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Sample records for atlas pixel detector

  1. The ATLAS pixel detector

    OpenAIRE

    Cristinziani, M.

    2007-01-01

    After a ten years planning and construction phase, the ATLAS pixel detector is nearing its completion and is scheduled to be integrated into the ATLAS detector to take data with the first LHC collisions in 2007. An overview of the construction is presented with particular emphasis on some of the major and most recent problems encountered and solved.

  2. ATLAS Pixel Detector Operational Experience

    CERN Document Server

    Di Girolamo, B; The ATLAS collaboration

    2011-01-01

    The ATLAS Pixel Detector is the innermost detector of the ATLAS experiment at the Large Hadron Collider at CERN, providing high-resolution measurements of charged particle tracks in the high radiation environment close to the collision region. This capability is vital for the identification and measurement of proper decay times of long-lived particles such as b-hadrons, and thus vital for the ATLAS physics program. The detector provides hermetic coverage with three cylindrical layers and three layers of forward and backward pixel detectors. It consists of approximately 80 million pixels that are individually read out via chips bump-bonded to 1744 n-in-n silicon substrates. In this talk, results from the successful operation of the Pixel Detector at the LHC will be presented, including monitoring, calibration procedures, timing optimization and detector performance. The detector performance is excellent: 96.9% of the pixels are operational, noise occupancy and hit efficiency exceed the design specification, an...

  3. Status of the ATLAS pixel detector

    CERN Document Server

    Saavedra Aldo, F

    2005-01-01

    The ATLAS pixel detector is currently being constructed and will be installed in 2006 to be ready for commissioning at the Large Hadron Collider. The complete pixel detector is composed of three concentric barrels and six disks that are populated by 1744 ATLAS Pixel modules. The main components of the pixel module are the readout electronics and the silicon sensor whose active region is instrumented with rectangular pixels. The module has been designed to be able to survive 10 years of operation within the ATLAS detector. A brief description of the pixel detector will be presented with results and problems encountered during the production stage.

  4. Operational experience of the ATLAS Pixel Detector

    CERN Document Server

    Marcisovsky, M; The ATLAS collaboration

    2011-01-01

    The ATLAS Pixel Detector is the innermost detector of the ATLAS experiment at the Large Hadron Collider at CERN, providing high-resolution measurements of charged particle tracks in the high radiation environment close to the collision region. This capability is vital for the identification and measurement of proper decay times of long-lived particles such as b-hadrons, and thus vital for the ATLAS physics program. The detector provides hermetic coverage with three cylindrical layers and three layers of forward and backward pixel detectors. It consists of approximately 80 million pixels that are individually read out via chips bump-bonded to 1744 n-in-n silicon substrates. In this talk, results from the successful operation of the Pixel Detector at the LHC will be presented, including monitoring, calibration procedures, timing optimization and detector performance. The detector performance is excellent: 97,5% of the pixels are operational, noise occupancy and hit efficiency exceed the design specification, an...

  5. Operational experience of the ATLAS Pixel detector

    CERN Document Server

    Hirschbuehl, D; The ATLAS collaboration

    2011-01-01

    The ATLAS Pixel Detector is the innermost detector of the ATLAS experiment at the Large Hadron Collider at CERN, providing high-resolution measurements of charged particle tracks in the high radiation environment close to the collision region. This capability is vital for the identification and measurement of proper decay times of long-lived particles such as b-hadrons, and thus vital for the ATLAS physics program. The detector provides hermetic coverage with three cylindrical layers and three layers of forward and backward pixel detectors. It consists of approximately 80 million pixels that are individually read out via chips bump-bonded to 1744 n-in-n silicon substrates. In this talk, results from the successful operation of the Pixel Detector at the LHC will be presented, including monitoring, calibration procedures, timing optimization and detector performance. The detector performance is excellent: 97,5% of the pixels are operational, noise occupancy and hit efficiency exceed the design specification, an...

  6. Operational experience with the ATLAS Pixel Detector

    CERN Document Server

    Ince, T; The ATLAS collaboration

    2012-01-01

    The ATLAS Pixel Detector is the innermost element of the ATLAS experiment at the Large Hadron Collider at CERN, providing high-resolution measurements of charged particle tracks in the high radiation environment close to the collision region. This capability is vital for the identification and measurement of proper decay times of long-lived particles such as b-hadrons, and thus vital for the ATLAS physics program. The detector provides hermetic coverage with three cylindrical layers and three layers of forward and backward pixel detectors. It consists of approximately 80 million pixels that are individually read out via chips bump-bonded to 1744 n-in-n silicon substrates. In this paper, results from the successful operation of the Pixel Detector at the LHC will be presented, including monitoring, calibration procedures, timing optimization and detector performance. The detector performance is excellent: 96.2% of the pixels are operational, noise occupancy and hit efficiency exceed the design specification, an...

  7. Commissioning of the ATLAS pixel detector

    Energy Technology Data Exchange (ETDEWEB)

    ATLAS Collaboration; Golling, Tobias

    2008-09-01

    The ATLAS pixel detector is a high precision silicon tracking device located closest to the LHC interaction point. It belongs to the first generation of its kind in a hadron collider experiment. It will provide crucial pattern recognition information and will largely determine the ability of ATLAS to precisely track particle trajectories and find secondary vertices. It was the last detector to be installed in ATLAS in June 2007, has been fully connected and tested in-situ during spring and summer 2008, and is ready for the imminent LHC turn-on. The highlights of the past and future commissioning activities of the ATLAS pixel system are presented.

  8. Commissioning of the ATLAS Pixel Detector

    OpenAIRE

    Golling, Tobias; ATLAS Collaboration

    2008-01-01

    The ATLAS pixel detector is a high precision silicon tracking device located closest to the LHC interaction point. It belongs to the first generation of its kind in a hadron collider experiment. It will provide crucial pattern recognition information and will largely determine the ability of ATLAS to precisely track particle trajectories and find secondary vertices. It was the last detector to be installed in ATLAS in June 2007, has been fully connected and tested in-situ during spring and su...

  9. Operational Experience with the ATLAS Pixel Detector

    CERN Document Server

    Lantzsch, Kerstin; The ATLAS collaboration

    2016-01-01

    Run 2 of the LHC is providing new challenges to track and vertex reconstruction with higher energies, denser jets and higher rates. Therefore the ATLAS experiment has constructed the first 4-layer Pixel detector in HEP, installing a new Pixel layer, also called Insertable B-Layer (IBL). In addition the Pixel detector was refurbished with new service quarter panels to recover about 3% of defective modules lost during run 1 and a new optical readout system to readout the data at higher speed while reducing the occupancy when running with increased luminosity. The commissioning, operation and performance of the 4-layer Pixel Detector will be presented.

  10. Upgrades of the ATLAS Pixel Detector

    CERN Document Server

    Hügging, F; The ATLAS collaboration

    2013-01-01

    The upgrade for the ATLAS detector will undergo different phases towards HL-LHC. The first upgrade for the Pixel Detector (Phase 1) consists in the construction of a new pixel layer, which will be installed during the 1st long shutdown of the LHC machine (LS1) in 2013/14. The new detector, called Insertable B-Layer (IBL), will be inserted between the existing pixel detector and a new (smaller radius) beam-pipe at a radius of about 3.2 cm. The IBL requires the development of several new technologies to cope with the increase of radiation and pixel occupancy as well as to improve the physics performance of the existing pixel detector. The pixel size is reduced and the material budget is minimized by using new lightweight mechanical support materials and a CO2 based cooling system. For Phase 2 upgrade of LHC a complete new 4-layer pixel system is planned as part of a new all silicon Inner Detector. The increase in luminosity to about $5\\cdot 10^{34}$cm$^{-2}$s$^{-1}$ together with a total expected lifetime of ab...

  11. Optical Link of the Atlas Pixel Detector

    OpenAIRE

    Gan, K. K.

    2007-01-01

    The on-detector optical link of the ATLAS pixel detector contains radiation-hard receiver chips to decode bi-phase marked signals received on PIN arrays and data transmitter chips to drive VCSEL arrays. The components are mounted on hybrid boards (opto-boards). We present results from the irradiation studies with 24 GeV protons up to 32 Mrad (1.2 x 10^15 p/cm^2) and the experience from the production.

  12. ATLAS Inner Detector (Pixel Detector and Silicon Tracker)

    CERN Multimedia

    ATLAS Outreach

    2006-01-01

    To raise awareness of the basic functions of the Pixel Detector and Silicon Tracker in the ATLAS detector on the LHC at CERN. This colorful 3D animation is an excerpt from the film "ATLAS-Episode II, The Particles Strike Back." Shot with a bug's eye view of the inside of the detector. The viewer is taken on a tour of the inner workings of the detector, seeing critical pieces of the detector and hearing short explanations of how each works.

  13. ATLAS rewards two pixel detector suppliers

    CERN Multimedia

    2007-01-01

    Peter Jenni, ATLAS spokesperson, presented the ATLAS supplier award to Herbert Reichl, IZM director, and to Simonetta Di Gioia, from the SELEX company.Two of ATLAS’ suppliers were awarded prizes at a ceremony on Wednesday 13 June attended by representatives of the experiment’s management and of CERN. The prizes went to the Fraunhofer Institut für Zuverlässigkeit und Mikrointegration (IZM) in Berlin and the company SELEX Sistemi Integrati in Rome for the manufacture of modules for the ATLAS pixel detector. SELEX supplied 1500 of the modules for the tracker, while IZM produced a further 1300. The modules, each made up of 46080 channels, form the active part of the ATLAS pixel detector. IZM and SELEX received the awards for the excellent quality of their work: the average number of faulty channels per module was less than 2.10-3. They also stayed within budget and on schedule. The difficulty they faced was designing modules based on electronic components and sensor...

  14. Optical links for the ATLAS Pixel detector

    CERN Document Server

    Stucci, Stefania Antonia; The ATLAS collaboration

    2015-01-01

    Optical links are necessary to satisfy the high speed readout over long distances for advanced silicon detector systems. We report on the optical readout used in the newly installed central pixel layer (IBL) in the ATLAS experiment. The off detector readout employs commercial optical to analog converters, which were extensively tested for this application. Performance measurements during installation and commissioning will be shown. With the increasing instantaneous luminosity in the next years, the next layers outwards of IBL of the ATLAS Pixel detector (Layer 1 and Layer 2) will reach their bandwidth limits. A plan to increase the bandwidth by upgrading the off detector readout chain is put in place. The plan also involves new optical readout components, in particular the optical receivers, for which commercial units cannot be used and a new design has been made. The latter allows for a wider operational range in term of data frequency and light input power to match the on-detector sending units on the pres...

  15. optical links for the atlas pixel detector

    CERN Document Server

    Stucci, Stefania Antonia; The ATLAS collaboration

    2015-01-01

    Optical links are necessary to satisfy the high speed readout over long distances for advanced silicon detector systems. We report on the optical readout used in the newly installed central pixel layer (IBL) in the ATLAS experiment. The off detector readout employs commercial optical to analog converters, which were extensively tested for this application. Performance measurements during installation and commissioning will be shown. With the increasing instantaneous luminosity in the next years, the next layers outwards of IBL of the ATLAS Pixel detector (Layer 1 and Layer 2) will reach their bandwidth limits. A plan to increase the bandwidth by upgrading the off detector readout chain is put in place. The plan also involves new optical readout components, in particular the optical receivers, for which commercial units cannot be used and a new design has been made. The latter allows for a wider operational range in term of data frequency and light input power to match the on-detector sending units on the pres...

  16. Survey of the ATLAS Pixel Detector Components

    International Nuclear Information System (INIS)

    This document provides a description of the survey performed on different components of the ATLAS Pixel Detector at different stages of its assembly. During the production of the ATLAS pixel detector great care was put in the geometrical survey of the location of the sensitive area of modules. This had a double purpose: (1) to provide a check of the quality of the assembly procedure and assure tolerances in the geometrical assembly were met; and (2) to provide an initial point for the alignment (the so called 'as-built detector'), better than the ideal geometry. Since direct access to the sensitive area becomes more and more difficult with the progress of the assembly, the survey needed to be performed at different stages: after module loading on the local supports (sectors and staves) and after assembly of the local supports in disks or halfshells. Different techniques were used, including both optical 2D and 3D surveys and mechanical survey. This document summarizes the survey procedures, the analysis done on the collected data and how survey data are stored in case they will need to be accessed in the future

  17. Operational experience with the ATLAS Pixel Detector at the LHC

    Science.gov (United States)

    Lapoire, C.; Atlas Collaboration

    2013-01-01

    The ATLAS Pixel Detector is the innermost detector of the ATLAS experiment at the Large Hadron Collider at CERN, providing high-resolution measurements of charged particle tracks in the high radiation environment close to the collision region. This capability is vital for the identification and measurement of proper decay times of long-lived particles such as B-hadrons, and thus vital for the ATLAS physics program. The detector provides hermetic coverage with three cylindrical layers and three layers of forward and backward pixel detectors. It consists of approximately 80 million pixels that are individually read out via chips bump-bonded to 1744 n-in-n silicon substrates. In this paper, results from the successful operation of the Pixel Detector at the LHC will be presented, including monitoring, calibration procedures and detector performance. The detector performance is excellent: 96.2% of the pixels are operational, noise occupancy is sufficiently low and hit efficiency exceed the design specification.

  18. Operational experience with the ATLAS Pixel Detector at the LHC

    CERN Document Server

    Hirschbuehl, D; The ATLAS collaboration

    2011-01-01

    The ATLAS Pixel Detector is the innermost detector of the ATLAS experiment at the Large Hadron Collider at CERN, providing high-resolution measurements of charged particle tracks in the high radiation environment close to the collision region. This capability is vital for the identification and measurement of proper decay times of long-lived particles such as b-hadrons, and thus vital for the ATLAS physics program. The detector provides hermetic coverage with three cylindrical layers and three layers of forward and backward pixel detectors. It consists of approximately 80 million pixels that are individually read out via chips bump-bonded to 1744 n-in-n silicon substrates. In this paper results from the successful operation of the Pixel Detector at the LHC will be presented, including monitoring, calibration procedures, timing optimization and detector performance. The detector performance is excellent: 96.7% of the pixels are operational, noise occupancy and hit efficiency exceed the design specification, an...

  19. Operational Experience with the ATLAS Pixel Detector at the LHC

    CERN Document Server

    Keil, M; The ATLAS collaboration

    2011-01-01

    The ATLAS Pixel Detector is the innermost detector of the ATLAS experiment at the Large Hadron Collider at CERN, providing high-resolution measurements of charged particle tracks in the high radiation environment close to the collision region. This capability is vital for the identification and measurement of proper decay times of long-lived particles such as b-hadrons, and thus vital for the ATLAS physics program. The detector provides hermetic coverage with three cylindrical layers and three layers of forward and backward pixel detectors. It consists of approximately 80 million pixels that are individually read out via chips bump-bonded to 1744 n-in-n silicon substrates. In this talk, results from the successful operation of the Pixel Detector at the LHC will be presented, including monitoring, calibration procedures, timing optimization and detector performance. The detector performance is excellent: 97,5% of the pixels are operational, noise occupancy and hit efficiency exceed the design specification, an...

  20. Operational experience with the ATLAS Pixel detector at the LHC

    CERN Document Server

    Deluca, C; The ATLAS collaboration

    2011-01-01

    The ATLAS Pixel Detector is the innermost detector of the ATLAS experiment at the Large Hadron Collider at CERN, providing high-resolution measurements of charged particle tracks in the high radiation environment close to the collision region. This capability is vital for the identification and measurement of proper decay times of long-lived particles such as b-hadrons, and thus vital for the ATLAS physics program. The detector provides hermetic coverage with three cylindrical layers and three layers of forward and backward pixel detectors. It consists of approximately 80 million pixels that are individually read out via chips bump-bonded to 1744 n-in-n silicon substrates. In this paper, results from the successful operation of the Pixel Detector at the LHC will be presented, including monitoring, calibration procedures, timing optimization and detector performance. The detector performance is excellent: 97,5\\% of the pixels are operational, noise occupancy and hit efficiency exceed the design specification, ...

  1. Operational experience with the ATLAS Pixel Detector at the LHC

    CERN Document Server

    Ince, T; The ATLAS collaboration

    2011-01-01

    The ATLAS Pixel Detector is the innermost detector of the ATLAS experiment at the Large Hadron Collider at CERN, providing high-resolution measurements of charged particle tracks in the high radiation environment close to the collision region. This capability is vital for the identification and measurement of proper decay times of long-lived particles such as b-hadrons, and thus vital for the ATLAS physics program. The detector provides hermetic coverage with three cylindrical layers and three layers of forward and backward pixel detectors. It consists of approximately 80 million pixels that are individually read out via chips bump-bonded to 1744 n-in-n silicon substrates. In this talk, results from the successful operation of the Pixel Detector at the LHC will be presented, including monitoring, calibration procedures, timing optimization and detector performance. The detector performance is excellent: 96.8% of the pixels are operational, noise occupancy and hit efficiency exceed the design specification, an...

  2. Operational experience with the ATLAS Pixel Detector at the LHC

    CERN Document Server

    Lapoire, C; The ATLAS collaboration

    2011-01-01

    The ATLAS Pixel Detector is the innermost detector of the ATLAS experiment at the Large Hadron Collider at CERN, providing high-resolution measurements of charged particle tracks in the high radiation environment close to the collision region. This capability is vital for the identification and measurement of proper decay times of long-lived particles such as b-hadrons, and thus vital for the ATLAS physics program. The detector provides hermetic coverage with three cylindrical layers and three layers of forward and backward pixel detectors. It consists of approximately 80 million pixels that are individually read out via chips bump-bonded to 1744 n-in-n silicon substrates. In this talk, results from the successful operation of the Pixel Detector at the LHC will be presented, including monitoring, calibration procedures, timing optimization and detector performance. The detector performance is excellent: 97,5% of the pixels are operational, noise occupancy and hit efficiency exceed the design specification, an...

  3. Operational Experience with the ATLAS Pixel Detector at the LHC

    CERN Document Server

    Lapoire, C; The ATLAS collaboration

    2012-01-01

    The ATLAS Pixel Detector is the innermost detector of the ATLAS experiment at the Large Hadron Collider at CERN, providing high-resolution measurements of charged particle tracks in the high radiation environment close to the collision region. This capability is vital for the identification and measurement of proper decay times of long-lived particles such as B-hadrons, and thus vital for the ATLAS physics program. The detector provides hermetic coverage with three cylindrical layers and three layers of forward and backward pixel detectors. It consists of approximately 80 million pixels that are individually read out via chips bump-bonded to 1744 n-in-n silicon substrates. In this paper, results from the successful operation of the Pixel Detector at the LHC will be presented, including monitoring, calibration procedures and detector performance. The detector performance is excellent: 96.2% of the pixels are operational, noise occupancy and hit efficiency exceed the design specification.

  4. Operational Experience with the ATLAS Pixel Detector at the LHC

    CERN Document Server

    Lange, C; The ATLAS collaboration

    2011-01-01

    The ATLAS Pixel Detector is the innermost detector of the ATLAS experiment at the Large Hadron Collider at CERN, providing high-resolution measurements of charged particle tracks in the high radiation environment close to the collision region. This capability is vital for the identification and measurement of proper decay times of long-lived particles such as b-hadrons, and thus vital for the ATLAS physics program. The detector provides hermetic coverage with three cylindrical layers and three layers of forward and backward pixel detectors. It consists of approximately 80 million pixels that are individually read out via chips bump- bonded to 1744 n-in-n silicon substrates. In this talk, results from the successful operation of the Pixel Detector at the LHC will be presented, including monitoring, calibration procedures, timing optimization and detector performance. The detector performance is excellent: 97,5% of the pixels are operational, noise occupancy and hit efficiency exceed the design specification, a...

  5. Operational experience with the ATLAS Pixel detector at the LHC

    CERN Document Server

    Deluca, C; The ATLAS collaboration

    2011-01-01

    The ATLAS Pixel Detector is the innermost detector of the ATLAS experiment at the Large Hadron Collider at CERN, providing high-resolution measurements of charged particle tracks in the high radiation environment close to the collision region. This capability is vital for the identification and measurement of proper decay times of long-lived particles such as b-hadrons, and thus vital for the ATLAS physics program. The detector provides hermetic coverage with three cylindrical layers and three layers of forward and backward pixel detectors. It consists of approximately 80 million pixels that are individually read out via chips bump-bonded to 1744 n-in-n silicon substrates. In this talk, results from the successful operation of the Pixel Detector at the LHC will be presented, including monitoring, calibration procedures, timing optimization and detector performance. The detector performance is excellent: 97,5% of the pixels are operational, noise occupancy and hit efficiency exceed the design specification, an...

  6. DAQ Hardware and software development for the ATLAS Pixel Detector

    CERN Document Server

    Stramaglia, Maria Elena; The ATLAS collaboration

    2015-01-01

    In 2014, the Pixel Detector of the ATLAS experiment was extended by about 12 million pixels with the installation of the Insertable B-Layer (IBL). Data-taking and tuning procedures have been implemented by employing newly designed read-out hardware, which supports the full detector bandwidth even for calibration. The hardware is supported by an embedded software stack running on the read-out boards. The same boards will be used to upgrade the read-out bandwidth for the two outermost layers of the ATLAS Pixel Barrel (54 million pixels). We present the IBL read-out hardware and the supporting software architecture used to calibrate and operate the 4-layer ATLAS Pixel detector. We discuss the technical implementations and status for data taking, validation of the DAQ system in recent cosmic ray data taking, in-situ calibrations, and results from additional tests in preparation for Run 2 at the LHC.

  7. Vertex measurement at a hadron collider. The ATLAS pixel detector

    International Nuclear Information System (INIS)

    The ATLAS Pixel Detector is the innermost layer of the ATLAS tracking system and will contribute significantly to the ATLAS track and vertex reconstruction. The detector consists of identical sensor-chip-hybrid modules, arranged in three barrels in the centre and three disks on either side for the forward region. The position of the Pixel Detector near the interaction point requires excellent radiation hardness, fast read-out, mechanical and thermal robustness, good long-term stability, all combined with a low material budget. The new design concepts used to meet the challenging requirements are discussed with their realisation in the Pixel Detector, followed by a description of a refined and extensive set of measurements to assess the detector performance during and after its construction. (orig.)

  8. DAQ hardware and software development for the ATLAS Pixel Detector

    CERN Document Server

    Stramaglia, Maria Elena; The ATLAS collaboration

    2015-01-01

    In 2014, the Pixel Detector of the ATLAS experiment has been extended by about 12 million pixels thanks to the installation of the Insertable B-Layer (IBL). Data-taking and tuning procedures have been implemented along with newly designed read-out hardware to support high bandwidth for data readout and calibration. The hardware is supported by an embedded software stack running on the read-out boards. The same boards will be used to upgrade the read-out bandwidth for the two outermost layers of the ATLAS Pixel Barrel (54 million pixels). We present the IBL read-out hardware and the supporting software architecture used to calibrate and operate the 4-layer ATLAS Pixel detector. We discuss the technical implementations and status for data taking, validation of the DAQ system in recent cosmic ray data taking, in-situ calibrations, and results from additional tests in preparation for Run 2 at the LHC.

  9. DAQ hardware and software development for the ATLAS Pixel Detector

    Science.gov (United States)

    Stramaglia, Maria Elena

    2016-07-01

    In 2014, the Pixel Detector of the ATLAS experiment has been extended by about 12 million pixels thanks to the installation of the Insertable B-Layer (IBL). Data-taking and tuning procedures have been implemented along with newly designed readout hardware to support high bandwidth for data readout and calibration. The hardware is supported by an embedded software stack running on the readout boards. The same boards will be used to upgrade the readout bandwidth for the two outermost barrel layers of the ATLAS Pixel Detector. We present the IBL readout hardware and the supporting software architecture used to calibrate and operate the 4-layer ATLAS Pixel Detector. We discuss the technical implementations and status for data taking, validation of the DAQ system in recent cosmic ray data taking, in-situ calibrations, and results from additional tests in preparation for Run 2 at the LHC.

  10. Initial Measurements on Pixel Detector Modules for the ATLAS Upgrades

    CERN Document Server

    Gallrapp, C; The ATLAS collaboration

    2011-01-01

    Delicate conditions in terms of peak and integrated luminosity in the Large Hadron Collider (LHC) will raise the ATLAS Pixel Detector to its performance limits. Silicon planar, silicon 3D and diamond pixel sensors are three possible sensor technologies which could be implemented in the upcoming Pixel Detector upgrades of the ATLAS experiment. Measurements of the IV-behavior and measurements with radioactive Americium-241 and Strontium-90 are used to characterize the sensor properties and to understand the interaction between the ATLAS FE-I4 front-end chip and the sensor. Comparisons of results from before and after irradiation for silicon planar and 3D pixel sensors, which give a first impression on the charge collection properties of the different sensor technologies, are presented.

  11. Initial Measurements On Pixel Detector Modules For The ATLAS Upgrades

    CERN Document Server

    Gallrapp, C; The ATLAS collaboration

    2011-01-01

    Sophisticated conditions in terms of peak and integrated luminosity in the Large Hadron Collider (LHC) will raise the ATLAS Pixel detector to its performance limits. Silicon planar, silicon 3D and diamond pixel sensors are three possible sensor technologies which could be implemented in the upcoming pixel detector upgrades of the ATLAS experiment. Measurements of the IV-behavior and measurements with radioactive Americium-241 and Strontium-90 are used to characterize the sensor properties and to understand the interaction between the ATLAS FE-I4 front-end chip and the sensor. Comparisons of results from before and after irradiation, which give a first impression on the charge collection properties of the different sensor technologies are presented.

  12. Optical Links for the ATLAS Pixel Detector

    CERN Document Server

    Gregor, Ingrid-Maria

    In der vorliegenden Dissertation wird eine strahlentolerante optische Datenstrecke mit hoher Datenrate für den Einsatz in dem Hochenergiephysikexperiment Atlas am Lhc Beschleuniger entwickelt. Da die Lhc-Experimente extremen Strahlenbelastungen ausgesetzt sind, müssen die Komponenten spezielle Ansprüche hinsichtlich der Strahlentoleranz erfüllen. Die Qualifikation der einzelnen Bauteile wurde im Rahmen dieser Arbeit durchgeführt. Die zu erwartenden Fluenzen im Atlas Inner Detector für Silizium und Gallium Arsenid (GaAs) wurden berechnet. Siliziumbauteile werden einer Fluenz von bis zu 1.1.1015neq /cm2 in 1 MeV äquivalenten Neutronen ausgesetzt sein, wohingegen GaAs Bauteile bis zu 7.8.1015neq /cm2 ausgesetzt sein werden. Die Strahlentoleranz der einzelnen benötigten Komponenten wie z.B. der Laserdioden sowie der jeweiligen Treiberchips wurde untersucht. Sowohl die Photo- als auch die Laserdioden haben sich als strahlentolerant für die Fluenzen an dem vorgesehenen Radius erwiesen. Aus de...

  13. Monitoring Radiation Damage in the ATLAS Pixel Detector

    CERN Document Server

    Schorlemmer, André Lukas; Große-Knetter, Jörn; Rembser, Christoph; Di Girolamo, Beniamino

    2014-11-05

    Radiation hardness is one of the most important features of the ATLAS pixel detector in order to ensure a good performance and a long lifetime. Monitoring of radiation damage is crucial in order to assess and predict the expected performance of the detector. Key values for the assessment of radiation damage in silicon, such as the depletion voltage and depletion depth in the sensors, are measured on a regular basis during operations. This thesis summarises the monitoring program that is conducted in order to assess the impact of radiation damage and compares it to model predictions. In addition, the physics performance of the ATLAS detector highly depends on the amount of disabled modules in the ATLAS pixel detector. A worrying amount of module failures was observed during run I. Thus it was decided to recover repairable modules during the long shutdown (LS1) by extracting the pixel detector. The impact of the module repairs and module failures on the detector performance is analysed in this thesis.

  14. Pixel detector modules performance for ATLAS IBL and future pixel detectors

    CERN Document Server

    AUTHOR|(INSPIRE)INSPIRE-00355104; Pernegger, Heinz

    2015-11-06

    The ATLAS Detector is one of the four big particle physics experiments at CERN’s LHC. Its innermost tracking system consisted of the 3-Layer silicon Pixel Detector (~80M readout channels) in the first run (2010-2012). Over the past two years it was refurbished and equipped with new services as well as a new beam monitor. The major upgrade, however, was the Insertable B-Layer (IBL). It adds ~12M readout channels for improved vertexing, tracking robustness and b-tagging performance for the upcoming runs, before the high luminosity upgrade of the LHC will take place. This thesis covers two main aspects of Pixel detector performance studies: The main work was the planning, commissioning and operation of a test bench that meets the requirements of current pixel detector components. Each newly built ATLAS IBL stave was thoroughly tested, following a specifically developed procedure, and initially calibrated in that setup. A variety of production accompanying measurements as well as preliminary results after integ...

  15. Radiation damage monitoring of the ATLAS pixel detector

    CERN Document Server

    Seidel, Sally; The ATLAS collaboration

    2015-01-01

    A measurement has been made of the radiation damage incurred by the ATLAS Pixel Detector barrel silicon modules from the beginning of operations through the end of 2012. This translates to hadronic fluence received over the full period of operation at energies up to and including 8 TeV. The measurement is based on a per-module record of the silicon sensor leakage current. The results are presented as a function of integrated luminosity and compared to predictions by the Hamburg Model. This information can be used to predict limits on the lifetime of the Pixel Detector due to current, for various operating scenarios.

  16. Calibration analysis software for the ATLAS Pixel Detector

    Science.gov (United States)

    Stramaglia, Maria Elena

    2016-07-01

    The calibration of the ATLAS Pixel Detector at LHC fulfils two main purposes: to tune the front-end configuration parameters for establishing the best operational settings and to measure the tuning performance through a subset of scans. An analysis framework has been set up in order to take actions on the detector given the outcome of a calibration scan (e.g. to create a mask for disabling noisy pixels). The software framework to control all aspects of the Pixel Detector scans and analyses is called calibration console. The introduction of a new layer, equipped with new FE-I4 chips, required an update of the console architecture. It now handles scans and scan analyses applied together to chips with different characteristics. An overview of the newly developed calibration analysis software will be presented, together with some preliminary results.

  17. Calibration Analysis Software for the ATLAS Pixel Detector

    CERN Document Server

    Stramaglia, Maria Elena; The ATLAS collaboration

    2015-01-01

    The calibration of the ATLAS Pixel detector at LHC fulfils two main purposes: to tune the front-end configuration parameters for establishing the best operational settings and to measure the tuning performance through a subset of scans. An analysis framework has been set up in order to take actions on the detector given the outcome of a calibration scan (e.g. to create a mask for disabling noisy pixels). The software framework to control all aspects of the Pixel detector scans and analyses is called Calibration Console. The introduction of a new layer, equipped with new Front End-I4 Chips, required an update the Console architecture. It now handles scans and scans analyses applied together to chips with different characteristics. An overview of the newly developed Calibration Analysis Software will be presented, together with some preliminary result.

  18. ATLAS Pixel Detector Design For HL-LHC

    CERN Document Server

    Smart, Ben; The ATLAS collaboration

    2016-01-01

    The ATLAS Inner Detector will be replaced for the High-Luminosity LHC (HL-LHC) running in 2026. The new Inner Detector will be called the Inner Tracker (ITk). The ITk will cover an extended eta-range: at least to |eta|<3.2, and likely up to |eta|<4.0. The ITk will be an all-Silicon based detector, consisting of a Silicon strip detector outside of a radius of 362mm, and a Silicon pixel detector inside of this radius. Several novel designs are being considered for the ITk pixel detector, to cope with high-eta charged particle tracks. These designs are grouped into 'extended' and 'inclined' design-types. Extended designs have long pixel staves with sensors parallel to the beamline. High-eta particles will therefore hit these sensors at shallow angles, leaving elongated charge clusters. The length of such a charge cluster can be used to estimate the angle of the passing particle. This information can then be used in track reconstruction to improve tracking efficiency and reduce fake rates. Inclined designs ...

  19. Planar pixel detector module development for the HL-LHC ATLAS pixel system

    Energy Technology Data Exchange (ETDEWEB)

    Bates, Richard L., E-mail: richard.bates@glasgow.ac.uk [SUPA School of Physics and Astronomy, University of Glasgow, Glasgow G12 8QQ (United Kingdom); Buttar, C.; Stewart, A.; Blue, A.; Doonan, K.; Ashby, J. [SUPA School of Physics and Astronomy, University of Glasgow, Glasgow G12 8QQ (United Kingdom); Casse, G.; Dervan, P.; Forshaw, D.; Tsurin, I. [The University of Liverpool, Liverpool (United Kingdom); Brown, S.; Pater, J. [The Univiersty of Manchester, Manchester (United Kingdom)

    2013-12-11

    The ATLAS pixel detector for the HL-LHC requires the development of large area pixel modules that can withstand doses up to 10{sup 16} 1 MeV n{sub eq} cm{sup −2}. The area of the pixel detector system will be over 5 m{sup 2} and as such low cost, large area modules are required. The development of a quad module based on 4 FE-I4 readout integrated chips (ROIC) will be discussed. The FE-I4 ROIC is a large area chip and the yield of the flip-chip process to form an assembly is discussed for single chip assemblies. The readout of the quad module for laboratory tests will be reported.

  20. Planar pixel detector module development for the HL-LHC ATLAS pixel system

    Science.gov (United States)

    Bates, Richard L.; Buttar, C.; Stewart, A.; Blue, A.; Doonan, K.; Ashby, J.; Casse, G.; Dervan, P.; Forshaw, D.; Tsurin, I.; Brown, S.; Pater, J.

    2013-12-01

    The ATLAS pixel detector for the HL-LHC requires the development of large area pixel modules that can withstand doses up to 1016 1 MeV neq cm-2. The area of the pixel detector system will be over 5 m2 and as such low cost, large area modules are required. The development of a quad module based on 4 FE-I4 readout integrated chips (ROIC) will be discussed. The FE-I4 ROIC is a large area chip and the yield of the flip-chip process to form an assembly is discussed for single chip assemblies. The readout of the quad module for laboratory tests will be reported.

  1. Planar pixel detector module development for the HL-LHC ATLAS pixel system

    International Nuclear Information System (INIS)

    The ATLAS pixel detector for the HL-LHC requires the development of large area pixel modules that can withstand doses up to 1016 1 MeV neq cm−2. The area of the pixel detector system will be over 5 m2 and as such low cost, large area modules are required. The development of a quad module based on 4 FE-I4 readout integrated chips (ROIC) will be discussed. The FE-I4 ROIC is a large area chip and the yield of the flip-chip process to form an assembly is discussed for single chip assemblies. The readout of the quad module for laboratory tests will be reported

  2. Simulation of gas mixture drift properties for GasPixel detector for modernization of ATLAS

    International Nuclear Information System (INIS)

    Results of simulation of gas mixture drift properties for GasPixel detector are presented. The properties of gaseous mixtures for the GasPixel detector have been studied in view of its use in high luminosity tracking applications for the ATLAS Inner Detector in a future super-LHC collider

  3. ATLAS pixel detector timing optimisation with the back of crate card of the optical pixel readout system

    Energy Technology Data Exchange (ETDEWEB)

    Flick, T; Gerlach, P; Reeves, K; Maettig, P [Department of Physics, Bergische Universitaet Wuppertal (Germany)

    2007-04-15

    As with all detector systems at the Large Hadron Collider (LHC), the assignment of data to the correct bunch crossing, where bunch crossings will be separated in time by 25 ns, is one of the challenges for the ATLAS pixel detector. This document explains how the detector system will accomplish this by describing the general strategy, its implementation, the optimisation of the parameters, and the results obtained during a combined testbeam of all ATLAS subdetectors.

  4. Status and future of the ATLAS Pixel Detector at the LHC

    International Nuclear Information System (INIS)

    The ATLAS Pixel Detector is the innermost detector of the ATLAS experiment at the Large Hadron Collider at CERN. The detector provides hermetic coverage with three cylindrical layers and three layers of disks in each forward end-cap. It consists of approximately 80 million pixels that are individually read out via chips bump-bonded to 1744 n-on-n silicon substrates. Intensive calibration, tuning, timing optimization and monitoring resulted in the successful five years of operation with good detector performance. The record breaking instantaneous luminosities of 7.7×1033cm−2s−1 recently surpassed at the LHC generated a rapidly increasing particle fluence in the ATLAS Pixel Detector. As the radiation dose accumulated, the first effects of radiation damage became observable in the silicon sensors as an increase in the silicon leakage current and the change of the voltage required to fully deplete the sensor. A fourth pixel layer at a radius of 3.3 cm will be added during the long shutdown (2013–2014) together with the replacement of pixel services. A letter of intent was submitted for a completely new Pixel Detector after 2023, capable to take data with extremely high leveled luminosities of 5×1034cm−2s−1 at the high luminosity LHC. -- Highlights: •The ATLAS Pixel Detector provides hermetic coverage with three layers with 80 million pixels. •Calibration, tuning, timing optimization and monitoring resulted in the successful five years of operation with good detector performance. •First effects of radiation damage became observable in the silicon sensors. •A fourth pixel layer at a radius of 3.3 cm will be added during the long shutdown (2013–2014). •Replacement of pixel services in 2013–2014. •A letter of intent was submitted for new Pixel Detector after 2023 for high luminosity LHC

  5. Development and characterization of diamond and 3D-silicon pixel detectors with ATLAS-pixel readout electronics

    International Nuclear Information System (INIS)

    Hybrid pixel detectors are used for particle tracking in the innermost layers of current high energy experiments like ATLAS. After the proposed luminosity upgrade of the LHC, they will have to survive very high radiation fluences of up to 1016 particles per cm2 per life time. New sensor concepts and materials are required, which promise to be more radiation tolerant than the currently used planar silicon sensors. Most prominent candidates are so-called 3D-silicon and single crystal or poly-crystalline diamond sensors. Using the ATLAS pixel electronics different detector prototypes with a pixel geometry of 400 x 50 μm2 have been built. In particular three devices have been studied in detail: a 3D-silicon and a single crystal diamond detector with an active area of about 1 cm2 and a poly-crystalline diamond detector of the same size as a current ATLAS pixel detector module (2 x 6 cm2). To characterize the devices regarding their particle detection efficiency and spatial resolution, the charge collection inside a pixel cell as well as the charge sharing between adjacent pixels was studied using a high energy particle beam. (orig.)

  6. Development and characterization of diamond and 3D-silicon pixel detectors with ATLAS-pixel readout electronics

    Energy Technology Data Exchange (ETDEWEB)

    Mathes, Markus

    2008-12-15

    Hybrid pixel detectors are used for particle tracking in the innermost layers of current high energy experiments like ATLAS. After the proposed luminosity upgrade of the LHC, they will have to survive very high radiation fluences of up to 10{sup 16} particles per cm{sup 2} per life time. New sensor concepts and materials are required, which promise to be more radiation tolerant than the currently used planar silicon sensors. Most prominent candidates are so-called 3D-silicon and single crystal or poly-crystalline diamond sensors. Using the ATLAS pixel electronics different detector prototypes with a pixel geometry of 400 x 50 {mu}m{sup 2} have been built. In particular three devices have been studied in detail: a 3D-silicon and a single crystal diamond detector with an active area of about 1 cm{sup 2} and a poly-crystalline diamond detector of the same size as a current ATLAS pixel detector module (2 x 6 cm{sup 2}). To characterize the devices regarding their particle detection efficiency and spatial resolution, the charge collection inside a pixel cell as well as the charge sharing between adjacent pixels was studied using a high energy particle beam. (orig.)

  7. Calibration Analysis Software for the ATLAS Pixel Detector

    CERN Document Server

    Stramaglia, Maria Elena; The ATLAS collaboration

    2015-01-01

    The calibration of the Pixel detector fulfills two main purposes: to tune front-end registers for establishing the best operational settings and to measure the tuning performance through a subset of scans. An analysis framework has been set up in order to take actions on the detector given the outcome of a calibration scan (e.g. to create a mask for disabling noisy pixels). The software framework to control all aspects of the Pixel detector scans and analyses is called Calibration Console. The introduction of a new layer, equipped with new Front End-I4 Chips, required an update the Console architecture. It now handles scans and scans analyses applied toghether to chips with dierent characteristics. An overview of the newly developed Calibration Analysis Software will be presented, together with some preliminary result.

  8. Studies for the detector control system of the ATLAS pixel at the HL-LHC

    International Nuclear Information System (INIS)

    In the context of the LHC upgrade to the HL-LHC the inner detector of the ATLAS experiment will be replaced completely. As part of this redesign there will also be a new pixel detector. This new pixel detector requires a control system which meets the strict space requirements for electronics in the ATLAS experiment. To accomplish this goal we propose a DCS (Detector Control System) network with the smallest form factor currently available. This network consists of a DCS chip located in close proximity to the interaction point and a DCS controller located in the outer regions of the ATLAS detector. These two types of chips form a star shaped network with several DCS chips being controlled by one DCS controller. Both chips are manufactured in deep sub-micron technology. We present prototypes with emphasis on studies concerning single event upsets.

  9. Commissioning of the upgraded ATLAS Pixel Detector for Run2 at LHC

    CERN Document Server

    Dobos, Daniel; The ATLAS collaboration

    2015-01-01

    The Pixel Detector of the ATLAS experiment has shown excellent performance during the whole Run-1 of LHC. Taking advantage of the long showdown, the detector was extracted from the experiment and brought to surface, to equip it with new service quarter panels, to repair modules and to ease installation of the Insertable B-Layer (IBL), a fourth layer of pixel detectors, installed in May 2014 between the existing Pixel Detector and a new smaller radius beam-pipe at a radius of 3.3 cm. To cope with the high radiation and pixel occupancy due to the proximity to the interaction point, a new read-out chip and two different silicon sensor technologies (planar and 3D) have been developed. An overview of the refurbishing of the Pixel Detector and of the IBL project as well as early performance tests using cosmic rays and beam data will be presented.

  10. Development and Characterization of Diamond and 3D-Silicon Pixel Detectors with ATLAS-Pixel Readout Electronics

    CERN Document Server

    Mathes, Markus

    2008-01-01

    Abstract: Hybrid pixel detectors are used for particle tracking in the innermost layers of current high energy experiments like ATLAS. After the proposed luminosity upgrade of the LHC, they will have to survive very high radiation fluences of up to 10^16 particles per cm^2 per life time. New sensor concepts and materials are required, which promise to be more radiation tolerant than the currently used planar silicon sensors. Most prominent candidates are so-called 3D-silicon and single crystal or poly-crystalline diamond sensors. Using the ATLAS pixel electronics different detector prototypes with a pixel geometry of 400 × 50 um^2 have been built. In particular three devices have been studied in detail: a 3D-silicon and a single crystal diamond detector with an active area of about 1 cm^2 and a poly-crystalline diamond detector of the same size as a current ATLAS pixel detector module (2 × 6 cm^2). To characterize the devices regarding their particle detection efficiency and spatial resolution, the charge c...

  11. Commissioning and Operation of the ATLAS Pixel Detector at the CERN LHC Collider

    CERN Document Server

    Djama, F; The ATLAS collaboration

    2010-01-01

    Physics program at the CERN LHC collider started in autumn 2009. Since then, LHC daily delivers collisions between its two proton beams. This talk was devoted to the commissioning and early operation of the ATLAS Pixel Detector. The Pixel Detector is working nicely and all the required performances like efficiency, resolution and low noise were met. The fraction of working modules is as high as 97.4 %. The Pixel Detector fully participates in the reconstruction of charged particles trajectories, and is a key element in finding primary and secondary verticies and in tagging of short-lived particles.

  12. Results on 0.7% X0 thick pixel modules for the ATLAS detector

    CERN Document Server

    Netchaeva, P; Darbo, G; Einsweiler, Kevin F; Gagliardi, G; Gemme, C; Gilchriese, M G D; Oppizzi, P; Richardson, J; Rossi, L; Ruscino, E; Vernocchi, F; Znizka, G

    2001-01-01

    Modules are the basic building blocks of the ATLAS pixel detector system, they are made of a silicon sensor tile containing ~46000 pixel cells of 50 mu m*400 mu m, 16 front-end chips connected to the sensor through bump bonding, a kapton flex circuit and the module controller chip. The pixel detector is the first to encounter particles emerging from LHC interactions, minimization of radiation length of pixel modules is therefore very important. We report here on the construction techniques and on the operation of the first ATLAS pixel modules of 0.7% radiation length thickness. We have operated these modules with threshold of 3700*10+or-300*10, mean noise value of 225*10 and 0.3% dead channels. (3 refs).

  13. Results on 0.7% X0 thick pixel modules for the ATLAS detector

    International Nuclear Information System (INIS)

    Modules are the basic building blocks of the ATLAS pixel detector system, they are made of a silicon sensor tile containing ∼46 000 pixel cells of 50 μmx400 μm, 16 front-end chips connected to the sensor through bump bonding, a kapton flex circuit and the module controller chip. The Pixel detector is the first to encounter particles emerging from LHC interactions, minimization of radiation length of pixel modules is therefore very important. We report here on the construction techniques and on the operation of the first ATLAS pixel modules of 0.7% radiation length thickness. We have operated these modules with threshold of 3700x10±300x10, mean noise value of 225x10 and 0.3% dead channels

  14. Physics performance and upgrade for Run II of the ATLAS pixel detector

    International Nuclear Information System (INIS)

    The ATLAS pixel detector is the innermost detector of the ATLAS experiment at the Large Hadron Collider at CERN, providing high-resolution measurements of charged particle trajectories in the high radiation environment close to the collision region. The operation and performance of the pixel detector during the first years of LHC running are described. More than 96% of the detector modules were operational during this period, with an average intrinsic hit efficiency larger than 99%. The alignment of the detector was found to be stable at the few-micron level over long periods of time. Detector material description, tracking performances in Run I and expectations for the upcoming Run II are presented

  15. The upgraded Pixel Detector of the ATLAS Experiment for Run2 at the Large Hadron Collider

    CERN Document Server

    Backhaus, Malte; The ATLAS collaboration

    2015-01-01

    During Run-1 of the Large Hadron Collider (LHC), the ATLAS Pixel Detector has shown excellent performance. The ATLAS collaboration took advantage of the first long shutdown of the LHC during 2013 and 2014 and extracted the ATLAS Pixel Detector from the experiment, brought it to surface and maintained the services. This includes the installation of new service quarter panels, the repair of cables, and the installation of the new Diamond Beam Monitor (DBM). Additionally a completely new innermost pixel detector layer, the Insertable B-Layer (IBL), was constructed and installed in May 2014 between a new smaller beam pipe and the existing Pixel Detector. With a radius of 3.3 cm the IBL is located extremely close to the interaction point. Therefore a new readout chip and two new sensor technologies (planar and 3D) are used in IBL. In order to achieve best possible physics performance the material budget was improved with respect to the existing Pixel Detector. This is realized using lightweight staves for mechanic...

  16. Simulation of guard ring influence on the performance of ATLAS pixel detectors for inner layer replacement

    Energy Technology Data Exchange (ETDEWEB)

    Benoit, M; Lounis, A; Dinu, N [Laboratoire de l' accelerateur lineaire, Orsay (France)], E-mail: Benoit@lal.in2p3.fr

    2009-03-15

    Electric field magnitude and depletion in the bulk of silicon pixel detectors, which influence its breakdown behaviour, was studied using finite-element method to solve the drift-diffusion equation coupled to Poisson's equation in a simplified two dimensional model of the ATLAS pixel sensor. Based on this model, the number of guard rings and dead edges width were modified to investigate their influence on the detector's depletion at the edge and on its internal electrical field distribution. Finally, the 3 level model was implemented into the simulation to study the behaviour of such detector under different level of irradiation.

  17. Studies for the detector control system of the ATLAS pixel at the HL-LHC

    CERN Document Server

    Püllen, L; Boek, J; Kersten, S; Kind, P; Mättig, P; Zeitnitz, C

    2012-01-01

    experiment will be replaced completely. As part of this redesign there will also be a new pixel detector. This new pixel detector requires a control system which meets the strict space requirements for electronics in the ATLAS experiment. To accomplish this goal we propose a DCS (Detector Control System) network with the smallest form factor currently available. This network consists of a DCS chip located in close proximity to the interaction point and a DCS controller located in the outer regions of the ATLAS detector. These two types of chips form a star shaped network with several DCS chips being controlled by one DCS controller. Both chips are manufactured in deep sub-micron technology. We present prototypes with emphasis on studies concerning single event upsets.

  18. Status of the ATLAS Pixel Detector at the LHC and its performance after three years of operation

    CERN Document Server

    Andreazza, A; The ATLAS collaboration

    2012-01-01

    The ATLAS Pixel Detector is the innermost detector of the ATLAS experiment at the Large Hadron Collider at CERN, providing high-resolution measurements of charged particle tracks in the high radiation environment close to the collision region. This capability is vital for the identification and measurement of proper decay times of long-lived particles such as b-hadrons, and thus vital for the ATLAS physics program. The detector provides hermetic coverage with three cylindrical layers and three layers of forward and backward pixel detectors. It consists of approximately 80 million pixels that are individually read out via chips bump-bonded to 1744 n-in-n silicon substrates. In this talk, results from the successful operation of the Pixel Detector at the LHC and its status after three years of operation will be presented, including monitoring, calibration procedures, timing optimization and detector performance. The detector performance is excellent: ~96 % of the pixels are operational, noise occupancy and hit ...

  19. Radiation-Hard Opto-Link for the Atlas Pixel Detector

    OpenAIRE

    Gan, K. K.

    2004-01-01

    The on-detector optical link of the ATLAS pixel detector contains radiation-hard receiver chips to decode bi-phase marked signals received on PIN arrays and data transmitter chips to drive VCSEL arrays. The components are mounted on hybrid boards (opto-boards). We present results from the opto-boards and from irradiation studies with 24 GeV protons up to 33 Mrad (1.2 x 10^15 p/cm^2).

  20. The Upgraded Pixel Detector of the ATLAS Experiment for Run-2

    CERN Document Server

    Ferrere, Didier; The ATLAS collaboration

    2016-01-01

    Run-2 of the LHC is providing new challenges to track and vertex reconstruction with higher energies, denser jets and higher rates. Therefore the ATLAS experiment has constructed the first 4-layer Pixel detector in HEP, installing a new Pixel layer, also called Insertable B-Layer (IBL). IBL is a fourth layer of pixel detectors, and has been installed in May 2014 at a radius of 3.3 cm between the existing Pixel Detector and a new smaller radius beam-pipe. The new detector, built to cope with high radiation and expected occupancy, is the first large scale application of 3D detectors and CMOS 130nm technology. In addition the Pixel detector was refurbished with a new service quarter panel to recover about 3% of defective modules lost during run-1 and a new optical readout system to readout the data at higher speed while reducing the occupancy when running with increased luminosity. The commissioning and performance of the 4-layer Pixel Detector, in particular the IBL, will be presented, using collision data.

  1. Study of planar pixel sensors hardener to radiations for the upgrade of the ATLAS vertex detector

    International Nuclear Information System (INIS)

    In this work, we present a study, using TCAD (Technology Computer-Assisted Design) simulation, of the possible methods of designing planar pixel sensors by reducing their inactive area and improving their radiation hardness for use in the Insertable B-Layer (IBL) project and for SLHC upgrade phase for the ATLAS experiment. Different physical models available have been studied to develop a coherent model of radiation damage in silicon that can be used to predict silicon pixel sensor behavior after exposure to radiation. The Multi-Guard Ring Structure, a protection structure used in pixel sensor design was studied to obtain guidelines for the reduction of inactive edges detrimental to detector operation while keeping a good sensor behavior through its lifetime in the ATLAS detector. A campaign of measurement of the sensor process parameters and electrical behavior to validate and calibrate the TCAD simulation models and results are also presented. A model for diode charge collection in highly irradiated environment was developed to explain the high charge collection observed in highly irradiated devices. A simple planar pixel sensor digitization model to be used in test beam and full detector system is detailed. It allows for easy comparison between experimental data and prediction by the various radiation damage models available. The digitizer has been validated using test beam data for unirradiated sensors and can be used to produce the first full scale simulation of the ATLAS detector with the IBL that include sensor effects such as slim edge and thinning of the sensor. (author)

  2. The Layer 1 / Layer 2 readout upgrade for the ATLAS Pixel Detector

    CERN Document Server

    Mullier, Geoffrey; The ATLAS collaboration

    2016-01-01

    The Pixel Detector of the ATLAS experiment has shown excellent performance during the whole Run-1 of the Large Hadron Collider (LHC). The increase of instantaneous luminosity foreseen during the LHC Run 2, will lead to an increased detector occupancy that is expected to saturate the readout links of the outermost layers of the pixel detector: Layers 1 and 2. To ensure a smooth data taking under such conditions, the read out system of the recently installed fourth innermost pixel layer, the Insertable B-Layer, was modified to accomodate the needs of the older detector. The Layer 2 upgrade installation took place during the 2015 winter shutdown, with the Layer 1 installation scheduled for 2016. A report of the successful installation, together with the design of novel dedicated optical to electrical converters and the software and firmware updates will be presented.

  3. A Leakage Current-based Measurement of the Radiation Damage in the ATLAS Pixel Detector

    CERN Document Server

    Gorelov, Igor; The ATLAS collaboration

    2015-01-01

    A measurement has been made of the radiation damage incurred by the ATLAS Pixel Detector barrel silicon modules from the beginning of operations through the end of 2012. This translates to hadronic fluence received over the full period of operation at energies up to and including 8 TeV. The measurement is based on a per-module measurement of the silicon sensor leakage current. The results are presented as a function of integrated luminosity and compared to predictions by the Hamburg Model. This information can be used to predict limits on the lifetime of the Pixel Detector due to current, for various operating scenarios.

  4. The Pixel Detector of the ATLAS Experiment for the Run 2 at the Large Hadron Collider

    CERN Document Server

    Mandelli, B; The ATLAS collaboration

    2014-01-01

    The Pixel Detector of the ATLAS experiment has shown excellent performance during the whole Run 1 of LHC. Taking advantage of the long shutdown, the detector was extracted from the experiment and brought to surface, to equip it with new service quarter panels, to repair modules and to ease installation of the Insertable B-Layer (IBL). The IBL is a fourth layer of pixel detectors, and has been installed in May 2014 between the existing Pixel Detector and a new smaller radius beam-pipe. To cope with the high radiation and pixel occupancy due to the proximity to the interaction point, a new read-out chip and two different silicon sensor technologies (planar and 3D) have been developed. Furthermore, the physics performance will be improved through the reduction of pixel size while, targeting for a low material budget, a new mechanical support using lightweight staves and a CO$_2$ based cooling system have been adopted. The IBL construction and installation in the ATLAS Experiment has been completed very successfu...

  5. The Pixel Detector of the ATLAS Experiment for LHC Run-2

    CERN Document Server

    Pernegger, H; The ATLAS collaboration

    2014-01-01

    The Pixel Detector of the ATLAS experiment has shown excellent performance during the whole Run-1 of LHC. Taking advantage of the long showdown, the detector was extracted from the experiment and brought to surface, to equip it with new service quarter panels, to repair modules and to ease installation of the Insertable B-Layer (IBL). IBL is a fourth layer of pixel detectors, and has been installed in May 2014 between the existing Pixel Detector and a new smaller radius beam-pipe at a radius of 3.3 cm. To cope with the high radiation and pixel occupancy due to the proximity to the interaction point, a new read-out chip and two different silicon sensor technologies (planar and 3D) have been developed. Furthermore, the physics performance will be improved through the reduction of pixel size while, targeting for a low material budget, a new mechanical support using lightweight staves and a CO2 based cooling system have been adopted. An overview of the refurbishing of the Pixel Detector and of the IBL project as ...

  6. The ATLAS Pixel Detector for Run II at the Large Hadron Collider

    CERN Document Server

    Marx, Marilyn; The ATLAS collaboration

    2014-01-01

    The Pixel Detector of the ATLAS experiment has shown excellent performance during the whole Run-1 of LHC. Taking advantage of the long showdown, the detector was extracted from the experiment and brought to surface, to equip it with new service quarter panels, to repair modules and to ease installation of the Insertable B-Layer (IBL). IBL is a fourth layer of pixel detectors, and has been installed in May 2014 between the existing Pixel Detector and a new smaller radius beam-pipe at a radius of 3.3 cm. To cope with the high radiation and pixel occupancy due to the proximity to the interaction point, a new read-out chip and two different silicon sensor technologies (planar and 3D) have been developed. Furthermore, the physics performance will be improved through the reduction of pixel size while, targeting for a low material budget, a new mechanical support using lightweight staves and a CO2 based cooling system have been adopted. An overview of the refurbishing of the Pixel Detector and of the IBL project as ...

  7. The upgraded Pixel Detector of the ATLAS Experiment for Run2 at the Large Hadron Collider

    CERN Document Server

    Backhaus, Malte; The ATLAS collaboration

    2015-01-01

    Run-2 of the LHC will provide new challenges to track and vertex reconstruction with higher energies, denser jets and higher rates. Therefore the ATLAS experiment has constructed the first 4-layer Pixel detector in HEP, installing a new Pixel layer, also called Insertable B-Layer (IBL). IBL is a fourth layer of pixel detectors, and has been installed in May 2014 at a radius of 3.3 cm between the existing Pixel Detector and a new smaller radius beam-pipe. To cope with the high radiation and pixel occupancy due to the proximity to the interaction point, two different silicon sensor technologies (planar and 3D) have been developed as well as a new read-out chip within CMOS 130nm technology and with larger area, smaller pixel size and faster readout capability. The new detector is the first large scale application of of 3D detectors and CMOS 130nm technology. An overview of the lessons learned during the IBL project will be presented, focusing on the challenges and highlighting the issues met during the productio...

  8. The Pixel Detector of the ATLAS experiment for the Run2 at the Large Hadron Collider

    CERN Document Server

    Takubo, Y; The ATLAS collaboration

    2014-01-01

    The Pixel Detector of the ATLAS experiment has shown excellent performance during the whole Run-1 of LHC. Taking advantage of the long shutdown, the detector was extracted from the experiment and brought to surface, to equip it with new service quarter panels, to repair the modules and to ease installation of the Insertable B-Layer (IBL). The IBL is a fourth layer of pixel detectors, and has been installed in May 2014 between the existing Pixel Detector and a new smaller radius beam-pipe at a radius of 3.3 cm. To cope with the high radiation and pixel occupancy due to the proximity to the interaction point, a new read-out chip and two different silicon sensor technologies (planar and 3D) have been developed. Furthermore, the physics performance will be improved through the reduction of pixel size while, targeting for a low material budget, a new mechanical support using light weight staves and CO$_{2}$ based cooling system have been adopted. An overview of the refurbishing of the Pixel Detector and the IBL pr...

  9. Commissioning of the upgraded ATLAS Pixel Detector for Run2 at LHC

    CERN Document Server

    ATLAS Pixel Collaboration; The ATLAS collaboration

    2015-01-01

    The Pixel Detector of the ATLAS experiment has shown excellent performance during the whole Run-1 of LHC. Taking advantage of the long showdown, the detector was extracted from the experiment and brought to surface, to equip it with new service quarter panels, to repair modules and to ease installation of the Insertable B-Layer (IBL). IBL is a fourth layer of pixel detectors, and has been installed in May 2014 between the existing Pixel Detector and a new smaller radius beam-pipe at a radius of 3.3 cm. To cope with the high radiation and pixel occupancy due to the proximity to the interaction point, a new read-out chip and two different silicon sensor technologies (planar and 3D) have been developed. Furthermore, the physics performance will be improved through the reduction of pixel size while, targeting for a low material budget, a new mechanical support using lightweight staves and a CO2 based cooling system have been adopted. An overview of the refurbishing of the Pixel Detector and of the IBL project as ...

  10. Neural network based cluster reconstruction in the ATLAS silicon Pixel Detector

    International Nuclear Information System (INIS)

    The hit signals read out from pixels on planar semi-conductor sensors are grouped into clusters, to reconstruct the location where a charged particle passed through. The spatial resolution of the pixel detector can be improved significantly using the information from the cluster of adjacent pixels. Such analogue cluster creation techniques have been used by the ATLAS experiment for many years giving an excellent performance. However, in dense environments, such as those inside high-energy jets, it is likely that the charge deposited by two or more close-by tracks merges into one single cluster. A clusterization algorithm based on neural network methods has been developed for the ATLAS Pixel Detector. This can identify the shared clusters, split them if necessary, and estimate the positions of all particles traversing the cluster. The algorithm significantly reduces ambiguities in the assignment of pixel detector measurements to tracks within jets, and improves the positional accuracy with respect to standard interpolation techniques, by the use of the 2-dimensional charge distribution information. The reconstruction using the neural network reduces strongly the number of hits shared by more than one track and improves the resolution of the impact parameter by about 15%.

  11. The Pixel Detector of the ATLAS experiment for the Run2 at the Large Hadron Collider

    CERN Document Server

    Takubo, Yosuke

    2015-01-01

    The Pixel Detector of the ATLAS experiment has shown excellent performance during the whole Run-1 of LHC. Taking advantage of the long showdown, the detector was extracted from the experiment and brought to surface, to equip it with new service quarter panels, to repair modules and to ease installation of the Insertable B-Layer (IBL). IBL is a fourth layer of pixel detectors, and has been installed in May 2014 between the existing Pixel Detector and a new smaller radius beam-pipe at a radius of 3.3 cm. To cope with the high radiation and pixel occupancy due to the proximity to the interaction point, a new read-out chip and two different silicon sensor technologies (planar and 3D) have been developed. Furthermore, the physics performance will be improved through the reduction of pixel size while, targeting for a low material budget, a new mechanical support using lightweight staves and a CO2 based cooling system have been adopted. An overview of the refurbishing of the Pixel Detect or and of the IBL project as...

  12. The upgraded Pixel Detector of the ATLAS experiment for Run-2 at the Large Hadron Collider

    International Nuclear Information System (INIS)

    The Pixel Detector of the ATLAS experiment has shown excellent performance during the whole Run-1 of the Large Hadron Collider (LHC) . Taking advantage of Long Shutdown 1 (LS1) during 2014/2015, the Pixel Detector was brought to surface to equip it with new service panels and to repair modules. The Insertable B-Layer (IBL), a fourth layer of pixel sensors, was installed in-between the existing Pixel Detector and a new beam-pipe at a radius of 3.3 cm. To cope with the high radiation and increased pixel occupancy due to the proximity to the interaction point, two different silicon sensor technologies (planar and 3D) were used and a new readout chip has been designed with CMOS 130 nm technology with larger area, smaller pixel size and faster readout capability. Dedicated design features in combination with a new composite material were considered and used in order to reduce the material budget of the support structure while keeping the optimal thermo-mechanical performance. An overview of the lessons learned during the IBL project is presented, focusing on the challenges and highlighting the issues met during the production, integration, installation and commissioning phases of the detector. Early performance tests using cosmic and beam data are also presented

  13. ATLAS SemiConductor Tracker and Pixel Detector: Status and Performance

    CERN Document Server

    Reeves, K; The ATLAS collaboration

    2012-01-01

    The Semi-Conductor Tracker (SCT) and the Pixel Detector are the key precision tracking devices in the Inner Detector of the ATLAS experiment at CERN LHC. The SCT is a silicon strip detector and is constructed of 4088 silicon detector modules for a total of 6.3 million strips. Each module is designed, constructed and tested to operate as a stand-alone unit, mechanically, electrically, optically and thermally. The SCT silicon micro-strip sensors are processed in the planar p-in-n technology. The signals from the strips are processed in the front-end ASICS ABCD3TA, working in the binary readout mode. The Pixel Detector consists of approximately 80 million pixels that are individually read out via chips bump-bonded to 1744 n-in-n silicon substrates. In the talk the current status of the SCT and Pixel Detector will be reviewed. We will report on the operation of the detectors including an overview of the issues we encountered and the observation of significant increases in leakage currents (as expected) from bulk ...

  14. The Pixel Detector of the ATLAS Experiment for LHC Run-2

    CERN Document Server

    Pernegger, Heinz; The ATLAS collaboration

    2015-01-01

    The Pixel Detector of the ATLAS experiment has shown excellent performance during the whole Run-1 of LHC. Taking advantage of the long shutdown, the detector was extracted from the experiment and brought to surface, to equip it with new service quarter panels, to repair modules and to ease installation of the Insertable B-Layer (IBL). IBL is a fourth layer of pixel detectors, and has been installed in May 2014 between the existing Pixel Detector and a new smaller radius beam-pipe at a radius of 3.3 cm. To cope with the high radiation and hit occupancy due to the proximity to the interaction point, a new read-out chip and two different silicon sensor technologies (planar and 3D) have been developed. Furthermore, the physics performance will be improved through the reduction of pixel size while, targeting for a low material budget, a new mechanical support using lightweight staves and a CO2 based cooling system have been adopted. An overview of the refurbishing of the Pixel Detector and of the IBL project as we...

  15. Pixel detectors

    CERN Document Server

    Passmore, M S

    2001-01-01

    positions on the detector. The loss of secondary electrons follows the profile of the detector and increases with higher energy ions. studies of the spatial resolution predict a value of 5.3 lp/mm. The image noise in photon counting systems is investigated theoretically and experimentally and is shown to be given by Poisson statistics. The rate capability of the LAD1 was measured to be 250 kHz per pixel. Theoretical and experimental studies of the difference in contrast for ideal charge integrating and photon counting imaging systems were carried out. It is shown that the contrast differs and that for the conventional definition (contrast = (background - signal)/background) the photon counting device will, in some cases, always give a better contrast than the integrating system. Simulations in MEDICI are combined with analytical calculations to investigate charge collection efficiencies (CCE) in semiconductor detectors. Different pixel sizes and biasing conditions are considered. The results show charge shari...

  16. Robustness of the Artificial Neural Networks Used for Clustering in the ATLAS Pixel Detector

    CERN Document Server

    The ATLAS collaboration

    2015-01-01

    A study of the robustness of the ATLAS pixel neural network clustering algorithm is presented. The sensitivity to variations to its input is evaluated. These variations are motivated by potential discrepancies between data and simulation due to uncertainties in the modelling of pixel clusters in simulation, as well as uncertainties from the detector calibration. Within reasonable variation magnitudes, the neural networks prove to be robust to most variations. The neural network used to identify pixel clusters created by multiple charged particles, is most sensitive to variations affecting the total amount of charge collected in the cluster. Modifying the read-out threshold has the biggest effect on the clustering's ability to estimate the position of the particle's intersection with the detector.

  17. A neural network clustering algorithm for the ATLAS silicon pixel detector

    CERN Document Server

    Aad, Georges; Abdallah, Jalal; Abdel Khalek, Samah; Abdinov, Ovsat; Aben, Rosemarie; Abi, Babak; Abolins, Maris; AbouZeid, Ossama; Abramowicz, Halina; Abreu, Henso; Abreu, Ricardo; Abulaiti, Yiming; Acharya, Bobby Samir; Adamczyk, Leszek; Adams, David; Adelman, Jahred; Adomeit, Stefanie; Adye, Tim; Agatonovic-Jovin, Tatjana; Aguilar-Saavedra, Juan Antonio; Agustoni, Marco; Ahlen, Steven; Ahmadov, Faig; Aielli, Giulio; Akerstedt, Henrik; Åkesson, Torsten Paul Ake; Akimoto, Ginga; Akimov, Andrei; Alberghi, Gian Luigi; Albert, Justin; Albrand, Solveig; Alconada Verzini, Maria Josefina; Aleksa, Martin; Aleksandrov, Igor; Alexa, Calin; Alexander, Gideon; Alexandre, Gauthier; Alexopoulos, Theodoros; Alhroob, Muhammad; Alimonti, Gianluca; Alio, Lion; Alison, John; Allbrooke, Benedict; Allison, Lee John; Allport, Phillip; Almond, John; Aloisio, Alberto; Alonso, Alejandro; Alonso, Francisco; Alpigiani, Cristiano; Altheimer, Andrew David; Alvarez Gonzalez, Barbara; Alviggi, Mariagrazia; Amako, Katsuya; Amaral Coutinho, Yara; Amelung, Christoph; Amidei, Dante; Amor Dos Santos, Susana Patricia; Amorim, Antonio; Amoroso, Simone; Amram, Nir; Amundsen, Glenn; Anastopoulos, Christos; Ancu, Lucian Stefan; Andari, Nansi; Andeen, Timothy; Anders, Christoph Falk; Anders, Gabriel; Anderson, Kelby; Andreazza, Attilio; Andrei, George Victor; Anduaga, Xabier; Angelidakis, Stylianos; Angelozzi, Ivan; Anger, Philipp; Angerami, Aaron; Anghinolfi, Francis; Anisenkov, Alexey; Anjos, Nuno; Annovi, Alberto; Antonaki, Ariadni; Antonelli, Mario; Antonov, Alexey; Antos, Jaroslav; Anulli, Fabio; Aoki, Masato; Aperio Bella, Ludovica; Apolle, Rudi; Arabidze, Giorgi; Aracena, Ignacio; Arai, Yasuo; Araque, Juan Pedro; Arce, Ayana; Arguin, Jean-Francois; Argyropoulos, Spyridon; Arik, Metin; Armbruster, Aaron James; Arnaez, Olivier; Arnal, Vanessa; Arnold, Hannah; Arratia, Miguel; Arslan, Ozan; Artamonov, Andrei; Artoni, Giacomo; Asai, Shoji; Asbah, Nedaa; Ashkenazi, Adi; Åsman, Barbro; Asquith, Lily; Assamagan, Ketevi; Astalos, Robert; Atkinson, Markus; Atlay, Naim Bora; Auerbach, Benjamin; Augsten, Kamil; Aurousseau, Mathieu; Avolio, Giuseppe; Azuelos, Georges; Azuma, Yuya; Baak, Max; Baas, Alessandra; Bacci, Cesare; Bachacou, Henri; Bachas, Konstantinos; Backes, Moritz; Backhaus, Malte; Backus Mayes, John; Badescu, Elisabeta; Bagiacchi, Paolo; Bagnaia, Paolo; Bai, Yu; Bain, Travis; Baines, John; Baker, Oliver Keith; Balek, Petr; Balli, Fabrice; Banas, Elzbieta; Banerjee, Swagato; Bannoura, Arwa A E; Bansal, Vikas; Bansil, Hardeep Singh; Barak, Liron; Baranov, Sergei; Barberio, Elisabetta Luigia; Barberis, Dario; Barbero, Marlon; Barillari, Teresa; Barisonzi, Marcello; Barklow, Timothy; Barlow, Nick; Barnett, Bruce; Barnett, Michael; Barnovska, Zuzana; Baroncelli, Antonio; Barone, Gaetano; Barr, Alan; Barreiro, Fernando; Barreiro Guimarães da Costa, João; Bartoldus, Rainer; Barton, Adam Edward; Bartos, Pavol; Bartsch, Valeria; Bassalat, Ahmed; Basye, Austin; Bates, Richard; Batkova, Lucia; Batley, Richard; Battaglia, Marco; Battistin, Michele; Bauer, Florian; Bawa, Harinder Singh; Beau, Tristan; Beauchemin, Pierre-Hugues; Beccherle, Roberto; Bechtle, Philip; Beck, Hans Peter; Becker, Anne Kathrin; Becker, Sebastian; Beckingham, Matthew; Becot, Cyril; Beddall, Andrew; Beddall, Ayda; Bedikian, Sourpouhi; Bednyakov, Vadim; Bee, Christopher; Beemster, Lars; Beermann, Thomas; Begel, Michael; Behr, Katharina; Belanger-Champagne, Camille; Bell, Paul; Bell, William; Bella, Gideon; Bellagamba, Lorenzo; Bellerive, Alain; Bellomo, Massimiliano; Belotskiy, Konstantin; Beltramello, Olga; Benary, Odette; Benchekroun, Driss; Bendtz, Katarina; Benekos, Nektarios; Benhammou, Yan; Benhar Noccioli, Eleonora; Benitez Garcia, Jorge-Armando; Benjamin, Douglas; Bensinger, James; Benslama, Kamal; Bentvelsen, Stan; Berge, David; Bergeaas Kuutmann, Elin; Berger, Nicolas; Berghaus, Frank; Beringer, Jürg; Bernard, Clare; Bernat, Pauline; Bernius, Catrin; Bernlochner, Florian Urs; Berry, Tracey; Berta, Peter; Bertella, Claudia; 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Cuhadar Donszelmann, Tulay; Cummings, Jane; Curatolo, Maria; Cuthbert, Cameron; Czirr, Hendrik; Czodrowski, Patrick; Czyczula, Zofia; D'Auria, Saverio; D'Onofrio, Monica; Da Cunha Sargedas De Sousa, Mario Jose; Da Via, Cinzia; Dabrowski, Wladyslaw; Dafinca, Alexandru; Dai, Tiesheng; Dale, Orjan; Dallaire, Frederick; Dallapiccola, Carlo; Dam, Mogens; Daniells, Andrew Christopher; Dano Hoffmann, Maria; Dao, Valerio; Darbo, Giovanni; Darmora, Smita; Dassoulas, James; Dattagupta, Aparajita; Davey, Will; David, Claire; Davidek, Tomas; Davies, Eleanor; Davies, Merlin; Davignon, Olivier; Davison, Adam; Davison, Peter; Davygora, Yuriy; Dawe, Edmund; Dawson, Ian; Daya-Ishmukhametova, Rozmin; De, Kaushik; de Asmundis, Riccardo; De Castro, Stefano; De Cecco, Sandro; De Groot, Nicolo; de Jong, Paul; De la Torre, Hector; De Lorenzi, Francesco; De Nooij, Lucie; De Pedis, Daniele; De Salvo, Alessandro; De Sanctis, Umberto; De Santo, Antonella; De Vivie De Regie, Jean-Baptiste; Dearnaley, William James; Debbe, Ramiro; Debenedetti, Chiara; Dechenaux, Benjamin; Dedovich, Dmitri; Deigaard, Ingrid; Del Peso, Jose; Del Prete, Tarcisio; Deliot, Frederic; Delitzsch, Chris Malena; Deliyergiyev, Maksym; Dell'Acqua, Andrea; Dell'Asta, Lidia; Dell'Orso, Mauro; Della Pietra, Massimo; della Volpe, Domenico; Delmastro, Marco; Delsart, Pierre-Antoine; Deluca, Carolina; Demers, Sarah; Demichev, Mikhail; Demilly, Aurelien; Denisov, Sergey; Derendarz, Dominik; Derkaoui, Jamal Eddine; Derue, Frederic; Dervan, Paul; Desch, Klaus Kurt; Deterre, Cecile; Deviveiros, Pier-Olivier; Dewhurst, Alastair; Dhaliwal, Saminder; Di Ciaccio, Anna; Di Ciaccio, Lucia; Di Domenico, Antonio; Di Donato, Camilla; Di Girolamo, Alessandro; Di Girolamo, Beniamino; Di Mattia, Alessandro; Di Micco, Biagio; Di Nardo, Roberto; Di Simone, Andrea; Di Sipio, Riccardo; Di Valentino, David; Dias, Flavia; Diaz, Marco Aurelio; Diehl, Edward; Dietrich, Janet; Dietzsch, Thorsten; Diglio, Sara; Dimitrievska, Aleksandra; Dingfelder, Jochen; 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Ferrari, Roberto; Ferreira de Lima, Danilo Enoque; Ferrer, Antonio; Ferrere, Didier; Ferretti, Claudio; Ferretto Parodi, Andrea; Fiascaris, Maria; Fiedler, Frank; Filipčič, Andrej; Filipuzzi, Marco; Filthaut, Frank; Fincke-Keeler, Margret; Finelli, Kevin Daniel; Fiolhais, Miguel; Fiorini, Luca; Firan, Ana; Fischer, Adam; Fischer, Julia; Fisher, Wade Cameron; Fitzgerald, Eric Andrew; Flechl, Martin; Fleck, Ivor; Fleischmann, Philipp; Fleischmann, Sebastian; Fletcher, Gareth Thomas; Fletcher, Gregory; Flick, Tobias; Floderus, Anders; Flores Castillo, Luis; Florez Bustos, Andres Carlos; Flowerdew, Michael; Formica, Andrea; Forti, Alessandra; Fortin, Dominique; Fournier, Daniel; Fox, Harald; Fracchia, Silvia; Francavilla, Paolo; Franchini, Matteo; Franchino, Silvia; Francis, David; Franklin, Melissa; Franz, Sebastien; Fraternali, Marco; French, Sky; Friedrich, Conrad; Friedrich, Felix; Froidevaux, Daniel; Frost, James; Fukunaga, Chikara; Fullana Torregrosa, Esteban; Fulsom, Bryan Gregory; Fuster, Juan; Gabaldon, Carolina; Gabizon, Ofir; Gabrielli, Alessandro; Gabrielli, Andrea; Gadatsch, Stefan; Gadomski, Szymon; Gagliardi, Guido; Gagnon, Pauline; Galea, Cristina; Galhardo, Bruno; Gallas, Elizabeth; Gallo, Valentina Santina; Gallop, Bruce; Gallus, Petr; Galster, Gorm Aske Gram Krohn; Gan, KK; Gandrajula, Reddy Pratap; Gao, Jun; Gao, Yongsheng; Garay Walls, Francisca; Garberson, Ford; García, Carmen; García Navarro, José Enrique; Garcia-Sciveres, Maurice; Gardner, Robert; Garelli, Nicoletta; Garonne, Vincent; Gatti, Claudio; Gaudio, Gabriella; Gaur, Bakul; Gauthier, Lea; Gauzzi, Paolo; Gavrilenko, Igor; Gay, Colin; Gaycken, Goetz; Gazis, Evangelos; Ge, Peng; Gecse, Zoltan; Gee, Norman; Geerts, Daniël Alphonsus Adrianus; Geich-Gimbel, Christoph; Gellerstedt, Karl; Gemme, Claudia; Gemmell, Alistair; Genest, Marie-Hélène; Gentile, Simonetta; George, Matthias; George, Simon; Gerbaudo, Davide; Gershon, Avi; Ghazlane, Hamid; Ghodbane, Nabil; Giacobbe, Benedetto; Giagu, Stefano; Giangiobbe, Vincent; Giannetti, Paola; Gianotti, Fabiola; Gibbard, Bruce; Gibson, Stephen; Gilchriese, Murdock; Gillam, Thomas; Gillberg, Dag; Gilles, Geoffrey; Gingrich, Douglas; Giokaris, Nikos; Giordani, MarioPaolo; Giordano, Raffaele; Giorgi, Filippo Maria; Giorgi, Francesco Michelangelo; Giraud, Pierre-Francois; Giugni, Danilo; Giuliani, Claudia; Giulini, Maddalena; Gjelsten, Børge Kile; Gkaitatzis, Stamatios; Gkialas, Ioannis; Gladilin, Leonid; Glasman, Claudia; Glatzer, Julian; Glaysher, Paul; Glazov, Alexandre; Glonti, George; Goblirsch-Kolb, Maximilian; Goddard, Jack Robert; Godfrey, Jennifer; Godlewski, Jan; Goeringer, Christian; Goldfarb, Steven; Golling, Tobias; Golubkov, Dmitry; Gomes, Agostinho; Gomez Fajardo, Luz Stella; Gonçalo, Ricardo; Goncalves Pinto Firmino Da Costa, Joao; Gonella, Laura; González de la Hoz, Santiago; Gonzalez Parra, Garoe; Gonzalez-Sevilla, Sergio; Goossens, Luc; Gorbounov, Petr Andreevich; Gordon, Howard; Gorelov, Igor; Gorini, Benedetto; Gorini, Edoardo; Gorišek, Andrej; Gornicki, Edward; Goshaw, Alfred; Gössling, Claus; Gostkin, Mikhail Ivanovitch; Gouighri, Mohamed; Goujdami, Driss; Goulette, Marc Phillippe; Goussiou, Anna; Goy, Corinne; Gozpinar, Serdar; Grabas, Herve Marie Xavier; Graber, Lars; Grabowska-Bold, Iwona; Grafström, Per; Grahn, Karl-Johan; Gramling, Johanna; Gramstad, Eirik; Grancagnolo, Sergio; Grassi, Valerio; Gratchev, Vadim; Gray, Heather; Graziani, Enrico; Grebenyuk, Oleg; Greenwood, Zeno Dixon; Gregersen, Kristian; Gregor, Ingrid-Maria; Grenier, Philippe; Griffiths, Justin; Grillo, Alexander; Grimm, Kathryn; Grinstein, Sebastian; Gris, Philippe Luc Yves; Grishkevich, Yaroslav; Grivaz, Jean-Francois; Grohs, Johannes Philipp; Grohsjean, Alexander; Gross, Eilam; Grosse-Knetter, Joern; Grossi, Giulio Cornelio; Groth-Jensen, Jacob; Grout, Zara Jane; Guan, Liang; Guescini, Francesco; Guest, Daniel; Gueta, Orel; Guicheney, Christophe; Guido, Elisa; Guillemin, Thibault; Guindon, Stefan; Gul, Umar; Gumpert, Christian; Gunther, Jaroslav; Guo, Jun; Gupta, Shaun; Gutierrez, Phillip; Gutierrez Ortiz, Nicolas Gilberto; Gutschow, Christian; Guttman, Nir; Guyot, Claude; Gwenlan, Claire; Gwilliam, Carl; Haas, Andy; Haber, Carl; Hadavand, Haleh Khani; Haddad, Nacim; Haefner, Petra; Hageböck, Stephan; Hajduk, Zbigniew; Hakobyan, Hrachya; Haleem, Mahsana; Hall, David; Halladjian, Garabed; Hamacher, Klaus; Hamal, Petr; Hamano, Kenji; Hamer, Matthias; Hamilton, Andrew; Hamilton, Samuel; Hamnett, Phillip George; Han, Liang; Hanagaki, Kazunori; Hanawa, Keita; Hance, Michael; Hanke, Paul; Hanna, Remie; Hansen, Jørgen Beck; Hansen, Jorn Dines; Hansen, Peter Henrik; Hara, Kazuhiko; Hard, Andrew; Harenberg, Torsten; Hariri, Faten; Harkusha, Siarhei; Harper, Devin; Harrington, Robert; Harris, Orin; Harrison, Paul Fraser; Hartjes, Fred; Hasegawa, Satoshi; Hasegawa, Yoji; Hasib, A; Hassani, Samira; Haug, Sigve; Hauschild, Michael; Hauser, Reiner; Havranek, Miroslav; Hawkes, Christopher; Hawkings, Richard John; Hawkins, Anthony David; Hayashi, Takayasu; Hayden, Daniel; Hays, Chris; Hayward, Helen; Haywood, Stephen; Head, Simon; Heck, Tobias; Hedberg, Vincent; Heelan, Louise; Heim, Sarah; Heim, Timon; Heinemann, Beate; Heinrich, Lukas; Hejbal, Jiri; Helary, Louis; Heller, Claudio; Heller, Matthieu; Hellman, Sten; Hellmich, Dennis; Helsens, Clement; Henderson, James; Henderson, Robert; Heng, Yang; Hengler, Christopher; Henrichs, Anna; Henriques Correia, Ana Maria; Henrot-Versille, Sophie; Hensel, Carsten; Herbert, Geoffrey Henry; Hernández Jiménez, Yesenia; Herrberg-Schubert, Ruth; Herten, Gregor; Hertenberger, Ralf; Hervas, Luis; Hesketh, Gavin Grant; Hessey, Nigel; Hickling, Robert; Higón-Rodriguez, Emilio; Hill, Ewan; Hill, John; Hiller, Karl Heinz; Hillert, Sonja; Hillier, Stephen; Hinchliffe, Ian; Hines, Elizabeth; Hirose, Minoru; Hirschbuehl, Dominic; Hobbs, John; Hod, Noam; Hodgkinson, Mark; Hodgson, Paul; Hoecker, Andreas; Hoeferkamp, Martin; Hoffman, Julia; Hoffmann, Dirk; Hofmann, Julia Isabell; Hohlfeld, Marc; Holmes, Tova Ray; Hong, Tae Min; Hooft van Huysduynen, Loek; Hostachy, Jean-Yves; Hou, Suen; Hoummada, Abdeslam; Howard, Jacob; Howarth, James; Hrabovsky, Miroslav; Hristova, Ivana; Hrivnac, Julius; Hryn'ova, Tetiana; Hsu, Catherine; Hsu, Pai-hsien Jennifer; Hsu, Shih-Chieh; Hu, Diedi; Hu, Xueye; Huang, Yanping; Hubacek, Zdenek; Hubaut, Fabrice; Huegging, Fabian; Huffman, Todd Brian; Hughes, Emlyn; Hughes, Gareth; Huhtinen, Mika; Hülsing, Tobias Alexander; Hurwitz, Martina; Huseynov, Nazim; Huston, Joey; Huth, John; Iacobucci, Giuseppe; Iakovidis, Georgios; Ibragimov, Iskander; Iconomidou-Fayard, Lydia; Ideal, Emma; Iengo, Paolo; Igonkina, Olga; Iizawa, Tomoya; Ikegami, Yoichi; Ikematsu, Katsumasa; Ikeno, Masahiro; Ilchenko, Iurii; Iliadis, Dimitrios; Ilic, Nikolina; Inamaru, Yuki; Ince, Tayfun; Ioannou, Pavlos; Iodice, Mauro; Iordanidou, Kalliopi; Ippolito, Valerio; Irles Quiles, Adrian; Isaksson, Charlie; Ishino, Masaya; Ishitsuka, Masaki; Ishmukhametov, Renat; Issever, Cigdem; Istin, Serhat; Iturbe Ponce, Julia Mariana; Iuppa, Roberto; Ivarsson, Jenny; Iwanski, Wieslaw; Iwasaki, Hiroyuki; Izen, Joseph; Izzo, Vincenzo; Jackson, Brett; Jackson, Matthew; Jackson, Paul; Jaekel, Martin; Jain, Vivek; Jakobs, Karl; Jakobsen, Sune; Jakoubek, Tomas; Jakubek, Jan; Jamin, David Olivier; Jana, Dilip; Jansen, Eric; Jansen, Hendrik; Janssen, Jens; Janus, Michel; Jarlskog, Göran; Javadov, Namig; Javůrek, Tomáš; Jeanty, Laura; Jejelava, Juansher; Jeng, Geng-yuan; Jennens, David; Jenni, Peter; Jentzsch, Jennifer; Jeske, Carl; Jézéquel, Stéphane; Ji, Haoshuang; Ji, Weina; Jia, Jiangyong; Jiang, Yi; Jimenez Belenguer, Marcos; Jin, Shan; Jinaru, Adam; Jinnouchi, Osamu; Joergensen, Morten Dam; Johansson, Erik; Johansson, Per; Johns, Kenneth; Jon-And, Kerstin; Jones, Graham; Jones, Roger; Jones, Tim; Jongmanns, Jan; Jorge, Pedro; Joshi, Kiran Daniel; Jovicevic, Jelena; Ju, Xiangyang; Jung, Christian; Jungst, Ralph Markus; Jussel, Patrick; Juste Rozas, Aurelio; Kaci, Mohammed; Kaczmarska, Anna; Kado, Marumi; Kagan, Harris; Kagan, Michael; Kajomovitz, Enrique; Kalderon, Charles William; Kama, Sami; Kamenshchikov, Andrey; Kanaya, Naoko; Kaneda, Michiru; Kaneti, Steven; Kantserov, Vadim; Kanzaki, Junichi; Kaplan, Benjamin; Kapliy, Anton; Kar, Deepak; Karakostas, Konstantinos; Karastathis, Nikolaos; Karnevskiy, Mikhail; Karpov, Sergey; Karpova, Zoya; Karthik, Krishnaiyengar; Kartvelishvili, Vakhtang; Karyukhin, Andrey; Kashif, Lashkar; Kasieczka, Gregor; Kass, Richard; Kastanas, Alex; Kataoka, Yousuke; Katre, Akshay; Katzy, Judith; Kaushik, Venkatesh; Kawagoe, Kiyotomo; Kawamoto, Tatsuo; Kawamura, Gen; Kazama, Shingo; Kazanin, Vassili; Kazarinov, Makhail; Keeler, Richard; Kehoe, Robert; Keil, Markus; Keller, John; Kempster, Jacob Julian; Keoshkerian, Houry; Kepka, Oldrich; Kerševan, Borut Paul; Kersten, Susanne; Kessoku, Kohei; Keung, Justin; Khalil-zada, Farkhad; Khandanyan, Hovhannes; Khanov, Alexander; Khodinov, Alexander; Khomich, Andrei; Khoo, Teng Jian; Khoriauli, Gia; Khoroshilov, Andrey; Khovanskiy, Valery; Khramov, Evgeniy; Khubua, Jemal; Kim, Hee Yeun; Kim, Hyeon Jin; Kim, Shinhong; Kimura, Naoki; Kind, Oliver; King, Barry; King, Matthew; King, Robert Steven Beaufoy; King, Samuel Burton; Kirk, Julie; Kiryunin, Andrey; Kishimoto, Tomoe; Kisielewska, Danuta; Kiss, Florian; Kittelmann, Thomas; Kiuchi, Kenji; Kladiva, Eduard; Klein, Max; Klein, Uta; Kleinknecht, Konrad; Klimek, Pawel; Klimentov, Alexei; Klingenberg, Reiner; Klinger, Joel Alexander; Klioutchnikova, Tatiana; Klok, Peter; Kluge, Eike-Erik; Kluit, Peter; Kluth, Stefan; Kneringer, Emmerich; Knoops, Edith; Knue, Andrea; Kobayashi, Dai; Kobayashi, Tomio; Kobel, Michael; Kocian, Martin; Kodys, Peter; Koevesarki, Peter; Koffas, Thomas; Koffeman, Els; Kogan, Lucy Anne; Kohlmann, Simon; Kohout, Zdenek; Kohriki, Takashi; Koi, Tatsumi; Kolanoski, Hermann; Koletsou, Iro; Koll, James; Komar, Aston; Komori, Yuto; Kondo, Takahiko; Kondrashova, Nataliia; Köneke, Karsten; König, Adriaan; König, Sebastian; Kono, Takanori; Konoplich, Rostislav; Konstantinidis, Nikolaos; Kopeliansky, Revital; Koperny, Stefan; Köpke, Lutz; Kopp, Anna Katharina; Korcyl, Krzysztof; Kordas, Kostantinos; Korn, Andreas; Korol, Aleksandr; Korolkov, Ilya; Korolkova, Elena; Korotkov, Vladislav; Kortner, Oliver; Kortner, Sandra; Kostyukhin, Vadim; Kotov, Vladislav; Kotwal, Ashutosh; Kourkoumelis, Christine; Kouskoura, Vasiliki; Koutsman, Alex; Kowalewski, Robert Victor; Kowalski, Tadeusz; Kozanecki, Witold; Kozhin, Anatoly; Kral, Vlastimil; Kramarenko, Viktor; Kramberger, Gregor; Krasnopevtsev, Dimitriy; Krasny, Mieczyslaw Witold; Krasznahorkay, Attila; Kraus, Jana; Kravchenko, Anton; Kreiss, Sven; Kretz, Moritz; Kretzschmar, Jan; Kreutzfeldt, Kristof; Krieger, Peter; Kroeninger, Kevin; Kroha, Hubert; Kroll, Joe; Kroseberg, Juergen; Krstic, Jelena; Kruchonak, Uladzimir; Krüger, Hans; Kruker, Tobias; Krumnack, Nils; Krumshteyn, Zinovii; Kruse, Amanda; Kruse, Mark; Kruskal, Michael; Kubota, Takashi; Kuday, Sinan; Kuehn, Susanne; Kugel, Andreas; Kuhl, Andrew; Kuhl, Thorsten; Kukhtin, Victor; Kulchitsky, Yuri; Kuleshov, Sergey; Kuna, Marine; Kunkle, Joshua; Kupco, Alexander; Kurashige, Hisaya; Kurochkin, Yurii; Kurumida, Rie; Kus, Vlastimil; Kuwertz, Emma Sian; Kuze, Masahiro; Kvita, Jiri; La Rosa, Alessandro; La Rotonda, Laura; Lacasta, Carlos; Lacava, Francesco; Lacey, James; Lacker, Heiko; Lacour, Didier; Lacuesta, Vicente Ramón; Ladygin, Evgueni; Lafaye, Remi; Laforge, Bertrand; Lagouri, Theodota; Lai, Stanley; Laier, Heiko; Lambourne, Luke; Lammers, Sabine; Lampen, Caleb; Lampl, Walter; Lançon, Eric; Landgraf, Ulrich; Landon, Murrough; Lang, Valerie Susanne; Lankford, Andrew; Lanni, Francesco; Lantzsch, Kerstin; Laplace, Sandrine; Lapoire, Cecile; Laporte, Jean-Francois; Lari, Tommaso; Lassnig, Mario; Laurelli, Paolo; Lavrijsen, Wim; Law, Alexander; Laycock, Paul; Le, Bao Tran; Le Dortz, Olivier; Le Guirriec, Emmanuel; Le Menedeu, Eve; LeCompte, Thomas; Ledroit-Guillon, Fabienne Agnes Marie; Lee, Claire, Alexandra; Lee, Hurng-Chun; Lee, Jason; Lee, Shih-Chang; Lee, Lawrence; Lefebvre, Guillaume; Lefebvre, Michel; Legger, Federica; Leggett, Charles; Lehan, Allan; Lehmacher, Marc; Lehmann Miotto, Giovanna; Lei, Xiaowen; Leight, William Axel; Leisos, Antonios; Leister, Andrew Gerard; Leite, Marco Aurelio Lisboa; Leitner, Rupert; Lellouch, Daniel; Lemmer, Boris; Leney, Katharine; Lenz, Tatjana; Lenzen, Georg; Lenzi, Bruno; Leone, Robert; Leone, Sandra; Leonhardt, Kathrin; Leonidopoulos, Christos; Leontsinis, Stefanos; Leroy, Claude; Lester, Christopher; Lester, Christopher Michael; Levchenko, Mikhail; Levêque, Jessica; Levin, Daniel; Levinson, Lorne; Levy, Mark; Lewis, Adrian; Lewis, George; Leyko, Agnieszka; Leyton, Michael; Li, Bing; Li, Bo; Li, Haifeng; Li, Ho Ling; Li, Lei; Li, Liang; Li, Shu; Li, Yichen; Liang, Zhijun; Liao, Hongbo; Liberti, Barbara; Lichard, Peter; Lie, Ki; Liebal, Jessica; Liebig, Wolfgang; Limbach, Christian; Limosani, Antonio; Lin, Simon; Lin, Tai-Hua; Linde, Frank; Lindquist, Brian Edward; Linnemann, James; Lipeles, Elliot; Lipniacka, Anna; Lisovyi, Mykhailo; Liss, Tony; Lissauer, David; Lister, Alison; Litke, Alan; Liu, Bo; Liu, Dong; Liu, Jianbei; Liu, Kun; Liu, Lulu; Liu, Miaoyuan; Liu, Minghui; Liu, Yanwen; Livan, Michele; Livermore, Sarah; Lleres, Annick; Llorente Merino, Javier; Lloyd, Stephen; Lo Sterzo, Francesco; Lobodzinska, Ewelina; Loch, Peter; Lockman, William; Loddenkoetter, Thomas; Loebinger, Fred; Loevschall-Jensen, Ask Emil; Loginov, Andrey; Loh, Chang Wei; Lohse, Thomas; Lohwasser, Kristin; Lokajicek, Milos; Lombardo, Vincenzo Paolo; Long, Brian Alexander; Long, Jonathan; Long, Robin Eamonn; Lopes, Lourenco; Lopez Mateos, David; Lopez Paredes, Brais; Lopez Paz, Ivan; Lorenz, Jeanette; Lorenzo Martinez, Narei; Losada, Marta; Loscutoff, Peter; Lou, XinChou; Lounis, Abdenour; Love, Jeremy; Love, Peter; Lowe, Andrew; Lu, Feng; Lubatti, Henry; Luci, Claudio; Lucotte, Arnaud; Luehring, Frederick; Lukas, Wolfgang; Luminari, Lamberto; Lundberg, Olof; Lund-Jensen, Bengt; Lungwitz, Matthias; Lynn, David; Lysak, Roman; Lytken, Else; Ma, Hong; Ma, Lian Liang; Maccarrone, Giovanni; Macchiolo, Anna; Machado Miguens, Joana; Macina, Daniela; Madaffari, Daniele; Madar, Romain; Maddocks, Harvey Jonathan; Mader, Wolfgang; Madsen, Alexander; Maeno, Mayuko; Maeno, Tadashi; Magradze, Erekle; Mahboubi, Kambiz; Mahlstedt, Joern; Mahmoud, Sara; Maiani, Camilla; Maidantchik, Carmen; Maier, Andreas Alexander; Maio, Amélia; Majewski, Stephanie; Makida, Yasuhiro; Makovec, Nikola; Mal, Prolay; Malaescu, Bogdan; Malecki, Pawel; Maleev, Victor; Malek, Fairouz; Mallik, Usha; Malon, David; Malone, Caitlin; Maltezos, Stavros; Malyshev, Vladimir; Malyukov, Sergei; Mamuzic, Judita; Mandelli, Beatrice; Mandelli, Luciano; Mandić, Igor; Mandrysch, Rocco; Maneira, José; Manfredini, Alessandro; Manhaes de Andrade Filho, Luciano; Manjarres Ramos, Joany Andreina; Mann, Alexander; Manning, Peter; Manousakis-Katsikakis, Arkadios; Mansoulie, Bruno; Mantifel, Rodger; Mapelli, Livio; March, Luis; Marchand, Jean-Francois; Marchiori, Giovanni; Marcisovsky, Michal; Marino, Christopher; Marjanovic, Marija; Marques, Carlos; Marroquim, Fernando; Marsden, Stephen Philip; Marshall, Zach; Marti, Lukas Fritz; Marti-Garcia, Salvador; Martin, Brian; Martin, Brian; Martin, Tim; Martin, Victoria Jane; Martin dit Latour, Bertrand; Martinez, Homero; Martinez, Mario; Martin-Haugh, Stewart; Martyniuk, Alex; Marx, Marilyn; Marzano, Francesco; Marzin, Antoine; Masetti, Lucia; Mashimo, Tetsuro; Mashinistov, Ruslan; Masik, Jiri; Maslennikov, Alexey; Massa, Ignazio; Massol, Nicolas; Mastrandrea, Paolo; Mastroberardino, Anna; Masubuchi, Tatsuya; Mättig, Peter; Mattmann, Johannes; Maurer, Julien; Maxfield, Stephen; Maximov, Dmitriy; Mazini, Rachid; Mazzaferro, Luca; Mc Goldrick, Garrin; Mc Kee, Shawn Patrick; McCarn, Allison; McCarthy, Robert; McCarthy, Tom; McCubbin, Norman; McFarlane, Kenneth; Mcfayden, Josh; Mchedlidze, Gvantsa; McMahon, Steve; McPherson, Robert; Meade, Andrew; Mechnich, Joerg; Medinnis, Michael; Meehan, Samuel; Mehlhase, Sascha; Mehta, Andrew; Meier, Karlheinz; Meineck, Christian; Meirose, Bernhard; Melachrinos, Constantinos; Mellado Garcia, Bruce Rafael; Meloni, Federico; Mengarelli, Alberto; Menke, Sven; Meoni, Evelin; Mercurio, Kevin Michael; Mergelmeyer, Sebastian; Meric, Nicolas; Mermod, Philippe; Merola, Leonardo; Meroni, Chiara; Merritt, Frank; Merritt, Hayes; Messina, Andrea; Metcalfe, Jessica; Mete, Alaettin Serhan; Meyer, Carsten; Meyer, Christopher; Meyer, Jean-Pierre; Meyer, Jochen; Middleton, Robin; Migas, Sylwia; Mijović, Liza; Mikenberg, Giora; Mikestikova, Marcela; Mikuž, Marko; Milic, Adriana; Miller, David; Mills, Corrinne; Milov, Alexander; Milstead, David; Milstein, Dmitry; Minaenko, Andrey; Minashvili, Irakli; Mincer, Allen; Mindur, Bartosz; Mineev, Mikhail; Ming, Yao; Mir, Lluisa-Maria; Mirabelli, Giovanni; Mitani, Takashi; Mitrevski, Jovan; Mitsou, Vasiliki A; Mitsui, Shingo; Miucci, Antonio; Miyagawa, Paul; Mjörnmark, Jan-Ulf; Moa, Torbjoern; Mochizuki, Kazuya; Mohapatra, Soumya; Mohr, Wolfgang; Molander, Simon; Moles-Valls, Regina; Mönig, Klaus; Monini, Caterina; Monk, James; Monnier, Emmanuel; Montejo Berlingen, Javier; Monticelli, Fernando; Monzani, Simone; Moore, Roger; Moraes, Arthur; Morange, Nicolas; Moreno, Deywis; Moreno Llácer, María; Morettini, Paolo; Morgenstern, Marcus; Morii, Masahiro; Moritz, Sebastian; Morley, Anthony Keith; Mornacchi, Giuseppe; Morris, John; Morvaj, Ljiljana; Moser, Hans-Guenther; Mosidze, Maia; Moss, Josh; Motohashi, Kazuki; Mount, Richard; Mountricha, Eleni; Mouraviev, Sergei; Moyse, Edward; Muanza, Steve; Mudd, Richard; Mueller, Felix; Mueller, James; Mueller, Klemens; Mueller, Thibaut; Mueller, Timo; Muenstermann, Daniel; Munwes, Yonathan; Murillo Quijada, Javier Alberto; Murray, Bill; Musheghyan, Haykuhi; Musto, Elisa; Myagkov, Alexey; Myska, Miroslav; Nackenhorst, Olaf; Nadal, Jordi; Nagai, Koichi; Nagai, Ryo; Nagai, Yoshikazu; Nagano, Kunihiro; Nagarkar, Advait; Nagasaka, Yasushi; Nagel, Martin; Nairz, Armin Michael; Nakahama, Yu; Nakamura, Koji; Nakamura, Tomoaki; Nakano, Itsuo; Namasivayam, Harisankar; Nanava, Gizo; Narayan, Rohin; Nattermann, Till; Naumann, Thomas; Navarro, Gabriela; Nayyar, Ruchika; Neal, Homer; Nechaeva, Polina; Neep, Thomas James; Nef, Pascal Daniel; Negri, Andrea; Negri, Guido; Negrini, Matteo; Nektarijevic, Snezana; Nelson, Andrew; Nelson, Timothy Knight; Nemecek, Stanislav; Nemethy, Peter; Nepomuceno, Andre Asevedo; Nessi, Marzio; Neubauer, Mark; Neumann, Manuel; Neves, Ricardo; Nevski, Pavel; Newman, Paul; Nguyen, Duong Hai; Nickerson, Richard; Nicolaidou, Rosy; Nicquevert, Bertrand; Nielsen, Jason; Nikiforou, Nikiforos; Nikiforov, Andriy; Nikolaenko, Vladimir; Nikolic-Audit, Irena; Nikolics, Katalin; Nikolopoulos, Konstantinos; Nilsson, Paul; Ninomiya, Yoichi; Nisati, Aleandro; Nisius, Richard; Nobe, Takuya; Nodulman, Lawrence; Nomachi, Masaharu; Nomidis, Ioannis; Norberg, Scarlet; Nordberg, Markus; Novgorodova, Olga; Nowak, Sebastian; Nozaki, Mitsuaki; Nozka, Libor; Ntekas, Konstantinos; Nunes Hanninger, Guilherme; Nunnemann, Thomas; Nurse, Emily; Nuti, Francesco; O'Brien, Brendan Joseph; O'grady, Fionnbarr; O'Neil, Dugan; O'Shea, Val; Oakham, Gerald; Oberlack, Horst; Obermann, Theresa; Ocariz, Jose; Ochi, Atsuhiko; Ochoa, Ines; Oda, Susumu; Odaka, Shigeru; Ogren, Harold; Oh, Alexander; Oh, Seog; Ohm, Christian; Ohman, Henrik; Ohshima, Takayoshi; Okamura, Wataru; Okawa, Hideki; Okumura, Yasuyuki; Okuyama, Toyonobu; Olariu, Albert; Olchevski, Alexander; Olivares Pino, Sebastian Andres; Oliveira Damazio, Denis; Oliver Garcia, Elena; Olszewski, Andrzej; Olszowska, Jolanta; Onofre, António; Onyisi, Peter; Oram, Christopher; Oreglia, Mark; Oren, Yona; Orestano, Domizia; Orlando, Nicola; Oropeza Barrera, Cristina; Orr, Robert; Osculati, Bianca; Ospanov, Rustem; Otero y Garzon, Gustavo; Otono, Hidetoshi; Ouchrif, Mohamed; Ouellette, Eric; Ould-Saada, Farid; Ouraou, Ahmimed; Oussoren, Koen Pieter; Ouyang, Qun; Ovcharova, Ana; Owen, Mark; Ozcan, Veysi Erkcan; Ozturk, Nurcan; Pachal, Katherine; Pacheco Pages, Andres; Padilla Aranda, Cristobal; Pagáčová, Martina; Pagan Griso, Simone; Paganis, Efstathios; Pahl, Christoph; Paige, Frank; Pais, Preema; Pajchel, Katarina; Palacino, Gabriel; Palestini, Sandro; Palka, Marek; Pallin, Dominique; Palma, Alberto; Palmer, Jody; Pan, Yibin; Panagiotopoulou, Evgenia; Panduro Vazquez, William; Pani, Priscilla; Panikashvili, Natalia; Panitkin, Sergey; Pantea, Dan; Paolozzi, Lorenzo; Papadopoulou, Theodora; Papageorgiou, Konstantinos; Paramonov, Alexander; Paredes Hernandez, Daniela; Parker, Michael Andrew; Parodi, Fabrizio; Parsons, John; Parzefall, Ulrich; Pasqualucci, Enrico; Passaggio, Stefano; Passeri, Antonio; Pastore, Fernanda; Pastore, Francesca; Pásztor, Gabriella; Pataraia, Sophio; Patel, Nikhul; Pater, Joleen; Patricelli, Sergio; Pauly, Thilo; Pearce, James; Pedersen, Maiken; Pedraza Lopez, Sebastian; Pedro, Rute; Peleganchuk, Sergey; Pelikan, Daniel; Peng, Haiping; Penning, Bjoern; Penwell, John; Perepelitsa, Dennis; Perez Codina, Estel; Pérez García-Estañ, María Teresa; Perez Reale, Valeria; Perini, Laura; Pernegger, Heinz; Perrino, Roberto; Peschke, Richard; Peshekhonov, Vladimir; Peters, Krisztian; Peters, Yvonne; Petersen, Brian; Petersen, Troels; Petit, Elisabeth; Petridis, Andreas; Petridou, Chariclia; Petrolo, Emilio; Petrucci, Fabrizio; Pettersson, Nora Emilia; Pezoa, Raquel; Phillips, Peter William; Piacquadio, Giacinto; Pianori, Elisabetta; Picazio, Attilio; Piccaro, Elisa; Piccinini, Maurizio; Piegaia, Ricardo; Pignotti, David; Pilcher, James; Pilkington, Andrew; Pina, João Antonio; Pinamonti, Michele; Pinder, Alex; Pinfold, James; Pingel, Almut; Pinto, Belmiro; Pires, Sylvestre; Pitt, Michael; Pizio, Caterina; Plazak, Lukas; Pleier, Marc-Andre; Pleskot, Vojtech; Plotnikova, Elena; Plucinski, Pawel; Poddar, Sahill; Podlyski, Fabrice; Poettgen, Ruth; Poggioli, Luc; Pohl, David-leon; Pohl, Martin; Polesello, Giacomo; Policicchio, Antonio; Polifka, Richard; Polini, Alessandro; Pollard, Christopher Samuel; Polychronakos, Venetios; Pommès, Kathy; Pontecorvo, Ludovico; Pope, Bernard; Popeneciu, Gabriel Alexandru; Popovic, Dragan; Poppleton, Alan; Portell Bueso, Xavier; Pospisil, Stanislav; Potamianos, Karolos; Potrap, Igor; Potter, Christina; Potter, Christopher; Poulard, Gilbert; Poveda, Joaquin; Pozdnyakov, Valery; Pralavorio, Pascal; Pranko, Aliaksandr; Prasad, Srivas; Pravahan, Rishiraj; Prell, Soeren; Price, Darren; Price, Joe; Price, Lawrence; Prieur, Damien; Primavera, Margherita; Proissl, Manuel; Prokofiev, Kirill; Prokoshin, Fedor; Protopapadaki, Eftychia-sofia; Protopopescu, Serban; Proudfoot, James; Przybycien, Mariusz; Przysiezniak, Helenka; Ptacek, Elizabeth; Puddu, Daniele; Pueschel, Elisa; Puldon, David; Purohit, Milind; Puzo, Patrick; Qian, Jianming; Qin, Gang; Qin, Yang; Quadt, Arnulf; Quarrie, David; Quayle, William; Queitsch-Maitland, Michaela; Quilty, Donnchadha; Qureshi, Anum; Radeka, Veljko; Radescu, Voica; Radhakrishnan, Sooraj Krishnan; Radloff, Peter; Rados, Pere; Ragusa, Francesco; Rahal, Ghita; Rajagopalan, Srinivasan; Rammensee, Michael; Randle-Conde, Aidan Sean; Rangel-Smith, Camila; Rao, Kanury; Rauscher, Felix; Rave, Tobias Christian; Ravenscroft, Thomas; Raymond, Michel; Read, Alexander Lincoln; Readioff, Nathan Peter; Rebuzzi, Daniela; Redelbach, Andreas; Redlinger, George; Reece, Ryan; Reeves, Kendall; Rehnisch, Laura; Reisin, Hernan; Relich, Matthew; Rembser, Christoph; Ren, Huan; Ren, Zhongliang; Renaud, Adrien; Rescigno, Marco; Resconi, Silvia; Rezanova, Olga; Reznicek, Pavel; Rezvani, Reyhaneh; Richter, Robert; Ridel, Melissa; Rieck, Patrick; Rieger, Julia; Rijssenbeek, Michael; Rimoldi, Adele; Rinaldi, Lorenzo; Ritsch, Elmar; Riu, Imma; Rizatdinova, Flera; Rizvi, Eram; Robertson, Steven; Robichaud-Veronneau, Andree; Robinson, Dave; Robinson, James; Robson, Aidan; Roda, Chiara; Rodrigues, Luis; Roe, Shaun; Røhne, Ole; Rolli, Simona; Romaniouk, Anatoli; Romano, Marino; Romero Adam, Elena; Rompotis, Nikolaos; Roos, Lydia; Ros, Eduardo; Rosati, Stefano; Rosbach, Kilian; Rose, Matthew; Rosendahl, Peter Lundgaard; Rosenthal, Oliver; Rossetti, Valerio; Rossi, Elvira; Rossi, Leonardo Paolo; Rosten, Rachel; Rotaru, Marina; Roth, Itamar; Rothberg, Joseph; Rousseau, David; Royon, Christophe; Rozanov, Alexandre; Rozen, Yoram; Ruan, Xifeng; Rubbo, Francesco; Rubinskiy, Igor; Rud, Viacheslav; Rudolph, Christian; Rudolph, Matthew Scott; Rühr, Frederik; Ruiz-Martinez, Aranzazu; Rurikova, Zuzana; Rusakovich, Nikolai; Ruschke, Alexander; Rutherfoord, John; Ruthmann, Nils; Ryabov, Yury; Rybar, Martin; Rybkin, Grigori; Ryder, Nick; Saavedra, Aldo; Sacerdoti, Sabrina; Saddique, Asif; Sadeh, Iftach; Sadrozinski, Hartmut; Sadykov, Renat; Safai Tehrani, Francesco; Sakamoto, Hiroshi; Sakurai, Yuki; Salamanna, Giuseppe; Salamon, Andrea; Saleem, Muhammad; Salek, David; Sales De Bruin, Pedro Henrique; Salihagic, Denis; Salnikov, Andrei; Salt, José; Salvachua Ferrando, Belén; Salvatore, Daniela; Salvatore, Pasquale Fabrizio; Salvucci, Antonio; Salzburger, Andreas; Sampsonidis, Dimitrios; Sanchez, Arturo; Sánchez, Javier; Sanchez Martinez, Victoria; Sandaker, Heidi; Sandbach, Ruth Laura; Sander, Heinz Georg; Sanders, Michiel; Sandhoff, Marisa; Sandoval, Tanya; Sandoval, Carlos; Sandstroem, Rikard; Sankey, Dave; Sansoni, Andrea; Santoni, Claudio; Santonico, Rinaldo; Santos, Helena; Santoyo Castillo, Itzebelt; Sapp, Kevin; Sapronov, Andrey; Saraiva, João; Sarrazin, Bjorn; Sartisohn, Georg; Sasaki, Osamu; Sasaki, Yuichi; Sauvage, Gilles; Sauvan, Emmanuel; Savard, Pierre; Savu, Dan Octavian; Sawyer, Craig; Sawyer, Lee; Saxon, David; Saxon, James; Sbarra, Carla; Sbrizzi, Antonio; Scanlon, Tim; Scannicchio, Diana; Scarcella, Mark; Scarfone, Valerio; Schaarschmidt, Jana; Schacht, Peter; Schaefer, Douglas; Schaefer, Ralph; Schaepe, Steffen; Schaetzel, Sebastian; Schäfer, Uli; Schaffer, Arthur; Schaile, Dorothee; Schamberger, R. Dean; Scharf, Veit; Schegelsky, Valery; Scheirich, Daniel; Schernau, Michael; Scherzer, Max; Schiavi, Carlo; Schieck, Jochen; Schillo, Christian; Schioppa, Marco; Schlenker, Stefan; Schmidt, Evelyn; Schmieden, Kristof; Schmitt, Christian; Schmitt, Christopher; Schmitt, Sebastian; Schneider, Basil; Schnellbach, Yan Jie; Schnoor, Ulrike; Schoeffel, Laurent; Schoening, Andre; Schoenrock, Bradley Daniel; Schorlemmer, Andre Lukas; Schott, Matthias; Schouten, Doug; Schovancova, Jaroslava; Schramm, Steven; Schreyer, Manuel; Schroeder, Christian; Schuh, Natascha; Schultens, Martin Johannes; Schultz-Coulon, Hans-Christian; Schulz, Holger; Schumacher, Markus; Schumm, Bruce; Schune, Philippe; Schwanenberger, Christian; Schwartzman, Ariel; Schwegler, Philipp; Schwemling, Philippe; Schwienhorst, Reinhard; Schwindling, Jerome; Schwindt, Thomas; Schwoerer, Maud; Sciacca, Gianfranco; Scifo, Estelle; Sciolla, Gabriella; Scott, Bill; Scuri, Fabrizio; Scutti, Federico; Searcy, Jacob; Sedov, George; Sedykh, Evgeny; Seidel, Sally; Seiden, Abraham; Seifert, Frank; Seixas, José; Sekhniaidze, Givi; Sekula, Stephen; Selbach, Karoline Elfriede; Seliverstov, Dmitry; Sellers, Graham; Semprini-Cesari, Nicola; Serfon, Cedric; Serin, Laurent; Serkin, Leonid; Serre, Thomas; Seuster, Rolf; Severini, Horst; Sfiligoj, Tina; Sforza, Federico; Sfyrla, Anna; Shabalina, Elizaveta; Shamim, Mansoora; Shan, Lianyou; Shang, Ruo-yu; Shank, James; Shapiro, Marjorie; Shatalov, Pavel; Shaw, Kate; Shehu, Ciwake Yusufu; Sherwood, Peter; Shi, Liaoshan; Shimizu, Shima; Shimmin, Chase Owen; Shimojima, Makoto; Shiyakova, Mariya; Shmeleva, Alevtina; Shochet, Mel; Short, Daniel; Shrestha, Suyog; Shulga, Evgeny; Shupe, Michael; Shushkevich, Stanislav; Sicho, Petr; Sidiropoulou, Ourania; Sidorov, Dmitri; Sidoti, Antonio; Siegert, Frank; Sijacki, Djordje; Silva, José; Silver, Yiftah; Silverstein, Daniel; Silverstein, Samuel; Simak, Vladislav; Simard, Olivier; Simic, Ljiljana; Simion, Stefan; Simioni, Eduard; Simmons, Brinick; Simoniello, Rosa; Simonyan, Margar; Sinervo, Pekka; Sinev, Nikolai; Sipica, Valentin; Siragusa, Giovanni; Sircar, Anirvan; Sisakyan, Alexei; Sivoklokov, Serguei; Sjölin, Jörgen; Sjursen, Therese; Skottowe, Hugh Philip; Skovpen, Kirill; Skubic, Patrick; Slater, Mark; Slavicek, Tomas; Sliwa, Krzysztof; Smakhtin, Vladimir; Smart, Ben; Smestad, Lillian; Smirnov, Sergei; Smirnov, Yury; Smirnova, Lidia; Smirnova, Oxana; Smith, Kenway; Smizanska, Maria; Smolek, Karel; Snesarev, Andrei; Snidero, Giacomo; Snyder, Scott; Sobie, Randall; Socher, Felix; Soffer, Abner; Soh, Dart-yin; Solans, Carlos; Solar, Michael; Solc, Jaroslav; Soldatov, Evgeny; Soldevila, Urmila; Solfaroli Camillocci, Elena; Solodkov, Alexander; Soloshenko, Alexei; Solovyanov, Oleg; Solovyev, Victor; Sommer, Philip; Song, Hong Ye; Soni, Nitesh; Sood, Alexander; Sopczak, Andre; Sopko, Bruno; Sopko, Vit; Sorin, Veronica; Sosebee, Mark; Soualah, Rachik; Soueid, Paul; Soukharev, Andrey; South, David; Spagnolo, Stefania; Spanò, Francesco; Spearman, William Robert; Spettel, Fabian; Spighi, Roberto; Spigo, Giancarlo; Spousta, Martin; Spreitzer, Teresa; Spurlock, Barry; St Denis, Richard Dante; Staerz, Steffen; Stahlman, Jonathan; Stamen, Rainer; Stanecka, Ewa; Stanek, Robert; Stanescu, Cristian; Stanescu-Bellu, Madalina; Stanitzki, Marcel Michael; Stapnes, Steinar; Starchenko, Evgeny; Stark, Jan; Staroba, Pavel; Starovoitov, Pavel; Staszewski, Rafal; Stavina, Pavel; Steinberg, Peter; Stelzer, Bernd; Stelzer, Harald Joerg; Stelzer-Chilton, Oliver; Stenzel, Hasko; Stern, Sebastian; Stewart, Graeme; Stillings, Jan Andre; Stockton, Mark; Stoebe, Michael; Stoicea, Gabriel; Stolte, Philipp; Stonjek, Stefan; Stradling, Alden; Straessner, Arno; Stramaglia, Maria Elena; Strandberg, Jonas; Strandberg, Sara; Strandlie, Are; Strauss, Emanuel; Strauss, Michael; Strizenec, Pavol; Ströhmer, Raimund; Strom, David; Stroynowski, Ryszard; Stucci, Stefania Antonia; Stugu, Bjarne; Styles, Nicholas Adam; Su, Dong; Su, Jun; Subramania, Halasya Siva; Subramaniam, Rajivalochan; Succurro, Antonella; Sugaya, Yorihito; Suhr, Chad; Suk, Michal; Sulin, Vladimir; Sultansoy, Saleh; Sumida, Toshi; Sun, Xiaohu; Sundermann, Jan Erik; Suruliz, Kerim; Susinno, Giancarlo; Sutton, Mark; Suzuki, Yu; Svatos, Michal; Swedish, Stephen; Swiatlowski, Maximilian; Sykora, Ivan; Sykora, Tomas; Ta, Duc; Taccini, Cecilia; Tackmann, Kerstin; Taenzer, Joe; Taffard, Anyes; Tafirout, Reda; Taiblum, Nimrod; Takahashi, Yuta; Takai, Helio; Takashima, Ryuichi; Takeda, Hiroshi; Takeshita, Tohru; Takubo, Yosuke; Talby, Mossadek; Talyshev, Alexey; Tam, Jason; Tan, Kong Guan; Tanaka, Junichi; Tanaka, Reisaburo; Tanaka, Satoshi; Tanaka, Shuji; Tanasijczuk, Andres Jorge; Tannenwald, Benjamin Bordy; Tannoury, Nancy; Tapprogge, Stefan; Tarem, Shlomit; Tarrade, Fabien; Tartarelli, Giuseppe Francesco; Tas, Petr; Tasevsky, Marek; Tashiro, Takuya; Tassi, Enrico; Tavares Delgado, Ademar; Tayalati, Yahya; Taylor, Frank; Taylor, Geoffrey; Taylor, Wendy; Teischinger, Florian Alfred; Teixeira Dias Castanheira, Matilde; Teixeira-Dias, Pedro; Temming, Kim Katrin; Ten Kate, Herman; Teng, Ping-Kun; Teoh, Jia Jian; Terada, Susumu; Terashi, Koji; Terron, Juan; Terzo, Stefano; Testa, Marianna; Teuscher, Richard; Therhaag, Jan; Theveneaux-Pelzer, Timothée; Thomas, Juergen; Thomas-Wilsker, Joshuha; Thompson, Emily; Thompson, Paul; Thompson, Peter; Thompson, Stan; Thomsen, Lotte Ansgaard; Thomson, Evelyn; Thomson, Mark; Thong, Wai Meng; Thun, Rudolf; Tian, Feng; Tibbetts, Mark James; Tikhomirov, Vladimir; Tikhonov, Yury; Timoshenko, Sergey; Tiouchichine, Elodie; Tipton, Paul; Tisserant, Sylvain; Todorov, Theodore; Todorova-Nova, Sharka; Toggerson, Brokk; Tojo, Junji; Tokár, Stanislav; Tokushuku, Katsuo; Tollefson, Kirsten; Tomlinson, Lee; Tomoto, Makoto; Tompkins, Lauren; Toms, Konstantin; Topilin, Nikolai; Torrence, Eric; Torres, Heberth; Torró Pastor, Emma; Toth, Jozsef; Touchard, Francois; Tovey, Daniel; Tran, Huong Lan; Trefzger, Thomas; Tremblet, Louis; Tricoli, Alessandro; Trigger, Isabel Marian; Trincaz-Duvoid, Sophie; Tripiana, Martin; Triplett, Nathan; Trischuk, William; Trocmé, Benjamin; Troncon, Clara; Trottier-McDonald, Michel; Trovatelli, Monica; True, Patrick; Trzebinski, Maciej; Trzupek, Adam; Tsarouchas, Charilaos; Tseng, Jeffrey; Tsiareshka, Pavel; Tsionou, Dimitra; Tsipolitis, Georgios; Tsirintanis, Nikolaos; Tsiskaridze, Shota; Tsiskaridze, Vakhtang; Tskhadadze, Edisher; Tsukerman, Ilya; Tsulaia, Vakhtang; Tsuno, Soshi; Tsybychev, Dmitri; Tudorache, Alexandra; Tudorache, Valentina; Tuna, Alexander Naip; Tupputi, Salvatore; Turchikhin, Semen; Turecek, Daniel; Turk Cakir, Ilkay; Turra, Ruggero; Tuts, Michael; Tykhonov, Andrii; Tylmad, Maja; Tyndel, Mike; Uchida, Kirika; Ueda, Ikuo; Ueno, Ryuichi; Ughetto, Michael; Ugland, Maren; Uhlenbrock, Mathias; Ukegawa, Fumihiko; Unal, Guillaume; Undrus, Alexander; Unel, Gokhan; Ungaro, Francesca; Unno, Yoshinobu; Urbaniec, Dustin; Urquijo, Phillip; Usai, Giulio; Usanova, Anna; Vacavant, Laurent; Vacek, Vaclav; Vachon, Brigitte; Valencic, Nika; Valentinetti, Sara; Valero, Alberto; Valery, Loic; Valkar, Stefan; Valladolid Gallego, Eva; Vallecorsa, Sofia; Valls Ferrer, Juan Antonio; Van Den Wollenberg, Wouter; Van Der Deijl, Pieter; van der Geer, Rogier; van der Graaf, Harry; Van Der Leeuw, Robin; van der Ster, Daniel; van Eldik, Niels; van Gemmeren, Peter; Van Nieuwkoop, Jacobus; van Vulpen, Ivo; van Woerden, Marius Cornelis; Vanadia, Marco; Vandelli, Wainer; Vanguri, Rami; Vaniachine, Alexandre; Vankov, Peter; Vannucci, Francois; Vardanyan, Gagik; Vari, Riccardo; Varnes, Erich; Varol, Tulin; Varouchas, Dimitris; Vartapetian, Armen; Varvell, Kevin; Vazeille, Francois; Vazquez Schroeder, Tamara; Veatch, Jason; Veloso, Filipe; Veneziano, Stefano; Ventura, Andrea; Ventura, Daniel; Venturi, Manuela; Venturi, Nicola; Venturini, Alessio; Vercesi, Valerio; Verducci, Monica; Verkerke, Wouter; Vermeulen, Jos; Vest, Anja; Vetterli, Michel; Viazlo, Oleksandr; Vichou, Irene; Vickey, Trevor; Vickey Boeriu, Oana Elena; Viehhauser, Georg; Viel, Simon; Vigne, Ralph; Villa, Mauro; Villaplana Perez, Miguel; Vilucchi, Elisabetta; Vincter, Manuella; Vinogradov, Vladimir; Virzi, Joseph; Vivarelli, Iacopo; Vives Vaque, Francesc; Vlachos, Sotirios; Vladoiu, Dan; Vlasak, Michal; Vogel, Adrian; Vogel, Marcelo; Vokac, Petr; Volpi, Guido; Volpi, Matteo; von der Schmitt, Hans; von Radziewski, Holger; von Toerne, Eckhard; Vorobel, Vit; Vorobev, Konstantin; Vos, Marcel; Voss, Rudiger; Vossebeld, Joost; Vranjes, Nenad; Vranjes Milosavljevic, Marija; Vrba, Vaclav; Vreeswijk, Marcel; Vu Anh, Tuan; Vuillermet, Raphael; Vukotic, Ilija; Vykydal, Zdenek; Wagner, Peter; Wagner, Wolfgang; Wahlberg, Hernan; Wahrmund, Sebastian; Wakabayashi, Jun; Walder, James; Walker, Rodney; Walkowiak, Wolfgang; Wall, Richard; Waller, Peter; Walsh, Brian; Wang, Chao; Wang, Chiho; Wang, Fuquan; Wang, Haichen; Wang, Hulin; Wang, Jike; Wang, Jin; Wang, Kuhan; Wang, Rui; Wang, Song-Ming; Wang, Tan; Wang, Xiaoxiao; Wanotayaroj, Chaowaroj; Warburton, Andreas; Ward, Patricia; Wardrope, David Robert; Warsinsky, Markus; Washbrook, Andrew; Wasicki, Christoph; Watkins, Peter; Watson, Alan; Watson, Ian; Watson, Miriam; Watts, Gordon; Watts, Stephen; Waugh, Ben; Webb, Samuel; Weber, Michele; Weber, Stefan Wolf; Webster, Jordan S; Weidberg, Anthony; Weigell, Philipp; Weinert, Benjamin; Weingarten, Jens; Weiser, Christian; Weits, Hartger; Wells, Phillippa; Wenaus, Torre; Wendland, Dennis; Weng, Zhili; Wengler, Thorsten; Wenig, Siegfried; Wermes, Norbert; Werner, Matthias; Werner, Per; Wessels, Martin; Wetter, Jeffrey; Whalen, Kathleen; White, Andrew; White, Martin; White, Ryan; White, Sebastian; Whiteson, Daniel; Wicke, Daniel; Wickens, Fred; Wiedenmann, Werner; Wielers, Monika; Wienemann, Peter; Wiglesworth, Craig; Wiik-Fuchs, Liv Antje Mari; Wijeratne, Peter Alexander; Wildauer, Andreas; Wildt, Martin Andre; Wilkens, Henric George; Will, Jonas Zacharias; Williams, Hugh; Williams, Sarah; Willis, Christopher; Willocq, Stephane; Wilson, Alan; Wilson, John; Wingerter-Seez, Isabelle; Winklmeier, Frank; Winter, Benedict Tobias; Wittgen, Matthias; Wittig, Tobias; Wittkowski, Josephine; Wollstadt, Simon Jakob; Wolter, Marcin Wladyslaw; Wolters, Helmut; Wosiek, Barbara; Wotschack, Jorg; Woudstra, Martin; Wozniak, Krzysztof; Wright, Michael; Wu, Mengqing; Wu, Sau Lan; Wu, Xin; Wu, Yusheng; Wulf, Evan; Wyatt, Terry Richard; Wynne, Benjamin; Xella, Stefania; Xiao, Meng; Xu, Da; Xu, Lailin; Yabsley, Bruce; Yacoob, Sahal; Yamada, Miho; Yamaguchi, Hiroshi; Yamaguchi, Yohei; Yamamoto, Akira; Yamamoto, Kyoko; Yamamoto, Shimpei; Yamamura, Taiki; Yamanaka, Takashi; Yamauchi, Katsuya; Yamazaki, Yuji; Yan, Zhen; Yang, Haijun; Yang, Hongtao; Yang, Un-Ki; Yang, Yi; Yanush, Serguei; Yao, Liwen; Yao, Weiming; Yasu, Yoshiji; Yatsenko, Elena; Yau Wong, Kaven Henry; Ye, Jingbo; Ye, Shuwei; Yen, Andy L; Yildirim, Eda; Yilmaz, Metin; Yoosoofmiya, Reza; Yorita, Kohei; Yoshida, Rikutaro; Yoshihara, Keisuke; Young, Charles; Young, Christopher John; Youssef, Saul; Yu, David Ren-Hwa; Yu, Jaehoon; Yu, Jiaming; Yu, Jie; Yuan, Li; Yurkewicz, Adam; Yusuff, Imran; Zabinski, Bartlomiej; Zaidan, Remi; Zaitsev, Alexander; Zaman, Aungshuman; Zambito, Stefano; Zanello, Lucia; Zanzi, Daniele; Zeitnitz, Christian; Zeman, Martin; Zemla, Andrzej; Zengel, Keith; Zenin, Oleg; Ženiš, Tibor; Zerwas, Dirk; Zevi della Porta, Giovanni; Zhang, Dongliang; Zhang, Fangzhou; Zhang, Huaqiao; Zhang, Jinlong; Zhang, Lei; Zhang, Xueyao; Zhang, Zhiqing; Zhao, Zhengguo; Zhemchugov, Alexey; Zhong, Jiahang; Zhou, Bing; Zhou, Lei; Zhou, Ning; Zhu, Cheng Guang; Zhu, Hongbo; Zhu, Junjie; Zhu, Yingchun; Zhuang, Xuai; Zhukov, Konstantin; Zibell, Andre; Zieminska, Daria; Zimine, Nikolai; Zimmermann, Christoph; Zimmermann, Robert; Zimmermann, Simone; Zimmermann, Stephanie; Zinonos, Zinonas; Ziolkowski, Michael; Zobernig, Georg; Zoccoli, Antonio; zur Nedden, Martin; Zurzolo, Giovanni; Zutshi, Vishnu; Zwalinski, Lukasz

    2014-01-01

    A novel technique to identify and split clusters created by multiple charged particles in the ATLAS pixel detector using a set of artificial neural networks is presented. Such merged clusters are a common feature of tracks originating from highly energetic objects, such as jets. Neural networks are trained using Monte Carlo samples produced with a detailed detector simulation. This technique replaces the former clustering approach based on a connected component analysis and charge interpolation. The performance of the neural network splitting technique is quantified using data from proton-proton collisions at the LHC collected by the ATLAS detector in 2011 and from Monte Carlo simulations. This technique reduces the number of clusters shared between tracks in highly energetic jets by up to a factor of three. It also provides more precise position and error estimates of the clusters in both the transverse and longitudinal impact parameter resolution.

  18. Studies on irradiated pixel detectors for the ATLAS IBL and HL-LHC upgrade

    International Nuclear Information System (INIS)

    The constant demand for higher luminosity in high energy physics is the reason for the continuous effort to adapt the accelerators and the experiments. The upgrade program for the experiments and the accelerators at CERN already includes several expansion stages of the Large Hadron Collider (LHC) which will increase the luminosity and the energy of the accelerator. Simultaneously the LHC experiments prepare the individual sub-detectors for the increasing demands in the coming years. Especially the tracking detectors have to cope with fluence levels unprecedented for high energy physics experiments. Correspondingly to the fluence increases the impact of the radiation damage which reduces the life time of the detectors by decreasing the detector performance and efficiency. To cope with this effect new and more radiation hard detector concepts become necessary to extend the life time. This work concentrates on the impact of radiation damage on the pixel sensor technologies to be used in the next upgrade of the ATLAS Pixel Detector as well as for applications in the ATLAS Experiment at HL-LHC conditions. The sensors considered in this work include various designs based on silicon and diamond as sensor material. The investigated designs include a planar silicon pixel design currently used in the ATLAS Experiment as well as a 3D pixel design which uses electrodes penetrating the entire sensor material. The diamond designs implement electrodes similar to the design used by the planar technology with diamond sensors made out of single- and poly-crystalline material. To investigate the sensor properties characterization tests are performed before and after irradiation with protons or neutrons. The measurements are used to determine the interaction between the read-out electronics and the sensors to ensure the signal transfer after irradiation. Further tests focus on the sensor performance itself which includes the analysis of the leakage current behavior and the charge

  19. The Pixel Detector of the ATLAS experiment for the Run2 at the Large Hadron Collider

    CERN Document Server

    Mandelli, B; The ATLAS collaboration

    2014-01-01

    The Pixel Detector of the ATLAS experiment has shown excellent performance during the whole Run-1 of LHC. Taking advantage of the long shutdown, the detector was extracted from the experiment and brought to surface, to equip it with new service quarter panels, to repair modules and to ease installation of the Insertable B-Layer (IBL). IBL is a fourth layer of pixel detectors, and will be installed in May 2014 between the existing Pixel Detector and a new smaller radius beam-pipe at a radius of 3.3 cm. To cope with the high radiation and pixel occupancy due to the proximity to the interaction point, a new read-out chip and two different silicon sensor technologies (planar and 3D) have been developed. Furthermore, the physics performance will be improved through the reduction of pixel size while, targeting for a low material budget, a new mechanical support using lightweight staves and a CO2 based cooling system have been adopted. IBL construction is now completed. An overview of the IBL project as well as the ...

  20. The Pixel Detector of the ATLAS experiment for the Run2 at the Large Hadron Collider

    CERN Document Server

    Oide, H; The ATLAS collaboration

    2014-01-01

    The Pixel Detector of the ATLAS experiment has shown excellent performance during the whole Run-1 of LHC. Taking advantage of the long showdown, the detector was extracted from the experiment and brought to surface, to equip it with new service quarter panels, to repair modules and to ease installation of the Insertable B-Layer (IBL). IBL is a fourth layer of pixel detectors, and will be installed in May 2014 between the existing Pixel Detector and a new smaller radius beam-pipe at a radius of 3.3 cm. To cope with the high radiation and pixel occupancy due to the proximity to the interaction point, a new read-out chip and two different silicon sensor technologies (planar and 3D) have been developed. Furthermore, the physics performance will be improved through the reduction of pixel size while, targeting for a low material budget, a new mechanical support using lightweight staves and a CO2 based cooling system have been adopted. IBL construction is now completed. An overview of the IBL project as well as the ...

  1. The Pixel Detector of the ATLAS experiment for the Run 2 at the Large Hadron Collider

    CERN Document Server

    Oide, H; The ATLAS collaboration

    2014-01-01

    The Pixel Detector of the ATLAS experiment has shown excellent performance during the whole Run 1 of LHC. Taking advantage of the long shutdown, the detector was extracted from the experiment and brought to surface, to equip it with new service quarter panels, to repair modules and to ease installation of the Insertable B-Layer (IBL). The IBL is the fourth layer of the Run 2 Pixel Detector, and it was installed in May 2014 between the existing Pixel Detector and the new smaller-radius beam pipe at a radius of 3.3 cm. To cope with the high radiation and pixel occupancy due to the proximity to the interaction point, a new read-out chip and two different silicon sensor technologies (planar and 3D) have been developed. Furthermore, the physics performance will be improved through the reduction of pixel size while, targeting for a low material budget, a new mechanical support using lightweight staves and a CO2 based cooling system have been adopted. IBL construction is now completed. An overview of the IBL project...

  2. The upgraded Pixel Detector of the ATLAS Experiment for Run2 at the Large Hadron Collider

    CERN Document Server

    Mullier, Geoffrey Andre; The ATLAS collaboration

    2015-01-01

    The Pixel Detector of the ATLAS experiment has shown excellent performance during the whole Run-1 of LHC. Taking advantage of the long showdown, the detector was extracted from the experiment and brought to surface, to equip it with new service quarter panels, to repair modules and to ease installation of the Insertable B-Layer (IBL), a fourth layer of pixel detectors, installed in May 2014 between the existing Pixel Detector and a new smaller radius beam-pipe at a radius of 3.3 cm. To cope with the high radiation and increased pixel occupancy due to the proximity to the interaction point, two different silicon sensor technologies (planar and 3D) have been developed. A new readout chip has been developed within CMOS 130nm technology with larger area, smaller pixel size and faster readout capability. Dedicated design features in combination with a new composite material were considered and used in order to reduce the material budget of the support structure while keeping the optimal thermo-mechanical performan...

  3. Tracking and b-tagging with pixel vertex detector in ATLAS experiment at LHC

    International Nuclear Information System (INIS)

    The capability of the ATLAS detector to tag b-jets is studied, using the impact parameter of charged tracks. High b-tagging performance is needed at LHC, especially during the first years of running, in order to see evidence of the Higgs boson if its mass lies between 80 and 120 GeV/c2. A pattern-recognition algorithm has been developed for this purpose, using a detailed simulation of the ATLAS inner detector. Track-finding starts from the pixel detector layers. A 'hyper-plane' concept allows the use of a simple tracking algorithm though the complex geometry. High track-finding efficiency and reconstruction quality ensure the discrimination of b-jets from other kinds of jets. After full simulation and reconstruction of H → bb-bar, H → gg, H → uu-bar, H → ss-bar and H → cc-bar events (mH = 100 GeV/c2), the mean rejections achieved against non-b-jets for a 50% b-jet tagging efficiency are as follows: Rg=39±5 Ru = 60 ± 9 Rs = 38 ± 5 Rc = 9 ± 1 The analysis of data from the first radiation-hard pixel detector prototypes justifies the potential of these detectors for track-finding and high-precision impact parameter measurement at LHC. (author)

  4. High bandwidth pixel detector modules for the ATLAS Insertable B-Layer

    International Nuclear Information System (INIS)

    The investigation of the nature of the recently discovered electro-weak symmetry breaking mechanism of the standard model of particle physics as well as the search for physics beyond the standard model with the LHC require to collect even more data. To achieve this goal, the luminosity of the LHC will be increased in two steps. The increased luminosity results in serious challenges for the inner tracking systems of the experiments at the LHC. The ATLAS pixel detector will also be upgraded in a two stage program. During the shutdown in 2013 and 2014 a fourth hybrid pixel detector layer, the socalled Insertable B-Layer (IBL) is inserted inside the existing pixel detector. This thesis focuses on the characterization, performance measurement, and production quality assurance of the central sensitive elements of the IBL, the modules. This includes a full characterization of the readout chip (FE-I4) and of the assembled modules. A completely new inner tracking system is mandatory in ATLAS after the second luminosity increase in the shutdown of 2022 and 2023. The final chapter of this thesis introduces a new module concept that uses an industrial high voltage CMOS technology as sensor layer, which is capacitively coupled to the FE-I4 readout chip.

  5. High bandwidth pixel detector modules for the ATLAS Insertable B-Layer

    Energy Technology Data Exchange (ETDEWEB)

    Backhaus, Malte

    2014-01-15

    The investigation of the nature of the recently discovered electro-weak symmetry breaking mechanism of the standard model of particle physics as well as the search for physics beyond the standard model with the LHC require to collect even more data. To achieve this goal, the luminosity of the LHC will be increased in two steps. The increased luminosity results in serious challenges for the inner tracking systems of the experiments at the LHC. The ATLAS pixel detector will also be upgraded in a two stage program. During the shutdown in 2013 and 2014 a fourth hybrid pixel detector layer, the socalled Insertable B-Layer (IBL) is inserted inside the existing pixel detector. This thesis focuses on the characterization, performance measurement, and production quality assurance of the central sensitive elements of the IBL, the modules. This includes a full characterization of the readout chip (FE-I4) and of the assembled modules. A completely new inner tracking system is mandatory in ATLAS after the second luminosity increase in the shutdown of 2022 and 2023. The final chapter of this thesis introduces a new module concept that uses an industrial high voltage CMOS technology as sensor layer, which is capacitively coupled to the FE-I4 readout chip.

  6. High bandwidth pixel detector modules for the ATLAS Insertable B-Layer

    CERN Document Server

    Backhaus, Malte

    2014-02-19

    The investigation of the nature of the recently discovered electro-weak symmetry breaking mechanism of the standard model of particle physics as well as the search for physics beyond the standard model with the LHC require to collect even more data. To achieve this goal, the luminosity of the LHC will be increased in two steps. The increased luminosity results in serious challenges for the inner tracking systems of the experiments at the LHC. The ATLAS pixel detector will also be upgraded in a two stage program. During the shutdown in 2013 and 2014 a fourth hybrid pixel detector layer, the so-called Insertable B-Layer (IBL) is inserted inside the existing pixel detector. This thesis focuses on the characterization, performance measurement, and production quality assurance of the central sensitive elements of the IBL, the modules. This includes a full characterization of the readout chip (FE-I4) and of the assembled modules. A completely new inner tracking system is mandatory in ATLAS after the second luminosi...

  7. The Pixel Detector of the ATLAS Experiment for the Run-2 at the Large Hadron Collider

    CERN Document Server

    Guescini, F; The ATLAS collaboration

    2014-01-01

    The Pixel Detector of the ATLAS experiment has shown excellent performance during the whole Run-1 of LHC. Taking advantage of the long showdown, the detector was extracted from the experiment and brought to surface, to equip it with new service quarter panels, to repair modules and to ease installation of the Insertable B-Layer (IBL). IBL is a fourth layer of pixel detectors, and has been installed in May 2014 between the existing Pixel Detector and a new smaller radius beam-pipe at a radial distance of 3.3 cm from the beam axis. The realization of the IBL required the development of several new technologies and solutions in order to overcome the challenges introduced by the extreme environment and working conditions, such as the high radiation levels, the high pixel occupancy and the need of an exceptionally low material budget. Two silicon sensor technologies have been adopted for the IBL modules: planar n-in-n and 3D. Both of these are connected via bump bonding to the new generation 130 nm IBM CMOS FE-I4 ...

  8. Prototypes for components of a control system for the ATLAS pixel detector at the HL-LHC

    CERN Document Server

    Boek, J; Kind, P; Mättig, P; Püllen, L; Zeitnitz, C

    2013-01-01

    inner detector of the ATLAS experiment will be replaced entirely including the pixel detector. This new pixel detector requires a specific control system which complies with the strict requirements in terms of radiation hardness, material budget and space for the electronics in the ATLAS experiment. The University ofWuppertal is developing a concept for a DCS (Detector Control System) network consisting of two kinds of ASICs. The first ASIC is the DCS Chip which is located on the pixel detector, very close to the interaction point. The second ASIC is the DCS Controller which is controlling 4x4 DCS Chips from the outer regions of ATLAS via differential data lines. Both ASICs are manufactured in 130 nm deep sub micron technology. We present results from measurements from new prototypes of components for the DCS network.

  9. 3D silicon pixel detectors for the ATLAS Forward Physics experiment

    CERN Document Server

    Lange, Jörn; Grinstein, Sebastian; Paz, Ivan Lopez

    2015-01-01

    The ATLAS Forward Physics (AFP) project plans to install 3D silicon pixel detectors about 210 m away from the interaction point and very close to the beamline (2-3 mm). This implies the need of slim edges of about 100-200 $\\mu$m width for the sensor side facing the beam to minimise the dead area. Another challenge is an expected non-uniform irradiation of the pixel sensors. It is studied if these requirements can be met using slightly-modified FE-I4 3D pixel sensors from the ATLAS Insertable B-Layer production. AFP-compatible slim edges are obtained with a simple diamond-saw cut. Electrical characterisations and beam tests are carried out and no detrimental impact on the leakage current and hit efficiency is observed. For devices without a 3D guard ring a remaining insensitive edge of less than 15 $\\mu$m width is found. Moreover, 3D detectors are non-uniformly irradiated up to fluences of several 10$^{15}$ n$_{eq}$/cm$^2$ with either a focussed 23 GeV proton beam or a 23 MeV proton beam through holes in Al ma...

  10. Firmware development and testing of the ATLAS Pixel Detector / IBL ROD card

    Science.gov (United States)

    Gabrielli, A.; Backhaus, M.; Balbi, G.; Bindi, M.; Chen, S. P.; Falchieri, D.; Flick, T.; Hauck, S.; Hsu, S. C.; Kretz, M.; Kugel, A.; Lama, L.; Travaglini, R.; Wensing, M.

    2015-03-01

    The ATLAS Experiment is reworking and upgrading systems during the current LHC shut down. In particular, the Pixel detector has inserted an additional inner layer called the Insertable B-Layer (IBL). The Readout-Driver card (ROD), the Back-of-Crate card (BOC), and the S-Link together form the essential frontend data path of the IBL's off-detector DAQ system. The strategy for IBL ROD firmware development was three-fold: keeping as much of the Pixel ROD datapath firmware logic as possible, employing a complete new scheme of steering and calibration firmware, and designing the overall system to prepare for a future unified code version integrating IBL and Pixel layers. Essential features such as data formatting, frontend-specific error handling, and calibration are added to the ROD data path. An IBL DAQ test bench using a realistic front-end chip model was created to serve as an initial framework for full offline electronic system simulation. In this document, major firmware achievements concerning the IBL ROD data path implementation, test on the test bench and ROD prototypes, will be reported. Recent Pixel collaboration efforts focus on finalizing hardware and firmware tests for the IBL. The plan is to approach a complete IBL DAQ hardware-software installation by the end of 2014.

  11. Firmware development and testing of the ATLAS Pixel Detector / IBL ROD card

    International Nuclear Information System (INIS)

    The ATLAS Experiment is reworking and upgrading systems during the current LHC shut down. In particular, the Pixel detector has inserted an additional inner layer called the Insertable B-Layer (IBL). The Readout-Driver card (ROD), the Back-of-Crate card (BOC), and the S-Link together form the essential frontend data path of the IBL's off-detector DAQ system. The strategy for IBL ROD firmware development was three-fold: keeping as much of the Pixel ROD datapath firmware logic as possible, employing a complete new scheme of steering and calibration firmware, and designing the overall system to prepare for a future unified code version integrating IBL and Pixel layers. Essential features such as data formatting, frontend-specific error handling, and calibration are added to the ROD data path. An IBL DAQ test bench using a realistic front-end chip model was created to serve as an initial framework for full offline electronic system simulation. In this document, major firmware achievements concerning the IBL ROD data path implementation, test on the test bench and ROD prototypes, will be reported. Recent Pixel collaboration efforts focus on finalizing hardware and firmware tests for the IBL. The plan is to approach a complete IBL DAQ hardware-software installation by the end of 2014

  12. Ongoing studies for the control system of a serially powered ATLAS pixel detector at the HL-LHC

    Science.gov (United States)

    Kersten, S.; Püllen, L.; Zeitnitz, C.

    2016-02-01

    In terms of the phase-2 upgrade of the ATLAS detector, the entire inner tracker (ITk) of ATLAS will be replaced. This includes the pixel detector and the corresponding detector control system (DCS). The current baseline is a serial powering scheme of the detector modules. Therefore a new detector control system is being developed with emphasis on the supervision of serially powered modules. Previous chips had been designed to test the radiation hardness of the technology and the implementation of the modified I2C as well as the implementation of the logic of the CAN protocol. This included tests with triple redundant registers. The described chip is focusing on the implementation in a serial powering scheme. It was designed for laboratory tests, aiming for the proof of principle. The concept of the DCS for ATLAS pixel after the phase-2 upgrade is presented as well as the status of development including tests with the prototype ASIC.

  13. Experiences with module-production and system tests for the ATLAS Pixel Detector

    Science.gov (United States)

    Grosse-Knetter, Jörn; Hügging, Fabian; Mättig, Peter; Reeves, Kendall; Schultes, Joachim; Weingarten, Jens; Wermes, Norbert

    2006-09-01

    The ATLAS pixel detector is built from 1744 modules which are organized in three barrel layers and three disk layers in forward direction. The modules consist of an oxygen-enriched silicon sensor with an active area of 60.8×16.4 mm2. Its 46 080 pixels are read out by 16 frontend chips, bump bonded to the sensor using a state-of-the-art hybridization technique. After extensive characterization of the single modules they are mounted on support structures, made from a carbon-carbon composite material, which make up the barrel or the disc layers. The first of these assemblies are used to study the behavior of the modules outside the lab environment.

  14. System test and noise performance studies at the ATLAS pixel detector

    International Nuclear Information System (INIS)

    The central component of the ATLAS Inner Tracker is the pixel detector. It consists of three barrel layers and three disk-layers in the end-caps in both forward directions. The innermost barrel layer is mounted at a distance of about 5 cm from the interaction region. With its very high granularity, truly two-dimensional hit information, and fast readout it is well suited to cope with the high densities of charged tracks, expected this close to the interaction region. The huge number of readout channels necessitates a very complex services infrastructure for powering, readout and safety. After a description of the pixel detector and its services infrastructure, key results from the system test at CERN are presented. Furthermore the noise performance of the pixel detector, crucial for high tracking and vertexing efficiencies, is studied. Measurements of the single-channel random noise are presented together with studies of common mode noise and measurements of the noise occupancy using a random trigger generator. (orig.)

  15. System test and noise performance studies at the ATLAS pixel detector

    Energy Technology Data Exchange (ETDEWEB)

    Weingarten, J.

    2007-09-15

    The central component of the ATLAS Inner Tracker is the pixel detector. It consists of three barrel layers and three disk-layers in the end-caps in both forward directions. The innermost barrel layer is mounted at a distance of about 5 cm from the interaction region. With its very high granularity, truly two-dimensional hit information, and fast readout it is well suited to cope with the high densities of charged tracks, expected this close to the interaction region. The huge number of readout channels necessitates a very complex services infrastructure for powering, readout and safety. After a description of the pixel detector and its services infrastructure, key results from the system test at CERN are presented. Furthermore the noise performance of the pixel detector, crucial for high tracking and vertexing efficiencies, is studied. Measurements of the single-channel random noise are presented together with studies of common mode noise and measurements of the noise occupancy using a random trigger generator. (orig.)

  16. ATLAS Pixel Detector ROD card from IBL towards Layers 2 and 1

    Science.gov (United States)

    Balbi, G.; Falchieri, D.; Gabrielli, A.; Lama, L.; Giangiacomi, N.; Travaglini, R.

    2016-01-01

    The incoming and future upgrades of LHC will require better performance by the data acquisition system, especially in terms of throughput due to the higher luminosity that is expected. For this reason, during the first shutdown of the LHC collider in 2013/14, the ATLAS Pixel Detector has been equipped with a fourth layer— the Insertable B-Layer or IBL—located at a radius smaller than the present three layers. To read out the new layer of pixels, with a smaller pixel size with respect to the other outer layers, a front end ASIC (FE-I4) was designed as well as a new off-detector read-out chain. The latter, accordingly to the structure of the other layers of pixels, is composed mainly of two 9U-VME read-out off-detector cards called the Back-Of-Crate (BOC) and Read-Out Driver (ROD). The ROD is used for data and event formatting and for configuration and control of the overall read-out electronics. After some prototyping samples were completed, a pre-production batch of 5 ROD cards was delivered with the final layout. Another production of 15 ROD cards was done in Fall 2013, and commissioning was completed in 2014. Altogether 14 cards are necessary for the 14 staves of the IBL detector, one additional card is required by the Diamond Beam Monitor (DBM), and additional spare ROD cards were produced for a total initial batch of 20 boards. This paper describes some integration tests that were performed and our plan to install the new DAQ chain for the layer 2, which is the outermost, and layer 1, which is external to the B-layer. This latter is the only layer that will not be upgraded to a higher readout speed. Rather, it will be switched off in the near future as it has too many damaged sensors that were not possible to rework. To do that, slices of the IBL read-out chain have been instrumented, and ROD performance is verified on a test bench mimicking a small-sized final setup. Thus, this contribution reports also how the adoption of the IBL ROD for ATLAS Pixel

  17. Firmware development and testing of the ATLAS Pixel Detector / IBL ROD card

    CERN Document Server

    Gabrielli, Alessandro; The ATLAS collaboration; Balbi, Gabriele; Bindi, Marcello; Chen, Shaw-pin; Falchieri, Davide; Flick, Tobias; Hauck, Scott Alan; Hsu, Shih-Chieh; Kretz, Moritz; Kugel, Andreas; Lama, Luca; Travaglini, Riccardo; Wensing, Marius; ATLAS Pixel Collaboration

    2015-01-01

    The ATLAS Experiment is reworking and upgrading systems during the current LHC shut down. In particular, the Pixel detector has inserted an additional inner layer called Insertable B-Layer (IBL). The Readout-Driver card (ROD), the Back-of-Crate card (BOC), and the S-Link together form the essential frontend data path of the IBL’s off-detector DAQ system. The strategy for IBL ROD firmware development was three-fold: keeping as much of the Pixel ROD datapath firmware logic as possible, employing a complete new scheme of steering and calibration firmware and designing the overall system to prepare for a future unified code version integrating IBL and Pixel layers. Essential features such as data formatting, frontend-specific error handling, and calibration are added to the ROD data path. An IBL DAQ testbench using realistic frontend chip model was created to serve as an initial framework for full offline electronic system simulation. In this document, major firmware achievements concerning the IBL ROD data pat...

  18. Firmware development and testing of the ATLAS Pixel Detector / IBL ROD card

    CERN Document Server

    Balbi, G; The ATLAS collaboration; Gabrielli, A; Lama, L; Travaglini, R; Backhaus, M; Bindi, M; Chen, S-P; Flick, T; Kretz, M; Kugel, A; Wensing, M

    2014-01-01

    The ATLAS Experiment is reworking and upgrading systems during the current LHC shut down. In particular, the Pixel detector has inserted an additional inner layer called Insertable B-Layer (IBL). The Readout-Driver card (ROD), the Back-of-Crate card (BOC), and the S-Link together form the essential frontend data path of the IBL’s off-detector DAQ system. The strategy for IBLROD firmware development was three-fold: keeping as much of the PixelROD datapath firmware logic as possible, employing a complete new scheme of steering and calibration firmware and designing the overall system to prepare for a future unified code version integrating IBL and Pixel layers. Essential features such as data formatting, frontend-specific error handling, and calibration are added to the ROD data path. An IBLDAQ testbench using realistic frontend chip model was created to serve as an initial framework for full offline electronic system simulation. In this document, major firmware achievements concerning the IBLROD data path im...

  19. 3D silicon pixel detectors for the ATLAS Forward Physics experiment

    International Nuclear Information System (INIS)

    The ATLAS Forward Physics (AFP) project plans to install 3D silicon pixel detectors about 210 m away from the interaction point and very close to the beamline (2–3 mm). This implies the need of slim edges of about 100–200 μm width for the sensor side facing the beam to minimise the dead area. Another challenge is an expected non-uniform irradiation of the pixel sensors. It is studied if these requirements can be met using slightly-modified FE-I4 3D pixel sensors from the ATLAS Insertable B-Layer production. AFP-compatible slim edges are obtained with a simple diamond-saw cut. Electrical characterisations and beam tests are carried out and no detrimental impact on the leakage current and hit efficiency is observed. For devices without a 3D guard ring a remaining insensitive edge of less than 15 μm width is found. Moreover, 3D detectors are non-uniformly irradiated up to fluences of several 1015 neq/cm2 with either a focussed 23 GeV proton beam or a 23 MeV proton beam through holes in Al masks. The efficiency in the irradiated region is found to be similar to the one in the non-irradiated region and exceeds 97% in case of favourable chip-parameter settings. Only in a narrow transition area at the edge of the hole in the Al mask, a significantly lower efficiency is seen. A follow-up study of this effect using arrays of small pad diodes for position-resolved dosimetry via the leakage current is carried out

  20. Beam test studies of 3D pixel sensors irradiated non-uniformly for the ATLAS forward physics detector

    International Nuclear Information System (INIS)

    Pixel detectors with cylindrical electrodes that penetrate the silicon substrate (so called 3D detectors) offer advantages over standard planar sensors in terms of radiation hardness, since the electrode distance is decoupled from the bulk thickness. In recent years significant progress has been made in the development of 3D sensors, which culminated in the sensor production for the ATLAS Insertable B-Layer (IBL) upgrade carried out at CNM (Barcelona, Spain) and FBK (Trento, Italy). Based on this success, the ATLAS Forward Physics (AFP) experiment has selected the 3D pixel sensor technology for the tracking detector. The AFP project presents a new challenge due to the need for a reduced dead area with respect to IBL, and the in-homogeneous nature of the radiation dose distribution in the sensor. Electrical characterization of the first AFP prototypes and beam test studies of 3D pixel devices irradiated non-uniformly are presented in this paper

  1. Beam test studies of 3D pixel sensors irradiated non-uniformly for the ATLAS forward physics detector

    Energy Technology Data Exchange (ETDEWEB)

    Grinstein, S., E-mail: sgrinstein@ifae.es [ICREA and Institut de Física d' Altes Energies (IFAE), Barcelona (Spain); Baselga, M. [Centro Nacional de Microelectronica, CNM-IMB (CSIC), Barcelona (Spain); Boscardin, M. [Fondazione Bruno Kessler, FBK-CMM, Trento (Italy); Christophersen, M. [U.S. Naval Research Laboratory, Washington (United States); Da Via, C. [School of Physics and Astronomy, University of Manchester, Manchester (United Kingdom); Dalla Betta, G.-F. [Universita degli Studi di Trento and INFN, Trento (Italy); Darbo, G. [INFN Sezione di Genova, Genova (Italy); Fadeyev, V. [Santa Cruz Institute for Particle Physics, University of California, Santa Cruz (United States); Fleta, C. [Centro Nacional de Microelectronica, CNM-IMB (CSIC), Barcelona (Spain); Gemme, C. [Universita degli Studi di Trento and INFN, Trento (Italy); Grenier, P. [SLAC National Accelerator Laboratory, Menlo Park (United States); Jimenez, A.; Lopez, I.; Micelli, A. [ICREA and Institut de Física d' Altes Energies (IFAE), Barcelona (Spain); Nelist, C. [INFN Sezione di Genova, Genova (Italy); Parker, S. [University of Hawaii, c/o Lawrence Berkeley Laboratory, Berkeley (United States); Pellegrini, G. [Centro Nacional de Microelectronica, CNM-IMB (CSIC), Barcelona (Spain); Phlips, B. [U.S. Naval Research Laboratory, Washington (United States); Pohl, D.-L. [University of Bonn, Bonn (Germany); Sadrozinski, H.F.-W. [Santa Cruz Institute for Particle Physics, University of California, Santa Cruz (United States); and others

    2013-12-01

    Pixel detectors with cylindrical electrodes that penetrate the silicon substrate (so called 3D detectors) offer advantages over standard planar sensors in terms of radiation hardness, since the electrode distance is decoupled from the bulk thickness. In recent years significant progress has been made in the development of 3D sensors, which culminated in the sensor production for the ATLAS Insertable B-Layer (IBL) upgrade carried out at CNM (Barcelona, Spain) and FBK (Trento, Italy). Based on this success, the ATLAS Forward Physics (AFP) experiment has selected the 3D pixel sensor technology for the tracking detector. The AFP project presents a new challenge due to the need for a reduced dead area with respect to IBL, and the in-homogeneous nature of the radiation dose distribution in the sensor. Electrical characterization of the first AFP prototypes and beam test studies of 3D pixel devices irradiated non-uniformly are presented in this paper.

  2. Beam Test Studies of 3D Pixel Sensors Irradiated Non-Uniformly for the ATLAS Forward Physics Detector

    CERN Document Server

    Grinstein, S; Boscardin, M; Christophersen, M; Da Via, C; Betta, G -F Dalla; Darbo, G; Fadeyev, V; Fleta, C; Gemme, C; Grenier, P; Jimenez, A; Lopez, I; Micelli, A; Nelist, C; Parker, S; Pellegrini, G; Phlips, B; Pohl, D L; Sadrozinski, H F -W; Sicho, P; Tsiskaridze, S

    2013-01-01

    Pixel detectors with cylindrical electrodes that penetrate the silicon substrate (so called 3D detectors) offer advantages over standard planar sensors in terms of radiation hardness, since the electrode distance is decoupled from the bulk thickness. In recent years significant progress has been made in the development of 3D sensors, which culminated in the sensor production for the ATLAS Insertable B-Layer (IBL) upgrade carried out at CNM (Barcelona, Spain) and FBK (Trento, Italy). Based on this success, the ATLAS Forward Physics (AFP) experiment has selected the 3D pixel sensor technology for the tracking detector. The AFP project presents a new challenge due to the need for a reduced dead area with respect to IBL, and the in-homogeneous nature of the radiation dose distribution in the sensor. Electrical characterization of the first AFP prototypes and beam test studies of 3D pixel devices irradiated non-uniformly are presented in this paper.

  3. Qualification measurements of the voltage supply system as well as conceptionation of a state machine for the detector control of the ATLAS pixel detector

    International Nuclear Information System (INIS)

    The supply system and the control system of the ATLAS pixel detector represent important building blocks of the pixel detector. Corresponding studies of the supply system, which were performed within a comprehensive test system, the so-called system test, with nearly all final components and the effects on the pixel detector are object of this thesis. A further point of this thesis is the coordination and further development of the detector-control-system software under regardment of the different partial systems. A main topic represents thereby the conceptionation of the required state machine as interface for the users and the connection to the data acquisition system

  4. Development of a detector control system for the serially powered ATLAS pixel detector at the HL-LHC

    Energy Technology Data Exchange (ETDEWEB)

    Puellen, Lukas

    2015-02-10

    In the years around 2020 the LHC will be upgraded to the HL-LHC. In terms of this upgrade, the ATLAS detector will also be upgraded. This also includes the pixel detector, the innermost of the sub-detectors in ATLAS. Thereby the powering concept of the pixel detector will be changed to reduce the material budget of the detector. From individual powering of each detector module, the concept changes to serial powering, where all modules of a powering group are connected in series. This change makes the development of a new detector control system (DCS) mandatory. Therefore, a new concept for the ATLAS pixel DCS is being developed at the University of Wuppertal. This concept is split into three paths: a safety path, a control path, and a diagnostics path. The safety path is a hard wired interlock system. The concept of this system will not differ significantly, compared to the interlock system of the current detector. The diagnostics path is embedded into the optical data read-out of the detector and will be used for detector tuning with high precision and granularity. The control path supervises the detector and provides a user interface to the hardware components. A concept for this path, including a prototype and proof-of-principle studies, has been developed in terms of this thesis. The control path consists of the DCS network, a read-out and controlling topology created by two types of ASICs: the DCS controller and the DCS chip. These ASICs measure and control all values, necessary for a safe detector operation in situ. This reduces the number of required cables and hence the material budget of the system. For the communication between these ASICs, two very fault tolerant bus protocols have been chosen: CAN bus carries data from the DCS computers, outside of the detector, to the DCS controllers at the edge of the pixel detector. For the communication between the DCS controller and the DCS chip, which is located close to each detector module, an enhanced I2C

  5. Development of a detector control system for the serially powered ATLAS pixel detector at the HL-LHC

    International Nuclear Information System (INIS)

    In the years around 2020 the LHC will be upgraded to the HL-LHC. In terms of this upgrade, the ATLAS detector will also be upgraded. This also includes the pixel detector, the innermost of the sub-detectors in ATLAS. Thereby the powering concept of the pixel detector will be changed to reduce the material budget of the detector. From individual powering of each detector module, the concept changes to serial powering, where all modules of a powering group are connected in series. This change makes the development of a new detector control system (DCS) mandatory. Therefore, a new concept for the ATLAS pixel DCS is being developed at the University of Wuppertal. This concept is split into three paths: a safety path, a control path, and a diagnostics path. The safety path is a hard wired interlock system. The concept of this system will not differ significantly, compared to the interlock system of the current detector. The diagnostics path is embedded into the optical data read-out of the detector and will be used for detector tuning with high precision and granularity. The control path supervises the detector and provides a user interface to the hardware components. A concept for this path, including a prototype and proof-of-principle studies, has been developed in terms of this thesis. The control path consists of the DCS network, a read-out and controlling topology created by two types of ASICs: the DCS controller and the DCS chip. These ASICs measure and control all values, necessary for a safe detector operation in situ. This reduces the number of required cables and hence the material budget of the system. For the communication between these ASICs, two very fault tolerant bus protocols have been chosen: CAN bus carries data from the DCS computers, outside of the detector, to the DCS controllers at the edge of the pixel detector. For the communication between the DCS controller and the DCS chip, which is located close to each detector module, an enhanced I2C

  6. Prototypes for components of a control system for the ATLAS pixel detector at the HL-LHC

    International Nuclear Information System (INIS)

    In the years around 2020 an upgrade of the LHC to the HL-LHC is scheduled, which will increase the accelerator's instantaneous luminosity by a factor of 5 and the integrated luminosity by a factor of 10. In the context of this upgrade, the inner detector (including the pixel detector) of the ATLAS experiment will be replaced. This new pixel detector requires a specific control system which complies with strict requirements in terms of radiation hardness, material budget and space for the electronics in the ATLAS experiment. The University of Wuppertal is developing a concept for a DCS (Detector Control System) network consisting of two kinds of ASICs. The first ASIC is the DCS chip which is located on the pixel detector, very close to the interaction point. The second ASIC is the DCS Controller which is controlling 4×4 DCS chips from the outer regions of ATLAS via differential data lines. Both ASICs are manufactured in 130 nm deep sub-micron technology. We present results from reliability measurements under irradiation from new prototypes of components for the DCS network.

  7. Commissioning of the Atlas pixel detector and search of the Higgs boson in the tt-H, H → bb- channel with the Atlas experiment at the LHC

    International Nuclear Information System (INIS)

    The global fit of Higgs boson quantum contributions to the electroweak experimental observables, computed within the Standard Model, favors a light Higgs boson with a mass of mH = 90-27+36 GeV, on the edge of the 95% Confidence Level region excluded by LEP. Finding a light Higgs boson at LHC is experimentally difficult and several channels with various signatures will be sought for. The associated production of the Higgs boson with a pair of top quarks, with the subsequent decay of the Higgs boson into b-quark pairs (dominant for mH <135 GeV), is one of the channels considered. This channel opens the possibility of measuring the top and b-quark Yukawa couplings. The potential of the ATLAS detector to observe this channel is described. Several ingredients are crucial: the reconstruction of the top-anti-top system with a high-purity, excellent b-tagging capabilities and good knowledge of the tt-bar+jets background. The pixel detector is the most important ATLAS sub-detectors for tagging b -jets. The ATLAS detector was commissioned with cosmic muon rays in autumn 2008. The pixel detector dead channels, calibration constants and slow control informations are described for this period. A detailed study about pixel noise determination and suppression is presented. Finally, the pixel detection efficiency is measured using cosmic muon rays. (author)

  8. FE-I4 Chip Development for Upgraded ATLAS Pixel Detector at LHC

    CERN Document Server

    Barbero, M; The ATLAS collaboration

    2010-01-01

    A new ATLAS pixel chip FE-I4 has been developed for use in upgraded LHC luminosity environments, including the near-term Insertable B-Layer upgrade. FE-I4 is designed in a 130 nm CMOS technology, presenting advantages in terms of radiation tolerance and digital logic density compared to the 0.25 μm CMOS technology used for the current ATLAS pixel IC, FE-I3. FE-I4 architecture is based on an array of 80×336 pixels, each 50×250 μm2, consisting of analog and digital sections. The analog pixel section is designed for low power consumption and compatibility to several sensor candidates. It is based on a two-stage architecture with a pre-amp AC-coupled to a second stage of amplification. It features leakage current compensation circuitry, local 4-bit pre-amp feedback tuning and a discriminator locally adjusted through 5 configuration bits. The digital architecture is based on a 4-pixel unit called Pixel Digital Region (PDR) allowing for local storage of hits in 5-deep data buffers at pixel level for the duratio...

  9. Development of hybrid pixel detectors for proton-proton collisions in the ATLAS experiment at the Large Hadron Collider at CERN

    International Nuclear Information System (INIS)

    The ATLAS experiment at the future large hadron collider at CERN uses a silicon pixel detector as the innermost tracking device. The detector is built using ∼2000 modules which consist of a silicon sensor and 16 bump bonded VLSI electronic readout chips with ∼3000 channels per chip. The requirements for the sensor and the 1.4 x 108 preamplifier channels are discussed. The architectures of several existing readout chips are described. Detailed laboratory measurements have been performed on all chips and the results are compared to the requirements of ATLAS. The performance of a first ATLAS compatible pixel detector assembly in a test beam at CERN is presented. (orig.)

  10. High-voltage pixel detectors in commercial CMOS technologies for ATLAS, CLIC and Mu3e experiments

    CERN Document Server

    Peric,I et al.

    2013-01-01

    High-voltage particle detectors in commercial CMOS technologies are a detector family that allows implementation of low-cost, thin and radiation-tolerant detectors with a high time resolution. In the R/D phase of the development, a radiation tolerance of 1015 neq=cm2 , nearly 100% detection efficiency and a spatial resolution of about 3 μm were demonstrated. Since 2011 the HV detectors have first applications: the technology is presently the main option for the pixel detector of the planned Mu3e experiment at PSI (Switzerland). Several prototype sensors have been designed in a standard 180 nm HV CMOS process and successfully tested. Thanks to its high radiation tolerance, the HV detectors are also seen at CERN as a promising alternative to the standard options for ATLAS upgrade and CLIC. In order to test the concept, within ATLAS upgrade R/D, we are currently exploring an active pixel detector demonstrator HV2FEI4; also implemented in the 180 nm HV process.

  11. High-voltage pixel detectors in commercial CMOS technologies for ATLAS, CLIC and Mu3e experiments

    CERN Document Server

    Peric, Ivan; Backhaus, Malte; Barbero, Marlon; Benoit, Mathieu; Berger, Niklaus; Bompard, Frederic; Breugnon, Patrick; Clemens, Jean-Claude; Dannheim, Dominik; Dierlamm, Alexander; Feigl, Simon; Fischer, Peter; Fougeron, Denis; Garcia-Sciveres, Maurice; Heim, Timon; Hügging, Fabian; Kiehn, Moritz; Kreidl, Christian; Krüger, Hans; La Rosa, Alessandro; Liu, Jian; Lütticke, Florian; Mariñas, Carlos; Meng, Lingxin; Miucci, Antonio; Münstermann, Daniel; Nguyen, Hong Hanh; Obermann, Theresa; Pangaud, Patrick; Perrevoort, Ann-Kathrin; Rozanov, Alexandre; Schöning, André; Schwenker, Benjamin; Wiedner, Dirk

    2013-01-01

    High-voltage particle detectors in commercial CMOS technologies are a detector family that allows implementation of low-cost, thin and radiation-tolerant detectors with a high time resolution. In the R/D phase of the development, a radiation tolerance of 10 15 n eq = cm 2 , nearly 100% detection ef fi ciency and a spatial resolution of about 3 μ m were demonstrated. Since 2011 the HV detectors have fi rst applications: the technology is presently the main option for the pixel detector of the planned Mu3e experiment at PSI (Switzerland). Several prototype sensors have been designed in a standard 180 nm HV CMOS process and successfully tested. Thanks to its high radiation tolerance, the HV detectors are also seen at CERN as a promising alternative to the standard options for ATLAS upgrade and CLIC. In order to test the concept, within ATLAS upgrade R/D, we are currently exploring an active pixel detector demonstrator HV2FEI4; also implemented in the 180 nm HV process

  12. The ATLAS Silicon Pixel Sensors

    CERN Document Server

    Alam, M S; Einsweiler, K F; Emes, J; Gilchriese, M G D; Joshi, A; Kleinfelder, S A; Marchesini, R; McCormack, F; Milgrome, O; Palaio, N; Pengg, F; Richardson, J; Zizka, G; Ackers, M; Andreazza, A; Comes, G; Fischer, P; Keil, M; Klasen, V; Kühl, T; Meuser, S; Ockenfels, W; Raith, B; Treis, J; Wermes, N; Gössling, C; Hügging, F G; Wüstenfeld, J; Wunstorf, R; Barberis, D; Beccherle, R; Darbo, G; Gagliardi, G; Gemme, C; Morettini, P; Musico, P; Osculati, B; Parodi, F; Rossi, L; Blanquart, L; Breugnon, P; Calvet, D; Clemens, J-C; Delpierre, P A; Hallewell, G D; Laugier, D; Mouthuy, T; Rozanov, A; Valin, I; Aleppo, M; Caccia, M; Ragusa, F; Troncon, C; Lutz, Gerhard; Richter, R H; Rohe, T; Brandl, A; Gorfine, G; Hoeferkamp, M; Seidel, SC; Boyd, GR; Skubic, P L; Sícho, P; Tomasek, L; Vrba, V; Holder, M; Ziolkowski, M; D'Auria, S; del Papa, C; Charles, E; Fasching, D; Becks, K H; Lenzen, G; Linder, C

    2001-01-01

    Prototype sensors for the ATLAS silicon pixel detector have been developed. The design of the sensors is guided by the need to operate them in the severe LHC radiation environment at up to several hundred volts while maintaining a good signal-to-noise ratio, small cell size, and minimal multiple scattering. The ability to be operated under full bias for electrical characterization prior to the attachment of the readout integrated circuit electronics is also desired.

  13. Experience with 3D integration technologies in the framework of the ATLAS pixel detector upgrade for the HL-LHC

    CERN Document Server

    Aruntinov, D; Gonella, L; Hemperek, T; Hügging, F; Krüger, H; Wermes, N; Breugnon, P; Chantepie, B; Clemens, J.C; Fei, R; Fougeron, D; Godiot, S; Pangaud, P; Rozanov, A; Garcia-Sciveres, M; Mekkaoui, A

    2013-01-01

    3D technologies are investigated for the upgrade of the ATLAS pixel detector at the HL-LHC. R&D focuses on both, IC design in 3D, as well as on post-processing 3D technologies such as Through Silicon Via (TSV). The first one uses a so-called via first technology, featuring the insertion of small aspect ratio TSV at the pixel level. As discussed in the paper, this technology can still present technical challenges for the industrial partners. The second one consists of etching the TSV via last. This technology is investigated to enable 4-side abuttable module concepts, using today's pixel detector technology. Both approaches are presented in this paper and results from first available prototypes are discussed.

  14. Radiationhard components for the control system of a future ATLAS pixel detector

    CERN Document Server

    Becker, K; Kersten, S; Kind, P; Mättig, P; Püllen, L; Zeitnitz, C

    2015-01-01

    will include a new pixel detector. A completely new detector control system (DCS) for this pixel detector will be required in order to cope with the substantial increase in radiation at the HL-LHC. The DCS has to have a very high reliability and all components installed within the detector volume have to be radiationhard. This will ensure a safe operation of the pixel detector and the experiment. A further design constraint is the minimization of the used material and cables in order to limit the impact on the tracking performance to a minimum. To meet these requirements we propose a DCS network which consists of a DCS chip and a DCS controller. In the following we present the development of the first prototypes for the DCS chip and the DCS controller with a special focus on the communication interface, radiation hardness and robustness against single event upsets.

  15. The upgraded Pixel Detector of the ATLAS Experiment for Run-II at the Large Hadron Collider

    CERN Document Server

    Mullier, Geoffrey; The ATLAS collaboration

    2015-01-01

    The Pixel Detector of the ATLAS experiment has shown excellent performance during the whole Run-1 of the LHC. Taking advantage of the detector development period 2013 – 2014, the detector was extracted from the experiment and brought to surface to equip it with new service panels and to repair modules furthermore this helped with the installation of the Insertable B-Layer (IBL), fourth layer of pixel, installed in between the existing Pixel Detector and a new beam-pipe at a radius of 3.3 cm. To cope with the high radiation and increased pixel occupancy due to the proximity to the interaction point, two different silicon sensor technologies (planar and 3D) have been used. A new readout chip has been designed with CMOS 130nm technology with larger area, smaller pixel size and faster readout capability. Dedicated design features in combination with a new composite material were considered and used in order to reduce the material budget of the support structure while keeping the optimal thermo-mechanical perfor...

  16. Module concepts with ultra thin FE chips and Through Silicon Vias for the upgrades of the ATLAS pixel detector

    International Nuclear Information System (INIS)

    The development of trackers for High Energy Physics experiments at high luminosity poses strict requirements on the material budget to allow good vertexing and b-tagging performance. State-of-the-art silicon technologies offer a variety of processes that can be used to achieve light modules design. Together with IZM Berlin we investigated the thinning of FE (Front-End) chips down to 90 μm, and developed a dedicated flip chip process to assure a reliable mechanical and electrical connection between thin FE chips and sensor. The selected flip chip method is currently used for the production of modules for the IBL (Insertable B-Layer) project, the first ATLAS pixel detector upgrade. Results from the characterization of IBL modules with 100 and 150 μm thin FE chip are shown. For future upgrades of the ATLAS pixel detector we propose more advanced module concepts with Through Silicon Vias (TSVs). IZM offers two via last TSV processes, Straight Side Wall TSVs and Tapered Side Wall TSVs. Both processes were successfully demonstrated with ATLAS pixel readout electronics (FE-I2/3). Results from prototype modules with planar sensor and 90 μm thin FE-I2 with Tapered TSV and back side redistribution layer are shown.

  17. Design and implementation of an expert system for the detector control systems of the ATLAS pixel detector

    International Nuclear Information System (INIS)

    In the framework of this thesis an expert system ''Pixel-Advisor'' for the control system of the pixel detector was designed and implemented. This supports the operational personnel in the diagnosis and removal of possible problems, which are in connection with the detector control system and unburdens the few available DCS experts

  18. Qualification measurements of the voltage supply system as well as conceptionation of a state machine for the detector control of the ATLAS pixel detector; Qualifizierungsmessungen des Spannungsversorgungssystems sowie Konzeptionierung einer Zustandsmaschine fuer die Detektorkontrolle des ATLAS-Pixeldetektors

    Energy Technology Data Exchange (ETDEWEB)

    Schultes, Joachim

    2007-02-15

    The supply system and the control system of the ATLAS pixel detector represent important building blocks of the pixel detector. Corresponding studies of the supply system, which were performed within a comprehensive test system, the so-called system test, with nearly all final components and the effects on the pixel detector are object of this thesis. A further point of this thesis is the coordination and further development of the detector-control-system software under regardment of the different partial systems. A main topic represents thereby the conceptionation of the required state machine as interface for the users and the connection to the data acquisition system.

  19. The upgraded Pixel detector and the commissioning of the Inner Detector tracking of the ATLAS experiment for Run-2 at the Large Hadron Collider

    CERN Document Server

    AUTHOR|(INSPIRE)INSPIRE-00019188; The ATLAS collaboration

    2016-01-01

    Run-2 of the Large Hadron Collider (LHC) will provide new challenges to track and vertex reconstruction with higher energies, denser jets and higher rates. Therefore the ATLAS experiment has constructed the first 4-layer Pixel detector in HEP, installing a new Pixel layer, also called Insertable B-Layer (IBL). The IBL is a fourth layer of pixel detectors, and has been installed in May 2014 at a radius of 3.3 cm between the existing Pixel Detector and a new smaller radius beam-pipe. The new detector, built to cope with the high radiation and expected occupancy, is the first large scale application of 3D detectors and CMOS 130~nm technology. In addition, the Pixel detector was refurbished with a new service quarter panel to recover about 3% of defective modules lost during Run-1 and a new optical readout system to readout the data at higher speed while reducing the occupancy when running with increased luminosity. Complementing detector improvements, many improvements to Inner Detector track and vertex reconstr...

  20. Measurements and TCAD simulation of novel ATLAS planar pixel detector structures for the HL-LHC upgrade

    CERN Document Server

    Nellist, C; Gkougkousis, E; Lounis, A

    2015-01-01

    The LHC accelerator complex will be upgraded between 2020-2022, to the High-Luminosity-LHC, to considerably increase statistics for the various physics analyses. To operate under these challenging new conditions, and maintain excellent performance in track reconstruction and vertex location, the ATLAS pixel detector must be substantially upgraded and a full replacement is expected. Processing techniques for novel pixel designs are optimised through characterisation of test structures in a clean room and also through simulations with Technology Computer Aided Design (TCAD). A method to study non-perpendicular tracks through a pixel device is discussed. Comparison of TCAD simulations with Secondary Ion Mass Spectrometry (SIMS) measurements to investigate the doping profile of structures and validate the simulation process is also presented.

  1. Measurements and TCAD simulation of novel ATLAS planar pixel detector structures for the HL-LHC upgrade

    International Nuclear Information System (INIS)

    The LHC accelerator complex will be upgraded between 2020–2022, to the High-Luminosity-LHC, to considerably increase statistics for the various physics analyses. To operate under these challenging new conditions, and maintain excellent performance in track reconstruction and vertex location, the ATLAS pixel detector must be substantially upgraded and a full replacement is expected. Processing techniques for novel pixel designs are optimised through characterisation of test structures in a clean room and also through simulations with Technology Computer Aided Design (TCAD). A method to study non-perpendicular tracks through a pixel device is discussed. Comparison of TCAD simulations with Secondary Ion Mass Spectrometry (SIMS) measurements to investigate the doping profile of structures and validate the simulation process is also presented

  2. Studies on irradiated pixel detectors for the ATLAS IBL and HL-LHC upgrade

    CERN Document Server

    AUTHOR|(INSPIRE)INSPIRE-00371978; Gößling, Claus; Pernegger, Heinz

    The constant demand for higher luminosity in high energy physics is the reason for the continuous effort to adapt the accelerators and the experiments. The upgrade program for the experiments and the accelerators at CERN already includes several expansion stages of the Large Hadron Collider (LHC) which will increase the luminosity and the energy of the accelerator. Simultaneously the LHC experiments prepare the individual sub-detectors for the increasing demands in the coming years. Especially the tracking detectors have to cope with fluence levels unprecedented for high energy physics experiments. Correspondingly to the fluence increases the impact of the radiation damage which reduces the life time of the detectors by decreasing the detector performance and efficiency. To cope with this effect new and more radiation hard detector concepts become necessary to extend the life time. This work concentrates on the impact of radiation damage on the pixel sensor technologies to be used in the next upgrade of the ...

  3. Diamond Pixel Detectors

    Energy Technology Data Exchange (ETDEWEB)

    Adam, W.; Berdermann, E.; Bergonzo, P.; Bertuccio, G.; Bogani, F.; Borchi, E.; Brambilla, A.; Bruzzi, M.; Colledani, C.; Conway, J.; D' Angelo, P.; Dabrowski, W.; Delpierre, P.; Deneuville, A.; Doroshenko, J.; Dulinski, W.; Eijk, B. van; Fallou, A.; Fizzotti, F.; Foster, J.; Foulon, F.; Friedl, M.; Gan, K.K.; Gheeraert, E.; Gobbi, B.; Grim, G.P.; Hallewell, G.; Han, S.; Hartjes, F.; Hrubec, J.; Husson, D.; Kagan, H.; Kania, D.; Kaplon, J.; Kass, R.; Koeth, T.; Krammer, M.; Lander, R.; Logiudice, A.; Lu, R.; Lynne, L.M.; Manfredotti, C.; Meier, D.; Mishina, M.; Moroni, L.; Oh, A.; Pan, L.S.; Pernicka, M.; Perera, L. E-mail: perera@physics.rutgers.edu; Pirollo, S.; Plano, R.; Procario, M.; Riester, J.L.; Roe, S.; Rott, C.; Rousseau, L.; Rudge, A.; Russ, J.; Sala, S.; Sampietro, M.; Schnetzer, S.; Sciortino, S.; Stelzer, H.; Stone, R.; Suter, B.; Tapper, R.J.; Tesarek, R.; Trischuk, W.; Tromson, D.; Vittone, E.; Wedenig, R.; Weilhammer, P.; White, C.; Zeuner, W.; Zoeller, M

    2001-06-01

    Diamond based pixel detectors are a promising radiation-hard technology for use at the LHC. We present first results on a CMS diamond pixel sensor. With a threshold setting of 2000 electrons, an average pixel efficiency of 78% was obtained for normally incident minimum ionizing particles.

  4. Diamond pixel detectors

    CERN Document Server

    Adam, W; Bergonzo, P; Bertuccio, G; Bognai, F; Borchi, E; Brambilla, A; Bruzzi, Mara; Colledani, C; Conway, J; D'Angelo, P; Dabrowski, W; Delpierre, P A; Deneuville, A; Doroshenko, J; Dulinski, W; van Eijk, B; Fallou, A; Fizzotti, F; Foster, J; Foulon, F; Friedl, M; Gan, K K; Gheeraert, E; Gobbi, B; Grim, G P; Hallewell, G D; Han, S; Hartjes, F G; Hrubec, Josef; Husson, D; Kagan, H; Kania, D R; Kaplon, J; Kass, R; Koeth, T W; Krammer, Manfred; Lander, R; Lo Giudice, A; Lü, R; MacLynne, L; Manfredotti, C; Meier, D; Mishina, M; Moroni, L; Oh, A; Pan, L S; Pernicka, Manfred; Perera, L P; Pirollo, S; Plano, R; Procario, M; Riester, J L; Roe, S; Rott, C; Rousseau, L; Rudge, A; Russ, J; Sala, S; Sampietro, M; Schnetzer, S; Sciortino, S; Stelzer, H; Stone, R; Suter, B; Tapper, R J; Tesarek, R; Trischuk, W; Tromson, D; Vittone, E; Wedenig, R; Weilhammer, Peter; White, C; Zeuner, W; Zöller, M

    2001-01-01

    Diamond based pixel detectors are a promising radiation-hard technology for use at the LHC. We present first results on a CMS diamond pixel sensor. With a threshold setting of 2000 electrons, an average pixel efficiency of 78% was obtained for normally incident minimum ionizing particles. (3 refs).

  5. Diamond Pixel Detectors

    International Nuclear Information System (INIS)

    Diamond based pixel detectors are a promising radiation-hard technology for use at the LHC. We present first results on a CMS diamond pixel sensor. With a threshold setting of 2000 electrons, an average pixel efficiency of 78% was obtained for normally incident minimum ionizing particles

  6. 3D silicon sensors: Design, large area production and quality assurance for the ATLAS IBL pixel detector upgrade

    International Nuclear Information System (INIS)

    3D silicon sensors, where electrodes penetrate the silicon substrate fully or partially, have successfully been fabricated in different processing facilities in Europe and USA. The key to 3D fabrication is the use of plasma micro-machining to etch narrow deep vertical openings allowing dopants to be diffused in and form electrodes of pin junctions. Similar openings can be used at the sensor's edge to reduce the perimeter's dead volume to as low as ∼4 μm. Since 2009 four industrial partners of the 3D ATLAS R and D Collaboration started a joint effort aimed at one common design and compatible processing strategy for the production of 3D sensors for the LHC Upgrade and in particular for the ATLAS pixel Insertable B-Layer (IBL). In this project, aimed for installation in 2013, a new layer will be inserted as close as 3.4 cm from the proton beams inside the existing pixel layers of the ATLAS experiment. The detector proximity to the interaction point will therefore require new radiation hard technologies for both sensors and front end electronics. The latter, called FE-I4, is processed at IBM and is the biggest front end of this kind ever designed with a surface of ∼4 cm2. The performance of 3D devices from several wafers was evaluated before and after bump-bonding. Key design aspects, device fabrication plans and quality assurance tests during the 3D sensors prototyping phase are discussed in this paper.

  7. High speed data transmission on small gauge cables for the ATLAS Phase-II Pixel detector upgrade

    Science.gov (United States)

    Shahinian, J.; Volk, J.; Fadeyev, V.; Grillo, A. A.; Meimban, B.; Nielsen, J.; Wilder, M.

    2016-03-01

    The High Luminosity LHC will present a number of challenges for the upgraded ATLAS detector. In particular, data transmission requirements for the upgrade of the ATLAS Pixel detector will be difficult to meet. The expected trigger rate and occupancy imply multi-gigabit per second transmission rates will be required but radiation levels at the smallest radius preclude completely optical solutions. Electrical transmission up to distances of 7m will be necessary to move optical components to an area with lower radiation levels. Here, we explore the use of small gauge electrical cables as a high-bandwidth, radiation hard solution with a sufficiently small radiation length. In particular, we present a characterization of various twisted wire pair (TWP) configurations of various material structures, including measurements of their bandwidth, crosstalk, and radiation hardness. We find that a custom ``hybrid'' cable consisting of 1m of a multi-stranded TWP with Poly-Ether-Ether-Ketone (PEEK) insulation and a thin Al shield followed by 6m of a thin twin-axial cable presents a low-mass solution that fulfills bandwidth requirements and is expected to be sufficiently radiation hard. Additionally, we discuss preliminary results of using measured S-parameters to produce a SPICE model for a 1m sample of the custom TWP to be used for the development of new pixel readout chips.

  8. High speed data transmission on small gauge cables for the ATLAS Phase-II Pixel detector upgrade

    International Nuclear Information System (INIS)

    The High Luminosity LHC will present a number of challenges for the upgraded ATLAS detector. In particular, data transmission requirements for the upgrade of the ATLAS Pixel detector will be difficult to meet. The expected trigger rate and occupancy imply multi-gigabit per second transmission rates will be required but radiation levels at the smallest radius preclude completely optical solutions. Electrical transmission up to distances of 7m will be necessary to move optical components to an area with lower radiation levels. Here, we explore the use of small gauge electrical cables as a high-bandwidth, radiation hard solution with a sufficiently small radiation length. In particular, we present a characterization of various twisted wire pair (TWP) configurations of various material structures, including measurements of their bandwidth, crosstalk, and radiation hardness. We find that a custom ''hybrid'' cable consisting of 1m of a multi-stranded TWP with Poly-Ether-Ether-Ketone (PEEK) insulation and a thin Al shield followed by 6m of a thin twin-axial cable presents a low-mass solution that fulfills bandwidth requirements and is expected to be sufficiently radiation hard. Additionally, we discuss preliminary results of using measured S-parameters to produce a SPICE model for a 1m sample of the custom TWP to be used for the development of new pixel readout chips

  9. Development of pixel detectors for the IBL and HL-LHC ATLAS experiment upgrade

    CERN Document Server

    Baselga Bacardit, Marta

    2016-03-18

    This thesis presents the development of advanced silicon technology detectors fabricated at CNM-Barcelona for High Energy Physics (HEP) experiments. The pixel size of the tracking silicon detectors for the upgrade of the HL-LHC will have to decrease in size in order to enhance the resolution in position for the measurements and they need to have lower occupancy for the electronics. The future experiments at CERN will cope with fuences up to 2 x 10^^16 neq/cm2, and the smaller 3D silicon detectors will have less trapping of the electron-holes generated in the bulk leading to a better performance under high radiation environment. This thesis studies silicon detectors fabricated at CNM-Barcelona applied to HEP experiments with two different kinds of novel technologies: 3D and Low Gain Avalanche Detectors (LGAD). The 3D detectors make it possible to reduce the size of the depleted region inside the detector and to work at lower voltages, whereas the LGAD detectors have an intrinsic gain which increases the collec...

  10. The Pixel Detector of the ATLAS experiment for the Run2 at the Large Hadron Collider -- Plot Approval (Pixel, IBL) : This is a submission of plot approval request for Pixel+IBL, facing on a talk at ICHEP 2014 conference

    CERN Document Server

    Mandelli, B; The ATLAS collaboration

    2014-01-01

    The Pixel Detector of the ATLAS experiment has shown excellent performance during the whole Run-1 of LHC. Taking advantage of the long showdown, the detector was extracted from the experiment and brought to surface, to equip it with new service quarter panels, to repair modules and to ease installation of the Insertable B-Layer (IBL). IBL is a fourth layer of pixel detectors, and will be installed in May 2014 between the existing Pixel Detector and a new smaller radius beam-pipe at a radius of 3.3 cm. To cope with the high radiation and pixel occupancy due to the proximity to the interaction point, a new read-out chip and two different silicon sensor technologies (planar and 3D) have been developed. Furthermore, the physics performance will be improved through the reduction of pixel size while, targeting for a low material budget, a new mechanical support using lightweight staves and a CO2 based cooling system have been adopted. IBL construction is now completed. An overview of the IBL project as well as the ...

  11. Experience in fabrication of multichip-modules for the ATLAS pixel detector

    International Nuclear Information System (INIS)

    About 1100 ATLAS bare modules will be assembled at Fraunhofer IZM. The bumping and assembly technology of these multichip-modules is described in this paper. Pixel contacts and lead-tin interconnection bumps are deposited by electroplating. A high yield manufacturing technology requires electrical test and optical inspection on wafer level as well as on chip level. In this paper, the result of optical inspection of more than 7600 readout chips is presented. Handling mistakes are the main reason for rejection of chips before flip chip assembly. A reliable process technology, the assembly of electrical Known Good Die (KGD), optical inspection after bumping and the development of a single chip repair technology result in 98% of good modules after flip chip assembly. The reliability of the bump interconnections was even checked by thermal cycling and accelerated thermal aging

  12. Three Generations of FPGA DAQ Development for the ATLAS Pixel Detector

    CERN Document Server

    AUTHOR|(CDS)2091916; Hsu, Shih-Chieh; Hauck, Scott Alan

    The Large Hadron Collider (LHC) at the European Center for Nuclear Research (CERN) tracks a schedule of long physics runs, followed by periods of inactivity known as Long Shutdowns (LS). During these LS phases both the LHC, and the experiments around its ring, undergo maintenance and upgrades. For the LHC these upgrades improve their ability to create data for physicists; the more data the LHC can create the more opportunities there are for rare events to appear that physicists will be interested in. The experiments upgrade so they can record the data and ensure the event won’t be missed. Currently the LHC is in Run 2 having completed the first LS of three. This thesis focuses on the development of Field-Programmable Gate Array (FPGA)-based readout systems that span across three major tasks of the ATLAS Pixel data acquisition (DAQ) system. The evolution of Pixel DAQ’s Readout Driver (ROD) card is presented. Starting from improvements made to the new Insertable B-Layer (IBL) ROD design, which was part of t...

  13. The pixelated detector

    CERN Multimedia

    Sutton, C

    1990-01-01

    "Collecting data as patterns of light or subatomic particles is vitally important in all the sciences. The new generation of solid-state detectors called pixel devices could transform experimental research at all levels" (4 pages).

  14. SOI monolithic pixel detector

    Science.gov (United States)

    Miyoshi, T.; Ahmed, M. I.; Arai, Y.; Fujita, Y.; Ikemoto, Y.; Takeda, A.; Tauchi, K.

    2014-05-01

    We are developing monolithic pixel detector using fully-depleted (FD) silicon-on-insulator (SOI) pixel process technology. The SOI substrate is high resistivity silicon with p-n junctions and another layer is a low resistivity silicon for SOI-CMOS circuitry. Tungsten vias are used for the connection between two silicons. Since flip-chip bump bonding process is not used, high sensor gain in a small pixel area can be obtained. In 2010 and 2011, high-resolution integration-type SOI pixel sensors, DIPIX and INTPIX5, have been developed. The characterizations by evaluating pixel-to-pixel crosstalk, quantum efficiency (QE), dark noise, and energy resolution were done. A phase-contrast imaging was demonstrated using the INTPIX5 pixel sensor for an X-ray application. The current issues and future prospect are also discussed.

  15. Pixel detector readout chip

    CERN Multimedia

    1991-01-01

    Close-up of a pixel detector readout chip. The photograph shows an aera of 1 mm x 2 mm containing 12 separate readout channels. The entire chip contains 1000 readout channels (around 80 000 transistors) covering a sensitive area of 8 mm x 5 mm. The chip has been mounted on a silicon detector to detect high energy particles.

  16. Development of a Standardised Readout System for Active Pixel Sensors in HV/HR-CMOS Technologies for ATLAS Inner Detector Upgrades

    International Nuclear Information System (INIS)

    The LHC Phase-II Upgrade results in new challenges for tracking detectors for example in terms of cost effectiveness, resolution and radiation hardness. Active Pixel Sensors in HV/HR-CMOS technologies show promising results coping with these challenges. In order to demonstrate the feasibility of hybrid modules with active CMOS sensors and readout chips for the future ATLAS Inner Tracker, ATLAS R and D activities have started. After introducing the basic concepts and the demonstrator program, the development of an ATLAS compatible readout system will be presented as well as tuning procedures and measurements with demonstrator modules to test the readout system

  17. Performance of the Insertable B-Layer for the ATLAS Pixel Detector during Quality Assurance and a Novel Pixel Detector Readout Concept based on PCIe

    CERN Document Server

    AUTHOR|(INSPIRE)INSPIRE-00356268; Pernegger, Heinz

    2016-07-27

    During the first long shutdown of the LHC the Pixel detector has been upgraded with a new 4th innermost layer, the Insertable B-Layer (IBL). The IBL will increase the tracking performance and help with higher than nominal luminosity the LHC will produce. The IBL is made up of 14 staves and in total 20 staves have been produced for the IBL. This thesis presents the results of the final quality tests performed on these staves in an detector-like environment, in order to select the 14 best of the 20 staves for integration onto the detector. The test setup as well as the testing procedure is introduced and typical results of each testing stage are shown and discussed. The overall performance of all staves is presented in regards to: tuning performance, radioactive source measurements, and number of failing pixels. Other measurement, which did not directly impact the selection of staves, but will be important for the operation of the detector or production of a future detector, are included. Based on the experienc...

  18. Pixel detector insertion

    CERN Multimedia

    CMS

    2015-01-01

    Insertion of the Pixel Tracker, the 66-million-channel device used to pinpoint the vertex of each colliding proton pair, located at the heart of the detector. The geometry of CMS is a cylinder lying on its side (22 meters long and 15 meters high in dia

  19. ALICE Silicon Pixel Detector

    CERN Multimedia

    Manzari, V

    2013-01-01

    The Silicon Pixel Detector (SPD) forms the innermost two layers of the 6-layer barrel Inner Tracking System (ITS). The SPD plays a key role in the determination of the position of the primary collision and in the reconstruction of the secondary vertices from particle decays.

  20. Modelling semiconductor pixel detectors

    CERN Document Server

    Mathieson, K

    2001-01-01

    expected after 200 ps in most cases. The effect of reducing the charge carrier lifetime and examining the charge collection efficiency has been utilised to explore how these detectors would respond in a harsh radiation environment. It is predicted that over critical carrier lifetimes (10 ps to 0.1 ns) an improvement of 40 % over conventional detectors can be expected. This also has positive implications for fabricating detectors, in this geometry, from materials which might otherwise be considered substandard. An analysis of charge transport in CdZnTe pixel detectors has been performed. The analysis starts with simulation studies into the formation of contacts and their influence on the internal electric field of planar detectors. The models include a number of well known defect states and these are balanced to give an agreement with a typical experimental I-V curve. The charge transport study extends to the development of a method for studying the effect of charge sharing in highly pixellated detectors. The ...

  1. Gallium arsenide pixel detectors

    Energy Technology Data Exchange (ETDEWEB)

    Bates, R.; DaVia, C.; O`Shea, V.; Raine, C.; Smith, K. [Glasgow Univ. (United Kingdom). Dept. of Physics and Astronomy; Campbell, M.; Cantatore, E.; Heijne, E.M.; Middelkamp, P.; Ropotar, I.; Scharfetter, L.; Snoeys, W. [CERN, ECP Div., CH-1211 Geneva 23 (Switzerland); D`Auria, S.; Papa, C. del [Department of Physics, University of Udine and INFN Trieste, Via delle Scienze 208, I-33100 Udine (Italy); RD8 Collaboration

    1998-06-01

    GaAs detectors can be fabricated with bidimensional single-sided electrode segmentation. They have been successfully bonded using flip-chip technology to the Omega-3 silicon read-out chip. We present here the design features of the GaAs pixel detectors and results from a test performed at the CERN SpS with a 120 GeV {pi}{sup -} beam. The detection efficiency was 99.2% with a nominal threshold of 5000 e{sup -}. (orig.) 10 refs.

  2. A neural network clustering algorithm for the ATLAS silicon pixel detector

    Czech Academy of Sciences Publication Activity Database

    Aad, G.; Abbott, B.; Abdallah, J.; Böhm, Jan; Chudoba, Jiří; Havránek, Miroslav; Hejbal, Jiří; Jakoubek, Tomáš; Kepka, Oldřich; Kupčo, Alexander; Kůs, Vlastimil; Lokajíček, Miloš; Lysák, Roman; Marčišovský, Michal; Mikeštíková, Marcela; Myška, M.; Němeček, Stanislav; Šícho, Petr; Staroba, Pavel; Svatoš, Michal; Taševský, Marek; Vrba, Václav

    2014-01-01

    Roč. 9, Sep (2014), s. 1-38. ISSN 1748-0221 R&D Projects: GA MŠk(CZ) LG13009 Institutional support: RVO:68378271 Keywords : Monte Carlo * resolution * impact parameter * cluster * ATLAS * tracks * charged particle * CERN LHC Coll * longitudinal * transverse * splitting Subject RIV: BF - Elementary Particles and High Energy Physics Impact factor: 1.399, year: 2014

  3. Analog front-end cell designed in a commercial 025 mu m process for the ATLAS pixel detector at LHC

    CERN Document Server

    Blanquart, L; Comes, G; Denes, P; Einsweiler, Kevin F; Fischer, P; Mandelli, E; Meddeler, G; Peric, I; Richardson, J

    2002-01-01

    A new analog pixel front-end cell has been developed for the ATLAS detector at the future Large Hadron Collider (LHC) at the European Laboratory for Particle Physics (CERN). This analog cell has been submitted in two commercial 0.25 mu m CMOS processes (in an analog test chip format), using special layout techniques for radiation hardness purposes. It is composed of two cascaded amplifiers followed by a fast discriminator featuring a detection threshold within the range of 1000 to 10000 electrons. The first preamplifier has the principal role of providing a large bandwidth, low input impedance, and fast rise time in order to enhance the time-walk and crosstalk performance, whereas the second fully differential amplifier is aimed at delivering a sufficiently high-voltage gain for optimum comparison. A new do feedback concept renders the cell tolerant of sensor leakage current up to 300 nA and provides monitoring of this current. Two 5-bit digital-to-analog converters tolerant to single- event upset have been i...

  4. ATLAS Inner Detector developments

    CERN Document Server

    Barberis, D

    2000-01-01

    The ATLAS Inner Detector consists of three layers of silicon pixels, four double layers of silicon microstrips and a Transition Radiation Tracker (straw tubes). The good performance of the track and vertex reconstruction algorithms is a direct consequence of the small radius (4.3, 10.1 and 13.2 cm), fine pitch ($50 \\times 300~\\mu$m) and low occupancy ($<3 \\times 10^{-4}$ at design luminosity) of the pixel detectors, and of the good tracking capabilities of the SCT and the TRT. The full detector simulation is used to evaluate the performance of the detector and of the reconstruction algorithms. Results are presented on track and vertex reconstruction efficiencies and resolutions, and on the separation between $b$-jets and jets produced by light quarks.

  5. Alpine Pixel Detector Layout

    CERN Document Server

    Delebecque, P; The ATLAS collaboration; Geffroy, N; Massol, N; Rambure, T; Todorov, T

    2013-01-01

    A description of an optimized layout of pixel sensors based on a stave that combines both barrel and endcap module orientations. The mechanical stiffness of the structure is provided by carbon fiber shells spaced by carbon foam. The cooling of the modules is provided by two-phase $CO_{2}$ flowing in a thin titanium pipe glued inside the carbon fiber foam. The electrical services of all modules are provided by a single stave flex. This layout eliminates the need for separate barrel and endcap detector structures, and therefore the barrel services material in front of the endcap. The transition from barrel to endcap module orientation is optimized separately for each layer in order to minimize the active pixel area and the traversed material. The sparse module spacing in the endcap part of the stave allows for multiple fixation points, and for a stiff overall structure composed only of staves interconnected by stiff disks.

  6. Multi-chip module development for the ATLAS pixel detector. Analysis of the front-end chip electronics in radiation hard 0.25-μm technology as well as development and realization of a serial power concept

    International Nuclear Information System (INIS)

    The innermost layer of the ATLAS tracking system is a silicon pixel detector. The use of radiation tolerant components is mandatory due to the harsh radiation environment. The smallest independent component of the pixel detector is a hybride pixel module consisting of a large oxygen enriched silicon sensor and 16 specifically developed ASICs. To achieve the necessary radiation tolerance the ASICs are produced in a 0.25 μm technology in combination with special design techniques. The measurements of the readout electronics during all stages of production of a full module are presented and the performance of the modules is compared with the strict requirements of the ATLAS pixel detector. Furthermore a new powering scheme for pixel detectors is presented, aiming at reducing the total power consumption, the material for the electrical services and the amount of power cables. The advantages and disadvantages of this concept are discussed on the example of the ATLAS pixel detector with pixel modules modified accounting to the new powering scheme. The performance of six of those modules operating at the same time in a small system test is compared to that of normal ATLAS pixel modules. (orig.)

  7. Electrical characteristics of silicon pixel detectors

    Energy Technology Data Exchange (ETDEWEB)

    Gorelov, I.; Gorfine, G.; Hoeferkamp, M.; Mata-Bruni, V.; Santistevan, G.; Seidel, S.C. E-mail: seidel@dot.phys.unm.edu; Ciocio, A.; Einsweiler, K.; Emes, J.; Gilchriese, M.; Joshi, A.; Kleinfelder, S.; Marchesini, R.; McCormack, F.; Milgrome, O.; Palaio, N.; Pengg, F.; Richardson, J.; Zizka, G.; Ackers, M.; Comes, G.; Fischer, P.; Keil, M.; Martinez, G.; Peric, I.; Runolfsson, O.; Stockmanns, T.; Treis, J.; Wermes, N.; Goessling, C.; Huegging, F.; Klaiber-Lodewigs, J.; Krasel, O.; Wuestenfeld, J.; Wunstorf, R.; Barberis, D.; Beccherle, R.; Caso, C.; Cervetto, M.; Darbo, G.; Gagliardi, G.; Gemme, C.; Morettini, P.; Netchaeva, P.; Osculati, B.; Rossi, L.; Charles, E.; Fasching, D.; Blanquart, L.; Breugnon, P.; Calvet, D.; Clemens, J.-C.; Delpierre, P.; Hallewell, G.; Laugier, D.; Mouthuy, T.; Rozanov, A.; Valin, I.; Andreazza, A.; Caccia, M.; Citterio, M.; Lari, T.; Meroni, C.; Ragusa, F.; Troncon, C.; Vegni, G.; Lutz, G.; Richter, R.H.; Rohe, T.; Boyd, G.R.; Skubic, P.L.; Sicho, P.; Tomasek, L.; Vrba, V.; Holder, M.; Ziolkowski, M.; Cauz, D.; Cobal-Grassmann, M.; D' Auria, S.; De Lotto, B.; Del Papa, C.; Grassmann, H.; Santi, L.; Becks, K.H.; Lenzen, G.; Linder, C

    2002-08-21

    Prototype sensors for the ATLAS silicon pixel detector have been electrically characterized. The current and voltage characteristics, charge-collection efficiencies, and resolutions have been examined. Devices were fabricated on oxygenated and standard detector-grade silicon wafers. Results from prototypes which examine p-stop and standard and moderated p-spray isolation are presented for a variety of geometrical options. Some of the comparisons relate unirradiated sensors with those that have received fluences relevant to LHC operation.

  8. Submission of the First Full Scale Prototype Chip for Upgraded ATLAS Pixel Detector at LHC, FE-I4A

    CERN Document Server

    Barbero, M; The ATLAS collaboration; Beccherle, R; Darbo, G; Dube, S; Elledge, D; Fleury, J; Fougeron, D; Garcia-Sciveres, M; Gensolen, F; Gnani, D; Gromov, V; Jensen, F; Hemperek, T; Karagounis, M; Kluit, R; Kruth, A; Mekkaoui, A; Menouni, M; Schipper, JD; Wermes, N; Zivkovic, V

    2010-01-01

    A new ATLAS pixel chip FE-I4 is being developed for use in upgraded LHC luminosity environments, including the near-term Insertable B-Layer (IBL) upgrade. FE-I4 is designed in a 130nm CMOS technology, presenting advantages in terms of radiation tolerance and digital logic density compared to the 250nm CMOS technology used for the current ATLAS pixel IC, FE-I3. The FE-I4 architecture is based on an array of 80x336 pixels, each 50x250um^2, consisting of analog and digital sections. In the summer 2010, a first full scale prototype FE-I4A was submitted for an engineering run. This IC features the full scale pixel array as well as the complex periphery of the future full-size FE-I4. The FE-I4A contains also various extra test features which should prove very useful for the chip characterization, but deviate from the needs for standard operation of the final FE-I4 for IBL. In this paper, focus will be brought to the various features implemented in the FE-I4A submission, while also underlining the main differences b...

  9. Front-End electronics and integration of ATLAS pixel modules

    Science.gov (United States)

    Hügging, F.; ATLAS Pixel Collaboration

    2005-09-01

    For the ATLAS Pixel Detector fast readout electronics has been successfully developed and tested. Main attention was given to the ability to detect small charges in the order of 5,000 e - within 25 ns in the harsh radiation environment of LHC together with the challenge to cope with the huge amount of data generated by the 80 million channels of the Pixel detector. For the integration of the 50 μm pitch hybrid pixel detector, reliable bump bonding techniques using either lead-tin or indium bumps has been developed and has been successfully tested for large-scale production.

  10. Front-End electronics and integration of ATLAS pixel modules

    CERN Document Server

    Hügging, F G

    2005-01-01

    For the ATLAS Pixel Detector fast readout electronics has been successfully developed and tested. Main attention was given to the ability to detect small charges in the order of 5,000 electrons within 25 ns in the harsh radiation environment of LHC together with the challenge to cope with the huge amount of data generated by the 80 millions channels of the Pixel detector. For the integration of the 50 micron pitch hybrid pixel detector reliable bump bonding techniques using either lead-tin or indium bumps has been developed and has been successfully tested for large scale production.

  11. Commissioning of the read-out driver (ROD) card for the ATLAS IBL detector and upgrade studies for the pixel Layers 1 and 2

    Energy Technology Data Exchange (ETDEWEB)

    Balbi, G.; Bindi, M. [Istituto Nazionale di Fisica Nucleare (INFN), Bologna (Italy); Falchieri, D. [Istituto Nazionale di Fisica Nucleare (INFN), Bologna (Italy); Department of Physics and Astronomy, University of Bologna (Italy); Gabrielli, A., E-mail: alessandro.gabrielli@bo.infn.it [Istituto Nazionale di Fisica Nucleare (INFN), Bologna (Italy); Department of Physics and Astronomy, University of Bologna (Italy); Travaglini, R. [Istituto Nazionale di Fisica Nucleare (INFN), Bologna (Italy); Chen, S.-P.; Hsu, S.-C.; Hauck, S. [University of Washington, Seattle (United States); Kugel, A. [ZITI – Institute for Computer Engineering, University of Heidelberg at Mannheim (Germany)

    2014-11-21

    The higher luminosity that is expected for the LHC after future upgrades will require better performance by the data acquisition system, especially in terms of throughput. In particular, during the first shutdown of the LHC collider in 2013/14, the ATLAS Pixel Detector will be equipped with a fourth layer – the Insertable B-Layer or IBL – located at a radius smaller than the present three layers. Consequently, a new front end ASIC (FE-I4) was designed as well as a new off-detector chain. The latter is composed mainly of two 9U-VME cards called the Back-Of-Crate (BOC) and Read-Out Driver (ROD). The ROD is used for data and event formatting and for configuration and control of the overall read-out electronics. After some prototyping samples were completed, a pre-production batch of 5 ROD cards was delivered with the final layout. Actual production of another 15 ROD cards is ongoing in Fall 2013, and commissioning is scheduled in 2014. Altogether 14 cards are necessary for the 14 staves of the IBL detector, one additional card is required by the Diamond Beam Monitor (DBM), and additional spare ROD cards will be produced for a total of 20 boards. This paper describes some integration tests that were performed and our plan to test the production of the ROD cards. Slices of the IBL read-out chain have been instrumented, and ROD performance is verified on a test bench mimicking a small-sized final setup. This contribution will report also one view on the possible adoption of the IBL ROD for ATLAS Pixel Detector Layer 2 (firstly) and, possibly, in the future, for Layer 1.

  12. Commissioning of the read-out driver (ROD) card for the ATLAS IBL detector and upgrade studies for the pixel Layers 1 and 2

    International Nuclear Information System (INIS)

    The higher luminosity that is expected for the LHC after future upgrades will require better performance by the data acquisition system, especially in terms of throughput. In particular, during the first shutdown of the LHC collider in 2013/14, the ATLAS Pixel Detector will be equipped with a fourth layer – the Insertable B-Layer or IBL – located at a radius smaller than the present three layers. Consequently, a new front end ASIC (FE-I4) was designed as well as a new off-detector chain. The latter is composed mainly of two 9U-VME cards called the Back-Of-Crate (BOC) and Read-Out Driver (ROD). The ROD is used for data and event formatting and for configuration and control of the overall read-out electronics. After some prototyping samples were completed, a pre-production batch of 5 ROD cards was delivered with the final layout. Actual production of another 15 ROD cards is ongoing in Fall 2013, and commissioning is scheduled in 2014. Altogether 14 cards are necessary for the 14 staves of the IBL detector, one additional card is required by the Diamond Beam Monitor (DBM), and additional spare ROD cards will be produced for a total of 20 boards. This paper describes some integration tests that were performed and our plan to test the production of the ROD cards. Slices of the IBL read-out chain have been instrumented, and ROD performance is verified on a test bench mimicking a small-sized final setup. This contribution will report also one view on the possible adoption of the IBL ROD for ATLAS Pixel Detector Layer 2 (firstly) and, possibly, in the future, for Layer 1

  13. The ALICE Pixel Detector

    International Nuclear Information System (INIS)

    The present document is a brief summary of the performed activities during the 2001 Summer Student Programme at CERN under the Scientific Summer at Foreign Laboratories Program organized by the Particles and Fields Division of the Mexican Physical Society (Sociedad Mexicana de Fisica). In this case, the activities were related with the ALICE Pixel Group of the EP-AIT Division, under the supervision of Jeroen van Hunen, research fellow in this group. First, I give an introduction and overview to the ALICE experiment; followed by a description of wafer probing. A brief summary of the test beam that we had from July 13th to July 25th is given as well

  14. Design and implementation of an expert system for the detector control systems of the ATLAS pixel detector; Entwurf und Implementation eines Expertensystems fuer das Detektorkontrollsystem des ATLAS-Pixeldetektors

    Energy Technology Data Exchange (ETDEWEB)

    Henss, Tobias

    2008-12-15

    In the framework of this thesis an expert system ''Pixel-Advisor'' for the control system of the pixel detector was designed and implemented. This supports the operational personnel in the diagnosis and removal of possible problems, which are in connection with the detector control system and unburdens the few available DCS experts.

  15. Pixel electronics for the ATLAS experiment

    CERN Document Server

    Fischer, P

    2001-01-01

    The ATLAS experiment at LHC will use 3 barrel layers and 2*5 disks of silicon pixel detectors as the innermost elements of the semiconductor tracker. The basic building blocks are pixel modules with an active area of 16.4 mm*60.8 mm which include an n/sup +/ on n-type silicon sensor and 16 VLSI front-end (FE) chips. Every FE chip contains a low power, high speed charge sensitive preamplifier, a fast discriminator, and a readout system which operates at the 40 MHz rate of LHC. The addresses of hit pixels (as well as a low resolution pulse height information) are stored on the FE chips until arrival of a level 1 trigger signal. Hits are then transferred to a module controller chip (MCC) which collects the data of all 16 FE chips, builds complete events and sends the data through two optical links to the data acquisition system. The MCC receives clock and data through an additional optical link and provides timing and configuration information for the FE chips. Two additional chips are used to amplify and decode...

  16. The ALICE pixel detector

    CERN Document Server

    Mercado Perez, J

    2002-01-01

    The present document is a brief summary of the performed activities during the 2001 Summer Student Programme at CERN under the Scientific Summer at Foreign Laboratories Program organized by the Particles and Fields Division of the Mexican Physical Society (Sociedad Mexicana de Fisica). In this case, the activities were related with the ALICE Pixel Group of the EP-AIT Division, under the supervision of Jeroen van Hunen, research fellow in this group. First, I give an introduction and overview to the ALICE experiment; followed by a description of wafer probing. A brief summary of the test beam that we had from July 13th to July 25th is given as well. (3 refs).

  17. The ATLAS pixel stave emulator for serial powering

    International Nuclear Information System (INIS)

    A serial powering scheme is being developed for the upgrade of the ATLAS pixel detector in view of sLHC. It offers in fact significant advantages over the presently used parallel powering scheme, namely reduced material budget in active area and power losses on cables, smaller number of power supplies, and no need for external, distant regulation of voltages. The development of this powering scheme requires not only the design of custom-developed voltage regulators, the basic elements of serial powering, but also the early study of system aspects connected to it, for instance the safety of the powering chain and AC-coupled data transmission. To this aim a test system emulating an ATLAS pixel stave is being developed. It will provide a realistic environment to test both concepts and sub-components. Due to its flexibility, it will offer the possibility to study not only serial powering concepts, but more generally system aspects related to the ATLAS pixel detector. In particular alternative powering schemes, data coding schemes, physical layer data transmission, and Detector Control System concepts will also be evaluated with this test system. The description and development of the ATLAS pixel stave emulator are presented and first results are discussed

  18. Robustness of the ATLAS pixel clustering neural network algorithm

    CERN Document Server

    Sidebo, Per Edvin; The ATLAS collaboration

    2016-01-01

    Proton-proton collisions at the energy frontier puts strong constraints on track reconstruction algorithms. In the ATLAS track reconstruction algorithm, an artificial neural network is utilised to identify and split clusters of neighbouring read-out elements in the ATLAS pixel detector created by multiple charged particles. The robustness of the neural network algorithm is presented, probing its sensitivity to uncertainties in the detector conditions. The robustness is studied by evaluating the stability of the algorithm's performance under a range of variations in the inputs to the neural networks. Within reasonable variation magnitudes, the neural networks prove to be robust to most variation types.

  19. R&D for the local support structure and cooling channel for the ATLAS PIXEL Detector Insertable B-Layer (IBL)

    CERN Document Server

    Coelli, S; The ATLAS collaboration

    2010-01-01

    ABSTRACT: The scope of the present R&D is to develop an innovative support, with an integrated cooling and based on carbon composites, for the electronic sensors of the Silicon Pixel Tracker, to be installed into the ATLAS Experiment on the Large Hadron Collider at CERN. The inner layer of the detector is installed immediately outside the Beryllium beam pipe at a distance of 50 mm from the Interaction Point, where the high energy protons collide: the intense radiation field induce a radiation damage on the sensors so that a cooling system is necessary to remove the electrical power dissipated as heat, maintaining the sensor temperature sufficiently low. The task of the support system is to hold the detector modules in positions with high accuracy, minimizing the deformation induced by the cooling; this must be done with the lower possible mass because there are tight requirements in terms of material budget. An evaporative boiling system to remove the power dissipated by the sensors is incorporated in the...

  20. ATLAS Fact Sheet : To raise awareness of the ATLAS detector and collaboration on the LHC

    CERN Multimedia

    ATLAS Outreach

    2010-01-01

    Facts on the Detector, Calorimeters, Muon System, Inner Detector, Pixel Detector, Semiconductor Tracker, Transition Radiation Tracker,, Surface hall, Cavern, Detector, Magnet system, Solenoid, Toroid, Event rates, Physics processes, Supersymmetric particles, Comparing LHC with Cosmic rays, Heavy ion collisions, Trigger and Data Acquisition TDAQ, Computing, the LHC and the ATLAS collaboration. This fact sheet also contains images of ATLAS and the collaboration as well as a short list of videos on ATLAS available for viewing.

  1. Robustness of the ATLAS pixel clustering neural network algorithm

    CERN Document Server

    Sidebo, Per Edvin; The ATLAS collaboration

    2016-01-01

    Proton-proton collisions at the energy frontier puts strong constraints on track reconstruction algorithms. The algorithms depend heavily on accurate estimation of the position of particles as they traverse the inner detector elements. An artificial neural network algorithm is utilised to identify and split clusters of neighbouring read-out elements in the ATLAS pixel detector created by multiple charged particles. The method recovers otherwise lost tracks in dense environments where particles are separated by distances comparable to the size of the detector read-out elements. Such environments are highly relevant for LHC run 2, e.g. in searches for heavy resonances. Within the scope of run 2 track reconstruction performance and upgrades, the robustness of the neural network algorithm will be presented. The robustness has been studied by evaluating the stability of the algorithm’s performance under a range of variations in the pixel detector conditions.

  2. The Read-Out Driver (ROD) card for the ATLAS experiment: commissioning for the IBL detector and upgrade studies for the Pixel Layers 1 and 2

    CERN Document Server

    Travaglini, R; The ATLAS collaboration; Bindi, M; Falchieri, D; Gabrielli, A; Lama, L; Chen, S P; Hsu, S C; Hauck, S; Kugel, A; Flick, T; Wensing, M

    2013-01-01

    The upgrade of the ATLAS experiment at LHC foresees the insertion of an innermost silicon layer, called Insertable B-layer (IBL). IBL read-out system will be equipped with new electronics. The Readout-Driver card (ROD) is a VME board devoted to data processing, configuration and control. A pre-production batch has been delivered in order to perform tests with instrumented slices of the overall acquisition chain, aiming to finalize strategies for system commissioning. In this contribution both setups and results will be described, as well as preliminary studies on changes in order to adopt the ROD for the ATLAS Pixel Layers 1 and 2.

  3. Diamond and silicon pixel detectors in high radiation environments

    Energy Technology Data Exchange (ETDEWEB)

    Tsung, Jieh-Wen

    2012-10-15

    Diamond pixel detector is a promising candidate for tracking of collider experiments because of the good radiation tolerance of diamond. The diamond pixel detector must withstand the radiation damage from 10{sup 16} particles per cm{sup 2}, which is the expected total fluence in High Luminosity Large Hadron Collider. The performance of diamond and silicon pixel detectors are evaluated in this research in terms of the signal-to-noise ratio (SNR). Single-crystal diamond pixel detectors with the most recent readout chip ATLAS FE-I4 are produced and characterized. Based on the results of the measurement, the SNR of diamond pixel detector is evaluated as a function of radiation fluence, and compared to that of planar-silicon ones. The deterioration of signal due to radiation damage is formulated using the mean free path of charge carriers in the sensor. The noise from the pixel readout circuit is simulated and calculated with leakage current and input capacitance to the amplifier as important parameters. The measured SNR shows good agreement with the calculated and simulated results, proving that the performance of diamond pixel detectors can exceed the silicon ones if the particle fluence is more than 10{sup 15} particles per cm{sup 2}.

  4. The atlas detector

    International Nuclear Information System (INIS)

    The ATLAS detector, one of the two multi-purpose detectors at the Large Hadron Collider at CERN, is currently being built in order to meet the first proton-proton collisions in time. A description of the detector components will be given, corresponding to the most up to date design and status of construction, completed with test beam results and performances of the first serial modules. (author)

  5. High-voltage pixel sensors for ATLAS upgrade

    Science.gov (United States)

    Perić, I.; Kreidl, C.; Fischer, P.; Bompard, F.; Breugnon, P.; Clemens, J.-C.; Fougeron, D.; Liu, J.; Pangaud, P.; Rozanov, A.; Barbero, M.; Feigl, S.; Capeans, M.; Ferrere, D.; Pernegger, H.; Ristic, B.; Muenstermann, D.; Gonzalez Sevilla, S.; La Rosa, A.; Miucci, A.; Nessi, M.; Iacobucci, G.; Backhaus, M.; Hügging, Fabian; Krüger, H.; Hemperek, T.; Obermann, T.; Wermes, N.; Garcia-Sciveres, M.; Quadt, A.; Weingarten, J.; George, M.; Grosse-Knetter, J.; Rieger, J.; Bates, R.; Blue, A.; Buttar, C.; Hynds, D.

    2014-11-01

    The high-voltage (HV-) CMOS pixel sensors offer several good properties: a fast charge collection by drift, the possibility to implement relatively complex CMOS in-pixel electronics and the compatibility with commercial processes. The sensor element is a deep n-well diode in a p-type substrate. The n-well contains CMOS pixel electronics. The main charge collection mechanism is drift in a shallow, high field region, which leads to a fast charge collection and a high radiation tolerance. We are currently evaluating the use of the high-voltage detectors implemented in 180 nm HV-CMOS technology for the high-luminosity ATLAS upgrade. Our approach is replacing the existing pixel and strip sensors with the CMOS sensors while keeping the presently used readout ASICs. By intelligence we mean the ability of the sensor to recognize a particle hit and generate the address information. In this way we could benefit from the advantages of the HV sensor technology such as lower cost, lower mass, lower operating voltage, smaller pitch, smaller clusters at high incidence angles. Additionally we expect to achieve a radiation hardness necessary for ATLAS upgrade. In order to test the concept, we have designed two HV-CMOS prototypes that can be readout in two ways: using pixel and strip readout chips. In the case of the pixel readout, the connection between HV-CMOS sensor and the readout ASIC can be established capacitively.

  6. Development of a Micro Pixel Chamber for the ATLAS Upgrade

    CERN Document Server

    Ochi, Atsuhiko; Komai, Hidetoshi; Edo, Yuki; Yamaguchi, Takahiro

    2012-01-01

    The Micro Pixel Chamber (μ-PIC) is being developed a sacandidate for the muon system of the ATLAS detector for upgrading in LHC experiments. The μ-PIC is a micro-pattern gaseous detector that doesn’t have floating structure such as wires, mesh, or foil. This detector can be made by printed-circuit-board (PCB) technology, which is commercially available and suited for mass production. Operation tests have been performed under high flux neutrons under similar conditions to the ATLAS cavern. Spark rates are measured using several gas mixtures under 7 MeV neutron irradiation, and good properties were observed using neon, ethane, and CF4 mixture of gases.Using resistive materials as electrodes, we are also developing a new μ-PIC, which is not expected to damage the electrodes in the case of discharge sparks.

  7. Pixelated CdZnTe drift detectors

    DEFF Research Database (Denmark)

    Kuvvetli, Irfan; Budtz-Jørgensen, Carl

    2005-01-01

    report on the performance of 3 mm thick prototype CZT drift pixel detectors fabricated using material from eV-products. We discuss issues associated with detector module performance. Characterization results obtained from several prototype drift pixel detectors are presented. Results of position...

  8. The ALICE Silicon Pixel Detector System (SPD)

    CERN Document Server

    Kluge, A; Antinori, Federico; Burns, M; Cali, I A; Campbell, M; Caselle, M; Ceresa, S; Dima, R; Elias, D; Fabris, D; Krivda, Marian; Librizzi, F; Manzari, Vito; Morel, M; Moretto, Sandra; Osmic, F; Pappalardo, G S; Pepato, Adriano; Pulvirenti, A; Riedler, P; Riggi, F; Santoro, R; Stefanini, G; Torcato De Matos, C; Turrisi, R; Tydesjo, H; Viesti, G; PH-EP

    2007-01-01

    The ALICE silicon pixel detector (SPD) comprises the two innermost layers of the ALICE inner tracker system. The SPD includes 120 detector modules (half-staves) each consisting of 10 ALICE pixel chips bump bonded to two silicon sensors and one multi-chip read-out module. Each pixel chip contains 8192 active cells, so that the total number of pixel cells in the SPD is ≈ 107. The on-detector read-out is based on a multi-chip-module containing 4 ASICs and an optical transceiver module. The constraints on material budget and detector module dimensions are very demanding.

  9. Recent ATLAS Detector Improvements

    CERN Document Server

    de Nooij, L; The ATLAS collaboration

    2011-01-01

    During the recent LHC shutdown period, ATLAS performed vital maintenance and improvements on the various sub-detectors. For the calorimeters, repairs were carried out on front-end electronics and power supplies to recover detector coverage that had been lost since the last maintenance period. The ALFA luminosity detector was installed along the beam line and is currently being commissioned. Smaller scale repairs were needed on the Inner Detector. Maintenance on the muon system included repairs on the readout as well as updates and leak checks in the gas systems. Six TGC chambers were also replaced. This poster summarizes the repairs and their expected improvement for physics performance and reliability of ATLAS for the upcoming LHC run.

  10. ATLAS Forward Detectors and Physics

    CERN Document Server

    Soni, N

    2010-01-01

    In this communication I describe the ATLAS forward physics program and the detectors, LUCID, ZDC and ALFA that have been designed to meet this experimental challenge. In addition to their primary role in the determination of ATLAS luminosity these detectors - in conjunction with the main ATLAS detector - will be used to study soft QCD and diffractive physics in the initial low luminosity phase of ATLAS running. Finally, I will briefly describe the ATLAS Forward Proton (AFP) project that currently represents the future of the ATLAS forward physics program.

  11. Multi-chip module development for the ATLAS pixel detector. Analysis of the front-end chip electronics in radiation hard 0.25-{mu}m technology as well as development and realization of a serial power concept; Multi-Chip-Modul-Entwicklung fuer den ATLAS-Pixeldetektor. Analyse der Front-End-Chip-Elektronik in strahlenharter0,25-{mu}m-Technologie sowie Entwicklung und Realisierung eines Serial-Powering-Konzeptes

    Energy Technology Data Exchange (ETDEWEB)

    Stockmanns, T.

    2004-08-01

    The innermost layer of the ATLAS tracking system is a silicon pixel detector. The use of radiation tolerant components is mandatory due to the harsh radiation environment. The smallest independent component of the pixel detector is a hybride pixel module consisting of a large oxygen enriched silicon sensor and 16 specifically developed ASICs. To achieve the necessary radiation tolerance the ASICs are produced in a 0.25 {mu}m technology in combination with special design techniques. The measurements of the readout electronics during all stages of production of a full module are presented and the performance of the modules is compared with the strict requirements of the ATLAS pixel detector. Furthermore a new powering scheme for pixel detectors is presented, aiming at reducing the total power consumption, the material for the electrical services and the amount of power cables. The advantages and disadvantages of this concept are discussed on the example of the ATLAS pixel detector with pixel modules modified accounting to the new powering scheme. The performance of six of those modules operating at the same time in a small system test is compared to that of normal ATLAS pixel modules. (orig.)

  12. CVD diamond pixel detectors for LHC experiments

    International Nuclear Information System (INIS)

    This paper reviews the development of CVD diamond pixel detectors. The preparation of the diamond pixel sensors for bump-bonding to the pixel readout electronics for the LHC and the results from beam tests carried out at CERN are described

  13. CVD diamond pixel detectors for LHC experiments

    CERN Document Server

    Wedenig, R; Bauer, C; Berdermann, E; Bergonzo, P; Bogani, F; Borchi, E; Brambilla, A; Bruzzi, Mara; Colledani, C; Conway, J; Dabrowski, W; Delpierre, P A; Deneuville, A; Dulinski, W; van Eijk, B; Fallou, A; Fizzotti, F; Foulon, F; Friedl, M; Gan, K K; Gheeraert, E; Grigoriev, E; Hallewell, G D; Hall-Wilton, R; Han, S; Hartjes, F G; Hrubec, Josef; Husson, D; Kagan, H; Kania, D R; Kaplon, J; Karl, C; Kass, R; Knöpfle, K T; Krammer, Manfred; Lo Giudice, A; Lü, R; Manfredi, P F; Manfredotti, C; Marshall, R D; Meier, D; Mishina, M; Oh, A; Pan, L S; Palmieri, V G; Pernicka, Manfred; Peitz, A; Pirollo, S; Polesello, P; Pretzl, Klaus P; Procario, M; Re, V; Riester, J L; Roe, S; Roff, D G; Rudge, A; Runólfsson, O; Russ, J; Schnetzer, S R; Sciortino, S; Speziali, V; Stelzer, H; Stone, R; Suter, B; Tapper, R J; Tesarek, R J; Trawick, M L; Trischuk, W; Vittone, E; Wagner, A; Walsh, A M; Weilhammer, Peter; White, C; Zeuner, W; Ziock, H J; Zöller, M

    1999-01-01

    This paper reviews the development of CVD diamond pixel detectors. The preparation of the diamond pixel sensors for bump-bonding to the pixel readout electronics for the LHC and the results from beam tests carried out at CERN are described. (9 refs).

  14. CVD diamond pixel detectors for LHC experiments

    Energy Technology Data Exchange (ETDEWEB)

    Wedenig, R.; Adam, W.; Bauer, C.; Berdermann, E.; Bergonzo, P.; Bogani, F.; Borchi, E.; Brambilla, A.; Bruzzi, M.; Colledani, C.; Conway, J.; Dabrowski, W.; Delpierre, P.; Deneuville, A.; Dulinski, W.; Eijk, B. van; Fallou, A.; Fizzotti, F.; Foulon, F.; Friedl, M.; Gan, K.K.; Gheeraert, E.; Grigoriev, E.; Hallewell, G.; Hall-Wilton, R.; Han, S.; Hartjes, F.; Hrubec, J.; Husson, D.; Kagan, H.; Kania, D.; Kaplon, J.; Karl, C.; Kass, R.; Knoepfle, K.T.; Krammer, M.; Logiudice, A.; Lu, R.; Manfredi, P.F.; Manfredotti, C.; Marshall, R.D.; Meier, D.; Mishina, M.; Oh, A.; Pan, L.S.; Palmieri, V.G.; Pernicka, M.; Peitz, A.; Pirollo, S.; Polesello, P.; Pretzl, K.; Procario, M.; Re, V.; Riester, J.L.; Roe, S.; Roff, D.; Rudge, A.; Runolfsson, O.; Russ, J.; Schnetzer, S.; Sciortino, S.; Speziali, V.; Stelzer, H.; Stone, R.; Suter, B.; Tapper, R.J.; Tesarek, R.; Trawick, M.; Trischuk, W.; Vittone, E.; Wagner, A.; Walsh, A.M.; Weilhammer, P.; White, C.; Zeuner, W.; Ziock, H.; Zoeller, M.; Blanquart, L.; Breugnion, P.; Charles, E.; Ciocio, A.; Clemens, J.C.; Dao, K.; Einsweiler, K.; Fasching, D.; Fischer, P.; Joshi, A.; Keil, M.; Klasen, V.; Kleinfelder, S.; Laugier, D.; Meuser, S.; Milgrome, O.; Mouthuy, T.; Richardson, J.; Sinervo, P.; Treis, J.; Wermes, N

    1999-08-01

    This paper reviews the development of CVD diamond pixel detectors. The preparation of the diamond pixel sensors for bump-bonding to the pixel readout electronics for the LHC and the results from beam tests carried out at CERN are described.

  15. The alignment of the ATLAS Inner Detector in Run 2

    CERN Document Server

    Ripellino, Giulia; The ATLAS collaboration

    2016-01-01

    The ATLAS reconstruction of charged particle trajectories relies on the Inner Detector tracking system. The accuracy of the reconstruction is limited by the finite resolution of the detector elements and the imperfect knowledge about their positions. A precise alignment of the detector is therefore essential. Here, the strategy and the status of the Inner Detector alignment in ATLAS during the LHC Run 2 are presented and the alignment challenges related to the distortion of the new innermost Pixel layer, the IBL, are discussed.

  16. Cooling Tests for the Silion Pixel Detectors

    CERN Document Server

    Pepato, Adriano; CERN. Geneva; Giarin, M; Antinori, Federico; Carrer, N; Morando, M; Soramel, F; Segato, G F; Turrisi, R; Scarlassara, F

    2000-01-01

    Abstract Cooling tests have been performed on dummy prototypes of the Silicon Pixel Detector ladders of the Inner Tracking System of ALICE, in order to assess the merits of the proposed cooling schemes. The tests provide insight into the problems of cooling of the pixel detectors and also yield experimental parameters necessary for a numerical simulation.

  17. Development of SOI pixel detector in Cracow

    OpenAIRE

    Bugiel, Szymon; Dasgupta, Roma; Glab, Sebastian; Idzik, Marek; Moron, Jakub; Kapusta, Piotr Julian; Kucewicz, Wojciech; Turala, Michal

    2015-01-01

    This paper presents the design of a new monolithic Silicon-On-Insulator pixel sensor in $200~nm$ SOI CMOS technology. The main application of the proposed pixel detector is the spectroscopy, but it can also be used for the minimum ionizing particle (MIP) tracking in particle physics experiments. For this reason few different versions of pixel cells are developed: a source-follower based pixel for tracking, a low noise pixel with preamplifier for spectroscopy, and a self-triggering pixel for t...

  18. TFA pixel sensor technology for vertex detectors

    OpenAIRE

    Jarron, P.; Moraes, D.; Despeisse, M.; Dissertori, G.; Dunand, S.; Kaplon. J.; Miazza, C.; Shah, Arvind; Viertel, G M.; Wyrsch, Nicolas

    2008-01-01

    Pixel microvertex detectors at the SLHC and a future linear collider face very challenging issues: extreme radiation hardness, cooling design, interconnections density and fabrication cost. As an alternative approach we present a novel pixel detector based on the deposition of a Hydrogenated Amorphous Silicon (a-Si:H) film on top of a readout ASIC. The Thin-Film on ASIC (TFA) technology is inspired by an emerging microelectronic technology envisaged for visible light Active Pixel Sensor (APS)...

  19. ATLAS Pixel-Optoboard Production and Simulation Studies

    CERN Document Server

    Nderitu, Simon

    At CERN, a Large collider will collide protons at high energies. There are four experiments being built to study the particle properties from the collision. The ATLAS experiment is the largest. It has many sub detectors among which is the Pixel detector which is the innermost part. The Pixel detector has eighty million channels that have to be read out. An optical link is utilized for the read out. It has optical to electronic interfaces both on the detector and off the detector at the counting room. The component on the detector in called the opto-board. This work discusses the production testing of the opto-boards to be installed on the detector. A total of 300 opto-boards including spares have been produced. The production was done in three laboratories among which is the laboratory at the University of Wuppertal which had the responsibility of Post production testing of all the one third of the total opto-boards. The results are discussed in this work. The analysis of the results from the total productio...

  20. Simulations of planar pixel sensors for the ATLAS high luminosity upgrade

    OpenAIRE

    Calderini, G.; Benoit, M; Dinu, N.; Lounis, A.; Marchiori, G.

    2011-01-01

    A physics-based device simulation was used to study the charge carrier distribution and the electric field configuration inside simplified two-dimensional models for pixel layouts based on the ATLAS pixel sensor. In order to study the behavior of such detectors under different levels of irradiation, a three-level defect model was implemented into the simulation. Using these models, the number of guard rings, the dead edge width and the detector thickness were modified to investigate their inf...

  1. Development of SOI pixel detector in Cracow

    CERN Document Server

    Bugiel, Szymon; Glab, Sebastian; Idzik, Marek; Moron, Jakub; Kapusta, Piotr Julian; Kucewicz, Wojciech; Turala, Michal

    2015-01-01

    This paper presents the design of a new monolithic Silicon-On-Insulator pixel sensor in $200~nm$ SOI CMOS technology. The main application of the proposed pixel detector is the spectroscopy, but it can also be used for the minimum ionizing particle (MIP) tracking in particle physics experiments. For this reason few different versions of pixel cells are developed: a source-follower based pixel for tracking, a low noise pixel with preamplifier for spectroscopy, and a self-triggering pixel for time and amplitude measurements. In addition the design of a Successive Approximation Register Analog-to-Digital Converter (SAR ADC) is also presented. A 10-bit SAR ADC is developed for spectroscopic measurements and a lower resolution 6-bit SAR ADC is integrated in the pixel matrix as a column ADC, for tracking applications.

  2. Parallel encoders for pixel detectors

    International Nuclear Information System (INIS)

    A new method of fast encoding and determining the multiplicity and coordinates of fired pixels is described. A specific example construction of parallel encodes and MCC for n=49 and t=2 is given. 16 refs.; 6 figs.; 2 tabs

  3. ATLAS Detector Interface Group

    CERN Multimedia

    Mapelli, L

    Originally organised as a sub-system in the DAQ/EF-1 Prototype Project, the Detector Interface Group (DIG) was an information exchange channel between the Detector systems and the Data Acquisition to provide critical detector information for prototype design and detector integration. After the reorganisation of the Trigger/DAQ Project and of Technical Coordination, the necessity to provide an adequate context for integration of detectors with the Trigger and DAQ lead to organisation of the DIG as one of the activities of Technical Coordination. Such an organisation emphasises the ATLAS wide coordination of the Trigger and DAQ exploitation aspects, which go beyond the domain of the Trigger/DAQ project itself. As part of Technical Coordination, the DIG provides the natural environment for the common work of Trigger/DAQ and detector experts. A DIG forum for a wide discussion of all the detector and Trigger/DAQ integration issues. A more restricted DIG group for the practical organisation and implementation o...

  4. Hybrid pixel detector development for medical radiography

    International Nuclear Information System (INIS)

    A 7-year project has been initiated to develop hybrid pixel detectors for medical radiography. Crystalline semiconductor will be bonded to a pixellated readout chip where individual integrated circuits process each event, transferring the position, energy and timing information to the data acquisition controller. Chips will be tiled to produce a large area detector, capable of energy dispersive photon counting at moderate spatial resolution. Preliminary results from studies examining the design features and operation of the device are presented

  5. Development of a counting pixel detector for 'Digitales Roentgen'

    International Nuclear Information System (INIS)

    The development of a single photon counting X-ray imaging detector for medical applications using hybrid pixel detectors is reported. The electronics development from the first prototype derived from detector development for particle physics experiments (ATLAS) to the imaging chip MPEC (multi picture element counters) for medical applications is described. This chip consists of 32 x 32 pixels of 200 μm x 200 μm size, each containing the complete read out electronics, i.e. an amplifier, two discriminators with adjustable thresholds and two 18-bit linear feedback shift-counters allowing energy windowing for contrast increase. Results on electronics performance are shown as well as measurements with several semiconductor materials (Si, GaAs, CdTe). Important aspects like detection efficiency, sensor homogeneity, linearity and spatial resolution are discussed. (orig.)

  6. Overview of the CMS Pixel Detector

    CERN Document Server

    Cerati, Giuseppe B

    2008-01-01

    The Compact Muon Solenoid Experiment (CMS) will start taking data at the Large Hadron Collider (LHC) in 2009. It will investigate the proton-proton collisions at $14~TeV$. A robust tracking combined with a precise vertex reconstruction is crucial to address the physics challenge of proton collisions at this energy. To this extent an all-silicon tracking system with very fine granularity has been built and now is in the final commissioning phase. It represents the largest silicon tracking detector ever built. The system is composed by an outer part, made of micro-strip detectors, and an inner one, made of pixel detectors. The pixel detector consists of three pixel barrel layers and two forward disks at each side of the interaction region. Each pixel sensor, both for the barrel and forward detectors, has $100 \\times 150$ $\\mu m^2$ cells for a total of 66 million pixels covering a total area of about $1~m^2$. The pixel detector will play a crucial role in the pattern recognition and the track reconstruction both...

  7. Pixel Hit Reconstruction with the CMS Detector

    CERN Document Server

    Giurgiu, Gavril; Maksimovic, P; Swartz, M

    2008-01-01

    We present a new technique for pixel hit reconstruction with the CMS pixel detector. The technique is based on fitting the pixel cluster projections to templates obtained using a detailed simulation called Pixelav. Pixelav successfully describes the profiles of clusters measured in beam tests of radiation-damaged sensors. Originally developed to optimally estimate the coordinates of hits after the radiation damage, the technique has superior performance before irradiation as well, reducing the resolution tails of reconstructed track parameters and significantly reducing the light quark background of tagged b-quarks. It is the only technique currently available to simulate hits from a radiation-damaged detector.

  8. Pixel detectors from fundamentals to applications

    CERN Document Server

    Rossi, Leonardo; Rohe, Tilman; Wermes, Norbert

    2006-01-01

    Pixel detectors are a particularly important class of particle and radiation detection devices. They have an extremely broad spectrum of applications, ranging from high-energy physics to the photo cameras of everyday life. This book is a general purpose introduction into the fundamental principles of pixel detector technology and semiconductor-based hybrid pixel devices. Although these devices were developed for high-energy ionizing particles and radiation beyond visible light, they are finding new applications in many other areas. This book will therefore benefit all scientists and engineers working in any laboratory involved in developing or using particle detection.

  9. Testbeam Measurements with Pixel Sensors for the ATLAS Insertable b-Layer Project

    CERN Document Server

    George, Matthias; Quadt, Arnulf

    During the current long machine shutdown of the Large Hadron Collider (LHC) at CERN (Geneva), the innermost part of the ATLAS experiment, the pixel detector, is upgraded. The existing ATLAS pixel system is equipped with silicon sensors, organized in three barrel layers and three end cap disks on either side. To cope with the higher instantaneous luminosity in the future and for compensation of radiation damages due to past and near future running time of the experiment, a new fourth pixel detector layer is inserted into the existing system. This additional pixel layer is called “Insertable b-Layer” (IBL). The IBL is a detector system, based on silicon pixel sensors. Due to the smaller radius, compared to all other detectors of the ATLAS experiment, it has to be more radiation tolerant, than e.g. the current pixel layers. Furthermore, a reduced pixel size is necessary to cope with the expected higher particle flux. During the planning phase for the IBL upgrade, three different sensor technologies were comp...

  10. 3D electronics for hybrid pixel detectors – TWEPP-09

    CERN Document Server

    Godiot, S; Chantepie, B; Clémens, J C; Fei, R; Fleury, J; Fougeron, D; Garcia-Sciveres, M; Hemperek, T; Karagounis, M; Krueger, H; Mekkaoui, A; Pangaud, P; Rozanov, A; Wermes, N

    2009-01-01

    Future hybrid pixel detectors are asking for smaller pixels in order to improve spatial resolution and to deal with an increasing counting rate. Facing these requirements is foreseen to be done by microelectronics technology shrinking. However, this straightforward approach presents some disadvantages in term of performances and cost. New 3D technologies offer an alternative way with the advantage of technology mixing. For the upgrade of ATLAS pixel detector, a 3D conception of the read-out chip appeared as an interesting solution. Splitting the pixel functionalities into two separate levels will reduce pixel size and open the opportunity to take benefit of technology's mixing. Based on a previous prototype of the read-out chip FE-I4 (IBM 130nm), this paper presents the design of a hybrid pixel read-out chip using threedimensional Tezzaron-Chartered technology. In order to disentangle effects due to Chartered 130nm technology from effects involved by 3D architecture, a first translation of FEI4 prototype had ...

  11. Performance of the ATLAS vertex detector

    CERN Document Server

    Barberis, D

    1999-01-01

    The ATLAS inner detector consists of three layers of silicon pixels, four double layers of silicon microstrips and a transition radiation tracker (straw tubes). The good performance of the track and vertex reconstruction algorithms is a direct consequence of the small radius (4.3, 10.1 and 13.2 cm), fine pitch (50*300 mu m) and low occupancy (<3*10/sup -4/ at design luminosity) of the pixel detectors. The full (GEANT3) detector simulation is used to evaluate the performance of the detector and of the reconstruction algorithms. Results are presented on track and vertex reconstruction efficiencies and resolutions, and on the separation between b-jets and jets produced by light quarks. (8 refs).

  12. Test Beam Results of 3D Silicon Pixel Sensors for the ATLAS upgrade

    CERN Document Server

    Grenier, P; Barbero, M; Bates, R; Bolle, E; Borri, M; Boscardin, M; Buttar, C; Capua, M; Cavalli-Sforza, M; Cobal, M; Cristofoli, A; Dalla Betta, G F; Darbo, G; Da Via, C; Devetak, E; DeWilde, B; Di Girolamo, B; Dobos, D; Einsweiler, K; Esseni, D; Fazio, S; Fleta, C; Freestone, J; Gallrapp, C; Garcia-Sciveres, M; Gariano, G; Gemme, C; Giordani, M P; Gjersdal, H; Grinstein, S; Hansen, T; Hansen, T E; Hansson, P; Hasi, J; Helle, K; Hoeferkamp, M; Hugging, F; Jackson, P; Jakobs, K; Kalliopuska, J; Karagounis, M; Kenney, C; Köhler, M; Kocian, M; Kok, A; Kolya, S; Korokolov, I; Kostyukhin, V; Krüger, H; La Rosa, A; Lai, C H; Lietaer, N; Lozano, M; Mastroberardino, A; Micelli, A; Nellist, C; Oja, A; Oshea, V; Padilla, C; Palestri, P; Parker, S; Parzefall, U; Pater, J; Pellegrini, G; Pernegger, H; Piemonte, C; Pospisil, S; Povoli, M; Roe, S; Rohne, O; Ronchin, S; Rovani, A; Ruscino, E; Sandaker, H; Seidel, S; Selmi, L; Silverstein, D; Sjøbaek, K; Slavicek, T; Stapnes, S; Stugu, B; Stupak, J; Su, D; Susinno, G; Thompson, R; Tsung, J W; Tsybychev, D; Watts, S J; Wermes, N; Young, C; Zorzi, N

    2011-01-01

    Results on beam tests of 3D silicon pixel sensors aimed at the ATLAS Insertable-B-Layer and High Luminosity LHC (HL-LHC)) upgrades are presented. Measurements include charge collection, tracking efficiency and charge sharing between pixel cells, as a function of track incident angle, and were performed with and without a 1.6 T magnetic field oriented as the ATLAS Inner Detector solenoid field. Sensors were bump bonded to the front-end chip currently used in the ATLAS pixel detector. Full 3D sensors, with electrodes penetrating through the entire wafer thickness and active edge, and double-sided 3D sensors with partially overlapping bias and read-out electrodes were tested and showed comparable performance.

  13. Test beam results of 3D silicon pixel sensors for the ATLAS upgrade

    International Nuclear Information System (INIS)

    Results on beam tests of 3D silicon pixel sensors aimed at the ATLAS Insertable B-Layer and High Luminosity LHC (HL-LHC) upgrades are presented. Measurements include charge collection, tracking efficiency and charge sharing between pixel cells, as a function of track incident angle, and were performed with and without a 1.6 T magnetic field oriented as the ATLAS inner detector solenoid field. Sensors were bump-bonded to the front-end chip currently used in the ATLAS pixel detector. Full 3D sensors, with electrodes penetrating through the entire wafer thickness and active edge, and double-sided 3D sensors with partially overlapping bias and read-out electrodes were tested and showed comparable performance.

  14. High efficiency pixellated CdTe detector

    International Nuclear Information System (INIS)

    Position sensitive detectors constructed from compound semiconductors (CdTe, CdZnTe, HgI2) are being developed for a variety of applications where high sensitivity and improved energy resolution are significant advantages over scintillator or gas based systems. We have investigated the possibility of using a CdTe detector array in a SPECT gamma camera that would require a high efficiency at 140 keV. The problem of worsening photopeak efficiencies in thick detectors (due to incomplete charge collection) makes it difficult to maintain a high efficiency which, ironically, is the primary reason for choosing a thicker detector. Recent research has shown that following a simple geometrical design criterion can greatly reduce this deleterious effect. This paper reports on the results from a small prototype pixellated array fabricated using this design. We verify the 'small pixel effect' for a detector thickness and pixel size significantly larger than those used in most other work. A 9-element detector (1 x 1 mm pixels, 4 mm thick) has been fabricated and characterized in terms of energy resolution, peak-to-valley ratio and detection efficiency. Testing of the detector in a fast pulse mode to obtain its high count rate response has also been performed. (orig.)

  15. The Upgrade of the ATLAS Inner Detector

    CERN Document Server

    Ferrere, D; The ATLAS collaboration

    2012-01-01

    With the Large Hadron Collider (LHC) successfully collecting data at 7 TeV and even at 8 TeV since April 2012, plans are actively advancing for a series of upgrades in phase with the three long shutdown periods leading to detector improvement. The ATLAS collaboration will upgrade at the next shutdown in 2013-2014 its semiconductor pixel tracking detector with a new Insertable BLayer (IBL) between the existing innermost pixel layer and the vacuum pipe of the LHC. The extreme operating conditions at this location led considering the development of new radiation hard pixel sensor technologies and a new front-end readout chip. The IBL community is currently working for producing modules with silicon planar and 3D technology towards the loading on 14 local stave structures as well as the integration around the beam pipe and in the ATLAS detector. The High-Luminosity LHC (HL-LHC) will eventually increase to about five times the LHC design-luminosity some 10-years from now requiring a complete Inner Detector replace...

  16. Track parameter resolution study of a pixel only detector for LHC geometry and future high rate experiments

    International Nuclear Information System (INIS)

    Recent progress in pixel detector technology in general and in the HV-MAPS technology in particular make it feasible to construct an all-silicon pixel detector for large scale particle experiments like ATLAS or CMS. Previous studies have indicated that six to nine layers of pixel sensors, in comparison to the 14 detector layers planned for Inner Tracker ATLAS upgrade, are sufficient to reliably reconstruct particle trajectories. The performance of an all-pixel detector and the minimum number of required pixel layers is studied based on a full GEANT simulation for high luminosity conditions at the upgraded LHC. Furthermore, the ability of an all-pixel detector to form trigger decisions using a special triplet pixel layer design is studied. Such a design could be used to reconstruct all tracks originating from the proton-proton interaction at the first hardware level at 40 MHz collision frequency.

  17. Track parameter resolution study of a pixel only detector for LHC geometry and future high rate experiments

    Energy Technology Data Exchange (ETDEWEB)

    Blago, Michele Piero; Schoening, Andre [Physikalisches Institut, Heidelberg Univ. (Germany)

    2015-07-01

    Recent progress in pixel detector technology in general and in the HV-MAPS technology in particular make it feasible to construct an all-silicon pixel detector for large scale particle experiments like ATLAS or CMS. Previous studies have indicated that six to nine layers of pixel sensors, in comparison to the 14 detector layers planned for Inner Tracker ATLAS upgrade, are sufficient to reliably reconstruct particle trajectories. The performance of an all-pixel detector and the minimum number of required pixel layers is studied based on a full GEANT simulation for high luminosity conditions at the upgraded LHC. Furthermore, the ability of an all-pixel detector to form trigger decisions using a special triplet pixel layer design is studied. Such a design could be used to reconstruct all tracks originating from the proton-proton interaction at the first hardware level at 40 MHz collision frequency.

  18. Overview of the BTeV Pixel Detector

    International Nuclear Information System (INIS)

    BTeV is a new Fermilab beauty and charm experiment designed to operate in the CZero region of the Tevatron collider. Critical to the success of BTeV is its pixel detector. The unique features of this pixel detector include its proximity to the beam, its operation with a beam crossing time of 132 ns, and the need for the detector information to be read out quickly enough to be used for the lowest level trigger. This talk presents an overview of the pixel detector design, giving the motivations for the technical choices made. The status of the current RandD on detector components is also reviewed. Additional Pixel 2002 talks on the BTeV pixel detector are given by Dave Christian[1], Mayling Wong[2], and Sergio Zimmermann[3]. Table 1 gives a selection of pixel detector parameters for the ALICE, ATLAS, BTeV, and CMS experiments. Comparing the progression of this table, which I have been updating for the last several years, has shown a convergence of specifications. Nevertheless, significant differences endure. The BTeV data-driven readout, horizontal and vertical position resolution better than 9 (micro)m with the ± 300 mr forward acceptance, and positioning in vacuum and as close as 6 mm from the circulating beams remain unique. These features are driven by the physics goals of the BTeV experiment. Table 2 demonstrates that the vertex trigger performance made possible by these features is requisite for a very large fraction of the B meson decay physics which is so central to the motivation for BTeV. For most of the physics quantities of interest listed in the table, the vertex trigger is essential. The performance of the BTeV pixel detector may be summarized by looking at particular physics examples; e.g., the Bs meson decay Bs → Ds- K+. For that decay, studies using GEANT3 simulations provide quantitative measures of performance. For example, the separation between the Bs decay point and the primary proton-antiproton interaction can be measured with an rms

  19. Proceedings of PIXEL98 -- International pixel detector workshop

    Energy Technology Data Exchange (ETDEWEB)

    Anderson, D.F.; Kwan, S. [eds.

    1998-08-01

    Experiments around the globe face new challenges of more precision in the face of higher interaction rates, greater track densities, and higher radiation doses, as they look for rarer and rarer processes, leading many to incorporate pixelated solid-state detectors into their plans. The highest-readout rate devices require new technologies for implementation. This workshop reviewed recent, significant progress in meeting these technical challenges. Participants presented many new results; many of them from the weeks--even days--just before the workshop. Brand new at this workshop were results on cryogenic operation of radiation-damaged silicon detectors (dubbed the Lazarus effect). Other new work included a diamond sensor with 280-micron collection distance; new results on breakdown in p-type silicon detectors; testing of the latest versions of read-out chip and interconnection designs; and the radiation hardness of deep-submicron processes.

  20. Heavy Ion Physics at the ATLAS Detector

    CERN Document Server

    Takai, H; The ATLAS collaboration

    2009-01-01

    The ATLAS detector is one of the two large detectors built to carry on high pT physics  at the Large Hadron Collider. The detector is designed to perform optimally at the challenging nominal LHC machine luminosity of 10^34 cm-2s-1. ATLAS has a finely segmented electromagnetic and hadronic calorimeters covering 10 units of rapidity. The inner tracking system is composed of  sicilicon pixel detector, silicon central tracker, transition radiation tracker and a 2T solenoidal magnet, covering 5 units of rapidity. The muon spectrometer is located outside the calorimeter volume. Muon chambers and air core toroids are used to track muons of momentum larger than 4 GeV.  The ATLAS detector has a superb performance for jet physics because of its calorimeters. Simulation studies also indicate that it will be possible to tag b-jets in the heavy ion environment. Upsilon and J/Psi can be reconstructed through the di-muon decay channel. The detector is ideal for the study of global variables, namely total energy flow and ...

  1. Development of a CMOS SOI pixel detector

    CERN Document Server

    Ishino, Hirokazu; Hazumi, M; Ikegami, Y; Kohriki, T; Tajima, O; Terada, S; Tsuboyama, T; Unno, Y; Ushiroda, Y; Ikeda, H; Hara, K; Ishino, H; Kawasaki, T; Miyake, H; Martin, E; Varner, G; Tajima, H; Ohno, M; Fukuda, K; Komatsubara, H; Ida, J

    2007-01-01

    We have developed a monolithic radiation pixel detector using silicon on insulator (SOI) with a commercial 0.15 m fullydepleted- SOI technology and a Czochralski high resistivity silicon substrate in place of a handle wafer. The SOI TEG (Test Element Group) chips with a size of 2.5 x 2.5mm2 consisting of 20 x 20 um2 pixels have been designed and manufactured. Performance tests with a laser light illumination and a . ray radioactive source indicate successful operation of the detector. We also brie y discuss the back gate effect as well as the simulation study.

  2. Commissioning the CMS pixel detector with Cosmic Rays

    CERN Document Server

    Heyburn, Bernadette

    2009-01-01

    commissioning activities in the CMS pixel detector. Results from cosmic ray studies will be presented, in addition to results obtained from the integration of the pixel detector within the CMS detector and various calibration and alignment analyses.

  3. The ATLAS Insertable B-Layer Detector (IBL)

    CERN Document Server

    Huegging, F; The ATLAS collaboration

    2010-01-01

    The upgrade for the ATLAS detector will undergo different phases towards SLHC. The first upgrade for the Pixel Detector will consist in the construction of a new pixel layer which will be installed during a longer shutdown of the LHC machine, the so-called Phase I Upgrade. The new detector, called Insertable B-Layer (IBL), will be inserted between the existing pixel detector and a new (smaller radius) beam-pipe at a radius of about 3.2 cm. The IBL requires the development of several new technologies to cope with the increase of radiation and pixel occupancy as well as to improve the physics performance of the existing pixel detector. In order to achieve these goals the pixel size is reduced and the material budget is minimized by using new lightweight mechanical support materials and a CO2 based cooling system. Main component of the module development for the IBL is the new ATLAS pixel readout chip, FE-I4, designed in 130 nm technology which features an array of 80 by 336 pixels with a pixel size of 50x250 µ...

  4. The ALICE silicon pixel detector readout electronics

    CERN Document Server

    Krivda, M; Burns, M; Caselle, M; Kluge, A; Manzari, V; Torcato de Matos, C; Morel, M; Riedler, P; Aglieri Rinella, G; Sandor, L; Stefanini, G

    2010-01-01

    The ALICE silicon pixel detector (SPD) constitutes the two innermost layers of the ALICE inner tracking system (ALICE Collaboration, 1999) [1]. The SPD is built with 120 detector modules (half-staves) and contains about 10 million pixels in total. The half-staves are connected to the off-detector electronics, housed in a control room 100 m away, via bidirectional optical links. The stream of data from the front-end electronics is processed in 20 VME readout modules, called routers, based on FPGAs. Three 2-channel link-receiver daughter cards, also based on FPGAs, are plugged in each router. Each link-receiver card receives data via the optical link from two half-staves, applies the zero suppression and passes them to the router to be processed and sent to the ALICE–DAQ system through the detector data link (DDL). The SPD control, configuration and data monitoring are performed using the VME interface embedded in the router.

  5. The ALICE silicon pixel detector readout electronics

    International Nuclear Information System (INIS)

    The ALICE silicon pixel detector (SPD) constitutes the two innermost layers of the ALICE inner tracking system (ALICE Collaboration, 1999) . The SPD is built with 120 detector modules (half-staves) and contains about 10 million pixels in total. The half-staves are connected to the off-detector electronics, housed in a control room 100 m away, via bidirectional optical links. The stream of data from the front-end electronics is processed in 20 VME readout modules, called routers, based on FPGAs. Three 2-channel link-receiver daughter cards, also based on FPGAs, are plugged in each router. Each link-receiver card receives data via the optical link from two half-staves, applies the zero suppression and passes them to the router to be processed and sent to the ALICE-DAQ system through the detector data link (DDL). The SPD control, configuration and data monitoring are performed using the VME interface embedded in the router.

  6. Charge sharing in silicon pixel detectors

    CERN Document Server

    Mathieson, K; Seller, P; Prydderch, M L; O'Shea, V; Bates, R L; Smith, K M; Rahman, M

    2002-01-01

    We used a pixellated hybrid silicon X-ray detector to study the effect of the sharing of generated charge between neighbouring pixels over a range of incident X-ray energies, 13-36 keV. The system is a room temperature, energy resolving detector with a Gaussian FWHM of 265 eV at 5.9 keV. Each pixel is 300 mu m square, 300 mu m deep and is bump bonded to matching read out electronics. The modelling packages MEDICI and MCNP were used to model the complete X-ray interaction and the subsequent charge transport. Using this software a model is developed which reproduces well the experimental results. The simulations are then altered to explore smaller pixel sizes and different X-ray energies. Charge sharing was observed experimentally to be 2% at 13 keV rising to 4.5% at 36 keV, for an energy threshold of 4 keV. The models predict that up to 50% of charge may be lost to the neighbouring pixels, for an X-ray energy of 36 keV, when the pixel size is reduced to 55 mu m.

  7. TFA pixel sensor technology for vertex detectors

    Energy Technology Data Exchange (ETDEWEB)

    Jarron, P. [CERN, CH-1211 Geneva 23 (Switzerland)]. E-mail: Pierre.Jarron@cern.ch; Moraes, D. [CERN, CH-1211 Geneva 23 (Switzerland)]. E-mail: Danielle.Moraes@cern.ch; Despeisse, M. [CERN, CH-1211 Geneva 23 (Switzerland); Dissertori, G. [ETH-Zurich, CH-8093 Zurich (Switzerland); Dunand, S. [IMT, Rue A.-L. Breguet 2, CH-2000 Neuchatel (Switzerland); Kaplon, J. [CERN, CH-1211 Geneva 23 (Switzerland); Miazza, C. [IMT, Rue A.-L. Breguet 2, CH-2000 Neuchatel (Switzerland); Shah, A. [IMT, Rue A.-L. Breguet 2, CH-2000 Neuchatel (Switzerland); Viertel, G.M. [ETH-Zurich, CH-8093 Zurich (Switzerland); Wyrsch, N. [IMT, Rue A.-L. Breguet 2, CH-2000 Neuchatel (Switzerland)

    2006-05-01

    Pixel microvertex detectors at the SLHC and a future linear collider face very challenging issues: extreme radiation hardness, cooling design, interconnections density and fabrication cost. As an alternative approach we present a novel pixel detector based on the deposition of a Hydrogenated Amorphous Silicon (a-Si:H) film on top of a readout ASIC. The Thin-Film on ASIC (TFA) technology is inspired by an emerging microelectronic technology envisaged for visible light Active Pixel Sensor (APS) devices. We present results obtained with a-Si:H sensor films deposited on a glass substrate and on ASIC, including the radiation hardness of this material up to a fluence of 3.5x10{sup 15} p/cm{sup 2}.

  8. TFA pixel sensor technology for vertex detectors

    International Nuclear Information System (INIS)

    Pixel microvertex detectors at the SLHC and a future linear collider face very challenging issues: extreme radiation hardness, cooling design, interconnections density and fabrication cost. As an alternative approach we present a novel pixel detector based on the deposition of a Hydrogenated Amorphous Silicon (a-Si:H) film on top of a readout ASIC. The Thin-Film on ASIC (TFA) technology is inspired by an emerging microelectronic technology envisaged for visible light Active Pixel Sensor (APS) devices. We present results obtained with a-Si:H sensor films deposited on a glass substrate and on ASIC, including the radiation hardness of this material up to a fluence of 3.5x1015 p/cm2

  9. Development of silicon micropattern pixel detectors

    International Nuclear Information System (INIS)

    Successive versions of high speed, active silicon pixel detectors with integrated readout electronics have been developed for particle physics experiments using monolithic and hybrid technologies. Various matrices with binary output as well as a linear detector with analog output have been made. The hybrid binary matrix with 1024 cells (dimension 75 μmx500 μm) can capture events at similar 5 MHz and a selected event can then be read out in 109Cd source a noise level of 170 e-r.m.s. (1.4 keV fwhm) has been measured with a threshold non-uniformity of 750 e- r.m.s. Objectives of the development work are the increase of the size of detecting area without loss of efficiency, the design of an appropriate readout architecture for collider operation, the reduction of material thickness in the detector, understanding of the threshold non-uniformity, study of the sensitivity of the pixel matrices to light and low energy electrons for scintillating fiber detector readout and last but not least, the optimization of cost and yield of the pixel detectors in production. ((orig.))

  10. Quality control on planar n-in-n pixel sensors — Recent progress of ATLAS planar pixel sensors

    International Nuclear Information System (INIS)

    To extend the physics reach of the Large Hadron Collider (LHC), upgrades to the accelerator are planned which will increase the peak luminosity by a factor 5–10. To cope with the increased occupancy and radiation damage, the ATLAS experiment plans to introduce an all-silicon inner tracker with the high luminosity upgrade (HL-LHC). To investigate the suitability of pixel sensors using the proven planar technology for the upgraded tracker, the ATLAS Upgrade Planar Pixel Sensor (PPS) R and D Project was established. Main areas of research are the performance of planar pixel sensors at highest fluences, the exploration of possibilities for cost reduction to enable the instrumentation of large areas, the achievement of slim or active edges to provide low geometric inefficiencies without the need for shingling of modules and the investigation of the operation of highly irradiated sensors at low thresholds to increase the efficiency. The Insertable b-layer (IBL) is the first upgrade project within the ATLAS experiment and will employ a new detector layer consisting of silicon pixel sensors, which were improved and prototyped in the framework of the planar pixel sensor R and D project. A special focus of this paper is the status of the development and testing of planar n-in-n pixel sensors including the quality control of the on-going series production and postprocessing of sensor wafers. A high yield of produced planar sensor wafers and FE-I4 double chip sensors after first steps of post-processing including under bump metallization and dicing is observed. -- Highlights: ► Prototypes of irradiated planar n-in-n sensors have been successfully tested under laboratory conditions. ► A quality assurance programme on the series production of planar sensors for the IBL has started. ► A high yield of double chip sensors during the series production is observed which are compatible to the specifications to this detector component.

  11. SOIKID, SOI pixel detector combined with superconducting detector KID

    CERN Document Server

    Ishino, Hirokazu; Kida, Yosuke; Yamada, Yousuke

    2015-01-01

    We present the development status of the SOIKID, a detector combining the SOI pixel detector and the superconducting detector KID (Kinetic Inductance Detector). The aim of the SOIKID is to measure X-ray photon energy with the resolution better than that of the semiconductor detector. The silicon substrate is used as the X-ray photon absorber. The recoiled electron creates athermal phonons as well as the ionizing electron-hole pairs. The KID formed at one side of the substrate surface detects the phonons to measure the total energy deposited, while the SOI pixel detector formed on the other side of the substrate detects the ionized carries to measure the position. Combining the position and energy measurements, it is in principle possible to have the extremely high energy resolution.

  12. ATLAS pixel IBL modules construction experience and developments for future upgrade

    International Nuclear Information System (INIS)

    The first upgrade of the ATLAS Pixel Detector is the Insertable B-Layer (IBL), installed in May 2014 in the core of ATLAS. Two different silicon sensor technologies, planar n-in-n and 3D, are used. Sensors are connected with the new generation 130 nm IBM CMOS FE-I4 read-out chip via solder bump-bonds. Production quality control tests were set up to verify and rate the performance of the modules before integration into staves. An overview of module design and construction, the quality control results and production yield will be discussed, as well as future developments foreseen for future detector upgrades

  13. ATLAS pixel IBL modules construction experience and developments for future upgrade

    Energy Technology Data Exchange (ETDEWEB)

    Gaudiello, A.

    2015-10-01

    The first upgrade of the ATLAS Pixel Detector is the Insertable B-Layer (IBL), installed in May 2014 in the core of ATLAS. Two different silicon sensor technologies, planar n-in-n and 3D, are used. Sensors are connected with the new generation 130 nm IBM CMOS FE-I4 read-out chip via solder bump-bonds. Production quality control tests were set up to verify and rate the performance of the modules before integration into staves. An overview of module design and construction, the quality control results and production yield will be discussed, as well as future developments foreseen for future detector upgrades.

  14. ATLAS Pixel IBL Modules Construction Experience and Developments for Future Upgrade

    CERN Document Server

    Gaudiello, Andrea; The ATLAS collaboration

    2015-01-01

    The first upgrade of the ATLAS Pixel Detector is the Insertable B-Layer (IBL), just installed in May 2014 in the core of ATLAS. Two different silicon sensor technologies, planar n-in-n and 3D, were used, connected with the new generation 130nm IBM CMOS FE-I4 readout chip via solder bump-bonds. Production quality control tests were set up to verify and rate the performance of the modules before integration into staves. An overview of module design and construction, the quality control results and production yield will be discussed, as well as future developments foreseen for future detector upgrades.

  15. ATLAS Pixel IBL modules construction experience and developments for future upgrade

    CERN Document Server

    Gaudiello, A; The ATLAS collaboration

    2014-01-01

    The first upgrade of the ATLAS Pixel Detector is the Insertable B-Layer (IBL), just installed in May 2014 in the core of ATLAS. Two different silicon sensor technologies, planar n-in-n and 3D, were used, connected with the new generation 130nm IBM CMOS FE-I4 readout chip via solder bump-bonds. Production quality control tests were set up to verify and rate the performance of the modules before integration into staves. An overview of module design and construction, the quality control results and production yield will be discussed, as well as future developments foreseen for future detector upgrades.

  16. Characterization of the CMS Pixel Detectors

    CERN Document Server

    Gu, Weihua

    2002-01-01

    In 2005 the Large Hadron Collider (LHC) will start the pp collisions at a high luminosity and at a center of mass energy of 14 TeV. The primary goal of the experimental programme is the search of the Higgs boson(s) and the supersymmetric particles. The programme is also proposed to detect a range of diverse signatures in order to provide guidance for future physics. The pixel detector system makes up the innermost part of the CMS experiment, which is one of the two general purpose detectors at the LHC. The main tasks of the system are vertex detection and flavor tagging. The high luminosity and the high particle multiplicity as well as the small bunch spacing at the LHC impose great challenges on the pixel detectors: radiation hardness of sensors and electronics, fast signal processing and a high granularity are the essential requirements. This thesis concentrates on the study of the suitability of two test stands, which are implemented to characterize the CMS pixel detectors: one is con-cerned with test puls...

  17. The Belle II DEPFET pixel detector

    International Nuclear Information System (INIS)

    The Japanese flavour factory (KEKB) accumulated a total integrated luminosity of 1000 fb-1 over more than a decade of operation. Despite this great success, an upgrade of the existing machine is under construction, and is foreseen for commissioning by the end of 2015. This new electron-positron machine (SuperKEKB) will deliver an instantaneous luminosity 40 times higher than the world record set by KEKB. To fully exploit the huge number of events and measure precisely the decay vertex of the B mesons in a large background environment, the SuperKEKB partner, the Belle detector, will be also upgraded. In the Belle II project, a highly granular silicon vertex detector (PXD) based on the DEPFET pixel technology, will be the innermost subsystem, operated very close to the interaction point. The new pixel detector has to have an excellent single point resolution (10 μm) and a fast readout (20 μs), while keeping the material budget under very low levels (0.2% X0). This talk summarizes the Belle II pixel detector concept, from the DEPFET sensor to the laboratory tests results, all the way up the electronics chain, the DAQ system and the cooling concept.

  18. Alignment of the ATLAS Inner Detector Tracking System

    CERN Document Server

    Heller, C; The ATLAS collaboration

    2011-01-01

    ATLAS is one of the multipurpose experiments that records the products of the LHC proton-proton and heavy ion collisions. In order to reconstruct trajectories of charged particles produced in these collisions, ATLAS is equipped with a tracking system built using two different technologies, silicon planar sensors (pixel and microstrips) and drift-tube based detectors. Together they constitute the ATLAS Inner Detector, which is embedded in a 2 T axial field. Efficiently reconstructing tracks from charged particles traversing the detector, and precisely measure their momenta is of crucial importance for physics analyses. In order to achieve its scientific goals, an alignment of the ATLAS Inner Detector is required to accurately determine its more than 700,000 degrees of freedom. The goal of the alignment is set such that the limited knowledge of the sensor locations should not deteriorate the resolution of track parameters by more than 20% with respect to the intrinsic tracker resolution. The implementation of t...

  19. Alignment of the ATLAS Inner Detector Tracking System

    CERN Document Server

    Heller, C; The ATLAS collaboration

    2011-01-01

    ATLAS is one of four multipurpose experiments that records the products of the LHC proton-proton collisions. In order to reconstruct trajectories of charged particles produced in these collisions, ATLAS is equipped with a tracking system built using two different technologies, silicon planar sensors (pixel and microstrips) and drift-tube based detectors. Together they constitute the ATLAS Inner Detector, which is embedded in a 2 T solenoidal field. Efficiently reconstructing tracks from charged particles traversing the detector, and precisely measure their momenta, is of crucial importance for physics analyses. In order to achieve its scientific goals, an alignment of the ATLAS Inner Detector is required to accurately determine its almost 36,000 degrees of freedom. The goal of the alignment is set such that the limited knowledge of the sensor locations should not deteriorate the resolution of track parameters by more than 20% with respect to the intrinsic tracker resolution. The resulting required precision f...

  20. Readout architecture of the CMS pixel detector

    CERN Document Server

    Baur, R

    2001-01-01

    In this paper we describe the readout architecture of the CMS pixel chip. In column drain architecture the complex tasks of data buffering and trigger verification are performed in the circuit periphery. This allows to use a rather simple pixel unit cell which requires only a small number of transistors. The column periphery logic is designed for readout and trigger rates expected for full LHC luminosity. At LHC the high particle flux can create single event upsets in the readout chips. At small radii the upsets of logic cells could severely affect the performance of the pixel detector readout. We have therefore performed a measurement of the upset rate at the PSI pion beam and describe the consequences for the design of the readout chip. (5 refs).

  1. Radiation Experience with the CMS Pixel Detector

    CERN Document Server

    Veszpremi, Viktor

    2015-01-01

    The CMS pixel detector is the innermost component of the CMS tracker occupying the region around the centre of CMS, where the LHC beams are crossed, between 4.3~cm and 30~cm in radius and 46.5~cm along the beam axis. It operates in a high-occupancy and high-radiation environment created by particle collisions. Studies of radiation damage effects to the sensors were performed throughout the first running period of the LHC. Leakage current, depletion voltage, pixel read-out thresholds, and hit finding efficiencies were monitored as functions of the increasing particle fluence. The methods and results of these measurements will be described together with their implications to detector operation as well as to performance parameters in offline hit reconstruction.

  2. Radiation experience with the CMS pixel detector

    Science.gov (United States)

    Veszpremi, V.

    2015-04-01

    The CMS pixel detector is the innermost component of the CMS tracker occupying the region around the centre of CMS, where the LHC beams are crossed, between 4.3 cm and 30 cm in radius and 46.5 cm along the beam axis. It operates in a high-occupancy and high-radiation environment created by particle collisions. Studies of radiation damage effects to the sensors were performed throughout the first running period of the LHC . Leakage current, depletion voltage, pixel readout thresholds, and hit finding efficiencies were monitored as functions of the increasing particle fluence. The methods and results of these measurements will be described together with their implications to detector operation as well as to performance parameters in offline hit reconstruction.

  3. Monolithic pixel detectors for high energy physics

    CERN Document Server

    Snoeys, W

    2013-01-01

    Monolithic pixel detectors integrating sensor matrix and readout in one piece of silicon have revolutionized imaging for consumer applications, but despite years of research they have not yet been widely adopted for high energy physics. Two major requirements for this application, radiation tolerance and low power consumption, require charge collection by drift for the most extreme radiation levels and an optimization of the collected signal charge over input capacitance ratio ( Q / C ). It is shown that monolithic detectors can achieve Q / C for low analog power consumption and even carryout the promise to practically eliminate analog power consumption, but combining suf fi cient Q / C , collection by drift, and integration of readout circuitry within the pixel remains a challenge. An overview is given of different approaches to address this challenge, with possible advantages and disadvantages.

  4. Characterization of the CMS pixel detectors

    OpenAIRE

    Gu, Weihua

    2002-01-01

    In 2005 the Large Hadron Collider (LHC) will start the pp collisions at a high luminosity and at a center of mass energy of 14 TeV. The primary goal of the experimental programme is the search of the Higgs boson(s) and the supersymmetric particles. The programme is also proposed to detect a range of diverse signatures in order to provide guidance for future physics. The pixel detector system makes up the innermost part of the CMS experiment, which is one of the two general purpose detectors a...

  5. Beam test results of the BTeV silicon pixel detector

    Energy Technology Data Exchange (ETDEWEB)

    Gabriele Chiodini et al.

    2000-09-28

    The authors have described the results of the BTeV silicon pixel detector beam test. The pixel detectors under test used samples of the first two generations of Fermilab pixel readout chips, FPIX0 and FPIX1, (indium bump-bonded to ATLAS sensor prototypes). The spatial resolution achieved using analog charge information is excellent for a large range of track inclination. The resolution is still very good using only 2-bit charge information. A relatively small dependence of the resolution on bias voltage is observed. The resolution is observed to depend dramatically on the discriminator threshold, and it deteriorates rapidly for threshold above 4000e{sup {minus}}.

  6. Alignment of the ATLAS Inner Detector tracking system

    CERN Document Server

    Moles-Valls, R; The ATLAS collaboration

    2010-01-01

    ATLAS is a multipurpose experiment that records the products of the LHC collisions. In order to reconstruct trajectories of charged particles produced in these collisions, ATLAS is equipped with a tracking system built on silicon planar sensors (Pixels and microstrips) and drift-tube based detectors. They constitute the ATLAS Inner Detector. It contains 1744 pixel modules (1456 in 3 barrel layers and 288 in 6 end cap disks). The pixel size is 50x400 squared microns. In order to achieve its scientific goals, the alignment of the ATLAS tracking system requires the determination of its almost 36000 degrees of freedom (DoF) with high accuracy. Thus the demanded precision for the alignment of the pixel and microstrip sensors is below 10 micrometers. This implies to use a large sample of high momentum and isolated charge particle tracks. The high level trigger selects those tracks online. Tracks from cosmic trigger during empty LHC bunches are also used as input for the alignment if they cross the pixel detector vo...

  7. The ATLAS Detector Control System

    CERN Document Server

    Schlenker, S; Kersten, S; Hirschbuehl, D; Braun, H; Poblaguev, A; Oliveira Damazio, D; Talyshev, A; Zimmermann, S; Franz, S; Gutzwiller, O; Hartert, J; Mindur, B; Tsarouchas, CA; Caforio, D; Sbarra, C; Olszowska, J; Hajduk, Z; Banas, E; Wynne, B; Robichaud-Veronneau, A; Nemecek, S; Thompson, PD; Mandic, I; Deliyergiyev, M; Polini, A; Kovalenko, S; Khomutnikov, V; Filimonov, V; Bindi, M; Stanecka, E; Martin, T; Lantzsch, K; Hoffmann, D; Huber, J; Mountricha, E; Santos, HF; Ribeiro, G; Barillari, T; Habring, J; Arabidze, G; Boterenbrood, H; Hart, R; Marques Vinagre, F; Lafarguette, P; Tartarelli, GF; Nagai, K; D'Auria, S; Chekulaev, S; Phillips, P; Ertel, E; Brenner, R; Leontsinis, S; Mitrevski, J; Grassi, V; Karakostas, K; Iakovidis, G.; Marchese, F; Aielli, G

    2011-01-01

    The ATLAS experiment is one of the multi-purpose experiments at the Large Hadron Collider (LHC), constructed to study elementary particle interactions in collisions of high-energy proton beams. Twelve different sub-detectors as well as the common experimental infrastructure are supervised by the Detector Control System (DCS). The DCS enables equipment supervision of all ATLAS sub-detectors by using a system of >130 server machines running the industrial SCADA product PVSS. This highly distributed system reads, processes and archives of the order of 106 operational parameters. Higher level control system layers allow for automatic control procedures, efficient error recognition and handling, and manage the communication with external systems such as the LHC. This contribution firstly describes the status of the ATLAS DCS and the experience gained during the LHC commissioning and the first physics data taking operation period. Secondly, the future evolution and maintenance constraints for the coming years an...

  8. Novel silicon n-in-p pixel sensors for the future ATLAS upgrades

    International Nuclear Information System (INIS)

    In view of the LHC upgrade phases towards HL-LHC the ATLAS experiment plans to upgrade the inner detector with an all silicon system. The n-in-p silicon technology is a promising candidate for the pixel upgrade thanks to its radiation hardness and cost effectiveness that allow for enlarging the area instrumented with pixel detectors. We present the characterization and performance of novel n-in-p planar pixel sensors produced by CiS (Germany) connected by bump bonding to the ATLAS readout chip FE-I3. These results are obtained before and after irradiation up to a fluence of 10161-MeV neqcm−2, and prove the operability of this kind of sensors in the harsh radiation environment foreseen for the pixel system at HL-LHC. We also present an overview of the new pixel production, which is on-going at CiS for sensors compatible with the new ATLAS readout chip FE-I4

  9. Novel Silicon n-in-p Pixel Sensors for the future ATLAS Upgrades

    CERN Document Server

    La Rosa, A; Macchiolo, A; Nisius, R; Pernegger, H; Richter,R H; Weigell, P

    2013-01-01

    In view of the LHC upgrade phases towards HL-LHC the ATLAS experiment plans to upgrade the Inner Detector with an all silicon system. The n-in-p silicon technology is a promising candidate for the pixel upgrade thanks to its radiation hardness and cost eectiveness, that allow for enlarging the area instrumented with pixel detectors. We present the characterization and performance of novel n-in-p planar pixel sensors produced by CiS (Germany) connected by bump bonding to the ATLAS readout chip FE-I3. These results are obtained before and after irradiation up to a fluence of 1016 1-MeV $n_{eq}cm^{-2}$, and prove the operability of this kind of sensors in the harsh radiation environment foreseen for the pixel system at HL-LHC. We also present an overview of the new pixel production, which is on-going at CiS for sensors compatible with the new ATLAS readout chip FE-I4.

  10. Novel silicon n-in-p pixel sensors for the future ATLAS upgrades

    Science.gov (United States)

    La Rosa, A.; Gallrapp, C.; Macchiolo, A.; Nisius, R.; Pernegger, H.; Richter, R. H.; Weigell, P.

    2013-08-01

    In view of the LHC upgrade phases towards HL-LHC the ATLAS experiment plans to upgrade the inner detector with an all silicon system. The n-in-p silicon technology is a promising candidate for the pixel upgrade thanks to its radiation hardness and cost effectiveness that allow for enlarging the area instrumented with pixel detectors. We present the characterization and performance of novel n-in-p planar pixel sensors produced by CiS (Germany) connected by bump bonding to the ATLAS readout chip FE-I3. These results are obtained before and after irradiation up to a fluence of 10161-MeV neq cm-2, and prove the operability of this kind of sensors in the harsh radiation environment foreseen for the pixel system at HL-LHC. We also present an overview of the new pixel production, which is on-going at CiS for sensors compatible with the new ATLAS readout chip FE-I4.

  11. A New Pixel Layer for ATLAS: The IBL

    CERN Document Server

    Kehal, Asma

    2013-01-01

    This report represents the main work in our intership at CERN we investegated the quality assurance of some staves by analyzed data . In this work, we briefly review the ATLAS detector, then we taken about IBL wish play an important role at ATLAS upgrade. And finally we analyzed data with Root to check the validity of the staves .

  12. Sensor studies of n+-in-n planar pixel sensors for the ATLAS upgrades

    International Nuclear Information System (INIS)

    The ATLAS experiment at the LHC is planning upgrades of its pixel detector to cope with the luminosity increase foreseen in the coming years within the transition from LHC to Super-LHC (SLHC/HL-LHC). Associated with an increase in instantaneous luminosity is a rise of the target integrated luminosity from 730 fb-1 to about 3000 fb-1 which directly translates into significantly higher radiation damage. These upgrades consist of the installation of a 4th pixel layer, the insertable b-layer IBL, with a mean sensor radius of only 32 mm from the beam axis, before 2016/17. In addition, the complete pixel detector will be exchanged before 2020/21. Being very close to the beam, the radiation damage of the IBL sensors might be as high as 5.1015neqcm-2 at their end-of-life. The total fluence of the innermost pixel layer after the SLHC upgrade might even reach 2.1016neqcm-2. We have performed systematic measurements of planar pixel detectors based on the current ATLAS readout chip FE-I3 and obtained first experience with the new IBL readout chip FE-I4. First results will be presented.

  13. The ATLAS detector: status and performance in Run-II

    CERN Document Server

    Schramm, Steven; The ATLAS collaboration

    2015-01-01

    During the 2013/2014 shutdown of the LHC, the ATLAS detector has been improved. A new silicon pixel detector layer has been installed, and the muon detector coverage has been improved substantially. In addition, nearly all other parts of the detector have also been revised to adapt them to the higher pile-up conditions or make them more robust in general. This talk will describe these improvements, and how they affect the performance of physics objects. The initial results showing the detector performance as obtained from cosmic runs and/or initial beam data will also be shown.

  14. The LHC Luminosity Upgrade and Related ATLAS Detector Plans

    CERN Document Server

    Hartjes, F; The ATLAS collaboration

    2009-01-01

    3rd draft of the proposed talk about Atlas Upgrade for MPGD2009 (Instrumentation conference on gaseous pixel detectors) on Friday June 12, 2009. I concentrated my presentation on the upgrade plans and schedule of the LHC and on detector technologies for the new Inner Tracker, putting less emphasis on other subdetectors. Compared to the 2nd draft I modified and clarified a few items about trigger, muon detection and calorimetry and did a number of cosmetic adaptions.

  15. The pixel detector for the CMS phase-II upgrade

    International Nuclear Information System (INIS)

    The high luminosity phase of the Large Hadron Collider (HL-LHC) requires a major pixel detector R and D effort to develop both readout chip and sensor that are capable to withstand unprecedented extremely high radiation. The target integrated luminosity of 3000 fb−1, that the HL-LHC is expected to deliver over about 10 years of operation, translates into a hadron fluence of 2×1016 1 MeV eq.n. / cm2, or equivalently 10 MGy of radiation dose in silicon, at about 3 cm from the interaction region where the first layer of the pixel detector could be located. The CMS collaboration has undertaken two baseline sensor R and D programs on thin n-on-p planar and 3D silicon sensor technologies. Together with the ATLAS collaboration it has also been established a common R and D effort for the development of the readout chip in the 65 nm CMOS technology. Status, progresses, and prospects of the CMS R and D effort are presented and discussed in this article

  16. The pixel detector for the CMS phase-II upgrade

    CERN Document Server

    Dinardo, Mauro

    2015-01-01

    The high luminosity phase of the Large Hadron Collider (HL-LHC) requires a major pixel detector R\\&D effort to develop both readout chip and sensor that are capable to withstand unprecedented extremely high radiation. The target integrated luminosity of 3000~fb$^{-1}$, that the HL-LHC is expected to deliver over about 10 years of operation, translates into a hadron fluence of $2\\times10^{16}$~1MeV~eq.n.~/~cm$^2$, or equivalently 10~MGy of radiation dose in silicon, at about 3~cm from the interaction region where the first layer of the pixel detector could be located. The CMS collaboration has undertaken two baseline sensor R\\&D programs on thin n-on-p planar and 3D silicon sensor technologies. Together with the ATLAS collaboration it has also been established a common R\\&D effort for the development of the readout chip in the 65~nm CMOS technology. Status, progresses, and prospects of the CMS R\\&D effort are presented and discussed in this article.

  17. The pixel detector for the CMS phase-II upgrade

    Science.gov (United States)

    Dinardo, M. E.

    2015-04-01

    The high luminosity phase of the Large Hadron Collider (HL-LHC) requires a major pixel detector R&D effort to develop both readout chip and sensor that are capable to withstand unprecedented extremely high radiation. The target integrated luminosity of 3000 fb-1, that the HL-LHC is expected to deliver over about 10 years of operation, translates into a hadron fluence of 2×1016 1 MeV eq.n. / cm2, or equivalently 10 MGy of radiation dose in silicon, at about 3 cm from the interaction region where the first layer of the pixel detector could be located. The CMS collaboration has undertaken two baseline sensor R&D programs on thin n-on-p planar and 3D silicon sensor technologies. Together with the ATLAS collaboration it has also been established a common R&D effort for the development of the readout chip in the 65 nm CMOS technology. Status, progresses, and prospects of the CMS R&D effort are presented and discussed in this article.

  18. The ALICE Silicon Pixel Detector System

    CERN Document Server

    Fadmar Osmic, FO

    2006-01-01

    The European Organization for Particle Physics (CERN) in Geneva is currently constructing the Large Hadron Collider (LHC), which will allow the study of the subnuclear ranges of physics with an accuracy never achieved before. Within the LHC project, ALICE is to the study of strongly interacting matter at extreme densities and high temperatures. ALICE as many other modern High Energy Physics (HEP) experiments uses silicon pixel detectors for tracking close to the interaction point (IP). The ALICE Silicon Pixel Detector (SPD) will constitute the two innermost layers of ALICE, and will due to its high granularity provide precise tracking information. In heavy ion collisions, the track density could be as high as 80 tracks/cm2 in the first SPD layer. The SPD will provide tracking information at radii of 3.9 and 7.6 cm from the IP. It is a fundamental element for the study of the weak decays of the particles carrying heavy flavour, whose typical signature will be a secondary vertex separated from the primary verte...

  19. Planar pixel sensors for the ATLAS upgrade: beam tests results

    International Nuclear Information System (INIS)

    The performance of planar silicon pixel sensors, in development for the ATLAS Insertable B-Layer and High Luminosity LHC (HL-LHC) upgrades, has been examined in a series of beam tests at the CERN SPS facilities since 2009. Salient results are reported on the key parameters, including the spatial resolution, the charge collection and the charge sharing between adjacent cells, for different bulk materials and sensor geometries. Measurements are presented for n+-in-n pixel sensors irradiated with a range of fluences and for p-type silicon sensors with various layouts from different vendors. All tested sensors were connected via bump-bonding to the ATLAS Pixel read-out chip. The tests reveal that both n-type and p-type planar sensors are able to collect significant charge even after the lifetime fluence expected at the HL-LHC.

  20. Commissioning the CMS pixel detector with Cosmic Rays

    CERN Document Server

    Heyburn, Bernadette

    2009-01-01

    The Compact Muon Solenoid (CMS) is one of two general purpose experiments at the Large Hadron Collider. The CMS experiment prides itself on an ambitious, all silicon based, tracking system. After almost 20 years of design and construction the CMS tracker detector has been installed and commissioned. The tracker detector consists of ten layers of silicon microstrip detectors while three layers of pixel detector modules are situated closest to the interaction point. The pixel detector consists of 66 million pixels of 100mm 150mm size, and is designed to use the shape of the actual charge distribution of charged particles to gain hit resolutions down to 12mm. This paper will focus on commissioning activities in the CMS pixel detector. Results from cosmic ray studies will be presented, in addition to results obtained from the integration of the pixel detector within the CMS detector and various calibration and alignment analyses.

  1. Detector performance of the ALICE silicon pixel detector

    CERN Document Server

    Cavicchioli, C

    2011-01-01

    The ALICE Silicon Pixel Detector (SPD) forms the two innermost layers of the ALICE Inner Tracking System (ITS). It consists of two barrel layers of hybrid silicon pixel detectors at radii of 39 and 76 mm. The physics targets of the ALICE experiment require that the material budget of the SPD is kept within approximate to 1\\%X(0) per layer. This has set some stringent constraints on the design and construction of the SPD. A unique feature of the ALICE SPD is that it is capable of providing a prompt trigger signal, called Fast-OR, which contributes to the L0 trigger decision. The pixel trigger system allows to apply a set of algorithms for the trigger selection, and its output is sent to the Central Trigger Processor (CTP). The detector has been installed in the experiment in summer 2007. During the first injection tests in June 2008 the SPD was able to record the very first sign of life of the LHC by registering secondary particles from the beam dumped upstream the ALICE experiment. In the following months the...

  2. ''The Read-Out Driver'' ROD card for the Insertable B-layer (IBL) detector of the ATLAS experiment: commissioning and upgrade studies for the Pixel Layers 1 and 2

    International Nuclear Information System (INIS)

    The upgrade of the ATLAS experiment at LHC foresees the insertion of an innermost silicon layer, called the Insertable B-layer (IBL). The IBL read-out system will be equipped with new electronics. The Readout-Driver card (ROD) is a VME board devoted to data processing, configuration and control. A pre-production batch has been delivered for testing with instrumented slices of the overall acquisition chain, aiming to finalize strategies for system commissioning. In this paper system setups and results will be described, as well as preliminary studies on changes needed to adopt the ROD for the ATLAS Pixel Layers 1 and 2

  3. Background capabilities of pixel detectors for double beta decay measurements

    Energy Technology Data Exchange (ETDEWEB)

    Cermak, Pavel, E-mail: pavel.cermak@utef.cvut.cz [Institute of Experimental and Applied Physics, CTU in Prague, 12800 Prague (Czech Republic); Stekl, Ivan; Bocarov, Viktor; Jose, Joshy M.; Jakubek, Jan; Pospisil, Stanislav [Institute of Experimental and Applied Physics, CTU in Prague, 12800 Prague (Czech Republic); Fiederle, Michael; Fauler, Alex [Freiburger Materialforschungszentrum, Albert-Ludwigs-Universitaet Freiburg, D-79104 Freiburg (Germany); Zuber, Kai [Institut fuer Kern- und Teilchenphysik, Technische Universitaet Dresden, 01069 Dresden (Germany); Loaiza, Pia [Laboratoire Souterrain de Modane, 73500 Modane (France); Shitov, Yuriy [Joint Institute for Nuclear Research, 141980 Dubna (Russian Federation)

    2011-05-15

    We discuss the possible use of a progressive detection technique based on pixel detectors for the study of double beta decay ({beta}{beta}) processes. A series of background measurements in various environments (surface laboratory, underground laboratory, with and without Pb shielding) was performed using the TimePix silicon hybrid pixel device. The pixel detector response to the natural background and intrinsic background properties measured by a low-background HPGe detector are presented.

  4. The ATLAS Detector Control System

    Science.gov (United States)

    Lantzsch, K.; Arfaoui, S.; Franz, S.; Gutzwiller, O.; Schlenker, S.; Tsarouchas, C. A.; Mindur, B.; Hartert, J.; Zimmermann, S.; Talyshev, A.; Oliveira Damazio, D.; Poblaguev, A.; Braun, H.; Hirschbuehl, D.; Kersten, S.; Martin, T.; Thompson, P. D.; Caforio, D.; Sbarra, C.; Hoffmann, D.; Nemecek, S.; Robichaud-Veronneau, A.; Wynne, B.; Banas, E.; Hajduk, Z.; Olszowska, J.; Stanecka, E.; Bindi, M.; Polini, A.; Deliyergiyev, M.; Mandic, I.; Ertel, E.; Marques Vinagre, F.; Ribeiro, G.; Santos, H. F.; Barillari, T.; Habring, J.; Huber, J.; Arabidze, G.; Boterenbrood, H.; Hart, R.; Iakovidis, G.; Karakostas, K.; Leontsinis, S.; Mountricha, E.; Ntekas, K.; Filimonov, V.; Khomutnikov, V.; Kovalenko, S.; Grassi, V.; Mitrevski, J.; Phillips, P.; Chekulaev, S.; D'Auria, S.; Nagai, K.; Tartarelli, G. F.; Aielli, G.; Marchese, F.; Lafarguette, P.; Brenner, R.

    2012-12-01

    The ATLAS experiment is one of the multi-purpose experiments at the Large Hadron Collider (LHC) at CERN, constructed to study elementary particle interactions in collisions of high-energy proton beams. Twelve different sub detectors as well as the common experimental infrastructure are controlled and monitored by the Detector Control System (DCS) using a highly distributed system of 140 server machines running the industrial SCADA product PVSS. Higher level control system layers allow for automatic control procedures, efficient error recognition and handling, manage the communication with external systems such as the LHC controls, and provide a synchronization mechanism with the ATLAS data acquisition system. Different databases are used to store the online parameters of the experiment, replicate a subset used for physics reconstruction, and store the configuration parameters of the systems. This contribution describes the computing architecture and software tools to handle this complex and highly interconnected control system.

  5. ATLAS Pixel Group - Photo Gallery from Irradiation

    CERN Multimedia

    2001-01-01

    Photos 1,2,3,4,5,6,7 - Photos taken before irradiation of Pixel Test Analog Chip and Pmbars (April 2000) Photos 8,9,10,11 - Irradiation of VDC chips (May 2000) Photos 12, 13 - Irradiation of Passive Components (June 2000) Photos 14,15, 16 - Irradiation of Marebo Chip (November 1999)

  6. Evaluation of the breakdown behaviour of ATLAS silicon pixel sensors after partial guard-ring removal

    International Nuclear Information System (INIS)

    To avoid geometrical inefficiencies in the ATLAS pixel detector, the concept of shingling is used up to now in the barrel section. For the upgrades of ATLAS, it is desired to avoid this as it increases the volume and material budget of the pixel layers and complicates the cooling. A direct planar edge-to-edge arrangement of pixel modules has not been possible in the past due to about 1100μm of inactive edge composed of approximately 600μm of guard rings and 500μm of safety margin. In this work, the safety margin and guard rings of ATLAS SingleChip sensors were cut at different positions using a standard diamond dicing saw and irradiated afterwards to explore the breakdown behaviour and the leakage current development. It is found that the inactive edge can be reduced to about 400μm of guard rings with almost no reduction in pre-irradiation testability and leakage current performance. This is in particular important for the insertable b-layer upgrade of ATLAS (IBL) where inactive edges of less than 450μm width are required.

  7. Evaluation of the breakdown behaviour of ATLAS silicon pixel sensors after partial guard-ring removal

    Science.gov (United States)

    Goessling, C.; Klingenberg, R.; Muenstermann, D.; Wittig, T.

    2010-12-01

    To avoid geometrical inefficiencies in the ATLAS pixel detector, the concept of shingling is used up to now in the barrel section. For the upgrades of ATLAS, it is desired to avoid this as it increases the volume and material budget of the pixel layers and complicates the cooling. A direct planar edge-to-edge arrangement of pixel modules has not been possible in the past due to about 1100 μm of inactive edge composed of approximately 600 μm of guard rings and 500 μm of safety margin. In this work, the safety margin and guard rings of ATLAS SingleChip sensors were cut at different positions using a standard diamond dicing saw and irradiated afterwards to explore the breakdown behaviour and the leakage current development. It is found that the inactive edge can be reduced to about 400 μm of guard rings with almost no reduction in pre-irradiation testability and leakage current performance. This is in particular important for the insertable b-layer upgrade of ATLAS (IBL) where inactive edges of less than 450 μm width are required.

  8. Evaluation of the breakdown behaviour of ATLAS silicon pixel sensors after partial guard-ring removal

    Energy Technology Data Exchange (ETDEWEB)

    Goessling, C.; Klingenberg, R. [Lehrstuhl fuer Experimentelle Physik IV, TU Dortmund, 44221 Dortmund (Germany); Muenstermann, D., E-mail: Daniel.Muenstermann@TU-Dortmund.d [Lehrstuhl fuer Experimentelle Physik IV, TU Dortmund, 44221 Dortmund (Germany); Wittig, T. [Lehrstuhl fuer Experimentelle Physik IV, TU Dortmund, 44221 Dortmund (Germany)

    2010-12-11

    To avoid geometrical inefficiencies in the ATLAS pixel detector, the concept of shingling is used up to now in the barrel section. For the upgrades of ATLAS, it is desired to avoid this as it increases the volume and material budget of the pixel layers and complicates the cooling. A direct planar edge-to-edge arrangement of pixel modules has not been possible in the past due to about 1100{mu}m of inactive edge composed of approximately 600{mu}m of guard rings and 500{mu}m of safety margin. In this work, the safety margin and guard rings of ATLAS SingleChip sensors were cut at different positions using a standard diamond dicing saw and irradiated afterwards to explore the breakdown behaviour and the leakage current development. It is found that the inactive edge can be reduced to about 400{mu}m of guard rings with almost no reduction in pre-irradiation testability and leakage current performance. This is in particular important for the insertable b-layer upgrade of ATLAS (IBL) where inactive edges of less than 450{mu}m width are required.

  9. A photon counting pixel detector for X-ray imaging

    International Nuclear Information System (INIS)

    Hybrid semiconductor pixel detector technology is presented in this thesis as an alternative to current imaging systems in medical imaging and synchrotron radiation applications. The technology has been developed from research performed in High Energy Physics, in particular, for the ATLAS experiment at the LHC, planned for 2005. This thesis describes work done by the author on behalf of the MEDIPIX project, a collaboration between 13 international institutions for the development of hybrid pixel detectors for non-HEP applications. Chapter 1 describes the motivation for these detectors, the origin of the technology, and the current state of the art in imaging devices. A description of the requirements of medical imaging on X-ray sensors is described, and the properties of film and CCDs are discussed. The work of the RD19 collaboration is introduced to show the evolution of these devices. Chapter 2 presents the basic semiconductor theory required to understand the operation of these detectors, and a section on image theory introduces the fundamental parameters which are necessary to define the quality of an imaging device. Chapter 3 presents measurements made by the author on a photon counting detector (PCD1) comprising a PCC1 (MEDIPIX1) readout chip bumpbonded to silicon and gallium arsenide pixel detectors. Tests on the seperate readout chip and the bump-bonded assembly are shown with comparisons between the performance of the two materials. Measurements of signal-to-noise ratio, detection efficiency and noise performance are presented, along with an MTF measurement made by the Freiburg group. The X-ray tube energy spectrum was calibrated by REGAM. The performance of the PCD in a powder diffraction experiment using a synchrotron radiation source is described in chapter 4. This chapter reports the first use of a true 2-D hybrid pixel detector in a synchrotron application, and a comparison with the existing scintillator based technology is made. The measurements made

  10. Test su fascio di prototipi del rivelatore a pixel per l'esperimento ATLAS

    CERN Document Server

    Matera, Andrea; Andreazza, A

    2005-01-01

    Silicon pixel detectors, developed to meet LHC requirements, were tested within the ATLAS collaboration in the H8 beam at CERN. Different sensor designs were studied using various versions of front end electronics developed during the R&D process. In this thesis a detailed experimental study of the overall performance of both irradiated and unirradiated detectors is presented, with special enphasis on efficiency, charge collection and spatial resolution. For the first time their dependence on timewalk is carefully investigated. Possible solutions to avoid spatial resolution deterioration due to timewalk are presented and discussed.

  11. Pre- and post-irradiation performance of FBK 3D silicon pixel detectors for CMS

    Energy Technology Data Exchange (ETDEWEB)

    Krzywda, A., E-mail: akrzywda@purdue.edu [Purdue University, Department of Physics and Astronomy, West Lafayette, IN 47907-2036 (United States); Alagoz, E.; Bubna, M. [Purdue University, Department of Physics and Astronomy, West Lafayette, IN 47907-2036 (United States); Obertino, M. [Università del Piemonte Orientale, Novara (Italy); INFN, Sezione di Torino, Torino (Italy); Solano, A. [Università di Torino, Torino (Italy); INFN, Sezione di Torino, Torino (Italy); Arndt, K. [Purdue University, Department of Physics and Astronomy, West Lafayette, IN 47907-2036 (United States); Uplegger, L. [Fermi National Accelerator Laboratory, Batavia, IL 60510-5011 (United States); Betta, G.F. Dalla [TIFPA INFN and Dipartimento di Ingegneria Industriale, Università di Trento, Via Sommarive 9, I-38123 Povo di Trento, TN (Italy); Boscardin, M. [Centro per Materiali e i Microsistemi Fondazione Bruno Kessler (FBK), Trento, Via Sommarive 18, I-38123 Povo di Trento, TN (Italy); Ngadiuba, J. [Università di Milano-Bicocca, Milan (Italy); Rivera, R. [Fermi National Accelerator Laboratory, Batavia, IL 60510-5011 (United States); Menasce, D.; Moroni, L.; Terzo, S. [Università di Milano-Bicocca, Milan (Italy); Bortoletto, D. [Purdue University, Department of Physics and Astronomy, West Lafayette, IN 47907-2036 (United States); Prosser, A.; Adreson, J.; Kwan, S. [Fermi National Accelerator Laboratory, Batavia, IL 60510-5011 (United States); Osipenkov, I. [Texas A and M University, Department of Physics, College Station, TX 77843 (United States); Bolla, G. [Purdue University, Department of Physics and Astronomy, West Lafayette, IN 47907-2036 (United States); and others

    2014-11-01

    In preparation for the tenfold luminosity upgrade of the Large Hadron Collider (the HL-LHC) around 2020, three-dimensional (3D) silicon pixel sensors are being developed as a radiation-hard candidate to replace the planar ones currently being used in the CMS pixel detector. This study examines an early batch of FBK sensors (named ATLAS08) of three 3D pixel geometries: 1E, 2E, and 4E, which respectively contain one, two, and four readout electrodes for each pixel, passing completely through the bulk. We present electrical characteristics and beam test performance results for each detector before and after irradiation. The maximum fluence applied is 3.5×10{sup 15} n {sub eq}/cm{sup 2}.

  12. Slim edge studies, design and quality control of planar ATLAS IBL pixel sensors

    International Nuclear Information System (INIS)

    One of the four large experiments at the LHC at CERN is the ATLAS detector, a multi purpose detector. Its pixel detector, composed of three layers, is the innermost part of the tracker. As it is closest to the interaction point, it represents a basic part of the track reconstruction. Besides the requested high resolution one main requirement is the radiation hardness. In the coming years the radiation damage will cause deteriorations of the detector performance. With the planned increase of the luminosity, especially after the upgrade to the High Luminosity LHC, this radiation damage will be even intensified. This circumstance necessitates a new pixel detector featuring improved radiation hard sensors and read-out chips. The present shutdown of the LHC is already utilized to insert an additional b-layer (IBL) into the existing ATLAS pixel detector. The current n-in-n pixel sensor design had to be adapted to the new read-out chip and the module specifications. The new stave geometry requests a reduction of the inactive sensor edge. In a prototype wafer production all modifications have been implemented. The sensor quality control was supervised which led to the decision of the final sensor thickness. In order to evaluate the performance of the sensor chip assemblies with an innovative slim edge design, they have been operated in test beam setups before and after irradiation. Furthermore, the quality control of the planar IBL sensor wafer production was supervised from the stage of wafer delivery to that before the flip chip process to ensure a sufficient amount of functional sensors for the module production.

  13. Slim edge studies, design and quality control of planar ATLAS IBL pixel sensors

    Energy Technology Data Exchange (ETDEWEB)

    Wittig, Tobias

    2013-05-08

    One of the four large experiments at the LHC at CERN is the ATLAS detector, a multi purpose detector. Its pixel detector, composed of three layers, is the innermost part of the tracker. As it is closest to the interaction point, it represents a basic part of the track reconstruction. Besides the requested high resolution one main requirement is the radiation hardness. In the coming years the radiation damage will cause deteriorations of the detector performance. With the planned increase of the luminosity, especially after the upgrade to the High Luminosity LHC, this radiation damage will be even intensified. This circumstance necessitates a new pixel detector featuring improved radiation hard sensors and read-out chips. The present shutdown of the LHC is already utilized to insert an additional b-layer (IBL) into the existing ATLAS pixel detector. The current n-in-n pixel sensor design had to be adapted to the new read-out chip and the module specifications. The new stave geometry requests a reduction of the inactive sensor edge. In a prototype wafer production all modifications have been implemented. The sensor quality control was supervised which led to the decision of the final sensor thickness. In order to evaluate the performance of the sensor chip assemblies with an innovative slim edge design, they have been operated in test beam setups before and after irradiation. Furthermore, the quality control of the planar IBL sensor wafer production was supervised from the stage of wafer delivery to that before the flip chip process to ensure a sufficient amount of functional sensors for the module production.

  14. The ATLAS Diamond Beam Monitor : Luminosity Detector on the LHC

    CERN Document Server

    Schaefer, Douglas; The ATLAS collaboration

    2015-01-01

    After the first three years of the LHC running the ATLAS experiment extracted it's pixel detector system to refurbish and re-position the optical readout drivers and install a new barrel layer of pixels. The experiment has also taken advantage of this access to also install a set of beam monitoring telescopes with pixel sensors, four each in the forward and backward regions. These telescopes were assembled based on chemical vapour deposited (CVD) diamond sensors to survive in this high radiation environment without needing extensive cooling. This talk will describe the lessons learned in construction and commissioning of the ATLAS x Diamond Beam Monitor (DBM). We will show results from the construction quality assurance tests, commissioning performance, including results from cosmic ray running in early 2015 and also expected first results from LHC run 2 collisions.

  15. The ATLAS Diamond Beam Monitor: Luminosity detector at the LHC

    Science.gov (United States)

    Schaefer, D. M.

    2016-07-01

    After the first three years of the LHC running, the ATLAS experiment extracted its pixel detector system to refurbish and re-position the optical readout drivers and install a new barrel layer of pixels. The experiment has also taken advantage of this access to install a set of beam monitoring telescopes with pixel sensors, four each in the forward and backward regions. These telescopes are based on chemical vapor deposited (CVD) diamond sensors to survive in this high radiation environment without needing extensive cooling. This paper describes the lessons learned in construction and commissioning of the ATLAS Diamond Beam Monitor (DBM). We show results from the construction quality assurance tests and commissioning performance, including results from cosmic ray running in early 2015.

  16. The ATLAS Detector Safety System

    CERN Multimedia

    Helfried Burckhart; Kathy Pommes; Heidi Sandaker

    The ATLAS Detector Safety System (DSS) has the mandate to put the detector in a safe state in case an abnormal situation arises which could be potentially dangerous for the detector. It covers the CERN alarm severity levels 1 and 2, which address serious risks for the equipment. The highest level 3, which also includes danger for persons, is the responsibility of the CERN-wide system CSAM, which always triggers an intervention by the CERN fire brigade. DSS works independently from and hence complements the Detector Control System, which is the tool to operate the experiment. The DSS is organized in a Front- End (FE), which fulfills autonomously the safety functions and a Back-End (BE) for interaction and configuration. The overall layout is shown in the picture below. ATLAS DSS configuration The FE implementation is based on a redundant Programmable Logical Crate (PLC) system which is used also in industry for such safety applications. Each of the two PLCs alone, one located underground and one at the s...

  17. Study of FPGA and GPU based pixel calibration for ATLAS IBL

    CERN Document Server

    Dopke, J; The ATLAS collaboration; Flick, T; Gabrielli, A; Grosse-Knetter, J; Krieger, N; Kugel, A; Polini, A; Schroer, N

    2010-01-01

    The insertable B-layer (IBL) is a new stage of the ATLAS pixel detector to be installed around 2014. 12 million pixel are attached to new FE-I4 readout ASICs, each controlling 26680 pixel. Compared to the existing FE-I3 based detector the new system features higher readout speed of 160Mbit/s per ASIC and simplified control. For calibration defined charges are applied to all pixels and the resulting time-over-threshold values are evaluated. In the present system multiple sets of two custom VME cards which employ a combination of FPGA and DSP technology are used for I/O interfacing, formatting and processing. The execution time of 51s to perform a threshold scan on a FE-I3 module of 46080 pixel is composed of 8s control, 29s transfer, 7.5s histogramming and 7s analysis. Extrapolating to FE-I4 the times per module of 53760 pixels are 12ms, 5.8s, 9.4s and 8.3s, a total of 23.5s. We present a proposal for a novel approach to the dominant tasks for FE-I4: histogramming and ananlysis. An FPGA-based histogramming uni...

  18. The ATLAS Inner Detector commissioning and calibration

    CERN Document Server

    Aad, Georges; Abdallah, Jalal; Abdelalim, Ahmed Ali; Abdesselam, Abdelouahab; Abdinov, Ovsat; Abi, Babak; Abolins, Maris; Abramowicz, Halina; Abreu, Henso; Acharya, Bobby Samir; Adams, David; Addy, Tetteh; Adelman, Jahred; Adorisio, Cristina; Adragna, Paolo; Adye, Tim; Aefsky, Scott; Aguilar-Saavedra, Juan Antonio; Aharrouche, Mohamed; Ahlen, Steven; Ahles, Florian; Ahmad, Ashfaq; Ahsan, Mahsana; Aielli, Giulio; Akdogan, Taylan; Åkesson, Torsten Paul Ake; Akimoto, Ginga; Akimov , Andrei; Aktas, Adil; Alam, Mohammad; Alam, Muhammad Aftab; Albrand, Solveig; Aleksa, Martin; Aleksandrov, Igor; Alexa, Calin; Alexander, Gideon; Alexandre, Gauthier; Alexopoulos, Theodoros; Alhroob, Muhammad; Aliev, Malik; Alimonti, Gianluca; Alison, John; Aliyev, Magsud; Allport, Phillip; Allwood-Spiers, Sarah; Almond, John; Aloisio, Alberto; Alon, Raz; Alonso, Alejandro; Alviggi, Mariagrazia; Amako, Katsuya; Amelung, Christoph; Amorim, Antonio; Amorós, Gabriel; Amram, Nir; Anastopoulos, Christos; Andeen, Timothy; Anders, Christoph Falk; Anderson, Kelby; Andreazza, Attilio; Andrei, George Victor; Anduaga, Xabier; Angerami, Aaron; Anghinolfi, Francis; Anjos, Nuno; Annovi, Alberto; Antonaki, Ariadni; Antonelli, Mario; Antonelli, Stefano; Antos, Jaroslav; Antunovic, Bijana; Anulli, Fabio; Aoun, Sahar; Arabidze, Giorgi; Aracena, Ignacio; Arai, Yasuo; Arce, Ayana; Archambault, John-Paul; Arfaoui, Samir; Arguin, Jean-Francois; Argyropoulos, Theodoros; Arik, Metin; Armbruster, Aaron James; Arnaez, Olivier; Arnault, Christian; Artamonov, Andrei; Arutinov, David; Asai, Makoto; Asai, Shoji; Silva, José; Asfandiyarov, Ruslan; Ask, Stefan; Åsman, Barbro; Asner, David; Asquith, Lily; Assamagan, Ketevi; Astvatsatourov, Anatoli; Atoian, Grigor; Auerbach, Benjamin; Augsten, Kamil; Aurousseau, Mathieu; Austin, Nicholas; Avolio, Giuseppe; Avramidou, Rachel Maria; Ay, Cano; Azuelos, Georges; Azuma, Yuya; Baak, Max; Bach, Andre; Bachacou, Henri; Bachas, Konstantinos; Backes, Moritz; Badescu, Elisabeta; Bagnaia, Paolo; Bai, Yu; Bain, Travis; Baines, John; Baker, Mark; Baker, Oliver Keith; Baker, Sarah; Baltasar Dos Santos Pedrosa, Fernando; Banas, Elzbieta; Banerjee, Piyali; Banerjee, Swagato; Banfi, Danilo; Bangert, Andrea Michelle; Bansal, Vikas; Baranov, Sergei; Barashkou, Andrei; Barber, Tom; Barberio, Elisabetta Luigia; Barberis, Dario; Barbero, Marlon; Bardin, Dmitri; Barillari, Teresa; Barisonzi, Marcello; Barklow, Timothy; Barlow, Nick; Barnett, Bruce; Barnett, Michael; Baroncelli, Antonio; Barr, Alan; Barreiro, Fernando; Barreiro Guimarães da Costa, João; Barrillon, Pierre; Bartoldus, Rainer; Bartsch, Detlef; Bates, Richard; Batkova, Lucia; Batley, Richard; Battaglia, Andreas; Battistin, Michele; Bauer, Florian; Bawa, Harinder Singh; Bazalova, Magdalena; Beare, Brian; Beau, Tristan; Beauchemin, Pierre-Hugues; Beccherle, Roberto; Bechtle, Philip; Beck, Graham; Beck, Hans Peter; Beckingham, Matthew; Becks, Karl-Heinz; Beddall, Ayda; Beddall, Andrew; Bednyakov, Vadim; Bee, Christopher; Begel, Michael; Behar Harpaz, Silvia; Behera, Prafulla; Beimforde, Michael; Belanger-Champagne, Camille; Bell, Paul; Bell, William; Bella, Gideon; Bellagamba, Lorenzo; Bellina, Francesco; Bellomo, Massimiliano; Belloni, Alberto; Belotskiy, Konstantin; Beltramello, Olga; Ben Ami, Sagi; Benary, Odette; Benchekroun, Driss; Bendel, Markus; Benedict, Brian Hugues; Benekos, Nektarios; Benhammou, Yan; Benjamin, Douglas; Benoit, Mathieu; Bensinger, James; Benslama, Kamal; Bentvelsen, Stan; Beretta, Matteo; Berge, David; Bergeaas Kuutmann, Elin; Berger, Nicolas; Berghaus, Frank; Berglund, Elina; Beringer, Jürg; Bernabéu , José; Bernat, Pauline; Bernhard, Ralf; Bernius, Catrin; Berry, Tracey; Bertin, Antonio; Besana, Maria Ilaria; Besson, Nathalie; Bethke, Siegfried; Bianchi, Riccardo-Maria; Bianco, Michele; Biebel, Otmar; Biesiada, Jed; Biglietti, Michela; Bilokon, Halina; Bindi, Marcello; Bingul, Ahmet; Bini, Cesare; Biscarat, Catherine; Bitenc, Urban; Black, Kevin; Blair, Robert; Blanchard, Jean-Baptiste; Blanchot, Georges; Blocker, Craig; Blondel, Alain; Blum, Walter; Blumenschein, Ulrike; Bobbink, Gerjan; Bocci, Andrea; Boehler, Michael; Boek, Jennifer; Boelaert, Nele; Böser, Sebastian; Bogaerts, Joannes Andreas; Bogouch, Andrei; Bohm, Christian; Bohm, Jan; Boisvert, Veronique; Bold, Tomasz; Boldea, Venera; Bondarenko, Valery; Bondioli, Mario; Boonekamp, Maarten; Bordoni, Stefania; Borer, Claudia; Borisov, Anatoly; Borissov, Guennadi; Borjanovic, Iris; Borroni, Sara; Bos, Kors; Boscherini, Davide; Bosman, Martine; Boterenbrood, Hendrik; Bouchami, Jihene; Boudreau, Joseph; Bouhova-Thacker, Evelina Vassileva; Boulahouache, Chaouki; Bourdarios, Claire; Boveia, Antonio; Boyd, James; Boyko, Igor; Bozovic-Jelisavcic, Ivanka; Bracinik, Juraj; Braem, André; Branchini, Paolo; Brandt, Andrew; Brandt, Gerhard; Brandt, Oleg; Bratzler, Uwe; Brau, Benjamin; Brau, James; Braun, Helmut; Brelier, Bertrand; Bremer, Johan; Brenner, Richard; Bressler, Shikma; Britton, Dave; Brochu, Frederic; Brock, Ian; Brock, Raymond; Brodet, Eyal; Bromberg, Carl; Brooijmans, Gustaaf; Brooks, William; Brown, Gareth; Bruckman de Renstrom, Pawel; Bruncko, Dusan; Bruneliere, Renaud; Brunet, Sylvie; Bruni, Alessia; Bruni, Graziano; Bruschi, Marco; Bucci, Francesca; Buchanan, James; Buchholz, Peter; Buckley, Andrew; Budagov, Ioulian; Budick, Burton; Büscher, Volker; Bugge, Lars; Bulekov, Oleg; Bunse, Moritz; Buran, Torleiv; Burckhart, Helfried; Burdin, Sergey; Burgess, Thomas; Burke, Stephen; Busato, Emmanuel; Bussey, Peter; Buszello, Claus-Peter; Butin, Françcois; Butler, Bart; Butler, John; Buttar, Craig; Butterworth, Jonathan; Byatt, Tom; Caballero, Jose; Cabrera Urbán, Susana; Caforio, Davide; Cakir, Orhan; Calafiura, Paolo; Calderini, Giovanni; Calfayan, Philippe; Calkins, Robert; Caloba, Luiz; Calvet, David; Camarri, Paolo; Cameron, David; Campana, Simone; Campanelli, Mario; Canale, Vincenzo; Canelli, Florencia; Canepa, Anadi; Cantero, Josu; Capasso, Luciano; Capeans Garrido, Maria Del Mar; Caprini, Irinel; Caprini, Mihai; Capua, Marcella; Caputo, Regina; Caramarcu, Costin; Cardarelli, Roberto; Carli, Tancredi; Carlino, Gianpaolo; Carminati, Leonardo; Caron, Bryan; Caron, Sascha; Carrillo Montoya, German D.; Carron Montero, Sebastian; Carter, Antony; Carter, Janet; Carvalho, João; Casadei, Diego; Casado, Maria Pilar; Cascella, Michele; Castaneda Hernandez, Alfredo Martin; Castaneda-Miranda, Elizabeth; Castillo Gimenez, Victoria; Castro, Nuno Filipe; Cataldi, Gabriella; Catinaccio, Andrea; Catmore, James; Cattai, Ariella; Cattani, Giordano; Caughron, Seth; Cavalleri, Pietro; Cavalli, Donatella; Cavalli-Sforza, Matteo; Cavasinni, Vincenzo; Ceradini, Filippo; Cerqueira, Augusto Santiago; Cerri, Alessandro; Cerrito, Lucio; Cerutti, Fabio; Cetin, Serkant Ali; Chafaq, Aziz; Chakraborty, Dhiman; Chan, Kevin; Chapman, John Derek; Chapman, John Wehrley; Chareyre, Eve; Charlton, Dave; Chavda, Vikash; Cheatham, Susan; Chekanov, Sergei; Chekulaev, Sergey; Chelkov, Gueorgui; Chen, Hucheng; Chen, Shenjian; Chen, Xin; Cheplakov, Alexander; Chepurnov, Vladimir; Cherkaoui El Moursli, Rajaa; Tcherniatine, Valeri; Chesneanu, Daniela; Cheu, Elliott; Cheung, Sing-Leung; Chevalier, Laurent; Chevallier, Florent; Chiefari, Giovanni; Chikovani, Leila; Childers, John Taylor; Chilingarov, Alexandre; Chiodini, Gabriele; Chizhov, Mihail; Choudalakis, Georgios; Chouridou, Sofia; Christidi, Illectra-Athanasia; Christov, Asen; Chromek-Burckhart, Doris; Chu, Ming-Lee; Chudoba, Jiri; Ciapetti, Guido; Ciftci, Abbas Kenan; Ciftci, Rena; Cinca, Diane; Cindro, Vladimir; Ciobotaru, Matei Dan; Ciocca, Claudia; Ciocio, Alessandra; Cirilli, Manuela; Clark, Allan G.; Clark, Philip James; Cleland, Bill; Clemens, Jean-Claude; Clement, Benoit; Clement, Christophe; Coadou, Yann; Cobal, Marina; Coccaro, Andrea; Cochran, James H.; Coggeshall, James; Cogneras, Eric; Colijn, Auke-Pieter; Collard, Caroline; Collins, Neil; Collins-Tooth, Christopher; Collot, Johann; Colon, German; Conde Muiño, Patricia; Coniavitis, Elias; Conidi, Maria Chiara; Consonni, Michele; Constantinescu, Serban; Conta, Claudio; Conventi, Francesco; Cooke, Mark; Cooper, Ben; Cooper-Sarkar, Amanda; Cooper-Smith, Neil; Copic, Katherine; Cornelissen, Thijs; Corradi, Massimo; Corriveau, Francois; Corso-Radu, Alina; Cortes-Gonzalez, Arely; Cortiana, Giorgio; Costa, Giuseppe; Costa, María José; Costanzo, Davide; Costin, Tudor; Côté, David; Coura Torres, Rodrigo; Courneyea, Lorraine; Cowan, Glen; Cowden, Christopher; Cox, Brian; Cranmer, Kyle; Cranshaw, Jack; Cristinziani, Markus; Crosetti, Giovanni; Crupi, Roberto; Crépé-Renaudin, Sabine; Cuenca Almenar, Cristóbal; Cuhadar Donszelmann, Tulay; Curatolo, Maria; Curtis, Chris; Cwetanski, Peter; Czyczula, Zofia; D'Auria, Saverio; D'Onofrio, Monica; D'Orazio, Alessia; Da Via, Cinzia; Dabrowski, Wladyslaw; Dai, Tiesheng; Dallapiccola, Carlo; Dallison, Steve; Daly, Colin; Dam, Mogens; Danielsson, Hans Olof; Dannheim, Dominik; Dao, Valerio; Darbo, Giovanni; Darlea, Georgiana Lavinia; Davey, Will; Davidek, Tomas; Davidson, Nadia; Davidson, Ruth; Davies, Merlin; Davison, Adam; Dawson, Ian; Daya, Rozmin; De, Kaushik; de Asmundis, Riccardo; De Castro, Stefano; De Castro Faria Salgado, Pedro; De Cecco, Sandro; de Graat, Julien; De Groot, Nicolo; de Jong, Paul; De Mora, Lee; De Oliveira Branco, Miguel; De Pedis, Daniele; De Salvo, Alessandro; De Sanctis, Umberto; De Santo, Antonella; De Vivie De Regie, Jean-Baptiste; Dean, Simon; Dedovich, Dmitri; Degenhardt, James; Dehchar, Mohamed; Del Papa, Carlo; Del Peso, Jose; Del Prete, Tarcisio; Dell'Acqua, Andrea; Dell'Asta, Lidia; Della Pietra, Massimo; della Volpe, Domenico; Delmastro, Marco; Delsart, Pierre-Antoine; Deluca, Carolina; Demers, Sarah; Demichev, Mikhail; Demirkoz, Bilge; Deng, Jianrong; Deng, Wensheng; Denisov, Sergey; Derkaoui, Jamal Eddine; Derue, Frederic; Dervan, Paul; Desch, Klaus Kurt; Deviveiros, Pier-Olivier; Dewhurst, Alastair; DeWilde, Burton; Dhaliwal, Saminder; Dhullipudi, Ramasudhakar; Di Ciaccio, Anna; Di Ciaccio, Lucia; Di Girolamo, Alessandro; Di Girolamo, Beniamino; Di Luise, Silvestro; Di Mattia, Alessandro; Di Nardo, Roberto; Di Simone, Andrea; Di Sipio, Riccardo; Diaz, Marco Aurelio; Diblen, Faruk; Diehl, Edward; Dietrich, Janet; Dietzsch, Thorsten; Diglio, Sara; Dindar Yagci, Kamile; Dingfelder, Jochen; Dionisi, Carlo; Dita, Petre; Dita, Sanda; Dittus, Fridolin; Djama, Fares; Djilkibaev, Rashid; Djobava, Tamar; do Vale, Maria Aline Barros; Do Valle Wemans, André; Doan, Thi Kieu Oanh; Dobos, Daniel; Dobson, Ellie; Dobson, Marc; Doglioni, Caterina; Doherty, Tom; Dolejsi, Jiri; Dolenc, Irena; Dolezal, Zdenek; Dolgoshein, Boris; Dohmae, Takeshi; Donega, Mauro; Donini, Julien; Dopke, Jens; Doria, Alessandra; Dos Anjos, Andre; Dotti, Andrea; Dova, Maria-Teresa; Doxiadis, Alexander; Doyle, Tony; Drasal, Zbynek; Dris, Manolis; Dubbert, Jörg; Duchovni, Ehud; Duckeck, Guenter; Dudarev, Alexey; Dudziak, Fanny; Dührssen , Michael; Duflot, Laurent; Dufour, Marc-Andre; Dunford, Monica; Duran Yildiz, Hatice; Duxfield, Robert; Dwuznik, Michal; Düren, Michael; Ebenstein, William; Ebke, Johannes; Eckweiler, Sebastian; Edmonds, Keith; Edwards, Clive; Egorov, Kirill; Ehrenfeld, Wolfgang; Ehrich, Thies; Eifert, Till; Eigen, Gerald; Einsweiler, Kevin; Eisenhandler, Eric; Ekelof, Tord; El Kacimi, Mohamed; Ellert, Mattias; Elles, Sabine; Ellinghaus, Frank; Ellis, Katherine; Ellis, Nicolas; Elmsheuser, Johannes; Elsing, Markus; Emeliyanov, Dmitry; Engelmann, Roderich; Engl, Albert; Epp, Brigitte; Eppig, Andrew; Erdmann, Johannes; Ereditato, Antonio; Eriksson, Daniel; Ermoline, Iouri; Ernst, Jesse; Ernst, Michael; Ernwein, Jean; Errede, Deborah; Errede, Steven; Ertel, Eugen; Escalier, Marc; Escobar, Carlos; Espinal Curull, Xavier; Esposito, Bellisario; Etienvre, Anne-Isabelle; Etzion, Erez; Evans, Hal; Fabbri, Laura; Fabre, Caroline; Facius, Katrine; Fakhrutdinov, Rinat; Falciano, Speranza; Fang, Yaquan; Fanti, Marcello; Farbin, Amir; Farilla, Addolorata; Farley, Jason; Farooque, Trisha; Farrington, Sinead; Farthouat, Philippe; Fassnacht, Patrick; Fassouliotis, Dimitrios; Fatholahzadeh, Baharak; Fayard, Louis; Fayette, Florent; Febbraro, Renato; Federic, Pavol; Fedin, Oleg; Fedorko, Woiciech; Feligioni, Lorenzo; Felzmann, Ulrich; Feng, Cunfeng; Feng, Eric; Fenyuk, Alexander; Ferencei, Jozef; Ferland, Jonathan; Fernandes, Bruno; Fernando, Waruna; Ferrag, Samir; Ferrando, James; Ferrara, Valentina; Ferrari, Arnaud; Ferrari, Pamela; Ferrari, Roberto; Ferrer, Antonio; Ferrer, Maria Lorenza; Ferrere, Didier; Ferretti, Claudio; Fiascaris, Maria; Fiedler, Frank; Filipčič, Andrej; Filippas, Anastasios; Filthaut, Frank; Fincke-Keeler, Margret; Fiolhais, Miguel; Fiorini, Luca; Firan, Ana; Fischer, Gordon; Fisher, Matthew; Flechl, Martin; Fleck, Ivor; Fleckner, Johanna; Fleischmann, Philipp; Fleischmann, Sebastian; Flick, Tobias; Flores Castillo, Luis; Flowerdew, Michael; Fonseca Martin, Teresa; Formica, Andrea; Forti, Alessandra; Fortin, Dominique; Fournier, Daniel; Fowler, Andrew; Fowler, Ken; Fox, Harald; Francavilla, Paolo; Franchino, Silvia; Francis, David; Franklin, Melissa; Franz, Sebastien; Fraternali, Marco; Fratina, Sasa; Freestone, Julian; French, Sky; Froeschl, Robert; Froidevaux, Daniel; Frost, James; Fukunaga, Chikara; Fullana Torregrosa, Esteban; Fuster, Juan; Gabaldon, Carolina; Gabizon, Ofir; Gadfort, Thomas; Gadomski, Szymon; Gagliardi, Guido; Gagnon, Pauline; Galea, Cristina; Gallas, Elizabeth; Gallo, Valentina Santina; Gallop, Bruce; Gallus, Petr; Galyaev, Eugene; Gan, K K; Gao, Yongsheng; Gaponenko, Andrei; Garcia-Sciveres, Maurice; García, Carmen; García Navarro, José Enrique; Gardner, Robert; Garelli, Nicoletta; Garitaonandia, Hegoi; Garonne, Vincent; Gatti, Claudio; Gaudio, Gabriella; Gautard, Valerie; Gauzzi, Paolo; Gavrilenko, Igor; Gay, Colin; Gaycken, Goetz; Gazis, Evangelos; Ge, Peng; Gee, Norman; Geich-Gimbel, Christoph; Gellerstedt, Karl; Gemme, Claudia; Genest, Marie-Hélène; Gentile, Simonetta; Georgatos, Fotios; George, Simon; Gershon, Avi; Ghazlane, Hamid; Ghodbane, Nabil; Giacobbe, Benedetto; Giagu, Stefano; Giakoumopoulou, Victoria; Giangiobbe, Vincent; Gianotti, Fabiola; Gibbard, Bruce; Gibson, Adam; Gibson, Stephen; Gilbert, Laura; Gilchriese, Murdock; Gilewsky, Valentin; Gingrich, Douglas; Ginzburg, Jonatan; Giokaris, Nikos; Giordani, MarioPaolo; Giordano, Raffaele; Giorgi, Francesco Michelangelo; Giovannini, Paola; Giraud, Pierre-Francois; Girtler, Peter; Giugni, Danilo; Giusti, Paolo; Gjelsten, Børge Kile; Gladilin, Leonid; Glasman, Claudia; Glazov, Alexandre; Glitza, Karl-Walter; Glonti, George; Godfrey, Jennifer; Godlewski, Jan; Goebel, Martin; Göpfert, Thomas; Goeringer, Christian; Gössling, Claus; Göttfert, Tobias; Goggi, Virginio; Goldfarb, Steven; Goldin, Daniel; Golling, Tobias; Gomes, Agostinho; Gomez Fajardo, Luz Stella; Gonçcalo, Ricardo; Gonella, Laura; Gong, Chenwei; González de la Hoz, Santiago; Gonzalez Silva, Laura; Gonzalez-Sevilla, Sergio; Goodson, Jeremiah Jet; Goossens, Luc; Gordon, Howard; Gorelov, Igor; Gorfine, Grant; Gorini, Benedetto; Gorini, Edoardo; Gorišek, Andrej; Gornicki, Edward; Gosdzik, Bjoern; Gosselink, Martijn; Gostkin, Mikhail Ivanovitch; Gough Eschrich, Ivo; Gouighri, Mohamed; Goujdami, Driss; Goulette, Marc Phillippe; Goussiou, Anna; Goy, Corinne; Grabowska-Bold, Iwona; Grafström, Per; Grahn, Karl-Johan; Grancagnolo, Sergio; Grassi, Valerio; Gratchev, Vadim; Grau, Nathan; Gray, Heather; Gray, Julia Ann; Graziani, Enrico; Green, Barry; Greenshaw, Timothy; Greenwood, Zeno Dixon; Gregor, Ingrid-Maria; Grenier, Philippe; Griesmayer, Erich; Griffiths, Justin; Grigalashvili, Nugzar; Grillo, Alexander; Grimm, Kathryn; Grinstein, Sebastian; Grishkevich, Yaroslav; Groh, Manfred; Groll, Marius; Gross, Eilam; Grosse-Knetter, Joern; Groth-Jensen, Jacob; Grybel, Kai; Guicheney, Christophe; Guida, Angelo; Guillemin, Thibault; Guler, Hulya; Gunther, Jaroslav; Guo, Bin; Gusakov, Yury; Gutierrez, Andrea; Gutierrez, Phillip; Guttman, Nir; Gutzwiller, Olivier; Guyot, Claude; Gwenlan, Claire; Gwilliam, Carl; Haas, Andy; Haas, Stefan; Haber, Carl; Hadavand, Haleh Khani; Hadley, David; Haefner, Petra; Hajduk, Zbigniew; Hakobyan, Hrachya; Haller, Johannes; Hamacher, Klaus; Hamilton, Andrew; Hamilton, Samuel; Han, Liang; Hanagaki, Kazunori; Hance, Michael; Handel, Carsten; Hanke, Paul; Hansen, Jørgen Beck; Hansen, Jorn Dines; Hansen, John Renner; Hansen, Peter Henrik; Hansl-Kozanecka, Traudl; Hansson, Per; Hara, Kazuhiko; Hare, Gabriel; Harenberg, Torsten; Harrington, Robert; Harris, Orin; Harrison, Karl; Hartert, Jochen; Hartjes, Fred; Harvey, Alex; Hasegawa, Satoshi; Hasegawa, Yoji; Hassani, Samira; Haug, Sigve; Hauschild, Michael; Hauser, Reiner; Havranek, Miroslav; Hawkes, Christopher; Hawkings, Richard John; Hayakawa, Takashi; Hayward, Helen; Haywood, Stephen; Head, Simon; Hedberg, Vincent; Heelan, Louise; Heim, Sarah; Heinemann, Beate; Heisterkamp, Simon; Helary, Louis; Heller, Mathieu; Hellman, Sten; Helsens, Clement; Hemperek, Tomasz; Henderson, Robert; Henke, Michael; Henrichs, Anna; Henriques Correia, Ana Maria; Henrot-Versille, Sophie; Hensel, Carsten; Henß, Tobias; Hernández Jiménez, Yesenia; Hershenhorn, Alon David; Herten, Gregor; Hertenberger, Ralf; Hervas, Luis; Hessey, Nigel; Higón-Rodriguez, Emilio; Hill, John; Hiller, Karl Heinz; Hillert, Sonja; Hillier, Stephen; Hinchliffe, Ian; Hines, Elizabeth; Hirose, Minoru; Hirsch, Florian; Hirschbuehl, Dominic; Hobbs, John; Hod, Noam; Hodgkinson, Mark; Hodgson, Paul; Hoecker, Andreas; Hoeferkamp, Martin; Hoffman, Julia; Hoffmann, Dirk; Hohlfeld, Marc; Holy, Tomas; Holzbauer, Jenny; Homma, Yasuhiro; Horazdovsky, Tomas; Hori, Takuya; Horn, Claus; Horner, Stephan; Hostachy, Jean-Yves; Hou, Suen; Hoummada, Abdeslam; Howe, Travis; Hrivnac, Julius; Hryn'ova, Tetiana; Hsu, Pai-hsien Jennifer; Hsu, Shih-Chieh; Huang, Guang Shun; Hubacek, Zdenek; Hubaut, Fabrice; Huegging, Fabian; Huffman, Todd Brian; Hughes, Emlyn; Hughes, Gareth; Hurwitz, Martina; Husemann, Ulrich; Huseynov, Nazim; Huston, Joey; Huth, John; Iacobucci, Giuseppe; Iakovidis, Georgios; Ibragimov, Iskander; Iconomidou-Fayard, Lydia; Idarraga, John; Iengo, Paolo; Igonkina, Olga; Ikegami, Yoichi; Ikeno, Masahiro; Ilchenko, Yuri; Iliadis, Dimitrios; Ince, Tayfun; Ioannou, Pavlos; Iodice, Mauro; Irles Quiles, Adrian; Ishikawa, Akimasa; Ishino, Masaya; Ishmukhametov, Renat; Isobe, Tadaaki; Issever, Cigdem; Istin, Serhat; Itoh, Yuki; Ivashin, Anton; Iwanski, Wieslaw; Iwasaki, Hiroyuki; Izen, Joseph; Izzo, Vincenzo; Jackson, Brett; Jackson, John; Jackson, Paul; Jaekel, Martin; Jain, Vivek; Jakobs, Karl; Jakobsen, Sune; Jakubek, Jan; Jana, Dilip; Jankowski, Ernest; Jansen, Eric; Jantsch, Andreas; Janus, Michel; Jarlskog, Göran; Jeanty, Laura; Jen-La Plante, Imai; Jenni, Peter; Jež, Pavel; Jézéquel, Stéphane; Ji, Weina; Jia, Jiangyong; Jiang, Yi; Jimenez Belenguer, Marcos; Jin, Shan; Jinnouchi, Osamu; Joffe, David; Johansen, Marianne; Johansson, Erik; Johansson, Per; Johnert, Sebastian; Johns, Kenneth; Jon-And, Kerstin; Jones, Graham; Jones, Roger; Jones, Tim; Jorge, Pedro; Joseph, John; Juranek, Vojtech; Jussel, Patrick; Kabachenko, Vasily; Kaci, Mohammed; Kaczmarska, Anna; Kado, Marumi; Kagan, Harris; Kagan, Michael; Kaiser, Steffen; Kajomovitz, Enrique; Kalinin, Sergey; Kalinovskaya, Lidia; Kama, Sami; Kanaya, Naoko; Kaneda, Michiru; Kantserov, Vadim; Kanzaki, Junichi; Kaplan, Benjamin; Kapliy, Anton; Kaplon, Jan; Kar, Deepak; Karagounis, Michael; Karagoz, Muge; Karnevskiy, Mikhail; Kartvelishvili, Vakhtang; Karyukhin, Andrey; Kashif, Lashkar; Kasmi, Azzedine; Kass, Richard; Kastanas, Alex; Kastoryano, Michael; Kataoka, Mayuko; Kataoka, Yousuke; Katsoufis, Elias; Katzy, Judith; Kaushik, Venkatesh; Kawagoe, Kiyotomo; Kawamoto, Tatsuo; Kawamura, Gen; Kayl, Manuel; Kayumov, Fred; Kazanin, Vassili; Kazarinov, Makhail; Keates, James Robert; Keeler, Richard; Keener, Paul; Kehoe, Robert; Keil, Markus; Kekelidze, George; Kelly, Marc; Kenyon, Mike; Kepka, Oldrich; Kerschen, Nicolas; Kerševan, Borut Paul; Kersten, Susanne; Kessoku, Kohei; Khakzad, Mohsen; Khalil-zada, Farkhad; Khandanyan, Hovhannes; Khanov, Alexander; Kharchenko, Dmitri; Khodinov, Alexander; Khomich, Andrei; Khoriauli, Gia; Khovanskiy, Nikolai; Khovanskiy, Valery; Khramov, Evgeniy; Khubua, Jemal; Kim, Hyeon Jin; Kim, Min Suk; Kim, Peter; Kim, Shinhong; Kind, Oliver; Kind, Peter; King, Barry; Kirk, Julie; Kirsch, Guillaume; Kirsch, Lawrence; Kiryunin, Andrey; Kisielewska, Danuta; Kittelmann, Thomas; Kiyamura, Hironori; Kladiva, Eduard; Klein, Max; Klein, Uta; Kleinknecht, Konrad; Klemetti, Miika; Klier, Amit; Klimentov, Alexei; Klingenberg, Reiner; Klinkby, Esben; Klioutchnikova, Tatiana; Klok, Peter; Klous, Sander; Kluge, Eike-Erik; Kluge, Thomas; Kluit, Peter; Klute, Markus; Kluth, Stefan; Knecht, Neil; Kneringer, Emmerich; Ko, Byeong Rok; Kobayashi, Tomio; Kobel, Michael; Koblitz, Birger; Kocian, Martin; Kocnar, Antonin; Kodys, Peter; Köneke, Karsten; König, Adriaan; Koenig, Sebastian; Köpke, Lutz; Koetsveld, Folkert; Koevesarki, Peter; Koffas, Thomas; Koffeman, Els; Kohn, Fabian; Kohout, Zdenek; Kohriki, Takashi; Kolanoski, Hermann; Kolesnikov, Vladimir; Koletsou, Iro; Koll, James; Kollar, Daniel; Kolos, Serguei; Kolya, Scott; Komar, Aston; Komaragiri, Jyothsna Rani; Kondo, Takahiko; Kono, Takanori; Konoplich, Rostislav; Konovalov, Serguei; Konstantinidis, Nikolaos; Koperny, Stefan; Korcyl, Krzysztof; Kordas, Kostantinos; Korn, Andreas; Korolkov, Ilya; Korolkova, Elena; Korotkov, Vladislav; Kortner, Oliver; Kortner, Sandra; Kostka, Peter; Kostyukhin, Vadim; Kotov, Serguei; Kotov, Vladislav; Kotov, Konstantin; Kourkoumelis, Christine; Koutsman, Alex; Kowalewski, Robert Victor; Kowalski, Henri; Kowalski, Tadeusz; Kozanecki, Witold; Kozhin, Anatoly; Kral, Vlastimil; Kramarenko, Viktor; Kramberger, Gregor; Krasny, Mieczyslaw Witold; Krasznahorkay, Attila; Kraus, James; Kreisel, Arik; Krejci, Frantisek; Kretzschmar, Jan; Krieger, Nina; Krieger, Peter; Kroeninger, Kevin; Kroha, Hubert; Kroll, Joe; Kroseberg, Juergen; Krstic, Jelena; Kruchonak, Uladzimir; Krüger, Hans; Krumshteyn, Zinovii; Kubota, Takashi; Kuehn, Susanne; Kugel, Andreas; Kuhl, Thorsten; Kuhn, Dietmar; Kukhtin, Victor; Kulchitsky, Yuri; Kuleshov, Sergey; Kummer, Christian; Kuna, Marine; Kunkle, Joshua; Kupco, Alexander; Kurashige, Hisaya; Kurata, Masakazu; Kurochkin, Yurii; Kus, Vlastimil; Kwee, Regina; La Rosa, Alessandro; La Rotonda, Laura; Labbe, Julien; Lacasta, Carlos; Lacava, Francesco; Lacker, Heiko; Lacour, Didier; Lacuesta, Vicente Ramón; Ladygin, Evgueni; Lafaye, Rémi; Laforge, Bertrand; Lagouri, Theodota; Lai, Stanley; Lamanna, Massimo; Lampen, Caleb; Lampl, Walter; Lancon, Eric; Landgraf, Ulrich; Landon, Murrough; Lane, Jenna; Lankford, Andrew; Lanni, Francesco; Lantzsch, Kerstin; Lanza, Agostino; Laplace, Sandrine; Lapoire, Cecile; Laporte, Jean-Francois; Lari, Tommaso; Larner, Aimee; Lassnig, Mario; Laurelli, Paolo; Lavrijsen, Wim; Laycock, Paul; Lazarev, Alexandre; Lazzaro, Alfio; Le Dortz, Olivier; Le Guirriec, Emmanuel; Le Menedeu, Eve; Lebedev, Alexander; Lebel, Céline; LeCompte, Thomas; Ledroit-Guillon, Fabienne Agnes Marie; Lee, Hurng-Chun; Lee, Jason; Lee, Shih-Chang; Lefebvre, Michel; Legendre, Marie; LeGeyt, Benjamin; Legger, Federica; Leggett, Charles; Lehmacher, Marc; Lehmann Miotto, Giovanna; Lei, Xiaowen; Leitner, Rupert; Lellouch, Daniel; Lellouch, Jeremie; Lendermann, Victor; Leney, Katharine; Lenz, Tatiana; Lenzen, Georg; Lenzi, Bruno; Leonhardt, Kathrin; Leroy, Claude; Lessard, Jean-Raphael; Lester, Christopher; Leung Fook Cheong, Annabelle; Levêque, Jessica; Levin, Daniel; Levinson, Lorne; Leyton, Michael; Li, Haifeng; Li, Xuefei; Liang, Zhihua; Liang, Zhijun; Liberti, Barbara; Lichard, Peter; Lichtnecker, Markus; Lie, Ki; Liebig, Wolfgang; Lilley, Joseph; Limosani, Antonio; Limper, Maaike; Lin, Simon; Linnemann, James; Lipeles, Elliot; Lipinsky, Lukas; Lipniacka, Anna; Liss, Tony; Lissauer, David; Lister, Alison; Litke, Alan; Liu, Chuanlei; Liu, Dong; Liu, Hao; Liu, Jianbei; Liu, Minghui; Liu, Tiankuan; Liu, Yanwen; Livan, Michele; Lleres, Annick; Lloyd, Stephen; Lobodzinska, Ewelina; Loch, Peter; Lockman, William; Lockwitz, Sarah; Loddenkoetter, Thomas; Loebinger, Fred; Loginov, Andrey; Loh, Chang Wei; Lohse, Thomas; Lohwasser, Kristin; Lokajicek, Milos; Long, Robin Eamonn; Lopes, Lourenco; Lopez Mateos, David; Losada, Marta; Loscutoff, Peter; Lou, Xinchou; Lounis, Abdenour; Loureiro, Karina; Lovas, Lubomir; Love, Jeremy; Love, Peter; Lowe, Andrew; Lu, Feng; Lubatti, Henry; Luci, Claudio; Lucotte, Arnaud; Ludwig, Andreas; Ludwig, Dörthe; Ludwig, Inga; Luehring, Frederick; Lumb, Debra; Luminari, Lamberto; Lund, Esben; Lund-Jensen, Bengt; Lundberg, Björn; Lundberg, Johan; Lundquist, Johan; Lynn, David; Lys, Jeremy; Lytken, Else; Ma, Hong; Ma, Lian Liang; Macana Goia, Jorge Andres; Maccarrone, Giovanni; Macchiolo, Anna; Maček, Boštjan; Machado Miguens, Joana; Mackeprang, Rasmus; Madaras, Ronald; Mader, Wolfgang; Maenner, Reinhard; Maeno, Tadashi; Mättig, Peter; Mättig, Stefan; Magalhaes Martins, Paulo Jorge; Magradze, Erekle; Mahalalel, Yair; Mahboubi, Kambiz; Mahmood, A.; Maiani, Camilla; Maidantchik, Carmen; Maio, Amélia; Majewski, Stephanie; Makida, Yasuhiro; Makouski, Mikhail; Makovec, Nikola; Malecki, Piotr; Malecki, Pawel; Maleev, Victor; Malek, Fairouz; Mallik, Usha; Malon, David; Maltezos, Stavros; Malyshev, Vladimir; Malyukov, Sergei; Mambelli, Marco; Mameghani, Raphael; Mamuzic, Judita; Mandelli, Luciano; Mandić, Igor; Mandrysch, Rocco; Maneira, José; Mangeard, Pierre-Simon; Manjavidze, Ioseb; Manning, Peter; Manousakis-Katsikakis, Arkadios; Mansoulie, Bruno; Mapelli, Alessandro; Mapelli, Livio; March , Luis; Marchand, Jean-Francois; Marchese, Fabrizio; Marchiori, Giovanni; Marcisovsky, Michal; Marino, Christopher; Marroquim, Fernando; Marshall, Zach; Marti-Garcia, Salvador; Martin, Alex; Martin, Andrew; Martin, Brian; Martin, Brian; Martin, Franck Francois; Martin, Jean-Pierre; Martin, Tim; Martin dit Latour, Bertrand; Martinez, Mario; Martinez Outschoorn, Verena; Martyniuk, Alex; Marzano, Francesco; Marzin, Antoine; Masetti, Lucia; Mashimo, Tetsuro; Mashinistov, Ruslan; Masik, Jiri; Maslennikov, Alexey; Massa, Ignazio; Massol, Nicolas; Mastroberardino, Anna; Masubuchi, Tatsuya; Matricon, Pierre; Matsunaga, Hiroyuki; Matsushita, Takashi; Mattravers, Carly; Maxfield, Stephen; Mayne, Anna; Mazini, Rachid; Mazur, Michael; Mc Donald, Jeffrey; Mc Kee, Shawn Patrick; McCarn, Allison; McCarthy, Robert; McCubbin, Norman; McFarlane, Kenneth; McGlone, Helen; Mchedlidze, Gvantsa; McMahon, Steve; McPherson, Robert; Meade, Andrew; Mechnich, Joerg; Mechtel, Markus; Medinnis, Mike; Meera-Lebbai, Razzak; Meguro, Tatsuma; Mehlhase, Sascha; Mehta, Andrew; Meier, Karlheinz; Meirose, Bernhard; Melachrinos, Constantinos; Mellado Garcia, Bruce Rafael; Mendoza Navas, Luis; Meng, Zhaoxia; Menke, Sven; Meoni, Evelin; Mermod, Philippe; Merola, Leonardo; Meroni, Chiara; Merritt, Frank; Messina, Andrea; Metcalfe, Jessica; Mete, Alaettin Serhan; Meyer, Jean-Pierre; Meyer, Jochen; Meyer, Joerg; Meyer, Thomas Christian; Meyer, W. Thomas; Miao, Jiayuan; Michal, Sebastien; Micu, Liliana; Middleton, Robin; Migas, Sylwia; Mijović, Liza; Mikenberg, Giora; Mikestikova, Marcela; Mikuž, Marko; Miller, David; Mills, Corrinne; Mills, Bill; Milov, Alexander; Milstead, David; Milstein, Dmitry; Minaenko, Andrey; Miñano, Mercedes; Minashvili, Irakli; Mincer, Allen; Mindur, Bartosz; Mineev, Mikhail; Ming, Yao; Mir, Lluisa-Maria; Mirabelli, Giovanni; Misawa, Shigeki; Misiejuk, Andrzej; Mitrevski, Jovan; Mitsou, Vasiliki A.; Miyagawa, Paul; Mjörnmark, Jan-Ulf; Moa, Torbjoern; Moed, Shulamit; Moeller, Victoria; Mönig, Klaus; Möser, Nicolas; Mohr, Wolfgang; Mohrdieck-Möck, Susanne; Moles-Valls, Regina; Molina-Perez, Jorge; Monk, James; Monnier, Emmanuel; Montesano, Simone; Monticelli, Fernando; Moore, Roger; Mora Herrera, Clemencia; Moraes, Arthur; Morais, Antonio; Morel, Julien; Morello, Gianfranco; Moreno, Deywis; Moreno Llácer, María; Morettini, Paolo; Morii, Masahiro; Morley, Anthony Keith; Mornacchi, Giuseppe; Morozov, Sergey; Morris, John; Moser, Hans-Guenther; Mosidze, Maia; Moss, Josh; Mount, Richard; Mountricha, Eleni; Mouraviev, Sergei; Moyse, Edward; Mudrinic, Mihajlo; Mueller, Felix; Mueller, James; Mueller, Klemens; Müller, Thomas; Muenstermann, Daniel; Muir, Alex; Munwes, Yonathan; Murillo Garcia, Raul; Murray, Bill; Mussche, Ido; Musto, Elisa; Myagkov, Alexey; Myska, Miroslav; Nadal, Jordi; Nagai, Koichi; Nagano, Kunihiro; Nagasaka, Yasushi; Nairz, Armin Michael; Nakamura, Koji; Nakano, Itsuo; Nakatsuka, Hiroki; Nanava, Gizo; Napier, Austin; Nash, Michael; Nation, Nigel; Nattermann, Till; Naumann, Thomas; Navarro, Gabriela; Nderitu, Simon Kirichu; Neal, Homer; Nebot, Eduardo; Nechaeva, Polina; Negri, Andrea; Negri, Guido; Nelson, Andrew; Nelson, Timothy Knight; Nemecek, Stanislav; Nemethy, Peter; Nepomuceno, Andre Asevedo; Nessi, Marzio; Neubauer, Mark; Neusiedl, Andrea; Neves, Ricardo; Nevski, Pavel; Newcomer, Mitchel; Nickerson, Richard; Nicolaidou, Rosy; Nicolas, Ludovic; Nicoletti, Giovanni; Nicquevert, Bertrand; Niedercorn, Francois; Nielsen, Jason; Nikiforov, Andriy; Nikolaev, Kirill; Nikolic-Audit, Irena; Nikolopoulos, Konstantinos; Nilsen, Henrik; Nilsson, Paul; Nisati, Aleandro; Nishiyama, Tomonori; Nisius, Richard; Nodulman, Lawrence; Nomachi, Masaharu; Nomidis, Ioannis; Nordberg, Markus; Nordkvist, Bjoern; Notz, Dieter; Novakova, Jana; Nozaki, Mitsuaki; Nožička, Miroslav; Nugent, Ian Michael; Nuncio-Quiroz, Adriana-Elizabeth; Nunes Hanninger, Guilherme; Nunnemann, Thomas; Nurse, Emily; O'Neil, Dugan; O'Shea, Val; Oakham, Gerald; Oberlack, Horst; Ochi, Atsuhiko; Oda, Susumu; Odaka, Shigeru; Odier, Jerome; Ogren, Harold; Oh, Alexander; Oh, Seog; Ohm, Christian; Ohshima, Takayoshi; Ohshita, Hidetoshi; Ohsugi, Takashi; Okada, Shogo; Okawa, Hideki; Okumura, Yasuyuki; Okuyama, Toyonobu; Olchevski, Alexander; Oliveira, Miguel Alfonso; Oliveira Damazio, Denis; Oliver Garcia, Elena; Olivito, Dominick; Olszewski, Andrzej; Olszowska, Jolanta; Omachi, Chihiro; Onofre, António; Onyisi, Peter; Oram, Christopher; Oreglia, Mark; Oren, Yona; Orestano, Domizia; Orlov, Iliya; Oropeza Barrera, Cristina; Orr, Robert; Ortega, Eduardo; Osculati, Bianca; Ospanov, Rustem; Osuna, Carlos; Ottersbach, John; Ould-Saada, Farid; Ouraou, Ahmimed; Ouyang, Qun; Owen, Mark; Owen, Simon; Oyarzun, Alejandro; Ozcan, Veysi Erkcan; Ozone, Kenji; Ozturk, Nurcan; Pacheco Pages, Andres; Padilla Aranda, Cristobal; Paganis, Efstathios; Pahl, Christoph; Paige, Frank; Pajchel, Katarina; Palestini, Sandro; Pallin, Dominique; Palma, Alberto; Palmer, Jody; Pan, Yibin; Panagiotopoulou, Evgenia; Panes, Boris; Panikashvili, Natalia; Panitkin, Sergey; Pantea, Dan; Panuskova, Monika; Paolone, Vittorio; Papadopoulou, Theodora; Park, Su-Jung; Park, Woochun; Parker, Andy; Parodi, Fabrizio; Parsons, John; Parzefall, Ulrich; Pasqualucci, Enrico; Passeri, Antonio; Pastore, Fernanda; Pastore, Francesca; Pásztor , Gabriella; Pataraia, Sophio; Pater, Joleen; Patricelli, Sergio; Pauly, Thilo; Peak, Lawrence; Pecsy, Martin; Pedraza Morales, Maria Isabel; Peleganchuk, Sergey; Peng, Haiping; Penson, Alexander; Penwell, John; Perantoni, Marcelo; Perez, Kerstin; Perez Codina, Estel; Pérez García-Estañ, María Teresa; Perez Reale, Valeria; Perini, Laura; Pernegger, Heinz; Perrino, Roberto; Persembe, Seda; Perus, Antoine; Peshekhonov, Vladimir; Petersen, Brian; Petersen, Troels; Petit, Elisabeth; Petridou, Chariclia; Petrolo, Emilio; Petrucci, Fabrizio; Petschull, Dennis; Petteni, Michele; Pezoa, Raquel; Phan, Anna; Phillips, Alan; Phillips, Peter William; Piacquadio, Giacinto; Piccinini, Maurizio; Piegaia, Ricardo; Pilcher, James; Pilkington, Andrew; Pina, João Antonio; Pinamonti, Michele; Pinfold, James; Pinto, Belmiro; Pizio, Caterina; Placakyte, Ringaile; Plamondon, Mathieu; Pleier, Marc-Andre; Poblaguev, Andrei; Poddar, Sahill; Podlyski, Fabrice; Poggioli, Luc; Pohl, Martin; Polci, Francesco; Polesello, Giacomo; Policicchio, Antonio; Polini, Alessandro; Poll, James; Polychronakos, Venetios; Pomeroy, Daniel; Pommès, Kathy; Ponsot, Patrick; Pontecorvo, Ludovico; Pope, Bernard; Popeneciu, Gabriel Alexandru; Popovic, Dragan; Poppleton, Alan; Popule, Jiri; Portell Bueso, Xavier; Porter, Robert; Pospelov, Guennady; Pospisil, Stanislav; Potekhin, Maxim; Potrap, Igor; Potter, Christina; Potter, Christopher; Potter, Keith; Poulard, Gilbert; Poveda, Joaquin; Prabhu, Robindra; Pralavorio, Pascal; Prasad, Srivas; Pravahan, Rishiraj; Pribyl, Lukas; Price, Darren; Price, Lawrence; Prichard, Paul; Prieur, Damien; Primavera, Margherita; Prokofiev, Kirill; Prokoshin, Fedor; Protopopescu, Serban; Proudfoot, James; Prudent, Xavier; Przysiezniak, Helenka; Psoroulas, Serena; Ptacek, Elizabeth; Purdham, John; Purohit, Milind; Puzo, Patrick; Pylypchenko, Yuriy; Qi, Ming; Qian, Jianming; Qian, Weiming; Qin, Zhonghua; Quadt, Arnulf; Quarrie, David; Quayle, William; Quinonez, Fernando; Raas, Marcel; Radeka, Veljko; Radescu, Voica; Radics, Balint; Rador, Tonguc; Ragusa, Francesco; Rahal, Ghita; Rahimi, Amir; Rajagopalan, Srinivasan; Rammensee, Michael; Rammes, Marcus; Rauscher, Felix; Rauter, Emanuel; Raymond, Michel; Read, Alexander Lincoln; Rebuzzi, Daniela; Redelbach, Andreas; Redlinger, George; Reece, Ryan; Reeves, Kendall; Reinherz-Aronis, Erez; Reinsch, Andreas; Reisinger, Ingo; Reljic, Dusan; Rembser, Christoph; Ren, Zhongliang; Renkel, Peter; Rescia, Sergio; Rescigno, Marco; Resconi, Silvia; Resende, Bernardo; Reznicek, Pavel; Rezvani, Reyhaneh; Richards, Alexander; Richter, Robert; Richter-Was, Elzbieta; Ridel, Melissa; Rijpstra, Manouk; Rijssenbeek, Michael; Rimoldi, Adele; Rinaldi, Lorenzo; Rios, Ryan Randy; Riu, Imma; Rizatdinova, Flera; Rizvi, Eram; Roa Romero, Diego Alejandro; Robertson, Steven; Robichaud-Veronneau, Andree; Robinson, Dave; Robinson, James; Robinson, Mary; Robson, Aidan; Rocha de Lima, Jose Guilherme; Roda, Chiara; Roda Dos Santos, Denis; Rodriguez, Diego; Rodriguez Garcia, Yohany; Roe, Shaun; Røhne, Ole; Rojo, Victoria; Rolli, Simona; Romaniouk, Anatoli; Romanov, Victor; Romeo, Gaston; Romero Maltrana, Diego; Roos, Lydia; Ros, Eduardo; Rosati, Stefano; Rosenbaum, Gabriel; Rosselet, Laurent; Rossetti, Valerio; Rossi, Leonardo Paolo; Rotaru, Marina; Rothberg, Joseph; Rousseau, David; Royon, Christophe; Rozanov, Alexander; Rozen, Yoram; Ruan, Xifeng; Ruckert, Benjamin; Ruckstuhl, Nicole; Rud, Viacheslav; Rudolph, Gerald; Rühr, Frederik; Ruggieri, Federico; Ruiz-Martinez, Aranzazu; Rumyantsev, Leonid; Rurikova, Zuzana; Rusakovich, Nikolai; Rutherfoord, John; Ruwiedel, Christoph; Ruzicka, Pavel; Ryabov, Yury; Ryan, Patrick; Rybkin, Grigori; Rzaeva, Sevda; Saavedra, Aldo; Sadrozinski, Hartmut; Sadykov, Renat; Safai Tehrani, Francesco; Sakamoto, Hiroshi; Salamanna, Giuseppe; Salamon, Andrea; Saleem, Muhammad; Salihagic, Denis; Salnikov, Andrei; Salt, José; Salvachua Ferrando, Belén; Salvatore, Daniela; Salvatore, Pasquale Fabrizio; Salvucci, Antonio; Salzburger, Andreas; Sampsonidis, Dimitrios; Samset, Björn Hallvard; Sandaker, Heidi; Sander, Heinz Georg; Sanders, Michiel; Sandhoff, Marisa; Sandhu, Pawan; Sandstroem, Rikard; Sandvoss, Stephan; Sankey, Dave; Sanny, Bernd; Sansoni, Andrea; Santamarina Rios, Cibran; Santoni, Claudio; Santonico, Rinaldo; Saraiva, João; Sarangi, Tapas; Sarkisyan-Grinbaum, Edward; Sarri, Francesca; Sasaki, Osamu; Sasao, Noboru; Satsounkevitch, Igor; Sauvage, Gilles; Savard, Pierre; Savine, Alexandre; Savinov, Vladimir; Sawyer, Lee; Saxon, David; Says, Louis-Pierre; Sbarra, Carla; Sbrizzi, Antonio; Scannicchio, Diana; Schaarschmidt, Jana; Schacht, Peter; Schäfer, Uli; Schaetzel, Sebastian; Schaffer, Arthur; Schaile, Dorothee; Schamberger, R.~Dean; Schamov, Andrey; Scharf, Veit; Schegelsky, Valery; Scheirich, Daniel; Schernau, Michael; Scherzer, Max; Schiavi, Carlo; Schieck, Jochen; Schioppa, Marco; Schlenker, Stefan; Schmidt, Evelyn; Schmieden, Kristof; Schmitt, Christian; Schmitz, Martin; Schöning, André; Schott, Matthias; Schouten, Doug; Schovancova, Jaroslava; Schram, Malachi; Schreiner, Alexander; Schroeder, Christian; Schroer, Nicolai; Schroers, Marcel; Schultes, Joachim; Schultz-Coulon, Hans-Christian; Schumacher, Jan; Schumacher, Markus; Schumm, Bruce; Schune, Philippe; Schwanenberger, Christian; Schwartzman, Ariel; Schwemling, Philippe; Schwienhorst, Reinhard; Schwierz, Rainer; Schwindling, Jerome; Scott, Bill; Searcy, Jacob; Sedykh, Evgeny; Segura, Ester; Seidel, Sally; Seiden, Abraham; Seifert, Frank; Seixas, José; Sekhniaidze, Givi; Seliverstov, Dmitry; Sellden, Bjoern; Semprini-Cesari, Nicola; Serfon, Cedric; Serin, Laurent; Seuster, Rolf; Severini, Horst; Sevior, Martin; Sfyrla, Anna; Shabalina, Elizaveta; Shamim, Mansoora; Shan, Lianyou; Shank, James; Shao, Qi Tao; Shapiro, Marjorie; Shatalov, Pavel; Shaw, Kate; Sherman, Daniel; Sherwood, Peter; Shibata, Akira; Shimojima, Makoto; Shin, Taeksu; Shmeleva, Alevtina; Shochet, Mel; Shupe, Michael; Sicho, Petr; Sidoti, Antonio; Siegert, Frank; Siegrist, James; Sijacki, Djordje; Silbert, Ohad; Silver, Yiftah; Silverstein, Daniel; Silverstein, Samuel; Simak, Vladislav; Simic, Ljiljana; Simion, Stefan; Simmons, Brinick; Simonyan, Margar; Sinervo, Pekka; Sinev, Nikolai; Sipica, Valentin; Siragusa, Giovanni; Sisakyan, Alexei; Sivoklokov, Serguei; Sjölin, Jörgen; Sjursen, Therese; Skovpen, Kirill; Skubic, Patrick; Slater, Mark; Slavicek, Tomas; Sliwa, Krzysztof; Sloper, John erik; Smakhtin, Vladimir; Smirnov, Sergei; Smirnov, Yuri; Smirnova, Lidia; Smirnova, Oxana; Smith, Ben Campbell; Smith, Douglas; Smith, Kenway; Smizanska, Maria; Smolek, Karel; Snesarev, Andrei; Snow, Steve; Snow, Joel; Snuverink, Jochem; Snyder, Scott; Soares, Mara; Sobie, Randall; Sodomka, Jaromir; Soffer, Abner; Solans, Carlos; Solar, Michael; Solc, Jaroslav; Solfaroli Camillocci, Elena; Solodkov, Alexander; Solovyanov, Oleg; Sondericker, John; Sopko, Vit; Sopko, Bruno; Sosebee, Mark; Soukharev, Andrey; Spagnolo, Stefania; Spanò, Francesco; Spighi, Roberto; Spigo, Giancarlo; Spila, Federico; Spiwoks, Ralf; Spousta, Martin; Spreitzer, Teresa; Spurlock, Barry; St. Denis, Richard Dante; Stahl, Thorsten; Stahlman, Jonathan; Stamen, Rainer; Stancu, Stefan Nicolae; Stanecka, Ewa; Stanek, Robert; Stanescu, Cristian; Stapnes, Steinar; Starchenko, Evgeny; Stark, Jan; Staroba, Pavel; Starovoitov, Pavel; Stastny, Jan; Stavina, Pavel; Steele, Genevieve; Steinbach, Peter; Steinberg, Peter; Stekl, Ivan; Stelzer, Bernd; Stelzer, Harald Joerg; Stelzer-Chilton, Oliver; Stenzel, Hasko; Stevenson, Kyle; Stewart, Graeme; Stockton, Mark; Stoerig, Kathrin; Stoicea, Gabriel; Stonjek, Stefan; Strachota, Pavel; Stradling, Alden; Straessner, Arno; Strandberg, Jonas; Strandberg, Sara; Strandlie, Are; Strauss, Michael; Strizenec, Pavol; Ströhmer, Raimund; Strom, David; Stroynowski, Ryszard; Strube, Jan; Stugu, Bjarne; Sturm, Philipp; Su, Dong; Soh, Dart-yin; Sugaya, Yorihito; Sugimoto, Takuya; Suhr, Chad; Suk, Michal; Sulin, Vladimir; Sultansoy, Saleh; Sumida, Toshi; Sun, Xiaohu; Sundermann, Jan Erik; Suruliz, Kerim; Sushkov, Serge; Susinno, Giancarlo; Sutton, Mark; Suzuki, Takuya; Suzuki, Yu; Sykora, Ivan; Sykora, Tomas; Szymocha, Tadeusz; Sánchez, Javier; Ta, Duc; Tackmann, Kerstin; Taffard, Anyes; Tafirout, Reda; Taga, Adrian; Takahashi, Yuta; Takai, Helio; Takashima, Ryuichi; Takeda, Hiroshi; Takeshita, Tohru; Talby, Mossadek; Talyshev, Alexey; Tamsett, Matthew; Tanaka, Junichi; Tanaka, Reisaburo; Tanaka, Satoshi; Tanaka, Shuji; Tapprogge, Stefan; Tardif, Dominique; Tarem, Shlomit; Tarrade, Fabien; Tartarelli, Giuseppe Francesco; Tas, Petr; Tasevsky, Marek; Tassi, Enrico; Tatarkhanov, Mous; Taylor, Christopher; Taylor, Frank; Taylor, Geoffrey; Taylor, Ryan P.; Taylor, Wendy; Teixeira-Dias, Pedro; Ten Kate, Herman; Teng, Ping-Kun; Tennenbaum-Katan, Yaniv-David; Terada, Susumu; Terashi, Koji; Terron, Juan; Terwort, Mark; Testa, Marianna; Teuscher, Richard; Therhaag, Jan; Thioye, Moustapha; Thoma, Sascha; Thomas, Juergen; Thompson, Stan; Thompson, Emily; Thompson, Peter; Thompson, Paul; Thompson, Ray; Thomson, Evelyn; Thun, Rudolf; Tic, Tomas; Tikhomirov, Vladimir; Tikhonov, Yury; Tipton, Paul; Tique Aires Viegas, Florbela De Jes; Tisserant, Sylvain; Toczek, Barbara; Todorov, Theodore; Todorova-Nova, Sharka; Toggerson, Brokk; Tojo, Junji; Tokár, Stanislav; Tokushuku, Katsuo; Tollefson, Kirsten; Tomasek, Lukas; Tomasek, Michal; Tomoto, Makoto; Tompkins, Lauren; Toms, Konstantin; Tonoyan, Arshak; Topfel, Cyril; Topilin, Nikolai; Torchiani, Ingo; Torrence, Eric; Torró Pastor, Emma; Toth, Jozsef; Touchard, Francois; Tovey, Daniel; Trefzger, Thomas; Tremblet, Louis; Tricoli, Alesandro; Trigger, Isabel Marian; Trincaz-Duvoid, Sophie; Trinh, Thi Nguyet; Tripiana, Martin; Triplett, Nathan; Trischuk, William; Trivedi, Arjun; Trocmé, Benjamin; Troncon, Clara; Trzupek, Adam; Tsarouchas, Charilaos; Tseng, Jeffrey; Tsiakiris, Menelaos; Tsiareshka, Pavel; Tsionou, Dimitra; Tsipolitis, Georgios; Tsiskaridze, Vakhtang; Tskhadadze, Edisher; Tsukerman, Ilya; Tsulaia, Vakhtang; Tsung, Jieh-Wen; Tsuno, Soshi; Tsybychev, Dmitri; Tuggle, Joseph; Turecek, Daniel; Turk Cakir, Ilkay; Turlay, Emmanuel; Tuts, Michael; Twomey, Matthew Shaun; Tylmad, Maja; Tyndel, Mike; Uchida, Kirika; Ueda, Ikuo; Ueno, Ryuichi; Ugland, Maren; Uhlenbrock, Mathias; Uhrmacher, Michael; Ukegawa, Fumihiko; Unal, Guillaume; Undrus, Alexander; Unel, Gokhan; Unno, Yoshinobu; Urbaniec, Dustin; Urkovsky, Evgeny; Urquijo, Phillip; Urrejola, Pedro; Usai, Giulio; Uslenghi, Massimiliano; Vacavant, Laurent; Vacek, Vaclav; Vachon, Brigitte; Vahsen, Sven; Valente, Paolo; Valentinetti, Sara; Valkar, Stefan; Valladolid Gallego, Eva; Vallecorsa, Sofia; Valls Ferrer, Juan Antonio; Van Berg, Richard; van der Graaf, Harry; van der Kraaij, Erik; van der Poel, Egge; van der Ster, Daniel; van Eldik, Niels; van Gemmeren, Peter; van Kesteren, Zdenko; van Vulpen, Ivo; Vandelli, Wainer; Vaniachine, Alexandre; Vankov, Peter; Vannucci, Francois; Vari, Riccardo; Varnes, Erich; Varouchas, Dimitris; Vartapetian, Armen; Varvell, Kevin; Vasilyeva, Lidia; Vassilakopoulos, Vassilios; Vazeille, Francois; Vellidis, Constantine; Veloso, Filipe; Veneziano, Stefano; Ventura, Andrea; Ventura, Daniel; Venturi, Manuela; Venturi, Nicola; Vercesi, Valerio; Verducci, Monica; Verkerke, Wouter; Vermeulen, Jos; Vetterli, Michel; Vichou, Irene; Vickey, Trevor; Viehhauser, Georg; Villa, Mauro; Villani, Giulio; Villaplana Perez, Miguel; Vilucchi, Elisabetta; Vincter, Manuella; Vinek, Elisabeth; Vinogradov, Vladimir; Viret, Sébastien; Virzi, Joseph; Vitale , Antonio; Vitells, Ofer; Vivarelli, Iacopo; Vives Vaque, Francesc; Vlachos, Sotirios; Vlasak, Michal; Vlasov, Nikolai; Vogel, Adrian; Vokac, Petr; Volpi, Matteo; von der Schmitt, Hans; von Loeben, Joerg; von Radziewski, Holger; von Toerne, Eckhard; Vorobel, Vit; Vorwerk, Volker; Vos, Marcel; Voss, Rudiger; Voss, Thorsten Tobias; Vossebeld, Joost; Vranjes, Nenad; Vranjes Milosavljevic, Marija; Vrba, Vaclav; Vreeswijk, Marcel; Vu Anh, Tuan; Vudragovic, Dusan; Vuillermet, Raphael; Vukotic, Ilija; Wagner, Peter; Walbersloh, Jorg; Walder, James; Walker, Rodney; Walkowiak, Wolfgang; Wall, Richard; Wang, Chiho; Wang, Haichen; Wang, Jin; Wang, Song-Ming; Warburton, Andreas; Ward, Patricia; Warsinsky, Markus; Wastie, Roy; Watkins, Peter; Watson, Alan; Watson, Miriam; Watts, Gordon; Watts, Stephen; Waugh, Anthony; Waugh, Ben; Weber, Marc; Weber, Manuel; Weber, Michele; Weber, Pavel; Weidberg, Anthony; Weingarten, Jens; Weiser, Christian; Wellenstein, Hermann; Wells, Phillippa; Wenaus, Torre; Wendler, Shanti; Wengler, Thorsten; Wenig, Siegfried; Wermes, Norbert; Werner, Matthias; Werner, Per; Werth, Michael; Werthenbach, Ulrich; Wessels, Martin; Whalen, Kathleen; White, Andrew; White, Martin; White, Sebastian; Whitehead, Samuel Robert; Whiteson, Daniel; Whittington, Denver; Wicek, Francois; Wicke, Daniel; Wickens, Fred; Wiedenmann, Werner; Wielers, Monika; Wienemann, Peter; Wiglesworth, Craig; Wiik, Liv Antje Mari; Wildauer, Andreas; Wildt, Martin Andre; Wilkens, Henric George; Williams, Eric; Williams, Hugh; Willocq, Stephane; Wilson, John; Wilson, Michael Galante; Wilson, Alan; Wingerter-Seez, Isabelle; Winklmeier, Frank; Wittgen, Matthias; Wolter, Marcin Wladyslaw; Wolters, Helmut; Wosiek, Barbara; Wotschack, Jorg; Woudstra, Martin; Wraight, Kenneth; Wright, Catherine; Wright, Dennis; Wrona, Bozydar; Wu, Sau Lan; Wu, Xin; Wulf, Evan; Wynne, Benjamin; Xaplanteris, Leonidas; Xella, Stefania; Xie, Song; Xu, Da; Xu, Neng; Yamada, Miho; Yamamoto, Akira; Yamamoto, Kyoko; Yamamoto, Shimpei; Yamamura, Taiki; Yamaoka, Jared; Yamazaki, Takayuki; Yamazaki, Yuji; Yan, Zhen; Yang, Haijun; Yang, Un-Ki; Yang, Zhaoyu; Yao, Weiming; Yao, Yushu; Yasu, Yoshiji; Ye, Jingbo; Ye, Shuwei; Yilmaz, Metin; Yoosoofmiya, Reza; Yorita, Kohei; Yoshida, Riktura; Young, Charles; Youssef, Saul; Yu, Dantong; Yu, Jaehoon; Yuan, Li; Yurkewicz, Adam; Zaidan, Remi; Zaitsev, Alexander; Zajacova, Zuzana; Zambrano, Valentina; Zanello, Lucia; Zaytsev, Alexander; Zeitnitz, Christian; Zeller, Michael; Zemla, Andrzej; Zendler, Carolin; Zenin, Oleg; Zenis, Tibor; Zenonos, Zenonas; Zenz, Seth; Zerwas, Dirk; Zevi della Porta, Giovanni; Zhan, Zhichao; Zhang, Huaqiao; Zhang, Jinlong; Zhang, Qizhi; Zhang, Xueyao; Zhao, Long; Zhao, Tianchi; Zhao, Zhengguo; Zhemchugov, Alexey; Zhong, Jiahang; Zhou, Bing; Zhou, Ning; Zhou, Yue; Zhu, Cheng Guang; Zhu, Hongbo; Zhu, Yingchun; Zhuang, Xuai; Zhuravlov, Vadym; Zimmermann, Robert; Zimmermann, Simone; Zimmermann, Stephanie; Ziolkowski, Michael; Zivkovic, Lidija; Zobernig, Georg; Zoccoli, Antonio; zur Nedden, Martin; Zutshi, Vishnu

    2010-01-01

    The ATLAS Inner Detector is a composite tracking system consisting of silicon pixels, silicon strips and straw tubes in a 2 T magnetic field. Its installation was completed in August 2008 and the detector took part in data- taking with single LHC beams and cosmic rays. The initial detector operation, hardware commissioning and in-situ calibrations are described. Tracking performance has been measured with 7.6 million cosmic-ray events, collected using a tracking trigger and reconstructed with modular pattern-recognition and fitting software. The intrinsic hit efficiency and tracking trigger efficiencies are close to 100%. Lorentz angle measurements for both electrons and holes, specific energy-loss calibration and transition radiation turn-on measurements have been performed. Different alignment techniques have been used to reconstruct the detector geometry. After the initial alignment, a transverse impact parameter resolution of 22.1+/-0.9 {\\mu}m and a relative momentum resolution {\\sigma}p/p = (4.83+/-0.16)...

  19. Simulations of planar pixel sensors for the ATLAS high luminosity upgrade

    CERN Document Server

    Calderini, G; Dinu, N; Lounis, A; Marchiori, G

    2011-01-01

    A physics-based device simulation was used to study the charge carrier distribution and the electric field configuration inside simplified two-dimensional models for pixel layouts based on the ATLAS pixel sensor. In order to study the behavior of such detectors under different levels of irradiation, a three-level defect model was implemented into the simulation. Using these models, the number of guard rings, the dead edge width and the detector thickness were modified to investigate their influence on the detector depletion at the edge and on its internal electric field distribution in order to optimize the layout parameters. Simulations indicate that the number of guard rings can be reduced by a few hundred microns with respect to the layout used for the present ATLAS sensors, with a corresponding extension of the active area of the sensors. A study of the inter-pixel capacitance and of the capacitance between the implants and the high-voltage contact as a function of several parameters affecting the geometr...

  20. Forward Detectors and Physics at ATLAS

    CERN Document Server

    Soni, N; The ATLAS collaboration

    2010-01-01

    This talk will cover the current Atlas forward detectors LUCID, ZDC, ALFA and the upgrade project AFP. The current forward detectors are dedicated for the luminosity measurements and the forward physics measurements at first low luminosity LHC phase. The AFP project will significantly extend the ATLAS physics program at high luminosities by tagging the very forward tagging protons.

  1. Semiconductor Pixel detectors and their applications in life sciences

    International Nuclear Information System (INIS)

    Recent advances in semiconductor technology allow construction of highly efficient and low noise pixel detectors of ionizing radiation. Steadily improving quality of front end electronics enables fast digital signal processing in each pixel which offers recording of more complete information about each detected quantum (energy, time, number of particles). All these features improve an extend applicability of pixel technology in different fields. Some applications of this technology especially for imaging in life sciences will be shown (energy and phase sensitive X-ray radiography and tomography, radiography with heavy charged particles, neutron radiography, etc). On the other hand a number of obstacles can limit the detector performance if not handled. The pixel detector is in fact an array of individual detectors (pixels), each of them has its own efficiency, energy calibration and also noise. The common effort is to make all these parameters uniform for all pixels. However an ideal uniformity can be never reached. Moreover, it is often seen that the signal in one pixel can affect the neighbouring pixels due to various reasons (e.g. charge sharing). All such effects have to be taken into account during data processing to avoid false data interpretation. A brief view into the future of pixel detectors and their applications including also spectroscopy, tracking and dosimetry is given too. Special attention is paid to the problem of detector segmentation in context of the charge sharing effect.

  2. The ATLAS detector: status and performance in Run-II

    CERN Document Server

    Schramm, Steven; The ATLAS collaboration

    2016-01-01

    During the first extended shutdown of the LHC, in 2013 and 2014, the ATLAS detector has undergone several improvements. A new silicon pixel detector layer has been added inside of the existing layers, enhancing vertex identification, while the coverage of the muon detector has been significantly expanded. Many other detector systems have been upgraded to handle the higher expected pileup conditions in the coming years and to generally improve their performance. This document describes these upgrades and the resulting impact on the identification and performance of standard physics objects. Preliminary results using the first $\\sim80\\,\\mathrm{pb}^{-1}$ of 2015 data at $\\sqrt{s}=13\\,\\mathrm{TeV}$ are presented, demonstrating the capability of ATLAS to perform both searches and measurements.

  3. STAR Vertex Detector Upgrade-HFT Pixel Development

    International Nuclear Information System (INIS)

    Development and prototyping efforts directed towards construction of a new vertex detector for the STAR experiment at the RHIC accelerator at BNL are presented. This new detector will extend the physics range of STAR by allowing for precision measurements of yields and spectra of particles containing heavy quarks. The innermost central part of the new detector is a high resolution pixel-type detector (PIXEL). PIXEL requirements are discussed as well as a conceptual mechanical design, a sensor development path, and a detector readout architecture. Selected progress with sensor prototypes dedicated to the PIXEL detector is summarized and the approach chosen for the readout system architecture validated in tests of hardware prototypes is discussed.

  4. STAR Vertex Detector Upgrade—HFT Pixel Development

    Science.gov (United States)

    Szelezniak, Michal; Anderssen, Eric; Greiner, Leo C.; Matis, Howard S.; Ritter, Hans Georg; Stezelberger, Thorsten; Sun, Xiangming; Thomas, James H.; Vu, Chinh Q.; Wieman, Howard H.

    2009-03-01

    Development and prototyping efforts directed towards construction of a new vertex detector for the STAR experiment at the RHIC accelerator at BNL are presented. This new detector will extend the physics range of STAR by allowing for precision measurements of yields and spectra of particles containing heavy quarks. The innermost central part of the new detector is a high resolution pixel-type detector (PIXEL). PIXEL requirements are discussed as well as a conceptual mechanical design, a sensor development path, and a detector readout architecture. Selected progress with sensor prototypes dedicated to the PIXEL detector is summarized and the approach chosen for the readout system architecture validated in tests of hardware prototypes is discussed.

  5. Status of the digital pixel array detector for protein crystallography

    CERN Document Server

    Datte, P; Beuville, E; Endres, N; Druillole, F; Luo, L; Millaud, J E; Xuong, N H

    1999-01-01

    A two-dimensional photon counting digital pixel array detector is being designed for static and time resolved protein crystallography. The room temperature detector will significantly enhance monochromatic and polychromatic protein crystallographic through-put data rates by more than three orders of magnitude. The detector has an almost infinite photon counting dynamic range and exhibits superior spatial resolution when compared to present crystallographic phosphor imaging plates or phosphor coupled CCD detectors. The detector is a high resistivity N-type Si with a pixel pitch of 150x150 mu m, and a thickness of 300 mu m, and is bump bonded to an application specific integrated circuit. The event driven readout of the detector is based on the column architecture and allows an independent pixel hit rate above 1 million photons/s/pixel. The device provides energy discrimination and sparse data readout which yields minimal dead-time. This type of architecture allows a continuous (frameless) data acquisition, a f...

  6. Commissioning of the ATLAS inner detector with cosmic rays

    Science.gov (United States)

    Hayward, H.

    2008-07-01

    The inner detector of the ATLAS experiment is in the process of being commissioned using cosmic ray events. First tests were performed in the SR1 assembly hall at CERN with both barrel and endcaps for all different detector technologies (pixels and microstrips silicon detectors as well as straw tubes with additional transition radiation detection). Integration with the rest of the ATLAS sub-detectors is now being done in the ATLAS cavern. The full software chain has been set up in order to reconstruct and analyse this kind of events. Final detector decoders have been developed, different pattern recognition algorithms and track fitters have been validated as well as the various alignment and calibration methods. The infrastructure to deal with conditions data coming from the data acquisition, detector control system and calibration runs has been put in place, allowing also to apply alignment and calibration constants. The software has also been essential to monitor the detector performance during data taking. Detector efficiencies, noise occupancies and resolutions have been studied in detail and compared with those obtained from simulation.

  7. Simulation of signal in irradiated silicon pixel detectors

    CERN Document Server

    Kramberger, G

    2003-01-01

    Induced currents in silicon pixel detectors of different geometries were simulated. The general properties of charge collection in irradiated segmented devices were investigated. A significant difference in charge collection efficiency (CCE) between n**+-n and p **+-n detectors was predicted after irradiation to the LHC fluences. A possible use of silicon detectors for the LHC upgrade was investigated by simulation of thin pixel sensors. The reduced CCE due to charge trapping seems to be the largest obstacle for their use.

  8. Design, production, and reliability of the new ATLAS pixel opto-boards

    International Nuclear Information System (INIS)

    New fiber optical transceivers, opto-boards, were designed and produced to replace the first generation opto-boards installed in the ATLAS pixel detector and for the new pixel layer, the insertable barrel layer (IBL). Each opto-board contains one 12-channel PIN array and two 12-channel VCSEL arrays along with associated receiver and driver ASICs. The new opto-board design benefits from the production and operational experience of the first generation opto-boards and contains several improvements. The new opto-boards have been successfully installed. Additionally, a set of the new opto-boards have been subjected to an accelerated lifetime experiment at 85 C and 85% relative humidity for over 1,000 hours. No failures were observed. We are cautiously optimistic that the new opto-boards will survive until the shutdown for the detector upgrade for the high-luminosity Large Hadron Collider (HL-LHC)

  9. Studies of the ATLAS Inner Detector material using $\\sqrt{s}=$13 TeV $pp$ collision data

    CERN Document Server

    The ATLAS collaboration

    2015-01-01

    The ATLAS Inner Detector comprises three different technologies: the Pixel detector (Pixel), the silicon strip tracker (SCT), and the transition radiation drift tube tracker (TRT). The material in the ATLAS Inner Detector is studied with several methods, using the $pp$ collision sample collected at $\\sqrt{s}=$13 TeV in 2015. The material within the innermost barrel regions of the ATLAS Inner Detector is studied using reconstructed hadronic interaction and photon conversion vertices from samples of minimum bias events. It was found that the description of the Insertable B-Layer, which is the new, innermost Pixel layer installed in 2014, in the geometry model was missing some material components. After updating the model, data and simulation show good agreement at the barrel region. The Pixel services (cables, cooling pipes, support trays) were modified between the Pixel and SCT detectors in 2014. The material in this region is also studied by investigating the efficiency with which tracks reconstructed only in...

  10. Calibration/Survey/Alignment studies of STAR HFT Pixel Detector

    Science.gov (United States)

    Ma, Long

    2013-10-01

    As a critical component of the STAR inner tracking detector - Heavy Flavor Tracker (HFT), the pixel detector consists of 10 sectors with 400 million 20x20-micrometer pixels forming the two innermost layers of the HFT at radii of 2.5 and 8 cm, respectively. In Run-13, a three-sector prototype was installed and successfully integrated into STAR. To achieve physics goals of HFT, the alignment calibration of pixel detector to a high precision of ~10 microns is essential. The precision alignment to map out each pixel position within the sector is carried out via a survey measurement utilizing a Coordinate Measurement Machine with a repeatability of a few micrometers. The global position parameters of the pixel sectors with respect to the STAR TPC will be obtained via a track-based alignment method with beam collisions. Particularly, the sensitive area of the pixel detector is designed to have some overlaps in order to complete the relative alignment between sectors using tracks passing through the overlap region. In this presentation, we will present the alignment calibration procedure for the HFT pixel detector. Status of the alignment calibration for the pixel detector prototype in Run-13 will be discussed. for the STAR Collaboration

  11. The ATLAS Pixel nSQP Readout Chain

    CERN Document Server

    Welch, S; The ATLAS collaboration

    2012-01-01

    Concerns regarding the failure of off detector optical components caused concern that on detector optical components would begin to fail in the same way. Therefor, replacements for the current Pixel Detector Service Quarter Panels have been designed and are under construction. The design challenges of the nSQP project are discussed and an overview of the changes is given. The nSQP project allows a few other upgrades to the current detector which are described. Finally a description of the design validation and testing on the new components is given.

  12. Small pixel CZT detector for hard X-ray spectroscopy

    Science.gov (United States)

    Wilson, Matthew David; Cernik, Robert; Chen, Henry; Hansson, Conny; Iniewski, Kris; Jones, Lawrence L.; Seller, Paul; Veale, Matthew C.

    2011-10-01

    A new small pixel cadmium zinc telluride (CZT) detector has been developed for hard X-ray spectroscopy. The X-ray performance of four detectors is presented and the detectors are analysed in terms of the energy resolution of each pixel. The detectors were made from CZT crystals grown by the travelling heater method (THM) bonded to a 20×20 application specific integrated circuit (ASIC) and data acquisition (DAQ) system. The detectors had an array of 20×20 pixels on a 250 μm pitch, with each pixel gold-stud bonded to an energy resolving circuit in the ASIC. The DAQ system digitised the ASIC output with 14 bit resolution, performing offset corrections and data storage to disc in real time at up to 40,000 frames per second. The detector geometry and ASIC design was optimised for X-ray spectroscopy up to 150 keV and made use of the small pixel effect to preferentially measure the electron signal. A 241Am source was used to measure the spectroscopic performance and uniformity of the detectors. The average energy resolution (FWHM at 59.54 keV) of each pixel ranged from 1.09±0.46 to 1.50±0.57 keV across the four detectors. The detectors showed good spectral performance and uniform response over almost all pixels in the 20×20 array. A large area 80×80 pixel detector will be built that will utilise the scalable design of the ASIC and the large areas of monolithic spectroscopic grade THM grown CZT that are now available. The large area detector will have the same performance as that demonstrated here.

  13. A low mass pixel detector upgrade for CMS

    CERN Document Server

    Kaestli, Hans-Christian

    2010-01-01

    and commissioning of the present pixel detector, we intend to upgrade the whole pixel detector in 2015. The main focus is on lowering the material budget and adding more tracking points. We will present the design of a new low mass pixel system consisting of 4 barrel layers and 3 end cap disks on each side. The design comprises of thin detector modules and a lightweight mechanical support structure using CO2 cooling. In addition, large efforts have been made to move material from the services out of the tracking regi...

  14. ATLAS Beam Pipe and LUCID Detector

    CERN Multimedia

    CERN Audiovisual Service

    2008-01-01

    The film will show you the descending and installation of the last element of the LHC beam pipe. Around the beam pipe is installed an ATLAS detector called LUCID. The same kind of element is on both sides of ATLAS. This detector measures the rate of the collisions in ATLAS. You can also get more information about LUCID detector by watching the part were Vincent Hedberg is interviewed (00:01:20). Almost at the end of the film there is the interview of the Raymond Veness. He tells about the delicate operations of finishing the vacuum system and the LHC (00:26:00).

  15. New pixelized Micromegas detector for the COMPASS experiment

    CERN Document Server

    Neyret, Damien; Bedfer, Yann; Burtin, Etienne; d'Hose, Nicole; Giganon, Arnaud; Ketzer, Bernhard; Konorov, Igor; Kunne, Fabienne; Magnon, Alain; Marchand, Claude; Paul, Bernard; Platchkov, Stéphane; Vandenbroucke, Maxence

    2009-01-01

    New Micromegas (Micro-mesh gaseous detectors) are being developed in view of the future physics projects planned by the COMPASS collaboration at CERN. Several major upgrades compared to present detectors are being studied: detectors standing five times higher luminosity with hadron beams, detection of beam particles (flux up to a few hundred of kHz/mm^2, 10 times larger than for the present detectors) with pixelized read-out in the central part, light and integrated electronics, and improved robustness. Studies were done with the present detectors moved in the beam, and two first pixelized prototypes are being tested with muon and hadron beams in real conditions at COMPASS. We present here this new project and report on two series of tests, with old detectors moved into the beam and with pixelized prototypes operated in real data taking condition with both muon and hadron beams.

  16. Status of the CMS Phase I Pixel Detector Upgrade

    CERN Document Server

    Spannagel, Simon

    2015-01-01

    This contribution gives an overview of the design of the upgraded pixel detector and the status of the upgrade project, and presents test beam performance measurements of the production read-out chip.

  17. Monolithic CMOS pixel detector for international linear collider vertex detection

    Indian Academy of Sciences (India)

    J E Brau; O Igonkina; N Sinew; D Strom; C Baltay; W Emmet; H Neal; D Rabinowitz

    2007-12-01

    A monolithic CMS pixel detector is under development for an ILC experiment. This chronopixel array provides a time stamp resolution of one bunch crossing, a critical feature for background suppression. The status of this effort is summarized.

  18. The Pixels find their way to the heart of ATLAS

    CERN Multimedia

    Kevin Einsweiler

    Since the last e-news article on the Pixel Detector in December 2006, there has been much progress. At that time, we were just about to receive the Beryllium beampipe, and to integrate the innermost layer of the Pixel Detector around it. This innermost layer is referred to as the B-layer because of the powerful role it plays in finding the secondary vertices that are the key signature for the presence of b-quarks, and with somewhat greater difficulty, c-quarks and tau leptons. The integration of the central 7m long beampipe into the Pixel Detector was completed in December, and the B-layer was successfully integrated around it. In January this year, we had largely completed the central 1.5m long detector, including the three barrel layers and the three disk layers on each end of the barrel. Although this region contains all of the 80 million readout channels, it cannot be integrated into the Inner Detector without additional services and infrastructure. Therefore, the next step was to add the Service Panels...

  19. A new CMS pixel detector for the LHC luminosity upgrade

    OpenAIRE

    Favaro, Carlotta; Collaboration, for the CMS

    2011-01-01

    The CMS inner pixel detector system is planned to be replaced during the first phase of the LHC luminosity upgrade. The plans foresee an ultra low mass system with four barrel layers and three disks on either end. With the expected increase in particle rates, the electronic readout chain will be changed for fast digital signals. An overview of the envisaged design options for the upgraded CMS pixel detector is given, as well as estimates of the tracking and vertexing performance.

  20. Analysis methods of testbeam data of irradiated ATLAS Planar Pixel Sensors

    International Nuclear Information System (INIS)

    The ATLAS Pixel detector is the innermost subdetector of the ATLAS-Experiment at CERN. The development of new sensor technologies is going on as detector-upgrades are foreseen to cope with higher fluences and more pile-up-events after accelerator upgrades (SLHC). For testing properties of sensors, testbeams are used. Beam-telescopes such as the EUDET-Telescope have been used for measuring the exact position of beam-tracks to determine the properties of different sensor technologies. Several sensors with different designs (e.g. slim edges) were read-out in testbeam after irradiation at differing fluences (up to 2.1016 neqcm-2) and voltages (up to 1500 V) to observe the performance of the sensors under conditions up to the end-lifetime of the ATLAS detector. The reconstruction chain of the so called Eutelescope framework including adaptions and the evaluation of the reconstructed data are presented. Typical results including hit- and charge-efficiency plots are shown and interpreted.

  1. ATLAS detector records its first curved muon

    CERN Multimedia

    2007-01-01

    The barrel muon spectrometer of the ATLAS detector has acquired its first cosmic event in a magnetic field produced by the barrel toroid magnet. This was an important test of the chambers in their final configurations, and marked the first triggering and measurement of curved cosmic ray muons in ATLAS.

  2. Silicon Pixel Detectors for Synchrotron Applications

    CERN Document Server

    Stewart, Graeme Douglas

    Recent advances in particle accelerators have increased the demands being placed on detectors. Novel detector designs are being implemented in many different areas including, for example, high luminosity experiments at the LHC or at next generation synchrotrons. The purpose of this thesis was to characterise some of these novel detectors. The first of the new detector types is called a 3D detector. This design was first proposed by Parker, Kenney and Segal (1997). In this design, doped electrodes are created that extend through the silicon substrate. When compared to a traditional photodiode with electrodes on the opposing surfaces, the 3D design can combine a reasonable detector thickness with a small electrode spacing resulting in fast charge collection and limited charge sharing. The small electrode spacing leads to the detectors having lower depletion voltages. This, combined with the fast collection time, makes 3D detectors a candidate for radiation hard applications. These applications include the upgra...

  3. TCAD Simulations of ATLAS Pixel Guard Ring and Edge Structure for SLHC Upgrade

    CERN Document Server

    Lounis, A; The ATLAS collaboration; Calderini, G; Marchiori, G; Benoit, M; Dinu, N

    2010-01-01

    In this work, the magnitude of the electric field and the depletion inside a simplified two dimensional model of the ATLAS planar pixel sensor for the insertable b-layer and the super-LHC upgrade have been studied. The parameters influencing the breakdown behavior were studied using a finite-element method to solve the drift-diffusion equations coupled to Poisson's equation. Using these models, the number of guard rings, dead edge width and sensor's thickness were modified with respect to the ATLAS actual pixel sensor to investigate their influence on the sensor's depletion at the edge and on its internal electrical field distribution. The goal of the simulation is to establish a model to discriminate between different designs and to select the most optimized to fit the needs in radiation hardness and low material budget of ATLAS inner detector during super-LHC operation. A three defects level model has been implemented in the simulations to study the behavior of such sensors under different level of irradiat...

  4. The Phase-1 upgrade of the CMS silicon pixel detector

    CERN Document Server

    Menichelli, Mauro

    2015-01-01

    The present CMS pixel detector will be replaced in the shutdown period 2016/17 by an upgraded version due to the following reasons: increased luminosity at reduced bunch spacing ( from 7 x 10 33 cm - 2 s - 1 at 50 ns bunch spacing to 2 x 10 34 cm - 2 s - 1 at 25 ns bunch spacing) in the LHC , and radiation damage effects that will significantly degrade the present detector. The new upgraded detector will have higher tracking efficiency and lower mass with four barrel layer and three forward/backward disks to provide higher hit pixel coverage out to pseudorapidities of ±2.5. In this paper we will describe the new pixel detector focus ing mostly on the barrel detector design, construction and expected performances

  5. The Phase-1 Upgrade of the CMS Pixel Detector

    CERN Document Server

    Klein, Katja

    2016-01-01

    The CMS experiment features a pixel detector with three barrel layers and two disks per side, corresponding to an active silicon area of 1\\,m$^2$. The detector delivered high-quality data during LHC Run~1. However, the CMS pixel detector was designed for the nominal instantaneous LHC luminosity of $1\\cdot 10^{34}\\,$cm$^{-2}$s$^{-1}$. It is expected that the instantaneous luminosity will increase and reach twice the design value before Long Shutdown 3, scheduled for 2023. Under such conditions, the present readout chip would suffer from data loss due to buffer overflow, leading to significant inefficiencies of up to~16\\,\\%. The CMS collaboration is presently constructing a new pixel detector to replace the present device during the winter shutdown 2016/2017. The design of this new detector will be outlined, the construction status summarized and the performance described.

  6. First Results of the Pixel Detector Performance in 2015

    CERN Document Server

    CMS Collaboration

    2015-01-01

    The CMS pixel detector consists of 66 million pixels arranged in three cylindric layers in the barrel region and two end-cap disks on each side of the barrel. It is used for seeding in track reconstruction. It is also the most important tool for vertex reconstruction. This report documents the good fraction of the pixel detector at the start of data-taking in 2015, its efficiency at low luminosity and 50 ns bunch-spacing, and the first measurements of the Lorentz-angle. Details are also given on the timing adjustment in the first collisions, and verification of the full depletion voltage.

  7. Development of n-in-p pixel modules for the ATLAS Upgrade at HL-LHC

    CERN Document Server

    Macchiolo, Anna; Savic, Natascha; Terzo, Stefano

    2016-01-01

    Thin planar pixel modules are promising candidates to instrument the inner layers of the new ATLAS pixel detector for HL-LHC, thanks to the reduced contribution to the material budget and their high charge collection efficiency after irradiation. 100-200 $\\mu$m thick sensors, interconnected to FE-I4 read-out chips, have been characterized with radioactive sources and beam tests at the CERN-SPS and DESY. The results of these measurements are reported for devices before and after irradiation up to a fluence of $14\\times10^{15}$ n$_{eq}$/cm$^2$. The charge collection and tracking efficiency of the different sensor thicknesses are compared. The outlook for future planar pixel sensor production is discussed, with a focus on sensor design with the pixel pitches (50x50 and 25x100 $\\mu$m$^2$) foreseen for the RD53 Collaboration read-out chip in 65 nm CMOS technology. An optimization of the biasing structures in the pixel cells is required to avoid the hit efficiency loss presently observed in the punch-through region...

  8. Development of n-in-p pixel modules for the ATLAS upgrade at HL-LHC

    CERN Document Server

    Macchiolo, A.; Savic, N.; Terzo, S.

    2016-01-01

    Thin planar pixel modules are promising candidates to instrument the inner layers of the new ATLAS pixel detector for HL-LHC, thanks to the reduced contribution to the material budget and their high charge collection efficiency after irradiation. 100–200 μm thick sensors, interconnected to FE-I4 read-out chips, have been characterized with radioactive sources and beam tests at the CERN-SPS and DESY. The results of these measurements are reported for devices before and after irradiation up to a fluence of 14×1015 neq/cm2. The charge collection and tracking efficiency of the different sensor thicknesses are compared. The outlook for future planar pixel sensor production is discussed, with a focus on sensor design with the pixel pitches (50×50 and 25×100 μm2) foreseen for the RD53 Collaboration read-out chip in 65 nm CMOS technology. An optimization of the biasing structures in the pixel cells is required to avoid the hit efficiency loss presently observed in the punch-through region after irradiation. F...

  9. Characterization of active CMOS sensors for capacitively coupled pixel detectors

    Energy Technology Data Exchange (ETDEWEB)

    Hirono, Toko; Gonella, Laura; Janssen, Jens; Hemperek, Tomasz; Huegging, Fabian; Krueger, Hans; Wermes, Norbert [Institute of Physics, University of Bonn (Germany); Peric, Ivan [Institut fuer Prozessdatenverarbeitung und Elektronik, Karlsruher Institut fuer Technologie, Karlsruhe (Germany)

    2015-07-01

    Active CMOS pixel sensor is one of the most attractive candidates for detectors of upcoming particle physics experiments. In contrast to conventional sensors of hybrid detectors, signal processing circuit can be integrated in the active CMOS sensor. The characterization and optimization of the pixel circuit are indispensable to obtain a good performance from the sensors. The prototype chips of the active CMOS sensor were fabricated in the AMS 180nm and L-Foundry 150 nm CMOS processes, respectively a high voltage and high resistivity technology. Both chips have a charge sensitive amplifier and a comparator in each pixel. The chips are designed to be glued to the FEI4 pixel readout chip. The signals from 3 pixels of the prototype chips are capacitively coupled to the FEI4 input pads. We have performed lab tests and test beams to characterize the prototypes. In this presentation, the measurement results of the active CMOS prototype sensors are shown.

  10. Challenges of small-pixel infrared detectors: a review

    Science.gov (United States)

    Rogalski, A.; Martyniuk, P.; Kopytko, M.

    2016-04-01

    In the last two decades, several new concepts for improving the performance of infrared detectors have been proposed. These new concepts particularly address the drive towards the so-called high operating temperature focal plane arrays (FPAs), aiming to increase detector operating temperatures, and as a consequence reduce the cost of infrared systems. In imaging systems with the above megapixel formats, pixel dimension plays a crucial role in determining critical system attributes such as system size, weight and power consumption (SWaP). The advent of smaller pixels has also resulted in the superior spatial and temperature resolution of these systems. Optimum pixel dimensions are limited by diffraction effects from the aperture, and are in turn wavelength-dependent. In this paper, the key challenges in realizing optimum pixel dimensions in FPA design including dark current, pixel hybridization, pixel delineation, and unit cell readout capacity are outlined to achieve a sufficiently adequate modulation transfer function for the ultra-small pitches involved. Both photon and thermal detectors have been considered. Concerning infrared photon detectors, the trade-offs between two types of competing technology—HgCdTe material systems and III-V materials (mainly barrier detectors)—have been investigated.

  11. Micro-pixel accuracy centroid displacement estimation and detector calibration

    CERN Document Server

    Zhai, Chengxing; Goullioud, Renaud; Nemati, Bijan

    2011-01-01

    Precise centroid estimation plays a critical role in accurate astrometry using telescope images. Conventional centroid estimation fits a template point spread function (PSF) to the image data. Because the PSF is typically not known to high accuracy due to wavefront aberrations and uncertainties in optical system, a simple Gaussian function is commonly used. PSF knowledge error leads to systematic errors in the conventional centroid estimation. In this paper, we present an accurate centroid estimation algorithm by reconstructing the PSF from well sampled (above Nyquist frequency) pixelated images. In the limit of an ideal focal plane array whose pixels have identical response function (no inter-pixel variation), this method can estimate centroid displacement between two 32$\\times$32 images to sub-micropixel accuracy. Inter-pixel response variations exist in real detectors, {\\it e.g.}~CCDs, which we can calibrate by measuring the pixel response of each pixel in Fourier space. The Fourier transforms of the inter...

  12. A low mass pixel detector upgrade for CMS

    CERN Document Server

    Kästli, H C

    2010-01-01

    The CMS pixel detector has been designed for a peak luminosity of 10^34cm-2s-1 and a total dose corresponding to 2 years of LHC operation at a radius of 4 cm from the interaction region. Parts of the pixel detector will have to be replaced until 2015. The detector performance will be degraded for two reasons: radiation damage of the innermost layers and the planned increase of the LHC peak luminosity by a factor of 2-3. Based on the experience in planning, constructing and commissioning of the present pixel detector, we intend to upgrade the whole pixel detector in 2015. The main focus is on lowering the material budget and adding more tracking points. We will present the design of a new low mass pixel system consisting of 4 barrel layers and 3 end cap disks on each side. The design comprises of thin detector modules and a lightweight mechanical support structure using CO2 cooling. In addition, large efforts have been made to move material from the services out of the tracking region.

  13. Spectroscopic X-ray imaging with photon counting pixel detectors

    CERN Document Server

    Tlustos, L

    2010-01-01

    Single particle counting hybrid pixel detectors simultaneously provide low noise, high granularity and high readout speed and make it possible to build detector systems offering high spatial resolution paired with good energy resolution. A limiting factor for the spectroscopic performance of such detector systems is charge sharing between neighbouring pixels in the sensor part of the detector. The signal spectrum at the collection electrodes of the readout electronics deviates significantly from the photonic spectrum when planar segmented sensor geometries are used. The Medipix3 implements a novel, distributed signal processing architecture linking neighbouring pixels and aims at eliminating the spectral distortion produced in the sensor by charge sharing and at reducing the impact of fluorescence photons generated in the sensor itself. Preliminary results from the very first Medipix3 readouts bump bonded to 300 pm Si sensor are presented. Material reconstruction is a possible future application of spectrosco...

  14. The Level 0 Pixel Trigger System for the ALICE Silicon Pixel Detector: implementation, testing and commissioning

    CERN Document Server

    Aglieri-Rinella, G

    2008-01-01

    The ALICE Silicon Pixel Detector transmits 1200 Fast-OR signals every 100 ns on 120 optical readout channels. They indicate the presence of at least one hit in the pixel matrix of each readout chip. The ALICE Level 0 Pixel Trigger System extracts them, processes them and delivers an input signal to the Central Trigger Processor for the first level trigger decision within a latency of 800 ns. This paper describes tests and measurements made on the system during the qualification and commissioning phases. These included Bit Error Rate tests on the Fast-OR data path, the measurement of the overall process latency and the recording of calibration data with cosmic rays. The first results of the operation of the Pixel Trigger System with the SPD detector in the ALICE experiment are also presented.

  15. Hybrid Pixel Detectors for gamma/X-ray imaging

    Science.gov (United States)

    Hatzistratis, D.; Theodoratos, G.; Zografos, V.; Kazas, I.; Loukas, D.; Lambropoulos, C. P.

    2015-09-01

    Hybrid pixel detectors are made by direct converting high-Z semi-insulating single crystalline material coupled to complementary-metal-oxide semiconductor (CMOS) readout electronics. They are attractive because direct conversion exterminates all the problems of spatial localization related to light diffusion, energy resolution, is far superior from the combination of scintillation crystals and photomultipliers and lithography can be used to pattern electrodes with very fine pitch. We are developing 2-D pixel CMOS ASICs, connect them to pixilated CdTe crystals with the flip chip and bump bonding method and characterize the hybrids. We have designed a series of circuits, whose latest member consists of a 50×25 pixel array with 400um pitch and an embedded controller. In every pixel a full spectroscopic channel with time tagging information has been implemented. The detectors are targeting Compton scatter imaging and they can be used for coded aperture imaging too. Hybridization using CMOS can overcome the limit put on pixel circuit complexity by the use of thin film transistors (TFT) in large flat panels. Hybrid active pixel sensors are used in dental imaging and other applications (e.g. industrial CT etc.). Thus X-ray imaging can benefit from the work done on dynamic range enhancement methods developed initially for visible and infrared CMOS pixel sensors. A 2-D CMOS ASIC with 100um pixel pitch to demonstrate the feasibility of such methods in the context of X-ray imaging has been designed.

  16. Studio di Rivelatori a Pixel di nuova generazione per il Sistema di Tracciamento di ATLAS.

    CERN Document Server

    Gaudiello, Andrea; Schiavi, Carlo

    In 2013 the LHC will undergo a long shutdown (Phase 0) in preparation for a an energy and luminosity upgrade. During this period the ATLAS Pixel Detector (that is the tracking detector closest to the beamline) will be upgraded. The new detector, called Insertable B-Layer (IBL), will be installed between the existing pixel detector and a new beam-pipe of smaller radius in order to ensure and maintain excellent performance of tracking, vertexing and jet flavor tagging. To satisfy the new requirements a new electronic front- end (FE-I4) and 2 sensor technologies have been developed: Planar and 3D. Genova is one of two sites dedicated to the assembly of the modules of IBL. The work is then carried out in two parallel directions: on one hand the production and its optimization; on the other the comparison and testing of these new technologies. Chapter 1 gives an overview of the theoretical framework needed to understand the importance and the goals of the experiments operating at the Large Hadron Collider (LHC), w...

  17. The CMS pixel detector and challenges for its upgrade

    CERN Document Server

    Bean, A

    2009-01-01

    The CMS pixel detector was installed in July 2008 in the innermost region of CMS. It consists of 66M pixels of 100um*150um size over 3 barrel layers and 2 forward disks. The pixel system has been successfully commissioned. Over 80K muon tracks were taken during the CMS cosmic runs and the detector is ready for the first physics run. The pixel detector, so close to the interaction point, will be exposed to a very high radiation dose. The estimation is that the first barrel layer, located at 4.3 cm from the beam pipe, after 3 years of LHC running at full luminosity, will become inefficient for position resolution reconstruction. For this reason, a substitution of a new pixel detector in 2014 has been already scheduled. At the same time an LHC luminosity upgrade is also planned. While a simple rebuild of the current detector could be done, the expectation is to design a new one, optimized for higher luminosity. This paper describes the present system and its performance as well as possible solutions for the upgr...

  18. Combining two major ATLAS inner detector components

    CERN Multimedia

    Maximilien Brice

    2006-01-01

    The semiconductor tracker is inserted into the transition radiation tracker for the ATLAS experiment at the LHC. These make up two of the three major components of the inner detector. They will work together to measure the trajectories produced in the proton-proton collisions at the centre of the detector when the LHC is switched on in 2008.

  19. Alternative glues for the production of ATLAS silicon strip modules for the Phase-II upgrade of the ATLAS Inner Detector

    OpenAIRE

    Poley, Luise; Bloch, Ingo; Edwards, Sam; Friedrich, Conrad; Gregor, Ingrid-Maria; Jones, Tim; Lacker, Heiko; Pyatt, Simon; Rehnisch, Laura; Sperlich, Dennis; Wilson, John

    2015-01-01

    The Phase-II upgrade of the ATLAS detector for the High Luminosity Large Hadron Collider (HL-LHC) includes the replacement of the current Inner Detector with an all-silicon tracker consisting of pixel and strip detectors. The current Phase-II detector layout requires the construction of 20,000 strip detector modules consisting of sensor, circuit boards and readout chips, which are connected mechanically using adhesives. The adhesive between readout chips and circuit board is a silver epoxy gl...

  20. Small-Scale Readout Systems Prototype for the STAR PIXEL Detector

    OpenAIRE

    Szelezniak, Michal A.

    2008-01-01

    A prototype readout system for the STAR PIXEL detector in the Heavy Flavor Tracker (HFT) vertex detector upgrade is presented. The PIXEL detector is a Monolithic Active Pixel Sensor (MAPS) based silicon pixel vertex detector fabricated in a commercial CMOS process that integrates the detector and front-end electronics layers in one silicon die. Two generations of MAPS prototypes designed specifically for the PIXEL are discussed. We have constructed a prototype telescope system consisting of t...

  1. Design methodology: edgeless 3D ASICs with complex in-pixel processing for pixel detectors

    Energy Technology Data Exchange (ETDEWEB)

    Fahim Farah, Fahim Farah [Northwestern U. (main); Deptuch, Grzegorz W. [Fermilab; Hoff, James R. [Fermilab; Mohseni, Hooman [Northwestern U. (main)

    2015-08-28

    The design methodology for the development of 3D integrated edgeless pixel detectors with in-pixel processing using Electronic Design Automation (EDA) tools is presented. A large area 3 tier 3D detector with one sensor layer and two ASIC layers containing one analog and one digital tier, is built for x-ray photon time of arrival measurement and imaging. A full custom analog pixel is 65μm x 65μm. It is connected to a sensor pixel of the same size on one side, and on the other side it has approximately 40 connections to the digital pixel. A 32 x 32 edgeless array without any peripheral functional blocks constitutes a sub-chip. The sub-chip is an indivisible unit, which is further arranged in a 6 x 6 array to create the entire 1.248cm x 1.248cm ASIC. Each chip has 720 bump-bond I/O connections, on the back of the digital tier to the ceramic PCB. All the analog tier power and biasing is conveyed through the digital tier from the PCB. The assembly has no peripheral functional blocks, and hence the active area extends to the edge of the detector. This was achieved by using a few flavors of almost identical analog pixels (minimal variation in layout) to allow for peripheral biasing blocks to be placed within pixels. The 1024 pixels within a digital sub-chip array have a variety of full custom, semi-custom and automated timing driven functional blocks placed together. The methodology uses a modified mixed-mode on-top digital implementation flow to not only harness the tool efficiency for timing and floor-planning but also to maintain designer control over compact parasitically aware layout. The methodology uses the Cadence design platform, however it is not limited to this tool.

  2. Characterization of 36 pixel silicon PAD detectors

    International Nuclear Information System (INIS)

    As silicon detectors offer good energy resolution and high reliability, these are ideally suited for tracking and calorimetric applications in nuclear and particle physics experiments. The band gap of silicon is small enough to produce a good number of charge carriers per unit energy loss of the ionizing particles. Further, the high material density (2.33 g/cm3) leads to a large energy loss per traversed length for ionizing particle (3.8 MeV/cm for a minimum ionizing particle). The semiconductor fabrication technology is now mature enough to produce low leakage and fast response detectors, as the mobility degradation is minimum due to doping

  3. Thick Pixelated CZT Detectors With Isolated Steering Grids

    CERN Document Server

    Jung, I; Perkins, J S; Krawczynski, H; Matteson, J; Skelton, R T; Bürger, A; Groza, M

    2005-01-01

    We explore the possibility to improve the performance of 0.5 cm thick Cadmium Zinc Telluride (CZT) detectors with the help of steering grids on the anode side of the detectors. Steering grids can improve the energy resolution of CZT detectors by enhancing the small pixel effect; furthermore, they can increase their detection efficiency by steering electrons to the anode pixels which otherwise would drift to the area between pixels. Previously, the benefit of steering grids had been compromised by additional noise associated with currents between the steering grids and the anode pixels. We use thin film deposition techniques to isolate the steering grid from the CZT substrate by a 150 nm thick layer of the isolator Aluminiumoxide. While the thin layer does not affect the beneficial effect of the steering grid on the weighting potentials and the electric field inside the detector, it suppresses the currents between the steering grid and the anode pixels. In this contribution, we present first results from a 2 x...

  4. A prototype hybrid pixel detector ASIC for the CLIC experiment

    CERN Document Server

    Valerio, P; Arfaoui, S; Ballabriga, R; Benoit, M; Bonacini, S; Campbell, M; Dannheim, D; De Gaspari, M; Felici, D; Kulis, S; Llopart, X; Nascetti, A; Poikela, T; Wong, W S

    2014-01-01

    A prototype hybrid pixel detector ASIC specifically designed to the requirements of the vertex detector for CLIC is described and first electrical measurements are presented. The chip has been designed using a commercial 65 nm CMOS technology and comprises a matrix of 64x64 square pixels with 25 μm pitch. The main features include simultaneous 4-bit measure- ment of Time-over-Threshold (ToT) and Time-of-Arrival (ToA) with 10 ns accuracy, on-chip data compression and power pulsing capability.

  5. Design and development of the IBL-BOC firmware for the ATLAS Pixel IBL optical datalink system

    CERN Document Server

    AUTHOR|(INSPIRE)INSPIRE-00356268

    The Insertable $b$-Layer (IBL) is the first upgrade of the ATLAS Pixel detector at the LHC. It will be installed in the Pixel detector in 2013. The IBL will use a new sensor and readout technology, therefore the readout components of the current Pixel detector are redesigned for the readout of the IBL. In this diploma thesis the design and development of the firmware for the new IBL Back-of-Crate card (IBL-BOC) are described. The IBL-BOC is located on the off-detector side of the readout and performs the optical-electrical conversion and vice versa for the optical connection to and from the detector. To process the data transmitted to and received from the detector, the IBL-BOC uses multiple Field Programmable Gate Arrays (FPGA). The transmitted signal is a 40~Mb/s BiPhase Mark (BPM) encoded data stream, providing the timing, trigger and control to the detector. The received signal is a 160~Mb/s 8b10b encoded data stream, containing data from the detector. The IBL-BOC encodes and decodes these data streams. T...

  6. Design Methodology: ASICs with complex in-pixel processing for Pixel Detectors

    Energy Technology Data Exchange (ETDEWEB)

    Fahim, Farah [Fermilab

    2014-10-31

    The development of Application Specific Integrated Circuits (ASIC) for pixel detectors with complex in-pixel processing using Computer Aided Design (CAD) tools that are, themselves, mainly developed for the design of conventional digital circuits requires a specialized approach. Mixed signal pixels often require parasitically aware detailed analog front-ends and extremely compact digital back-ends with more than 1000 transistors in small areas below 100μm x 100μm. These pixels are tiled to create large arrays, which have the same clock distribution and data readout speed constraints as in, for example, micro-processors. The methodology uses a modified mixed-mode on-top digital implementation flow to not only harness the tool efficiency for timing and floor-planning but also to maintain designer control over compact parasitically aware layout.

  7. Low mass hybrid pixel detectors for the high luminosity LHC upgrade

    Energy Technology Data Exchange (ETDEWEB)

    Gonella, Laura

    2013-10-15

    Reducing material in silicon trackers is of major importance for a good overall detector performance, and poses severe challenges to the design of the tracking system. To match the low mass constraints for trackers in High Energy Physics experiments at high luminosity, dedicated technological developments are required. This dissertation presents three technologies to design low mass hybrid pixel detectors for the high luminosity upgrades of the LHC. The work targets specifically the reduction of the material from the detector services and modules, with novel powering schemes, flip chip and interconnection technologies. A serial powering scheme is prototyped, featuring a new regulator concept, a control and protection element, and AC-coupled data transmission. A modified flip chip technology is developed for thin, large area Front-End chips, and a via last Through Silicon Via process is demonstrated on existing pixel modules. These technologies, their developments, and the achievable material reduction are discussed using the upgrades of the ATLAS pixel detector as a case study.

  8. Low mass hybrid pixel detectors for the high luminosity LHC upgrade

    International Nuclear Information System (INIS)

    Reducing material in silicon trackers is of major importance for a good overall detector performance, and poses severe challenges to the design of the tracking system. To match the low mass constraints for trackers in High Energy Physics experiments at high luminosity, dedicated technological developments are required. This dissertation presents three technologies to design low mass hybrid pixel detectors for the high luminosity upgrades of the LHC. The work targets specifically the reduction of the material from the detector services and modules, with novel powering schemes, flip chip and interconnection technologies. A serial powering scheme is prototyped, featuring a new regulator concept, a control and protection element, and AC-coupled data transmission. A modified flip chip technology is developed for thin, large area Front-End chips, and a via last Through Silicon Via process is demonstrated on existing pixel modules. These technologies, their developments, and the achievable material reduction are discussed using the upgrades of the ATLAS pixel detector as a case study.

  9. A Cherenkov Detector for Monitoring ATLAS Luminosity

    CERN Document Server

    Sbrizzi, A; The ATLAS collaboration

    2010-01-01

    LUCID (LUminosity Cherenkov Integrating Detector) is the monitor of the luminosity delivered by the LHC accelerator to the ATLAS experiment. The detector is made of two symmetric arms deployed at about 17 m from the ATLAS interaction point. Each arm consists of an aluminum vessel containing 20 tubes, 15 mm diameter and 1500 mm length, and a Cherenkov gaseous radiator (C4F10) at about 1.1 bar absolute. The light generated by charged particles above the Cherenkov threshold is collected by photomultiplier tubes (PMT) directly placed at the tubes end. Thanks to an intrinsically fast response and to its custom readout electronics, LUCID estimates the number of interactions per LHC bunch crossing and provides an interaction trigger to the ATLAS experiment. The relevant details of the detector design and the expexted performance based on Monte Carlo simulations are presented, together with the first results obtained with pp collisions produced by LHC.

  10. Leakage current measurements on pixelated CdZnTe detectors

    International Nuclear Information System (INIS)

    In the field of the R and D of a new generation hard X-ray cameras for space applications we focus on the use of pixelated CdTe or CdZnTe semiconductor detectors. They are covered with 64 (0.9x0.9 mm2) or 256 (0.5x0.5 mm2) pixels, surrounded by a guard ring and operate in the energy ranging from several keV to 1 MeV, at temperatures between -20 and +20 oC. A critical parameter in the characterisation of these detectors is the leakage current per pixel under polarisation (∼50-500 V/mm). In operation mode each pixel will be read-out by an integrated spectroscopy channel of the multi-channel IDeF-X ASIC currently developed in our lab. The design and functionality of the ASIC depends directly on the direction and value of the current. A dedicated and highly insulating electronics circuit is designed to automatically measure the current in each individual pixel, which is in the order of tens of pico-amperes. Leakage current maps of different CdZnTe detectors of 2 and 6 mm thick and at various temperatures are presented and discussed. Defect density diagnostics have been performed by calculation of the activation energy of the material

  11. Readout chip for the CMS pixel detector upgrade

    International Nuclear Information System (INIS)

    For the CMS experiment a new pixel detector is planned for installation during the extended shutdown in winter 2016/2017. Among the changes of the detector modified front end electronics will be used for higher efficiency at peak luminosity of the LHC and faster readout. The first prototype versions of the new readout chip have been designed and produced. The results of qualification and calibration for the new chip are presented in this paper

  12. Readout chip for the CMS pixel detector upgrade

    Science.gov (United States)

    Rossini, Marco

    2014-11-01

    For the CMS experiment a new pixel detector is planned for installation during the extended shutdown in winter 2016/2017. Among the changes of the detector modified front end electronics will be used for higher efficiency at peak luminosity of the LHC and faster readout. The first prototype versions of the new readout chip have been designed and produced. The results of qualification and calibration for the new chip are presented in this paper.

  13. The ALFA Roman Pot Detectors of ATLAS

    CERN Document Server

    Khalek, S Abdel; Anghinolfi, F; Barrillon, P; Blanchot, G; Blin-Bondil, S; Braem, A; Chytka, L; Muíño, P Conde; Düren, M; Fassnacht, P; Franz, S; Gurriana, L; Grafström, P; Heller, M; Haguenauer, M; Hain, W; Hamal, P; Hiller, K; Iwanski, W; Jakobsen, S; Joram, C; Kötz, U; Korcyl, K; Kreutzfeldt, K; Lohse, T; Maio, A; Maneira, M J P; Notz, D; Nozka, L; Palma, A; Petschull, D; Pons, X; Puzo, P; Ravat, S; Schneider, T; Seabra, L; Sykora, T; Staszewski, R; Stenzel, H; Trzebinski, M; Valkar, S; Viti, M; Vorobel, V; Wemans, A

    2016-01-01

    The ATLAS Roman Pot system is designed to determine the total proton-proton cross-section as well as the luminosity at the Large Hadron Collider (LHC) by measuring elastic proton scattering at very small angles. The system is made of four Roman Pot stations, located in the LHC tunnel in a distance of about 240~m at both sides of the ATLAS interaction point. Each station is equipped with tracking detectors, inserted in Roman Pots which approach the LHC beams vertically. The tracking detectors consist of multi-layer scintillating fibre structures readout by Multi-Anode-Photo-Multipliers.

  14. KPIX a pixel detector imaging chip

    CERN Document Server

    Cadeddu, S; Caria, M

    2002-01-01

    We present a VLSI custom device, named KPIX, developed in a 0.6 mu m CMOS technology. The circuit is dedicated to readout solid-state detectors covering large areas (on the order of square centimetre) and featuring very small currents. KPIX integrates 1024 channels (current amplifiers) and 8 ADCs on a 15.5x4 mm sup 2 area. Both an analogue and digital readout are allowed, with a 10 bit amplitude resolution. Amplifiers are organized in 8 columns of 128 rows. When choosing the digital or the analogue readout, the complete set of channels can be read out in about 30 ms. The specific design of the amplification cells allows to measure very small input current levels, on the order of fractions of pico-ampere. Power consumption has also been kept at the level of 80 mu W per cell and 150 mW (peak value) in total. The specific chip architecture and geometry allow use of many KPIX circuits together in order to serve a large detector sensitive area. The KPIX structure is presented along with some measurements character...

  15. The first bump-bonded pixel detectors on CVD diamond

    Science.gov (United States)

    Adam, W.; Bauer, C.; Berdermann, E.; Bergonzo, P.; Bogani, F.; Borchi, E.; Brambilla, A.; Bruzzi, M.; Colledani, C.; Conway, J.; Dabrowski, W.; Delpierre, P.; Deneuville, A.; Dulinski, W.; van Eijk, B.; Fallou, A.; Fizzotti, F.; Foulon, F.; Friedl, M.; Gan, K. K.; Gheeraert, E.; Grigoriev, E.; Hallewell, G.; Hall-Wilton, R.; Han, S.; Hartjes, F.; Hrubec, J.; Husson, D.; Kagan, H.; Kania, D.; Kaplon, J.; Karl, C.; Kass, R.; Krammer, M.; Logiudice, A.; Lu, R.; Manfredi, P. F.; Manfredotti, C.; Marshall, R. D.; Meier, D.; Mishina, M.; Oh, A.; Palmieri, V. G.; Pan, L. S.; Peitz, A.; Pernicka, M.; Pirollo, S.; Polesello, P.; Pretzl, K.; Re, V.; Riester, J. L.; Roe, S.; Roff, D.; Rudge, A.; Schnetzer, S.; Sciortino, S.; Speziali, V.; Stelzer, H.; Steuerer, J.; Stone, R.; Tapper, R. J.; Tesarek, R.; Trawick, M.; Trischuk, W.; Turchetta, R.; Vittone, E.; Wagner, A.; Walsh, A. M.; Wedenig, R.; Weilhammer, P.; Zeuner, W.; Ziock, H.; Zoeller, M.; Charles, E.; Ciocio, A.; Dao, K.; Einsweiler, K.; Fasching, D.; Gilchriese, M.; Joshi, A.; Kleinfelder, S.; Milgrome, O.; Palaio, N.; Richardson, J.; Sinervo, P.; Zizka, G.; RD42 Collaboration

    1999-11-01

    Diamond is a nearly ideal material for detecting ionising radiation. Its outstanding radiation hardness, fast charge collection and low leakage current allow it to be used in high radiation environments. These characteristics make diamond sensors particularly appealing for use in the next generation of pixel detectors. Over the last year, the RD42 collaboration has worked with several groups that have developed pixel readout electronics in order to optimise diamond sensors for bump-bonding. This effort resulted in an operational diamond pixel sensor that was tested in a pion beam. We demonstrate that greater than 98% of the channels were successfully bump-bonded and functioning. The device shows good overall hit efficiency as well as clear spatial hit correlation to tracks measured in a silicon reference telescope. A position resolution of 14.8 μm was observed, consistent with expectations given the detector pitch.

  16. Studies of mono-crystalline CVD diamond pixel detectors

    Science.gov (United States)

    Bugg, W.; Hollingsworth, M.; Spanier, S.; Yang, Z.; Bartz, E.; Doroshenko, J.; Hits, D.; Schnetzer, S.; Stone, R.; Atramentov, O.; Patel, R.; Barker, A.; Hall-Wilton, R.; Ryjov, V.; Farrow, C.; Pernicka, M.; Steininger, H.; Johns, W.; Halyo, V.; Harrop, B.; Hunt, A.; Marlow, D.; Hebda, P.

    2011-09-01

    The Pixel Luminosity Telescope (PLT) is a dedicated luminosity monitor, presently under construction, for the Compact Muon Solenoid (CMS) experiment at the Large Hadron Collider (LHC). It measures the particle flux in several three layered pixel diamond detectors that are aligned precisely with respect to each other and the beam direction. At a lower rate it also performs particle track position measurements. The PLT's mono-crystalline CVD diamonds are bump-bonded to the same readout chip used in the silicon pixel system in CMS. Mono-crystalline diamond detectors have many attributes that make them desirable for use in charged particle tracking in radiation hostile environments such as the LHC. In order to further characterize the applicability of diamond technology to charged particle tracking we performed several tests with particle beams that included a measurement of the intrinsic spatial resolution with a high resolution beam telescope.

  17. Studies of mono-crystalline CVD diamond pixel detectors

    CERN Document Server

    Bartz, E; Atramentov, O; Yang, Z; Hall-Wilton, R; Schnetzer, S; Patel, R; Bugg, W; Hebda, P; Halyo, V; Hunt, A; Marlow, D; Steininger, H; Ryjov, V; Hits, D; Spanier, S; Pernicka, M; Johns, W; Doroshenko, J; Hollingsworth, M; Harrop, B; Farrow, C; Stone, R

    2011-01-01

    The Pixel Luminosity Telescope (PLT) is a dedicated luminosity monitor, presently under construction, for the Compact Muon Solenoid (CMS) experiment at the Large Hadron Collider (LHC). It measures the particle flux in several three layered pixel diamond detectors that are aligned precisely with respect to each other and the beam direction. At a lower rate it also performs particle track position measurements. The PLTs mono-crystalline CVD diamonds are bump-bonded to the same readout chip used in the silicon pixel system in CMS. Mono-crystalline diamond detectors have many attributes that make them desirable for use in charged particle tracking in radiation hostile environments such as the LHC. In order to further characterize the applicability of diamond technology to charged particle tracking we performed several tests with particle beams that included a measurement of the intrinsic spatial resolution with a high resolution beam telescope. Published by Elsevier B.V.

  18. The first bump-bonded pixel detectors on CVD diamond

    CERN Document Server

    Adam, W; Berdermann, E; Bergonzo, P; Bogani, F; Borchi, E; Brambilla, A; Bruzzi, Mara; Colledani, C; Conway, J; Dabrowski, W; Delpierre, P A; Deneuville, A; Dulinski, W; van Eijk, B; Fallou, A; Fizzotti, F; Foulon, F; Fried, M; Gan, K K; Gheeraert, E; Grigoriev, E; Hallewell, G D; Hall-Wilton, R; Han, S; Hartjes, F G; Hrubec, Josef; Husson, D; Kagan, H; Kania, D R; Kaplon, J; Karl, C; Kass, R; Krammer, Manfred; Lo Giudice, A; Lü, R; Manfredi, P F; Manfredotti, C; Marshall, R D; Meier, D; Mishina, M; Oh, A; Palmieri, V G; Pan, L S; Peitz, A; Pernicka, Manfred; Pirollo, S; Polesello, P; Pretzl, Klaus P; Re, V; Riester, J L; Roe, S; Roff, D G; Rudge, A; Schnetzer, S R; Sciortino, S; Speziali, V; Stelzer, H; Steuerer, J; Stone, R; Tapper, R J; Tesarek, R J; Trawick, M L; Trischuk, W; Turchetta, R; Vittone, E; Wagner, A; Walsh, A M; Wedenig, R; Weilhammer, Peter; Zeuner, W; Ziock, H J; Zöller, M; Charles, E; Ciocio, A; Dao, K; Einsweiler, Kevin F; Fasching, D; Gilchriese, M G D; Joshi, A; Kleinfelder, S A; Milgrome, O; Palaio, N; Richardson, J; Sinervo, P K; Zizka, G

    1999-01-01

    Diamond is a nearly ideal material for detecting ionising radiation. Its outstanding radiation hardness, fast charge collection and low leakage current allow it to be used in high radiation environments. These characteristics make diamond sensors particularly appealing for use in the next generation of pixel detectors. Over the last year, the RD42 collaboration has worked with several groups that have developed pixel readout electronics in order to optimise diamond sensors for bump-bonding. This effort resulted in an operational diamond pixel sensor that was tested in a pion beam. We demonstrate that greater than 98565544f the channels were successfully bump-bonded and functioning. The device shows good overall hit efficiency as well as clear spatial hit correlation to tracks measured in a silicon reference telescope. A position resolution of 14.8 mu m was observed, consistent with expectations given the detector pitch. (13 refs).

  19. The first bump-bonded pixel detectors on CVD diamond

    Energy Technology Data Exchange (ETDEWEB)

    Adam, W.; Bauer, C.; Berdermann, E.; Bergonzo, P.; Bogani, F.; Borchi, E.; Brambilla, A.; Bruzzi, M.; Colledani, C.; Conway, J.; Dabrowski, W.; Delpierre, P.; Deneuville, A.; Dulinski, W.; Eijk, B. van; Fallou, A.; Fizzotti, F.; Foulon, F.; Friedl, M.; Gan, K.K.; Gheeraert, E.; Grigoriev, E.; Hallewell, G.; Hall-Wilton, R.; Han, S.; Hartjes, F.; Hrubec, J.; Husson, D.; Kagan, H.; Kania, D.; Kaplon, J.; Karl, C.; Kass, R.; Krammer, M.; Logiudice, A.; Lu, R.; Manfredi, P.F.; Manfredotti, C.; Marshall, R.D.; Meier, D.; Mishina, M.; Oh, A.; Palmieri, V.G.; Pan, L.S.; Peitz, A.; Pernicka, M.; Pirollo, S.; Polesello, P.; Pretzl, K.; Re, V.; Riester, J.L.; Roe, S.; Roff, D.; Rudge, A.; Schnetzer, S.; Sciortino, S.; Speziali, V.; Stelzer, H.; Steuerer, J.; Stone, R.; Tapper, R.J.; Tesarek, R.; Trawick, M.; Trischuk, W. E-mail: william@physics.utoronto.ca; Turchetta, R.; Vittone, E.; Wagner, A.; Walsh, A.M.; Wedenig, R.; Weilhammer, P.; Zeuner, W.; Ziock, H.; Zoeller, M.; Charles, E.; Ciocio, A.; Dao, K.; Einsweiler, K.; Fasching, D.; Gilchriese, M.; Joshi, A.; Kleinfelder, S.; Milgrome, O.; Palaio, N.; Richardson, J.; Sinervo, P.; Zizka, G

    1999-11-01

    Diamond is a nearly ideal material for detecting ionising radiation. Its outstanding radiation hardness, fast charge collection and low leakage current allow it to be used in high radiation environments. These characteristics make diamond sensors particularly appealing for use in the next generation of pixel detectors. Over the last year, the RD42 collaboration has worked with several groups that have developed pixel readout electronics in order to optimise diamond sensors for bump-bonding. This effort resulted in an operational diamond pixel sensor that was tested in a pion beam. We demonstrate that greater than 98% of the channels were successfully bump-bonded and functioning. The device shows good overall hit efficiency as well as clear spatial hit correlation to tracks measured in a silicon reference telescope. A position resolution of 14.8 {mu}m was observed, consistent with expectations given the detector pitch.

  20. The first bump-bonded pixel detectors on CVD diamond

    International Nuclear Information System (INIS)

    Diamond is a nearly ideal material for detecting ionising radiation. Its outstanding radiation hardness, fast charge collection and low leakage current allow it to be used in high radiation environments. These characteristics make diamond sensors particularly appealing for use in the next generation of pixel detectors. Over the last year, the RD42 collaboration has worked with several groups that have developed pixel readout electronics in order to optimise diamond sensors for bump-bonding. This effort resulted in an operational diamond pixel sensor that was tested in a pion beam. We demonstrate that greater than 98% of the channels were successfully bump-bonded and functioning. The device shows good overall hit efficiency as well as clear spatial hit correlation to tracks measured in a silicon reference telescope. A position resolution of 14.8 μm was observed, consistent with expectations given the detector pitch

  1. CMS Technical Design Report for the Pixel Detector Upgrade

    CERN Document Server

    Dominguez, A; Arndt, K; Bacchetta, N; Ball, A; Bartz, E; Bertl, W; Bilei, G M; Bolla, G; Cheung, H W K; Chertok, M; Costa, S; Demaria, N; Dominguez, A; Ecklund, K; Erdmann, W; Gill, K; Hall, G; Harder, K; Hartmann, F; Horisberger, R; Johns, W; Kaestli, H C; Klein, K; Kotlinski, D; Kwan, S; Pesaresi, M; Postema, H; Rohe, T; Schäfer, C; Starodumov, A; Streuli, S; Tricomi, A; Tropea, P; Troska, J; Vasey, F; Zeuner, W

    2012-01-01

    The original design goal of the LHC was to operate at $1 \\times 10^{34}$ cm$^{−2}s^{−1}$ with 25 ns bunch spacing, where approximately 25 simultaneous inelastic collisions per crossing (“pile-up”) occur. With the upgrade of the accelerators, the lumi- nosity and pile-up will more than double. The current pixel detector is crucial to charged particle tracking, but was not designed to perform effectively in such collision conditions and the physics program of CMS would suffer as a result. We propose to replace the current pixel tracker with a new high efficiency and low mass detector with four barrel layers and three forward/backward disks to provide four-hit pixel coverage out to pseudorapidities of ±2.5. This new detector will meet or exceed the original design specifications in these high luminosity environments. In this report, we provide details on the design, construction and installation of the upgraded pixel detector as well as estimates of its expected performance.

  2. Pixelated Single-crystal Diamond Detector for fast neutron measurements

    International Nuclear Information System (INIS)

    Single-crystal Diamond Detectors (SDDs), due to their high radiation hardness, fast response time and small size, are good candidates as fast neutron detectors in those environments where the high neutron flux is an issue, such as spallation neutron sources and the next generation thermonuclear fusion plasmas, i.e. the ITER experiment. Neutron detection in SDDs is based on the collection of electron-hole pairs produced by charged particles generated by neutron interactions with 12C. Recent measurements have demonstrated the SDD capability of measuring the neutron flux with a good energy resolution and at high rates. In this work a novel detector based on a 12-pixels SDD matrix will be presented. Each pixel is equipped with an independent electronic chain: the fast shaping preamplifier coupled to a digitizer is able to combine the high rate capability and the good energy resolution. Two CAEN digitizers are compared and the possibility of performing good energy resolution measurements (<2%) and at high rates (>1 MHz per channel) is described. Each pixel was characterized and calibrated using an 241Am source: the energy resolution was evaluated and gives a mean value of 1.73% at 5.5 MeV. The good energy resolution achieved and its uniformity between pixels are the demonstration of the capability of this novel detector as a spectrometer. This system will be installed during the next Deuterium-Tritium campaign on a collimated vertical line of sight at JET for 14 MeV neutron measurements

  3. Properties of Neutron Pixel Detector Based on Medipix-2 Device

    Czech Academy of Sciences Publication Activity Database

    Jakůbek, J.; Holý, T.; Lehmann, E.; Pospíšil, S.; Uher, J.; Vacík, J.; Vavřík, Daniel

    Řím : Nuclear & Plasma Sciences Society, 2004, s. 54. [Nuclear Science Symposium IEEE 2003. Řím (IT), 16.10.2004-22.10.2004] Institutional research plan: CEZ:AV0Z2071913 Keywords : neutron radiography * neutron pixel detector * digital radiography Subject RIV: BG - Nuclear, Atomic and Molecular Physics, Colliders

  4. Spatial Resolution of the Medipix-2 as Neutron Pixel Detector

    Czech Academy of Sciences Publication Activity Database

    Jakůbek, J.; Holý, T.; Lehmann, E.; Pospíšil, S.; Uher, J.; Vacík, J.; Vavřík, Daniel

    Glasgow, Scotland : Glasgow University, 2004, s. 1. [International Workshop on Radiation Imaging Detectors /6./. Glasgow, Scotland (GB), 25.07.2004-29.07.2004] Institutional research plan: CEZ:AV0Z2071913 Keywords : Neutron Radiography * Digital Radiography * Single Photon Counting Pixel Device Subject RIV: BF - Elementary Particles and High Energy Physics

  5. Spatial resolution of Medipix-2 device as neutron pixel detector

    Czech Academy of Sciences Publication Activity Database

    Jakůbek, J.; Holý, T.; Lehmann, E.; Pospíšil, S.; Uher, J.; Vacík, Jiří; Vavřík, D.

    2005-01-01

    Roč. 546, - (2005), s. 164-169. ISSN 0168-9002 R&D Projects: GA MŠk(CZ) 1P04LA211 Institutional research plan: CEZ:AV0Z10480505 Keywords : neutron detection * pixel detectors * neutronography Subject RIV: BG - Nuclear, Atomic and Molecular Physics, Colliders Impact factor: 1.224, year: 2005

  6. The ATLAS Inner Detector operation,data quality and tracking performance.

    CERN Document Server

    Stanecka, E; The ATLAS collaboration

    2012-01-01

    The ATLAS Inner Detector comprises silicon and gas based detectors. The Semi-Conductor Tracker (SCT) and the Pixel Detector are the key precision tracking silicon devices in the Inner Detector of the ATLAS experiment at CERN LHC. And the the Transition Radiation Tracker (TRT), the outermost of the three subsystems of the ATLAS Inner Detector is made of thin-walled proportional-mode drift tubes (straws). The Pixel Detector consists of approximately 80 million pixels that are individually read out via chips bump-bonded to 1744 n-in-n silicon substrates. The SCT is a silicon strip detector and is constructed of 4088 silicon detector modules for a total of 6.3 million strips. Each module is designed, constructed and tested to operate as a stand-alone unit, mechanically, electrically, optically and thermally. The SCT silicon micro-strip sensors are processed in the planar p-in-n technology. The signals from the strips are processed in the front-end ASICS ABCD3TA, working in the binary readout mode. The TRT is made...

  7. Development of a custom on-line ultrasonic vapour analyzer and flow meter for the ATLAS inner detector, with application to Cherenkov and gaseous charged particle detectors

    OpenAIRE

    Alhrooba, M.; Batesb, R.; Degeorged, C.; Deterree, C.; DiGirolamoc, B.; Doubekf, M.; Favrec, G.; Godlewskib, J.; Hallewellg, G.; Hasiba, A.; Katuninh, S.; Langeving, N.; Battistinc, M.; Lombardc, D.; Mathieug, M.

    2015-01-01

    Precision sound velocity measurements can simultaneously determine binary gas composition and flow. We have developed an analyzer with custom microcontroller-based electronics, currently used in the ATLAS Detector Control System, with numerous potential applications. Three instruments monitor C3F8 and CO2 coolant leak rates into the nitrogen envelopes of the ATLAS silicon microstrip and Pixel detectors. Two further instruments will aid operation of the new thermosiphon coolant recirculator: o...

  8. Active Pixel Sensors in ams H18/H35 HV-CMOS Technology for the ATLAS HL-LHC Upgrade

    CERN Document Server

    Ristic, Branislav

    2016-01-01

    Deep sub micron HV-CMOS processes offer the opportunity for sensors built by industry standard techniques while being HV tolerant, making them good candidates for drift-based, fast collecting, thus radiation-hard pixel detectors. For the upgrade of the ATLAS Pixel Detector towards the HL-LHC requirements, active pixel sensors in HV-CMOS technology were investigated. These implement amplifier and discriminator stages directly in insulating deep n-wells, which also act as collecting electrodes. The deep n-wells allow for bias voltages up to 150V leading to a depletion depth of several 10um. Prototype sensors in the ams H18 180nm and H35 350nm HV-CMOS processes have been manufactured, acting as a potential drop-in replacement for the current ATLAS Pixel sensors, thus leaving higher level processing such as trigger handling to dedicated read-out chips. Sensors were thoroughly tested in lab measurements as well as in testbeam experiments. Irradiation with X-rays and protons revealed a tolerance to ionizing doses o...

  9. A Sealed Gas Pixel Detector for X-ray Astronomy

    OpenAIRE

    Bellazzini, R.; Spandre, G.; Minuti, M.; Baldini, L; Brez, A.; Latronico, L; Omodei, N.; Razzano, M.; Massai, M. M.; Pinchera, M.; Pesce-Rollins, M.; SGRO, C.; Costa, E; P. Soffitta(a); Sipila, H.

    2006-01-01

    We report on the results of a new, sealed, Gas Pixel Detector. The very compact design and the absence of the gas flow system, make this detector substantially ready for use as focal plane detector for future X-ray space telescopes. The instrument brings high sensitivity to X-ray polarimetry, which is the last unexplored field of X-ray astronomy. It derives the polarization information from the track of the photoelectrons that are imaged by a high gain (>1000), fine pitch GEM that matches the...

  10. CMOS Monolithic Active Pixel Sensors (MAPS) for future vertex detectors

    International Nuclear Information System (INIS)

    This paper reviews the development of CMOS Monolithic Active Pixel Sensors (MAPS) for future vertex detectors. MAPS are developed in a standard CMOS technology. In the imaging field, where the technology found its first applications, they are also known as CMOS Image Sensors. The use of MAPS as a detector for particle physics was first proposed at the end of 1999. Since then, their good performance in terms of spatial resolution, efficiency, radiation hardness have been demonstrated and work is now well under way to deliver the first MAPS-based vertex detectors

  11. CMOS Monolithic Active Pixel Sensors (MAPS) for future vertex detectors

    CERN Document Server

    Turchetta, R

    2006-01-01

    This paper reviews the development of CMOS Monolithic Active Pixel Sensors (MAPS) for future vertex detectors. MAPS are developed in a standard CMOS technology. In the imaging field, where the technology found its first applications, they are also known as CMOS Image Sensors. The use of MAPS as a detector for particle physics was first proposed at the end of 1999. Since then, their good performance in terms of spatial resolution, efficiency, radiation hardness have been demonstrated and work is now well under way to deliver the first MAPS-based vertex detectors.

  12. Compensation of radiation damages for SOI pixel detector via tunneling

    CERN Document Server

    Yamada, Miho; Kurachi, Ikuo

    2015-01-01

    We are developing monolithic pixel detectors based on SOI technology for high energy physics, X-ray applications and so on.To employ SOI pixel detector on such radiation environments, we have to solve effects of total ionization damages (TID) for transistors which are enclosed in oxide layer.The holes which are generated and trapped in the oxide layers after irradiation affect characteristics of near-by transistors due to its positive electric field.Annealing and radiation of ultraviolet are not realistic to remove trapped holes for a fabricated detector due to thermal resistance of components and difficulty of handling. We studied compensation of TID effects by tunneling using a high-voltage. For decrease of trapped holes, applied high-voltage to buried p-well which is under oxide layer to inject the electrons into the oxide layer.In this report, recent progress of this study is shown.

  13. GaAs Medipix2 hybrid pixel detector

    CERN Document Server

    Kostamo, P; Vähänen, S; Tlustos, L; Fröjdh, C; Campbell, M; Zhilyaev, Y; Lipsanen, H

    2008-01-01

    A GaAs Medipix2 hybrid pixel detector based on high purity epitaxial GaAs material was successfully fabricated. The mesa type GaAs sensor with 256×256 pixels and total area of 1.4×1.4 cm2 was made of a 140-μm-thick epitaxial p–i–n structure utilizing reactive ion etching. A final thickness of approximately 110 μm for the all-epitaxial sensor element is achieved by back-thinning procedure. The sensor element is bump bonded to a Medipix2 read-out ASIC. The detector is capable of room temperature spectroscopic operation and it demonstrates the potential of GaAs for high resolution X-ray imaging systems operating at room temperature. This work describes the manufacturing process and electrical properties of the GaAs Medipix2 hybrid detector.

  14. An EUDET/AIDA Pixel Beam Telescope for Detector Development

    CERN Document Server

    Rubinskiy, I

    2015-01-01

    Ahigh resolution(σ< 2 μm) beam telescope based on monolithic active pixel sensors (MAPS) was developed within the EUDET collaboration. EUDET was a coordinated detector R&D programme for the future International Linear Collider providing test beam infrastructure to detector R&D groups. The telescope consists of six sensor planes with a pixel pitch of either 18.4 μm or 10 μmand canbe operated insidea solenoidal magnetic fieldofupto1.2T.Ageneral purpose cooling, positioning, data acquisition (DAQ) and offine data analysis tools are available for the users. The excellent resolution, readout rate andDAQintegration capabilities made the telescopea primary beam tests tool also for several CERN based experiments. In this report the performance of the final telescope is presented. The plans for an even more flexible telescope with three differentpixel technologies(ATLASPixel, Mimosa,Timepix) withinthenew European detector infrastructure project AIDA are presented.

  15. Pixel hybrid photon detectors for the ring imaging Cherenkov detectors of LHCb

    CERN Document Server

    Somerville, L

    2005-01-01

    A Pixel Hybrid Photon Detector (pixel HPD) has been developed for the LHCb Ring Imaging Cherenkov (RICH) detectors. The pixel HPD is a vacuum tube with a multi-alkali photocathode, high-voltage cross- focused electron optics and an anode consisting of a silicon pixel detector bump-bonded to a CMOS readout chip; the readout chip is thus fully encapsulated in the device. The pixel HPD fulfils the stringent requirements for the RICH detectors of LHCb, combining single photon sensitivity, high signal-to-noise ratio and fast readout with an ~8cm diameter active area and an effective pixel size of 2.5mm 2.5mm at the photocathode. The performance and characteristics of two prototype pixel HPDs have been studied in laboratory measurements and in recent beam tests. The results of all measurements agree with expectations and fulfil the LHCb RICH requirements. In readiness for production of the ~500pixel HPDs for the RICH detectors, a test programme was designed and implemented to ensure component quality control at eac...

  16. A new sub-detector for ATLAS

    CERN Multimedia

    Marco Bruschi

    Since last August, the ATLAS detector family has been joined by a new little member named LUCID, from the acronym "LUminosity Cerenkov Integrating Detector". This may well surprise you if you are already aware that LUCID construction started only in February after its approval by an ATLAS-management mandated review committee. The rapid progress from approval to installation is the result of the close collaboration between groups from Alberta (Canada), INFN Bologna (Italy), Lund (Sweden) and CERN. LUCID is primarily intended to measure the luminosity delivered by the LHC to ATLAS with a systematic uncertainty in the range of a few percent. To achieve such a precision and still meet the demanding installation schedule, the LUCID developers prized simplicity and robustness above all. One of the LUCID vessels while under construction. One can see the aluminum Cerenkov tubes and the photomultiplier mount (plugged into the upper flange). The two fully assembled LUCID vessels seen from the front end elect...

  17. Use of silicon pixel detectors in double electron capture experiments

    Energy Technology Data Exchange (ETDEWEB)

    Cermak, P; Stekl, I; Mamedov, F; Rukhadze, E N; Jose, J M; Cermak, J [Institute of Experimental and Applied Physics, Czech Technical University in Prague, Horska 3a/22, 12800 Prague 2 (Czech Republic); Shitov, Yu A; Rukhadze, N I; Brudanin, V B [Joint Institute for Nuclear Research, Joliot-Curie 6, 141980 Dubna, Moscow region (Russian Federation); Loaiza, P, E-mail: pavel.cermak@utef.cvut.cz [Laboratoire Souterrain de Modane, 73500 Modane (France)

    2011-01-15

    A novel experimental approach to search for double electron capture (EC/EC) is discussed in this article. R and D for a new generation EC/EC spectrometer based on silicon pixel detectors (SPDs) has been conducted since 2009 for an upgrade of the TGV experiment. SPDs built on Timepix technology with a spectroscopic readout from each individual pixel are an effective tool to detect the 2{nu}EC/EC signature of the two low energy X-rays hitting two separate pixels. The ability of SPDs to indentify {alpha}/{beta}/{gamma} particles and localize them precisely leads to effective background discrimination and thus considerable improvement of the signal-to-background ratio (S/B). A multi-SPD system, called a Silicon Pixel Telescope (SPT), is planned based on the experimental approach of the TGV calorimeter which measures thin foils of enriched EC/EC-isotope sandwiched between HPGe detectors working in coincidence mode. The sources of SPD internal background have been identified by measuring SPD radiopurity with a low-background HPGe detector as well as by long-term SPD background runs in the Modane underground laboratory (LSM, France), and results of these studies are presented.

  18. Use of silicon pixel detectors in double electron capture experiments

    Science.gov (United States)

    Cermak, P.; Stekl, I.; Shitov, Yu A.; Mamedov, F.; Rukhadze, E. N.; Jose, J. M.; Cermak, J.; Rukhadze, N. I.; Brudanin, V. B.; Loaiza, P.

    2011-01-01

    A novel experimental approach to search for double electron capture (EC/EC) is discussed in this article. R&D for a new generation EC/EC spectrometer based on silicon pixel detectors (SPDs) has been conducted since 2009 for an upgrade of the TGV experiment. SPDs built on Timepix technology with a spectroscopic readout from each individual pixel are an effective tool to detect the 2νEC/EC signature of the two low energy X-rays hitting two separate pixels. The ability of SPDs to indentify α/β/γ particles and localize them precisely leads to effective background discrimination and thus considerable improvement of the signal-to-background ratio (S/B). A multi-SPD system, called a Silicon Pixel Telescope (SPT), is planned based on the experimental approach of the TGV calorimeter which measures thin foils of enriched EC/EC-isotope sandwiched between HPGe detectors working in coincidence mode. The sources of SPD internal background have been identified by measuring SPD radiopurity with a low-background HPGe detector as well as by long-term SPD background runs in the Modane underground laboratory (LSM, France), and results of these studies are presented.

  19. Dark Matter searches with the ATLAS Detector

    CERN Document Server

    Hooberman, Benjamin Henry; The ATLAS collaboration

    2016-01-01

    The presence of a non-baryonic Dark Matter (DM) component in the Universe is inferred from the observation of its gravitational interaction. If DM interacts non-gravitationally with the Standard Model, it could be produced at the LHC, escaping the detector and leaving missing transverse momentum (MET) as a signature. Recent results from the ATLAS detector will be presented, based on events with large MET accompanied by a variety of other objects.

  20. High frame rate measurements of semiconductor pixel detector readout IC

    International Nuclear Information System (INIS)

    We report on high count rate and high frame rate measurements of a prototype IC named FPDR90, designed for readouts of hybrid pixel semiconductor detectors used for X-ray imaging applications. The FPDR90 is constructed in 90 nm CMOS technology and has dimensions of 4 mm×4 mm. Its main part is a matrix of 40×32 pixels with 100 μm×100 μm pixel size. The chip works in the single photon counting mode with two discriminators and two 16-bit ripple counters per pixel. The count rate per pixel depends on the effective CSA feedback resistance and can be set up to 6 Mcps. The FPDR90 can operate in the continuous readout mode, with zero dead time. Due to the architecture of digital blocks in pixel, one can select the number of bits read out from each counter from 1 to 16. Because in the FPDR90 prototype only one data output is available, the frame rate is 9 kfps and 72 kfps for 16 bits and 1 bit readout, respectively (with nominal clock frequency of 200 MHz).

  1. Hybrid Pixel Detector Development for the Linear Collider Vertex Tracker

    CERN Document Server

    Battaglia, Marco; Campagnolo, R; Caccia, M; Kucewicz, W; Jalocha, P; Palka, J; Zalewska-Bak, A

    2001-01-01

    In order to fully exploit the physics potential of the future high energy e+e- linear collider, a Vertex Tracker able to provide particle track extrapolation with very high resolution is needed. Hybrid Si pixel sensors are an attractive technology due to their fast read-out capabilities and radiation hardness. A novel pixel detector layout with interleaved cells has been developed to improve the single point resolution. Results of the characterisation of the first processed prototypes by electrostatic measurements and charge collection studies are discussed.

  2. Semiconductor micropattern pixel detectors a review of the beginnings

    CERN Document Server

    Heijne, Erik H M

    2001-01-01

    The innovation in monolithic and hybrid semiconductor 'micropattern' or 'reactive' pixel detectors for tracking in particle physics was actually to fit logic and pulse processing electronics with µW power on a pixel area of less than 0.04 mm2, retaining the characteristics of a traditional nuclear amplifier chain. The ns timing precision in conjunction with local memory and logic operations allowed event selection at > 10 MHz rates with unambiguous track reconstruction even at particle multiplicities > 10 cm-2. The noise in a channel was ~100 e- r.m.s. and enabled binary operation with random noise 'hits' at a level 30 Mrad, respectively.

  3. 'Daisy petal' connectors for the ATLAS detector

    CERN Multimedia

    Laurent Guiraud

    1997-01-01

    These daisy-petal structures are conducting connectors embedded in kapton film. This was an innovative solution to the demands of the ATLAS detector. Straws are pushed through the petals and held in contact using plugs. The flexible kapton film allows as many petals to be built in any configuration, while acting as a printed circuit carrying the high voltage between circles.

  4. Atlas pixel opto-board production and analysis and optolink simulation studies

    International Nuclear Information System (INIS)

    At CERN, a Large collider will collide protons at high energies. There are four experiments being built to study the particle properties from the collision. The ATLAS experiment is the largest. It has many sub detectors among which is the Pixel detector which is the innermost part. The Pixel detector has eighty million channels that have to be read out. An optical link is utilized for the read out. It has optical to electronic interfaces both on the detector and off the detector at the counting room. The component on the detector in called the opto-board. This work discusses the production testing of the opto-boards to be installed on the detector. A total of 300 opto-boards including spares have been produced. The production was done in three laboratories among which is the laboratory at the University of Wuppertal which had the responsibility of Post production testing of all the one third of the total opto-boards. The results are discussed in this work. The analysis of the results from the total production process has been done in the scope of this work as well. In addition to the production, a study by simulation of the communication links optical signal has been done. This has enabled an assessment of the sufficiency of the optical signal against the transmission attenuation and irradiation degradation. A System Test set up has been put up at Wuppertal to enhance general studies for better understanding of the Pixel read out system. Among other studies is the study of the timing parameters behavior of the System which has been done in this work and enhanced by a simulation. These parameters are namely the mark to space ratio and the fine delay and their relatedness during the optolink tuning. A bit error rate test based on the System has also been done which enabled assessment of the transmission quality utilizing the tools inbuilt in the System Test. These results have been presented in this work. (orig.)

  5. Silicon sensors for the upgrades of the CMS pixel detector

    Energy Technology Data Exchange (ETDEWEB)

    Centis Vignali, Matteo

    2015-12-15

    The Compact Muon Solenoid (CMS) is a general purpose detector at the Large Hadron Collider (LHC). The LHC luminosity is constantly increased through upgrades of the accelerator and its injection chain. Two major upgrades will take place in the next years. The first upgrade involves the LHC injector chain and allows the collider to achieve a luminosity of about 2.10{sup 34} cm{sup -2}s{sup -1}. A further upgrade of the LHC foreseen for 2025 will boost its luminosity to 5.10{sup 34} cm{sup -2}s{sup -1}. As a consequence of the increased luminosity, the detectors need to be upgraded. In particular, the CMS pixel detector will undergo two upgrades in the next years. The first upgrade (phase I) consists in the substitution of the current pixel detector in winter 2016/2017. The upgraded pixel detector will implement new readout electronics that allow efficient data taking up to a luminosity of 2.10{sup 34} cm{sup -2}s{sup -1}, twice as much as the LHC design luminosity. The modules that will constitute the upgraded detector are being produced at different institutes. Hamburg (University and DESY) is responsible for the production of 350 pixel modules. The second upgrade (phase II) of the pixel detector is foreseen for 2025. The innermost pixel layer of the upgraded detector will accumulate a radiation damage corresponding to an equivalent fluence of Φ{sub eq}=2.10{sup 16} cm{sup -2} and a dose of ∼10 MGy after an integrated luminosity of 3000 fb{sup -1}. Several groups are investigating sensor designs and configurations able to withstand such high doses and fluences. This work is divided into two parts related to important aspects of the upgrades of the CMS pixel detector. For the phase I upgrade, a setup has been developed to provide an absolute energy calibration of the pixel modules that will constitute the detector. The calibration is obtained using monochromatic X-rays. The same setup is used to test the buffering capabilities of the modules' readout chip

  6. Silicon sensors for the upgrades of the CMS pixel detector

    International Nuclear Information System (INIS)

    The Compact Muon Solenoid (CMS) is a general purpose detector at the Large Hadron Collider (LHC). The LHC luminosity is constantly increased through upgrades of the accelerator and its injection chain. Two major upgrades will take place in the next years. The first upgrade involves the LHC injector chain and allows the collider to achieve a luminosity of about 2.1034 cm-2s-1. A further upgrade of the LHC foreseen for 2025 will boost its luminosity to 5.1034 cm-2s-1. As a consequence of the increased luminosity, the detectors need to be upgraded. In particular, the CMS pixel detector will undergo two upgrades in the next years. The first upgrade (phase I) consists in the substitution of the current pixel detector in winter 2016/2017. The upgraded pixel detector will implement new readout electronics that allow efficient data taking up to a luminosity of 2.1034 cm-2s-1, twice as much as the LHC design luminosity. The modules that will constitute the upgraded detector are being produced at different institutes. Hamburg (University and DESY) is responsible for the production of 350 pixel modules. The second upgrade (phase II) of the pixel detector is foreseen for 2025. The innermost pixel layer of the upgraded detector will accumulate a radiation damage corresponding to an equivalent fluence of Φeq=2.1016 cm-2 and a dose of ∼10 MGy after an integrated luminosity of 3000 fb-1. Several groups are investigating sensor designs and configurations able to withstand such high doses and fluences. This work is divided into two parts related to important aspects of the upgrades of the CMS pixel detector. For the phase I upgrade, a setup has been developed to provide an absolute energy calibration of the pixel modules that will constitute the detector. The calibration is obtained using monochromatic X-rays. The same setup is used to test the buffering capabilities of the modules' readout chip. The maximum rate experienced by the modules produced in Hamburg will be 120 MHz

  7. Pixel readout electronics development for the ALICE pixel vertex and LHCb RICH detector

    CERN Document Server

    Snoeys, W; Cantatore, E; Cencelli, V; Dinapoli, R; Heijne, Erik H M; Jarron, Pierre; Lamanna, P; Minervini, D; O'Shea, V; Quiquempoix, V; San Segundo-Bello, D; Van Koningsveld, B; Wyllie, Ken H

    2001-01-01

    The ALICE1LHCB pixel readout chip emerged from previous experience at CERN. The RD-19 collaboration provided the basis for the installation of a pixel system in the WA97 and NA57 experiments. Operation in these experiments was key in the understanding of the system issues. In parallel the RD-49 collaboration provided the basis to obtain radiation tolerance in commercial submicron CMOS through special circuit layout. The new ALICE1LMB chip was developed to serve two different applications: particle tracking in the ALICE Silicon Pixel Detector and particle identification in the LHCb Ring Imaging Cherenkov detector. To satisfy the different needs for these two experiments, the chip can be operated in two different modes. In tracking mode all the 50 mu m*435 mu m pixel cells in the 256*32 array are read out individually, whilst in particle identification mode they are combined in groups of 8 to form a 32*32 array of 400 mu m*425 mu m cells. The circuit is currently being manufactured in a commercial 0.25 mu m CMO...

  8. Pixel readout electronics development for the ALICE pixel vertex and LHCb RICH detector

    International Nuclear Information System (INIS)

    The ALICE1LHCB pixel readout chip emerged from previous experience at CERN. The RD-19 collaboration provided the basis for the installation of a pixel system in the WA97 and NA57 experiments. Operation in these experiments was key in the understanding of the system issues. In parallel the RD-49 collaboration provided the basis to obtain radiation tolerance in commercial submicron CMOS through special circuit layout. The new ALICE1LHB chip was developed to serve two different applications: particle tracking in the ALICE Silicon Pixel Detector and particle identification in the LHCb Ring Imaging Cherenkov detector. To satisfy the different needs for these two experiments, the chip can be operated in two different modes. In tracking mode all the 50 μmx425 μm pixel cells in the 256x32 array are read out individually, whilst in particle identification mode they are combined in groups of 8 to form a 32x32 array of 400 μmx425 μm cells. The circuit is currently being manufactured in a commercial 0.25 μm CMOS technology

  9. Radiation Damage of the ATLAS Pixel Sensors Using Leakage Current Measurement System

    CERN Document Server

    Gorelov, I; The ATLAS collaboration

    2013-01-01

    The current measurement system measures directly the leakage current in pixel sensors. The system is integrated with the ATLAS Pixel high voltage delivery system. The system runs as a monitor of a radiation damage of the pixel sensors. The leakage current data collected for the completed data taking period are analyzed. The recent status of the sensor's radiation damage and a comparison with the theoretical predictions are presented.

  10. Large precision muon detector for ATLAS

    CERN Document Server

    Zhou Bing

    2002-01-01

    The ATLAS muon spectrometer is designed to exploit the full physics discovery potential at the Large Hadron Collider in a stand-alone mode. The precision muon detector is made of monitored drift tubes with tracking precision better than 50 mum to measure the muon track sagitta in the toroidal magnetic field. A world-wide intensive construction work of the ATLAS muon detector is under way. We report the precision muon detector mass production experience, including the R&D results on the long tube operation stability and the impact on the momentum resolution due to wire sag. The quality control data in mass production are presented. Cosmic ray test results show that the MDT chambers have tracking efficiency close to 100% and single wire resolution is better than 80 mum.

  11. Large precision muon detector for ATLAS

    CERN Document Server

    Zhou Bing

    2002-01-01

    The ATLAS muon spectrometer is designed to exploit the full physics discovery potential at the Large Hadron Collider in a stand-alone mode. The precision muon detector is made of monitored drift tubes with tracking precision better than 50 mu m to measure the muon track sagitta in the toroidal magnetic field. A world-wide intensive construction work of the ATLAS muon detector is under way. We report the precision muon detector mass production experience, including the R and D results on the long tube operation stability and the impact on the momentum resolution due to wire sag. The quality control data in mass production are presented. Cosmic ray test results show that the MDT chambers have tracking efficiency close to 100% and single wire resolution is better than 80 mu m.

  12. The ALICE Silicon Pixel Detector Control and Calibration Systems

    CERN Document Server

    Calì, Ivan Amos; Manzari, Vito; Stefanini, Giorgio

    2008-01-01

    The work presented in this thesis was carried out in the Silicon Pixel Detector (SPD) group of the ALICE experiment at the Large Hadron Collider (LHC). The SPD is the innermost part (two cylindrical layers of silicon pixel detec- tors) of the ALICE Inner Tracking System (ITS). During the last three years I have been strongly involved in the SPD hardware and software development, construction and commissioning. This thesis is focused on the design, development and commissioning of the SPD Control and Calibration Systems. I started this project from scratch. After a prototyping phase now a stable version of the control and calibration systems is operative. These systems allowed the detector sectors and half-barrels test, integration and commissioning as well as the SPD commissioning in the experiment. The integration of the systems with the ALICE Experiment Control System (ECS), DAQ and Trigger system has been accomplished and the SPD participated in the experimental December 2007 commissioning run. The complex...

  13. Beam tests of an integrated prototype of the ATLAS Forward Proton detector

    CERN Document Server

    Lange, J; Avoni, G.; Banas, E.; Brandt, A.; Bruschi, M.; Buglewicz, P.; Cavallaro, E.; Caforio, D.; Chiodini, G.; Chytka, L.; Ciesla, K.; Davis, P.M.; Dyndal, M.; Grinstein, S.; Janas, K.; Jirakova, K.; Kocian, M.; Korcyl, K.; Lopez Paz, I.; Northacker, D.; Nozka, L.; Rijssenbeek, M.; Seabra, L.; Staszewski, R.; Swierska, P.; Sykora, T.

    2016-01-01

    The ATLAS Forward Proton (AFP) detector is intended to measure protons scattered at small angles from the ATLAS interaction point. To this end, a combination of 3D Silicon pixel tracking modules and Quartz-Cherenkov time-of-flight (ToF) detectors is installed 210m away from the interaction point at both sides of ATLAS. Beam tests with an AFP prototype detector combining tracking and timing sub-detectors and a common readout have been performed at the CERN-SPS test-beam facility in November 2014 and September 2015 to complete the system integration and to study the detector performance. The successful tracking-timing integration was demonstrated. Good tracker hit efficiencies above 99.9% at a sensor tilt of 14{\\deg}, as foreseen for AFP, were observed. Spatial resolutions in the short pixel direction with 50 {\\mu}m pitch of 5.5 +/- 0.5 {\\mu}m per pixel plane and of 2.8 +/- 0.5 {\\mu}m for the full four-plane tracker at 14{\\deg} were found, largely surpassing the AFP requirement of 10 {\\mu}m. The timing detector...

  14. Hexagonal pixel detector with time encoded binary readout

    International Nuclear Information System (INIS)

    The University of Hawaii is developing continuous acquisition pixel (CAP) detectors for vertexing applications in lepton colliding experiments such as SuperBelle or ILC. In parallel to the investigation of different technology options such as MAPS or SOI, both analog and binary readout concepts have been tested. First results with a binary readout scheme in which the hit information is time encoded by means of a signal shifting mechanism have recently been published. This paper explains the hit reconstruction for such a binary detector with an emphasis on fake hit reconstruction probabilities in order to evaluate the rate capability in a high background environment such as the planned SuperB factory at KEK. The results show that the binary concept is at least comparable to any analog readout strategy if not better in terms of occupancy. Furthermore, we present a completely new binary readout strategy in which the pixel cells are arranged in a hexagonal grid allowing the use of three independent output directions to reduce reconstruction ambiguities. The new concept uses the same signal shifting mechanism for time encoding, however, in dedicated transfer lines on the periphery of the detector, which enables higher shifting frequencies. Detailed Monte Carlo simulations of full size pixel matrices including hit and BG generation, signal generation, and data reconstruction show that by means of multiple signal transfer lines on the periphery the pixel can be made smaller (higher resolution), the number of output channels and the data volume per triggered event can be reduced dramatically, fake hit reconstruction is lowered to a minimum and the resulting effective occupancies are less than 10-4. A prototype detector has been designed in the AMS 0.35μm Opto process and is currently under fabrication.

  15. Descent of the Silicon Pixel Detector (SPD) for ALICE Experiment

    CERN Multimedia

    2007-01-01

    The Silicon Pixel Detector (SPD) constitutes the two innermost layers of the ALICE Inner Tracking System (ITS) at radii of 3.9 cm and 7.6 cm, respectively. It is a fundamental element for the determination of the position of the primary vertex as well as for the measurement of the impact parameter of secondary tracks originating from the weak decays of strange, charm and beauty particles.

  16. Simulations of 3D-Si sensors for the innermost layer of the ATLAS pixel upgrade

    CERN Document Server

    Baselga, Marta; Quirion, David

    2016-01-01

    The LHC is expected to reach luminosities up to 3000fb-1 and the innermost layer of the ATLAS upgrade plans to cope with higher occupancy and to decrease the pixel size. 3D-Si sensors are a good candidate for the innermost layer of the ATLAS pixel upgrade since they exhibit good performance under high fluences and the new designs will have smaller pixel size to fulfill the electronics expectations. This paper reports TCAD simulations of the 3D-Si sensors designed at IMB-CNM with non passing-through columns that are being fabricated for the next innermost layer of the ATLAS pixel upgrade, shows the charge collection response before and after irradiation, and the response of 3D-Si sensors located at large $\\eta$ angles.

  17. From vertex detectors to inner trackers with CMOS pixel sensors

    OpenAIRE

    Besson, A.; Pérez, A. Pérez; Spiriti, E.; Baudot, J.; Claus, G; Goffe, M.; de Winter, M.

    2016-01-01

    The use of CMOS Pixel Sensors (CPS) for high resolution and low material vertex detectors has been validated with the 2014 and 2015 physics runs of the STAR-PXL detector at RHIC/BNL. This opens the door to the use of CPS for inner tracking devices, with 10-100 times larger sensitive area, which require therefore a sensor design privileging power saving, response uniformity and robustness. The 350 nm CMOS technology used for the STAR-PXL sensors was considered as too poorly suited to upcoming ...

  18. Monolithic active pixel radiation detector with shielding techniques

    Energy Technology Data Exchange (ETDEWEB)

    Deptuch, Grzegorz W.

    2016-09-06

    A monolithic active pixel radiation detector including a method of fabricating thereof. The disclosed radiation detector can include a substrate comprising a silicon layer upon which electronics are configured. A plurality of channels can be formed on the silicon layer, wherein the plurality of channels are connected to sources of signals located in a bulk part of the substrate, and wherein the signals flow through electrically conducting vias established in an isolation oxide on the substrate. One or more nested wells can be configured from the substrate, wherein the nested wells assist in collecting charge carriers released in interaction with radiation and wherein the nested wells further separate the electronics from the sensing portion of the detector substrate. The detector can also be configured according to a thick SOA method of fabrication.

  19. Pixel diamond detectors for excimer laser beam diagnostics

    Science.gov (United States)

    Girolami, M.; Allegrini, P.; Conte, G.; Salvatori, S.

    2011-05-01

    Laser beam profiling technology in the UV spectrum of light is evolving with the increase of excimer lasers and lamps applications, that span from lithography for VLSI circuits to eye surgery. The development of a beam-profiler, able to capture the excimer laser single pulse and process the acquired pixel current signals in the time period between each pulse, is mandatory for such applications. 1D and 2D array detectors have been realized on polycrystalline CVD diamond specimens. The fast diamond photoresponse, in the ns time regime, suggests the suitability of such devices for fine tuning feedback of high-power pulsed-laser cavities, whereas solar-blindness guarantees high performance in UV beam diagnostics, also under high intensity background illumination. Offering unique properties in terms of thermal conductivity and visible-light transparency, diamond represents one of the most suitable candidate for the detection of high-power UV laser emission. The relatively high resistivity of diamond in the dark has allowed the fabrication of photoconductive vertical pixel-detectors. A semitransparent light-receiving back-side contact has been used for detector biasing. Each pixel signal has been conditioned by a multi-channel read-out electronics made up of a high-sensitive integrator and a Σ-Δ A/D converter. The 500 μs conversion time has allowed a data acquisition rate up to 2 kSPS (Sample Per Second).

  20. A Parallel FPGA Implementation for Real-Time 2D Pixel Clustering for the ATLAS Fast TracKer Processor

    CERN Document Server

    Sotiropoulou, C-L; The ATLAS collaboration; Annovi, A; Beretta, M; Kordas, K; Nikolaidis, S; Petridou, C; Volpi, G

    2014-01-01

    The parallel 2D pixel clustering FPGA implementation used for the input system of the ATLAS Fast TracKer (FTK) processor is presented. The input system for the FTK processor will receive data from the Pixel and micro-strip detectors from inner ATLAS read out drivers (RODs) at full rate, for total of 760Gbs, as sent by the RODs after level-1 triggers. Clustering serves two purposes, the first is to reduce the high rate of the received data before further processing, the second is to determine the cluster centroid to obtain the best spatial measurement. For the pixel detectors the clustering is implemented by using a 2D-clustering algorithm that takes advantage of a moving window technique to minimize the logic required for cluster identification. The cluster detection window size can be adjusted for optimizing the cluster identification process. Additionally, the implementation can be parallelized by instantiating multiple cores to identify different clusters independently thus exploiting more FPGA resources. ...

  1. A Parallel FPGA Implementation for Real-Time 2D Pixel Clustering for the ATLAS Fast TracKer Processor

    CERN Document Server

    Sotiropoulou, C-L; The ATLAS collaboration; Annovi, A; Beretta, M; Kordas, K; Nikolaidis, S; Petridou, C; Volpi, G

    2014-01-01

    The parallel 2D pixel clustering FPGA implementation used for the input system of the ATLAS Fast TracKer (FTK) processor is presented. The input system for the FTK processor will receive data from the Pixel and micro-strip detectors from inner ATLAS read out drivers (RODs) at full rate, for total of 760Gbs, as sent by the RODs after level1 triggers. Clustering serves two purposes, the first is to reduce the high rate of the received data before further processing, the second is to determine the cluster centroid to obtain the best spatial measurement. For the pixel detectors the clustering is implemented by using a 2D-clustering algorithm that takes advantage of a moving window technique to minimize the logic required for cluster identification. The cluster detection window size can be adjusted for optimizing the cluster identification process. Additionally, the implementation can be parallelized by instantiating multiple cores to identify different clusters independently thus exploiting more FPGA resources. T...

  2. Timing performance of pixellated CdZnTe detectors

    International Nuclear Information System (INIS)

    Recently introduced nuclear medicine cameras in which Positron Emission Tomography (PET) and the traditional Single Photon Emission Computerized Tomography (SPECT), are combined opened new horizon for the nuclear medicine field These systems applying NaI(Tl) scintillation detectors we very well tested and mailable for some time in the medical imaging field However the traditional NaI(Tl) cameras, optimized for low energy radiation imaging, suffer some severe limitations. The relatively low density (3.67 g/cm2) of NaI(Tl) limits the sensitivity. By incarcerating the NaI(Tl) thickness, the spatial resolution decreases. The long decay time (230 nsec) of the light emitted in NaI(Tl) restricts the the use of coincidence technique , as well as the count rate. In recent years CdZn Te (CZT) detectors are studied for the purpose of SPECT nuclear medical radiation imaging in the form of pixellated and microstrip detectors. CZT detector can served as a good candidate for replacing NaI(Tl) for PET and SPECT imaging due to their relatively high stopping power (density = (6.0 g/im3, high Z(48, 30, 52)) and their high count rate capability. Unfortunately there are several difficulties in PET application due to the difficulty in manufacturing thick crystals, registration of the full energy deposited in several pixels and their timing capabilities. The latter is due to large ballistic signal variation induced. This variations caused by the pulse shape, which is composed of two main components, the electron and the hole. The electrons travel about ten times faster than the holes. A photon absorbed clear the cathode plane will cause a large and fast signal induced by the electron and a small and slow signal induced due to the holes. Photons absorbed near the anode plane will induce the opposite signals. The distribution of photon absorption depth in the crystal causes signal splits over a number of pixels, due to the well-known 'small pixel effect'. The different pulses slope

  3. The data acquisition system of the Belle II Pixel Detector

    International Nuclear Information System (INIS)

    At the future Belle II experiment the DEPFET (DEPleted Field Effect Transistor) pixel detector will consist of about 8 million channels and is placed as the innermost detector. Because of its small distance to the interaction region and the high luminosity in Belle II, for a trigger rate of about 30 kHz with an estimated occupancy of about 3 % a data rate of about 22 GB/s is expected. Due to the high data rate, a data reduction factor higher than 30 is needed in order to stay inside the specifications of the event builder. The main hardware to reduce the data rate is a xTCA based Compute Node (CN) developed in cooperation between IHEP Beijing and University Giessen. Each node has as main component a Xilinx Virtex-5 FX70T FPGA and is equipped with 2 × 2 GB RAM , GBit Ethernet and 4 × 6.25 Gb/s optical links. An ATCA carrier board is able to hold up to four CN and supplies high bandwidth connections between the four CNs and to the ATCA backplane. To achieve the required data reduction on the CNs, regions of interest (ROI) are used. These regions are calculated in two independent systems by projecting tracks back to the pixel detector. One is the High Level Trigger (HLT) which uses data from the Silicon Vertex Detector (SVD), a silicon strip detector, and outer detectors. The other is the Data Concentrator (DATCON) which calculates ROIs based on SVD data only, in order to get low momentum tracks. With this information, only PXD data inside these ROIs will be forwarded to the event builder, while data outside of these regions will be discarded. First results of the test beam time in January 2014 at DESY with a Belle II vertex detector prototype and full DAQ chain will be presented

  4. Application of Hybrid Pixel Detectors for Searches of Rare Decays

    Energy Technology Data Exchange (ETDEWEB)

    Durst, J.; Anton, Gisela; Boehnel, Michael; Gleixner, Thomas; Lueck, Ferdinand; Michel, Thilo [Erlangen Centre for Astroparticle Physics (ECAP), Friedrich-Alexander-Universitaet Erlangen-Nuernberg, Erwin-Rommel-Str. 1, 91058 Erlangen (Germany); Schwenke, Maria; Zuber, Kai [Institut fuer Kern- und Teilchenphysik, Technische Universitaet Dresden, Zellescher Weg 19, 01069 Dresden (Germany)

    2011-06-15

    The new generation of hybrid pixel detectors like the Timepix detector provides access to the track information of the energy deposition in the used sensor, which allows better background discrimination in experiments for searches of rare decays. Due to the hybrid design several combinations of an ASIC with a sensor are possible. Assemblies are available with an attached Silicon sensor or CdTe sensor respectively. The detector measures the energy deposition using the time over threshold method. In this contribution we present simulation results of the detector response of the Timepix detector in applications for searches of rare decays. One application would be the search for the neutrinoless double beta decay of {sup 116}Cd using Timepix detectors with enriched CdTe as sensor material. In addition to the simulation results we present first experimental background measurements using a Timepix detector with Silicon sensor in the underground laboratory in Dresden. Using cluster analysis methods it is possible to categorise the single events.

  5. Development of Edgeless n-on-p Planar Pixel Sensors for future ATLAS Upgrades

    CERN Document Server

    Bomben, M; Boscardin, M; Bosisio, L; Calderini, G; Chauveau, J; Giacomini, G; La Rosa, A; Marchori, G; Zorzi, N

    2012-01-01

    The development of n-on-p "edgeless" planar pixel sensors being fabricated at FBK (Trento, Italy), aimed at the upgrade of the ATLAS Inner Detector for the High Luminosity phase of the Large Hadron Collider (HL-LHC), is reported. A characterizing feature of the devices is the reduced dead area at the edge, achieved by adopting the "active edge" technology, based on a deep etched trench, suitably doped to make an ohmic contact to the substrate. The project is presented, along with the active edge process, the sensor design for this first n-on-p production and a selection of simulation results, including the expected charge collection efficiency after radiation fluence of $1 \\times 10^{15} {\\rm n_{eq}}/{\\rm cm}^2$ comparable to those expected at HL-LHC (about ten years of running, with an integrated luminosity of 3000 fb$^{-1}$) for the outer pixel layers. We show that, after irradiation, more than 50% of the signal should be collected in the edge region; this confirms the validity of the active edge approach.

  6. Development of Edgeless n-on-p Planar Pixel Sensors for future ATLAS Upgrades

    CERN Document Server

    Bomben, M

    2013-01-01

    The development of n-on-p “edgeless” planar pixel sensors being fabricated at FBK (Trento, Italy), aimed at the upgrade of the ATLAS Inner Detector for the High Luminosity phase of the Large Hadron Collider (HL-LHC), is reported. A characterizing feature of the devices is the reduced dead area at the edge, achieved by adopting the “active edge” technology, based on a deep etched trench, suitably doped to make an ohmic contact to the substrate. The project is presented, along with the active edge process, the sensor design for this first n-on-p production and a selection of simulation results, including the expected charge collection efficiency after radiation fluence of View the MathML source1×1015neq/cm2 comparable to those expected at HL-LHC (about ten years of running, with an integrated luminosity of 3000 fb−1) for the outer pixel layers. We show that, after irradiation and at a bias voltage of 500 V, more than 50% of the signal should be collected in the edge region; this confirms the validity...

  7. Development of edgeless n-on-p planar pixel sensors for future ATLAS upgrades

    Science.gov (United States)

    Bomben, Marco; Bagolini, Alvise; Boscardin, Maurizio; Bosisio, Luciano; Calderini, Giovanni; Chauveau, Jacques; Giacomini, Gabriele; La Rosa, Alessandro; Marchiori, Giovanni; Zorzi, Nicola

    2013-06-01

    The development of n-on-p "edgeless" planar pixel sensors being fabricated at FBK (Trento, Italy), aimed at the upgrade of the ATLAS Inner Detector for the High Luminosity phase of the Large Hadron Collider (HL-LHC), is reported. A characterizing feature of the devices is the reduced dead area at the edge, achieved by adopting the "active edge" technology, based on a deep etched trench, suitably doped to make an ohmic contact to the substrate. The project is presented, along with the active edge process, the sensor design for this first n-on-p production and a selection of simulation results, including the expected charge collection efficiency after radiation fluence of 1×1015 neq/cm2 comparable to those expected at HL-LHC (about ten years of running, with an integrated luminosity of 3000 fb-1) for the outer pixel layers. We show that, after irradiation and at a bias voltage of 500 V, more than 50% of the signal should be collected in the edge region; this confirms the validity of the active edge approach.

  8. Pixel hybrid photon detector magnetic distortions characterization and compensation

    CERN Document Server

    Aglieri-Rinella, G; D'Ambrosio, Carmelo; Forty, Roger W; Gys, Thierry; Patel, Mitesh; Piedigrossi, Didier; Van Lysebetten, Ann

    2004-01-01

    The LHCb experiment requires positive kaon identification in the momentum range 2-100 GeV/c. This is provided by two ring imaging Cherenkov detectors. The stringent requirements on the photon detectors are fully satisfied by the novel pixel hybrid photon detector, HPD. The HPD is a vacuum tube with a quartz window, S20 photo-cathode, cross-focusing electron optics and a silicon anode encapsulated within the tube. The anode is a 32*256 pixels hybrid detector, with a silicon sensor bump-bonded onto a readout chip containing 8192 channels with analogue front-end and digital read-out circuitry. An external magnetic field influences the trajectory of the photoelectrons and could thereby degrade the inherent excellent space resolution of the HPD. The HPDs must be operational in the fringe magnetic field of the LHCb magnet. This paper reports on an extensive experimental characterization of the distortion effects. The characterization has allowed the development of parameterisations and of a compensation algorithm. ...

  9. An EUDET/AIDA Pixel Beam Telescope for Detector Development

    CERN Document Server

    Rubinskiy, I

    2015-01-01

    A high resolution (σ∼2μm) beam telescope based on monolithic active pixel sensors (MAPS) was developed within the EUDET collaboration. The telescope consists of six monolithic active pixel sensor planes (Mimosa26) with a pixel pitch of 18.4 \\mu m and thinned down to 50 \\mu m. The excellent resolution, readout rate and DAQ integration capabilities made the telescope a primary test beam tool for many groups including several CERN based experiments. Within the European detector infrastructure project AIDA the test beam telescope is being further extended in terms of cooling and powering infrastructure, read-out speed, area of acceptance, and precision. In order to provide a system optimized for the different requirements by the user community a combination of various state-of-the-art pixel technologies is foreseen. Furthermore, new central dead-time-free trigger logic unit (TLU) has been developed to provide LHC-speed response with one-trigger-per-particle operating mode and a synchronous clock for all conn...

  10. Standard Model measurements with the ATLAS detector

    Directory of Open Access Journals (Sweden)

    Hassani Samira

    2015-01-01

    Full Text Available Various Standard Model measurements have been performed in proton-proton collisions at a centre-of-mass energy of √s = 7 and 8 TeV using the ATLAS detector at the Large Hadron Collider. A review of a selection of the latest results of electroweak measurements, W/Z production in association with jets, jet physics and soft QCD is given. Measurements are in general found to be well described by the Standard Model predictions.

  11. ATLAS gets its own luminosity detector

    CERN Multimedia

    CERN Bulletin

    2011-01-01

    During the winter shutdown, the ATLAS collaboration has completed the installation of ALFA, the detector system that aims at the LHC absolute luminosity at Point 1 analysing the elastic scattering of protons at small angles.   Upper and lower ALFA Roman Pots as installed in sector 8-1 of the LHC tunnel, 240 metres from the ATLAS Interaction Point. The detectors of the ALFA system are installed at ± 240 meters from the interaction point 1, on either side of the ATLAS detector. The whole system consists of four stations, two on each side of the interaction point. Each station is equipped with two Roman Pots; each pot – that is separated from the vacuum of the accelerator by a thin window but is connected with bellows to the beam-pipe – can be moved very close to the beam. “The Roman Pot technique has been used successfully in the past for the measurement of elastic scattering very close to the circulating beam,” says Patrick Fassn...

  12. On the basic mechanism of Pixelized Photon Detectors

    CERN Document Server

    Otono, H; Yamashita, S; Yoshioka, T

    2008-01-01

    A Pixelized Photon Detector (PPD) is a generic name for the semiconductor devices operated in the Geiger-mode, such as Silicon PhotoMultiplier and Multi-Pixel Photon Counter, which has high photon counting capability. While the internal mechanisms of the PPD have been intensively studied in recent years, the existing models do not include the avalanche process. We have simulated the multiplication and quenching of the avalanche process and have succeeded in reproducing the output waveform of the PPD. Furthermore our model predicts the existence of dead-time in the PPD which has never been numerically predicted. For serching the dead-time, we also have developed waveform analysis method using deconvolution which has the potential to distinguish neibouring pulses precisely. In this paper, we discuss our improved model and waveform analysis method.

  13. Capacitively coupled hybrid pixel assemblies for the CLIC vertex detector

    CERN Document Server

    Alipour Tehrani, Niloufar; Benoit, Mathieu; Dannheim, Dominik; Dette, Karola; Hynds, Daniel; Kulis, Szymon; Peric, Ivan; Petric, Marko; Redford, Sophie; Sicking, Eva; Valerio, Pierpaolo

    2015-01-01

    The vertex detector at the proposed CLIC multi-TeV linear e+e- collider must have minimal material content and high spatial resolution, combined with accurate time-stamping to cope with the expected high rate of beam-induced backgrounds. One of the options being considered is the use of active sensors implemented in a commercial high-voltage CMOS process, capacitively coupled to hybrid pixel ASICs. A prototype of such an assembly, using two custom designed chips (CCPDv3 as active sensor glued to a CLICpix readout chip), has been characterised both in the lab and in beam tests at the CERN SPS using 120 GeV/c positively charged hadrons. Results of these characterisation studies are presented both for single and dual amplification stages in the active sensor. Pixel cross-coupling results are also presented, showing the sensitivity to placement precision and planarity of the glue layer.

  14. Characteristics of the ATLAS and CMS detectors

    CERN Document Server

    Seiden, Abraham

    2012-01-01

    The goal for the detection of new physics processes in particle collisions at Large Hadron Collider energies, combined with the broad spectrum of possibilities for how the physics might be manifest, leads to detectors of unprecedented scope and size for particle physics experiments at colliders. The resulting two detectors, ATLAS (A Toroidal LHC ApparatuS) and CMS (compact muon spectrometer), must search for the new physics processes within very complex events arising from the very high-energy collisions. The two experiments share many basic design features—in particular, the need for very selective triggering to weed out the bulk of the uninteresting events; the order in which detector types are arrayed in order to provide maximum information about each event; and the very large angular coverage required to constrain the energy carried by any non-interacting particles. However, within these basic constraints, the detectors are quite different given the different emphases placed on issues such as resolution...

  15. Development of thin sensors and a novel interconnection technology for the upgrade of the ATLAS pixel system

    Energy Technology Data Exchange (ETDEWEB)

    Beimforde, Michael

    2010-07-19

    To extend the discovery potential of the experiments at the LHC accelerator a two phase luminosity upgrade towards the super LHC (sLHC) with a maximum instantaneous luminosity of 10{sup 35}/cm{sup 2}s{sup 1} is planned. Retaining the reconstruction efficiency and spatial resolution of the ATLAS tracking detector at the sLHC, new pixel modules have to be developed that have a higher granularity, can be placed closer to the interaction point, and allow for a cost-efficient coverage of a larger pixel detector volume compared to the present one. The reduced distance to the interaction point calls for more compact modules that have to be radiation hard to supply a sufficient charge collection efficiency up to an integrated particle fluence equivalent to that of (1-2).10{sup 16} 1-MeV-neutrons per square centimeter (n{sub eq}/cm{sup 2}). Within this thesis a new module concept was partially realised and evaluated for the operation within an ATLAS pixel detector at the sLHC. This module concept utilizes a novel thin sensor production process for thin n-in-p silicon sensors which potentially allow for a higher radiation hardness at a reduced cost. Furthermore, the new 3D-integration technology ICV-SLID is explored which will allow for increasing the active area of the modules from 71% to about 90% and hence, for employing the modules in the innermost layer of the upgraded ATLAS pixel detector. A semiconductor simulation and measurements of irradiated test sensors are used to optimize the implantation parameters for the inter-pixel isolation of the thin sensors. These reduce the crosstalk between the pixel channels and should allow for operating the sensors during the whole runtime of the experiment without causing junction breakdowns. The characterization of the first production of sensors with active thicknesses of 75 {mu}m and 150 {mu}m proved that thin pixel sensors can be successfully produced with the new process technology. Thin pad sensors with a reduced inactive

  16. Development of thin sensors and a novel interconnection technology for the upgrade of the ATLAS pixel system

    International Nuclear Information System (INIS)

    To extend the discovery potential of the experiments at the LHC accelerator a two phase luminosity upgrade towards the super LHC (sLHC) with a maximum instantaneous luminosity of 1035/cm2s1 is planned. Retaining the reconstruction efficiency and spatial resolution of the ATLAS tracking detector at the sLHC, new pixel modules have to be developed that have a higher granularity, can be placed closer to the interaction point, and allow for a cost-efficient coverage of a larger pixel detector volume compared to the present one. The reduced distance to the interaction point calls for more compact modules that have to be radiation hard to supply a sufficient charge collection efficiency up to an integrated particle fluence equivalent to that of (1-2).1016 1-MeV-neutrons per square centimeter (neq/cm2). Within this thesis a new module concept was partially realised and evaluated for the operation within an ATLAS pixel detector at the sLHC. This module concept utilizes a novel thin sensor production process for thin n-in-p silicon sensors which potentially allow for a higher radiation hardness at a reduced cost. Furthermore, the new 3D-integration technology ICV-SLID is explored which will allow for increasing the active area of the modules from 71% to about 90% and hence, for employing the modules in the innermost layer of the upgraded ATLAS pixel detector. A semiconductor simulation and measurements of irradiated test sensors are used to optimize the implantation parameters for the inter-pixel isolation of the thin sensors. These reduce the crosstalk between the pixel channels and should allow for operating the sensors during the whole runtime of the experiment without causing junction breakdowns. The characterization of the first production of sensors with active thicknesses of 75 μm and 150 μm proved that thin pixel sensors can be successfully produced with the new process technology. Thin pad sensors with a reduced inactive edge demonstrate that the active sensor

  17. A Sealed Gas Pixel Detector for X-ray Astronomy

    CERN Document Server

    Bellazzini, R; Minuti, M; Baldini, L; Brez, A; Latronico, L; Omodei, N; Razzano, M; Massai, M M; Pinchera, M; Pesce-Rollins, M; Sgro, C; Costa, E; Soffitta, P; Sipilä, H; Lempinen, E

    2006-01-01

    We report on the results of a new, sealed, Gas Pixel Detector. The very compact design and the absence of the gas flow system, make this detector substantially ready for use as focal plane detector for future X-ray space telescopes. The instrument brings high sensitivity to X-ray polarimetry, which is the last unexplored field of X-ray astronomy. It derives the polarization information from the track of the photoelectrons that are imaged by a high gain (>1000), fine pitch GEM that matches the pitch of a pixel ASIC which is the collecting anode of the GPD (105k, 50 micron wide, hexagonal cells). The device is able to simultaneously perform good imaging (50-60 micron), moderate spectroscopy (~15% at 6 keV) as well as fast, high rate timing in the 1-10keV range. Moreover, being truly 2D, it is non dispersive and does not require any rotation. The great improvement of sensitivity, at least two orders of magnitude with respect to traditional polarimeters (based on Bragg crystals or Thomson scattering), will allow ...

  18. Low energy polarization sensitivity of the Gas Pixel Detector

    CERN Document Server

    Muleri, F; Baldini, L; Bellazzini, R; Bregeon, J; Brez, A; Costa, E; Frutti, M; Latronico, L; Minuti, M; Negri, M B; Omodei, N; Pinchera, M; Pesce-Rollins, M; Razzano, M; Rubini, A; Sgro', C; Spandre, G

    2007-01-01

    An X-ray photoelectric polarimeter based on the Gas Pixel Detector has been proposed to be included in many upcoming space missions to fill the gap of about 30 years from the first (and to date only) positive measurement of polarized X-ray emission from an astrophysical source. The estimated sensitivity of the current prototype peaks at an energy of about 3 keV, but the lack of readily available polarized sources in this energy range has prevented the measurement of detector polarimetric performances. In this paper we present the measurement of the Gas Pixel Detector polarimetric sensitivity at energies of a few keV and the new, light, compact and transportable polarized source that was devised and built to this aim. Polarized photons are produced, from unpolarized radiation generated with an X-ray tube, by means of Bragg diffraction at nearly 45 degrees. The employment of mosaic graphite and flat aluminum crystals allow the production of nearly completely polarized photons at 2.6, 3.7 and 5.2 keV from the di...

  19. Development of Edgeless Silicon Pixel Sensors on p-type substrate for the ATLAS High-Luminosity Upgrade

    CERN Document Server

    Calderini, G; Bomben, M; Boscardin, M; Bosisio, L; Chauveau, J; Giacomini, G; La Rosa, A; Marchiori, G; Zorzi, N

    2014-01-01

    In view of the LHC upgrade for the high luminosity phase (HL-LHC), the ATLAS experiment is planning to replace the inner detector with an all-silicon system. The n-in-p bulk technology represents a valid solution for the modules of most of the layers, given the significant radiation hardness of this option and the reduced cost. The large area necessary to instrument the outer layers will demand to tile the sensors, a solution for which the inefficient region at the border of each sensor needs to be reduced to the minimum size. This paper reports on a joint R&D project by the ATLAS LPNHE Paris group and FBK Trento on a novel n-in-p edgeless planar pixel design, based on the deep-trench process available at FBK.

  20. Selected results from the static characterization of edgeless n-on-p planar pixel sensors for ATLAS upgrades

    CERN Document Server

    Giacomini, Gabriele; Bomben, Marco; Boscardin, Maurizio; Bosisio, Luciano; Calderini, Giovanni; Chauveau, Jacques; La Rosa, Alessandro; Marchiori, Giovanni; Zorzi, Nicola

    2014-01-01

    In view of the LHC upgrade for the High Luminosity Phase (HL-LHC), the ATLAS experiment is planning to replace the Inner Detector with an all-Silicon system. The n-on-p technology represents a valid solution for the modules of most of the layers, given the significant radiation hardness of this option and the reduced cost. There is also the demand to reduce the inactive areas to a minimum. The ATLAS LPNHE Paris group and FBK Trento started a collaboration for the development on a novel n-on-p edgeless planar pixel design, based on the deep-trench process which can cope with all these requirements. This paper reports selected results from the electrical characterization, both before and after irradiation, of test structures from the first production batch.

  1. Status of the CMS Phase I Pixel Detector Upgrade

    OpenAIRE

    Spannagel, Simon

    2015-01-01

    Based on the strong performance of the LHC accelerator, it is anticipated that peak luminosities of two times the design luminosity of L = 2 x10^34 cm^-2s^-1 are likely to be reached before 2018 and probably significantly exceeded in the so-called Phase I period until 2022. At this higher luminosity and increased hit occupancies the current CMS pixel detector would be subject to severe dead time and inefficiencies introduced by limited buffers in the analog read-out chip and effects of radiat...

  2. Radiation damage of pixelated photon detector by neutron irradiation

    Science.gov (United States)

    Nakamura, Isamu

    2009-10-01

    Radiation Damage of Pixelated Photon Detector by neutron irradiation is reported. MPPC, one of PPD or Geiger-mode APD, developed by Hamamatsu Photonics, is planned to be used in many high energy physics experiments. In such experiments radiation damage is a serious issue. A series of neutron irradiation tests is performed at the Reactor YAYOI of the University of Tokyo. MPPCs were irradiated at the reactor up to 1012 neutron/cm2. In this paper, the effect of neutron irradiation on the basic characteristics of PPD including gain, noise rate, photon detection efficiency is presented.

  3. DAQ Development for Silicon-On-Insulator Pixel detectors

    CERN Document Server

    Nishimura, Ryutaro; Miyoshi, Toshinobu

    2015-01-01

    We are developing DAQ for Si-pixel detectors by using a Slicon-On-Insulator (SOI) technology. This DAQ consists of firmware works on SEABAS (Soi EvAluation BoArd with Sitcp) DAQ board and software works on PC. We have been working on the development of firmware/software. Now we accomplished to speed up the readout (~90Hz) and to add a function for frame rate control. This is the report of our development work for the High Speed DAQ system.

  4. Performance of Edgeless Silicon Pixel Sensors on p-type substrate for the ATLAS High-Luminosity Upgrade

    CERN Document Server

    Bomben, Marco; Boscardin, Maurizio; Bosisio, Luciano; Calderini, Giovanni; Chauveau, Jacques; Ducourthial, Audrey; Giacomini, Gabriele; Marchiori, Giovanni; Zorzi, Nicola

    2016-01-01

    In view of the LHC upgrade phases towards the High Luminosity LHC (HL-LHC), the ATLAS experiment plans to upgrade the Inner Detector with an all-silicon system. The n-on-p silicon technology is a promising candidate to achieve a large area instrumented with pixel sensors, since it is radiation hard and cost effective. The paper reports on the performance of novel n-on-p edgeless planar pixel sensors produced by FBK-CMM, making use of the active trench for the reduction of the dead area at the periphery of the device. After discussing the sensor technology an overview of the first beam test results will be given.

  5. Run-2 ATLAS Trigger and Detector Performance

    CERN Document Server

    Winklmeier, Frank; The ATLAS collaboration

    2016-01-01

    The 2nd LHC run has started in June 2015 with a pp centre-of-mass collision energy of 13 TeV, and ATLAS has taken first data at this new energy. In this talk the improvements made to the ATLAS experiment during the 2-year shutdown 2013/2014 will be discussed, and first detector and trigger performance results from the Run-2 will be shown. In general, reconstruction algorithms of tracks, e/gamma, muons, taus, jets and flavour tag- ging have been improved for Run-2. The new reconstruction algorithms and their performance measured using the data taken in 2015 at sqrt(s)=13 TeV will be discussed. Reconstruction efficiency, isolation performance, transverse momentum resolution and momentum scales are measured in various regions of the detector and in momentum intervals enlarged with respect to those measured in the Run-1. This presentation will also give an overview of the upgrades to the ATLAS trigger system that have been implemented during the LHC shutdown in order to deal with the increased trigger rates (fact...

  6. Thin n-in-p planar pixel sensors and active edge sensors for the ATLAS upgrade at HL-LHC

    CERN Document Server

    Terzo, S; Nisius, R; Paschen, B

    2014-01-01

    Silicon pixel modules employing n-in-p planar sensors with an active thickness of 200 $\\mu$m, produced at CiS, and 100-200 $\\mu$m thin active/slim edge sensor devices, produced at VTT in Finland have been interconnected to ATLAS FE-I3 and FE-I4 read-out chips. The thin sensors are designed for high energy physics collider experiments to ensure radiation hardness at high fluences. Moreover, the active edge technology of the VTT production maximizes the sensitive region of the assembly, allowing for a reduced overlap of the modules in the pixel layer close to the beam pipe. The CiS production includes also four chip sensors according to the module geometry planned for the outer layers of the upgraded ATLAS pixel detector to be operated at the HL-LHC. The modules have been characterized using radioactive sources in the laboratory and with high precision measurements at beam tests to investigate the hit efficiency and charge collection properties at different bias voltages and particle incidence angles. The perfo...

  7. Thin n-in-p planar pixel sensors and active edge sensors for the ATLAS upgrade at HL-LHC

    Science.gov (United States)

    Terzo, S.; Macchiolo, A.; Nisius, R.; Paschen, B.

    2014-12-01

    Silicon pixel modules employing n-in-p planar sensors with an active thickness of 200 μm, produced at CiS, and 100-200 μm thin active/slim edge sensor devices, produced at VTT in Finland have been interconnected to ATLAS FE-I3 and FE-I4 read-out chips. The thin sensors are designed for high energy physics collider experiments to ensure radiation hardness at high fluences. Moreover, the active edge technology of the VTT production maximizes the sensitive region of the assembly, allowing for a reduced overlap of the modules in the pixel layer close to the beam pipe. The CiS production includes also four chip sensors according to the module geometry planned for the outer layers of the upgraded ATLAS pixel detector to be operated at the HL-LHC. The modules have been characterized using radioactive sources in the laboratory and with high precision measurements at beam tests to investigate the hit efficiency and charge collection properties at different bias voltages and particle incidence angles. The performance of the different sensor thicknesses and edge designs are compared before and after irradiation up to a fluence of 1.4 × 1016 neq/cm2.

  8. Thin n-in-p planar pixel sensors and active edge sensors for the ATLAS upgrade at HL-LHC

    International Nuclear Information System (INIS)

    Silicon pixel modules employing n-in-p planar sensors with an active thickness of 200 μm, produced at CiS, and 100-200 μm thin active/slim edge sensor devices, produced at VTT in Finland have been interconnected to ATLAS FE-I3 and FE-I4 read-out chips. The thin sensors are designed for high energy physics collider experiments to ensure radiation hardness at high fluences. Moreover, the active edge technology of the VTT production maximizes the sensitive region of the assembly, allowing for a reduced overlap of the modules in the pixel layer close to the beam pipe. The CiS production includes also four chip sensors according to the module geometry planned for the outer layers of the upgraded ATLAS pixel detector to be operated at the HL-LHC. The modules have been characterized using radioactive sources in the laboratory and with high precision measurements at beam tests to investigate the hit efficiency and charge collection properties at different bias voltages and particle incidence angles. The performance of the different sensor thicknesses and edge designs are compared before and after irradiation up to a fluence of 1.4 × 1016 neq/cm2

  9. Fabrication of a high-density MCM-D for a pixel detector system using a BCB/Cu technology

    CERN Document Server

    Topper, M; Engelmann, G; Fehlberg, S; Gerlach, P; Wolf, J; Ehrmann, O; Becks, K H; Reichl, H

    1999-01-01

    The MCM-D which is described here is a prototype for a pixel detector system for the planned Large Hadron Collider (LHC) at CERN, Geneva. The project is within the ATLAS experiment. The module consists of a sensor tile with an active area of 16.4 mm*60.4 mm, 16 readout chips, each serving 24*160 pixel unit cells, a module controller chip, an optical transceiver and the local signal interconnection and power distribution buses. The extremely high wiring density which is necessary to interconnect the readout chips was achieved using a thin film copper/photo-BCB process above the pixel array. The bumping of the readout chips was done by PbSn electroplating. All dice are then attached by flip-chip assembly to the sensor diodes and the local buses. The focus of this paper is a detailed description of the technologies for the fabrication of this advanced MCM-D. (10 refs).

  10. Top quark studies with the ATLAS detector

    CERN Document Server

    Capua, Marcella; The ATLAS collaboration

    2015-01-01

    The latest top quark studies in proton-proton collisions at a centre-of-mass energy of 7 and 8 TeV with the ATLAS detector are reported. We present recent results on the top pair production inclusive cross-sections, top pair production differential cross-section in the resolved and boosted regimes, single top-quark production cross-sections measured in the t-channel, s-channel and W-boson associated processes, as well as the CKM matrix element $|V_{tb}|$ determination. The results are compared with theoretical expectations. Latest ATLAS results on top properties will be also shown in terms of direct and mass pole, spin correlations and charge asymmetry.

  11. The alignment of the ATLAS Inner Detector in Run 2

    CERN Document Server

    Ripellino, Giulia; The ATLAS collaboration

    2016-01-01

    The ATLAS reconstruction of charged particle trajectories relies on the Inner Detector tracking system. The accuracy of the reconstruction is limited by the finite resolution of the detector elements and the knowledge about their positions. A precise alignment of the detector is therefore essential. In this poster we present the strategy and the status of the Inner Detector alignment in ATLAS during the LHC Run 2.

  12. ATLAS inner detector: the Run 1 to Run 2 transition, and first experience from Run 2

    CERN Document Server

    Dobos, Daniel; The ATLAS collaboration

    2015-01-01

    The ATLAS experiment is equipped with a tracking system, the Inner Detector, built using different technologies, silicon planar sensors (pixel and micro-strip) and gaseous drift- tubes, all embedded in a 2T solenoidal magnetic field. For the LHC Run II, the system has been upgraded; taking advantage of the long showdown, the Pixel Detector was extracted from the experiment and brought to surface, to equip it with new service quarter panels, to repair modules and to ease installation of the Insertable B-Layer (IBL), a fourth layer of pixel detectors, installed in May 2014 between the existing Pixel Detector and a new smaller radius beam-pipe at a radius of 3.3 cm from the beam axis. To cope with the high radiation and pixel occupancy due to the proximity to the interaction point and the increase of Luminosity that LHC will face in Run-2, a new read-out chip within CMOS 130nm and two different silicon sensor pixel technologies (planar and 3D) have been developed. SCT and TRT systems consolidation was also carri...

  13. A sealed Gas Pixel Detector for X-ray astronomy

    International Nuclear Information System (INIS)

    We report on the results of a new, sealed Gas Pixel Detector. The very compact design and the absence of the gas flow system make this detector substantially ready for use as focal plane detector for future X-ray space telescopes. The instrument brings high sensitivity to X-ray polarimetry, which is the last unexplored field of X-ray astronomy. It derives the polarization information from the track of the photoelectrons that are imaged by a high-gain (>1000), fine pitch GEM that matches the pitch of a pixel ASIC which is the collecting anode of the GPD (105k, 50 μm wide, hexagonal cells). The device is able to simultaneously perform good imaging (50-60 μm), moderate spectroscopy (∼15% at 6 keV) as well as fast, high-rate timing in the 1-10 keV range. Moreover, being truly 2D, it is non-dispersive and does not require any rotation. The great improvement of sensitivity, at least two orders of magnitude with respect to traditional polarimeters (based on Bragg crystals or Thomson scattering), will allow the direct exploration of the most dramatic objects of the X-ray sky. At the focus of the large mirror area of the XEUS telescope it will be decisive in reaching many of the scientific goals of the mission. With integration times of the order of 1 day, polarimetry of Active Galactic Nuclei at the percent level will be possible, making for a real breakthrough in high-energy astrophysics

  14. A sealed Gas Pixel Detector for X-ray astronomy

    Energy Technology Data Exchange (ETDEWEB)

    Bellazzini, R. [INFN sez.Pisa, Largo B. Pontecorvo 3, I-56127 Pisa (Italy)], E-mail: ronaldo.bellazzini@pi.infn.it; Spandre, G.; Minuti, M.; Baldini, L.; Brez, A.; Latronico, L.; Omodei, N. [INFN sez.Pisa, Largo B. Pontecorvo 3, I-56127 Pisa (Italy); Razzano, M.; Massai, M.M. [INFN sez.Pisa, Largo B. Pontecorvo 3, I-56127 Pisa (Italy); Dipartimento di Fisica, Universita di Pisa, Largo B. Pontecorvo 3, I-56127 Pisa (Italy); Pesce-Rollins, M.; Sgro, C. [INFN sez.Pisa, Largo B. Pontecorvo 3, I-56127 Pisa (Italy); Costa, Enrico; Soffitta, Paolo [Istituto di Astrofisica Spaziale e Fisica Cosmica, Via del Fosso del Cavaliere 100, I-00133, Roma (Italy); Sipila, H.; Lempinen, E. [Oxford Instruments Analytical Oy, Nihtisillankuja 5, FI-02631 Espoo (Finland)

    2007-09-01

    We report on the results of a new, sealed Gas Pixel Detector. The very compact design and the absence of the gas flow system make this detector substantially ready for use as focal plane detector for future X-ray space telescopes. The instrument brings high sensitivity to X-ray polarimetry, which is the last unexplored field of X-ray astronomy. It derives the polarization information from the track of the photoelectrons that are imaged by a high-gain (>1000), fine pitch GEM that matches the pitch of a pixel ASIC which is the collecting anode of the GPD (105k, 50 {mu}m wide, hexagonal cells). The device is able to simultaneously perform good imaging (50-60 {mu}m), moderate spectroscopy ({approx}15% at 6 keV) as well as fast, high-rate timing in the 1-10 keV range. Moreover, being truly 2D, it is non-dispersive and does not require any rotation. The great improvement of sensitivity, at least two orders of magnitude with respect to traditional polarimeters (based on Bragg crystals or Thomson scattering), will allow the direct exploration of the most dramatic objects of the X-ray sky. At the focus of the large mirror area of the XEUS telescope it will be decisive in reaching many of the scientific goals of the mission. With integration times of the order of 1 day, polarimetry of Active Galactic Nuclei at the percent level will be possible, making for a real breakthrough in high-energy astroph0011ysi.

  15. Recent SM measurements with the ATLAS detector

    CERN Document Server

    Hejbal, Jiri; The ATLAS collaboration

    2015-01-01

    Various Standard Model measurements have been performed in proton-proton collisions at a centre-of-mass energy of sqrt(s) = 7 and 8 TeV using the ATLAS detector at the Large Hadron Collider. A review of a selection of the latest results of electroweak measurements, W/Z production in association with jets, jet physics and soft QCD is given. Measurements are in general found to be well described by the Standard Model predictions. First LHC Run-2 results including measurements of the properties of minimum bias interactions and early cross section measurements involving W and Z bosons are also presented.

  16. Characterisation and mitigation of beam-induced backgrounds observed in the ATLAS detector during the 2011 proton-proton run

    Czech Academy of Sciences Publication Activity Database

    Aad, G.; Abajyan, T.; Abbott, B.; Böhm, Jan; Chudoba, Jiří; Gallus, Petr; Gunther, Jaroslav; Jakoubek, Tomáš; Juránek, Vojtěch; Kepka, Oldřich; Kupčo, Alexander; Kůs, Vlastimil; Lokajíček, Miloš; Marčišovský, Michal; Mikeštíková, Marcela; Myška, Miroslav; Němeček, Stanislav; Růžička, Pavel; Schovancová, Jaroslava; Šícho, Petr; Staroba, Pavel; Svatoš, Michal; Taševský, Marek; Tic, Tomáš; Valenta, J.; Vrba, Václav

    2013-01-01

    Roč. 8, Jul (2013), s. 1-58. ISSN 1748-0221 R&D Projects: GA MŠk(CZ) LG13009 Institutional support: RVO:68378271 Keywords : background * induced * semiconductor detector * pixel * muon * spectrometer * jet * single production * ATLAS * calorimeter * new physics * beam Subject RIV: BG - Nuclear, Atomic and Molecular Physics, Colliders Impact factor: 1.526, year: 2013

  17. A parallel FPGA implementation for real-time 2D pixel clustering for the ATLAS Fast Tracker Processor

    Science.gov (United States)

    Sotiropoulou, C. L.; Gkaitatzis, S.; Annovi, A.; Beretta, M.; Kordas, K.; Nikolaidis, S.; Petridou, C.; Volpi, G.

    2014-10-01

    The parallel 2D pixel clustering FPGA implementation used for the input system of the ATLAS Fast TracKer (FTK) processor is presented. The input system for the FTK processor will receive data from the Pixel and micro-strip detectors from inner ATLAS read out drivers (RODs) at full rate, for total of 760Gbs, as sent by the RODs after level-1 triggers. Clustering serves two purposes, the first is to reduce the high rate of the received data before further processing, the second is to determine the cluster centroid to obtain the best spatial measurement. For the pixel detectors the clustering is implemented by using a 2D-clustering algorithm that takes advantage of a moving window technique to minimize the logic required for cluster identification. The cluster detection window size can be adjusted for optimizing the cluster identification process. Additionally, the implementation can be parallelized by instantiating multiple cores to identify different clusters independently thus exploiting more FPGA resources. This flexibility makes the implementation suitable for a variety of demanding image processing applications. The implementation is robust against bit errors in the input data stream and drops all data that cannot be identified. In the unlikely event of missing control words, the implementation will ensure stable data processing by inserting the missing control words in the data stream. The 2D pixel clustering implementation is developed and tested in both single flow and parallel versions. The first parallel version with 16 parallel cluster identification engines is presented. The input data from the RODs are received through S-Links and the processing units that follow the clustering implementation also require a single data stream, therefore data parallelizing (demultiplexing) and serializing (multiplexing) modules are introduced in order to accommodate the parallelized version and restore the data stream afterwards. The results of the first hardware tests of

  18. Monitored Drift Chambers in the ATLAS Detector

    CERN Multimedia

    Herten, G

    Monitored Drift Chambers (MDT) are used in the ATLAS Detector to measure the momentum of high energy muons. They consist of drift tubes, which are filled with an Ar-CO2 gas mixture at 3 bar gas pressure. About 1200 drift chambers are required for ATLAS. They are up to 6 m long. Nevertheless the position of every wire needs to be known with a precision of 20 µm within a chamber. In addition, optical alignment sensors are required to measure the relative position of adjacent chambers with a precision of 30µm. This gigantic task seems impossible at first instance. Indeed it took many years of R&D to invent the right tools and methods before the first chamber could be built according to specifications. Today, at the time when 50% of the chambers have been produced, we are confident that the goal for ATLAS can be reached. The mechanical precision of the chambers could be verified with the x-ray tomograph at CERN. This ingenious device, developed for the MDT system, is able to measure the wire position insid...

  19. Silicon Strip Detectors for the ATLAS sLHC Upgrade

    CERN Document Server

    Soldevila, U; The ATLAS collaboration

    2011-01-01

    While the Large Hadron Collider (LHC) at CERN is continuing to deliver an ever-increasing luminosity to the experiments, plans for an upgraded machine called Super-LHC (sLHC) are progressing. The upgrade is foreseen to increase the LHC design luminosity by a factor ten. The ATLAS experiment will need to build a new tracker for sLHC operation, which needs to be suited to the harsh sLHC conditions in terms of particle rates and radiation doses. In order to cope with the increase in pile-up backgrounds at the higher luminosity, an all silicon detector is being designed. To successfully face the increased radiation dose, a new generation of extremely radiation hard silicon detectors is being designed. Silicon sensors with sufficient radiation hardness are the subject of an international R&amp;D programme, working on pixel and strip sensors. The efforts presented here concentrate on the innermost strip layers. We have developed a large number of prototype planar detectors produced on p-type wafers in a...

  20. Silicon Strip Detectors for ATLAS sLHC Upgrade

    CERN Document Server

    Affolder, A; The ATLAS collaboration

    2011-01-01

    While the Large Hadron Collider (LHC) at CERN is continuing to deliver an ever-increasing luminosity to the experiments, plans for an upgraded machine called Super-LHC (sLHC) are progressing. The upgrade is foreseen to increase the LHC design luminosity by a factor ten. The ATLAS experiment will need to build a new tracker for sLHC operation, which needs to be suited to the harsh sLHC conditions in terms of particle rates and radiation doses. In order to cope with the increase in pile-up backgrounds at the higher luminosity, an all silicon detector is being designed. To successfully face the increased radiation dose, a new generation of extremely radiation hard silicon detectors is being designed. Silicon sensors with sufficient radiation hardness are the subject of an international R&D programme, working on pixel and strip sensors. The efforts presented here concentrate on the innermost strip layers. We have developed a large number of prototype planar detectors produced on p-type wafers in a number of d...

  1. Silicon strip detectors for the ATLAS HL-LHC upgrade

    CERN Document Server

    Bernabeu, J; The ATLAS collaboration

    2011-01-01

    While the Large Hadron Collider (LHC) at CERN is continuing to deliver an ever-increasing luminosity to the experiments, plans for an upgraded machine called Super-LHC (sLHC) are progressing. The upgrade is foreseen to increase the LHC design luminosity by a factor ten. The ATLAS experiment will need to build a new tracker for sLHC operation, which needs to be suited to the harsh sLHC conditions in terms of particle rates and radiation doses. In order to cope with the increase in pile-up backgrounds at the higher luminosity, an all silicon detector is being designed. To successfully face the increased radiation dose, a new generation of extremely radiation hard silicon detectors is being designed. Silicon sensors with sufficient radiation hardness are the subject of an international R&D programme, working on pixel and strip sensors. The efforts presented here concentrate on the innermost strip layers. We have developed a large number of prototype planar detectors produced on p-type wafers in a number of d...

  2. Silicon Strip Detectors for the ATLAS HL-LHC Upgrade

    CERN Document Server

    Dervan, Paul; The ATLAS collaboration

    2011-01-01

    While the Large Hadron Collider (LHC) at CERN is continuing to deliver an ever-increasing luminosity to the experiments, plans for an upgraded machine called Super-LHC (sLHC) are progressing. The upgrade is foreseen to increase the LHC design luminosity by a factor ten. The ATLAS experiment will need to build a new tracker for sLHC operation, which needs to be suited to the harsh sLHC conditions in terms of particle rates and radiation doses. In order to cope with the increase in pile-up backgrounds at the higher luminosity, an all silicon detector is being designed. To successfully face the increased radiation dose, a new generation of extremely radiation hard silicon detectors is being designed. Silicon sensors with sufficient radiation hardness are the subject of an international R&D programme, working on pixel and strip sensors. The efforts presented here concentrate on the innermost strip layers. We have developed a large number of prototype planar detectors produced on p-type wafers in a num...

  3. Achievements of the ATLAS Upgrade Planar Pixel Sensors R&D Project

    CERN Document Server

    Nellist, C

    2015-01-01

    In the framework of the HL-LHC upgrade, the ATLAS experiment plans to introduce an all-silicon inner tracker to cope with the elevated occupancy. To investigate the suitability of pixel sensors using the proven planar technology for the upgraded tracker, the ATLAS Planar Pixel Sensor R&D Project (PPS) was established comprising 19 institutes and more than 90 scientists. The paper provides an overview of the research and development project and highlights accomplishments, among them: beam test results with planar sensors up to innermost layer fluences (> 10^16 n_eq cm^2); measurements obtained with irradiated thin edgeless n-in-p pixel assemblies; recent studies of the SCP technique to obtain almost active edges by postprocessing already existing sensors based on scribing, cleaving and edge passivation; an update on prototyping efforts for large areas: sensor design improvements and concepts for low-cost hybridisation; comparison between Secondary Ion Mass Spectrometry results and TCAD simulations. Togethe...

  4. Development of thin sensors and a novel interconnection technology for the upgrade of the ATLAS pixel system

    International Nuclear Information System (INIS)

    A new pixel module concept is presented utilizing thin sensors and a novel vertical integration technique for the ATLAS pixel detector in view of the foreseen LHC luminosity upgrades. A first set of pixel sensors with active thicknesses of 75 and 150μm has been produced from wafers of standard thickness using a thinning process developed at the Max-Planck-Institut Halbleiterlabor (HLL) and the Max-Planck-Institut fuer Physik (MPP). Pre-irradiation characterizations of these sensors show a very good device yield and high break down voltage. First proton irradiations up to a fluence of 1015 neq cm-2 have been carried out and their impact on the electrical properties of thin sensors has been studied. The novel ICV-SLID vertical integration technology will allow for routing signals vertically to the back side of the readout chips. With this, four-side buttable detector devices with an increased active area fraction are made possible. A first production of SLID test structures was performed and showed a high connection efficiency for different pad sizes and a mild sensitivity to disturbances of the surface planarity.

  5. Capacitively coupled hybrid pixel assemblies for the CLIC vertex detector

    Science.gov (United States)

    Tehrani, N. Alipour; Arfaoui, S.; Benoit, M.; Dannheim, D.; Dette, K.; Hynds, D.; Kulis, S.; Perić, I.; Petrič, M.; Redford, S.; Sicking, E.; Valerio, P.

    2016-07-01

    The vertex detector at the proposed CLIC multi-TeV linear e+e- collider must have minimal material content and high spatial resolution, combined with accurate time-stamping to cope with the expected high rate of beam-induced backgrounds. One of the options being considered is the use of active sensors implemented in a commercial high-voltage CMOS process, capacitively coupled to hybrid pixel ASICs. A prototype of such an assembly, using two custom designed chips (CCPDv3 as active sensor glued to a CLICpix readout chip), has been characterised both in the lab and in beam tests at the CERN SPS using 120 GeV/c positively charged hadrons. Results of these characterisation studies are presented both for single and dual amplification stages in the active sensor, where efficiencies of greater than 99% have been achieved at -60 V substrate bias, with a single hit resolution of 6.1 μm . Pixel cross-coupling results are also presented, showing the sensitivity to placement precision and planarity of the glue layer.

  6. Pixel Detector Trial Assembly Test in the SR1 building

    CERN Multimedia

    D. Giugni

    2004-01-01

    During the last two months the Pixel group [LBL, Milan and Wuppertal] made a successful integration test on the mechanics of the barrel. The scope of the test was to qualify the integration procedures and the various assembling tools. The test took place in the clean room of the SR1 building at CERN, where the detector has been assembled around a dummy beam pipe made of Stainless Steel. The process is rather complex: the shells come in two parts and they have to be clamped together to get the full shell. This operation is carried out by a dedicated tool which is shown to the right in the picture below. The layer 1 shell is clamped around a "service" pipe that will be used for moving the full layer to the integration tool [ITT] which is visible on the left. View of the tools devoted to the Pixel barrel integration in the SR1 building Also visible in the picture is the global frame that is actually held by the tool. It will engage the layers sliding onto the rails. The first two layers are sequentially...

  7. Towards a new generation of pixel detector readout chips

    International Nuclear Information System (INIS)

    The Medipix3 Collaboration has broken new ground in spectroscopic X-ray imaging and in single particle detection and tracking. This paper will review briefly the performance and limitations of the present generation of pixel detector readout chips developed by the Collaboration. Through Silicon Via technology has the potential to provide a significant improvement in the tile-ability and more flexibility in the choice of readout architecture. This has been explored in the context of 3 projects with CEA-LETI using Medipix3 and Timepix3 wafers. The next generation of chips will aim to provide improved spectroscopic imaging performance at rates compatible with human CT. It will also aim to provide full spectroscopic images with unprecedented energy and spatial resolution. Some of the opportunities and challenges posed by moving to a more dense CMOS process will be discussed

  8. Planar pixel sensors for the ATLAS upgrade: beam tests results

    Czech Academy of Sciences Publication Activity Database

    Weingarten, J.; Altenheiner, S.; Beimforde, M.; Benoit, M.; Bomben, M.; Calderini, G.; Gallrapp, C.; George, M.; Gibson, S.; Grinstein, S.; Janoška, Zdenko; Jentzsch, J.; Jinnouchi, O.; Kishida, T.; La Rosa, A.; Libov, V.; Macchiolo, A.; Marchiori, G.; Muenstermann, D.; Nagai, R.; Piacquadio, G.; Ristic, B.; Rubinskiy, I.; Rummler, A.; Takubo, Y.; Troska, G.; Tsiskaridtze, S.; Tsurin, I.; Unno, Y.; Weigell, P.; Wittig, T.

    2012-01-01

    Roč. 7, Oct (2012), "P10028-1"-"P10028-26". ISSN 1748-0221 Institutional support: RVO:68378271 Keywords : particle tracking detectors * solid state detectors * radiation -hard detectors Subject RIV: BL - Plasma and Gas Discharge Physics Impact factor: 1.869, year: 2011

  9. Thin n-in-p planar pixel modules for the ATLAS upgrade at HL-LHC

    CERN Document Server

    Savic, N; Breuer, J; La Rosa, A; Macchiolo, A; Nisius, R; Terzo, S

    2016-01-01

    The ATLAS experiment will undergo a major upgrade of the tracker system in view of the high luminosity phase of the LHC (HL-LHC) foreseen to start around 2025. Thin planar pixel modules are promising candidates to instrument the new pixel system, thanks to the reduced contribution to the material budget and their high charge collection efficiency after irradiation. New designs of the pixel cells, with an optimized biasing structure, have been implemented in n-in-p planar pixel productions with sensor thicknesses of 270 um. Using beam tests, the gain in hit efficiency is investigated as a function of the received irradiation fluence. The outlook for future thin planar pixel sensor productions will be discussed, with a focus on thin sensors with a thickness of 100 and 150 um and a novel design with the optimized biasing structure and small pixel cells (50 um x 50 um and 25 um x 100 um). These dimensions are foreseen for the new ATLAS read-out chip in 65 nm CMOS technology and the fine segmentation will represen...

  10. High-speed readout of high-Z pixel detectors with the LAMBDA detector

    International Nuclear Information System (INIS)

    High-frame-rate X-ray pixel detectors make it possible to perform time-resolved experiments at synchrotron beamlines, and to make better use of these sources by shortening experiment times. LAMBDA is a photon-counting hybrid pixel detector based on the Medipix3 chip, designed to combine a small pixel size of 55 μm, a large tileable module design, high speed, and compatibility with ''high-Z'' sensors for hard X-ray detection. This technical paper focuses on LAMBDA's high-speed-readout functionality, which allows a frame rate of 2000 frames per second with no deadtime between successive images. This takes advantage of the Medipix3 chip's ''continuous read-write'' function and highly parallelised readout. The readout electronics serialise this data and send it back to a server PC over two 10 Gigabit Ethernet links. The server PC controls the detector and receives, processes and stores the data using software designed for the Tango control system. As a demonstration of high-speed readout of a high-Z sensor, a GaAs LAMBDA detector was used to make a high-speed X-ray video of a computer fan

  11. Data Concentrator for the BELLE II DEPFET pixel detector

    International Nuclear Information System (INIS)

    The innermost two layers of the BELLE II detector located at the KEK facility in Tsukuba, Japan, will be covered by high granularity DEPFET pixel (PXD) sensors. This leads to a high data rate of around 60 Gbps, which has to be significantly reduced by the Data Acquisition System. To perform the data reduction the hit information of the surrounding silicon strip detector (SVD) is used to define so-called Regions of Interest (ROI) and only hits inside these ROIs are saved. The ROIs are computed by reconstructing track segments from SVD data. A data reduction of up to a factor of 10 can be achieved this way. All the necessary processing stages, the receiving and multiplexing of the data on many optical links from the SVD, the track reconstruction and the definition of the ROIs, are performed by the Data Concentrator. The planned hardware design is based on a distributed set of Advanced Mezzanine Cards (AMC) each equipped with a Field Programmable Gate Array (FPGA) chip. In this talk, the firmware development of the algorithms and the hardware implementation of the Data Concentrator are discussed. In addition, preliminary studies of track reconstruction algorithms, that could be used for FPGA-based tracking, are presented.

  12. From vertex detectors to inner trackers with CMOS pixel sensors

    CERN Document Server

    Besson, A; Spiriti, E; Baudot, J; Claus, G; Goffe, M; Winter, M

    2016-01-01

    The use of CMOS Pixel Sensors (CPS) for high resolution and low material vertex detectors has been validated with the 2014 and 2015 physics runs of the STAR-PXL detector at RHIC/BNL. This opens the door to the use of CPS for inner tracking devices, with 10-100 times larger sensitive area, which require therefore a sensor design privileging power saving, response uniformity and robustness. The 350 nm CMOS technology used for the STAR-PXL sensors was considered as too poorly suited to upcoming applications like the upgraded ALICE Inner Tracking System (ITS), which requires sensors with one order of magnitude improvement on readout speed and improved radiation tolerance. This triggered the exploration of a deeper sub-micron CMOS technology, Tower-Jazz 180 nm, for the design of a CPS well adapted for the new ALICE-ITS running conditions. This paper reports the R&D results for the conception of a CPS well adapted for the ALICE-ITS.

  13. Studies of diffraction with the ATLAS detector

    International Nuclear Information System (INIS)

    The thesis is devoted to the study of diffractive physics with the ATLAS detector at the LHC. After a short introduction to diffractive physics including soft and hard diffraction, we discuss Jet-Gap-Jet production at the LHC which is particularly interesting for testing the Balitski Fadin Kuraev Lipatov QCD evolution equation. Using the signal selection requirements and a gap definition based on tracks reconstructed in the ATLAS Inner Detector, we observe a clear signal of Jet-Gap-Jet events in the data. Starting from the half-gap size of 0.8 the data cannot be properly described using only the Jet Monte Carlo sample without gaps. Furthermore, we demonstrated that DPE JGJ production, with both protons tagged in the AFP stations, should provide a significant test of the BFKL theory, once the 300 pb-1 of integrated luminosity is collected. In the last part of the thesis, we discussed the processes of Central Exclusive Jet and Exclusive π+π- production. After the data selection, the signal to background ratio is found to be of about 5/9 (1/13) for μ= 23 (46). For a collected integrated luminosity of 40(300) fb-1 (for pile-up of 23(46)) this measurement will deliver ten times better constraints on the theoretical models than the most recent ones. The additional measurement of exclusive pion production, relying on the use of the ALFA stations, allows to constrain further the exclusive models. We demonstrated that a data sample collected by the ALFA detectors should be sufficient to measure the cross section and to study various distributions, especially the invariant mass of the pion-pion system. (author)

  14. Charge Sharing Effect on 600 {\\mu}m Pitch Pixelated CZT Detector for Imaging Applications

    CERN Document Server

    Yin, Yongzhi; Xu, Dapeng; Chen, Ximeng

    2013-01-01

    We are currently investigating the spatial resolution of highly pixelated Cadmium Zinc Telluride (CZT) detector for imaging applications. A 20 mm {\\times} 20 mm {\\times} 5 mm CZT substrate was fabricated with 600 {\\mu}m pitch pixels (500 {\\mu}m anode pixels with 100 {\\mu}m gap) and coplanar cathode. Charge sharing between two pixels was studied using collimated 122 keV gamma ray source. Experiments show a resolution of 125 {\\mu}m FWHM for double-pixel charge sharing events when the 600 {\\mu}m pixelated and 5 mm thick CZT detector biased at -1000 V. In addition, we analyzed the energy response of the 600 {\\mu}m pitch pixelated CZT detector.

  15. X-ray imaging using single photon processing with semiconductor pixel detectors

    International Nuclear Information System (INIS)

    More than 10 years experience with semiconductor pixel detectors for vertex detection in high-energy physics experiments together with the steady progress in CMOS technology opened the way for the development of single photon processing pixel detectors for various applications including medical X-ray imaging. The state of the art of such pixel devices consists of pixel dimensions as small as 55x55 μm2, electronic noise per pixel 100 e- rms, signal-to-noise discrimination levels around 1000 e- with a spread 50 e- and a dynamic range up to 32 bits/pixel. Moreover, the high granularity of hybrid pixel detectors makes it possible to probe inhomogeneities of the attached semiconductor sensor

  16. X-ray imaging using single photon processing with semiconductor pixel detectors

    CERN Document Server

    Mikulec, Bettina; Heijne, Erik H M; Llopart-Cudie, Xavier; Tlustos, Lukas

    2003-01-01

    More than 10 years experience with semiconductor pixel detectors for vertex detection in high energy physics experiments together with the steady progress in CMOS technology opened the way for the development of single photon processing pixel detectors for various applications including medical X-ray imaging. The state of the art of such pixel devices consists of pixel dimensions as small as 55x55 um2, electronic noise per pixel <100 e- rms, signal-to-noise discrimination levels around 1000 e- with a spread <50 e- and a dynamic range up to 32 bits per pixel. Moreover, the high granularity of hybrid pixel detectors makes it possible to probe inhomogeneities of the attached semiconductor sensor.

  17. Petalet prototype for the ATLAS silicon strip detector upgrade

    International Nuclear Information System (INIS)

    To achieve more precise measurements and to search new physics phenomena, the luminosity at the LHC is expected to be increased during a series of upgrades in the next years. The latest scheduled upgrade, called the High Luminosity LHC (HL-LHC) is proposed to provide instantaneous luminosity of 5 x 1034 cm2s-1. The increased luminosity and the radiation damage will affect the current Inner Tracker. In order to cope with the higher radiation dose and occupancy, the ATLAS experiment plans to replace the current Inner Detector with a new all-silicon tracker consisting of ∝8 m2 pixel and ∝192 m2 strip detectors. In response to the needs, highly modular structures will be used for the strip system, called Staves for the barrel region and Petals for the end-caps region. A small-scaled prototype for the Petal, the Petalet, is built to study some specialties of this complex wedge-shaped structures. The Petalet consists of one large and two small sized sensors. This report focuses on the recent progress in the prototyping of the Petalet and their electrical performances.

  18. Characterization of M-π-n CdTe pixel detectors coupled to HEXITEC readout chip

    Science.gov (United States)

    Veale, M. C.; Kalliopuska, J.; Pohjonen, H.; Andersson, H.; Nenonen, S.; Seller, P.; Wilson, M. D.

    2012-01-01

    Segmentation of the anode-side of an M-π-n CdTe diode, where the pn-junction is diffused into the detector bulk, produces large improvements in the spatial and energy resolution of CdTe pixel detectors. It has been shown that this fabrication technique produces very high inter-pixel resistance and low leakage currents are obtained by physical isolation of the pixels of M-π-n CdTe detectors. In this paper the results from M-π-n CdTe detectors stud bonded to a spectroscopic readout ASIC are reported. The CdTe pixel detectors have 250 μm pitch and an area of 5 × 5 mm2 with thicknesses of 1 and 2 mm. The polarization and energy resolution dependence of the M-π-n CdTe detectors as a function of detector thickness are discussed.

  19. Display of cosmic ray event going through the pixel detector taken on October 18th 2008

    CERN Multimedia

    ATLAS, Experiment

    2014-01-01

    Shown are the XY view (of SCT and pixels and of pixels alone) and an RZ view. The track has a hit in each of the layers in both the upper and the lower hemisphere. In the bottom of L0 there are even two hits due to a module overlap. Apart from the signal hits there is only one other hit in the pixel detector demonstrating the very low noise level in the detector.

  20. Heavy Ion Physics with the ATLAS Detector

    CERN Multimedia

    Takai, H

    2003-01-01

    I guess the first thing that comes to people's mind is why is an experiment such as ATLAS interested in heavy ion physics. What is heavy ion physics anyway? The term heavy ion physics refers to the study of collisions between large nuclei such as lead, atomic number 208. But why would someone collide something as large and extensive as lead nuclei? When two nuclei collide there is a unique opportunity to study QCD at extreme energy densities. This said why do we think ATLAS is a good detector to study this particular physics? Among many of the simultaneous collisions that takes place when two nuclei encouter, hard scattering takes place. The unique situation now is that before hadronization partons from hard scattering may feel the surrounding media serving as an ideal probe for the matter formed in these collisions. As a consequence of this, jets may be quenched and their properties, e.g. fragmentation function or cone radius, modified when compared to proton-proton collisions. This is precisely where ATL...

  1. ATLAS detector control system data viewer

    International Nuclear Information System (INIS)

    The ATLAS experiment at CERN is one of the four Large Hadron Collider experiments. DCS Data Viewer (DDV) is a web interface application that provides access to historical data of ATLAS Detector Control System (DCS) parameters written to the database (DB). It has a modular and flexible design and is structured using a client-server architecture. The server can be operated stand alone with a command-line interface to the data while the client offers a user friendly, browser independent interface. The selection of the meta-data of DCS parameters is done via a column-tree view or with a powerful search engine. The final visualisation of the data is done using various plug-ins such as 'value over time' charts, data tables, raw ASCII or structured export to ROOT. Excessive access or malicious use of the database is prevented by dedicated protection mechanisms, allowing the exposure of the tool to hundreds of inexperienced users. The meta-data selection and data output features can be used separately by XML configuration files. Security constraints have been taken into account in the implementation allowing the access of DDV by collaborators worldwide. (authors)

  2. ATLAS Detector Control System Data Viewer

    CERN Document Server

    Tsarouchas, Charilaos; Roe, S; Bitenc, U; Fehling-Kaschek, ML; Winkelmann, S; D’Auria, S; Hoffmann, D; Pisano, O

    2011-01-01

    The ATLAS experiment at CERN is one of the four Large Hadron Collider experiments. DCS Data Viewer (DDV) is a web interface application that provides access to historical data of ATLAS Detector Control System [1] (DCS) parameters written to the database (DB). It has a modular andflexible design and is structured using a clientserver architecture. The server can be operated stand alone with a command-line interface to the data while the client offers a user friendly, browser independent interface. The selection of the metadata of DCS parameters is done via a column-tree view or with a powerful search engine. The final visualisation of the data is done using various plugins such as “value over time” charts, data tables, raw ASCII or structured export to ROOT. Excessive access or malicious use of the database is prevented by dedicated protection mechanisms, allowing the exposure of the tool to hundreds of inexperienced users. The metadata selection and data output features can be used separately by XML con...

  3. Radiation-hard active CMOS pixel sensors for HL-LHC detector upgrades

    Science.gov (United States)

    Backhaus, Malte

    2015-02-01

    The luminosity of the Large Hadron Collider (LHC) will be increased during the Long Shutdown of 2022 and 2023 (LS3) in order to increase the sensitivity of its experiments. A completely new inner detector for the ATLAS experiment needs to be developed to withstand the extremely harsh environment of the upgraded, so-called High-Luminosity LHC (HL-LHC). High radiation hardness as well as granularity is mandatory to cope with the requirements in terms of radiation damage as well as particle occupancy. A new silicon detector concept that uses commercial high voltage and/or high resistivity full complementary metal-oxide-semiconductor (CMOS) processes as active sensor for pixel and/or strip layers has risen high attention, because it potentially provides high radiation hardness and granularity and at the same time reduced price due to the commercial processing and possibly relaxed requirements for the hybridization technique. Results on the first prototypes characterized in a variety of laboratory as well as test beam environments are presented.

  4. The New ATLAS/LUCID detector

    CERN Document Server

    Bruschi, Marco; The ATLAS collaboration

    2015-01-01

    The new ATLAS luminosity monitor has many innovative aspects implemented. Its photomultipliers tubes are used as detector elements by using the Cherenkov light produced by charged particles above threshold crossing the quartz windows. The analog shaping of the readout chain has been improved, in order to cope with the 25 ns bunch spacing of the LHC machine. The main readout card is a quite general processing unit based on 12 bit - 500 MS/s Flash ADC and on FPGAs, delivering the processed data to 1.3 Gb/s optical links. The talk will describe all these aspects and will outline future perspectives of the card for next generation high energy physics experiments.

  5. The new ATLAS/LUCID detector

    CERN Document Server

    Bruschi, Marco; The ATLAS collaboration

    2015-01-01

    The new ATLAS luminosity monitor has many innovative aspects implemented. Its photomultipliers tubes are used as detector elements by using the Cherenkov light produced by charged particles above threshold crossing the quartz windows. The analog shaping of the readout chain has been improved, in order to cope with the 25 ns bunch spacing of the LHC machine. The main readout card is a quite general processing unit based on 12 bit - 320 MS/s Flash ADC and on FPGAs, delivering the processed data to 1.3 Gb/s optical links. The article will describe all these aspects and will outline future perspectives of the card for next generation high energy physics experiments.

  6. Small-Scale Readout System Prototype for the STAR PIXEL Detector

    Energy Technology Data Exchange (ETDEWEB)

    Szelezniak, Michal; Anderssen, Eric; Greiner, Leo; Matis, Howard; Ritter, Hans Georg; Stezelberger, Thorsten; Sun, Xiangming; Thomas, James; Vu, Chinh; Wieman, Howard

    2008-10-10

    Development and prototyping efforts directed towards construction of a new vertex detector for the STAR experiment at the RHIC accelerator at BNL are presented. This new detector will extend the physics range of STAR by allowing for precision measurements of yields and spectra of particles containing heavy quarks. The innermost central part of the new detector is a high resolution pixel-type detector (PIXEL). PIXEL requirements are discussed as well as a conceptual mechanical design, a sensor development path, and a detector readout architecture. Selected progress with sensor prototypes dedicated to the PIXEL detector is summarized and the approach chosen for the readout system architecture validated in tests of hardware prototypes is discussed.

  7. Modelling and 3D optimisation of CdTe pixels detector array geometry - Extension to small pixels

    Energy Technology Data Exchange (ETDEWEB)

    Zumbiehl, A. E-mail: zumbiehl@phase.c-strasbourg.fr; Hage-Ali, M.; Fougeres, P.; Koebel, J.M.; Regal, R.; Rit, C.; Ayoub, M.; Siffert, P

    2001-08-11

    CdTe and CdZnTe pixel detectors offer great interest for many applications, especially for medical and industrial imaging. Up to now, the material, generally, used and investigated for pixel arrays was CZT (Hamel et al., IEEE Trans. Nucl. Sci. 43 (3) (1996) 1422; Barrett et al., Phys. Rev. Lett. 75 (1) (1995) 156; Bennett et al., Nucl. Instr. and Meth. A 392 (1997) 260; Eskin et al., J. Appl. Phys. 85 (2) (1999) 647; Brunett et al., J. Appl. Phys. 86 (7) (1999) 3926; Luke, Nucl. Instr. and Meth. A 380 (1996) 232), but cadmium telluride can also be an appropriate choice, as shown here. However, we clearly demonstrate here that the optimal pixel configuration is highly dependent on the electrical transport properties of the material. Depending on the field of primary interest, either energy resolution or counting rate efficiency in the photopeak, the geometry for each case has to be optimised. For that purpose, we have developed a calculation of the signal induced onto the pixel. Two distinct parts are used: after showing our approach for the weighting potential calculation, we present our results performed by a 'pseudo-Monte Carlo' simulation. Results are supported by a few experimental comparisons. We argue about the optimum sizes with clarifying the problems caused by too small and too large pixel sizes. The study field is chosen to be vast, i.e. pixel size to detector thickness ratios (W/L) of 1/8-1, and detector thickness of 1.0-8.0 mm. In addition, several electrical transport properties are used. Since efficiency is often of primary interest, thick detectors could be very attractive, which are shown to be really feasible even on CdTe.

  8. Modelling and 3D optimisation of CdTe pixels detector array geometry - Extension to small pixels

    Science.gov (United States)

    Zumbiehl, A.; Hage-Ali, M.; Fougeres, P.; Koebel, J. M.; Regal, R.; Rit, C.; Ayoub, M.; Siffert, P.

    2001-08-01

    CdTe and CdZnTe pixel detectors offer great interest for many applications, especially for medical and industrial imaging. Up to now, the material, generally, used and investigated for pixel arrays was CZT (Hamel et al., IEEE Trans. Nucl. Sci. 43 (3) (1996) 1422; Barrett et al., Phys. Rev. Lett. 75 (1) (1995) 156; Bennett et al., Nucl. Instr. and Meth. A 392 (1997) 260; Eskin et al., J. Appl. Phys. 85 (2) (1999) 647; Brunett et al., J. Appl. Phys. 86 (7) (1999) 3926; Luke, Nucl. Instr. and Meth. A 380 (1996) 232), but cadmium telluride can also be an appropriate choice, as shown here. However, we clearly demonstrate here that the optimal pixel configuration is highly dependent on the electrical transport properties of the material. Depending on the field of primary interest, either energy resolution or counting rate efficiency in the photopeak, the geometry for each case has to be optimised. For that purpose, we have developed a calculation of the signal induced onto the pixel. Two distinct parts are used: after showing our approach for the weighting potential calculation, we present our results performed by a "pseudo-Monte Carlo" simulation. Results are supported by a few experimental comparisons. We argue about the optimum sizes with clarifying the problems caused by too small and too large pixel sizes. The study field is chosen to be vast, i.e. pixel size to detector thickness ratios ( W/ L) of 1/8-1, and detector thickness of 1.0-8.0 mm. In addition, several electrical transport properties are used. Since efficiency is often of primary interest, thick detectors could be very attractive, which are shown to be really feasible even on CdTe.

  9. Performance of common-grid pixelated CZT detector with different array geometries

    International Nuclear Information System (INIS)

    A 4 × 4 common-grid pixelated CZT detector with four different array geometries has been designed and fabricated. The impact of small pixel effect, guide effect of the steering grid and edge effect on detector performance has been investigated. Both the weighting potential and the real electric field distributions have been calculated for better understanding the charge induction and collection. Results show that with constant pixel pitch, smaller anode pixel suffers from serious charge loss in volume and surface layer between anode pixels and steering grid. The small pixel effect is not strong enough to remove hole trailing for lager anode pixel. A relative high potential difference between anode pixels and steering grid leads to sufficient charge collection resulting in a better detector performance, especially for smaller anode pixels. In addition to edge and corner effects due to faulty or imperfect fabrication of the detector, the weighting potential distribution difference is an inherent physical effect that alter the profile of the induced signals in edge and corner pixels

  10. Performance of the ATLAS Detector using First Collision Data

    CERN Document Server

    Aad, G; Abbott, B; Abdallah, J; Abdelalim, A A; Abdesselam, A; Abdinov, O; Abi, B; Abolins, M; Abramowicz, H; Abreu, H; Acerbi, E; Acharya, B S; Ackers, M; Adams, D L; Addy, T N; Adelman, J; Aderholz, M; Adomeit, S; Adorisio, C; Adragna, P; Adye, T; Aefsky, S; Aguilar-Saavedra, J A; Aharrouche, M; Ahlen, S P; Ahles, F; Ahmad, A; Ahmed, H; Ahsan, M; Aielli, G; Akdogan, T; Åkesson, P F; Åkesson, T P A; Akimoto, G; Akimov, A V; Aktas, A; Alam, M S; Alam, M A; Albrand, S; Aleksa, M; Aleksandrov, I N; Aleppo, M; Alessandria, F; Alexa, C; Alexander, G; Alexandre, G; Alexopoulos, T; Alhroob, M; Aliev, M; Alimonti, G; Alison, J; Aliyev, M; Allport, P P; Allwood-Spiers, S E; Almond, J; Aloisio, A; Alon, R; Alonso, A; Alonso, J; Alviggi, M G; Amako, K; Amaral, P; Ambrosini, G; Ambrosio, G; Amelung, C; Ammosov, V V; Ammosov, V V; Amorim, A; Amorós, G; Amram, N; Anastopoulos, C; Andeen, T; Anders, C F; Anderson, K J; Andreazza, A; Andrei, V; Andrieux, M-L; Anduaga, X S; Angerami, A; Anghinolfi, F; Anjos, N; Annovi, A; Antonaki, A; Antonelli, M; Antonelli, S; Antos, J; Antunovic, B; Anulli, F; Aoun, S; Arabidze, G; Aracena, I; Arai, Y; Arce, A T H; Archambault, J P; Arfaoui, S; Arguin, J-F; Argyropoulos, T; Arik, E; Arik, M; Armbruster, A J; Arms, K E; Armstrong, S R; Arnaez, O; Arnault, C; Artamonov, A; Arutinov, D; Asai, M; Asai, S; Asfandiyarov, R; Ask, S; Åsman, B; Asner, D; Asquith, L; Assamagan, K; Astbury, A; Astvatsatourov, A; Atoian, G; Aubert, B; Auerbach, B; Auge, E; Augsten, K; Aurousseau, M; Austin, N; Avolio, G; Avramidou, R; Axen, D; Ay, C; Azuelos, G; Azuma, Y; Baak, M A; Baccaglioni, G; Bacci, C; Bach, A M; Bachacou, H; Bachas, K; Bachy, G; Backes, M; Badescu, E; Bagnaia, P; Bai, Y; Bailey, D C; Bain, T; Baines, J T; Baker, O K; Baker, M D; Baker, S; Baltasar Dos Santos Pedrosa, F; Banas, E; Banerjee, P; Banerjee, S; Banfi, D; Bangert, A; Bansal, V; Baranov, S P; Baranov, S; Barashkou, A; Barber, T; Barberio, E L; Barberis, D; Barbero, M; Bardin, D Y; Barillari, T; Barisonzi, M; Barklow, T; Barlow, N; Barnett, B M; Barnett, R M; Baroncelli, A; Barone, M; Barr, A J; Barreiro, F; Barreiro Guimarães da, J; Barrillon, P; Bartoldus, R; Bartsch, D; Bates, R L; Batkova, L; Batley, J R; Battaglia, A; Battistin, M; Battistoni, G; Bauer, F; Bawa, H S; Bazalova, M; Beare, B; Beau, T; Beauchemin, P H; Beccherle, R; Becerici, N; Bechtle, P; Beck, G A; Beck, H P; Beckingham, M; Becks, K H; Beddall, A J; Beddall, A; Bednyakov, V A; Bee, C; Begel, M; Behar Harpaz, S; Behera, P K; Beimforde, M; Belanger, G A N; Belanger-Champagne, C; Belhorma, B; Bell, P J; Bell, W H; Bella, G; Bellagamba, L; Bellina, F; Bellomo, G; Bellomo, M; Belloni, A; Belotskiy, K; Beltramello, O; Belymam, A; Ben Ami, S; Benary, O; Benchekroun, D; Benchouk, C; Bendel, M; Benedict, B H; Benekos, N; Benhammou, Y; Benincasa, G P; Benjamin, D P; Benoit, M; Bensinger, J R; Benslama, K; Bentvelsen, S; Beretta, M; Berge, D; Bergeaas Kuutmann, E; Berger, N; Berghaus, F; Berglund, E; Beringer, J; Bernardet, K; Bernat, P; Bernhard, R; Bernius, C; Berry, T; Bertin, A; Bertinelli, F; Bertolucci, S; Besana, M I; Besson, N; Bethke, S; Bianchi, R M; Bianco, M; Biebel, O; Bieri, M; Biesiada, J; Biglietti, M; Bilokon, H; Binder, M; Bindi, M; Binet, S; Bingul, A; Bini, C; Biscarat, C; Bischof, R; Bitenc, U; Black, K M; Blair, R E; Blanch, O; Blanchard, J-B; Blanchot, G; Blocker, C; Blocki, J; Blondel, A; Blum, W; Blumenschein, U; Boaretto, C; Bobbink, G J; Bocci, A; Bocian, D; Bock, R; Boehler, M; Boek, J; Boelaert, N; Böser, S; Bogaerts, J A; Bogouch, A; Bohm, C; Bohm, J; Boisvert, V; Bold, T; Boldea, V; Bondarenko, V G; Bondioli, M; Bonino, R; Boonekamp, M; Boorman, G; Boosten, M; Booth, C N; Booth, P S L; Booth, P; Booth, J R A; Bordoni, S; Borer, C; Borer, K; Borisov, A; Borissov, G; Borjanovic, I; Borroni, S; Bos, K; Boscherini, D; Bosman, M; Boterenbrood, H; Botterill, D; Bouchami, J; Boudreau, J; Bouhova-Thacker, E V; Boulahouache, C; Bourdarios, C; Boveia, A; Boyd, J; Boyko, I R; Bozhko, N I; Bozovic-Jelisavcic, I; Braccini, S; Bracinik, J; Braem, A; Brambilla, E; Branchini, P; Brandenburg, G W; Brandt, A; Brandt, G; Brandt, O; Bratzler, U; Brau, B; Brau, J E; Braun, H M; Bravo, S; Brelier, B; Bremer, J; Brenner, R; Bressler, S; Breton, D; Brett, N D; Bright-Thomas, P G; Britton, D; Brochu, F M; Brock, I; Brock, R; Brodbeck, T J; Brodet, E; Broggi, F; Bromberg, C; Brooijmans, G; Brooks, W K; Brown, G; Brubaker, E; Bruckman de Renstrom, P A; Bruncko, D; Bruneliere, R; Brunet, S; Bruni, A; Bruni, G; Bruschi, M; Buanes, T; Bucci, F; Buchanan, J; Buchanan, N J; Buchholz, P; Buckley, A G; Budagov, I A; Budick, B; Büscher, V; Bugge, L; Buira-Clark, D; Buis, E J; Bujor, F; Bulekov, O; Bunse, M; Buran, T; Burckhart, H; Burdin, S; Burgess, T; Burke, S; Busato, E; Bussey, P; Buszello, C P; Butin, F; Butler, B; Butler, J M

    2010-01-01

    More than half a million minimum-bias events of LHC collision data were collected by the ATLAS experiment in December 2009 at centre-of-mass energies of 0.9 TeV and 2.36 TeV. This paper reports on studies of the initial performance of the ATLAS detector from these data. Comparisons between data and Monte Carlo predictions are shown for distributions of several track- and calorimeter-based quantities. The good performance of the ATLAS detector in these first data gives confidence for successful running at higher energies.

  11. Development of hybrid photon detectors with integrated silicon pixel readout for the RICH counters of LHCb

    CERN Document Server

    Alemi, M; Formenti, F; Gys, Thierry; Piedigrossi, D; Puertolas, D; Rosso, E; Snoeys, W; Wyllie, Ken H

    1999-01-01

    We report on the ongoing work towards a hybrid photon detector with integrated silicon pixel readout for the ring imaging Cherenkov detectors of the LHCb experiment at the Large Hadron Collider at CERN. The photon detector is based $9 on a cross-focussed image intensifier tube geometry where the image is de-magnified by a factor of 4. The anode consists of a silicon pixel array, bump-bonded to a fast, binary readout chip with matching pixel electronics. The $9 performance of a half-scale prototype is presented, together with the developments and tests of a full-scale tube with large active area. Specific requirements for pixel front-end and readout electronics in LHCb are outlined, and $9 recent results obtained from pixel chips applicable to hybrid photon detector design are summarized.

  12. Performance Studies of Pixel Hybrid Photon Detectors for the LHCb RICH Counters

    CERN Document Server

    Aglieri Rinella, G; Piedigrossi, D; Van Lysebetten, A

    2004-01-01

    The Pixel Hybrid Photon Detector is a vacuum tube with a multi-alkali photo cathode, high voltage cross-focused electron optics and an anode consisting of a silicon pixel detector bump-bonded to a readout CMOS electronic chip fully encapsulated in the device. The Pixel HPD fulfils the requirements of the Ring Imaging Cherenkov counters of the LHCb experiment at LHC. The performances of the Pixel HPD will be discussed with reference to laboratory measurements, Cherenkov light imaging in recent beam tests, image distortions due to a magnetic field.

  13. Performance studies of pixel hybrid photon detectors for the LHCb RICH counters

    CERN Document Server

    Aglieri-Rinella, G; Piedigrossi, D; Van Lysebetten, A

    2006-01-01

    The Pixel Hybrid Photon Detector is a vacuum tube with a multi-alkali photo cathode, high voltage cross-focused electron optics and an anode consisting of a silicon pixel detector bump-bonded to a readout CMOS electronic chip fully encapsulated in the device. The Pixel HPD fulfils the requirements of the Ring Imaging Cherenkov counters of the LHCb experiment at LHC. The performances of the Pixel HPD will be discussed with reference to laboratory measurements, Cherenkov light imaging in recent beam tests, image distortions due to a magnetic field.

  14. Test Results on the Silicon Pixel Detector for the TTF-FEL Beam Trajectory Monitor

    CERN Document Server

    Hillert, S; Müller, U C; Roth, S; Hansen, K; Holl, P; Karstensen, S; Kemmer, J; Klanner, Robert; Lechner, P; Leenen, M; Ng, J S T; Schmüser, P; Strüder, L

    2001-01-01

    Test measurements on the silicon pixel detector for the beam trajectory monitor at the free electron laser of the TESLA test facility are presented. To determine the electronic noise of detector and read-out and to calibrate the signal amplitude of different pixels the 6 keV photons of the manganese K line are used. Two different methods determine the spatial accuracy of the detector: In one setup a laser beam is focused to a straight line and moved across the pixel structure. In the other the detector is scanned using a low-intensity electron beam of an electron microscope. Both methods show that the symmetry axis of the detector defines a straight line within 0.4 microns. The sensitivity of the detector to low energy X-rays is measured using a vacuum ultraviolet beam at the synchrotron light source HASYLAB. Additionally, the electron microscope is used to study the radiation hardness of the detector.

  15. Uncooled infrared detectors toward smaller pixel pitch with newly proposed pixel structure

    Science.gov (United States)

    Tohyama, Shigeru; Sasaki, Tokuhito; Endoh, Tsutomu; Sano, Masahiko; Kato, Koji; Kurashina, Seiji; Miyoshi, Masaru; Yamazaki, Takao; Ueno, Munetaka; Katayama, Haruyoshi; Imai, Tadashi

    2013-12-01

    An uncooled infrared (IR) focal plane array (FPA) with 23.5 μm pixel pitch has been successfully demonstrated and has found wide commercial applications in the areas of thermography, security cameras, and other applications. One of the key issues for uncooled IRFPA technology is to shrink the pixel pitch because the size of the pixel pitch determines the overall size of the FPA, which, in turn, determines the cost of the IR camera products. This paper proposes an innovative pixel structure with a diaphragm and beams placed in different levels to realize an uncooled IRFPA with smaller pixel pitch (≦17 μm). The upper level consists of a diaphragm with VOx bolometer and IR absorber layers, while the lower level consists of the two beams, which are designed to be placed on the adjacent pixels. The test devices of this pixel design with 12, 15, and 17 μm pitch have been fabricated on the Si read-out integrated circuit (ROIC) of quarter video graphics array (QVGA) (320×240) with 23.5 μm pitch. Their performances are nearly equal to those of the IRFPA with 23.5 μm pitch. For example, a noise equivalent temperature difference of 12 μm pixel is 63.1 mK for F/1 optics with the thermal time constant of 14.5 ms. Then, the proposed structure is shown to be effective for the existing IRFPA with 23.5 μm pitch because of the improvements in IR sensitivity. Furthermore, the advanced pixel structure that has the beams composed of two levels are demonstrated to be realizable.

  16. Test Results on the Silicon Pixel Detector for the TTF-FEL Beam Trajectory Monitor

    OpenAIRE

    Hillert, S.; Ischebeck, R.; Müller, U. C.; Roth, S.; Hansen, K.; Holl, P.; Karstensen, S.; Kemmer, J.; Klanner, R.; Lechner, P.; Leenen, M; Ng, J. S. T.; Schmüser, P.; Strüder, L.

    2000-01-01

    Test measurements on the silicon pixel detector for the beam trajectory monitor at the free electron laser of the TESLA test facility are presented. To determine the electronic noise of detector and read-out and to calibrate the signal amplitude of different pixels the 6 keV photons of the manganese K line are used. Two different methods determine the spatial accuracy of the detector: In one setup a laser beam is focused to a straight line and moved across the pixel structure. In the other th...

  17. Modeling Inter-Pixel Crosstalk in Teledyne Imaging Sensors H4RG Detectors

    CERN Document Server

    Dudik, R P; Dorland, B N; Veillette, D; Waczynski, A; Lane, B; Loose, M; Kan, E; Waterman, J; Pravdo, S

    2012-01-01

    CMOS-hybrid arrays have recently surfaced as competitive optical detectors for use in ground- and space-based astronomy. One source of error in these detectors that does not appear in more traditional CCD arrays is the inter-pixel capacitance component of crosstalk. In this paper we use a single pixel reset method to model inter-pixel capacitance (IPC). We combine this IPC model with a model for charge diffusion to estimate the total crosstalk on H4RG arrays. Finally, we compare our model results to Fe55 data obtained using an astrometric camera built to test the H4RG-B0 generation detectors.

  18. X-CSIT: a toolkit for simulating 2D pixel detectors

    International Nuclear Information System (INIS)

    A new, modular toolkit for creating simulations of 2D X-ray pixel detectors, X-CSIT (X-ray Camera SImulation Toolkit), is being developed. The toolkit uses three sequential simulations of detector processes which model photon interactions, electron charge cloud spreading with a high charge density plasma model and common electronic components used in detector readout. In addition, because of the wide variety in pixel detector design, X-CSIT has been designed as a modular platform so that existing functions can be modified or additional functionality added if the specific design of a detector demands it. X-CSIT will be used to create simulations of the detectors at the European XFEL, including three bespoke 2D detectors: the Adaptive Gain Integrating Pixel Detector (AGIPD), Large Pixel Detector (LPD) and DePFET Sensor with Signal Compression (DSSC). These simulations will be used by the detector group at the European XFEL for detector characterisation and calibration. For this purpose, X-CSIT has been integrated into the European XFEL's software framework, Karabo. This will further make it available to users to aid with the planning of experiments and analysis of data. In addition, X-CSIT will be released as a standalone, open source version for other users, collaborations and groups intending to create simulations of their own detectors

  19. ATLAS's inner detector installed in the heart of the experiment

    CERN Multimedia

    2006-01-01

    The ATLAS collaboration recently celebrated a major engineering milestone, namely the transport and installation of the central part of the inner detector (ID-barrel) into the ATLAS detector. Right: Engineers and technicians work to carefully align and install the inner detector in the centre of ATLAS.Left: The crane used in the carefully coordinated effort by the ATLAS collaboration to lower down the fragile inner detector 100 metres underground to its new home. Many members of the collaboration gathered to witness this moment at Point 1. After years of design, construction and commissioning, the two outer detectors (TRT and SCT) of the inner detector barrel (ID-barrel) were moved from the SR1 cleanroom to the ATLAS cavern. The barrel was moved across the car park from Building 2175 to SX1. Although only a journey of about 100 metres, this required weeks of planning and some degree of luck as far as the weather was concerned. Special measures were in place to minimize shock and vibration during transportati...

  20. Recent results of the ATLAS upgrade planar pixel sensors R&D project

    Science.gov (United States)

    Weigell, Philipp

    2013-12-01

    To extend the physics reach of the LHC experiments, several upgrades to the accelerator complex are planned, culminating in the HL-LHC, which eventually leads to an increase of the peak luminosity by a factor of five to ten compared to the LHC design value. To cope with the higher occupancy and radiation damage also the LHC experiments will be upgraded. The ATLAS Planar Pixel Sensor R&D Project is an international collaboration of 17 institutions and more than 80 scientists, exploring the feasibility of employing planar pixel sensors for this scenario. Depending on the radius, different pixel concepts are investigated using laboratory and beam test measurements. At small radii the extreme radiation environment and strong space constraints are addressed with very thin pixel sensors active thickness in the range of (75-150) μm, and the development of slim as well as active edges. At larger radii the main challenge is the cost reduction to allow for instrumenting the large area of (7-10) m2. To reach this goal the pixel productions are being transferred to 6 in production lines and more cost-efficient and industrialised interconnection techniques are investigated. Additionally, the n-in-p technology is employed, which requires less production steps since it relies on a single-sided process. An overview of the recent accomplishments obtained within the ATLAS Planar Pixel Sensor R&D Project is given. The performance in terms of charge collection and tracking efficiency, obtained with radioactive sources in the laboratory and at beam tests, is presented for devices built from sensors of different vendors connected to either the present ATLAS read-out chip FE-I3 or the new Insertable B-Layer read-out chip FE-I4. The devices, with a thickness varying between 75 μm and 300 μm, were irradiated to several fluences up to 2×1016 neq/cm2. Finally, the different approaches followed inside the collaboration to achieve slim or active edges for planar pixel sensors are presented.

  1. The simulation of charge sharing in semiconductor X-ray pixel detectors

    CERN Document Server

    Mathieson, K; O'Shea, V; Passmore, M S; Rahman, M; Smith, K M; Watt, J; Whitehill, C

    2002-01-01

    Two simulation packages were used to model the sharing of charge, due to the scattering and diffusion of carriers, between adjacent pixel elements in semiconductors X-ray detectors. The X-ray interaction and the consequent multiple scattering was modelled with the aid of the Monte Carlo package, MCNP. The resultant deposited charge distribution was then used to create the charge cloud profile in the finite element semiconductor simulation code MEDICI. The analysis of the current pulses induced on pixel electrodes for varying photon energies was performed for a GaAs pixel detector. For a pixel pitch of 25 mu m, the charge lost to a neighbouring pixel was observed to be constant, at 0.6%, through the energies simulated. Ultimately, a fundamental limit on the pixel element size for imaging and spectroscopic devices may be set due to these key physical principles.

  2. X-ray imaging with photon counting hybrid semiconductor pixel detectors

    CERN Document Server

    Manolopoulos, S; Campbell, M; Snoeys, W; Heijne, Erik H M; Pernigotti, E; Raine, C; Smith, K; Watt, J; O'Shea, V; Ludwig, J; Schwarz, C

    1999-01-01

    Semiconductor pixel detectors, originally developed for particle physics experiments, have been studied as X-ray imaging devices. The performance of devices using the OMEGA 3 read-out chip bump-bonded to pixellated silicon semiconductor detectors is characterised in terms of their signal-to-noise ratio when exposed to 60 kVp X-rays. Although parts of the devices achieve values of this ratio compatible with the noise being photon statistics limited, this is not found to hold for the whole pixel matrix, resulting in the global signal-to-noise ratio being compromised. First results are presented of X-ray images taken with a gallium arsenide pixel detector bump-bonded to a new read-out chip, (MEDIPIX), which is a single photon counting read-out chip incorporating a 15-bit counter in every pixel. (author)

  3. X-ray imaging with photon counting hybrid semiconductor pixel detectors

    Energy Technology Data Exchange (ETDEWEB)

    Manolopoulos, S.; Bates, R.; Campbell, M.; Snoeys, W.; Heijne, E.; Pernigotti, E.; Raine, C.; Smith, K. E-mail: k.smith@physics.gla.ac.uk; Watt, J.; O' Shea, V.; Ludwig, J.; Schwarz, C

    1999-09-11

    Semiconductor pixel detectors, originally developed for particle physics experiments, have been studied as X-ray imaging devices. The performance of devices using the {omega}3 read-out chip bump-bonded to pixellated silicon semiconductor detectors is characterised in terms of their signal-to-noise ratio when exposed to 60 kVp X-rays. Although parts of the devices achieve values of this ratio compatible with the noise being photon statistics limited, this is not found to hold for the whole pixel matrix, resulting in the global signal-to-noise ratio being compromised. First results are presented of X-ray images taken with a gallium arsenide pixel detector bump-bonded to a new read-out chip, (MEDIPIX), which is a single photon counting read-out chip incorporating a 15-bit counter in every pixel. (author)

  4. Performance of radiation-hard HV/HR CMOS sensors for the ATLAS inner detector upgrades

    Science.gov (United States)

    Liu, J.; Barbero, M.; Bilbao De Mendizabal, J.; Breugnon, P.; Godiot-Basolo, S.; Pangaud, P.; Rozanov, A.

    2016-03-01

    A major upgrade (Phase II Upgrade) to the Large Hadron Collider (LHC), scheduled for 2022, will be brought to the machine so as to extend its discovery potential. The upgraded LHC, called High-Luminosity LHC (HL-LHC), will run with a nominal leveled instantaneous luminosity of 5×1034 cm-2s-1, more than twice the expected luminosity. This unprecedented luminosity will result in higher occupancy and background radiations, which will request the design of a new Inner Tracker (ITk) which should have higher granularity, reduced material budget and improved radiation tolerance. A new pixel sensor concept based on High Voltage and High Resistivity CMOS (HV/HR CMOS) technology targeting the ATLAS inner detector upgrade is under exploration. With respect to the traditional hybrid pixel detector, the HV/HR CMOS sensor can potentially offer lower material budget, reduced pixel pitch and lower cost. Several prototypes have been designed and characterized within the ATLAS upgrade R&D effort, to investigate the detection and radiation hardness performance of various commercial technologies. An overview of the HV/HR CMOS sensor operation principle is described in this paper. The characterizations of three prototypes with X-ray, proton and neutron irradiation are also given.

  5. Performance of radiation-hard HV/HR CMOS sensors for the ATLAS inner detector upgrades

    International Nuclear Information System (INIS)

    A major upgrade (Phase II Upgrade) to the Large Hadron Collider (LHC), scheduled for 2022, will be brought to the machine so as to extend its discovery potential. The upgraded LHC, called High-Luminosity LHC (HL-LHC), will run with a nominal leveled instantaneous luminosity of 5×1034 cm−2s−1, more than twice the expected luminosity. This unprecedented luminosity will result in higher occupancy and background radiations, which will request the design of a new Inner Tracker (ITk) which should have higher granularity, reduced material budget and improved radiation tolerance. A new pixel sensor concept based on High Voltage and High Resistivity CMOS (HV/HR CMOS) technology targeting the ATLAS inner detector upgrade is under exploration. With respect to the traditional hybrid pixel detector, the HV/HR CMOS sensor can potentially offer lower material budget, reduced pixel pitch and lower cost. Several prototypes have been designed and characterized within the ATLAS upgrade R and D effort, to investigate the detection and radiation hardness performance of various commercial technologies. An overview of the HV/HR CMOS sensor operation principle is described in this paper. The characterizations of three prototypes with X-ray, proton and neutron irradiation are also given

  6. Alignment of the ATLAS Inner Detector Tracking System

    CERN Document Server

    Moles-Valls, R

    2008-01-01

    The ATLAS experiment is equipped with a tracking system for c harged particles built on two technologies: silicon and drift tube base detectors. These kind of detectors compose the ATLAS Inner Detector (ID). The Alignment of the ATLAS ID tracking s ystem requires the determination of almost 36000 degrees of freedom. From the tracking point o f view, the alignment parameters should be know to a few microns precision. This permits to att ain optimal measurements of the parameters of the charged particles trajectories, thus ena bling ATLAS to achieve its physics goals. The implementation of the alignment software, its framewor k and the data flow will be discussed. Special attention will be paid to the recent challenges wher e large scale computing simulation of the ATLAS detector has been performed, mimicking the ATLAS o peration, which is going to be very important for the LHC startup scenario. The alignment r esult for several challenges (real cosmic ray data taking and computing system commissioning) will be...

  7. Silicon strip detectors for the ATLAS HL-LHC upgrade

    CERN Document Server

    Gonzalez Sevilla, S; The ATLAS collaboration

    2011-01-01

    The LHC upgrade is foreseen to increase the ATLAS design luminosity by a factor ten, implying the need to build a new tracker suited to the harsh HL-LHC conditions in terms of particle rates and radiation doses. In order to cope with the increase in pile-up backgrounds at the higher luminosity, an all silicon detector is being designed. To successfully face the increased radiation dose, a new generation of extremely radiation hard silicon detectors is being designed. We give an overview of the ATLAS tracker upgrade project, in particular focusing on the crucial innermost silicon strip layers. Results from a wide range of irradiated silicon detectors for the strip region of the future ATLAS tracker are presented. Layout concepts for lightweight yet mechanically very rigid detector modules with high service integration are shown.

  8. Efficient phase contrast imaging in STEM using a pixelated detector. Part II: Optimisation of imaging conditions

    International Nuclear Information System (INIS)

    In Part I of this series of two papers, we demonstrated the formation of a high efficiency phase-contrast image at atomic resolution using a pixelated detector in the scanning transmission electron microscope (STEM) with ptychography. In this paper we explore the technique more quantitatively using theory and simulations. Compared to other STEM phase contrast modes including annular bright field (ABF) and differential phase contrast (DPC), we show that the ptychographic phase reconstruction method using pixelated detectors offers the highest contrast transfer efficiency and superior low dose performance. Applying the ptychographic reconstruction method to DPC segmented detectors also improves the detector contrast transfer and results in less noisy images than DPC images formed using difference signals. We also find that using a minimum array of 16×16 pixels is sufficient to provide the highest signal-to-noise ratio (SNR) for imaging beam sensitive weak phase objects. Finally, the convergence angle can be adjusted to enhance the contrast transfer based on the spatial frequencies of the specimen under study. - Highlights: • High efficiency phase contrast transfer function (PCTF) can be achieved using pixelated detectors followed by a ptychographic reconstruction. • Ptychographic reconstruction offers the highest PCTF across the entire spatial frequency range compared to DPC and ABF. • Image simulations show that a ptychographic reconstruction using pixelated detectors offers a superior low dose performance for imaging weak phase objects. • Optimisation of imaging conditions using pixelated detectors are discussed by considering the contrast transfer function for various cases

  9. Efficient phase contrast imaging in STEM using a pixelated detector. Part II: Optimisation of imaging conditions

    Energy Technology Data Exchange (ETDEWEB)

    Yang, Hao, E-mail: hao.yang@materials.ox.ac.uk [University of Oxford, Department of Materials. Parks Rd, Oxford OX1 3PH (United Kingdom); Pennycook, Timothy J.; Nellist, Peter D. [University of Oxford, Department of Materials. Parks Rd, Oxford OX1 3PH (United Kingdom); EPSRC SuperSTEM Facility, Daresbury Laboratory, WA4 4AD (United Kingdom)

    2015-04-15

    In Part I of this series of two papers, we demonstrated the formation of a high efficiency phase-contrast image at atomic resolution using a pixelated detector in the scanning transmission electron microscope (STEM) with ptychography. In this paper we explore the technique more quantitatively using theory and simulations. Compared to other STEM phase contrast modes including annular bright field (ABF) and differential phase contrast (DPC), we show that the ptychographic phase reconstruction method using pixelated detectors offers the highest contrast transfer efficiency and superior low dose performance. Applying the ptychographic reconstruction method to DPC segmented detectors also improves the detector contrast transfer and results in less noisy images than DPC images formed using difference signals. We also find that using a minimum array of 16×16 pixels is sufficient to provide the highest signal-to-noise ratio (SNR) for imaging beam sensitive weak phase objects. Finally, the convergence angle can be adjusted to enhance the contrast transfer based on the spatial frequencies of the specimen under study. - Highlights: • High efficiency phase contrast transfer function (PCTF) can be achieved using pixelated detectors followed by a ptychographic reconstruction. • Ptychographic reconstruction offers the highest PCTF across the entire spatial frequency range compared to DPC and ABF. • Image simulations show that a ptychographic reconstruction using pixelated detectors offers a superior low dose performance for imaging weak phase objects. • Optimisation of imaging conditions using pixelated detectors are discussed by considering the contrast transfer function for various cases.

  10. X-CSIT: a toolkit for simulating 2D pixel detectors

    CERN Document Server

    Joy, Ashley; Hauf, Steffen; Kuster, Markus; Rüter, Tonn

    2015-01-01

    A new, modular toolkit for creating simulations of 2D X-ray pixel detectors, X-CSIT (X-ray Camera SImulation Toolkit), is being developed. The toolkit uses three sequential simulations of detector processes which model photon interactions, electron charge cloud spreading with a high charge density plasma model and common electronic components used in detector readout. In addition, because of the wide variety in pixel detector design, X-CSIT has been designed as a modular platform so that existing functions can be modified or additional functionality added if the specific design of a detector demands it. X-CSIT will be used to create simulations of the detectors at the European XFEL, including three bespoke 2D detectors: the Adaptive Gain Integrating Pixel Detector (AGIPD), Large Pixel Detector (LPD) and DePFET Sensor with Signal Compression (DSSC). These simulations will be used by the detector group at the European XFEL for detector characterisation and calibration. For this purpose, X-CSIT has been integrat...

  11. Exploration of Pixelated detectors for double beta decay searches within the COBRA experiment

    International Nuclear Information System (INIS)

    The aim of the COBRA experiment is the search for neutrinoless double beta decay events in Cadmium Zinc Telluride (CdZnTe) room temperature semiconductor detectors. The development of pixelated detectors provides the potential for clear event identification and thus major background reduction. The tracking option of a semiconductor is a unique approach in this field. For initial studies, several possible detector systems are considered with a special regard for low background applications: the large volume system Polaris with a pixelated CdZnTe sensor, Timepix detectors with Si and enriched CdTe sensor material and a CdZnTe pixel system developed at the Washington University in St. Louis, USA. For all detector systems first experimental background measurements taken at underground laboratories (Gran Sasso Underground Laboratory in Italy, LNGS and the Niederniveau Messlabor Felsenkeller in Dresden, Germany) and additionally for the Timepix detectors simulation results are presented.

  12. Si and CdTe pixel detector developments at SPring-8

    International Nuclear Information System (INIS)

    Single X-ray photon counting pixel detectors have become the most advanced detector technology in synchrotron radiation experiments recently. In particular, the PILATUS detector based on a silicon sensor has reached a very mature state and represents the world's largest detector in this field. This paper first reports on threshold energy calibrations and the capability of applying an energy-resolved X-ray imaging with PILATUS. Second the design of a cadmium telluride (CdTe) pixel detector is described. A high density and high-atomic number sensor material is required in high energy X-ray applications available at SPring-8. For this purpose we are developing a CdTe pixel detector with the SP8-01 readout ASIC covering a wide dynamic range between 10 and 100 keV and containing lower and upper discriminators.

  13. Exploration of Pixelated detectors for double beta decay searches within the COBRA experiment

    Energy Technology Data Exchange (ETDEWEB)

    Schwenke, M., E-mail: schwenke@asp.tu-dresden.de [Institut fuer Kern- und Teilchenphysik, Technische Universitaet Dresden, Zellescher Weg 19, 01069 Dresden (Germany); Zuber, K.; Janutta, B. [Institut fuer Kern- und Teilchenphysik, Technische Universitaet Dresden, Zellescher Weg 19, 01069 Dresden (Germany); He, Z.; Zeng, F. [Department of Nuclear Engineering and Radiological Sciences, University of Michigan, Ann Arbor, Michigan 48109-2104 (United States); Anton, G.; Michel, T.; Durst, J.; Lueck, F.; Gleixner, T. [Erlangen Centre for Astroparticle Physics, Friedrich-Alexander-Universitaet Erlangen-Nuernberg, Erwin-Rommel-Str. 1, 91058 Erlangen (Germany); Goessling, C.; Schulz, O.; Koettig, T. [Technische Universitaet Dortmund, Physik E IV, 44221 Dortmund (Germany); Krawczynski, H.; Martin, J. [Department of Physics, Washington University in St. Louis, Campus Box 1105, One Brookings Drive, St. Louis, MO 63130-4899 (United States); Stekl, I.; Cermak, P. [Institute of Experimental and Applied Physics, Czech Technical University in Prague, Horska 3a/22, 128 00 Prague (Czech Republic)

    2011-09-11

    The aim of the COBRA experiment is the search for neutrinoless double beta decay events in Cadmium Zinc Telluride (CdZnTe) room temperature semiconductor detectors. The development of pixelated detectors provides the potential for clear event identification and thus major background reduction. The tracking option of a semiconductor is a unique approach in this field. For initial studies, several possible detector systems are considered with a special regard for low background applications: the large volume system Polaris with a pixelated CdZnTe sensor, Timepix detectors with Si and enriched CdTe sensor material and a CdZnTe pixel system developed at the Washington University in St. Louis, USA. For all detector systems first experimental background measurements taken at underground laboratories (Gran Sasso Underground Laboratory in Italy, LNGS and the Niederniveau Messlabor Felsenkeller in Dresden, Germany) and additionally for the Timepix detectors simulation results are presented.

  14. Spectroscopic measurements with the ATLAS FE-I4 pixel readout chip

    Energy Technology Data Exchange (ETDEWEB)

    Pohl, David-Leon; Janssen, Jens; Hemperek, Tomasz; Huegging, Fabian; Wermes, Norbert [Physikalisches Institut der Univeristaet Bonn (Germany)

    2015-07-01

    The ATLAS FE-I4 pixel readout chip is a large (2 x 2 cm{sup 2}) state of the art ASIC used in high energy physics experiments as well as for research and development purposes. While the FE-I4 is optimized for high hit rates it provides very limited charge resolution. Therefore two methods were developed to obtain high resolution single pixel charge spectra with the ATLAS FE-I4. The first method relies on the ability to change the detection threshold in small steps while counting hits from a particle source and has a resolution limited by electronic noise only. The other method uses a FPGA based time-to-digital-converter to digitize the analog charge signal with high precision. The feasibility, performance and challenges of these methods are discussed. First results of sensor characterizations from radioactive sources and test beams with the ATLAS FE-I4 in view of the charge collection efficiency after irradiation are presented.

  15. Charge Pump Clock Generation PLL for the Data Output Block of the Upgraded ATLAS Pixel Front-End in 130 nm CMOS

    CERN Document Server

    Kruth, A; Arutinov, D; Barbero, M; Gronewald, M; Hemperek, T; Karagounis, M; Krueger, H; Wermes, N; Fougeron, D; Menouni, M; Beccherle, R; Dube, S; Ellege, D; Garcia-Sciveres, M; Gnani, D; Mekkaoui, A; Gromov, V; Kluit, R; Schipper, J

    2009-01-01

    FE-I4 is the 130 nm ATLAS pixel IC currently under development for upgraded Large Hadron Collider (LHC) luminosities. FE-I4 is based on a low-power analog pixel array and digital architecture concepts tuned to higher hit rates [1]. An integrated Phase Locked Loop (PLL) has been developed that locally generates a clock signal for the 160 Mbit/s output data stream from the 40 MHz bunch crossing reference clock. This block is designed for low power, low area consumption and recovers quickly from loss of lock related to single-event transients in the high radiation environment of the ATLAS pixel detector. After a general introduction to the new FE-I4 pixel front-end chip, this work focuses on the FE-I4 output blocks and on a first PLL prototype test chip submitted in early 2009. The PLL is nominally operated from a 1.2V supply and consumes 3.84mW of DC power. Under nominal operating conditions, the control voltage settles to within 2% of its nominal value in less than 700 ns. The nominal operating frequency for t...

  16. The 025 mum front-end for the CMS pixel detector

    CERN Document Server

    Erdmann, W

    2005-01-01

    The front-end for the CMS pixel detector has been translated from the radiation hard DMILL process to a commercial 0.25 mum technology. The smaller feature size of this technology permitted a reduction of the pixel size and other improvements. First results obtained with the translated chip are discussed.

  17. Recent Results of the ATLAS Upgrade Planar Pixel Sensors R&D Project

    CERN Document Server

    Weigell, Philipp

    2013-01-01

    To cope with the higher occupancy and radiation damage at the HL-LHC also the LHC experiments will be upgraded. The ATLAS Planar Pixel Sensor R&D Project (PPS) is an international collaboration of 17 institutions and more than 80 scientists, exploring the feasibility of employing planar pixel sensors for this scenario. Depending on the radius, different pixel concepts are investigated using laboratory and beam test measurements. At small radii the extreme radiation environment and strong space constraints are addressed with very thin pixel sensors active thickness in the range of (75-150) mum, and the development of slim as well as active edges. At larger radii the main challenge is the cost reduction to allow for instrumenting the large area of (7-10) m^2. To reach this goal the pixel productions are being transferred to 6 inch production lines. Additionally, investigated are more cost-efficient and industrialised interconnection techniques as well as the n-in-p technology, which, being a single-sided pr...

  18. Development of a custom on-line ultrasonic vapour analyzer and flow meter for the ATLAS inner detector, with application to Cherenkov and gaseous charged particle detectors

    International Nuclear Information System (INIS)

    Precision sound velocity measurements can simultaneously determine binary gas composition and flow. We have developed an analyzer with custom microcontroller-based electronics, currently used in the ATLAS Detector Control System, with numerous potential applications. Three instruments monitor C3F8 and CO2 coolant leak rates into the nitrogen envelopes of the ATLAS silicon microstrip and Pixel detectors. Two further instruments will aid operation of the new thermosiphon coolant recirculator: one of these will monitor air leaks into the low pressure condenser while the other will measure return vapour flow along with C3F8/C2F6 blend composition, should blend operation be necessary to protect the ATLAS silicon tracker under increasing LHC luminosity. We describe these instruments and their electronics

  19. Development of a custom on-line ultrasonic vapour analyzer and flow meter for the ATLAS inner detector, with application to Cherenkov and gaseous charged particle detectors

    Science.gov (United States)

    Alhroob, M.; Bates, R.; Battistin, M.; Berry, S.; Bitadze, A.; Bonneau, P.; Bousson, N.; Boyd, G.; Bozza, G.; Crespo-Lopez, O.; Degeorge, C.; Deterre, C.; DiGirolamo, B.; Doubek, M.; Favre, G.; Godlewski, J.; Hallewell, G.; Hasib, A.; Katunin, S.; Langevin, N.; Lombard, D.; Mathieu, M.; McMahon, S.; Nagai, K.; O'Rourke, A.; Pearson, B.; Robinson, D.; Rossi, C.; Rozanov, A.; Strauss, M.; Vacek, V.; Zwalinski, L.

    2015-03-01

    Precision sound velocity measurements can simultaneously determine binary gas composition and flow. We have developed an analyzer with custom microcontroller-based electronics, currently used in the ATLAS Detector Control System, with numerous potential applications. Three instruments monitor C3F8 and CO2 coolant leak rates into the nitrogen envelopes of the ATLAS silicon microstrip and Pixel detectors. Two further instruments will aid operation of the new thermosiphon coolant recirculator: one of these will monitor air leaks into the low pressure condenser while the other will measure return vapour flow along with C3F8/C2F6 blend composition, should blend operation be necessary to protect the ATLAS silicon tracker under increasing LHC luminosity. We describe these instruments and their electronics.

  20. Optimization of CZT Detectors with Sub-mm Pixel Pitches Project

    Data.gov (United States)

    National Aeronautics and Space Administration — We propose to develop and optimize 0.5 cm thick Cadmium Zinc Telluride (CZT) detectors with very small pixel pitches, i.e. 350 micron and 600 micron. The proposed...

  1. Performance study of new pixel hybrid photon detector prototypes for the LHCb RICH counters

    CERN Document Server

    Moritz, M; Allebone, L; Campbell, M; Gys, Thierry; Newby, C; Pickford, A; Piedigrossi, D; Wyllie, K

    2004-01-01

    A pixel Hybrid Photon Detector was developed according to the specific requirements of the LHCb ring imaging Cerenkov counters. This detector comprises a silicon pixel detector bump-bonded to a binary readout chip to achieve a 25 ns fast readout and a high signal-to-noise ratio. The detector performance was characterized by varying the pixel threshold, the tube high voltage, the silicon bias voltage and by the determination of the photoelectron detection efficiency. Furthermore accelerated aging and high pixel occupancy tests were performed to verify the long term stability. The results were obtained using Cerenkov light and a fast pulsed light emitting diode. All measurements results are within the expectations and fulfill the design goals. (8 refs).

  2. 320x240 GaAs pixel detectors with improved X-ray imaging quality

    Energy Technology Data Exchange (ETDEWEB)

    Irsigler, R.; Andersson, J.; Alverbro, J.; Fakoor-Biniaz, Z.; Froejdh, C.; Helander, P.; Martijn, H.; Meikle, D.; Oestlund, M.; O' Shea, V.; Smith, K

    2001-03-11

    We report on gain and offset corrections for GaAs X-ray pixel detectors, which were hybridised to silicon CMOS readout integrated circuits (ROICs). The whole detector array contains 320x240 square-shaped pixels with a pitch of 38 {mu}m. The GaAs pixel detectors are based on semi-insulating and VPE grown substrates. The ROIC operates in the charge integration mode and provides snapshot as well as real time video images. Previously we have reported that the image quality of semi-insulating GaAs pixel detectors suffer from local variations in X-ray sensitivity. We have now developed a method to compensate for the sensitivity variations by applying suitable offset and gain corrections. The improvement in image quality is demonstrated in the measured signal-to-noise ratio of flood exposure images.

  3. 320x240 GaAs pixel detectors with improved X-ray imaging quality

    International Nuclear Information System (INIS)

    We report on gain and offset corrections for GaAs X-ray pixel detectors, which were hybridised to silicon CMOS readout integrated circuits (ROICs). The whole detector array contains 320x240 square-shaped pixels with a pitch of 38 μm. The GaAs pixel detectors are based on semi-insulating and VPE grown substrates. The ROIC operates in the charge integration mode and provides snapshot as well as real time video images. Previously we have reported that the image quality of semi-insulating GaAs pixel detectors suffer from local variations in X-ray sensitivity. We have now developed a method to compensate for the sensitivity variations by applying suitable offset and gain corrections. The improvement in image quality is demonstrated in the measured signal-to-noise ratio of flood exposure images

  4. Digital column readout architectures for hybrid pixel detector readout chips

    CERN Document Server

    Poikela, T; Westerlund, T; Buytaert, J; Campbell, M; De Gaspari, M; Llopart, X; Wyllie, K; Gromov, V; Kluit, R; van Beuzekom, M; Zappon, F; Zivkovic, V; Brezina, C; Desch, K; Fu, Y; Kruth, A

    2014-01-01

    In this paper, two digital column architectures suitable for sparse readout of data from a pixel matrix in trigger-less applications are presented. Each architecture reads out a pixel matrix of 256 x 256 pixels with a pixel pitch of 55 µm. The first architecture has been implemented in the Timepix3 chip, and this is presented together with initial measurements. Simulation results and measured data are compared. The second architecture has been designed for Velopix, a readout chip planned for the LHCb VELO upgrade. Unlike Timepix3, this has to be tolerant to radiation-induced single-event effects. Results from post-layout simulations are shown with the circuit architectures.

  5. ATLAS Tracker Upgrade: Silicon Strip Detectors for the sLHC

    CERN Document Server

    Dawson, I

    2010-01-01

    It is foreseen to increase the luminosity of the Large Hadron Collider (LHC) at CERN around 2020 by about an order of magnitude to the sLHC. As the existing silicon tracking in ATLAS (pixel and strip detectors) is designed to withstand the radiation doses of the LHC only, the tracking detector (Inner Detector or ID) will need to be replaced. In order to cope with the order of magnitude increase in pile-up backgrounds at the higher luminosity, an all-silicon tracking detector is being designed. The new strip detector will use significantly shorter strips than the current Semiconductor Tracker (SCT) in order to keep the occupancy low enough. As the increased luminosity will mean a corresponding increase in radiation dose, a new generation of extremely radiation hard silicon detectors is required. A number of ATLAS R&D projects aimed at developing the sLHC layout of the ID, silicon sensors with sufficient radiation hardness, radiation-hard front-end electronics, and readout systems are ongoing to cope wi...

  6. Modular pixelated detector system with the spectroscopic capability and fast parallel read-out

    OpenAIRE

    Vavřík, D. (Daniel); Holík, M.; Jakůbek, J; Jakůbek, M.; Kraus, V.; Krejčí, F.; Soukup, P. (Pavel); Tureček, D.; Vacík, J. (Jiří); Žemlička, J.

    2014-01-01

    A modular pixelated detector system was developed for imaging applications, where spectroscopic analysis of detected particles is advantageous e.g. for energy sensitive X-ray radiography, fluorescent and high resolution neutron imaging etc. The presented system consists of an arbitrary number of independent versatile modules. Each module is equipped with pixelated edgeless detector with spectroscopic ability and has its own fast read-out electronics. Design of the modules allows assembly of v...

  7. Low-noise analog front-end signal processing channel integration for pixelated semiconductor radiation detector

    OpenAIRE

    Lin, Ming-Cheng

    2012-01-01

    In the research development of the medical nuclear imaging, the low noise performance has always been a mandatory requirement in the design of the semiconductor pixelated radiation detector system in order to achieve the high detectability of the charge signal. The noise-optimized analog front-end signal processing channel composed of the charge sensitive amplifier and the pulse shaper is used extensively in processing the radiation charge signals from the pixelated semiconductor detector. Th...

  8. Accessing photon bunching with photon number resolving multi-pixel detector

    OpenAIRE

    Kalashnikov, Dmitry A.; Tan, Si-Hui; Chekhova, Maria V.; Krivitsky, Leonid A.

    2010-01-01

    In quantum optics and its applications, there is an urgent demand for photon-number resolving detectors. Recently, there appeared multi-pixel detectors (MPPC) that are able to distinguish between 1,2,..10 photons. At the same time, strong coupling between different pixels (cross-talk) hinders their photon-number resolution. In this work, we suggest a method for `filtering out' the cross-talk effect in the measurement of intensity correlation functions.

  9. Development of a counting pixel detector for 'Digitales Roentgen'; Entwicklung eines zaehlenden Pixeldetektors fuer 'Digitales Roentgen'

    Energy Technology Data Exchange (ETDEWEB)

    Lindner, M.

    2001-08-01

    The development of a single photon counting X-ray imaging detector for medical applications using hybrid pixel detectors is reported. The electronics development from the first prototype derived from detector development for particle physics experiments (ATLAS) to the imaging chip MPEC (multi picture element counters) for medical applications is described. This chip consists of 32 x 32 pixels of 200 {mu}m x 200 {mu}m size, each containing the complete read out electronics, i.e. an amplifier, two discriminators with adjustable thresholds and two 18-bit linear feedback shift-counters allowing energy windowing for contrast increase. Results on electronics performance are shown as well as measurements with several semiconductor materials (Si, GaAs, CdTe). Important aspects like detection efficiency, sensor homogeneity, linearity and spatial resolution are discussed. (orig.)

  10. Gas gain stabilisation in the ATLAS TRT detector

    Science.gov (United States)

    Mindur, B.; Åkesson, T. P. A.; Anghinolfi, F.; Antonov, A.; Arslan, O.; Baker, O. K.; Banas, E.; Bault, C.; Beddall, A. J.; Bendotti, J.; Benjamin, D. P.; Bertelsen, H.; Bingul, A.; Bocci, A.; Boldyrev, A. S.; Brock, I.; Capeáns Garrido, M.; Catinaccio, A.; Celebi, E.; Cetin, S. A.; Choi, K.; Dam, M.; Danielsson, H.; Davis, D.; Degeorge, C.; Derendarz, D.; Desch, K.; Di Girolamo, B.; Dittus, F.; Dixon, N.; Dressnandt, N.; Dubinin, F. A.; Evans, H.; Farthouat, P.; Fedin, O. L.; Froidevaux, D.; Gavrilenko, I. L.; Gay, C.; Gecse, Z.; Godlewski, J.; Grefe, C.; Gurbuz, S.; Hajduk, Z.; Hance, M.; Haney, B.; Hansen, J. B.; Hansen, P. H.; Hawkins, A. D.; Heim, S.; Holway, K.; Kantserov, V. A.; Katounine, S.; Kayumov, F.; Keener, P. T.; Kisielewski, B.; Klopov, N. V.; Konovalov, S. P.; Koperny, S.; Korotkova, N. A.; Kowalski, T. Z.; Kramarenko, V.; Krasnopevtsev, D.; Kruse, M.; Kudin, L. G.; Lichard, P.; Loginov, A.; Martinez, N. Lorenzo; Lucotte, A.; Luehring, F.; Lytken, E.; Maleev, V. P.; Maevskiy, A. S.; Manjarres Ramos, J.; Mashinistov, R. Y.; Meyer, C.; Mialkovski, V.; Mistry, K.; Mitsou, V. A.; Nadtochi, A. V.; Newcomer, F. M.; Novodvorski, E. G.; Ogren, H.; Oh, S. H.; Oleshko, S. B.; Olszowska, J.; Ostrowicz, W.; Palacino, G.; Patrichev, S.; Penwell, J.; Perez-Gomez, F.; Peshekhonov, V. D.; RØhne, O.; Reilly, M. B.; Rembser, C.; Ricken, O.; Romaniouk, A.; Rousseau, D.; Ryjov, V.; Sasmaz, U.; Schaepe, S.; Schegelsky, V. A.; Shmeleva, A. P.; Shulga, E.; Sivoklokov, S.; Smirnov, S.; Smirnov, Yu.; Smirnova, L. N.; Soldatov, E.; Sulin, V. V.; Tartarelli, G.; Taylor, W.; Thomson, E.; Tikhomirov, V. O.; Tipton, P.; Valls Ferrer, J. A.; Van Berg, R.; Vasquez, J.; Vasilyeva, L. F.; Vlazlo, O.; Weinert, B.; Williams, H. H.; Wong, V.; Zhukov, K. I.; Zieminska, D.

    2016-04-01

    The ATLAS (one of two general purpose detectors at the LHC) Transition Radiation Tracker (TRT) is the outermost of the three tracking subsystems of the ATLAS Inner Detector. It is a large straw-based detector and contains about 350,000 electronics channels. The performance of the TRT as tracking and particularly particle identification detector strongly depends on stability of the operation parameters with most important parameter being the gas gain which must be kept constant across the detector volume. The gas gain in the straws can vary significantly with atmospheric pressure, temperature, and gas mixture composition changes. This paper presents a concept of the gas gain stabilisation in the TRT and describes in detail the Gas Gain Stabilisation System (GGSS) integrated into the Detector Control System (DCS). Operation stability of the GGSS during Run-1 is demonstrated.

  11. Characterization of edgeless pixel detectors coupled to Medipix2 readout chip

    Science.gov (United States)

    Kalliopuska, Juha; Tlustos, Lukas; Eränen, Simo; Virolainen, Tuula

    2011-08-01

    VTT has developed a straightforward and fast process to fabricate four-side buttable (edgeless) microstrip and pixel detectors on 6 in. (150 mm) wafers. The process relies on advanced ion implantation to activate the edges of the detector instead of using polysilicon. The article characterizes 150 μm thick n-on-n edgeless pixel detector prototypes with a dead layer at the edge below 1 μm. Electrical and radiation response characterization of 1.4×1.4 cm2 n-on-n edgeless detectors has been done by coupling them to the Medipix2 readout chips. The distance of the detector's physical edge from the pixels was either 20 or 50 μm. The leakage current of flip-chip bonded edgeless Medipix2 detector assembles were measured to be ˜90 nA/cm2 and no breakdown was observed below 110 V. Radiation response characterization includes X-ray tube and radiation source responses. The characterization results show that the detector's response at the pixels close to the physical edge of the detector depend dramatically on the pixel-to-edge distance.

  12. Screen printing and chip flipping techniques for large area hybrid pixel detectors bonding

    International Nuclear Information System (INIS)

    In the last few years hybrid silicon pixel detectors came to use in high energy physics. One of the most serious problems is the realization of detectors and read out electronics interconnection at high density and low cost. For the upgrade in the forward direction of the DELPHI silicon vertex detector, it has been successfully carried out the bonding of pixel detectors to VLSI read out chips by means of conductive glue screen printing followed by a precise chip flipping procedure. The measured missing contact rate is (0.05±0.03)%. (orig.)

  13. A study of the material in the ATLAS inner detector using secondary hadronic interactions

    Czech Academy of Sciences Publication Activity Database

    Aad, G.; Abbott, B.; Abdallah, J.; Chudoba, Jiří; Gallus, Petr; Gunther, Jaroslav; Hruška, I.; Juránek, Vojtěch; Kepka, Oldřich; Kupčo, Alexander; Kůs, Vlastimil; Lipinský, L.; Lokajíček, Miloš; Marčišovský, Michal; Mikeštíková, Marcela; Myška, Miroslav; Němeček, Stanislav; Panušková, M.; Růžička, Pavel; Schovancová, Jaroslava; Šícho, Petr; Staroba, Pavel; Svatoš, Michal; Taševský, Marek; Tic, Tomáš; Valenta, J.; Vrba, Václav; Zeman, Martin

    2012-01-01

    Roč. 7, Jan (2012), s. 1-39. ISSN 1748-0221 R&D Projects: GA MŠk LA08032 Institutional research plan: CEZ:AV0Z10100502 Keywords : transverse momentum * missing-energy * ATLAS * CERN LHC * trigger * tracks * p p scattering * pixel detector * microstrip * transition radiation Subject RIV: BF - Elementary Particles and High Energy Physics Impact factor: 1.869, year: 2011 http://iopscience.iop.org/1748-0221/7/01/P01013/pdf/1748-0221_7_01_P01013.pdf

  14. Prototype Active Silicon Sensor in 150 nm HR-CMOS Technology for ATLAS Inner Detector Upgrade

    CERN Document Server

    Rymaszewski, Piotr; Breugnon, Patrick; Godiot, Stépahnie; Gonella, Laura; Hemperek, Tomasz; Hirono, Toko; Hügging, Fabian; Krüger, Hans; Liu, Jian; Pangaud, Patrick; Peric, Ivan; Rozanov, Alexandre; Wang, Anqing; Wermes, Norbert

    2016-01-01

    The LHC Phase-II upgrade will lead to a significant increase in luminosity, which in turn will bring new challenges for the operation of inner tracking detectors. A possible solution is to use active silicon sensors, taking advantage of commercial CMOS technologies. Currently ATLAS R&D programme is qualifying a few commercial technologies in terms of suitability for this task. In this paper a prototype designed in one of them (LFoundry 150 nm process) will be discussed. The chip architecture will be described, including different pixel types incorporated into the design, followed by simulation and measurement results.

  15. Prototype Active Silicon Sensor in 150 nm HR-CMOS technology for ATLAS Inner Detector Upgrade

    Science.gov (United States)

    Rymaszewski, P.; Barbero, M.; Breugnon, P.; Godiot, S.; Gonella, L.; Hemperek, T.; Hirono, T.; Hügging, F.; Krüger, H.; Liu, J.; Pangaud, P.; Peric, I.; Rozanov, A.; Wang, A.; Wermes, N.

    2016-02-01

    The LHC Phase-II upgrade will lead to a significant increase in luminosity, which in turn will bring new challenges for the operation of inner tracking detectors. A possible solution is to use active silicon sensors, taking advantage of commercial CMOS technologies. Currently ATLAS R&D programme is qualifying a few commercial technologies in terms of suitability for this task. In this paper a prototype designed in one of them (LFoundry 150 nm process) will be discussed. The chip architecture will be described, including different pixel types incorporated into the design, followed by simulation and measurement results.

  16. Investigation of photon counting pixel detectors for X-ray spectroscopy and imaging

    Energy Technology Data Exchange (ETDEWEB)

    Talla, Patrick Takoukam

    2011-04-07

    The Medipix2 and Medipix3 detectors are hybrid pixelated photon counting detectors with a pixel pitch of 55 {mu}m. The sensor material used in this thesis was silicon. Because of their small pixel size they suffer from charge sharing i.e. an incoming photon can be registered by more than one pixel. In order to correct for charge sharing due to lateral diffusion of charge carriers, the Medipix3 detector was developed: with its Charge Summing Mode, the charge collected in a cluster of 2 x 2 pixel is added up and attributed to only one pixel whose counter is incremented. The adjustable threshold of the detectors allows to count the photons and to gain information on their energy. The main purposes of the thesis are to investigate spectral and imaging properties of pixelated photon counting detectors from the Medipix family such as Medipix2 and Medipix3. The investigations are based on simulations and measurements. In order to investigate the spectral properties of the detectors measurements were performed using fluorescence lines of materials such as molybdenum, silver but also some radioactive sources such as Am-241 or Cd-109. From the measured data, parameters like the threshold dispersion and the gain variation from pixel-to-pixel were extracted and used as input in the Monte Carlo code ROSI to model the responses of the detector to monoenergetic photons. The measured data are well described by the simulations for Medipix2 and for Medipix3 operating in Charge Summing Mode. Due to charge sharing and due to the energy dependence of attenuation processes in silicon and to Compton scattering the incoming and the measured spectrum differ substantially from each other. Since the responses to monoenergetic photons are known, a deconvolution was performed to determine the true incoming spectrum. Several direct and iterative methods were successfully applied on measured and simulated data of an X-ray tube and radioactive sources. The knowledge of the X-ray spectrum is

  17. Investigation of photon counting pixel detectors for X-ray spectroscopy and imaging

    International Nuclear Information System (INIS)

    The Medipix2 and Medipix3 detectors are hybrid pixelated photon counting detectors with a pixel pitch of 55 μm. The sensor material used in this thesis was silicon. Because of their small pixel size they suffer from charge sharing i.e. an incoming photon can be registered by more than one pixel. In order to correct for charge sharing due to lateral diffusion of charge carriers, the Medipix3 detector was developed: with its Charge Summing Mode, the charge collected in a cluster of 2 x 2 pixel is added up and attributed to only one pixel whose counter is incremented. The adjustable threshold of the detectors allows to count the photons and to gain information on their energy. The main purposes of the thesis are to investigate spectral and imaging properties of pixelated photon counting detectors from the Medipix family such as Medipix2 and Medipix3. The investigations are based on simulations and measurements. In order to investigate the spectral properties of the detectors measurements were performed using fluorescence lines of materials such as molybdenum, silver but also some radioactive sources such as Am-241 or Cd-109. From the measured data, parameters like the threshold dispersion and the gain variation from pixel-to-pixel were extracted and used as input in the Monte Carlo code ROSI to model the responses of the detector to monoenergetic photons. The measured data are well described by the simulations for Medipix2 and for Medipix3 operating in Charge Summing Mode. Due to charge sharing and due to the energy dependence of attenuation processes in silicon and to Compton scattering the incoming and the measured spectrum differ substantially from each other. Since the responses to monoenergetic photons are known, a deconvolution was performed to determine the true incoming spectrum. Several direct and iterative methods were successfully applied on measured and simulated data of an X-ray tube and radioactive sources. The knowledge of the X-ray spectrum is

  18. A module concept for the upgrades of the ATLAS pixel system using the novel SLID-ICV vertical integration technology

    CERN Document Server

    Beimforde, M; Macchiolo, A; Moser, H G; Nisius, R; Richter, R H; Weigell, P; 10.1088/1748-0221/5/12/C12025

    2010-01-01

    The presented R&D activity is focused on the development of a new pixel module concept for the foreseen upgrades of the ATLAS detector towards the Super LHC employing thin n-in-p silicon sensors together with a novel vertical integration technology. A first set of pixel sensors with active thicknesses of 75 μm and 150 μm has been produced using a thinning technique developed at the Max-Planck-Institut für Physik (MPP) and the MPI Semiconductor Laboratory (HLL). Charge Collection Efficiency (CCE) measurements of these sensors irradiated with 26 MeV protons up to a particle fluence of 1016neqcm−2 have been performed, yielding higher values than expected from the present radiation damage models. The novel integration technology, developed by the Fraunhofer Institut EMFT, consists of the Solid-Liquid InterDiffusion (SLID) interconnection, being an alternative to the standard solder bump-bonding, and Inter-Chip Vias (ICVs) for routing signals vertically through electronics. This allows for extracting the ...

  19. The Dosepix detector—an energy-resolving photon-counting pixel detector for spectrometric measurements

    International Nuclear Information System (INIS)

    The Dosepix detector is a hybrid photon-counting pixel detector based on ideas of the Medipix and Timepix detector family. 1 mm thick cadmium telluride and 300 μm thick silicon were used as sensor material. The pixel matrix of the Dosepix consists of 16 x 16 square pixels with 12 rows of (200 μm)2 and 4 rows of (55 μm)2 sensitive area for the silicon sensor layer and 16 rows of pixels with 220 μm pixel pitch for CdTe. Besides digital energy integration and photon-counting mode, a novel concept of energy binning is included in the pixel electronics, allowing energy-resolved measurements in 16 energy bins within one acquisition. The possibilities of this detector concept range from applications in personal dosimetry and energy-resolved imaging to quality assurance of medical X-ray sources by analysis of the emitted photon spectrum. In this contribution the Dosepix detector, its response to X-rays as well as spectrum measurements with Si and CdTe sensor layer are presented. Furthermore, a first evaluation was carried out to use the Dosepix detector as a kVp-meter, that means to determine the applied acceleration voltage from measured X-ray tubes spectra

  20. Test results of the first 3D-IC prototype chip developed in the framework of HL-LHC/ATLAS hybrid pixel upgrade

    CERN Document Server

    Pangaud, P; Barbero, M; Bompard, F; Breugnon, P; Clemens, J C; Fougeron, D; Garcia-Sciveres, M; Godiot, S; Hemperek, T; Krüger, H; Obermann, T; Rozanov, S; Wermes, N

    2014-01-01

    The ATLAS pixel detector needs to handle this new challenging environment. As a consequence, 3D integrated technologies are pursued with the target of offering higher spatial resolution, very good signal to noise ratio and unprecedented radiation hardness. We present here the test results of the first 3D prototype chip developed in the GlobalFoundries 130 nm technology processed by the Tezzaron Company, submitted within the 3D-IC consortium for which a qualification program was developed. Reliability and influence on the behavior of the integrated devices due to the presence of the Bond Interface (BI) and of the Through Silicon Via (TSV) connections, ...

  1. Expected Performance of the ATLAS Experiment - Detector, Trigger and Physics

    Energy Technology Data Exchange (ETDEWEB)

    Aad, G.; Abat, E.; Abbott, B.; Abdallah, J.; Abdelalim, A.A.; Abdesselam, A.; Abdinov, O.; Abi, B.; Abolins, M.; Abramowicz, H.; Acharya, Bobby Samir; Adams, D.L.; Addy, T.N.; Adorisio, C.; Adragna, P.; Adye, T.; Aguilar-Saavedra, J.A.; Aharrouche, M.; Ahlen, S.P.; Ahles, F.; Ahmad, A.; /SUNY, Albany /Alberta U. /Ankara U. /Annecy, LAPP /Argonne /Arizona U. /Texas U., Arlington /Athens U. /Natl. Tech. U., Athens /Baku, Inst. Phys. /Barcelona, IFAE /Belgrade U. /VINCA Inst. Nucl. Sci., Belgrade /Bergen U. /LBL, Berkeley /Humboldt U., Berlin /Bern U., LHEP /Birmingham U. /Bogazici U. /INFN, Bologna /Bologna U.

    2011-11-28

    The Large Hadron Collider (LHC) at CERN promises a major step forward in the understanding of the fundamental nature of matter. The ATLAS experiment is a general-purpose detector for the LHC, whose design was guided by the need to accommodate the wide spectrum of possible physics signatures. The major remit of the ATLAS experiment is the exploration of the TeV mass scale where groundbreaking discoveries are expected. In the focus are the investigation of the electroweak symmetry breaking and linked to this the search for the Higgs boson as well as the search for Physics beyond the Standard Model. In this report a detailed examination of the expected performance of the ATLAS detector is provided, with a major aim being to investigate the experimental sensitivity to a wide range of measurements and potential observations of new physical processes. An earlier summary of the expected capabilities of ATLAS was compiled in 1999 [1]. A survey of physics capabilities of the CMS detector was published in [2]. The design of the ATLAS detector has now been finalised, and its construction and installation have been completed [3]. An extensive test-beam programme was undertaken. Furthermore, the simulation and reconstruction software code and frameworks have been completely rewritten. Revisions incorporated reflect improved detector modelling as well as major technical changes to the software technology. Greatly improved understanding of calibration and alignment techniques, and their practical impact on performance, is now in place. The studies reported here are based on full simulations of the ATLAS detector response. A variety of event generators were employed. The simulation and reconstruction of these large event samples thus provided an important operational test of the new ATLAS software system. In addition, the processing was distributed world-wide over the ATLAS Grid facilities and hence provided an important test of the ATLAS computing system - this is the origin of

  2. Edge pixel response studies of edgeless silicon sensor technology for pixellated imaging detectors

    Science.gov (United States)

    Maneuski, D.; Bates, R.; Blue, A.; Buttar, C.; Doonan, K.; Eklund, L.; Gimenez, E. N.; Hynds, D.; Kachkanov, S.; Kalliopuska, J.; McMullen, T.; O'Shea, V.; Tartoni, N.; Plackett, R.; Vahanen, S.; Wraight, K.

    2015-03-01

    Silicon sensor technologies with reduced dead area at the sensor's perimeter are under development at a number of institutes. Several fabrication methods for sensors which are sensitive close to the physical edge of the device are under investigation utilising techniques such as active-edges, passivated edges and current-terminating rings. Such technologies offer the goal of a seamlessly tiled detection surface with minimum dead space between the individual modules. In order to quantify the performance of different geometries and different bulk and implant types, characterisation of several sensors fabricated using active-edge technology were performed at the B16 beam line of the Diamond Light Source. The sensors were fabricated by VTT and bump-bonded to Timepix ROICs. They were 100 and 200 μ m thick sensors, with the last pixel-to-edge distance of either 50 or 100 μ m. The sensors were fabricated as either n-on-n or n-on-p type devices. Using 15 keV monochromatic X-rays with a beam spot of 2.5 μ m, the performance at the outer edge and corners pixels of the sensors was evaluated at three bias voltages. The results indicate a significant change in the charge collection properties between the edge and 5th (up to 275 μ m) from edge pixel for the 200 μ m thick n-on-n sensor. The edge pixel performance of the 100 μ m thick n-on-p sensors is affected only for the last two pixels (up to 110 μ m) subject to biasing conditions. Imaging characteristics of all sensor types investigated are stable over time and the non-uniformities can be minimised by flat-field corrections. The results from the synchrotron tests combined with lab measurements are presented along with an explanation of the observed effects.

  3. Simulation on the Charged Particle Response of the STAR Heavy Flavor Tracker Pixel Detector

    Science.gov (United States)

    Cimaroli, Alex; Li, Xin

    2009-10-01

    The main task of the STAR experiment, located at the Relativistic Heavy Ion Collider at Brookhaven National Laboratory, is to study the quark-gluon plasma (QGP), which is believed to have been created a few microseconds after the ``Big Bang.'' Heavy quarks are ideal tools for studying the properties of QGP. The Heavy Flavor Tracker (HFT) is the central part of the STAR future heavy flavor physics program and will enable STAR to directly measure heavy flavor mesons. The core of HFT is a pixel detector (PIXEL) using CMOS Active PIXEL Sensor. This poster will describe the development of a detailed simulation of the pixel detector response to charged particles and the corresponding fast simulation that dramatically enhances the simulation speed with little sacrifice in accuracy. The full simulation randomly generates ionized electrons along an incoming track and diffuses the electrons inside the pixel array until they are collected by the electronics or recombined inside a pixel. With the same result, the fast simulation, which quickens processing time from one hour to 5 seconds, generates a grid inside a single pixel and create a map of probability distribution functions for a single ionized electron generated from a grid point. We will also discuss the study of pixel detector position resolution using a simple clustering algorithm.

  4. Fabrication of pixelated CdTe and CdZnTe radiation detectors

    International Nuclear Information System (INIS)

    Cadmium telluride (CdTe) and cadmium zinc telluride (CdZnTe) are compound semiconductor characterized by wide semiconducting band gap and high photon stopping power due to its high atomic number and density. The mobility-life time product (μ t product) for holes in the materials is smaller than that for electrons. Hence, the effect of trapping losses is more pronounced on holes than on electrons. The trapping losses for holes limit achievable energy resolutions for planar detectors. In this study, pixelated CdTe detectors and pixelated CdZnTe detectors were fabricated and tested by 662 KeV gamma-rays of 137Cs at room temperature. Electrodes were formed on both sides of CdTe crystals and CdZnTe crystals by vacuum evaporation of gold. For purpose of comparison, a planar CdTe detector and a planar CdZnTe detector were evaluated. Since the pixelated CdTe detectors and the pixelated CdZnTe detectors operated as a single-polarity charge sensing device, the obtained energy resolutions were significantly higher than those for the planar detectors. Further improvement of energy resolutions of the detectors will be achieved by optimizing electrode structures. (M. Suetake)

  5. Preliminary test of an imaging probe for nuclear medicine using hybrid pixel detectors

    International Nuclear Information System (INIS)

    We are investigating the feasibility of an intraoperative imaging probe for lymphoscintigraphy with Tc-99m tracer, for sentinel node radioguided surgery, using the Medipix series of hybrid detectors coupled to a collimator. These detectors are pixelated semiconductor detectors bump-bonded to the Medipix1 photon counting read-out chip (64x64 pixel, 170 μm pitch) or to the Medipix2 chip (256x256 pixel, 55 μm pitch), developed by the European Medipix collaboration. The pixel detector we plan to use in the final version of the probe is a semi-insulating GaAs detector or a 1-2 mm thick CdZnTe detector. For the preliminary tests presented here, we used 300-μm thick silicon detectors, hybridized via bump-bonding to the Medipix1 chip. We used a tungsten parallel-hole collimator (7 mm thick, matrix array of 64x64 100 μm circular holes with 170 μm pitch), and a 22, 60 and 122 keV point-like (1 mm diameter) radioactive sources, placed at various distances from the detector. These tests were conducted in order to investigate the general feasibility of this imaging probe and its resolving power. Measurements show the high resolution but low efficiency performance of the detector-collimator set, which is able to image the 122 keV source with <1 mm FWHM resolution

  6. Studies on the Optical Readout for the ATLAS Pixel Detector

    CERN Document Server

    Flick, Tobias

    The particle physics is concentrating on the research of the structure of the matter which is observable in our world. How is this world built. Which particles exist, which are necessary to build up the world? How is this matter kept together, what are the interactions between the known particles? The answers to these questions are obtained by observing the known particles, to study their properties, and to search new for particles. Models are developed to describe all the observations. Experiments are performed to proove the models. The best prooven model to describe many of the observations is the Standard Model. The Standard Model is elucidated in Chapter 1. It is tested very precisely by experimental measurements in the last years, but cannot explain all phenomena of nature. To discover the last not observed particle of the Standard Model, the Higgs boson, and to extend the model further experiments are needed. To study the elementary particles machines and instruments are necessary to produce and measur...

  7. A study on the shielding mechanisms of SOI pixel detector

    CERN Document Server

    Lu, Yunpeng; Wu, Zhigang; Ouyang, Qun; Arai, Yasuo

    2015-01-01

    In order to tackle the charge injection issue that had perplexed the counting type SOI pixel for years, two successive chips CPIXTEG3 and CPIXTEG3b were developed utilizing two shielding mechanisms, Nested-well and Double-SOI, in the LAPIS process. A TCAD simulation showed the shielding effectiveness influenced by the high sheet resistance of shielding layers. Test structures specially designed to measure the crosstalk associated to charge injection were implemented in CPIXTEG3/3b. Measurement results proved that using shielding layer is indispensable for counting type pixel and Double-SOI is superior to Nested-well in terms of shielding effectiveness and design flexibility.

  8. X-ray analog pixel array detector for single synchrotron bunch time-resolved imaging

    CERN Document Server

    Koerner, Lucas J

    2010-01-01

    Dynamic x-ray studies may reach temporal resolutions limited by only the x-ray pulse duration if the detector is fast enough to segregate synchrotron pulses. An analog integrating pixel array detector with in-pixel storage and temporal resolution of around 150 ns, sufficient to isolate pulses, is presented. Analog integration minimizes count-rate limitations and in-pixel storage captures successive pulses. Fundamental tests of noise and linearity as well as high-speed laser measurements are shown. The detector resolved individual bunch trains at the Cornell High Energy Synchrotron Source (CHESS) at levels of up to 3.7x10^3 x-rays/pixel/train. When applied to turn-by-turn x-ray beam characterization single-shot intensity measurements were made with a repeatability of 0.4% and horizontal oscillations of the positron cloud were detected. This device is appropriate for time-resolved Bragg spot single crystal experiments.

  9. 4.3 μm quantum cascade detector in pixel configuration.

    Science.gov (United States)

    Harrer, A; Schwarz, B; Schuler, S; Reininger, P; Wirthmüller, A; Detz, H; MacFarland, D; Zederbauer, T; Andrews, A M; Rothermund, M; Oppermann, H; Schrenk, W; Strasser, G

    2016-07-25

    We present the design simulation and characterization of a quantum cascade detector operating at 4.3μm wavelength. Array integration and packaging processes were investigated. The device operates in the 4.3μm CO2 absorption region and consists of 64 pixels. The detector is designed fully compatible to standard processing and material growth methods for scalability to large pixel counts. The detector design is optimized for a high device resistance at elevated temperatures. A QCD simulation model was enhanced for resistance and responsivity optimization. The substrate illuminated pixels utilize a two dimensional Au diffraction grating to couple the light to the active region. A single pixel responsivity of 16mA/W at room temperature with a specific detectivity D* of 5⋅107 cmHz/W was measured. PMID:27464155

  10. Module Production and Qualification for the Phase I Upgrade of the CMS Pixel Detector

    CERN Document Server

    AUTHOR|(CDS)2086689

    2015-01-01

    After consolidation of the LHC in 2013/14 its centre-of-mass energy will increase to 13TeV and the luminosity will reach $2 \\cdot 10^{34}\\, \\textnormal{cm}^{-2} \\textnormal{s}^{-1}$, which is twice the design luminosity. The latter will result in more simultaneous particle collisions, which would significantly increase the dead time of the current readout chip of the CMS pixel detector. Therefore the entire CMS pixel detector is replaced in 2016/17 and a new digital readout with larger buffers will be used to handle increasing pixel hit rates. An additional fourth barrel-layer provides more space points to improve track reconstruction. Half of the required modules for layer four is being produced at Karlsruhe Institute of Technology (KIT). This poster deals with the smallest discrete subunit of the pixel detector, the module and its assembly process. Moreover first production experience will be shown.

  11. Progress in the use of pixel detectors in double beta decay experiment TGV

    International Nuclear Information System (INIS)

    The TGV collaboration has been investigating two neutrino double electron capture (2νEC/EC) in 106Cd since 2000. The double beta experiments would answer some of the puzzling problems about neutrinos (e.g. nature and mass) but one of the main challenges is the background events. The collaboration is investigating the use of pixel detectors in such rare decay experiments. Pixel detector gives spatial information along with energy of the particle, thus provides useful information to reduce the background. The collaboration has proposed a Silicon Pixel Telescope (SPT) for the next generation experiment; where a pair of Si pixel detectors with enriched Cd foil in the middle forms the detection unit. A prototype unit of SPT has been constructed and results of preliminary background measurements performed on the surface and in the underground laboratories are presented

  12. Progress in the use of pixel detectors in double beta decay experiment TGV

    Science.gov (United States)

    Jose, J. M.; TGV Collaboration

    2013-12-01

    The TGV collaboration has been investigating two neutrino double electron capture (2νEC/EC) in 106Cd since 2000. The double beta experiments would answer some of the puzzling problems about neutrinos (e.g. nature and mass) but one of the main challenges is the background events. The collaboration is investigating the use of pixel detectors in such rare decay experiments. Pixel detector gives spatial information along with energy of the particle, thus provides useful information to reduce the background. The collaboration has proposed a Silicon Pixel Telescope (SPT) for the next generation experiment; where a pair of Si pixel detectors with enriched Cd foil in the middle forms the detection unit. A prototype unit of SPT has been constructed and results of preliminary background measurements performed on the surface and in the underground laboratories are presented.

  13. Progress in the use of pixel detectors in double beta decay experiment TGV

    Energy Technology Data Exchange (ETDEWEB)

    Jose, J. M. [Institute of Experimental and Applied Physics, Czech Technical University in Prague, Horska 3a/22, 12800 Prague 2 (Czech Republic); Collaboration: TGV Collaboration

    2013-12-30

    The TGV collaboration has been investigating two neutrino double electron capture (2νEC/EC) in {sup 106}Cd since 2000. The double beta experiments would answer some of the puzzling problems about neutrinos (e.g. nature and mass) but one of the main challenges is the background events. The collaboration is investigating the use of pixel detectors in such rare decay experiments. Pixel detector gives spatial information along with energy of the particle, thus provides useful information to reduce the background. The collaboration has proposed a Silicon Pixel Telescope (SPT) for the next generation experiment; where a pair of Si pixel detectors with enriched Cd foil in the middle forms the detection unit. A prototype unit of SPT has been constructed and results of preliminary background measurements performed on the surface and in the underground laboratories are presented.

  14. Si pixel detectors in the detection of EC/EC decay

    International Nuclear Information System (INIS)

    The SPT collaboration has been investigating the applicability of pixel detectors in the detection of two neutrino double electron capture (2νEC/EC) in106Cd. The collaboration has proposed a Silicon Pixel Telescope (SPT) where a pair of Si pixel detectors with enriched Cd foil in the middle forms the detection unit. The Pixel detector gives spatial information along with energy of the particle, thus helps to identify and remove the background signals. Four units of SPT prototype (using 0.5 and 1 mm Si sensors) were fabricated and installed in the LSM underground laboratory, France. Recent progress in the SPT experiment and preliminary results from background measurements are presented

  15. Pixellated CdZnTe detector for emission/transmission computed tomography

    International Nuclear Information System (INIS)

    A small pixellated CdZnTe array is tested for suitability in a prototype SPECT system designed to acquire both emission and transmission data. Determining the optimum contact design and obtaining performance estimates of single photon acquisition are the primary focus. Flood field and collimated 57Co sources irradiated the 16 pixel array (5 mm thick and 1.5 mm pixels) to determine photopeak efficiencies and detector response with different event collection techniques. Intrinsic full energy peak efficiency averaged 72% for an 18 keV acceptance window. A small irradiation spot scanned an array region, revealing detector response from nearby pixels. Post processing spectra compare coincident and anti-coincident acquisition. Additionally, current mode tests compare linearity with a CdWO4/Si p-i-n detector

  16. High Dynamic Range Pixel Array Detector for Scanning Transmission Electron Microscopy.

    Science.gov (United States)

    Tate, Mark W; Purohit, Prafull; Chamberlain, Darol; Nguyen, Kayla X; Hovden, Robert; Chang, Celesta S; Deb, Pratiti; Turgut, Emrah; Heron, John T; Schlom, Darrell G; Ralph, Daniel C; Fuchs, Gregory D; Shanks, Katherine S; Philipp, Hugh T; Muller, David A; Gruner, Sol M

    2016-02-01

    We describe a hybrid pixel array detector (electron microscope pixel array detector, or EMPAD) adapted for use in electron microscope applications, especially as a universal detector for scanning transmission electron microscopy. The 128×128 pixel detector consists of a 500 µm thick silicon diode array bump-bonded pixel-by-pixel to an application-specific integrated circuit. The in-pixel circuitry provides a 1,000,000:1 dynamic range within a single frame, allowing the direct electron beam to be imaged while still maintaining single electron sensitivity. A 1.1 kHz framing rate enables rapid data collection and minimizes sample drift distortions while scanning. By capturing the entire unsaturated diffraction pattern in scanning mode, one can simultaneously capture bright field, dark field, and phase contrast information, as well as being able to analyze the full scattering distribution, allowing true center of mass imaging. The scattering is recorded on an absolute scale, so that information such as local sample thickness can be directly determined. This paper describes the detector architecture, data acquisition system, and preliminary results from experiments with 80-200 keV electron beams. PMID:26750260

  17. X-ray Characterization of a Multichannel Smart-Pixel Array Detector

    Energy Technology Data Exchange (ETDEWEB)

    Ross, Steve; Haji-Sheikh, Michael; Huntington, Andrew; Kline, David; Lee, Adam; Li, Yuelin; Rhee, Jehyuk; Tarpley, Mary; Walko, Donald A.; Westberg, Gregg; Williams, George; Zou, Haifeng; Landahl, Eric

    2016-01-01

    The Voxtel VX-798 is a prototype X-ray pixel array detector (PAD) featuring a silicon sensor photodiode array of 48 x 48 pixels, each 130 mu m x 130 mu m x 520 mu m thick, coupled to a CMOS readout application specific integrated circuit (ASIC). The first synchrotron X-ray characterization of this detector is presented, and its ability to selectively count individual X-rays within two independent arrival time windows, a programmable energy range, and localized to a single pixel is demonstrated. During our first trial run at Argonne National Laboratory's Advance Photon Source, the detector achieved a 60 ns gating time and 700 eV full width at half-maximum energy resolution in agreement with design parameters. Each pixel of the PAD holds two independent digital counters, and the discriminator for X-ray energy features both an upper and lower threshold to window the energy of interest discarding unwanted background. This smart-pixel technology allows energy and time resolution to be set and optimized in software. It is found that the detector linearity follows an isolated dead-time model, implying that megahertz count rates should be possible in each pixel. Measurement of the line and point spread functions showed negligible spatial blurring. When combined with the timing structure of the synchrotron storage ring, it is demonstrated that the area detector can perform both picosecond time-resolved X-ray diffraction and fluorescence spectroscopy measurements.

  18. X-ray characterization of a multichannel smart-pixel array detector.

    Science.gov (United States)

    Ross, Steve; Haji-Sheikh, Michael; Huntington, Andrew; Kline, David; Lee, Adam; Li, Yuelin; Rhee, Jehyuk; Tarpley, Mary; Walko, Donald A; Westberg, Gregg; Williams, George; Zou, Haifeng; Landahl, Eric

    2016-01-01

    The Voxtel VX-798 is a prototype X-ray pixel array detector (PAD) featuring a silicon sensor photodiode array of 48 × 48 pixels, each 130 µm × 130 µm × 520 µm thick, coupled to a CMOS readout application specific integrated circuit (ASIC). The first synchrotron X-ray characterization of this detector is presented, and its ability to selectively count individual X-rays within two independent arrival time windows, a programmable energy range, and localized to a single pixel is demonstrated. During our first trial run at Argonne National Laboratory's Advance Photon Source, the detector achieved a 60 ns gating time and 700 eV full width at half-maximum energy resolution in agreement with design parameters. Each pixel of the PAD holds two independent digital counters, and the discriminator for X-ray energy features both an upper and lower threshold to window the energy of interest discarding unwanted background. This smart-pixel technology allows energy and time resolution to be set and optimized in software. It is found that the detector linearity follows an isolated dead-time model, implying that megahertz count rates should be possible in each pixel. Measurement of the line and point spread functions showed negligible spatial blurring. When combined with the timing structure of the synchrotron storage ring, it is demonstrated that the area detector can perform both picosecond time-resolved X-ray diffraction and fluorescence spectroscopy measurements. PMID:26698064

  19. The Dosepix detector—an energy-resolving photon-counting pixel detector for spectrometric measurements

    CERN Document Server

    Zang, A; Ballabriga, R; Bisello, F; Campbell, M; Celi, J C; Fauler, A; Fiederle, M; Jensch, M; Kochanski, N; Llopart, X; Michel, N; Mollenhauer, U; Ritter, I; Tennert, F; Wölfel, S; Wong, W; Michel, T

    2015-01-01

    The Dosepix detector is a hybrid photon-counting pixel detector based on ideas of the Medipix and Timepix detector family. 1 mm thick cadmium telluride and 300 μm thick silicon were used as sensor material. The pixel matrix of the Dosepix consists of 16 x 16 square pixels with 12 rows of (200 μm)2 and 4 rows of (55 μm)2 sensitive area for the silicon sensor layer and 16 rows of pixels with 220 μm pixel pitch for CdTe. Besides digital energy integration and photon-counting mode, a novel concept of energy binning is included in the pixel electronics, allowing energy-resolved measurements in 16 energy bins within one acquisition. The possibilities of this detector concept range from applications in personal dosimetry and energy-resolved imaging to quality assurance of medical X-ray sources by analysis of the emitted photon spectrum. In this contribution the Dosepix detector, its response to X-rays as well as spectrum measurements with Si and CdTe sensor layer are presented. Furthermore, a first evaluation wa...

  20. Alternative glues for the production of ATLAS silicon strip modules for the Phase-II upgrade of the ATLAS inner detector

    Energy Technology Data Exchange (ETDEWEB)

    Poley, Luise [DESY, Zeuthen (Germany); Humboldt Univ. Berlin (Germany); Bloch, Ingo [DESY, Zeuthen (Germany); Edwards, Sam [Birmingham Univ. (United Kingdom); and others

    2016-04-15

    The Phase-II upgrade of the ATLAS detector for the High Luminosity Large Hadron Collider (HL-LHC) includes the replacement of the current Inner Detector with an all-silicon tracker consisting of pixel and strip detectors. The current Phase-II detector layout requires the construction of 20,000 strip detector modules consisting of sensor, circuit boards and readout chips, which are connected mechanically using adhesives. The adhesive between readout chips and circuit board is a silver epoxy glue as was used in the current ATLAS SemiConductor Tracker (SCT). This glue has several disadvantages, which motivated the search for an alternative. This paper presents a study concerning the use of six ultra-violet (UV) cure glues and a glue pad for use in the assembly of silicon strip detector modules for the ATLAS upgrade. Trials were carried out to determine the ease of use, the thermal conduction and shear strength, thermal cycling, radiation hardness, corrosion resistance and shear strength tests. These investigations led to the exclusion of three UV cure glues as well as the glue pad. Three UV cure glues were found to be possible better alternatives. Results from electrical tests of first prototype modules constructed using these glues are presented.