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Sample records for array readout chip

  1. SPAD array chips with full frame readout for crystal characterization

    Energy Technology Data Exchange (ETDEWEB)

    Fischer, Peter; Blanco, Roberto; Sacco, Ilaria; Ritzert, Michael [Heidelberg University (Germany); Weyers, Sascha [Fraunhofer Institute for Microelectronic Circuits and Systems (Germany)

    2015-05-18

    We present single photon sensitive 2D camera chips containing 88x88 avalanche photo diodes which can be read out in full frame mode with up to 400.000 frames per second. The sensors have an imaging area of ~5mm x 5mm covered by square pixels of ~56µm x 56µm with a ~55% fill factor in the latest chip generation. The chips contain a self triggering logic with selectable (column) multiplicities of up to >=4 hits within an adjustable coincidence time window. The photon accumulation time window is programmable as well. First prototypes have demonstrated low dark count rates of <50kHz/mm2 (SPAD area) at 10 degree C for 10% masked pixels. One chip version contains an automated readout of the photon cluster position. The readout of the detailed photon distribution for single events allows the characterization of light sharing, optical crosstalk etc., in crystals or crystal arrays as they are used in PET instrumentation. This knowledge could lead to improvements in spatial or temporal resolution.

  2. Pixel detector readout chip

    CERN Multimedia

    1991-01-01

    Close-up of a pixel detector readout chip. The photograph shows an aera of 1 mm x 2 mm containing 12 separate readout channels. The entire chip contains 1000 readout channels (around 80 000 transistors) covering a sensitive area of 8 mm x 5 mm. The chip has been mounted on a silicon detector to detect high energy particles.

  3. XA readout chip characteristics and CdZnTe spectral measurements

    International Nuclear Information System (INIS)

    Barbier, L.M.; Birsa, F.; Odom, J.

    1999-01-01

    The authors report on the performance of a CdZnTe (CZT) array readout by an XA (X-ray imaging chip produced at the AMS foundry) application specific readout chip (ASIC). The array was designed and fabricated at NASA/Goddard Space Flight Center (GSFC) as a prototype for the Burst Arc-Second Imaging and Spectroscopy gamma-ray instrument. The XA ASIC was obtained from Integrated Detector and Electronics (IDE), in Norway. Performance characteristics and spectral data for 241 Am are presented both at room temperature and at -20 C. The measured noise (σ) was 2.5 keV at 60 keV at room temperature. This paper represents a progress report on work with the XA ASIC and CZT detectors. Work is continuing and in particular, larger arrays are planned for future NASA missions

  4. Vertically integrated pixel readout chip for high energy physics

    International Nuclear Information System (INIS)

    Deptuch, Grzegorz; Demarteau, Marcel; Hoff, James; Khalid, Farah; Lipton, Ronald; Shenai, Alpana; Trimpl, Marcel; Yarema, Raymond; Zimmerman, Tom

    2011-01-01

    We report on the development of the vertex detector pixel readout chips based on multi-tier vertically integrated electronics for the International Linear Collider. Some testing results of the VIP2a prototype are presented. The chip is the second iteration of the silicon implementation of the prototype, data-pushed concept of the readout developed at Fermilab. The device was fabricated in the 3D MIT-LL 0.15 (micro)m fully depleted SOI process. The prototype is a three-tier design, featuring 30 x 30 (micro)m 2 pixels, laid out in an array of 48 x 48 pixels.

  5. Medipix3 array high performance read-out board for synchrotron research

    International Nuclear Information System (INIS)

    Tartoni, N.; Horswell, I. C.; Marchal, J.; Gimenez, E. N.; Fearn, R. D.; Silfhout, R. G. van

    2010-01-01

    The Medipix3 ASIC is one of the most advanced chip that is presently available to build photon counting area detectors. The capabilities of the chip include adjacent pixels charge summing circuitry to sort out the distortion due to charge sharing, simultaneous counting and read-out that enables frames to be acquired without dead time, the colour mode of operation that enables up to eight energy bands to be acquired. In order to fully exploit the capabilities of the Medipix3 chip in synchrotron research, a high performance electronic board capable of driving large arrays of chips is necessary. We propose a parallel read-out board of Medipix3 chip arrays with a scalable architecture that allows driving the Medipix3 chip in all of its modes of operation. The board functions include the control of the chip arrays, data formatting and data compression, the management of the communications with the data storage devices, and operation in various trigger modes. In addition to this the board will have some 'intelligence' embedded. This will add some very important features to the final detector such as pattern recognition, capability of variable frame duration as a function of the photon flux, feedback to other equipment and real time calculations of data relevant to experiments such as the autocorrelation function.

  6. A prototype pixel readout chip for asynchronous detection applications

    International Nuclear Information System (INIS)

    Raymond, D.M.; Hall, G.; Lewis, A.J.; Sharp, P.H.

    1991-01-01

    A two-dimensional array of amplifier cells has been fabricated as a prototype readout system for a matching array of silicon diode detectors. Each cell contains a preamplifier, shaping amplifier, comparator and analogue signal storage in an area of 300 μmx320 μm using 3 μm CMOS technology. Full size chips will be bump bonded to pixel detector arrays. Low noise and asynchronous operation are novel design features. With noise levels of less than 250 rms electrons for input capacitances up to 600 fF, pixel detectors will be suitable for autoradiography, synchrotron X-ray and high energy particle detection applications. The design of the prototype chip is presented and future developments and prospects for applications are discussed. (orig.)

  7. Spectroscopy study of imaging devices based on silicon Pixel Array Detector coupled to VATAGP7 read-out chips

    International Nuclear Information System (INIS)

    Linhart, V; Lacasta, C; Llosa, G; Stankova, V; Burdette, D; Chessi, E; Cochran, E; Honscheid, K; Kagan, H; Weilhammer, P; Cindro, V; Grosicar, B; Mikuz, M; Studen, A; Zontar, D; Clinthorne, N H

    2011-01-01

    Spectroscopic and timing response studies have been conducted on a detector module consisting of a silicon Pixel Array Detector bonded on two VATAGP7 read-out chips manufactured by Gamma-Medica Ideas using laboratory gamma sources and the internal calibration facilities (the calibration system of the read-out chips). The performed tests have proven that the chips have (i) non-linear calibration curves which can be approximated by power functions, (ii) capability to measure the energy of photons with energy resolution better than 2 keV (exact range and resolution depend on experimental setup), (iii) the internal calibration facility which provides 6 out of 16 available internal calibration charges within our region of interest (spanning the Compton edge of 511 keV photons). The peaks induced by the internal calibration facility are suitable for a fit of the calibration curves. However, they are not suitable for measurements of equivalent noise charge because their full width at half maximum varies with their amplitude. These facts indicate that the VATAGP7 chips are useful and precise tools for a wide variety of spectroscopic devices. We have also explored time walk of the module and peaking time of the spectroscopy signals provided by the chips. We have observed that (iv) the time walk is caused partly by the peaking time of the signals provided by the fast shaper of the chips and partly by the timing uncertainty related to the varying position of the photon interaction, (v) the peaking time of the spectroscopy signals provided by the chips increases with increasing pulse height.

  8. Development and characterisation of a radiation hard readout chip for the LHCb experiment

    CERN Document Server

    Baumeister, Daniel; Stachel, Johanna

    2003-01-01

    Within this doctoral thesis parts of the radiation hard readout chip Beetle have been developed and characterised, before and after irradiation. The design work included the analogue memory with the corresponding readout amplifier as well as components of the digital control circuitry. An interface compatible with the I2C-standard and the control logic for event readout have been implemented. A scheme has been developed which ensures the robustness of the Beetle chip against Single-Event Upset (SEU). This includes the consistent use of triple-redundant memory devices together with a self-triggered correction in parts of the circuit. The Beetle ASIC is a 128 channel pipelined readout chip for silicon strip detectors. The front-end consists of a charge-sensitive preamplifier and a CR-RC pulse shaper. It features an equivalent noise charge of ENC = 497 e− +48.3 e−/pF·Cin. The analogue memory is a switched capacitor array, which provides a latency of max. 4 µs. The 128 channels are transmitted off chip in 9...

  9. Readout Architecture for Hybrid Pixel Readout Chips

    CERN Document Server

    AUTHOR|(SzGeCERN)694170; Westerlund, Tomi; Wyllie, Ken

    The original contribution of this thesis to knowledge are novel digital readout architectures for hybrid pixel readout chips. The thesis presents asynchronous bus-based architecture, a data-node based column architecture and a network-based pixel matrix architecture for data transportation. It is shown that the data-node architecture achieves readout efficiency 99 % with half the output rate as a bus-based system. The network-based solution avoids ``broken'' columns due to some manufacturing errors, and it distributes internal data traffic more evenly across the pixel matrix than column-based architectures. An improvement of $>$ 10 % to the efficiency is achieved with uniform and non-uniform hit occupancies. Architectural design has been done using transaction level modeling ($TLM$) and sequential high-level design techniques for reducing the design and simulation time. It has been possible to simulate tens of column and full chip architectures using the high-level techniques. A decrease of $>$ 10 in run-time...

  10. Chip cleaning and regeneration for electrochemical sensor arrays

    Energy Technology Data Exchange (ETDEWEB)

    Bhalla, Vijayender [Biochemistry Department ' G.Moruzzi' , University of Bologna, Via Irnerio 48, 40126 Bologna (Italy); Carrara, Sandro, E-mail: sandro.carrara@epfl.c [Biochemistry Department ' G.Moruzzi' , University of Bologna, Via Irnerio 48, 40126 Bologna (Italy); Stagni, Claudio [Department DEIS, University of Bologna, viale Risorgimento 2, 40136 Bologna (Italy); Samori, Bruno [Biochemistry Department ' G.Moruzzi' , University of Bologna, Via Irnerio 48, 40126 Bologna (Italy)

    2010-04-02

    Sensing systems based on electrochemical detection have generated great interest because electronic readout may replace conventional optical readout in microarray. Moreover, they offer the possibility to avoid labelling for target molecules. A typical electrochemical array consists of many sensing sites. An ideal micro-fabricated sensor-chip should have the same measured values for all the equivalent sensing sites (or spots). To achieve high reliability in electrochemical measurements, high quality in functionalization of the electrodes surface is essential. Molecular probes are often immobilized by using alkanethiols onto gold electrodes. Applying effective cleaning methods on the chip is a fundamental requirement for the formation of densely-packed and stable self-assembly monolayers. However, the available well-known techniques for chip cleaning may not be so reliable. Furthermore, it could be necessary to recycle the chip for reuse. Also in this case, an effective recycling technique is required to re-obtain well cleaned sensing surfaces on the chip. This paper presents experimental results on the efficacy and efficiency of the available techniques for initial cleaning and further recycling of micro-fabricated chips. Piranha, plasma, reductive and oxidative cleaning methods were applied and the obtained results were critically compared. Some interesting results were attained by using commonly considered cleaning methodologies. This study outlines oxidative electrochemical cleaning and recycling as the more efficient cleaning procedure for electrochemical based sensor arrays.

  11. Performance of a Fast Binary Readout CMOS Active Pixel Sensor Chip Designed for Charged Particle Detection

    Science.gov (United States)

    Deerli, Yavuz; Besanon, Marc; Besson, Auguste; Claus, Gilles; Deptuch, Grzegorz; Dulinski, Wojciech; Fourches, Nicolas; Goffe, Mathieu; Himmi, Abdelkader; Li, Yan; Lutz, Pierre; Orsini, Fabienne; Szelezniak, Michal

    2006-12-01

    We report on the performance of the MIMOSA8 (HiMAPS1) chip. The chip is a 128times32 pixels array where 24 columns have discriminated binary outputs and eight columns analog test outputs. Offset correction techniques are used extensively in this chip to overcome process related mismatches. The array is divided in four blocks of pixels with different conversion factors and is controlled by a serially programmable sequencer. MIMOSA8 is a representative of the CMOS sensors development option considered as a promising candidate for the Vertex Detector of the future International Linear Collider (ILC). The readout technique, implemented on the chip, combines high spatial resolution capabilities with high processing readout speed. Data acquisition, providing control of the chip and signal buffering and linked to a VME system, was made on the eight analog outputs. Analog data, without and with a 55Fe X-ray source, were acquired and processed using off-line analysis software. From the reconstruction of pixel clusters, built around a central pixel, we deduce that the charge spread is limited to the closest 25 pixels and almost all the available charge is collected. The position of the total charge collection peak (and subsequently the charge-to-voltage conversion factor) stays unaffected when the clock frequency is increased even up to 150 MHz (13.6 mus readout time per frame). The discriminators, placed in the readout chain, have proved to be fully functional. Beam tests have been made with high energy electrons at DESY (Germany) to study detection efficiency. The results prove that MIMOSA8 is the first and fastest successful monolithic active pixel sensor with on-chip signal discrimination for detection of MIPs

  12. Design and Performance of the CMS Pixel Detector Readout Chip

    CERN Document Server

    Kästli, H C; Erdmann, W; Hörmann, C; Horisberger, R P; Kotlinski, D; Meier, B; Hoermann, Ch.

    2006-01-01

    The readout chip for the CMS pixel detector has to deal with an enormous data rate. On-chip zero suppression is inevitable and hit data must be buffered locally during the latency of the first level trigger. Dead-time must be kept at a minimum. It is dominated by contributions coming from the readout. To keep it low an analog readout scheme has been adopted where pixel addresses are analog coded. We present the architecture of the final CMS pixel detector readout chip with special emphasis on the analog readout chain. Measurements of its performance are discussed.

  13. Digital column readout architectures for hybrid pixel detector readout chips

    International Nuclear Information System (INIS)

    Poikela, T; Plosila, J; Westerlund, T; Buytaert, J; Campbell, M; Gaspari, M De; Llopart, X; Wyllie, K; Gromov, V; Kluit, R; Beuzekom, M van; Zappon, F; Zivkovic, V; Brezina, C; Desch, K; Fu, Y; Kruth, A

    2014-01-01

    In this paper, two digital column architectures suitable for sparse readout of data from a pixel matrix in trigger-less applications are presented. Each architecture reads out a pixel matrix of 256 x 256 pixels with a pixel pitch of 55 μm. The first architecture has been implemented in the Timepix3 chip, and this is presented together with initial measurements. Simulation results and measured data are compared. The second architecture has been designed for Velopix, a readout chip planned for the LHCb VELO upgrade. Unlike Timepix3, this has to be tolerant to radiation-induced single-event effects. Results from post-layout simulations are shown with the circuit architectures

  14. Development, optimisation and characterisation of a radiation hard mixed-signal readout chip for LHCb

    Energy Technology Data Exchange (ETDEWEB)

    Loechner, S.

    2006-07-26

    The Beetle chip is a radiation hard, 128 channel pipelined readout chip for silicon strip detectors. The front-end consists of a charge-sensitive preamplifier followed by a CR-RC pulse shaper. The analogue pipeline memory is implemented as a switched capacitor array with a maximum latency of 4us. The 128 analogue channels are multiplexed and transmitted off chip in 900ns via four current output drivers. Beside the pipelined readout path, the Beetle provides a fast discrimination of the front-end pulse. Within this doctoral thesis parts of the radiation hard Beetle readout chip for the LHCb experiment have been developed. The overall chip performances like noise, power consumption, input charge rates have been optimised as well as the elimination of failures so that the Beetle fulfils the requirements of the experiment. Furthermore the characterisation of the chip was a major part of this thesis. Beside the detailed measurement of the chip performance, several irradiation tests and an Single Event Upset (SEU) test were performed. A long-time measurement with a silicon strip detector was also part of this work as well as the development and test of a first mass production test setup. The Beetle chip showed no functional failure and only slight degradation in the analogue performance under irradiation of up to 130Mrad total dose. The Beetle chip fulfils all requirements of the vertex detector (VELO), the trigger tracker (TT) and the inner tracker (IT) and is ready for the start of LHCb end of 2007. (orig.)

  15. Development, optimisation and characterisation of a radiation hard mixed-signal readout chip for LHCb

    International Nuclear Information System (INIS)

    Loechner, S.

    2006-01-01

    The Beetle chip is a radiation hard, 128 channel pipelined readout chip for silicon strip detectors. The front-end consists of a charge-sensitive preamplifier followed by a CR-RC pulse shaper. The analogue pipeline memory is implemented as a switched capacitor array with a maximum latency of 4us. The 128 analogue channels are multiplexed and transmitted off chip in 900ns via four current output drivers. Beside the pipelined readout path, the Beetle provides a fast discrimination of the front-end pulse. Within this doctoral thesis parts of the radiation hard Beetle readout chip for the LHCb experiment have been developed. The overall chip performances like noise, power consumption, input charge rates have been optimised as well as the elimination of failures so that the Beetle fulfils the requirements of the experiment. Furthermore the characterisation of the chip was a major part of this thesis. Beside the detailed measurement of the chip performance, several irradiation tests and an Single Event Upset (SEU) test were performed. A long-time measurement with a silicon strip detector was also part of this work as well as the development and test of a first mass production test setup. The Beetle chip showed no functional failure and only slight degradation in the analogue performance under irradiation of up to 130Mrad total dose. The Beetle chip fulfils all requirements of the vertex detector (VELO), the trigger tracker (TT) and the inner tracker (IT) and is ready for the start of LHCb end of 2007. (orig.)

  16. Design of a CMOS readout circuit on ultra-thin flexible silicon chip for printed strain gauges

    Directory of Open Access Journals (Sweden)

    M. Elsobky

    2017-09-01

    Full Text Available Flexible electronics represents an emerging technology with features enabling several new applications such as wearable electronics and bendable displays. Precise and high-performance sensors readout chips are crucial for high quality flexible electronic products. In this work, the design of a CMOS readout circuit for an array of printed strain gauges is presented. The ultra-thin readout chip and the printed sensors are combined on a thin Benzocyclobutene/Polyimide (BCB/PI substrate to form a Hybrid System-in-Foil (HySiF, which is used as an electronic skin for robotic applications. Each strain gauge utilizes a Wheatstone bridge circuit, where four Aerosol Jet® printed meander-shaped resistors form a full-bridge topology. The readout chip amplifies the output voltage difference (about 5 mV full-scale swing of the strain gauge. One challenge during the sensor interface circuit design is to compensate for the relatively large dc offset (about 30 mV at 1 mA in the bridge output voltage so that the amplified signal span matches the input range of an analog-to-digital converter (ADC. The circuit design uses the 0. 5 µm mixed-signal GATEFORESTTM technology. In order to achieve the mechanical flexibility, the chip fabrication is based on either back thinned wafers or the ChipFilmTM technology, which enables the manufacturing of silicon chips with a thickness of about 20 µm. The implemented readout chip uses a supply of 5 V and includes a 5-bit digital-to-analog converter (DAC, a differential difference amplifier (DDA, and a 10-bit successive approximation register (SAR ADC. The circuit is simulated across process, supply and temperature corners and the simulation results indicate excellent performance in terms of circuit stability and linearity.

  17. Readout chip for the CMS pixel detector upgrade

    Energy Technology Data Exchange (ETDEWEB)

    Rossini, Marco, E-mail: marco.rossini@phys.ethz.ch

    2014-11-21

    For the CMS experiment a new pixel detector is planned for installation during the extended shutdown in winter 2016/2017. Among the changes of the detector modified front end electronics will be used for higher efficiency at peak luminosity of the LHC and faster readout. The first prototype versions of the new readout chip have been designed and produced. The results of qualification and calibration for the new chip are presented in this paper.

  18. Performance of the CAMEX64 silicon strip readout chip

    International Nuclear Information System (INIS)

    Yarema, R.J.

    1989-06-01

    The CAMEX64 is a 64 channel full custom CMOS chip designed specifically for the readout of silicon strip detectors. CAMEX which stands for CMOS Multichannel Analog MultiplEXer for Silicon Strip Detectors was designed by members of the Franhofer Institute for Microelectronic Circuits and Systems and the Max Planck Institute for Physics and Astrophysics. Each CAMEX channel has a switched capacitor charge sensitive amplifier with 4 sampling capacitors and a multiplexing scheme for reading out each of the channels on an analog bus. The device uses multiple sampling capacitors to filter and reduce input noise. Filtering is controlled through sampling techniques using external clocks. The device operates in a double correlated sampling mode and therefore cannot separate detector leakage current from a charge input. Normal operation of this device is similar to all other silicon readout chips designed and built thus far in that there is a data acquisition cycle during which charge is simultaneously accepted on all channels for a short period of time from a detector array, followed by a readout cycle where that charge or hit information is read out. This device works especially well for colliding beam experiments where the time of charge arrival is accurately known. However it can be used in fixed target or asynchronous mode where the time of charge arrival is not well known. In the asynchronous mode it appears that gain is somewhat dependent on the time interval required to decide whether or not to accept charge input information and thus the maximum signal to noise performance found with the synchronous mode may not be achieved in the asynchronous mode. 18 figs., 5 tabs

  19. Implementation of a Customisable Readout Sequence for the ALICE ITS Upgrade Explorer Family Chips

    CERN Document Server

    Gazzari, Matthias

    2014-01-01

    Within the ALICE ITS upgrade R&D programme the Explorer family chips are developed featuring 11700 pixels which are split into 18 different sectors with different properties. These pixels are read out sequentially leading to a time span of 2.34ms between the first and last pixel. Due to the long readout time, shot noise induced by the leakage currents in the in-pixel analogue memories makes the comparison of different sensor implementations located in distant sectors on the Explorer family chips difficult. In order to reduce this noise contribution a customisable readout sequence is developed to read parts instead of the whole chip which reduces the overall readout time. This readout sequence is integrated in the existing characterisation framework in order to choose the best performing sensor implementation through pixel-by-pixel comparison without readout-induced effects.

  20. Silicon microstrip detectors with SVX chip readout

    International Nuclear Information System (INIS)

    Brueckner, W.; Dropmann, F.; Godbersen, M.; Konorov, I.; Koenigsmann, K.; Masciocchi, S.; Newsom, C.; Paul, S.; Povh, B.; Russ, J.S.; Timm, S.; Vorwalter, K.; Werding, R.

    1995-01-01

    A new silicon strip detector has been designed for the fixed target experiment WA89 at CERN. The system of about 30 000 channels is equipped with SVX chips and read out via a double buffer into a FASTBUS memory. The detector provides a fast readout by offering zero-suppressed data extraction on the chip. The silicon counters are the largest detectors built on a monocrystal so far in order to achieve good transversal acceptance. Construction and performance during the 1993 data taking run are discussed. ((orig.))

  1. SVX3: A deadtimeless readout chip for silicon strip detectors

    International Nuclear Information System (INIS)

    Zimmerman, T.; Huffman, T.; Srage, J.; Stroehmer, R.; Yarema, R.; Garcia-Sciveras, M.; Luo, L.; Milgrome, O.

    1997-12-01

    A new silicon strip readout chip called the SVX3 has been designed for the 720,000 channel CDF silicon upgrade at Fermilab. SVX3 incorporates an integrator, analog delay pipeline, ADC, and data sparsification for each of 128 identical channels. Many of the operating parameters are programmable via a serial bit stream, which allows the chip to be used under a variety of conditions. Distinct features of SVX3 include use of a backside substrate contact for optimal ground referencing, and the capability of simultaneous signal acquisition and digital readout allowing deadtimeless operation in the Fermilab Tevatron

  2. Description of the SAltro-16 chip for gas detector readout

    CERN Document Server

    Aspell, P; Garcia Garcia, E; de Gaspari, M; Mager, M; Musa, L; Rehman, A; Trampitsch, G

    2010-01-01

    The S-ALTRO prototype chip is a mixed-signal integrated circuit designed to be one of the building blocks of the readout electronics for gas detectors. Its architecture is based in the ALTRO (ALICE TPC Read Out) chip, being its main difference the integration of the charge shaping amplifier in the same IC. Just like ALTRO chip, the prototype architecture and programmability make it suitable for the readout of a wider class of detectors. In one single chip, 16 analogue signals from the detector are shaped, digitised, processed, compressed and stored in a multi-acquisition memory. The Analogue-to- Digital converters embedded in the chip have a 10-bit dynamic range and a maximum sampling rate up to 40MHz. After digitisation, a pipelined Data Processor is able to remove from the input signal a wide range of perturbations, related to the non- ideal behaviour of the detector, temperature variation of the electronics, environmental noise, etc. Moreover, the Data Processor is able to suppress the pulse tail within 1�...

  3. TID-dependent current measurements of IBL readout chips

    Energy Technology Data Exchange (ETDEWEB)

    Dette, Karola [TU Dortmund, Experimentelle Physik IV (Germany); CERN (Switzerland); Collaboration: ATLAS Pixel-Collaboration

    2016-07-01

    The ATLAS detector consists of several subsystems with a hybrid pixel detector as the innermost component of the tracking system. The pixel detector has been composed of three layers of silicon sensor assemblies during the first data taking run of the LHC and has been upgraded with a new 4th layer, the so-called Insertable B-Layer (IBL), in summer 2014. Each silicon sensor of the IBL is connected to a Front End readout chip (FE-I4) via bump bonds. During the first year of data taking an increase of the LV current produced by the readout chips was observed. This increase could be traced back to radiation damage inside the silicon. The dependence of the current on the Total Ionizing Dose (TID) and temperature has been tested with X-ray irradiations and will be presented in this talk.

  4. Integrated microelectronic capacitive readout subsystem for lab-on-a-chip applications

    International Nuclear Information System (INIS)

    Spathis, Christos; Georgakopoulou, Konstantina; Petrellis, Nikos; Efstathiou, Konstantinos; Birbas, Alexios

    2014-01-01

    A mixed-signal capacitive biosensor readout system is presented with its main readout functionality embedded in an integrated circuit, compatible with complementary metal oxide semiconductor-type biosensors. The system modularity allows its usage as a consumable since it eventually leads to a system-on-chip where sensor and readout circuitry are hosted on the same die. In this work, a constant current source is used for measuring the input capacitance. Compared to most capacitive biosensor readout circuits, this method offers the convenience of adjusting both the range and the resolution, depending on the requirements dictated by the application. The chip consumes less than 5 mW of power and the die area is 0.06 mm 2 . It shows a broad input capacitance range (capable of measuring bio-capacitances from 6 pF to 9.8 nF), configurable resolution (down to 1 fF), robustness to various biological experiments and good linearity. The integrated nature of the readout system is proven to be sufficient both for one-time in situ (consumable-type) bio-measurements and its incorporation into a point-of-care system. (paper)

  5. Digital Power Consumption Estimations for CHIPIX65 Pixel Readout Chip

    CERN Document Server

    Marcotulli, Andrea

    2016-01-01

    New hybrid pixel detectors with improved resolution capable of dealing with hit rates up to 3 GHz/cm2 will be required for future High Energy Physics experiments in the Large Hadron Collider (LHC) at CERN. Given this, the RD53 collaboration works on the design of the next generation pixel readout chip needed for both the ATLAS and CMS detector phase 2 pixel upgrades. For the RD53 demonstrator chip in 65nm CMOS technology, different architectures are considered. In particular the purpose of this work is estimating the power consumption of the digital architecture of the readout ASIC developed by CHIPIX65 project of the INFN National Scientific Committee. This has been done with modern chip design tools integrated with the VEPIX53 simulation framework that has been developed within the RD53 collaboration in order to assess the performance of the system in very high rate, high energy physics experiments.

  6. Latest generation of ASICs for photodetector readout

    Science.gov (United States)

    Seguin-Moreau, N.

    2013-08-01

    The OMEGA microelectronics group has designed a new generation of multichannel integrated circuits, the "ROC" family, in AustrianMicroSystem (AMS) SiGe 0.35 μm technology to read out signals from various families of photodetectors. The chip named MAROC (standing for Multi Anode ReadOut Chip) has been designed to read out MultiAnode Photomultipliers (MAPMT), Photomultiplier ARray In SiGe ReadOut Chip (PARISROC) to read out Photomultipliers (PMTs) and SiPM Integrated ReadOut Chip (SPIROC) to readout Silicon PhotoMultiplier (SiPM) detectors and which was the first ASIC to do so. The three of them fulfill the stringent requirements of the future photodetectors, in particular in terms of low noise, radiation hardness, large dynamic range, high density and high speed while keeping low power thanks to the SiGe technology. These multi-channel ASICs are real System on Chip (SoC) as they provide charge, time and photon-counting information which are digitized internally. Their complexity and versatility enable innovative frontier detectors and also cover spin off of these detectors in adjacent fields such as medical or material imaging as well as smart detectors. In this presentation, the three ASIC architectures and test results will be described to give a general panorama of the "ROC" chips.

  7. Latest generation of ASICs for photodetector readout

    Energy Technology Data Exchange (ETDEWEB)

    Seguin-Moreau, N., E-mail: seguin@lal.in2p3.fr [Laboratoire de l’Accélérateur Linéaire, IN2P3-CNRS, Université Paris-Sud, Bâtiment 200, 91898 Orsay Cedex (France)

    2013-08-01

    The OMEGA microelectronics group has designed a new generation of multichannel integrated circuits, the “ROC” family, in AustrianMicroSystem (AMS) SiGe 0.35 μm technology to read out signals from various families of photodetectors. The chip named MAROC (standing for Multi Anode ReadOut Chip) has been designed to read out MultiAnode Photomultipliers (MAPMT), Photomultiplier ARray In SiGe ReadOut Chip (PARISROC) to read out Photomultipliers (PMTs) and SiPM Integrated ReadOut Chip (SPIROC) to readout Silicon PhotoMultiplier (SiPM) detectors and which was the first ASIC to do so. The three of them fulfill the stringent requirements of the future photodetectors, in particular in terms of low noise, radiation hardness, large dynamic range, high density and high speed while keeping low power thanks to the SiGe technology. These multi-channel ASICs are real System on Chip (SoC) as they provide charge, time and photon-counting information which are digitized internally. Their complexity and versatility enable innovative frontier detectors and also cover spin off of these detectors in adjacent fields such as medical or material imaging as well as smart detectors. In this presentation, the three ASIC architectures and test results will be described to give a general panorama of the “ROC” chips.

  8. Latest generation of ASICs for photodetector readout

    International Nuclear Information System (INIS)

    Seguin-Moreau, N.

    2013-01-01

    The OMEGA microelectronics group has designed a new generation of multichannel integrated circuits, the “ROC” family, in AustrianMicroSystem (AMS) SiGe 0.35 μm technology to read out signals from various families of photodetectors. The chip named MAROC (standing for Multi Anode ReadOut Chip) has been designed to read out MultiAnode Photomultipliers (MAPMT), Photomultiplier ARray In SiGe ReadOut Chip (PARISROC) to read out Photomultipliers (PMTs) and SiPM Integrated ReadOut Chip (SPIROC) to readout Silicon PhotoMultiplier (SiPM) detectors and which was the first ASIC to do so. The three of them fulfill the stringent requirements of the future photodetectors, in particular in terms of low noise, radiation hardness, large dynamic range, high density and high speed while keeping low power thanks to the SiGe technology. These multi-channel ASICs are real System on Chip (SoC) as they provide charge, time and photon-counting information which are digitized internally. Their complexity and versatility enable innovative frontier detectors and also cover spin off of these detectors in adjacent fields such as medical or material imaging as well as smart detectors. In this presentation, the three ASIC architectures and test results will be described to give a general panorama of the “ROC” chips

  9. Towards a new generation of pixel detector readout chips

    CERN Document Server

    Campbell, M; Ballabriga, R.; Frojdh, E.; Heijne, E.; Llopart, X.; Poikela, T.; Tlustos, L.; Valerio, P.; Wong, W.

    2016-01-01

    The Medipix3 Collaboration has broken new ground in spectroscopic X-ray imaging and in single particle detection and tracking. This paper will review briefly the performance and limitations of the present generation of pixel detector readout chips developed by the Collaboration. Through Silicon Via technology has the potential to provide a significant improvement in the tile- ability and more flexibility in the choice of readout architecture. This has been explored in the context of 3 projects with CEA-LETI using Medipix3 and Timepix3 wafers. The next generation of chips will aim to provide improved spectroscopic imaging performance at rates compatible with human CT. It will also aim to provide full spectroscopic images with unprecedented energy and spatial resolution. Some of the opportunities and challenges posed by moving to a more dense CMOS process will be discussed.

  10. Compensated readout for high-density MOS-gated memristor crossbar array

    KAUST Repository

    Zidan, Mohammed A.

    2015-01-01

    Leakage current is one of the main challenges facing high-density MOS-gated memristor arrays. In this study, we show that leakage current ruins the memory readout process for high-density arrays, and analyze the tradeoff between the array density and its power consumption. We propose a novel readout technique and its underlying circuitry, which is able to compensate for the transistor leakage-current effect in the high-density gated memristor array.

  11. An inverter-based capacitive trans-impedance amplifier readout with offset cancellation and temporal noise reduction for IR focal plane array

    Science.gov (United States)

    Chen, Hsin-Han; Hsieh, Chih-Cheng

    2013-09-01

    This paper presents a readout integrated circuit (ROIC) with inverter-based capacitive trans-impedance amplifier (CTIA) and pseudo-multiple sampling technique for infrared focal plane array (IRFPA). The proposed inverter-based CTIA with a coupling capacitor [1], executing auto-zeroing technique to cancel out the varied offset voltage from process variation, is used to substitute differential amplifier in conventional CTIA. The tunable detector bias is applied from a global external bias before exposure. This scheme not only retains stable detector bias voltage and signal injection efficiency, but also reduces the pixel area as well. Pseudo-multiple sampling technique [2] is adopted to reduce the temporal noise of readout circuit. The noise reduction performance is comparable to the conventional multiple sampling operation without need of longer readout time proportional to the number of samples. A CMOS image sensor chip with 55×65 pixel array has been fabricated in 0.18um CMOS technology. It achieves a 12um×12um pixel size, a frame rate of 72 fps, a power-per-pixel of 0.66uW/pixel, and a readout temporal noise of 1.06mVrms (16 times of pseudo-multiple sampling), respectively.

  12. Transparent Nanopore Cavity Arrays Enable Highly Parallelized Optical Studies of Single Membrane Proteins on Chip.

    Science.gov (United States)

    Diederichs, Tim; Nguyen, Quoc Hung; Urban, Michael; Tampé, Robert; Tornow, Marc

    2018-06-13

    Membrane proteins involved in transport processes are key targets for pharmaceutical research and industry. Despite continuous improvements and new developments in the field of electrical readouts for the analysis of transport kinetics, a well-suited methodology for high-throughput characterization of single transporters with nonionic substrates and slow turnover rates is still lacking. Here, we report on a novel architecture of silicon chips with embedded nanopore microcavities, based on a silicon-on-insulator technology for high-throughput optical readouts. Arrays containing more than 14 000 inverted-pyramidal cavities of 50 femtoliter volumes and 80 nm circular pore openings were constructed via high-resolution electron-beam lithography in combination with reactive ion etching and anisotropic wet etching. These cavities feature both, an optically transparent bottom and top cap. Atomic force microscopy analysis reveals an overall extremely smooth chip surface, particularly in the vicinity of the nanopores, which exhibits well-defined edges. Our unprecedented transparent chip design provides parallel and independent fluorescent readout of both cavities and buffer reservoir for unbiased single-transporter recordings. Spreading of large unilamellar vesicles with efficiencies up to 96% created nanopore-supported lipid bilayers, which are stable for more than 1 day. A high lipid mobility in the supported membrane was determined by fluorescent recovery after photobleaching. Flux kinetics of α-hemolysin were characterized at single-pore resolution with a rate constant of 0.96 ± 0.06 × 10 -3 s -1 . Here, we deliver an ideal chip platform for pharmaceutical research, which features high parallelism and throughput, synergistically combined with single-transporter resolution.

  13. Radiation effects on the Viking-2 preamplifier-readout chip

    International Nuclear Information System (INIS)

    Fallot-Burghardt, W.; Hawblitzel, C.; Hofmann, W.; Knoepfle, K.T.; Seeger, M.; Brenner, R.; Nygaard, E.; Rudge, A.; Toker, O.; Weilhammer, P.; Yoshioka, K.

    1994-01-01

    We have studied the radiation sensitivity of the Viking-2 VLSI circuit which has been designed for the readout of silicon strip detectors and manufactured at Mietec in 1.5 μm CMOS technology. Both biased and unbiased chips have been irradiated with a 137 Cs γ source up to a total dose of 2 kGy (200 krad) after which all tested chips were still fully functional. We report the characteristic changes of device parameters with dose, including equivalent noise charge for different capacitive loads, and determine transistor threshold shifts and change of mobilities. ((orig.))

  14. SPIROC (SiPM Integrated Read-Out Chip) Dedicated very front-end electronics for an ILC prototype hadronic calorimeter with SiPM read-out

    CERN Document Server

    Bouchel, Michel; Dulucq, Frédéric; Fleury, Julien; de La Taille, Christophe; Martin-Chassard, Gisèle; Raux, Ludovic

    2009-01-01

    The SPIROC chip is a dedicated very front-end electronics for an ILC prototype hadronic calorimeter with Silicon photomultiplier (or MPPC) readout. This ASIC is due to equip a 10,000-channel demonstrator in 2009. SPIROC is an evolution of FLC_SiPM used for the ILC AHCAL physics prototype [1]. SPIROC was submitted in June 2007 and will be tested in September 2007. It embeds cutting edge features that fulfil ILC final detector requirements. It has been realized in 0.35m SiGe technology. It has been developed to match the requirements of large dynamic range, low noise, low consumption, high precision and large number of readout channels needed. SPIROC is an auto-triggered, bi-gain, 36-channel ASIC which allows to measure on each channel the charge from one photoelectron to 2000 and the time with a 100ps accurate TDC. An analogue memory array with a depth of 16 for each channel is used to store the time information and the charge measurement. A 12-bit Wilkinson ADC has been embedded to digitize the analogue memor...

  15. SPIROC (SiPM Integrated Read-Out Chip) Dedicated very front-end electronics for an ILC prototype hadronic calorimeter with SiPM read-out

    CERN Document Server

    Bouchel, Michel; Fleury, Julien; de La Taille, Christophe; Martin-Chassard, Gisèle; Raux, Ludovic

    2007-01-01

    The SPIROC chip is a dedicated very front-end electronics for an ILC prototype hadronic calorimeter with Silicon photomultiplier (or MPPC) readout. This ASIC is due to equip a 10,000-channel demonstrator in 2009. SPIROC is an evolution of FLC_SiPM used for the ILC AHCAL physics prototype [1]. SPIROC was submitted in June 2007 and will be tested in September 2007. It embeds cutting edge features that fulfil ILC final detector requirements. It has been realized in 0.35m SiGe technology. It has been developed to match the requirements of large dynamic range, low noise, low consumption, high precision and large number of readout channels needed. SPIROC is an auto-triggered, bi-gain, 36-channel ASIC which allows to measure on each channel the charge from one photoelectron to 2000 and the time with a 100ps accurate TDC. An analogue memory array with a depth of 16 for each channel is used to store the time information and the charge measurement. A 12-bit Wilkinson ADC has been embedded to digitize the analogue memor...

  16. SEU tolerant memory design for the ATLAS pixel readout chip

    International Nuclear Information System (INIS)

    Menouni, M; Barbero, M; Breugnon, P; Fougeron, D; Gensolen, F; Arutinov, D; Backhaus, M; Gonella, L; Hemperek, T; Karagounis, M; Beccherle, R; Darbo, G; Caminada, L; Dube, S; Fleury, J; Garcia-Sciveres, M; Gnani, D; Jensen, F; Gromov, V; Kluit, R

    2013-01-01

    The FE-I4 chip for the B-layer upgrade is designed in a 130 nm CMOS process. For this design, configuration memories are based on the DICE latches where layout considerations are followed to improve the tolerance to SEU. Tests have shown that DICE latches for which layout approaches are adopted are 30 times more tolerant to SEU than the standard DICE latches. To prepare for the new pixel readout chip planned for the future upgrades, a prototype chip containing 512 pixels has been designed in a 65 nm CMOS process and a new approach is adopted for SEU tolerant latches. Results in terms of SEU and TID tolerance are presented.

  17. Evaluation of 320x240 pixel LEC GaAs Schottky barrier X-ray imaging arrays, hybridized to CMOS readout circuit based on charge integration

    CERN Document Server

    Irsigler, R; Alverbro, J; Borglind, J; Froejdh, C; Helander, P; Manolopoulos, S; O'Shea, V; Smith, K

    1999-01-01

    320x240 pixels GaAs Schottky barrier detector arrays were fabricated, hybridized to silicon readout circuits, and subsequently evaluated. The detector chip was based on semi-insulating LEC GaAs material. The square shaped pixel detector elements were of the Schottky barrier type and had a pitch of 38 mu m. The GaAs wafers were thinned down prior to the fabrication of the ohmic back contact. After dicing, the chips were indium bump, flip-chip bonded to CMOS readout circuits based on charge integration, and finally evaluated. A bias voltage between 50 and 100 V was sufficient to operate the detector. Results on I-V characteristics, noise behaviour and response to X-ray radiation are presented. Images of various objects and slit patterns were acquired by using a standard dental imaging X-ray source. The work done was a part of the XIMAGE project financed by the European Community (Brite-Euram). (author)

  18. A novel high electrode count spike recording array using an 81,920 pixel transimpedance amplifier-based imaging chip.

    Science.gov (United States)

    Johnson, Lee J; Cohen, Ethan; Ilg, Doug; Klein, Richard; Skeath, Perry; Scribner, Dean A

    2012-04-15

    Microelectrode recording arrays of 60-100 electrodes are commonly used to record neuronal biopotentials, and these have aided our understanding of brain function, development and pathology. However, higher density microelectrode recording arrays of larger area are needed to study neuronal function over broader brain regions such as in cerebral cortex or hippocampal slices. Here, we present a novel design of a high electrode count picocurrent imaging array (PIA), based on an 81,920 pixel Indigo ISC9809 readout integrated circuit camera chip. While originally developed for interfacing to infrared photodetector arrays, we have adapted the chip for neuron recording by bonding it to microwire glass resulting in an array with an inter-electrode pixel spacing of 30 μm. In a high density electrode array, the ability to selectively record neural regions at high speed and with good signal to noise ratio are both functionally important. A critical feature of our PIA is that each pixel contains a dedicated low noise transimpedance amplifier (∼0.32 pA rms) which allows recording high signal to noise ratio biocurrents comparable to single electrode voltage amplifier recordings. Using selective sampling of 256 pixel subarray regions, we recorded the extracellular biocurrents of rabbit retinal ganglion cell spikes at sampling rates up to 7.2 kHz. Full array local electroretinogram currents could also be recorded at frame rates up to 100 Hz. A PIA with a full complement of 4 readout circuits would span 1cm and could acquire simultaneous data from selected regions of 1024 electrodes at sampling rates up to 9.3 kHz. Published by Elsevier B.V.

  19. A 240-channel thick film multi-chip module for readout of silicon drift detectors

    International Nuclear Information System (INIS)

    Lynn, D.; Bellwied, R.; Beuttenmueller, R.; Caines, H.; Chen, W.; DiMassimo, D.; Dyke, H.; Elliott, D.; Grau, M.; Hoffmann, G.W.; Humanic, T.; Jensen, P.; Kleinfelder, S.A.; Kotov, I.; Kraner, H.W.; Kuczewski, P.; Leonhardt, B.; Li, Z.; Liaw, C.J.; LoCurto, G.; Middelkamp, P.; Minor, R.; Mazeh, N.; Nehmeh, S.; O'Conner, P.; Ott, G.; Pandey, S.U.; Pruneau, C.; Pinelli, D.; Radeka, V.; Rescia, S.; Rykov, V.; Schambach, J.; Sedlmeir, J.; Sheen, J.; Soja, B.; Stephani, D.; Sugarbaker, E.; Takahashi, J.; Wilson, K.

    2000-01-01

    We have developed a thick film multi-chip module for readout of silicon drift (or low capacitance ∼200 fF) detectors. Main elements of the module include a custom 16-channel NPN-BJT preamplifier-shaper (PASA) and a custom 16-channel CMOS Switched Capacitor Array (SCA). The primary design criteria of the module were the minimizations of the power (12 mW/channel), noise (ENC=490 e - rms), size (20.5 mmx63 mm), and radiation length (1.4%). We will discuss various aspects of the PASA design, with emphasis on the preamplifier feedback network. The SCA is a modification of an integrated circuit that has been previously described [1]; its design features specific to its application in the SVT (Silicon Vertex Tracker in the STAR experiment at RHIC) will be discussed. The 240-channel multi-chip module is a circuit with five metal layers fabricated in thick film technology on a beryllia substrate and contains 35 custom and commercial integrated circuits. It has been recently integrated with silicon drift detectors in both a prototype system assembly for the SVT and a silicon drift array for the E896 experiment at the Alternating Gradient Synchrotron at the Brookhaven National Laboratory. We will discuss features of the module's design and fabrication, report the test results, and emphasize its performance both on the bench and under experimental conditions

  20. A self-adjusting delay circuit for pixel read-out chips

    International Nuclear Information System (INIS)

    Raith, B.

    1997-01-01

    A simple concept for automatic adjustment of important VLSI-circuit properties was proposed in (Fischer and Joens, Nucl. Instr. and. Meth.). As an application, a self-adjusting monoflop is reviewed, and detailed measurements are discussed regarding a possible implementation in the LHC 1 read-out chip for the ATLAS experiment (ATLAS Internal Note, 1995). (orig.)

  1. A Low Noise CMOS Readout Based on a Polymer-Coated SAW Array for Miniature Electronic Nose

    Directory of Open Access Journals (Sweden)

    Cheng-Chun Wu

    2016-10-01

    Full Text Available An electronic nose (E-Nose is one of the applications for surface acoustic wave (SAW sensors. In this paper, we present a low-noise complementary metal–oxide–semiconductor (CMOS readout application-specific integrated circuit (ASIC based on an SAW sensor array for achieving a miniature E-Nose. The center frequency of the SAW sensors was measured to be approximately 114 MHz. Because of interference between the sensors, we designed a low-noise CMOS frequency readout circuit to enable the SAW sensor to obtain frequency variation. The proposed circuit was fabricated in Taiwan Semiconductor Manufacturing Company (TSMC 0.18 μm 1P6M CMOS process technology. The total chip size was nearly 1203 × 1203 μm2. The chip was operated at a supply voltage of 1 V for a digital circuit and 1.8 V for an analog circuit. The least measurable difference between frequencies was 4 Hz. The detection limit of the system, when estimated using methanol and ethanol, was 0.1 ppm. Their linearity was in the range of 0.1 to 26,000 ppm. The power consumption levels of the analog and digital circuits were 1.742 mW and 761 μW, respectively.

  2. Integration of the Omega-3 readout chip into a high energy physics experimental data acquisition system

    International Nuclear Information System (INIS)

    Beker, H.; Chesi, E.; Martinengo, P.

    1997-01-01

    The Omega-3 readout chip is presented in detail elsewhere in the same proceedings. We here describe the integration of the chip into present and future experiments describing both hardware and software aspects. We cover preliminary tests in the laboratory and on the beam. The WA97 experiment has already used a pixel telescope in the past and intends to upgrade to the Omega-3 chip. A newly proposed experiment at CERN studying strangeness production in heavy ion collisions also plans to use a similar telescope. Finally, we give an outlook on the ongoing developments in the pixel readout architecture in the context of ALICE, the heavy ion experiment at the LHC collider. (orig.)

  3. LSST camera readout chip ASPIC: test tools

    Science.gov (United States)

    Antilogus, P.; Bailly, Ph; Jeglot, J.; Juramy, C.; Lebbolo, H.; Martin, D.; Moniez, M.; Tocut, V.; Wicek, F.

    2012-02-01

    The LSST camera will have more than 3000 video-processing channels. The readout of this large focal plane requires a very compact readout chain. The correlated ''Double Sampling technique'', which is generally used for the signal readout of CCDs, is also adopted for this application and implemented with the so called ''Dual Slope integrator'' method. We have designed and implemented an ASIC for LSST: the Analog Signal Processing asIC (ASPIC). The goal is to amplify the signal close to the output, in order to maximize signal to noise ratio, and to send differential outputs to the digitization. Others requirements are that each chip should process the output of half a CCD, that is 8 channels and should operate at 173 K. A specific Back End board has been designed especially for lab test purposes. It manages the clock signals, digitizes the analog differentials outputs of ASPIC and stores data into a memory. It contains 8 ADCs (18 bits), 512 kwords memory and an USB interface. An FPGA manages all signals from/to all components on board and generates the timing sequence for ASPIC. Its firmware is written in Verilog and VHDL languages. Internals registers permit to define various tests parameters of the ASPIC. A Labview GUI allows to load or update these registers and to check a proper operation. Several series of tests, including linearity, noise and crosstalk, have been performed over the past year to characterize the ASPIC at room and cold temperature. At present, the ASPIC, Back-End board and CCD detectors are being integrated to perform a characterization of the whole readout chain.

  4. LSST camera readout chip ASPIC: test tools

    International Nuclear Information System (INIS)

    Antilogus, P; Bailly, Ph; Juramy, C; Lebbolo, H; Martin, D; Jeglot, J; Moniez, M; Tocut, V; Wicek, F

    2012-01-01

    The LSST camera will have more than 3000 video-processing channels. The readout of this large focal plane requires a very compact readout chain. The correlated ''Double Sampling technique'', which is generally used for the signal readout of CCDs, is also adopted for this application and implemented with the so called ''Dual Slope integrator'' method. We have designed and implemented an ASIC for LSST: the Analog Signal Processing asIC (ASPIC). The goal is to amplify the signal close to the output, in order to maximize signal to noise ratio, and to send differential outputs to the digitization. Others requirements are that each chip should process the output of half a CCD, that is 8 channels and should operate at 173 K. A specific Back End board has been designed especially for lab test purposes. It manages the clock signals, digitizes the analog differentials outputs of ASPIC and stores data into a memory. It contains 8 ADCs (18 bits), 512 kwords memory and an USB interface. An FPGA manages all signals from/to all components on board and generates the timing sequence for ASPIC. Its firmware is written in Verilog and VHDL languages. Internals registers permit to define various tests parameters of the ASPIC. A Labview GUI allows to load or update these registers and to check a proper operation. Several series of tests, including linearity, noise and crosstalk, have been performed over the past year to characterize the ASPIC at room and cold temperature. At present, the ASPIC, Back-End board and CCD detectors are being integrated to perform a characterization of the whole readout chain.

  5. A Readout Integrated Circuit (ROIC) employing self-adaptive background current compensation technique for Infrared Focal Plane Array (IRFPA)

    Science.gov (United States)

    Zhou, Tong; Zhao, Jian; He, Yong; Jiang, Bo; Su, Yan

    2018-05-01

    A novel self-adaptive background current compensation circuit applied to infrared focal plane array is proposed in this paper, which can compensate the background current generated in different conditions. Designed double-threshold detection strategy is to estimate and eliminate the background currents, which could significantly reduce the hardware overhead and improve the uniformity among different pixels. In addition, the circuit is well compatible to various categories of infrared thermo-sensitive materials. The testing results of a 4 × 4 experimental chip showed that the proposed circuit achieves high precision, wide application and high intelligence. Tape-out of the 320 × 240 readout circuit, as well as the bonding, encapsulation and imaging verification of uncooled infrared focal plane array, have also been completed.

  6. arXiv Characterization and Verification Environment for the RD53A Pixel Readout Chip in 65 nm CMOS

    CERN Document Server

    Vogt, M.; Hemperek, T.; Janssen, J.; Pohl, D.L.; Daas, M.

    2018-02-02

    The RD53 collaboration is currently designing a large scale prototype pixel readout chip in 65 nm CMOS technology for the phase 2 upgrades at the HL-LHC. The RD53A chip will be available by the end of the year 2017 and will be extensively tested to confirm if the circuit and the architecture make a solid foundation for the final pixel readout chips for the experiments at the HL-LHC. A test and data acquisition system for the RD53A chip is currently under development to perform single-chip and multi-chip module measurements. In addition, the verification of the RD53A design is performed in a dedicated simulation environment. The concept and the implementation of the test and data acquisition system and the simulation environment, which are based on a modular data acquisition and system testing framework, are presented in this work.

  7. Point-source reconstruction with a sparse light-sensor array for optical TPC readout

    International Nuclear Information System (INIS)

    Rutter, G; Richards, M; Bennieston, A J; Ramachers, Y A

    2011-01-01

    A reconstruction technique for sparse array optical signal readout is introduced and applied to the generic challenge of large-area readout of a large number of point light sources. This challenge finds a prominent example in future, large volume neutrino detector studies based on liquid argon. It is concluded that the sparse array option may be ruled out for reasons of required number of channels when compared to a benchmark derived from charge readout on wire-planes. Smaller-scale detectors, however, could benefit from this technology.

  8. A One-Dimensional Magnetic Chip with a Hybrid Magnetosensor and a Readout Circuit

    Directory of Open Access Journals (Sweden)

    Guo-Ming Sung

    2018-01-01

    Full Text Available This work presents a one-dimensional magnetic chip composed of a hybrid magnetosensor and a readout circuit, which were fabricated with 0.18 μm 1P6M CMOS technology. The proposed magnetosensor includes a polysilicon cross-shaped Hall plate and two separated metal-oxide semiconductor field-effect transistors (MOSFETs to sense the magnetic induction perpendicular to the chip surface. The readout circuit, which comprises a current-to-voltage converter, a low-pass filter, and an instrumentation amplifier, is designed to amplify the output Hall voltage with a gain of 43 dB. Furthermore, a SPICE macro model is proposed to predict the sensor’s performance in advance and to ensure sufficient comprehension of the magnetic mechanism of the proposed magnetosensor. Both simulated and measured results verify the correctness and flexibility of the proposed SPICE macro model. Measurements reveal that the maximum output Hall voltage VH, the optimum current-related magnetosensitivity SRI, the optimum voltage-related magnetosensitivity SRV, the averaged nonlinearity error NLE, and the relative bias current Ibias are 4.381 mV, 520.5 V/A·T, 40.04 V/V·T, 7.19%, and 200 μA, respectively, for the proposed 1-D magnetic chip with a readout circuit of 43 dB. The averaged NLE is small at high magnetic inductions of ±30 mT, whereas it is large at low magnetic inductions of ±30 G.

  9. Radiation induced effects in the \\\\ATLAS Insertable B-Layer readout chip

    CERN Document Server

    The ATLAS collaboration

    2017-01-01

    The ATLAS Insertable B-Layer is the innermost pixel barrel layer of the ATLAS detector installed in 2014. During the first year of $pp$ collisions at $\\sqrt{s} = 13~{\\rm TeV}$ in 2015, an unusual increase was observed in the low voltage currents of the readout chips. This increase was found to be due to radiation damage to the chips. The dependence of the current on the total ionising dose and temperature has been studied using X-ray and proton beam sources, and will be presented in this note together with its possible parametrisation and operation guidelines for the detector.

  10. Faraday Cup Array Integrated with a Readout IC and Method for Manufacture Thereof

    Science.gov (United States)

    Temple, Dorota (Inventor); Bower, Christopher A. (Inventor); Hedgepath Gilchrist, Kristin (Inventor); Stoner, Brian R. (Inventor)

    2014-01-01

    A detector array and method for making the detector array. The array includes a substrate including a plurality of trenches formed therein, and includes a plurality of collectors electrically isolated from each other, formed on the walls of the trenches, and configured to collect charge particles incident on respective ones of the collectors and to output from said collectors signals indicative of charged particle collection. The array includes a plurality of readout circuits disposed on a side of the substrate opposite openings to the collectors. The readout circuits are configured to read charge collection signals from respective ones of the plurality of collectors.

  11. MAROC, a generic photomultiplier readout chip

    Science.gov (United States)

    Blin, S.; Barrillon, P.; de La Taille, C.

    2010-12-01

    The MAROC ASICs family is dedicated to the readout of 64-channel Multi Anode PMT and similar detectors. Its main roles are to correct the gain spread of MAPMT channels thanks to an individual variable gain preamplifier and to discriminate the input signals (from 50fC i.e 1/3 photo-electron) in order to produce 64 trigger outputs. A multiplexed analog charge output is also available with a dynamic range around 10 pe ( ~ 1.6 pC) and a 12 bit Wilkinson ADC is embedded. Three versions of this chip have been submitted. MAROC 2 is the production version for the ATLAS luminometer and MAROC3 is a version with lower dissipation and significant improvements concerning the charge (30 pe: ~ 5 pC) and trigger (discrimination from 10fC). This third version showed very good characteristics that are presented here.

  12. TARGET: A multi-channel digitizer chip for very-high-energy gamma-ray telescopes

    Energy Technology Data Exchange (ETDEWEB)

    Bechtol, K.; Funk, S.; /Stanford U., HEPL /KIPAC, Menlo Park; Okumura, A.; /JAXA, Sagamihara /Stanford U., HEPL /KIPAC, Menlo Park; Ruckman, L.; /Hawaii U.; Simons, A.; Tajima, H.; Vandenbroucke, J.; /Stanford U., HEPL /KIPAC, Menlo Park; Varner, G.; /Hawaii U.

    2011-08-11

    The next-generation very-high-energy (VHE) gamma-ray observatory, the Cherenkov Telescope Array, will feature dozens of imaging atmospheric Cherenkov telescopes (IACTs), each with thousands of pixels of photosensors. To be affordable and reliable, reading out such a mega-channel array requires event recording technology that is highly integrated and modular, with a low cost per channel. We present the design and performance of a chip targeted to this application: the TeV Array Readout with GSa/s sampling and Event Trigger (TARGET). This application-specific integrated circuit (ASIC) has 16 parallel input channels, a 4096-sample buffer for each channel, adjustable input termination, self-trigger functionality, and tight window-selected readout. We report the performance of TARGET in terms of sampling frequency, power consumption, dynamic range, current-mode gain, analog bandwidth, and cross talk. The large number of channels per chip allows a low cost per channel ($10 to $20 including front-end and back-end electronics but not including photosensors) to be achieved with a TARGET-based IACT readout system. In addition to basic performance parameters of the TARGET chip itself, we present a camera module prototype as well as a second-generation chip (TARGET 2), both of which have been produced.

  13. Frequency-domain readout multiplexing of transition-edge sensor arrays

    Energy Technology Data Exchange (ETDEWEB)

    Lanting, T.M. [Physics Department, University of California, Berkeley, CA 94720 (United States)]. E-mail: tlanting@berkeley.edu; Arnold, K. [Physics Department, University of California, Berkeley, CA 94720 (United States); Cho, Hsiao-Mei [Physics Department, University of California, Berkeley, CA 94720 (United States); Clarke, John [Physics Department, University of California, Berkeley, CA 94720 (United States); Materials Sciences Division, Lawrence Berkeley National Laboratory, Berkeley, CA 94720 (United States); Dobbs, Matt [Physics Division, Lawrence Berkeley National Laboratory, Berkeley, CA 94720 (United States); Holzapfel, William [Physics Department, University of California, Berkeley, CA 94720 (United States); Lee, Adrian T. [Physics Department, University of California, Berkeley, CA 94720 (United States); Physics Division, Lawrence Berkeley National Laboratory, Berkeley, CA 94720 (United States); Lueker, M. [Physics Department, University of California, Berkeley, CA 94720 (United States); Richards, P.L. [Physics Department, University of California, Berkeley, CA 94720 (United States); Materials Sciences Division, Lawrence Berkeley National Laboratory, Berkeley, CA 94720 (United States); Space Sciences Laboratory, University of California, Berkeley, CA 94720 (United States); Smith, A.D. [Northrop-Grumman, Redondo Beach, CA 94278 (United States); Spieler, H.G. [Physics Division, Lawrence Berkeley National Laboratory, Berkeley, CA 94720 (United States)

    2006-04-15

    We have demonstrated frequency-domain readout multiplexing of eight channels for superconducting transition-edge sensor bolometer arrays. The multiplexed readout noise is 6.5 pA/{radical}Hz, well below the bolometer dark noise of 15-20 pA/{radical}Hz. We measure an upper limit on crosstalk of 0.004 between channels adjacent in frequency which meets our design requirement of 0.01. We have observed vibration insensitivity in our frequency-domain multiplexed transition-edge sensors, making this system very attractive for telescope and satellite observations. We also discuss extensions to our multiplexed readout. In particular, we are developing a SQUID flux-locked loop that is entirely cold and collaborating on digital multiplexer technology in order to scale up the number of multiplexed channels.

  14. MAROC, a generic photomultiplier readout chip

    Energy Technology Data Exchange (ETDEWEB)

    Blin, S; Barrillon, P; La Taille, C de, E-mail: blin@lal.in2p3.f [CNRS/IN2p3/LAL-OMEGA, Universite Paris Sud, Bat.200, 91898 Orsay (France)

    2010-12-15

    The MAROC ASICs family is dedicated to the readout of 64-channel Multi Anode PMT and similar detectors. Its main roles are to correct the gain spread of MAPMT channels thanks to an individual variable gain preamplifier and to discriminate the input signals (from 50fC i.e 1/3 photo-electron) in order to produce 64 trigger outputs. A multiplexed analog charge output is also available with a dynamic range around 10 pe ( {approx} 1.6 pC) and a 12 bit Wilkinson ADC is embedded. Three versions of this chip have been submitted. MAROC 2 is the production version for the ATLAS luminometer and MAROC3 is a version with lower dissipation and significant improvements concerning the charge (30 pe: {approx} 5 pC) and trigger (discrimination from 10fC). This third version showed very good characteristics that are presented here.

  15. MAROC, a generic photomultiplier readout chip

    International Nuclear Information System (INIS)

    Blin, S; Barrillon, P; La Taille, C de

    2010-01-01

    The MAROC ASICs family is dedicated to the readout of 64-channel Multi Anode PMT and similar detectors. Its main roles are to correct the gain spread of MAPMT channels thanks to an individual variable gain preamplifier and to discriminate the input signals (from 50fC i.e 1/3 photo-electron) in order to produce 64 trigger outputs. A multiplexed analog charge output is also available with a dynamic range around 10 pe ( ∼ 1.6 pC) and a 12 bit Wilkinson ADC is embedded. Three versions of this chip have been submitted. MAROC 2 is the production version for the ATLAS luminometer and MAROC3 is a version with lower dissipation and significant improvements concerning the charge (30 pe: ∼ 5 pC) and trigger (discrimination from 10fC). This third version showed very good characteristics that are presented here.

  16. Evaluation of the x-ray response of a position-sensitive microstrip detector with an integrated readout chip

    International Nuclear Information System (INIS)

    Rossington, C.; Jaklevic, J.; Haber, C.; Spieler, H.; Reid, J.

    1990-08-01

    The performance of an SVX silicon microstrip detector and its compatible integrated readout chip have been evaluated in response to Rh Kα x-rays (average energy 20.5 keV). The energy and spatial discrimination capabilities, efficient data management and fast readout rates make it an attractive alternative to the CCD and PDA detectors now being offered for x-ray position sensitive diffraction and EXAFS work. The SVX system was designed for high energy physics applications and thus further development of the existing system is required to optimize it for use in practical x-ray experiments. For optimum energy resolution the system noise must be decreased to its previously demonstrated low levels of 2 keV FWHM at 60 keV or less, and the data handling rate of the computer must be increased. New readout chips are now available that offer the potential of better performance. 15 refs., 7 figs

  17. Readout electronic for multichannel detectors

    CERN Document Server

    Kulibaba, V I; Naumov, S V

    2001-01-01

    Readout electronics based on the 128-channel chip 'Viking' (IDE AS inc., Norway) is considered. The chip 'Viking' integrates 128 low noise charge-sensitive preamplifiers with tunable CR-(RC) sup 2 shapers,analog memory and multiplexed readout to one output. All modules of readout electronics were designed and produced in KIPT taking into account the published recommendations of IDE AS inc.

  18. Readout electronic for multichannel detectors

    International Nuclear Information System (INIS)

    Kulibaba, V.I.; Maslov, N.I.; Naumov, S.V.

    2001-01-01

    Readout electronics based on the 128-channel chip 'Viking' (IDE AS inc., Norway) is considered. The chip 'Viking' integrates 128 low noise charge-sensitive preamplifiers with tunable CR-(RC) 2 shapers,analog memory and multiplexed readout to one output. All modules of readout electronics were designed and produced in KIPT taking into account the published recommendations of IDE AS inc

  19. Performance of the gamma-ray camera based on GSO(Ce) scintillator array and PSPMT with the ASIC readout system

    International Nuclear Information System (INIS)

    Ueno, Kazuki; Hattori, Kaori; Ida, Chihiro; Iwaki, Satoru; Kabuki, Shigeto; Kubo, Hidetoshi; Kurosawa, Shunsuke; Miuchi, Kentaro; Nagayoshi, Tsutomu; Nishimura, Hironobu; Orito, Reiko; Takada, Atsushi; Tanimori, Toru

    2008-01-01

    We have studied the performance of a readout system with ASIC chips for a gamma-ray camera based on a 64-channel multi-anode PSPMT (Hamamatsu flat-panel H8500) coupled to a GSO(Ce) scintillator array. The GSO array consists of 8x8 pixels of 6x6x13 mm 3 with the same pixel pitch as the anode of the H8500. This camera is intended to serve as an absorber of an electron tracking Compton gamma-ray camera that measures gamma rays up to ∼1 MeV. Because we need a readout system with low power consumption for a balloon-borne experiment, we adopted a 32-channel ASIC chip, IDEAS VA32 H DR11, which has one of the widest dynamic range among commercial chips. However, in the case of using a GSO(Ce) crystal and the H8500, the dynamic range of VA32 H DR11 is narrow, and therefore the H8500 has to be operated with a low gain of about 10 5 . If the H8500 is operated with a low gain, the camera has a narrow incident-energy dynamic range from 100 to 700 keV, and a bad energy resolution of 13.0% (FWHM) at 662 keV. We have therefore developed an attenuator board in order to operate the H8500 with the typical gain of 10 6 , which can measure up to ∼1 MeV gamma ray. The board makes the variation of the anode gain uniform and widens the dynamic range of the H8500. The system using the new attenuator board has a good uniformity of min:max∼1:1.6, an incident-energy dynamic range from 30 to 900 keV, a position resolution of less than 6 mm, and a typical energy resolution of 10.6% (FWHM) at 662 keV with a low power consumption of about 1.7 W/64ch

  20. A camac based data acquisition system for flat-panel image array readout

    International Nuclear Information System (INIS)

    Morton, E.J.; Antonuk, L.E.; Berry, J.E.; Huang, W.; Mody, P.; Yorkston, J.; Longo, M.J.

    1993-01-01

    A readout system has been developed to facilitate the digitization and subsequent display of image data from two-dimensional, pixellated, flat-panel, amorphous silicon imaging arrays. These arrays have been designed specifically for medical x-ray imaging applications. The readout system is based on hardware and software developed for various experiments at CERN and Fermi National Accelerator Laboratory. Additional analog signal processing and digital control electronics were constructed specifically for this application. The authors report on the form of the resulting data acquisition system, discuss aspects of its performance, and consider the compromises which were involved in its design

  1. Microneedle Array Interface to CE on Chip

    NARCIS (Netherlands)

    Lüttge, Regina; Gardeniers, Johannes G.E.; Vrouwe, E.X.; van den Berg, Albert; Northrup, M.A.; Jensen, K.F; Harrison, D.J.

    2003-01-01

    This paper presents a microneedle array sampler interfaced to a capillary electrophoresis (CE) glass chip with integrated conductivity detection electrodes. A solution of alkali ions was electrokinetically loaded through the microneedles onto the chip and separation was demonstrated compared to a

  2. Development of Micromegas-like gaseous detectors using a pixel readout chip as collecting anode

    International Nuclear Information System (INIS)

    Chefdeville, M.

    2009-01-01

    This thesis reports on the fabrication and test of a new gaseous detector with a very large number of readout channels. This detector is intended for measuring the tracks of charged particles with an unprecedented sensitivity to single electrons of almost 100 %. It combines a metal grid for signal amplification called the Micromegas with a pixel readout chip as signal collecting anode and is dubbed GridPix. GridPix is a potential candidate for a sub-detector at a future electron linear collider (ILC) foreseen to work in parallel with the LHC around 2020--2030. The tracking capability of GridPix is best exploited if the Micromegas is integrated on the pixel chip. This integrated grid is called InGrid and is precisely fabricated by wafer post-processing. The various steps of the fabrication process and the measurements of its gain, energy resolution and ion back-flow property are reported in this document. Studies of the response of the complete detector formed by an InGrid and a TimePix pixel chip to X-rays and cosmic particles are also presented. In particular, the efficiency for detecting single electrons and the point resolution in the pixel plane are measured. Implications for a GridPix detector at ILC are discussed. (author)

  3. Programmable System-on-Chip (PSoC) Embedded Readout Designs for Liquid Helium Level Sensors.

    Science.gov (United States)

    Parasakthi, C; Gireesan, K; Usha Rani, R; Sheela, O K; Janawadkar, M P

    2014-08-01

    This article reports the development of programmable system-on-chip (PSoC)-based embedded readout designs for liquid helium level sensors using resistive liquid vapor discriminators. The system has been built for the measurement of liquid helium level in a concave-bottomed, helmet-shaped, fiber-reinforced plastic cryostat for magnetoencephalography. This design incorporates three carbon resistors as cost-effective sensors, which are mounted at desired heights inside the cryostat and were used to infer the liquid helium level by measuring their temperature-dependent resistance. Localized electrical heating of the carbon resistors was used to discriminate whether the resistor is immersed in liquid helium or its vapor by exploiting the difference in the heat transfer rates in the two environments. This report describes a single PSoC chip for the design and development of a constant current source to drive the three carbon resistors, a multiplexer to route the sensor outputs to the analog-to-digital converter (ADC), a buffer to avoid loading of the sensors, an ADC for digitizing the data, and a display using liquid crystal display cum light-emitting diode modules. The level sensor readout designed with a single PSoC chip enables cost-effective and reliable measurement system design. © 2014 Society for Laboratory Automation and Screening.

  4. Flip chip assembly of thinned chips for hybrid pixel detector applications

    International Nuclear Information System (INIS)

    Fritzsch, T; Zoschke, K; Rothermund, M; Oppermann, H; Woehrmann, M; Ehrmann, O; Lang, K D; Huegging, F

    2014-01-01

    There is a steady trend to ultra-thin microelectronic devices. Especially for future particle detector systems a reduced readout chip thickness is required to limit the loss of tracking precision due to scattering. The reduction of silicon thickness is performed at wafer level in a two-step thinning process. To minimize the risk of wafer breakage the thinned wafer needs to be handled by a carrier during the whole process chain of wafer bumping. Another key process is the flip chip assembly of thinned readout chips onto thin sensor tiles. Besides the prevention of silicon breakage the minimization of chip warpage is one additional task for a high yield and reliable flip chip process. A new technology using glass carrier wafer will be described in detail. The main advantage of this technology is the combination of a carrier support during wafer processing and the chip support during flip chip assembly. For that a glass wafer is glue-bonded onto the backside of the thinned readout chip wafer. After the bump deposition process the glass-readout chip stack is diced in one step. Finally the glass carrier chip is released by laser illumination after flip chip assembly of the readout chip onto sensor tile. The results of the flip chip assembly process development for the ATLAS IBL upgrade are described more in detail. The new ATLAS FEI4B chip with a size of 20 × 19 mm 2 is flip chip bonded with a thickness of only 150 μm, but the capability of this technology has been demonstrated on hybrid modules with a reduced readout chip thickness of down to 50 μm which is a major step for ultra-thin electronic systems

  5. Results of FE65-P2 Pixel Readout Test Chip for High Luminosity LHC Upgrades

    CERN Document Server

    AUTHOR|(SzGeCERN)394193

    2016-01-01

    A pixel readout test chip called FE65-P2 has been fabricated on 65 nm CMOS technology. FE65-P2 contains a matrix of 64 x 64 pixels on 50 micron by 50 micron pitch, designed to read out a bump bonded sensor. The goals of FE65-P2 are to demonstrate excellent analog performance isolated from digital activity well enough to achieve 500 electron stable threshold, be radiation hard to at least 500 Mrad, and prove the novel concept of isolated analog front ends embedded in a flat digital design, dubbed “analog islands in a digital sea”. Experience from FE65-P2 and hybrid assemblies will be applied to the design for a large format readout chip, called RD53A, to be produced in a wafer run in early 2017 by the RD53 collaboration. We review the case for 65 nm technology and report on threshold stability test results for the FE65-P2.

  6. The Retinal Readout System: a status report A Status Report

    CERN Document Server

    Litke, A M

    1999-01-01

    The 'Retinal Readout System' is being developed to study the language the eye uses to send information about the visual world to the brain. Its architecture is based on that of silicon microstrip detectors. An array of 512 microscopic electrodes picks up the signals generated by the output neurons of live retinal tissue in response to a dynamic image focused on the input neurons. These signals are amplified, filtered and multiplexed by a set of eight custom-designed VLSI readout chips, and digitized and recorded by a data acquisition system. This report describes the goals, design, and status of the system. (author)

  7. A Full Parallel Event Driven Readout Technique for Area Array SPAD FLIM Image Sensors

    Directory of Open Access Journals (Sweden)

    Kaiming Nie

    2016-01-01

    Full Text Available This paper presents a full parallel event driven readout method which is implemented in an area array single-photon avalanche diode (SPAD image sensor for high-speed fluorescence lifetime imaging microscopy (FLIM. The sensor only records and reads out effective time and position information by adopting full parallel event driven readout method, aiming at reducing the amount of data. The image sensor includes four 8 × 8 pixel arrays. In each array, four time-to-digital converters (TDCs are used to quantize the time of photons’ arrival, and two address record modules are used to record the column and row information. In this work, Monte Carlo simulations were performed in Matlab in terms of the pile-up effect induced by the readout method. The sensor’s resolution is 16 × 16. The time resolution of TDCs is 97.6 ps and the quantization range is 100 ns. The readout frame rate is 10 Mfps, and the maximum imaging frame rate is 100 fps. The chip’s output bandwidth is 720 MHz with an average power of 15 mW. The lifetime resolvability range is 5–20 ns, and the average error of estimated fluorescence lifetimes is below 1% by employing CMM to estimate lifetimes.

  8. SiPM arrays and miniaturized readout electronics for compact gamma camera

    Energy Technology Data Exchange (ETDEWEB)

    Dinu, N., E-mail: dinu@lal.in2p3.fr [Laboratory of Linear Accelerator, IN2P3, CNRS, Orsay (France); Imando, T. Ait; Nagai, A. [Laboratory of Linear Accelerator, IN2P3, CNRS, Orsay (France); Pinot, L. [Laboratory of Imaging and Modelisation in Neurobiology and Cancerology, IN2P3, CNRS, Orsay (France); Puill, V. [Laboratory of Linear Accelerator, IN2P3, CNRS, Orsay (France); Callier, S. [Omega Microelectronics Group, CNRS, Palaiseau (France); Janvier, B.; Esnault, C.; Verdier, M.-A. [Laboratory of Imaging and Modelisation in Neurobiology and Cancerology, IN2P3, CNRS, Orsay (France); Raux, L. [Omega Microelectronics Group, CNRS, Palaiseau (France); Vandenbussche, V.; Charon, Y.; Menard, L. [Laboratory of Imaging and Modelisation in Neurobiology and Cancerology, IN2P3, CNRS, Orsay (France)

    2015-07-01

    This article reports on the design and features of a very compact and light gamma camera based on SiPM arrays and miniaturized readout electronics dedicated to tumor localization during radio-guided cancer surgery. This gamma camera, called MAGICS, is composed of four (2×2) photo-detection elementary modules coupled to an inorganic scintillator. The 256 channels photo-detection system covers a sensitive area of 54×53 m{sup 2}. Each elementary module is based on four (2×2) SiPM monolithic arrays, each array consisting of 16 SiPM photo-sensors (4×4) with 3×3 mm{sup 2} sensitive area, coupled to a miniaturized readout electronics and a dedicated ASIC. The overall dimensions of the electronics fit the size of the detector, enabling to assemble side-by-side several elementary modules in a close-packed arrangement. The preliminary performances of the system are very encouraging, showing an energy resolution of 9.8% and a spatial resolution of less than 1 mm at 122 keV.

  9. A novel readout integrated circuit for ferroelectric FPA detector

    Science.gov (United States)

    Bai, Piji; Li, Lihua; Ji, Yulong; Zhang, Jia; Li, Min; Liang, Yan; Hu, Yanbo; Li, Songying

    2017-11-01

    Uncooled infrared detectors haves some advantages such as low cost light weight low power consumption, and superior reliability, compared with cryogenically cooled ones Ferroelectric uncooled focal plane array(FPA) are being developed for its AC response and its high reliability As a key part of the ferroelectric assembly the ROIC determines the performance of the assembly. A top-down design model for uncooled ferroelectric readout integrated circuit(ROIC) has been developed. Based on the optical thermal and electrical properties of the ferroelectric detector the RTIA readout integrated circuit is designed. The noise bandwidth of RTIA readout circuit has been developed and analyzed. A novel high gain amplifier, a high pass filter and a low pass filter circuits are designed on the ROIC. In order to improve the ferroelectric FPA package performance and decrease of package cost a temperature sensor is designed on the ROIC chip At last the novel RTIA ROIC is implemented on 0.6μm 2P3M CMOS silicon techniques. According to the experimental chip test results the temporal root mean square(RMS)noise voltage is about 1.4mV the sensitivity of the on chip temperature sensor is 0.6 mV/K from -40°C to 60°C the linearity performance of the ROIC chip is better than 99% Based on the 320×240 RTIA ROIC, a 320×240 infrared ferroelectric FPA is fabricated and tested. Test results shows that the 320×240 RTIA ROIC meets the demand of infrared ferroelectric FPA.

  10. The readout system of the new H1 silicon detectors

    International Nuclear Information System (INIS)

    Buerger, J.; Hansen, K.; Lange, W.; Prell, S.; Zimmermann, W.; Henschel, H.; Haynes, W.J.; Noyes, G.W.; Joensson, L.; Gabathuler, K.; Horisberger, R.; Wagener, M.; Eichler, R.; Erdmann, W.; Niggli, H.; Pitzl, D.

    1995-03-01

    The H1 detector at HERA at DESY undergoes presently a major upgrade. In this context silicon strip detectors have been installed at beginning of 1995. The high bunch crossing frequency of HERA (10.4 MHz) demands a novel readout architecture which includes pipelining, signal processing and data reduction at a very early stage. The front end readout is hierarchically organized. The detector elements are read out by the APC chip which contains an analog pipeline and performs first background subtraction. Up to five readout chips are controlled by a Decoder Chip. The readout processor module (OnSiRoC) operates the detectors, controls the Decoder Chips and performs a first level data reduction. The paper describes the readout architecture of the H1 Silicon Detectors and performance data of the complete readout chain. (orig.)

  11. In the photograph, one can see the interconnection from one readout chip to the flexible cable realized with ultrasonic wire bonds (25 microns).

    CERN Multimedia

    Saba, A

    2006-01-01

    2 ladders are connected via a multi layer aluminium polyimide flexible cable with a multi chip module containing several custom designed ASICs. The production of the flexible cable was developed and carrier out at CERN. It provides signal and data lines as well as power to the individual readout chipswith a total thickness of only 220 microns. In the photograph, one can see the interconnection from one readout chip to the flexible cable realized with ultrasonic wire bonds (25 microns).

  12. A Discrete Component Low-Noise Preamplifier Readout for a Linear (1x16) SiC Photodiode Array

    Science.gov (United States)

    Kahle, Duncan; Aslam, Shahid; Herrero, Frederico A.; Waczynski, Augustyn

    2016-01-01

    A compact, low-noise and inexpensive preamplifier circuit has been designed and fabricated to optimally readout a common cathode (1x16) channel 4H-SiC Schottky photodiode array for use in ultraviolet experiments. The readout uses an operational amplifier with 10 pF capacitor in the feedback loop in parallel with a low leakage switch for each of the channels. This circuit configuration allows for reiterative sample, integrate and reset. A sampling technique is given to remove Johnson noise, enabling a femtoampere level readout noise performance. Commercial-off-the-shelf acquisition electronics are used to digitize the preamplifier analogue signals. The data logging acquisition electronics has a different integration circuit, which allows the bandwidth and gain to be independently adjusted. Using this readout, photoresponse measurements across the array between spectral wavelengths 200 nm and 370 nm are made to establish the array pixels external quantum efficiency, current responsivity and noise equivalent power.

  13. A discrete component low-noise preamplifier readout for a linear (1×16) SiC photodiode array

    Energy Technology Data Exchange (ETDEWEB)

    Kahle, Duncan [NASA, Goddard Space Flight Center, Detector Systems Branch, Greenbelt, MD 20771 (United States); Aslam, Shahid, E-mail: shahid.aslam-1@nasa.gov [NASA, Goddard Space Flight Center, Planetary Systems Laboratory, Greenbelt, MD 20771 (United States); Herrero, Federico A.; Waczynski, Augustyn [NASA, Goddard Space Flight Center, Detector Systems Branch, Greenbelt, MD 20771 (United States)

    2016-09-11

    A compact, low-noise and inexpensive preamplifier circuit has been designed and fabricated to optimally readout a common cathode (1×16) channel 4H-SiC Schottky photodiode array for use in ultraviolet experiments. The readout uses an operational amplifier with 10 pF capacitor in the feedback loop in parallel with a low leakage switch for each of the channels. This circuit configuration allows for reiterative sample, integrate and reset. A sampling technique is given to remove Johnson noise, enabling a femtoampere level readout noise performance. Commercial-off-the-shelf acquisition electronics are used to digitize the preamplifier analog signals. The data logging acquisition electronics has a different integration circuit, which allows the bandwidth and gain to be independently adjusted. Using this readout, photoresponse measurements across the array between spectral wavelengths 200 nm and 370 nm are made to establish the array pixels external quantum efficiency, current responsivity and noise equivalent power.

  14. Enhancements to a Superconducting Quantum Interference Device (SQUID) Multiplexer Readout and Control System

    Science.gov (United States)

    Forgione, J.; Benford, D. J.; Buchanan, E. D.; Moseley, S. H.; Rebar, J.; Shafer, R. A.

    2004-01-01

    Far-infrared detector arrays such as the 16x32 superconducting bolometer array for the SAFIRE instrument (flying on the SOFIA airborne observatory) require systems of readout and control electronics to provide translation between a user-driven, digital PC and the cold, analog world of the cryogenic detector. In 2001, the National Institute of Standards and Technology (NIST) developed their Mark III electronics for purposes of control and readout of their 1x32 SQUID Multiplexer chips. We at NASA s Goddard Space Flight Center acquired a Mark 111 system and subsequently designed upgrades to suit our and our collaborators purposes. We developed an arbitrary, programmable multiplexing system that allows the user to cycle through rows in a SQUID array in an infinite number of combinations. We provided hooks in the Mark III system to allow readout of signals from outside the Mark 111 system, such as telescope status information. Finally, we augmented the heart of the system with a new feedback algorithm implementation, flexible diagnostic tools, and informative telemetry.

  15. Readout of micromechanical cantilever sensor arrays by Fabry-Perot interferometry

    International Nuclear Information System (INIS)

    Wehrmeister, Jana; Fuss, Achim; Saurenbach, Frank; Berger, Ruediger; Helm, Mark

    2007-01-01

    The increasing use of micromechanical cantilevers in sensing applications causes a need for reliable readout techniques of micromechanical cantilever sensor (MCS) bending. Current optical beam deflection techniques suffer from drawbacks such as artifacts due to changes in the refraction index upon exchange of media. Here, an adaptation of the Fabry-Perot interferometer is presented that allows simultaneous determination of MCS bending and changes in the refraction index of media. Calibration of the instrument with liquids of known refraction index provides an avenue to direct measurement of bending with nanometer precision. Versatile construction of flow cells in combination with alignment features for substrate chips allows simultaneous measurement of two MCS situated either on the same, or on two different support chips. The performance of the instrument is demonstrate in several sensing applications, including adsorption experiments of alkanethioles on MCS gold surfaces, and measurement of humidity changes in air

  16. Frequency multiplexing for readout of spin qubits

    Energy Technology Data Exchange (ETDEWEB)

    Hornibrook, J. M.; Colless, J. I.; Mahoney, A. C.; Croot, X. G.; Blanvillain, S.; Reilly, D. J., E-mail: david.reilly@sydney.edu.au [ARC Centre of Excellence for Engineered Quantum Systems, School of Physics, University of Sydney, Sydney, NSW 2006 (Australia); Lu, H.; Gossard, A. C. [Materials Department, University of California, Santa Barbara, California 93106 (United States)

    2014-03-10

    We demonstrate a low loss, chip-level frequency multiplexing scheme for readout of scaled-up spin qubit devices. By integrating separate bias tees and resonator circuits on-chip for each readout channel, we realise dispersive gate-sensing in combination with charge detection based on two radio frequency quantum point contacts. We apply this approach to perform multiplexed readout of a double quantum dot in the few-electron regime and further demonstrate operation of a 10-channel multiplexing device. Limitations for scaling spin qubit readout to large numbers of multiplexed channels are discussed.

  17. Development of radiation hard readout electronics for LHCb

    CERN Document Server

    Sexauer, Edgar; Lindenstruth, Volker

    2001-01-01

    The experiment LHCb is under development at CERN and aims to measure CP-violation in the B-Meson system at very high precision. The experiment makes use of a vertex detector that is equipped with silicon microstrip detectors. A chip suitable for the readout of this detector has been developed in a working group at the ASIC-laboratory Heidelberg. This readout chip 'Beetle-1.0' contains 128 analog input stages of a charge sensitive preamplifier, a pulse shaper and a buffer. The analog signal is fed into a comparator, from which a fast trigger signal can be derived. The following pipeline, realized as an array of gate capacitances, can be used to either store the analog output of the input amplifiers or to store the digital comparator output. External trigger signals mark events that have to be read out and the according pipeline location is stored in a derandomizing buffer. Pending events are read out from the pipeline via a charge-sensitive, resetable amplifier and an analog multiplexer, which serializes the s...

  18. COLIBRI: partial camera readout and sliding trigger for the Cherenkov Telescope Array CTA

    International Nuclear Information System (INIS)

    Naumann, C L; Tejedor, L A; Martínez, G

    2013-01-01

    Plans for the future Cherenkov telescope array CTA include replacing the monolithic camera designs used in H.E.S.S. and MAGIC-I by one that is built up from a number of identical segments. These so-called clusters will be relatively autonomous, each containing its own triggering and readout hardware. While this choice was made for reasons of flexibility and ease of manufacture and maintenance, such a concept with semi-independent sub-units lends itself quite naturally to the possibility of new, and more flexible, readout modes. In all previously-used concepts, triggering and readout of the camera is centralised, with a single camera trigger per event that starts the readout of all pixels in the camera at the same time and within the same integration time window. The limitations of such a trigger system can reduce the performance of a large array such as CTA, due to the huge amount of useless data created by night-sky background if trigger thresholds are set low enough to achieve the desired 20 GeV energy threshold, and to image losses at high energies due to the rigid readout window. In this study, an alternative concept (''COLIBRI'' = Concept for an Optimised Local Image Building and Readout Infrastructure) is presented, where only those parts of the camera which are likely to actually contain image data (usually a small percentage of the total pixels) are read out. This leads to a significant reduction of the expected data rate and the dead-times incurred in the camera. Furthermore, the quasi-independence of the individual clusters can be used to read different parts of the camera at slightly different times, thus allowing the readout to follow the slow development of the shower image across the camera field of view. This concept of flexible, partial camera readout is presented in the following, together with a description of Monte-Carlo studies performed to evaluate its performance as well as a hardware implementation proposed for CTA.

  19. Chip-based microtrap arrays for cold polar molecules

    Science.gov (United States)

    Hou, Shunyong; Wei, Bin; Deng, Lianzhong; Yin, Jianping

    2017-12-01

    Compared to the atomic chip, which has been a powerful platform to perform an astonishing range of applications from rapid Bose-Einstein condensate (BEC) production to the atomic clock, the molecular chip is only in its infant stages. Recently a one-dimensional electric lattice was demonstrated to trap polar molecules on a chip. This excellent work opens up the way to building a molecular chip laboratory. Here we propose a two-dimensional (2D) electric lattice on a chip with concise and robust structure, which is formed by arrays of squared gold wires. Arrays of microtraps that originate in the microsize electrodes offer a steep gradient and thus allow for confining both light and heavy polar molecules. Theoretical analysis and numerical calculations are performed using two types of sample molecules, N D3 and SrF, to justify the possibility of our proposal. The height of the minima of the potential wells is about 10 μm above the surface of the chip and can be easily adjusted in a wide range by changing the voltages applied on the electrodes. These microtraps offer intriguing perspectives for investigating cold molecules in periodic potentials, such as quantum computing science, low-dimensional physics, and some other possible applications amenable to magnetic or optical lattice. The 2D adjustable electric lattice is expected to act as a building block for a future gas-phase molecular chip laboratory.

  20. Common Bias Readout for TES Array on Scanning Transmission Electron Microscope

    Science.gov (United States)

    Yamamoto, R.; Sakai, K.; Maehisa, K.; Nagayoshi, K.; Hayashi, T.; Muramatsu, H.; Nakashima, Y.; Mitsuda, K.; Yamasaki, N. Y.; Takei, Y.; Hidaka, M.; Nagasawa, S.; Maehata, K.; Hara, T.

    2016-07-01

    A transition edge sensor (TES) microcalorimeter array as an X-ray sensor for a scanning transmission electron microscope system is being developed. The technical challenge of this system is a high count rate of ˜ 5000 counts/second/array. We adopted a 64 pixel array with a parallel readout. Common SQUID bias, and common TES bias are planned to reduce the number of wires and the resources of a room temperature circuit. The reduction rate of wires is 44 % when a 64 pixel array is read out by a common bias of 8 channels. The possible degradation of the energy resolution has been investigated by simulations and experiments. The bias fluctuation effects of a series connection are less than those of a parallel connection. Simple calculations expect that the fluctuations of the common SQUID bias and common TES bias in a series connection are 10^{-7} and 10^{-3}, respectively. We constructed 8 SQUIDs which are connected to 8 TES outputs and a room temperature circuit for common bias readout and evaluated experimentally. Our simulation of crosstalk indicates that at an X-ray event rate of 500 cps/pixel, crosstalk will broaden a monochromatic line by about 0.01 %, or about 1.5 eV at 15 keV. Thus, our design goal of 10 eV energy resolution across the 0.5-15 keV band should be achievable.

  1. Advanced ACTPol Cryogenic Detector Arrays and Readout

    Science.gov (United States)

    Henderson, S. W.; Allison, R.; Austermann, J.; Baildon, T.; Battaglia, N.; Beall, J. A.; Becker, D.; De Bernardis, F.; Bond, J. R.; Calabrese, E.; Choi, S. K.; Coughlin, K. P.; Crowley, K. T.; Datta, R.; Devlin, M. J.; Duff, S. M.; Dunkley, J.; Dünner, R.; van Engelen, A.; Gallardo, P. A.; Grace, E.; Hasselfield, M.; Hills, F.; Hilton, G. C.; Hincks, A. D.; Hloẑek, R.; Ho, S. P.; Hubmayr, J.; Huffenberger, K.; Hughes, J. P.; Irwin, K. D.; Koopman, B. J.; Kosowsky, A. B.; Li, D.; McMahon, J.; Munson, C.; Nati, F.; Newburgh, L.; Niemack, M. D.; Niraula, P.; Page, L. A.; Pappas, C. G.; Salatino, M.; Schillaci, A.; Schmitt, B. L.; Sehgal, N.; Sherwin, B. D.; Sievers, J. L.; Simon, S. M.; Spergel, D. N.; Staggs, S. T.; Stevens, J. R.; Thornton, R.; Van Lanen, J.; Vavagiakis, E. M.; Ward, J. T.; Wollack, E. J.

    2016-08-01

    Advanced ACTPol is a polarization-sensitive upgrade for the 6 m aperture Atacama Cosmology Telescope, adding new frequencies and increasing sensitivity over the previous ACTPol receiver. In 2016, Advanced ACTPol will begin to map approximately half the sky in five frequency bands (28-230 GHz). Its maps of primary and secondary cosmic microwave background anisotropies—imaged in intensity and polarization at few arcminute-scale resolution—will enable precision cosmological constraints and also a wide array of cross-correlation science that probes the expansion history of the universe and the growth of structure via gravitational collapse. To accomplish these scientific goals, the Advanced ACTPol receiver will be a significant upgrade to the ACTPol receiver, including four new multichroic arrays of cryogenic, feedhorn-coupled AlMn transition edge sensor polarimeters (fabricated on 150 mm diameter wafers); a system of continuously rotating meta-material silicon half-wave plates; and a new multiplexing readout architecture which uses superconducting quantum interference devices and time division to achieve a 64-row multiplexing factor. Here we present the status and scientific goals of the Advanced ACTPol instrument, emphasizing the design and implementation of the Advanced ACTPol cryogenic detector arrays.

  2. ASIC Readout Circuit Architecture for Large Geiger Photodiode Arrays

    Science.gov (United States)

    Vasile, Stefan; Lipson, Jerold

    2012-01-01

    The objective of this work was to develop a new class of readout integrated circuit (ROIC) arrays to be operated with Geiger avalanche photodiode (GPD) arrays, by integrating multiple functions at the pixel level (smart-pixel or active pixel technology) in 250-nm CMOS (complementary metal oxide semiconductor) processes. In order to pack a maximum of functions within a minimum pixel size, the ROIC array is a full, custom application-specific integrated circuit (ASIC) design using a mixed-signal CMOS process with compact primitive layout cells. The ROIC array was processed to allow assembly in bump-bonding technology with photon-counting infrared detector arrays into 3-D imaging cameras (LADAR). The ROIC architecture was designed to work with either common- anode Si GPD arrays or common-cathode InGaAs GPD arrays. The current ROIC pixel design is hardwired prior to processing one of the two GPD array configurations, and it has the provision to allow soft reconfiguration to either array (to be implemented into the next ROIC array generation). The ROIC pixel architecture implements the Geiger avalanche quenching, bias, reset, and time to digital conversion (TDC) functions in full-digital design, and uses time domain over-sampling (vernier) to allow high temporal resolution at low clock rates, increased data yield, and improved utilization of the laser beam.

  3. Digital readouts for large microwave low-temperature detector arrays

    International Nuclear Information System (INIS)

    Mazin, Benjamin A.; Day, Peter K.; Irwin, Kent D.; Reintsema, Carl D.; Zmuidzinas, Jonas

    2006-01-01

    Over the last several years many different types of low-temperature detectors (LTDs) have been developed that use a microwave resonant circuit as part of their readout. These devices include microwave kinetic inductance detectors (MKID), microwave SQUID readouts for transition edge sensors (TES), and NIS bolometers. Current readout techniques for these devices use analog frequency synthesizers and IQ mixers. While these components are available as microwave integrated circuits, one set is required for each resonator. We are exploring a new readout technique for this class of detectors based on a commercial-off-the-shelf technology called software defined radio (SDR). In this method a fast digital to analog (D/A) converter creates as many tones as desired in the available bandwidth. Our prototype system employs a 100MS/s 16-bit D/A to generate an arbitrary number of tones in 50MHz of bandwidth. This signal is then mixed up to the desired detector resonant frequency (∼10GHz), sent through the detector, then mixed back down to baseband. The baseband signal is then digitized with a series of fast analog to digital converters (80MS/s, 14-bit). Next, a numerical mixer in a dedicated integrated circuit or FPGA mixes the resonant frequency of a specified detector to 0Hz, and sends the complex detector output over a computer bus for processing and storage. In this paper we will report on our results in using a prototype system to readout a MKID array, including system noise performance, X-ray pulse response, and cross-talk measurements. We will also discuss how this technique can be scaled to read out many thousands of detectors

  4. Analyses of test beam data for the ATLAS upgrade readout chip (ABC130)

    Energy Technology Data Exchange (ETDEWEB)

    Peschke, Richard [DESY, Hamburg (Germany); Collaboration: ATLAS-Collaboration

    2015-07-01

    As part of the ATLAS phase II upgrade it is planned to replace the current tracker with an all silicon tracker. The outer part of the new tracker will consist of silicon strip detectors. For the readout of the strip detector a new Analog to Binary Converter chip (ABC130) was designed. The chip is processed in the 130 nm technology. In laboratory measurements the preamplifier of the new ABC130 showed a significant lower gain than expected. From the measurements in the laboratory it was not possible to distinguish if the malfunction is in the preamplifier or in the test circuit. Therefore an unbiased test was mandatory. Among other measurements, one was a test beam campaign at the Stanford Linear Accelerator Collider (SLAC). The result of measurement is shown in the presentation.

  5. A Zinc Oxide Nanorod Ammonia Microsensor Integrated with a Readout Circuit on-a-Chip

    Directory of Open Access Journals (Sweden)

    Chyan-Chyi Wu

    2011-11-01

    Full Text Available A zinc oxide nanorod ammonia microsensor integrated with a readout circuit on-a-chip fabricated using the commercial 0.35 mm complementary metal oxide semiconductor (CMOS process was investigated. The structure of the ammonia sensor is composed of a sensitive film and polysilicon electrodes. The ammonia sensor requires a post-process to etch the sacrificial layer, and to coat the sensitive film on the polysilicon electrodes. The sensitive film that is prepared by a hydrothermal method is made of zinc oxide. The sensor resistance changes when the sensitive film adsorbs or desorbs ammonia gas. The readout circuit is used to convert the sensor resistance into the voltage output. Experiments show that the ammonia sensor has a sensitivity of about 1.5 mV/ppm at room temperature.

  6. A High-Speed, Event-Driven, Active Pixel Sensor Readout for Photon-Counting Microchannel Plate Detectors

    Science.gov (United States)

    Kimble, Randy A.; Pain, Bedabrata; Norton, Timothy J.; Haas, J. Patrick; Oegerle, William R. (Technical Monitor)

    2002-01-01

    Silicon array readouts for microchannel plate intensifiers offer several attractive features. In this class of detector, the electron cloud output of the MCP intensifier is converted to visible light by a phosphor; that light is then fiber-optically coupled to the silicon array. In photon-counting mode, the resulting light splashes on the silicon array are recognized and centroided to fractional pixel accuracy by off-chip electronics. This process can result in very high (MCP-limited) spatial resolution while operating at a modest MCP gain (desirable for dynamic range and long term stability). The principal limitation of intensified CCD systems of this type is their severely limited local dynamic range, as accurate photon counting is achieved only if there are not overlapping event splashes within the frame time of the device. This problem can be ameliorated somewhat by processing events only in pre-selected windows of interest of by using an addressable charge injection device (CID) for the readout array. We are currently pursuing the development of an intriguing alternative readout concept based on using an event-driven CMOS Active Pixel Sensor. APS technology permits the incorporation of discriminator circuitry within each pixel. When coupled with suitable CMOS logic outside the array area, the discriminator circuitry can be used to trigger the readout of small sub-array windows only when and where an event splash has been detected, completely eliminating the local dynamic range problem, while achieving a high global count rate capability and maintaining high spatial resolution. We elaborate on this concept and present our progress toward implementing an event-driven APS readout.

  7. Image processing system design for microcantilever-based optical readout infrared arrays

    Science.gov (United States)

    Tong, Qiang; Dong, Liquan; Zhao, Yuejin; Gong, Cheng; Liu, Xiaohua; Yu, Xiaomei; Yang, Lei; Liu, Weiyu

    2012-12-01

    Compared with the traditional infrared imaging technology, the new type of optical-readout uncooled infrared imaging technology based on MEMS has many advantages, such as low cost, small size, producing simple. In addition, the theory proves that the technology's high thermal detection sensitivity. So it has a very broad application prospects in the field of high performance infrared detection. The paper mainly focuses on an image capturing and processing system in the new type of optical-readout uncooled infrared imaging technology based on MEMS. The image capturing and processing system consists of software and hardware. We build our image processing core hardware platform based on TI's high performance DSP chip which is the TMS320DM642, and then design our image capturing board based on the MT9P031. MT9P031 is Micron's company high frame rate, low power consumption CMOS chip. Last we use Intel's company network transceiver devices-LXT971A to design the network output board. The software system is built on the real-time operating system DSP/BIOS. We design our video capture driver program based on TI's class-mini driver and network output program based on the NDK kit for image capturing and processing and transmitting. The experiment shows that the system has the advantages of high capturing resolution and fast processing speed. The speed of the network transmission is up to 100Mbps.

  8. Flip chip assembly of thinned chips for hybrid pixel detector applications

    CERN Document Server

    Fritzsch, T; Woehrmann, M; Rothermund, M; Huegging, F; Ehrmann, O; Oppermann, H; Lang, K.D

    2014-01-01

    There is a steady trend to ultra-thin microelectronic devices. Especially for future particle detector systems a reduced readout chip thickness is required to limit the loss of tracking precision due to scattering. The reduction of silicon thickness is performed at wafer level in a two-step thinning process. To minimize the risk of wafer breakage the thinned wafer needs to be handled by a carrier during the whole process chain of wafer bumping. Another key process is the flip chip assembly of thinned readout chips onto thin sensor tiles. Besides the prevention of silicon breakage the minimization of chip warpage is one additional task for a high yield and reliable flip chip process. A new technology using glass carrier wafer will be described in detail. The main advantage of this technology is the combination of a carrier support during wafer processing and the chip support during flip chip assembly. For that a glass wafer is glue-bonded onto the backside of the thinned readout chip wafer. After the bump depo...

  9. A fast integrated readout system for a cathode pad photon detector

    Energy Technology Data Exchange (ETDEWEB)

    French, M. (Rutherford Appleton Lab., Chilton (United Kingdom)); Lovell, M. (Rutherford Appleton Lab., Chilton (United Kingdom)); Chesi, E. (CERN, ECP Div., Geneva (Switzerland)); Racz, A. (CERN, ECP Div., Geneva (Switzerland)); Seguinot, J. (Coll. de France, Paris (France)); Ypsilantis, T. (Coll. de France, Paris (France)); Arnold, R. (CRN, Louis Pasteur Univ., Strasbourg (France)); Guyonnet, J.L. (CRN, Louis Pasteur Univ., Strasbourg (France)); Egger, J. (Paul Scherrer Inst., Villigen (Switzerland)); Gabathuler, K. (Paul Scherrer Inst., Villigen (Switzerland))

    1994-04-01

    A fast integrated electronic chain is presented to read out the cathode pad array of a multiwire photon detector for a fast RICH counter. Two VLSI circuits have been designed and produced. An analog eight channel, low noise, fast, bipolar, current preamplifier and discriminator chip serves as front-end electronics. It has an rms equivalent noise current of 10 nA (2000 e[sup -]), 50 MHz bandwidth with 10 mW of power consumption per channel. Two analogue chips are coupled to a digital 16 channels CMOS readout chip, operating at 20 MHz, that provides a pipelined delay of 1.3 [mu]s and zero suppression with a power consumption of about 6 mW per channel. Readout of a 4000 pad sector requires 3-4 [mu]s depending on the number of hit pads. The full RICH counter is made up of many of such sectors (the prototype has three fully equipped sectors), read out in parallel. The minimum time to separate successive hits on the same pad is about 70 ns. The time skew of the full chain is about 15 ns. (orig.)

  10. First operation of a hybrid photon detector prototype with electrostatic cross-focussing and integrated silicon pixel readout

    International Nuclear Information System (INIS)

    Alemi, M.; Campbell, M.; Gys, T.; Mikulec, B.; Piedigrossi, D.; Puertolas, D.; Rosso, E.; Schomaker, R.; Snoeys, W.; Wyllie, K.

    2000-01-01

    We report on the first operation of a hybrid photon detector prototype with integrated silicon pixel readout for the ring imaging Cherenkov detectors of the LHCb experiment. The photon detector is based on a cross-focussed image intensifier tube geometry where the image is de-magnified by a factor of 4. The anode consists of a silicon pixel array, bump-bonded to a binary readout chip with matching pixel electronics. The prototype has been characterized using a low-intensity light-emitting diode operated in pulsed mode. Its performance in terms of single-photoelectron detection efficiency and imaging properties is presented. A model of photoelectron detection is proposed, and is shown to be in good agreement with the experimental data. It includes an estimate of the charge signal generated in the silicon detector, and the combined effects of the comparator threshold spread of the pixel readout chip, charge sharing at the pixel boundaries and back-scattering of the photoelectrons at the silicon detector surface

  11. First operation of a hybrid photon detector prototype with electrostatic cross-focussing and integrated silicon pixel readout

    Energy Technology Data Exchange (ETDEWEB)

    Alemi, M.; Campbell, M.; Gys, T. E-mail: thierry.gys@cern.ch; Mikulec, B.; Piedigrossi, D.; Puertolas, D.; Rosso, E.; Schomaker, R.; Snoeys, W.; Wyllie, K

    2000-07-11

    We report on the first operation of a hybrid photon detector prototype with integrated silicon pixel readout for the ring imaging Cherenkov detectors of the LHCb experiment. The photon detector is based on a cross-focussed image intensifier tube geometry where the image is de-magnified by a factor of 4. The anode consists of a silicon pixel array, bump-bonded to a binary readout chip with matching pixel electronics. The prototype has been characterized using a low-intensity light-emitting diode operated in pulsed mode. Its performance in terms of single-photoelectron detection efficiency and imaging properties is presented. A model of photoelectron detection is proposed, and is shown to be in good agreement with the experimental data. It includes an estimate of the charge signal generated in the silicon detector, and the combined effects of the comparator threshold spread of the pixel readout chip, charge sharing at the pixel boundaries and back-scattering of the photoelectrons at the silicon detector surface.

  12. Design of readout drivers for ATLAS pixel detectors using field programmable gate arrays

    CERN Document Server

    Sivasubramaniyan, Sriram

    Microstrip detectors are an integral patt of high energy physics research . Special protocols are used to transmit the data from these detectors . To readout the data from such detectors specialized instrumentation have to be designed . To achieve this task, creative and innovative high speed algorithms were designed simulated and implemented in Field Programmable gate arrays, using CAD/CAE tools. The simulation results indicated that these algorithms would be able to perform all the required tasks quickly and efficiently. This thesis describes the design of data acquisition system called the Readout Drivers (ROD) . It focuses on the ROD data path for ATLAS Pixel detectors. The data path will be an integrated part of Readout Drivers setup to decode the data from the silicon micro strip detectors and pixel detectors. This research also includes the design of Readout Driver controller. This Module is used to control the operation of the ROD. This module is responsible for the operation of the Pixel decoders bas...

  13. Zero suppression logic of the ALICE muon forward tracker pixel chip prototype PIXAM and associated readout electronics development

    International Nuclear Information System (INIS)

    Flouzat, C.; Değerli, Y.; Guilloux, F.; Orsini, F.; Venault, P.

    2015-01-01

    In the framework of the ALICE experiment upgrade at HL-LHC, a new forward tracking detector, the Muon Forward Tracker (MFT), is foreseen to overcome the intrinsic limitations of the present Muon Spectrometer and will perform new measurements of general interest for the whole ALICE physics. To fulfill the new detector requirements, CMOS Monolithic Active Pixel Sensors (MAPS) provide an attractive trade-off between readout speed, spatial resolution, radiation hardness, granularity, power consumption and material budget. This technology has been chosen to equip the Muon Forward Tracker and also the vertex detector: the Inner Tracking System (ITS). Since few years, an intensive R and D program has been performed on the design of MAPS in the 0.18 μ m CMOS Image Sensor (CIS) process. In order to avoid pile up effects in the experiment, the classical rolling shutter readout system of MAPS has been improved to overcome the readout speed limitation. A zero suppression algorithm, based on a 3 by 3 cluster finding (position and data), has been chosen for the MFT. This algorithm allows adequate data compression for the sensor. This paper presents the large size prototype PIXAM, which represents 1/3 of the final chip, and will focus specially on the zero suppression block architecture. This chip is designed and under fabrication in the 0.18 μ m CIS process. Finally, the readout electronics principle to send out the compressed data flow is also presented taking into account the cluster occupancy per MFT plane for a single central Pb-Pb collision

  14. Zero suppression logic of the ALICE muon forward tracker pixel chip prototype PIXAM and associated readout electronics development

    Science.gov (United States)

    Flouzat, C.; Değerli, Y.; Guilloux, F.; Orsini, F.; Venault, P.

    2015-05-01

    In the framework of the ALICE experiment upgrade at HL-LHC, a new forward tracking detector, the Muon Forward Tracker (MFT), is foreseen to overcome the intrinsic limitations of the present Muon Spectrometer and will perform new measurements of general interest for the whole ALICE physics. To fulfill the new detector requirements, CMOS Monolithic Active Pixel Sensors (MAPS) provide an attractive trade-off between readout speed, spatial resolution, radiation hardness, granularity, power consumption and material budget. This technology has been chosen to equip the Muon Forward Tracker and also the vertex detector: the Inner Tracking System (ITS). Since few years, an intensive R&D program has been performed on the design of MAPS in the 0.18 μ m CMOS Image Sensor (CIS) process. In order to avoid pile up effects in the experiment, the classical rolling shutter readout system of MAPS has been improved to overcome the readout speed limitation. A zero suppression algorithm, based on a 3 by 3 cluster finding (position and data), has been chosen for the MFT. This algorithm allows adequate data compression for the sensor. This paper presents the large size prototype PIXAM, which represents 1/3 of the final chip, and will focus specially on the zero suppression block architecture. This chip is designed and under fabrication in the 0.18 μ m CIS process. Finally, the readout electronics principle to send out the compressed data flow is also presented taking into account the cluster occupancy per MFT plane for a single central Pb-Pb collision.

  15. Innovative multi-cantilever array sensor system with MOEMS read-out

    Science.gov (United States)

    Ivaldi, F.; Bieniek, T.; Janus, P.; Grabiec, P.; Majstrzyk, W.; Kopiec, D.; Gotszalk, T.

    2016-11-01

    Cantilever based sensor system are a well-established sensor family exploited in several every-day life applications as well as in high-end research areas. The very high sensitivity of such systems and the possibility to design and functionalize the cantilevers to create purpose built and highly selective sensors have increased the interest of the scientific community and the industry in further exploiting this promising sensors type. Optical deflection detection systems for cantilever sensors provide a reliable, flexible method for reading information from cantilevers with the highest sensitivity. However the need of using multi-cantilever arrays in several fields of application such as medicine, biology or safety related areas, make the optical method less suitable due to its structural complexity. Working in the frame of a the Joint Undertaking project Lab4MEMS II our group proposes a novel and innovative approach to solve this issue, by integrating a Micro-Opto-Electro-Mechanical-System (MOEMS) with dedicated optics, electronics and software with a MOEMS micro-mirror, ultimately developed in the frame of Lab4MEMSII. In this way we are able to present a closely packed, lightweight solution combining the advantages of standard optical read-out systems with the possibility of recording multiple read-outs from large cantilever arrays quasi simultaneously.

  16. Low-Noise CMOS Circuits for On-Chip Signal Processing in Focal-Plane Arrays

    Science.gov (United States)

    Pain, Bedabrata

    The performance of focal-plane arrays can be significantly enhanced through the use of on-chip signal processing. Novel, in-pixel, on-focal-plane, analog signal-processing circuits for high-performance imaging are presented in this thesis. The presence of a high background-radiation is a major impediment for infrared focal-plane array design. An in-pixel, background-suppression scheme, using dynamic analog current memory circuit, is described. The scheme also suppresses spatial noise that results from response non-uniformities of photo-detectors, leading to background limited infrared detector readout performance. Two new, low-power, compact, current memory circuits, optimized for operation at ultra-low current levels required in infrared-detection, are presented. The first one is a self-cascading current memory that increases the output impedance, and the second one is a novel, switch feed-through reducing current memory, implemented using error-current feedback. This circuit can operate with a residual absolute -error of less than 0.1%. The storage-time of the memory is long enough to also find applications in neural network circuits. In addition, a voltage-mode, accurate, low-offset, low-power, high-uniformity, random-access sample-and-hold cell, implemented using a CCD with feedback, is also presented for use in background-suppression and neural network applications. A new, low noise, ultra-low level signal readout technique, implemented by individually counting photo-electrons within the detection pixel, is presented. The output of each unit-cell is a digital word corresponding to the intensity of the photon flux, and the readout is noise free. This technique requires the use of unit-cell amplifiers that feature ultra-high-gain, low-power, self-biasing capability and noise in sub-electron levels. Both single-input and differential-input implementations of such amplifiers are investigated. A noise analysis technique is presented for analyzing sampled

  17. Frequency multiplexed superconducting quantum interference device readout of large bolometer arrays for cosmic microwave background measurements.

    Science.gov (United States)

    Dobbs, M A; Lueker, M; Aird, K A; Bender, A N; Benson, B A; Bleem, L E; Carlstrom, J E; Chang, C L; Cho, H-M; Clarke, J; Crawford, T M; Crites, A T; Flanigan, D I; de Haan, T; George, E M; Halverson, N W; Holzapfel, W L; Hrubes, J D; Johnson, B R; Joseph, J; Keisler, R; Kennedy, J; Kermish, Z; Lanting, T M; Lee, A T; Leitch, E M; Luong-Van, D; McMahon, J J; Mehl, J; Meyer, S S; Montroy, T E; Padin, S; Plagge, T; Pryke, C; Richards, P L; Ruhl, J E; Schaffer, K K; Schwan, D; Shirokoff, E; Spieler, H G; Staniszewski, Z; Stark, A A; Vanderlinde, K; Vieira, J D; Vu, C; Westbrook, B; Williamson, R

    2012-07-01

    A technological milestone for experiments employing transition edge sensor bolometers operating at sub-Kelvin temperature is the deployment of detector arrays with 100s-1000s of bolometers. One key technology for such arrays is readout multiplexing: the ability to read out many sensors simultaneously on the same set of wires. This paper describes a frequency-domain multiplexed readout system which has been developed for and deployed on the APEX-SZ and South Pole Telescope millimeter wavelength receivers. In this system, the detector array is divided into modules of seven detectors, and each bolometer within the module is biased with a unique ∼MHz sinusoidal carrier such that the individual bolometer signals are well separated in frequency space. The currents from all bolometers in a module are summed together and pre-amplified with superconducting quantum interference devices operating at 4 K. Room temperature electronics demodulate the carriers to recover the bolometer signals, which are digitized separately and stored to disk. This readout system contributes little noise relative to the detectors themselves, is remarkably insensitive to unwanted microphonic excitations, and provides a technology pathway to multiplexing larger numbers of sensors.

  18. A Low Mass On-Chip Readout Scheme for Double-Sided Silicon Strip Detectors

    Energy Technology Data Exchange (ETDEWEB)

    Irmler, C., E-mail: christian.irmler@oeaw.ac.at [HEPHY Vienna – Institute of High Energy Physics of the Austrian Academy of Sciences, Nikolsdorfer Gasse 18, A-1050 Vienna (Austria); Bergauer, T.; Frankenberger, A.; Friedl, M.; Gfall, I. [HEPHY Vienna – Institute of High Energy Physics of the Austrian Academy of Sciences, Nikolsdorfer Gasse 18, A-1050 Vienna (Austria); Higuchi, T. [University of Tokyo, Kavli Institute for Physics and Mathematics of the Universe, 5-1-5 Kashiwanoha, Kashiwa, Chiba 277-8583 (Japan); Ishikawa, A. [Tohoku University, Department of Physics, Aoba Aramaki Aoba-ku, Sendai 980-8578 (Japan); Joo, C. [Seoul National University, High Energy Physics Laboratory, 25-107 Shinlim-dong, Kwanak-gu, Seoul 151-742 (Korea, Republic of); Kah, D.H.; Kang, K.H. [Kyungpook National University, Department of Physics, 1370 Sankyuk Dong, Buk Gu, Daegu 702-701 (Korea, Republic of); Rao, K.K. [Tata Institute of Fundamental Research, Experimental High Energy Physics Group, Homi Bhabha Road, Mumbai 400 005 (India); Kato, E. [Tohoku University, Department of Physics, Aoba Aramaki Aoba-ku, Sendai 980-8578 (Japan); Mohanty, G.B. [Tata Institute of Fundamental Research, Experimental High Energy Physics Group, Homi Bhabha Road, Mumbai 400 005 (India); Negishi, K. [Tohoku University, Department of Physics, Aoba Aramaki Aoba-ku, Sendai 980-8578 (Japan); Onuki, Y.; Shimizu, N. [University of Tokyo, Department of Physics, 7-3-1 Hongo, Bunkyo-ku, Tokyo 113-0033 (Japan); Tsuboyama, T. [KEK, 1-1 Oho, Tsukuba, Ibaraki 305-0801 (Japan); Valentan, M. [HEPHY Vienna – Institute of High Energy Physics of the Austrian Academy of Sciences, Nikolsdorfer Gasse 18, A-1050 Vienna (Austria)

    2013-12-21

    B-factories like the KEKB in Tsukuba, Japan, operate at relatively low energies and thus require detectors with very low material budget in order to minimize multiple scattering. On the other hand, front-end chips with short shaping time like the APV25 have to be placed as close to the sensor strips as possible to reduce the capacitive load, which mainly determines the noise figure. In order to achieve both – minimal material budget and low noise – we developed a readout scheme for double-sided silicon detectors, where the APV25 chips are placed on a flexible circuit, which is glued onto the top side of the sensor. The bottom-side strips are connected by two flexible circuits, which are bent around the edge of the sensor. This so-called “Origami” design will be utilized to build the Silicon Vertex Detector of the Belle II experiment, which will consist of four layers made from ladders with up to five double-sided silicon strip sensors in a row. Each ladder will be supported by two ribs made of a carbon fiber and Airex foam core sandwich. The heat dissipated by the front-end chips will be removed by a highly efficient two-phase CO{sub 2} system. Thanks to the Origami concept, all APV25 chips are aligned in a row and thus can be cooled by a single thin cooling pipe per ladder. We present the concept and the assembly procedure of the Origami chip-on-sensor modules.

  19. A Low Mass On-Chip Readout Scheme for Double-Sided Silicon Strip Detectors

    International Nuclear Information System (INIS)

    Irmler, C.; Bergauer, T.; Frankenberger, A.; Friedl, M.; Gfall, I.; Higuchi, T.; Ishikawa, A.; Joo, C.; Kah, D.H.; Kang, K.H.; Rao, K.K.; Kato, E.; Mohanty, G.B.; Negishi, K.; Onuki, Y.; Shimizu, N.; Tsuboyama, T.; Valentan, M.

    2013-01-01

    B-factories like the KEKB in Tsukuba, Japan, operate at relatively low energies and thus require detectors with very low material budget in order to minimize multiple scattering. On the other hand, front-end chips with short shaping time like the APV25 have to be placed as close to the sensor strips as possible to reduce the capacitive load, which mainly determines the noise figure. In order to achieve both – minimal material budget and low noise – we developed a readout scheme for double-sided silicon detectors, where the APV25 chips are placed on a flexible circuit, which is glued onto the top side of the sensor. The bottom-side strips are connected by two flexible circuits, which are bent around the edge of the sensor. This so-called “Origami” design will be utilized to build the Silicon Vertex Detector of the Belle II experiment, which will consist of four layers made from ladders with up to five double-sided silicon strip sensors in a row. Each ladder will be supported by two ribs made of a carbon fiber and Airex foam core sandwich. The heat dissipated by the front-end chips will be removed by a highly efficient two-phase CO 2 system. Thanks to the Origami concept, all APV25 chips are aligned in a row and thus can be cooled by a single thin cooling pipe per ladder. We present the concept and the assembly procedure of the Origami chip-on-sensor modules

  20. Performance of a thermal imager employing a hybrid pyroelectric detector array with MOSFET readout

    International Nuclear Information System (INIS)

    Watton, R.; Mansi, M.V.

    1988-01-01

    A thermal imager employing a two-dimensional hybrid array of pyroelectric detectors with MOSFET readout has been built. The design and theoretical performance of the detector are discussed, and the results of performance measurements are presented. 8 references

  1. A Novel Two-Wire Fast Readout Approach for Suppressing Cable Crosstalk in a Tactile Resistive Sensor Array.

    Science.gov (United States)

    Wu, Jianfeng; Wang, Yu; Li, Jianqing; Song, Aiguo

    2016-05-18

    For suppressing the crosstalk problem due to wire resistances and contacted resistances of the long flexible cables in tactile sensing systems, we present a novel two-wire fast readout approach for the two-dimensional resistive sensor array in shared row-column fashion. In the approach, two wires are used for every driving electrode and every sampling electrode in the resistive sensor array. The approach with a high readout rate, though it requires a large number of wires and many sampling channels, solves the cable crosstalk problem. We also verified the approach's performance with Multisim simulations and actual experiments.

  2. A Novel Two-Wire Fast Readout Approach for Suppressing Cable Crosstalk in a Tactile Resistive Sensor Array

    Directory of Open Access Journals (Sweden)

    Jianfeng Wu

    2016-05-01

    Full Text Available For suppressing the crosstalk problem due to wire resistances and contacted resistances of the long flexible cables in tactile sensing systems, we present a novel two-wire fast readout approach for the two-dimensional resistive sensor array in shared row-column fashion. In the approach, two wires are used for every driving electrode and every sampling electrode in the resistive sensor array. The approach with a high readout rate, though it requires a large number of wires and many sampling channels, solves the cable crosstalk problem. We also verified the approach’s performance with Multisim simulations and actual experiments.

  3. Strip detectors read-out system user's guide

    International Nuclear Information System (INIS)

    Claus, G.; Dulinski, W.; Lounis, A.

    1996-01-01

    The Strip Detector Read-out System consists of two VME modules: SDR-Flash and SDR-seq completed by a fast logic SDR-Trig stand alone card. The system is a self-consistent, cost effective and easy use solution for the read-out of analog multiplexed signals coming from some of the front-end electronics chips (Viking/VA chips family, Premus 128 etc...) currently used together with solid (silicon) or gas microstrip detectors. (author)

  4. Architecture of a modular, multichannel readout system for dense electrochemical biosensor microarrays

    International Nuclear Information System (INIS)

    Ramfos, Ioannis; Birbas, Alexios; Blionas, Spyridon

    2015-01-01

    The architecture of a modular, multichannel readout system for dense electrochemical microarrays, targeting Lab-on-a-Chip applications, is presented. This approach promotes efficient component reusability through a hybrid multiplexing methodology, maintaining high levels of sampling performance and accuracy. Two readout modes are offered, which can be dynamically interchanged following signal profiling, to cater for both rapid signal transitions and weak current responses. Additionally, functional extensions to the described architecture are discussed, which provide the system with multi-biasing capabilities. A prototype integrated circuit of the proposed architecture’s analog core and a supporting board were implemented to verify the working principles. The system was evaluated using standard loads, as well as electrochemical sensor arrays. Through a range of operating conditions and loads, the prototype exhibited a highly linear response and accurately delivered the readout of input signals with fast transitions and wide dynamic ranges. (paper)

  5. General-purpose readout electronics for white neutron source at China Spallation Neutron Source.

    Science.gov (United States)

    Wang, Q; Cao, P; Qi, X; Yu, T; Ji, X; Xie, L; An, Q

    2018-01-01

    The under-construction White Neutron Source (WNS) at China Spallation Neutron Source is a facility for accurate measurements of neutron-induced cross section. Seven spectrometers are planned at WNS. As the physical objectives of each spectrometer are different, the requirements for readout electronics are not the same. In order to simplify the development of the readout electronics, this paper presents a general method for detector signal readout. This method has advantages of expansibility and flexibility, which makes it adaptable to most detectors at WNS. In the WNS general-purpose readout electronics, signals from any kinds of detectors are conditioned by a dedicated signal conditioning module corresponding to this detector, and then digitized by a common waveform digitizer with high speed and high precision (1 GSPS at 12-bit) to obtain the full waveform data. The waveform digitizer uses a field programmable gate array chip to process the data stream and trigger information in real time. PXI Express platform is used to support the functionalities of data readout, clock distribution, and trigger information exchange between digitizers and trigger modules. Test results show that the performance of the WNS general-purpose readout electronics can meet the requirements of the WNS spectrometers.

  6. Nanoliter Centrifugal Liquid Dispenser Coupled with Superhydrophobic Microwell Array Chips for High-Throughput Cell Assays

    Directory of Open Access Journals (Sweden)

    Yuyi Wang

    2018-06-01

    Full Text Available Microfluidic systems have been regarded as a potential platform for high-throughput screening technology in drug discovery due to their low sample consumption, high integration, and easy operation. The handling of small-volume liquid is an essential operation in microfluidic systems, especially in investigating large-scale combination conditions. Here, we develop a nanoliter centrifugal liquid dispenser (NanoCLD coupled with superhydrophobic microwell array chips for high-throughput cell-based assays in the nanoliter scale. The NanoCLD consists of a plastic stock block with an array of drilled through holes, a reagent microwell array chip (reagent chip, and an alignment bottom assembled together in a fixture. A simple centrifugation at 800 rpm can dispense ~160 nL reagents into microwells in 5 min. The dispensed reagents are then delivered to cells by sandwiching the reagent chip upside down with another microwell array chip (cell chip on which cells are cultured. A gradient of doxorubicin is then dispensed to the cell chip using the NanoCLD for validating the feasibility of performing drug tests on our microchip platform. This novel nanoliter-volume liquid dispensing method is simple, easy to operate, and especially suitable for repeatedly dispensing many different reagents simultaneously to microwells.

  7. LHC1: a semiconductor pixel detector readout chip with internal, tunable delay providing a binary pattern of selected events

    International Nuclear Information System (INIS)

    Heijne, E.H.M.; Antinori, F.; Barberis, D.

    1996-01-01

    The Omega3/LHC1 pixel detector readout chip comprises a matrix of 128 x 16 readout cells of 50 μm x 500 μm and peripheral functions with 4 distinct modes of initialization and operation, together more than 800 000 transistors. Each cell contains a complete chain of amplifier, discriminator with adjustable threshold and fast-OR output, a globally adjustable delay with local fine-tuning, coincidence logic and memory. Every cell can be individually addressed for electrical test and masking. First results have been obtained from electrical tests of a chip without detector as well as from source measurements. The electronic noise without detector is ∼100 e - rms. The lowest threshold setting is close to 2000 e - and non-uniformity has been measured to be better than 450 e - rms at 5000 e - threshold. A timewalk of <10 ns and a precision of <6 ns rms on a delay of 2 μs have been measured. The results may be improved by further optimization. (orig.)

  8. Design of a current based readout chip and development of a DEPFET pixel prototype system for the ILC vertex detector

    International Nuclear Information System (INIS)

    Trimpl, M.

    2005-12-01

    The future TeV-scale linear collider ILC (International Linear Collider) offers a large variety of precision measurements complementary to the discovery potential of the LHC (Large Hadron Collider). To fully exploit its physics potential, a vertex detector with unprecedented performance is needed. One proposed technology for the ILC vertex detector is the DEPFET active pixel sensor. The DEPFET sensor offers particle detection with in-pixel amplification by incorporating a field effect transistor into a fully depleted high-ohmic silicon substrate. The device provides an excellent signal-to-noise ratio and a good spatial resolution at the same time. To establish a very fast readout of a DEPFET pixel matrix with row rates of 20 MHz and more, the 128 channel CURO II ASIC has been designed and fabricated. The architecture of the chip is completely based on current mode techniques (SI) perfectly adapted to the current signal of the sensor. For the ILC vertex detector a prototype system with a 64 x 128 DEPFET pixel matrix read out by the CURO II chip has been developed. The design issues and the standalone performance of the readout chip as well as first results with the prototype system will be presented. (orig.)

  9. Design of a current based readout chip and development of a DEPFET pixel prototype system for the ILC vertex detector

    Energy Technology Data Exchange (ETDEWEB)

    Trimpl, M.

    2005-12-15

    The future TeV-scale linear collider ILC (International Linear Collider) offers a large variety of precision measurements complementary to the discovery potential of the LHC (Large Hadron Collider). To fully exploit its physics potential, a vertex detector with unprecedented performance is needed. One proposed technology for the ILC vertex detector is the DEPFET active pixel sensor. The DEPFET sensor offers particle detection with in-pixel amplification by incorporating a field effect transistor into a fully depleted high-ohmic silicon substrate. The device provides an excellent signal-to-noise ratio and a good spatial resolution at the same time. To establish a very fast readout of a DEPFET pixel matrix with row rates of 20 MHz and more, the 128 channel CURO II ASIC has been designed and fabricated. The architecture of the chip is completely based on current mode techniques (SI) perfectly adapted to the current signal of the sensor. For the ILC vertex detector a prototype system with a 64 x 128 DEPFET pixel matrix read out by the CURO II chip has been developed. The design issues and the standalone performance of the readout chip as well as first results with the prototype system will be presented. (orig.)

  10. Multiplexed detection of cardiac biomarkers in serum with nanowire arrays using readout ASIC.

    Science.gov (United States)

    Zhang, Guo-Jun; Chai, Kevin Tshun Chuan; Luo, Henry Zhan Hong; Huang, Joon Min; Tay, Ignatius Guang Kai; Lim, Andy Eu-Jin; Je, Minkyu

    2012-05-15

    Early detection of cardiac biomarkers for diagnosis of heart attack is the key to saving lives. Conventional method of detection like the enzyme-linked immunosorbent assay (ELISA) is time consuming and low in sensitivity. Here, we present a label-free detection system consisting of an array of silicon nanowire sensors and an interface readout application specific integrated circuit (ASIC). This system provides a rapid solution that is highly sensitive and is able to perform direct simultaneous-multiplexed detection of cardiac biomarkers in serum. Nanowire sensor arrays were demonstrated to have the required selectivity and sensitivity to perform multiplexed detection of 100 fg/ml troponin T, creatine kinase MM, and creatine kinase MB in serum. A good correlation between measurements from a probe station and the readout ASIC was obtained. Our detection system is expected to address the existing limitations in cardiac health management that are currently imposed by the conventional testing platform, and opens up possibilities in the development of a miniaturized device for point-of-care diagnostic applications. Copyright © 2012 Elsevier B.V. All rights reserved.

  11. A fast and reliable readout method for quantitative analysis of surface-enhanced Raman scattering nanoprobes on chip surface

    Energy Technology Data Exchange (ETDEWEB)

    Chang, Hyejin; Jeong, Sinyoung; Ko, Eunbyeol; Jeong, Dae Hong, E-mail: yslee@snu.ac.kr, E-mail: debobkr@gmail.com, E-mail: jeongdh@snu.ac.kr [Department of Chemistry Education, Seoul National University, Seoul 151-742 (Korea, Republic of); Kang, Homan [Interdisciplinary Program in Nano-Science and Technology, Seoul National University, Seoul 151-742 (Korea, Republic of); Lee, Yoon-Sik, E-mail: yslee@snu.ac.kr, E-mail: debobkr@gmail.com, E-mail: jeongdh@snu.ac.kr [Interdisciplinary Program in Nano-Science and Technology, Seoul National University, Seoul 151-742 (Korea, Republic of); School of Chemical and Biological Engineering, Seoul National University, Seoul 151-742 (Korea, Republic of); Lee, Ho-Young, E-mail: yslee@snu.ac.kr, E-mail: debobkr@gmail.com, E-mail: jeongdh@snu.ac.kr [Department of Nuclear Medicine, Seoul National University Bundang Hospital, Seongnam 463-707 (Korea, Republic of)

    2015-05-15

    Surface-enhanced Raman scattering techniques have been widely used for bioanalysis due to its high sensitivity and multiplex capacity. However, the point-scanning method using a micro-Raman system, which is the most common method in the literature, has a disadvantage of extremely long measurement time for on-chip immunoassay adopting a large chip area of approximately 1-mm scale and confocal beam point of ca. 1-μm size. Alternative methods such as sampled spot scan with high confocality and large-area scan method with enlarged field of view and low confocality have been utilized in order to minimize the measurement time practically. In this study, we analyzed the two methods in respect of signal-to-noise ratio and sampling-led signal fluctuations to obtain insights into a fast and reliable readout strategy. On this basis, we proposed a methodology for fast and reliable quantitative measurement of the whole chip area. The proposed method adopted a raster scan covering a full area of 100 μm × 100 μm region as a proof-of-concept experiment while accumulating signals in the CCD detector for single spectrum per frame. One single scan with 10 s over 100 μm × 100 μm area yielded much higher sensitivity compared to sampled spot scanning measurements and no signal fluctuations attributed to sampled spot scan. This readout method is able to serve as one of key technologies that will bring quantitative multiplexed detection and analysis into practice.

  12. Gossipo-3 A prototype of a Front-End Pixel Chip for Read-Out of Micro-Pattern Gas Detectors

    CERN Document Server

    Brezina, Christpoh; van der Graaf, Haryy; Gromov, Vladimir; Kluit, Ruud; Kruth, Andre; Zappon, Francesco

    2009-01-01

    In a joint effort of Nikhef (Amsterdam) and the University of Bonn, the Gossipo-3 integrated circuit (IC) has been developed. This circuit is a prototype of a chip dedicated for read-out of various types of position sensitive Micro-Pattern Gas detectors (MPGD). The Gossipo-3 is defined as a set of building blocks to be used in a future highly granulated (60 μm) chip. The pixel circuit can operate in two modes. In Time mode every readout pixel measures the hit arrival time and the charge deposit. For this purpose it has been equipped with a high resolution TDC (1.7 ns) covering dynamic range up to 102 μs. Charge collected by the pixel will be measured using Time-over- Threshold method in the range from 400 e- to 28000 e- with accuracy of 200 e- (standard deviation). In Counting mode every pixel operates as a 24-bit counter, counting the number of incoming hits. The circuit is also optimized to operate at low power consumption (100 mW/cm2) that is required to avoid the need for massive power transport and coo...

  13. Experimental characterization of the 192 channel Clear-PEM frontend ASIC coupled to a multi-pixel APD readout of LYSO:Ce crystals

    International Nuclear Information System (INIS)

    Albuquerque, Edgar; Bexiga, Vasco; Bugalho, Ricardo; Carrico, Bruno; Ferreira, Claudia S.; Ferreira, Miguel; Godinho, Joaquim; Goncalves, Fernando; Leong, Carlos; Lousa, Pedro; Machado, Pedro; Moura, Rui; Neves, Pedro; Ortigao, Catarina; Piedade, Fernando; Pinheiro, Joao F.; Rego, Joel; Rivetti, Angelo; Rodrigues, Pedro; Silva, Jose C.

    2009-01-01

    In the framework of the Clear-PEM project for the construction of a high-resolution scanner for breast cancer imaging, a very compact and dense frontend electronics system has been developed for readout of multi-pixel S8550 Hamamatsu APDs. The frontend electronics are instrumented with a mixed-signal Application-Specific Integrated Circuit (ASIC), which incorporates 192 low-noise charge pre-amplifiers, shapers, analog memory cells and digital control blocks. Pulses are continuously stored in memory cells at clock frequency. Channels above a common threshold voltage are readout for digitization by off-chip free-sampling ADCs. The ASIC has a size of 7.3x9.8mm 2 and was implemented in a AMS 0.35μm CMOS technology. In this paper the experimental characterization of the Clear-PEM frontend ASIC, reading out multi-pixel APDs coupled to LYSO:Ce crystal matrices, is presented. The chips were mounted on a custom test board connected to six APD arrays and to the data acquisition system. Six 32-pixel LYSO:Ce crystal matrices coupled on both sides to APD arrays were readout by two test boards. All 384 channels were operational. The chip power consumption is 660 mW (3.4 mW per channel). A very stable behavior of the chip was observed, with an estimated ENC of 1200-1300e - at APD gain 100. The inter-channel noise dispersion and mean baseline variation is less than 8% and 0.5%, respectively. The spread in the gain between different channels is found to be 1.5%. Energy resolution of 16.5% at 511 keV and 12.8% at 662 keV has been measured. Timing measurements between the two APDs that readout the same crystal is extracted and compared with detailed Monte Carlo simulations. At 511 keV the measured single photon time RMS resolution is 1.30 ns, in very good agreement with the expected value of 1.34 ns.

  14. LHCb - SALT, a dedicated readout chip for strip detectors in the LHCb Upgrade experiment

    CERN Multimedia

    Swientek, Krzysztof Piotr

    2015-01-01

    Silicon strip detectors in the upgraded Tracker of LHCb experiment will require a new readout 128-channel ASIC called SALT. It will extract and digitise analogue signals from the sensor, perform digital processing and transmit serial output data. SALT is designed in CMOS 130 nm process and uses a novel architecture comprising of analogue front-end and ultra-low power ($<$0.5 mW) fast (40 MSps) sampling 6-bit ADC in each channel. A prototype of first 8-channel version of SALT chip, comprising all important functionalities, was submitted. Its design and possibly first tests results will be presented.

  15. Simultaneous detection of lactate and glucose by integrated printed circuit board based array sensing chip

    Energy Technology Data Exchange (ETDEWEB)

    Li, Xuelian [Institute for Clean Energy and Advanced Materials, Southwest University, Chongqing 400715 (China); School of Chemistry and Chemical Engineering, Southwest University, Chongqing 400715 (China); Zang, Jianfeng [Department of Mechanical Engineering and Materials Science, Duke University, Durham, NC 27708 (United States); Liu, Yingshuai; Lu, Zhisong [Institute for Clean Energy and Advanced Materials, Southwest University, Chongqing 400715 (China); Li, Qing, E-mail: Qli@swu.edu.cn [School of Chemistry and Chemical Engineering, Southwest University, Chongqing 400715 (China); Li, Chang Ming, E-mail: ecmli@swu.edu.cn [Institute for Clean Energy and Advanced Materials, Southwest University, Chongqing 400715 (China)

    2013-04-10

    Highlights: ► An integrated printed circuit board (PCB) based array sensing chip was developed. ► Simultaneous detection of lactate and glucose in serum has been demonstrated. ► The array electronic biochip has high signal to noise ratio and high sensitivity. ► Additional electrodes were designed on the chip to correct interferences. -- Abstract: An integrated printed circuit board (PCB) based array sensing chip was developed to simultaneously detect lactate and glucose in mouse serum. The novelty of the chip relies on a concept demonstration of inexpensive high-throughput electronic biochip, a chip design for high signal to noise ratio and high sensitivity by construction of positively charged chitosan/redox polymer Polyvinylimidazole-Os (PVI-Os)/carbon nanotube (CNT) composite sensing platform, in which the positively charged chitosan/PVI-Os is mediator and electrostatically immobilizes the negatively charged enzyme, while CNTs function as an essential cross-linker to network PVI-Os and chitosan due to its negative charged nature. Additional electrodes on the chip with the same sensing layer but without enzymes were prepared to correct the interferences for high specificity. Low detection limits of 0.6 μM and 5 μM were achieved for lactate and glucose, respectively. This work could be extended to inexpensive array sensing chips with high sensitivity, good specificity and high reproducibility for various sensor applications.

  16. Readout and characterisation of new silicon pixel photodiode array for use in PET

    International Nuclear Information System (INIS)

    Hooper, P.; Ward, G.; Lerch, R.; Rozenfeld, A.

    2002-01-01

    Full text: Positron emission tomography (PET) is a functional imaging tool, which is able to quantify physiological, and biochemical processes in vivo using short-lived cyclotron-produced radiotracers. The main physical principle of PET is the simultaneous measurement of two 511 keV photons which are emitted in opposite directions following the annihilation of a positron in tissue. The accuracy of tracking these photons determines the accuracy of localising the radiotracer in the body, which is referred to as the spatial resolution of the system. Compared with conventional single photon imaging with gamma cameras, PET provides superior spatial resolution and sensitivity. However, compared with anatomical imaging techniques, the spatial resolution remains relatively poor at approximately 4-6 mm full width at half maximum (FWHM), compared with 1 mm FWHM for MRI. The Centre for Medical Radiation Physics at the University of Wollongong is developing a new Positron Emission Tomography (PET) detection sub-module that will significantly improve the spatial resolution of PET. The new sub-module design is simple and robust to minimise module assembly complications and is completely independent of photomultiplier tubes. The new sub-module has also been designed to maximise its flexibility for easy sub-module coupling so as to form a complete, customised, detection module to be used in PET scanners dedicated to human brain and breast, and small animal studies. A new computer controlled gantry allows the system to be used for PET and SPECT applications. Silicon 8x8 detector arrays have been developed by CMRP and will be optically coupled scintillation crystals and readout using the VIKING tM hybrid preamplifier chip to form the basis of the new module Characterisation of the pixel photodiode array has been performed to check the uniformity of the response of the array. This characterisation has been done using a pulsed, near infra-red laser diode system and alpha particles

  17. Effect of gamma irradiation on leakage current in CMOS read-out chips for the ATLAS upgrade silicon strip tracker at the HL-LHC

    CERN Document Server

    Stucci, Stefania Antonia; Lynn, Dave; Kierstead, James; Kuczewski, Philip; van Nieuwenhuizen, Gerrit J; Rosin, Guy; Tricoli, Alessandro

    2017-01-01

    The increase of the leakage current of NMOS transistors in detector readout chips in certain 130 nm CMOS technologies during exposure to ionising radiation needs special consideration in the design of detector systems, as this can result in a large increase of the supply current and power dissipation. As part of the R&D; program for the upgrade of the ATLAS inner detector tracker for the High Luminosity upgrade of the LHC at CERN, a dedicated set of irradiations have been carried out with the $^60$Co gamma-ray source at the Brookhaven National Laboratory. Measurements will be presented that characterise the increase in the digital leakage current in the 130 nm-technology ABC130 readout chips. The variation of the current as a function of time and total ionising dose has been studied under various conditions of dose rate, temperature and power applied to the chip. The range of variation of dose rates and temperatures has been set to be close to those expected at the High Luminosity LHC, i.e. in the range 0...

  18. FE-I2 a front-end readout chip designed in a commercial 025- mu m process for the ATLAS pixel detector at LHC

    CERN Document Server

    Blanquart, L; Einsweiler, Kevin F; Fischer, P; Mandelli, E; Meddeler, G; Peric, I

    2004-01-01

    A new front-end chip (FE-I2) has been developed for the ATLAS pixel detector at the future Large Hadron Collider (LHC) accelerator facility of the European Laboratory for Particle Physics (CERN). This chip has been submitted in a commercial 0.25- mu m CMOS process using special layout techniques for radiation tolerance. It comprises 2880 pixels arranged into 18 columns of 160 channels. Each pixel element of dimension 50 mu m * 400 mu m is composed of a charge- sensitive amplifier followed by a fast discriminator with a detection threshold adjustable within a range of 0-6000 electrons and slow control logic incorporating a wired-hit-Or, preamplifier-kill, readout mask, and automatic threshold tuning circuitry. There are two single-event- upset (SEU)-tolerant DACs for reducing threshold (7-b) and recovery- time (3-b) mismatches from pixel to pixel along with digital hit emulation and a differential readout circuit aimed at transporting time-stamped data from each pixel to buffers at the bottom of the chip. In c...

  19. Study of multi-channel readout ASIC and its discrete module for particle detector

    International Nuclear Information System (INIS)

    Wang Ke; Fan Lei; Zhang Shengjun; Li Xian

    2013-01-01

    Recently, kinds of particle detectors have used Application Specific Integrated Circuits (ASIC) in their electronics readout systems, it is the key part for the whole system. This project designed a multi-channel readout ASIC for general detectors. The chip has Preamplifier, Shaper and Peak Detector embedded for easy readout. For each channel, signal which is preprocessed by a low-noise preamplifier is sent to the shaper to form a quasi-Gaussian pulse and keep its peak for readout. This chip and modules of individual Preamplifier, Shaper and Peak Detector have been manufactured and tested. The discrete modules work well, and the 6-channel chip NPRE 6 is ready for test in some particle detection system. (authors)

  20. Readout of the upgraded ALICE-ITS

    Science.gov (United States)

    Szczepankiewicz, A.; ALICE Collaboration

    2016-07-01

    The ALICE experiment will undergo a major upgrade during the second long shutdown of the CERN LHC. As part of this program, the present Inner Tracking System (ITS), which employs different layers of hybrid pixels, silicon drift and strip detectors, will be replaced by a completely new tracker composed of seven layers of monolithic active pixel sensors. The upgraded ITS will have more than twelve billion pixels in total, producing 300 Gbit/s of data when tracking 50 kHz Pb-Pb events. Two families of pixel chips realized with the TowerJazz CMOS imaging process have been developed as candidate sensors: the ALPIDE, which uses a proprietary readout and sparsification mechanism and the MISTRAL-O, based on a proven rolling shutter architecture. Both chips can operate in continuous mode, with the ALPIDE also supporting triggered operations. As the communication IP blocks are shared among the two chip families, it has been possible to develop a common Readout Electronics. All the sensor components (analog stages, state machines, buffers, FIFOs, etc.) have been modelled in a system level simulation, which has been extensively used to optimize both the sensor and the whole readout chain design in an iterative process. This contribution covers the progress of the R&D efforts and the overall expected performance of the ALICE-ITS readout system.

  1. Readout of the upgraded ALICE-ITS

    International Nuclear Information System (INIS)

    Szczepankiewicz, A.

    2016-01-01

    The ALICE experiment will undergo a major upgrade during the second long shutdown of the CERN LHC. As part of this program, the present Inner Tracking System (ITS), which employs different layers of hybrid pixels, silicon drift and strip detectors, will be replaced by a completely new tracker composed of seven layers of monolithic active pixel sensors. The upgraded ITS will have more than twelve billion pixels in total, producing 300 Gbit/s of data when tracking 50 kHz Pb–Pb events. Two families of pixel chips realized with the TowerJazz CMOS imaging process have been developed as candidate sensors: the ALPIDE, which uses a proprietary readout and sparsification mechanism and the MISTRAL-O, based on a proven rolling shutter architecture. Both chips can operate in continuous mode, with the ALPIDE also supporting triggered operations. As the communication IP blocks are shared among the two chip families, it has been possible to develop a common Readout Electronics. All the sensor components (analog stages, state machines, buffers, FIFOs, etc.) have been modelled in a system level simulation, which has been extensively used to optimize both the sensor and the whole readout chain design in an iterative process. This contribution covers the progress of the R&D efforts and the overall expected performance of the ALICE-ITS readout system.

  2. Readout of the upgraded ALICE-ITS

    Energy Technology Data Exchange (ETDEWEB)

    Szczepankiewicz, A., E-mail: Adam.Szczepankiewicz@cern.ch [CERN, Geneva (Switzerland); Institute of Computer Science, Warsaw University of Technology, Warsaw (Poland)

    2016-07-11

    The ALICE experiment will undergo a major upgrade during the second long shutdown of the CERN LHC. As part of this program, the present Inner Tracking System (ITS), which employs different layers of hybrid pixels, silicon drift and strip detectors, will be replaced by a completely new tracker composed of seven layers of monolithic active pixel sensors. The upgraded ITS will have more than twelve billion pixels in total, producing 300 Gbit/s of data when tracking 50 kHz Pb–Pb events. Two families of pixel chips realized with the TowerJazz CMOS imaging process have been developed as candidate sensors: the ALPIDE, which uses a proprietary readout and sparsification mechanism and the MISTRAL-O, based on a proven rolling shutter architecture. Both chips can operate in continuous mode, with the ALPIDE also supporting triggered operations. As the communication IP blocks are shared among the two chip families, it has been possible to develop a common Readout Electronics. All the sensor components (analog stages, state machines, buffers, FIFOs, etc.) have been modelled in a system level simulation, which has been extensively used to optimize both the sensor and the whole readout chain design in an iterative process. This contribution covers the progress of the R&D efforts and the overall expected performance of the ALICE-ITS readout system.

  3. Silicon PIN diode hybrid arrays for charged particle detection: Building blocks for vertex detectors at the SSC

    International Nuclear Information System (INIS)

    Kramer, G.; Gaalema, S.; Shapiro, S.L.; Dunwoodie, W.M.; Arens, J.F.; Jernigan, J.G.

    1989-05-01

    Two-dimensional arrays of solid state detectors have long been used in visible and infrared systems. Hybrid arrays with separately optimized detector and readout substrates have been extensively developed for infrared sensors. The characteristics and use of these infrared readout chips with silicon PIN diode arrays produced by MICRON SEMICONDUCTOR for detecting high-energy particles are reported. Some of these arrays have been produced in formats as large as 512 /times/ 512 pixels; others have been radiation hardened to total dose levels beyond 1 Mrad. Data generation rates of 380 megasamples/second have been achieved. Analog and digital signal transmission and processing techniques have also been developed to accept and reduce these high data rates. 9 refs., 15 figs., 2 tabs

  4. FE-I4 pixel chip characterization with USBpix3 test system

    Energy Technology Data Exchange (ETDEWEB)

    Filimonov, Viacheslav; Gonella, Laura; Hemperek, Tomasz; Huegging, Fabian; Janssen, Jens; Krueger, Hans; Pohl, David-Leon; Wermes, Norbert [University of Bonn, Bonn (Germany)

    2015-07-01

    The USBpix readout system is a small and light weighting test system for the ATLAS pixel readout chips. It is widely used to operate and characterize FE-I4 pixel modules in lab and test beam environments. For multi-chip modules the resources on the Multi-IO board, that is the central control unit of the readout system, are coming to their limits, which makes the simultaneous readout of more than one chip at a time challenging. Therefore an upgrade of the current USBpix system has been developed. The upgraded system is called USBpix3 - the main focus of the talk. Characterization of single chip FE-I4 modules was performed with USBpix3 prototype (digital, analog, threshold and source scans; tuning). PyBAR (Bonn ATLAS Readout in Python scripting language) was used as readout software. PyBAR consists of FEI4 DAQ and Data Analysis Libraries in Python. The presentation describes the USBpix3 system, results of FE-I4 modules characterization and preparation for the multi-chip module and multi-module readout with USBpix3.

  5. Fast readout of the COMPASS RICH CsI-MWPC chambers

    CERN Document Server

    Abbon, P; Deschampbs, H; Kunne, F; Gerasimov, S; Ketzer, B; Konorov, I; Kravtchuk, N; Magnon, A; Neyret, D; Panebianco, S; Paul, S; Rebourgeard, P; Tessaroto, F

    2006-01-01

    A new readout system for CsI-coated MWPCs, used in the COMPASS RICH detector, has been proposed and tested in nominal high-rate conditions. It is based on the APV25-S1 analog sampling chip, and will replace the Gassiplex chip readout used up to now. The APV chip, originally designed for silicon microstrip detectors, is shown to perform well even with “slow” signals from a MWPC, keeping a signal-to-noise ratio of 9. For every trigger the system reads three consecutive in-time samples, thus allowing to extract information on the signal shape and its timing. The effective time window is reduced from ∼3 μs for the Gassiplex to below 400 ns for the APV25-S1 chip, reducing pile-up events at high particle rate. A significant improvement of the signal-to-background ratio by a factor 5–6 with respect to the original readout has been measured in the central region of the RICH detector. Due to its pipelined architecture, the new readout system also considerably reduces the dead time per event, allowing efficien...

  6. High-speed imaging at high x-ray energy: CdTe sensors coupled to charge-integrating pixel array detectors

    Energy Technology Data Exchange (ETDEWEB)

    Becker, Julian; Tate, Mark W.; Shanks, Katherine S.; Philipp, Hugh T.; Weiss, Joel T.; Purohit, Prafull [Laboratory of Atomic and Solid State Physics, Cornell University, Ithaca, NY 14853 (United States); Chamberlain, Darol [Cornell High Energy Synchrotron Source (CHESS), Cornell University, Ithaca, NY 14853 (United States); Gruner, Sol M., E-mail: smg26@cornell.edu [Laboratory of Atomic and Solid State Physics, Cornell University, Ithaca, NY 14853 (United States); Cornell High Energy Synchrotron Source (CHESS), Cornell University, Ithaca, NY 14853 (United States)

    2016-07-27

    Pixel Array Detectors (PADs) consist of an x-ray sensor layer bonded pixel-by-pixel to an underlying readout chip. This approach allows both the sensor and the custom pixel electronics to be tailored independently to best match the x-ray imaging requirements. Here we describe the hybridization of CdTe sensors to two different charge-integrating readout chips, the Keck PAD and the Mixed-Mode PAD (MM-PAD), both developed previously in our laboratory. The charge-integrating architecture of each of these PADs extends the instantaneous counting rate by many orders of magnitude beyond that obtainable with photon counting architectures. The Keck PAD chip consists of rapid, 8-frame, in-pixel storage elements with framing periods <150 ns. The second detector, the MM-PAD, has an extended dynamic range by utilizing an in-pixel overflow counter coupled with charge removal circuitry activated at each overflow. This allows the recording of signals from the single-photon level to tens of millions of x-rays/pixel/frame while framing at 1 kHz. Both detector chips consist of a 128×128 pixel array with (150 µm){sup 2} pixels.

  7. A low-power small-area ADC array for IRFPA readout

    Science.gov (United States)

    Zhong, Shengyou; Yao, Libin

    2013-09-01

    The readout integrated circuit (ROIC) is a bridge between the infrared focal plane array (IRFPA) and image processing circuit in an infrared imaging system. The ROIC is the first part of signal processing circuit and connected to detectors directly, so its performance will greatly affect the detector or even the whole imaging system performance. With the development of CMOS technologies, it's possible to digitalize the signal inside the ROIC and develop the digital ROIC. Digital ROIC can reduce complexity of the whole system and improve the system reliability. More importantly, it can accommodate variety of digital signal processing techniques which the traditional analog ROIC cannot achieve. The analog to digital converter (ADC) is the most important building block in the digital ROIC. The requirements for ADCs inside the ROIC are low power, high dynamic range and small area. In this paper we propose an RC hybrid Successive Approximation Register (SAR) ADC as the column ADC for digital ROIC. In our proposed ADC structure, a resistor ladder is used to generate several voltages. The proposed RC hybrid structure not only reduces the area of capacitor array but also releases requirement for capacitor array matching. Theory analysis and simulation show RC hybrid SAR ADC is suitable for ADC array applications

  8. The RD53 Collaboration's SystemVerilog-UVM Simulation Framework and its General Applicability to Design of Advanced Pixel Readout Chips

    CERN Document Server

    Marconi, S.; Placidi, P.; Christiansen, J.; Hemperek, T.

    2014-01-01

    The foreseen Phase 2 pixel upgrades at the LHC have very challenging requirements for the design of hybrid pixel readout chips. A versatile pixel simulation platform is as an essential development tool for the design, verification and optimization of both the system architecture and the pixel chip building blocks (Intellectual Properties, IPs). This work is focused on the implemented simulation and verification environment named VEPIX53, built using the SystemVerilog language and the Universal Verification Methodology (UVM) class library in the framework of the RD53 Collaboration. The environment supports pixel chips at different levels of description: its reusable components feature the generation of different classes of parameterized input hits to the pixel matrix, monitoring of pixel chip inputs and outputs, conformity checks between predicted and actual outputs and collection of statistics on system performance. The environment has been tested performing a study of shared architectures of the trigger late...

  9. Development of HgCdTe large format MBE arrays and noise-free high speed MOVPE EAPD arrays for ground based NIR astronomy

    Science.gov (United States)

    Finger, G.; Baker, I.; Downing, M.; Alvarez, D.; Ives, D.; Mehrgan, L.; Meyer, M.; Stegmeier, J.; Weller, H. J.

    2017-11-01

    Large format near infrared HgCdTe 2Kx2K and 4Kx4K MBE arrays have reached a level of maturity which meets most of the specifications required for near infrared (NIR) astronomy. The only remaining problem is the persistence effect which is device specific and not yet fully under control. For ground based multi-object spectroscopy on 40 meter class telescopes larger pixels would be advantageous. For high speed near infrared fringe tracking and wavefront sensing the only way to overcome the CMOS noise barrier is the amplification of the photoelectron signal inside the infrared pixel by means of the avalanche gain. A readout chip for a 320x256 pixel HgCdTe eAPD array will be presented which has 32 parallel video outputs being arranged in such a way that the full multiplex advantage is also available for small sub-windows. In combination with the high APD gain this allows reducing the readout noise to the subelectron level by applying nondestructive readout schemes with subpixel sampling. Arrays grown by MOVPE achieve subelectron readout noise and operate with superb cosmetic quality at high APD gain. Efforts are made to reduce the dark current of those arrays to make this technology also available for large format focal planes of NIR instruments offering noise free detectors for deep exposures. The dark current of the latest MOVPE eAPD arrays is already at a level adequate for noiseless broad and narrow band imaging in scientific instruments.

  10. Two Dimensional Array of Piezoresistive Nanomechanical Membrane-Type Surface Stress Sensor (MSS with Improved Sensitivity

    Directory of Open Access Journals (Sweden)

    Nico F. de Rooij

    2012-11-01

    Full Text Available We present a new generation of piezoresistive nanomechanical Membrane-type Surface stress Sensor (MSS chips, which consist of a two dimensional array of MSS on a single chip. The implementation of several optimization techniques in the design and microfabrication improved the piezoresistive sensitivity by 3~4 times compared to the first generation MSS chip, resulting in a sensitivity about ~100 times better than a standard cantilever-type sensor and a few times better than optical read-out methods in terms of experimental signal-to-noise ratio. Since the integrated piezoresistive read-out of the MSS can meet practical requirements, such as compactness and not requiring bulky and expensive peripheral devices, the MSS is a promising transducer for nanomechanical sensing in the rapidly growing application fields in medicine, biology, security, and the environment. Specifically, its system compactness due to the integrated piezoresistive sensing makes the MSS concept attractive for the instruments used in mobile applications. In addition, the MSS can operate in opaque liquids, such as blood, where optical read-out techniques cannot be applied.

  11. The FE-I4 Pixel Readout Chip and the IBL Module

    Energy Technology Data Exchange (ETDEWEB)

    Barbero, Marlon; Arutinov, David; Backhaus, Malte; Fang, Xiao-Chao; Gonella, Laura; Hemperek, Tomasz; Karagounis, Michael; Hans, Kruger; Kruth, Andre; Wermes, Norbert; /Bonn U.; Breugnon, Patrick; Fougeron, Denis; Gensolen, Fabrice; Menouni, Mohsine; Rozanov, Alexander; /Marseille, CPPM; Beccherle, Roberto; Darbo, Giovanni; /INFN, Genoa; Caminada, Lea; Dube, Sourabh; Fleury, Julien; Gnani, Dario; /LBL, Berkeley /NIKHEF, Amsterdam /Gottingen U. /SLAC

    2012-05-01

    FE-I4 is the new ATLAS pixel readout chip for the upgraded ATLAS pixel detector. Designed in a CMOS 130 nm feature size process, the IC is able to withstand higher radiation levels compared to the present generation of ATLAS pixel Front-End FE-I3, and can also cope with higher hit rate. It is thus suitable for intermediate radii pixel detector layers in the High Luminosity LHC environment, but also for the inserted layer at 3.3 cm known as the 'Insertable B-Layer' project (IBL), at a shorter timescale. In this paper, an introduction to the FE-I4 will be given, focusing on test results from the first full size FE-I4A prototype which has been available since fall 2010. The IBL project will be introduced, with particular emphasis on the FE-I4-based module concept.

  12. A nanoporous alumina microelectrode array for functional cell–chip coupling

    International Nuclear Information System (INIS)

    Wesche, Manuel; Hüske, Martin; Yakushenko, Alexey; Brüggemann, Dorothea; Mayer, Dirk; Offenhäusser, Andreas; Wolfrum, Bernhard

    2012-01-01

    The design of electrode interfaces has a strong impact on cell-based bioelectronic applications. We present a new type of microelectrode array chip featuring a nanoporous alumina interface. The chip is fabricated in a combination of top-down and bottom-up processes using state-of-the-art clean room technology and self-assembled generation of nanopores by aluminum anodization. The electrode characteristics are investigated in phosphate buffered saline as well as under cell culture conditions. We show that the modified microelectrodes exhibit decreased impedance compared to planar microelectrodes, which is caused by a nanostructuring effect of the underlying gold during anodization. The stability and biocompatibility of the device are demonstrated by measuring action potentials from cardiomyocyte-like cells growing on top of the chip. Cross sections of the cell–surface interface reveal that the cell membrane seals the nanoporous alumina layer without bending into the sub-50 nm apertures. The nanoporous microelectrode array device may be used as a platform for combining extracellular recording of cell activity with stimulating topographical cues. (paper)

  13. Design and realisation of integrated circuits for the readout of pixel sensors in high-energy physics and biomedical imaging

    Energy Technology Data Exchange (ETDEWEB)

    Peric, I.

    2004-08-01

    Radiation tolerant pixel-readout chip for the ATLAS pixel detector has been designed, implemented in a deep-submicron CMOS technology and successfully tested. The chip contains readout-channels with complex analog and digital circuits. Chip for steering of the DEPFET active-pixel matrix has been implemented in a high-voltage CMOS technology. The chip contains channels which generate fast sequences of high-voltage signals. Detector containing this chip has been successfully tested. Pixel-readout test chip for an X-ray imaging pixel sensor has been designed, implemented in a CMOS technology and tested. Pixel-readout channels are able to simultaneously count the signals generated by passage of individual photons and to sum the total charge generated during exposure time. (orig.)

  14. Development of a Timepix3 readout system based on the Merlin readout system

    International Nuclear Information System (INIS)

    Crevatin, G.; Carrato, S.; Horswell, I.; Omar, D.; Tartoni, N.; Cautero, G.

    2015-01-01

    Timepix3 chip is a new ASIC specifically designed to readout hybrid pixel detectors. The main purpose of Timepix3 is to measure the time of arrival of events. This characteristic can be exploited very effectively to develop detectors for time resolved experiments at synchrotron radiation facilities. In order to investigate how the ASIC can be applied to synchrotron experiments the Merlin readout system, developed at Diamond for the Medipix3 ASIC, has been adapted to readout the Timepix3 ASIC. The first tests of the ASIC with pulse injection and with alpha particles show that its behaviour is consistent with its nominal characteristics

  15. Readout of a 176 pixel FDM system for SAFARI TES arrays

    Science.gov (United States)

    Hijmering, R. A.; den Hartog, R.; Ridder, M.; van der Linden, A. J.; van der Kuur, J.; Gao, J. R.; Jackson, B.

    2016-07-01

    In this paper we present the results of our 176-pixel prototype of the FDM readout system for SAFARI, a TES-based focal-plane instrument for the far-IR SPICA mission. We have implemented the knowledge obtained from the detailed study on electrical crosstalk reported previously. The effect of carrier leakage is reduced by a factor two, mutual impedance is reduced to below 1 nH and mutual inductance is removed. The pixels are connected in stages, one quarter of the array half of the array and the full array, to resolve intermediate technical issues. A semi-automated procedure was incorporated to find all optimal settings for all pixels. And as a final step the complete array has been connected and 132 pixels have been read out simultaneously within the frequency range of 1-3.8MHz with an average frequency separation of 16kHz. The noise was found to be detector limited and was not affected by reading out all pixels in a FDM mode. With this result the concept of using FDM for multiplexed bolometer read out for the SAFARI instrument has been demonstrated.

  16. A Fastbus-based silicon strip readout system

    International Nuclear Information System (INIS)

    Neoustroev, P.; Stepanov, V.; Svoiski, M.; Uvarov, L.; Matthew, P.; Russ, J.; Cooper, P.

    1995-01-01

    The readout system we describe here is built specifically to work with the LBL-designed SVX chip. It is typical of systems using a master sequencer module to direct the trigger and readout cycles of the sparse data source and to push data into a digitization and storage module. (orig.)

  17. A New ATLAS Muon CSC Readout System with System on Chip Technology on ATCA Platform

    CERN Document Server

    AUTHOR|(SzGeCERN)696050; Garelli, N.; Herbst, R.T.; Huffer, M.; Iakovidis, G.; Iordanidou, K.; Kwan, K.; Kocian, M.; Lankford, A.J.; Moschovakos, P.; Nelson, A.; Ntekas, K.; Ruckman, L.; Russell, J.; Schernau, M.; Schlenker, S.; Su, D.; Valderanis, C.; Wittgen, M.; Bartoldus, R.

    2016-01-01

    The ATLAS muon Cathode Strip Chamber (CSC) backend readout system has been upgraded during the LHC 2013-2015 shutdown to be able to handle the higher Level-1 trigger rate of 100 kHz and the higher occupancy at Run 2 luminosity. The readout design is based on the Reconfigurable Cluster Element (RCE) concept for high bandwidth generic DAQ implemented on the Advanced Telecommunication Computing Architecture (ATCA) platform. The RCE design is based on the new System on Chip XILINX ZYNQ series with a processor-centric architecture with ARM processor embedded in FPGA fabric and high speed I/O resources together with auxiliary memories to form a versatile DAQ building block that can host applications tapping into both software and firmware resources. The Cluster on Board (COB) ATCA carrier hosts RCE mezzanines and an embedded Fulcrum network switch to form an online DAQ processing cluster. More compact firmware solutions on the ZYNQ for G-link, S-link and TTC allowed the full system of 320 G-links from the 32 chambe...

  18. A New ATLAS Muon CSC Readout System with System on Chip Technology on ATCA Platform

    CERN Document Server

    ATLAS CSC Collaboration; The ATLAS collaboration

    2016-01-01

    The ATLAS muon Cathode Strip Chamber (CSC) backend readout system has been upgrade during the LHC 2013-2015 shutdown to be able to handle the higher Level-1 trigger rate of 100 kHz and the higher occupancy at Run 2 luminosity. The readout design is based on the Reconfigurable Cluster Element (RCE) concept for high bandwidth generic DAQ implemented on the Advanced Telecommunication Computing Architecture (ATCA) platform. The RCE design is based on the new System on Chip XILINX ZYNQ series with a processor-centric architecture with ARM processor embedded in FPGA fabric and high speed I/O resources together with auxiliary memories to form a versatile DAQ building block that can host applications tapping into both software and firmware resources. The Cluster on Board (COB) ATCA carrier hosts RCE mezzanines and an embedded Fulcrum network switch to form an online DAQ processing cluster. More compact firmware solutions on the ZYNQ for G-link, S-link and TTC allowed the full system of 320 G-links from the 32 chamber...

  19. A New ATLAS Muon CSC Readout System with System on Chip Technology on ATCA Platform

    CERN Document Server

    AUTHOR|(SzGeCERN)664042

    2016-01-01

    The ATLAS muon Cathode Strip Chamber (CSC) back-end readout system has been upgraded during the LHC 2013-2015 shutdown to be able to handle the higher Level-1 trigger rate of 100 kHz and the higher occupancy at Run 2 luminosity. The readout design is based on the Reconfiguration Cluster Element (RCE) concept for high bandwidth generic DAQ implemented on the ATCA platform. The RCE design is based on the new System on Chip Xilinx Zynq series with a processor-centric architecture with ARM processor embedded in FPGA fabric and high speed I/O resources together with auxiliary memories to form a versatile DAQ building block that can host applications tapping into both software and firmware resources. The Cluster on Board (COB) ATCA carrier hosts RCE mezzanines and an embedded Fulcrum network switch to form an online DAQ processing cluster. More compact firmware solutions on the Zynq for G-link, S-link and TTC allowed the full system of 320 G-links from the 32 chambers to be processed by 6 COBs in one ATCA shelf thr...

  20. A New ATLAS Muon CSC Readout System with System on Chip Technology on ATCA Platform

    CERN Document Server

    Claus, Richard; The ATLAS collaboration

    2015-01-01

    The ATLAS muon Cathode Strip Chamber (CSC) backend readout system has been upgraded during the LHC 2013-2015 shutdown to be able to handle the higher Level-1 trigger rate of 100 kHz and the higher occupancy at Run 2 luminosity. The readout design is based on the Reconfiguration Cluster Element (RCE) concept for high bandwidth generic DAQ implemented on the ATCA platform. The RCE design is based on the new System on Chip XILINX ZYNQ series with a processor-centric architecture with ARM processor embedded in FPGA fabric and high speed I/O resources together with auxiliary memories to form a versatile DAQ building block that can host applications tapping into both software and firmware resources. The Cluster on Board (COB) ATCA carrier hosts RCE mezzanines and an embedded Fulcrum network switch to form an online DAQ processing cluster. More compact firmware solutions on the ZYNQ for G-link, S-link and TTC allowed the full system of 320 G-links from the 32 chambers to be processed by 6 COBs in one ATCA shelf thro...

  1. Cobalt Oxide Nanosheet and CNT Micro Carbon Monoxide Sensor Integrated with Readout Circuit on Chip

    Directory of Open Access Journals (Sweden)

    Ching-Liang Dai

    2010-03-01

    Full Text Available The study presents a micro carbon monoxide (CO sensor integrated with a readout circuit-on-a-chip manufactured by the commercial 0.35 μm complementary metal oxide semiconductor (CMOS process and a post-process. The sensing film of the sensor is a composite cobalt oxide nanosheet and carbon nanotube (CoOOH/CNT film that is prepared by a precipitation-oxidation method. The structure of the CO sensor is composed of a polysilicon resistor and a sensing film. The sensor, which is of a resistive type, changes its resistance when the sensing film adsorbs or desorbs CO gas. The readout circuit is used to convert the sensor resistance into the voltage output. The post-processing of the sensor includes etching the sacrificial layers and coating the sensing film. The advantages of the sensor include room temperature operation, short response/recovery times and easy post-processing. Experimental results show that the sensitivity of the CO sensor is about 0.19 mV/ppm, and the response and recovery times are 23 s and 34 s for 200 ppm CO, respectively.

  2. Optimised cantilever biosensor with piezoresistive read-out

    DEFF Research Database (Denmark)

    Rasmussen, Peter; Thaysen, J.; Hansen, Ole

    2003-01-01

    We present a cantilever-based biochemical sensor with piezoresistive read-out which has been optimised for measuring surface stress. The resistors and the electrical wiring on the chip are encapsulated in low-pressure chemical vapor deposition (LPCVD) silicon nitride, so that the chip is well sui...

  3. Fast readout of the COMPASS RICH CsI-MWPC photon chambers

    International Nuclear Information System (INIS)

    Abbon, P.; Delagnes, E.; Deschamps, H.; Kunne, F.; Gerasimov, S.; Ketzer, B.; Konorov, I.; Kravtchuk, N.; Magnon, A.; Neyret, D.; Panebianco, S.; Paul, S.; Rebourgeard, P.; Tessaroto, F.

    2006-01-01

    A new readout system for CsI-coated MWPCs, used in the COMPASS RICH detector, has been proposed and tested in nominal high-rate conditions. It is based on the APV25-S1 analog sampling chip, and will replace the Gassiplex chip readout used up to now. The APV chip, originally designed for silicon microstrip detectors, is shown to perform well even with 'slow' signals from a MWPC, keeping a signal-to-noise ratio of 9. For every trigger the system reads three consecutive in-time samples, thus allowing to extract information on the signal shape and its timing. The effective time window is reduced from ∼3 μs for the Gassiplex to below 400 ns for the APV25-S1 chip, reducing pile-up events at high particle rate. A significant improvement of the signal-to-background ratio by a factor 5-6 with respect to the original readout has been measured in the central region of the RICH detector. Due to its pipelined architecture, the new readout system also considerably reduces the dead time per event, allowing efficient data taking at higher trigger rate

  4. A readout system for position sensitive measurements of X-ray using silicon strip detectors

    CERN Document Server

    Dabrowski, W; Grybos, P; Idzik, M; Kudlaty, J

    2000-01-01

    In this paper we describe the development of a readout system for X-ray measurements using silicon strip detectors. The limitation concerning the inherent spatial resolution of silicon strip detectors has been evaluated by Monte Carlo simulation and the results are discussed. The developed readout system is based on the binary readout architecture and consists of two ASICs: RX32 front-end chip comprising 32 channels of preamplifiers, shapers and discriminators, and COUNT32 counter chip comprising 32 20-bit asynchronous counters and the readout logic. This work focuses on the design and performance of the front-end chip. The RX32 chip has been optimised for a low detector capacitance, in the range of 1-3 pF, and high counting rate applications. It can be used with DC coupled detectors allowing the leakage current up to a few nA per strip. For the prototype chip manufactured in a CMOS process all basic parameters have been evaluated by electronic measurements. The noise below 140 el rms has been achieved for a ...

  5. Prototype readout system for a multi Mpixels UV single-photon imaging detector capable of space flight operation

    Science.gov (United States)

    Seljak, A.; Cumming, H. S.; Varner, G.; Vallerga, J.; Raffanti, R.; Virta, V.

    2018-02-01

    Our collaboration works on the development of a large aperture, high resolution, UV single-photon imaging detector, funded through NASA's Strategic Astrophysics Technology (SAT) program. The detector uses a microchannel plate for charge multiplication, and orthogonal cross strip (XS) anodes for charge readout. Our target is to make an advancement in the technology readiness level (TRL), which enables real scale prototypes to be tested for future NASA missions. The baseline detector has an aperture of 50×50 mm and requires 160 low-noise charge-sensitive channels, in order to extrapolate the incoming photon position with a spatial resolution of about 20 μm FWHM. Technologies involving space flight require highly integrated electronic systems operating at very low power. We have designed two ASICs which enable the construction of such readout system. First, a charge sensitive amplifier (CSAv3) ASIC provides an equivalent noise charge (ENC) of around 600 e-, and a baseline gain of 10 mV/fC. The second, a Giga Sample per Second (GSPS) ASIC, called HalfGRAPH, is a 12-bit analog to digital converter. Its architecture is based on waveform sampling capacitor arrays and has about 8 μs of analog storage memory per channel. Both chips encapsulate 16 measurement channels. Using these chips, a small scale prototype readout system has been constructed on a FPGA Mezzanine Board (FMC), equipped with 32 measurement channels for system evaluation. We describe the construction of HalfGRAPH ASIC, detector's readout system concept and obtained results from the prototype system. As part of the space flight qualification, these chips were irradiated with a Cobalt gamma-ray source, to verify functional operation under ionizing radiation exposure.

  6. Spectroscopic measurements with the ATLAS FE-I4 pixel readout chip

    Energy Technology Data Exchange (ETDEWEB)

    Pohl, David-Leon; Janssen, Jens; Hemperek, Tomasz; Huegging, Fabian; Wermes, Norbert [Physikalisches Institut der Univeristaet Bonn (Germany)

    2015-07-01

    The ATLAS FE-I4 pixel readout chip is a large (2 x 2 cm{sup 2}) state of the art ASIC used in high energy physics experiments as well as for research and development purposes. While the FE-I4 is optimized for high hit rates it provides very limited charge resolution. Therefore two methods were developed to obtain high resolution single pixel charge spectra with the ATLAS FE-I4. The first method relies on the ability to change the detection threshold in small steps while counting hits from a particle source and has a resolution limited by electronic noise only. The other method uses a FPGA based time-to-digital-converter to digitize the analog charge signal with high precision. The feasibility, performance and challenges of these methods are discussed. First results of sensor characterizations from radioactive sources and test beams with the ATLAS FE-I4 in view of the charge collection efficiency after irradiation are presented.

  7. Study of preamplifier, shaper and peak detector in readout ASIC for particle detector

    International Nuclear Information System (INIS)

    Wang Ke; Zhang Shengjun; Fan Lei; Li Xian

    2014-01-01

    Recently, kinds of particle detectors have used Application Specific Integrated Circuits (ASIC) in their electronics readout system and ASICs have been designed in China now. This project designed a multi-channel readout ASIC for general detector. The chip has Preamplifier, Shaper and Peak Detector embedded for easy readout. For each channel, signal which is preprocessed by a low-noise preamplifier is sent to the shaper to form a quasi-Gaussian pulse and keep its peak for readout. This chip and modules of individual Preamplifier, Shaper and Peak Detector have been manufactured, results will be reported in time. (authors)

  8. Status of readout integrated circuits for radiation detector

    International Nuclear Information System (INIS)

    Moon, B. S.; Hong, S. B.; Cheng, J. E. and others

    2001-09-01

    In this report, we describe the current status of readout integrated circuits developed for radiation detectors, along with new technologies being applied to this field. The current status of ASCIC chip development related to the readout electronics is also included in this report. Major sources of this report are from product catalogs and web sites of the related industries. In the field of semiconductor process technology in Korea, the current status of the multi-project wafer(MPW) of IDEC, the multi-project chip(MPC) of ISRC and other domestic semiconductor process industries is described. In the case of other countries, the status of the MPW of MOSIS in USA and the MPW of EUROPRACTICE in Europe is studied. This report also describes the technologies and products of readout integrated circuits of industries worldwide

  9. Data readout system utilizing photonic integrated circuit

    Energy Technology Data Exchange (ETDEWEB)

    Stopiński, S., E-mail: S.Stopinski@tue.nl [COBRA Research Institute, Eindhoven University of Technology (Netherlands); Institute of Microelectronics and Optoelectronics, Warsaw University of Technology (Poland); Malinowski, M.; Piramidowicz, R. [Institute of Microelectronics and Optoelectronics, Warsaw University of Technology (Poland); Smit, M.K.; Leijtens, X.J.M. [COBRA Research Institute, Eindhoven University of Technology (Netherlands)

    2013-10-11

    We describe a novel optical solution for data readout systems. The core of the system is an Indium-Phosphide photonic integrated circuit performing as a front-end readout unit. It functions as an optical serializer in which the serialization of the input signal is provided by means of on-chip optical delay lines. The circuit employs electro-optic phase shifters to build amplitude modulators, power splitters for signal distribution, semiconductor optical amplifiers for signal amplification as well as on-chip reflectors. We present the concept of the system, the design and first characterization results of the devices that were fabricated in a multi-project wafer run.

  10. A 64-channel readout ASIC for nanowire biosensor array with electrical calibration scheme.

    Science.gov (United States)

    Chai, Kevin T C; Choe, Kunil; Bernal, Olivier D; Gopalakrishnan, Pradeep K; Zhang, Guo-Jun; Kang, Tae Goo; Je, Minkyu

    2010-01-01

    A 1.8-mW, 18.5-mm(2) 64-channel current readout ASIC was implemented in 0.18-µm CMOS together with a new calibration scheme for silicon nanowire biosensor arrays. The ASIC consists of 64 channels of dedicated readout and conditioning circuits which incorporate correlated double sampling scheme to reduce the effect of 1/f noise and offset from the analog front-end. The ASIC provides a 10-bit digital output with a sampling rate of 300 S/s whilst achieving a minimum resolution of 7 pA(rms). A new electrical calibration method was introduced to mitigate the issue of large variations in the nano-scale sensor device parameters and optimize the sensor sensitivity. The experimental results show that the proposed calibration technique improved the sensitivity by 2 to 10 times and reduced the variation between dataset by 9 times.

  11. A 10 MHz micropower CMOS front end for direct readout of pixel detectors

    International Nuclear Information System (INIS)

    Campbell, M.; Heijne, E.H.M.; Jarron, P.; Krummenacher, F.; Enz, C.C.; Declercq, M.; Vittoz, E.; Viertel, G.

    1990-01-01

    In the framework of the CERN-LAA project for detector R and D, a micropower circuit of 200 μmx200 μm with a current amplifier, a latched comparator and a digital memory element has been tested electrically and operated in connection with linear silicon detector arrays. The experimental direct-readout (DRO) chip comprises a matrix of 9x12 circuit cells and has been manufactured in a 3 μm CMOS technology. Particles and X-ray photons below 22 keV were detected, and thresholds can be set between 2000 and 20000 e - . The noise is less than 4 keV FWHM or 500 e - rms and the power dissipation per pixel element is 30 μW. The chip can be coupled to a detector matrix using bump bonding. (orig.)

  12. Frequency-multiplexed bias and readout of a 16-pixel superconducting nanowire single-photon detector array

    Science.gov (United States)

    Doerner, S.; Kuzmin, A.; Wuensch, S.; Charaev, I.; Boes, F.; Zwick, T.; Siegel, M.

    2017-07-01

    We demonstrate a 16-pixel array of microwave-current driven superconducting nanowire single-photon detectors with an integrated and scalable frequency-division multiplexing architecture, which reduces the required number of bias and readout lines to a single microwave feed line. The electrical behavior of the photon-sensitive nanowires, embedded in a resonant circuit, as well as the optical performance and timing jitter of the single detectors is discussed. Besides the single pixel measurements, we also demonstrate the operation of a 16-pixel array with a temporal, spatial, and photon-number resolution.

  13. Prototype ATLAS IBL Modules using the FE-I4A Front-End Readout Chip

    CERN Document Server

    Albert, J; Alimonti, Gianluca; Allport, Phil; Altenheiner, Silke; Ancu, Lucian; Andreazza, Attilio; Arguin, Jean-Francois; Arutinov, David; Backhaus, Malte; Bagolini, Alvise; Ballansat, Jacques; Barbero, Marlon; Barbier, Gérard; Bates, Richard; Battistin, Michele; Baudin, Patrick; Beau, Tristan; Beccherle, Roberto; Beck, Hans Peter; Benoit, Mathieu; Bensinger, Jim; Bomben, Marco; Borri, Marcello; Boscardin, Maurizio; Botelho Direito, Jose Antonio; Bousson, Nicolas; Boyd, George Russell Jr; Breugnon, Patrick; Bruni, Graziano; Bruschi, Marco; Buchholz, Peter; Buttar, Craig; Cadoux, Franck; Calderini, Giovanni; Caminada, Leah; Capeans, Mar; Casse, Gianluigi; Catinaccio, Andrea; Cavalli-Sforza, Matteo; Chauveau, Jacques; Chu, Ming-Lee; Ciapetti, Marco; Cindro, Vladimir; Citterio, Mauro; Clark, Allan; Cobal, Marina; Coelli, Simone; Colijn, Auke-Pieter; Colin, Daly; Collot, Johann; Crespo-Lopez, Olivier; Dalla Betta, Gian-Franco; Darbo, Giovanni; DaVia, Cinzia; David, Pierre-Yves; Debieux, Stéphane; Delebecque, Pierre; Devetak, Erik; DeWilde, Burton; Di Girolamo, Beniamino; Dinu, Nicoleta; Dittus, Fridolin; Diyakov, Denis; Djama, Fares; Dobos, Daniel Adam; Doonan, Kate; Dopke, Jens; Dorholt, Ole; Dube, Sourabh; Dushkin, Andrey; Dzahini, Daniel; Egorov, Kirill; Ehrmann, Oswin; Elldge, David; Elles, Sabine; Elsing, Markus; Eraud, Ludovic; Ereditato, Antonio; Eyring, Andreas; Falchieri, Davide; Falou, Aboud; Fang, Xiaochao; Fausten, Camille; Favre, Yannick; Ferrere, Didier; Fleta, Celeste; Fleury, Julien; Flick, Tobias; Forshaw, Dean; Fougeron, Denis; Fritzsch, Thomas; Gabrielli, Alessandro; Gaglione, Renaud; Gallrapp, Christian; Gan, K; Garcia-Sciveres, Maurice; Gariano, Giuseppe; Gastaldi, Thibaut; Gemme, Claudia; Gensolen, Fabrice; George, Matthias; Ghislain, Patrick; Giacomini, Gabriele; Gibson, Stephen; Giordani, Mario Paolo; Giugni, Danilo; Gjersdal, Håvard; Glitza, Karl Walter; Gnani, Dario; Godlewski, Jan; Gonella, Laura; Gorelov, Igor; Gorišek, Andrej; Gössling, Claus; Grancagnolo, Sergio; Gray, Heather; Gregor, Ingrid-Maria; Grenier, Philippe; Grinstein, Sebastian; Gromov, Vladimir; Grondin, Denis; Grosse-Knetter, Jörn; Hansen, Thor-Erik; Hansson, Per; Harb, Ali; Hartman, Neal; Hasi, Jasmine; Hegner, Franziska; Heim, Timon; Heinemann, Beate; Hemperek, Tomasz; Hessey, Nigel; Hetmánek, Martin; Hoeferkamp, Martin; Hostachy, Jean-Yves; Hügging, Fabian; Husi, Coralie; Iacobucci, Giuseppe; Idarraga, John; Ikegami, Yoichi; Janoška, Zdenko; Jansen, Jens; Jansen, Luc; Jensen, Frank; Jentzsch, Jennifer; Joseph, John; Kagan, Harris; Karagounis, Michael; Kass, Richard; Kenney, Christopher J; Kersten, Susanne; Kind, Peter; Klingenberg, Reiner; Kluit, Ruud; Kocian, Martin; Koffeman, Els; Kok, Angela; Korchak, Oleksandr; Korolkov, Ilya; Kostyukhin, Vadim; Krieger, Nina; Krüger, Hans; Kruth, Andre; Kugel, Andreas; Kuykendall, William; La Rosa, Alessandro; Lai, Chung-Hang; Lantzsch, Kerstin; Laporte, Didier; Lapsien, Tobias; Lounis, abdenour; Lozano, Manuel; Lu, Yunpeng; Lubatti, Henry; Macchiolo, Anna; Mallik, Usha; Mandić, Igor; Marchand, Denis; Marchiori, Giovanni; Massol, Nicolas; Matthias, Wittgen; Mättig, Peter; Mekkaoui, Abderrazak; Menouni, Mohsine; Menu, Johann; Meroni, Chiara; Mesa, Javier; Micelli, Andrea; Michal, Sébastien; Miglioranzi, Silvia; Mikuž, Marko; Mitsui, Shingo; Monti, Mauro; Moore, J; Morettini, Paolo; Muenstermann, Daniel; Murray, Peyton; Nellist, Clara; Nelson, David J; Nessi, Marzio; Neumann, Manuel; Nisius, Richard; Nordberg, Markus; Nuiry, Francois-Xavier; Oppermann, Hermann; Oriunno, Marco; Padilla, Cristobal; Parker, Sherwood; Pellegrini, Giulio; Pelleriti, Gabriel; Pernegger, Heinz; Piacquadio, Nicola Giacinto; Picazio, Attilio; Pohl, David; Polini, Alessandro; Popule, Jiří; Portell Bueso, Xavier; Povoli, Marco; Puldon, David; Pylypchenko, Yuriy; Quadt, Arnulf; Quirion, David; Ragusa, Francesco; Rambure, Thibaut; Richards, Erik; Ristic, Branislav; Røhne, Ole; Rothermund, Mario; Rovani, Alessandro; Rozanov, Alexandre; Rubinskiy, Igor; Rudolph, Matthew Scott; Rummler, André; Ruscino, Ettore; Salek, David; Salzburger, Andreas; Sandaker, Heidi; Schipper, Jan-David; Schneider, Basil; Schorlemmer, Andre; Schroer, Nicolai; Schwemling, Philippe; Seidel, Sally; Seiden, Abraham; Šícho, Petr; Skubic, Patrick; Sloboda, Michal; Smith, D; Sood, Alex; Spencer, Edwin; Strang, Michael; Stugu, Bjarne; Stupak, John; Su, Dong; Takubo, Yosuke; Tassan, Jean; Teng, Ping-Kun; Terada, Susumu; Todorov, Theodore; Tomášek, Michal; Toms, Konstantin; Travaglini, Riccardo; Trischuk, William; Troncon, Clara; Troska, Georg; Tsiskaridze, Shota; Tsurin, Ilya; Tsybychev, Dmitri; Unno, Yoshinobu; Vacavant, Laurent; Verlaat, Bart; Vianello, Elisa; Vigeolas, Eric; von Kleist, Stephan; Vrba, Václav; Vuillermet, Raphaël; Wang, Rui; Watts, Stephen; Weber, Michele; Weber, Marteen; Weigell, Philipp; Weingarten, Jens; Welch, Steven David; Wenig, Siegfried; Wermes, Norbert; Wiese, Andreas; Wittig, Tobias; Yildizkaya, Tamer; Zeitnitz, Christian; Ziolkowski, Michal; Zivkovic, Vladimir; Zoccoli, Antonio; Zorzi, Nicola; Zwalinski, Lukasz

    2012-01-01

    The ATLAS Collaboration will upgrade its semiconductor pixel tracking detector with a new Insertable B-layer (IBL) between the existing pixel detector and the vacuum pipe of the Large Hadron Collider. The extreme operating conditions at this location have necessitated the development of new radiation hard pixel sensor technologies and a new front-end readout chip, called the FE-I4. Planar pixel sensors and 3D pixel sensors have been investigated to equip this new pixel layer, and prototype modules using the FE-I4A have been fabricated and characterized using 120 GeV pions at the CERN SPS and 4 GeV positrons at DESY, before and after module irradiation. Beam test results are presented, including charge collection efficiency, tracking efficiency and charge sharing.

  14. Indium phosphide-based monolithically integrated PIN waveguide photodiode readout for resonant cantilever sensors

    Energy Technology Data Exchange (ETDEWEB)

    Siwak, N. P. [Department of Electrical and Computer Engineering, Institute for Systems Research, University of Maryland, College Park, Maryland 20742 (United States); Laboratory for the Physical Sciences, 8050 Greenmead Drive, College Park, Maryland 20740 (United States); Fan, X. Z.; Ghodssi, R. [Department of Electrical and Computer Engineering, Institute for Systems Research, University of Maryland, College Park, Maryland 20742 (United States); Kanakaraju, S.; Richardson, C. J. K. [Laboratory for the Physical Sciences, 8050 Greenmead Drive, College Park, Maryland 20740 (United States)

    2014-10-06

    An integrated photodiode displacement readout scheme for a microelectromechanical cantilever waveguide resonator sensing platform is presented. III-V semiconductors are used to enable the monolithic integration of passive waveguides with active optical components. This work builds upon previously demonstrated results by measuring the displacement of cantilever waveguide resonators with on-chip waveguide PIN photodiodes. The on-chip integration of the readout provides an additional 70% improvement in mass sensitivity compared to off-chip photodetector designs due to measurement stability and minimized coupling loss. In addition to increased measurement stability, reduced packaging complexity is achieved due to the simplicity of the readout design. We have fabricated cantilever waveguides with integrated photodetectors and experimentally characterized these cantilever sensors with monolithically integrated PIN photodiodes.

  15. Antenna-coupled bolometer arrays using transition-edge sensors

    Energy Technology Data Exchange (ETDEWEB)

    Myers, Michael J. [Department of Physics, University of California, Berkeley, California 94720 (United States)]. E-mail: mmyers@cosmology.berkeley.edu; Ade, Peter [School of Physics and Astronomy, Cardiff University, Cardiff, Wales (United Kingdom); Arnold, Kam [Department of Physics, University of California, Berkeley, California 94720 (United States); Engargiola, Greg [Department of Astronomy, University of California, Berkeley, California 94720 (United States); Holzapfel, Bill [Department of Physics, University of California, Berkeley, California 94720 (United States); Lee, Adrian T. [Department of Physics, University of California, Berkeley, California 94720 (United States); O' Brient, Roger [Department of Physics, University of California, Berkeley, California 94720 (United States); Richards, Paul L. [Department of Physics, University of California, Berkeley, California 94720 (United States); Smith, Andy [Northrop Grumman, Redondo Beach, California 90278 (United States); Spieler, Helmuth [Lawrence Berkeley National Laboratory, Berkeley, California 94720 (United States); Tran, Huan T. [Department of Physics, University of California, Berkeley, California 94720 (United States)

    2006-04-15

    We are developing antenna-coupled Transition-Edge Sensor (TES) bolometer arrays for use in measurements of the CMB polarization. TES bolometers have many well-known advantages over conventional bolometers, such as increased speed, linearity, and the existence of readout multiplexers. Antenna-coupled bolometers use an on-chip planar antenna to couple light into the bolometer. The antenna directivity and polarization sensitivity, along with the potential for on-chip band defining filters and channelizing circuits, allow a significant increase in focal plane integration. This eliminates the bulky horns, quasioptical filters, dichroics, and polarizers which might otherwise be needed in a conventional bolometric system. This simplification will ease the construction of receivers with larger numbers of pixels. We report on the fabrication and optical testing of single antenna-coupled bolometer pixels with integrated band defining filters. We will also discuss current progress on fabrication of a bolometer array based on this design.

  16. Characterization of Ni/SnPb-TiW/Pt Flip Chip Interconnections in Silicon Pixel Detector Modules

    CERN Document Server

    Karadzhinova, Aneliya; Härkönen, Jaakko; Luukka, Panja-riina; Mäenpää, Teppo; Tuominen, Eija; Haeggstrom, Edward; Kalliopuska, Juha; Vahanen, Sami; Kassamakov, Ivan

    2014-01-01

    In contemporary high energy physics experiments, silicon detectors are essential for recording the trajectory of new particles generated by multiple simultaneous collisions. Modern particle tracking systems may feature 100 million channels, or pixels, which need to be individually connected to read-out chains. Silicon pixel detectors are typically connected to readout chips by flip-chip bonding using solder bumps. High-quality electro-mechanical flip-chip interconnects minimizes the number of dead read-out channels in the particle tracking system. Furthermore, the detector modules must endure handling during installation and withstand heat generation and cooling during operation. Silicon pixel detector modules were constructed by flip-chip bonding 16 readout chips to a single sensor. Eutectic SnPb solder bumps were deposited on the readout chips and the sensor chips were coated with TiW/Pt thin film UBM (under bump metallization). The modules were assembled at Advacam Ltd, Finland. We studied the uniformity o...

  17. The rad-hard readout system of the BaBar silicon vertex tracker

    Science.gov (United States)

    Re, V.; DeWitt, J.; Dow, S.; Frey, A.; Johnson, R. P.; Kroeger, W.; Kipnis, I.; Leona, A.; Luo, L.; Mandelli, E.; Manfredi, P. F.; Nyman, M.; Pedrali-Noy, M.; Poplevin, P.; Perazzo, A.; Roe, N.; Spencer, N.

    1998-02-01

    This paper discusses the behaviour of a prototype rad-hard version of the chip developed for the readout of the BaBar silicon vertex tracker. A previous version of the chip, implemented in the 0.8 μm HP rad-soft version has been thoroughly tested in the recent times. It featured outstanding noise characteristics and showed that the specifications assumed as target for the tracker readout were met to a very good extent. The next step was the realization of a chip prototype in the rad-hard process that will be employed in the actual chip production. Such a prototype is structurally and functionally identical to its rad-soft predecessor. However, the process parameters being different, and not fully mastered at the time of design, some deviations in the behaviour were to be expected. The reasons for such deviations have been identified and some of them were removed by acting on the points that were left accessible on the chip. Other required small circuit modifications that will not affect the production schedule. The tests done so far on the rad-hard chip have shown that the noise behaviour is very close to that of the rad-soft version, that is fully adequate for the vertex detector readout.

  18. GOSSIP: A vertex detector combining a thin gas layer as signal generator with a CMOS readout pixel array

    Energy Technology Data Exchange (ETDEWEB)

    Campbell, M. [CERN/MediPix Consortium, Geneva (Switzerland); Heijne, E.H.M. [CERN/MediPix Consortium, Geneva (Switzerland); Llopart, X. [CERN/MediPix Consortium, Geneva (Switzerland); Colas, P. [DAPNIA, CEA Saclay, 91191 Gif sur Yvette Cedex (France); Giganon, A. [DAPNIA, CEA Saclay, 91191 Gif sur Yvette Cedex (France); Giomataris, Y. [DAPNIA, CEA Saclay, 91191 Gif sur Yvette Cedex (France); Chefdeville, M. [NIKHEF, Amsterdam (Netherlands); Colijn, A.P. [NIKHEF, Amsterdam (Netherlands); Fornaini, A. [NIKHEF, Amsterdam (Netherlands); Graaf, H. van der [NIKHEF, Amsterdam (Netherlands)]. E-mail: vdgraaf@nikhef.nl; Kluit, P. [NIKHEF, Amsterdam (Netherlands); Timmermans, J. [NIKHEF, Amsterdam (Netherlands); Visschers, J.L. [NIKHEF, Amsterdam (Netherlands); Schmitz, J. [University of Twente/MESA (Netherlands)

    2006-05-01

    A small TPC has been read out by means of a Medipix2 chip as direct anode. A Micromegas foil was placed 50{mu}m above the chip, and electron multiplication occurred in the gap. With a He/isobutane 80/20 mixture, gas multiplication factors up to tens of thousands were achieved, resulting in an efficiency for detecting single electrons of better than 90%. With this new readout technology for gas-filled detectors we recorded many image frames containing 2D images with tracks from cosmic muons. Along these tracks, electron clusters were observed, as well as {delta}-rays. With a gas layer thickness of only 1mm, the device could be applied as vertex detector, outperforming all Si-based detectors.

  19. GOSSIP: A vertex detector combining a thin gas layer as signal generator with a CMOS readout pixel array

    International Nuclear Information System (INIS)

    Campbell, M.; Heijne, E.H.M.; Llopart, X.; Colas, P.; Giganon, A.; Giomataris, Y.; Chefdeville, M.; Colijn, A.P.; Fornaini, A.; Graaf, H. van der; Kluit, P.; Timmermans, J.; Visschers, J.L.; Schmitz, J.

    2006-01-01

    A small TPC has been read out by means of a Medipix2 chip as direct anode. A Micromegas foil was placed 50μm above the chip, and electron multiplication occurred in the gap. With a He/isobutane 80/20 mixture, gas multiplication factors up to tens of thousands were achieved, resulting in an efficiency for detecting single electrons of better than 90%. With this new readout technology for gas-filled detectors we recorded many image frames containing 2D images with tracks from cosmic muons. Along these tracks, electron clusters were observed, as well as δ-rays. With a gas layer thickness of only 1mm, the device could be applied as vertex detector, outperforming all Si-based detectors

  20. GOSSIP: A vertex detector combining a thin gas layer as signal generator with a CMOS readout pixel array

    Science.gov (United States)

    Campbell, M.; Heijne, E. H. M.; Llopart, X.; Colas, P.; Giganon, A.; Giomataris, Y.; Chefdeville, M.; Colijn, A. P.; Fornaini, A.; van der Graaf, H.; Kluit, P.; Timmermans, J.; Visschers, J. L.; Schmitz, J.

    2006-05-01

    A small TPC has been read out by means of a Medipix2 chip as direct anode. A Micromegas foil was placed 50 μm above the chip, and electron multiplication occurred in the gap. With a He/isobutane 80/20 mixture, gas multiplication factors up to tens of thousands were achieved, resulting in an efficiency for detecting single electrons of better than 90%. With this new readout technology for gas-filled detectors we recorded many image frames containing 2D images with tracks from cosmic muons. Along these tracks, electron clusters were observed, as well as δ-rays. With a gas layer thickness of only 1 mm, the device could be applied as vertex detector, outperforming all Si-based detectors.

  1. Oxide-confined 2D VCSEL arrays for high-density inter/intra-chip interconnects

    Science.gov (United States)

    King, Roger; Michalzik, Rainer; Jung, Christian; Grabherr, Martin; Eberhard, Franz; Jaeger, Roland; Schnitzer, Peter; Ebeling, Karl J.

    1998-04-01

    We have designed and fabricated 4 X 8 vertical-cavity surface-emitting laser (VCSEL) arrays intended to be used as transmitters in short-distance parallel optical interconnects. In order to meet the requirements of 2D, high-speed optical links, each of the 32 laser diodes is supplied with two individual top contacts. The metallization scheme allows flip-chip mounting of the array modules junction-side down on silicon complementary metal oxide semiconductor (CMOS) chips. The optical and electrical characteristics across the arrays with device pitch of 250 micrometers are quite homogeneous. Arrays with 3 micrometers , 6 micrometers and 10 micrometers active diameter lasers have been investigated. The small devices show threshold currents of 600 (mu) A, single-mode output powers as high as 3 mW and maximum wavelength deviations of only 3 nm. The driving characteristics of all arrays are fully compatible to advanced 3.3 V CMOS technology. Using these arrays, we have measured small-signal modulation bandwidths exceeding 10 GHz and transmitted pseudo random data at 8 Gbit/s channel over 500 m graded index multimode fiber. This corresponds to a data transmission rate of 256 Gbit/s per array of 1 X 2 mm2 footprint area.

  2. Pad readout for gas detectors using 128-channel integrated preamplifiers

    International Nuclear Information System (INIS)

    Fischer, P.; Drees, A.; Glassel, P.

    1988-01-01

    A novel two-dimensional readout scheme for gas detectors is presented which uses small metal pads with 2.54 mm pitch as an anode. The pads are read out via 128-channel VLSI low-noise preamplifier/multiplexer chips. These chips are mounted on 2.8x2.8 cm/sup 2/ modules which are directly plugged onto the detector backplane, daisy-chained with jumpers and read out sequentially. The readout has been successfully tested with a low-pressure, two-step, TMAE-filled UV-RICH detector prototype. A single electron efficiently of >90% was observed at moderate chamber gains (<10/sup 6/). The method offers high electronic amplification, low noise, and high readout speed with a very flexible and compact design, suited for space-limited applications

  3. A CMOS ASIC Design for SiPM Arrays.

    Science.gov (United States)

    Dey, Samrat; Banks, Lushon; Chen, Shaw-Pin; Xu, Wenbin; Lewellen, Thomas K; Miyaoka, Robert S; Rudell, Jacques C

    2011-12-01

    Our lab has previously reported on novel board-level readout electronics for an 8×8 silicon photomultiplier (SiPM) array featuring row/column summation technique to reduce the hardware requirements for signal processing. We are taking the next step by implementing a monolithic CMOS chip which is based on the row-column architecture. In addition, this paper explores the option of using diagonal summation as well as calibration to compensate for temperature and process variations. Further description of a timing pickoff signal which aligns all of the positioning (spatial channels) pulses in the array is described. The ASIC design is targeted to be scalable with the detector size and flexible to accommodate detectors from different vendors. This paper focuses on circuit implementation issues associated with the design of the ASIC to interface our Phase II MiCES FPGA board with a SiPM array. Moreover, a discussion is provided for strategies to eventually integrate all the analog and mixed-signal electronics with the SiPM, on either a single-silicon substrate or multi-chip module (MCM).

  4. Yarr: A PCIe based readout system for semiconductor tracking systems

    Energy Technology Data Exchange (ETDEWEB)

    Heim, Timon [Bergische Universitaet Wuppertal, Wuppertal (Germany); CERN, Geneva (Switzerland); Maettig, Peter [Bergische Universitaet Wuppertal, Wuppertal (Germany); Pernegger, Heinz [CERN, Geneva (Switzerland)

    2015-07-01

    The Yarr readout system is a novel DAQ concept, using an FPGA board connected via PCIe to a computer, to read out semiconductor tracking systems. The system uses the FPGA as a reconfigurable IO interface which, in conjunction with the very high speed of the PCIe bus, enables a focus of processing the data stream coming from the pixel detector in software. Modern computer system could potentially make the need of custom signal processing hardware in readout systems obsolete and the Yarr readout system showcases this for FE-I4 chips, which are state-of-the-art readout chips used in the ATLAS Pixel Insertable B-Layer and developed for tracking in high multiplicity environments. The underlying concept of the Yarr readout system tries to move intelligence from hardware into the software without the loss of performance, which is made possible by modern multi-core processors. The FPGA board firmware acts like a buffer and does no further processing of the data stream, enabling rapid integration of new hardware due to minimal firmware minimisation.

  5. Emulation and Calibration of the SALT Read-out Chip for the Upstream Tracker for Modernised LHCb Detector

    CERN Document Server

    Dendek, Adam

    2015-01-01

    The LHCb is one of the four major experiments currently operating at CERN. The main reason for constructing the LHCb forward spectrometer was a precise measurement of the CP violation in heavy quarks section as well as search for a New Physics. To obtain interesting results, the LHCb is mainly focused on study of B meson decays. Unfortunately, due to the present data acquisition architecture, the LHCb experiment is statistically limited for collecting such events. This fact led the LHCb Collaboration to decide to perform far-reaching upgrade. Key part of this upgrade will be replacement of the TT detector. To perform this action, it was requited to design new tracking detector with entirely new front-end electronics. This detector will be called the Upstream Tracker (UT) and the read-out chip — SALT. This note presents an overall discussion on SALT chip. In particular, the emulation process of the SALT data preformed via the software written by the author.

  6. Development and characterisation of a front-end ASIC for macro array of photo-detectors of large dimensions

    International Nuclear Information System (INIS)

    Conforti Di Lorenzo, S.

    2010-10-01

    The coverage of large areas of photo-detection is a crucial element of experiments studying high energy atmospheric cosmic showers and neutrinos from different sources. The objective of this project is to realize big detectors using thousands of photomultipliers (PMT). The project proposes to segment the large surface of photo-detection into macro pixels consisting of an array of 16 PMT of 12 inches (2*2 m 2 ), connected to an autonomous front-end electronics which works in without-trigger data acquisition mode placed near the array. This is possible thanks to the microelectronics progress that allows to integrate the readout and the signal processing, of all the multipliers, in the same circuit (ASIC) named PARISROC (Photomultiplier Array Integrated ins SiGe Read Out Chip). The ASIC must only send out the digital data by network to the surface central data storage. The PARISROC chip made in AM's Silicon Germanium (SiGe) 0.35 μm technology, integrates 16 independent channels for each PMT of the array, providing charge and time measurements. The first prototype of PARISROC chip has a total surface of 19 mm 2 . The ASIC measurements have led to the realization of a second prototype. Important measurements were performed in terms of noise, dynamic range, readout frequency (from 10 MHz to 40 MHz), time measurements (TDC improvements) and charge measurements (Slow shaper improvements). This new prototype of PARISROC-2 has been tested and the characterisation has shown a good overall behavior and the verification of the improvements. (author)

  7. MUSIC: An 8 channel readout ASIC for SiPM arrays

    Science.gov (United States)

    Gómez, Sergio; Gascón, David; Fernández, Gerard; Sanuy, Andreu; Mauricio, Joan; Graciani, Ricardo; Sanchez, David

    2016-04-01

    This paper presents an 8 channel ASIC for SiPM anode readout based on a novel low input impedance current conveyor (under patent1). This Multiple Use SiPM Integrated Circuit (MUSIC) has been designed to serve several purposes, including, for instance, the readout of SiPM arrays for some of the Cherenkov Telescope Array (CTA) cameras. The current division scheme at the very front end part of the circuit splits the input current into differently scaled copies which are connected to independent current mirrors. The circuit contains a tunable pole zero cancellation of the SiPM recovery time constant to deal with sensors from different manufacturers. Decay times up to 100 ns are supported covering most of the available SiPM devices in the market. MUSIC offers three main features: (1) differential output of the sum of the individual input channels; (2) 8 individual single ended analog outputs and; (3) 8 individual binary outputs. The digital outputs encode the amount of collected charge in the duration of the digital signal using a time over threshold technique. For each individual channel, the user must select the analog or digital output. Each functionality, the signal sum and the 8 A/D outputs, include a selectable dual-gain configuration. Moreover, the signal sum implements dual-gain output providing a 15 bit dynamic range. Full die simulation results of the MUSIC designed using AMS 0.35 µm SiGe technology are presented: total die size of 9 mm2, 500 MHz bandwidth for channel sum and 150 MHz bandwidth for A/D channels, low input impedance (≍32 Ω), single photon output pulse width at half maximum (FWHM) between 5 and 10 ns and with a power consumption of ≍ 30 mW/ch plus ≍ 200 mW for the 8 ch sum. Encapsulated prototype samples of the MUSIC are expected by March 2016.

  8. The RD53 collaboration's SystemVerilog-UVM simulation framework and its general applicability to design of advanced pixel readout chips

    International Nuclear Information System (INIS)

    Marconi, S; Christiansen, J; Conti, E; Placidi, P; Hemperek, T

    2014-01-01

    The foreseen Phase 2 pixel upgrades at the LHC have very challenging requirements for the design of hybrid pixel readout chips. A versatile pixel simulation platform is as an essential development tool for the design, verification and optimization of both the system architecture and the pixel chip building blocks (Intellectual Properties, IPs). This work is focused on the implemented simulation and verification environment named VEPIX53, built using the SystemVerilog language and the Universal Verification Methodology (UVM) class library in the framework of the RD53 Collaboration. The environment supports pixel chips at different levels of description: its reusable components feature the generation of different classes of parameterized input hits to the pixel matrix, monitoring of pixel chip inputs and outputs, conformity checks between predicted and actual outputs and collection of statistics on system performance. The environment has been tested performing a study of shared architectures of the trigger latency buffering section of pixel chips. A fully shared architecture and a distributed one have been described at behavioral level and simulated; the resulting memory occupancy statistics and hit loss rates have subsequently been compared

  9. Simulation of digital pixel readout chip architectures with the RD53 SystemVerilog-UVM verification environment using Monte Carlo physics data

    International Nuclear Information System (INIS)

    Conti, E.; Marconi, S.; Christiansen, J.; Placidi, P.; Hemperek, T.

    2016-01-01

    The simulation and verification framework developed by the RD53 collaboration is a powerful tool for global architecture optimization and design verification of next generation hybrid pixel readout chips. In this paper the framework is used for studying digital pixel chip architectures at behavioral level. This is carried out by simulating a dedicated, highly parameterized pixel chip description, which makes it possible to investigate different grouping strategies between pixels and different latency buffering and arbitration schemes. The pixel hit information used as simulation input can be either generated internally in the framework or imported from external Monte Carlo detector simulation data. The latter have been provided by both the CMS and ATLAS experiments, featuring HL-LHC operating conditions and the specifications related to the Phase 2 upgrade. Pixel regions and double columns were simulated using such Monte Carlo data as inputs: the performance of different latency buffering architectures was compared and the compliance of different link speeds with the expected column data rate was verified

  10. Application specific integrated circuit (ASIC) readout technologies for future ion beam analytical instruments

    Energy Technology Data Exchange (ETDEWEB)

    Whitlow, Harry J. E-mail: harry_j.whitlow@nuclear.lu.se

    2000-03-01

    New possibilities for ion beam analysis (IBA) are afforded by recent developments in detector technology which facilitate the parallel collection of data from a large number of channels. Application specific integrated circuit (ASIC) technologies, which have been widely employed for multi-channel readout systems in nuclear and particle physics, are more net-cost effective (160/channel for 1000 channels) and a more rational solution for readout of a large number of channels than afforded by conventional electronics. Based on results from existing and on-going chip designs, the possibilities and issues of ASIC readout technology are considered from the IBA viewpoint. Consideration is given to readout chip architecture and how the stringent resolution, linearity and stability requirements for IBA may be met. In addition the implications of the restrictions imposed by ASIC technology are discussed.

  11. Evaluation of mixed-signal noise effects in photon-counting X-ray image sensor readout circuits

    International Nuclear Information System (INIS)

    Lundgren, Jan; Abdalla, Suliman; O'Nils, Mattias; Oelmann, Bengt

    2006-01-01

    In readout electronics for photon-counting pixel detectors, the tight integration between analog and digital blocks causes the readout electronics to be sensitive to on-chip noise coupling. This noise coupling can result in faulty luminance values in grayscale X-ray images, or as color distortions in a color X-ray imaging system. An exploration of simulating noise coupling in readout circuits is presented which enables the discovery of sensitive blocks at as early a stage as possible, in order to avoid costly design iterations. The photon-counting readout system has been simulated for noise coupling in order to highlight the existing problems of noise coupling in X-ray imaging systems. The simulation results suggest that on-chip noise coupling should be considered and simulated in future readout electronics systems for X-ray detectors

  12. Development of the quality control system of the readout electronics for the large size telescope of the Cherenkov Telescope Array observatory

    Science.gov (United States)

    Konno, Y.; Kubo, H.; Masuda, S.; Paoletti, R.; Poulios, S.; Rugliancich, A.; Saito, T.

    2016-07-01

    The Cherenkov Telescope Array (CTA) is the next generation VHE γ-ray observatory which will improve the currently available sensitivity by a factor of 10 in the range 100 GeV to 10 TeV. The array consists of different types of telescopes, called large size telescope (LST), medium size telescope (MST) and small size telescope (SST). A LST prototype is currently being built and will be installed at the Observatorio Roque de los Muchachos, island of La Palma, Canary islands, Spain. The readout system for the LST prototype has been designed and around 300 readout boards will be produced in the coming months. In this note we describe an automated quality control system able to measure basic performance parameters and quickly identify faulty boards.

  13. A compact readout system for multi-pixel hybrid photodiodes

    International Nuclear Information System (INIS)

    Datema, C.P.; Meng, L.J.; Ramsden, D.

    1999-01-01

    Although the first Multi-pixel Hybrid Photodiode (M-HPD) was developed in the early 1990s by Delft Electronic Products, the main obstacle to its application has been the lack of availability of a compact read-out system. A fast, parallel readout system has been constructed for use with the earlier 25-pixel tube with High-energy Physics applications in mind. The excellent properties of the recently developed multi-pixel hybrid photodiodes (M-HPD) will be easier to exploit following the development of the new hybrid read-out circuits described in this paper. This system will enable all of the required read-out functions to be accommodate on a single board into which the M-HPD is plugged. The design and performance of a versatile system is described in which a trigger-signal, derived from the common-side of the silicon anode in the M-HPD, is used to trigger the readout of the 60-anode pixels in the M-HPD. The multi-channel amplifier section is based on the use of a new, commercial VLSI chip, whilst the read-out sequencer uses a chip of its own design. The common anode signal is processed by a fast amplifier and discriminator to provide a trigger signal when a single event is detected. In the prototype version, the serial analogue output data-stream is processed using a PC-mounted, high speed ADC. Results obtained using the new read-out system in a compact gamma-camera and with a small muon tracking-chamber demonstrate the low-noise performance of the system. The application of this read-out system in other position-sensitive or multi-anode photomultiplier tube applications are also described

  14. VLSI design of an RSA encryption/decryption chip using systolic array based architecture

    Science.gov (United States)

    Sun, Chi-Chia; Lin, Bor-Shing; Jan, Gene Eu; Lin, Jheng-Yi

    2016-09-01

    This article presents the VLSI design of a configurable RSA public key cryptosystem supporting the 512-bit, 1024-bit and 2048-bit based on Montgomery algorithm achieving comparable clock cycles of current relevant works but with smaller die size. We use binary method for the modular exponentiation and adopt Montgomery algorithm for the modular multiplication to simplify computational complexity, which, together with the systolic array concept for electric circuit designs effectively, lower the die size. The main architecture of the chip consists of four functional blocks, namely input/output modules, registers module, arithmetic module and control module. We applied the concept of systolic array to design the RSA encryption/decryption chip by using VHDL hardware language and verified using the TSMC/CIC 0.35 m 1P4 M technology. The die area of the 2048-bit RSA chip without the DFT is 3.9 × 3.9 mm2 (4.58 × 4.58 mm2 with DFT). Its average baud rate can reach 10.84 kbps under a 100 MHz clock.

  15. Readout electronics development for the ATLAS silicon tracker

    International Nuclear Information System (INIS)

    Borer, K.; Beringer, J.; Anghinolfi, F.; Aspell, P.; Chilingarov, A.; Jarron, P.; Heijne, E.H.M.; Santiard, J.C.; Verweij, H.; Goessling, C.; Lisowski, B.; Reichold, A.; Bonino, R.; Clark, A.G.; Kambara, H.; La Marra, D.; Leger, A.; Wu, X.; Richeux, J.P.; Taylor, G.N.; Fedotov, M.; Kuper, E.; Velikzhanin, Yu.; Campbell, D.; Murray, P.; Seller, P.

    1995-01-01

    We present the status of the development of the readout electronics for the large area silicon tracker of the ATLAS experiment at the LHC, carried out by the CERN RD2 project. Our basic readout concept is to integrate a fast amplifier, analog memory, sparse data scan circuit and analog-to-digital convertor (ADC) on a single VLSI chip. This architecture will provide full analog information of charged particle hits associated unambiguously to one LHC beam crossing, which is expected to be at a frequency of 40 MHz. The expected low occupancy of the ATLAS inner silicon detectors allows us to use a low speed (5 MHz) on-chip ADC with a multiplexing scheme. The functionality of the fast amplifier and analog memory have been demonstrated with various prototype chips. Most recently we have successfully tested improved versions of the amplifier and the analog memory. A piecewise linear ADC has been fabricated and performed satisfactorily up to 5 MHz. A new chip including amplifier, analog memory, memory controller, ADC, and data buffer has been designed and submitted for fabrication and will be tested on a prototype of the ATLAS silicon tracker module with realistic electrical and mechanical constraints. (orig.)

  16. Development of n+-in-p planar pixel quadsensor flip-chipped with FE-I4 readout ASICs

    International Nuclear Information System (INIS)

    Unno, Y.; Hanagaki, K.; Hori, R.; Ikegami, Y.; Nakamura, K.; Takubo, Y.; Kamada, S.; Yamamura, K.; Yamamoto, H.; Takashima, R.; Tojo, J.; Kono, T.; Nagai, R.; Saito, S.; Sugibayashi, K.; Hirose, M.; Jinnouchi, O.; Sato, S.; Sawai, H.; Hara, K.

    2017-01-01

    We have developed flip-chip modules applicable to the pixel detector for the HL-LHC. New radiation-tolerant n + -in-p planar pixel sensors of a size of four FE-I4 application-specific integrated circuits (ASICs) are laid out in a 6-in wafer. Variation in readout connection for the pixels at the boundary of ASICs is implemented in the design of quadsensors. Bump bonding technology is developed for four ASICs onto one quadsensor. Both sensors and ASICs are thinned to 150 μm before bump bonding, and are held flat with vacuum chucks. Using lead-free SnAg solder bumps, we encounter deficiency with large areas of disconnected bumps after thermal stress treatment, including irradiation. Surface oxidation of the solder bumps is identified as a critical source of this deficiency after bump bonding trials, using SnAg bumps with solder flux, indium bumps, and SnAg bumps with a newly-introduced hydrogen-reflow process. With hydrogen-reflow, we establish flux-less bump bonding technology with SnAg bumps, appropriate for mass production of the flip-chip modules with thin sensors and thin ASICs.

  17. The PASTA chip. A free-running readout ASIC for silicon strip sensors in PANDA

    Energy Technology Data Exchange (ETDEWEB)

    Goerres, Andre; Stockmanns, Tobias; Ritman, James [Forschungszentrum Juelich GmbH, Juelich (Germany); Rivetti, Angelo [INFN Sezione di Torino, Torino (Italy); Collaboration: PANDA-Collaboration

    2015-07-01

    The PANDA experiment is a multi purpose detector, investigating hadron physics in the charm quark mass regime. It is one of the main experiments at the future FAIR accelerator facility, using anti pp annihilations from a 1.5-15 GeV/c anti-proton beam. Because of the broad physics spectrum and the similarity of event and background signals, PANDA does an event selection based on the complete raw data of the detector. The innermost of PANDA's sub-systems is the Micro Vertex Detector (MVD), consisting of silicon pixel and strip sensors. The latter will be read out by a specialized, free-running readout front-end called PANDA Strip ASIC (PASTA). It has to face a high event rate of up to 40 kHz/ch in an radiation-intense environment. To fulfill the MVD's requirements, it has to give accurate timing information to incoming events (<10 ns) and determine the collected charge with an 8-bit precision. All this has to be done with a very low power design (<4 mW/ch) on a small footprint with less than 21 mm{sup 2} and 60 μm input pitch for 64 channels per chip. Therefore, a simple, time-based readout approach with two independent thresholds is chosen. In this talk, the conceptual design of the full front-end and some aspects of the digital part are presented.

  18. Comparison of three resistor network division circuits for the readout of 4×4 pixel SiPM arrays

    International Nuclear Information System (INIS)

    Stratos, David; Maria, Georgiou; Eleftherios, Fysikopoulos; George, Loudos

    2013-01-01

    The purpose of this study is to investigate the behavior of a flexible SensL's silicon photomultiplier array (SPMArray4) photodetector for possible applications in PET imaging. We have designed and evaluated three different resistor network division circuits to read out the signal outputs of a 4×4 pixel SiPM array. We have applied firstly (i) a symmetric resistive voltage division circuit, secondly (ii) a symmetric resistive charge division circuit and thirdly (iii) a charge division multiplexing resistor network reducing the 16 pixel outputs to 4 position signals. In the first circuit the SensL SPMArray4-A0 preamplification electronics and a SPMArray4-A1 evaluation board providing the 16 pixels voltage outputs were used, before the symmetric resistive voltage network. We reduced the 16 voltage signals firstly to 4X and 4Y coordinate signals. Then those signals were further reduced to 2X and 2Y position signals connected via a resistor network. In the second readout circuit we have used the same technique but without the preamplification stage. The third circuit is based on a discretized positioning circuit, which multiplexes the 16 signals from the SiPM array to 4 position signals. The 4 position signals (Xa, Xb, Yc and Yd) were digitized using a free running sampling technique. An FPGA (Spartan 6 LX16) was used for triggering and signal processing of the pulses. We acquired raw images and energy histograms of a BGO and a CsI:Na pixilated scintillator under 22 Na excitation. A clear visualization of the discrete 2×2×5 mm 3 pixilated BGO scintillator elements as well as the 1×1×5 mm 3 pixilated CsI:Na crystal array was achieved with all applied readout circuits. The symmetric resistive charge division circuit provides higher peak to valley ratio than the other readout circuits. Τhe sensitivity and the energy resolution remained almost constant for the three circuits

  19. Characterisation of capacitively coupled HV/HR-CMOS sensor chips for the CLIC vertex detector

    Science.gov (United States)

    Kremastiotis, I.

    2017-12-01

    The capacitive coupling between an active sensor and a readout ASIC has been considered in the framework of the CLIC vertex detector study. The CLICpix Capacitively Coupled Pixel Detector (C3PD) is a High-Voltage CMOS sensor chip produced in a commercial 180 nm HV-CMOS process for this purpose. The sensor was designed to be connected to the CLICpix2 readout chip. It therefore matches the dimensions of the readout chip, featuring a matrix of 128×128 square pixels with 25μm pitch. The sensor chip has been produced with the standard value for the substrate resistivity (~20 Ωcm) and it has been characterised in standalone testing mode, before receiving and testing capacitively coupled assemblies. The standalone measurement results show a rise time of ~20 ns for a power consumption of 5μW/pixel. Production of the C3PD HV-CMOS sensor chip with higher substrate resistivity wafers (~20, 80, 200 and 1000 Ωcm) is foreseen. The expected benefits of the higher substrate resistivity will be studied using future assemblies with the readout chip.

  20. A new ATLAS muon CSC readout system with system on chip technology on ATCA platform

    Science.gov (United States)

    Claus, R.; ATLAS Collaboration

    2016-07-01

    The ATLAS muon Cathode Strip Chamber (CSC) back-end readout system has been upgraded during the LHC 2013-2015 shutdown to be able to handle the higher Level-1 trigger rate of 100 kHz and the higher occupancy at Run 2 luminosity. The readout design is based on the Reconfiguration Cluster Element (RCE) concept for high bandwidth generic DAQ implemented on the ATCA platform. The RCE design is based on the new System on Chip Xilinx Zynq series with a processor-centric architecture with ARM processor embedded in FPGA fabric and high speed I/O resources together with auxiliary memories to form a versatile DAQ building block that can host applications tapping into both software and firmware resources. The Cluster on Board (COB) ATCA carrier hosts RCE mezzanines and an embedded Fulcrum network switch to form an online DAQ processing cluster. More compact firmware solutions on the Zynq for G-link, S-link and TTC allowed the full system of 320 G-links from the 32 chambers to be processed by 6 COBs in one ATCA shelf through software waveform feature extraction to output 32 S-links. The full system was installed in Sept. 2014. We will present the RCE/COB design concept, the firmware and software processing architecture, and the experience from the intense commissioning towards LHC Run 2.

  1. A new ATLAS muon CSC readout system with system on chip technology on ATCA platform

    International Nuclear Information System (INIS)

    Claus, R.

    2016-01-01

    The ATLAS muon Cathode Strip Chamber (CSC) back-end readout system has been upgraded during the LHC 2013–2015 shutdown to be able to handle the higher Level-1 trigger rate of 100 kHz and the higher occupancy at Run 2 luminosity. The readout design is based on the Reconfiguration Cluster Element (RCE) concept for high bandwidth generic DAQ implemented on the ATCA platform. The RCE design is based on the new System on Chip Xilinx Zynq series with a processor-centric architecture with ARM processor embedded in FPGA fabric and high speed I/O resources together with auxiliary memories to form a versatile DAQ building block that can host applications tapping into both software and firmware resources. The Cluster on Board (COB) ATCA carrier hosts RCE mezzanines and an embedded Fulcrum network switch to form an online DAQ processing cluster. More compact firmware solutions on the Zynq for G-link, S-link and TTC allowed the full system of 320 G-links from the 32 chambers to be processed by 6 COBs in one ATCA shelf through software waveform feature extraction to output 32 S-links. The full system was installed in Sept. 2014. We will present the RCE/COB design concept, the firmware and software processing architecture, and the experience from the intense commissioning towards LHC Run 2.

  2. A new ATLAS muon CSC readout system with system on chip technology on ATCA platform

    Science.gov (United States)

    Bartoldus, R.; Claus, R.; Garelli, N.; Herbst, R. T.; Huffer, M.; Iakovidis, G.; Iordanidou, K.; Kwan, K.; Kocian, M.; Lankford, A. J.; Moschovakos, P.; Nelson, A.; Ntekas, K.; Ruckman, L.; Russell, J.; Schernau, M.; Schlenker, S.; Su, D.; Valderanis, C.; Wittgen, M.; Yildiz, S. C.

    2016-01-01

    The ATLAS muon Cathode Strip Chamber (CSC) backend readout system has been upgraded during the LHC 2013-2015 shutdown to be able to handle the higher Level-1 trigger rate of 100 kHz and the higher occupancy at Run-2 luminosity. The readout design is based on the Reconfigurable Cluster Element (RCE) concept for high bandwidth generic DAQ implemented on the Advanced Telecommunication Computing Architecture (ATCA) platform. The RCE design is based on the new System on Chip XILINX ZYNQ series with a processor-centric architecture with ARM processor embedded in FPGA fabric and high speed I/O resources. Together with auxiliary memories, all these components form a versatile DAQ building block that can host applications tapping into both software and firmware resources. The Cluster on Board (COB) ATCA carrier hosts RCE mezzanines and an embedded Fulcrum network switch to form an online DAQ processing cluster. More compact firmware solutions on the ZYNQ for high speed input and output fiberoptic links and TTC allowed the full system of 320 input links from the 32 chambers to be processed by 6 COBs in one ATCA shelf. The full system was installed in September 2014. We will present the RCE/COB design concept, the firmware and software processing architecture, and the experience from the intense commissioning for LHC Run 2.

  3. A new ATLAS muon CSC readout system with system on chip technology on ATCA platform

    International Nuclear Information System (INIS)

    Bartoldus, R.; Claus, R.; Garelli, N.; Herbst, R.T.; Huffer, M.; Kocian, M.; Ruckman, L.; Russell, J.; Su, D.; Wittgen, M.; Iakovidis, G.; Iordanidou, K.; Moschovakos, P.; Ntekas, K.; Kwan, K.; Lankford, A.J.; Nelson, A.; Schernau, M.; Schlenker, S.; Valderanis, C.

    2016-01-01

    The ATLAS muon Cathode Strip Chamber (CSC) backend readout system has been upgraded during the LHC 2013-2015 shutdown to be able to handle the higher Level-1 trigger rate of 100 kHz and the higher occupancy at Run-2 luminosity. The readout design is based on the Reconfigurable Cluster Element (RCE) concept for high bandwidth generic DAQ implemented on the Advanced Telecommunication Computing Architecture (ATCA) platform. The RCE design is based on the new System on Chip XILINX ZYNQ series with a processor-centric architecture with ARM processor embedded in FPGA fabric and high speed I/O resources. Together with auxiliary memories, all these components form a versatile DAQ building block that can host applications tapping into both software and firmware resources. The Cluster on Board (COB) ATCA carrier hosts RCE mezzanines and an embedded Fulcrum network switch to form an online DAQ processing cluster. More compact firmware solutions on the ZYNQ for high speed input and output fiberoptic links and TTC allowed the full system of 320 input links from the 32 chambers to be processed by 6 COBs in one ATCA shelf. The full system was installed in September 2014. We will present the RCE/COB design concept, the firmware and software processing architecture, and the experience from the intense commissioning for LHC Run 2

  4. A new ATLAS muon CSC readout system with system on chip technology on ATCA platform

    Energy Technology Data Exchange (ETDEWEB)

    Claus, R., E-mail: claus@slac.stanford.edu

    2016-07-11

    The ATLAS muon Cathode Strip Chamber (CSC) back-end readout system has been upgraded during the LHC 2013–2015 shutdown to be able to handle the higher Level-1 trigger rate of 100 kHz and the higher occupancy at Run 2 luminosity. The readout design is based on the Reconfiguration Cluster Element (RCE) concept for high bandwidth generic DAQ implemented on the ATCA platform. The RCE design is based on the new System on Chip Xilinx Zynq series with a processor-centric architecture with ARM processor embedded in FPGA fabric and high speed I/O resources together with auxiliary memories to form a versatile DAQ building block that can host applications tapping into both software and firmware resources. The Cluster on Board (COB) ATCA carrier hosts RCE mezzanines and an embedded Fulcrum network switch to form an online DAQ processing cluster. More compact firmware solutions on the Zynq for G-link, S-link and TTC allowed the full system of 320 G-links from the 32 chambers to be processed by 6 COBs in one ATCA shelf through software waveform feature extraction to output 32 S-links. The full system was installed in Sept. 2014. We will present the RCE/COB design concept, the firmware and software processing architecture, and the experience from the intense commissioning towards LHC Run 2.

  5. Pixel readout chips in deep submicron CMOS for ALICE and LHCb tolerant to 10 Mrad and beyond

    International Nuclear Information System (INIS)

    Snoeys, W.; Burns, M.; Campbell, M.; Cantatore, E.; Cencelli, V.; Dinapoli, R.; Heijne, E.; Jarron, P.; Lamanna, P.; Minervini, D.; Morel, M.; O'Shea, V.; Quiquempoix, V.; Bello, D.S.S.D.San Segundo; Van Koningsveld, B.; Wyllie, K.

    2001-01-01

    The ALICE1LHCB chip is a mixed-mode integrated circuit designed to read out silicon pixel detectors for two different applications: particle tracking in the ALICE Silicon Pixel Detector and particle identification in the LHCb Ring Imaging Cherenkov detector. To satisfy the different needs for these two experiments, the chip can be operated in two different modes. In tracking mode all the 50 μmx425 μm pixel cells in the 256x32 array are read out individually, whilst in particle identification mode they are combined in groups of 8 to form a 32x32 array of 400 μmx425 μm cells. Radiation tolerance was enhanced through special circuit layout. Sensitivity to coupling of digital signals into the analog front end was minimized. System issues such as testability and uniformity further constrained the design. The circuit is currently being manufactured in a commercial 0.25 μm CMOS technology

  6. Low-Light-Level InGaAs focal plane arrays with and without illumination

    Science.gov (United States)

    Macdougal, Michael; Geske, Jon; Wang, Chad; Follman, David

    2010-04-01

    Short wavelength IR imaging using InGaAs-based FPAs is shown. Aerius demonstrates low dark current in InGaAs detector arrays with 15 μm pixel pitch. The same material is mated with a 640x 512 CTIA-based readout integrated circuit. The resulting FPA is capable of imaging photon fluxes with wavelengths between 1 and 1.6 microns at low light levels. The mean dark current density on the FPAs is extremely low at 0.64 nA/cm2 at 10°C. Noise due to the readout can be reduced from 95 to 57 electrons by using off-chip correlated double sampling (CDS). In addition, Aerius has developed laser arrays that provide flat illumination in scenes that are normally light-starved. The illuminators have 40% wall-plug efficiency and provide speckle-free illumination, provide artifact-free imagery versus conventional laser illuminators.

  7. ADVANCED READOUT ELECTRONICS FOR MULTIELEMENT CdZnTe SENSORS

    International Nuclear Information System (INIS)

    DE GERONIMO, G.; O CONNOR, P.; KANDASAMY, A.; GROSHOLZ, J.

    2002-01-01

    A generation of high performance front-end and read-out ASICs customized for highly segmented CdZnTe sensors is presented. The ASICs, developed in a multi-year effort at Brookhaven National Laboratory, are targeted to a wide range of applications including medical, safeguards/security, industrial, research, and spectroscopy. The front-end multichannel ASICs provide high accuracy low noise preamplification and filtering of signals, with versions for small and large area CdZnTe elements. They implement a high order unipolar or bipolar shaper, an innovative low noise continuous reset system with self-adapting capability to the wide range of detector leakage currents, a new system for stabilizing the output baseline and high output driving capability. The general-purpose versions include programmable gain and peaking time. The read-out multichannel ASICs provide fully data driven high accuracy amplitude and time measurements, multiplexing and time domain derandomization of the shaped pulses. They implement a fast arbitration scheme and an array of innovative two-phase offset-free rail-to-rail analog peak detectors for buffering and absorption of input rate fluctuations, thus greatly relaxing the rate requirement on the external ADC. Pulse amplitude, hit timing, pulse risetime, and channel address per processed pulse are available at the output in correspondence of an external readout request. Prototype chips have been fabricated in 0.5 and 0.35 (micro)m CMOS and tested. Design concepts and experimental results are discussed

  8. Test beam results of the first CMS double-sided strip module prototypes using the CBC2 read-out chip

    Energy Technology Data Exchange (ETDEWEB)

    Harb, Ali, E-mail: ali.harb@desy.de; Mussgiller, Andreas; Hauk, Johannes

    2017-02-11

    The CMS Binary Chip (CBC) is a prototype version of the front-end read-out ASIC to be used in the silicon strip modules of the CMS outer tracking detector during the high luminosity phase of the LHC. The CBC is produced in 130 nm CMOS technology and bump-bonded to the hybrid of a double layer silicon strip module, the so-called 2S-p{sub T} module. It has 254 input channels and is designed to provide on-board trigger information to the first level trigger system of CMS, with the capability of cluster-width discrimination and high-p{sub T} track identification. In November 2013 the first 2S-p{sub T} module prototypes equipped with the CBC chips were put to test at the DESY-II test beam facility. Data were collected exploiting a beam of positrons with an energy ranging from 2 to 4 GeV. In this paper the test setup and the results are presented.

  9. MEMS capacitive pressure sensor monolithically integrated with CMOS readout circuit by using post CMOS processes

    Science.gov (United States)

    Jang, Munseon; Yun, Kwang-Seok

    2017-12-01

    In this paper, we presents a MEMS pressure sensor integrated with a readout circuit on a chip for an on-chip signal processing. The capacitive pressure sensor is formed on a CMOS chip by using a post-CMOS MEMS processes. The proposed device consists of a sensing capacitor that is square in shape, a reference capacitor and a readout circuitry based on a switched-capacitor scheme to detect capacitance change at various environmental pressures. The readout circuit was implemented by using a commercial 0.35 μm CMOS process with 2 polysilicon and 4 metal layers. Then, the pressure sensor was formed by wet etching of metal 2 layer through via hole structures. Experimental results show that the MEMS pressure sensor has a sensitivity of 11 mV/100 kPa at the pressure range of 100-400 kPa.

  10. ReseqChip: Automated integration of multiple local context probe data from the MitoChip array in mitochondrial DNA sequence assembly

    Directory of Open Access Journals (Sweden)

    Spang Rainer

    2009-12-01

    Full Text Available Abstract Background The Affymetrix MitoChip v2.0 is an oligonucleotide tiling array for the resequencing of the human mitochondrial (mt genome. For each of 16,569 nucleotide positions of the mt genome it holds two sets of four 25-mer probes each that match the heavy and the light strand of a reference mt genome and vary only at their central position to interrogate all four possible alleles. In addition, the MitoChip v2.0 carries alternative local context probes to account for known mtDNA variants. These probes have been neglected in most studies due to the lack of software for their automated analysis. Results We provide ReseqChip, a free software that automates the process of resequencing mtDNA using multiple local context probes on the MitoChip v2.0. ReseqChip significantly improves base call rate and sequence accuracy. ReseqChip is available at http://code.open-bio.org/svnweb/index.cgi/bioperl/browse/bioperl-live/trunk/Bio/Microarray/Tools/. Conclusions ReseqChip allows for the automated consolidation of base calls from alternative local mt genome context probes. It thereby improves the accuracy of resequencing, while reducing the number of non-called bases.

  11. Microwave Readout Techniques for Very Large Arrays of Nuclear Sensors

    Energy Technology Data Exchange (ETDEWEB)

    Ullom, Joel [Univ. of Colorado, Boulder, CO (United States). Dept. of Physics

    2017-05-17

    During this project, we transformed the use of microwave readout techniques for nuclear sensors from a speculative idea to reality. The core of the project consisted of the development of a set of microwave electronics able to generate and process large numbers of microwave tones. The tones can be used to probe a circuit containing a series of electrical resonances whose frequency locations and widths depend on the state of a network of sensors, with one sensor per resonance. The amplitude and phase of the tones emerging from the circuit are processed by the same electronics and are reduced to the sensor signals after two demodulation steps. This approach allows a large number of sensors to be interrogated using a single pair of coaxial cables. We successfully developed hardware, firmware, and software to complete a scalable implementation of these microwave control electronics and demonstrated their use in two areas. First, we showed that the electronics can be used at room temperature to read out a network of diverse sensor types relevant to safeguards or process monitoring. Second, we showed that the electronics can be used to measure large numbers of ultrasensitive cryogenic sensors such as gamma-ray microcalorimeters. In particular, we demonstrated the undegraded readout of up to 128 channels and established a path to even higher multiplexing factors. These results have transformed the prospects for gamma-ray spectrometers based on cryogenic microcalorimeter arrays by enabling spectrometers whose collecting areas and count rates can be competitive with high purity germanium but with 10x better spectral resolution.

  12. Readout scheme for the Baby-MIND detector

    CERN Document Server

    Noah, Etam; Cadoux, F; Favre, Y; Martinez, B; Nicola, L; Parsa, S; Rayner, M; Antonova, M; Fedotov, S; Izmaylov, A; Kleymenova, A; Khabibullin, M; Khotyantsev, A; Kudenko, Y; Likhacheva, V; Mefodiev, A; Mineev, O; Ovsiannikova, T; Shaykhiev, A; Suvorov, S; Yershov, N; Tsenov, R

    2016-01-01

    A readout scheme has been designed for the plastic scintillator bars of the Baby-MIND detector modules. This spectrometer will measure momentum and identify the charge of 1 GeV/c muons with magnetized iron plates interleaved with detector modules. One challenge the detector aims to address is that of keeping high charge identification efficiencies for momenta below 1 GeV/c where multiple scattering in the iron plates degrades momentum resolution. A front-end board has been developed, with 3 CITIROC readout chips per board and up to 96 channels. Hamamatsu MPPCs type S12571-025C photosensors were chosen for readout of wavelength shifting fibers embedded in plastic scintillators. Procurement of the MPPCs has been carried out to instrument 3000 channels in total. Design choices and first results of this readout scheme are presented.

  13. SPIDR, a general-purpose readout system for pixel ASICs

    International Nuclear Information System (INIS)

    Heijden, B. van der; Visser, J.; Beuzekom, M. van; Boterenbrood, H.; Munneke, B.; Schreuder, F.; Kulis, S.

    2017-01-01

    The SPIDR (Speedy PIxel Detector Readout) system is a flexible general-purpose readout platform that can be easily adapted to test and characterize new and existing detector readout ASICs. It is originally designed for the readout of pixel ASICs from the Medipix/Timepix family, but other types of ASICs or front-end circuits can be read out as well. The SPIDR system consists of an FPGA board with memory and various communication interfaces, FPGA firmware, CPU subsystem and an API library on the PC . The FPGA firmware can be adapted to read out other ASICs by re-using IP blocks. The available IP blocks include a UDP packet builder, 1 and 10 Gigabit Ethernet MAC's and a 'soft core' CPU . Currently the firmware is targeted at the Xilinx VC707 development board and at a custom board called Compact-SPIDR . The firmware can easily be ported to other Xilinx 7 series and ultra scale FPGAs. The gap between an ASIC and the data acquisition back-end is bridged by the SPIDR system. Using the high pin count VITA 57 FPGA Mezzanine Card (FMC) connector only a simple chip carrier PCB is required. A 1 and a 10 Gigabit Ethernet interface handle the connection to the back-end. These can be used simultaneously for high-speed data and configuration over separate channels. In addition to the FMC connector, configurable inputs and outputs are available for synchronization with other detectors. A high resolution (≈ 27 ps bin size) Time to Digital converter is provided for time stamping events in the detector. The SPIDR system is frequently used as readout for the Medipix3 and Timepix3 ASICs. Using the 10 Gigabit Ethernet interface it is possible to read out a single chip at full bandwidth or up to 12 chips at a reduced rate. Another recent application is the test-bed for the VeloPix ASIC, which is developed for the Vertex Detector of the LHCb experiment. In this case the SPIDR system processes the 20 Gbps scrambled data stream from the VeloPix and distributes it over four

  14. Implementation of the Timepix ASIC in the Scalable Readout System

    Energy Technology Data Exchange (ETDEWEB)

    Lupberger, M., E-mail: lupberger@physik.uni-bonn.de; Desch, K.; Kaminski, J.

    2016-09-11

    We report on the development of electronics hardware, FPGA firmware and software to provide a flexible multi-chip readout of the Timepix ASIC within the framework of the Scalable Readout System (SRS). The system features FPGA-based zero-suppression and the possibility to read out up to 4×8 chips with a single Front End Concentrator (FEC). By operating several FECs in parallel, in principle an arbitrary number of chips can be read out, exploiting the scaling features of SRS. Specifically, we tested the system with a setup consisting of 160 Timepix ASICs, operated as GridPix devices in a large TPC field cage in a 1 T magnetic field at a DESY test beam facility providing an electron beam of up to 6 GeV. We discuss the design choices, the dedicated hardware components, the FPGA firmware as well as the performance of the system in the test beam.

  15. Development of a Crosstalk Suppression Algorithm for KID Readout

    Science.gov (United States)

    Lee, Kyungmin; Ishitsuka, H.; Oguri, S.; Suzuki, J.; Tajima, O.; Tomita, N.; Won, Eunil; Yoshida, M.

    2018-06-01

    The GroundBIRD telescope aims to detect B-mode polarization of the cosmic microwave background radiation using the kinetic inductance detector array as a polarimeter. For the readout of the signal from detector array, we have developed a frequency division multiplexing readout system based on a digital down converter method. These techniques in general have the leakage problems caused by the crosstalks. The window function was applied in the field programmable gate arrays to mitigate the effect of these problems and tested it in algorithm level.

  16. Single-Readout High-Density Memristor Crossbar

    KAUST Repository

    Zidan, M. A.

    2016-01-07

    High-density memristor-crossbar architecture is a very promising technology for future computing systems. The simplicity of the gateless-crossbar structure is both its principal advantage and the source of undesired sneak-paths of current. This parasitic current could consume an enormous amount of energy and ruin the readout process. We introduce new adaptive-threshold readout techniques that utilize the locality and hierarchy properties of the computer-memory system to address the sneak-paths problem. The proposed methods require a single memory access per pixel for an array readout. Besides, the memristive crossbar consumes an order of magnitude less power than state-of-the-art readout techniques.

  17. Single-Readout High-Density Memristor Crossbar

    KAUST Repository

    Zidan, M. A.; Omran, Hesham; Naous, Rawan; Salem, Ahmed Sultan; Fahmy, H. A. H.; Lu, W. D.; Salama, Khaled N.

    2016-01-01

    High-density memristor-crossbar architecture is a very promising technology for future computing systems. The simplicity of the gateless-crossbar structure is both its principal advantage and the source of undesired sneak-paths of current. This parasitic current could consume an enormous amount of energy and ruin the readout process. We introduce new adaptive-threshold readout techniques that utilize the locality and hierarchy properties of the computer-memory system to address the sneak-paths problem. The proposed methods require a single memory access per pixel for an array readout. Besides, the memristive crossbar consumes an order of magnitude less power than state-of-the-art readout techniques.

  18. Enabling Large Focal Plane Arrays Through Mosaic Hybridization

    Science.gov (United States)

    Miller, Timothy M.; Jhabvala, Christine A.; Leong, Edward; Costen, Nicholas P.; Sharp, Elmer; Adachi, Tomoko; Benford, Dominic J.

    2012-01-01

    We have demonstrated advances in mosaic hybridization that will enable very large format far-infrared detectors. Specifically we have produced electrical detector models via mosaic hybridization yielding superconducting circuit paths by hybridizing separately fabricated sub-units onto a single detector unit. The detector model was made on a 100mm diameter wafer while four model readout quadrant chips were made from a separate 100mm wafer. The individually fabricated parts were hybridized using a flip-chip bonder to assemble the detector-readout stack. Once all of the hybridized readouts were in place, a single, large and thick silicon substrate was placed on the stack and attached with permanent epoxy to provide strength and a Coefficient of Thermal Expansion match to the silicon components underneath. Wirebond pads on the readout chips connect circuits to warm readout electronics; and were used to validate the successful superconducting electrical interconnection of the model mosaic-hybrid detector. This demonstration is directly scalable to 150 mm diameter wafers, enabling pixel areas over ten times the area currently available.

  19. The AMS silicon tracker readout, performance results with minimum ionizing particles

    CERN Document Server

    Alpat, B; Battiston, R; Bourquin, Maurice; Burger, W J; Extermann, Pierre; Chang, Y H; Hou, S R; Pauluzzi, M; Produit, N; Qiu, S; Rapin, D; Ribordy, R; Toker, O; Wu, S X

    2000-01-01

    First results for the AMS silicon tracker readout performance are presented. Small 20.0*20.0*0.300 mm/sup 3/ silicon microstrip detectors were installed in a 50 GeV electron beam at CERN. The detector readout consisted of prototypes of the tracker data reduction card equipped with a 12-bit ADC and the tracker frontend hybrid with VA_hdr readout chips. The system performance is assessed in terms of signal-to-noise, position resolution, and efficiency. (13 refs).

  20. On-chip nanofluidic integration of acoustic sensors towards high Q in liquid

    Science.gov (United States)

    Liang, Ji; Liu, Zifeng; Zhang, Hongxiang; Liu, Bohua; Zhang, Menglun; Zhang, Hao; Pang, Wei

    2017-11-01

    This paper reports an on-chip acoustic sensor comprising a piston-mode film bulk acoustic resonator and a monolithically integrated nanochannel. The resonator with the channel exhibits a resonance frequency (f) of 2.5 GHz and a quality (Q) factor of 436 in deionized water. The f × Q product is as high as 1.1 × 1012, which is the highest among all the acoustic wave sensors in the liquid phase. The sensor consumes 2 pl liquid volume and thus greatly saves the precious assays in biomedical testing. The Q factor is investigated, and real-time viscosity tests of glucose solution are demonstrated. The highly miniaturized and integrated sensor is capable to be arrayed with readout-circuitry, which opens an avenue for portable applications and lab-on-chip systems.

  1. Performance measurements of hybrid PIN diode arrays

    International Nuclear Information System (INIS)

    Jernigan, J.G.; Arens, J.F.; Collins, T.; Herring, J.; Shapiro, S.L.; Wilburn, C.D.

    1990-05-01

    We report on the successful effort to develop hybrid PIN diode arrays and to demonstrate their potential as components of vertex detectors. Hybrid pixel arrays have been fabricated by the Hughes Aircraft Co. by bump bonding readout chips developed by Hughes to an array of PIN diodes manufactured by Micron Semiconductor Inc. These hybrid pixel arrays were constructed in two configurations. One array format having 10 x 64 pixels, each 120 μm square, and the other format having 256 x 256 pixels, each 30 μm square. In both cases, the thickness of the PIN diode layer is 300 μm. Measurements of detector performance show that excellent position resolution can be achieved by interpolation. By determining the centroid of the charge cloud which spreads charge into a number of neighboring pixels, a spatial resolution of a few microns has been attained. The noise has been measured to be about 300 electrons (rms) at room temperature, as expected from KTC and dark current considerations, yielding a signal-to-noise ratio of about 100 for minimum ionizing particles. 4 refs., 13 figs

  2. A micromachined surface stress sensor with electronic readout

    NARCIS (Netherlands)

    Carlen, Edwin; Weinberg, M.S.; Zapata, A.M.; Borenstein, J.T.

    2008-01-01

    A micromachined surface stress sensor has been fabricated and integrated off chip with a low-noise, differential capacitance, electronic readout circuit. The differential capacitance signal is modulated with a high frequency carrier signal, and the output signal is synchronously demodulated and

  3. Design and implementation of Gm-APD array readout integrated circuit for infrared 3D imaging

    Science.gov (United States)

    Zheng, Li-xia; Yang, Jun-hao; Liu, Zhao; Dong, Huai-peng; Wu, Jin; Sun, Wei-feng

    2013-09-01

    A single-photon detecting array of readout integrated circuit (ROIC) capable of infrared 3D imaging by photon detection and time-of-flight measurement is presented in this paper. The InGaAs avalanche photon diodes (APD) dynamic biased under Geiger operation mode by gate controlled active quenching circuit (AQC) are used here. The time-of-flight is accurately measured by a high accurate time-to-digital converter (TDC) integrated in the ROIC. For 3D imaging, frame rate controlling technique is utilized to the pixel's detection, so that the APD related to each pixel should be controlled by individual AQC to sense and quench the avalanche current, providing a digital CMOS-compatible voltage pulse. After each first sense, the detector is reset to wait for next frame operation. We employ counters of a two-segmental coarse-fine architecture, where the coarse conversion is achieved by a 10-bit pseudo-random linear feedback shift register (LFSR) in each pixel and a 3-bit fine conversion is realized by a ring delay line shared by all pixels. The reference clock driving the LFSR counter can be generated within the ring delay line Oscillator or provided by an external clock source. The circuit is designed and implemented by CSMC 0.5μm standard CMOS technology and the total chip area is around 2mm×2mm for 8×8 format ROIC with 150μm pixel pitch. The simulation results indicate that the relative time resolution of the proposed ROIC can achieve less than 1ns, and the preliminary test results show that the circuit function is correct.

  4. Characterization of the CBC2 readout ASIC for the CMS strip-tracker high-luminosity upgrade

    International Nuclear Information System (INIS)

    Braga, D; Hall, G; Pesaresi, M; Raymond, M; Jones, L; Murray, P; Prydderch, M

    2014-01-01

    The CMS Binary Chip 2 (CBC2) is a full-scale prototype ASIC developed for the front-end readout of the high-luminosity upgrade of the CMS silicon strip tracker. The 254-channel, 130 nm CMOS ASIC is designed for the binary readout of double-layer modules, and features cluster-width discrimination and coincidence logic for detecting high-P T track candidates. The chip was delivered in January 2013 and has since been bump-bonded to a dual-chip hybrid and extensively tested. The CBC2 is fully functional and working to specification: we present the result of electrical characterization of the chip, including gain, noise, threshold scan and power consumption, together with the performance of the stub finding logic. Finally we will outline the plan for future developments towards the production version

  5. Morphologies and optical and electrical properties of InGaN/GaN micro-square array light-emitting diode chips.

    Science.gov (United States)

    Han, Dan; Ma, Shufang; Jia, Zhigang; Liu, Peizhi; Jia, Wei; Shang, Lin; Zhai, Guangmei; Xu, Bingshe

    2018-04-10

    InGaN/GaN micro-square array light-emitting diode (LED) chips (micro-chips) have been prepared via the focused ion beam (FIB) etching technique, which can not only reduce ohmic contact degradation but also control the aspect ratio precisely in three-dimensional (3D) structure LED (3D-LED) device fabrication. The effects of FIB beam current and micro-square array depth on morphologies and optical and electrical properties of the micro-chips have been studied. Our results show that sidewall surface morphology and optical and electrical properties of the micro-chips degrade with increased beam current. After potassium hydroxide etching with different times, an optimal current-voltage and luminescence performance can be obtained. Combining the results of cathodoluminescence mappings and light output-current characteristics, the light extraction efficiency of the micro-chips is reduced as FIB etch depth increases. The mechanisms of micro-square depth on light extraction have been revealed by 3D finite difference time domain.

  6. Pixel detector readout electronics with two-level discriminator scheme

    International Nuclear Information System (INIS)

    Pengg, F.

    1998-01-01

    In preparation for a silicon pixel detector with more than 3,000 readout channels per chip for operation at the future large hadron collider (LHC) at CERN the analog front end of the readout electronics has been designed and measured on several test-arrays with 16 by 4 cells. They are implemented in the HP 0.8 microm process but compatible with the design rules of the radiation hard Honeywell 0.8 microm bulk process. Each cell contains bump bonding pad, preamplifier, discriminator and control logic for masking and testing within a layout area of only 50 microm by 140 microm. A new two-level discriminator scheme has been implemented to cope with the problems of time-walk and interpixel cross-coupling. The measured gain of the preamplifier is 900 mV for a minimum ionizing particle (MIP, about 24,000 e - for a 300 microm thick Si-detector) with a return to baseline within 750 ns for a 1 MIP input signal. The full readout chain (without detector) shows an equivalent noise charge to 60e - r.m.s. The time-walk, a function of the separation between the two threshold levels, is measured to be 22 ns at a separation of 1,500 e - , which is adequate for the 40 MHz beam-crossing frequency at the LHC. The interpixel cross-coupling, measured with a 40fF coupling capacitance, is less than 3%. A single cell consumes 35 microW at 3.5 V supply voltage

  7. Development of pixel readout integrated circuits for extreme rate and radiation

    CERN Multimedia

    Liberali, V; Rizzi, A; Re, V; Minuti, M; Pangaud, P; Barbero, M B; Pacher, L; Kluit, R; Hinchliffe, I; Manghisoni, M; Giubilato, P; Faccio, F; Pernegger, H; Krueger, H; Gensolen, F D; Bilei, G M; Da rocha rolo, M D; Prydderch, M L; Fanucci, L; Grillo, A A; Bellazzini, R; Palomo pinto, F R; Michelis, S; Huegging, F G; Kishishita, T; Marchiori, G; Christian, D C; Kaestli, H C; Meier, B; Andreazza, A; Key-charriere, M; Linssen, L; Dannheim, D; Conti, E; Hemperek, T; Menouni, M; Fougeron, D; Genat, J; Bomben, M; Marzocca, C; Demaria, N; Mazza, G; Van bakel, N A; Palla, F; Grippo, M T; Magazzu, G; Ratti, L; Abbaneo, D; Crescioli, F; Deptuch, G W; Neue, G; De robertis, G; Passeri, D; Placidi, P; Gromov, V; Morsani, F; Paccagnella, A; Christiansen, J; Dho, E; Wermes, N; Rymaszewski, P; Rozanov, A; Wang, A; Lipton, R J; Havranek, M; Neviani, A; Marconi, S; Karagounis, M; Godiot, S; Calderini, G; Seidel, S C; Horisberger, R P; Garcia-sciveres, M A; Stabile, A; Beccherle, R; Bacchetta, N

    The present hybrid pixel detectors in operation at the LHC represent a major achievement. They deployed a new technology on an unprecedented scale and their success firmly established pixel tracking as indispensable for future HEP experiments. However, extrapolation of hybrid pixel technology to the HL-LHC presents major challenges on several fronts. We propose a new RD collaboration specifically focused on the development of pixel readout Integrated Circuits (IC). The IC challenges include: smaller pixels to resolve tracks in boosted jets, much higher hit rates (1-2 GHz/cm$^{2}$), unprecedented radiation tolerance (10 MGy), much higher output bandwidth, and large IC format with low power consumption in order to instrument large areas while keeping the material budget low. We propose a collaboration to design the next generation of hybrid pixel readout chips to enable the ATLAS and CMS Phase 2 pixel upgrades. This does not imply that ATLAS and CMS must use the same exact pixel readout chip, as most of the dev...

  8. An Improved Zero Potential Circuit for Readout of a Two-Dimensional Resistive Sensor Array.

    Science.gov (United States)

    Wu, Jian-Feng; Wang, Feng; Wang, Qi; Li, Jian-Qing; Song, Ai-Guo

    2016-12-06

    With one operational amplifier (op-amp) in negative feedback, the traditional zero potential circuit could access one element in the two-dimensional (2-D) resistive sensor array with the shared row-column fashion but it suffered from the crosstalk problem for the non-scanned elements' bypass currents, which were injected into array's non-scanned electrodes from zero potential. Firstly, for suppressing the crosstalk problem, we designed a novel improved zero potential circuit with one more op-amp in negative feedback to sample the total bypass current and calculate the precision resistance of the element being tested (EBT) with it. The improved setting non-scanned-electrode zero potential circuit (S-NSE-ZPC) was given as an example for analyzing and verifying the performance of the improved zero potential circuit. Secondly, in the S-NSE-ZPC and the improved S-NSE-ZPC, the effects of different parameters of the resistive sensor arrays and their readout circuits on the EBT's measurement accuracy were simulated with the NI Multisim 12. Thirdly, part features of the improved circuit were verified with the experiments of a prototype circuit. Followed, the results were discussed and the conclusions were given. The experiment results show that the improved circuit, though it requires one more op-amp, one more resistor and one more sampling channel, can access the EBT in the 2-D resistive sensor array more accurately.

  9. The universal read-out controller for CBM at FAIR

    Energy Technology Data Exchange (ETDEWEB)

    Manz, Sebastian; Abel, Norbert; Gebelein, Jano [Kirchhoff-Institut fuer Physik, Heidelberg (Germany); Collaboration: CBM-Collaboration

    2011-07-01

    Since 2007 we design and develop the firmware for the read-out controller (ROC) for data acquisition of the CBM detector at FAIR. While our first implementation solely focused on the nXYTER chip, today we are also designing and implementing readout logic for the GET4 chip which is supposed to be part of the time of flight (TOF) detector. Furthermore, we fully support both Ethernet and Optical transport as two transparent solutions. This addresses the different requirements of a laboratory setup and the final detector setup respectively. The usage of a strict modularization of the Read Out Controller firmware enables us to provide an Universal ROC where front-end specific logic and transport logic can be combined in a very flexible way. Fault tolerance techniques are only required for some of those modules and hence are only implemented there.

  10. Application of the DRS chip for fast waveform digitizing

    Energy Technology Data Exchange (ETDEWEB)

    Ritt, Stefan, E-mail: stefan.ritt@psi.c [PSI, CH-5232 Villigen (Switzerland); Dinapoli, Roberto; Hartmann, Ueli [PSI, CH-5232 Villigen (Switzerland)

    2010-11-01

    The high demands of modern experiments in fast waveform digitizing led to the development of a whole family of switched capacitor arrays (SCA), called the Domino Ring Sampler (DRS). The most recent version, DRS4, is produced in a radiation hard 0.25 {mu}m CMOS process, and is capable of digitizing 9 differential input channels at sampling rates of up to 6 Giga-samples per second (GSPS) with an analogue bandwidth of 950 MHz (-3 dB). The channel depth can be configured between 1024 and 8192 cells, and the signal-to-noise ratio allows a resolution equivalent to more than 11 bits. Using an interleaved sampling technique, sampling rates up to 48 GSPS are possible. Compared with the previous versions, the DRS4 chip contains several improvements such as an on-chip PLL for sampling-frequency stabilization and various mechanisms to reduce the read out dead-time. The high bandwidth, low power consumption and short readout time make this chip attractive for many experiments, replacing traditional ADCs and TDCs. This includes time-of-flight detectors, cosmic gamma ray observatories, PET scanners and industrial applications.

  11. Development of a small-scale protope of the GOSSIPO-2 chip in 0.13 um CMOS technology

    CERN Document Server

    Kluit, R; Gromov, V

    2007-01-01

    The GOSSIP (Gas On Slimmed Silicon Pixel) detector is a proposed alternative for silicon based pixel detectors. The Gossip Prototype (GOSSIPO) chip is being developed to serve as a prototype read-out chip for such a gas-filled detector. Thanks to the very low capacitance at the preamplifier input, the front-end of the chip demonstrates low-noise performance in combination with a fast peaking time and low analog power dissipation. Measurement of the drift time of every primary electron in the gas volume enables 3D reconstruction of the particle tracks. For this purpose a Time-to- Digital converter must be placed in each pixel. A small-scale prototype of the GOSSIP chip has been developed in the 0.13 μm CMOS technology. The prototype includes a 16 by 16 pixel array where each pixel is equipped with a front-end circuit, threshold DAC, and a 4-bit TDC. The chip is available for testing in May 2007 and after initial tests it will be postprocessed to build a prototype detector. This paper describes the detector de...

  12. Preliminary Assessment of Microwave Readout Multiplexing Factor

    Energy Technology Data Exchange (ETDEWEB)

    Croce, Mark Philip [Los Alamos National Lab. (LANL), Los Alamos, NM (United States); Koehler, Katrina Elizabeth [Los Alamos National Lab. (LANL), Los Alamos, NM (United States); Rabin, Michael W. [Los Alamos National Lab. (LANL), Los Alamos, NM (United States); Bennett, D. A. [National Inst. of Standards and Technology (NIST), Boulder, CO (United States); Mates, J. A. B. [National Inst. of Standards and Technology (NIST), Boulder, CO (United States); Gard, J. D. [National Inst. of Standards and Technology (NIST), Boulder, CO (United States); Becker, D. [National Inst. of Standards and Technology (NIST), Boulder, CO (United States); Schmidt, D. R. [National Inst. of Standards and Technology (NIST), Boulder, CO (United States); Ullom, J. N. [National Inst. of Standards and Technology (NIST), Boulder, CO (United States)

    2017-01-23

    Ultra-high resolution microcalorimeter gamma spectroscopy is a new non-destructive assay technology for measurement of plutonium isotopic composition, with the potential to reduce total measurement uncertainty to a level competitive with destructive analysis methods [1-4]. Achieving this level of performance in practical applications requires not only the energy resolution now routinely achieved with transition-edge sensor microcalorimeter arrays (an order of magnitude better than for germanium detectors) but also high throughput. Microcalorimeter gamma spectrometers have not yet achieved detection efficiency and count rate capability that is comparable to germanium detectors, largely because of limits from existing readout technology. Microcalorimeter detectors must be operated at low temperature to achieve their exceptional energy resolution. Although the typical 100 mK operating temperatures can be achieved with reliable, cryogen-free systems, the cryogenic complexity and heat load from individual readout channels for large sensor arrays is prohibitive. Multiplexing is required for practical systems. The most mature multiplexing technology at present is time-division multiplexing (TDM) [3, 5-6]. In TDM, the sensor outputs are switched by applying bias current to one SQUID amplifier at a time. Transition-edge sensor (TES) microcalorimeter arrays as large as 256 pixels have been developed for X-ray and gamma-ray spectroscopy using TDM technology. Due to bandwidth limits and noise scaling, TDM is limited to a maximum multiplexing factor of approximately 32-40 sensors on one readout line [8]. Increasing the size of microcalorimeter arrays above the kilopixel scale, required to match the throughput of germanium detectors, requires the development of a new readout technology with a much higher multiplexing factor.

  13. A TDC integrated circuit for drift chamber readout

    International Nuclear Information System (INIS)

    Passaseo, M.; Petrolo, E.; Veneziano, S.

    1995-01-01

    A custom integrated circuit for the measurement of the signal drift-time coming from the KLOE chamber developed by INFN Sezione di Roma is presented. The circuit is a multichannel common start/stop TDC, with 32 channels per chip. The TDC integrated circuit will be developed as a full-custom device in 0.5 μm CMOS technology, with 1 ns LSB realized using a Gray counter working at the frequency of 1 GHz. The circuit is capable of detecting rising/falling edges, with a double edge resolution of 8 ns; the hits are recorded as 16 bit words, hits older than a programmable time window are discarded, if not confirmed by a stop signal. The chip has four event-buffers, which are used only if at least one hit is present in one of the 32 channels. The readout of the data passes through the I/O port at a speed of 33 MHz; empty channels are automatically skipped during the readout phase. (orig.)

  14. A TDC integrated circuit for drift chamber readout

    Energy Technology Data Exchange (ETDEWEB)

    Passaseo, M. [Istituto Nazionale di Fisica Nucleare, Rome (Italy); Petrolo, E. [Istituto Nazionale di Fisica Nucleare, Rome (Italy); Veneziano, S. [Istituto Nazionale di Fisica Nucleare, Rome (Italy)

    1995-12-11

    A custom integrated circuit for the measurement of the signal drift-time coming from the KLOE chamber developed by INFN Sezione di Roma is presented. The circuit is a multichannel common start/stop TDC, with 32 channels per chip. The TDC integrated circuit will be developed as a full-custom device in 0.5 {mu}m CMOS technology, with 1 ns LSB realized using a Gray counter working at the frequency of 1 GHz. The circuit is capable of detecting rising/falling edges, with a double edge resolution of 8 ns; the hits are recorded as 16 bit words, hits older than a programmable time window are discarded, if not confirmed by a stop signal. The chip has four event-buffers, which are used only if at least one hit is present in one of the 32 channels. The readout of the data passes through the I/O port at a speed of 33 MHz; empty channels are automatically skipped during the readout phase. (orig.).

  15. High-speed readout of high-Z pixel detectors with the LAMBDA detector

    International Nuclear Information System (INIS)

    Pennicard, D.; Smoljanin, S.; Sheviakov, I.; Xia, Q.; Rothkirch, A.; Yu, Y.; Struth, B.; Hirsemann, H.; Graafsma, H.

    2014-01-01

    High-frame-rate X-ray pixel detectors make it possible to perform time-resolved experiments at synchrotron beamlines, and to make better use of these sources by shortening experiment times. LAMBDA is a photon-counting hybrid pixel detector based on the Medipix3 chip, designed to combine a small pixel size of 55 μm, a large tileable module design, high speed, and compatibility with ''high-Z'' sensors for hard X-ray detection. This technical paper focuses on LAMBDA's high-speed-readout functionality, which allows a frame rate of 2000 frames per second with no deadtime between successive images. This takes advantage of the Medipix3 chip's ''continuous read-write'' function and highly parallelised readout. The readout electronics serialise this data and send it back to a server PC over two 10 Gigabit Ethernet links. The server PC controls the detector and receives, processes and stores the data using software designed for the Tango control system. As a demonstration of high-speed readout of a high-Z sensor, a GaAs LAMBDA detector was used to make a high-speed X-ray video of a computer fan

  16. RD Collaboration Proposal: Development of pixel readout integrated circuits for extreme rate and radiation

    CERN Document Server

    Chistiansen, J (CERN)

    2013-01-01

    This proposal describes a new RD collaboration to develop the next genrration of hybrid pixel readout chips for use in ATLAS and CMS PHase 2 upgrades. extrapolation of hybrid pixel technology to the HL-LHC presents major challenges on several fronts. Challenges include: smaller pixels to resolve tracks in boosted jets, much higher hit rates (1-2 GHz/cm2 ), unprecedented radiation tolerance (10 MGy), much higher output bandwidth, and large IC format with low power consumption in order to instrument large areas while keeping the material budget low. This collaboration is specifically focused on design of hybrid pixel readout chips, and not on more general chip design or on other aspects of hybrid pixel technology. Participants include 7 institutes on ATLAS and 7 on CMS, plus 2 on both experiments.

  17. High-Performance Wireless via the Merger of CI Chip-Shaped DS-CDMA and Oscillating-Beam Smart Antenna Arrays

    Directory of Open Access Journals (Sweden)

    Nassar Carl R

    2004-01-01

    Full Text Available We introduce a novel merger of direct sequence code division multiple access (DS-CDMA and smart antenna arrays. With regard to the DS-CDMA scheme, we employ carrier interferometry DS-CDMA (CI/DS-CDMA, a novel implementation of DS-CDMA where chips are decomposable into narrowband frequency components. With regard to the antenna array, we deploy the oscillating-beam smart array. Here, applying proper time-varying phases to the array elements, we create small movement (oscillation in the antenna array's pattern, while steering the antenna pattern main lobe to the position of the intended user. The oscillating antenna pattern creates a time-varying channel with a controllable coherence time. This, in turn, provides transmit diversity in the form of a time diversity gain at the mobile receiver side. At the receiver, three stages of combining are available: combining time components of the received signal within symbol duration (each experiencing a different fade to enhance performance via time diversity; combining frequency components which make up the CI/DS-CDMA chip to enhance the performance via frequency diversity; and combining across chips to eliminate the interfering users on the system. Merging CI/DS-CDMA with the oscillating-beam smart antenna at the base station, we achieve very high capacity via the merger of SDMA (available through directionality of the antenna array and code division multiple access (inherent in CI/DS-CDMA, and very high performance via the construction of receivers that exploit both transmit diversity and frequency diversity. We present the performance gains of the proposed merger.

  18. Far infrared through millimeter backshort-under-grid arrays

    Science.gov (United States)

    Allen, Christine A.; Abrahams, John; Benford, Dominic J.; Chervenak, James A.; Chuss, David T.; Staguhn, Johannes G.; Miller, Timothy M.; Moseley, S. Harvey; Wollack, Edward J.

    2006-06-01

    We are developing a large-format, versatile, bolometer array for a wide range of infrared through millimeter astronomical applications. The array design consists of three key components - superconducting transition edge sensor bolometer arrays, quarter-wave reflective backshort grids, and Superconducting Quantum Interference Device (SQUID) multiplexer readouts. The detector array is a filled, square grid of bolometers with superconducting sensors. The backshort arrays are fabricated separately and are positioned in the etch cavities behind the detector grid. The grids have unique three-dimensional interlocking features micromachined into the walls for positioning and mechanical stability. The ultimate goal of the program is to produce large-format arrays with background-limited sensitivity, suitable for a wide range of wavelengths and applications. Large-format (kilopixel) arrays will be directly indium bump bonded to a SQUID multiplexer circuit. We have produced and tested 8×8 arrays of 1 mm detectors to demonstrate proof of concept. 8×16 arrays of 2 mm detectors are being produced for a new Goddard Space Flight Center instrument. We have also produced models of a kilopixel detector grid and dummy multiplexer chip for bump bonding development. We present detector design overview, several unique fabrication highlights, and assembly technologies.

  19. Simulations of busy probabilities in the ALPIDE chip and the upgraded ALICE ITS detector

    CERN Document Server

    Nesbo, Simon Voigt; Bonora, Matthias; Giubilato, Piero; Helstrup, Haavard; Hristozkov, Svetlomir; Aglieri Rinella, Gianluca; Röhrich, Dieter; Schambach, Joachim; Shahoyan, Ruben; Ullaland, Kjetil

    2017-01-01

    For the Long Shutdown 2 (LS2) upgrade of the ITS detector in the ALICE experiment at the LHC, a novel pixel detector chip, the ALPIDE chip, has been developed. In the event of busy ALPIDE chips in the ITS detector, the readout electronics may need to take appropriate action to minimize loss of data. This paper presents a lightweight, statistical simulation model for the ALPIDE chip and the up- graded ITS detector, developed using the SystemC framework. The purpose of the model is to quantify the probability of a busy condition and the data taking efficiency of the ALPIDE chips under various conditions, and to apply this knowledge during the development of the readout electronics and firmware.

  20. Leakage analysis of crossbar memristor arrays

    KAUST Repository

    Zidan, Mohammed A.; Salem, Ahmed Sultan; Fahmy, Hossam Aly Hassan; Salama, Khaled N.

    2014-01-01

    the readout operation. In this work we study the trade-off between the crossbar array density and the power consumption required for its readout. Our analysis is based on simulating full memristor arrays on a SPICE platform.

  1. Investigation of image distortion due to MCP electronic readout misalignment and correction via customized GUI application

    Science.gov (United States)

    Vitucci, G.; Minniti, T.; Tremsin, A. S.; Kockelmann, W.; Gorini, G.

    2018-04-01

    The MCP-based neutron counting detector is a novel device that allows high spatial resolution and time-resolved neutron radiography and tomography with epithermal, thermal and cold neutrons. Time resolution is possible by the high readout speeds of ~ 1200 frames/sec, allowing high resolution event counting with relatively high rates without spatial resolution degradation due to event overlaps. The electronic readout is based on a Timepix sensor, a CMOS pixel readout chip developed at CERN. Currently, a geometry of a quad Timepix detector is used with an active format of 28 × 28 mm2 limited by the size of the Timepix quad (2 × 2 chips) readout. Measurements of a set of high-precision micrometers test samples have been performed at the Imaging and Materials Science & Engineering (IMAT) beamline operating at the ISIS spallation neutron source (U.K.). The aim of these experiments was the full characterization of the chip misalignment and of the gaps between each pad in the quad Timepix sensor. Such misalignment causes distortions of the recorded shape of the sample analyzed. We present in this work a post-processing image procedure that considers and corrects these effects. Results of the correction will be discussed and the efficacy of this method evaluated.

  2. Development of pixel readout integrated circuits for extreme rate and radiation

    CERN Document Server

    Garcia-Sciveres, M; CERN. Geneva. The LHC experiments Committee; LHCC

    2013-01-01

    Letter of Intent for RD Collaboration Proposal focused on development of a next generation pixel readout integrated circuits needed for high luminosity LHC detector upgrades. Brings together ATLAS and CMS pixel chip design communities.

  3. Development of the quality control system of the readout electronics for the large size telescope of the Cherenkov Telescope Array observatory

    Energy Technology Data Exchange (ETDEWEB)

    Konno, Y.; Kubo, H.; Masuda, S. [Department of Physics, Graduate School of Science, Kyoto University, Kyoto (Japan); Paoletti, R.; Poulios, S. [SFTA Department, Physics Section, University of Siena and INFN, Siena (Italy); Rugliancich, A., E-mail: andrea.rugliancich@pi.infn.it [SFTA Department, Physics Section, University of Siena and INFN, Siena (Italy); Saito, T. [Department of Physics, Graduate School of Science, Kyoto University, Kyoto (Japan)

    2016-07-11

    The Cherenkov Telescope Array (CTA) is the next generation VHE γ-ray observatory which will improve the currently available sensitivity by a factor of 10 in the range 100 GeV to 10 TeV. The array consists of different types of telescopes, called large size telescope (LST), medium size telescope (MST) and small size telescope (SST). A LST prototype is currently being built and will be installed at the Observatorio Roque de los Muchachos, island of La Palma, Canary islands, Spain. The readout system for the LST prototype has been designed and around 300 readout boards will be produced in the coming months. In this note we describe an automated quality control system able to measure basic performance parameters and quickly identify faulty boards. - Highlights: • The Dragon Board is part of the DAQ of the LST Cherenkov telescope prototype. • We developed an automated quality control system for the Dragon Board. • We check pedestal, linearity, pulse shape and crosstalk values. • The quality control test can be performed on the production line.

  4. First considerations for a readout system for the ILD TPC with the Timepix3

    Energy Technology Data Exchange (ETDEWEB)

    Schiffer, Tobias [Universitaet Bonn (Germany); Collaboration: LCTPC-Deutschland-Collaboration

    2016-07-01

    For the planned International Linear Collider (ILC) two detectors are proposed. One of them, the International Large Detector (ILD) uses a Time Projektion Chamber (TPC) as the main tracking device. As a readout system for this TPC, pixel chips are one of the considered options. An integrated Micromegas stage is foreseen as gas amplification stage, which is built directly on top of the chip. Since first tests of a Pixel-TPC with 160 Timepix ASICs showed promising results, one is interested in developing a detector using the Timepix3 ASIC. It has several advantages, first of all its feature to measure ToT and a ToA at the same time and its significantly increased readout rate. For this purpose a readout system needs to be developed which fulfils the requirements of the Timpix3 ASIC and also has a high scalability. The main challenges are the high speed readout with a clock of up to 640 MHz and the reliability of the system. Also, the data driven as well as the frame-based readout of the Timepix3 needs to be considered for the implementation. The main goal is to provide a fast and parallel readout of several million channels. An overview and the status of the planning is given. Also, the development challenges are discussed.

  5. Characterisation of capacitively coupled HV/HR-CMOS sensor chips for the CLIC vertex detector

    CERN Document Server

    AUTHOR|(SzGeCERN)756402

    2017-01-01

    The capacitive coupling between an active sensor and a readout ASIC has been considered in the framework of the CLIC vertex detector study. The CLICpix Capacitively Coupled Pixel Detector (C3PD) is a High-Voltage CMOS sensor chip produced in a commercial 180 nm HV-CMOS process for this purpose. The sensor was designed to be connected to the CLICpix2 readout chip. It therefore matches the dimensions of the readout chip, featuring a matrix of 128 × 128 square pixels with 25 μm pitch. The sensor chip has been produced with the standard value for the substrate resistivity (∼ 20 Ωcm) and it has been characterised in standalone testing mode, before receiving and testing capacitively coupled assemblies. The standalone measurement results show a rise time of ∼ 20 ns for a power consumption of 5 μW/pixel. Production of the C3PD HV-CMOS sensor chip with higher substrate resistivity wafers (∼ 20, 80, 200 and 1000 Ωcm) is foreseen. The expected benefits of the higher substrate resistivity will be studied using...

  6. Study and optimization of the spatial resolution for detectors with binary readout

    Energy Technology Data Exchange (ETDEWEB)

    Yonamine, R., E-mail: ryo.yonamine@ulb.ac.be; Maerschalk, T.; Lentdecker, G. De

    2016-09-11

    Using simulations and analytical approaches, we have studied single hit resolutions obtained with a binary readout, which is often proposed for high granularity detectors to reduce the generated data volume. Our simulations considering several parameters (e.g. strip pitch) show that the detector geometry and an electronics parameter of the binary readout chips could be optimized for binary readout to offer an equivalent spatial resolution to the one with an analog readout. To understand the behavior as a function of simulation parameters, we developed analytical models that reproduce simulation results with a few parameters. The models can be used to optimize detector designs and operation conditions with regard to the spatial resolution.

  7. Dedicated very front-end electronics for an ILC prototype hadronic calorimeter with SiPM read-out

    CERN Document Server

    de La Taille, C

    2008-01-01

    The SPIROC chip is a dedicated very front-end electronics for an ILC prototype hadronic calorimeter with Silicon photomultiplier (or MPPC) readout. This ASIC is due to equip a 10,000-channel demonstrator in 2009. SPIROC is an evolution of FLC_SiPM used for the ILC AHCAL physics prototype [1]. SPIROC was submitted in June 2007 and will be tested in September 2007. It embeds cutting edge features that fulfil ILC final detector requirements. It has been realized in 0.35m SiGe technology. It has been developed to match the requirements of large dynamic range, low noise, low consumption, high precision and large number of readout channels needed. SPIROC is an auto-triggered, bi-gain, 36-channel ASIC which allows to measure on each channel the charge from one photoelectron to 2000 and the time with a 100ps accurate TDC. An analogue memory array with a depth of 16 for each channel is used to store the time information and the charge measurement. A 12-bit Wilkinson ADC has been embedded to digitize the analogue memor...

  8. An eight channel low-noise CMOS readout circuit for silicon detectors with on-chip front-end FET

    International Nuclear Information System (INIS)

    Fiorini, C.; Porro, M.

    2006-01-01

    We propose a CMOS readout circuit for the processing of signals from multi-channel silicon detectors to be used in X-ray spectroscopy and γ-ray imaging applications. The circuit is composed by eight channels, each one featuring a low-noise preamplifier, a 6th-order semigaussian shaping amplifier with four selectable peaking times, from 1.8 up to 6 μs, a peak stretcher and a discriminator. The circuit is conceived to be used with silicon detectors with a front-end FET integrated on the detector chips itself, like silicon drift detectors with JFET and pixel detectors with DEPMOS. The integrated time constants used for the shaping are implemented by means of an RC-cell, based on the technique of demagnification of the current flowing in a resistor R by means of the use of current mirrors. The eight analog channels of the chip are multiplexed to a single analog output. A suitable digital section provides self-resetting of each channel and trigger output and is able to set independent thresholds on the analog channels by means of a programmable serial register and 3-bit DACs. The circuit has been realized in the 0.35 μm CMOS AMS technology. In this work, the main features of the circuit are presented along with the experimental results of its characterization

  9. Digital column readout architecture for the ATLAS pixel 025 mum front end IC

    CERN Document Server

    Mandelli, E; Blanquart, L; Comes, G; Denes, P; Einsweiler, Kevin F; Fischer, P; Marchesini, R; Meddeler, G; Peric, I

    2002-01-01

    A fast low noise, limited power, radiation-hard front-end chip was developed for reading out the Atlas Pixel Silicon Detector. As in the past prototypes, every chip is used to digitize and read out charge and time information from hits on each one of its 2880 inputs. The basic column readout architecture idea was adopted and modified to allow a safe transition to quarter micron technology. Each pixel cell, organized in a 160 multiplied by 18 matrix, can be independently enabled and configured in order to optimize the analog signal response and to prevent defective pixels from saturating the readout. The digital readout organizes hit data coming from each column, with respect to time, and output them on a low-level serial interface. A considerable effort was made to design state machines free of undefined states, where single-point defects and charge deposited by heavy ions in the silicon could have led to unpredicted forbidden states. 7 Refs.

  10. Invited Article: Terahertz microfluidic chips sensitivity-enhanced with a few arrays of meta-atoms

    Directory of Open Access Journals (Sweden)

    Kazunori Serita

    2018-05-01

    Full Text Available We present a nonlinear optical crystal (NLOC-based terahertz (THz microfluidic chip with a few arrays of split ring resonators (SRRs for ultra-trace and quantitative measurements of liquid solutions. The proposed chip operates on the basis of near-field coupling between the SRRs and a local emission of point like THz source that is generated in the process of optical rectification in NLOCs on a sub-wavelength scale. The liquid solutions flowing inside the microchannel modify the resonance frequency and peak attenuation in the THz transmission spectra. In contrast to conventional bio-sensing with far/near-field THz waves, our technique can be expected to compactify the chip design as well as realize high sensitive near-field measurement of liquid solutions without any high-power optical/THz source, near-field probes, and prisms. Using this chip, we have succeeded in observing the 31.8 fmol of ion concentration in actual amount of 318 pl water solutions from the shift of the resonance frequency. The technique opens the door to microanalysis of biological samples with THz waves and accelerates development of THz lab-on-chip devices.

  11. Invited Article: Terahertz microfluidic chips sensitivity-enhanced with a few arrays of meta-atoms

    Science.gov (United States)

    Serita, Kazunori; Matsuda, Eiki; Okada, Kosuke; Murakami, Hironaru; Kawayama, Iwao; Tonouchi, Masayoshi

    2018-05-01

    We present a nonlinear optical crystal (NLOC)-based terahertz (THz) microfluidic chip with a few arrays of split ring resonators (SRRs) for ultra-trace and quantitative measurements of liquid solutions. The proposed chip operates on the basis of near-field coupling between the SRRs and a local emission of point like THz source that is generated in the process of optical rectification in NLOCs on a sub-wavelength scale. The liquid solutions flowing inside the microchannel modify the resonance frequency and peak attenuation in the THz transmission spectra. In contrast to conventional bio-sensing with far/near-field THz waves, our technique can be expected to compactify the chip design as well as realize high sensitive near-field measurement of liquid solutions without any high-power optical/THz source, near-field probes, and prisms. Using this chip, we have succeeded in observing the 31.8 fmol of ion concentration in actual amount of 318 pl water solutions from the shift of the resonance frequency. The technique opens the door to microanalysis of biological samples with THz waves and accelerates development of THz lab-on-chip devices.

  12. Leakage analysis of crossbar memristor arrays

    KAUST Repository

    Zidan, Mohammed A.

    2014-07-01

    Crossbar memristor arrays provide a promising high density alternative for the current memory and storage technologies. These arrays suffer from parasitic current components that significantly increase the power consumption, and could ruin the readout operation. In this work we study the trade-off between the crossbar array density and the power consumption required for its readout. Our analysis is based on simulating full memristor arrays on a SPICE platform.

  13. Disposable MoS2-Arrayed MALDI MS Chip for High-Throughput and Rapid Quantification of Sulfonamides in Multiple Real Samples.

    Science.gov (United States)

    Zhao, Yaju; Tang, Minmin; Liao, Qiaobo; Li, Zhoumin; Li, Hui; Xi, Kai; Tan, Li; Zhang, Mei; Xu, Danke; Chen, Hong-Yuan

    2018-04-27

    In this work, we demonstrate, for the first time, the development of a disposable MoS 2 -arrayed matrix-assisted laser desorption/ionization mass spectrometry (MALDI MS) chip combined with an immunoaffinity enrichment method for high-throughput, rapid, and simultaneous quantitation of multiple sulfonamides (SAs). The disposable MALDI MS chip was designed and fabricated by MoS 2 array formation on a commercial indium tin oxide (ITO) glass slide. A series of SAs were analyzed, and clear deprotonated signals were obtained in negative-ion mode. Compared with MoS 2 -arrayed commercial steel plate, the prepared MALDI MS chip exhibited comparable LDI efficiency, providing a good alternative and disposable substrate for MALDI MS analysis. Furthermore, internal standard (IS) was previously deposited onto the MoS 2 array to simplify the experimental process for MALDI MS quantitation. 96 sample spots could be analyzed within 10 min in one single chip to perform quantitative analysis, recovery studies, and real foodstuff detection. Upon targeted extraction and enrichment by antibody conjugated magnetic beads, five SAs were quantitatively determined by the IS-first method with the linear range of 0.5-10 ng/mL ( R 2 > 0.990). Good recoveries and repeatability were obtained for spiked pork, egg, and milk samples. SAs in several real foodstuffs were successfully identified and quantified. The developed method may provide a promising tool for the routine analysis of antibiotic residues in real samples.

  14. CMOS Active-Pixel Image Sensor With Intensity-Driven Readout

    Science.gov (United States)

    Langenbacher, Harry T.; Fossum, Eric R.; Kemeny, Sabrina

    1996-01-01

    Proposed complementary metal oxide/semiconductor (CMOS) integrated-circuit image sensor automatically provides readouts from pixels in order of decreasing illumination intensity. Sensor operated in integration mode. Particularly useful in number of image-sensing tasks, including diffractive laser range-finding, three-dimensional imaging, event-driven readout of sparse sensor arrays, and star tracking.

  15. A multi-chip data acquisition system based on a heterogeneous system-on-chip platform

    CERN Document Server

    Fiergolski, Adrian

    2017-01-01

    The Control and Readout Inner tracking BOard (CaRIBOu) is a versatile readout system targeting a multitude of detector prototypes. It profits from the heterogeneous platform of the Zynq System-on-Chip (SoC) and integrates in a monolithic device front-end FPGA resources with a back-end software running on a hard-core ARM-based processor. The user-friendly Linux terminal with the pre-installed DAQ software is combined with the efficiency and throughput of a system fully implemented in the FPGA fabric. The paper presents the design of the SoC-based DAQ system and its building blocks. It also shows examples of the achieved functionality for the CLICpix2 readout ASIC.

  16. MT3250BA: a 320×256-50µm snapshot microbolometer ROIC for high-resistance detector arrays

    Science.gov (United States)

    Eminoglu, Selim; Akin, Tayfun

    2013-06-01

    This paper reports the development of a new microbolometer readout integrated circuit (MT3250BA) designed for high-resistance detector arrays. MT3250BA is the first microbolometer readout integrated circuit (ROIC) product from Mikro-Tasarim Ltd., which is a fabless IC design house specialized in the development of monolithic CMOS imaging sensors and ROICs for hybrid photonic imaging sensors and microbolometers. MT3250BA has a format of 320 × 256 and a pixel pitch of 50 µm, developed with a system-on-chip architecture in mind, where all the timing and biasing for this ROIC are generated on-chip without requiring any external inputs. MT3250BA is a highly configurable ROIC, where many of its features can be programmed through a 3-wire serial interface allowing on-the-fly configuration of many ROIC features. MT3250BA has 2 analog video outputs and 1 analog reference output for pseudo-differential operation, and the ROIC can be programmed to operate in the 1 or 2-output modes. A unique feature of MT3250BA is that it performs snapshot readout operation; therefore, the image quality will only be limited by the thermal time constant of the detector pixels, but not by the scanning speed of the ROIC, as commonly found in the conventional microbolometer ROICs performing line-by-line (rolling-line) readout operation. The signal integration is performed at the pixel level in parallel for the whole array, and signal integration time can be programmed from 0.1 µs up to 100 ms in steps of 0.1 µs. The ROIC is designed to work with high-resistance detector arrays with pixel resistance values higher than 250 kΩ. The detector bias voltage can be programmed on-chip over a 2 V range with a resolution of 1 mV. The ROIC has a measured input referred noise of 260 µV rms at 300 K. The ROIC can be used to build a microbolometer infrared sensor with an NETD value below 100 mK using a microbolometer detector array fabrication technology with a high detector resistance value (≥ 250 K

  17. Tailoring the High-Q LC Filter Arrays for Readout of Kilo-Pixel TES Arrays in the SPICA-SAFARI Instrument

    Science.gov (United States)

    Bruijn, M. P.; Gottardi, L.; den Hartog, R. H.; van der Kuur, J.; van der Linden, A. J.; Jackson, B. D.

    2014-08-01

    Following earlier presentations of arrays of high quality factor (Q 10.000) superconducting resonators in the MHz regime, we report on improvement of the packing density of resonance frequencies to 160 in the 1-3 MHz band. Spread in the spacing of resonances is found to be limited to 1 kHz (1 with the present fabrication procedure. The present packing density of frequencies and chip area approaches the requirements for the SAFARI instrument on the SPICA mission (in preparation). The a-Si:H dielectric layer in the planar S-I-S capacitors shows a presently unexplained apparent negative effective series resistance, depending on operating temperature and applied testing voltage.

  18. Investigation of the readout electronics of DELPHI surround muon chamber

    International Nuclear Information System (INIS)

    Khovanskij, N.; Krumshtejn, Z.; Ol'shevskij, A.; Sadovskij, A.; Sedykh, Yu.; Molnar, J.; Sicho, P.; Tomsa, Z.

    1995-01-01

    The characteristics of the readout electronics of the DELPHI surround muon chambers with various AMPLEX chips (AMPLEX 16 and AMPLEX-SICAL) are presented. This electronics is studied in a cosmic rays test of the real surround muon chamber model. 4 refs., 6 figs., 1 tab

  19. Development of an external readout electronics for a hybrid photon detector

    CERN Document Server

    Uyttenhove, Simon; Tichon, Jacques; Garcia, Salvador

    The pixel hybrid photon detectors currently installed in the LHCb Cherenkov system encapsulate readout electronics in the vacuum tube envelope. The LHCb upgrade and the new trigger system will require their replacement with new photon detectors. The baseline photon detector candidate is the multi-anode photomultiplier. A hybrid photon detector with external readout electronics has been proposed as a backup option. This master thesis covers a R & D phase to investigate this latter concept. Extensive studies of the initial electronics system underlined the noise contributions from the Beetle chip used as front-end readout ASIC and from the ceramic carrier of the photon detector. New front-end electronic boards have been developed and made fully compatible with the existing LHCb-RICH infrastructure. With this compact readout system, Cherenkov photons have been successfully detected in a real particle beam environment. The proof-of-concept of a hybrid photon detector with external readout electronics was val...

  20. Development of telescope readout system based on FELIX for testbeam experiments

    CERN Document Server

    Wu, Weihao; Chen, Hucheng; Chen, Kai; Lacobucci, Giuseppe; Lanni, Francessco; Liu, Hongbin; Barrero Pinto, Mateus Vicente; Xu, Lailin

    2017-01-01

    The High Voltage CMOS (HV-CMOS) sensors are extensively investigated by the ATLAS collaboration in the High-Luminosity LHC (HL-LHC) upgrade of the Inner Tracker (ITk) detector. A testbeam telescope, based on the ATLAS IBL (Insertable B-Layer) silicon pixel modules, has been built to characterize the HV-CMOS sensor prototypes. The Front-End LInk eXchange (FELIX) system is a new approach to function as the gateway between front-ends and the commodity switched network in the different detectors of the ATLAS upgrade. A FELIX based readout system has been developed for the readout of the testbeam telescope, which includes a Telescope Readout FMC Card as interface between the IBL DC (double-chip) modules and a Xilinx ZC706 evaluation board. The test results show that the FELIX based telescope readout system is capable of sensor calibration and readout of a high-density pixel detector in test beam experiments in an effective way.

  1. Micromachined microphone array on a chip for turbulent boundary layer measurements

    Science.gov (United States)

    Krause, Joshua Steven

    A surface micromachined microphone array on a single chip has been successfully designed, fabricated, characterized, and tested for aeroacoustic purposes. The microphone was designed to have venting through the diaphragm, 64 elements (8x8) on the chip, and used a capacitive transduction scheme. The microphone was fabricated using the MEMSCAP PolyMUMPs process (a foundry polysilicon surface micromachining process) along with facilities at Tufts Micro and Nano Fabrication Facility (TMNF) where a Parylene-C passivation layer deposition and release of the microstructures were performed. The devices are packaged with low profile interconnects, presenting a maximum of 100 mum of surface topology. The design of an individual microphone was completed through the use of a lumped element model (LEM) to determine the theoretical performance of the microphone. Off-chip electronics were created to allow the microphone array outputs to be redirected to one of two channels, allowing dynamic reconfiguration of the effective transducer shape in software and provide 80 dB off isolation. The characterization was completed through the use of laser Doppler vibrometry (LDV), acoustic plane wave tube and free-field calibration, and electrical noise floor testing in a Faraday cage. Measured microphone sensitivity is 0.15 mV/Pa for an individual microphone and 8.7 mV/Pa for the entire array, in close agreement with model predictions. The microphones and electronics operate over the 200--40 000 Hz band. The dynamic range extends from 60 dB SPL in a 1 Hz band to greater than 150 dB SPL. Element variability was +/-0.05 mV/Pa in sensitivity with an array yield of 95%. Wind tunnel testing at flow rates of up to 205.8 m/s indicates that the devices continue to operate in flow without damage, and can be successfully reconfigured on the fly. Care has been taken to systematically remove contaminating signals (acoustic, vibration, and noise floor) from the wind tunnel data to determine actual

  2. The TDCpix readout ASIC: A 75ps resolution timing front-end for the NA62 Gigatracker hybrid pixel detector

    CERN Document Server

    Kluge, A; Bonacini, S; Jarron, P; Kaplon, J; Morel, M; Noy, M; Perktold, L; Poltorak, K

    2013-01-01

    The TDCpix is a novel pixel readout ASIC for the NA62 Gigatracker detector. NA62 is a new experiment being installed at the CERN Super Proton Synchrotron. Its Gigatracker detector shall provide on-beam tracking and time stamping of individual particles with a time resolution of 150 ps rms. It will consist of three tracking stations, each with one hybrid pixel sensor. The peak fl ow of particles crossing the detector modules reaches 1.27 MHz/mm 2 for a total rate of about 0.75 GHz. Ten TDCpix chips will be bump-bonded to every silicon pixel sensor. Each chip shall perform time stamping of 100 M particle hits per second with a detection ef fi ciency above 99% and a timing accuracy better than 200 ps rms for an overall three-station-setup time resolution of better than 150 ps. The TDCpix chip has been designed in a 130 nm CMOS technology. It will feature 45 40 square pixels of 300 300 μ m 2 and a complex End of Column peripheral region including an array of TDCs based on DLLs, four high speed serializers, a low...

  3. Development of X-ray CCD camera system with high readout rate using ASIC

    International Nuclear Information System (INIS)

    Nakajima, Hiroshi; Matsuura, Daisuke; Anabuki, Naohisa; Miyata, Emi; Tsunemi, Hiroshi; Doty, John P.; Ikeda, Hirokazu; Katayama, Haruyoshi

    2009-01-01

    We report on the development of an X-ray charge-coupled device (CCD) camera system with high readout rate using application-specific integrated circuit (ASIC) and Camera Link standard. The distinctive ΔΣ type analog-to-digital converter is introduced into the chip to achieve effective noise shaping and to obtain a high resolution with relatively simple circuits. The unit test proved moderately low equivalent input noise of 70μV with a high readout pixel rate of 625 kHz, while the entire chip consumes only 100 mW. The Camera Link standard was applied for the connectivity between the camera system and frame grabbers. In the initial test of the whole system, we adopted a P-channel CCD with a thick depletion layer developed for X-ray CCD camera onboard the next Japanese X-ray astronomical satellite. The characteristic X-rays from 109 Cd were successfully read out resulting in the energy resolution of 379(±7)eV (FWHM) at 22.1 keV, that is, ΔE/E=1.7% with a readout rate of 44 kHz.

  4. A 32 x 32 capacitive micromachined ultrasonic transducer array manufactured in standard CMOS.

    Science.gov (United States)

    Lemmerhirt, David F; Cheng, Xiaoyang; White, Robert; Rich, Collin A; Zhang, Man; Fowlkes, J Brian; Kripfgans, Oliver D

    2012-07-01

    As ultrasound imagers become increasingly portable and lower cost, breakthroughs in transducer technology will be needed to provide high-resolution, real-time 3-D imaging while maintaining the affordability needed for portable systems. This paper presents a 32 x 32 ultrasound array prototype, manufactured using a CMUT-in-CMOS approach whereby ultrasonic transducer elements and readout circuits are integrated on a single chip using a standard integrated circuit manufacturing process in a commercial CMOS foundry. Only blanket wet-etch and sealing steps are added to complete the MEMS devices after the CMOS process. This process typically yields better than 99% working elements per array, with less than ±1.5 dB variation in receive sensitivity among the 1024 individually addressable elements. The CMUT pulseecho frequency response is typically centered at 2.1 MHz with a -6 dB fractional bandwidth of 60%, and elements are arranged on a 250 μm hexagonal grid (less than half-wavelength pitch). Multiplexers and CMOS buffers within the array are used to make on-chip routing manageable, reduce the number of physical output leads, and drive the transducer cable. The array has been interfaced to a commercial imager as well as a set of custom transmit and receive electronics, and volumetric images of nylon fishing line targets have been produced.

  5. Vertically Integrated Edgeless Photon Imaging Camera

    Energy Technology Data Exchange (ETDEWEB)

    Fahim, Farah [Fermilab; Deptuch, Grzegorz [Fermilab; Shenai, Alpana [Fermilab; Maj, Piotr [AGH-UST, Cracow; Kmon, Piotr [AGH-UST, Cracow; Grybos, Pawel [AGH-UST, Cracow; Szczygiel, Robert [AGH-UST, Cracow; Siddons, D. Peter [Brookhaven; Rumaiz, Abdul [Brookhaven; Kuczewski, Anthony [Brookhaven; Mead, Joseph [Brookhaven; Bradford, Rebecca [Argonne; Weizeorick, John [Argonne

    2017-01-01

    The Vertically Integrated Photon Imaging Chip - Large, (VIPIC-L), is a large area, small pixel (65μm), 3D integrated, photon counting ASIC with zero-suppressed or full frame dead-time-less data readout. It features data throughput of 14.4 Gbps per chip with a full frame readout speed of 56kframes/s in the imaging mode. VIPIC-L contain 192 x 192 pixel array and the total size of the chip is 1.248cm x 1.248cm with only a 5μm periphery. It contains about 120M transistors. A 1.3M pixel camera module will be developed by arranging a 6 x 6 array of 3D VIPIC-L’s bonded to a large area silicon sensor on the analog side and to a readout board on the digital side. The readout board hosts a bank of FPGA’s, one per VIPIC-L to allow processing of up to 0.7 Tbps of raw data produced by the camera.

  6. Large power microwave nonlinear effects on multifunction amplifier chip for Ka-band T/R module of phased array radar

    Science.gov (United States)

    Guo, Guo; Gu, Ling; Wu, Ruowu; Xu, Xiong; Zhou, Taifu; Niu, Xinjian; Liu, Yinghui; Wang, Hui; Wei, Yanyu; Guo, Changyong

    2017-12-01

    Nonlinear effects of large power millimeter wave on critical chips for the T/R module of phased array radar is experimental studied and analyzed in this paper. A multifunction amplifier chip is selected for our experiments. A solid continuous wave (CW) source and a large power pulsed magnetron are both employed to generate the Ka-band microwave. The input-output characteristics, the degradation and destroy threshold of the chips are obtained through a series of experimental tests. At last, the results are given by figures and analyzed theoretically.

  7. Development of a prototype PET scanner with depth-of-interaction measurement using solid-state photomultiplier arrays and parallel readout electronics.

    Science.gov (United States)

    Shao, Yiping; Sun, Xishan; Lan, Kejian A; Bircher, Chad; Lou, Kai; Deng, Zhi

    2014-03-07

    In this study, we developed a prototype animal PET by applying several novel technologies to use solid-state photomultiplier (SSPM) arrays to measure the depth of interaction (DOI) and improve imaging performance. Each PET detector has an 8 × 8 array of about 1.9 × 1.9 × 30.0 mm(3) lutetium-yttrium-oxyorthosilicate scintillators, with each end optically connected to an SSPM array (16 channels in a 4 × 4 matrix) through a light guide to enable continuous DOI measurement. Each SSPM has an active area of about 3 × 3 mm(2), and its output is read by a custom-developed application-specific integrated circuit to directly convert analogue signals to digital timing pulses that encode the interaction information. These pulses are transferred to and are decoded by a field-programmable gate array-based time-to-digital convertor for coincident event selection and data acquisition. The independent readout of each SSPM and the parallel signal process can significantly improve the signal-to-noise ratio and enable the use of flexible algorithms for different data processes. The prototype PET consists of two rotating detector panels on a portable gantry with four detectors in each panel to provide 16 mm axial and variable transaxial field-of-view (FOV) sizes. List-mode ordered subset expectation maximization image reconstruction was implemented. The measured mean energy, coincidence timing and DOI resolution for a crystal were about 17.6%, 2.8 ns and 5.6 mm, respectively. The measured transaxial resolutions at the center of the FOV were 2.0 mm and 2.3 mm for images reconstructed with and without DOI, respectively. In addition, the resolutions across the FOV with DOI were substantially better than those without DOI. The quality of PET images of both a hot-rod phantom and mouse acquired with DOI was much higher than that of images obtained without DOI. This study demonstrates that SSPM arrays and advanced readout/processing electronics can be used to develop a practical DOI

  8. An Improved Zero Potential Circuit for Readout of a Two-Dimensional Resistive Sensor Array

    Directory of Open Access Journals (Sweden)

    Jian-Feng Wu

    2016-12-01

    Full Text Available With one operational amplifier (op-amp in negative feedback, the traditional zero potential circuit could access one element in the two-dimensional (2-D resistive sensor array with the shared row-column fashion but it suffered from the crosstalk problem for the non-scanned elements’ bypass currents, which were injected into array’s non-scanned electrodes from zero potential. Firstly, for suppressing the crosstalk problem, we designed a novel improved zero potential circuit with one more op-amp in negative feedback to sample the total bypass current and calculate the precision resistance of the element being tested (EBT with it. The improved setting non-scanned-electrode zero potential circuit (S-NSE-ZPC was given as an example for analyzing and verifying the performance of the improved zero potential circuit. Secondly, in the S-NSE-ZPC and the improved S-NSE-ZPC, the effects of different parameters of the resistive sensor arrays and their readout circuits on the EBT’s measurement accuracy were simulated with the NI Multisim 12. Thirdly, part features of the improved circuit were verified with the experiments of a prototype circuit. Followed, the results were discussed and the conclusions were given. The experiment results show that the improved circuit, though it requires one more op-amp, one more resistor and one more sampling channel, can access the EBT in the 2-D resistive sensor array more accurately.

  9. Highly efficient router-based readout algorithm for single-photon-avalanche-diode imagers for time-correlated experiments

    Science.gov (United States)

    Cominelli, A.; Acconcia, G.; Caldi, F.; Peronio, P.; Ghioni, M.; Rech, I.

    2018-02-01

    Time-Correlated Single Photon Counting (TCSPC) is a powerful tool that permits to record extremely fast optical signals with a precision down to few picoseconds. On the other hand, it is recognized as a relatively slow technique, especially when a large time-resolved image is acquired exploiting a single acquisition channel and a scanning system. During the last years, much effort has been made towards the parallelization of many acquisition and conversion chains. In particular, the exploitation of Single-Photon Avalanche Diodes in standard CMOS technology has paved the way to the integration of thousands of independent channels on the same chip. Unfortunately, the presence of a large number of detectors can give rise to a huge rate of events, which can easily lead to the saturation of the transfer rate toward the elaboration unit. As a result, a smart readout approach is needed to guarantee an efficient exploitation of the limited transfer bandwidth. We recently introduced a novel readout architecture, aimed at maximizing the counting efficiency of the system in typical TCSPC measurements. It features a limited number of high-performance converters, which are shared with a much larger array, while a smart routing logic provides a dynamic multiplexing between the two parts. Here we propose a novel routing algorithm, which exploits standard digital gates distributed among a large 32x32 array to ensure a dynamic connection between detectors and external time-measurement circuits.

  10. Qualification method for a 1 MGy-tolerant front-end chip designed in 65 nm CMOS for the read-out of remotely operated sensors and actuators during maintenance in ITER

    Energy Technology Data Exchange (ETDEWEB)

    Verbeeck, Jens, E-mail: jens.verbeeck@esat.kuleuven.be [KU Leuven (KUL), Div. LRD-MAGyICS, Kasteelpark Arenberg 10, 3001 Heverlee (Belgium); Cao, Ying [KU Leuven (KUL), Div. LRD-MAGyICS, Kasteelpark Arenberg 10, 3001 Heverlee (Belgium); Van Uffelen, Marco; Casellas, Laura Mont; Damiani, Carlo; Morales, Emilio Ruiz; Santana, Roberto Ranz [Fusion for Energy (F4E), c/Josep, no. 2, Torres Diagonal Litoral, Ed. B3, 08019 Barcelona (Spain); Meek, Richard; Haist, Bernhard [Oxford Technologies Ltd. (OTL), 7 Nuffield Way, Abingdon OX14 1RL (United Kingdom); Hamilton, David [ITER Organisation (IO), Route de Vinon-sur-Verdon, CS 90 046, 13067 St. Paul les Durance Cedex (France); Steyaert, Michiel [KU Leuven, ESAT-MICAS, Kasteelpark Arenberg 10, 3001 Heverlee (Belgium); Leroux, Paul [KU Leuven, ESAT-MICAS, Kasteelpark Arenberg 10, 3001 Heverlee (Belgium); KU Leuven, ESAT, Advanced Integrated Sensing Lab (AdvISe), Kleinhoefstraat 4, 2440 Geel (Belgium)

    2015-10-15

    This paper describes the radiation qualification procedure for a 1 MGy-tolerant Application Specific Integrated Circuit (ASIC) developed in 65 nm CMOS technology. The chip is intended for the read-out of electrical signals of sensors and actuators during maintenance in ITER. First the general working principle of the ASIC is shown. The developed IC allows to read-out, condition and digitize multiple low bandwidth (<10 kHz) sensors. In addition the IC is able to multiplex the digitized sensor signals. To comply with ITER-relevant constraints an adapted radiation qualification procedure has been proposed. The radiation-qualification procedure describes the test criteria and test conditions of the developed ASICs, which are also compared with COTS alternatives, to meet the stringent qualification procedures for electronics exposed to radiation in ITER.

  11. Wavelength shifter strips and G-APD arrays for the read-out of the z-coordinate in axial PET modules

    CERN Document Server

    Braem, André; Joram, C; Rudge, A; Séguinot, Jacques; Weilhammer, P; De Leo, R; Nappi, E; Lustermann, W; Schinzel, D; Johnson, I; Renker, D; Albrecht, S

    2008-01-01

    The measurements presented in this paper are related to the development of a PET camera based on a 3-D axial geometry with excellent 3-D spatial, timing and energy resolution. The detector modules consist of matrices of long axially oriented scintillation crystal bars, which are individually coupled to photodetectors. The axial coordinate is derived from wavelength shifting (WLS) plastic strips orthogonally interleaved between the crystal bars and readout by G-APD arrays. We report on results from measurements with two LYSO crystal bars, read with PMTs, and two WLS strips readout with G-APD devices from Hamamatsu (called MPPC). The WLS strips are positioned orthogonally underneath the LYSO bars. Yields of about 80 photoelectrons from the WLS strips for an energy deposition in the LYSO crystals equivalent to the absorption of 511 keV photons are observed. The axial coordinate in the LYSO bars is reconstructed with a precision of about 1.9 mm (FWHM) using a digital reconstruction method. The resolution of an an...

  12. Microwave multiplex readout for superconducting sensors

    Energy Technology Data Exchange (ETDEWEB)

    Ferri, E., E-mail: elena.ferri@mib.infn.it [Università Milano-Bicocca, Milan (Italy); INFN Sez. di Milano-Bicocca, Milan (Italy); Becker, D.; Bennett, D. [NIST, Boulder, CO (United States); Faverzani, M. [Università Milano-Bicocca, Milan (Italy); INFN Sez. di Milano-Bicocca, Milan (Italy); Fowler, J.; Gard, J. [NIST, Boulder, CO (United States); Giachero, A. [Università Milano-Bicocca, Milan (Italy); INFN Sez. di Milano-Bicocca, Milan (Italy); Hays-Wehle, J.; Hilton, G. [NIST, Boulder, CO (United States); Maino, M. [Università Milano-Bicocca, Milan (Italy); INFN Sez. di Milano-Bicocca, Milan (Italy); Mates, J. [NIST, Boulder, CO (United States); Puiu, A.; Nucciotti, A. [Università Milano-Bicocca, Milan (Italy); INFN Sez. di Milano-Bicocca, Milan (Italy); Reintsema, C.; Schmidt, D.; Swetz, D.; Ullom, J.; Vale, L. [NIST, Boulder, CO (United States)

    2016-07-11

    The absolute neutrino mass scale is still an outstanding challenge in both particle physics and cosmology. The calorimetric measurement of the energy released in a nuclear beta decay is a powerful tool to determine the effective electron-neutrino mass. In the last years, the progress on low temperature detector technologies has allowed to design large scale experiments aiming at pushing down the sensitivity on the neutrino mass below 1 eV. Even with outstanding performances in both energy (~ eV on keV) and time resolution (~ 1 μs) on the single channel, a large number of detectors working in parallel is required to reach a sub-eV sensitivity. Microwave frequency domain readout is the best available technique to readout large array of low temperature detectors, such as Transition Edge Sensors (TESs) or Microwave Kinetic Inductance Detectors (MKIDs). In this way a multiplex factor of the order of thousands can be reached, limited only by the bandwidth of the available commercial fast digitizers. This microwave multiplexing system will be used to readout the HOLMES detectors, an array of 1000 microcalorimeters based on TES sensors in which the {sup 163}Ho will be implanted. HOLMES is a new experiment for measuring the electron neutrino mass by means of the electron capture (EC) decay of {sup 163}Ho. We present here the microwave frequency multiplex which will be used in the HOLMES experiment and the microwave frequency multiplex used to readout the MKID detectors developed in Milan as well.

  13. A statistical method for predicting splice variants between two groups of samples using GeneChip® expression array data

    Directory of Open Access Journals (Sweden)

    Olson James M

    2006-04-01

    Full Text Available Abstract Background Alternative splicing of pre-messenger RNA results in RNA variants with combinations of selected exons. It is one of the essential biological functions and regulatory components in higher eukaryotic cells. Some of these variants are detectable with the Affymetrix GeneChip® that uses multiple oligonucleotide probes (i.e. probe set, since the target sequences for the multiple probes are adjacent within each gene. Hybridization intensity from a probe correlates with abundance of the corresponding transcript. Although the multiple-probe feature in the current GeneChip® was designed to assess expression values of individual genes, it also measures transcriptional abundance for a sub-region of a gene sequence. This additional capacity motivated us to develop a method to predict alternative splicing, taking advance of extensive repositories of GeneChip® gene expression array data. Results We developed a two-step approach to predict alternative splicing from GeneChip® data. First, we clustered the probes from a probe set into pseudo-exons based on similarity of probe intensities and physical adjacency. A pseudo-exon is defined as a sequence in the gene within which multiple probes have comparable probe intensity values. Second, for each pseudo-exon, we assessed the statistical significance of the difference in probe intensity between two groups of samples. Differentially expressed pseudo-exons are predicted to be alternatively spliced. We applied our method to empirical data generated from GeneChip® Hu6800 arrays, which include 7129 probe sets and twenty probes per probe set. The dataset consists of sixty-nine medulloblastoma (27 metastatic and 42 non-metastatic samples and four cerebellum samples as normal controls. We predicted that 577 genes would be alternatively spliced when we compared normal cerebellum samples to medulloblastomas, and predicted that thirteen genes would be alternatively spliced when we compared metastatic

  14. Fully parallel write/read in resistive synaptic array for accelerating on-chip learning

    Science.gov (United States)

    Gao, Ligang; Wang, I.-Ting; Chen, Pai-Yu; Vrudhula, Sarma; Seo, Jae-sun; Cao, Yu; Hou, Tuo-Hung; Yu, Shimeng

    2015-11-01

    A neuro-inspired computing paradigm beyond the von Neumann architecture is emerging and it generally takes advantage of massive parallelism and is aimed at complex tasks that involve intelligence and learning. The cross-point array architecture with synaptic devices has been proposed for on-chip implementation of the weighted sum and weight update in the learning algorithms. In this work, forming-free, silicon-process-compatible Ta/TaO x /TiO2/Ti synaptic devices are fabricated, in which >200 levels of conductance states could be continuously tuned by identical programming pulses. In order to demonstrate the advantages of parallelism of the cross-point array architecture, a novel fully parallel write scheme is designed and experimentally demonstrated in a small-scale crossbar array to accelerate the weight update in the training process, at a speed that is independent of the array size. Compared to the conventional row-by-row write scheme, it achieves >30× speed-up and >30× improvement in energy efficiency as projected in a large-scale array. If realistic synaptic device characteristics such as device variations are taken into an array-level simulation, the proposed array architecture is able to achieve ∼95% recognition accuracy of MNIST handwritten digits, which is close to the accuracy achieved by software using the ideal sparse coding algorithm.

  15. Fully parallel write/read in resistive synaptic array for accelerating on-chip learning

    International Nuclear Information System (INIS)

    Gao, Ligang; Chen, Pai-Yu; Seo, Jae-sun; Cao, Yu; Yu, Shimeng; Wang, I-Ting; Hou, Tuo-Hung; Vrudhula, Sarma

    2015-01-01

    A neuro-inspired computing paradigm beyond the von Neumann architecture is emerging and it generally takes advantage of massive parallelism and is aimed at complex tasks that involve intelligence and learning. The cross-point array architecture with synaptic devices has been proposed for on-chip implementation of the weighted sum and weight update in the learning algorithms. In this work, forming-free, silicon-process-compatible Ta/TaO_x/TiO_2/Ti synaptic devices are fabricated, in which >200 levels of conductance states could be continuously tuned by identical programming pulses. In order to demonstrate the advantages of parallelism of the cross-point array architecture, a novel fully parallel write scheme is designed and experimentally demonstrated in a small-scale crossbar array to accelerate the weight update in the training process, at a speed that is independent of the array size. Compared to the conventional row-by-row write scheme, it achieves >30× speed-up and >30× improvement in energy efficiency as projected in a large-scale array. If realistic synaptic device characteristics such as device variations are taken into an array-level simulation, the proposed array architecture is able to achieve ∼95% recognition accuracy of MNIST handwritten digits, which is close to the accuracy achieved by software using the ideal sparse coding algorithm. (paper)

  16. Electronics and readout of a large area silicon detector for LHC

    International Nuclear Information System (INIS)

    Borer, K.; Munday, D.J.; Parker, M.A.; Anghinolfi, F.; Aspell, P.; Campbell, M.; Chilingarov, A.; Jarron, P.; Heijne, E.H.M.; Santiard, J.C.; Scampoli, P.; Verweij, H.; Goessling, C.; Lisowski, B.; Reichold, A.; Spiwoks, R.; Tsesmelis, E.; Benslama, K.; Bonino, R.; Clark, A.G.; Couyoumtzelis, C.; Kambara, H.; Wu, X.; Fretwurst, E.; Lindstroem, G.; Schultz, T.; Bardos, R.A.; Gorfine, G.W.; Moorhead, G.F.; Taylor, G.N.; Tovey, S.N.; Bibby, J.H.; Hawkings, R.J.; Kundu, N.; Weidberg, A.; Campbell, D.; Murray, P.; Seller, P.; Teiger, J.

    1994-01-01

    The purpose of the RD2 project is to evaluate the feasibility of a silicon tracker and/or preshower detector for LHC. Irradiation studies with doses equivalent to those expected at LHC have been performed to determine the behavior of operational parameters such as leakage current, depletion voltage and charge collection during the life of the detector. The development of fast, dense, low power and low cost signal processing electronics is one of the major activities of the collaboration. We describe the first fully functional integrated analog memory chip with asynchronous read and write operations and level 1 trigger capture capabilities. A complete test beam system using this analog memory chip at 66 MHz has been successfully operated with RD2 prototype silicon detectors during various test runs. The flexibility of the electronics and readout have allowed us to easily interface our set-up to other data acquisition systems. Mechanical studies are in progress to design a silicon tracking detector with several million channels that may be operated at low (0-10 C) temperature, while maintaining the required geometrical precision. Prototype readout boards for such a detector are being developed and simulation studies are being performed to optimize the readout architecture. (orig.)

  17. Field-programmable lab-on-a-chip based on microelectrode dot array architecture.

    Science.gov (United States)

    Wang, Gary; Teng, Daniel; Lai, Yi-Tse; Lu, Yi-Wen; Ho, Yingchieh; Lee, Chen-Yi

    2014-09-01

    The fundamentals of electrowetting-on-dielectric (EWOD) digital microfluidics are very strong: advantageous capability in the manipulation of fluids, small test volumes, precise dynamic control and detection, and microscale systems. These advantages are very important for future biochip developments, but the development of EWOD microfluidics has been hindered by the absence of: integrated detector technology, standard commercial components, on-chip sample preparation, standard manufacturing technology and end-to-end system integration. A field-programmable lab-on-a-chip (FPLOC) system based on microelectrode dot array (MEDA) architecture is presented in this research. The MEDA architecture proposes a standard EWOD microfluidic component called 'microelectrode cell', which can be dynamically configured into microfluidic components to perform microfluidic operations of the biochip. A proof-of-concept prototype FPLOC, containing a 30 × 30 MEDA, was developed by using generic integrated circuits computer aided design tools, and it was manufactured with standard low-voltage complementary metal-oxide-semiconductor technology, which allows smooth on-chip integration of microfluidics and microelectronics. By integrating 900 droplet detection circuits into microelectrode cells, the FPLOC has achieved large-scale integration of microfluidics and microelectronics. Compared to the full-custom and bottom-up design methods, the FPLOC provides hierarchical top-down design approach, field-programmability and dynamic manipulations of droplets for advanced microfluidic operations.

  18. Short-wavelength infrared imaging using low dark current InGaAs detector arrays and vertical-cavity surface-emitting laser illuminators

    Science.gov (United States)

    Macdougal, Michael; Geske, Jon; Wang, Chad; Follman, David

    2011-06-01

    We describe the factors that go into the component choices for a short wavelength IR (SWIR) imager, which include the SWIR sensor, the lens, and the illuminator. We have shown the factors for reducing dark current, and shown that we can achieve well below 1.5 nA/cm2 for 15 μm devices at 7 °C. In addition, we have mated our InGaAs detector arrays to 640×512 readout integrated integrated circuits to make focal plane arrays (FPAs). The resulting FPAs are capable of imaging photon fluxes with wavelengths between 1 and 1.6 μm at low light levels. The dark current associated with these FPAs is extremely low, exhibiting a mean dark current density of 0.26 nA/cm2 at 0 °C. Noise due to the readout can be reduced from 95 to 57 electrons by using off-chip correlated double sampling. In addition, Aerius has developed laser arrays that provide flat illumination in scenes that are normally light-starved. The illuminators have 40% wall-plug efficiency and provide low-speckle illumination, and provide artifact-free imagery versus conventional laser illuminators.

  19. Low-power priority Address-Encoder and Reset-Decoder data-driven readout for Monolithic Active Pixel Sensors for tracker system

    International Nuclear Information System (INIS)

    Yang, P.; Aglieri, G.; Cavicchioli, C.; Chalmet, P.L.; Chanlek, N.; Collu, A.; Gao, C.; Hillemanns, H.; Junique, A.; Kofarago, M.; Keil, M.; Kugathasan, T.; Kim, D.; Kim, J.; Lattuca, A.; Marin Tobon, C.A.; Marras, D.; Mager, M.; Martinengo, P.; Mazza, G.

    2015-01-01

    Active Pixel Sensors used in High Energy Particle Physics require low power consumption to reduce the detector material budget, low integration time to reduce the possibilities of pile-up and fast readout to improve the detector data capability. To satisfy these requirements, a novel Address-Encoder and Reset-Decoder (AERD) asynchronous circuit for a fast readout of a pixel matrix has been developed. The AERD data-driven readout architecture operates the address encoding and reset decoding based on an arbitration tree, and allows us to readout only the hit pixels. Compared to the traditional readout structure of the rolling shutter scheme in Monolithic Active Pixel Sensors (MAPS), AERD can achieve a low readout time and a low power consumption especially for low hit occupancies. The readout is controlled at the chip periphery with a signal synchronous with the clock, allows a good digital and analogue signal separation in the matrix and a reduction of the power consumption. The AERD circuit has been implemented in the TowerJazz 180 nm CMOS Imaging Sensor (CIS) process with full complementary CMOS logic in the pixel. It works at 10 MHz with a matrix height of 15 mm. The energy consumed to read out one pixel is around 72 pJ. A scheme to boost the readout speed to 40 MHz is also discussed. The sensor chip equipped with AERD has been produced and characterised. Test results including electrical beam measurement are presented

  20. Low-power priority Address-Encoder and Reset-Decoder data-driven readout for Monolithic Active Pixel Sensors for tracker system

    Energy Technology Data Exchange (ETDEWEB)

    Yang, P., E-mail: yangping0710@126.com [Central China Normal University, Wuhan (China); Aglieri, G.; Cavicchioli, C. [CERN, 1210 Geneva 23 (Switzerland); Chalmet, P.L. [MIND, Archamps (France); Chanlek, N. [Suranaree University of Technology, Nakhon Ratchasima (Thailand); Collu, A. [University of Cagliari, Cagliari (Italy); INFN (Italy); Gao, C. [Central China Normal University, Wuhan (China); Hillemanns, H.; Junique, A. [CERN, 1210 Geneva 23 (Switzerland); Kofarago, M. [CERN, 1210 Geneva 23 (Switzerland); University of Utrecht, Utrecht (Netherlands); Keil, M.; Kugathasan, T. [CERN, 1210 Geneva 23 (Switzerland); Kim, D. [Dongguk and Yonsei University, Seoul (Korea, Republic of); Kim, J. [Pusan National University, Busan (Korea, Republic of); Lattuca, A. [University of Torino, Torino (Italy); INFN (Italy); Marin Tobon, C.A. [CERN, 1210 Geneva 23 (Switzerland); Marras, D. [University of Cagliari, Cagliari (Italy); INFN (Italy); Mager, M.; Martinengo, P. [CERN, 1210 Geneva 23 (Switzerland); Mazza, G. [University of Torino, Torino (Italy); INFN (Italy); and others

    2015-06-11

    Active Pixel Sensors used in High Energy Particle Physics require low power consumption to reduce the detector material budget, low integration time to reduce the possibilities of pile-up and fast readout to improve the detector data capability. To satisfy these requirements, a novel Address-Encoder and Reset-Decoder (AERD) asynchronous circuit for a fast readout of a pixel matrix has been developed. The AERD data-driven readout architecture operates the address encoding and reset decoding based on an arbitration tree, and allows us to readout only the hit pixels. Compared to the traditional readout structure of the rolling shutter scheme in Monolithic Active Pixel Sensors (MAPS), AERD can achieve a low readout time and a low power consumption especially for low hit occupancies. The readout is controlled at the chip periphery with a signal synchronous with the clock, allows a good digital and analogue signal separation in the matrix and a reduction of the power consumption. The AERD circuit has been implemented in the TowerJazz 180 nm CMOS Imaging Sensor (CIS) process with full complementary CMOS logic in the pixel. It works at 10 MHz with a matrix height of 15 mm. The energy consumed to read out one pixel is around 72 pJ. A scheme to boost the readout speed to 40 MHz is also discussed. The sensor chip equipped with AERD has been produced and characterised. Test results including electrical beam measurement are presented.

  1. Low-power priority Address-Encoder and Reset-Decoder data-driven readout for Monolithic Active Pixel Sensors for tracker system

    Science.gov (United States)

    Yang, P.; Aglieri, G.; Cavicchioli, C.; Chalmet, P. L.; Chanlek, N.; Collu, A.; Gao, C.; Hillemanns, H.; Junique, A.; Kofarago, M.; Keil, M.; Kugathasan, T.; Kim, D.; Kim, J.; Lattuca, A.; Marin Tobon, C. A.; Marras, D.; Mager, M.; Martinengo, P.; Mazza, G.; Mugnier, H.; Musa, L.; Puggioni, C.; Rousset, J.; Reidt, F.; Riedler, P.; Snoeys, W.; Siddhanta, S.; Usai, G.; van Hoorne, J. W.; Yi, J.

    2015-06-01

    Active Pixel Sensors used in High Energy Particle Physics require low power consumption to reduce the detector material budget, low integration time to reduce the possibilities of pile-up and fast readout to improve the detector data capability. To satisfy these requirements, a novel Address-Encoder and Reset-Decoder (AERD) asynchronous circuit for a fast readout of a pixel matrix has been developed. The AERD data-driven readout architecture operates the address encoding and reset decoding based on an arbitration tree, and allows us to readout only the hit pixels. Compared to the traditional readout structure of the rolling shutter scheme in Monolithic Active Pixel Sensors (MAPS), AERD can achieve a low readout time and a low power consumption especially for low hit occupancies. The readout is controlled at the chip periphery with a signal synchronous with the clock, allows a good digital and analogue signal separation in the matrix and a reduction of the power consumption. The AERD circuit has been implemented in the TowerJazz 180 nm CMOS Imaging Sensor (CIS) process with full complementary CMOS logic in the pixel. It works at 10 MHz with a matrix height of 15 mm. The energy consumed to read out one pixel is around 72 pJ. A scheme to boost the readout speed to 40 MHz is also discussed. The sensor chip equipped with AERD has been produced and characterised. Test results including electrical beam measurement are presented.

  2. SQUIDs for the readout of metallic magnetic calorimeters

    Energy Technology Data Exchange (ETDEWEB)

    Ferring, Anna; Wegner, Mathias; Fleischmann, Andreas; Gastaldo, Loredana; Kempf, Sebastian; Enss, Christian [Kirchhoff-Institute for Physics, Heidelberg University (Germany)

    2015-07-01

    Superconducting quantum interference devices (SQUIDs) are the devices of choice to read out metallic magnetic calorimeters (MMCs). Here, the temperature change of the detector upon the absorption of an energetic particle is measured as a magnetization change of a paramagnetic temperature sensor that is situated in a weak magnetic field. Driven by the need for devices that allow for the readout of large-scale detector arrays with hundreds or even thousands of individual detectors as well as of single channel detectors with sub-eV energy resolution, we have recently started the development of low-T{sub c} current-sensing SQUIDs. In particular, we are developing cryogenic frequency-domain multiplexers based on non-hysteretic rf-SQUIDs for detector array readout as well as dc-SQUIDs for single channel detector readout. We discuss our SQUID designs and the performance of prototype SQUIDs. We particularly focus on the frequency and temperature dependence of the SQUID noise as well as the reliability of our SQUID fabrication process for Nb/Al-AlO{sub x}/Nb Josephson junctions. Additionally, we demonstrate experimentally that state-of-the-art MMCs can successfully be read out with our current devices. Finally, we discuss different strategies to improve the SQUID and detector performance aiming to reach sub-eV energy resolution for individual detectors as well as for detector arrays.

  3. High-efficiency dynamic routing architecture for the readout of single photon avalanche diode arrays in time-correlated measurements

    Science.gov (United States)

    Cominelli, A.; Acconcia, G.; Peronio, P.; Rech, I.; Ghioni, M.

    2017-05-01

    In recent years, the Time-Correlated Single Photon Counting (TCSPC) technique has gained a prominent role in many fields, where the analysis of extremely fast and faint luminous signals is required. In the life science, for instance, the estimation of fluorescence time-constants with picosecond accuracy has been leading to a deeper insight into many biological processes. Although the many advantages provided by TCSPC-based techniques, their intrinsically repetitive nature leads to a relatively long acquisition time, especially when time-resolved images are obtained by means of a single detector, along with a scanning point system. In the last decade, TCSPC acquisition systems have been subjected to a fast trend towards the parallelization of many independent channels, in order to speed up the measure. On one hand, some high-performance multi-module systems have been already made commercially available, but high area and power consumption of each module have limited the number of channels to only some units. On the other hand, many compact systems based on Single Photon Avalanche Diodes (SPAD) have been proposed in literature, featuring thousands of independent acquisition chains on a single chip. The integration of both detectors and conversion electronic in the same pixel area, though, has imposed tight constraints on power dissipation and area occupation of the electronics, resulting in a tradeoff with performance, both in terms of differential nonlinearity and timing jitter. Furthermore, in the ideal case of simultaneous readout of a huge number of channels, the overall data rate can be as high as 100 Gbit/s, which is nowadays too high to be easily processed in real time by a PC. Typical adopted solutions involve an arbitrary dwell time, followed by a sequential readout of the converters, thus limiting the maximum operating frequency of each channel and impairing the measurement speed, which still lies well below the limit imposed by the saturation of the

  4. Specific detection of oxytetracycline using DNA aptamer-immobilized interdigitated array electrode chip

    Energy Technology Data Exchange (ETDEWEB)

    Kim, Yeon Seok; Niazi, Javed H [School of Life Sciences and Biotechnology, Korea University, Anam-dong, Seongbuk-gu, Seoul 136-701 (Korea, Republic of); Gu, Man Bock [School of Life Sciences and Biotechnology, Korea University, Anam-dong, Seongbuk-gu, Seoul 136-701 (Korea, Republic of)], E-mail: mbgu@korea.ac.kr

    2009-02-23

    An electrochemical sensing system for oxytetracycline (OTC) detection was developed using ssDNA aptamer immobilized on gold interdigitated array (IDA) electrode chip. A highly specific ssDNA aptamer that bind to OTC with high affinity was employed to discriminate other tetracyclines (TCs), such as doxycycline (DOX) and tetracycline (TET). The immobilized thiol-modified aptamer on gold electrode chip served as a biorecognition element for the target molecules and the electrochemical signals generated from interactions between the aptamers and the target molecules was evaluated by cyclic voltammetry (CV) and square wave voltammetry (SWV). The current decrease due to the interference of bound OTC, DOX or TET was analyzed with the electron flow produced by a redox reaction between ferro- and ferricyanide. The specificity of developed EC-biosensor for OTC was highly distinguishable from the structurally similar antibiotics (DOX and TET). The dynamic range was determined to be 1-100 nM of OTC concentration in semi-logarithmic coordinates.

  5. Specific detection of oxytetracycline using DNA aptamer-immobilized interdigitated array electrode chip

    International Nuclear Information System (INIS)

    Kim, Yeon Seok; Niazi, Javed H.; Gu, Man Bock

    2009-01-01

    An electrochemical sensing system for oxytetracycline (OTC) detection was developed using ssDNA aptamer immobilized on gold interdigitated array (IDA) electrode chip. A highly specific ssDNA aptamer that bind to OTC with high affinity was employed to discriminate other tetracyclines (TCs), such as doxycycline (DOX) and tetracycline (TET). The immobilized thiol-modified aptamer on gold electrode chip served as a biorecognition element for the target molecules and the electrochemical signals generated from interactions between the aptamers and the target molecules was evaluated by cyclic voltammetry (CV) and square wave voltammetry (SWV). The current decrease due to the interference of bound OTC, DOX or TET was analyzed with the electron flow produced by a redox reaction between ferro- and ferricyanide. The specificity of developed EC-biosensor for OTC was highly distinguishable from the structurally similar antibiotics (DOX and TET). The dynamic range was determined to be 1-100 nM of OTC concentration in semi-logarithmic coordinates

  6. A digitalising board for the prototype array of LHAASO WCDA

    International Nuclear Information System (INIS)

    Hao Xinjun; Liu Shubin; Zhao Lei; An Qi

    2011-01-01

    In this paper, a digitalising board for readout of PMT signals in the prototype array of WCDA (water Cerenkov detector array) for LHAASO (Large high altitude air shower observatory)is designed. The prototype array is composed of 9 PMTs, including the pulse time and charge measurement from the PMTs, and clock generation and trigger decision. In the digitalising board, FPGA reconfiguration and data readout via VME bus are implemented. Test results show that the performances meet well with the requirements of readout electronics. It has been installed in Yangbajing and tests with the prototype array and DAQ is ongoing. (authors)

  7. Development of high performance readout ASICs for silicon photomultipliers (SiPMs)

    International Nuclear Information System (INIS)

    Shen, Wei

    2012-01-01

    Silicon Photomultipliers (SiPMs) are novel kind of solid state photon detectors with extremely high photon detection resolution. They are composed of hundreds or thousands of avalanche photon diode pixels connected in parallel. These avalanche photon diodes are operated in Geiger Mode. SiPMs have the same magnitude of multiplication gain compared to the conventional photomultipliers (PMTs). Moreover, they have a lot of advantages such as compactness, relatively low bias voltage and magnetic field immunity etc. Special readout electronics are required to preserve the high performance of the detector. KLauS and STiC are two CMOS ASIC chips designed in particular for SiPMs. KLauS is used for SiPM charge readout applications. Since SiPMs have a much larger detector capacitance compared to other solid state photon detectors such as PIN diodes and APDs, a few special techniques are used inside the chip to make sure a descent signal to noise ratio for pixel charge signal can be obtained. STiC is a chip dedicated to SiPM time-of-flight applications. High bandwidth and low jitter design schemes are mandatory for such applications where time jitter less than tens of picoseconds is required. Design schemes and error analysis as well as measurement results are presented in the thesis.

  8. NeuroSeek dual-color image processing infrared focal plane array

    Science.gov (United States)

    McCarley, Paul L.; Massie, Mark A.; Baxter, Christopher R.; Huynh, Buu L.

    1998-09-01

    Several technologies have been developed in recent years to advance the state of the art of IR sensor systems including dual color affordable focal planes, on-focal plane array biologically inspired image and signal processing techniques and spectral sensing techniques. Pacific Advanced Technology (PAT) and the Air Force Research Lab Munitions Directorate have developed a system which incorporates the best of these capabilities into a single device. The 'NeuroSeek' device integrates these technologies into an IR focal plane array (FPA) which combines multicolor Midwave IR/Longwave IR radiometric response with on-focal plane 'smart' neuromorphic analog image processing. The readout and processing integrated circuit very large scale integration chip which was developed under this effort will be hybridized to a dual color detector array to produce the NeuroSeek FPA, which will have the capability to fuse multiple pixel-based sensor inputs directly on the focal plane. Great advantages are afforded by application of massively parallel processing algorithms to image data in the analog domain; the high speed and low power consumption of this device mimic operations performed in the human retina.

  9. Front-end electronics and readout system for the ILD TPC

    CERN Document Server

    Hedberg, V; Lundberg, B; Mjörnmark, U; Oskarsson, A; Österman, L; De Lentdecker, G; Yang, Y; Zhang, F

    2015-01-01

    A high resolution TPC is the main option for a central tracking detector at the future International Linear Collider (ILC). It is planned that the MPGD (Micro Pattern Gas Detector) technology will be used for the readout. A Large Prototype TPC at DESY has been used to test the performance of MPGDs in an electron beam of energies up to 6 GeV. The first step in the technology development was to demonstrate that the MPGDs are able to achieve the necessary performance set by the goals of ILC. For this ’proof of principle’ phase, the ALTRO front-end electronics from the ALICE TPC was used, modified to adapt to MPGD readout. The proof of principle has been verified and at present further improvement of the MPGD technology is going on, using the same readout electronics. The next step is the ’feasibility phase’, which aims at producing front-end electronics comparable in size (few mm2) to the readout pads of the TPC. This development work is based on the succeeding SALTRO16 chip, which combines the analogue ...

  10. A multichannel front end ASIC for PMT readout in LHAASO WCDA

    Science.gov (United States)

    Liang, Y.; Zhao, L.; Guo, Y.; Qin, J.; Yang, Y.; Cheng, B.; Liu, S.; An, Q.

    2018-01-01

    Time and charge measurements over a large dynamic range from 1 Photo Electron (P.E.) to 4000 P.E. are required for the Water Cherenkov Detector Array (WCDA), which is one of the key components in the Large High Altitude Air Shower Observatory (LHAASO). To simplify the circuit structure of the readout electronics, a front end ASIC was designed. Based on the charge-to-time conversion method, the output pulse width of the ASIC corresponds to the input signal charge information while time information of the input signal is picked off through a discriminator, and thus the time and charge information can be digitized simultaneously using this ASIC and a following Time-to-Digital Converter (TDC). To address the challenge of mismatch among the channels observed in the previous prototype version, this work presents approaches for analyzing the problem and optimizing the circuits. A new version of the ASIC was designed and fabricated in the GLOBALFOUNDRIES 0.35 μm CMOS technology, which integrates 6 channels (corresponding to the readout of the 3 PMTs) in each chip. The test results indicate that the mismatch between the channels is significantly reduced to less than 20% using the proposed approach. The time measurement resolution better than 300 ps is achieved, and the charge measurement resolution is better than 10% at 1 P.E., and 1% at 4000 P.E., which meets the application requirements.

  11. Silicon μ-strip detectors with SVX chip readout

    International Nuclear Information System (INIS)

    Brueckner, W.; Dropmann, F.; Godbersen, M.; Konorov, I.; Koenigsmann, K.; Newsom, C.; Paul, S.; Povh, B.; Russ, J.; Timm, S.; Vorwalter, K.; Werding, R.

    1994-01-01

    A new silicon strip detector has been designed and constructed for a fixed target experiment at CERN. The system of about 30 000 channels is equipped with SVX chips and read out via a double buffer into Fastbus memory. Construction and performance during the actual data taking run are discussed. ((orig.))

  12. Sub-10ps monolithic and low-power photodetector readout

    International Nuclear Information System (INIS)

    Varner, Gary S.; Ruckman, Larry L.

    2009-01-01

    Recent advances in photon detectors have resulted in high-density imaging arrays that offer many performance and cost advantages. In particular, the excellent transit time spread of certain devices show promise to provide tangible benefits in applications such as Positron Emission Tomography (PET). Meanwhile, high-density, high-performance readout techniques have not kept on pace for exploiting these developments. Photodetector readout for next generation high event rate particle identification and time-resolved PET requires a highly-integrated, low-power, and cost-effective readout technique. We propose fast waveform sampling as a method that meets these criteria and demonstrate that sub-10ps resolution can be obtained for an existing device

  13. Sub-10ps monolithic and low-power photodetector readout

    Energy Technology Data Exchange (ETDEWEB)

    Varner, Gary S.; Ruckman, Larry L.

    2009-02-20

    Recent advances in photon detectors have resulted in high-density imaging arrays that offer many performance and cost advantages. In particular, the excellent transit time spread of certain devices show promise to provide tangible benefits in applications such as Positron Emission Tomography (PET). Meanwhile, high-density, high-performance readout techniques have not kept on pace for exploiting these developments. Photodetector readout for next generation high event rate particle identification and time-resolved PET requires a highly-integrated, low-power, and cost-effective readout technique. We propose fast waveform sampling as a method that meets these criteria and demonstrate that sub-10ps resolution can be obtained for an existing device.

  14. A Medipix3 readout system based on the National Instruments FlexRIO card and using the LabVIEW programming environment

    Science.gov (United States)

    Horswell, I.; Gimenez, E. N.; Marchal, J.; Tartoni, N.

    2011-01-01

    Hybrid silicon photon-counting detectors are becoming standard equipment for many synchrotron applications. The latest in the Medipix family of read-out chips designed as part of the Medipix Collaboration at CERN is the Medipix3, which while maintaining the same pixel size as its predecessor, offers increased functionality and operating modes. The active area of the Medipix3 chip is approx 14mm × 14mm (containing 256 × 256 pixels) which is not large enough for many detector applications, this results in the need to tile many sensors and chips. As a first step on the road to develop such a detector, it was decided to build a prototype single chip readout system to gain the necessary experience in operating a Medipix3 chip. To provide a flexible learning and development tool it was decided to build an interface based on the recently released FlexRIOTM system from National Instruments and to use the LabVIEWTM graphical programming environment. This system and the achieved performance are described in this paper.

  15. Progress report on the use of hybrid silicon pin diode arrays in high energy physics

    International Nuclear Information System (INIS)

    Shapiro, S.L.; Jernigan, J.G.; Arens, J.F.

    1990-05-01

    We report on the successful effort to develop hybrid PIN diode arrays and to demonstrate their potential as components of vertex detectors. Hybrid pixel arrays have been fabricated by the Hughes Aircraft Co. by bump-bonding readout chips developed by Hughes to an array of PIN diodes manufactured by Micron Semiconductor Inc. These hybrid pixel arrays were constructed in two configurations. One array format has 10 x 64 pixels, each 120 μm square; and the other format has 256 x 156 pixels, each 30 μm square. In both cases, the thickness of the PIN diode layer is 300 μm. Measurements of detector performance show that excellent position resolution can be achieved by interpolation. By determining the centroid of the charge cloud which spreads charge into a number of neighboring pixels, a spatial resolution of a few microns has been attained. The noise has been measured to be about 300 electrons (rms) at room temperature, as expected from KTC and dark current considerations, yielding a signal-to-noise ratio of about 100 for minimum ionizing particles. 4 refs., 17 figs

  16. An integrated circuit with transmit beamforming flip-chip bonded to a 2-D CMUT array for 3-D ultrasound imaging.

    Science.gov (United States)

    Wygant, Ira O; Jamal, Nafis S; Lee, Hyunjoo J; Nikoozadeh, Amin; Oralkan, Omer; Karaman, Mustafa; Khuri-Yakub, Butrus T

    2009-10-01

    State-of-the-art 3-D medical ultrasound imaging requires transmitting and receiving ultrasound using a 2-D array of ultrasound transducers with hundreds or thousands of elements. A tight combination of the transducer array with integrated circuitry eliminates bulky cables connecting the elements of the transducer array to a separate system of electronics. Furthermore, preamplifiers located close to the array can lead to improved receive sensitivity. A combined IC and transducer array can lead to a portable, high-performance, and inexpensive 3-D ultrasound imaging system. This paper presents an IC flip-chip bonded to a 16 x 16-element capacitive micromachined ultrasonic transducer (CMUT) array for 3-D ultrasound imaging. The IC includes a transmit beamformer that generates 25-V unipolar pulses with programmable focusing delays to 224 of the 256 transducer elements. One-shot circuits allow adjustment of the pulse widths for different ultrasound transducer center frequencies. For receiving reflected ultrasound signals, the IC uses the 32-elements along the array diagonals. The IC provides each receiving element with a low-noise 25-MHz-bandwidth transimpedance amplifier. Using a field-programmable gate array (FPGA) clocked at 100 MHz to operate the IC, the IC generated properly timed transmit pulses with 5-ns accuracy. With the IC flip-chip bonded to a CMUT array, we show that the IC can produce steered and focused ultrasound beams. We present 2-D and 3-D images of a wire phantom and 2-D orthogonal cross-sectional images (Bscans) of a latex heart phantom.

  17. Design and prototyping of a readout aggregation ASIC

    Energy Technology Data Exchange (ETDEWEB)

    Lemke, Frank; Schatral, Sven; Bruening, Ulrich [ZITI, Universitaet Heidelberg (Germany); Som, Indranil; Bhattacharyya, Tarun [Indian Institute of Technology, Kharagpur (India); Collaboration: CBM-Collaboration

    2015-07-01

    In close collaboration between the Indian Institute of Technology Kharagpur (IITKGP) and the Institute for Computer Engineering (ZITI) at the University of Heidelberg a readout aggregation ASIC was designed. This happened in the context of the Compressed Baryonic Matter (CBM) experiment at the Facility for Antiproton and Ion Research (FAIR). The ASIC is designed in 65nm TSMC technology. Its miniASIC tapeout to verify the analog and high-speed components is scheduled to the first quarter of 2015. This mixed-signal ASIC consists of a full-custom 5Gb/s serializer/deserializer, designed by the IITKGP including design elements such as phase-locked loop, bandgap reference, and clock data recovery, and a digital designed network communication and aggregation part designed by the ZITI. In addition, there are test structures and an I2C readout integrated to ease bring up and monitoring. A specialty of this test ASIC is the aggregation of links featuring different data rates, running with bundles of 500 MB/s LVDS. This enables flexible readout setups of mixed detectors respectively readout of various chips. As communication protocol, a unified link protocol is used including control messages, data messages, and synchronization messages on an identical lane. The design has been simulated, verified, and hardware emulated using Spartan 6 FPGAs.

  18. arXiv The MuPix System-on-Chip for the Mu3e Experiment

    CERN Document Server

    Augustin, Heiko

    2017-02-11

    Mu3e is a novel experiment searching for charged lepton flavor violation in the rare decay $\\mu^+ \\rightarrow e^+e^-e^+$. Decay vertex position, decay time and particle momenta have to be precisely measured in order to reject both accidental and physics background. A silicon pixel tracker based on $50\\,\\mu$m thin high voltage monolithic active pixel sensors (HV-MAPS) in a 1 T solenoidal magnetic field provides precise vertex and momentum information. The MuPix chip combines pixel sensor cells with integrated analog electronics and a periphery with a complete digital readout. The MuPix7 is the first HV-MAPS prototype implementing all functionalities of the final sensor including a readout state machine and high speed serialization with 1.25 Gbit/s data output, allowing for a streaming readout in parallel to the data taking. The observed efficiency of the MuPix7 chip including the full readout system is $\\geq99\\%$ in a high rate test beam.

  19. On-Chip Sorting of Long Semiconducting Carbon Nanotubes for Multiple Transistors along an Identical Array.

    Science.gov (United States)

    Otsuka, Keigo; Inoue, Taiki; Maeda, Etsuo; Kometani, Reo; Chiashi, Shohei; Maruyama, Shigeo

    2017-11-28

    Ballistic transport and sub-10 nm channel lengths have been achieved in transistors containing one single-walled carbon nanotube (SWNT). To fill the gap between single-tube transistors and high-performance logic circuits for the replacement of silicon, large-area, high-density, and purely semiconducting (s-) SWNT arrays are highly desired. Here we demonstrate the fabrication of multiple transistors along a purely semiconducting SWNT array via an on-chip purification method. Water- and polymer-assisted burning from site-controlled nanogaps is developed for the reliable full-length removal of metallic SWNTs with the damage to s-SWNTs minimized even in high-density arrays. All the transistors with various channel lengths show large on-state current and excellent switching behavior in the off-state. Since our method potentially provides pure s-SWNT arrays over a large area with negligible damage, numerous transistors with arbitrary dimensions could be fabricated using a conventional semiconductor process, leading to SWNT-based logic, high-speed communication, and other next-generation electronic devices.

  20. The ALICE Time of Flight Readout System AFRO

    CERN Document Server

    Kluge, A

    1999-01-01

    The ALICE Time of Flight Detector system comprises more than 100.000 channels and covers an area of more than 100 m2. The timing resolution should be better than 150 ps. This combination of requirements poses a major challenge to the readout system. All detector timing measurements are referenced to a unique start signal t0. This signal is generated at the time an event occurs. Timing measurements are performed using a multichannel TDC chip which requires a 40 MHz reference clock signal. The general concept of the readout system is based on a modular architecture. Detector cells are combined to modules of 1024 channels. Each of these modules can be read out and calibrated independently from each other. By distributing a reference signal, a timing relationship between the modules is established. This reference signal can either be the start signal t0 or the TDC-reference clock. The readout architecture is divided into three steps; the TDC controller, the module controller, and the time of flight controller. Th...

  1. MKID digital readout tuning with deep learning

    Science.gov (United States)

    Dodkins, R.; Mahashabde, S.; O'Brien, K.; Thatte, N.; Fruitwala, N.; Walter, A. B.; Meeker, S. R.; Szypryt, P.; Mazin, B. A.

    2018-04-01

    Microwave Kinetic Inductance Detector (MKID) devices offer inherent spectral resolution, simultaneous read out of thousands of pixels, and photon-limited sensitivity at optical wavelengths. Before taking observations the readout power and frequency of each pixel must be individually tuned, and if the equilibrium state of the pixels change, then the readout must be retuned. This process has previously been performed through manual inspection, and typically takes one hour per 500 resonators (20 h for a ten-kilo-pixel array). We present an algorithm based on a deep convolution neural network (CNN) architecture to determine the optimal bias power for each resonator. The bias point classifications from this CNN model, and those from alternative automated methods, are compared to those from human decisions, and the accuracy of each method is assessed. On a test feed-line dataset, the CNN achieves an accuracy of 90% within 1 dB of the designated optimal value, which is equivalent accuracy to a randomly selected human operator, and superior to the highest scoring alternative automated method by 10%. On a full ten-kilopixel array, the CNN performs the characterization in a matter of minutes - paving the way for future mega-pixel MKID arrays.

  2. Preparation of a Superhydrophobic and Peroxidase-like Activity Array Chip for H2O2 Sensing by Surface-Enhanced Raman Scattering.

    Science.gov (United States)

    Yu, Zhi; Park, Yeonju; Chen, Lei; Zhao, Bing; Jung, Young Mee; Cong, Qian

    2015-10-28

    In this paper, we propose a novel and simple method for preparing a dual-biomimetic functional array possessing both superhydrophobic and peroxidase-like activity that can be used for hydrogen peroxide (H2O2) sensing. The proposed method is an integration innovation that combines the above two properties and surface-enhanced Raman scattering (SERS). We integrated a series of well-ordered arrays of Au points (d = 1 mm) onto a superhydrophobic copper (Cu)/silver (Ag) surface by replicating an arrayed molybdenum template. Instead of using photoresists and the traditional lithography method, we utilized a chemical etching method (a substitution reaction between Cu and HAuCl4) with a Cu/Ag superhydrophobic surface as the barrier layer, which has the benefit of water repellency. The as-prepared Au points were observed to possess peroxidase-like activity, allowing for catalytic oxidation of the chromogenic molecule o-phenylenediamine dihydrochloride (OPD). Oxidation was evidenced by a color change in the presence of H2O2, which allows the array chip to act as an H2O2 sensor. In this study, the water repellency of the superhydrophobic surface was used to fabricate the array chip and increase the local reactant concentration during the catalytic reaction. As a result, the catalytic reaction occurred when only 2 μL of an aqueous sample (OPD/H2O2) was placed onto the Au point, and the enzymatic product, 2,3-diaminophenazine, showed a SERS signal distinguishable from that of OPD after mixing with 2 μL of colloidal Au. Using the dual-biomimetic functional array chip, quantitative analysis of H2O2 was performed by observing the change in the SERS spectra, which showed a concentration-dependent behavior for H2O2. This method allows for the detection of H2O2 at concentrations as low as 3 pmol per 2 μL of sample, which is a considerable advantage in H2O2 analysis. The as-prepared substrate was convenient for H2O2 detection because only a small amount of sample was required in

  3. FILTRES: a 128 channels VLSI mixed front-end readout electronic development for microstrip detectors

    International Nuclear Information System (INIS)

    Anstotz, F.; Hu, Y.; Michel, J.; Sohler, J.L.; Lachartre, D.

    1998-01-01

    We present a VLSI digital-analog readout electronic chain for silicon microstrip detectors. The characteristics of this circuit have been optimized for the high resolution tracker of the CERN CMS experiment. This chip consists of 128 channels at 50 μm pitch. Each channel is composed by a charge amplifier, a CR-RC shaper, an analog memory, an analog processor, an output FIFO read out serially by a multiplexer. This chip has been processed in the radiation hard technology DMILL. This paper describes the architecture of the circuit and presents test results of the 128 channel full chain chip. (orig.)

  4. Performance of the new amplifier-shaper-discriminator chip for the ATLAS MDT chambers at the HL-LHC

    CERN Document Server

    INSPIRE-00218480

    2016-01-01

    The Phase-II Upgrade of the ATLAS Muon Detector requires new electronics for the readout of the MDT drift tubes. The first processing stage, the Amplifier-Shaper-Discriminator (ASD), determines the performance of the readout for crucial parameters like time resolution, gain uniformity, efficiency and noise rejection. An 8-channel ASD chip, using the IBM 130 nm CMOS 8RF-DM technology, has been designed, produced and tested. The area of the chip is 2.2 x 2.9 square mm size. We present results of detailed measurements as well as a comparision with simulation results of the chip behaviour at three different levels of detail.

  5. A Zirconium Dioxide Ammonia Microsensor Integrated with a Readout Circuit Manufactured Using the 0.18 μm CMOS Process

    Directory of Open Access Journals (Sweden)

    Ming-Zhi Yang

    2013-03-01

    Full Text Available The study presents an ammonia microsensor integrated with a readout circuit on-a-chip fabricated using the commercial 0.18 μm complementary metal oxide semiconductor (CMOS process. The integrated sensor chip consists of a heater, an ammonia sensor and a readout circuit. The ammonia sensor is constructed by a sensitive film and the interdigitated electrodes. The sensitive film is zirconium dioxide that is coated on the interdigitated electrodes. The heater is used to provide a working temperature to the sensitive film. A post-process is employed to remove the sacrificial layer and to coat zirconium dioxide on the sensor. When the sensitive film adsorbs or desorbs ammonia gas, the sensor produces a change in resistance. The readout circuit converts the resistance variation of the sensor into the output voltage. The experiments show that the integrated ammonia sensor has a sensitivity of 4.1 mV/ppm.

  6. Large-scale analysis of antisense transcription in wheat using the Affymetrix GeneChip Wheat Genome Array

    Directory of Open Access Journals (Sweden)

    Settles Matthew L

    2009-05-01

    Full Text Available Abstract Background Natural antisense transcripts (NATs are transcripts of the opposite DNA strand to the sense-strand either at the same locus (cis-encoded or a different locus (trans-encoded. They can affect gene expression at multiple stages including transcription, RNA processing and transport, and translation. NATs give rise to sense-antisense transcript pairs and the number of these identified has escalated greatly with the availability of DNA sequencing resources and public databases. Traditionally, NATs were identified by the alignment of full-length cDNAs or expressed sequence tags to genome sequences, but an alternative method for large-scale detection of sense-antisense transcript pairs involves the use of microarrays. In this study we developed a novel protocol to assay sense- and antisense-strand transcription on the 55 K Affymetrix GeneChip Wheat Genome Array, which is a 3' in vitro transcription (3'IVT expression array. We selected five different tissue types for assay to enable maximum discovery, and used the 'Chinese Spring' wheat genotype because most of the wheat GeneChip probe sequences were based on its genomic sequence. This study is the first report of using a 3'IVT expression array to discover the expression of natural sense-antisense transcript pairs, and may be considered as proof-of-concept. Results By using alternative target preparation schemes, both the sense- and antisense-strand derived transcripts were labeled and hybridized to the Wheat GeneChip. Quality assurance verified that successful hybridization did occur in the antisense-strand assay. A stringent threshold for positive hybridization was applied, which resulted in the identification of 110 sense-antisense transcript pairs, as well as 80 potentially antisense-specific transcripts. Strand-specific RT-PCR validated the microarray observations, and showed that antisense transcription is likely to be tissue specific. For the annotated sense

  7. Pulseshape characteristics of a 300 $\\mu$m PR03 R-measuring VELO sensor read out with a Beetle1.3 chip

    CERN Document Server

    Palacios, A; Buytaert, J; Borel, J; Collins, P; Eckstein, D; Eklund, L; Ferro-Luzzi, M; Jans, E; Ketel, T; Petrie, D; Pivk, M; Tobin, M

    2005-01-01

    The signal-to-noise, overspill and undershoot characteristics of a VELO module equipped with Beetle1.3 read-out chips have been measured using 120 GeV pions from the SPS test beam facility at CERN. The module consists of a PR03 n-on-n 300 $\\mu$m R measuring prototype sensor and a fully populated K03 hybrid. Results are presented for a single Beetle1.3 chip with a variety of chip parameter settings controlling the pre-amplifier and shaper currents and feedback voltages, with the objective of establishing the performance of the module and understanding its dependence on the read-out chip settings.

  8. Cryogenic readout techniques for germanium detectors

    Energy Technology Data Exchange (ETDEWEB)

    Benato, G. [University of Zurich, (Switzerland); Cattadori, C. [INFN - Milano Bicocca, (Italy); Di Vacri, A. [INFN LNGS, (Italy); Ferri, E. [Universita Milano Bicocca/INFN Milano Bicocca, (Italy); D' Andrea, V.; Macolino, C. [GSSI/INFN LNGS, (Italy); Riboldi, S. [Universita degli Studi di Milano/INFN Milano, (Italy); Salamida, F. [Universita Milano Bicocca/INFN Milano Bicocca, (Italy)

    2015-07-01

    High Purity Germanium detectors are used in many applications, from nuclear and astro-particle physics, to homeland security or environment protection. Although quite standard configurations are often used, with cryostats, charge sensitive amplifiers and analog or digital acquisition systems all commercially available, it might be the case that a few specific applications, e.g. satellites, portable devices, cryogenic physics experiments, etc. also require the development of a few additional or complementary techniques. An interesting case is for sure GERDA, the Germanium Detector Array experiment, searching for neutrino-less double beta decay of {sup 76}Ge at the Gran Sasso National Laboratory of INFN - Italy. In GERDA the entire detector array, composed of semi-coaxial and BEGe naked crystals, is operated suspended inside a cryostat filled with liquid argon, that acts not only as cooling medium and but also as an active shield, thanks to its scintillation properties. These peculiar circumstances, together with the additional requirement of a very low radioactive background from all the materials adjacent to the detectors, clearly introduce significant constraints on the design of the Ge front-end readout electronics. All the Ge readout solutions developed within the framework of the GERDA collaboration, for both Phase I and Phase II, will be briefly reviewed, with their relative strength and weakness compared together and with respect to ideal Ge readout. Finally, the digital processing techniques developed by the GERDA collaboration for energy estimation of Ge detector signals will be recalled. (authors)

  9. The readout and control system of the mid-size telescope prototype of the Cherenkov telescope array

    International Nuclear Information System (INIS)

    Oya, I; Anguner, O; Birsin, E; Schwanke, U; Behera, B; Melkumyan, D; Schmidt, T; Sternberger, R; Wegner, P; Wiesand, S; Fuessling, M

    2014-01-01

    The Cherenkov Telescope Array (CTA) is one of the major ground-based astronomy projects being pursued and will be the largest facility for ground-based y-ray observations ever built. CTA will consist of two arrays: one in the Northern hemisphere composed of about 20 telescopes, and the other one in the Southern hemisphere composed of about 100 telescopes, both arrays containing telescopes of different type and size. A prototype for the Mid-Size Telescope (MST) with a diameter of 12 m has been installed in Berlin and is currently being commissioned. This prototype is composed of a mechanical structure, a drive system and mirror facets mounted with powered actuators to enable active control. Five Charge-Coupled Device (CCD) cameras, and a wide set of sensors allow the evaluation of the performance of the instrument. The design of the control software is following concepts and tools under evaluation within the CTA consortium in order to provide a realistic test-bed for the middleware: 1) The readout and control system for the MST prototype is implemented with the Atacama Large Millimeter/submillimeter Array (ALMA) Common Software (ACS) distributed control middleware; 2) the OPen Connectivity-Unified Architecture (OPC UA) is used for hardware access; 3) the document oriented MongoDB database is used for an efficient storage of CCD images, logging and alarm information: and 4) MySQL and MongoDB databases are used for archiving the slow control monitoring data and for storing the operation configuration parameters. In this contribution, the details of the implementation of the control system for the MST prototype telescope are described.

  10. The readout and control system of the mid-size telescope prototype of the Cherenkov Telescope Array

    Science.gov (United States)

    Oya, I.; Anguner, O.; Behera, B.; Birsin, E.; Fuessling, M.; Melkumyan, D.; Schmidt, T.; Schwanke, U.; Sternberger, R.; Wegner, P.; Wiesand, S.; Cta Consortium,the

    2014-06-01

    The Cherenkov Telescope Array (CTA) is one of the major ground-based astronomy projects being pursued and will be the largest facility for ground-based y-ray observations ever built. CTA will consist of two arrays: one in the Northern hemisphere composed of about 20 telescopes, and the other one in the Southern hemisphere composed of about 100 telescopes, both arrays containing telescopes of different type and size. A prototype for the Mid-Size Telescope (MST) with a diameter of 12 m has been installed in Berlin and is currently being commissioned. This prototype is composed of a mechanical structure, a drive system and mirror facets mounted with powered actuators to enable active control. Five Charge-Coupled Device (CCD) cameras, and a wide set of sensors allow the evaluation of the performance of the instrument. The design of the control software is following concepts and tools under evaluation within the CTA consortium in order to provide a realistic test-bed for the middleware: 1) The readout and control system for the MST prototype is implemented with the Atacama Large Millimeter/submillimeter Array (ALMA) Common Software (ACS) distributed control middleware; 2) the OPen Connectivity-Unified Architecture (OPC UA) is used for hardware access; 3) the document oriented MongoDB database is used for an efficient storage of CCD images, logging and alarm information: and 4) MySQL and MongoDB databases are used for archiving the slow control monitoring data and for storing the operation configuration parameters. In this contribution, the details of the implementation of the control system for the MST prototype telescope are described.

  11. 5A Zirconium Dioxide Ammonia Microsensor Integrated with a Readout Circuit Manufactured Using the 0.18 μm CMOS Process

    Science.gov (United States)

    Lin, Guan-Ming; Dai, Ching-Liang; Yang, Ming-Zhi

    2013-01-01

    The study presents an ammonia microsensor integrated with a readout circuit on-a-chip fabricated using the commercial 0.18 μm complementary metal oxide semiconductor (CMOS) process. The integrated sensor chip consists of a heater, an ammonia sensor and a readout circuit. The ammonia sensor is constructed by a sensitive film and the interdigitated electrodes. The sensitive film is zirconium dioxide that is coated on the interdigitated electrodes. The heater is used to provide a working temperature to the sensitive film. A post-process is employed to remove the sacrificial layer and to coat zirconium dioxide on the sensor. When the sensitive film adsorbs or desorbs ammonia gas, the sensor produces a change in resistance. The readout circuit converts the resistance variation of the sensor into the output voltage. The experiments show that the integrated ammonia sensor has a sensitivity of 4.1 mV/ppm. PMID:23503294

  12. Rutherford X-ray spectrometer readout

    International Nuclear Information System (INIS)

    Bateman, J.E.

    1978-07-01

    Rutherford electronic X-ray spectrometer readout is based on the combination of two established techniques (a) the detection and location of soft X-rays by means of multichannel electron multiplier arrays (MCP's), and (b) the electronic readout of charge distributions (generally in multi-wire proportional counters) by means of the delay line techniques. In order for the latter device to function well a charge signal of approximately 10 6 electrons must be available to the delay line wand. This is achieved in the present device by means of two cascaded MCP's which can produce electron gains up to approximately 10 8 , and so operate the delay line from the single electron pulses generated at the front face of an MCP by a soft X-ray. The delay line readout technique was chosen because of its simplicity (both in terms of the necessary hardware and the associated electronics), robustness, and ease of implementation. In order to achieve the target spatial resolution of 50 μm (fwhm) or 20 μm (standard deviation) it was necessary to adapt the charge collection system so that the readout takes place from a length of delay line 200 mm long. The general layout of the system and the functions of the electronic circuits are described. Performance testing, setting up procedures and trouble shooting of the system are discussed. (U.K.)

  13. Tunable on chip optofluidic laser

    DEFF Research Database (Denmark)

    Bakal, Avraham; Vannahme, Christoph; Kristensen, Anders

    2016-01-01

    On chip tunable laser is demonstrated by realizing a microfluidic droplet array. The periodicity is controlled by the pressure applied to two separate inlets, allowing to tune the lasing frequency over a broad spectral range.......On chip tunable laser is demonstrated by realizing a microfluidic droplet array. The periodicity is controlled by the pressure applied to two separate inlets, allowing to tune the lasing frequency over a broad spectral range....

  14. In situ synthesis of protein arrays.

    Science.gov (United States)

    He, Mingyue; Stoevesandt, Oda; Taussig, Michael J

    2008-02-01

    In situ or on-chip protein array methods use cell free expression systems to produce proteins directly onto an immobilising surface from co-distributed or pre-arrayed DNA or RNA, enabling protein arrays to be created on demand. These methods address three issues in protein array technology: (i) efficient protein expression and availability, (ii) functional protein immobilisation and purification in a single step and (iii) protein on-chip stability over time. By simultaneously expressing and immobilising many proteins in parallel on the chip surface, the laborious and often costly processes of DNA cloning, expression and separate protein purification are avoided. Recently employed methods reviewed are PISA (protein in situ array) and NAPPA (nucleic acid programmable protein array) from DNA and puromycin-mediated immobilisation from mRNA.

  15. CdTe layer structures for X-ray and gamma-ray detection directly grown on the Medipix readout-chip by MBE

    Science.gov (United States)

    Vogt, A.; Schütt, S.; Frei, K.; Fiederle, M.

    2017-11-01

    This work investigates the potential of CdTe semiconducting layers used for radiation detection directly deposited on the Medipix readout-chip by MBE. Due to the high Z-number of CdTe and the low electron-hole pair creation energy a thin layer suffices for satisfying photon absorption. The deposition takes place in a modified MBE system enabling growth rates up to 10 μm/h while the UHV conditions allow the required high purity for detector applications. CdTe sensor layers deposited on silicon substrates show resistivities up to 5.8 × 108 Ω cm and a preferred (1 1 1) orientation. However, the resistivity increases with higher growth temperature and the orientation gets more random. Additionally, the deposition of a back contact layer sequence in one process simplifies the complex production of an efficient contact on CdTe with aligned work functions. UPS measurements verify a decrease of the work function of 0.62 eV induced by Te doping of the CdTe.

  16. Life test of the InGaAs focal plane arrays detector for space applications

    Science.gov (United States)

    Zhu, Xian-Liang; Zhang, Hai-Yan; Li, Xue; Huang, Zhang-Cheng; Gong, Hai-Mei

    2017-08-01

    The short-wavelength infrared (SWIR) InGaAs focal plane array (FPA) detector consists of infrared detector chip, readout integrated circuit (ROIC), and flip-chip bonding interconnection by Indium bump. In order to satisfy space application requirements for failure rates or Mean Time to Failure (MTTF), which can only be demonstrated with the large number of detectors manufactured, the single pixel in InGaAs FPAs was chosen as the research object in this paper. The constant-stress accelerated life tests were carried out at 70°C 80°C 90°C and100°C. The failed pixels increased gradually during more than 14000 hours at each elevated temperatures. From the random failure data the activation energy was estimated to be 0.46eV, and the average lifetime of a single pixel in InGaAs FPAs was estimated to be longer than 1E+7h at the practical operating temperature (5°C).

  17. Proposed differential-frequency-readout system by hysteretic Josephson junctions

    International Nuclear Information System (INIS)

    Wang, L.Z.; Duncan, R.V.

    1992-01-01

    The Josephson relation V=nhν/2e has been verified experimentally to 3 parts in 10 19 [A. K. Jain, J. E. Lukens, and J.-S. Tsai, Phys. Rev. Lett. 58, 1165 (1987)]. Motivated by this result, we propose a differential-frequency-readout system by two sets of hysteretic Josephson junctions rf biased at millimeter wavelengths. Because of the Josephson relation, the proposed differential-frequency-readout system is not limited by photon fluctuation, which limits most photon-detection schemes. In the context of the Stewart-McCumber model [W. C. Stewart, Appl. Phys. Lett. 12, 277 (1968); D. E. McCumber, J. Appl. Phys. 39, 3113 (1968)] of Josephson junctions, we show theoretically that the differential frequency of the two milliwave biases can be read out by the proposed system to unprecedented accuracy. The stability of the readout scheme is also discussed. The measurement uncertainty of the readout system resulting from the intrinsic thermal noise in the hysteretic junctions is shown to be insignificant. The study of two single junctions can be extended to two sets of Josephson junctions connected in series (series array) in this measurement scheme provided that junctions are separated by at least 10 μm [D. W. Jillie, J. E. Lukens, and Y. H. Kao, Phys. Rev. Lett. 38, 915 (1977)]. The sensitivity for the differential frequency detection may be increased by biasing both series arrays to a higher constant-voltage step

  18. Dead Time in the LAr Calorimeter Front-End Readout

    CERN Document Server

    Gingrich, D M

    2002-01-01

    We present readout time, latency, buffering, and dead-time calculations for the switched capacitor array controllers of the LAr calorimeter. The dead time is compared with algorithms for the dead-time generation in the level-1 central trigger processor.

  19. Initial beam test results from a silicon-strip detector with VLSI readout

    International Nuclear Information System (INIS)

    Adolphsen, C.; Litke, A.; Schwarz, A.

    1986-01-01

    Silicon detectors with 256 strips, having a pitch of 25 μm, and connected to two 128 channel NMOS VLSI chips each (Microplex), have been tested in relativistic charged particle beams at CERN and at the Stanford Linear Accelerator Center. The readout chips have an input channel pitch of 47.5 μm and a single multiplexed output which provides voltages proportional to the integrated charge from each strip. The most probable signal height from minimum ionizing tracks was 15 times the rms noise in any single channel. Two-track traversals with a separation of 100 μm were cleanly resolved

  20. Test vehicles for CMS HGCAL readout ASIC

    CERN Document Server

    Thienpont, Damien

    2017-01-01

    This paper presents first measurement results of two test vehicles ASIC embedding some building blocks for the future CMS High Granularity CALorimeter (HGCAL) read-out ASIC. They were fabricated in CMOS 130 nm, in order to first design the Analog and Mixed-Signal blocks before going to a complete and complex chip. Such a circuit needs to achieve low noise high dynamic range charge measurement and 20 ps resolution timing capability. The results show good analog performance but with higher noise levels compared to simulations. We present the results of the preamplifiers, shapers and ADCs.

  1. An optical fiber-based flexible readout system for micro-pattern gas detectors

    Science.gov (United States)

    Li, C.; Feng, C. Q.; Zhu, D. Y.; Liu, S. B.; An, Q.

    2018-04-01

    This paper presents an optical fiber-based readout system that is intended to provide a general purpose multi-channel readout solution for various Micro-Pattern Gas Detectors (MPGDs). The proposed readout system is composed of several front-end cards (FECs) and a data collection module (DCM). The FEC exploits the capability of an existing 64-channel generic TPC readout ASIC chip, named AGET, to implement 256 channels readout. AGET offers FEC a large flexibility in gain range (4 options from 120 fC to 10 pC), peaking time (16 options from 50 ns to 1 us) and sampling freqency (100 MHz max.). The DCM contains multiple 1 Gbps optical fiber serial link interfaces that allow the system scaling up to 1536 channels with 6 FECs and 1 DCM. Further scaling up is possible through cascading of multiple DCMs, by configuring one DCM as a master while other DCMs in slave mode. This design offers a rapid readout solution for different application senario. Tests indicate that the nonlinearity of each channel is less than 1%, and the equivalent input noise charge is typically around 0.7 fC in RMS (root mean square), with a noise slope of about 0.01 fC/pF. The system level trigger rate limit is about 700 Hz in all channel readout mode. When in hit channel readout mode, supposing that typically 10 percent of channels are fired, trigger rate can go up to about 7 kHz. This system has been tested with Micromegas detector and GEM detector, confirming its capability in MPGD readout. Details of hardware and FPGA firmware design, as well as system performances, are described in the paper.

  2. Development of a customized SSC pixel detector readout for vertex tracking

    International Nuclear Information System (INIS)

    Barkan, O.; Atlas, E.L.; Marking, W.L.; Worley, S.; Yacoub, G.Y.; Kramer, G.; Arens, J.F.; Jernigan, J.G.; Shapiro, S.L.; Nygren, D.; Spieler, H.; Wright, M.

    1990-01-01

    The authors describe the readout architecture and progress to date in the development of hybrid PIN diode arrays for use as vertex detectors in the SSC environment. The architecture supports a self-timed mechanism for time stamping hit pixels, storing their xy coordinates and later selectively reading out only those pixels containing interesting data along with their coordinates. The peripheral logic resolves ambiguous pixel ghost locations and controls pixel neighbor readout to achieve high spatial resolution. A test lot containing 64 x 32 pixel arrays has been processed and is currently being tested. Each pixel contains 23 transistors and six capacitors consuming an area of 50μm by 150μm and dissipating about 20μW of power

  3. The TDCpix readout ASIC: A 75 ps resolution timing front-end for the NA62 Gigatracker hybrid pixel detector

    Energy Technology Data Exchange (ETDEWEB)

    Kluge, A., E-mail: alexander.kluge@cern.ch; Aglieri Rinella, G.; Bonacini, S.; Jarron, P.; Kaplon, J.; Morel, M.; Noy, M.; Perktold, L.; Poltorak, K.

    2013-12-21

    The TDCpix is a novel pixel readout ASIC for the NA62 Gigatracker detector. NA62 is a new experiment being installed at the CERN Super Proton Synchrotron. Its Gigatracker detector shall provide on-beam tracking and time stamping of individual particles with a time resolution of 150 ps rms. It will consist of three tracking stations, each with one hybrid pixel sensor. The peak flow of particles crossing the detector modules reaches 1.27 MHz/mm{sup 2} for a total rate of about 0.75 GHz. Ten TDCpix chips will be bump-bonded to every silicon pixel sensor. Each chip shall perform time stamping of 100 M particle hits per second with a detection efficiency above 99% and a timing accuracy better than 200 ps rms for an overall three-station-setup time resolution of better than 150 ps. The TDCpix chip has been designed in a 130 nm CMOS technology. It will feature 45×40 square pixels of 300×300μm{sup 2} and a complex End of Column peripheral region including an array of TDCs based on DLLs, four high speed serializers, a low-jitter PLL, readout and control circuits. This contribution will describe the complete design of the final TDCpix ASIC. It will discuss design choices, the challenges faced and some of the lessons learned. Furthermore, experimental results from the testing of circuit prototypes will be presented. These demonstrate the achievement of key performance figures such as a time resolution of the processing chain of 75 ps rms with a laser sent to the center of the pixel and the capability of time stamping charged particles with an overall resolution below 200 ps rms. -- Highlights: • Feasibility demonstration of a silicon pixel detector with sub-ns time tagging capability. • Demonstrator detector assembly with a time resolution of 75 ps RMS with laser charge injection; 170 ps RMS with particle beam. • Design of trigger-less TDCpix ASIC with 1800 pixels, 720 TDC channels and 4 3.2 Gbit/s serializers.

  4. First implementation of the MEPHISTO binary readout architecture for strip detectors

    International Nuclear Information System (INIS)

    Fischer, P.

    2001-01-01

    Today's front-end readout chips for multi-channel silicon strip detectors use pipeline-like structures for temporary storage of hit information until arrival of a trigger signal. This approach leads to large-area chips when long trigger latencies are necessary. The MEPHISTO architecture uses a different concept. Hit strips are identified in real time and only the relevant binary hit information is stored in FIFOs. For the typical occupancies in LHC detectors of ∼1 hit per clock cycle this architecture requires less than half the chip area of a typical binary pipeline. This reduces the system cost considerably. At a lower data rate, operation with very long trigger latencies or even without any trigger is possible due to the real-time data sparsification. The Mephisto II architecture is presented and the expected performance is discussed

  5. A novel integrated circuit for semiconductor radiation detectors with sparse readout

    International Nuclear Information System (INIS)

    Zhang Yacong; Chen Zhognjian; Lu Wengao; Zhao Baoying; Ji Lijiu

    2008-01-01

    A novel fully integrated CMOS readout circuit for semiconductor radiation detector with sparse readout is presented. The new sparse scheme is: when one channel is being read out, the trigger signal from other channels is delayed and then processed. Therefore, the dead time is reduced and so is the error rate. Besides sparse readout, sequential readout is also allowed, which means the analog voltages and addresses of all the channels are read out sequentially once there is a channel triggered. The circuit comprises Charge Sensitive Amplifier (CSA), pulse shaper, peak detect and hold circuit, and digital logic. A test chip of four channels designed in a 0.5 μ DPTM CMOS technology has been taped out. The results of post simulation indicate that the gain is 79.3 mV/fC with a linearity of 99.92%. The power dissipation is 4 mW per channel. Theory analysis and calculation shows that the error probability is approximately 2.5%, which means a reduction of about 37% is obtained compared with the traditional scanning scheme, assuming a 16-channel system with a particle rate of 100 k/s per channel. (authors)

  6. Vertically Aligned Carbon Nanotube Array (VANTA Biosensor for MEMS Lab-on-a-Chip

    Directory of Open Access Journals (Sweden)

    Luke JOSEPH

    2009-10-01

    Full Text Available We describe the fabrication, functionalization and characterization of vertically aligned carbon nanotube arrays (VANTAs for biological sensor applications. This structure is created using a standard MEMS process and chemical vapor deposition (CVD multi-walled carbon nanotube (MWNT post-processing. The device is well suited for full integration into microfluidic lab-on-a-chip solutions. Included is a spectroscopic characterization of the galvanostatic impedance of the device, as well as scanning electron microscopy (SEM images of the pre- and post- functionalized device. Interferometric 3D profiling and X-ray spectroscopy were also used to check process assumptions. The work presented validates that this approach is an ideal candidate for low-cost, high-throughput manufacturing of biochemical sensors. Unlike previously published work [1, 2] using SWNT, the use of MWNT arrays allows functionalization over the entirety of the nanotubes. This approach maintains low baseline impedance and increases the surface area leveraging inherent benefits of the VANTA.

  7. A new TLD badge with machine readable ID for fully automated readout

    International Nuclear Information System (INIS)

    Kannan, S. Ratna P.; Kulkarni, M.S.

    2003-01-01

    The TLD badge currently being used for personnel monitoring of more than 40,000 radiation workers has a few drawbacks such as lack of on-badge machine readable ID code, delicate two-point clamping of dosimeters on an aluminium card with the chances of dosimeters falling off during handling or readout, projections on one side making automation of readout difficult etc. A new badge has been designed with a 8-digit identification code in the form of an array of holes and smooth exteriors to enable full automation of readout. The new badge also permits changing of dosimeters when necessary. The new design does not affect the readout time or the dosimetric characteristics. The salient features and the dosimetric characteristics are discussed. (author)

  8. Rework of flip chip bonded radiation pixel detectors

    International Nuclear Information System (INIS)

    Vaehaenen, S.; Heikkinen, H.; Pohjonen, H.; Salonen, J.; Savolainen-Pulli, S.

    2008-01-01

    In this paper, some practical aspects of reworking flip chip hybridized pixel detectors are discussed. As flip chip technology has been advancing in terms of placement accuracy and reliability, large-area hybrid pixel detectors have been developed. The area requirements are usually fulfilled by placing several readout chips (ROCs) on single sensor chip. However, as the number of ROCs increases, the probability of failure in the hybridization process and the ROC operation also increases. Because high accuracy flip chip bonding takes time, a significant part of the price of a pixel detector comes from the flip chip assembly process itself. As large-area detector substrates are expensive, and many flip chip placements are required, the price of an assembled detector can become very high. In a typical case, there is just one bad ROC (out of several) on a faulty detector to be replaced. Considering the high price of pixel detectors and the fact that reworking faulty ROCs does not take much longer than the original placement, it is worthwhile to investigate the feasibility of a rework process

  9. Rework of flip chip bonded radiation pixel detectors

    Energy Technology Data Exchange (ETDEWEB)

    Vaehaenen, S. [VTT MEMS and Micropackaging, Espoo 02150 (Finland)], E-mail: sami.vahanen@vtt.fi; Heikkinen, H.; Pohjonen, H.; Salonen, J.; Savolainen-Pulli, S. [VTT MEMS and Micropackaging, Espoo 02150 (Finland)

    2008-06-11

    In this paper, some practical aspects of reworking flip chip hybridized pixel detectors are discussed. As flip chip technology has been advancing in terms of placement accuracy and reliability, large-area hybrid pixel detectors have been developed. The area requirements are usually fulfilled by placing several readout chips (ROCs) on single sensor chip. However, as the number of ROCs increases, the probability of failure in the hybridization process and the ROC operation also increases. Because high accuracy flip chip bonding takes time, a significant part of the price of a pixel detector comes from the flip chip assembly process itself. As large-area detector substrates are expensive, and many flip chip placements are required, the price of an assembled detector can become very high. In a typical case, there is just one bad ROC (out of several) on a faulty detector to be replaced. Considering the high price of pixel detectors and the fact that reworking faulty ROCs does not take much longer than the original placement, it is worthwhile to investigate the feasibility of a rework process.

  10. Development and characterisation of a radiation hard readout chip for the LHCb outer tracker detector

    International Nuclear Information System (INIS)

    Stange, U.

    2005-01-01

    The reconstruction of charged particle tracks in the Outer Tracker detector of the LHCb experiment requires to measure the drift times of the straw tubes. A Time to Digital Converter (TDC) chip has been developed for this task. The chip integrates into the LHCb data acquisition schema and fulfils the requirements of the detector. The OTIS chip is manufactured in a commercial 0.25 μm CMOS process. A 32-channel TDC core drives the drift time measurement (25 ns measurement range, 390 ps nominal resolution) without introducing dead times. The resulting drift times are buffered until a trigger decision arrives after the fixed latency of 4 μs. In case of a trigger accept signal, the digital control core processes and transmits the corresponding data to the following data acquisition stage. Drift time measurement and data processing are independent from the detector occupancy. The digital control core of the OTIS chip has been developed within this doctoral thesis. It has been integrated into the TDC chip together with other constituents of the chip. Several test chips and prototype versions of the TDC chip have been characterised. The present version of the chip OTIS1.2 fulfils all requirements and is ready for mass production. (Orig.)

  11. Fabrication of a high-density MCM-D for a pixel detector system using a BCB/Cu technology

    CERN Document Server

    Topper, M; Engelmann, G; Fehlberg, S; Gerlach, P; Wolf, J; Ehrmann, O; Becks, K H; Reichl, H

    1999-01-01

    The MCM-D which is described here is a prototype for a pixel detector system for the planned Large Hadron Collider (LHC) at CERN, Geneva. The project is within the ATLAS experiment. The module consists of a sensor tile with an active area of 16.4 mm*60.4 mm, 16 readout chips, each serving 24*160 pixel unit cells, a module controller chip, an optical transceiver and the local signal interconnection and power distribution buses. The extremely high wiring density which is necessary to interconnect the readout chips was achieved using a thin film copper/photo-BCB process above the pixel array. The bumping of the readout chips was done by PbSn electroplating. All dice are then attached by flip-chip assembly to the sensor diodes and the local buses. The focus of this paper is a detailed description of the technologies for the fabrication of this advanced MCM-D. (10 refs).

  12. Progress in the development of the DTMROC time measurement chip for the ATLAS transition radiation tracker (TRT)

    CERN Document Server

    Alexander, C; Dressnandt, N; Ekenberg, T; Farthouat, Philippe; Keener, P T; Lam, N; La Marra, D; Mann, J; Newcomer, F M; Ryzhov, V; Söderberg, M; Szczygiel, R; Van Berg, R; Williams, H H

    2001-01-01

    A 16-channel digital time-measurement readout chip (DTMROC) has been fabricated in the TEMIC/DM1LL left bracket 1 right bracket BI- CMOS radiation-hard process for the Large Hadron Collider's (LHC) Transition Radiation Tracker (ATLAS/TRT) at CERN left bracket 2 right bracket . The chip receives discriminated straw-drift-tube signals from bipolar amplifier-shaper-discriminator chips (ASDBLR). measures the arrival time in 3.125 ns increments ( plus or minus 1 ns), and stores the data in a pipeline for 3.3mus. A trigger signal (L1A) causes the data to be tagged with a time stamp and stored for readout- Up to 13 events may be stored in an on-chip buffer while data is being clocked out in a 40 MHz serial stream. The chip has been designed to function after exposure to 1x10**1**4 protons/cm**2 and 1 Mrad total dose. System beam-tests have demonstrated measurement of track positions with a resolution of 165mum and 85% efficiency at rates up to 18MHz. 6 Refs.

  13. Test and improvement of readout system based on APV25 chip for GEM detector

    International Nuclear Information System (INIS)

    Hu Shouyang; Jian Siyu; Zhou Jing; Shan Chao; Li Xinglong; Li Xia; Li Xiaomei; Zhou Yi

    2014-01-01

    Gas electron multiplier (GEM) is the most promising position sensitive gas detector. The new generation of readout electronics system includes APV25 front-end card, multi-purpose digitizer (MPD), VME controller and Linux-based acquisition software DAQ. The construction and preliminary test of this readout system were finished, and the ideal data with the system working frequency of 40 MHz and 20 MHz were obtained. The long time running test shows that the system has a very good time-stable ability. Through optimizing the software configuration and improving hardware quality, the noise level was reduced, and the signal noise ratio was improved. (authors)

  14. Design of a readout ASIC for gas detectors with self-amplification

    International Nuclear Information System (INIS)

    Deng Zhi; Liu Yinong

    2009-01-01

    A readout ASIC has been designed for gas detectors with self-amplification such as GEM and RPC. It provides amplification and shaping of the detector signals and buffers them to the free running ADCs. The charge gain and the shaping time can be adjusted. The programmability of gain and shaping time is very convenient for studying detector performance under different gas gain and also expands the application range of the chip. The ENC increases as charge gain decreases below 10 mV/fC because the noise from the shaper becomes significant. The chip is designed in Chartered 0.35μm 2P4M CMOS process. Detailed design and simulation results are described in the paper. (authors)

  15. On-chip concentration of bacteria using a 3D dielectrophoretic chip and subsequent laser-based DNA extraction in the same chip

    International Nuclear Information System (INIS)

    Cho, Yoon-Kyoung; Kim, Tae-hyeong; Lee, Jeong-Gun

    2010-01-01

    We report the on-chip concentration of bacteria using a dielectrophoretic (DEP) chip with 3D electrodes and subsequent laser-based DNA extraction in the same chip. The DEP chip has a set of interdigitated Au post electrodes with 50 µm height to generate a network of non-uniform electric fields for the efficient trapping by DEP. The metal post array was fabricated by photolithography and subsequent Ni and Au electroplating. Three model bacteria samples (Escherichia coli, Staphylococcus epidermidis, Streptococcus mutans) were tested and over 80-fold concentrations were achieved within 2 min. Subsequently, on-chip DNA extraction from the concentrated bacteria in the 3D DEP chip was performed by laser irradiation using the laser-irradiated magnetic bead system (LIMBS) in the same chip. The extracted DNA was analyzed with silicon chip-based real-time polymerase chain reaction (PCR). The total process of on-chip bacteria concentration and the subsequent DNA extraction can be completed within 10 min including the manual operation time.

  16. Flip-chip bonded optoelectronic integration based on ultrathin silicon (UTSi) CMOS

    Science.gov (United States)

    Hong, Sunkwang; Ho, Tawei; Zhang, Liping; Sawchuk, Alexander A.

    2003-06-01

    We describe the design and test of flip-chip bonded optoelectronic CMOS devices based on Peregrine Semiconductor's 0.5 micron Ultra-Thin Silicon on sapphire (UTSi) technology. The UTSi process eliminates the substrate leakage that typically results in crosstalk and reduces parasitic capacitance to the substrate, providing many benefits compared to bulk silicon CMOS. The low-loss synthetic sapphire substrate is optically transparent and has a coefficient of thermal expansion suitable for flip-chip bonding of vertical cavity surface emitting lasers (VCSELs) and detectors. We have designed two different UTSi CMOS chips. One contains a flip-chip bonded 1 x 4 photodiode array, a receiver array, a double edge triggered D-flip flop-based 2047-pattern pseudo random bit stream (PRBS) generator and a quadrature-phase LC-voltage controlled oscillator (VCO). The other chip contains a flip-chip bonded 1 x 4 VCSEL array, a driver array based on high-speed low-voltage differential signals (LVDS) and a full-balanced differential LC-VCO. Each VCSEL driver and receiver has individual input and bias voltage adjustments. Each UTSi chip is mounted on different printed circuit boards (PCBs) which have holes with about 1 mm radius for optical output and input paths through the sapphire substrate. We discuss preliminary testing of these chips.

  17. Digital signal processors for cryogenic high-resolution x-ray detector readout

    International Nuclear Information System (INIS)

    Friedrich, Stephan; Drury, Owen B.; Bechstein, Sylke; Hennig, Wolfgang; Momayezi, Michael

    2003-01-01

    We are developing fast digital signal processors (DSPs) to read out superconducting high-resolution X-ray detectors with on-line pulse processing. For superconducting tunnel junction (STJ) detector read-out, the DSPs offer online filtering, rise time discrimination and pile-up rejection. Compared to analog pulse processing, DSP readout somewhat degrades the detector resolution, but improves the spectral purity of the detector response. We discuss DSP performance with our 9-channel STJ array for synchrotron-based high-resolution X-ray spectroscopy. (author)

  18. HuMiChip: Development of a Functional Gene Array for the Study of Human Microbiomes

    Energy Technology Data Exchange (ETDEWEB)

    Tu, Q.; Deng, Ye; Lin, Lu; Hemme, Chris L.; He, Zhili; Zhou, Jizhong

    2010-05-17

    Microbiomes play very important roles in terms of nutrition, health and disease by interacting with their hosts. Based on sequence data currently available in public domains, we have developed a functional gene array to monitor both organismal and functional gene profiles of normal microbiota in human and mouse hosts, and such an array is called human and mouse microbiota array, HMM-Chip. First, seed sequences were identified from KEGG databases, and used to construct a seed database (seedDB) containing 136 gene families in 19 metabolic pathways closely related to human and mouse microbiomes. Second, a mother database (motherDB) was constructed with 81 genomes of bacterial strains with 54 from gut and 27 from oral environments, and 16 metagenomes, and used for selection of genes and probe design. Gene prediction was performed by Glimmer3 for bacterial genomes, and by the Metagene program for metagenomes. In total, 228,240 and 801,599 genes were identified for bacterial genomes and metagenomes, respectively. Then the motherDB was searched against the seedDB using the HMMer program, and gene sequences in the motherDB that were highly homologous with seed sequences in the seedDB were used for probe design by the CommOligo software. Different degrees of specific probes, including gene-specific, inclusive and exclusive group-specific probes were selected. All candidate probes were checked against the motherDB and NCBI databases for specificity. Finally, 7,763 probes covering 91.2percent (12,601 out of 13,814) HMMer confirmed sequences from 75 bacterial genomes and 16 metagenomes were selected. This developed HMM-Chip is able to detect the diversity and abundance of functional genes, the gene expression of microbial communities, and potentially, the interactions of microorganisms and their hosts.

  19. Studies of the performance of different front-end systems for flat-panel multi-anode PMTs with CsI(Tl) scintillator arrays

    International Nuclear Information System (INIS)

    Sekiya, H.; Hattori, K.; Kubo, H.; Miuchi, K.; Nagayoshi, T.; Nishimura, H.; Okada, Y.; Orito, R.; Takada, A.; Takeda, A.; Tanimori, T.; Ueno, K.

    2006-01-01

    We have studied the performance of two different types of front-end systems for our gamma camera based on Hamamatsu H8500 (flat-panel 64 channels multi-anode PSPMT) with a CsI(Tl) scintillator array. The array consists of 64 pixels of 6x6x20mm 3 which corresponds to the anode pixels of H8500. One of the system is based on commercial ASIC chips in order to read out every anode. The others are based on resistive charge divider network between anodes to reduce readout channels. In both systems, each pixel (6mm) was clearly resolved by flood field irradiation of 137 Cs. We also investigated the energy resolution of these systems and showed the performance of the cascade connection of resistive network between some PMTs for large area detectors

  20. Two-dimensional readout system for radiation detector

    International Nuclear Information System (INIS)

    Lee, L.Y.

    1975-01-01

    A two dimensional readout system has been provided for reading out locations of scintillations produced in a scintillation type radiation detector array wherein strips of scintillator material are arranged in a parallel planar array. Two sets of light guides are placed perpendicular to the scintillator strips, one on the top and one on the bottom to extend in alignment across the strips. Both the top and bottom guides are composed of a number of 90 0 triangular prisms with the lateral side forming the hypotenuse equal to twice the width of a scintillator strip. The prism system reflects light from a scintillation along one of the strips back and forth through adjacent strips to light pipes coupled to the outermost strips of the detector array which transmit light pulses to appropriate detectors to determine the scintillation along one axis. Other light pipes are connected to the end portions of the strips to transmit light from the individual strips to appropriate light detectors to indicate the particular strip activated, thereby determining the position of a scintillation along the other axis. The number of light guide pairs may be equal the number of the scintillation strips when equal spatial resolution for each of the two coordinates is desired. When the scintillator array detects an event which produces a scintillation along one of the strips, the emitted light travels along four different paths, two of which are along the strip, and two of which are through the light guide pair perpendicular to the strips until all four beams reach the outer edges of the array where they may be transmitted to light detectors by means of light pipes connected therebetween according to a binary code for direct digital readout. (U.S.)

  1. Performance of 20:1 multiplexer for large area charge readouts in directional dark matter TPC detectors

    Science.gov (United States)

    Ezeribe, A. C.; Robinson, M.; Robinson, N.; Scarff, A.; Spooner, N. J. C.; Yuriev, L.

    2018-02-01

    More target mass is required in current TPC based directional dark matter detectors for improved detector sensitivity. This can be achieved by scaling up the detector volumes, but this results in the need for more analogue signal channels. A possible solution to reducing the overall cost of the charge readout electronics is to multiplex the signal readout channels. Here, we present a multiplexer system in expanded mode based on LMH6574 chips produced by Texas Instruments, originally designed for video processing. The setup has a capability of reducing the number of readouts in such TPC detectors by a factor of 20. Results indicate that the important charge distribution asymmetry along an ionization track is retained after multiplexed signals are demultiplexed.

  2. Transition edge sensor series array bolometer

    Energy Technology Data Exchange (ETDEWEB)

    Beyer, J, E-mail: joern.beyer@ptb.d [Physikalisch-Technische Bundesanstalt (PTB), Abbestrasse 2-12, D-10587 Berlin (Germany)

    2010-10-15

    A transition edge sensor series array (TES-SA) is an array of identical TESs that are connected in series by low-inductance superconducting wiring. The array elements are equally and well thermally coupled to the absorber and respond to changes in the absorber temperature in synchronization. The TES-SA total resistance increases compared to a single TES while the shape of the superconducting transition is preserved. We are developing a TES-SA with a large number, hundreds to thousands, of array elements with the goal of enabling the readout of a TES-based bolometer operated at 4.2 K with a semiconductor-based amplifier located at room temperature. The noise and dynamic performance of a TES-SA bolometer based on a niobium/aluminum bilayer is analyzed. It is shown that stable readout of the bolometer with a low-noise transimpedance amplifier is feasible.

  3. Transition edge sensor series array bolometer

    International Nuclear Information System (INIS)

    Beyer, J

    2010-01-01

    A transition edge sensor series array (TES-SA) is an array of identical TESs that are connected in series by low-inductance superconducting wiring. The array elements are equally and well thermally coupled to the absorber and respond to changes in the absorber temperature in synchronization. The TES-SA total resistance increases compared to a single TES while the shape of the superconducting transition is preserved. We are developing a TES-SA with a large number, hundreds to thousands, of array elements with the goal of enabling the readout of a TES-based bolometer operated at 4.2 K with a semiconductor-based amplifier located at room temperature. The noise and dynamic performance of a TES-SA bolometer based on a niobium/aluminum bilayer is analyzed. It is shown that stable readout of the bolometer with a low-noise transimpedance amplifier is feasible.

  4. Readout from iconic memory and selective spatial attention involve similar neural processes.

    Science.gov (United States)

    Ruff, Christian C; Kristjánsson, Arni; Driver, Jon

    2007-10-01

    Iconic memory and spatial attention are often considered separately, but they may have functional similarities. Here we provide functional magnetic resonance imaging evidence for some common underlying neural effects. Subjects judged three visual stimuli in one hemifield of a bilateral array comprising six stimuli. The relevant hemifield for partial report was indicated by an auditory cue, administered either before the visual array (precue, spatial attention) or shortly after the array (postcue, iconic memory). Pre- and postcues led to similar activity modulations in lateral occipital cortex contralateral to the cued side. This finding indicates that readout from iconic memory can have some neural effects similar to those of spatial attention. We also found common bilateral activation of a fronto-parietal network for postcue and precue trials. These neuroimaging data suggest that some common neural mechanisms underlie selective spatial attention and readout from iconic memory. Some differences were also found; compared with precues, postcues led to higher activity in the right middle frontal gyrus.

  5. An Automatic Baseline Regulation in a Highly Integrated Receiver Chip for JUNO

    Science.gov (United States)

    Muralidharan, P.; Zambanini, A.; Karagounis, M.; Grewing, C.; Liebau, D.; Nielinger, D.; Robens, M.; Kruth, A.; Peters, C.; Parkalian, N.; Yegin, U.; van Waasen, S.

    2017-09-01

    This paper describes the data processing unit and an automatic baseline regulation of a highly integrated readout chip (Vulcan) for JUNO. The chip collects data continuously at 1 Gsamples/sec. The Primary data processing which is performed in the integrated circuit can aid to reduce the memory and data processing efforts in the subsequent stages. In addition, a baseline regulator compensating a shift in the baseline is described.

  6. Design and simulation of a novel method for determining depth-of-interaction in a PET scintillation crystal array using a single-ended readout by a multi-anode PMT

    International Nuclear Information System (INIS)

    Ito, Mikiko; Sim, Kwang-Souk; Lee, Jae Sung; Park, Min-Jae; Hong, Seong Jong

    2010-01-01

    PET detectors with depth-of-interaction (DOI) encoding capability allow high spatial resolution and high sensitivity to be achieved simultaneously. To obtain DOI information from a mono-layer array of scintillation crystals using a single-ended readout, the authors devised a method based on light spreading within a crystal array and performed Monte Carlo simulations with individual scintillation photon tracking to prove the concept. A scintillation crystal array model was constructed using a grid method. Conventional grids are constructed using comb-shaped reflector strips with rectangular teeth to isolate scintillation crystals optically. However, the authors propose the use of triangularly shaped teeth, such that scintillation photons spread only in the x-direction in the upper halves of crystals and in the y-direction in lower halves. DOI positions can be estimated by considering the extent of two-dimensional light dispersion, which can be determined from the multiple anode outputs of a position-sensitive PMT placed under the crystal array. In the main simulation, a crystal block consisting of a 29 x 29 array of 1.5 mm x 1.5 mm x 20 mm crystals and a multi-anode PMT with 16 x 16 pixels were used. The effects of crystal size and non-uniform PMT output gain were also explored by simulation. The DOI resolution estimated for 1.5 x 1.5 x 20 mm 3 crystals was 2.16 mm on average. Although the flood map was depth dependent, each crystal was well identified at all depths when a corner of the crystal array was irradiated with 511 keV gamma rays (peak-to-valley ratio ∼9:1). DOI resolution was better than 3 mm up to a crystal length of 28 mm with a 1.5 x 1.5 mm 2 or 2.0 x 2.0 mm 2 crystal surface area. The devised light-sharing method allowed excellent DOI resolutions to be obtained without the use of dual-ended readout or multiple crystal arrays.

  7. 60 GHz wireless data transfer for tracker readout systems—first studies and results

    International Nuclear Information System (INIS)

    Dittmeier, S.; Berger, N.; Schöning, A.; Soltveit, H.K.; Wiedner, D.

    2014-01-01

    To allow highly granular trackers to contribute to first level trigger decisions or event filtering, a fast readout system with very high bandwidth is required. Space, power and material constraints, however, pose severe limitations on the maximum available bandwidth of electrical or optical data transfers. A new approach for the implementation of a fast readout system is the application of a wireless data transfer at a carrier frequency of 60 GHz. The available bandwidth of several GHz allows for data rates of multiple Gbps per link. 60 GHz transceiver chips can be produced with a small form factor and a high integration level. A prototype transceiver currently under development at the University of Heidelberg is briefly described in this paper. To allow easy and fast future testing of the chip's functionality, a bit error rate test has been developed with a commercially available transceiver. Crosstalk might be a big issue for a wireless readout system with many links in a tracking detector. Direct crosstalk can be avoided by using directive antennas, linearly polarized waves and frequency channeling. Reflections from tracking modules can be reduced by applying an absorbing material like graphite foam. Properties of different materials typically used in tracking detectors and graphite foam in the 60 GHz frequency range are presented. For data transmission tests, links using commercially available 60 GHz transmitters and receivers are used. Studies regarding crosstalk and the applicability of graphite foam, Kapton horn antennas and polarized waves are shown

  8. The GOTTHARD charge integrating readout detector: design and characterization

    International Nuclear Information System (INIS)

    Mozzanica, A; Bergamaschi, A; Dinapoli, R; Greiffenberg, D; Henrich, B; Johnson, I; Valeria, R; Schmitt, B; Xintian, S; Graafsma, H; Lohmann, M

    2012-01-01

    A charge integrating readout ASIC (Application Specific Integrated Circuit) for silicon strip sensors has been developed at PSI in collaboration with DESY. The goal of the project is to provide a charge integrating readout system able to cope with the pulsed beam of XFEL machines and at the same time to retain the high dynamic range and single photon resolution performances typical for photon counting systems. The ASIC, designed in IBM 130 nm CMOS technology, takes advantage of its three gain stages with automatic stage selection to achieve a dynamic range of 10000 12 keV photons and a noise better than 300 e.n.c.. The 4 analog outputs of the ASIC are optimized for speed, allowing frame rates higher than 1 MHz, without compromises on linearity and noise performances. This work presents the design features of the ASIC, and reports the characterization results of the chip itself.

  9. First results from a silicon-strip detector with VLSI readout

    International Nuclear Information System (INIS)

    Anzivino, G.; Horisberger, R.; Hubbeling, L.; Hyams, B.; Parker, S.; Breakstone, A.; Litke, A.M.; Walker, J.T.; Bingefors, N.

    1986-01-01

    A 256-strip silicon detector with 25 μm strip pitch, connected to two 128-channel NMOS VLSI chips (Microplex), has been tested using straight-through tracks from a ruthenium beta source. The readout channels have a pitch of 47.5 μm. A single multiplexed output provides voltages proportional to the integrated charge from each strip. The most probable signal height from the beta traversals is approximately 14 times the rms noise in any single channel. (orig.)

  10. Superconductor Microwave Kinetic Inductance Detectors: System Model of the Readout Electronics

    Directory of Open Access Journals (Sweden)

    F. Alimenti

    2009-06-01

    Full Text Available This paper deals with the readout electronics needed by superconductor Microwave Kinetic Inductance Detectors (MKIDs. MKIDs are typically implemented in the form of cryogenic-cooled high quality factor microwave resonator. The natural frequency of these resonators changes as a millimeter or sub-millimeter wave radiation impinges on the resonator itself. A quantitative system model of the readout electronics (very similar to that of a vector network analyzer has been implemented under ADS environment and tested by several simulation experiments. The developed model is a tool to further optimize the readout electronic and to design the frequency allocation of parallel-connected MKIDs resonators. The applications of MKIDs will be in microwave and millimeter-wave radiometric imaging as well as in radio-astronomy focal plane arrays.

  11. Monolithic integration of a silicon nanowire field-effect transistors array on a complementary metal-oxide semiconductor chip for biochemical sensor applications.

    Science.gov (United States)

    Livi, Paolo; Kwiat, Moria; Shadmani, Amir; Pevzner, Alexander; Navarra, Giulio; Rothe, Jörg; Stettler, Alexander; Chen, Yihui; Patolsky, Fernando; Hierlemann, Andreas

    2015-10-06

    We present a monolithic complementary metal-oxide semiconductor (CMOS)-based sensor system comprising an array of silicon nanowire field-effect transistors (FETs) and the signal-conditioning circuitry on the same chip. The silicon nanowires were fabricated by chemical vapor deposition methods and then transferred to the CMOS chip, where Ti/Pd/Ti contacts had been patterned via e-beam lithography. The on-chip circuitry measures the current flowing through each nanowire FET upon applying a constant source-drain voltage. The analog signal is digitized on chip and then transmitted to a receiving unit. The system has been successfully fabricated and tested by acquiring I-V curves of the bare nanowire-based FETs. Furthermore, the sensing capabilities of the complete system have been demonstrated by recording current changes upon nanowire exposure to solutions of different pHs, as well as by detecting different concentrations of Troponin T biomarkers (cTnT) through antibody-functionalized nanowire FETs.

  12. Optical lattice on an atom chip

    DEFF Research Database (Denmark)

    Gallego, D.; Hofferberth, S.; Schumm, Thorsten

    2009-01-01

    Optical dipole traps and atom chips are two very powerful tools for the quantum manipulation of neutral atoms. We demonstrate that both methods can be combined by creating an optical lattice potential on an atom chip. A red-detuned laser beam is retroreflected using the atom chip surface as a high......-quality mirror, generating a vertical array of purely optical oblate traps. We transfer thermal atoms from the chip into the lattice and observe cooling into the two-dimensional regime. Using a chip-generated Bose-Einstein condensate, we demonstrate coherent Bloch oscillations in the lattice....

  13. MEMS acceleration sensor with remote optical readout for continuous power generator monitoring

    Directory of Open Access Journals (Sweden)

    Tormen Maurizio

    2015-01-01

    Full Text Available Miniaturized accelerometers with remote optical readout are required devices for the continuous monitoring of vibrations inside power generators. In turbo and hydro generators, end-winding vibrations are present during operation causing in the long term undesirable out-of-service repairs. Continuous monitoring of these vibrations is therefore mandatory. The high electromagnetic fields in the generators impose the use of devices immune to electromagnetic interferences. In this paper a MEMS based accelerometer with remote optical readout is presented. Advantages of the proposed device are the use of a differential optical signal to reject the common mode signal and noise, the reduced number of steps for the MEMS chip fabrication and for the system assembly, and the reduced package volume.

  14. UW VLSI chip tester

    Science.gov (United States)

    McKenzie, Neil

    1989-12-01

    We present a design for a low-cost, functional VLSI chip tester. It is based on the Apple MacIntosh II personal computer. It tests chips that have up to 128 pins. All pin drivers of the tester are bidirectional; each pin is programmed independently as an input or an output. The tester can test both static and dynamic chips. Rudimentary speed testing is provided. Chips are tested by executing C programs written by the user. A software library is provided for program development. Tests run under both the Mac Operating System and A/UX. The design is implemented using Xilinx Logic Cell Arrays. Price/performance tradeoffs are discussed.

  15. Characterization of the column-based priority logic readout of Topmetal-II− CMOS pixel direct charge sensor

    International Nuclear Information System (INIS)

    An, M.; Zhang, W.; Xiao, L.; Gao, C.; Chen, C.; Huang, G.; Ji, R.; Liu, J.; Pei, H.; Sun, X.; Wang, K.; Yang, P.; Zhou, W.; Han, M.; Mei, Y.; Li, X.; Sun, Q.

    2017-01-01

    We present the detailed study of the digital readout of Topmetal-II - CMOS pixel direct charge sensor. Topmetal-II - is an integrated sensor with an array of 72×72 pixels each capable of directly collecting external charge through exposed metal electrodes in the topmost metal layer. In addition to the time-shared multiplexing readout of the analog output from Charge Sensitive Amplifiers in each pixel, hits are also generated through comparators in each pixel with individually adjustable thresholds. The hits are read out via a column-based priority logic structure, retaining both hit location and time information. The in-array column-based priority logic features with a full clock-less circuitry hence there is no continuously running clock distributed in the pixel and matrix logic. These characteristics enable its use as the charge readout device in future Time Projection Chambers without gaseous gain mechanism, which has unique advantages in low background and low rate-density experiments. We studied the detailed working behavior and performance of this readout, and demonstrated its functional validity and potential in imaging applications.

  16. OSL signal of IC chips from mobile phones for dose assessment in accidental dosimetry

    International Nuclear Information System (INIS)

    Mrozik, A.; Marczewska, B.; Bilski, P.; Książek, M.

    2017-01-01

    The rapid assessment of the radiation dose is very important for the prediction of biological effects after unintended exposition. The materials for use as dosimeters in accidental dosimetry should be everyday objects which are usually placed near the human body, for example mobile phones. IC (Integrated Circuit) chip is one of several electronic components of mobile phones which give a luminescent signal. The measurements of samples from different mobile phones and smartphones were conducted by optically stimulated luminescence (OSL) and thermoluminescence (TL) methods. The OSL measurement was performed in two ways: with readouts at room temperature and at 100 °C. This work is focused on determination of OSL dose response of IC chips, minimum detectable dose (MDD), OSL signal stability in the time after the exposition, its repeatability and sensitivity to light. Several tests of the assessment of unknown doses were also conducted. The readouts at 100 °C indicate the reducing of the fading of OSL signal in the first hours after irradiation in comparison with room temperature readouts. The obtained results showed relatively good dosimetric properties of IC chips: their high sensitivity to the ionizing radiation, linear dose response up to 10 Gy and a good reproducibility of OSL signal which can allow the dose recovery of doses less than 2 Gy in 14 days after an incident with the accuracy better than 25%. The fading is a drawback of IC chips and the fading factor should be considered when calculating the dose. - Highlights: • IC chips from smartphones demonstrated high potential for accidental dosimetry. • Minimum detectable dose was estimated as a value of 50 mGy. • Samples showed linear dose response for the dose range from 0.05 Gy up to 10 Gy.

  17. Lab-on-chip system combining a microfluidic-ELISA with an array of amorphous silicon photosensors for the detection of celiac disease epitopes

    Directory of Open Access Journals (Sweden)

    Francesca Costantini

    2015-12-01

    Full Text Available This work presents a lab-on-chip system, which combines a glass-polydimethilsiloxane microfluidic network and an array of amorphous silicon photosensors for the diagnosis and follow-up of Celiac disease. The microfluidic chip implements an on-chip enzyme-linked immunosorbent assay (ELISA, relying on a sandwich immunoassay between antibodies against gliadin peptides (GPs and a secondary antibody marked with horseradish peroxidase (Ig-HRP. This enzyme catalyzes a chemiluminescent reaction, whose light intensity is detected by the amorphous silicon photosensors and transduced into an electrical signal that can be processed to recognize the presence of antibodies against GPs in the serum of people affected by Celiac syndrome.The correct operation of the developed lab-on-chip has been demonstrated using rabbit serum in the microfluidic ELISA. In particular, optimizing the dilution factors of both sera and Ig-HRP samples in the flowing solutions, the specific and non-specific antibodies against GPs can be successfully distinguished, showing the suitability of the presented device to effectively screen celiac disease epitopes. Keywords: Lab-on-chip, Celiac disease, Microfluidics, On-chip detection, ELISA, Amorphous silicon photosensors

  18. Miniature silicon electronic biological assay chip and applications for rapid battlefield diagnostics

    Science.gov (United States)

    Cunningham, Brian T.; Regan, Robert A.; Clapp, Christopher; Hildebrant, Eric; Weinberg, Marc S.; Williams, John

    1999-07-01

    Assessing the medical condition of battlefield personnel requires the development of rapid, portable biological diagnostic assays for a wide variety of antigens and enzymes. Ideally, such an assay would be inexpensive, small, and require no added reagents while maintaining the sensitivity and accuracy of laboratory-based assays. In this work, a microelectromechanical (MEMS) based biological assay sensor is presented which is expected to meet the above requirements. The sensor is a thin silicon membrane resonator (SMR) which registers a decrease in resonant frequency when mass is adsorbed onto its surface. By coating the sensor surface with a monolayer of antibody, for example, we have detected the corresponding antigen with a detection resolution of 0.25 ng/ml in phosphate buffer solution. Micromachining techniques are being used to integrate many (64 elements on the first test chip) identical SMR sensors into a single silicon chip which would be capable of simultaneously performing a wide variety of biomedical assays. The sensors require only a small printed circuit board and 8V power supply to operate and provide a readout. The presentation will describe the operation of the SMR sensor, the fabrication of the sensor array, and initial test results using commercially available animal immunoglobulins in laboratory-prepared test solutions.

  19. EIGER: Next generation single photon counting detector for X-ray applications

    Energy Technology Data Exchange (ETDEWEB)

    Dinapoli, Roberto, E-mail: roberto.dinapoli@psi.ch [Paul Scherrer Institut, 5232 Villigen PSI (Switzerland); Bergamaschi, Anna; Henrich, Beat; Horisberger, Roland; Johnson, Ian; Mozzanica, Aldo; Schmid, Elmar; Schmitt, Bernd; Schreiber, Akos; Shi, Xintian; Theidel, Gerd [Paul Scherrer Institut, 5232 Villigen PSI (Switzerland)

    2011-09-11

    EIGER is an advanced family of single photon counting hybrid pixel detectors, primarily aimed at diffraction experiments at synchrotrons. Optimization of maximal functionality and minimal pixel size (using a 0.25{mu}m process and conserving the radiation tolerant design) has resulted in 75x75{mu}m{sup 2} pixels. Every pixel comprises a preamplifier, shaper, discriminator (with a 6 bit DAC for threshold trimming), a configurable 4/8/12 bit counter with double buffering, as well as readout, control and test circuitry. A novel feature of this chip is its double buffered counter, meaning a next frame can be acquired while the previous one is being readout. An array of 256x256 pixels fits on a {approx}2x2cm{sup 2} chip and a sensor of {approx}8x4cm{sup 2} will be equipped with eight readout chips to form a module containing 0.5 Mpixel. Several modules can then be tiled to form larger area detectors. Detectors up to 4x8 modules (16 Mpixel) are planned. To achieve frame rates of up to 24 kHz the readout architecture is highly parallel, and the chip readout happens in parallel on 32 readout lines with a 100 MHz Double Data Rate clock. Several chips and singles (i.e. a single chip bump-bonded to a single chip silicon sensor) were tested both with a lab X-ray source and at Swiss Light Source (SLS) beamlines. These tests demonstrate the full functionality of the chip and provide a first assessment of its performance. High resolution X-ray images and 'high speed movies' were produced, even without threshold trimming, at the target system frame rates (up to {approx}24kHz in 4 bit mode). In parallel, dedicated hardware, firmware and software had to be developed to comply with the enormous data rate the chip is capable of delivering. Details of the chip design and tests will be given, as well as highlights of both test and final readout systems.

  20. GOSSIPO-4: Evaluation of a Novel PLL-Based TDC-Technique for the Readout of GridPix-Detectors

    CERN Document Server

    Brezina, C; Zappon, F; Van Beuzekom, M; Campbell, M; Desch, K; Van der Graaf, H; Gromov, V; Kluit, R; Llopart, X; Poikela, T; Zivkovic, V

    2014-01-01

    The direct readout of Micro-Pattern Gaseous Detectors (MPGDs) with bare pixel chips introduces the need for a new generation of readout electronics featuring a high spatial granularity as well as a highly accurate time measurement in each pixel. GOSSIPO-4, fabricated in a 130 nm CMOS technology, is a demonstrator ASIC investigating the potential of a new TDC-concept that is based on a chip-wide 40 MHz clock which is complemented by an additional 640 MHz clock. The latter is created upon demand by local oscillators distributed across the pixel matrix. PLL tuning of the local oscillators allows for automatic compensation of frequency fluctuations caused by process parameter, supply voltage and temperature variations. The developed PLL locks within s and achieves a duty cycle of 50.75% with a time interval error of only 23.4 ps. Mean DNL and INL of the TDC are less than 20% of the time bin size of 1.56 ns under all anticipated conditions.

  1. Nanophotonic lab-on-a-chip platforms including novel bimodal interferometers, microfluidics and grating couplers.

    Science.gov (United States)

    Duval, Daphné; González-Guerrero, Ana Belén; Dante, Stefania; Osmond, Johann; Monge, Rosa; Fernández, Luis J; Zinoviev, Kirill E; Domínguez, Carlos; Lechuga, Laura M

    2012-05-08

    One of the main limitations for achieving truly lab-on-a-chip (LOC) devices for point-of-care diagnosis is the incorporation of the "on-chip" detection. Indeed, most of the state-of-the-art LOC devices usually require complex read-out instrumentation, losing the main advantages of portability and simplicity. In this context, we present our last advances towards the achievement of a portable and label-free LOC platform with highly sensitive "on-chip" detection by using nanophotonic biosensors. Bimodal waveguide interferometers fabricated by standard silicon processes have been integrated with sub-micronic grating couplers for efficient light in-coupling, showing a phase resolution of 6.6 × 10(-4)× 2π rad and a limit of detection of 3.3 × 10(-7) refractive index unit (RIU) in bulk. A 3D network of SU-8 polymer microfluidics monolithically assembled at the wafer-level was included, ensuring perfect sealing and compact packaging. To overcome some of the drawbacks inherent to interferometric read-outs, a novel all-optical wavelength modulation system has been implemented, providing a linear response and a direct read-out of the phase variation. Sensitivity, specificity and reproducibility of the wavelength modulated BiMW sensor has been demonstrated through the label-free immunodetection of the human hormone hTSH at picomolar level using a reliable biofunctionalization process.

  2. Fully Integrated Linear Single Photon Avalanche Diode (SPAD) Array with Parallel Readout Circuit in a Standard 180 nm CMOS Process

    Science.gov (United States)

    Isaak, S.; Bull, S.; Pitter, M. C.; Harrison, Ian.

    2011-05-01

    This paper reports on the development of a SPAD device and its subsequent use in an actively quenched single photon counting imaging system, and was fabricated in a UMC 0.18 μm CMOS process. A low-doped p- guard ring (t-well layer) encircling the active area to prevent the premature reverse breakdown. The array is a 16×1 parallel output SPAD array, which comprises of an active quenched SPAD circuit in each pixel with the current value being set by an external resistor RRef = 300 kΩ. The SPAD I-V response, ID was found to slowly increase until VBD was reached at excess bias voltage, Ve = 11.03 V, and then rapidly increase due to avalanche multiplication. Digital circuitry to control the SPAD array and perform the necessary data processing was designed in VHDL and implemented on a FPGA chip. At room temperature, the dark count was found to be approximately 13 KHz for most of the 16 SPAD pixels and the dead time was estimated to be 40 ns.

  3. A 9-Channel, 100 ps LSB Time-to-Digital Converter for the NA62 Gigatracker Readout ASIC (TDCpix)

    International Nuclear Information System (INIS)

    Perktold, L; Rinella, G Aglieri; Noy, M; Kluge, A; Kloukinas, K; Kaplon, J; Jarron, P; Morel, M; Fiorini, M; Martin, E

    2012-01-01

    The TDCpix ASIC is the readout chip for the Gigatracker station of the NA62 experiment. Each station of the Gigatracker needs to provide time stamping of individual particles to 200 ps-rms or better. Bump-bonded to the pixel sensor the ASIC serves an array of 40 columns x 40 pixels. The high precision time measurement of the discriminated hit signals is accomplished with a set of 40 TDCs sitting in the End-Of-Column region of the ASIC. Each TDC provides 9 channels per column. For the time-to-digital converter (TDC) a delay-locked-loop (DLL) approach is employed to achieve a constant time binning of 100 ps. Simulation results show that an average rms time resolution of 33 ps with a power consumption of the TDC better than 33 mW per column is achieved. This contribution will present the design, simulation results and implementation challenges of the TDC.

  4. The Front-End Readout as an Encoder IC for Magneto-Resistive Linear Scale Sensors

    Directory of Open Access Journals (Sweden)

    Trong-Hieu Tran

    2016-09-01

    Full Text Available This study proposes a front-end readout circuit as an encoder chip for magneto-resistance (MR linear scales. A typical MR sensor consists of two major parts: one is its base structure, also called the magnetic scale, which is embedded with multiple grid MR electrodes, while another is an “MR reader” stage with magnets inside and moving on the rails of the base. As the stage is in motion, the magnetic interaction between the moving stage and the base causes the variation of the magneto-resistances of the grid electrodes. In this study, a front-end readout IC chip is successfully designed and realized to acquire temporally-varying resistances in electrical signals as the stage is in motions. The acquired signals are in fact sinusoids and co-sinusoids, which are further deciphered by the front-end readout circuit via newly-designed programmable gain amplifiers (PGAs and analog-to-digital converters (ADCs. The PGA is particularly designed to amplify the signals up to full dynamic ranges and up to 1 MHz. A 12-bit successive approximation register (SAR ADC for analog-to-digital conversion is designed with linearity performance of ±1 in the least significant bit (LSB over the input range of 0.5–2.5 V from peak to peak. The chip was fabricated by the Taiwan Semiconductor Manufacturing Company (TSMC 0.35-micron complementary metal oxide semiconductor (CMOS technology for verification with a chip size of 6.61 mm2, while the power consumption is 56 mW from a 5-V power supply. The measured integral non-linearity (INL is −0.79–0.95 LSB while the differential non-linearity (DNL is −0.68–0.72 LSB. The effective number of bits (ENOB of the designed ADC is validated as 10.86 for converting the input analog signal to digital counterparts. Experimental validation was conducted. A digital decoder is orchestrated to decipher the harmonic outputs from the ADC via interpolation to the position of the moving stage. It was found that the displacement

  5. Triroc: A Multi-Channel SiPM Read-Out ASIC for PET/PET-ToF Application

    Science.gov (United States)

    Ahmad, Salleh; Fleury, Julien; de la Taille, Christophe; Seguin-Moreau, Nathalie; Dulucq, Frederic; Martin-Chassard, Gisele; Callier, Stephane; Thienpont, Damien; Raux, Ludovic

    2015-06-01

    Triroc is the latest addition to SiPM readout ASICs family developed at Weeroc, a start-up company from the Omega microelectronics group of IN2P3/CNRS. This chip is developed under the framework TRIMAGE European project which is aimed for building a cost effective tri-modal PET/MR/EEG brain scan. To ensure the flexibility and compatibility with any SiPM in the market, the ASIC is designed to be capable of accepting negative and positive polarity input signals. This 64-channel ASIC, is suitable for SiPM readout which requires high accuracy timing and charge measurements. Targeted applications would be PET prototyping with time-of-flight capability. Main features of Triroc includes high dynamic range ADC up to 2500 photoelectrons and TDC fine time binning of 40 ps. Triroc requires very minimal external components which means it is a good contender for compact multichannel PET prototyping. Triroc is designed by using AMS 0.35 μm SiGe technology and it was submitted in March 2014. The detail design of this chip will be presented.

  6. submitter Development of the readout for the IBL upgrade project of the ATLAS Pixel Detector

    CERN Document Server

    Krieger, Nina

    The LHC luminosity is upgraded in several phases until 2022. The resulting higher occupancy degrades the detector performance of the current Pixel Detector. To provide a good performance during the LHC luminosity upgrade, a fourth pixel layer is inserted into the existing ATLAS Pixel Detector. A new FE-I4 readout chip and a new data acquisition chain are required to cope with the higher track rate and the resulting increased bandwidth. Among others, this includes a new readout board: the IBL ROD. One component of this board is the DSP which creates commands for the FE-I4 chip and has to be upgraded as well. In this thesis, the first tests of the IBL ROD prototype are presented. A correct communication of the DSP to its external memory is verified. Moreover, the implementations for an IBL DSP code are described and tested. This includes the first configuration of the FE-I4 with an IBL ROD. In addition, a working communication with the Histogrammer SDRAM and the Input FIFO on the IBL ROD are demonstrated.

  7. Hybridization of Environmental Microbial Community Nucleic Acids by GeoChip.

    Science.gov (United States)

    Van Nostrand, Joy D; Yin, Huaqin; Wu, Liyou; Yuan, Tong; Zhou, Jizhong

    2016-01-01

    Functional gene arrays, like the GeoChip, allow for the study of tens of thousands of genes in a single assay. The GeoChip array (5.0) contains probes for genes involved in geochemical cycling (N, C, S, and P), metal homeostasis, stress response, organic contaminant degradation, antibiotic resistance, secondary metabolism, and virulence factors as well as genes specific for fungi, protists, and viruses. Here, we briefly describe GeoChip design strategies (gene selection and probe design) and discuss minimum quantity and quality requirements for nucleic acids. We then provide detailed protocols for amplification, labeling, and hybridization of samples to the GeoChip.

  8. SiGe Integrated Circuit Developments for SQUID/TES Readout

    Science.gov (United States)

    Prêle, D.; Voisin, F.; Beillimaz, C.; Chen, S.; Piat, M.; Goldwurm, A.; Laurent, P.

    2018-03-01

    SiGe integrated circuits dedicated to the readout of superconducting bolometer arrays for astrophysics have been developed since more than 10 years at APC. Whether for Cosmic Microwave Background (CMB) observations with the QUBIC ground-based experiment (Aumont et al. in astro-ph.IM, 2016. arXiv:1609.04372) or for the Hot and Energetic Universe science theme with the X-IFU instrument on-board of the ATHENA space mission (Barret et al. in SPIE 9905, space telescopes & instrumentation 2016: UV to γ Ray, 2016. https://doi.org/10.1117/12.2232432), several kinds of Transition Edge Sensor (TES) (Irwin and Hilton, in ENSS (ed) Cryogenic particle detection, Springer, Berlin, 2005) arrays have been investigated. To readout such superconducting detector arrays, we use time or frequency domain multiplexers (TDM, FDM) (Prêle in JINST 10:C08015, 2016. https://doi.org/10.1088/1748-0221/10/08/C08015) with Superconducting QUantum Interference Devices (SQUID). In addition to the SQUID devices, low-noise biasing and amplification are needed. These last functions can be obtained by using BiCMOS SiGe technology in an Application Specific Integrated Circuit (ASIC). ASIC technology allows integration of highly optimised circuits specifically designed for a unique application. Moreover, we could reach very low-noise and wide band amplification using SiGe bipolar transistor either at room or cryogenic temperatures (Cressler in J Phys IV 04(C6):C6-101, 1994. https://doi.org/10.1051/jp4:1994616). This paper discusses the use of SiGe integrated circuits for SQUID/TES readout and gives an update of the last developments dedicated to the QUBIC telescope and to the X-IFU instrument. Both ASIC called SQmux128 and AwaXe are described showing the interest of such SiGe technology for SQUID multiplexer controls.

  9. Design and implementation of a nanosecond time-stamping readout system-on-chip for photo-detectors

    International Nuclear Information System (INIS)

    Anvar, Shebli; Château, Frédéric; Le Provost, Hervé; Louis, Frédéric; Manolopoulos, Konstantinos; Moudden, Yassir; Vallage, Bertrand; Zonca, Eric

    2014-01-01

    A readout system suitable for a large number of synchronized photo-detection units has been designed. Each unit embeds a specifically designed fully integrated communicating system based on Xilinx FPGA SoC technology. It runs the VxWorks real-time OS and a custom data acquisition software designed within the Ice middleware framework, resulting in a highly flexible, controllable and scalable distributed application. Clock distribution and delay calibration over customized fixed latency gigabit Ethernet links enable synchronous time-stamping of events with nanosecond precision. The implementation of this readout system on several data-collecting units as well as its performances are described

  10. Wide field and diffraction limited array camera for SIRTF

    International Nuclear Information System (INIS)

    Fazio, G.G.; Koch, D.G.; Melnick, G.J.

    1986-01-01

    The Infrared Array Camera for the Space Infrared Telescope Facility (SIRTF/IRAC) is capable of two-dimensional photometry in either a wide field or diffraction-limited mode over the wavelength interval from 2 to 30 microns. Three different two-dimensional direct readout (DRO) array detectors are being considered: Band 1-InSb or Si:In (2-5 microns) 128 x 128 pixels, Band 2-Si:Ga (5-18 microns) 64 x 64 pixels, and Band 3-Si:Sb (18-30 microns) 64 x 64 pixels. The hybrid DRO readout architecture has the advantages of low read noise, random pixel access with individual readout rates, and nondestructive readout. The scientific goals of IRAC are discussed, which are the basis for several important requirements and capabilities of the array camera: (1) diffraction-limited resolution from 2-30 microns, (2) use of the maximum unvignetted field of view of SIRTF, (3) simultaneous observations within the three infrared spectral bands, and (4) the capability for broad and narrow bandwidth spectral resolution. A strategy has been developed to minimize the total electronic and environmental noise sources to satisfy the scientific requirements. 7 references

  11. Design and standalone characterisation of a capacitively coupled HV-CMOS sensor chip for the CLIC vertex detector

    Science.gov (United States)

    Kremastiotis, I.; Ballabriga, R.; Campbell, M.; Dannheim, D.; Fiergolski, A.; Hynds, D.; Kulis, S.; Peric, I.

    2017-09-01

    The concept of capacitive coupling between sensors and readout chips is under study for the vertex detector at the proposed high-energy CLIC electron positron collider. The CLICpix Capacitively Coupled Pixel Detector (C3PD) is an active High-Voltage CMOS sensor, designed to be capacitively coupled to the CLICpix2 readout chip. The chip is implemented in a commercial 180 nm HV-CMOS process and contains a matrix of 128×128 square pixels with 25μm pitch. First prototypes have been produced with a standard resistivity of ~20 Ωcm for the substrate and tested in standalone mode. The results show a rise time of ~20 ns, charge gain of 190 mV/ke- and ~40 e- RMS noise for a power consumption of 4.8μW/pixel. The main design aspects, as well as standalone measurement results, are presented.

  12. The GenoChip: a new tool for genetic anthropology.

    Science.gov (United States)

    Elhaik, Eran; Greenspan, Elliott; Staats, Sean; Krahn, Thomas; Tyler-Smith, Chris; Xue, Yali; Tofanelli, Sergio; Francalacci, Paolo; Cucca, Francesco; Pagani, Luca; Jin, Li; Li, Hui; Schurr, Theodore G; Greenspan, Bennett; Spencer Wells, R

    2013-01-01

    The Genographic Project is an international effort aimed at charting human migratory history. The project is nonprofit and nonmedical, and, through its Legacy Fund, supports locally led efforts to preserve indigenous and traditional cultures. Although the first phase of the project was focused on uniparentally inherited markers on the Y-chromosome and mitochondrial DNA (mtDNA), the current phase focuses on markers from across the entire genome to obtain a more complete understanding of human genetic variation. Although many commercial arrays exist for genome-wide single-nucleotide polymorphism (SNP) genotyping, they were designed for medical genetic studies and contain medically related markers that are inappropriate for global population genetic studies. GenoChip, the Genographic Project's new genotyping array, was designed to resolve these issues and enable higher resolution research into outstanding questions in genetic anthropology. The GenoChip includes ancestry informative markers obtained for over 450 human populations, an ancient human (Saqqaq), and two archaic hominins (Neanderthal and Denisovan) and was designed to identify all known Y-chromosome and mtDNA haplogroups. The chip was carefully vetted to avoid inclusion of medically relevant markers. To demonstrate its capabilities, we compared the FST distributions of GenoChip SNPs to those of two commercial arrays. Although all arrays yielded similarly shaped (inverse J) FST distributions, the GenoChip autosomal and X-chromosomal distributions had the highest mean FST, attesting to its ability to discern subpopulations. The chip performances are illustrated in a principal component analysis for 14 worldwide populations. In summary, the GenoChip is a dedicated genotyping platform for genetic anthropology. With an unprecedented number of approximately 12,000 Y-chromosomal and approximately 3,300 mtDNA SNPs and over 130,000 autosomal and X-chromosomal SNPs without any known health, medical, or phenotypic

  13. The GenoChip: A New Tool for Genetic Anthropology

    Science.gov (United States)

    Elhaik, Eran; Greenspan, Elliott; Staats, Sean; Krahn, Thomas; Tyler-Smith, Chris; Xue, Yali; Tofanelli, Sergio; Francalacci, Paolo; Cucca, Francesco; Pagani, Luca; Jin, Li; Li, Hui; Schurr, Theodore G.; Greenspan, Bennett; Spencer Wells, R.

    2013-01-01

    The Genographic Project is an international effort aimed at charting human migratory history. The project is nonprofit and nonmedical, and, through its Legacy Fund, supports locally led efforts to preserve indigenous and traditional cultures. Although the first phase of the project was focused on uniparentally inherited markers on the Y-chromosome and mitochondrial DNA (mtDNA), the current phase focuses on markers from across the entire genome to obtain a more complete understanding of human genetic variation. Although many commercial arrays exist for genome-wide single-nucleotide polymorphism (SNP) genotyping, they were designed for medical genetic studies and contain medically related markers that are inappropriate for global population genetic studies. GenoChip, the Genographic Project’s new genotyping array, was designed to resolve these issues and enable higher resolution research into outstanding questions in genetic anthropology. The GenoChip includes ancestry informative markers obtained for over 450 human populations, an ancient human (Saqqaq), and two archaic hominins (Neanderthal and Denisovan) and was designed to identify all known Y-chromosome and mtDNA haplogroups. The chip was carefully vetted to avoid inclusion of medically relevant markers. To demonstrate its capabilities, we compared the FST distributions of GenoChip SNPs to those of two commercial arrays. Although all arrays yielded similarly shaped (inverse J) FST distributions, the GenoChip autosomal and X-chromosomal distributions had the highest mean FST, attesting to its ability to discern subpopulations. The chip performances are illustrated in a principal component analysis for 14 worldwide populations. In summary, the GenoChip is a dedicated genotyping platform for genetic anthropology. With an unprecedented number of approximately 12,000 Y-chromosomal and approximately 3,300 mtDNA SNPs and over 130,000 autosomal and X-chromosomal SNPs without any known health, medical, or phenotypic

  14. 3D-SoftChip: A Novel Architecture for Next-Generation Adaptive Computing Systems

    Directory of Open Access Journals (Sweden)

    Lee Mike Myung-Ok

    2006-01-01

    Full Text Available This paper introduces a novel architecture for next-generation adaptive computing systems, which we term 3D-SoftChip. The 3D-SoftChip is a 3-dimensional (3D vertically integrated adaptive computing system combining state-of-the-art processing and 3D interconnection technology. It comprises the vertical integration of two chips (a configurable array processor and an intelligent configurable switch through an indium bump interconnection array (IBIA. The configurable array processor (CAP is an array of heterogeneous processing elements (PEs, while the intelligent configurable switch (ICS comprises a switch block, 32-bit dedicated RISC processor for control, on-chip program/data memory, data frame buffer, along with a direct memory access (DMA controller. This paper introduces the novel 3D-SoftChip architecture for real-time communication and multimedia signal processing as a next-generation computing system. The paper further describes the advanced HW/SW codesign and verification methodology, including high-level system modeling of the 3D-SoftChip using SystemC, being used to determine the optimum hardware specification in the early design stage.

  15. Vacuum packaging of InGaAs focal plane array with four-stage thermoelectric cooler

    Science.gov (United States)

    Mo, De-feng; Liu, Da-fu; Yang, Li-yi; Xu, Qin-fei; Li, Xue

    2013-09-01

    The InGaAs focal plane array (FPA) detectors, covering the near-infrared 1~2.4 μm wavelength range, have been developed for application in space-based spectroscopy of the Earth atmosphere. This paper shows an all-metal vacuum package design for area array InGaAs detector of 1024×64 pixels, and its architecture will be given. Four-stage thermoelectric cooler (TEC) is used to cool down the FPA chip. To acquire high heat dissipation for TEC's Joule-heat, tungsten copper (CuW80) and kovar (4J29) is used as motherboard and cavity material respectively which joined by brazing. The heat loss including conduction, convection and radiation is analyzed. Finite element model is established to analyze the temperature uniformity of the chip substrate which is made of aluminum nitride (AlN). The performance of The TEC with and without heat load in vacuum condition is tested. The results show that the heat load has little influence to current-voltage relationship of TEC. The temperature difference (ΔT) increases as the input current increases. A linear relationship exists between heat load and ΔT of the TEC. Theoretical analysis and calculation show that the heat loss of radiation and conduction is about 187 mW and 82 mW respectively. Considering the Joule-heat of readout circuit and the heat loss of radiation and conduction, the FPA for a 220 K operation at room temperature can be achieved. As the thickness of AlN chip substrate is thicker than 1 millimeter, the temperature difference can be less than 0.3 K.

  16. Design of a CMOS integrated on-chip oscilloscope for spin wave characterization

    Directory of Open Access Journals (Sweden)

    Eugen Egel

    2017-05-01

    Full Text Available Spin waves can perform some optically-inspired computing algorithms, e.g. the Fourier transform, directly than it is done with the CMOS logic. This article describes a new approach for on-chip characterization of spin wave based devices. The readout circuitry for the spin waves is simulated with 65-nm CMOS technology models. Commonly used circuits for Radio Frequency (RF receivers are implemented to detect a sinusoidal ultra-wideband (5-50 GHz signal with an amplitude of at least 15 μV picked up by a loop antenna. First, the RF signal is amplified by a Low Noise Amplifier (LNA. Then, it is down-converted by a mixer to Intermediate Frequency (IF. Finally, an Operational Amplifier (OpAmp brings the IF signal to higher voltages (50-300 mV. The estimated power consumption and the required area of the readout circuit is approximately 55.5 mW and 0.168 mm2, respectively. The proposed On-Chip Oscilloscope (OCO is highly suitable for on-chip spin wave characterization regarding the frequency, amplitude change and phase information. It offers an integrated low power alternative to current spin wave detecting systems.

  17. Design and Measurement of a Low-Noise 64-Channels Front-End Readout ASIC for CdZnTe Detectors

    Energy Technology Data Exchange (ETDEWEB)

    Gan, Bo; Wei, Tingcun; Gao, Wu; Liu, Hui; Hu, Yann [School of Computer Science and Technology, Northwestern Polytechnical University, Xi' an (China)

    2015-07-01

    Cadmium zinc telluride (CdZnTe) detectors, as one of the principal detectors for the next-generation X-ray and γ-ray imagers, have high energy resolution and supporting electrode patterning in the radiation environment at room-temperature. In the present, a number of internationally renowned research institutions and universities are actively using these detector systems to carry out researches of energy spectrum analysis, medical imaging, materials characterization, high-energy physics, nuclear plant monitoring, and astrophysics. As the most important part of the readout system for the CdZnTe detector, the front-end readout application specific integrated circuit (ASIC) would have an important impact on the performances of the whole detector system. In order to ensure the small signal to noise ratio (SNR) and sufficient range of the output signal, it is necessary to design a front-end readout ASIC with very low noise and very high dynamic range. In addition, radiation hardness should be considered when the detectors are utilized in the space applications and high energy physics experiments. In this paper, we present measurements and performances of a novel multi-channel radiation-hardness low-noise front-end readout ASIC for CdZnTe detectors. The readout circuits in each channel consist of charge sensitive amplifier, leakage current compensation circuit (LCC), CR-RC shaper, S-K filter, inverse proportional amplifier, peak detect and hold circuit (PDH), discriminator and trigger logic, time sequence control circuit and driving buffer. All of 64 readout channels' outputs enter corresponding inputs of a 64 channel multiplexer. The output of the mux goes directly out of the chip via the output buffer. The 64-channel readout ASIC is implemented using the TSMC 0.35 μm mixed-signal CMOS technology. The die size of the prototype chip is 2.7 mm x 8 mm. At room temperature, the equivalent noise level of a typical channel reaches 66 e{sup -} (rms) at zero farad for a

  18. Perspective: Fabrication of integrated organ-on-a-chip via bioprinting.

    Science.gov (United States)

    Yang, Qingzhen; Lian, Qin; Xu, Feng

    2017-05-01

    Organ-on-a-chip has emerged as a powerful platform with widespread applications in biomedical engineering, such as pathology studies and drug screening. However, the fabrication of organ-on-a-chip is still a challenging task due to its complexity. For an integrated organ-on-a-chip, it may contain four key elements, i.e., a microfluidic chip, live cells/microtissues that are cultured in this chip, components for stimulus loading to mature the microtissues, and sensors for results readout. Recently, bioprinting has been used for fabricating organ-on-a-chip as it enables the printing of multiple materials, including biocompatible materials and even live cells in a programmable manner with a high spatial resolution. Besides, all four elements for organ-on-a-chip could be printed in a single continuous procedure on one printer; in other words, the fabrication process is assembly free. In this paper, we discuss the recent advances of organ-on-a-chip fabrication by bioprinting. Light is shed on the printing strategies, materials, and biocompatibility. In addition, some specific bioprinted organs-on-chips are analyzed in detail. Because the bioprinted organ-on-a-chip is still in its early stage, significant efforts are still needed. Thus, the challenges presented together with possible solutions and future trends are also discussed.

  19. On-chip supercapacitors with ultrahigh volumetric performance based on electrochemically co-deposited CuO/polypyrrole nanosheet arrays.

    Science.gov (United States)

    Qian, Tao; Zhou, Jinqiu; Xu, Na; Yang, Tingzhou; Shen, Xiaowei; Liu, Xuejun; Wu, Shishan; Yan, Chenglin

    2015-10-23

    We introduce a new method for fabricating unique on-chip supercapacitors based on CuO/polypyrrole core/shell nanosheet arrays by means of direct electrochemical co-deposition on interdigital-like electrodes. The prepared all-solid-state device demonstrates exceptionally high specific capacitance of 1275.5 F cm(-3) (∼40 times larger than that of CuO-only supercapacitors) and high-energy-density of 28.35 mWh cm(-3), which are both significantly greater than other solid-state supercapacitors. More importantly, the device maintains approximately 100% capacity retention at 2.5 A cm(-3) after 3000 cycles. The in situ co-deposition of CuO/polypyrrole nanosheets on interdigital substrate enables effective charge transport, electrode fabrication integrity, and device integration. Because of their high energy, power density, and stable cycling stability, these newly developed on-chip supercapacitors permit fast, reliable applications in portable and miniaturized electronic devices.

  20. On-chip supercapacitors with ultrahigh volumetric performance based on electrochemically co-deposited CuO/polypyrrole nanosheet arrays

    Science.gov (United States)

    Qian, Tao; Zhou, Jinqiu; Xu, Na; Yang, Tingzhou; Shen, Xiaowei; Liu, Xuejun; Wu, Shishan; Yan, Chenglin

    2015-10-01

    We introduce a new method for fabricating unique on-chip supercapacitors based on CuO/polypyrrole core/shell nanosheet arrays by means of direct electrochemical co-deposition on interdigital-like electrodes. The prepared all-solid-state device demonstrates exceptionally high specific capacitance of 1275.5 F cm-3 (˜40 times larger than that of CuO-only supercapacitors) and high-energy-density of 28.35 mWh cm-3, which are both significantly greater than other solid-state supercapacitors. More importantly, the device maintains approximately 100% capacity retention at 2.5 A cm-3 after 3000 cycles. The in situ co-deposition of CuO/polypyrrole nanosheets on interdigital substrate enables effective charge transport, electrode fabrication integrity, and device integration. Because of their high energy, power density, and stable cycling stability, these newly developed on-chip supercapacitors permit fast, reliable applications in portable and miniaturized electronic devices.

  1. Direct reading of charge multipliers with a self-triggering CMOS analog chip with 105k pixels at 50 micron pitch

    CERN Document Server

    Bellazzini, R; Minuti, M; Baldini, L; Brez, A; Cavalca, F; Latronico, L; Omodei, N; Massai, M M; Sgro, C; Costa, E; Krummenacher, P S F; De Oliveira, R

    2006-01-01

    We report on a large active area (15x15mm2), high channel density (470 pixels/mm2), self-triggering CMOS analog chip that we have developed as pixelized charge collecting electrode of a Micropattern Gas Detector. This device, which represents a big step forward both in terms of size and performance, is the last version of three generations of custom ASICs of increasing complexity. The CMOS pixel array has the top metal layer patterned in a matrix of 105600 hexagonal pixels at 50 micron pitch. Each pixel is directly connected to the underneath full electronics chain which has been realized in the remaining five metal and two poly-silicon layers of a 0.18 micron VLSI technology. The chip has customizable self-triggering capability and includes a signal pre-processing function for the automatic localization of the event coordinates. In this way it is possible to reduce significantly the readout time and the data volume by limiting the signal output only to those pixels belonging to the region of interest. The ve...

  2. Microcontroller based four-channel current readout unit for beam slit monitor

    International Nuclear Information System (INIS)

    Holikatti, A.C.; Puntambekar, T.A.; Pithawa, C.K.

    2009-01-01

    This paper describes the design and development of a microcontroller based four-channel current readout unit for Beam Slit Monitor (BSM) installed in Transport Line-1 of Indus Accelerator Complex. BSM is a diagnostic device consisting of two horizontal and two vertical blades, which can be moved independently in to the beam pipe to cut the beam transversely. The readout unit employs switched integrators with reset, hold and select switches and timing and control unit. It integrates the current output of the four blades of BSM and produces an output corresponding to the beam charge intercepted by the blade. The integrator outputs are then multiplexed and digitized using 12-bit ADC. Acquired digital data from ADC is stored into on-chip RAM of the microcontroller. The readout sequence is synchronized with the Microtron beam-timing signal. The timing of integration, hold and reset cycles is controlled by the microcontroller. The unit is connected on a serial link to the host computer in main control room. This unit has been integrated with the BSM system and is being used to obtain the electron beam profile. (author)

  3. Hybrid CMOS-Graphene Sensor Array for Subsecond Dopamine Detection.

    Science.gov (United States)

    Nasri, Bayan; Wu, Ting; Alharbi, Abdullah; You, Kae-Dyi; Gupta, Mayank; Sebastian, Sunit P; Kiani, Roozbeh; Shahrjerdi, Davood

    2017-12-01

    We introduce a hybrid CMOS-graphene sensor array for subsecond measurement of dopamine via fast-scan cyclic voltammetry (FSCV). The prototype chip has four independent CMOS readout channels, fabricated in a 65-nm process. Using planar multilayer graphene as biologically compatible sensing material enables integration of miniaturized sensing electrodes directly above the readout channels. Taking advantage of the chemical specificity of FSCV, we introduce a region of interest technique, which subtracts a large portion of the background current using a programmable low-noise constant current at about the redox potentials. We demonstrate the utility of this feature for enhancing the sensitivity by measuring the sensor response to a known dopamine concentration in vitro at three different scan rates. This strategy further allows us to significantly reduce the dynamic range requirements of the analog-to-digital converter (ADC) without compromising the measurement accuracy. We show that an integrating dual-slope ADC is adequate for digitizing the background-subtracted current. The ADC operates at a sampling frequency of 5-10 kHz and has an effective resolution of about 60 pA, which corresponds to a theoretical dopamine detection limit of about 6 nM. Our hybrid sensing platform offers an effective solution for implementing next-generation FSCV devices that can enable precise recording of dopamine signaling in vivo on a large scale.

  4. A new ion detector array and digital-signal-processor-based interface

    International Nuclear Information System (INIS)

    Langstaff, D.P.; McGinnity, T.M.; Forbes, D.M.; Birkinshaw, K.; Lawton, M.W.

    1994-01-01

    A new one-dimensional ion detector array on a silicon chip has been developed for use in mass spectrometry. It is much smaller and simpler than electro-optical arrays currently in use and in addition has a higher resolution and a zero noise level. The array consists of a one-dimensional array of metal strips (electrodes) with a pitch of 25 μm on the top surface of a silicon chip, each electrode having its own charge pulse sensor, 8-bit counter and control/interface circuitry. The chip is mounted on a ceramic substrate and is preceded by a micro-channel plate electron multiplier. Chips are butted to give a longer array. Test results show a stable operating region. A digital-signal-processor-based interface is described, which controls the mode of operation and reads the accumulated array data at the maximum rate to avoid counter overflow. (author)

  5. A new ion detector array and digital-signal-processor-based interface

    Energy Technology Data Exchange (ETDEWEB)

    Langstaff, D.P.; McGinnity, T.M.; Forbes, D.M.; Birkinshaw, K. (University Coll. of Wales, Aberystwyth (United Kingdom). Dept. of Physics); Lawton, M.W. (University of Wales Aberystwyth (United Kingdom). Dept. of Computer Science)

    1994-04-01

    A new one-dimensional ion detector array on a silicon chip has been developed for use in mass spectrometry. It is much smaller and simpler than electro-optical arrays currently in use and in addition has a higher resolution and a zero noise level. The array consists of a one-dimensional array of metal strips (electrodes) with a pitch of 25 [mu]m on the top surface of a silicon chip, each electrode having its own charge pulse sensor, 8-bit counter and control/interface circuitry. The chip is mounted on a ceramic substrate and is preceded by a micro-channel plate electron multiplier. Chips are butted to give a longer array. Test results show a stable operating region. A digital-signal-processor-based interface is described, which controls the mode of operation and reads the accumulated array data at the maximum rate to avoid counter overflow. (author).

  6. Performance of the ALIBAVA portable readout system with irradiated and non-irradiated microstrip silicon sensors

    International Nuclear Information System (INIS)

    Marco-Hernadez, R.

    2009-01-01

    A readout system for microstrip silicon sensors has been developed as a result of collaboration among the University of Liverpool, the CNM of Barcelona and the IFIC of Valencia. The name of this collaboration is ALIBAVA and it is integrated in the RD50 Collaboration. This system is able to measure the collected charge in one or two microstrip silicon sensors by reading out all the channels of the sensor(s), up to 256, as an analogue measurement. The system uses two Beetle chips to read out the detector(s). The Beetle chip is an analogue pipelined readout chip used in the LHCb experiment. The system can operate either with non-irradiated and irradiated sensors as well as with n-type and p-type microstrip silicon sensors. Heavily irradiated sensors will be used at the SLHC, so this system is being to research the performance of microstrip silicon sensors in conditions as similar as possible to the SLHC operating conditions. The system has two main parts: a hardware part and a software part. The hardware part acquires the sensor signals either from external trigger inputs, in case of a radioactive source setup is used, or from a synchronised trigger output generated by the system, if a laser setup is used. This acquired data is sent by USB to be stored in a PC for a further processing. The hardware is a dual board based system. The daughterboard is a small board intended for containing two Beetle readout chips as well as fan-ins and detector support to interface the sensors. The motherboard is intended to process the data, to control the whole hardware and to communicate with the software by USB. The software controls the system and processes the data acquired from the sensors in order to store it in an adequate format file. The main characteristics of the system will be described. Results of measurements acquired with n-type and p-type irradiated and non-irradiated detectors using both the laser and the radioactive source setup will be also presented and discussed

  7. A pixel unit-cell targeting 16 ns resolution and radiation hardness in a column read-out particle vertex detector

    International Nuclear Information System (INIS)

    Wright, M.; Millaud, J.; Nygren, D.

    1992-10-01

    A pixel unit cell (PUC) circuit architecture, optimized for a column read out architecture, is reported. Each PUC contains an integrator, active filter, comparator, and optional analog store. The time-over-threshold (TOT) discriminator allows an all-digital interface to the array periphery readout while passing an analog measure of collected charge. Use of (existing) radiation hard processes, to build a detector bump-bonded to a pixel readout array, is targeted. Here, emphasis is on a qualitative explanation of how the unique circuit implementation benefits operation for Super Collider (SSC) detector application

  8. A pixel unit-cell targeting 16ns resolution and radiation hardness in a column read-out particle vertex detector

    International Nuclear Information System (INIS)

    Wright, M.; Millaud, J.; Nygren, D.

    1993-01-01

    A pixel unit cell (PUC) circuit architecture, optimized for a column read out architecture, is reported. Each PUC contains an integrator, active filter, comparator, and optional analog store. The time-over-threshold (TOT) discriminator allows an all-digital interface to the array periphery readout while passing an analog measure of collected charge. Use of (existing) radiation hard processes, to build a detector bump-bonded to a pixel readout array, is targeted. Here emphasis is on a qualitative explanation of how the unique circuit implementation benefits operation for Super Collider (SSC) detector application. (orig.)

  9. Three-dimensional cross point readout detector design for including depth information

    Science.gov (United States)

    Lee, Seung-Jae; Baek, Cheol-Ha

    2018-04-01

    We designed a depth-encoding positron emission tomography (PET) detector using a cross point readout method with wavelength-shifting (WLS) fibers. To evaluate the characteristics of the novel detector module and the PET system, we used the DETECT2000 to perform optical photon transport in the crystal array. The GATE was also used. The detector module is made up of four layers of scintillator arrays, the five layers of WLS fiber arrays, and two sensor arrays. The WLS fiber arrays in each layer cross each other to transport light to each sensor array. The two sensor arrays are coupled to the forward and left sides of the WLS fiber array, respectively. The identification of three-dimensional pixels was determined using a digital positioning algorithm. All pixels were well decoded, with the system resolution ranging from 2.11 mm to 2.29 mm at full width at half maximum (FWHM).

  10. Tracker Readout ASIC for Proton Computed Tomography Data Acquisition.

    Science.gov (United States)

    Johnson, Robert P; Dewitt, Joel; Holcomb, Cole; Macafee, Scott; Sadrozinski, Hartmut F-W; Steinberg, David

    2013-10-01

    A unique CMOS chip has been designed to serve as the front-end of the tracking detector data acquisition system of a pre-clinical prototype scanner for proton computed tomography (pCT). The scanner is to be capable of measuring one to two million proton tracks per second, so the chip must be able to digitize the data and send it out rapidly while keeping the front-end amplifiers active at all times. One chip handles 64 consecutive channels, including logic for control, calibration, triggering, buffering, and zero suppression. It outputs a formatted cluster list for each trigger, and a set of field programmable gate arrays merges those lists from many chips to build the events to be sent to the data acquisition computer. The chip design has been fabricated, and subsequent tests have demonstrated that it meets all of its performance requirements, including excellent low-noise performance.

  11. Development of a multiplexed readout with high position resolution for positron emission tomography

    Energy Technology Data Exchange (ETDEWEB)

    Lee, Sangwon; Choi, Yong [Molecular Imaging Research & Education (MiRe) Laboratory, Department of Electronic Engineering, Sogang University, Seoul 04107 (Korea, Republic of); Kang, Jihoon [Department of Biomedical Engineering, Chonnam National University, Yeosu 550-749 (Korea, Republic of); Jung, Jin Ho [Molecular Imaging Research & Education (MiRe) Laboratory, Department of Electronic Engineering, Sogang University, Seoul 04107 (Korea, Republic of)

    2017-04-01

    Detector signals for positron emission tomography (PET) are commonly multiplexed to reduce the number of digital processing channels so that the system can remain cost effective while also maintaining imaging performance. In this work, a multiplexed readout combining Anger position estimation algorithm and position decoder circuit (PDC) was developed to reduce the number of readout channels by a factor of 24, 96-to-4. The data acquisition module consisted of a TDC (50 ps resolution), 4-channel ADCs (12 bit, 105 MHz sampling rate), 2 GB SDRAM and USB3.0. The performance of the multiplexed readout was assessed with a high-resolution PET detector block composed of 2×3 detector modules, each consisting of an 8×8 array of 1.52×1.52×6 mm{sup 3} LYSO, a 4×4 array of 3×3 mm{sup 2} silicon photomultiplier (SiPM) and 13.4×13.4 mm{sup 2} light guide with 0.7 mm thickness. The acquired flood histogram showed that all 384 crystals could be resolved. The average energy resolution at 511 keV was 13.7±1.6% full-width-at-half-maximum (FWHM) and the peak-to-valley ratios of the flood histogram on the horizontal and vertical lines were 18.8±0.8 and 22.8±1.3, respectively. The coincidence resolving time of a pair of detector blocks was 6.2 ns FWHM. The reconstructed phantom image showed that rods down to a diameter of 1.6 mm could be resolved. The results of this study indicate that the multiplexed readout would be useful in developing a PET with a spatial resolution less than the pixel size of the photosensor, such as a SiPM array.

  12. Design of a 40-nm CMOS integrated on-chip oscilloscope for 5-50 GHz spin wave characterization

    Science.gov (United States)

    Egel, Eugen; Csaba, György; Dietz, Andreas; Breitkreutz-von Gamm, Stephan; Russer, Johannes; Russer, Peter; Kreupl, Franz; Becherer, Markus

    2018-05-01

    Spin wave (SW) devices are receiving growing attention in research as a strong candidate for low power applications in the beyond-CMOS era. All SW applications would require an efficient, low power, on-chip read-out circuitry. Thus, we provide a concept for an on-chip oscilloscope (OCO) allowing parallel detection of the SWs at different frequencies. The readout system is designed in 40-nm CMOS technology and is capable of SW device characterization. First, the SWs are picked up by near field loop antennas, placed below yttrium iron garnet (YIG) film, and amplified by a low noise amplifier (LNA). Second, a mixer down-converts the radio frequency (RF) signal of 5 - 50 GHz to lower intermediate frequencies (IF) around 10 - 50 MHz. Finally, the IF signal can be digitized and analyzed regarding the frequency, amplitude and phase variation of the SWs. The power consumption and chip area of the whole OCO are estimated to 166.4 mW and 1.31 mm2, respectively.

  13. A multichannel compact readout system for single photon detection: Design and performances

    Energy Technology Data Exchange (ETDEWEB)

    Argentieri, A.G. [Istituto Nazionale di Fisica Nucleare, via E. Orabona 4, 70126 Bari (Italy); Cisbani, E.; Colilli, S.; Cusanno, F. [Istituto Superiore di Sanita, viale Regina Elena 299, 00161 Roma (Italy); De Leo, R. [Istituto Nazionale di Fisica Nucleare, via E. Orabona 4, 70126 Bari (Italy); Fratoni, R.; Garibaldi, F.; Giuliani, F.; Gricia, M.; Lucentini, M. [Istituto Superiore di Sanita, viale Regina Elena 299, 00161 Roma (Italy); Marra, M. [Istituto Nazionale di Fisica Nucleare, via E. Orabona 4, 70126 Bari (Italy); Musico, Paolo, E-mail: Paolo.Musico@ge.infn.i [Istituto Nazionale di Fisica Nucleare, via Dodecaneso 33, 16146 Genova (Italy); Santavenere, F.; Torrioli, S. [Istituto Superiore di Sanita, viale Regina Elena 299, 00161 Roma (Italy)

    2010-05-21

    Optimal exploitation of Multi Anode PhotoMultiplier Tubes (MAPMT) as imaging devices requires the acquisition of a large number of independent channels; despite the rather wide demand, on-the-shelf electronics for this purpose does not exist. A compact independent channel readout system for an array of MAPMTs has been developed and tested . The system can handle up to 4096 independent channels, covering an area of about 20x20cm{sup 2} with pixel size of 3x3mm{sup 2}, using Hamamatsu H-9500 devices. The front-end is based on a 64 channels VLSI custom chip called MAROC, developed by IN2P3 Orsay (France) group, controlled by means of a Field Programmable Gate Array (FPGA) which implements configuration, triggering and data conversion controls. Up to 64 front-end cards can be housed in four backplanes and a central unit collects data from all of them, communicating with a control Personal Computer (PC) using an high speed USB 2.0 connection. A complete system has been built and tested. Eight Flat MAPMTs (256 anodes Hamamatsu H-9500) have been arranged on a boundary of a 3x3 matrix for a grand total of 2048 channels. This detector has been used to verify the performances of a focusing aerogel RICH prototype using an electron beam at the Frascati (Rome) INFN National Laboratory Beam Test Facility (BTF) during the last week of January 2009. Data analysis is ongoing: the first results are encouraging, showing that the Cherenkov rings are well identified by this system.

  14. A multichannel compact readout system for single photon detection: Design and performances

    Science.gov (United States)

    Argentieri, A. G.; Cisbani, E.; Colilli, S.; Cusanno, F.; De Leo, R.; Fratoni, R.; Garibaldi, F.; Giuliani, F.; Gricia, M.; Lucentini, M.; Marra, M.; Musico, Paolo; Santavenere, F.; Torrioli, S.

    2010-05-01

    Optimal exploitation of Multi Anode PhotoMultiplier Tubes (MAPMT) as imaging devices requires the acquisition of a large number of independent channels; despite the rather wide demand, on-the-shelf electronics for this purpose does not exist. A compact independent channel readout system for an array of MAPMTs has been developed and tested [1,2]. The system can handle up to 4096 independent channels, covering an area of about 20×20 cm2 with pixel size of 3×3 mm2, using Hamamatsu H-9500 devices. The front-end is based on a 64 channels VLSI custom chip called MAROC, developed by IN2P3 Orsay (France) group, controlled by means of a Field Programmable Gate Array (FPGA) which implements configuration, triggering and data conversion controls. Up to 64 front-end cards can be housed in four backplanes and a central unit collects data from all of them, communicating with a control Personal Computer (PC) using an high speed USB 2.0 connection. A complete system has been built and tested. Eight Flat MAPMTs (256 anodes Hamamatsu H-9500) have been arranged on a boundary of a 3×3 matrix for a grand total of 2048 channels. This detector has been used to verify the performances of a focusing aerogel RICH prototype using an electron beam at the Frascati (Rome) INFN National Laboratory Beam Test Facility (BTF) during the last week of January 2009. Data analysis is ongoing: the first results are encouraging, showing that the Cherenkov rings are well identified by this system.

  15. An asynchronous data-driven readout prototype for CEPC vertex detector

    Science.gov (United States)

    Yang, Ping; Sun, Xiangming; Huang, Guangming; Xiao, Le; Gao, Chaosong; Huang, Xing; Zhou, Wei; Ren, Weiping; Li, Yashu; Liu, Jianchao; You, Bihui; Zhang, Li

    2017-12-01

    The Circular Electron Positron Collider (CEPC) is proposed as a Higgs boson and/or Z boson factory for high-precision measurements on the Higgs boson. The precision of secondary vertex impact parameter plays an important role in such measurements which typically rely on flavor-tagging. Thus silicon CMOS Pixel Sensors (CPS) are the most promising technology candidate for a CEPC vertex detector, which can most likely feature a high position resolution, a low power consumption and a fast readout simultaneously. For the R&D of the CEPC vertex detector, we have developed a prototype MIC4 in the Towerjazz 180 nm CMOS Image Sensor (CIS) process. We have proposed and implemented a new architecture of asynchronous zero-suppression data-driven readout inside the matrix combined with a binary front-end inside the pixel. The matrix contains 128 rows and 64 columns with a small pixel pitch of 25 μm. The readout architecture has implemented the traditional OR-gate chain inside a super pixel combined with a priority arbiter tree between the super pixels, only reading out relevant pixels. The MIC4 architecture will be introduced in more detail in this paper. It will be taped out in May and will be characterized when the chip comes back.

  16. Merlin: a fast versatile readout system for Medipix3

    International Nuclear Information System (INIS)

    Plackett, R; Horswell, I; Gimenez, E N; Marchal, J; Omar, D; Tartoni, N

    2013-01-01

    This contribution reports on the development of a new high rate readout system for the Medipix3 hybrid pixel ASIC developed by the Detector Group at Diamond Light Source. It details the current functionality of the system and initial results from tests on Diamond's B16 beamline. The Merlin system is based on a National Instruments PXI/FlexRIO system running a Xilinx Virtex5 FPGA. It is capable of recording Medipix3 256 by 256 by 12 bit data frames at over 1 kHz in bursts of 1200 frames and running at over 100 Hz continuously to disk or over a TCP/IP link. It is compatible with the standard Medipix3 single chipboards developed at CERN and is capable of driving them over cable lengths of up to 10 m depending on the data rate required. In addition to a standalone graphical interface, a system of remote TCP/IP control and data transfer has been developed to allow easy integration with third party control systems and scripting languages. Two Merlin systems are being deployed on the B16 and I16 beamlines at Diamond and the system has been integrated with the EPICS/GDA control systems used. Results from trigger synchronisation, fast burst and high rate tests made on B16 in March are reported and demonstrate an encouraging reliability and timing accuracy. In addition to normal high resolution imaging applications of Medipix3, the results indicate the system could profitably be used in 'pump and probe' style experiments, where a very accurate, high frame rate is especially beneficial. In addition to these two systems, Merlin is being used by the Detector Group to test the Excalibur 16 chip hybrid modules, and by the LHCb VELO Pixel Upgrade group in their forthcoming testbeams. Additionally the contribution looks forward to further developments and improvements in the system, including full rate quad chip readout capability, multi-FPGA support, long distance optical communication and further functionality enhancements built on the capabilities of the Medipix3 chips.

  17. Merlin: a fast versatile readout system for Medipix3

    Science.gov (United States)

    Plackett, R.; Horswell, I.; Gimenez, E. N.; Marchal, J.; Omar, D.; Tartoni, N.

    2013-01-01

    This contribution reports on the development of a new high rate readout system for the Medipix3 hybrid pixel ASIC developed by the Detector Group at Diamond Light Source. It details the current functionality of the system and initial results from tests on Diamond's B16 beamline. The Merlin system is based on a National Instruments PXI/FlexRIO system running a Xilinx Virtex5 FPGA. It is capable of recording Medipix3 256 by 256 by 12 bit data frames at over 1 kHz in bursts of 1200 frames and running at over 100 Hz continuously to disk or over a TCP/IP link. It is compatible with the standard Medipix3 single chipboards developed at CERN and is capable of driving them over cable lengths of up to 10 m depending on the data rate required. In addition to a standalone graphical interface, a system of remote TCP/IP control and data transfer has been developed to allow easy integration with third party control systems and scripting languages. Two Merlin systems are being deployed on the B16 and I16 beamlines at Diamond and the system has been integrated with the EPICS/GDA control systems used. Results from trigger synchronisation, fast burst and high rate tests made on B16 in March are reported and demonstrate an encouraging reliability and timing accuracy. In addition to normal high resolution imaging applications of Medipix3, the results indicate the system could profitably be used in `pump and probe' style experiments, where a very accurate, high frame rate is especially beneficial. In addition to these two systems, Merlin is being used by the Detector Group to test the Excalibur 16 chip hybrid modules, and by the LHCb VELO Pixel Upgrade group in their forthcoming testbeams. Additionally the contribution looks forward to further developments and improvements in the system, including full rate quad chip readout capability, multi-FPGA support, long distance optical communication and further functionality enhancements built on the capabilities of the Medipix3 chips.

  18. A microfluidic chip with a U-shaped microstructure array for multicellular spheroid formation, culturing and analysis

    International Nuclear Information System (INIS)

    Fu, Chien-Yu; Chang, Hwan-You; Tseng, Sheng-Yang; Yang, Shih-Mo; Hsu, Long; Liu, Cheng-Hsien

    2014-01-01

    Multicellular spheroids (MCS), formed by self-assembly of single cells, are commonly used as a three-dimensional cell culture model to bridge the gap between in vitro monolayer culture and in vivo tissues. However, current methods for MCS generation and analysis still suffer drawbacks such as being labor-intensive and of poor controllability, and are not suitable for high-throughput applications. This study demonstrates a novel microfluidic chip to facilitate MCS formation, culturing and analysis. The chip contains an array of U-shaped microstructures fabricated by photopolymerizing the poly(ethylene glycol) diacrylate hydrogel through defining the ultraviolet light exposure pattern with a photomask. The geometry of the U-shaped microstructures allowed trapping cells into the pocket through the actions of fluid flow and the force of gravity. The hydrogel is non-adherent for cells, promoting the formation of MCS. Its permselective property also facilitates exchange of nutrients and waste for MCS, while providing protection of MCS from shearing stress during the medium perfusion. Heterotypic MCS can be formed easily by manipulating the cell trapping steps. Subsequent drug susceptibility analysis and long-term culture could also be achieved within the same chip. This MCS formation and culture platform can be used as a micro-scale bioreactor and applied in many cell biology and drug testing studies. (paper)

  19. The ALTRO Chip A 16-channel A/D Converter and Digital Processor for Gas Detectors

    CERN Document Server

    Esteve-Bosch, R; Mota, B; Musa, L

    2003-01-01

    The ALTRO (ALICE TPC Read Out) chip is a mixed-signal integrated circuit designed to be one of the building blocks of the readout electronics for gas detectors. Originally conceived and optimised for the Time Projection Chamber (TPC) of the ALICE experiment at the CERN LHC, its architecture and programmability makes it suitable for the readout of a wider class of gas detectors. In one single chip, the analogue signals from 16 channels are digitised, processed, compressed and stored in a multi-acquisition memory. The Analogue-to- Digital converters embedded in the chip have a 10-bit dynamic range and a maximum sampling rate in the range of 20 to 40MHz. After digitisation, a pipelined hardwired Processor is able to remove from the input signal a wide range of systematic and non-systematic perturbations, related to the non-ideal behaviour of the detector, temperature variation of the electronics, environmental noise, etc. Moreover, the Processor is able to suppress the signal tail within 1mus after the pulse pea...

  20. Origami chip-on-sensor design: progress and new developments

    International Nuclear Information System (INIS)

    Irmler, C; Bergauer, T; Frankenberger, A; Friedl, M; Gfall, I; Valentan, M; Ishikawa, A; Kato, E; Negishi, K; Kameswara, R; Mohanty, G; Onuki, Y; Shimizu, N; Tsuboyama, T

    2013-01-01

    The Belle II silicon vertex detector will consist of four layers of double-sided silicon strip detectors, arranged in ladders. Each sensor will be read out individually by utilizing the Origami chip-on-sensor concept, where the APV25 chips are placed on flexible circuits, glued on top of the sensors. Beside a best compromise between low material budget and sufficient SNR, this concept allows efficient CO 2 cooling of the readout chips by a single, thin cooling pipe per ladder. Recently, we assembled a module consisting of two consecutive 6'' double-sided silicon strip detectors, both read out by Origami flexes. Such a compound of Origami modules is required for the ladders of the outer Belle II SVD layers. Consequently, it is intended to verify the scalability of the assembly procedure, the performance of combined Origami flexes as well as the efficiency of the CO 2 cooling system for a higher number of APV25 chips.

  1. Development of a new photo-detector readout technique for PET and CT imaging

    CERN Document Server

    Powolny, François; Auffray, Etiennette; Dosanjh, Manjit; Jarron, Pierre; Kaplon, Jan; Lecoq, Paul; Meyer, T C; Trummer, Julia; Velitchko, Sandra

    2007-01-01

    In the framework of the European FP6's BioCare project, we develop a novel photo-detector readout technique to increase sensitivity and timing precision for molecular imaging in Positron Emission Tomography (PET) and Computer Tomography (CT). Within the Project's work packages, the CERN-BioCare group focuses on the development of a PET detection head suitable to process data from both PET and CT operation in one unit. The detector module consists of a LSO matrix coupled to an APD array. The signal is processed by a fast and low noise readout electronics recently developed for experiments at the Large Hadron Collider (LHC) at CERN. The functioning of the individual system components and the performance of the entire readout channel are presented.

  2. On-chip supercapacitors with ultrahigh volumetric performance based on electrochemically co-deposited CuO/polypyrrole nanosheet arrays

    International Nuclear Information System (INIS)

    Qian, Tao; Zhou, Jinqiu; Xu, Na; Yang, Tingzhou; Shen, Xiaowei; Liu, Xuejun; Yan, Chenglin; Wu, Shishan

    2015-01-01

    We introduce a new method for fabricating unique on-chip supercapacitors based on CuO/polypyrrole core/shell nanosheet arrays by means of direct electrochemical co-deposition on interdigital-like electrodes. The prepared all-solid-state device demonstrates exceptionally high specific capacitance of 1275.5 F cm"−"3 (∼40 times larger than that of CuO-only supercapacitors) and high-energy-density of 28.35 mWh cm"−"3, which are both significantly greater than other solid-state supercapacitors. More importantly, the device maintains approximately 100% capacity retention at 2.5 A cm"−"3 after 3000 cycles. The in situ co-deposition of CuO/polypyrrole nanosheets on interdigital substrate enables effective charge transport, electrode fabrication integrity, and device integration. Because of their high energy, power density, and stable cycling stability, these newly developed on-chip supercapacitors permit fast, reliable applications in portable and miniaturized electronic devices. (paper)

  3. A Neuron- and a Synapse Chip for Artificial Neural Networks

    DEFF Research Database (Denmark)

    Lansner, John; Lehmann, Torsten

    1992-01-01

    A cascadable, analog, CMOS chip set has been developed for hardware implementations of artificial neural networks (ANN's):I) a neuron chip containing an array of neurons with hyperbolic tangent activation functions and adjustable gains, and II) a synapse chip (or a matrix-vector multiplier) where...

  4. Normalization and experimental design for ChIP-chip data

    Directory of Open Access Journals (Sweden)

    Alekseyenko Artyom A

    2007-06-01

    Full Text Available Abstract Background Chromatin immunoprecipitation on tiling arrays (ChIP-chip has been widely used to investigate the DNA binding sites for a variety of proteins on a genome-wide scale. However, several issues in the processing and analysis of ChIP-chip data have not been resolved fully, including the effect of background (mock control subtraction and normalization within and across arrays. Results The binding profiles of Drosophila male-specific lethal (MSL complex on a tiling array provide a unique opportunity for investigating these topics, as it is known to bind on the X chromosome but not on the autosomes. These large bound and control regions on the same array allow clear evaluation of analytical methods. We introduce a novel normalization scheme specifically designed for ChIP-chip data from dual-channel arrays and demonstrate that this step is critical for correcting systematic dye-bias that may exist in the data. Subtraction of the mock (non-specific antibody or no antibody control data is generally needed to eliminate the bias, but appropriate normalization obviates the need for mock experiments and increases the correlation among replicates. The idea underlying the normalization can be used subsequently to estimate the background noise level in each array for normalization across arrays. We demonstrate the effectiveness of the methods with the MSL complex binding data and other publicly available data. Conclusion Proper normalization is essential for ChIP-chip experiments. The proposed normalization technique can correct systematic errors and compensate for the lack of mock control data, thus reducing the experimental cost and producing more accurate results.

  5. Chip-based molecularly imprinted monolithic capillary array columns coated GO/SiO2 for selective extraction and sensitive determination of rhodamine B in chili powder.

    Science.gov (United States)

    Zhai, Haiyun; Huang, Lu; Chen, Zuanguang; Su, Zihao; Yuan, Kaisong; Liang, Guohuan; Pan, Yufang

    2017-01-01

    A novel solid-phase extraction chip embedded with array columns of molecularly imprinted polymer-coated silanized graphene oxide (GO/SiO2-MISPE) was established to detect trace rhodamine B (RB) in chili powder. GO/SiO2-MISPE monolithic columns for RB detection were prepared by optimizing the supporting substrate, template, and polymerizing monomer under mild water bath conditions. Adsorption capacity and specificity, which are critical properties for the application of the GO/SiO2-MISPE monolithic column, were investigated. GO/SiO2-MIP was examined by scanning electron microscopy (SEM) and Fourier transform-infrared spectroscopy. The recovery and the intraday and interday relative standard deviations for RB ranged from 83.7% to 88.4% and 2.5% to 4.0% and the enrichment factors were higher than 110-fold. The chip-based array columns effectively eliminated impurities in chili powder, indicating that the chip-based GO/SiO2-MISPE method was reliable for RB detection in food samples using high-performance liquid chromatography. Accordingly, this method has direct applications for monitoring potentially harmful dyes in processed food. Copyright © 2016 Elsevier Ltd. All rights reserved.

  6. Photon counting arrays for AO wavefront sensors

    CERN Document Server

    Vallerga, J; McPhate, J; Mikulec, Bettina; Clark, Allan G; Siegmund, O; CERN. Geneva

    2005-01-01

    Future wavefront sensors for AO on large telescopes will require a large number of pixels and must operate at high frame rates. Unfortunately for CCDs, there is a readout noise penalty for operating faster, and this noise can add up rather quickly when considering the number of pixels required for the extended shape of a sodium laser guide star observed with a large telescope. Imaging photon counting detectors have zero readout noise and many pixels, but have suffered in the past with low QE at the longer wavelengths (>500 nm). Recent developments in GaAs photocathode technology, CMOS ASIC readouts and FPGA processing electronics have resulted in noiseless WFS detector designs that are competitive with silicon array detectors, though at ~40% the QE of CCDs. We review noiseless array detectors and compare their centroiding performance with CCDs using the best available characteristics of each. We show that for sub-aperture binning of 6x6 and greater that noiseless detectors have a smaller centroid error at flu...

  7. A Robust and Low-Complexity Gas Recognition Technique for On-Chip Tin-Oxide Gas Sensor Array

    Directory of Open Access Journals (Sweden)

    Farid Flitti

    2008-01-01

    Full Text Available Gas recognition is a new emerging research area with many civil, military, and industrial applications. The success of any gas recognition system depends on its computational complexity and its robustness. In this work, we propose a new low-complexity recognition method which is tested and successfully validated for tin-oxide gas sensor array chip. The recognition system is based on a vector angle similarity measure between the query gas and the representatives of the different gas classes. The latter are obtained using a clustering algorithm based on the same measure within the training data set. Experimented results on our in-house gas sensors array show more than 98% of correct recognition. The robustness of the proposed method is tested by recognizing gas measurements with simulated drift. Less than 1% of performance degradation is noted at the worst case scenario which represents a significant improvement when compared to the current state-of-the-art.

  8. The front-end chip of the SuperB SVT detector

    International Nuclear Information System (INIS)

    Giorgi, F.; Comotti, D.; Manghisoni, M.; Re, V.; Traversi, G.; Fabbri, L.; Gabrielli, A.; Pellegrini, G.; Sbarra, C.; Semprini-Cesari, N.; Valentinetti, S.; Villa, M.; Zoccoli, A.; Berra, A.; Lietti, D.; Prest, M.; Bevan, A.; Wilson, F.; Beck, G.; Morris, J.

    2013-01-01

    The asymmetric e + e − collider SuperB is designed to deliver a high luminosity, greater than 10 36 cm −2 s −1 , with moderate beam currents and a reduced center of mass boost with respect to earlier B-Factories. The innermost detector is the Silicon Vertex Tracker which is made of 5 layers of double sided silicon strip sensors plus a layer 0, that can be equipped with short striplets detectors in a first phase of the experiment. In order to achieve an overall track reconstruction efficiency above 98% it is crucial to optimize both analog and digital readout circuits. The readout architecture being developed for the front-end chips will be able to cope with the very high rates expected in the first layer. The digital readout will be optimized to be fully efficient for hit rates up to 2 MHz/strip, including large margins on the maximum expected background rates, but can potentially accommodate higher rates with a proper tuning of the buffer depth. The readout is based on a triggered architecture where each of the 128 strip channel is provided with a dedicated digital buffer. Each buffer collects the digitized charge information by means of a 4-bit TOT, storing it in conjunction with the related time stamp. The depth of buffers was dimensioned considering the expected trigger latency and hit rate including suitable safety margins. Every buffer is connected to a highly parallelized circuit handling the trigger logic, rejecting expired data in the buffers and channeling the parallel stream of triggered hits to the common output of the chip. The presented architecture has been modeled by HDL language and investigated with a Monte Carlo hit generator emulating the analog front-end behavior. The simulations showed that even applying the highest stressing conditions, about 2 MHz per strip, the efficiency of the digital readout remained above 99.8%

  9. A custom readout electronics for the BESIII CGEM detector

    International Nuclear Information System (INIS)

    Rolo, M. Da Rocha; Alexeev, M.; Amoroso, A.; Bianchi, F.; Cossio, F.; Mori, F. De; Destefanis, M.; Ferroli, R. Baldini; Chai, J.Y.; Bertani, M.; Calcaterra, A.; Capodiferro, M.; Cerioni, S.; Bettoni, D.; Canale, N.; Carassiti, V.; Chiozzi, S.; Cibinetto, G.; Ramusino, A. Cotta; Bugalho, R.

    2017-01-01

    readout, and reviewing the first silicon results of the chip prototype.

  10. A custom readout electronics for the BESIII CGEM detector

    Science.gov (United States)

    Da Rocha Rolo, M.; Alexeev, M.; Amoroso, A.; Baldini Ferroli, R.; Bertani, M.; Bettoni, D.; Bianchi, F.; Bugalho, R.; Calcaterra, A.; Canale, N.; Capodiferro, M.; Carassiti, V.; Cerioni, S.; Chai, J. Y.; Chiozzi, S.; Cibinetto, G.; Cossio, F.; Cotta Ramusino, A.; De Mori, F.; Destefanis, M.; Di Francesco, A.; Dong, J.; Evangelisti, F.; Farinelli, R.; Fava, L.; Felici, G.; Fioravanti, E.; Garzia, I.; Gatta, M.; Greco, M.; Lavezzi, L.; Leng, C. Y.; Li, H.; Maggiora, M.; Malaguti, R.; Marcello, S.; Marciniewski, P.; Melchiorri, M.; Mezzadri, G.; Mignone, M.; Morello, G.; Pacetti, S.; Patteri, P.; Pellegrino, J.; Pelosi, A.; Rivetti, A.; Savrié, M.; Scodeggio, M.; Soldani, E.; Sosio, S.; Spataro, S.; Tskhadadze, E.; Varela, J.; Verma, S.; Wheadon, R.; Yan, L.

    2017-07-01

    For the upgrade of the inner tracker of the BESIII spectrometer, planned for 2018, a lightweight tracker based on an innovative Cylindrical Gas Electron Multiplier (CGEM) detector is now under development. The analogue readout of the CGEM enables the use of a charge centroid algorithm to improve the spatial resolution to better than 130 μm while loosening the pitch strip to 650 μm, which allows to reduce the total number of channels to about 10 000. The channels are readout by 160 dedicated integrated 64-channel front-end ASICs, providing a time and charge measurement and featuring a fully-digital output. The energy measurement is extracted either from the time-over-threshold (ToT) or the 10-bit digitisation of the peak amplitude of the signal. The time of the event is generated by quad-buffered low-power TDCs, allowing for rates in excess of 60 kHz per channel. The TDCs are based on analogue interpolation techniques and produce a time stamp (or two, if working in ToT mode) of the event with a time resolution better than 50 ps. The front-end noise, based on a CSA and a two-stage complex conjugated pole shapers, dominate the channel intrinsic time jitter, which is less than 5 ns r.m.s. The time information of the hit can be used to reconstruct the track path, operating the detector as a small TPC and hence improving the position resolution when the distribution of the cloud, due to large incident angle or magnetic field, is very broad. Event data is collected by an off-detector motherboard, where each GEM-ROC readout card handles 4 ASIC carrier FEBs (512 channels). Configuration upload and data readout between the off-detector electronics and the VME-based data collector cards are managed by bi-directional fibre optical links. This paper covers the design of a custom front-end electronics for the readout of the new inner tracker of the BESIII experiment, addressing the relevant design aspects of the detector electronics and the front-end ASIC for the CGEM readout

  11. Readout system of TPC/MPD NICA project

    Energy Technology Data Exchange (ETDEWEB)

    Averyanov, A. V.; Bajajin, A. G.; Chepurnov, V. F.; Cheremukhina, G. A.; Fateev, O. V.; Korotkova, A. M.; Levchanovskiy, F. V.; Lukstins, J.; Movchan, S. A.; Razin, S. V.; Rybakov, A. A.; Vereschagin, S. V., E-mail: vereschagin@jinr.ru; Zanevsky, Yu. V.; Zaporozhets, S. A.; Zruyev, V. N. [Joint Institute for Nuclear Research (Russian Federation)

    2015-12-15

    The time-projection chamber (TPC) is the main tracking detector in the MPD/NICA. The information on charge-particle tracks in the TPC is registered by the MWPG with cathode pad readout. The frontend electronics (FEE) are developed with use of modern technologies such as application specific integrated circuits (ASIC), field-programmable gate arrays (FPGA), and data transfer to a concentrator via a fast optical interface. The main parameters of the FEE are as follows: total number of channels, ∼95 000; data stream from the whole TPC, 5 GB/s; low power consumption, less than 100 mW/ch; signal to noise ratio (S/N), 30; equivalent noise charge (ENC), <1000e{sup –} (C{sub in} = 10–20 pF); and zero suppression (pad signal rejection ∼90%). The article presents the status of the readout chamber construction and the data acquisition system. The results of testing FEE prototypes are presented.

  12. SNP typing on the NanoChip electronic microarray

    DEFF Research Database (Denmark)

    Børsting, Claus; Sanchez Sanchez, Juan Jose; Morling, Niels

    2005-01-01

    We describe a single nucleotide polymorphism (SNP) typing protocol developed for the NanoChip electronic microarray. The NanoChip array consists of 100 electrodes covered by a thin hydrogel layer containing streptavidin. An electric currency can be applied to one, several, or all electrodes...

  13. The NA62 Gigatracker: Detector properties and pixel read-out architectures

    International Nuclear Information System (INIS)

    Fiorini, M.; Carassiti, V.; Ceccucci, A.; Cortina, E.; Cotta Ramusino, A.; Dellacasa, G.; Jarron, P.; Kaplon, J.; Kluge, A.; Marchetto, F.; Martin, E.; Martoiu, S.; Mazza, G.; Noy, M.; Petrucci, F.; Riedler, P.; Rivetti, A.; Tiuraniemi, S.

    2010-01-01

    The beam spectrometer of the NA62 experiment, named Gigatracker, has to perform single track reconstruction with unprecedented time resolution (150 ps rms) in a harsh radiation environment. To meet these requirements, and in order to reduce material budget to a minimum, three hybrid silicon pixel detector stations will be installed in vacuum. An adequate strategy to compensate for the discriminator time-walk must be implemented and R and D investigating two different options is ongoing. Two read-out chip prototypes have been designed in order to compare their performance: one approach is based on the use of a constant-fraction discriminator followed by an on-pixel TDC, while the other one is based on the use of a time-over-threshold circuit followed by a TDC shared by a group of pixels. This paper describes the Gigatracker system, presents the global architectures of both read-out ASICs and reviews the current status of the R and D project.

  14. Test of the CMS microstrip silicon tracker readout and control system

    CERN Document Server

    Zghiche, A

    2001-01-01

    The Microstrip Silicon tracker of the CMS detector is designed to provide robust particle tracking and vertex reconstruction within a strong magnetic field in the high luminosity environment of the LHC. The Tracker readout system employs Front-End Driver cards to digitize and buffer the analogue data arriving via optical links from on detector pipeline chips. The control chain of the front-end electronic is built to operate via optical fibers in order to shield the communications from the outside noise. Components close to the final design have been assembled to be tested in the X5 beam area at CERN where a dedicated 25 ns temporal structure beam has been made available by the SPS. This paper describes the hardware and the software developed for readout and control of data acquired by the front-end electronics operating at 40 MHz, Some preliminary results of the tests performed in the 25 ns beam are also given. (8 refs).

  15. Power distribution and substrate noise coupling investigations on the behavioral level for photon counting imaging readout circuits

    International Nuclear Information System (INIS)

    Lundgren, Jan; Abdalla, Suliman; O'Nils, Mattias; Oelmann, Bengt

    2007-01-01

    In modern mixed-signal system design, there are increasing problems associated with noise coupling caused by switching digital parts to sensitive analog parts. As a consequence, there is a growing necessity to understand these problems. In order to avoid costly design iterations, noise coupling simulations should be initiated as early as possible in the design chain. The problems associated with on-chip noise coupling have been discovered in photon counting pixel detector readout systems, where the level of integration of analog and digital circuits is very high on a very small area, and it would appear that these problems will continue to increase for future system designs in this field. This paper deals with the functionality of utilizing behavioral level models for simulating noise coupling in these readout systems. The methods and models are described and simulation results are shown for a photon counting pixel detector readout system

  16. Pixel readout ASIC for an APD based 2D X-ray hybrid pixel detector with sub-nanosecond resolution

    Energy Technology Data Exchange (ETDEWEB)

    Thil, Ch., E-mail: christophe.thil@ziti.uni-heidelberg.d [Heidelberg University, Institute of Computer Engineering, B6, 26, 68161 Mannheim (Germany); Baron, A.Q.R. [RIKEN SPring-8 Center, 1-1-1 Kouto, Sayo-cho, Sayo-gun, Hyogo 679-5148 (Japan); Fajardo, P. [ESRF, Polygone Scientifique Louis Neel, 6, rue Jules Horowitz, 38000 Grenoble (France); Fischer, P. [Heidelberg University, Institute of Computer Engineering, B6, 26, 68161 Mannheim (Germany); Graafsma, H. [DESY, Notkestrasse 85, 22607 Hamburg (Germany); Rueffer, R. [ESRF, Polygone Scientifique Louis Neel, 6, rue Jules Horowitz, 38000 Grenoble (France)

    2011-02-01

    The fast response and the short recovery time of avalanche photodiodes (APDs) in linear mode make those devices ideal for direct X-ray detection in applications requiring high time resolution or counting rate. In order to provide position sensitivity, the XNAP project aims at creating a hybrid pixel detector with nanosecond time resolution based on a monolithic APD sensor array with 32 x32 pixels covering about 1 cm{sup 2} active area. The readout is implemented in a pixelated front-end ASIC suited for the readout of such arrays, matched to pixels of 280{mu}mx280{mu}m size. Every single channel features a fast transimpedance amplifier, a discriminator with locally adjustable threshold and two counters with high dynamic range and counting speed able to accumulate X-ray hits with no readout dead time. Additionally, the detector can be operated in list mode by time-stamping every single event with sub-nanosecond resolution. In a first phase of the project, a 4x4 pixel test module is built to validate the conceptual design of the detector. The XNAP project is briefly presented and the performance of the readout ASIC is discussed.

  17. Pixel readout ASIC for an APD based 2D X-ray hybrid pixel detector with sub-nanosecond resolution

    International Nuclear Information System (INIS)

    Thil, Ch.; Baron, A.Q.R.; Fajardo, P.; Fischer, P.; Graafsma, H.; Rueffer, R.

    2011-01-01

    The fast response and the short recovery time of avalanche photodiodes (APDs) in linear mode make those devices ideal for direct X-ray detection in applications requiring high time resolution or counting rate. In order to provide position sensitivity, the XNAP project aims at creating a hybrid pixel detector with nanosecond time resolution based on a monolithic APD sensor array with 32 x32 pixels covering about 1 cm 2 active area. The readout is implemented in a pixelated front-end ASIC suited for the readout of such arrays, matched to pixels of 280μmx280μm size. Every single channel features a fast transimpedance amplifier, a discriminator with locally adjustable threshold and two counters with high dynamic range and counting speed able to accumulate X-ray hits with no readout dead time. Additionally, the detector can be operated in list mode by time-stamping every single event with sub-nanosecond resolution. In a first phase of the project, a 4x4 pixel test module is built to validate the conceptual design of the detector. The XNAP project is briefly presented and the performance of the readout ASIC is discussed.

  18. The CMS silicon strip tracker and its electronic readout

    International Nuclear Information System (INIS)

    Friedl, M.

    2001-05-01

    The Large Hadron Collider (LHC) at CERN (Geneva, CH) will be the world's biggest accelerator machine when operation starts in 2006. One of its four detector experiments is the Compact Muon Solenoid (CMS), consisting of a large-scale silicon tracker and electromagnetic and hadron calorimeters, all embedded in a solenoidal magnetic field of 4 T, and a muon system surrounding the magnet coil. The Silicon Strip Tracker has a sensitive area of 206m 2 with 10 million analog channels which are read out at the collider frequency of 40 MHz. The building blocks of the CMS Tracker are the silicon sensors, APV amplifier ASICs, supporting front-end ASICs, analog and digital optical links as well as data processors and control units in the back-end. Radiation tolerance, readout speed and the huge data volume are challenging requirements. The charge collection in silicon detectors was modeled, which is discussed as well as the concepts of readout amplifiers with respect to the LHC requirements, including the deconvolution method of fast pulse shaping, electronic noise constraints and radiation effects. Moreover, extensive measurements on prototype components of the CMS Tracker and different versions of the APV chip in particular were performed. There was a significant contribution to the construction of several detector modules, characterized them in particle beam tests and quantified radiation induced effects on the APV chip and on silicon detectors. In addition, a prototype of the analog optical link and the analog performance of the back-end digitization unit were evaluated. The results are very encouraging, demonstrating the feasibility of the CMS Silicon Strip Tracker system and motivating progress towards the construction phase. (author)

  19. GeoChips for Analysis of Microbial Functional Communities

    Energy Technology Data Exchange (ETDEWEB)

    Van Nostrand, Joy D.; Wu, Liyou; He, Zhili; Zhou, Jizhong

    2008-09-30

    Functional gene arrays (FGA) are microarrays that contain probes for genes encoding proteins or enzymes involved in functions of interest and allow for the study of thousands of genes at one time. The most comprehensive FGA to date is the GeoChip, which contains ~;;24,000 probes for ~;;10,000 genes involved in the geochemical cycling of C, N, P, and S, as well as genes involved in metal resistance and reduction and contaminant degradation. This chapter details the methods necessary for GeoChip analysis. Methods covered include preparation of DNA (whole community genome amplification and labeling), array setup (prehybridization steps), hybridization (sample and hybridization buffers), and post hybridization steps (slide washing and array scanning).

  20. Ultra-thin silicon (UTSi) on insulator CMOS transceiver and time-division multiplexed switch chips for smart pixel integration

    Science.gov (United States)

    Zhang, Liping; Sawchuk, Alexander A.

    2001-12-01

    We describe the design, fabrication and functionality of two different 0.5 micron CMOS optoelectronic integrated circuit (OEIC) chips based on the Peregrine Semiconductor Ultra-Thin Silicon on insulator technology. The Peregrine UTSi silicon- on-sapphire (SOS) technology is a member of the silicon-on- insulator (SOI) family. The low-loss synthetic sapphire substrate is optically transparent and has good thermal conductivity and coefficient of thermal expansion properties, which meet the requirements for flip-chip bonding of VCSELs and other optoelectronic input-output components. One chip contains transceiver and network components, including four channel high-speed CMOS transceiver modules, pseudo-random bit stream (PRBS) generators, a voltage controlled oscillator (VCO) and other test circuits. The transceiver chips can operate in both self-testing mode and networking mode. An on- chip clock and true-single-phase-clock (TSPC) D-flip-flop have been designed to generate a PRBS at over 2.5 Gb/s for the high-speed transceiver arrays to operate in self-testing mode. In the networking mode, an even number of transceiver chips forms a ring network through free-space or fiber ribbon interconnections. The second chip contains four channel optical time-division multiplex (TDM) switches, optical transceiver arrays, an active pixel detector and additional test devices. The eventual applications of these chips will require monolithic OEICs with integrated optical input and output. After fabrication and testing, the CMOS transceiver array dies will be packaged with 850 nm vertical cavity surface emitting lasers (VCSELs), and metal-semiconductor- metal (MSM) or GaAs p-i-n detector die arrays to achieve high- speed optical interconnections. The hybrid technique could be either wire bonding or flip-chip bonding of the CMOS SOS smart-pixel arrays with arrays of VCSELs and photodetectors onto an optoelectronic chip carrier as a multi-chip module (MCM).

  1. Evaluation of local radiation damage in silicon sensor via charge collection mapping with the Timepix read-out chip

    International Nuclear Information System (INIS)

    Platkevic, M; Jakubek, J; Jakubek, M; Pospisil, S; Zemlicka, J; Havranek, V; Semian, V

    2013-01-01

    Studies of radiation hardness of silicon sensors are standardly performed with single-pad detectors evaluating their global electrical properties. In this work we introduce a technique to visualize and determine the spatial distribution of radiation damage across the area of a semiconductor sensor. The sensor properties such as charge collection efficiency and charge diffusion were evaluated locally at many points of the sensor creating 2D maps. For this purpose we used a silicon sensor bump bonded to the pixelated Timepix read-out chip. This device, operated in Time-over-threshold (TOT) mode, allows for the direct energy measurement in each pixel. Selected regions of the sensor were intentionally damaged by defined doses (up to 10 12 particles/cm 2 ) of energetic protons (of 2.5 and 4 MeV). The extent of the damage was measured in terms of the detector response to the same ions. This procedure was performed either on-line during irradiation or off-line after it. The response of the detector to each single particle was analyzed determining the charge collection efficiency and lateral charge diffusion. We evaluated the changes of these parameters as a function of radiation dose. These features are related to the local properties such as the spatial homogeneity of the sensor. The effect of radiation damage was also independently investigated measuring local changes of signal response to γ, and X rays and alpha particles.

  2. Intensity-based readout of resonant-waveguide grating biosensors: Systems and nanostructures

    Science.gov (United States)

    Paulsen, Moritz; Jahns, Sabrina; Gerken, Martina

    2017-09-01

    Resonant waveguide gratings (RWG) - also called photonic crystal slabs (PCS) - have been established as reliable optical transducers for label-free biochemical assays as well as for cell-based assays. Current readout systems are based on mechanical scanning and spectrometric measurements with system sizes suitable for laboratory equipment. Here, we review recent progress in compact intensity-based readout systems for point-of-care (POC) applications. We briefly introduce PCSs as sensitive optical transducers and introduce different approaches for intensity-based readout systems. Photometric measurements have been realized with a simple combination of a light source and a photodetector. Recently a 96-channel, intensity-based readout system for both biochemical interaction analyses as well as cellular assays was presented employing the intensity change of a near cut-off mode. As an alternative for multiparametric detection, a camera system for imaging detection has been implemented. A portable, camera-based system of size 13 cm × 4.9 cm × 3.5 cm with six detection areas on an RWG surface area of 11 mm × 7 mm has been demonstrated for the parallel detection of six protein binding kinetics. The signal-to-noise ratio of this system corresponds to a limit of detection of 168 M (24 ng/ml). To further improve the signal-to-noise ratio advanced nanostructure designs are investigated for RWGs. Here, results on multiperiodic and deterministic aperiodic nanostructures are presented. These advanced nanostructures allow for the design of the number and wavelengths of the RWG resonances. In the context of intensity-based readout systems they are particularly interesting for the realization of multi-LED systems. These recent trends suggest that compact point-of-care systems employing disposable test chips with RWG functional areas may reach market in the near future.

  3. Progress on TSV technology for Medipix3RX chip

    Science.gov (United States)

    Sarajlić, M.; Pennicard, D.; Smoljanin, S.; Fritzsch, T.; Zoschke, K.; Graafsma, H.

    2017-12-01

    The progress of Through Silicon Via (TSV) technology for Medipix3RX chip done at DESY is presented here. The goal of this development is to replace the wire bonds in X-ray detectors with TSVs, in order to reduce the dead area between detectors. We obtained the first working chips assembled together with Si based sensors for X-ray detection. The 3D integration technology, including TSV, Re-distribution layer deposition, bump bonding to the Si sensor and bump bonding to the carrier PCB, was done by Fraunhofer Institute IZM in Berlin. After assembly, the module was successfully tested by recording background radiation and making X-ray images of small objects. The active area of the Medipix3RX chip is 14.1 mm×14.1 mm or 256×256 pixels. During TSV processing, the Medipix3RX chip was thinned from 775 μm original thickness, to 130 μm. The diameter of the vias is 40 μm, and the pitch between the vias is 120 μm. A liner filling approach was used to contact the TSV with the RDL on the backside of the Medipix3RX readout chip.

  4. The SVX3D integrated circuit for dead-timeless silicon strip readout

    Energy Technology Data Exchange (ETDEWEB)

    Garcia-Sciveres, M. E-mail: mgs@lbl.gov; Milgrome, O.; Zimmerman, T.; Volobouev, I.; Ely, R.P.; Connolly, A.; Fish, D.; Affolder, T.; Sill, A

    1999-10-01

    The revision D of the SVX3 readout IC has been fabricated in the Honeywell radiation-hard 0.8 {mu}m bulk CMOS process, for instrumenting 712,704 silicon strips in the upgrade to the Collider Detector at Fermilab. This final revision incorporates new features and changes to the original architecture that were added to meet the goal of dead-timeless operation. This paper describes the features central to dead-timeless operation, and presents test data for un-irradiated and irradiated SVX3D chips. (author)

  5. New approach to the readout system for a very large bismuth germanate calorimeter

    International Nuclear Information System (INIS)

    Sumner, R.

    1982-01-01

    This note presents a possible solution to the problem of data acquisition and control for a very large array of BGO crystals. The array is a total energy calorimeter, which is a part of a detector being designed for LEPC. After a brief description of the environment, we present a working definition of the calorimeter, followed by a statement of the desirable characteristics of the readout system. After a discussion of some alternatives, a complete system is described

  6. A Low-Power Integrated Humidity CMOS Sensor by Printing-on-Chip Technology

    Directory of Open Access Journals (Sweden)

    Chang-Hung Lee

    2014-05-01

    Full Text Available A low-power, wide-dynamic-range integrated humidity sensing chip is implemented using a printable polymer sensing material with an on-chip pulse-width-modulation interface circuit. By using the inkjet printing technique, poly(3,4-ethylene-dioxythiophene/polystyrene sulfonate that has humidity sensing features can be printed onto the top metal layer of a 0.35 μm CMOS IC. The developed printing-on-chip humidity sensor achieves a heterogeneous three dimensional sensor system-on-chip architecture. The humidity sensing of the implemented printing-on-chip sensor system is experimentally tested. The sensor shows a sensitivity of 0.98% to humidity in the atmosphere. The maximum dynamic range of the readout circuit is 9.8 MΩ, which can be further tuned by the frequency of input signal to fit the requirement of the resistance of printed sensor. The power consumption keeps only 154 μW. This printing-on-chip sensor provides a practical solution to fulfill an ultra-small integrated sensor for the applications in miniaturized sensing systems.

  7. A low-power integrated humidity CMOS sensor by printing-on-chip technology.

    Science.gov (United States)

    Lee, Chang-Hung; Chuang, Wen-Yu; Cowan, Melissa A; Wu, Wen-Jung; Lin, Chih-Ting

    2014-05-23

    A low-power, wide-dynamic-range integrated humidity sensing chip is implemented using a printable polymer sensing material with an on-chip pulse-width-modulation interface circuit. By using the inkjet printing technique, poly(3,4-ethylene-dioxythiophene)/polystyrene sulfonate that has humidity sensing features can be printed onto the top metal layer of a 0.35 μm CMOS IC. The developed printing-on-chip humidity sensor achieves a heterogeneous three dimensional sensor system-on-chip architecture. The humidity sensing of the implemented printing-on-chip sensor system is experimentally tested. The sensor shows a sensitivity of 0.98% to humidity in the atmosphere. The maximum dynamic range of the readout circuit is 9.8 MΩ, which can be further tuned by the frequency of input signal to fit the requirement of the resistance of printed sensor. The power consumption keeps only 154 μW. This printing-on-chip sensor provides a practical solution to fulfill an ultra-small integrated sensor for the applications in miniaturized sensing systems.

  8. Graphical user interface for a dual-module EMCCD x-ray detector array

    Science.gov (United States)

    Wang, Weiyuan; Ionita, Ciprian; Kuhls-Gilcrist, Andrew; Huang, Ying; Qu, Bin; Gupta, Sandesh K.; Bednarek, Daniel R.; Rudin, Stephen

    2011-03-01

    A new Graphical User Interface (GUI) was developed using Laboratory Virtual Instrumentation Engineering Workbench (LabVIEW) for a high-resolution, high-sensitivity Solid State X-ray Image Intensifier (SSXII), which is a new x-ray detector for radiographic and fluoroscopic imaging, consisting of an array of Electron-Multiplying CCDs (EMCCDs) each having a variable on-chip electron-multiplication gain of up to 2000x to reduce the effect of readout noise. To enlarge the field-of-view (FOV), each EMCCD sensor is coupled to an x-ray phosphor through a fiberoptic taper. Two EMCCD camera modules are used in our prototype to form a computer-controlled array; however, larger arrays are under development. The new GUI provides patient registration, EMCCD module control, image acquisition, and patient image review. Images from the array are stitched into a 2kx1k pixel image that can be acquired and saved at a rate of 17 Hz (faster with pixel binning). When reviewing the patient's data, the operator can select images from the patient's directory tree listed by the GUI and cycle through the images using a slider bar. Commonly used camera parameters including exposure time, trigger mode, and individual EMCCD gain can be easily adjusted using the GUI. The GUI is designed to accommodate expansion of the EMCCD array to even larger FOVs with more modules. The high-resolution, high-sensitivity EMCCD modular-array SSXII imager with the new user-friendly GUI should enable angiographers and interventionalists to visualize smaller vessels and endovascular devices, helping them to make more accurate diagnoses and to perform more precise image-guided interventions.

  9. Graphical User Interface for a Dual-Module EMCCD X-ray Detector Array.

    Science.gov (United States)

    Wang, Weiyuan; Ionita, Ciprian; Kuhls-Gilcrist, Andrew; Huang, Ying; Qu, Bin; Gupta, Sandesh K; Bednarek, Daniel R; Rudin, Stephen

    2011-03-16

    A new Graphical User Interface (GUI) was developed using Laboratory Virtual Instrumentation Engineering Workbench (LabVIEW) for a high-resolution, high-sensitivity Solid State X-ray Image Intensifier (SSXII), which is a new x-ray detector for radiographic and fluoroscopic imaging, consisting of an array of Electron-Multiplying CCDs (EMCCDs) each having a variable on-chip electron-multiplication gain of up to 2000× to reduce the effect of readout noise. To enlarge the field-of-view (FOV), each EMCCD sensor is coupled to an x-ray phosphor through a fiberoptic taper. Two EMCCD camera modules are used in our prototype to form a computer-controlled array; however, larger arrays are under development. The new GUI provides patient registration, EMCCD module control, image acquisition, and patient image review. Images from the array are stitched into a 2k×1k pixel image that can be acquired and saved at a rate of 17 Hz (faster with pixel binning). When reviewing the patient's data, the operator can select images from the patient's directory tree listed by the GUI and cycle through the images using a slider bar. Commonly used camera parameters including exposure time, trigger mode, and individual EMCCD gain can be easily adjusted using the GUI. The GUI is designed to accommodate expansion of the EMCCD array to even larger FOVs with more modules. The high-resolution, high-sensitivity EMCCD modular-array SSXII imager with the new user-friendly GUI should enable angiographers and interventionalists to visualize smaller vessels and endovascular devices, helping them to make more accurate diagnoses and to perform more precise image-guided interventions.

  10. NIKEL-AMC: readout electronics for the NIKA2 experiment

    International Nuclear Information System (INIS)

    Bourrion, O.; Bouly, J.L.; Bouvier, J.; Bosson, G.; Catalano, A.; Li, C.; Macías-Pérez, J.F.; Tourres, D.; Ponchant, N.; Vescovi, C.; Benoit, A.; Calvo, M.; Goupy, J.; Monfardini, A.

    2016-01-01

    The New Iram Kid Arrays-2 (NIKA2) instrument has recently been installed at the IRAM 30 m telescope. NIKA2 is a state-of-art instrument dedicated to mm-wave astronomy using microwave kinetic inductance detectors (KID) as sensors. The three arrays installed in the camera, two at 1.25 mm and one at 2.05 mm, feature a total of 3300 KIDs. To instrument these large array of detectors, a specifically designed electronics, composed of 20 readout boards and hosted in three microTCA crates, has been developed. The implemented solution and the achieved performances are presented in this paper. We find that multiplexing factors of up to 400 detectors per board can be achieved with homogeneous performance across boards in real observing conditions, and a factor of more than 3 decrease in volume with respect to previous generations.

  11. Prototype detection unit for the CHIPS experiment

    Science.gov (United States)

    Pfützner, Maciej M.

    2017-09-01

    CHIPS (CHerenkov detectors In mine PitS) is an R&D project aiming to develop novel cost-effective neutrino detectors, focused on measuring the CP-violating neutrino mixing phase (δ CP). A single detector module, containing an enclosed volume of purified water, would be submerged in an existing lake, located in a neutrino beam. A staged approach is proposed with first detectors deployed in a flooded mine pit in Northern Minnesota, 7 mrad off-axis from the existing NuMI beam. A small proof-of-principle model (CHIPS-M) has already been tested and the first stage of a fully functional 10 kt module (CHIPS-10) is planned for 2018. One of the instruments submerged on board of CHIPS-M in autumn 2015 was a prototype detection unit, constructed at Nikhef. The unit contains hardware borrowed from the KM3NeT experiment, including 16 3 inch photomultiplier tubes and readout electronics. In addition to testing the mechanical design and data acquisition, the detector was used to record a large sample of cosmic ray muon events. The collected data is valuable for characterising the cosmic muon background and validating a Monte Carlo simulation used to optimise future designs. This paper introduces the CHIPS project, describes the design of the prototype unit, and presents the results of a preliminary data analysis.

  12. Transmission-Line Readout with Good Time and Space Resolutions for Planacon MCP-PMTs

    CERN Document Server

    Tang, F; Byrum, K; Drake, G; Ertley, C; Frisch, H; Genat, J-F; May, E

    2008-01-01

    With commercially-available multi-anode microchannel plate photomultiplier tubes (MCP-PMT) and electronics, resolutions significantly better than 10 psec have been achieved in small systems with a few readout channels[1,2]. For large-scale time-of-flight systems used in particle physics, which may cover tens of square meters, a solution must be found with a manageable number of electronics channels and low total power consumption on the readout electronics without degrading the system timing resolution. We present here the design of a transmission-line readout for a Photonis Planacon MCP-PMT that has these characteristics. The tube, which is 5 cm square, is characterized by signal pulse rise times in the order of 200 psec and transit time spreads (TTS) in the order of 25 psec[1, 2]. The model 85011-011 MCP has 1024 anode pads laid out in an array of 32 by 32 on the back of the tube. The proposed readout is implemented on a Rogers 4350B printed circuit board with 32 parallel 50-ohm transmission lines on 1.6 mm...

  13. Development of readout system for FE-I4 pixel module using SiTCP

    Energy Technology Data Exchange (ETDEWEB)

    Teoh, J.J., E-mail: jjteoh@champ.hep.sci.osaka-u.ac.jp [Graduate School of Science, Osaka University, 1-1 Machikaneyama, Toyonaka, Osaka, 560-0043 (Japan); Hanagaki, K. [Graduate School of Science, Osaka University, 1-1 Machikaneyama, Toyonaka, Osaka, 560-0043 (Japan); Ikegami, Y.; Takubo, Y.; Terada, S.; Unno, Y. [Institute for Particle and Nuclear Studies, High Energy Accelerator Research Organization (KEK), 1-1 Oho, Tsukuba City, Ibaraki-ken 305-0801 (Japan)

    2013-12-11

    The ATLAS pixel detector will be replaced in the future High Luminosity-Large Hadron Collider (HL-LHC) upgrade to preserve or improve the detector performance at high luminosity environment. To meet the tight requirements of the upgrade, a new pixel Front-End (FE) Integrated Circuit (IC) called FE-I4 has been developed. We have then devised a readout system for the new FE IC. Our system incorporates Silicon Transmission Control Protocol (SiTCP) technology (Uchida, 2008 [1]) which utilizes the standard TCP/IP and UDP communication protocols. This technology allows direct data access and transfer between a readout hardware chain and PC via a high speed Ethernet. In addition, the communication protocols are small enough to be implemented in a single Field-Programable Gate Array (FPGA). Relying on this technology, we have been able to construct a very compact, versatile and fast readout system. We have developed a firmware and software together with the readout hardware chain. We also have established basic functionalities for reading out FE-I4.

  14. Development of a cylindrical tracking detector with multichannel scintillation fibers and pixelated photon detector readout

    Energy Technology Data Exchange (ETDEWEB)

    Akazawa, Y.; Miwa, K.; Honda, R.; Shiozaki, T.; Chiga, N.

    2015-07-01

    We are developing a cylindrical tracking detector for a Σp scattering experiment in J-PARC with scintillation fibers and the Pixelated Photon Detector (PPD) readout, which is called as cylindrical fiber tracker (CFT), in order to reconstruct trajectories of charged particles emitted inside CFT. CFT works not only as a tracking detector but also a particle identification detector from energy deposits. A prototype CFT consisting of two straight layers and one spiral layer was constructed. About 1100 scintillation fibers with a diameter of 0.75 mm (Kuraray SCSF-78 M) were used. Each fiber signal was read by Multi-Pixel Photon Counter (MPPC, HPK S10362-11-050P, 1×1 mm{sup 2}, 400 pixels) fiber by fiber. MPPCs were handled with Extended Analogue Silicon Photomultipliers Integrated ReadOut Chip (EASIROC) boards, which were developed for the readout of a large number of MPPCs. The energy resolution of one layer was 28% for a 70 MeV proton where the energy deposit in fibers was 0.7 MeV.

  15. CBC3: a CMS microstrip readout ASIC with logic for track-trigger modules at HL-LHC

    CERN Document Server

    Prydderch, Mark Lyndon; Bell, Stephen Jean-marc; Key-Charriere, M; Jones, Lawrence; Auzinger, Georg; Borg, Johan; Hall, Geoffrey; Pesaresi, Mark Franco; Raymond, David Mark; Uchida, Kirika; Goldstein, Joel; Seif El Nasr, Sarah

    2018-01-01

    The CBC3 is the latest version of the CMS Binary Chip ASIC for readout of the outer radial region of the upgraded CMS Tracker at HL-LHC. This 254-channel, 130nm CMOS ASIC is designed to be bump-bonded to a substrate to which sensors will be wire-bonded. It will instrument double-layer 2S-modules, consisting of two overlaid silicon microstrip sensors with aligned microstrips. On-chip logic identifies first level trigger primitives from high transverse-momentum tracks by selecting correlated hits in the two sensors. Delivered in late 2016, the CBC3 has been under test for several months, including X-ray irradiations and SEU testing. Results and performance are reported.

  16. PADI ASIC for straw tube read-out

    Energy Technology Data Exchange (ETDEWEB)

    Pietraszko, Jerzy; Traeger, Michael; Fruehauf, Jochen; Schmidt, Christian [GSI, Darmstadt (Germany); Ciobanu, Mircea [ISS, Bucharest (Romania); Collaboration: CBM-Collaboration

    2016-07-01

    A prototype of the CBM MUCH straw tube detector consisting of six individual straws of 6mm inner diameter and 220 mm length filled with Ar/CO{sub 2} gas mixture has been tested at the COSY accelerator in Juelich. The straw tubes were connected to the FEET-PADI6-HDa PCB equipped with PADI-6 fast amplifier/discriminator ASIC. As a reference counter in this measurement the scCVD diamond detector has been used delivering excellent timing, time resolution below 100 ps (sigma), and very precise position information, below 50 μm. The demonstrated position resolution of about 160 μm of the straw tube read out with PADI-6 ASIC confirms the capability of the PADI chip and puts this development as a very attractive readout option for straw tubes and wire chambers.

  17. Measurement of extremely low level dose with LiF(Mg,Cu,P) TL chips

    International Nuclear Information System (INIS)

    Zha Ziying; Wang Shoushan; Wu Fang; Chen Guolong; Li Yuanfang; Zhu Jianhuan

    1986-01-01

    This paper presents some of the dosimetric characteristics of newly developed LiF(Mg,Cu,P) TL chips with high signal-to-noise ratio for measurement at the 10 -7 to 10 -4 Gy dose level. Measuring techniques and optimum procedures for annealing and readout are also presented. (author)

  18. A pixel read-out architecture implementing a two-stage token ring, zero suppression and compression

    International Nuclear Information System (INIS)

    Heuvelmans, S; Boerrigter, M

    2011-01-01

    Increasing luminosity in high energy physics experiments leads to new challenges in the design of data acquisition systems for pixel detectors. With the upgrade of the LHCb experiment, the data processing will be changed; hit data from every collision will be transported off the pixel chip, without any trigger selection. A read-out architecture is proposed which is able to obtain low hit data loss on limited silicon area by using the logic beneath the pixels as a data buffer. Zero suppression and redundancy reduction ensure that the data rate off chip is minimized. A C++ model has been created for simulation of functionality and data loss, and for system development. A VHDL implementation has been derived from this model.

  19. A pixel read-out architecture implementing a two-stage token ring, zero suppression and compression

    Energy Technology Data Exchange (ETDEWEB)

    Heuvelmans, S; Boerrigter, M, E-mail: sander.heuvelmans@bruco.nl [Bruco integrated circuits BV, Oostermaat 2, 7623 CS (Netherlands)

    2011-01-15

    Increasing luminosity in high energy physics experiments leads to new challenges in the design of data acquisition systems for pixel detectors. With the upgrade of the LHCb experiment, the data processing will be changed; hit data from every collision will be transported off the pixel chip, without any trigger selection. A read-out architecture is proposed which is able to obtain low hit data loss on limited silicon area by using the logic beneath the pixels as a data buffer. Zero suppression and redundancy reduction ensure that the data rate off chip is minimized. A C++ model has been created for simulation of functionality and data loss, and for system development. A VHDL implementation has been derived from this model.

  20. The 160 TES bolometer read-out using FDM for SAFARI

    Science.gov (United States)

    Hijmering, R. A.; den Hartog, R. H.; van der Linden, A. J.; Ridder, M.; Bruijn, M. P.; van der Kuur, J.; van Leeuwen, B. J.; van Winden, P.; Jackson, B.

    2014-07-01

    For the read out of the Transition Edge Sensors (TES) bolometer arrays of the SAFARI instrument on the Japanese background-limited far-IR SPICA mission SRON is developing a Frequency Domain Multiplexing (FDM) read-out system. The next step after the successful demonstration of the read out of 38 TES bolometers using FDM was to demonstrate the FDM readout of the required 160 TES bolometers. Of the 160 LC filter and TES bolometer chains 151 have been connected and after cooldown 148 of the resonances could be identified. Although initial operation and locking of the pixels went smoothly the experiment revealed several complications. In this paper we describe the 160 pixel FDM set-up, show the results and discuss the issues faced during operation of the 160 pixel FDM experiment.

  1. On-Chip Microwave Quantum Hall Circulator

    Directory of Open Access Journals (Sweden)

    A. C. Mahoney

    2017-01-01

    Full Text Available Circulators are nonreciprocal circuit elements that are integral to technologies including radar systems, microwave communication transceivers, and the readout of quantum information devices. Their nonreciprocity arises from the interference of microwaves over the centimeter scale of the signal wavelength, in the presence of bulky magnetic media that breaks time-reversal symmetry. Here, we realize a completely passive on-chip microwave circulator with size 1/1000th the wavelength by exploiting the chiral, “slow-light” response of a two-dimensional electron gas in the quantum Hall regime. For an integrated GaAs device with 330  μm diameter and about 1-GHz center frequency, a nonreciprocity of 25 dB is observed over a 50-MHz bandwidth. Furthermore, the nonreciprocity can be dynamically tuned by varying the voltage at the port, an aspect that may enable reconfigurable passive routing of microwave signals on chip.

  2. Effects of reflector and crystal surface on the performance of a depth-encoding PET detector with dual-ended readout

    International Nuclear Information System (INIS)

    Ren, Silin; Yang, Yongfeng; Cherry, Simon R.

    2014-01-01

    Purpose: Depth encoding detectors are required to improve the spatial resolution and spatial resolution uniformity of small animal positron emission tomography (PET) scanners, as well as dedicated breast and brain scanners. Depth of interaction (DOI) can be measured by using dual-ended readout of lutetium oxyorthosilicate (LSO) scintillator arrays with position-sensitive avalanche photodiodes. Inter-crystal reflectors and crystal surface treatments play important roles in determining the performance of dual-ended detectors. In this paper, the authors evaluated five LSO arrays made with three different intercrystal reflectors and with either polished or unpolished crystal surfaces. Methods: The crystal size in all arrays was 1.5 mm, which is typical of the detector size used in small animal and dedicated breast scanners. The LSO arrays were measured with dual-ended readout and were compared in terms of flood histogram, energy resolution, and DOI resolution performance. Results: The four arrays using enhanced specular reflector (ESR) and Toray reflector provided similar quality flood histograms and the array using Crystal Wrap reflector gave the worst flood histogram. The two arrays using ESR reflector provided the best energy resolution and the array using Crystal Wrap reflector yielded the worst energy resolution. All arrays except the polished ESR array provided good DOI resolution ranging from 1.9 mm to 2.9 mm. DOI resolution improved as the gradient in light collection efficiency with depth (GLCED) increased. The geometric mean energies were also calculated for these dual-ended readout detectors as an alternative to the conventional summed total energy. It was shown that the geometric mean energy is advantageous in that it provides more uniform photopeak amplitude at different depths for arrays with high GLCED, and is beneficial in event selection by allowing a fixed energy window independent of depth. A new method of DOI calculation that improved the linearity

  3. Monitoring the CMS strip tracker readout system

    International Nuclear Information System (INIS)

    Mersi, S; Bainbridge, R; Cripps, N; Fulcher, J; Wingham, M; Baulieu, G; Bel, S; Delaere, C; Drouhin, F; Mirabito, L; Cole, J; Giassi, A; Gross, L; Hahn, K; Nikolic, M; Tkaczyk, S

    2008-01-01

    The CMS Silicon Strip Tracker at the LHC comprises a sensitive area of approximately 200 m 2 and 10 million readout channels. Its data acquisition system is based around a custom analogue front-end chip. Both the control and the readout of the front-end electronics are performed by off-detector VME boards in the counting room, which digitise the raw event data and perform zero-suppression and formatting. The data acquisition system uses the CMS online software framework to configure, control and monitor the hardware components and steer the data acquisition. The first data analysis is performed online within the official CMS reconstruction framework, which provides many services, such as distributed analysis, access to geometry and conditions data, and a Data Quality Monitoring tool based on the online physics reconstruction. The data acquisition monitoring of the Strip Tracker uses both the data acquisition and the reconstruction software frameworks in order to provide real-time feedback to shifters on the operational state of the detector, archiving for later analysis and possibly trigger automatic recovery actions in case of errors. Here we review the proposed architecture of the monitoring system and we describe its software components, which are already in place, the various monitoring streams available, and our experiences of operating and monitoring a large-scale system

  4. Double-sided coaxial circuit QED with out-of-plane wiring

    Science.gov (United States)

    Rahamim, J.; Behrle, T.; Peterer, M. J.; Patterson, A.; Spring, P. A.; Tsunoda, T.; Manenti, R.; Tancredi, G.; Leek, P. J.

    2017-05-01

    Superconducting circuits are well established as a strong candidate platform for the development of quantum computing. In order to advance to a practically useful level, architectures are needed which combine arrays of many qubits with selective qubit control and readout, without compromising on coherence. Here, we present a coaxial circuit quantum electrodynamics architecture in which qubit and resonator are fabricated on opposing sides of a single chip, and control and readout wiring are provided by coaxial wiring running perpendicular to the chip plane. We present characterization measurements of a fabricated device in good agreement with simulated parameters and demonstrating energy relaxation and dephasing times of T1 = 4.1 μs and T2 = 5.7 μs, respectively. The architecture allows for scaling to large arrays of selectively controlled and measured qubits with the advantage of all wiring being out of the plane.

  5. CCD and IR array controllers

    Science.gov (United States)

    Leach, Robert W.; Low, Frank J.

    2000-08-01

    A family of controllers has bene developed that is powerful and flexible enough to operate a wide range of CCD and IR focal plane arrays in a variety of ground-based applications. These include fast readout of small CCD and IR arrays for adaptive optics applications, slow readout of large CCD and IR mosaics, and single CCD and IR array operation at low background/low noise regimes as well as high background/high speed regimes. The CCD and IR controllers have a common digital core based on user- programmable digital signal processors that are used to generate the array clocking and signal processing signals customized for each application. A fiber optic link passes image data and commands to VME or PCI interface boards resident in a host computer to the controller. CCD signal processing is done with a dual slope integrator operating at speeds of up to one Megapixel per second per channel. Signal processing of IR arrays is done either with a dual channel video processor or a four channel video processor that has built-in image memory and a coadder to 32-bit precision for operating high background arrays. Recent developments underway include the implementation of a fast fiber optic data link operating at a speed of 12.5 Megapixels per second for fast image transfer from the controller to the host computer, and supporting image acquisition software and device drivers for the PCI interface board for the Sun Solaris, Linux and Windows 2000 operating systems.

  6. High-Tc dc-SQUID gradiometers in flip-chip configuration

    International Nuclear Information System (INIS)

    Peiselt, K; Schmidl, F; Linzen, S; Anton, A S; Huebner, U; Seidel, P

    2003-01-01

    We describe a new design of a gradiometric flip-chip antenna, which is inductively coupled to a dc-SQUID gradiometer. Both components are patterned out of thin films of the high-T c superconductor YBa 2 Cu 3 O 7-x (YBCO). For the flip-chip antenna, a 40 mm x 10 mm SrTiO 3 single crystalline substrate is used, while the gradiometer sensors are prepared on 10 mm x 10 mm SrTiO 3 bicrystal substrates. Special attention is paid to the inductive coupling between the flip-chip antenna and the read-out gradiometer antenna. We investigate different designs of coupling loops in order to optimize the coupling inductance between both components of the sensor. With optimized coupling the sensor achieves a field-gradient resolution of 12 fT cm -1 Hz -1/2 in the white noise region and of 310 fT cm -1 Hz -1/2 at 1 Hz in the unshielded laboratory environment

  7. High-Tc dc-SQUID gradiometers in flip-chip configuration

    Science.gov (United States)

    Peiselt, K.; Schmidl, F.; Linzen, S.; Anton, A. S.; Hübner, U.; Seidel, P.

    2003-12-01

    We describe a new design of a gradiometric flip-chip antenna, which is inductively coupled to a dc-SQUID gradiometer. Both components are patterned out of thin films of the high-Tc superconductor YBa2Cu3O7-x (YBCO). For the flip-chip antenna, a 40 mm × 10 mm SrTiO3 single crystalline substrate is used, while the gradiometer sensors are prepared on 10 mm × 10 mm SrTiO3 bicrystal substrates. Special attention is paid to the inductive coupling between the flip-chip antenna and the read-out gradiometer antenna. We investigate different designs of coupling loops in order to optimize the coupling inductance between both components of the sensor. With optimized coupling the sensor achieves a field-gradient resolution of 12 fT cm-1 Hz-1/2 in the white noise region and of 310 fT cm-1 Hz-1/2 at 1 Hz in the unshielded laboratory environment.

  8. Optimal use of tandem biotin and V5 tags in ChIP assays

    NARCIS (Netherlands)

    K.E. Kolodziej (Katarzyna); F. Pourfarzad, F. (Farzin); E. de Boer (Ernie); S. Krpic (Sanja); F.G. Grosveld (Frank); J. Strouboulis (John)

    2009-01-01

    textabstractBackground: Chromatin immunoprecipitation (ChIP) assays coupled to genome arrays (Chip-on-chip) or massive parallel sequencing (ChIP-seq) lead to the genome wide identification of binding sites of chromatin associated proteins. However, the highly variable quality of antibodies and the

  9. Studies for an upgrade of ALICE Inner Tracking System: Pixel chip characterization

    Directory of Open Access Journals (Sweden)

    Park Jonghan

    2017-01-01

    Full Text Available Inner Tracking System (ITS of ALICE is used for vertex determination and tracking. Future heavy-ion program at the LHC aims to run with high luminosity. To address this challenge, upgrade program of ITS is underway, which aims at better position resolution (factor of 3, high detection efficiency (>99%, high-rate readout capabilities (100 kHz for Pb-Pb and moderate radiation hardness (> 700 krad. The new ITS will be composed with 7 layers of silicon pixel chip based on Monolithic Active Pixel Sensor (MAPS technology. The characterization test of various version of prototype chips at different phases of development has been performed. This contribution will provide the main characterization results obtained from the measurements performed at laboratories and using test beam for finalizing the pixel chip specification.

  10. Studies and development of a readout ASIC for pixelated CdTe detectors for space applications

    International Nuclear Information System (INIS)

    Michalowska, A.

    2013-01-01

    designed two ASICs. The first one, Caterpylar, is a test-chip, which enables the characterization of differently dimensioned CSA circuits to choose the most suitable one for the final application. It is optimized for readout of the target CdTe detector with 300 μm pixel pitch and the corresponding input parameters. With this circuit I have also analyzed possible filtering methods, in particular the semi-Gaussian shaping and the Multi-Correlated Double Sampling (MCDS). Their comparison is preceded by the theoretical analysis of these shapers. The second ASIC D 2 R 1 is a complete readout circuit, containing 256 channels to readout CdTe detector with the same number of pixels, arranged in 16 *16 array. Each channel fits into a layout area of 300 μm - 300 μm. It is based on the MCDS processing with self-triggering capabilities. The mean electronic noise measured over all channels is 29 electrons rms when characterized without the detector. The corresponding power consumption is 315 μW/channel. With these results the future measurements with the detector give prospects for reaching an FWHM spectral resolution in the order of 600 eV at 60 keV. (author) [fr

  11. Research of Dielectric Breakdown Micro fluidic Sampling Chip

    International Nuclear Information System (INIS)

    Jiang, F.; Lei, Y.; Yu, J.

    2013-01-01

    Micro fluidic chip is mainly driven electrically by external electrode and array electrode, but there are certain disadvantages in both of ways, which affect the promotion and application of micro fluidic technology. This paper discusses a scheme that uses the conductive solution in a microchannel made by PDMS, replacing electrodes and the way of dielectric breakdown to achieve microfluidic chip driver. It could reduce the driving voltage and simplify the chip production process. To prove the feasibility of this method, we produced a micro fluidic chip used in PDMS material with the lithography technology and experimented it. The results showed that using the dielectric breakdown to achieve microfluidic chip driver is feasible, and it has certain application prospect.

  12. Test of a PCIe based readout option for PANDA

    Energy Technology Data Exchange (ETDEWEB)

    Reiter, Simon; Lange, Soeren; Kuehn, Wolfgang [Justus-Liebig-Universitaet Giessen (Germany); Engel, Heiko [Goethe-Universitaet Frankfurt (Germany); Collaboration: PANDA-Collaboration

    2016-07-01

    The future PANDA detector will achieve an event rate at about 20 MHz resulting in a high data load of up to 200 GB/s. The data acquisition system will be based on a triggerless readout concept, leading to the requirement of large data bandwidths. The data reduction will be guaranteed on the first level by an array of FPGAs running a full on-line reconstruction followed by the second level of a CPU/GPU cluster to achieve a reduction factor more than 1000. The C-RORC (Common Readout Receiver Card), originally developed for ALICE, provides on the one hand 12 optical links with 6.25 Gbps each, and on the other hand a PCIe interface with up to 40 Gbps. The receiver card has been installed and tested, and the firmware has been adjusted for the Panda data format. Test results are presented.

  13. A frequency and sensitivity tunable microresonator array for high-speed quantum processor readout

    Energy Technology Data Exchange (ETDEWEB)

    Whittaker, J. D., E-mail: jwhittaker@dwavesys.com; Swenson, L. J.; Volkmann, M. H.; Spear, P.; Altomare, F.; Berkley, A. J.; Bunyk, P.; Harris, R.; Hilton, J. P.; Hoskinson, E.; Johnson, M. W.; Ladizinsky, E.; Lanting, T.; Oh, T.; Perminov, I.; Tolkacheva, E.; Yao, J. [D-Wave Systems, Inc., Burnaby, British Columbia V5G 4M9 (Canada); Bumble, B.; Day, P. K.; Eom, B. H. [Jet Propulsion Laboratory, California Institute of Technology, Pasadena, California 91109 (United States); and others

    2016-01-07

    Superconducting microresonators have been successfully utilized as detection elements for a wide variety of applications. With multiplexing factors exceeding 1000 detectors per transmission line, they are the most scalable low-temperature detector technology demonstrated to date. For high-throughput applications, fewer detectors can be coupled to a single wire but utilize a larger per-detector bandwidth. For all existing designs, fluctuations in fabrication tolerances result in a non-uniform shift in resonance frequency and sensitivity, which ultimately limits the efficiency of bandwidth utilization. Here, we present the design, implementation, and initial characterization of a superconducting microresonator readout integrating two tunable inductances per detector. We demonstrate that these tuning elements provide independent control of both the detector frequency and sensitivity, allowing us to maximize the transmission line bandwidth utilization. Finally, we discuss the integration of these detectors in a multilayer fabrication stack for high-speed readout of the D-Wave quantum processor, highlighting the use of control and routing circuitry composed of single-flux-quantum loops to minimize the number of control wires at the lowest temperature stage.

  14. Neuron array with plastic synapses and programmable dendrites.

    Science.gov (United States)

    Ramakrishnan, Shubha; Wunderlich, Richard; Hasler, Jennifer; George, Suma

    2013-10-01

    We describe a novel neuromorphic chip architecture that models neurons for efficient computation. Traditional architectures of neuron array chips consist of large scale systems that are interfaced with AER for implementing intra- or inter-chip connectivity. We present a chip that uses AER for inter-chip communication but uses fast, reconfigurable FPGA-style routing with local memory for intra-chip connectivity. We model neurons with biologically realistic channel models, synapses and dendrites. This chip is suitable for small-scale network simulations and can also be used for sequence detection, utilizing directional selectivity properties of dendrites, ultimately for use in word recognition.

  15. ASIC Development for Three-Dimensional Silicon Imaging Array for Cold Neutrons

    International Nuclear Information System (INIS)

    Britton, C.L.; Jagadish, U.; Bryan, W.L.

    2004-01-01

    An Integrated Circuit (IC) readout chip with four channels arranged so as to receive input charge from the corners of the chip was designed for use with 5- to 7-mm pixel detectors. This Application Specific IC (ASIC) can be used for cold neutron imaging, for study of structural order in materials using cold neutron scattering or for particle physics experiments. The ASIC is fabricated in a 0.5-(micro)m n-well AMI process. The design of the ASIC and the test measurements made is reported. Noise measurements are also reported

  16. Temporal Noise Analysis of Charge-Domain Sampling Readout Circuits for CMOS Image Sensors

    Directory of Open Access Journals (Sweden)

    Xiaoliang Ge

    2018-02-01

    Full Text Available This paper presents a temporal noise analysis of charge-domain sampling readout circuits for Complementary Metal-Oxide Semiconductor (CMOS image sensors. In order to address the trade-off between the low input-referred noise and high dynamic range, a Gm-cell-based pixel together with a charge-domain correlated-double sampling (CDS technique has been proposed to provide a way to efficiently embed a tunable conversion gain along the read-out path. Such readout topology, however, operates in a non-stationery large-signal behavior, and the statistical properties of its temporal noise are a function of time. Conventional noise analysis methods for CMOS image sensors are based on steady-state signal models, and therefore cannot be readily applied for Gm-cell-based pixels. In this paper, we develop analysis models for both thermal noise and flicker noise in Gm-cell-based pixels by employing the time-domain linear analysis approach and the non-stationary noise analysis theory, which help to quantitatively evaluate the temporal noise characteristic of Gm-cell-based pixels. Both models were numerically computed in MATLAB using design parameters of a prototype chip, and compared with both simulation and experimental results. The good agreement between the theoretical and measurement results verifies the effectiveness of the proposed noise analysis models.

  17. Towards UV imaging sensors based on single-crystal diamond chips for spectroscopic applications

    Energy Technology Data Exchange (ETDEWEB)

    De Sio, A. [Department of Astronomy and Space Science, University of Firenze, Largo E. Fermi 2, 50125 Florence (Italy)], E-mail: desio@arcetri.astro.it; Bocci, A. [Department of Astronomy and Space Science, University of Firenze, Largo E. Fermi 2, 50125 Florence (Italy); Bruno, P.; Di Benedetto, R.; Greco, V.; Gullotta, G. [INAF-Astrophysical Observatory of Catania (Italy); Marinelli, M. [INFN-Department of Mechanical Engineering, University of Roma ' Tor Vergata' (Italy); Pace, E. [Department of Astronomy and Space Science, University of Firenze, Largo E. Fermi 2, 50125 Florence (Italy); Rubulotta, D.; Scuderi, S. [INAF-Astrophysical Observatory of Catania (Italy); Verona-Rinati, G. [INFN-Department of Mechanical Engineering, University of Roma ' Tor Vergata' (Italy)

    2007-12-11

    The recent improvements achieved in the Homoepitaxial Chemical Vapour Deposition technique have led to the production of high-quality detector-grade single-crystal diamonds. Diamond-based detectors have shown excellent performances in UV and X-ray detection, paving the way for applications of diamond technology to the fields of space astronomy and high-energy photon detection in harsh environments or against strong visible light emission. These applications are possible due to diamond's unique properties such as its chemical inertness and visible blindness, respectively. Actually, the development of linear array detectors represents the main issue for a full exploitation of diamond detectors. Linear arrays are a first step to study bi-dimensional sensors. Such devices allow one to face the problems related to pixel miniaturisation and of signal read-out from many channels. Immediate applications would be in spectroscopy, where such arrays are preferred. This paper reports on the development of imaging detectors made by our groups, starting from the material growth and characterisation, through the design, fabrication and packaging of 2xn pixel arrays, to their electro-optical characterisation in terms of UV sensitivity, uniformity of the response and to the development of an electronic circuit suitable to read-out very low photocurrent signals. The detector and its electronic read-out were then tested using a 2x5 pixel array based on a single-crystal diamond. The results will be discussed in the framework of the development of an imager device for X-UV astronomy applications in space missions.

  18. The PASTA chip - A free-running readout ASIC for silicon strip sensors in PANDA

    Energy Technology Data Exchange (ETDEWEB)

    Goerres, Andre; Stockmanns, Tobias; Ritman, James [Institut fuer Kernphysik, Forschungszentrum Juelich, Juelich (Germany); Rivetti, Angelo [INFN Sezione di Torino, Torino (Italy); Collaboration: PANDA-Collaboration

    2014-07-01

    The PANDA experiment is a multi purpose detector, investigating hadron physics in the charm quark mass regime. It is one of the main experiments at the future FAIR accelerator facility, using pp annihilations from a 1.5-15 GeV/c anti-proton beam. Because of the broad physics spectrum and the similarity of event and background signals, PANDA does not rely on a hardware-level trigger decision. The innermost of PANDA's sub-systems is the Micro Vertex Detector (MVD), consisting of silicon pixel and strip sensors. The latter will be read out by a specialized, free-running readout front-end called PANDA Strip ASIC (PASTA). It has to face a high event rate of up to 40 kHz/ch in an radiation-intense environment. To fulfill the MVD's requirements, it has to give accurate timing information to incoming events (<10 ns) and determine the collected charge with an 8-bit precision. The design has to meet cooling and placing restrictions, leading to a very low power consumption (<4 mW/ch) and limited dimensions. Therefore, a simple, time-based readout approach is chosen. In this talk, the conceptual design of the front-end is presented.

  19. 32 x 16 CMOS smart pixel array for optical interconnects

    Science.gov (United States)

    Kim, Jongwoo; Guilfoyle, Peter S.; Stone, Richard V.; Hessenbruch, John M.; Choquette, Kent D.; Kiamilev, Fouad E.

    2000-05-01

    Free space optical interconnects can increase throughput capacities and eliminate much of the energy consumption required for `all electronic' systems. High speed optical interconnects can be achieved by integrating optoelectronic devices with conventional electronics. Smart pixel arrays have been developed which use optical interconnects. An individual smart pixel cell is composed of a vertical cavity surface emitting laser (VCSEL), a photodetector, an optical receiver, a laser driver, and digital logic circuitry. Oxide-confined VCSELs are being developed to operate at 850 nm with a threshold current of approximately 1 mA. Multiple quantum well photodetectors are being fabricated from AlGaAs for use with the 850 nm VCSELs. The VCSELs and photodetectors are being integrated with complementary metal oxide semiconductor (CMOS) circuitry using flip-chip bonding. CMOS circuitry is being integrated with a 32 X 16 smart pixel array. The 512 smart pixels are serially linked. Thus, an entire data stream may be clocked through the chip and output electrically by the last pixel. Electrical testing is being performed on the CMOS smart pixel array. Using an on-chip pseudo random number generator, a digital data sequence was cycled through the chip verifying operation of the digital circuitry. Although, the prototype chip was fabricated in 1.2 micrometers technology, simulations have demonstrated that the array can operate at 1 Gb/s per pixel using 0.5 micrometers technology.

  20. High Voltage Dielectrophoretic and Magnetophoretic Hybrid Integrated Circuit / Microfluidic Chip

    Science.gov (United States)

    Issadore, David; Franke, Thomas; Brown, Keith A.; Hunt, Thomas P.; Westervelt, Robert M.

    2010-01-01

    A hybrid integrated circuit (IC) / microfluidic chip is presented that independently and simultaneously traps and moves microscopic objects suspended in fluid using both electric and magnetic fields. This hybrid chip controls the location of dielectric objects, such as living cells and drops of fluid, on a 60 × 61 array of pixels that are 30 × 38 μm2 in size, each of which can be individually addressed with a 50 V peak-to-peak, DC to 10 MHz radio frequency voltage. These high voltage pixels produce electric fields above the chip’s surface with a magnitude , resulting in strong dielectrophoresis (DEP) forces . Underneath the array of DEP pixels there is a magnetic matrix that consists of two perpendicular sets of 60 metal wires running across the chip. Each wire can be sourced with 120 mA to trap and move magnetically susceptible objects using magnetophoresis (MP). The DEP pixel array and magnetic matrix can be used simultaneously to apply forces to microscopic objects, such as living cells or lipid vesicles, that are tagged with magnetic nanoparticles. The capabilities of the hybrid IC / microfluidic chip demonstrated in this paper provide important building blocks for a platform for biological and chemical applications. PMID:20625468

  1. Further studies of the stability of LiF:Mg,Cu,P (GR-200) at maximum readout temperatures between 240oC and 280oC

    International Nuclear Information System (INIS)

    Oster, L.; Horowitz, Y.S.; Horowitz, A.

    1996-01-01

    It has recently been shown that LiF:Mg,Cu,P (GR-200) can be read out to temperatures as high as 270 o C for 12 s with negligible loss in sensitivity. In the present work the long-term sensitivity of GR-200 was studied at readout temperatures between 240 o C and 280 o C. The idea was that the readout temperatures above 240 o C might initiate reaction processes which influence the sensitivity only after long-term storage. No difference was found in the behaviour of GR-200 chips with 80 accumulated readouts to 240 o C or 270 o C and after storage of up to four months. Slight losses in sensitivity of 4% for 240 o C and 10% for 270 o C are observed after 80 readouts during four months storage. However, at a maximum readout temperature of 280 o C, a 33% loss in sensitivity after 80 cycles is observed. In conclusion it is found that GR-200 can be read out at temperatures as high as 270 o C with negligible loss in sensitivity (less than 0.1% per readout following an initialisation procedure of 1 readout) and acceptable residual signal (0.6%). (author)

  2. Beam test performance of the APV5 chip

    International Nuclear Information System (INIS)

    De Fez-Laso, M.D.M.; Gill, K.; MacEvoy, B.; Millmore, M.; Potts, A.; Raymond, M.

    1996-01-01

    The performance of the latest prototype of the radiation hard front end chip to be used by the CMS collaboration for analogue readout of the microstrip tracker has been evaluated with a silicon microstrip detector in a beam at CERN. The circuit, developed by the RD20 collaboration, consists of 128 channels of amplifier, pipeline memory, analogue signal processor and a serial multiplexer. As a result of these studies improvements in the circuit design have been devised which will be implemented in the next version. (orig.)

  3. Timing and Readout Contorl in the LHCb Upgraded Readout System

    CERN Document Server

    Alessio, Federico

    2016-01-01

    In 2019, the LHCb experiment at CERN will undergo a major upgrade where its detectors electronics and entire readout system will be changed to read-out events at the full LHC rate of 40 MHz. In this paper, the new timing, trigger and readout control system for such upgrade is reviewed. Particular attention is given to the distribution of the clock, timing and synchronization information across the entire readout system using generic FTTH technology like Passive Optical Networks. Moreover the system will be responsible to generically control the Front-End electronics by transmitting configuration data and receiving monitoring data, offloading the software control system from the heavy task of manipulating complex protocols of thousands of Front-End electronics devices. The way in which this was implemented is here reviewed with a description of results from first implementations of the system, including usages in test-benches, implementation of techniques for timing distribution and latency control."

  4. [Evaluation of Image Quality of Readout Segmented EPI with Readout Partial Fourier Technique].

    Science.gov (United States)

    Yoshimura, Yuuki; Suzuki, Daisuke; Miyahara, Kanae

    Readout segmented EPI (readout segmentation of long variable echo-trains: RESOLVE) segmented k-space in the readout direction. By using the partial Fourier method in the readout direction, the imaging time was shortened. However, the influence on image quality due to insufficient data sampling is concerned. The setting of the partial Fourier method in the readout direction in each segment was changed. Then, we examined signal-to-noise ratio (SNR), contrast-to-noise ratio (CNR), and distortion ratio for changes in image quality due to differences in data sampling. As the number of sampling segments decreased, SNR and CNR showed a low value. In addition, the distortion ratio did not change. The image quality of minimum sampling segments is greatly different from full data sampling, and caution is required when using it.

  5. Dedicated multichannel readout ASIC coupled with single crystal diamond for dosimeter application

    International Nuclear Information System (INIS)

    Fabbri, A; Notaristefani, F De; Galasso, M; Cencelli, V Orsolini; Falco, M D; Marinelli, M; Tortora, L; Verona, C; Rinati, G Verona

    2013-01-01

    This paper reports on the tests of a low-noise, multi-channel readout integrated circuit used as a readout electronic front-end for a diamond multi-pixel dosimeter. The system is developed for dose distribution measurement in radiotherapy applications. The first 10-channel prototype chip was designed and fabricated in a 0.18 um CMOS process. Every channel includes a charge integrator with a 10 pF capacitor and a double slope A/D converter. The diamond multi-pixel detector, based on CVD synthetic single crystal diamond Schottky diodes, is made by a 3 × 3 sensor matrix. The overall device has been tested under irradiation with 6 MeV radio therapeutic photon beams at the Policlinico ''Tor Vergata'' (PTV) hospital. Measurements show a 20 fA RMS leakage current from the front-end input stage and a negligible dark current from the diamond detector, a stable temporal response and a good linear behaviour as a function of both dose and dose rate. These characteristics were common to each tested channel.

  6. Direct photon-counting scintillation detector readout using an SSPM

    International Nuclear Information System (INIS)

    Stapels, Christopher J.; Squillante, Michael R.; Lawrence, William G.; Augustine, Frank L.; Christian, James F.

    2007-01-01

    Gamma-ray detector technologies, capable of providing adequate energy information, use photomultiplier tubes (PMTs) or silicon avalanche photodiodes to detect the light pulse from a scintillation crystal. A new approach to detect the light from scintillation materials is to use an array of small photon counting detectors, or a 'detector-on-a-chip' based on a novel 'Solid-state Photomultiplier' (SSPM) concept. A CMOS SSPM coupled to a scintillation crystal uses an array of CMOS Geiger photodiode (GPD) pixels to collect light and produce a signal proportional to the energy of the radiation. Each pixel acts as a binary photon detector, but the summed output is an analog representation of the total photon intensity. We have successfully fabricated arrays of GPD pixels in a CMOS environment, which makes possible the production of miniaturized arrays integrated with the detector electronics in a small silicon chip. This detector technology allows for a substantial cost reduction while preserving the energy resolution needed for radiological measurements. In this work, we compare designs for the SSPM detector. One pixel design achieves maximum detection efficiency (DE) for 632-nm photons approaching 30% with a room temperature dark count rate (DCR) of less than 1 kHz for a 30-μm-diameter pixel. We characterize after pulsing and optical cross talk and discuss their effects on the performance of the SSPM. For 30-μm diameter, passively quenched CMOS GPD pixels, modeling suggests that a pixel spacing of approximately 90 μm optimizes the SSPM performance with respect to DE and cross talk

  7. AVME readout module for multichannel ASIC characterization

    International Nuclear Information System (INIS)

    Borkar, S.P.; Lalwani, S.K.; Ghodgaonkar, M.D.; Kataria, S.K.; Reynaud, Serge; )

    2004-01-01

    Electronics Division, BARC has been working on the development of multi-channel ASIC, called SPAIR (Silicon-strip Pulse Amplifier Integrated Readout). It contains 8 channels of preamplifier, shaper and track-and-hold circuitry. Electronics Division has also actively participated in development of test setup for the front-end ASIC, called PACE, for the preshower detector of the Compact Muon Solenoid (CMS) Experiment at CERN, Geneva. PACE is a 32 channel ASIC for silicon strip detector, containing preamplifier, shaper, calibration circuitry, switched capacitor array, readout amplifier per channel and an analog multiplexer. A VME Readout Module, (VRM) is developed which can be utilized in data acquisition from ASICs like PACE and SPAIR. The VRM can also be used as the Detector Dependent Unit for digitally processing the data received from the front-end electronics on the 16-bit LVDS port. The processed, data can be read by the VME system. Thus the VRM is very useful in building an ASIC characterization system and/or the automated ASIC production testing system. It can be used also to build the applications using such ASICs. To cater to various requirements arising in future, variety of VME modules are to be developed like ADCs, DACs and D 1/0. VME interface remains a common part to all these modules. The different functional blocks of these modules can be designed and fabricated on small piggyback boards (called Test Boards) and mounted on the VRM, which provides the common VME interface. The design details and uses of VRM are presented here. (author)

  8. A CMOS 130nm Evaluation digitzer chip for silicon strips readout

    CERN Document Server

    Da Silva, W; Dhellot, M; Fougeron, D; Genat, J F; Hermel, R; Huppert, J f; Kapusta, F; Lebbolo, H; Pham, T H; Rossel, F; Savoy-navarro, A; Sefri, R; Vilalte

    2007-01-01

    A CMOS 130nm evaluation chip intended to read Silicon strip detectors at the ILC has been designed and successfully tested. Optimized for a detector capacitance of 10 pF, it includes four channels of charge integration, pulse shaping, a 16-deep analogue sampler triggered on input analogue sums, and parallel analogue to digital conversion. Tests results of the full chain are reported, demonstrating the behaviour and performance of the full sampling process and analogue to digital conversion. Each channel dissipates less than one milli-Watt static power.

  9. Waveshifting fiber readout of lanthanum halide scintillators

    International Nuclear Information System (INIS)

    Case, G.L.; Cherry, M.L.; Stacy, J.G.

    2006-01-01

    Newly developed high-light-yield inorganic scintillators coupled to waveshifting optical fibers provide the capability of efficient X-ray detection and millimeter scale position resolution suitable for high-energy cosmic ray instruments, hard X-ray/gamma ray astronomy telescopes and applications to national security. The CASTER design for NASA's proposed Black Hole Finder Probe mission, in particular, calls for a 6-8 m 2 hard X-ray coded aperture imaging telescope operating in the 20-600 keV energy band, putting significant constraints on cost and readout complexity. The development of new inorganic scintillator materials (e.g., cerium-doped LaBr 3 and LaCl 3 ) provides improved energy resolution and timing performance that is well suited to the requirements for national security and astrophysics applications. LaBr 3 or LaCl 3 detector arrays coupled with waveshifting fiber optic readout represent a significant advance in the performance capabilities of scintillator-based gamma cameras and provide the potential for a feasible approach to affordable, large area, extremely sensitive detectors. We describe some of the applications and present laboratory test results demonstrating the expected scintillator performance

  10. Standard practice for radiological examination using digital detector arrays

    CERN Document Server

    American Society for Testing and Materials. Philadelphia

    2010-01-01

    1.1 This practice establishes the minimum requirements for radiological examination for metallic and nonmetallic material using a digital detector array (DDA) system. 1.2 The requirements in this practice are intended to control the quality of radiologic images and are not intended to establish acceptance criteria for parts or materials. 1.3 This practice covers the radiologic examination with DDAs including DDAs described in Practice E2597 such as a device that contains a photoconductor attached to a Thin Film Transistor (TFT) read out structure, a device that has a phosphor coupled directly to an amorphous silicon read-out structure, and devices where a phosphor is coupled to a CMOS (Complementary metal–oxide–semiconductor) array, a Linear Detector Array (LDA) or a CCD (charge coupled device) crystalline silicon read-out structure. 1.4 The DDA shall be selected for an NDT application based on knowledge of the technology described in Guide , and of the selected DDA properties provided by the manufactu...

  11. Transcript profiling of common bean (Phaseolus vulgaris L. using the GeneChip® Soybean Genome Array: optimizing analysis by masking biased probes

    Directory of Open Access Journals (Sweden)

    Gronwald John W

    2010-05-01

    Full Text Available Abstract Background Common bean (Phaseolus vulgaris L. and soybean (Glycine max both belong to the Phaseoleae tribe and share significant coding sequence homology. This suggests that the GeneChip® Soybean Genome Array (soybean GeneChip may be used for gene expression studies using common bean. Results To evaluate the utility of the soybean GeneChip for transcript profiling of common bean, we hybridized cRNAs purified from nodule, leaf, and root of common bean and soybean in triplicate to the soybean GeneChip. Initial data analysis showed a decreased sensitivity and accuracy of measuring differential gene expression in common bean cross-species hybridization (CSH GeneChip data compared to that of soybean. We employed a method that masked putative probes targeting inter-species variable (ISV regions between common bean and soybean. A masking signal intensity threshold was selected that optimized both sensitivity and accuracy of measuring differential gene expression. After masking for ISV regions, the number of differentially-expressed genes identified in common bean was increased by 2.8-fold reflecting increased sensitivity. Quantitative RT-PCR (qRT-PCR analysis of 20 randomly selected genes and purine-ureide pathway genes demonstrated an increased accuracy of measuring differential gene expression after masking for ISV regions. We also evaluated masked probe frequency per probe set to gain insight into the sequence divergence pattern between common bean and soybean. The sequence divergence pattern analysis suggested that the genes for basic cellular functions and metabolism were highly conserved between soybean and common bean. Additionally, our results show that some classes of genes, particularly those associated with environmental adaptation, are highly divergent. Conclusions The soybean GeneChip is a suitable cross-species platform for transcript profiling in common bean when used in combination with the masking protocol described. In

  12. Tunable on chip optofluidic laser

    DEFF Research Database (Denmark)

    Bakal, Avraham; Vannahme, Christoph; Kristensen, Anders

    2015-01-01

    A chip scale tunable laser in the visible spectral band is realized by generating a periodic droplet array inside a microfluidic channel. Combined with a gain medium within the droplets, the periodic structure provides the optical feedback of the laser. By controlling the pressure applied to two...

  13. From understanding cellular function to novel drug discovery: the role of planar patch-clamp array chip technology

    Directory of Open Access Journals (Sweden)

    Christophe ePy

    2011-10-01

    Full Text Available All excitable cell functions rely upon ion channels that are embedded in their plasma membrane. Perturbations of ion channel structure or function result in pathologies ranging from cardiac dysfunction to neurodegenerative disorders. Consequently, to understand the functions of excitable cells and to remedy their pathophysiology, it is important to understand the ion channel functions under various experimental conditions – including exposure to novel drug targets. Glass pipette patch-clamp is the state of the art technique to monitor the intrinsic and synaptic properties of neurons. However, this technique is labor-intensive and has low data throughput. Planar patch-clamp chips, integrated into automated systems, offer high throughputs but are limited to isolated cells from suspensions, resulting in questionable models of true physiological function, and are unsuitable for studies involving neuronal communication. Multi-electrode arrays (MEA, in contrast, have the ability to monitor network activity by measuring local field potentials from multiple extracellular sites, but specific ion channel activity is challenging to extract from these multiplexed signals. Here we describe a novel planar patch-clamp chip technology that enables the simultaneous high resolution electrophysiological interrogation of individual neurons at multiple sites in synaptically connected neuronal networks, thereby combining the advantages of MEA and patch-clamp techniques. Each neuron can be probed through an aperture that connects to a dedicated subterranean microfluidic channel. Neurons growing in networks are aligned to the apertures by physisorbed or chemisorbed chemical cues. In this review, we describe the design and fabrication process of these chips, the approach to the chemical patterning for cell placement, and present physiological data from cultured neuronal cells.

  14. Laser Power Measurement Using Commercial MEMS Pressure Sensor along with PSoC Embedded Read-out

    Directory of Open Access Journals (Sweden)

    J. Jayapandian

    2011-06-01

    Full Text Available Solid-state, gas, semiconductor and other types of lasers are extensively employed in industry for producing laser beams used in such wide ranging fields as machining, medicine and communications. In such applications, it is necessary to be able to accurately measure the power of the laser beam that is emitted by the laser. This paper describes a novel design technique which uses the diaphragm of a commercial MEMS pressure sensor as a target surface on which laser beam impinge, transfer heat and causes change in piezo resistance. The measured change in resistance was proportional to the intensity of laser beam in the range of 0 to 300 mW. The ratio metric embedded read-out design using a single chip programmable system on chip (PSoC has been used to acquire the resistance.

  15. High-resolution gamma-ray spectroscopy with a microwave-multiplexed transition-edge sensor array

    Energy Technology Data Exchange (ETDEWEB)

    Noroozian, Omid [National Institute of Standards and Technology, Boulder, Colorado 80305 (United States); Center for Astrophysics and Space Astronomy, University of Colorado, Boulder, Colorado 80309 (United States); Mates, John A. B.; Bennett, Douglas A.; Brevik, Justus A.; Fowler, Joseph W.; Gao, Jiansong; Hilton, Gene C.; Horansky, Robert D.; Irwin, Kent D.; Schmidt, Daniel R.; Vale, Leila R.; Ullom, Joel N. [National Institute of Standards and Technology, Boulder, Colorado 80305 (United States); Kang, Zhao [Department of Physics, University of Colorado, Boulder, Colorado 80309 (United States)

    2013-11-11

    We demonstrate very high resolution photon spectroscopy with a microwave-multiplexed two-pixel transition-edge sensor (TES) array. We measured a {sup 153}Gd photon source and achieved an energy resolution of 63 eV full-width-at-half-maximum at 97 keV and an equivalent readout system noise of 86 pA/√(Hz) at the TES. The readout circuit consists of superconducting microwave resonators coupled to radio-frequency superconducting-quantum-interference-devices and transduces changes in input current to changes in phase of a microwave signal. We use flux-ramp modulation to linearize the response and evade low-frequency noise. This demonstration establishes one path for the readout of cryogenic X-ray and gamma-ray sensor arrays with more than 10{sup 3} elements and spectral resolving powers R=λ/Δλ>10{sup 3}.

  16. PARISROC, an autonomous front-end ASIC for triggerless acquisition in next generation neutrino experiments

    Science.gov (United States)

    Conforti Di Lorenzo, S.; Campagne, J. E.; Drouet, S.; Dulucq, F.; El Berni, M.; Genolini, B.; de La Taille, C.; Martin-Chassard, G.; Seguin Moreau, N.; Wanlin, E.; Xiangbo, Y.

    2012-12-01

    PARISROC (Photomultiplier ARray Integrated in SiGe ReadOut Chip) is a complete readout chip in AustriaMicroSystems (AMS) SiGe 0.35 μm technology designed to read array of 16 Photomultipliers (PMTs). The ASIC is realized in the context of the PMm2 (square meter PhotoMultiplier) project that has proposed a new system of “smart photo-detectors” composed by sensor and read-out electronics dedicated to next generation neutrino experiments. The future water Cherenkov detectors will take place in megaton size water tanks then with a large surface of photo-detection. We propose to segment the large surface in arrays with a single front-end electronics and only the useful data send in surface to be stocked and analyzed. This paper describes the second version of the ASIC and illustrates the chip principle of operation and the main characteristics thank to a series of measurements. It is a 16-channel ASIC with channels that work independently, in triggerless mode and all managed by a common digital part. Then main innovation is that all the channels are handled independently by the digital part so that only channels that have triggered are digitized. Then the data are transferred to the internal memory and sent out in a data driven way. The ASIC allows charge and time measurement. We measured a charge measurement range starting from 160 fC (1 photoelectron-p.e., at PMT gain of 106) to 100 pC (around 600 p.e.) at 1% of linearity; time tagging at 1 ns thanks to a 24-bit counter at 10 MHz and a Time to Digital Converter (TDC) on a 100 ns ramp.

  17. PARISROC, an autonomous front-end ASIC for triggerless acquisition in next generation neutrino experiments

    International Nuclear Information System (INIS)

    Conforti Di Lorenzo, S.; Campagne, J.E.; Drouet, S.; Dulucq, F.; El Berni, M.; Genolini, B.; La Taille, C. de; Martin-Chassard, G.; Seguin Moreau, N.; Wanlin, E.; Xiangbo, Y.

    2012-01-01

    PARISROC (Photomultiplier ARray Integrated in SiGe ReadOut Chip) is a complete readout chip in AustriaMicroSystems (AMS) SiGe 0.35 μm technology designed to read array of 16 Photomultipliers (PMTs). The ASIC is realized in the context of the PMm2 (square meter PhotoMultiplier) project that has proposed a new system of “smart photo-detectors” composed by sensor and read-out electronics dedicated to next generation neutrino experiments. The future water Cherenkov detectors will take place in megaton size water tanks then with a large surface of photo-detection. We propose to segment the large surface in arrays with a single front-end electronics and only the useful data send in surface to be stocked and analyzed. This paper describes the second version of the ASIC and illustrates the chip principle of operation and the main characteristics thank to a series of measurements. It is a 16-channel ASIC with channels that work independently, in triggerless mode and all managed by a common digital part. Then main innovation is that all the channels are handled independently by the digital part so that only channels that have triggered are digitized. Then the data are transferred to the internal memory and sent out in a data driven way. The ASIC allows charge and time measurement. We measured a charge measurement range starting from 160 fC (1 photoelectron-p.e., at PMT gain of 10 6 ) to 100 pC (around 600 p.e.) at 1% of linearity; time tagging at 1 ns thanks to a 24-bit counter at 10 MHz and a Time to Digital Converter (TDC) on a 100 ns ramp.

  18. Developing an optimum protocol for thermoluminescence dosimetry with gr-200 chips using Taguchi method

    International Nuclear Information System (INIS)

    Sadeghi, Maryam; Faghihi, Reza; Sina, Sedigheh

    2017-01-01

    Thermoluminescence dosimetry (TLD) is a powerful technique with wide applications in personal, environmental and clinical dosimetry. The optimum annealing, storage and reading protocols are very effective in accuracy of TLD response. The purpose of this study is to obtain an optimum protocol for GR-200; LiF: Mg, Cu, P, by optimizing the effective parameters, to increase the reliability of the TLD response using Taguchi method. Taguchi method has been used in this study for optimization of annealing, storage and reading protocols of the TLDs. A number of 108 GR-200 chips were divided into 27 groups, each containing four chips. The TLDs were exposed to three different doses, and stored, annealed and read out by different procedures as suggested by Taguchi Method. By comparing the signal-to-noise ratios the optimum dosimetry procedure was obtained. According to the results, the optimum values for annealing temperature (de.C), Annealing Time (s), Annealing to Exposure time (d), Exposure to Readout time (d), Pre-heat Temperature (de.C), Pre-heat Time (s), Heating Rate (de.C/s), Maximum Temperature of Readout (de.C), readout time (s) and Storage Temperature (de.C) are 240, 90, 1, 2, 50, 0, 15, 240, 13 and -20, respectively. Using the optimum protocol, an efficient glow curve with low residual signals can be achieved. Using optimum protocol obtained by Taguchi method, the dosimetry can be effectively performed with great accuracy. (authors)

  19. Fabrication of the GLAST Silicon Tracker Readout Electronics

    Energy Technology Data Exchange (ETDEWEB)

    Baldini, Luca; Brez, Alessandro; Himel, Thomas; Johnson, R.P.; Latronico, Luca; Minuti, Massimo; Nelson, David; Sadrozinski, H.F.-W.; Sgro, Carmelo; Spandre, Gloria; Sugizaki, Mutsumi; Tajima, Hiro; Cohen Tanugi, Johann; Young, Charles; Ziegler, Marcus; /Pisa U. /INFN, Pisa /SLAC /UC, Santa Cruz

    2006-03-03

    A unique electronics system has been built and tested for reading signals from the silicon-strip detectors of the Gamma-ray Large Area Space Telescope mission. The system amplifies and processes signals from 884,736 36-cm long silicon strips in a 4 x 4 array of tower modules. An aggressive mechanical design fits the readout electronics in narrow spaces between the tower modules, to minimize dead area. This design and the resulting departures from conventional electronics packaging led to several fabrication challenges and lessons learned. This paper describes the fabrication processes and how the problems peculiar to this design were overcome.

  20. NECTAR: New electronics for the Cherenkov Telescope Array

    Science.gov (United States)

    Naumann, Christopher Lindsay; Bolmont, J.; Corona, P.; Delagnes, E.; Dzahini, D.; Feinstein, F.; Gascon, D.; Glicenstein, J.-F.; Nayman, P.; Rarbi, F.; Ribo, M.; Sanuy, A.; Siero, X.; Tavernet, J.-P.; Toussenel, F.; Vincent, P.; Vorobiov, S.

    2012-12-01

    The international CTA consortium is currently in the preparatory phase for the development of the next-generation Cherenkov Telescope Array (CTA [1]), based on the return of experience from the three major current-generation arrays H.E.S.S., MAGIC and VERITAS. To achieve an unprecedented sensitivity and energy range for TeV gamma rays, a new kind of flexible and powerful yet inexpensive front-end hardware will be required for the order of 105 channels of photodetectors in up to 100 telescopes. One possible solution is the NECTAr (New Electronics for the Cherenkov Telescope Array) system, based on the integration of as much as possible of the front-end electronics (amplifiers, fast analogue samplers, memory and ADCs) into a single ASIC for very fast readout performance and a significant reduction of the cost and the lower consumption per channel, while offering a high degree of flexibility both for the triggering and the readout of the telescope. The current status of its development is presented, along with newest results from measurements and simulation studies.

  1. Temperature-controlled transfer and self-wiring for multi-color light-emitting diode arrays

    International Nuclear Information System (INIS)

    Onoe, Hiroaki; Nakai, Akihito; Iwase, Eiji; Matsumoto, Kiyoshi; Shimoyama, Isao

    2009-01-01

    We propose an integration method for arranging light-emitting diode (LED) bare chips on a flexible substrate for multi-color inorganic LED displays. The LED bare chips (240 µm × 240 µm × 75 µm), which were diced on an adhesive sheet by the manufacturer, were transferred to a flexible polyimide substrate by our temperature-controlled transfer (TCT) and self-wiring (SW) processes. In these processes, low-melting point solder (LMPS) and poly-(ethylene glycol) (PEG) worked as adhesive layers for the LED chips during the TCT processes, and the adhesion force of the LMPS and PEG layers was controlled by changing the temperature to melt and solidify the layers. After the TCT processes, electrical connection between the transferred LED chips and the flexible substrate was automatically established via the SW process, by using the surface tension of the melted LMPS. This TCT/SW method enabled us to (i) handle arrays of commercially available bare chips, (ii) arrange multiple types of chips on the circuit substrate by simply repeating the TCT processes and (iii) establish electrical connection between the chips and the substrate automatically. Applying this transfer printing and wiring method, we experimentally demonstrated a 5-by-5 flexible LED array and a two-color (blue and green) LED array

  2. SQUID readout multiplexers for transition-edge sensor arrays

    Energy Technology Data Exchange (ETDEWEB)

    Lee, Adrian T. [Physics Department, University of California, Berkeley, CA 94720 (United States) and Physics Division, Lawrence Berkeley National Laboratory, Berkeley, CA 94720 (United States)]. E-mail: atl@physics.berkeley.edu

    2006-04-15

    Two classes of SQUID multiplexer are being developed for large arrays of cryogenic sensors, distinguished by their operation in either the time domain or frequency domain. Several systems optimized for use with Transition-Edge Sensors (TES) are reaching a high level of maturity, and will be deployed on funded astrophysics experiments in the next several years. A useful technical figure of merit is the product of the number of detectors multplexed multipled by the bandwidth of the detectors, which can be termed the 'total signal bandwidth' of a multiplexer system. This figure of merit is comparable within a factor of two for the mature systems. Several new concepts for increasing the total bandwidth are being developed in the broad class of frequency domain multiplexers. Another notable area of progress is in the level of integration of muliplexer and detector array. The time domain system for SCUBA-II is a sophisticated bump-bonded sandwich structure, and the Jena/MPI group is integrating detectors and a time domain multiplexer on one substrate. Finally, the Kinetic Inductance Detectors (KID)/HEMT (non-SQUID) detector/multiplexer system, will be discussed briefly.

  3. ChIP on SNP-chip for genome-wide analysis of human histone H4 hyperacetylation

    Directory of Open Access Journals (Sweden)

    Porter Christopher J

    2007-09-01

    Full Text Available Abstract Background SNP microarrays are designed to genotype Single Nucleotide Polymorphisms (SNPs. These microarrays report hybridization of DNA fragments and therefore can be used for the purpose of detecting genomic fragments. Results Here, we demonstrate that a SNP microarray can be effectively used in this way to perform chromatin immunoprecipitation (ChIP on chip as an alternative to tiling microarrays. We illustrate this novel application by mapping whole genome histone H4 hyperacetylation in human myoblasts and myotubes. We detect clusters of hyperacetylated histone H4, often spanning across up to 300 kilobases of genomic sequence. Using complementary genome-wide analyses of gene expression by DNA microarray we demonstrate that these clusters of hyperacetylated histone H4 tend to be associated with expressed genes. Conclusion The use of a SNP array for a ChIP-on-chip application (ChIP on SNP-chip will be of great value to laboratories whose interest is the determination of general rules regarding the relationship of specific chromatin modifications to transcriptional status throughout the genome and to examine the asymmetric modification of chromatin at heterozygous loci.

  4. Front-end electronics for the readout of CdZnTe sensors

    CERN Document Server

    Moraes, D; Rudge, A

    2006-01-01

    The CERN_DxCTA is a front-end ASIC optimized for the readout of CdZn Te sensors. The chip is implemented in 0.25 mum CMOS technology. The circuit consists of 128 channels equipped with a transimpedance amplifier followed by a gain-shaper stage with 20 ns peaking time and two discriminators, allowing two threshold settings. Each discriminator includes a 5-bit trim DAC and is followed by an 18-bit static ripple-counter. The channel architecture is optimized for the detector characteristics in order to achieve the best energy resolution at counting rates of up to 5 M counts/second. Complete evaluation of the circuit is presented using electronic pulses and Cd ZnTe pixel detectors.

  5. A CMOS micromachined capacitive tactile sensor with integrated readout circuits and compensation of process variations.

    Science.gov (United States)

    Tsai, Tsung-Heng; Tsai, Hao-Cheng; Wu, Tien-Keng

    2014-10-01

    This paper presents a capacitive tactile sensor fabricated in a standard CMOS process. Both of the sensor and readout circuits are integrated on a single chip by a TSMC 0.35 μm CMOS MEMS technology. In order to improve the sensitivity, a T-shaped protrusion is proposed and implemented. This sensor comprises the metal layer and the dielectric layer without extra thin film deposition, and can be completed with few post-processing steps. By a nano-indenter, the measured spring constant of the T-shaped structure is 2.19 kNewton/m. Fully differential correlated double sampling capacitor-to-voltage converter (CDS-CVC) and reference capacitor correction are utilized to compensate process variations and improve the accuracy of the readout circuits. The measured displacement-to-voltage transductance is 7.15 mV/nm, and the sensitivity is 3.26 mV/μNewton. The overall power dissipation is 132.8 μW.

  6. High-power, format-flexible, 885-nm vertical-cavity surface-emitting laser arrays

    Science.gov (United States)

    Wang, Chad; Talantov, Fedor; Garrett, Henry; Berdin, Glen; Cardellino, Terri; Millenheft, David; Geske, Jonathan

    2013-03-01

    High-power, format flexible, 885 nm vertical-cavity surface-emitting laser (VCSEL) arrays have been developed for solid-state pumping and illumination applications. In this approach, a common VCSEL size format was designed to enable tiling into flexible formats and operating configurations. The fabrication of a common chip size on ceramic submount enables low-cost volume manufacturing of high-power VCSEL arrays. This base VCSEL chip was designed to be 5x3.33 mm2, and produced up to 50 Watts of peak continuous wave (CW) power. To scale to higher powers, multiple chips can be tiled into a combination of series or parallel configurations tailored to the application driver conditions. In actively cooled CW operation, the VCSEL array chips were packaged onto a single water channel cooler, and we have demonstrated 0.5x1, 1x1, and 1x3 cm2 formats, producing 150, 250, and 500 Watts of peak power, respectively, in under 130 A operating current. In QCW operation, the 1x3 cm2 VCSEL module, which contains 18 VCSEL array chips packaged on a single water cooler, produced over 1.3 kW of peak power. In passively cooled packages, multiple chip configurations have been developed for illumination applications, producing over 300 Watts of peak power in QCW operating conditions. These VCSEL chips use a substrate-removed structure to allow for efficient thermal heatsinking to enable high-power operation. This scalable, format flexible VCSEL architecture can be applied to wavelengths ranging from 800 to 1100 nm, and can be used to tailor emission spectral widths and build high-power hyperspectral sources.

  7. Superconducting Microwave Resonator Arrays for Submillimeter/Far-Infrared Imaging

    Science.gov (United States)

    Noroozian, Omid

    Superconducting microwave resonators have the potential to revolutionize submillimeter and far-infrared astronomy, and with it our understanding of the universe. The field of low-temperature detector technology has reached a point where extremely sensitive devices like transition-edge sensors are now capable of detecting radiation limited by the background noise of the universe. However, the size of these detector arrays are limited to only a few thousand pixels. This is because of the cost and complexity of fabricating large-scale arrays of these detectors that can reach up to 10 lithographic levels on chip, and the complicated SQUID-based multiplexing circuitry and wiring for readout of each detector. In order to make substantial progress, next-generation ground-based telescopes such as CCAT or future space telescopes require focal planes with large-scale detector arrays of 104--10 6 pixels. Arrays using microwave kinetic inductance detectors (MKID) are a potential solution. These arrays can be easily made with a single layer of superconducting metal film deposited on a silicon substrate and pattered using conventional optical lithography. Furthermore, MKIDs are inherently multiplexable in the frequency domain, allowing ˜ 10 3 detectors to be read out using a single coaxial transmission line and cryogenic amplifier, drastically reducing cost and complexity. An MKID uses the change in the microwave surface impedance of a superconducting thin-film microresonator to detect photons. Absorption of photons in the superconductor breaks Cooper pairs into quasiparticles, changing the complex surface impedance, which results in a perturbation of resonator frequency and quality factor. For excitation and readout, the resonator is weakly coupled to a transmission line. The complex amplitude of a microwave probe signal tuned on-resonance and transmitted on the feedline past the resonator is perturbed as photons are absorbed in the superconductor. The perturbation can be

  8. Design and performance of single photon APD focal plane arrays for 3-D LADAR imaging

    Science.gov (United States)

    Itzler, Mark A.; Entwistle, Mark; Owens, Mark; Patel, Ketan; Jiang, Xudong; Slomkowski, Krystyna; Rangwala, Sabbir; Zalud, Peter F.; Senko, Tom; Tower, John; Ferraro, Joseph

    2010-08-01

    ×We describe the design, fabrication, and performance of focal plane arrays (FPAs) for use in 3-D LADAR imaging applications requiring single photon sensitivity. These 32 × 32 FPAs provide high-efficiency single photon sensitivity for three-dimensional LADAR imaging applications at 1064 nm. Our GmAPD arrays are designed using a planarpassivated avalanche photodiode device platform with buried p-n junctions that has demonstrated excellent performance uniformity, operational stability, and long-term reliability. The core of the FPA is a chip stack formed by hybridizing the GmAPD photodiode array to a custom CMOS read-out integrated circuit (ROIC) and attaching a precision-aligned GaP microlens array (MLA) to the back-illuminated detector array. Each ROIC pixel includes an active quenching circuit governing Geiger-mode operation of the corresponding avalanche photodiode pixel as well as a pseudo-random counter to capture per-pixel time-of-flight timestamps in each frame. The FPA has been designed to operate at frame rates as high as 186 kHz for 2 μs range gates. Effective single photon detection efficiencies as high as 40% (including all optical transmission and MLA losses) are achieved for dark count rates below 20 kHz. For these planar-geometry diffused-junction GmAPDs, isolation trenches are used to reduce crosstalk due to hot carrier luminescence effects during avalanche events, and we present details of the crosstalk performance for different operating conditions. Direct measurement of temporal probability distribution functions due to cumulative timing uncertainties of the GmAPDs and ROIC circuitry has demonstrated a FWHM timing jitter as low as 265 ps (standard deviation is ~100 ps).

  9. Portable Lock-in Amplifier-Based Electrochemical Method to Measure an Array of 64 Sensors for Point-of-Care Applications.

    Science.gov (United States)

    Hrdý, Radim; Kynclová, Hana; Klepáčová, Ivana; Bartošík, Martin; Neužil, Pavel

    2017-09-05

    We present a portable lock-in amplifier-based electrochemical sensing system. The basic unit (cluster) consists of four electrochemical cells (EC), each containing one pseudoreference electrode (PRE) and one working electrode (WE). All four ECs are simultaneously interrogated, each at different frequencies, with square wave pulses superposed on a sawtooth signal for cyclic voltammetry (CV). Lock-in amplification provides independent read-out of four signals, with excellent noise suppression. We expanded a single cluster system into an array of 16 clusters by using electronic switches. The chip with an array of ECs was fabricated using planar technology with a gap between a WE and a PRE of ≈2 μm, which results in partial microelectrode-type behavior. The basic electrode characterization was performed with the model case using a ferricyanide-ferrocyanide redox couple (Fe 2+ /Fe 3+ ) reaction, performing CV and differential pulse voltammetry (DPV). We then used this system to perform cyclic lock-in voltammetry (CLV) to measure concurrently responses of the four ECs. We repeated this method with all 64 ECs on the chip. The standard deviation of a peak oxidation and reduction current in a single channel consisting of 13 ECs was ≈7.46% and ≈5.6%, respectively. The four-EC configuration in each measured spot allows determination of nonperforming ECs and, thus, to eliminate potential false results. This system is built in a portable palm-size format suitable for point-of-care applications. It can perform either individual or multiple measurements of active compounds, such as biomarkers.

  10. Reliable Single Chip Genotyping with Semi-Parametric Log-Concave Mixtures

    NARCIS (Netherlands)

    R.C.A. Rippe (Ralph); J.J. Meulman (Jacqueline); P.H.C. Eilers (Paul)

    2012-01-01

    textabstractThe common approach to SNP genotyping is to use (model-based) clustering per individual SNP, on a set of arrays. Genotyping all SNPs on a single array is much more attractive, in terms of flexibility, stability and applicability, when developing new chips. A new semi-parametric method,

  11. CBC2: A CMS microstrip readout ASIC with logic for track-trigger modules at HL-LHC

    Energy Technology Data Exchange (ETDEWEB)

    Hall, G., E-mail: g.hall@imperial.ac.uk [Blackett Laboratory, Imperial College, London SW7 2AZ (United Kingdom); Pesaresi, M.; Raymond, M. [Blackett Laboratory, Imperial College, London SW7 2AZ (United Kingdom); Braga, D.; Jones, L.; Murray, P.; Prydderch, M. [Rutherford Appleton Laboratory, Chilton, Didcot, Oxon OX11 OQX (United Kingdom); Abbaneo, D.; Blanchot, G.; Honma, A.; Kovacs, M.; Vasey, F. [CERN, CH-1211, Geneva (Switzerland)

    2014-11-21

    The CBC2 is the latest version of the CMS Binary Chip ASIC for readout of the upgraded CMS Tracker at the High Luminosity LHC. It is designed in 130 nm CMOS with 254 input channels and will be bump-bonded to a substrate to which sensors will be wire-bonded. The CBC2 is designed to instrument double layer modules, consisting of two overlaid silicon microstrip sensors with aligned microstrips, in the outer tracker. It incorporates logic to identify L1 trigger primitives in the form of “stubs”: high transverse-momentum track candidates which are identified within the low momentum background by selecting correlated hits between two closely separated microstrip sensors. The first prototype modules have been assembled. The performance of the chip in recent laboratory tests is briefly reported and the status of module construction described.

  12. "Hook"-calibration of GeneChip-microarrays: Chip characteristics and expression measures

    Directory of Open Access Journals (Sweden)

    Krohn Knut

    2008-08-01

    Full Text Available Abstract Background Microarray experiments rely on several critical steps that may introduce biases and uncertainty in downstream analyses. These steps include mRNA sample extraction, amplification and labelling, hybridization, and scanning causing chip-specific systematic variations on the raw intensity level. Also the chosen array-type and the up-to-dateness of the genomic information probed on the chip affect the quality of the expression measures. In the accompanying publication we presented theory and algorithm of the so-called hook method which aims at correcting expression data for systematic biases using a series of new chip characteristics. Results In this publication we summarize the essential chip characteristics provided by this method, analyze special benchmark experiments to estimate transcript related expression measures and illustrate the potency of the method to detect and to quantify the quality of a particular hybridization. It is shown that our single-chip approach provides expression measures responding linearly on changes of the transcript concentration over three orders of magnitude. In addition, the method calculates a detection call judging the relation between the signal and the detection limit of the particular measurement. The performance of the method in the context of different chip generations and probe set assignments is illustrated. The hook method characterizes the RNA-quality in terms of the 3'/5'-amplification bias and the sample-specific calling rate. We show that the proper judgement of these effects requires the disentanglement of non-specific and specific hybridization which, otherwise, can lead to misinterpretations of expression changes. The consequences of modifying probe/target interactions by either changing the labelling protocol or by substituting RNA by DNA targets are demonstrated. Conclusion The single-chip based hook-method provides accurate expression estimates and chip-summary characteristics

  13. Amorphous silicon pixel radiation detectors and associated thin film transistor electronics readout

    International Nuclear Information System (INIS)

    Perez-Mendez, V.; Drewery, J.; Hong, W.S.; Jing, T.; Kaplan, S.N.; Lee, H.; Mireshghi, A.

    1994-10-01

    We describe the characteristics of thin (1 μm) and thick (>30 μm) hydrogenated amorphous silicon p-i-n diodes which are optimized for detecting and recording the spatial distribution of charged particles, x-rays and γ rays. For x-ray, γ ray, and charged particle detection we can use thin p-i-n photosensitive diode arrays coupled to evaporated layers of suitable scintillators. For direct detection of charged particles with high resistance to radiation damage, we use the thick p-i-n diode arrays. Deposition techniques using helium dilution, which produce samples with low stress are described. Pixel arrays for flux exposures can be readout by transistor, single diode or two diode switches. Polysilicon charge sensitive pixel amplifiers for single event detection are described. Various applications in nuclear, particle physics, x-ray medical imaging, neutron crystallography, and radionuclide chromatography are discussed

  14. Design issues of a low cost lock-in amplifier readout circuit for an infrared detector

    Science.gov (United States)

    Scheepers, L.; Schoeman, J.

    2014-06-01

    In the past, high resolution thermal sensors required expensive cooling techniques making the early thermal imagers expensive to operate and cumbersome to transport, limiting them mainly to military applications. However, the introduction of uncooled microbolometers has overcome many of earlier problems and now shows great potential for commercial optoelectric applications. The structure of uncooled microbolometer sensors, especially their smaller size, makes them attractive in low cost commercial applications requiring high production numbers with relatively low performance requirements. However, the biasing requirements of these microbolometers cause these sensors to generate a substantial amount of noise on the output measurements due to self-heating. Different techniques to reduce this noise component have been attempted, such as pulsed biasing currents and the use of blind bolometers as common mode reference. These techniques proved to either limit the performance of the microbolometer or increase the cost of their implementation. The development of a low cost lock-in amplifier provides a readout technique to potentially overcome these challenges. High performance commercial lock-in amplifiers are very expensive. Using this as a readout circuit for a microbolometer will take away from the low manufacturing cost of the detector array. Thus, the purpose of this work was to develop a low cost readout circuit using the technique of phase sensitive detection and customizing this as a readout circuit for microbolometers. The hardware and software of the readout circuit was designed and tested for improvement of the signal-to-noise ratio (SNR) of the microbolometer signal. An optical modulation system was also developed in order to effectively identify the desired signal from the noise with the use of the readout circuit. A data acquisition and graphical user interface sub system was added in order to display the signal recovered by the readout circuit. The readout

  15. A study of SEU-tolerant latches for the RD53A chip

    CERN Document Server

    Fougeron, Denis

    2018-01-01

    The RD53 collaboration was established to develop the next generation of pixel readout chips needed by ATLAS and CMS at the HL-LHC and requiring extreme rate and radiation tolerance. The 65 nm CMOS process has been adopted in order to satisfy the high level of integration requirement. However, the SEU immunity should be carefully considered for a deep submicron process like the 65 nm. Indeed, the device dimensions are small and the capacitance of the storage nodes becomes very low. A chip prototype including different SEU tolerant structures was designed in a 65 nm technology. Several proton irradiation tests were carried out in order to estimate the SEU tolerance of the proposed structures and the level of improvement comparing with a standard architecture.

  16. Initial performance of the two-dimensional 1024-channel amplifier array

    International Nuclear Information System (INIS)

    Kishishita, Tetsuichi; Ikeda, Hirokazu; Tamura, Ken-ichi; Hiruta, Tatsuro; Nakazawa, Kazuhiro; Takashima, Takeshi; Takahashi, Tadayuki

    2007-01-01

    This paper describes the initial performance of a two-dimensional analog ASIC that has been developed to read out CdTe pixel detectors for the next-generation hard X-ray imager. The readout chip consists of a 32x32 matrix of identical 200μmx200μm pixel cells. Each readout cell contains a low noise charge-sensitive amplifier, three-stage pulse shaping amplifiers and a comparator circuit. Pulse processing circuits have been also designed to achieve lower power consumption for the space application. Analog outputs by injecting a test pulse have been obtained from 991 pixels out of 1024 pixels. The mean noise level is 297+/-29 electrons (rms) and power consumption is 110μW/pixel

  17. Demonstration of Time Domain Multiplexed Readout for Magnetically Coupled Calorimeters

    Science.gov (United States)

    Porst, J.-P.; Adams, J. S.; Balvin, M.; Bandler, S.; Beyer, J.; Busch, S. E.; Drung, D.; Seidel, G. M.; Smith, S. J.; Stevenson, T. R.

    2012-01-01

    Magnetically coupled calorimeters (MCC) have extremely high potential for x-ray applications due to the inherent high energy resolution capability and being non-dissipative. Although very high energy-resolution has been demonstrated, until now there has been no demonstration of multiplexed read-out. We report on the first realization of a time domain multiplexed (TDM) read-out. While this has many similarities with TDM of transition-edge-sensors (TES), for MGGs the energy resolution is limited by the SQUID read-out noise and requires the well established scheme to be altered in order to minimize degradation due to noise aliasing effects. In cur approach, each pixel is read out by a single first stage SQUID (SQ1) that is operated in open loop. The outputs of the SQ1 s are low-pass filtered with an array of low cross-talk inductors, then fed into a single-stage SQUID TD multiplexer. The multiplexer is addressed from room temperature and read out through a single amplifier channel. We present results achieved with a new detector platform. Noise performance is presented and compared to expectations. We have demonstrated multiplexed X-ray spectroscopy at 5.9keV with delta_FWHM=10eV. In an optimized setup, we show it is possible to multiplex 32 detectors without significantly degrading the Intrinsic detector resolution.

  18. Design and Verification of Digital Architecture of 65K Pixel Readout Chip for High-Energy Physics

    CERN Document Server

    Poikela, Tuomas; Paakkulainen, J

    2010-01-01

    The feasibility to design and implement a front-end ASIC for the upgrade of the VELO detector of LHCb experiment at CERN using IBM’s 130nm standard CMOS process and a standard cell library is studied in this thesis. The proposed architecture is a design to cope with high data rates and continuous data taking. The architecture is designed to operate without any external trigger to record every hit signal the ASIC receives from a sensor chip, and then to transmit the information to the next level of electronics, for example to FPGAs. This thesis focuses on design, implementation and functional verification of the digital electronics of the active pixel area. The area requirements are dictated by the geometry of pixels (55$mu$m x 55$mu$m), power requirements (20W/module) by restricted cooling capabilities of the module consisting of 10 chips and output bandwidth requirements by data rate (< 10 Gbit/s) produced by a particle flux passing through the chip. The design work was carried out using transaction...

  19. The ALICE silicon pixel detector front-end and read-out electronics

    CERN Document Server

    Kluge, A

    2006-01-01

    The ALICE silicon pixel detector (SPD) comprises the two innermost barrel layers of the ALICE inner tracker system. The SPD includes 120 half staves each of which consists of a linear array of 10 ALICE pixel chips bump bonded to two silicon sensors. Each pixel chip contains 8192 active cells, so the total number of pixel cells in the SPD is ≈107. The tight material budget and the limitation in physical dimensions required by the detector design introduce new challenges for the integration of the on-detector electronics. An essential part of the half stave is a low-mass multi-layer flex that carries power, ground, and signals to the pixel chips. Each half stave is read out using a multi-chip module (MCM). The MCM contains three radiation hard ASICs and an 800 Mbit/s custom developed optical link for the data transfer between the detector and the control room. The detector components are less than 3 mm thick. The production of the half-staves and MCMs is currently under way. Test results as well as on overvie...

  20. Tests of UFXC32k chip with CdTe pixel detector

    Science.gov (United States)

    Maj, P.; Taguchi, T.; Nakaye, Y.

    2018-02-01

    The paper presents the performance of the UFXC32K—a hybrid pixel detector readout chip working with CdTe detectors. The UFXC32K has a pixel pitch of 75 μm and can cope with both input signal polarities. This functionality allows operating with widely used silicon sensors collecting holes and CdTe sensors collecting electrons. This article describes the chip focusing on solving the issues connected to high-Z sensor material, namely high leakage currents, slow charge collection time and thick material resulting in increased charge-sharring effects. The measurements were conducted with higher X-ray energies including 17.4 keV from molybdenum. Conclusions drawn inside the paper show the UFXC32K's usability for CdTe sensors in high X-ray energy applications.

  1. Developing an Optimum Protocol for Thermoluminescence Dosimetry with GR-200 Chips using Taguchi Method.

    Science.gov (United States)

    Sadeghi, Maryam; Faghihi, Reza; Sina, Sedigheh

    2017-06-15

    Thermoluminescence dosimetry (TLD) is a powerful technique with wide applications in personal, environmental and clinical dosimetry. The optimum annealing, storage and reading protocols are very effective in accuracy of TLD response. The purpose of this study is to obtain an optimum protocol for GR-200; LiF: Mg, Cu, P, by optimizing the effective parameters, to increase the reliability of the TLD response using Taguchi method. Taguchi method has been used in this study for optimization of annealing, storage and reading protocols of the TLDs. A number of 108 GR-200 chips were divided into 27 groups, each containing four chips. The TLDs were exposed to three different doses, and stored, annealed and read out by different procedures as suggested by Taguchi Method. By comparing the signal-to-noise ratios the optimum dosimetry procedure was obtained. According to the results, the optimum values for annealing temperature (°C), Annealing Time (s), Annealing to Exposure time (d), Exposure to Readout time (d), Pre-heat Temperature (°C), Pre-heat Time (s), Heating Rate (°C/s), Maximum Temperature of Readout (°C), readout time (s) and Storage Temperature (°C) are 240, 90, 1, 2, 50, 0, 15, 240, 13 and -20, respectively. Using the optimum protocol, an efficient glow curve with low residual signals can be achieved. Using optimum protocol obtained by Taguchi method, the dosimetry can be effectively performed with great accuracy. © The Author 2016. Published by Oxford University Press. All rights reserved. For Permissions, please email: journals.permissions@oup.com.

  2. Development of a versatile readout and test system and characterization of a capacitively coupled active pixel sensor

    Energy Technology Data Exchange (ETDEWEB)

    Janssen, Jens; Gonella, Laura; Hemperek, Tomasz; Hirono, Toko; Huegging, Fabian; Krueger, Hans; Wermes, Norbert [Institute of Physics, University of Bonn, Bonn (Germany); Peric, Ivan [Karlsruher Institut fuer Technologie, Karlsruhe (Germany); Collaboration: ATLAS-Collaboration

    2015-07-01

    With the availability of high voltage and high resistivity CMOS processes, active pixel sensors are becoming increasingly interesting for radiation detection in high energy physics experiments. Although the pixel signal-to-noise ratio and the sensor radiation tolerance were improved, active pixel sensors cannot yet compete with state-of-the-art hybrid pixel detector in a high radiation environment. Hence, active pixel sensors are possible candidates for the outer tracking detector in HEP experiments where production cost plays a role. The investigation of numerous prototyping steps and different technologies is still ongoing and requires a versatile test and readout system, which will be presented in this talk. A capacitively coupled active pixel sensor fabricated in AMS 180 nm high voltage CMOS process is investigated. The sensor is designed to be glued to existing front-end pixel readout chips. Results from the characterization are presented in this talk.

  3. A High-Voltage SOI CMOS Exciter Chip for a Programmable Fluidic Processor System.

    Science.gov (United States)

    Current, K W; Yuk, K; McConaghy, C; Gascoyne, P R C; Schwartz, J A; Vykoukal, J V; Andrews, C

    2007-06-01

    A high-voltage (HV) integrated circuit has been demonstrated to transport fluidic droplet samples on programmable paths across the array of driving electrodes on its hydrophobically coated surface. This exciter chip is the engine for dielectrophoresis (DEP)-based micro-fluidic lab-on-a-chip systems, creating field excitations that inject and move fluidic droplets onto and about the manipulation surface. The architecture of this chip is expandable to arrays of N X N identical HV electrode driver circuits and electrodes. The exciter chip is programmable in several senses. The routes of multiple droplets may be set arbitrarily within the bounds of the electrode array. The electrode excitation waveform voltage amplitude, phase, and frequency may be adjusted based on the system configuration and the signal required to manipulate a particular fluid droplet composition. The voltage amplitude of the electrode excitation waveform can be set from the minimum logic level up to the maximum limit of the breakdown voltage of the fabrication technology. The frequency of the electrode excitation waveform can also be set independently of its voltage, up to a maximum depending upon the type of droplets that must be driven. The exciter chip can be coated and its oxide surface used as the droplet manipulation surface or it can be used with a top-mounted, enclosed fluidic chamber consisting of a variety of materials. The HV capability of the exciter chip allows the generated DEP forces to penetrate into the enclosed chamber region and an adjustable voltage amplitude can accommodate a variety of chamber floor thicknesses. This demonstration exciter chip has a 32 x 32 array of nominally 100 V electrode drivers that are individually programmable at each time point in the procedure to either of two phases: 0deg and 180deg with respect to the reference clock. For this demonstration chip, while operating the electrodes with a 100-V peak-to-peak periodic waveform, the maximum HV electrode

  4. Backside illuminated CMOS-TDI line scan sensor for space applications

    Science.gov (United States)

    Cohen, Omer; Ofer, Oren; Abramovich, Gil; Ben-Ari, Nimrod; Gershon, Gal; Brumer, Maya; Shay, Adi; Shamay, Yaron

    2018-05-01

    A multi-spectral backside illuminated Time Delayed Integration Radiation Hardened line scan sensor utilizing CMOS technology was designed for continuous scanning Low Earth Orbit small satellite applications. The sensor comprises a single silicon chip with 4 independent arrays of pixels where each array is arranged in 2600 columns with 64 TDI levels. A multispectral optical filter whose spectral responses per array are adjustable per system requirement is assembled at the package level. A custom 4T Pixel design provides the required readout speed, low-noise, very low dark current, and high conversion gains. A 2-phase internally controlled exposure mechanism improves the sensor's dynamic MTF. The sensor high level of integration includes on-chip 12 bit per pixel analog to digital converters, on-chip controller, and CMOS compatible voltage levels. Thus, the power consumption and the weight of the supporting electronics are reduced, and a simple electrical interface is provided. An adjustable gain provides a Full Well Capacity ranging from 150,000 electrons up to 500,000 electrons per column and an overall readout noise per column of less than 120 electrons. The imager supports line rates ranging from 50 to 10,000 lines/sec, with power consumption of less than 0.5W per array. Thus, the sensor is characterized by a high pixel rate, a high dynamic range and a very low power. To meet a Latch-up free requirement RadHard architecture and design rules were utilized. In this paper recent electrical and electro-optical measurements of the sensor's Flight Models will be presented for the first time.

  5. On-chip photonic integrated circuit structures for millimeter and terahertz wave signal generation

    NARCIS (Netherlands)

    Gordón, C.; Guzmán, R. C.; Corral, V.; Carpintero, G.; Leijtens, X.

    2015-01-01

    We present two different on-chip photonic integrated circuit (PIC) structures for continuous-wave generation of millimeter and terahertz waves, each one using a different approach. One approach is the optical heterodyne method, using an on-chip arrayed waveguide grating laser (OC-AWGL) which is

  6. Microfluidic Arrayed Lab-On-A-Chip for Electrochemical Capacitive Detection of DNA Hybridization Events.

    Science.gov (United States)

    Ben-Yoav, Hadar; Dykstra, Peter H; Bentley, William E; Ghodssi, Reza

    2017-01-01

    A microfluidic electrochemical lab-on-a-chip (LOC) device for DNA hybridization detection has been developed. The device comprises a 3 × 3 array of microelectrodes integrated with a dual layer microfluidic valved manipulation system that provides controlled and automated capabilities for high throughput analysis of microliter volume samples. The surface of the microelectrodes is functionalized with single-stranded DNA (ssDNA) probes which enable specific detection of complementary ssDNA targets. These targets are detected by a capacitive technique which measures dielectric variation at the microelectrode-electrolyte interface due to DNA hybridization events. A quantitative analysis of the hybridization events is carried out based on a sensing modeling that includes detailed analysis of energy storage and dissipation components. By calculating these components during hybridization events the device is able to demonstrate specific and dose response sensing characteristics. The developed microfluidic LOC for DNA hybridization detection offers a technology for real-time and label-free assessment of genetic markers outside of laboratory settings, such as at the point-of-care or in-field environmental monitoring.

  7. CHICSi--a compact ultra-high vacuum compatible detector system for nuclear reaction experiments at storage rings. III. readout system

    Energy Technology Data Exchange (ETDEWEB)

    Carlen, L.; Foerre, G.; Golubev, P.; Jakobsson, B. E-mail: bo.jakobsson@kosufy.lu.se; Kolozhvari, A.; Marciniewski, P.; Siwek, A.; Veldhuizen, E.J. van; Westerberg, L.; Whitlow, H.J.; Oestby, J.M

    2004-01-11

    (CHICSi) Celsius Heavy Ion Collaboration Si detector system is a high granularity, modular detector telescope array for operation around the cluster-jet target/circulating beam intersection of the CELSIUS storage ring at the The. Svedberg Laboratory in Uppsala, Sweden. It is able to provide identity and momentum vector of up to 100 charged particles and fragments from proton-nucleus and nucleus-nucleus collisions at intermediate energies, 50-1000A MeV. All detector telescopes as well as the major part of electronic readout system are placed inside the target chamber in ultra-high vacuum (UHV, 10{sup -9}-10{sup -7} Pa). This requires Very Large Scale Integrated (VLSI) microchip for the spectroscopic signal processing and the generation and transport of digital control signals. Eighteen telescopes, read out with chip-on-board technique by ceramics Mother Boards (MB) and corresponding 18 microchips are mounted on a 450x45 mm{sup 2} Grand Mother Board (GMB), processed on FR4 glass-fibre material. Each of these 28 GMB units contains a daisy-chain organisation of the VLSI chips and associated protection circuits. Analogue-to-digital conversion of the spectroscopic signals is performed on a board outside the chamber which is connected on one side to a power distribution board, directly attached to a UHV mounting flange, and on the other side to the VME-based data acquisition system (CHICSiDAQ). This in its turn is connected via a fibre-optic link to the general TSL acquisition system (SVEDAQ), and in this way data from auxiliary detector systems, read out in CAMAC mode, can be stored in coincidence with CHICSi data.

  8. CHICSi--a compact ultra-high vacuum compatible detector system for nuclear reaction experiments at storage rings. III. readout system

    International Nuclear Information System (INIS)

    Carlen, L.; Foerre, G.; Golubev, P.; Jakobsson, B.; Kolozhvari, A.; Marciniewski, P.; Siwek, A.; Veldhuizen, E.J. van; Westerberg, L.; Whitlow, H.J.; Oestby, J.M.

    2004-01-01

    (CHICSi) Celsius Heavy Ion Collaboration Si detector system is a high granularity, modular detector telescope array for operation around the cluster-jet target/circulating beam intersection of the CELSIUS storage ring at the The. Svedberg Laboratory in Uppsala, Sweden. It is able to provide identity and momentum vector of up to 100 charged particles and fragments from proton-nucleus and nucleus-nucleus collisions at intermediate energies, 50-1000A MeV. All detector telescopes as well as the major part of electronic readout system are placed inside the target chamber in ultra-high vacuum (UHV, 10 -9 -10 -7 Pa). This requires Very Large Scale Integrated (VLSI) microchip for the spectroscopic signal processing and the generation and transport of digital control signals. Eighteen telescopes, read out with chip-on-board technique by ceramics Mother Boards (MB) and corresponding 18 microchips are mounted on a 450x45 mm 2 Grand Mother Board (GMB), processed on FR4 glass-fibre material. Each of these 28 GMB units contains a daisy-chain organisation of the VLSI chips and associated protection circuits. Analogue-to-digital conversion of the spectroscopic signals is performed on a board outside the chamber which is connected on one side to a power distribution board, directly attached to a UHV mounting flange, and on the other side to the VME-based data acquisition system (CHICSiDAQ). This in its turn is connected via a fibre-optic link to the general TSL acquisition system (SVEDAQ), and in this way data from auxiliary detector systems, read out in CAMAC mode, can be stored in coincidence with CHICSi data

  9. KPiX, An Array of Self Triggered Charge Sensitive Cells Generating Digital Time and Amplitude Information

    International Nuclear Information System (INIS)

    Freytag, D.

    2008-01-01

    The Silicon Detector proposed for the International Linear Collider (ILC) requires electronic read-out that can be tightly coupled to the silicon detectors envisioned for the tracker and the electromagnetic calorimeter. The KPiX is a 1024-channel read-out chip that bump-bonds to the detector and communicates through a few digital signals, power, and detector bias. The KPiX front-end is a low-noise dual-range charge-amplifier with a dynamic range of 17 bit, achieved by autonomous switching of the feedback capacitor. The device takes advantage of the ILC duty cycle of 1 ms trains at 5 Hz rate by lowering the supply current after the data acquisition cycle for an average power consumption of <20 (micro)W/channel. During the 1 ms train, up to four events exceeding a programmable threshold can be stored, the amplitude as a voltage on a capacitor for subsequent digitization, the event time in digital format. The chip can be configured for other than ILC applications

  10. 64 x 64 thresholding photodetector array for optical pattern recognition

    Science.gov (United States)

    Langenbacher, Harry; Chao, Tien-Hsin; Shaw, Timothy; Yu, Jeffrey W.

    1993-10-01

    A high performance 32 X 32 peak detector array is introduced. This detector consists of a 32 X 32 array of thresholding photo-transistor cells, manufactured with a standard MOSIS digital 2-micron CMOS process. A built-in thresholding function that is able to perform 1024 thresholding operations in parallel strongly distinguishes this chip from available CCD detectors. This high speed detector offers responses from one to 10 milliseconds that is much higher than the commercially available CCD detectors operating at a TV frame rate. The parallel multiple peaks thresholding detection capability makes it particularly suitable for optical correlator and optoelectronically implemented neural networks. The principle of operation, circuit design and the performance characteristics are described. Experimental demonstration of correlation peak detection is also provided. Recently, we have also designed and built an advanced version of a 64 X 64 thresholding photodetector array chip. Experimental investigation of using this chip for pattern recognition is ongoing.

  11. Wideband pulse amplifiers for the NECTAr chip

    International Nuclear Information System (INIS)

    Sanuy, A.; Delagnes, E.; Gascon, D.; Sieiro, X.; Bolmont, J.; Corona, P.; Feinstein, F.; Glicenstein, J-F.; Naumann, C.L.; Nayman, P.; Ribó, M.

    2012-01-01

    The NECTAr collaboration's FE option for the camera of the CTA is a 16 bits and 1–3 GS/s sampling chip based on analog memories including most of the readout functions. This works describes the input amplifiers of the NECTAr ASIC. A fully differential wideband amplifier, with voltage gain up to 20 V/V and a BW of 400 MHz. As it is impossible to design a fully differential OpAmp with an 8 GHz GBW product in a 0.35 CMOS technology, an alternative implementation based on HF linearized transconductors is explored. The output buffer is a class AB miller operational amplifier, with special non-linear current boost.

  12. Wideband pulse amplifiers for the NECTAr chip

    Science.gov (United States)

    Sanuy, A.; Delagnes, E.; Gascon, D.; Sieiro, X.; Bolmont, J.; Corona, P.; Feinstein, F.; Glicenstein, J.-F.; Naumann, C. L.; Nayman, P.; Ribó, M.; Tavernet, J.-P.; Toussenel, F.; Vincent, P.; Vorobiov, S.

    2012-12-01

    The NECTAr collaboration's FE option for the camera of the CTA is a 16 bits and 1-3 GS/s sampling chip based on analog memories including most of the readout functions. This works describes the input amplifiers of the NECTAr ASIC. A fully differential wideband amplifier, with voltage gain up to 20 V/V and a BW of 400 MHz. As it is impossible to design a fully differential OpAmp with an 8 GHz GBW product in a 0.35 CMOS technology, an alternative implementation based on HF linearized transconductors is explored. The output buffer is a class AB miller operational amplifier, with special non-linear current boost.

  13. Depleted fully monolithic CMOS pixel detectors using a column based readout architecture for the ATLAS Inner Tracker upgrade

    Science.gov (United States)

    Wang, T.; Barbero, M.; Berdalovic, I.; Bespin, C.; Bhat, S.; Breugnon, P.; Caicedo, I.; Cardella, R.; Chen, Z.; Degerli, Y.; Egidos, N.; Godiot, S.; Guilloux, F.; Hemperek, T.; Hirono, T.; Krüger, H.; Kugathasan, T.; Hügging, F.; Marin Tobon, C. A.; Moustakas, K.; Pangaud, P.; Schwemling, P.; Pernegger, H.; Pohl, D.-L.; Rozanov, A.; Rymaszewski, P.; Snoeys, W.; Wermes, N.

    2018-03-01

    Depleted monolithic active pixel sensors (DMAPS), which exploit high voltage and/or high resistivity add-ons of modern CMOS technologies to achieve substantial depletion in the sensing volume, have proven to have high radiation tolerance towards the requirements of ATLAS in the high-luminosity LHC era. DMAPS integrating fast readout architectures are currently being developed as promising candidates for the outer pixel layers of the future ATLAS Inner Tracker, which will be installed during the phase II upgrade of ATLAS around year 2025. In this work, two DMAPS prototype designs, named LF-Monopix and TJ-Monopix, are presented. LF-Monopix was fabricated in the LFoundry 150 nm CMOS technology, and TJ-Monopix has been designed in the TowerJazz 180 nm CMOS technology. Both chips employ the same readout architecture, i.e. the column drain architecture, whereas different sensor implementation concepts are pursued. The paper makes a joint description of the two prototypes, so that their technical differences and challenges can be addressed in direct comparison. First measurement results for LF-Monopix will also be shown, demonstrating for the first time a fully functional fast readout DMAPS prototype implemented in the LFoundry technology.

  14. Multi-path interferometric Josephson directional amplifier for qubit readout

    Science.gov (United States)

    Abdo, Baleegh; Bronn, Nicholas T.; Jinka, Oblesh; Olivadese, Salvatore; Brink, Markus; Chow, Jerry M.

    2018-04-01

    We realize and characterize a quantum-limited, directional Josephson amplifier suitable for qubit readout. The device consists of two nondegenerate, three-wave-mixing amplifiers that are coupled together in an interferometric scheme, embedded in a printed circuit board. Nonreciprocity is generated by applying a phase gradient between the same-frequency pumps feeding the device, which plays the role of the magnetic field in a Faraday medium. Directional amplification and reflection-gain elimination are induced via wave interference between multiple paths in the system. We measure and discuss the main figures of merit of the device and show that the experimental results are in good agreement with theory. An improved version of this directional amplifier is expected to eliminate the need for bulky, off-chip isolation stages that generally separate quantum systems and preamplifiers in high-fidelity, quantum-nondemolition measurement setups.

  15. Modeling Charge Collection in Detector Arrays

    Science.gov (United States)

    Hardage, Donna (Technical Monitor); Pickel, J. C.

    2003-01-01

    A detector array charge collection model has been developed for use as an engineering tool to aid in the design of optical sensor missions for operation in the space radiation environment. This model is an enhancement of the prototype array charge collection model that was developed for the Next Generation Space Telescope (NGST) program. The primary enhancements were accounting for drift-assisted diffusion by Monte Carlo modeling techniques and implementing the modeling approaches in a windows-based code. The modeling is concerned with integrated charge collection within discrete pixels in the focal plane array (FPA), with high fidelity spatial resolution. It is applicable to all detector geometries including monolithc charge coupled devices (CCDs), Active Pixel Sensors (APS) and hybrid FPA geometries based on a detector array bump-bonded to a readout integrated circuit (ROIC).

  16. Collective Memory Transfers for Multi-Core Chips

    Energy Technology Data Exchange (ETDEWEB)

    Michelogiannakis, George; Williams, Alexander; Shalf, John

    2013-11-13

    Future performance improvements for microprocessors have shifted from clock frequency scaling towards increases in on-chip parallelism. Performance improvements for a wide variety of parallel applications require domain-decomposition of data arrays from a contiguous arrangement in memory to a tiled layout for on-chip L1 data caches and scratchpads. How- ever, DRAM performance suffers under the non-streaming access patterns generated by many independent cores. We propose collective memory scheduling (CMS) that actively takes control of collective memory transfers such that requests arrive in a sequential and predictable fashion to the memory controller. CMS uses the hierarchically tiled arrays formal- ism to compactly express collective operations, which greatly improves programmability over conventional prefetch or list- DMA approaches. CMS reduces application execution time by up to 32% and DRAM read power by 2.2×, compared to a baseline DMA architecture such as STI Cell.

  17. Design and Characterization of 64K Pixels Chips Working in Single Photon Processing Mode

    CERN Document Server

    Llopart Cudie, Xavier; Campbell, M

    2007-01-01

    Progress in CMOS technology and in fine pitch bump bonding has made possible the development of high granularity single photon counting detectors for X-ray imaging. This thesis studies the design and characterization of three pulse processing chips with 65536 square pixels of 55 µm x 55 µm designed in a commercial 0.25 µm 6-metal CMOS technology. The 3 chips share the same architecture and dimensions and are named Medipix2, Mpix2MXR20 and Timepix. The Medipix2 chip is a pixel detector readout chip consisting of 256 x 256 identical elements, each working in single photon counting mode for positive or negative input charge signals. The preamplifier feedback provides compensation for detector leakage current on a pixel by pixel basis. Two identical pulse height discriminators are used to define an energy window. Every event falling inside the energy window is counted with a 13 bit pseudo-random counter. The counter logic, based in a shift register, also behaves as the input/output register for the pixel. Each...

  18. The TDCpix Readout ASIC: A 75 ps Resolution Timing Front-End for the Gigatrackerof theNA62 Experiment

    Science.gov (United States)

    Rinella, G. Aglieri; Fiorini, M.; Jarron, P.; Kaplon, J.; Kluge, A.; Martin, E.; Morel, M.; Noy, M.; Perktold, L.; Poltorak, K.

    NA62 is an experiment under development at the CERN Super Proton Synchrotron, aiming at measuring ultra rare kaon decays. The Gigatracker (GTK) detector shall combine on-beam tracking of individual particles with a time resolution of 150 ps rms. The peak flow of particles crossing the detector modules reaches 1.27 MHz/mm2 fora total rateof about 0.75 GHz.Ahybrid siliconpixel detectoris beingdevelopedto meet these requirements. The pixel chip for the Gigatracker (TDCpix) is under design. The TDCpix chip will feature 1800 square pixels of 300×300 μm2 arranged in a matrix of 45 rows × 40 columns. Bump-bonded to a silicon pixel sensor it shall perform time stamping of particle hits with a timing accuracybetter than 200 ps rms and a detection efficiencyabove 99%. The chosen architecture provides full separation of the sensitive analog amplifiers of the pixel matrix from the noisy digital circuits of the TDCs and of the readout blocks. Discriminated hit signals from each pixel are transmitted to the end of column region. An array ofTime to Digital Converters (TDC) is implemented at the bottom of the pixel array. The TDCs are based on time tagging the events with the fine time codes generated by Delay Locked Loops (DLL) and have a nominal time bin of ˜100 ps. Time stamps and time-over-threshold are recorded for each discriminated hit and the correction of the discriminator's time-walk is performed off-detector. Data are continuously transmitted on four 2.4 Gb/s serial output links. Adescription of the on-going design of the final TDCpix is given in this paper. Design choices and some technical implementation details are presented. Aprototype ASIC including thekeycomponents of this architecture has been manufactured. The achievement of specification figures such as a time resolution of the processing chain of 75 ps rms as well as charged particle time stampingwitha resolutionbetterthan200psrmswere demonstratedexperimentally.Asummaryoftheseresultsisalso presented in

  19. New bi-dimensional SPAD arrays for time resolved single photon imaging

    Energy Technology Data Exchange (ETDEWEB)

    Grasso, R. [INFN-Laboratori Nazionali del Sud and Sez., INFN di Catania, Via S. Sofia 62, 95125 Catania (Italy); Dipartimento di Fisica ed Astronomia, Università di Catania, Via S. Sofia 64, 95123 Catania (Italy); Centro Siciliano di Fisica Nucleare e Struttura della Materia, Viale A. Doria 6, 95125 Catania (Italy); Tudisco, S., E-mail: tudisco@lns.infn.it [INFN-Laboratori Nazionali del Sud and Sez., INFN di Catania, Via S. Sofia 62, 95125 Catania (Italy); Centro Siciliano di Fisica Nucleare e Struttura della Materia, Viale A. Doria 6, 95125 Catania (Italy); Piemonte, C. [FBK-Fondazione Bruno Kessler, Via S. Croce 77, 38122 Trento (Italy); Lo Presti, D. [INFN-Laboratori Nazionali del Sud and Sez., INFN di Catania, Via S. Sofia 62, 95125 Catania (Italy); Dipartimento di Fisica ed Astronomia, Università di Catania, Via S. Sofia 64, 95123 Catania (Italy); Anzalone, A. [INFN-Laboratori Nazionali del Sud and Sez., INFN di Catania, Via S. Sofia 62, 95125 Catania (Italy); Musumeci, F.; Scordino, A. [INFN-Laboratori Nazionali del Sud and Sez., INFN di Catania, Via S. Sofia 62, 95125 Catania (Italy); Dipartimento di Fisica ed Astronomia, Università di Catania, Via S. Sofia 64, 95123 Catania (Italy); Serra, N.; Zorzi, N. [FBK-Fondazione Bruno Kessler, Via S. Croce 77, 38122 Trento (Italy)

    2013-08-01

    Some of the first results concerning the electrical and optical performances of new bi-dimensional single photon avalanche diodes arrays for imaging applications are briefly presented. The planned arrays were realized at the Fondazione Bruno Kessler—Trento and tested at LNS–INFN. The proposed new solution, utilizing a new architecture with integrated quenching resistors, allows to simplify the electronic readout.

  20. New bi-dimensional SPAD arrays for time resolved single photon imaging

    International Nuclear Information System (INIS)

    Grasso, R.; Tudisco, S.; Piemonte, C.; Lo Presti, D.; Anzalone, A.; Musumeci, F.; Scordino, A.; Serra, N.; Zorzi, N.

    2013-01-01

    Some of the first results concerning the electrical and optical performances of new bi-dimensional single photon avalanche diodes arrays for imaging applications are briefly presented. The planned arrays were realized at the Fondazione Bruno Kessler—Trento and tested at LNS–INFN. The proposed new solution, utilizing a new architecture with integrated quenching resistors, allows to simplify the electronic readout