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Sample records for ag-cu alloys journal

  1. Electrochemical behavior of Ag-Cu alloy in alkaline media

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    Grekulović Vesna J.

    2010-01-01

    Full Text Available Results of the investigation of electrochemical behaviour of Ag-Cu alloy containing 50 mass% Ag and 50 mass% Cu are presented in this paper. Pure silver and copper were investigated, too. Working electrodes were prepared by metallurgical process. 1 mol dm-3 and 0.5 mol dm-3 solutions of NaOH are chosen as the electrolyte. On the cyclic voltammograms, some current waves corresponding to number and quantity of phases present in the investigated electrodes appeared and they can be used for characterization of investigated alloy. On the voltammogram recorded for pure silver, two anodic and two cathodic peaks appeared. First peak consisted of two joined current waves which can be ascribed to the formation of the two different types of silver(I oxide, Ag2O. Second peak should correspond to the formation of silver(II oxide, AgO. Voltammogram obtained for pure copper exhibits one broad current wave corresponding to the formation of copper oxides, followed by a wide potential area in which copper is completely passive. At 0.4 V vs. SCE, current starts to increase again due to oxygen evolution and probably due to simultaneous dissolution of copper with formation of CuO22- as a product. In alkaline solutions copper has no significant influence on the shape and current values of the voltammograms recorded for Ag-Cu alloy; however, it has an influence only on the anodic and cathodic peak potentials, which are shifted to more negative values in comparison to Ag. It could mean an easier formation of oxides and their harder reduction. Comparing voltammograms recorded for Ag-Cu alloy in 0.5 moldm-3 NaOH and in 1 moldm-3 NaOH solutions, one can see that current waves appear at more positive potentials on the voltammograms obtained in the solution of lower concentration and with much higher current densities than those on the voltammograms obtained in the solution of higher concentration.

  2. Interfacial Reaction of Sn-Ag-Cu Lead-Free Solder Alloy on Cu: A Review

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    Liu Mei Lee

    2013-01-01

    Full Text Available This paper reviews the function and importance of Sn-Ag-Cu solder alloys in electronics industry and the interfacial reaction of Sn-Ag-Cu/Cu solder joint at various solder forms and solder reflow conditions. The Sn-Ag-Cu solder alloys are examined in bulk and in thin film. It then examines the effect of soldering conditions to the formation of intermetallic compounds such as Cu substrate selection, structural phases, morphology evolution, the growth kinetics, temperature and time is also discussed. Sn-Ag-Cu lead-free solder alloys are the most promising candidate for the replacement of Sn-Pb solders in modern microelectronic technology. Sn-Ag-Cu solders could possibly be considered and adapted in miniaturization technologies. Therefore, this paper should be of great interest to a large selection of electronics interconnect materials, reliability, processes, and assembly community.

  3. Interfacial Reaction of Sn-Ag-Cu Lead-Free Solder Alloy on Cu: A Review

    OpenAIRE

    Liu Mei Lee; Ahmad Azmin Mohamad

    2013-01-01

    This paper reviews the function and importance of Sn-Ag-Cu solder alloys in electronics industry and the interfacial reaction of Sn-Ag-Cu/Cu solder joint at various solder forms and solder reflow conditions. The Sn-Ag-Cu solder alloys are examined in bulk and in thin film. It then examines the effect of soldering conditions to the formation of intermetallic compounds such as Cu substrate selection, structural phases, morphology evolution, the growth kinetics, temperature and time is also disc...

  4. Nucleation promotion of Sn-Ag-Cu lead-free solder alloys via micro alloying

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    Mao, Jie

    Sn-Ag-Cu (SAC) alloy system is widely accepted as a viable Pb-free alternative to Sn-Pb alloys for microelectronics packaging applications. Compared with its Pb-containing predecessor SAC alloys tend to have coarse grain structure, which is believed to be caused by high undercooling prior to nucleation. This work explores the possibility of modifying the nucleation process and reducing the undercooling of SAC alloys via introducing minor alloying elements. The mechanisms through which effective alloying elements influenced the nucleation process of SAC alloys are investigated with microstructural and chemical analyses. Minor alloying elements (Mn and Zn) are found promoting beta-Sn nucleation and reducing the undercooling of SAC. Manganese promotes beta-Sn primary phase nucleation through the formation of MnSn2 intermetallic compound. Experimental results in this work support the claim by previous researchers that zinc promotes beta-Sn primary phase nucleation through the formation of zinc oxide. In addition to nucleation, this work also assesses the microstructural impact of minor elements on Sn-Ag-Cu based alloys. Methods have been developed to quantify and compare microstructural impacts of minor elements and efficiently study their partitioning behaviors. LA-ICPMS was introduced to SAC alloy application to efficiently study partitioning behaviors of minor elements.

  5. Behavior and influence of Pb and Bi in Ag-Cu-Zn brazing alloy

    Institute of Scientific and Technical Information of China (English)

    2000-01-01

    The effects of trace content of Pb and Bi elements on the spreading property and the strength of brazed joints of Ag-Cu-Zn filler metal have been studied. The results show that Pb has little effect on both above properties, and Bi has remarkable influence on the spreading property but little effect on the strength of brazed joint. Pb and Bi dissolve into the Ag-Cu-Zn matrix and will melt and gather at lower temperature when that alloy is being heated. Therefore a liquid forms on the surface of the Ag-Cu-Zn alloy and overlays the melting alloy, then keeps the filler metal away from the materials being joined, and so decreases the spreading property.

  6. Optical Limiting Properties of Ag-Cu Metal Alloy Nanoparticles Analysis by using MATLAB

    Institute of Scientific and Technical Information of China (English)

    WANG Yu-Hua; LI Hui-Qing; LU Jian-Duo; WANG Ru-Wu

    2011-01-01

    Ag-Cu alloy nanoparticles were formed by sequential ion implantation (Ag and Cu) in silica using a metal vapor vacuum arc (MEVVA) ion source.Third-order nonlinear optical properties of the nanoparticles were measured at 1064nm excitations using the Z-scan technique.Curve fitting analysis,based on the MATLAB features for Ag-Cu alloy nanoparticle optical limiting experiments,is used.The results show that Ag-Cu alloy nanoparticles display a refractive optical limiting effect at 1064 nm.Recently,increasing attention has been focused on the third-order nonlinear susceptibility and the photorefractive effect of noble-metal clusters embedded in dielectric matrices.[1-3] Third-order nonlinearities of metal/dielectric composite materials are influenced not only by the type and size of the embedded metal clusters,but also by the dielectric constant,thermal conductivity and heat capacity of the dielectric matrices.[4-6] Amongst the nanoparticles studied earlier,high nonlinear absorption and nonlinear refraction coefficients were found in copper and copper containing nanomaterials.[7,8] For silver,the nonlinear refractive index γ changes from positive to negative upon the growth of clusters.[9] Potential applications of optical limiters in the protection of sensors from intense laser pulses have motivated great efforts to design new nonlinear optical systems.[10]%Ag-Cu alloy nanoparticles were formed by sequential ion implantation (Ag and Cu) in silica using a metal vapor vacuum arc (MEVVA) ion source. Third-order nonlinear optical properties of the nanoparticles were measured at 1064 nm excitations using the Z-scan technique. Curve fitting analysis, based on the MATLAB features for Ag-Cu alloy nanoparticle optical limiting experiments, is used. The results show that Ag-Cu alloy nanoparticles display a refractive optical limiting effect at 1064 nm.

  7. Electrodeposition and characterisation of Sn-Ag-Cu solder alloys for flip-chip interconnection

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    Qin Yi [Department of Materials, Loughborough University, Leicestershire, LE11 3TU (United Kingdom); Wolfson School of Mechanical and Manufacturing Engineering, Loughborough University, Leicestershire, LE11 3TU (United Kingdom); Wilcox, G.D., E-mail: G.D.Wilcox@lboro.ac.u [Department of Materials, Loughborough University, Leicestershire, LE11 3TU (United Kingdom); Liu Changqing [Wolfson School of Mechanical and Manufacturing Engineering, Loughborough University, Leicestershire, LE11 3TU (United Kingdom)

    2010-12-15

    A pyrophosphate and iodide based bath was investigated for the electrodeposition of near-eutectic Sn-Ag-Cu alloys, which are promising lead-free solder candidates for electronics interconnection. Near-eutectic Sn-Ag-Cu electrodeposits (2.5-4.2 wt.% Ag and 0.7-1.5 wt.% Cu) were achieved from the system as measured by wavelength dispersive X-ray spectroscopy (WDS). Electroplating such near-eutectic ternary alloys at higher deposition rates was possible with the application of electrolyte agitation. Different morphologies of deposited Sn-Ag-Cu films were analysed using scanning electron microscopy (SEM). X-ray diffraction (XRD) data indicated that Sn, Ag{sub 3}Sn and Cu{sub 6}Sn{sub 5} were present in the 'as-electrodeposited' Sn-Ag-Cu film. The microstructure of the deposits and the morphology of Ag{sub 3}Sn and Cu{sub 6}Sn{sub 5} intermetallics were characterised from cross-sectional images produced from a focused ion beam scanning electron microscopy and then imaged from transmission electron microscopy (TEM) micrographs. The proposed bath proved capable of producing fine pitch near-eutectic Sn-Ag-Cu solder bumps as demonstrated on a glass test wafer.

  8. Novel PdAgCu ternary alloy: Hydrogen permeation and surface properties

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    Tarditi, Ana M.; Braun, Fernando [Instituto de Investigaciones en Catalisis y Petroquimica (FIQ, UNL-CONICET), Santiago del Estero 2829, 3000 Santa Fe (Argentina); Cornaglia, Laura M., E-mail: lmcornag@fiq.unl.edu.ar [Instituto de Investigaciones en Catalisis y Petroquimica (FIQ, UNL-CONICET), Santiago del Estero 2829, 3000 Santa Fe (Argentina)

    2011-05-15

    Dense PdAgCu ternary alloy composite membranes were synthesized by the sequential electroless plating of Pd, Ag and Cu on top of both disk and tubular porous stainless steel substrates. X-ray diffraction and scanning electron microscopy were employed to study the structure and morphology of the tested samples. The hydrogen permeation performance of these membranes was investigated over a 350-450 deg. C temperature range and a trans-membrane pressure up to 100 kPa. After annealing at 500 deg. C in hydrogen stream followed by permeation experiments, the alloy layer presented a FCC crystalline phase with a bulk concentration of 68% Pd, 7% Ag and 25% Cu as revealed by EDS. The PdAgCu tubular membrane was found to be stable during more than 300 h on hydrogen stream. The permeabilities of the PdAgCu ternary alloy samples were higher than the permeabilities of the PdCu alloy membranes with a FCC phase. The co-segregation of silver and copper to the membrane surface was observed after hydrogen permeation experiments at high temperature as determined by XPS.

  9. Microstructure evaluation of long-term aged binary Ag-Cu alloy

    OpenAIRE

    K. Labisz; Z. Rdzawski; M. Pawlyta

    2011-01-01

    Purpose: In this work there are presented microstructure investigation results of the long aged Ag-Cu alloy used for monetary production. The purpose of this work was to determine the microstructural phase changes after 30 year ageing time, with appliance of transmission electron microscopy. Mainly the possibility of spinodal decomposition process occurrence was investigated.Design/methodology/approach: The investigations were performed using optical microscopy for the microstructure determin...

  10. Study on the Correlation between Microstructure Corrosion and Wear Resistance of Ag-Cu-Ge Alloys

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    Antonio Cusma

    2015-03-01

    Full Text Available In this work, a morphological and structural characterization of a ternary Ag-Cu-Ge alloy of known composition was performed with the aim of evaluating how the passivation parameters (time and temperature influence the morphological features of the material surface. A nanomechanical characterization was performed in order to correlate the morphology and microstructure of the alloy with its tarnish, wear, and scratch resistance. It was found that the addition of germanium to the alloy not only provides the material with tarnish and fire-stain resistance, but it also improves the scratch and wear resistance owing to the formation of a dense and stable thin oxide layer.

  11. Interfacial reactions of Sn-Ag-Cu solders modified by minor Zn alloying addition

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    Kang, Sung K.; Leonard, Donovan; Shih, Da-Yuan; Gignac, Lynne; Henderson, D. W.; Cho, Sungil; Yu, Jin

    2006-03-01

    The near-ternary eutectic Sn-Ag-Cu alloys have been identified as leading Pb-free solder candidates to replace Pb-bearing solders in microelectronic applications. However, recent investigations on the processing behavior and solder joints reliability assessment have revealed several potential reliability risk factors associated with the alloy system. The formation of large Ag3Sn plates in Sn-Ag-Cu joints, especially when solidified in a relatively slow cooling rate, is one issue of concern. The implications of large Ag3Sn plates on solder joint performance and several methods to control them have been discussed in previous studies. The minor Zn addition was found to be effective in reducing the amount of undercooling required for tin solidification and thereby to suppress the formation of large Ag3Sn plates. The Zn addition also caused the changes in the bulk microstructure as well as the interfacial reaction. In this paper, an in-depth characterization of the interfacial reaction of Zn-added Sn-Ag-Cu solders on Cu and Au/Ni(P) surface finishes is reported. The effects of a Zn addition on modification of the interfacial IMCs and their growth kinetics are also discussed.

  12. Effects of cerium on Sn-Ag-Cu alloys based on finite element simulation and experiments

    Institute of Scientific and Technical Information of China (English)

    ZHANG Liang; XUE Songbai; CHEN Yan; HAN Zongjie; WANG Jianxin; YU Shenglin; LU Fangyan

    2009-01-01

    Effect of small addition of rare earth on Sn-Ag-Cu solder was investigated by finite element method based on creep model of low stress and high stress and experiments respectively. It was found that addition of rare earths evidently improved the resistance to creep deformation of the solder, so that the reliability of Sn-Ag-Cu-Ce solder joint could be improved remarkably. Mechanical testing and microstructural analysis results showed that, mechanical properties of alloys bearing Ce were better than that of the original alloy, and the optimum content of Ce was about 0.03wt.%. After aging intermetallic compound between solder joint and Cu substrate was observed and analyzed by X-ray diffraction (XRD), scanning electron micrographs (SEM) and energy dispersive X-ray fluorescence spectrometer (EDX). Results showed that the thickness of intermetallic compound layer would became thinner when the addition of Ce was about 0.03wt.%, and the grains of intermetallic compound became finer, and the microstructure was more homogeneous than that in the original Sn-Ag-Cu/Cu interface.

  13. Research on Solidification Behavior of Ag-Cu-Zn Alloys%Ag-Cu-Zn合金凝固行为的研究

    Institute of Scientific and Technical Information of China (English)

    陈永泰; 谢明; 杨有才; 张吉明; 刘满门; 王松; 王塞北; 胡洁琼; 李爱坤

    2015-01-01

    对Ag-6Cu-xZn(x=0,1,2)合金铸态显微组织、物相及凝固行为进行了研究,结果表明,Zn对Ag-Cu合金的二次枝晶间距有细化作用;Ag-6Cu-xZn合金主要由α相(富Ag固溶体相)和少量的β相(富Cu和Zn固溶体相)组成,β相弥散分布于二次枝晶间;Zn的添加降低了合金及第二相的熔化温度,且 Zn 含量越高,合金熔化温度降低趋势越大,其凝固特征是一个典型的固溶体合金的非平衡凝固过程。%The as-cast microstructure, chemical phase and solidification behavior of Ag-6Cu-xZn (x=0, 1, 2) alloys were investigated. The results indicate that, the Zn in Ag-Cu alloy could refine the secondary dendrite arm spacing, but its refining effect is limited. The Ag-Cu-Zn alloy is mainly composed ofα phase (silver-rich phase) and littleβ phase ((copper, zinc)-rich phase).βphases are dispersively distributed in secondary dendrite, they will help to improve the abrasion resistance properties of materials. Adding Zn can reduce the melting temperature of the alloy and the second phase, the higher content of Zn, the greater tendency to reduce the melting temperature of the alloy, the solidification feature of Ag-Cu-Zn alloy is a typical of non-equilibrium solidification of Solid Solution.

  14. The effect of immersion time in a benzotriazole solution on anodic behaviour of AgCu50 alloy

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    Grekulović, Vesna; Rajčić-Vujasinović, Mirjana; Stević, Zoran; id_orcid 0000-0002-1867-9360

    2016-01-01

    Electrochemical behavior of silver ,copper and AgCu50 alloy after their immersion in 0.01 mol/dm3 benzotriazole solution for 30, 360, 720 i 1440 minutes, was investigated in 0.1 mol/dm3 NaOH using the cyclic voltammetry method. Currents on cyclic voltammograms for both, pure silver, pure copper and AgCu50 alloy recorded after imemersion in the benzotriazole solution are lower than the corresponding currents obtained without the contact of the metals with BTA. During the immersion of electrode...

  15. Equivalent Activity Coefficient Phenomenon of Cerium Reacting with Lead or Bismuth in Ag, Cu and Zn Alloy

    Institute of Scientific and Technical Information of China (English)

    薛松柏; 钱乙余; 董健

    2002-01-01

    The relation between contents of cerium and impurity lead or bismuth to their activity coefficient in Ag, Cu and Zn-base alloy was calculated and analyzed by using the ternary system Chou model. The thermodynamic calculation results show that the "equivalent activity coefficient phenomenon" emerges among the activity coefficient of solute in a certain range of cerium (or at a certain point) for the Ce-Pb-X and Ce-Bi-X (X=Ag, Cu or Zn) ternary alloy system. Under this condition, the activity coefficient of solute has nothing to do with its own concentration. The preliminary theoretical analysis to this phenomenon was also made.

  16. The Effects of Adding Elements of Zinc and Magnesium on Ag-Cu Eutectic Alloy for Warming Acupuncture

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    Yu Kyoung Kim

    2013-01-01

    Full Text Available The warming acupuncture for hyperthermia therapy is made of STS304. However, its needle point cannot be reached to a desirable temperature due to heat loss caused by low thermal conductivity, and the quantification of stimulation condition and the effective standard establishment of warming acupuncture are required as a heat source. Accordingly, in this study, after Ag-Cu alloys with different composition ratios were casted and then mixed with additives to improve their physical and mechanical properties, the thermal conductivity and biocompatibility of the alloy specimens were evaluated for selecting suitable material. Ag-Cu binary alloys and ternary alloys added 5 wt% Zn or 2 wt% Mg were casted and then cold drawn to manufacture needles for acupuncture, and their physical properties, thermal conductivity, and biocompatibility were evaluated for their potential use in warming acupuncture. The results of this study showed that the physical and mechanical properties of the Ag-Cu alloys were improved by additives and that the thermal conductivity, machinability, and biocompatibility of the Ag-Cu alloys were improved by Mg addition.

  17. Effect of Cu concentration on morphology of Sn-Ag-Cu solders by mechanical alloying

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    Kao, Szu-Tsung; Duh, Jenq-Gong

    2004-12-01

    The mechanical alloying (MA) process is considered an alternative approach to produce solder materials. In this study, the effect of Cu concentration in the ternary Sn-3.5Ag-xCu (x=0.2, 0.7, and 1) solder by MA was investigated. The (Cu,Sn) solid solution was precipitated as the Cu6Sn5 intermetallic compound (IMC), which was distributed nonuniformly through the microstructure. The Cu6Sn5 IMC, which was present in the SnAgCu solder with high Cu composition, causes the as-milled MA particle to fracture to a smaller size. Appreciable distinction on morphology of as-milled MA powders with different Cu content was revealed. When the Cu concentration was low (x=0.2), MA particle aggregated to a spherical ingot with large particle size. For higher Cu concentration (x=0.7 and x=1), the MA particle turned to flakes with smaller particle size. The distinction of the milling mechanism of Sn-3.5Ag-xCu (x=0.2, 0.7, and 1) solder by the MA process was discussed. An effective approach was developed to reduce the particle size of the SnAgCu solder from 1 mm down to 10-100 µm by doping the Cu6Sn5 nanoparticle during the MA process. In addition, the differential scanning calorimetry (DSC) results also ensure the compatibility to apply the solder material for the reflow process.

  18. Creep Behavior of Lead-Free Sn-Ag-Cu + Ni-Ge Solder Alloys

    Science.gov (United States)

    Hidaka, N.; Watanabe, H.; Yoshiba, M.

    2009-05-01

    We developed a new lead-free solder alloy, an Sn-Ag-Cu base to which a small amount of Ni and Ge is added, to improve the mechanical properties of solder alloys. We examined creep deformation in bulk and through-hole (TH) form for two lead-free solder alloys, Sn-3.5Ag-0.5Cu-Ni-Ge and Sn-3.0Ag-0.5Cu, at elevated temperatures, finding that the creep rupture life of the Sn-3.5Ag-0.5Cu-Ni-Ge solder alloy was over three times better than that of the Sn-3.0Ag-0.5Cu solder at 398 K. Adding Ni to the solder appears to make microstructural development finer and more uniform. The Ni added to the solder readily combined with Cu to form stable intermetallic compounds of (Cu, Ni)6Sn5 capable of improving the creep behavior of solder alloys. Moreover, microstructural characterization based on transmission electron microscopy analyses observing creep behavior in detail showed that such particles in the Sn-3.5Ag-0.5Cu-Ni-Ge solder alloy prevent dislocation and movement.

  19. Research on Microstructure and Properties of AgCuZnNi Alloy%AgCuZnNi合金的显微组织与性能研究

    Institute of Scientific and Technical Information of China (English)

    陈永泰; 谢明; 杨有才; 张吉明; 王松; 王塞北; 胡洁琼; 李爱坤

    2015-01-01

    AgCuZnNi合金的物相以及变形过程中合金的显微组织、力恘、电恘性能进行了悁究.悁究结果表明:合金主要由富Ag固溶体以及富Cu相组成,Zn与Ni主要存在于富Cu相中.变形量较小时,基体中的富Cu相发生位移、转动和破碎,随着变形量的继恋增加,大颗粒的富Cu相先产生变形,最后全部转变为纤维组织.抗拉强度和硬度随变形量的增加而增加,是形变强化、晶界强化和纤维强化共同作用的结果.电阻率随变形量的增加而增加,晶体缺陷及界面增多是电阻率增加的主要原因.%The phase composition and microstructure, mechanical properties, electrical properties during deformation of AgCuZnNi alloy were analyzed. The results show that the AgCuZnNi alloy is mainly composed of silver-rich phase and copper-rich phase, Zn and Ni mainly exist in copper-rich phase. The displacement, rotation and broken of the copper-rich phase take place only when the deformation is small. With the increase of deformation, large particles of copper-rich phase first produce deformation, finally, all particles of copper-rich phase completely convert to fibrous tissue. Tensile strength and hardness increase with the increase of deformation, which attributed to the joint actions of deformation strengthening, grain boundary strengthening and fiber strengthening. Resistivity decreases with the increase of deformation, due to the increase of crystal defects and grain boundary.

  20. Effects of FeCo magnetic nanoparticles on microstructure of Sn-Ag-Cu alloys

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    Xu, Siyang; Habib, Ashfaque H.; Prasitthipayong, Anya; McHenry, Michael E.

    2013-05-01

    Sn-Ag-Cu (SAC) alloys have been regarded as the most promising candidates for lead-free solders in the electronic packaging industry. We prepared SAC solder-FeCo magnetic nanoparticles (MNPs) composite paste with different MNP concentration and used AC magnetic fields localized heating to cause their reflow. Differential scanning calorimetry results show a reduced undercooling of the composite paste with the addition of MNPs. Transmission electron microscope prove that the FeCo MNPs are distributed in Sn matrix of the reflowed solder composites. Optical micrographs show a decrease in the amount of primary Ag3Sn and β-Sn dendrites, and an increase in the amount of eutectic microconstituents with increasing MNPs. The addition of FeCo MNPs is considered to promote the solidification of β-Sn by providing more heterogeneous nucleation sites at a relatively low undercooling, which results in the microstructural refinement in the as-prepared solder joints.

  1. Brazing of zirconia to titanium using Ag-Cu and Au-Ni filler alloys

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    Jean S. Pimenta

    2013-12-01

    Full Text Available Advanced ceramic is usually joined to metal by the well-known direct brazing process, where costly active filler alloys can be considered a limitation. Brazing using active-metal-free filler alloy as insert between the joint components is an attempt to overcome it. The active metal diffusion from the titanium member through the bulk of molten filler to the ceramic was responsible to produce an active filler alloy in loco and promote reduction of the zirconium oxide to improve wetting on the ceramic surface. Unalloyed titanium was joined in a high-vacuum furnace (<3x10-5 mbar to yttria-tetragonal zirconia polycristals (Y-TZP and zirconia partially stabilized with magnesia (Mg-PSZ, where commercial fillers Ag-28Cu and Au-18Ni with respective thermal cycles were evaluated. Helium gas leak detection test was performed at the ceramic/metal interface at room temperature; samples from reliable vacuum tight joints were examined by microstructural analysis techniques and energy dispersive X-ray analysis at the joint cross-section. Tight joints were produced with eutectic Ag-Cu filler, revealing an intermetallic layer and a dark reaction layer near the ceramic surface; titanium diffusion was efficient for superficial chemical interactions between individual components. Brazing joints were also tested using three-point flexure testing.

  2. Kinetics of Corrosion Process in H2SO4 and HNO3 Aqueous Solutions of Lead Free Sn-Ag-Cu Solder Alloys

    OpenAIRE

    Guśpiel J.; Wierzbicka-Miernik A.; Reczyński W.

    2016-01-01

    This paper presents the results of the corrosion resistance of Sn-Ag-Cu alloys in air-saturated aqueous solutions containing NO3-, SO42- ions, whose concentration was equivalent to their contents in acid rains and in concentrations 10 - 100 times higher. The Ag, Cu and Sn concentrations in the corrosive media were determined using the Atomic Absorption Spectrometry. The specific dissolution rate and corrosion current were derived using the a rotating disc technique. The corrosion rate of Sn- ...

  3. Preparation and characterization of agar-based nanocomposite films reinforced with bimetallic (Ag-Cu) alloy nanoparticles.

    Science.gov (United States)

    Arfat, Yasir Ali; Ahmed, Jasim; Jacob, Harsha

    2017-01-02

    Agar-based active nanocomposite films were prepared by incorporating silver-copper (Ag-Cu) alloy nanoparticles (NPs) (0.5-4wt%) into glycerol plasticized agar solution. Thermo-mechanical, morphological, structural, and optical properties of the nanocomposite films were characterized by texture analyzer, differential scanning calorimetry (DSC), scanning electron microscope (SEM), X-ray diffraction (XRD), Fourier transforms infrared (FTIR) spectroscopy, and surface color measurement. Tensile strength and the melting temperature of the film increased linearly with NPs loading concentration. Color, transparency and UV barrier properties of agar films were influenced by the reinforcement of Ag-Cu NPs. XRD analysis confirmed the crystalline structure of the Agar/Ag-Cu nanocomposite films, whereas the smoothness and the homogeneity of film surface strongly reduced as observed through the SEM. The nanocomposite films exhibited a profound antibacterial activity against both Gram-positive (Listeria monocytogenes) and Gram-negative (Salmonella enterica sv typhimurium) bacteria. Overall, the agar nanocomposite films could be used as packaging material for food preservation by controlling foodborne pathogens and spoilage bacteria.

  4. Structural evolution of Ag-Cu nano-alloys confined between AlN nano-layers upon fast heating.

    Science.gov (United States)

    Janczak-Rusch, J; Chiodi, M; Cancellieri, C; Moszner, F; Hauert, R; Pigozzi, G; Jeurgens, L P H

    2015-11-14

    The structural evolution of a Ag-Cu/AlN nano-multilayer (NML), as prepared by magnetron-sputtering on a α-Al2O3 substrate, was monitored during fast heating by real-time in situ XRD analysis (at the synchrotron), as well as by ex situ microstructural analysis using SEM, XPS and in-house XRD. The as-deposited NML is constituted of alternating nano-layers (thickness ≈ 10 nm) of a chemically inert AlN barrier and a eutectic Ag-Cu(40at%) nano-alloy. The nano-alloy in the as-deposited state is composed of a fcc matrix of Ag nano-grains (≈6 nm), which are supersaturated by Cu, and some smaller embedded Cu rich nano-grains (≈4 nm). Heating up to 265 °C activates segregation of Cu out of the supersaturated Ag nano-grains phase, thus initiating phase separation. At T > 265 °C, the phase-separated Cu metal partially migrates to the top NML surface, thereby relaxing thermally-accumulated compressive stresses in the confined alloy nano-layers and facilitating grain coarsening of (still confined) phase-separated nano-crystallites. Further heating and annealing up to 420 °C results in complete phase separation, forming extended Ag and Cu domains with well-defined coherent Ag/AlN interfaces. The observed outflow of Cu well below the eutectic melting point of the bulk Ag-Cu alloy might provide new pathways for designing low-temperature nano-structured brazing materials.

  5. Influence of Surface Segregation on Wetting of Sn-Ag-Cu (SAC) Series and Pb-Containing Solder Alloys

    Science.gov (United States)

    Bozack, M. J.; Suhling, J. C.; Zhang, Y.; Cai, Z.; Lall, P.

    2011-10-01

    Wetting of Sn-Ag-Cu (SAC) series solder alloys to solid substrates is strongly influenced by surface segregation of low-level bulk impurities in the alloys. We report in situ and real-time Auger electron spectroscopy measurements of SAC alloy surface compositions as a function of temperature as the alloys are taken through the melting point. A dramatic increase in the amount of surface C (and frequently O) is observed with temperature, and in some cases the alloy surface is nearly 80 at.% C at the melting point. The C originates from low-level impurities incorporated during alloy synthesis and inhibits wetting because C acts as a blocking layer to reaction between the alloy and substrate. A similar phenomenon has been observed over a wide range of (SAC and non-SAC) alloys synthesized by a variety of techniques. That solder alloy surfaces at melting have a radically different composition from the bulk uncovers a key variable that helps to explain the wide variability in contact angles reported in previous studies of wetting and adhesion.

  6. Surface Morphology Study of Nanostructured Lead-Free Solder Alloy Sn-Ag-Cu Developed by Electrodeposition: Effect of Current Density Investigation

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    Sakinah Mohd Yusof

    2013-10-01

    Roman"; mso-bidi-theme-font:minor-bidi;} Doi: 10.12777/ijse.5.2.51-55 [How to cite this article: Yusof, S.M., Hadi, A., and Jai, J. (2013. Surface Morphology Study of Nanostructured Lead-Free Solder Alloy Sn-Ag-Cu Developed by Electrodeposition: Effect of Current Density Investigation. International Journal of Science and Engineering, 5(2:51-55. Doi: 10.12777/ijse.5.2.51-55 Prediction of Phase Formation in Nanoscale Sn-Ag-Cu Solder Alloy

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    Wu, Min; Lv, Bailin

    2016-01-01

    In a dynamic nonequilibrium process, the effective heat of formation allows the heat of formation to be calculated as a function of concentrations of the reacting atoms. In this work, we used the effective heat of formation rule to predict the formation and size of compound phases in a nanoscale Sn-Ag-Cu lead-free solder. We calculated the formation enthalpy and effective formation enthalpy of compounds in the Sn-Ag, Sn-Cu, and Ag-Cu systems by using the Miedema model and effective heat of formation. Our results show that, considering the surface effect of the nanoparticle, the effective heat of formation rule successfully predicts the phase formation and sizes of Ag3Sn and Cu6Sn5 compounds, which agrees well with experimental data.

  7. Bonding of Cf/SiC composite to Invar alloy using an active cement, Ag-Cu eutectic and Cu interlayer

    Science.gov (United States)

    Lei, Zhao; Xiaohong, Li; Jinbao, Hou; Qiang, Sun; Fuli, Zhang

    2012-10-01

    The interfacial microstructures and mechanical properties of the joints formed by active cement added brazing in vacuum of Cf/SiC composite to Invar alloy, using Ag-Cu eutectic alloy and pure copper foil as braze alloy and interlayer respectively, were investigated. CuTi, Cu4Ti3, Fe2Ti and the reaction layer of TiC and Si were the predominant components at the joint interface. The maximum shear strength of the joint was 77 MPa for brazing at 850 °C for 15 min. The results show that active cement added brazing in vacuum using Ag-Cu eutectic alloy and Cu interlayer can be used successfully for joining Cf/SiC composites to Invar alloy.

  8. Controlling Ag3Sn plate formation in near-ternary-eutectic Sn-Ag-Cu solder by minor Zn alloying

    Science.gov (United States)

    Kang, Sung K.; Shih, Da-Yuan; Leonard, Donovan; Henderson, Donald W.; Gosselin, Timothy; Cho, Sung-Il; Yu, Jin; Choi, Won K.

    2004-06-01

    As a result of extensive studies, nearternary-eutectic Sn-Ag-Cu (SAC) alloys have been identified as the leading lead-free solder candidates to replace lead-bearing solders for ball-grid array module assembly. However, recent studies revealed several potential reliability risk factors associated with the alloy system. The formation of large Ag3Sn plates in solder joints, especially when solidified at a relatively slow cooling rate, poses a reliability concern. In this study, the effect of adding a minor amount of zinc in SAC alloy was investigated. The minor zinc addition was shown to reduce the amount of undercooling during solidification and thereby suppress the formation of large Ag3Sn plates. In addition, the zinc was found to cause changes in both the microstructure and interfacial reaction of the solder joint. The interaction of zinc with other alloying elements in the solder was also investigated for a better understanding of the role of zinc during solidification of the nearternary-eutectic alloys.

  9. Localized surface plasmon behavior of Ag-Cu alloy nanoparticles stabilized by rice-starch and gelatin

    Energy Technology Data Exchange (ETDEWEB)

    Singh, Manish Kumar; Mandal, R. K., E-mail: rkmandal.met@itbhu.ac.in [Department of Metallurgical Engineering, IIT (BHU), Varanasi and DST Unit on Nanoscience and Technology, BHU, Varanasi-221 005 (India); Manda, Premkumar; Singh, A. K. [DefenceMetallurgical Research Laboratory, KanchanBagh, Hyderabad-500058 (India)

    2015-10-15

    The purpose of this communication was to understand localized surface plasmon behavior of a series of Ag-Cu alloy nanoparticles capped by rice-starch and gelatin. The structures of dried powders were investigated with the help of X-ray diffraction. The analysis revealed Ag-rich and Cu-rich phases with maximum solid solubility of Cu ∼9 atom per cent; 8 atom per cent and Ag ∼ 16 atom per cent; 14 atom per cent in rice-starch and gelatin capped samples respectively. Transmission electron microscope was used for knowing the particle size as well as to supplement FCC phase formations of Ag-rich and Cu-rich solid phases arrived at based on X-ray diffraction studies. The UV-Vis spectra of sols were examined for the formation and stability of alloy nanoparticles. The temporal evolution of LSPR curves gave us to assert that the sol is stable for more than two months. Small angle X-ray scattering in the sol state was extensively utilized to understand nature of suspensions in terms of fractals. Such a study is important for having a correlation between LSPR behaviors with those of nanoparticle dispersion in aqueous media. It is believed that this work will be a contribution to the emerging field of plasmonics that include applications in the area of photophysical processes and photochemical reactions.

  10. Comparison of Extensive Thermal Cycling Effects on Microstructure Development in Micro-alloyed Sn-Ag-Cu Solder Joints

    Energy Technology Data Exchange (ETDEWEB)

    Anderson, Iver E.; Boesenberg, Adam; Harringa, Joel; Riegner, David; Steinmetz, Andrew; Hillman, David

    2011-09-28

    Pb-free solder alloys based on the Sn-Ag-Cu (SAC) ternary eutectic have promise for widespread adoption across assembly conditions and operating environments, but enhanced microstructural control is needed. Micro-alloying with elements such as Zn was demonstrated for promoting a preferred solidification path and joint microstructure earlier in simple (Cu/Cu) solder joints studies for different cooling rates. This beneficial behavior now has been verified in reworked ball grid array (BGA) joints, using dissimilar SAC305 (Sn-3.0Ag-0.5Cu, wt.%) solder paste. After industrial assembly, BGA components joined with Sn-3.5Ag-0.74Cu-0.21Zn solder were tested in thermal cycling (-55 C/+125 C) along with baseline SAC305 BGA joints beyond 3000 cycles with continuous failure monitoring. Weibull analysis of the results demonstrated that BGA components joined with SAC + Zn/SAC305 have less joint integrity than SAC305 joints, but their lifetime is sufficient for severe applications in consumer, defense, and avionics electronic product field environments. Failure analysis of the BGA joints revealed that cracking did not deviate from the typical top area (BGA component side) of each joint, in spite of different Ag3Sn blade content. Thus, SAC + Zn solder has not shown any advantage over SAC305 solder in these thermal cycling trials, but other characteristics of SAC + Zn solder may make it more attractive for use across the full range of harsh conditions of avionics or defense applications.

  11. Crystal and electronic structure study of AgAu and AgCu bimetallic alloy thin films by X-ray techniques

    Energy Technology Data Exchange (ETDEWEB)

    Ozkendir, O. Murat, E-mail: ozkendir@gmail.com [Mersin University, Faculty of Technology, Energy Systems Engineering, Tarsus (Turkey); Mersin University, Institute of Natural Science, Department of Nanotechnology and Advanced Materials, Mersin (Turkey); Cengiz, E. [Karadeniz Technical University, Faculty of Science, Department of Physics, Trabzon (Turkey); Yalaz, E. [Mersin University, Institute of Natural Science, Department of Nanotechnology and Advanced Materials, Mersin (Turkey); Söğüt, Ö.; Ayas, D.H. [Kahramanmaraş Sütçü İmam Üniversitesi, Faculty of Science and Letters, Department of Physics, Kahramanmaraş (Turkey); Thammajak, B. Nirawat [Synchrotron Light Research Institute (Public Organisation), 111 University Avenue, T. Suranaree, A. Muang, Nakhon Ratchasima 30000 (Thailand)

    2016-05-15

    Highlights: • Crystal and electronic properties of bimetallic AgCu and AgAu alloy thin films were studied. • Both AgCu and AgAu bimetallic samples were determined to have cubic crystal geometry. • Strong influence of Cu and Au atoms on the electronic structure of the Ag atoms were determined. - Abstract: Crystal and electronic structure properties of bimetallic AgAu and AgCu alloy thin films were investigated by X-ray spectroscopic techniques. The aim of this study is to probe the influence of Au or Cu atoms on the electronic behaviors of Ag ions in bimetallic alloy materials that yields different crystal properties. To identify the mechanisms causing crystal phase transitions, study were supported by the collected EXAFS (Extended X-ray Absorption Fine Structure) data. Crystal structures of both Cu and Au doped bimetallic Ag samples were determined mainly in cubic geometry with “Fm3m” space group. Through the Ag–Au and Ag–Cu molecular interactions during bimetallic alloy formations, highly overlapped electronic levels that supports large molecular band formations were observed with different ionization states. Besides, traces of the d–d interactions in Au rich samples were determined as the main interplay in the broad molecular bond formations. The exact atomic locations and types in the samples were determined by EXAFS studies and supported by the performed calculations with FEFF scientific code.

  12. Effect of triethanolamine and heliotropin on cathodic polarization of weakly acidic baths and properties of Sn-Ag-Cu alloy electrodeposits

    Energy Technology Data Exchange (ETDEWEB)

    Zhang Jinqiu [Department of Applied Chemistry, Harbin Institute of Technology, Harbin (China); An Maozhong [Department of Applied Chemistry, Harbin Institute of Technology, Harbin (China)], E-mail: mzan@hit.edu.cn; Chang Limin; Liu Guiyuan [Department of Applied Chemistry, Harbin Institute of Technology, Harbin (China)

    2008-01-01

    The effect of triethanolamine (TEA) and heliotropin (HT) on the cathodic polarization of weakly acidic baths and the properties of Sn-Ag-Cu alloy electrodeposits were investigated. Lead-free Sn-Ag-Cu solder alloy were electrodeposited in weakly acidic baths (pH 5.5) containing Sn(CH{sub 3}SO{sub 3}){sub 2}, AgI, Cu(CH{sub 3}SO{sub 3}){sub 2}, K{sub 4}P{sub 2}O{sub 7}, KI, hydroquinone, TEA, HT and methylsulfonic acid (MSA). The cathodic polarization of baths and the properties of electrodeposits were evaluated by Liner sweep voltammetry (LSV), scanning electron microscopy (SEM), X-ray fluorescence (XRF), X-ray diffraction (XRD), Fourier transform infrared spectrometer (FT-IR) and X-ray photoelectron spectroscopy (XPS). The results indicate that HT is a main brightening agent that increases the cathodic polarization of baths and refines the grains of electrodeposits; TEA is a complexing agent for copper ions and a brightening promoter that decreases the cathodic polarization of baths and densifies the electrodeposits. The bright, compact, and smooth Sn-Ag-Cu alloy electrodeposits contain 88-95 wt% tin, 5-10 wt% silver and 0.5-2 wt% copper. Organic compounds used in the baths neither adsorb on the electrodeposits surfaces nor are included in the electrodeposits. It can be therefore concluded that the use of both TEA and HT is better than that of them either in the process of electroplating bright Sn-Ag-Cu alloy.

  13. Kinetics of Corrosion Process in H2SO4 and HNO3 Aqueous Solutions of Lead Free Sn-Ag-Cu Solder Alloys

    Directory of Open Access Journals (Sweden)

    Guśpiel J.

    2016-06-01

    Full Text Available This paper presents the results of the corrosion resistance of Sn-Ag-Cu alloys in air-saturated aqueous solutions containing NO3-, SO42- ions, whose concentration was equivalent to their contents in acid rains and in concentrations 10 - 100 times higher. The Ag, Cu and Sn concentrations in the corrosive media were determined using the Atomic Absorption Spectrometry. The specific dissolution rate and corrosion current were derived using the a rotating disc technique. The corrosion rate of Sn- Ag-Cu alloys depends on pH of the examined solutions and on the concentration of oxygen near the phase boundary. In the whole range of concentrations of the applied H2SO4 + HNO3 mixtures of acids, the pure Sn was more corrosion resistant than eutectic alloy as well as the near eutectic one, following the sequence: Sn>Sn3.66Ag0.91Cu>3.8Ag0.7Cu.

  14. Comparison of Extensive Thermal Cycling Effects on Microstructure Development in Micro-alloyed Sn-Ag-Cu Solder Joints

    Science.gov (United States)

    Anderson, Iver E.; Boesenberg, Adam; Harringa, Joel; Riegner, David; Steinmetz, Andrew; Hillman, David

    2012-02-01

    Pb-free solder alloys based on the Sn-Ag-Cu (SAC) ternary eutectic have promise for widespread adoption across assembly conditions and operating environments, but enhanced microstructural control is needed. Micro-alloying with elements such as Zn was demonstrated for promoting a preferred solidification path and joint microstructure earlier in simple (Cu/Cu) solder joints studies for different cooling rates. This beneficial behavior now has been verified in reworked ball grid array (BGA) joints, using dissimilar SAC305 (Sn-3.0Ag-0.5Cu, wt.%) solder paste. After industrial assembly, BGA components joined with Sn-3.5Ag-0.74Cu-0.21Zn solder were tested in thermal cycling (-55°C/+125°C) along with baseline SAC305 BGA joints beyond 3000 cycles with continuous failure monitoring. Weibull analysis of the results demonstrated that BGA components joined with SAC + Zn/SAC305 have less joint integrity than SAC305 joints, but their lifetime is sufficient for severe applications in consumer, defense, and avionics electronic product field environments. Failure analysis of the BGA joints revealed that cracking did not deviate from the typical top area (BGA component side) of each joint, in spite of different Ag3Sn blade content. Thus, SAC + Zn solder has not shown any advantage over SAC305 solder in these thermal cycling trials, but other characteristics of SAC + Zn solder may make it more attractive for use across the full range of harsh conditions of avionics or defense applications.

  15. In-situ synthesis of AgCu/Cu{sub 2}O nanocomposite by mechanical alloying: The effect of the processing on the thermal behavior

    Energy Technology Data Exchange (ETDEWEB)

    Gingu, Oana [University of Craiova, Department IMST, 1st Calugareni, 220037 Drobeta Turnu Severin (Romania); Rotaru, P., E-mail: protaru@central.ucv.ro [University of Craiova, Department of Physics, 13 A.I. Cuza Street, 200585 Craiova (Romania); Milea, A.; Marin, A. [Institute of Physical Chemistry “Ilie Murgulescu” of the Romanian Academy, 202 Splaiul Independentei, P.O. Box 194, 060021 Bucharest (Romania); Nicolicescu, C.; Sima, Gabriela [University of Craiova, Department IMST, 1st Calugareni, 220037 Drobeta Turnu Severin (Romania); Tanasescu, Speranta [Institute of Physical Chemistry “Ilie Murgulescu” of the Romanian Academy, 202 Splaiul Independentei, P.O. Box 194, 060021 Bucharest (Romania)

    2015-04-20

    TG heating curves for Ag–Cu samples vs. the milling time, recorded during the heating. The samples’ mass variation is strongly dependent on the powders’ specific surface, respectively the milling time. - Highlights: • AgCu bimetallic composites reinforced by Cu{sub 2}O has been studied. • The milling time influences the particle size distribution of the particles. • The thermal behavior of the mixtures has been studied by TG and DSC, in argon. • Correlation of thermal stability with thermal expansion properties was made. - Abstract: The influence of the mechanical alloying processing parameters on the elaboration of AgCu-based bimetallic matrix composites reinforced by in-situ synthesized Cu{sub 2}O has been studied. The milling time (20, 45 and 80 h) of the initial 72% mass Ag + 28% mass Cu micrometric powders mixture influences the particle size distribution of the obtained composite particles. After 80 h of mechanical alloying, AgCu/Cu{sub 2}O nanoparticles of 60–80 nm are obtained and their chemical composition at bulk/surface level has been determined by X-ray diffraction and photoelectron spectroscopy. The effect of milling time on the thermal behavior of the powders samples has been studied by thermogravimetry and differential scanning calorimetry measurements in argon atmosphere. The argon chemosorbtive reaction from the particles surface has been identified and the binding energy (0.9–1.99 eV) has been calculated. The isothermal drop calorimetry and the linear thermal expansion measurements were used to evaluate the correlation between thermal stability and thermal expansion properties of the in-situ synthesized AgCu/Cu{sub 2}O nanocomposite.

  16. Short-range Ferromagnetism in Alloy Ribbons of Fe-Cr-Si-Nb-(Ag, Cu)

    DEFF Research Database (Denmark)

    Thanh, P. Q.; Hoa, N. Q.; Chau, N.;

    2014-01-01

    We have studied the magnetic properties of two amorphous alloy ribbons Fe72Cr6Si4Nb5B12Ag1 (FCSNB-Ag) and Fe72Cr6Si4Nb5B12Cu1 (FCSNB-Cu), prepared by using a melt-spinning technique. Magnetization (M) measurements for various temperatures (T) and magnetic fields (H) indicate that ferromagnetic...

  17. Thermal Analysis of the Sn-Ag-Cu-In Solder Alloy

    DEFF Research Database (Denmark)

    Sopousek, J.; Palcut, Marián; Hodúlová, Erika

    2010-01-01

    The tin-based alloy Sn-1.5Ag-0.7Cu-9.5In (composition in wt.%) is a potential candidate for lead-free soldering at temperatures close to 200°C due to the significant amount of indium. Samples of Sn-1.5Ag-0.7Cu-9.5In were prepared by controlled melting of the pure elements, followed by quenching...

  18. Interfacial reactions and compound formation of Sn-Ag-Cu solders by mechanical alloying on electroless Ni-P/Cu under bump metallization

    Science.gov (United States)

    Kao, Szu-Tsung; Duh, Jenq-Gong

    2005-08-01

    Electroless Ni-P under bump metallization (UBM) has been widely used in electronic interconnections due to the good diffusion barrier between Cu and solder. In this study, the mechanical alloying (MA) process was applied to produce the SnAgCu lead-free solder pastes. Solder joints after annealing at 240°C for 15 min were employed to investigate the evolution of interfacial reaction between electroless Ni-P/Cu UBM and SnAgCu solder with various Cu concentrations ranging from 0.2 to 1.0 wt.%. After detailed quantitative analysis with an electron probe microanalyzer, the effect of Cu content on the formation of intermetallic compounds (IMCs) at SnAgCu solder/electroless Ni-P interface was evaluated. When the Cu concentration in the solder was 0.2 wt.%, only one (Ni, Cu)3Sn4 layer was observed at the solder/electroless Ni-P interface. As the Cu content increased to 0.5 wt.%, (Cu, Ni)6Sn5 formed along with (Ni, Cu)3Sn4. However, only one (Cu, Ni)6Sn5 layer was revealed, if the Cu content was up to 1 wt.%. With the aid of microstructure evolution, quantitative analysis, and elemental distribution by x-ray color mapping, the presence of the Ni-Sn-P phase and P-rich layer was evidenced.

  19. Development of Sn-Ag-Cu-X Solders for Electronic Assembly by Micro-Alloying with Al

    Science.gov (United States)

    Boesenberg, Adam J.; Anderson, Iver E.; Harringa, Joel L.

    2012-07-01

    Of Pb-free solder choices, an array of solder alloys based on the Sn-Ag-Cu (SAC) ternary eutectic ( T eut = 217°C) composition have emerged with potential for broad use, including ball grid array (BGA) joints that cool slowly. This work investigated minor substitutional additions of Al (solders to promote more consistent solder joint microstructures and to avoid deleterious product phases, e.g., Ag3Sn "blades," for BGA cooling rates, since such Al additions to SAC had already demonstrated excellent thermal aging stability. Consistent with past work, blade formation was suppressed for increased Al content (>0.05Al), but the suppression effect faded for >0.20Al. Undercooling suppression did not correlate specifically with blade suppression since it became significant at 0.10Al and increased continuously with greater Al to 0.25Al. Surprisingly, an intermediate range of Al content (0.10 wt.% to 0.20 wt.% Al) promoted formation of significant populations of 2- μm to 5- μm faceted Cu-Al particles, identified as Cu33Al17, that clustered at the top of the solder joint matrix and exhibited extraordinary hardness. Clustering of Cu33Al17 was attributed to its buoyancy, from a lower density than Sn liquid, and its early position in the nucleation sequence within the solder matrix, permitting unrestricted migration to the top interface. Joint microstructures and implications for the full nucleation sequence for these SAC + Al solder joints are discussed, along with possible benefits from the clustered particles for improved thermal cycling resistance.

  1. Short-range ferromagnetism in alloy ribbons of Fe-Cr-Si-Nb-(Ag, Cu)

    Energy Technology Data Exchange (ETDEWEB)

    THANH, P. Q.; HOA, N. Q.; CHAU, N. [Vietnam National University, Hanoi (Viet Nam); HUU, C. X. [Danang University of Technology, Danang (Viet Nam); NGO, D. T. [Technical University of Denmark, Kgs. Lyngby (Denmark); PHAN, T. L. [Chungbuk National University, Cheongju (Korea, Republic of)

    2014-04-15

    We have studied the magnetic properties of two amorphous alloy ribbons Fe{sub 72}Cr{sub 6}Si{sub 4}Nb{sub 5}B{sub 12}Ag{sub 1} (FCSNB-Ag) and Fe{sub 72}Cr{sub 6}Si{sub 4}Nb{sub 5}B{sub 12}Cu{sub 1} (FCSNB-Cu), prepared by using a melt-spinning technique. Magnetization (M) measurements for various temperatures (T) and magnetic fields (H) indicate that ferromagnetic-paramagnetic (FM-PM) phase transitions take place in FCSNB-Ag and FCSNB-Cu at Curie temperatures (T{sub C} ) of about 308.3 K and 322.5 K, respectively. Analyses of M - H data at different temperatures in the vicinity of the FM-PM phase transition based on the modified Arrott plot method and scaling hypothesis yielded the exponent values of β = 0.369 ± 0.005, γ = 1.359 ± 0.005 and δ = 4.7 ± 0.1 for FCSNB-Ag, and β = 0.376 ± 0.002, γ = 1.315 ± 0.006 and δ = 4.5 ± 0.1 for FCSNB-Cu. Compared with the values from theoretical models, these values are close to those expected for the 3D Heisenberg model, demonstrating the existence of short-range FM order in the amorphous alloy ribbons.

  2. Infrared Brazing of Ti50Ni50 Shape Memory Alloy and Inconel 600 Alloy with Two Ag-Cu-Ti Active Braze Alloys

    Science.gov (United States)

    Shiue, Ren-Kae; Wu, Shyi-Kaan; Yang, Sheng-Hao

    2017-02-01

    Infrared brazing of Ti50Ni50 SMA and Inconel 600 alloy using Cusil-ABA and Ticusil filler metals has been investigated. The joints were dominated by Ag-Cu eutectic with proeutectic Cu in the Cusil-ABA brazed joint and with proeutectic Ag in the Ticusil one. A continuous curved belt composed of a Ni3Ti layer and a (Cu x Ni1- x )2Ti layer formed in the brazed Ti50Ni50/Ticusil/Inconel 600 joint. On the Ti50Ni50 SMA side, an intermetallic layer of (Cu x Ni1- x )2Ti formed in all joints, with x values around 0.81 and 0.47. Layers of (Cu x Ni1- x )2Ti, Ni3Ti, and mixed Ni3Ti and Ni2Cr intermetallics were observed next to the Inconel 600 substrate in the brazed Ti50Ni50/Cusil-ABA/Inconel 600 joint. The maximum shear strengths of the joints using the Cusil-ABA filler metal and the Ticusil filler metal were 324 and 300 MPa, respectively. In the Cusil-ABA brazed joint, cracks with cleavage-dominated fracture propagated along the (Cu x Ni1- x )2Ti interfacial layer next to the Ti50Ni50 SMA substrate. In the Ticusil brazed joint, ductile dimple fracture occurred in the Ag-rich matrix near the Inconel 600 alloy substrate. The absence of a detrimental Ti-Fe-(Cu) layer on the Inconel 600 substrate side can effectively improve the shear strength of the joint.

  3. Ternary eutectic growth of Ag-Cu-Sb alloy within ultrasonic field

    Institute of Scientific and Technical Information of China (English)

    2007-01-01

    The liquid to solid transformation of ternary Ag42.4Cu21.6Sb36 eutectic alloy was ac- complished in an ultrasonic field with a frequency of 35 kHz, and the growth mechanism of this ternary eutectic was examined. Theoretical calculations predict that the sound intensity in the liquid phase at the solidification interface increases gradually as the interface moves up from the sample bottom to its top. The growth mode of (ε + θ + Sb) ternary eutectic exhibits a transition of "divorced eutectic— mixture of anomalous and regular structures—regular eutectic" along the sample axis due to the inhomogeneity of sound field distribution. In the top zone with the highest sound intensity, the cavitation effect promotes the three eutectic phases to nucleate independently, while the acoustic streaming efficiently suppresses the coupled growth of eutectic phases. In the meantime, the ultrasonic field accelerates the solute transportation at the solid-liquid interface, which reduces the solute solubility of eutectic phases.

  4. Ternary eutectic growth of Ag-Cu-Sb alloy within ultrasonic field

    Institute of Scientific and Technical Information of China (English)

    ZHAI Wei; HONG ZhenYu; WEI BingBo

    2007-01-01

    The liquid to solid transformation of ternary Ag42.4Cu21.6Sb36 eutectic alloy was accomplished in an ultrasonic field with a frequency of 35 kHz, and the growth mechanism of this ternary eutectic was examined. Theoretical calculations predict that the sound intensity in the liquid phase at the solidification interface increases gradually as the interface moves up from the sample bottom to its top. The growth mode of (ε + θ + Sb) ternary eutectic exhibits a transition of "divorced eutectic- mixture of anomalous and regular structures-regular eutectic" along the sample axis due to the inhomogeneity of sound field distribution. In the top zone with the highest sound intensity, the cavitation effect promotes the three eutectic phases to nucleate independently, while the acoustic streaming efficiently suppresses the coupled growth of eutectic phases. In the meantime, the ultrasonic field accelerates the solute transportation at the solid-liquid interface, which reduces the solute solubility of eutectic phases.

  5. Isothermal Fatigue Behavior of the Near-Eutectic Sn-Ag-Cu Alloy between -25°C and 125°C

    Science.gov (United States)

    Korhonen, Tia-Marje K.; Lehman, Lawrence P.; Korhonen, Matt A.; Henderson, Donald W.

    2007-02-01

    When near-eutectic Sn-Ag-Cu (SAC) alloys are used to make soldered ball-grid-array (BGA) assemblies, the grain size of the joints is very large. During thermomechanical cycling, the solder joint fatigue process is often initiated with recrystallization of the Sn grains, resulting in a smaller grain size in the deformed areas. Grain boundary sliding and increased grain boundary diffusion then results in intergranular crack nucleation and propagation along the recrystallized Sn grain boundaries. In this work, fatigue tests were used to study the initial stages of cyclic deformation damage in Sn-Ag-Cu alloy samples. To separate the solder properties from the constraints introduced by the substrate, the tests were done with free-standing solder specimens, instead of solder joints. The test samples were cast dog-bone specimens that have a cross-sectional diameter of 1 mm, which corresponds to a typical solder joint diameter in BGAs. Mechanical cycling was performed isothermally at several temperatures, from -25°C to 125°C. Typical test conditions were ± 1.5% strain and 15-minute hold at tensile peak stress to allow stress relaxation to take place. Optical microscopy, scanning electron microscopy, and electron backscattering diffraction were used to study the microstructures of the samples before and after fatigue testing in order to obtain insight into the nucleation and growth mechanisms of fatigue damage.

  6. Inhibiting the growth of Cu3Sn and Kirkendall voids in the Cu/Sn-Ag-Cu system by minor Pd alloying

    Science.gov (United States)

    Ho, Cheng En; Kuo, Tsai Tung; Wang, Chun Chien; Wu, Wei Hsiang

    2012-10-01

    In this study, the metallurgical reaction between Cu substrates (electrolytic type) and a Sn3Ag0.5Cu-xPd alloy at 180°C was examined using a scanning electron microscope (SEM), electron probe microanalyzer (EPMA), focused ion beam (FIB) microscope, and transmission electron microscope (TEM). The results showed that the growth of Cu3Sn in the Cu/Sn-Ag-Cu solder joints was substantially suppressed by doping with a minor quantity of Pd (0.1-0.7 wt. %) in the solder alloy. The sluggish growth of Cu3Sn reduced the formation of Kirkendall voids at the Cu/Cu3Sn interface and significantly improved the mechanical reliability of the joint interface. It was argued that a minor addition of Pd into the solder stabilized the Cu6Sn5 phase and enlarged the interdiffusion coefficient of Cu6Sn5 but diminished that of the neighboring phase (Cu3Sn), thereby decreasing the Kirkendall effect in the Cu/Sn-Ag-Cu reactive system.

  7. Phase-dependent corrosion of titanium-to-stainless steel joints brazed by Ag-Cu eutectic alloy filler and Ag interlayer

    Science.gov (United States)

    Lee, M. K.; Park, J. J.; Lee, J. G.; Rhee, C. K.

    2013-08-01

    The electrochemical corrosion properties of Ti-STS dissimilar joints brazed by a 72Ag-28Cu alloy filler and an Ag interlayer were studied in a 3.5% NaCl solution using potentiodynamic polarization and ac impedance spectroscopy. For a joint with a layered structure of Ti(base)/TiAg/Ag solid solution/Ag-Cu eutectic/STS(base), galvanic corrosion mostly occurred in the TiAg phase with a severe material loss, indicating that the TiAg layer acted as an anode in the galvanic couple in the layered joint. The Ag-rich solid solution layer was also corroded to a certain extent, but the corrosion in this layer was dominated by the selective pitting corrosion of the eutectic Cu-rich phase. With an increase in the brazing temperature, the Cu-rich phases disappeared owing to the enhanced isothermal solidification effect, leading to an improvement of the corrosion resistance.

  8. Nucleation and Growth of Cu-Al Intermetallics in Al-Modified Sn-Cu and Sn-Ag-Cu Lead-Free Solder Alloys

    Science.gov (United States)

    Reeve, Kathlene N.; Anderson, Iver E.; Handwerker, Carol A.

    2015-03-01

    Lead-free solder alloys Sn-Cu (SC) and Sn-Ag-Cu (SAC) are widely used by the microelectronics industry, but enhanced control of the microstructure is needed to improve solder performance. For such control, nucleation and stability of Cu-Al intermetallic compound (IMC) solidification catalysts were investigated by variation of the Cu (0.7-3.0 wt.%) and Al (0.0-0.4 wt.%) content of SC + Al and SAC + Al alloys, and of SAC + Al ball-grid array (BGA) solder joints. All of the Al-modified alloys produced Cu-Al IMC particles with different morphologies and phases (occasionally non-equilibrium phases). A trend of increasing Cu-Al IMC volume fraction with increasing Al content was established. Because of solidification of non-equilibrium phases in wire alloy structures, differential scanning calorimetry (DSC) experiments revealed delayed, non-equilibrium melting at high temperatures related to quenched-in Cu-Al phases; a final liquidus of 960-1200°C was recorded. During cooling from 1200°C, the DSC samples had the solidification behavior expected from thermodynamic equilibrium calculations. Solidification of the ternary alloys commenced with formation of ternary β and Cu-Al δ phases at 450-550°C; this was followed by β-Sn, and, finally, Cu6Sn5 and Cu-Al γ1. Because of the presence of the retained, high-temperature phases in the alloys, particle size and volume fraction of the room temperature Cu-Al IMC phases were observed to increase when the alloy casting temperature was reduced from 1200°C to 800°C, even though both temperatures are above the calculated liquidus temperature of the alloys. Preliminary electron backscatter diffraction results seemed to show Sn grain refinement in the SAC + Al BGA alloy.

  9. Microstructure and mechanical properties of joints in sintered SiC fiber-bonded ceramics brazed with Ag Cu Ti alloy

    Energy Technology Data Exchange (ETDEWEB)

    Singh, Mrityunjay [NASA-Glenn Research Center, Cleveland; Asthana, Rajiv [University of Wisconsin-Stout, Menomonie; Ishikawa, Toshihiro [Ube Industries, Ltd.; Matsunaga, Tadashi [Ube Industries, Ltd.; Lin, Hua-Tay [ORNL

    2012-01-01

    Active metal brazing of a new high thermal conductivity sintered SiC-polycrystalline fiber-bonded ceramic (SA-Tyrannohexs) has been carried out using a Ti-containing Ag Cu active braze alloy (Cusil-ABAs). The brazed composite joints were characterized using scanning electron microscopy coupled with energy-dispersive X-ray spectrometry (SEM EDS). The results show that this material can be successfully joined using judiciously selected off-the shelf active braze alloys to yield metallurgically sound joints possessing high integrity. Uniform and continuous joints were obtained irrespective of differences in the fiber orientation in the substrate material. Detailed interfacial microanalysis showed that the titanium reacts with C and Si to form TiC layer and a Ti Si compound, respectively. Furthermore, the evaluation of shear strength of the joints was also conducted at ambient and elevated temperatures in air using the single-lap offset (SLO) shear test. The perpendicular-type SA-Tyrannohex joints exhibited apparent shear strengths of about 42 MPa and 25 MPa at 650 1C and 750 1C, respectively. The fracture at the higher temperature occurred at the interface between the reactionformed TiC layer and braze. This might be caused by generation of stress intensity when a shear stress was applied, according to m-FEA simulation results.

  10. Age-hardenability and related microstructural changes during and after phase transformation in an Au-Ag-Cu-based dental alloy

    Directory of Open Access Journals (Sweden)

    Hyung-Il Kim

    2013-02-01

    Full Text Available The aim of this study was to clarify how the microstructural changes during and after phase transformation determine the age-hardenability of an Au-Ag-Cu-based dental alloy. The rapid increase in hardness in the initial stage was the result of rapid atomic diffusion by spinodal decomposition into metastable Ag-rich' and Cu-rich' phases. The constant hardening after apparent initial hardening was the result of a subsequent transformation of the metastable Ag-rich' and Cu-rich' phases to the stable Ag-rich α1phase and AuCu I phase through the metastable AuCu I' phase. During the increase in hardness, fine block-like structure with high coherency formed in the grain interior, which changed to a fine cross-hatched structure. A relatively coarse lamellar structure composed of Ag-rich α1and AuCu I phases grew from the grain boundaries, initiating softening before the grain interior reached its maximum hardness. As a result, the spinodal decomposition attributed to rapid hardening by forming the fine block-like structure, and the subsequent ordering into AuCu I, which is a famous hardening mechanism, weakened its hardening effect by accelerating the lamellar-forming grain boundary reaction.

  11. Age-hardenability and related microstructural changes during and after phase transformation in an Au-Ag-Cu-based dental alloy

    Directory of Open Access Journals (Sweden)

    Hyung-Il Kim

    2012-01-01

    Full Text Available The aim of this study was to clarify how the microstructural changes during and after phase transformation determine the age-hardenability of an Au-Ag-Cu-based dental alloy. The rapid increase in hardness in the initial stage was the result of rapid atomic diffusion by spinodal decomposition into metastable Ag-rich' and Cu-rich' phases. The constant hardening after apparent initial hardening was the result of a subsequent transformation of the metastable Ag-rich' and Cu-rich' phases to the stable Ag-rich α1phase and AuCu I phase through the metastable AuCu I' phase. During the increase in hardness, fine block-like structure with high coherency formed in the grain interior, which changed to a fine cross-hatched structure. A relatively coarse lamellar structure composed of Ag-rich α1and AuCu I phases grew from the grain boundaries, initiating softening before the grain interior reached its maximum hardness. As a result, the spinodal decomposition attributed to rapid hardening by forming the fine block-like structure, and the subsequent ordering into AuCu I, which is a famous hardening mechanism, weakened its hardening effect by accelerating the lamellar-forming grain boundary reaction.

  12. Thermodynamic calculation and evaluation for Sn-Ag-Cu-Ce lead-free solder alloy system%Sn-Ag-Cu-Ce无铅钎料合金体系的热力学计算及预测

    Institute of Scientific and Technical Information of China (English)

    薛松柏; 陈燕; 吕晓春

    2005-01-01

    利用周模型对Sn-Ag-Cu-Ce无铅钎料合金体系进行了热力学计算预测.热力学计算结果表明,Ag、Cu含量(质量分数)分别为0.5%~4.5%时,当Ce的含量(质量分数)超过0.05%时,体系达到化学平衡状态;当Ce的含量(质量分数)达到0.6%左右时,Sn、Ag、Cu分别都出现了"等活度系数"现象.这一研究结果可为无铅钎料合金的成分设计提供理论指导.

  13. Microstructural evolution and tensile properties of Sn-Ag-Cu mixed with Sn-Pb solder alloys

    Energy Technology Data Exchange (ETDEWEB)

    Wang Fengjiang [Department of Materials Science and Engineering and Materials Research Center, Missouri University of Science and Technology, Rolla, MO 65401 (United States); O' Keefe, Matthew [Department of Materials Science and Engineering and Materials Research Center, Missouri University of Science and Technology, Rolla, MO 65401 (United States)], E-mail: mjokeefe@mst.edu; Brinkmeyer, Brandon [Department of Materials Science and Engineering and Materials Research Center, Missouri University of Science and Technology, Rolla, MO 65401 (United States)

    2009-05-27

    The effect of incorporating eutectic Sn-Pb solder with Sn-3.0Ag-0.5Cu (SAC) Pb-free solder on the microstructure and tensile properties of the mixed alloys was investigated. Alloys containing 100, 75, 50, 25, 20, 15, 10, 5 and 0 wt% SAC, with the balance being Sn-37Pb eutectic solder alloy, were prepared and characterized. Optical and scanning electron microscopy were used to analyze the microstructures while 'mini-tensile' test specimens were fabricated and tested to determine mechanical properties at the mm length scale, more closely matching that of the solder joints. Microstructural analysis indicated that a Pb-rich phase formed and was uniformly distributed at the boundary between the Sn-rich grains or between the Sn-rich and the intermetallic compounds in the solder. Tensile results showed that mixing of the alloys resulted in an increase in both the yield and the ultimate tensile strength compared to the original solders, with the 50% SAC-50% Sn-Pb mixture having the highest measured strength. Initial investigations indicate the formation and distribution of a Pb-rich phase in the mixed solder alloys as the source of the strengthening mechanism.

  14. In Situ Scanning Electron Microscopy Observation of Tensile Deformation in Sn-Ag-Cu Alloys Containing Rare-Earth Elements

    Science.gov (United States)

    Xiao, Wei Min; Shi, Yao Wu; Lei, Yong Ping; Xia, Zhi Dong; Guo, Fu

    2008-11-01

    The effects of rare-earth (RE) element additions on the tensile deformation mechanism of the Sn-3.8Ag-0.7Cu solder alloy have been investigated. The results show that adding RE elements can remarkably improve the tensile strength and elongation of the Sn-3.8Ag-0.7Cu alloy. The increase in the mechanical properties are attributed to the constraints of microcrack growth and grain boundary sliding in the eutectic phase as well as the relaxation of stress concentration in the β-Sn phase due to the addition of the RE elements. It is considered that the RE elements strengthen the eutectic phase and increase the deformation resistance of this alloy.

  15. 添加Zn对AgCu钎料在TiC金属陶瓷表面润湿性的影响%Influence of Zn addition on wettability of AgCu brazing alloy on TiC cermet

    Institute of Scientific and Technical Information of China (English)

    雷敏; 张丽霞; 李宏伟; 冯吉才

    2012-01-01

    Wetting experiments of AgCu eutectic brazing alloy and AgCuZn brazing alloy with 30wt.% Zn addition were performed on TiC cermet.Based on observation of wetting angles of the two brazing alloys on the cermet and interfacial microstructure,it is found that wettability of brazing alloy on TiC cermet is greatly improved by Zn addition.When AgCu brazing alloy was adopted,the microstructure was Ag(s.s)+Cu(s.s)/(Cu,Ni)+Ag(s.s)/TiC cermet+Ag(s.s)+Cu(s.s)/TiC cermet from the near exterior surface of the alloy to the cermet.However,when Zn was added into AgCu brazing alloy,the microstructure was Ag(s.s)+Cu(s.s)+(Cu,Ni)/Ag(s.s)+Cu(s.s)/(Cu,Ni)/TiC cermet+Ag(s.s)+ Cu(s.s)/TiC cermet.And it's shown that evaporation of Zn in the vacuum improves dissolution and diffusion of Ni at the interface and the wetting angle of the brazing alloy on the cermet decreases from 120.6° to 33.9°.%分别采用AgCu共晶钎料和AgCu共晶钎料中添加30%(质量分数)Zn的AgCuZn钎料在TiC金属陶瓷表面进行润湿试验.结果表明,Zn元素的添加显著改善了钎料在TiC金属陶瓷表面的润湿性;AgCu钎料润湿TiC金属陶瓷时,从近钎料外表面到钎料/陶瓷界面,组织依次为Ag(s.s)+Cu(s.s)/(Cu,Ni)+Ag(s.s)/TiC金属陶瓷+Ag(s.s)+Cu(s.s)/TiC金属陶瓷;而采用AgCuZn钎料润湿TiC金属陶瓷后,从近钎料外表面到钎料/陶瓷界面,组织依次为Ag(s.s)+Cu(s.s)+(Cu,Ni)/Ag(s.s)+Cu(s.s)/(Cu,Ni)/TiC金属陶瓷+Ag(s.s)+Cu(s.s)/TiC金属陶瓷.Zn元素在真空中挥发促进了界面处Ni原子的溶解和扩散,使钎料在陶瓷表面的润湿角由120.6°减小到33.9°.

  16. The effect of micro alloying on the microstructure evolution of Sn-Ag-Cu lead-free solder

    Science.gov (United States)

    Werden, Jesse

    The microelectronics industry is required to obtain alternative Pb-free soldering materials due to legal, environmental, and technological factors. As a joining material, solder provides an electrical and mechanical support in electronic assemblies and therefore, the properties of the solder are crucial to the durability and reliability of the solder joint and the function of the electronic device. One major concern with new Pb-free alternatives is that the microstructure is prone to microstructural coarsening over time which leads to inconsistent properties over the device's lifetime. Power aging the solder is a common method of stabilizing the microstructure for Pb-based alloys, however, it is unclear if this will be an appropriate solution to the microstructural coarsening of Pb-free solders. The goal of this work is to develop a better understanding of the coarsening process in new solder alloys and to suggest methods of stabilizing the solder microstructure. Microalloying is one potential solution to the microstructural coarsening problem. This experiment consists of a microstructural coarsening study of SAC305 in which each sample has been alloyed with one of three different solutes, directionally solidified at 100microm/s, and then aged at three different temperatures over a total period of 20 days. There are several important conclusions from this experiment. First, the coarsening kinetics of the intermetallics in the ternary eutectic follow the Ostwald ripening model where r3 in proprotional to t for each alloying constituent. Second, the activation energy for coarsening was found to be 68.1+/-10.3 kJ/mol for the SAC305 samples, Zn had the most significant increase in the activation energy increasing it to 88.8+/-34.9 kJ/mol for the SAC+Zn samples, Mn also increased the activation energy to 83.2+/-20.8 kJ/mol for the SAC+Mn samples, and Sb decreased the activation energy to 48.0+/-3.59 kJ/mol for the SAC+Sb samples. Finally, it was found that the

  17. Effect of cerium on microstructure and mechanical properties of Sn-Ag-Cu system lead-free solder alloys

    Institute of Scientific and Technical Information of China (English)

    2007-01-01

    The melting point, spreading property, mechanical properties and microstructures of Sn-3.0Ag-2.8Cu solder alloys added with micro-variable-Ce were studied by means of optical microscopy, scanning electron microscopy(SEM) and energy dispersive X-ray(EDX). The results indicate that the melting point of Sn-3.0Ag-2.8Cu solder is enhanced by Ce addition; a small amount of Ce will remarkably prolong the creep-tupture life of Sn-3.0Ag-2.8Cu solder joint at room temperature, especially when the content of Ce is 0.1%, the creep-rupture life will be 9 times or more than that of the solder joint without Ce addition; the elongation of Sn-3.0Ag-2.gCu solder is also obviously improved even up to 15.7%. In sum, the optimum content of Ce is within 0.05%-0.1%.

  18. Technical study on Ag-Cu based medium temperature solder prepared by mechanical alloying method%机械合金化法制备Ag-Cu基中温合金钎料工艺研究

    Institute of Scientific and Technical Information of China (English)

    郑苗; 刘薇; 王晓蓉; 陈融; 王天根; 沈杭燕

    2016-01-01

    为研究机械合金化法制备Ag-Cu中温合金钎料的工艺过程,系统分析了球磨工艺参数对合金焊粉粒度及形貌演变的影响,确定了机械合金化制备球磨焊粉的优化工艺参数.采用X射线衍射仪(XRD)、扫描电镜(SEM)和差示扫描量热分析仪(DSC)等分析手段,对合金化过程中物相变化、微观结构及熔化特性进行了表征,并在此基础上进行了Ag-Cu基三元和四元焊粉机械合金化的研究.结果表明:Ag-Cu系合金焊粉经优化工艺(球料比20:1,转速400 r/min,无水乙醇作为工艺控制剂,球磨40 h)球磨后,合金化完全,以过饱和固溶体为基体相;不同组元的添加对于焊粉尺寸形貌和相结构的影响不同.Ag-Cu-10Sn粉末在球磨40 h后生成了以亚稳态的过饱和固溶体Ag(Cu)为主要组成相的合金粉,其金相组织细小均匀,与不锈钢基板之间形成过渡层,有利于增加接头强度.这表明,通过控制球磨工艺和多组元的添加,可改变合金粉末的形貌和相结构,能得到过饱和固溶体为主要组成相的钎料合金,有利于改善钎料的性能.%To study the preparation process of the medium temperature solder powders using mechanical alloying method, the effects of ball-milling parameters on the size and morphology evolution of the powders were systematic studied and optimized. The phase compositions, microstructure and melting properties of the powders were characterized by X-ray diffraction ( XRD ) , scanning electron microscopy ( SEM ) and differential scanning calorimetry (DSC) methods. The mechanical alloying of ternary and quaternary solder powders based on Ag-Cu was also carried out. The results show that Ag-Cu system solder powders can be completely alloyed with the optimized ball-milling parameters:20:1 ball-to-powder weight ratio, 400 r/min milling speed, ethyl alcohol as PCA, milling for 40 h, and the supersaturated solid solutions can be obtained. The different elements additions such

  19. Brazing diamond/Cu composite to alumina using reactive Ag-Cu-Ti alloy%金刚石/铜复合材料与氧化铝陶瓷的Ag-Cu-Ti活性钎焊

    Institute of Scientific and Technical Information of China (English)

    吴茂; 曹车正; Rafi-ud-din; 何新波; 曲选辉

    2013-01-01

    The novel properties of diamond/Cu composites such as low thermal expansion coefficient and high thermal conductivity have rendered the composites a valuable packaging material. The reactive brazing of diamond/Cu composites and alumina was performed using the 97%(72Ag−28Cu)−3%Ti alloy. The reactive brazing alloy displays good wettability with alumina and diamond film, and the equilibrium contact angle on both the substrates is found to be less than 5º. The influence of main bonding conditions such as peak heating temperature and holding time was investigated in detail. It is found that Ti element concentrates at the surface of diamond particle resulting in the formation of TiC compound. The morphology of TiC compound exhibits a close relationship with the shear strength of brazing joint. It is surmised that an optimal thickness of TiC layer on the diamond particle surface can ameliorate the shear strength of brazing joint. However, on the contrary, the particle-like shaped TiC compound or a thicker TiC compound layer can impair the shear strength. The maximum shear strength is found to be 117 MPa.%金刚石/铜复合材料具有低膨胀系数和高热导率等优异性能,使其成为一种理想的电子封装材料。采用97%(72Ag−28Cu)−3%Ti 活性钎料对金刚石/铜复合材料和氧化铝陶瓷进行钎焊。发现活性钎料在氧化铝陶瓷和金刚石薄膜表面均具有良好的润湿性,在两者表面的平衡润湿角均小于5°。讨论了主要钎焊条件(如钎焊温度和保温时间等)对接头性能的影响。发现钎焊过程中Ti元素聚集在金刚石颗粒的表面形成TiC化合物,且TiC化合物的形貌与钎焊接头的剪切强度具有紧密联系。推测合适的TiC化合物层厚度可改善钎焊接头的剪切强度,而颗粒状的TiC化合物及过厚的TiC化合物层却会损害钎焊接头的性能。获得的最大剪切强度为117 MPa。

  20. Comparison of Sn-Ag-Cu Solder Alloy Intermetallic Compound Growth Under Different Thermal Excursions for Fine-Pitch Flip-Chip Assemblies

    Science.gov (United States)

    Tian, Ye; Liu, Xi; Chow, Justin; Wu, Yi Ping; Sitaraman, Suresh K.

    2013-08-01

    The intermetallic compound (IMC) evolution in Cu pad/Sn-Ag-Cu solder interface and Sn-Ag-Cu solder/Ni pad interface was investigated using thermal shock experiments with 100- μm-pitch flip-chip assemblies. The experiments show that low standoff height of solder joints and high thermomechanical stress play a great role in the interfacial IMC microstructure evolution under thermal shock, and strong cross-reaction of pad metallurgies is evident in the intermetallic growth. Furthermore, by comparing the IMC growth during thermal aging and thermal shock, it was found that thermal shock accelerates IMC growth and that kinetic models based on thermal aging experiments underpredict IMC growth in thermal shock experiments. Therefore, new diffusion kinetic parameters were determined for the growth of (Cu,Ni)6Sn5 using thermal shock experiments, and the Cu diffusion coefficient through the IMC layer was calculated to be 0.2028 μm2/h under thermal shock. Finite-element models also show that the solder stresses are higher under thermal shock, which could explain why the IMC growth is faster and greater under thermal shock cycling as opposed to thermal aging.

  1. Properties and Microstructures of Sn-Ag-Cu-X Lead-Free Solder Joints in Electronic Packaging

    Directory of Open Access Journals (Sweden)

    Lei Sun

    2015-01-01

    Full Text Available SnAgCu solder alloys were considered as one of the most popular lead-free solders because of its good reliability and mechanical properties. However, there are also many problems that need to be solved for the SnAgCu solders, such as high melting point and poor wettability. In order to overcome these shortcomings, and further enhance the properties of SnAgCu solders, many researchers choose to add a series of alloying elements (In, Ti, Fe, Zn, Bi, Ni, Sb, Ga, Al, and rare earth and nanoparticles to the SnAgCu solders. In this paper, the work of SnAgCu lead-free solders containing alloying elements and nanoparticles was reviewed, and the effects of alloying elements and nanoparticles on the melting temperature, wettability, mechanical properties, hardness properties, microstructures, intermetallic compounds, and whiskers were discussed.

  2. Correlation Between Sn Grain Orientation and Corrosion in Sn-Ag-Cu Solder Interconnects

    Science.gov (United States)

    Lee, Tae-Kyu; Liu, Bo; Zhou, Bite; Bieler, Thomas; Liu, Kuo-Chuan

    2011-09-01

    The impact of a marine environment on Sn-Ag-Cu interconnect reliability is examined using salt spray exposure followed by thermal cycling. Sn-Ag-Cu solder alloy wafer-level packages, with and without pretreatment with 5% NaCl salt spray, were thermally cycled to failure. The prior salt spray reduced the characteristic lifetime of the Sn-Ag-Cu solder joints by over 43%. Although Sn-based materials show strong resistance to corrosion, the nature of localized corroded areas at critical locations in the solder joint caused significant degradation in the Sn-Ag-Cu solder joints. An important link between the corrosion path and Sn grain orientation was observed using orientation imaging microscopy (OIM). A strong correlation between the corrosion path and grain orientation was identified, indicating that the corrosion attack preferentially followed the basal plane of the Sn lattice.

  3. 合金元素 Ag 含量对 Sn-Ag-Cu无铅焊料焊接性能的影响%Effect of Ag concentration on soldering properties of Sn-Ag-Cu lead-free solder alloy

    Institute of Scientific and Technical Information of China (English)

    高瑞军; 张宇航; 康宇; 韩振峰; 孙福林; 钟茂山

    2015-01-01

    The paper has investigated that different amount of pure Ag are added into Sn-Ag-Cu lead-free solders,and the effect on soldering properties was also discussed.The results show that Ag can improve spreadability and wettability of Cu alloy further.When 0.5% of Ag added,both Sn-0.7Cu and Sn-0.5Ag-0.5Cu solder alloys exhibited similar properties.%探讨了合金元素 Ag 含量对 Sn-Ag-Cu 无铅合金焊料熔化温度、铺展性及润湿性的影响.结果表明,随着 Ag 含量的增加,Sn-Ag-Cu 合金焊料的熔化温度降低,铺展性和润湿性提高,当 w(Ag)≤0.5%时,Sn-0.7Cu 焊料与 Sn-0.5Ag-0.5Cu 焊料的焊接性能十分接近.

  4. Finite Element-Assisted Assessment of the Thermo-cyclic Characteristics of Leads Soldered with SnAgCu(+Bi,In) Alloys

    Science.gov (United States)

    Lis, Adrian; Nakanishi, Kohei; Matsuda, Tomoki; Sano, Tomokazu; Minagawa, Madoka; Okamoto, Masahide; Hirose, Akio

    2017-03-01

    Solder joints between leads and printed circuit boards in thin small outline packages were produced with conventional Sn1.0Ag0.7Cu (SAC107) and Sn3.0Ag0.7Cu (SAC305) solders as well as various solder alloys with gradually increasing amounts of Bi (up to 3.0 wt.%) and In (up to 1.0 wt.%) within the SAC107 base solder. The reliability of soldered leads in temperature cycle (TC) tests improved most with solder alloys containing both Bi (1.6 wt.%) and In (0.5 wt.%). Microindentation and electron probe microanalysis mappings revealed that the effect originates from a combination of solution and precipitation strengthening of the initial SAC alloy. The distribution of inelastic strain accumulation (ISA), as a measure for degradation, was determined in the solder joints by finite element calculations. It was shown that defects in the solder proximal to the lead (60-75 μm), which was underpinned by similar cracking characteristics along the lead-solder interface. The ISA was confirmed to be lower in SAC+Bi/In alloys owing to their enhanced elasto-plastic properties. Moreover, the addition of a thin Cu coating on the leads could improve the joint reliability, as suggested by the calculation of the ISA and the acceleration factor.

  5. X-ray diffraction study of thermal parameters of Pd, Pd-Ag and Pd-Ag-Cu alloys as hydrogen purification membrane materials

    Science.gov (United States)

    Pati, Subhasis; Jat, Ram Avtar; Mukerjee, S. K.; Parida, S. C.

    2016-03-01

    High temperature X-ray diffraction measurements were carried out for pure palladium and palladium-rich alloys of compositions Pd0.77Ag0.23 and Pd0.77Ag0.10Cu0.13 in the temperature range of 298-1023 K at an interval of 50 K. The lattice parameters, coefficient of thermal expansion and X-ray Debye temperature of these materials were calculated as a function of temperature from the XRD data. The lattice parameter of Pd0.77Ag0.23 alloy was found to be higher than that of palladium, whereas the lattice parameter of Pd0.77Ag0.10Cu0.13 was found to be lower than that of palladium in the temperature range of investigation. Further, the lattice parameters of both the palladium alloys show negative deviation from Vegard's law and the deviation was found to increase with increase in temperature. The average value of coefficient of linear thermal expansion was found to follow the trend: αT (Pd)>αT (Pd0.77Ag0.23)>αT (Pd0.77Ag0.10Cu0.13). The X-ray Debye temperatures of Pd0.77Ag0.23 and Pd0.77Ag0.10Cu0.13 alloys were calculated and found to be 225±10 and 165±10 K, respectively.

  6. Ag-Cu合金纳米颗粒的低温合成与热学性能%Low temperature synthesis and thermal properties of Ag-Cu alloy nanoparticles

    Institute of Scientific and Technical Information of China (English)

    W.BHAGATHSINGH; A.SAMSONNESARAJ

    2013-01-01

    采用一种简单的低温化学还原方法,在水溶液中利用NaBH4作为还原剂还原醋酸或硫酸铜,制备了Ag-Cu纳米颗粒.反应过程中通入氮气来防止生成的合金被氧化.采用XRD、紫外-可见光谱、颗粒尺寸测试、EDS分析、TG-DTA分析和SEM观察等手段来表征合成的Ag-Cu纳米颗粒.XRD分析表明,所合成的Ag-Cu纳米颗粒的晶粒尺寸为15nm左右.紫外-可见光谱分析证实了纳米颗粒的生成.EDS分析表明,样品中存在Ag和Cu.SEM观察表明,所制备的样品的平均晶粒尺寸为40 nm.TG-DTA研究表明,合金的熔点与颗粒尺寸有关.%Ag-Cu alloy nanoparticles were synthesized by simple low temperature chemical reduction method using metal salts (acetate/sulphates) in aqueous solution with sodium borohydride as reducing agent.The chemical reduction was carried out in the presence of nitrogen gas in order to prevent the oxidation of copper during the reaction process.The alloy nanoparticles were characterized by XRD,UV-Vis,particle size analysis,EDS,TG-DTA and SEM analysis.From the XRD analysis,the crystallite sizes of the prepared samples were calculated using Scherrer formula and the values were found to be in the range of 15 nm.UV-Vis studies conform the formation of alloy nanoparticles.EDS analysis shows the presence of silver and copper in the samples.The SEM observation reveals that the samples consist of grains with average grain size up to 40 nm,and the particle size dependant melting point was studied by TG-DTA.

  7. Primary solidification phases of the Sn-rich Sn-Ag-Cu-Ni quaternary system

    Science.gov (United States)

    Chang, Cheng-An; Chen, Sinn-Wen; Chiu, Chen-Nan; Huang, Yu-Chih

    2005-08-01

    The eutectic and near-eutectic Sn-Ag-Cu solders are the most promising lead-free solders, and nickel is frequently used as the barrier layer material. Nickel dissolves into the molten Sn-Ag-Ni alloy during the soldering process, and the ternary solder becomes a Sn-Ag-Cu-Ni quaternary melt near the nickel substrate. Liquidus projection is the projection of the liquidus trough and it delineates the boundaries of various primary solidification phases. Information of liquidus projection is helpful for understanding the alloys’ solidification behavior. This study prepared the Sn-Ag-Cu-Ni alloys of various compositions at the Sn-rich corner. The alloys were melted at higher temperatures and solidified in air. The solidified alloys were metallographically examined to determine the phases formed, especially the primary solidification phases. No ternary or quaternary compounds were found. The knowledge of the primary solidification phases, phase formation sequences, and reaction temperatures determined in this study were put together with all of the available liquidus projections of the constituent ternary systems to determine the primary solidification phases of the quaternary Sn-Ag-Cu-Ni system at the Sn-rich corner.

  8. Sn-Ag-Cu Nanosolders: Solder Joints Integrity and Strength

    Science.gov (United States)

    Roshanghias, Ali; Khatibi, Golta; Yakymovych, Andriy; Bernardi, Johannes; Ipser, Herbert

    2016-08-01

    Although considerable research has been dedicated to the synthesis and characterization of lead-free nanoparticle solder alloys, only very little has been reported on the reliability of the respective joints. In fact, the merit of nanoparticle solders with depressed melting temperatures close to the Sn-Pb eutectic temperature has always been challenged when compared with conventional solder joints, especially in terms of inferior solderability due to the oxide shell commonly present on the nanoparticles, as well as due to compatibility problems with common fluxing agents. Correspondingly, in the current study, Sn-Ag-Cu (SAC) nanoparticle alloys were combined with a proper fluxing vehicle to produce prototype nanosolder pastes. The reliability of the solder joints was successively investigated by means of electron microscopy and mechanical tests. As a result, the optimized condition for employing nanoparticles as a competent nanopaste and a novel procedure for surface treatment of the SAC nanoparticles to diminish the oxide shell prior to soldering are being proposed.

  9. Effects of rare earth element Ce on solderabilities of micron-powdered Sn-Ag-Cu solder

    Institute of Scientific and Technical Information of China (English)

    XUE Song-bai; YU Sheng-lin; WANG Xu-yan; LIU lin; HU Yong-fang; YAO Li-hua

    2005-01-01

    Several important properties of the micron-powdered Sn-Ag-Cu-Ce solder, including the spreadability, spreading ratio, wetting time, and melting point, were investigated for verifying the effects of rare earth element Ce on solderabilities of micron-powdered Sn-Ag-Cu solder. The solidus and the liquidus of the micron-powdered Sn-Ag-Cu-Ce solder are 193.6℃ and 218.4℃, respectively, about 28℃ and 3℃ lower than the melting point of the block Sn-Ag-Cu solder, which reminds the existence of the surface effect of the micron-powdered solder. By adding Ce into Sn-Ag-Cu alloy, its wetting time on pure copper can be obviously decreased. For the Sn-Ag-Cu-0.03%Ce, the soldering temperature is 250℃, and the wetting time on pure copper is close to 1s, with the soldering temperature approaching to 260℃, the wetting time is dropped to 0.8s, which is close to the wetting time, 0.68s, of Sn-Pb solder at 235℃.

  10. The Reliability of Microalloyed Sn-Ag-Cu Solder Interconnections Under Cyclic Thermal and Mechanical Shock Loading

    Science.gov (United States)

    Mattila, Toni T.; Hokka, Jussi; Paulasto-Kröckel, Mervi

    2014-11-01

    In this study, the performance of three microalloyed Sn-Ag-Cu solder interconnection compositions (Sn-3.1Ag-0.52Cu, Sn-3.0Ag-0.52Cu-0.24Bi, and Sn-1.1Ag-0.52Cu-0.1Ni) was compared under mechanical shock loading (JESD22-B111 standard) and cyclic thermal loading (40 ± 125°C, 42 min cycle) conditions. In the drop tests, the component boards with the low-silver nickel-containing composition (Sn-Ag-Cu-Ni) showed the highest average number of drops-to-failure, while those with the bismuth-containing alloy (Sn-Ag-Cu-Bi) showed the lowest. Results of the thermal cycling tests showed that boards with Sn-Ag-Cu-Bi interconnections performed the best, while those with Sn-Ag-Cu-Ni performed the worst. Sn-Ag-Cu was placed in the middle in both tests. In this paper, we demonstrate that solder strength is an essential reliability factor and that higher strength can be beneficial for thermal cycling reliability but detrimental to drop reliability. We discuss these findings from the perspective of the microstructures and mechanical properties of the three solder interconnection compositions and, based on a comprehensive literature review, investigate how the differences in the solder compositions influence the mechanical properties of the interconnections and discuss how the differences are reflected in the failure mechanisms under both loading conditions.

  11. Temperature stability of AgCu nanoparticles

    Energy Technology Data Exchange (ETDEWEB)

    Sopoušek, Jiří, E-mail: sopousek@mail.muni.cz; Zobač, Ondřej; Vykoukal, Vít [Masaryk University, Department of Chemistry, Faculty of Science (Czech Republic); Buršík, Jiří; Roupcová, Pavla [Institute of Physics of Materials ASCR (Czech Republic); Brož, Pavel; Pinkas, Jiří [Masaryk University, Department of Chemistry, Faculty of Science (Czech Republic); Vřešťál, Jan [Masaryk University, Central European Institute of Technology, CEITEC (Czech Republic)

    2015-12-15

    The colloidal solutions of the Ag–Cu nanoparticles (NPs, 10–32 nm) were prepared by solvothermal reactions. The samples of dried AgCu NPs and the resulting microstructures after heat treatment in air were investigated by various methods including electron microscopy (TEM, SEM) and high-temperature X-ray powder diffraction (HTXRD). The AgCu randomly mixed, Cu-rich, and Ag-rich face centred cubic crystal lattices were detected during the experiments. The temperature induced sintering was observed experimentally by HTXRD at 250 °C. The phase transformations at high temperatures were monitored by differential scanning calorimetry. The formation of the Ag-rich grains during heating in air and evolution of copper oxide microstructure were detected.Graphical abstract.

  12. Ag3Sn plate formation in the solidification of near-ternary eutectic Sn-Ag-Cu

    Science.gov (United States)

    Kang, Sung K.; Shih, Da-Yuan; Donald, Ny.; Henderson, W.; Gosselin, Timothy; Sarkhel, Amit; Charles Goldsmith, Ny.; Puttlitz, Karl J.; Choi, Won Kyoung

    2003-06-01

    Near-ternary eutectic Sn-Ag-Cu alloys are leading lead-free candidate solders for various applications. These alloys yield three phases upon solidification: β-Sn,Ag3Sn, and Cu6Sn5. Large, plate-like, pro-eutectic Ag3Sn structures can grow rapidly within the liquid phase, potentially adversely affecting the mechanical behavior and reducing the fatigue life of solder joints. This article reports on the formation of such plates in Sn-Ag-Cu solder balls and joints and demonstrates how large Ag3Sn plate formation can be minimized.

  13. Al2O3/SUS304 Brazing via AgCuTi-W Composite as Active Filler

    Science.gov (United States)

    Su, Cherng-Yuh; Zhuang, Xie-Zongyang; Pan, Cheng-Tang

    2014-03-01

    Alumina ceramic (α-Al2O3) was brazed to stainless steel (SUS304) using an Ag-Cu-Ti + W composite filler and a traditional active brazing filler alloy (CuSil-ABA). Then, the effects of the presence of W particles and of the brazing parameters on the microstructures and mechanical properties of the brazed joints were investigated. The maximum tensile strength of the joints obtained using Ag-Cu-Ti + W composite filler was 13.2 MPa, which is similar to that obtained using CuSil-ABA filler (13.5 MPa). When the joint was brazed at 930 °C for 30 min, the tensile strengths decreased for both kinds of fillers, although the strength was slightly higher for the Ag-Cu-Ti + W composite filler than for the Ag-Cu-Ti filler. The interfacial microstructure results show that the Ti reacts with W to form a Ti-W-O compound in the brazing alloy. When there are more W particles in the brazing alloy, the thickness of the Ti X O Y reaction layer near the alumina ceramic decreases. Moreover, W particles added to the brazing alloy can reduce the coefficient of thermal expansion of the brazing alloy, which results in lower residual stress between the Al2O3 and SUS304 in the brazing joints and thus yields higher tensile strengths as compared to those obtained using the CuSil-ABA brazing alloy.

  14. Effect of Ag Content and the Minor Alloying Element Fe on the Mechanical Properties and Microstructural Stability of Sn-Ag-Cu Solder Alloy Under High-Temperature Annealing

    Science.gov (United States)

    Shnawah, Dhafer Abdulameer; Sabri, Mohd Faizul Mohd; Badruddin, Irfan Anjum; Said, Suhana Binti Mohd; Ariga, Tadashi; Che, Fa Xing

    2013-03-01

    This study compares the high-Ag-content Sn-3Ag-0.5Cu with the low- Ag-content Sn-1Ag-0.5Cu solder alloy and the three quaternary solder alloys Sn-1Ag-0.5Cu-0.1Fe, Sn-1Ag-0.5Cu-0.3Fe, and Sn-1Ag-0.5Cu-0.5Fe to understand the beneficial effects of Fe on the microstructural stability, mechanical properties, and thermal behavior of the low-Ag-content Sn-1Ag-0.5Cu solder alloy. The results indicate that the Sn-3Ag-0.5Cu solder alloy possesses small primary β-Sn dendrites and wide interdendritic regions consisting of a large number of fine Ag3Sn intermetallic compound (IMC) particles. However, the Sn-1Ag-0.5Cu solder alloy possesses large primary β-Sn dendrites and narrow interdendritic regions of sparsely distributed Ag3Sn IMC particles. The Fe-bearing SAC105 solder alloys possess large primary β-Sn dendrites and narrow interdendritic regions of sparsely distributed Ag3Sn IMC particles containing a small amount of Fe. Moreover, the addition of Fe leads to the formation of large circular FeSn2 IMC particles located in the interdendritic regions. On the one hand, tensile tests indicate that the elastic modulus, yield strength, and ultimate tensile strength (UTS) increase with increasing Ag content. On the other hand, increasing the Ag content reduces the total elongation. The addition of Fe decreases the elastic modulus, yield strength, and UTS, while the total elongation is still maintained at the Sn-1Ag-0.5Cu level. The effect of aging on the mechanical behavior was studied. After 720 h and 24 h of aging at 100°C and 180°C, respectively, the Sn-1Ag-0.5Cu solder alloy experienced a large degradation in its mechanical properties after both of the aging conditions, whereas the mechanical properties of the Sn-3Ag-0.5Cu solder alloy degraded more dramatically after 24 h of aging at 180°C. However, the Fe-bearing SAC105 solder alloys exhibited only slight changes in their mechanical properties after both aging procedures. The inclusion of Fe in the Ag3Sn IMC particles

  15. Tensile properties and thermal shock reliability of Sn-Ag-Cu solder joint with indium addition.

    Science.gov (United States)

    Yu, A-Mi; Jang, Jae-Won; Lee, Jong-Hyun; Kim, Jun-Ki; Kim, Mok-Soon

    2012-04-01

    The thermal shock reliability and tensile properties of a newly developed quaternary Sn-1.2Ag-0.5Cu-0.4In (wt%) solder alloy were investigated and compared to those of ternary Sn-Ag-Cu based Pb-free solder alloys. It was revealed that the Sn-1.2Ag-0.5Cu-0.4In solder alloy shows better thermal shock reliability compared to the Sn-1.0Ag-0.5Cu and Sn-3.0Ag-0.5Cu solder alloys. The quaternary alloy has higher strength than Sn-1.0Ag-0.5Cu alloy, and higher elongation than Sn-3.0Ag-0.5Cu alloy. It was also revealed that the addition of indium promotes the formation of Ag3(Sn, In) phase in the solder joint during reflow process.

  16. Etude et caractérisation d'interconnexions intermétalliques à partir de plot de cuivre et d'alliage SnAgCu pour l'empilement tridimentionnel de composants actifs

    OpenAIRE

    Bertheau, Julien

    2014-01-01

    Technological roadmap of the microelectronic industry is mainly described by Moore'slaw which aims a constant reduction of transistors size. Three-dimensional integration ofactive chips appears more and more as an alternative way to Moore's law. According to thisstrategy, chips are interconnected along the vertical axis thanks to copper pillars and a tinbased alloy (SnAgCu).The joining is then performed through eutectic bonding using aSnAgCu solder alloy which is at the origin of intermetalli...

  17. Thermophysical Properties of Sn-Ag-Cu Based Pb-Free Solders

    Science.gov (United States)

    Kim, Sok Won; Lee, Jaeran; Jeon, Bo-Min; Jung, Eun; Lee, Sang Hyun; Kang, Kweon Ho; Lim, Kwon Taek

    2009-06-01

    Lead-tin (Pb-Sn) alloys are the dominant solders used for electronic packaging because of their low cost and superior properties required for interconnecting electronic components. However, increasing environmental and health concerns over the toxicity of lead, combined with global legislation to limit the use of Pb in manufactured products, have led to extensive research and development studies of lead-free solders. The Sn-Ag-Cu ternary eutectic alloy is considered to be one of the promising alternatives. Except for thermal properties, much research on several properties of Sn-Ag-Cu alloy has been performed. In this study, five Sn-xAg-0.5Cu alloys with variations of Ag content x of 1.0 mass%, 2.5 mass%, 3.0 mass%, 3.5 mass%, and 4.0 mass% were prepared, and their thermal diffusivity and specific heat were measured from room temperature to 150 °C, and the thermal conductivity was calculated using the measured thermal diffusivity, specific heat, and density values. Also, the linear thermal expansion was measured from room temperature to 170 °C. The results show that Sn-3.5Ag-0.5Cu is the best candidate because it has a maximum thermal conductivity and a low thermal expansion, which are the ideal conditions to be a proper packaging alloy for effective cooling and thermostability.

  18. Electromigration of composite Sn-Ag-Cu solder bumps

    Science.gov (United States)

    Sharma, Ashutosh; Xu, Di Erick; Chow, Jasper; Mayer, Michael; Sohn, Heung-Rak; Jung, Jae Pil

    2015-11-01

    This study investigates the electromigration (EM) behavior of lead free Sn-Ag-Cu (SAC) solder alloys that were reinforced with different types of nanoparticles [Copper-coated carbon nanotubes (Cu/CNT), La2O3, Graphene, SiC, and ZrO2]. The composite solders were bumped on a Cu substrate at 220°C, and the resistance of the bumped solders was measured using a four wire setup. Current aging was carried out for 4 hours at a temperature of 160°C, and an increase in resistance was noted during this time. Of all the composite solders that were studied, La2O3 and SiC reinforced SAC solders exhibited the smallest resistances after current aging. However, the rate of change in the resistance at room temperature was lower for the SiC-reinforced SAC solder. The SAC and Graphene reinforced SAC solder bumps completely failed within 15 - 20 min of these tests. The SiC nanoparticles were reported to possibly entrap the SAC atoms better than other nanoparticles with a lower rate of EM. [Figure not available: see fulltext.

  19. 微量RE对SnAgCu无铅钎料力学性能和润湿性能的影响%Effect of Rare Earth Elements on Mechanical Property and Wettability of SnAgCu Solder Alloy

    Institute of Scientific and Technical Information of China (English)

    杨洁; 冯晓乐; 程光辉

    2011-01-01

    利用光学显微镜、扫描电镜和能谱分析仪等检测手段,研究了微量RE对低银Sn2.5Ag0.7Cu无铅钎料的力学性能和润湿性能影响.结果表明,添加微量RE可以提高该钎料的力学性能,改善润湿性能.当RE添加量为0.1wt%时,钎料的伸长率和拉伸强度最大,此时,该钎料在Cu焊盘上的铺展面积也最大.但过量的RE会导致性能的下降.这些性能的改变与微量RE对其显微组织的影响有关.%The effect of rare earth elements on the mechanical properties and wettability of Sn2.5AgO.7Cu solder were investigated by optical microscopy, SEM and EDS. The results indicate that the addition of trace RE can improve the properties of SnAgCu lead-free solder. The elongation and tensile strength and spreading area on Cu can reach the optimal values, when RE addition is 0. Lwt%. But excessive RE can lead to the decline of performance. The property changes of Sn2.5Ag0.7Cu solder are attributed to the change of the microstructure caused by trace rare earths additions.

  20. Laser soldering of Sn-Ag-Cu and Sn-Zn-Bi lead-free solder pastes

    Science.gov (United States)

    Takahashi, Junichi; Nakahara, Sumio; Hisada, Shigeyoshi; Fujita, Takeyoshi

    2004-10-01

    It has reported that a waste of an electronics substrate including lead and its compound such as 63Sn-37Pb has polluted the environment with acid rain. For that environment problem the development of lead-free solder alloys has been promoted in order to find out the substitute for Sn-Pb solders in the United States, Europe, and Japan. In a present electronics industry, typical alloys have narrowed down to Sn-Ag-Cu and Sn-Zn lead-free solder. In this study, solderability of Pb-free solder that are Sn-Ag-Cu and Sn-Zn-Bi alloy was studied on soldering using YAG (yttrium aluminum garnet) laser and diode laser. Experiments were peformed in order to determine the range of soldering parameters for obtaining an appropriate wettability based on a visual inspection. Joining strength of surface mounting chip components soldered on PCB (printed circuit board) was tested on application thickness of solder paste (0.2, 0.3, and 0.4 mm). In addition, joining strength characteristics of eutectic Sn-Pb alloy and under different power density were examined. As a result, solderability of Sn-Ag-Cu (Pb-free) solder paste are equivalent to that of coventional Sn-Pb solder paste, and are superior to that of Sn-Zn-Bi solder paste in the laser soldering method.

  1. Spasmodic growth during the rapid solidification of undercooled Ag-Cu eutectic melts

    Science.gov (United States)

    Clopet, C. R.; Cochrane, R. F.; Mullis, A. M.

    2013-01-01

    A melt fluxing technique has been used to undercool Ag-Cu eutectic alloy by 10-70 K and the subsequent recalescence has been studied using high speed imaging. Spasmodic growth of the solidification front was observed, in which the growth front would make a series of quasi-periodic jumps separated by extended periods during which time growth appeared to arrest. Evidence of this previously unreported mode of growth is presented. The high speed images and microstructural evidence support the theory that anomalous eutectics form by the growth and subsequent remelting of eutectic dendrites.

  2. Ag-Cu nanoalloyed film as a high-performance cathode electrocatalytic material for zinc-air battery

    OpenAIRE

    Lei, Yimin; Chen, Fuyi; Jin, Yachao; Liu, Zongwen

    2015-01-01

    A novel Ag50Cu50 film electrocatalyst for oxygen reduction reaction (ORR) was prepared by pulsed laser deposition (PLD) method. The electrocatalyst actually is Ag-Cu alloyed nanoparticles embedded in amorphous Cu film, based on transmission electron microscopy (TEM) characterization. The rotating disk electrode (RDE) measurements provide evidence that the ORR proceed via a four-electron pathway on the electrocatalysts in alkaline solution. And it is much more efficient than pure Ag catalyst. ...

  3. The Role of Pd in Sn-Ag-Cu Solder Interconnect Mechanical Shock Performance

    Science.gov (United States)

    Lee, Tae-Kyu; Zhou, Bite; Bieler, Thomas R.; Tseng, Chien-Fu; Duh, Jeng-Gong

    2013-02-01

    The mechanical stability of solder joints with Pd added to Sn-Ag-Cu alloy with different aging conditions was investigated in a high- G level shock environment. A test vehicle with three different strain and shock level conditions in one board was used to identify the joint stability and failure modes. The results revealed that Pd provided stability at the package-side interface with an overall shock performance improvement of over 65% compared with the Sn-Ag-Cu alloy without Pd. A dependency on the pad structure was also identified. However, the strengthening mechanism was only observed in the non-solder mask defined (NSMD) pad design, whereas the solder mask defined (SMD) pad design boards showed no improvement in shock performance with Pd-added solders. The effects of Sn grain orientation on shock performance, interconnect stability, and crack propagation path with and without Pd are discussed. The SAC305 + Pd solder joints showed more grain refinements, recrystallization, and especially mechanical twin deformation during the shock test, which provides a partial explanation for the ability of SAC305 + Pd to absorb more shock-induced energy through active deformation compared with SAC305.

  4. 基于 ANSYS 有限元的 Ag-Cu-Ti合金钎焊金刚石磨粒残余应力分析与优化研究%Re search on Thermal Stress of Brazed Diamond Grain with Ag-Cu-Ti Brazing Alloy Based on ANSYS

    Institute of Scientific and Technical Information of China (English)

    朱迪; 吕明; 孟普

    2015-01-01

    The influence of the solder layer thickness to the properties of monolayer brazed diamond tools was studied .The em-bedding depth of diamond was 20%, 40%, 50%, 60%, 80%, respectively .When finite element software ANSYS was used to study the residual stress of diamond brazed with Ag -Cu-Ti alloy brazing , the brazing process could be thought as an isothermal process.Therefore the linear and static analysis method were used to research the residual stress formed during brazing process . Results show that the maximum stress appears at the interface between diamonds and brazing alloy , stress decreases from the bot-tom of the diamond to the top of the diamond;the diamond abrasive endures tensile stress , however , the brazing alloy and tools substrate endures compressive stress .When the embedding depth of the diamond is between 20%and 40%, the residual stress has the minimum value .%研究金刚石包埋深度分别为20%、40%、50%、60%、80%的钎料对单层钎焊金刚石工具性能的影响。利用有限元软件ANSYS对Ag-Cu-Ti合金钎焊金刚石过程中形成的残余应力进行数值模拟,采用线性和静态的分析方法。研究结果表明,最大应力值位于金刚石和钎料界面结合处的最底部,应力从金刚石底部到顶部逐渐减小,金刚石受拉应力,钎料和工具基体受压应力。当金刚石的包埋深度介于20%与40%之间时,钎焊残余应力最小。

  5. Preparation and soldering test for rapid solidification Sn-Ag-Cu solder alloy%快速凝固型Sn-Ag-Cu系钎料合金制备及钎焊工艺试验

    Institute of Scientific and Technical Information of China (English)

    李攀; 张鑫; 刘治军; 高广东; 熊毅

    2012-01-01

    采用单辊法制备了快速凝固型Sn2.5Ag0.7Cu钎料合金,在对其进行XRD检测、熔化特性测定和钎焊工艺试验后,对一定钎焊工艺条件下钎焊接头的力学性能和显微组织进行了测试分析,结果表明:所制备的钎料合金的熔化特性和钎焊接头力学性能满足要求,钎缝-母材界面上金属间化合物呈不均匀分布,且朝向钎焊缝中心生长.%Rapid solidification Sn2.5Ag0.7Cu solder alloy was prepared by using single-roller method, after XRD-test and testing the melting property and soldering procedure, the mechanical properties and microstructure of the joints under given soldering conditions were tested and analyzed. The results showed that the melting property of the solder alloy and mechanical properties of the joint were satisfactory. The IMC located at the solder-parent metal interface had an uneven distribution, and they grew toward the center of the solder seam.

  6. Ag-Cu-Ti合金与ZrO2陶瓷的润湿性及界面特征%Wettability and interface characteristics of Ag-Cu-Ti/ZrO2 system

    Institute of Scientific and Technical Information of China (English)

    刘玉华; 庄宇; 胡建东; 韩先贺

    2014-01-01

    Wettability and interface characteristics of Ag-Cu-Ti/ZrO2 system were studied by an improved sessile drop method. Wettability and interface morphology of Ag-Cu-Ti/ZrO2 system were investigated in detail by ADSA ( Axisymmetric drop shape analysis)-SESDROPD, X-ray diffractometer (XRD), Field emission scanning electron microscopy (FESEM) and scanning electron microscopy ( SEM) with spectrometer ( EDS) . The results show that:the wetting of molten Ag-Cu-Ti metallic glass alloy on the ZrO2 substrate belongs to the reactive wetting. With the increase in the content of Ti, the wettability of Ag-Cu-Ti/ZrO2 systems are improved significantly. There is the anomalous dependence of wettability of Ag54 Cu4 3 Ti4/ZrO2 system on the temperatures. Ag53 Cu41 Ti6 alloy has good wettability. With the increase of temperature, Ag54 Cu43 Ti4/ZrO2 and Ag53 Cu41 Ti6/ZrO2 interfaces reaction product TiO phase gradually thickening, Cu3 Ti3 O reaction layer is thinning;Ag50 Cu40 Ti10/ZrO2 interface, a big lump of intermetallic compound Cu3 Ti3 O, is easy to result in stripping of alloy and ceramic interface.%通过改良座滴法研究了 Ag-Cu-Ti/ZrO2陶瓷体系的润湿行为和界面特征[1]。采用 ADSA ( axisymmetric drop shape analysis )-SESDROPD 分析软件, X 射线衍射仪( XRD ),场发射扫描电镜( FESEM)以及配有能谱仪( EDS)的扫描电镜( SEM)测量表征了温度变化下,不同Ti含量的Ag-Cu-Ti合金在ZrO2陶瓷基板上的润湿性及其界面微观结构的影响规律。结果表明:Ag-Cu-Ti/ZrO2陶瓷体系的润湿机制为反应性润湿。 Ag-Cu-Ti合金在ZrO2陶瓷基板上的润湿性随Ti含量的增加逐渐改善。 Ag54 Cu43 Ti4合金熔体在ZrO2陶瓷基板上的润湿性对温度具有明显的反常依赖性,Ag53 Cu41 Ti6合金的润湿性较好。随温度的升高, Ag54 Cu43 Ti4/ZrO2和 Ag53 Cu41 Ti6/ZrO2界面反应产物 TiO 反应层逐渐增厚, Cu3 Ti3 O反应层有逐渐变薄的趋势。 Ag50 Cu40

  7. High-Reliability Low-Ag-Content Sn-Ag-Cu Solder Joints for Electronics Applications

    Science.gov (United States)

    Shnawah, Dhafer Abdulameer; Said, Suhana Binti Mohd; Sabri, Mohd Faizul Mohd; Badruddin, Irfan Anjum; Che, Fa Xing

    2012-09-01

    Sn-Ag-Cu (SAC) alloy is currently recognized as the standard lead-free solder alloy for packaging of interconnects in the electronics industry, and high- Ag-content SAC alloys are the most popular choice. However, this choice has been encumbered by the fragility of the solder joints that has been observed in drop testing as well as the high cost of the Ag itself. Therefore, low-Ag-content SAC alloy was considered as a solution for both issues. However, this approach may compromise the thermal-cycling performance of the solders. Therefore, to enhance the thermal-cycling reliability of low-Ag-content SAC alloys without sacrificing their drop-impact performance, alloying elements such as Mn, Ce, Ti, Bi, In, Sb, Ni, Zn, Al, Fe, and Co were selected as additions to these alloys. However, research reports related to these modified SAC alloys are limited. To address this paucity, the present study reviews the effect of these minor alloying elements on the solder joint reliability of low-Ag-content SAC alloys in terms of thermal cycling and drop impact. Addition of Mn, Ce, Bi, and Ni to low-Ag-content SAC solder effectively improves the thermal-cycling reliability of joints without sacrificing the drop-impact performance. Taking into consideration the improvement in the bulk alloy microstructure and mechanical properties, wetting properties, and growth suppression of the interface intermetallic compound (IMC) layers, addition of Ti, In, Sb, Zn, Al, Fe, and Co to low-Ag-content SAC solder has the potential to improve the thermal-cycling reliability of joints without sacrificing the drop-impact performance. Consequently, further investigations of both thermal-cycling and drop reliability of these modified solder joints must be carried out in future work.

  8. Thermal analysis of selected tin-based lead-free solder alloys

    DEFF Research Database (Denmark)

    Palcut, Marián; Sopoušek, J.; Trnková, L.

    2009-01-01

    The Sn-Ag-Cu alloys have favourable solderability and wetting properties and are, therefore, being considered as potential lead-free solder materials. In the present study, tin-based Sn-Ag-Cu and Sn-Ag-Cu-Bi alloys were studied in detail by a differential scanning calorimetry (DSC) and thermodyna......The Sn-Ag-Cu alloys have favourable solderability and wetting properties and are, therefore, being considered as potential lead-free solder materials. In the present study, tin-based Sn-Ag-Cu and Sn-Ag-Cu-Bi alloys were studied in detail by a differential scanning calorimetry (DSC...... was simulated using the Thermo-Calc software package. This approach enabled us to obtain the enthalpy of cooling for each alloy and to compare its temperature derivative with the experimental DSC curves....

  9. Dynamic viscosities of pure tin and Sn-Ag, Sn-Cu, and Sn-Ag-Cu eutectic melts

    Science.gov (United States)

    Rozhitsina, E. V.; Gruner, S.; Kaban, I.; Hoyer, W.; Sidorov, V. E.; Popel', P. S.

    2011-02-01

    The dynamic viscosities of the melts of pure tin and eutectic Sn-Ag, Sn-Cu, and Sn-Ag-Cu alloys are studied in heating followed by cooling, and the maximum heating temperature was 1200°C. An irreversible decrease in the viscosity is found in the temperature range 800-1000°C in the polytherms of all melts. This finding is related to the loss of a local order in a melt and can be used to develop temperature regimes for the production of lead-free solders.

  10. Mechanical Characterization of Lead-Free Sn-Ag-Cu Solder Joints by High-Temperature Nanoindentation

    OpenAIRE

    Lotfian, S.; Molina Aldareguía, Jon M.; Yazzie, K. E.; Llorca Martinez, Francisco Javier; Chawla, N

    2013-01-01

    The reliability of Pb-free solder joints is controlled by their microstructural constituents. Therefore, knowledge of the solder microconstituents’ mechanical properties as a function of temperature is required. Sn-Ag-Cu lead-free solder alloy contains three phases: a Sn-rich phase, and the intermetallic compounds (IMCs) Cu6Sn5 and Ag3Sn. Typically, the Sn-rich phase is surrounded by a eutectic mixture of β-Sn, Cu6Sn5, and Ag3Sn. In this paper, we report on the Young’s modulus and hardness of...

  11. 微电机换向器用内氧化法AgCuONiO电接触材料的结构及性能研究%Structure and Properties of Internal Oxidized AgCuONiO Electrical Contact Materials Applied to Micro-motor Commutator

    Institute of Scientific and Technical Information of China (English)

    王新建; 阮文魁; 王杨; 于磊

    2013-01-01

    The internal oxidized Ag-based alloys have become an important kind of electrical contact materials and been successfully used in micro-motor commutator field due to their excellent electrical conductivity and abrasion resistance. The structure and properties of internal oxi-dized AgCu4Ni0.3 alloys were respectively studied by the means of XRD, SEM, MHV and life testing. Results show that the AgCu4Ni0.3 alloy is fully oxidized after being oxidized at 700 ℃for three hours in 0.5 atm oxygen atmosphere. The CuO and NiO particles distribute in the ma-trix uniformly, so that the thermal stability of the alloy is enhanced. Compared with that of the AgCu4Ni0.3 alloy before oxidized (about 250 ℃), the softening temperature of the oxidized Ag-Cu4Ni0.3 alloy is improved almost to 400℃. Life testing shows that the commutator made with AgCuONiO/TU1 clad strips has higher abrasive resistance, which can be used as the electrical contact materials widely.%  内氧化银基合金具有优良的导电性和耐磨性,已成为一种重要的电接触材料并成功应用于微电机换向器领域.本文利用X射线衍射仪(XRD)、扫描电子显微镜(SEM)、显微硬度仪(MHT)以及寿命试验分别对微电机换向器用AgCu4Ni0.3合金内氧化前后的结构及性能进行了研究.结果表明, AgCu4Ni0.3合金在700℃、0.5 atm氧分压下氧化3 h后完全氧化,氧化产物CuO、NiO颗粒均匀弥散分布于氧化层基体中,增强了合金的热稳定性;AgCu4Ni0.3合金的软化温度由氧化前的250℃提高到400℃.寿命试验表明,相比AgCuNi/TU1材料,AgCuONiO/TU1复合材料制成的换向器具有更高的耐磨损性能,在电接触材料领域具有广泛的应用前景.

  12. Reaction of Liquid Sn-Ag-Cu-Ce Solders with Solid Copper

    Science.gov (United States)

    Chriaštel'Ová, J.; Rízeková Trnková, L.; Pocisková Dimová, K.; Ožvold, M.

    2011-09-01

    Small amounts of the rare-earth element Ce were added to the Sn-rich lead-free eutectic solders Sn-3.5Ag-0.7Cu, Sn-0.7Cu, and Sn-3.5Ag to improve their properties. The microstructures of the solders without Ce and with different amounts (0.1 wt.%, 0.2 wt.%, and 0.5 wt.%) of Ce were compared. The microstructure of the solders became finer with increasing Ce content. Deviation from this rule was observed for the Sn-Ag-Cu solder with 0.2 wt.% Ce, and for the Sn-0.7Cu eutectic alloy, which showed the finest microstructure without Ce. The melting temperatures of the solders were not affected. The morphology of intermetallic compounds (IMC) formed at the interface between the liquid solders and a Cu substrate at temperatures about 40°C above the melting point of the solder for dipping times from 2 s to 256 s was studied for the basic solder and for solder with 0.5 wt.% Ce addition. The morphology of the Cu6Sn5 IMC layer developed at the interface between the solders and the substrate exhibited the typical scallop-type shape without significant difference between solders with and without Ce for the shortest dipping time. Addition of Ce decreased the thickness of the Cu6Sn5 IMC layer only at the Cu/Sn-Ag-Cu solder interface for the 2-s dipping. A different morphology of the IMC layer was observed for the 256-s dipping time: The layers were less continuous and exhibited a broken relief. Massive scallops were not observed. For longer dipping times, Cu3Sn IMC layers located near the Cu substrate were also observed.

  13. Mechanical properties and microstructure investigation of Sn-Ag-Cu lead free solder for electronic package applications

    Science.gov (United States)

    Wang, Qing

    While the electronics industry appears to be focusing on Sn-Ag-Cu as the alloy of choice for lead free electronics assembly, the exact composition varies by geographic region, supplier and user. Add to that dissolved copper and silver from the printed circuit board traces and surface finish, and there can be significant variation in the final solder joint composition. A systematic study of the mechanical and microstructural properties of Sn-Ag-Cu alloys with Ag varying from 2wt% to 4wt% and Cu varying from 0.5wt% to 1.5wt%, was investigated in this research study. Different sample preparation techniques (water quenched, oil quenched and water quenched followed by reflow) were explored and the resulting microstructure compared to that of a typical reflowed lead free chip scale package (CSP) solder joint. Tensile properties such as tensile strength, 0.2% yield strength and the ultimate tensile strength and creep behavior of selected alloy compositions (Sn-4Ag-1.5Cu, Sn-4Ag-0.5Cu, Sn-2Ag-1.5Cu, Sn-2Ag-0.5Cu, Sn-3.5Ag-0.8Cu) were performed for three conditions: as-cast; aged for 100 hours at 125°C; and aged for 250 hours at 125°C. The microstructures of these alloys were examined using light and scanning electron microscopy (LM and SEM) respectively and SEM based energy dispersive x-ray spectroscopy (EDS). Fracture surface and cross-section analysis were performed on the specimens after creep testing. The creep testing results and the effect of high temperature aging on mechanical properties will also be presented for the oil quenched samples. A hyperbolic-sine creep model was adopted and used to fit the creep experiment data. The effect of adding the quaternary element bismuth to the Sn-3.5Ag-0.8Cu alloy on the mechanical properties was measured and compared with the mechanical properties of the ternary alloys. The results of this research study provide necessary data for the modeling of solder joint reliability for a range of Sn-Ag-Cu compositions and a baseline

  14. Fiabilité mécanique des assemblages électroniques utilisant des alliages du type SnAgCu

    OpenAIRE

    Dompierre, Benoît

    2011-01-01

    Since the use of the lead was restricted in electronic assemblies, the electronic market turned on lead-free alloys for electronic assemblies. Most of electronic manufacturers chose SnAgCu (SAC) to replace SnPb alloys. For SAC, former results suggest that high temperature thermal ageing causes a significant drop in mechanical properties, which stabilises after several years at room temperature. The aim of this work is to analyse the impact of thermal ageing on the fatigue damage of SAC305 ele...

  15. Surface modification of oleylamine-capped Ag-Cu nanoparticles to fabricate low-temperature-sinterable Ag-Cu nanoink

    Science.gov (United States)

    Kim, Na Rae; Jong Lee, Yung; Lee, Changsoo; Koo, Jahyun; Lee, Hyuck Mo

    2016-08-01

    By treating oleylamine (OA)-capped Ag-Cu nanoparticles with tetramethylammonium hydroxide (TMAH), we obtained metal nanoparticles that are suspended in polar solvents and sinterable at low temperatures. The simple process with ultra sonication enables synthesis of monodispersed and high purity nanoparticles in an organic base, where the resulting nanoparticles are dispersible in polar solvents such as ethanol and isopropyl alcohol. To investigate the surface characteristics, we conducted Fourier-transform infrared and zeta-potential analyses. After thermal sintering at 200 °C, which is approximately 150 °C lower than the thermal decomposition temperature of OA, an electrically conductive thin film was obtained. Electrical resistivity measurements of the TMAH-treated ink demonstrate that surface modified nanoparticles have a low resistivity of 13.7 × 10-6 Ω cm. These results confirm the prospects of using low-temperature sinterable nanoparticles as the electrode layer for flexible printed electronics without damaging other stacked polymer layers.

  16. Impact of 5% NaCl Salt Spray Pretreatment on the Long-Term Reliability of Wafer-Level Packages with Sn-Pb and Sn-Ag-Cu Solder Interconnects

    Science.gov (United States)

    Liu, Bo; Lee, Tae-Kyu; Liu, Kuo-Chuan

    2011-10-01

    Understanding the sensitivity of Pb-free solder joint reliability to various environmental conditions, such as corrosive gases, low temperatures, and high-humidity environments, is a critical topic in the deployment of Pb-free products in various markets and applications. The work reported herein concerns the impact of a marine environment on Sn-Pb and Sn-Ag-Cu interconnects. Both Sn-Pb and Sn-Ag-Cu solder alloy wafer-level packages, with and without pretreatment by 5% NaCl salt spray, were thermally cycled to failure. The salt spray test did not reduce the characteristic lifetime of the Sn-Pb solder joints, but it did reduce the lifetime of the Sn-Ag-Cu solder joints by over 43%. Although both materials showed strong resistance to corrosion, the localized nature of the corroded area at critical locations in the solder joint caused significant degradation in the Sn-Ag-Cu solder joints. The mechanisms leading to these results as well as the extent, microstructural evolution, and dependency of the solder alloy degradation are discussed.

  17. Wettability of Sn-Zn, Sn-Ag-Cu and Sn-Bi-Cu Lead-free Solder Alloys with Copper Substrate%Sn-Zn,Sn-Ag-Cu和Sn-Bi-Cu无铅焊锡合金与铜的润湿性

    Institute of Scientific and Technical Information of China (English)

    张晓瑞; 汪春雷; 赵宏欣; 李建强; 袁章福

    2009-01-01

    采用静滴法对Sn-Zn,Sn-Ag-Cu Sn-Bi-Cu锡基合金在铜基板上的润湿性进行了研究.结果表明,Sn-Bi-Cu合金的润湿性良好,Sn-30Bi-0.5Cu合金在530 K时的接触角为26°,熔融的Sn-3Ag-0.5Cu共晶合金的接触角几乎不存在滞后性.锡基合金中添加Bi元素可提高合金的润湿性,添加Cu元素可有效防止溶铜发生.研究结果为无铅焊锡合金的应用提供了一定的理论依据.

  18. Microstructure and Properties of Hot Pressing Bonding on Be/HR-1 Stainless Steel with AgCu28 as Interlayer%AgCu28对Be/HR-1不锈钢热静压接头组织性能的影响

    Institute of Scientific and Technical Information of China (English)

    李辉; 康人木; 周上祺; 孔纪兰; 张鹏程

    2011-01-01

    Be and HR-Ⅰ stainless steel with AgCu28 as interlayer was diffusion bonded by hot pressing.The microstructure, composition and phase distribution and mechanical properties of the joints were analyzed using optical microscopy, scanning electron microscopy ( SEM ), scanning auger microspectroy ( SAM ), X-ray diffraction (XRD) and material testing machines, and the relationship between composition and microstructure and properties,and the effect of interlayer materials AgCu28 alloy was also discussed.The results show that good joint can be obtained using AgCu28 alloy as interlayer materials, because it can reduce the mutual diffusion between beryllium and stainless steel element, the formation of brittle intermetallic compounds between beryllium and stainless steel element are avoided effectively to improve the diffusion bonding strength and properties.%以AgCu28合金作为中间层材料,进行Be/HR-Ⅰ不锈钢热静压扩散连接.利用光学金相、扫描电镜(SEM)、俄歇电子能谱(AES)和X射线衍射仪(XRD)及材料试验机分析了热静压扩散连接接头的显微组织、元素和物相分布以及力学性能,探讨了扩散区成分、组织结构与性能的关系,以及AgCu28合金作为中间层材料的作用.研究表明:采用AgCu28合金作为中间层材料,能够实现Be/HR-Ⅰ不锈钢的扩散连接,能有效地减少铍、不锈钢间的元素互扩散,减少了Be与Fe和不锈钢中其他合金元素的脆性金属间化合物的大量生成,接头质量较好.

  19. Effect of Board Thickness on Sn-Ag-Cu Joint Interconnect Mechanical Shock Performance

    Science.gov (United States)

    Lee, Tae-Kyu; Xie, Weidong

    2014-12-01

    The mechanical stability of solder joints with Sn-Ag-Cu alloy joints on various board thicknesses was investigated with a high G level shock environment. A test vehicle with three different board thicknesses was used for board drop shock performance tests. These vehicles have three different strain and shock level condition couples per board, and are used to identify the joint stability and failure modes based on the board responses. The results revealed that joint stability is sensitive to board thickness. The board drop shock test showed that the first failure location shifts from the corner location near the standoff to the center with increased board thickness due to the shock wave response. From analysis of the thickness variation and failure cycle number, the strain rate during the pulse strain cycle is the dominant factor, which defines the life cycle number per board thickness, and not the maximum strain value. The failure location shift and the shock performance differentiation are discussed from the perspective of maximum principal strain, cycle frequency and strain rate per cycle.

  20. Mechanical properties of FeCo magnetic particles-based Sn-Ag-Cu solder composites

    Science.gov (United States)

    Xu, Siyang; Prasitthipayong, Anya; Pickel, Andrea D.; Habib, Ashfaque H.; McHenry, Michael E.

    2013-06-01

    We demonstrate magnetic nanoparticles (MNPs) in enabling lead-free solder reflow in RF fields and improved mechanical properties that impact solder joint reliability. Here, we report on Sn-Ag-Cu (SAC) alloys. SAC solder-FeCo MNP composites with 0, 1, 2, 3, and 4 wt. % FeCo MNP and the use of AC magnetic fields to achieve localized reflow. Electron microscopy of the as-reflowed samples show a decrease in the volume of Sn dendrite regions as well as smaller and more homogeneously dispersed Ag3Sn intermetallic compounds (IMCs) with increasing MNP concentrations. Mechanical properties of the composites were measured by nanoindentation. In pure solder samples and solder composites with 4 wt. % MNP, hardness values increased from 0.18 GPa to 0.20 GPa and the modulus increased from 39.22 GPa to 71.22 GPa. The stress exponent, reflecting creep resistance, increased from 12.85 of pure solder to 16.47 for solder composites with 4 wt. % MNP. Enhanced mechanical properties as compared with the as-prepared solder joints are explained in terms of grain boundary and dispersion strengthening resulting from the microstructural refinement.

  1. Solid-liquid reactions: The effect of Cu content on Sn-Ag-Cu interconnects

    Science.gov (United States)

    Lu, Henry Y.; Balkan, Haluk; Simon, K. Y.

    2005-06-01

    The impact of copper content on the Sn-Ag-y%Cu (Ag=constant=3.5; y=0.0, 0.5, 1.0, and 2.0) interconnects was investigated in this study. The copper content and solid-liquid (S-L) reactions were used as inputs, and the outputs were the interfacial microstructure evolution and joint macro-performance. Surface microetching microscopy, cross-section microscopy, energy-dispersive x-ray analysis, shear test, and differential scanning calorimetry were used in the studies. It was discovered that as-soldered Sn-Ag-y%Cu interconnects could have different interfacial microstructures depending on copper content; no Ag3Sn plates were observed for any alloy groups. After the S-L reactions, Ag3Sn plates occurred for all groups. The magnitude of the Ag3Sn plate growth depended on copper content. This and other effects of copper content on Sn-Ag-Cu interconnects are discussed in this article.

  2. Active Brazing of C/C Composite to Copper by AgCuTi Filler Metal

    Science.gov (United States)

    Zhang, Kexiang; Xia, Lihong; Zhang, Fuqin; He, Lianlong

    2016-05-01

    Brazing between the carbon-fiber-reinforced carbon composite (C/C composite) and copper has gained increasing interest because of its important application in thermal management systems in nuclear fusion reactors and in the aerospace industry. In order to examine the "interfacial shape effect" on the mechanical properties of the joint, straight and conical interfacial configurations were designed and machined on the surface of C/C composites before joining to copper using an Ag-68.8Cu-4.5Ti (wt pct) alloy. The microstructure and interfacial microchemistry of C/C composite/AgCuTi/Cu brazed joints were comprehensively investigated by using high-resolution transmission electron microscopy. The results indicate that the joint region of both straight and conical joints can be described as a bilayer. Reaction products of Cu3Ti3O and γ-TiO were formed near the copper side in a conical interface joint, while no reaction products were found in the straight case. The effect of Ag on the interfacial reaction was discussed, and the formation mechanism of the joints during brazing was proposed. On the basis of the detailed microstructure presented, the mechanical performance of the brazed joints was discussed in terms of reaction and morphology across the joint.

  3. Microfluidic synthesis of Ag@Cu2O core-shell nanoparticles with enhanced photocatalytic activity.

    Science.gov (United States)

    Tao, Sha; Yang, Mei; Chen, Huihui; Ren, Mingyue; Chen, Guangwen

    2017-01-15

    A microfluidic-based method for the continuous synthesis of Ag@Cu2O core-shell nanoparticles (NPs) has been developed. It only took 32s to obtain Ag@Cu2O core-shell NPs, indicating a high efficiency of this microfluidic-based method. Triangular Ag nanoprisms were employed as the cores for the overgrowth of Cu2O through the reduction of Cu(OH)4(2-) with ascorbic acid. The as-synthesized samples were characterized by XRD, TEM, SEM, HAADF-STEM, EDX, HRTEM, UV-vis spectra and N2 adsorption-desorption. The characterization results revealed that the as-synthesized Ag@Cu2O core-shell NPs exhibited a well-defined core-shell nanostructure with a polycrystalline shell, which was composed of numbers of Cu2O domains epitaxially growing on the triangular Ag nanoprism. It was concluded that the synthesis parameters such as the molar ratio of trisodium citrate to AgNO3, H2O2 to AgNO3, NaOH to CuSO4, ascorbic acid to CuSO4 and AgNO3 to CuSO4 had significant effect on the synthesis of Ag@Cu2O core-shell NPs. Moreover, Ag@Cu2O core-shell NPs exhibited superior catalytic activity in comparison with pristine Cu2O NPs towards the visible light-driven degradation of methyl orange. This enhanced photocatalytic activity of Ag@Cu2O core-shell NPs was attributed to the larger BET surface area and improved charge separation efficiency. The trapping experiment indicated that holes and superoxide anion radicals were the major reactive species in the photodegradation of methyl orange over Ag@Cu2O core-shell NPs. In addition, Ag@Cu2O core-shell NPs showed no obvious deactivation in the cyclic test.

  4. Ag-Cu Bimetallic Nanoparticles Prepared by Microemulsion Method as Catalyst for Epoxidation of Styrene

    Directory of Open Access Journals (Sweden)

    Hong-Kui Wang

    2012-01-01

    Full Text Available Ag/Cu bimetallic nanocatalysts supported on reticulate-like γ-alumina were prepared by a microemulsion method using N2H4·H2O as the reducing agent. The catalysts were activated by calcination followed with hydrogen reduction at 873K, and the properties were confirmed using various characterization techniques. Compared with metal oxides particles, Ag-Cu particles exhibited smaller sizes (<5 nm after calcination in H2 at 873K. XPS results indicated that the binding energies changed with the Ag/Cu ratios, suggesting that increasing the copper content gave both metals a greater tendency to lose electrons. Furthermore, Ag-Cu bimetallic nanoparticles supported on γ-alumina showed better catalytic activity on the epoxidation of styrene as compared with the corresponding monometallic silver or copper. The styrene oxide selectivity could reach 76.6% at Ag/Cu molar ratio of 3/1, while the maximum conversion (up to 94.6% appeared at Ag/Cu molar ratio of 1/1 because of the maximum interaction between silver and copper.

  5. Intermetallic compound formation in Sn-Co-Cu, Sn-Ag-Cu and eutectic Sn-Cu solder joints on electroless Ni(P) immersion Au surface finish after reflow soldering

    Energy Technology Data Exchange (ETDEWEB)

    Sun Peng [Key State Lab for New Displays and System Integration (Chinese Ministry of Education), SMIT Center, Shanghai University, 200072 Shanghai (China) and Department of Microtechnology and Nanoscience, SMIT Center, Chalmers University of Technology, 412-96 Goeteborg (Sweden)]. E-mail: peng.sun@mc2.chalmers.se; Andersson, Cristina [Department of Microtechnology and Nanoscience, SMIT Center, Chalmers University of Technology, 412-96 Goeteborg (Sweden); Wei Xicheng [Key State Lab for New Displays and System Integration (Chinese Ministry of Education), SMIT Center, Shanghai University, 200072 Shanghai (China); Cheng Zhaonian [Department of Microtechnology and Nanoscience, SMIT Center, Chalmers University of Technology, 412-96 Goeteborg (Sweden); Shangguan Dongkai [Flextronics International, San Jose, CA (United States); Liu Johan [Key State Lab for New Displays and System Integration (Chinese Ministry of Education), SMIT Center, Shanghai University, 200072 Shanghai (China); Department of Microtechnology and Nanoscience, SMIT Center, Chalmers University of Technology, 412-96 Goeteborg (Sweden)

    2006-11-25

    The interfacial reactions between Sn-0.4Co-0.7Cu eutectic alloy and immersion Au/electroless Ni(P)/Cu substrate were investigated after reflow soldering at 260 deg. C for 2 min. Common Sn-4.0Ag-0.5Cu and eutectic Sn-0.7Cu solders were used as reference. Two types of intermetallic compounds (IMC) were found in the solder matrix of the Sn-0.4Co-0.7Cu alloy, namely coarser CoSn{sub 2} and finer Cu{sub 6}Sn{sub 5} particles, while only one ternary (Cu, Ni){sub 6}Sn{sub 5} interfacial compound was detected between the solder alloy and the electroless nickel and immersion gold (ENIG) coated substrate. The same trend was also observed for the Sn-Ag-Cu and Sn-Cu solder joints. Compared with the CoSn{sub 2} particles found in the Sn-Co-Cu solder and the Ag{sub 3}Sn particles found in the Sn-Ag-Cu solder, the Cu{sub 6}Sn{sub 5} particles found in both solder systems exhibited finer structure and more uniform distribution. It was noted that the thickness of the interfacial IMCs for the Sn-Co-Cu, Sn-Ag-Cu and Sn-Cu alloys was 3.5 {mu}m, 4.3 {mu}m and 4.1 {mu}m, respectively, as a result of longer reflow time above the alloy's melting temperature since the Sn-Ag-Cu solder alloy has the lowest melting point.

  6. Ag-Cu nanoalloyed film as a high-performance cathode electrocatalytic material for zinc-air battery

    Science.gov (United States)

    Lei, Yimin; Chen, Fuyi; Jin, Yachao; Liu, Zongwen

    2015-04-01

    A novel Ag50Cu50 film electrocatalyst for oxygen reduction reaction (ORR) was prepared by pulsed laser deposition (PLD) method. The electrocatalyst actually is Ag-Cu alloyed nanoparticles embedded in amorphous Cu film, based on transmission electron microscopy (TEM) characterization. The rotating disk electrode (RDE) measurements provide evidence that the ORR proceed via a four-electron pathway on the electrocatalysts in alkaline solution. And it is much more efficient than pure Ag catalyst. The catalytic layer has maximum power density of 67 mW cm-2 and an acceptable cell voltage at 0.863 V when current densities increased up to 100 mA cm-2 in the Ag50Cu50-based primary zinc-air battery. The resulting rechargeable zinc-air battery exhibits low charge-discharge voltage polarization of 1.1 V at 20 mAcm-2 and high durability over 100 cycles in natural air.

  7. Evaluating print performance of Sn-Ag-Cu lead-free solder pastes used in electronics assembly process

    Science.gov (United States)

    Mallik, S.; Bauer, R.; Hübner, F.; Ekere, N. N.

    2011-01-01

    Solder paste is the most widely used interconnection material in the electronic assembly process for attaching electronic components/devices directly onto the surface of printed circuit boards, using stencil printing process. This paper evaluates the performance of three different commercially available Sn-Ag-Cu solder pastes formulated with different particle size distributions (PSD), metal content and alloy composition. A series of stencil printing tests were carried out using a specially designed stencil of 75 μm thickness and apertures of 300×300 μm2 dimension and 500 μm pitch sizes. Solder paste printing behaviors were found related to attributes such as slumping and surface tension and printing performance was correlated with metal content and PSD. The results of the study should benefit paste manufacturers and SMT assemblers to improve their products and practices.

  8. Diffusion Brazing of Ti-6Al-4V and Stainless Steel 316L Using AgCuZn Filler Metal

    Directory of Open Access Journals (Sweden)

    R. Soltani Tashi

    2013-09-01

    Full Text Available In the present study, vacuum brazing was applied to join Ti-6Al-4V and stainless steel using AgCuZn filler metal. The bonds were characterized by scanning electron microscopy, energy dispersive spectroscopy and X-ray diffraction analysis. Mechanical strengths of the joints were evaluated by the shear test and microhardness. It has been shown that shear strength decreased with increasing the brazing temperature and time. The wettability of the filler alloy was increased by enhancing the wetting test temperature. By increasing the brazing temperature various intermetallic compounds were formed in the bond area. These intermetallic compounds were mainly a combination of CuTi and Fe-Cu-Ti. The shear test results verified the influence of the bonding temperature on the strength of the joints based on the formation of different intermetallics in the bond zone. The fracture analysis also revealed different fracture footpath and morphology for different brazing temperatures.

  9. Microstructures and fatigue life of SnAgCu solder joints bearing Nano-Al particles in QFP devices

    Science.gov (United States)

    Zhang, Liang; Fan, Xi-ying; Guo, Yong-huan; He, Cheng-wen

    2014-05-01

    Microstructures and fatigue life of SnAgCu and SnAgCu bearing nano-Al particles in QFP (Quad flat package) devices were investigated, respectively. Results show that the addition of nano-Al particles into SnAgCu solder can refine the microstructures of matrix microstructure. Moreover, the nano-Al particles present in the solder matrix, act as obstacles which can create a back stress, resisting the motion of dislocations. In QFP device, it is found that the addition of nano-Al particles can increase the fatigue life by 32% compared with the SnAgCu solder joints during thermal cycling loading.

  10. Electromigration of Sn-3Ag-0.5Cu and Sn-3Ag-0.5Cu-0.5Ce-0.2Zn solder joints with Au/Ni(P)/Cu and Ag/Cu pads

    Energy Technology Data Exchange (ETDEWEB)

    Lin, H.-J., E-mail: HJLin@itri.org.t [Institute of Materials Science and Engineering, National Taiwan University, 1 Roosevelt St. Sec. 4, Taipei 106, Taiwan (China); Industrial Technology Research Institute, Mechanical and Systems Research Laboratories, Hsinchu 310, Taiwan (China); Lin, J.-S., E-mail: JohnnyLin@itri.org.t [Industrial Technology Research Institute, Mechanical and Systems Research Laboratories, Hsinchu 310, Taiwan (China); Department of Mechanical Engineering, Osaka University, Yamadaoka 2-1, Suita, Osaka 565-0871 (Japan); Chuang, T.-H., E-mail: tunghan@ntu.edu.t [Institute of Materials Science and Engineering, National Taiwan University, 1 Roosevelt St. Sec. 4, Taipei 106, Taiwan (China)

    2009-11-13

    It has previously been established that adding 0.2 wt.% Zn into a Sn-3Ag-0.5Cu-0.5Ce alloy improves the mechanical properties and eliminates the problem of rapid whisker growth. However, no detailed studies have been conducted on electromigration behavior of Sn-3Ag-0.5Cu-0.5Ce-0.2Zn alloy. The electromigration damage in solder joints of Sn-3Ag-0.5Cu and Sn-3Ag-0.5Cu-0.5Ce-0.2Zn with Ag/Cu pads and Au/Ni(P)/Cu pads was studied after current stressing at room temperature with an average current density of 3.1 x 10{sup 4} A/cm{sup 2}. With additions of 0.5 wt.% Ce and 0.2 wt.% Zn, the electromigration processes of Sn-Ag-Cu solder joints were accelerated due to refinement of the solder matrix when joint temperature was around 80 deg. C. Since Ni is more resistant than Cu to diffusion driven by electron flow, solder joints of both alloys (Sn-3Ag-0.5Cu and Sn-3Ag-0.5Cu-0.5Ce-0.2Zn) with Au/Ni(P)/Cu pads possess longer current-stressing lifetimes than those with Ag/Cu pads.

  11. Effect of the Vibrational Modes on the Ag-Cu Phase Diagram

    Institute of Scientific and Technical Information of China (English)

    DUAN Su-Qing; ZHAO Xian-Geng; LIU Shao-Jun; MA Ben-Kun

    2000-01-01

    We calculated the vibrational free energies of the selected ordered compounds in the Ag-Cu system by using two kinds of methods: (1) calculating the phonon dispersion and density of states and the consequently vibrational free energies by using the method of ab initio inverted interatomic potentials and dynamic matrix; (2) the vibrational free energies determined by a Debye-Griineisen approximation. The Ag-Cu phase diagram is calculated by the cluster variation method. The results show that the solubility at Ag-rich end of the calculated phase diagram considering vibrational modes by using the first method is in better agreement with the experimental.

  12. LED Die-Bonded on the Ag/Cu Substrate by a Sn-BiZn-Sn Bonding System

    Science.gov (United States)

    Tang, Y. K.; Hsu, Y. C.; Lin, E. J.; Hu, Y. J.; Liu, C. Y.

    2016-12-01

    In this study, light emitting diode (LED) chips were die-bonded on a Ag/Cu substrate by a Sn-BixZn-Sn bonding system. A high die-bonding strength is successfully achieved by using a Sn-BixZn-Sn ternary system. At the bonding interface, there is observed a Bi-segregation phenomenon. This Bi-segregation phenomenon solves the problems of the brittle layer-type Bi at the joint interface. Our shear test results show that the bonding interface with Bi-segregation enhances the shear strength of the LED die-bonding joints. The Bi-0.3Zn and Bi-0.5Zn die-bonding cases have the best shear strength among all die-bonding systems. In addition, we investigate the atomic depth profile of the deposited Bi-xZn layer by evaporating Bi-xZn E-gun alloy sources. The initial Zn content of the deposited Bi-Zn alloy layers are much higher than the average Zn content in the deposited Bi-Zn layers.

  13. Aging Characteristics of Sn-Ag Eutectic Solder Alloy with the Addition of Cu, In, and Mn

    Science.gov (United States)

    Ghosh, M.; Kar, Abhijit; Das, S. K.; Ray, A. K.

    2009-10-01

    In the present investigation, three types of solder alloy, i.e., Sn-Ag-Cu, Sn-Ag-In, and Sn-Ag-Cu-Mn, have been prepared and joined with Cu substrate. In the reflowed condition, the joint interface is decorated with Cu6Sn5 intermetallic in all cases. During aging at 100 °C for 50 to 200 hours, Cu3Sn formation took place in the diffusion zone of the Sn-Ag-Cu and Sn-Ag-In vs Cu assembly, which was not observed for the Sn-Ag-Cu-Mn vs Cu joint. Aging also leads to enhancement in the width of reaction layers; however, the growth is sluggish (~134 KJ/mol) for the Sn-Ag-Cu-Mn vs Cu transition joint. In the reflowed condition, the highest shear strength is obtained for the Sn-Ag-Cu-Mn vs Cu joint. Increment in aging time results in decrement in shear strength of the assemblies; yet small reduction is observed for the Sn-Ag-Cu-Mn vs Cu joint. The presence of Mn in the solder alloy is responsible for the difference in microstructure of the Sn-Ag-Cu-Mn solder alloy vs Cu assembly in the reflowed condition, which in turn influences the microstructure of the same after aging with respect to others.

  14. Atomic-scale investigation of interface-facilitated deformation twinning in severely deformed Ag-Cu nanolamellar composites

    Energy Technology Data Exchange (ETDEWEB)

    An, X. H., E-mail: anxianghai@gmail.com, E-mail: xiaozhou.liao@sydenye.edu.au; Cao, Y.; Liao, X. Z., E-mail: anxianghai@gmail.com, E-mail: xiaozhou.liao@sydenye.edu.au [School of Aerospace, Mechanical and Mechatronic Engineering, The University of Sydney, Sydney, New South Wales 2006 (Australia); Zhu, S. M.; Nie, J. F. [Department of Materials Engineering, Monash University, Melbourne, Victoria 3800 (Australia); Kawasaki, M. [Division of Materials Science and Engineering, Hanyang University, 17 Haengdang-dong, Seongdong-gu, Seoul 133-791 (Korea, Republic of); Ringer, S. P. [School of Aerospace, Mechanical and Mechatronic Engineering, The University of Sydney, Sydney, New South Wales 2006 (Australia); Australian Centre for Microscopy and Microanalysis, The University of Sydney, Sydney, New South Wales 2006 (Australia); Langdon, T. G. [Departments of Aerospace and Mechanical Engineering and Materials Science, University of Southern California, Los Angeles, California 90089-1453 (United States); Materials Research Group, Faculty of Engineering and the Environment, University of Southampton, Southampton SO17 1BJ (United Kingdom); Zhu, Y. T. [Department of Materials Science and Engineering, North Carolina State University, Raleigh, North Carolina 27695-7919 (United States); School of Materials Science and Engineering, Nanjing University of Science and Technology, Nanjing (China)

    2015-07-06

    We report an atomic-scale investigation of interface-facilitated deformation twinning behaviour in Ag-Cu nanolamellar composites. Profuse twinning activities in Ag supply partial dislocations to directly transmit across the Ag-Cu lamellar interface that promotes deformation twinning in the neighbouring Cu lamellae although the interface is severely deformed. The trans-interface twin bands change the local structure at the interface. Our analysis suggests that the orientation relationship and interfacial structure between neighbouring Ag-Cu lamellae play a crucial role in such special interface-facilitated twinning behaviour.

  15. Mechanical Deformation Behavior of Sn-Ag-Cu Solders with Minor Addition of 0.05 wt.% Ni

    Science.gov (United States)

    Hammad, A. E.; El-Taher, A. M.

    2014-11-01

    The aim of the present work is to develop a comparative evaluation of the microstructural and mechanical deformation behavior of Sn-Ag-Cu (SAC) solders with the minor addition of 0.05 wt.% Ni. Test results showed that, by adding 0.05Ni element into SAC solders, generated mainly small rod-shaped (Cu,Ni)6Sn5 intermetallic compounds (IMCs) inside the β-Sn phase. Moreover, increasing the Ag content and adding Ni could result in the change of the shape and size of the IMC precipitate. Hence, a significant improvement is observed in the mechanical properties of SAC solders with increasing Ag content and Ni addition. On the other hand, the tensile results of Ni-doped SAC solders showed that both the yield stress and ultimate tensile strengths decrease with increasing temperature and with decreasing strain rate. This behavior was attributed to the competing effects of work hardening and dynamic recovery processes. The Sn-2.0Ag-0.5Cu-0.05Ni solder displayed the highest mechanical properties due to the formation of hard (Cu,Ni)6Sn5 IMCs. Based on the obtained stress exponents and activation energies, it is suggested that the dominant deformation mechanism in SAC (205)-, SAC (0505)- and SAC (0505)-0.05Ni solders is pipe diffusion, and lattice self-diffusion in SAC (205)-0.05Ni solder. In view of these results, the Sn-2.0Ag-0.5Cu-0.05Ni alloy is a more reliable solder alloy with improved properties compared with other solder alloys tested in the present work.

  16. Characteristics of intermetallics and micromechanical properties during thermal ageing of Sn-Ag-Cu flip-chip solder interconnects

    Energy Technology Data Exchange (ETDEWEB)

    Li Dezhi [Wolfson School of Mechanical and Manufacturing Engineering, Loughborough University, Loughborough, Leicestershire LE11 3TU (United Kingdom); Liu Changqing [Wolfson School of Mechanical and Manufacturing Engineering, Loughborough University, Loughborough, Leicestershire LE11 3TU (United Kingdom)]. E-mail: c.liu@lboro.ac.uk; Conway, Paul P. [Wolfson School of Mechanical and Manufacturing Engineering, Loughborough University, Loughborough, Leicestershire LE11 3TU (United Kingdom)

    2005-01-25

    Sn-3.8 wt.% Ag-0.7 wt.% Cu solder was applied to Al-1 wt.% Cu bond pads with an electroless nickel (Ni-P) interlayer as an under bump metallisation (UBM). The microstructure and micromechanical properties were studied after ageing at 80 deg. C and 150 deg. C. Two types of intermetallic compounds (IMCs) were identified by electron back-scattered diffraction (EBSD), these being a (Cu, Ni){sub 6}Sn{sub 5} formed at the solder-UBM interface and Ag{sub 3}Sn in the bulk solder. The (Cu, Ni){sub 6}Sn{sub 5} layer grew very slowly during the ageing process, with no Kirkendall voids found by scanning electron microscopy (SEM) after ageing at 80 deg. C. Nano-indentation was used to analyse the mechanical properties of different phases in the solder. Both (Cu, Ni){sub 6}Sn{sub 5} and Ag{sub 3}Sn were harder and more brittle than the {beta}-Sn matrix of the Sn-Ag-Cu alloy. The branch-like morphology of the Ag{sub 3}Sn IMC, especially at the solder-UBM interface, could ultimately be detrimental to the mechanical integrity of the solder when assembled in flip-chip joints.

  17. Effects of bismuth on growth of intermetallic compounds in Sn-Ag-Cu Pb-free solder joints

    Institute of Scientific and Technical Information of China (English)

    LI Guo-yuan; SHI Xun-qing

    2006-01-01

    The effects of Bi addition on the growth of intermetallic compound (IMC) formation in Sn-3.8Ag-0.7Cu solder joints were investigated. The test samples were prepared by conventional surface mounting technology. To investigate the element diffusion and the growth kinetics of intermetallics formation in solder joint,isothermal aging test was performed at temperatures of 100,150,and 190 ℃,respectively. The optical microscope (OM) and scanning electron microscope (SEM) were used to observe microstructure evolution of solder joint and to estimate the thickness and the grain size of the intermetallic layers. The IMC phases were identified by energy dispersive X-ray (EDX) and X-ray diffractometer (XRD). The results clearly show that adding about 1.0% Bi in Sn-Ag-Cu solder alloy system can refine the grain size of the IMC and inhibit the excessive IMC growth in solder joints,and therefore improve the reliability of the Pb-free solder joints. Through observation of the microstructural evolution of the solder joints,the mechanism of inhibition of IMC growth due to Bi addition was proposed.

  18. Mechanical Characterization of Lead-Free Sn-Ag-Cu Solder Joints by High-Temperature Nanoindentation

    Science.gov (United States)

    Lotfian, S.; Molina-Aldareguia, J. M.; Yazzie, K. E.; Llorca, J.; Chawla, N.

    2013-06-01

    The reliability of Pb-free solder joints is controlled by their microstructural constituents. Therefore, knowledge of the solder microconstituents' mechanical properties as a function of temperature is required. Sn-Ag-Cu lead-free solder alloy contains three phases: a Sn-rich phase, and the intermetallic compounds (IMCs) Cu6Sn5 and Ag3Sn. Typically, the Sn-rich phase is surrounded by a eutectic mixture of β-Sn, Cu6Sn5, and Ag3Sn. In this paper, we report on the Young's modulus and hardness of the Cu6Sn5 and Cu3Sn IMCs, the β-Sn phase, and the eutectic compound, as measured by nanoindentation at elevated temperatures. For both the β-Sn phase and the eutectic compound, the hardness and Young's modulus exhibited strong temperature dependence. In the case of the intermetallics, this temperature dependence is observed for Cu6Sn5, but the mechanical properties of Cu3Sn are more stable up to 200°C.

  19. Mirroring the dynamic magnetic behavior of magnetostrictive Co/(Ag,Cu,Ta) multilayers grown onto rigid and flexible substrates

    Energy Technology Data Exchange (ETDEWEB)

    Agra, K.; Gomes, R.R. [Departamento de Física, Universidade Federal do Rio Grande do Norte, 59078-900 Natal, RN (Brazil); Della Pace, R.D. [Departamento de Física, Universidade Federal de Santa Catarina, 88040-900 Florianópolis, SC (Brazil); Departamento de Física, Universidade Federal de Santa Maria, 97105-900 Santa Maria, RS (Brazil); Dorneles, L.S. [Departamento de Física, Universidade Federal de Santa Maria, 97105-900 Santa Maria, RS (Brazil); Bohn, F. [Departamento de Física, Universidade Federal do Rio Grande do Norte, 59078-900 Natal, RN (Brazil); Corrêa, M.A., E-mail: marciocorrea@dfte.ufrn.br [Departamento de Física, Universidade Federal do Rio Grande do Norte, 59078-900 Natal, RN (Brazil)

    2015-11-01

    We investigate the magnetoimpedance effect in a wide frequency range in magnetostrictive Co/(Ag,Cu,Ta) multilayers grown onto rigid and flexible substrates. We observe a direct correlation between structural and quasi-static magnetic properties and the magnetoimpedance effect, since they are directly dependent on the nature of the spacer material. Moreover, we verify that all these properties are insensitive to the kind of employed substrate. We compare the magnetoimpedance results measured for multilayers in rigid and flexible substrates and discuss them in terms of different mechanisms that govern the impedances changes, magnetic anisotropy, structural character, and of numerical calculation results found in the literature. The fact that magnetostrictive multilayers can be reproduced in distinct kinds of substrates corresponds to an important advance for their applicability. The results place multilayers grown onto flexible substrates as attractive candidates for application as probe element in the development of MI-based sensor devices. - Highlights: • Correlation between structural and magnetic properties. • Dynamic magnetic behavior of multilayers trough MI effect. • Mirroring the dynamic magnetic behavior in flexible and rigid substrates. • Flexible substrate applications for magnetostrictive alloys.

  20. Green Synthesis of Ag-Cu Nanoalloys Using Opuntia ficus- indica

    Science.gov (United States)

    Rocha-Rocha, O.; Cortez-Valadez, M.; Hernández-Martínez, A. R.; Gámez-Corrales, R.; Alvarez, Ramón A. B.; Britto-Hurtado, R.; Delgado-Beleño, Y.; Martinez-Nuñez, C. E.; Pérez-Rodríguez, A.; Arizpe-Chávez, H.; Flores-Acosta, M.

    2017-02-01

    Bimetallic Ag/Cu nanoparticles have been obtained by green synthesis using Opuntia ficus- indica plant extract. Two synthesis methods were applied to obtain nanoparticles with core-shell and Janus morphologies by reversing the order of precursors. Transmission electronic microscopy revealed size of 10 nm and 20 nm for the core-shell and Janus nanoparticles, respectively. Other small particles with size of up to 2 nm were also observed. Absorption bands attributed to surface plasmon resonance were detected at 440 nm and 500 nm for the core-shell and Janus nanoparticles, respectively. Density functional theory predicted a breathing mode type (BMT) located at low wavenumber due to small, low-energy clusters of (AgCu) n with n = 2 to 9, showing a certain correlation with the experimental one (at 220 cm-1). The dependence of the BMT on the number of atoms constituting the cluster is also studied.

  1. [Determination of Ag, Cu, Zn and Cd in silver brazing filler metals by ICP-AES].

    Science.gov (United States)

    Yang, X

    1997-06-01

    A method of simultaneous and direct determination for Ag, Cu, Zn and Cd in silver brazing filler metals by ICP-AES is reported. The spectral interferences and effect of acidity have been investigated. Working conditions were optimized. The method has been applied to the analysis of silver brazing filler metals with RSD of 4-7% and recovery of 94-105%. This method was accurate, simple and rapid.

  2. Improvement on the microstructure stability, mechanical and wetting properties of Sn-Ag-Cu lead-free solder with the addition of rare earth elements

    Energy Technology Data Exchange (ETDEWEB)

    Yu, D.Q.; Zhao, J.; Wang, L

    2004-08-11

    Ternary lead-free solder alloys Sn-Ag-Cu were considered as the potential alternatives to lead-tin alloys comparing with other solders. In this paper, microstructure and mechanical properties of Sn-2.5Ag-0.7Cu, Sn-3.5Ag-0.7Cu, Sn-3.5Ag-0.7Cu-0.1RE, and Sn-3.5Ag-0.7Cu-0.25RE alloys were researched. Coarse {beta}-Sn grains were formed in Sn-2.5Ag-0.7Cu and Sn-3.5Ag-0.7Cu alloys and bulky Ag{sub 3}Sn intermetallics were found in Sn-3.5Ag-0.7Cu alloy. With the addition of trace rare earth (RE) elements the coarse {beta}-Sn grains were refrained, at the same time, Cu{sub 6}Sn{sub 5} and Ag{sub 3}Sn intermetallics were finer according to the adsorption affection of the active rare earth elements. Due to the fine and uniform microstructure, the tensile strength and elongation were improved. In addition, the wetting properties were also enhanced. All these results indicated that adding trace rare earth elements was an efficient way to develop new solders.

  3. Synthesis and Characterization of Monometallic (Ag, Cu and Bimetallic Ag-Cu Particles for Antibacterial and Antifungal Applications

    Directory of Open Access Journals (Sweden)

    Marta Paszkiewicz

    2016-01-01

    Full Text Available In this paper, the experimental studies are concerned with the effect of the synthesis parameters on the formation of monometallic Ag and Cu nanoparticles (NPs. We consider the synthesis strategies verification for the bimetallic core-shell and alloy particles preparation. It was successfully obtained by chemical reduction method. The obtained colloidal solution is characterized by the transmission electron microscopy (TEM with energy-dispersive X-ray spectroscopy (EDX data, UV-Vis spectra, particle size distribution, and zeta potential. This work presents a comprehensive overview of experimental studies of the most stable colloidal solutions to impregnate fabrics that will exhibit a bactericidal and fungicidal activity against Candida albicans, Escherichia coli, and Staphylococcus aureus.

  4. Effect of vertically oriented few-layer graphene on the wettability and interfacial reactions of the AgCuTi-SiO2f/SiO2 system.

    Science.gov (United States)

    Sun, Z; Zhang, L X; Qi, J L; Zhang, Z H; Hao, T D; Feng, J C

    2017-03-22

    With the aim of expanding their applications, particularly when joining metals, a simple but effective method is reported whereby the surface chemical reactivity of SiO2f/SiO2 (SiO2f/SiO2 stands for silica fibre reinforced silica based composite materials and f is short for fibre) composites with vertically oriented few-layer graphene (VFG, 3-10 atomic layers of graphene vertically oriented to the substrate) can be tailored. VFG was uniformly grown on the surface of a SiO2f/SiO2 composite by using plasma enhanced chemical vapour deposition (PECVD). The wetting experiments were conducted by placing small pieces of AgCuTi alloy foil on SiO2f/SiO2 composites with and without VFG decoration. It was demonstrated that the contact angle dropped from 120° (without VFG decoration) to 50° (with VFG decoration) when the holding time was 10 min. The interfacial reaction layer in SiO2f/SiO2 composites with VFG decoration became continuous without any unfilled gaps compared with the composites without VFG decoration. High-resolution transmission electron microscopy (HRTEM) was employed to investigate the interaction between VFG and Ti from the AgCuTi alloy. The results showed that VFG possessed high chemical reactivity and could easily react with Ti even at room temperature. Finally, a mechanism of how VFG promoted the wetting of the SiO2f/SiO2 composite by the AgCuTi alloy is proposed and thoroughly discussed.

  5. Characterization of Ag-Cu-S Thin Layers Formed on Low Density Polyethylene Film

    Directory of Open Access Journals (Sweden)

    Ingrida ANCUTIENĖ

    2011-09-01

    Full Text Available The Ag-Cu-S layer formed on PE demonstrated a wide variation in thickness. The cross-section showed the average thickness of sulfide layers on PE increase from 1.9 mm to 5.6 mm with the increase in the sulfurization time and from 1.9 mm to 3.9 mm with the increase of treating time in the solution of copper salts. The electronic micrographs of the sulfide layers indicate the creation of an irregular but continuous base of small dendrites and agglomerates. With the increase in the sulfurization time and treating time in copper (II/I salt solution observed an increase of the agglomerates size. Energy dispersive spectroscopy results indicate that modified layers are poor in copper (0.5 at. % - 1.5 at. %. The atomic ratios of Ag/Cu/S, calculated from the quantification of the peaks (excluded C and O elements give the values (% of 8.3:1.5:4.4, 8.7:0.5:4.3 and 23:1.2:10.9, respectively. In all cases, energy dispersive spectroscopy measurements revealed the modified layers are nearly stoichiometric Ag2S.http://dx.doi.org/10.5755/j01.ms.17.3.584

  6. Visible light degradation of textile effluent using nanostructured TiO2/Ag/CuO photocatalysts

    OpenAIRE

    Karthikeyan, N.; Narayanan, V.; Stephen, A

    2016-01-01

    TiO2, Ag and CuO nanomaterials, and nanostructured TiO2/Ag/CuO photocatalytic materials coupled in different weight percentages were synthesized. The prepared materials were characterized by XRD, SEM, EDX and UV-Vis diffuse reflectance spectroscopy. Photocatalytic degrading capabilities of the pure, as well as the nanostructured TiO2/Ag/CuO photocatalytic materials were tested on the dye effluent collected from the textile industries. The samples collected during the photocatalytic degradatio...

  7. Vacuum Brazing of TiAl Based Alloy with 40Cr Steel

    Institute of Scientific and Technical Information of China (English)

    周昀; 薛小怀; 吴鲁海; 楼松年

    2004-01-01

    The vacuum brazing of TiAl based alloy with 40Cr steel was investigated using Ag-Cu-Ti filler metal.The experimental results show that the Ag, Cu, Ti atoms in the filler metal and the base metal inter-diffuse toward each other during brazing and react at the interface to form an inter-metallic AlCu2Ti compound which joins two parts to produce a brazing joint with higher strength.

  8. Study on Manufacturing Process and Properties of Cross-layered Ag/Cu Composite for Fuse%贯穿复合银/铜熔体材料的工艺与性能研究

    Institute of Scientific and Technical Information of China (English)

    李仲才; 章应; 徐永红; 周晓荣

    2013-01-01

    介绍了贯穿复合银/铜熔体材料的研发和生产现状。复合银/铜熔体材料可替代目前广泛使用的纯银带用于熔断器行业。贯穿复合材料的坯料通过组合烧结的方式制备,界面添加银铜合金以提高结合强度;烧结后经过多道次轧制和热处理获得所需要的带材尺寸。该新型熔体材料较好地解决了熔断片与基座不易焊接的难题,同时节约贵金属银的用量,具有很好的推广应用前景。%Status of research and production of cross-layered Ag /Cu composite is introduced in this paper. This composite can be used to take place of pure silver strip in fuses. The cross-layered blank was fabricated by combination sintering. Ag-Cu alloy was placed in the interface between pure silver and pure copper so as to increase the bond strength. The sintered blank was then multi-pass rolled and heat treated to obtain the expected gauge. The welding difficulty between the pure silver fuse and the base is overcome effectively by applying this novel Ag/Cu composite. And the consumption of silver for fuse is decreased significantly. Therefore, the composite shows an extensive application prospect.

  9. Kinetics of Silver Dissolution in Nitric Acid from Ag-Au0.04-Cu0.10 and Ag-Cu0.23 Scraps

    Institute of Scientific and Technical Information of China (English)

    S.K.Sadrnezhaad; E.Ahmadi; M.Mozammel

    2006-01-01

    Kinetics of dissolution of silver present in precious metal scraps in HNO3 was studied in temperature range of 26~85℃. Dissolution rate of silver was much faster than that of copper at all temperatures. Effects of particle size, stirring speed, acid concentration and temperature on the rate of dissolving of silver were evaluated.Dissolution rate decreases with particle size and increases with temperature. Dissolving was accelerated with acid concentrations less than 10 mol/L. Concentrations greater than 10 mol/L resulted in slowing down of the dissolution rate. Shrinking core model with internal diffusion equation t/τ=1-3(1-x)2/3+2(1-x)could be used to explain the mechanism of the reaction. Silver extraction resulted in activation energies of 33.95 k J/mol for Ag-Au0.04-Cu0.10 and 68.87 k J/mol for Ag-Cu0.23 particles. Inter-diffusion of silver and nitrate ions through the porous region of the insoluble alloying layer was the main resistance to the dissolving process. Results were tangible for applications in recycling of the material from electronic silver-bearing scraps, dental alloys,jewelry, silverware and anodic slime precious metal recovery.

  10. Electrical characterization of the organic semiconductor Ag/CuPc/Au Schottky diode

    Institute of Scientific and Technical Information of China (English)

    Mutabar Shah; M. H. Sayyad; Kh. S. Karimov

    2011-01-01

    This paper reports on the fabrication and investigation of a surface-type organic semiconductor copper phthalocyanine (CuPc) based diode. A thin film of CuPc of thickness 100 nm was thermally sublimed onto a glass substrate with preliminary deposited metallic electrodes to form a surface-type Ag/CuPc/Au Schottky diode. The current-voltage characteristics were measured at room temperature under dark conditions. The barrier height was calculated as 1.05 eV. The values of mobility and conductivity was found to be 1.74 x l0-9 cm2/(V.s) and 5.5 x 10-6 Ω-1. cm-1, respectively. At low voltages the device showed ohmic conduction and the space charge limited current conduction mechanisms were dominated at higher voltages.

  11. Thermodynamic modeling of the Na-X (X = Si, Ag, Cu, Cr systems

    Directory of Open Access Journals (Sweden)

    Hao D.

    2012-01-01

    Full Text Available The Na-X (X = Si, Ag, Cu, Cr systems have been critically reviewed and modeled by means of the CALPHAD approach. The two compounds, NaSi and Ag2Na, are treated as stoichiometric ones. By means of first-principles calculations, the enthalpies of formation at 0 K for the LT-NaSi (low temperature form of NaSi and Ag2Na have been computed to be -5210 and -29821.8 Jmol-1, respectively, with the desire to assist thermodynamic modeling. One set of self-consistent thermodynamic parameters is obtained for each of these binary systems. Comparisons between calculated and measured phase diagrams show that most of the experimental information can be satisfactorily accounted for by the present thermodynamic descriptions.

  12. ANTIMICROBIAL ACTIVITY OF Ag+, Cu2+, Zn2+, Mg2+ IONS DOPED CHITOSAN NANOPARTICLES

    Directory of Open Access Journals (Sweden)

    Sukhodub LB

    2015-04-01

    Full Text Available Modification by polymers and inorganic ions of the bioactive materials for orthopedic implants with the purpose of initiating controlled reactions in tissues that surround the implant, is one of the modern approaches in medical materials. A key feature of functional polymers is their ability to form complexes with various metal ions in solution. Chitosan is natural biopolymer with pronounced affinity to transition metal ions. Some researches prove the higher antimicrobial activity of Chitosan-metal complexes compared with pure Chitosan. The purpose of this work was the study of antimicrobial activity of Chitosan nanoparticles modified by metal ions Ag+, Cu2+, Zn2+, Mg2+ against reference strains S. aureus 25923 ATSS, E. coli ATCC 25922, C. albicans ATCC 885653 for their further use as components of the composite biomaterials for medical purpose.Chitosan nanoparticles suspension was prepared by known method based on the ionotropic gelation between chitosan and sodium tripolyphosphate.To obtain Chitosan-metal nanoparticles to the Chitosan suspension were added the corresponding metal ions aqueous solutions in quantity to match the concentration of metal ions of 200 ppm . Antibacterial activities of Ag+, Cu2+, Zn2+, Mg2+ ions doped Chitosan nanoparticles, pure Chitosan nanoparticles, metal ions and 1% (v/v acetic acid solution (it was used as solvent for Chitosan against bacteria were evaluated by determination of minimum inhibitory concentration (MIC and minimum bactericidal concentration (MBC in vitro. Muller– Hinton (MH broth and MH agar (Russia were used as growth media. The bacteria suspension for further use was prepared with concentration that corresponded 0,5units by McFarland scale. The MIC was determined by a broth dilution method. The results were read after 24 hours of experimental tubes incubation at 37 oC as equivalent to the concentration of the tube without visible growth. To evaluate MBC, a sample of 0,1 ml was transferred from

  13. The study on interfacial bonding strength of Ag-Ni, Ag-Cu in cold pressure welding

    Institute of Scientific and Technical Information of China (English)

    李云涛; 杜则裕; 陈丽萍

    2003-01-01

    The area of combination actually is a kind of interfacial phenomena that exist on the surface or thin film. The properties of interface have important effect on the whole welded joint, even decide directly the interfacial bonding strength. The bonding strength of metals in cold pressure welding such as Ag-Ni (they are hardly mutual soluble) and Ag-Cu(they are limited soluble) are discussed in this paper. The results of the tensile test suggest that two kinds of welded joints have enough strength to satisfy with the demand for being used. Moreover, thermodynamics, crystal logy, physics and metal electronic microscopic analysis etc are adopted to further calculate the bonding strength. The results of test and theoretical analyses prove that Ag-Ni, Ag-Cu, especially, for Ag-Ni can form strong welded joint which is higher than that of the relative soft base metals in cold pressure welding.

  14. The effects of deposition time on surface morphology, structural, electrical and optical properties of sputtered Ag-Cu thin films

    Science.gov (United States)

    Ahmadpourian, Azin; Luna, Carlos; Boochani, Arash; Arman, Ali; Achour, Amine; Rezaee, Sahare; Naderi, Sirvan

    2016-10-01

    The preparation of designed nanostructured thin films combining nano grains of different compositions and physical properties represents a promising avenue for the exploration of novel collective behaviors with technological potentials. Herein, nanostructured Ag-Cu thin films with different surface morphology properties were grown by magnetron sputtering varying the deposition time (4-24 min) and fixing the other deposition conditions. X-ray diffraction studies corroborated that Cu and Ag tend to appear as separated phases with nanometric sizes due to the fact that these elements are rather immiscible. The deposited Cu tended to be partially oxidized with crystal sizes of several tens of nm, whereas the deposited Ag phase displayed a poor crystallinity with an average crystal size of around 3nm. However, at deposition time of few minutes, the formation of Ag-Cu crystals with a preferable crystallization orientation along the [111] direction was detected. The surface morphology of the obtained thin films was studied by atomic force microscopy determining the surface roughness and average particle sizes of the samples. These parameters were correlated with the plasmon resonance extinction bands of the different Ag-Cu films and their electrical properties, providing a reproducible route to obtain thin films with tuned electrical resistances and optical properties.

  15. Vibrational states on vicinal surfaces of Al, Ag, Cu and Pd

    Science.gov (United States)

    Sklyadneva, I. Yu.; Rusina, G. G.; Chulkov, E. V.

    1998-10-01

    We present the calculation of vibrational modes and lattice relaxation for the (110), (211), (311), (511), (331) and (221) surfaces of Al, Ag, Cu and Pd. The surface phonon frequencies and polarizations are obtained for relaxed and unrelaxed surfaces using embedded atom model potentials. On all surfaces studied step-localized vibrational modes and surface states localized on terrace atoms are found. It is shown that as the terrace width increases so does the number of surface phonons. It is found that interlayer relaxation leads to a shift in the frequencies of the surface states and to a change in the number and localization. In particular, it may cause the appearance or disappearance of step modes. It is shown that the character of relaxation on vicinal surfaces is determined by the number of atoms on a terrace. A comparison of the results with the available experimental data for the Al(221), Cu(211), and Cu(511) surfaces indicates that there is a good agreement with the experimental data.

  16. Electronic structure and conductivity of nanocomposite metal (Au,Ag,Cu,Mo)-containing amorphous carbon films

    Energy Technology Data Exchange (ETDEWEB)

    Endrino, Jose L.; Horwat, David; Gago, Raul; Andersson, Joakim; Liu, Y.S.; Guo, Jinghua; Anders, Andre

    2008-05-14

    In this work, we study the influence of the incorporation of different metals (Me = Au, Ag, Cu, Mo) on the electronic structure of amorphous carbon (a-C:Me) films. The films were produced at room temperature using a novel pulsed dual-cathode arc deposition technique. Compositional analysis was performed with secondary neutral mass spectroscopy whereas X-ray diffraction was used to identify the formation of metal nanoclusters in the carbon matrix. The metal content incorporated in the nanocomposite films induces a drastic increase in the conductivity, in parallel with a decrease in the band gap corrected from Urbach energy. The electronic structure as a function of the Me content has been monitored by x-ray absorption near edge structure (XANES) at the C K-edge. XANES showed that the C host matrix has a dominant graphitic character and that it is not affected significantly by the incorporation of metal impurities, except for the case of Mo, where the modifications in the lineshape spectra indicated the formation of a carbide phase. Subtle modifications of the spectral lineshape are discussed in terms of nanocomposite formation.

  17. Influence of Sn on Microstructure and Performance of Electric Vacuum Ag-Cu Filler Metal

    Directory of Open Access Journals (Sweden)

    SHI Lei

    2016-10-01

    Full Text Available Influence of Sn on microstructure, melting characteristic and brazing performance of electric vacuum Ag-Cu filler metal was studied by using scanning electronic microscope (SEM with energy disperse spectroscopy (EDS, differential scanning calorimetry (DSC and contrast tests. The results show that, while the addition of Sn is 4% (mass fraction,the same below, there is no brittle β-Cu phase in Ag60Cu filler metal,the effect on the processing performance is not obvious; with the increase of Sn content, the liquidus temperature of Ag60Cu filler metal decreases gradually, but the solidus temperature drops drastically,resulting in wider melting temperature range, and worse gap filling ability of filler metal. The Ag60Cu filler metal with Sn content of 4% has good spreading and metallurgical bonding abilities on copper plates, which are closer to that of BAg72Cu filler metal, and it can be processed into flake filler metal to replace the BAg72Cu flake filler metal to be used.

  18. Interface Structure and Electrical Property of Yb0.3Co4Sb12/Mo-Cu Element Pre-pared by Welding Using Ag-Cu-Zn Solder%Yb0.3Co4Sb12/Mo-Cu热电元件的界面结构与界面电阻

    Institute of Scientific and Technical Information of China (English)

    唐云山; 柏胜强; 任都迪; 廖锦城; 张澜庭; 陈立东

    2015-01-01

    通过放电等离子烧结(SPS)实现阻挡层 Ti-Al、过渡焊接层 Ni 与热电臂 Yb0.3Co4Sb12的一体化烧结,使用Ag-Cu-Zn 共晶合金完成热电元件 Yb0.3Co4Sb12/Ti-Al/Ni 与 Mo-Cu 电极的钎焊连接。扫描电镜(SEM)显示出Yb0.3Co4Sb12/Ti-Al/Ni/Ag-Cu-Zn/Mo-Cu 接头中各界面结合良好,无裂纹,成分分析发现 Yb0.3Co4Sb12/Ti-Al 界面存在AlCo、TiCoSb及TiSb2等金属间化合物(IMC)。500℃下等温时效30 d后, Yb0.3Co4Sb12/Ti-Al界面处的金属间化合物厚度无明显变化; Ag-Cu-Zn/Ni界面处Cu、Zn扩散趋于稳定, Cu-Zn扩散层厚度达到约40μm。界面接触电阻测试结果表明,等温时效前后Yb0.3Co4Sb12/Ti-Al/Ni/Ag-Cu-Zn/Mo-Cu元件的界面接触电阻率均低于10μΩ·cm2。%The barrier layer of Ti-Al and the contact layer of Ni were joined to Yb0.3Co4Sb12 simultaneously by us-ing spark plasma sintering (SPS) technique. The Mo-Cu electrode was then welded to thermoelectric element Yb0.3Co4Sb12/Ti-Al/Ni by using Ag-Cu-Zn alloy as solder. SEM results show that there are no cracks at the inter-faces of Yb0.3Co4Sb12/Ti-Al/Ni/Ag-Cu-Zn/Mo-Cu thermoelectric joints. The EDS analysis shows that intermetallic compounds (IMCs) layer containing AlCo, TiCoSb and TiSb2 phases are formed at the interface between Yb0.3Co4Sb12 and Ti-Al. After thermal aging at 500℃ for 30 d, the inter-diffusions at both Yb0.3Co4Sb12/Ti-Al inter-face and Ag-Cu-Zn/Ni interface tend to be steady. The contact electrical resistivity of the Yb0.3Co4Sb12/ Ti-Al/Ni/Ag-Cu-Zn/Mo-Cu thermoelectric joints are about 6.1μΩ·cm2after welding, and it maintained as low as 10μΩ·cm2 even after thermal aged for 30 d.

  19. Enhanced photocatalytic, electrochemical and photoelectrochemical properties of TiO{sub 2} nanotubes arrays modified with Cu, AgCu and Bi nanoparticles obtained via radiolytic reduction

    Energy Technology Data Exchange (ETDEWEB)

    Nischk, Michał [Department of Chemical Technology, Faculty of Chemistry, Gdansk University of Technology, 11/12 G. Narutowicza 11/12 St., 80-233 Gdansk (Poland); Department of Environmental Technology, Faculty of Chemistry, University of Gdansk, 63 Wita Stwosza St., 80-308 Gdansk (Poland); Mazierski, Paweł [Department of Environmental Technology, Faculty of Chemistry, University of Gdansk, 63 Wita Stwosza St., 80-308 Gdansk (Poland); Wei, Zhishun [Institute for Catalysis, Hokkaido University, N21, W10, 001-0021, Sapporo (Japan); Siuzdak, Katarzyna [Centre for Plasma and Laser Engineering, The Szewalski Institute of Fluid-Flow Machinery, Polish Academy of Sciences, 14 Fiszera St., 80-231 Gdansk (Poland); Kouame, Natalie Amoin [Laboratoire de Chimie Physique, CNRS—UMR 8000,Université Paris-Sud, Université Paris-Saclay, Bâtiment 349, 91405 Orsay (France); Kowalska, Ewa [Institute for Catalysis, Hokkaido University, N21, W10, 001-0021, Sapporo (Japan); Remita, Hynd [Laboratoire de Chimie Physique, CNRS—UMR 8000,Université Paris-Sud, Université Paris-Saclay, Bâtiment 349, 91405 Orsay (France); Zaleska-Medynska, Adriana, E-mail: adriana.zaleska@ug.edu.pl [Department of Environmental Technology, Faculty of Chemistry, University of Gdansk, 63 Wita Stwosza St., 80-308 Gdansk (Poland)

    2016-11-30

    Highlights: • TiO{sub 2} nanotubes were modified with Cu, AgCu, Bi nanoparticles via gamma radiolysis. • Excessive amount of deposited metal decreased photocatalytic activity. • AgCu-modified samples were more active than Cu-modified (with the same Cu content). • AgCu nanoparticles exist in a core{sub (Ag)}-shell{sub (Cu)} form. • Examined photocatalysts were resistant towards photocorrosion processes. - Abstract: TiO{sub 2} nanotubes arrays (NTs), obtained via electrochemical anodization of Ti foil, were modified with monometallic (Cu, Bi) and bimetallic (AgCu) nanoparticles. Different amounts of metals’ precursors were deposited on the surface of NTs by the spin-coating technique, and the reduction of metals was performed via gamma radiolysis. Surface modification of titania was studied by EDS and XPS analysis. The results show that AgCu nanoparticles exist in a Ag{sub core}-Cu{sub shell} form. Photocatalytic activity was examined under UV irradiation and phenol was used as a model pollutant of water. Over 95% of phenol degradation was achieved after 60 min of irradiation for almost all examined samples, but only slight difference in degradation efficiency (about 3%) between modified and bare NTs was observed. However, the initial phenol degradation rate and TOC removal efficiency was significantly enhanced for the samples modified with 0.31 and 0.63 mol% of Bi as well as for all the samples modified with Cu and AgCu nanoparticles in comparison with bare titania nanotubes. The saturated photocurrent, under the influence of simulated solar light irradiation, for the most active Bi- and AgCu-modified samples, was over two times higher than for pristine NTs. All the examined materials were resistant towards photocorrosion processes that enables their application for long term processes induced by light.

  20. Critical evaluations of lead-free solder alloys and performance comparisons

    Energy Technology Data Exchange (ETDEWEB)

    Hitch, T.T.; Palit, K.; Prabhu, A.N. [David Sarnoff Research Center, Princeton, NJ (United States)

    1996-12-31

    This paper discusses the methodology for solder alloy selection, solder preparation processes, test selection, results, and conclusions. The conclusions from this phase of study were that: (1). Solders containing significant amounts of bismuth exhibit poor fatigue life. (2). The Sn-Ag-Cu alloy was the best solder we studied for use as a replacement for Sn-Pb eutectic. A second phase of the work involved detailed study of the Sn-Ag-Cu system with other additions to determine the optimum lead-free solder compositions in terms of melting point, solderability, and mechanical properties.

  1. Analysis of wear properties of aluminium based journal bearing alloys with and without lubrication.

    Science.gov (United States)

    Mathavan, J. Joy; Patnaik, Amar

    2016-09-01

    Apart from classical bearing materials, Aluminium alloys are used as bearing materials these days because of their superior quality. In this analysis, new Aluminium based bearing materials, with filler metals Si, Ni, and Cr are prepared by metal mould casting in burnout furnace machine, and tribological properties of these alloys with and without lubrication were tested. The experiments for wear with lubrication are conducted on multiple specimen tester and experiments without lubrication is conducted on Pin on disk tribometer. The disc material used was SAE 1050 steel. Wear tests were conducted at a sliding speed of 0.785 m/s and at a normal load of 20 N. Coefficient of friction values, temperature changes and wear of the specimens were plotted on graph according to the above mentioned working conditions. Hardness and weight losses of the specimens were calculated. The obtained results demonstrate how the friction and wear properties of these samples have changed with the % addition of Silicon, Chromium and Nickel to the base metal aluminium.

  2. Development of a new Pb-free solder: Sn-Ag-Cu

    Energy Technology Data Exchange (ETDEWEB)

    Miller, C.M.

    1995-02-10

    With the ever increasing awareness of the toxicity of Pb, significant pressure has been put on the electronics industry to get the Pb out of solder. This work pertains to the development and characterization of an alloy which is Pb-free, yet retains the proven positive qualities of current Sn-Pb solders while enhancing the shortcomings of Sn-Pb solder. The solder studied is the Sn-4.7Ag-1.7Cu wt% alloy. By utilizing a variety of experimental techniques the alloy was characterized. The alloy has a melting temperature of 217{degrees}C and exhibits eutectic melting behavior. The solder was examined by subjecting to different annealing schedules and examining the microstructural stability. The effect of cooling rate on the microstructure of the solder was also examined. Overall, this solder alloy shows great promise as a viable alternative to Pb-bearing solders and, as such, an application for a patent has been filed.

  3. Effect of Silver Content on Microstructure and Properties of Brass/steel Induction Brazing Joint Using Ag-Cu-Zn-Sn Filler Metal

    Institute of Scientific and Technical Information of China (English)

    J. Cao; L.X. Zhang; H.Q. Wang; L.Z. Wu; C. Feng

    2011-01-01

    The induction brazing of brass to steel using Ag-Cu-Zn-Sn filler metal was investigated in this study. The influence of Ag content on the microstructure and properties were analyzed by means of optical microscopy, scanning electron microscopy and electron probe microanalysis. Defect free joint was achieved using Ag-Cu-Zn-Sn filler metal. The microstructure of the joint was mainly composed of Ag-based solid solution and Cu-based solid solution. The increase of Ag content and the cooling rate both led to the increase of the needle like eutectic structure. The tensile strength decreased with the increase of Ag content. The tensile strength at room temperature using Ag25CuZnSn filler metal reached 445 MPa. All fractures using Ag-Cu-Zn-Sn filler metal presented ductile characteristic.

  4. Efficient enhancement of hydrogen production by Ag/Cu{sub 2}O/ZnO tandem triple-junction photoelectrochemical cell

    Energy Technology Data Exchange (ETDEWEB)

    Liu, Ying; Ren, Feng, E-mail: fren@whu.edu.cn; Chen, Chao; Liu, Chang; Xing, Zhuo; Liu, Dan; Xiao, Xiangheng; Wu, Wei; Zheng, Xudong; Liu, Yichao; Jiang, Changzhong [Center for Ion Beam Application and Center for Electron Microscopy, School of Physics and Technology, Wuhan University, Wuhan 430072 (China); Shen, Shaohua; Fu, Yanming [International Research Center for Renewable Energy, State Key Laboratory of Multiphase Flow in Power Engineering, Xi' an Jiaotong University, Xi' an 710049 (China)

    2015-03-23

    Highly efficient semiconductor photoelectrodes for solar hydrogen production through photocatalytic water splitting are a promising and challenge solution to solve the energy problems. In this work, Ag/Cu{sub 2}O/ZnO tandem triple-junction photoelectrode was designed and prepared. An increase of 11 times of photocurrent is achieved in the Ag/Cu{sub 2}O/ZnO photoelectrode comparing to that of the Cu{sub 2}O film. The high performance of the Ag/Cu{sub 2}O/ZnO film is due to the optimized design of the tandem triple-junction structure, where the localized surface Plasmon resonance of Ag and the hetero-junctions efficiently absorb solar energy, produce, and separate electron-hole pairs in the photocathode.

  5. Ag/CuMoO4催化剂的水热合成以及其形貌、光催化研究

    Institute of Scientific and Technical Information of China (English)

    夏菁

    2014-01-01

    以(NH4)6Mo7O24·4H2O和CuCl2为原料,通过水热法合成了光催化剂CuMoO4以及通过光还原技术成功制备了Ag/CuMoO4的纳米线.通过XRD、SEM和UV-Vis吸收光谱等测试手段对所得催化剂形貌和催化活性进行表征.结果表明:CuMoO4在50mins可将罗丹明B降解率达到40%,Ag/CuMoO4可将罗丹明B降解率达到95%,由此说明Ag/CuMoO4是一种性能优良的光催化剂.

  6. Growth behavior of intermetallic compounds at Sn–Ag/Cu joint interfaces revealed by 3D imaging

    Energy Technology Data Exchange (ETDEWEB)

    Zhang, Q.K., E-mail: qkzhang@alum.imr.ac.cn [Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016 (China); State Key Laboratory of Advanced Brazing Filler Metals & Technology, Zhengzhou Research Institute of Mechanical Engineering, Zhengzhou 450001 (China); Long, W.M. [State Key Laboratory of Advanced Brazing Filler Metals & Technology, Zhengzhou Research Institute of Mechanical Engineering, Zhengzhou 450001 (China); Zhang, Z.F., E-mail: zhfzhang@imr.ac.cn [Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016 (China)

    2015-10-15

    In this study, the morphologies of intermetallic compounds (IMCs) at the as-soldered and thermal aged Sn–Ag/Cu joint interfaces were observed by SEM and measured using Laser Confocal Microscope, and their three-dimensional (3D) shapes were revealed using 3D imaging technology. The observation reveal that during the soldering process the Cu{sub 6}Sn{sub 5} grains at the joint interface evolve from hemispheroid to a bamboo shoot-shaped body with increasing liquid state reacting time, and their grain size increases sharply. After thermal aging, the Cu{sub 6}Sn{sub 5} grains change into equiaxed grains, while the top of some prominent Cu{sub 6}Sn{sub 5} grains changes little. Due to the higher active energy of the Sn atoms at the grain boundary, the growth rate of IMC grains around the grain boundaries of the solder is higher during the aging process. From the evolution in morphology of the IMC layer, it is demonstrated that the IMC layer grows through grain boundary diffusion of the Cu and Sn atoms during the aging process, and the volume diffusion is very little. The 3D imaging technology is used to reveal the shape and dimension of the IMC grains. - Highlights: • Morphologies of IMCs at the Sn–Ag/Cu interface were revealed by 3D imaging. • Preferential growth of IMCs around the solder grain boundaries was observed. • Growth behaviors of IMCs during reflowing and aging process were investigated.

  7. Research on Physical Properties of Sn-Ag-Cu-Sb Solder%Sn-Ag-Cu-Sb无铅焊料物理性能

    Institute of Scientific and Technical Information of China (English)

    桂太龙; 袁力鹏; 郝龙; 贾伟; 董小丽

    2011-01-01

    为了获得不同性能的电子封装焊料,制备了掺杂Sb(锑)的Sn-3.35Ag-0.7Cu无铅焊料合金,并对其密度、杨氏模量、硬度等重要物理性能进行了测定.测得该无铅焊料的密度为7.2106g/cm3,杨氏模量为43 GPa,硬度为96.7 N/mm2.实验结果表明,同未掺杂Sn-3.35Ag-0.7Cu焊料合金相比,硬度略有降低,熔点下降不明显,但密度有显著降低,杨氏模量、润湿性有明显的提高.%We prepare of the doped Sb (antimony) of the Sn-3.35Ag-0. 7Cu lead-free solder alloy. Its important physical properties were measured: density, Young's modulus, hardness and so on. The density is 7. 210 6g/cm3, Young' s modulus is 43GPa, and the hardness is 96.7 N/mm2. The experimental results show that nondoped with Sn -3.35Ag -0. 7Cu solder alloys, the hardness slightly lower, the melting points do not drop obviously than that not doped. However, there is a significant reduction in density. Young's modulus and wetting p properties are significantly improved.

  8. Liquid and solid state interfacial reactions of Sn-Ag-Cu and Sn-In-Ag-Cu solders with Ni-P under bump metallization

    Energy Technology Data Exchange (ETDEWEB)

    Sharif, Ahmed [Department of Electronic Engineering, City University of Hong Kong, Tat Chee Avenue, Kowloon Tong, Hong Kong (China); Chan, Y.C. [Department of Electronic Engineering, City University of Hong Kong, Tat Chee Avenue, Kowloon Tong, Hong Kong (China)]. E-mail: EEYCCHAN@cityu.edu.hk

    2006-05-10

    In this study, interfacial reactions of electroless Ni(P) metallization of the ball-grid-array (BGA) substrate with the Sn-4 Ag-0.5 Cu (SAC405), Sn-3 Ag-0.5 Cu (SAC305) and Sn-9 In-3.5 Ag-0.5 Cu (SIAC) (wt.%) solder alloy were investigated, focusing on identification of the intermetallic compound (IMC) phases, the IMC growth rates and the consumption rate of the metallization layer at various liquid and solid state heat treatment conditions, e.g. extended reflow and solid state aging. A fixed volume of BGA solder ball (760 {mu}m diameter) was used on a substrate metallization pad with a diameter of 650 {mu}m. The consumption of the electroless Ni(P) in SIAC solder was also lower than in the SAC solders. The presence of indium in the solder played a major role in inhibiting the consumption of Ni(P) in the soldering reaction. The stable IMCs initially formed at the interface of the Ni(P)/In-containing solder system was the (Cu, Ni){sub 6} (Sn, In){sub 5} phase. During further reflow, the (Cu, Ni){sub 3} (Sn, In){sub 4} IMC started forming because of the limited Cu content in the solder. Bulk of the SIAC solder also contained Cu{sub 6}(Sn, In){sub 5} and Ag-In-Sn precipitates embedded in the Sn-rich matrix. It was also found that more Ag-containing SAC405 solder shows higher Ni(P) consumption than SAC305 solder at the same heat treatment condition.

  9. A bamboo-inspired hierarchical nanoarchitecture of Ag/CuO/TiO2 nanotube array for highly photocatalytic degradation of 2,4-dinitrophenol.

    Science.gov (United States)

    Zhang, Xuhong; Wang, Longlu; Liu, Chengbin; Ding, Yangbin; Zhang, Shuqu; Zeng, Yunxiong; Liu, Yutang; Luo, Shenglian

    2016-08-05

    The optimized geometrical configuration of muitiple active materials into hierarchical nanoarchitecture is essential for the creation of photocatalytic degradation system that can mimic natural photosynthesis. A bamboo-like architecture, CuO nanosheets and Ag nanoparticles co-decorated TiO2 nanotube arrays (Ag/CuO/TiO2), was fabricated by using simple solution-immersion and electrodeposition process. Under simulated solar light irradiation, the 2,4-dinitrophenol (2,4-DNP) photocatalytic degradation rate over Ag/CuO/TiO2 was about 2.0, 1.5 and 1.2 times that over TiO2 nanotubes, CuO/TiO2 and Ag/TiO2, respectively. The enhanced photocatalytic activity of ternary Ag/CuO/TiO2 photocatalyst was ascribed to improved light absorption, reduced carrier recombination and more exposed active sites. Moreover, the excellent stability and reliability of the Ag/CuO/TiO2 photocatalyst demonstrated a promising application for organic pollutant removal from water.

  10. Enhanced photocatalytic, electrochemical and photoelectrochemical properties of TiO2 nanotubes arrays modified with Cu, AgCu and Bi nanoparticles obtained via radiolytic reduction

    Science.gov (United States)

    Nischk, Michał; Mazierski, Paweł; Wei, Zhishun; Siuzdak, Katarzyna; Kouame, Natalie Amoin; Kowalska, Ewa; Remita, Hynd; Zaleska-Medynska, Adriana

    2016-11-01

    TiO2 nanotubes arrays (NTs), obtained via electrochemical anodization of Ti foil, were modified with monometallic (Cu, Bi) and bimetallic (AgCu) nanoparticles. Different amounts of metals' precursors were deposited on the surface of NTs by the spin-coating technique, and the reduction of metals was performed via gamma radiolysis. Surface modification of titania was studied by EDS and XPS analysis. The results show that AgCu nanoparticles exist in a Agcore-Cushell form. Photocatalytic activity was examined under UV irradiation and phenol was used as a model pollutant of water. Over 95% of phenol degradation was achieved after 60 min of irradiation for almost all examined samples, but only slight difference in degradation efficiency (about 3%) between modified and bare NTs was observed. However, the initial phenol degradation rate and TOC removal efficiency was significantly enhanced for the samples modified with 0.31 and 0.63 mol% of Bi as well as for all the samples modified with Cu and AgCu nanoparticles in comparison with bare titania nanotubes. The saturated photocurrent, under the influence of simulated solar light irradiation, for the most active Bi- and AgCu-modified samples, was over two times higher than for pristine NTs. All the examined materials were resistant towards photocorrosion processes that enables their application for long term processes induced by light.

  11. Impact of an Elevated Temperature Environment on Sn-Ag-Cu Interconnect Board Level High-G Mechanical Shock Performance

    Science.gov (United States)

    Lee, Tae-Kyu; Chen, Zhiqiang; Baty, Greg; Bieler, Thomas R.; Kim, Choong-Un

    2016-12-01

    The mechanical stability of Sn-Ag-Cu interconnects with low and high silver content against mechanical shock at room and elevated temperatures was investigated. With a heating element-embedded printed circuit board design, a test temperature from room temperature to 80°C was established. High impact shock tests were applied to isothermally pre-conditioned ball-grid array interconnects. Under cyclic shock testing, degradation and improved shock performances were identified associated with test temperature variation and non-solder mask defined and solder-mask defined pad design configuration differences. Different crack propagation paths were observed, induced by the effect of the elevated temperature test conditions and isothermal aging pre-conditions.

  12. EFFECT OF BRAZING TIME ON TiC CERMET/IRON JOINT BRAZED WITH Ag-Cu-Zn FILLER METAL

    Institute of Scientific and Technical Information of China (English)

    L.X. Zhang; J.C. Feng; Z.R. Li; H.J. Liu

    2004-01-01

    The brazing of TiC cermet to iron was carried out at 1223K for 5-20min using Ag-Cu-Zn filler metal. The formation phase and interface structure of the joints were investigated by electron probe microanalysis (EPMA), scanning electron microscopy (SEM) and X-ray diffraction (XRD), and the joint strength was tested by shearing method. The results showed: there occurred three new formation phases, Cu(s.s), FeNi and Ag(s.s) in TiC cermet/iron joint. The interface structure was expressed as TiC cermet/Cu(s.s)+FeNi/Ag(s.s)+a little Cu(s.s)+a little FeNi/Cu(s.s)+ FeNi/iron. With brazing time increasing, there appeared highest shear strength of the joints, the value of which was up to 252.2MPa when brazing time was 10min.

  13. Thermomechanical Behavior of Monolithic SN-AG-CU Solder and Copper Fiber Reinforced Solders

    Science.gov (United States)

    2005-09-01

    controlled fatigue life, likely because of increased void -nucleation via creep-fatigue interactions. Since the solder is largely under strain-controlled...to plastically deform the solder in order to break the oxide layers and eliminate some minor voids around the NiTi particles. Figure 32... Underfill Constraint Effects during Thermomechanical Cycling of Flip Chip Solder Joints,” Journal of Electronic Materials, Vol. 31, No. 4, 2002

  14. INFLUENCE OF IMC ON THE INTERFACE FAILURE OF TIN-SILVER-COPPER SOLDER JOINTS%金属间化合物对SnAgCu/Cu界面破坏行为的影响

    Institute of Scientific and Technical Information of China (English)

    李晓延; 严永长; 史耀武

    2005-01-01

    无铅焊接与封装是对新一代电子产品的基本要求,SnAgCu系合金是最有可能替代SnPb焊料的无铅焊料.SnAgCu-Cu界面金属间化合物(intermetallic components,IMC)的形成与生长对电子产品的性能和可靠性有重要影响.文中讨论SnAgCu-Cu界面IMC的形貌及组织演变,介绍SnAgCu-Cu界面IMC的形成、生长机理和表征方法,分析IMC对SnAgCu-Cu界面破坏行为的影响.

  15. The compression stress-strain behavior of Sn-Ag-Cu solder

    Science.gov (United States)

    Vianco, Paul T.; Rejent, Jerome A.; Martin, Joseph J.

    2003-06-01

    The yield-stress behavior was investigated for the 95.5Sn-4.3Ag-0.2Cu (wt.%), 95.5Sn-3.9Ag-0.6Cu, and 95.5Sn-3.8Ag-0.7Cu ternary lead-free solders using the compression stress-strain test technique. Cylindrical specimens were evaluated in the as-cast or aged (125°C, 24 h) condition. The tests were performed at -25°C, 25°C, 75°C, 125°C, and 160°C using strain rates of 4.2×10-5s-1 or 8.3×10-4s-1. Specially designed Sn-Ag-0.6Cu samples were fabricated to compare the yield stress of the dendritic microstructure versus that of the equiaxed microstructure that occurs in this alloy.

  16. The crystal structure of Gabrielite, Tl2AgCu2As3S7, a new species of Thallium Sulfosalt from Lengenbach, Switzerland

    DEFF Research Database (Denmark)

    Balic-Zunic, Tonci; Makovicky, Emil; Karanovic, Ljiljana

    2006-01-01

    Gabrielite, Tl2AgCu2As3S7, is a new species of sulfosalt mineral occurring in the famous Lengenbach locality, at Binntal, Canton Valais, Switzerland. It was discovered in association with numerous other As sulfosalts, such as hutchinsonite, hatchite, edenharterite, trechmannite, tennantite...... formula Tl6(Ag,Cu)3IV(Cu,Ag)6III[(As,Sb)S3]3[(As,Sb)2S4]3; the empirical formula obtained from the microprobe data is Tl5.95(Ag2.56Cu6.46) 9.02(As8.23Sb0.48) 8.71S21. The name of the mineral honors Walter Gabriel, of Basel, Switzerland, well-known mineral photographer and expert of Lengenbach minerals....

  17. PANI-Ag-Cu Nanocomposite Thin Films Based Impedimetric Microbial Sensor for Detection of E. coli Bacteria

    Directory of Open Access Journals (Sweden)

    Huda Abdullah

    2014-01-01

    Full Text Available PANI-Ag-Cu nanocomposite thin films were prepared by sol-gel method and deposited on the glass substrate using spin coating technique. Polyaniline was synthesized by chemical oxidative polymerization of aniline monomer in the presence of nitric acid. The films were characterized using XRD, FTIR, and UV-Visible spectroscopy. The performance of the sensor was conducted using electrochemical impedance spectroscopy to obtain the change in impedance of the sensor film before and after incubation with E. coli bacteria in water. The peaks in XRD pattern confirm the presence of Ag and Cu nanoparticles in face-centered cubic structure. FTIR analysis shows the stretching of N–H in the polyaniline structure. The absorption band from UV-Visible spectroscopy shows high peaks between 400 nm and 500 nm which indicate the presence of Ag and Cu nanoparticles, respectively. Impedance analysis indicates that the change in impedance of the films decreases with the presence of E. coli. The sensitivity on E. coli increases for the sample with high concentration of Cu.

  18. Degradation of organic pollutants by Ag, Cu and Sn doped waste non-metallic printed circuit boards.

    Science.gov (United States)

    Ramaswamy, Kadari; Radha, Velchuri; Malathi, M; Vithal, Muga; Munirathnam, Nagegownivari R

    2017-02-01

    The disposal and reuse of waste printed circuit boards have been the major global concerns. Printed circuit boards, a form of Electronic waste (hereafter e-waste), have been chemically processed, doped with Ag(+), Cu(2+) and Sn(2+), and used as visible light photocatalysts against the degradation of methylene blue and methyl violet. The elemental analyses of pristine and metal doped printed circuit board were obtained using energy dispersive X-ray fluorescence (EDXRF) spectra and inductively coupled plasma optical emission spectroscopy (ICP-OES). The morphology of parent and doped printed circuit board was obtained from scanning electron microscopy (SEM) measurements. The photocatalytic activity of parent and metal doped samples was carried out for the decomposition of organic pollutants, methylene blue and methyl violet, under visible light irradiation. Metal doped waste printed circuit boards (WPCBs) have shown higher photocatalytic activity against the degradation of methyl violet and methylene blue under visible light irradiation. Scavenger experiments were performed to identify the reactive intermediates responsible for the degradation of methylene blue and methyl violet. The reactive species responsible for the degradation of MV and MB were found to be holes and hydroxyl radicals. A possible mechanism of degradation of methylene blue and methyl violet is given. The stability and reusability of the catalysts are also investigated.

  19. Electromigration-induced cracks in Cu/Sn3.5Ag/Cu solder reaction couple at room temperature

    Institute of Scientific and Technical Information of China (English)

    He Hongwen; Xu Guangchen; Guo Fu

    2009-01-01

    Electromigration (EM) behavior of Cu/Sn3.5Ag/Cu solder reaction couple was investigated with a high current density of 5× 103 A/cm2 at room temperature. One dimensional structure, copper wire/solder ball/copper wire SRC was designed and fabricated to dissipate the Joule heating induced by the current flow. In addition, thermomigration effect was excluded due to the symmetrical structure of the SRC. The experimental results in-dicated that micro-cracks initially appeared near the cathode interface between solder matrix and copper substrate after 474 h current stressing. With current stressing time increased, the cracks propagated and extended along the cathode interface. It should be noted that the continuous Cu6Sn5 intcrmetallic compounds (LMCs) layer both at the anode and at the cathode remained their sizes. Interestingly, tiny cracks appeared at the root of some long column-type Cu6Sn5 at the cathode interface due to the thermal stress.

  20. Electromigration-induced cracks in Cu/Sn3.5Ag/Cu solder reaction couple at room temperature

    Science.gov (United States)

    Hongwen, He; Guangchen, Xu; Fu, Guo

    2009-03-01

    Electromigration (EM) behavior of Cu/Sn3.5Ag/Cu solder reaction couple was investigated with a high current density of 5 × 103 A/cm2 at room temperature. One dimensional structure, copper wire/solder ball/copper wire SRC was designed and fabricated to dissipate the Joule heating induced by the current flow. In addition, thermomigration effect was excluded due to the symmetrical structure of the SRC. The experimental results indicated that micro-cracks initially appeared near the cathode interface between solder matrix and copper substrate after 474 h current stressing. With current stressing time increased, the cracks propagated and extended along the cathode interface. It should be noted that the continuous Cu6Sn5 intermetallic compounds (IMCs) layer both at the anode and at the cathode remained their sizes. Interestingly, tiny cracks appeared at the root of some long column-type Cu6Sn5 at the cathode interface due to the thermal stress.

  1. Influence of Dopant on Growth of Intermetallic Layers in Sn-Ag-Cu Solder Joints

    Science.gov (United States)

    Li, G. Y.; Bi, X. D.; Chen, Q.; Shi, X. Q.

    2011-02-01

    The interfacial interaction between Cu substrates and Sn-3.5Ag-0.7Cu- xSb ( x = 0, 0.2, 0.5, 0.8, 1.0, 1.5, and 2.0) solder alloys has been investigated under different isothermal aging temperatures of 100°C, 150°C, and 190°C. Scanning electron microscopy (SEM) was used to measure the thickness of the intermetallic compound (IMC) layer and observe the microstructural evolution of the solder joints. The IMC phases were identified by energy-dispersive x-ray spectroscopy (EDX) and x-ray diffractometry (XRD). The growth of both the Cu6Sn5 and Cu3Sn IMC layers at the interface between the Cu substrate and the solder fits a power-law relationship with the exponent ranging from 0.42 to 0.83, which suggests that the IMC growth is primarily controlled by diffusion but may also be influenced by interface reactions. The activation energies and interdiffusion coefficients of the IMC formation of seven solder alloys were determined. The addition of Sb has a strong influence on the growth of the Cu6Sn5 layer, but very little influence on the formation of the Cu3Sn IMC phase. The thickness of the Cu3Sn layer rapidly increases with aging time and temperature, whereas the thickness of the Cu6Sn5 layer increases slowly. This is probably due to the formation of Cu3Sn at the interface between two IMC phases, which occurs with consumption of Cu6Sn5. Adding antimony to Sn-3.5Ag-0.7Cu solder can evidently increase the activation energy of Cu6Sn5 IMC formation, reduce the atomic diffusion rate, and thus inhibit excessive growth of Cu6Sn5 IMCs. This study suggests that grain boundary pinning is one of the most important mechanisms for inhibiting the growth of Cu6Sn5 IMCs in such solder joints when Sb is added.

  2. Sputtered Ni-Zn under bump metallurgy (UBM) for Sn-Ag-Cu solders

    Energy Technology Data Exchange (ETDEWEB)

    Kim, Tae Jin; Kim, Young Min [Division of Materials Science and Engineering, Hanyang University, Seoul 133-791 (Korea, Republic of); Kim, Young-Ho, E-mail: kimyh@hanyang.ac.kr [Division of Materials Science and Engineering, Hanyang University, Seoul 133-791 (Korea, Republic of)

    2012-09-15

    Highlights: Black-Right-Pointing-Pointer Ni-Zn UBM can effectively suppress the growth of IMCs and the consumption of UBM. Black-Right-Pointing-Pointer The growth of (Ni, Cu){sub 3}Sn{sub 4} was retarded at the SAC305/Ni-Zn interface after aging. Black-Right-Pointing-Pointer Only a single (Cu, Ni){sub 6}Sn{sub 5} formed at the SAC107/Ni-Zn interface after aging. Black-Right-Pointing-Pointer Segregated Zn atoms on IMC layers retarded the interdiffusion of Cu, Ni, and Sn. Black-Right-Pointing-Pointer Sputtered Ni-Zn UBM is promising for Pb-free solder flip chip applications. - Abstract: We developed a new sputtered under bump metallurgy (UBM) based on Ni-20wt% Zn thin films for Pb-free solders. This study focuses on the interfacial reactions between two Pb-free solders (Sn3.0Ag0.5Cu and Sn1.0Ag0.7Cu) and a Ni-Zn alloy UBM. By adding Zn to Ni UBM, Zn is incorporated into intermetallic compounds (IMCs) to form a quaternary Cu-Ni-Zn-Sn phase at the solder/Ni-Zn interface after reflow and subsequent isothermal aging. The Ni-Zn UBM sufficiently reduces the interfacial reaction and IMCs formation rates as well as UBM consumption rates compared to a Ni UBM. In particular, the formation of (Ni, Cu){sub 3}Sn{sub 4} IMC was significantly retarded by adding Zn into UBM.

  3. Ag-Cu-Sn-In中温焊膏的性能与初步应用试验%Performance of Ag-Cu-Sn-In Alloy Solder Paste at Middle Temperature and Its Application

    Institute of Scientific and Technical Information of China (English)

    涂传政; 叶建军; 谭澄宇; 岳译新

    2006-01-01

    采用氮气雾化法将Ag-22.4Cu-15Sn-5In焊料制成粉体,利用丙烯酸酯类化合物为载体将其调配成膏状焊料.应用试验表明,所配制的新型焊膏易于涂布,焊接性能良好,焊后残渣少,无需再清洗.该新型焊膏能进行可伐与钨铜、可伐与陶瓷等材料的焊接,有着广阔的应用前景.钎焊界面分析发现,钎料主要是由富Ag相,少量Cu7In4相、Cu39Sn11相以及Cu3Sn相组成.在钎焊过程中,镍基板上的镍与钎料中的元素铜存在元素扩散,这对改善钎料与基体之间的结合状况是有益的.

  4. The Preparation and Application of New Ag-Cu-Ge-Sn Middle Temperature Alloy Solder Paste%Ag-Cu-Ge-Sn新型中温焊膏的研制与应用

    Institute of Scientific and Technical Information of China (English)

    叶建军; 涂传政; 谭澄宇; 岳译新; 郑学斌

    2007-01-01

    新型焊料Ag-24Cu-25Ge-4Sn(%)的熔化温度:544~557 ℃,固-液相间隔为:13℃;采用氮气雾化的方法将该焊料制成粉体,利用扫描电镜对焊料粉体形貌进行了观察,并用X-ray衍射对焊料的相结构进行了分析.研究表明:所制备的焊料粉体呈球形,粒径约20 μm;焊料主要由富Ag相、Ge相、中间相Ag6.7Sn和Cu5Ge2相组成.利用丙烯酸酯类化合物为载体将其调配成膏状焊料;焊膏铺展试验表明,该焊料流散性一般,钎焊后焊料表面色泽光亮,但边界有堆积现象;钎焊截面分析发现,在钎焊界面处存在明显的多层过渡层,这应与镍基板上的Ni和钎料中元素Cu的互相扩散有关系.

  5. Sn-6Bi-2Ag(Cu, Sb)无铅钎料合金微观组织分析%Microstructures of Sn-6Bi-2Ag(Cu,Sb) lead-free solder alloys

    Institute of Scientific and Technical Information of China (English)

    黄明亮; 于大全; 王来; 王富岗

    2002-01-01

    利用差示扫描量热计(DSC)测定了Sn-6Bi-2 Ag, Sn-6Bi-2Ag-0.5Cu, Sn-6Bi-2Ag -2.5Sb三种新无铅钎料合金的熔化温度. 结果表明, 少量Cu的加入能降低Sn-Bi-Ag系无铅钎料合金的熔化温度, 而Sb的加入使合金的熔化温度升高.利用光学显微镜(OM)、扫描电子显微镜(SEM)、能谱分析(EDX)对合金的微观组织进行了分析与比较, 钎料合金的微观组织与冷却条件和合金元素的含量有关, Sb的加入使析出相的尺寸细化.硬度测定表明Sn-Bi-Ag(C u, Sb)无铅钎料合金的硬度远大于纯Sn的硬度, 加入少量的Cu(0.5%), Sb(2.5%)对Sn -Bi-Ag系钎料合金的硬度影响较小.

  6. Effect of Cu Addition on the Microstructure of Ag-Ce Alloys%Cu对Ag-Ce合金组织与结构之影响

    Institute of Scientific and Technical Information of China (English)

    俞建树; 贺晓燕; 周世平; 卢绍平; 安盈志; 王佳丽; 王健

    2013-01-01

    The effects of Cu addition on the microstructure of Ag-Ce alloy were studied by SEM and EDS. The results showed that the main body of Ag-Cu-Ce alloys is silver-copper solid solution with smaller crystal grains, in which many symbiotically separated β-Cu and Ag4Ce particles were distributed diffusively. Cu addition segregation. Tensile fracture of Ag-Ce and Ag-Cu-Ce alloys was shown cone and left distinct tough pit, which is typical tough break.%利用扫描电子显微镜和能谱仪分析Cu对Ag-Ce合金组织与结构的影响。结果表明:Ag-Cu-Ce合金基体为银铜固溶体,晶粒较小,基体上弥散分布着恀多共生析出的β-Cu和Ag4Ce颗粒,Cu的加入改善了Ag4Ce的偏析现象。Ag-Ce和Ag-Cu-Ce合金的拉伸断口呈锥形,有明显的韧窝组织,为典型的韧性断裂。

  7. Alloy

    Science.gov (United States)

    Cabeza, Sandra; Garcés, Gerardo; Pérez, Pablo; Adeva, Paloma

    2014-07-01

    The Mg98.5Gd1Zn0.5 alloy produced by a powder metallurgy route was studied and compared with the same alloy produced by extrusion of ingots. Atomized powders were cold compacted and extruded at 623 K and 673 K (350 °C and 400 °C). The microstructure of extruded materials was characterized by α-Mg grains, and Mg3Gd and 14H-LPSO particles located at grain boundaries. Grain size decreased from 6.8 μm in the extruded ingot, down to 1.6 μm for powders extruded at 623 K (350 °C). Grain refinement resulted in an increase in mechanical properties at room and high temperatures. Moreover, at high temperatures the PM alloy showed superplasticity at high strain rates, with elongations to failure up to 700 pct.

  8. Journal of Aeronautics.

    Science.gov (United States)

    1982-07-21

    Dislocation Structures of 2024 Aluminum Alloy, by Li Qingsheng, Tsai Chikung , Chen Xianxi, Pan Tian- xi...AND FATIGUE DISLOCATION STRUCTURES OF 2024 ALUMINUM ALLOY Li Qingsheng, Tsai Chikung , Chen Xianxi, Pan Tianxi Central Iron and Steel Research Institute...express our thanks.. Reference Literature 1) Tsai Chikung , Jin Shu Xue Bao, 1976 Nian 12 Juan 1 Qi 45 Ye. "Tsai Chikung , Journal of Metals, Vol. 12

  9. The Colors and Chromatic Charts of Gold -Silver -Copper Carat Alloys%Au-Ag-Cu系开金合金的颜色与色度图

    Institute of Scientific and Technical Information of China (English)

    宁远涛

    2012-01-01

    颜色和色度坐标是珠宝饰品设计与制造的重要因素与参数.Au- Ag-Cu系合金是最重要的颜色开金饰品合金.文章评述了Ag、Cu对Au和Au基合金的光反射率和颜色的影响;介绍了Au- Ag-Cu系合金的色度图、金合金色泽标准及某些标准颜色合金成分;讨论了某些合金化元素对Au- Ag-Cu系合金颜色的影响.通过调整Ag、Cu组元含量比例和添加其它合金化元素,Au-Ag - Cu系开金合金可以获得丰富多彩的颜色,对于设计与控制珠宝饰品的颜色有重要意义.%Au - Ag - Cu system alloys are the most important color jewelry alloys. The colors of Au - Ag - Cu alloys depend on the composition and the content of the alloying components. The influences of Ag and Cu components on the reflectivity and color of gold and gold - based alloys were reviewed. The chromatic charts of gold - silver - copper carat alloys, color standard of carat alloys and the compositions of some standard color gold alloys were introduced. The effects of some other alloying elements on the color of gold alloys were also discussed. Au - Ag - Cu carat alloys can develop rich and varied colors through regulating the ratio of the contents of Ag and Cu in alloys and adding other alloying elements, which is the basis for designing and controlling colors of carat alloys based on gold.

  10. In vitro cytotoxicity of Ag-Pd-Cu-based casting alloys.

    Science.gov (United States)

    Niemi, L; Hensten-Pettersen, A

    1985-01-01

    The cytotoxicity and its correlation to alloy composition, structure, corrosion, as well as galvanic coupling was studied with 12 Ag-Pd-Cu-type alloys, one conventional type III gold alloy and pure Ag, Cu, and Pd. The agar overlay cell culture technique was used. Single phase binary CuPd alloys were only slightly cytotoxic below a Cu content of 30 wt%. The tested multiphase alloys were all toxic, but no correlation between toxicity and Cu content could be observed. Solid solution annealing increased the cytotoxicity of a multiphase alloy. Exposure of a single phase alloy to an artificial saliva for 1 week prior to the test decreased its cytotoxicity significantly. Galvanic coupling of the alloys through an outer copper wire decreased their cytotoxicity.

  11. Journals Abroad

    Science.gov (United States)

    Ando, Shoichi

    1975-01-01

    This article summarizes four journal articles on language teaching appearing in the American pedagogical language journals, "The Modern Language Journal,""English Language Teaching Journal," and "TESOL Quarterly." The purpose is to give an indication of what kinds of articles can be found in journals outside Japan.…

  12. 采用AgCuTi活性钎料真空钎焊MgAl2O4透明陶瓷

    Institute of Scientific and Technical Information of China (English)

    朱成俊; 尚长沛

    2015-01-01

    采用AgCuTi活性钎料箔带分别在880℃/10 min和880℃/60 min两种工艺下对MgAl2O4陶瓷进行了真空钎焊连接,接头冶金质量良好,两种工艺下接头抗剪强度分别为52.4 MPa和61.3 MPa.微观分析结果表明,靠近陶瓷母材附近生成了连续的扩散反应层结构,结合XRD结果,该层主要由CuAl2 O4和TiO两种化合物组成;钎缝基体区由Cu(s,s),Ag(s,s)和TiO相组成.

  13. Al2O3/Al2O3 Joint Brazed with Al2O3-particulate-contained Composite Ag-Cu-Ti Filler Material

    Institute of Scientific and Technical Information of China (English)

    Jianguo YANG; Hongyuan FANG; Xin WAN

    2005-01-01

    Microstructure and interfacial reactions of Al2O3 joints brazed with Al2O3-particulate-contained composite Ag-Cu-Ti filler material were researched by scanning electron microscopy (SEM), electron probe microscopy analysis (EPMA),energy dispersive spectroscopy (EDS) and X-ray diffraction (XRD). The interfacial reaction layer thickness of joints brazed with conventional active filler metal and active composite filler materials with different volume fraction of Al2O3 particulate was also studied. The experimental results indicated although there were Al2O3 particulates added into active filler metals, the time dependence of interfacial layer growth of joints brazed with active composite filler material is t1/2 as described by Fickian law as the joints brazed with conventional active filler metal.

  14. Alloying of metal nanoparticles by ion-beam induced sputtering

    Science.gov (United States)

    Magudapathy, P.; Srivastava, S. K.; Gangopadhyay, P.; Amirthapandian, S.; Saravanan, K.; Das, A.; Panigrahi, B. K.

    2017-01-01

    Ion-beam sputtering technique has been utilized for controlled synthesis of metal alloy nanoparticles of compositions that can be tuned. Analysis of various experimental results reveals the formation of Ag-Cu alloy nanoparticles on a silica substrate. Surface-plasmon optical resonance positions and observed shifts of Ag Bragg angles in X-ray diffraction pattern particularly confirm formation of alloy nanoparticles on glass samples. Sputtering induced nano-alloying mechanism has been discussed and compared with thermal mixing of Ag and Cu thin films on glass substrates. Compositions and sizes of alloy nanoparticles formed during ion-beam induced sputtering are found to exceed far from the values of thermal mixing.

  15. Microstructural behavior of iron and bismuth added Sn-1Ag-Cu solder under elevated temperature aging

    Science.gov (United States)

    Ali, Bakhtiar; Sabri, Mohd Faizul Mohd; Jauhari, Iswadi

    2016-07-01

    An extensive study was done to investigate the microstructural behavior of iron (Fe) and bismuth (Bi) added Sn-1Ag-0.5Cu (SAC105) under severe thermal aging conditions. The isothermal aging was done at 200 °C for 100 h, 200 h, and 300 h. Optical microscopy with cross-polarized light revealed that the grain size significantly reduces with Fe/Bi addition to the base alloy SAC105 and remains literally the same after thermal aging. The micrographs of field emission scanning electron microscopy (FESEM) with backscattered electron detector and their further analysis via imageJ software indicated that Fe/Bi added SAC105 showed a significant reduction in the IMCs size (Ag3Sn and Cu6Sn5), especially the Cu6Sn5 IMCs, as well as β-Sn matrix and a refinement in the microstructure, which is due to the presence of Bi in the alloys. Moreover, their microstructure remains much more stable under severe thermal aging conditions, which is because of the presence of both Fe and Bi in the alloy. The microstructural behavior suggests that Fe/Bi modified SAC105 would have much improved reliability under severe thermal environments. These modified alloys also have relatively low melting temperature and low cost.

  16. Toxicity of Ag, CuO and ZnO nanoparticles to selected environmentally relevant test organisms and mammalian cells in vitro: a critical review.

    Science.gov (United States)

    Bondarenko, Olesja; Juganson, Katre; Ivask, Angela; Kasemets, Kaja; Mortimer, Monika; Kahru, Anne

    2013-07-01

    Nanoparticles (NPs) of copper oxide (CuO), zinc oxide (ZnO) and especially nanosilver are intentionally used to fight the undesirable growth of bacteria, fungi and algae. Release of these NPs from consumer and household products into waste streams and further into the environment may, however, pose threat to the 'non-target' organisms, such as natural microbes and aquatic organisms. This review summarizes the recent research on (eco)toxicity of silver (Ag), CuO and ZnO NPs. Organism-wise it focuses on key test species used for the analysis of ecotoxicological hazard. For comparison, the toxic effects of studied NPs toward mammalian cells in vitro were addressed. Altogether 317 L(E)C50 or minimal inhibitory concentrations (MIC) values were obtained for algae, crustaceans, fish, bacteria, yeast, nematodes, protozoa and mammalian cell lines. As a rule, crustaceans, algae and fish proved most sensitive to the studied NPs. The median L(E)C50 values of Ag NPs, CuO NPs and ZnO NPs (mg/L) were 0.01, 2.1 and 2.3 for crustaceans; 0.36, 2.8 and 0.08 for algae; and 1.36, 100 and 3.0 for fish, respectively. Surprisingly, the NPs were less toxic to bacteria than to aquatic organisms: the median MIC values for bacteria were 7.1, 200 and 500 mg/L for Ag, CuO and ZnO NPs, respectively. In comparison, the respective median L(E)C50 values for mammalian cells were 11.3, 25 and 43 mg/L. Thus, the toxic range of all the three metal-containing NPs to target- and non-target organisms overlaps, indicating that the leaching of biocidal NPs from consumer products should be addressed.

  17. Numerical prediction of fraction of eutectic phase in Sn-Ag-Cu soldring using the phase-field method

    Science.gov (United States)

    Ode, Machiko; Ueshima, Minoru; Abe, Taichi; Murakami, Hideyuki; Onodera, Hidehiro

    2006-11-01

    A combination of macroscale solidification simulation and phase-field calculation is employed to predict the volume fraction of the eutectic phase in Sn-4.0 mass% Ag-XCu solder alloys (X=0.5 1.1 mass%). The solidification simulation incorporates the cooling rate in the phase-field simulation. We assume the residual liquid solidifies as eutectic phase when the driving force for the nucleation of Cu6Sn5 amounts to a critical value, which is determined based on the experimental data. Though the calculation results depend on the experimental data, the obtained fractions are about 40% for 0.5 mass% Cu and more than 90% for 1.1 mass% Cu alloy, which shows good agreement with the experimental data.

  18. Effect of palladium on sulfide tarnishing of noble metal alloys.

    Science.gov (United States)

    Suoninen, E; Herø, H; Minni, E

    1985-10-01

    Electron spectroscopic studies of Au-Ag-Cu alloys of the type used for dental castings show that small additions (less than or equal to 3 wt%) of palladium reduce essentially the thickness of the sulfide layer formed on surfaces of samples treated in aqueous Na2S solutions. Relative to silver, palladium does not enrich in the sulfide, but statistically significant enrichment is found immediately below the sulfide layer. This enrichment probably takes place during the exposure of the substrate surface to atmosphere before the sulfiding treatment. The mechanism of the impeding effect of palladium on sulfiding is assumed to be a decrease in diffusion from the bulk alloy to the surface due to the enriched layer. The effect cannot be explained by changes in the electronic structure of the alloy due to palladium alloying.

  19. Well-organized raspberry-like Ag@Cu bimetal nanoparticles for highly reliable and reproducible surface-enhanced Raman scattering

    Science.gov (United States)

    Lee, Jung-Pil; Chen, Dongchang; Li, Xiaxi; Yoo, Seungmin; Bottomley, Lawrence A.; El-Sayed, Mostafa A.; Park, Soojin; Liu, Meilin

    2013-11-01

    Surface-enhanced Raman scattering (SERS) is ideally suited for probing and mapping surface species and incipient phases on fuel cell electrodes because of its high sensitivity and surface-selectivity, potentially offering insights into the mechanisms of chemical and energy transformation processes. In particular, bimetal nanostructures of coinage metals (Au, Ag, and Cu) have attracted much attention as SERS-active agents due to their distinctive electromagnetic field enhancements originated from surface plasmon resonance. Here we report excellent SERS-active, raspberry-like nanostructures composed of a silver (Ag) nanoparticle core decorated with smaller copper (Cu) nanoparticles, which displayed enhanced and broadened UV-Vis absorption spectra. These unique Ag@Cu raspberry nanostructures enable us to use blue, green, and red light as the excitation laser source for surface-enhanced Raman spectroscopy (SERS) with a large enhancement factor (EF). A highly reliable SERS effect was demonstrated using Rhodamine 6G (R6G) molecules and a thin film of gadolinium doped ceria.Surface-enhanced Raman scattering (SERS) is ideally suited for probing and mapping surface species and incipient phases on fuel cell electrodes because of its high sensitivity and surface-selectivity, potentially offering insights into the mechanisms of chemical and energy transformation processes. In particular, bimetal nanostructures of coinage metals (Au, Ag, and Cu) have attracted much attention as SERS-active agents due to their distinctive electromagnetic field enhancements originated from surface plasmon resonance. Here we report excellent SERS-active, raspberry-like nanostructures composed of a silver (Ag) nanoparticle core decorated with smaller copper (Cu) nanoparticles, which displayed enhanced and broadened UV-Vis absorption spectra. These unique Ag@Cu raspberry nanostructures enable us to use blue, green, and red light as the excitation laser source for surface-enhanced Raman spectroscopy

  20. Effect Mechanism of Rare Earth on the Microstructures of SnAgCu Solder Joints%稀土元素对SnAgCu焊点内部组织的影响机制

    Institute of Scientific and Technical Information of China (English)

    张亮; 韩继光; 郭永环; 何成文; 袁建民

    2012-01-01

    Due to the enhancement of environmental protection in our world, the research on lead-free solders has become the important role in electronic industry, the addition of rare earth can improve the properties of lead-free solders, based on the soldering testing of lead-free solders bearing rare earth Ce, the scanning electron microscope and energy dispersive X-ray spectroscopy technology are used to investigate the effect mechanism of rare earth Ce on the microstructure of SnAgCu solder joints systematically. The results indicated that CeSn3 with different morphologies appear in the solder matrix. The chemical affinity is utilized to describe the correlation between Ce and Sn, Ag, Cu elements, it can be demonstrated that the rare earth Ce had higher affinity for Sn in the SnAgCu system in theoretically. The adsorption effect of rare earth is investigated based on ULF principle, it can be used to explain the intermetallic compounds(IMCs) refinement of SnAgCu solder joints bearing rare earth Ce. With the microstructure analysis of SnAgCuCe solder joints, it is found that the order of IMCs particles sizes is CeSn3>Cu6Sn5>Ag3Sn, in the theory, it is confirmed that the Ag3Sn particles plays an important role in the strengthen of SnAgCu solder joints, which can provide the theory support for the research of lead-free solders.%随着人们环保意识的逐渐增强,新型无铅钎料的研究成为电子工业中的研究热点,而稀土元素的添加可以显著改善钎料的性能,基于含稀土Ce无铅钎料的钎焊试验,采用扫描电镜和能谱仪研究稀土元素Ce对SnAgCu焊点内部组织的影响机制.结果表明,稀土元素在SnAgCu焊点内部以CeSn3的形式存在,且稀土相形态各异.采用化学亲和力来表征稀土元素Ce与Sn、Ag、Cu之间的内在联系,从理论上证明Ce的“亲Sn性”.采用乌尔夫原理研究稀土元素的吸附现象,解释稀土元素Ce对SnAgCu焊点内部金属间化合物的细化作用.由SnAgCuCe焊

  1. In situ heating transmission electron microscopy observation of nanoeutectic lamellar structure in Sn-Ag-Cu alloy on Au under-bump metallization.

    Science.gov (United States)

    Seo, Jong-Hyun; Yoon, Sang-Won; Kim, Kyou-Hyun; Chang, Hye-Jung; Lee, Kon-Bae; Seong, Tae-Yeon; Fleury, Eric; Ahn, Jae-Pyoung

    2013-08-01

    We investigated the microstructural evolution of Sn(96.4)Ag(2.8)Cu(0.8) solder through in situ heating transmission electron microscopy observations. As-soldered bump consisted of seven layers, containing the nanoeutectic lamella structure of AuSn and Au₅Sn phases, and the polygonal grains of AuSn₂ and AuSn₄, on Au-plated Cu bond pads. Here, we found that there are two nanoeutectic lamellar layers with lamella spacing of 40 and 250 nm. By in situ heating above 140°C, the nanoeutectic lamella of AuSn and Au₅Sn was decomposed with structural degradation by sphering and coarsening processes of the lamellar interface. At the third layer neighboring to the lamella layer, on the other hand, Au₅Sn particles with a zig-zag shape in AuSn matrix became spherical and were finally dissipated in order to minimize the interface energy between two phases. In the other layers except both lamella layers, polycrystal grains of AuSn₂ and AuSn₄ grew by normal grain growth during in situ heating. The high interface energy of nanoeutectic lamella and polygonal nanograins, which are formed by rapid solidification, acted as a principal driving force on the microstructural change during the in situ heating.

  2. Thermal processes and solidification kinetcs of evolution of the microstructure of tin-silver-copper solder alloys

    Science.gov (United States)

    Kinyanjui, Robert Kamau

    The adoption of Sn-Ag-Cu (SAC) Pb-free solders will affect electronic manufacturing processes and joint reliability for electronics packages. Since SAC solder has a higher melting temperature than eutectic Pb-Sn solder, higher processing temperatures will be required. The higher processing temperatures can potentially affect the microstructure of these Pb-free solder joints. We investigated the effect of thermal history on the evolution of the microstructure of Sn-xAg-yCu (0 ≤ x ≤ 4.0; 0 ≤ y ≤ 1.4, concentrations are in weight percent) solder alloys. This family of alloys falls within a class of Sn-rich Sn-Ag-Cu (SAC) alloys recommended by various international consortia for implementation in electronic manufacturing industry to replace the conventional PbSn solders. This investigation was divided into three parts: part one was an investigation of an optimum SAC alloy composition devoid of large (in length scales) intermetallic compounds (IMCs) after thermal treatment. The presence of large IMCs, with different mechanical characteristics from the bulk Sn, may compromise the mechanical integrity of the Pb-free solder interconnect. In part two of this study, we examined the growth morphology of Ag3Sn, Cu6Sn 5, and betaSn in the SAC alloys. In part three, an examination of the effect of sample size on undercooling was carried out. A Sn-Ag-Cu alloy of the composition: 96.5Sn-2.6Ag-0.9Cu (in weight percent) was found to exhibit no growth of large Ag3Sn, Cu6Sn 5 intermetallic compounds at cooling rates from 0.1 to 1°C/s. However, growth of large betaSn dendrites was observed. The crystallized Sn-Ag-Cu balls were found to contain only a few Sn grains. Also the solidification temperature of the 96.5Sn-2.6Ag-yCu (0 ≤ y ≤ 1.4) solder system was found to increase with Cu content. Further, this investigation established a strong correlation between Sn-Ag-Cu sample size and degree of undercooling for these Pb-free solder alloys. The degree of undercooling of Sn in

  3. Lifestyle Journalism

    DEFF Research Database (Denmark)

    From, Unni; Kristensen, Nete Nørgaard

    2013-01-01

    Lifestyle journalism has experienced enormous growth in the media over the past two decades, but scholars in the fields of journalism and communication studies have so far paid relatively little attention to a field that is still sometimes seen as "not real journalism". There is now an urgent need...... for in-depth exploration and contextualisation of this field, with its increasing relevance for 21st century consumer cultures. For the first time, this book presents a wide range of studies which have engaged with the field of lifestyle journalism in order to outline the various political, economic...... of sub-fields such as travel, music, food, health, fashion and personal technology journalism. This volume provides a fascinating account of the different facets of lifestyle journalism, and charts the way forward for a more sustained analysis of the field. This book was originally published as a special...

  4. Ethnographic journalism

    DEFF Research Database (Denmark)

    Hermann, Anne Kirstine

    2016-01-01

    Accounting for emerging journalistic genres is a difficult endeavor not least because there is little agreement as to what constitutes journalism itself. Doing so, however, is essential if we are to recognize changing journalistic doxas. To capture such changes, we must include a holistic framework...... require more contextual reporting, ethnographic journalism emerges in American feature journalism. Analyzed holistically, this genre is characterized as the employment of immersion strategies adopted from social science for distinct storytelling purposes. These methods, however, transform conventional...... journalistic epistemology, changing it through practice. In turn, the analysis reveals how journalism practices can evolve its troubled philosophical position...

  5. Characterization of the effects of binary metal mixtures on short-term uptake of Ag, Cu, and Ni by rainbow trout (Oncorhynchus mykiss).

    Science.gov (United States)

    Brix, Kevin V; Tellis, Margaret S; Crémazy, Anne; Wood, Chris M

    2016-11-01

    Single metal Biotic Ligand Models (BLMs) have been developed for a number of metals and model organisms. While these BLMs improve our ability to regulate metals in the aquatic environment, in reality, organisms are often simultaneously exposed to metal mixtures. Recently, several attempts have been made to develop mixture BLMs (mBLMs). Some of these models assume competitive interactions between all metals, while others assume only metals with a similar mode of action (e.g., Na(+) or Ca(2+) antagonists) will competitively interact. To begin testing these assumptions in the mBLM framework, standard 3-h gill metal binding assays with Ag, Cu, and Ni (primary metals), were performed in vivo on freshwater rainbow trout. Fish were exposed across a range of concentrations encompassing the 96-h LC50 for that metal to characterize uptake kinetics for each of these three primary metals (radiolabelled) in the presence and absence of a secondary metal (Ag, Cd, Cu, Ni, Pb, or Zn; not radiolabelled). We observed a complex series of interactions in binary mixtures that frequently contradicted theoretical expectations. Metals with similar modes of action did competitively interact in some instances, but not others, and when they did compete the competition was not necessarily reciprocal (e.g., Cu inhibited Ag uptake but Ag did not inhibit Cu uptake). We also observed examples of interactions between metals with dissimilar modes of action and several examples of metals stimulating the uptake of other metals. The underlying mechanisms for these unexpected interactions are unclear, but suggest that many of the current assumptions in mBLMs regarding the number and types of metal uptake sites and corresponding metal interactions are not correct. Careful characterization of metal mixture interactions is clearly needed before a reliable mBLM can be developed.

  6. From Journals

    Directory of Open Access Journals (Sweden)

    Nedjeljko Frančula

    2011-06-01

    Full Text Available This is a selection of papers related to cartography and geoinformation from journals which are not primarily cartographic, and the full texts of which are available on the Internet to members of Croatian academic and research community. Most journals are available via the PERO browser (http://knjiznica.irb.hr/pero/index.php.

  7. JOURNAL INFORMATION

    Institute of Scientific and Technical Information of China (English)

    2008-01-01

    Journal of Shenzhen University Journal of Shenzhen University Science and Engineering (ISSN 1000-2618) started publication in 1984 and is issued quarterly on 112 A4 pages. Its main topics cover the disciplines of electron optics and infor- mation engineering, architecture and civ

  8. Radio Journalism.

    Science.gov (United States)

    Bittner, John R.; Bittner, Denise A.

    This book, a how-to-do-it guide for the novice and the professional alike, deals with several aspects of radio journalism: producing documentaries, preparing and announcing radio news, ethics and responsibility, regulation of radio journalism, and careers. It traces the history and growth of radio news, shows its impact on the public, and…

  9. SIMULATION ON NONLINEAR OPTICAL ABSORPTION OF BINARY METALS DISPERSED (Au, Ag, Cu)/SiO2 NANO-COMPOSITE FILMS BY MODIFIED MIE THEORY%(Au,Ag,Cu)/SiO2二元金属单分散复合薄膜非线性光吸收性的Mie理论模拟

    Institute of Scientific and Technical Information of China (English)

    严丽平; 张波萍; 王士京; 赵翠华; 李顺

    2011-01-01

    Due to the surface plasmon resonance (SPR) and enhanced local field effect of metal particles, nano-composite films exhibit a variety of properties, such as large third order nonlinear susceptibility, superfast response time and absorption peaks in the optical spectra at a special wavelength. Therefore they are attractive candidates for optical communication, such as information storage and optical device. In recent years, the metal nanoparticle nonlinear optical composite films have been developed rapidly, expanded from single metal nano particle dispersion system to the dual metal nano particle dispersion system. However, theoretical study on the nonlinear optical absorption of the dual metal nano particle dispersion system is quite rare. In this study, the optical absorption spectra of the (Ag, Cu)/SiO2, (Au, Cu)/SiO2 and (Ag, Au)/SiO2 binary metals dispersed nano-composite films were simulated by modified Mie theory. When the metal particles with a low full factor are smaller than the incident wavelength in diameters, the optical spectra of (Ag, Cu)/SiO2, (Au, Cu)/SiO2 and (Ag, Au)/SiO2 composite films in which the nanoparticles solely dispersed in each metal state, can be calculated and analyzed based on the modified Mie theory using the optical parameters of the component. Two SPR absorption peaks appear in the corresponding wavelength of the single metal dispersed nano-composite films.The intensities of SPR absorption peaks depend strongly on the relative content of binary metals,while their peak positions are constant regardless of the content. The calculated optical absorption spectra by proposed method in this study are in good agreement with the reported experiment results.It suggests that the linear superposition method is feasible to calculate the absorption spectra of other separated binary and/or multiplex metals dispersed nano-composite films.%采用修正的Mie理论模拟计算了(Ag,Cu)/SiO2,(Au,Cu)/SiO2和(Ag,Au)/SiO2二元单质金属纳米颗

  10. Solid-Liquid State Bonding of Si3N4 Ceramics with Ceramic-Modified Brazing Alloy

    Institute of Scientific and Technical Information of China (English)

    杨俊; 吴爱萍; 邹贵生; 张德库; 刘根茂

    2004-01-01

    Solid-liquid state bonding of Si3N4 ceramics with TiN-modified Ag-Cu-Ti brazing alloy was used to enhance joint strength. The effects of the TiN particles on the microstructures, interfacial reactions, and room-temperature properties of the joints were investigated. The results show that the TiN particles are generally well dispersed in the Ag-Cu eutectic base and the interface between them is both clean and compact. Changes in the TiN volume fractions from 0 to 20% exert no noticeable effect on the interfacial reaction between Ag-Cu-Ti and the substrates. Other bonding parameters being constant, the TiN volume fraction in the filler material plays a key role in the joint properties. For TiN volume fractions below 20%, the joints are reinforced, especially joints with 5% and 20% TiN. The average shearing strength of joints with 5%TiN is 200.8 MPa, 30% higher than that of joints with no TiN (154.1 MPa). However, for TiN volumes fractions above 20%, the joint strengths decrease.

  11. Dissimilar joint characteristics of SiC and WC-Co alloy by laser brazing

    Science.gov (United States)

    Nagatsuka, K.; Sechi, Y.; Nakata, K.

    2012-08-01

    SiC and WC-Co alloys were joined by laser brazing with an active braze metal. The braze metal based on eutectic Ag-Cu alloy with additional Ti as an active element ranging from 0 to 2.8 mass% was sandwiched by the SiC block and WC-Co alloy plate. The brazing was carried out by selective laser beam irradiation on the WC-Co alloy plate. The content of Ti in the braze metal was required to exceed 0.6 mass% in order to form a brazed joint with a measurable shear strength. The shear strength increased with increasing Ti content up to 2.3 mass%Ti and decreased with a higher content.

  12. A two-component Frenkel-Kontorowa model for surface alloy formation

    CERN Document Server

    Daruka, I

    2003-01-01

    It has been shown by recent experiments that bulk immiscible metals (e.g. Ag/Cu, Ag/Co and Au/Ni) can form binary alloys on certain surfaces where the substrate mediates the elastic misfits between the two components, thus relieving the elastic strain in the overlayer. These novel surface alloys exhibit a rich phase structure. We formulate a two-component Frenkel-Kontorova model in one dimension to study surface alloy formation. This model can naturally incorporate dislocation formation that plays a crucial role in determining the actual structure of the system. Using energy minimization calculations we provide a phase diagram in terms of average alloy composition and the energy of mixing. Monte Carlo simulations were also performed to study the structure and interaction of the emerging dislocations.

  13. From Journals

    Directory of Open Access Journals (Sweden)

    Nedjeljko Frančula

    2012-12-01

    Full Text Available From the field of cartography and geoinformation, there are journal’s article extracts given which are not cartographic first and whose complete texts are on the Internet, accessible to the members of Croatian academic and research community. Most journals can be accessed through the PERO browser (http://knjiznica.irb.hr/pero/index.php. For the journals not found through this browser, the complete texts of the mentioned articles are available for free on the givenweb-address.Next to every journal headline, in the brackets, it is noted which prominent bibliographic and quotation bases it is placed in: CC (Current Contents, SCIE (Science Citation Index Expanded, and SSCI (Social Science Citation Index. It should be noted that, for some journals accessible throughPERObrowser, thereisadelayof6,12 and even 18 months in accessing the newestissues.Thisnumberisgiveninthe brackets next to the journal’s headline.

  14. Investigation of microgravity effect on solidification of medium-low-melting-point alloy by drop tube experiment

    Institute of Scientific and Technical Information of China (English)

    2008-01-01

    The solidification microstructure of Al-Ni, Al-Cu, Ag-Cu, Al-Pb and Cu-Co alloys quenched in silicone oil before and after free fall in evacuated 50 m drop tube were investigated contrastively. The effect of microgravity on the solidification process of medium-low-melting-point eutectic, monotectic and peritectic alloys were ana-lyzed and discussed. The results indicated that the effects of microgravity on the eutectic cell shape, the pattern in eutectic cell and the inter-eutectic spacing were different for different types of eutectic systems; the size distribution of Pb particles in Al-5wt% Pb monotectic alloy was significantly changed by microgravity; and the shape of retained primary α-Co phase in Cu-10wt%Co peritectic alloy was also changed by microgravity. These results are beneficial for people to further identify and analyze the solidification behavior of multiphase alloys under microgravity.

  15. In Situ Observation of Small-Scale Deformation in a Lead-Free Solder Alloy

    Science.gov (United States)

    Sun, Yong; Liang, Jin; Xu, Zhi-Hui; Wang, Guofeng; Li, Xiaodong

    2009-03-01

    In situ observation of the local, small-scale deformation behavior of a Sn-Ag-Cu (SAC387) alloy under extremely small strain rates was realized using a custom-designed mechanical testing stage integrated with atomic force microscopy (AFM) and optical microscopy. Grain boundary sliding (GBS) hand in hand with grain boundary decohesion (GBD) is the dominant mechanism in the early stage of deformation (<8.0% local strain) while intragranular slip bands are observed in the large-strain regime for the dendritic microstructure at room temperature. The deformation mechanisms of SAC387 are discussed in detail with reference to its microstructural constituents and mechanical properties.

  16. Ag-CuO钎料与BaCo0.7Fe0.2Nb0.1O3-δ透氧膜陶瓷润湿及界面反应机理的研究%The wetting and interface reaction mechanism of Ag-Cu-O brazes on BaCo0.7Fe0.2Nb0.1O3-δ oxygen-permeable membrane ceramic

    Institute of Scientific and Technical Information of China (English)

    张齐飞; 耿振; 张玉文; 侯丽娟; 王海海; 丁伟中; 鲁雄刚

    2012-01-01

    The wetting and interface reaction mechanism of Ag-Cu-O brazes on BaCo0.7Fe0.2Nb0.1O3-δ(BCFNO) oxygen-permeable membrane ceramic were investigated by the sessile drop wetting experiment and SEM/EDS test.The results indicate that the wetting of Ag-Cu-O brazes on BCFNO follow the wetting mechanism of interface reaction,with the Cu content and temperature increased,wetting angle rapid decreased.When the content of Cu was 3.3mol%,in BCFNO side at the interface a layer of reactive layer was generated.The existence of reactive layer reduced the liquid-solid interfacial energies,then improved the wettability of interface and enhanced the mutual metallurgy effect.Reactive layer are caused by the interface reaction(CuOx+BaCoFeNbO→Ba-Cu-O + Co-Cu-O) occurs in the interface.The complex oxide Ba-Cu-O,Co-Cu-O in the grain boundary of BCFNO matrix show island shape distributed.%利用座滴法润湿实验,借助SEM和EDS测试,研究了Ag-CuO钎料与BaCo0.7Fe0.2Nb0.1O3-δ透氧膜陶瓷润湿及界面反应机理。结果表明Ag-Cu-O/BCFNO间的润湿遵从界面反应润湿机制,随Cu含量增加和温度升高,润湿角快速减小。当Cu含量为3.3%(摩尔分数)时,在界面处BCFNO侧开始生成1层反应层,反应层的存在降低了固液界面能,使界面润湿性得到改善,相互冶金作用增强。反应层产生的原因是界面处发生了界面反应CuOx+BaCoFeNbO→Ba-Cu-O+Co-Cu-O,生成的复杂氧化物Ba-Cu-O、Co-Cu-O在BCFNO基体的晶粒边界上呈岛状分布。

  17. Comparative modular analysis of two complex sulfosalt structures: sterryite, Cu(Ag,Cu)3Pb19(Sb,As)22(As-As)S56, and parasterryite, Ag4Pb20(Sb,As)24S58.

    Science.gov (United States)

    Moëlo, Yves; Guillot-Deudon, Catherine; Evain, Michel; Orlandi, Paolo; Biagioni, Cristian

    2012-10-01

    The crystal structures of two very close, but distinct complex minerals of the lead sulfosalt group have been solved: sterryite, Cu(Ag,Cu)(3)Pb(19)(Sb,As)(22)(As-As)S(56), and parasterryite, Ag(4)Pb(20)(Sb,As)(24)S(58). They are analyzed and compared according to modular analysis. The fundamental building block is a complex column centred on a Pb(6)S(12) triangular prismatic core, with two additional long and short arms. The main chemical and topological differences relate to the short arm, which induces a relative a/4 shift (~2 Å along the elongation parameter) of the constitutive rod layers, as illustrated by distinct cell settings within the same space group (P2(1)/n and P2(1)/c, respectively). Selection of the shortest (i.e. strongest) (Sb,As)-S bonds permitted to enhance the polymeric organization of (Sb,As) atoms with triangular pyramidal coordination. These two quasi-homeotypic structures are expanded derivatives of owyheeite, Ag(3)Pb(10)Sb(11)S(28). The hierarchy of organization levels from zero- to three-dimensional entities is subordinated to building operators, which appear as the driving force for the construction of such complex structures. Minor cations (Ag, Cu) or the As-As pair in sterryite secure the final locking, which favours the formation of one or the other compound.

  18. Corrosion evaluation of gold-based dental alloys.

    Science.gov (United States)

    Corso, P P; German, R M; Simmons, H D

    1985-05-01

    Three commercial gold-based dental alloys and three constant-nobility ternary alloys (Au-Ag-Cu) were evaluated for corrosion using a quantitative test battery. Integration of the current density, in a de-aerated solution of 1% NaCl along the approximate potential range found in the mouth (-300 mV to +300 mV vs. SCE), yields a quantitative rank ordering of the test alloys. The results are combined with prior findings on other commercial alloys to demonstrate the interaction of nobility and microstructure. Nobility determines the overall corrosion resistance for gold-based alloys. However, because of mutual insolubility, alloying with copper induces silver segregation, resulting in a higher corrosion rate at a given nobility. Thus, microstructure has an influence on corrosion, but heat treatments are largely ineffective in altering the basic corrosion characteristics. The test techniques, in combination with tarnish evaluations, provide a quantitative battery for alloy evaluation. The results indicate the combinations of nobility, microstructure, and environment most likely to avoid corrosion difficulties.

  19. From Journals

    Directory of Open Access Journals (Sweden)

    Nedjeljko Frančula

    2012-06-01

    Full Text Available From the field of cartography and geoinformation, there are journal’s article extracts given which are not cartographic first and whose complete texts are on the Internet, accessible to the members of Croatian academic and research community. Most journals can be accessed through the PERO browser (http://knjiznica.irb.hr/pero/index.php.

  20. From Journals

    Directory of Open Access Journals (Sweden)

    Nedjeljko Frančula

    2011-12-01

    Full Text Available From the field of cartography and geoinformation, there are journal’s article extracts given which are not cartographic first and whose complete texts are on the Internet, accessible to the members of Croatian academic and research community. Most journals can be accessed through the PERO browser (http://knjiznica.irb.hr/pero/index.php.

  1. Study on the distributions of Cd, Co, Sr, Zn, Ag, Cu, Pb, Mn and Ni in the eolian sands of the Gavkuni playa (southeast of Isfahan

    Directory of Open Access Journals (Sweden)

    Hamidreza Pakzad

    2014-11-01

    Full Text Available Introduction Heavy metals are continually introduced into hydrosphere, atmosphere and biosphere. These potentially toxic elements can concentrate in sediments in aqueous ecosystems and they can act as pollution sources in particular conditions. Heavy metals mainly concentrate in fine sand particles because of more concentration of heavy minerals in this grain size. The Gavkhuni playa lake with an approximate area of 550 km2 is located at southeast of Isfahan, Iran. The Zayandehrud permanent river and several seasonal rivers flow into this playa. During quaternary, massive volume of sediments in sand and gravel sizes were carried into this area and deposited. These sediments are mainly deposited in the delta of Zayandehrud river (northwest of Gavkhuni playa and northwest of the sand dunes in margin of the Zayandehrud river particularly from Varzaneh to the playa. The megafans surrounding the playa can be partly origin of these sediments. The Gavkhuni playa lake is composed of three major flats namely sand, mud and salt flats. The salt flat forms the major part of the playa. Igneous, metamorphic and sedimentary (mainly carbonates rocks outcrop in the drainage basin of the Gavkhuni playa lake. Schist, gneiss, limestone, shale and andesite are the dominant lithology in this basin. The main objective of this research is to determine the concentrations of Cd, Co, Sr, Zn, Ag, Cu, Pb, Mn and Ni in the eolian sand deposits, the factors influencing the distributions of these elements and also relationship between the heavy metals and the minerals (particularly heavy minerals containing these elements. Material & Methods The eolian sands (sand dunes and sand flats of the Gavkhuni playa were sampled in 15 sampling points from north to south of the playa. Grain size distribution of the sediments were determined through dry sieving method. Heavy minerals were separated and studied through microscopy of the prepared thin and polish sections. The concentration

  2. Bottom-Up Nanofabrication of Supported Noble Metal Alloy Nanoparticle Arrays for Plasmonics

    DEFF Research Database (Denmark)

    Nugroho, Ferry A. A.; Iandolo, Beniamino; Wagner, Jakob Birkedal;

    2016-01-01

    Mixing different elements at the nanoscale to obtain alloy nanostructures with fine-tuned physical and chemical properties offers appealing opportunities for nanotechnology and nanoscience. However, despite widespread successful application of alloy nanoparticles made by colloidal synthesis...... in heterogeneous catalysis, nanoalloy systems have been used very rarely in solid-state devices and nanoplasmonics-related applications. One reason is that such applications require integration in arrays on a surface with compelling demands on nanoparticle arrangement, uniformity in surface coverage...... the concept, we focus on Au-based binary and ternary alloy systems with Ag, Cu, and Pd, due to their high relevance for nanoplasmonics and complete miscibility, and characterize their optical properties. Moreover, as an example for the relevance of the obtained materials for integration in devices, we...

  3. Microstructure and Antibacterial Properties of AIS1304 Stainless Steel Doped by Ag/Cu%Ag/Cu共渗不锈钢表面的微观结构及抗菌性能研究

    Institute of Scientific and Technical Information of China (English)

    倪红卫; 詹玮婷; 陈荣生

    2011-01-01

    AISI304 stainless steel doped by silver and copper ions simultaneously with glow discharge plasma metallurgy was prepared. The antibacterial properties of Ag/Cu doped stainless steel were estimated by standard plate count method. The doped layer was characterized by energy dispersive X-ray spectrometry(EDS). The corrosion resistance of Ag/Cu doped stainless steel was evaluated by electrochemical polarization curve in 3. 5wt% NaCl solution. The results show that the weight ratio of silver and copper ions existed in the doped layer of stainless steel is 4.9: 3.The corrosion potential of the layer increase from —0. 103V to 0. 07V. The corrosion current densities decrease from 1.66 × 10-7 A/cm2 to 5. 813 × 10-9 A/cm2. The corrosion resistance of stainless steel is enhanced after doped with copper and silver ions. Excellent antibacterial activities (100%) against both Gram-negative Escherichia coli and Grampositive Staphylococcus aureus are obtained for Ag/Cu doped stainless steel%以银铜合金为靶材,利用辉光等离子体在AISI304不锈钢表面同时渗入银和铜,制备性能优良的抗茵不锈钢.对渗层的形貌、化学组成、耐蚀性能和抗菌性能进行了研究,结果表明,所得渗层在不锈钢表面分布均匀,Ag/Cu元素质量比为4.9∶3;不锈钢表面渗层腐蚀电位由-0.103V提高到0.07V,自腐蚀电流密度从1.66×10-7A/cm2降至5.813×10-9A/cm2,耐腐蚀性能有所提高;渗层对大肠杆菌和金黄色葡萄球菌的杀菌率均达100%.

  4. From Journals

    Directory of Open Access Journals (Sweden)

    Nedjeljko Frančula

    2013-06-01

    Full Text Available From the field of cartography and geoinformation, there are journal’s article extracts given which are not cartographic first and whose complete texts are on the Internet, accessible to the members of Croatian academic and research community. Most journals can be accessed through the PERO browser (http://knjiznica.irb.hr/pero/index.php. For the journals not found through this browser, the complete texts of the mentioned articles are available for free on the given web-address. Next to every jo­urnal headline, in the brackets, it is noted which prominent bibliographic and quotation bases it is placed in: CC (Current Contents, SCIE (Science Citati­­on Index Expanded, and SSCI (Social Sc­­­i­ence Citation Index. It should be noted that, for some journals accessible through PERO browser, there is a delay of 6, 12 and even 18 months in accessing the newest issues. This number is given in the brackets next to the journal’s headline.Bullettin of the GSI (Geospatial Information Authority of Japanhttp://www.gsi.go.jp/ENGLISH/page_e30092.htmlK. Kawase: A general formula for calculating meridian arc length and its application to coordinate conversion in the Gauss-Krüger projection, Vol. 59, December 2011.K. Kawase: Concise derivation of extensive coordinate conversion formulae in the Gauss-Krüger pro­jection, Vol. 60, December 2012.Coordinates (A monthly magazine on positioning, navigation and beyond http://mycoordinates.orgT. Nagayama, K. Inaba, T. Hayashi, H: Nakai: Responding to the great east Japan earthquake, 2012, 12.J. SF Fabic: Data integration and sharing for disaster management, 2012, 12.D. Ampatzidis: Datum transformations using exclusively geodetic curvilinear coordinates without height information, 2012, 12.Geomatics and Environmental Engineeringhttp://journals.bg.agh.edu.pl/GEOMATICS/index.phpR. Cellmer, A. Senetra, A. Szczepanska: Land value maps of naturally valuable areas, 2012, 3.Geopolitics (CC, SSCI (12J. Strandsbjerg

  5. Journal standards.

    Science.gov (United States)

    Jackson, R

    2003-08-01

    Despite its many imperfections, the peer review process is a firmly established quality control system for scientific literature. It gives readers some assurance that the work and views that are reported meet standards that are acceptable to a journal. Maureen Revington's editorial in a recent issue of the Australian Veterinary Journal (Revington2002) gives a good concise warts and all overview of the process and is well worth reading. I have some concerns about several articles in the December 2002 issue of the New Zealand Veterinary Journal (Volume 50, Number 6), devoted to the health and welfare of farmed deer, that relate to extensive citing of non-peer reviewed papers. I can understand the need for information to flow from researchers to the wider community but that need is already satisfied by publications such as the proceedings of the Deer Branch of the New Zealand Veterinary Association and Proceedings of the New Zealand Society of Animal Production. Non-peer reviewed papers have been cited in the Journal in the past but never to the extent displayed in this particular issue. It degrades the peer-review process and creates an added burden for reviewers who are forced to grapple with the uncertainties of the science in non-peer reviewed citations. One of my fears is that this process allows science from non peer reviewed articles to be legitimised by its inclusion in a peer reviewed journal and perhaps go on to be accepted as dogma. This is a real danger given the difficulties associated with tracing back to original citations and the increasing volume of scientific literature. It also affords opportunities for agencies to pick up questionable and doubtful science and tout it as support for their products or particular points of view. If deer researchers choose to publish most of their work in proceedings then so be it. However this approach, which seems to becoming increasingly prevalent in the deer sector, is questionable from an established science point

  6. Ag Nanoparticles Loaded CuMoO4 Nanowires with Enhanced Photocatalytic Oxidative Activities%Ag/CuMoO4纳米线的制备及其光催化活性的研究

    Institute of Scientific and Technical Information of China (English)

    王文杰; 甄延忠

    2014-01-01

    采用水热技术获得了CuMoO4纳米线,通过光还原技术成功将Ag负载到CuMoO4纳米线材料上.利用罗丹明B模拟水中污染物,考察了CuMoO4和Ag/CuMoO4的光催化活性.研究结果表明:Ag均匀沉积在CuMoO4表面,提高了CuMoO4的光生电子-空穴对的分离效率,从而有效提高了催化剂的活性,对罗丹明B的降解率达95%.

  7. Electrodeposition of lead-free, tin-based alloy solder films

    Science.gov (United States)

    Han, Chunfen

    The dominant materials used for solders in electronic assemblies over the past 60 years have been Pb-Sn alloys. Increasing pressure from environmental and health authorities has stimulated the development of various Pb-free solders. Two of the most promising replacements are eutectic Sn-Cu and Sn-Ag-Cu alloys that are produced primarily by electrodeposition. During soldering and solid state aging (storage or in service of the electronic assemblies), interactions take place at the solder/substrate metal interface and form intermetallic compounds (IMCs) which are crucial for the reliability of the solder joints. Simple and "green" Sn-citrate and Sn-Cu-citrate solutions have been developed and optimized to electrodeposit eutectic and near eutectic Sn-Cu solder films. Sn-citrate suspensions with Cu particles and Sn-Cu-citrate suspensions with Ag nano-particles have also been developed and optimized to allow for electrochemical composite deposition of eutectic and near eutectic Sn-Cu and Sn-Ag-Cu solder films. Different plating and post-plating conditions, including solution concentration, current density, agitation, additives, and aging, have been investigated by evaluating their effects on plating rate, deposit composition and microstructure. Tri-ammonium citrate is used as the only complexing agent for Sn, Sn-Cu, and Sn-Ag-Cu deposition. Speciation diagram calculations, reduction potential calculations, and polarization studies are conducted to study Sn-citrate solution chemistry and the kinetics of Sn electrodeposition. X-ray photoelectron spectroscopy (XPS) analysis is used to identify the precipitates formed in Sn-citrate solutions at low pH. Current-controlled and potential-controlled electrochemical techniques, nucleation modeling, and surface morphology characterization techniques are applied to study the nucleation and film growth mechanism of Sn and Sn-Cu electrodeposition from Sn-citrate and Sn-Cu-citrate solutions. Reflow and aging tests for deposited Sn

  8. Fine Structure of Ag-Cu Bimetallic Nanoparticles in Silicate Glass%硅酸盐玻璃中银铜双金属纳米颗粒的精细结构

    Institute of Scientific and Technical Information of China (English)

    赵建富; 杨修春; 黄敏; 姜政; 黄宇营

    2012-01-01

    采用离子交换结合热处理方法制备了银铜纳米颗粒/硅酸盐玻璃复合材料。利用扩展X射线吸收精细结构谱和紫外-可见吸收光谱对复合材料中银铜纳米晶的精细结构进行了表征和分析。结果表明:玻璃中银铜纳米颗粒各自分散在玻璃基质中;银纳米颗粒的Ag-Ag键长由于制备过程中产生的张应力使标准银箔发生了膨胀;铜纳米颗粒表面的Cu-O配位数由于Cu-Cu配位的出现而降低,且Cu-Cu配位数远小于标准铜箔中Cu-Cu的配位数,其键长也发生了收缩。%Bimetallic Ag-Cu nano-particles were prepared via ion-exchange and subsequently thermal treatment. The formation process and local structure of Ag-Cu nano-particles in composite materials were characterized by extended X-ray absorption fine structure technique and ultraviolet-visible absorption spectroscopy, respectively. The results indicate that Ag and Cu nano-particles exist in the silicate glass. Compared to the corresponding value of Ag foil, the nearest-neighboring Ag-Ag distance expanded due to the tensile stress in the synthesis process. The Cu-Cu coordination appeared, inducing a decrease of the Cu-O coordination number. The Cu-Cu coordination number was smaller than the corresponding value of Cu foil, and the Cu-Cu distance contracted compared to the corresponding value of Cu foil.

  9. DFT study of Hg adsorption on M-substituted Pd(1 1 1) and PdM/γ-Al2O3(1 1 0) (M = Au, Ag, Cu) surfaces

    Science.gov (United States)

    Wang, Jiancheng; Yu, Huafeng; Geng, Lu; Liu, Jianwen; Han, Lina; Chang, Liping; Feng, Gang; Ling, Lixia

    2015-11-01

    The adsorption of Hgn (n = 1-3) on the Au-, Ag-, Cu-substituted Pd(1 1 1) surfaces as well as the PdM/γ-Al2O3(1 1 0) (M = Au, Ag, Cu) surfaces has been investigated using spin-polarized density functional theory calculations. It is found that M-substituted Pd(1 1 1) surfaces show as good Hg adsorption capacity as the perfect Pd(1 1 1) at low Hg coverage, while the Hg adsorption capacity is only slightly weakened at high Hg coverage. On the basis of stepwise adsorption energies analysis, it is concluded that M-substituted Pd(1 1 1) surfaces can contribute to the binding of Hg atom on the surfaces at high Hg coverage. The electronic properties of the second metal atoms are the main factor contributes to the Hg adsorption capacity. Gas phase Pd2 shows better Hg adsorption capacity than Pd2/γ-Al2O3, while PdM/γ-Al2O3 can adsorb Hg more efficiently than bare PdM clusters. It suggests that the γ-Al2O3 support can enhance the activity of PdM for Hg adsorption and reduces the activity of Pd2. It is also found that Pd is the main active composition responsible for the interaction of mercury with the surface for PdM/γ-Al2O3 sorbent. Taking Hg adsorption capacity and economic costs into account, Cu addition is a comparatively good candidate for Hg capture.

  10. Superior effect of Ni-substitution on the hydrogenation kinetics of Mg{sub 6}Pd{sub 1−x}TM{sub x} (TM = Ag, Cu, Ni) pseudo-binary compounds

    Energy Technology Data Exchange (ETDEWEB)

    Ponthieu, M. [MIRE-Group, Laboratorio de Física de Materiales de Interés Energético, Dpto Física de Materiales, Facultad de Ciencias, Universidad Autónoma de Madrid, 28049 Madrid (Spain); ICMPE/CNRS-UPEC, UMR 7182, 2-8 rue Henri Dunant, 94320 Thiais (France); Fernández, J.F., E-mail: josefrancisco.fernandez@uam.es [MIRE-Group, Laboratorio de Física de Materiales de Interés Energético, Dpto Física de Materiales, Facultad de Ciencias, Universidad Autónoma de Madrid, 28049 Madrid (Spain); Cuevas, F. [ICMPE/CNRS-UPEC, UMR 7182, 2-8 rue Henri Dunant, 94320 Thiais (France); Laversenne, L. [Institut Néel, CNRS, Grenoble (France); Bodega, J.; Ares, J.R.; Sánchez, C. [MIRE-Group, Laboratorio de Física de Materiales de Interés Energético, Dpto Física de Materiales, Facultad de Ciencias, Universidad Autónoma de Madrid, 28049 Madrid (Spain)

    2015-10-05

    Highlights: • Kinetics of (de)hydrogenation of Mg{sub 6}(Pd,TM) TM = Ag, Cu and Ni compared. • Faster hydrogenation kinetics for the Ni compound. • Faster H-desorption for the Ni compound due to MgH{sub 2}/Mg{sub 2}NiH{sub 4} synergy. - Abstract: In this investigation, the H-sorption kinetics of Mg{sub 6}Pd and Mg{sub 6}Pd{sub 1−x}TM{sub x} (TM = Ag, Cu, Ni) pseudo-binary compounds at the TM solubility limit have been studied by isothermal hydrogen absorption, thermal desorption spectroscopy and in situ neutron diffraction. Among all studied compounds, the fastest absorption kinetics takes place for the Ni-substituted one. The fit of the absorption curves to established model equations for solid–gas reaction shows that hydrogenation is controlled by diffusion. As for desorption, the peak temperature for the Ni-substituted compound is 90 K below that of MgH{sub 2}/Mg system and is characterised by a low activation energy of 68 kJ/molH{sub 2}. To better understand these results, neutron diffraction experiments during in situ thermal desorption of deuterated Mg{sub 6}Pd and Mg{sub 6}Pd{sub 0.25}Ni{sub 0.75} compounds were carried out. These experiments demonstrate a synergetic effect between MgH{sub 2} and Mg{sub 2}NiH{sub 4} hydrides as responsible for the remarkable kinetics of the Ni-containing compound.

  11. Impact of Cooling Rate-Induced Recrystallization on High G Mechanical Shock and Thermal Cycling in Sn-Ag-Cu Solder Interconnects

    Science.gov (United States)

    Lee, Tae-Kyu; Bieler, Thomas R.; Kim, Choong-Un

    2016-01-01

    The mechanical stability and thermo-mechanical fatigue performance of solder joints with low silver content Sn-1.0Ag-0.5Cu (wt.%) (SAC105) alloy based on different cooling rates are investigated in high G level shock environment and thermal cycling conditions. The cooling rate-controlled samples ranging from 1°C/min to 75°C/min cooling rate, not only show differences in microstructure, where a fine poly-granular microstructure develops in the case of fast cooling versus normal cooling, but also show various shock performances based on the microstructure changes. The fast cooling rate improves the high G shock performance by over 90% compared to the normal cooled SAC105 alloy air-cooling environment commonly used after assembly reflow. The microstructure effect on thermal cycling performance is also discussed, which is analyzed based on the Sn grain orientation, interconnect stability, and solder joint bulk microstructure.

  12. Good journalism or peace journalism?

    Directory of Open Access Journals (Sweden)

    David Loyn

    2007-10-01

    Full Text Available This paper argues against the prescriptive notions of Peace Journalism, and in particular its exclusive nature and attempt to define itself as a new orthodoxy. Most of the paper is a critique of the work of Jake Lynch and Annabel McGoldrick, in a book published in 2005, as well as their earlier Reporting the World series. They condemn all other ways of reporting as 'War Journalism, biased in favour of war.' I argue instead that the opposite of Peace Journalism is good journalism. Much of this Peace Journalism argument is derived from the work of Johan Galtung, who accuses 'war journalists' of reporting war in an enclosed space and time, with no context, concealing peace initiatives and making wars 'opaque/secret.' Galtung specifically calls on journalists as part of their mission to search out peace proposals which might begin as something small and beneath notice, but which might then be picked up and owned by politicians as their own. My response is clear and simple: creating peacemaking politicians is not the business of a reporter. I examine the traditional journalistic methods of using objectivity to get at a version of the truth. I concede that perfect truth is unattainable, (and paradoxically the tool of objectivity we use to get there is slippery too. I conclude that a more quotidian truth, or 'truthfulness' is though a manageable goal. I engage with philosophers who examine objectivity, concluding with the assistance of Thomas Nagel that it does still have a value. Nagel's account also has the merit of explaining how practices such as peace-reporting are bound to be less objective than alternatives, 'since they commit themselves to the adoption of particular perspectives, in effect giving up on the ideal of stripping away as much…as possible.' I examine the responses of the so-called 'journalism of attachment' framed as a desire of journalists faced by the horrors of Bosnia to cast off impartiality and emotional detachment and take

  13. Development of Ag-Cu-Zn-Sn brazing filler metals with a 1 0 weight-% reduction of silver and same liquidus temperature

    Institute of Scientific and Technical Information of China (English)

    Daniel Schnee; Gunther Wiehl; Sebastian Starck; Chen Kevin

    2014-01-01

    With BrazeTec BlueBraze the manufacturers in HVACR industry have an alternative filler metal with 10 weight-%less silver but same brazing temperatures.The performance of these new alloys has been evaluated in several tests.The evaluation included wetting investigations,metallographic examinations,joint strength at different temperatures and pulsation and corrosion resistance.The results ofthese tests will be presented in this paper.

  14. Dissimilar laser brazing of h-BN and WC-Co alloy in Ar atmosphere without evacuation process

    Science.gov (United States)

    Sechi, Y.; Nagatsuka, K.; Nakata, K.

    2012-08-01

    Laser brazing with Ti as an active element in Ag-Cu alloy braze metal has been successfully applied to dissimilar joining of h-BN and WC-Co alloy in Ar (99.999% purity) gas flow atmosphere without any evacuation process. Good wettability of the braze metal with h-BN and WC-Co alloy were confirmed by the observation and structural analysis of the interface by electron probe micro-analysis and scanning acoustic microscopy. The oxidation of titanium was not observed and this showed that the laser brazing with titanium as an active element in braze metal could be performed even in an Ar gas flow atmosphere without an evacuation process using a high-vacuum furnace.

  15. 合金元素对Sn-Bi-Sb-Ag-Cu-Re系无铅钎料性能和组织的影响%Effect of alloying elements on properties and microstructure of Sn-Bi-Sb-Ag-Cu-Re lead-free solder

    Institute of Scientific and Technical Information of China (English)

    王宗杰; 路林; 王敏

    2005-01-01

    研究了合金元素Bi、Sb、Ag、Cu、Re对锡基无铅多元钎料性能和组织的影响.研究结果表明,增加Bi、Ag、Cu含量可以降低液相线温度,Sb 可以提高液相线温度;Bi、Cu有提高润湿性能的作用,Sb、Ag、Re在低含量范围内可提高润湿性能;Cu有提高剪切强度的作用,Bi明显使剪切强度降低.钎料的相组成是由在β-Sn的基体上分布着金属间化合物Ag3Sn、SnBi和Cu6Sn5构成的,Sb和Re则基本上是固溶在基体中.

  16. Manufacturing Techniques for Titanium Aluminide Based Alloys and Metal Matrix Composites

    Science.gov (United States)

    2010-01-01

    Journal of Alloys and Compounds , vol. 484, pp. 816-821, 2009. 75. C. F. Yolton, Y-W. Kim, and U. Habel, Gamma Titanium Aluminides 2003. [ed.] Y-W. Kim... Journal of Alloys and Compounds , vol. 368, pp. 187-196, 2004. 86. Bohn R., Klassen T., and Bormann R, “Mechanical Behavior of Submicron- grained...Alloying,” Journal of Alloys and Compounds , vol. 471, pp. 93-97, 2009. 201 90. N. Forouzanmehr, F.

  17. Journal bearing

    Science.gov (United States)

    Menke, John R.; Boeker, Gilbert F.

    1976-05-11

    1. An improved journal bearing comprising in combination a non-rotatable cylindrical bearing member having a first bearing surface, a rotatable cylindrical bearing member having a confronting second bearing surface having a plurality of bearing elements, a source of lubricant adjacent said bearing elements for supplying lubricant thereto, each bearing element consisting of a pair of elongated relatively shallowly depressed surfaces lying in a cylindrical surface co-axial with the non-depressed surface and diverging from one another in the direction of rotation and obliquely arranged with respect to the axis of rotation of said rotatable member to cause a flow of lubricant longitudinally along said depressed surfaces from their distal ends toward their proximal ends as said bearing members are rotated relative to one another, each depressed surface subtending a radial angle of less than 360.degree., and means for rotating said rotatable bearing member to cause the lubricant to flow across and along said depressed surfaces, the flow of lubricant being impeded by the non-depressed portions of said second bearing surface to cause an increase in the lubricant pressure.

  18. Cu含量对Ag-Cu钎料钎焊透氧膜界面结构的影响%Effect of Cu Content on Interface Microstructures of Oxygen-Permeable Membrane Brazed with Ag-Cu Brazing Filler

    Institute of Scientific and Technical Information of China (English)

    王方; 张玉文; 丁伟中; 鲁雄刚

    2011-01-01

    采用Ag-Cu钎料用于透氧膜与不锈钢支撑体之间的封接,研究了Cu含量对Ag-Cu钎料钎焊透氧膜界面结构的影响.利用SEM对连接界面的显微组织进行观察,并用EDS对界面的相组成进行分析.结果表明:纯Ag与透氧膜陶瓷之间的连接界面无元素互扩散;Ag中少量1 at%Cu的添加并未明显改善钎焊连接界面:当Cu含量增加到3.3 at%时,在透氧膜一侧生成一层由Cu和Ag扩散所致的厚度约200 μm的反应层,反应层的生成表明Ag-3.3Cu钎料与透氧膜之间具有良好的润湿性和界面结合.%Ag-Cu brazing filler were adopted to seal oxygen-permeable membrane ceramics and stainless steel support, and the effect of Cu content on interface microstructure of oxygen-permeable membrane brazed with Ag-Cu brazing filler was investigated. The microstructure of the interface was observed by SEM and the constituent phases were analyzed by EDS. The results show that no elemental interdiffusion occurs in the interface of pure Ag and oxygen-permeable membrane; the addition of 1 at%Cu doesn't improve the bonding of the interface obviously; when the Cu content reaches 3.3 at%, a reaction layer of about 200μrn in thickness forms on the membrane side due to the diffusion of Cu and Ag, which indicates the good wetting ability and interface bonding between Ag-3.3Cu brazing filler and oxygen-permeable membrane.

  19. Psychology journals

    Directory of Open Access Journals (Sweden)

    Gualberto Buela-Casal

    2007-01-01

    Full Text Available El concepto de publicación internacional es uno de los criterios más utilizado para evaluar la productividad de los investigadores y de las instituciones científicas. Sin embargo, también es uno de los más polémicos, dado que hasta la actualidad no se había definido ni establecido un Índice de Internacionalidad. Este estudio descriptivo analiza las revistas españolas de Psicología incluidas en la base de datos IN-RECS según su nivel de internacionalidad. Cada revista fue evaluada teniendo en cuenta los once criterios de internacionalidad (idioma de publicación, factor de impacto -en este caso el Índice de Impacto según IN-RECS-, países de procedencia de los miembros del los comités editoriales, nombres de la revista, inclusión en el Journal Citation Reports, países de procedencia de los autores, normas de publicación, acceso por internet, acceso por internet gratuito, inclusión en bases de datos y pertenencia a las instituciones “internacionales”. Se sumaron las puntuaciones en todos los criterios y los totales fueron ordenados de mayor a menor dando como resultado el Índice de Internacionalidad de las Revistas Españolas de Psicología. Entre los resultados cabe resaltar que de las cinco primeras revistas del ranking de internacionalidad cuatro son revistas indexadas en la Web of Science.

  20. Study of tin-silver-copper alloy reliability through material microstructure evolution and laser moire interferometry

    Science.gov (United States)

    Tunga, Krishna Rajaram

    This research aims to understand the reliability of Sn-Ag-Cu solder interconnects used in plastic ball grid array (PBGA) packages using microstructure evolution, laser moire interferometry and finite-element modeling. A particle coarsening based microstructure evolution of the solder joint material during thermal excursions was studied for extended periods of time lasting for several months. The microstructure evolution and particle coarsening was quantified, and acceleration factors were determined between benign field-use conditions and accelerated thermal cycling (ATC) conditions for PBGA packages with different form factors and for two different lead-free solder alloys. A new technique using laser moire interferometry was developed to assess the deformation behavior of Sn-Ag-Cu based solder joints during thermal excursions. This technique can used to estimate the fatigue life of solder joints quickly in a matter of few days instead of months and can be extended to cover a wide range of temperature regimes. Finite-element analysis (FEA) in conjunction with experimental data from the ATC for different lead-free PBGA packages was used to develop a fatigue life model that can be used to predict solder joint fatigue life for any PBGA package. The proposed model will be able to predict the mean number of cycles required for crack initiation and crack growth rate in a solder joint.

  1. Constitutive Behavior of Mixed Sn-Pb/Sn-3.0Ag-0.5Cu Solder Alloys

    Science.gov (United States)

    Tucker, J. P.; Chan, D. K.; Subbarayan, G.; Handwerker, C. A.

    2012-03-01

    During the transition from Pb-containing solders to Pb-free solders, joints composed of a mixture of Sn-Pb and Sn-Ag-Cu often result from either mixed assemblies or rework. Comprehensive characterization of the mechanical behavior of these mixed solder alloys resulting in a deformationally complete constitutive description is necessary to predict failure of mixed alloy solder joints. Three alloys with 1 wt.%, 5 wt.%, and 20 wt.% Pb were selected so as to represent reasonable ranges of Pb contamination expected from different 63Sn-37Pb components mixed with Sn-3.0Ag-0.5Cu. Creep and displacement-controlled tests were performed on specially designed assemblies at temperatures of 25°C, 75°C, and 125°C using a double lap shear test setup that ensures a nearly homogeneous state of plastic strain at the joint interface. The observed changes in creep and tensile behavior with Pb additions were related to phase equilibria and microstructure differences observed through differential scanning calorimetric and scanning electron microscopic cross-sectional analysis. As Pb content increased, the steady-state creep strain rates increased, and primary creep decreased. Even 1 wt.% Pb addition was sufficient to induce substantially large creep strains relative to the Sn-3.0Ag-0.5Cu alloy. We describe rate-dependent constitutive models for Pb-contaminated Sn-Ag-Cu solder alloys, ranging from the traditional time-hardening creep model to the viscoplastic Anand model. We illustrate the utility of these constitutive models by examining the inelastic response of a chip-scale package (CSP) under thermomechanical loading through finite-element analysis. The models predict that, as Pb content increases, total inelastic dissipation decreases.

  2. Developments of Electromigration of Sn-Ag-Cu Lead-free Interconnect Solder Joints%Sn-Ag-Cu无铅钎料互连焊点的电迁移研究进展

    Institute of Scientific and Technical Information of China (English)

    王玲; 刘晓剑; 万超

    2013-01-01

      电迁移问题作为影响焊点可靠性的关键问题之一,容易导致焊点出现裂纹、丘凸和空洞等焊接缺陷。其失效机制有电流拥挤效应、焦耳热效应、极化效应和金属间化合物失效等。聚焦Sn-Ag-Cu系无铅钎料焊点的电迁移问题,介绍了这一领域电迁移的失效机制、影响因素和防止措施的研究现状,并展望了今后的研究发展趋势。%As one of the key issues affecting the solder joint reliability, electro-migration problems can cause the failure in the form of solder joints crack, mound convex, voids and other defects. The failure mechanisms include current crowding effect, joule heating, polarization effects, and intermetallic compounds, and so on. Focused on the electromigration problems of Sn-Ag-Cu lead-free solder, comprehensively describe the failure modes, influencing factors and preventing measures of this area and outlook of its future research trends.

  3. Ag/CuO nanoparticles prepared from a novel trinuclear compound [Cu(Imdz)4(Ag(CN)2)2] (Imdz = imidazole) by a pyrolysis display excellent antimicrobial activity

    Science.gov (United States)

    Adhikary, Jaydeep; Das, Balaram; Chatterjee, Sourav; Dash, Sandeep Kumar; Chattopadhyay, Sourav; Roy, Somenath; Chen, Jeng-Wei; Chattopadhyay, Tanmay

    2016-06-01

    One copper and two silver containing one hetero tri-nuclear precursor compound [Cu(Imdz)4(Ag(CN)2)2] (1) (Imdz = Imidazole) has been synthesized and characterized by single crystal X-ray diffraction. Simple pyrolysis of the complex at 550 °C for 4 h afforded Ag/CuO nanoparticles (NPs). The synthesized nanoparticles were characterized by ultraviolet-visible (UV-Vis), Fourier transform infrared (FT-IR), X-ray powder diffraction (XRPD), dynamic light scattering (DLS), scanning electron microscopy (SEM), transmission electron microscopy (TEM), energy dispersive X-ray (EDX) and X-ray photo electron spectroscopy (XPS). Staphylococcus aureus (S. aureus) and Escherichia coli (E. coli) have been employed as model microbial species to study the anti-microbial activity of the synthesized NPs. The NPs showed potent anti-microbial activity evidenced from the Minimum Inhibitory Concentration (MIC) and Minimum Bactericidal Concentration (MBC) values. Very high level of cell uptake and then generation of reactive oxygen species (ROS) are the origin of such strong antimicrobial activity for the NPs. However, the cytotoxicity level of the NPs towards normal human cell is very low.

  4. Journalism Education in Canada.

    Science.gov (United States)

    MacDonald, Dick; Russell, Catharine

    Twenty-four of the 35 Canadian schools with formal journalism programs responded to a survey conducted to collect data about enrollment, curricula, faculty background in journalism, and the ability of journalism graduates to find jobs in the profession. Highlights of the results are as follows: there are an estimated 3,300 journalism students in…

  5. European journals on microbiology.

    Science.gov (United States)

    Ronda, C; Vázquez, M

    1997-12-01

    A survey on the scientific journals dealing with microbiology published in Europe has been carried out. Eighteen European countries publish microbiological journals with the United Kingdom. Netherlands and Germany leading in number of journals on this specialty. Most of the European journals on microbiology are published bimonthly (27%), and English is the most common language used (54%). Most of these journals (86%) are included in some database, but only 36 (25%) are indexed in the six databases studied. Out of the 146 journals registered, 71 (49%), published in 11 European countries, are included in the 1995 Journal Citation Reports (ISI, Philadelphia).

  6. Parametric Study of Amorphous High-Entropy Alloys formation from two New Perspectives: Atomic Radius Modification and Crystalline Structure of Alloying Elements

    Science.gov (United States)

    Hu, Q.; Guo, S.; Wang, J.M.; Yan, Y.H.; Chen, S.S.; Lu, D.P.; Liu, K.M.; Zou, J.Z.; Zeng, X.R.

    2017-01-01

    Chemical and topological parameters have been widely used for predicting the phase selection in high-entropy alloys (HEAs). Nevertheless, previous studies could be faulted due to the small number of available data points, the negligence of kinetic effects, and the insensitivity to small compositional changes. Here in this work, 92 TiZrHfM, TiZrHfMM, TiZrHfMMM (M = Fe, Cr, V, Nb, Al, Ag, Cu, Ni) HEAs were prepared by melt spinning, to build a reliable and sufficiently large material database to inspect the robustness of previously established parameters. Modification of atomic radii by considering the change of local electronic environment in alloys, was critically found out to be superior in distinguishing the formation of amorphous and crystalline alloys, when compared to using atomic radii of pure elements in topological parameters. Moreover, crystal structures of alloying element were found to play an important role in the amorphous phase formation, which was then attributed to how alloying hexagonal-close-packed elements and face-centered-cubic or body-centered-cubic elements can affect the mixing enthalpy. Findings from this work not only provide parametric studies for HEAs with new and important perspectives, but also reveal possibly a hidden connection among some important concepts in various fields. PMID:28051186

  7. Parametric Study of Amorphous High-Entropy Alloys formation from two New Perspectives: Atomic Radius Modification and Crystalline Structure of Alloying Elements.

    Science.gov (United States)

    Hu, Q; Guo, S; Wang, J M; Yan, Y H; Chen, S S; Lu, D P; Liu, K M; Zou, J Z; Zeng, X R

    2017-01-04

    Chemical and topological parameters have been widely used for predicting the phase selection in high-entropy alloys (HEAs). Nevertheless, previous studies could be faulted due to the small number of available data points, the negligence of kinetic effects, and the insensitivity to small compositional changes. Here in this work, 92 TiZrHfM, TiZrHfMM, TiZrHfMMM (M = Fe, Cr, V, Nb, Al, Ag, Cu, Ni) HEAs were prepared by melt spinning, to build a reliable and sufficiently large material database to inspect the robustness of previously established parameters. Modification of atomic radii by considering the change of local electronic environment in alloys, was critically found out to be superior in distinguishing the formation of amorphous and crystalline alloys, when compared to using atomic radii of pure elements in topological parameters. Moreover, crystal structures of alloying element were found to play an important role in the amorphous phase formation, which was then attributed to how alloying hexagonal-close-packed elements and face-centered-cubic or body-centered-cubic elements can affect the mixing enthalpy. Findings from this work not only provide parametric studies for HEAs with new and important perspectives, but also reveal possibly a hidden connection among some important concepts in various fields.

  8. Ranking Economic History Journals

    DEFF Research Database (Denmark)

    Di Vaio, Gianfranco; Weisdorf, Jacob Louis

    This study ranks - for the first time - 12 international academic journals that have economic history as their main topic. The ranking is based on data collected for the year 2007. Journals are ranked using standard citation analysis where we adjust for age, size and self-citation of journals. We...... also compare the leading economic history journals with the leading journals in economics in order to measure the influence on economics of economic history, and vice versa. With a few exceptions, our results confirm the general idea about what economic history journals are the most influential...

  9. Ranking economic history journals

    DEFF Research Database (Denmark)

    Di Vaio, Gianfranco; Weisdorf, Jacob Louis

    2010-01-01

    This study ranks-for the first time-12 international academic journals that have economic history as their main topic. The ranking is based on data collected for the year 2007. Journals are ranked using standard citation analysis where we adjust for age, size and self-citation of journals. We also...... compare the leading economic history journals with the leading journals in economics in order to measure the influence on economics of economic history, and vice versa. With a few exceptions, our results confirm the general idea about what economic history journals are the most influential for economic...

  10. B-Site Metal (Pd, Pt, Ag, Cu, Zn, Ni Promoted La1−xSrxCo1−yFeyO3–δ Perovskite Oxides as Cathodes for IT-SOFCs

    Directory of Open Access Journals (Sweden)

    Shaoli Guo

    2015-03-01

    Full Text Available Perovskite oxides La1−xSrxCo1−yFeyO3–δ (LSCF have been extensively investigated and developed as cathode materials for intermediate temperature solid oxide fuel cells (IT-SOFCs due to mixed ionic–electronic conductivity and high electrooxygen reduction activity for oxygen reduction. Recent literature investigations show that cathode performances can be improved by metal surface modification or B-site substitution on LSCF. Although the specific reaction mechanism needs to be further investigated, the promoting effect of metal species in enhancing oxygen surface exchange and oxygen bulk diffusion is well recognized. To our knowledge, no previous reviews dealing with the effect of metal promotion on the cathodic performances of LSCF materials have been reported. In the present review, recent progresses on metal (Pd, Pt, Ag, Cu, Zn, Ni promotion of LSCF are discussed focusing on two main aspects, the different synthesis approaches used (infiltration, deposition, solid state reaction, one pot citrate method and the effects of metal promotion on structural properties, oxygen vacancies content and cathodic performances. The novelty of the work lies in the fact that the metal promotion at the B-site is discussed in detail, pointing at the effects produced by two different approaches, the LSCF surface modification by the metal or the metal ion substitution at the B-site of the perovskite. Moreover, for the first time in a review article, the importance of the combined effects of oxygen dissociation rate and interfacial oxygen transfer rate between the metal phase and the cathode phase is addressed for metal-promoted LSCF and compared with the un-promoted oxides. Perspectives on new research directions are shortly given in the conclusion.

  11. Effect of diode-laser parameters on shear force of micro-joints soldered with Sn-Ag-Cu lead-free solder on Au/Ni/Cu pad

    Institute of Scientific and Technical Information of China (English)

    WANG Jian-xin; XUE Song-bai; FANG Dian-song; JU Jin-long; HAN Zong-jie; YAO Li-hua

    2006-01-01

    Soldering experiments with Sn-3.5Ag-0.5Cu lead-free solder on Au/Ni/Cu pad were carried out by means of diode-laser and IR reflow soldering methods respectively. The influence of different heating methods as well as output power of diode-laser on shear force of micro-joints was studied and the relationship between the shear force and microstructures of micro-joints was analyzed.The results indicate that the formation of intermetallic compound Ag3Sn is the key factor to affect the shear force and the fine eutectic network structures of micro-joints as well as the dispersion morphology of fine compound Ag3Sn, in which eutectic network band is responsible for the improvement of the shear force of micro-joints soldered with Sn-Ag-Cu lead-free solder. With the increases of output power of diode-laser, the shear force and the microstructures change obviously. The eutectic network structures of micro-joints soldered with diode-laser soldering method are more homogeneous and the grains of Ag3Sn compounds are finer in the range of near optimal output power than those soldered with IR reflow soldering method, so the shear force is also higher than that using IR reflow soldering method. When the output power value of diode-laser is about 41.0 W, the shear force exhibits the highest value that is 70% higher than that using IR reflow soldering method.

  12. [Fourcroy and pharmaceutical journals].

    Science.gov (United States)

    Bonnemain, Bruno

    2011-04-01

    Cadet de Gassicourt wrote a brief Eloge of Fourcroy in January 1810 as he died in December of 1809. Fourcroy had a major role concerning the new ideas on the place of pharmacy at the beginning of the 19th century. Fourcroy has had a key influence for the start of several pharmaceutical journals that wanted to emphasize the link between the new chemistry and pharmacy. None of these journals created with him will survive and one has to wait for 1909 to see the creation, without Fourcroy, of a new pharmaceutical journal, the "Journal de Pharmacie" that will become "Journal de Pharmacie et des Sciences accessoires", then "Journal de Pharmacie et de Chimie", before taking the name of"Annales Pharmaceutiques Françaises", the present official journal of the French Academy of Pharmacy. In spite of the essential role of Fourcroy at the start of pharmaceutical journals, Cadet did not even mention it in his Eloge of 1810.

  13. CHINESE JOURNAL OF CHEMISTRY

    Institute of Scientific and Technical Information of China (English)

    2000-01-01

    @@Chinese Journal of Chemistry is an international journal published in English by the Chinese Chemical Society with its editorial office hosted by Shanghai Institute of Organic Chemistry, Chinese Academy of Sciences.

  14. Journals and Justice.

    Science.gov (United States)

    Curzer, Howard J.

    1996-01-01

    Addresses the process of journal deselection from the point of view of justice and argues that when journal cuts are necessary, libraries should first, reduce all departments to core holdings; second, ask departments with expensive journals for permission to implement an efficiency principle; third, if refused permission, implement an equal…

  15. Sn-Ag-Cu无铅钎料粉末与合金的组织及钎焊性能对比%Microstructure and Solderability of Sn-Ag-Cu Lead-free Solder Powder and Alloy

    Institute of Scientific and Technical Information of China (English)

    许天旱; 王党会

    2009-01-01

    利用自行设计的超音速雾化制粉装置制备了Sn-3Ag-2.8Cu 无铅焊锡粉末,并将不同介质雾化的粉末组织和普通合金组织进行对比,同时选择一种综合性能良好的粉末,将其钎焊性能和普通合金进行对比.结果表明,氮气雾化粉末比空气雾化粉末具有更高的凝固速度;雾化粉末组织更细小,主要由基体上弥散分布的多边形Cu6Sn5 IMC 和粒状Ag3Sn IMC组成;粉末比普通合金与铜基板形成的IMC更不规则,且扩散层与基板的界面更模糊;雾化粉末的蠕变断裂寿命显著高于普通合金.因此,Sn-3Ag-2.8Cu无铅焊锡粉末性能优于普通合金.

  16. MICROSTRUCTURES AND PROPERTIES OF Pb-FREE SOLDER Sn-Ag-Cu SYSTEM ALLOY%Sn-Ag-Cu系无铅焊料的显微组织与性能

    Institute of Scientific and Technical Information of China (English)

    刘艳斌; 吴本生; 杨晓华

    2007-01-01

    用无铅焊料取代现有的含铅焊料已经成为历史发展的必然趋势.Sn-Ag-Cu系合金具有优异的可靠性和可焊性,受到了电子工业界的广泛关注.阐述了近年来该系焊料合金的微观组织和性能的一些研究成果,并对该系无铅焊料的特性进行了比较.结果表明,低银焊料的组织和性能比高银焊料好,而且成本低,为确定综合性能最佳的该系焊料合金提供依据.

  17. Ce对Sn-Ag-Cu系焊料合金的组织与性能影响%Effect of Ce on Microstructure and Properties of Sn-Ag-Cu Solder Alloys

    Institute of Scientific and Technical Information of China (English)

    赵小艳; 赵麦群; 王娅辉; 顾琳; 葛利玲

    2006-01-01

    通过添加稀土Ce研究了Sn-3.0Ag-2.8Cu系焊料合金的显微组织和性能.用光学显微镜、SEM、EDX对其显微组织进行分析,并且对其导电性,润湿性,硬度等重要性能进行测试.结果表明,添加稀土w(Ce)为1%焊料合金的导电性明显提高;而润湿角明显减小,润湿性增强;同时焊料合金的硬度也有所增加.

  18. Ce对SnAgCu系无铅焊锡力学性能的影响%Effect of Cerium on Mechanical Properties of Free- lead Solder Alloy of Sn- Ag- Cu System

    Institute of Scientific and Technical Information of China (English)

    许天旱; 王宇; 黄敏

    2006-01-01

    通过向Sn-3Ag-2.8Cu钎料合金中添加微量稀土Ce,利用扫描电子显微镜(SEM)研究了不同稀土含量对Sn-3Ag-2.8Cu合金的力学性能的影响,同时对显微组织进行了分析.实验结果表明,微量的Ce稀土可以显著提高Sn-3Ag-2.8Cu钎料的延伸率、延长其焊接接头在室温下的蠕变断裂寿命,尤其是当稀土的质量分数为0.1%时,其蠕变断裂寿命可以达到Sn-3Ag-2.8Cu钎料的9倍以上,当稀土的质量分数超过0.1%时,接头的蠕变断裂寿命呈下降趋势.综合考虑,最佳的稀土质量分数为0.05%~0.10%.

  19. Influences of Superheat of Alloy on the Properties of Free-lead Solder Power of Sn-Ag-Cu System%过热度对无铅焊锡雾化粉末特性的影响

    Institute of Scientific and Technical Information of China (English)

    许天旱; 赵麦群; 邸小波; 李涛; 刘阳; 张文韬

    2005-01-01

    利用自行设计的超音速雾化制粉装置,研究了合金过热度对SnAgCu系无铅焊锡粉末有效雾化率、粒度分布、球形度及含氧量的影响.结果表明:随着合金过热度升高,粉末粒度有明显变细趋势,粉末氧含量随着过热度的升高而急剧增大;在其他条件不变,过热度为150℃时,雾化粉末的有效雾化率最高,且球形度较好.与SnPb雾化粉末相比,Sn3Ag2.8Cu无铅焊锡粉末具有较低的含氧量和较高的有效雾化率;Sn3Ag2.8CuCe具有较高的氧含量,有效雾化率高于SnPb,低于Sn3Ag2.8Cu.

  20. Sn-Bi-Ag-Cu钎料通孔焊点剥离现象试验研究%Research Of Fillet- lifting Phenomenon In Through- hole Circuit Soldered By Sn- Bi- Ag- Cu Alloy

    Institute of Scientific and Technical Information of China (English)

    赵智力; 钱乙余; 孙凤莲; 李忠锁

    2005-01-01

    采用Sn-2.0Ag-0.5Cu-7.5Bi钎料,进行通孔波峰焊焊点剥离现象的模拟试验,剥离的断面形貌和成分分析表明,凝固延迟及铋元素偏析导致焊盘拐角附近钎料区在结晶后期残存液相并最终成为缩孔的聚集区,结晶后期该区的低塑性使收缩应变容易超过材料的塑性而发生开裂,发生机制与结晶裂纹发生机制相同,强偏析元素铋的存在导致剥离概率极高.钎焊后急冷仅能在一定程度上降低剥离的发生率.

  1. La对Sn-Ag-Cu无铅钎料组织与性能的影响%Effects of La on Microstructures and Properties of Sn - Ag - Cu Lead - Free Solder Alloy

    Institute of Scientific and Technical Information of China (English)

    周迎春; 潘清林; 何运斌; 梁文杰; 李文斌; 李运春; 路聪阁

    2007-01-01

    研究了微量稀土La对Sn-3.0Ag-0.5Cu无铅钎料显微组织、力学性能、断口形貌、润湿性能和熔点的影响.结果表明:La的质量分数为0.1%可使钎料合金晶粒细化,并显著提高钎料合金力学性能和润湿性能;添加La的质量分数为0.4%将形成粗大LaSn3初生枝晶相,降低力学性能和润湿性能;微量La使钎料合金的熔点轻微增加.

  2. Mechanical Properties and Practical Properties of Sn-Ag-Cu Lead-free Solder Alloys%Sn-Ag-Cu系无铅焊锡的力学性能和实用性能

    Institute of Scientific and Technical Information of China (English)

    赵小艳; 赵麦群; 白艳霞; 王秀春; 王娅辉

    2006-01-01

    研究添加稀土Ce对Sn-Ag-Cu合金的力学性能和实用性能的影响,利用光学显微镜、SEM、EDX对合金的组织、形貌、成分进行分析.结果表明,在Sn-Ag-Cu系无铅焊锡中添加稀土Ce可以细化合金组织,使合金成分分布更加均匀;稀土Ce的添加可以明显提高合金的延伸率;添加Ce后延伸率提高了6.1 %,从而使力学性能大大提高;适量稀土的加入使焊料与基体结合更加紧密,外观平整,对合金的实用性能有很大提高.

  3. Measurement of mechanical properties of Sn-Ag-Cu series lead-free solder alloy by using micro-indentation%微观压痕法测量Sn-Ag-Cu系无铅钎料的力学性能

    Institute of Scientific and Technical Information of China (English)

    王凤江; 钱乙余; 马鑫

    2005-01-01

    Sn-Ag-Cu系合金是最有可能替代Sn-Pb钎料的无铅钎料.介绍了一种测量其力学性能的新方法,即通过微压痕仪精确测量不同加载速率下压子的压入深度h与加载载荷F的关系来确定钎料的弹性模量E和蠕变速率敏感指数m.结果表明:加载速率对钎料蠕变压痕F-h曲线和压入深度有着重要的影响;Oliver-Pharr方法确定的钎料弹性模量取决于卸载过程而与加载速率无关.基于压痕做功概念定义了压痕蠕变硬度和蠕变应变速率,从而给出钎料的蠕变速率敏感指数.Sn-3.5Ag-0.75Cu与Sn-3.0Ag-0.5Cu钎料蠕变压痕测试表明合金成分影响Sn-Ag-Cu系无铅钎料的力学性能.

  4. Sn-Ag-Cu系无铅焊锡成分的优化研究%Study on the 0ptimal Free-lead Solder Alloy of Sn-Ag-Cu System

    Institute of Scientific and Technical Information of China (English)

    许天旱; 赵麦群; 刘新华

    2004-01-01

    通过正交实验法对Sn-Ag-Cu系无铅焊锡合金的成分进行了优化研究.用光学显微镜、电导仪、热分析仪等对合金的微观组织、电导率、熔点、铺展性能进行了分析,并与Sn37Pb进行了对比.结果表明,Ag、Cu对Sn-Ag-Cu系焊锡合金的熔点、铺展性和电导率都有影响,当Ag质量分数为3%,Cu为2.8%,焊锡合金具有最佳的综合性能,且与铜基板的扩散层厚度大于Sn37Pb.

  5. 弱酸性电镀Sn-Ag-Cu合金及镀层焊接性能的研究%Study of Electroplating Process in Weak Acid Bath and Soldering Properties of Sn-Ag-Cu Alloy

    Institute of Scientific and Technical Information of China (English)

    张锦秋; 安茂忠; 刘桂媛; 于文明

    2008-01-01

    对弱酸性甲磺酸盐-碘化物电镀Sn-Ag-Cu合金工艺进行了优化,镀层光亮、致密、平整,阴极电流效率提高到25%左右.Sn-Ag-Cu合金镀层耐蚀性好;部分Sn-Ag-Cu合金镀层在高温高湿条件下有锡须产生;回流焊后Sn-Ag-Cu合金镀层与Sn-3.0Ag-0.5Cu焊料间结合牢固.

  6. 以Ag-Cu合金触点废料制备超细铜粉和银粉%Preparation of Superfine Copper and Silver Powders from Waste Ag-Cu Alloy Contact

    Institute of Scientific and Technical Information of China (English)

    王琪; 周全法; 叶小会

    2010-01-01

    以Ag-Cu合金废触点制备CuCl2和AgCl,采用葡萄糖预还原-水合肼二次还原法制备超细铜粉、氨-肼还原法制备超细银粉.结果表明:在反应温度为70 ℃,加入适量PVP和苯并三氮唑作为分散剂和抗氧化剂的条件下,所得微米级铜粉的粒度在0.3~0.6 μm,粒度分布范围小,纯度高于99.9%.经3个月的抗氧化试验表明,所得铜粉产品的抗氧化性能较高.一定时间的球磨是氨-肼还原法制备超细银粉的关键,经24 h湿法球磨后干燥所得银粉的粒度为1.90 μm,分布均匀.

  7. Preparation of silver copper bimetals powder from waste Ag-Cu alloy contactor%利用废弃银铜合金触点直接制备银铜双金属粉

    Institute of Scientific and Technical Information of China (English)

    王琪; 娄德大; 周全法

    2010-01-01

    研究了利用废弃银铜合金触点(Ag、Cu、Sn质量分数分别约为30 %、60 %和2 %)直接制备银铜双金属粉的工艺.原料以硝酸溶解后,采用葡萄糖预还原和水合肼二次还原,在聚乙烯吡咯烷酮(PVP)的保护下制得了粒径在1μm左右类球形超细银铜双金属粉和超细铜粉.还原前加入尿素,控制反应温度在60 ℃温度下,加入抗氧化剂苯并三氮唑,均可防止铜粉的表面氧化,从而获得高质量的银铜双金属粉,银、铜的回收率达到99 %以上.所得产品可再用于粉末冶金法制备银铜合金触点,或者直接用于制备电子浆料.该工艺可避免银、铜的分离过程,使废弃银、铜合金触点中银、铜的回收和深加工得到有效结合,从而实现节能减排的目标.

  8. Continuous determination of Cu, Al, Zn in Ag- Cu- Al- Zn quarternary alloy by titration%滴定法连续测定银铜铝锌四元合金中Cu,Al,Zn

    Institute of Scientific and Technical Information of China (English)

    麦丽碧

    2004-01-01

    采用连续滴定的方法同时测定Cu,Al,Zn.加入一定量的EDTA标准溶液,使Cu2+,Al3+,Zn2+全部与EDTA络合,用Zn2+盐滴定过量EDTA,然后加氟盐置换出EDTA-Al中的EDTA,用硫脲抗坏血酸和邻菲啰啉置换出EDTA-Cu中的EDTA,并分别用Zn2+盐滴定,从总量中减去Al量和Cu量即得Zn量.滴定Cu,Al,Zn回收率均在98%以上,本法分析快速准确.

  9. Investigation of thermal, mechanical and magnetic behaviors of the Cu-11%Al alloy with Ag and Mn additions

    Energy Technology Data Exchange (ETDEWEB)

    Silva, R.A.G., E-mail: galdino.ricardo@gmail.com [Departamento de Ciencias Exatas e da Terra-UNIFESP, Diadema-SP (Brazil); Paganotti, A.; Gama, S. [Departamento de Ciencias Exatas e da Terra-UNIFESP, Diadema-SP (Brazil); Adorno, A.T.; Carvalho, T.M.; Santos, C.M.A. [Instituto de Quimica - UNESP, Araraquara-SP (Brazil)

    2013-01-15

    The investigation of thermal, mechanical and magnetic behaviors of the Cu-11%Al, Cu-11%Al-3%Ag, Cu-11%Al-10%Mn and Cu-11%Al-10%Mn-3%Ag alloys was made using microhardness measurements, differential scanning calorimetry, X-ray diffractometry, scanning electron microscopy, energy dispersion X-ray spectroscopy and magnetic moment change with applied field measurement. The results indicated that the Mn addition changes the phase stability range, the microhardness values and makes undetectable the eutectoid reaction in annealed Cu-11%Al and Cu-11%Al-3%Ag alloys while the presence of Ag does not modify the phase transformation sequence neither microhardness values of the annealed Cu-11%Al and Cu-11%Al-10%Mn alloys, but it increases the magnetic moment of this latter at about 2.7 times and decreases the rates of eutectoid and peritectoid reactions of the former. - Highlights: Black-Right-Pointing-Pointer The microstructure of Cu-Al alloy is modified in the Ag presence. Black-Right-Pointing-Pointer ({alpha} + {gamma}) phase is stabilized down to room temperature when Ag is added to Cu-Al alloy. Black-Right-Pointing-Pointer Ag-rich phase modifies the magnetic characteristics of Cu-Al-Mn alloy.

  10. How to Rank Journals.

    Science.gov (United States)

    Bradshaw, Corey J A; Brook, Barry W

    2016-01-01

    There are now many methods available to assess the relative citation performance of peer-reviewed journals. Regardless of their individual faults and advantages, citation-based metrics are used by researchers to maximize the citation potential of their articles, and by employers to rank academic track records. The absolute value of any particular index is arguably meaningless unless compared to other journals, and different metrics result in divergent rankings. To provide a simple yet more objective way to rank journals within and among disciplines, we developed a κ-resampled composite journal rank incorporating five popular citation indices: Impact Factor, Immediacy Index, Source-Normalized Impact Per Paper, SCImago Journal Rank and Google 5-year h-index; this approach provides an index of relative rank uncertainty. We applied the approach to six sample sets of scientific journals from Ecology (n = 100 journals), Medicine (n = 100), Multidisciplinary (n = 50); Ecology + Multidisciplinary (n = 25), Obstetrics & Gynaecology (n = 25) and Marine Biology & Fisheries (n = 25). We then cross-compared the κ-resampled ranking for the Ecology + Multidisciplinary journal set to the results of a survey of 188 publishing ecologists who were asked to rank the same journals, and found a 0.68-0.84 Spearman's ρ correlation between the two rankings datasets. Our composite index approach therefore approximates relative journal reputation, at least for that discipline. Agglomerative and divisive clustering and multi-dimensional scaling techniques applied to the Ecology + Multidisciplinary journal set identified specific clusters of similarly ranked journals, with only Nature & Science separating out from the others. When comparing a selection of journals within or among disciplines, we recommend collecting multiple citation-based metrics for a sample of relevant and realistic journals to calculate the composite rankings and their relative uncertainty windows.

  11. Ranking Economic History Journals

    DEFF Research Database (Denmark)

    Di Vaio, Gianfranco; Weisdorf, Jacob Louis

    This study ranks - for the first time - 12 international academic journals that have economic history as their main topic. The ranking is based on data collected for the year 2007. Journals are ranked using standard citation analysis where we adjust for age, size and self-citation of journals. We...... also compare the leading economic history journals with the leading journals in economics in order to measure the influence on economics of economic history, and vice versa. With a few exceptions, our results confirm the general idea about what economic history journals are the most influential...... for economic history, and that, although economic history is quite independent from economics as a whole, knowledge exchange between the two fields is indeed going on....

  12. About the Journal

    OpenAIRE

    Endri Papajorgji

    2015-01-01

    About the Journal Academic Journal of Business, Administration, Law and Social Sciences is an international peer-reviewed journal published three times a year by International Institute for Private, Commercial and Competition Law. The need for different approaches in science, such as in business, economics, law, administration and social sciences is a must in the whole field of scientific research. Academics, Professors, Researchers, Students and the whole world is in a new era of communicati...

  13. Microstructure and Reliability Comparison of Different Pb-Free Alloys Used for Wave Soldering and Rework

    Science.gov (United States)

    Snugovsky, Polina; Bagheri, Zohreh; Hamilton, Craig

    2009-12-01

    This paper describes the results of an intensive microstructural and reliability study of pin-through-hole (PTH) and surface mount technology (SMT) components which were wave solder assembled using three groups of alloys: (1) near-eutectic Sn-Ag-Cu alloys such as SAC405 and SAC305, (2) low-Ag off-eutectic Pb-free alloys with an Ag content of about 1% and lower, and (3) eutectic Sn-Cu alloys with Ni and other additives. Both primary attach and reworked solder connections using solder fountain and hand rework were studied. The PTH connector types and SMT components were wave solder assembled on a test vehicle. Accelerated thermal cycling (ATC) was conducted at 0°C to 100°C for 6000 cycles. The difference in microstructures, intermetallic formation, Cu dissolution, grain coarsening, and crack formation is shown. The influence of the microstructure after assembly and rework on Weibull plot parameters and failure modes is described for 2512 resistors. Interconnect defects such as nonuniform phase distribution and void formation are discussed. The Sn-Cu-Ni- and Sn-Cu-Ag-Bi-based alloys tested in this study are recommended as potential suitable replacements for SAC305/405 in the wave solder process; no failure was detected up to 6000 cycles at 0°C to 100°C. Although SAC405 demonstrated better barrel fill and lower rate of crack propagation during ATC, after PTH rework, both of the alternative Pb-free alloys have a much lower Cu dissolution rate and definitely outperform SAC405 in ATC. SAC405 glue and wave resistors after primary attachment and rework demonstrate higher reliability than alternative alloys. Early failures relate to alternative alloy characteristics and should be considered for some applications.

  14. Formation of the BiAg2 surface alloy on lattice-mismatched interfaces

    Science.gov (United States)

    Abd El-Fattah, Z. M.; Lutz, P.; Piquero-Zulaica, I.; Lobo-Checa, J.; Schiller, F.; Bentmann, H.; Ortega, J. E.; Reinert, F.

    2016-10-01

    We report on the growth of a monolayer-thick BiAg2 surface alloy on thin Ag films grown on Pt(111) and Cu(111). Using low energy electron diffraction (LEED), angle resolved photoemission spectroscopy (ARPES), and scanning tunneling microscopy (STM) we show that the surface structure of the 1/3 ML Bi/x -ML Ag/Pt(111) system (x ≥2 ) is strongly affected by the annealing temperature required to form the alloy. As judged from the characteristic (√{3 }×√{3 } )R 30∘ LEED pattern, the BiAg2 alloy is partially formed at room temperature. A gentle, gradual increase in the annealing temperatures successively results in the formation of a pure BiAg2 phase, a combination of that phase with a (2 ×2 ) superstructure, and finally the pure (2 ×2 ) phase, which persists at higher annealing temperatures. These results complement recent work reporting the (2 ×2 ) as a predominant phase, and attributing the absence of BiAg2 alloy to the strained Ag/Pt interface. Likewise, we show that the growth of the BiAg2 alloy on similarly lattice-mismatched 1 and 2 ML Ag-Cu(111) interfaces also requires a low annealing temperature, whilst higher temperatures result in BiAg2 clustering and the formation of a BiCu2 alloy. The demonstration that the BiAg2 alloy can be formed on thin Ag films on different substrates presenting a strained interface has the prospect of serving as bases for technologically relevant systems, such as Rashba alloys interfaced with magnetic and semiconductor substrates.

  15. Journal of Vietnamese Environment

    OpenAIRE

    2012-01-01

    The Journal of Vietnamese Environment (J. Viet. Env.) plays the role of a scientific platform for researchers and stakeholders working on environmental issues in Vietnam and abroad. The journal is open for all kind of Vietnam-related environmental topics, from climate change and renewable energies to legislative framework and socio-economic aspects.

  16. SnAg-alloy coating for connectors and soldering applications; Alliages SnAg pour revetements de connecteurs et brasage

    Energy Technology Data Exchange (ETDEWEB)

    Buresch, I. [Wieland-Werke AG, Ulm (Germany)

    2003-02-01

    The announced ban of lead in electronic products (WEEE-Waste Electrical and Electronic Equipment from 2006 onwards) is one chance to implement better alternatives. It is a challenge for researcher to develop one alternative which fulfills the different requirements for conditions in use for connectors and production like soldering. The system SnAgCu gives us.good opportunities for soldering applications and as a coating material for connectors. The tin-silver-copper alloy SnTOP meets the engine compartment requirements in automobiles in terms of temperature exposure while simultaneously provide low insertion forces using it as a functional coating on connectors combined with good solderability using it as a solder. (authors)

  17. Microstructure and strength of brazed joints of TiB2 cermet to TiAl-based alloys

    Institute of Scientific and Technical Information of China (English)

    李卓然; 冯吉才; 曹健

    2003-01-01

    In this study, TiB2 cermet and TiAl-based alloy are vacuum brazed successfully by using Ag-Cu-Ti filler metal. The microstructural analyses indicate that two reaction products, Ti(Cu, Al)2 and Ag based solid solution (Ag(s.s)), are present in the brazing seam, and the interface structure of the brazed joint is TiB2/TiB2+ Ag(s.s) /Ag(s.s)+Ti(Cu, Al)2/Ti(Cu, Al)2/TiAl. The experimental results show that the shear strength of the brazed TiB2/TiAl joints decreases as the brazing time increases at a definite brazing temperature. When the joint is brazed at 1 223 K for 5 min, a joint strength up to 173 MPa is achieved.

  18. Rethinking Journalism Again

    DEFF Research Database (Denmark)

    It’s easy to make a rhetorical case for the value of journalism. Because, it is a necessary precondition for democracy; it speaks to the people and for the people; it informs citizens and enables them to make rational decisions; it functions as their watchdog on government and other powers that be....... But does rehashing such familiar rationales bring journalism studies forward? Does it contribute to ongoing discussions surrounding journalism’s viability going forth? For all their seeming self-evidence, this book considers what bearing these old platitudes have in the new digital era. It asks whether...... such hopeful talk really reflects the concrete roles journalism now performs for people in their everyday lives. In essence, it poses questions that strike at the core of the idea of journalism itself. Is there a singular journalism that has one well-defined role in society? Is its public mandate as strong...

  19. The mediatization of journalism

    Directory of Open Access Journals (Sweden)

    Aske Kammer

    2014-06-01

    Full Text Available Proposing an explanation of current macro-sociological changes and institutional transformations in journalism, this article argues that journalism is currently undergoing a process of mediatization. Drawing upon the international research literature as well as statements from interviews with news workers working on Danish news websites, the article examines four current trends in journalism that are closely connected to the rise of news on the web, namely the use of the affordances of news websites, radical commercialization, increased audience participation in news production, and the increased multi-skilling and simultaneous de-skilling of journalists. Taken together, these trends reflect a process through which journalism increasingly subsumes itself to the logic of the media, suggesting mediatization as an adequate explanatory framework. One implication of such a process is that journalism seems to be transforming from an occupational profession into an organizational one.

  20. Our Censored Journals

    Directory of Open Access Journals (Sweden)

    David Healy

    2008-01-01

    Full Text Available When an article is rejected by a medical journal, the standard assumption is that the article is unsound or there is something wrong with the author. Alternatively, it may have been because the journal editor was concerned about the consequences should the article be published. This article seeks to inform discussion by providing a series of instances in which editorial concerns about the consequences to journals may have counted for more than any assessment about the truth-value of the article or the motives of its authors. This claim is based on the fact that different journals may treat exactly the same article in an entirely different fashion; some issues appear to be taboo in certain journals, no matter who the author, and there is a series of explicit communications from editors that publication has been held up by their legal departments.

  1. Uses and Benefits of Journal Writing.

    Science.gov (United States)

    Hiemstra, Roger

    2001-01-01

    Describes various types of journals: learning journals, diaries, dream logs, autobiographies, spiritual journals, professional journals, interactive reading logs, theory logs, and electronic journals. Lists benefits of journal writing and ways to overcome writing blocks. (Contains 19 references.) (SK)

  2. Superplastic Behavior of Ti-6Al-4V-0.1B Alloy (Preprint)

    Science.gov (United States)

    2011-10-01

    Galeyev, O.R. Valiakhmetov, F.H. (Sam) Froes, Journal of Alloys and Compounds 345 (2002) 221–227. 8. A.V. Sergueeva, V.V. Stolyarov, R.Z. Valiev... Journal of Alloys and Compounds 490 (2010) 118–123. 7 Approved for public release; distribution unlimited. 17. S. Tamirisakandala, R.B. Bhat

  3. Oxidation Resistance of Alloys from Nb-Si-Cr System for High Temperature Applications

    Science.gov (United States)

    2013-01-02

    Journal of Alloys and Compounds Vol.476, 257-262, 2009 (doi:10.1016/j.jallcom...net/MSF.638-642.2351) 5. "Oxidation behavior of Nb-20M0-15Si-5B-20Ti Alloy in Air from 700 to 1300°C" Benedict Portillo and S.K. Varma Journal of Alloys and Compounds Vol...Additions" Alma Vasquez and S.K. Varma Journal of Alloys and Compounds Vol.509, 7027-7033, 2011 (doi: 10.1016/j.jallcom.2011.02.174) 11. "Effect

  4. Journal of CHINA PLASTICS

    Institute of Scientific and Technical Information of China (English)

    2012-01-01

    Journal of CHINA PLASTICS was authorized and approved by The State Committee of Science and Technology of China and The Bureau of News Press of China, and published by The China Plastics Processing Industry Association,Beijing Technology and Business University and The Institute of Plastics Processing and Application of Light Industry, distributed worldwide. Since its birth in 1987, CHINA PLASTICS has become a leading magazine in plastics industry in China, a national Chinese core journal and journal of Chinese scientific and technological article statistics. It is covered by CA.

  5. Computational Journalism. When journalism meets programming

    OpenAIRE

    Stavelin, Eirik

    2014-01-01

    Digital data sources and platforms allow journalists to produce news in new and different ways. The shift from an analog to digital workflow introduces computation as a central component of news production. This enables variability for end users, automation of tedious tasks for newsrooms, and allows journalists to tackle analysis of the increasingly large sets of data relevant to citizens. To journalism, computerization is a promising path for news production, particularly for ...

  6. Lifestyle Journalism: Blurring boundaries

    DEFF Research Database (Denmark)

    From, Unni

    2013-01-01

    Lifestyle journalism has experienced enormous growth in the media over the past two decades, but scholars in the fields of journalism and communication studies have so far paid relatively little attention to a field that is still sometimes seen as "not real journalism". There is now an urgent need...... for in-depth exploration and contextualisation of this field, with its increasing relevance for 21st century consumer cultures. For the first time, this book presents a wide range of studies which have engaged with the field of lifestyle journalism in order to outline the various political, economic......, social and cultural tensions within it. Taking a comparative view, the collection includes studies covering four continents, including countries such as Australia, China, Norway, Denmark, Singapore, the UK and the USA. While keeping the broader lifestyle field in mind, the chapters focus on a variety...

  7. US Marine Meteorological Journals

    Data.gov (United States)

    National Oceanic and Atmospheric Administration, Department of Commerce — This series consists of volumes entitled 'Meteorological Journal' (a regulation Navy-issue publication) which were to be completed by masters of merchant vessels...

  8. In Other Professional Journals.

    Science.gov (United States)

    Campbell, Christine M.

    1992-01-01

    Lists current articles, appearing in major journals on language teaching and learning, applied psycholinguistics, linguistics, curriculum development, computer science, psychology, educational technology, and general education, of particular interest to foreign language instruction professionals. (CB)

  9. Language Works. Linguistic Journal

    DEFF Research Database (Denmark)

    Hartling, Anna Sofie; Nørreby, Thomas Rørbeck; Skovse, Astrid Ravn

    2016-01-01

    Language works! – and with this initiative and this journal we want to give the opportunity to many more students to present their linguistic research to each other, to the scientific community and to all interested.......Language works! – and with this initiative and this journal we want to give the opportunity to many more students to present their linguistic research to each other, to the scientific community and to all interested....

  10. Information Literacy Journal Club

    OpenAIRE

    Dalton, Michelle; Tumelty, Niamh

    2014-01-01

    The Information Literacy Journal Club (http://infolitjournalclub.blogspot.co.uk/) is an online discussion group that focuses on information literacy and other aspects of user education. The journal club was originally set up on the Blogger platform in December 2012 by Niamh Tumelty (University of Cambridge) and Sheila Webber (University of Sheffield), and since then the community involved has grown to include a range of professionals interested in the area.

  11. About the Journal

    OpenAIRE

    Endri Papajorgji

    2015-01-01

    Academic Journal of Business, Administration, Law and Social Sciences is an international peer-reviewed journal published three times a year by International Institute for Private, Commercial and Competition Law. The need for different approaches in science, such as in business, economics, law, administration and social sciences is a must in the whole field of scientific research. Academics, Professors, Researchers, Students and the whole world is in a new era of communication, which causes f...

  12. About the Journal

    OpenAIRE

    Endri Papajorgji

    2016-01-01

    Academic Journal of Business, Administration, Law and Social Sciences is an international peer-reviewed journal published three times a year by International Institute for Private, Commercial and Competition Law. The need for different approaches in science, such as in business, economics, law, administration and social sciences is a must in the whole field of scientific research. Academics, Professors, Researchers, Students and the whole world is in a new era of communication, which causes ...

  13. About the Journal

    OpenAIRE

    Endri Papajorgji

    2016-01-01

    Academic Journal of Business, Administration, Law and Social Sciences is an international peer-reviewed journal published three times a year by International Institute for Private, Commercial and Competition Law. The need for different approaches in science, such as in business, economics, law, administration and social sciences is a must in the whole field of scientific research. Academics, Professors, Researchers, Students and the whole world is in a new era of communication, which causes f...

  14. AJEMS - a new journal

    DEFF Research Database (Denmark)

    Kuada, John

    2010-01-01

    African Journal of Economic and Management Studies (AJEMS) provides an avenue for disseminating empirical research results, as well as theoretical viewpoints and methodologies that could impact positively on economic and business activities in Africa.......African Journal of Economic and Management Studies (AJEMS) provides an avenue for disseminating empirical research results, as well as theoretical viewpoints and methodologies that could impact positively on economic and business activities in Africa....

  15. Citation Indicators of Japanese Journals.

    Science.gov (United States)

    Haiqi, Zhang; Yamazaki, Shigeaki

    1998-01-01

    Evaluates Japanese journals--128 indexed in the 1994 "Journal Citation Reports"--in bibliometric parameters such as impact factors (IFs), mean IFs from citing and cited journals, and self-citing and self-cited rates. Results: only 15 journals, with a wide variation of self-citing and self-cited rates, have obtained a current impact…

  16. About the Journal

    Directory of Open Access Journals (Sweden)

    Endri Papajorgji

    2015-03-01

    Full Text Available About the Journal Academic Journal of Business, Administration, Law and Social Sciences is an international peer-reviewed journal published three times a year by International Institute for Private, Commercial and Competition Law. The need for different approaches in science, such as in business, economics, law, administration and social sciences is a must in the whole field of scientific research. Academics, Professors, Researchers, Students and the whole world is in a new era of communication, which causes fast changes and gives birth to scientific and cultural debates. Our Journal is interested in promoting the exchange of idea, and to bring together researchers and academics from all over the countries. In this sense, we welcome papers not only in the above cited fields, but also in other fields of scientific research. Welcome to AJBALS, which is open for the academic world, universities, research institutions, PhD students, academic and non-academic researchers. Aiming at scientific excellence and quality, this journal will promote the best inputs in scientific- and academic research, on the prospective of local, international, global developments in business, economics, law, social-, but also natural sciences. All manuscripts will be double blind peer reviewed by the members of the editorial board who are noted experts in the appropriate subject area

  17. Journalism of Relation

    DEFF Research Database (Denmark)

    Blaagaard, Bolette

    of the self-other relation which is simultaneously personal and political. Secondly, the dissertation relates the phenomenological ‘race’ and gender debates to the societal and productive context of contemporary European and ‘western’ globalised and mediated culture and politics. Journalism is re...... accountability and relation from journalistic training and practices whereby a ‘white’ and homogeneous social imaginary is reproduced. I make a call for thinking about journalism as relation – in terms of technological mediations, but also in terms of subjectivities. In order to allow for this, a shift is needed...... of cosmopolitanism from universal reproductions of sameness into creative productions of singular self-other relations based on the practiced and productive journalism. This is substantiated through case study analyses. The aim is to challenge the modern, rational journalistic subject referring back to the unified...

  18. Deformation Driven Alloying and Transformation

    Science.gov (United States)

    2015-03-03

    Rolling, Acta Materiala (08 2014) Zhe Wang , John H Perepezko, David Larson, David Reinhard. Mixing Behaviors in Cu/Ni and Ni/V Multilayers Induced...by Cold Rolling, Journal of Alloys and Compounds (07 2014) Zhe Wang , John H. Perepezko. Deformation-Induced Nanoscale Mixing Reactions in Cu/Ni...FTE Equivalent: Total Number: Discipline Zhe Wang 0.50 0.50 1 Names of Post Doctorates Names of Faculty Supported Names of Under Graduate students

  19. War Journalism and 'Objectivity'

    Directory of Open Access Journals (Sweden)

    Annabel McGoldrick

    2006-10-01

    Full Text Available This article opens by considering an apparent paradox. Many professional journalists, working on many media in many countries, consider themselves 'objective'. They do not, at least, set out to skew their coverage of important issues in favour of one side or the other. And yet much of their coverage of conflicts shows a discernible dominant pattern of War Journalism - biased in favour of war. This is not because of a lack of objectivity, the article suggests, but a surfeit. The set of conventions many editors and reporters regard as defining 'objective' journalism arose in response to economic and political conditions which rewarded news that could commend itself as unobjectionable to the maximum number of potential customers. Three of the most important conventions privilege official sources; a dualistic construction of stories and event, over process. Each of these, when applied to the representation of conflicts, leads readers and audiences - or leaves them - to over-value violent, reactive responses and under-value non-violent, developmental responses. Industry conventions sit uneasily alongside equally time-honoured expectations of journalism. These are encoded in rules and regulations governing the content of broadcast news, in many jurisdictions which have a public service concept for radio and television. In some respects, War Journalism can be shown to make it more difficult for broadcast news services to fulfil their public service obligations. Awareness is now growing, of the tension between these two pressures on journalism and its influence on the way pressing public debates are shaped and mediated. More Peace Journalism would help to bring public service news back into line with legitimate public expectations.

  20. Chinese Journalism Students

    DEFF Research Database (Denmark)

    Dombernowsky, Laura Møller

    2014-01-01

    As important providers of information, analysis of current events and debates, journalists are subject to high expectations regarding their professional values. Journalism is considered to be more than merely a career; it is construed as a profession that builds on personal commitment to serve...... society. This chapter is concerned with Chinese journalism students' self-perceptions and evaluations of journalistic performances in order to understand the professional values to which they adhere. The study is based on semi-structured in-depth interviews conducted in two periods in Spring 2011 and Fall...

  1. Journal of Integrative Agriculture

    Institute of Scientific and Technical Information of China (English)

    2015-01-01

    Aims and Scope Journal of Integrative Agriculture (JIA), formerly Agricultural Sciences in China (ASC), founded in 2002, is an official publication of the Chinese Academy of Agricultural Sciences (CAAS). JIA seeks to publish those papers that are influential and will significantly advance scientific understanding in agriculture fields worldwide.

  2. Citizen Journalism & Public Interfaces

    DEFF Research Database (Denmark)

    Brynskov, Martin; Strøbech, Kristian; Bang, Jørgen

    2011-01-01

    of views or plain information dissemination. Form the media institution’s point of view the goal was to create a platform for hyper local journalism as a source for journalistic coverage in commercial media. The group investigating civic communication within the Digital Urban Living project...

  3. Existentialism in New Journalism.

    Science.gov (United States)

    Dalmia, Shikha

    In 1977, John C. Merrill, a mass communication scholar, found that many scholars believed that the sixties movement of new journalism is in some way related to existentialism. To find this out, a study identified six main themes of the philosophy of existentialism (as espoused by Jean-Paul Sartre) and looked for the presence of these themes in the…

  4. About the Journal

    Directory of Open Access Journals (Sweden)

    Endri Papajorgji

    2016-11-01

    Full Text Available Academic Journal of Business, Administration, Law and Social Sciences is an international peer-reviewed journal published three times a year by International Institute for Private, Commercial and Competition Law. The need for different approaches in science, such as in business, economics, law, administration and social sciences is a must in the whole field of scientific research. Academics, Professors, Researchers, Students and the whole world is in a new era of communication, which causes fast changes and gives birth to scientific and cultural debates. Our Journal is interested in promoting the exchange of idea, and to bring together researchers and academics from all over the countries. In this sense, we welcome papers not only in the above cited fields, but also in other fields of scientific research. Welcome to AJBALS, which is open for the academic world, universities, research institutions, PhD students, academic and non-academic researchers. Aiming at scientific excellence and quality, this journal will promote the best inputs in scientific- and academic research, on the prospective of local, international, global developments in business, economics, law, social-, but also natural sciences. All manuscripts will be double blind peer reviewed by the members of the editorial board who are noted experts in the appropriate subject area.

  5. About the Journal

    Directory of Open Access Journals (Sweden)

    Endri Papajorgji

    2015-11-01

    Full Text Available Academic Journal of Business, Administration, Law and Social Sciences is an international peer-reviewed journal published three times a year by International Institute for Private, Commercial and Competition Law. The need for different approaches in science, such as in business, economics, law, administration and social sciences is a must in the whole field of scientific research. Academics, Professors, Researchers, Students and the whole world is in a new era of communication, which causes fast changes and gives birth to scientific and cultural debates. Our Journal is interested in promoting the exchange of idea, and to bring together researchers and academics from all over the countries. In this sense, we welcome papers not only in the above cited fields, but also in other fields of scientific research. Welcome to AJBALS, which is open for the academic world, universities, research institutions, PhD students, academic and non-academic researchers. Aiming at scientific excellence and quality, this journal will promote the best inputs in scientific- and academic research, on the prospective of local, international, global developments in business, economics, law, social-, but also natural sciences. All manuscripts will be double blind peer reviewed by the members of the editorial board who are noted experts in the appropriate subject area.

  6. About the Journal

    Directory of Open Access Journals (Sweden)

    Endri Papajorgji

    2016-03-01

    Full Text Available Academic Journal of Business, Administration, Law and Social Sciences is an international peer-reviewed journal published three times a year by International Institute for Private, Commercial and Competition Law. The need for different approaches in science, such as in business, economics, law, administration and social sciences is a must in the whole field of scientific research. Academics, Professors, Researchers, Students and the whole world is in a new era of communication, which causes fast changes and gives birth to scientific and cultural debates. Our Journal is interested in promoting the exchange of idea, and to bring together researchers and academics from all over the countries. In this sense, we welcome papers not only in the above cited fields, but also in other fields of scientific research. Welcome to AJBALS, which is open for the academic world, universities, research institutions, PhD students, academic and non-academic researchers. Aiming at scientific excellence and quality, this journal will promote the best inputs in scientific- and academic research, on the prospective of local, international, global developments in business, economics, law, social-, but also natural sciences. All manuscripts will be double blind peer reviewed by the members of the editorial board who are noted experts in the appropriate subject area.

  7. About the Journal

    Directory of Open Access Journals (Sweden)

    Endri Papajorgji

    2015-07-01

    Full Text Available Academic Journal of Business, Administration, Law and Social Sciences is an international peer-reviewed journal published three times a year by International Institute for Private, Commercial and Competition Law. The need for different approaches in science, such as in business, economics, law, administration and social sciences is a must in the whole field of scientific research. Academics, Professors, Researchers, Students and the whole world is in a new era of communication, which causes fast changes and gives birth to scientific and cultural debates. Our Journal is interested in promoting the exchange of idea, and to bring together researchers and academics from all over the countries. In this sense, we welcome papers not only in the above cited fields, but also in other fields of scientific research. Welcome to AJBALS, which is open for the academic world, universities, research institutions, PhD students, academic and non-academic researchers. Aiming at scientific excellence and quality, this journal will promote the best inputs in scientific- and academic research, on the prospective of local, international, global developments in business, economics, law, social-, but also natural sciences. All manuscripts will be double blind peer reviewed by the members of the editorial board who are noted experts in the appropriate subject area..

  8. About the Journal

    Directory of Open Access Journals (Sweden)

    Lena Hoffman

    2017-03-01

    Full Text Available Academic Journal of Business, Administration, Law and Social Sciences is an international peer-reviewed journal published three times a year by International Institute for Private, Commercial and Competition Law. The need for different approaches in science, such as in business, economics, law, administration and social sciences is a must in the whole field of scientific research. Academics, Professors, Researchers, Students and the whole world is in a new era of communication, which causes fast changes and gives birth to scientific and cultural debates. Our Journal is interested in promoting the exchange of idea, and to bring together researchers and academics from all over the countries. In this sense, we welcome papers not only in the above cited fields, but also in other fields of scientific research. Welcome to AJBALS, which is open for the academic world, universities, research institutions, PhD students, academic and non-academic researchers. Aiming at scientific excellence and quality, this journal will promote the best inputs in scientific- and academic research, on the prospective of local, international, global developments in business, economics, law, social-, but also natural sciences. All manuscripts will be double blind peer reviewed by the members of the editorial board who are noted experts in the appropriate subject area.

  9. About the Journal

    Directory of Open Access Journals (Sweden)

    Endri Papajorgji

    2016-07-01

    Full Text Available Academic Journal of Business, Administration, Law and Social Sciences is an international peer-reviewed journal published three times a year by International Institute for Private, Commercial and Competition Law. The need for different approaches in science, such as in business, economics, law, administration and social sciences is a must in the whole field of scientific research. Academics, Professors, Researchers, Students and the whole world is in a new era of communication, which causes fast changes and gives birth to scientific and cultural debates. Our Journal is interested in promoting the exchange of idea, and to bring together researchers and academics from all over the countries. In this sense, we welcome papers not only in the above cited fields, but also in other fields of scientific research. Welcome to AJBALS, which is open for the academic world, universities, research institutions, PhD students, academic and non-academic researchers. Aiming at scientific excellence and quality, this journal will promote the best inputs in scientific- and academic research, on the prospective of local, international, global developments in business, economics, law, social-, but also natural sciences. All manuscripts will be double blind peer reviewed by the members of the editorial board who are noted experts in the appropriate subject area.

  10. Parent's Journal. [Videotape Series].

    Science.gov (United States)

    1999

    Parent's Journal is a set of 16 videotapes for parents of prenatal, infant, and toddler-age children, created by the Alaska Native Home Base Video Project of the Tlingit and Haida Head Start Program. This series offers culturally relevant solutions to the challenges of parenting, drawing on the life stories and experiences of capable mothers and…

  11. Journalism and science

    DEFF Research Database (Denmark)

    Meyer, Gitte

    2006-01-01

    that are likely to occur to journalistic attitudes - mirroring changing attitudes in the wider society - towards science and scientific researchers. Two journalistic conventions - those of science transmission and of investigative journalism - are presented and discussed in relation to the present drive towards...

  12. What are Journals for?

    Science.gov (United States)

    Rallison, S P

    2015-03-01

    'The secret is comprised in three words - work, finish, publish.' Michael Faraday There are many reasons doctors want to publish their work. For most at an early stage in their career, this may be to add a line to their curriculum vitae and advance their careers but for academics, publishing is an expectation. Many will believe they have something important to say, and wish to provoke debate and discussion; others wish to share knowledge and experiences, which in medicine can lead to a satisfying change in clinical practice. All serve to register one's idea and educate others. However, for some, the reason is as basic as money. As we celebrate the 350th anniversary of the first academic publication, perhaps we have come full circle when it comes to why people publish? Publishing is a flourishing business. There were approximately 28,100 active scholarly peer-reviewed journals in mid-2012, collectively publishing about 1.8-1.9 million articles per year. The number of articles published each year and the number of journals have both grown steadily for more than two centuries, by about 3% and 3.5% per year respectively. (1) Journals have a responsibility to refine and define information and act as a scientific filter. Many of us will receive daily invitations in our email inbox from eclectic and new journals that are likely to take anything - is the filter now too porous? But this industry is like any other commercial activity and the supply still far outstrips the demand. Perhaps the internet revolution has merely fuelled our hunger to publish more? The launch of this exciting and innovative series about publishing coincides with the 350th celebration of the publication of the first academic journal. In the age of social media, the first question is 'What are journals for?', which Simon Rallison sets out to answer. Simon is Director of Publications at the Physiological Society, and was previously a journal publisher with Earthscan, Springer and Blackwell. Writing is

  13. Characteristics of dissimilar laser-brazed joints of isotropic graphite to WC-Co alloy

    Energy Technology Data Exchange (ETDEWEB)

    Nagatsuka, Kimiaki, E-mail: nagatuka@jwri.osaka-u.ac.jp [Graduate School of Engineering, Osaka University, Joining and Welding Research Institute, 11-1, Mihogaoka, Ibaraki, Osaka 567-0047 (Japan); Sechi, Yoshihisa, E-mail: sechi@kagoshima-it.go.jp [Kagoshima Prefectural Institute of Industrial Technology, 1445-1 Oda, Hayato-cho, Kirishima, Kagoshima 899-5105 (Japan); Miyamoto, Yoshinari, E-mail: y_miyamoto@toyotanso.co.jp [Toyo Tanso Co., Ltd., 5-7-12 Takeshima, Nishiyodgawa-ku, Osaka 555-0011 (Japan); Nakata, Kazuhiro, E-mail: nakata@jwri.osaka-u.ac.jp [Joining and Welding Research Institute, Osaka University, 11-1, Mihogaoka, Ibaraki, Osaka 567-0047 (Japan)

    2012-04-25

    Highlights: Black-Right-Pointing-Pointer Ti was required in the filler metal for brazing graphite to WC-Co alloy. Black-Right-Pointing-Pointer The shear strength of the joint increased with Ti content up to 1.7 mass%. Black-Right-Pointing-Pointer Ti concentrated at the interface of graphite/filler metal. Black-Right-Pointing-Pointer TiC was formed at the interface of graphite/filler metal. - Abstract: The effect of Ti serving as an activator in a eutectic Ag-Cu alloy filler metal in dissimilar laser-brazed joints of isotropic graphite and a WC-Co alloy on the joint strength and the interface structure of the joint is investigated in this study. To evaluate the joint characteristics, the Ti content in the filler metal was increased from 0 to 2.8 mass%. The laser brazing was carried out by irradiating a laser beam selectively on the WC-Co alloy plate in Ar atmosphere. The threshold content of Ti required to join isotropic graphite to WC-Co alloy was 0.4 mass%. The shear strength at the brazed joint increased rapidly with increasing Ti content up to 1.7 mass%, and a higher Ti content was found to be likely to saturate the shear strength to a constant value of about 14 MPa. The isotropic graphite blocks also fractured at this content. The concentration of Ti observed at the interface between isotropic graphite and the filler metal indicates the formation of an intermetallic layer of TiC.

  14. Positioning Open Access Journals in a LIS Journal Ranking

    Science.gov (United States)

    Xia, Jingfeng

    2012-01-01

    This research uses the h-index to rank the quality of library and information science journals between 2004 and 2008. Selected open access (OA) journals are included in the ranking to assess current OA development in support of scholarly communication. It is found that OA journals have gained momentum supporting high-quality research and…

  15. Three journal similarity metrics and their application to biomedical journals.

    Science.gov (United States)

    D'Souza, Jennifer L; Smalheiser, Neil R

    2014-01-01

    In the present paper, we have created several novel journal similarity metrics. The MeSH odds ratio measures the topical similarity of any pair of journals, based on the major MeSH headings assigned to articles in MEDLINE. The second metric employed the 2009 Author-ity author name disambiguation dataset as a gold standard for estimating the author odds ratio. This gives a straightforward, intuitive answer to the question: Given two articles in PubMed that share the same author name (lastname, first initial), how does knowing only the identity of the journals (in which the articles were published) predict the relative likelihood that they are written by the same person vs. different persons? The article pair odds ratio detects the tendency of authors to publish repeatedly in the same journal, as well as in specific pairs of journals. The metrics can be applied not only to estimate the similarity of a pair of journals, but to provide novel profiles of individual journals as well. For example, for each journal, one can define the MeSH cloud as the number of other journals that are topically more similar to it than expected by chance, and the author cloud as the number of other journals that share more authors than expected by chance. These metrics for journal pairs and individual journals have been provided in the form of public datasets that can be readily studied and utilized by others.

  16. Publishing corruption discussion: predatory journalism.

    Science.gov (United States)

    Jones, James W; McCullough, Laurence B

    2014-02-01

    Dr Spock is a brilliant young vascular surgeon who is up for tenure next year. He has been warned by the chair of surgery that he needs to increase his list of publications to assure passage. He has recently had a paper reviewed by one of the top journals in his specialty, Journal X-special, with several suggestions for revision. He received an e-mail request for manuscript submission from a newly minted, open access, Journal of Vascular Disease Therapy, which promises a quick and likely favorable response for a fee. What should be done? A. Send the paper to another peer reviewed journal with the suggested revisions. B. Resubmit the paper to Journal X-special. C. Submit to the online journal as is to save time. D. Submit to the online journal and another regular journal. E. Look for another job.

  17. Phase diagrams for surface alloys

    DEFF Research Database (Denmark)

    Christensen, Asbjørn; Ruban, Andrei; Stoltze, Per

    1997-01-01

    is based on density-functional calculations using the coherent-potential approximation and on effective-medium theory. We give self-consistent density-functional results for the segregation energy and surface mixing energy for all combinations of the transition and noble metals. Finally we discuss...... in detail the cases Ag/Cu(100), Pt/Cu(111), Ag/Pt(111), Co/Cu(111), Fe/Cu(111), and Pd/Cu(110) in connection with available experimental results....

  18. Evaluation of OAS Education Journals.

    Science.gov (United States)

    Leavitt, Howard B.; And Others

    An in-depth evaluation of four Organization of American States educational journals is presented. The journals, published for distribution among Latin American countries, were "Tecnologia Educativa", "Curriculum", "Educacion de Adultors", and "La Educacion". Assessment was made of the journals' mandates, implementation procedures, and managerial…

  19. Monopoly Power and Electronic Journals.

    Science.gov (United States)

    Meyer, Richard W.

    1997-01-01

    Rising periodical prices and lagging library budgets have many academics hoping that scholarly print journals will migrate to online versions. Examines economic factors shaping the electronic journal market, emerging new electronic journals, access versus ownership, consortial purchasing, self-maintained infrastructures, elimination of tenure and…

  20. Journalism Pedagogical Framework Report

    DEFF Research Database (Denmark)

    Jørgensen, Asbjørn Slot

    , this report can serve as a catalogue of inspiration, including relevant tips and teaching material. Headlines from this report include: - Large cross-platform newsrooms of 70-80 students - External partnerships and university publications - Motivation and learning: the power of media related topics - Newsroom...... design – the physical space for teaching integrated journalism skills - Collaboration: group size and group composition - Entrepreneur-ship and intrapreneur-ship – competitive and real-life - Social media: the new ethics. - Social media – professional profiles for journalists. - The journalism teachers......' professional development and commitment - Computer programming – anarchy, and shortcutting the system - Event-based teaching All underlying material (tipsheets and model course descriptions) is available in its entirety online, at http://learning.euromain.net....

  1. "Space of physics journals": in search of journals of quality

    CERN Document Server

    Katchanov, Yurij L

    2016-01-01

    This paper analyses the problem of scientific quality of physics journals. The main assumption is that the quality of a physics journal exists only in reference to other journals. Instead of constructing new indicators of scientific quality, we identify a physical journal with corresponding empirical distribution function of citations. From our relational point of view, the space of physics journals is only a system of differences between empirical distribution functions of citations. Using data from Web of Science Core Collection we consider the space of physics journals and the space of scientific publishers. The first provides an objective basis for the grouping of physics journals on the basis of a whole range of indicators (citation statistics, country, publisher, etc.). The second reveals the "competitors' triangle" of regional publishers, transnational publishers and professional physical societies. These findings have prompted us to advance the hypothesis that the structure of the space of physics jou...

  2. Journalism in a Network

    OpenAIRE

    Singer, J.

    2011-01-01

    The occupation of journalism has changed very dramatically very fast. Until the 1990s, journalists produced content for a single outlet, such as a newspaper or television program, and they produced it in a single format – printed words, say, or sound, or moving images. Most of them worked in stable media industries that, thanks largely to a lucrative advertising-based revenue model, had been highly profitable for decades if not centuries, and they had something close to a monopoly on providin...

  3. Trends in wetting behavior for Ag–CuO braze alloys on Ba0.5Sr0.5Co0.8Fe0.2O(3-δ) at elevated temperatures in air

    Energy Technology Data Exchange (ETDEWEB)

    Joshi, Vineet V.; Meier, Alan; Darsell, Jens; Weil, K. Scott; Bowden, Mark

    2013-06-21

    Ba0.5Sr0.5Co0.80.2O(3-δ)(BSCF) is a potential oxygen separation membrane material for advanced coal based power plants. For this application, BSCF must be joined to a metal. In the current study, Ag-CuO, a reactive air brazing (RAB) alloy was evaluated for brazing BSCF. In-situ contact angle tests were performed on BSCF using Ag-CuO binary mixtures at 950 and 1000°C and the interfacial microstructures were evaluated. Wetting contact angles (θ< 90°) were obtained at short times at 950°C and the contact angles remained constant at 1000°C for 1, 2 and 8 mol% CuO contents. Microstructural analysis revealed the dissolution of copper oxide into the BSCF matrix to form copper-cobalt-oxygen rich dissolution products along the BSCF grain boundary. The formation of a thick interfacial reaction product layer and ridging at the sessile drop triple point indicate that the reaction kinetics are very rapid and that it will require careful process control to obtain the desired thin but continuous interfacial product layer.

  4. The Effects of Grain Size on the Martensitic Transformation in Copper-Zinc-Aluminum Shape Memory Alloys.

    Science.gov (United States)

    1982-12-01

    production or nearly so. In the medical arts these alloys are being exploited for their SME properties as orthodontic appliances, intercranial aneurism...treatment is applicable to the Cu-Zn-Al alloys. 60 LIST OF REFERENCES 1. Wayman, C. M., "Some Applications of Shape Memory Alloys," Journal of Metals, pp

  5. Students’ Learning through Reflective Journaling

    Directory of Open Access Journals (Sweden)

    Alvyda Liuolienė

    2011-04-01

    Full Text Available The aim of the article is to get acquainted with the types of journals used in education to help students to learn. The paper presents some ways of fostering student’s learning through reflective journaling. It also describes the key aspects of a new method ARRIVE cycle in connection with teachers preparation to use reflective journals in a classroom. The article also presents self-assessment in reflective journaling and students’ need to self-evaluate their learning process. Reflective journaling as central to students’ self-evaluation is described as a means of fostering metacognition.

  6. Scientific Journal Indexing

    Directory of Open Access Journals (Sweden)

    Getulio Teixeira Batista

    2007-08-01

    Full Text Available It is quite impressive the visibility of online publishing compared to offline. Lawrence (2001 computed the percentage increase across 1,494 venues containing at least five offline and five online articles. Results shown an average of 336% more citations to online articles compared to offline articles published in the same venue. If articles published in the same venue are of similar quality, then they concluded that online articles are more highly cited because of their easier access. Thomson Scientific, traditionally concerned with printed journals, announced on November 28, 2005, the launch of Web Citation Index™, the multidisciplinary citation index of scholarly content from institutional and subject-based repositories (http://scientific.thomson. com/press/2005/8298416/. The Web Citation Index from the abstracting and indexing (A&I connects together pre-print articles, institutional repositories and open access (OA journals (Chillingworth, 2005. Basically all research funds are government granted funds, tax payer’s supported and therefore, results should be made freely available to the community. Free online availability facilitates access to research findings, maximizes interaction among research groups, and optimizes efforts and research funds efficiency. Therefore, Ambi-Água is committed to provide free access to its articles. An important aspect of Ambi-Água is the publication and management system of this journal. It uses the Electronic System for Journal Publishing (SEER - http://www.ibict.br/secao.php?cat=SEER. This system was translated and customized by the Brazilian Institute for Science and Technology Information (IBICT based on the software developed by the Public Knowledge Project (Open Journal Systems of the British Columbia University (http://pkp.sfu.ca/ojs/. The big advantage of using this system is that it is compatible with the OAI-PMH protocol for metadata harvesting what greatly promotes published articles

  7. Journal Self-Citedness in "Journal Citation Reports" Library and Information Science and Genetics Journal Rankings.

    Science.gov (United States)

    Nisonger, Thomas E.

    1998-01-01

    Investigates the effect of journal self-citedness on "Journal Citation Reports" (JCR) rankings of library and information science and genetics journals using data from 1994 on CD-ROM. Results for library and information science indicate that the effect of self-citedness on both JCR impact factor and total citation rankings was minimal.…

  8. Journal Self-Citedness in "Journal Citation Reports" Library and Information Science and Genetics Journal Rankings.

    Science.gov (United States)

    Nisonger, Thomas E.

    1998-01-01

    Investigates the effect of journal self-citedness on "Journal Citation Reports" (JCR) rankings of library and information science and genetics journals using data from 1994 on CD-ROM. Results for library and information science indicate that the effect of self-citedness on both JCR impact factor and total citation rankings was minimal. (Author/AEF)

  9. The handbook of journal publishing

    CERN Document Server

    Morris, Sally; LaFrenier, Douglas; Reich, Margaret

    2013-01-01

    The Handbook of Journal Publishing is a comprehensive reference work written by experienced professionals, covering all aspects of journal publishing, both online and in print. Journals are crucial to scholarly communication, but changes in recent years in the way journals are produced, financed, and used make this an especially turbulent and challenging time for journal publishers - and for authors, readers, and librarians. The Handbook offers a thorough guide to the journal publishing process, from editing and production through marketing, sales, and fulfilment, with chapters on management, finances, metrics, copyright, and ethical issues. It provides a wealth of practical tools, including checklists, sample documents, worked examples, alternative scenarios, and extensive lists of resources, which readers can use in their day-to-day work. Between them, the authors have been involved in every aspect of journal publishing over several decades and bring to the text their experience working for a wide range of ...

  10. Micro/nano-scale investigation on tin alloys and tin dioxide nanowires

    Science.gov (United States)

    Sun, Yong

    Tin (Sn) and its alloys have been at people's service since 3000 BC when bronze (alloy of tin and copper) was produced in large scale. They have unique properties and find applications in various engineering fields. Correspondingly, there is abundant information waiting to be clarified surrounding these Sn-related materials. As the key element used for solder alloys, the properties of Sn alloys have been of great interest to the electronic packaging community. At the same time, the intriguing phenomenon of spontaneous Sn whisker growth from Sn / Sn-alloy thin films have bothered, yet also inspired materials scientists for over 60 years. The most commonly seen Sn-containing compound, SnO 2, is in high demand as well due to its exceptional electronic and chemical properties. In addition, nanostructures of SnO2 are intensively studied for their potential applications as solid-state sensors, transparent conducting materials, lithium-ion batteries, high-efficiency solar cell and recently, supercapacitors. The objective of this proposed research is to explore the amazing properties of Sn and Sn-alloys from several different perspectives. Firstly, ever since the banish of lead in solder alloys, lead-free alloys such as Sn-Ag-Cu (SAC) has been put under the spotlight. We intend to use our expertise in nanomechanics to give an in-depth and thorough investigation on a popular SAC387 alloy. The mechanical properties of each phase and the local deformation mechanisms have been considered. Secondly, the Sn whisker growth phenomenon is to be re-visited. With the aid of digital image correlation (DIC) techniques, it was found that magnitude of the strain gradient plays an important role in whisker growth. Moreover, DIC helps to visualize the dynamic growth process in which the alteration of strain field has been identified to cause growth of subsequent whiskers. Last but not least, the performance of SnO2 nanowires is to be evaluated in several aspects including mechanical

  11. Five Predatory Mega-Journals: A Review

    OpenAIRE

    Beall, Jeffrey

    2013-01-01

    Mega-journals such as PLOS One are an emerging and successful model of scholarly Open Access publishing. Unfortunately, some new, questionable journals have appeared that are copying the megajournal model. This review covers the five predatory mega-journals British Journal of Science, International Journal of Current Research, International Journal of Science and Advanced Technology (IJSAT), International Journal of Sciences (IJSciences), and World Journal of Science and Technology. Each of t...

  12. TC4钛合金真空钎焊接头显微组织分析%Analysis of TC4 Titanium Alloy Vacuum Brazing Joint Microstructure

    Institute of Scientific and Technical Information of China (English)

    徐龙勇

    2013-01-01

      采用Ag-Cu-Ti钎料对TC4钛合金进行真空钎焊;采用金相分析、扫描电镜对钎缝的组织结构、元素分布情况进行分析,并对焊件的整体力学性能进行拉伸测试。结果表明,TC4合金板真空钎焊搭接接头处抗剪强度在200MPa以上,钎焊接头处总体的力学性能优于母材;钎缝与基体相临的部位析出了弥散相,钎缝处有Cu的固溶体析出;焊接接头中的主要元素Ti、Al、V、Ag、Cu呈规律性分布,钎缝及扩散区域得到以细小笋状的方式生长的Cu基固溶体,是为Ag-Cu共晶组织。%Vacuum brazing of TC4 was carried out with Ag-Cu-Ti filler metal. Organizational structure, element distribution of brazed joints were investigated by means of scanning electron microscopy and metallographic microscope, and the joint whole mechanical property was determined by tensile testing method. The results show that shear strength for the brazing joint of TC4 titanium alloy is above 200MPa and whole mechanical property of the brazing joint are better than base metal. Dispersed network phase form between base metal and brazing seam, and Cu-based solid solution separate out in the brazing seam. Ti, Al, V, Ag and Cu of the brazing joint were regular distribution. Ag-Cu eutectic structure of brazing seam and diffuse region were grown by slender and small bamboo shoots mode.

  13. pH对锡-银-铜三元合金共沉积的影响%Effect of pH on codeposition of tin-silver-copper ternary alloy

    Institute of Scientific and Technical Information of China (English)

    张莹莹; 石秀敏; 高学朋; 贺岩峰

    2013-01-01

    The effect of pH on codeposition of Sn-Ag-Cu ternary alloy was studied by polarization curve measurement, inductively coupled plasma emission spectroscopy, surface morphology analysis, and X-ray diffraction spectroscopy, using HEDTA [N-(β-hydroxyethyl)ethylenediamine triacetic acid] as main complexing agent. The bath composition and process parameters are as follows: Sn(CH3SO3)2 110 g/L, Ag2O 0.081 1 g/L, Cu(CH3SO3)2 0.876 g/L, HEDTA 278.3 g/L, thiourea 4.6 g/L, alkyl glycosides 1 g/L, temperature 25 ℃, and current density 10 mA/cm2. The results show that the deposition potential shifts towards negative as the pH increases. The Sn-Ag-Cu alloy coatings obtained at 3.22-7.74 are fine-grained and level. The Sn-Ag-Cu alloy coating is composed of Sn, Ag3Sn and Cu6Sn5. The crystal orientation of the coating changes as pH changes. The suitable pH for electrodeposition of Sn-Ag-Cu alloy coating from HEDTA system is 3.00-6.00, and the optimal pH is 5.00-6.00.%以HEDTA(N-β-羟乙基乙二胺三乙酸)为主配位剂,通过极化曲线测量、电感耦合等离子体发射光谱、表面形貌分析和X射线衍射谱分析等研究了pH对Sn-Ag-Cu三元合金共沉积的影响.镀液组成及工艺参数为:Sn(CH3SO3)2 110 g/L,Ag2O0.081 1 g/L,Cu(CH3SO3)2 0.876 g/L,HEDTA 278.3 g/L,硫脲4.6 g/L,烷基糖苷1g/L,温度25℃,电流密度10 mA/cm2.结果表明,随pH增大,Sn-Ag-Cu的沉积电位负移.pH为3.22~7.74时,Sn-Ag-Cu合金镀层结晶细致、表面平整.Sn-Ag-Cu合金镀层由Sn、Ag3Sn和Cu6Sn5组成,其结晶取向随pH改变而变.HEDTA体系电沉积Sn-Ag-Cu合金镀层的适宜pH为3.00 ~ 6.00,最优范围是5.00 ~ 6.00.

  14. ISI's Journal Citation Reports on the Web.

    Science.gov (United States)

    Fitzpatrick, Roberta Bronson

    2003-01-01

    This column features an overview of the Institute for Scientific Information's (ISI) Journal Citation Reports (JCR) database. Basic searching techniques are presented, as well as simple ways to manipulate data contained in the file. The Journal Citation Reports database can provide information on highest impact journals, most frequently used journals, "hottest" journals, and largest journals in a field or discipline.

  15. NEW YEAR, NEW JOURNAL

    Institute of Scientific and Technical Information of China (English)

    Zunqi; Lin

    2013-01-01

    <正>We are excited to release the first issue of High Power Laser Science and Engineering(abbreviated HPLaser)at the beginning of 2013,Year of the Snake in the Chinese calendar.First of all,I would like to give our sincere thanks to those who have contributed to the publishing of the new journal.Since the invention of laser in 1960,the requirements of scientific research have driven the development of high power laser technology.Laser output power continues to increase dramatically through the development of laser technology,and many new research topics are being discovered and created.

  16. Aluminum alloy

    Science.gov (United States)

    Blackburn, Linda B. (Inventor); Starke, Edgar A., Jr. (Inventor)

    1989-01-01

    This invention relates to aluminum alloys, particularly to aluminum-copper-lithium alloys containing at least about 0.1 percent by weight of indium as an essential component, which are suitable for applications in aircraft and aerospace vehicles. At least about 0.1 percent by weight of indium is added as an essential component to an alloy which precipitates a T1 phase (Al2CuLi). This addition enhances the nucleation of the precipitate T1 phase, producing a microstructure which provides excellent strength as indicated by Rockwell hardness values and confirmed by standard tensile tests.

  17. A profession termed Journalism

    Directory of Open Access Journals (Sweden)

    Manuel Fernández Areal, Ph. D.

    2010-01-01

    Full Text Available New technologies can foster the impression that journalism, as a profession will become extinct probably in a short term. Anybody can have access to any information sources as well as to transmit – through Internet- all sorts of messages at an unusual speed, and this fact seems to support the idea that no technical training will be needed in the future not even an specific cultural background will be required, much less an university degree or qualification that ensures a responsible and appropriate practice of the modern social communication. The Federation of Journalists Associations in Spain (FAPE in its Draft of the Professional Statute is in favor of a graduated or qualified profession at an university level, and its Commission for Complaints has been developing a successful work regarding the professional self-regulation and self-control for the benefit of society. Therefore, there are good reasons for being optimist. Journalism, as a profession, is not going to disappear, and maybe it is time to consider it, really, as an academic qualified profession.

  18. 从含高铜铅氰化金泥中提取金、银、铜、铅全湿法工艺%Total-wet method to extract Au, Ag, Cu and Pb from cyanidation gold-slime containing high copper and lead

    Institute of Scientific and Technical Information of China (English)

    胡宪

    2011-01-01

    A total-wet method to extract Au, Ag, Cu and Pb from cyanidation gold-slime containing high copper and lead is put forward by experiments.The gold slim is pretreated by adding a sort of decoppering agent in the sulfuric acid medium, and the decoppering rate is 98 %.The gold extraction rate from the extracting slag after pretreatment is 99.5 %.Sponge gold is reduced with mixed reducer,and after impurity removement, the gold purity meets the Au-2 standard.%根据试验结果,提出了一种从含高铜铅氰化金泥中提取Au、Ag、Cu、Pb全湿法工艺.该工艺在硫酸介质中加入一种除铜剂对氰化金泥进行预处理,除铜率达98%;预处理后的含金渣浸金,金浸出率达99.5%以上;用混合还原荆还原出的海绵金,经去杂处理,金的成色达到Au-2标准.

  19. Particle temperature measurements in closed chamber detonations using thermoluminescence from Li{sub 2}B{sub 4}O{sub 7}:Ag,Cu, MgB{sub 4}O{sub 7}:Dy,Li and CaSO{sub 4}:Ce,Tb

    Energy Technology Data Exchange (ETDEWEB)

    Yukihara, E.G., E-mail: eduardo.yukihara@okstate.edu [Physics Department, Oklahoma State University, 145 Physical Sciences, Stillwater, OK 74078 (United States); Coleman, A.C.; Bastani, S.; Gustafson, T. [Physics Department, Oklahoma State University, 145 Physical Sciences, Stillwater, OK 74078 (United States); Talghader, J.J. [Department of Electrical and Computer Engineering, University of Minnesota, Minneapolis, MN 55455 (United States); Daniels, A.; Stamatis, D.; Lightstone, J. M; Milby, C.; Svingala, F.R. [Naval Surface Warfare Center, Indian Head Explosive Ordnance Disposal Technology Division (NSWC IHEODTD), Indian Head, MD 20640 (United States)

    2015-09-15

    The present work describes the procedures and results from the first temperature measurements in closed chamber detonations obtained using the thermoluminescence (TL) of particles specifically developed for temperature sensing. Li{sub 2}B{sub 4}O{sub 7}:Ag,Cu (LBO), MgB{sub 4}O{sub 7}:Dy,Li (MBO) and CaSO{sub 4}:Ce,Tb (CSO) were tested separately in a total of 12 independent detonations using a closed detonation chamber at the Naval Surface Warfare Center, Indian Head Explosive Ordnance Disposal Technology Division (NSWC IHEODTD). Detonations were carried out using two different explosives: a high temperature plastic bonded explosive (HPBX) and a low temperature plastic bonded explosive (LPBX). The LPBX and HPBX charges produced temperatures experienced by the TL particles to be between ~550–670 K and ~700–780 K, respectively, depending on the shot. The measured temperatures were reproducible and typically higher than the thermocouple temperatures. These tests demonstrate the survivability of the TL materials and the ability to obtain temperature estimates in realistic conditions, indicating that TL may represent a reliable way of estimating the temperature experienced by free-flowing particles inside an opaque post-detonation fireball. - Highlights: • TL materials were tested in closed chamber detonations. • Temperatures experienced by the particles were ~550–670 K and ~700–780 K. • TL temperatures were reproducible and higher than thermocouple measurements. • Tests demonstrate TL material survival and ability to obtain temperature estimates.

  20. Good journalism or peace journalism? – Counterplea by David Loyn

    Directory of Open Access Journals (Sweden)

    David Loyn

    2007-10-01

    Full Text Available In this paper the author responds to the reasoning by Jake Lynch (“Peace journalism and its discontents” and Samuel Peleg (“In defense of peace journalism: A rejoinder”, published in the same issue of conflict & communication online (http://www.cco.regener-online.de/2007_2/inhalt6_2.htm.

  1. Journalism we don’t teach at journalism schools

    NARCIS (Netherlands)

    Bakker, Piet

    2013-01-01

    Although basic features of journalism have remained the same over the last decades, the tasks journalists perform, the skills they need and the position they have within news organizations have changed dramatically. Usually the focus in the discourse on changes in journalism is on skills, especially

  2. Scientific journal cancellations

    CERN Multimedia

    The Library

    2001-01-01

    Earlier this year the Scientific Information Policy Board (SIPB) requested the Library and the Working Group for Acquisitions to revise the current printed journal collection in order to cancel those titles that are less required. Savings could then be used for the development of other collections and particularly electronic resources needed to support CERN current research activities. A list of proposed cancellations was drawn and posted on the Library web pages: http://library.cern.ch/library_general/cancel.html The SIPB invites every one to check if any of the titles are of importance to their work, in which case you are invited to inform the Library before the 25th of September by sending an e-mail to: eliane.chaney@cern.ch Titles not reconsidered by the users will be cancelled by the end of the year. Thank you, The Library

  3. Teaching journalism or teaching African journalism? Experiences from foreign involvement in a journalism programme in Ethiopia

    OpenAIRE

    Terje S. Skjerdal

    2011-01-01

    Journalism programmes across the African continent have different attitudes to the issue of universal vs.
    local values in journalism. This article discusses the issue in light of a post-graduate journalism
    programme that opened at Addis Ababa University in 2004. In its 5-year implementation phase, the
    programme engaged educators from Europe and North America in addition to local instructors. Thus, one
    could expect a potential conflict between Wester...

  4. Situating peace journalism in journalism studies: A critical appraisal

    Directory of Open Access Journals (Sweden)

    Thomas Hanitzsch

    2007-10-01

    Full Text Available Most wars were not brought to our attention if there were no journalists to report on them and no news media to send reporters to conflict spots. At the same time, the media often give priority to conflict and war at the expense of playing a positive role in attempts to bring about peace. The concept of peace journalism is, therefore, seen as an alternative model to traditional ways of war reporting. This article argues, however, that the idea of peace journalism comes as old wine in new bottles. Although carrying a noble goal, it ignores the manifold nuances in the media and tends to highlight the exceptional, spectacular and negative of war coverage. The idea of peace journalism tends to overestimate the influence journalists and the media have on political decisions; and it often understands audiences in terms of a passive mass that needs to be enlightened by virtue of peace reporting. In addition to this, peace journalism is, to a considerable extent, based on an overly individualistic perspective and ignores the many structural constraints that shape and limit the work of journalists: few personnel, time and material resources; editorial procedures and hierarchies; textual constraints; availability of sources; access to the scene and information in general - just to name a few. All this suggests that the conduct of peace journalism is not a matter of individual leeway, and media structures and professional routines cannot be modified from the position of the individual journalist. Modern corporate journalism involves processes of organized news production, thus giving priority to organizational and institutional factors as well as processes of professional socialization. To have any impact on the way the news is made, and its critical scrutiny, the advocates of peace journalism must address the structural constraints of news production. The discussion of peace journalism, and particularly of its practical implications, must be tied to the

  5. Electrical Resistance Alloys and Low-Expansion Alloys

    DEFF Research Database (Denmark)

    Kjer, Torben

    1996-01-01

    The article gives an overview of electrical resistance alloys and alloys with low thermal expansion. The electrical resistance alloys comprise resistance alloys, heating alloys and thermostat alloys. The low expansion alloys comprise alloys with very low expansion coefficients, alloys with very low...

  6. Science, Journalism and Media Logic

    NARCIS (Netherlands)

    Korthagen, Iris

    2016-01-01

    Science journalism is an important distribution channel for the results and insights produced by scientific research, and as such plays an important role in shaping public opinion of science. This prompted the Rathenau Institute to study the state of science journalism. We see journalists as partner

  7. Price Discrimination in Academic Journals.

    Science.gov (United States)

    Joyce, Patrick; Merz, Thomas E.

    1985-01-01

    Analysis of price discrimination (charging different prices to different customers for same product) for 89 academic journals in 6 disciplines reveals: incidence of price discrimination rose between 1974 and 1984, increase in mean institutional (library) subscription price exceeded increase in mean individual subscription price. Journal list…

  8. Medical Journalism and Emergency Medicine

    Directory of Open Access Journals (Sweden)

    Saeed Safari

    2015-07-01

    Full Text Available Nowadays, many researches in the field of medicine are conducting all around the world and medical journalism is a way to share the results. In fact, dissemination of the related manuscripts can prevent the repetitive research or may even lead to conducting a better survey. Therefore high quality medical journals are considered as up-to-date resources for further investigations. Medical journals are propagating their papers in various media including television programs, newspapers, internet websites and different social media. So they can influence the government policy makers, health-care professionals and even public. Moreover, most researchers hear about medical discoveries for the first time through medical journals and their related social media. So as well a high quality journal can help to improve medical science, a journal of poor quality can be damaging and distorting. Indeed, popular journals have the power of inventing a “communication storm” to draw attention to a certain topic. Thus they have to respect the accepted international principles to prevent spreading inaccurate and misleading data. This paper aims to review the previous and current situation of medical journalism by focus on field of emergency medicine.

  9. Journalism as Cultures of Circulation

    DEFF Research Database (Denmark)

    Bødker, Henrik

    2013-01-01

    The universe of journalism has always consisted of interspersed texts, meanings and practices. Yet, much journalism research has often isolated either texts and/or contexts and as such assumed relations between professional practices, informed (rational) readers and (conceived) core texts...... of journalism. It is, however, more important than ever to shift attention away from texts to the processes through which they are circulated. This is partly because the many cultural forms of journalism (textual, institutional, technological, material, behavioural and imagined) are undergoing significant......, likes, comments, searches, journalist roles, writing and reading positions and identities etc. Such forms will be traced within the mediation of a specific event with the overall aim of beginning a theorization of the landscape of journalism as highly interrelated cultures of circulation....

  10. Hierarchical networks of scientific journals

    CERN Document Server

    Palla, Gergely; Mones, Enys; Pollner, Péter; Vicsek, Tamás

    2015-01-01

    Scientific journals are the repositories of the gradually accumulating knowledge of mankind about the world surrounding us. Just as our knowledge is organised into classes ranging from major disciplines, subjects and fields to increasingly specific topics, journals can also be categorised into groups using various metrics. In addition to the set of topics characteristic for a journal, they can also be ranked regarding their relevance from the point of overall influence. One widespread measure is impact factor, but in the present paper we intend to reconstruct a much more detailed description by studying the hierarchical relations between the journals based on citation data. We use a measure related to the notion of m-reaching centrality and find a network which shows the level of influence of a journal from the point of the direction and efficiency with which information spreads through the network. We can also obtain an alternative network using a suitably modified nested hierarchy extraction method applied ...

  11. Compatibility of Anti-Wear Additives with Non-Ferrous Engine Bearing Alloys

    Energy Technology Data Exchange (ETDEWEB)

    Qu, Jun [Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States); Zhou, Yan [Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States)

    2017-01-01

    Investigate the compatibility of engine lubricant antiwear (AW) additives, specifically conventional zinc dialkyldithiophosphate (ZDDP) and newly developed ionic liquids (ILs), with selected non-ferrous engine bearing alloys, specifically aluminum and bronze alloys that are commonly used in connecting rod end journal bearings and bushings, to gain fundamental understanding to guide future development of engine lubricants

  12. Development of high strength Sn-Mg solder alloys with reasonable ductility

    Science.gov (United States)

    Alam, Md Ershadul; Gupta, Manoj

    2013-09-01

    This study discussed the development of a series of new lead-free Sn-Mg solders by incorporating varying amounts of Mg (0.8, 1.5 and 2.5 wt. %) into pure Sn using disintegrated melt deposition technique followed by room temperature extrusion. All extruded Sn and Sn-Mg solder samples were characterized. Microstructural characterization studies revealed equiaxed grain morphology, minimal porosity and relatively uniform distribution of secondary phase. Better coefficient of thermal expansion was observed for Sn-2.5Mg sample when compared to conventional Sn-37Pb solder. Melting temperature of Sn-1.5Mg was found to be 212°C which is much lower than the conventional Sn-Ag-Cu or Sn-Cu (227°C) solders. Microhardness was increased with increasing amount of Mg in pure Sn. Room temperature tensile test results revealed that newly developed Sn-Mg solders exhibit enhanced strengths (0.2% yield strength and ultimate tensile strength) with comparable (if not better) ductility when compared to other commercially available and widely used Sn-based solder alloys.

  13. Chemical elements diffusion in the stainless steel components brazed with Cu-Ag alloy

    Science.gov (United States)

    Voiculescu, I.; Geanta, V.; Vasile, I. M.; Binchiciu, E. F.; Winestoock, R.

    2016-06-01

    The paper presents the study of diffusion of chemical elements through a brazing joint, between two thin components (0.5mm) made of stainless steel 304. An experimental brazing filler material has been used for brazing stainless steel component and then the diffusion phenomenon has been studied, in terms of chemical element displacement from the brazed separation interface. The filler material is in the form of a metal rod coated with ceramic slurry mixture of minerals, containing precursors and metallic powders, which can contribute to the formation of deposit brazed. In determining the distance of diffusion of chemical elements, on both sides of the fusion line, were performed measurements of the chemical composition using electron microscopy SEM and EDX spectrometry. Metallographic analysis of cross sections was performed with the aim of highlight the microstructural characteristics of brazed joints, for estimate the wetting capacity, adherence of filler metal and highlight any imperfections. Analyzes performed showed the penetration of alloying elements from the solder (Ag, Cu, Zn and Sn) towards the base material (stainless steel), over distances up to 60 microns.

  14. Authorship policies of scientific journals.

    Science.gov (United States)

    Resnik, David B; Tyler, Ana M; Black, Jennifer R; Kissling, Grace

    2016-03-01

    We analysed the authorship policies of a random sample of 600 journals from the Journal Citation Reports database. 62.5% of the journals we sampled had an authorship policy. Having an authorship policy was positively associated with impact factor. Journals from the biomedical sciences and social sciences/humanities were more likely to have an authorship policy than journals from the physical sciences, engineering or mathematical sciences. Among journals with a policy, the most frequent type of policy was guidance on criteria for authorship (99.7%); followed by guidance on acknowledgments (97.3%); requiring that authors make substantial contributions to the research (94.7%); requiring that authors be accountable for the research as a whole (84.8%); guidance on changes in authorship (77.9%); requiring that authors give final approval to the manuscript (77.6%); requiring that authors draft or critically revise the manuscript (71.7%); providing guidance on corporate authorship (58.9%); prohibiting gift, guest or ghost authorship (31.7%); requiring authors to describe their contributions (5.3%); limiting the number of authors for some types of articles (4.0%) and requiring authors to be accountable for their part in the research (1.1%). None of the policies addressed equal contribution statements. Journals that do not have authorship policies should consider adopting or developing ones.

  15. Wetting evaluation of silver based braze alloys onto zirconia metalized with reactive elements for application in oil well drill bots; Avaliacao do molhamento de ligas de adicao a base de prata sobre zirconia polida e metalizada com elementos ativos para aplicacao em brocas de perfuracao de pocos de petroleo

    Energy Technology Data Exchange (ETDEWEB)

    Pereira, J.C.; Silva, J.M.; Santos, P.R.F.; Nascimento, R.M.; Martinelli, A.E. [Universidade Federal do Rio Grande do Norte (UFRN), Natal, RN (Brazil). Dept. de Engenharia de Materiais], Email: jocabuzo@gmail.com; Pimenta, J.S. [Universidade Federal de Santa Catarina (UFSC), Florianopolis, SC (Brazil). Dept. de Engenharia Mecanica

    2010-07-01

    Drill bits with hard ceramic inserts are often used on drilling operations. The cutting and crushing action of rocks will produce failures in the tricone bits, which are related to wear; total or partial rupture of the drill bit body or even the inserts; thermal shock and corrosion. The research of better drill bits with ceramic inserts thermally more stable and mechanically stronger, will lead to an increase of their lifetime, and so reducing costs of substitution and maintenance. In the present work, some silver based braze alloys were melted onto zirconia YSZ substrates metallized or not with active metals. inside a furnace with vacuum of 10{sup -5} mbar to evaluate the wetting behavior. The system with AgCuTi and the non metallized YSZ ceramic, showed low contact angles and stable interfaces, which may be appropriate for brazing metal/ceramic parts. (author)

  16. Mo-Cu合金与1Cr18Ni9Ti不锈钢真空钎焊接头的组织性能%Microstructure characteristics of vacuum brazed joint for Mo-Cu alloy with lCrl8Ni9Ti stainless steel

    Institute of Scientific and Technical Information of China (English)

    王娟; 郑德双; 李亚江

    2013-01-01

    Mo-Cu alloy and lCrl8Ni9Ti stainless steel were joined by vacuum brazing with Ag-Cu-Ti active filler metal at 910 ℃ for 20 min and a Mo-Cu/lCrl8Ni9Ti joint with a shear strength of 75 MPa was obtained. The microstructure and performance of Mo-Cu/lCrl8Ni9Ti joint were investigated by scanning electron microscope ( SEM ) , energy dispersive spectrometer ( EDS) and microhardness test. The results indicated that Ag-Cu eutectic and Cu-rich phase were produced in the brazed joint. There were few of TiC phases near the side of lCrl8Ni9Ti stainless steel in the joint. The microhardness of brazed seam was lower than that of Mo-Cu alloy and lCrl8Ni9Ti stainless steel. There are no brittle compounds formed in the Mo-Cu/lCrl8Ni9Ti joint. The shear fracture appearance shows shear dimple feature.%采用Ag-Cu-Ti钎料,控制钎焊温度为910℃,保温时间为20 min,可以实现Mo-Cu合金与1Cr1 8Ni9Ti不锈钢的真空钎焊,接头抗剪强度为75 MPa.采用扫描电镜、能谱分析仪和显微硬度计对Mo-Cu/1 Cr18 Ni9Ti接头组织特征及性能进行分析.结果表明,钎焊接头靠近1Cr18Ni9Ti钢一侧,主要形成Ag-Cu共晶组织和少量的TiC相;靠近Mo-Cu合金一侧,Ag,Cu元素在合金与钎缝间相向扩散,共晶组织消失,以富铜相为主.钎缝的显微硬度明显低于Mo-Cu合金和1Cr18Ni9Ti不锈钢母材,无脆性化合物生成,剪切断口呈现剪切韧窝的形貌特征.

  17. Literary journalism : the intersection of literature and journalism

    Directory of Open Access Journals (Sweden)

    Sonja Merljak Zdovc

    2004-12-01

    Full Text Available Literary journalism is a style of newspaper and magazine writing that developed as a reaction against facto graphic and objective journalism. Rather than answering the informational who, what, when, or where, it depicts moments in time. It has also managed to eschew the formula of newspaper feature writing, with its predictability and cliches. Instead, it appointed the techniques of realistic  fiction to portray daily life. The author of this paper attempts to present the genre that belongs at the same time to literature and journalism; it combines the best of both practices in order to give the reader the most vivid and accurate picture of society. The author of this paper also attempts to present literary journalism as it exists in Slovenia.

  18. Effect of Ni and Bi addition on growth rate of intermetallic compound of SnAgCu soldering%Ni和Bi元素对SnAgCu钎焊界面金属化合物生长速率的影响

    Institute of Scientific and Technical Information of China (English)

    刘洋; 孙凤莲

    2012-01-01

    通过加速温度时效方法研究Ni和Bi元素对低银(含银量小于1%,质量分数)Sn-Ag-Cu (LASAC)钎料 界面IMC生长速率的影响.通过与高银钎料SAC305和低银钎料LASAC对比,分析添加Ni和Bi元素后LASAC钎料在高温时效过程中热疲劳抗性的变化情况.结果表明:LASAC/Cu、LASAC-Bi/Cu和SAC305/Cu界面IMC时效后均形成较厚的Cu3Sn层,LASAC-Ni/Cu界面经IMC时效后则形成较薄的(Cu,Ni)3Sn;高银钎料SAC305在180℃时效下IMC生长速率为2.17×10-5 μm2/s,与之相比,低Ag钎料LASAC IMC在时效过程中生长速率较高,为3.8×10-5 μm2/s; Ni和Bi元素的添加均可降低钎料LASAC/Cu界面IMC的生长速率,其中Bi的改善效果最显著,LASAC-Bi钎料的IMC生长速率为1.92×10-5μm2/s,低于SAC305钎料的IMC生长速率.%The effects of Ni and Bi addition on the intermetallic compound (IMC) growth rate of low-Ag (<1%, mass fraction) Sn-Ag-Cu(LASAC) soldering were investigated by accelerated temperature aging. The thermal fatige resistance of LASAC solders with Ni and Bi addition was studied by comparing with SAC305 solder. The results show that thick Cu3Sn layer forms after high temperature storage (HTS) aging between LASAC/Cu, LASAC-Bi/Cu and SAC305/Cu interfaces. While the IMC between LASAC-Ni/Cu is (Cu, Ni)3Sn layer with a very thin thickness after aged. The IMC growth rate of SAC305 is 2.17X 10-5 um2/s. However, the IMC growth rate of LASAC solder is 3.8X 10-5 um2/s, which is faster than that of SAC305. The growth rate of IMC at LASAC/Cu interface decreases with Ni and Bi addition. Bi shows a better improvement for solder compared with Ni element. The IMC growth rate of LASAC-Bi is 1.92 X 10-5 um2/s, which is slower than the IMC growth rate of SAC305.

  19. Journal Writing for Life Development

    Directory of Open Access Journals (Sweden)

    Dorothy M. Epple

    2007-12-01

    Full Text Available Journal writing can be a creative adjunct to psychotherapy. This article will describe a qualitative study of the experiences of journal writers. Each participant’s narrative illustrates the integration of Winnicott’s transitional phenomena, Freeman’s four stages of epiphanies, and Kegan’s adult developmental stages through journal writing. The central findings of this research are that the experience of the participants can be identified in the following three categories: therapeutic experience,meditative experience, and a transformative experience. Journal writing can be adapted by psychotherapists, as an adjunct to therapy, to aid clients in elaborating their stories, listening within, identifying epiphanies, and moving forward in the change process.This article will present a case study of one of the narratives from this research.

  20. Published journal article with data

    Data.gov (United States)

    U.S. Environmental Protection Agency — published journal article. This dataset is associated with the following publication: Schumacher, B., J. Zimmerman, J. Elliot, and G. Swanson. The Effect of...

  1. 60 years of IUCr journals

    Science.gov (United States)

    Authier, A.

    2009-05-01

    The birth and growth of the publications and journals of the International Union of Crystallography from 1948 to 2008 are described. Details are given of the pre-war history that led up to their creation and development.

  2. Historic Climate Diaries and Journals

    Data.gov (United States)

    National Oceanic and Atmospheric Administration, Department of Commerce — Diaries and Journals containing weather information in a non-tabular format. Records date from 1735 through the early 20th century. Much of the weather and climate...

  3. Peace Journalism and its discontents

    Directory of Open Access Journals (Sweden)

    Jake Lynch

    2007-10-01

    Full Text Available This article is a response to criticisms of peace journalism from a journalist (David Loyn and a scholar (Thomas Hanitzsch by one who has recently gone from one profession to the other. It argues that journalists, like Loyn, often misrepresent the dividing lines in the debate over peace journalism because they take an unduly realist view of news and its relationship with the facts. This is tantamount to ignoring some of the most important insights of research into journalism and communications. On the other hand, scholars like Hanitzsch take an unduly conventionalist view, it argues, thereby excluding important arguments about the basis upon which we should prefer some representations of conflict over others, as being more accurate and more useful. Peace journalism bases its claims on observations about conflict, peace and violence by researchers in Peace and Conflict Studies, preferable as a basis for representing conflict to the often-unexamined conventions of the news industry. Peace journalism is also criticised as resting on an overly individualistic model of journalistic endeavour, attaching too little weight to the importance of structural constraints on the work of editors and reporters. This article acknowledges those constraints as governing, though not fully determining influences; but it also argues that peace journalism can contribute to the mobilization of social resources for structural reform, or for the existing structural provisions for public service concepts in journalism to be applied and carried out. Furthermore, some research into journalistic representations of conflict is insufficiently attentive to the insights of peace research, as distinct from research on journalism, a shortcoming which, the article says, invalidates some of its conclusions.

  4. Clinical relevance in anesthesia journals

    DEFF Research Database (Denmark)

    Lauritsen, Jakob; Møller, Ann M

    2006-01-01

    The purpose of this review is to present the latest knowledge and research on the definition and distribution of clinically relevant articles in anesthesia journals. It will also discuss the importance of the chosen methodology and outcome of articles.......The purpose of this review is to present the latest knowledge and research on the definition and distribution of clinically relevant articles in anesthesia journals. It will also discuss the importance of the chosen methodology and outcome of articles....

  5. Global Journalism Ethics: Widening the Conceptual Base

    Directory of Open Access Journals (Sweden)

    Stephen J. A. Ward

    2008-01-01

    Full Text Available For most of its history, journalism ethics has been highly practical in aim, in theorizing, and in application. Inquiry analyzed what was occurring inside newsrooms and its scope was parochial. Starting from the premise that a parochial approach no longer serves journalism, the study of journalism, or the public of journalism, in this paper it is argued that a major task of journalism ethics is to construct a more non-parochial ethics—a global journalism ethics informed by critical work from various disciplines and cultures. The discussion presented charts the trajectory of journalism ethics over several centuries to explain the role of parochialism and the limits of theorizing in journalism ethics. This historical perspective also serves as a foundation for outlining what a future journalism ethics might look like, if we widen the conceptual base by incorporating new knowledge of media from outside journalism ethics, and by redefining journalism ethics as a global enterprise.

  6. An Overview and Analysis of Journal Operations, Journal Publication Patterns, and Journal Impact in School Psychology and Related Fields

    Science.gov (United States)

    Floyd, Randy G.; Cooley, Kathryn M.; Arnett, James E.; Fagan, Thomas K.; Mercer, Sterett H.; Hingle, Christine

    2011-01-01

    This article describes the results of three studies designed to understand better the journal operations, publishing practices, and impact of school psychology journals in recent years. The first study presents the results of a survey focusing on journal operations and peer-review practices that was completed by 61 journal editors of school…

  7. Literature and interviews on journalism studies

    DEFF Research Database (Denmark)

    Jørgensen, Asbjørn Slot

    What is necessary for the teaching of skills specific to online and cross-media journalism in new media? Danish country report for the project Integrated Journalism in Europe.......What is necessary for the teaching of skills specific to online and cross-media journalism in new media? Danish country report for the project Integrated Journalism in Europe....

  8. Faculty Perception of Business Education Journals.

    Science.gov (United States)

    Blair, Robert B.; Balachandran, Martha E.

    2002-01-01

    Responses from 51 of 134 members of the National Association of Business Teacher Education (NABTE) rated the quality of 22 business education journals. The top two were Delta Pi Epsilon Journal and NABTE Review. Refereed and national publications rated higher than nonrefereed or state journals. Most departments did not rank journals in the…

  9. Crossing Cultures with Multi-Voiced Journals

    Science.gov (United States)

    Styslinger, Mary E.; Whisenant, Alison

    2004-01-01

    In this article, the authors discuss the benefits of using multi-voiced journals as a teaching strategy in reading instruction. Multi-voiced journals, an adaptation of dual-voiced journals, encourage responses to reading in varied, cultured voices of characters. It is similar to reading journals in that they prod students to connect to the lives…

  10. The Core Journal Concept in Black Studies

    Science.gov (United States)

    Weissinger, Thomas

    2010-01-01

    Black Studies scholars have shown interest in the core journal concept. Indeed, the idea of core journals for the study of the Black experience has changed several times since 1940. While Black Studies scholars are citing Black Studies journals with frequency, they also cite traditional disciplinary journals a great deal of the time. However,…

  11. Creativity and Mathematics: Using Learning Journals

    Science.gov (United States)

    Coles, Alf; Banfield, Gemma

    2012-01-01

    Does the term "learning journal" readily conjure up an image of something that is part of the normal mathematics classroom? Personally, do you ever use a journal of some form to help you organise your thoughts? Or, put quite simply--what is a learning journal? It might be that you are unfamiliar with the label, but journals are one type of…

  12. Relative Influence of Professional Counseling Journals

    Science.gov (United States)

    Fernando, Delini M.; Barrio Minton, Casey A.

    2011-01-01

    The authors used social network analysis of citation data to study the flow of information and relative influence of 17 professional counseling journals. Although the "Journal of Counseling & Development" ranked very highly in all measures of journal influence, several division journals emerged as key players in the flow of information within the…

  13. Metal and alloy nanoparticles by amine-borane reduction of metal salts by solid-phase synthesis: atom economy and green process.

    Science.gov (United States)

    Sanyal, Udishnu; Jagirdar, Balaji R

    2012-12-03

    A new solid state synthetic route has been developed toward metal and bimetallic alloy nanoparticles from metal salts employing amine-boranes as the reducing agent. During the reduction, amine-borane plays a dual role: acts as a reducing agent and reduces the metal salts to their elemental form and simultaneously generates a stabilizing agent in situ which controls the growth of the particles and stabilizes them in the nanosize regime. Employing different amine-boranes with differing reducing ability (ammonia borane (AB), dimethylamine borane (DMAB), and triethylamine borane (TMAB)) was found to have a profound effect on the particle size and the size distribution. Usage of AB as the reducing agent provided the smallest possible size with best size distribution. Employment of TMAB also afforded similar results; however, when DMAB was used as the reducing agent it resulted in larger sized nanoparticles that are polydisperse too. In the AB mediated reduction, BNH(x) polymer generated in situ acts as a capping agent whereas, the complexing amine of the other amine-boranes (DMAB and TMAB) play the same role. Employing the solid state route described herein, monometallic Au, Ag, Cu, Pd, and Ir and bimetallic CuAg and CuAu alloy nanoparticles of <10 nm were successfully prepared. Nucleation and growth processes that control the size and the size distribution of the resulting nanoparticles have been elucidated in these systems.

  14. Effect of Ag addition on phase transitions of the Cu–22.26 at.%Al–9.93 at.%Mn alloy

    Energy Technology Data Exchange (ETDEWEB)

    Silva, R.A.G., E-mail: galdino.ricardo@gmail.com [DCET, Universidade Federal de São Paulo, Campus Diadema, SP (Brazil); Gama, S.; Paganotti, A. [DCET, Universidade Federal de São Paulo, Campus Diadema, SP (Brazil); Adorno, A.T.; Carvalho, T.M.; Santos, C.M.A. [DFQ, Instituto de Química – Unesp, Campus Araraquara, SP (Brazil)

    2013-02-20

    Highlights: ► A kinetic mechanism for the dissolution of DO{sub 3} phase is suggested. ► The intermediate phase interferes on the kinetics of the DO{sub 3} phase dissolution. ► The presence of Ag changes the stability of intermediate phase. - Abstract: The phase transitions that occur in the Cu–22.26 at.%Al–9.93 at.%Mn and Cu–22.49 at.%Al–10.01 at.%Mn–1.53 at.%Ag alloys after slow cooling were studied using differential scanning calorimetry at different heating rates, microhardness changes with temperature, magnetization changes with temperature, scanning electron microscopy and energy dispersion X-ray spectroscopy. The results indicated that the presence of Ag does not modify the transition sequence of Cu–Al–Mn alloy, introduces a new transition due to the (Ag-Cu)-rich precipitates dissolution at about 800 K, and changes the mechanism of DO{sub 3} phase dissolution. This mechanistic change was analyzed and a sequence of phase transitions was proposed for the reaction.

  15. Reliability of journal impact factor rankings

    Directory of Open Access Journals (Sweden)

    Greenwood Darren C

    2007-11-01

    Full Text Available Abstract Background Journal impact factors and their ranks are used widely by journals, researchers, and research assessment exercises. Methods Based on citations to journals in research and experimental medicine in 2005, Bayesian Markov chain Monte Carlo methods were used to estimate the uncertainty associated with these journal performance indicators. Results Intervals representing plausible ranges of values for journal impact factor ranks indicated that most journals cannot be ranked with great precision. Only the top and bottom few journals could place any confidence in their rank position. Intervals were wider and overlapping for most journals. Conclusion Decisions placed on journal impact factors are potentially misleading where the uncertainty associated with the measure is ignored. This article proposes that caution should be exercised in the interpretation of journal impact factors and their ranks, and specifically that a measure of uncertainty should be routinely presented alongside the point estimate.

  16. Seventy Years of the Journal "Medical Archives".

    Science.gov (United States)

    Masic, Izet

    2016-02-01

    This year journal "Medical Archives" celebrates 70th anniversary of its continuing publication. Medical Archives is oldest biomedical journal in Bosnia and Herzegovina and one of the oldest medical journals in Europe, established in the year 1947, as official scientific and professional journal of Association of Physicians of Bosnia and Herzegovina. Until present Medical Archives has published over 5000 articles. Today Medical Archives is internationally recognized medical peer-reviewed indexed journal, visible in more than 30 international on-line databases.

  17. Journal of Mineralogical and Petrological Sciences

    Science.gov (United States)

    Official journal of Japan Association of Mineralogical Sciences (JAMS), focusing on mineralogical and petrological sciences and their related fields. Journal of Mineralogical and Petrological Sciences (JMPS) is the successor journal to both “Journal of Mineralogy, Petrology and Economic Geology” and “Mineralogical Journal”. Journal of Mineralogical and Petrological Sciences (JMPS) is indexed in the ISI database (Thomson Reuters), the Science Citation Index-Expanded, Current Contents/Physical, Chemical & Earth Sciences, and ISI Alerting Services.

  18. Journal Benchmarking for Strategic Publication Management and for Improving Journal Positioning in the World Ranking Systems

    Science.gov (United States)

    Moskovkin, Vladimir M.; Bocharova, Emilia A.; Balashova, Oksana V.

    2014-01-01

    Purpose: The purpose of this paper is to introduce and develop the methodology of journal benchmarking. Design/Methodology/ Approach: The journal benchmarking method is understood to be an analytic procedure of continuous monitoring and comparing of the advance of specific journal(s) against that of competing journals in the same subject area,…

  19. Dwight D. Eisenhower Army Medical Center (DDEAMC) Staff Preferences: Electronic Journals versus Print Journals

    Science.gov (United States)

    2003-04-01

    Biomedical Library Journal Preferences 26 investigated the impact of electronic journals on research processes. The results of this research indicated... Library Journal Preferences 28 reported that health science researchers valued the convenience and time-saving features of electronic journals including 24...Health Science Library (2001). Health Science Library Journal List [Brochure]. Fort Gordon, Georgia: Author. Department of Defense (2002). Department

  20. State of the Journal, 2015.

    Science.gov (United States)

    Richards, Lorie Gage

    2015-01-01

    The American Journal of Occupational Therapy (AJOT) had a successful 2015. From September 2014 to September 2015, the number of manuscripts submitted had increased by 35%. Manuscripts were received from 23 countries, compared with 17 countries in 2014. AJOT continues to have the highest impact factor and to be the highest ranked of the occupational therapy journals listed in Journal Citation Reports. AJOT continues to focus on publishing research articles on aspects of occupational therapy among varied populations with diverse acute and chronic conditions. Additional changes for 2015 include new associate editors, a significantly enlarged pool of reviewers from across the globe, continuous publishing, pay-per-view, updated author guidelines, and the adoption of clinical trial registration requirements effective January 1, 2016.

  1. The knowledge base of journalism

    DEFF Research Database (Denmark)

    Svith, Flemming

    In this paper I propose the knowledge base as a fruitful way to apprehend journalism. With the claim that the majority of practice is anchored in knowledge – understood as 9 categories of rationales, forms and levels – this knowledge base appears as a contextual look at journalists’ knowledge......, and place. As an analytical framework, the knowledge base is limited to understand the practice of newspaper journalists, but, conversely, the knowledge base encompasses more general beginnings through the inclusion of overall structural relationships in the media and journalism and general theories...... on practice and knowledge. As the result of an abductive reasoning is a theory proposal, there is a need for more deductive approaches to test the validity of this knowledge base claim. It is thus relevant to investigate which rationales are included in the knowledge base of journalism, as the dimension does...

  2. IDEAL: ACADEMIC PRESS JOURNALS ONLINE

    CERN Multimedia

    The Library

    2001-01-01

    All Academic Press journals are available online to CERN users for a test period which will last until the end of July. The service 'IDEALIBRARY' includes 174 scientific journals that cover several domains, ranging from engineering to mathematics, computing and physics. Titles covered are among others 'Atomic Data and Nuclear Data Tables', 'Nuclear Data Sheets', 'Annals of Physics', 'Journal of Parallel and Distributed Computing'. Reference citations present in each article are linked to the corresponding full text, when the latter is published by a member of the CrossRef consortium (members are: Elsevier, APS, AIP and others). Therefore, the navigation between articles and references is uninterrupted. A search engine allows queries by author, title and publication year. See http://www.idealibrary.com. At present the Library is evaluating a site license offer proposed by the publisher.

  3. Narrative journalism as complementary inquiry

    Directory of Open Access Journals (Sweden)

    Jørgen Jeppesen

    2011-10-01

    Full Text Available Narrative journalism is a method to craft stories worth reading about real people. In this article, we explore the ability of that communicative power to produce insights complementary to those obtainable through traditional qualitative and quantitative research methods. With examples from a study of journalistic narrative as patient involvement in professional rehabilitation, interview data transcribed as stories are analyzed for qualities of heterogeneity, sensibility, transparency, and reflexivity. Building on sociological theories of thinking with stories, writing as inquiry, and public journalism as ethnography, we suggest that narrative journalism as a common practice might unfold dimensions of subjective otherness of the self. Aspiring to unite writing in both transparently confrontational and empathetically dialogic ways, the narrative journalistic method holds a potential to expose dynamics of power within the interview.

  4. Can Scientific Journals be Classified in terms of Aggregated Journal-Journal Citation Relations using the Journal Citation Reports?

    CERN Document Server

    Leydesdorff, Loet

    2009-01-01

    The aggregated citation relations among journals included in the Science Citation Index provide us with a huge matrix which can be analyzed in various ways. Using principal component analysis or factor analysis, the factor scores can be used as indicators of the position of the cited journals in the citing dimensions of the database. Unrotated factor scores are exact, and the extraction of principal components can be made stepwise since the principal components are independent. Rotation may be needed for the designation, but in the rotated solution a model is assumed. This assumption can be legitimated on pragmatic or theoretical grounds. Since the resulting outcomes remain sensitive to the assumptions in the model, an unambiguous classification is no longer possible in this case. However, the factor-analytic solutions allow us to test classifications against the structures contained in the database. This will be demonstrated for the delineation of a set of biochemistry journals.

  5. Evaluating big deal journal bundles.

    Science.gov (United States)

    Bergstrom, Theodore C; Courant, Paul N; McAfee, R Preston; Williams, Michael A

    2014-07-01

    Large commercial publishers sell bundled online subscriptions to their entire list of academic journals at prices significantly lower than the sum of their á la carte prices. Bundle prices differ drastically between institutions, but they are not publicly posted. The data that we have collected enable us to compare the bundle prices charged by commercial publishers with those of nonprofit societies and to examine the types of price discrimination practiced by commercial and nonprofit journal publishers. This information is of interest to economists who study monopolist pricing, librarians interested in making efficient use of library budgets, and scholars who are interested in the availability of the work that they publish.

  6. Journal Editing and Ethical Research Practice: Perspectives of Journal Editors

    Science.gov (United States)

    Randell-Moon, Holly; Anderson, Nicole; Bretag, Tracey; Burke, Anthony; Grieshaber, Sue; Lambert, Anthony; Saltmarsh, David; Yelland, Nicola

    2011-01-01

    This article offers perspectives from academics with recent journal editing experience on a range of ethical issues and dilemmas that regularly pose challenges for those in editorial roles. Each contributing author has provided commentary and reflection on a select topic that was identified in the research literature concerning academic publishing…

  7. Memoires d'apprendre: journal (Memories of Learning: Journal).

    Science.gov (United States)

    Allouche, Victor

    1990-01-01

    A French teacher's journal notes about his experience as a student in an intensive English course in a foreign country are presented. The notes address aspects of the language learning experience, including unfamiliar cultural context, intrusion of the new language into daily thought, resistance, translation, interference, and motivation. (MSE)

  8. Comparison of journal self-citation rates between some Chinese and non-Chinese international journals.

    Directory of Open Access Journals (Sweden)

    Zu-Guo Yang

    Full Text Available BACKGROUND: The past 3 decades have witnessed a boost in science development in China; in parallel, more and more Chinese scientific journals are indexed by the Journal Citation Reports issued by Thomson Reuters (SCI. Evaluation of the performance of these Chinese SCI journals is necessary and helpful to improve their quality. This study aimed to evaluate these journals by calculating various journal self-citation rates, which are important parameters influencing a journal impact factor. METHODOLOGY/PRINCIPAL FINDINGS: We defined three journal self-citation rates, and studied these rates for 99 Chinese scientific journals, almost exhausting all Chinese SCI journals currently available. Likewise, we selected 99 non-Chinese international (abbreviated as 'world' journals, with each being in the same JCR subject category and having similar impact factors as their Chinese counterparts. Generally, Chinese journals tended to be higher in all the three self-citation rates than world journal counterparts. Particularly, a few Chinese scientific journals had much higher self-citation rates. CONCLUSIONS/SIGNIFICANCE: Our results show that generally Chinese scientific journals have higher self-citation rates than those of world journals. Consequently, Chinese scientific journals tend to have lower visibility and are more isolated in the relevant fields. Considering the fact that sciences are rapidly developing in China and so are Chinese scientific journals, we expect that the differences of journal self-citation rates between Chinese and world scientific journals will gradually disappear in the future. Some suggestions to solve the problems are presented.

  9. The intermetallic formation and growth kinetics at the interface of near eutectic tin-silver-copper solder alloys and gold/nickel metallization

    Science.gov (United States)

    Gao, Mao

    The formation of a one micron thick layer of an intermetallic compound between a solder alloy and a metallic substrate generally constitutes a good solder joint in an electronic device. However, if the compound grows too thick, and/or if multiple intermetallic compounds form, poor solder joint reliability may result. Thus significant interest has been focused on intermetallic compound phase selection and growth kinetics at such solder/metal interfaces. The present study focuses on one such specific problem, the formation and growth of intermetallic compounds at near eutectic Sn-Ag-Cu solder alloy/Ni interfaces. Sn-3.0Ag-0.5Cu solder was reflowed on Au/Ni substrates, resulting in the initial formation and growth of (CuNi)6Sn 5 at Sn-3.0Ag-0.5Cu /Ni interfaces. (NiCu)3Sn4 formed between the (CuNi)6Sn5 and the Ni substrate when the concentration of Cu in the liquid SnAgCu solder decreased to a critical value which depended upon temperature: 0.37, 0.31 and 0.3(wt.%) at reflow temperatures of 260°C, 245°C and 230°C respectively. The growth rate of (CuNi)6Sn5 was found to be consistent with extrapolations of a diffusion limited growth model formulated for lower temperature, solid state diffusion couples. The long range diffusion of Cu did not limit growth rates. The spalling of (CuNiAu)6Sn5 from (NiCu)3 Sn4 surfaces during reflow was also examined. When the Cu concentration in the solder decreased to approximately 0.28wt.%, the (Cu,Ni,Au) 6Sn5 was observed to spall. Compressive stress in (CuNiAu) 6Sn5 and weak adhesion between (CuNiAu)6Sn 5 and (NiCu)3Sn4 was found to cause this effect.

  10. Effect of Rare-Earth (La, Ce, and Y) Additions on the Microstructure and Mechanical Behavior of Sn-3.9Ag-0.7Cu Solder Alloy

    Science.gov (United States)

    Dudek, M. A.; Chawla, N.

    2010-03-01

    In this article, we report on the microstructure and mechanical properties of Ce- and Y-containing Sn-3.9Ag-0.7Cu solders. The microstructures of both as-processed solder and solder joints containing rare-earth (RE) elements (up to 0.5 wt pct) are more refined compared to conventional Sn-3.9Ag-0.7Cu, with decreases in secondary Sn dendrite size and spacing and a thinner Cu6Sn5 intermetallic layer at the Cu/solder interface. These results agree well with similar observations seen in La-containing solders reported previously. The monotonic shear behavior of reflowed Sn-3.9Ag-0.7Cu- X(Ce, Y)/Cu lap shear joints was studied as well as the creep behavior at 368 K (95 °C). The data were compared with results obtained for Sn-3.9Ag-0.7Cu and Sn-3.9Ag-0.7Cu- XLa alloys. All RE-containing alloys exhibited creep behavior similar to Sn-3.9Ag-0.7Cu. Alloys with Ce additions exhibited a small decrease in ultimate shear strength but higher elongations compared with Sn-Ag-Cu. Similar observations were seen in La-containing solders. The influence of the RE-containing intermetallics (CeSn3 and YSn3) that form in these alloys on the microstructural refinement, solidification behavior, and mechanical performance of these novel materials is discussed.

  11. THE LIST OF JOURNALS ABSTRACTED

    Institute of Scientific and Technical Information of China (English)

    2001-01-01

    Academic Journal of the First Medical University of PLA; Acad J Ist Med Univ PLA Acta Academiae Medicinae Bengbu; Acta Acad Med Bengbu Acta Academiae Medicinae Hebei; Acta Acad Med Hebei Acta Academiae Medicinae Nanjing; Acta Acad Med Nanjing Acta Academiae Medicinae Nantong; Acta Acad Med Nantong

  12. Leakage-free journal bearings

    Science.gov (United States)

    Pinkus, O.; Etsion, I.

    1976-01-01

    A new concept of a journal bearing is developed which prevents side leakage of the lubricant, thus eliminating the need for sealing and collecting this leakage. The cooling of the bearing is accomplished by the prevailing circumferential flow. An analysis is performed and solutions are given for the bearing geometries and inlet pressures required to achieve the above purpose.

  13. JournalMap: Research. Reimagined.

    Science.gov (United States)

    JournalMap is a scientific literature search engine that empowers you to find relevant research based on location and biophysical variables as well as traditional keyword searches. All publications are geotagged based on reported location information and plotted on a world map showing where the rese...

  14. Changes in Journal Financial Management

    Science.gov (United States)

    Editorial Staff, Jce

    2009-06-01

    This report announces the retirement of Mary Orna from the position of Publication Manager of JCE and gives information on the Board of Publication decision to change the management of the Journal 's business and financial affairs to a new system consisting of a treasurer and a business manager, and announces the appointments to those positions.

  15. Chiropractic & Osteopathy. A new journal

    Directory of Open Access Journals (Sweden)

    Walker Bruce F

    2005-04-01

    Full Text Available Abstract Both chiropractic and osteopathy are over a century old. They are now regarded as complementary health professions. There is an imperative for both professions to research the principles and claims that underpin them, and the new journal Chiropractic & Osteopathy provides a scientific forum for the publication of such research.

  16. School Library Journal's Spending Survey

    Science.gov (United States)

    Farmer, Lesley; Shontz, Marilyn

    2009-01-01

    This year's "School Library Journal's" spending survey showed that, despite the recession, the vast majority of media centers around the country have retained their credentialed media specialists. For example, almost 85% of elementary schools and more than 95% of middle and high schools have a full-time certified librarian. In addition, salaries…

  17. Television journalism during terror attacks

    DEFF Research Database (Denmark)

    Mogensen, Kirsten

    2008-01-01

    This article views television news coverage of ongoing terrorist attacks and their immediate aftermath as a special genre within journalism, and describes norms connected with the genre. The description is based on qualitative analyses of the coverage on major American networks the first 24 hours...

  18. Television Journalism During Terror Attacks

    DEFF Research Database (Denmark)

    Mogensen, Kirsten

    This article views television news coverage of ongoing terrorist attacks and their immediate aftermath as a special genre within journalism, and describes norms connected with the genre. The description is based on qualitative analyses of the coverage on the major American networks in the fi rst ...

  19. Re-Imagining Education Journalism

    Science.gov (United States)

    West, Darrell M.; Whitehurst, Grover J.; Dionne, E.J., Jr.

    2010-01-01

    Education journalism is going through a gut-wrenching transformation of its business model and its organizational structure, even as the ways in which news is delivered are changing rapidly. Old business models have collapsed, and new ones are struggling to find their footing. Digital technologies have fundamentally altered the way news is…

  20. High-impact open access journals

    OpenAIRE

    Vallez, Mari; Pagès i Camps, Gerard

    2014-01-01

    Poster presented in the LIBER 43rd Annual Conference. It is shown the tool "High-impact open access journals ¿" created by the Library of the Universitat Oberta de Catalunya. The tool gives access to open access journals listed in the Directory of Open Access Journals (DOAJ) with impact factor in the Journal Citation Reports 2011 or SCImago Journal Rank. Pòster presentat al LIBER 43rd Annual Conference. Es mostra l'eina "High-impact open access journals" creada per la Biblioteca de ...

  1. Emerging journals: The benefits of and challenges for publishing scientific journals in and by emerging countries

    OpenAIRE

    Meneghini,Rogerio

    2012-01-01

    Emerging countries have established national scientific journals as an alternative publication route for their researchers. However, these journals eventually need to catch up to international standards.

  2. A course in Peace Journalism

    Directory of Open Access Journals (Sweden)

    Jake Lynch

    2007-04-01

    Full Text Available This article sets out a reasoned and annotated plan for a short course in Peace Journalism, suitable for teaching to students of Journalism, Communications, Media and Peace and Conflict Studies. It is based on courses the author has taught, over many years, and the aim of the article is to help teachers to devise their own courses. The best way to help students to begin thinking about issues in the representation of conflicts, the article argues, is to give them a flavour of it, by showing them different ways in which the same story can be told. The article gives story-boards and scripts for two television news treatments of the same event, a bombing in the Philippines. The first is an example of War Journalism, it is argued; the second, Peace Journalism. The article suggests ways to develop a course from this illustrative starting point, to ask why the distinctions between these two approaches should be considered important - both in their own terms, and in terms of their potential influence on the course of events in conflict. Different approaches to conceptualising and measuring this possible influence are discussed, with suggestions for further exploration. The article recounts some of the author's experiences in introducing and discussing what is, inevitably sometimes, difficult and sensitive material, with groups including participants from conflict-affected countries - Palestine, Israel and the Philippines. Not all students will be aspiring journalists. The article offers brief notes on practical Peace Journalism, as well as showing how learning outcomes can be formulated to allow the same issues to be tackled in the form of a civil society campaign, or as a peace-building intervention in conflict. The article also explains how students can be equipped to question elements of journalistic practice which they may take for granted, and which pass unexamined in many current journalism courses. That, in turn, entails examining the emergence

  3. Are claims made in orthodontic journal advertisements evidence-supported?

    OpenAIRE

    Livas, Christos; Kouskoura, Thaleia; Ren, Yijin; Katsaros, Christos; Pandis, Nikolaos

    2015-01-01

    OBJECTIVE To examine the supporting evidence of advertisements published in six leading orthodontic journals. MATERIALS AND METHODS The 2012-2013 printed issues of American Journal of Orthodontics and Dentofacial Orthopedics, Australian Orthodontic Journal, Journal of Orthodontics, European Journal of Orthodontics, Journal of Clinical Orthodontics, and Journal of Orofacial Orthopedics were screened for advertisements implying superior performance compared with competitor products....

  4. Pb-free Sn-Ag-Cu ternary eutectic solder

    Energy Technology Data Exchange (ETDEWEB)

    Anderson, I.E.; Yost, F.G.; Smith, J.F.; Miller, C.M.; Terpstra, R.L.

    1996-06-18

    A Pb-free solder includes a ternary eutectic composition consisting essentially of about 93.6 weight % Sn-about 4.7 weight % Ag-about 1.7 weight % Cu having a eutectic melting temperature of about 217 C and variants of the ternary composition wherein the relative concentrations of Sn, Ag, and Cu deviate from the ternary eutectic composition to provide a controlled melting temperature range (liquid-solid ``mushy`` zone) relative to the eutectic melting temperature (e.g. up to 15 C above the eutectic melting temperature). 5 figs.

  5. Clinical trial registration in oral health journals.

    Science.gov (United States)

    Smaïl-Faugeron, V; Fron-Chabouis, H; Durieux, P

    2015-03-01

    Prospective registration of randomized controlled trials (RCTs) represents the best solution to reporting bias. The extent to which oral health journals have endorsed and complied with RCT registration is unknown. We identified journals publishing RCTs in dentistry, oral surgery, and medicine in the Journal Citation Reports. We classified journals into 3 groups: journals requiring or recommending trial registration, journals referring indirectly to registration, and journals providing no reference to registration. For the 5 journals with the highest 2012 impact factors in each group, we assessed whether RCTs with results published in 2013 had been registered. Of 78 journals examined, 32 (41%) required or recommended trial registration, 19 (24%) referred indirectly to registration, and 27 (35%) provided no reference to registration. We identified 317 RCTs with results published in the 15 selected journals in 2013. Overall, 73 (23%) were registered in a trial registry. Among those, 91% were registered retrospectively and 32% did not report trial registration in the published article. The proportion of trials registered was not significantly associated with editorial policies: 29% with results in journals that required or recommended registration, 15% in those that referred indirectly to registration, and 21% in those providing no reference to registration (P = 0.05). Less than one-quarter of RCTs with results published in a sample of oral health journals were registered with a public registry. Improvements are needed with respect to how journals inform and require their authors to register their trials.

  6. Use of Journal Citation Reports and Journal Performance Indicators in measuring short and long term journal impact.

    Science.gov (United States)

    Garfield, E

    2000-12-01

    The impact factor has become the subject of widespread controversy. It has gradually developed to mean both journal and author impact. The emphasis on impact factors obscures the main purpose of bibliographic databases created at the Institute for Scientific Information. I will here show how two of these databases, Journal Citation Reports and the Journal Performance Indicators, can be used to study scientific journals and the articles they publish, as well as the evolution of scientific fields.

  7. Interactive overlays of journals and the measurement of interdisciplinarity on the basis of aggregated journal-journal citations

    NARCIS (Netherlands)

    Leydesdorff, L.; Rafols, I.; Chen, C.

    2013-01-01

    Using the option Analyze Results with the Web of Science, one can directly generate overlays onto global journal maps of science. The maps are based on the 10,000+ journals contained in the Journal Citation Reports (JCR) of the Science and Social Sciences Citation Indices (2011). The disciplinary di

  8. Influence of microstructure on quasi-static and dynamic mechanical properties of bismuth-containing lead-free solder alloys

    Energy Technology Data Exchange (ETDEWEB)

    Witkin, David B., E-mail: david.b.witkin@aero.org [Materials Science Department, Aerospace Corporation, P.O. Box 92957, Mail Stop M2/242, Los Angeles, CA 90009 2957 (United States)

    2012-01-15

    Highlights: Black-Right-Pointing-Pointer Tensile and dynamic properties of lead-free solder were evaluated. Black-Right-Pointing-Pointer Emphasis on addition of bismuth to alloys and role of isothermal aging. Black-Right-Pointing-Pointer Addition of bismuth increases strength. Black-Right-Pointing-Pointer Strength maintained in Bi-containing alloy after aging, which is opposite of SAC305. Black-Right-Pointing-Pointer Unlike SAC305 damping capacity of Bi-containing changes with aging like SnPb and Sn. - Abstract: The mechanical properties of bulk Pb-free solder alloys containing Bi have been characterized in the as-cast and aged conditions. The alloys were the commercially available Sn-3.4Ag-1.0Cu-3.3Bi and Sn-3.4Ag-4.8Bi (wt.%), which had demonstrated good reliability performance in previous circuit board-level testing programs, but have not been considered for high-volume electronic manufacturing. Room- and elevated-temperature tensile testing showed that the addition of Bi greatly reduced the loss in strength due to aging that occurs in the Sn-Ag-Cu ternary alloys. The room-temperature tensile strength of bulk SAC305 was reduced by 37% after aging at 150 Degree-Sign C for 336 h, but for SAC-Bi the reduction was not statistically meaningful and in SnAg-Bi the tensile strength increased. These differences are attributed to the presence of Bi and its role in solid solution strengthening and precipitation as a separate phase. The damping capacity of the alloys measured by dynamic mechanical analysis showed similar trends, with tan {delta} increasing in aged SAC305 but decreasing in SAC-Bi and SnAg-Bi. The reduction in damping seen in SAC-Bi and SnAg-Bi is consistent with Sn and SnPb eutectic solder, indicating that a general microstructural coarsening is responsible. The increase in damping in SAC305 suggests that the transformation of the ternary eutectic by particle coarsening leads to a continuous {beta}-Sn matrix that contributes to damping.

  9. Editorial: Biotechnology Journal's diverse coverage of biotechnology.

    Science.gov (United States)

    Wink, Michael

    2014-03-01

    This issue of Biotechnology Journal is a regular issue edited by Prof. Michael Wink. The issue covers all the major focus areas of the journal, including medical biotechnology, synthetic biology, and novel biotechnological methods.

  10. Queen's discovery lauded by top scientific journal

    CERN Multimedia

    McGrady, S

    2002-01-01

    A scientific breakthrough at Queen's University's Sudbury Neutrino Observatory has received major international recognition. The journal Science ranked the discovery that cracked the "neutrino problem" second, in the journal's top 10 scientific achievements of 2002 (1/2 page).

  11. Students Must be Taught to Think about Journalism.

    Science.gov (United States)

    Picard, Robert G.

    1985-01-01

    Discusses myths of journalism that are perpetuated in undergraduate journalism classes. Describes techniques for teaching undergraduates to take a more critical stance concerning journalism issues. (HTH)

  12. 1Cr18Ni9Ti不锈钢/Ti6Al4V钛合金真空钎焊工艺研究%Vacuum Brazing of 1Cr18Ni9Ti Stainless Steel and Ti6Al4V Titanium Alloy

    Institute of Scientific and Technical Information of China (English)

    祁凯; 于治水; 李瑞峰

    2011-01-01

    Ti6A14V titanium alloy and lCrl8Ni9Ti stainless steel was vacuum brazed using Ag-Cu-Ti as filler. The interfacial microstructure and element distribution was studied at 790°C ~870 °C for lmin and 3min, respectively. The results show that the width of seam decreases with the increase of brazing temperature and increases with the increase of . Holding time, however, the width of the diffusion layer increases with the increase of brazing temperature. Element Ti determines the formation of inermetallic compounds. The optimal interfacial microstructure can be obtained when brazing at 790 °C for 3 min, no cracks are found in the brazed joint.%采用Ag-Cu-Ti钎料进行Ti6Al4V(TC4)钛合金和1Cr1 8Ni9Ti不锈钢的真空钎焊,观察分析了其在钎焊温度为790~870℃和保温时间为1和3min时钎缝界面微观组织和成分分布.研究结果表明,钎缝宽度随着钎焊温度的升高而降低,随着保温时间的增加而增加;扩散层厚度随着保温时间的增加而增加.Ti是焊缝中反应物多少的决定因素.在钎焊温度790℃,保温3min时能得到较好的焊缝组织,界面无裂纹出现.

  13. A Researcher's Guide to Health Education Journals.

    Science.gov (United States)

    Laflin, Molly T.; Horowitz, Stephen M.; Nims, Julia K.

    1999-01-01

    Developed a tool to help health-education researchers match manuscript submissions with the most appropriate journals. The Delphi method was used to elicit information from health-education leaders/scholars on primary content areas in health education, preeminent journals, and information about the journals. The results include nine categories and…

  14. Journal Writing: Pedagogical Perspectives. [SFC Monograph #3.

    Science.gov (United States)

    Casanave, Christine Pearson, Ed.

    Articles on the use of student journals in high school and college English-as-a-Second-Language instruction, specifically in the Japanese context, include: "Journal Writing and the Damaged Language Learner" (Alan J. McCormick); "Interested?" (Sven G. M. Puetter); "Tradition and the Student Journal" (George Deaux);…

  15. Chinese Journal of Lasers (Selected Articles),

    Science.gov (United States)

    1986-04-22

    Qi Changhong , and Dai Fengmei, Chinese Journal of Physics, Vol. 29, No. 1, 1980, p54. [23) Nd-doped glass heat deformation group, Chinese Journal of...No. 1, 1983, p49. [46] Qi Changhong and Gan Fuxi, Chinese Journal of Optical Emission and Display, No. 3, 1983, pl. [47] Zheng He and Gan Fuxi, Laser

  16. Aerospace—An Open Access Journal

    Directory of Open Access Journals (Sweden)

    Konstantinos Kontis

    2014-11-01

    Full Text Available Welcome to Aerospace, an open journal covering aerospace science, engineering and technology. We seek to publish theoretical, fundamental, and applied results linked to potential applications related to research, design, manufacture, operations, control and maintenance of aircraft and spacecraft. A full description of the journal scope can be found on the journal website [1].[...

  17. Reference List Accuracy in Social Work Journals

    Science.gov (United States)

    Spivey, Christina A.; Wilks, Scott E.

    2004-01-01

    This exploratory study investigated the rate of citation errors in the reference lists of five social work journals. High error rates have been found in journals in fields such as medicine and psychology but have not yet been investigated in social work journals. A stratified, computer-generated random sample was selected (N = 500, 100 per…

  18. AsMA journal covers, a history.

    Science.gov (United States)

    Day, Pamela C

    2014-01-01

    The cover of our journal has changed quite often over the years. As we look forward to changing the name and design of the journal, it seems appropriate to reflect on the previous journal titles and covers. A brief history follows.

  19. Journal Writing: Enlivening Elementary Linear Algebra.

    Science.gov (United States)

    Meel, David E.

    1999-01-01

    Examines the various issues surrounding the implementation of journal writing in an undergraduate linear algebra course. Identifies the benefits of incorporating journal writing into an undergraduate mathematics course, which are supported with students' comments from their journals and their reflections on the process. Contains 14 references.…

  20. Reflective Journals: A Review of the Literature

    Science.gov (United States)

    Lindroth, James T.

    2015-01-01

    The use of reflective journals has been identified as an effective tool to promote reflection in preservice teachers. This review of literature provides the reader with an understanding of the various ways journals are used and assessed in teacher education programs. The findings of this review outline the use of reflective journals on topics such…

  1. Editorial: Journal of Comparative Psychology.

    Science.gov (United States)

    Burghardt, Gordon M

    2006-05-01

    Both continuity and change typically mark the changing of editors at a long-established journal with extended editorial terms. Change is inherent in any dynamic field and is independent of editorship, but editors have an influence that should be wielded in a fair, responsible, judicious, and scientifically rigorous manner, while inevitably reflecting their own perspectives and values. The Journal of Comparative Psychology will continue to publish exciting, fascinating, assessable, controversial, and well-written reports on research, be the topic traditional, interdisciplinary, applied, or one breaking risky new ground. Editorial standards must be high, but appropriate for various subfields, and as editor the author will try to make those judgments carefully. The author would also like to see more submissions of brief reports describing exciting developments as well as submissions on significant theoretical, conceptual, and methodological issues during his tenure as editor.

  2. Narrative journalism as complementary inquiry

    OpenAIRE

    Jørgen Jeppesen; Helle Ploug Hansen

    2011-01-01

    Narrative journalism is a method to craft stories worth reading about real people. In this article, we explore the ability of that communicative power to produce insights complementary to those obtainable through traditional qualitative and quantitative research methods. With examples from a study of journalistic narrative as patient involvement in professional rehabilitation, interview data transcribed as stories are analyzed for qualities of heterogeneity, sensibility, transparency, and ref...

  3. Publishing papers in international journals

    Institute of Scientific and Technical Information of China (English)

    2003-01-01

    @@ INTRODUCTIONThere is increasing pressure for scientists in all countries, including China,to publish their research in international journals.This is necessary for personal careers,as well as for the reputations of universities and other research organizations.Additionally,with the continued growth in international scientific research and the speed with which advances are being made,and active and successful researcher needs to take part in the global circulation of results and information on new technologies.

  4. Deciphering Journal Abbreviations with JAbbr

    OpenAIRE

    Keith Jenkins

    2009-01-01

    JAbbr is an online tool developed at Cornell University to help users decipher journal title abbreviations. This article discusses why these abbreviations are so problematic, and how traditional tools are often insufficient, and then describes the novel approach used by JAbbr. Given an abbreviation, JAbbr creates a regular expression for fuzzy matching, tests it against a list of serial titles extracted from the library catalog, and returns a list of possible matches to the user. JAbbr is ava...

  5. Comparison of Journal Citation Reports and Scopus Impact Factors for Ecology and Environmental Sciences Journals

    Science.gov (United States)

    Gray, Edward; Hodkinson, Sarah Z.

    2008-01-01

    Impact factors for journals listed under the subject categories "ecology" and "environmental sciences" in the Journal Citation Reports database were calculated using citation data from the Scopus database. The journals were then ranked by their Scopus impact factor and compared to the ranked lists of the same journals derived from Journal…

  6. Impact factor trends for general medical journals: non-English-language journals are lagging behind

    DEFF Research Database (Denmark)

    Vinther, Siri; Rosenberg, Jacob

    2012-01-01

    The impact factor (IF) is a common citation metric used for evaluating and comparing scientific journals within a certain field. Previous studies have shown that IFs are increasing. However, rates may depend on journal publication language. The aim of this study was to determine IF values...... and trends for general medical journals, comparing non-English-language with English-language journals....

  7. CERN Library - Scientific journal cancellations

    CERN Multimedia

    2004-01-01

    Due to the constant increase of the subscription costs of scientific journals and the current budget restrictions, the Scientific Information Policy Board has mandated the Working Group for Acquisitions (WGA) together with the Library to propose a list of titles to be cancelled at the end of 2004. As a first step, the WGA has identified the scientific journals listed at the web site below as candidates for cancellation. The choice has been guided by the personal experience of the WGA members, consultation of other expert CERN staff for highly specialized titles, and by criteria such as subscription price, impact factor, and - where available - access statistics for electronic journals. The list also accounts for the fact that many titles are subscribed to in 'packages' such that a cancellation of individual titles would not lead to any cost savings. We invite users to carefully check the list on the Library homepage (http://library.cern.ch/). If you find any title that you consider critically important for y...

  8. Translating VDM to Alloy

    DEFF Research Database (Denmark)

    Lausdahl, Kenneth

    2013-01-01

    . Traditionally, theorem provers are used to prove that specifications are correct but this process is highly dependent on expert users. Alternatively, model finding has proved to be useful for validation of specifications. The Alloy Analyzer is an automated model finder for checking and visualising Alloy...... specifications. However, to take advantage of the automated analysis of Alloy, the model-oriented VDM specifications must be translated into a constraint-based Alloy specifications. We describe how a sub- set of VDM can be translated into Alloy and how assertions can be expressed in VDM and checked by the Alloy...

  9. Journal of Molecular Structure: THEOCHEM

    OpenAIRE

    Fuks, D.; Mundim, K.C.; Malbouisson, L.A.C.; Berner, A.; Dorfman, S.; Ellis, D. E.

    2001-01-01

    Texto completo: acesso restrito. p. 199–214 The effects of interstitial carbon on the diffusion and mechanical properties of copper and silver are studied theoretically. Semiempirical methodology, atomistic simulations, and first-principles density functional schemes are combined to extract some understanding of the diffusion process and lattice reconstruction in extremely dilute interstitial Cu–C and Ag–C alloys. It is demonstrated that carbon inclusion in the host matrix leads to suffici...

  10. CytoJournal joins 'open access' philosophy

    Directory of Open Access Journals (Sweden)

    Shidham Vinod B

    2004-07-01

    Full Text Available Abstract Welcome to CytoJournal! We would like to introduce you to your journal, one that is run by and for the scientific cytopathology community with incontestable benefits of Open Access, and support from Cytopathology Foundation, Inc. http://www.cytopathology-foundation.org/index.htmlCytoJournal is a peer-reviewed, PubMed indexed, online journal, publishing research in the field of cytopathology and related areas, with world wide free access. Authors submitting to CytoJournal retain the copyright to their hard earned work.

  11. Frequently cited journals in forensic psychology.

    Science.gov (United States)

    Black, Steve

    2012-02-01

    Works cited in six forensic psychology journals published 2008-2010 were counted to identify the most frequently cited journals. The sample of works cited (N = 21,776) was not a definitive ranked list of important journals in forensic psychology, but was large enough to indicate high-impact journals. The list of frequently cited publications included more general psychiatry and psychology journals than titles specific to forensic psychology. The implications of the proportion of general versus specific titles for collections supporting research in forensic psychology were discussed.

  12. Making room for pluralism by redefining journalism

    DEFF Research Database (Denmark)

    Meyer, Gitte; Lund, Anker Brink

    2006-01-01

    Motivated by the ideal of pluralism, this essay explores an apparent paradox: although many different kinds of journalism may have evolved, because journalism is only vaguely defined by connections to ‘the media' and ‘news', there is a trend towards increasing journalistic standardization....... It is proposed that this standardization represents attempts to rationalize journalism. But rationalism is a framework of thought which is alien to journalism and to political life in general, it is argued. As an alternative framework for the philosophy and practice of journalism, the classical notions of praxis...

  13. Effect of HEDTA on codeposition of tin-silver-copper ternary alloy from methanesulfonate bath%HEDTA对甲基磺酸盐镀液中锡-银-铜三元合金共沉积的影响

    Institute of Scientific and Technical Information of China (English)

    高学朋; 张莹莹; 贺岩峰

    2013-01-01

    以HEDTA(N-β-羟乙基乙二胺三乙酸)为主配位剂,通过极化曲线测量、电感耦合等离子体发射光谱、表面形貌分析和X射线衍射谱分析等技术研究了甲基磺酸盐镀液中HEDTA含量对Sn-Ag-Cu三元合金共沉积的影响.镀液的基础组成和工艺条件为:Sn(CH3SO3)2 0.18 mol/L,Ag2O 0.006 mol/L,Cu(CH3SO3)2 0.001 2 mol/L,硫脲0.06 mol/L,烷基糖苷(APG)1 g/L,pH 4.0 ~ 6.0,温度25℃,电流密度7 mA/cm2,时间30 min.结果表明,随镀液中HEDTA含量的增加,Sn-Ag-Cu的沉积电位负移;但n(HEDTA)∶[Sn (Ⅱ)]大于2.2∶1.0时,HEDTA才可满足一定的配位要求,使沉积电位产生足够大的负移.镀液中HEDTA含量为0.6 ~ 1.2 mol/L,即n(HEDTA)∶n[Sn (Ⅱ)]为(3.3 ~ 6.7)∶1.0时,HEDTA的含量对镀层组成影响不大,所得Sn-Ag-Cu合金镀层结晶细致,表面平整、均匀,主要由Sn、Ag3Sn和Cu6Sn5组成.此外,随镀液中HEDTA含量的变化,镀层的结晶取向发生变化.%The effect of the content of primary complexing agent HEDTA [W-(β-hydroxyethyl)ethylendiamine triacetic acid] on codeposition of Sn-Ag-Cu ternary alloy in methanesulfonate bath was studied by polarization curve measurement, inductively coupled plasma emission spectroscopy, surface morphology observation, and X-ray diffraction analysis. The basic bath compositions and process parameters are as follows: Sn(CH3SO3)20.18 mol/L, Ag2O 0.006 mol/L, Cu(CH3SO3)2 0.001 2 mol/L, thiourea 0.06 mol/L, alkyl glycosides (APG) 1 g/L, pH 4.0-6.0, temperature 25 ℃, current density 7 mA/cm2, and time 30 min. The results show that the deposition potential shifts towards negative as the HEDTA content in bath increases. However, only when the molar ratio of HEDTA to Sn(Ⅱ) is above 2.2:1.0, can HEDTA meet the complexation requirement and make the deposition potential shift towards negative enough. When the HEDTA content in bath is 0.6-1.2 mol/L, that is the molar ratio of HEDTA to Sn(Ⅱ) equals to (3.3-6.7): 1.0, HEDTA content

  14. 急冷型Sn-Ag-Cu系钎料钎焊接头力学性能与显微组织%Study on the mechanical properties and microstructure of soldering joints with down quenching Sn-Ag-Cu solder alloy foil

    Institute of Scientific and Technical Information of China (English)

    张鑫; 张柯柯; 涂益民; 熊毅

    2010-01-01

    采用单辊法制备了急冷型Sn-Ag-Cu系钎料合金,在对其进行熔化温度特性和XRD分析检测后,进行了钎焊工艺试验,并对所得接头的抗剪强度和显微组织进行了测试分析,研究了钎焊温度对接头组织性能的影响.结果表明:在不同的钎焊温度条件下,接头界面处金属间化合物的形成及分布是不同的,并由此导致了接头抗剪强度的变化.

  15. Effect of Alloying Elements Cr, Al on High-Temperature Oxidation Resistance and Wettability of Sn-Ag-Cu Based Lead-Free Solder%合金元素Cr,Al对Sn-Ag-Cu基无铅钎料高温抗氧化和润湿性的影响

    Institute of Scientific and Technical Information of China (English)

    刘静; 张富文; 徐骏; 杨福宝; 朱学新

    2006-01-01

    研究了少量合金元素Cr, Al对 Sn-3.0Ag-0.5Cu(305)无铅钎料高温抗氧化性的影响. 钎料在液态下的表面颜色变化以及热重分析表明, Cr, Al能明显改善305合金钎料的抗氧化性能. 通过合金元素Cr, Al的抗氧化机制和X 射线衍射分析得出: Al和Cr在钎料表面形成致密氧化膜, 形成"阻挡层", 抑制了钎料的氧化. 同时也比较了合金元素Cr, Al对 305钎料润湿性能的影响, 结果表明: 单独加Al不利于钎料的铺展, 少量的Cr和Al同时加入对钎料的铺展没有太大的影响. 实验证实: Cr和Al的共同作用明显提高了Sn-3.0Ag-0.5Cu 钎料的高温抗氧化性, 同时对钎料的润湿性也没有恶化作用.

  16. La对Sn-Ag-Cu无铅钎料与铜钎焊接头金属间化合物的影响%Effect of La on intermetallic compounds of Sn-Ag-Cu lead-free alloy soldered with copper

    Institute of Scientific and Technical Information of China (English)

    周迎春; 潘清林; 李文斌; 梁文杰; 何运斌; 李运春; 路聪阁

    2008-01-01

    研究微量稀土La在钎焊和时效过程中对Sn-3.0Ag-0.5Cu无铅钎料与铜基板的钎焊界面及钎料内部金属间化合物(IMC)的形成与生长行为的影响.结果表明:钎焊后钎焊界面形成连续的扇形Cu6Sn5化合物层,其厚度随La含量的增加而减小;在150℃时效100h后,连续的Cu3Sn化合物层在Cu6Sn5化合物层和铜基板之间析出,且Cu6Sn5层里嵌有Ag3Sn颗粒;界面金属间化合物总厚度随时效时间的延长而增厚,且在相同时效条件下随La含量的增加而减小;时效过程中金属间化合物生长动力学的时间系数(n)随着La含量的增加逐渐增大;钎焊后钎料内部Ag仍以共晶形式存在,时效后Ag3Sn颗粒沿钎料内部的共晶组织网络析出.

  17. 温度对Ag-Cu合金钎焊陶瓷透氧膜的界面反应和连接性能影响的研究%The effect of temperature on the interface reaction and connectivity between Ag-Cu alloy braze and ceramic oxygen-permeable membrane

    Institute of Scientific and Technical Information of China (English)

    刘蛟; 张玉文; 刘旭; 丁伟中

    2011-01-01

    The sessile drop wetting experiment and joint strength test was conducted to study the Ag-3.3mol% Cu air brazing BaCo0.7Fe0.2Nb0.1O3-δ(BCFNO) mixed-conducting membranes for oxygen. The results indicate that the filler has good wetting property to the substrate; with the temperature increasing the wetting angle decreases and the joining strength increases. Controlling the brazing temperature over the monotectic reaction temperature within a certain range, the CuO-rich liquid reacting with BCFNO playing the role of pre-wetting and forming a reaction layer is beneficial to the improvement of the interface joining strength. Then the interface joining strength of joints can reach 65 % of ceramic membranes substrate, fracture occurs mainly in the interface layer between the ceramic substrate and the filler metal.%利用座滴法润湿实验和连接强度测试对Ag-3.3%(摩尔分数)Cu空气钎焊BaCo(0.7)Fe(0.2)Nb(0.1)O(3-8)(BCFNO)混合导体透氧膜陶瓷进行研究.结果表明,此钎料能够很好的润湿BCFNO透氧膜陶瓷,且随着温度的升高润湿角逐渐减小,钎焊界面的连接强度升高.当钎焊温度控制在偏晶反应温度以上一定范围内时,富CuO的液相对BCFNO起到了预润湿作用并形成1层反应层,有利于界面连接强度的提高.这时的界面连接强度可以达到透氧膜陶瓷抗弯强度的65%,断裂主要发生在钎料与陶瓷基界面间的反应层内.

  18. Women's Involvement in Educational Psychology Journals from 1976 to 2004

    Science.gov (United States)

    Evans, Joy; Hsieh, Peggy Pei-Hsuan; Robinson, Daniel H.

    2005-01-01

    Previously, Robinson, McKay, Katayama, and Fan (1998) examined women's involvement in six educational psychology journals ("American Educational Research Journal," "Contemporary Educational Psychology," "Educational Psychologist," "Educational Psychology Review," "Journal of Experimental Education," and "Journal of Educational Psychology") from…

  19. Are claims made in orthodontic journal advertisements evidence-supported?

    NARCIS (Netherlands)

    Livas, Christos; Kouskoura, Thaleia; Ren, Yijin; Katsaros, Christos; Pandis, Nikolaos

    2015-01-01

    Objective: To examine the supporting evidence of advertisements published in six leading orthodontic journals. Materials and Methods: The 2012-2013 printed issues of American Journal of Orthodontics and Dentofacial Orthopedics, Australian Orthodontic Journal, Journal of Orthodontics, European Journa

  20. [Journal usage at the Andrija Stampar library].

    Science.gov (United States)

    Teuber, Marina; Kuri, Zdenka; Bozikov, Jadranka

    2002-09-01

    Development of journal collection in the Andrija Stampar library is presented. Research of loaned and photocopied journals was performed in order to evaluate circulation of journals in 2001. There were 1057 titles of journals in the Library, 77 were secondary journals and they were excluded from the study. 346 different titles were used 5204 times, out of which 236 were current titles. There were 11 titles used more than 100 times. Journal of Clinical Microbiology was the highest ranking journal. The greatest number of users were from the School of Public Health Andrija Stampar. Most important users of the Library were hospitals, universities, institutions, institutes of public health from Zagreb and all parts of Croatia. More recent journals were used more frequently than the old ones. Decrease of journal usage in the Library has been noticed in recent years. The reason for that are the possibilities of using full text electronic journals either through free access, or through combined subscriptions. The access to electronic journals is possible through more and more affordable subscriptions from the big publishers.

  1. Exploring overlay journals: the RIOJA project

    CERN Document Server

    CERN. Geneva

    2007-01-01

    Researchers in cosmology and astrophysics depend on the arXiv repository for the registration and dissemination of their work, as well as for current awareness, yet they continue to submit papers to journals for review. Could rapid quality certification be overlaid directly onto the arXiv repository? This presentation introduces the RIOJA (Repository Interface to Overlaid Journal Archives) project, on which a group of cosmology researchers from the UK is working with UCL Library Services and Cornell University. The project is creating a tool to support the overlay of journals onto repositories, and will demonstrate a cosmology journal overlaid on top of arXiv. RIOJA will also work with the cosmology community to explore the social and economic aspects of journal overlay in this discipline: what other value, besides the quality stamp, does journal publication typically add? What are the costs of the ideal overlay journal for this community, and how could those costs be recovered? Would researchers real...

  2. Perilous terra incognita--open-access journals.

    Science.gov (United States)

    Balon, Richard

    2014-04-01

    The author focuses on a new rapidly spreading practice of publication in open-access journals. The pros and cons of open-access journals are discussed. Publishing in these journals may be cost prohibitive for educators and junior faculty members. Some authors may be lured by the ease of publishing in open-access journals (and their, at times, inflated self-description, e.g., "international", "scientific"), and their possibly valuable contributions will escape the attention of Academic Psychiatry readership in the vast sea of open-access journals. The readership may be flooded with a large number of low-quality articles (maybe not even properly peer-reviewed) from open-access journals. It may take some time to sort out what is and what is not relevant and useful. Open-access publishing represents a problematic and controversial practice and may be associated with a conflict of interest for the editors and publishers of these journals.

  3. Journal Of The Korean Hydrogen Energy Society 3

    Energy Technology Data Exchange (ETDEWEB)

    NONE

    2001-11-15

    This book is the Journal of the Korean hydrogen energy society, which includes study on the improvement of the electrochemical characteristics of surface-modified V-Ti-Cr alloy by Ball-milling by Kim, Jin Ho; Lee, Sang Min; Lee, Ho; Lee, Paul S. and Lee, Jai Young, hydrogen generation from water using cds-zns photocatalysts by Heo, Gwi Suk, characteristics of Y-Hx Film by Cho, Young Sin; Kim, Sun Hee, and effect of Cu powder as a compacting material on the discharge characteristics of the negative electrode of Ni-MH battery by Jung, J. H.; Han, Y. S.; Yu, J. S.; Jang, K. J.; Lee, J. Y.

  4. Data compilation diffusion in ferrous alloys

    CERN Document Server

    Fisher, David J

    2006-01-01

    This issue comprises an extensive body of selected data, on diffusion in iron-based materials, gleaned from research published in leading journals during the past 70 years. The materials covered range from the almost-pure metal, to high-alloy steels (including metallic glasses) and the data reflect the effect of special conditions (thin films, strain, etc.) upon bulk, surface and pipe diffusion.This publication will constitute an invaluable first port-of-call for anyone looking for a quick guide as to the extent of diffusion which is to be expected to occur during any research project or indus

  5. Alloy Fabrication Laboratory

    Data.gov (United States)

    Federal Laboratory Consortium — At NETL’s Alloy Fabrication Facility in Albany, OR, researchers conduct DOE research projects to produce new alloys suited to a variety of applications, from gas...

  6. Microstructure, mechanical, and thermal properties of the Sn-1Ag-0.5Cu solder alloy bearing Fe for electronics applications

    Energy Technology Data Exchange (ETDEWEB)

    Shnawah, Dhafer Abdul-Ameer, E-mail: dhafer_eng@yahoo.com [Department of Mechanical Engineering, University of Malaya, 50603 Kuala Lumpur (Malaysia); Said, Suhana Binti Mohd [Department of Electrical Engineering, University of Malaya, 50603 Kuala Lumpur (Malaysia); Sabri, Mohd Faizul Mohd; Badruddin, Irfan Anjum [Department of Mechanical Engineering, University of Malaya, 50603 Kuala Lumpur (Malaysia); Che Faxing [Institute of Microelectronics, A-STAR (Agency for Science, Technology and Research), 11 Science Park Road, Singapore Science Park II, Singapore 117685 (Singapore)

    2012-08-15

    This work investigates the effect of Fe addition on the microstructural, mechanical, and thermal properties of the Sn-1Ag-0.5Cu (SAC105) solder alloy. The addition of Fe leads to the formation of large circular FeSn{sub 2} intermetallic compound (IMC) particles, which produce a weak interface with the {beta}-Sn matrix. The addition of Fe also leads to the inclusion of Fe in the Ag{sub 3}Sn and Cu{sub 6}Sn{sub 5} IMC particles. Moreover, Fe-bearing solders have been shown to form large primary {beta}-Sn grains. The weak interface between the large FeSn{sub 2} IMC particles and the {beta}-Sn matrix together with the presence of the large primary {beta}-Sn grains results in a significant reduction on the elastic modulus and yield strength of the Fe-bearing solders. Moreover, the improved plasticity of the large primary {beta}-Sn grains causes the Fe-bearing solders to exhibit large total elongation. The addition of Fe also significantly reduces the effect of aging. After aging at 100 Degree-Sign C and 180 Degree-Sign C, it has been observed that the Fe-bearing solders significantly suppress the coarsening of the Ag{sub 3}Sn IMC particles; consequently, they exhibit stable mechanical properties. This effect can be attributed to the inclusion of Fe in the Ag{sub 3}Sn IMC particles. In addition, fracture surface analysis indicates that the addition of Fe to the SAC105 solder alloy does not affect the mode of fracture, and all tested solders exhibited large ductile-dimples on the fracture surface. Moreover, the addition of Fe did not produce any significant effect on the melting behavior. As a result, the use conditions of the Fe-bearing solders are consistent with the conditions for conventional Sn-Ag-Cu solder alloys.

  7. F-Alloy: An Alloy Based Model Transformation Language

    OpenAIRE

    Gammaitoni, Loïc; Kelsen, Pierre

    2015-01-01

    Model transformations are one of the core artifacts of a model-driven engineering approach. The relational logic language Alloy has been used in the past to verify properties of model transformations. In this paper we introduce the concept of functional Alloy modules. In essence a functional Alloy module can be viewed as an Alloy module representing a model transformation. We describe a sublanguage of Alloy called F-Alloy that allows the specification of functional Alloy modules. Module...

  8. PLUTONIUM-THORIUM ALLOYS

    Science.gov (United States)

    Schonfeld, F.W.

    1959-09-15

    New plutonium-base binary alloys useful as liquid reactor fuel are described. The alloys consist of 50 to 98 at.% thorium with the remainder plutonium. The stated advantages of these alloys over unalloyed plutonium for reactor fuel use are easy fabrication, phase stability, and the accompanying advantuge of providing a means for converting Th/sup 232/ into U/sup 233/.

  9. New journal on biological frontiers

    Institute of Scientific and Technical Information of China (English)

    Weihua WU

    2010-01-01

    @@ Frontiers in Biology, an international peer-reviewed scientific journal to be published bi-monthly, is launched today. It is jointly published by Higher Education Press and Springer. The joumal provides a forum for a broad blend of peer-reviewed articles to promote rapid communication and exchanges among biologists around the world. The primary criterion for publication is new insights that are of broad interest to biologists, not just specialists, and the presentation of results must be appropriate to a wide audience of biologists.

  10. Deciphering Journal Abbreviations with JAbbr

    Directory of Open Access Journals (Sweden)

    Keith Jenkins

    2009-06-01

    Full Text Available JAbbr is an online tool developed at Cornell University to help users decipher journal title abbreviations. This article discusses why these abbreviations are so problematic, and how traditional tools are often insufficient, and then describes the novel approach used by JAbbr. Given an abbreviation, JAbbr creates a regular expression for fuzzy matching, tests it against a list of serial titles extracted from the library catalog, and returns a list of possible matches to the user. JAbbr is available as a web site and as a web service.

  11. Trends in impact factors of ophthalmology journals

    Directory of Open Access Journals (Sweden)

    Igor Vainer

    2016-01-01

    Full Text Available Purpose: To test whether there is an association between the growth in the number of ophthalmic journals in the past years and their mean and maximum impact factor (IF as a common sign of scientific proliferation. Methods: Using data from the 2013 Journal Citation Report database a study of the major clinical medical fields was conducted to assess the correlation between the number of journals and maximum IF in a given field in the year 2013. In the field of ophthalmology, we examined the correlation between year, number of journals, mean IF and maximum IF in the field of ophthalmology throughout the years 2000–2013. Results: In the major medical fields, a positive correlation was found between the number of journals and the maximum IF (quadratic R2 = 0.71, P< 0.001. When studying the field of ophthalmology a positive correlation between the number of journals and mean IF (R2 = 0.84, P< 0.001 and between number of journals and maximum IF (R2 = 0.71, P< 0.001 was detected. Conclusions: Our findings suggest that the variation in the IF can be explained by the number of journals in the field of ophthalmology. In the future, the formation of additional ophthalmology journals is likely to further increase the IFs of existing journals.

  12. Mining Related Articles for Automatic Journal Cataloging

    Directory of Open Access Journals (Sweden)

    Yuqing Mao

    2016-06-01

    Full Text Available Purpose: This paper is an investigation of the effectiveness of the method of clustering biomedical journals through mining the content similarity of journal articles. Design/methodology/approach: 3,265 journals in PubMed are analyzed based on article content similarity and Web usage, respectively. Comparisons of the two analysis approaches and a citation-based approach are given. Findings: Our results suggest that article content similarity is useful for clustering biomedical journals, and the content-similarity-based journal clustering method is more robust and less subject to human factors compared with the usage-based approach and the citation-based approach. Research limitations: Our paper currently focuses on clustering journals in the biomedical domain because there are a large volume of freely available resources such as PubMed and MeSH in this field. Further investigation is needed to improve this approach to fit journals in other domains. Practical implications: Our results show that it is feasible to catalog biomedical journals by mining the article content similarity. This work is also significant in serving practical needs in research portfolio analysis. Originality/value: To the best of our knowledge, we are among the first to report on clustering journals in the biomedical field through mining the article content similarity. This method can be integrated with existing approaches to create a new paradigm for future studies of journal clustering.

  13. Online Journals Influence amongst Iranian Universities

    Directory of Open Access Journals (Sweden)

    Mohammad Amin Mahdavi

    2013-12-01

    Full Text Available Ranking is one of the key measures for evaluating universities. Progress of research at universities is often measured by the rate of its publications. It is also common knowledge in the field of research that journal publications owe their success to their impact factor. However, one of the contributing factors that affect a journal's impact factor is the accessibility and availability of its content. The law of statistics suggests that publishing an electronic version of the journal content through online publications is likely to boost the visibility of a journal; hence, improving the impact factor. The ability to publish electronically is often received favorably by the research community. Despite advances in electronic journal publishing, only recently, online journals have made their way into Iranian university journal publishing. This paper evaluates and reports on the extent of online journal publications among Iranian universities. For the purposes of this study, 653 journals published by 183 universities were studied. The results reveal that 66.7% of all universities have online copies of their journals. This study is carried out for three categories of universities; the Ministry of Health and medical Education universities, the Ministry of Science, Research, and Technology universities (MSRT, and Islamic Azad University Branches (IAU.

  14. The Dynamics of Triads in Aggregated Journal-Journal Citation Relations: Specialty Developments at the Above-Journal Level

    OpenAIRE

    2015-01-01

    Dyads of journals related by citations can agglomerate into specialties through the mechanism of triadic closure. Using the Journal Citation Reports 2011, 2012, and 2013, we analyze triad formation as indicators of integration (specialty growth) and disintegration (restructuring). The strongest integration is found among the large journals that report on studies in different scientific specialties, such as PLoS ONE, Nature Communications, Nature, and Science. This tendency towards large-scale...

  15. Losses of Superconductor Journal Bearing

    Science.gov (United States)

    Han, Y. H.; Hull, J. R.; Han, S. C.; Jeong, N. H.; Oh, J. M.; Sung, T. H.

    2004-06-01

    A high-temperature superconductor (HTS) journal bearing was studied for rotational loss. Two HTS bearings support the rotor at top and bottom. The rotor weight is 4 kg and the length is about 300 mm. Both the top and bottom bearings have two permanent magnet (PM) rings with an iron pole piece separating them. Each HTS journal bearing is composed of six pieces of superconductor blocks of size 35×25×10 mm. The HTS blocks are encased in a cryochamber through which liquid nitrogen flows. The inner spool of the cryochamber is made from G-10 to reduce eddy current loss, and the rest of the cryochamber is stainless steel. The magnetic field from the PM rings is < 10 mT on the stainless part. The rotational drag was measured over the same speed range at several chamber pressures. Results indicate that a chamber pressure of 0.4 mtorr is sufficiently low to minimize windage loss, and the 10 mT design criterion for the magnetic field on the stainless part of the cryochamber is too high.

  16. High strength alloys

    Energy Technology Data Exchange (ETDEWEB)

    Maziasz, Phillip James [Oak Ridge, TN; Shingledecker, John Paul [Knoxville, TN; Santella, Michael Leonard [Knoxville, TN; Schneibel, Joachim Hugo [Knoxville, TN; Sikka, Vinod Kumar [Oak Ridge, TN; Vinegar, Harold J [Bellaire, TX; John, Randy Carl [Houston, TX; Kim, Dong Sub [Sugar Land, TX

    2010-08-31

    High strength metal alloys are described herein. At least one composition of a metal alloy includes chromium, nickel, copper, manganese, silicon, niobium, tungsten and iron. System, methods, and heaters that include the high strength metal alloys are described herein. At least one heater system may include a canister at least partially made from material containing at least one of the metal alloys. At least one system for heating a subterranean formation may include a tubular that is at least partially made from a material containing at least one of the metal alloys.

  17. High strength alloys

    Science.gov (United States)

    Maziasz, Phillip James; Shingledecker, John Paul; Santella, Michael Leonard; Schneibel, Joachim Hugo; Sikka, Vinod Kumar; Vinegar, Harold J.; John, Randy Carl; Kim, Dong Sub

    2012-06-05

    High strength metal alloys are described herein. At least one composition of a metal alloy includes chromium, nickel, copper, manganese, silicon, niobium, tungsten and iron. System, methods, and heaters that include the high strength metal alloys are described herein. At least one heater system may include a canister at least partially made from material containing at least one of the metal alloys. At least one system for heating a subterranean formation may include a tublar that is at least partially made from a material containing at least one of the metal alloys.

  18. Citation analysis of Journal of Documentation

    Directory of Open Access Journals (Sweden)

    Navneet Kaur

    2011-06-01

    Full Text Available Citation analysis of all the journal articles published in the Journal of Documentation from 1996-2010 is carried out. 487 articles are published in the journal during 15 years. Highest numbers (44 of articles are published in the year 2005. The journal contained 15587 citations from 1996-2010. Average number of citation per article is maximum in the year 2009. This study also covers the analyses of authorship patterns in citing article. In authorship pattern, single author citations are dominant than others and it is 201 (49%. This study also reveals that Journal of Documentation is the most preferred journal used by authors in their citation. The paper concludes that only 10 core periodicals can cover more than 2951 (16 % references.

  19. A history of the Journal of Parasitology.

    Science.gov (United States)

    Esch, Gerald; Desser, Sherwin; Nickol, Brent

    2014-02-01

    The present issue is Number 1 of Volume 100, The Journal of Parasitology. All 6 numbers of this, our Centennial Volume, are dedicated to those in the past who have contributed in any manner to the Journal's success as a national and international broker for parasitology. Our essay on the history of the Journal is divided into 3 parts. The first extends from 1914 to 1932, i.e., 'the beginning', when Henry Baldwin Ward was Editor and owned the Journal. The 'middle years' continue from 1933, when Ward gave the Journal to the American Society of Parasitologists, to 1961. The 'current period' carries on from 1961 to the present, our Centennial year. Obviously, we cannot provide a great many specific details for each era, but we have made an effort to identify some of the events, issues, and people that have played a significant role in our Journal's history.

  20. Creep Resistant Zinc Alloy

    Energy Technology Data Exchange (ETDEWEB)

    Frank E. Goodwin

    2002-12-31

    This report covers the development of Hot Chamber Die Castable Zinc Alloys with High Creep Strengths. This project commenced in 2000, with the primary objective of developing a hot chamber zinc die-casting alloy, capable of satisfactory service at 140 C. The core objectives of the development program were to: (1) fill in missing alloy data areas and develop a more complete empirical model of the influence of alloy composition on creep strength and other selected properties, and (2) based on the results from this model, examine promising alloy composition areas, for further development and for meeting the property combination targets, with the view to designing an optimized alloy composition. The target properties identified by ILZRO for an improved creep resistant zinc die-casting alloy were identified as follows: (1) temperature capability of 1470 C; (2) creep stress of 31 MPa (4500 psi); (3) exposure time of 1000 hours; and (4) maximum creep elongation under these conditions of 1%. The project was broadly divided into three tasks: (1) Task 1--General and Modeling, covering Experimental design of a first batch of alloys, alloy preparation and characterization. (2) Task 2--Refinement and Optimization, covering Experimental design of a second batch of alloys. (3) Task 3--Creep Testing and Technology transfer, covering the finalization of testing and the transfer of technology to the Zinc industry should have at least one improved alloy result from this work.

  1. Biocompatibility of dental alloys

    Energy Technology Data Exchange (ETDEWEB)

    Braemer, W. [Heraeus Kulzer GmbH and Co. KG, Hanau (Germany)

    2001-10-01

    Modern dental alloys have been used for 50 years to produce prosthetic dental restorations. Generally, the crowns and frames of a prosthesis are prepared in dental alloys, and then veneered by feldspar ceramics or composites. In use, the alloys are exposed to the corrosive influence of saliva and bacteria. Metallic dental materials can be classified as precious and non-precious alloys. Precious alloys consist of gold, platinum, and small amounts of non-precious components such as copper, tin, or zinc. The non-precious alloys are based on either nickel or cobalt, alloyed with chrome, molybdenum, manganese, etc. Titanium is used as Grade 2 quality for dental purposes. As well as the dental casting alloys, high purity electroplated gold (99.8 wt.-%) is used in dental technology. This review discusses the corrosion behavior of metallic dental materials with saliva in ''in vitro'' tests and the influence of alloy components on bacteria (Lactobacillus casei and Streptococcus mutans). The test results show that alloys with high gold content, cobalt-based alloys, titanium, and electroplated gold are suitable for use as dental materials. (orig.)

  2. Fatigue Crack Initiation and Propagation of Aluminum Alloy Bearings

    Institute of Scientific and Technical Information of China (English)

    CHENG Xian-Hua; MA Yan-Yan

    2004-01-01

    Observation of fatigue crack initiation and propagation during fatigue test in ALSn20Cu bearing has been presented. Journal center orbit, oil film pressure and stress distribution in alloy layer have been calculated and are taken as the basis for theoretically simulating the bearing fatigue process. It is found that the calculated results are in good accordance with the experimental results, which provides a feasible way for investigation of fatigue crack propagation process in the bearing.

  3. Why a new journal on animal science

    OpenAIRE

    Rosanna Scipioni

    2010-01-01

    The publication of the first issue of the Italian Journal of Animal Science marks two important events for the Associazione Scientifica di Produzione Animale -ASPA- (Italian Scientific Association of Animal Production): the birth of a new scientific journal in English and the end of the publication in Italian of the remarkable journal Zootecnica e Nutrizione Animale, which was started in 1975, as the official organ of the Association.

  4. Italian Journal of Animal Science - Presentation

    OpenAIRE

    Vincenzo Russo

    2010-01-01

    The publication of the first issue of the Italian Journal of Animal Science marks two important events for the Associazione Scientifica di Produzione Animale -ASPA- (Italian Scientific Association of Animal Production): the birth of a new scientific journal in English and the end of the publication in Italian of the remarkable journal Zootecnica e Nutrizione Animale, which was started in 1975, as the official organ of the Association.

  5. An overview of Chilean Marine Sciences Journals

    OpenAIRE

    2005-01-01

    The work provides a global vision of Chilean marine sciences journals, besides the problems that have existed in relation to their edition and publication. In spite of being serious publications with rich scientific content related to the study area, mainly along the coast of the eastern South Pacific, these journals have not reached the expected levels to be considered within the ISI system journals. With the purpose of obtaining an objective appreciation in regard to the presentation format...

  6. Journalism studies in Argentina: background and questions

    OpenAIRE

    Adriana Amado; Natalia Pizzolo

    2014-01-01

    This article summarizes the background of empirical journalism studies in Argentina.  In recent publications, researchers have consistently underscored the lack of data on the profession and the scarce development of theoretical frameworks related to journalism studies.  The local investigations have prioritized approaches and methods that do not give the whole picture of the population of journalists. Most of the research tends to equate media analysis and media messages with journalism stud...

  7. The Crop Journal Calls for Papers

    Institute of Scientific and Technical Information of China (English)

    2014-01-01

    <正>We would like to invite you to submit your latest research accomplishments to The Crop Journal(ISSN:2095-5421;Online ISSN:2214-5141,CN 10-1112/S),a new bimonthly academic journal co-sponsored by the Crop Science Society of China and the Institute of Crop Science,Chinese Academy of Agricultural Sciences.The Crop Journal is freely available online(Open Access)in ScienceDirect.

  8. The Crop Journal Calls for Papers

    Institute of Scientific and Technical Information of China (English)

    2014-01-01

    <正>We would like to invite you to submit your latest research accomplishments to The Crop Journal(ISSN:2095-5421;Online ISSN:2214-5141,CN 10-1112/S),a new bimonthly academic journal co-sponsored by the Crop Science Society of China and the Institute of Crop Science,Chinese Academy of Agricultural Sciences.The Crop Journal is freely available online(Open Access)in ScienceDirect.The Editor-in-Chief of

  9. The Crop Journal Calls for Papers

    Institute of Scientific and Technical Information of China (English)

    2013-01-01

    <正>We would like to invite you to submit your latest research accomplishments to The Crop Journal(ISSN:2095-5421;Online ISSN:2214-5141,CN 10-1112/S),a new bimonthly academic journal co-sponsored by the Crop Science Society of China and the Institute of Crop Science,Chinese Academy of Agricultural Sciences.The Crop Journal is freely available online(Open Access)in ScienceDirect.

  10. The Crop Journal Calls for Papers

    Institute of Scientific and Technical Information of China (English)

    2015-01-01

    <正>We would like to invite you to submit your latest research accomplishments to The Crop Journal(ISSN:2095-5421;Online ISSN:2214-5141,CN 10-1112/S),a new bimonthly academic journal co-sponsored by the Crop Science Society of China and the Institute of Crop Science,Chinese Academy of Agricultural Sciences.The Crop Journal is freely available online(Open Access)in ScienceDirect.The Editor-in-Chief

  11. The Academic Journal: Has it a Future?

    OpenAIRE

    Gaby Weiner

    2001-01-01

    This article examines the current state of the academic journal. It does so for a number of reasons: the increasing expense of paper journals; the advent of electronic publishing; the use of publication in journals as an indicator of research quality (in addition to disseminating knowledge within a discipline) and consequent criticisms of systems of peer review and evaluation of scholarship; emergent issues of equity and access; and evidence of malpractice. These issues taken together constit...

  12. [The Journals role in continuing medical education].

    Science.gov (United States)

    Ramiro-H, Manuel; Cruz-A, J Enrique

    2017-01-01

    In the 19th century, the first journals in medicine appeared in order to disseminate knowledge among creators and discoverers, but especially among users of knowledge, some of these journals continue to be published nowadays. Subsequently, an organization that initially aspired to collect, sort, archive and distribute the publications: the Index Medicus. Over time, it was imperative to create indexes that measure the performance of journals and with that of researchers.

  13. Italian Journal of Animal Science - Presentation

    Directory of Open Access Journals (Sweden)

    Vincenzo Russo

    2010-01-01

    Full Text Available The publication of the first issue of the Italian Journal of Animal Science marks two important events for the Associazione Scientifica di Produzione Animale -ASPA- (Italian Scientific Association of Animal Production: the birth of a new scientific journal in English and the end of the publication in Italian of the remarkable journal Zootecnica e Nutrizione Animale, which was started in 1975, as the official organ of the Association.

  14. Why a new journal on animal science

    Directory of Open Access Journals (Sweden)

    Rosanna Scipioni

    2010-01-01

    Full Text Available The publication of the first issue of the Italian Journal of Animal Science marks two important events for the Associazione Scientifica di Produzione Animale -ASPA- (Italian Scientific Association of Animal Production: the birth of a new scientific journal in English and the end of the publication in Italian of the remarkable journal Zootecnica e Nutrizione Animale, which was started in 1975, as the official organ of the Association.

  15. The Best in CytoJournal: 2005

    Directory of Open Access Journals (Sweden)

    Cohen Michael

    2006-01-01

    Full Text Available Abstract CytoJournal opened its doors in late 2004 and 2005 was the first full year of publication. In order to celebrate this event as well as recognize the contributing authors works, CytoJournal has initiated a Best Article of the Year, in this case 2005. This year's Best of CytoJournal: 2005 is an excellent review of thyroid FNAB.

  16. Journalism Curiosity and Story Telling Frame

    DEFF Research Database (Denmark)

    Grunwald, Ebbe; Rupar, Verica

    2009-01-01

    This comparative study of journalism practices in Australia and Denmark explores the interplay between two concepts relevant for journalism's meaning-making activity: a curiosity seen as an action meant to close an information gap, and a story telling frame seen as a form of structuring information...... the epistemological and organisational dimension of frames relates to the process of  meaning-making. We suggest refining the concept of frame in journalism studies by making a distinction between a frame (an epistemological category) and an angle (a textual organisation category). Our investigation shows...... that this distinction better serves the analysis and understanding of the mechanisms behind journalism in comparative contexts. Udgivelsesdato: December...

  17. Journalism – neo-modern and deliberative

    DEFF Research Database (Denmark)

    Svith, Flemming

    In recent years in literature, journalism in Western countries is considered on a downfall due to digital technologies, the corporate structure of news media and the project of the journalistic profession itself. Despite attempts by scholars and the journalistic profession, the gap between...... journalism and society and democracy still exists. Paraphrasing scholarly work, the idea of this paper is simple: I propose a new journalistic approach, called Analytical Journalism, which adds to representations of reality in news discourse by nuancing dominating frames on a specific issue. Hence, the story...... is the best obtainable deliberative input – both in terms of existing representations of reality, the contingent nature of reality and the journalism practice....

  18. THE BIRTH OF A NEW JOURNAL

    Directory of Open Access Journals (Sweden)

    K.V.S. Hari Kumar

    2012-01-01

    Full Text Available On behalf of all members of the editorial board, we welcome you to our new online journal, International Journal of Medical and Health Sciences. In this era of explosive growth of knowledge and publishing, we have the audacity to launch this journal to correct the anomalies related to the research productivity from India. Our efforts in delivering this baby originated from a prolonged unfavorable experience with the existing medical journals published from India. Most of the authors publishing from India are aware of the problems like editorial bias, delays in the review and publication timeframes.

  19. MUSIC WEB JOURNALISM: SELF-IDENTIFICATION

    Directory of Open Access Journals (Sweden)

    Chernyshov Alexander V.

    2016-12-01

    Full Text Available Online media have a short history. Only twenty years has passed with the moment the first telecommunication media appeared (mainly in the US. However, web journalism as an independent type of convergent journalism began to evolve relatively recently. We will examine its features in this article as an example of new music media journalism. First of all, it features such as universalism, ownership multimedia forms (e-journal, online-radio, online-TV, web portal, etc. and hypertext, personalization, increased interactivity

  20. The international impact of scientific journals - how "international" are the international journals?

    DEFF Research Database (Denmark)

    Wormell, Irene

    the analysis of the geographical distribution of authors, citations and subscriptions for seven selected LIS journals......the analysis of the geographical distribution of authors, citations and subscriptions for seven selected LIS journals...

  1. Journal of Ethnopharmacology简介

    Institute of Scientific and Technical Information of China (English)

    张晶

    2008-01-01

    Journal of Ethnopharmacology(民族药理学杂志,网址:http://www.elsevier.com/wps/find/journaldescription.CWS_home/506035,/description)是一本由国际民族药理学会(International Society of Ethnopharmacology.ISE)主办,Elsevier Science出版社出版的英文国际学术刊物(ISSN:0378—8741)。该杂志创刊于1979年,由荷兰莱顿大学生物研究所生药学系主任Robert Verpoorte主编,全年18期,

  2. [Medical journals and open access].

    Science.gov (United States)

    Sember, Marijan

    2008-01-01

    The open access (OA) or the idea of a free access to scholarly literature published in electronic form has been already well established in the field of medicine. Medline has already been free for a decade, PubMed Central has been growing steadily. The global crisis of the scientific publishing, becoming increasingly dominated by multinational companies and constant increase of journal prices have moved to action not only individuals and institutions but governments and research charities too. The aim of this article is to give an overview of the main open access initiatives and resources in biomedicine (PubMed, PubMed Central, BioMed Central, PLoS). The OA pros and cons are briefly discussed emphasizing the benefits of OA to medical research and practice.

  3. Hypothetical influence of non-indexed Spanish journals on the impact factor of radiological journals

    Energy Technology Data Exchange (ETDEWEB)

    Miguel-Dasit, Alberto [MR Section, La Plana de Vila-Real Hospital, Castellon (Spain); Aleixandre, Rafael [Institute of History of Science and Documentation Lopez Pinero, University of Valencia-CSIC, Valencia (Spain); Valderrama, Juan C. [Institute of History of Science and Documentation Lopez Pinero, University of Valencia-CSIC, Valencia (Spain); Marti-Bonmati, Luis [Department of Radiology, MR Section, Dr. Peset University Hospital, Avenida Gaspar Aguilar 90, E-46017 Valencia (Spain)]. E-mail: marti_lui@gva.es; Sanfeliu, Pilar [Cardenal Herrera-CEU University, Alfara, Valencia (Spain)

    2005-06-01

    Objective: The aim of this study was to analyze the hypothetical changes in the 2001 impact factor of 52 radiological journals included in the Science Citation Index-Journal Citation Reports by also counting cites proceeding from 73 Spanish journals on different medical specialties. Also, to estimate the possible impact factor of the official Spanish radiology journal, Radiologia, not included in this database. Materials and methods: A modified 2001 impact factor of 52 radiological journals and Radiologia was obtained by adding the number of cites in 1999 and 2000 from the medical Spanish journals. Data were obtained by consulting the 2001 edition of the Journal Citation Reports in the 'Web of Science' database. Results: The 16,985 bibliographical references were analysed (232 of them to radiological journals). The journal with the largest increase in its 2001 impact factor (from 1.83 to 1.90) was Radiologic Clinics of North America. European Journal of Radiology was the European journal with the highest increase (from 1.084 to 1.110) in the difference between the 2001 modified and original impact factor. The modified 2001 impact factor of the 34 American journals was statistically higher (P = 0.016) than that of the 18 European journals (1.64 versus 0.93). Differences between the 2001 modified and original impact factor were slightly higher in the American journals (no statistically significant difference). The 2001 impact factor of Radiologia was 0.056. Discussion: Differences between the 2001 original and modified impact factor were small, but larger in the American journals. The 2001 impact factor of Radiologia was modest, although similar to other publications included in the Journal Citation Reports.

  4. A journal-level analysis of Health Communication.

    Science.gov (United States)

    Feeley, Thomas Hugh; Smith, Rachel A; Moon, Shin-Il; Anker, Ashley E

    2010-09-01

    Citation data from 2006 through 2008 were used to examine the journal citation network of Health Communication in comparison to 26 related journals indexed by Journal Citation Reports, a database published by the Institute for Scientific Information (ISI) Web of Knowledge. A recently advanced journal relatedness factor based on out-degree (i.e., cited journals) and in-degree (i.e., citing journals) citations was used to determine the network of peer journals. Results indicate Health Communication serves to link communication and health-related journals. Data were also reported on journal impact and 5-year journal impact factors. When compared to ISI-indexed communication journals, Health Communication is consistently ranked in the top 25% across impact factors and citations to the journal are consistent over the 7 years of analysis from 2002 through 2008. Methods of increasing the impact of Health Communication among journals in social sciences are discussed.

  5. Accuracy of References in Five Entomology Journals.

    Science.gov (United States)

    Kristof, Cynthia

    ln this paper, the bibliographical references in five core entomology journals are examined for citation accuracy in order to determine if the error rates are similar. Every reference printed in each journal's first issue of 1992 was examined, and these were compared to the original (cited) publications, if possible, in order to determine the…

  6. A Comprehensive Analysis of Marketing Journal Rankings

    Science.gov (United States)

    Steward, Michelle D.; Lewis, Bruce R.

    2010-01-01

    The purpose of this study is to offer a comprehensive assessment of journal standings in Marketing from two perspectives. The discipline perspective of rankings is obtained from a collection of published journal ranking studies during the past 15 years. The studies in the published ranking stream are assessed for reliability by examining internal…

  7. Australian Education Journals: Quantitative and Qualitative Indicators

    Science.gov (United States)

    Haddow, Gaby; Genoni, Paul

    2009-01-01

    This paper reports on a study that applied citation-based measurements to Australian education journals. Citations data were drawn from two sources, Web of Science and Scopus, and these data were used to calculate each journal's impact factor, "h"-index, and diffusion factor. The rankings resulting from these analyses were compared with…

  8. Translation Aestheticsand Communication Theory of Journalism English

    Institute of Scientific and Technical Information of China (English)

    陈曜

    2007-01-01

    This paper describes the present translation theories and standards especially in journalism English translation and imply these theories in my issue. Moreover, I will explain how to apply the translation aesthetics and communication theory of translation in the course of journalism English translation activities. So that translation will achieve elegance in English news text and its Chinese version as well.

  9. Bibliometrics of electronic journals in information science

    Directory of Open Access Journals (Sweden)

    Donald T. Hawkins

    2001-01-01

    Full Text Available The bibliometric characteristics of electronic journals (e-journals covering the field of information science have been studied. Twenty-eight e-journals were identified and ranked by number of articles on the subject they published. A Bradford plot revealed that the core is not well developed yet, but it will likely contain six journals. The publication of information science articles in e-journals began modestly in 1995 with 26 articles, but it has risen to approximately 250 articles per year. The most prolific authors are identified. The vast majority of them are located in the United States or United Kingdom. Only 26 articles have authors from more than one country, showing that electronic technology has not yet strongly influenced international collaboration. About 2/3 of the articles originate in academic institutions. Common topics of e-journal articles in information science include electronic information, electronic publishing, virtual (digital libraries, information search and retrieval, and use of the Internet. Seven online databases cover these e-journals; Information Science Abstracts is the only one to cover all 28 journals, and it has the highest number of abstracts from them - over 1,100.

  10. Referencing web pages and e-journals.

    Science.gov (United States)

    Bryson, David

    2013-12-01

    One of the areas that can confuse students and authors alike is how to reference web pages and electronic journals (e-journals). The aim of this professional development article is to go back to first principles for referencing and see how with examples these should be referenced.

  11. Citing Journal Articles in Social Sciences Blogs

    Directory of Open Access Journals (Sweden)

    Hamid Reza Jamali

    2015-05-01

    Full Text Available This article aims to analyze motivations behind social sciences blog posts citing journal articles in order to find out whether blog citations of scholarly journal articles are good indicators for the societal impact of research. A random sample of 300 social sciences blog posts (out of 1,233 blog posts from ResearchBlogging published between 01/01/2012 to 18/06/2014 were subjected to content analysis. An existing categorization scheme was used and modified inductively. The 300 blog posts had 472 references including 424 journal articles from 269 different journals. Sixty-one (22.68% of all journals cited were from the category of social sciences and most of the journals with high frequency were highly cited general science journals such as PNAS and Science. Seventy-five percent of all journals were referenced only once. The average age of articles cited was 5.8 years. The most frequent (38, 12.67% motivation was to ‘neutrally presenting details of a study’. Overall, social science blogs were rather subject-oriented than article oriented. This means a considerable number of blog posts were not driven simply by writing about an article, instead bloggers tend to write about their subject of interest and use references to support their argument. The study shows the potential of blog citations as an altmetric measure and as a proxy for assessing the research impact.

  12. Academic Library Responses to Journal Price Discrimination.

    Science.gov (United States)

    Haley, Jean Walstrom; Talaga, James

    1992-01-01

    Discusses the nature and extent of discriminatory pricing by journal publishers, and reports on a survey of academic libraries that was conducted to assess the effectiveness of strategies used by libraries to mitigate the effects of high journal prices and price discrimination, i.e., higher prices for both institutions and foreign subscribers.…

  13. Journalling and the Teaching of Spirituality.

    Science.gov (United States)

    Bush, Tony

    1999-01-01

    A teacher developing a method to teach spiritual care to nursing students over age 25 used a journal to record and reflect on experiences. The importance of a safe and open learning environment, use of adult-learning principles, and immediate recording of journal entries was underscored. (SK)

  14. Electronic Journal Delivery in Academic Libraries

    Science.gov (United States)

    Crothers, Stephen; Prabhu, Margaret; Sullivan, Shirley

    2007-01-01

    The authors recount experiences of the variety of problems and issues involved in providing access to electronic journals in a large academic library. The paper excludes concerns emanating from decisions to subscribe to aggregations such as those produced by vendors like EBSCO, but concentrates on scholarly journals ordered individually, or as…

  15. DPJ Editorial: Launching the new journal

    Directory of Open Access Journals (Sweden)

    Eugene Matusov

    2013-01-01

    Full Text Available We welcome and invite new readers, authors, reviewers and editors to the new journal.  A short history of the journal foundation is given along with the reasons for launching this publication. A long, but not finished, list is provided of important and interesting themes and areas of interest for dialogic educational practice, research and theory.

  16. Pedagogically-Orientated Language Teaching Journals.

    Science.gov (United States)

    Ely, Christopher

    1992-01-01

    Reviews seven pedagogically orientated journals for foreign language teachers, most of which are designed for teachers of English-as-a-Second-Language: (1) "Practical English Teaching"; (2) "Modern English Teacher"; (3) "English Teaching Forum"; (4) "Guidelines"; (5) "ELT Journal"; (6) "Cross Currents"; and (7) "TESL Reporter." The names and…

  17. Northeastern Mathematical Journal Aims and Scope

    Institute of Scientific and Technical Information of China (English)

    2005-01-01

    Northeastern Mathematical Journal (NMJ) is a comprehensive mathematical journal carrying original papers on pure and applied mathematics. It started publication in September, 1985, and appears quarterly. The primary purpose is to present latest achievements in mathematical research and to promote national and international academic exchange, The Editorial Committee of NMJ consists of 49 members from different parts and units of China.

  18. Northeastern Mathematical Journal Aims and Scope

    Institute of Scientific and Technical Information of China (English)

    2004-01-01

    Northeastern Mathematical Journal (NMJ) is a comprehensive mathematical journal carrying original papers on pure and applied mathematics. It started publication in September, 1985, and appears quarterly. The primary purpose is to present latest achievements in mathematical research and to promote national and international academic exchange.

  19. Surviving the War: A College Counselor's Journal

    Science.gov (United States)

    Clinton, Philip L.

    2012-01-01

    This article presents excerpts of the author's journal that recounts his experiences and the events about surviving the war in Egypt from 1990-1991. The article begins with the August 13th entry in the journal of the year 1990.

  20. Job Satisfaction of High School Journalism Educators.

    Science.gov (United States)

    Dvorak, Jack; Phillips, Kay D.

    Four research questions are posed to explore the job satisfaction of high school journalism educators. A national random sample of 669 respondents shows that journalism educators are generally satisfied with their jobs--more so than teachers in other disciplines. Multiple regression analysis using Herzberg's motivation-hygiene theory as a…

  1. A Registry of Archived Electronic Journals

    Science.gov (United States)

    Sparks, Sue; Look, Hugh; Bide, Mark; Muir, Adrienne

    2010-01-01

    Concerns about e-journal archiving have increased in recent years. There is no central list of archived titles and there are inconsistencies in the information available about them. This makes it difficult for journal collection managers to take decisions on discarding print back runs and moving to electronic only subscriptions. In 2007, the UK's…

  2. The Academic Journal: Has it a Future?

    Directory of Open Access Journals (Sweden)

    Gaby Weiner

    2001-03-01

    Full Text Available This article examines the current state of the academic journal. It does so for a number of reasons: the increasing expense of paper journals; the advent of electronic publishing; the use of publication in journals as an indicator of research quality (in addition to disseminating knowledge within a discipline and consequent criticisms of systems of peer review and evaluation of scholarship; emergent issues of equity and access; and evidence of malpractice. These issues taken together constitute a critique of, and challenge to, the process whereby research papers become journal articles, which has in the past been viewed as unproblematic and straightforward. This paper brings together a wide range of literature in order to inform discussion about the future of the academic journal. It briefly examines the origins of the academic journal and then provides a comprehensive overview of current debates concerning how academic journals work today. In so doing, it raises questions about decisions that will need to be taken regarding the continuity or otherwise of the conventional academic journal, and how publishing practices may change in the future.

  3. Professional Academic Development through Professional Journal Dialogue

    Science.gov (United States)

    Ruth, Damian; Naidoo, Kogi

    2012-01-01

    This paper presents the cooperative analysis by a lecturer and an academic development practitioner of a reflective journal dialogue over the 12 weeks of teaching a postgraduate course. Through a retrospective analysis of the journal the present paper explores the following issues: the framing of an inquiry; the personal-professional nexus; and…

  4. Senior Faculty Perceptions of Social Work Journals.

    Science.gov (United States)

    Cnaan, Ram A.; And Others

    1994-01-01

    A survey of 421 senior faculty in graduate social work education investigated the familiarity and perceived quality of 120 professional journals in the field. Resulting ratings are presented for use by faculty seeking to publish their work in appropriate journals and those assessing the scholarly contribution of social work educators. (Author/MSE)

  5. Student-Selected Journals: An Emerging Resource

    Science.gov (United States)

    Weber, Roberta K.; Allen, Ethan J.

    2014-01-01

    This longitudinal study investigates the journal selections of 367 graduate students as they worked to fulfill a commonly assigned, criteria-based literature search on educational topics. The criteria called for evidence-based studies, published within the current ten years of course enrollment, within peer-reviewed journals. Student references…

  6. LIS Journals in the Knowledge Age.

    Science.gov (United States)

    Breen, Eileen

    This paper examines EMERALD LIS and how it facilitates the use of information contained in LIS (library and information science) journals for improvements and progress. EMERALD LIS is a full-text database of journals in information management, library technology, library and information service management, and collection management/development.…

  7. Forensic Journal, Volume VI, January 1984.

    Science.gov (United States)

    Forensic Journal, 1984

    1984-01-01

    While covering various English language forensics activities in Japan, this special journal issue is heavily devoted to debate. The 22 articles in the journal are divided into five sections as follows: (1) general information on the Japan English Forensics Association (JEFA); (2) debate, including reports on debate tournaments around the world, a…

  8. Journal of the Chinese Ceramic Society

    Institute of Scientific and Technical Information of China (English)

    2015-01-01

    ISSN 2095-7645CN 10-1189/TQAims and Scope The Journal of the Chinese Ceramic Society is a premier archival journal devoted to publishing top quality original research that advances the fundamental and applied science of ceramic materials.Today’s ceramic science is an interdisciplinary field that has expanded beyond its

  9. Foreword to Journal of Geographical Sciences

    Institute of Scientific and Technical Information of China (English)

    2001-01-01

    @@In order to strengthen academic exchange of geography between China and other countries,and to offer a publication for exchanging academic ideas of geog-raphers in the world,The Journal of AChinese Geog-raphyis changed to Journal of Geographical Sciences in 2001.

  10. Australian Education Journals: Quantitative and Qualitative Indicators

    Science.gov (United States)

    Haddow, Gaby; Genoni, Paul

    2009-01-01

    This paper reports on a study that applied citation-based measurements to Australian education journals. Citations data were drawn from two sources, Web of Science and Scopus, and these data were used to calculate each journal's impact factor, "h"-index, and diffusion factor. The rankings resulting from these analyses were compared with draft…

  11. Predatory Journals, Peer Review, and Education Research

    Science.gov (United States)

    Beall, Jeffrey

    2017-01-01

    This commentary examines the problem of predatory journals, low-quality open-access journals that seek to earn revenue from scholarly authors without following scholarly publishing best practices. Seeking to accept as many papers as possible, they typically do not perform a standard peer review, leading to the publication of improperly vetted…

  12. Kiyo Journals and Scholarly Communication in Japan

    Science.gov (United States)

    Kamada, Hitoshi

    2007-01-01

    Kiyo are journals published by Japanese academic institutions. As a scholarly communication medium, they have inherent problems such as limited accessibility and lack of quality control. Despite these problems, they have evolved to comprise the majority of academic journals published in the humanities and social sciences in Japan because they fit…

  13. Congratulation on World Journal of Gastroenterology

    Institute of Scientific and Technical Information of China (English)

    2007-01-01

    @@ Dear Professor Lian-Sheng Ma, Professor Michael Hobsley and I have greatly enjoyed reading the account of all you have done towards the development of "The World Journal of Gastroenterology", as described in the article by Zhen-Xi Li in the November 21st. Issue of the Journal.

  14. Journalism: Acquiring Something to Write About.

    Science.gov (United States)

    Moore, Roy L.

    1989-01-01

    A broad liberal arts curriculum coupled with basic and advanced journalism writing, editing, and theory (including law and ethics) courses is the best insurance for excellence in journalism education. A University of Kentucky plan includes establishing an exchange program with other disciplines, and requiring paired, cross-disciplinary courses.…

  15. Responsibility: The Key to Scholastic Journalism.

    Science.gov (United States)

    Bowen, John

    1988-01-01

    To behave responsibly toward school journalism, personnel officers and administrators must select a qualified, fully cognizant adviser/instructor with training in press law and ethics, journalism advising and instruction, news reporting, copy editing, and design and layout principles. A professionally oriented curriculum is also a must. (MLH)

  16. Catalyst Alloys Processing

    Science.gov (United States)

    Tan, Xincai

    2014-10-01

    Catalysts are one of the key materials used for diamond formation at high pressures. Several such catalyst products have been developed and applied in China and around the world. The catalyst alloy most widely used in China is Ni70Mn25Co5 developed at Changsha Research Institute of Mining and Metallurgy. In this article, detailed techniques for manufacturing such a typical catalyst alloy will be reviewed. The characteristics of the alloy will be described. Detailed processing of the alloy will be presented, including remelting and casting, hot rolling, annealing, surface treatment, cold rolling, blanking, finishing, packaging, and waste treatment. An example use of the catalyst alloy will also be given. Industrial experience shows that for the catalyst alloy products, a vacuum induction remelt furnace can be used for remelting, a metal mold can be used for casting, hot and cold rolling can be used for forming, and acid pickling can be used for metal surface cleaning.

  17. Evaluating Academic Journals without Impact Factors for Collection Management Decisions.

    Science.gov (United States)

    Dilevko, Juris; Atkinson, Esther

    2002-01-01

    Discussion of evaluating academic journals for collection management decisions focuses on a methodological framework for evaluating journals not ranked by impact factors in Journal Citation Reports. Compares nonranked journals with ranked journals and then applies this framework to a case study in the field of medical science. (LRW)

  18. Examining Marketing Journals' Publication Process and Reviewer Practices

    Science.gov (United States)

    Seiler, Vicky L.; Reisenwitz, Timothy H.; Schibrowsky, John A.

    2011-01-01

    This study examines reviewer practices at 11 marketing journals. The results for the top three journals are compared to eight comparable journals that are typically considered to be non-top-tier journals. The results suggest that the reviewers and the review processes at the top journals differ significantly from those of the non-top-tier…

  19. Measuring contextual citation impact of scientific journals

    CERN Document Server

    Moed, Henk F

    2009-01-01

    This paper explores a new indicator of journal citation impact, denoted as source normalized impact per paper (SNIP). It measures a journal's contextual citation impact, taking into account characteristics of its properly defined subject field, especially the frequency at which authors cite other papers in their reference lists, the rapidity of maturing of citation impact, and the extent to which a database used for the assessment covers the field's literature. It further develops Eugene Garfield's notions of a field's 'citation potential' defined as the average length of references lists in a field and determining the probability of being cited, and the need in fair performance assessments to correct for differences between subject fields. A journal's subject field is defined as the set of papers citing that journal. SNIP is defined as the ratio of the journal's citation count per paper and the citation potential in its subject field. It aims to allow direct comparison of sources in different subject fields....

  20. Considering a possible future for Digital Journalism

    Directory of Open Access Journals (Sweden)

    Mark DEUZE

    2017-01-01

    Full Text Available Developments shaping digital journalism seem to speeding up at the start of the 21st century. Social media enable radical new ways to gather and verify sources and information. Hardware and software power innovative storytelling formats, combining platforms and channels, adding interactivity to the news experience. And the global news industry is quickly becoming a networked industry, with startups and other forms of entrepreneurial journalism springing up all over the world. In this essay, I consider a possible future for digital journalism by briefly reviewing first findings from a series of case studies of 21 new small-sized journalism enterprises operating in 11 countries (spread across 5 continents. The overarching research question: seen through their eyes, what does the future of (digital journalism look like? The answers are hopeful.