuration parameters for establishing the best operational settings and to measure the tuning performance through a subset of scans. An analysis framework has been set up in order to take actions on the detector given the outcome of a calibration scan (e.g. to create a mask for disabling noisy pixels). The software framework to control all aspects of the Pixel detector scans and analyses is called Calibration Console. The introduction of a new layer, equipped with new Front End-I4 Chips, required an update the Console architecture. It now handles scans and scans analyses applied together to chips with different characteristics. An overview of the newly developed Calibration Analysis Software will be presented, together with some preliminary result.

  5. Calibration analysis software for the ATLAS Pixel Detector

    Science.gov (United States)

    Stramaglia, Maria Elena

    2016-07-01

    The calibration of the ATLAS Pixel Detector at LHC fulfils two main purposes: to tune the front-end configuration parameters for establishing the best operational settings and to measure the tuning performance through a subset of scans. An analysis framework has been set up in order to take actions on the detector given the outcome of a calibration scan (e.g. to create a mask for disabling noisy pixels). The software framework to control all aspects of the Pixel Detector scans and analyses is called calibration console. The introduction of a new layer, equipped with new FE-I4 chips, required an update of the console architecture. It now handles scans and scan analyses applied together to chips with different characteristics. An overview of the newly developed calibration analysis software will be presented, together with some preliminary results.

  6. Validation studies of the ATLAS pixel detector control system

    Energy Technology Data Exchange (ETDEWEB)

    Schultes, Joachim [University of Wuppertal, Gaussstr. 20, 42097 Wuppertal (Germany)]. E-mail: schultes@physik.uni-wuppertal.de; Becks, Karl-Heinz [University of Wuppertal, Gaussstr. 20, 42097 Wuppertal (Germany); Flick, Tobias [University of Wuppertal, Gaussstr. 20, 42097 Wuppertal (Germany); Henss, Tobias [University of Wuppertal, Gaussstr. 20, 42097 Wuppertal (Germany); Imhaeuser, Martin [University of Wuppertal, Gaussstr. 20, 42097 Wuppertal (Germany); Kersten, Susanne [University of Wuppertal, Gaussstr. 20, 42097 Wuppertal (Germany); Kind, Peter [University of Wuppertal, Gaussstr. 20, 42097 Wuppertal (Germany); Lantzsch, Kerstin [University of Wuppertal, Gaussstr. 20, 42097 Wuppertal (Germany); Maettig, Peter [University of Wuppertal, Gaussstr. 20, 42097 Wuppertal (Germany); Reeves, Kendall [University of Wuppertal, Gaussstr. 20, 42097 Wuppertal (Germany); Weingarten, Jens [University of Bonn, Nussallee 12, 53115 Bonn (Germany)

    2006-09-01

    The ATLAS pixel detector consists of 1744 identical silicon pixel modules arranged in three barrel layers providing coverage for the central region, and three disk layers on either side of the primary interaction point providing coverage of the forward regions. Once deployed into the experiment, the detector will employ optical data transfer, with the requisite powering being provided by a complex system of commercial and custom-made power supplies. However, during normal performance and production tests in the laboratory, only single modules are operated and electrical readout is used. In addition, standard laboratory power supplies are used. In contrast to these normal tests, the data discussed here were obtained from a multi-module assembly which was powered and read out using production items: the optical data path, the final design power supply system using close to final services, and the Detector Control System (DCS)

  7. ATLAS Pixel Detector Design For HL-LHC

    CERN Document Server

    Smart, Ben; The ATLAS collaboration

    2016-01-01

    The ATLAS Inner Detector will be replaced for the High-Luminosity LHC (HL-LHC) running in 2026. The new Inner Detector will be called the Inner Tracker (ITk). The ITk will cover an extended eta-range: at least to |eta|<3.2, and likely up to |eta|<4.0. The ITk will be an all-Silicon based detector, consisting of a Silicon strip detector outside of a radius of 362 mm, and a Silicon pixel detector inside of this radius. Several novel designs are being considered for the ITk pixel detector, to cope with high-eta charged particle tracks. These designs are grouped into 'extended' and 'inclined' design-types. Extended designs have long pixel staves with sensors parallel to the beamline, while inclined designs have sensors angled such that they point towards the interaction point. The relative advantages and challenges of these two classes of designs will be examined in this paper, along with the mechanical solutions being considered. Thermal management, radiation-length mapping, and electrical services will al...

  8. ATLAS Pixel Detector Design For HL-LHC

    CERN Document Server

    Smart, Ben; The ATLAS collaboration

    2016-01-01

    The ATLAS Inner Detector will be replaced for the High-Luminosity LHC (HL-LHC) running in 2026. The new Inner Detector will be called the Inner Tracker (ITk). The ITk will cover an extended eta-range: at least to |eta|<3.2, and likely up to |eta|<4.0. The ITk will be an all-Silicon based detector, consisting of a Silicon strip detector outside of a radius of 362mm, and a Silicon pixel detector inside of this radius. Several novel designs are being considered for the ITk pixel detector, to cope with high-eta charged particle tracks. These designs are grouped into 'extended' and 'inclined' design-types. Extended designs have long pixel staves with sensors parallel to the beamline. High-eta particles will therefore hit these sensors at shallow angles, leaving elongated charge clusters. The length of such a charge cluster can be used to estimate the angle of the passing particle. This information can then be used in track reconstruction to improve tracking efficiency and reduce fake rates. Inclined designs ...

  9. ATLAS pixel detector design for the HL-LHC

    Science.gov (United States)

    Smart, B.

    2017-02-01

    The ATLAS Inner Detector will be replaced for the High-Luminosity LHC (HL-LHC) running in 2026. The new Inner Detector is called the Inner Tracker (ITk). The ITk will cover an extended η-range: at least to |η|<3.2, and likely up to 0|η|<4.. The ITk will be an all-Silicon based detector, consisting of a Silicon strip detector outside of a radius of 362 mm, and a Silicon pixel detector inside of this radius. Several novel designs are being considered for the ITk pixel detector, to cope with high-eta charged particle tracks. These designs are grouped into `extended' and `inclined' design-types. Extended designs have long pixel staves with sensors parallel to the beamline, while inclined designs have sensors angled such that they point towards the interaction point. The relative advantages and challenges of these two classes of designs will be examined in this paper, along with the mechanical solutions being considered. Thermal management, radiation-length mapping, and electrical services will also be discussed.

  10. The upgraded Pixel Detector of the ATLAS Experiment for Run 2 at the Large Hadron Collider

    Energy Technology Data Exchange (ETDEWEB)

    Backhaus, M., E-mail: malte.backhaus@cern.ch

    2016-09-21

    During Run 1 of the Large Hadron Collider (LHC), the ATLAS Pixel Detector has shown excellent performance. The ATLAS collaboration took advantage of the first long shutdown of the LHC during 2013 and 2014 and extracted the ATLAS Pixel Detector from the experiment, brought it to surface and maintained the services. This included the installation of new service quarter panels, the repair of cables, and the installation of the new Diamond Beam Monitor (DBM). Additionally, a completely new innermost pixel detector layer, the Insertable B-Layer (IBL), was constructed and installed in May 2014 between a new smaller beam pipe and the existing Pixel Detector. With a radius of 3.3 cm the IBL is located extremely close to the interaction point. Therefore, a new readout chip and two new sensor technologies (planar and 3D) are used in the IBL. In order to achieve best possible physics performance the material budget was improved with respect to the existing Pixel Detector. This is realized using lightweight staves for mechanical support and a CO{sub 2} based cooling system. This paper describes the improvements achieved during the maintenance of the existing Pixel Detector as well as the performance of the IBL during the construction and commissioning phase. Additionally, first results obtained during the LHC Run 2 demonstrating the distinguished tracking performance of the new Four Layer ATLAS Pixel Detector are presented.

  11. Development and characterization of diamond and 3D-silicon pixel detectors with ATLAS-pixel readout electronics

    Energy Technology Data Exchange (ETDEWEB)

    Mathes, Markus

    2008-12-15

    Hybrid pixel detectors are used for particle tracking in the innermost layers of current high energy experiments like ATLAS. After the proposed luminosity upgrade of the LHC, they will have to survive very high radiation fluences of up to 10{sup 16} particles per cm{sup 2} per life time. New sensor concepts and materials are required, which promise to be more radiation tolerant than the currently used planar silicon sensors. Most prominent candidates are so-called 3D-silicon and single crystal or poly-crystalline diamond sensors. Using the ATLAS pixel electronics different detector prototypes with a pixel geometry of 400 x 50 {mu}m{sup 2} have been built. In particular three devices have been studied in detail: a 3D-silicon and a single crystal diamond detector with an active area of about 1 cm{sup 2} and a poly-crystalline diamond detector of the same size as a current ATLAS pixel detector module (2 x 6 cm{sup 2}). To characterize the devices regarding their particle detection efficiency and spatial resolution, the charge collection inside a pixel cell as well as the charge sharing between adjacent pixels was studied using a high energy particle beam. (orig.)

  12. Pixel Detectors

    OpenAIRE

    Wermes, Norbert

    2005-01-01

    Pixel detectors for precise particle tracking in high energy physics have been developed to a level of maturity during the past decade. Three of the LHC detectors will use vertex detectors close to the interaction point based on the hybrid pixel technology which can be considered the state of the art in this field of instrumentation. A development period of almost 10 years has resulted in pixel detector modules which can stand the extreme rate and timing requirements as well as the very harsh...

  13. Calibration Analysis Software for the ATLAS Pixel Detector

    CERN Document Server

    Stramaglia, Maria Elena; The ATLAS collaboration

    2015-01-01

    The calibration of the Pixel detector fulfills two main purposes: to tune front-end registers for establishing the best operational settings and to measure the tuning performance through a subset of scans. An analysis framework has been set up in order to take actions on the detector given the outcome of a calibration scan (e.g. to create a mask for disabling noisy pixels). The software framework to control all aspects of the Pixel detector scans and analyses is called Calibration Console. The introduction of a new layer, equipped with new Front End-I4 Chips, required an update the Console architecture. It now handles scans and scans analyses applied toghether to chips with dierent characteristics. An overview of the newly developed Calibration Analysis Software will be presented, together with some preliminary result.

  14. Optical Readout in a Multi-Module System Test for the ATLAS Pixel Detector

    CERN Document Server

    Flick, T; Gerlach, P; Kersten, S; Mättig, P; Kirichu, S N; Reeves, K; Richter, J; Schultes, J; Flick, Tobias; Becks, Karl-Heinz; Gerlach, Peter; Kersten, Susanne; Maettig, Peter; Kirichu, Simon Nderitu; Reeves, Kendall; Richter, Jennifer; Schultes, Joachim

    2006-01-01

    The innermost part of the ATLAS experiment at the LHC, CERN, will be a pixel detector. The command messages and the readout data of the detector are transmitted over an optical data path. The readout chain consists of many components which are produced at several locations around the world, and must work together in the pixel detector. To verify that these parts are working together as expected a system test has been built up. In this paper the system test setup and the operation of the readout chain is described. Also, some results of tests using the final pixel detector readout chain are given.

  15. Operational Performance and Status of the ATLAS Pixel Detector at the LHC

    CERN Document Server

    Jentzsch, J; The ATLAS collaboration

    2014-01-01

    The ATLAS Pixel Detector is the innermost detector of the ATLAS experi- ment at the Large Hadron Collider at CERN. The detector provides hermetic coverage with three cylindrical layers and three layers of forward and backward pixel detectors. It consists of approximately 80 million pixels that are individu- ally read out via chips bump-bonded to 1744 n+-in-n silicon substrates. In this talk, results from the successful operation of the Pixel Detector at the LHC and its status after three years of operation will be presented, including moni- toring, calibration procedures, timing optimization and detector performance. The record breaking instantaneous luminosities of 7.7 · 1033 cm−2s−1 recently surpassed at the Large Hadron Collider generate a rapidly increasing particle fluence in the ATLAS Pixel Detector. As the radiation dose accumulates, the first effects of radiation damage are now observable in the silicon sensors. A regular monitoring program has been conducted and reveals an increase in the silico...

  16. Operational performance and status of the ATLAS pixel detector at the LHC

    CERN Document Server

    Ince, T; The ATLAS collaboration

    2013-01-01

    The ATLAS Pixel Detector is the innermost detector of the ATLAS experiment at the Large Hadron Collider at CERN. The detector provides hermetic coverage with three cylindrical layers and three layers of forward and backward pixel detectors. It consists of approximately 80 million pixels that are individually read out via chips bump-bonded to 1744 n-in-n silicon substrates. In this talk, results from the successful operation of the Pixel Detector at the LHC and its status after three years of operation will be presented, including monitoring, calibration procedures, timing optimization and detector performance. The record breaking instantaneous luminosities of 7.7 x 10^33 cm-2 s-1 recently surpassed at the Large Hadron Collider generate a rapidly increasing particle fluence in the ATLAS Pixel Detector. As the radiation dose accumulates, the first effects of radiation damage are now observable in the silicon sensors. A regular monitoring program has been conducted and reveals an increase in the silicon leakage ...

  17. Status and future of the ATLAS Pixel Detector at the LHC

    CERN Document Server

    Rozanov, A; The ATLAS collaboration

    2013-01-01

    The ATLAS Pixel Detector is the innermost detector of the ATLAS experiment at the Large Hadron Collider at CERN. The detector provides hermetic coverage with three cylindrical layers and three layers of forward and backward pixel detectors. It consists of approximately 80 million pixels that are individually read out via chips bump-bonded to 1744 n-in-n silicon substrates. In this talk, results from the successful operation of the Pixel Detector at the LHC and its status after three years of operation will be presented, including monitoring, calibration procedures, timing optimization and detector performance. The record breaking instantaneous luminosities of 7.7 x 10^33 cm-2 s-1 recently surpassed at the Large Hadron Collider generate a rapidly increasing particle fluence in the ATLAS Pixel Detector. As the radiation dose accumulates, the first effects of radiation damage are now observable in the silicon sensors. A regular monitoring program has been conducted and reveals an increase in the silicon leakage ...

  18. Operational Performance and Status of the ATLAS Pixel Detector at the LHC

    CERN Document Server

    Jentzsch, J; The ATLAS collaboration

    2013-01-01

    The ATLAS Pixel Detector is the innermost detector of the ATLAS experiment at the Large Hadron Collider at CERN. The detector provides hermetic coverage with three cylindrical layers and three layers of forward and backward pixel detectors. It consists of approximately 80 million pixels that are individually read out via chips bump-bonded to 1744 n-in-n silicon substrates. In this talk, results from the successful operation of the Pixel Detector at the LHC and its status after three years of operation will be presented, including monitoring, calibration procedures, timing optimization and detector performance. The record breaking instantaneous luminosities of 7.7 x 10^33 cm-2 s-1 recently surpassed at the Large Hadron Collider generate a rapidly increasing particle fluence in the ATLAS Pixel Detector. As the radiation dose accumulates, the first effects of radiation damage are now observable in the silicon sensors. A regular monitoring program has been conducted and reveals an increase in the silicon leakage ...

  19. Neural network based cluster creation in the ATLAS silicon Pixel Detector

    CERN Document Server

    Andreazza, A; The ATLAS collaboration

    2013-01-01

    The read-out from individual pixels on planar semi-conductor sensors are grouped into clusters to reconstruct the location where a charged particle passed through the sensor. The resolution given by individual pixel sizes is significantly improved by using the information from the charge sharing between pixels. Such analog cluster creation techniques have been used by the ATLAS experiment for many years to obtain an excellent performance. However, in dense environments, such as those inside high-energy jets, clusters have an increased probability of merging the charge deposited by multiple particles. Recently, a neural network based algorithm which estimates both the cluster position and whether a cluster should be split has been developed for the ATLAS Pixel Detector. The algorithm significantly reduces ambiguities in the assignment of pixel detector measurement to tracks within jets and improves the position accuracy with respect to standard interpolation techniques by taking into account the 2-dimensional ...

  20. Neural network based cluster creation in the ATLAS silicon Pixel Detector

    CERN Document Server

    Perez Cavalcanti, T; The ATLAS collaboration

    2012-01-01

    The hit signals read out from pixels on planar semi-conductor sensors are grouped into clusters, to reconstruct the location where a charged particle passed through. The resolution of the individual pixel sizes can be improved significantly using the information from the cluster of adjacent pixels. Such analog cluster creation techniques have been used by the ATLAS experiment for many years giving an excellent performance. However, in dense environments, such as those inside high-energy jets, is likely that the charge deposited by two or more close-by tracks merges into one single cluster. A new pattern recognition algorithm based on neural network methods has been developed for the ATLAS Pixel Detector. This can identify the shared clusters, split them if necessary, and estimate the positions of all particles traversing the cluster. The algorithm significantly reduces ambiguities in the assignment of pixel detector measurements to tracks within jets, and improves the positional accuracy with respect to stand...

  1. Performance of silicon pixel detectors at small track incidence angles for the ATLAS Inner Tracker upgrade

    Energy Technology Data Exchange (ETDEWEB)

    Viel, Simon, E-mail: sviel@lbl.gov [Physics Division, Lawrence Berkeley National Laboratory and University of California, Berkeley, CA, United States of America (United States); Banerjee, Swagato [Department of Physics, University of Wisconsin, Madison, WI, United States of America (United States); Brandt, Gerhard; Carney, Rebecca; Garcia-Sciveres, Maurice [Physics Division, Lawrence Berkeley National Laboratory and University of California, Berkeley, CA, United States of America (United States); Hard, Andrew Straiton; Kaplan, Laser Seymour; Kashif, Lashkar [Department of Physics, University of Wisconsin, Madison, WI, United States of America (United States); Pranko, Aliaksandr [Physics Division, Lawrence Berkeley National Laboratory and University of California, Berkeley, CA, United States of America (United States); Rieger, Julia [Physics Division, Lawrence Berkeley National Laboratory and University of California, Berkeley, CA, United States of America (United States); II Physikalisches Institut, Georg-August-Universität, Göttingen (Germany); Wolf, Julian [Physics Division, Lawrence Berkeley National Laboratory and University of California, Berkeley, CA, United States of America (United States); Wu, Sau Lan; Yang, Hongtao [Department of Physics, University of Wisconsin, Madison, WI, United States of America (United States)

    2016-09-21

    In order to enable the ATLAS experiment to successfully track charged particles produced in high-energy collisions at the High-Luminosity Large Hadron Collider, the current ATLAS Inner Detector will be replaced by the Inner Tracker (ITk), entirely composed of silicon pixel and strip detectors. An extension of the tracking coverage of the ITk to very forward pseudorapidity values is proposed, using pixel modules placed in a long cylindrical layer around the beam pipe. The measurement of long pixel clusters, detected when charged particles cross the silicon sensor at small incidence angles, has potential to significantly improve the tracking efficiency, fake track rejection, and resolution of the ITk in the very forward region. The performance of state-of-the-art pixel modules at small track incidence angles is studied using test beam data collected at SLAC and CERN. - Highlights: • Extended inner pixel barrel layers are proposed for the ATLAS ITk upgrade. • Test beam results at small track incidence angles validate this ATLAS ITk design. • Long pixel clusters are reconstructed with high efficiency at low threshold values. • Excellent angular resolution is achieved using pixel cluster length information.

  2. dE/dx measurement in the ATLAS Pixel Detector and its use for particle identification

    CERN Document Server

    The ATLAS collaboration

    2011-01-01

    The ATLAS Pixel Detector provides a measurement of the charge deposited by each track crossing it. This note presents a study of how this information can be used to identify low beta particles. This study uses hits recorded in the 7 TeV proton-proton collisions during the 2010 run period and the corresponding Monte Carlo simulation. The track reconstruction has been done in the standard ATLAS software environment.

  3. The upgraded Pixel Detector of the ATLAS Experiment for Run 2 at the Large Hadron Collider

    CERN Document Server

    Backhaus, M

    2016-01-01

    During Run 1 of the Large Hadron Collider (LHC), the ATLAS Pixel Detector has shown excellent performance. The ATLAS collaboration took advantage of the first long shutdown of the LHC during 2013 and 2014 and extracted the ATLAS Pixel Detector from the experiment, brought it to surface and maintained the services. This included the installation of new service quarter panels, the repair of cables, and the installation of the new Diamond Beam Monitor (DBM). Additionally, a completely new innermost pixel detector layer, the Insertable B-Layer (IBL), was constructed and installed in May 2014 between a new smaller beam pipe and the existing Pixel Detector. With a radius of 3.3 cm the IBL is located extremely close to the interaction point. Therefore, a new readout chip and two new sensor technologies (planar and 3D) are used in the IBL. In order to achieve best possible physics performance the material budget was improved with respect to the existing Pixel Detector. This is realized using lightweight staves for me...

  4. The upgraded Pixel Detector of the ATLAS Experiment for Run2 at the Large Hadron Collider

    CERN Document Server

    Backhaus, Malte; The ATLAS collaboration

    2015-01-01

    During Run-1 of the Large Hadron Collider (LHC), the ATLAS Pixel Detector has shown excellent performance. The ATLAS collaboration took advantage of the first long shutdown of the LHC during 2013 and 2014 and extracted the ATLAS Pixel Detector from the experiment, brought it to surface and maintained the services. This includes the installation of new service quarter panels, the repair of cables, and the installation of the new Diamond Beam Monitor (DBM). Additionally a completely new innermost pixel detector layer, the Insertable B-Layer (IBL), was constructed and installed in May 2014 between a new smaller beam pipe and the existing Pixel Detector. With a radius of 3.3 cm the IBL is located extremely close to the interaction point. Therefore a new readout chip and two new sensor technologies (planar and 3D) are used in IBL. In order to achieve best possible physics performance the material budget was improved with respect to the existing Pixel Detector. This is realized using lightweight staves for mechanic...

  5. Performance of silicon pixel detectors at small track incidence angles for the ATLAS Inner Tracker upgrade

    Science.gov (United States)

    Viel, Simon; Banerjee, Swagato; Brandt, Gerhard; Carney, Rebecca; Garcia-Sciveres, Maurice; Hard, Andrew Straiton; Kaplan, Laser Seymour; Kashif, Lashkar; Pranko, Aliaksandr; Rieger, Julia; Wolf, Julian; Wu, Sau Lan; Yang, Hongtao

    2016-09-01

    In order to enable the ATLAS experiment to successfully track charged particles produced in high-energy collisions at the High-Luminosity Large Hadron Collider, the current ATLAS Inner Detector will be replaced by the Inner Tracker (ITk), entirely composed of silicon pixel and strip detectors. An extension of the tracking coverage of the ITk to very forward pseudorapidity values is proposed, using pixel modules placed in a long cylindrical layer around the beam pipe. The measurement of long pixel clusters, detected when charged particles cross the silicon sensor at small incidence angles, has potential to significantly improve the tracking efficiency, fake track rejection, and resolution of the ITk in the very forward region. The performance of state-of-the-art pixel modules at small track incidence angles is studied using test beam data collected at SLAC and CERN.

  6. Performance of Silicon Pixel Detectors at Small Track Incidence Angles for the ATLAS Inner Tracker Upgrade

    CERN Document Server

    Viel, Simon; The ATLAS collaboration; Brandt, Gerhard; Carney, Rebecca; Garcia-Sciveres, Maurice; Hard, Andrew; Kaplan, Laser Seymour; Kashif, Lashkar; Pranko, Aliaksandr; Rieger, Julia; Wolf, Julian Choate; Wu, Sau Lan; Yang, Hongtao

    2015-01-01

    In order to enable the ATLAS experiment to successfully track charged particles produced in high-energy collisions at the High-Luminosity Large Hadron Collider, the current ATLAS Inner Detector will be replaced by the Inner Tracker (ITk), entirely composed of silicon pixel and strip detectors. An extension of the tracking coverage of the ITk to very forward pseudorapidity values is proposed, using pixel modules placed in a long cylindrical layer around the beam pipe. The measurement of long pixel clusters, detected when charged particles cross the silicon sensor at small incidence angles, has potential to significantly improve the tracking efficiency, fake track rejection, and resolution of the ITk in the very forward region. The performance of state-of-the-art pixel modules at small track incidence angles is studied using test beam data collected at SLAC and CERN.

  7. Operational Experience of the ATLAS SemiConductor Tracker and Pixel Detector

    CERN Document Server

    Robinson, Dave; The ATLAS collaboration

    2016-01-01

    The tracking performance of the ATLAS detector relies critically on the silicon and gaseous tracking subsystems that form the ATLAS Inner Detector. Those subsystems have undergone significant hardware and software upgrades to meet the challenges imposed by the higher collision energy, pileup and luminosity that are being delivered by the LHC during Run2. The key status and performance metrics of the Pixel Detector and the Semi Conductor Tracker are summarised, and the operational experience and requirements to ensure optimum data quality and data taking efficiency are described.

  8. Pixel detectors

    CERN Document Server

    Passmore, M S

    2001-01-01

    positions on the detector. The loss of secondary electrons follows the profile of the detector and increases with higher energy ions. studies of the spatial resolution predict a value of 5.3 lp/mm. The image noise in photon counting systems is investigated theoretically and experimentally and is shown to be given by Poisson statistics. The rate capability of the LAD1 was measured to be 250 kHz per pixel. Theoretical and experimental studies of the difference in contrast for ideal charge integrating and photon counting imaging systems were carried out. It is shown that the contrast differs and that for the conventional definition (contrast = (background - signal)/background) the photon counting device will, in some cases, always give a better contrast than the integrating system. Simulations in MEDICI are combined with analytical calculations to investigate charge collection efficiencies (CCE) in semiconductor detectors. Different pixel sizes and biasing conditions are considered. The results show charge shari...

  9. Studies for the detector control system of the ATLAS pixel at the HL-LHC

    CERN Document Server

    Püllen, L; Boek, J; Kersten, S; Kind, P; Mättig, P; Zeitnitz, C

    2012-01-01

    experiment will be replaced completely. As part of this redesign there will also be a new pixel detector. This new pixel detector requires a control system which meets the strict space requirements for electronics in the ATLAS experiment. To accomplish this goal we propose a DCS (Detector Control System) network with the smallest form factor currently available. This network consists of a DCS chip located in close proximity to the interaction point and a DCS controller located in the outer regions of the ATLAS detector. These two types of chips form a star shaped network with several DCS chips being controlled by one DCS controller. Both chips are manufactured in deep sub-micron technology. We present prototypes with emphasis on studies concerning single event upsets.

  10. The upgraded Pixel Detector of the ATLAS experiment for Run-2 at the Large Hadron Collider

    CERN Document Server

    Giordani, MarioPaolo; The ATLAS collaboration

    2016-01-01

    Run-2 of the LHC is providing new challenges to track and vertex reconstruction with higher energies, denser jets and higher rates. Therefore the ATLAS experiment has constructed the first 4-layer Pixel detector in HEP, installing a new Pixel layer, also called Insertable B-Layer (IBL). IBL is a fourth layer of pixel detectors, and has been installed in May 2014 at a radius of 3.3 cm between the existing Pixel Detector and a new smaller radius beam-pipe. The new detector, built to cope with high radiation and expected occupancy, is the first large scale application of 3D detectors and CMOS 130nm technology. In addition the Pixel detector was refurbished with a new service quarter panel to recover about 3% of defective modules lost during run-1 and a new optical readout system to readout the data at higher speed while reducing the occupancy when running with increased luminosity. The commissioning and performance of the 4-layer Pixel Detector, in particular the IBL, will be presented, using collision data.

  11. The Upgraded Pixel Detector of the ATLAS Experiment for Run-2 at the LHC

    CERN Document Server

    Giordani, MarioPaolo; The ATLAS collaboration

    2016-01-01

    Run-2 of the LHC is providing new challenges to track and vertex reconstruction with higher energies, denser jets and higher rates. Therefore the ATLAS experiment has constructed the first 4-layer Pixel detector in HEP, installing a new Pixel layer, also called Insertable B-Layer (IBL). IBL is a fourth layer of pixel detectors, and has been installed in May 2014 at a radius of 3.3 cm between the existing Pixel Detector and a new smaller radius beam-pipe. The new detector, built to cope with high radiation and expected occupancy, is the first large scale application of 3D detectors and CMOS 130 nm technology. In addition the Pixel detector was refurbished with a new service quarter panel to recover about 3% of defective modules lost during run-1 and a new optical readout system to readout the data at higher speed while reducing the occupancy when running with increased luminosity. The commissioning and performance of the 4-layer Pixel Detector, in particular the IBL, will be presented using collision data.

  12. The Upgraded Pixel Detector of the ATLAS Experiment for Run-2

    CERN Document Server

    Ferrere, Didier; The ATLAS collaboration

    2016-01-01

    Run-2 of the LHC is providing new challenges to track and vertex reconstruction with higher energies, denser jets and higher rates. Therefore the ATLAS experiment has constructed the first 4-layer Pixel detector in HEP, installing a new Pixel layer, also called Insertable B-Layer (IBL). IBL is a fourth layer of pixel detectors, and has been installed in May 2014 at a radius of 3.3 cm between the existing Pixel Detector and a new smaller radius beam-pipe. The new detector, built to cope with high radiation and expected occupancy, is the first large scale application of 3D detectors and CMOS 130nm technology. In addition the Pixel detector was refurbished with a new service quarter panel to recover about 3% of defective modules lost during run-1 and a new optical readout system to readout the data at higher speed while reducing the occupancy when running with increased luminosity. The commissioning and performance of the 4-layer Pixel Detector, in particular the IBL, will be presented, using collision data.

  13. Pixel architectures in a HV-CMOS process for the ATLAS inner detector upgrade

    Science.gov (United States)

    Degerli, Y.; Godiot, S.; Guilloux, F.; Hemperek, T.; Krüger, H.; Lachkar, M.; Liu, J.; Orsini, F.; Pangaud, P.; Rymaszewski, P.; Wang, T.

    2016-12-01

    In this paper, design details and simulation results of new pixel architectures designed in LFoundry 150 nm high voltage CMOS process in the framework of the ATLAS high luminosity inner detector upgrade are presented. These pixels can be connected to the FE-I4 readout chip via bump bonding or glue and some of them can also be tested without a readout chip. Negative high voltage is applied to the high resistivity (> 2 kΩ .cm) substrate in order to deplete the deep n-well charge collection diode, ensuring good charge collection and radiation tolerance. In these pixels, the front-end has been implemented inside the diode using both NMOS and PMOS transistors. The pixel pitch is 50 μm × 250 μm for all pixels. These pixels have been implemented in a demonstrator chip called LFCPIX.

  14. The Layer 1 / Layer 2 readout upgrade for the ATLAS Pixel Detector

    CERN Document Server

    Mullier, Geoffrey; The ATLAS collaboration

    2016-01-01

    The Pixel Detector of the ATLAS experiment has shown excellent performance during the whole Run-1 of the Large Hadron Collider (LHC). The increase of instantaneous luminosity foreseen during the LHC Run 2, will lead to an increased detector occupancy that is expected to saturate the readout links of the outermost layers of the pixel detector: Layers 1 and 2. To ensure a smooth data taking under such conditions, the read out system of the recently installed fourth innermost pixel layer, the Insertable B-Layer, was modified to accomodate the needs of the older detector. The Layer 2 upgrade installation took place during the 2015 winter shutdown, with the Layer 1 installation scheduled for 2016. A report of the successful installation, together with the design of novel dedicated optical to electrical converters and the software and firmware updates will be presented.

  15. A Leakage Current-based Measurement of the Radiation Damage in the ATLAS Pixel Detector

    CERN Document Server

    Gorelov, Igor; The ATLAS collaboration

    2015-01-01

    A measurement has been made of the radiation damage incurred by the ATLAS Pixel Detector barrel silicon modules from the beginning of operations through the end of 2012. This translates to hadronic fluence received over the full period of operation at energies up to and including 8 TeV. The measurement is based on a per-module measurement of the silicon sensor leakage current. The results are presented as a function of integrated luminosity and compared to predictions by the Hamburg Model. This information can be used to predict limits on the lifetime of the Pixel Detector due to current, for various operating scenarios.

  16. Development of 3D-DDTC pixel detectors for the ATLAS upgrade

    Energy Technology Data Exchange (ETDEWEB)

    Dalla Betta, Gian-Franco, E-mail: dallabe@disi.unitn.it [INFN, Sezione di Padova (Gruppo Collegato di Trento), and DISI, Universita di Trento, Via Sommarive 14, 38123 Povo di Trento (Italy); Boscardin, Maurizio [Fondazione Bruno Kessler (FBK-irst), Via Sommarive 18, 38123 Povo di Trento (Italy); Darbo, Giovanni; Gemme, Claudia [INFN, Sezione di Genova, Via Dodecaneso 33, 16146 Genova (Italy); La Rosa, Alessandro; Pernegger, Heinz [CERN-PH, CH-1211 Geneve 23 (Switzerland); Piemonte, Claudio [Fondazione Bruno Kessler (FBK-irst), Via Sommarive 18, 38123 Povo di Trento (Italy); Povoli, Marco [INFN, Sezione di Padova (Gruppo Collegato di Trento), and DISI, Universita di Trento, Via Sommarive 14, 38123 Povo di Trento (Italy); Ronchin, Sabina [Fondazione Bruno Kessler (FBK-irst), Via Sommarive 18, 38123 Povo di Trento (Italy); Zoboli, Andrea [INFN, Sezione di Padova (Gruppo Collegato di Trento), and DISI, Universita di Trento, Via Sommarive 14, 38123 Povo di Trento (Italy); Zorzi, Nicola [Fondazione Bruno Kessler (FBK-irst), Via Sommarive 18, 38123 Povo di Trento (Italy)

    2011-04-21

    We report on the development of n-on-p, 3D Double-Side Double Type Column (3D-DDTC) pixel detectors fabricated at FBK-irst (Trento, Italy) and oriented to the ATLAS upgrade. The considered fabrication technology is simpler than that required for full 3D detectors with active edge, but the detector efficiency and radiation hardness critically depend on the columnar electrode overlap and should be carefully evaluated. The first assemblies of these sensors (featuring 2, 3, or 4 columns per pixel) with the ATLAS FEI3 read-out chip have been tested in laboratory. Selected results from the electrical and functional characterization with radioactive sources are discussed here.

  17. Development of 3D-DDTC pixel detectors for the ATLAS upgrade

    CERN Document Server

    Betta, G -F Dalla; Darbo, G; Gemme, C; La Rosa, A; Pernegger, H; Piemonte, C; Povoli, M; Ronchin, S; Zoboli, A; Zorzi, N

    2011-01-01

    We report on the development of n-on-p, 3D Double-Side Double Type Column (3D-DDTC) pixel detectors fabricated at FBK-irst (Trento, Italy) and oriented to the ATLAS upgrade. The considered fabrication technology is simpler than that required for full 3D detectors with active edge, but the detector efficiency and radiation hardness critically depend on the columnar electrode overlap and should be carefully evaluated. The first assemblies of these sensors (featuring 2, 3, or 4 columns per pixel) with the ATLAS FEI3 read-out chip have been tested in laboratory. Selected results from the electrical and functional characterization with radioactive sources are here discussed.

  18. Spatial and vertex resolution studies on the ATLAS Pixel Detector based on Combined Testbeam 2004 data

    CERN Document Server

    Reisinger, Ingo; Klingenberg, Reiner

    2006-01-01

    This diploma thesis deals with spatial and vertex resolution studies on the ATLAS Pixel detector based on real data taken during the Combined Testbeam period 2004 (17th May - 15th November). For the Combined Testbeam a barrel segment of the ATLAS Detector was build up and tested under real experimental conditions. Several data sets, being recorded during that time, are reconstructed by the ATLAS control framework called ATHENA. The input information for the reconstruction of the particle tracks through the Pixel Detector are the so-called spacepoints. Their uncertainty affects the resolution of the reconstructed particle tracks and thus, also the accuracy of the vertex reconstruction. Since traversing particles deposite their charge mostly (but not compellingly) within more than one pixel, all pixels corresponding to one hit have to be grouped together to a cluster. To compute the spacepoint from the cluster information two different strategies can be performed. The first one is a digital clustering, w...

  19. The ATLAS Pixel Detector for Run II at the Large Hadron Collider

    CERN Document Server

    Marx, Marilyn; The ATLAS collaboration

    2014-01-01

    The Pixel Detector of the ATLAS experiment has shown excellent performance during the whole Run-1 of LHC. Taking advantage of the long showdown, the detector was extracted from the experiment and brought to surface, to equip it with new service quarter panels, to repair modules and to ease installation of the Insertable B-Layer (IBL). IBL is a fourth layer of pixel detectors, and has been installed in May 2014 between the existing Pixel Detector and a new smaller radius beam-pipe at a radius of 3.3 cm. To cope with the high radiation and pixel occupancy due to the proximity to the interaction point, a new read-out chip and two different silicon sensor technologies (planar and 3D) have been developed. Furthermore, the physics performance will be improved through the reduction of pixel size while, targeting for a low material budget, a new mechanical support using lightweight staves and a CO2 based cooling system have been adopted. An overview of the refurbishing of the Pixel Detector and of the IBL project as ...

  20. The upgraded Pixel Detector of the ATLAS Experiment for Run2 at the Large Hadron Collider

    CERN Document Server

    Backhaus, Malte; The ATLAS collaboration

    2015-01-01

    Run-2 of the LHC will provide new challenges to track and vertex reconstruction with higher energies, denser jets and higher rates. Therefore the ATLAS experiment has constructed the first 4-layer Pixel detector in HEP, installing a new Pixel layer, also called Insertable B-Layer (IBL). IBL is a fourth layer of pixel detectors, and has been installed in May 2014 at a radius of 3.3 cm between the existing Pixel Detector and a new smaller radius beam-pipe. To cope with the high radiation and pixel occupancy due to the proximity to the interaction point, two different silicon sensor technologies (planar and 3D) have been developed as well as a new read-out chip within CMOS 130nm technology and with larger area, smaller pixel size and faster readout capability. The new detector is the first large scale application of of 3D detectors and CMOS 130nm technology. An overview of the lessons learned during the IBL project will be presented, focusing on the challenges and highlighting the issues met during the productio...

  1. The Pixel Detector of the ATLAS experiment for the Run2 at the Large Hadron Collider

    CERN Document Server

    INSPIRE-00237659

    2015-01-01

    The Pixel Detector of the ATLAS experiment has shown excellent performance during the whole Run-1 of LHC. Taking advantage of the long showdown, the detector was extracted from the experiment and brought to surface, to equip it with new service quarter panels, to repair modules and to ease installation of the Insertable B-Layer (IBL). IBL is a fourth layer of pixel detectors, and has been installed in May 2014 between the existing Pixel Detector and a new smaller radius beam-pipe at a radius of 3.3 cm. To cope with the high radiation and pixel occupancy due to the proximity to the interaction point, a new read-out chip and two different silicon sensor technologies (planar and 3D) have been developed. Furthermore, the physics performance will be improved through the reduction of pixel size while, targeting for a low material budget, a new mechanical support using lightweight staves and a CO2 based cooling system have been adopted. An overview of the refurbishing of the Pixel Detect or and of the IBL project as...

  2. A neural network clustering algorithm for the ATLAS silicon pixel detector

    CERN Document Server

    Aad, Georges; Abdallah, Jalal; Abdel Khalek, Samah; Abdinov, Ovsat; Aben, Rosemarie; Abi, Babak; Abolins, Maris; AbouZeid, Ossama; Abramowicz, Halina; Abreu, Henso; Abreu, Ricardo; Abulaiti, Yiming; Acharya, Bobby Samir; Adamczyk, Leszek; Adams, David; Adelman, Jahred; Adomeit, Stefanie; Adye, Tim; Agatonovic-Jovin, Tatjana; Aguilar-Saavedra, Juan Antonio; Agustoni, Marco; Ahlen, Steven; Ahmadov, Faig; Aielli, Giulio; Akerstedt, Henrik; Åkesson, Torsten Paul Ake; Akimoto, Ginga; Akimov, Andrei; Alberghi, Gian Luigi; Albert, Justin; Albrand, Solveig; Alconada Verzini, Maria Josefina; Aleksa, Martin; Aleksandrov, Igor; Alexa, Calin; Alexander, Gideon; Alexandre, Gauthier; Alexopoulos, Theodoros; Alhroob, Muhammad; Alimonti, Gianluca; Alio, Lion; Alison, John; Allbrooke, Benedict; Allison, Lee John; Allport, Phillip; Almond, John; Aloisio, Alberto; Alonso, Alejandro; Alonso, Francisco; Alpigiani, Cristiano; Altheimer, Andrew David; Alvarez Gonzalez, Barbara; Alviggi, Mariagrazia; Amako, Katsuya; Amaral Coutinho, Yara; Amelung, Christoph; Amidei, Dante; Amor Dos Santos, Susana Patricia; Amorim, Antonio; Amoroso, Simone; Amram, Nir; Amundsen, Glenn; Anastopoulos, Christos; Ancu, Lucian Stefan; Andari, Nansi; Andeen, Timothy; Anders, Christoph Falk; Anders, Gabriel; Anderson, Kelby; Andreazza, Attilio; Andrei, George Victor; Anduaga, Xabier; Angelidakis, Stylianos; Angelozzi, Ivan; Anger, Philipp; Angerami, Aaron; Anghinolfi, Francis; Anisenkov, Alexey; Anjos, Nuno; Annovi, Alberto; Antonaki, Ariadni; Antonelli, Mario; Antonov, Alexey; Antos, Jaroslav; Anulli, Fabio; Aoki, Masato; Aperio Bella, Ludovica; Apolle, Rudi; Arabidze, Giorgi; Aracena, Ignacio; Arai, Yasuo; Araque, Juan Pedro; Arce, Ayana; Arguin, Jean-Francois; Argyropoulos, Spyridon; Arik, Metin; Armbruster, Aaron James; Arnaez, Olivier; Arnal, Vanessa; Arnold, Hannah; Arratia, Miguel; Arslan, Ozan; Artamonov, Andrei; Artoni, Giacomo; Asai, Shoji; Asbah, Nedaa; Ashkenazi, Adi; Åsman, Barbro; Asquith, Lily; Assamagan, Ketevi; Astalos, Robert; Atkinson, Markus; Atlay, Naim Bora; Auerbach, Benjamin; Augsten, Kamil; Aurousseau, Mathieu; Avolio, Giuseppe; Azuelos, Georges; Azuma, Yuya; Baak, Max; Baas, Alessandra; Bacci, Cesare; Bachacou, Henri; Bachas, Konstantinos; Backes, Moritz; Backhaus, Malte; Backus Mayes, John; Badescu, Elisabeta; Bagiacchi, Paolo; Bagnaia, Paolo; Bai, Yu; Bain, Travis; Baines, John; Baker, Oliver Keith; Balek, Petr; Balli, Fabrice; Banas, Elzbieta; Banerjee, Swagato; Bannoura, Arwa A E; Bansal, Vikas; Bansil, Hardeep Singh; Barak, Liron; Baranov, Sergei; Barberio, Elisabetta Luigia; Barberis, Dario; Barbero, Marlon; Barillari, Teresa; Barisonzi, Marcello; Barklow, Timothy; Barlow, Nick; Barnett, Bruce; Barnett, Michael; Barnovska, Zuzana; Baroncelli, Antonio; Barone, Gaetano; Barr, Alan; Barreiro, Fernando; Barreiro Guimarães da Costa, João; Bartoldus, Rainer; Barton, Adam Edward; Bartos, Pavol; Bartsch, Valeria; Bassalat, Ahmed; Basye, Austin; Bates, Richard; Batkova, Lucia; Batley, Richard; Battaglia, Marco; Battistin, Michele; Bauer, Florian; Bawa, Harinder Singh; Beau, Tristan; Beauchemin, Pierre-Hugues; Beccherle, Roberto; Bechtle, Philip; Beck, Hans Peter; Becker, Anne Kathrin; Becker, Sebastian; Beckingham, Matthew; Becot, Cyril; Beddall, Andrew; Beddall, Ayda; Bedikian, Sourpouhi; Bednyakov, Vadim; Bee, Christopher; Beemster, Lars; Beermann, Thomas; Begel, Michael; Behr, Katharina; Belanger-Champagne, Camille; Bell, Paul; Bell, William; Bella, Gideon; Bellagamba, Lorenzo; Bellerive, Alain; Bellomo, Massimiliano; Belotskiy, Konstantin; Beltramello, Olga; Benary, Odette; Benchekroun, Driss; Bendtz, Katarina; Benekos, Nektarios; Benhammou, Yan; Benhar Noccioli, Eleonora; Benitez Garcia, Jorge-Armando; Benjamin, Douglas; Bensinger, James; Benslama, Kamal; Bentvelsen, Stan; Berge, David; Bergeaas Kuutmann, Elin; Berger, Nicolas; Berghaus, Frank; Beringer, Jürg; Bernard, Clare; Bernat, Pauline; Bernius, Catrin; Bernlochner, Florian Urs; Berry, Tracey; Berta, Peter; Bertella, Claudia; Bertoli, Gabriele; Bertolucci, Federico; Bertsche, David; Besana, Maria Ilaria; Besjes, Geert-Jan; Bessidskaia, Olga; Bessner, Martin Florian; Besson, Nathalie; Betancourt, Christopher; Bethke, Siegfried; Bhimji, Wahid; Bianchi, Riccardo-Maria; Bianchini, Louis; Bianco, Michele; Biebel, Otmar; Bieniek, Stephen Paul; Bierwagen, Katharina; Biesiada, Jed; Biglietti, Michela; Bilbao De Mendizabal, Javier; Bilokon, Halina; Bindi, Marcello; Binet, Sebastien; Bingul, Ahmet; Bini, Cesare; Black, Curtis; Black, James; Black, Kevin; Blackburn, Daniel; Blair, Robert; Blanchard, Jean-Baptiste; Blazek, Tomas; Bloch, Ingo; Blocker, Craig; Blum, Walter; Blumenschein, Ulrike; Bobbink, Gerjan; Bobrovnikov, Victor; Bocchetta, Simona Serena; Bocci, Andrea; Bock, Christopher; Boddy, Christopher Richard; Boehler, Michael; Boek, Thorsten Tobias; Bogaerts, Joannes Andreas; Bogdanchikov, Alexander; Bogouch, Andrei; Bohm, Christian; Bohm, Jan; Boisvert, Veronique; Bold, Tomasz; Boldea, Venera; Boldyrev, Alexey; Bomben, Marco; Bona, Marcella; Boonekamp, Maarten; Borisov, Anatoly; Borissov, Guennadi; Borri, Marcello; Borroni, Sara; Bortfeldt, Jonathan; Bortolotto, Valerio; Bos, Kors; Boscherini, Davide; Bosman, Martine; Boterenbrood, Hendrik; Boudreau, Joseph; Bouffard, Julian; Bouhova-Thacker, Evelina Vassileva; Boumediene, Djamel Eddine; Bourdarios, Claire; Bousson, Nicolas; Boutouil, Sara; Boveia, Antonio; Boyd, James; Boyko, Igor; Bracinik, Juraj; Brandt, Andrew; Brandt, Gerhard; Brandt, Oleg; Bratzler, Uwe; Brau, Benjamin; Brau, James; Braun, Helmut; Brazzale, Simone Federico; Brelier, Bertrand; Brendlinger, Kurt; Brennan, Amelia Jean; Brenner, Richard; Bressler, Shikma; Bristow, Kieran; Bristow, Timothy Michael; Britton, Dave; Brochu, Frederic; Brock, Ian; Brock, Raymond; Bromberg, Carl; Bronner, Johanna; Brooijmans, Gustaaf; Brooks, Timothy; Brooks, William; Brosamer, Jacquelyn; Brost, Elizabeth; Brown, Jonathan; Bruckman de Renstrom, Pawel; Bruncko, Dusan; Bruneliere, Renaud; Brunet, Sylvie; Bruni, Alessia; Bruni, Graziano; Bruschi, Marco; Bryngemark, Lene; Buanes, Trygve; Buat, Quentin; Bucci, Francesca; Buchholz, Peter; Buckingham, Ryan; Buckley, Andrew; Buda, Stelian Ioan; Budagov, Ioulian; Buehrer, Felix; Bugge, Lars; Bugge, Magnar Kopangen; Bulekov, Oleg; Bundock, Aaron Colin; Burckhart, Helfried; Burdin, Sergey; Burghgrave, Blake; Burke, Stephen; Burmeister, Ingo; Busato, Emmanuel; Büscher, Daniel; Büscher, Volker; Bussey, Peter; Buszello, Claus-Peter; Butler, Bart; Butler, John; Butt, Aatif Imtiaz; Buttar, Craig; Butterworth, Jonathan; Butti, Pierfrancesco; Buttinger, William; Buzatu, Adrian; Byszewski, Marcin; Cabrera Urbán, Susana; Caforio, Davide; Cakir, Orhan; Calafiura, Paolo; Calandri, Alessandro; Calderini, Giovanni; Calfayan, Philippe; Calkins, Robert; Caloba, Luiz; Calvet, David; Calvet, Samuel; Camacho Toro, Reina; Camarda, Stefano; Cameron, David; Caminada, Lea Michaela; Caminal Armadans, Roger; Campana, Simone; Campanelli, Mario; Campoverde, Angel; Canale, Vincenzo; Canepa, Anadi; Cano Bret, Marc; Cantero, Josu; Cantrill, Robert; Cao, Tingting; Capeans Garrido, Maria Del Mar; Caprini, Irinel; Caprini, Mihai; Capua, Marcella; Caputo, Regina; Cardarelli, Roberto; Carli, Tancredi; Carlino, Gianpaolo; Carminati, Leonardo; Caron, Sascha; Carquin, Edson; Carrillo-Montoya, German D; Carter, Janet; Carvalho, João; Casadei, Diego; Casado, Maria Pilar; Casolino, Mirkoantonio; Castaneda-Miranda, Elizabeth; Castelli, Angelantonio; Castillo Gimenez, Victoria; Castro, Nuno Filipe; Catastini, Pierluigi; Catinaccio, Andrea; Catmore, James; Cattai, Ariella; Cattani, Giordano; Caughron, Seth; Cavaliere, Viviana; Cavalli, Donatella; Cavalli-Sforza, Matteo; Cavasinni, Vincenzo; Ceradini, Filippo; Cerio, Benjamin; Cerny, Karel; Cerqueira, Augusto Santiago; Cerri, Alessandro; Cerrito, Lucio; Cerutti, Fabio; Cerv, Matevz; Cervelli, Alberto; Cetin, Serkant Ali; Chafaq, Aziz; Chakraborty, Dhiman; Chalupkova, Ina; Chang, Philip; Chapleau, Bertrand; Chapman, John Derek; Charfeddine, Driss; Charlton, Dave; Chau, Chav Chhiv; Chavez Barajas, Carlos Alberto; Cheatham, Susan; Chegwidden, Andrew; Chekanov, Sergei; Chekulaev, Sergey; Chelkov, Gueorgui; Chelstowska, Magda Anna; Chen, Chunhui; Chen, Hucheng; Chen, Karen; Chen, Liming; Chen, Shenjian; Chen, Xin; Chen, Yujiao; Cheng, Hok Chuen; Cheng, Yangyang; Cheplakov, Alexander; Cherkaoui El Moursli, Rajaa; Chernyatin, Valeriy; Cheu, Elliott; Chevalier, Laurent; Chiarella, Vitaliano; Chiefari, Giovanni; Childers, John Taylor; Chilingarov, Alexandre; Chiodini, Gabriele; Chisholm, Andrew; Chislett, Rebecca Thalatta; Chitan, Adrian; Chizhov, Mihail; Chouridou, Sofia; Chow, Bonnie Kar Bo; Chromek-Burckhart, Doris; Chu, Ming-Lee; Chudoba, Jiri; Chwastowski, Janusz; Chytka, Ladislav; Ciapetti, Guido; Ciftci, Abbas Kenan; Ciftci, Rena; Cinca, Diane; Cindro, Vladimir; Ciocio, Alessandra; Cirkovic, Predrag; Citron, Zvi Hirsh; Citterio, Mauro; Ciubancan, Mihai; Clark, Allan G; Clark, Philip James; Clarke, Robert; Cleland, Bill; Clemens, Jean-Claude; Clement, Christophe; Coadou, Yann; Cobal, Marina; Coccaro, Andrea; Cochran, James H; Coffey, Laurel; Cogan, Joshua Godfrey; Coggeshall, James; Cole, Brian; Cole, Stephen; Colijn, Auke-Pieter; Collot, Johann; Colombo, Tommaso; Colon, German; Compostella, Gabriele; Conde Muiño, Patricia; Coniavitis, Elias; Conidi, Maria Chiara; Connell, Simon Henry; Connelly, Ian; Consonni, Sofia Maria; Consorti, Valerio; Constantinescu, Serban; Conta, Claudio; Conti, Geraldine; Conventi, Francesco; Cooke, Mark; Cooper, Ben; Cooper-Sarkar, Amanda; Cooper-Smith, Neil; Copic, Katherine; Cornelissen, Thijs; Corradi, Massimo; Corriveau, Francois; Corso-Radu, Alina; Cortes-Gonzalez, Arely; Cortiana, Giorgio; Costa, Giuseppe; Costa, María José; Costanzo, Davide; Côté, David; Cottin, Giovanna; Cowan, Glen; Cox, Brian; Cranmer, Kyle; Cree, Graham; Crépé-Renaudin, Sabine; Crescioli, Francesco; Cribbs, Wayne Allen; Crispin Ortuzar, Mireia; Cristinziani, Markus; Croft, Vince; Crosetti, Giovanni; Cuciuc, Constantin-Mihai; Cuhadar Donszelmann, Tulay; Cummings, Jane; Curatolo, Maria; Cuthbert, Cameron; Czirr, Hendrik; Czodrowski, Patrick; Czyczula, Zofia; D'Auria, Saverio; D'Onofrio, Monica; Da Cunha Sargedas De Sousa, Mario Jose; Da Via, Cinzia; Dabrowski, Wladyslaw; Dafinca, Alexandru; Dai, Tiesheng; Dale, Orjan; Dallaire, Frederick; Dallapiccola, Carlo; Dam, Mogens; Daniells, Andrew Christopher; Dano Hoffmann, Maria; Dao, Valerio; Darbo, Giovanni; Darmora, Smita; Dassoulas, James; Dattagupta, Aparajita; Davey, Will; David, Claire; Davidek, Tomas; Davies, Eleanor; Davies, Merlin; Davignon, Olivier; Davison, Adam; Davison, Peter; Davygora, Yuriy; Dawe, Edmund; Dawson, Ian; Daya-Ishmukhametova, Rozmin; De, Kaushik; de Asmundis, Riccardo; De Castro, Stefano; De Cecco, Sandro; De Groot, Nicolo; de Jong, Paul; De la Torre, Hector; De Lorenzi, Francesco; De Nooij, Lucie; De Pedis, Daniele; De Salvo, Alessandro; De Sanctis, Umberto; De Santo, Antonella; De Vivie De Regie, Jean-Baptiste; Dearnaley, William James; Debbe, Ramiro; Debenedetti, Chiara; Dechenaux, Benjamin; Dedovich, Dmitri; Deigaard, Ingrid; Del Peso, Jose; Del Prete, Tarcisio; Deliot, Frederic; Delitzsch, Chris Malena; Deliyergiyev, Maksym; Dell'Acqua, Andrea; Dell'Asta, Lidia; Dell'Orso, Mauro; Della Pietra, Massimo; della Volpe, Domenico; Delmastro, Marco; Delsart, Pierre-Antoine; Deluca, Carolina; Demers, Sarah; Demichev, Mikhail; Demilly, Aurelien; Denisov, Sergey; Derendarz, Dominik; Derkaoui, Jamal Eddine; Derue, Frederic; Dervan, Paul; Desch, Klaus Kurt; Deterre, Cecile; Deviveiros, Pier-Olivier; Dewhurst, Alastair; Dhaliwal, Saminder; Di Ciaccio, Anna; Di Ciaccio, Lucia; Di Domenico, Antonio; Di Donato, Camilla; Di Girolamo, Alessandro; Di Girolamo, Beniamino; Di Mattia, Alessandro; Di Micco, Biagio; Di Nardo, Roberto; Di Simone, Andrea; Di Sipio, Riccardo; Di Valentino, David; Dias, Flavia; Diaz, Marco Aurelio; Diehl, Edward; Dietrich, Janet; Dietzsch, Thorsten; Diglio, Sara; Dimitrievska, Aleksandra; Dingfelder, Jochen; Dionisi, Carlo; Dita, Petre; Dita, Sanda; Dittus, Fridolin; Djama, Fares; Djobava, Tamar; do Vale, Maria Aline Barros; Do Valle Wemans, André; Doan, Thi Kieu Oanh; Dobos, Daniel; Doglioni, Caterina; Doherty, Tom; Dohmae, Takeshi; Dolejsi, Jiri; Dolezal, Zdenek; Dolgoshein, Boris; Donadelli, Marisilvia; Donati, Simone; Dondero, Paolo; Donini, Julien; Dopke, Jens; Doria, Alessandra; Dova, Maria-Teresa; Doyle, Tony; Dris, Manolis; Dubbert, Jörg; Dube, Sourabh; Dubreuil, Emmanuelle; Duchovni, Ehud; Duckeck, Guenter; Ducu, Otilia Anamaria; Duda, Dominik; Dudarev, Alexey; Dudziak, Fanny; Duflot, Laurent; Duguid, Liam; Dührssen, Michael; Dunford, Monica; Duran Yildiz, Hatice; Düren, Michael; Durglishvili, Archil; Dwuznik, Michal; Dyndal, Mateusz; Ebke, Johannes; Edson, William; Edwards, Nicholas Charles; Ehrenfeld, Wolfgang; Eifert, Till; Eigen, Gerald; Einsweiler, Kevin; Ekelof, Tord; El Kacimi, Mohamed; Ellert, Mattias; Elles, Sabine; Ellinghaus, Frank; Ellis, Nicolas; Elmsheuser, Johannes; Elsing, Markus; Emeliyanov, Dmitry; Enari, Yuji; Endner, Oliver Chris; Endo, Masaki; Engelmann, Roderich; Erdmann, Johannes; Ereditato, Antonio; Eriksson, Daniel; Ernis, Gunar; Ernst, Jesse; Ernst, Michael; Ernwein, Jean; Errede, Deborah; Errede, Steven; Ertel, Eugen; Escalier, Marc; Esch, Hendrik; Escobar, Carlos; Esposito, Bellisario; Etienvre, Anne-Isabelle; Etzion, Erez; Evans, Hal; Ezhilov, Alexey; Fabbri, Laura; Facini, Gabriel; Fakhrutdinov, Rinat; Falciano, Speranza; Falla, Rebecca Jane; Faltova, Jana; Fang, Yaquan; Fanti, Marcello; Farbin, Amir; Farilla, Addolorata; Farooque, Trisha; Farrell, Steven; Farrington, Sinead; Farthouat, Philippe; Fassi, Farida; Fassnacht, Patrick; Fassouliotis, Dimitrios; Favareto, Andrea; Fayard, Louis; Federic, Pavol; Fedin, Oleg; Fedorko, Wojciech; Fehling-Kaschek, Mirjam; Feigl, Simon; Feligioni, Lorenzo; Feng, Cunfeng; Feng, Eric; Feng, Haolu; Fenyuk, Alexander; Fernandez Perez, Sonia; Ferrag, Samir; Ferrando, James; Ferrari, Arnaud; Ferrari, Pamela; Ferrari, Roberto; Ferreira de Lima, Danilo Enoque; Ferrer, Antonio; Ferrere, Didier; Ferretti, Claudio; Ferretto Parodi, Andrea; Fiascaris, Maria; Fiedler, Frank; Filipčič, Andrej; Filipuzzi, Marco; Filthaut, Frank; Fincke-Keeler, Margret; Finelli, Kevin Daniel; Fiolhais, Miguel; Fiorini, Luca; Firan, Ana; Fischer, Adam; Fischer, Julia; Fisher, Wade Cameron; Fitzgerald, Eric Andrew; Flechl, Martin; Fleck, Ivor; Fleischmann, Philipp; Fleischmann, Sebastian; Fletcher, Gareth Thomas; Fletcher, Gregory; Flick, Tobias; Floderus, Anders; Flores Castillo, Luis; Florez Bustos, Andres Carlos; Flowerdew, Michael; Formica, Andrea; Forti, Alessandra; Fortin, Dominique; Fournier, Daniel; Fox, Harald; Fracchia, Silvia; Francavilla, Paolo; Franchini, Matteo; Franchino, Silvia; Francis, David; Franklin, Melissa; Franz, Sebastien; Fraternali, Marco; French, Sky; Friedrich, Conrad; Friedrich, Felix; Froidevaux, Daniel; Frost, James; Fukunaga, Chikara; Fullana Torregrosa, Esteban; Fulsom, Bryan Gregory; Fuster, Juan; Gabaldon, Carolina; Gabizon, Ofir; Gabrielli, Alessandro; Gabrielli, Andrea; Gadatsch, Stefan; Gadomski, Szymon; Gagliardi, Guido; Gagnon, Pauline; Galea, Cristina; Galhardo, Bruno; Gallas, Elizabeth; Gallo, Valentina Santina; Gallop, Bruce; Gallus, Petr; Galster, Gorm Aske Gram Krohn; Gan, KK; Gandrajula, Reddy Pratap; Gao, Jun; Gao, Yongsheng; Garay Walls, Francisca; Garberson, Ford; García, Carmen; García Navarro, José Enrique; Garcia-Sciveres, Maurice; Gardner, Robert; Garelli, Nicoletta; Garonne, Vincent; Gatti, Claudio; Gaudio, Gabriella; Gaur, Bakul; Gauthier, Lea; Gauzzi, Paolo; Gavrilenko, Igor; Gay, Colin; Gaycken, Goetz; Gazis, Evangelos; Ge, Peng; Gecse, Zoltan; Gee, Norman; Geerts, Daniël Alphonsus Adrianus; Geich-Gimbel, Christoph; Gellerstedt, Karl; Gemme, Claudia; Gemmell, Alistair; Genest, Marie-Hélène; Gentile, Simonetta; George, Matthias; George, Simon; Gerbaudo, Davide; Gershon, Avi; Ghazlane, Hamid; Ghodbane, Nabil; Giacobbe, Benedetto; Giagu, Stefano; Giangiobbe, Vincent; Giannetti, Paola; Gianotti, Fabiola; Gibbard, Bruce; Gibson, Stephen; Gilchriese, Murdock; Gillam, Thomas; Gillberg, Dag; Gilles, Geoffrey; Gingrich, Douglas; Giokaris, Nikos; Giordani, MarioPaolo; Giordano, Raffaele; Giorgi, Filippo Maria; Giorgi, Francesco Michelangelo; Giraud, Pierre-Francois; Giugni, Danilo; Giuliani, Claudia; Giulini, Maddalena; Gjelsten, Børge Kile; Gkaitatzis, Stamatios; Gkialas, Ioannis; Gladilin, Leonid; Glasman, Claudia; Glatzer, Julian; Glaysher, Paul; Glazov, Alexandre; Glonti, George; Goblirsch-Kolb, Maximilian; Goddard, Jack Robert; Godfrey, Jennifer; Godlewski, Jan; Goeringer, Christian; Goldfarb, Steven; Golling, Tobias; Golubkov, Dmitry; Gomes, Agostinho; Gomez Fajardo, Luz Stella; Gonçalo, Ricardo; Goncalves Pinto Firmino Da Costa, Joao; Gonella, Laura; González de la Hoz, Santiago; Gonzalez Parra, Garoe; Gonzalez-Sevilla, Sergio; Goossens, Luc; Gorbounov, Petr Andreevich; Gordon, Howard; Gorelov, Igor; Gorini, Benedetto; Gorini, Edoardo; Gorišek, Andrej; Gornicki, Edward; Goshaw, Alfred; Gössling, Claus; Gostkin, Mikhail Ivanovitch; Gouighri, Mohamed; Goujdami, Driss; Goulette, Marc Phillippe; Goussiou, Anna; Goy, Corinne; Gozpinar, Serdar; Grabas, Herve Marie Xavier; Graber, Lars; Grabowska-Bold, Iwona; Grafström, Per; Grahn, Karl-Johan; Gramling, Johanna; Gramstad, Eirik; Grancagnolo, Sergio; Grassi, Valerio; Gratchev, Vadim; Gray, Heather; Graziani, Enrico; Grebenyuk, Oleg; Greenwood, Zeno Dixon; Gregersen, Kristian; Gregor, Ingrid-Maria; Grenier, Philippe; Griffiths, Justin; Grillo, Alexander; Grimm, Kathryn; Grinstein, Sebastian; Gris, Philippe Luc Yves; Grishkevich, Yaroslav; Grivaz, Jean-Francois; Grohs, Johannes Philipp; Grohsjean, Alexander; Gross, Eilam; Grosse-Knetter, Joern; Grossi, Giulio Cornelio; Groth-Jensen, Jacob; Grout, Zara Jane; Guan, Liang; Guescini, Francesco; Guest, Daniel; Gueta, Orel; Guicheney, Christophe; Guido, Elisa; Guillemin, Thibault; Guindon, Stefan; Gul, Umar; Gumpert, Christian; Gunther, Jaroslav; Guo, Jun; Gupta, Shaun; Gutierrez, Phillip; Gutierrez Ortiz, Nicolas Gilberto; Gutschow, Christian; Guttman, Nir; Guyot, Claude; Gwenlan, Claire; Gwilliam, Carl; Haas, Andy; Haber, Carl; Hadavand, Haleh Khani; Haddad, Nacim; Haefner, Petra; Hageböck, Stephan; Hajduk, Zbigniew; Hakobyan, Hrachya; Haleem, Mahsana; Hall, David; Halladjian, Garabed; Hamacher, Klaus; Hamal, Petr; Hamano, Kenji; Hamer, Matthias; Hamilton, Andrew; Hamilton, Samuel; Hamnett, Phillip George; Han, Liang; Hanagaki, Kazunori; Hanawa, Keita; Hance, Michael; Hanke, Paul; Hanna, Remie; Hansen, Jørgen Beck; Hansen, Jorn Dines; Hansen, Peter Henrik; Hara, Kazuhiko; Hard, Andrew; Harenberg, Torsten; Hariri, Faten; Harkusha, Siarhei; Harper, Devin; Harrington, Robert; Harris, Orin; Harrison, Paul Fraser; Hartjes, Fred; Hasegawa, Satoshi; Hasegawa, Yoji; Hasib, A; Hassani, Samira; Haug, Sigve; Hauschild, Michael; Hauser, Reiner; Havranek, Miroslav; Hawkes, Christopher; Hawkings, Richard John; Hawkins, Anthony David; Hayashi, Takayasu; Hayden, Daniel; Hays, Chris; Hayward, Helen; Haywood, Stephen; Head, Simon; Heck, Tobias; Hedberg, Vincent; Heelan, Louise; Heim, Sarah; Heim, Timon; Heinemann, Beate; Heinrich, Lukas; Hejbal, Jiri; Helary, Louis; Heller, Claudio; Heller, Matthieu; Hellman, Sten; Hellmich, Dennis; Helsens, Clement; Henderson, James; Henderson, Robert; Heng, Yang; Hengler, Christopher; Henrichs, Anna; Henriques Correia, Ana Maria; Henrot-Versille, Sophie; Hensel, Carsten; Herbert, Geoffrey Henry; Hernández Jiménez, Yesenia; Herrberg-Schubert, Ruth; Herten, Gregor; Hertenberger, Ralf; Hervas, Luis; Hesketh, Gavin Grant; Hessey, Nigel; Hickling, Robert; Higón-Rodriguez, Emilio; Hill, Ewan; Hill, John; Hiller, Karl Heinz; Hillert, Sonja; Hillier, Stephen; Hinchliffe, Ian; Hines, Elizabeth; Hirose, Minoru; Hirschbuehl, Dominic; Hobbs, John; Hod, Noam; Hodgkinson, Mark; Hodgson, Paul; Hoecker, Andreas; Hoeferkamp, Martin; Hoffman, Julia; Hoffmann, Dirk; Hofmann, Julia Isabell; Hohlfeld, Marc; Holmes, Tova Ray; Hong, Tae Min; Hooft van Huysduynen, Loek; Hostachy, Jean-Yves; Hou, Suen; Hoummada, Abdeslam; Howard, Jacob; Howarth, James; Hrabovsky, Miroslav; Hristova, Ivana; Hrivnac, Julius; Hryn'ova, Tetiana; Hsu, Catherine; Hsu, Pai-hsien Jennifer; Hsu, Shih-Chieh; Hu, Diedi; Hu, Xueye; Huang, Yanping; Hubacek, Zdenek; Hubaut, Fabrice; Huegging, Fabian; Huffman, Todd Brian; Hughes, Emlyn; Hughes, Gareth; Huhtinen, Mika; Hülsing, Tobias Alexander; Hurwitz, Martina; Huseynov, Nazim; Huston, Joey; Huth, John; Iacobucci, Giuseppe; Iakovidis, Georgios; Ibragimov, Iskander; Iconomidou-Fayard, Lydia; Ideal, Emma; Iengo, Paolo; Igonkina, Olga; Iizawa, Tomoya; Ikegami, Yoichi; Ikematsu, Katsumasa; Ikeno, Masahiro; Ilchenko, Iurii; Iliadis, Dimitrios; Ilic, Nikolina; Inamaru, Yuki; Ince, Tayfun; Ioannou, Pavlos; Iodice, Mauro; Iordanidou, Kalliopi; Ippolito, Valerio; Irles Quiles, Adrian; Isaksson, Charlie; Ishino, Masaya; Ishitsuka, Masaki; Ishmukhametov, Renat; Issever, Cigdem; Istin, Serhat; Iturbe Ponce, Julia Mariana; Iuppa, Roberto; Ivarsson, Jenny; Iwanski, Wieslaw; Iwasaki, Hiroyuki; Izen, Joseph; Izzo, Vincenzo; Jackson, Brett; Jackson, Matthew; Jackson, Paul; Jaekel, Martin; Jain, Vivek; Jakobs, Karl; Jakobsen, Sune; Jakoubek, Tomas; Jakubek, Jan; Jamin, David Olivier; Jana, Dilip; Jansen, Eric; Jansen, Hendrik; Janssen, Jens; Janus, Michel; Jarlskog, Göran; Javadov, Namig; Javůrek, Tomáš; Jeanty, Laura; Jejelava, Juansher; Jeng, Geng-yuan; Jennens, David; Jenni, Peter; Jentzsch, Jennifer; Jeske, Carl; Jézéquel, Stéphane; Ji, Haoshuang; Ji, Weina; Jia, Jiangyong; Jiang, Yi; Jimenez Belenguer, Marcos; Jin, Shan; Jinaru, Adam; Jinnouchi, Osamu; Joergensen, Morten Dam; Johansson, Erik; Johansson, Per; Johns, Kenneth; Jon-And, Kerstin; Jones, Graham; Jones, Roger; Jones, Tim; Jongmanns, Jan; Jorge, Pedro; Joshi, Kiran Daniel; Jovicevic, Jelena; Ju, Xiangyang; Jung, Christian; Jungst, Ralph Markus; Jussel, Patrick; Juste Rozas, Aurelio; Kaci, Mohammed; Kaczmarska, Anna; Kado, Marumi; Kagan, Harris; Kagan, Michael; Kajomovitz, Enrique; Kalderon, Charles William; Kama, Sami; Kamenshchikov, Andrey; Kanaya, Naoko; Kaneda, Michiru; Kaneti, Steven; Kantserov, Vadim; Kanzaki, Junichi; Kaplan, Benjamin; Kapliy, Anton; Kar, Deepak; Karakostas, Konstantinos; Karastathis, Nikolaos; Karnevskiy, Mikhail; Karpov, Sergey; Karpova, Zoya; Karthik, Krishnaiyengar; Kartvelishvili, Vakhtang; Karyukhin, Andrey; Kashif, Lashkar; Kasieczka, Gregor; Kass, Richard; Kastanas, Alex; Kataoka, Yousuke; Katre, Akshay; Katzy, Judith; Kaushik, Venkatesh; Kawagoe, Kiyotomo; Kawamoto, Tatsuo; Kawamura, Gen; Kazama, Shingo; Kazanin, Vassili; Kazarinov, Makhail; Keeler, Richard; Kehoe, Robert; Keil, Markus; Keller, John; Kempster, Jacob Julian; Keoshkerian, Houry; Kepka, Oldrich; Kerševan, Borut Paul; Kersten, Susanne; Kessoku, Kohei; Keung, Justin; Khalil-zada, Farkhad; Khandanyan, Hovhannes; Khanov, Alexander; Khodinov, Alexander; Khomich, Andrei; Khoo, Teng Jian; Khoriauli, Gia; Khoroshilov, Andrey; Khovanskiy, Valery; Khramov, Evgeniy; Khubua, Jemal; Kim, Hee Yeun; Kim, Hyeon Jin; Kim, Shinhong; Kimura, Naoki; Kind, Oliver; King, Barry; King, Matthew; King, Robert Steven Beaufoy; King, Samuel Burton; Kirk, Julie; Kiryunin, Andrey; Kishimoto, Tomoe; Kisielewska, Danuta; Kiss, Florian; Kittelmann, Thomas; Kiuchi, Kenji; Kladiva, Eduard; Klein, Max; Klein, Uta; Kleinknecht, Konrad; Klimek, Pawel; Klimentov, Alexei; Klingenberg, Reiner; Klinger, Joel Alexander; Klioutchnikova, Tatiana; Klok, Peter; Kluge, Eike-Erik; Kluit, Peter; Kluth, Stefan; Kneringer, Emmerich; Knoops, Edith; Knue, Andrea; Kobayashi, Dai; Kobayashi, Tomio; Kobel, Michael; Kocian, Martin; Kodys, Peter; Koevesarki, Peter; Koffas, Thomas; Koffeman, Els; Kogan, Lucy Anne; Kohlmann, Simon; Kohout, Zdenek; Kohriki, Takashi; Koi, Tatsumi; Kolanoski, Hermann; Koletsou, Iro; Koll, James; Komar, Aston; Komori, Yuto; Kondo, Takahiko; Kondrashova, Nataliia; Köneke, Karsten; König, Adriaan; König, Sebastian; Kono, Takanori; Konoplich, Rostislav; Konstantinidis, Nikolaos; Kopeliansky, Revital; Koperny, Stefan; Köpke, Lutz; Kopp, Anna Katharina; Korcyl, Krzysztof; Kordas, Kostantinos; Korn, Andreas; Korol, Aleksandr; Korolkov, Ilya; Korolkova, Elena; Korotkov, Vladislav; Kortner, Oliver; Kortner, Sandra; Kostyukhin, Vadim; Kotov, Vladislav; Kotwal, Ashutosh; Kourkoumelis, Christine; Kouskoura, Vasiliki; Koutsman, Alex; Kowalewski, Robert Victor; Kowalski, Tadeusz; Kozanecki, Witold; Kozhin, Anatoly; Kral, Vlastimil; Kramarenko, Viktor; Kramberger, Gregor; Krasnopevtsev, Dimitriy; Krasny, Mieczyslaw Witold; Krasznahorkay, Attila; Kraus, Jana; Kravchenko, Anton; Kreiss, Sven; Kretz, Moritz; Kretzschmar, Jan; Kreutzfeldt, Kristof; Krieger, Peter; Kroeninger, Kevin; Kroha, Hubert; Kroll, Joe; Kroseberg, Juergen; Krstic, Jelena; Kruchonak, Uladzimir; Krüger, Hans; Kruker, Tobias; Krumnack, Nils; Krumshteyn, Zinovii; Kruse, Amanda; Kruse, Mark; Kruskal, Michael; Kubota, Takashi; Kuday, Sinan; Kuehn, Susanne; Kugel, Andreas; Kuhl, Andrew; Kuhl, Thorsten; Kukhtin, Victor; Kulchitsky, Yuri; Kuleshov, Sergey; Kuna, Marine; Kunkle, Joshua; Kupco, Alexander; Kurashige, Hisaya; Kurochkin, Yurii; Kurumida, Rie; Kus, Vlastimil; Kuwertz, Emma Sian; Kuze, Masahiro; Kvita, Jiri; La Rosa, Alessandro; La Rotonda, Laura; Lacasta, Carlos; Lacava, Francesco; Lacey, James; Lacker, Heiko; Lacour, Didier; Lacuesta, Vicente Ramón; Ladygin, Evgueni; Lafaye, Remi; Laforge, Bertrand; Lagouri, Theodota; Lai, Stanley; Laier, Heiko; Lambourne, Luke; Lammers, Sabine; Lampen, Caleb; Lampl, Walter; Lançon, Eric; Landgraf, Ulrich; Landon, Murrough; Lang, Valerie Susanne; Lankford, Andrew; Lanni, Francesco; Lantzsch, Kerstin; Laplace, Sandrine; Lapoire, Cecile; Laporte, Jean-Francois; Lari, Tommaso; Lassnig, Mario; Laurelli, Paolo; Lavrijsen, Wim; Law, Alexander; Laycock, Paul; Le, Bao Tran; Le Dortz, Olivier; Le Guirriec, Emmanuel; Le Menedeu, Eve; LeCompte, Thomas; Ledroit-Guillon, Fabienne Agnes Marie; Lee, Claire, Alexandra; Lee, Hurng-Chun; Lee, Jason; Lee, Shih-Chang; Lee, Lawrence; Lefebvre, Guillaume; Lefebvre, Michel; Legger, Federica; Leggett, Charles; Lehan, Allan; Lehmacher, Marc; Lehmann Miotto, Giovanna; Lei, Xiaowen; Leight, William Axel; Leisos, Antonios; Leister, Andrew Gerard; Leite, Marco Aurelio Lisboa; Leitner, Rupert; Lellouch, Daniel; Lemmer, Boris; Leney, Katharine; Lenz, Tatjana; Lenzen, Georg; Lenzi, Bruno; Leone, Robert; Leone, Sandra; Leonhardt, Kathrin; Leonidopoulos, Christos; Leontsinis, Stefanos; Leroy, Claude; Lester, Christopher; Lester, Christopher Michael; Levchenko, Mikhail; Levêque, Jessica; Levin, Daniel; Levinson, Lorne; Levy, Mark; Lewis, Adrian; Lewis, George; Leyko, Agnieszka; Leyton, Michael; Li, Bing; Li, Bo; Li, Haifeng; Li, Ho Ling; Li, Lei; Li, Liang; Li, Shu; Li, Yichen; Liang, Zhijun; Liao, Hongbo; Liberti, Barbara; Lichard, Peter; Lie, Ki; Liebal, Jessica; Liebig, Wolfgang; Limbach, Christian; Limosani, Antonio; Lin, Simon; Lin, Tai-Hua; Linde, Frank; Lindquist, Brian Edward; Linnemann, James; Lipeles, Elliot; Lipniacka, Anna; Lisovyi, Mykhailo; Liss, Tony; Lissauer, David; Lister, Alison; Litke, Alan; Liu, Bo; Liu, Dong; Liu, Jianbei; Liu, Kun; Liu, Lulu; Liu, Miaoyuan; Liu, Minghui; Liu, Yanwen; Livan, Michele; Livermore, Sarah; Lleres, Annick; Llorente Merino, Javier; Lloyd, Stephen; Lo Sterzo, Francesco; Lobodzinska, Ewelina; Loch, Peter; Lockman, William; Loddenkoetter, Thomas; Loebinger, Fred; Loevschall-Jensen, Ask Emil; Loginov, Andrey; Loh, Chang Wei; Lohse, Thomas; Lohwasser, Kristin; Lokajicek, Milos; Lombardo, Vincenzo Paolo; Long, Brian Alexander; Long, Jonathan; Long, Robin Eamonn; Lopes, Lourenco; Lopez Mateos, David; Lopez Paredes, Brais; Lopez Paz, Ivan; Lorenz, Jeanette; Lorenzo Martinez, Narei; Losada, Marta; Loscutoff, Peter; Lou, XinChou; Lounis, Abdenour; Love, Jeremy; Love, Peter; Lowe, Andrew; Lu, Feng; Lubatti, Henry; Luci, Claudio; Lucotte, Arnaud; Luehring, Frederick; Lukas, Wolfgang; Luminari, Lamberto; Lundberg, Olof; Lund-Jensen, Bengt; Lungwitz, Matthias; Lynn, David; Lysak, Roman; Lytken, Else; Ma, Hong; Ma, Lian Liang; Maccarrone, Giovanni; Macchiolo, Anna; Machado Miguens, Joana; Macina, Daniela; Madaffari, Daniele; Madar, Romain; Maddocks, Harvey Jonathan; Mader, Wolfgang; Madsen, Alexander; Maeno, Mayuko; Maeno, Tadashi; Magradze, Erekle; Mahboubi, Kambiz; Mahlstedt, Joern; Mahmoud, Sara; Maiani, Camilla; Maidantchik, Carmen; Maier, Andreas Alexander; Maio, Amélia; Majewski, Stephanie; Makida, Yasuhiro; Makovec, Nikola; Mal, Prolay; Malaescu, Bogdan; Malecki, Pawel; Maleev, Victor; Malek, Fairouz; Mallik, Usha; Malon, David; Malone, Caitlin; Maltezos, Stavros; Malyshev, Vladimir; Malyukov, Sergei; Mamuzic, Judita; Mandelli, Beatrice; Mandelli, Luciano; Mandić, Igor; Mandrysch, Rocco; Maneira, José; Manfredini, Alessandro; Manhaes de Andrade Filho, Luciano; Manjarres Ramos, Joany Andreina; Mann, Alexander; Manning, Peter; Manousakis-Katsikakis, Arkadios; Mansoulie, Bruno; Mantifel, Rodger; Mapelli, Livio; March, Luis; Marchand, Jean-Francois; Marchiori, Giovanni; Marcisovsky, Michal; Marino, Christopher; Marjanovic, Marija; Marques, Carlos; Marroquim, Fernando; Marsden, Stephen Philip; Marshall, Zach; Marti, Lukas Fritz; Marti-Garcia, Salvador; Martin, Brian; Martin, Brian; Martin, Tim; Martin, Victoria Jane; Martin dit Latour, Bertrand; Martinez, Homero; Martinez, Mario; Martin-Haugh, Stewart; Martyniuk, Alex; Marx, Marilyn; Marzano, Francesco; Marzin, Antoine; Masetti, Lucia; Mashimo, Tetsuro; Mashinistov, Ruslan; Masik, Jiri; Maslennikov, Alexey; Massa, Ignazio; Massol, Nicolas; Mastrandrea, Paolo; Mastroberardino, Anna; Masubuchi, Tatsuya; Mättig, Peter; Mattmann, Johannes; Maurer, Julien; Maxfield, Stephen; Maximov, Dmitriy; Mazini, Rachid; Mazzaferro, Luca; Mc Goldrick, Garrin; Mc Kee, Shawn Patrick; McCarn, Allison; McCarthy, Robert; McCarthy, Tom; McCubbin, Norman; McFarlane, Kenneth; Mcfayden, Josh; Mchedlidze, Gvantsa; McMahon, Steve; McPherson, Robert; Meade, Andrew; Mechnich, Joerg; Medinnis, Michael; Meehan, Samuel; Mehlhase, Sascha; Mehta, Andrew; Meier, Karlheinz; Meineck, Christian; Meirose, Bernhard; Melachrinos, Constantinos; Mellado Garcia, Bruce Rafael; Meloni, Federico; Mengarelli, Alberto; Menke, Sven; Meoni, Evelin; Mercurio, Kevin Michael; Mergelmeyer, Sebastian; Meric, Nicolas; Mermod, Philippe; Merola, Leonardo; Meroni, Chiara; Merritt, Frank; Merritt, Hayes; Messina, Andrea; Metcalfe, Jessica; Mete, Alaettin Serhan; Meyer, Carsten; Meyer, Christopher; Meyer, Jean-Pierre; Meyer, Jochen; Middleton, Robin; Migas, Sylwia; Mijović, Liza; Mikenberg, Giora; Mikestikova, Marcela; Mikuž, Marko; Milic, Adriana; Miller, David; Mills, Corrinne; Milov, Alexander; Milstead, David; Milstein, Dmitry; Minaenko, Andrey; Minashvili, Irakli; Mincer, Allen; Mindur, Bartosz; Mineev, Mikhail; Ming, Yao; Mir, Lluisa-Maria; Mirabelli, Giovanni; Mitani, Takashi; Mitrevski, Jovan; Mitsou, Vasiliki A; Mitsui, Shingo; Miucci, Antonio; Miyagawa, Paul; Mjörnmark, Jan-Ulf; Moa, Torbjoern; Mochizuki, Kazuya; Mohapatra, Soumya; Mohr, Wolfgang; Molander, Simon; Moles-Valls, Regina; Mönig, Klaus; Monini, Caterina; Monk, James; Monnier, Emmanuel; Montejo Berlingen, Javier; Monticelli, Fernando; Monzani, Simone; Moore, Roger; Moraes, Arthur; Morange, Nicolas; Moreno, Deywis; Moreno Llácer, María; Morettini, Paolo; Morgenstern, Marcus; Morii, Masahiro; Moritz, Sebastian; Morley, Anthony Keith; Mornacchi, Giuseppe; Morris, John; Morvaj, Ljiljana; Moser, Hans-Guenther; Mosidze, Maia; Moss, Josh; Motohashi, Kazuki; Mount, Richard; Mountricha, Eleni; Mouraviev, Sergei; Moyse, Edward; Muanza, Steve; Mudd, Richard; Mueller, Felix; Mueller, James; Mueller, Klemens; Mueller, Thibaut; Mueller, Timo; Muenstermann, Daniel; Munwes, Yonathan; Murillo Quijada, Javier Alberto; Murray, Bill; Musheghyan, Haykuhi; Musto, Elisa; Myagkov, Alexey; Myska, Miroslav; Nackenhorst, Olaf; Nadal, Jordi; Nagai, Koichi; Nagai, Ryo; Nagai, Yoshikazu; Nagano, Kunihiro; Nagarkar, Advait; Nagasaka, Yasushi; Nagel, Martin; Nairz, Armin Michael; Nakahama, Yu; Nakamura, Koji; Nakamura, Tomoaki; Nakano, Itsuo; Namasivayam, Harisankar; Nanava, Gizo; Narayan, Rohin; Nattermann, Till; Naumann, Thomas; Navarro, Gabriela; Nayyar, Ruchika; Neal, Homer; Nechaeva, Polina; Neep, Thomas James; Nef, Pascal Daniel; Negri, Andrea; Negri, Guido; Negrini, Matteo; Nektarijevic, Snezana; Nelson, Andrew; Nelson, Timothy Knight; Nemecek, Stanislav; Nemethy, Peter; Nepomuceno, Andre Asevedo; Nessi, Marzio; Neubauer, Mark; Neumann, Manuel; Neves, Ricardo; Nevski, Pavel; Newman, Paul; Nguyen, Duong Hai; Nickerson, Richard; Nicolaidou, Rosy; Nicquevert, Bertrand; Nielsen, Jason; Nikiforou, Nikiforos; Nikiforov, Andriy; Nikolaenko, Vladimir; Nikolic-Audit, Irena; Nikolics, Katalin; Nikolopoulos, Konstantinos; Nilsson, Paul; Ninomiya, Yoichi; Nisati, Aleandro; Nisius, Richard; Nobe, Takuya; Nodulman, Lawrence; Nomachi, Masaharu; Nomidis, Ioannis; Norberg, Scarlet; Nordberg, Markus; Novgorodova, Olga; Nowak, Sebastian; Nozaki, Mitsuaki; Nozka, Libor; Ntekas, Konstantinos; Nunes Hanninger, Guilherme; Nunnemann, Thomas; Nurse, Emily; Nuti, Francesco; O'Brien, Brendan Joseph; O'grady, Fionnbarr; O'Neil, Dugan; O'Shea, Val; Oakham, Gerald; Oberlack, Horst; Obermann, Theresa; Ocariz, Jose; Ochi, Atsuhiko; Ochoa, Ines; Oda, Susumu; Odaka, Shigeru; Ogren, Harold; Oh, Alexander; Oh, Seog; Ohm, Christian; Ohman, Henrik; Ohshima, Takayoshi; Okamura, Wataru; Okawa, Hideki; Okumura, Yasuyuki; Okuyama, Toyonobu; Olariu, Albert; Olchevski, Alexander; Olivares Pino, Sebastian Andres; Oliveira Damazio, Denis; Oliver Garcia, Elena; Olszewski, Andrzej; Olszowska, Jolanta; Onofre, António; Onyisi, Peter; Oram, Christopher; Oreglia, Mark; Oren, Yona; Orestano, Domizia; Orlando, Nicola; Oropeza Barrera, Cristina; Orr, Robert; Osculati, Bianca; Ospanov, Rustem; Otero y Garzon, Gustavo; Otono, Hidetoshi; Ouchrif, Mohamed; Ouellette, Eric; Ould-Saada, Farid; Ouraou, Ahmimed; Oussoren, Koen Pieter; Ouyang, Qun; Ovcharova, Ana; Owen, Mark; Ozcan, Veysi Erkcan; Ozturk, Nurcan; Pachal, Katherine; Pacheco Pages, Andres; Padilla Aranda, Cristobal; Pagáčová, Martina; Pagan Griso, Simone; Paganis, Efstathios; Pahl, Christoph; Paige, Frank; Pais, Preema; Pajchel, Katarina; Palacino, Gabriel; Palestini, Sandro; Palka, Marek; Pallin, Dominique; Palma, Alberto; Palmer, Jody; Pan, Yibin; Panagiotopoulou, Evgenia; Panduro Vazquez, William; Pani, Priscilla; Panikashvili, Natalia; Panitkin, Sergey; Pantea, Dan; Paolozzi, Lorenzo; Papadopoulou, Theodora; Papageorgiou, Konstantinos; Paramonov, Alexander; Paredes Hernandez, Daniela; Parker, Michael Andrew; Parodi, Fabrizio; Parsons, John; Parzefall, Ulrich; Pasqualucci, Enrico; Passaggio, Stefano; Passeri, Antonio; Pastore, Fernanda; Pastore, Francesca; Pásztor, Gabriella; Pataraia, Sophio; Patel, Nikhul; Pater, Joleen; Patricelli, Sergio; Pauly, Thilo; Pearce, James; Pedersen, Maiken; Pedraza Lopez, Sebastian; Pedro, Rute; Peleganchuk, Sergey; Pelikan, Daniel; Peng, Haiping; Penning, Bjoern; Penwell, John; Perepelitsa, Dennis; Perez Codina, Estel; Pérez García-Estañ, María Teresa; Perez Reale, Valeria; Perini, Laura; Pernegger, Heinz; Perrino, Roberto; Peschke, Richard; Peshekhonov, Vladimir; Peters, Krisztian; Peters, Yvonne; Petersen, Brian; Petersen, Troels; Petit, Elisabeth; Petridis, Andreas; Petridou, Chariclia; Petrolo, Emilio; Petrucci, Fabrizio; Pettersson, Nora Emilia; Pezoa, Raquel; Phillips, Peter William; Piacquadio, Giacinto; Pianori, Elisabetta; Picazio, Attilio; Piccaro, Elisa; Piccinini, Maurizio; Piegaia, Ricardo; Pignotti, David; Pilcher, James; Pilkington, Andrew; Pina, João Antonio; Pinamonti, Michele; Pinder, Alex; Pinfold, James; Pingel, Almut; Pinto, Belmiro; Pires, Sylvestre; Pitt, Michael; Pizio, Caterina; Plazak, Lukas; Pleier, Marc-Andre; Pleskot, Vojtech; Plotnikova, Elena; Plucinski, Pawel; Poddar, Sahill; Podlyski, Fabrice; Poettgen, Ruth; Poggioli, Luc; Pohl, David-leon; Pohl, Martin; Polesello, Giacomo; Policicchio, Antonio; Polifka, Richard; Polini, Alessandro; Pollard, Christopher Samuel; Polychronakos, Venetios; Pommès, Kathy; Pontecorvo, Ludovico; Pope, Bernard; Popeneciu, Gabriel Alexandru; Popovic, Dragan; Poppleton, Alan; Portell Bueso, Xavier; Pospisil, Stanislav; Potamianos, Karolos; Potrap, Igor; Potter, Christina; Potter, Christopher; Poulard, Gilbert; Poveda, Joaquin; Pozdnyakov, Valery; Pralavorio, Pascal; Pranko, Aliaksandr; Prasad, Srivas; Pravahan, Rishiraj; Prell, Soeren; Price, Darren; Price, Joe; Price, Lawrence; Prieur, Damien; Primavera, Margherita; Proissl, Manuel; Prokofiev, Kirill; Prokoshin, Fedor; Protopapadaki, Eftychia-sofia; Protopopescu, Serban; Proudfoot, James; Przybycien, Mariusz; Przysiezniak, Helenka; Ptacek, Elizabeth; Puddu, Daniele; Pueschel, Elisa; Puldon, David; Purohit, Milind; Puzo, Patrick; Qian, Jianming; Qin, Gang; Qin, Yang; Quadt, Arnulf; Quarrie, David; Quayle, William; Queitsch-Maitland, Michaela; Quilty, Donnchadha; Qureshi, Anum; Radeka, Veljko; Radescu, Voica; Radhakrishnan, Sooraj Krishnan; Radloff, Peter; Rados, Pere; Ragusa, Francesco; Rahal, Ghita; Rajagopalan, Srinivasan; Rammensee, Michael; Randle-Conde, Aidan Sean; Rangel-Smith, Camila; Rao, Kanury; Rauscher, Felix; Rave, Tobias Christian; Ravenscroft, Thomas; Raymond, Michel; Read, Alexander Lincoln; Readioff, Nathan Peter; Rebuzzi, Daniela; Redelbach, Andreas; Redlinger, George; Reece, Ryan; Reeves, Kendall; Rehnisch, Laura; Reisin, Hernan; Relich, Matthew; Rembser, Christoph; Ren, Huan; Ren, Zhongliang; Renaud, Adrien; Rescigno, Marco; Resconi, Silvia; Rezanova, Olga; Reznicek, Pavel; Rezvani, Reyhaneh; Richter, Robert; Ridel, Melissa; Rieck, Patrick; Rieger, Julia; Rijssenbeek, Michael; Rimoldi, Adele; Rinaldi, Lorenzo; Ritsch, Elmar; Riu, Imma; Rizatdinova, Flera; Rizvi, Eram; Robertson, Steven; Robichaud-Veronneau, Andree; Robinson, Dave; Robinson, James; Robson, Aidan; Roda, Chiara; Rodrigues, Luis; Roe, Shaun; Røhne, Ole; Rolli, Simona; Romaniouk, Anatoli; Romano, Marino; Romero Adam, Elena; Rompotis, Nikolaos; Roos, Lydia; Ros, Eduardo; Rosati, Stefano; Rosbach, Kilian; Rose, Matthew; Rosendahl, Peter Lundgaard; Rosenthal, Oliver; Rossetti, Valerio; Rossi, Elvira; Rossi, Leonardo Paolo; Rosten, Rachel; Rotaru, Marina; Roth, Itamar; Rothberg, Joseph; Rousseau, David; Royon, Christophe; Rozanov, Alexandre; Rozen, Yoram; Ruan, Xifeng; Rubbo, Francesco; Rubinskiy, Igor; Rud, Viacheslav; Rudolph, Christian; Rudolph, Matthew Scott; Rühr, Frederik; Ruiz-Martinez, Aranzazu; Rurikova, Zuzana; Rusakovich, Nikolai; Ruschke, Alexander; Rutherfoord, John; Ruthmann, Nils; Ryabov, Yury; Rybar, Martin; Rybkin, Grigori; Ryder, Nick; Saavedra, Aldo; Sacerdoti, Sabrina; Saddique, Asif; Sadeh, Iftach; Sadrozinski, Hartmut; Sadykov, Renat; Safai Tehrani, Francesco; Sakamoto, Hiroshi; Sakurai, Yuki; Salamanna, Giuseppe; Salamon, Andrea; Saleem, Muhammad; Salek, David; Sales De Bruin, Pedro Henrique; Salihagic, Denis; Salnikov, Andrei; Salt, José; Salvachua Ferrando, Belén; Salvatore, Daniela; Salvatore, Pasquale Fabrizio; Salvucci, Antonio; Salzburger, Andreas; Sampsonidis, Dimitrios; Sanchez, Arturo; Sánchez, Javier; Sanchez Martinez, Victoria; Sandaker, Heidi; Sandbach, Ruth Laura; Sander, Heinz Georg; Sanders, Michiel; Sandhoff, Marisa; Sandoval, Tanya; Sandoval, Carlos; Sandstroem, Rikard; Sankey, Dave; Sansoni, Andrea; Santoni, Claudio; Santonico, Rinaldo; Santos, Helena; Santoyo Castillo, Itzebelt; Sapp, Kevin; Sapronov, Andrey; Saraiva, João; Sarrazin, Bjorn; Sartisohn, Georg; Sasaki, Osamu; Sasaki, Yuichi; Sauvage, Gilles; Sauvan, Emmanuel; Savard, Pierre; Savu, Dan Octavian; Sawyer, Craig; Sawyer, Lee; Saxon, David; Saxon, James; Sbarra, Carla; Sbrizzi, Antonio; Scanlon, Tim; Scannicchio, Diana; Scarcella, Mark; Scarfone, Valerio; Schaarschmidt, Jana; Schacht, Peter; Schaefer, Douglas; Schaefer, Ralph; Schaepe, Steffen; Schaetzel, Sebastian; Schäfer, Uli; Schaffer, Arthur; Schaile, Dorothee; Schamberger, R. Dean; Scharf, Veit; Schegelsky, Valery; Scheirich, Daniel; Schernau, Michael; Scherzer, Max; Schiavi, Carlo; Schieck, Jochen; Schillo, Christian; Schioppa, Marco; Schlenker, Stefan; Schmidt, Evelyn; Schmieden, Kristof; Schmitt, Christian; Schmitt, Christopher; Schmitt, Sebastian; Schneider, Basil; Schnellbach, Yan Jie; Schnoor, Ulrike; Schoeffel, Laurent; Schoening, Andre; Schoenrock, Bradley Daniel; Schorlemmer, Andre Lukas; Schott, Matthias; Schouten, Doug; Schovancova, Jaroslava; Schramm, Steven; Schreyer, Manuel; Schroeder, Christian; Schuh, Natascha; Schultens, Martin Johannes; Schultz-Coulon, Hans-Christian; Schulz, Holger; Schumacher, Markus; Schumm, Bruce; Schune, Philippe; Schwanenberger, Christian; Schwartzman, Ariel; Schwegler, Philipp; Schwemling, Philippe; Schwienhorst, Reinhard; Schwindling, Jerome; Schwindt, Thomas; Schwoerer, Maud; Sciacca, Gianfranco; Scifo, Estelle; Sciolla, Gabriella; Scott, Bill; Scuri, Fabrizio; Scutti, Federico; Searcy, Jacob; Sedov, George; Sedykh, Evgeny; Seidel, Sally; Seiden, Abraham; Seifert, Frank; Seixas, José; Sekhniaidze, Givi; Sekula, Stephen; Selbach, Karoline Elfriede; Seliverstov, Dmitry; Sellers, Graham; Semprini-Cesari, Nicola; Serfon, Cedric; Serin, Laurent; Serkin, Leonid; Serre, Thomas; Seuster, Rolf; Severini, Horst; Sfiligoj, Tina; Sforza, Federico; Sfyrla, Anna; Shabalina, Elizaveta; Shamim, Mansoora; Shan, Lianyou; Shang, Ruo-yu; Shank, James; Shapiro, Marjorie; Shatalov, Pavel; Shaw, Kate; Shehu, Ciwake Yusufu; Sherwood, Peter; Shi, Liaoshan; Shimizu, Shima; Shimmin, Chase Owen; Shimojima, Makoto; Shiyakova, Mariya; Shmeleva, Alevtina; Shochet, Mel; Short, Daniel; Shrestha, Suyog; Shulga, Evgeny; Shupe, Michael; Shushkevich, Stanislav; Sicho, Petr; Sidiropoulou, Ourania; Sidorov, Dmitri; Sidoti, Antonio; Siegert, Frank; Sijacki, Djordje; Silva, José; Silver, Yiftah; Silverstein, Daniel; Silverstein, Samuel; Simak, Vladislav; Simard, Olivier; Simic, Ljiljana; Simion, Stefan; Simioni, Eduard; Simmons, Brinick; Simoniello, Rosa; Simonyan, Margar; Sinervo, Pekka; Sinev, Nikolai; Sipica, Valentin; Siragusa, Giovanni; Sircar, Anirvan; Sisakyan, Alexei; Sivoklokov, Serguei; Sjölin, Jörgen; Sjursen, Therese; Skottowe, Hugh Philip; Skovpen, Kirill; Skubic, Patrick; Slater, Mark; Slavicek, Tomas; Sliwa, Krzysztof; Smakhtin, Vladimir; Smart, Ben; Smestad, Lillian; Smirnov, Sergei; Smirnov, Yury; Smirnova, Lidia; Smirnova, Oxana; Smith, Kenway; Smizanska, Maria; Smolek, Karel; Snesarev, Andrei; Snidero, Giacomo; Snyder, Scott; Sobie, Randall; Socher, Felix; Soffer, Abner; Soh, Dart-yin; Solans, Carlos; Solar, Michael; Solc, Jaroslav; Soldatov, Evgeny; Soldevila, Urmila; Solfaroli Camillocci, Elena; Solodkov, Alexander; Soloshenko, Alexei; Solovyanov, Oleg; Solovyev, Victor; Sommer, Philip; Song, Hong Ye; Soni, Nitesh; Sood, Alexander; Sopczak, Andre; Sopko, Bruno; Sopko, Vit; Sorin, Veronica; Sosebee, Mark; Soualah, Rachik; Soueid, Paul; Soukharev, Andrey; South, David; Spagnolo, Stefania; Spanò, Francesco; Spearman, William Robert; Spettel, Fabian; Spighi, Roberto; Spigo, Giancarlo; Spousta, Martin; Spreitzer, Teresa; Spurlock, Barry; St Denis, Richard Dante; Staerz, Steffen; Stahlman, Jonathan; Stamen, Rainer; Stanecka, Ewa; Stanek, Robert; Stanescu, Cristian; Stanescu-Bellu, Madalina; Stanitzki, Marcel Michael; Stapnes, Steinar; Starchenko, Evgeny; Stark, Jan; Staroba, Pavel; Starovoitov, Pavel; Staszewski, Rafal; Stavina, Pavel; Steinberg, Peter; Stelzer, Bernd; Stelzer, Harald Joerg; Stelzer-Chilton, Oliver; Stenzel, Hasko; Stern, Sebastian; Stewart, Graeme; Stillings, Jan Andre; Stockton, Mark; Stoebe, Michael; Stoicea, Gabriel; Stolte, Philipp; Stonjek, Stefan; Stradling, Alden; Straessner, Arno; Stramaglia, Maria Elena; Strandberg, Jonas; Strandberg, Sara; Strandlie, Are; Strauss, Emanuel; Strauss, Michael; Strizenec, Pavol; Ströhmer, Raimund; Strom, David; Stroynowski, Ryszard; Stucci, Stefania Antonia; Stugu, Bjarne; Styles, Nicholas Adam; Su, Dong; Su, Jun; Subramania, Halasya Siva; Subramaniam, Rajivalochan; Succurro, Antonella; Sugaya, Yorihito; Suhr, Chad; Suk, Michal; Sulin, Vladimir; Sultansoy, Saleh; Sumida, Toshi; Sun, Xiaohu; Sundermann, Jan Erik; Suruliz, Kerim; Susinno, Giancarlo; Sutton, Mark; Suzuki, Yu; Svatos, Michal; Swedish, Stephen; Swiatlowski, Maximilian; Sykora, Ivan; Sykora, Tomas; Ta, Duc; Taccini, Cecilia; Tackmann, Kerstin; Taenzer, Joe; Taffard, Anyes; Tafirout, Reda; Taiblum, Nimrod; Takahashi, Yuta; Takai, Helio; Takashima, Ryuichi; Takeda, Hiroshi; Takeshita, Tohru; Takubo, Yosuke; Talby, Mossadek; Talyshev, Alexey; Tam, Jason; Tan, Kong Guan; Tanaka, Junichi; Tanaka, Reisaburo; Tanaka, Satoshi; Tanaka, Shuji; Tanasijczuk, Andres Jorge; Tannenwald, Benjamin Bordy; Tannoury, Nancy; Tapprogge, Stefan; Tarem, Shlomit; Tarrade, Fabien; Tartarelli, Giuseppe Francesco; Tas, Petr; Tasevsky, Marek; Tashiro, Takuya; Tassi, Enrico; Tavares Delgado, Ademar; Tayalati, Yahya; Taylor, Frank; Taylor, Geoffrey; Taylor, Wendy; Teischinger, Florian Alfred; Teixeira Dias Castanheira, Matilde; Teixeira-Dias, Pedro; Temming, Kim Katrin; Ten Kate, Herman; Teng, Ping-Kun; Teoh, Jia Jian; Terada, Susumu; Terashi, Koji; Terron, Juan; Terzo, Stefano; Testa, Marianna; Teuscher, Richard; Therhaag, Jan; Theveneaux-Pelzer, Timothée; Thomas, Juergen; Thomas-Wilsker, Joshuha; Thompson, Emily; Thompson, Paul; Thompson, Peter; Thompson, Stan; Thomsen, Lotte Ansgaard; Thomson, Evelyn; Thomson, Mark; Thong, Wai Meng; Thun, Rudolf; Tian, Feng; Tibbetts, Mark James; Tikhomirov, Vladimir; Tikhonov, Yury; Timoshenko, Sergey; Tiouchichine, Elodie; Tipton, Paul; Tisserant, Sylvain; Todorov, Theodore; Todorova-Nova, Sharka; Toggerson, Brokk; Tojo, Junji; Tokár, Stanislav; Tokushuku, Katsuo; Tollefson, Kirsten; Tomlinson, Lee; Tomoto, Makoto; Tompkins, Lauren; Toms, Konstantin; Topilin, Nikolai; Torrence, Eric; Torres, Heberth; Torró Pastor, Emma; Toth, Jozsef; Touchard, Francois; Tovey, Daniel; Tran, Huong Lan; Trefzger, Thomas; Tremblet, Louis; Tricoli, Alessandro; Trigger, Isabel Marian; Trincaz-Duvoid, Sophie; Tripiana, Martin; Triplett, Nathan; Trischuk, William; Trocmé, Benjamin; Troncon, Clara; Trottier-McDonald, Michel; Trovatelli, Monica; True, Patrick; Trzebinski, Maciej; Trzupek, Adam; Tsarouchas, Charilaos; Tseng, Jeffrey; Tsiareshka, Pavel; Tsionou, Dimitra; Tsipolitis, Georgios; Tsirintanis, Nikolaos; Tsiskaridze, Shota; Tsiskaridze, Vakhtang; Tskhadadze, Edisher; Tsukerman, Ilya; Tsulaia, Vakhtang; Tsuno, Soshi; Tsybychev, Dmitri; Tudorache, Alexandra; Tudorache, Valentina; Tuna, Alexander Naip; Tupputi, Salvatore; Turchikhin, Semen; Turecek, Daniel; Turk Cakir, Ilkay; Turra, Ruggero; Tuts, Michael; Tykhonov, Andrii; Tylmad, Maja; Tyndel, Mike; Uchida, Kirika; Ueda, Ikuo; Ueno, Ryuichi; Ughetto, Michael; Ugland, Maren; Uhlenbrock, Mathias; Ukegawa, Fumihiko; Unal, Guillaume; Undrus, Alexander; Unel, Gokhan; Ungaro, Francesca; Unno, Yoshinobu; Urbaniec, Dustin; Urquijo, Phillip; Usai, Giulio; Usanova, Anna; Vacavant, Laurent; Vacek, Vaclav; Vachon, Brigitte; Valencic, Nika; Valentinetti, Sara; Valero, Alberto; Valery, Loic; Valkar, Stefan; Valladolid Gallego, Eva; Vallecorsa, Sofia; Valls Ferrer, Juan Antonio; Van Den Wollenberg, Wouter; Van Der Deijl, Pieter; van der Geer, Rogier; van der Graaf, Harry; Van Der Leeuw, Robin; van der Ster, Daniel; van Eldik, Niels; van Gemmeren, Peter; Van Nieuwkoop, Jacobus; van Vulpen, Ivo; van Woerden, Marius Cornelis; Vanadia, Marco; Vandelli, Wainer; Vanguri, Rami; Vaniachine, Alexandre; Vankov, Peter; Vannucci, Francois; Vardanyan, Gagik; Vari, Riccardo; Varnes, Erich; Varol, Tulin; Varouchas, Dimitris; Vartapetian, Armen; Varvell, Kevin; Vazeille, Francois; Vazquez Schroeder, Tamara; Veatch, Jason; Veloso, Filipe; Veneziano, Stefano; Ventura, Andrea; Ventura, Daniel; Venturi, Manuela; Venturi, Nicola; Venturini, Alessio; Vercesi, Valerio; Verducci, Monica; Verkerke, Wouter; Vermeulen, Jos; Vest, Anja; Vetterli, Michel; Viazlo, Oleksandr; Vichou, Irene; Vickey, Trevor; Vickey Boeriu, Oana Elena; Viehhauser, Georg; Viel, Simon; Vigne, Ralph; Villa, Mauro; Villaplana Perez, Miguel; Vilucchi, Elisabetta; Vincter, Manuella; Vinogradov, Vladimir; Virzi, Joseph; Vivarelli, Iacopo; Vives Vaque, Francesc; Vlachos, Sotirios; Vladoiu, Dan; Vlasak, Michal; Vogel, Adrian; Vogel, Marcelo; Vokac, Petr; Volpi, Guido; Volpi, Matteo; von der Schmitt, Hans; von Radziewski, Holger; von Toerne, Eckhard; Vorobel, Vit; Vorobev, Konstantin; Vos, Marcel; Voss, Rudiger; Vossebeld, Joost; Vranjes, Nenad; Vranjes Milosavljevic, Marija; Vrba, Vaclav; Vreeswijk, Marcel; Vu Anh, Tuan; Vuillermet, Raphael; Vukotic, Ilija; Vykydal, Zdenek; Wagner, Peter; Wagner, Wolfgang; Wahlberg, Hernan; Wahrmund, Sebastian; Wakabayashi, Jun; Walder, James; Walker, Rodney; Walkowiak, Wolfgang; Wall, Richard; Waller, Peter; Walsh, Brian; Wang, Chao; Wang, Chiho; Wang, Fuquan; Wang, Haichen; Wang, Hulin; Wang, Jike; Wang, Jin; Wang, Kuhan; Wang, Rui; Wang, Song-Ming; Wang, Tan; Wang, Xiaoxiao; Wanotayaroj, Chaowaroj; Warburton, Andreas; Ward, Patricia; Wardrope, David Robert; Warsinsky, Markus; Washbrook, Andrew; Wasicki, Christoph; Watkins, Peter; Watson, Alan; Watson, Ian; Watson, Miriam; Watts, Gordon; Watts, Stephen; Waugh, Ben; Webb, Samuel; Weber, Michele; Weber, Stefan Wolf; Webster, Jordan S; Weidberg, Anthony; Weigell, Philipp; Weinert, Benjamin; Weingarten, Jens; Weiser, Christian; Weits, Hartger; Wells, Phillippa; Wenaus, Torre; Wendland, Dennis; Weng, Zhili; Wengler, Thorsten; Wenig, Siegfried; Wermes, Norbert; Werner, Matthias; Werner, Per; Wessels, Martin; Wetter, Jeffrey; Whalen, Kathleen; White, Andrew; White, Martin; White, Ryan; White, Sebastian; Whiteson, Daniel; Wicke, Daniel; Wickens, Fred; Wiedenmann, Werner; Wielers, Monika; Wienemann, Peter; Wiglesworth, Craig; Wiik-Fuchs, Liv Antje Mari; Wijeratne, Peter Alexander; Wildauer, Andreas; Wildt, Martin Andre; Wilkens, Henric George; Will, Jonas Zacharias; Williams, Hugh; Williams, Sarah; Willis, Christopher; Willocq, Stephane; Wilson, Alan; Wilson, John; Wingerter-Seez, Isabelle; Winklmeier, Frank; Winter, Benedict Tobias; Wittgen, Matthias; Wittig, Tobias; Wittkowski, Josephine; Wollstadt, Simon Jakob; Wolter, Marcin Wladyslaw; Wolters, Helmut; Wosiek, Barbara; Wotschack, Jorg; Woudstra, Martin; Wozniak, Krzysztof; Wright, Michael; Wu, Mengqing; Wu, Sau Lan; Wu, Xin; Wu, Yusheng; Wulf, Evan; Wyatt, Terry Richard; Wynne, Benjamin; Xella, Stefania; Xiao, Meng; Xu, Da; Xu, Lailin; Yabsley, Bruce; Yacoob, Sahal; Yamada, Miho; Yamaguchi, Hiroshi; Yamaguchi, Yohei; Yamamoto, Akira; Yamamoto, Kyoko; Yamamoto, Shimpei; Yamamura, Taiki; Yamanaka, Takashi; Yamauchi, Katsuya; Yamazaki, Yuji; Yan, Zhen; Yang, Haijun; Yang, Hongtao; Yang, Un-Ki; Yang, Yi; Yanush, Serguei; Yao, Liwen; Yao, Weiming; Yasu, Yoshiji; Yatsenko, Elena; Yau Wong, Kaven Henry; Ye, Jingbo; Ye, Shuwei; Yen, Andy L; Yildirim, Eda; Yilmaz, Metin; Yoosoofmiya, Reza; Yorita, Kohei; Yoshida, Rikutaro; Yoshihara, Keisuke; Young, Charles; Young, Christopher John; Youssef, Saul; Yu, David Ren-Hwa; Yu, Jaehoon; Yu, Jiaming; Yu, Jie; Yuan, Li; Yurkewicz, Adam; Yusuff, Imran; Zabinski, Bartlomiej; Zaidan, Remi; Zaitsev, Alexander; Zaman, Aungshuman; Zambito, Stefano; Zanello, Lucia; Zanzi, Daniele; Zeitnitz, Christian; Zeman, Martin; Zemla, Andrzej; Zengel, Keith; Zenin, Oleg; Ženiš, Tibor; Zerwas, Dirk; Zevi della Porta, Giovanni; Zhang, Dongliang; Zhang, Fangzhou; Zhang, Huaqiao; Zhang, Jinlong; Zhang, Lei; Zhang, Xueyao; Zhang, Zhiqing; Zhao, Zhengguo; Zhemchugov, Alexey; Zhong, Jiahang; Zhou, Bing; Zhou, Lei; Zhou, Ning; Zhu, Cheng Guang; Zhu, Hongbo; Zhu, Junjie; Zhu, Yingchun; Zhuang, Xuai; Zhukov, Konstantin; Zibell, Andre; Zieminska, Daria; Zimine, Nikolai; Zimmermann, Christoph; Zimmermann, Robert; Zimmermann, Simone; Zimmermann, Stephanie; Zinonos, Zinonas; Ziolkowski, Michael; Zobernig, Georg; Zoccoli, Antonio; zur Nedden, Martin; Zurzolo, Giovanni; Zutshi, Vishnu; Zwalinski, Lukasz

    2014-01-01

    A novel technique to identify and split clusters created by multiple charged particles in the ATLAS pixel detector using a set of artificial neural networks is presented. Such merged clusters are a common feature of tracks originating from highly energetic objects, such as jets. Neural networks are trained using Monte Carlo samples produced with a detailed detector simulation. This technique replaces the former clustering approach based on a connected component analysis and charge interpolation. The performance of the neural network splitting technique is quantified using data from proton-proton collisions at the LHC collected by the ATLAS detector in 2011 and from Monte Carlo simulations. This technique reduces the number of clusters shared between tracks in highly energetic jets by up to a factor of three. It also provides more precise position and error estimates of the clusters in both the transverse and longitudinal impact parameter resolution.

  3. The Pixel Detector of the ATLAS experiment for the Run 2 at the Large Hadron Collider

    CERN Document Server

    Oide, H; The ATLAS collaboration

    2014-01-01

    The Pixel Detector of the ATLAS experiment has shown excellent performance during the whole Run 1 of LHC. Taking advantage of the long shutdown, the detector was extracted from the experiment and brought to surface, to equip it with new service quarter panels, to repair modules and to ease installation of the Insertable B-Layer (IBL). The IBL is the fourth layer of the Run 2 Pixel Detector, and it was installed in May 2014 between the existing Pixel Detector and the new smaller-radius beam pipe at a radius of 3.3 cm. To cope with the high radiation and pixel occupancy due to the proximity to the interaction point, a new read-out chip and two different silicon sensor technologies (planar and 3D) have been developed. Furthermore, the physics performance will be improved through the reduction of pixel size while, targeting for a low material budget, a new mechanical support using lightweight staves and a CO2 based cooling system have been adopted. IBL construction is now completed. An overview of the IBL project...

  4. The upgraded Pixel Detector of the ATLAS Experiment for Run2 at the Large Hadron Collider

    CERN Document Server

    Mullier, Geoffrey Andre; The ATLAS collaboration

    2015-01-01

    The Pixel Detector of the ATLAS experiment has shown excellent performance during the whole Run-1 of LHC. Taking advantage of the long showdown, the detector was extracted from the experiment and brought to surface, to equip it with new service quarter panels, to repair modules and to ease installation of the Insertable B-Layer (IBL), a fourth layer of pixel detectors, installed in May 2014 between the existing Pixel Detector and a new smaller radius beam-pipe at a radius of 3.3 cm. To cope with the high radiation and increased pixel occupancy due to the proximity to the interaction point, two different silicon sensor technologies (planar and 3D) have been developed. A new readout chip has been developed within CMOS 130nm technology with larger area, smaller pixel size and faster readout capability. Dedicated design features in combination with a new composite material were considered and used in order to reduce the material budget of the support structure while keeping the optimal thermo-mechanical performan...

  5. Prototypes for components of a control system for the ATLAS pixel detector at the HL-LHC

    CERN Document Server

    Boek, J; Kind, P; Mättig, P; Püllen, L; Zeitnitz, C

    2013-01-01

    inner detector of the ATLAS experiment will be replaced entirely including the pixel detector. This new pixel detector requires a specific control system which complies with the strict requirements in terms of radiation hardness, material budget and space for the electronics in the ATLAS experiment. The University ofWuppertal is developing a concept for a DCS (Detector Control System) network consisting of two kinds of ASICs. The first ASIC is the DCS Chip which is located on the pixel detector, very close to the interaction point. The second ASIC is the DCS Controller which is controlling 4x4 DCS Chips from the outer regions of ATLAS via differential data lines. Both ASICs are manufactured in 130 nm deep sub micron technology. We present results from measurements from new prototypes of components for the DCS network.

  6. The Pixel Detector of the ATLAS Experiment for the Run-2 at the Large Hadron Collider

    CERN Document Server

    Guescini, F; The ATLAS collaboration

    2014-01-01

    The Pixel Detector of the ATLAS experiment has shown excellent performance during the whole Run-1 of LHC. Taking advantage of the long showdown, the detector was extracted from the experiment and brought to surface, to equip it with new service quarter panels, to repair modules and to ease installation of the Insertable B-Layer (IBL). IBL is a fourth layer of pixel detectors, and has been installed in May 2014 between the existing Pixel Detector and a new smaller radius beam-pipe at a radial distance of 3.3 cm from the beam axis. The realization of the IBL required the development of several new technologies and solutions in order to overcome the challenges introduced by the extreme environment and working conditions, such as the high radiation levels, the high pixel occupancy and the need of an exceptionally low material budget. Two silicon sensor technologies have been adopted for the IBL modules: planar n-in-n and 3D. Both of these are connected via bump bonding to the new generation 130 nm IBM CMOS FE-I4 ...

  7. Status of the ATLAS Pixel Detector at the LHC and its performance after three years of operation

    CERN Document Server

    Andreazza, A; The ATLAS collaboration

    2012-01-01

    The ATLAS Pixel Detector is the innermost detector of the ATLAS experi- ment at the Large Hadron Collider at CERN, providing high-resolution mea- surements of charged particle tracks in the high radiation environment close to the collision region. The detector provides hermetic coverage with three cylindrical layers and three layers of forward and backward pixel detectors. It consists of approximately 80 million pixels that are individually read out via chips bump-bonded to 1744 n-in-n silicon substrates. After three years of operation the detector performance is excellent: 96% of the pixels are opera- tional, at 3500 e threshold noise occupancy and efficiency exceed the design specification. The effect of radiation on the silicon sensor is measured and compared with model of radiation damage.

  8. 3D silicon pixel detectors for the ATLAS Forward Physics experiment

    CERN Document Server

    INSPIRE-00397348; Cavallaro, E.; Grinstein, S.; López Paz, I.

    2015-01-01

    The ATLAS Forward Physics (AFP) project plans to install 3D silicon pixel detectors about 210 m away from the interaction point and very close to the beamline (2-3 mm). This implies the need of slim edges of about 100-200 $\\mu$m width for the sensor side facing the beam to minimise the dead area. Another challenge is an expected non-uniform irradiation of the pixel sensors. It is studied if these requirements can be met using slightly-modified FE-I4 3D pixel sensors from the ATLAS Insertable B-Layer production. AFP-compatible slim edges are obtained with a simple diamond-saw cut. Electrical characterisations and beam tests are carried out and no detrimental impact on the leakage current and hit efficiency is observed. For devices without a 3D guard ring a remaining insensitive edge of less than 15 $\\mu$m width is found. Moreover, 3D detectors are non-uniformly irradiated up to fluences of several 10$^{15}$ n$_{eq}$/cm$^2$ with either a focussed 23 GeV proton beam or a 23 MeV proton beam through holes in Al ma...

  9. Development of a Detector Control System for the ATLAS Pixel detector in the HL-LHC

    Science.gov (United States)

    Lehmann, N.; Karagounis, M.; Kersten, S.; Zeitnitz, C.

    2016-11-01

    The upgrade of the LHC to the HL-LHC requires a new ITk detector. The innermost part of this new tracker is a pixel detector. The University of Wuppertal is developing a new DCS to monitor and control this new pixel detector. The current concept envisions three parallel paths of the DCS. The first path, called security path, is hardwired and provides an interlock system to guarantee the safety of the detector and human beings. The second path is a control path. This path is used to supervise the entire detector. The control path has its own communication lines independent from the regular data readout for reliable operation. The third path is for diagnostics and provides information on demand. It is merged with the regular data readout and provides the highest granularity and most detailed information. To reduce the material budget, a serial power scheme is the baseline for the pixel modules. A new ASIC used in the control path is in development at Wuppertal for this serial power chain. A prototype exists already and a proof of principle was demonstrated. Development and research is ongoing to guarantee the correct operation of the new ASIC in the harsh environment of the HL-LHC. The concept for the new DCS will be presented in this paper. A focus will be made on the development of the DCS chip, used for monitoring and control of pixel modules in a serial power chain.

  10. System test and noise performance studies at the ATLAS pixel detector

    Energy Technology Data Exchange (ETDEWEB)

    Weingarten, J.

    2007-09-15

    The central component of the ATLAS Inner Tracker is the pixel detector. It consists of three barrel layers and three disk-layers in the end-caps in both forward directions. The innermost barrel layer is mounted at a distance of about 5 cm from the interaction region. With its very high granularity, truly two-dimensional hit information, and fast readout it is well suited to cope with the high densities of charged tracks, expected this close to the interaction region. The huge number of readout channels necessitates a very complex services infrastructure for powering, readout and safety. After a description of the pixel detector and its services infrastructure, key results from the system test at CERN are presented. Furthermore the noise performance of the pixel detector, crucial for high tracking and vertexing efficiencies, is studied. Measurements of the single-channel random noise are presented together with studies of common mode noise and measurements of the noise occupancy using a random trigger generator. (orig.)

  11. Status of the ATLAS Pixel Detector at the LHC and its performance after three years of operation.

    CERN Document Server

    Heim, Timon; The ATLAS collaboration

    2013-01-01

    The ATLAS Pixel Detector is the innermost detector of the ATLAS experiment at the Large Hadron Collider at CERN. The detector provides hermetic coverage with three cylindrical layers and three layers of forward and backward pixel detectors. It consists of approximately 80 million pixels that are individually read out via chips bump-bonded to 1744 n-in-n silicon substrates. In this talk, results from the successful operation of the Pixel Detector at the LHC and its status after three years of operation will be presented, including monitoring, calibration procedures, timing optimization and detector performance. The record breaking instantaneous luminosities of 7.7 x 10^33 cm-2 s-1 recently surpassed at the Large Hadron Collider generate a rapidly increasing particle fluence in the ATLAS Pixel Detector. As the radiation dose accumulates, the first effects of radiation damage are now observable in the silicon sensors. A regular monitoring program has been conducted and reveals an increase in the silicon leakage ...

  12. ATLAS-TPX: a two-layer pixel detector setup for neutron detection and radiation field characterization

    Science.gov (United States)

    Bergmann, B.; Caicedo, I.; Leroy, C.; Pospisil, S.; Vykydal, Z.

    2016-10-01

    A two-layer pixel detector setup (ATLAS-TPX), designed for thermal and fast neutron detection and radiation field characterization is presented. It consists of two segmented silicon detectors (256 × 256 pixels, pixel pitch 55 μm, thicknesses 300 μm and 500 μm) facing each other. To enhance the neutron detection efficiency a set of converter layers is inserted in between these detectors. The pixelation and the two-layer design allow a discrimination of neutrons against γs by pattern recognition and against charged particles by using the coincidence and anticoincidence information. The neutron conversion and detection efficiencies are measured in a thermal neutron field and fast neutron fields with energies up to 600 MeV. A Geant4 simulation model is presented, which is validated against the measured detector responses. The reliability of the coincidence and anticoincidence technique is demonstrated and possible applications of the detector setup are briefly outlined.

  13. Firmware development and testing of the ATLAS Pixel Detector / IBL ROD card

    CERN Document Server

    Gabrielli, Alessandro; The ATLAS collaboration; Balbi, Gabriele; Bindi, Marcello; Chen, Shaw-pin; Falchieri, Davide; Flick, Tobias; Hauck, Scott Alan; Hsu, Shih-Chieh; Kretz, Moritz; Kugel, Andreas; Lama, Luca; Travaglini, Riccardo; Wensing, Marius; ATLAS Pixel Collaboration

    2015-01-01

    The ATLAS Experiment is reworking and upgrading systems during the current LHC shut down. In particular, the Pixel detector has inserted an additional inner layer called Insertable B-Layer (IBL). The Readout-Driver card (ROD), the Back-of-Crate card (BOC), and the S-Link together form the essential frontend data path of the IBL’s off-detector DAQ system. The strategy for IBL ROD firmware development was three-fold: keeping as much of the Pixel ROD datapath firmware logic as possible, employing a complete new scheme of steering and calibration firmware and designing the overall system to prepare for a future unified code version integrating IBL and Pixel layers. Essential features such as data formatting, frontend-specific error handling, and calibration are added to the ROD data path. An IBL DAQ testbench using realistic frontend chip model was created to serve as an initial framework for full offline electronic system simulation. In this document, major firmware achievements concerning the IBL ROD data pat...

  14. Firmware development and testing of the ATLAS Pixel Detector / IBL ROD card

    CERN Document Server

    Balbi, G; The ATLAS collaboration; Gabrielli, A; Lama, L; Travaglini, R; Backhaus, M; Bindi, M; Chen, S-P; Flick, T; Kretz, M; Kugel, A; Wensing, M

    2014-01-01

    The ATLAS Experiment is reworking and upgrading systems during the current LHC shut down. In particular, the Pixel detector has inserted an additional inner layer called Insertable B-Layer (IBL). The Readout-Driver card (ROD), the Back-of-Crate card (BOC), and the S-Link together form the essential frontend data path of the IBL’s off-detector DAQ system. The strategy for IBLROD firmware development was three-fold: keeping as much of the PixelROD datapath firmware logic as possible, employing a complete new scheme of steering and calibration firmware and designing the overall system to prepare for a future unified code version integrating IBL and Pixel layers. Essential features such as data formatting, frontend-specific error handling, and calibration are added to the ROD data path. An IBLDAQ testbench using realistic frontend chip model was created to serve as an initial framework for full offline electronic system simulation. In this document, major firmware achievements concerning the IBLROD data path im...

  15. Radiation-hard ASICs for optical data transmission in the ATLAS pixel detector

    CERN Document Server

    Ziolkowski, M; Buchholz, P; Ciliox, A; Gan, K K; Holder, M; Johnson, M; Kagan, H; Kass, R; Nderitu, S; Rahimi, A; Rush, C J; Smith, S; Ter-Antonian, R; Zoeller, M M

    2004-01-01

    We have developed two radiation-hard ASICs for optical data transmission in the ATLAS pixel detector at the CERN Large Hadron Collider (LHC). The first circuit is a driver chip for a Vertical Cavity Surface Emitting Laser (VCSEL) diode to be used for 80 Mbit/s data transmission from the detector. The second circuit is a Bi-Phase Mark, decoder chip to recover the control data and 40 MHz clock received optically by a PIN diode on the detector side. During ten years of operation at the LHC, the ATLAS optical link circuitry will be exposed to a maximum total fluence of 10/sup 15/ 1-MeV-equivalent neutrons per cm/sup 2/. We have successfully implemented both ASICs in a commercial 0.25 mu m CMOS technology using standard layout techniques to enhance the radiation tolerance. Both chips are four- channel devices compatible with common cathode PIN and VCSEL arrays. We present results from final prototype circuits and from irradiation studies of both circuits with 24 GeV protons up to a total dose of 57 Mrad. (3 refs).

  16. Beam Test Studies of 3D Pixel Sensors Irradiated Non-Uniformly for the ATLAS Forward Physics Detector

    CERN Document Server

    Grinstein, S; Boscardin, M; Christophersen, M; Da Via, C; Betta, G -F Dalla; Darbo, G; Fadeyev, V; Fleta, C; Gemme, C; Grenier, P; Jimenez, A; Lopez, I; Micelli, A; Nelist, C; Parker, S; Pellegrini, G; Phlips, B; Pohl, D L; Sadrozinski, H F -W; Sicho, P; Tsiskaridze, S

    2013-01-01

    Pixel detectors with cylindrical electrodes that penetrate the silicon substrate (so called 3D detectors) offer advantages over standard planar sensors in terms of radiation hardness, since the electrode distance is decoupled from the bulk thickness. In recent years significant progress has been made in the development of 3D sensors, which culminated in the sensor production for the ATLAS Insertable B-Layer (IBL) upgrade carried out at CNM (Barcelona, Spain) and FBK (Trento, Italy). Based on this success, the ATLAS Forward Physics (AFP) experiment has selected the 3D pixel sensor technology for the tracking detector. The AFP project presents a new challenge due to the need for a reduced dead area with respect to IBL, and the in-homogeneous nature of the radiation dose distribution in the sensor. Electrical characterization of the first AFP prototypes and beam test studies of 3D pixel devices irradiated non-uniformly are presented in this paper.

  17. Beam test studies of 3D pixel sensors irradiated non-uniformly for the ATLAS forward physics detector

    Energy Technology Data Exchange (ETDEWEB)

    Grinstein, S., E-mail: sgrinstein@ifae.es [ICREA and Institut de Física d' Altes Energies (IFAE), Barcelona (Spain); Baselga, M. [Centro Nacional de Microelectronica, CNM-IMB (CSIC), Barcelona (Spain); Boscardin, M. [Fondazione Bruno Kessler, FBK-CMM, Trento (Italy); Christophersen, M. [U.S. Naval Research Laboratory, Washington (United States); Da Via, C. [School of Physics and Astronomy, University of Manchester, Manchester (United Kingdom); Dalla Betta, G.-F. [Universita degli Studi di Trento and INFN, Trento (Italy); Darbo, G. [INFN Sezione di Genova, Genova (Italy); Fadeyev, V. [Santa Cruz Institute for Particle Physics, University of California, Santa Cruz (United States); Fleta, C. [Centro Nacional de Microelectronica, CNM-IMB (CSIC), Barcelona (Spain); Gemme, C. [Universita degli Studi di Trento and INFN, Trento (Italy); Grenier, P. [SLAC National Accelerator Laboratory, Menlo Park (United States); Jimenez, A.; Lopez, I.; Micelli, A. [ICREA and Institut de Física d' Altes Energies (IFAE), Barcelona (Spain); Nelist, C. [INFN Sezione di Genova, Genova (Italy); Parker, S. [University of Hawaii, c/o Lawrence Berkeley Laboratory, Berkeley (United States); Pellegrini, G. [Centro Nacional de Microelectronica, CNM-IMB (CSIC), Barcelona (Spain); Phlips, B. [U.S. Naval Research Laboratory, Washington (United States); Pohl, D.-L. [University of Bonn, Bonn (Germany); Sadrozinski, H.F.-W. [Santa Cruz Institute for Particle Physics, University of California, Santa Cruz (United States); and others

    2013-12-01

    Pixel detectors with cylindrical electrodes that penetrate the silicon substrate (so called 3D detectors) offer advantages over standard planar sensors in terms of radiation hardness, since the electrode distance is decoupled from the bulk thickness. In recent years significant progress has been made in the development of 3D sensors, which culminated in the sensor production for the ATLAS Insertable B-Layer (IBL) upgrade carried out at CNM (Barcelona, Spain) and FBK (Trento, Italy). Based on this success, the ATLAS Forward Physics (AFP) experiment has selected the 3D pixel sensor technology for the tracking detector. The AFP project presents a new challenge due to the need for a reduced dead area with respect to IBL, and the in-homogeneous nature of the radiation dose distribution in the sensor. Electrical characterization of the first AFP prototypes and beam test studies of 3D pixel devices irradiated non-uniformly are presented in this paper.

  18. Characterization of silicon 3D pixel detectors for the ATLAS Forward Physics experiment

    Energy Technology Data Exchange (ETDEWEB)

    Lopez Paz, I.; Cavallaro, E.; Lange, J. [Institut de Fisica d' Altes Energies - IFAE, 08193 Bellaterra, Barcelona (Spain); Grinstein, S. [Institut de Fisica d' Altes Energies - IFAE, 08193 Bellaterra, Barcelona (Spain); Catalan Institution for Research and Advanced Studies - ICREA, Barcelona (Spain)

    2015-07-01

    The ATLAS Forward Physics (AFP) project aims to measure protons scattered under a small angle from the pp collisions in ATLAS. In order to perform such measurements, a new silicon tracker, together with a time-of-flight detector for pile-up removal, are planned to be installed at ∼210 m from the interaction point and at 2-3 mm from the LHC proton beam. To cope with such configuration and maximize the physics outcome, the tracker has to fulfil three main requirements: endure highly non-uniform radiation doses, due to the very inhomogeneous beam profile, have slim and efficient edges to improve the acceptance of the tracker, and provide good position resolution. Recent laboratory and beam test characterization results of AFP prototypes will be presented. Slim-edged 3D pixel detectors down to 100-200 μm were studied and later non-uniformly irradiated (with a peak fluence of several 10{sup 15} n{sub eq}/cm{sup 2}) to determine the fulfilment of the AFP requirements. (authors)

  19. Pixel Vertex Detectors

    OpenAIRE

    Wermes, Norbert

    2006-01-01

    Pixel vertex detectors are THE instrument of choice for the tracking of charged particles close to the interaction point at the LHC. Hybrid pixel detectors, in which sensor and read-out IC are separate entities, constitute the present state of the art in detector technology. Three of the LHC detectors use vertex detectors based on this technology. A development period of almost 10 years has resulted in pixel detector modules which can stand the extreme rate and timing requirements as well as ...

  20. Development of a detector control system for the serially powered ATLAS pixel detector at the HL-LHC

    Energy Technology Data Exchange (ETDEWEB)

    Puellen, Lukas

    2015-02-10

    In the years around 2020 the LHC will be upgraded to the HL-LHC. In terms of this upgrade, the ATLAS detector will also be upgraded. This also includes the pixel detector, the innermost of the sub-detectors in ATLAS. Thereby the powering concept of the pixel detector will be changed to reduce the material budget of the detector. From individual powering of each detector module, the concept changes to serial powering, where all modules of a powering group are connected in series. This change makes the development of a new detector control system (DCS) mandatory. Therefore, a new concept for the ATLAS pixel DCS is being developed at the University of Wuppertal. This concept is split into three paths: a safety path, a control path, and a diagnostics path. The safety path is a hard wired interlock system. The concept of this system will not differ significantly, compared to the interlock system of the current detector. The diagnostics path is embedded into the optical data read-out of the detector and will be used for detector tuning with high precision and granularity. The control path supervises the detector and provides a user interface to the hardware components. A concept for this path, including a prototype and proof-of-principle studies, has been developed in terms of this thesis. The control path consists of the DCS network, a read-out and controlling topology created by two types of ASICs: the DCS controller and the DCS chip. These ASICs measure and control all values, necessary for a safe detector operation in situ. This reduces the number of required cables and hence the material budget of the system. For the communication between these ASICs, two very fault tolerant bus protocols have been chosen: CAN bus carries data from the DCS computers, outside of the detector, to the DCS controllers at the edge of the pixel detector. For the communication between the DCS controller and the DCS chip, which is located close to each detector module, an enhanced I2C

  1. Total Ionising Dose effects in the FE-I4 front-end chip of the ATLAS Pixel IBL detector

    CERN Document Server

    AUTHOR|(INSPIRE)INSPIRE-00439451

    2016-01-01

    The ATLAS Pixel Insertable B-Layer (IBL) detector was installed into the ATLAS experiment in 2014 and has been in operation since 2015. During the first year of data taking, an increase of the LV current, produced by the FE-I4 chip, was observed. This increase was traced back to radiation damage in the chip. The dependence of the current from the Total Ionizing Dose (TID) and temperature has been tested with X-ray irradiations. This report presents the measurement results and gives a parameterisation of the leakage current and detector operation guidelines.

  2. Characterization and Performance of Silicon n-in-p Pixel Detectors for the ATLAS Upgrades

    CERN Document Server

    Weigell, Philipp; Gallrapp, Christian; La Rosa, Alessandro; Macchiolo, Anna; Nisius, Richard; Pernegger, Heinz; Richter, Rainer

    2011-01-01

    The existing ATLAS Tracker will be at its functional limit for particle fluences of 10^15 neq/cm^2 (LHC). Thus for the upgrades at smaller radii like in the case of the planned Insertable B-Layer (IBL) and for increased LHC luminosities (super LHC) the development of new structures and materials which can cope with the resulting particle fluences is needed. N-in-p silicon devices are a promising candidate for tracking detectors to achieve these goals, since they are radiation hard, cost efficient and are not type inverted after irradiation. A n-in-p pixel production based on a MPP/HLL design and performed by CiS (Erfurt, Germany) on 300 \\mu m thick Float-Zone material is characterised and the electrical properties of sensors and single chip modules (SCM) are presented, including noise, charge collection efficiencies, and measurements with MIPs as well as an 241Am source. The SCMs are built with sensors connected to the current the ATLAS read-out chip FE-I3. The characterisation has been performed with the ATL...

  3. Simulation of the depletion voltage evolution of the ATLAS Pixel Detector

    CERN Document Server

    Beyer, Julien-christopher; The ATLAS collaboration

    2017-01-01

    The ATLAS Pixel detector has been operating since 2010 and consists of hybrid pixel modules where the sensitive elements are planar n-in-n sensors. In order to investigate and predict the evolution of the depletion voltage and of the leakage current in the different layers, a fully analytical implementation of the Hamburg model was derived. The parameters of the model, describing the dependence of the depletion voltage (U_depl) on fluence, temperature and time were tuned with a fit to the available measurements of Udepl in the last years of operation. A particular emphasis is put on the B-Layer, where the highest fluence has been accumulated up to now. A precise input of temperature and radiation dose is generated from the on-module temperature monitoring and the luminosity data. The analysis is then also extended to the Insertable B-Layer (IBL), installed at the end of Run-1, where we expect the fastest evolution of the radiation damage with luminosity, due to its closer position to the interaction point. Di...

  4. High-voltage pixel detectors in commercial CMOS technologies for ATLAS, CLIC and Mu3e experiments

    CERN Document Server

    Peric, Ivan; Backhaus, Malte; Barbero, Marlon; Benoit, Mathieu; Berger, Niklaus; Bompard, Frederic; Breugnon, Patrick; Clemens, Jean-Claude; Dannheim, Dominik; Dierlamm, Alexander; Feigl, Simon; Fischer, Peter; Fougeron, Denis; Garcia-Sciveres, Maurice; Heim, Timon; Hügging, Fabian; Kiehn, Moritz; Kreidl, Christian; Krüger, Hans; La Rosa, Alessandro; Liu, Jian; Lütticke, Florian; Mariñas, Carlos; Meng, Lingxin; Miucci, Antonio; Münstermann, Daniel; Nguyen, Hong Hanh; Obermann, Theresa; Pangaud, Patrick; Perrevoort, Ann-Kathrin; Rozanov, Alexandre; Schöning, André; Schwenker, Benjamin; Wiedner, Dirk

    2013-01-01

    High-voltage particle detectors in commercial CMOS technologies are a detector family that allows implementation of low-cost, thin and radiation-tolerant detectors with a high time resolution. In the R/D phase of the development, a radiation tolerance of 10 15 n eq = cm 2 , nearly 100% detection ef fi ciency and a spatial resolution of about 3 μ m were demonstrated. Since 2011 the HV detectors have fi rst applications: the technology is presently the main option for the pixel detector of the planned Mu3e experiment at PSI (Switzerland). Several prototype sensors have been designed in a standard 180 nm HV CMOS process and successfully tested. Thanks to its high radiation tolerance, the HV detectors are also seen at CERN as a promising alternative to the standard options for ATLAS upgrade and CLIC. In order to test the concept, within ATLAS upgrade R/D, we are currently exploring an active pixel detector demonstrator HV2FEI4; also implemented in the 180 nm HV process

  5. High-voltage pixel detectors in commercial CMOS technologies for ATLAS, CLIC and Mu3e experiments

    CERN Document Server

    Peric,I et al.

    2013-01-01

    High-voltage particle detectors in commercial CMOS technologies are a detector family that allows implementation of low-cost, thin and radiation-tolerant detectors with a high time resolution. In the R/D phase of the development, a radiation tolerance of 1015 neq=cm2 , nearly 100% detection efficiency and a spatial resolution of about 3 μm were demonstrated. Since 2011 the HV detectors have first applications: the technology is presently the main option for the pixel detector of the planned Mu3e experiment at PSI (Switzerland). Several prototype sensors have been designed in a standard 180 nm HV CMOS process and successfully tested. Thanks to its high radiation tolerance, the HV detectors are also seen at CERN as a promising alternative to the standard options for ATLAS upgrade and CLIC. In order to test the concept, within ATLAS upgrade R/D, we are currently exploring an active pixel detector demonstrator HV2FEI4; also implemented in the 180 nm HV process.

  6. FE-I4 Chip Development for Upgraded ATLAS Pixel Detector at LHC

    CERN Document Server

    Barbero, M; The ATLAS collaboration

    2010-01-01

    A new ATLAS pixel chip FE-I4 has been developed for use in upgraded LHC luminosity environments, including the near-term Insertable B-Layer upgrade. FE-I4 is designed in a 130 nm CMOS technology, presenting advantages in terms of radiation tolerance and digital logic density compared to the 0.25 μm CMOS technology used for the current ATLAS pixel IC, FE-I3. FE-I4 architecture is based on an array of 80×336 pixels, each 50×250 μm2, consisting of analog and digital sections. The analog pixel section is designed for low power consumption and compatibility to several sensor candidates. It is based on a two-stage architecture with a pre-amp AC-coupled to a second stage of amplification. It features leakage current compensation circuitry, local 4-bit pre-amp feedback tuning and a discriminator locally adjusted through 5 configuration bits. The digital architecture is based on a 4-pixel unit called Pixel Digital Region (PDR) allowing for local storage of hits in 5-deep data buffers at pixel level for the duratio...

  7. The upgraded Pixel Detector of the ATLAS Experiment for Run-II at the Large Hadron Collider

    CERN Document Server

    AUTHOR|(INSPIRE)INSPIRE-00407702

    2016-01-01

    The Pixel Detector of the ATLAS experiment has shown excellent performance during the whole Run-1 of the LHC. Taking advantage of the detector development period 2013 – 2014, the detector was extracted from the experiment and brought to surface to equip it with new service panels and to repair modules furthermore this helped with the installation of the Insertable B-Layer (IBL), fourth layer of pixel, installed in between the existing Pixel Detector and a new beam-pipe at a radius of 3.3 cm. To cope with the high radiation and increased pixel occupancy due to the proximity to the interaction point, two different silicon sensor technologies (planar and 3D) have been used. A new readout chip has been designed with CMOS 130nm technology with larger area, smaller pixel size and faster readout capability. Dedicated design features in combination with a new composite material were considered and used in order to reduce the material budget of the support structure while keeping the optimal thermo-mechanical perfor...

  8. The upgraded Pixel detector and the commissioning of the Inner Detector tracking of the ATLAS experiment for Run-2 at the Large Hadron Collider

    CERN Document Server

    AUTHOR|(INSPIRE)INSPIRE-00019188; The ATLAS collaboration

    2016-01-01

    Run-2 of the Large Hadron Collider (LHC) will provide new challenges to track and vertex reconstruction with higher energies, denser jets and higher rates. Therefore the ATLAS experiment has constructed the first 4-layer Pixel detector in HEP, installing a new Pixel layer, also called Insertable B-Layer (IBL). The IBL is a fourth layer of pixel detectors, and has been installed in May 2014 at a radius of 3.3 cm between the existing Pixel Detector and a new smaller radius beam-pipe. The new detector, built to cope with the high radiation and expected occupancy, is the first large scale application of 3D detectors and CMOS 130~nm technology. In addition, the Pixel detector was refurbished with a new service quarter panel to recover about 3% of defective modules lost during Run-1 and a new optical readout system to readout the data at higher speed while reducing the occupancy when running with increased luminosity. Complementing detector improvements, many improvements to Inner Detector track and vertex reconstr...

  9. Qualification measurements of the voltage supply system as well as conceptionation of a state machine for the detector control of the ATLAS pixel detector; Qualifizierungsmessungen des Spannungsversorgungssystems sowie Konzeptionierung einer Zustandsmaschine fuer die Detektorkontrolle des ATLAS-Pixeldetektors

    Energy Technology Data Exchange (ETDEWEB)

    Schultes, Joachim

    2007-02-15

    The supply system and the control system of the ATLAS pixel detector represent important building blocks of the pixel detector. Corresponding studies of the supply system, which were performed within a comprehensive test system, the so-called system test, with nearly all final components and the effects on the pixel detector are object of this thesis. A further point of this thesis is the coordination and further development of the detector-control-system software under regardment of the different partial systems. A main topic represents thereby the conceptionation of the required state machine as interface for the users and the connection to the data acquisition system.

  10. The ATLAS Silicon Pixel Sensors

    CERN Document Server

    Alam, M S; Einsweiler, K F; Emes, J; Gilchriese, M G D; Joshi, A; Kleinfelder, S A; Marchesini, R; McCormack, F; Milgrome, O; Palaio, N; Pengg, F; Richardson, J; Zizka, G; Ackers, M; Andreazza, A; Comes, G; Fischer, P; Keil, M; Klasen, V; Kühl, T; Meuser, S; Ockenfels, W; Raith, B; Treis, J; Wermes, N; Gössling, C; Hügging, F G; Wüstenfeld, J; Wunstorf, R; Barberis, D; Beccherle, R; Darbo, G; Gagliardi, G; Gemme, C; Morettini, P; Musico, P; Osculati, B; Parodi, F; Rossi, L; Blanquart, L; Breugnon, P; Calvet, D; Clemens, J-C; Delpierre, P A; Hallewell, G D; Laugier, D; Mouthuy, T; Rozanov, A; Valin, I; Aleppo, M; Caccia, M; Ragusa, F; Troncon, C; Lutz, Gerhard; Richter, R H; Rohe, T; Brandl, A; Gorfine, G; Hoeferkamp, M; Seidel, SC; Boyd, GR; Skubic, P L; Sícho, P; Tomasek, L; Vrba, V; Holder, M; Ziolkowski, M; D'Auria, S; del Papa, C; Charles, E; Fasching, D; Becks, K H; Lenzen, G; Linder, C

    2001-01-01

    Prototype sensors for the ATLAS silicon pixel detector have been developed. The design of the sensors is guided by the need to operate them in the severe LHC radiation environment at up to several hundred volts while maintaining a good signal-to-noise ratio, small cell size, and minimal multiple scattering. The ability to be operated under full bias for electrical characterization prior to the attachment of the readout integrated circuit electronics is also desired.

  11. Measurements and TCAD simulation of novel ATLAS planar pixel detector structures for the HL-LHC upgrade

    CERN Document Server

    INSPIRE-00304438; Gkougkousis, E.; Lounis, A.

    2015-01-01

    The LHC accelerator complex will be upgraded between 2020-2022, to the High-Luminosity-LHC, to considerably increase statistics for the various physics analyses. To operate under these challenging new conditions, and maintain excellent performance in track reconstruction and vertex location, the ATLAS pixel detector must be substantially upgraded and a full replacement is expected. Processing techniques for novel pixel designs are optimised through characterisation of test structures in a clean room and also through simulations with Technology Computer Aided Design (TCAD). A method to study non-perpendicular tracks through a pixel device is discussed. Comparison of TCAD simulations with Secondary Ion Mass Spectrometry (SIMS) measurements to investigate the doping profile of structures and validate the simulation process is also presented.

  12. Chip development in 65 nm CMOS technology for the high luminosity upgrade of the ATLAS pixel detector

    Energy Technology Data Exchange (ETDEWEB)

    Germic, Leonard; Hemperek, Tomasz; Kishishita, Tetsuichi; Krueger, Hans; Rymaszewski, Piotr; Wermes, Norbert [University of Bonn, Bonn (Germany)

    2016-07-01

    The LHC High Luminosity upgrade will result in a significant change of environment in which particle detectors are going to operate, especially for devices very close to the interaction point like pixel detector electronics. Challenges arising from the increased hit rate will have to be solved by designing faster and more complex readout electronics that will also have to withstand unprecedented radiation doses. Developing such integrated circuit requires a significant R and D effort and resources, therefore a joint development project between several institutes (including ours) was started. This collaboration, named RD53, aims to develop a pixel readout chip suitable for ATLAS' and CMS' upgrades using a 65nm CMOS technology. During this presentation motivations and benefits of using this very deep-submicron technology are discussed. Most of the talk is allocated to presenting some of the circuits designed by our group (focusing on developments connected to RD53 collaboration), along with their performance measurement results.

  13. The pixelated detector

    CERN Multimedia

    Sutton, C

    1990-01-01

    "Collecting data as patterns of light or subatomic particles is vitally important in all the sciences. The new generation of solid-state detectors called pixel devices could transform experimental research at all levels" (4 pages).

  14. Performance and description of the upgraded readout with the new back-end electronics for the ATLAS Pixel detector

    CERN Document Server

    Yajima, Kazuki; The ATLAS collaboration

    2017-01-01

    LHC increased drastically its performance during the RUN2 data taking, starting from a peak instantaneous luminosity of up to $5\\times10^{33} \\mathrm{cm}^{-2} \\mathrm{s}^{-1}$ in 2015 to conclude with the record value of $1.4\\times10^{34} \\mathrm{cm}^{-2} \\mathrm{s}^{-1}$ in November 2016. The concurrent increase of the trigger rate and event size forced the ATLAS experiment to exploit its sub-detectors to the maximum, approaching and possibly overcoming the design parameters. The ATLAS Pixel data acquisition system was upgraded to avoid possible bandwidth limitations. Two upgrades of the read-out electronics have been done. The first one during 2015/16 YETS, when the outermost pixel layer (Layer-2) was upgraded and its bandwidth was doubled. This upgrade partly contributed to maintain the data taking efficiency of the Pixel detector at a relatively high level ($\\sim$99%) during the 2016 run. A similar upgrade of the read-out system for the middle layer (Layer-1) is ongoing during 2016/17 EYETS. The details o...

  15. Pixel detector readout chip

    CERN Multimedia

    1991-01-01

    Close-up of a pixel detector readout chip. The photograph shows an aera of 1 mm x 2 mm containing 12 separate readout channels. The entire chip contains 1000 readout channels (around 80 000 transistors) covering a sensitive area of 8 mm x 5 mm. The chip has been mounted on a silicon detector to detect high energy particles.

  16. Fluorocarbon evaporative cooling developments for the ATLAS pixel and semiconductor tracking detectors

    CERN Document Server

    Anderssen, E; Berry, S; Bonneau, P; Bosteels, Michel; Bouvier, P; Cragg, D; English, R; Godlewski, J; Górski, B; Grohmann, S; Hallewell, G D; Hayler, T; Ilie, S; Jones, T; Kadlec, J; Lindsay, S; Miller, W; Niinikoski, T O; Olcese, M; Olszowska, J; Payne, B; Pilling, A; Perrin, E; Sandaker, H; Seytre, J F; Thadome, J; Vacek, V

    1999-01-01

    Heat transfer coefficients 2-5.103 Wm-2K-1 have been measured in a 3.6 mm I.D. heated tube dissipating 100 Watts - close to the full equivalent power (~110 W) of a barrel SCT detector "stave" - over a range of power dissipations and mass flows in the above fluids. Aspects of full-scale evaporative cooling circulator design for the ATLAS experiment are discussed, together with plans for future development.

  17. Studies on irradiated pixel detectors for the ATLAS IBL and HL-LHC upgrade

    CERN Document Server

    AUTHOR|(INSPIRE)INSPIRE-00371978; Gößling, Claus; Pernegger, Heinz

    The constant demand for higher luminosity in high energy physics is the reason for the continuous effort to adapt the accelerators and the experiments. The upgrade program for the experiments and the accelerators at CERN already includes several expansion stages of the Large Hadron Collider (LHC) which will increase the luminosity and the energy of the accelerator. Simultaneously the LHC experiments prepare the individual sub-detectors for the increasing demands in the coming years. Especially the tracking detectors have to cope with fluence levels unprecedented for high energy physics experiments. Correspondingly to the fluence increases the impact of the radiation damage which reduces the life time of the detectors by decreasing the detector performance and efficiency. To cope with this effect new and more radiation hard detector concepts become necessary to extend the life time. This work concentrates on the impact of radiation damage on the pixel sensor technologies to be used in the next upgrade of the ...

  18. High speed data transmission on small gauge cables for the ATLAS Phase-II Pixel detector upgrade

    Science.gov (United States)

    Shahinian, J.; Volk, J.; Fadeyev, V.; Grillo, A. A.; Meimban, B.; Nielsen, J.; Wilder, M.

    2016-03-01

    The High Luminosity LHC will present a number of challenges for the upgraded ATLAS detector. In particular, data transmission requirements for the upgrade of the ATLAS Pixel detector will be difficult to meet. The expected trigger rate and occupancy imply multi-gigabit per second transmission rates will be required but radiation levels at the smallest radius preclude completely optical solutions. Electrical transmission up to distances of 7m will be necessary to move optical components to an area with lower radiation levels. Here, we explore the use of small gauge electrical cables as a high-bandwidth, radiation hard solution with a sufficiently small radiation length. In particular, we present a characterization of various twisted wire pair (TWP) configurations of various material structures, including measurements of their bandwidth, crosstalk, and radiation hardness. We find that a custom ``hybrid'' cable consisting of 1m of a multi-stranded TWP with Poly-Ether-Ether-Ketone (PEEK) insulation and a thin Al shield followed by 6m of a thin twin-axial cable presents a low-mass solution that fulfills bandwidth requirements and is expected to be sufficiently radiation hard. Additionally, we discuss preliminary results of using measured S-parameters to produce a SPICE model for a 1m sample of the custom TWP to be used for the development of new pixel readout chips.

  19. Development of pixel detectors for the IBL and HL-LHC ATLAS experiment upgrade

    CERN Document Server

    Baselga Bacardit, Marta

    2016-03-18

    This thesis presents the development of advanced silicon technology detectors fabricated at CNM-Barcelona for High Energy Physics (HEP) experiments. The pixel size of the tracking silicon detectors for the upgrade of the HL-LHC will have to decrease in size in order to enhance the resolution in position for the measurements and they need to have lower occupancy for the electronics. The future experiments at CERN will cope with fuences up to 2 x 10^^16 neq/cm2, and the smaller 3D silicon detectors will have less trapping of the electron-holes generated in the bulk leading to a better performance under high radiation environment. This thesis studies silicon detectors fabricated at CNM-Barcelona applied to HEP experiments with two different kinds of novel technologies: 3D and Low Gain Avalanche Detectors (LGAD). The 3D detectors make it possible to reduce the size of the depleted region inside the detector and to work at lower voltages, whereas the LGAD detectors have an intrinsic gain which increases the collec...

  20. Ultra-light and stable composite structure to support and cool the ATLAS pixel detector barrel electronics modules

    CERN Document Server

    Olcese, M; Castiglioni, G; Cereseto, R; Cuneo, S; Dameri, M; Gemme, C; Glitza, K W; Lenzen, G; Mora, F; Netchaeva, P; Ockenfels, W; Piano, E; Pizzorno, C; Puppo, R; Rebora, A; Rossi, L; Thadome, J; Vernocchi, F; Vigeolas, E; Vinci, A

    2004-01-01

    The design of an ultra light structure, the so-called "stave", to support and cool the sensitive elements of the Barrel Pixel detector, the innermost part of the ATLAS detector to be installed on the new Large Hadron Collider at CERN (Geneva), is presented. Very high- dimensional stability, minimization of the material and ability of operating 10 years in a high radiation environment are the key design requirements. The proposed solution consists of a combination of different carbon-based materials (impregnated carbon-carbon, ultra high modulus carbon fibre composites) coupled to a thin aluminum tube to form a very light support with an integrated cooling channel. Our design has proven to successfully fulfil the requirements. The extensive prototyping and testing program to fully qualify the design and release the production are discussed.

  1. ALICE Silicon Pixel Detector

    CERN Multimedia

    Manzari, V

    2013-01-01

    The Silicon Pixel Detector (SPD) forms the innermost two layers of the 6-layer barrel Inner Tracking System (ITS). The SPD plays a key role in the determination of the position of the primary collision and in the reconstruction of the secondary vertices from particle decays.

  2. Pixel detector insertion

    CERN Multimedia

    CMS

    2015-01-01

    Insertion of the Pixel Tracker, the 66-million-channel device used to pinpoint the vertex of each colliding proton pair, located at the heart of the detector. The geometry of CMS is a cylinder lying on its side (22 meters long and 15 meters high in dia

  3. Pixel readout chip for the ATLAS experiment

    CERN Document Server

    Ackers, M; Blanquart, L; Bonzom, V; Comes, G; Fischer, P; Keil, M; Kühl, T; Meuser, S; Delpierre, P A; Treis, J; Raith, B A; Wermes, N

    1999-01-01

    Pixel detectors with a high granularity and a very large number of sensitive elements (cells) are a very recent development used for high precision particle detection. At the Large Hadron Collider LHC at CERN (Geneva) a pixel detector with 1.4*10/sup 8/ individual pixel cells is developed for the ATLAS detector. The concept is a hybrid detector. Consisting of a pixel sensor connected to a pixel electronics chip by bump and flip chip technology in one-to-one cell correspondence. The development and prototype results of the pixel front end chip are presented together with the physical and technical requirements to be met at LHC. Lab measurements are reported. (6 refs).

  4. Preliminary results of 3D-DDTC pixel detectors for the ATLAS upgrade

    CERN Document Server

    La Rosa, Alessandro; Dalla Betta, G F; Darbo, G; Gemme, C; Pernegger, H; Piemonte, C; Povoli, M; Ronchin, S; Zoboli, A; Zorzi, N; Bolle, E; Borri, M; Da Via, C; Dong, S; Fazio, S; Grenier, P; Grinstein, S; Gjersdal, H; Hansson, P; Huegging, F; Jackson, P; Kocian, M; Rivero, F; Rohne, O; Sandaker, H; Sjobak, K; Slavicek, T; Tsung, W; Tsybychev, D; Wermes, N; Young, C

    2009-01-01

    3D Silicon sensors fabricated at FBK-irst with the Double-side Double Type Column (DDTC) approach and columnar electrodes only partially etched through p-type substrates were tested in laboratory and in a 1.35 Tesla magnetic field with a 180GeV pion beam at CERN SPS. The substrate thickness of the sensors is about 200um, and different column depths are available, with overlaps between junction columns (etched from the front side) and ohmic columns (etched from the back side) in the range from 110um to 150um. The devices under test were bump bonded to the ATLAS Pixel readout chip (FEI3) at SELEX SI (Rome, Italy). We report leakage current and noise measurements, results of functional tests with Am241 gamma-ray sources, charge collection tests with Sr90 beta-source and an overview of preliminary results from the CERN beam test.

  5. Preliminary Results of 3D-DDTC Pixel Detectors for the ATLAS Upgrade

    Energy Technology Data Exchange (ETDEWEB)

    La Rosa, Alessandro; /CERN; Boscardin, M.; /Fond. Bruno Kessler, Povo; Dalla Betta, G.-F.; /Trento U. /INFN, Trento; Darbo, G.; Gemme, C.; /INFN, Genoa; Pernegger, H.; /CERN; Piemonte, C.; /Fond. Bruno Kessler, Povo; Povoli, M.; /Trento U. /INFN, Trento; Ronchin, S.; /Fond. Bruno Kessler, Povo; Zoboli, A.; /Trento U. /INFN, Trento; Zorzi, N.; /Fond. Bruno Kessler, Povo; Bolle, E.; /Oslo U.; Borri, M.; /INFN, Turin /Turin U.; Da Via, C.; /Manchester U.; Dong, S.; /SLAC; Fazio, S.; /Calabria U.; Grenier, P.; /SLAC; Grinstein, S.; /Barcelona, IFAE; Gjersdal, H.; /Oslo U.; Hansson, P.; /SLAC; Huegging, F.; /Bonn U. /SLAC /INFN, Turin /Turin U. /Oslo U. /Bergen U. /Oslo U. /Prague, Tech. U. /Bonn U. /SUNY, Stony Brook /Bonn U. /SLAC

    2012-04-04

    3D Silicon sensors fabricated at FBK-irst with the Double-side Double Type Column (DDTC) approach and columnar electrodes only partially etched through p-type substrates were tested in laboratory and in a 1.35 Tesla magnetic field with a 180 GeV pion beam at CERN SPS. The substrate thickness of the sensors is about 200 {mu}m, and different column depths are available, with overlaps between junction columns (etched from the front side) and ohmic columns (etched from the back side) in the range from 110 {mu}m to 150 {mu}m. The devices under test were bump bonded to the ATLAS Pixel readout chip (FEI3) at SELEX SI (Rome, Italy). We report leakage current and noise measurements, results of functional tests with Am{sup 241} {gamma}-ray sources, charge collection tests with Sr90 {beta}-source and an overview of preliminary results from the CERN beam test.

  6. Three Generations of FPGA DAQ Development for the ATLAS Pixel Detector

    CERN Document Server

    AUTHOR|(CDS)2091916; Hsu, Shih-Chieh; Hauck, Scott Alan

    The Large Hadron Collider (LHC) at the European Center for Nuclear Research (CERN) tracks a schedule of long physics runs, followed by periods of inactivity known as Long Shutdowns (LS). During these LS phases both the LHC, and the experiments around its ring, undergo maintenance and upgrades. For the LHC these upgrades improve their ability to create data for physicists; the more data the LHC can create the more opportunities there are for rare events to appear that physicists will be interested in. The experiments upgrade so they can record the data and ensure the event won’t be missed. Currently the LHC is in Run 2 having completed the first LS of three. This thesis focuses on the development of Field-Programmable Gate Array (FPGA)-based readout systems that span across three major tasks of the ATLAS Pixel data acquisition (DAQ) system. The evolution of Pixel DAQ’s Readout Driver (ROD) card is presented. Starting from improvements made to the new Insertable B-Layer (IBL) ROD design, which was part of t...

  7. Modelling semiconductor pixel detectors

    CERN Document Server

    Mathieson, K

    2001-01-01

    expected after 200 ps in most cases. The effect of reducing the charge carrier lifetime and examining the charge collection efficiency has been utilised to explore how these detectors would respond in a harsh radiation environment. It is predicted that over critical carrier lifetimes (10 ps to 0.1 ns) an improvement of 40 % over conventional detectors can be expected. This also has positive implications for fabricating detectors, in this geometry, from materials which might otherwise be considered substandard. An analysis of charge transport in CdZnTe pixel detectors has been performed. The analysis starts with simulation studies into the formation of contacts and their influence on the internal electric field of planar detectors. The models include a number of well known defect states and these are balanced to give an agreement with a typical experimental I-V curve. The charge transport study extends to the development of a method for studying the effect of charge sharing in highly pixellated detectors. The ...

  8. Performance of the Insertable B-Layer for the ATLAS Pixel Detector during Quality Assurance and a Novel Pixel Detector Readout Concept based on PCIe

    CERN Document Server

    AUTHOR|(INSPIRE)INSPIRE-00356268; Pernegger, Heinz

    2016-07-27

    During the first long shutdown of the LHC the Pixel detector has been upgraded with a new 4th innermost layer, the Insertable B-Layer (IBL). The IBL will increase the tracking performance and help with higher than nominal luminosity the LHC will produce. The IBL is made up of 14 staves and in total 20 staves have been produced for the IBL. This thesis presents the results of the final quality tests performed on these staves in an detector-like environment, in order to select the 14 best of the 20 staves for integration onto the detector. The test setup as well as the testing procedure is introduced and typical results of each testing stage are shown and discussed. The overall performance of all staves is presented in regards to: tuning performance, radioactive source measurements, and number of failing pixels. Other measurement, which did not directly impact the selection of staves, but will be important for the operation of the detector or production of a future detector, are included. Based on the experienc...

  9. 3D silicon sensors: Design, large area production and quality assurance for the ATLAS IBL pixel detector upgrade

    Energy Technology Data Exchange (ETDEWEB)

    Da Via, Cinzia [School of Physics and Astronomy, University of Manchester, Oxford Road, Manchester, M13 9PL (United Kingdom); Boscardin, Maurizio [Fondazione Bruno Kessler, FBK-CMM, Via Sommarive 18, I-38123 Trento (Italy); Dalla Betta, Gian-Franco, E-mail: dallabe@disi.unitn.it [DISI, Universita degli Studi di Trento and INFN, Via Sommarive 14, I-38123 Trento (Italy); Darbo, Giovanni [INFN Sezione di Genova, Via Dodecaneso 33, I-14146 Genova (Italy); Fleta, Celeste [Centro Nacional de Microelectronica, CNM-IMB (CSIC), Barcelona E-08193 (Spain); Gemme, Claudia [INFN Sezione di Genova, Via Dodecaneso 33, I-14146 Genova (Italy); Grenier, Philippe [SLAC National Accelerator Laboratory, 2575 Sand Hill Road, Menlo Park, CA 94025 (United States); Grinstein, Sebastian [Institut de Fisica d' Altes Energies (IFAE) and ICREA, Universitat Autonoma de Barcelona (UAB), E-08193 Bellaterra, Barcelona (Spain); Hansen, Thor-Erik [SINTEF MiNaLab, Blindern, N-0314 Oslo (Norway); Hasi, Jasmine; Kenney, Chris [SLAC National Accelerator Laboratory, 2575 Sand Hill Road, Menlo Park, CA 94025 (United States); Kok, Angela [SINTEF MiNaLab, Blindern, N-0314 Oslo (Norway); Parker, Sherwood [University of Hawaii, c/o Lawrence Berkeley Laboratory, Berkeley, CA 94720 (United States); Pellegrini, Giulio [Centro Nacional de Microelectronica, CNM-IMB (CSIC), Barcelona E-08193 (Spain); Vianello, Elisa; Zorzi, Nicola [Fondazione Bruno Kessler, FBK-CMM, Via Sommarive 18, I-38123 Trento (Italy)

    2012-12-01

    3D silicon sensors, where electrodes penetrate the silicon substrate fully or partially, have successfully been fabricated in different processing facilities in Europe and USA. The key to 3D fabrication is the use of plasma micro-machining to etch narrow deep vertical openings allowing dopants to be diffused in and form electrodes of pin junctions. Similar openings can be used at the sensor's edge to reduce the perimeter's dead volume to as low as {approx}4 {mu}m. Since 2009 four industrial partners of the 3D ATLAS R and D Collaboration started a joint effort aimed at one common design and compatible processing strategy for the production of 3D sensors for the LHC Upgrade and in particular for the ATLAS pixel Insertable B-Layer (IBL). In this project, aimed for installation in 2013, a new layer will be inserted as close as 3.4 cm from the proton beams inside the existing pixel layers of the ATLAS experiment. The detector proximity to the interaction point will therefore require new radiation hard technologies for both sensors and front end electronics. The latter, called FE-I4, is processed at IBM and is the biggest front end of this kind ever designed with a surface of {approx}4 cm{sup 2}. The performance of 3D devices from several wafers was evaluated before and after bump-bonding. Key design aspects, device fabrication plans and quality assurance tests during the 3D sensors prototyping phase are discussed in this paper.

  10. Opto-box: Optical modules and mini-crate for ATLAS pixel and IBL detectors

    Science.gov (United States)

    Bertsche, David

    2016-11-01

    The opto-box is a custom mini-crate for housing optical modules which process and transfer optoelectronic data. Many novel solutions were developed for the custom design and manufacturing. The system tightly integrates electrical, mechanical, and thermal functionality into a small package of size 35×10x8 cm3. Special attention was given to ensure proper shielding, grounding, cooling, high reliability, and environmental tolerance. The custom modules, which incorporate Application Specific Integrated Circuits, were developed through a cycle of rigorous testing and redesign. In total, fourteen opto-boxes have been installed and loaded with modules on the ATLAS detector. They are currently in operation as part of the LHC run 2 data read-out chain. This conference proceeding is in support of the poster presented at the International Conference on New Frontiers in Physics (ICNFP) 2015 [1].

  11. Opto-box: Optical modules and mini-crate for ATLAS pixel and IBL detectors

    Directory of Open Access Journals (Sweden)

    Bertsche David

    2016-01-01

    Full Text Available The opto-box is a custom mini-crate for housing optical modules which process and transfer optoelectronic data. Many novel solutions were developed for the custom design and manufacturing. The system tightly integrates electrical, mechanical, and thermal functionality into a small package of size 35×10x8 cm3. Special attention was given to ensure proper shielding, grounding, cooling, high reliability, and environmental tolerance. The custom modules, which incorporate Application Specific Integrated Circuits, were developed through a cycle of rigorous testing and redesign. In total, fourteen opto-boxes have been installed and loaded with modules on the ATLAS detector. They are currently in operation as part of the LHC run 2 data read-out chain. This conference proceeding is in support of the poster presented at the International Conference on New Frontiers in Physics (ICNFP 2015 [1].

  12. Beam Test Studies of 3D Pixel Sensors Irradiated Non-Uniformly for the ATLAS Forward Physics Detector

    Science.gov (United States)

    2013-02-21

    removal of pile up protons. The AFP tracker unit will consist of an array of six pixel sensors placed at 2-3 mm from the Large Hadron Collider (LHC...Experiment at the CERN Large Hadron Collider ”, JINST 3 S08003 (2008). [2] The ATLAS Collaboration, “Letter of Intent for the Phase-I Upgrade of the ATLAS

  13. ATLAS Pixel Opto-Electronics

    CERN Document Server

    Arms, K E; Gan, K K; Holder, M; Jackson, P; Johnson, M; Kagan, H; Kass, R; Rahimi, A M; Roggenbuck, A; Rush, C; Schade, P; Smith, S; Ter-Antonian, R; Ziolkowski, M; Zoeller, M M

    2005-01-01

    We have developed two radiation-hard ASICs for optical data transmission in the ATLAS pixel detector at the LHC at CERN: a driver chip for a Vertical Cavity Surface Emitting Laser (VCSEL) diode for 80 Mbit/s data transmission from the detector, and a Bi-Phase Mark decoder chip to recover the control data and 40 MHz clock received optically by a PIN diode. We have successfully implemented both ASICs in 0.25 micron CMOS technology using enclosed layout transistors and guard rings for increased radiation hardness. We present results of the performance of these chips, including irradiation with 24 GeV protons up to 61 Mrad (2.3 x 10e15 p/cm^2).

  14. Alpine Pixel Detector Layout

    CERN Document Server

    Delebecque, P; The ATLAS collaboration; Geffroy, N; Massol, N; Rambure, T; Todorov, T

    2013-01-01

    A description of an optimized layout of pixel sensors based on a stave that combines both barrel and endcap module orientations. The mechanical stiffness of the structure is provided by carbon fiber shells spaced by carbon foam. The cooling of the modules is provided by two-phase $CO_{2}$ flowing in a thin titanium pipe glued inside the carbon fiber foam. The electrical services of all modules are provided by a single stave flex. This layout eliminates the need for separate barrel and endcap detector structures, and therefore the barrel services material in front of the endcap. The transition from barrel to endcap module orientation is optimized separately for each layer in order to minimize the active pixel area and the traversed material. The sparse module spacing in the endcap part of the stave allows for multiple fixation points, and for a stiff overall structure composed only of staves interconnected by stiff disks.

  15. ATLAS Tracker and Pixel Operational Experience

    CERN Document Server

    AUTHOR|(INSPIRE)INSPIRE-00222525; The ATLAS collaboration

    2016-01-01

    The tracking performance of the ATLAS detector relies critically on the silicon and gaseous tracking subsystems that form the ATLAS Inner Detector. Those subsystems have undergone significant hardware and software upgrades to meet the challenges imposed by the higher collision energy, pileup and luminosity that are being delivered by the LHC during Run2. The key status and performance metrics of the Pixel Detector and the Semi Conductor Tracker, are summarised, and the operational experience and requirements to ensure optimum data quality and data taking efficiency are described.

  16. Pixelated gamma detector

    Energy Technology Data Exchange (ETDEWEB)

    Dolinsky, Sergei Ivanovich; Yanoff, Brian David; Guida, Renato; Ivan, Adrian

    2016-12-27

    A pixelated gamma detector includes a scintillator column assembly having scintillator crystals and optical transparent elements alternating along a longitudinal axis, a collimator assembly having longitudinal walls separated by collimator septum, the collimator septum spaced apart to form collimator channels, the scintillator column assembly positioned adjacent to the collimator assembly so that the respective ones of the scintillator crystal are positioned adjacent to respective ones of the collimator channels, the respective ones of the optical transparent element are positioned adjacent to respective ones of the collimator septum, and a first photosensor and a second photosensor, the first and the second photosensor each connected to an opposing end of the scintillator column assembly. A system and a method for inspecting and/or detecting defects in an interior of an object are also disclosed.

  17. Analog front-end cell designed in a commercial 025 mu m process for the ATLAS pixel detector at LHC

    CERN Document Server

    Blanquart, L; Comes, G; Denes, P; Einsweiler, Kevin F; Fischer, P; Mandelli, E; Meddeler, G; Peric, I; Richardson, J

    2002-01-01

    A new analog pixel front-end cell has been developed for the ATLAS detector at the future Large Hadron Collider (LHC) at the European Laboratory for Particle Physics (CERN). This analog cell has been submitted in two commercial 0.25 mu m CMOS processes (in an analog test chip format), using special layout techniques for radiation hardness purposes. It is composed of two cascaded amplifiers followed by a fast discriminator featuring a detection threshold within the range of 1000 to 10000 electrons. The first preamplifier has the principal role of providing a large bandwidth, low input impedance, and fast rise time in order to enhance the time-walk and crosstalk performance, whereas the second fully differential amplifier is aimed at delivering a sufficiently high-voltage gain for optimum comparison. A new do feedback concept renders the cell tolerant of sensor leakage current up to 300 nA and provides monitoring of this current. Two 5-bit digital-to-analog converters tolerant to single- event upset have been i...

  18. ATLAS Pixel IBL: Stave Quality Assurance

    CERN Document Server

    The ATLAS collaboration

    2014-01-01

    For Run 2 of the LHC a fourth innermost Pixel Detector layer on a smaller radius beam pipe has been installed in the ATLAS Detector to add redundancy against radiation damage of the current Pixel Detector and to ensure a high quality tracking and b-tagging performance of the Inner Detector over the coming years until the High Luminosity Upgrade. State of the art components have been produced and assembled onto support structures known as staves over the last two years. In total, 20 staves have been built and qualified in a designated Quality Assurance setup at CERN of which 14 have been integrated onto the beam pipe. Results from the testing are presented.

  19. Simulation study of pixel detector charge digitization

    Science.gov (United States)

    Wang, Fuyue; Nachman, Benjamin; Sciveres, Maurice; Lawrence Berkeley National Laboratory Team

    2017-01-01

    Reconstruction of tracks from nearly overlapping particles, called Tracking in Dense Environments (TIDE), is an increasingly important component of many physics analyses at the Large Hadron Collider as signatures involving highly boosted jets are investigated. TIDE makes use of the charge distribution inside a pixel cluster to resolve tracks that share one of more of their pixel detector hits. In practice, the pixel charge is discretized using the Time-over-Threshold (ToT) technique. More charge information is better for discrimination, but more challenging for designing and operating the detector. A model of the silicon pixels has been developed in order to study the impact of the precision of the digitized charge distribution on distinguishing multi-particle clusters. The output of the GEANT4-based simulation is used to train neutral networks that predict the multiplicity and location of particles depositing energy inside one cluster of pixels. By studying the multi-particle cluster identification efficiency and position resolution, we quantify the trade-off between the number of ToT bits and low-level tracking inputs. As both ATLAS and CMS are designing upgraded detectors, this work provides guidance for the pixel module designs to meet TIDE needs. Work funded by the China Scholarship Council and the Office of High Energy Physics of the U.S. Department of Energy under contract DE-AC02-05CH11231.

  20. Submission of the first full scale prototype chip for upgraded ATLAS pixel detector at LHC, FE-I4A

    Energy Technology Data Exchange (ETDEWEB)

    Barbero, Marlon, E-mail: barbero@physik.uni-bonn.de [Physikalisches Institut Universitaet Bonn, Nussallee 12, 53115 Bonn (Germany); Arutinov, David [Physikalisches Institut Universitaet Bonn, Nussallee 12, 53115 Bonn (Germany); Beccherle, Roberto; Darbo, Giovanni [INFN Genova, via Dodecaseno 33, IT-16146 Genova (Italy); Dube, Sourabh; Elledge, David; Fleury, Julien [Lawrence Berkeley National Laboratory, 1 Cyclotron Road, CA 94720 (United States); Fougeron, Denis [CPPM Aix-Marseille Universite, CNRS/IN2P3, Marseille (France); Garcia-Sciveres, Maurice [Lawrence Berkeley National Laboratory, 1 Cyclotron Road, CA 94720 (United States); Gensolen, Fabrice [CPPM Aix-Marseille Universite, CNRS/IN2P3, Marseille (France); Gnani, Dario [Lawrence Berkeley National Laboratory, 1 Cyclotron Road, CA 94720 (United States); Gromov, Vladimir [NIKHEF, Science Park 105, 1098 XG Amsterdam (Netherlands); Jensen, Frank [Lawrence Berkeley National Laboratory, 1 Cyclotron Road, CA 94720 (United States); Hemperek, Tomasz; Karagounis, Michael [Physikalisches Institut Universitaet Bonn, Nussallee 12, 53115 Bonn (Germany); Kluit, Ruud [NIKHEF, Science Park 105, 1098 XG Amsterdam (Netherlands); Kruth, Andre [Physikalisches Institut Universitaet Bonn, Nussallee 12, 53115 Bonn (Germany); Mekkaoui, Abderrezak [Lawrence Berkeley National Laboratory, 1 Cyclotron Road, CA 94720 (United States); Menouni, Mohsine [CPPM Aix-Marseille Universite, CNRS/IN2P3, Marseille (France); Schipper, Jan David [NIKHEF, Science Park 105, 1098 XG Amsterdam (Netherlands); and others

    2011-09-11

    A new ATLAS pixel chip FE-I4 is being developed for use in upgraded LHC luminosity environments, including the near-term Insertable B-Layer (IBL) upgrade. FE-I4 is designed in a 130 nm CMOS technology, presenting advantages in terms of radiation tolerance and digital logic density compared to the 0.25{mu}m CMOS technology used for the current ATLAS pixel IC, FE-I3. The FE-I4 architecture is based on an array of 80x336 pixels, each 50x250{mu}m{sup 2}, consisting of analog and digital sections. In the summer 2010, a first full scale prototype FE-I4A was submitted for an engineering run. This IC features the full scale pixel array as well as the complex periphery of the future full-size FE-I4. The FE-I4A contains also various extra test features which should prove very useful for the chip characterization, but deviate from the needs for standard operation of the final FE-I4 for IBL. In this paper, focus will be brought to the various features implemented in the FE-I4A submission, while also underlining the main differences between the FE-I4A IC and the final FE-I4 as envisioned for IBL.

  1. VNR CMS Pixel detector replacement

    CERN Multimedia

    2017-01-01

    Joel Butler, spokesperson of the CMS collaboration explains how a team from many different partner institutes installed a new detector in CMS. This detector is the silicon pixel detector and they’ve been working on it for about five years, to replace one of our existing detectors. This detectors measures particles closer to the beam than any of the other components of this huge detector behind me. It gives us the most precise picture of tracks as they come out of the collisions and expand and travel through the detector. This particular device has twice as many pixels, 120 million, as opposed to about 68 million in the old detector and it can take data faster and pump it out to the analysis more quickly. 00’53’’ Images of the descent, insertion and installation of first piece of the Pixel detector on Tue Feb 28. Images of the descent, insertion and installation of second piece of the Pixel and the two cylinders being joined.

  2. Irradiation and beam tests qualification for ATLAS IBL Pixel Modules.

    CERN Document Server

    Rubinskiy, Igor; The ATLAS collaboration

    2011-01-01

    The upgrade for the ATLAS detector will undergo different phases towards HL-LHC. The first upgrade for the Pixel Detector will consist in the construction of a new pixel layer which will be installed during the first shutdown of the LHC machine (foreseen for 2013-14). The new detector, called Insertable B-Layer (IBL), will be inserted between the existing pixel detector and a new (smaller radius) beam-pipe at a radius of 3.2 cm. The IBL will require the development of several new technologies to cope with increase of radiation or pixel occupancy and also to improve the physics performance which will be achieved by reduction of the pixel size and of the material budget. Two different promising Silicon sensor technologies (Planar n-in-n and 3D) are currently under investigation for the pixel detector. An overview of the sensor technologies qualification with particular emphasis on irradiation and beam tests will be presented.

  3. Irradiation and beam tests qualification for ATLAS IBL Pixel Modules

    CERN Document Server

    Rubinskiy, I

    2013-01-01

    The upgrade for the ATLAS detector will have different steps towards HL-LHC. The first upgrade for the Pixel Detector will consist in the construction of a new pixel layer which will be installed during the first shutdown of the LHC machine (foreseen for 2013–2014). The new detector, called Insertable B-Layer (IBL), will be inserted between the existing Pixel Detector and a new (smaller radius) beam-pipe at a radius of 33 mm. The IBL will require the development of several new technologies to cope with the increase in the radiation damage and the pixel occupancy and also to improve the physics performance, which will be achieved by reduction of the pixel size and of the material budget. Two different promising silicon sensor technologies (Planar n-in-n and 3D) are currently under investigation for the Pixel Detector. An overview of the sensor technologies' qualification with particular emphasis on irradiation and beam tests is presented.

  4. Irradiation and beam tests qualification for ATLAS IBL Pixel Modules

    CERN Document Server

    Rubinskiy, Igor

    2013-01-01

    The upgrade for the ATLAS detector will have different steps towards HL-LHC. The first upgrade for the Pixel Detector will consist in the construction of a new pixel layer which will be installed during the first shutdown of the LHC machine (foreseen for 2013-14). The new detector, called Insertable B-Layer (IBL), will be inserted between the existing pixel detector and a new (smaller radius) beam-pipe at a radius of 33 mm. The IBL will require the development of several new technologies to cope with the increase of the radiation damage and the pixel occupancy and also to improve the physics performance, which will be achieved by reduction of the pixel size and of the material budget. Two different promising silicon sensor technologies (Planar n-in-n and 3D) are currently under investigation for the pixel detector. An overview of the sensor technologies’ qualification with particular emphasis on irradiation and beam tests are presented.

  5. Chip development in 65 nm CMOS technology for the high luminosity upgrade of the ATLAS pixel detector

    Energy Technology Data Exchange (ETDEWEB)

    Germic, Leonard; Hemperek, Tomasz; Kishishita, Testsuichi; Krueger, Hans; Rymaszewski, Piotr; Wermes, Norbert [University of Bonn, Bonn (Germany); Havranek, Miroslav [University of Bonn, Bonn (Germany); Institute of Physics of the Academy of Sciences, Prague (Czech Republic)

    2015-07-01

    The LHC High Luminosity upgrade will result in a significant change of environment in which particle detectors are going to operate, especially for devices very close to the interaction point like pixel detector electronics. Challenges coming from the higher hit rate will have to be solved by designing faster and more complex circuits, while at the same time keeping in mind very high radiation hardness requirements. Therefore matching the specification set by the high luminosity upgrade requires a large R and D effort. Our group is participating in such a joint development * namely the RD53 collaboration * which goal is to design a new pixel chip using an advanced 65 nm CMOS technology. During this presentation motivations and benefits of using this very deep-submicron technology will be shown together with a comparison with older technologies (130 nm, 250 nm). Most of the talk is allocated to presenting some of the circuits designed by our group, along with their performance measurement results.

  6. The ALICE pixel detector

    CERN Document Server

    Mercado Perez, J

    2002-01-01

    The present document is a brief summary of the performed activities during the 2001 Summer Student Programme at CERN under the Scientific Summer at Foreign Laboratories Program organized by the Particles and Fields Division of the Mexican Physical Society (Sociedad Mexicana de Fisica). In this case, the activities were related with the ALICE Pixel Group of the EP-AIT Division, under the supervision of Jeroen van Hunen, research fellow in this group. First, I give an introduction and overview to the ALICE experiment; followed by a description of wafer probing. A brief summary of the test beam that we had from July 13th to July 25th is given as well. (3 refs).

  7. The ALICE pixel detector upgrade

    Science.gov (United States)

    Reidt, F.

    2016-12-01

    The ALICE experiment at the CERN LHC is designed to study the physics of strongly interacting matter, and in particular the properties of the Quark-Gluon Plasma, using proton-proton, proton-nucleus and nucleus-nucleus collisions. The ALICE collaboration is preparing a major upgrade of the experimental apparatus to be installed during the second long LHC shutdown in the years 2019-2020. A key element of the ALICE upgrade is the new, ultra-light, high-resolution Inner Tracking System. With respect to the current detector, the new Inner Tracking System will significantly enhance the pointing resolution, the tracking efficiency at low transverse momenta, and the read-out rate capabilities. This will be obtained by seven concentric detector layers based on a Monolithic Active Pixel Sensor with a pixel pitch of about 30×30 μm2. A key feature of the new Inner Tracking System, which is optimised for high tracking accuracy at low transverse momenta, is the very low mass of the three innermost layers, which feature a material budget of 0.3% X0 per layer. This contribution presents the design goals and layout of the upgraded ALICE Inner Tracking System, summarises the R&D activities focussing on the technical implementation of the main detector components, and the projected detector performance.

  8. Design and implementation of an expert system for the detector control systems of the ATLAS pixel detector; Entwurf und Implementation eines Expertensystems fuer das Detektorkontrollsystem des ATLAS-Pixeldetektors

    Energy Technology Data Exchange (ETDEWEB)

    Henss, Tobias

    2008-12-15

    In the framework of this thesis an expert system ''Pixel-Advisor'' for the control system of the pixel detector was designed and implemented. This supports the operational personnel in the diagnosis and removal of possible problems, which are in connection with the detector control system and unburdens the few available DCS experts.

  9. Performance of silicon pixel detectors at small track incidence angles

    CERN Document Server

    Viel, Simon; The ATLAS collaboration

    2015-01-01

    In order to enable the ATLAS experiment to successfully track charged particles produced in high-energy collisions at the High-Luminosity Large Hadron Collider, the current ATLAS Inner Detector will be replaced by the Inner Tracker (ITk), entirely composed of silicon pixel and strip detectors. An extension of the tracking coverage of ITk to very forward pseudorapidity values is proposed, using pixel modules placed in a long cylindrical layer around the beam pipe. The measurement of long pixel clusters, detected when charged particles cross the silicon sensor at small incidence angles, has potential to significantly improve the tracking efficiency, fake track rejection, and resolution of ITk in the very forward region. The performance of state-of-the-art pixel modules at small track incidence angles is studied using test beam data collected at SLAC and CERN, as well as simulated data.

  10. Diamond and silicon pixel detectors in high radiation environments

    Energy Technology Data Exchange (ETDEWEB)

    Tsung, Jieh-Wen

    2012-10-15

    Diamond pixel detector is a promising candidate for tracking of collider experiments because of the good radiation tolerance of diamond. The diamond pixel detector must withstand the radiation damage from 10{sup 16} particles per cm{sup 2}, which is the expected total fluence in High Luminosity Large Hadron Collider. The performance of diamond and silicon pixel detectors are evaluated in this research in terms of the signal-to-noise ratio (SNR). Single-crystal diamond pixel detectors with the most recent readout chip ATLAS FE-I4 are produced and characterized. Based on the results of the measurement, the SNR of diamond pixel detector is evaluated as a function of radiation fluence, and compared to that of planar-silicon ones. The deterioration of signal due to radiation damage is formulated using the mean free path of charge carriers in the sensor. The noise from the pixel readout circuit is simulated and calculated with leakage current and input capacitance to the amplifier as important parameters. The measured SNR shows good agreement with the calculated and simulated results, proving that the performance of diamond pixel detectors can exceed the silicon ones if the particle fluence is more than 10{sup 15} particles per cm{sup 2}.

  11. The Phase-2 ATLAS ITk Pixel Upgrade

    CERN Document Server

    Flick, Tobias; The ATLAS collaboration

    2016-01-01

    The entire tracking system of the ATLAS experiment will be replaced during the LHC Phase II shutdown (foreseen to take place around 2025) by an all-silicon detector called the “ITk” (Inner Tracker). The pixel detector will comprise the five innermost layers, and will be instrumented with new sensor and readout electronics technologies to improve the tracking performance and cope with the HL-LHC environment, which will be severe in terms of occupancy and radiation. The total surface area of silicon in the new pixel system could measure up to 14 m2, depending on the final layout choice, which is expected to take place in early 2017. Four layout options are being investigated at the moment, two with forward coverage to |eta| < 3.2 and two to |eta| < 4. For each coverage option, a layout with long barrel staves and a layout with novel inclined support structures in the barrel-endcap overlap region are considered. All potential layouts include modules mounted on ring-shaped supports in the endcap regions...

  12. The Phase II ATLAS ITk Pixel Upgrade

    CERN Document Server

    Terzo, Stefano; The ATLAS collaboration

    2017-01-01

    The entire tracking system of the ATLAS experiment will be replaced during the LHC Phase II shutdown (foreseen to take place around 2025) by an all-silicon detector called the "ITk" (Inner Tracker). The innermost portion of ITk will consist of a pixel detector with five layers in the barrel region and and ring-shaped supports in the endcap regions. It will be instrumented with new sensor and readout electronics technologies to improve the tracking performance and cope with the HL-LHC environment, which will be severe in terms of occupancy and radiation. The total surface area of silicon in the new pixel system could measure up to 14 m$^2$ , depending on the final layout choice, which is expected to take place in early 2017. Several layout options are being investigated at the moment, including some with novel inclined support structures in the barrel-endcap overlap region and others with very long innermost barrel layers. Forward coverage could be as high as $|\\eta| < 4$. Supporting structures will be ...

  13. R&D for the local support structure and cooling channel for the ATLAS PIXEL Detector Insertable B-Layer (IBL)

    CERN Document Server

    Coelli, S; The ATLAS collaboration

    2010-01-01

    ABSTRACT: The scope of the present R&D is to develop an innovative support, with an integrated cooling and based on carbon composites, for the electronic sensors of the Silicon Pixel Tracker, to be installed into the ATLAS Experiment on the Large Hadron Collider at CERN. The inner layer of the detector is installed immediately outside the Beryllium beam pipe at a distance of 50 mm from the Interaction Point, where the high energy protons collide: the intense radiation field induce a radiation damage on the sensors so that a cooling system is necessary to remove the electrical power dissipated as heat, maintaining the sensor temperature sufficiently low. The task of the support system is to hold the detector modules in positions with high accuracy, minimizing the deformation induced by the cooling; this must be done with the lower possible mass because there are tight requirements in terms of material budget. An evaporative boiling system to remove the power dissipated by the sensors is incorporated in the...

  14. Robustness of the ATLAS pixel clustering neural network algorithm

    CERN Document Server

    AUTHOR|(INSPIRE)INSPIRE-00407780; The ATLAS collaboration

    2016-01-01

    Proton-proton collisions at the energy frontier puts strong constraints on track reconstruction algorithms. In the ATLAS track reconstruction algorithm, an artificial neural network is utilised to identify and split clusters of neighbouring read-out elements in the ATLAS pixel detector created by multiple charged particles. The robustness of the neural network algorithm is presented, probing its sensitivity to uncertainties in the detector conditions. The robustness is studied by evaluating the stability of the algorithm's performance under a range of variations in the inputs to the neural networks. Within reasonable variation magnitudes, the neural networks prove to be robust to most variation types.

  15. Pixelated CdZnTe drift detectors

    DEFF Research Database (Denmark)

    Kuvvetli, Irfan; Budtz-Jørgensen, Carl

    2005-01-01

    A technique, the so-called Drift Strip Method (DSM), for improving the CdZnTe detector energy response to hard X-rays and gamma-rays was applied as a pixel geometry. First tests have confirmed that this detector type provides excellent energy resolution and imaging performance. We specifically...... report on the performance of 3 mm thick prototype CZT drift pixel detectors fabricated using material from eV-products. We discuss issues associated with detector module performance. Characterization results obtained from several prototype drift pixel detectors are presented. Results of position...

  16. CVD diamond pixel detectors for LHC experiments

    Energy Technology Data Exchange (ETDEWEB)

    Wedenig, R.; Adam, W.; Bauer, C.; Berdermann, E.; Bergonzo, P.; Bogani, F.; Borchi, E.; Brambilla, A.; Bruzzi, M.; Colledani, C.; Conway, J.; Dabrowski, W.; Delpierre, P.; Deneuville, A.; Dulinski, W.; Eijk, B. van; Fallou, A.; Fizzotti, F.; Foulon, F.; Friedl, M.; Gan, K.K.; Gheeraert, E.; Grigoriev, E.; Hallewell, G.; Hall-Wilton, R.; Han, S.; Hartjes, F.; Hrubec, J.; Husson, D.; Kagan, H.; Kania, D.; Kaplon, J.; Karl, C.; Kass, R.; Knoepfle, K.T.; Krammer, M.; Logiudice, A.; Lu, R.; Manfredi, P.F.; Manfredotti, C.; Marshall, R.D.; Meier, D.; Mishina, M.; Oh, A.; Pan, L.S.; Palmieri, V.G.; Pernicka, M.; Peitz, A.; Pirollo, S.; Polesello, P.; Pretzl, K.; Procario, M.; Re, V.; Riester, J.L.; Roe, S.; Roff, D.; Rudge, A.; Runolfsson, O.; Russ, J.; Schnetzer, S.; Sciortino, S.; Speziali, V.; Stelzer, H.; Stone, R.; Suter, B.; Tapper, R.J.; Tesarek, R.; Trawick, M.; Trischuk, W.; Vittone, E.; Wagner, A.; Walsh, A.M.; Weilhammer, P.; White, C.; Zeuner, W.; Ziock, H.; Zoeller, M.; Blanquart, L.; Breugnion, P.; Charles, E.; Ciocio, A.; Clemens, J.C.; Dao, K.; Einsweiler, K.; Fasching, D.; Fischer, P.; Joshi, A.; Keil, M.; Klasen, V.; Kleinfelder, S.; Laugier, D.; Meuser, S.; Milgrome, O.; Mouthuy, T.; Richardson, J.; Sinervo, P.; Treis, J.; Wermes, N

    1999-08-01

    This paper reviews the development of CVD diamond pixel detectors. The preparation of the diamond pixel sensors for bump-bonding to the pixel readout electronics for the LHC and the results from beam tests carried out at CERN are described.

  17. ATLAS Inner Detector Alignment

    CERN Document Server

    Bocci, A

    2008-01-01

    The ATLAS experiment is a multi-purpose particle detector that will study high-energy particle collisions produced by the Large Hadron Collider at CERN. In order to achieve its physics goals, the ATLAS tracking requires that the positions of the silicon detector elements have to be known to a precision better than 10 μm. Several track-based alignment algorithms have been developed for the Inner Detector. An extensive validation has been performed with simulated events and real data coming from the ATLAS. Results from such validation are reported in this paper.

  18. ATLAS Fact Sheet : To raise awareness of the ATLAS detector and collaboration on the LHC

    CERN Multimedia

    ATLAS Outreach

    2010-01-01

    Facts on the Detector, Calorimeters, Muon System, Inner Detector, Pixel Detector, Semiconductor Tracker, Transition Radiation Tracker,, Surface hall, Cavern, Detector, Magnet system, Solenoid, Toroid, Event rates, Physics processes, Supersymmetric particles, Comparing LHC with Cosmic rays, Heavy ion collisions, Trigger and Data Acquisition TDAQ, Computing, the LHC and the ATLAS collaboration. This fact sheet also contains images of ATLAS and the collaboration as well as a short list of videos on ATLAS available for viewing.

  19. Robustness of the ATLAS pixel clustering neural network algorithm

    CERN Document Server

    Sidebo, Per Edvin; The ATLAS collaboration

    2016-01-01

    Proton-proton collisions at the energy frontier puts strong constraints on track reconstruction algorithms. The algorithms depend heavily on accurate estimation of the position of particles as they traverse the inner detector elements. An artificial neural network algorithm is utilised to identify and split clusters of neighbouring read-out elements in the ATLAS pixel detector created by multiple charged particles. The method recovers otherwise lost tracks in dense environments where particles are separated by distances comparable to the size of the detector read-out elements. Such environments are highly relevant for LHC run 2, e.g. in searches for heavy resonances. Within the scope of run 2 track reconstruction performance and upgrades, the robustness of the neural network algorithm will be presented. The robustness has been studied by evaluating the stability of the algorithm’s performance under a range of variations in the pixel detector conditions.

  20. Module and electronics developments for the ATLAS ITK pixel system

    CERN Document Server

    Nellist, Clara; The ATLAS collaboration

    2016-01-01

    Summary ATLAS is preparing for an extensive modification of its detector in the course of the planned HL‐ LHC accelerator upgrade around 2025 which includes a replacement of the entire tracking system by an all‐silicon detector (Inner Tracker, ITk). A revised trigger and data taking system is foreseen with triggers expected at lowest level at an average rate of 1 MHz. The five innermost layers of ITk will comprise of a pixel detector built of new sensor and readout electronics technologies to improve the tracking performance and cope with the severe HL‐LHC environment in terms of occupancy and radiation. The total area of the new pixel system could measure up to 14 m2, depending on the final layout choice that is expected to take place in early 2017. A new on‐detector readout chip is designed in the context of the RD53 collaboration in 65 nm CMOS technology. This paper will present the on‐going R&D within the ATLAS ITK project towards the new pixel modules and the off‐detector electronics. Pla...

  1. Development of SOI pixel detector in Cracow

    CERN Document Server

    Bugiel, Szymon; Glab, Sebastian; Idzik, Marek; Moron, Jakub; Kapusta, Piotr Julian; Kucewicz, Wojciech; Turala, Michal

    2015-01-01

    This paper presents the design of a new monolithic Silicon-On-Insulator pixel sensor in $200~nm$ SOI CMOS technology. The main application of the proposed pixel detector is the spectroscopy, but it can also be used for the minimum ionizing particle (MIP) tracking in particle physics experiments. For this reason few different versions of pixel cells are developed: a source-follower based pixel for tracking, a low noise pixel with preamplifier for spectroscopy, and a self-triggering pixel for time and amplitude measurements. In addition the design of a Successive Approximation Register Analog-to-Digital Converter (SAR ADC) is also presented. A 10-bit SAR ADC is developed for spectroscopic measurements and a lower resolution 6-bit SAR ADC is integrated in the pixel matrix as a column ADC, for tracking applications.

  2. Multi-chip module development for the ATLAS pixel detector. Analysis of the front-end chip electronics in radiation hard 0.25-{mu}m technology as well as development and realization of a serial power concept; Multi-Chip-Modul-Entwicklung fuer den ATLAS-Pixeldetektor. Analyse der Front-End-Chip-Elektronik in strahlenharter0,25-{mu}m-Technologie sowie Entwicklung und Realisierung eines Serial-Powering-Konzeptes

    Energy Technology Data Exchange (ETDEWEB)

    Stockmanns, T.

    2004-08-01

    The innermost layer of the ATLAS tracking system is a silicon pixel detector. The use of radiation tolerant components is mandatory due to the harsh radiation environment. The smallest independent component of the pixel detector is a hybride pixel module consisting of a large oxygen enriched silicon sensor and 16 specifically developed ASICs. To achieve the necessary radiation tolerance the ASICs are produced in a 0.25 {mu}m technology in combination with special design techniques. The measurements of the readout electronics during all stages of production of a full module are presented and the performance of the modules is compared with the strict requirements of the ATLAS pixel detector. Furthermore a new powering scheme for pixel detectors is presented, aiming at reducing the total power consumption, the material for the electrical services and the amount of power cables. The advantages and disadvantages of this concept are discussed on the example of the ATLAS pixel detector with pixel modules modified accounting to the new powering scheme. The performance of six of those modules operating at the same time in a small system test is compared to that of normal ATLAS pixel modules. (orig.)

  3. Development of a Micro Pixel Chamber for the ATLAS Upgrade

    CERN Document Server

    Ochi, Atsuhiko; Komai, Hidetoshi; Edo, Yuki; Yamaguchi, Takahiro

    2012-01-01

    The Micro Pixel Chamber (μ-PIC) is being developed a sacandidate for the muon system of the ATLAS detector for upgrading in LHC experiments. The μ-PIC is a micro-pattern gaseous detector that doesn’t have floating structure such as wires, mesh, or foil. This detector can be made by printed-circuit-board (PCB) technology, which is commercially available and suited for mass production. Operation tests have been performed under high flux neutrons under similar conditions to the ATLAS cavern. Spark rates are measured using several gas mixtures under 7 MeV neutron irradiation, and good properties were observed using neon, ethane, and CF4 mixture of gases.Using resistive materials as electrodes, we are also developing a new μ-PIC, which is not expected to damage the electrodes in the case of discharge sparks.

  4. LISe pixel detector for neutron imaging

    Science.gov (United States)

    Herrera, Elan; Hamm, Daniel; Wiggins, Brenden; Milburn, Rob; Burger, Arnold; Bilheux, Hassina; Santodonato, Louis; Chvala, Ondrej; Stowe, Ashley; Lukosi, Eric

    2016-10-01

    Semiconducting lithium indium diselenide, 6LiInSe2 or LISe, has promising characteristics for neutron detection applications. The 95% isotopic enrichment of 6Li results in a highly efficient thermal neutron-sensitive material. In this study, we report on a proof-of-principle investigation of a semiconducting LISe pixel detector to demonstrate its potential as an efficient neutron imager. The LISe pixel detector had a 4×4 of pixels with a 550 μm pitch on a 5×5×0.56 mm3 LISe substrate. An experimentally verified spatial resolution of 300 μm was observed utilizing a super-sampling technique.

  5. Pixel detectors from fundamentals to applications

    CERN Document Server

    Rossi, Leonardo; Rohe, Tilman; Wermes, Norbert

    2006-01-01

    Pixel detectors are a particularly important class of particle and radiation detection devices. They have an extremely broad spectrum of applications, ranging from high-energy physics to the photo cameras of everyday life. This book is a general purpose introduction into the fundamental principles of pixel detector technology and semiconductor-based hybrid pixel devices. Although these devices were developed for high-energy ionizing particles and radiation beyond visible light, they are finding new applications in many other areas. This book will therefore benefit all scientists and engineers working in any laboratory involved in developing or using particle detection.

  6. Optimization of the thermal performances of the Alpine Pixel Detector

    CERN Document Server

    Zhang, Zhan; Di Ciaccio, Lucia

    The ATLAS (A Toroidal LHC ApparatuS) detector is the largest detector of the Large Hadron Collider (LHC). One of the most important goals of ATLAS was to search for the missing piece of the Standard Model, the Higgs boson that had been found in 2012. In order to keep looking for the unknowns, it is planned to upgrade the LHC. The High Luminosity LHC (HL-LHC) is a novel configuration of the accelerator, aiming at increasing the luminosity by a factor five or more above the nominal LHC design. In parallel with the accelerator upgrade also the ATLAS will be upgraded to cope with detector aging and to achieve the same or better performance under increased event rate and radiation dose expected at the HL-LHC. This thesis discusses a novel design for the ATLAS Pixel Detector called the "Alpine" layout for the HL-LHC. To support this design, a local support structure is proposed, optimized and tested with an advanced CO2 evaporative cooling system. A numerical program called “CoBra” simulating the twophase heat ...

  7. ATLAS Phase-II-Upgrade Pixel Data Transmission Development

    CERN Document Server

    Wensing, Marius; The ATLAS collaboration

    2016-01-01

    The ATLAS tracking system will be replaced by an all-silicon detector (ITk) in the course of the planned HL-LHC accelerator upgrade around 2025. The readout of the ITk pixel system will be most challenging in terms of data rate and readout speed. Simulation of the on-detector electronics based on the currently foreseen trigger rate of 1 MHz indicate that a readout speed of up to 5 Gbps per data link is necessary. Due to radiation levels, the first part of transmission has to be implemented electrically. System simulation and test results of cable candidates will be presented.

  8. The alignment of the ATLAS Inner Detector in Run 2

    CERN Document Server

    Ripellino, Giulia; The ATLAS collaboration

    2016-01-01

    The ATLAS reconstruction of charged particle trajectories relies on the Inner Detector tracking system. The accuracy of the reconstruction is limited by the finite resolution of the detector elements and the imperfect knowledge about their positions. A precise alignment of the detector is therefore essential. Here, the strategy and the status of the Inner Detector alignment in ATLAS during the LHC Run 2 are presented and the alignment challenges related to the distortion of the new innermost Pixel layer, the IBL, are discussed.

  9. Operational Experience with the CMS Pixel Detector

    CERN Document Server

    Karancsi, Janos

    2016-01-01

    The CMS pixel detector was repaired successfully, calibrated and commissioned for the second run of Large Hadron Collider during the first long shutdown between 2013 and 2015. The replaced pixel modules were calibrated separately and show the expected behavior of an un-irradiated detector. In 2015, the system performed very well with an even improved spatial resolution compared to 2012. During this time, the operational team faced various challenges including the loss of a sector in one half shell which was only partially recovered. In 2016, the detector is expected to withstand instantaneous luminosities beyond the design limits and will need a combined effort of both online and offline teams in order to provide the high quality data that is required to reach the physics goals of CMS. We present the operational experience gained during the second run of the LHC and show the latest performance results of the CMS pixel detector.

  10. ATLAS Forward Detectors and Physics

    CERN Document Server

    Soni, N

    2010-01-01

    In this communication I describe the ATLAS forward physics program and the detectors, LUCID, ZDC and ALFA that have been designed to meet this experimental challenge. In addition to their primary role in the determination of ATLAS luminosity these detectors - in conjunction with the main ATLAS detector - will be used to study soft QCD and diffractive physics in the initial low luminosity phase of ATLAS running. Finally, I will briefly describe the ATLAS Forward Proton (AFP) project that currently represents the future of the ATLAS forward physics program.

  11. Towards spark-proof gaseous pixel detectors

    Science.gov (United States)

    Tsigaridas, S.; Beuzekom, M. v.; Chan, H. W.; Graaf, H. v. d.; Hartjes, F.; Heijhoff, K.; Hessey, N. P.; Prodanovic, V.

    2016-11-01

    The micro-pattern gaseous pixel detector, is a promising technology for imaging and particle tracking applications. It is a combination of a gas layer acting as detection medium and a CMOS pixelated readout-chip. As a prevention against discharges we deposit a protection layer on the chip and then integrate on top a micromegas-like amplification structure. With this technology we are able to reconstruct 3D track segments of particles passing through the gas thanks to the functionality of the chip. We have turned a Timepix3 chip into a gaseous pixel detector and tested it at the SPS at Cern. The preliminary results are promising and within the expectations. However, the spark protection layer needs further improvement to make reliable detectors. For this reason, we have created a setup for spark-testing. We present the first results obtained from the lab-measurements along with preliminary results from the testbeam.

  12. Anode readout for pixellated CZT detectors

    Science.gov (United States)

    Narita, Tomohiko; Grindlay, Jonathan E.; Hong, Jaesub; Niestemski, Francis C.

    2004-02-01

    Determination of the photon interaction depth offers numerous advantages for an astronomical hard X-ray telescope. The interaction depth is typically derived from two signals: anode and cathode, or collecting and non-collecting electrodes. We present some preliminary results from our depth sensing detectors using only the anode pixel signals. By examining several anode pixel signals simultaneously, we find that we can estimate the interaction depth, and get sub-pixel 2-D position resolution. We discuss our findings and the requirements for future ASIC development.

  13. Diamond Pixel Detectors and 3D Diamond Devices

    Science.gov (United States)

    Venturi, N.

    2016-12-01

    Results from detectors of poly-crystalline chemical vapour deposited (pCVD) diamond are presented. These include the first analysis of data of the ATLAS Diamond Beam Monitor (DBM). The DBM module consists of pCVD diamond sensors instrumented with pixellated FE-I4 front-end electronics. Six diamond telescopes, each with three modules, are placed symmetrically around the ATLAS interaction point. The DBM tracking capabilities allow it to discriminate between particles coming from the interaction point and background particles passing through the ATLAS detector. Also, analysis of test beam data of pCVD DBM modules are presented. A new low threshold tuning algorithm based on noise occupancy was developed which increases the DBM module signal to noise ratio significantly. Finally first results from prototypes of a novel detector using pCVD diamond and resistive electrodes in the bulk, forming a 3D diamond device, are discussed. 3D devices based on pCVD diamond were successfully tested with test beams at CERN. The measured charge is compared to that of a strip detector mounted on the same pCVD diamond showing that the 3D device collects significantly more charge than the planar device.

  14. Proceedings of PIXEL98 -- International pixel detector workshop

    Energy Technology Data Exchange (ETDEWEB)

    Anderson, D.F.; Kwan, S. [eds.

    1998-08-01

    Experiments around the globe face new challenges of more precision in the face of higher interaction rates, greater track densities, and higher radiation doses, as they look for rarer and rarer processes, leading many to incorporate pixelated solid-state detectors into their plans. The highest-readout rate devices require new technologies for implementation. This workshop reviewed recent, significant progress in meeting these technical challenges. Participants presented many new results; many of them from the weeks--even days--just before the workshop. Brand new at this workshop were results on cryogenic operation of radiation-damaged silicon detectors (dubbed the Lazarus effect). Other new work included a diamond sensor with 280-micron collection distance; new results on breakdown in p-type silicon detectors; testing of the latest versions of read-out chip and interconnection designs; and the radiation hardness of deep-submicron processes.

  15. ATLAS Pixel-Optoboard Production and Simulation Studies

    CERN Document Server

    Nderitu, Simon

    At CERN, a Large collider will collide protons at high energies. There are four experiments being built to study the particle properties from the collision. The ATLAS experiment is the largest. It has many sub detectors among which is the Pixel detector which is the innermost part. The Pixel detector has eighty million channels that have to be read out. An optical link is utilized for the read out. It has optical to electronic interfaces both on the detector and off the detector at the counting room. The component on the detector in called the opto-board. This work discusses the production testing of the opto-boards to be installed on the detector. A total of 300 opto-boards including spares have been produced. The production was done in three laboratories among which is the laboratory at the University of Wuppertal which had the responsibility of Post production testing of all the one third of the total opto-boards. The results are discussed in this work. The analysis of the results from the total productio...

  16. Recent results of the ATLAS Upgrade Planar Pixel Sensors R&D Project

    CERN Document Server

    AUTHOR|(CDS)2073610

    2011-01-01

    The ATLAS detector has to undergo significant updates at the end of the current decade, in order to withstand the increased occupancy and radiation damage that will be produced by the high-luminosity upgrade of the Large Hadron Collider. In this presentation we give an overview of the recent accomplishments of the R&D activity on the planar pixel sensors for the ATLAS Inner Detector upgrade.

  17. Module and Electronics Developments for the ATLAS ITK Pixel System

    CERN Document Server

    Nellist, Clara; The ATLAS collaboration

    2016-01-01

    ATLAS is preparing for an extensive modification of its detector in the course of the planned HL-LHC accelerator upgrade around 2025 which includes a replacement of the entire tracking system by an all-silicon detector (Inner Tracker, ITk). The five innermost layers of ITk will comprise of a pixel detector built of new sensor and readout electronics technologies to improve the tracking performance and cope with the severe HL-LHC environment in terms of occupancy and radiation. The total area of the new pixel system could measure up to 14 m$^{2}$, depending on the final layout choice that is expected to take place in early 2017. An intense R\\&D activity is taking place in the field of planar, 3D, CMOS sensors to identify the optimal technology for the different pixel layers. In parallel various sensor-chip interconnection options are explored to identify reliable technologies when employing 100-150~$\\mu$m thin chips. While the new read-out chip is being developed by the RD53 Collaboration, the pixel off de...

  18. Module and Electronics Developments for the ATLAS ITK Pixel System

    CERN Document Server

    Rummler, Andr{e}; The ATLAS collaboration

    2016-01-01

    The entire tracking system of the ATLAS experiment will be replaced during the LHC Phase II shutdown around 2025 by an all-silicon detector (Inner Tracker, ITk). The pixel detector will be composed by the five innermost layers, instrumented with new sensor and readout electronics technologies to improve the tracking performance and cope with the severe HL-LHC environment in terms of occupancy and radiation. The total area of the new pixel system could measure up to 14 m^2, depending on the final layout choice that is expected to take place in early 2017. Different designs of planar, 3D, CMOS sensors are being investigated to identify the optimal technology for the different pixel layers. In parallel sensor-chip interconnection options are evaluated in collaboration with industrial partners to identify reliable technologies when employing 100-150 μm thin chips. While the new read-out chip is being developed by the RD53 Collaboration, the pixel off detector read-out electronics will be implemented in the frame...

  19. ATLAS Detector Upgrade Prospects

    Science.gov (United States)

    Dobre, M.; ATLAS Collaboration

    2017-01-01

    After the successful operation at the centre-of-mass energies of 7 and 8 TeV in 2010-2012, the LHC was ramped up and successfully took data at the centre-of-mass energies of 13 TeV in 2015 and 2016. Meanwhile, plans are actively advancing for a series of upgrades of the accelerator, culminating roughly ten years from now in the high-luminosity LHC (HL-LHC) project, which will deliver of the order of five times the LHC nominal instantaneous luminosity along with luminosity levelling. The ultimate goal is to extend the dataset from about few hundred fb ‑1 expected for LHC running by the end of 2018 to 3000 fb ‑1 by around 2035 for ATLAS and CMS. The challenge of coping with the HL-LHC instantaneous and integrated luminosity, along with the associated radiation levels, requires further major changes to the ATLAS detector. The designs are developing rapidly for a new all-silicon tracker, significant upgrades of the calorimeter and muon systems, as well as improved triggers and data acquisition. ATLAS is also examining potential benefits of extensions to larger pseudorapidity, particularly in tracking and muon systems. This report summarizes various improvements to the ATLAS detector required to cope with the anticipated evolution of the LHC luminosity during this decade and the next. A brief overview is also given on physics prospects with a pp centre-of-mass energy of 14 TeV.

  20. Sensor development for the CMS pixel detector

    CERN Document Server

    Bölla, G; Horisberger, R P; Kaufmann, R; Rohe, T; Roy, A

    2002-01-01

    The CMS experiment which is currently under construction at the Large Hadron Collider (LHC) at CERN (Geneva, Switzerland) will contain a pixel detector which provides in its final configuration three space points per track close to the interaction point of the colliding beams. Because of the harsh radiation environment of the LHC, the technical realization of the pixel detector is extremely challenging. The readout chip as the most damageable part of the system is believed to survive a particle fluence of 6x10 sup 1 sup 4 n sub e sub q /cm sup 2 (All fluences are normalized to 1 MeV neutrons and therefore all components of the hybrid pixel detector have to perform well up to at least this fluence. As this requires a partially depleted operation of the silicon sensors after irradiation-induced type inversion of the substrate, an ''n in n'' concept has been chosen. In order to perform IV-tests on wafer level and to hold accidentally unconnected pixels close to ground potential, a resistive path between the pixe...

  1. Characterization of the CMS Pixel Detectors

    CERN Document Server

    Gu, Weihua

    2002-01-01

    In 2005 the Large Hadron Collider (LHC) will start the pp collisions at a high luminosity and at a center of mass energy of 14 TeV. The primary goal of the experimental programme is the search of the Higgs boson(s) and the supersymmetric particles. The programme is also proposed to detect a range of diverse signatures in order to provide guidance for future physics. The pixel detector system makes up the innermost part of the CMS experiment, which is one of the two general purpose detectors at the LHC. The main tasks of the system are vertex detection and flavor tagging. The high luminosity and the high particle multiplicity as well as the small bunch spacing at the LHC impose great challenges on the pixel detectors: radiation hardness of sensors and electronics, fast signal processing and a high granularity are the essential requirements. This thesis concentrates on the study of the suitability of two test stands, which are implemented to characterize the CMS pixel detectors: one is con-cerned with test puls...

  2. ATLAS Detector Interface Group

    CERN Multimedia

    Mapelli, L

    Originally organised as a sub-system in the DAQ/EF-1 Prototype Project, the Detector Interface Group (DIG) was an information exchange channel between the Detector systems and the Data Acquisition to provide critical detector information for prototype design and detector integration. After the reorganisation of the Trigger/DAQ Project and of Technical Coordination, the necessity to provide an adequate context for integration of detectors with the Trigger and DAQ lead to organisation of the DIG as one of the activities of Technical Coordination. Such an organisation emphasises the ATLAS wide coordination of the Trigger and DAQ exploitation aspects, which go beyond the domain of the Trigger/DAQ project itself. As part of Technical Coordination, the DIG provides the natural environment for the common work of Trigger/DAQ and detector experts. A DIG forum for a wide discussion of all the detector and Trigger/DAQ integration issues. A more restricted DIG group for the practical organisation and implementation o...

  3. Monolithic pixel detectors for high energy physics

    CERN Document Server

    Snoeys, W

    2013-01-01

    Monolithic pixel detectors integrating sensor matrix and readout in one piece of silicon have revolutionized imaging for consumer applications, but despite years of research they have not yet been widely adopted for high energy physics. Two major requirements for this application, radiation tolerance and low power consumption, require charge collection by drift for the most extreme radiation levels and an optimization of the collected signal charge over input capacitance ratio ( Q / C ). It is shown that monolithic detectors can achieve Q / C for low analog power consumption and even carryout the promise to practically eliminate analog power consumption, but combining suf fi cient Q / C , collection by drift, and integration of readout circuitry within the pixel remains a challenge. An overview is given of different approaches to address this challenge, with possible advantages and disadvantages.

  4. Operational Experience with the ALICE Pixel detector

    CERN Document Server

    Mastroserio, A.

    2017-01-01

    The Silicon Pixel Detector (SPD) constitutes the two innermost layers of the Inner Tracking System of the ALICE experiment and it is the closest detector to the interaction point. As a vertex detector, it has the unique feature of generating a trigger signal that contributes to the L0 trigger of the ALICE experiment. The SPD started collecting data since the very first pp collisions at LHC in 2009 and since then it has taken part in all pp, Pb-Pb and p-Pb data taking campaigns. This contribution will present the main features of the SPD, the detector performance and the operational experience, including calibration and optimization activities from Run 1 to Run 2.

  5. The Belle II DEPFET pixel detector

    Energy Technology Data Exchange (ETDEWEB)

    Moser, Hans-Günther, E-mail: moser@mpp.mpg.de

    2016-09-21

    The Belle II experiment at KEK (Tsukuba, Japan) will explore heavy flavour physics (B, charm and tau) at the starting of 2018 with unprecedented precision. Charged particles are tracked by a two-layer DEPFET pixel device (PXD), a four-layer silicon strip detector (SVD) and the central drift chamber (CDC). The PXD will consist of two layers at radii of 14 mm and 22 mm with 8 and 12 ladders, respectively. The pixel sizes will vary, between 50 μm×(55–60) μm in the first layer and between 50 μm×(70–85) μm in the second layer, to optimize the charge sharing efficiency. These innermost layers have to cope with high background occupancy, high radiation and must have minimal material to reduce multiple scattering. These challenges are met using the DEPFET technology. Each pixel is a FET integrated on a fully depleted silicon bulk. The signal charge collected in the ‘internal gate’ modulates the FET current resulting in a first stage amplification and therefore very low noise. This allows very thin sensors (75 μm) reducing the overall material budget of the detector (0.21% X{sub 0}). Four fold multiplexing of the column parallel readout allows read out a full frame of the pixel matrix in only 20 μs while keeping the power consumption low enough for air cooling. Only the active electronics outside the detector acceptance has to be cooled actively with a two phase CO{sub 2} system. Furthermore the DEPFET technology offers the unique feature of an electronic shutter which allows the detector to operate efficiently in the continuous injection mode of superKEKB.

  6. The Belle II DEPFET pixel detector

    Science.gov (United States)

    Moser, Hans-Günther

    2016-09-01

    The Belle II experiment at KEK (Tsukuba, Japan) will explore heavy flavour physics (B, charm and tau) at the starting of 2018 with unprecedented precision. Charged particles are tracked by a two-layer DEPFET pixel device (PXD), a four-layer silicon strip detector (SVD) and the central drift chamber (CDC). The PXD will consist of two layers at radii of 14 mm and 22 mm with 8 and 12 ladders, respectively. The pixel sizes will vary, between 50 μm×(55-60) μm in the first layer and between 50 μm×(70-85) μm in the second layer, to optimize the charge sharing efficiency. These innermost layers have to cope with high background occupancy, high radiation and must have minimal material to reduce multiple scattering. These challenges are met using the DEPFET technology. Each pixel is a FET integrated on a fully depleted silicon bulk. The signal charge collected in the 'internal gate' modulates the FET current resulting in a first stage amplification and therefore very low noise. This allows very thin sensors (75 μm) reducing the overall material budget of the detector (0.21% X0). Four fold multiplexing of the column parallel readout allows read out a full frame of the pixel matrix in only 20 μs while keeping the power consumption low enough for air cooling. Only the active electronics outside the detector acceptance has to be cooled actively with a two phase CO2 system. Furthermore the DEPFET technology offers the unique feature of an electronic shutter which allows the detector to operate efficiently in the continuous injection mode of superKEKB.

  7. Test Beam Results of 3D Silicon Pixel Sensors for the ATLAS upgrade

    CERN Document Server

    Grenier, P; Barbero, M; Bates, R; Bolle, E; Borri, M; Boscardin, M; Buttar, C; Capua, M; Cavalli-Sforza, M; Cobal, M; Cristofoli, A; Dalla Betta, G F; Darbo, G; Da Via, C; Devetak, E; DeWilde, B; Di Girolamo, B; Dobos, D; Einsweiler, K; Esseni, D; Fazio, S; Fleta, C; Freestone, J; Gallrapp, C; Garcia-Sciveres, M; Gariano, G; Gemme, C; Giordani, M P; Gjersdal, H; Grinstein, S; Hansen, T; Hansen, T E; Hansson, P; Hasi, J; Helle, K; Hoeferkamp, M; Hugging, F; Jackson, P; Jakobs, K; Kalliopuska, J; Karagounis, M; Kenney, C; Köhler, M; Kocian, M; Kok, A; Kolya, S; Korokolov, I; Kostyukhin, V; Krüger, H; La Rosa, A; Lai, C H; Lietaer, N; Lozano, M; Mastroberardino, A; Micelli, A; Nellist, C; Oja, A; Oshea, V; Padilla, C; Palestri, P; Parker, S; Parzefall, U; Pater, J; Pellegrini, G; Pernegger, H; Piemonte, C; Pospisil, S; Povoli, M; Roe, S; Rohne, O; Ronchin, S; Rovani, A; Ruscino, E; Sandaker, H; Seidel, S; Selmi, L; Silverstein, D; Sjøbaek, K; Slavicek, T; Stapnes, S; Stugu, B; Stupak, J; Su, D; Susinno, G; Thompson, R; Tsung, J W; Tsybychev, D; Watts, S J; Wermes, N; Young, C; Zorzi, N

    2011-01-01

    Results on beam tests of 3D silicon pixel sensors aimed at the ATLAS Insertable-B-Layer and High Luminosity LHC (HL-LHC)) upgrades are presented. Measurements include charge collection, tracking efficiency and charge sharing between pixel cells, as a function of track incident angle, and were performed with and without a 1.6 T magnetic field oriented as the ATLAS Inner Detector solenoid field. Sensors were bump bonded to the front-end chip currently used in the ATLAS pixel detector. Full 3D sensors, with electrodes penetrating through the entire wafer thickness and active edge, and double-sided 3D sensors with partially overlapping bias and read-out electrodes were tested and showed comparable performance.

  8. Test beam results of 3D silicon pixel sensors for the ATLAS upgrade

    Energy Technology Data Exchange (ETDEWEB)

    Grenier, P., E-mail: grenier@slac.stanford.ed [SLAC National Accelerator Laboratory (United States); Alimonti, G. [INFN Sezione di Milano (Italy); Barbero, M. [Bonn University (Germany); Bates, R. [Glasgow University (United Kingdom); Bolle, E. [Oslo University (Norway); Borri, M. [University of Manchester (United Kingdom); Boscardin, M. [FBK-irst, Trento (Italy); Buttar, C. [Glasgow University (United Kingdom); Capua, M. [INFN Gruppo Collegato di Cosenza and Universita della Calabria (Italy); Cavalli-Sforza, M. [IFAE Barcelona (Spain); Cobal, M.; Cristofoli, A. [INFN Gruppo Collegato di Udine and Universita di Udine (Italy); Dalla Betta, G.-F. [INFN Gruppo Collegato di Trento and DISI Universita di Trento (Italy); Darbo, G. [INFN Sezione di Genova (Italy); Da Via, C. [University of Manchester (United Kingdom); Devetak, E.; DeWilde, B. [Stony Brook University (United States); Di Girolamo, B.; Dobos, D. [CERN (Switzerland); Einsweiler, K. [Lawrence Berkeley National Laboratory (United States)

    2011-05-11

    Results on beam tests of 3D silicon pixel sensors aimed at the ATLAS Insertable B-Layer and High Luminosity LHC (HL-LHC) upgrades are presented. Measurements include charge collection, tracking efficiency and charge sharing between pixel cells, as a function of track incident angle, and were performed with and without a 1.6 T magnetic field oriented as the ATLAS inner detector solenoid field. Sensors were bump-bonded to the front-end chip currently used in the ATLAS pixel detector. Full 3D sensors, with electrodes penetrating through the entire wafer thickness and active edge, and double-sided 3D sensors with partially overlapping bias and read-out electrodes were tested and showed comparable performance.

  9. Development of planar pixel modules for the ATLAS high luminosity LHC tracker upgrade

    Energy Technology Data Exchange (ETDEWEB)

    Allport, P.P. [Department of Physics, University of Liverpool (United Kingdom); Ashby, J.; Bates, R.L.; Blue, A. [SUPA, School of Physics and Astronomy, University of Glasgow (United Kingdom); Burdin, S. [Department of Physics, University of Liverpool (United Kingdom); Buttar, C.M., E-mail: craig.buttar@glasgow.ac.uk [SUPA, School of Physics and Astronomy, University of Glasgow (United Kingdom); Casse, G.; Dervan, P. [Department of Physics, University of Liverpool (United Kingdom); Doonan, K. [SUPA, School of Physics and Astronomy, University of Glasgow (United Kingdom); Forshaw, D. [Department of Physics, University of Liverpool (United Kingdom); Lipp, J. [The Science and Technology Facilities Council, Rutherford Appleton Laboratory (United Kingdom); McMullen, T. [SUPA, School of Physics and Astronomy, University of Glasgow (United Kingdom); Pater, J. [School of Physics and Astronomy, University of Manchester (United Kingdom); Stewart, A. [SUPA, School of Physics and Astronomy, University of Glasgow (United Kingdom); Tsurin, I. [Department of Physics, University of Liverpool (United Kingdom)

    2014-11-21

    The high-luminosity LHC will present significant challenges for tracking systems. ATLAS is preparing to upgrade the entire tracking system, which will include a significantly larger pixel detector. This paper reports on the development of large area planar detectors for the outer pixel layers and the pixel endcaps. Large area sensors have been fabricated and mounted onto 4 FE-I4 readout ASICs, the so-called quad-modules, and their performance evaluated in the laboratory and testbeam. Results from characterisation of sensors prior to assembly, experience with module assembly, including bump-bonding and results from laboratory and testbeam studies are presented.

  10. ATLAS Detector Upgrade Prospects

    CERN Document Server

    Dobre, Monica; The ATLAS collaboration

    2016-01-01

    After the successful operation at the centre-of-mass energies of 7 and 8 TeV in 2010-2012, the LHC is ramped up and successfully took data at the centre-of-mass energies of 13 TeV in 2015. Meanwhile, plans are actively advancing for a series of upgrades of the accelerator, culminating roughly ten years from now in the high-luminosity LHC (HL-LHC) project, delivering of the order of five times the LHC nominal instantaneous luminosity along with luminosity levelling. The ultimate goal is to extend the dataset from about few hundred f b −1 expected for LHC running to 3000 f b −1 by around 2035 for ATLAS and CMS. The challenge of coping with the HL-LHC instantaneous and integrated luminosity, along with the associated radiation levels, requires further major changes to the ATLAS detector. The designs are developing rapidly for a new all-silicon tracker, significant upgrades of the calorimeter and muon systems, as well as improved triggers and data acquisition. ATLAS is also examining potential benefits of ext...

  11. ATLAS Detector Upgrade Prospects

    CERN Document Server

    Dobre, Monica; The ATLAS collaboration

    2016-01-01

    After the successful operation at the center-of-mass energies of 7 and 8 TeV in 2010 - 2012, the LHC is ramped up and successfully took data at the center-of-mass energies of 13 TeV in 2015. Meanwhile, plans are actively advancing for a series of upgrades of the accelerator, culminating roughly ten years from now in the high-luminosity LHC (HL-LHC) project, delivering of the order of five times the LHC nominal instantaneous luminosity along with luminosity leveling. The ultimate goal is to extend the dataset from about few hundred fb−1 expected for LHC running to 3000 fb−1 by around 2035 for ATLAS and CMS. The challenge of coping with the HL-LHC instantaneous and integrated luminosity, along with the associated radiation levels, requires further major changes to the ATLAS detector. The designs are developing rapidly for a new all-silicon tracker, significant upgrades of the calorimeter and muon systems, as well as improved triggers and data acquisition. ATLAS is also examining potential benefits of extens...

  12. The Phase1 CMS Pixel detector upgrade

    CERN Document Server

    Tavolaro, Vittorio Raoul

    2016-01-01

    The pixel detector of the CMS experiment will be replaced in an extended end-of-year shutdown during winter 2016/2017 with an upgraded one able to cope with peak instantaneous luminosities beyond the nominal LHC instantaneous luminosity of $1 \\times 10^{34}$ cm$^{-2}$ s$^{-1}$. Under the conditions expected in the coming years, which will see an increase of a factor two in instantaneous luminosity, the present system would experience a dynamic inefficiency caused mainly by data losses due to buffer overflows. The Phase I upgrade of the CMS pixel detector, described in this paper, will operate at full efficiency at an instantaneous luminosity of $2 \\times 10^{34}$ cm$^{-2}$ s$^{-1}$, thanks to a new readout chip. The new detector will feature one additional tracking point both in the barrel and in the forward regions, while reducing the material budget as a result of a new CO$_{2}$ cooling system and optimised layout of the services. In this paper, the design and the technological choices of the Phase I detect...

  13. Pixel-Cluster Counting Luminosity Measurement In ATLAS

    CERN Document Server

    McCormack, William Patrick; The ATLAS collaboration

    2016-01-01

    A precision measurement of the delivered luminosity is a key component of the ATLAS physics program at the Large Hadron Collider (LHC). A fundamental ingredient of the strategy to control the systematic uncertainties affecting the absolute luminosity has been to compare the measure- ments of several luminometers, most of which use more than one counting technique. The level of consistency across the various methods provides valuable cross-checks as well as an estimate of the detector-related systematic uncertainties. This poster describes the development of a luminosity algorithm based on pixel-cluster counting in the recently installed ATLAS inner b-layer (IBL), using data recorded during the 2015 pp run at the LHC. The noise and background contamination of the luminosity-associated cluster count is minimized by a multi-component fit to the measured cluster-size distribution in the forward pixel modules of the IBL. The linearity, long-term stability and statistical precision of the cluster- counting method a...

  14. Pixel-Cluster Counting Luminosity Measurement in ATLAS

    CERN Document Server

    McCormack, William Patrick; The ATLAS collaboration

    2016-01-01

    A precision measurement of the delivered luminosity is a key component of the ATLAS physics program at the Large Hadron Collider (LHC). A fundamental ingredient of the strategy to control the systematic uncertainties affecting the absolute luminosity has been to compare the measurements of several luminometers, most of which use more than one counting technique. The level of consistency across the various methods provides valuable cross-checks as well as an estimate of the detector-related systematic uncertainties. This poster describes the development of a luminosity algorithm based on pixel-cluster counting in the recently installed ATLAS inner b-layer (IBL), using data recorded during the 2015 pp run at the LHC. The noise and background contamination of the luminosity-associated cluster count is minimized by a multi-component fit to the measured cluster-size distribution in the forward pixel modules of the IBL. The linearity, long-term stability and statistical precision of the cluster-counting method are ...

  15. ATLAS Detector : Performance and Upgrades

    CERN Document Server

    Oliveira Damazio, Denis; The ATLAS collaboration

    2016-01-01

    Describe the ATLAS detector and summarize most relevant and recent information about the detector performance in 2016 with LHC colliding bunches at sqrt(s)=13 TeV with luminosity above the nominal value. Describe the different upgrade phases previewed for the detector and main activities already ongoing.

  16. The ALICE Silicon Pixel Detector System

    CERN Document Server

    Fadmar Osmic, FO

    2006-01-01

    The European Organization for Particle Physics (CERN) in Geneva is currently constructing the Large Hadron Collider (LHC), which will allow the study of the subnuclear ranges of physics with an accuracy never achieved before. Within the LHC project, ALICE is to the study of strongly interacting matter at extreme densities and high temperatures. ALICE as many other modern High Energy Physics (HEP) experiments uses silicon pixel detectors for tracking close to the interaction point (IP). The ALICE Silicon Pixel Detector (SPD) will constitute the two innermost layers of ALICE, and will due to its high granularity provide precise tracking information. In heavy ion collisions, the track density could be as high as 80 tracks/cm2 in the first SPD layer. The SPD will provide tracking information at radii of 3.9 and 7.6 cm from the IP. It is a fundamental element for the study of the weak decays of the particles carrying heavy flavour, whose typical signature will be a secondary vertex separated from the primary verte...

  17. Detector performance of the ALICE silicon pixel detector

    CERN Document Server

    Cavicchioli, C

    2011-01-01

    The ALICE Silicon Pixel Detector (SPD) forms the two innermost layers of the ALICE Inner Tracking System (ITS). It consists of two barrel layers of hybrid silicon pixel detectors at radii of 39 and 76 mm. The physics targets of the ALICE experiment require that the material budget of the SPD is kept within approximate to 1\\%X(0) per layer. This has set some stringent constraints on the design and construction of the SPD. A unique feature of the ALICE SPD is that it is capable of providing a prompt trigger signal, called Fast-OR, which contributes to the L0 trigger decision. The pixel trigger system allows to apply a set of algorithms for the trigger selection, and its output is sent to the Central Trigger Processor (CTP). The detector has been installed in the experiment in summer 2007. During the first injection tests in June 2008 the SPD was able to record the very first sign of life of the LHC by registering secondary particles from the beam dumped upstream the ALICE experiment. In the following months the...

  18. The Phase II ATLAS Pixel Upgrade: The Inner Tracker (ITk)

    CERN Document Server

    Flick, Tobias; The ATLAS collaboration

    2016-01-01

    The entire tracking system of the ATLAS experiment will be replaced during the LHC Phase II shutdown (foreseen to take place around 2025) by an all-silicon detector called the ITk (Inner Tracker). The pixel detector will comprise the five innermost layers, and will be instrumented with new sensor and readout electronics technologies to improve the tracking performance and cope with the HL-LHC environment, which will be severe in terms of occupancy and radiation. The total surface area of silicon in the new pixel system could measure up to 14 m^2, depending on the final layout choice, which is expected to take place in early 2017. Four layout options are being investigated at the moment, two with forward coverage to eta < 3.2 and two to eta < 4. For each coverage option, a layout with long barrel staves and a layout with novel inclined support structures in the barrel-endcap overlap region are considered. All potential layouts include modules mounted on ring-shaped supports in the endcap regions. Support...

  19. ATLAS Pixel Radiation Monitoring with HVPP4 System

    CERN Document Server

    Gorelov, Igor; Seidel, Sally; Toms, Konstantin

    2009-01-01

    In this talk we present the basis for the protocol for radiation monitoring of the ATLAS Pixel Sensors. The monitoring is based on a current measurement system, HVPP4. The status on the ATLAS HVPP4 system development is also presented.

  20. A method for precise charge reconstruction with pixel detectors using binary hit information

    CERN Document Server

    Pohl, David-Leon; Hemperek, Tomasz; Hügging, Fabian; Wermes, Norbert

    2014-01-01

    A method is presented to precisely reconstruct charge spectra with pixel detectors using binary hit information of individual pixels. The method is independent of the charge information provided by the readout circuitry and has a resolution mainly limited by the electronic noise. It relies on the ability to change the detection threshold in small steps while counting hits from a particle source. The errors are addressed and the performance of the method is shown based on measurements with the ATLAS pixel chip FE-I4 bump bonded to a 230 {\\mu}m 3D-silicon sensor. Charge spectra from radioactive sources and from electron beams are presented serving as examples. It is demonstrated that a charge resolution ({\\sigma}<200 e) close to the electronic noise of the ATLAS FE-I4 pixel chip can be achieved.

  1. Test Beam Results of 3D Silicon Pixel Sensors for the ATLAS upgrade

    Energy Technology Data Exchange (ETDEWEB)

    Grenier, P.; /SLAC; Alimonti, G.; /INFN, Milan; Barbero, M.; /Bonn U.; Bates, R.; /Glasgow U.; Bolle, E.; /Oslo U.; Borri, M.; /Manchester U.; Boscardin, M.; /Fond. Bruno Kessler, Povo; Buttar, C.; /Glasgow U.; Capua, M.; /Calabria U. /INFN, Cosenza; Cavalli-Sforza, M.; /Barcelona, IFAE; Cobal, M.; /Udine U. /INFN, Udine; Cristofoli, A.; /Udine U. /INFN, Udine; Dalla Betta, G.F.; /Trento U. /INFN, Trento; Darbo, G.; /INFN, Genoa; Da Via, C.; /Manchester U.; Devetak, E.; /SUNY, Stony Brook; DeWilde, B.; /SUNY, Stony Brook; Di Girolamo, B.; /CERN; Dobos, D.; /CERN; Einsweiler, K.; /LBL, Berkeley; Esseni, D.; /Udine U. /INFN, Udine /Calabria U. /INFN, Cosenza /Barcelona, Inst. Microelectron. /Manchester U. /CERN /LBL, Berkeley /INFN, Genoa /INFN, Genoa /Udine U. /INFN, Udine /Oslo U. /ICREA, Barcelona /Barcelona, IFAE /SINTEF, Oslo /SINTEF, Oslo /SLAC /SLAC /Bergen U. /New Mexico U. /Bonn U. /SLAC /Freiburg U. /VTT Electronics, Espoo /Bonn U. /SLAC /Freiburg U. /SLAC /SINTEF, Oslo /Manchester U. /Barcelona, IFAE /Bonn U. /Bonn U. /CERN /Manchester U. /SINTEF, Oslo /Barcelona, Inst. Microelectron. /Calabria U. /INFN, Cosenza /Udine U. /INFN, Udine /Manchester U. /VTT Electronics, Espoo /Glasgow U. /Barcelona, IFAE /Udine U. /INFN, Udine /Hawaii U. /Freiburg U. /Manchester U. /Barcelona, Inst. Microelectron. /CERN /Fond. Bruno Kessler, Povo /Prague, Tech. U. /Trento U. /INFN, Trento /CERN /Oslo U. /Fond. Bruno Kessler, Povo /INFN, Genoa /INFN, Genoa /Bergen U. /New Mexico U. /Udine U. /INFN, Udine /SLAC /Oslo U. /Prague, Tech. U. /Oslo U. /Bergen U. /SUNY, Stony Brook /SLAC /Calabria U. /INFN, Cosenza /Manchester U. /Bonn U. /SUNY, Stony Brook /Manchester U. /Bonn U. /SLAC /Fond. Bruno Kessler, Povo

    2011-08-19

    Results on beam tests of 3D silicon pixel sensors aimed at the ATLAS Insertable-B-Layer and High Luminosity LHC (HL-LHC) upgrades are presented. Measurements include charge collection, tracking efficiency and charge sharing between pixel cells, as a function of track incident angle, and were performed with and without a 1.6 T magnetic field oriented as the ATLAS Inner Detector solenoid field. Sensors were bump bonded to the front-end chip currently used in the ATLAS pixel detector. Full 3D sensors, with electrodes penetrating through the entire wafer thickness and active edge, and double-sided 3D sensors with partially overlapping bias and read-out electrodes were tested and showed comparable performance. Full and partial 3D pixel detectors have been tested, with and without a 1.6T magnetic field, in high energy pion beams at the CERN SPS North Area in 2009. Sensors characteristics have been measured as a function of the beam incident angle and compared to a regular planar pixel device. Overall full and partial 3D devices have similar behavior. Magnetic field has no sizeable effect on 3D performances. Due to electrode inefficiency 3D devices exhibit some loss of tracking efficiency for normal incident tracks but recover full efficiency with tilted tracks. As expected due to the electric field configuration 3D sensors have little charge sharing between cells.

  2. ATLAS pixel IBL modules construction experience and developments for future upgrade

    Energy Technology Data Exchange (ETDEWEB)

    Gaudiello, A.

    2015-10-01

    The first upgrade of the ATLAS Pixel Detector is the Insertable B-Layer (IBL), installed in May 2014 in the core of ATLAS. Two different silicon sensor technologies, planar n-in-n and 3D, are used. Sensors are connected with the new generation 130 nm IBM CMOS FE-I4 read-out chip via solder bump-bonds. Production quality control tests were set up to verify and rate the performance of the modules before integration into staves. An overview of module design and construction, the quality control results and production yield will be discussed, as well as future developments foreseen for future detector upgrades.

  3. Silicon buried channels for pixel detector cooling

    Energy Technology Data Exchange (ETDEWEB)

    Boscardin, M., E-mail: boscardi@fbk.eu [Fondazione Bruno Kessler Trento, Via Sommarive 18, I-38123 Trento (Italy); Conci, P.; Crivellari, M.; Ronchin, S. [Fondazione Bruno Kessler Trento, Via Sommarive 18, I-38123 Trento (Italy); Bettarini, S. [Universitá di Pisa, L.go B. Pontecorvo 3, I-56127 Pisa (Italy); Istituto Nazionale di Fisica Nucleare, Sez. di Pisa, L.go B. Pontecorvo 3, I-56127 Pisa (Italy); Bosi, F. [Istituto Nazionale di Fisica Nucleare, Sez. di Pisa, L.go B. Pontecorvo 3, I-56127 Pisa (Italy)

    2013-08-01

    The support and cooling structures add important contributions to the thickness, in radiation length, of vertex detectors. In order to minimize the material budget of pixel sensors, we developed a new approach to integrate the cooling into the silicon devices. The microchannels are formed in silicon using isotropic SF{sub 6} plasma etching in a DRIE (deep reactive ion etcher) equipment. Due to their peculiar profiles, the channels can be sealed by a layer of a PECVD silicon oxide. We have realized on a silicon wafer microchannels with different geometries and hydraulic diameters. We describe the main fabrication steps of microchannels with focus on the channel definition. The experimental results are reported on the thermal characterization of several prototypes, using a mixture of glycol and water as a liquid coolant. The prototypes have shown high cooling efficiency and high-pressure breaking strength.

  4. 3D silicon pixel detectors for the High-Luminosity LHC

    CERN Document Server

    Lange, J.

    2016-01-01

    3D silicon pixel detectors have been investigated as radiation-hard candidates for the innermost layers of the HL-LHC upgrade of the ATLAS pixel detector. 3D detectors are already in use today in the ATLAS IBL and AFP experiments. These are based on 50x250 um2 large pixels connected to the FE-I4 readout chip. Detectors of this generation were irradiated to HL-LHC fluences and demonstrated excellent radiation hardness with operational voltages as low as 180 V and power dissipation of 12--15 mW/cm2 at a fluence of about 1e16 neq/cm2, measured at -25 degree C. Moreover, to cope with the higher occupancies expected at the HL-LHC, a first run of a new generation of 3D detectors designed for the HL-LHC was produced at CNM with small pixel sizes of 50x50 and 25x100 um2, matched to the FE-I4 chip. They demonstrated a good performance in the laboratory and in beam tests with hit efficiencies of about 97% at already 1--2V before irradiation.

  5. 3D silicon pixel detectors for the High-Luminosity LHC

    Science.gov (United States)

    Lange, J.; Carulla Areste, M.; Cavallaro, E.; Förster, F.; Grinstein, S.; López Paz, I.; Manna, M.; Pellegrini, G.; Quirion, D.; Terzo, S.; Vázquez Furelos, D.

    2016-11-01

    3D silicon pixel detectors have been investigated as radiation-hard candidates for the innermost layers of the HL-LHC upgrade of the ATLAS pixel detector. 3D detectors are already in use today in the ATLAS IBL and AFP experiments. These are based on 50 × 250 μm2 large pixels connected to the FE-I4 readout chip. Detectors of this generation were irradiated to HL-LHC fluences and demonstrated excellent radiation hardness with operational voltages as low as 180 V and power dissipation of 12-15 mW/cm2 at a fluence of about 1016 neq/cm2, measured at -25°C. Moreover, to cope with the higher occupancies expected at the HL-LHC, a first run of a new generation of 3D detectors designed for the HL-LHC was produced at CNM with small pixel sizes of 50 × 50 and 25 × 100 μm2, matched to the FE-I4 chip. They demonstrated a good performance in the laboratory and in beam tests with hit efficiencies of about 97% at already 1-2 V before irradiation.

  6. Hit efficiency study of CMS prototype forward pixel detectors

    Energy Technology Data Exchange (ETDEWEB)

    Kim, Dongwook; /Johns Hopkins U.

    2006-01-01

    In this paper the author describes the measurement of the hit efficiency of a prototype pixel device for the CMS forward pixel detector. These pixel detectors were FM type sensors with PSI46V1 chip readout. The data were taken with the 120 GeV proton beam at Fermilab during the period of December 2004 to February 2005. The detectors proved to be highly efficient (99.27 {+-} 0.02%). The inefficiency was primarily located near the corners of the individual pixels.

  7. Pre- and post-irradiation performance of FBK 3D silicon pixel detectors for CMS

    Energy Technology Data Exchange (ETDEWEB)

    Krzywda, A., E-mail: akrzywda@purdue.edu [Purdue University, Department of Physics and Astronomy, West Lafayette, IN 47907-2036 (United States); Alagoz, E.; Bubna, M. [Purdue University, Department of Physics and Astronomy, West Lafayette, IN 47907-2036 (United States); Obertino, M. [Università del Piemonte Orientale, Novara (Italy); INFN, Sezione di Torino, Torino (Italy); Solano, A. [Università di Torino, Torino (Italy); INFN, Sezione di Torino, Torino (Italy); Arndt, K. [Purdue University, Department of Physics and Astronomy, West Lafayette, IN 47907-2036 (United States); Uplegger, L. [Fermi National Accelerator Laboratory, Batavia, IL 60510-5011 (United States); Betta, G.F. Dalla [TIFPA INFN and Dipartimento di Ingegneria Industriale, Università di Trento, Via Sommarive 9, I-38123 Povo di Trento, TN (Italy); Boscardin, M. [Centro per Materiali e i Microsistemi Fondazione Bruno Kessler (FBK), Trento, Via Sommarive 18, I-38123 Povo di Trento, TN (Italy); Ngadiuba, J. [Università di Milano-Bicocca, Milan (Italy); Rivera, R. [Fermi National Accelerator Laboratory, Batavia, IL 60510-5011 (United States); Menasce, D.; Moroni, L.; Terzo, S. [Università di Milano-Bicocca, Milan (Italy); Bortoletto, D. [Purdue University, Department of Physics and Astronomy, West Lafayette, IN 47907-2036 (United States); Prosser, A.; Adreson, J.; Kwan, S. [Fermi National Accelerator Laboratory, Batavia, IL 60510-5011 (United States); Osipenkov, I. [Texas A and M University, Department of Physics, College Station, TX 77843 (United States); Bolla, G. [Purdue University, Department of Physics and Astronomy, West Lafayette, IN 47907-2036 (United States); and others

    2014-11-01

    In preparation for the tenfold luminosity upgrade of the Large Hadron Collider (the HL-LHC) around 2020, three-dimensional (3D) silicon pixel sensors are being developed as a radiation-hard candidate to replace the planar ones currently being used in the CMS pixel detector. This study examines an early batch of FBK sensors (named ATLAS08) of three 3D pixel geometries: 1E, 2E, and 4E, which respectively contain one, two, and four readout electrodes for each pixel, passing completely through the bulk. We present electrical characteristics and beam test performance results for each detector before and after irradiation. The maximum fluence applied is 3.5×10{sup 15} n {sub eq}/cm{sup 2}.

  8. Novel silicon n-in-p pixel sensors for the future ATLAS upgrades

    Energy Technology Data Exchange (ETDEWEB)

    La Rosa, A., E-mail: alessandro.larosa@cern.ch [Section de Physique (DPNC), Université de Genève, 24 quai Ernest Ansermet, Genève 4, CH-1211 (Switzerland); Gallrapp, C. [CERN, Geneva 23, CH-1211 (Switzerland); Macchiolo, A.; Nisius, R. [Max-Planck-Institut für Physik (Werner-Heisenberg-Institut) Föhringer Ring 6, D-80805 München (Germany); Pernegger, H. [CERN, Geneva 23, CH-1211 (Switzerland); Richter, R.H. [Max-Planck-Institut Halbleiterlabor, Otto Hahn Ring 6, D-81739 München (Germany); Weigell, P. [Max-Planck-Institut für Physik (Werner-Heisenberg-Institut) Föhringer Ring 6, D-80805 München (Germany)

    2013-08-01

    In view of the LHC upgrade phases towards HL-LHC the ATLAS experiment plans to upgrade the inner detector with an all silicon system. The n-in-p silicon technology is a promising candidate for the pixel upgrade thanks to its radiation hardness and cost effectiveness that allow for enlarging the area instrumented with pixel detectors. We present the characterization and performance of novel n-in-p planar pixel sensors produced by CiS (Germany) connected by bump bonding to the ATLAS readout chip FE-I3. These results are obtained before and after irradiation up to a fluence of 10{sup 16}1-MeV n{sub eq}cm{sup −2}, and prove the operability of this kind of sensors in the harsh radiation environment foreseen for the pixel system at HL-LHC. We also present an overview of the new pixel production, which is on-going at CiS for sensors compatible with the new ATLAS readout chip FE-I4.

  9. Novel Silicon n-in-p Pixel Sensors for the future ATLAS Upgrades

    CERN Document Server

    La Rosa, A; Macchiolo, A; Nisius, R; Pernegger, H; Richter,R H; Weigell, P

    2013-01-01

    In view of the LHC upgrade phases towards HL-LHC the ATLAS experiment plans to upgrade the Inner Detector with an all silicon system. The n-in-p silicon technology is a promising candidate for the pixel upgrade thanks to its radiation hardness and cost eectiveness, that allow for enlarging the area instrumented with pixel detectors. We present the characterization and performance of novel n-in-p planar pixel sensors produced by CiS (Germany) connected by bump bonding to the ATLAS readout chip FE-I3. These results are obtained before and after irradiation up to a fluence of 1016 1-MeV $n_{eq}cm^{-2}$, and prove the operability of this kind of sensors in the harsh radiation environment foreseen for the pixel system at HL-LHC. We also present an overview of the new pixel production, which is on-going at CiS for sensors compatible with the new ATLAS readout chip FE-I4.

  10. Near Future Upgrades for the CMS Pixel Detector

    CERN Document Server

    Kumar, Ashish

    2015-01-01

    The silicon pixel detector is the innermost component of the CMS tracking system, providing high precision space point measurements of charged particle trajectories. The current pixel detector is designed to operate at a maximum luminosity of $1\\times10^{34}cm^{-2}s^{-1}$. Before 2018 the instantaneous luminosity of the LHC is expected to reach $2\\times10^{34}cm^{-2}s^{-1}$, which will significantly increase the number of interactions per bunch crossing. The performance of the current pixel detector in such high occupancy environment will be degraded due to substantial data-loss and effects of radiation damage of sensors, built up over the operational period. In order to maintain or exceed its current performance, the CMS pixel detector will be replaced by a new lightweight system with additional detection layers, better acceptance and improved readout electronics. The upgraded pixel detector will provide improved track and vertex reconstruction, standalone tracking capabilities, as well as identification of ...

  11. The ATLAS Detector Control System

    CERN Document Server

    Schlenker, S; Kersten, S; Hirschbuehl, D; Braun, H; Poblaguev, A; Oliveira Damazio, D; Talyshev, A; Zimmermann, S; Franz, S; Gutzwiller, O; Hartert, J; Mindur, B; Tsarouchas, CA; Caforio, D; Sbarra, C; Olszowska, J; Hajduk, Z; Banas, E; Wynne, B; Robichaud-Veronneau, A; Nemecek, S; Thompson, PD; Mandic, I; Deliyergiyev, M; Polini, A; Kovalenko, S; Khomutnikov, V; Filimonov, V; Bindi, M; Stanecka, E; Martin, T; Lantzsch, K; Hoffmann, D; Huber, J; Mountricha, E; Santos, HF; Ribeiro, G; Barillari, T; Habring, J; Arabidze, G; Boterenbrood, H; Hart, R; Marques Vinagre, F; Lafarguette, P; Tartarelli, GF; Nagai, K; D'Auria, S; Chekulaev, S; Phillips, P; Ertel, E; Brenner, R; Leontsinis, S; Mitrevski, J; Grassi, V; Karakostas, K; Iakovidis, G.; Marchese, F; Aielli, G

    2011-01-01

    The ATLAS experiment is one of the multi-purpose experiments at the Large Hadron Collider (LHC), constructed to study elementary particle interactions in collisions of high-energy proton beams. Twelve different sub-detectors as well as the common experimental infrastructure are supervised by the Detector Control System (DCS). The DCS enables equipment supervision of all ATLAS sub-detectors by using a system of >130 server machines running the industrial SCADA product PVSS. This highly distributed system reads, processes and archives of the order of 106 operational parameters. Higher level control system layers allow for automatic control procedures, efficient error recognition and handling, and manage the communication with external systems such as the LHC. This contribution firstly describes the status of the ATLAS DCS and the experience gained during the LHC commissioning and the first physics data taking operation period. Secondly, the future evolution and maintenance constraints for the coming years an...

  12. Planar n{sup +}-in-n silicon pixel sensors for the ATLAS IBL upgrade

    Energy Technology Data Exchange (ETDEWEB)

    Goessling, C.; Klingenberg, R. [Lehrstuhl fuer Experimentelle Physik IV, TU Dortmund, 44221 Dortmund (Germany); Muenstermann, D., E-mail: Daniel.Muenstermann@TU-Dortmund.de [Lehrstuhl fuer Experimentelle Physik IV, TU Dortmund, 44221 Dortmund (Germany); Rummler, A.; Troska, G.; Wittig, T. [Lehrstuhl fuer Experimentelle Physik IV, TU Dortmund, 44221 Dortmund (Germany)

    2011-09-11

    The ATLAS experiment at the LHC is planning to upgrade its pixel detector by the installation of a 4th pixel layer, the insertable b-layer IBL with a mean sensor radius of only 32 mm from the beam axis. Being very close to the beam, the radiation damage of the IBL sensors might be as high as 5x10{sup 15} n{sub eq} cm{sup -2} at their end-of-life. To investigate the radiation hardness and suitability of the current ATLAS pixel sensors for IBL fluences, n{sup +}-in-n silicon pixel sensors from the ATLAS Pixel production have been irradiated by reactor neutrons to the IBL design fluence and been tested with pions at the SPS and with electrons from a {sup 90}Sr source in the laboratory. The collected charge was found to exceed 10 000 electrons per MIP at 1 kV of bias voltage which is in agreement with data collected with strip sensors. With an expected threshold of 3000-4000 electrons, this result suggests that planar n{sup +}-in-n pixel sensors are radiation hard enough to be used as IBL sensor technology.

  13. The LHC Luminosity Upgrade and Related ATLAS Detector Plans

    CERN Document Server

    Hartjes, F; The ATLAS collaboration

    2009-01-01

    3rd draft of the proposed talk about Atlas Upgrade for MPGD2009 (Instrumentation conference on gaseous pixel detectors) on Friday June 12, 2009. I concentrated my presentation on the upgrade plans and schedule of the LHC and on detector technologies for the new Inner Tracker, putting less emphasis on other subdetectors. Compared to the 2nd draft I modified and clarified a few items about trigger, muon detection and calorimetry and did a number of cosmetic adaptions.

  14. Status of the CMS Phase I Pixel Detector Upgrade

    CERN Document Server

    AUTHOR|(CDS)2083994

    2016-01-01

    A new pixel detector for the CMS experiment is being built, owing to the instantaneous luminosities anticipated for the Phase~I Upgrade of the LHC. The new CMS pixel detector provides four-hit tracking while featuring a significantly reduced material budget as well as new cooling and powering schemes. A new front-end readout chip mitigates buffering and bandwidth limitations, and comprises a low-threshold comparator. These improvements allow the new pixel detector to sustain and improve the efficiency of the current pixel tracker at the increased requirements imposed by high luminosities and pile-up. This contribution gives an overview of the design of the upgraded pixel detector and the status of the upgrade project, and presents test beam performance measurements of the production read-out chip.

  15. Status of the CMS Phase I pixel detector upgrade

    Energy Technology Data Exchange (ETDEWEB)

    Spannagel, S., E-mail: simon.spannagel@desy.de

    2016-09-21

    A new pixel detector for the CMS experiment is being built, owing to the instantaneous luminosities anticipated for the Phase I Upgrade of the LHC. The new CMS pixel detector provides four-hit tracking while featuring a significantly reduced material budget as well as new cooling and powering schemes. A new front-end readout chip mitigates buffering and bandwidth limitations, and comprises a low-threshold comparator. These improvements allow the new pixel detector to sustain and improve the efficiency of the current pixel tracker at the increased requirements imposed by high luminosities and pile-up. This contribution gives an overview of the design of the upgraded pixel detector and the status of the upgrade project, and presents test beam performance measurements of the production read-out chip.

  16. Small pixel CZT detector for hard X-ray spectroscopy

    Energy Technology Data Exchange (ETDEWEB)

    Wilson, Matthew David, E-mail: Matt.Wilson@stfc.ac.uk [Science and Technology Facilities Council, Rutherford Appleton Laboratory, Harwell Science and Innovation Campus, Oxfordshire OX11 0QX (United Kingdom); Cernik, Robert [Henry Moseley X-ray Imaging Facility, School of Materials, University of Manchester (United Kingdom); Chen, Henry [Redlen Technologies, Saanichton, British Columbia (Canada); Hansson, Conny [Henry Moseley X-ray Imaging Facility, School of Materials, University of Manchester (United Kingdom); Iniewski, Kris [Redlen Technologies, Saanichton, British Columbia (Canada); Jones, Lawrence L.; Seller, Paul; Veale, Matthew C. [Science and Technology Facilities Council, Rutherford Appleton Laboratory, Harwell Science and Innovation Campus, Oxfordshire OX11 0QX (United Kingdom)

    2011-10-01

    A new small pixel cadmium zinc telluride (CZT) detector has been developed for hard X-ray spectroscopy. The X-ray performance of four detectors is presented and the detectors are analysed in terms of the energy resolution of each pixel. The detectors were made from CZT crystals grown by the travelling heater method (THM) bonded to a 20x20 application specific integrated circuit (ASIC) and data acquisition (DAQ) system. The detectors had an array of 20x20 pixels on a 250 {mu}m pitch, with each pixel gold-stud bonded to an energy resolving circuit in the ASIC. The DAQ system digitised the ASIC output with 14 bit resolution, performing offset corrections and data storage to disc in real time at up to 40,000 frames per second. The detector geometry and ASIC design was optimised for X-ray spectroscopy up to 150 keV and made use of the small pixel effect to preferentially measure the electron signal. A {sup 241}Am source was used to measure the spectroscopic performance and uniformity of the detectors. The average energy resolution (FWHM at 59.54 keV) of each pixel ranged from 1.09{+-}0.46 to 1.50{+-}0.57 keV across the four detectors. The detectors showed good spectral performance and uniform response over almost all pixels in the 20x20 array. A large area 80x80 pixel detector will be built that will utilise the scalable design of the ASIC and the large areas of monolithic spectroscopic grade THM grown CZT that are now available. The large area detector will have the same performance as that demonstrated here.

  17. Small pixel CZT detector for hard X-ray spectroscopy

    Science.gov (United States)

    Wilson, Matthew David; Cernik, Robert; Chen, Henry; Hansson, Conny; Iniewski, Kris; Jones, Lawrence L.; Seller, Paul; Veale, Matthew C.

    2011-10-01

    A new small pixel cadmium zinc telluride (CZT) detector has been developed for hard X-ray spectroscopy. The X-ray performance of four detectors is presented and the detectors are analysed in terms of the energy resolution of each pixel. The detectors were made from CZT crystals grown by the travelling heater method (THM) bonded to a 20×20 application specific integrated circuit (ASIC) and data acquisition (DAQ) system. The detectors had an array of 20×20 pixels on a 250 μm pitch, with each pixel gold-stud bonded to an energy resolving circuit in the ASIC. The DAQ system digitised the ASIC output with 14 bit resolution, performing offset corrections and data storage to disc in real time at up to 40,000 frames per second. The detector geometry and ASIC design was optimised for X-ray spectroscopy up to 150 keV and made use of the small pixel effect to preferentially measure the electron signal. A 241Am source was used to measure the spectroscopic performance and uniformity of the detectors. The average energy resolution (FWHM at 59.54 keV) of each pixel ranged from 1.09±0.46 to 1.50±0.57 keV across the four detectors. The detectors showed good spectral performance and uniform response over almost all pixels in the 20×20 array. A large area 80×80 pixel detector will be built that will utilise the scalable design of the ASIC and the large areas of monolithic spectroscopic grade THM grown CZT that are now available. The large area detector will have the same performance as that demonstrated here.

  18. Luminosity measurements in ATLAS with MPX detectors

    Energy Technology Data Exchange (ETDEWEB)

    Sopczak, Andre; Benes, Petr; Bergmann, Benedikt; Biskup, Bartolomej; Jakubek, Jan; Pospisil, Stanislav; Solc, Jaroslav; Sopko, Vit; Suk, Michal; Turecek, Daniel; Vykydal, Zdenek [IEAP CTU Prague (Czech Republic); Asbah, Nedaa; Leroy, Claude; Soueid, Paul [Universite de Montreal (Canada)

    2013-07-01

    The ATLAS-MPX detectors are based on Medipix2 silicon devices designed by CERN for the detection of different types of radiation. These detectors are successfully operating in the ATLAS detector at 16 places and collect data independent of the ATLAS data-recording chain. Recently it has been recognized that these detectors are well suited for luminosity measurements. Results from these studies are presented.

  19. Detector apparatus having a hybrid pixel-waveform readout system

    Science.gov (United States)

    Meng, Ling-Jian

    2014-10-21

    A gamma ray detector apparatus comprises a solid state detector that includes a plurality of anode pixels and at least one cathode. The solid state detector is configured for receiving gamma rays during an interaction and inducing a signal in an anode pixel and in a cathode. An anode pixel readout circuit is coupled to the plurality of anode pixels and is configured to read out and process the induced signal in the anode pixel and provide triggering and addressing information. A waveform sampling circuit is coupled to the at least one cathode and configured to read out and process the induced signal in the cathode and determine energy of the interaction, timing of the interaction, and depth of interaction.

  20. Test of CZT Detectors with Different Pixel Pitches and Thicknesses

    CERN Document Server

    Li, Qiang; Jung, Ira; Groza, Michael; Dowkontt, Paul; Bose, Richard; Simburger, Garry; Burger, Arnold; Krawczynski, Henric

    2007-01-01

    The Modified Horizontal Bridgman (MHB) process produces Cadmium Zinc Telluride (CZT) crystals with high yield and excellent homogeneity. Various groups,including our own, previously reported on the test of 2x2x0.5 cm3 MHB CZT detectors grown by the company Orbotech and read out with 8x8 pixels. In this contribution, we describe the optimization of the photolithographic process used for contacting the CZT detector with pixel contacts. The optimized process gives a high yield of good pixels down to pixel diameters/pitches of 50 microns. Furthermore, we discuss the performance of 0.5 cm and 0.75 cm thick detectors contacted with 64 and 225 pixel read out with the RENA-3 ASICs from the company NOVA R&D.

  1. Characterization of new hybrid pixel module concepts for the ATLAS Insertable B-Layer upgrade

    CERN Document Server

    Backhaus, Malte

    2012-01-01

    The ATLAS Insertable B-Layer (IBL) collaboration plans to insert a fourth pixel layer inside the present Pixel Detector to recover from eventual failures in the current pixel system, especially the b-layer. Additionally the IBL will ensure excellent tracking, vertexing and b-tagging performance during the LHC phase I and add robustness in tracking with high luminosity pile-up. The expected peak luminosity for IBL is 2 to 3centerdot1034 cm-2s-1 and IBL is designed for an integrated luminosity of 700 fb-1. This corresponds to an expected fluence of 5centerdot1015 1 MeV neqcm-2 and a total ionizing dose of 250 MRad. In order to cope with these requirements, two new module concepts are under investigation, both based on a new front end IC, called FE-I4. This IC was designed as readout chip for future ATLAS Pixel Detectors and its first application will be the IBL. The planar pixel sensor (PPS) based module concept benefits from its well understood design, which is kept as similar as possible to the design of the ...

  2. Characterization of new hybrid pixel module concepts for the ATLAS Insertable B-Layer upgrade

    CERN Document Server

    Backhaus, M

    2012-01-01

    The ATLAS Insertable B-Layer (IBL) collaboration plans to insert a fourth pixel layer inside the present Pixel Detector to recover from eventual failures in the current pixel system, especially the b-layer. Additionally the IBL will ensure excellent tracking, vertexing and b-tagging performance during the LHC phase I and add robustness in tracking with high luminosity pile-up. The expected peak luminosity for IBL is 2 to 3•10^34 cm^−2 s^ −1 and IBL is designed for an integrated luminosity of 700 fb^−1 . This corresponds to an expected fluence of 5 • 10^15 1 MeV n_eqcm^−2 and a total ionizing dose of 250 MRad. In order to cope with these requirements, two new module concepts are under investigation, both based on a new front end IC, called FE-I4. This IC was designed as readout chip for future ATLAS Pixel Detectors and its first application will be the IBL. The planar pixel sensor (PPS) based module concept benefits from its well understood design, which is kept as similar as possible to the design...

  3. Monolithic CMOS pixel detector for international linear collider vertex detection

    Indian Academy of Sciences (India)

    J E Brau; O Igonkina; N Sinew; D Strom; C Baltay; W Emmet; H Neal; D Rabinowitz

    2007-12-01

    A monolithic CMS pixel detector is under development for an ILC experiment. This chronopixel array provides a time stamp resolution of one bunch crossing, a critical feature for background suppression. The status of this effort is summarized.

  4. Fabrication and Test of Pixelated CZT Detectors with Different Pixel Pitches and Thicknesses

    CERN Document Server

    Li, Q; Dowkontt, P; Martín, J; Beilicke, M; Jung, I; Groza, M; Bürger, A; De Geronimo, G; Krawczynski, H

    2008-01-01

    The main methods grown Cadmium Zinc Telluride (CZT) crystals with high yield and excellent homogeneity are Modified Horizontal Bridgman (MHB) and High Pressure Bridgman (HPB) processes, respectively. In this contribution, the readout system based on two 32-channel NCI-ASICs for pixellated CZT detector arrays has been developed and tested. The CZT detectors supplied by Orbotech (MHB) and eV products (HPB) are tested by NCI-ASIC readout system. The CZT detectors have an array of 8x8 or 11x11 pixel anodes fabricated on the anode surface with the area up to 2 cm x2 cm and the thickness of CZT detectors ranges from 0.5 cm to 1 cm. Energy spectra resolution and electron mobility-lifetime products of 8x8 pixels CZT detector with different thicknesses have been investigated.

  5. Silicon Pixel Detectors for Synchrotron Applications

    CERN Document Server

    Stewart, Graeme Douglas

    Recent advances in particle accelerators have increased the demands being placed on detectors. Novel detector designs are being implemented in many different areas including, for example, high luminosity experiments at the LHC or at next generation synchrotrons. The purpose of this thesis was to characterise some of these novel detectors. The first of the new detector types is called a 3D detector. This design was first proposed by Parker, Kenney and Segal (1997). In this design, doped electrodes are created that extend through the silicon substrate. When compared to a traditional photodiode with electrodes on the opposing surfaces, the 3D design can combine a reasonable detector thickness with a small electrode spacing resulting in fast charge collection and limited charge sharing. The small electrode spacing leads to the detectors having lower depletion voltages. This, combined with the fast collection time, makes 3D detectors a candidate for radiation hard applications. These applications include the upgra...

  6. Serial powering Proof of principle demonstration of a scheme for the operation of a large pixel detector at the LHC

    CERN Document Server

    Ta, D B; Hugging, F; Fischer, P; Grosse-Knetter, J; Runólfsson, O; Wermes, N

    2006-01-01

    Large detectors in high-energy physics experiments are mostly built from many identical individual building blocks, called modules, which possess individual parts of the services. The modules are usually also powered by parallel power lines such that they can be individually operated. The main disadvantage of such a parallel powering scheme is the vast amount of necessary power cables which constitutes also a large amount of material in the path of the particles to be detected. For the LHC experiments already now this is a major problem for the optimal performance of the detectors and it has become evident, that for an upgrade programme alternative powering schemes must be investigated. We prove and demonstrate here for the example of the large scale pixel detector of ATLAS that Serial Powering of pixel modules is a viable alternative. A powering scheme using dedicated voltage regulators and modified flex hybrid circuits has been devised and implemented for ATLAS pixel modules. The modules have been intensive...

  7. The Phase-1 upgrade of the CMS silicon pixel detector

    CERN Document Server

    Menichelli, Mauro

    2015-01-01

    The present CMS pixel detector will be replaced in the shutdown period 2016/17 by an upgraded version due to the following reasons: increased luminosity at reduced bunch spacing ( from 7 x 10 33 cm - 2 s - 1 at 50 ns bunch spacing to 2 x 10 34 cm - 2 s - 1 at 25 ns bunch spacing) in the LHC , and radiation damage effects that will significantly degrade the present detector. The new upgraded detector will have higher tracking efficiency and lower mass with four barrel layer and three forward/backward disks to provide higher hit pixel coverage out to pseudorapidities of ±2.5. In this paper we will describe the new pixel detector focus ing mostly on the barrel detector design, construction and expected performances

  8. The Phase-1 upgrade of the CMS pixel detector

    Science.gov (United States)

    Klein, Katja

    2017-02-01

    The CMS experiment features a pixel detector with three barrel layers and two discs per side, corresponding to an active silicon area of 1 m2. The detector delivered high-quality data during LHC Run 1. However, the CMS pixel detector was designed for the nominal instantaneous LHC luminosity of 1 ·1034cm-2s-1 . It is expected that the instantaneous luminosity will increase and reach twice the design value before Long Shutdown 3, scheduled for 2023. Under such conditions, the present readout chip would suffer from data loss due to buffer overflow, leading to significant inefficiencies of up to 16%. The CMS collaboration is presently constructing a new pixel detector to replace the present device during the winter shutdown 2016/2017. The design of this new detector will be outlined, the construction status summarized and the performance described.

  9. HEXITEC ASIC-a pixellated readout chip for CZT detectors

    Energy Technology Data Exchange (ETDEWEB)

    Jones, Lawrence [STFC Rutherford Appleton Laboratory, Didcot OX11 0QX (United Kingdom)], E-mail: l.l.jones@stfc.ac.uk; Seller, Paul; Wilson, Matthew; Hardie, Alec [STFC Rutherford Appleton Laboratory, Didcot OX11 0QX (United Kingdom)

    2009-06-01

    HEXITEC is a collaborative project with the aim of developing a new range of detectors for high-energy X-ray imaging. High-energy X-ray imaging has major advantages over current lower energy imaging for the life and physical sciences, including improved phase-contrast images on larger, higher density samples and with lower accumulated doses. However, at these energies conventional silicon-based devices cannot be used, hence, the requirement for a new range of high Z-detector materials. Underpinning the HEXITEC programme are the development of a pixellated Cadmium Zinc Telluride (CZT) detectors and a pixellated readout ASIC which will be bump-bonded to the detector. The HEXITEC ASIC is required to have low noise (20 electrons rms) and tolerate detector leakage currents. A prototype 20x20 pixel ASIC has been developed and manufactured on a standard 0.35 {mu}m CMOS process.

  10. HEXITEC ASIC—a pixellated readout chip for CZT detectors

    Science.gov (United States)

    Jones, Lawrence; Seller, Paul; Wilson, Matthew; Hardie, Alec

    2009-06-01

    HEXITEC is a collaborative project with the aim of developing a new range of detectors for high-energy X-ray imaging. High-energy X-ray imaging has major advantages over current lower energy imaging for the life and physical sciences, including improved phase-contrast images on larger, higher density samples and with lower accumulated doses. However, at these energies conventional silicon-based devices cannot be used, hence, the requirement for a new range of high Z-detector materials. Underpinning the HEXITEC programme are the development of a pixellated Cadmium Zinc Telluride (CZT) detectors and a pixellated readout ASIC which will be bump-bonded to the detector. The HEXITEC ASIC is required to have low noise (20 electrons rms) and tolerate detector leakage currents. A prototype 20×20 pixel ASIC has been developed and manufactured on a standard 0.35 μm CMOS process.

  11. The Phase-1 Upgrade of the CMS Pixel Detector

    CERN Document Server

    Klein, Katja

    2016-01-01

    The CMS experiment features a pixel detector with three barrel layers and two disks per side, corresponding to an active silicon area of 1\\,m$^2$. The detector delivered high-quality data during LHC Run~1. However, the CMS pixel detector was designed for the nominal instantaneous LHC luminosity of $1\\cdot 10^{34}\\,$cm$^{-2}$s$^{-1}$. It is expected that the instantaneous luminosity will increase and reach twice the design value before Long Shutdown 3, scheduled for 2023. Under such conditions, the present readout chip would suffer from data loss due to buffer overflow, leading to significant inefficiencies of up to~16\\,\\%. The CMS collaboration is presently constructing a new pixel detector to replace the present device during the winter shutdown 2016/2017. The design of this new detector will be outlined, the construction status summarized and the performance described.

  12. Planar Pixel Sensors for the ATLAS Upgrade: Beam Tests results

    CERN Document Server

    Weingarten, J; Beimforde, M; Benoit, M; Bomben, M; Calderini, G; Gallrapp, C; George, M; Gibson, S; Grinstein, S; Janoska, Z; Jentzsch, J; Jinnouchi, O; Kishida, T; La Rosa, A; Libov, V; Macchiolo, A; Marchiori, G; Münstermann, D; Nagai, R; Piacquadio, G; Ristic, B; Rubinskiy, I; Rummler, A; Takubo, Y; Troska, G; Tsiskaridtze, S; Tsurin, I; Unno, Y; Weigel, P; Wittig, T

    2012-01-01

    Results of beam tests with planar silicon pixel sensors aimed towards the ATLAS Insertable B-Layer and High Luminosity LHC (HL-LHC) upgrades are presented. Measurements include spatial resolution, charge collection performance and charge sharing between neighbouring cells as a function of track incidence angle for different bulk materials. Measurements of n-in-n pixel sensors are presented as a function of fluence for different irradiations. Furthermore p-type silicon sensors from several vendors with slightly differing layouts were tested. All tested sensors were connected by bump-bonding to the ATLAS Pixel read-out chip. We show that both n-type and p-type tested planar sensors are able to collect significant charge even after integrated fluences expected at HL-LHC.

  13. First Results of the Pixel Detector Performance in 2015

    CERN Document Server

    CMS Collaboration

    2015-01-01

    The CMS pixel detector consists of 66 million pixels arranged in three cylindric layers in the barrel region and two end-cap disks on each side of the barrel. It is used for seeding in track reconstruction. It is also the most important tool for vertex reconstruction. This report documents the good fraction of the pixel detector at the start of data-taking in 2015, its efficiency at low luminosity and 50 ns bunch-spacing, and the first measurements of the Lorentz-angle. Details are also given on the timing adjustment in the first collisions, and verification of the full depletion voltage.

  14. Evaluation of the breakdown behaviour of ATLAS silicon pixel sensors after partial guard-ring removal

    Energy Technology Data Exchange (ETDEWEB)

    Goessling, C.; Klingenberg, R. [Lehrstuhl fuer Experimentelle Physik IV, TU Dortmund, 44221 Dortmund (Germany); Muenstermann, D., E-mail: Daniel.Muenstermann@TU-Dortmund.d [Lehrstuhl fuer Experimentelle Physik IV, TU Dortmund, 44221 Dortmund (Germany); Wittig, T. [Lehrstuhl fuer Experimentelle Physik IV, TU Dortmund, 44221 Dortmund (Germany)

    2010-12-11

    To avoid geometrical inefficiencies in the ATLAS pixel detector, the concept of shingling is used up to now in the barrel section. For the upgrades of ATLAS, it is desired to avoid this as it increases the volume and material budget of the pixel layers and complicates the cooling. A direct planar edge-to-edge arrangement of pixel modules has not been possible in the past due to about 1100{mu}m of inactive edge composed of approximately 600{mu}m of guard rings and 500{mu}m of safety margin. In this work, the safety margin and guard rings of ATLAS SingleChip sensors were cut at different positions using a standard diamond dicing saw and irradiated afterwards to explore the breakdown behaviour and the leakage current development. It is found that the inactive edge can be reduced to about 400{mu}m of guard rings with almost no reduction in pre-irradiation testability and leakage current performance. This is in particular important for the insertable b-layer upgrade of ATLAS (IBL) where inactive edges of less than 450{mu}m width are required.

  15. The phase-II ATLAS pixel tracker upgrade: layout and mechanics.

    CERN Document Server

    Sharma, Abhishek; The ATLAS collaboration

    2016-01-01

    The ATLAS experiment will upgrade its tracking detector during the Phase-II LHC shutdown, to better take advantage of the increased luminosity of the HL-LHC. The upgraded tracker will consist of silicon-strip modules surrounding a pixel detector, and will likely cover an extended eta range, perhaps as far as |eta|<4.0. A number of layout and supporting-structure options are being considered for the pixel detector, with the final choice expected to be made in early 2017. The proposed supporting structures are based on lightweight, highly-thermally-conductive carbon-based materials and are cooled by evaporative carbon dioxide. The various layouts will be described and a description of the supporting structures will be presented, along with results from testing of prototypes.

  16. Pixel-level Analog-To-Digital Converters for Hybrid Pixel Detectors with energy sensitivity

    NARCIS (Netherlands)

    San Segundo Bello, David; Nauta, Bram; Visschers, Jan

    2000-01-01

    Single-photon counting hybrid pixel detectors have shown to be a valid alternative to other types of X-ray imaging devices due to their high sensitivity, low noise, linear behavior and wide dynamic range. One important advantage of these devices is the fact that detector and readout electronics are

  17. Design of pixel-level ADCs for energy-sensitive hybrid pixel detectors

    NARCIS (Netherlands)

    San Segundo Bello, David; Nauta, Bram; Visschers, Jan

    2000-01-01

    Single-photon counting hybrid pixel detectors have shown to be a valid alternative to other types of X-ray imaging devices due to their high sensitivity, low noise, linear behavior and wide dynamic range. One important advantage of these devices is the fact that detector and readout electronics are

  18. Characterization of active CMOS sensors for capacitively coupled pixel detectors

    Energy Technology Data Exchange (ETDEWEB)

    Hirono, Toko; Gonella, Laura; Janssen, Jens; Hemperek, Tomasz; Huegging, Fabian; Krueger, Hans; Wermes, Norbert [Institute of Physics, University of Bonn (Germany); Peric, Ivan [Institut fuer Prozessdatenverarbeitung und Elektronik, Karlsruher Institut fuer Technologie, Karlsruhe (Germany)

    2015-07-01

    Active CMOS pixel sensor is one of the most attractive candidates for detectors of upcoming particle physics experiments. In contrast to conventional sensors of hybrid detectors, signal processing circuit can be integrated in the active CMOS sensor. The characterization and optimization of the pixel circuit are indispensable to obtain a good performance from the sensors. The prototype chips of the active CMOS sensor were fabricated in the AMS 180nm and L-Foundry 150 nm CMOS processes, respectively a high voltage and high resistivity technology. Both chips have a charge sensitive amplifier and a comparator in each pixel. The chips are designed to be glued to the FEI4 pixel readout chip. The signals from 3 pixels of the prototype chips are capacitively coupled to the FEI4 input pads. We have performed lab tests and test beams to characterize the prototypes. In this presentation, the measurement results of the active CMOS prototype sensors are shown.

  19. Slim edge studies, design and quality control of planar ATLAS IBL pixel sensors

    Energy Technology Data Exchange (ETDEWEB)

    Wittig, Tobias

    2013-05-08

    One of the four large experiments at the LHC at CERN is the ATLAS detector, a multi purpose detector. Its pixel detector, composed of three layers, is the innermost part of the tracker. As it is closest to the interaction point, it represents a basic part of the track reconstruction. Besides the requested high resolution one main requirement is the radiation hardness. In the coming years the radiation damage will cause deteriorations of the detector performance. With the planned increase of the luminosity, especially after the upgrade to the High Luminosity LHC, this radiation damage will be even intensified. This circumstance necessitates a new pixel detector featuring improved radiation hard sensors and read-out chips. The present shutdown of the LHC is already utilized to insert an additional b-layer (IBL) into the existing ATLAS pixel detector. The current n-in-n pixel sensor design had to be adapted to the new read-out chip and the module specifications. The new stave geometry requests a reduction of the inactive sensor edge. In a prototype wafer production all modifications have been implemented. The sensor quality control was supervised which led to the decision of the final sensor thickness. In order to evaluate the performance of the sensor chip assemblies with an innovative slim edge design, they have been operated in test beam setups before and after irradiation. Furthermore, the quality control of the planar IBL sensor wafer production was supervised from the stage of wafer delivery to that before the flip chip process to ensure a sufficient amount of functional sensors for the module production.

  20. The phase 1 upgrade \\\\ of the CMS pixel detector

    CERN Document Server

    Verzocchi, Marco

    2016-01-01

    The CMS collaboration is building a replacement for the pixel detector that will be installed in the extended end of year shutdown 2016-2017. This contribution reviews the motivations for the upgrade, the technological choices made, the status of the construction of this new detector and the plans for installation and commissioning.

  1. Charge induction in semiconductor detectors with pixellated structure

    NARCIS (Netherlands)

    Samedov, Victor V.

    2007-01-01

    Considerable interest is now being attracted to the next generation of compound semiconductor detectors with pixellated structure in application to x-ray and gamma-astronomy, nuclear spectroscopy and nuclear medicine. The spatial resolution of this type of detectors is mainly determined by the proce

  2. Study of FPGA and GPU based pixel calibration for ATLAS IBL

    CERN Document Server

    Dopke, J; The ATLAS collaboration; Flick, T; Gabrielli, A; Grosse-Knetter, J; Krieger, N; Kugel, A; Polini, A; Schroer, N

    2010-01-01

    The insertable B-layer (IBL) is a new stage of the ATLAS pixel detector to be installed around 2014. 12 million pixel are attached to new FE-I4 readout ASICs, each controlling 26680 pixel. Compared to the existing FE-I3 based detector the new system features higher readout speed of 160Mbit/s per ASIC and simplified control. For calibration defined charges are applied to all pixels and the resulting time-over-threshold values are evaluated. In the present system multiple sets of two custom VME cards which employ a combination of FPGA and DSP technology are used for I/O interfacing, formatting and processing. The execution time of 51s to perform a threshold scan on a FE-I3 module of 46080 pixel is composed of 8s control, 29s transfer, 7.5s histogramming and 7s analysis. Extrapolating to FE-I4 the times per module of 53760 pixels are 12ms, 5.8s, 9.4s and 8.3s, a total of 23.5s. We present a proposal for a novel approach to the dominant tasks for FE-I4: histogramming and ananlysis. An FPGA-based histogramming uni...

  3. Studies of the ATLAS Inner Detector material using $\\sqrt{s}=$13 TeV $pp$ collision data

    CERN Document Server

    The ATLAS collaboration

    2015-01-01

    The ATLAS Inner Detector comprises three different technologies: the Pixel detector (Pixel), the silicon strip tracker (SCT), and the transition radiation drift tube tracker (TRT). The material in the ATLAS Inner Detector is studied with several methods, using the $pp$ collision sample collected at $\\sqrt{s}=$13 TeV in 2015. The material within the innermost barrel regions of the ATLAS Inner Detector is studied using reconstructed hadronic interaction and photon conversion vertices from samples of minimum bias events. It was found that the description of the Insertable B-Layer, which is the new, innermost Pixel layer installed in 2014, in the geometry model was missing some material components. After updating the model, data and simulation show good agreement at the barrel region. The Pixel services (cables, cooling pipes, support trays) were modified between the Pixel and SCT detectors in 2014. The material in this region is also studied by investigating the efficiency with which tracks reconstructed only in...

  4. The ATLAS Inner Detector commissioning and calibration

    CERN Document Server

    Aad, Georges; Abdallah, Jalal; Abdelalim, Ahmed Ali; Abdesselam, Abdelouahab; Abdinov, Ovsat; Abi, Babak; Abolins, Maris; Abramowicz, Halina; Abreu, Henso; Acharya, Bobby Samir; Adams, David; Addy, Tetteh; Adelman, Jahred; Adorisio, Cristina; Adragna, Paolo; Adye, Tim; Aefsky, Scott; Aguilar-Saavedra, Juan Antonio; Aharrouche, Mohamed; Ahlen, Steven; Ahles, Florian; Ahmad, Ashfaq; Ahsan, Mahsana; Aielli, Giulio; Akdogan, Taylan; Åkesson, Torsten Paul Ake; Akimoto, Ginga; Akimov , Andrei; Aktas, Adil; Alam, Mohammad; Alam, Muhammad Aftab; Albrand, Solveig; Aleksa, Martin; Aleksandrov, Igor; Alexa, Calin; Alexander, Gideon; Alexandre, Gauthier; Alexopoulos, Theodoros; Alhroob, Muhammad; Aliev, Malik; Alimonti, Gianluca; Alison, John; Aliyev, Magsud; Allport, Phillip; Allwood-Spiers, Sarah; Almond, John; Aloisio, Alberto; Alon, Raz; Alonso, Alejandro; Alviggi, Mariagrazia; Amako, Katsuya; Amelung, Christoph; Amorim, Antonio; Amorós, Gabriel; Amram, Nir; Anastopoulos, Christos; Andeen, Timothy; Anders, Christoph Falk; Anderson, Kelby; Andreazza, Attilio; Andrei, George Victor; Anduaga, Xabier; Angerami, Aaron; Anghinolfi, Francis; Anjos, Nuno; Annovi, Alberto; Antonaki, Ariadni; Antonelli, Mario; Antonelli, Stefano; Antos, Jaroslav; Antunovic, Bijana; Anulli, Fabio; Aoun, Sahar; Arabidze, Giorgi; Aracena, Ignacio; Arai, Yasuo; Arce, Ayana; Archambault, John-Paul; Arfaoui, Samir; Arguin, Jean-Francois; Argyropoulos, Theodoros; Arik, Metin; Armbruster, Aaron James; Arnaez, Olivier; Arnault, Christian; Artamonov, Andrei; Arutinov, David; Asai, Makoto; Asai, Shoji; Silva, José; Asfandiyarov, Ruslan; Ask, Stefan; Åsman, Barbro; Asner, David; Asquith, Lily; Assamagan, Ketevi; Astvatsatourov, Anatoli; Atoian, Grigor; Auerbach, Benjamin; Augsten, Kamil; Aurousseau, Mathieu; Austin, Nicholas; Avolio, Giuseppe; Avramidou, Rachel Maria; Ay, Cano; Azuelos, Georges; Azuma, Yuya; Baak, Max; Bach, Andre; Bachacou, Henri; Bachas, Konstantinos; Backes, Moritz; Badescu, Elisabeta; Bagnaia, Paolo; Bai, Yu; Bain, Travis; Baines, John; Baker, Mark; Baker, Oliver Keith; Baker, Sarah; Baltasar Dos Santos Pedrosa, Fernando; Banas, Elzbieta; Banerjee, Piyali; Banerjee, Swagato; Banfi, Danilo; Bangert, Andrea Michelle; Bansal, Vikas; Baranov, Sergei; Barashkou, Andrei; Barber, Tom; Barberio, Elisabetta Luigia; Barberis, Dario; Barbero, Marlon; Bardin, Dmitri; Barillari, Teresa; Barisonzi, Marcello; Barklow, Timothy; Barlow, Nick; Barnett, Bruce; Barnett, Michael; Baroncelli, Antonio; Barr, Alan; Barreiro, Fernando; Barreiro Guimarães da Costa, João; Barrillon, Pierre; Bartoldus, Rainer; Bartsch, Detlef; Bates, Richard; Batkova, Lucia; Batley, Richard; Battaglia, Andreas; Battistin, Michele; Bauer, Florian; Bawa, Harinder Singh; Bazalova, Magdalena; Beare, Brian; Beau, Tristan; Beauchemin, Pierre-Hugues; Beccherle, Roberto; Bechtle, Philip; Beck, Graham; Beck, Hans Peter; Beckingham, Matthew; Becks, Karl-Heinz; Beddall, Ayda; Beddall, Andrew; Bednyakov, Vadim; Bee, Christopher; Begel, Michael; Behar Harpaz, Silvia; Behera, Prafulla; Beimforde, Michael; Belanger-Champagne, Camille; Bell, Paul; Bell, William; Bella, Gideon; Bellagamba, Lorenzo; Bellina, Francesco; Bellomo, Massimiliano; Belloni, Alberto; Belotskiy, Konstantin; Beltramello, Olga; Ben Ami, Sagi; Benary, Odette; Benchekroun, Driss; Bendel, Markus; Benedict, Brian Hugues; Benekos, Nektarios; Benhammou, Yan; Benjamin, Douglas; Benoit, Mathieu; Bensinger, James; Benslama, Kamal; Bentvelsen, Stan; Beretta, Matteo; Berge, David; Bergeaas Kuutmann, Elin; Berger, Nicolas; Berghaus, Frank; Berglund, Elina; Beringer, Jürg; Bernabéu , José; Bernat, Pauline; Bernhard, Ralf; Bernius, Catrin; Berry, Tracey; Bertin, Antonio; Besana, Maria Ilaria; Besson, Nathalie; Bethke, Siegfried; Bianchi, Riccardo-Maria; Bianco, Michele; Biebel, Otmar; Biesiada, Jed; Biglietti, Michela; Bilokon, Halina; Bindi, Marcello; Bingul, Ahmet; Bini, Cesare; Biscarat, Catherine; Bitenc, Urban; Black, Kevin; Blair, Robert; Blanchard, Jean-Baptiste; Blanchot, Georges; Blocker, Craig; Blondel, Alain; Blum, Walter; Blumenschein, Ulrike; Bobbink, Gerjan; Bocci, Andrea; Boehler, Michael; Boek, Jennifer; Boelaert, Nele; Böser, Sebastian; Bogaerts, Joannes Andreas; Bogouch, Andrei; Bohm, Christian; Bohm, Jan; Boisvert, Veronique; Bold, Tomasz; Boldea, Venera; Bondarenko, Valery; Bondioli, Mario; Boonekamp, Maarten; Bordoni, Stefania; Borer, Claudia; Borisov, Anatoly; Borissov, Guennadi; Borjanovic, Iris; Borroni, Sara; Bos, Kors; Boscherini, Davide; Bosman, Martine; Boterenbrood, Hendrik; Bouchami, Jihene; Boudreau, Joseph; Bouhova-Thacker, Evelina Vassileva; Boulahouache, Chaouki; Bourdarios, Claire; Boveia, Antonio; Boyd, James; Boyko, Igor; Bozovic-Jelisavcic, Ivanka; Bracinik, Juraj; Braem, André; Branchini, Paolo; Brandt, Andrew; Brandt, Gerhard; Brandt, Oleg; Bratzler, Uwe; Brau, Benjamin; Brau, James; Braun, Helmut; Brelier, Bertrand; Bremer, Johan; Brenner, Richard; Bressler, Shikma; Britton, Dave; Brochu, Frederic; Brock, Ian; Brock, Raymond; Brodet, Eyal; Bromberg, Carl; Brooijmans, Gustaaf; Brooks, William; Brown, Gareth; Bruckman de Renstrom, Pawel; Bruncko, Dusan; Bruneliere, Renaud; Brunet, Sylvie; Bruni, Alessia; Bruni, Graziano; Bruschi, Marco; Bucci, Francesca; Buchanan, James; Buchholz, Peter; Buckley, Andrew; Budagov, Ioulian; Budick, Burton; Büscher, Volker; Bugge, Lars; Bulekov, Oleg; Bunse, Moritz; Buran, Torleiv; Burckhart, Helfried; Burdin, Sergey; Burgess, Thomas; Burke, Stephen; Busato, Emmanuel; Bussey, Peter; Buszello, Claus-Peter; Butin, Françcois; Butler, Bart; Butler, John; Buttar, Craig; Butterworth, Jonathan; Byatt, Tom; Caballero, Jose; Cabrera Urbán, Susana; Caforio, Davide; Cakir, Orhan; Calafiura, Paolo; Calderini, Giovanni; Calfayan, Philippe; Calkins, Robert; Caloba, Luiz; Calvet, David; Camarri, Paolo; Cameron, David; Campana, Simone; Campanelli, Mario; Canale, Vincenzo; Canelli, Florencia; Canepa, Anadi; Cantero, Josu; Capasso, Luciano; Capeans Garrido, Maria Del Mar; Caprini, Irinel; Caprini, Mihai; Capua, Marcella; Caputo, Regina; Caramarcu, Costin; Cardarelli, Roberto; Carli, Tancredi; Carlino, Gianpaolo; Carminati, Leonardo; Caron, Bryan; Caron, Sascha; Carrillo Montoya, German D.; Carron Montero, Sebastian; Carter, Antony; Carter, Janet; Carvalho, João; Casadei, Diego; Casado, Maria Pilar; Cascella, Michele; Castaneda Hernandez, Alfredo Martin; Castaneda-Miranda, Elizabeth; Castillo Gimenez, Victoria; Castro, Nuno Filipe; Cataldi, Gabriella; Catinaccio, Andrea; Catmore, James; Cattai, Ariella; Cattani, Giordano; Caughron, Seth; Cavalleri, Pietro; Cavalli, Donatella; Cavalli-Sforza, Matteo; Cavasinni, Vincenzo; Ceradini, Filippo; Cerqueira, Augusto Santiago; Cerri, Alessandro; Cerrito, Lucio; Cerutti, Fabio; Cetin, Serkant Ali; Chafaq, Aziz; Chakraborty, Dhiman; Chan, Kevin; Chapman, John Derek; Chapman, John Wehrley; Chareyre, Eve; Charlton, Dave; Chavda, Vikash; Cheatham, Susan; Chekanov, Sergei; Chekulaev, Sergey; Chelkov, Gueorgui; Chen, Hucheng; Chen, Shenjian; Chen, Xin; Cheplakov, Alexander; Chepurnov, Vladimir; Cherkaoui El Moursli, Rajaa; Tcherniatine, Valeri; Chesneanu, Daniela; Cheu, Elliott; Cheung, Sing-Leung; Chevalier, Laurent; Chevallier, Florent; Chiefari, Giovanni; Chikovani, Leila; Childers, John Taylor; Chilingarov, Alexandre; Chiodini, Gabriele; Chizhov, Mihail; Choudalakis, Georgios; Chouridou, Sofia; Christidi, Illectra-Athanasia; Christov, Asen; Chromek-Burckhart, Doris; Chu, Ming-Lee; Chudoba, Jiri; Ciapetti, Guido; Ciftci, Abbas Kenan; Ciftci, Rena; Cinca, Diane; Cindro, Vladimir; Ciobotaru, Matei Dan; Ciocca, Claudia; Ciocio, Alessandra; Cirilli, Manuela; Clark, Allan G.; Clark, Philip James; Cleland, Bill; Clemens, Jean-Claude; Clement, Benoit; Clement, Christophe; Coadou, Yann; Cobal, Marina; Coccaro, Andrea; Cochran, James H.; Coggeshall, James; Cogneras, Eric; Colijn, Auke-Pieter; Collard, Caroline; Collins, Neil; Collins-Tooth, Christopher; Collot, Johann; Colon, German; Conde Muiño, Patricia; Coniavitis, Elias; Conidi, Maria Chiara; Consonni, Michele; Constantinescu, Serban; Conta, Claudio; Conventi, Francesco; Cooke, Mark; Cooper, Ben; Cooper-Sarkar, Amanda; Cooper-Smith, Neil; Copic, Katherine; Cornelissen, Thijs; Corradi, Massimo; Corriveau, Francois; Corso-Radu, Alina; Cortes-Gonzalez, Arely; Cortiana, Giorgio; Costa, Giuseppe; Costa, María José; Costanzo, Davide; Costin, Tudor; Côté, David; Coura Torres, Rodrigo; Courneyea, Lorraine; Cowan, Glen; Cowden, Christopher; Cox, Brian; Cranmer, Kyle; Cranshaw, Jack; Cristinziani, Markus; Crosetti, Giovanni; Crupi, Roberto; Crépé-Renaudin, Sabine; Cuenca Almenar, Cristóbal; Cuhadar Donszelmann, Tulay; Curatolo, Maria; Curtis, Chris; Cwetanski, Peter; Czyczula, Zofia; D'Auria, Saverio; D'Onofrio, Monica; D'Orazio, Alessia; Da Via, Cinzia; Dabrowski, Wladyslaw; Dai, Tiesheng; Dallapiccola, Carlo; Dallison, Steve; Daly, Colin; Dam, Mogens; Danielsson, Hans Olof; Dannheim, Dominik; Dao, Valerio; Darbo, Giovanni; Darlea, Georgiana Lavinia; Davey, Will; Davidek, Tomas; Davidson, Nadia; Davidson, Ruth; Davies, Merlin; Davison, Adam; Dawson, Ian; Daya, Rozmin; De, Kaushik; de Asmundis, Riccardo; De Castro, Stefano; De Castro Faria Salgado, Pedro; De Cecco, Sandro; de Graat, Julien; De Groot, Nicolo; de Jong, Paul; De Mora, Lee; De Oliveira Branco, Miguel; De Pedis, Daniele; De Salvo, Alessandro; De Sanctis, Umberto; De Santo, Antonella; De Vivie De Regie, Jean-Baptiste; Dean, Simon; Dedovich, Dmitri; Degenhardt, James; Dehchar, Mohamed; Del Papa, Carlo; Del Peso, Jose; Del Prete, Tarcisio; Dell'Acqua, Andrea; Dell'Asta, Lidia; Della Pietra, Massimo; della Volpe, Domenico; Delmastro, Marco; Delsart, Pierre-Antoine; Deluca, Carolina; Demers, Sarah; Demichev, Mikhail; Demirkoz, Bilge; Deng, Jianrong; Deng, Wensheng; Denisov, Sergey; Derkaoui, Jamal Eddine; Derue, Frederic; Dervan, Paul; Desch, Klaus Kurt; Deviveiros, Pier-Olivier; Dewhurst, Alastair; DeWilde, Burton; Dhaliwal, Saminder; Dhullipudi, Ramasudhakar; Di Ciaccio, Anna; Di Ciaccio, Lucia; Di Girolamo, Alessandro; Di Girolamo, Beniamino; Di Luise, Silvestro; Di Mattia, Alessandro; Di Nardo, Roberto; Di Simone, Andrea; Di Sipio, Riccardo; Diaz, Marco Aurelio; Diblen, Faruk; Diehl, Edward; Dietrich, Janet; Dietzsch, Thorsten; Diglio, Sara; Dindar Yagci, Kamile; Dingfelder, Jochen; Dionisi, Carlo; Dita, Petre; Dita, Sanda; Dittus, Fridolin; Djama, Fares; Djilkibaev, Rashid; Djobava, Tamar; do Vale, Maria Aline Barros; Do Valle Wemans, André; Doan, Thi Kieu Oanh; Dobos, Daniel; Dobson, Ellie; Dobson, Marc; Doglioni, Caterina; Doherty, Tom; Dolejsi, Jiri; Dolenc, Irena; Dolezal, Zdenek; Dolgoshein, Boris; Dohmae, Takeshi; Donega, Mauro; Donini, Julien; Dopke, Jens; Doria, Alessandra; Dos Anjos, Andre; Dotti, Andrea; Dova, Maria-Teresa; Doxiadis, Alexander; Doyle, Tony; Drasal, Zbynek; Dris, Manolis; Dubbert, Jörg; Duchovni, Ehud; Duckeck, Guenter; Dudarev, Alexey; Dudziak, Fanny; Dührssen , Michael; Duflot, Laurent; Dufour, Marc-Andre; Dunford, Monica; Duran Yildiz, Hatice; Duxfield, Robert; Dwuznik, Michal; Düren, Michael; Ebenstein, William; Ebke, Johannes; Eckweiler, Sebastian; Edmonds, Keith; Edwards, Clive; Egorov, Kirill; Ehrenfeld, Wolfgang; Ehrich, Thies; Eifert, Till; Eigen, Gerald; Einsweiler, Kevin; Eisenhandler, Eric; Ekelof, Tord; El Kacimi, Mohamed; Ellert, Mattias; Elles, Sabine; Ellinghaus, Frank; Ellis, Katherine; Ellis, Nicolas; Elmsheuser, Johannes; Elsing, Markus; Emeliyanov, Dmitry; Engelmann, Roderich; Engl, Albert; Epp, Brigitte; Eppig, Andrew; Erdmann, Johannes; Ereditato, Antonio; Eriksson, Daniel; Ermoline, Iouri; Ernst, Jesse; Ernst, Michael; Ernwein, Jean; Errede, Deborah; Errede, Steven; Ertel, Eugen; Escalier, Marc; Escobar, Carlos; Espinal Curull, Xavier; Esposito, Bellisario; Etienvre, Anne-Isabelle; Etzion, Erez; Evans, Hal; Fabbri, Laura; Fabre, Caroline; Facius, Katrine; Fakhrutdinov, Rinat; Falciano, Speranza; Fang, Yaquan; Fanti, Marcello; Farbin, Amir; Farilla, Addolorata; Farley, Jason; Farooque, Trisha; Farrington, Sinead; Farthouat, Philippe; Fassnacht, Patrick; Fassouliotis, Dimitrios; Fatholahzadeh, Baharak; Fayard, Louis; Fayette, Florent; Febbraro, Renato; Federic, Pavol; Fedin, Oleg; Fedorko, Woiciech; Feligioni, Lorenzo; Felzmann, Ulrich; Feng, Cunfeng; Feng, Eric; Fenyuk, Alexander; Ferencei, Jozef; Ferland, Jonathan; Fernandes, Bruno; Fernando, Waruna; Ferrag, Samir; Ferrando, James; Ferrara, Valentina; Ferrari, Arnaud; Ferrari, Pamela; Ferrari, Roberto; Ferrer, Antonio; Ferrer, Maria Lorenza; Ferrere, Didier; Ferretti, Claudio; Fiascaris, Maria; Fiedler, Frank; Filipčič, Andrej; Filippas, Anastasios; Filthaut, Frank; Fincke-Keeler, Margret; Fiolhais, Miguel; Fiorini, Luca; Firan, Ana; Fischer, Gordon; Fisher, Matthew; Flechl, Martin; Fleck, Ivor; Fleckner, Johanna; Fleischmann, Philipp; Fleischmann, Sebastian; Flick, Tobias; Flores Castillo, Luis; Flowerdew, Michael; Fonseca Martin, Teresa; Formica, Andrea; Forti, Alessandra; Fortin, Dominique; Fournier, Daniel; Fowler, Andrew; Fowler, Ken; Fox, Harald; Francavilla, Paolo; Franchino, Silvia; Francis, David; Franklin, Melissa; Franz, Sebastien; Fraternali, Marco; Fratina, Sasa; Freestone, Julian; French, Sky; Froeschl, Robert; Froidevaux, Daniel; Frost, James; Fukunaga, Chikara; Fullana Torregrosa, Esteban; Fuster, Juan; Gabaldon, Carolina; Gabizon, Ofir; Gadfort, Thomas; Gadomski, Szymon; Gagliardi, Guido; Gagnon, Pauline; Galea, Cristina; Gallas, Elizabeth; Gallo, Valentina Santina; Gallop, Bruce; Gallus, Petr; Galyaev, Eugene; Gan, K K; Gao, Yongsheng; Gaponenko, Andrei; Garcia-Sciveres, Maurice; García, Carmen; García Navarro, José Enrique; Gardner, Robert; Garelli, Nicoletta; Garitaonandia, Hegoi; Garonne, Vincent; Gatti, Claudio; Gaudio, Gabriella; Gautard, Valerie; Gauzzi, Paolo; Gavrilenko, Igor; Gay, Colin; Gaycken, Goetz; Gazis, Evangelos; Ge, Peng; Gee, Norman; Geich-Gimbel, Christoph; Gellerstedt, Karl; Gemme, Claudia; Genest, Marie-Hélène; Gentile, Simonetta; Georgatos, Fotios; George, Simon; Gershon, Avi; Ghazlane, Hamid; Ghodbane, Nabil; Giacobbe, Benedetto; Giagu, Stefano; Giakoumopoulou, Victoria; Giangiobbe, Vincent; Gianotti, Fabiola; Gibbard, Bruce; Gibson, Adam; Gibson, Stephen; Gilbert, Laura; Gilchriese, Murdock; Gilewsky, Valentin; Gingrich, Douglas; Ginzburg, Jonatan; Giokaris, Nikos; Giordani, MarioPaolo; Giordano, Raffaele; Giorgi, Francesco Michelangelo; Giovannini, Paola; Giraud, Pierre-Francois; Girtler, Peter; Giugni, Danilo; Giusti, Paolo; Gjelsten, Børge Kile; Gladilin, Leonid; Glasman, Claudia; Glazov, Alexandre; Glitza, Karl-Walter; Glonti, George; Godfrey, Jennifer; Godlewski, Jan; Goebel, Martin; Göpfert, Thomas; Goeringer, Christian; Gössling, Claus; Göttfert, Tobias; Goggi, Virginio; Goldfarb, Steven; Goldin, Daniel; Golling, Tobias; Gomes, Agostinho; Gomez Fajardo, Luz Stella; Gonçcalo, Ricardo; Gonella, Laura; Gong, Chenwei; González de la Hoz, Santiago; Gonzalez Silva, Laura; Gonzalez-Sevilla, Sergio; Goodson, Jeremiah Jet; Goossens, Luc; Gordon, Howard; Gorelov, Igor; Gorfine, Grant; Gorini, Benedetto; Gorini, Edoardo; Gorišek, Andrej; Gornicki, Edward; Gosdzik, Bjoern; Gosselink, Martijn; Gostkin, Mikhail Ivanovitch; Gough Eschrich, Ivo; Gouighri, Mohamed; Goujdami, Driss; Goulette, Marc Phillippe; Goussiou, Anna; Goy, Corinne; Grabowska-Bold, Iwona; Grafström, Per; Grahn, Karl-Johan; Grancagnolo, Sergio; Grassi, Valerio; Gratchev, Vadim; Grau, Nathan; Gray, Heather; Gray, Julia Ann; Graziani, Enrico; Green, Barry; Greenshaw, Timothy; Greenwood, Zeno Dixon; Gregor, Ingrid-Maria; Grenier, Philippe; Griesmayer, Erich; Griffiths, Justin; Grigalashvili, Nugzar; Grillo, Alexander; Grimm, Kathryn; Grinstein, Sebastian; Grishkevich, Yaroslav; Groh, Manfred; Groll, Marius; Gross, Eilam; Grosse-Knetter, Joern; Groth-Jensen, Jacob; Grybel, Kai; Guicheney, Christophe; Guida, Angelo; Guillemin, Thibault; Guler, Hulya; Gunther, Jaroslav; Guo, Bin; Gusakov, Yury; Gutierrez, Andrea; Gutierrez, Phillip; Guttman, Nir; Gutzwiller, Olivier; Guyot, Claude; Gwenlan, Claire; Gwilliam, Carl; Haas, Andy; Haas, Stefan; Haber, Carl; Hadavand, Haleh Khani; Hadley, David; Haefner, Petra; Hajduk, Zbigniew; Hakobyan, Hrachya; Haller, Johannes; Hamacher, Klaus; Hamilton, Andrew; Hamilton, Samuel; Han, Liang; Hanagaki, Kazunori; Hance, Michael; Handel, Carsten; Hanke, Paul; Hansen, Jørgen Beck; Hansen, Jorn Dines; Hansen, John Renner; Hansen, Peter Henrik; Hansl-Kozanecka, Traudl; Hansson, Per; Hara, Kazuhiko; Hare, Gabriel; Harenberg, Torsten; Harrington, Robert; Harris, Orin; Harrison, Karl; Hartert, Jochen; Hartjes, Fred; Harvey, Alex; Hasegawa, Satoshi; Hasegawa, Yoji; Hassani, Samira; Haug, Sigve; Hauschild, Michael; Hauser, Reiner; Havranek, Miroslav; Hawkes, Christopher; Hawkings, Richard John; Hayakawa, Takashi; Hayward, Helen; Haywood, Stephen; Head, Simon; Hedberg, Vincent; Heelan, Louise; Heim, Sarah; Heinemann, Beate; Heisterkamp, Simon; Helary, Louis; Heller, Mathieu; Hellman, Sten; Helsens, Clement; Hemperek, Tomasz; Henderson, Robert; Henke, Michael; Henrichs, Anna; Henriques Correia, Ana Maria; Henrot-Versille, Sophie; Hensel, Carsten; Henß, Tobias; Hernández Jiménez, Yesenia; Hershenhorn, Alon David; Herten, Gregor; Hertenberger, Ralf; Hervas, Luis; Hessey, Nigel; Higón-Rodriguez, Emilio; Hill, John; Hiller, Karl Heinz; Hillert, Sonja; Hillier, Stephen; Hinchliffe, Ian; Hines, Elizabeth; Hirose, Minoru; Hirsch, Florian; Hirschbuehl, Dominic; Hobbs, John; Hod, Noam; Hodgkinson, Mark; Hodgson, Paul; Hoecker, Andreas; Hoeferkamp, Martin; Hoffman, Julia; Hoffmann, Dirk; Hohlfeld, Marc; Holy, Tomas; Holzbauer, Jenny; Homma, Yasuhiro; Horazdovsky, Tomas; Hori, Takuya; Horn, Claus; Horner, Stephan; Hostachy, Jean-Yves; Hou, Suen; Hoummada, Abdeslam; Howe, Travis; Hrivnac, Julius; Hryn'ova, Tetiana; Hsu, Pai-hsien Jennifer; Hsu, Shih-Chieh; Huang, Guang Shun; Hubacek, Zdenek; Hubaut, Fabrice; Huegging, Fabian; Huffman, Todd Brian; Hughes, Emlyn; Hughes, Gareth; Hurwitz, Martina; Husemann, Ulrich; Huseynov, Nazim; Huston, Joey; Huth, John; Iacobucci, Giuseppe; Iakovidis, Georgios; Ibragimov, Iskander; Iconomidou-Fayard, Lydia; Idarraga, John; Iengo, Paolo; Igonkina, Olga; Ikegami, Yoichi; Ikeno, Masahiro; Ilchenko, Yuri; Iliadis, Dimitrios; Ince, Tayfun; Ioannou, Pavlos; Iodice, Mauro; Irles Quiles, Adrian; Ishikawa, Akimasa; Ishino, Masaya; Ishmukhametov, Renat; Isobe, Tadaaki; Issever, Cigdem; Istin, Serhat; Itoh, Yuki; Ivashin, Anton; Iwanski, Wieslaw; Iwasaki, Hiroyuki; Izen, Joseph; Izzo, Vincenzo; Jackson, Brett; Jackson, John; Jackson, Paul; Jaekel, Martin; Jain, Vivek; Jakobs, Karl; Jakobsen, Sune; Jakubek, Jan; Jana, Dilip; Jankowski, Ernest; Jansen, Eric; Jantsch, Andreas; Janus, Michel; Jarlskog, Göran; Jeanty, Laura; Jen-La Plante, Imai; Jenni, Peter; Jež, Pavel; Jézéquel, Stéphane; Ji, Weina; Jia, Jiangyong; Jiang, Yi; Jimenez Belenguer, Marcos; Jin, Shan; Jinnouchi, Osamu; Joffe, David; Johansen, Marianne; Johansson, Erik; Johansson, Per; Johnert, Sebastian; Johns, Kenneth; Jon-And, Kerstin; Jones, Graham; Jones, Roger; Jones, Tim; Jorge, Pedro; Joseph, John; Juranek, Vojtech; Jussel, Patrick; Kabachenko, Vasily; Kaci, Mohammed; Kaczmarska, Anna; Kado, Marumi; Kagan, Harris; Kagan, Michael; Kaiser, Steffen; Kajomovitz, Enrique; Kalinin, Sergey; Kalinovskaya, Lidia; Kama, Sami; Kanaya, Naoko; Kaneda, Michiru; Kantserov, Vadim; Kanzaki, Junichi; Kaplan, Benjamin; Kapliy, Anton; Kaplon, Jan; Kar, Deepak; Karagounis, Michael; Karagoz, Muge; Karnevskiy, Mikhail; Kartvelishvili, Vakhtang; Karyukhin, Andrey; Kashif, Lashkar; Kasmi, Azzedine; Kass, Richard; Kastanas, Alex; Kastoryano, Michael; Kataoka, Mayuko; Kataoka, Yousuke; Katsoufis, Elias; Katzy, Judith; Kaushik, Venkatesh; Kawagoe, Kiyotomo; Kawamoto, Tatsuo; Kawamura, Gen; Kayl, Manuel; Kayumov, Fred; Kazanin, Vassili; Kazarinov, Makhail; Keates, James Robert; Keeler, Richard; Keener, Paul; Kehoe, Robert; Keil, Markus; Kekelidze, George; Kelly, Marc; Kenyon, Mike; Kepka, Oldrich; Kerschen, Nicolas; Kerševan, Borut Paul; Kersten, Susanne; Kessoku, Kohei; Khakzad, Mohsen; Khalil-zada, Farkhad; Khandanyan, Hovhannes; Khanov, Alexander; Kharchenko, Dmitri; Khodinov, Alexander; Khomich, Andrei; Khoriauli, Gia; Khovanskiy, Nikolai; Khovanskiy, Valery; Khramov, Evgeniy; Khubua, Jemal; Kim, Hyeon Jin; Kim, Min Suk; Kim, Peter; Kim, Shinhong; Kind, Oliver; Kind, Peter; King, Barry; Kirk, Julie; Kirsch, Guillaume; Kirsch, Lawrence; Kiryunin, Andrey; Kisielewska, Danuta; Kittelmann, Thomas; Kiyamura, Hironori; Kladiva, Eduard; Klein, Max; Klein, Uta; Kleinknecht, Konrad; Klemetti, Miika; Klier, Amit; Klimentov, Alexei; Klingenberg, Reiner; Klinkby, Esben; Klioutchnikova, Tatiana; Klok, Peter; Klous, Sander; Kluge, Eike-Erik; Kluge, Thomas; Kluit, Peter; Klute, Markus; Kluth, Stefan; Knecht, Neil; Kneringer, Emmerich; Ko, Byeong Rok; Kobayashi, Tomio; Kobel, Michael; Koblitz, Birger; Kocian, Martin; Kocnar, Antonin; Kodys, Peter; Köneke, Karsten; König, Adriaan; Koenig, Sebastian; Köpke, Lutz; Koetsveld, Folkert; Koevesarki, Peter; Koffas, Thomas; Koffeman, Els; Kohn, Fabian; Kohout, Zdenek; Kohriki, Takashi; Kolanoski, Hermann; Kolesnikov, Vladimir; Koletsou, Iro; Koll, James; Kollar, Daniel; Kolos, Serguei; Kolya, Scott; Komar, Aston; Komaragiri, Jyothsna Rani; Kondo, Takahiko; Kono, Takanori; Konoplich, Rostislav; Konovalov, Serguei; Konstantinidis, Nikolaos; Koperny, Stefan; Korcyl, Krzysztof; Kordas, Kostantinos; Korn, Andreas; Korolkov, Ilya; Korolkova, Elena; Korotkov, Vladislav; Kortner, Oliver; Kortner, Sandra; Kostka, Peter; Kostyukhin, Vadim; Kotov, Serguei; Kotov, Vladislav; Kotov, Konstantin; Kourkoumelis, Christine; Koutsman, Alex; Kowalewski, Robert Victor; Kowalski, Henri; Kowalski, Tadeusz; Kozanecki, Witold; Kozhin, Anatoly; Kral, Vlastimil; Kramarenko, Viktor; Kramberger, Gregor; Krasny, Mieczyslaw Witold; Krasznahorkay, Attila; Kraus, James; Kreisel, Arik; Krejci, Frantisek; Kretzschmar, Jan; Krieger, Nina; Krieger, Peter; Kroeninger, Kevin; Kroha, Hubert; Kroll, Joe; Kroseberg, Juergen; Krstic, Jelena; Kruchonak, Uladzimir; Krüger, Hans; Krumshteyn, Zinovii; Kubota, Takashi; Kuehn, Susanne; Kugel, Andreas; Kuhl, Thorsten; Kuhn, Dietmar; Kukhtin, Victor; Kulchitsky, Yuri; Kuleshov, Sergey; Kummer, Christian; Kuna, Marine; Kunkle, Joshua; Kupco, Alexander; Kurashige, Hisaya; Kurata, Masakazu; Kurochkin, Yurii; Kus, Vlastimil; Kwee, Regina; La Rosa, Alessandro; La Rotonda, Laura; Labbe, Julien; Lacasta, Carlos; Lacava, Francesco; Lacker, Heiko; Lacour, Didier; Lacuesta, Vicente Ramón; Ladygin, Evgueni; Lafaye, Rémi; Laforge, Bertrand; Lagouri, Theodota; Lai, Stanley; Lamanna, Massimo; Lampen, Caleb; Lampl, Walter; Lancon, Eric; Landgraf, Ulrich; Landon, Murrough; Lane, Jenna; Lankford, Andrew; Lanni, Francesco; Lantzsch, Kerstin; Lanza, Agostino; Laplace, Sandrine; Lapoire, Cecile; Laporte, Jean-Francois; Lari, Tommaso; Larner, Aimee; Lassnig, Mario; Laurelli, Paolo; Lavrijsen, Wim; Laycock, Paul; Lazarev, Alexandre; Lazzaro, Alfio; Le Dortz, Olivier; Le Guirriec, Emmanuel; Le Menedeu, Eve; Lebedev, Alexander; Lebel, Céline; LeCompte, Thomas; Ledroit-Guillon, Fabienne Agnes Marie; Lee, Hurng-Chun; Lee, Jason; Lee, Shih-Chang; Lefebvre, Michel; Legendre, Marie; LeGeyt, Benjamin; Legger, Federica; Leggett, Charles; Lehmacher, Marc; Lehmann Miotto, Giovanna; Lei, Xiaowen; Leitner, Rupert; Lellouch, Daniel; Lellouch, Jeremie; Lendermann, Victor; Leney, Katharine; Lenz, Tatiana; Lenzen, Georg; Lenzi, Bruno; Leonhardt, Kathrin; Leroy, Claude; Lessard, Jean-Raphael; Lester, Christopher; Leung Fook Cheong, Annabelle; Levêque, Jessica; Levin, Daniel; Levinson, Lorne; Leyton, Michael; Li, Haifeng; Li, Xuefei; Liang, Zhihua; Liang, Zhijun; Liberti, Barbara; Lichard, Peter; Lichtnecker, Markus; Lie, Ki; Liebig, Wolfgang; Lilley, Joseph; Limosani, Antonio; Limper, Maaike; Lin, Simon; Linnemann, James; Lipeles, Elliot; Lipinsky, Lukas; Lipniacka, Anna; Liss, Tony; Lissauer, David; Lister, Alison; Litke, Alan; Liu, Chuanlei; Liu, Dong; Liu, Hao; Liu, Jianbei; Liu, Minghui; Liu, Tiankuan; Liu, Yanwen; Livan, Michele; Lleres, Annick; Lloyd, Stephen; Lobodzinska, Ewelina; Loch, Peter; Lockman, William; Lockwitz, Sarah; Loddenkoetter, Thomas; Loebinger, Fred; Loginov, Andrey; Loh, Chang Wei; Lohse, Thomas; Lohwasser, Kristin; Lokajicek, Milos; Long, Robin Eamonn; Lopes, Lourenco; Lopez Mateos, David; Losada, Marta; Loscutoff, Peter; Lou, Xinchou; Lounis, Abdenour; Loureiro, Karina; Lovas, Lubomir; Love, Jeremy; Love, Peter; Lowe, Andrew; Lu, Feng; Lubatti, Henry; Luci, Claudio; Lucotte, Arnaud; Ludwig, Andreas; Ludwig, Dörthe; Ludwig, Inga; Luehring, Frederick; Lumb, Debra; Luminari, Lamberto; Lund, Esben; Lund-Jensen, Bengt; Lundberg, Björn; Lundberg, Johan; Lundquist, Johan; Lynn, David; Lys, Jeremy; Lytken, Else; Ma, Hong; Ma, Lian Liang; Macana Goia, Jorge Andres; Maccarrone, Giovanni; Macchiolo, Anna; Maček, Boštjan; Machado Miguens, Joana; Mackeprang, Rasmus; Madaras, Ronald; Mader, Wolfgang; Maenner, Reinhard; Maeno, Tadashi; Mättig, Peter; Mättig, Stefan; Magalhaes Martins, Paulo Jorge; Magradze, Erekle; Mahalalel, Yair; Mahboubi, Kambiz; Mahmood, A.; Maiani, Camilla; Maidantchik, Carmen; Maio, Amélia; Majewski, Stephanie; Makida, Yasuhiro; Makouski, Mikhail; Makovec, Nikola; Malecki, Piotr; Malecki, Pawel; Maleev, Victor; Malek, Fairouz; Mallik, Usha; Malon, David; Maltezos, Stavros; Malyshev, Vladimir; Malyukov, Sergei; Mambelli, Marco; Mameghani, Raphael; Mamuzic, Judita; Mandelli, Luciano; Mandić, Igor; Mandrysch, Rocco; Maneira, José; Mangeard, Pierre-Simon; Manjavidze, Ioseb; Manning, Peter; Manousakis-Katsikakis, Arkadios; Mansoulie, Bruno; Mapelli, Alessandro; Mapelli, Livio; March , Luis; Marchand, Jean-Francois; Marchese, Fabrizio; Marchiori, Giovanni; Marcisovsky, Michal; Marino, Christopher; Marroquim, Fernando; Marshall, Zach; Marti-Garcia, Salvador; Martin, Alex; Martin, Andrew; Martin, Brian; Martin, Brian; Martin, Franck Francois; Martin, Jean-Pierre; Martin, Tim; Martin dit Latour, Bertrand; Martinez, Mario; Martinez Outschoorn, Verena; Martyniuk, Alex; Marzano, Francesco; Marzin, Antoine; Masetti, Lucia; Mashimo, Tetsuro; Mashinistov, Ruslan; Masik, Jiri; Maslennikov, Alexey; Massa, Ignazio; Massol, Nicolas; Mastroberardino, Anna; Masubuchi, Tatsuya; Matricon, Pierre; Matsunaga, Hiroyuki; Matsushita, Takashi; Mattravers, Carly; Maxfield, Stephen; Mayne, Anna; Mazini, Rachid; Mazur, Michael; Mc Donald, Jeffrey; Mc Kee, Shawn Patrick; McCarn, Allison; McCarthy, Robert; McCubbin, Norman; McFarlane, Kenneth; McGlone, Helen; Mchedlidze, Gvantsa; McMahon, Steve; McPherson, Robert; Meade, Andrew; Mechnich, Joerg; Mechtel, Markus; Medinnis, Mike; Meera-Lebbai, Razzak; Meguro, Tatsuma; Mehlhase, Sascha; Mehta, Andrew; Meier, Karlheinz; Meirose, Bernhard; Melachrinos, Constantinos; Mellado Garcia, Bruce Rafael; Mendoza Navas, Luis; Meng, Zhaoxia; Menke, Sven; Meoni, Evelin; Mermod, Philippe; Merola, Leonardo; Meroni, Chiara; Merritt, Frank; Messina, Andrea; Metcalfe, Jessica; Mete, Alaettin Serhan; Meyer, Jean-Pierre; Meyer, Jochen; Meyer, Joerg; Meyer, Thomas Christian; Meyer, W. Thomas; Miao, Jiayuan; Michal, Sebastien; Micu, Liliana; Middleton, Robin; Migas, Sylwia; Mijović, Liza; Mikenberg, Giora; Mikestikova, Marcela; Mikuž, Marko; Miller, David; Mills, Corrinne; Mills, Bill; Milov, Alexander; Milstead, David; Milstein, Dmitry; Minaenko, Andrey; Miñano, Mercedes; Minashvili, Irakli; Mincer, Allen; Mindur, Bartosz; Mineev, Mikhail; Ming, Yao; Mir, Lluisa-Maria; Mirabelli, Giovanni; Misawa, Shigeki; Misiejuk, Andrzej; Mitrevski, Jovan; Mitsou, Vasiliki A.; Miyagawa, Paul; Mjörnmark, Jan-Ulf; Moa, Torbjoern; Moed, Shulamit; Moeller, Victoria; Mönig, Klaus; Möser, Nicolas; Mohr, Wolfgang; Mohrdieck-Möck, Susanne; Moles-Valls, Regina; Molina-Perez, Jorge; Monk, James; Monnier, Emmanuel; Montesano, Simone; Monticelli, Fernando; Moore, Roger; Mora Herrera, Clemencia; Moraes, Arthur; Morais, Antonio; Morel, Julien; Morello, Gianfranco; Moreno, Deywis; Moreno Llácer, María; Morettini, Paolo; Morii, Masahiro; Morley, Anthony Keith; Mornacchi, Giuseppe; Morozov, Sergey; Morris, John; Moser, Hans-Guenther; Mosidze, Maia; Moss, Josh; Mount, Richard; Mountricha, Eleni; Mouraviev, Sergei; Moyse, Edward; Mudrinic, Mihajlo; Mueller, Felix; Mueller, James; Mueller, Klemens; Müller, Thomas; Muenstermann, Daniel; Muir, Alex; Munwes, Yonathan; Murillo Garcia, Raul; Murray, Bill; Mussche, Ido; Musto, Elisa; Myagkov, Alexey; Myska, Miroslav; Nadal, Jordi; Nagai, Koichi; Nagano, Kunihiro; Nagasaka, Yasushi; Nairz, Armin Michael; Nakamura, Koji; Nakano, Itsuo; Nakatsuka, Hiroki; Nanava, Gizo; Napier, Austin; Nash, Michael; Nation, Nigel; Nattermann, Till; Naumann, Thomas; Navarro, Gabriela; Nderitu, Simon Kirichu; Neal, Homer; Nebot, Eduardo; Nechaeva, Polina; Negri, Andrea; Negri, Guido; Nelson, Andrew; Nelson, Timothy Knight; Nemecek, Stanislav; Nemethy, Peter; Nepomuceno, Andre Asevedo; Nessi, Marzio; Neubauer, Mark; Neusiedl, Andrea; Neves, Ricardo; Nevski, Pavel; Newcomer, Mitchel; Nickerson, Richard; Nicolaidou, Rosy; Nicolas, Ludovic; Nicoletti, Giovanni; Nicquevert, Bertrand; Niedercorn, Francois; Nielsen, Jason; Nikiforov, Andriy; Nikolaev, Kirill; Nikolic-Audit, Irena; Nikolopoulos, Konstantinos; Nilsen, Henrik; Nilsson, Paul; Nisati, Aleandro; Nishiyama, Tomonori; Nisius, Richard; Nodulman, Lawrence; Nomachi, Masaharu; Nomidis, Ioannis; Nordberg, Markus; Nordkvist, Bjoern; Notz, Dieter; Novakova, Jana; Nozaki, Mitsuaki; Nožička, Miroslav; Nugent, Ian Michael; Nuncio-Quiroz, Adriana-Elizabeth; Nunes Hanninger, Guilherme; Nunnemann, Thomas; Nurse, Emily; O'Neil, Dugan; O'Shea, Val; Oakham, Gerald; Oberlack, Horst; Ochi, Atsuhiko; Oda, Susumu; Odaka, Shigeru; Odier, Jerome; Ogren, Harold; Oh, Alexander; Oh, Seog; Ohm, Christian; Ohshima, Takayoshi; Ohshita, Hidetoshi; Ohsugi, Takashi; Okada, Shogo; Okawa, Hideki; Okumura, Yasuyuki; Okuyama, Toyonobu; Olchevski, Alexander; Oliveira, Miguel Alfonso; Oliveira Damazio, Denis; Oliver Garcia, Elena; Olivito, Dominick; Olszewski, Andrzej; Olszowska, Jolanta; Omachi, Chihiro; Onofre, António; Onyisi, Peter; Oram, Christopher; Oreglia, Mark; Oren, Yona; Orestano, Domizia; Orlov, Iliya; Oropeza Barrera, Cristina; Orr, Robert; Ortega, Eduardo; Osculati, Bianca; Ospanov, Rustem; Osuna, Carlos; Ottersbach, John; Ould-Saada, Farid; Ouraou, Ahmimed; Ouyang, Qun; Owen, Mark; Owen, Simon; Oyarzun, Alejandro; Ozcan, Veysi Erkcan; Ozone, Kenji; Ozturk, Nurcan; Pacheco Pages, Andres; Padilla Aranda, Cristobal; Paganis, Efstathios; Pahl, Christoph; Paige, Frank; Pajchel, Katarina; Palestini, Sandro; Pallin, Dominique; Palma, Alberto; Palmer, Jody; Pan, Yibin; Panagiotopoulou, Evgenia; Panes, Boris; Panikashvili, Natalia; Panitkin, Sergey; Pantea, Dan; Panuskova, Monika; Paolone, Vittorio; Papadopoulou, Theodora; Park, Su-Jung; Park, Woochun; Parker, Andy; Parodi, Fabrizio; Parsons, John; Parzefall, Ulrich; Pasqualucci, Enrico; Passeri, Antonio; Pastore, Fernanda; Pastore, Francesca; Pásztor , Gabriella; Pataraia, Sophio; Pater, Joleen; Patricelli, Sergio; Pauly, Thilo; Peak, Lawrence; Pecsy, Martin; Pedraza Morales, Maria Isabel; Peleganchuk, Sergey; Peng, Haiping; Penson, Alexander; Penwell, John; Perantoni, Marcelo; Perez, Kerstin; Perez Codina, Estel; Pérez García-Estañ, María Teresa; Perez Reale, Valeria; Perini, Laura; Pernegger, Heinz; Perrino, Roberto; Persembe, Seda; Perus, Antoine; Peshekhonov, Vladimir; Petersen, Brian; Petersen, Troels; Petit, Elisabeth; Petridou, Chariclia; Petrolo, Emilio; Petrucci, Fabrizio; Petschull, Dennis; Petteni, Michele; Pezoa, Raquel; Phan, Anna; Phillips, Alan; Phillips, Peter William; Piacquadio, Giacinto; Piccinini, Maurizio; Piegaia, Ricardo; Pilcher, James; Pilkington, Andrew; Pina, João Antonio; Pinamonti, Michele; Pinfold, James; Pinto, Belmiro; Pizio, Caterina; Placakyte, Ringaile; Plamondon, Mathieu; Pleier, Marc-Andre; Poblaguev, Andrei; Poddar, Sahill; Podlyski, Fabrice; Poggioli, Luc; Pohl, Martin; Polci, Francesco; Polesello, Giacomo; Policicchio, Antonio; Polini, Alessandro; Poll, James; Polychronakos, Venetios; Pomeroy, Daniel; Pommès, Kathy; Ponsot, Patrick; Pontecorvo, Ludovico; Pope, Bernard; Popeneciu, Gabriel Alexandru; Popovic, Dragan; Poppleton, Alan; Popule, Jiri; Portell Bueso, Xavier; Porter, Robert; Pospelov, Guennady; Pospisil, Stanislav; Potekhin, Maxim; Potrap, Igor; Potter, Christina; Potter, Christopher; Potter, Keith; Poulard, Gilbert; Poveda, Joaquin; Prabhu, Robindra; Pralavorio, Pascal; Prasad, Srivas; Pravahan, Rishiraj; Pribyl, Lukas; Price, Darren; Price, Lawrence; Prichard, Paul; Prieur, Damien; Primavera, Margherita; Prokofiev, Kirill; Prokoshin, Fedor; Protopopescu, Serban; Proudfoot, James; Prudent, Xavier; Przysiezniak, Helenka; Psoroulas, Serena; Ptacek, Elizabeth; Purdham, John; Purohit, Milind; Puzo, Patrick; Pylypchenko, Yuriy; Qi, Ming; Qian, Jianming; Qian, Weiming; Qin, Zhonghua; Quadt, Arnulf; Quarrie, David; Quayle, William; Quinonez, Fernando; Raas, Marcel; Radeka, Veljko; Radescu, Voica; Radics, Balint; Rador, Tonguc; Ragusa, Francesco; Rahal, Ghita; Rahimi, Amir; Rajagopalan, Srinivasan; Rammensee, Michael; Rammes, Marcus; Rauscher, Felix; Rauter, Emanuel; Raymond, Michel; Read, Alexander Lincoln; Rebuzzi, Daniela; Redelbach, Andreas; Redlinger, George; Reece, Ryan; Reeves, Kendall; Reinherz-Aronis, Erez; Reinsch, Andreas; Reisinger, Ingo; Reljic, Dusan; Rembser, Christoph; Ren, Zhongliang; Renkel, Peter; Rescia, Sergio; Rescigno, Marco; Resconi, Silvia; Resende, Bernardo; Reznicek, Pavel; Rezvani, Reyhaneh; Richards, Alexander; Richter, Robert; Richter-Was, Elzbieta; Ridel, Melissa; Rijpstra, Manouk; Rijssenbeek, Michael; Rimoldi, Adele; Rinaldi, Lorenzo; Rios, Ryan Randy; Riu, Imma; Rizatdinova, Flera; Rizvi, Eram; Roa Romero, Diego Alejandro; Robertson, Steven; Robichaud-Veronneau, Andree; Robinson, Dave; Robinson, James; Robinson, Mary; Robson, Aidan; Rocha de Lima, Jose Guilherme; Roda, Chiara; Roda Dos Santos, Denis; Rodriguez, Diego; Rodriguez Garcia, Yohany; Roe, Shaun; Røhne, Ole; Rojo, Victoria; Rolli, Simona; Romaniouk, Anatoli; Romanov, Victor; Romeo, Gaston; Romero Maltrana, Diego; Roos, Lydia; Ros, Eduardo; Rosati, Stefano; Rosenbaum, Gabriel; Rosselet, Laurent; Rossetti, Valerio; Rossi, Leonardo Paolo; Rotaru, Marina; Rothberg, Joseph; Rousseau, David; Royon, Christophe; Rozanov, Alexander; Rozen, Yoram; Ruan, Xifeng; Ruckert, Benjamin; Ruckstuhl, Nicole; Rud, Viacheslav; Rudolph, Gerald; Rühr, Frederik; Ruggieri, Federico; Ruiz-Martinez, Aranzazu; Rumyantsev, Leonid; Rurikova, Zuzana; Rusakovich, Nikolai; Rutherfoord, John; Ruwiedel, Christoph; Ruzicka, Pavel; Ryabov, Yury; Ryan, Patrick; Rybkin, Grigori; Rzaeva, Sevda; Saavedra, Aldo; Sadrozinski, Hartmut; Sadykov, Renat; Safai Tehrani, Francesco; Sakamoto, Hiroshi; Salamanna, Giuseppe; Salamon, Andrea; Saleem, Muhammad; Salihagic, Denis; Salnikov, Andrei; Salt, José; Salvachua Ferrando, Belén; Salvatore, Daniela; Salvatore, Pasquale Fabrizio; Salvucci, Antonio; Salzburger, Andreas; Sampsonidis, Dimitrios; Samset, Björn Hallvard; Sandaker, Heidi; Sander, Heinz Georg; Sanders, Michiel; Sandhoff, Marisa; Sandhu, Pawan; Sandstroem, Rikard; Sandvoss, Stephan; Sankey, Dave; Sanny, Bernd; Sansoni, Andrea; Santamarina Rios, Cibran; Santoni, Claudio; Santonico, Rinaldo; Saraiva, João; Sarangi, Tapas; Sarkisyan-Grinbaum, Edward; Sarri, Francesca; Sasaki, Osamu; Sasao, Noboru; Satsounkevitch, Igor; Sauvage, Gilles; Savard, Pierre; Savine, Alexandre; Savinov, Vladimir; Sawyer, Lee; Saxon, David; Says, Louis-Pierre; Sbarra, Carla; Sbrizzi, Antonio; Scannicchio, Diana; Schaarschmidt, Jana; Schacht, Peter; Schäfer, Uli; Schaetzel, Sebastian; Schaffer, Arthur; Schaile, Dorothee; Schamberger, R.~Dean; Schamov, Andrey; Scharf, Veit; Schegelsky, Valery; Scheirich, Daniel; Schernau, Michael; Scherzer, Max; Schiavi, Carlo; Schieck, Jochen; Schioppa, Marco; Schlenker, Stefan; Schmidt, Evelyn; Schmieden, Kristof; Schmitt, Christian; Schmitz, Martin; Schöning, André; Schott, Matthias; Schouten, Doug; Schovancova, Jaroslava; Schram, Malachi; Schreiner, Alexander; Schroeder, Christian; Schroer, Nicolai; Schroers, Marcel; Schultes, Joachim; Schultz-Coulon, Hans-Christian; Schumacher, Jan; Schumacher, Markus; Schumm, Bruce; Schune, Philippe; Schwanenberger, Christian; Schwartzman, Ariel; Schwemling, Philippe; Schwienhorst, Reinhard; Schwierz, Rainer; Schwindling, Jerome; Scott, Bill; Searcy, Jacob; Sedykh, Evgeny; Segura, Ester; Seidel, Sally; Seiden, Abraham; Seifert, Frank; Seixas, José; Sekhniaidze, Givi; Seliverstov, Dmitry; Sellden, Bjoern; Semprini-Cesari, Nicola; Serfon, Cedric; Serin, Laurent; Seuster, Rolf; Severini, Horst; Sevior, Martin; Sfyrla, Anna; Shabalina, Elizaveta; Shamim, Mansoora; Shan, Lianyou; Shank, James; Shao, Qi Tao; Shapiro, Marjorie; Shatalov, Pavel; Shaw, Kate; Sherman, Daniel; Sherwood, Peter; Shibata, Akira; Shimojima, Makoto; Shin, Taeksu; Shmeleva, Alevtina; Shochet, Mel; Shupe, Michael; Sicho, Petr; Sidoti, Antonio; Siegert, Frank; Siegrist, James; Sijacki, Djordje; Silbert, Ohad; Silver, Yiftah; Silverstein, Daniel; Silverstein, Samuel; Simak, Vladislav; Simic, Ljiljana; Simion, Stefan; Simmons, Brinick; Simonyan, Margar; Sinervo, Pekka; Sinev, Nikolai; Sipica, Valentin; Siragusa, Giovanni; Sisakyan, Alexei; Sivoklokov, Serguei; Sjölin, Jörgen; Sjursen, Therese; Skovpen, Kirill; Skubic, Patrick; Slater, Mark; Slavicek, Tomas; Sliwa, Krzysztof; Sloper, John erik; Smakhtin, Vladimir; Smirnov, Sergei; Smirnov, Yuri; Smirnova, Lidia; Smirnova, Oxana; Smith, Ben Campbell; Smith, Douglas; Smith, Kenway; Smizanska, Maria; Smolek, Karel; Snesarev, Andrei; Snow, Steve; Snow, Joel; Snuverink, Jochem; Snyder, Scott; Soares, Mara; Sobie, Randall; Sodomka, Jaromir; Soffer, Abner; Solans, Carlos; Solar, Michael; Solc, Jaroslav; Solfaroli Camillocci, Elena; Solodkov, Alexander; Solovyanov, Oleg; Sondericker, John; Sopko, Vit; Sopko, Bruno; Sosebee, Mark; Soukharev, Andrey; Spagnolo, Stefania; Spanò, Francesco; Spighi, Roberto; Spigo, Giancarlo; Spila, Federico; Spiwoks, Ralf; Spousta, Martin; Spreitzer, Teresa; Spurlock, Barry; St. Denis, Richard Dante; Stahl, Thorsten; Stahlman, Jonathan; Stamen, Rainer; Stancu, Stefan Nicolae; Stanecka, Ewa; Stanek, Robert; Stanescu, Cristian; Stapnes, Steinar; Starchenko, Evgeny; Stark, Jan; Staroba, Pavel; Starovoitov, Pavel; Stastny, Jan; Stavina, Pavel; Steele, Genevieve; Steinbach, Peter; Steinberg, Peter; Stekl, Ivan; Stelzer, Bernd; Stelzer, Harald Joerg; Stelzer-Chilton, Oliver; Stenzel, Hasko; Stevenson, Kyle; Stewart, Graeme; Stockton, Mark; Stoerig, Kathrin; Stoicea, Gabriel; Stonjek, Stefan; Strachota, Pavel; Stradling, Alden; Straessner, Arno; Strandberg, Jonas; Strandberg, Sara; Strandlie, Are; Strauss, Michael; Strizenec, Pavol; Ströhmer, Raimund; Strom, David; Stroynowski, Ryszard; Strube, Jan; Stugu, Bjarne; Sturm, Philipp; Su, Dong; Soh, Dart-yin; Sugaya, Yorihito; Sugimoto, Takuya; Suhr, Chad; Suk, Michal; Sulin, Vladimir; Sultansoy, Saleh; Sumida, Toshi; Sun, Xiaohu; Sundermann, Jan Erik; Suruliz, Kerim; Sushkov, Serge; Susinno, Giancarlo; Sutton, Mark; Suzuki, Takuya; Suzuki, Yu; Sykora, Ivan; Sykora, Tomas; Szymocha, Tadeusz; Sánchez, Javier; Ta, Duc; Tackmann, Kerstin; Taffard, Anyes; Tafirout, Reda; Taga, Adrian; Takahashi, Yuta; Takai, Helio; Takashima, Ryuichi; Takeda, Hiroshi; Takeshita, Tohru; Talby, Mossadek; Talyshev, Alexey; Tamsett, Matthew; Tanaka, Junichi; Tanaka, Reisaburo; Tanaka, Satoshi; Tanaka, Shuji; Tapprogge, Stefan; Tardif, Dominique; Tarem, Shlomit; Tarrade, Fabien; Tartarelli, Giuseppe Francesco; Tas, Petr; Tasevsky, Marek; Tassi, Enrico; Tatarkhanov, Mous; Taylor, Christopher; Taylor, Frank; Taylor, Geoffrey; Taylor, Ryan P.; Taylor, Wendy; Teixeira-Dias, Pedro; Ten Kate, Herman; Teng, Ping-Kun; Tennenbaum-Katan, Yaniv-David; Terada, Susumu; Terashi, Koji; Terron, Juan; Terwort, Mark; Testa, Marianna; Teuscher, Richard; Therhaag, Jan; Thioye, Moustapha; Thoma, Sascha; Thomas, Juergen; Thompson, Stan; Thompson, Emily; Thompson, Peter; Thompson, Paul; Thompson, Ray; Thomson, Evelyn; Thun, Rudolf; Tic, Tomas; Tikhomirov, Vladimir; Tikhonov, Yury; Tipton, Paul; Tique Aires Viegas, Florbela De Jes; Tisserant, Sylvain; Toczek, Barbara; Todorov, Theodore; Todorova-Nova, Sharka; Toggerson, Brokk; Tojo, Junji; Tokár, Stanislav; Tokushuku, Katsuo; Tollefson, Kirsten; Tomasek, Lukas; Tomasek, Michal; Tomoto, Makoto; Tompkins, Lauren; Toms, Konstantin; Tonoyan, Arshak; Topfel, Cyril; Topilin, Nikolai; Torchiani, Ingo; Torrence, Eric; Torró Pastor, Emma; Toth, Jozsef; Touchard, Francois; Tovey, Daniel; Trefzger, Thomas; Tremblet, Louis; Tricoli, Alesandro; Trigger, Isabel Marian; Trincaz-Duvoid, Sophie; Trinh, Thi Nguyet; Tripiana, Martin; Triplett, Nathan; Trischuk, William; Trivedi, Arjun; Trocmé, Benjamin; Troncon, Clara; Trzupek, Adam; Tsarouchas, Charilaos; Tseng, Jeffrey; Tsiakiris, Menelaos; Tsiareshka, Pavel; Tsionou, Dimitra; Tsipolitis, Georgios; Tsiskaridze, Vakhtang; Tskhadadze, Edisher; Tsukerman, Ilya; Tsulaia, Vakhtang; Tsung, Jieh-Wen; Tsuno, Soshi; Tsybychev, Dmitri; Tuggle, Joseph; Turecek, Daniel; Turk Cakir, Ilkay; Turlay, Emmanuel; Tuts, Michael; Twomey, Matthew Shaun; Tylmad, Maja; Tyndel, Mike; Uchida, Kirika; Ueda, Ikuo; Ueno, Ryuichi; Ugland, Maren; Uhlenbrock, Mathias; Uhrmacher, Michael; Ukegawa, Fumihiko; Unal, Guillaume; Undrus, Alexander; Unel, Gokhan; Unno, Yoshinobu; Urbaniec, Dustin; Urkovsky, Evgeny; Urquijo, Phillip; Urrejola, Pedro; Usai, Giulio; Uslenghi, Massimiliano; Vacavant, Laurent; Vacek, Vaclav; Vachon, Brigitte; Vahsen, Sven; Valente, Paolo; Valentinetti, Sara; Valkar, Stefan; Valladolid Gallego, Eva; Vallecorsa, Sofia; Valls Ferrer, Juan Antonio; Van Berg, Richard; van der Graaf, Harry; van der Kraaij, Erik; van der Poel, Egge; van der Ster, Daniel; van Eldik, Niels; van Gemmeren, Peter; van Kesteren, Zdenko; van Vulpen, Ivo; Vandelli, Wainer; Vaniachine, Alexandre; Vankov, Peter; Vannucci, Francois; Vari, Riccardo; Varnes, Erich; Varouchas, Dimitris; Vartapetian, Armen; Varvell, Kevin; Vasilyeva, Lidia; Vassilakopoulos, Vassilios; Vazeille, Francois; Vellidis, Constantine; Veloso, Filipe; Veneziano, Stefano; Ventura, Andrea; Ventura, Daniel; Venturi, Manuela; Venturi, Nicola; Vercesi, Valerio; Verducci, Monica; Verkerke, Wouter; Vermeulen, Jos; Vetterli, Michel; Vichou, Irene; Vickey, Trevor; Viehhauser, Georg; Villa, Mauro; Villani, Giulio; Villaplana Perez, Miguel; Vilucchi, Elisabetta; Vincter, Manuella; Vinek, Elisabeth; Vinogradov, Vladimir; Viret, Sébastien; Virzi, Joseph; Vitale , Antonio; Vitells, Ofer; Vivarelli, Iacopo; Vives Vaque, Francesc; Vlachos, Sotirios; Vlasak, Michal; Vlasov, Nikolai; Vogel, Adrian; Vokac, Petr; Volpi, Matteo; von der Schmitt, Hans; von Loeben, Joerg; von Radziewski, Holger; von Toerne, Eckhard; Vorobel, Vit; Vorwerk, Volker; Vos, Marcel; Voss, Rudiger; Voss, Thorsten Tobias; Vossebeld, Joost; Vranjes, Nenad; Vranjes Milosavljevic, Marija; Vrba, Vaclav; Vreeswijk, Marcel; Vu Anh, Tuan; Vudragovic, Dusan; Vuillermet, Raphael; Vukotic, Ilija; Wagner, Peter; Walbersloh, Jorg; Walder, James; Walker, Rodney; Walkowiak, Wolfgang; Wall, Richard; Wang, Chiho; Wang, Haichen; Wang, Jin; Wang, Song-Ming; Warburton, Andreas; Ward, Patricia; Warsinsky, Markus; Wastie, Roy; Watkins, Peter; Watson, Alan; Watson, Miriam; Watts, Gordon; Watts, Stephen; Waugh, Anthony; Waugh, Ben; Weber, Marc; Weber, Manuel; Weber, Michele; Weber, Pavel; Weidberg, Anthony; Weingarten, Jens; Weiser, Christian; Wellenstein, Hermann; Wells, Phillippa; Wenaus, Torre; Wendler, Shanti; Wengler, Thorsten; Wenig, Siegfried; Wermes, Norbert; Werner, Matthias; Werner, Per; Werth, Michael; Werthenbach, Ulrich; Wessels, Martin; Whalen, Kathleen; White, Andrew; White, Martin; White, Sebastian; Whitehead, Samuel Robert; Whiteson, Daniel; Whittington, Denver; Wicek, Francois; Wicke, Daniel; Wickens, Fred; Wiedenmann, Werner; Wielers, Monika; Wienemann, Peter; Wiglesworth, Craig; Wiik, Liv Antje Mari; Wildauer, Andreas; Wildt, Martin Andre; Wilkens, Henric George; Williams, Eric; Williams, Hugh; Willocq, Stephane; Wilson, John; Wilson, Michael Galante; Wilson, Alan; Wingerter-Seez, Isabelle; Winklmeier, Frank; Wittgen, Matthias; Wolter, Marcin Wladyslaw; Wolters, Helmut; Wosiek, Barbara; Wotschack, Jorg; Woudstra, Martin; Wraight, Kenneth; Wright, Catherine; Wright, Dennis; Wrona, Bozydar; Wu, Sau Lan; Wu, Xin; Wulf, Evan; Wynne, Benjamin; Xaplanteris, Leonidas; Xella, Stefania; Xie, Song; Xu, Da; Xu, Neng; Yamada, Miho; Yamamoto, Akira; Yamamoto, Kyoko; Yamamoto, Shimpei; Yamamura, Taiki; Yamaoka, Jared; Yamazaki, Takayuki; Yamazaki, Yuji; Yan, Zhen; Yang, Haijun; Yang, Un-Ki; Yang, Zhaoyu; Yao, Weiming; Yao, Yushu; Yasu, Yoshiji; Ye, Jingbo; Ye, Shuwei; Yilmaz, Metin; Yoosoofmiya, Reza; Yorita, Kohei; Yoshida, Riktura; Young, Charles; Youssef, Saul; Yu, Dantong; Yu, Jaehoon; Yuan, Li; Yurkewicz, Adam; Zaidan, Remi; Zaitsev, Alexander; Zajacova, Zuzana; Zambrano, Valentina; Zanello, Lucia; Zaytsev, Alexander; Zeitnitz, Christian; Zeller, Michael; Zemla, Andrzej; Zendler, Carolin; Zenin, Oleg; Zenis, Tibor; Zenonos, Zenonas; Zenz, Seth; Zerwas, Dirk; Zevi della Porta, Giovanni; Zhan, Zhichao; Zhang, Huaqiao; Zhang, Jinlong; Zhang, Qizhi; Zhang, Xueyao; Zhao, Long; Zhao, Tianchi; Zhao, Zhengguo; Zhemchugov, Alexey; Zhong, Jiahang; Zhou, Bing; Zhou, Ning; Zhou, Yue; Zhu, Cheng Guang; Zhu, Hongbo; Zhu, Yingchun; Zhuang, Xuai; Zhuravlov, Vadym; Zimmermann, Robert; Zimmermann, Simone; Zimmermann, Stephanie; Ziolkowski, Michael; Zivkovic, Lidija; Zobernig, Georg; Zoccoli, Antonio; zur Nedden, Martin; Zutshi, Vishnu

    2010-01-01

    The ATLAS Inner Detector is a composite tracking system consisting of silicon pixels, silicon strips and straw tubes in a 2 T magnetic field. Its installation was completed in August 2008 and the detector took part in data- taking with single LHC beams and cosmic rays. The initial detector operation, hardware commissioning and in-situ calibrations are described. Tracking performance has been measured with 7.6 million cosmic-ray events, collected using a tracking trigger and reconstructed with modular pattern-recognition and fitting software. The intrinsic hit efficiency and tracking trigger efficiencies are close to 100%. Lorentz angle measurements for both electrons and holes, specific energy-loss calibration and transition radiation turn-on measurements have been performed. Different alignment techniques have been used to reconstruct the detector geometry. After the initial alignment, a transverse impact parameter resolution of 22.1+/-0.9 {\\mu}m and a relative momentum resolution {\\sigma}p/p = (4.83+/-0.16)...

  5. Improvement of Event Synchronization in the ATLAS Pixel Readout Development

    Science.gov (United States)

    Adams, Logan; Atlas Collaboration

    2017-01-01

    As the LHC continues in Run2, the B-Layer still uses the Atlas-SiROD Pixel readout system initially developed for Run 1. The higher luminosity occurring during Run 2 results in higher occupancy causing increased desynchronization errors in the Pixel Readout. In order to ensure lasting operation of the B-Layer until it is replaced after Run 3, changes were made to the firmware and software to add debug capabilities to identify when the errors are crossing certain thresholds and change the internal control logic accordingly. These features also allow for better debugging of the Event Counter Reset addition to the firmware. This talk will focus on the features implemented and measurements to demonstrate the positive impact on the Pixel DAQ system. A Pixel front-end chip emulator which can be used for readout system development beyond Run 3 will also be discussed. Presenter is Logan Adams, University of Washington.

  6. ATLAS Pixel Group - Photo Gallery from Irradiation

    CERN Multimedia

    2001-01-01

    Photos 1,2,3,4,5,6,7 - Photos taken before irradiation of Pixel Test Analog Chip and Pmbars (April 2000) Photos 8,9,10,11 - Irradiation of VDC chips (May 2000) Photos 12, 13 - Irradiation of Passive Components (June 2000) Photos 14,15, 16 - Irradiation of Marebo Chip (November 1999)

  7. Hybrid Pixel Detectors for gamma/X-ray imaging

    Science.gov (United States)

    Hatzistratis, D.; Theodoratos, G.; Zografos, V.; Kazas, I.; Loukas, D.; Lambropoulos, C. P.

    2015-09-01

    Hybrid pixel detectors are made by direct converting high-Z semi-insulating single crystalline material coupled to complementary-metal-oxide semiconductor (CMOS) readout electronics. They are attractive because direct conversion exterminates all the problems of spatial localization related to light diffusion, energy resolution, is far superior from the combination of scintillation crystals and photomultipliers and lithography can be used to pattern electrodes with very fine pitch. We are developing 2-D pixel CMOS ASICs, connect them to pixilated CdTe crystals with the flip chip and bump bonding method and characterize the hybrids. We have designed a series of circuits, whose latest member consists of a 50×25 pixel array with 400um pitch and an embedded controller. In every pixel a full spectroscopic channel with time tagging information has been implemented. The detectors are targeting Compton scatter imaging and they can be used for coded aperture imaging too. Hybridization using CMOS can overcome the limit put on pixel circuit complexity by the use of thin film transistors (TFT) in large flat panels. Hybrid active pixel sensors are used in dental imaging and other applications (e.g. industrial CT etc.). Thus X-ray imaging can benefit from the work done on dynamic range enhancement methods developed initially for visible and infrared CMOS pixel sensors. A 2-D CMOS ASIC with 100um pixel pitch to demonstrate the feasibility of such methods in the context of X-ray imaging has been designed.

  8. The forward Detectors of the ATLAS experiment

    CERN Document Server

    Vittori, Camilla; The ATLAS collaboration

    2017-01-01

    In this poster, a review of the ATLAS forward detectors operating in the 2015-2016 data taking is given. This includes a description of LUCID, the preferred ATLAS luminosity provider; of the ALFA detector, aimed to measure elastically scattered protons at small angle for the total proton-proton cross section measurement; of the ATLAS Forward Proton project AFP, which was partially installed and took the first data in 2015, and of the Zero Degree Calorimeter ZDC built for the ATLAS Heavy Ions physics program. The near future plans for these detectors will also be addressed.

  9. The ATLAS Detector Safety System

    CERN Multimedia

    Helfried Burckhart; Kathy Pommes; Heidi Sandaker

    The ATLAS Detector Safety System (DSS) has the mandate to put the detector in a safe state in case an abnormal situation arises which could be potentially dangerous for the detector. It covers the CERN alarm severity levels 1 and 2, which address serious risks for the equipment. The highest level 3, which also includes danger for persons, is the responsibility of the CERN-wide system CSAM, which always triggers an intervention by the CERN fire brigade. DSS works independently from and hence complements the Detector Control System, which is the tool to operate the experiment. The DSS is organized in a Front- End (FE), which fulfills autonomously the safety functions and a Back-End (BE) for interaction and configuration. The overall layout is shown in the picture below. ATLAS DSS configuration The FE implementation is based on a redundant Programmable Logical Crate (PLC) system which is used also in industry for such safety applications. Each of the two PLCs alone, one located underground and one at the s...

  10. Forward Detectors and Physics at ATLAS

    CERN Document Server

    Soni, N; The ATLAS collaboration

    2010-01-01

    This talk will cover the current Atlas forward detectors LUCID, ZDC, ALFA and the upgrade project AFP. The current forward detectors are dedicated for the luminosity measurements and the forward physics measurements at first low luminosity LHC phase. The AFP project will significantly extend the ATLAS physics program at high luminosities by tagging the very forward tagging protons.

  11. Digital column readout architecture for the ATLAS pixel 025 mum front end IC

    CERN Document Server

    Mandelli, E; Blanquart, L; Comes, G; Denes, P; Einsweiler, Kevin F; Fischer, P; Marchesini, R; Meddeler, G; Peric, I

    2002-01-01

    A fast low noise, limited power, radiation-hard front-end chip was developed for reading out the Atlas Pixel Silicon Detector. As in the past prototypes, every chip is used to digitize and read out charge and time information from hits on each one of its 2880 inputs. The basic column readout architecture idea was adopted and modified to allow a safe transition to quarter micron technology. Each pixel cell, organized in a 160 multiplied by 18 matrix, can be independently enabled and configured in order to optimize the analog signal response and to prevent defective pixels from saturating the readout. The digital readout organizes hit data coming from each column, with respect to time, and output them on a low-level serial interface. A considerable effort was made to design state machines free of undefined states, where single-point defects and charge deposited by heavy ions in the silicon could have led to unpredicted forbidden states. 7 Refs.

  12. Leakage current measurements on pixelated CdZnTe detectors

    NARCIS (Netherlands)

    Dirks, B.P.F.; Blondel, C.; Daly, F.; Gevin, O.; Limousin, O.; Lugiez, F.

    2006-01-01

    In the field of the R&D of a new generation hard X-ray cameras for space applications we focus on the use of pixelated CdTe or CdZnTe semiconductor detectors. They are covered with 64 (0.9×0.9 mm2) or 256 (0.5×0.5 mm2) pixels, surrounded by a guard ring and operate in the energy ranging from several

  13. Silicon pixel detector prototyping in SOI CMOS technology

    Science.gov (United States)

    Dasgupta, Roma; Bugiel, Szymon; Idzik, Marek; Kapusta, Piotr; Kucewicz, Wojciech; Turala, Michal

    2016-12-01

    The Silicon-On-Insulator (SOI) CMOS is one of the most advanced and promising technology for monolithic pixel detectors design. The insulator layer that is implemented inside the silicon crystal allows to integrate sensors matrix and readout electronic on a single wafer. Moreover, the separation of electronic and substrate increases also the SOI circuits performance. The parasitic capacitances to substrate are significantly reduced, so the electronic systems are faster and consume much less power. The authors of this presentation are the members of international SOIPIX collaboration, that is developing SOI pixel detectors in 200 nm Lapis Fully-Depleted, Low-Leakage SOI CMOS. This work shows a set of advantages of SOI technology and presents possibilities for pixel detector design SOI CMOS. In particular, the preliminary results of a Cracow chip are presented.

  14. Chronopixels: particle detector R&D for the ATLAS phase 2 upgrade

    Science.gov (United States)

    Weber, Christian; Baker, Keith; Barker, Thomas; Baltay, Charles; Sinev, Nikolai; Brau, Jim; Strom, David; Atlas Collaboration

    2017-01-01

    The pixel detector comprises the innermost part of the ATLAS detector. Its proximity to the interaction point together with its micrometer resolution allow for impact parameter determination and vertex fitting. This proximity however exposes it also to the highest radiation fluences and particle densities. The latter poses a challenge in inferring particle tracks from hit pixels, while the former leads to progressive radiation damage of the pixel detector itself. These problems will worsen after the LHC's third long shutdown in 2025 when it will operate in high luminosity mode at about five times the current instantaneous luminosity. These conditions will require the pixel detector to be replaced by one staffed with pixel modules capable of enduring the harsher radiation environment, and with finer granularity to cope with the increased pileup. Several efforts in the community are on their way to produce such a pixel module. We are presenting here the current status of our R&D on such a pixel module: The Chronopixel for ATLAS phase 2, a fully monolithic active pixel sensor in CMOS technology. Sensing and readout electronics are included in each pixel here. As such it does not require expensive and labor intensive bump-bonding to a separate readout chip, reducing cost and material in the pixel detector. We gratefully acknowledge support by the Department of Energy, Office of High Energy Physics.

  15. Design methodology: edgeless 3D ASICs with complex in-pixel processing for pixel detectors

    Energy Technology Data Exchange (ETDEWEB)

    Fahim Farah, Fahim Farah [Northwestern U. (main); Deptuch, Grzegorz W. [Fermilab; Hoff, James R. [Fermilab; Mohseni, Hooman [Northwestern U. (main)

    2015-08-28

    The design methodology for the development of 3D integrated edgeless pixel detectors with in-pixel processing using Electronic Design Automation (EDA) tools is presented. A large area 3 tier 3D detector with one sensor layer and two ASIC layers containing one analog and one digital tier, is built for x-ray photon time of arrival measurement and imaging. A full custom analog pixel is 65μm x 65μm. It is connected to a sensor pixel of the same size on one side, and on the other side it has approximately 40 connections to the digital pixel. A 32 x 32 edgeless array without any peripheral functional blocks constitutes a sub-chip. The sub-chip is an indivisible unit, which is further arranged in a 6 x 6 array to create the entire 1.248cm x 1.248cm ASIC. Each chip has 720 bump-bond I/O connections, on the back of the digital tier to the ceramic PCB. All the analog tier power and biasing is conveyed through the digital tier from the PCB. The assembly has no peripheral functional blocks, and hence the active area extends to the edge of the detector. This was achieved by using a few flavors of almost identical analog pixels (minimal variation in layout) to allow for peripheral biasing blocks to be placed within pixels. The 1024 pixels within a digital sub-chip array have a variety of full custom, semi-custom and automated timing driven functional blocks placed together. The methodology uses a modified mixed-mode on-top digital implementation flow to not only harness the tool efficiency for timing and floor-planning but also to maintain designer control over compact parasitically aware layout. The methodology uses the Cadence design platform, however it is not limited to this tool.

  16. A prototype hybrid pixel detector ASIC for the CLIC experiment

    CERN Document Server

    Valerio, P; Arfaoui, S; Ballabriga, R; Benoit, M; Bonacini, S; Campbell, M; Dannheim, D; De Gaspari, M; Felici, D; Kulis, S; Llopart, X; Nascetti, A; Poikela, T; Wong, W S

    2014-01-01

    A prototype hybrid pixel detector ASIC specifically designed to the requirements of the vertex detector for CLIC is described and first electrical measurements are presented. The chip has been designed using a commercial 65 nm CMOS technology and comprises a matrix of 64x64 square pixels with 25 μm pitch. The main features include simultaneous 4-bit measure- ment of Time-over-Threshold (ToT) and Time-of-Arrival (ToA) with 10 ns accuracy, on-chip data compression and power pulsing capability.

  17. The phase-1 upgrade of the CMS pixel detector

    CERN Document Server

    Weber, Hannsjorg Artur

    2016-01-01

    The pixel detector of the CMS experiment will be upgraded during the extended end of year shutdown during winter 2016/2017. The upgraded detector will operate at full efficiency at an instantaneous luminosity of ${2\\times10^{34}}$\\,cm$^{{-2}}$s$^{{-1}}$ with increased detector acceptance and additional redundancy for the tracking, while at the same time reducing the material budget. The design and technological choices will be reviewed, and the status of the construction of the detector and the performance of its components as measured in system tests are discussed.

  18. Construction of the Phase I Forward Pixel Detector

    Science.gov (United States)

    Neylon, Ashton; Bartek, Rachel

    2017-01-01

    The silicon pixel detector is the innermost component of the CMS tracking system, providing high precision space point measurements of charged particle trajectories. The original CMS detector was designed for the nominal instantaneous LHC luminosity of 1 x 1034 cm-2s-1 . The LHC has already started to exceed this luminosity causing the CMS pixel detector to see a dynamic inefficiency caused by data losses due to buffer overflows. For this reason the CMS Collaboration has been building an upgraded pixel detector which is scheduled for installation during an extended year end technical stop during winter 2016/2017. The phase 1 upgrade includes four barrel layers and three forward disks, providing robust tracking and vertexing for LHC luminosities up to 2 x 1034 cm-2s-1 . The upgrade incorporates new readout chips, front-end electronics, DC-DC powering, and dual-phase CO2 cooling to achieve performance exceeding that of the present detector with a lower material budget. This contribution will review the design and technology choices of the Phase I detector and discuss the status of the detector. The challenges and difficulties encountered during the construction will also be presented, as well as the lessons learned for future upgrades. National Science Foundation.

  19. Phase 1 upgrade of the CMS pixel detector

    Science.gov (United States)

    Saha, Anirban

    2017-02-01

    The pixel tracker of the Compact Muon Solenoid (CMS) experiment is the innermost sub-detector, located close to the collision point, and is used for reconstruction of the tracks and vertices of charged particles. The present pixel detector was designed to work efficiently with the maximum instantaneous luminosity of 1 × 1034 cm‑2 s‑1. In 2017 the Large Hadron Collider (LHC) is expected to deliver a peak luminosity reaching up to 2 × 1034 cm‑2 s‑1, increasing the mean number of primary vertices to 50. Due to the radiation damage and significant data losses due to high occupancy in the readout chip of the pixel detector, the present system must be replaced by a new one in an extended end-of-year shutdown during winter 2016/2017 in order to maintain the excellent tracking and other physics performances. The main new features of the upgraded pixel detector are a ultra-light mechanical design with four barrel layers and three end-cap disks, digital readout chip with higher rate capability and a new cooling system. In this document, we discuss the motivations for the upgrade, the design, and technological choices made, the status of the construction of the new detector and the future plans for the installation and commissioning.

  20. Novel integrated CMOS pixel structures for vertex detectors

    Energy Technology Data Exchange (ETDEWEB)

    Kleinfelder, Stuart; Bieser, Fred; Chen, Yandong; Gareus, Robin; Matis, Howard S.; Oldenburg, Markus; Retiere, Fabrice; Ritter, Hans Georg; Wieman, Howard H.; Yamamoto, Eugene

    2003-10-29

    Novel CMOS active pixel structures for vertex detector applications have been designed and tested. The overriding goal of this work is to increase the signal to noise ratio of the sensors and readout circuits. A large-area native epitaxial silicon photogate was designed with the aim of increasing the charge collected per struck pixel and to reduce charge diffusion to neighboring pixels. The photogate then transfers the charge to a low capacitance readout node to maintain a high charge to voltage conversion gain. Two techniques for noise reduction are also presented. The first is a per-pixel kT/C noise reduction circuit that produces results similar to traditional correlated double sampling (CDS). It has the advantage of requiring only one read, as compared to two for CDS, and no external storage or subtraction is needed. The technique reduced input-referred temporal noise by a factor of 2.5, to 12.8 e{sup -}. Finally, a column-level active reset technique is explored that suppresses kT/C noise during pixel reset. In tests, noise was reduced by a factor of 7.6 times, to an estimated 5.1 e{sup -} input-referred noise. The technique also dramatically reduces fixed pattern (pedestal) noise, by up to a factor of 21 in our tests. The latter feature may possibly reduce pixel-by-pixel pedestal differences to levels low enough to permit sparse data scan without per-pixel offset corrections.

  1. The ATLAS tracker strip detector for HL-LHC

    CERN Document Server

    Cormier, Kyle James Read; The ATLAS collaboration

    2016-01-01

    As part of the ATLAS upgrades for the High Luminsotiy LHC (HL-LHC) the current ATLAS Inner Detector (ID) will be replaced by a new Inner Tracker (ITk). The ITk will consist of two main components: semi-conductor pixels at the innermost radii, and silicon strips covering larger radii out as far as the ATLAS solenoid magnet including the volume currently occupied by the ATLAS Transition Radiation Tracker (TRT). The primary challenges faced by the ITk are the higher planned read out rate of ATLAS, the high density of charged particles in HL-LHC conditions for which tracks need to be resolved, and the corresponding high radiation doses that the detector and electronics will receive. The ITk strips community is currently working on designing and testing all aspects of the sensors, readout, mechanics, cooling and integration to meet these goals and a Technical Design Report is being prepared. This talk is an overview of the strip detector component of the ITk, highlighting the current status and the road ahead.

  2. Readout chip for the CMS pixel detector upgrade

    Energy Technology Data Exchange (ETDEWEB)

    Rossini, Marco, E-mail: marco.rossini@phys.ethz.ch

    2014-11-21

    For the CMS experiment a new pixel detector is planned for installation during the extended shutdown in winter 2016/2017. Among the changes of the detector modified front end electronics will be used for higher efficiency at peak luminosity of the LHC and faster readout. The first prototype versions of the new readout chip have been designed and produced. The results of qualification and calibration for the new chip are presented in this paper.

  3. Low mass hybrid pixel detectors for the high luminosity LHC upgrade

    Energy Technology Data Exchange (ETDEWEB)

    Gonella, Laura

    2013-10-15

    Reducing material in silicon trackers is of major importance for a good overall detector performance, and poses severe challenges to the design of the tracking system. To match the low mass constraints for trackers in High Energy Physics experiments at high luminosity, dedicated technological developments are required. This dissertation presents three technologies to design low mass hybrid pixel detectors for the high luminosity upgrades of the LHC. The work targets specifically the reduction of the material from the detector services and modules, with novel powering schemes, flip chip and interconnection technologies. A serial powering scheme is prototyped, featuring a new regulator concept, a control and protection element, and AC-coupled data transmission. A modified flip chip technology is developed for thin, large area Front-End chips, and a via last Through Silicon Via process is demonstrated on existing pixel modules. These technologies, their developments, and the achievable material reduction are discussed using the upgrades of the ATLAS pixel detector as a case study.

  4. Design Methodology: ASICs with complex in-pixel processing for Pixel Detectors

    Energy Technology Data Exchange (ETDEWEB)

    Fahim, Farah [Fermilab

    2014-10-31

    The development of Application Specific Integrated Circuits (ASIC) for pixel detectors with complex in-pixel processing using Computer Aided Design (CAD) tools that are, themselves, mainly developed for the design of conventional digital circuits requires a specialized approach. Mixed signal pixels often require parasitically aware detailed analog front-ends and extremely compact digital back-ends with more than 1000 transistors in small areas below 100μm x 100μm. These pixels are tiled to create large arrays, which have the same clock distribution and data readout speed constraints as in, for example, micro-processors. The methodology uses a modified mixed-mode on-top digital implementation flow to not only harness the tool efficiency for timing and floor-planning but also to maintain designer control over compact parasitically aware layout.

  5. KPIX a pixel detector imaging chip

    CERN Document Server

    Cadeddu, S; Caria, M

    2002-01-01

    We present a VLSI custom device, named KPIX, developed in a 0.6 mu m CMOS technology. The circuit is dedicated to readout solid-state detectors covering large areas (on the order of square centimetre) and featuring very small currents. KPIX integrates 1024 channels (current amplifiers) and 8 ADCs on a 15.5x4 mm sup 2 area. Both an analogue and digital readout are allowed, with a 10 bit amplitude resolution. Amplifiers are organized in 8 columns of 128 rows. When choosing the digital or the analogue readout, the complete set of channels can be read out in about 30 ms. The specific design of the amplification cells allows to measure very small input current levels, on the order of fractions of pico-ampere. Power consumption has also been kept at the level of 80 mu W per cell and 150 mW (peak value) in total. The specific chip architecture and geometry allow use of many KPIX circuits together in order to serve a large detector sensitive area. The KPIX structure is presented along with some measurements character...

  6. Detector Control System for the ATLAS Forward Proton detector

    CERN Document Server

    Czekierda, Sabina; The ATLAS collaboration

    2017-01-01

    The ATLAS Forward Proton (AFP) is a forward detector using a Roman Pot technique, recently installed in the LHC tunnel. It is aiming at registering protons that were diffractively or electromagnetically scattered in soft and hard processes. Infrastructure of the detector consists of hardware placed both in the tunnel and in the control room USA15 (about 330 meters from the Roman Pots). AFP detector, like the other detectors of the ATLAS experiment, uses the Detector Control System (DCS) to supervise the detector and to ensure its safe and coherent operation, since the incorrect detector performance may influence the physics results. The DCS continuously monitors the detector parameters, subset of which is stored in data bases. Crucial parameters are guarded by alarm system. A detector representation as a hierarchical tree-like structure of well-defined subsystems built with the use of the Finite State Machine (FSM) toolkit allows for overall detector operation and visualization. Every node in the hierarchy is...

  7. The first bump-bonded pixel detectors on CVD diamond

    Energy Technology Data Exchange (ETDEWEB)

    Adam, W.; Bauer, C.; Berdermann, E.; Bergonzo, P.; Bogani, F.; Borchi, E.; Brambilla, A.; Bruzzi, M.; Colledani, C.; Conway, J.; Dabrowski, W.; Delpierre, P.; Deneuville, A.; Dulinski, W.; Eijk, B. van; Fallou, A.; Fizzotti, F.; Foulon, F.; Friedl, M.; Gan, K.K.; Gheeraert, E.; Grigoriev, E.; Hallewell, G.; Hall-Wilton, R.; Han, S.; Hartjes, F.; Hrubec, J.; Husson, D.; Kagan, H.; Kania, D.; Kaplon, J.; Karl, C.; Kass, R.; Krammer, M.; Logiudice, A.; Lu, R.; Manfredi, P.F.; Manfredotti, C.; Marshall, R.D.; Meier, D.; Mishina, M.; Oh, A.; Palmieri, V.G.; Pan, L.S.; Peitz, A.; Pernicka, M.; Pirollo, S.; Polesello, P.; Pretzl, K.; Re, V.; Riester, J.L.; Roe, S.; Roff, D.; Rudge, A.; Schnetzer, S.; Sciortino, S.; Speziali, V.; Stelzer, H.; Steuerer, J.; Stone, R.; Tapper, R.J.; Tesarek, R.; Trawick, M.; Trischuk, W. E-mail: william@physics.utoronto.ca; Turchetta, R.; Vittone, E.; Wagner, A.; Walsh, A.M.; Wedenig, R.; Weilhammer, P.; Zeuner, W.; Ziock, H.; Zoeller, M.; Charles, E.; Ciocio, A.; Dao, K.; Einsweiler, K.; Fasching, D.; Gilchriese, M.; Joshi, A.; Kleinfelder, S.; Milgrome, O.; Palaio, N.; Richardson, J.; Sinervo, P.; Zizka, G

    1999-11-01

    Diamond is a nearly ideal material for detecting ionising radiation. Its outstanding radiation hardness, fast charge collection and low leakage current allow it to be used in high radiation environments. These characteristics make diamond sensors particularly appealing for use in the next generation of pixel detectors. Over the last year, the RD42 collaboration has worked with several groups that have developed pixel readout electronics in order to optimise diamond sensors for bump-bonding. This effort resulted in an operational diamond pixel sensor that was tested in a pion beam. We demonstrate that greater than 98% of the channels were successfully bump-bonded and functioning. The device shows good overall hit efficiency as well as clear spatial hit correlation to tracks measured in a silicon reference telescope. A position resolution of 14.8 {mu}m was observed, consistent with expectations given the detector pitch.

  8. Performance of the INTPIX6 SOI pixel detector

    Science.gov (United States)

    Arai, Y.; Bugiel, Sz.; Dasgupta, R.; Idzik, M.; Kapusta, P.; Kucewicz, W.; Miyoshi, T.; Turala, M.

    2017-01-01

    Characterization of the monolithic pixel detector INPTIX6, designed at KEK and fabricated in Lapis 0.2 μ m Fully-Depleted, Low-Leakage Silicon-On-Insulator (SOI) CMOS technology, was performed. The INTPIX6 comprises a large area of 1408 × 896 integrating type squared pixels of 12 micron pitch. In this work the performance and measurement results of the prototypes produced on lower resistivity Czochralski type (CZ-n) and high resistivity floating zone (FZ-n) sensor wafers are presented. Using 241Am radioactive source the noise of INTPIX6 was measured, showing the ENC (Equivalent Noise Charge) of about 70 e-. The resolution calculated from the FWHM of the Iron-55 X-ray peak was about 100 e-. The radiation hardness of the SOI pixel detector was also investigated. The CZ-n type INTPIX6 received a dose of 60 krad and its performance has been continuously monitored during the irradiation.

  9. Fabrication and Test of Pixelated CZT Detectors with Different Pixel Pitches and Thicknesses

    OpenAIRE

    Li, Q.; Garson, A.; Dowkontt, P.; Martin, J.; Beilicke, M; Jung, I.; Groza, M.; A. Burger; De Geronimo, G.; Krawczynski, H.; .

    2008-01-01

    The main methods grown Cadmium Zinc Telluride (CZT) crystals with high yield and excellent homogeneity are Modified Horizontal Bridgman (MHB) and High Pressure Bridgman (HPB) processes, respectively. In this contribution, the readout system based on two 32-channel NCI-ASICs for pixellated CZT detector arrays has been developed and tested. The CZT detectors supplied by Orbotech (MHB) and eV products (HPB) are tested by NCI-ASIC readout system. The CZT detectors have an array of 8x8 or 11x11 pi...

  10. Phase 1 upgrade of the CMS Pixel Detector

    CERN Document Server

    Saha, Anirban

    2016-01-01

    The pixel tracker of the Compact Muon Solenoid (CMS) experiment is the innermost sub-detector, located close to the collision point, and is used for reconstruction of the tracks and vertices of charged particles. The present pixel detector was designed to work efficiently with the maximum instantaneous luminosity of $\\rm 1 \\times 10^{34}$ cm$^{-2}$ s$^{-1}$. In 2017 the Large Hadron Collider (LHC) is expected to deliver a peak luminosity reaching up to $\\rm 2\\times10^{34} cm^{-2}s^{-1}$, increasing the mean number of primary vertices to 50. Due to the radiation damage and significant data losses due to high occupancy in the readout chip of the pixel detector, the present system must be replaced by a new one in an extended end-of-year shutdown during winter 2016/2017 in order to maintain the excellent tracking and other physics performances. The main new features of the upgraded pixel detector are the a ultra-light mechanical design with four barrel layers and three end-cap disks, digital readout chip with hi...

  11. Development of n-in-p pixel modules for the ATLAS upgrade at HL-LHC

    Science.gov (United States)

    Macchiolo, A.; Nisius, R.; Savic, N.; Terzo, S.

    2016-09-01

    Thin planar pixel modules are promising candidates to instrument the inner layers of the new ATLAS pixel detector for HL-LHC, thanks to the reduced contribution to the material budget and their high charge collection efficiency after irradiation. 100-200 μm thick sensors, interconnected to FE-I4 read-out chips, have been characterized with radioactive sources and beam tests at the CERN-SPS and DESY. The results of these measurements are reported for devices before and after irradiation up to a fluence of 14 ×1015 neq /cm2 . The charge collection and tracking efficiency of the different sensor thicknesses are compared. The outlook for future planar pixel sensor production is discussed, with a focus on sensor design with the pixel pitches (50×50 and 25×100 μm2) foreseen for the RD53 Collaboration read-out chip in 65 nm CMOS technology. An optimization of the biasing structures in the pixel cells is required to avoid the hit efficiency loss presently observed in the punch-through region after irradiation. For this purpose the performance of different layouts have been compared in FE-I4 compatible sensors at various fluence levels by using beam test data. Highly segmented sensors will represent a challenge for the tracking in the forward region of the pixel system at HL-LHC. In order to reproduce the performance of 50×50 μm2 pixels at high pseudo-rapidity values, FE-I4 compatible planar pixel sensors have been studied before and after irradiation in beam tests at high incidence angle (80°) with respect to the short pixel direction. Results on cluster shapes, charge collection and hit efficiency will be shown.

  12. GaAs Medipix2 hybrid pixel detector

    CERN Document Server

    Kostamo, P; Vähänen, S; Tlustos, L; Fröjdh, C; Campbell, M; Zhilyaev, Y; Lipsanen, H

    2008-01-01

    A GaAs Medipix2 hybrid pixel detector based on high purity epitaxial GaAs material was successfully fabricated. The mesa type GaAs sensor with 256×256 pixels and total area of 1.4×1.4 cm2 was made of a 140-μm-thick epitaxial p–i–n structure utilizing reactive ion etching. A final thickness of approximately 110 μm for the all-epitaxial sensor element is achieved by back-thinning procedure. The sensor element is bump bonded to a Medipix2 read-out ASIC. The detector is capable of room temperature spectroscopic operation and it demonstrates the potential of GaAs for high resolution X-ray imaging systems operating at room temperature. This work describes the manufacturing process and electrical properties of the GaAs Medipix2 hybrid detector.

  13. Signal variations in high granularity Si pixel detectors

    CERN Document Server

    Tlustos, L; Heijne, Erik H M; Llopart-Cudie, Xavier

    2004-01-01

    Fixed pattern noise is one of the limiting factors of image quality and degrades the achievable spatial resolution. In the case of silicon sensors non-uniformities due to doping inhomogeneities can be limited by operating the sensor in strong overdepletion. For high granularity photon counting pixel detectors an additional high frequency interpixel signal variation is an important factor for the achievable signal to noise ratio (SNR). It is common practice to apply flatfield corrections to increase the SNR of the detector system. For the case of direct conversion detectors it can be shown that the Poisson limit can be reached for floodfield irradiation. However when used for imaging with spectral X-ray sources flatfield corrections are less effective. This is partly a consequence of charge sharing between adjacent pixels, which gives rise to an effective energy spectrum seen by the readout, which is different from the spectral content of the incident beam. In this paper we present simulations and measurements...

  14. An EUDET/AIDA Pixel Beam Telescope for Detector Development

    CERN Document Server

    Rubinskiy, I

    2015-01-01

    Ahigh resolution(σ< 2 μm) beam telescope based on monolithic active pixel sensors (MAPS) was developed within the EUDET collaboration. EUDET was a coordinated detector R&D programme for the future International Linear Collider providing test beam infrastructure to detector R&D groups. The telescope consists of six sensor planes with a pixel pitch of either 18.4 μm or 10 μmand canbe operated insidea solenoidal magnetic fieldofupto1.2T.Ageneral purpose cooling, positioning, data acquisition (DAQ) and offine data analysis tools are available for the users. The excellent resolution, readout rate andDAQintegration capabilities made the telescopea primary beam tests tool also for several CERN based experiments. In this report the performance of the final telescope is presented. The plans for an even more flexible telescope with three differentpixel technologies(ATLASPixel, Mimosa,Timepix) withinthenew European detector infrastructure project AIDA are presented.

  15. Pixel detector system development at Diamond Light Source

    Science.gov (United States)

    Marchal, J.; Horswell, I.; Gimenez, E. N.; Tartoni, N.

    2010-10-01

    Hybrid pixel detectors consisting of an array of silicon photodiodes bump-bonded to CMOS read-out chips provide high signal-to-noise ratio and high dynamic range compared to CCD-based detectors and Image Plates. These detector features are important for SAXS experiments where a wide range of intensities are present in the images. For time resolved SAXS experiments, high frame rates are compulsory. The latest CMOS read-out chip developed by the MEDIPIX collaboration provides high frame rate and continuous acquisition mode. A read-out system for an array of MEDIPIX3 sensors is under development at Diamond Light Source. This system will support a full resolution frame rate of 1 kHz at a pixel counter depth of 12-bit and a frame rate of 30 kHz at a counter depth of 1 bit. Details concerning system design and MEDIPIX sensors characterization are presented.

  16. Silicon Strip Detectors for the ATLAS sLHC Upgrade

    CERN Document Server

    Miñano, M; The ATLAS collaboration

    2011-01-01

    While the Large Hadron Collider (LHC) at CERN is continuing to deliver an ever-increasing luminosity to the experiments, plans for an upgraded machine called Super-LHC (sLHC) are progressing. The upgrade is foreseen to increase the LHC design luminosity by a factor ten. The ATLAS experiment will need to build a new tracker for sLHC operation, which needs to be suited to the harsh sLHC conditions in terms of particle rates. In order to cope with the increase in pile-up backgrounds at the higher luminosity, an all silicon detector is being designed. To successfully face the increased radiation dose, a new generation of extremely radiation hard silicon detectors is being designed. The left part of figure 1 shows the simulated layout for the ATLAS tracker upgrade to be installed in the volume taken up by the current ATLAS pixel, strip and transition radiation detectors. Silicon sensors with sufficient radiation hardness are the subject of an international R&D programme, working on pixel and strip sensors. The...

  17. The Pixels find their way to the heart of ATLAS

    CERN Multimedia

    Kevin Einsweiler

    Since the last e-news article on the Pixel Detector in December 2006, there has been much progress. At that time, we were just about to receive the Beryllium beampipe, and to integrate the innermost layer of the Pixel Detector around it. This innermost layer is referred to as the B-layer because of the powerful role it plays in finding the secondary vertices that are the key signature for the presence of b-quarks, and with somewhat greater difficulty, c-quarks and tau leptons. The integration of the central 7m long beampipe into the Pixel Detector was completed in December, and the B-layer was successfully integrated around it. In January this year, we had largely completed the central 1.5m long detector, including the three barrel layers and the three disk layers on each end of the barrel. Although this region contains all of the 80 million readout channels, it cannot be integrated into the Inner Detector without additional services and infrastructure. Therefore, the next step was to add the Service Panels...

  18. Line profile modelling for multi-pixel CZT detectors

    Science.gov (United States)

    Chattopadhyay, T.; Vadawale, S. V.; Rao, A. R.; Bhattacharya, D.; Mithun, N. P. S.; Bhalerao, V.

    2016-07-01

    Cadmium Zinc Telluride (CZT) detectors have been the mainstay for hard X-ray astronomy for its high quantum efficiency, fine energy resolution, near room temperature operation, and radiation hardness. In order to fully utilize the spectroscopic capabilities of CZT detectors, it is important to generate accurate response matrix, which in turn requires precise modelling of the line profiles for the CZT detectors. We have developed a numerical model taking into account the mobility and lifetime of the charge carriers and intrpixel charge sharing for the CZT detectors. This paper describes the details of the modelling along with the experimental measurements of mobility, lifetime and charge sharing fractions for the CZT detector modules of thickness of 5 mm and 2.5 mm pixel size procured from Orbotech Medical Solutions (same modules used in AstroSat-CZTI).

  19. A 65 nm CMOS analog processor with zero dead time for future pixel detectors

    Science.gov (United States)

    Gaioni, L.; Braga, D.; Christian, D. C.; Deptuch, G.; Fahim, F.; Nodari, B.; Ratti, L.; Re, V.; Zimmerman, T.

    2017-02-01

    Next generation pixel chips at the High-Luminosity (HL) LHC will be exposed to extremely high levels of radiation and particle rates. In the so-called Phase II upgrade, ATLAS and CMS will need a completely new tracker detector, complying with the very demanding operating conditions and the delivered luminosity (up to 5×1034 cm-2 s-1 in the next decade). This work is concerned with the design of a synchronous analog processor with zero dead time developed in a 65 nm CMOS technology, conceived for pixel detectors at the HL-LHC experiment upgrades. It includes a low noise, fast charge sensitive amplifier featuring a detector leakage compensation circuit, and a compact, single ended comparator that guarantees very good performance in terms of channel-to-channel dispersion of threshold without needing any pixel-level trimming. A flash ADC is exploited for digital conversion immediately after the charge amplifier. A thorough discussion on the design of the charge amplifier and the comparator is provided along with an exhaustive set of simulation results.

  20. ATLAS detector records its first curved muon

    CERN Multimedia

    2007-01-01

    The barrel muon spectrometer of the ATLAS detector has acquired its first cosmic event in a magnetic field produced by the barrel toroid magnet. This was an important test of the chambers in their final configurations, and marked the first triggering and measurement of curved cosmic ray muons in ATLAS.

  1. Semiconductor micropattern pixel detectors a review of the beginnings

    CERN Document Server

    Heijne, Erik H M

    2001-01-01

    The innovation in monolithic and hybrid semiconductor 'micropattern' or 'reactive' pixel detectors for tracking in particle physics was actually to fit logic and pulse processing electronics with µW power on a pixel area of less than 0.04 mm2, retaining the characteristics of a traditional nuclear amplifier chain. The ns timing precision in conjunction with local memory and logic operations allowed event selection at > 10 MHz rates with unambiguous track reconstruction even at particle multiplicities > 10 cm-2. The noise in a channel was ~100 e- r.m.s. and enabled binary operation with random noise 'hits' at a level 30 Mrad, respectively.

  2. Comprehensive measurements of GaAs pixel detectors capacitance

    CERN Document Server

    Caria, M; D'Auria, S; Lai, A; Randaccio, P; Cadeddu, S

    2002-01-01

    We have studied GaAs pixel detectors on semi-insulating wafers with Schottky contacts. We performed comprehensive measurements on the inter-pixel and capacitance to back plane. Being semi-insulating, the behaviour is totally different with respect to other common semiconductors, such as high resistivity silicon. Non-homogeneities are also an issue, due to both the contacts and the crystal bulk. In order to detect them and their influence on capacitance, we undertook systematic measurements with different configurations of the measuring electrodes.

  3. Tracking and flavour-tagging performance for HV-CMOS sensors in the context of the ATLAS ITK pixel simulation program

    Science.gov (United States)

    Calandri, A.; Vacavant, L.; Barbero, M.; Rozanov, A.; Djama, F.

    2016-12-01

    The HV-CMOS (High Voltage - Complementary Metal-Oxide Semiconductor) pixel technology has recently risen interest for the upgrade of the pixel detector of the ATLAS experiment towards the High Luminosity phase of the Large Hadron Collider (LHC) . HV-CMOS sensors can be employed in the pixel outer layers (R >15 cm), where the radiation hardness requirements are less stringent, as they could instrument large areas at a relatively low cost. In addition, smaller pixel granularity can be achieved by exploiting sub-pixel encoding technology. Therefore, the largest impact on physics performance, tracking and flavour tagging, could be reached if exploited in the innermost layer (in place of the current IBL) or in the next-to-innermost layer. This proceeding will present studies on tracking and flavour-tagging performance in presence of HV-CMOS sensors in the innermost layer of the ATLAS detector.

  4. High frame rate measurements of semiconductor pixel detector readout IC

    Science.gov (United States)

    Szczygiel, R.; Grybos, P.; Maj, P.

    2012-07-01

    We report on high count rate and high frame rate measurements of a prototype IC named FPDR90, designed for readouts of hybrid pixel semiconductor detectors used for X-ray imaging applications. The FPDR90 is constructed in 90 nm CMOS technology and has dimensions of 4 mm×4 mm. Its main part is a matrix of 40×32 pixels with 100 μm×100 μm pixel size. The chip works in the single photon counting mode with two discriminators and two 16-bit ripple counters per pixel. The count rate per pixel depends on the effective CSA feedback resistance and can be set up to 6 Mcps. The FPDR90 can operate in the continuous readout mode, with zero dead time. Due to the architecture of digital blocks in pixel, one can select the number of bits read out from each counter from 1 to 16. Because in the FPDR90 prototype only one data output is available, the frame rate is 9 kfps and 72 kfps for 16 bits and 1 bit readout, respectively (with nominal clock frequency of 200 MHz).

  5. High frame rate measurements of semiconductor pixel detector readout IC

    Energy Technology Data Exchange (ETDEWEB)

    Szczygiel, R., E-mail: robert.szczygiel@agh.edu.pl [AGH University of Science and Technology, Department of Measurement and Instrumentation, Al. Mickiewicza 30, 30-059 Cracow (Poland); Grybos, P.; Maj, P. [AGH University of Science and Technology, Department of Measurement and Instrumentation, Al. Mickiewicza 30, 30-059 Cracow (Poland)

    2012-07-11

    We report on high count rate and high frame rate measurements of a prototype IC named FPDR90, designed for readouts of hybrid pixel semiconductor detectors used for X-ray imaging applications. The FPDR90 is constructed in 90 nm CMOS technology and has dimensions of 4 mm Multiplication-Sign 4 mm. Its main part is a matrix of 40 Multiplication-Sign 32 pixels with 100 {mu}m Multiplication-Sign 100 {mu}m pixel size. The chip works in the single photon counting mode with two discriminators and two 16-bit ripple counters per pixel. The count rate per pixel depends on the effective CSA feedback resistance and can be set up to 6 Mcps. The FPDR90 can operate in the continuous readout mode, with zero dead time. Due to the architecture of digital blocks in pixel, one can select the number of bits read out from each counter from 1 to 16. Because in the FPDR90 prototype only one data output is available, the frame rate is 9 kfps and 72 kfps for 16 bits and 1 bit readout, respectively (with nominal clock frequency of 200 MHz).

  6. Development of n-in-p pixel modules for the ATLAS Upgrade at HL-LHC

    CERN Document Server

    Macchiolo, Anna; Savic, Natascha; Terzo, Stefano

    2016-01-01

    Thin planar pixel modules are promising candidates to instrument the inner layers of the new ATLAS pixel detector for HL-LHC, thanks to the reduced contribution to the material budget and their high charge collection efficiency after irradiation. 100-200 $\\mu$m thick sensors, interconnected to FE-I4 read-out chips, have been characterized with radioactive sources and beam tests at the CERN-SPS and DESY. The results of these measurements are reported for devices before and after irradiation up to a fluence of $14\\times10^{15}$ n$_{eq}$/cm$^2$. The charge collection and tracking efficiency of the different sensor thicknesses are compared. The outlook for future planar pixel sensor production is discussed, with a focus on sensor design with the pixel pitches (50x50 and 25x100 $\\mu$m$^2$) foreseen for the RD53 Collaboration read-out chip in 65 nm CMOS technology. An optimization of the biasing structures in the pixel cells is required to avoid the hit efficiency loss presently observed in the punch-through region...

  7. Pixel sensors with different pitch layouts for ATLAS Phase-II upgrade

    CERN Document Server

    Dervan, Paul

    2014-01-01

    Different pitch layouts are considered for the pixel detector being designed for the ATLAS up- graded tracking system which will be operating at the High Luminosity LHC. The tracking per- formance in the Endcap pixel regions could benefit from pixel layouts which differ from the ge- ometries used in the barrel region. Also, the performance in different barrel layers and eta regions could be optimised using different pixel sizes. This presentation will report on the development and tests of pitch layouts which could be readout by the FE-I4 ASICs. The pixel geometries in- clude 50 250 m m 2 , 25 500 m m 2 , 100 125 m m 2 , 125 167 m m 2 , 50 2000 m m 2 and 25 2000 m m 2 . The sensors with geometries 50 250 m m 2 , 25 500 m m 2 and 100 125 m m 2 were irradiated and tested at the DESY testbeam. These and other testbeam results as well as results from characterisation of these sensors in the laboratory will be presented

  8. MTF study of planar small pixel pitch quantum IR detectors

    Science.gov (United States)

    Gravrand, O.; Baier, N.; Ferron, A.; Rochette, F.; Berthoz, J.; Rubaldo, L.; Cluzel, R.

    2014-06-01

    The actual trend in quantum IR detector development is the design of very small pixel pitch large arrays. From previously 30μm pitch, the standard pixel pitch is today 15μm and is expected to decrease to 12μm in the next few years. Furthermore, focal plane arrays (FPA) with pixel pitch as small as small as 10μm has been demonstrated. Such ultra-small pixel pitches are very small compared to the typical length ruling the electrical characteristics of the absorbing materials, namely the minority carrier diffusion length. As an example for low doped N type HgCdTe or InSb material, this diffusion length is of the order of 30 to 50μm, i.e. 3 to 5 times the targeted pixel pitches. This has strong consequences on the modulation transfer function (MTF) for planar structures, where the lateral extension of the photodiode is limited by diffusion. For such aspect ratios, the self-confinement of neighboring diodes may not be efficient enough to maintain optimal MTF. Therefore, this issue has to be addressed in order to take full benefits of the pixel pitch reduction in terms of image resolution. This paper aims at investigating the MTF evolution of HgCdTe and InSb FPAs decreasing the pixel pitch below 15μm. Both experimental measurements and finite element simulations are used to discuss this issue. Different scenarii will be compared, namely deep mesa etch between pixels, internal drift, surface recombination, thin absorbing layers.

  9. SLID-ICV Vertical Integration Technology for the ATLAS Pixel Upgrades

    CERN Document Server

    Macchiolo, A; Moser, H G; Nisius, R; Richter, R H; Weigell, P

    2012-01-01

    We present the results of the characterization of pixel modules composed of 75 μm thick n-in-p sensors and ATLAS FE-I3 chips, interconnected with the SLID (Solid Liquid Inter-Diffusion) technology. This technique, developed at Fraunhofer-EMFT, is explored as an alternative to the bump-bonding process. These modules have been designed to demonstrate the feasibility of a very compact detector to be employed in the future ATLAS pixel upgrades, making use of vertical integration technologies. This module concept also envisages Inter-Chip-Vias (ICV) to extract the signals from the backside of the chips, thereby achieving a higher fraction of active area with respect to the present pixel module design. In the case of the demonstrator module, ICVs are etched over the original wire bonding pads of the FE-I3 chip. In the modules with ICVs the FE-I3 chips will be thinned down to 50 um. The status of the ICV preparation is presented.

  10. CMS Pixel Detector design for HL-LHC

    CERN Document Server

    Migliore, Ernesto

    2016-01-01

    The LHC machine is planning an upgrade program which will smoothly bring the luminosity to about 7.5$\\times$10$^{34}$cm$^{-2}$s$^{-1}$ in 2028, to possibly reach an integrated luminosity of 3000 fb$^{-1}$ by the end of 2037. This High Luminosity scenario, HL-LHC, will present new challenges in higher data rates and increased radiation.In order to maintain its physics reach the CMS Collaboration has undertaken a preparation program of the detector known as Phase-2 upgrade. The CMS Phase-2 Pixel upgrade will require a high bandwidth readout system and high radiation tolerance for sensors and on-detector ASICs. Several technologies for the upgrade sensors are being studied. Serial powering schemes are under consideration to accommodate significant constraints on the system. These prospective designs, as well as new layout geometries that include very forward pixel discs, will be presented together with performance estimations.

  11. Optimisation of ROB mapping for SCT and Pixel detectors

    CERN Document Server

    Wheeler, S

    1999-01-01

    A simple object-oriented program has been written to simulate the SCT and Pixel detectors in order to determine the suitability of various ROB mapping schemes in the context of the Level 2 trigger. Layer and tower mappings have been investigated separately for the SCT barrel and endcap and for the Pixel barrel and endcap. Events containing one RoI were fired at each detector part and the number of ROBs hit determined. As a result, plots of ROB output data rates and ROB hit frequency as a function of ROB ID were obtained. In general it was found that layer mapping schemes might result in unacceptably high data rates and frequencies. This result would have to be confirmed with more detailed modelling. The tower mappings investigated, in general produced acceptable rates.

  12. The ALICE Silicon Pixel Detector Control and Calibration Systems

    CERN Document Server

    Calì, Ivan Amos; Manzari, Vito; Stefanini, Giorgio

    2008-01-01

    The work presented in this thesis was carried out in the Silicon Pixel Detector (SPD) group of the ALICE experiment at the Large Hadron Collider (LHC). The SPD is the innermost part (two cylindrical layers of silicon pixel detec- tors) of the ALICE Inner Tracking System (ITS). During the last three years I have been strongly involved in the SPD hardware and software development, construction and commissioning. This thesis is focused on the design, development and commissioning of the SPD Control and Calibration Systems. I started this project from scratch. After a prototyping phase now a stable version of the control and calibration systems is operative. These systems allowed the detector sectors and half-barrels test, integration and commissioning as well as the SPD commissioning in the experiment. The integration of the systems with the ALICE Experiment Control System (ECS), DAQ and Trigger system has been accomplished and the SPD participated in the experimental December 2007 commissioning run. The complex...

  13. CMS Pixel Detector design for HL-LHC

    Science.gov (United States)

    Migliore, E.

    2016-12-01

    The LHC machine is planning an upgrade program which will smoothly bring the luminosity to about 7.5×1034cm-2s-1 in 2028, to possibly reach an integrated luminosity of 3000 fb-1 by the end of 2037. This High Luminosity scenario, HL-LHC, will present new challenges in higher data rates and increased radiation. In order to maintain its physics reach the CMS collaboration has undertaken a preparation program of the detector known as Phase-2 upgrade. The CMS Phase-2 Pixel upgrade will require a high bandwidth readout system and high radiation tolerance for sensors and on-detector ASICs. Several technologies for the upgrade sensors are being studied. Serial powering schemes are under consideration to accommodate significant constraints on the system. These prospective designs, as well as new layout geometries that include very forward pixel discs, will be presented together with performance estimation.

  14. Monolithic active pixel radiation detector with shielding techniques

    Energy Technology Data Exchange (ETDEWEB)

    Deptuch, Grzegorz W.

    2016-09-06

    A monolithic active pixel radiation detector including a method of fabricating thereof. The disclosed radiation detector can include a substrate comprising a silicon layer upon which electronics are configured. A plurality of channels can be formed on the silicon layer, wherein the plurality of channels are connected to sources of signals located in a bulk part of the substrate, and wherein the signals flow through electrically conducting vias established in an isolation oxide on the substrate. One or more nested wells can be configured from the substrate, wherein the nested wells assist in collecting charge carriers released in interaction with radiation and wherein the nested wells further separate the electronics from the sensing portion of the detector substrate. The detector can also be configured according to a thick SOA method of fabrication.

  15. Descent of the Silicon Pixel Detector (SPD) for ALICE Experiment

    CERN Multimedia

    2007-01-01

    The Silicon Pixel Detector (SPD) constitutes the two innermost layers of the ALICE Inner Tracking System (ITS) at radii of 3.9 cm and 7.6 cm, respectively. It is a fundamental element for the determination of the position of the primary vertex as well as for the measurement of the impact parameter of secondary tracks originating from the weak decays of strange, charm and beauty particles.

  16. Pixel diamond detectors for excimer laser beam diagnostics

    Science.gov (United States)

    Girolami, M.; Allegrini, P.; Conte, G.; Salvatori, S.

    2011-05-01

    Laser beam profiling technology in the UV spectrum of light is evolving with the increase of excimer lasers and lamps applications, that span from lithography for VLSI circuits to eye surgery. The development of a beam-profiler, able to capture the excimer laser single pulse and process the acquired pixel current signals in the time period between each pulse, is mandatory for such applications. 1D and 2D array detectors have been realized on polycrystalline CVD diamond specimens. The fast diamond photoresponse, in the ns time regime, suggests the suitability of such devices for fine tuning feedback of high-power pulsed-laser cavities, whereas solar-blindness guarantees high performance in UV beam diagnostics, also under high intensity background illumination. Offering unique properties in terms of thermal conductivity and visible-light transparency, diamond represents one of the most suitable candidate for the detection of high-power UV laser emission. The relatively high resistivity of diamond in the dark has allowed the fabrication of photoconductive vertical pixel-detectors. A semitransparent light-receiving back-side contact has been used for detector biasing. Each pixel signal has been conditioned by a multi-channel read-out electronics made up of a high-sensitive integrator and a Σ-Δ A/D converter. The 500 μs conversion time has allowed a data acquisition rate up to 2 kSPS (Sample Per Second).

  17. Studio di Rivelatori a Pixel di nuova generazione per il Sistema di Tracciamento di ATLAS.

    CERN Document Server

    Gaudiello, Andrea; Schiavi, Carlo

    In 2013 the LHC will undergo a long shutdown (Phase 0) in preparation for a an energy and luminosity upgrade. During this period the ATLAS Pixel Detector (that is the tracking detector closest to the beamline) will be upgraded. The new detector, called Insertable B-Layer (IBL), will be installed between the existing pixel detector and a new beam-pipe of smaller radius in order to ensure and maintain excellent performance of tracking, vertexing and jet flavor tagging. To satisfy the new requirements a new electronic front- end (FE-I4) and 2 sensor technologies have been developed: Planar and 3D. Genova is one of two sites dedicated to the assembly of the modules of IBL. The work is then carried out in two parallel directions: on one hand the production and its optimization; on the other the comparison and testing of these new technologies. Chapter 1 gives an overview of the theoretical framework needed to understand the importance and the goals of the experiments operating at the Large Hadron Collider (LHC), w...

  18. Strip Detector for the ATLAS Detector Upgrade for the High - Luminosity LHC

    CERN Document Server

    Sperlich, Dennis; The ATLAS collaboration

    2016-01-01

    The planned HL-LHC (High Luminosity LHC) in 2025 is being designed to maximise the physics potential of the LHC through a sizeable increase in the luminosity, reaching 1*10^35 cm2s-1 after 10 years of operation. A consequence of this increased luminosity is the expected radiation damage at an integrated luminosity of 3000/fb, requiring the tracking detectors to withstand hadron fluencies to over 1*10^16 1 MeV neutron equivalent per cm2. With the addition of increased readout rates, a complete re-design of the current ATLAS Inner Detector (ID) is being developed as the Inner Tracker (ITk), which will consist of both strip and pixelated silicon detectors. The physics motivations, required performance characteristics and basic design of the proposed upgrade of the strip detector will be a subject of this talk. Present ideas and solutions for the strip detector and current research and development program will be discussed.

  19. Strip Detector for the ATLAS Detector Upgrade for the High-Luminosity LHC

    CERN Document Server

    Sperlich, Dennis; The ATLAS collaboration

    2016-01-01

    The planned HL-LHC (High Luminosity LHC) in 2025 is being designed to maximise the physics potential of the LHC through a sizeable increase in the luminosity, reaching 1*10^35 cm2s-1 after 10 years of operation. A consequence of this increased luminosity is the expected radiation damage at an integrated luminosity of 3000/fb, requiring the tracking detectors to withstand hadron fluencies to over 1*10^16 1 MeV neutron equivalent per cm2. With the addition of increased readout rates, a complete re-design of the current ATLAS Inner Detector (ID) is being developed as the Inner Tracker (ITk), which will consist of both strip and pixelated silicon detectors. The physics motivations, required performance characteristics and basic design of the proposed upgrade of the strip detector will be a subject of this talk. Present ideas and solutions for the strip detector and current research and development program will be discussed.

  20. Radiation hardness and timing studies of a monolithic TowerJazz pixel design for the new ATLAS Inner Tracker

    Science.gov (United States)

    Riegel, C.; Backhaus, M.; Van Hoorne, J. W.; Kugathasan, T.; Musa, L.; Pernegger, H.; Riedler, P.; Schaefer, D.; Snoeys, W.; Wagner, W.

    2017-01-01

    A part of the upcoming HL-LHC upgrade of the ATLAS Detector is the construction of a new Inner Tracker. This upgrade opens new possibilities, but also presents challenges in terms of occupancy and radiation tolerance. For the pixel detector inside the inner tracker, hybrid modules containing passive silicon sensors and connected readout chips are presently used, but require expensive assembly techniques like fine-pitch bump bonding. Silicon devices fabricated in standard commercial CMOS technologies, which include part or all of the readout chain, are also investigated offering a reduced cost as they are cheaper per unit area than traditional silicon detectors. If they contain the full readout chain, as for a fully monolithic approach, there is no need for the expensive flip-chip assembly, resulting in a further cost reduction and material savings. In the outer pixel layers of the ATLAS Inner Tracker, the pixel sensors must withstand non-ionising energy losses of up to 1015 n/cm2 and offer a timing resolution of 25 ns or less. This paper presents test results obtained on a monolithic test chip, the TowerJazz 180nm Investigator, towards these specifications. The presented program of radiation hardness and timing studies has been launched to investigate this technology's potential for the new ATLAS Inner Tracker.

  1. Radiation hardness studies of n{sup +}-in-n planar pixel sensors for the ATLAS upgrades

    Energy Technology Data Exchange (ETDEWEB)

    Altenheiner, S.; Goessling, C.; Jentzsch, J.; Klingenberg, R. [Lehrstuhl fuer Experimentelle Physik IV, TU Dortmund, 44221 Dortmund (Germany); Muenstermann, D., E-mail: Daniel.Muenstermann@TU-Dortmund.de [Lehrstuhl fuer Experimentelle Physik IV, TU Dortmund, 44221 Dortmund (Germany); Rummler, A.; Troska, G.; Wittig, T. [Lehrstuhl fuer Experimentelle Physik IV, TU Dortmund, 44221 Dortmund (Germany)

    2011-12-01

    The ATLAS experiment at the LHC is planning upgrades of its pixel detector to cope with the luminosity increase foreseen in the coming years within the transition from LHC to Super-LHC (SLHC/HL-LHC). Associated with the increase in instantaneous luminosity is a rise of the target integrated luminosity from 730 to about 3000 fb{sup -1} which directly translates into significantly higher radiation damage. These upgrades consist of the installation of a 4th pixel layer, the insertable b-layer IBL, with a mean sensor radius of only 32 mm from the beam axis, before 2016/17. In addition, the complete pixel detector will be exchanged before 2020/21. Being very close to the beam, the radiation damage of the IBL sensors might be as high as 5 Multiplication-Sign 10{sup 15}n{sub eq}cm{sup -2} at their end-of-life. The total fluence of the innermost pixel layer after the SLHC upgrade might even reach 2 Multiplication-Sign 10{sup 16}n{sub eq}cm{sup -2}. To investigate the radiation hardness and suitability of the current ATLAS pixel sensors for these fluences, n{sup +}-in-n silicon pixel sensors from the ATLAS Pixel production have been irradiated by reactor neutrons to the IBL design fluence and been tested with pions at the SPS and with electrons from a {sup 90}Sr source in the laboratory. The collected charge after IBL fluences was found to exceed 10 000 electrons per MIP at 1 kV of bias voltage which is in agreement with data collected with strip sensors. After SLHC fluences, still reliable operation of the devices could be observed with a collected charge of more than 5000 electrons per MIP.

  2. Small-Scale Readout Systems Prototype for the STAR PIXEL Detector

    Energy Technology Data Exchange (ETDEWEB)

    Szelezniak, Michal A.; Besson, Auguste; Colledani, Claude; Dorokhov, Andrei; Dulinski, Wojciech; Greiner, Leo C.; Himmi, Abdelkader; Hu, Christine; Matis, Howard S.; Ritter, Hans Georg; Rose, Andrew; Shabetai, Alexandre; Stezelberger, Thorsten; Sun, Xiangming; Thomas, Jim H.; Valin, Isabelle; Vu, Chinh Q.; Wieman, Howard H.; Winter, Marc

    2008-10-01

    A prototype readout system for the STAR PIXEL detector in the Heavy Flavor Tracker (HFT) vertex detector upgrade is presented. The PIXEL detector is a Monolithic Active Pixel Sensor (MAPS) based silicon pixel vertex detector fabricated in a commercial CMOS process that integrates the detector and front-end electronics layers in one silicon die. Two generations ofMAPS prototypes designed specifically for the PIXEL are discussed. We have constructed a prototype telescope system consisting of three small MAPS sensors arranged in three parallel and coaxial planes with a readout system based on the readout architecture for PIXEL. This proposed readout architecture is simple and scales to the size required to readout the final detector. The real-time hit finding algorithm necessary for data rate reduction in the 400 million pixel detector is described, and aspects of the PIXEL system integration into the existing STAR framework are addressed. The complete system has been recently tested and shown to be fully functional.

  3. Alignment of the Pixel and SCT Modules for the 2004 ATLAS Combined Test Beam

    Energy Technology Data Exchange (ETDEWEB)

    ATLAS Collaboration; Ahmad, A.; Andreazza, A.; Atkinson, T.; Baines, J.; Barr, A.J.; Beccherle, R.; Bell, P.J.; Bernabeu, J.; Broklova, Z.; Bruckman de Renstrom, P.A.; Cauz, D.; Chevalier, L.; Chouridou, S.; Citterio, M.; Clark, A.; Cobal, M.; Cornelissen, T.; Correard, S.; Costa, M.J.; Costanzo, D.; Cuneo, S.; Dameri, M.; Darbo, G.; de Vivie, J.B.; Di Girolamo, B.; Dobos, D.; Drasal, Z.; Drohan, J.; Einsweiler, K.; Elsing, M.; Emelyanov, D.; Escobar, C.; Facius, K.; Ferrari, P.; Fergusson, D.; Ferrere, D.; Flick,, T.; Froidevaux, D.; Gagliardi, G.; Gallas, M.; Gallop, B.J.; Gan, K.K.; Garcia, C.; Gavrilenko, I.L.; Gemme, C.; Gerlach, P.; Golling, T.; Gonzalez-Sevilla, S.; Goodrick, M.J.; Gorfine, G.; Gottfert, T.; Grosse-Knetter, J.; Hansen, P.H.; Hara, K.; Hartel, R.; Harvey, A.; Hawkings, R.J.; Heinemann, F.E.W.; Henss, T.; Hill, J.C.; Huegging, F.; Jansen, E.; Joseph, J.; Unel, M. Karagoz; Kataoka, M.; Kersten, S.; Khomich, A.; Klingenberg, R.; Kodys, P.; Koffas, T.; Konstantinidis, N.; Kostyukhin, V.; Lacasta, C.; Lari, T.; Latorre, S.; Lester, C.G.; Liebig, W.; Lipniacka, A.; Lourerio, K.F.; Mangin-Brinet, M.; Marti i Garcia, S.; Mathes, M.; Meroni, C.; Mikulec, B.; Mindur, B.; Moed, S.; Moorhead, G.; Morettini, P.; Moyse, E.W.J.; Nakamura, K.; Nechaeva, P.; Nikolaev, K.; Parodi, F.; Parzhitskiy, S.; Pater, J.; Petti, R.; Phillips, P.W.; Pinto, B.; Poppleton, A.; Reeves, K.; Reisinger, I.; Reznicek, P.; Risso, P.; Robinson, D.; Roe, S.; Rozanov, A.; Salzburger, A.; Sandaker, H.; Santi, L.; Schiavi, C.; Schieck, J.; Schultes, J.; Sfyrla, A.; Shaw, C.; Tegenfeldt, F.; Timmermans, C.J.W.P.; Toczek, B.; Troncon, C.; Tyndel, M.; Vernocchi, F.; Virzi, J.; Anh, T. Vu; Warren, M.; Weber, J.; Weber, M.; Weidberg, A.R.; Weingarten, J.; Wellsf, P.S.; Zhelezkow, A.

    2008-06-02

    A small set of final prototypes of the ATLAS Inner Detector silicon tracking system(Pixel Detector and SemiConductor Tracker), were used to take data during the 2004 Combined Test Beam. Data were collected from runs with beams of different flavour (electrons, pions, muons and photons) with a momentum range of 2 to 180 GeV/c. Four independent methods were used to align the silicon modules. The corrections obtained were validated using the known momenta of the beam particles and were shown to yield consistent results among the different alignment approaches. From the residual distributions, it is concluded that the precision attained in the alignmentof the silicon modules is of the order of 5 mm in their most precise coordinate.

  4. Design and development of the IBL-BOC firmware for the ATLAS Pixel IBL optical datalink system

    CERN Document Server

    AUTHOR|(INSPIRE)INSPIRE-00356268

    The Insertable $b$-Layer (IBL) is the first upgrade of the ATLAS Pixel detector at the LHC. It will be installed in the Pixel detector in 2013. The IBL will use a new sensor and readout technology, therefore the readout components of the current Pixel detector are redesigned for the readout of the IBL. In this diploma thesis the design and development of the firmware for the new IBL Back-of-Crate card (IBL-BOC) are described. The IBL-BOC is located on the off-detector side of the readout and performs the optical-electrical conversion and vice versa for the optical connection to and from the detector. To process the data transmitted to and received from the detector, the IBL-BOC uses multiple Field Programmable Gate Arrays (FPGA). The transmitted signal is a 40~Mb/s BiPhase Mark (BPM) encoded data stream, providing the timing, trigger and control to the detector. The received signal is a 160~Mb/s 8b10b encoded data stream, containing data from the detector. The IBL-BOC encodes and decodes these data streams. T...

  5. Combining two major ATLAS inner detector components

    CERN Multimedia

    Maximilien Brice

    2006-01-01

    The semiconductor tracker is inserted into the transition radiation tracker for the ATLAS experiment at the LHC. These make up two of the three major components of the inner detector. They will work together to measure the trajectories produced in the proton-proton collisions at the centre of the detector when the LHC is switched on in 2008.

  6. Investigation of thin n-in-p planar pixel modules for the ATLAS upgrade

    CERN Document Server

    Savic, N

    2016-01-01

    In view of the High Luminosity upgrade of the Large Hadron Collider (HL-LHC), planned to start around 2023-2025, the ATLAS experiment will undergo a replacement of the Inner Detector. A higher luminosity will imply higher irradiation levels and hence will demand more ra- diation hardness especially in the inner layers of the pixel system. The n-in-p silicon technology is a promising candidate to instrument this region, also thanks to its cost-effectiveness because it only requires a single sided processing in contrast to the n-in-n pixel technology presently employed in the LHC experiments. In addition, thin sensors were found to ensure radiation hardness at high fluences. An overview is given of recent results obtained with not irradiated and irradiated n-in-p planar pixel modules. The focus will be on n-in-p planar pixel sensors with an active thickness of 100 and 150 {\\mu}m recently produced at ADVACAM. To maximize the active area of the sensors, slim and active edges are implemented. The performance of th...

  7. Studies on activation in the ATLAS cavern with MPX detectors

    Energy Technology Data Exchange (ETDEWEB)

    Bergmann, Benedikt; Sopczak, Andre; Biskup, Bartolomej; Jakubek, Jan; Pospisil, Stanislav; Solc, Jaroslav; Sopko, Vit; Suk, Michal; Turecek, Daniel; Vykydal, Zdenek; Benes, Petr [IEAP CTU Prague (Czech Republic); Asbah, Nedaa; Leroy, Claude; Soueid, Paul [Universite de Montreal (Canada)

    2013-07-01

    The ATLAS-MPX detectors are based on Medipix2 silicon devices designed by CERN for the detection of different types of radiation. These detectors are successfully operating in the ATLAS detector at 16 positions and collect data independent of the ATLAS data-recording chain. Their data was used to study the activation of the surrounding material and the ATLAS-MPX detectors itself during and after collisions. As the detectors also offer the possibility to distinguish between different types of radiation, an attempt was made to estimate the corresponding dose rates at different locations in the ATLAS detector and in the cavern. First results are presented.

  8. Silicon pixel-detector R&D for CLIC

    Science.gov (United States)

    Nürnberg, A.

    2016-11-01

    The physics aims at the future CLIC high-energy linear e+e- collider set very high precision requirements on the performance of the vertex and tracking detectors. Moreover, these detectors have to be well adapted to the experimental conditions, such as the time structure of the collisions and the presence of beam-induced backgrounds. The principal challenges are: a point resolution of a few μm, ultra-low mass (~ 0.2%X0 per layer for the vertex region and ~ 1%X0 per layer for the outer tracker), very low power dissipation (compatible with air-flow cooling in the inner vertex region) and pulsed power operation, complemented with ~ 10 ns time stamping capabilities. A highly granular all-silicon vertex and tracking detector system is under development, following an integrated approach addressing simultaneously the physics requirements and engineering constraints. For the vertex-detector region, hybrid pixel detectors with small pitch (25 μm) and analog readout are explored. For the outer tracking region, both hybrid concepts and fully integrated CMOS sensors are under consideration. The feasibility of ultra-thin sensor layers is validated with Timepix3 readout ASICs bump bonded to active edge planar sensors with 50 μm to 150 μm thickness. Prototypes of CLICpix readout ASICs implemented in 6525 nm CMOS technology with 25 μm pixel pitch have been produced. Hybridisation concepts have been developed for interconnecting these chips either through capacitive coupling to active HV-CMOS sensors or through bump-bonding to planar sensors. Recent R&D achievements include results from beam tests with all types of hybrid assemblies. Simulations based on Geant4 and TCAD are used to validate the experimental results and to assess and optimise the performance of various detector designs.

  9. An EUDET/AIDA Pixel Beam Telescope for Detector Development

    CERN Document Server

    Rubinskiy, I

    2015-01-01

    A high resolution (σ∼2μm) beam telescope based on monolithic active pixel sensors (MAPS) was developed within the EUDET collaboration. The telescope consists of six monolithic active pixel sensor planes (Mimosa26) with a pixel pitch of 18.4 \\mu m and thinned down to 50 \\mu m. The excellent resolution, readout rate and DAQ integration capabilities made the telescope a primary test beam tool for many groups including several CERN based experiments. Within the European detector infrastructure project AIDA the test beam telescope is being further extended in terms of cooling and powering infrastructure, read-out speed, area of acceptance, and precision. In order to provide a system optimized for the different requirements by the user community a combination of various state-of-the-art pixel technologies is foreseen. Furthermore, new central dead-time-free trigger logic unit (TLU) has been developed to provide LHC-speed response with one-trigger-per-particle operating mode and a synchronous clock for all conn...

  10. The ATLAS Inner Detector operation,data quality and tracking performance.

    CERN Document Server

    Stanecka, E; The ATLAS collaboration

    2012-01-01

    The ATLAS Inner Detector comprises silicon and gas based detectors. The Semi-Conductor Tracker (SCT) and the Pixel Detector are the key precision tracking silicon devices in the Inner Detector of the ATLAS experiment at CERN LHC. And the the Transition Radiation Tracker (TRT), the outermost of the three subsystems of the ATLAS Inner Detector is made of thin-walled proportional-mode drift tubes (straws). The Pixel Detector consists of approximately 80 million pixels that are individually read out via chips bump-bonded to 1744 n-in-n silicon substrates. The SCT is a silicon strip detector and is constructed of 4088 silicon detector modules for a total of 6.3 million strips. Each module is designed, constructed and tested to operate as a stand-alone unit, mechanically, electrically, optically and thermally. The SCT silicon micro-strip sensors are processed in the planar p-in-n technology. The signals from the strips are processed in the front-end ASICS ABCD3TA, working in the binary readout mode. The TRT is made...

  11. Capacitively coupled hybrid pixel assemblies for the CLIC vertex detector

    CERN Document Server

    AUTHOR|(SzGeCERN)734627; Benoit, Mathieu; Dannheim, Dominik; Dette, Karola; Hynds, Daniel; Kulis, Szymon; Peric, Ivan; Petric, Marko; Redford, Sophie; Sicking, Eva; Valerio, Pierpaolo

    2016-01-01

    The vertex detector at the proposed CLIC multi-TeV linear e+e- collider must have minimal material content and high spatial resolution, combined with accurate time-stamping to cope with the expected high rate of beam-induced backgrounds. One of the options being considered is the use of active sensors implemented in a commercial high-voltage CMOS process, capacitively coupled to hybrid pixel ASICs. A prototype of such an assembly, using two custom designed chips (CCPDv3 as active sensor glued to a CLICpix readout chip), has been characterised both in the lab and in beam tests at the CERN SPS using 120 GeV/c positively charged hadrons. Results of these characterisation studies are presented both for single and dual amplification stages in the active sensor. Pixel cross-coupling results are also presented, showing the sensitivity to placement precision and planarity of the glue layer.

  12. Thermal Grease Evaluation for ATLAS Upgrade Micro-Strip Detector.

    CERN Document Server

    Barbier, G; The ATLAS collaboration; Clark, A; Ferrère, D; Pernecker, S; Perrin, E; Streit, KP; Weber, M

    2010-01-01

    The ATLAS upgrade detector foreseen at the phase 2 upgrade of LHC requires a complete new inner detector using silicon pixel and strip detectors. For both technologies, a specific mechanical and thermal design is required. Such a design may use soft thermal interfaces such as grease between the various parts. One foreseeable use would be between the cooling pipe and the thermal block allowing the strip modules to be decoupled from the mechanical and cooling structure. This note describes the technique used and the results obtained when characterizing a few grease samples. The results have been compared with thermal FEA simulations. A thermal conductivity measurement for each sample could be extracted from the measurements, with a systematic uncertainty of less than 6%. Some samples were irradiated to the expected fluence at sLHC and their resulting thermal conductivity compared with the non-irradiated samples.

  13. Imaging performance of the hybrid pixel detectors XPAD3-S.

    Science.gov (United States)

    Brunner, F Cassol; Clemens, J C; Hemmer, C; Morel, C

    2009-03-21

    Hybrid pixel detectors, originally developed for tracking particles in high-energy physics experiments, have recently been used in material sciences and macromolecular crystallography. Their capability to count single photons and to apply a threshold on the photon energy suggests that they could be optimal digital x-ray detectors in low energy beams such as for small animal computed tomography (CT). To investigate this issue, we have studied the imaging performance of photon counting hybrid pixel detectors based on the XPAD3-S chip. Two detectors are considered, connected either to a Si or to a CdTe sensor, the latter being of interest for its higher efficiency. Both a standard 'International Electrotechnical Commission' (IEC) mammography beam and a beam used for mouse CT results published in the literature are employed. The detector stability, linearity and noise are investigated as a function of the dose for several imaging exposures ( approximately 0.1-400 microGy). The perfect linearity of both detectors is confirmed, but an increase in internal noise for counting statistics higher than approximately 5000 photons has been found, corresponding to exposures above approximately 110 microGy and approximately 50 microGy for the Si and CdTe sensors, respectively. The noise power spectrum (NPS), the modulation transfer function (MTF) and the detective quantum efficiency (DQE) are then measured for two energy threshold configurations (5 keV and 18 keV) and three doses ( approximately 3, 30 and 300 microGy), in order to obtain a complete estimation of the detector performances. In general, the CdTe sensor shows a clear superiority with a maximal DQE(0) of approximately 1, thanks to its high efficiency ( approximately 100%). The DQE of the Si sensor is more dependent on the radiation quality, due to the energy dependence of its efficiency its maximum is approximately 0.4 with respect to the softer radiation. Finally, we compare the XPAD3-S DQE with published curves of

  14. CMS 2017 Pixel detector replacement - A roll and B roll

    CERN Multimedia

    Paola Catapano

    2017-01-01

    On Thursday 2 March 2017 CERN physicists and engineers have carried out a highly complex operation right at the heart of one of the four main experiments of the Large Hadron Collider (LHC): the CMS detector, located 100 m below ground under French territory, at one of the LHC’s collision points. CMS is one of the four main detectors on the 27km LHC accelerator., and one of the two experiments which found the Higgs boson in 2012. The heart of the CMS experiment is the pixel detector, the innermost instrument in the very heart of the CMS apparatus, the very point where new particles, such as the Higgs boson, are produced by the energy of the proton proton collisions of the LHC accelerator. With thousands of silicon sensors, the new Pixel Tracker is now being upgraded to improve the particle-tracking capabilities of CMS. This operation, started on Tuesday Feb 28 when the first components of the new instrument were descended into the experiment’s cavern, is one of the most significant milestones ahead of the ...

  15. The CMS Silicon Pixel detector for HL-LHC

    CERN Document Server

    Steinbrueck, Georg

    2016-01-01

    The LHC is planning an upgrade program which will bring the luminosity to about 5~$\\times10^{34}$~cm$^{-2}$s$^{-1}$ in 2026, with the goal of an integrated luminosity of 3000 fb$^{-1}$ by the end of 2037. This High Luminosity scenario, HL-LHC, will present new challenges of higher data rates and increased radiation. To maintain its physics potential in this harsh environment, the CMS detector will undergo a major upgrade program known as the Phase II upgrade. The new Phase II pixel detector will require a high bandwidth readout system and highly radiation tolerant sensors and on-detector ASICs. Several technologies for the sensors are being studied. Serial powering schemes are under consideration to accommodate significant constraints on the system. These prospective designs, as well as new layout geometries that include very forward pixel discs with acceptance extended from $\\vert\\eta\\vert<2.4$ to $\\vert\\eta\\vert<4$, are presented together with performance estimates.

  16. A Search for Long-Lived, Charged, Supersymmetric Particles using Ionization with the ATLAS Detector

    CERN Document Server

    AUTHOR|(INSPIRE)INSPIRE-00379148

    Several extensions of the Standard Model predict the existence of charged, very massive, and long-lived particles. Because of their high masses these particles would propagate non-relativistically through the ATLAS pixel detector and would therefore be identifiable through a measurement of large specific energy loss. Measuring heavy, long-lived particles through their track parameters in the pixel detector allows sensitivity to particles with lifetimes in the nanosecond range and above. This dissertation presents an inner detector driven method for identifying such particles in proton-proton collisions at 13 TeV with the 2015 LHC dataset corresponding to an integrated luminosity of 3.5 pb−1.

  17. Silicon pixel R&D for the CLIC detector

    CERN Document Server

    Hynds, Daniel

    2016-01-01

    The physics aims at the future CLIC high-energy linear e+e collider set very high precision requirements on the performance of the vertex and tracking detectors. Moreover, these detectors have to be well adapted to the experimental conditions, such as the time structure of the collisions and the presence of beam-induced backgrounds. The principal challenges are: a point resolution of a few microns, ultra-low mass (~0.2% X0 per layer for the vertex region and ~1% X0 per layer for the outer tracker), very low power dissipation (compatible with air-flow cooling in the inner vertex region) and pulsed power operation, complemented with ~10 ns time stamping capabilities. A highly granular all-silicon vertex and tracking detector system is under development, following an integrated approach addressing simultaneously the physics requirements and engineering constraints. For the vertex-detector region, hy- brid pixel detectors with small pitch (25 μm) and analogue readout are explored. For the outer tracking region,...

  18. Silicon pixel-detector R&D for CLIC

    CERN Document Server

    AUTHOR|(SzGeCERN)718101

    2016-01-01

    The physics aims at the future CLIC high-energy linear e+e- collider set very high precision requirements on the performance of the vertex and tracking detectors. Moreover, these detectors have to be well adapted to the experimental conditions, such as the time structure of the collisions and the presence of beam-induced backgrounds. The principal challenges are: a point resolution of a few μm, ultra-low mass (∼ 0.2% X${}_0$ per layer for the vertex region and ∼ 1 % X${}_0$ per layer for the outer tracker), very low power dissipation (compatible with air-flow cooling in the inner vertex region) and pulsed power operation, complemented with ∼ 10 ns time stamping capabilities. A highly granular all-silicon vertex and tracking detector system is under development, following an integrated approach addressing simultaneously the physics requirements and engineering constraints. For the vertex-detector region, hybrid pixel detectors with small pitch (25 μm) and analog readout are explored. For the outer trac...

  19. Beam tests of an integrated prototype of the ATLAS Forward Proton detector

    Science.gov (United States)

    Lange, J.; Adamczyk, L.; Avoni, G.; Banas, E.; Brandt, A.; Bruschi, M.; Buglewicz, P.; Cavallaro, E.; Caforio, D.; Chiodini, G.; Chytka, L.; Cieśla, K.; Davis, P. M.; Dyndal, M.; Grinstein, S.; Janas, K.; Jirakova, K.; Kocian, M.; Korcyl, K.; Lopez Paz, I.; Northacker, D.; Nozka, L.; Rijssenbeek, M.; Seabra, L.; Staszewski, R.; Świerska, P.; Sykora, T.

    2016-09-01

    The ATLAS Forward Proton (AFP) detector is intended to measure protons scattered at small angles from the ATLAS interaction point. To this end, a combination of 3D Silicon pixel tracking modules and Quartz-Cherenkov time-of-flight (ToF) detectors is installed 210 m away from the interaction point at both sides of ATLAS. Beam tests with an AFP prototype detector combining tracking and timing sub-detectors and a common readout have been performed at the CERN-SPS test-beam facility in November 2014 and September 2015 to complete the system integration and to study the detector performance. The successful tracking-timing integration was demonstrated. Good tracker hit efficiencies above 99.9% at a sensor tilt of 14°, as foreseen for AFP, were observed. Spatial resolutions in the short pixel direction with 50 μm pitch of 5.5 ± 0.5 μm per pixel plane and of 2.8 ± 0.5 μm for the full four-plane tracker at 14° were found, largely surpassing the AFP requirement of 10 μm. The timing detector showed also good hit efficiencies above 99%, and a full-system time resolution of 35±6 ps was found for the ToF prototype detector with two Quartz bars in-line (half the final AFP size) without dedicated optimisation, fulfilling the requirements for initial low-luminosity AFP runs.

  20. The ALFA Roman Pot Detectors of ATLAS

    CERN Document Server

    Abdel Khalek, S.

    2016-01-01

    The ATLAS Roman Pot system is designed to determine the total proton-proton cross-section as well as the luminosity at the Large Hadron Collider (LHC) by measuring elastic proton scattering at very small angles. The system is made of four Roman Pot stations, located in the LHC tunnel in a distance of about 240~m at both sides of the ATLAS interaction point. Each station is equipped with tracking detectors, inserted in Roman Pots which approach the LHC beams vertically. The tracking detectors consist of multi-layer scintillating fibre structures readout by Multi-Anode-Photo-Multipliers.

  1. Active Pixel Sensors in ams H18/H35 HV-CMOS Technology for the ATLAS HL-LHC Upgrade

    CERN Document Server

    Ristic, Branislav

    2016-01-01

    Deep sub micron HV-CMOS processes offer the opportunity for sensors built by industry standard techniques while being HV tolerant, making them good candidates for drift-based, fast collecting, thus radiation-hard pixel detectors. For the upgrade of the ATLAS Pixel Detector towards the HL-LHC requirements, active pixel sensors in HV-CMOS technology were investigated. These implement amplifier and discriminator stages directly in insulating deep n-wells, which also act as collecting electrodes. The deep n-wells allow for bias voltages up to 150V leading to a depletion depth of several 10um. Prototype sensors in the ams H18 180nm and H35 350nm HV-CMOS processes have been manufactured, acting as a potential drop-in replacement for the current ATLAS Pixel sensors, thus leaving higher level processing such as trigger handling to dedicated read-out chips. Sensors were thoroughly tested in lab measurements as well as in testbeam experiments. Irradiation with X-rays and protons revealed a tolerance to ionizing doses o...

  2. Novel time-dependent alignment of the ATLAS Inner Detector in the LHC Run 2

    CERN Document Server

    Jimenez Pena, Javier; The ATLAS collaboration

    2016-01-01

    ATLAS is a multipurpose experiment at the LHC proton-proton collider. Its physics goals require an unbiased and high resolution measurement of the charged particle kinematic parameters. These critically depend on the layout and performance of the tracking system and the quality of the alignment of its components. For the LHC Run 2, the system has been upgraded with the installation of a new pixel layer, the Insertable B-layer (IBL). ATLAS Inner Detector alignment framework has been adapted and upgraded to correct very short time scale movements of the sub-detectors. In particular, a mechanical distortion of the IBL staves up to 20 μm and a vertical displacement of the Pixel detector of ~6 μm have been observed during data-taking. The techniques used to correct for these effects and to match the required Inner Detector performance will be presented.

  3. Novel time-dependent alignment of the ATLAS Inner Detector in the LHC Run 2

    Science.gov (United States)

    Jiménez Peña, J.

    2016-11-01

    ATLAS is a multipurpose experiment at the LHC proton-proton collider. Its physics goals require an unbiased and high resolution measurement of the charged particle kinematic parameters. These critically depend on the layout and performance of the tracking system and the quality of the alignment of its components. For the LHC Run 2, the system has been upgraded with the installation of a new pixel layer, the Insertable B-layer (IBL) . ATLAS Inner Detector alignment framework has been adapted and upgraded to correct very short time scale movements of the sub-detectors. In particular, a mechanical distortion of the IBL staves up to 20 μm and a vertical displacement of the Pixel detector of ~ 6 μm have been observed during data-taking. The techniques used to correct for these effects and to match the required Inner Detector performance will be presented.

  4. The ultralight DEPFET pixel detector of the Belle II experiment

    Science.gov (United States)

    Luetticke, Florian

    2017-02-01

    An upgrade of the existing Japanese flavor factory (KEKB in Tsukuba, Japan) is under construction and foreseen for commissioning by the end of 2017. This new e+e- machine (SuperKEKB) will deliver an instantaneous luminosity 40 times higher than the luminosity world record set by KEKB. To fully exploit the increased number of events and provide high precision measurements of B-meson decay vertices in such a harsh environment, the Belle detector will be upgraded to Belle II, featuring a new silicon vertex detector with two pixel layers close to the interaction point based on the DEPFET (DEpleted P-channel Field Effect Transistor) technology. This technology combines particle detection together with in-pixel amplification by integrating a field effect transistor into a fully depleted silicon bulk. In Belle II, DEPFET sensors thinned down to 75 μm with low power consumption and low intrinsic noise will be used. The first large thin multi-chip production modules have been produced and characterization results on both large modules as well as small test systems will be presented in this contribution.

  5. A DEPFET pixel system for the ILC vertex detector

    CERN Document Server

    Trimpl, M; Kohrs, R; Krüger, H; Lodomez, P; Reuen, L; Sandow, C; Toerne, E; Velthuis, J J; Wermes, N; Andricek, L; Moser, H G; Richter, R H; Lutz, Gerhard; Giesen, F; Fischer, P; Peric, I

    2006-01-01

    We have developed a prototype system for the ILC vertex detector based on DEPFET pixels. The system operates a 128x64 pixel matrix and uses two dedicated microchips, the SWITCHER II chip for matrix steering and the CURO II chip for readout. The system development has been driven by the final ILC requirements which above all demand a detector thinned to 50 micron and a row wise read out with line rates of 20MHz and more. The targeted noise performance for the DEPFET technology is in the range of ENC=100e-. The functionality of the system has been demonstrated using different radioactive sources in an energy range from 6keV to 60keV. In recent test beam experiments using 6GeV electrons, a signal-to-noise ratio of S/N~120 has been achieved with present sensors being 450 micron thick. For improved DEPFET systems using 50 micron thin sensors in future, a signal-to-noise of 40 is expected.

  6. Tests of the gated mode for Belle II pixel detector

    Energy Technology Data Exchange (ETDEWEB)

    Prinker, Eduard [Max-Planck-Institute for Physics, Munich (Germany); Collaboration: Belle II-Collaboration

    2015-07-01

    DEPFET pixel detectors offer intrinsic amplification and very high signal to noise ratio. They form an integral building block for the vertex detector system of the Belle II experiment, which will start data taking in the year 2017 at the SuperKEKB Collider in Japan. A special Test board (Hybrid4) is used, which contains a small version of the DEPFET sensor with a read-out (DCD) and a steering chip (Switcher) attached, both controlled by a field-programmable gate array (FPGA) as the central interface to the computer. In order to keep the luminosity of the collider constant over time, the particle bunch currents have to be topped off by injecting additional bunches at a rate of 50 Hz. The particles in the daughter bunches produce a high rate of background (noisy bunches) for a short period of time, saturating the occupancy of the sensor. Operating the DEPFET sensor in a Gated Mode allows preserving the signals from collisions of normal bunches while protecting the pixels from background signals of the passing noisy bunches. An overview of the Gated Mode and first results is presented.

  7. Fabrication of a high-density MCM-D for a pixel detector system using a BCB/Cu technology

    CERN Document Server

    Topper, M; Engelmann, G; Fehlberg, S; Gerlach, P; Wolf, J; Ehrmann, O; Becks, K H; Reichl, H

    1999-01-01

    The MCM-D which is described here is a prototype for a pixel detector system for the planned Large Hadron Collider (LHC) at CERN, Geneva. The project is within the ATLAS experiment. The module consists of a sensor tile with an active area of 16.4 mm*60.4 mm, 16 readout chips, each serving 24*160 pixel unit cells, a module controller chip, an optical transceiver and the local signal interconnection and power distribution buses. The extremely high wiring density which is necessary to interconnect the readout chips was achieved using a thin film copper/photo-BCB process above the pixel array. The bumping of the readout chips was done by PbSn electroplating. All dice are then attached by flip-chip assembly to the sensor diodes and the local buses. The focus of this paper is a detailed description of the technologies for the fabrication of this advanced MCM-D. (10 refs).

  8. Dark Matter searches with the ATLAS Detector

    CERN Document Server

    Hooberman, Benjamin Henry; The ATLAS collaboration

    2016-01-01

    The presence of a non-baryonic Dark Matter (DM) component in the Universe is inferred from the observation of its gravitational interaction. If DM interacts non-gravitationally with the Standard Model, it could be produced at the LHC, escaping the detector and leaving missing transverse momentum (MET) as a signature. Recent results from the ATLAS detector will be presented, based on events with large MET accompanied by a variety of other objects.

  9. Beam tests of an integrated prototype of the ATLAS Forward Proton detector

    CERN Document Server

    INSPIRE-00397348

    2016-01-01

    The ATLAS Forward Proton (AFP) detector is intended to measure protons scattered at small angles from the ATLAS interaction point. To this end, a combination of 3D Silicon pixel tracking modules and Quartz-Cherenkov time-of-flight (ToF) detectors is installed 210m away from the interaction point at both sides of ATLAS. Beam tests with an AFP prototype detector combining tracking and timing sub-detectors and a common readout have been performed at the CERN-SPS test-beam facility in November 2014 and September 2015 to complete the system integration and to study the detector performance. The successful tracking-timing integration was demonstrated. Good tracker hit efficiencies above 99.9% at a sensor tilt of 14{\\deg}, as foreseen for AFP, were observed. Spatial resolutions in the short pixel direction with 50 {\\mu}m pitch of 5.5 +/- 0.5 {\\mu}m per pixel plane and of 2.8 +/- 0.5 {\\mu}m for the full four-plane tracker at 14{\\deg} were found, largely surpassing the AFP requirement of 10 {\\mu}m. The timing detector...

  10. A new sub-detector for ATLAS

    CERN Multimedia

    Marco Bruschi

    Since last August, the ATLAS detector family has been joined by a new little member named LUCID, from the acronym "LUminosity Cerenkov Integrating Detector". This may well surprise you if you are already aware that LUCID construction started only in February after its approval by an ATLAS-management mandated review committee. The rapid progress from approval to installation is the result of the close collaboration between groups from Alberta (Canada), INFN Bologna (Italy), Lund (Sweden) and CERN. LUCID is primarily intended to measure the luminosity delivered by the LHC to ATLAS with a systematic uncertainty in the range of a few percent. To achieve such a precision and still meet the demanding installation schedule, the LUCID developers prized simplicity and robustness above all. One of the LUCID vessels while under construction. One can see the aluminum Cerenkov tubes and the photomultiplier mount (plugged into the upper flange). The two fully assembled LUCID vessels seen from the front end elect...

  11. 'Daisy petal' connectors for the ATLAS detector

    CERN Multimedia

    Laurent Guiraud

    1997-01-01

    These daisy-petal structures are conducting connectors embedded in kapton film. This was an innovative solution to the demands of the ATLAS detector. Straws are pushed through the petals and held in contact using plugs. The flexible kapton film allows as many petals to be built in any configuration, while acting as a printed circuit carrying the high voltage between circles.

  12. Diamond Pixel Modules and the ATLAS Beam Conditions Monitor

    CERN Document Server

    Dobos, D

    2011-01-01

    The ATLAS Beam Conditions Monitor’s (BCM) main purpose is to protect the experiments silicon tracker from beam incidents. In total 16 1x1 cm^2 500 um thick diamond pCVD sensors are used in eight positions around the LHC interaction point. They perform time difference measurements with sub nanosecond resolution to distinguish between particles from a collision and spray particles from a beam incident; an abundance of the latter can lead the BCM to provoke an abort of LHC beam. The BCM diamond detector modules, their readout system and the algorithms used to detect beam incidents are described. Results of the BCM operation with circulating LHC beams and it’s commissioning with first LHC collisions are reported.

  13. Étude des détecteurs planaires pixels durcis aux radiations pour la mise à jour du détecteur de vertex d'ATLAS

    CERN Document Server

    Benoit, Mathieu

    In this work, is presented a study, using TCAD simulation, of the possible methods of designing of a planar pixel sensors by reducing their inactive area and improving their radiation hardness for use in the Insertable B-Layer (IBL) project and for SLHC upgrade phase for the ATLAS experiment. Different physical models available have been studied to develop a coherent model of radiation damage in silicon that can be used to predict silicon pixel sensor behavior after exposure to radiation. The Multi-Guard Ring Structure,a protection structure used in pixel sensor design was studied to obtain guidelines for the reduction of inactive edges detrimental to detector operation while keeping a good sensor behavior through its lifetime in the ATLAS detector. A campaign of measurement of the sensor's process parameters and electrical behavior to validate and calibrate the TCAD simulation models and results are also presented. A model for diode charge collection in highly irradiated environment was developed to explain ...

  14. Running experience with the DELPHI pixel detector reflections on design characteristics and system features

    CERN Document Server

    Heuser, J M

    1999-01-01

    The DELPHI experiment at LEP is the first collider experiment with hybrid pixel detectors contributing to its track reconstruction. The pixel detector has been installed in 1996 with the final DELPHI silicon tracker, an assembly of microstrip, ministrip and pixel detectors optimized for the operation at LEP2. It was completed for the physics period in 1997. The pixel detector comprises 1.2 million detector cells of 330*330 mu m/sup 2/. 152 detector modules are arranged in 4 inclined cone-shaped layers which cover polar angles from 10 degrees to 25 degrees . Experience on the system's features has been gained during three years of operation. The article intends to provide information on positive and critical aspects which might be useful for designers of pixel detector systems in forthcoming experiments. (4 refs).

  15. Micropattern gas detectors The CMS MSGC project and gaseous pixel detector applications

    CERN Document Server

    Bellazzini, R; Gariano, G; Latronico, L; Lumb, N; Moggi, A; Reale, S; Spandre, G; Massai, M M; Spezziga, M A; Toropin, A N; Costa, E; Soffitta, P; Pacella, D

    2001-01-01

    We report recent results from the development and testing of two types of micropattern gas detectors-micro-strip gas chambers and GEM- based devices with two types of pixel read-out. Thirty-two micro- strip gas chambers were tested in a high intensity hadron beam as a milestone for CERN's Compact Muon Solenoid (CMS) experiment. The detectors were operated with voltage settings corresponding to 98% hit detection efficiency at CMS for a total high intensity exposure period of 493 h. All of the requirements expected by the milestone- gain stability, number of lost strips, spark rate, etc.-were met, with wide margins. In a separate investigation, we have coupled PCB pixel read-out planes to GEM foils. In one case, 2 mm*2 mm pixels were fanned out to individual discriminators and scalers to provide very fast (2 MHz/pixel) read-out; this system has been used as an imaging device to provide diagnostic information in fusion experiments. The second type of device used smaller pixels (200 mu m squares) and a Flash-ADC ...

  16. The LHCb Vertex Locator (VELO) Pixel Detector Upgrade

    CERN Document Server

    Buchanan, Emma

    2017-01-01

    The LHCb experiment is designed to perform high-precision measurements of CP violation and the decays of beauty and charm hadrons at the Large Hadron Collider (LHC) at CERN. There is a planned upgrade during Long Shutdown 2 (LS2), expected in 2019, which will allow the detector to run at higher luminosities by transforming the entire readout to a trigger-less system. This will include a substantial upgrade of the Vertex Locator (VELO), the silicon tracker that surrounds the LHCb interaction region. The VELO is moving from silicon strip technology to hybrid pixel sensors, where silicon sensors are bonded to VeloPix ASICs. Sensor prototypes have undergone rigorous testing using the Timepix3 Telescope at the SPS, CERN. The main components of the upgrade are summarised and testbeam results presented.

  17. Towards a new generation of pixel detector readout chips

    CERN Document Server

    Campbell, M; Ballabriga, R.; Frojdh, E.; Heijne, E.; Llopart, X.; Poikela, T.; Tlustos, L.; Valerio, P.; Wong, W.

    2016-01-01

    The Medipix3 Collaboration has broken new ground in spectroscopic X-ray imaging and in single particle detection and tracking. This paper will review briefly the performance and limitations of the present generation of pixel detector readout chips developed by the Collaboration. Through Silicon Via technology has the potential to provide a significant improvement in the tile- ability and more flexibility in the choice of readout architecture. This has been explored in the context of 3 projects with CEA-LETI using Medipix3 and Timepix3 wafers. The next generation of chips will aim to provide improved spectroscopic imaging performance at rates compatible with human CT. It will also aim to provide full spectroscopic images with unprecedented energy and spatial resolution. Some of the opportunities and challenges posed by moving to a more dense CMOS process will be discussed.

  18. Pixel Detector Trial Assembly Test in the SR1 building

    CERN Multimedia

    D. Giugni

    2004-01-01

    During the last two months the Pixel group [LBL, Milan and Wuppertal] made a successful integration test on the mechanics of the barrel. The scope of the test was to qualify the integration procedures and the various assembling tools. The test took place in the clean room of the SR1 building at CERN, where the detector has been assembled around a dummy beam pipe made of Stainless Steel. The process is rather complex: the shells come in two parts and they have to be clamped together to get the full shell. This operation is carried out by a dedicated tool which is shown to the right in the picture below. The layer 1 shell is clamped around a "service" pipe that will be used for moving the full layer to the integration tool [ITT] which is visible on the left. View of the tools devoted to the Pixel barrel integration in the SR1 building Also visible in the picture is the global frame that is actually held by the tool. It will engage the layers sliding onto the rails. The first two layers are sequentially...

  19. A generic readout environment for prototype pixel detectors

    Energy Technology Data Exchange (ETDEWEB)

    Turqueti, Marcos, E-mail: turqueti@fnal.go [Fermi National Accelerator Laboratory, Kirk and Wilson Road, 60510-500 (United States); Rivera, Ryan; Prosser, Alan; Kwan, Simon [Fermi National Accelerator Laboratory, Kirk and Wilson Road, 60510-500 (United States)

    2010-11-01

    Pixel detectors for experimental particle physics research have been implemented with a variety of readout formats and potentially generate massive amounts of data. Examples include the PSI46 device for the Compact Muon Solenoid (CMS) experiment which implements an analog readout, the Fermilab FPIX2.1 device with a digital readout, and the Fermilab Vertically Integrated Pixel device. The Electronic Systems Engineering Department of the Computing Division at the Fermi National Accelerator Laboratory has developed a data acquisition system flexible and powerful enough to meet the various needs of these devices to support laboratory test bench as well as test beam applications. The system is called CAPTAN (Compact And Programmable daTa Acquisition Node) and is characterized by its flexibility, versatility and scalability by virtue of several key architectural features. These include a vertical bus that permits the user to stack multiple boards, a gigabit Ethernet link that permits high speed communications to the system and a core group of boards that provide specific processing and readout capabilities for the system. System software based on distributed computing techniques supports an expandable network of CAPTANs. In this paper, we describe the system architecture and give an overview of its capabilities.

  20. A germanium hybrid pixel detector with 55μm pixel size and 65,000 channels

    Science.gov (United States)

    Pennicard, D.; Struth, B.; Hirsemann, H.; Sarajlic, M.; Smoljanin, S.; Zuvic, M.; Lampert, M. O.; Fritzsch, T.; Rothermund, M.; Graafsma, H.

    2014-12-01

    Hybrid pixel semiconductor detectors provide high performance through a combination of direct detection, a relatively small pixel size, fast readout and sophisticated signal processing circuitry in each pixel. For X-ray detection above 20 keV, high-Z sensor layers rather than silicon are needed to achieve high quantum efficiency, but many high-Z materials such as GaAs and CdTe often suffer from poor material properties or nonuniformities. Germanium is available in large wafers of extremely high quality, making it an appealing option for high-performance hybrid pixel X-ray detectors, but suitable technologies for finely pixelating and bump-bonding germanium have not previously been available. A finely-pixelated germanium photodiode sensor with a 256 by 256 array of 55μm pixels has been produced. The sensor has an n-on-p structure, with 700μm thickness. Using a low-temperature indium bump process, this sensor has been bonded to the Medipix3RX photoncounting readout chip. Tests with the LAMBDA readout system have shown that the detector works successfully, with a high bond yield and higher image uniformity than comparable high-Z systems. During cooling, the system is functional around -80°C (with warmer temperatures resulting in excessive leakage current), with -100°C sufficient for good performance.

  1. Large precision muon detector for ATLAS

    CERN Document Server

    Zhou Bing

    2002-01-01

    The ATLAS muon spectrometer is designed to exploit the full physics discovery potential at the Large Hadron Collider in a stand-alone mode. The precision muon detector is made of monitored drift tubes with tracking precision better than 50 mum to measure the muon track sagitta in the toroidal magnetic field. A world-wide intensive construction work of the ATLAS muon detector is under way. We report the precision muon detector mass production experience, including the R&D results on the long tube operation stability and the impact on the momentum resolution due to wire sag. The quality control data in mass production are presented. Cosmic ray test results show that the MDT chambers have tracking efficiency close to 100% and single wire resolution is better than 80 mum.

  2. Large precision muon detector for ATLAS

    CERN Document Server

    Zhou Bing

    2002-01-01

    The ATLAS muon spectrometer is designed to exploit the full physics discovery potential at the Large Hadron Collider in a stand-alone mode. The precision muon detector is made of monitored drift tubes with tracking precision better than 50 mu m to measure the muon track sagitta in the toroidal magnetic field. A world-wide intensive construction work of the ATLAS muon detector is under way. We report the precision muon detector mass production experience, including the R and D results on the long tube operation stability and the impact on the momentum resolution due to wire sag. The quality control data in mass production are presented. Cosmic ray test results show that the MDT chambers have tracking efficiency close to 100% and single wire resolution is better than 80 mu m.

  3. X-ray micro-beam characterization of a small pixel spectroscopic CdTe detector

    Science.gov (United States)

    Veale, M. C.; Bell, S. J.; Seller, P.; Wilson, M. D.; Kachkanov, V.

    2012-07-01

    A small pixel, spectroscopic, CdTe detector has been developed at the Rutherford Appleton Laboratory (RAL) for X-ray imaging applications. The detector consists of 80 × 80 pixels on a 250 μm pitch with 50 μm inter-pixel spacing. Measurements with an 241Am γ-source demonstrated that 96% of all pixels have a FWHM of better than 1 keV while the majority of the remaining pixels have FWHM of less than 4 keV. Using the Diamond Light Source synchrotron, a 10 μm collimated beam of monochromatic 20 keV X-rays has been used to map the spatial variation in the detector response and the effects of charge sharing corrections on detector efficiency and resolution. The mapping measurements revealed the presence of inclusions in the detector and quantified their effect on the spectroscopic resolution of pixels.

  4. A Parallel FPGA Implementation for Real-Time 2D Pixel Clustering for the ATLAS Fast TracKer Processor

    CERN Document Server

    Sotiropoulou, C-L; The ATLAS collaboration; Annovi, A; Beretta, M; Kordas, K; Nikolaidis, S; Petridou, C; Volpi, G

    2014-01-01

    The parallel 2D pixel clustering FPGA implementation used for the input system of the ATLAS Fast TracKer (FTK) processor is presented. The input system for the FTK processor will receive data from the Pixel and micro-strip detectors from inner ATLAS read out drivers (RODs) at full rate, for total of 760Gbs, as sent by the RODs after level-1 triggers. Clustering serves two purposes, the first is to reduce the high rate of the received data before further processing, the second is to determine the cluster centroid to obtain the best spatial measurement. For the pixel detectors the clustering is implemented by using a 2D-clustering algorithm that takes advantage of a moving window technique to minimize the logic required for cluster identification. The cluster detection window size can be adjusted for optimizing the cluster identification process. Additionally, the implementation can be parallelized by instantiating multiple cores to identify different clusters independently thus exploiting more FPGA resources. ...

  5. A Parallel FPGA Implementation for Real-Time 2D Pixel Clustering for the ATLAS Fast TracKer Processor

    CERN Document Server

    Sotiropoulou, C-L; The ATLAS collaboration; Annovi, A; Beretta, M; Kordas, K; Nikolaidis, S; Petridou, C; Volpi, G

    2014-01-01

    The parallel 2D pixel clustering FPGA implementation used for the input system of the ATLAS Fast TracKer (FTK) processor is presented. The input system for the FTK processor will receive data from the Pixel and micro-strip detectors from inner ATLAS read out drivers (RODs) at full rate, for total of 760Gbs, as sent by the RODs after level1 triggers. Clustering serves two purposes, the first is to reduce the high rate of the received data before further processing, the second is to determine the cluster centroid to obtain the best spatial measurement. For the pixel detectors the clustering is implemented by using a 2D-clustering algorithm that takes advantage of a moving window technique to minimize the logic required for cluster identification. The cluster detection window size can be adjusted for optimizing the cluster identification process. Additionally, the implementation can be parallelized by instantiating multiple cores to identify different clusters independently thus exploiting more FPGA resources. T...

  6. Physics with Electrons in the ATLAS Detector

    CERN Document Server

    AUTHOR|(INSPIRE)INSPIRE-00338116

    This thesis presents two diboson measurements with the ATLAS experiment. The first is a differential measurement of Higgs boson observables in the four-lepton decay channel at $\\sqrt{s}=8$ TeV. The second presents a first measurement of the WZ diboson production cross section in the three-lepton decay channel at $\\sqrt{s}=13$ TeV. Special emphasis is given to the identification techniques of prompt electrons, particularly the likelihood identification first introduced in 2012 data taking, and electron efficiency measurements in the ATLAS detector.

  7. Readout electronics and test bench for the CMS Phase I pixel detector

    CERN Document Server

    Del Burgo, Riccardo

    2016-01-01

    The present CMS pixel detector will be replaced with an upgraded pixel system during the LHC extended technical stop in winter 2016/2017. The CMS Phase 1 pixel upgrade combines a new pixel readout chip, which minimizes detection inefficiencies, with several other design improvements to maintain the excellent tracking performance of CMS at the higher luminosity conditions foreseen for the coming years. The upgraded detector features new readout electronics which require detailed evaluation. For this purpose a test stand has been setup, including a slice of the CMS pixel DAQ system, all components of the upgraded readout chain together with a number of detector modules. The test stand allows for detailed evaluation and verification of all detector components, and is also crucial to develop tests and procedures to be used during the detector assembly and the commissioning and calibration of the detector. In this talk the system test and its functionalities will be described with a focus on the tests performed fo...

  8. Tracking and vertexing performance of the ATLAS Inner Detector at the LHC

    CERN Document Server

    Marti, S; The ATLAS collaboration

    2011-01-01

    The ATLAS experiment at the LHC is equipped with a charged particle tracking system, the Inner Detector, built on three subdetectors, which provide high precision measurements made from a fine detector granularity. The Pixel and microstrip (SCT) subdetectors, which use the silicon technology, are complemented with the Transition Radiation Tracker. Since the LHC startup in 2009, the ATLAS inner tracker has played a central role in many ATLAS physics analyses. Rapid improvements in the calibration and alignment of the detector allowed it to reach nearly the nominal performance in the timespan of a few months. The tracking performance proved to be stable as the LHC luminosity increased by five orders of magnitude during the 2010 proton run, while the performance was only slightly degraded in the extremely dense heavy ion collisions. New developments in the offline reconstruction for the 2011 run will improve the tracking performance in high pile-up conditions.

  9. From vertex detectors to inner trackers with CMOS pixel sensors

    CERN Document Server

    Besson, A; Spiriti, E.; Baudot, J.; Claus, G.; Goffe, M.; Winter, M.

    2016-01-01

    The use of CMOS Pixel Sensors (CPS) for high resolution and low material vertex detectors has been validated with the 2014 and 2015 physics runs of the STAR-PXL detector at RHIC/BNL. This opens the door to the use of CPS for inner tracking devices, with 10-100 times larger sensitive area, which require therefore a sensor design privileging power saving, response uniformity and robustness. The 350 nm CMOS technology used for the STAR-PXL sensors was considered as too poorly suited to upcoming applications like the upgraded ALICE Inner Tracking System (ITS), which requires sensors with one order of magnitude improvement on readout speed and improved radiation tolerance. This triggered the exploration of a deeper sub-micron CMOS technology, Tower-Jazz 180 nm, for the design of a CPS well adapted for the new ALICE-ITS running conditions. This paper reports the R&D results for the conception of a CPS well adapted for the ALICE-ITS.

  10. Simulations of 3D-Si sensors for the innermost layer of the ATLAS pixel upgrade

    Science.gov (United States)

    Baselga, M.; Pellegrini, G.; Quirion, D.

    2017-03-01

    The LHC is expected to reach luminosities up to 3000 fb-1 and the innermost layer of the ATLAS upgrade plans to cope with higher occupancy and to decrease the pixel size. 3D-Si sensors are a good candidate for the innermost layer of the ATLAS pixel upgrade since they exhibit good performance under high fluences and the new designs will have smaller pixel size to fulfill the electronics expectations. This paper reports TCAD simulations of the 3D-Si sensors designed at IMB-CNM with non-passing-through columns that are being fabricated for the next innermost layer of the ATLAS pixel upgrade. It shows the charge collection response before and after irradiation, and the response of 3D-Si sensors located at large η angles.

  11. Simulations of 3D-Si sensors for the innermost layer of the ATLAS pixel upgrade

    CERN Document Server

    Baselga, Marta

    2017-01-01

    The LHC is expected to reach luminosities up to 3000fb-1 and the innermost layer of the ATLAS upgrade plans to cope with higher occupancy and to decrease the pixel size. 3D-Si sensors are a good candidate for the innermost layer of the ATLAS pixel upgrade since they exhibit good performance under high fluences and the new designs will have smaller pixel size to fulfill the electronics expectations. This paper reports TCAD simulations of the 3D-Si sensors designed at IMB-CNM with non passing-through columns that are being fabricated for the next innermost layer of the ATLAS pixel upgrade, shows the charge collection response before and after irradiation, and the response of 3D-Si sensors located at large $\\eta$ angles.

  12. Effects of bulk and surface conductivity on the performance of CdZnTe pixel detectors

    DEFF Research Database (Denmark)

    Bolotnikov, A.E.; Chen, C.M.H.; Cook, W.R.;

    2002-01-01

    between the pixel contacts. When the grid is negatively biased, the strong electric field in the gaps between the pixels forces the electrons landing on the surface to move toward the contacts, preventing the charge loss. We have investigated these effects by using CZT pixel detectors indium bump...

  13. The Tilecal/ATLAS detector control system

    CERN Document Server

    Tomasio Pina, João Antonio

    2004-01-01

    Tilecal is the barrel hadronic calorimeter of the ATLAS detector that is presently being built at CERN to operate at the LHC accelerator. The main task of the Tilecal detector control system (DCS) is to enable the coherent and safe operation of the detector. All actions initiated by the operator and all errors, warnings, and alarms concerning the hardware of the detector are handled by DCS. The DCS has to continuously monitor all operational parameters, give warnings and alarms concerning the hardware of the detector. The DCS architecture consists of a distributed back-end (BE) system running on PC's and different front-end (FE) systems. The implementation of the BE will he achieved with a commercial supervisory control and data acquisition system (SCADA) and the FE instrumentation will consist on a wide variety of equipment. The connection between the FE and BE is provided by fieldbus or L

  14. Beam test results of the BTeV silicon pixel detector

    CERN Document Server

    Appel, J A

    2001-01-01

    We report the results of the BTeV silicon pixel detector tests carried out in the MTest beam at Fermilab in 1999-2000. The pixel detector spatial resolution has been studied as a function of track inclination, sensor bias, and readout threshold.

  15. Display of cosmic ray event going through the pixel detector taken on October 18th 2008

    CERN Multimedia

    ATLAS, Experiment

    2014-01-01

    Shown are the XY view (of SCT and pixels and of pixels alone) and an RZ view. The track has a hit in each of the layers in both the upper and the lower hemisphere. In the bottom of L0 there are even two hits due to a module overlap. Apart from the signal hits there is only one other hit in the pixel detector demonstrating the very low noise level in the detector.

  16. Development of thin sensors and a novel interconnection technology for the upgrade of the ATLAS pixel system

    Energy Technology Data Exchange (ETDEWEB)

    Beimforde, Michael

    2010-07-19

    To extend the discovery potential of the experiments at the LHC accelerator a two phase luminosity upgrade towards the super LHC (sLHC) with a maximum instantaneous luminosity of 10{sup 35}/cm{sup 2}s{sup 1} is planned. Retaining the reconstruction efficiency and spatial resolution of the ATLAS tracking detector at the sLHC, new pixel modules have to be developed that have a higher granularity, can be placed closer to the interaction point, and allow for a cost-efficient coverage of a larger pixel detector volume compared to the present one. The reduced distance to the interaction point calls for more compact modules that have to be radiation hard to supply a sufficient charge collection efficiency up to an integrated particle fluence equivalent to that of (1-2).10{sup 16} 1-MeV-neutrons per square centimeter (n{sub eq}/cm{sup 2}). Within this thesis a new module concept was partially realised and evaluated for the operation within an ATLAS pixel detector at the sLHC. This module concept utilizes a novel thin sensor production process for thin n-in-p silicon sensors which potentially allow for a higher radiation hardness at a reduced cost. Furthermore, the new 3D-integration technology ICV-SLID is explored which will allow for increasing the active area of the modules from 71% to about 90% and hence, for employing the modules in the innermost layer of the upgraded ATLAS pixel detector. A semiconductor simulation and measurements of irradiated test sensors are used to optimize the implantation parameters for the inter-pixel isolation of the thin sensors. These reduce the crosstalk between the pixel channels and should allow for operating the sensors during the whole runtime of the experiment without causing junction breakdowns. The characterization of the first production of sensors with active thicknesses of 75 {mu}m and 150 {mu}m proved that thin pixel sensors can be successfully produced with the new process technology. Thin pad sensors with a reduced inactive

  17. Standard Model measurements with the ATLAS detector

    Directory of Open Access Journals (Sweden)

    Hassani Samira

    2015-01-01

    Full Text Available Various Standard Model measurements have been performed in proton-proton collisions at a centre-of-mass energy of √s = 7 and 8 TeV using the ATLAS detector at the Large Hadron Collider. A review of a selection of the latest results of electroweak measurements, W/Z production in association with jets, jet physics and soft QCD is given. Measurements are in general found to be well described by the Standard Model predictions.

  18. Qualification of the modules for the Phase 1 upgrade of the CMS forward pixel detector

    Science.gov (United States)

    Sandoval Gonzalez, Irving; CMS Collaboration

    2017-01-01

    The innermost component of the Compact Muon Solenoid (CMS) detector, the silicon pixel tracker, will be replaced by a new device in early 2017 to cope with the significant increase in instantaneous luminosity expected for the remainder of Run 2 of the Large Hadron Collider. The upgraded detector is composed of two subcomponents: the barrel pixel (BPIX) and the forward pixel (FPIX). In this work, we describe the testing and calibration procedures that the FPIX detector subcomponents underwent as well as the quality assurance criteria used for selecting the best detector modules for the final installation. NSF

  19. Technical Design Report for the ATLAS Inner Tracker Strip Detector

    CERN Document Server

    Collaboration, ATLAS

    2017-01-01

    This is the first of two Technical Design Report documents that describe the upgrade of the central tracking system for the ATLAS experiment for the operation at the High Luminosity LHC (HL-LHC) starting in the middle of 2026. At this time the LHC will have been upgraded to reach a peak instantaneous luminosity of 7.5x10^34 cm^[-2]s^[-1], which corresponds to approximately 200 inelastic proton-proton collisions per beam crossing. The new Inner Tracker (ITk) will be operational for more than ten years, during which ATLAS aims to accumulate a total data set of 3,000 fb^[-1]. Meeting these requirements presents a unique challenge for the design of an all-silicon tracking system that consists of a pixel detector at small radius close to the beam line and a large-area strip tracking detector surrounding it. This document presents in detail the requirements of the new tracker, its layout and expected performance including the results of several benchmark physics studies at the highest numbers of collisions per beam...

  20. Selected results from the static characterization of edgeless n-on-p planar pixel sensors for ATLAS upgrades

    CERN Document Server

    Giacomini, Gabriele; Bomben, Marco; Boscardin, Maurizio; Bosisio, Luciano; Calderini, Giovanni; Chauveau, Jacques; La Rosa, Alessandro; Marchiori, Giovanni; Zorzi, Nicola

    2014-01-01

    In view of the LHC upgrade for the High Luminosity Phase (HL-LHC), the ATLAS experiment is planning to replace the Inner Detector with an all-Silicon system. The n-on-p technology represents a valid solution for the modules of most of the layers, given the significant radiation hardness of this option and the reduced cost. There is also the demand to reduce the inactive areas to a minimum. The ATLAS LPNHE Paris group and FBK Trento started a collaboration for the development on a novel n-on-p edgeless planar pixel design, based on the deep-trench process which can cope with all these requirements. This paper reports selected results from the electrical characterization, both before and after irradiation, of test structures from the first production batch.

  1. Development of Edgeless Silicon Pixel Sensors on p-type substrate for the ATLAS High-Luminosity Upgrade

    CERN Document Server

    Calderini, G; Bomben, M; Boscardin, M; Bosisio, L; Chauveau, J; Giacomini, G; La Rosa, A; Marchiori, G; Zorzi, N

    2014-01-01

    In view of the LHC upgrade for the high luminosity phase (HL-LHC), the ATLAS experiment is planning to replace the inner detector with an all-silicon system. The n-in-p bulk technology represents a valid solution for the modules of most of the layers, given the significant radiation hardness of this option and the reduced cost. The large area necessary to instrument the outer layers will demand to tile the sensors, a solution for which the inefficient region at the border of each sensor needs to be reduced to the minimum size. This paper reports on a joint R&D project by the ATLAS LPNHE Paris group and FBK Trento on a novel n-in-p edgeless planar pixel design, based on the deep-trench process available at FBK.

  2. ATLAS Silicon Microstrip Detector Operation and Performance

    CERN Document Server

    Coniavitis, E

    2011-01-01

    In December 2009 the ATLAS experiment at the CERN Large Hadron Collider (LHC) recorded the first proton-proton collisions at a centre-of-mass energy of 900 GeV, followed by the unprecedented energy of 7 TeV in March 2010. The Semi-Conductor Tracker (SCT) is the key precision tracking device in ATLAS, made up from silicon micro-strip detectors processed in the planar p-in-n technology. The completed SCT has been installed inside the ATLAS experimental hall. After the commissioning phase it arrived to the first LHC pp collision runs in very good shape: 99.3% of the SCT strips are operational, noise occupancy and hit efficiency exceed the design specifications, the alignment is already close enough to the ideal one to allow on-line track reconstruction and invariant mass determination. The current status of the SCT is reviewed, including results from the latest data-taking periods in 2009 and 2010, and from the detector alignment. We report on the operation of the detector and observed problems. The main emphasi...

  3. ATLAS gets its own luminosity detector

    CERN Multimedia

    CERN Bulletin

    2011-01-01

    During the winter shutdown, the ATLAS collaboration has completed the installation of ALFA, the detector system that aims at the LHC absolute luminosity at Point 1 analysing the elastic scattering of protons at small angles.   Upper and lower ALFA Roman Pots as installed in sector 8-1 of the LHC tunnel, 240 metres from the ATLAS Interaction Point. The detectors of the ALFA system are installed at ± 240 meters from the interaction point 1, on either side of the ATLAS detector. The whole system consists of four stations, two on each side of the interaction point. Each station is equipped with two Roman Pots; each pot – that is separated from the vacuum of the accelerator by a thin window but is connected with bellows to the beam-pipe – can be moved very close to the beam. “The Roman Pot technique has been used successfully in the past for the measurement of elastic scattering very close to the circulating beam,” says Patrick Fassn...

  4. Characteristics of the ATLAS and CMS detectors

    CERN Document Server

    Seiden, Abraham

    2012-01-01

    The goal for the detection of new physics processes in particle collisions at Large Hadron Collider energies, combined with the broad spectrum of possibilities for how the physics might be manifest, leads to detectors of unprecedented scope and size for particle physics experiments at colliders. The resulting two detectors, ATLAS (A Toroidal LHC ApparatuS) and CMS (compact muon spectrometer), must search for the new physics processes within very complex events arising from the very high-energy collisions. The two experiments share many basic design features—in particular, the need for very selective triggering to weed out the bulk of the uninteresting events; the order in which detector types are arrayed in order to provide maximum information about each event; and the very large angular coverage required to constrain the energy carried by any non-interacting particles. However, within these basic constraints, the detectors are quite different given the different emphases placed on issues such as resolution...

  5. Qualification of Barrel Pixel Detector Modules for the Phase 1 Upgrade of the CMS Vertex Detector

    CERN Document Server

    Kudella, Simon

    2016-01-01

    To withstand the higher particle rates of LHC Runs 2 and 3, with expected luminosities of up to $2\\times 10^{34}\\,\\mathrm{cm^{-2}s^{-1}}$, the current CMS pixel detector at the LHC will be replaced as part of the CMS Phase I Upgrade during the extended winter shutdown in 2016/17. The new pixel detector features a new geometry with one additional detector layer in the barrel region~(BPIX) and one pair of additional disks in the forward region~(FPIX), new digital readout chips as well as a new CO$_{2}$-based cooling system for both the barrel and forward region. The BPIX detector module production is summarized, with special focus on the different stages of quality assurance. The quality tests as well as the calibrations which all produced modules undergo in a temperature and humidity controlled environment are described. Exemplarily, the KIT/Aachen production line and its subprocesses are presented together with its quality and yields.

  6. Small-Scale Readout System Prototype for the STAR PIXEL Detector

    Energy Technology Data Exchange (ETDEWEB)

    Szelezniak, Michal; Anderssen, Eric; Greiner, Leo; Matis, Howard; Ritter, Hans Georg; Stezelberger, Thorsten; Sun, Xiangming; Thomas, James; Vu, Chinh; Wieman, Howard

    2008-10-10

    Development and prototyping efforts directed towards construction of a new vertex detector for the STAR experiment at the RHIC accelerator at BNL are presented. This new detector will extend the physics range of STAR by allowing for precision measurements of yields and spectra of particles containing heavy quarks. The innermost central part of the new detector is a high resolution pixel-type detector (PIXEL). PIXEL requirements are discussed as well as a conceptual mechanical design, a sensor development path, and a detector readout architecture. Selected progress with sensor prototypes dedicated to the PIXEL detector is summarized and the approach chosen for the readout system architecture validated in tests of hardware prototypes is discussed.

  7. Pixel readout ASIC for an APD based 2D X-ray hybrid pixel detector with sub-nanosecond resolution

    Energy Technology Data Exchange (ETDEWEB)

    Thil, Ch., E-mail: christophe.thil@ziti.uni-heidelberg.d [Heidelberg University, Institute of Computer Engineering, B6, 26, 68161 Mannheim (Germany); Baron, A.Q.R. [RIKEN SPring-8 Center, 1-1-1 Kouto, Sayo-cho, Sayo-gun, Hyogo 679-5148 (Japan); Fajardo, P. [ESRF, Polygone Scientifique Louis Neel, 6, rue Jules Horowitz, 38000 Grenoble (France); Fischer, P. [Heidelberg University, Institute of Computer Engineering, B6, 26, 68161 Mannheim (Germany); Graafsma, H. [DESY, Notkestrasse 85, 22607 Hamburg (Germany); Rueffer, R. [ESRF, Polygone Scientifique Louis Neel, 6, rue Jules Horowitz, 38000 Grenoble (France)

    2011-02-01

    The fast response and the short recovery time of avalanche photodiodes (APDs) in linear mode make those devices ideal for direct X-ray detection in applications requiring high time resolution or counting rate. In order to provide position sensitivity, the XNAP project aims at creating a hybrid pixel detector with nanosecond time resolution based on a monolithic APD sensor array with 32 x32 pixels covering about 1 cm{sup 2} active area. The readout is implemented in a pixelated front-end ASIC suited for the readout of such arrays, matched to pixels of 280{mu}mx280{mu}m size. Every single channel features a fast transimpedance amplifier, a discriminator with locally adjustable threshold and two counters with high dynamic range and counting speed able to accumulate X-ray hits with no readout dead time. Additionally, the detector can be operated in list mode by time-stamping every single event with sub-nanosecond resolution. In a first phase of the project, a 4x4 pixel test module is built to validate the conceptual design of the detector. The XNAP project is briefly presented and the performance of the readout ASIC is discussed.

  8. Performance of Edgeless Silicon Pixel Sensors on p-type substrate for the ATLAS High-Luminosity Upgrade

    CERN Document Server

    INSPIRE-00052711; Boscardin, Maurizio; Bosisio, Luciano; Calderini, Giovanni; Chauveau, Jacques; Ducourthial, Audrey; Giacomini, Gabriele; Marchiori, Giovanni; Zorzi, Nicola

    2016-01-01

    In view of the LHC upgrade phases towards the High Luminosity LHC (HL-LHC), the ATLAS experiment plans to upgrade the Inner Detector with an all-silicon system. The n-on-p silicon technology is a promising candidate to achieve a large area instrumented with pixel sensors, since it is radiation hard and cost effective. The paper reports on the performance of novel n-on-p edgeless planar pixel sensors produced by FBK-CMM, making use of the active trench for the reduction of the dead area at the periphery of the device. After discussing the sensor technology an overview of the first beam test results will be given.

  9. Development of Edgeless Silicon Pixel Sensors on p-type substrate for the ATLAS High-Luminosity Upgrade

    Energy Technology Data Exchange (ETDEWEB)

    Calderini, G. [Laboratoire de Physique Nucléaire et des Hautes Energies (LPNHE), Paris (France); Dipartimento di Fisica E. Fermi, Universitá di Pisa, Pisa (Italy); Bagolini, A. [Fondazione Bruno Kessler, Centro per i Materiali e i Microsistemi (FBK-CMM), Povo di Trento (Italy); Beccherle, R. [Istituto Nazionale di Fisica Nucleare, Sez. di Pisa (Italy); Bomben, M. [Laboratoire de Physique Nucléaire et des Hautes Energies (LPNHE), Paris (France); Boscardin, M. [Fondazione Bruno Kessler, Centro per i Materiali e i Microsistemi (FBK-CMM), Povo di Trento (Italy); Bosisio, L. [Università degli studi di Trieste (Italy); INFN-Trieste (Italy); Chauveau, J. [Laboratoire de Physique Nucléaire et des Hautes Energies (LPNHE), Paris (France); Giacomini, G. [Fondazione Bruno Kessler, Centro per i Materiali e i Microsistemi (FBK-CMM), Povo di Trento (Italy); La Rosa, A. [Section de Physique (DPNC), Universitè de Geneve, Geneve (Switzerland); Marchiori, G. [Laboratoire de Physique Nucléaire et des Hautes Energies (LPNHE), Paris (France); Zorzi, N. [Fondazione Bruno Kessler, Centro per i Materiali e i Microsistemi (FBK-CMM), Povo di Trento (Italy)

    2016-09-21

    In view of the LHC upgrade phases towards the High Luminosity LHC (HL-LHC), the ATLAS experiment plans to upgrade the Inner Detector with an all-silicon system. The n-on-p silicon technology is a promising candidate to achieve a large area instrumented with pixel sensors, since it is radiation hard and cost effective. The presentation describes the performance of novel n-in-p edgeless planar pixel sensors produced by FBK-CMM, making use of the active trench for the reduction of the dead area at the periphery of the device. After discussing the sensor technology, some feedback from preliminary results of the first beam test will be discussed.

  10. Development of Edgeless Silicon Pixel Sensors on p-type substrate for the ATLAS High-Luminosity Upgrade

    Science.gov (United States)

    Calderini, G.; Bagolini, A.; Beccherle, R.; Bomben, M.; Boscardin, M.; Bosisio, L.; Chauveau, J.; Giacomini, G.; La Rosa, A.; Marchiori, G.; Zorzi, N.

    2016-09-01

    In view of the LHC upgrade phases towards the High Luminosity LHC (HL-LHC), the ATLAS experiment plans to upgrade the Inner Detector with an all-silicon system. The n-on-p silicon technology is a promising candidate to achieve a large area instrumented with pixel sensors, since it is radiation hard and cost effective. The presentation describes the performance of novel n-in-p edgeless planar pixel sensors produced by FBK-CMM, making use of the active trench for the reduction of the dead area at the periphery of the device. After discussing the sensor technology, some feedback from preliminary results of the first beam test will be discussed.

  11. Thin n-in-p planar pixel sensors and active edge sensors for the ATLAS upgrade at HL-LHC

    CERN Document Server

    Terzo, Stefano; Nisius, R.; Paschen, B.

    2014-01-01

    Silicon pixel modules employing n-in-p planar sensors with an active thickness of 200 $\\mu$m, produced at CiS, and 100-200 $\\mu$m thin active/slim edge sensor devices, produced at VTT in Finland have been interconnected to ATLAS FE-I3 and FE-I4 read-out chips. The thin sensors are designed for high energy physics collider experiments to ensure radiation hardness at high fluences. Moreover, the active edge technology of the VTT production maximizes the sensitive region of the assembly, allowing for a reduced overlap of the modules in the pixel layer close to the beam pipe. The CiS production includes also four chip sensors according to the module geometry planned for the outer layers of the upgraded ATLAS pixel detector to be operated at the HL-LHC. The modules have been characterized using radioactive sources in the laboratory and with high precision measurements at beam tests to investigate the hit efficiency and charge collection properties at different bias voltages and particle incidence angles. The perfo...

  12. The alignment of the ATLAS Inner Detector in Run 2

    CERN Document Server

    Ripellino, Giulia; The ATLAS collaboration

    2016-01-01

    The ATLAS reconstruction of charged particle trajectories relies on the Inner Detector tracking system. The accuracy of the reconstruction is limited by the finite resolution of the detector elements and the knowledge about their positions. A precise alignment of the detector is therefore essential. In this poster we present the strategy and the status of the Inner Detector alignment in ATLAS during the LHC Run 2.

  13. Modeling Inter-Pixel Crosstalk in Teledyne Imaging Sensors H4RG Detectors

    CERN Document Server

    Dudik, R P; Dorland, B N; Veillette, D; Waczynski, A; Lane, B; Loose, M; Kan, E; Waterman, J; Pravdo, S

    2012-01-01

    CMOS-hybrid arrays have recently surfaced as competitive optical detectors for use in ground- and space-based astronomy. One source of error in these detectors that does not appear in more traditional CCD arrays is the inter-pixel capacitance component of crosstalk. In this paper we use a single pixel reset method to model inter-pixel capacitance (IPC). We combine this IPC model with a model for charge diffusion to estimate the total crosstalk on H4RG arrays. Finally, we compare our model results to Fe55 data obtained using an astrometric camera built to test the H4RG-B0 generation detectors.

  14. Silicon Strip Detectors for the ATLAS sLHC Upgrade

    CERN Document Server

    Soldevila, U; The ATLAS collaboration

    2011-01-01

    While the Large Hadron Collider (LHC) at CERN is continuing to deliver an ever-increasing luminosity to the experiments, plans for an upgraded machine called Super-LHC (sLHC) are progressing. The upgrade is foreseen to increase the LHC design luminosity by a factor ten. The ATLAS experiment will need to build a new tracker for sLHC operation, which needs to be suited to the harsh sLHC conditions in terms of particle rates and radiation doses. In order to cope with the increase in pile-up backgrounds at the higher luminosity, an all silicon detector is being designed. To successfully face the increased radiation dose, a new generation of extremely radiation hard silicon detectors is being designed. Silicon sensors with sufficient radiation hardness are the subject of an international R&amp;D programme, working on pixel and strip sensors. The efforts presented here concentrate on the innermost strip layers. We have developed a large number of prototype planar detectors produced on p-type wafers in a...

  15. Silicon strip detectors for the ATLAS HL-LHC upgrade

    CERN Document Server

    Bernabeu, J; The ATLAS collaboration

    2011-01-01

    While the Large Hadron Collider (LHC) at CERN is continuing to deliver an ever-increasing luminosity to the experiments, plans for an upgraded machine called Super-LHC (sLHC) are progressing. The upgrade is foreseen to increase the LHC design luminosity by a factor ten. The ATLAS experiment will need to build a new tracker for sLHC operation, which needs to be suited to the harsh sLHC conditions in terms of particle rates and radiation doses. In order to cope with the increase in pile-up backgrounds at the higher luminosity, an all silicon detector is being designed. To successfully face the increased radiation dose, a new generation of extremely radiation hard silicon detectors is being designed. Silicon sensors with sufficient radiation hardness are the subject of an international R&D programme, working on pixel and strip sensors. The efforts presented here concentrate on the innermost strip layers. We have developed a large number of prototype planar detectors produced on p-type wafers in a number of d...

  16. X-ray imaging with photon counting hybrid semiconductor pixel detectors

    CERN Document Server

    Manolopoulos, S; Campbell, M; Snoeys, W; Heijne, Erik H M; Pernigotti, E; Raine, C; Smith, K; Watt, J; O'Shea, V; Ludwig, J; Schwarz, C

    1999-01-01

    Semiconductor pixel detectors, originally developed for particle physics experiments, have been studied as X-ray imaging devices. The performance of devices using the OMEGA 3 read-out chip bump-bonded to pixellated silicon semiconductor detectors is characterised in terms of their signal-to-noise ratio when exposed to 60 kVp X-rays. Although parts of the devices achieve values of this ratio compatible with the noise being photon statistics limited, this is not found to hold for the whole pixel matrix, resulting in the global signal-to-noise ratio being compromised. First results are presented of X-ray images taken with a gallium arsenide pixel detector bump-bonded to a new read-out chip, (MEDIPIX), which is a single photon counting read-out chip incorporating a 15-bit counter in every pixel. (author)

  17. X-ray imaging with photon counting hybrid semiconductor pixel detectors

    Energy Technology Data Exchange (ETDEWEB)

    Manolopoulos, S.; Bates, R.; Campbell, M.; Snoeys, W.; Heijne, E.; Pernigotti, E.; Raine, C.; Smith, K. E-mail: k.smith@physics.gla.ac.uk; Watt, J.; O' Shea, V.; Ludwig, J.; Schwarz, C

    1999-09-11

    Semiconductor pixel detectors, originally developed for particle physics experiments, have been studied as X-ray imaging devices. The performance of devices using the {omega}3 read-out chip bump-bonded to pixellated silicon semiconductor detectors is characterised in terms of their signal-to-noise ratio when exposed to 60 kVp X-rays. Although parts of the devices achieve values of this ratio compatible with the noise being photon statistics limited, this is not found to hold for the whole pixel matrix, resulting in the global signal-to-noise ratio being compromised. First results are presented of X-ray images taken with a gallium arsenide pixel detector bump-bonded to a new read-out chip, (MEDIPIX), which is a single photon counting read-out chip incorporating a 15-bit counter in every pixel. (author)

  18. The simulation of charge sharing in semiconductor X-ray pixel detectors

    CERN Document Server

    Mathieson, K; O'Shea, V; Passmore, M S; Rahman, M; Smith, K M; Watt, J; Whitehill, C

    2002-01-01

    Two simulation packages were used to model the sharing of charge, due to the scattering and diffusion of carriers, between adjacent pixel elements in semiconductors X-ray detectors. The X-ray interaction and the consequent multiple scattering was modelled with the aid of the Monte Carlo package, MCNP. The resultant deposited charge distribution was then used to create the charge cloud profile in the finite element semiconductor simulation code MEDICI. The analysis of the current pulses induced on pixel electrodes for varying photon energies was performed for a GaAs pixel detector. For a pixel pitch of 25 mu m, the charge lost to a neighbouring pixel was observed to be constant, at 0.6%, through the energies simulated. Ultimately, a fundamental limit on the pixel element size for imaging and spectroscopic devices may be set due to these key physical principles.

  19. Efficient phase contrast imaging in STEM using a pixelated detector. Part II: Optimisation of imaging conditions

    Energy Technology Data Exchange (ETDEWEB)

    Yang, Hao, E-mail: hao.yang@materials.ox.ac.uk [University of Oxford, Department of Materials. Parks Rd, Oxford OX1 3PH (United Kingdom); Pennycook, Timothy J.; Nellist, Peter D. [University of Oxford, Department of Materials. Parks Rd, Oxford OX1 3PH (United Kingdom); EPSRC SuperSTEM Facility, Daresbury Laboratory, WA4 4AD (United Kingdom)

    2015-04-15

    In Part I of this series of two papers, we demonstrated the formation of a high efficiency phase-contrast image at atomic resolution using a pixelated detector in the scanning transmission electron microscope (STEM) with ptychography. In this paper we explore the technique more quantitatively using theory and simulations. Compared to other STEM phase contrast modes including annular bright field (ABF) and differential phase contrast (DPC), we show that the ptychographic phase reconstruction method using pixelated detectors offers the highest contrast transfer efficiency and superior low dose performance. Applying the ptychographic reconstruction method to DPC segmented detectors also improves the detector contrast transfer and results in less noisy images than DPC images formed using difference signals. We also find that using a minimum array of 16×16 pixels is sufficient to provide the highest signal-to-noise ratio (SNR) for imaging beam sensitive weak phase objects. Finally, the convergence angle can be adjusted to enhance the contrast transfer based on the spatial frequencies of the specimen under study. - Highlights: • High efficiency phase contrast transfer function (PCTF) can be achieved using pixelated detectors followed by a ptychographic reconstruction. • Ptychographic reconstruction offers the highest PCTF across the entire spatial frequency range compared to DPC and ABF. • Image simulations show that a ptychographic reconstruction using pixelated detectors offers a superior low dose performance for imaging weak phase objects. • Optimisation of imaging conditions using pixelated detectors are discussed by considering the contrast transfer function for various cases.

  20. Active pixel sensors in AMS H18/H35 HV-CMOS technology for the ATLAS HL-LHC upgrade

    Science.gov (United States)

    Ristic, Branislav

    2016-09-01

    Deep sub micron HV-CMOS processes offer the opportunity for sensors built by industry standard techniques while being HV tolerant, making them good candidates for drift-based, fast collecting, thus radiation-hard pixel detectors. For the upgrade of the ATLAS Pixel Detector towards the HL-LHC requirements, active pixel sensors in HV-CMOS technology were investigated. These implement signal processing electronics in deep n-wells, which also act as collecting electrodes. The deep n-wells allow for bias voltages up to 150 V leading to a depletion depth of several 10 μm. Prototype sensors in the AMS H18 180 nm and H35 350 nm HV-CMOS processes were thoroughly tested in lab measurements as well as in testbeam experiments. Irradiations with X-rays and protons revealed a tolerance to ionizing doses of 1 Grad while Edge-TCT studies assessed the effects of radiation on the charge collection. The sensors showed high detection efficiencies after neutron irradiation to 1015neq cm-2 in testbeam experiments. A full reticle size demonstrator chip, implemented in the H35 process is being submitted to prove the large scale feasibility of the HV-CMOS concept.

  1. Optimization of CZT Detectors with Sub-mm Pixel Pitches Project

    Data.gov (United States)

    National Aeronautics and Space Administration — We propose to develop and optimize 0.5 cm thick Cadmium Zinc Telluride (CZT) detectors with very small pixel pitches, i.e. 350 micron and 600 micron. The proposed...

  2. Characterization of edgeless pixel detectors coupled to Medipix2 readout chip

    Science.gov (United States)

    Kalliopuska, Juha; Tlustos, Lukas; Eränen, Simo; Virolainen, Tuula

    2011-08-01

    VTT has developed a straightforward and fast process to fabricate four-side buttable (edgeless) microstrip and pixel detectors on 6 in. (150 mm) wafers. The process relies on advanced ion implantation to activate the edges of the detector instead of using polysilicon. The article characterizes 150 μm thick n-on-n edgeless pixel detector prototypes with a dead layer at the edge below 1 μm. Electrical and radiation response characterization of 1.4×1.4 cm2 n-on-n edgeless detectors has been done by coupling them to the Medipix2 readout chips. The distance of the detector's physical edge from the pixels was either 20 or 50 μm. The leakage current of flip-chip bonded edgeless Medipix2 detector assembles were measured to be ˜90 nA/cm2 and no breakdown was observed below 110 V. Radiation response characterization includes X-ray tube and radiation source responses. The characterization results show that the detector's response at the pixels close to the physical edge of the detector depend dramatically on the pixel-to-edge distance.

  3. Digital column readout architectures for hybrid pixel detector readout chips

    CERN Document Server

    Poikela, T; Westerlund, T; Buytaert, J; Campbell, M; De Gaspari, M; Llopart, X; Wyllie, K; Gromov, V; Kluit, R; van Beuzekom, M; Zappon, F; Zivkovic, V; Brezina, C; Desch, K; Fu, Y; Kruth, A

    2014-01-01

    In this paper, two digital column architectures suitable for sparse readout of data from a pixel matrix in trigger-less applications are presented. Each architecture reads out a pixel matrix of 256 x 256 pixels with a pixel pitch of 55 µm. The first architecture has been implemented in the Timepix3 chip, and this is presented together with initial measurements. Simulation results and measured data are compared. The second architecture has been designed for Velopix, a readout chip planned for the LHCb VELO upgrade. Unlike Timepix3, this has to be tolerant to radiation-induced single-event effects. Results from post-layout simulations are shown with the circuit architectures.

  4. Monitored Drift Chambers in the ATLAS Detector

    CERN Multimedia

    Herten, G

    Monitored Drift Chambers (MDT) are used in the ATLAS Detector to measure the momentum of high energy muons. They consist of drift tubes, which are filled with an Ar-CO2 gas mixture at 3 bar gas pressure. About 1200 drift chambers are required for ATLAS. They are up to 6 m long. Nevertheless the position of every wire needs to be known with a precision of 20 µm within a chamber. In addition, optical alignment sensors are required to measure the relative position of adjacent chambers with a precision of 30µm. This gigantic task seems impossible at first instance. Indeed it took many years of R&D to invent the right tools and methods before the first chamber could be built according to specifications. Today, at the time when 50% of the chambers have been produced, we are confident that the goal for ATLAS can be reached. The mechanical precision of the chambers could be verified with the x-ray tomograph at CERN. This ingenious device, developed for the MDT system, is able to measure the wire position insid...

  5. Investigation of photon counting pixel detectors for X-ray spectroscopy and imaging

    Energy Technology Data Exchange (ETDEWEB)

    Talla, Patrick Takoukam

    2011-04-07

    The Medipix2 and Medipix3 detectors are hybrid pixelated photon counting detectors with a pixel pitch of 55 {mu}m. The sensor material used in this thesis was silicon. Because of their small pixel size they suffer from charge sharing i.e. an incoming photon can be registered by more than one pixel. In order to correct for charge sharing due to lateral diffusion of charge carriers, the Medipix3 detector was developed: with its Charge Summing Mode, the charge collected in a cluster of 2 x 2 pixel is added up and attributed to only one pixel whose counter is incremented. The adjustable threshold of the detectors allows to count the photons and to gain information on their energy. The main purposes of the thesis are to investigate spectral and imaging properties of pixelated photon counting detectors from the Medipix family such as Medipix2 and Medipix3. The investigations are based on simulations and measurements. In order to investigate the spectral properties of the detectors measurements were performed using fluorescence lines of materials such as molybdenum, silver but also some radioactive sources such as Am-241 or Cd-109. From the measured data, parameters like the threshold dispersion and the gain variation from pixel-to-pixel were extracted and used as input in the Monte Carlo code ROSI to model the responses of the detector to monoenergetic photons. The measured data are well described by the simulations for Medipix2 and for Medipix3 operating in Charge Summing Mode. Due to charge sharing and due to the energy dependence of attenuation processes in silicon and to Compton scattering the incoming and the measured spectrum differ substantially from each other. Since the responses to monoenergetic photons are known, a deconvolution was performed to determine the true incoming spectrum. Several direct and iterative methods were successfully applied on measured and simulated data of an X-ray tube and radioactive sources. The knowledge of the X-ray spectrum is

  6. Modelling of the small pixel effect in gallium arsenide X-ray imaging detectors

    CERN Document Server

    Sellin, P J

    1999-01-01

    A Monte Carlo simulation has been carried out to investigate the small pixel effect in highly pixellated X-ray imaging detectors fabricated from semi-insulating gallium arsenide. The presence of highly non-uniform weighting fields in detectors with a small pixel geometry causes the majority of the induced signal to be generated when the moving charges are close to the pixellated contacts. The response of GaAs X-ray imaging detectors is further complicated by the presence of charge trapping, particularly of electrons. In this work detectors are modelled with a pixel pitch of 40 and 150 mu m, and with thicknesses of 300 and 500 mu m. Pulses induced in devices with 40 mu m pixels are due almost totally to the movement of the lightly-trapped holes and can exhibit significantly higher charge collection efficiencies than detectors with large electrodes, in which electron trapping is significant. Details of the charge collection efficiencies as a function of interaction depth in the detector and of the incident phot...

  7. Achievements of the ATLAS Upgrade Planar Pixel Sensors R&D Project

    CERN Document Server

    Nellist, C

    2015-01-01

    In the framework of the HL-LHC upgrade, the ATLAS experiment plans to introduce an all-silicon inner tracker to cope with the elevated occupancy. To investigate the suitability of pixel sensors using the proven planar technology for the upgraded tracker, the ATLAS Planar Pixel Sensor R&D Project (PPS) was established comprising 19 institutes and more than 90 scientists. The paper provides an overview of the research and development project and highlights accomplishments, among them: beam test results with planar sensors up to innermost layer fluences (> 10^16 n_eq cm^2); measurements obtained with irradiated thin edgeless n-in-p pixel assemblies; recent studies of the SCP technique to obtain almost active edges by postprocessing already existing sensors based on scribing, cleaving and edge passivation; an update on prototyping efforts for large areas: sensor design improvements and concepts for low-cost hybridisation; comparison between Secondary Ion Mass Spectrometry results and TCAD simulations. Togethe...

  8. Thin n-in-p planar pixel modules for the ATLAS upgrade at HL-LHC

    Science.gov (United States)

    Savic, N.; Bergbreiter, L.; Breuer, J.; La Rosa, A.; Macchiolo, A.; Nisius, R.; Terzo, S.

    2017-02-01

    The ATLAS experiment will undergo a major upgrade of the tracker system in view of the high luminosity phase of the LHC (HL-LHC) foreseen to start around 2025. Thin planar pixel modules are promising candidates to instrument the new pixel system, thanks to the reduced contribution to the material budget and their high charge collection efficiency after irradiation. New designs of the pixel cells, with an optimized biasing structure, have been implemented in n-in-p planar pixel productions with sensor thicknesses of 270 μm. Using beam tests, the gain in hit efficiency is investigated as a function of the received irradiation fluence. The outlook for future thin planar pixel sensor productions will be discussed, with a focus on thin sensors with a thickness of 100 and 150 μm and a novel design with the optimized biasing structure and small pixel cells (50×50 and 25×100 μm2). These dimensions are foreseen for the new ATLAS read-out chip in 65 nm CMOS technology and the fine segmentation will represent a challenge for the tracking in the forward region of the pixel system at HL-LHC. To predict the performance of 50×50 μm2 pixels at high η, FE-I4 compatible planar pixel sensors have been studied before and after irradiation in beam tests at high incidence angle with respect to the short pixel direction. Results on cluster shapes, charge collection- and hit efficiency will be shown.

  9. Development of pixel readout integrated circuits for extreme rate and radiation

    CERN Document Server

    Garcia-Sciveres, M; CERN. Geneva. The LHC experiments Committee; LHCC

    2013-01-01

    Letter of Intent for RD Collaboration Proposal focused on development of a next generation pixel readout integrated circuits needed for high luminosity LHC detector upgrades. Brings together ATLAS and CMS pixel chip design communities.

  10. Alignment of the ATLAS Inner Detector

    CERN Document Server

    Marti-Garcia, Salvador; The ATLAS collaboration

    2016-01-01

    The Run-2 of the LHC has presented new challenges to track and vertex reconstruction with higher energies, denser jets and higher rates. In addition, the Insertable B-layer (IBL) is a fourth pixel layer, which has been deployed at the centre of ATLAS during the longshutdown-1 of the LHC. The physics performance of the experiment requires a high resolution and unbiased measurement of all charged particle kinematic parameters. In its turn, the performance of the tracking depends, among many other issues, on the accurate determination of the alignment parameters of the tracking sensors. The offline track based alignment of the ATLAS tracking system has to deal with more than 700,000 degrees of freedom (DoF). This represents a considerable numerical challenge in terms of both CPU time and precision. During Run-2, a mechanical distortion of the IBL staves up to 20um has been observed during data-taking, plus other short time scale movements. The talk will also describe the procedures implemented to detect and remo...

  11. Imaging and spectroscopic performance studies of pixellated CdTe Timepix detector

    Science.gov (United States)

    Maneuski, D.; Astromskas, V.; Fröjdh, E.; Fröjdh, C.; Gimenez, E. N.; Marchal, J.; O'Shea, V.; Stewart, G.; Tartoni, N.; Wilhelm, H.; Wraight, K.; Zain, R. M.

    2012-01-01

    In this work the results on imaging and spectroscopic performances of 14 × 14 × 1 mm CdTe detectors with 55 × 55 μm and 110 × 110 μm pixel pitch bump-bonded to a Timepix chip are presented. The performance of the 110 × 110 μm pixel detector was evaluated at the extreme conditions beam line I15 of the Diamond Light Source. The energy of X-rays was set between 25 and 77 keV. The beam was collimated through the edge slits to 20 μm FWHM incident in the middle of the pixel. The detector was operated in the time-over-threshold mode, allowing direct energy measurement. Energy in the neighbouring pixels was summed for spectra reconstruction. Energy resolution at 77 keV was found to be ΔE/E = 3.9%. Comparative imaging and energy resolution studies were carried out between two pixel size detectors with a fluorescence target X-ray tube and radioactive sources. The 110 × 110 μm pixel detector exhibited systematically better energy resolution in comparison to 55 × 55 μm. An imaging performance of 55 × 55 μm pixellated CdTe detector was assessed using the Modulation Transfer Function (MTF) technique and compared to the larger pixel. A considerable degradation in MTF was observed for bias voltages below -300 V. Significant room for improvement of the detector performance was identified both for imaging and spectroscopy and is discussed.

  12. Direct charge sharing observation in single-photon-counting pixel detector

    Energy Technology Data Exchange (ETDEWEB)

    Pellegrini, G. [Centro Nacional de Microelectronica, IMB-CNM (CSIC), Barcelona 08193 (Spain)]. E-mail: Giulio.Pellegrini@cnm.es; Maiorino, M. [IFAE - Institut de Fisica d' Altes Energies, UAB Campus, 08193 Bellaterra (Spain); Blanchot, G. [IFAE - Institut de Fisica d' Altes Energies, UAB Campus, 08193 Bellaterra (Spain); Chmeissani, M. [IFAE - Institut de Fisica d' Altes Energies, UAB Campus, 08193 Bellaterra (Spain); Garcia, J. [IFAE - Institut de Fisica d' Altes Energies, UAB Campus, 08193 Bellaterra (Spain); Lozano, M. [Centro Nacional de Microelectronica, IMB-CNM (CSIC), Barcelona 08193 (Spain); Martinez, R. [Centro Nacional de Microelectronica, IMB-CNM (CSIC), Barcelona 08193 (Spain); Puigdengoles, C. [IFAE - Institut de Fisica d' Altes Energies, UAB Campus, 08193 Bellaterra (Spain); Ullan, M. [Centro Nacional de Microelectronica, IMB-CNM (CSIC), Barcelona 08193 (Spain)

    2007-04-01

    In photon-counting imaging devices, charge sharing can limit the detector spatial resolution and contrast, as multiple counts can be induced in adjacent pixels as a result of the spread of the charge cloud generated from a single X-ray photon of high energy in the detector bulk. Although debated for a long time, the full impact of charge sharing has not been completely assessed. In this work, the importance of charge sharing in pixellated CdTe and silicon detectors is studied by exposing imaging devices to different low activity sources. These devices are made of Si and CdTe pixel detector bump-bonded to Medipix2 single-photon-counting chips with a 55 {mu}m pixel pitch. We will show how charge sharing affects the spatial detector resolution depending on incident particle type (alpha, beta and gamma), detector bias voltage and read-out chip threshold. This study will give an insight on the impact on the design and operation of pixel detectors coupled to photon-counting devices for imaging applications.

  13. Direct charge sharing observation in single-photon-counting pixel detector

    Science.gov (United States)

    Pellegrini, G.; Maiorino, M.; Blanchot, G.; Chmeissani, M.; Garcia, J.; Lozano, M.; Martinez, R.; Puigdengoles, C.; Ullan, M.

    2007-04-01

    In photon-counting imaging devices, charge sharing can limit the detector spatial resolution and contrast, as multiple counts can be induced in adjacent pixels as a result of the spread of the charge cloud generated from a single X-ray photon of high energy in the detector bulk. Although debated for a long time, the full impact of charge sharing has not been completely assessed. In this work, the importance of charge sharing in pixellated CdTe and silicon detectors is studied by exposing imaging devices to different low activity sources. These devices are made of Si and CdTe pixel detector bump-bonded to Medipix2 single-photon-counting chips with a 55 μm pixel pitch. We will show how charge sharing affects the spatial detector resolution depending on incident particle type (alpha, beta and gamma), detector bias voltage and read-out chip threshold. This study will give an insight on the impact on the design and operation of pixel detectors coupled to photon-counting devices for imaging applications.

  14. Readout and Trigger for the AFP Detector at ATLAS Experiment

    CERN Document Server

    Kocian, Martin; The ATLAS collaboration

    2016-01-01

    AFP, the ATLAS Forward Proton consists of silicon detectors at 205 m and 217 m on each side of ATLAS. In 2016 two detectors in one side were installed. The FEI4 chips are read at 160 Mbps over the optical fibers. The DAQ system uses a FPGA board with Artix chip and a mezzanine card with RCE data processing module based on a Zynq chip with ARM processor running Linux. In this contribution we give an overview of the AFP detector with the commissioning steps taken to integrate with the ATLAS TDAQ. Furthermore first performance results are presented.

  15. The Evaporative Cooling System for the ATLAS Inner Detector

    CERN Document Server

    Aitree, D; Anderssen, E C; Akhnazarov, V; Apsimon, R J; Barclay, P; Batchelor, L E; Bates, R L; Battistin, M; Bendotti, J; Berry, S; Bitadze, A; Bizzel, J P; Bonneau, P; Bosteels, Michel; Butterworth, J M; Butterworth, S; Carter, A A; Carter, J R; Catinaccio, A; Corbaz, F; Danielsson, H O; Danilevich, E; Dixon, N; Dixon, S D; Doherty, F; Dorholt, O; Doubrava, M; Egorov, I; Egorov, K; Einsweiler, K; Falou, A C; Feraudet, P; Ferrari, P; Fowler, K; Fraser, J T; French, R S; Galuska, M; Gannaway, F; Gariano, G; Gibson, M D; Gilchriese, M G D; Giugni, D; Godlewski, J; Gousakov, I; Górski, B; Hallewell, G D; Hartman, N; Hawkings, R J; Haywood, S J; Hessey, N P; Infante, S; Jackson, J N; Jones, T J; Kaplon, J; Katunin, S; Lindsay, S; Luisa, L; Massol, N; McEwan, F; McMahon, S J; Menot, C; Mistry, J; Morris, J; Muskett, D M; Nagai, K; Nichols, A; Nicholson, R; Nickerson, R B; Nielsen, S L; Nordahl, P E; Olcese, M; Parodi, M; Pérez-Gómez, F; Pernegger, H; Perrin, E; Rossi, L P; Rovani, A; Ruscino, E; Sandaker, H; Smith, A; Sopko, V; Stapnes, S; Stodulski, M; Tarrant, J; Thadome, J; Tovey, D; Turala, M; Tyndel, M; Vacek, V; van der Kraaij, E; Viehhauser, G H A; Vigeolas, E; Wells, P S; Wenig, S; Werneke, P

    2008-01-01

    This paper describes the evaporative system used to cool the silicon detector structures of the inner detector sub-detectors of the ATLAS experiment at the CERN Large Hadron Collider. The motivation for an evaporative system, its design and construction are discussed. In detail the particular requirements of the ATLAS inner detector, technical choices and the qualification and manufacture of final components are addressed. Finally results of initial operational tests are reported. Although the entire system described, the paper focuses on the on-detector aspects. Details of the evaporative cooling plant will be discussed elsewhere.

  16. ASICs in nanometer and 3D technologies for readout of hybrid pixel detectors

    Science.gov (United States)

    Maj, Piotr; Grybos, Pawel; Kmon, Piotr; Szczygiel, Robert

    2013-07-01

    Hybrid pixel detectors working in a single photon counting mode are very attractive solutions for material science and medical X-ray imaging applications. Readout electronics of these detectors has to match the geometry of pixel detectors with an area of readout channel of 100 μm × 100 μm (or even less) and very small power consumption (a few tens of μW). New solutions of readout ASICs are going into directions of better spatial resolutions, higher data throughput and more advanced functionality. We report on the design and measurement results of two pixel prototype ASICs in nanometer technology and 3D technology which offer fast signal processing, low noise performance and advanced functionality per single readout pixel cell.

  17. Module Production and Qualification for the Phase I Upgrade of the CMS Pixel Detector

    CERN Document Server

    AUTHOR|(CDS)2086689

    2015-01-01

    After consolidation of the LHC in 2013/14 its centre-of-mass energy will increase to 13TeV and the luminosity will reach $2 \\cdot 10^{34}\\, \\textnormal{cm}^{-2} \\textnormal{s}^{-1}$, which is twice the design luminosity. The latter will result in more simultaneous particle collisions, which would significantly increase the dead time of the current readout chip of the CMS pixel detector. Therefore the entire CMS pixel detector is replaced in 2016/17 and a new digital readout with larger buffers will be used to handle increasing pixel hit rates. An additional fourth barrel-layer provides more space points to improve track reconstruction. Half of the required modules for layer four is being produced at Karlsruhe Institute of Technology (KIT). This poster deals with the smallest discrete subunit of the pixel detector, the module and its assembly process. Moreover first production experience will be shown.

  18. X-ray Characterization of a Multichannel Smart-Pixel Array Detector

    Energy Technology Data Exchange (ETDEWEB)

    Ross, Steve; Haji-Sheikh, Michael; Huntington, Andrew; Kline, David; Lee, Adam; Li, Yuelin; Rhee, Jehyuk; Tarpley, Mary; Walko, Donald A.; Westberg, Gregg; Williams, George; Zou, Haifeng; Landahl, Eric

    2016-01-01

    The Voxtel VX-798 is a prototype X-ray pixel array detector (PAD) featuring a silicon sensor photodiode array of 48 x 48 pixels, each 130 mu m x 130 mu m x 520 mu m thick, coupled to a CMOS readout application specific integrated circuit (ASIC). The first synchrotron X-ray characterization of this detector is presented, and its ability to selectively count individual X-rays within two independent arrival time windows, a programmable energy range, and localized to a single pixel is demonstrated. During our first trial run at Argonne National Laboratory's Advance Photon Source, the detector achieved a 60 ns gating time and 700 eV full width at half-maximum energy resolution in agreement with design parameters. Each pixel of the PAD holds two independent digital counters, and the discriminator for X-ray energy features both an upper and lower threshold to window the energy of interest discarding unwanted background. This smart-pixel technology allows energy and time resolution to be set and optimized in software. It is found that the detector linearity follows an isolated dead-time model, implying that megahertz count rates should be possible in each pixel. Measurement of the line and point spread functions showed negligible spatial blurring. When combined with the timing structure of the synchrotron storage ring, it is demonstrated that the area detector can perform both picosecond time-resolved X-ray diffraction and fluorescence spectroscopy measurements.

  19. High Dynamic Range Pixel Array Detector for Scanning Transmission Electron Microscopy.

    Science.gov (United States)

    Tate, Mark W; Purohit, Prafull; Chamberlain, Darol; Nguyen, Kayla X; Hovden, Robert; Chang, Celesta S; Deb, Pratiti; Turgut, Emrah; Heron, John T; Schlom, Darrell G; Ralph, Daniel C; Fuchs, Gregory D; Shanks, Katherine S; Philipp, Hugh T; Muller, David A; Gruner, Sol M

    2016-02-01

    We describe a hybrid pixel array detector (electron microscope pixel array detector, or EMPAD) adapted for use in electron microscope applications, especially as a universal detector for scanning transmission electron microscopy. The 128×128 pixel detector consists of a 500 µm thick silicon diode array bump-bonded pixel-by-pixel to an application-specific integrated circuit. The in-pixel circuitry provides a 1,000,000:1 dynamic range within a single frame, allowing the direct electron beam to be imaged while still maintaining single electron sensitivity. A 1.1 kHz framing rate enables rapid data collection and minimizes sample drift distortions while scanning. By capturing the entire unsaturated diffraction pattern in scanning mode, one can simultaneously capture bright field, dark field, and phase contrast information, as well as being able to analyze the full scattering distribution, allowing true center of mass imaging. The scattering is recorded on an absolute scale, so that information such as local sample thickness can be directly determined. This paper describes the detector architecture, data acquisition system, and preliminary results from experiments with 80-200 keV electron beams.

  20. The Dosepix detector—an energy-resolving photon-counting pixel detector for spectrometric measurements

    CERN Document Server

    Zang, A; Ballabriga, R; Bisello, F; Campbell, M; Celi, J C; Fauler, A; Fiederle, M; Jensch, M; Kochanski, N; Llopart, X; Michel, N; Mollenhauer, U; Ritter, I; Tennert, F; Wölfel, S; Wong, W; Michel, T

    2015-01-01

    The Dosepix detector is a hybrid photon-counting pixel detector based on ideas of the Medipix and Timepix detector family. 1 mm thick cadmium telluride and 300 μm thick silicon were used as sensor material. The pixel matrix of the Dosepix consists of 16 x 16 square pixels with 12 rows of (200 μm)2 and 4 rows of (55 μm)2 sensitive area for the silicon sensor layer and 16 rows of pixels with 220 μm pixel pitch for CdTe. Besides digital energy integration and photon-counting mode, a novel concept of energy binning is included in the pixel electronics, allowing energy-resolved measurements in 16 energy bins within one acquisition. The possibilities of this detector concept range from applications in personal dosimetry and energy-resolved imaging to quality assurance of medical X-ray sources by analysis of the emitted photon spectrum. In this contribution the Dosepix detector, its response to X-rays as well as spectrum measurements with Si and CdTe sensor layer are presented. Furthermore, a first evaluation wa...

  1. Thin n-in-p planar pixel modules for the ATLAS upgrade at HL-LHC

    CERN Document Server

    INSPIRE-00517212; Breuer, J.; La Rosa, A.; Macchiolo, A.; Nisius, R.; Terzo, S.

    2016-01-01

    The ATLAS experiment will undergo a major upgrade of the tracker system in view of the high luminosity phase of the LHC (HL-LHC) foreseen to start around 2025. Thin planar pixel modules are promising candidates to instrument the new pixel system, thanks to the reduced contribution to the material budget and their high charge collection efficiency after irradiation. New designs of the pixel cells, with an optimized biasing structure, have been implemented in n-in-p planar pixel productions with sensor thicknesses of 270 um. Using beam tests, the gain in hit efficiency is investigated as a function of the received irradiation fluence. The outlook for future thin planar pixel sensor productions will be discussed, with a focus on thin sensors with a thickness of 100 and 150 um and a novel design with the optimized biasing structure and small pixel cells (50 um x 50 um and 25 um x 100 um). These dimensions are foreseen for the new ATLAS read-out chip in 65 nm CMOS technology and the fine segmentation will represen...

  2. Edge pixel response studies of edgeless silicon sensor technology for pixellated imaging detectors

    Science.gov (United States)

    Maneuski, D.; Bates, R.; Blue, A.; Buttar, C.; Doonan, K.; Eklund, L.; Gimenez, E. N.; Hynds, D.; Kachkanov, S.; Kalliopuska, J.; McMullen, T.; O'Shea, V.; Tartoni, N.; Plackett, R.; Vahanen, S.; Wraight, K.

    2015-03-01

    Silicon sensor technologies with reduced dead area at the sensor's perimeter are under development at a number of institutes. Several fabrication methods for sensors which are sensitive close to the physical edge of the device are under investigation utilising techniques such as active-edges, passivated edges and current-terminating rings. Such technologies offer the goal of a seamlessly tiled detection surface with minimum dead space between the individual modules. In order to quantify the performance of different geometries and different bulk and implant types, characterisation of several sensors fabricated using active-edge technology were performed at the B16 beam line of the Diamond Light Source. The sensors were fabricated by VTT and bump-bonded to Timepix ROICs. They were 100 and 200 μ m thick sensors, with the last pixel-to-edge distance of either 50 or 100 μ m. The sensors were fabricated as either n-on-n or n-on-p type devices. Using 15 keV monochromatic X-rays with a beam spot of 2.5 μ m, the performance at the outer edge and corners pixels of the sensors was evaluated at three bias voltages. The results indicate a significant change in the charge collection properties between the edge and 5th (up to 275 μ m) from edge pixel for the 200 μ m thick n-on-n sensor. The edge pixel performance of the 100 μ m thick n-on-p sensors is affected only for the last two pixels (up to 110 μ m) subject to biasing conditions. Imaging characteristics of all sensor types investigated are stable over time and the non-uniformities can be minimised by flat-field corrections. The results from the synchrotron tests combined with lab measurements are presented along with an explanation of the observed effects.

  3. Silicon Strip Detectors for the ATLAS HL-LHC Upgrade

    CERN Document Server

    Miñano, M; The ATLAS collaboration

    2011-01-01

    While the Large Hadron Collider (LHC) at CERN is continuing to deliver an ever-increasing luminosity to the experiments, plans for an upgraded machine called High Luminosity LHC (HL-LHC) are progressing. The upgrade is foreseen to increase the LHC design luminosity up to 5 x 1034 cm-2 s-1. The ATLAS experiment will need to build a new tracker for HL operation, which would cope with the increase in pile-up backgrounds at the higher luminosity. A new generation of extremely radiation hard silicon detectors is being designed. Silicon sensors with sufficient radiation hardness are the subject of an international R&D programme, working on pixel and strip sensors. The efforts presented here concentrate on the innermost strip layers. We have developed a large number of prototype planar detectors produced on p-type wafers in a number of different designs. The irradiated sensors were subsequently tested in order to study the radiation-induced degradation, and determine their performance after irradiation of up to ...

  4. Preliminary test of an imaging probe for nuclear medicine using hybrid pixel detectors

    CERN Document Server

    Bertolucci, Ennio; Mettivier, G; Montesi, M C; Russo, P

    2002-01-01

    We are investigating the feasibility of an intraoperative imaging probe for lymphoscintigraphy with Tc-99m tracer, for sentinel node radioguided surgery, using the Medipix series of hybrid detectors coupled to a collimator. These detectors are pixelated semiconductor detectors bump-bonded to the Medipix1 photon counting read-out chip (64x64 pixel, 170 mu m pitch) or to the Medipix2 chip (256x256 pixel, 55 mu m pitch), developed by the European Medipix collaboration. The pixel detector we plan to use in the final version of the probe is a semi-insulating GaAs detector or a 1-2 mm thick CdZnTe detector. For the preliminary tests presented here, we used 300-mu m thick silicon detectors, hybridized via bump-bonding to the Medipix1 chip. We used a tungsten parallel-hole collimator (7 mm thick, matrix array of 64x64 100 mu m circular holes with 170 mu m pitch), and a 22, 60 and 122 keV point-like (1 mm diameter) radioactive sources, placed at various distances from the detector. These tests were conducted in order ...

  5. Design of analog-to-digital converters for energy sensitive hybrid pixel detectors

    NARCIS (Netherlands)

    San Segundo Bello, David; Nauta, Bram; Visschers, Jan

    2001-01-01

    An important feature of hybrid semiconductor pixel detectors is the fact that detector and readout electronics are manufactured separately, allowing the use of industrial state-of-the-art CMOS processes to manufacture the readout electronics. As the feature size of these processes decreases, faster

  6. Evaluation of Compton gamma camera prototype based on pixelated CdTe detectors

    OpenAIRE

    Y Calderón; Chmeissani, M.; Kolstein, M.; De Lorenzo, G.

    2014-01-01

    A proposed Compton camera prototype based on pixelated CdTe is simulated and evaluated in order to establish its feasibility and expected performance in real laboratory tests. The system is based on module units containing a 2×4 array of square CdTe detectors of 10×10 mm2 area and 2 mm thickness. The detectors are pixelated and stacked forming a 3D detector with voxel sizes of 2 × 1 × 2 mm3. The camera performance is simulated with Geant4-based Architecture for Medicine-Oriented Simulations(G...

  7. Prospects and Results from the AFP Detector in ATLAS

    CERN Document Server

    Gach, Grzegorz; The ATLAS collaboration

    2016-01-01

    Status of the AFP project in the ATLAS experiment is given. In 2016 one arm of the AFP detector was installed and first data have been taken. In parallel with integration of the AFP subdetector into the ATLAS TDAQ nad DCS, beam tests and preparations for the installation of the 2nd arm are performed.

  8. Searching for exotic physics with the ATLAS detector

    CERN Document Server

    Delsart, Pierre-Antoine; The ATLAS collaboration

    2017-01-01

    Many theories beyond the Standard Model predict new phenomena accessible by the LHC. Searches for new physics models are performed using the ATLAS experiment at the LHC. The results reported here use the pp collision data sample collected in 2015 and 2016 by the ATLAS detector at the LHC with a centre-of-mass energy of 13 TeV.

  9. Prospects and Results from the AFP Detector in ATLAS

    CERN Document Server

    Gach, Grzegorz; The ATLAS collaboration

    2017-01-01

    In 2016 one arm of the AFP detector was installed and first data have been taken. In parallel with integration of the AFP subdetector into the ATLAS TDAQ and DCS systems, beam tests and preparations for the installation of the 2$^{\\textrm{nd}}$ arm are performed. In this report, a status of the AFP project in the ATLAS experiment is discussed.

  10. DEPFET active pixel detectors for a future linear $e^+e^-$ collider

    CERN Document Server

    Alonso, O; Dieguez, A; Dingfelder, J; Hemperek, T; Kishishita, T; Kleinohl, T; Koch, M; Krueger, H; Lemarenko, M; Luetticke, F; Marinas, C; Schnell, M; Wermes, N; Campbell, A; Ferber, T; Kleinwort, C; Niebuhr, C; Soloviev, Y; Steder, M; Volkenborn, R; Yaschenko, S; Fischer, P; Kreidl, C; Peric, I; Knopf, J; Ritzert, M; Curras, E; Lopez-Virto, A; Moya, D; Vila, I; Boronat, M; Esperante, D; Fuster, J; Garcia Garcia, I; Lacasta, C; Oyanguren, A; Ruiz, P; Timon, G; Vos, M; Gessler, T; Kuehn, W; Lange, S; Muenchow, D; Spruck, B; Frey, A; Geisler, C; Schwenker, B; Wilk, F; Barvich, T; Heck, M; Heindl, S; Lutz, O; Mueller, Th; Pulvermacher, C; Simonis, H.J; Weiler, T; Krausser, T; Lipsky, O; Rummel, S; Schieck, J; Schlueter, T; Ackermann, K; Andricek, L; Chekelian, V; Chobanova, V; Dalseno, J; Kiesling, C; Koffmane, C; Gioi, L.Li; Moll, A; Moser, H.G; Mueller, F; Nedelkovska, E; Ninkovic, J; Petrovics, S; Prothmann, K; Richter, R; Ritter, A; Ritter, M; Simon, F; Vanhoefer, P; Wassatsch, A; Dolezal, Z; Drasal, Z; Kodys, P; Kvasnicka, P; Scheirich, J

    2013-01-01

    The DEPFET collaboration develops highly granular, ultra-transparent active pixel detectors for high-performance vertex reconstruction at future collider experiments. The characterization of detector prototypes has proven that the key principle, the integration of a first amplification stage in a detector-grade sensor material, can provide a comfortable signal to noise ratio of over 40 for a sensor thickness of 50-75 $\\mathrm{\\mathbf{\\mu m}}$. ASICs have been designed and produced to operate a DEPFET pixel detector with the required read-out speed. A complete detector concept is being developed, including solutions for mechanical support, cooling and services. In this paper the status of DEPFET R & D project is reviewed in the light of the requirements of the vertex detector at a future linear $\\mathbf{e^+ e^-}$ collider.

  11. Calibration of the CMS Pixel Detector at the Large Hadron Collider

    CERN Document Server

    Vami, Tamas Almos

    2014-01-01

    The Compact Muon Solenoid (CMS) detector is one of two general-purpose detectors that reconstruct the products of high energy particle interactions at the Large Hadron Collider (LHC) at CERN. The silicon pixel detector is the innermost component of the CMS tracking system. It determines the trajectories of charged particles originating from the interaction region in three points with high resolution enabling precise momentum and impact parameter measurements in the tracker. The pixel detector is exposed to intense ionizing radiation generated by particle collisions in the LHC. This irradiation could result in temporary or permanent malfunctions of the sensors and could decrease the efficiency of the detector. We have developed procedures in order to correct for these effects. In this paper, we present the types of malfunctions and the offline calibration procedures. We will also show the efficiency and the resolution of the detector in 2012.

  12. Calibration of the CMS Pixel Detector at the Large Hadron Collider

    CERN Document Server

    Vami, Tamas Almos

    2015-01-01

    The Compact Muon Solenoid (CMS) detector is one of two general-purpose detectors that reconstruct the products of high energy particle interactions at the Large Hadron Collider (LHC) at CERN. The silicon pixel detector is the innermost component of the CMS tracking system. It determines the trajectories of charged particles originating from the interaction region in three points with high resolution enabling precise momentum and impact parameter measurements in the tracker. The pixel detector is exposed to intense ionizing radiation generated by particle collisions in the LHC. This irradiation could result in temporary or permanent malfunctions of the sensors and could decrease the efficiency of the detector. We have developed procedures in order to correct for these effects. In this paper, we present the types of malfunctions and the offline calibration procedures. We will also show the efficiency and the resolution of the detector in 2012.

  13. Primary Numbers Database for ATLAS Detector Description Parameters

    CERN Document Server

    Vaniachine, A; Malon, D; Nevski, P; Wenaus, T

    2003-01-01

    We present the design and the status of the database for detector description parameters in ATLAS experiment. The ATLAS Primary Numbers are the parameters defining the detector geometry and digitization in simulations, as well as certain reconstruction parameters. Since the detailed ATLAS detector description needs more than 10,000 such parameters, a preferred solution is to have a single verified source for all these data. The database stores the data dictionary for each parameter collection object, providing schema evolution support for object-based retrieval of parameters. The same Primary Numbers are served to many different clients accessing the database: the ATLAS software framework Athena, the Geant3 heritage framework Atlsim, the Geant4 developers framework FADS/Goofy, the generator of XML output for detector description, and several end-user clients for interactive data navigation, including web-based browsers and ROOT. The choice of the MySQL database product for the implementation provides addition...

  14. Interconnect and bonding techniques for pixelated X-ray and gamma-ray detectors

    Science.gov (United States)

    Schneider, A.; Veale, M. C.; Duarte, D. D.; Bell, S. J.; Wilson, M. D.; Lipp, J. D.; Seller, P.

    2015-02-01

    In the last decade, the Detector Development Group at the Technology Department of the Science and Technology Facilities Council (STFC), U.K., established a variety of fabrication and bonding techniques to build pixelated X-ray and γ-ray detector systems such as the spectroscopic X-ray imaging detector HEXITEC [1]. The fabrication and bonding of such devices comprises a range of processes including material surface preparation, photolithography, stencil printing, flip-chip and wire bonding of detectors to application-specific integrated circuits (ASIC). This paper presents interconnect and bonding techniques used in the fabrication chain for pixelated detectors assembled at STFC. For this purpose, detector dies (~ 20× 20 mm2) of high quality, single crystal semiconductors, such as cadmium zinc telluride (CZT) are cut to the required thickness (up to 5mm). The die surfaces are lapped and polished to a mirror-finish and then individually processed by electroless gold deposition combined with photolithography to form 74× 74 arrays of 200 μ m × 200 μ m pixels with 250 μ m pitch. Owing to a lack of availability of CZT wafers, lithography is commonly carried out on individual detector dies which represents a significant technical challenge as the edge of the pixel array and the surrounding guard band lies close to the physical edge of the crystal. Further, such detector dies are flip-chip bonded to readout ASIC using low-temperature curing silver-loaded epoxy so that the stress between the bonded detector die and the ASIC is minimized. In addition, this reduces crystalline modifications of the detector die that occur at temperature greater than 150\\r{ }C and have adverse effects on the detector performance. To allow smaller pitch detectors to be bonded, STFC has also developed a compression cold-weld indium bump bonding technique utilising bumps formed by a photolithographic lift-off technique.

  15. Detector Control System for the AFP detector in ATLAS experiment at CERN

    CERN Document Server

    Banas, Elzbieta; The ATLAS collaboration

    2017-01-01

    The ATLAS Forward Proton (AFP) detector project consists of two forward detectors located at 205 m and 217 m on either side of the ATLAS experiment. The aim is to measure the momenta and angles of diffractively scattered protons. In 2016, two detector stations on one side of the ATLAS interaction point were installed and commissioned. The detector infrastructure and necessary services were installed and are supervised by the Detector Control System (DCS), which is responsible for the coherent and safe operation of the detector. A large variety of used equipment represents a considerable challenge for the AFP DCS design. Industrial Supervisory Control and Data Acquisition (SCADA) product Siemens WinCCOA, together with the CERN Joint Control Project (JCOP) framework and standard industrial and custom developed server applications and protocols are used for reading, processing, monitoring and archiving of the detector parameters. Graphical user interfaces allow for overall detector operation and visualization of...

  16. Signal modeling of charge sharing effect in simple pixelated CdZnTe detector

    Science.gov (United States)

    Kim, Jae Cheon; Kaye, William R.; He, Zhong

    2014-05-01

    In order to study the energy resolution degradation in 3D position-sensitive pixelated CdZnTe (CZT) detectors, a detailed detector system modeling package has been developed and used to analyze the detector performance. A 20 × 20 × 15 mm3 CZT crystal with an 11 × 11 simple-pixel anode array and a 1.72 mm pixel pitch was modeled. The VAS UM/TAT4 Application Specific Integrated Circuitry (ASIC) was used for signal read-out. Components of the simulation package include gamma-ray interactions with the CZT crystal, charge induction, electronic noise, pulse shaping, and ASIC triggering procedures. The charge induction model considers charge drift, trapping, diffusion, and sharing between pixels. This system model is used to determine the effects of electron cloud sharing, weighting potential non-uniformity, and weighting potential cross-talk which produce non-uniform signal responses for different gamma-ray interaction positions and ultimately degrade energy resolution. The effect of the decreased weighting potential underneath the gap between pixels on the total pulse amplitude of events has been studied. The transient signals induced by electron clouds collected near the gap between pixels may generate false signals, and the measured amplitude can be even greater than the photopeak. As the number of pixels that collect charge increases, the probability of side-neighbor events due to charge sharing significantly increases. If side-neighbor events are not corrected appropriately, the energy resolution of pixelated CZT detectors in multiple-pixel events degrades rapidly.

  17. Signal modeling of charge sharing effect in simple pixelated CdZnTe detector

    Energy Technology Data Exchange (ETDEWEB)

    Kim, Jae C.; Kaye, William R.; He, Zhong [University of Michigan, Ann Arbor, MI (United States)

    2014-05-15

    In order to study the energy resolution degradation in 3D position-sensitive pixelated CdZnTe (CZT) detectors, a detailed detector system modeling package has been developed and used to analyze the detector performance. A 20 x 20 x 15 mm{sup 3} CZT crystal with an 11 x 11 simple-pixel anode array and a 1.72 mm pixel pitch was modeled. The VAS UM/TAT4 Application Specific Integrated Circuitry (ASIC) was used for signal read-out. Components of the simulation package include gamma-ray interactions with the CZT crystal, charge induction, electronic noise, pulse shaping, and ASIC triggering procedures. The charge induction model considers charge drift, trapping, diffusion, and sharing between pixels. This system model is used to determine the effects of electron cloud sharing, weighting potential non-uniformity, and weighting potential cross-talk which produce non-uniform signal responses for different gamma-ray interaction positions and ultimately degrade energy resolution. The effect of the decreased weighting potential underneath the gap between pixels on the total pulse amplitude of events has been studied. The transient signals induced by electron clouds collected near the gap between pixels may generate false signals, and the measured amplitude can be even greater than the photopeak. As the number of pixels that collect charge increases, the probability of side-neighbor events due to charge sharing significantly increases. If side-neighbor events are not corrected appropriately, the energy resolution of pixelated CZT detectors in multiple-pixel events degrades rapidly.

  18. High Dynamic Range Pixel Array Detector for Scanning Transmission Electron Microscopy

    CERN Document Server

    Tate, Mark W; Chamberlain, Darol; Nguyen, Kayla X; Hovden, Robert M; Chang, Celesta S; Deb, Pratiti; Turgut, Emrah; Heron, John T; Schlom, Darrell G; Ralph, Daniel C; Fuchs, Gregory D; Shanks, Katherine S; Philipp, Hugh T; Muller, David A; Gruner, Sol M

    2015-01-01

    We describe a hybrid pixel array detector (EMPAD - electron microscope pixel array detector) adapted for use in electron microscope applications, especially as a universal detector for scanning transmission electron microscopy. The 128 x 128 pixel detector consists of a 500 um thick silicon diode array bump-bonded pixel-by-pixel to an application-specific integrated circuit (ASIC). The in-pixel circuitry provides a 1,000,000:1 dynamic range within a single frame, allowing the direct electron beam to be imaged while still maintaining single electron sensitivity. A 1.1 kHz framing rate enables rapid data collection and minimizes sample drift distortions while scanning. By capturing the entire unsaturated diffraction pattern in scanning mode, one can simultaneously capture bright field, dark field, and phase contrast information, as well as being able to analyze the full scattering distribution, allowing true center of mass imaging. The scattering is recorded on an absolute scale, so that information such as loc...

  19. Data acquisition at the front-end of the Mu3e pixel detector

    Energy Technology Data Exchange (ETDEWEB)

    Perrevoort, Ann-Kathrin [Physikalisches Institut, Universitaet Heidelberg (Germany); Collaboration: Mu3e-Collaboration

    2016-07-01

    The Mu3e experiment - searching for the lepton-flavour violating decay of the muon into three electrons at an unprecedented sensitivity of one in 10{sup 16} decays - is based on a pixel tracking detector. The sensors are High-Voltage Monolithic Active Pixel Sensors, a technology which allows for very fast and thin detectors, and thus is an ideal fit for Mu3e where the trajectories of low-momentum electrons at high rates are to be measured. The detector will consist of about 275 million pixels and will be operated at up to 10{sup 9} muon stops per second. Therefore, a fast and trigger-less data readout is required. The pixel sensors feature zero-suppressed data output via high-speed serial links. The data is then buffered and sorted by time on a FPGA on the front-end before being processed to the following readout stage. In this talk, the readout of the Mu3e pixel detector at the front-end is introduced. Furthermore, a first firmware implementation of this concept in a beam telescope consisting of the current pixel sensor prototype MuPix7 is presented.

  20. Planarity certification of ATLAS Micromegas detector panels

    Energy Technology Data Exchange (ETDEWEB)

    Mueller, Ralph; Biebel, Otmar; Bortfeldt, Jonathan; Flierl, Bernhard; Hertenberger, Ralf; Loesel, Philipp; Herrmann, Maximilian [LMU Muenchen (Germany); Zibell, Andre [JMU Wuerzburg (Germany)

    2016-07-01

    During the second long LHC shutdown, 2019/20, the precision tracking detectors of the ATLAS muon spectrometer in the inner end caps will be replaced using Micromegas, a planar gas-detector technology. Modules of 2 m{sup 2} area are built in quadruplets from five precisely planar sandwich panels that define the anodes and the cathodes of the four active detector planes. A panel is composed of three consecutive layers FR4 - aluminum honeycomb - FR4. Single plane spatial particle resolution below 100 μm is achievable when the deviations from planarity of the strip-anodes do not exceed 80 μm RMS over the whole active area and the parallelism of the readout strips is within 30 μm. In order to measure the dimensional accuracy of each panel, laser distance sensors combined with a coordinate measurement system have been investigated. The sensor requirements to measure the planarity of the panels are a resolution of 0.3 μm and a beam spot diameter of ∼20 μm, well below 100 μ m the size of the smallest structures. We report on achieved planarities of the panels and the performance of the laser sensor system. A panel with an RMS better than 30 μm was build and the evolution of its planarity due to humidity and temperature effects is shown.

  1. High-speed X-ray imaging pixel array detector for synchrotron bunch isolation

    Energy Technology Data Exchange (ETDEWEB)

    Philipp, Hugh T., E-mail: htp2@cornell.edu; Tate, Mark W.; Purohit, Prafull; Shanks, Katherine S.; Weiss, Joel T. [Cornell University, Ithaca, NY 14853 (United States); Gruner, Sol M. [Cornell University, Ithaca, NY 14853 (United States); Cornell University, Ithaca, NY 14853 (United States)

    2016-01-28

    A high-speed pixel array detector for time-resolved X-ray imaging at synchrotrons has been developed. The ability to isolate single synchrotron bunches makes it ideal for time-resolved dynamical studies. A wide-dynamic-range imaging X-ray detector designed for recording successive frames at rates up to 10 MHz is described. X-ray imaging with frame rates of up to 6.5 MHz have been experimentally verified. The pixel design allows for up to 8–12 frames to be stored internally at high speed before readout, which occurs at a 1 kHz frame rate. An additional mode of operation allows the integration capacitors to be re-addressed repeatedly before readout which can enhance the signal-to-noise ratio of cyclical processes. This detector, along with modern storage ring sources which provide short (10–100 ps) and intense X-ray pulses at megahertz rates, opens new avenues for the study of rapid structural changes in materials. The detector consists of hybridized modules, each of which is comprised of a 500 µm-thick silicon X-ray sensor solder bump-bonded, pixel by pixel, to an application-specific integrated circuit. The format of each module is 128 × 128 pixels with a pixel pitch of 150 µm. In the prototype detector described here, the three-side buttable modules are tiled in a 3 × 2 array with a full format of 256 × 384 pixels. The characteristics, operation, testing and application of the detector are detailed.

  2. Heavy Ion Physics with the ATLAS Detector

    CERN Multimedia

    Takai, H

    2003-01-01

    I guess the first thing that comes to people's mind is why is an experiment such as ATLAS interested in heavy ion physics. What is heavy ion physics anyway? The term heavy ion physics refers to the study of collisions between large nuclei such as lead, atomic number 208. But why would someone collide something as large and extensive as lead nuclei? When two nuclei collide there is a unique opportunity to study QCD at extreme energy densities. This said why do we think ATLAS is a good detector to study this particular physics? Among many of the simultaneous collisions that takes place when two nuclei encouter, hard scattering takes place. The unique situation now is that before hadronization partons from hard scattering may feel the surrounding media serving as an ideal probe for the matter formed in these collisions. As a consequence of this, jets may be quenched and their properties, e.g. fragmentation function or cone radius, modified when compared to proton-proton collisions. This is precisely where ATL...

  3. FE-I4, the new ATLAS pixel chip for upgraded LHC luminosities

    Energy Technology Data Exchange (ETDEWEB)

    Arutinov, David; Barbero, Marlon; Gronewald, Markus; Hemperek, Tomasz; Karagounis, Michael; Krueger, Hans; Kruth, Andre; Wermes, Norbert [Physikalisches Institut, Universitaet Bonn, Nussallee 12, D-53115 Bonn (Germany)

    2010-07-01

    The new ATLAS pixel chip FE-I4 is being developed for use in upgraded luminosity environments, in the framework of the Insertable B-Layer (IBL) project and the outer pixel layers of Super-LHC. FE-I4 is designed in a 130 nm CMOS technology and is based on an array of 80 x 336 pixels, each 50 x x250 {mu}m2 and consisting of analog and digital sections. The analog pixel section is designed for low power consumption. The digital architecture is based on a 4 pixel unit called region, which allows for a power-efficient, low recording inefficiency design, and provides a handle to the problem of timewalk. The chip periphery contains a digital control block, a command decoder, powering blocks, a data reformatting unit, an 8b10b coder and a clock multiplier unit, which handles data transmission up to 160 Mb/s for the IBL. Increased power consumption in the inner layers of ATLAS translates into more material for cooling and power routing, which degrades the tracking and the b-tagging quality. As a consequence the FE-I4 collaboration places severe constraints on the power consumption of all blocks. First full scale FE-I4 submission will occur beginning 2010.

  4. Leakage current measurements of a pixelated polycrystalline CVD diamond detector

    OpenAIRE

    Zain, R.M.; Maneuski, D.; O'Shea, V.; Bates, R.; Blue, A.; Cunnigham, L.; Stehl, C.; Berderman, E.; Rahim, R. A.

    2013-01-01

    Diamond has several desirable features when used as a material for radiation detection. With the invention of synthetic growth techniques, it has become feasible to look at developing diamond radiation detectors with reasonable surface areas. Polycrystalline diamond has been grown using a chemical vapour deposition (CVD) technique by the University of Augsburg and detector structures fabricated at the James Watt Nanofabrication Centre (JWNC) in the University of Glasgow in order to produce pi...

  5. The New ATLAS/LUCID detector

    CERN Document Server

    Bruschi, Marco; The ATLAS collaboration

    2015-01-01

    The new ATLAS luminosity monitor has many innovative aspects implemented. Its photomultipliers tubes are used as detector elements by using the Cherenkov light produced by charged particles above threshold crossing the quartz windows. The analog shaping of the readout chain has been improved, in order to cope with the 25 ns bunch spacing of the LHC machine. The main readout card is a quite general processing unit based on 12 bit - 500 MS/s Flash ADC and on FPGAs, delivering the processed data to 1.3 Gb/s optical links. The talk will describe all these aspects and will outline future perspectives of the card for next generation high energy physics experiments.

  6. The new ATLAS/LUCID detector

    CERN Document Server

    Bruschi, Marco; The ATLAS collaboration

    2015-01-01

    The new ATLAS luminosity monitor has many innovative aspects implemented. Its photomultipliers tubes are used as detector elements by using the Cherenkov light produced by charged particles above threshold crossing the quartz windows. The analog shaping of the readout chain has been improved, in order to cope with the 25 ns bunch spacing of the LHC machine. The main readout card is a quite general processing unit based on 12 bit - 320 MS/s Flash ADC and on FPGAs, delivering the processed data to 1.3 Gb/s optical links. The article will describe all these aspects and will outline future perspectives of the card for next generation high energy physics experiments.

  7. The new ATLAS/LUCID detector

    Energy Technology Data Exchange (ETDEWEB)

    Bruschi, Marco [INFN, Bologna, (Italy)

    2015-07-01

    The new ATLAS luminosity monitor has many innovative aspects implemented. Its photomultipliers tubes are used as detector elements by using the Cherenkov light produced by charged particles above threshold crossing the quartz windows. The analog shaping of the readout chain has been improved, in order to cope with the 25 ns bunch spacing of the LHC machine. The main readout card is a quite general processing unit based on 12 bit - 500 MS/s Flash ADC and on FPGAs, delivering the processed data to 1.3 Gb/s optical links. The article will describe all these aspects and will outline future perspectives of the card for next generation high energy physics experiments. (authors)

  8. Performance Optimization of the ATLAS Detector Simulation

    CERN Document Server

    AUTHOR|(CDS)2091018

    In the thesis at hand the current performance of the ATLAS detector simulation, part of the Athena framework, is analyzed and possible optimizations are examined. For this purpose the event based sampling profiler VTune Amplifier by Intel is utilized. As the most important metric to measure improvements, the total execution time of the simulation of $t\\bar{t}$ events is also considered. All efforts are focused on structural changes, which do not influence the simulation output and can be attributed to CPU specific issues, especially front end stalls and vectorization. The most promising change is the activation of profile guided optimization for Geant4, which is a critical external dependency of the simulation. Profile guided optimization gives an average improvement of $8.9\\%$ and $10.0\\%$ for the two considered cases at the cost of one additional compilation (instrumented binaries) and execution (training to obtain profiling data) at build time.

  9. Development of DC-DC converters for the upgrade of the CMS pixel detector

    Energy Technology Data Exchange (ETDEWEB)

    Feld, Lutz; Karpinski, Waclaw; Klein, Katja; Sammet, Jan; Wlochal, Michael [RWTH Aachen University (Germany)

    2012-07-01

    Around 2017, the pixel detector of the CMS experiment at LHC will be upgraded. The amount of current that has to be provided to the front-end electronics is expected to increase by a factor of two. Since the space available for cables is limited, this would imply unacceptable power losses in the available supply cables. Therefore it is foreseen to place DC-DC converters close to the front-end electronics, allowing to provide the power at higher voltages and thereby to facilitate the supply of the required currents with the present cable plant. The talk introduces the foreseen powering scheme of the pixel upgrade and summarizes the results of system test measurements with CMS pixel sensor modules, radiation tolerant DC-DC converters and the full power supply chain of the pixel detector. In addition, measurements of the converter efficiency and performance before, after and during thermal cycling are presented.

  10. Performance of the ATLAS Detector using First Collision Data

    CERN Document Server

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    2010-01-01

    More than half a million minimum-bias events of LHC collision data were collected by the ATLAS experiment in December 2009 at centre-of-mass energies of 0.9 TeV and 2.36 TeV. This paper reports on studies of the initial performance of the ATLAS detector from these data. Comparisons between data and Monte Carlo predictions are shown for distributions of several track- and calorimeter-based quantities. The good performance of the ATLAS detector in these first data gives confidence for successful running at higher energies.

  11. Performance of the ATLAS detector using first collision data

    Science.gov (United States)

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V.; Soluk, R.; Sondericker, J.; Sopko, V.; Sopko, B.; Sorbi, M.; Sosebee, M.; Soukharev, A.; Spagnolo, S.; Spanò, F.; Speckmayer, P.; Spencer, E.; Spighi, R.; Spigo, G.; Spila, F.; Spiriti, E.; Spiwoks, R.; Spogli, L.; Spousta, M.; Spreitzer, T.; Spurlock, B.; Denis, R. D. St.; Stahl, T.; Stahlman, J.; Stamen, R.; Stancu, S. N.; Stanecka, E.; Stanek, R. W.; Stanescu, C.; Stapnes, S.; Starchenko, E. A.; Stark, J.; Staroba, P.; Starovoitov, P.; Stastny, J.; Staude, A.; Stavina, P.; Stavropoulos, G.; Steele, G.; Stefanidis, E.; Steinbach, P.; Steinberg, P.; Stekl, I.; Stelzer, B.; Stelzer, H. J.; Stelzer-Chilton, O.; Stenzel, H.; Stevenson, K.; Stewart, G. A.; Stewart, T. D.; Stiller, W.; Stockmanns, T.; Stockton, M. C.; Stodulski, M.; Stoerig, K.; Stoicea, G.; Stonjek, S.; Strachota, P.; Stradling, A. R.; Straessner, A.; Strandberg, J.; Strandberg, S.; Strandlie, A.; Strang, M.; Strauss, M.; Strizenec, P.; Ströhmer, R.; Strom, D. M.; Strong, J. A.; Stroynowski, R.; Strube, J.; Stugu, B.; Stumer, I.; Sturm, P.; Soh, D. A.; Su, D.; Subramania, S.; Sugaya, Y.; Sugimoto, T.; Suhr, C.; Suita, K.; Suk, M.; Sulin, V. V.; Sultansoy, S.; Sumida, T.; Sun, X. H.; Sundermann, J. E.; Suruliz, K.; Sushkov, S.; Susinno, G.; Sutton, M. R.; Suzuki, T.; Suzuki, Y.; Sviridov, Yu. M.; Sykora, I.; Sykora, T.; Szczygiel, R. R.; Szeless, B.; Szymocha, T.; Sánchez, J.; Ta, D.; Taboada Gameiro, S.; Tackmann, K.; Taffard, A.; Tafirout, R.; Taga, A.; Takahashi, Y.; Takai, H.; Takashima, R.; Takeda, H.; Takeshita, T.; Talby, M.; Talyshev, A.; Tamsett, M. C.; Tanaka, J.; Tanaka, R.; Tanaka, S.; Tanaka, S.; Tanaka, Y.; Tani, K.; Tappern, G. P.; Tapprogge, S.; Tardif, D.; Tarem, S.; Tarrade, F.; Tartarelli, G. F.; Tas, P.; Tasevsky, M.; Tassi, E.; Tatarkhanov, M.; Tayalati, Y.; Taylor, C.; Taylor, F. E.; Taylor, G.; Taylor, G. N.; Taylor, R. P.; Taylor, W.; Teixeira Dias Castanheira, M.; Teixeira-Dias, P.; Ten Kate, H.; Teng, P. K.; Tennenbaum-Katan, Y. D.; Terada, S.; Terashi, K.; Terron, J.; Terwort, M.; Testa, M.; Teuscher, R. J.; Tevlin, C. M.; Thadome, J.; Therhaag, J.; Thioye, M.; Thoma, S.; Thomas, J. P.; Thompson, E. N.; Thompson, P. D.; Thompson, P. D.; Thompson, R. J.; Thompson, A. S.; Thomson, E.; Thun, R. P.; Tic, T.; Tikhomirov, V. O.; Tikhonov, Y. A.; Timmermans, C. J. W. P.; Tipton, P.; Tique Aires Viegas, F. J.; Tisserant, S.; Tobias, J.; Toczek, B.; Todorov, T.; Todorova-Nova, S.; Toggerson, B.; Tojo, J.; Tokár, S.; Tokunaga, K.; Tokushuku, K.; Tollefson, K.; Tomasek, L.; Tomasek, M.; Tomoto, M.; Tompkins, D.; Tompkins, L.; Toms, K.; Tonazzo, A.; Tong, G.; Tonoyan, A.; Topfel, C.; Topilin, N. D.; Torchiani, I.; Torrence, E.; Torró Pastor, E.; Toth, J.; Touchard, F.; Tovey, D. R.; Trefzger, T.; Treis, J.; Tremblet, L.; Tricoli, A.; Trigger, I. M.; Trilling, G.; Trincaz-Duvoid, S.; Trinh, T. N.; Tripiana, M. F.; Triplett, N.; Trischuk, W.; Trivedi, A.; Trocmé, B.; Troncon, C.; Trzupek, A.; Tsarouchas, C.; Tseng, J. C.-L.; Tsiakiris, M.; Tsiareshka, P. V.; Tsionou, D.; Tsipolitis, G.; Tsiskaridze, V.; Tskhadadze, E. G.; Tsukerman, I. I.; Tsulaia, V.; Tsung, J.-W.; Tsuno, S.; Tsybychev, D.; Tuggle, J. M.; Turala, M.; Turecek, D.; Turk Cakir, I.; Turlay, E.; Tuts, P. M.; Twomey, M. S.; Tylmad, M.; Tyndel, M.; Typaldos, D.; Tyrvainen, H.; Tzamarioudaki, E.; Tzanakos, G.; Uchida, K.; Ueda, I.; Ueno, R.; Ugland, M.; Uhlenbrock, M.; Uhrmacher, M.; Ukegawa, F.; Unal, G.; Underwood, D. G.; Undrus, A.; Unel, G.; Unno, Y.; Urbaniec, D.; Urkovsky, E.; Urquijo, P.; Urrejola, P.; Usai, G.; Uslenghi, M.; Vacavant, L.; Vacek, V.; Vachon, B.; Vahsen, S.; Valderanis, C.; Valenta, J.; Valente, P.; Valentinetti, S.; Valkar, S.; Valladolid Gallego, E.; Vallecorsa, S.; Valls Ferrer, J. A.; van Berg, R.; van der Graaf, H.; van der Kraaij, E.; van der Poel, E.; van der Ster, D.; van Eijk, B.; van Eldik, N.; van Gemmeren, P.; van Kesteren, Z.; van Vulpen, I.; Vandelli, W.; Vandoni, G.; Vaniachine, A.; Vankov, P.; Vannucci, F.; Varela Rodriguez, F.; Vari, R.; Varnes, E. W.; Varouchas, D.; Vartapetian, A.; Varvell, K. E.; Vasilyeva, L.; Vassilakopoulos, V. I.; Vazeille, F.; Vegni, G.; Veillet, J. J.; Vellidis, C.; Veloso, F.; Veness, R.; Veneziano, S.; Ventura, A.; Ventura, D.; Ventura, S.; Venturi, M.; Venturi, N.; Vercesi, V.; Verducci, M.; Verkerke, W.; Vermeulen, J. C.; Vertogardov, L.; Vetterli, M. C.; Vichou, I.; Vickey, T.; Viehhauser, G. H. A.; Villa, M.; Villani, E. G.; Villaplana Perez, M.; Vilucchi, E.; Vincter, M. G.; Vinek, E.; Vinogradov, V. B.; Virchaux, M.; Viret, S.; Virzi, J.; Vitale, A.; Vitells, O.; Vivarelli, I.; Vives Vaque, F.; Vlachos, S.; Vlasak, M.; Vlasov, N.; Vogel, A.; Vogt, H.; Vokac, P.; Vollmer, C. F.; Volpi, M.; Volpini, G.; von der Schmitt, H.; von Loeben, J.; von Radziewski, H.; von Toerne, E.; Vorobel, V.; Vorobiev, A. P.; Vorwerk, V.; Vos, M.; Voss, K. C.; Voss, R.; Voss, T. T.; Vossebeld, J. H.; Vovenko, A. S.; Vranjes, N.; Vranjes Milosavljevic, M.; Vrba, V.; Vreeswijk, M.; Vu Anh, T.; Vuaridel, B.; Vudragovic, D.; Vuillermet, R.; Vukotic, I.; Wagner, P.; Wahlen, H.; Walbersloh, J.; Walder, J.; Walker, R.; Walkowiak, W.; Wall, R.; Walsh, S.; Wang, C.; Wang, H.; Wang, J.; Wang, J. C.; Wang, S. M.; Warburton, A.; Ward, C. P.; Warsinsky, M.; Wastie, R.; Watkins, P. M.; Watson, A. T.; Watson, M. F.; Watts, G.; Watts, S.; Waugh, A. T.; Waugh, B. M.; Webel, M.; Weber, G.; Weber, J.; Weber, M. D.; Weber, M.; Weber, M. S.; Weber, P.; Weidberg, A. R.; Weingarten, J.; Weiser, C.; Wellenstein, H.; Wellisch, H. P.; Wells, P. S.; Wen, M.; Wenaus, T.; Wendler, S.; Weng, Z.; Wengler, T.; Wenig, S.; Wermes, N.; Werner, M.; Werner, P.; Werth, M.; Werthenbach, U.; Wessels, M.; Whalen, K.; Wheeler-Ellis, S. J.; Whitaker, S. P.; White, A.; White, M. J.; White, S.; Whitehead, S. R.; Whiteson, D.; Whittington, D.; Wicek, F.; Wicke, D.; Wickens, F. J.; Wiedenmann, W.; Wielers, M.; Wienemann, P.; Wiesmann, M.; Wiglesworth, C.; Wiik, L. A. M.; Wildauer, A.; Wildt, M. A.; Wilhelm, I.; Wilkens, H. G.; Williams, E.; Williams, H. H.; Willis, W.; Willocq, S.; Wilson, J. A.; Wilson, M. G.; Wilson, A.; Wingerter-Seez, I.; Winklmeier, F.; Wittgen, M.; Woehrling, E.; Wolter, M. W.; Wolters, H.; Wosiek, B. K.; Wotschack, J.; Woudstra, M. J.; Wraight, K.; Wright, C.; Wright, D.; Wrona, B.; Wu, S. L.; Wu, X.; Wuestenfeld, J.; Wulf, E.; Wunstorf, R.; Wynne, B. M.; Xaplanteris, L.; Xella, S.; Xie, S.; Xie, Y.; Xu, D.; Xu, G.; Xu, N.; Yamada, M.; Yamamoto, A.; Yamamoto, K.; Yamamoto, S.; Yamamura, T.; Yamaoka, J.; Yamazaki, T.; Yamazaki, Y.; Yan, Z.; Yang, H.; Yang, S.; Yang, U. K.; Yang, Y.; Yang, Z.; Yao, W.-M.; Yao, Y.; Yasu, Y.; Ye, J.; Ye, S.; Yilmaz, M.; Yoosoofmiya, R.; Yorita, K.; Yoshida, R.; Young, C.; Youssef, S. P.; Yu, D.; Yu, J.; Yuan, J.; Yuan, L.; Yurkewicz, A.; Zaets, V. G.; Zaidan, R.; Zaitsev, A. M.; Zajacova, Z.; Zalite, Yo. K.; Zambrano, V.; Zanello, L.; Zarzhitsky, P.; Zaytsev, A.; Zdrazil, M.; Zeitnitz, C.; Zeller, M.; Zema, P. F.; Zemla, A.; Zendler, C.; Zenin, A. V.; Zenin, O.; Zenis, T.; Zenonos, Z.; Zenz, S.; Zerwas, D.; Zevi Della Porta, G.; Zhan, Z.; Zhang, H.; Zhang, J.; Zhang, Q.; Zhang, X.; Zhao, L.; Zhao, T.; Zhao, Z.; Zhemchugov, A.; Zheng, S.; Zhong, J.; Zhou, B.; Zhou, N.; Zhou, Y.; Zhu, C. G.; Zhu, H.; Zhu, Y.; Zhuang, X.; Zhuravlov, V.; Zilka, B.; Zimmermann, R.; Zimmermann, S.; Zimmermann, S.; Ziolkowski, M.; Zitoun, R.; Živković, L.; Zmouchko, V. V.; Zobernig, G.; Zoccoli, A.; Zolnierowski, Y.; Zsenei, A.; Zur Nedden, M.; Zutshi, V.; ATLAS Collaboration

    2010-09-01

    More than half a million minimum-bias events of LHC collision data were collected by the ATLAS experiment in December 2009 at centre-of-mass energies of 0.9 TeV and 2.36 TeV. This paper reports on studies of the initial performance of the ATLAS detector from these data. Comparisons between data and Monte Carlo predictions are shown for distributions of several track-and calorimeter-based quantities. The good performance of the ATLAS detector in these first data gives confidence for successful running at higher energies.

  12. Studies of irradiated AMS H35 CMOS detectors for the ATLAS tracker upgrade

    Science.gov (United States)

    Cavallaro, E.; Casanova, R.; Förster, F.; Grinstein, S.; Lange, J.; Kramberger, G.; Mandić, I.; Puigdengoles, C.; Terzo, S.

    2017-01-01

    Silicon detectors based on the HV-CMOS technology are being investigated as possible candidate for the outer layers of the ATLAS pixel detector for the High Luminosity LHC. In this framework the H35Demo ASIC has been produced in the 350 nm AMS technology (H35). The H35Demo chip has a large area (18.49 × 24.40 mm2) and includes four different pixel matrices and three test structures. In this paper the radiation hardness properties, in particular the evolution of the depletion region with fluence is studied using edge-TCT on test structures. Measurements on the test structures from chips with different substrate resistivity are shown for non irradiated and irradiated devices up to a cumulative fluence of 2 ṡ 1015 1 MeV neq / cm2.

  13. Studies of irradiated AMS H35 CMOS detectors for the ATLAS tracker upgrade

    CERN Document Server

    Cavallaro, Emanuele; Förster, Fabian; Grinstein, Sebastinan; Lange, Jörn; Kramberger, Gregor; Mandić, Igor; Puigdengoles, Carles; Terzo, Stefano

    2016-01-01

    Silicon detectors based on the HV-CMOS technology are being investigated as possible candidate for the outer layers of the ATLAS pixel detector for the High Luminosity LHC. In this framework the H35Demo ASIC has been produced in the 350 nm AMS technology (H35). The H35Demo chip has a large area ($18.49 \\times 24.40 \\, \\mathrm{mm^2}$) and includes four different pixel matrices and three test structures. In this paper the radiation hardness properties, in particular the evolution of the depletion region with fluence is studied using edge-TCT on test structures. Measurements on the test structures from chips with different substrate resistivity are shown for non irradiated and irradiated devices up to a cumulative fluence of $2 \\cdot 10^{15} \\, \\mathrm{1\\,MeV\\, n_{eq} / cm^{2}}$.

  14. \\title{Low-Cost Bump-Bonding Processes for High Energy Physics Pixel Detectors}

    CERN Document Server

    Caselle, Michele; Colombo, Fabio; Dierlamm, Alexander Hermann; Husemann, Ulrich; Kudella, Simon; Weber, M

    2015-01-01

    In the next generation of collider experiments detectors will be challenged by unprecedented particle fluxes. Thus large detector arrays of highly pixelated detectors with minimal dead area at reasonable costs are required. Bump-bonding of pixel detectors has been shown to be a major cost-driver. KIT is one of the production centers of the CMS barrel pixel detector for the Phase I Upgrade. In this contribution the SnPb bump-bonding process and the production yield is reported. In parallel to the production of the new CMS pixel detector, several alternatives to the expensive photolithography electroplating/electroless metal deposition technologies are developing. Recent progress and challenges faced in the development of bump-bonding technology based on gold-stud bonding by thin ($15\\,\\rm{\\mu m}$) gold wire is presented. This technique allows producing metal bumps with diameters down to $30\\,\\rm{\\mu m}$ without using photolithography processes, which are typically required to provide suitable under bu...

  15. Imaging detector development for nuclear astrophysics using pixelated CdTe

    Science.gov (United States)

    Álvarez, J. M.; Gálvez, J. L.; Hernanz, M.; Isern, J.; Llopis, M.; Lozano, M.; Pellegrini, G.; Chmeissani, M.

    2010-11-01

    The concept of focusing telescopes in the energy range of lines of astrophysical interest (i.e., of energies around 1 MeV) should allow to reach unprecedented sensitivities, essential to perform detailed studies of cosmic explosions and cosmic accelerators. Our research and development activities aim to study a detector suited for the focal plane of a γ-ray telescope mission. A CdTe/CdZnTe detector operating at room temperature, that combines high detection efficiency with good spatial and spectral resolution is being studied in recent years as a focal plane detector, with the interesting option of also operating as a Compton telescope monitor. We present the current status of the design and development of a γ-ray imaging spectrometer in the MeV range, for nuclear astrophysics, consisting of a stack of CdTe pixel detectors with increasing thicknesses. We have developed an initial prototype based on CdTe ohmic detector. The detector has 11×11 pixels, with a pixel pitch of 1 mm and a thickness of 2 mm. Each pixel is stud bonded to a fanout board and routed to an front end ASIC to measure pulse height and rise time information for each incident γ-ray photon. First measurements of a 133Ba and 241Am source are reported here.

  16. Imaging detector development for nuclear astrophysics using pixelated CdTe

    Energy Technology Data Exchange (ETDEWEB)

    Alvarez, J.M., E-mail: alvarez@ieec.uab.e [Institut de Ciencies de l' Espai (CSIC-IEEC), Campus UAB, E-08193 Barcelona (Spain); Galvez, J.L.; Hernanz, M.; Isern, J.; Llopis, M. [Institut de Ciencies de l' Espai (CSIC-IEEC), Campus UAB, E-08193 Barcelona (Spain); Lozano, M.; Pellegrini, G. [Centro Nacional de Microelectronica - IMB-CNM (CSIC), Campus UAB, E-08193 Barcelona (Spain); Chmeissani, M. [Institut de Fisica d' Altes Energies (IFAE), Campus UAB, E-08193 Barcelona (Spain)

    2010-11-01

    The concept of focusing telescopes in the energy range of lines of astrophysical interest (i.e., of energies around 1 MeV) should allow to reach unprecedented sensitivities, essential to perform detailed studies of cosmic explosions and cosmic accelerators. Our research and development activities aim to study a detector suited for the focal plane of a {gamma}-ray telescope mission. A CdTe/CdZnTe detector operating at room temperature, that combines high detection efficiency with good spatial and spectral resolution is being studied in recent years as a focal plane detector, with the interesting option of also operating as a Compton telescope monitor. We present the current status of the design and development of a {gamma}-ray imaging spectrometer in the MeV range, for nuclear astrophysics, consisting of a stack of CdTe pixel detectors with increasing thicknesses. We have developed an initial prototype based on CdTe ohmic detector. The detector has 11x11 pixels, with a pixel pitch of 1 mm and a thickness of 2 mm. Each pixel is stud bonded to a fanout board and routed to an front end ASIC to measure pulse height and rise time information for each incident {gamma}-ray photon. First measurements of a {sup 133}Ba and {sup 241}Am source are reported here.

  17. The barrel sector assembly system of the ALICE silicon pixel detector

    CERN Document Server

    Antinori, F; Cinausero, M; Dima, R; Fabris, D; Fioretto, E; Lunardon, M; Moretto, S; Pepato, Adriano; Prete, G; Scarlassara, F; Segato, G F; Soramel, F; Turrisi, R; Vannucci, L; Viesti, G

    2004-01-01

    The Silicon Pixel Detector is the inner part of the ITS tracking system of the ALICE experiment at LHC. The 240 silicon modules, hosting almost 10 million pixel cells with dimension 50 . 425 mu m /sup 2/, have to be assembled on a carbon fiber support with micrometric precision. To reach this result, a dedicated high- precision computer-controlled tooling system has been developed at the INFN Padova. The assembly system and the mounting procedures are presented. (10 refs).

  18. Geneva University: Pixel Detectors – trends and options for the future

    CERN Multimedia

    Geneva University

    2012-01-01

    GENEVA UNIVERSITY École de physique Département de physique nucléaire et corspusculaire 24, quai Ernest-Ansermet 1211 Genève 4 Tél.: (022) 379 62 73 Fax: (022) 379 69 92   Wednesday 25 April 2012 SEMINAIRE DE PHYSIQUE CORPUSCULAIRE Science III, Auditoire 1S081 30Science III, Auditoire 1S081 30 Pixel Detectors – trends and options for the future Prof. Norbert Wermes - University of Bonn  Pixel detectors have been invented in the early 90s with the advancement of micro technologies. With the advent of the LHC, big vertex detectors have demonstrated that the pixel detector type is holding many of the promises it had made before. Meanwhile new, different or just improved variants of the pixel technology are being studied for their suitability for future experiments or experiment upgrades. The talk will address the various pro's and con's comparing hybrid and monolithic pixel technologies and their su...

  19. The Phase-II ATLAS Pixel Tracker Upgrade: Layout and Mechanics

    CERN Document Server

    Sharma, Abhishek; The ATLAS collaboration

    2016-01-01

    In early 2017 a new layout will be decided for the ATLAS experiment as it undergoes an upgrade of its tracking detector during the Phase-II LHC shutdown, to better take advantage of the increased luminosity of the HL-LHC. The various layouts are described and a description of the supporting structures are presented, along with results from testing of prototypes.

  20. Gamma spectroscopic measurements using the PID350 pixelated CdTe radiation detector

    CERN Document Server

    Karafasoulis, K; Seferlis, S; Papadakis, I; Loukas, D; Lambropoulos, C; Potiriadis, C

    2010-01-01

    Spectroscopic measurements are presented using the PID350 pixelated gamma radiation detectors. A high-speed data acquisition system has been developed in order to reduce the data loss during the data reading in case of a high flux of photons. A data analysis framework has been developed in order to improve the resolution of the acquired energy spectra, using specific calibration parameters for each PID350's pixel. Three PID350 detectors have been used to construct a stacked prototype system and spectroscopic measurements have been performed in order to test the ability of the prototype to localize radioactive sources.

  1. Compressive spectral polarization imaging by a pixelized polarizer and colored patterned detector.

    Science.gov (United States)

    Fu, Chen; Arguello, Henry; Sadler, Brian M; Arce, Gonzalo R

    2015-11-01

    A compressive spectral and polarization imager based on a pixelized polarizer and colored patterned detector is presented. The proposed imager captures several dispersed compressive projections with spectral and polarization coding. Stokes parameter images at several wavelengths are reconstructed directly from 2D projections. Employing a pixelized polarizer and colored patterned detector enables compressive sensing over spatial, spectral, and polarization domains, reducing the total number of measurements. Compressive sensing codes are specially designed to enhance the peak signal-to-noise ratio in the reconstructed images. Experiments validate the architecture and reconstruction algorithms.

  2. Assembly procedure of the module (half-stave) of the ALICE Silicon Pixel Detector

    CERN Document Server

    Caselle, M; Antinori, F; Burns, M; Campbell, M; Chochula, P; Dinapoli, R; Elia, D; Formenti, F; Fini, R A; Ghidini, B; Kluge, A; Lenti, V; Manzari, V; Meddi, F; Morel, M; Navach, F; Nilsson, P; Pepato, Adriano; Riedler, P; Santoro, R; Stefanini, G; Viesti, G; Wyllie, K

    2004-01-01

    The Silicon Pixel Detector (SPD) forms the two innermost layers of the ALICE Inner Tracking System (ITS). The detector includes 1200 readout ASICs, each containing 8192 pixel cells, bump-bonded to Si sensor elements. The thickness of the readout chip and the sensor element is 150mum and 200mum, respectively. Low-mass solutions are implemented for the bus and the mechanical support. In this contribution, we describe the basic module (half-stave) of the two SPD layers and we give an overview of its assembly procedure.

  3. Testing and Integration of the Service Cylinders for the CMS Phase 1 pixel detector

    CERN Document Server

    Ngadiuba, Jennifer

    2016-01-01

    The present 3-layer CMS pixel detector will be replaced with a new 4-layer pixel system, referred to as Phase~1 upgrade, during the LHC extended technical stop in winter 2016/2017. The upgraded detector will allow to maintain the excellent tracking performance of CMS at the upcoming higher luminosity conditions at the LHC. The addition of an extra layer, closer to the beam pipe, demands a complete redesign of its services. The barrel pixel detector is attached to four half cylinders which carry the services along the beam pipe, accommodate the cooling lines and house the electronics for detector readout and control. The service cylinders are a complex system in design as well as in production due to the large number of channels and tight space requirements. In this document we present the design of the system and discuss the construction and testing of the service cylinders for the barrel pixel detector. Furthermore, we present results of the testing and calibrations carried out with a set of new digital dete...

  4. Pixel detectors for use in retina neurophysiology studies

    CERN Document Server

    Cunningham, W; Chichilnisky, E J; Horn, M; Litke, A M; Mathieson, K; McEwan, F A; Melone, J; O'Shea, V; Rahman, M; Smith, K M

    2003-01-01

    One area of major inter-disciplinary co-operation is between the particle physics and bio-medical communities. The type of large detector arrays and fast electronics developed in laboratories like CERN are becoming used for a wide range of medical and biological experiments. In the present work fabrication technology developed for producing semiconductor radiation detectors has been applied to produce arrays which have been used in neuro-physiological experiments on retinal tissue. We have exploited UVIII, a low molecular weight resist, that has permitted large area electron beam lithography. This allows the resolution to go below that of conventional photolithography and hence the production of densely packed similar to 500 electrode arrays with feature sizes down to below 2 mum. The neural signals from significant areas of the retina may thus be captured.

  5. ATLAS's inner detector installed in the heart of the experiment

    CERN Multimedia

    2006-01-01

    The ATLAS collaboration recently celebrated a major engineering milestone, namely the transport and installation of the central part of the inner detector (ID-barrel) into the ATLAS detector. Right: Engineers and technicians work to carefully align and install the inner detector in the centre of ATLAS.Left: The crane used in the carefully coordinated effort by the ATLAS collaboration to lower down the fragile inner detector 100 metres underground to its new home. Many members of the collaboration gathered to witness this moment at Point 1. After years of design, construction and commissioning, the two outer detectors (TRT and SCT) of the inner detector barrel (ID-barrel) were moved from the SR1 cleanroom to the ATLAS cavern. The barrel was moved across the car park from Building 2175 to SX1. Although only a journey of about 100 metres, this required weeks of planning and some degree of luck as far as the weather was concerned. Special measures were in place to minimize shock and vibration during transportati...

  6. Medipix3: A 64 k pixel detector readout chip working in single photon counting mode with improved spectrometric performance

    CERN Document Server

    Ballabriga, R; Wong, W; Heijne, E; Campbell, M; Llopart, X

    2011-01-01

    Medipix3 is a 256 x 256 channel hybrid pixel detector readout chip working in a single photon counting mode with a new inter-pixel architecture, which aims to improve the energy resolution in pixelated detectors by mitigating the effects of charge sharing between channels. Charges are summed in all 2 x 2 pixel clusters on the chip and a given hit is allocated locally to the pixel summing circuit with the biggest total charge on an event-by-event basis. Each pixel contains also two 12-bit binary counters with programmable depth and overflow control. The chip is configurable such that either the dimensions of each detector pixel match those of one readout pixel or detector pixels are four times greater in area than the readout pixels. In the latter case, event-by-event summing is still possible between the larger pixels. Each pixel has around 1600 transistors and the analog static power consumption is below 15 mu W in the charge summing mode and 9 mu W in the single pixel mode. The chip has been built in an 8-m...

  7. Design Optimization of Pixel Structure for α-Si based Uncooled Infrared Detector

    Directory of Open Access Journals (Sweden)

    Sudha Gupta

    2013-11-01

    Full Text Available In this paper authors present the design and simulation results achieved for pixel structure of amorphous Si (α-Si based bolometer array. Most uncooled IR detectors in the world are based on VOx material. But this is not a standard material in IC technology and has many inherent disadvantages. The α-Si, an alternative material with high TCR is becoming as popular. However, large TCR values, in this material are achieved only in films of high resistivity. To achieve TCR value more than 2.5%/K, α-Si film resistivity is ~ 80 ohms-cm. This gives rise to very large pixel resistance of the order of 100 Mega ohms depending upon the design of the leg structure. This high pixel resistance causes very large noise and hence lower sensitivity. If leg width or membrane thickness is increased in order to reduce the pixel resistance, then this results in higher thermal conductance which also decreases sensitivity. To overcome this problem, pixel structure is so designed that within a pixel, only part of the electrical conduction is through α-Si and rest is through metal. Simulation using Coventorware software has been done to optimize pixel resistance as well as thermal conductance through legs so that maximum sensitivity could be obtained. Optimization is also carried out in order to reduce sensitivity of pixel resistance to variation in material resistivity.

  8. Silicon micro-fluidic cooling for NA62 GTK pixel detectors

    CERN Document Server

    Romagnoli, G; Brunel, B; Catinaccio, A; Degrange, J; Mapelli, A; Morel, M; Noel, J; Petagna, P

    2015-01-01

    Silicon micro-channel cooling is being studied for efficient thermal management in application fields such as high power computing and 3D electronic integration. This concept has been introduced in 2010 for the thermal management of silicon pixel detectors in high energy physics experiments. Combining the versatility of standard micro-fabrication processes with the high thermal efficiency typical of micro-fluidics, it is possible to produce effective thermal management devices that are well adapted to different detector configurations. The production of very thin cooling devices in silicon enables a minimization of material of the tracking sensors and eliminates mechanical stresses due to the mismatch of the coefficient of thermal expansion between detectors and cooling systems. The NA62 experiment at CERN will be the first high particle physics experiment that will install a micro-cooling system to perform the thermal management of the three detection planes of its Gigatracker pixel detector.

  9. Test of a fine pitch SOI pixel detector with laser beam

    CERN Document Server

    Liu, Yi; Ju, Xudong; Ouyang, Qun

    2015-01-01

    A fine pitch pixel detector, developed on SOI (Silicon on Insulator) technology, has been tested under the illumination of infrared laser pulses. As an alternative way beside particel beam test, the laser pulses are tuned to very short duration and small transverse profile to simulate tracks of MIPs (Minimum Ionization Particles) in silicon. Hit cluster size and substrate depletion characteristics of this SOI detector are obtained. When focused laser pulses propagate through SOI detector perpendicularly to its surface, the hit cluster is measured, and most of signal charges are collected directly by the seed pixel. The signal amplitude as a function of applied bias voltage has been measured on this SOI detector for the first time, which helps us better understand of depletion characteristics.

  10. The Detector Control System of the ATLAS SemiCondutor Tracker during Macro-Assembly and Integration

    CERN Document Server

    Abdesselam, A; Basiladze, S; Bates, R L; Bell, P; Bingefors, N; Böhm, J; Brenner, R; Chamizo-Llatas, M; Clark, A; Codispoti, G; Colijn, A P; D'Auria, S; Dorholt, O; Doherty, F; Ferrari, P; Ferrère, D; Górnicki, E; Koperny, S; Lefèvre, R; Lindquist, L-E; Malecki, P; Mikulec, B; Mohn, B; Pater, J; Pernegger, H; Phillips, P; Robichaud-Véronneau, A; Robinson, D; Roe, S; Sandaker, H; Sfyrla, A; Stanecka, E; Stastny, J; Viehhauser, G; Vossebeld, J; Wells, P

    2008-01-01

    The ATLAS SemiConductor Tracker (SCT) is one of the largest existing semiconductor detectors. It is situated between the Pixel detector and the Transition Radiation Tracker at one of the four interaction points of the Large Hadron Collider (LHC). During 2006-2007 the detector was lowered into the ATLAS cavern and installed in its final position. For the assembly, integration and commissioning phase, a complete Detector Control System (DCS) was developed to ensure the safe operation of the tracker. This included control of the individual powering of the silicon modules, a bi-phase cooling system and various types of sensors monitoring the SCT environment and the surrounding test enclosure. The DCS software architecture, performance and operational experience will be presented in the view of a validation of the DCS for the final SCT installation and operation phase.

  11. Charge Pump Clock Generation PLL for the Data Output Block of the Upgraded ATLAS Pixel Front-End in 130 nm CMOS

    CERN Document Server

    Kruth, A; Arutinov, D; Barbero, M; Gronewald, M; Hemperek, T; Karagounis, M; Krueger, H; Wermes, N; Fougeron, D; Menouni, M; Beccherle, R; Dube, S; Ellege, D; Garcia-Sciveres, M; Gnani, D; Mekkaoui, A; Gromov, V; Kluit, R; Schipper, J

    2009-01-01

    FE-I4 is the 130 nm ATLAS pixel IC currently under development for upgraded Large Hadron Collider (LHC) luminosities. FE-I4 is based on a low-power analog pixel array and digital architecture concepts tuned to higher hit rates [1]. An integrated Phase Locked Loop (PLL) has been developed that locally generates a clock signal for the 160 Mbit/s output data stream from the 40 MHz bunch crossing reference clock. This block is designed for low power, low area consumption and recovers quickly from loss of lock related to single-event transients in the high radiation environment of the ATLAS pixel detector. After a general introduction to the new FE-I4 pixel front-end chip, this work focuses on the FE-I4 output blocks and on a first PLL prototype test chip submitted in early 2009. The PLL is nominally operated from a 1.2V supply and consumes 3.84mW of DC power. Under nominal operating conditions, the control voltage settles to within 2% of its nominal value in less than 700 ns. The nominal operating frequency for t...

  12. An Interdigitated Pixel PIN Detector for Energetic Particle Spectroscopy in Space

    OpenAIRE

    1993-01-01

    We describe a new two-dimensional position-sensitive detector, now under development, for use in space-borne energetic particle spectrometers. The novel feature of this device is the use of interdigitated pixels to provide both dimensions of position information from a single side of the detector, while a measurement of the energy deposition is derived from the opposite side. An advantage of this approach is that significant reductions in the complexity, power, and weight of th...

  13. Alignment of the ATLAS Inner Detector Tracking System

    CERN Document Server

    Moles-Valls, R

    2008-01-01

    The ATLAS experiment is equipped with a tracking system for c harged particles built on two technologies: silicon and drift tube base detectors. These kind of detectors compose the ATLAS Inner Detector (ID). The Alignment of the ATLAS ID tracking s ystem requires the determination of almost 36000 degrees of freedom. From the tracking point o f view, the alignment parameters should be know to a few microns precision. This permits to att ain optimal measurements of the parameters of the charged particles trajectories, thus ena bling ATLAS to achieve its physics goals. The implementation of the alignment software, its framewor k and the data flow will be discussed. Special attention will be paid to the recent challenges wher e large scale computing simulation of the ATLAS detector has been performed, mimicking the ATLAS o peration, which is going to be very important for the LHC startup scenario. The alignment r esult for several challenges (real cosmic ray data taking and computing system commissioning) will be...

  14. Prototype Active Silicon Sensor in 150 nm HR-CMOS Technology for ATLAS Inner Detector Upgrade

    CERN Document Server

    Rymaszewski, Piotr; Breugnon, Patrick; Godiot, Stépahnie; Gonella, Laura; Hemperek, Tomasz; Hirono, Toko; Hügging, Fabian; Krüger, Hans; Liu, Jian; Pangaud, Patrick; Peric, Ivan; Rozanov, Alexandre; Wang, Anqing; Wermes, Norbert

    2016-01-01

    The LHC Phase-II upgrade will lead to a significant increase in luminosity, which in turn will bring new challenges for the operation of inner tracking detectors. A possible solution is to use active silicon sensors, taking advantage of commercial CMOS technologies. Currently ATLAS R&D programme is qualifying a few commercial technologies in terms of suitability for this task. In this paper a prototype designed in one of them (LFoundry 150 nm process) will be discussed. The chip architecture will be described, including different pixel types incorporated into the design, followed by simulation and measurement results.

  15. The ITk strips tracker for the phase-II upgrade of the ATLAS detector of the HL-LHC

    CERN Document Server

    Koutoulaki, Afroditi; The ATLAS collaboration

    2016-01-01

    The inner detector of the present ATLAS detector has been designed and developed to function in the environment of the present Large Hadron Collider (LHC). At the next-generation tracking detector proposed for the High Luminosity LHC (HL-LHC), the so-called ATLAS Phase-II Upgrade, the particle densities and radiation levels will be higher by as much as a factor of ten. The new detectors must be faster, they need to be more highly segmented, and covering more area. They also need to be more resistant to radiation, and they require much greater power delivery to the front-end systems. At the same time, they cannot introduce excess material which could undermine performance. For those reasons, the inner tracker of the ATLAS detector must be redesigned and rebuilt completely. The design of the ATLAS Upgrade inner tracker (ITk) has already been defined. It consists of several layers of silicon particle detectors. The innermost layers will be composed of silicon pixel sensors, and the outer layers will consist of s...

  16. 3 mega-pixel InSb detector with 10μm pitch

    Science.gov (United States)

    Gershon, G.; Albo, A.; Eylon, M.; Cohen, O.; Calahorra, Z.; Brumer, M.; Nitzani, M.; Avnon, E.; Aghion, Y.; Kogan, I.; Ilan, E.; Shkedy, L.

    2013-06-01

    SCD has developed a new 1920x1536 / 10 μm digital Infrared detector for the MWIR window named Blackbird. The Blackbird detector features a Focal Plane Array (FPA) that incorporates two technological building blocks developed over the past few years. The first one is a 10 μm InSb pixel based on the matured planar technology. The second building block is an innovative 10 μm ReadOut Integrated Circuit (ROIC) pixel. The InSb and the ROIC arrays are connected using Flip-Chip technology by means of indium bumps. The digital ROIC consists a matrix of 1920x1536 pixels and has an analog to digital (A/D) converter per-channel (total of 1920x2 A/Ds). It allows for full frame readout at a high frame rate of up to 120 Hz. Such an on-chip A/D conversion eliminates the need for several A/D converters with fairly high power consumption at the system level. The ROIC power consumption at maximum bandwidth is less than 400 mW. It features a wide range of pixel-level functionality such as several conversion gain options and a 2x2 pixel binning. The ROIC design makes use of the advanced and matured CMOS technology, 0.18 μm, which allows for high functionality and relatively low power consumption. The FPA is mounted on a Cold-Finger by a specially designed ceramic substrate. The whole assembly is housed in a stiffened Dewar that withstands harsh environmental conditions while minimizing the environment heat load contribution to the heat load of the detector. The design enables a 3-megapixel detector with overall low size, weight, and power (SWaP) with respect to comparable large format detectors. In this work we present in detail the characteristic performance of the new Blackbird detector.

  17. Summer Student Project Report. Parallelization of the path reconstruction algorithm for the inner detector of the ATLAS experiment.

    CERN Document Server

    Maldonado Puente, Bryan Patricio

    2014-01-01

    The inner detector of the ATLAS experiment has two types of silicon detectors used for tracking: Pixel Detector and SCT (semiconductor tracker). Once a proton-proton collision occurs, the result- ing particles pass through these detectors and these are recorded as hits on the detector surfaces. A medium to high energy particle passes through seven different surfaces of the two detectors, leaving seven hits, while lower energy particles can leave many more hits as they circle through the detector. For a typical event during the expected operational conditions, there are 30 000 hits in average recorded by the sensors. Only high energy particles are of interest for physics analysis and are taken into account for the path reconstruction; thus, a filtering process helps to discard the low energy particles produced in the collision. The following report presents a solution for increasing the speed of the filtering process in the path reconstruction algorithm.

  18. TSV last for hybrid pixel detectors: Application to particle physics and imaging experiments

    CERN Document Server

    Henry, D; Berthelot, A; Cuchet, R; Chantre, C; Campbell, M

    Hybrid pixel detectors are now widely used in particle physics experiments and at synchrotron light sources. They have also stimulated growing interest in other fields and, in particular, in medical imaging. Through the continuous pursuit of miniaturization in CMOS it has been possible to increase the functionality per pixel while maintaining or even shrinking pixel dimensions. The main constraint on the more extensive use of the technology in all fields is the cost of module building and the difficulty of covering large areas seamlessly [1]. On another hand, in the field of electronic component integration, a new approach has been developed in the last years, called 3D Integration. This concept, based on using the vertical axis for component integration, allows improving the global performance of complex systems. Thanks to this technology, the cost and the form factor of components could be decreased and the performance of the global system could be enhanced. In the field of radiation imaging detectors the a...

  19. Simulation of active-edge pixelated CdTe radiation detectors

    Energy Technology Data Exchange (ETDEWEB)

    Duarte, D.D., E-mail: diana.duarte@stfc.ac.uk [STFC Rutherford Appleton Laboratory, Harwell Oxford, Didcot OX11 0QX (United Kingdom); Faculty of Engineering and Physical Sciences, University of Surrey, Guildford, Surrey GU2 7XH (United Kingdom); Lipp, J.D.; Schneider, A.; Seller, P.; Veale, M.C.; Wilson, M.D. [STFC Rutherford Appleton Laboratory, Harwell Oxford, Didcot OX11 0QX (United Kingdom); Baker, M.A.; Sellin, P.J. [Faculty of Engineering and Physical Sciences, University of Surrey, Guildford, Surrey GU2 7XH (United Kingdom)

    2016-01-11

    The edge surfaces of single crystal CdTe play an important role in the electronic properties and performance of this material as an X-ray and γ-ray radiation detector. Edge effects have previously been reported to reduce the spectroscopic performance of the edge pixels in pixelated CdTe radiation detectors without guard bands. A novel Technology Computer Aided Design (TCAD) model based on experimental data has been developed to investigate these effects. The results presented in this paper show how localized low resistivity surfaces modify the internal electric field of CdTe creating potential wells. These result in a reduction of charge collection efficiency of the edge pixels, which compares well with experimental data.

  20. Development and characterization of a DEPFET pixel prototype system for the ILC vertex detector

    Energy Technology Data Exchange (ETDEWEB)

    Kohrs, Robert

    2008-09-15

    For the future TeV-scale linear collider ILC (International Linear Collider) a vertex detector of unprecedented performance is needed to fully exploit its physics potential. By incorporating a field effect transistor into a fully depleted sensor substrate the DEPFET (Depleted Field Effect Transistor) sensor combines radiation detection and in-pixel amplification. For the operation at a linear collider the excellent noise performance of DEPFET pixels allows building very thin detectors with a high spatial resolution and a low power consumption. With this thesis a prototype system consisting of a 64 x 128 pixels sensor, dedicated steering and readout ASICs and a data acquisition board has been developed and successfully operated in the laboratory and under realistic conditions in beam test environments at DESY and CERN. A DEPFET matrix has been successfully read out using the on-chip zero-suppression of the readout chip CURO 2. The results of the system characterization and beam test results are presented. (orig.)

  1. Design and TCAD simulation of double-sided pixelated low gain avalanche detectors

    Energy Technology Data Exchange (ETDEWEB)

    Dalla Betta, Gian-Franco, E-mail: gianfranco.dallabetta@unitn.it [Dipartimento di Ingegneria Industriale, Università di Trento, Via Sommarive 9, 38123 Trento (Italy); TIFPA INFN, Via Sommarive 14, 38123 Trento (Italy); Pancheri, Lucio [Dipartimento di Ingegneria Industriale, Università di Trento, Via Sommarive 9, 38123 Trento (Italy); TIFPA INFN, Via Sommarive 14, 38123 Trento (Italy); Boscardin, Maurizio [Fondazione Bruno Kessler, Via Sommarive 18, 38123 Trento (Italy); TIFPA INFN, Via Sommarive 14, 38123 Trento (Italy); Paternoster, Giovanni [Fondazione Bruno Kessler, Via Sommarive 18, 38123 Trento (Italy); Piemonte, Claudio [Fondazione Bruno Kessler, Via Sommarive 18, 38123 Trento (Italy); TIFPA INFN, Via Sommarive 14, 38123 Trento (Italy); Cartiglia, Nicolo; Cenna, Francesca [INFN Sezione di Torino, Via P. Giuria 2, 10125 Torino (Italy); Bruzzi, Mara [Dipartimento di FIsica e Astronomia, Università di Firenze, and INFN Sezione di Firenze, Via Giovanni Sansone 1, 50019 Sesto Fiorentino (Italy)

    2015-10-01

    We introduce a double-sided variant of low gain avalanche detector, suitable for pixel arrays without dead-area in between the different read-out elements. TCAD simulations were used to validate the device concept and predict its performance. Different design options and selected simulation results are presented, along with the proposed fabrication process.

  2. A near-infrared 64-pixel superconducting nanowire single photon detector array with integrated multiplexed readout

    Energy Technology Data Exchange (ETDEWEB)

    Allman, M. S., E-mail: shane.allman@boulder.nist.gov; Verma, V. B.; Stevens, M.; Gerrits, T.; Horansky, R. D.; Lita, A. E.; Mirin, R.; Nam, S. W. [National Institute of Standards and Technology, 325 Broadway, Boulder, Colorado 80305-3328 (United States); Marsili, F.; Beyer, A.; Shaw, M. D. [Jet Propulsion Laboratory, 4800 Oak Grove Dr., Pasadena, California 91109 (United States); Kumor, D. [Purdue University, 610 Purdue Mall, West Lafayette, Indiana 47907 (United States)

    2015-05-11

    We demonstrate a 64-pixel free-space-coupled array of superconducting nanowire single photon detectors optimized for high detection efficiency in the near-infrared range. An integrated, readily scalable, multiplexed readout scheme is employed to reduce the number of readout lines to 16. The cryogenic, optical, and electronic packaging to read out the array as well as characterization measurements are discussed.

  3. A Near-Infrared 64-pixel Superconducting Nanowire Single Photon Detector Array with Integrated Multiplexed Readout

    CERN Document Server

    Allman, M S; Stevens, M; Gerrits, T; Horansky, R D; Lita, A E; Marsili, F; Beyer, A; Shaw, M D; Kumor, D; Mirin, R; Nam, S W

    2015-01-01

    We demonstrate a 64-pixel free-space-coupled array of superconducting nanowire single photon detectors optimized for high detection efficiency in the near-infrared range. An integrated, readily scalable, multiplexed readout scheme is employed to reduce the number of readout lines to 16. The cryogenic, optical, and electronic packaging to read out the array, as well as characterization measurements are discussed.

  4. Module production for the Phase 1 upgrade of the CMS forward pixel detector

    Science.gov (United States)

    Siado Castaneda, Joaquin

    2017-01-01

    For Run 2 the Large Hadron Collider will run at a much higher instantaneous luminosity, which requires an upgrade of the CMS pixel detector. The detector consists of rectangular silicon sensors, segmented into 100 μm by 150 μm pixels, bonded to readout chips, with one sensor and a 8x2 array of readout chips forming a module. Due to its high granularity and good spatial resolution, about 10 μm for a single hit, the pixel detector is used for track reconstruction, pileup mitigation, and b-quark tagging in many physics analyses. Being the innermost sub-detector of CMS it receives the most radiation damage, and therefore needs to be replaced most often. For the phase 1 upgrade an additional disk in the forward region and increased buffer space in the readout chip will improve the pixel performance by increasing efficiency and reducing fake rates. The University of Nebraska-Lincoln is one of the two sites where modules are being assembled. This talk features the steps of the assembly process as well as challenges encountered and overcome during production of over 500 modules. The CMS Collaboration.

  5. System Electronics for the ATLAS Upgraded Strip Detector

    CERN Document Server

    Affolder, T; The ATLAS collaboration; Clark, A; Dabrowskic, W; Dewitt, J; Diez Cornell, S; Dressdant, N; Fadeyev, V; Farthouat, P; Ferrere, D; Greenall, A; Grillo, A; Kaplon, J; Key-Charriere, M; La Marra, D; Lipeles, E; Lynn, D; Newcomer, M; Pereirab, F; Phillips, P; Spencer, E; Swientekc, K; Warren, M; Weidberg, A

    2013-01-01

    The basic concept of the front-end system of the Silicon Strip Detector in the Atlas Detector upgraded for the HL-LHC is being elaborated and proposed. The readout electronics of this new detector is based on front-end chips (ABC130), Hybrid Controller chips (HCC) and End of Stave Controller chips (EOSC). This document defines the basic functionality of the front-end system and of the different ASICs.

  6. A module concept for the upgrades of the ATLAS pixel system using the novel SLID-ICV vertical integration technology

    CERN Document Server

    Beimforde, M; Macchiolo, A; Moser, H G; Nisius, R; Richter, R H; Weigell, P; 10.1088/1748-0221/5/12/C12025

    2010-01