WorldWideScience

Sample records for advanced semiconductor manufacturing

  1. Semiconductor Manufacturing equipment introduction

    International Nuclear Information System (INIS)

    Im, Jong Sun

    2001-02-01

    This book deals with semiconductor manufacturing equipment. It is comprised of nine chapters, which are manufacturing process of semiconductor device, history of semiconductor manufacturing equipment, kinds and role of semiconductor manufacturing equipment, construction and method of semiconductor manufacturing equipment, introduction of various semiconductor manufacturing equipment, spots of semiconductor manufacturing, technical elements of semiconductor manufacturing equipment, road map of technology of semiconductor manufacturing equipment and semiconductor manufacturing equipment in the 21st century.

  2. Advanced excimer laser technologies enable green semiconductor manufacturing

    Science.gov (United States)

    Fukuda, Hitomi; Yoo, Youngsun; Minegishi, Yuji; Hisanaga, Naoto; Enami, Tatsuo

    2014-03-01

    "Green" has fast become an important and pervasive topic throughout many industries worldwide. Many companies, especially in the manufacturing industries, have taken steps to integrate green initiatives into their high-level corporate strategies. Governments have also been active in implementing various initiatives designed to increase corporate responsibility and accountability towards environmental issues. In the semiconductor manufacturing industry, there are growing concerns over future environmental impact as enormous fabs expand and new generation of equipments become larger and more powerful. To address these concerns, Gigaphoton has implemented various green initiatives for many years under the EcoPhoton™ program. The objective of this program is to drive innovations in technology and services that enable manufacturers to significantly reduce both the financial and environmental "green cost" of laser operations in high-volume manufacturing environment (HVM) - primarily focusing on electricity, gas and heat management costs. One example of such innovation is Gigaphoton's Injection-Lock system, which reduces electricity and gas utilization costs of the laser by up to 50%. Furthermore, to support the industry's transition from 300mm to the next generation 450mm wafers, technologies are being developed to create lasers that offer double the output power from 60W to 120W, but reducing electricity and gas consumption by another 50%. This means that the efficiency of lasers can be improve by up to 4 times in 450mm wafer production environments. Other future innovations include the introduction of totally Heliumfree Excimer lasers that utilize Nitrogen gas as its replacement for optical module purging. This paper discusses these and other innovations by Gigaphoton to enable green manufacturing.

  3. Introduction to semiconductor manufacturing technology

    CERN Document Server

    2012-01-01

    IC chip manufacturing processes, such as photolithography, etch, CVD, PVD, CMP, ion implantation, RTP, inspection, and metrology, are complex methods that draw upon many disciplines. [i]Introduction to Semiconductor Manufacturing Technologies, Second Edition[/i] thoroughly describes the complicated processes with minimal mathematics, chemistry, and physics; it covers advanced concepts while keeping the contents accessible to readers without advanced degrees. Designed as a textbook for college students, this book provides a realistic picture of the semiconductor industry and an in-depth discuss

  4. Automation and Integration in Semiconductor Manufacturing

    OpenAIRE

    Liao, Da-Yin

    2010-01-01

    Semiconductor automation originates from the prevention and avoidance of frauds in daily fab operations. As semiconductor technology and business continuously advance and grow, manufacturing systems must aggressively evolve to meet the changing technical and business requirements in this industry. Semiconductor manufacturing has been suffering pains from islands of automation. The problems associated with these systems are limited

  5. An Assessment of Critical Dimension Small Angle X-ray Scattering Metrology for Advanced Semiconductor Manufacturing

    Energy Technology Data Exchange (ETDEWEB)

    Settens, Charles M. [State Univ. of New York (SUNY), Albany, NY (United States)

    2015-01-01

    Simultaneous migration of planar transistors to FinFET architectures, the introduction of a plurality of materials to ensure suitable electrical characteristics, and the establishment of reliable multiple patterning lithography schemes to pattern sub-10 nm feature sizes imposes formidable challenges to current in-line dimensional metrologies. Because the shape of a FinFET channel cross-section immediately influences the electrical characteristics, the evaluation of 3D device structures requires measurement of parameters beyond traditional critical dimension (CD), including their sidewall angles, top corner rounding and footing, roughness, recesses and undercuts at single nanometer dimensions; thus, metrologies require sub-nm and approaching atomic level measurement uncertainty. Synchrotron critical dimension small angle X-ray scattering (CD-SAXS) has unique capabilities to non-destructively monitor the cross-section shape of surface structures with single nanometer uncertainty and can perform overlay metrology to sub-nm uncertainty. In this dissertation, we perform a systematic experimental investigation using CD-SAXS metrology on a hierarchy of semiconductor 3D device architectures including, high-aspect-ratio contact holes, H2 annealed Si fins, and a series of grating type samples at multiple points along a FinFET fabrication process increasing in structural intricacy and ending with fully fabricated FinFET. Comparative studies between CD-SAXS metrology and other relevant semiconductor dimensional metrologies, particularly CDSEM, CD-AFM and TEM are used to determine physical limits of CD-SAXS approach for advanced semiconductor samples. CD-SAXS experimental tradeoffs, advice for model-dependent analysis and thoughts on the compatibility with a semiconductor manufacturing environment are discussed.

  6. Fabrication of Circuit QED Quantum Processors, Part 2: Advanced Semiconductor Manufacturing Perspectives

    Science.gov (United States)

    Michalak, D. J.; Bruno, A.; Caudillo, R.; Elsherbini, A. A.; Falcon, J. A.; Nam, Y. S.; Poletto, S.; Roberts, J.; Thomas, N. K.; Yoscovits, Z. R.; Dicarlo, L.; Clarke, J. S.

    Experimental quantum computing is rapidly approaching the integration of sufficient numbers of quantum bits for interesting applications, but many challenges still remain. These challenges include: realization of an extensible design for large array scale up, sufficient material process control, and discovery of integration schemes compatible with industrial 300 mm fabrication. We present recent developments in extensible circuits with vertical delivery. Toward the goal of developing a high-volume manufacturing process, we will present recent results on a new Josephson junction process that is compatible with current tooling. We will then present the improvements in NbTiN material uniformity that typical 300 mm fabrication tooling can provide. While initial results on few-qubit systems are encouraging, advanced processing control is expected to deliver the improvements in qubit uniformity, coherence time, and control required for larger systems. Research funded by Intel Corporation.

  7. Method of manufacturing semiconductor devices

    International Nuclear Information System (INIS)

    Sun, Y.S.E.

    1980-01-01

    A method of improving the electrical characteristics of semiconductor devices such as SCR's, rectifiers and triacs during their manufacture is described. The system consists of electron irradiation at an energy in excess of 250 KeV and most preferably between 1.5 and 12 MeV, producing an irradiation dose of between 5.10 12 and 5.10 15 electrons per sq. cm., and at a temperature in excess of 100 0 C preferably between 150 and 375 0 C. (U.K.)

  8. Advanced Manufacturing Technologies

    Science.gov (United States)

    Fikes, John

    2016-01-01

    Advanced Manufacturing Technologies (AMT) is developing and maturing innovative and advanced manufacturing technologies that will enable more capable and lower-cost spacecraft, launch vehicles and infrastructure to enable exploration missions. The technologies will utilize cutting edge materials and emerging capabilities including metallic processes, additive manufacturing, composites, and digital manufacturing. The AMT project supports the National Manufacturing Initiative involving collaboration with other government agencies.

  9. Advanced Manufacturing Laboratory

    Data.gov (United States)

    Federal Laboratory Consortium — The Advanced Manufacturing Laboratory at the University of Maryland provides the state of the art facilities for realizing next generation products and educating the...

  10. Fundamentals of semiconductor manufacturing and process control

    CERN Document Server

    May, Gary S

    2006-01-01

    A practical guide to semiconductor manufacturing from process control to yield modeling and experimental design Fundamentals of Semiconductor Manufacturing and Process Control covers all issues involved in manufacturing microelectronic devices and circuits, including fabrication sequences, process control, experimental design, process modeling, yield modeling, and CIM/CAM systems. Readers are introduced to both the theory and practice of all basic manufacturing concepts. Following an overview of manufacturing and technology, the text explores process monitoring methods, including those that focus on product wafers and those that focus on the equipment used to produce wafers. Next, the text sets forth some fundamentals of statistics and yield modeling, which set the foundation for a detailed discussion of how statistical process control is used to analyze quality and improve yields. The discussion of statistical experimental design offers readers a powerful approach for systematically varying controllable p...

  11. Advances in semiconductor lasers

    CERN Document Server

    Coleman, James J; Jagadish, Chennupati

    2012-01-01

    Semiconductors and Semimetals has distinguished itself through the careful selection of well-known authors, editors, and contributors. Originally widely known as the ""Willardson and Beer"" Series, it has succeeded in publishing numerous landmark volumes and chapters. The series publishes timely, highly relevant volumes intended for long-term impact and reflecting the truly interdisciplinary nature of the field. The volumes in Semiconductors and Semimetals have been and will continue to be of great interest to physicists, chemists, materials scientists, and device engineers in academia, scien

  12. Semiconductors integrated circuit design for manufacturability

    CERN Document Server

    Balasinki, Artur

    2011-01-01

    Because of the continuous evolution of integrated circuit manufacturing (ICM) and design for manufacturability (DfM), most books on the subject are obsolete before they even go to press. That's why the field requires a reference that takes the focus off of numbers and concentrates more on larger economic concepts than on technical details. Semiconductors: Integrated Circuit Design for Manufacturability covers the gradual evolution of integrated circuit design (ICD) as a basis to propose strategies for improving return-on-investment (ROI) for ICD in manufacturing. Where most books put the spotl

  13. Method of manufacturing a semiconductor device and semiconductor device obtained with such a method

    NARCIS (Netherlands)

    2008-01-01

    The invention relates to a method of manufacturing a semiconductor device (10) with a semiconductor body (1) which is provided with at least one semiconductor element, wherein on the surface of the semiconductor body (1) a mesa- shaped semiconductor region (2) is formed, a masking layer (3) is

  14. Advanced manufacturing: Technology diffusion

    Energy Technology Data Exchange (ETDEWEB)

    Tesar, A.

    1995-12-01

    In this paper we examine how manufacturing technology diffuses rom the developers of technology across national borders to those who do not have the capability or resources to develop advanced technology on their own. None of the wide variety of technology diffusion mechanisms discussed in this paper are new, yet the opportunities to apply these mechanisms are growing. A dramatic increase in technology diffusion occurred over the last decade. The two major trends which probably drive this increase are a worldwide inclination towards ``freer`` markets and diminishing isolation. Technology is most rapidly diffusing from the US In fact, the US is supplying technology for the rest of the world. The value of the technology supplied by the US more than doubled from 1985 to 1992 (see the Introduction for details). History shows us that technology diffusion is inevitable. It is the rates at which technologies diffuse to other countries which can vary considerably. Manufacturers in these countries are increasingly able to absorb technology. Their manufacturing efficiency is expected to progress as technology becomes increasingly available and utilized.

  15. 2001 Industry Studies: Advanced Manufacturing

    Science.gov (United States)

    2001-05-28

    oriented, 19 and manufacturers are employing the Internet and associated information technologies to better integrate supply chains and form extended...ways to compete in world markets . As part of this ongoing transformation, the broad implementation of advanced manufacturing technologies , processes...competitive advantages and better performance in world markets . Importantly, advanced manufacturing involves the innovative integration of new technology

  16. Microeconomics of process control in semiconductor manufacturing

    Science.gov (United States)

    Monahan, Kevin M.

    2003-06-01

    Process window control enables accelerated design-rule shrinks for both logic and memory manufacturers, but simple microeconomic models that directly link the effects of process window control to maximum profitability are rare. In this work, we derive these links using a simplified model for the maximum rate of profit generated by the semiconductor manufacturing process. We show that the ability of process window control to achieve these economic objectives may be limited by variability in the larger manufacturing context, including measurement delays and process variation at the lot, wafer, x-wafer, x-field, and x-chip levels. We conclude that x-wafer and x-field CD control strategies will be critical enablers of density, performance and optimum profitability at the 90 and 65nm technology nodes. These analyses correlate well with actual factory data and often identify millions of dollars in potential incremental revenue and cost savings. As an example, we show that a scatterometry-based CD Process Window Monitor is an economically justified, enabling technology for the 65nm node.

  17. Advanced manufacturing technologies modern machining, advanced joining, sustainable manufacturing

    CERN Document Server

    2017-01-01

    This book provides details and collective information on working principle, process mechanism, salient features, and unique applications of various advanced manufacturing techniques and processes belong. The book is divided in three sessions covering modern machining methods, advanced repair and joining techniques and, finally, sustainable manufacturing. The latest trends and research aspects of those fields are highlighted.

  18. Advanced Manufacture of Reflectors

    Energy Technology Data Exchange (ETDEWEB)

    Angel, Roger [Univ. of Arizona, Tucson, AZ (United States)

    2014-12-17

    The main project objective has been to develop an advanced gravity sag method for molding large glass solar reflectors with either line or point focus, and with long or short focal length. The method involves taking standard sized squares of glass, 1.65 m x 1.65 m, and shaping them by gravity sag into precision steel molds. The method is designed for high volume manufacture when incorporated into a production line with separate pre-heating and cooling. The performance objectives for the self-supporting glass mirrors made by this project include mirror optical accuracy of 2 mrad root mean square (RMS), requiring surface slope errors less than 1 mrad rms, a target not met by current production of solar reflectors. Our objective also included development of new methods for rapidly shaping glass mirrors and coating them for higher reflectivity and soil resistance. Reflectivity of 95% for a glass mirror with anti-soil coating was targeted, compared to the present ~94% with no anti-soil coating. Our mirror cost objective is ~$20/m2 in 2020, a significant reduction compared to the present ~$35/m2 for solar trough mirrors produced for trough solar plants.

  19. Method of manufacturing a semiconductor sensor device and semiconductor sensor device

    NARCIS (Netherlands)

    2009-01-01

    The invention relates to a method of manufacturing a semiconductor sensor device (10) for sensing a substance comprising a plurality of mutually parallel mesa-shaped semiconductor regions (1) which are formed on a surface of a semiconductor body (11) and which are connected at a first end to a first

  20. NICE3 SO3 Cleaning Process in Semiconductor Manufacturing

    International Nuclear Information System (INIS)

    Blazek, Steve

    1999-01-01

    This fact sheet explains how Anon, Inc., has developed a novel method of removing photoresist--a light-sensitive material used to produce semiconductor wafers for computers--from the computer manufacturing process at reduced cost and greater efficiency. The new technology is technically superior to existing semiconductor cleaning methods and results in reduced use of hazardous chemicals

  1. Advances in Additive Manufacturing

    Science.gov (United States)

    2016-07-14

    with a collection of information if it does not display a currently valid OMB control number. PLEASE DO NOT RETURN YOUR FORM TO THE ABOVE ADDRESS...Hamilton • Beth Bimber Air Force Research Laboratory, Metals Branch • Eddie Schwalbach • Mike Groeber • Benjamin Leever • James Hardin...conducting more in-field, or point-of-need, manufacturing than ever before. Other areas of concentration include man- machine interface, capabilities

  2. Kansas Advanced Semiconductor Project: Final Report

    International Nuclear Information System (INIS)

    Baringer, P.; Bean, A.; Bolton, T.; Horton-Smith, G.; Maravin, Y.; Ratra, B.; Stanton, N.; von Toerne, E.; Wilson, G.

    2007-01-01

    KASP (Kansas Advanced Semiconductor Project) completed the new Layer 0 upgrade for D0, assumed key electronics projects for the US CMS project, finished important new physics measurements with the D0 experiment at Fermilab, made substantial contributions to detector studies for the proposed e+e- international linear collider (ILC), and advanced key initiatives in non-accelerator-based neutrino physics.

  3. Impact of nano particles on semiconductor manufacturing

    NARCIS (Netherlands)

    Wali, F.; Knotter, D.M.; Kuper, F.G.

    2008-01-01

    Semiconductor industry faces a continuous challenge to decrease the transistor size as well as to increase the yield by eliminating defect sources. One of the sources of particle defects is ultra pure water used in different production tools at different stages of processing. In this paper, particle

  4. Semiconductor

    International Nuclear Information System (INIS)

    2000-01-01

    This book deals with process and measurement of semiconductor. It contains 20 chapters, which goes as follows; semiconductor industry, introduction of semiconductor manufacturing, yield of semiconductor process, materials, crystal growth and a wafer forming, PN, control pollution, oxidation, photomasking photoresist chemistry, photomasking technologies, diffusion and ion injection, chemical vapor deposition, metallization, wafer test and way of evaluation, semiconductor elements, integrated circuit and semiconductor circuit technology.

  5. Ohio Advanced Energy Manufacturing Center

    Energy Technology Data Exchange (ETDEWEB)

    Kimberly Gibson; Mark Norfolk

    2012-07-30

    The program goal of the Ohio Advanced Energy Manufacturing Center (OAEMC) is to support advanced energy manufacturing and to create responsive manufacturing clusters that will support the production of advanced energy and energy-efficient products to help ensure the nation's energy and environmental security. This goal cuts across a number of existing industry segments critical to the nation's future. Many of the advanced energy businesses are starting to make the transition from technology development to commercial production. Historically, this transition from laboratory prototypes through initial production for early adopters to full production for mass markets has taken several years. Developing and implementing manufacturing technology to enable production at a price point the market will accept is a key step. Since these start-up operations are configured to advance the technology readiness of the core energy technology, they have neither the expertise nor the resources to address manufacturing readiness issues they encounter as the technology advances toward market entry. Given the economic realities of today's business environment, finding ways to accelerate this transition can make the difference between success and failure for a new product or business. The advanced energy industry touches a wide range of industry segments that are not accustomed to working together in complex supply chains to serve large markets such as automotive and construction. During its first three years, the Center has catalyzed the communication between companies and industry groups that serve the wide range of advanced energy markets. The Center has also found areas of common concern, and worked to help companies address these concerns on a segment or industry basis rather than having each company work to solve common problems individually. EWI worked with three industries through public-private partnerships to sew together disparate segments helping to promote

  6. Advanced optical manufacturing digital integrated system

    Science.gov (United States)

    Tao, Yizheng; Li, Xinglan; Li, Wei; Tang, Dingyong

    2012-10-01

    It is necessarily to adapt development of advanced optical manufacturing technology with modern science technology development. To solved these problems which low of ration, ratio of finished product, repetition, consistent in big size and high precision in advanced optical component manufacturing. Applied business driven and method of Rational Unified Process, this paper has researched advanced optical manufacturing process flow, requirement of Advanced Optical Manufacturing integrated System, and put forward architecture and key technology of it. Designed Optical component core and Manufacturing process driven of Advanced Optical Manufacturing Digital Integrated System. the result displayed effective well, realized dynamic planning Manufacturing process, information integration improved ratio of production manufactory.

  7. Coherent diffractive imaging methods for semiconductor manufacturing

    Science.gov (United States)

    Helfenstein, Patrick; Mochi, Iacopo; Rajeev, Rajendran; Fernandez, Sara; Ekinci, Yasin

    2017-12-01

    The paradigm shift of the semiconductor industry moving from deep ultraviolet to extreme ultraviolet lithography (EUVL) brought about new challenges in the fabrication of illumination and projection optics, which constitute one of the core sources of cost of ownership for many of the metrology tools needed in the lithography process. For this reason, lensless imaging techniques based on coherent diffractive imaging started to raise interest in the EUVL community. This paper presents an overview of currently on-going research endeavors that use a number of methods based on lensless imaging with coherent light.

  8. Strengthening the Competitiveness and Sustainability of a Semiconductor Manufacturer with Cloud Manufacturing

    Directory of Open Access Journals (Sweden)

    Toly Chen

    2014-01-01

    Full Text Available Cloud manufacturing (CMfg is a new-generation service-oriented networked manufacturing model that provides distributed users centralized managed manufacturing resources, ability, and services. CMfg is applied here to a semiconductor manufacturing factory. Benefits are classified into five aspects: cost savings, efficiency, additional data analysis capabilities, flexibility, and closer partner relationships. A strength, weakness, opportunity, and threat (SWOT analysis is done which guides a semiconductor manufacturer in planning CMfg implementation projects. Simulation of a wafer fabrication factory (wafer fab is used as an example. Several CMfg services are proposed for assisting the fab simulation activities through the collaboration of cloud service providers, software vendors, equipment suppliers, and the wafer fab. The connection with the competitiveness and sustainability of a wafer fab is also stressed.

  9. Rare resource supply crisis and solution technology for semiconductor manufacturing

    Science.gov (United States)

    Fukuda, Hitomi; Hu, Sophia; Yoo, Youngsun; Takahisa, Kenji; Enami, Tatsuo

    2016-03-01

    There are growing concerns over future environmental impact and earth resource shortage throughout the world and in many industries. Our semiconductor industry is not excluded. "Green" has become an important topic as production volume become larger and more powerful. Especially, the rare gases are widely used in semiconductor manufacturing because of its inertness and extreme chemical stability. One major component of an Excimer laser system is Neon. It is used as a buffer gas for Argon (Ar) and Krypton (Kr) gases used in deep ultraviolet (DUV) lithography laser systems. Since Neon gas accounting for more than 96% of the laser gas mixture, a fairly large amount of neon gas is consumed to run these DUV lasers. However, due to country's instability both in politics and economics in Ukraine, the main producer of neon gas today, supply reduction has become an issue and is causing increasing concern. This concern is not only based on price increases, but has escalated to the point of supply shortages in 2015. This poses a critical situation for the semiconductor industry, which represents the leading consumer of neon gas in the world. Helium is another noble gas used for Excimer laser operation. It is used as a purge gas for optical component modules to prevent from being damaged by active gases and impurities. Helium has been used in various industries, including for medical equipment, linear motor cars, and semiconductors, and is indispensable for modern life. But consumption of helium in manufacturing has been increased dramatically, and its unstable supply and price rise has been a serious issue today. In this article, recent global supply issue of rare resources, especially Neon gas and Helium gas, and its solution technology to support semiconductor industry will be discussed.

  10. Advanced Manufacturing Technologies (AMT): Modular Rapidly Manufactured SmallSat

    Data.gov (United States)

    National Aeronautics and Space Administration — Utilize advanced manufacturing processes to design and fabricate a fully functional prototype flight model, with the goal of demonstrating rapid on-orbit assembly of...

  11. Advance Manufacturing Office FY 2017 Budget At-A-Glance

    Energy Technology Data Exchange (ETDEWEB)

    None

    2016-03-01

    The Advanced Manufacturing Office (AMO) brings together manufacturers, research institutions, suppliers, and universities to investigate manufacturing processes, information, and materials technologies critical to advance domestic manufacturing of clean energy products, and to support energy productivity across the entire manufacturing sector.

  12. Fundamental atomic plasma chemistry for semiconductor manufacturing process analysis

    International Nuclear Information System (INIS)

    Ventzek, P.L.G.; Zhang, D.; Stout, P.J.; Rauf, S.; Orlowski, M.; Kudrya, V.; Astapenko, V.; Eletskii, A.

    2002-01-01

    An absence of fundamental atomic plasma chemistry data (e.g. electron impact cross-sections) hinders the application of plasma process models in semiconductor manufacturing. Of particular importance is excited state plasma chemistry data for metallization applications. This paper describes important plasma chemistry processes in the context of high density plasmas for metallization application and methods for the calculation of data for the study of these processes. Also discussed is the development of model data sets that address computational tractability issues. Examples of model electron impact cross-sections for Ni reduced from multiple collision processes are presented

  13. Progress in ion implantation equipment for semiconductor manufacturing

    International Nuclear Information System (INIS)

    Kawai, Tadashi; Naito, Masao

    1987-01-01

    In the semiconductor device manufacturing industry, ion implantation systems are used to dope semiconductor substrates with impurities that act as donor or acceptor. In an ion implantation system, required impurity ions are generated from an ion source, subjected to mass analysis, accelerated, converged and implanted in semiconductor wafers. High-tension arc tends to cause troubles in these systems, but improvement in design increased the average operation rate of medium-power systems from bout 70 percent to 90 percent during the past 10 years. Freeman type ion sources have replaced most RF ion sources and cold cathode PIG sources, which had been widely used until the early 1970s. Many of the recent ion sources are equipped with a P and As vaporizer to increase the beam intensity. By an increased beam intensity or decreased handling time in combination with an automatic handling system, the throughput has reached 330 wafers per hour for 10 second implantation. The yield has increased due to the development of improved scanning methods, vacuum devices such as cryopump, and processes and apparatus that serve for preventing particles from being contained in micro-devices. Various other improvements have been made to permit efficient production. (Nogami, K.)

  14. Advanced manufacturing: Technology and international competitiveness

    Energy Technology Data Exchange (ETDEWEB)

    Tesar, A.

    1995-02-01

    Dramatic changes in the competitiveness of German and Japanese manufacturing have been most evident since 1988. All three countries are now facing similar challenges, and these challenges are clearly observed in human capital issues. Our comparison of human capital issues in German, Japanese, and US manufacturing leads us to the following key judgments: Manufacturing workforces are undergoing significant changes due to advanced manufacturing technologies. As companies are forced to develop and apply these technologies, the constituency of the manufacturing workforce (especially educational requirements, contingent labor, job content, and continuing knowledge development) is being dramatically and irreversibly altered. The new workforce requirements which result due to advanced manufacturing require a higher level of worker sophistication and responsibility.

  15. Research overview: Advanced Manufacturing in Switzerland

    OpenAIRE

    Schärer, Claudia

    2016-01-01

    SATW is convinced that industrial production methods will see fundamental changes over the coming years. Mastering new production technologies (advanced manufacturing) such as additive manufacturing and industry 4.0 will be vital to keep Swiss production at a competitive level. New additive manufacturing processes such as 3D printing offer revolutionary opportunities and have the potential to replace traditional production methods. Industry 4.0 has seen the definition of a new concept for...

  16. Microeconomics of yield learning and process control in semiconductor manufacturing

    Science.gov (United States)

    Monahan, Kevin M.

    2003-06-01

    Simple microeconomic models that directly link yield learning to profitability in semiconductor manufacturing have been rare or non-existent. In this work, we review such a model and provide links to inspection capability and cost. Using a small number of input parameters, we explain current yield management practices in 200mm factories. The model is then used to extrapolate requirements for 300mm factories, including the impact of technology transitions to 130nm design rules and below. We show that the dramatic increase in value per wafer at the 300mm transition becomes a driver for increasing metrology and inspection capability and sampling. These analyses correlate well wtih actual factory data and often identify millions of dollars in potential cost savings. We demonstrate this using the example of grating-based overlay metrology for the 65nm node.

  17. Research Staff | Advanced Manufacturing Research | NREL

    Science.gov (United States)

    manages wind turbine rotor blade composite manufacturing projects at the National Wind Technology Center postdoctoral researcher working to develop and validate advanced composite manufacturing processes using novel materials for wind and marine and hydrokinetic (MHK) turbines. This includes hands-on composite

  18. Advanced Manufacturing Office Clean Water Processing Technologies

    Energy Technology Data Exchange (ETDEWEB)

    None

    2018-03-01

    The DOE Office of Energy Efficiency and Renewable Energy (EERE)’s Advanced Manufacturing Office partners with industry, small business, universities, and other stakeholders to identify and invest in emerging technologies with the potential to create high-quality domestic manufacturing jobs and enhance the global competitiveness of the United States.

  19. Measure of manufacturing performance in advanced manufacturing systems

    NARCIS (Netherlands)

    Ron, de A.J.

    1995-01-01

    Because of the financial risks as a result of the high investments, decisions concerning investing in advanced manufacturing systems are difficult. The difficulty to decide is gained by the lack of a well-defined measure to support decisions and alarming messages from the industry concerning inverse

  20. Big Data Analytics for Smart Manufacturing: Case Studies in Semiconductor Manufacturing

    Directory of Open Access Journals (Sweden)

    James Moyne

    2017-07-01

    Full Text Available Smart manufacturing (SM is a term generally applied to the improvement in manufacturing operations through integration of systems, linking of physical and cyber capabilities, and taking advantage of information including leveraging the big data evolution. SM adoption has been occurring unevenly across industries, thus there is an opportunity to look to other industries to determine solution and roadmap paths for industries such as biochemistry or biology. The big data evolution affords an opportunity for managing significantly larger amounts of information and acting on it with analytics for improved diagnostics and prognostics. The analytics approaches can be defined in terms of dimensions to understand their requirements and capabilities, and to determine technology gaps. The semiconductor manufacturing industry has been taking advantage of the big data and analytics evolution by improving existing capabilities such as fault detection, and supporting new capabilities such as predictive maintenance. For most of these capabilities: (1 data quality is the most important big data factor in delivering high quality solutions; and (2 incorporating subject matter expertise in analytics is often required for realizing effective on-line manufacturing solutions. In the future, an improved big data environment incorporating smart manufacturing concepts such as digital twin will further enable analytics; however, it is anticipated that the need for incorporating subject matter expertise in solution design will remain.

  1. An Assessment of Advanced Manufacturing Technologies Implementation in Manufacturing Enterprises

    Directory of Open Access Journals (Sweden)

    Ghulam Yasin Shaikh

    2011-04-01

    Full Text Available The implementation of AMTs (Advanced Manufacturing Technologies has always been the high interest and core issue for the manufacturing enterprises to get rapid production for global market place. The developed countries have achieved its competitive advantage by implementing this unique model of technologies with full range of systems. In developing countries, the implementation of such technologies is not much common due to so many reasons, (political, social, economical and technical but entrepreneurs of growing economies are contemplating to reshape long term strategy to adopt Computer systems oriented technologies in their manufacturing companies to meet the growing needs of their indigenous market on one hand and to make a place in the international market on the other. Although, very few manufacturing organization do meet the global market requirements. But there is still lot of efforts to be taken for world class competition. An attempt has been made in this paper to develop a conceptual model taking in to account the three parameters such as, Direct, Indirect and Administrative AMTs. This research work further attempts to present an empirical data analysis conducted in the manufacturing enterprises in province of Sindh, Pakistan. The overall indigenous progress of manufacturing enterprises as according to the data collected from 60 companies reveals that the AMTs systems are partially understood and practiced that is also one of the cause towards slow progress of national exchequer.

  2. Development of Advanced Ceramic Manufacturing Technology; FINAL

    International Nuclear Information System (INIS)

    Pujari, V.K.

    2001-01-01

    Advanced structural ceramics are enabling materials for new transportation engine systems that have the potential for significantly reducing energy consumption and pollution in automobiles and heavy vehicles. Ceramic component reliability and performance have been demonstrated in previous U.S. DOE initiatives, but high manufacturing cost was recognized as a major barrier to commercialization. Norton Advanced Ceramics (NAC), a division of Saint-Gobain Industrial Ceramics, Inc. (SGIC), was selected to perform a major Advanced Ceramics Manufacturing Technology (ACMT) Program. The overall objectives of NAC's program were to design, develop, and demonstrate advanced manufacturing technology for the production of ceramic exhaust valves for diesel engines. The specific objectives were (1) to reduce the manufacturing cost by an order of magnitude, (2) to develop and demonstrate process capability and reproducibility, and (3) to validate ceramic valve performance, durability, and reliability. I n order to achieve these objectives, NAC, a leading U.S. advanced ceramics component manufacturer, assembled a multidisciplinary, vertically integrated team. This team included: a major diesel engine builder, Detroit Diesel Corporation (DDC); a corporate ceramics research division, SGIC's Northboro R and D Center; intelligent processing system developers, BDM Federal/MATSYS; a furnace equipment company, Centorr/Vacuum Industries; a sintering expert, Wittmer Consultants; a production OEM, Deco-Grand; a wheel manufacturer and grinding operation developer, Norton Company's Higgins Grinding Technology Center (HGTC); a ceramic machine shop, Chand Kare Technical Ceramics; and a manufacturing cost consultant, IBIS Associates. The program was divided into four major tasks: Component Design and Specification, Component Manufacturing Technology Development, Inspection and Testing, and Process Demonstration

  3. USCAR LEP ESST Advanced Manufacturing

    Energy Technology Data Exchange (ETDEWEB)

    Lazarus, L.J.

    2000-09-25

    The objective of this task was to provide processing information data summaries on powder metallurgy (PM) alloys that meet the partner requirements for the production of low mass, highly accurate, near-net-shape powertrain components. This required modification to existing ISO machinability test procedures and development of a new drilling test procedure. These summaries could then be presented in a web page format. When combined with information generated from the USCAR CRADA this would allow chemical, metallurgical, and machining data on PM alloys to be available to all engineering and manufacturing personnel that have access to in-house networks. The web page format also allows for the additions of other wrought materials, making this a valuable tool to the technical staffs.

  4. Advanced Manufacturing Technologies (AMT): Advanced Near Net Shape Technology

    Data.gov (United States)

    National Aeronautics and Space Administration — The objective of the Advanced Near Net Shape Technology (ANNST) project is to radically improve near net shape manufacturing methods from the current...

  5. Design for manufacturability with advanced lithography

    CERN Document Server

    Yu, Bei

    2016-01-01

    This book introduces readers to the most advanced research results on Design for Manufacturability (DFM) with multiple patterning lithography (MPL) and electron beam lithography (EBL).  The authors describe in detail a set of algorithms/methodologies to resolve issues in modern design for manufacturability problems with advanced lithography.  Unlike books that discuss DFM from the product level, or physical manufacturing level, this book describes DFM solutions from a circuit design level, such that most of the critical problems can be formulated and solved through combinatorial algorithms. Enables readers to tackle the challenge of layout decompositions for different patterning techniques; Presents a coherent framework, including standard cell compliance and detailed placement, to enable Triple Patterning Lithography (TPL) friendly design; Includes coverage of the design for manufacturability with E-Beam lithography.

  6. Advances in semiconductor photodetectors for scintillators

    International Nuclear Information System (INIS)

    Farrell, R.; Olschner, F.; Shah, K.; Squillante, M.R.

    1997-01-01

    Semiconductors photodetectors have long seemed an attractive alternative for scintillation detection, but only recently have semiconductor photodiodes been proven suitable for some room temperature applications. There are many applications, however for which the performance of standard silicon p-i-n photodiodes is not satisfactory. This article reviews recent progress in two different families of novel semiconductor photodetectors: (1) wide bandgap compound semiconductors and (2) silicon photodetectors with enhanced signal-to-noise ratio. The compounds discussed and compared in this paper are HgI 2 , PbI 2 , InI, TlBr, TlBr 1-x I x and HgBr 1-x I x . The paper will also examine unity gain silicon drift diodes and avalanche photodiodes with maximum room temperature gain greater than 10000. (orig.)

  7. Forecasting the Success of Implementing Sensors Advanced Manufacturing Technology

    Directory of Open Access Journals (Sweden)

    Cheng-Shih Su

    2014-08-01

    Full Text Available This paper is presented fuzzy preference relations approach to forecast the success of implementing sensors advanced manufacturing technology (AMT. In the manufacturing environment, performance measurement is based on different quantitative and qualitative factors. This study proposes an analytic hierarchical prediction model based on fuzzy preference relations to help the organizations become aware of the essential factors affecting the AMT implementation, forecasting the chance of successful implementing sensors AMT, as well as identifying the actions necessary before implementing sensors AMT. Then predicted success/failure values are obtained to enable organizations to decide whether to initiate sensors AMT, inhibit adoption or take remedial actions to increase the possibility of successful sensors AMT initiatives. This proposed approach is demonstrated with a real case study involving six influential factors assessed by nine evaluators solicited from a semiconductor engineering incorporation located in Taiwan.

  8. Advances in recombinant antibody manufacturing.

    Science.gov (United States)

    Kunert, Renate; Reinhart, David

    2016-04-01

    Since the first use of Chinese hamster ovary (CHO) cells for recombinant protein expression, production processes have steadily improved through numerous advances. In this review, we have highlighted several key milestones that have contributed to the success of CHO cells from the beginning of their use for monoclonal antibody (mAb) expression until today. The main factors influencing the yield of a production process are the time to accumulate a desired amount of biomass, the process duration, and the specific productivity. By comparing maximum cell densities and specific growth rates of various expression systems, we have emphasized the limiting parameters of different cellular systems and comprehensively described scientific approaches and techniques to improve host cell lines. Besides the quantitative evaluation of current systems, the quality-determining properties of a host cell line, namely post-translational modifications, were analyzed and compared to naturally occurring polyclonal immunoglobulin fractions from human plasma. In summary, numerous different expression systems for mAbs are available and also under scientific investigation. However, CHO cells are the most frequently investigated cell lines and remain the workhorse for mAb production until today.

  9. Development of Advanced Ceramic Manufacturing Technology

    Energy Technology Data Exchange (ETDEWEB)

    Pujari, V.K.

    2001-04-05

    Advanced structural ceramics are enabling materials for new transportation engine systems that have the potential for significantly reducing energy consumption and pollution in automobiles and heavy vehicles. Ceramic component reliability and performance have been demonstrated in previous U.S. DOE initiatives, but high manufacturing cost was recognized as a major barrier to commercialization. Norton Advanced Ceramics (NAC), a division of Saint-Gobain Industrial Ceramics, Inc. (SGIC), was selected to perform a major Advanced Ceramics Manufacturing Technology (ACMT) Program. The overall objectives of NAC's program were to design, develop, and demonstrate advanced manufacturing technology for the production of ceramic exhaust valves for diesel engines. The specific objectives were (1) to reduce the manufacturing cost by an order of magnitude, (2) to develop and demonstrate process capability and reproducibility, and (3) to validate ceramic valve performance, durability, and reliability. The program was divided into four major tasks: Component Design and Specification, Component Manufacturing Technology Development, Inspection and Testing, and Process Demonstration. A high-power diesel engine valve for the DDC Series 149 engine was chosen as the demonstration part for this program. This was determined to be an ideal component type to demonstrate cost-effective process enhancements, the beneficial impact of advanced ceramics on transportation systems, and near-term commercialization potential. The baseline valve material was NAC's NT451 SiAION. It was replaced, later in the program, by an alternate silicon nitride composition (NT551), which utilized a lower cost raw material and a simplified powder-processing approach. The material specifications were defined based on DDC's engine requirements, and the initial and final component design tasks were completed.

  10. Dissolved air flotation of polishing wastewater from semiconductor manufacturer.

    Science.gov (United States)

    Liu, J C; Lien, C Y

    2006-01-01

    The feasibility of the dissolved air flotation (DAF) process in treating chemical mechanical polishing (CMP) wastewater was evaluated in this study. Wastewater from a local semiconductor manufacturer was sampled and characterised. Nano-sized silica (77.6 nm) with turbidity of 130 +/- 3 NTU was found in the slightly alkaline wastewater with traces of other pollutants. Experimental results indicated removal efficiency of particles, measured as suspended particle or turbidity, increased with increasing concentration of cationic collector cetyltrimethyl ammonium bromide (CTAB). When CTAB concentration was 30 mg/L, pH of 6.5 +/- 0.1 and recycle ratio of 30%, very effective removal of particles (> 98%) was observed in saturation pressure range of 4 to 6 kg/cm2, and the reaction proceeded faster under higher pressure. Similarly, the reaction was faster under the higher recycle ratio, while final removal efficiency improved slightly as the recycle ratio increased from 20 to 40%. An insignificant effect of pH on treatment efficiency was found as pH varied from 4.5 to 8.5. The presence of activator, Al3+ and Fe3+, enhanced the system performance. It is proposed that CTAB adsorbs on silica particles in polishing wastewater through electrostatic interaction and makes particles more hydrophobic. The increase in hydrophobicity results in more effective bubble-particle collisions. In addition, flocculation of silica particles through bridging effect of collector was found; it is believed that flocculation of particles also contributed to flotation. Better attachment between gas bubble and solid, higher buoyancy and higher air to solid ratio all lead to effective flotation.

  11. Semiconductor device and method of manufacturing the same

    NARCIS (Netherlands)

    2009-01-01

    The invention relates to a semiconductor device (10) with a semiconductor body (12) comprising a bipolar transistor with an emitter region, a base region and a collector region (1, 2, 3) of, respectively, a first conductivity type, a second conductivity type opposite to the first conductivity type,

  12. Advanced Engineering Environments: Implications for Aerospace Manufacturing

    Science.gov (United States)

    Thomas, D.

    2001-01-01

    There are significant challenges facing today's aerospace industry. Global competition, more complex products, geographically-distributed design teams, demands for lower cost, higher reliability and safer vehicles, and the need to incorporate the latest technologies quicker all face the developer of aerospace systems. New information technologies offer promising opportunities to develop advanced engineering environments (AEEs) to meet these challenges. Significant advances in the state-of-the-art of aerospace engineering practice are envisioned in the areas of engineering design and analytical tools, cost and risk tools, collaborative engineering, and high-fidelity simulations early in the development cycle. These advances will enable modeling and simulation of manufacturing methods, which will in turn allow manufacturing considerations to be included much earlier in the system development cycle. Significant cost savings, increased quality, and decreased manufacturing cycle time are expected to result. This paper will give an overview of the NASA's Intelligent Synthesis Environment, the agency initiative to develop an AEE, with a focus on the anticipated benefits in aerospace manufacturing.

  13. A system approach to controlling semiconductor manufacturing operations

    OpenAIRE

    Σταυράκης, Γιώργος Δ.

    1987-01-01

    Semicoductor manufacturers, faced with stiffening competition in both product cost and quality, require improved utilization of their development and manufacturing resources. Manufacturing philosophy must be changed, from focusing on short term results, to support continuous improvements in both output and quality. Such improvements demand better information management to monitor and control the manufacturing process. From these considerations, a process control methodology was develope...

  14. New era of silicon technologies due to radical reaction based semiconductor manufacturing

    International Nuclear Information System (INIS)

    Ohmi, Tadahiro; Hirayama, Masaki; Teramoto, Akinobu

    2006-01-01

    Current semiconductor technology, the so-called the molecule reaction based semiconductor manufacturing, now faces a very severe standstill due to the drastic increase of gate leakage currents and drain leakage currents. Radical reaction based semiconductor manufacturing has been developed to completely overcome the current standstill by introducing microwave excited high density plasma with very low electron temperatures and without accompanying charge-up damage. The introduction of radical reaction based semiconductor manufacturing has made it possible to fabricate LSI devices on any crystal orientation Si substrate surface as well as (100) Si substrate surfaces, and to eliminate a very severe limitation to the antenna ratio in the circuit layout patterns, which is strictly limited to less than 100-200 in order to obtain a relatively high production yield. (topical review)

  15. Nanoimprint system development and status for high volume semiconductor manufacturing

    Science.gov (United States)

    Hiura, Hiromi; Takabayashi, Yukio; Takashima, Tsuneo; Emoto, Keiji; Choi, Jin; Schumaker, Phil

    2016-10-01

    Imprint lithography has been shown to be an effective technique for replication of nano-scale features. Jet and Flash Imprint Lithography* (J-FIL*) involves the field-by-field deposition and exposure of a low viscosity resist deposited by jetting technology onto the substrate. The patterned mask is lowered into the fluid which then quickly flows into the relief patterns in the mask by capillary action. Following this filling step, the resist is crosslinked under UV radiation, and then the mask is removed, leaving a patterned resist on the substrate. There are many criteria that determine whether a particular technology is ready for wafer manufacturing. For imprint lithography, recent attention has been given to the areas of overlay, throughput, defectivity, and mask replication. This paper reviews progress in these critical areas. Recent demonstrations have proven that mix and match overlay of less than 5nm can achieved. Further reductions require a higher order correction system. Modeling and experimental data are presented which provide a path towards reducing the overlay errors to less than 3nm. Throughput is mainly impacted by the fill time of the relief images on the mask. Improvement in resist materials provides a solution that allows 15 wafers per hour per station, or a tool throughput of 60 wafers per hour. Defectivity and mask life play a significant role relative to meeting the cost of ownership (CoO) requirements in the production of semiconductor devices. Hard particles on a wafer or mask create the possibility of inducing a permanent defect on the mask that can impact device yield and mask life. By using material methods to reduce particle shedding and by introducing an air curtain system, the lifetime of both the master mask and the replica mask can be extended. In this work, we report results that demonstrate a path towards achieving mask lifetimes of better than 1000 wafers. Finally, on the mask side, a new replication tool, the FPA-1100NR2 is

  16. 75 FR 879 - National Semiconductor Corporation Arlington Manufacturing Site Including On-Site Leased Workers...

    Science.gov (United States)

    2010-01-06

    ... engaged in activities related to the production of integrated circuits. The company reports that on-site... Corporation Arlington Manufacturing Site Including On-Site Leased Workers From GCA, CMPA (Silverleaf), Custom..., applicable to workers of National Semiconductor Corporation, Arlington Manufacturing Site, including on-site...

  17. EDITORIAL: Extreme Ultraviolet Light Sources for Semiconductor Manufacturing

    Science.gov (United States)

    Attwood, David

    2004-12-01

    The International Technology Roadmap for Semiconductors (ITRS) [1] provides industry expectations for high volume computer chip fabrication a decade into the future. It provides expectations to anticipated performance and requisite specifications. While the roadmap provides a collective projection of what international industry expects to produce, it does not specify the technology that will be employed. Indeed, there are generally several competing technologies for each two or three year step forward—known as `nodes'. Recent successful technologies have been based on KrF (248 nm), and now ArF (193 nm) lasers, combined with ultraviolet transmissive refractive optics, in what are known as step and scan exposure tools. Less fortunate technologies in the recent past have included soft x-ray proximity printing and, it appears, 157 nm wavelength F2 lasers. In combination with higher numerical aperture liquid emersion optics, 193 nm is expected to be used for the manufacture of leading edge chip performance for the coming five years. Beyond that, starting in about 2009, the technology to be employed is less clear. The leading candidate for the 2009 node is extreme ultraviolet (EUV) lithography, however this requires that several remaining challenges, including sufficient EUV source power, be overcome in a timely manner. This technology is based on multilayer coated reflective optics [2] and an EUV emitting plasma. Following Moore's Law [3] it is expected, for example, that at the 2009 `32 nm node' (printable patterns of 32 nm half-pitch), isolated lines with 18 nm width will be formed in resist (using threshold effects), and that these will be further narrowed to 13 nm in transfer to metalized electronic gates. These narrow features are expected to provide computer chips of 19 GHz clock frequency, with of the order of 1.5 billion transistors per chip [1]. This issue of Journal of Physics D: Applied Physics contains a cluster of eight papers addressing the critical

  18. A Review of Related Work on Machine Learning in Semiconductor Manufacturing and Assembly Lines

    OpenAIRE

    Stanisavljevic, Darko; Spitzer, Michael

    2017-01-01

    This paper deals with applications of machine learning algorithms in manufacturing. Machine learning can be defined as a field of computer science that gives computers the ability to learn without explicitly developing the needed algorithms. Manufacturing is the production of merchandise by manual labour, machines and tools. The focus of this paper is on automatic production lines. The areas of interest of this paper are semiconductor manufacturing and production on assembly lines. The purpos...

  19. NASA's National Center for Advanced Manufacturing

    Science.gov (United States)

    Vickers, John

    2003-01-01

    NASA has designated the Principal Center Assignment to the Marshall Space Flight Center (MSFC) for implementation of the National Center for Advanced Manufacturing (NCAM). NCAM is NASA s leading resource for the aerospace manufacturing research, development, and innovation needs that are critical to the goals of the Agency. Through this initiative NCAM s people work together with government, industry, and academia to ensure the technology base and national infrastructure are available to develop innovative manufacturing technologies with broad application to NASA Enterprise programs, and U.S. industry. Educational enhancements are ever-present within the NCAM focus to promote research, to inspire participation and to support education and training in manufacturing. Many important accomplishments took place during 2002. Through NCAM, NASA was among five federal agencies involved in manufacturing research and development (R&D) to launch a major effort to exchange information and cooperate directly to enhance the payoffs from federal investments. The Government Agencies Technology Exchange in Manufacturing (GATE-M) is the only active effort to specifically and comprehensively address manufacturing R&D across the federal government. Participating agencies include the departments of Commerce (represented by the National Institute of Standards and Technology), Defense, and Energy, as well as the National Science Foundation and NASA. MSFC s ongoing partnership with the State of Louisiana, the University of New Orleans, and Lockheed Martin Corporation at the Michoud Assembly Facility (MAF) progressed significantly. Major capital investments were initiated for world-class equipment additions including a universal friction stir welding system, composite fiber placement machine, five-axis machining center, and ten-axis laser ultrasonic nondestructive test system. The NCAM consortium of five universities led by University of New Orleans with Mississippi State University

  20. Advanced manufacturing: optimising the factories of tomorrow

    International Nuclear Information System (INIS)

    Philippon, Patrick

    2013-01-01

    Faced with competition Patrick Philippon - Les Defis du CEA no.179 - April 2013 from the emerging countries, the competitiveness of the industrialised nations depends on the ability of their industries to innovate. This strategy necessarily entails the reorganisation and optimisation of the production systems. This is the whole challenge for 'advanced manufacturing', which relies on the new information and communication technologies. Interactive robotics, virtual reality and non-destructive testing are all technological building blocks developed by CEA, now approved within a cross-cutting programme, to meet the needs of industry and together build the factories of tomorrow. (author)

  1. Launching the dialogue: Safety and innovation as partners for success in advanced manufacturing.

    Science.gov (United States)

    Geraci, C L; Tinkle, S S; Brenner, S A; Hodson, L L; Pomeroy-Carter, C A; Neu-Baker, N

    2018-06-01

    Emerging and novel technologies, materials, and information integrated into increasingly automated and networked manufacturing processes or into traditional manufacturing settings are enhancing the efficiency and productivity of manufacturing. Globally, there is a move toward a new era in manufacturing that is characterized by: (1) the ability to create and deliver more complex designs of products; (2) the creation and use of materials with new properties that meet a design need; (3) the employment of new technologies, such as additive and digital techniques that improve on conventional manufacturing processes; and (4) a compression of the time from initial design concept to the creation of a final product. Globally, this movement has many names, but "advanced manufacturing" has become the shorthand for this complex integration of material and technology elements that enable new ways to manufacture existing products, as well as new products emerging from new technologies and new design methods. As the breadth of activities associated with advanced manufacturing suggests, there is no single advanced manufacturing industry. Instead, aspects of advanced manufacturing can be identified across a diverse set of business sectors that use manufacturing technologies, ranging from the semiconductors and electronics to the automotive and pharmaceutical industries. The breadth and diversity of advanced manufacturing may change the occupational and environmental risk profile, challenge the basic elements of comprehensive health and safety (material, process, worker, environment, product, and general public health and safety), and provide an opportunity for development and dissemination of occupational and environmental health and safety (OEHS) guidance and best practices. It is unknown how much the risk profile of different elements of OEHS will change, thus requiring an evolution of health and safety practices. These changes may be accomplished most effectively through multi

  2. A Systematic Cycle Time Reduction Procedure for Enhancing the Competitiveness and Sustainability of a Semiconductor Manufacturer

    Directory of Open Access Journals (Sweden)

    Toly Chen

    2013-11-01

    Full Text Available Cycle time reduction plays an important role in improving the competitiveness and sustainability of a semiconductor manufacturer. However, in the past, cycle time reduction was usually unplanned owing to the lack of a systematic and quantitative procedure. To tackle this problem, a systematic procedure was established in this study for planning cycle time reduction actions to enhance the competitiveness and sustainability of a semiconductor manufacturer. First, some controllable factors that are influential to the job cycle time are identified. Subsequently, the relationship between the controllable factors and the job cycle time is fitted with a back propagation network. Based on this relationship, actions to shorten the job cycle time can be planned. The feasibility and effectiveness of an action have to be assessed before it can be taken in practice. An example containing the real data of hundreds of jobs has been used to illustrate the applicability of the proposed methodology. In addition, the financial benefits of the cycle time reduction action were analyzed, which provided the evidence that the proposed methodology enabled the sustainable development of the semiconductor manufacturer, since capital adequacy is very important in the semiconductor manufacturing industry.

  3. Study on Measurement of Advanced Manufacturing: Case by China

    Directory of Open Access Journals (Sweden)

    She Jinghuai

    2017-01-01

    Full Text Available This article has built a system of China's Advanced Manufacturing measurement indicators. By applying the datum from 2004 to 2013, we estimate the level of development and current status of China’s Advanced Manufacturing (AM, and evaluate the measurement results by establishing Hierarchical Linear Model (HLM. We confirmed that China's Advanced Manufacturing is in the rapid development trend. And due to the difference of initial conditions in Advanced Manufacturing development there is a greater imbalance. In contrast, a region with poor initial condition of has a relatively fast development speed.

  4. 2014 Joint Conference on Mechanical Design Engineering and Advanced Manufacturing

    CERN Document Server

    Daidie, Alain; Eynard, Benoit; Paredes, Manuel

    2016-01-01

    Covering key topics in the field such as technological innovation, human-centered sustainable engineering and manufacturing, and manufacture at a global scale in a virtual world, this book addresses both advanced techniques and industrial applications of key research in interactive design and manufacturing. Featuring the full papers presented at the 2014 Joint Conference on Mechanical Design Engineering and Advanced Manufacturing, which took place in June 2014 in Toulouse, France, it presents recent research and industrial success stories related to implementing interactive design and manufacturing solutions.

  5. Advanced single-wafer sequential multiprocessing techniques for semiconductor device fabrication

    International Nuclear Information System (INIS)

    Moslehi, M.M.; Davis, C.

    1989-01-01

    Single-wafer integrated in-situ multiprocessing (SWIM) is recognized as the future trend for advanced microelectronics production in flexible fast turn- around computer-integrated semiconductor manufacturing environments. The SWIM equipment technology and processing methodology offer enhanced equipment utilization, improved process reproducibility and yield, and reduced chip manufacturing cost. They also provide significant capabilities for fabrication of new and improved device structures. This paper describes the SWIM techniques and presents a novel single-wafer advanced vacuum multiprocessing technology developed based on the use of multiple process energy/activation sources (lamp heating and remote microwave plasma) for multilayer epitaxial and polycrystalline semiconductor as well as dielectric film processing. Based on this technology, multilayer in-situ-doped homoepitaxial silicon and heteroepitaxial strained layer Si/Ge x Si 1 - x /Si structures have been grown and characterized. The process control and the ultimate interfacial abruptness of the layer-to-layer transition widths in the device structures prepared by this technology will challenge the MBE techniques in multilayer epitaxial growth applications

  6. Particle dispersing system and method for testing semiconductor manufacturing equipment

    Science.gov (United States)

    Chandrachood, Madhavi; Ghanayem, Steve G.; Cantwell, Nancy; Rader, Daniel J.; Geller, Anthony S.

    1998-01-01

    The system and method prepare a gas stream comprising particles at a known concentration using a particle disperser for moving particles from a reservoir of particles into a stream of flowing carrier gas. The electrostatic charges on the particles entrained in the carrier gas are then neutralized or otherwise altered, and the resulting particle-laden gas stream is then diluted to provide an acceptable particle concentration. The diluted gas stream is then split into a calibration stream and the desired output stream. The particles in the calibration stream are detected to provide an indication of the actual size distribution and concentration of particles in the output stream that is supplied to a process chamber being analyzed. Particles flowing out of the process chamber within a vacuum pumping system are detected, and the output particle size distribution and concentration are compared with the particle size distribution and concentration of the calibration stream in order to determine the particle transport characteristics of a process chamber, or to determine the number of particles lodged in the process chamber as a function of manufacturing process parameters such as pressure, flowrate, temperature, process chamber geometry, particle size, particle charge, and gas composition.

  7. Advanced Manufacturing Technologies (AMT): Composites Integrated Modeling

    Data.gov (United States)

    National Aeronautics and Space Administration — The Composites Integrated Modeling (CIM) Element developed low cost, lightweight, and efficient composite structures, materials and manufacturing technologies with...

  8. Advanced Semiconductor Heterostructures Novel Devices, Potential Device Applications and Basic Properties

    CERN Document Server

    Stroscio, Michael A

    2003-01-01

    This volume provides valuable summaries on many aspects of advanced semiconductor heterostructures and highlights the great variety of semiconductor heterostructures that has emerged since their original conception. As exemplified by the chapters in this book, recent progress on advanced semiconductor heterostructures spans a truly remarkable range of scientific fields with an associated diversity of applications. Some of these applications will undoubtedly revolutionize critically important facets of modern technology. At the heart of these advances is the ability to design and control the pr

  9. Biocompatibility of Advanced Manufactured Titanium Implants—A Review

    Science.gov (United States)

    Sidambe, Alfred T.

    2014-01-01

    Titanium (Ti) and its alloys may be processed via advanced powder manufacturing routes such as additive layer manufacturing (or 3D printing) or metal injection moulding. This field is receiving increased attention from various manufacturing sectors including the medical devices sector. It is possible that advanced manufacturing techniques could replace the machining or casting of metal alloys in the manufacture of devices because of associated advantages that include design flexibility, reduced processing costs, reduced waste, and the opportunity to more easily manufacture complex or custom-shaped implants. The emerging advanced manufacturing approaches of metal injection moulding and additive layer manufacturing are receiving particular attention from the implant fabrication industry because they could overcome some of the difficulties associated with traditional implant fabrication techniques such as titanium casting. Using advanced manufacturing, it is also possible to produce more complex porous structures with improved mechanical performance, potentially matching the modulus of elasticity of local bone. While the economic and engineering potential of advanced manufacturing for the manufacture of musculo-skeletal implants is therefore clear, the impact on the biocompatibility of the materials has been less investigated. In this review, the capabilities of advanced powder manufacturing routes in producing components that are suitable for biomedical implant applications are assessed with emphasis placed on surface finishes and porous structures. Given that biocompatibility and host bone response are critical determinants of clinical performance, published studies of in vitro and in vivo research have been considered carefully. The review concludes with a future outlook on advanced Ti production for biomedical implants using powder metallurgy. PMID:28788296

  10. Biocompatibility of Advanced Manufactured Titanium Implants—A Review

    Directory of Open Access Journals (Sweden)

    Alfred T. Sidambe

    2014-12-01

    Full Text Available Titanium (Ti and its alloys may be processed via advanced powder manufacturing routes such as additive layer manufacturing (or 3D printing or metal injection moulding. This field is receiving increased attention from various manufacturing sectors including the medical devices sector. It is possible that advanced manufacturing techniques could replace the machining or casting of metal alloys in the manufacture of devices because of associated advantages that include design flexibility, reduced processing costs, reduced waste, and the opportunity to more easily manufacture complex or custom-shaped implants. The emerging advanced manufacturing approaches of metal injection moulding and additive layer manufacturing are receiving particular attention from the implant fabrication industry because they could overcome some of the difficulties associated with traditional implant fabrication techniques such as titanium casting. Using advanced manufacturing, it is also possible to produce more complex porous structures with improved mechanical performance, potentially matching the modulus of elasticity of local bone. While the economic and engineering potential of advanced manufacturing for the manufacture of musculo-skeletal implants is therefore clear, the impact on the biocompatibility of the materials has been less investigated. In this review, the capabilities of advanced powder manufacturing routes in producing components that are suitable for biomedical implant applications are assessed with emphasis placed on surface finishes and porous structures. Given that biocompatibility and host bone response are critical determinants of clinical performance, published studies of in vitro and in vivo research have been considered carefully. The review concludes with a future outlook on advanced Ti production for biomedical implants using powder metallurgy.

  11. Biocompatibility of Advanced Manufactured Titanium Implants-A Review.

    Science.gov (United States)

    Sidambe, Alfred T

    2014-12-19

    Titanium (Ti) and its alloys may be processed via advanced powder manufacturing routes such as additive layer manufacturing (or 3D printing) or metal injection moulding. This field is receiving increased attention from various manufacturing sectors including the medical devices sector. It is possible that advanced manufacturing techniques could replace the machining or casting of metal alloys in the manufacture of devices because of associated advantages that include design flexibility, reduced processing costs, reduced waste, and the opportunity to more easily manufacture complex or custom-shaped implants. The emerging advanced manufacturing approaches of metal injection moulding and additive layer manufacturing are receiving particular attention from the implant fabrication industry because they could overcome some of the difficulties associated with traditional implant fabrication techniques such as titanium casting. Using advanced manufacturing, it is also possible to produce more complex porous structures with improved mechanical performance, potentially matching the modulus of elasticity of local bone. While the economic and engineering potential of advanced manufacturing for the manufacture of musculo-skeletal implants is therefore clear, the impact on the biocompatibility of the materials has been less investigated. In this review, the capabilities of advanced powder manufacturing routes in producing components that are suitable for biomedical implant applications are assessed with emphasis placed on surface finishes and porous structures. Given that biocompatibility and host bone response are critical determinants of clinical performance, published studies of in vitro and in vivo research have been considered carefully. The review concludes with a future outlook on advanced Ti production for biomedical implants using powder metallurgy.

  12. Organizational Considerations for Advanced Manufacturing Technology

    Science.gov (United States)

    DeRuntz, Bruce D.; Turner, Roger M.

    2003-01-01

    In the last several decades, the United States has experienced a decline in productivity, while the world has seen a maturation of the global marketplace. Nations have moved manufacturing strategy and process technology issues to the top of management priority lists. The issues surrounding manufacturing technologies and their implementations have…

  13. 75 FR 81643 - In the Matter of Certain Semiconductor Products Made by Advanced Lithography Techniques and...

    Science.gov (United States)

    2010-12-28

    ... Semiconductor Products Made by Advanced Lithography Techniques and Products Containing Same; Notice of... Mexico) (``STC''), alleging a violation of section 337 in the importation, sale for [[Page 81644

  14. Advanced Material Strategies for Next-Generation Additive Manufacturing

    Science.gov (United States)

    Chang, Jinke; He, Jiankang; Zhou, Wenxing; Lei, Qi; Li, Xiao; Li, Dichen

    2018-01-01

    Additive manufacturing (AM) has drawn tremendous attention in various fields. In recent years, great efforts have been made to develop novel additive manufacturing processes such as micro-/nano-scale 3D printing, bioprinting, and 4D printing for the fabrication of complex 3D structures with high resolution, living components, and multimaterials. The development of advanced functional materials is important for the implementation of these novel additive manufacturing processes. Here, a state-of-the-art review on advanced material strategies for novel additive manufacturing processes is provided, mainly including conductive materials, biomaterials, and smart materials. The advantages, limitations, and future perspectives of these materials for additive manufacturing are discussed. It is believed that the innovations of material strategies in parallel with the evolution of additive manufacturing processes will provide numerous possibilities for the fabrication of complex smart constructs with multiple functions, which will significantly widen the application fields of next-generation additive manufacturing. PMID:29361754

  15. Advanced Material Strategies for Next-Generation Additive Manufacturing.

    Science.gov (United States)

    Chang, Jinke; He, Jiankang; Mao, Mao; Zhou, Wenxing; Lei, Qi; Li, Xiao; Li, Dichen; Chua, Chee-Kai; Zhao, Xin

    2018-01-22

    Additive manufacturing (AM) has drawn tremendous attention in various fields. In recent years, great efforts have been made to develop novel additive manufacturing processes such as micro-/nano-scale 3D printing, bioprinting, and 4D printing for the fabrication of complex 3D structures with high resolution, living components, and multimaterials. The development of advanced functional materials is important for the implementation of these novel additive manufacturing processes. Here, a state-of-the-art review on advanced material strategies for novel additive manufacturing processes is provided, mainly including conductive materials, biomaterials, and smart materials. The advantages, limitations, and future perspectives of these materials for additive manufacturing are discussed. It is believed that the innovations of material strategies in parallel with the evolution of additive manufacturing processes will provide numerous possibilities for the fabrication of complex smart constructs with multiple functions, which will significantly widen the application fields of next-generation additive manufacturing.

  16. Advanced Material Strategies for Next-Generation Additive Manufacturing

    Directory of Open Access Journals (Sweden)

    Jinke Chang

    2018-01-01

    Full Text Available Additive manufacturing (AM has drawn tremendous attention in various fields. In recent years, great efforts have been made to develop novel additive manufacturing processes such as micro-/nano-scale 3D printing, bioprinting, and 4D printing for the fabrication of complex 3D structures with high resolution, living components, and multimaterials. The development of advanced functional materials is important for the implementation of these novel additive manufacturing processes. Here, a state-of-the-art review on advanced material strategies for novel additive manufacturing processes is provided, mainly including conductive materials, biomaterials, and smart materials. The advantages, limitations, and future perspectives of these materials for additive manufacturing are discussed. It is believed that the innovations of material strategies in parallel with the evolution of additive manufacturing processes will provide numerous possibilities for the fabrication of complex smart constructs with multiple functions, which will significantly widen the application fields of next-generation additive manufacturing.

  17. Advances in solid dosage form manufacturing technology.

    Science.gov (United States)

    Andrews, Gavin P

    2007-12-15

    Currently, the pharmaceutical and healthcare industries are moving through a period of unparalleled change. Major multinational pharmaceutical companies are restructuring, consolidating, merging and more importantly critically assessing their competitiveness to ensure constant growth in an ever-more demanding market where the cost of developing novel products is continuously increasing. The pharmaceutical manufacturing processes currently in existence for the production of solid oral dosage forms are associated with significant disadvantages and in many instances provide many processing problems. Therefore, it is well accepted that there is an increasing need for alternative processes to dramatically improve powder processing, and more importantly to ensure that acceptable, reproducible solid dosage forms can be manufactured. Consequently, pharmaceutical companies are beginning to invest in innovative processes capable of producing solid dosage forms that better meet the needs of the patient while providing efficient manufacturing operations. This article discusses two emerging solid dosage form manufacturing technologies, namely hot-melt extrusion and fluidized hot-melt granulation.

  18. Advanced Blade Manufacturing Project - Final Report

    Energy Technology Data Exchange (ETDEWEB)

    POORE, ROBERT Z.

    1999-08-01

    The original scope of the project was to research improvements to the processes and materials used in the manufacture of wood-epoxy blades, conduct tests to qualify any new material or processes for use in blade design and subsequently build and test six blades using the improved processes and materials. In particular, ABM was interested in reducing blade cost and improving quality. In addition, ABM needed to find a replacement material for the mature Douglas fir used in the manufacturing process. The use of mature Douglas fir is commercially unacceptable because of its limited supply and environmental concerns associated with the use of mature timber. Unfortunately, the bankruptcy of FloWind in June 1997 and a dramatic reduction in AWT sales made it impossible for ABM to complete the full scope of work. However, sufficient research and testing were completed to identify several promising changes in the blade manufacturing process and develop a preliminary design incorporating these changes.

  19. Evaluation of Advanced Polymers for Additive Manufacturing

    Energy Technology Data Exchange (ETDEWEB)

    Rios, Orlando [Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States); Carter, William G. [Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States); Kutchko, Cindy [PPG Industries, Pittsburgh, PA (United States); Fenn, David [PPG Industries, Pittsburgh, PA (United States); Olson, Kurt [PPG Industries, Pittsburgh, PA (United States)

    2017-09-08

    The goal of this Manufacturing Demonstration Facility (MDF) technical collaboration project between Oak Ridge National Laboratory (ORNL) and PPG Industries, Inc. (PPG) was to evaluate the feasibility of using conventional coatings chemistry and technology to build up material layer-by-layer. The PPG-ORNL study successfully demonstrated that polymeric coatings formulations may overcome many limitations of common thermoplastics used in additive manufacturing (AM), allow lightweight nozzle design for material deposition, and increase build rate. The materials effort focused on layer-by-layer deposition of coatings with each layer fusing together. The combination of materials and deposition results in an additively manufactured build that has sufficient mechanical properties to bear the load of additional layers, yet is capable of bonding across the z-layers to improve build direction strength. The formulation properties were tuned to enable a novel, high-throughput deposition method that is highly scalable, compatible with high loading of reinforcing fillers, and inherently low-cost.

  20. SETEC/Semiconductor Manufacturing Technologies Program: 1999 Annual and Final Report

    Energy Technology Data Exchange (ETDEWEB)

    MCBRAYER,JOHN D.

    2000-12-01

    This report summarizes the results of work conducted by the Semiconductor Manufacturing Technologies Program at Sandia National Laboratories (Sandia) during 1999. This work was performed by one working group: the Semiconductor Equipment Technology Center (SETEC). The group's projects included Numerical/Experimental Characterization of the Growth of Single-Crystal Calcium Fluoride (CaF{sub 2}); The Use of High-Resolution Transmission Electron Microscopy (HRTEM) Imaging for Certifying Critical-Dimension Reference Materials Fabricated with Silicon Micromachining; Assembly Test Chip for Flip Chip on Board; Plasma Mechanism Validation: Modeling and Experimentation; and Model-Based Reduction of Contamination in Gate-Quality Nitride Reactor. During 1999, all projects focused on meeting customer needs in a timely manner and ensuring that projects were aligned with the goals of the National Technology Roadmap for Semiconductors sponsored by the Semiconductor Industry Association and with Sandia's defense mission. This report also provides a short history of the Sandia/SEMATECH relationship and a brief on all projects completed during the seven years of the program.

  1. The Vulcan Advanced Hybrid Manufacturing System, Phase I

    Data.gov (United States)

    National Aeronautics and Space Administration — Made In Space is developing the The Vulcan Advanced Hybrid Manufacturing System (VULCAN) to address NASA's requirement to produce high-strength, high-precision...

  2. Product manufacturing, quality, and reliability initiatives to maintain a competitive advantage and meet customer expectations in the semiconductor industry

    Science.gov (United States)

    Capps, Gregory

    Semiconductor products are manufactured and consumed across the world. The semiconductor industry is constantly striving to manufacture products with greater performance, improved efficiency, less energy consumption, smaller feature sizes, thinner gate oxides, and faster speeds. Customers have pushed towards zero defects and require a more reliable, higher quality product than ever before. Manufacturers are required to improve yields, reduce operating costs, and increase revenue to maintain a competitive advantage. Opportunities exist for integrated circuit (IC) customers and manufacturers to work together and independently to reduce costs, eliminate waste, reduce defects, reduce warranty returns, and improve quality. This project focuses on electrical over-stress (EOS) and re-test okay (RTOK), two top failure return mechanisms, which both make great defect reduction opportunities in customer-manufacturer relationship. Proactive continuous improvement initiatives and methodologies are addressed with emphasis on product life cycle, manufacturing processes, test, statistical process control (SPC), industry best practices, customer education, and customer-manufacturer interaction.

  3. The Flexible Foundry: Advanced Reconfigurable Manufacturing for Semiconductors

    Data.gov (United States)

    Federal Laboratory Consortium —  Sometimes it is not a device that is obsolete, but an idea. In logistics terms, the problem is not that the device becomes obsolete; the problem is that the device...

  4. Prolonged menstrual cycles in female workers exposed to ethylene glycol ethers in the semiconductor manufacturing industry.

    Science.gov (United States)

    Hsieh, G-Y; Wang, J-D; Cheng, T-J; Chen, P-C

    2005-08-01

    It has been shown that female workers exposed to ethylene glycol ethers (EGEs) in the semiconductor industry have higher risks of spontaneous abortion, subfertility, and menstrual disturbances, and prolonged waiting time to pregnancy. To examine whether EGEs or other chemicals are associated with long menstrual cycles in female workers in the semiconductor manufacturing industry. Cross-sectional questionnaire survey during the annual health examination at a wafer manufacturing company in Taiwan in 1997. A three tiered exposure-assessment strategy was used to analyse the risk. A short menstrual cycle was defined to be a cycle less than 24 days and a long cycle to be more than 35 days. There were 606 valid questionnaires from 473 workers in fabrication jobs and 133 in non-fabrication areas. Long menstrual cycles were associated with workers in fabrication areas compared to those in non-fabrication areas. Using workers in non-fabrication areas as referents, workers in photolithography and diffusion areas had higher risks for long menstrual cycles. Workers exposed to EGEs and isopropanol, and hydrofluoric acid, isopropanol, and phosphorous compounds also showed increased risks of a long menstrual cycle. Exposure to multiple chemicals, including EGEs in photolithography, might be associated with long menstrual cycles, and may play an important role in a prolonged time to pregnancy in the wafer manufacturing industry; however, the prevalence in the design, possible exposure misclassification, and chance should be considered.

  5. Emerging Global Trends in Advanced Manufacturing

    Science.gov (United States)

    2012-03-01

    facility. Such distributed manufacturing could be made accessible to large masses even in remote areas (Ehmann 2011). For example, Zara is a Spanish...consumers. It has tightened its supply-chain management so that the consumer “pulls” the design. Zara uses state-of-the-art IT and distribution...systems to collect data daily on trends so they can quickly turn out new designs. Zara keeps costs down by using existing materials in stock and through

  6. Manufacturing Theory for Advanced Grid Stiffened Structures

    National Research Council Canada - National Science Library

    Huybrechts, Steven M; Meink, Troy E; Wegner, Peter M; Ganley, Jeff M

    2002-01-01

    Lattices of rigidly connected ribs, known as advanced grid stiffened (AGS) structures, have many advantages over traditional construction methods, which use panels, sandwich cores and/or expensive frameworks...

  7. Advances in 3D printing & additive manufacturing technologies

    CERN Document Server

    Pandey, Pulak; Kumar, L

    2017-01-01

    This edited volume comprises select chapters on advanced technologies for 3D printing and additive manufacturing and how these technologies have changed the face of direct, digital technologies for rapid production of models, prototypes and patterns. Because of its wide applications, 3D printing and additive manufacturing technology has become a powerful new industrial revolution in the field of manufacturing. The evolution of 3D printing and additive manufacturing technologies has changed design, engineering and manufacturing processes across industries such as consumer products, aerospace, medical devices and automotives. The objective of this book is to help designers, R&D personnel, and practicing engineers understand the state-of-the-art developments in the field of 3D Printing and Additive Manufacturing. .

  8. Recent Advances in Precision Machinery and Manufacturing Technology

    DEFF Research Database (Denmark)

    Liu, Chien-Hung; Hsieh, Wen-Hsiang; Chang, Zong-Yu

    2014-01-01

    Precision machinery and manufacturing technology are be- coming more important in current and future technologies. New knowledge in this field will aid in the advancement of various technologies that are needed to gain industrial competitiveness. To this end, the special issue aims to disseminate...... the latest advancements of relevant fundamental and applied research works of high quality to the inter- national community. The topics of the accepted articles in the special issue include precision manufacturing pro- cesses, measurements and control, robotics and automation, machine tools, advanced...

  9. Analytical chemistry in semiconductor manufacturing: Techniques, role of nuclear methods and need for quality control

    International Nuclear Information System (INIS)

    1989-06-01

    This report is the result of a consultants meeting held in Gaithersburg, USA, 2-3 October 1987. The meeting was hosted by the National Bureau of Standards and Technology, and it was attended by 18 participants from Denmark, Finland, India, Japan, Norway, People's Republic of China and the USA. The purpose of the meeting was to assess the present status of analytical chemistry in semiconductor manufacturing, the role of nuclear analytical methods and the need for internationally organized quality control of the chemical analysis. The report contains the three presentations in full and a summary report of the discussions. Thus, it gives an overview of the need of analytical chemistry in manufacturing of silicon based devices, the use of nuclear analytical methods, and discusses the need for quality control. Refs, figs and tabs

  10. Advancing lean manufacturing, the role of IT

    NARCIS (Netherlands)

    Riezebos, J.; Klingenberg, W.

    This introduction to the special issue discusses the changing role of information technology (IT) in advancing lean production. Lean principles and techniques have been applied in a wide variety of organisations, from make-to-stock to engineer-to-order industries, and even in typical service

  11. Advances in the manufacture of MIP nanoparticles.

    Science.gov (United States)

    Poma, Alessandro; Turner, Anthony P F; Piletsky, Sergey A

    2010-12-01

    Molecularly imprinted polymers (MIPs) are prepared by creating a three-dimensional polymeric matrix around a template molecule. After the matrix is removed, complementary cavities with respect to shape and functional groups remain. MIPs have been produced for applications in in vitro diagnostics, therapeutics and separations. However, this promising technology still lacks widespread application because of issues related to large-scale production and optimization of the synthesis. Recent developments in the area of MIP nanoparticles might offer solutions to several problems associated with performance and application. This review discusses various approaches used in the preparation of MIP nanoparticles, focusing in particular on the issues associated with large-scale manufacture and implications for the performance of synthesized nanomaterials. Copyright © 2010 Elsevier Ltd. All rights reserved.

  12. Exploring the evolution of investment pattern on advanced manufacturing technology

    DEFF Research Database (Denmark)

    Yang, Cheng; Matthiesen, Rikke Vestergaard; Johansen, John

    2014-01-01

    This paper explores the evolution of investment pattern on advanced manufacturing technology in a manner that builds on a longitudinal perspective. Based on the data of investments in AMTs from 567 manufacturing companies this paper develops a longitudinal taxonomy defined by the evolution of inv...... of technology management, which is comprised primarily of cross-sectional studies that do not address the dynamic nature of investments in AMTs.......This paper explores the evolution of investment pattern on advanced manufacturing technology in a manner that builds on a longitudinal perspective. Based on the data of investments in AMTs from 567 manufacturing companies this paper develops a longitudinal taxonomy defined by the evolution...... of investment patterns on AMT followed by companies over time; identifies the possible evolutionary features of different groups of companies; and suggests the possible explanatory and outcome factors on the evolution of investment pattern on AMTs. By doing so, this study seeks to fill a void in the area...

  13. International Joint Conference on Mechanics, Design Engineering & Advanced Manufacturing

    CERN Document Server

    Nigrelli, Vincenzo; Oliveri, Salvatore; Peris-Fajarnes, Guillermo; Rizzuti, Sergio

    2017-01-01

    This book gathers papers presented at the International Joint Conference on Mechanics, Design Engineering and Advanced Manufacturing (JCM 2016), held on 14-16 September, 2016, in Catania, Italy. It reports on cutting-edge topics in product design and manufacturing, such as industrial methods for integrated product and process design; innovative design; and computer-aided design. Further topics covered include virtual simulation and reverse engineering; additive manufacturing; product manufacturing; engineering methods in medicine and education; representation techniques; and nautical, aeronautics and aerospace design and modeling. The book is divided into eight main sections, reflecting the focus and primary themes of the conference. The contributions presented here will not only provide researchers, engineers and experts in a range of industrial engineering subfields with extensive information to support their daily work; they are also intended to stimulate new research directions, advanced applications of t...

  14. Forecasting the Success of Implementing Sensors Advanced Manufacturing Technology

    OpenAIRE

    Cheng-Shih Su; Shu-Chen Hsu

    2014-01-01

    This paper is presented fuzzy preference relations approach to forecast the success of implementing sensors advanced manufacturing technology (AMT). In the manufacturing environment, performance measurement is based on different quantitative and qualitative factors. This study proposes an analytic hierarchical prediction model based on fuzzy preference relations to help the organizations become aware of the essential factors affecting the AMT implementation, forecasting the chance of successf...

  15. The Environmental Impact of Advanced Manufacturing Technologies: Examples from Hungary

    OpenAIRE

    Andrea Szalavetz

    2017-01-01

    The purpose of the paper is to demonstrate the beneficial impact of advanced manufacturing technologies (AMT) on firms’ environmental performance. Drawing on interviews conducted with 16 Hungarian manufacturing subsidiaries on their experience with AMT, we find three functional areas, where industry 4.0 solutions can not only enhance operational excellence and cost-efficiency, but they can also improve eco-efficiency, but they can also improve eco-efficiency, namely in the f...

  16. Recent advances in fuel product and manufacturing process development

    International Nuclear Information System (INIS)

    Slember, R.J.; Doshi, P.K.

    1987-01-01

    This paper discusses advancements in commercial nuclear fuel products and manufacturing made by the Westinghouse Electric Corporation in response to the commercial nuclear fuel industry's demand for high reliability, increased plant availability and improved operating flexibility. The features and benefits of Westinghouse's most advanced fuel products--VANTAGE 5 for PWR plants and QUAD+ for BWR plants--are described, as well as 'high performance' fuel concepts now under development for delivery in the late 1980s. The paper also disusses the importance of in-process quality control throughout manufacturing towards reducing product variability and improving fuel reliability. (author)

  17. Soft computing in design and manufacturing of advanced materials

    Science.gov (United States)

    Cios, Krzysztof J.; Baaklini, George Y; Vary, Alex

    1993-01-01

    The potential of fuzzy sets and neural networks, often referred to as soft computing, for aiding in all aspects of manufacturing of advanced materials like ceramics is addressed. In design and manufacturing of advanced materials, it is desirable to find which of the many processing variables contribute most to the desired properties of the material. There is also interest in real time quality control of parameters that govern material properties during processing stages. The concepts of fuzzy sets and neural networks are briefly introduced and it is shown how they can be used in the design and manufacturing processes. These two computational methods are alternatives to other methods such as the Taguchi method. The two methods are demonstrated by using data collected at NASA Lewis Research Center. Future research directions are also discussed.

  18. Exposure Characteristics of Nanoparticles as Process By-products for the Semiconductor Manufacturing Industry.

    Science.gov (United States)

    Choi, Kwang-Min; Kim, Jin-Ho; Park, Ju-Hyun; Kim, Kwan-Sick; Bae, Gwi-Nam

    2015-01-01

    This study aims to elucidate the exposure properties of nanoparticles (NPs; semiconductor manufacturing processes. The measurements of airborne NPs were mainly performed around process equipment during fabrication processes and during maintenance. The number concentrations of NPs were measured using a water-based condensation particle counter having a size range of 10-3,000 nm. The chemical composition, size, and shape of NPs were determined by scanning electron microscopy and transmission electron microscopy techniques equipped with energy dispersive spectroscopy. The resulting concentrations of NPs ranged from 0.00-11.47 particles/cm(3). The concentration of NPs measured during maintenance showed a tendency to increase, albeit incrementally, compared to that measured during normal conditions (under typical process conditions without maintenance). However, the increment was small. When comparing the mean number concentration and standard deviation (n ± σ) of NPs, the chemical mechanical polishing (CMP) process was the highest (3.45 ± 3.65 particles/cm(3)), and the dry etch (ETCH) process was the lowest (0.11 ± 0.22 particles/cm(3)). The major NPs observed were silica (SiO2) and titania (TiO2) particles, which were mainly spherical agglomerates ranging in size from 25-280 nm. Sampling of semiconductor processes in CMP, chemical vapor deposition, and ETCH reveled NPs were particle size exceeded 100 nm in diffusion, metallization, ion implantation, and wet cleaning/etching process. The results show that the SiO2 and TiO2 are the major NPs present in semiconductor cleanroom environments.

  19. Tungsten and other heavy metal contamination in aquatic environments receiving wastewater from semiconductor manufacturing

    International Nuclear Information System (INIS)

    Hsu, Shih-Chieh; Hsieh, Hwey-Lian; Chen, Chang-Po; Tseng, Chun-Mao; Huang, Shou-Chung; Huang, Chou-Hao; Huang, Yi-Tang; Radashevsky, Vasily; Lin, Shuen-Hsin

    2011-01-01

    Through analyses of water and sediments, we investigate tungsten and 14 other heavy metals in a stream receiving treated effluents from a semiconductor manufacturer-clustered science park in Taiwan. Treated effluents account for ∼50% of total annual river discharge and <1% of total sediment discharge. Dissolved tungsten concentrations in the effluents abnormally reach 400 μg/L, as compared to the world river average concentration of <0.1 μg/L. Particulate tungsten concentrations are up to 300 μg/g in suspended and deposited sediments, and the corresponding enrichment factors are three orders of magnitude higher than average crust composition. Surprisingly, the estimated amount of tungsten exported to the adjacent ocean is 23.5 t/yr, which can approximate the amount from the Yangtze River should it be unpolluted. This study highlights the urgency of investigating the biological effect of such contamination.

  20. The Effect of the Implementation of Advanced Manufacturing Technologies on Training in the Manufacturing Sector

    Science.gov (United States)

    Castrillon, Isabel Dieguez; Cantorna, Ana I. Sinde

    2005-01-01

    Purpose: The aim of this article is to gain insight into some of the factors that determine personnel-training efforts in companies introducing advanced manufacturing technologies (AMTs). The study provides empirical evidence from a sector with high rates of technological modernisation. Design/methodology/approach: "Ad hoc" survey of 90…

  1. Handbook on advanced design and manufacturing technologies for biomedical devices

    CERN Document Server

    2013-01-01

    The last decades have seen remarkable advances in computer-aided design, engineering and manufacturing technologies, multi-variable simulation tools, medical imaging, biomimetic design, rapid prototyping, micro and nanomanufacturing methods and information management resources, all of which provide new horizons for the Biomedical Engineering fields and the Medical Device Industry. Handbook on Advanced Design and Manufacturing Technologies for Biomedical Devices covers such topics in depth, with an applied perspective and providing several case studies that help to analyze and understand the key factors of the different stages linked to the development of a novel biomedical device, from the conceptual and design steps, to the prototyping and industrialization phases. Main research challenges and future potentials are also discussed, taking into account relevant social demands and a growing market already exceeding billions of dollars. In time, advanced biomedical devices will decisively change methods and resu...

  2. NATO Advanced Research Institute on the Efficiency of Manufacturing Systems

    CERN Document Server

    Berg, C; French, D

    1983-01-01

    The Advanced Research Institute (A.R. 1.) on "the efficiency of Manufacturing Systems" was held under the auspices of the NATO Special Programm~ Panel on Systems Science as a part of the NATO Science Committee's continuous effort to promote the advancement of science through international co-operation. Advanced Research Institutes are organised for the purpose of bringing together experts in a particular field of interest to identify and make known the present state of knowledge in that area and, through informed debate, to make recommendations for directions for future research that would benefit the community at large. To this end two kinds of contribution were obtained by invitation. There were those papers which were about the current state of work in the area of manufacturing systems and its organisation; in addition three theme papers were presented to provide a stimulus to the discussion in terms of ways of thinking, both about the area and about the kind of research needed.

  3. Advances in High Temperature Materials for Additive Manufacturing

    Science.gov (United States)

    Nordin, Nurul Amira Binti; Johar, Muhammad Akmal Bin; Ibrahim, Mohd Halim Irwan Bin; Marwah, Omar Mohd Faizan bin

    2017-08-01

    In today’s technology, additive manufacturing has evolved over the year that commonly known as 3D printing. Currently, additive manufacturing have been applied for many industries such as for automotive, aerospace, medical and other commercial product. The technologies are supported by materials for the manufacturing process to produce high quality product. Plus, additive manufacturing technologies has been growth from the lowest to moderate and high technology to fulfil manufacturing industries obligation. Initially from simple 3D printing such as fused deposition modelling (FDM), poly-jet, inkjet printing, to selective laser sintering (SLS), and electron beam melting (EBM). However, the high technology of additive manufacturing nowadays really needs high investment to carry out the process for fine products. There are three foremost type of material which is polymer, metal and ceramic used for additive manufacturing application, and mostly they were in the form of wire feedstock or powder. In circumstance, it is crucial to recognize the characteristics of each type of materials used in order to understand the behaviours of the materials on high temperature application via additive manufacturing. Therefore, this review aims to provide excessive inquiry and gather the necessary information for further research on additive material materials for high temperature application. This paper also proposed a new material based on powder glass, which comes from recycled tempered glass from automotive industry, having a huge potential to be applied for high temperature application. The technique proposed for additive manufacturing will minimize some cost of modelling with same quality of products compare to the others advanced technology used for high temperature application.

  4. Based on Weibull Information Fusion Analysis Semiconductors Quality the Key Technology of Manufacturing Execution Systems Reliability

    Science.gov (United States)

    Huang, Zhi-Hui; Tang, Ying-Chun; Dai, Kai

    2016-05-01

    Semiconductor materials and Product qualified rate are directly related to the manufacturing costs and survival of the enterprise. Application a dynamic reliability growth analysis method studies manufacturing execution system reliability growth to improve product quality. Refer to classical Duane model assumptions and tracking growth forecasts the TGP programming model, through the failure data, established the Weibull distribution model. Combining with the median rank of average rank method, through linear regression and least squares estimation method, match respectively weibull information fusion reliability growth curve. This assumption model overcome Duane model a weakness which is MTBF point estimation accuracy is not high, through the analysis of the failure data show that the method is an instance of the test and evaluation modeling process are basically identical. Median rank in the statistics is used to determine the method of random variable distribution function, which is a good way to solve the problem of complex systems such as the limited sample size. Therefore this method has great engineering application value.

  5. Characterization of advanced semiconductor materials by positron annihilation

    International Nuclear Information System (INIS)

    Uedono, Akira; Suzuki, Ryoichi; Ohdaira, Toshiyuki; Ishibashi, Shoji

    2005-01-01

    Positron annihilation is an established technique for investigating vacancy-type defects near surfaces or interfaces. Using this technique, one can identify defect species in a nondestructive manner. Because there is no restriction of sample conductivity or temperature, this technique can be applied to a various materials, such as semiconductors, metals, metal oxides, and polymers. The positron annihilation has been applied to the studies of Si-technology related materials, which show that it can provide useful information for the development of semiconductor devices. In this article, we report the results obtained for electroplated Cu, strained Si and high-k materials. (author)

  6. Phase 1 Development Testing of the Advanced Manufacturing Demonstrator Engine

    Science.gov (United States)

    Case, Nicholas L.; Eddleman, David E.; Calvert, Marty R.; Bullard, David B.; Martin, Michael A.; Wall, Thomas R.

    2016-01-01

    The Additive Manufacturing Development Breadboard Engine (BBE) is a pressure-fed liquid oxygen/pump-fed liquid hydrogen (LOX/LH2) expander cycle engine that was built and operated by NASA at Marshall Space Flight Center's East Test Area. The breadboard engine was conceived as a technology demonstrator for the additive manufacturing technologies for an advanced upper stage prototype engine. The components tested on the breadboard engine included an ablative chamber, injector, main fuel valve, turbine bypass valve, a main oxidizer valve, a mixer and the fuel turbopump. All parts minus the ablative chamber were additively manufactured. The BBE was successfully hot fire tested seven times. Data collected from the test series will be used for follow on demonstration tests with a liquid oxygen turbopump and a regeneratively cooled chamber and nozzle.

  7. 5th International Conference on Advanced Manufacturing Engineering and Technologies

    CERN Document Server

    Jakovljevic, Zivana; NEWTECH2017

    2017-01-01

    This book presents the proceedings from the 5th NEWTECH conference (Belgrade, Serbia, 5–9 June 2017), the latest in a series of high-level conferences that bring together experts from academia and industry in order to exchange knowledge, ideas, experiences, research results, and information in the field of manufacturing. The range of topics addressed is wide, including, for example, machine tool research and in-machine measurements, progress in CAD/CAM technologies, rapid prototyping and reverse engineering, nanomanufacturing, advanced material processing, functional and protective surfaces, and cyber-physical and reconfigurable manufacturing systems. The book will benefit readers by providing updates on key issues and recent progress in manufacturing engineering and technologies and will aid the transfer of valuable knowledge to the next generation of academics and practitioners. It will appeal to all who work or conduct research in this rapidly evolving field.

  8. Advances in defect characterizations of semiconductors using positrons

    International Nuclear Information System (INIS)

    Lynn, K.G.; Asoka-Kumar, P.

    1996-01-01

    Positron Annihilation Spectroscopy (PAS) is a sensitive probe for studying the electronic structure of defects in solids. The authors summarize recent developments in defect characterization of semiconductors using depth-resolved PAS. The progress achieved in extending the capabilities of the PAS method is also described

  9. The Environmental Impact of Advanced Manufacturing Technologies: Examples from Hungary

    Directory of Open Access Journals (Sweden)

    Andrea Szalavetz

    2017-06-01

    Full Text Available The purpose of the paper is to demonstrate the beneficial impact of advanced manufacturing technologies (AMT on firms’ environmental performance. Drawing on interviews conducted with 16 Hungarian manufacturing subsidiaries on their experience with AMT, we find three functional areas, where industry 4.0 solutions can not only enhance operational excellence and cost-efficiency, but they can also improve eco-efficiency, but they can also improve eco-efficiency, namely in the field of quality management (through smart production control, data analytics and predictive modelling solutions; process optimization (through capacity planning and production scheduling solutions; and product and process engineering (through advanced virtual technologies. We also find that AMT adoption facilitated subsidiary upgrading along various dimensions. The main managerial implication is that subsidiaries need to be proactive, and emphasize also the benefits stemming from energy and resource efficiency improvement when lobbying for investment in AMT.

  10. Advanced Manufacturing Systems in Food Processing and Packaging Industry

    International Nuclear Information System (INIS)

    Sani, Mohd Shafie; Aziz, Faieza Abdul

    2013-01-01

    In this paper, several advanced manufacturing systems in food processing and packaging industry are reviewed, including: biodegradable smart packaging and Nano composites, advanced automation control system consists of fieldbus technology, distributed control system and food safety inspection features. The main purpose of current technology in food processing and packaging industry is discussed due to major concern on efficiency of the plant process, productivity, quality, as well as safety. These application were chosen because they are robust, flexible, reconfigurable, preserve the quality of the food, and efficient.

  11. Advanced Manufacturing Systems in Food Processing and Packaging Industry

    Science.gov (United States)

    Shafie Sani, Mohd; Aziz, Faieza Abdul

    2013-06-01

    In this paper, several advanced manufacturing systems in food processing and packaging industry are reviewed, including: biodegradable smart packaging and Nano composites, advanced automation control system consists of fieldbus technology, distributed control system and food safety inspection features. The main purpose of current technology in food processing and packaging industry is discussed due to major concern on efficiency of the plant process, productivity, quality, as well as safety. These application were chosen because they are robust, flexible, reconfigurable, preserve the quality of the food, and efficient.

  12. 75 FR 44015 - Certain Semiconductor Products Made by Advanced Lithography Techniques and Products Containing...

    Science.gov (United States)

    2010-07-27

    ... Advanced Lithography Techniques and Products Containing Same; Notice of Investigation AGENCY: U.S... violations of section 337 based upon the importation into the United States, the sale for importation, and the sale within the United States after importation of certain semiconductor products made by advanced...

  13. Status and progress in ion implantation technology for semiconductor device manufacturing

    International Nuclear Information System (INIS)

    Takahashi, Noriyuki

    1998-01-01

    Rapid growth in implant applications in the fabrication of semiconductors has encouraged a dramatic increase in the range of energies, beam currents and ion species used. The challenges of a wider energy range, higher beam currents, continued reduction in contamination, improved angle integrity and larger substrates have motivated the development of many innovations. Advanced processes in submicron device production uses up to twenty implantation steps. Thus the outstanding growth of this industry has led to the evolution of a thriving business of hundreds of implantation equipment systems each year with very specific requirements. The present paper reviews the principal process requirements which resulted in the evolution of the equipment technology, and describes the recent trends in the ion implanter technology all three principal categories: high current, medium current and high energy. (author)

  14. NATO Advanced Study Institute on Physics of Submicron Semiconductor Devices

    CERN Document Server

    Ferry, David; Jacoboni, C

    1988-01-01

    The papers contained in the volume represent lectures delivered as a 1983 NATO ASI, held at Urbino, Italy. The lecture series was designed to identify the key submicron and ultrasubmicron device physics, transport, materials and contact issues. Nonequilibrium transport, quantum transport, interfacial and size constraints issues were also highlighted. The ASI was supported by NATO and the European Research Office. H. L. Grubin D. K. Ferry C. Jacoboni v CONTENTS MODELLING OF SUB-MICRON DEVICES.................. .......... 1 E. Constant BOLTZMANN TRANSPORT EQUATION... ... ...... .................... 33 K. Hess TRANSPORT AND MATERIAL CONSIDERATIONS FOR SUBMICRON DEVICES. . .. . . . . .. . . . .. . .. . .... ... .. . . . .. . . . .. . . . . . . . . . . 45 H. L. Grubin EPITAXIAL GROWTH FOR SUB MICRON STRUCTURES.................. 179 C. E. C. Wood INSULATOR/SEMICONDUCTOR INTERFACES.......................... 195 C. W. Wilms en THEORY OF THE ELECTRONIC STRUCTURE OF SEMICONDUCTOR SURFACES AND INTERFACES...................

  15. Semiconductor sensor device, diagnostic instrument comprising such a device and method of manufacturing such a device

    NARCIS (Netherlands)

    2010-01-01

    The invention relates to a semiconductor sensor device (10) for sensing a substance comprising at least one mesa- shaped semiconductor region (11) which is formed on a surface of a semiconductor body (12) and which is connected at a first end to a first electrically conducting connection region (13)

  16. Adsorption treatment of oxide chemical mechanical polishing wastewater from a semiconductor manufacturing plant by electrocoagulation

    Energy Technology Data Exchange (ETDEWEB)

    Chou, Wei-Lung, E-mail: wlchou@sunrise.hk.edu.tw [Department of Safety, Health and Environmental Engineering, Hungkuang University, No. 34, Chung-Chie Road, Sha-Lu, Taichung 433, Taiwan (China); Wang, Chih-Ta [Department of Safety Health and Environmental Engineering, Chung Hwa University of Medical Technology, Tainan Hsien 717, Taiwan (China); Chang, Wen-Chun; Chang, Shih-Yu [Department of Safety, Health and Environmental Engineering, Hungkuang University, No. 34, Chung-Chie Road, Sha-Lu, Taichung 433, Taiwan (China)

    2010-08-15

    In this study, metal hydroxides generated during electrocoagulation (EC) were used to remove the chemical oxygen demand (COD) of oxide chemical mechanical polishing (oxide-CMP) wastewater from a semiconductor manufacturing plant by EC. Adsorption studies were conducted in a batch system for various current densities and temperatures. The COD concentration in the oxide-CMP wastewater was effectively removed and decreased by more than 90%, resulting in a final wastewater COD concentration that was below the Taiwan discharge standard (100 mg L{sup -1}). Since the processed wastewater quality exceeded the direct discharge standard, the effluent could be considered for reuse. The adsorption kinetic studies showed that the EC process was best described using the pseudo-second-order kinetic model at the various current densities and temperatures. The experimental data were also tested against different adsorption isotherm models to describe the EC process. The Freundlich adsorption isotherm model predictions matched satisfactorily with the experimental observations. Thermodynamic parameters, including the Gibbs free energy, enthalpy, and entropy, indicated that the COD adsorption of oxide-CMP wastewater on metal hydroxides was feasible, spontaneous and endothermic in the temperature range of 288-318 K.

  17. Adsorption treatment of oxide chemical mechanical polishing wastewater from a semiconductor manufacturing plant by electrocoagulation

    International Nuclear Information System (INIS)

    Chou, Wei-Lung; Wang, Chih-Ta; Chang, Wen-Chun; Chang, Shih-Yu

    2010-01-01

    In this study, metal hydroxides generated during electrocoagulation (EC) were used to remove the chemical oxygen demand (COD) of oxide chemical mechanical polishing (oxide-CMP) wastewater from a semiconductor manufacturing plant by EC. Adsorption studies were conducted in a batch system for various current densities and temperatures. The COD concentration in the oxide-CMP wastewater was effectively removed and decreased by more than 90%, resulting in a final wastewater COD concentration that was below the Taiwan discharge standard (100 mg L -1 ). Since the processed wastewater quality exceeded the direct discharge standard, the effluent could be considered for reuse. The adsorption kinetic studies showed that the EC process was best described using the pseudo-second-order kinetic model at the various current densities and temperatures. The experimental data were also tested against different adsorption isotherm models to describe the EC process. The Freundlich adsorption isotherm model predictions matched satisfactorily with the experimental observations. Thermodynamic parameters, including the Gibbs free energy, enthalpy, and entropy, indicated that the COD adsorption of oxide-CMP wastewater on metal hydroxides was feasible, spontaneous and endothermic in the temperature range of 288-318 K.

  18. Adsorption treatment of oxide chemical mechanical polishing wastewater from a semiconductor manufacturing plant by electrocoagulation.

    Science.gov (United States)

    Chou, Wei-Lung; Wang, Chih-Ta; Chang, Wen-Chun; Chang, Shih-Yu

    2010-08-15

    In this study, metal hydroxides generated during electrocoagulation (EC) were used to remove the chemical oxygen demand (COD) of oxide chemical mechanical polishing (oxide-CMP) wastewater from a semiconductor manufacturing plant by EC. Adsorption studies were conducted in a batch system for various current densities and temperatures. The COD concentration in the oxide-CMP wastewater was effectively removed and decreased by more than 90%, resulting in a final wastewater COD concentration that was below the Taiwan discharge standard (100 mg L(-1)). Since the processed wastewater quality exceeded the direct discharge standard, the effluent could be considered for reuse. The adsorption kinetic studies showed that the EC process was best described using the pseudo-second-order kinetic model at the various current densities and temperatures. The experimental data were also tested against different adsorption isotherm models to describe the EC process. The Freundlich adsorption isotherm model predictions matched satisfactorily with the experimental observations. Thermodynamic parameters, including the Gibbs free energy, enthalpy, and entropy, indicated that the COD adsorption of oxide-CMP wastewater on metal hydroxides was feasible, spontaneous and endothermic in the temperature range of 288-318 K. Copyright 2010 Elsevier B.V. All rights reserved.

  19. Risk for work-related fatigue among the employees on semiconductor manufacturing lines.

    Science.gov (United States)

    Lin, Yu-Cheng; Chen, Yen-Cheng; Hsieh, Hui-I; Chen, Pau-Chung

    2015-03-01

    To examine the potential risk factors for work-related fatigue (WRF) among workers in modern industries, the authors analyzed the records of need-for-recovery questionnaires and health checkup results for 1545 employees. Compared with regular daytime workers, and after adjusting for confounders, the workers adapting to day-and-night rotating shift work (RSW) had a 4.0-fold (95% confidence interval [CI] = 2.7-5.9) increased risk for WRF, higher than the 2.2-fold risk (95% CI = 1.5-3.3) for persistent shift workers. Based on highest education level, the male employees with university degrees had the highest adjusted odds ratio (a-OR) 2.8 (95% CI = 1.0-7.8) for complaining of WRF versus compulsory education group. For female workers, currently married/cohabiting status was inversely associated with WRF (a-OR = 0.5; 95% CI = 0.2-0.9), and child-rearing responsibility moderately increased WRF risk (a-OR = 1.9; 95% CI = 1.0-3.7). Day-and-night RSW and the adaptation, educational levels of males, and domestic factors for females contributed to WRF among semiconductor manufacturing employees. © 2013 APJPH.

  20. A manufacturing database of advanced materials used in spacecraft structures

    Science.gov (United States)

    Bao, Han P.

    1994-12-01

    Cost savings opportunities over the life cycle of a product are highest in the early exploratory phase when different design alternatives are evaluated not only for their performance characteristics but also their methods of fabrication which really control the ultimate manufacturing costs of the product. In the past, Design-To-Cost methodologies for spacecraft design concentrated on the sizing and weight issues more than anything else at the early so-called 'Vehicle Level' (Ref: DOD/NASA Advanced Composites Design Guide). Given the impact of manufacturing cost, the objective of this study is to identify the principal cost drivers for each materials technology and propose a quantitative approach to incorporating these cost drivers into the family of optimization tools used by the Vehicle Analysis Branch of NASA LaRC to assess various conceptual vehicle designs. The advanced materials being considered include aluminum-lithium alloys, thermoplastic graphite-polyether etherketone composites, graphite-bismaleimide composites, graphite- polyimide composites, and carbon-carbon composites. Two conventional materials are added to the study to serve as baseline materials against which the other materials are compared. These two conventional materials are aircraft aluminum alloys series 2000 and series 7000, and graphite-epoxy composites T-300/934. The following information is available in the database. For each material type, the mechanical, physical, thermal, and environmental properties are first listed. Next the principal manufacturing processes are described. Whenever possible, guidelines for optimum processing conditions for specific applications are provided. Finally, six categories of cost drivers are discussed. They include, design features affecting processing, tooling, materials, fabrication, joining/assembly, and quality assurance issues. It should be emphasized that this database is not an exhaustive database. Its primary use is to make the vehicle designer

  1. 10 CFR 611.202 - Advanced Technology Vehicle Manufacturing Facility Award Program.

    Science.gov (United States)

    2010-01-01

    ... 10 Energy 4 2010-01-01 2010-01-01 false Advanced Technology Vehicle Manufacturing Facility Award... TECHNOLOGY VEHICLES MANUFACTURER ASSISTANCE PROGRAM Facility/Funding Awards § 611.202 Advanced Technology Vehicle Manufacturing Facility Award Program. DOE may issue, under the Advanced Technology Vehicle...

  2. Treatment of exhaust gas from the semiconductor manufacturing process. 3; Handotai seizo sochi kara no hai gas shori. 3

    Energy Technology Data Exchange (ETDEWEB)

    Fukunaga, A. [Ebara Research Co. Ltd., Kanagawa (Japan); Mori, Y.; Osato, M.; Tsujimura, M. [Ebara Corp., Tokyo (Japan)

    1995-10-20

    Demand has been building up for an individual dry type scrubber for treating exhaust gas from the semiconductor manufacturing process. Some factors for the wide acceptance of such a scrubber would be the capability for complete treatment, easy maintenance and safety features, etc. Practical gas analysis and optimum scrubbing techniques would have to be applied, as well as effective monitoring, alarm, and fail-safe techniques. The overall exhaust gas line, i.e. the line connecting the scrubber system and the upstream process, including that extending to pump system, has to be fully considered for enabling effective scrubbing performance. Such factors, which have until now not been given any priority, would have to be fully studied for the development of a practical, individual dry type scrubber. Cooperation on this matter from the semiconductor manufacturing industry would also be essential. 6 refs., 3 figs., 5 tabs.

  3. Advanced Manufacturing Technology Adoption In SMEs: An Integrative Model

    Directory of Open Access Journals (Sweden)

    Mirmahdi Darbanhosseiniamirkhiz

    2012-12-01

    Full Text Available The objective of this study is to assess the critical factors which influence adoption of  Advanced Manufacturing Technologies (AMTs and identify hurdles and barriers which prevent small- and medium-sized enterprises (SMEs from accomplishing the desired goals of AMTs utilization. The proposed framework has synthesized previous studies and integrated related studies through conducting a comprehensive literature review. This paper is a theoretical construction that synthesizes previous studies, and centers on three context (Environmental, Organizational, and Technological which influence  adoption of AMTs. This model can provide managers with practical solutions through granting in-depth understanding of whole internal, external, and technological environments, and awarding empirical insight into overcoming barriers to the adoption and implementation of AMT and other process innovations in manufacturing organizations.

  4. Advances in battery manufacturing, service, and management systems

    CERN Document Server

    Zhou, Shiyu; Han, Yehui

    2016-01-01

    This book brings together experts in the field to highlight the cutting edge research advances in BM2S2 and to promote an innovative integrated research framework responding to the challenges. There are three major parts included in this book: manufacturing, service, and management. The first part focuses on battery manufacturing systems, including modeling, analysis, design and control, as well as economic and risk analyses. The second part focuses on information technology’s impact on service systems, such as data-driven reliability modeling, failure prognosis, and service decision making methodologies for battery services. The third part addresses battery management systems (BMS) for control and optimization of battery cells, opera ions, and hybrid storage systems to ensure overall performance and safety, as well as EV management.

  5. Advanced Continuous Flow Platform for On-Demand Pharmaceutical Manufacturing.

    Science.gov (United States)

    Zhang, Ping; Weeranoppanant, Nopphon; Thomas, Dale A; Tahara, Kohei; Stelzer, Torsten; Russell, Mary Grace; O'Mahony, Marcus; Myerson, Allan S; Lin, Hongkun; Kelly, Liam P; Jensen, Klavs F; Jamison, Timothy F; Dai, Chunhui; Cui, Yuqing; Briggs, Naomi; Beingessner, Rachel L; Adamo, Andrea

    2018-02-21

    As a demonstration of an alternative to the challenges faced with batch pharmaceutical manufacturing including the large production footprint and lengthy time-scale, we previously reported a refrigerator-sized continuous flow system for the on-demand production of essential medicines. Building on this technology, herein we report a second-generation, reconfigurable and 25 % smaller (by volume) continuous flow pharmaceutical manufacturing platform featuring advances in reaction and purification equipment. Consisting of two compact [0.7 (L)×0.5 (D)×1.3 m (H)] stand-alone units for synthesis and purification/formulation processes, the capabilities of this automated system are demonstrated with the synthesis of nicardipine hydrochloride and the production of concentrated liquid doses of ciprofloxacin hydrochloride, neostigmine methylsulfate and rufinamide that meet US Pharmacopeia standards. © 2018 Wiley-VCH Verlag GmbH & Co. KGaA, Weinheim.

  6. Advanced crystal growth techniques for thallium bromide semiconductor radiation detectors

    Science.gov (United States)

    Datta, Amlan; Becla, Piotr; Guguschev, Christo; Motakef, Shariar

    2018-02-01

    Thallium Bromide (TlBr) is a promising room-temperature radiation detector candidate with excellent charge transport properties. Currently, Travelling Molten Zone (TMZ) technique is widely used for growth of semiconductor-grade TlBr crystals. However, there are several challenges associated with this type of crystal growth process including lower yield, high thermal stress, and low crystal uniformity. To overcome these shortcomings of the current technique, several different crystal growth techniques have been implemented in this study. These include: Vertical Bridgman (VB), Physical Vapor Transport (PVT), Edge-defined Film-fed Growth (EFG), and Czochralski Growth (Cz). Techniques based on melt pulling (EFG and Cz) were demonstrated for the first time for semiconductor grade TlBr material. The viability of each process along with the associated challenges for TlBr growth has been discussed. The purity of the TlBr crystals along with its crystalline and electronic properties were analyzed and correlated with the growth techniques. Uncorrected 662 keV energy resolutions around 2% were obtained from 5 mm x 5 mm x 10 mm TlBr devices with virtual Frisch-grid configuration.

  7. Innovations in Advanced Materials and Metals Manufacturing Project (IAM2)

    Energy Technology Data Exchange (ETDEWEB)

    Scott, Elizabeth [Columbia River Economic Development Council, Vancouver, WA (United States)

    2017-01-06

    This project, under the Jobs and Innovation Accelerator Challenge, Innovations in Advanced Materials and Metals Manufacturing Project, contracted with Cascade Energy to provide a shared energy project manager engineer to work with five different companies throughout the Portland metro grant region to implement ten energy efficiency projects and develop a case study to analyze the project model. As a part of the project, the energy project manager also looked into specific new technologies and methodologies that could change the way energy is consumed by manufacturers—from game-changing equipment and technology to monitor energy use to methodologies that change the way companies interact and use their machines to reduce energy consumption.

  8. Technology-design-manufacturing co-optimization for advanced mobile SoCs

    Science.gov (United States)

    Yang, Da; Gan, Chock; Chidambaram, P. R.; Nallapadi, Giri; Zhu, John; Song, S. C.; Xu, Jeff; Yeap, Geoffrey

    2014-03-01

    How to maintain the Moore's Law scaling beyond the 193 immersion resolution limit is the key question semiconductor industry needs to answer in the near future. Process complexity will undoubtfully increase for 14nm node and beyond, which brings both challenges and opportunities for technology development. A vertically integrated design-technologymanufacturing co-optimization flow is desired to better address the complicated issues new process changes bring. In recent years smart mobile wireless devices have been the fastest growing consumer electronics market. Advanced mobile devices such as smartphones are complex systems with the overriding objective of providing the best userexperience value by harnessing all the technology innovations. Most critical system drivers are better system performance/power efficiency, cost effectiveness, and smaller form factors, which, in turns, drive the need of system design and solution with More-than-Moore innovations. Mobile system-on-chips (SoCs) has become the leading driver for semiconductor technology definition and manufacturing. Here we highlight how the co-optimization strategy influenced architecture, device/circuit, process technology and package, in the face of growing process cost/complexity and variability as well as design rule restrictions.

  9. Novel engineered compound semiconductor heterostructures for advanced electronics applications

    Science.gov (United States)

    Stillman, Gregory E.; Holonyak, Nick, Jr.; Coleman, James J.

    1992-06-01

    To provide the technology base that will enable SDIO capitalization on the performance advantages offered through novel engineered multiple-lavered compound semiconductor structures, this project has focussed on three specific areas: (1) carbon doping of AlGaAs/GaAs and InP/InGaAs materials for reliable high frequency heterojunction bipolar transistors; (2) impurity induced layer disordering and the environmental degradation of AlxGal-xAs-GaAs quantum-well heterostructures and the native oxide stabilization of AlxGal-xAs-GaAs quantum well heterostructure lasers; and (3) non-planar and strained-layer quantum well heterostructure lasers and laser arrays. The accomplishments in this three year research are reported in fifty-six publications and the abstracts included in this report.

  10. Charge separation sensitized by advanced II-VI semiconductor nanostructures

    Energy Technology Data Exchange (ETDEWEB)

    Kelley, David F. [Univ.of California, Merced, CA (United States)

    2017-04-11

    This proposal focuses on how the composition and morphology of pure and alloyed II-VI semiconductor heterostructures control their spectroscopic and dynamical properties. The proposed research will use a combination of synthesis development, electron microscopy, time-resolved electronic spectroscopy and modeling calculations to study these nanostructures. The proposed research will examine the extent to which morphology, compression due to lattice mismatch and alloy effects can be used to tune the electron and hole energies and the spectroscopic properties of II-VI heterojunctions. It will also use synthesis, optical spectroscopy and HRTEM to examine the role of lattice mismatch and hence lattice strain in producing interfacial defects, and the extent to which defect formation can be prevented by controlling the composition profile through the particles and across the interfaces. Finally, we will study the magnitude of the surface roughness in core/shell nanostructures and the role of shell thickness variability on the inhomogeneity of interfacial charge transfer rates.

  11. Nanoimprint wafer and mask tool progress and status for high volume semiconductor manufacturing

    Science.gov (United States)

    Matsuoka, Yoichi; Seki, Junichi; Nakayama, Takahiro; Nakagawa, Kazuki; Azuma, Hisanobu; Yamamoto, Kiyohito; Sato, Chiaki; Sakai, Fumio; Takabayashi, Yukio; Aghili, Ali; Mizuno, Makoto; Choi, Jin; Jones, Chris E.

    2016-10-01

    Imprint lithography has been shown to be an effective technique for replication of nano-scale features. Jet and Flash* Imprint Lithography (J-FIL*) involves the field-by-field deposition and exposure of a low viscosity resist deposited by jetting technology onto the substrate. The patterned mask is lowered into the fluid which then quickly flows into the relief patterns in the mask by capillary action. Following this filling step, the resist is crosslinked under UV radiation, and then the mask is removed, leaving a patterned resist on the substrate. There are many criteria that determine whether a particular technology is ready for wafer manufacturing. Defectivity and mask life play a significant role relative to meeting the cost of ownership (CoO) requirements in the production of semiconductor devices. Hard particles on a wafer or mask create the possibility of inducing a permanent defect on the mask that can impact device yield and mask life. By using material methods to reduce particle shedding and by introducing an air curtain system, the lifetime of both the master mask and the replica mask can be extended. In this work, we report results that demonstrate a path towards achieving mask lifetimes of better than 1000 wafers. On the mask side, a new replication tool, the FPA-1100 NR2 is introduced. Mask replication is required for nanoimprint lithography (NIL), and criteria that are crucial to the success of a replication platform include both particle control, resolution and image placement accuracy. In this paper we discuss the progress made in both feature resolution and in meeting the image placement specification for replica masks.

  12. Advanced Manufacturing Processes Laboratory Building 878 hazards assessment document

    International Nuclear Information System (INIS)

    Wood, C.; Thornton, W.; Swihart, A.; Gilman, T.

    1994-07-01

    The introduction of the hazards assessment process is to document the impact of the release of hazards at the Advanced Manufacturing Processes Laboratory (AMPL) that are significant enough to warrant consideration in Sandia National Laboratories' operational emergency management program. This hazards assessment is prepared in accordance with the Department of Energy Order 5500.3A requirement that facility-specific hazards assessments be prepared, maintained, and used for emergency planning purposes. This hazards assessment provides an analysis of the potential airborne release of chemicals associated with the operations and processes at the AMPL. This research and development laboratory develops advanced manufacturing technologies, practices, and unique equipment and provides the fabrication of prototype hardware to meet the needs of Sandia National Laboratories, Albuquerque, New Mexico (SNL/NM). The focus of the hazards assessment is the airborne release of materials because this requires the most rapid, coordinated emergency response on the part of the AMPL, SNL/NM, collocated facilities, and surrounding jurisdiction to protect workers, the public, and the environment

  13. Advanced Manufacturing Processes Laboratory Building 878 hazards assessment document

    Energy Technology Data Exchange (ETDEWEB)

    Wood, C.; Thornton, W.; Swihart, A.; Gilman, T.

    1994-07-01

    The introduction of the hazards assessment process is to document the impact of the release of hazards at the Advanced Manufacturing Processes Laboratory (AMPL) that are significant enough to warrant consideration in Sandia National Laboratories` operational emergency management program. This hazards assessment is prepared in accordance with the Department of Energy Order 5500.3A requirement that facility-specific hazards assessments be prepared, maintained, and used for emergency planning purposes. This hazards assessment provides an analysis of the potential airborne release of chemicals associated with the operations and processes at the AMPL. This research and development laboratory develops advanced manufacturing technologies, practices, and unique equipment and provides the fabrication of prototype hardware to meet the needs of Sandia National Laboratories, Albuquerque, New Mexico (SNL/NM). The focus of the hazards assessment is the airborne release of materials because this requires the most rapid, coordinated emergency response on the part of the AMPL, SNL/NM, collocated facilities, and surrounding jurisdiction to protect workers, the public, and the environment.

  14. Advanced Manufacture of Spiral Bevel and Hypoid Gears

    Directory of Open Access Journals (Sweden)

    Vilmos Simon

    2016-11-01

    Full Text Available In this study, an advanced method for the manufacture of spiral bevel and hypoid gears on CNC hypoid generators is proposed. The optmal head-cutter geometry and machine tool settings are determined to introduce the optimal tooth surface modifications into the teeth of spiral bevel and hypoid gears. The aim of these tooth surface modifications is to simultaneously reduce the tooth contact pressure and the transmission errors, to maximize the EHD load carrying capacity of the oil film, and to minimize power losses in the oil film. The proposed advanced method for the manufacture of spiral bevel and hypoid gears is based on machine tool setting variation on the cradle-type generator conducted by optimal polynomial functions and on the use of a CNC hypoid generator. An algorithm is developed for the execution of motions on the CNC hypoid generator using the optimal relations on the cradle-type machine. Effectiveness of the method was demonstrated by using spiral bevel and hypoid gear examples. Significant improvements in the operating characteristics of the gear pairs are achieved.

  15. Recent Advancements in Semiconductor-based Optical Signal Processing

    DEFF Research Database (Denmark)

    Nielsen, M L; Mørk, Jesper

    2006-01-01

    Significant advancements in technology and basic understanding of device physics are bringing optical signal processing closer to a commercial breakthrough. In this paper we describe the main challenges in high-speed SOA-based switching.......Significant advancements in technology and basic understanding of device physics are bringing optical signal processing closer to a commercial breakthrough. In this paper we describe the main challenges in high-speed SOA-based switching....

  16. Magnetic resonance of semiconductors and their nanostructures basic and advanced applications

    CERN Document Server

    Baranov, Pavel G; Jelezko, Fedor; Wrachtrup, Jörg

    2017-01-01

    This book explains different magnetic resonance (MR) techniques and uses different combinations of these techniques to analyze defects in semiconductors and nanostructures. It also introduces novelties such as single defects MR and electron-paramagnetic-resonance-based methods: electron spin echo, electrically detected magnetic resonance, optically detected magnetic resonance and electron-nuclear double resonance – the designated tools for investigating the structural and spin properties of condensed systems, living matter, nanostructures and nanobiotechnology objects. Further, the authors address problems existing in semiconductor and nanotechnology sciences that can be resolved using MR, and discuss past, current and future applications of MR, with a focus on advances in MR methods. The book is intended for researchers in MR studies of semiconductors and nanostructures wanting a comprehensive review of what has been done in their own and related fields of study, as well as future perspectives.

  17. Hot stamping advanced manufacturing technology of lightweight car body

    CERN Document Server

    Hu, Ping; He, Bin

    2017-01-01

    This book summarizes the advanced manufacturing technology of original innovations in hot stamping of lightweight car body. A detailed description of the technical system and basic knowledge of sheet metal forming is given, which helps readers quickly understand the relevant knowledge in the field. Emphasis has been placed on the independently developed hot stamping process and equipment, which help describe the theoretical and experimental research on key problems involving stress field, thermal field and phase transformation field in hot stamping process. Also, a description of the formability at elevated temperature and the numerical simulation algorithms for high strength steel hot stamping is given in combination with the experiments. Finally, the book presents some application cases of hot stamping technology such as the lightweight car body design using hot stamping components and gradient hardness components, and the cooling design of the stamping tool. This book is intended for researchers, engineers...

  18. Analyzing the Drivers of Advanced Sustainable Manufacturing System Using AHP Approach

    Directory of Open Access Journals (Sweden)

    K. Madan Shankar

    2016-08-01

    Full Text Available A number of current manufacturing sectors are striving hard to introduce innovative long-term strategies into their operations. As a result, many scholarly studies have found it fruitful to investigate advanced manufacturing strategies such as agile, computer-integrated, and cellular manufacturing. Through the example of downstream cases, manufacturing sectors have learned that financial benefits garnered through automated technologies cannot be counted on as a sole measure to ensure their success in today’s competitive and fluctuating marketplaces. The objective of this study is to integrate those advanced techniques with sustainable operations, to promote advanced sustainable manufacturing so those manufacturing sectors can thrive even in uncertain markets. To establish this connection, this study analyzes the drivers of advanced sustainable manufacturing through a proposed framework validated through a case study in India. Common drivers are collected from the literature, calibrated with opinions from experts, and analyzed through an analytical hierarchy process (AHP, which is a multi-criteria decision making (MCDM approach. This study reveals that quality is the primary driver that pressures manufacturing sectors to adopt advanced sustainable manufacturing. Manufacturers can easily note the top ranked driver and adopt it to soundly implement advanced sustainable manufacturing. In addition, some key future scopes are explored along with possible recommendations for effective implementation of advanced sustainable manufacturing systems.

  19. Developing novel 3D antennas using advanced additive manufacturing technology

    Science.gov (United States)

    Mirzaee, Milad

    In today's world of wireless communication systems, antenna engineering is rapidly advancing as the wireless services continue to expand in support of emerging commercial applications. Antennas play a key role in the performance of advanced transceiver systems where they serve to convert electric power to electromagnetic waves and vice versa. Researchers have held significant interest in developing this crucial component for wireless communication systems by employing a variety of design techniques. In the past few years, demands for electrically small antennas continues to increase, particularly among portable and mobile wireless devices, medical electronics and aerospace systems. This trend toward smaller electronic devices makes the three dimensional (3D) antennas very appealing, since they can be designed in a way to use every available space inside the devise. Additive Manufacturing (AM) method could help to find great solutions for the antennas design for next generation of wireless communication systems. In this thesis, the design and fabrication of 3D printed antennas using AM technology is studied. To demonstrate this application of AM, different types of antennas structures have been designed and fabricated using various manufacturing processes. This thesis studies, for the first time, embedded conductive 3D printed antennas using PolyLactic Acid (PLA) and Acrylonitrile Butadiene Styrene (ABS) for substrate parts and high temperature carbon paste for conductive parts which can be a good candidate to overcome the limitations of direct printing on 3D surfaces that is the most popular method to fabricate conductive parts of the antennas. This thesis also studies, for the first time, the fabrication of antennas with 3D printed conductive parts which can contribute to the new generation of 3D printed antennas.

  20. Importance of Advanced Planning of Manufacturing for Nuclear Industry

    Directory of Open Access Journals (Sweden)

    Shykinov Nick

    2016-06-01

    Full Text Available In the context of energy demands by growing economies, climate changes, fossil fuel pricing volatility, and improved safety and performance of nuclear power plants, many countries express interest in expanding or acquiring nuclear power capacity. In the light of the increased interest in expanding nuclear power the supply chain for nuclear power projects has received more attention in recent years. The importance of the advanced planning of procurement and manufacturing of components of nuclear facilities is critical for these projects. Many of these components are often referred to as long-lead items. They may be equipment, products and systems that are identified to have a delivery time long enough to affect directly the overall timing of a project. In order to avoid negatively affecting the project schedule, these items may need to be sourced out or manufactured years before the beginning of the project. For nuclear facilities, long-lead items include physical components such as large pressure vessels, instrumentation and controls. They may also mean programs and management systems important to the safety of the facility. Authorized nuclear operator training, site evaluation programs, and procurement are some of the examples. The nuclear power industry must often meet very demanding construction and commissioning timelines, and proper advanced planning of the long-lead items helps manage risks to project completion time. For nuclear components there are regulatory and licensing considerations that need to be considered. A national nuclear regulator must be involved early to ensure the components will meet the national legal regulatory requirements. This paper will discuss timing considerations to address the regulatory compliance of nuclear long-lead items.

  1. Manufacture of ribbon and solar cells of material of semiconductor grade

    International Nuclear Information System (INIS)

    1980-01-01

    A method is described of producing ribbon-like substantially monocrystalline bodies of silicon or other materials of semiconductor grade suitable for use in solar cells or other semiconductor devices. A tube of the material is made and a photovoltaic junction formed in it. The tube is then divided lengthwise into a number of ribbon-like bodies. The photovoltaic junction can be formed either by diffusion or by ion-implantation. (U.K.)

  2. Co-Extrusion: Advanced Manufacturing for Energy Devices

    Energy Technology Data Exchange (ETDEWEB)

    Cobb, Corie Lynn [PARC, Palo Alto, CA (United States)

    2016-11-18

    The development of mass markets for large-format batteries, including electric vehicles (EVs) and grid support, depends on both cost reductions and performance enhancements to improve their economic viability. Palo Alto Research Center (PARC) has developed a multi-material, advanced manufacturing process called co-extrusion (CoEx) to remove multiple steps in a conventional battery coating process with the potential to simultaneously increase battery energy and power density. CoEx can revolutionize battery manufacturing across most chemistries, significantly lowering end-product cost and shifting the underlying economics to make EVs and other battery applications a reality. PARC’s scale-up of CoEx for electric vehicle (EV) batteries builds on a solid base of experience in applying CoEx to solar cell manufacturing, deposition of viscous ceramic pastes, and Li-ion battery chemistries. In the solar application, CoEx has been deployed commercially at production scale where multi-channel CoEx printheads are used to print viscous silver gridline pastes at full production speeds (>40 ft/min). This operational scale-up provided invaluable experience with the nuances of speed, yield, and maintenance inherent in taking a new technology to the factory floor. PARC has leveraged this experience, adapting the CoEx process for Lithium-ion (Li-ion) battery manufacturing. To date, PARC has worked with Li-ion battery materials and structured cathodes with high-density Li-ion regions and low-density conduction regions, documenting both energy and power performance. Modeling results for a CoEx cathode show a path towards a 10-20% improvement in capacity for an EV pouch cell. Experimentally, we have realized a co-extruded battery structure with a Lithium Nickel Manganese Cobalt (NMC) cathode at print speeds equivalent to conventional roll coating processes. The heterogeneous CoEx cathode enables improved capacity in thick electrodes at higher C-rates. The proof-of-principle coin cells

  3. Experiences and Trends of Manufacturing Technology of Advanced Nuclear Fuels

    International Nuclear Information System (INIS)

    2012-08-01

    The 'Atoms for Peace' mission initiated in the mid-1950s paved the way for the development and deployment of nuclear fission reactors as a source of heat energy for electricity generation in nuclear power reactors and as a source of neutrons in non-power reactors for research, materials irradiation, and testing and production of radioisotopes. The fuels for nuclear reactors are manufactured from natural uranium (∼99.3% 238 U + ∼0.7% 235 U) and natural thorium (∼100% 232 Th) resources. Currently, most power and research reactors use 235 U, the only fissile isotope found in nature, as fuel. The fertile isotopes 238 U and 232 Th are transmuted in the reactor to human-made 239 Pu and 233 U fissile isotopes, respectively. Likewise, minor actinides (MA) (Np, Am and Cm) and other plutonium isotopes are also formed by a series of neutron capture reactions with 238 U and 235 U. Long term sustainability of nuclear power will depend to a great extent on the efficient, safe and secure utilization of fissile and fertile materials. Light water reactors (LWRs) account for more than 82% of the operating reactors, followed by pressurized heavy water reactors (PHWRs), which constitute ∼10% of reactors. LWRs will continue to dominate the nuclear power market for several decades, as long as economically viable natural uranium resources are available. Currently, the plutonium obtained from spent nuclear fuel is subjected to mono recycling in LWRs as uranium-plutonium mixed oxide (MOX), containing up to 12% PuO 2 , in a very limited way. The reprocessed uranium (RepU) is also re-enriched and recycled in LWRs in a few countries. Unfortunately, the utilization of natural uranium resources in thermal neutron reactors is 2 and MOX fuel technology has matured during the past five decades. These fuels are now being manufactured, used and reprocessed on an industrial scale. Mixed uranium- plutonium monocarbide (MC), mononitride (MN) and U-Pu-Zr alloys are recognized as advanced fuels

  4. Supplymentary type semiconductor device and manufacturing method. Soho gata handotai sochi oyobi sono seizo hoho

    Energy Technology Data Exchange (ETDEWEB)

    Uno, Masaaki

    1990-01-08

    As a supplementary type semiconductor device has a complicated structure, it is extremely difficult to construct it in a three dimensional structure. This invention aims to reduce its occupying area by forming p-channel and n-channel transistors in a solid structure; moreover in an easy method of production. In other words, an opening is made in the element-forming region of a semiconductor substrate, forming a gate-insulation film on each of the p-type and n-type semiconductors which are exposed on the two facing surfaces; on it formed a gate electrode; p-type semiconductor surface is used as a channel domain; a drain region of n-channel transistor on one surface and a source region on another surface; the n-type semiconductor surface corresponding to the gate electrode is used as a channel region; a source region of the n-channel transistor is formed on the same surface and the drain region on the substrate surface. Occupied area is thus made less and the production gets easier. 20 figs.

  5. Advanced Methods for Direct Ink Write Additive Manufacturing

    Energy Technology Data Exchange (ETDEWEB)

    Compel, W. S. [Lawrence Livermore National Lab. (LLNL), Livermore, CA (United States); Lewicki, J. P. [Lawrence Livermore National Lab. (LLNL), Livermore, CA (United States)

    2018-01-24

    Lawrence Livermore National Laboratory is one of the world’s premier labs for research and development of additive manufacturing processes. Out of these many processes, direct ink write (DIW) is arguably one of the most relevant for the manufacture of architected polymeric materials, components and hardware. However, a bottleneck in this pipeline that has largely been ignored to date is the lack of advanced software implementation with respect to toolpath execution. There remains to be a convenient, automated method to design and produce complex parts that is user-friendly and enabling for the realization of next generation designs and structures. For a material to be suitable as a DIW ink it must possess the appropriate rheological properties for this process. Most importantly, the material must exhibit shear-thinning in order to extrude through a print head and have a rapid recovery of its static shear modulus. This makes it possible for the extrudate to be self-supporting upon exiting the print head. While this and other prerequisites narrow the scope of ‘offthe- shelf’ printable materials directly amenable to DIW, the process still tolerates a wide range of potential feedstock materials. These include metallic alloys, inorganic solvent borne dispersions, polymeric melts, filler stabilized monomer compositions, pre-elastomeric feedstocks and thermoset resins each of which requires custom print conditions tailored to the individual ink. As such, an ink perfectly suited for DIW may be prematurely determined to be undesirable for the process if printed under the wrong conditions. Defining appropriate print conditions such as extrusion rate, layer height, and maximum bridge length is a vital first step in validating an ink’s DIW capability.

  6. Feature scale modeling for etching and deposition processes in semiconductor manufacturing

    International Nuclear Information System (INIS)

    Pyka, W.

    2000-04-01

    Simulation of etching and deposition processes as well as three-dimensional geometry generation are important issues in state of the art TCAD applications. Three-dimensional effects are gaining importance for semiconductor devices and for their interconnects. Therefore a strictly physically based simulation of their topography is required. Accurate investigation of single etching and deposition processes has become equally important as process integration. Within this context several aspects of three-dimensional topography simulation have been covered by this thesis and new and interesting results have been achieved in various areas. The algorithmic core of the cell-based structuring element surface propagation method has been optimized and has been eliminated from its position as factor which predominantly determines the required CPU time. In parallel with investigated optimization techniques and required by various process models, the implementation of the surface normal calculation and the special handling of voids and unconnected parts of the geometry has been completed in three dimensions. A process-step-based solid modeling tool which incorporates layout data as well as aerial image simulation has been supplied. It can be coupled with the topography simulation and includes simple geometrically based models for CMP and oxidation. In the presented combination, the tool makes use of the design information stored in the layout file, combines it with the manufacturing recipe, and hence is extremely helpful for the automatic generation of three-dimensional structures. Its usefulness has been proven with several interconnect examples. Regarding topography models, resist development not only turned out to be very helpful for predicting exposed and etched resist profiles within a rigorous lithography simulation, but, by means of benchmark examples, also demonstrated the extraordinary stability of the proposed cellular surface movement algorithm. With respect to

  7. Prosperity Game: Advanced Manufacturing Day, May 17, 1994

    Energy Technology Data Exchange (ETDEWEB)

    Berman, M.

    1994-12-01

    Prosperity Games are an outgrowth and adaptation of move/countermove and seminar War Games. Prosperity Games are simulations that explore complex issues in a variety of areas including economics, politics, sociology, environment, education and research. These issues can be examined from a variety of perspectives ranging from a global, macroeconomic and geopolitical viewpoint down to the details of customer/supplier/market interactions in specific industries. All Prosperity Games are unique in that both the game format and the player contributions vary from game to game. This report documents a 90-minute Prosperity Game conducted as part of Advanced Manufacturing Day on May 17, 1994. This was the fourth game conducted under the direction of the Center for National Industrial Alliances at Sandia. Although previous games lasted from one to two days, this abbreviated game produced interesting and important results. Most of the strategies proposed in previous games were reiterated here. These included policy changes in international trade, tax laws, the legal system, and the educational system. Government support of new technologies was encouraged as well as government-industry partnerships. The importance of language in international trade was an original contribution of this game. The deliberations and recommendations of these teams provide valuable insights as to the views of this diverse group of decision makers concerning policy changes, foreign competition, and the development, delivery and commercialization of new technologies.

  8. Advanced Manufacturing Technology Implementation Process in SME: Critical Success Factors

    Directory of Open Access Journals (Sweden)

    Jani Rahardjo

    2010-01-01

    Full Text Available The aim of this paper is to present critical factors that constitute a successful implementation of the Advanced Manufacturing Technologies (AMT in Small Medium Enterprise (SME. Many large companies have applied AMT and the applications have shown significant results in this global market era. Conveniently, these phenomenons are also engaged to Small Medium Enterprises (SME that of high demands on performing high quality product, fast delivery, reliable and more flexible. The implementation of AMT follow several processes namely pre installation, installation, improvement and mature. In order to guarantee the succesfull of running these processes, one should consider the Critical Success Factors (CSF. We conducted a survey to 125 SMEs that have implemented AMT, and found that the CSF for each process are moderately different. Good leadership is the main critical success factor for preparing and installation of the AMT. Once the AMT started or installed and arrived at growth stage, the financial availability factor turns into a critical success factor in the AMT implementation. In, mature stage, the support and commitment of top management becomes an important factor for gaining successful implementation. By means of factor analysis, we could point out that strategic factors are the main factors in pre-installation and installation stage. Finally, in the growth stage and mature stage, both tactical and strategic factors are the important factors in the successful of AMT implementation

  9. Advanced Manufacturing Technologies (AMT): Additive Manufactured Hot Fire Planning and Testing in GRC Cell 32 Project

    Science.gov (United States)

    Fikes, John C.

    2014-01-01

    The objective of this project is to hot fire test an additively manufactured thrust chamber assembly TCA (injector and thrust chamber). GRC will install the additively manufactured Inconel 625 injector, two additively manufactured (SLM) water cooled Cu-Cr thrust chamber barrels and one additively manufactured (SLM) water cooled Cu-Cr thrust chamber nozzle on the test stand in Cell 32 and perform hot fire testing of the integrated TCA.

  10. Decade of PV Industry R and D Advances in Silicon Module Manufacturing

    Energy Technology Data Exchange (ETDEWEB)

    Symko-Davis, M.; Mitchell, R.L.; Witt, C.E.; Thomas, H.P. [National Renewable Energy Laboratory; King, R.[U.S. Department of Energy; Ruby, D.S. [Sandia National Laboratories

    2001-01-18

    The US Photovoltaic (PV) industry has made significant technical advances in crystalline silicon (Si) module manufacturing through the PV Manufacturing R and D Project during the past decade. Funded Si technologies in this project have been Czochralski, cast polycrystalline, edge-defined film-fed growth (EFG) ribbon, string ribbon, and Si-film. Specific R and D Si module-manufacturing categories that have shown technical growth and will be discussed are in crystal growth and processing, wafering, cell fabrication, and module manufacturing. These R and D advancements since 1992 have contributed to a 30% decrease in PV manufacturing costs and stimulated a sevenfold increase in PV production capacity.

  11. Semiconductor relay and its manufacture method. Handotai relay oyobi sono seizo hoho

    Energy Technology Data Exchange (ETDEWEB)

    Nakamura, M

    1993-06-01

    The invention relates to a semiconductor relay in which a light emitting diode and a photovoltaic element are arranged in the opposite positions and connected with a light connection and aims to present a light transmission path to transmit input signals to the light emitting diode to the side of the photovoltaic element with a negligible light loss effectively. The invention presents a semiconductor relay, in which a light emitting diode loaded on the first lead frame and the light receiving part of the photovoltaic element to drive a MOSFET element loaded on the second lead frame and acting as a switch element are connected through an insulator tube with an opaque outer wall, and the interior of the insulator tube is filled with a transparent insulating filler, so that the invention affords a light transmission path without light leakage from the interior of the opaque insulator tube and with the stability in the form and no light loss. 3 figs.

  12. Center for Advanced Materials Manufacturing | College of Engineering &

    Science.gov (United States)

    generation, transmission and purification; biomedical applications; green manufacturing techniques, and finally materials used for national defense by the Navy, Air Force, and Army. Specific areas of research

  13. Advanced Drying Process for Lower Manufacturing Cost of Electrodes

    Energy Technology Data Exchange (ETDEWEB)

    Ahmad, Iftikhar [Lambda Technologies, Inc., Morrisville, NC (United States); Zhang, Pu [Lambda Technologies, Inc., Morrisville, NC (United States)

    2016-11-30

    For this Vehicle Technologies Incubator/Energy Storage R&D topic, Lambda Technologies teamed with Navitas Systems and proposed a new advanced drying process that promised a 5X reduction in electrode drying time and significant reduction in the cost of large format lithium batteries used in PEV's. The operating principle of the proposed process was to use penetrating radiant energy source Variable Frequency Microwaves (VFM), that are selectively absorbed by the polar water or solvent molecules instantly in the entire volume of the electrode. The solvent molecules are thus driven out of the electrode thickness making the process more efficient and much faster than convective drying method. To evaluate the Advanced Drying Process (ADP) a hybrid prototype system utilizing VFM and hot air flow was designed and fabricated. While VFM drives the solvent out of the electrode thickness, the hot air flow exhausts the solvent vapors out of the chamber. The drying results from this prototype were very encouraging. For water based anodes there is a 5X drying advantage (time & length of oven) in using ADP over standard drying system and for the NMP based cathodes the reduction in drying time has 3X benefit. For energy savings the power consumption measurements were performed to ADP prototype and compared with the convection standard drying oven. The data collected demonstrated over 40% saving in power consumption with ADP as compared to the convection drying systems. The energy savings are one of the operational cost benefits possible with ADP. To further speed up the drying process, the ADP prototype was explored as a booster module before the convection oven and for the electrode material being evaluated it was possible to increase the drying speed by a factor of 4, which could not be accomplished with the standard dryer without surface defects and cracks. The instantaneous penetration of microwave in the entire slurry thickness showed a major advantage in rapid drying of

  14. Feasibility Study of Nanoscale Semiconductor Manufacture Using Thermal Dip Pen Nanolithography

    National Research Council Canada - National Science Library

    King, William P

    2006-01-01

    ...) for the purpose of nanoscale electronics manufacturing. In this project, we have demonstrated that using the thermal DPN technique that both indium metal, and semiconducting organic materials (PDDT, PVDF...

  15. Multiscale and Multiphysics Modeling of Additive Manufacturing of Advanced Materials

    Science.gov (United States)

    Liou, Frank; Newkirk, Joseph; Fan, Zhiqiang; Sparks, Todd; Chen, Xueyang; Fletcher, Kenneth; Zhang, Jingwei; Zhang, Yunlu; Kumar, Kannan Suresh; Karnati, Sreekar

    2015-01-01

    The objective of this proposed project is to research and develop a prediction tool for advanced additive manufacturing (AAM) processes for advanced materials and develop experimental methods to provide fundamental properties and establish validation data. Aircraft structures and engines demand materials that are stronger, useable at much higher temperatures, provide less acoustic transmission, and enable more aeroelastic tailoring than those currently used. Significant improvements in properties can only be achieved by processing the materials under nonequilibrium conditions, such as AAM processes. AAM processes encompass a class of processes that use a focused heat source to create a melt pool on a substrate. Examples include Electron Beam Freeform Fabrication and Direct Metal Deposition. These types of additive processes enable fabrication of parts directly from CAD drawings. To achieve the desired material properties and geometries of the final structure, assessing the impact of process parameters and predicting optimized conditions with numerical modeling as an effective prediction tool is necessary. The targets for the processing are multiple and at different spatial scales, and the physical phenomena associated occur in multiphysics and multiscale. In this project, the research work has been developed to model AAM processes in a multiscale and multiphysics approach. A macroscale model was developed to investigate the residual stresses and distortion in AAM processes. A sequentially coupled, thermomechanical, finite element model was developed and validated experimentally. The results showed the temperature distribution, residual stress, and deformation within the formed deposits and substrates. A mesoscale model was developed to include heat transfer, phase change with mushy zone, incompressible free surface flow, solute redistribution, and surface tension. Because of excessive computing time needed, a parallel computing approach was also tested. In addition

  16. [Chinese medicine industry 4.0:advancing digital pharmaceutical manufacture toward intelligent pharmaceutical manufacture].

    Science.gov (United States)

    Cheng, Yi-Yu; Qu, Hai-Bin; Zhang, Bo-Li

    2016-01-01

    A perspective analysis on the technological innovation in pharmaceutical engineering of Chinese medicine unveils a vision on "Future Factory" of Chinese medicine industry in mind. The strategy as well as the technical roadmap of "Chinese medicine industry 4.0" is proposed, with the projection of related core technology system. It is clarified that the technical development path of Chinese medicine industry from digital manufacture to intelligent manufacture. On the basis of precisely defining technical terms such as process control, on-line detection and process quality monitoring for Chinese medicine manufacture, the technical concepts and characteristics of intelligent pharmaceutical manufacture as well as digital pharmaceutical manufacture are elaborated. Promoting wide applications of digital manufacturing technology of Chinese medicine is strongly recommended. Through completely informationized manufacturing processes and multi-discipline cluster innovation, intelligent manufacturing technology of Chinese medicine should be developed, which would provide a new driving force for Chinese medicine industry in technology upgrade, product quality enhancement and efficiency improvement. Copyright© by the Chinese Pharmaceutical Association.

  17. Manufacturing Advanced Channel Wall Rocket Liners, Phase I

    Data.gov (United States)

    National Aeronautics and Space Administration — This SBIR will adapt and demonstrate a low cost flexible method of manufacturing channel wall liquid rocket nozzles and combustors, while providing developers a...

  18. Space Technology Mission Directorate Game Changing Development Program FY2015 Annual Program Review: Advanced Manufacturing Technology

    Science.gov (United States)

    Vickers, John; Fikes, John

    2015-01-01

    The Advance Manufacturing Technology (AMT) Project supports multiple activities within the Administration's National Manufacturing Initiative. A key component of the Initiative is the Advanced Manufacturing National Program Office (AMNPO), which includes participation from all federal agencies involved in U.S. manufacturing. In support of the AMNPO the AMT Project supports building and Growing the National Network for Manufacturing Innovation through a public-private partnership designed to help the industrial community accelerate manufacturing innovation. Integration with other projects/programs and partnerships: STMD (Space Technology Mission Directorate), HEOMD, other Centers; Industry, Academia; OGA's (e.g., DOD, DOE, DOC, USDA, NASA, NSF); Office of Science and Technology Policy, NIST Advanced Manufacturing Program Office; Generate insight within NASA and cross-agency for technology development priorities and investments. Technology Infusion Plan: PC; Potential customer infusion (TDM, HEOMD, SMD, OGA, Industry); Leverage; Collaborate with other Agencies, Industry and Academia; NASA roadmap. Initiatives include: Advanced Near Net Shape Technology Integrally Stiffened Cylinder Process Development (launch vehicles, sounding rockets); Materials Genome; Low Cost Upper Stage-Class Propulsion; Additive Construction with Mobile Emplacement (ACME); National Center for Advanced Manufacturing.

  19. Advanced Manufacturing Technologies (AMT): Additive Manufactured Hot Fire Planning and Testing in GRC Cell 32

    Data.gov (United States)

    National Aeronautics and Space Administration — The objective of this project is to hot fire test an additively manufactured thrust chamber assembly TCA (injector and thrust chamber). GRC will install the...

  20. Advanced manufacturing technologies for improved competitiveness of the South African manufacturing industry

    CSIR Research Space (South Africa)

    Tlale, NS

    2008-11-01

    Full Text Available In this paper the manufacturing environment with regards to technology and market is discussed. Both the South African and global view are given, together with technology management strategies. Value added products are described and determined...

  1. Metal Advanced Manufacturing Bot-Assisted Assembly (MAMBA) Process, Phase I

    Data.gov (United States)

    National Aeronautics and Space Administration — Tethers Unlimited, Inc. (TUI) proposes to develop the Metal Advanced Manufacturing Bot-Assisted Assembly (MAMBA) Process, a robotically managed metal press and...

  2. Worker exposure to methanol vapors during cleaning of semiconductor wafers in a manufacturing setting.

    Science.gov (United States)

    Gaffney, Shannon; Moody, Emily; McKinley, Meg; Knutsen, Jeffrey; Madl, Amy; Paustenbach, Dennis

    2008-05-01

    An exposure simulation was conducted to characterize methanol exposure of workers who cleaned wafers in quality control departments within the semiconductor industry. Short-term (15 min) and long-term (2-4 hr) personal and area samples (at distances of 1 m and 3-6 m from the source) were collected during the 2-day simulation. On the first day, 45 mL of methanol were used per hour by a single worker washing wafers in a 102 m(3) room with a ventilation rate of about 10 air changes per hour (ACH). Virtually all methanol volatilized. To assess exposures under conditions associated with higher productivity, on the second day, two workers cleaned wafers simultaneously, together using methanol at over twice the rate of the first day (95 mL/hr). On this day, the ventilation rate was halved (5 ACH). Personal concentrations on the first day averaged 60 ppm (SD = 46 ppm) and ranged from 10-140 ppm. On the second day, personal concentrations for both workers averaged 118 ppm (SD = 50 ppm; range: 64-270 ppm). Area concentrations measured on the first day at 1 m from the source and throughout the balance of the room averaged 29 ppm (SD = 19 ppm; range: 4-83 ppm) and 18 ppm (SD = 12 ppm; range: 3-42 ppm), respectively. As expected, area concentrations measured on the second day were higher than the first and averaged 73 ppm (SD = 25 ppm; range: 27-140 ppm) at 1 meter and 48 ppm (SD = 13 ppm; range: 21-67 ppm) throughout the balance of the room. The results of this simulation suggest that the use of methanol to clean semiconductor wafers without the use of local exhaust ventilation and with relatively low room ventilation rates is unlikely to result in worker exposures exceeding the current ACGIH(R) threshold limit value of 200 ppm. This study also confirmed prior studies suggesting that when a relatively volatile chemical is located within arm's length (near field), breathing zone concentrations will be about two- to threefold greater than the room concentration when the air

  3. Innovation Training within the Australian Advanced Manufacturing Industry

    Science.gov (United States)

    Donovan, Jerome Denis; Maritz, Alex; McLellan, Andrew

    2013-01-01

    Innovation has emerged as a core driver for the future profitability and success of the manufacturing sector, and increasingly both governments and the private sector are examining ways to support the development of innovation capabilities within organisations. In this research, we have evaluated a government-funded innovation training course…

  4. Impacts of Advanced Manufacturing Technology on Parametric Estimating

    Science.gov (United States)

    1989-12-01

    been build ( Blois , p. 65). As firms move up the levels of automation, there is a large capital investment to acquire robots, computer numerically...Affordable Acquisition Approach Study, Executive Summary, Air Force Systems Command, Andrews AFB, Maryland, February 9, 1983. Blois , K.J., "Manufacturing

  5. Effects of fluorine contamination on spin-on dielectric thickness in semiconductor manufacturing

    Science.gov (United States)

    Kim, Hyoung-ryeun; Hong, Soonsang; Kim, Samyoung; Oh, Changyeol; Hwang, Sung Min

    2018-03-01

    In the recent semiconductor industry, as the device shrinks, spin-on dielectric (SOD) has been adopted as a widely used material because of its excellent gap-fill, efficient throughput on mass production. SOD film must be uniformly thin, homogeneous and free of particle defects because it has been perfectly perserved after chemical-mechanical polishing (CMP) and etching process. Spin coating is one of the most common techniques for applying SOD thin films to substrates. In spin coating process, the film thickness and uniformity are strong function of the solution viscosity, the final spin speed and the surface properties. Especially, airborne molecular contaminants (AMCs), such as HF, HCl and NH3, are known to change to surface wetting characteristics. In this work, we study the SOD film thickness as a function of fluorine contamination on the wafer surface. To examine the effects of airborne molecular contamination, the wafers are directly exposed to HF fume followed by SOD coating. It appears that the film thickness decreases by higher contact angle on the wafer surface due to fluorine contamination. The thickness of the SOD film decreased with increasing fluorine contamination on the wafer surface. It means that the wafer surface with more hydrophobic property generates less hydrogen bonding with the functional group of Si-NH in polysilazane(PSZ)-SOD film. Therefore, the wetting properties of silicon wafer surfaces can be degraded by inorganic contamination in SOD coating process.

  6. Gender differences on the job satisfaction in the phase of implementing advanced manufacturing technology in the Chinese manufacturing firms.

    Science.gov (United States)

    Yu, Na; Shen, Li Ming; Lewark, Siegfried

    2012-01-01

    This research gave an effort to study on gender differences in the job satisfaction for technological innovation at Chinese manufacturing firm. The exploratory study was conducted in four Chinese furniture manufacturing firms, which are all in the phases of introducing advanced manufacturing system. The results of statistical analysis show that general satisfaction of female employees to their jobs is significantly higher than male employees. In addition, supervisory satisfaction of female employees is significantly higher than male employees. The findings of the study reveal that activities are suggested to be carried out to increase the job satisfaction of male employees, especially improve communication and relationship between the managerial and the non-managerial levels in the innovation process. In addition, the higher job satisfaction of female employees could be considered a positive factor for the successful implementation of AMT in the technological innovation, although male employees are still dominated work force in the case study firms.

  7. Advances in infrastructure support for flat panel display manufacturing

    Science.gov (United States)

    Bardsley, James N.; Ciesinski, Michael F.; Pinnel, M. Robert

    1997-07-01

    The success of the US display industry, both in providing high-performance displays for the US Department of Defense at reasonable cost and in capturing a significant share of the global civilian market, depends on maintaining technological leadership and on building efficient manufacturing capabilities. The US Display Consortium (USDC) was set up in 1993 by the US Government and private industry to guide the development of the infrastructure needed to support the manufacturing of flat panel displays. This mainly involves the supply of equipment and materials, but also includes the formation of partnerships and the training of a skilled labor force. Examples are given of successful development projects, some involving USDC participation, others through independent efforts of its member companies. These examples show that US-based companies can achieve leadership positions in this young and rapidly growing global market.

  8. Ergonomic Challenges in Conventional and Advanced Apparel Manufacturing.

    Science.gov (United States)

    1992-10-01

    Attn.: Nina Harris Corporate Safety Director 2680 Pershing Avenue P.O. Drawer E Memphis, TN 38112 Griffin, GA 30224 901-320-3200 404-227-5581 Disneyland ...Box 498 Rome, GA 30161 Granite Quarry, NC 28072-0498 404-295-6008 Grant City Manufacturing Corporation Gerber Garment Technology, Inc. Old Highway...169 North See CMS Division Grant City, MO 64456 Gibson, Dunn & Crutcher Lawyers Sue Unger, Librarian Great West Casualty Company 1050 Connecticut

  9. Advancing semiconductor-electrocatalyst systems: application of surface transformation films and nanosphere lithography.

    Science.gov (United States)

    Brinkert, Katharina; Richter, Matthias H; Akay, Ömer; Giersig, Michael; Fountaine, Katherine T; Lewerenz, Hans-Joachim

    2018-05-24

    Photoelectrochemical (PEC) cells offer the possibility of carbon-neutral solar fuel production through artificial photosynthesis. The pursued design involves technologically advanced III-V semiconductor absorbers coupled via an interfacial film to an electrocatalyst layer. These systems have been prepared by in situ surface transformations in electrochemical environments. High activity nanostructured electrocatalysts are required for an efficiently operating cell, optimized in their optical and electrical properties. We demonstrate that shadow nanosphere lithography (SNL) is an auspicious tool to systematically create three-dimensional electrocatalyst nanostructures on the semiconductor photoelectrode through controlling their morphology and optical properties. First results are demonstrated by means of the photoelectrochemical production of hydrogen on p-type InP photocathodes where hitherto applied photoelectrodeposition and SNL-deposited Rh electrocatalysts are compared based on their J-V and spectroscopic behavior. We show that smaller polystyrene particle masks achieve higher defect nanostructures of rhodium on the photoelectrode which leads to a higher catalytic activity and larger short circuit currents. Structural analyses including HRSEM and the analysis of the photoelectrode surface composition by using photoelectron spectroscopy support and complement the photoelectrochemical observations. The optical performance is further compared to theoretical models of the nanostructured photoelectrodes on light scattering and propagation.

  10. VO2 microcrystals as an advanced smart window material at semiconductor to metal transition

    Science.gov (United States)

    Basu, Raktima; Magudapathy, P.; Sardar, Manas; Pandian, Ramanathaswamy; Dhara, Sandip

    2017-11-01

    Textured VO2(0 1 1) microcrystals are grown in the monoclinic, M1 phase which undergoes a reversible first order semiconductor to metal transition (SMT) accompanied by a structural phase transition to rutile tetragonal, R phase. Around the phase transition, VO2 also experiences noticeable change in its optical and electrical properties. A change in color of the VO2 micro crystals from white to cyan around the transition temperature is observed, which is further understood by absorption of red light using temperature dependent ultraviolet-visible spectroscopic analysis and photoluminescence studies. The absorption of light in the red region is explained by the optical transition between Hubbard states, confirming the electronic correlation as the driving force for SMT in VO2. The thermochromism in VO2 has been studied for smart window applications so far in the IR region, which supports the opening of the band gap in semiconducting phase; whereas there is hardly any report in the management of visible light. The filtering of blue light along with reflection of infrared above the semiconductor to metal transition temperature make VO2 applicable as advanced smart windows for overall heat management of a closure.

  11. VO2 microcrystals as an advanced smart window material at semiconductor to metal transition

    International Nuclear Information System (INIS)

    Basu, Raktima; Pandian, Ramanathaswamy; Dhara, Sandip; Magudapathy, P; Sardar, Manas

    2017-01-01

    Textured VO 2 (0 1 1) microcrystals are grown in the monoclinic, M1 phase which undergoes a reversible first order semiconductor to metal transition (SMT) accompanied by a structural phase transition to rutile tetragonal, R phase. Around the phase transition, VO 2 also experiences noticeable change in its optical and electrical properties. A change in color of the VO 2 micro crystals from white to cyan around the transition temperature is observed, which is further understood by absorption of red light using temperature dependent ultraviolet–visible spectroscopic analysis and photoluminescence studies. The absorption of light in the red region is explained by the optical transition between Hubbard states, confirming the electronic correlation as the driving force for SMT in VO 2 . The thermochromism in VO 2 has been studied for smart window applications so far in the IR region, which supports the opening of the band gap in semiconducting phase; whereas there is hardly any report in the management of visible light. The filtering of blue light along with reflection of infrared above the semiconductor to metal transition temperature make VO 2 applicable as advanced smart windows for overall heat management of a closure. (paper)

  12. Calibration and validation of coarse-grained models of atomic systems: application to semiconductor manufacturing

    Science.gov (United States)

    Farrell, Kathryn; Oden, J. Tinsley

    2014-07-01

    methods through applications to representative atomic structures and we discuss extensions to the validation process for molecular models of polymer structures encountered in certain semiconductor nanomanufacturing processes. The powerful method of model plausibility as a means for selecting interaction potentials for coarse-grained models is discussed in connection with a coarse-grained hexane molecule. Discussions of how all-atom information is used to construct priors are contained in an appendix.

  13. A comprehensive review of arsenic levels in the semiconductor manufacturing industry.

    Science.gov (United States)

    Park, Donguk; Yang, Haengsun; Jeong, Jeeyeon; Ha, Kwonchul; Choi, Sangjun; Kim, Chinyon; Yoon, Chungsik; Park, Dooyong; Paek, Domyung

    2010-11-01

    This paper presents a summary of arsenic level statistics from air and wipe samples taken from studies conducted in fabrication operations. The main objectives of this study were not only to describe arsenic measurement data but also, through a literature review, to categorize fabrication workers in accordance with observed arsenic levels. All airborne arsenic measurements reported were included in the summary statistics for analysis of the measurement data. The arithmetic mean was estimated assuming a lognormal distribution from the geometric mean and the geometric standard deviation or the range. In addition, weighted arithmetic means (WAMs) were calculated based on the number of measurements reported for each mean. Analysis of variance (ANOVA) was employed to compare arsenic levels classified according to several categories such as the year, sampling type, location sampled, operation type, and cleaning technique. Nine papers were found reporting airborne arsenic measurement data from maintenance workers or maintenance areas in semiconductor chip-making plants. A total of 40 statistical summaries from seven articles were identified that represented a total of 423 airborne arsenic measurements. Arsenic exposure levels taken during normal operating activities in implantation operations (WAM = 1.6 μg m⁻³, no. of samples = 77, no. of statistical summaries = 2) were found to be lower than exposure levels of engineers who were involved in maintenance works (7.7 μg m⁻³, no. of samples = 181, no. of statistical summaries = 19). The highest level (WAM = 218.6 μg m⁻³) was associated with various maintenance works performed inside an ion implantation chamber. ANOVA revealed no significant differences in the WAM arsenic levels among the categorizations based on operation and sampling characteristics. Arsenic levels (56.4 μg m⁻³) recorded during maintenance works performed in dry conditions were found to be much higher than those from maintenance works in wet

  14. NATO Advanced Study Institute on Nondestructive Evaluation of Semiconductor Materials and Devices

    CERN Document Server

    1979-01-01

    From September 19-29, a NATO Advanced Study Institute on Non­ destructive Evaluation of Semiconductor Materials and Devices was held at the Villa Tuscolano in Frascati, Italy. A total of 80 attendees and lecturers participated in the program which covered many of the important topics in this field. The subject matter was divided to emphasize the following different types of problems: electrical measurements; acoustic measurements; scanning techniques; optical methods; backscatter methods; x-ray observations; accele­ rated life tests. It would be difficult to give a full discussion of such an Institute without going through the major points of each speaker. Clearly this is the proper task of the eventual readers of these Proceedings. Instead, it would be preferable to stress some general issues. What came through very clearly is that the measurements of the basic scientists in materials and device phenomena are of sub­ stantial immediate concern to the device technologies and end users.

  15. Review on Advances of Functional Material for Additive Manufacturing

    Science.gov (United States)

    Zulkifli, Nur Amalina Binti; Akmal Johar, Muhammad; Faizan Marwah, Omar Mohd; Irwan Ibrahim, Mohd Halim

    2017-08-01

    The attempt of finding and making new materials in improving products that are already in the market are widely done by researchers nowadays. This project is focusing on making new materials for functional material through additive manufacturing application. The idea of this project came from the ability limitation of capacitor in market nowadays in storing higher charges but smaller in size. Powder glass is the new material that could to be used as a dielectric material for capacitor with the help of palm kernel oil as the binder. This paper reviews on applications done through additive manufacturing method and also types of functional materials used in this method previously. Structure of a capacitor, dielectric properties and measurement techniques that are trying to be carried out are also explains in this paper. Last part of this paper brief on the material proposal and reasons those materials are chosen. New dielectric material for capacitor which are able to store more charges but still small in size are expected to be produced as the outcome of this research.

  16. Analysis of the influence of advanced materials for aerospace products R and D and manufacturing cost

    International Nuclear Information System (INIS)

    Shen, A W; Guo, J L; Wang, Z J

    2015-01-01

    In this paper, we pointed out the deficiency of traditional cost estimation model about aerospace products Research and Development (R and D) and manufacturing based on analyzing the widely use of advanced materials in aviation products. Then we put up with the estimating formulas of cost factor, which representing the influences of advanced materials on the labor cost rate and manufacturing materials cost rate. The values ranges of the common advanced materials such as composite materials, titanium alloy are present in the labor and materials two aspects. Finally, we estimate the R and D and manufacturing cost of F/A-18, F/A- 22, B-1B and B-2 aircraft based on the common DAPCA IV model and the modified model proposed by this paper. The calculation results show that the calculation precision improved greatly by the proposed method which considering advanced materials. So we can know the proposed method is scientific and reasonable. (paper)

  17. Analysis of the influence of advanced materials for aerospace products R&D and manufacturing cost

    Science.gov (United States)

    Shen, A. W.; Guo, J. L.; Wang, Z. J.

    2015-12-01

    In this paper, we pointed out the deficiency of traditional cost estimation model about aerospace products Research & Development (R&D) and manufacturing based on analyzing the widely use of advanced materials in aviation products. Then we put up with the estimating formulas of cost factor, which representing the influences of advanced materials on the labor cost rate and manufacturing materials cost rate. The values ranges of the common advanced materials such as composite materials, titanium alloy are present in the labor and materials two aspects. Finally, we estimate the R&D and manufacturing cost of F/A-18, F/A- 22, B-1B and B-2 aircraft based on the common DAPCA IV model and the modified model proposed by this paper. The calculation results show that the calculation precision improved greatly by the proposed method which considering advanced materials. So we can know the proposed method is scientific and reasonable.

  18. Good Manufacturing Practices (GMP) manufacturing of advanced therapy medicinal products: a novel tailored model for optimizing performance and estimating costs.

    Science.gov (United States)

    Abou-El-Enein, Mohamed; Römhild, Andy; Kaiser, Daniel; Beier, Carola; Bauer, Gerhard; Volk, Hans-Dieter; Reinke, Petra

    2013-03-01

    Advanced therapy medicinal products (ATMP) have gained considerable attention in academia due to their therapeutic potential. Good Manufacturing Practice (GMP) principles ensure the quality and sterility of manufacturing these products. We developed a model for estimating the manufacturing costs of cell therapy products and optimizing the performance of academic GMP-facilities. The "Clean-Room Technology Assessment Technique" (CTAT) was tested prospectively in the GMP facility of BCRT, Berlin, Germany, then retrospectively in the GMP facility of the University of California-Davis, California, USA. CTAT is a two-level model: level one identifies operational (core) processes and measures their fixed costs; level two identifies production (supporting) processes and measures their variable costs. The model comprises several tools to measure and optimize performance of these processes. Manufacturing costs were itemized using adjusted micro-costing system. CTAT identified GMP activities with strong correlation to the manufacturing process of cell-based products. Building best practice standards allowed for performance improvement and elimination of human errors. The model also demonstrated the unidirectional dependencies that may exist among the core GMP activities. When compared to traditional business models, the CTAT assessment resulted in a more accurate allocation of annual expenses. The estimated expenses were used to set a fee structure for both GMP facilities. A mathematical equation was also developed to provide the final product cost. CTAT can be a useful tool in estimating accurate costs for the ATMPs manufactured in an optimized GMP process. These estimates are useful when analyzing the cost-effectiveness of these novel interventions. Copyright © 2013 International Society for Cellular Therapy. Published by Elsevier Inc. All rights reserved.

  19. Advanced laser processing for industrial solar cell manufacturing (ALPINISM)

    Energy Technology Data Exchange (ETDEWEB)

    Mason, N.B.; Fieret, J. [Exitech Ltd. (United Kingdom)

    2006-05-04

    The study was aimed at improving methods for the manufacture of high efficiency solar cells and thereby increase production rates. The project focused on the laser grooved buried contact solar cell (LGBC) which is produced by high-speed laser machining. The specific objectives were (i) to optimise the laser technology for high speed processing; (ii) to optimise the solar cell process conditions for high speed processing; (iii) to produce a prototype tool and demonstrate high throughput; and (iv) to demonstrate increased cell efficiency using laser processing of rear contact. Essentially, all the objectives were met and Exitech have already sold six production tools and one research tool developed in this study. In addition, it was found that laser processing at the rear cell surface offers the prospect of LGBC solar cells with an efficiency of 20 per cent. BP Solar Limited carried out this work under contract to the DTI.

  20. Model-based Engineering for the Integration of Manufacturing Systems with Advanced Analytics

    OpenAIRE

    Lechevalier , David; Narayanan , Anantha; Rachuri , Sudarsan; Foufou , Sebti; Lee , Y Tina

    2016-01-01

    Part 3: Interoperability and Systems Integration; International audience; To employ data analytics effectively and efficiently on manufacturing systems, engineers and data scientists need to collaborate closely to bring their domain knowledge together. In this paper, we introduce a domain-specific modeling approach to integrate a manufacturing system model with advanced analytics, in particular neural networks, to model predictions. Our approach combines a set of meta-models and transformatio...

  1. Emerging technology: A key enabler for modernizing pharmaceutical manufacturing and advancing product quality.

    Science.gov (United States)

    O'Connor, Thomas F; Yu, Lawrence X; Lee, Sau L

    2016-07-25

    Issues in product quality have produced recalls and caused drug shortages in United States (U.S.) in the past few years. These quality issues were often due to outdated manufacturing technologies and equipment as well as lack of an effective quality management system. To ensure consistent supply of safe, effective and high-quality drug products available to the patients, the U.S. Food and Drug Administration (FDA) supports modernizing pharmaceutical manufacturing for improvements in product quality. Specifically, five new initiatives are proposed here to achieve this goal. They include: (i) advancing regulatory science for pharmaceutical manufacturing; (ii) establishing a public-private institute for pharmaceutical manufacturing innovation; (iii) creating incentives for investment in the technological upgrade of manufacturing processes and facilities; (iv) leveraging external expertise for regulatory quality assessment of emerging technologies; and (v) promoting the international harmonization of approaches for expediting the global adoption of emerging technologies. Published by Elsevier B.V.

  2. 3D metal droplet printing development and advanced materials additive manufacturing

    Directory of Open Access Journals (Sweden)

    Lawrence E. Murr

    2017-01-01

    Full Text Available While commercial additive manufacturing processes involving direct metal wire or powder deposition along with powder bed fusion technologies using laser and electron beam melting have proliferated over the past decade, inkjet printing using molten metal droplets for direct, 3D printing has been elusive. In this paper we review the more than three decades of development of metal droplet generation for precision additive manufacturing applications utilizing advanced, high-temperature metals and alloys. Issues concerning process optimization, including product structure and properties affected by oxidation are discussed and some comparisons of related additive manufactured microstructures are presented.

  3. Computational modeling, optimization and manufacturing simulation of advanced engineering materials

    CERN Document Server

    2016-01-01

    This volume presents recent research work focused in the development of adequate theoretical and numerical formulations to describe the behavior of advanced engineering materials.  Particular emphasis is devoted to applications in the fields of biological tissues, phase changing and porous materials, polymers and to micro/nano scale modeling. Sensitivity analysis, gradient and non-gradient based optimization procedures are involved in many of the chapters, aiming at the solution of constitutive inverse problems and parameter identification. All these relevant topics are exposed by experienced international and inter institutional research teams resulting in a high level compilation. The book is a valuable research reference for scientists, senior undergraduate and graduate students, as well as for engineers acting in the area of computational material modeling.

  4. Enhancing cell and gene therapy manufacture through the application of advanced fluorescent optical sensors (Review).

    Science.gov (United States)

    Harrison, Richard P; Chauhan, Veeren M

    2017-12-15

    Cell and gene therapies (CGTs) are examples of future therapeutics that can be used to cure or alleviate the symptoms of disease, by repairing damaged tissue or reprogramming defective genetic information. However, despite the recent advancements in clinical trial outcomes, the path to wide-scale adoption of CGTs remains challenging, such that the emergence of a "blockbuster" therapy has so far proved elusive. Manufacturing solutions for these therapies require the application of scalable and replicable cell manufacturing techniques, which differ markedly from the existing pharmaceutical incumbent. Attempts to adopt this pharmaceutical model for CGT manufacture have largely proved unsuccessful. The most significant challenges facing CGT manufacturing are process analytical testing and quality control. These procedures would greatly benefit from improved sensory technologies that allow direct measurement of critical quality attributes, such as pH, oxygen, lactate and glucose. In turn, this would make manufacturing more robust, replicable and standardized. In this review, the present-day state and prospects of CGT manufacturing are discussed. In particular, the authors highlight the role of fluorescent optical sensors, focusing on their strengths and weaknesses, for CGT manufacture. The review concludes by discussing how the integration of CGT manufacture and fluorescent optical sensors could augment future bioprocessing approaches.

  5. Recent advances in Tl Br, Cd Te and CdZnTe semiconductor radiation detectors: a review

    International Nuclear Information System (INIS)

    Oliveira, Icimone B.

    2011-01-01

    The success in the development of radiation spectrometers operating at room temperature is based on many years of effort on the part of large numbers of workers around the world. These individuals have contributed to the understanding of the fundamental materials issues associated with the growth of semiconductors for this application, the development of device fabrication and processing technology, and advances in low noise electronics and pulse processing. Progress in this field continues at an accelerated pace, as in evidenced by the improvements in detector performance and by the growing number of commercial products. Thus, the last years have been seen continued effort in the development of room temperature compound semiconductors devices. High-Z compound semiconductor detectors has been explored for high energy resolution, high detection efficiency and are of low cost. Compound semiconductors detectors are well suited for addressing needs of demanding applications such as bore hole logging where high operating temperature are encountered. In this work recent developments in semiconductors detectors were reviewed. This review concentrated on thallium bromide (TlBr), cadmium zinc telluride (CdZnTe) and cadmium telluride (CdTe) crystals detectors. TlBr has higher stopping power compared to common semiconductor materials because it has the higher photoelectric and total attenuation coefficients over wide energy range from 100 keV to 1 MeV. CdTe and CdZnTe detectors have several attractive features for detecting X-ray and low energy gamma ray. Their relatively large band gaps lead to a relatively low leakage current and offer an excellent energy resolution at room temperature. A literature survey and bibliography was also included. (author)

  6. Recent advances in Tl Br, Cd Te and CdZnTe semiconductor radiation detectors: a review

    Energy Technology Data Exchange (ETDEWEB)

    Oliveira, Icimone B. [Universidade Bandeirante (UNIBAN), Sao Paulo, SP (Brazil)

    2011-07-01

    The success in the development of radiation spectrometers operating at room temperature is based on many years of effort on the part of large numbers of workers around the world. These individuals have contributed to the understanding of the fundamental materials issues associated with the growth of semiconductors for this application, the development of device fabrication and processing technology, and advances in low noise electronics and pulse processing. Progress in this field continues at an accelerated pace, as in evidenced by the improvements in detector performance and by the growing number of commercial products. Thus, the last years have been seen continued effort in the development of room temperature compound semiconductors devices. High-Z compound semiconductor detectors has been explored for high energy resolution, high detection efficiency and are of low cost. Compound semiconductors detectors are well suited for addressing needs of demanding applications such as bore hole logging where high operating temperature are encountered. In this work recent developments in semiconductors detectors were reviewed. This review concentrated on thallium bromide (TlBr), cadmium zinc telluride (CdZnTe) and cadmium telluride (CdTe) crystals detectors. TlBr has higher stopping power compared to common semiconductor materials because it has the higher photoelectric and total attenuation coefficients over wide energy range from 100 keV to 1 MeV. CdTe and CdZnTe detectors have several attractive features for detecting X-ray and low energy gamma ray. Their relatively large band gaps lead to a relatively low leakage current and offer an excellent energy resolution at room temperature. A literature survey and bibliography was also included. (author)

  7. Optimal design of advanced distillation configuration for enhanced energy efficiency of waste solvent recovery process in semiconductor industry

    International Nuclear Information System (INIS)

    Chaniago, Yus Donald; Minh, Le Quang; Khan, Mohd Shariq; Koo, Kee-Kahb; Bahadori, Alireza; Lee, Moonyong

    2015-01-01

    Highlights: • Thermally coupled distillation process is proposed for waste solvent recovery. • A systematic optimization procedure is used to optimize distillation columns. • Response surface methodology is applied to optimal design of distillation column. • Proposed advanced distillation allows energy efficient waste solvent recovery. - Abstract: The semiconductor industry is one of the largest industries in the world. On the other hand, the huge amount of solvent used in the industry results in high production cost and potential environmental damage because most of the valuable chemicals discharged from the process are incinerated at high temperatures. A distillation process is used to recover waste solvent, reduce the production-related costs and protect the environment from the semiconductor industrial waste. Therefore, in this study, a distillation process was used to recover the valuable chemicals from semiconductor industry discharge, which otherwise would have been lost to the environment. The conventional sequence of distillation columns, which was optimized using the Box and sequential quadratic programming method for minimum energy objectives, was used. The energy demands of a distillation problem may have a substantial influence on the profitability of a process. A thermally coupled distillation and heat pump-assisted distillation sequence was implemented to further improve the distillation performance. Finally, a comparison was made between the conventional and advanced distillation sequences, and the optimal conditions for enhancing recovery were determined. The proposed advanced distillation configuration achieved a significant energy saving of 40.5% compared to the conventional column sequence

  8. Present Status and Future Growth of Advanced Maintenance Technology and Strategy in US Manufacturing.

    Science.gov (United States)

    Jin, Xiaoning; Weiss, Brian A; Siegel, David; Lee, Jay

    2016-01-01

    The goals of this paper are to 1) examine the current practices of diagnostics, prognostics, and maintenance employed by United States (U.S.) manufacturers to achieve productivity and quality targets and 2) to understand the present level of maintenance technologies and strategies that are being incorporated into these practices. A study is performed to contrast the impact of various industry-specific factors on the effectiveness and profitability of the implementation of prognostics and health management technologies, and maintenance strategies using both surveys and case studies on a sample of U.S. manufacturing firms ranging from small to mid-sized enterprises (SMEs) to large-sized manufacturing enterprises in various industries. The results obtained provide important insights on the different impacts of specific factors on the successful adoption of these technologies between SMEs and large manufacturing enterprises. The varying degrees of success with respect to current maintenance programs highlight the opportunity for larger manufacturers to improve maintenance practices and consider the use of advanced prognostics and health management (PHM) technology. This paper also provides the existing gaps, barriers, future trends, and roadmaps for manufacturing PHM technology and maintenance strategy.

  9. Technological and organizational diversity and technical advance in the early history of the American semiconductor industry

    Science.gov (United States)

    Cohen, W.; Holbrook, D.; Klepper, S.

    1994-06-01

    This study examines the early years of the semiconductor industry and focuses on the roles played by different size firms in technologically innovative processes. A large and diverse pool of firms participated in the growth of the industry. Three related technological areas were chosen for in-depth analysis: integrated circuits, materials technology, and device packaging. Large business producing vacuum tubes dominated the early production of semiconductor devices. As the market for new devices grew during the 1950's, new firms were founded and existing firms from other industries, e.g. aircraft builders and instrument makers, began to pursue semiconductor electronics. Small firms began to cater to the emerging industry by supplying materials and equipment. These firms contributed to the development of certain aspects of one thousand firms that were playing some part in the semiconductor industry.

  10. Advances and highlights of the CNEA qualification program as high density fuel manufacturer for research reactors

    Energy Technology Data Exchange (ETDEWEB)

    Adelfang, P.; Alvarez, L.; Boero, N.; Calabrese, R.; Echenique, P.; Markiewicz, M.; Pasqualini, E.; Ruggirello, G.; Taboada, H. [Unidad de Actividad Combustibles Nucleares Comision Nacional de Energia Atomica (CNE4), Avda. del Libertador, 8250 C1429BNO Buenos Aires (Argentina)

    2002-07-01

    One of the main objectives of CNEA regarding the fuel for research reactors is the development and qualification of the manufacturing of LEU high-density fuels. The qualification programs for both types of fuels, Silicide fuel and U- x Mo fuel, are similar. They include the following activities: development and set up of the fissile compound manufacturing technology, set up of fuel plate manufacturing, fabrication and irradiation of mini plates and plates, design and fabrication of fuel assembly prototypes for irradiation, post-irradiation examination and feedback for manufacturing improvements. This paper describes the different activities performed within each program during the last year and the main advances and achievements of the programs within this period. The main achievements may be summarized in the following activities: Continuation of the irradiation of the first silicide fuel element in the R A3. Completion of the manufacturing of the second silicide fuel element, licensing and beginning of its irradiation in the R A3. Development of the HMD Process to manufacture U-Mo powder (pUMA project). Set up of fuel plates manufacturing at industrial level using U-Mo powder. Preliminary studies and the design for the irradiation of mini plates, plates and full scale fuel elements with U-Mo and 7 g U/cm{sup 3}. PIE destructive studies for the P-04 silicide fuel prototype (accurate burnup determination through chemical analysis, metallography and SEM of samples from the irradiated fuel plates). Improvement and development of new characterization techniques for high density fuel plates quality control including US testing and densitometric analysis of X-ray examinations. The results obtained in this period are encouraging and also allow to foresee a wider participation of CNEA in the international effort to qualify U-Mo as a new material for the manufacturing of research reactor fuels. (author)

  11. Advances and highlights of the CNEA qualification program as high density fuel manufacturer for research reactors

    International Nuclear Information System (INIS)

    Adelfang, P.; Alvarez, L.; Boero, N.; Calabrese, R.; Echenique, P.; Markiewicz, M.; Pasqualini, E.; Ruggirello, G.; Taboada, H.

    2002-01-01

    One of the main objectives of CNEA regarding the fuel for research reactors is the development and qualification of the manufacturing of LEU high-density fuels. The qualification programs for both types of fuels, Silicide fuel and U- x Mo fuel, are similar. They include the following activities: development and set up of the fissile compound manufacturing technology, set up of fuel plate manufacturing, fabrication and irradiation of mini plates and plates, design and fabrication of fuel assembly prototypes for irradiation, post-irradiation examination and feedback for manufacturing improvements. This paper describes the different activities performed within each program during the last year and the main advances and achievements of the programs within this period. The main achievements may be summarized in the following activities: Continuation of the irradiation of the first silicide fuel element in the R A3. Completion of the manufacturing of the second silicide fuel element, licensing and beginning of its irradiation in the R A3. Development of the HMD Process to manufacture U-Mo powder (pUMA project). Set up of fuel plates manufacturing at industrial level using U-Mo powder. Preliminary studies and the design for the irradiation of mini plates, plates and full scale fuel elements with U-Mo and 7 g U/cm 3 . PIE destructive studies for the P-04 silicide fuel prototype (accurate burnup determination through chemical analysis, metallography and SEM of samples from the irradiated fuel plates). Improvement and development of new characterization techniques for high density fuel plates quality control including US testing and densitometric analysis of X-ray examinations. The results obtained in this period are encouraging and also allow to foresee a wider participation of CNEA in the international effort to qualify U-Mo as a new material for the manufacturing of research reactor fuels. (author)

  12. Semiconductor spintronics

    CERN Document Server

    Xia, Jianbai; Chang, Kai

    2012-01-01

    Semiconductor Spintronics, as an emerging research discipline and an important advanced field in physics, has developed quickly and obtained fruitful results in recent decades. This volume is the first monograph summarizing the physical foundation and the experimental results obtained in this field. With the culmination of the authors' extensive working experiences, this book presents the developing history of semiconductor spintronics, its basic concepts and theories, experimental results, and the prospected future development. This unique book intends to provide a systematic and modern foundation for semiconductor spintronics aimed at researchers, professors, post-doctorates, and graduate students, and to help them master the overall knowledge of spintronics.

  13. Inkjet printing for biosensor fabrication: combining chemistry and technology for advanced manufacturing.

    Science.gov (United States)

    Li, Jia; Rossignol, Fabrice; Macdonald, Joanne

    2015-06-21

    Inkjet printing is emerging at the forefront of biosensor fabrication technologies. Parallel advances in both ink chemistry and printers have led to a biosensor manufacturing approach that is simple, rapid, flexible, high resolution, low cost, efficient for mass production, and extends the capabilities of devices beyond other manufacturing technologies. Here we review for the first time the factors behind successful inkjet biosensor fabrication, including printers, inks, patterning methods, and matrix types. We discuss technical considerations that are important when moving beyond theoretical knowledge to practical implementation. We also highlight significant advances in biosensor functionality that have been realised through inkjet printing. Finally, we consider future possibilities for biosensors enabled by this novel combination of chemistry and technology.

  14. Training for my Life: Lived Experiences of Dislocated Workers in an Advanced Manufacturing Training Program

    OpenAIRE

    Marquita R. Walker

    2012-01-01

    This qualitative paper explores the lived experiences of one group of workers dislocated because of globalized trade policies who completed a hybrid Advanced Manufacturing Training Program (AMTP) by taking advantage of Trade Adjustment Assistance (TAA), a federally-funded program for retraining workers dislocated because of trade policies. The research questions focus on how satisfied these workers are with the services and programs provided by TAA. Focus groups and survey instrument results ...

  15. Advanced Manufacturing Technology: The Perceived Impact on Producer’s Value

    Directory of Open Access Journals (Sweden)

    Rohani Abdullah

    2012-09-01

    Full Text Available The purpose of this study is to determine which AMT has the greatest perceived impact on producer’s value and to identify which AMTs has been most successfully employed. The study population consists of senior manufacturing executives in electrical and electronic firms located in the northern region of Malaysia. The study addresses the senior manufacturing executives’ perceptions on how well specific AMTs have achieved the expectation of the firms implementing them. They are selected as respondents because of their understanding of the technology and their effects, and because as top manufacturing decision makers, their opinions are likely to shape the future technology of the organization. This study found that the type of AMT that perceived the greatest impact on producer’s value is Flexible Manufacturing System, due to its high effects on two dimensions of producer’s value: quality and cost while Just-in-Time is found to be the most successfully employed AMT among respondents. The findings of this study are significant as they contribute to the AMT literature especially in the context of Electrical and Electronic firms. Keywords: advanced manufacturing technology, producer’s value

  16. Manufacturing Initiative

    Data.gov (United States)

    National Aeronautics and Space Administration — The Advanced Manufacturing Technologies (AMT) Project supports multiple activities within the Administration's National Manufacturing Initiative. A key component of...

  17. Abatement of global warming gas emissions from semiconductor manufacturing processes by non-thermal plasma-catalyst systems

    Energy Technology Data Exchange (ETDEWEB)

    Chang, J-S.; Urashima, K. [McMaster Univ., McIARS and Dept. Eng. Phys., Hamilton, Ontario (Canada)

    2009-07-01

    Emission of various hazardous air pollutants (HAPs) and greenhouse gases including perfluoro-compounds (PFCs) from semiconductor industries may cause significant impact on human health and the global environment, has attracted much public attention. In this paper, an application of nonthermal plasma-adsorbent system for a removal of PFCs emission from semiconductor process flue gases is experimentally investigated. The non-thermal plasma reactor used is the ferro-electric packed-bed type barrier discharge plasma and adsorbent reactor used is Zeolite bed reactor. The results show that for a simulated semiconductor process flue gas with C{sub 2}F{sub 6} (2000ppm)/ CF{sub 4}(1000ppm)/ N{sub 2}O(1000ppm)/ N{sub 2}/ Air mixture, 54% of C{sub 2}F{sub 6} and 32% of CF{sub 4} were decomposed by the plasma reactor and 100% of C{sub 2}F{sub 6} and 98% of CF{sub 4} were removed by plasma reactor/Zeolite adsorbent hybrid system. For a simulated semiconductor process flue gas with NF{sub 3} (2000ppm)/ SiF{sub 4}(1000ppm)/ N{sub 2}O(200ppm)/ N{sub 2}/ Air mixture, 92% of NF{sub 3} and 32% of SiF{sub 4} were decomposed by the plasma reactor and total (100%) removal of the pollutant gases was achieved by plasma reactor/Zeolite adsorbent hybrid system. (author)

  18. Abatement of global warming gas emissions from semiconductor manufacturing processes by non-thermal plasma-catalyst systems

    International Nuclear Information System (INIS)

    Chang, J-S.; Urashima, K.

    2009-01-01

    Emission of various hazardous air pollutants (HAPs) and greenhouse gases including perfluoro-compounds (PFCs) from semiconductor industries may cause significant impact on human health and the global environment, has attracted much public attention. In this paper, an application of nonthermal plasma-adsorbent system for a removal of PFCs emission from semiconductor process flue gases is experimentally investigated. The non-thermal plasma reactor used is the ferro-electric packed-bed type barrier discharge plasma and adsorbent reactor used is Zeolite bed reactor. The results show that for a simulated semiconductor process flue gas with C 2 F 6 (2000ppm)/ CF 4 (1000ppm)/ N 2 O(1000ppm)/ N 2 / Air mixture, 54% of C 2 F 6 and 32% of CF 4 were decomposed by the plasma reactor and 100% of C 2 F 6 and 98% of CF 4 were removed by plasma reactor/Zeolite adsorbent hybrid system. For a simulated semiconductor process flue gas with NF 3 (2000ppm)/ SiF 4 (1000ppm)/ N 2 O(200ppm)/ N 2 / Air mixture, 92% of NF 3 and 32% of SiF 4 were decomposed by the plasma reactor and total (100%) removal of the pollutant gases was achieved by plasma reactor/Zeolite adsorbent hybrid system. (author)

  19. Self-slowdown and -advancement of fs pulses in a quantum-dot semiconductor optical amplifier

    DEFF Research Database (Denmark)

    Poel, Mike van der; Mørk, Jesper; Hvam, Jørn Märcher

    2005-01-01

    We demonstrate changes in the propagation time of 180 femtosecond pulses in a quantum-dot semiconductor optical amplifier as function of pulse input power and bias current. The results interpreted as a result of pulse reshaping by gain saturation but are also analogous to coherent population osci...

  20. Tribal Colleges and Universities/American Indian Research and Education Initiatives Advanced Manufacturing Technical Assistance Project

    Energy Technology Data Exchange (ETDEWEB)

    Atcitty, Stanley [Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)

    2017-02-01

    The overall goal of this project is to establish a network of TCUs with essential advanced manufacturing (AM) facilities, associated training and education programs, and private sector and federal agency partnerships to both prepare an American Indian AM workforce and create economic and employment opportunities within Tribal communities through design, manufacturing, and marketing of high quality products. Some examples of high quality products involve next generation grid components such as mechanical energy storage, cabling for distribution of energy, and electrochemical energy storage enclosures. Sandia National Laboratories (Sandia) is tasked to provide technical advising, planning, and academic program development support for the TCU/American Indian Higher Education Consortium (AIHEC) Advanced Manufacturing Project. The TCUs include Bay Mills Community College (BMCC), Cankdeska Cikana Community College (CCCC), Navajo Technical University (NTU), Southwestern Indian Polytechnic Institute (SIPI), and Salish Kooteani College. AIHEC and Sandia, with collaboration from SIPI, will be establishing an 8-week summer institute on the SIPI campus during the summer of 2017. Up to 20 students from TCUs are anticipated to take part in the summer program. The goal of the program is to bring AM science, technology, engineering, and mathematics (STEM) awareness and opportunities for the American Indian students. Prior to the summer institute, Sandia will be providing reviews on curriculum plans at the each of the TCUs to ensure the content is consistent with current AM design and engineering practice. In addition, Sandia will provide technical assistance to each of the TCUs in regards to their current AM activities.

  1. Advanced manufacturing technology effectiveness: A review of literature and some issues

    Science.gov (United States)

    Goyal, Sanjeev; Grover, Sandeep

    2012-09-01

    Advanced manufacturing technology (AMT) provides advantages to manufacturing managers in terms of flexibility, quality, reduced delivery times, and global competitiveness. Although a large number of publications had presented the importance of this technology, only a few had delved into related literature review. Considering the importance of this technology and the recent contributions by various authors, the present paper conducts a more comprehensive review. Literature was reviewed in a way that will help researchers, academicians, and practitioners to take a closer look at the implementation, evaluation, and justification of the AMT. The authors reviewed various papers, proposed a different classification scheme, and identified certain gaps that will provide hints for further research in AMT management.

  2. Design and exploration of semiconductors from first principles: A review of recent advances

    Science.gov (United States)

    Oba, Fumiyasu; Kumagai, Yu

    2018-06-01

    Recent first-principles approaches to semiconductors are reviewed, with an emphasis on theoretical insight into emerging materials and in silico exploration of as-yet-unreported materials. As relevant theory and methodologies have developed, along with computer performance, it is now feasible to predict a variety of material properties ab initio at the practical level of accuracy required for detailed understanding and elaborate design of semiconductors; these material properties include (i) fundamental bulk properties such as band gaps, effective masses, dielectric constants, and optical absorption coefficients; (ii) the properties of point defects, including native defects, residual impurities, and dopants, such as donor, acceptor, and deep-trap levels, and formation energies, which determine the carrier type and density; and (iii) absolute and relative band positions, including ionization potentials and electron affinities at semiconductor surfaces, band offsets at heterointerfaces between dissimilar semiconductors, and Schottky barrier heights at metal–semiconductor interfaces, which are often discussed systematically using band alignment or lineup diagrams. These predictions from first principles have made it possible to elucidate the characteristics of semiconductors used in industry, including group III–V compounds such as GaN, GaP, and GaAs and their alloys with related Al and In compounds; amorphous oxides, represented by In–Ga–Zn–O transparent conductive oxides (TCOs), represented by In2O3, SnO2, and ZnO; and photovoltaic absorber and buffer layer materials such as CdTe and CdS among group II–VI compounds and chalcopyrite CuInSe2, CuGaSe2, and CuIn1‑ x Ga x Se2 (CIGS) alloys, in addition to the prototypical elemental semiconductors Si and Ge. Semiconductors attracting renewed or emerging interest have also been investigated, for instance, divalent tin compounds, including SnO and SnS; wurtzite-derived ternary compounds such as ZnSnN2 and Cu

  3. Semiconductor materials for solar photovoltaic cells

    CERN Document Server

    Wong-Ng, Winnie; Bhattacharya, Raghu

    2016-01-01

    This book reviews the current status of semiconductor materials for conversion of sunlight to electricity, and highlights advances in both basic science and manufacturing.  Photovoltaic (PV) solar electric technology will be a significant contributor to world energy supplies when reliable, efficient PV power products are manufactured in large volumes at low cost.  Expert chapters cover the full range of semiconductor materials for solar-to-electricity conversion, from crystalline silicon and amorphous silicon to cadmium telluride, copper indium gallium sulfide selenides, dye sensitized solar cells, organic solar cells, and environmentally friendly copper zinc tin sulfide selenides. The latest methods for synthesis and characterization of solar cell materials are described, together with techniques for measuring solar cell efficiency. Semiconductor Materials for Solar Photovoltaic Cells presents the current state of the art as well as key details about future strategies to increase the efficiency and reduce ...

  4. Advanced Manufacturing - National Information Infrastructure (AM-NII) Final Report CRADA No. TO-4013-01

    Energy Technology Data Exchange (ETDEWEB)

    Vickers, Don [Lawrence Livermore National Lab. (LLNL), Livermore, CA (United States)

    2001-03-23

    Advanced Manufacturing - National Information Infrastructure (AM-NII) was a multiyear DOE/DP program, involving multiple DOE laboratories and production facilities, focused on improving the manufacturing capabilities of the Nuclear Weapons Complex (NWC) through the application of modem information technologies. AM-NII's published mission states: "In partnership with the manufacturing business sector, AMNII will leverage DOE capabilities to develop, demonstrate, and pilot industrial information infrastructure and applications that enhance national security." LLNL's AM-NII project targeted two opportunities for improving NWC manufacturing capabilities. First was the link between the NWC and its outside suppliers of manufactured parts - web-based supply-chain integration. Second was the cross-site enterprise integration (EI) within the Complex itself. The general approach to supply-chain integration was to leverage the National Information Infrastructure (including Internet) to demonstrate the procurement of fabricated electrical and mechanical parts using a completely paperless procurement process. The general approach to NWC enterprise integration was to utilize SecureNet, a network that provides a secure, high-speed data link among the various NWC sites. If one looks at SecureNet as "the track," our goal was to get the trains running. Cross-site enterprise integration presupposes there is some level of local integration, so we worked both local and cross-site is sues simultaneously. Our EI work was in support of the LLNL Stockpile Life Extension Programs (SLEPs), the Submarine Launch Ballistic Missile Warhead Protection Program (SWPP), and the Laser Cutter Workstation installed at Y-12.

  5. A study on the performance advancement of teat algorithm for defects in semiconductor packages

    Energy Technology Data Exchange (ETDEWEB)

    Kim, Jae Yeol; Kim, Chang Hyun; Yang, Dong Jo; Ko, Myung Soo [Chosun University, Gwangju (Korea, Republic of); You, Sin [Computer Added Mechanical Engineering, Mokpo Science College, Mokpo (Korea, Republic of)

    2002-11-15

    In this study, researchers classifying the artificial flaws in semiconductor packages are performed by pattern recognition technology. For this purposes, image pattern recognition package including the user made software was developed and total procedure including ultrasonic image acquisition, equalization filtration, binary process, edge detection and classifier design is treated by Backpropagation Neural Network. Specially, it is compared with various weights of Backpropagation Neural Network and it is compared with threshold level of edge detection in preprocessing method for entrance into Multi-Layer Perceptron(Backpropagation Neural network). Also, tile pattern recognition techniques is applied to the classification problem of defects in semiconductor packages as normal, crack, delamination. According to this results, it is possible to acquire the recognition rate of 100% for Backpropagation Neural Network.

  6. Advanced Manufacturing Technologies and Strategically Flexible Production. A Review and Outlook

    DEFF Research Database (Denmark)

    Boer, Harry

    2016-01-01

    ) led to only partial results, and were often abandoned or scaled down. At the same time, a number of soft organizational and managerial approaches and improvement programs, mostly derived from Japan, began to spread in response to the dramatic changes in the competitive environment that seemed...... to require new rationales to organize and manage production systems. However, the compatibility and coherence between changing organizational paradigms and CIM approaches were not extensively explored nor understood. This paper aims to investigate the interactions between the implementation and integration...... of Advanced Manufacturing Technologies (AMT) and the adoption of new managerial and organizational principles....

  7. Advanced chemical quality control techniques for use in the manufacture of (U-Pu) MOX fuels

    International Nuclear Information System (INIS)

    Panakkal, J.P.; Prakash, Amrit

    2010-01-01

    Analytical chemistry plays a very important role for nuclear fuel cycle activities be it fuel fabrication, waste management or reprocessing. Nuclear fuels are selected based on the type of reactor. The nuclear fuel has to conform to various stringent chemical specifications like B, rare earths, H, O/M heavy metal content etc. Selection of technique is very important to determine the true specification. This is important particularly when the analyses has to be performed inside leak tight enclosure. The present paper describes the details of the advanced techniques being developed and used in the manufacture of (U,Pu) MOX fuels. (author)

  8. Advanced Shape Memory Technology to Reshape Product Design, Manufacturing and Recycling

    Directory of Open Access Journals (Sweden)

    Wen Guang Yang

    2014-08-01

    Full Text Available This paper provides a brief review on the advanced shape memory technology (ASMT with a focus on polymeric materials. In addition to introducing the concept and fundamentals of the ASMT, the potential applications of the ASMT either alone or integrated with an existing mature technique (such as, 3D printing, quick response (QR code, lenticular lens and phenomena (e.g., wrinkling and stress-enhanced swelling effect in product design, manufacturing, and recycling are demonstrated. It is concluded that the ASMT is indeed able to provide a range of powerful approaches to reshape part of the life cycle or the whole life cycle of products.

  9. Raman spectroscopy as an advanced structural nanoprobe for conjugated molecular semiconductors

    International Nuclear Information System (INIS)

    Wood, Sebastian; Hollis, Joseph Razzell; Kim, Ji-Seon

    2017-01-01

    Raman spectroscopy has emerged as a powerful and important characterisation tool for probing molecular semiconducting materials. The useful optoelectronic properties of these materials arise from the delocalised π -electron density in the conjugated core of the molecule, which also results in large Raman scattering cross-sections and a strong coupling between its electronic states and vibrational modes. For this reason, Raman spectroscopy offers a unique insight into the properties of molecular semiconductors, including: chemical structure, molecular conformation, molecular orientation, and fundamental photo- and electro-chemical processes—all of which are critically important to the performance of a wide range of optical and electronic organic semiconductor devices. Experimentally, Raman spectroscopy is non-intrusive, non-destructive, and requires no special sample preparation, and so is suitable for a wide range of in situ measurements, which are particularly relevant to issues of thermal and photochemical stability. Here we review the development of the family of Raman spectroscopic techniques, which have been applied to the study of conjugated molecular semiconductors. We consider the suitability of each technique for particular circumstances, and the unique insights it can offer, with a particular focus on the significance of these measurements for the continuing development of stable, high performance organic electronic devices. (topical review)

  10. Recent advancements in the development of radiation hard semiconductor detectors for S-LHC

    CERN Document Server

    Fretwurst, E; Al-Ajili, A A; Alfieri, G; Allport, P P; Artuso, M; Assouak, S; Avset, B S; Barabash, L; Barcz, A; Bates, R; Biagi, S F; Bilei, G M; Bisello, D; Blue, A; Blumenau, A; Boisvert, V; Bölla, G; Bondarenko, G B; Borchi, E; Borrello, L; Bortoletto, D; Boscardin, M; Bosisio, L; Bowcock, T J V; Brodbeck, T J; Broz, J; Bruzzi, M; Brzozowski, A; Buda, M; Buhmann, P; Buttar, C; Campabadal, F; Campbell, D; Candelori, A; Casse, G; Cavallini, A; Charron, S; Chilingarov, A G; Chren, D; Cindro, V; Collins, P; Coluccia, R; Contarato, D; Coutinho, J; Creanza, D; Cunningham, L; Dalla Betta, G F; Dawson, I; de Boer, Wim; De Palma, M; Demina, R; Dervan, P; Dittongo, S; Dolezal, Z; Dolgolenko, A; Eberlein, T; Eremin, V; Fall, C; Fasolo, F; Ferbel, T; Fizzotti, F; Fleta, C; Focardi, E; Forton, E; García, C; García-Navarro, J E; Gaubas, E; Genest, M H; Gill, K A; Giolo, K; Glaser, M; Gössling, C; Golovine, V; González-Sevilla, S; Gorelov,I; Goss, J; Gouldwell-Bates, A; Grégoire, G; Gregori, P; Grigoriev, E; Grillo, A A; Groza, A; Guskov, J; Haddad, L; Härkönen, J; Hauler, F; Hoeferkamp, M; Honniger, F; Horazdovsky, T; Horisberger, R P; Horn, M; Houdayer, A; Hourahine, B; Hughes, G; Ilyashenko, Yu S; Irmscher, K; Ivanov, A; Jarasiunas, K; Johansen, K M H; Jones, B K; Jones, R; Joram, C; Jungermann, L; Kalinina, E; Kaminski, P; Karpenko, A; Karpov, A; Kazlauskiene, V; Kazukauskas, V; Khivrich, V; Khomenkov, V P; Kierstead, J A; Klaiber Lodewigs, J M; Klingenberg, R; Kodys, P; Kohout, Z; Korjenevski, S; Koski, M; Kozlowski, R; Kozodaev, M; Kramberger, G; Krasel, O; Kuznetsov, A; Kwan, S; Lagomarsino, S; Lassila-Perini, K M; Lastovetsky, V F; Latino, G; Lazanu, I; Lazanu, S; Lebedev, A; Lebel, C; Leinonen, K; Leroy, C; Li, Z; Lindström, G; Linhart, V; Litovchenko, P G; Litovchenko, A P; Lo Giudice, A; Lozano, M; Luczynski, Z; Luukka, Panja; Macchiolo, A; Makarenko, L F; Mandic, I; Manfredotti, C; Manna, N; Martí i García, S; Marunko, S; Mathieson, K; Melone, J; Menichelli, D; Messineo, A; Metcalfe, J; Miglio, S; Mikuz, M; Miyamoto, J; Moll, M; Monakhov, E; Moscatelli, F; Naoumov, D; Nossarzhevska, E; Nysten, J; Olivero, P; O'Shea, V; Palviainen, T; Paolini, C; Parkes, C; Passeri, D; Pein, U; Pellegrini, G; Perera, L; Petasecca, M; Piemonte, C; Pignatel, G U; Pinho, N; Pintilie, I; Pintilie, L; Polivtsev, L; Polozov, P; Popa, A; Populea, J; Pospísil, S; Pozza, A; Radicci, V; Rafí, J M; Rando, R; Röder, R; Rohe, T; Ronchin, S; Rott, C; Roy, A; Ruzin, A; Sadrozinski, H F W; Sakalauskas, S; Scaringella, M; Schiavulli, L; Schnetzer, S; Schumm, B; Sciortino, S; Scorzoni, A; Segneri, G; Seidela, S; Seiden, A; Sellberg, G; Sellin, P J; Sentenac, D; Shipsey, I; Sícho, P; Sloan, T; Solar, M; Son, S; Sopko, B; Sopko, V; Spencer, N; Stahl, J; Stolze, D; Stone, R; Storasta, J; Strokan, N; Sudzius, M; Surma, B; Suvorov, A; Svensson, B G; Tipton, P; Tomasek, M; Tsvetkov, A; Tuominen, E; Tuovinen, E; Tuuva, T; Tylchin, M; Uebersee, H; Uher, J; Ullán, M; Vaitkus, J V; Velthuis, J; Verbitskaya, E; Vrba, V; Wagner, G; Wilhelm, I; Worm, S; Wright, V; Wunstorf, R; Yiuri, Y; Zabierowski, P; Zaluzhny, A; Zavrtanik, M; Zen, M; Zhukov, V; Zorzi, N

    2005-01-01

    The proposed luminosity upgrade of the Large Hadron Collider (S-LHC) at CERN will demand the innermost layers of the vertex detectors to sustain fluences of about 1016 hadrons/cm2. Due to the high multiplicity of tracks, the required spatial resolution and the extremely harsh radiation field new detector concepts and semiconductor materials have to be explored for a possible solution of this challenge. The CERN RD50 collaboration “Development of Radiation Hard Semiconductor Devices for Very High Luminosity Colliders” has started in 2002 an R&D program for the development of detector technologies that will fulfill the requirements of the S-LHC. Different strategies are followed by RD50 to improve the radiation tolerance. These include the development of defect engineered silicon like Czochralski, epitaxial and oxygen-enriched silicon and of other semiconductor materials like SiC and GaN as well as extensive studies of the microscopic defects responsible for the degradation of irradiated sensors. Furthe...

  11. Fiscal 1998 research achievement report. Development of key technology for high-efficiency semiconductor manufacturing process; 1998 nendo kokoritsu handotai seizo process kiban gijutsu kaihatsu seika hokokusho

    Energy Technology Data Exchange (ETDEWEB)

    NONE

    2000-05-01

    In the development of large-aperture/high-density plasma technology, research and development was carried out for balanced electron drift plasma technologies for uniform control of plasma density and the like, such as an excited plasma source and plasma drift to enable wide-range plasma generation in a chamber. In the development of high-efficiency exposure technology, studies were made for stable generation and control of short wavelength excimer laser and for higher-speed large-aperture mask writing by use of an electron beam. In the development of higher-speed processing and energy-efficient technologies, research and development was conducted involving probe card technology for increasing the speed of semiconductor inspection, software-aided virtual tester technology, local energy-efficient cleaning technology in wafer processing and transportation, sheet-type flexible manufacturing system, and the like. (NEDO)

  12. 75 FR 38129 - Freescale Semiconductor, Inc., Hardware/Software Design and Manufacturing A Including On-Site...

    Science.gov (United States)

    2010-07-01

    ... Manufacturing A, Austin, Texas. The notice was published in the Federal Register on May 28, 2010 (75 FR 30070...Logic, Inc., Austin, TX; Amended Certification Regarding Eligibility To Apply for Worker Adjustment..., Design Solutions, Inc., Veriseo, SilconElite and MicroLogic, Inc. were employed on-site at the Austin...

  13. Advanced Manufacturing for Thermal and Environmental Control Systems: Achieving National Energy Goals

    Energy Technology Data Exchange (ETDEWEB)

    Bogucz, Edward A. [Syracuse Univ., NY (United States)

    2017-02-20

    This project was part of a regional initiative in the five counties of Central New York (CNY) that received funding from the U.S. Department of Energy (DOE) and four other federal agencies through the 2012 Advanced Manufacturing Jobs and Innovation Accelerator Challenge (AMJIAC). The CNY initiative was focused on cultivating the emergent regional cluster in “Advanced Manufacturing for Thermal and Environmental Control (AM-TEC).” As one component of the CNY AM-TEC initiative, the DOE-funded project supported five research & development seed projects that strategically targeted: 1) needs and opportunities of CNY AM-TEC companies, and 2) the goal of DOE’s Advanced Manufacturing Office (AMO) to reduce energy consumption by 50% across product life-cycles over 10 years. The project also sought to fulfill the AMO mission of developing and demonstrating new, energy-efficient processing and materials technologies at a scale adequate to prove their value to manufacturers and spur investment. The five seed projects demonstrated technologies and processes that can reduce energy intensity and improve production as well as use less energy throughout their lifecycles. The project was conducted over three years in two 18-month budget periods. During the first budget period, two projects proposed in the original AMJAIC application were successfully completed: Seed Project 1 focused on saving energy in heat transfer processes via development of nano structured surfaces to significantly increase heat flux; Seed Project 2 addressed saving energy in data centers via subzero cooling of the computing processors. Also during the first budget period, a process was developed and executed to select a second round of seed projects via a competitive request for proposals from regional companies and university collaborators. Applicants were encouraged to form industry-academic partnerships to leverage experience and resources of public and private sectors in the CNY region. Proposals were

  14. Advanced manufacturing of microdisk vaccines for uniform control of material properties and immune cell function.

    Science.gov (United States)

    Zeng, Qin; Zhang, Peipei; Zeng, Xiangbin; Tostanoski, Lisa H; Jewell, Christopher M

    2017-12-19

    The continued challenges facing vaccines in infectious disease and cancer highlight a need for better control over the features of vaccines and the responses they generate. Biomaterials offer unique advantages to achieve this goal through features such as controlled release and co-delivery of antigens and adjuvants. However, many synthesis strategies lead to particles with heterogeneity in diameter, shape, loading level, or other properties. In contrast, advanced manufacturing techniques allow precision control of material properties at the micro- and nano-scale. These capabilities in vaccines and immunotherapies could allow more rational design to speed efficient design and clinical translation. Here we employed soft lithography to generate polymer microdisk vaccines with uniform structures and tunable compositions of vaccine antigens and toll like receptor agonists (TLRas) that serve as molecular adjuvants. Compared to conventional PLGA particles formed by emulsion, microdisks provided a dramatic improvement in the consistency of properties such as diameter. During culture with primary dendritic cells (DCs) from mice, microdisks were internalized by the cells without toxicity, while promoting co-delivery of antigen and TLRa to the same cell. Analysis of DC surface activation markers by flow cytometry revealed microdisk vaccines activated dendritic cells in a manner that depended on the level of TLRa, while antigen processing and presentation depended on the amount of antigen in the microdisks. Together, this work demonstrates the use of advanced manufacturing techniques to produce uniform vaccines that direct DC function depending on the composition in the disks.

  15. Reduced toxicity polyester resins and microvascular pre-preg tapes for advanced composites manufacturing

    Science.gov (United States)

    Poillucci, Richard

    Advanced composites manufacturing broadly encapsulates topics ranging from matrix chemistries to automated machines that lay-up fiber-reinforced materials. Environmental regulations are stimulating research to reduce matrix resin formulation toxicity. At present, composites fabricated with polyester resins expose workers to the risk of contact with and inhalation of styrene monomer, which is a potential carcinogen, neurotoxin, and respiratory irritant. The first primary goal of this thesis is to reduce the toxicity associated with polyester resins by: (1) identification of potential monomers to replace styrene, (2) determination of monomer solubility within the polyester, and (3) investigation of approaches to rapidly screen a large resin composition parameter space. Monomers are identified based on their ability to react with polyester and their toxicity as determined by the Globally Harmonized System (GHS) and a green screen method. Solubilities were determined by the Hoftyzer -- Van Krevelen method, Hansen solubility parameter database, and experimental mixing of monomers. A combinatorial microfluidic mixing device is designed and tested to obtain distinct resin compositions from two input chemistries. The push for safer materials is complemented by a thrust for multifunctional composites. The second primary goal of this thesis is to design and implement the manufacture of sacrificial fiber materials suitable for use in automated fiber placement of microvascaular multifunctional composites. Two key advancements are required to achieve this goal: (1) development of a roll-to-roll method to place sacrificial fibers onto carbon fiber pre-preg tape; and (2) demonstration of feasible manufacture of microvascular carbon fiber plates with automated fiber placement. An automated method for placing sacrificial fibers onto carbon fiber tapes is designed and a prototype implemented. Carbon fiber tows with manual placement of sacrificial fibers is implemented within an

  16. Dense Plasma Focus-Based Nanofabrication of III-V Semiconductors: Unique Features and Recent Advances.

    Science.gov (United States)

    Mangla, Onkar; Roy, Savita; Ostrikov, Kostya Ken

    2015-12-29

    The hot and dense plasma formed in modified dense plasma focus (DPF) device has been used worldwide for the nanofabrication of several materials. In this paper, we summarize the fabrication of III-V semiconductor nanostructures using the high fluence material ions produced by hot, dense and extremely non-equilibrium plasma generated in a modified DPF device. In addition, we present the recent results on the fabrication of porous nano-gallium arsenide (GaAs). The details of morphological, structural and optical properties of the fabricated nano-GaAs are provided. The effect of rapid thermal annealing on the above properties of porous nano-GaAs is studied. The study reveals that it is possible to tailor the size of pores with annealing temperature. The optical properties of these porous nano-GaAs also confirm the possibility to tailor the pore sizes upon annealing. Possible applications of the fabricated and subsequently annealed porous nano-GaAs in transmission-type photo-cathodes and visible optoelectronic devices are discussed. These results suggest that the modified DPF is an effective tool for nanofabrication of continuous and porous III-V semiconductor nanomaterials. Further opportunities for using the modified DPF device for the fabrication of novel nanostructures are discussed as well.

  17. Measurement of ionising radiation semiconductor detectors: a review

    International Nuclear Information System (INIS)

    Aussel, J.P.

    1986-06-01

    Manufacturing techniques for nuclear detectors using semiconductors are constantly advancing, and a large range of models with different specificities and characteristics are available. After a theoretical reminder, this report describes the main types of detectors, their working and their preferential use. A comparative table guides the neophyte reader in his choice [fr

  18. Quantifying Adoption Rates and Energy Savings Over Time for Advanced Manufacturing Technologies

    Energy Technology Data Exchange (ETDEWEB)

    Hanes, Rebecca [National Renewable Energy Laboratory (NREL), Golden, CO (United States); Carpenter Petri, Alberta C [National Renewable Energy Laboratory (NREL), Golden, CO (United States); Riddle, Matt [Argonne National Laboratory; Graziano, Diane [Argonne National Laboratory

    2017-10-09

    Energy-efficient manufacturing technologies can reduce energy consumption and lower operating costs for an individual manufacturing facility, but increased process complexity and the resulting risk of disruption means that manufacturers may be reluctant to adopt such technologies. In order to quantify potential energy savings at scales larger than a single facility, it is necessary to account for how quickly and how widely the technology will be adopted by manufacturers. This work develops a methodology for estimating energy-efficient manufacturing technology adoption rates using quantitative, objectively measurable technology characteristics, including energetic, economic and technical criteria. Twelve technology characteristics are considered, and each characteristic is assigned an importance weight that reflects its impact on the overall technology adoption rate. Technology characteristic data and importance weights are used to calculate the adoption score, a number between 0 and 1 that represents how quickly the technology is likely to be adopted. The adoption score is then used to estimate parameters for the Bass diffusion curve, which quantifies the change in the number of new technology adopters in a population over time. Finally, energy savings at the sector level are calculated over time by multiplying the number of new technology adopters at each time step with the technology's facility-level energy savings. The proposed methodology will be applied to five state-of-the-art energy-efficient technologies in the carbon fiber composites sector, with technology data obtained from the Department of Energy's 2016 bandwidth study. Because the importance weights used in estimating the Bass curve parameters are subjective, a sensitivity analysis will be performed on the weights to obtain a range of parameters for each technology. The potential energy savings for each technology and the rate at which each technology is adopted in the sector are quantified

  19. Advanced radiation detector development: Advanced semiconductor detector development: Development of a oom-temperature, gamma ray detector using gallium arsenide to develop an electrode detector

    International Nuclear Information System (INIS)

    Knoll, G.F.

    1995-11-01

    The advanced detector development project at the University of Michigan has completed the first full year of its current funding. Our general goals are the development of radiation detectors and spectrometers that are capable of portable room temperature operation. Over the past 12 months, we have worked primarily in the development of semiconductor spectrometers with open-quotes single carrierclose quotes response that offer the promise of room temperature operation and good energy resolution in gamma ray spectroscopy. We have also begun a small scale effort at investigating the properties of a small non-spectroscopic detector system with directional characteristics that will allow identification of the approximate direction in which gamma rays are incident. These activities have made use of the extensive clean room facilities at the University of Michigan for semiconductor device fabrication, and also the radiation measurement capabilities provided in our laboratory in the Phoenix Building on the North Campus. In addition to our laboratory based activities, Professor Knoll has also been a participant in several Department of Energy review activities held in the Forrestal Building and at the Germantown site. The most recent of these has been service on a DOE review panel chaired by Dr. Hap Lamonds that is reviewing the detector development programs supported through the Office of Arms Control and International Security

  20. Advanced understanding on electronic structure of molecular semiconductors and their interfaces

    Science.gov (United States)

    Akaike, Kouki

    2018-03-01

    Understanding the electronic structure of organic semiconductors and their interfaces is critical to optimizing functionalities for electronics applications, by rational chemical design and appropriate combination of device constituents. The unique electronic structure of a molecular solid is characterized as (i) anisotropic electrostatic fields that originate from molecular quadrupoles, (ii) interfacial energy-level lineup governed by simple electrostatics, and (iii) weak intermolecular interactions that make not only structural order but also energy distributions of the frontier orbitals sensitive to atmosphere and interface growth. This article shows an overview on these features with reference to the improved understanding of the orientation-dependent electronic structure, comprehensive mechanisms of molecular doping, and energy-level alignment. Furthermore, the engineering of ionization energy by the control of the electrostatic fields and work function of practical electrodes by contact-induced doping is briefly described for the purpose of highlighting how the electronic structure impacts the performance of organic devices.

  1. Implementation of activity-based costing (ABC) to drive cost reduction efforts in a semiconductor manufacturing operation

    Science.gov (United States)

    Naguib, Hussein; Bol, Igor I.; Lora, J.; Chowdhry, R.

    1994-09-01

    This paper presents a case study on the implementation of ABC to calculate the cost per wafer and to drive cost reduction efforts for a new IC product line. The cost reduction activities were conducted through the efforts of 11 cross-functional teams which included members of the finance, purchasing, technology development, process engineering, equipment engineering, production control, and facility groups. The activities of these cross functional teams were coordinated by a cost council. It will be shown that these activities have resulted in a 57% reduction in the wafer manufacturing cost of the new product line. Factors contributed to successful implementation of an ABC management system are discussed.

  2. A Novel Method for Control Performance Assessment with Fractional Order Signal Processing and Its Application to Semiconductor Manufacturing

    Directory of Open Access Journals (Sweden)

    Kai Liu

    2018-06-01

    Full Text Available The significant task for control performance assessment (CPA is to review and evaluate the performance of the control system. The control system in the semiconductor industry exhibits a complex dynamic behavior, which is hard to analyze. This paper investigates the interesting crossover properties of Hurst exponent estimations and proposes a novel method for feature extraction of the nonlinear multi-input multi-output (MIMO systems. At first, coupled data from real industry are analyzed by multifractal detrended fluctuation analysis (MFDFA and the resultant multifractal spectrum is obtained. Secondly, the crossover points with spline fit in the scale-law curve are located and then employed to segment the entire scale-law curve into several different scaling regions, in which a single Hurst exponent can be estimated. Thirdly, to further ascertain the origin of the multifractality of control signals, the generalized Hurst exponents of the original series are compared with shuffled data. At last, non-Gaussian statistical properties, multifractal properties and Hurst exponents of the process control variables are derived and compared with different sets of tuning parameters. The results have shown that CPA of the MIMO system can be better employed with the help of fractional order signal processing (FOSP.

  3. Effect of rotating shift work on childbearing and birth weight: a study of women working in a semiconductor manufacturing factory.

    Science.gov (United States)

    Lin, Yu-Cheng; Chen, Mei-Huei; Hsieh, Chia-Jung; Chen, Pau-Chung

    2011-05-01

    Stable circadian rhythm is important for both maternal and fetal health. This retrospective analysis of women in a semiconductor factory evaluated the effect of shift work exposure on childbearing and birth weight. Records of 440 female employees (initial mean age: 28.4 years) including 111 mothers who had 158 live births during the period of observation (1997-2007) were reviewed. The data analyzed included maternal age, general health condition, highest educational level, life-style and occupational factors, as well as newborn gender, birth weight, birth order and gestational age. The childbearing rates of female workers on three different work schedules (consistent daytime work (CDW), intermittent (i-) or persistent (p-) rotating shift works (RSW)) were 32.1%, 20.0% and 25.4%, respectively (P=0.047). After controlling for potential confounding factors, childbearing rates among women with CDW exceeded those of shift workers (odds ratio (OR), 1.7; 95% confidence interval (CI), 1.0-3.0). The birth weights of newborns from mothers on the three work schedules (CDW, i-RSW and p-RSW) were significantly different (3271.7±395.4, 3251.3±460.9, and 2998.5±381.2 g, respectively (Pmanufacturing factory. Work schedules should be carefully planned for female employees who are pregnant or preparing for pregnancy. Prenatal evaluations for mothers with persistent day-night rotating shift work exposures are especially necessary.

  4. Integration of a nonmetallic electrostatic precipitator and a wet scrubber for improved removal of particles and corrosive gas cleaning in semiconductor manufacturing industries.

    Science.gov (United States)

    Kim, Hak-Joon; Han, Bangwoo; Kim, Yong-Jin; Yoa, Seok-Jun; Oda, Tetsuji

    2012-08-01

    To remove particles in corrosive gases generated by semiconductor industries, we have developed a novel non-metallic, two-stage electrostatic precipitator (ESP). Carbon brush electrodes and grounded carbon fiber-reinforced polymer (CFRP) form the ionization stage, and polyvinyl chloride collection plates are used in the collection stage of the ESP The collection performance of the ESP downstream of a wet scrubber was evaluated with KC1, silica, and mist particles (0.01-10 pm), changing design and operation parameters such as the ESP length, voltage, and flow rate. A long-term and regeneration performance (12-hr) test was conducted at the maximum operation conditions of the scrubber and ESP and the performance was then demonstrated for 1 month with exhaust gases from wet scrubbers at the rooftop of a semiconductor manufacturing plant in Korea. The results showed that the electrical and collection performance of the ESP (16 channels, 400x400 mm2) was maintained with different grounded plate materials (stainless steel and CFRP) and different lengths of the ionization stage. The collection efficiency of the ESP at high air velocity was enhanced with increases in applied voltages and collection plate lengths. The ESP (16 channels with 100 mm length, 400x400 mm2x540 mm with a 10-mm gap) removed more than 90% of silica and mistparticles with 10 and 12 kV applied to the ESPat the air velocity of 2 m/s and liquid-to-gas ratio of 3.6 L/m3. Decreased performance after 13 hours ofcontinuous operation was recovered to the initial performance level by 5 min of water washing. Moreover during the 1-month operation at the demonstration site, the ESP showed average collection efficiencies of 97% based on particle number and 92% based on total particle mass, which were achieved with a much smaller specific corona power of 0.28 W/m3/hr compared with conventional ESPs.

  5. Training for my Life: Lived Experiences of Dislocated Workers in an Advanced Manufacturing Training Program

    Directory of Open Access Journals (Sweden)

    Marquita R. Walker

    2012-07-01

    Full Text Available This qualitative paper explores the lived experiences of one group of workers dislocated because of globalized trade policies who completed a hybrid Advanced Manufacturing Training Program (AMTP by taking advantage of Trade Adjustment Assistance (TAA, a federally-funded program for retraining workers dislocated because of trade policies. The research questions focus on how satisfied these workers are with the services and programs provided by TAA. Focus groups and survey instrument results indicate these workers found TAA services and processes cumbersome and time- consuming and actually had the effect of discouraging their education, training, and self- employment. The consequences of their dislocation as it relates to TAA experiences are increased frustration and dissatisfaction with the TAA program. Serious consideration for TAA policy changes should be deemed of utmost importance.

  6. Manufacturing and material properties of ultralarge size forgings for advanced BWRPV

    International Nuclear Information System (INIS)

    Suzuki, Komei; Sato, Ikuo; Tsukada, Hisashi

    1994-01-01

    Ultralarge size forgings for the advanced boiling water reactor (ABWR) pressure vessel as represented by the bottom petal made from a 600ton ingot have been developed. The bottom petal is a larger wall thickness ring with 10 integrated nozzles inside and outside the ring. The outer diameter is 7.8m, the height is 1.8m and the wall thickness if 1.1m in the as-forged condition. A very high purity level of P≤qslant0.003% and S≤qslant0.003% can be obtained by the application of double-refining processes to all the molten steel. The forging shows a homogeneous chemical distribution, sound internal qualities and adequate impact properties.This paper summarizes the manufacturing technique and material properties of large size forgings such as the bottom petal, the shell with integrated skirt and the bottom dome. ((orig.))

  7. Design, manufacture and installation of measuring and control equipments for the advanced thermal prototype reactor 'Fugen'

    International Nuclear Information System (INIS)

    Hirota, Shigeo; Kawabata, Yoshinori

    1979-01-01

    The advanced thermal prototype reactor ''Fugen'' attained the criticality on March 20, 1978, and 100% output operation on November 13, 1978. On March 20, 1979, it passed the final inspection, and since then, it has continued the smooth operation up to now. The measuring and control equipments are provided for grasping the operational conditions of the plant and operating it safely and efficiently. At the time of designing, manufacturing and installing the measuring and control equipments for Fugen, it was required to clarify the requirements of the plant design, to secure the sufficient functions, and to improve the operational process, maintainability and the reliability and accuracy of the equipments. Many design guidelines and criteria were decided in order to coordinate the conditions among five manufacturers and give the unified state as one plant. The outline of the instrumentations for neutrons, radiation monitoring and process data, the control systems for reactivity, reactor output, pressure and water supply, the safety protection system, and the process computer are described. Finally, the installations and tests of the measuring and control equipments are explained. The aseismatic capability of the equipments was confirmed. (Kako, I.)

  8. Manufacture and installation of reactor auxiliary facilities for advanced thermal prototype reactor 'Fugen'

    International Nuclear Information System (INIS)

    Kawahara, Toshio; Matsushita, Tadashi

    1977-01-01

    The facilities of reactor auxiliary systems for the advanced thermal prtotype reactor ''Fugen'' were manufactured in factories since 1972, and the installation at the site began in November, 1974. It was almost completed in March, 1977, except a part of the tests and inspections, therefore the outline of the works is reported. The ATR ''Fugen'' is a heavy water-moderated, boiling light water reactor, and its reactor auxiliary systems comprise mainly the facilities for handling heavy water, such as heavy water cooling system, heavy water cleaning system, poison supplying system, helium circulating system, helium cleaning system, and carbon dioxide system. The poison supplying system supplies liquid poison to the heavy water cooling system to absorb excess reactivity in the initial reactor core. The helium circulating system covers heavy water surface with helium to prevent the deterioration of heavy water and maintains heavy water level by pressure difference. The carbon dioxide system flows highly pure CO 2 gas in the space of pressure tubes and carandria tubes, and provides thermal shielding. The design, manufacture and installation of the facilities of reactor auxiliary systems, and the helium leak test, synthetic pressure test and total cleaning are explained. (Kako, I.)

  9. Deep UV Semiconductor Sources for Advanced Planetary Science Instruments, Phase II

    Data.gov (United States)

    National Aeronautics and Space Administration — This proposal addresses the need for miniature, narrow-linewidth, deep UV optical sources that operate at very low ambient temperatures for use in advanced in situ...

  10. Application of advanced diffraction based optical metrology overlay capabilities for high-volume manufacturing

    Science.gov (United States)

    Chen, Kai-Hsiung; Huang, Guo-Tsai; Hsieh, Hung-Chih; Ni, Wei-Feng; Chuang, S. M.; Chuang, T. K.; Ke, Chih-Ming; Huang, Jacky; Rao, Shiuan-An; Cumurcu Gysen, Aysegul; d'Alfonso, Maxime; Yueh, Jenny; Izikson, Pavel; Soco, Aileen; Wu, Jon; Nooitgedagt, Tjitte; Ottens, Jeroen; Kim, Yong Ho; Ebert, Martin

    2017-03-01

    On-product overlay requirements are becoming more challenging with every next technology node due to the continued decrease of the device dimensions and process tolerances. Therefore, current and future technology nodes require demanding metrology capabilities such as target designs that are robust towards process variations and high overlay measurement density (e.g. for higher order process corrections) to enable advanced process control solutions. The impact of advanced control solutions based on YieldStar overlay data is being presented in this paper. Multi patterning techniques are applied for critical layers and leading to additional overlay measurement demands. The use of 1D process steps results in the need of overlay measurements relative to more than one layer. Dealing with the increased number of overlay measurements while keeping the high measurement density and metrology accuracy at the same time presents a challenge for high volume manufacturing (HVM). These challenges are addressed by the capability to measure multi-layer targets with the recently introduced YieldStar metrology tool, YS350. On-product overlay results of such multi-layers and standard targets are presented including measurement stability performance.

  11. Latest advances in the manufacturing of 3D rechargeable lithium microbatteries

    Science.gov (United States)

    Ferrari, Stefania; Loveridge, Melanie; Beattie, Shane D.; Jahn, Marcus; Dashwood, Richard J.; Bhagat, Rohit

    2015-07-01

    Recent advances in micro- and nano-electromechanical systems (MEMS/NEMS) technology have led to a niche industry of diverse small-scale devices that include microsensors, micromachines and drug-delivery systems. For these devices, there is an urgent need to develop Micro Lithium Ion Batteries (MLIBs) with dimensions on the scale 1-10 mm3 enabling on-board power delivery. Unfortunately, power limitations are inherent in planar 2D cells and only the advent of 3D designs and microarchitectures will lead to a real breakthrough in the microbattery technology. During the last few years, many efforts to optimise MLIBs were discussed in literature, both in the planar and 3D configurations. This review highlights the importance of 3D microarchitectured electrodes to fabricate batteries that can be device-integrated with exceptionally high specific power density coupled with exquisite miniaturisation. A wide literature overview is provided and recent advances in manufacturing routes to 3D-MLIBs comprising materials synthesis, device formulation, device testing are herein discussed. The advent of simple, economic and easily scalable fabrication processes such as 3D printing will have a decisive role in the growing field of micropower sources and microdevices.

  12. A review of recent advances in the spherical harmonics expansion method for semiconductor device simulation.

    Science.gov (United States)

    Rupp, K; Jungemann, C; Hong, S-M; Bina, M; Grasser, T; Jüngel, A

    The Boltzmann transport equation is commonly considered to be the best semi-classical description of carrier transport in semiconductors, providing precise information about the distribution of carriers with respect to time (one dimension), location (three dimensions), and momentum (three dimensions). However, numerical solutions for the seven-dimensional carrier distribution functions are very demanding. The most common solution approach is the stochastic Monte Carlo method, because the gigabytes of memory requirements of deterministic direct solution approaches has not been available until recently. As a remedy, the higher accuracy provided by solutions of the Boltzmann transport equation is often exchanged for lower computational expense by using simpler models based on macroscopic quantities such as carrier density and mean carrier velocity. Recent developments for the deterministic spherical harmonics expansion method have reduced the computational cost for solving the Boltzmann transport equation, enabling the computation of carrier distribution functions even for spatially three-dimensional device simulations within minutes to hours. We summarize recent progress for the spherical harmonics expansion method and show that small currents, reasonable execution times, and rare events such as low-frequency noise, which are all hard or even impossible to simulate with the established Monte Carlo method, can be handled in a straight-forward manner. The applicability of the method for important practical applications is demonstrated for noise simulation, small-signal analysis, hot-carrier degradation, and avalanche breakdown.

  13. Lightweighting Automotive Materials for Increased Fuel Efficiency and Delivering Advanced Modeling and Simulation Capabilities to U.S. Manufacturers

    Energy Technology Data Exchange (ETDEWEB)

    Hale, Steve

    2013-09-11

    Abstract The National Center for Manufacturing Sciences (NCMS) worked with the U.S. Department of Energy (DOE), National Energy Technology Laboratory (NETL), to bring together research and development (R&D) collaborations to develop and accelerate the knowledgebase and infrastructure for lightweighting materials and manufacturing processes for their use in structural and applications in the automotive sector. The purpose/importance of this DOE program: • 2016 CAFÉ standards. • Automotive industry technology that shall adopt the insertion of lightweighting material concepts towards manufacturing of production vehicles. • Development and manufacture of advanced research tools for modeling and simulation (M&S) applications to reduce manufacturing and material costs. • U.S. competitiveness that will help drive the development and manufacture of the next generation of materials. NCMS established a focused portfolio of applied R&D projects utilizing lightweighting materials for manufacture into automotive structures and components. Areas that were targeted in this program: • Functionality of new lightweighting materials to meet present safety requirements. • Manufacturability using new lightweighting materials. • Cost reduction for the development and use of new lightweighting materials. The automotive industry’s future continuously evolves through innovation, and lightweight materials are key in achieving a new era of lighter, more efficient vehicles. Lightweight materials are among the technical advances needed to achieve fuel/energy efficiency and reduce carbon dioxide (CO2) emissions: • Establish design criteria methodology to identify the best materials for lightweighting. • Employ state-of-the-art design tools for optimum material development for their specific applications. • Match new manufacturing technology to production volume. • Address new process variability with new production-ready processes.

  14. Effects of work-related factors on the breastfeeding behavior of working mothers in a Taiwanese semiconductor manufacturer: a cross-sectional survey.

    Science.gov (United States)

    Chen, Yi Chun; Wu, Ya-Chi; Chie, Wei-Chu

    2006-06-21

    In recent years, the creation of supportive environments for encouraging mothers to breastfeed their children has emerged as a key health issue for women and children. The provision of lactation rooms and breast pumping breaks have helped mothers to continue breastfeeding after returning to work, but their effectiveness is uncertain. The aim of this study was to assess the effects of worksite breastfeeding-friendly policies and work-related factors on the behaviour of working mothers. This study was conducted at a large Taiwanese semiconductor manufacturer in August-September 2003. Questionnaires were used to collect data on female employees' breastfeeding behaviour, child rearing and work status when raising their most recently born child. A total of 998 valid questionnaires were collected, giving a response rate of 75.3%. The results showed that 66.9% of survey respondents breastfed initially during their maternity leave, which averaged 56 days. Despite the provision of lactation rooms and breast pumping breaks, only 10.6% mothers continued to breastfeed after returning to work, primarily office workers and those who were aware of their company's breastfeeding-friendly policies. In conclusion, breastfeeding-friendly policies can significantly affect breastfeeding behaviour. However, an unfavourable working environment, especially for fab workers, can make it difficult to implement breastfeeding measures. With health professionals emphasizing that the importance of breastfeeding for infant health, and as only females can perform lactation, it is vital that women's work "productive role" and family "reproductive role" be respected and accommodated by society.

  15. Advanced surface chemical analysis of continuously manufactured drug loaded composite pellets.

    Science.gov (United States)

    Hossain, Akter; Nandi, Uttom; Fule, Ritesh; Nokhodchi, Ali; Maniruzzaman, Mohammed

    2017-04-15

    The aim of the present study was to develop and characterise polymeric composite pellets by means of continuous melt extrusion techniques. Powder blends of a steroid hormone (SH) as a model drug and either ethyl cellulose (EC N10 and EC P7 grades) or hydroxypropyl methylcellulose (HPMC AS grade) as polymeric carrier were extruded using a Pharma 11mm twin screw extruder in a continuous mode of operation to manufacture extruded composite pellets of 1mm length. Molecular modelling study using commercial Gaussian 09 software outlined a possible drug-polymer interaction in the molecular level to develop solid dispersions of the drug in the pellets. Solid-state analysis conducted via a differential scanning calorimetry (DSC), hot stage microscopy (HSM) and X-ray powder diffraction (XRPD) analyses revealed the amorphous state of the drug in the polymer matrices. Surface analysis using SEM/energy dispersive X-ray (EDX) of the produced pellets arguably showed a homogenous distribution of the C and O atoms in the pellet matrices. Moreover, advanced chemical surface analysis conducted via atomic force microscopy (AFM) showed a homogenous phase system having the drug molecule dispersed onto the amorphous matrices while Raman mapping confirmed the homogenous single-phase drug distribution in the manufactured composite pellets. Such composite pellets are expected to deliver multidisciplinary applications in drug delivery and medical sciences by e.g. modifying drug solubility/dissolutions or stabilizing the unstable drug (e.g. hormone, protein) in the composite network. Copyright © 2016. Published by Elsevier Inc.

  16. ROBOTICALLY ENHANCED ADVANCED MANUFACTURING CONCEPTS TO OPTIMIZE ENERGY, PRODUCTIVITY, AND ENVIRONMENTAL PERFORMANCE

    Energy Technology Data Exchange (ETDEWEB)

    Larry L. Keller; Joseph M. Pack; Robert V. Kolarik II

    2007-11-05

    In the first phase of the REML project, major assets were acquired for a manufacturing line for follow-on installation, capability studies and optimization. That activity has been documented in the DE-FC36-99ID13819 final report. In this the second phase of the REML project, most of the major assets have been installed in a manufacturing line arrangement featuring a green cell, a thermal treatment cell and a finishing cell. Most of the secondary and support assets have been acquired and installed. Assets have been integrated with a commercial, machine-tending gantry robot in the thermal treatment cell and with a low-mass, high-speed gantry robot in the finish cell. Capabilities for masterless gauging of product’s dimensional and form characteristics were advanced. Trial production runs across the entire REML line have been undertaken. Discrete event simulation modeling has aided in line balancing and reduction of flow time. Energy, productivity and cost, and environmental comparisons to baselines have been made. Energy The REML line in its current state of development has been measured to be about 22% (338,000 kVA-hrs) less energy intensive than the baseline conventional low volume line assuming equivalent annual production volume of approximately 51,000 races. The reduction in energy consumption is largely attributable to the energy reduction in the REML thermal treatment cell where the heating devices are energized on demand and are appropriately sized to the heating load of a near single piece flow line. If additional steps such as power factor correction and use of high-efficiency motors were implemented to further reduce energy consumption, it is estimated, but not yet demonstrated, that the REML line would be about 30% less energy intensive than the baseline conventional low volume line assuming equivalent annual production volume. Productivity The capital cost of an REML line would be roughly equivalent to the capital cost of a new conventional line. The

  17. Development of advanced manufacturing technologies for low cost hydrogen storage vessels

    Energy Technology Data Exchange (ETDEWEB)

    Leavitt, Mark [Quantum Fuel Systems Technologies Worldwide, Inc., Irvine, CA (United States); Lam, Patrick [Boeing Research and Technology (BR& T), Seattle, WA (United States)

    2014-12-29

    The U.S. Department of Energy (DOE) defined a need for low-cost gaseous hydrogen storage vessels at 700 bar to support cost goals aimed at 500,000 units per year. Existing filament winding processes produce a pressure vessel that is structurally inefficient, requiring more carbon fiber for manufacturing reasons, than would otherwise be necessary. Carbon fiber is the greatest cost driver in building a hydrogen pressure vessel. The objective of this project is to develop new methods for manufacturing Type IV pressure vessels for hydrogen storage with the purpose of lowering the overall product cost through an innovative hybrid process of optimizing composite usage by combining traditional filament winding (FW) and advanced fiber placement (AFP) techniques. A numbers of vessels were manufactured in this project. The latest vessel design passed all the critical tests on the hybrid design per European Commission (EC) 79-2009 standard except the extreme temperature cycle test. The tests passed include burst test, cycle test, accelerated stress rupture test and drop test. It was discovered the location where AFP and FW overlap for load transfer could be weakened during hydraulic cycling at 85°C. To design a vessel that passed these tests, the in-house modeling software was updated to add capability to start and stop fiber layers to simulate the AFP process. The original in-house software was developed for filament winding only. Alternative fiber was also investigated in this project, but the added mass impacted the vessel cost negatively due to the lower performance from the alternative fiber. Overall the project was a success to show the hybrid design is a viable solution to reduce fiber usage, thus driving down the cost of fuel storage vessels. Based on DOE’s baseline vessel size of 147.3L and 91kg, the 129L vessel (scaled to DOE baseline) in this project shows a 32% composite savings and 20% cost savings when comparing Vessel 15 hybrid design and the Quantum

  18. Advances in compact manufacturing for shape and performance controllability of large-scale components-a review

    Science.gov (United States)

    Qin, Fangcheng; Li, Yongtang; Qi, Huiping; Ju, Li

    2017-01-01

    Research on compact manufacturing technology for shape and performance controllability of metallic components can realize the simplification and high-reliability of manufacturing process on the premise of satisfying the requirement of macro/micro-structure. It is not only the key paths in improving performance, saving material and energy, and green manufacturing of components used in major equipments, but also the challenging subjects in frontiers of advanced plastic forming. To provide a novel horizon for the manufacturing in the critical components is significant. Focused on the high-performance large-scale components such as bearing rings, flanges, railway wheels, thick-walled pipes, etc, the conventional processes and their developing situations are summarized. The existing problems including multi-pass heating, wasting material and energy, high cost and high-emission are discussed, and the present study unable to meet the manufacturing in high-quality components is also pointed out. Thus, the new techniques related to casting-rolling compound precise forming of rings, compact manufacturing for duplex-metal composite rings, compact manufacturing for railway wheels, and casting-extruding continuous forming of thick-walled pipes are introduced in detail, respectively. The corresponding research contents, such as casting ring blank, hot ring rolling, near solid-state pressure forming, hot extruding, are elaborated. Some findings in through-thickness microstructure evolution and mechanical properties are also presented. The components produced by the new techniques are mainly characterized by fine and homogeneous grains. Moreover, the possible directions for further development of those techniques are suggested. Finally, the key scientific problems are first proposed. All of these results and conclusions have reference value and guiding significance for the integrated control of shape and performance in advanced compact manufacturing.

  19. Effects of work-related factors on the breastfeeding behavior of working mothers in a Taiwanese semiconductor manufacturer: a cross-sectional survey

    Directory of Open Access Journals (Sweden)

    Chie Wei-Chu

    2006-06-01

    Full Text Available Abstract Background In recent years, the creation of supportive environments for encouraging mothers to breastfeed their children has emerged as a key health issue for women and children. The provision of lactation rooms and breast pumping breaks have helped mothers to continue breastfeeding after returning to work, but their effectiveness is uncertain. The aim of this study was to assess the effects of worksite breastfeeding-friendly policies and work-related factors on the behaviour of working mothers. Methods This study was conducted at a large Taiwanese semiconductor manufacturer in August-September 2003. Questionnaires were used to collect data on female employees' breastfeeding behaviour, child rearing and work status when raising their most recently born child. A total of 998 valid questionnaires were collected, giving a response rate of 75.3%. Results The results showed that 66.9% of survey respondents breastfed initially during their maternity leave, which averaged 56 days. Despite the provision of lactation rooms and breast pumping breaks, only 10.6% mothers continued to breastfeed after returning to work, primarily office workers and those who were aware of their company's breastfeeding-friendly policies. Conclusion In conclusion, breastfeeding-friendly policies can significantly affect breastfeeding behaviour. However, an unfavourable working environment, especially for fab workers, can make it difficult to implement breastfeeding measures. With health professionals emphasizing that the importance of breastfeeding for infant health, and as only females can perform lactation, it is vital that women's work "productive role" and family "reproductive role" be respected and accommodated by society.

  20. V1.6 Development of Advanced Manufacturing Technologies for Low Cost Hydrogen Storage Vessels

    Energy Technology Data Exchange (ETDEWEB)

    Leavitt, Mark; Lam, Patrick; Nelson, Karl M.; johnson, Brice A.; Johnson, Kenneth I.; Alvine, Kyle J.; Ruiz, Antonio; Adams, Jesse

    2012-10-01

    The goal of this project is to develop an innovative manufacturing process for Type IV high-pressure hydrogen storage vessels, with the intent to significantly lower manufacturing costs. Part of the development is to integrate the features of high precision AFP and commercial FW. Evaluation of an alternative fiber to replace a portion of the baseline fiber will help to reduce costs further.

  1. Advanced Process Chains for Prototyping and Pilot Production based on Additive Manufacturing

    DEFF Research Database (Denmark)

    Mischkot, Michael

    2015-01-01

    For many years, Additive Manufacturing (AM) has been a well-established production technology used mainly for rapid prototyping. But the need for increased flexibility and economic low volume production led to the discovery of Additive Manufacturing as a suitable fabrication technique (Mellor 2013...

  2. Final Report - Advanced MEA's for Enhanced Operating Conditions, Amenable to High Volume Manufacture

    Energy Technology Data Exchange (ETDEWEB)

    Debe, Mark K.

    2007-09-30

    This report summarizes the work completed under a 3M/DOE contract directed at advancing the key fuel cell (FC) components most critical for overcoming the polymer electrolyte membrane fuel cell (PEMFC) performance, durability & cost barriers. This contract focused on the development of advanced ion exchange membranes & electrocatalysts for PEMFCs that will enable operation under ever more demanding automotive operating conditions & the use high volume compatible processes for their manufacture. Higher performing & more durable electrocatalysts must be developed for PEMFCs to meet the power density & lifetime hours required for FC vehicles. At the same time the amount of expensive Pt catalyst must be reduced to lower the MEA costs. While these two properties are met, the catalyst must be made resistant to multiple degradation mechanisms to reach necessary operating lifetimes. In this report, we present the work focused on the development of a completely new approach to PEMFC electrocatalyts, called nanostructured thin film (NSTF) catalysts. The carbon black supports are eliminated with this new approach which eliminates the carbon corrosion issue. The thin film nature of the catalyst significantly improves its robustness against dissolution & grain growth, preserving the surface area. Also, the activity of the NSTF for oxygen reduction is improved by over 500% compared to dispersed Pt catalyts. Finally, the process for fabricating the NSTF catalysts is consistent with high volume roll-good manufacturing & extremely flexible towards the introduction of new catalyst compositions & structures. This report documents the work done to develop new multi-element NSTF catalysts with properties that exceed pure Pt, that are optimized for use with the membranes discussed below, & advance the state-of-the-art towards meeting the DOE 2010 targets for PEMFC electrocatalysts. The work completed advances the understanding of the NSTF catalyst technology, identifies new NSTF

  3. Semiconductor Physical Electronics

    CERN Document Server

    Li, Sheng

    2006-01-01

    Semiconductor Physical Electronics, Second Edition, provides comprehensive coverage of fundamental semiconductor physics that is essential to an understanding of the physical and operational principles of a wide variety of semiconductor electronic and optoelectronic devices. This text presents a unified and balanced treatment of the physics, characterization, and applications of semiconductor materials and devices for physicists and material scientists who need further exposure to semiconductor and photonic devices, and for device engineers who need additional background on the underlying physical principles. This updated and revised second edition reflects advances in semicondutor technologies over the past decade, including many new semiconductor devices that have emerged and entered into the marketplace. It is suitable for graduate students in electrical engineering, materials science, physics, and chemical engineering, and as a general reference for processing and device engineers working in the semicondi...

  4. EXPORT CONTROLS: Rapid Advances in China's Semiconductor Industry Underscore Need for Fundamental U.S. Policy Review

    National Research Council Canada - National Science Library

    2002-01-01

    The United States controls the export of certain technology, including some of the equipment and materials used to make semiconductors, to sensitive destinations such as China for national security...

  5. Semiconductor Quantum Dots for Applications to Advanced Concepts for Solar Photon Conversion to Electricity and Solar Fuels

    Energy Technology Data Exchange (ETDEWEB)

    Nozik, Arthur J [National Renewable Energy Laboratory (NREL), Golden, CO (United States); Beard, Matthew C [National Renewable Energy Laboratory (NREL), Golden, CO (United States)

    2017-11-06

    The challenge of photoconversion research is to produce photovoltaic electricity at costs much less than those based on fossil fuels. Novel photoactive semiconductors and molecules of various types and structures are discussed for this purpose.

  6. Assimilation Patterns in the Use of Advanced Manufacturing Technologies in SMEs: Exploring their Effects on Product Innovation Performance

    Directory of Open Access Journals (Sweden)

    Sylvestre Uwizeyemungu

    2015-10-01

    Full Text Available Manufacturing small and medium-sized enterprises (SMEs are more and more adopting advanced manufacturing technologies (AMT aimed at fostering product innovation process, improving product quality, streamlining the production process, and gaining productivity. In this study, we analyze the relationship between AMT proficiency levels in manufacturing SMEs and product innovation performance. Using data from 616 manufacturing SMEs, and considering a wide range of various AMT (20 different types of AMT grouped into 5 categories, we derived three AMT assimilation patterns through a cluster analysis procedure combining hierarchical and non-hierarchical clustering algorithms. The analysis of the relationship between AMT assimilation patterns and product innovation performance shows a rather unexpected picture: in spite of the existence of clearly distinct patterns of AMT assimilation, we find no significant relationship between any pattern and product innovation performance. Instead, we find the organizational and environmental context of SMEs to be more determinant for product innovation performance than any of the AMT assimilation patterns. From a practical point of view, this study indicates that manufacturing SMEs managers interested in fostering their innovation capabilities through AMT assimilation need to be aware of the contingency effects of their organizational size, age, and sector of activity.

  7. Efficacy of using multiple open-path Fourier transform infrared (OP-FTIR) spectrometers in an odor emission episode investigation at a semiconductor manufacturing plant

    International Nuclear Information System (INIS)

    Tsao, Yung-Chieh; Wu, Chang-Fu; Chang, Pao-Erh; Chen, Shin-Yu; Hwang, Yaw-Huei

    2011-01-01

    This study evaluated the efficacy of simultaneously employing three open-path Fourier transform infrared (OP-FTIR) spectrometers with 3-day consecutive monitoring, using an odor episode as an example. The corresponding monitoring paths were allocated among the possible emission sources of a semiconductor manufacturing plant and the surrounding optoelectronic and electronic-related factories, which were located in a high-tech industrial park. There was a combined total odor rate of 43.9% for the three monitoring paths, each comprised of 736 continuous 5-minute monitoring records and containing detectable odor compounds, such as ammonia, ozone, butyl acetate, and propylene glycol monomethyl ether acetate (PGMEA). The results of the logistic regression model indicated that the prevailing south wind and the OP-FTIR monitoring path closest to the emission source in down-wind direction resulted in a high efficacy for detecting odorous samples with odds ratios (OR) of 3.8 (95% confidence interval (CI): 2.9-5.0) and 5.1 (95% CI: 3.6-7.2), respectively. Meanwhile, the odds ratio for detecting ammonia odorous samples was 7.5 for Path II, which was downwind closer to the possible source, as compared to Path III, downwind far away from the possible source. PGMEA could not be monitored at Path II but could be at Path III, indicating the importance of the monitoring path and flow ejection velocities inside the stacks on the monitoring performance of OP-FTIR. Besides, an odds ratio of 5.1 for odorous sample detection was obtained with south prevailing wind comprising 65.0% of the monitoring time period. In general, it is concluded that OP-FTIR operated with multiple paths simultaneously shall be considered for investigation on relatively complicated episodes such as emergency of chemical release, multiple-source emission and chemical monitoring for odor in a densely populated plant area to enhance the efficacy of OP-FTIR monitoring. - Research highlights: → To conduct multi

  8. Efficacy of using multiple open-path Fourier transform infrared (OP-FTIR) spectrometers in an odor emission episode investigation at a semiconductor manufacturing plant

    Energy Technology Data Exchange (ETDEWEB)

    Tsao, Yung-Chieh; Wu, Chang-Fu [Institute of Occupational Medicine and Industrial Hygiene, National Taiwan University College of Public Health, Taipei City 100, Taiwan (China); Chang, Pao-Erh; Chen, Shin-Yu [Green Energy and Environment Research Laboratories, Industrial Technology Research Institute, Hsinchu City 310, Taiwan 310 (China); Hwang, Yaw-Huei, E-mail: yhhwang@ntu.edu.tw [Institute of Occupational Medicine and Industrial Hygiene, National Taiwan University College of Public Health, Taipei City 100, Taiwan (China); Department of Public Health, College of Public Health, National Taiwan University, Taipei City 100, Taiwan (China)

    2011-08-01

    This study evaluated the efficacy of simultaneously employing three open-path Fourier transform infrared (OP-FTIR) spectrometers with 3-day consecutive monitoring, using an odor episode as an example. The corresponding monitoring paths were allocated among the possible emission sources of a semiconductor manufacturing plant and the surrounding optoelectronic and electronic-related factories, which were located in a high-tech industrial park. There was a combined total odor rate of 43.9% for the three monitoring paths, each comprised of 736 continuous 5-minute monitoring records and containing detectable odor compounds, such as ammonia, ozone, butyl acetate, and propylene glycol monomethyl ether acetate (PGMEA). The results of the logistic regression model indicated that the prevailing south wind and the OP-FTIR monitoring path closest to the emission source in down-wind direction resulted in a high efficacy for detecting odorous samples with odds ratios (OR) of 3.8 (95% confidence interval (CI): 2.9-5.0) and 5.1 (95% CI: 3.6-7.2), respectively. Meanwhile, the odds ratio for detecting ammonia odorous samples was 7.5 for Path II, which was downwind closer to the possible source, as compared to Path III, downwind far away from the possible source. PGMEA could not be monitored at Path II but could be at Path III, indicating the importance of the monitoring path and flow ejection velocities inside the stacks on the monitoring performance of OP-FTIR. Besides, an odds ratio of 5.1 for odorous sample detection was obtained with south prevailing wind comprising 65.0% of the monitoring time period. In general, it is concluded that OP-FTIR operated with multiple paths simultaneously shall be considered for investigation on relatively complicated episodes such as emergency of chemical release, multiple-source emission and chemical monitoring for odor in a densely populated plant area to enhance the efficacy of OP-FTIR monitoring. - Research highlights: {yields} To conduct

  9. The industrial resurgence of Southern California? Advanced ground transportation equipment manufacturing and local economic develoment

    OpenAIRE

    A J Scott; D Bergman

    1995-01-01

    Southern California is in a deeply rooted process of economic restructuring. Much of the region's manufacturing base is made up of two groups of industries: a declining aerospace - defense sector, and a low-wage, low-skill sweatshop sector. What are the prospects for creating a growing manufacturing base focused on high-wage, high-skill industries? In this paper we examine the opportunities presented by the Los Angeles County Metropolitan Transportation Authority's S183 billion thirty-year ca...

  10. Nuclear engineering training and advanced training at universities and in manufacturing industries

    International Nuclear Information System (INIS)

    Sauer, A.

    1984-01-01

    The lecture describes: the qualification of the staff of one nuclear power plant building company, the structure of university studies in the Federal Republic of Germany, in the USA and in the GDR, technical colleges, continuation studies, in-service training in the manufacturing industry, training programmes for short-term benefits, training of German and foreign operating personnel by the manufacturers, training within the framework of technology transfer. (HSCH) [de

  11. Field Evaluation of Advances in Energy-Efficiency Practices for Manufactured Homes

    Energy Technology Data Exchange (ETDEWEB)

    Levy, E. [Advanced Residential Integrated Energy Solutions (ARIES) Collaborative, New York, NY (United States); Dentz, J. [Advanced Residential Integrated Energy Solutions (ARIES) Collaborative, New York, NY (United States); Ansanelli, E. [Advanced Residential Integrated Energy Solutions (ARIES) Collaborative, New York, NY (United States); Barker, G. [Advanced Residential Integrated Energy Solutions (ARIES) Collaborative, New York, NY (United States); Rath, P. [Advanced Residential Integrated Energy Solutions (ARIES) Collaborative, New York, NY (United States); Dadia, D. [Advanced Residential Integrated Energy Solutions (ARIES) Collaborative, New York, NY (United States)

    2016-03-01

    Through field-testing and analysis, this project evaluated whole-building approaches and estimated the relative contributions of select technologies toward reducing energy use related to space conditioning in new manufactured homes. Three lab houses of varying designs were built and tested side-by-side under controlled conditions in Russellville, Alabama. The tests provided a valuable indicator of how changes in the construction of manufactured homes can contribute to significant reductions in energy use.

  12. Micro-manufacturing: design and manufacturing of micro-products

    National Research Council Canada - National Science Library

    Koç, Muammer; Özel, Tuğrul

    2011-01-01

    .... After addressing the fundamentals and non-metallic-based micro-manufacturing processes in the semiconductor industry, it goes on to address specific metallic-based micro-manufacturing processes...

  13. Recent advance on design and manufacturing of composite anisogrid structures for space launchers

    Science.gov (United States)

    Totaro, G.; De Nicola, F.

    2012-12-01

    Anisogrid composite shells have been developed and applied since the eighties by the Russian technology aiming at critical weight structures for space launchers, as interstages and cone adapters. The manufacturing process commonly applied is based on the wet filament winding. The paper concerns with some developments of design and manufacturing recently performed at the Italian Aerospace Research Center on a cylindrical structural model representative of this kind of structures. The framework of preliminary design is improved by introducing the concept of suboptimal configuration in order to match the stiffness requirement of the shell and minimise the mass, in conjunction with the typical strength constraints. The undertaken manufacturing process is based on dry robotic winding for the lattice structure and for the outer skin, with the aid of usual rubber tooling and new devices for the automated deposition strategy. Resin infusion under vacuum bag and co-cure of the system of ribs and skin is finally applied out-of-autoclave, with the aid of a heated mandrel. With such approach an interstage structural model (scale factor 1:1.5) has been designed, manufactured and tested. Design requirements and loads refer to a typical space launcher whose baseline configuration is made in aluminium. The global mechanical test of the manufactured structure has confirmed the expected high structural performance. The possibility to reach substantial weight savings in comparison with the aluminium benchmark has been fully demonstrated.

  14. Roll-to-Roll Advanced Materials Manufacturing DOE Lab Consortium - FY16 Annual Report

    Energy Technology Data Exchange (ETDEWEB)

    Daniel, Claus [Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States); Wood, III, David L. [Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States); Krumdick, Gregory [Argonne National Lab. (ANL), Argonne, IL (United States); Ulsh, Michael [National Renewable Energy Lab. (NREL), Golden, CO (United States); Srinivasan, Venkat [Lawrence Berkeley National Lab. (LBNL), Berkeley, CA (United States)

    2016-12-01

    A DOE laboratory consortium comprised of ORNL, ANL, NREL and LBNL, coordinating with Kodak’s Eastman Business Park (Kodak) and other selected industry partners, was formed to address enhancing battery electrode performance and R2R manufacturing challenges. The objective of the FY 2016 seed project was to develop a materials genome synthesis process amenable to R2R manufacturing and to provide modeling, simulation, processing, and manufacturing techniques that demonstrate the feasibility of process controls and scale-up potential for improved battery electrodes. The research efforts were to predict and measure changes and results in electrode morphology and performance based on process condition changes; to evaluate mixed, active, particle size deposition and drying for novel electrode materials; and to model various process condition changes and the resulting morphology and electrode performance.

  15. MODULAR RESEARCH EQUIPMENT FOR ON-LINE INSPECTION IN ADVANCED MANUFACTURING SYSTEMS

    Directory of Open Access Journals (Sweden)

    Davrajh, S.

    2012-11-01

    Full Text Available The significance of inspection processes increases when producing parts with high levels of customer input. These processes must adapt to variations in significant product characteristics. Mass customisation and reconfigurable manufacturing are currently being researched as ways to respond to high levels of customer input. This paper presents the research and development of modular inspection equipment that was designed to meet the on-line quality requirements of mass customisation and reconfigurable manufacturing environments. Simulated results were analysed for application in an industrial environment. The implementation of the equipment in South Africa is briefly discussed. The research indicates that manufacturers need only invest in the required equipment configurations when they are needed for on-line inspection.

  16. The impact on advanced economies of north-south trade in manufacturing and services

    Directory of Open Access Journals (Sweden)

    Robert Rowthorn

    2005-04-01

    Full Text Available Many types of production are being transferred from the rich economies of the North to the poorer economies of the South. Such changes began in manufacturing but are now spreading to services. This paper provides estimates of their past and future impact on employment in the North. About 5 million manufacturing jobs have been lost over the past decade because of trade with low-wage economies. A similar number of service jobs may be lost to low-wage economies over the next decade. Although small compared to total employment, such losses may seriously harm certain localities or types of worker.

  17. Advanced composites structural concepts and materials technologies for primary aircraft structures: Design/manufacturing concept assessment

    Science.gov (United States)

    Chu, Robert L.; Bayha, Tom D.; Davis, HU; Ingram, J. ED; Shukla, Jay G.

    1992-01-01

    Composite Wing and Fuselage Structural Design/Manufacturing Concepts have been developed and evaluated. Trade studies were performed to determine how well the concepts satisfy the program goals of 25 percent cost savings, 40 percent weight savings with aircraft resizing, and 50 percent part count reduction as compared to the aluminum Lockheed L-1011 baseline. The concepts developed using emerging technologies such as large scale resin transfer molding (RTM), automatic tow placed (ATP), braiding, out-of-autoclave and automated manufacturing processes for both thermoset and thermoplastic materials were evaluated for possible application in the design concepts. Trade studies were used to determine which concepts carry into the detailed design development subtask.

  18. Development of STEP-NC Adaptor for Advanced Web Manufacturing System

    Science.gov (United States)

    Ajay Konapala, Mr.; Koona, Ramji, Dr.

    2017-08-01

    Information systems play a key role in the modern era of Information Technology. Rapid developments in IT & global competition calls for many changes in basic CAD/CAM/CAPP/CNC manufacturing chain of operations. ‘STEP-NC’ an enhancement to STEP for operating CNC machines, creating new opportunities for collaborative, concurrent, adaptive works across the manufacturing chain of operations. Schemas and data models defined by ISO14649 in liaison with ISO10303 standards made STEP-NC file rich with feature based, rather than mere point to point information of G/M Code format. But one needs to have a suitable information system to understand and modify these files. Various STEP-NC information systems are reviewed to understand the suitability of STEP-NC for web manufacturing. Present work also deals with the development of an adaptor which imports STEP-NC file, organizes its information, allowing modifications to entity values and finally generates a new STEP-NC file to export. The system is designed and developed to work on web to avail additional benefits through the web and also to be part of a proposed ‘Web based STEP-NC manufacturing platform’ which is under development and explained as future scope.

  19. FY1995 ultra-high performance semiconductor lasers for advanced optical information network; 1995 nendo kodo hikari joho tsushinmo e muketa kyokugen seino handotai laser

    Energy Technology Data Exchange (ETDEWEB)

    NONE

    1997-03-01

    The purpose of this research was to study and develop ultra-high performance semiconductor light source devices that should facilitate construction of advanced optical information networks. The semiconductor devices mentioned above are enhanced and integrated versions of distributed feedback (DFB) lasers based on 'gain coupling', which the group of the research coordinator has been investigating as a pioneer in the world. This research aimed at development of ultra-high performance semiconductor lasers that surpass the first generation conventional DFB lasers in any respect, by strengthening important device characteristics for system applications of the gain-coupled DFB lasers. The achievements of this research are listed below : 1. In-situ characterization of As-P exchange in MOVPE 2. Development of 1.55 {mu}m gain-coupled DFB lasers of absorptive grating type 3. Establishment of measurement technique for gain-coupling coefficients 4. Enlargement of small signal modulation response by the absorptive grating 5. Prediction of lower analog modulation distortion 6. Characterization of reflection-induced noise 7. Proposal and Demonstration of wavelength trimming 8. Proposal and Fabrication of GC DFB laser triode (NEDO)

  20. Advances in the manufacture of clad tubes and components for PHWR fuel bundle

    International Nuclear Information System (INIS)

    Saibaba, N.; Jha, S.K.; Chandrasekha, B.; Tonpe, S.; Jayaraj, R.N.

    2010-01-01

    Fuel bundles for Pressurized Heavy Water Reactors (PHWRs) consists of Uranium di-oxide pellets encapsulated into thin wall Zircaloy clad tubes. Other components such as end caps, bearing pads and spacer pads are the integral elements of the fuel bundle. As the fuel assembly is subjected to severe operating conditions of high temperature and pressure in addition to continual irradiation exposure, all the components are manufactured conforming to stringent specifications with respect to chemical composition, mechanical & metallurgical properties and dimensional tolerances. The integrity of each component is ensured by NDE at different stages of manufacture. The manufacturing route for fuel tubes and components comprise of a combination of thermomechanical processing and each process step has marked effect on the final properties. The fuel tubes are manufactured by processing the extruded blanks in four stage cold pilgering with intermediate annealing and final stress relieving operation. The bar material is produced by hot extrusion followed by multi-pass swaging and intermediate annealing. Spacer pads and bearing pads are manufactured by blanking and coining of Zircaloy sheet which is made by a combination of hot and cold rolling operations. Due to the small size and stringent dimensional requirements of these appendages, selection of production route and optimization of process parameters are important. This paper discusses about various measures taken for improving the recoveries and mechanical and corrosion properties of the tube, sheet and bar materials being manufactured at Nuclear Fuel Complex, Hyderabad For the production of clad tubes, modifications at extrusion stage to reduce the wall thickness variation, introduction of ultrasonic testing of extruded blanks, optimization of cold working and heat treatment parameters at various stages of production etc. were done. The finished bar material is subjected to 100% Ultrasonic and eddy current testing to ensure

  1. Technological Education for the Rural Community (TERC) Project: Technical Mathematics for the Advanced Manufacturing Technician

    Science.gov (United States)

    McCormack, Sherry L.; Zieman, Stuart

    2017-01-01

    Hopkinsville Community College's Technological Education for the Rural Community (TERC) project is funded through the National Science Foundation Advanced Technological Education (NSF ATE) division. It is advancing innovative educational pathways for technological education promoted at the community college level serving rural communities to fill…

  2. Advanced technologies for manufacturing high strength sour grade UOE line pipe

    Energy Technology Data Exchange (ETDEWEB)

    Kobayashi, Kenji; Omura, Tomohiko; Takahashi, Nobuaki; Minato, Izuru; Yamamoto, Akio [Sumitomo Metal Industries, Ltd., Kashima, (Japan)

    2010-07-01

    A new kind of high strength pipeline has been manufactured for sour service in offshore pipelines. This paper first presents a review of developments in manufacturing technology to improve sour resistance. This was particularly the case with Grade UOE line pipe. The improvement was achieved by optimizing the continuous casting process, monitoring the shape of inclusions (such as MnS, CaS, Al2O3, CaO-Al2O3) and decreasing coarse precipitates (Nb(C,N), TiN). The study then used the HIC evaluation method to determine hydrogen induced cracking (HIC) resistance of the material and HAZ test for sulfide stress cracking (SSC) resistance. The evaluation of the NACE TM0284 solution A showed that these pipelines are able to resist severe sour conditions because of good HIC and SSC resistance. Optimizing others components like alloying elements and the ACC process would improve sour resistance in future applications.

  3. NASA Advances Technologies for Additive Manufacturing of GRCop-84 Copper Alloy

    Science.gov (United States)

    Gradl, Paul; Protz, Chris

    2017-01-01

    The Low Cost Upper Stage Propulsion project has successfully developed and matured Selective Laser Melting (SLM) Fabrication of the NASA developed GRCop-84 copper alloy. Several parts have been printed in house and at a commercial vendor, and these parts have been successfully machined and have undergone further fabrication steps to allow hot-fire testing. Hot-fire testing has demonstrated parts manufactured with this technique can survive and perform well in the relevant environments for liquid rocket propulsion systems.

  4. Visual correlation analytics of event-based error reports for advanced manufacturing

    OpenAIRE

    Nazir, Iqbal

    2017-01-01

    With the growing digitalization and automation in the manufacturing domain, an increasing amount of process data and error reports become available. To minimize the number of errors and maximize the efficiency of the production line, it is important to analyze the generated error reports and find solutions that can reduce future errors. However, not all errors have the equal importance, as some errors may be the result of previously occurred errors. Therefore, it is important for domain exper...

  5. DARPA Agreement HR0011-06-1-0028 (Robert C. Byrd Institute for Advanced Flexible Manufacturing)

    Science.gov (United States)

    2011-12-13

    Machine tool engineering and supervising; diagnostic equipment and maintenance; MIG, TIG and ARC welding ; Solder certification and training...possible to convert an inspiration to reality. This service merely formalized the process that was always available at RCBI. It was used to promote...focused mission. Specific R&D efforts involved projects for more complex manufacturing issues, from techniques in the design process to initial

  6. Advances in clinical NK cell studies: Donor selection, manufacturing and quality control

    OpenAIRE

    Koehl, U.; Kalberer, C.; Spanholtz, J.; Lee, D. A.; Miller, J. S.; Cooley, S.; Lowdell, M.; Uharek, L.; Klingemann, H.; Curti, A.; Leung, W.; Alici, E.

    2015-01-01

    ABSTRACT Natural killer (NK) cells are increasingly used in clinical studies in order to treat patients with various malignancies. The following review summarizes platform lectures and 2013?2015 consortium meetings on manufacturing and clinical use of NK cells in Europe and United States. A broad overview of recent pre-clinical and clinical results in NK cell therapies is provided based on unstimulated, cytokine-activated, as well as genetically engineered NK cells using chimeric antigen rece...

  7. Semiconductors bonds and bands

    CERN Document Server

    Ferry, David K

    2013-01-01

    As we settle into this second decade of the twenty-first century, it is evident that the advances in micro-electronics have truly revolutionized our day-to-day lifestyle. The technology is built upon semiconductors, materials in which the band gap has been engineered for special values suitable to the particular application. This book, written specifically for a one semester course for graduate students, provides a thorough understanding of the key solid state physics of semiconductors. It describes how quantum mechanics gives semiconductors unique properties that enabled the micro-electronics revolution, and sustain the ever-growing importance of this revolution.

  8. Manufacturing technologies

    Energy Technology Data Exchange (ETDEWEB)

    NONE

    1995-09-01

    The Manufacturing Technologies Center is an integral part of Sandia National Laboratories, a multiprogram engineering and science laboratory, operated for the Department of Energy (DOE) with major facilities at Albuquerque, New Mexico, and Livermore, California. Our Center is at the core of Sandia`s Advanced Manufacturing effort which spans the entire product realization process.

  9. Semiconductor statistics

    CERN Document Server

    Blakemore, J S

    1987-01-01

    In-depth exploration of the implications of carrier populations and Fermi energies examines distribution of electrons in energy bands and impurity levels of semiconductors. Also: kinetics of semiconductors containing excess carriers, particularly in terms of trapping, excitation, and recombination.

  10. Measuring the Effectiveness of the Apparel Advanced Manufacturing Demonstration Program. Appendices B-E

    Science.gov (United States)

    1990-12-30

    reh~exide Cen ter Georgia Institute of Technolo Southern Collge of Tecbnolog’ I eogiaiecn I OEMC INS=I~f No. 6 ’AMTC~’ I#. Save Money By Repairing Air...with a company’s physical and apparel industry, the architecture should be developed first. human resources I l. Computer-Integrated Manufacturing I I...demonstration center, ex. ence Technology - grants to de- Research projects in the physics , pected to -open In mid or late velop an automated antenna

  11. Manufacturing of advanced bent crystals for Laue Optics for Gamma ObservationS (LOGOS)

    International Nuclear Information System (INIS)

    Mazzolari, Andrea; Camattari, Riccardo; Bellucci, Valerio; Paternò, Gianfranco; Scian, Carlo; Mattei, Giovanni; Guidi, Vincenzo

    2015-01-01

    X- and γ-ray detection is currently a hot topic for a wide scientific community, spanning from astrophysics to nuclear medicine. However, lack of optics capable of focusing photons of energies in the energy range 0.1–1 MeV leaves the photon detection to a direct-view approach, resulting in a limited efficiency and resolution. The main scope of the INFN-LOGOS project is the development of technologies that enable manufacturing highly performing optical elements to be employed in the realization of hard X-ray lenses. Such lenses, typically named Laue lenses, consist of an ensemble of crystals disposed in concentric rings in order to diffract the incident radiation towards the focus of the lens, where a detector is placed. In particular, the INFN-LOGOS project aims at the realization of intrinsically bent silicon and germanium crystals exploiting the quasi-mosaic effect for focusing hard X-rays. Crystal manufacturing relies on a proper revisitation of techniques typically employed in silicon micromachining, such as thin film deposition and patterning or ion implantation

  12. Manufacturing technology for advanced jet engines; Jisedai jetto engine no seizo gijutsu

    Energy Technology Data Exchange (ETDEWEB)

    Hirakawa, H [Kawasaki Heavy Industries Ltd., Kobe (Japan)

    1997-04-05

    A part of the latest production technologies for aircraft jet engines is introduced. Outline of the turbofan engine, turbo-prop engine, and turbo-shaft engine are given. Every one of them employs a gas turbine engine comprising a compressor, combustor, and a turbine as the output generator. Increase in the turbine inlet temperature is effective for making the gas turbine engine more efficient. The development tread of heat resisting materials for realizing higher temperature is shown. The current status and future aspect of the manufacturing technology is discussed for each main component of the engine. Technological development for decreasing weight is important because the weight of the fan member increases when the fan diameter is increased to increase the bypass ratio. FRP is adopted for the blades and casing to decrease the weight of the compressor, and studies have been made on fiber reinforced materials to reduce the weight of the disks. The outlines of the latest manufacturing technologies for the combustor and turbine are introduced. 2 refs., 9 figs.

  13. Advanced treatment of acrylic fiber manufacturing wastewater with a combined microbubble-ozonation/ultraviolet irradiation process

    KAUST Repository

    Zheng, Tianlong; Zhang, Tao; Wang, Qunhui; Tian, Yanli; Shi, Zhining; Smale, Nicholas; Xu, Banghua

    2015-01-01

    This work investigated the effectiveness of a combination of microbubble-ozonation and ultraviolet (UV) irradiation for the treatment of secondary wastewater effluent of a wet-spun acrylic fiber manufacturing plant. Under reactor condition (ozone dosage of 48 mg L-1, UV fluence rate of 90 mW cm-2, initial pH of 8.0, and reaction time of 120 min), the biodegradability (represented as BOD5/CODcr) of the wastewater improved from 0.18 to 0.47. This improvement in biodegradability is related to the degradation of alkanes, aromatic compounds, and other bio-refractory organic compounds. The combination of microbubble-ozonation and UV irradiation synergistically improved treatment efficiencies by 228%, 29%, and 142% for CODcr, UV254 removal and BOD5/CODcr respectively after 120 min reaction time, as compared with the sum efficiency of microbubble-ozonation alone and UV irradiation alone. Hydroxyl radical production in the microbubble-ozonation/UV process was about 1.8 times higher than the sum production in microbubble-ozonation alone and UV irradiation alone. The ozone decomposition rate in the combined process was about 4.1 times higher than that in microbubble-ozonation alone. The microbubble-ozonation/UV process could be a promising technique for the treatment of bio-refractory organics in the acrylic fiber manufacturing industry. © 2015 Royal Society of Chemistry.

  14. Computer-assisted generation of individual training concepts for advanced education in manufacturing metrology

    International Nuclear Information System (INIS)

    Werner, Teresa; Weckenmann, Albert

    2010-01-01

    Due to increasing requirements on the accuracy and reproducibility of measurement results together with a rapid development of novel technologies for the execution of measurements, there is a high demand for adequately qualified metrologists. Accordingly, a variety of training offers are provided by machine manufacturers, universities and other institutions. Yet, for an interested learner it is very difficult to define an optimal training schedule for his/her individual demands. Therefore, a computer-based assistance tool is developed to support a demand-responsive scheduling of training. Based on the difference between the actual and intended competence profile and under consideration of amending requirements, an optimally customized qualification concept is derived. For this, available training offers are categorized according to different dimensions: regarding contents of the course, but also intended target groups, focus of the imparted competences, implemented methods of learning and teaching, expected constraints for learning and necessary preknowledge. After completing a course, the achieved competences and the transferability of gathered knowledge are evaluated. Based on the results, recommendations for amending measures of learning are provided. Thus, a customized qualification for manufacturing metrology is facilitated, adapted to the specific needs and constraints of each individual learner

  15. Field Evaluation of Advances in Energy-Efficiency Practices for Manufactured Homes

    Energy Technology Data Exchange (ETDEWEB)

    Levy, E. [Advanced Residential Integrated Energy Solutions (ARIES) Collaboration, New York, NY (United States); Dentz, J. [Advanced Residential Integrated Energy Solutions (ARIES) Collaboration, New York, NY (United States); Ansanelli, E. [Advanced Residential Integrated Energy Solutions (ARIES) Collaboration, New York, NY (United States); Barker, G. [Advanced Residential Integrated Energy Solutions (ARIES) Collaboration, New York, NY (United States); Rath, P. [Advanced Residential Integrated Energy Solutions (ARIES) Collaboration, New York, NY (United States); Dadia, D. [Advanced Residential Integrated Energy Solutions (ARIES) Collaboration, New York, NY (United States)

    2016-03-01

    Three side-by-side lab houses were built, instrumented and monitored in an effort to determine through field testing and analysis the relative contributions of select technologies toward reducing energy use in new manufactured homes. The lab houses in Russellville, Alabama compared the performance of three homes built to varying levels of thermal integrity and HVAC equipment: a baseline HUD-code home equipped with an electric furnace and a split system air conditioner; an ENERGY STAR manufactured home with an enhanced thermal envelope and traditional split system heat pump; and a house designed to qualify for Zero Energy Ready Home designation with a ductless mini-split heat pump with transfer fan distribution system in place of the traditional duct system for distribution. Experiments were conducted in the lab houses to evaluate impact on energy and comfort of interior door position, window blind position and transfer fan operation. The report describes results of tracer gas and co-heating tests and presents calculation of the heat pump coefficient of performance for both the traditional heat pump and the ductless mini-split. A series of calibrated energy models was developed based on measured data and run in three locations in the Southeast to compare annual energy usage of the three homes.

  16. Manufacturing of advanced bent crystals for Laue Optics for Gamma ObservationS (LOGOS)

    Energy Technology Data Exchange (ETDEWEB)

    Mazzolari, Andrea, E-mail: mazzolari@fe.infn.it [Department of Physics and Earth Sciences, University of Ferrara, Via Saragat 1/c, 44122 Ferrara (Italy); INFN, Section of Ferrara (Italy); Camattari, Riccardo; Bellucci, Valerio; Paternò, Gianfranco [Department of Physics and Earth Sciences, University of Ferrara, Via Saragat 1/c, 44122 Ferrara (Italy); INFN, Section of Ferrara (Italy); Scian, Carlo; Mattei, Giovanni [University of Padova, Department of Physics and Astronomy Galileo Galilei (Italy); Guidi, Vincenzo [Department of Physics and Earth Sciences, University of Ferrara, Via Saragat 1/c, 44122 Ferrara (Italy); INFN, Section of Ferrara (Italy)

    2015-07-15

    X- and γ-ray detection is currently a hot topic for a wide scientific community, spanning from astrophysics to nuclear medicine. However, lack of optics capable of focusing photons of energies in the energy range 0.1–1 MeV leaves the photon detection to a direct-view approach, resulting in a limited efficiency and resolution. The main scope of the INFN-LOGOS project is the development of technologies that enable manufacturing highly performing optical elements to be employed in the realization of hard X-ray lenses. Such lenses, typically named Laue lenses, consist of an ensemble of crystals disposed in concentric rings in order to diffract the incident radiation towards the focus of the lens, where a detector is placed. In particular, the INFN-LOGOS project aims at the realization of intrinsically bent silicon and germanium crystals exploiting the quasi-mosaic effect for focusing hard X-rays. Crystal manufacturing relies on a proper revisitation of techniques typically employed in silicon micromachining, such as thin film deposition and patterning or ion implantation.

  17. Semiconductor physics

    CERN Document Server

    Böer, Karl W

    2018-01-01

    This handbook gives a complete survey of the important topics and results in semiconductor physics. It addresses every fundamental principle and most research topics and areas of application in the field of semiconductor physics. Comprehensive information is provided on crystalline bulk and low-dimensional as well as amporphous semiconductors, including optical, transport, and dynamic properties.

  18. Advancing the manufacture of complex geometry GFRC for today's building envelopes

    Directory of Open Access Journals (Sweden)

    Thomas Henriksen

    2017-06-01

    With this research the current architectural knowledge base has been advanced in terms of complex geometry thin-walled GFRC for building envelopes. The identified solutions should allow building with complex geometries to be realised using thin-walled GFRC as the envelope cladding.

  19. Aircrew helmet design and manufacturing enhancements through the use of advanced technologies

    Science.gov (United States)

    Cadogan, David P.; George, Alan E.; Winkler, Edward R.

    1993-12-01

    With the development of helmet mounted displays (HMD) and night vision systems (NVS) for use in military and civil aviation roles, new methods of helmet development need to be explored. The helmet must be designed to provide the user with the most lightweight, form fitting system, while meeting other system performance requirements. This can be achieved through a complete analysis of the system requirements. One such technique for systems analysis, a quality function deployment (QFD) matrix, is explored for this purpose. The advanced helmet development process for developing aircrew helmets includes the utilization of several emerging technologies such as laser scanning, computer aided design (CAD), computer generated patterns from 3-D surfaces, laser cutting of patterns and components, and rapid prototyping (stereolithography). Advanced anthropometry methods for helmet development are also available for use. Besides the application of advanced technologies to be used in the development of helmet assemblies, methods of mass reduction are also discussed. The use of these advanced technologies will minimize errors in the development cycle of the helmet and molds, and should enhance system performance while reducing development time and cost.

  20. Advances in the manufacturing and irradiation of reduced enrichment fuels for canadian research reactors

    International Nuclear Information System (INIS)

    Wood, J.C.; Foo, M.T.; Berthiaume, L.C.; Herbert, L.N.; Schaefer, J.D.

    1984-01-01

    The procedures for manufacturing fuel rods of uranium silicide dispersed in aluminum and clad in aluminum have been optimized to maximize production rates while minimizing scrap losses. Melting and casting, chip machining and core extrusion have all been re-evaluated to improve their efficiency and significant gains have been made, whilst maintaining high quality standards. The results of our irradiation program on mini-elements up to a burnup of 80 atomic percent continue to be encouraging. The upper bound curve of fuel core swelling versus burnup in the range 0-80 atomic percent represents 1% swelling per 10 atomic percent burnup. Fuel core swelling has now been measured directly on six mini-elements from which the clad surface oxide had been removed showing that previous calculated values of core swelling were marginally conservative. (author)

  1. Extensive characterisation of advanced manufacturing solutions for the ITER Central Solenoid pre-compression system

    CERN Document Server

    Langeslag, S.A.E.; Libeyre, P.; Marcinek, D.J.; Zhang, Z.

    2015-01-01

    The ITER Central Solenoid (CS), positioned in the center of the ITER tokamak, will provide a magnetic field, contributing to the confinement of the plasma. The 13 m high CS consists of a vertical stack of 6 independently driven modules, dynamically activated. Resulting opposing currents can lead to high separation forces. A pre-compression structure is implemented to counteract these opposing forces, by realising a continuous 180 MN coil-to-coil contact loading. Preload is applied by mechanical fastening via 9 subunits, positioned along the coil stack, each consisting of 2 outer and 1 inner tie plate. The tie plates therefore need to feature outstanding mechanical behaviour in a large temperature range. High strength, Nitronic®-50 type F XM-19 austenitic stainless steel is selected as candidate material. The linearised stress distribution reaches approximately 250 MPa, leading to a required yield strength of 380 MPa at room temperature. Two different manufacturing methods are being studied for the procuremen...

  2. Advanced Material Studies for Additive Manufacturing in terms of Future Gear Application

    Directory of Open Access Journals (Sweden)

    Jan Bräunig

    2014-06-01

    Full Text Available Additive manufacturing by laser beam melting is predestined for complex component geometry like integrated cooling channels without enormous posttreatment processing. To investigate the influence of build-up direction in terms of later tooth excitation of gear-wheels, first fundamental material analyses were accomplished in this publication. Therefore, additively produced specimens were used to determine the build-up direction dependent elastic properties of the material in all three spatial directions based on tensile and torsion tests. The anisotropies of elastic limits and breaking points of previous studies were confirmed in this paper. Furthermore, torsion values were also determined depending on build-up direction. Laser beam melted X3NiCoMoTi18-9-5 (hot-work tool steel was shown to exhibit extremely high performance under shear loading in comparison to conventionally processed steel. The influence of build-up direction on torsional strength was also shown.

  3. Development of Advanced Manufacturing Methods for Warm White LEDs for General Lighting

    Energy Technology Data Exchange (ETDEWEB)

    Deshpande, Anirudha; Kolodin, Boris; Jacob, Cherian; Chowdhury, Ashfaqul; Kuenzler, Glenn; Sater, Karen; Aesram, Danny; Glaettli, Steven; Gallagher, Brian; Langer, Paul; Setlur, Anant; Beers, Bill

    2012-03-31

    GE Lighting Solutions will develop precise and efficient manufacturing techniques for the “remote phosphor” platform of warm-white LED products. In volume, this will be demonstrated to drive significant materials, labor and capital productivity to achieve a maximum possible 53% reduction in overall cost. In addition, the typical total color variation for these white LEDs in production will be well within the ANSI bins and as low as a 4-step MacAdam ellipse centered on the black body curve. Achievement of both of these objectives will be demonstrated while meeting a performance target of > 75 lm/W for a warm-white LED and a reliability target of <30% lumen drop / <2-step MacAdam ellipse shift, estimated over 50,000 hrs.

  4. Extensive characterisation of advanced manufacturing solutions for the ITER Central Solenoid pre-compression system

    Energy Technology Data Exchange (ETDEWEB)

    Langeslag, S.A.E., E-mail: stefanie.langeslag@cern.ch [CERN, CH-1211 Genève 23 (Switzerland); Sgobba, S. [CERN, CH-1211 Genève 23 (Switzerland); Libeyre, P. [ITER Organization, Route de Vinon-sur-Verdon, CS 90 046, 13067 St. Paul lez Durance Cedex (France); Marcinek, D.J. [Cracow University of Technology, Warszawska 24, 30-962 Kraków (Poland); Zhang, Z. [CERN, CH-1211 Genève 23 (Switzerland); EPFL, CH-1015 Lausanne (Switzerland)

    2015-10-15

    The ITER Central Solenoid (CS), positioned in the center of the ITER tokamak, will provide a magnetic field, contributing to the confinement of the plasma. The 13 m high CS consists of a vertical stack of 6 independently driven modules, dynamically activated. Resulting opposing currents can lead to high separation forces. A pre-compression structure is implemented to counteract these opposing forces, by realising a continuous 180 MN coil-to-coil contact loading. Preload is applied by mechanical fastening via 9 subunits, positioned along the coil stack, each consisting of 2 outer and 1 inner tie plate. The tie plates therefore need to feature outstanding mechanical behaviour in a large temperature range. High strength, Nitronic®-50 type F XM-19 austenitic stainless steel is selected as candidate material. The linearised stress distribution reaches approximately 250 MPa, leading to a required yield strength of 380 MPa at room temperature. Two different manufacturing methods are being studied for the procurement of these 15 m long tie plates. A welded solution originates from individual head- and slab-forgings, welded together by Gas Metal Arc Welding (GMAW). In parallel, a single piece forged solution is proven feasible, impressively forged in one piece by applying successive open die forging steps, followed by final machining. Maximum internal stress is experienced during cool-down to 4 K as a result of a large difference in thermal contraction between the support system and the coils. Furthermore, the varying magnetic fields in the independently driven coils introduce cyclic loading. Therefore, assessment of the two manufacturing solutions, in terms of both static and dynamic mechanical behaviour, is performed at ambient as well as cryogenic temperature. An extensive characterisation including microstructural and mechanical examination is conducted, evaluating the comparative performance of both solutions, reporting, amongst others, yield strength reaching the

  5. CANDU RU fuel manufacturing basic technology development and advanced fuel verification tests

    International Nuclear Information System (INIS)

    Chung, Chang Hwan; Chang, S.K.; Hong, S.D.

    1999-04-01

    A PHWR advanced fuel named the CANFLEX fuel has been developed through a KAERI/AECL joint Program. The KAERI made fuel bundle was tested at the KAERI Hot Test Loop for the performance verification of the bundle design. The major test activities were the fuel bundle cross-flow test, the endurance fretting/vibration test, the freon CHF test, and the fuel bundle heat-up test. KAERI also has developing a more advanced PHWR fuel, the CANFLEX-RU fuel, using recovered uranium to extend fuel burn-up in the CANDU reactors. For the purpose of proving safety of the RU handling techniques and appraising feasibility of the CANFLEX-RU fuel fabrication in near future, a physical, chemical and radiological characterization of the RU powder and pellets was performed. (author). 54 refs., 46 tabs., 62 figs

  6. CANDU RU fuel manufacturing basic technology development and advanced fuel verification tests

    Energy Technology Data Exchange (ETDEWEB)

    Chung, Chang Hwan; Chang, S.K.; Hong, S.D. [and others

    1999-04-01

    A PHWR advanced fuel named the CANFLEX fuel has been developed through a KAERI/AECL joint Program. The KAERI made fuel bundle was tested at the KAERI Hot Test Loop for the performance verification of the bundle design. The major test activities were the fuel bundle cross-flow test, the endurance fretting/vibration test, the freon CHF test, and the fuel bundle heat-up test. KAERI also has developing a more advanced PHWR fuel, the CANFLEX-RU fuel, using recovered uranium to extend fuel burn-up in the CANDU reactors. For the purpose of proving safety of the RU handling techniques and appraising feasibility of the CANFLEX-RU fuel fabrication in near future, a physical, chemical and radiological characterization of the RU powder and pellets was performed. (author). 54 refs., 46 tabs., 62 figs.

  7. Next generation grinding spindle for cost-effective manufacture of advanced ceramic components

    Energy Technology Data Exchange (ETDEWEB)

    Kovach, J.A.; Laurich, M.A.

    2000-01-01

    Finish grinding of advanced structural ceramics has generally been considered an extremely slow and costly process. Recently, however, results from the High-Speed, Low-Damage (HSLD) program have clearly demonstrated that numerous finish-process performance benefits can be realized by grinding silicon nitride at high wheel speeds. A new, single-step, roughing-process capable of producing high-quality silicon nitride parts at high material removal rates while dramatically reducing finishing costs has been developed.

  8. Ionizing radiation processing and its potential in advancing biorefining and nanocellulose composite materials manufacturing.

    Science.gov (United States)

    Postek, Michael T; Poster, Dianne L; Vládar, András E; Driscoll, Mark S; LaVerne, Jay A; Tsinas, Zois; Al-Sheikhly, Mohamad I

    2018-02-01

    Nanocellulose is a high value material that has gained increasing attention because of its high strength, stiffness, unique photonic and piezoelectric properties, high stability and uniform structure. Through utilization of a biorefinery concept, nanocellulose can be produced in large volumes from wood at relatively low cost via ionizing radiation processing. Ionizing radiation causes significant break down of the polysaccharide and leads to the production of potentially useful gaseous products such as H 2 and CO. The application of radiation processing to the production of nanocellulose from woody and non-wood sources, such as field grasses, bio-refining byproducts, industrial pulp waste, and agricultural surplus materials remains an open field, ripe for innovation and application. Elucidating the mechanisms of the radiolytic decomposition of cellulose and the mass generation of nanocellulose by radiation processing is key to tapping into this source of nanocelluose for the growth of nanocellulostic-product development. More importantly, understanding the structural break-up of the cell walls as a function of radiation exposure is a key goal and only through careful, detailed characterization and dimensional metrology can this be achieved at the level of detail that is needed to further the growth of large scale radiation processing of plant materials. This work is resulting from strong collaborations between NIST and its academic partners who are pursuing the unique demonstration of applied ionizing radiation processing to plant materials as well as the development of manufacturing metrology for novel nanomaterials.

  9. Microbubble enhanced ozonation process for advanced treatment of wastewater produced in acrylic fiber manufacturing industry

    KAUST Repository

    Zheng, Tianlong

    2015-02-02

    This work investigated microbubble-ozonation for the treatment of a refractory wet-spun acrylic fiber wastewater in comparison to macrobubble-ozonation. CODcr, NH3-N, and UV254 of the wastewater were removed by 42%, 21%, and 42%, respectively in the microbubble-ozonation, being 25%, 9%, and 35% higher than the removal rates achieved by macrobubble-ozonation at the same ozone dose. The microbubbles (with average diameter of 45μm) had a high concentration of 3.9×105 counts/mL at a gas flow rate of 0.5L/min. The gas holdup, total ozone mass-transfer coefficient, and average ozone utilization efficiency in the microbubble-ozonation were 6.6, 2.2, and 1.5 times higher than those of the macrobubble-ozonation. Greater generation of hydroxyl radicals and a higher zeta potential of the bubbles were also observed in the microbubble ozonation process. The biodegradability of the wastewater was also significantly improved by microbubble-ozonation, which was ascribed to the enhanced degradation of alkanes, aromatic compounds, and the many other bio-refractory organic compounds in the wastewater. Microbubble-ozonation can thus be a more effective treatment process than traditional macrobubble-ozonation for refractory wastewater produced by the acrylic fiber manufacturing industry.

  10. Ionizing radiation processing and its potential in advancing biorefining and nanocellulose composite materials manufacturing

    Science.gov (United States)

    Postek, Michael T.; Poster, Dianne L.; Vládar, András E.; Driscoll, Mark S.; LaVerne, Jay A.; Tsinas, Zois; Al-Sheikhly, Mohamad I.

    2018-02-01

    Nanocellulose is a high value material that has gained increasing attention because of its high strength, stiffness, unique photonic and piezoelectric properties, high stability and uniform structure. Through utilization of a biorefinery concept, nanocellulose can be produced in large volumes from wood at relatively low cost via ionizing radiation processing. Ionizing radiation causes significant break down of the polysaccharide and leads to the production of potentially useful gaseous products such as H2 and CO. The application of radiation processing to the production of nanocellulose from woody and non-wood sources, such as field grasses, bio-refining by-products, industrial pulp waste, and agricultural surplus materials remains an open field, ripe for innovation and application. Elucidating the mechanisms of the radiolytic decomposition of cellulose and the mass generation of nanocellulose by radiation processing is key to tapping into this source of nanocelluose for the growth of nanocellulostic-product development. More importantly, understanding the structural break-up of the cell walls as a function of radiation exposure is a key goal and only through careful, detailed characterization and dimensional metrology can this be achieved at the level of detail that is needed to further the growth of large scale radiation processing of plant materials. This work is resulting from strong collaborations between NIST and its academic partners who are pursuing the unique demonstration of applied ionizing radiation processing to plant materials as well as the development of manufacturing metrology for novel nanomaterials.

  11. Modernization of the Radioisotopes Production Laboratory of the La Reina Nuclear Center in Chile: Incorporating advanced concepts of safety and good manufacturing practices

    International Nuclear Information System (INIS)

    Lagos Espinoza, Silvia

    2014-01-01

    A radioisotopes and radiopharmaceuticals production laboratory was established in Chile in the 1960s for research activities. From 1967 until January 2012, it was dedicated to the manufacturing of radioisotopes and radiopharmaceuticals for medical diagnosis and treatment purposes. In 2012, modernization of the facility’s design and technology began as part of the IAEA technical cooperation project, Modernizing the Radioisotopes Production Laboratory of La Reina Nuclear Centre by Incorporating Advanced Concepts of Safety and Good Manufacturing Practices, (CHI4022)

  12. Structural analysis and manufacture for the vacuum vessel of experimental advanced superconducting tokamak (EAST) device

    International Nuclear Information System (INIS)

    Song Yuntao; Yao Damao; Wu Songata; Weng Peide

    2006-01-01

    The experimental advanced superconducting tokamak (EAST) is an advanced steady-state plasma physics experimental device, which has been approved by the Chinese government and is being constructed as the Chinese national nuclear fusion research project. The vacuum vessel, that is one of the key components, will have to withstand not only the electromagnetic force due to the plasma disruption and the Halo current, but also the pressure of boride water and the thermal stress due to the 250 deg. C baking out by the hot pressure nitrogen gas, or the 100 deg. C hot wall during plasma operation. This paper is a report of the mechanical analyses of the vacuum vessel. According to the allowable stress criteria of American Society of Mechanical Engineers, Boiler and Pressure Vessel Committee (ASME), the maximum integrated stress intensity on the vacuum vessel is 396 MPa, less than the allowable design stress intensity 3S m (441 MPa). At the same time, some key R and D issues are presented, which include supporting system, bellows and the assembly of the whole vacuum vessel

  13. Fundamentals of semiconductor lasers

    CERN Document Server

    Numai, Takahiro

    2015-01-01

    This book explains physics under the operating principles of semiconductor lasers in detail based on the experience of the author, dealing with the first manufacturing of phase-shifted DFB-LDs and recent research on transverse modes.   The book also bridges a wide gap between journal papers and textbooks, requiring only an undergraduate-level knowledge of electromagnetism and quantum mechanics, and helps readers to understand journal papers where definitions of some technical terms vary, depending on the paper. Two definitions of the photon density in the rate equations and two definitions of the phase-shift in the phase-shifted DFB-LD are explained, and differences in the calculated results are indicated, depending on the definitions.    Readers can understand the physics of semiconductor lasers and analytical tools for Fabry-Perot LDs, DFB-LDs, and VCSELs and will be stimulated to develop semiconductor lasers themselves.

  14. AC low-pressure plasmas generated by using annular-shaped electrodes for abatement of pollutants emitted during semiconductor manufacturing processes

    International Nuclear Information System (INIS)

    Hur, Min; Lee, Jae Ok; Song, Young Hoon

    2011-01-01

    A plasma abatement system operating at low pressures is set up with the aim of treating pollutants emitted by the semiconductor industry. The abatement device is characterized by using a tube-shaped reactor design and a bipolar alternating current, which allows an easy connection to pre-existing pipelines in the semiconductor industry and low installation cost, respectively. By using optical emission spectroscopy (OES) and Fourier transform infrared spectroscopy (FTIR), we analyzed the discharge characteristics and abatement efficiency with emphasis on the working pressure effect. In the case of CF 4 , the destruction and removal efficiency (DRE) is greatly reduced with increasing pressure. However, the pressure has a relatively small influence on the DRE for tetrakis(ethylmethylamino)zirconium (TEMAZ), which is significantly destroyed only with several hundred watts and without any liquefied byproducts. This difference is closely related to the spatial distribution of reactive species and to the chemical bond strengths of the pollutant's components. Finally, the applicability of the abatement device is discussed based on the experimental results.

  15. Advanced light source technologies that enable high-volume manufacturing of DUV lithography extensions

    Science.gov (United States)

    Cacouris, Theodore; Rao, Rajasekhar; Rokitski, Rostislav; Jiang, Rui; Melchior, John; Burfeindt, Bernd; O'Brien, Kevin

    2012-03-01

    Deep UV (DUV) lithography is being applied to pattern increasingly finer geometries, leading to solutions like double- and multiple-patterning. Such process complexities lead to higher costs due to the increasing number of steps required to produce the desired results. One of the consequences is that the lithography equipment needs to provide higher operating efficiencies to minimize the cost increases, especially for producers of memory devices that experience a rapid decline in sales prices of these products over time. In addition to having introduced higher power 193nm light sources to enable higher throughput, we previously described technologies that also enable: higher tool availability via advanced discharge chamber gas management algorithms; improved process monitoring via enhanced on-board beam metrology; and increased depth of focus (DOF) via light source bandwidth modulation. In this paper we will report on the field performance of these technologies with data that supports the desired improvements in on-wafer performance and operational efficiencies.

  16. Advanced materials for the optical delay line of frequency pulse modulator on the basis of semiconductor laser

    International Nuclear Information System (INIS)

    Abrarov, S.M.

    1999-01-01

    In the paper some materials which can be sued as an optical delay line of the pulse frequency modulator are considered. The structure and the principle are described as a modulator consisting of a laser diode with two Fabry Perot resonators and an optical wave guide providing a feedback loop. The optical wave guide fulfills the function of delay line and links the two resonators. The pulse sequence of the radiation of the semiconductor laser arises due to failure and recovery of optical generation. The pulse frequency modulation can be carried out by the action of electrical tension field on the electro optic martial of the wave guide. The selection of three electro-optic crystals for making of the optical wave guide of the considered modulator is justified. (author)

  17. A note on “A new approach for the selection of advanced manufacturing technologies: Data envelopment analysis with double frontiers”

    Directory of Open Access Journals (Sweden)

    Hossein Azizi

    2015-08-01

    Full Text Available Recently, using the data envelopment analysis (DEA with double frontiers approach, Wang and Chin (2009 proposed a new approach for the selection of advanced manufacturing technologies: DEA with double frontiers and a new measure for the selection of the best advanced manufacturing technologies (AMTs. In this note, we show that their proposed overall performance measure for the selection of the best AMT has an additional computational burden. Moreover, we propose a new measure for developing a complete ranking of AMTs. Numerical examples are examined using the proposed measure to show its simplicity and usefulness in the AMT selection and justification.

  18. Future Role of Application of New Technologies in Small-and Medium Scale Manufacturing Systems - Regarding Intelligent and Advanced Manufacturing Systems in Northern Peripheral Area

    OpenAIRE

    Somlò, Kinga; Sziebig, Gabor

    2017-01-01

    Accepted manuscript version. Link to publishers version: http://doi.org/10.1109/ISIE.2017.8001510 Nowadays the concept of Industry 4.0. and the relating intelligent manufacturing system are getting more and more current and well-known. In the past years the outstanding development of different areas such as information technology computer science, machining, robotics and so on, made possible a comprehensive transformation of the manufacturing systems. Present paper aims to give a gener...

  19. Design and manufacturing of non-instrumented capsule for advanced PWR fuel pellet irradiation test in HANARO

    Energy Technology Data Exchange (ETDEWEB)

    Kim, D. H.; Lee, C. B.; Song, K. W. [Korea Atomic Energy Research Institute, Taejeon (Korea)

    2002-04-01

    This project is preparing to irradiation test of the developed large grain UO{sub 2} fuel pellet in HANARO for pursuit fuel safety and high burn-up in 'Advanced LWR Fuel Technology Development Project' as a part Nuclear Mid and Long-term R and D Program. On the basis test rod is performed the nuclei property and preliminary fuel performance analysis, test rod and non-instrumented capsule are designed and manufactured for irradiation test in HANARO. This non-instrumented irradiation capsule of Advanced PWR Fuel pellet was referred the non-instrumented capsule for an irradiation test of simulated DUPIC fuel in HANARO(DUPIC Rig-001) and 18-element HANARO fuel, was designed to ensure the integrity and the endurance of non-instrumented capsule during the long term(2.5 years) irradiation. To irradiate the UO{sub 2} pellets up to the burn-up 70 MWD/kgU, need the time about 60 months and ensure the integrity of non-instrumented capsule for 30 months until replace the new capsule. This non-instrumented irradiation capsule will be based to develope the non-instrumented capsule for the more long term irradiation in HANARO. 22 refs., 13 figs., 5 tabs. (Author)

  20. Dampak Implementasi Penggunaan Teknologi Manufaktur Tingkat Lanjut -Advanced Manufacturing Technology pada Kinerja UKM di Indonesia

    Directory of Open Access Journals (Sweden)

    Jani Rahardjo

    2014-01-01

    Full Text Available In Indonesia, 99.8% of the businesses are SMEs. However, those SMEs only contribute to the 56.7% of the Indonesia GDP.  This happened, mainly due to the limitations of SMEs which use traditional technologies in the production process. Therefore, in 2014, the Indonesian government through the Ministry of Cooperation and Small Medium Entreprises launced a new strategic plan to empowering the SMEs by applying the Advanced Manufacting Technology (AMT. It is believed that by applying the AMT in the SMEs can increase productivities, expand the market share and raised national economic growth. This study, identified the used of AMT in the Indonesia SMEs, especially in foods, beverages, herbal and handicraft sectors. Additionally, it is also measured the impact of the used of AMT in the SMEs’ performaces. In this study, it is found that 76.6 % of the total sampel (253 SMEs declared that they use the AMT. This indicates that the Indonesia SMEs have a clear operation mission, process production, high quality products and meet the customer’s satisfaction. It is also found that the percentage of the hard technology is higher than the soft technology. This showed that there is a large effort to increase the productivity in the process production. Finally, we found that the impact of the AMT used to the SMEs’ performance in the market share, profitability and organization performance is increased significantly.

  1. The Advanced High-Temperature Reactor (AHTR) for Producing Hydrogen to Manufacture Liquid Fuels

    International Nuclear Information System (INIS)

    Forsberg, C.W.; Peterson, P.F.; Ott, L.

    2004-01-01

    Conventional world oil production is expected to peak within a decade. Shortfalls in production of liquid fuels (gasoline, diesel, and jet fuel) from conventional oil sources are expected to be offset by increased production of fuels from heavy oils and tar sands that are primarily located in the Western Hemisphere (Canada, Venezuela, the United States, and Mexico). Simultaneously, there is a renewed interest in liquid fuels from biomass, such as alcohol; but, biomass production requires fertilizer. Massive quantities of hydrogen (H2) are required (1) to convert heavy oils and tar sands to liquid fuels and (2) to produce fertilizer for production of biomass that can be converted to liquid fuels. If these liquid fuels are to be used while simultaneously minimizing greenhouse emissions, nonfossil methods for the production of H2 are required. Nuclear energy can be used to produce H2. The most efficient methods to produce H2 from nuclear energy involve thermochemical cycles in which high-temperature heat (700 to 850 C) and water are converted to H2 and oxygen. The peak nuclear reactor fuel and coolant temperatures must be significantly higher than the chemical process temperatures to transport heat from the reactor core to an intermediate heat transfer loop and from the intermediate heat transfer loop to the chemical plant. The reactor temperatures required for H2 production are at the limits of practical engineering materials. A new high-temperature reactor concept is being developed for H2 and electricity production: the Advanced High-Temperature Reactor (AHTR). The fuel is a graphite-matrix, coated-particle fuel, the same type that is used in modular high-temperature gas-cooled reactors (MHTGRs). The coolant is a clean molten fluoride salt with a boiling point near 1400 C. The use of a liquid coolant, rather than helium, reduces peak reactor fuel and coolant temperatures 100 to 200 C relative to those of a MHTGR. Liquids are better heat transfer fluids than gases

  2. Semiconductor lasers stability, instability and chaos

    CERN Document Server

    Ohtsubo, Junji

    2017-01-01

    This book describes the fascinating recent advances made concerning the chaos, stability and instability of semiconductor lasers, and discusses their applications and future prospects in detail. It emphasizes the dynamics in semiconductor lasers by optical and electronic feedback, optical injection, and injection current modulation. Applications of semiconductor laser chaos, control and noise, and semiconductor lasers are also demonstrated. Semiconductor lasers with new structures, such as vertical-cavity surface-emitting lasers and broad-area semiconductor lasers, are intriguing and promising devices. Current topics include fast physical number generation using chaotic semiconductor lasers for secure communication, development of chaos, quantum-dot semiconductor lasers and quantum-cascade semiconductor lasers, and vertical-cavity surface-emitting lasers. This fourth edition has been significantly expanded to reflect the latest developments. The fundamental theory of laser chaos and the chaotic dynamics in se...

  3. Tribology in Manufacturing Technology

    CERN Document Server

    2013-01-01

    The present book aims to provide research advances on tribology in manufacturing technology for modern industry. This book can be used as a research book for final undergraduate engineering course (for example, mechanical, manufacturing, materials, etc) or as a subject on manufacturing at the postgraduate level. Also, this book can serve as a useful reference for academics, manufacturing and tribology researchers, mechanical, mechanical, manufacturing and materials engineers, professionals in related industries with manufacturing and tribology.

  4. Manufacturing of Protected Lithium Electrodes for Advanced Lithium-Air, Lithium-Water & Lithium-Sulfur Batteries

    Energy Technology Data Exchange (ETDEWEB)

    Visco, Steven J

    2015-11-30

    The global demand for rechargeable batteries is large and growing rapidly. Assuming the adoption of electric vehicles continues to increase, the need for smaller, lighter, and less expensive batteries will become even more pressing. In this vein, PolyPlus Battery Company has developed ultra-light high performance batteries based on its proprietary protected lithium electrode (PLE) technology. The Company’s Lithium-Air and Lithium-Seawater batteries have already demonstrated world record performance (verified by third party testing), and we are developing advanced lithium-sulfur batteries which have the potential deliver high performance at low cost. In this program PolyPlus Battery Company teamed with Corning Incorporated to transition the PLE technology from bench top fabrication using manual tooling to a pre- commercial semi-automated pilot line. At the inception of this program PolyPlus worked with a Tier 1 battery manufacturing engineering firm to design and build the first-of-its-kind pilot line for PLE production. The pilot line was shipped and installed in Berkeley, California several months after the start of the program. PolyPlus spent the next two years working with and optimizing the pilot line and now produces all of its PLEs on this line. The optimization process successfully increased the yield, throughput, and quality of PLEs produced on the pilot line. The Corning team focused on fabrication and scale-up of the ceramic membranes that are key to the PLE technology. PolyPlus next demonstrated that it could take Corning membranes through the pilot line process to produce state-of-the-art protected lithium electrodes. In the latter part of the program the Corning team developed alternative membranes targeted for the large rechargeable battery market. PolyPlus is now in discussions with several potential customers for its advanced PLE-enabled batteries, and is building relationships and infrastructure for the transition into manufacturing. It is likely

  5. Low-Cost Manufacturing Technique for Advanced Regenerative Cooling for In-Space Cryogenic Engines, Phase II

    Data.gov (United States)

    National Aeronautics and Space Administration — The goal of the proposed effort is to use selective laser melting (SLM, an additive manufacturing technique) to manufacture a hot fire-capable, water-cooled spool...

  6. Low-Cost Manufacturing Technique for Advanced Regenerative Cooling for In-Space Cryogenic Engines, Phase I

    Data.gov (United States)

    National Aeronautics and Space Administration — The goal of the proposed effort is to demonstrate feasibility of using selective laser melting (SLM, an emerging manufacturing technique) to manufacture a subscale...

  7. Advanced calculation methodology for manufacturing and technological parameters' uncertainties propagation at arbitrary level of lattice elements grouping

    International Nuclear Information System (INIS)

    Pecchia, Marco; Vasiliev, Alexander; Leray, Olivier; Ferroukhi, Hakim; Pautz, Andreas

    2015-01-01

    A new methodology, referred to as manufacturing and technological parameters uncertainty quantification (MTUQ), is under development at Paul Scherrer Institut (PSI). Based on uncertainty and global sensitivity analysis methods, MTUQ aims at advancing state-of-the-art for the treatment of geometrical/material uncertainties in light water reactor computations, using the MCNPX Monte Carlo neutron transport code. The development is currently focused primarily on criticality safety evaluations (CSE). In that context, the key components are a dedicated modular interface with the MCNPX code and a user-friendly interface to model functional relationship between system variables. A unique feature is an automatic capability to parameterize variables belonging to so-called “repeated structures” such as to allow for perturbations of each individual element of a given system modelled with MCNPX. Concerning the statistical analysis capabilities, these are currently implemented through an interface with the ROOT platform to handle the random sampling design. This paper presents the current status of the MTUQ methodology development and a first assessment of an ongoing organisation for economic cooperation and development/nuclear energy agency benchmark dedicated to uncertainty analyses for CSE. The presented results illustrate the overall capabilities of MTUQ and underline its relevance in predicting more realistic results compared to a methodology previously applied at PSI for this particular benchmark. (author)

  8. Computational modeling of electrically-driven deposition of ionized polydisperse particulate powder mixtures in advanced manufacturing processes

    Science.gov (United States)

    Zohdi, T. I.

    2017-07-01

    A key part of emerging advanced additive manufacturing methods is the deposition of specialized particulate mixtures of materials on substrates. For example, in many cases these materials are polydisperse powder mixtures whereby one set of particles is chosen with the objective to electrically, thermally or mechanically functionalize the overall mixture material and another set of finer-scale particles serves as an interstitial filler/binder. Often, achieving controllable, precise, deposition is difficult or impossible using mechanical means alone. It is for this reason that electromagnetically-driven methods are being pursued in industry, whereby the particles are ionized and an electromagnetic field is used to guide them into place. The goal of this work is to develop a model and simulation framework to investigate the behavior of a deposition as a function of an applied electric field. The approach develops a modular discrete-element type method for the simulation of the particle dynamics, which provides researchers with a framework to construct computational tools for this growing industry.

  9. Semiconductor research capabilities at the Lawrence Berkeley Laboratory

    International Nuclear Information System (INIS)

    1987-02-01

    This document discusses semiconductor research capabilities (advanced materials, processing, packaging) and national user facilities (electron microscopy, heavy-ion accelerators, advanced light source)

  10. Electronic structure of semiconductor interfaces

    Energy Technology Data Exchange (ETDEWEB)

    Herman, F

    1983-02-01

    The study of semiconductor interfaces is one of the most active and exciting areas of current semiconductor research. Because interfaces play a vital role in modern semiconductor technology (integrated circuits, heterojunction lasers, solar cells, infrared detectors, etc.), there is a strong incentive to understand interface properties at a fundamental level and advance existing technology thereby. At the same time, technological advances such as molecular beam epitaxy have paved the way for the fabrication of semiconductor heterojunctions and superlattices of novel design which exhibit unusual electronic, optical, and magnetic properties and offer unique opportunities for fundamental scientific research. A general perspective on this subject is offered treating such topics as the atomic and electronic structure of semiconductor surfaces and interfaces; oxidation and oxide layers; semiconductor heterojunctions and superlattices; rectifying metal-semiconductor contacts; and interface reactions. Recent progress is emphasized and some future directions are indicated. In addition, the role that large-scale scientific computation has played in furthering our theoretical understanding of semiconductor surfaces and interfaces is discussed. Finally, the nature of theoretical models, and the role they play in describing the physical world is considered.

  11. Electronic structure of semiconductor interfaces

    International Nuclear Information System (INIS)

    Herman, F.

    1983-01-01

    The study of semiconductor interfaces is one of the most active and exciting areas of current semiconductor research. Because interfaces play a vital role in modern semiconductor technology (integrated circuits, heterojunction lasers, solar cells, infrared detectors, etc.), there is a strong incentive to understand interface properties at a fundamental level and advance existing technology thereby. At the same time, technological advances such as molecular beam epitaxy have paved the way for the fabrication of semiconductor heterojunctions and superlattices of novel design which exhibit unusual electronic, optical, and magnetic properties and offer unique opportunities for fundamental scientific research. A general perspective on this subject is offered treating such topics as the atomic and electronic structure of semiconductor surfaces and interfaces; oxidation and oxide layers; semiconductor heterojunctions and superlattices; rectifying metal-semiconductor contacts; and interface reactions. Recent progress is emphasized and some future directions are indicated. In addition, the role that large-scale scientific computation has played in furthering our theoretical understanding of semiconductor surfaces and interfaces is discussed. Finally, the nature of theoretical models, and the role they play in describing the physical world is considered. (Author) [pt

  12. Advanced methods of process/quality control in nuclear reactor fuel manufacture. Proceedings of a technical committee meeting

    Energy Technology Data Exchange (ETDEWEB)

    NONE

    2000-07-01

    Nuclear fuel plays an essential role in ensuring the competitiveness of nuclear energy and its acceptance by the public. The economic and market situation is not favorable at present for nuclear fuel designers and suppliers. The reduction in fuel prices (mainly to compete with fossil fuels) and in the number of fuel assemblies to be delivered to customers (mainly due to burnup increase) has been offset by the rising number of safety and other requirements, e.g. the choice of fuel and structural materials and the qualification of equipment. In this respect, higher burnup and thermal rates, longer fuel cycles and the use of MOX fuels are the real means to improve the economics of the nuclear fuel cycle as a whole. Therefore, utilities and fuel vendors have recently initiated new research and development programmes aimed at improving fuel quality, design and materials to produce robust and reliable fuel for safe and reliable reactor operation more demanding conditions. In this connection, improvement of fuel quality occupies an important place and this requires continuous effort on the part of fuel researchers, designers and producers. In the early years of commercial fuel fabrication, emphasis was given to advancements in quality control/quality assurance related mainly to the product itself. Now, the emphasis is transferred to improvements in process control and to implementation of overall total quality management (TQM) programmes. In the area of fuel quality control, statistical methods are now widely implemented, replacing 100% inspection. The IAEA, recognizing the importance of obtaining and maintaining high standards in fuel fabrication, has paid particular attention to this subject. In response to the rapid progress in development and implementation of advanced methods of process/quality control in nuclear fuel manufacture and on the recommendation of the International Working Group on Water Reactor Fuel Performance and Technology, the IAEA conducted a

  13. Advanced methods of process/quality control in nuclear reactor fuel manufacture. Proceedings of a technical committee meeting

    International Nuclear Information System (INIS)

    2000-07-01

    Nuclear fuel plays an essential role in ensuring the competitiveness of nuclear energy and its acceptance by the public. The economic and market situation is not favorable at present for nuclear fuel designers and suppliers. The reduction in fuel prices (mainly to compete with fossil fuels) and in the number of fuel assemblies to be delivered to customers (mainly due to burnup increase) has been offset by the rising number of safety and other requirements, e.g. the choice of fuel and structural materials and the qualification of equipment. In this respect, higher burnup and thermal rates, longer fuel cycles and the use of MOX fuels are the real means to improve the economics of the nuclear fuel cycle as a whole. Therefore, utilities and fuel vendors have recently initiated new research and development programmes aimed at improving fuel quality, design and materials to produce robust and reliable fuel for safe and reliable reactor operation more demanding conditions. In this connection, improvement of fuel quality occupies an important place and this requires continuous effort on the part of fuel researchers, designers and producers. In the early years of commercial fuel fabrication, emphasis was given to advancements in quality control/quality assurance related mainly to the product itself. Now, the emphasis is transferred to improvements in process control and to implementation of overall total quality management (TQM) programmes. In the area of fuel quality control, statistical methods are now widely implemented, replacing 100% inspection. The IAEA, recognizing the importance of obtaining and maintaining high standards in fuel fabrication, has paid particular attention to this subject. In response to the rapid progress in development and implementation of advanced methods of process/quality control in nuclear fuel manufacture and on the recommendation of the International Working Group on Water Reactor Fuel Performance and Technology, the IAEA conducted a

  14. High brightness semiconductor lasers with reduced filamentation

    DEFF Research Database (Denmark)

    McInerney, John; O'Brien, Peter.; Skovgaard, Peter M. W.

    1999-01-01

    High brightness semiconductor lasers have applications in spectroscopy, fiber lasers, manufacturing and materials processing, medicine and free space communication or energy transfer. The main difficulty associated with high brightness is that, because of COD, high power requires a large aperture...

  15. Revenue sharing in semiconductor industry supply chain ...

    Indian Academy of Sciences (India)

    to reduce demand opportunities, inventory needs and production efficiencies, in addition to reducing .... design based on coalition structures in semiconductor supply chain. ..... supplier/contract manufacturer for a product/component category.

  16. Advanced Battery Manufacturing (VA)

    Energy Technology Data Exchange (ETDEWEB)

    Stratton, Jeremy

    2012-09-30

    LiFeBATT has concentrated its recent testing and evaluation on the safety of its batteries. There appears to be a good margin of safety with respect to overheating of the cells and the cases being utilized for the batteries are specifically designed to dissipate any heat built up during charging. This aspect of LiFeBATT’s products will be even more fully investigated, and assuming ongoing positive results, it will become a major component of marketing efforts for the batteries. LiFeBATT has continued to receive prismatic 20 Amp hour cells from Taiwan. Further testing continues to indicate significant advantages over the previously available 15 Ah cells. Battery packs are being assembled with battery management systems in the Danville facility. Comprehensive tests are underway at Sandia National Laboratory to provide further documentation of the advantages of these 20 Ah cells. The company is pursuing its work with Hybrid Vehicles of Danville to critically evaluate the 20 Ah cells in a hybrid, armored vehicle being developed for military and security applications. Results have been even more encouraging than they were initially. LiFeBATT is expanding its work with several OEM customers to build a worldwide distribution network. These customers include a major automotive consulting group in the U.K., an Australian maker of luxury off-road campers, and a number of makers of E-bikes and scooters. LiFeBATT continues to explore the possibility of working with nations that are woefully short of infrastructure. Negotiations are underway with Siemens to jointly develop a system for using photovoltaic generation and battery storage to supply electricity to communities that are not currently served adequately. The IDA has continued to monitor the progress of LiFeBATT’s work to ensure that all funds are being expended wisely and that matching funds will be generated as promised. The company has also remained current on all obligations for repayment of an IDA loan and lease payments for space to the IDA. A commercial venture is being formed to utilize the LiFeBATT product for consumer use in enabling photovoltaic powered boat lifts. Field tests of the system have proven to be very effective and commercially promising. This venture is expected to result in significant sales within the next six months.

  17. Recent advances in photoelectrochemistry. Part 1. Preparation and photocatalytic activities of semiconductor microcrystals; Saikin no hikari denki kagaku. 1. Handotai chobiryushi no chosei to hikari shokubai kassei

    Energy Technology Data Exchange (ETDEWEB)

    Yoneyama, H; Torimoto, T [Osaka Univ., Osaka (Japan). Faculty of Engineering

    1995-01-05

    The energy structure of semiconductor microcrystals with less than 10nm particle size is different from that of bulk semiconductor, and the reducing force of electrons and the oxidizing force of holes produced by light in microcrystals are larger than those of bulk semiconductor. Focusing on the application of semiconductor microcrystals to photocatalysis, the effects of the particle size and surface conditions of particles on photocatalytic activity are discussed. It has been shown that the change in the characteristics of semiconductor microcrystals depends on particle size, and microcrystals with narrow distribution of particle sized is necessary for the study of the characteristics of semiconductor microcrystals. An example of high efficient progress of CO2 direct reduction by the use of semiconductor microcrystals is introduced. It has been made clear that the photocatalytic activity of semiconductor is improved when a small amount of electrode catalyst is supported in it. A unique photocatalytic reaction which can not be observed with bulk particles can be progressed by the use of high oxidation and reduction ability caused by quantum size effect of semiconductor microcrystals. 26 refs., 2 figs., 1 tab.

  18. Productivity improvement through industrial engineering in the semiconductor industry

    Science.gov (United States)

    Meyersdorf, Doron

    1996-09-01

    Industrial Engineering is fairly new to the semiconductor industry, though the awareness to its importance has increased in recent years. The US semiconductor industry in particular has come to the realization that in order to remain competitive in the global market it must take the lead not only in product development but also in manufacturing. Industrial engineering techniques offer one ofthe most effective strategies for achieving manufacturing excellence. Industrial engineers play an important role in the success of the manufacturing facility. This paper defines the Industrial engineers role in the IC facility, set the visions of excellence in semiconductor manufacturing and highlights 10 roadblocks on the journey towards manufacturing excellence.

  19. Solving the Big Data (BD) Problem in Advanced Manufacturing (Subcategory for work done at Georgia Tech. Study Process and Design Factors for Additive Manufacturing Improvement)

    Energy Technology Data Exchange (ETDEWEB)

    Clark, Brett W. [Sandia National Lab. (SNL-NM), Albuquerque, NM (United States); Diaz, Kimberly A. [Georgia Inst. of Technology, Atlanta, GA (United States); Ochiobi, Chinaza Darlene [Georgia Inst. of Technology, Atlanta, GA (United States); Paynabar, Kamran [Georgia Inst. of Technology, Atlanta, GA (United States)

    2015-09-01

    3D printing originally known as additive manufacturing is a process of making 3 dimensional solid objects from a CAD file. This ground breaking technology is widely used for industrial and biomedical purposes such as building objects, tools, body parts and cosmetics. An important benefit of 3D printing is the cost reduction and manufacturing flexibility; complex parts are built at the fraction of the price. However, layer by layer printing of complex shapes adds error due to the surface roughness. Any such error results in poor quality products with inaccurate dimensions. The main purpose of this research is to measure the amount of printing errors for parts with different geometric shapes and to analyze them for finding optimal printing settings to minimize the error. We use a Design of Experiments framework, and focus on studying parts with cone and ellipsoid shapes. We found that the orientation and the shape of geometric shapes have significant effect on the printing error. From our analysis, we also determined the optimal orientation that gives the least printing error.

  20. Semiconductor spintronics

    International Nuclear Information System (INIS)

    Fabian, J.; Abiague, A.M.; Ertler, Ch.; Stano, P.; Zutic, I.

    2007-01-01

    Spintronics refers commonly to phenomena in which the spin of electrons in a solid state environment plays the determining role. In a more narrow sense spintronics is an emerging research field of electronics: spintronics devices are based on a spin control of electronics, or on an electrical and optical control of spin of magnetism. While metal spintronics has already found its niche in the computer industry - giant magnetoresistance systems are used as hard disk read heads - semiconductor spintronics is vet demonstrate its full potential. This review presents selected themes of semiconductor spintronics, introducing important concepts in spin transport, spin transport, spin injection. Silsbee-Johnson spin-charge coupling, and spin-dependent tunneling, as well as spin relaxation and spin dynamics. The most fundamental spin-dependent interaction in nonmagnetic semiconductors is spin-orbit coupling. Depending on the crystal symmetries of the material, as well as on the structural properties of semiconductor based heterostructures, the spin-orbit coupling takes on different functional forms, giving a nice playground of effective spin-orbit Hamiltonians. The effective Hamiltonians for the most relevant classes of materials and heterostructures are derived here from realistic electronic band structure descriptions. Most semiconductor device systems are still theoretical concepts, waiting for experimental demonstrations. A review of selected proposed, and a few demonstrated devices is presented, with detailed description of two important classes: magnetic resonant tunnel structures and bipolar magnetic diodes and transistors. In view of the importance of ferromagnetic semiconductor material, a brief discussion of diluted magnetic semiconductors is included. In most cases the presentation is of tutorial style, introducing the essential theoretical formalism at an accessible level, with case-study-like illustrations of actual experimental results, as well as with brief

  1. Single frequency semiconductor lasers

    CERN Document Server

    Fang, Zujie; Chen, Gaoting; Qu, Ronghui

    2017-01-01

    This book systematically introduces the single frequency semiconductor laser, which is widely used in many vital advanced technologies, such as the laser cooling of atoms and atomic clock, high-precision measurements and spectroscopy, coherent optical communications, and advanced optical sensors. It presents both the fundamentals and characteristics of semiconductor lasers, including basic F-P structure and monolithic integrated structures; interprets laser noises and their measurements; and explains mechanisms and technologies relating to the main aspects of single frequency lasers, including external cavity lasers, frequency stabilization technologies, frequency sweeping, optical phase locked loops, and so on. It paints a clear, physical picture of related technologies and reviews new developments in the field as well. It will be a useful reference to graduate students, researchers, and engineers in the field.

  2. Composite Structures Manufacturing Facility

    Data.gov (United States)

    Federal Laboratory Consortium — The Composite Structures Manufacturing Facility specializes in the design, analysis, fabrication and testing of advanced composite structures and materials for both...

  3. 76 FR 59542 - Mandatory Reporting of Greenhouse Gases: Changes to Provisions for Electronics Manufacturing To...

    Science.gov (United States)

    2011-09-27

    ... Mandatory Reporting of Greenhouse Gases: Changes to Provisions for Electronics Manufacturing To Provide... regulation to amend the calculation and monitoring provisions in the Electronics Manufacturing portion of the... Electronics Manufacturing 334111 Microcomputer manufacturing facilities. 334413 Semiconductor, photovoltaic...

  4. Semiconductor Nanocrystals for Biological Imaging

    Energy Technology Data Exchange (ETDEWEB)

    Fu, Aihua; Gu, Weiwei; Larabell, Carolyn; Alivisatos, A. Paul

    2005-06-28

    Conventional organic fluorophores suffer from poor photo stability, narrow absorption spectra and broad emission feature. Semiconductor nanocrystals, on the other hand, are highly photo-stable with broad absorption spectra and narrow size-tunable emission spectra. Recent advances in the synthesis of these materials have resulted in bright, sensitive, extremely photo-stable and biocompatible semiconductor fluorophores. Commercial availability facilitates their application in a variety of unprecedented biological experiments, including multiplexed cellular imaging, long-term in vitro and in vivo labeling, deep tissue structure mapping and single particle investigation of dynamic cellular processes. Semiconductor nanocrystals are one of the first examples of nanotechnology enabling a new class of biomedical applications.

  5. Industrial science and technology research and development project of university cooperative type in fiscal 2000. Report on achievements in semiconductor device manufacturing processes using Cat-CVD method (Semiconductor device manufacturing processes using Cat-CVD method); 2000 nendo daigaku renkeigata sangyo kagaku gijutsu kenkyu kaihatsu project. Cat-CVD ho ni yoru handotai device seizo process seika hokokusho (Cat-CVD ho ni yoru handotai device seizo process)

    Energy Technology Data Exchange (ETDEWEB)

    NONE

    2001-03-01

    The catalytic chemical vapor deposition (Cat-CVD) method is a low-temperature thin film depositing technology that can achieve improvement in quality of semiconductor thin films and can perform inexpensive film deposition in a large area. The present project is composed of the basic research and development theme and the demonstrative research and development theme for the Cat-CVD method. This report summarizes the achievements in fiscal 2000 centering on the former theme. Discussions were given on the following five areas: 1) simulation on film thickness distribution in the Cat-CVD method, 2) life extension by preventing the catalyst converting into silicide and development of a catalyst integrated shear head, 3) vapor diagnosis in the film forming process by the Cat-CVD method using silane, hydrogen and ammonia, 4) a technology for high-speed deposition of hydrogenated amorphous silicon films for solar cells using the Cat-CVD method, and the low-temperature silicon oxide nitriding technology using heated catalysts, and 5) discussions on compatibility of transparent oxide electrode materials to the process of manufacturing thin-film silicon-based solar cells by using the Cat-CVD method. (NEDO)

  6. Semiconductor research with reactor neutrons

    International Nuclear Information System (INIS)

    Kimura, Itsuro

    1992-01-01

    Reactor neutrons play an important role for characterization of semiconductor materials as same as other advanced materials. On the other hand reactor neutrons bring about not only malignant irradiation effects called radiation damage, but also useful effects such as neutron transmutation doping and defect formation for opto-electronics. Research works on semiconductor materials with the reactor neutrons of the Kyoto University Reactor (KUR) are briefly reviewed. In this review, a stress is laid on the present author's works. (author)

  7. PowerGuard{reg_sign} Advanced Manufacturing; PVMaT Phase 1 Final Technical Report: June 1, 1998 to September 30, 1999

    Energy Technology Data Exchange (ETDEWEB)

    Marshall, M. C.; Dinwoodie, T. L.; O' Brian, C.; Botkin, J.; Ansley, J.

    2000-06-14

    During Phase 1 of PowerGuard{reg_sign} Advanced Manufacturing, PowerLight Corporation accomplished the following advancements: (1) Decreased system cost by 15%; (2) Increased PowerGuard tile production capacity from 5 MW/year to 8 MW/yr; (3) Established a manufacturing layout master plan for sequential integration of semi-automated and automated component workstations; (4) Defined semi-automation or automation of selected stages of the existing tile fabrication sequence, including PV module preparation, XPS processing, and coating; (5) Completed the advancement of several design improvements to the grid-tied inverter control board, including controller redesign, integrated data acquisition system (DAS), and communications for audit-worthy verification of PV system performance; (6) Conformed to NEPA, OSHA, and other federal and state regulations applicable to the proposed production process and mitigated potential for waste streams; (7) Initiated Underwriters Laboratories listings and international certifications on PowerGuard improvements; (8) Developed finance packages and integrated warranties; (9) Evaluated commercial demonstrations that incorporated the new design features and manufacturing process.

  8. Oxide semiconductors

    CERN Document Server

    Svensson, Bengt G; Jagadish, Chennupati

    2013-01-01

    Semiconductors and Semimetals has distinguished itself through the careful selection of well-known authors, editors, and contributors. Originally widely known as the ""Willardson and Beer"" Series, it has succeeded in publishing numerous landmark volumes and chapters. The series publishes timely, highly relevant volumes intended for long-term impact and reflecting the truly interdisciplinary nature of the field. The volumes in Semiconductors and Semimetals have been and will continue to be of great interest to physicists, chemists, materials scientists, and device engineers in academia, scient

  9. Semiconductor statistics

    CERN Document Server

    Blakemore, J S

    1962-01-01

    Semiconductor Statistics presents statistics aimed at complementing existing books on the relationships between carrier densities and transport effects. The book is divided into two parts. Part I provides introductory material on the electron theory of solids, and then discusses carrier statistics for semiconductors in thermal equilibrium. Of course a solid cannot be in true thermodynamic equilibrium if any electrical current is passed; but when currents are reasonably small the distribution function is but little perturbed, and the carrier distribution for such a """"quasi-equilibrium"""" co

  10. Preparation and analysis of amorphous carbon films deposited from (C{sub 6}H{sub 12})/Ar/He chemistry for application as the dry etch hard mask in the semiconductor manufacturing process

    Energy Technology Data Exchange (ETDEWEB)

    Lee, Seungmoo [Department of Materials Science and Engineering, Korea University, Seoul, 136-701 (Korea, Republic of); TC Technology Team, Samsung Electronics Co. Ltd., Gyeounggi-Do, 446-711 (Korea, Republic of); Won, Jaihyung; Choi, Jongsik [TC Technology Team, Samsung Electronics Co. Ltd., Gyeounggi-Do, 446-711 (Korea, Republic of); Jang, Samseok [Department of Materials Science and Engineering, Korea University, Seoul, 136-701 (Korea, Republic of); Jee, Yeonhong; Lee, Hyeondeok [TC Technology Team, Samsung Electronics Co. Ltd., Gyeounggi-Do, 446-711 (Korea, Republic of); Byun, Dongjin, E-mail: dbyun@korea.ac.kr [Department of Materials Science and Engineering, Korea University, Seoul, 136-701 (Korea, Republic of)

    2011-08-01

    Amorphous carbon layers (ACL) were deposited on Si (100) wafers by plasma enhanced chemical vapor deposition (PECVD) by using 1-hexene (C{sub 6}H{sub 12}) as a carbon source for dry etch hard mask of semiconductor devices manufacturing process. The deposition characteristics and film properties were investigated by means of ellipsometry, Raman spectroscopy, X-ray photo electron spectroscopy (XPS) and stress analysis. Hardness, Young's modulus, and surface roughness of ACL deposited at 550 deg. C were investigated by using nano-indentation and AFM. The deposition rate was decreased from 5050 A/min to 2160 A/min, and dry etch rate was decreased from 2090 A/min to 1770 A/min, and extinction coefficient was increased from 0.1 to 0.5. Raman analysis revealed a higher shift of the G-peak and a lower shift of the D-peak and the increase of I(D)/I(G) ratio as the deposition temperature was increased from 350 deg. C to 550 deg. C. XPS results of ACL deposited at 550 deg. C revealed a carbon 1s binding energy of 284.4 eV. The compressive film stress was decreased from 2.95 GPa to 1.28 GPa with increasing deposition temperature. The hardness and Young's modulus of ACL deposited at 550 deg. C were 5.8 GPa and 48.7 GPa respectively. The surface roughness RMS of ACL deposited at 550 deg. C was 2.24 A, and that after cleaning in diluted HF solution (H{sub 2}O:HF = 200:1), SC1 (NH{sub 4}OH:H{sub 2}O{sub 2}:H{sub 2}O = 1:4:20) solution, and sulfuric acid solution (H{sub 2}SO{sub 4}:H{sub 2}O{sub 2} = 6:1) was 2.28 A, 2.30 A and 7.34 A, respectively. The removal amount of ACL deposited at 550 deg. C in diluted HF solution, SC1 solution and sulfuric acid solution was 6 A, 36 A and 110 A, respectively. These results demonstrated the viability of ACL deposited by PECVD from C{sub 6}H{sub 12} at 550 deg. C for application as the dry etch hard mask in fabrication of semiconductor devices.

  11. Recent advances in the reconstruction of cranio-maxillofacial defects using computer-aided design/computer-aided manufacturing.

    Science.gov (United States)

    Oh, Ji-Hyeon

    2018-12-01

    With the development of computer-aided design/computer-aided manufacturing (CAD/CAM) technology, it has been possible to reconstruct the cranio-maxillofacial defect with more accurate preoperative planning, precise patient-specific implants (PSIs), and shorter operation times. The manufacturing processes include subtractive manufacturing and additive manufacturing and should be selected in consideration of the material type, available technology, post-processing, accuracy, lead time, properties, and surface quality. Materials such as titanium, polyethylene, polyetheretherketone (PEEK), hydroxyapatite (HA), poly-DL-lactic acid (PDLLA), polylactide-co-glycolide acid (PLGA), and calcium phosphate are used. Design methods for the reconstruction of cranio-maxillofacial defects include the use of a pre-operative model printed with pre-operative data, printing a cutting guide or template after virtual surgery, a model after virtual surgery printed with reconstructed data using a mirror image, and manufacturing PSIs by directly obtaining PSI data after reconstruction using a mirror image. By selecting the appropriate design method, manufacturing process, and implant material according to the case, it is possible to obtain a more accurate surgical procedure, reduced operation time, the prevention of various complications that can occur using the traditional method, and predictive results compared to the traditional method.

  12. Semiconductor Detectors

    International Nuclear Information System (INIS)

    Cortina, E.

    2007-01-01

    Particle detectors based on semiconductor materials are among the few devices used for particle detection that are available to the public at large. In fact we are surrounded by them in our daily lives: they are used in photoelectric cells for opening doors, in digital photographic and video camera, and in bar code readers at supermarket cash registers. (Author)

  13. Environmental and workplace contamination in the semiconductor industry: implications for future health of the workforce and community.

    Science.gov (United States)

    Edelman, P

    1990-01-01

    The semiconductor industry has been an enormous worldwide growth industry. At the heart of computer and other electronic technological advances, the environment in and around these manufacturing facilities has not been scrutinized to fully detail the health effects to the workers and the community from such exposures. Hazard identification in this industry leads to the conclusion that there are many sources of potential exposure to chemicals including arsenic, solvents, photoactive polymers and other materials. As the size of the semiconductor work force expands, the potential for adverse health effects, ranging from transient irritant symptoms to reproductive effects and cancer, must be determined and control measures instituted. Risk assessments need to be effected for areas where these facilities conduct manufacturing. The predominance of women in the manufacturing areas requires evaluating the exposures to reproductive hazards and outcomes. Arsenic exposures must also be evaluated and minimized, especially for maintenance workers; evaluation for lung and skin cancers is also appropriate. PMID:2401268

  14. A synopsis of the Defense Advanced Research Projects Agency (DARPA) investment in additive manufacture and what challenges remain

    Science.gov (United States)

    Maher, Michael; Smith, Adrien; Margiotta, Jesse

    2014-03-01

    DARPA's interest in additive manufacture dates back to the mid-80s with seedling programs that developed the foundational knowledge and equipment that led to the Solid Freeform Fabrication program in 1990. The drivers for this program included reducing development times by enabling "tool-less" manufacturing as well as integration of design and fabrication tools. DARPA consistently pushed the boundaries of additive manufacture with follow-on programs that expanded the material suite available for 3-D printing as well as new processes that expanded the technology's capability base. Programs such as the Mesoscopic Integrated Conformal Electronics (MICE) program incorporated functionality to the manufacturing processes through direct write of electronics. DARPA's investment in additive manufacture continues to this day but the focus has changed. DARPA's early investments were focused on developing and demonstrating the technology's capabilities. Now that the technology has been demonstrated, there is serious interest in taking advantage of the attributes unique to the processing methodology (such as customization and new design possibilities) for producing production parts. Accordingly, today's investment at DARPA addresses the systematic barriers to implementation rather than the technology itself. The Open Manufacturing program is enabling rapid qualification of new technologies for the manufacturing environment through the development of new modeling and informatics tools. While the technology is becoming more mainstream, there are plenty of challenges that need to be addressed. And as the technology continues to mature, the agency will continue to look for those "DARPA-hard" challenges that enable revolutionary changes in capability and performance for the Department of Defense.

  15. Neural manufacturing: a novel concept for processing modeling, monitoring, and control

    Science.gov (United States)

    Fu, Chi Y.; Petrich, Loren; Law, Benjamin

    1995-09-01

    Semiconductor fabrication lines have become extremely costly, and achieving a good return from such a high capital investment requires efficient utilization of these expensive facilities. It is highly desirable to shorten processing development time, increase fabrication yield, enhance flexibility, improve quality, and minimize downtime. We propose that these ends can be achieved by applying recent advances in the areas of artificial neural networks, fuzzy logic, machine learning, and genetic algorithms. We use the term neural manufacturing to describe such applications. This paper describes our use of artificial neural networks to improve the monitoring and control of semiconductor process.

  16. Organic semiconductors in sensor applications

    CERN Document Server

    Malliaras, George; Owens, Róisín

    2008-01-01

    Organic semiconductors offer unique characteristics such as tunability of electronic properties via chemical synthesis, compatibility with mechanically flexible substrates, low-cost manufacturing, and facile integration with chemical and biological functionalities. These characteristics have prompted the application of organic semiconductors and their devices in physical, chemical, and biological sensors. This book covers this rapidly emerging field by discussing both optical and electrical sensor concepts. Novel transducers based on organic light-emitting diodes and organic thin-film transistors, as well as systems-on-a-chip architectures are presented. Functionalization techniques to enhance specificity are outlined, and models for the sensor response are described.

  17. Benefits of Hot Isostatic Pressure/Powdered Metal (HIP/PM) and Additive Manufacturing (AM) To Fabricate Advanced Energy System Components

    Energy Technology Data Exchange (ETDEWEB)

    Horton, Nancy [Energy Industries of Ohio, Cleveland, OH (United States); Sheppard, Roy [Energy Industries of Ohio, Cleveland, OH (United States)

    2016-12-31

    Advanced Energy systems require large, complex components produced from materials capable of withstanding severe operating environments (high temperature, pressure, corrosivity). Such parts can be difficult to source, as conventional material processing technologies must be tailored to ensure a safe and cost effective approach to large-scale manufacture of quality structural advanced alloy components that meet the performance specifications of AE systems. (HIP/PM) has shown advantages over other manufacturing methods when working with these materials. For example, using HIP’ing in lieu of casting means significant savings in raw material costs, which for expensive, high-nickel alloys can be considerable for large-scale production. Use of HIP/PM also eliminates the difficulties resulting from reactivity of these materials in the molten state and facilitates manufacture of the large size requirements of the AE industry, producing a part that is defect and porosity free, thus further reducing or eliminating time and expense of post processing machining and weld repair. New advances in Additive Manufacturing (AM) techniques make it possible to further expand the benefits of HIP/PM in producing AE system components to create an even more robust manufacturing approach. Traditional techniques of welding and forming sheet metal to produce the HIP canisters can be time consuming and costly, with limitations on the complexity of part which can be achieved. A key benefit of AM is the freedom of design that it offers, so use of AM could overcome such challenges, ultimately enabling redesign of complete energy systems. A critical step toward this goal is material characterization of the required advanced alloys, for use in AM. Using Haynes 282, a high nickel alloy of interest to the Fossil Energy community, particularly for Advanced-UltraSuperCritical (AUSC) operating environments, as well as the crosscutting interests of the aerospace, defense and medical markets, this

  18. Implementation of an advanced hybrid MPC-PID control system using PAT tools into a direct compaction continuous pharmaceutical tablet manufacturing pilot plant.

    Science.gov (United States)

    Singh, Ravendra; Sahay, Abhishek; Karry, Krizia M; Muzzio, Fernando; Ierapetritou, Marianthi; Ramachandran, Rohit

    2014-10-01

    It is desirable for a pharmaceutical final dosage form to be manufactured through a quality by design (QbD)-based approach rather than a quality by testing (QbT) approach. An automatic feedback control system coupled with PAT tools that is part of the QbD paradigm shift, has the potential to ensure that the pre-defined end product quality attributes are met in a time and cost efficient manner. In this work, an advanced hybrid MPC-PID control architecture coupled with real time inline/online monitoring tools and principal components analysis (PCA) based additional supervisory control layer has been proposed for a continuous direct compaction tablet manufacturing process. The advantages of both MPC and PID have been utilized in a hybrid scheme. The control hardware and software integration and implementation of the control system has been demonstrated using feeders and blending unit operation of a continuous tablet manufacturing pilot plant and an NIR based PAT tool. The advanced hybrid MPC-PID control scheme leads to enhanced control loop performance of the critical quality attributes in comparison to a regulatory (e.g. PID) control scheme indicating its potential to improve pharmaceutical product quality. Copyright © 2014 Elsevier B.V. All rights reserved.

  19. Advanced Manufacturing and Sustainable Urban Development%先进制造与可持续城市发展

    Institute of Scientific and Technical Information of China (English)

    Otthein HERZOG; Bernhard MUELLER; WU Zhiqiang

    2016-01-01

    构的的途径。GIZ认为有4个多部门的优先点是相关的[2]:  大都市地区作为创新产业地区:“大都市为地方、国家和全球商业的商品和信息的交流提供了场所。他们吸引知识型公司,并推进和落实可促进可持续经济活动的新想法。但是,为了实现这一点,必须要建立适当的框架”[2]。  大都市地区作为包容的劳动力市场和住宅中心:“大都市地区以其经济增长可创造广泛的服务类工作岗位,贫困人群也可从中受益[2]。”  大都市地区作为“密集纽带”网络:大都市地区把大量的人口、生产和消费集中在一个区域,它要消耗巨量的能源和自然资源。但是由于大都市地区存在着紧密交织的地理连接和部门连接,还是有很好的机会以提高其物质和能量循环的效率的”[2]。  大都市地区作为治理体系:“城市群需要新的治理结构以组织和控制它们所面临的多部门的挑战……”[2]  上述的3个途径:高质量增长、绿色城市经济和可持续城市发展,有不少相互重合和联系之处。高质量增长关注总体上的经济发展,而绿色城市经济和大都市地区可持续发展的概念把增长质量转化到城市发展的语境中。因此,我们取增长质量这个方法来作为分析的基础。%AbSTRAcT Industry 4.0 [17, 18, 28], the Industrial Internet[15, 16], and Made in China 2025[3] are three topics of high economic relevance that touch on the future of current international value networks. The three approaches to Advanced Manufacturing aim at a forthcoming “fourth industrial revolution,” which is based on the progressing digitalization process across al industries and services (cf. e.g., Ref.[4]). These long-term plans and strategies are based on technologies that are available today, namely Cyber-Physical Systems, the Internet of Things, distributed software services, and Cloud Computing. They are

  20. Basic semiconductor physics

    CERN Document Server

    Hamaguchi, Chihiro

    2017-01-01

    This book presents a detailed description of basic semiconductor physics. The text covers a wide range of important phenomena in semiconductors, from the simple to the advanced. Four different methods of energy band calculations in the full band region are explained: local empirical pseudopotential, non-local pseudopotential, KP perturbation and tight-binding methods. The effective mass approximation and electron motion in a periodic potential, Boltzmann transport equation and deformation potentials used for analysis of transport properties are discussed. Further, the book examines experiments and theoretical analyses of cyclotron resonance in detail. Optical and transport properties, magneto-transport, two-dimensional electron gas transport (HEMT and MOSFET) and quantum transport are reviewed, while optical transition, electron-phonon interaction and electron mobility are also addressed. Energy and electronic structure of a quantum dot (artificial atom) are explained with the help of Slater determinants. The...

  1. Semiconductor sensors

    International Nuclear Information System (INIS)

    Hartmann, Frank

    2011-01-01

    Semiconductor sensors have been around since the 1950s and today, every high energy physics experiment has one in its repertoire. In Lepton as well as Hadron colliders, silicon vertex and tracking detectors led to the most amazing physics and will continue doing so in the future. This contribution tries to depict the history of these devices exemplarily without being able to honor all important developments and installations. The current understanding of radiation damage mechanisms and recent R and D topics demonstrating the future challenges and possible technical solutions for the SLHC detectors are presented. Consequently semiconductor sensor candidates for an LHC upgrade and a future linear collider are also briefly introduced. The work presented here is a collage of the work of many individual silicon experts spread over several collaborations across the world.

  2. Semiconductor Optics

    CERN Document Server

    Klingshirn, Claus F

    2012-01-01

    This updated and enlarged new edition of Semiconductor Optics provides an introduction to and an overview of semiconductor optics from the IR through the visible to the UV, including linear and nonlinear optical properties, dynamics, magneto and electrooptics, high-excitation effects and laser processes, some applications, experimental techniques and group theory. The mathematics is kept as elementary as possible, sufficient for an intuitive understanding of the experimental results and techniques treated. The subjects covered extend from physics to materials science and optoelectronics. Significantly updated chapters add coverage of current topics such as electron hole plasma, Bose condensation of excitons and meta materials. Over 120 problems, chapter introductions and a detailed index make it the key textbook for graduate students in physics. The mathematics is kept as elementary as possible, sufficient for an intuitive understanding of the experimental results and techniques treated. The subjects covered ...

  3. Semiconductor annealing

    International Nuclear Information System (INIS)

    Young, J.M.; Scovell, P.D.

    1982-01-01

    A process for annealing crystal damage in ion implanted semiconductor devices in which the device is rapidly heated to a temperature between 450 and 900 0 C and allowed to cool. It has been found that such heating of the device to these relatively low temperatures results in rapid annealing. In one application the device may be heated on a graphite element mounted between electrodes in an inert atmosphere in a chamber. (author)

  4. Advances in second generation high temperature superconducting wire manufacturing and R and D at American Superconductor Corporation

    Energy Technology Data Exchange (ETDEWEB)

    Rupich, Martin W; Li Xiaoping; Thieme, Cees; Sathyamurthy, Srivatsan; Fleshler, Steven; Tucker, David; Thompson, Elliot; Schreiber, Jeff; Lynch, Joseph; Buczek, David; DeMoranville, Ken; Inch, James; Cedrone, Paul; Slack, James, E-mail: mrupich@amsc.co [American Superconductor Corporation, 64 Jackson Road, Devens, MA 01434-4020 (United States)

    2010-01-15

    The RABiTS(TM)/MOD-YBCO (rolling assisted biaxially textured substrate/metal-organic deposition of YBa{sub 2}Cu{sub 3}O{sub 7-{delta}}) route has been established as a low-cost manufacturing process for producing high performance second generation (2G) wire. American Superconductor Corporation (AMSC) has used this approach to establish a production scale manufacturing line based on a wide-web manufacturing process. This initial production line is currently capable of producing 2G wire in lengths to 500 m with critical currents exceeding 250 A cm{sub width}{sup -1} at 77 K, in the self-field. The wide-web process, combined with slitting and lamination processes, allows customization of the 2G wire width and stabilizer composition to meet application specific wire requirements. The production line is currently supplying 2G wire for multiple cable, fault current limiter and coil applications. Ongoing R and D is focused on the development of thicker YBCO layers and improved flux pinning centers. This paper reviews the history of 2G wire development at AMSC, summarizes the current capability of the 2G wire manufacturing at AMSC, and describes future R and D improvements.

  5. Antimicrobial resistance and the environment: Assessment of advances, gaps and recommendations for agriculture, aquaculture and pharmaceutical manufacturing.

    Science.gov (United States)

    A roundtable discussion held at the 4th International Symposium on the Environmental Dimension of Antibiotic Resistance (EDAR4) considered key issues concerning the impact on the environment of antibiotic use in agriculture and aquaculture, and emissions from antibiotic manufacturing. The critical ...

  6. Where the chips fall: environmental health in the semiconductor industry.

    Science.gov (United States)

    Chepesiuk, R

    1999-09-01

    Three recent lawsuits are focusing public attention on the environmental and occupational health effects of the world's largest and fastest growing manufacturing sector-the $150 billion semiconductor industry. The suits allege that exposure to toxic chemicals in semiconductor manufacturing plants led to adverse health effects such as miscarriage and cancer among workers. To manufacture computer components, the semiconductor industry uses large amounts of hazardous chemicals including hydrochloric acid, toxic metals and gases, and volatile solvents. Little is known about the long-term health consequences of exposure to chemicals by semiconductor workers. According to industry critics, the semiconductor industry also adversely impacts the environment, causing groundwater and air pollution and generating toxic waste as a by-product of the semiconductor manufacturing process. In contrast, the U.S. Bureau of Statistics shows the semiconductor industry as having a worker illness rate of about one-third of the average of all manufacturers, and advocates defend the industry, pointing to recent research collaborations and product replacement as proof that semiconductor manufacturers adequately protect both their employees and the environment.

  7. Water soluble nano-scale transient material germanium oxide for zero toxic waste based environmentally benign nano-manufacturing

    KAUST Repository

    Almuslem, A. S.; Hanna, Amir; Yapici, Tahir; Wehbe, N.; Diallo, Elhadj; Kutbee, Arwa T.; Bahabry, Rabab R.; Hussain, Muhammad Mustafa

    2017-01-01

    , in addition to transiency, we also show an environmentally friendly manufacturing process for a complementary metal oxide semiconductor (CMOS) technology. Every year, trillions of complementary metal oxide semiconductor (CMOS) electronics are manufactured

  8. Incorporating DSA in multipatterning semiconductor manufacturing technologies

    Science.gov (United States)

    Badr, Yasmine; Torres, J. A.; Ma, Yuansheng; Mitra, Joydeep; Gupta, Puneet

    2015-03-01

    Multi-patterning (MP) is the process of record for many sub-10nm process technologies. The drive to higher densities has required the use of double and triple patterning for several layers; but this increases the cost of the new processes especially for low volume products in which the mask set is a large percentage of the total cost. For that reason there has been a strong incentive to develop technologies like Directed Self Assembly (DSA), EUV or E-beam direct write to reduce the total number of masks needed in a new technology node. Because of the nature of the technology, DSA cylinder graphoepitaxy only allows single-size holes in a single patterning approach. However, by integrating DSA and MP into a hybrid DSA-MP process, it is possible to come up with decomposition approaches that increase the design flexibility, allowing different size holes or bar structures by independently changing the process for every patterning step. A simple approach to integrate multi-patterning with DSA is to perform DSA grouping and MP decomposition in sequence whether it is: grouping-then-decomposition or decomposition-then-grouping; and each of the two sequences has its pros and cons. However, this paper describes why these intuitive approaches do not produce results of acceptable quality from the point of view of design compliance and we highlight the need for custom DSA-aware MP algorithms.

  9. A study on adapting advanced traceability system between feed manufacturer and salmon farmer in a farmed salmon supply chain

    OpenAIRE

    Zhang, Yating; Kim, YunJin

    2015-01-01

    Adopting an advanced traceability system in a supply chain is crucial to solve food safety issue. It is certainly important for firms to improve their traceability to deal with potential recalls but it is up to the firms’ choice 'How much traceability' they want and on 'What level of granularity'. The purpose of this thesis is to investigate how different actors in a real farmed salmon supply chain perceive benefits of implementing the advanced trac...

  10. An Exploratory Analysis for the Selection and Implementation of Advanced Manufacturing Technology by Fuzzy Multi-criteria Decision Making Methods: A Comparative Study

    Science.gov (United States)

    Nath, Surajit; Sarkar, Bijan

    2017-08-01

    Advanced Manufacturing Technologies (AMTs) offer opportunities for the manufacturing organizations to excel their competitiveness and in turn their effectiveness in manufacturing. Proper selection and evaluation of AMTs is the most significant task in today's modern world. But this involves a lot of uncertainty and vagueness as it requires many conflicting criteria to deal with. So the task of selection and evaluation of AMTs becomes very tedious for the evaluators as they are not able to provide crisp data for the criteria. Different Fuzzy Multi-criteria Decision Making (MCDM) methods help greatly in dealing with this problem. This paper focuses on the application of two very much potential Fuzzy MCDM methods namely COPRAS-G, EVAMIX and a comparative study between them on some rarely mentioned criteria. Each of the two methods is very powerful evaluation tool and has beauty in its own. Although, performance wise these two methods are almost at same level, but, the approach of each one of them are quite unique. This uniqueness is revealed by introducing a numerical example of selection of AMT.

  11. Semiconductor annealing

    International Nuclear Information System (INIS)

    Young, J.M.; Scovell, P.D.

    1981-01-01

    A process for annealing crystal damage in ion implanted semiconductor devices is described in which the device is rapidly heated to a temperature between 450 and 600 0 C and allowed to cool. It has been found that such heating of the device to these relatively low temperatures results in rapid annealing. In one application the device may be heated on a graphite element mounted between electrodes in an inert atmosphere in a chamber. The process may be enhanced by the application of optical radiation from a Xenon lamp. (author)

  12. Green Manufacturing Fundamentals and Applications

    CERN Document Server

    2013-01-01

    Green Manufacturing: Fundamentals and Applications introduces the basic definitions and issues surrounding green manufacturing at the process, machine and system (including supply chain) levels. It also shows, by way of several examples from different industry sectors, the potential for substantial improvement and the paths to achieve the improvement. Additionally, this book discusses regulatory and government motivations for green manufacturing and outlines the path for making manufacturing more green as well as making production more sustainable. This book also: • Discusses new engineering approaches for manufacturing and provides a path from traditional manufacturing to green manufacturing • Addresses regulatory and economic issues surrounding green manufacturing • Details new supply chains that need to be in place before going green • Includes state-of-the-art case studies in the areas of automotive, semiconductor and medical areas as well as in the supply chain and packaging areas Green Manufactu...

  13. Semiconductor Ion Implanters

    International Nuclear Information System (INIS)

    MacKinnon, Barry A.; Ruffell, John P.

    2011-01-01

    In 1953 the Raytheon CK722 transistor was priced at $7.60. Based upon this, an Intel Xeon Quad Core processor containing 820,000,000 transistors should list at $6.2 billion! Particle accelerator technology plays an important part in the remarkable story of why that Intel product can be purchased today for a few hundred dollars. Most people of the mid twentieth century would be astonished at the ubiquity of semiconductors in the products we now buy and use every day. Though relatively expensive in the nineteen fifties they now exist in a wide range of items from high-end multicore microprocessors like the Intel product to disposable items containing 'only' hundreds or thousands like RFID chips and talking greeting cards. This historical development has been fueled by continuous advancement of the several individual technologies involved in the production of semiconductor devices including Ion Implantation and the charged particle beamlines at the heart of implant machines. In the course of its 40 year development, the worldwide implanter industry has reached annual sales levels around $2B, installed thousands of dedicated machines and directly employs thousands of workers. It represents in all these measures, as much and possibly more than any other industrial application of particle accelerator technology. This presentation discusses the history of implanter development. It touches on some of the people involved and on some of the developmental changes and challenges imposed as the requirements of the semiconductor industry evolved.

  14. The Physics of Semiconductors

    Science.gov (United States)

    Brennan, Kevin F.

    1999-02-01

    Modern fabrication techniques have made it possible to produce semiconductor devices whose dimensions are so small that quantum mechanical effects dominate their behavior. This book describes the key elements of quantum mechanics, statistical mechanics, and solid-state physics that are necessary in understanding these modern semiconductor devices. The author begins with a review of elementary quantum mechanics, and then describes more advanced topics, such as multiple quantum wells. He then disusses equilibrium and nonequilibrium statistical mechanics. Following this introduction, he provides a thorough treatment of solid-state physics, covering electron motion in periodic potentials, electron-phonon interaction, and recombination processes. The final four chapters deal exclusively with real devices, such as semiconductor lasers, photodiodes, flat panel displays, and MOSFETs. The book contains many homework exercises and is suitable as a textbook for electrical engineering, materials science, or physics students taking courses in solid-state device physics. It will also be a valuable reference for practicing engineers in optoelectronics and related areas.

  15. Ion implantation for semiconductors

    International Nuclear Information System (INIS)

    Grey-Morgan, T.

    1995-01-01

    Full text: Over the past two decades, thousands of particle accelerators have been used to implant foreign atoms like boron, phosphorus and arsenic into silicon crystal wafers to produce special embedded layers for manufacturing semiconductor devices. Depending on the device required, the atomic species, the depth of implant and doping levels are the main parameters for the implantation process; the selection and parameter control is totally automated. The depth of the implant, usually less than 1 micron, is determined by the ion energy, which can be varied between 2 and 600 keV. The ion beam is extracted from a Freeman or Bernas type ion source and accelerated to 60 keV before mass analysis. For higher beam energies postacceleration is applied up to 200 keV and even higher energies can be achieved by mass selecting multiplycharged ions, but with a corresponding reduction in beam output. Depending on the device to be manufactured, doping levels can range from 10 10 to 10 15 atoms/cm 2 and are controlled by implanter beam currents in the range up to 30mA; continuous process monitoring ensures uniformity across the wafer of better than 1 % . As semiconductor devices get smaller, additional sophistication is required in the design of the implanter. The silicon wafers charge electrically during implantation and this charge must be dissipated continuously to reduce the electrical stress in the device and avoid destructive electrical breakdown. Electron flood guns produce low energy electrons (below 10 electronvolts) to neutralize positive charge buildup and implanter design must ensure minimum contamination by other isotopic species and ensure low internal sputter rates. The pace of technology in the semiconductor industry is such that implanters are being built now for 256 Megabit circuits but which are only likely to be widely available five years from now. Several specialist companies manufacture implanter systems, each costing around US$5 million, depending on the

  16. Magnetic semiconductors

    Energy Technology Data Exchange (ETDEWEB)

    Bihler, Christoph

    2009-04-15

    In this thesis we investigated in detail the properties of Ga{sub 1-x}Mn{sub x}As, Ga{sub 1-x}Mn{sub x}P, and Ga{sub 1-x}Mn{sub x}N dilute magnetic semiconductor thin films with a focus on the magnetic anisotropy and the changes of their properties upon hydrogenation. We applied two complementary spectroscopic techniques to address the position of H in magnetic semiconductors: (i) Electron paramagnetic resonance, which provides direct information on the symmetry of the crystal field of the Mn{sup 2+} atoms and (ii) x-ray absorption fine structure analysis which allows to probe the local crystallographic neighborhood of the absorbing Mn atom via analysing the fine structure at the Mn K absorption edge. Finally, we discussed the obstacles that have to be overcome to achieve Curie temperatures above the current maximum in Ga{sub 1-x}Mn{sub x}As of 185 K. Here, we outlined in detail the generic problem of the formation of precipitates at the example of Ge:MN. (orig.)

  17. Device Physics of Narrow Gap Semiconductors

    CERN Document Server

    Chu, Junhao

    2010-01-01

    Narrow gap semiconductors obey the general rules of semiconductor science, but often exhibit extreme features of these rules because of the same properties that produce their narrow gaps. Consequently these materials provide sensitive tests of theory, and the opportunity for the design of innovative devices. Narrow gap semiconductors are the most important materials for the preparation of advanced modern infrared systems. Device Physics of Narrow Gap Semiconductors offers descriptions of the materials science and device physics of these unique materials. Topics covered include impurities and defects, recombination mechanisms, surface and interface properties, and the properties of low dimensional systems for infrared applications. This book will help readers to understand not only the semiconductor physics and materials science, but also how they relate to advanced opto-electronic devices. The last chapter applies the understanding of device physics to photoconductive detectors, photovoltaic infrared detector...

  18. Unified Controller Design for Intelligent Manufacturing Automation

    National Research Council Canada - National Science Library

    Kosut, Robert

    1997-01-01

    .... The demonstration system selected was rapid thermal processing (RTP) of semiconductor wafers. This novel approach in integrated circuit manufacturing demands fast tracking control laws that achieve near uniform spatial temperature distributions...

  19. Semiconductor Laser Measurements Laboratory

    Data.gov (United States)

    Federal Laboratory Consortium — The Semiconductor Laser Measurements Laboratory is equipped to investigate and characterize the lasing properties of semiconductor diode lasers. Lasing features such...

  20. Past and Present of the Chinese and Korean Trainees and Survival of a Small Manufacturing Industry

    Science.gov (United States)

    Nishihata, Mikio

    In 1973, the author established the Nippon Bell Parts Co., Ltd. in Funabashi-city under his estimation of the advances in communication, information, semiconductor and automotive industries, then he has focused on R&D and developed the manufacturing of precise parts. During the past 30 years, he has himself experienced the importance of the mutual exchange between Japan and China and Korea, for keeping the human capability as well as for the management and the technical development to avoid a bankruptcy. The author is intentionally acting for the education of craftsmen in small and medium-sized manufacturing industries.

  1. Offshoring in the Semiconductor Industry: Historical Perspectives

    OpenAIRE

    Brown, Clair; Linden, Greg

    2005-01-01

    Semiconductor design is a frequently-cited example of the new wave of offshoring and foreign-outsourcing of service sector jobs. It is certainly a concern to U.S. design engineers themselves. In addition to the current wave of white-collar outsourcing, the industry also has a rich experience with offshoring of manufacturing activity. Semiconductor companies were among the first to invest in offshore facilities to manufacture goods for imports back to the U.S. A brief review of these earlie...

  2. Ensuring Biologics Advanced Development and Manufacturing Capability for the United States Government: A Summary of Key Findings and Conclusions

    Science.gov (United States)

    2009-10-06

    CRISP Computer Retrieval Information on Scientific Projects DARPA Defense Advanced Research Projects Agency DCA Demand Capacity Assessment DHS...2007. 8. BARDA, HHS. Personal interview. 20 September 2007. 9. Bravata DM . Reducing mortality from anthrax bioterrorism: strategies for stockpiling...Projects ( CRISP ). Novel smallpox vaccine derived from VV/VAR Immunome. EPIVAX, INC. 17. Congressional Research Services (CRS) RL32917: Bioterrorism

  3. Fabrication of Microcomponents by Electrochemical Manufacturing: Advanced Feed-Through Metallisation on Silicon and Nickel Micromechanical Resonators

    DEFF Research Database (Denmark)

    Tang, Peter Torben; Heschel, Matthias; Ravnkilde, Jan Tue

    2000-01-01

    Electrochemical processes such as electroplating, wet selective etching (or controlled corrosion) and electroless plating are powerful tools for fabrication of MEMS (Micro ElectroMechanical Systems) products. Especially when the electrochemical processes are used in combination with UV-lithograph......Electrochemical processes such as electroplating, wet selective etching (or controlled corrosion) and electroless plating are powerful tools for fabrication of MEMS (Micro ElectroMechanical Systems) products. Especially when the electrochemical processes are used in combination with UV......, as well as nickel/gold pads for conductive adhesive bonding, are also deposited by electroplating. The second example is a simple, inexpensive, low-temperature electroplating process for fabrication of released, stress-free nickel comb resonators. Since the manufacturing sequence only involves low...

  4. Manufacturing ontology through templates

    Directory of Open Access Journals (Sweden)

    Diciuc Vlad

    2017-01-01

    Full Text Available The manufacturing industry contains a high volume of knowhow and of high value, much of it being held by key persons in the company. The passing of this know-how is the basis of manufacturing ontology. Among other methods like advanced filtering and algorithm based decision making, one way of handling the manufacturing ontology is via templates. The current paper tackles this approach and highlights the advantages concluding with some recommendations.

  5. REDUCTION OF ARSENIC WASTES IN THE SEMICONDUCTOR INDUSTRY

    Science.gov (United States)

    The research described in this report was aimed at initiating and developing processes and process modifications that could be incorporated into semiconductor manufacturing operations to accomplish pollution prevention, especially to accomplish significant reduction in the quanti...

  6. Semiconductor laser shearing interferometer

    International Nuclear Information System (INIS)

    Ming Hai; Li Ming; Chen Nong; Xie Jiaping

    1988-03-01

    The application of semiconductor laser on grating shearing interferometry is studied experimentally in the present paper. The method measuring the coherence of semiconductor laser beam by ion etching double frequency grating is proposed. The experimental result of lens aberration with semiconductor laser shearing interferometer is given. Talbot shearing interferometry of semiconductor laser is also described. (author). 2 refs, 9 figs

  7. Dry etching technology for semiconductors

    CERN Document Server

    Nojiri, Kazuo

    2015-01-01

    This book is a must-have reference to dry etching technology for semiconductors, which will enable engineers to develop new etching processes for further miniaturization and integration of semiconductor integrated circuits.  The author describes the device manufacturing flow, and explains in which part of the flow dry etching is actually used. The content is designed as a practical guide for engineers working at chip makers, equipment suppliers and materials suppliers, and university students studying plasma, focusing on the topics they need most, such as detailed etching processes for each material (Si, SiO2, Metal etc) used in semiconductor devices, etching equipment used in manufacturing fabs, explanation of why a particular plasma source and gas chemistry are used for the etching of each material, and how to develop etching processes.  The latest, key technologies are also described, such as 3D IC Etching, Dual Damascene Etching, Low-k Etching, Hi-k/Metal Gate Etching, FinFET Etching, Double Patterning ...

  8. Recent advance in high manufacturing readiness level and high temperature CMOS mixed-signal integrated circuits on silicon carbide

    Science.gov (United States)

    Weng, M. H.; Clark, D. T.; Wright, S. N.; Gordon, D. L.; Duncan, M. A.; Kirkham, S. J.; Idris, M. I.; Chan, H. K.; Young, R. A. R.; Ramsay, E. P.; Wright, N. G.; Horsfall, A. B.

    2017-05-01

    A high manufacturing readiness level silicon carbide (SiC) CMOS technology is presented. The unique process flow enables the monolithic integration of pMOS and nMOS transistors with passive circuit elements capable of operation at temperatures of 300 °C and beyond. Critical to this functionality is the behaviour of the gate dielectric and data for high temperature capacitance-voltage measurements are reported for SiO2/4H-SiC (n and p type) MOS structures. In addition, a summary of the long term reliability for a range of structures including contact chains to both n-type and p-type SiC, as well as simple logic circuits is presented, showing function after 2000 h at 300 °C. Circuit data is also presented for the performance of digital logic devices, a 4 to 1 analogue multiplexer and a configurable timer operating over a wide temperature range. A high temperature micro-oven system has been utilised to enable the high temperature testing and stressing of units assembled in ceramic dual in line packages, including a high temperature small form-factor SiC based bridge leg power module prototype, operated for over 1000 h at 300 °C. The data presented show that SiC CMOS is a key enabling technology in high temperature integrated circuit design. In particular it provides the ability to realise sensor interface circuits capable of operating above 300 °C, accommodate shifts in key parameters enabling deployment in applications including automotive, aerospace and deep well drilling.

  9. 75 FR 24742 - In the Matter of Certain Large Scale Integrated Circuit Semiconductor Chips and Products...

    Science.gov (United States)

    2010-05-05

    ... Semiconductor, Xiqing Integrated Semiconductor, Manufacturing Site, No. 15 Xinghua Road, Xiqing Economic... Malaysia Sdn. Bhd., NO. 2 Jalan SS 8/2, Free Industrial Zone, Sungai Way, 47300 Petaling Jaya, Selengor, Malaysia. Freescale Semiconductor Pte. Ltd., 7 Changi South Street 2, 03-00, Singapore 486415. Freescale...

  10. Life-cycle assessment of semiconductors

    CERN Document Server

    Boyd, Sarah B

    2012-01-01

    Life-Cycle Assessment of Semiconductors presents the first and thus far only available transparent and complete life cycle assessment of semiconductor devices. A lack of reliable semiconductor LCA data has been a major challenge to evaluation of the potential environmental benefits of information technologies (IT). The analysis and results presented in this book will allow a higher degree of confidence and certainty in decisions concerning the use of IT in efforts to reduce climate change and other environmental effects. Coverage includes but is not limited to semiconductor manufacturing trends by product type and geography, unique coverage of life-cycle assessment, with a focus on uncertainty and sensitivity analysis of energy and global warming missions for CMOS logic devices, life cycle assessment of flash memory and life cycle assessment of DRAM. The information and conclusions discussed here will be highly relevant and useful to individuals and institutions. The book also: Provides a detailed, complete a...

  11. Semiconductors detectors: basics principals, fabrication and repair

    International Nuclear Information System (INIS)

    Souza Coelho, L.F. de.

    1982-05-01

    The fabrication and repairing techniques of semiconductor detectors, are described. These methods are shown in the way they are applied by the semiconductor detector laboratory of the KFA-Julich, where they have been developed during the last 15 years. The history of the semiconductor detectors is presented here, being also described the detector fabrication experiences inside Brazil. The key problems of manufacturing are raised. In order to understand the fabrication and repairing techniques the working principles of these detectors, are described. The cases in which worked during the stay in the KFA-Julich, particularly the fabrication of a plane Ge (Li) detector, with side entry, and the repair of a coaxial Ge (Li) is described. The vanguard problems being researched in Julich are also described. Finally it is discussed a timetable for the semiconductor detector laboratory of the UFRJ, which laboratory is in the mounting stage now. (Author) [pt

  12. Analysis and simulation of semiconductor devices

    CERN Document Server

    Selberherr, Siegfried

    1984-01-01

    The invention of semiconductor devices is a fairly recent one, considering classical time scales in human life. The bipolar transistor was announced in 1947, and the MOS transistor, in a practically usable manner, was demonstrated in 1960. From these beginnings the semiconductor device field has grown rapidly. The first integrated circuits, which contained just a few devices, became commercially available in the early 1960s. Immediately thereafter an evolution has taken place so that today, less than 25 years later, the manufacture of integrated circuits with over 400.000 devices per single chip is possible. Coincident with the growth in semiconductor device development, the literature concerning semiconductor device and technology issues has literally exploded. In the last decade about 50.000 papers have been published on these subjects. The advent of so called Very-Large-Scale-Integration (VLSI) has certainly revealed the need for a better understanding of basic device behavior. The miniaturization of the s...

  13. Semiconductor nanostructures

    Energy Technology Data Exchange (ETDEWEB)

    Marstein Erik Stensrud

    2003-07-01

    This thesis presents a study of two material systems containing semiconductor nanocrystals, namely porous silicon (PSi) films and germanium (Ge) nanocrystals embedded in silicon dioxide (SiO2) films. The PSi films were made by anodic etching of silicon (Si) substrates in an electrolyte containing hydrofluoric acid. The PSi films were doped with erbium (Er) using two different doping methods. electrochemical doping and doping by immersing the PSi films in a solution containing Er. The resulting Er concentration profiles were investigated using scanning electron microscopy (SEN1) combined with energy dispersive X-ray analysis (EDS). The main subject of the work on PSi presented in this thesis was investigating and comparing these two doping methods. Ge nanocrystals were made by implanting Ge ions into Si02 films that were subsequently annealed. However. nanocrystal formation occurred only for certain sets of processing parameters. The dependence of the microstructure of the Ge implanted Si02 films on the processing parameters were therefore investigated. A range of methods were employed for these investigations, including transmission electron microscopy (TEM) combined with EDS, X-ray photoelectron spectroscopy (XPS) and secondary ion mass spectroscopy (SIMS). The observed structures, ranging from Ge nanocrystals to voids with diameters of several tens of nanometers and Ge rich Si02 films without any nanocrystals is described. A model explaining the void formation is also presented. For certain sets of processing parameters. An accumulation of Ge at the Si-Si02 interface was observed. The effect of this accumulation on the electrical properties of MOS structures made from Ge implanted SiO2 films was investigated using CV-measurements. (Author)

  14. Metal oxide semiconductor thin-film transistors for flexible electronics

    Energy Technology Data Exchange (ETDEWEB)

    Petti, Luisa; Vogt, Christian; Büthe, Lars; Cantarella, Giuseppe; Tröster, Gerhard [Electronics Laboratory, Swiss Federal Institute of Technology, Zürich (Switzerland); Münzenrieder, Niko [Electronics Laboratory, Swiss Federal Institute of Technology, Zürich (Switzerland); Sensor Technology Research Centre, University of Sussex, Falmer (United Kingdom); Faber, Hendrik; Bottacchi, Francesca; Anthopoulos, Thomas D. [Department of Physics and Centre for Plastic Electronics, Imperial College London, London (United Kingdom)

    2016-06-15

    The field of flexible electronics has rapidly expanded over the last decades, pioneering novel applications, such as wearable and textile integrated devices, seamless and embedded patch-like systems, soft electronic skins, as well as imperceptible and transient implants. The possibility to revolutionize our daily life with such disruptive appliances has fueled the quest for electronic devices which yield good electrical and mechanical performance and are at the same time light-weight, transparent, conformable, stretchable, and even biodegradable. Flexible metal oxide semiconductor thin-film transistors (TFTs) can fulfill all these requirements and are therefore considered the most promising technology for tomorrow's electronics. This review reflects the establishment of flexible metal oxide semiconductor TFTs, from the development of single devices, large-area circuits, up to entirely integrated systems. First, an introduction on metal oxide semiconductor TFTs is given, where the history of the field is revisited, the TFT configurations and operating principles are presented, and the main issues and technological challenges faced in the area are analyzed. Then, the recent advances achieved for flexible n-type metal oxide semiconductor TFTs manufactured by physical vapor deposition methods and solution-processing techniques are summarized. In particular, the ability of flexible metal oxide semiconductor TFTs to combine low temperature fabrication, high carrier mobility, large frequency operation, extreme mechanical bendability, together with transparency, conformability, stretchability, and water dissolubility is shown. Afterward, a detailed analysis of the most promising metal oxide semiconducting materials developed to realize the state-of-the-art flexible p-type TFTs is given. Next, the recent progresses obtained for flexible metal oxide semiconductor-based electronic circuits, realized with both unipolar and complementary technology, are reported. In

  15. Use of radioactive tracers in the semiconductor industry

    International Nuclear Information System (INIS)

    Akerman, Karol

    1975-01-01

    Manufacture of the semiconductor materials comprises production and purification of the raw materials (GeC14 or SiHC13), purification of the elemental semiconductors by metallurgical methods (including zone melting), production and doping of single crystals, dividing the crystals into slices of suitable size, formation of p-n junctions and fabrication of the finished semiconductor devices. In the sequence of operations, the behavior of very small quantities of an element must be monitored, and radioactive tracers are often used to solve these problems. Examples are given of the use of radioactive tracers in the semiconductor industry

  16. Fundamentals of semiconductor devices

    CERN Document Server

    Lindmayer, Joseph

    1965-01-01

    Semiconductor properties ; semiconductor junctions or diodes ; transistor fundamentals ; inhomogeneous impurity distributions, drift or graded-base transistors ; high-frequency properties of transistors ; band structure of semiconductors ; high current densities and mechanisms of carrier transport ; transistor transient response and recombination processes ; surfaces, field-effect transistors, and composite junctions ; additional semiconductor characteristics ; additional semiconductor devices and microcircuits ; more metal, insulator, and semiconductor combinations for devices ; four-pole parameters and configuration rotation ; four-poles of combined networks and devices ; equivalent circuits ; the error function and its properties ; Fermi-Dirac statistics ; useful physical constants.

  17. Nitride semiconductor devices fundamentals and applications

    CERN Document Server

    Morkoç, Hadis

    2013-01-01

    This book gives a clear presentation of the necessary basics of semiconductor and device physics and engineering. It introduces readers to fundamental issues that will enable them to follow the latest technological research. It also covers important applications, including LED and lighting, semiconductor lasers, high power switching devices, and detectors. This balanced and up-to-date treatment makes the text an essential educational tool for both advanced students and professionals in the electronics industry.

  18. 3D Ceramic Microfluidic Device Manufacturing

    International Nuclear Information System (INIS)

    Natarajan, Govindarajan; Humenik, James N

    2006-01-01

    Today, semiconductor processing serves as the backbone for the bulk of micromachined devices. Precision lithography and etching technology used in the semiconductor industry are also leveraged by alternate techniques like electroforming and molding. The nature of such processing is complex, limited and expensive for any manufacturing foundry. This paper details the technology elements developed to manufacture cost effective and versatile microfluidic devices for applications ranging from medical diagnostics to characterization of bioassays. Two applications using multilayer ceramic technology to manufacture complex 3D microfluidic devices are discussed

  19. Measuring Manufacturing Innovativeness

    DEFF Research Database (Denmark)

    Blichfeldt, Henrik; Knudsen, Mette Præst

    2017-01-01

    Globalization and customization increases the pressure on manufacturing companies, and the ability to provide innovativeness is a potential source of competitive advantage. This paper positions the manufacturing entity in the innovation process, and investigates the relation between innovation vers...... technology and organizational concepts. Based on Danish survey data from the European Manufacturing Survey (EMS-2015) this paper finds that there is a relation between innovative companies, and their level of technology and use of organizational concepts. Technology and organizational concepts act...... as manufacturing levers to support the manufacturing and production system to provide innovativeness. The managerial implication lies in building manufacturing capabilities to support the innovative process, by standardization, optimization and creating stability in combination with automation and advanced...

  20. Electron beam writing on semiconductors

    International Nuclear Information System (INIS)

    Bierhenke, H.; Kutzer, E.; Pascher, A.; Plitzner, H.; Rummel, P.; Siemens A.G., Muenchen; Siemens A.G., Muenchen

    1979-08-01

    Reported are the results of the 3 1/2 year research project 'Electron beam Writing on Semiconductors'. Work has been done in the field of direct wafer exposure techniques, and of mask making. Described are resist technology, setting up of a research device, exploration of alignment procedures, manufacturing of devices and their radiation influence. Furthermore, investigations and measurements of an electron beam machine bought for mask making purposes, the development of LSI-circuits with this machine, the software necessary and important developments of digital subsystems are reported. (orig.) [de

  1. Social manufacturing

    OpenAIRE

    Hamalainen, Markko; Karjalainen, Jesse

    2017-01-01

    New business models harnessing the power of individuals have already revolutionized service industries and digital content production. In this study, we investigate whether a similar phenomenon is taking place in manufacturing industries. We start by conceptually defining two distinct forms of firm-individual collaboration in manufacturing industries: (1) social cloud manufacturing, in which firms outsource manufacturing to individuals, and (2) social platform manufacturing, in which firms pr...

  2. Solid spectroscopy: semiconductors

    International Nuclear Information System (INIS)

    Silva, C.E.T.G. da

    1983-01-01

    Photoemission as technique of study of the semiconductor electronic structure is shortly discussed. Homogeneous and heterogeneous semiconductors, where volume and surface electronic structure, core levels and O and H chemisorption in GaAs, Schottky barrier are treated, respectively. Amorphous semiconductors are also discussed. (L.C.) [pt

  3. ZnCdMgSe as a Materials Platform for Advanced Photonic Devices: Broadband Quantum Cascade Detectors and Green Semiconductor Disk Lasers

    Science.gov (United States)

    De Jesus, Joel

    The ZnCdMgSe family of II-VI materials has unique and promising characteristics that may be useful in practical applications. For example they can be grown lattice matched to InP substrates with lattice matched bandgaps that span from 2.1 to 3.5 eV, they can be successfully doped n-type, have a large conduction band offset (CBO) with no intervalley scattering present when strained, they have lower average phonon energies, and the InP lattice constant lies in the middle of the ZnSe and CdSe binaries compounds giving room to experiment with tensile and compressive stress. However they have not been studied in detail for use in practical devices. Here we have identified two types of devices that are being currently developed that benefit from the ZnCdMgSe-based material properties. These are the intersubband (ISB) quantum cascade (QC) detectors and optically pumped semiconductor lasers that emit in the visible range. The paucity for semiconductor lasers operating in the green-orange portion of the visible spectrum can be easily overcome with the ZnCdMgSe materials system developed in our research. The non-strain limited, large CBO available allows to expand the operating wavelength of ISB devices providing shorter and longer wavelengths than the currently commercially available devices. This property can also be exploited to develop broadband room temperature operation ISB detectors. The work presented here focused first on using the ZnCdMgSe-based material properties and parameter to understand and predict the interband and intersubband transitions of its heterostructures. We did this by studying an active region of a QC device by contactless electroreflectance, photoluminescence, FTIR transmittance and correlating the measurements to the quantum well structure by transfer matrix modeling. Then we worked on optimizing the ZnCdMgSe material heterostructures quality by studying the effects of growth interruptions on their optical and optoelectronic properties of

  4. Current Capabilities at SNL for the Integration of Small Modular Reactors onto Smart Microgrids Using Sandia's Smart Microgrid Technology High Performance Computing and Advanced Manufacturing.

    Energy Technology Data Exchange (ETDEWEB)

    Rodriguez, Salvador B. [Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)

    2017-05-01

    Smart grids are a crucial component for enabling the nation’s future energy needs, as part of a modernization effort led by the Department of Energy. Smart grids and smart microgrids are being considered in niche applications, and as part of a comprehensive energy strategy to help manage the nation’s growing energy demands, for critical infrastructures, military installations, small rural communities, and large populations with limited water supplies. As part of a far-reaching strategic initiative, Sandia National Laboratories (SNL) presents herein a unique, three-pronged approach to integrate small modular reactors (SMRs) into microgrids, with the goal of providing economically-competitive, reliable, and secure energy to meet the nation’s needs. SNL’s triad methodology involves an innovative blend of smart microgrid technology, high performance computing (HPC), and advanced manufacturing (AM). In this report, Sandia’s current capabilities in those areas are summarized, as well as paths forward that will enable DOE to achieve its energy goals. In the area of smart grid/microgrid technology, Sandia’s current computational capabilities can model the entire grid, including temporal aspects and cyber security issues. Our tools include system development, integration, testing and evaluation, monitoring, and sustainment.

  5. The potential of dielectric analysis as an on-line cure monitoring technique in the manufacture of advanced fibre reinforced composites

    International Nuclear Information System (INIS)

    McIlhagger, A.T.

    2002-02-01

    Composite manufacturing processes such as RTM, are being developed in the aerospace industry in order to promote and reduce the cost of advanced fibre reinforced composites. The aerospace industry has identified the need for a cure monitoring system to be utilised in this production, to improve the efficiency and reliability of processing. The system must be able to determine through-thickness properties of the composite, on-line and without affecting the integrity of the finished component. Literature has shown that a number of techniques are available but these do not address all of the requirements of industry. The most important process parameters in RTM are the resin flow, point of minimum viscosity, gelation and subsequent completion of cure. These 'key cure parameters' are often difficult to control accurately in the manufacturing environment. Although dielectric analysis has been around for many years, literature identified an urgent requirement for research on the interpretation of dielectric sensor data relating to these main process parameters. A dielectric laboratory instrument, operated in the parallel plate sensor configuration was utilised to simulate a standard RTM cure cycle. The important transitions in the resin, namely minimum viscosity, gelation, vitrification and completion of cure, were identified. The parallel plate dielectric technique was applied to composites containing conductive and non-conductive reinforcement fibres. The appropriate dielectric signals and frequency were determined based on the sensor configuration, insulating layer and resin/fabric type. Correlations have been demonstrated between dielectric results and other established thermal (DSC and. DMA) and mechanical test techniques (tensile, flexural and interlaminar shear). Test methods were designed and investigated to provide information to compare with dielectric data. The parallel plate configuration was used to investigate the effect of composite thickness variation on

  6. The Physics of Semiconductors An Introduction Including Devices and Nanophysics

    CERN Document Server

    Grundmann, Marius

    2006-01-01

    The Physics of Semiconductors provides material for a comprehensive upper-level-undergrauate and graduate course on the subject, guiding readers to the point where they can choose a special topic and begin supervised research. The textbook provides a balance between essential aspects of solid-state and semiconductor physics, on the one hand, and the principles of various semiconductor devices and their applications in electronic and photonic devices, on the other. It highlights many practical aspects of semiconductors such as alloys, strain, heterostructures, nanostructures, that are necessary in modern semiconductor research but typically omitted in textbooks. For the interested reader some additional advanced topics are included, such as Bragg mirrors, resonators, polarized and magnetic semiconductors are included. Also supplied are explicit formulas for many results, to support better understanding. The Physics of Semiconductors requires little or no prior knowledge of solid-state physics and evolved from ...

  7. Report on achievement in the preceding research related to global industry technologies for the global industry technology research and development project. Research on gas systems substituting global warming gases such as PFC used in manufacturing semiconductors; 1998 nendo chikyu kankyo sangyo gijutsu ni kakawaru sendo kenkyu. Handotai seizo nado ni shiyosuru PFC nado no chikyu ondanka gas no daitai gas system no kenkyu

    Energy Technology Data Exchange (ETDEWEB)

    NONE

    1999-03-01

    The present semiconductor manufacturing process uses a great amount of PFC having large global warming coefficients and extremely long atmospheric life. A research was made particularly on reduction of its emission from etching processes. After introducing how the semiconductor industry has been working conventionally on protection of the global environment, this paper makes clear the purpose and positioning of this preceding research, as well as how it is moved forward. The paper also reports the results of analyzing and discussing the exhaust gases from etching devices using several kinds of substitute PFC gases. Survey results are reported on the possibilities of new substitute gases, plasma decomposition and treatment of exhaust gases, reaction process simulation, and in-situ analyzing and evaluating technologies. Investigations were made on the possibility of using no PFC in wiring processes which consume greater amount of PFC, as well as on wiring techniques using inter-layer insulation film with low dielectric rate, a new wiring structure forming technology, new functional elements, circuits and systems in a wide range. Proposals were given on specific research and development themes and plans that begin in fiscal 1999. (NEDO)

  8. Microeconomics of advanced process window control for 50-nm gates

    Science.gov (United States)

    Monahan, Kevin M.; Chen, Xuemei; Falessi, Georges; Garvin, Craig; Hankinson, Matt; Lev, Amir; Levy, Ady; Slessor, Michael D.

    2002-07-01

    Fundamentally, advanced process control enables accelerated design-rule reduction, but simple microeconomic models that directly link the effects of advanced process control to profitability are rare or non-existent. In this work, we derive these links using a simplified model for the rate of profit generated by the semiconductor manufacturing process. We use it to explain why and how microprocessor manufacturers strive to avoid commoditization by producing only the number of dies required to satisfy the time-varying demand in each performance segment. This strategy is realized using the tactic known as speed binning, the deliberate creation of an unnatural distribution of microprocessor performance that varies according to market demand. We show that the ability of APC to achieve these economic objectives may be limited by variability in the larger manufacturing context, including measurement delays and process window variation.

  9. Integrated Manufacturing for Advanced MEAs

    Energy Technology Data Exchange (ETDEWEB)

    Emory S. De Castro; Yu-Min Tsou; Mark G. Roelofs; Olga Polevaya

    2007-03-30

    This program addressed a two-pronged goal for developing fuel cell components: lowering of precious metal content in membrane electrode assemblies (MEAs), thereby reducing the fuel cell cost, and creating MEAs that can operate at 120oC and 25% RH whereby the system efficiency and effectiveness is greatly improved. In completing this program, we have demonstrated a significant reduction in precious metal while at the same time increasing the power output (achieved 2005 goal of 0.6g/Kw). We have also identified a technology that allows for one step fabrication of MEAs and appears to be a feasible path toward achieving DOE’s 2010 targets for precious metal and power (approaches 0.2g/Kw). Our team partner Du Pont invented a new class of polymer electrolyte membrane that has sufficient stability and conductivity to demonstrate feasibility for operation at 120 oC and low relative humidity. Through the course of this project, the public has benefited greatly from numerous presentations and publications on the technical understanding necessary to achieve these goals.

  10. Overview of atomic layer etching in the semiconductor industry

    Energy Technology Data Exchange (ETDEWEB)

    Kanarik, Keren J., E-mail: keren.kanarik@lamresearch.com; Lill, Thorsten; Hudson, Eric A.; Sriraman, Saravanapriyan; Tan, Samantha; Marks, Jeffrey; Vahedi, Vahid; Gottscho, Richard A. [Lam Research Corporation, 4400 Cushing Parkway, Fremont, California 94538 (United States)

    2015-03-15

    Atomic layer etching (ALE) is a technique for removing thin layers of material using sequential reaction steps that are self-limiting. ALE has been studied in the laboratory for more than 25 years. Today, it is being driven by the semiconductor industry as an alternative to continuous etching and is viewed as an essential counterpart to atomic layer deposition. As we enter the era of atomic-scale dimensions, there is need to unify the ALE field through increased effectiveness of collaboration between academia and industry, and to help enable the transition from lab to fab. With this in mind, this article provides defining criteria for ALE, along with clarification of some of the terminology and assumptions of this field. To increase understanding of the process, the mechanistic understanding is described for the silicon ALE case study, including the advantages of plasma-assisted processing. A historical overview spanning more than 25 years is provided for silicon, as well as ALE studies on oxides, III–V compounds, and other materials. Together, these processes encompass a variety of implementations, all following the same ALE principles. While the focus is on directional etching, isotropic ALE is also included. As part of this review, the authors also address the role of power pulsing as a predecessor to ALE and examine the outlook of ALE in the manufacturing of advanced semiconductor devices.

  11. Overview of atomic layer etching in the semiconductor industry

    International Nuclear Information System (INIS)

    Kanarik, Keren J.; Lill, Thorsten; Hudson, Eric A.; Sriraman, Saravanapriyan; Tan, Samantha; Marks, Jeffrey; Vahedi, Vahid; Gottscho, Richard A.

    2015-01-01

    Atomic layer etching (ALE) is a technique for removing thin layers of material using sequential reaction steps that are self-limiting. ALE has been studied in the laboratory for more than 25 years. Today, it is being driven by the semiconductor industry as an alternative to continuous etching and is viewed as an essential counterpart to atomic layer deposition. As we enter the era of atomic-scale dimensions, there is need to unify the ALE field through increased effectiveness of collaboration between academia and industry, and to help enable the transition from lab to fab. With this in mind, this article provides defining criteria for ALE, along with clarification of some of the terminology and assumptions of this field. To increase understanding of the process, the mechanistic understanding is described for the silicon ALE case study, including the advantages of plasma-assisted processing. A historical overview spanning more than 25 years is provided for silicon, as well as ALE studies on oxides, III–V compounds, and other materials. Together, these processes encompass a variety of implementations, all following the same ALE principles. While the focus is on directional etching, isotropic ALE is also included. As part of this review, the authors also address the role of power pulsing as a predecessor to ALE and examine the outlook of ALE in the manufacturing of advanced semiconductor devices

  12. JIT Manufacturing: A Survey of Implementations in Small and Large U.S. Manufacturers

    OpenAIRE

    Richard E. White; John N. Pearson; Jeffrey R. Wilson

    1999-01-01

    Since the early 1980s, the diffusion of Just-In-Time (JIT) manufacturing from Japanese manufacturers to U.S. manufacturers has progressed at an accelerated rate. At this stage of the diffusion process, JIT implementations are more common and more advanced in large U.S. manufacturers than in small; consequently, U.S. businessmen's understanding of issues associated with JIT implementations in large manufacturers is more developed than that of small manufacturers. When small manufacturers repre...

  13. Advanced radiation detector development mercuric iodide, silicon with internal gain, hybrid scintillator/semiconductor detectors. Comprehensive summary report, 1976-1985

    International Nuclear Information System (INIS)

    Huth, G.C.; Dabrowski, A.J.

    1985-01-01

    Accomplishments are reported in the development of a compound semi-insulator mercuric iodide (HgI 2 ) for nuclear radiation detection and spectroscopy, early lung cancer detection and localization in the uranium miner/worker population, computer digital image processing and image reconstruction research, and a concept for multiple, filtered x-ray computed tomography scanning to reveal chemical compositional information. Another area of interest is the study of new advances in the area of silicon detectors with internal gain (''avalanche'')

  14. Compound Semiconductor Radiation Detector

    International Nuclear Information System (INIS)

    Kim, Y. K.; Park, S. H.; Lee, W. G.; Ha, J. H.

    2005-01-01

    In 1945, Van Heerden measured α, β and γ radiations with the cooled AgCl crystal. It was the first radiation measurement using the compound semiconductor detector. Since then the compound semiconductor has been extensively studied as radiation detector. Generally the radiation detector can be divided into the gas detector, the scintillator and the semiconductor detector. The semiconductor detector has good points comparing to other radiation detectors. Since the density of the semiconductor detector is higher than that of the gas detector, the semiconductor detector can be made with the compact size to measure the high energy radiation. In the scintillator, the radiation is measured with the two-step process. That is, the radiation is converted into the photons, which are changed into electrons by a photo-detector, inside the scintillator. However in the semiconductor radiation detector, the radiation is measured only with the one-step process. The electron-hole pairs are generated from the radiation interaction inside the semiconductor detector, and these electrons and charged ions are directly collected to get the signal. The energy resolution of the semiconductor detector is generally better than that of the scintillator. At present, the commonly used semiconductors as the radiation detector are Si and Ge. However, these semiconductor detectors have weak points. That is, one needs thick material to measure the high energy radiation because of the relatively low atomic number of the composite material. In Ge case, the dark current of the detector is large at room temperature because of the small band-gap energy. Recently the compound semiconductor detectors have been extensively studied to overcome these problems. In this paper, we will briefly summarize the recent research topics about the compound semiconductor detector. We will introduce the research activities of our group, too

  15. Developments in fuel manufacturing

    International Nuclear Information System (INIS)

    Williams, T.

    1997-01-01

    BNFL has a long tradition of willingness to embrace technological challenge and a dedication to quality. This paper describes advances in the overall manufacturing philosophy at BNFL's Fuel Business Group and then covers how some new technologies are currently being employed in BNFL Fuel Business Group's flagship oxide complex (OFC), which is currently in its final stages of commissioning. This plant represents a total investment of some Pound 200 million. This paper also describes how these technologies are also being deployed in BNFL's MOX plant now being built at Sellafield and, finally, covers some new processes being developed for advanced fuel manufacture. (author)

  16. Semiconductor apparatus and method of fabrication for a semiconductor apparatus

    NARCIS (Netherlands)

    2010-01-01

    The invention relates to a semiconductor apparatus (1) and a method of fabrication for a semiconductor apparatus (1), wherein the semiconductor apparatus (1) comprises a semiconductor layer (2) and a passivation layer (3), arranged on a surface of the semiconductor layer (2), for passivating the

  17. Review of the Semiconductor Industry and Technology Roadmap.

    Science.gov (United States)

    Kumar, Sameer; Krenner, Nicole

    2002-01-01

    Points out that the semiconductor industry is extremely competitive and requires ongoing technological advances to improve performance while reducing costs to remain competitive and how essential it is to gain an understanding of important facets of the industry. Provides an overview of the initial and current semiconductor technology roadmap that…

  18. Fabrication and application of amorphous semiconductor devices

    International Nuclear Information System (INIS)

    Kumurdjian, Pierre.

    1976-01-01

    This invention concerns the design and manufacture of elecric switching or memorisation components with amorphous semiconductors. As is known some compounds, particularly the chalcogenides, have a resistivity of the semiconductor type in the amorphous solid state. These materials are obtained by the high temperature homogeneisation of several single elements such as tellurium, arsenic, germanium and sulphur, followed by water or air quenching. In particular these compounds have useful switching and memorisation properties. In particular they have the characteristic of not suffering deterioration when placed in an environment subjected to nuclear radiations. In order to know more about the nature and properties of these amorphous semiconductors the French patent No. 71 28048 of 30 June 1971 may be consulted with advantage [fr

  19. Precision manufacturing

    CERN Document Server

    Dornfeld, David

    2008-01-01

    Today there is a high demand for high-precision products. The manufacturing processes are now highly sophisticated and derive from a specialized genre called precision engineering. Precision Manufacturing provides an introduction to precision engineering and manufacturing with an emphasis on the design and performance of precision machines and machine tools, metrology, tooling elements, machine structures, sources of error, precision machining processes and precision process planning. As well as discussing the critical role precision machine design for manufacturing has had in technological developments over the last few hundred years. In addition, the influence of sustainable manufacturing requirements in precision processes is introduced. Drawing upon years of practical experience and using numerous examples and illustrative applications, David Dornfeld and Dae-Eun Lee cover precision manufacturing as it applies to: The importance of measurement and metrology in the context of Precision Manufacturing. Th...

  20. Manufacturing Demonstration Facility: Roll-to-Roll Processing

    Energy Technology Data Exchange (ETDEWEB)

    Datskos, Panos G [ORNL; Joshi, Pooran C [ORNL; List III, Frederick Alyious [ORNL; Duty, Chad E [ORNL; Armstrong, Beth L [ORNL; Ivanov, Ilia N [ORNL; Jacobs, Christopher B [ORNL; Graham, David E [ORNL; Moon, Ji Won [ORNL

    2015-08-01

    This Manufacturing Demonstration Facility (MDF)e roll-to-roll processing effort described in this report provided an excellent opportunity to investigate a number of advanced manufacturing approaches to achieve a path for low cost devices and sensors. Critical to this effort is the ability to deposit thin films at low temperatures using nanomaterials derived from nanofermentation. The overarching goal of this project was to develop roll-to-roll manufacturing processes of thin film deposition on low-cost flexible substrates for electronics and sensor applications. This project utilized ORNL s unique Pulse Thermal Processing (PTP) technologies coupled with non-vacuum low temperature deposition techniques, ORNL s clean room facility, slot dye coating, drop casting, spin coating, screen printing and several other equipment including a Dimatix ink jet printer and a large-scale Kyocera ink jet printer. The roll-to-roll processing project had three main tasks: 1) develop and demonstrate zinc-Zn based opto-electronic sensors using low cost nanoparticulate structures manufactured in a related MDF Project using nanofermentation techniques, 2) evaluate the use of silver based conductive inks developed by project partner NovaCentrix for electronic device fabrication, and 3) demonstrate a suite of low cost printed sensors developed using non-vacuum deposition techniques which involved the integration of metal and semiconductor layers to establish a diverse sensor platform technology.

  1. Contacts to semiconductors

    International Nuclear Information System (INIS)

    Tove, P.A.

    1975-08-01

    Contacts to semiconductors play an important role in most semiconductor devices. These devices range from microelectronics to power components, from high-sensitivity light or radiation detectors to light-emitting of microwave-generating components. Silicon is the dominating material but compound semiconductors are increasing in importance. The following survey is an attempt to classify contact properties and the physical mechanisms involved, as well as fabrication methods and methods of investigation. The main interest is in metal-semiconductor type contacts where a few basic concepts are dealt with in some detail. (Auth.)

  2. Semiconductor Electrical Measurements Laboratory

    Data.gov (United States)

    Federal Laboratory Consortium — The Semiconductor Electrical Measurements Laboratory is a research laboratory which complements the Optical Measurements Laboratory. The laboratory provides for Hall...

  3. Foreword: Focus on Superconductivity in Semiconductors

    Directory of Open Access Journals (Sweden)

    Yoshihiko Takano

    2008-01-01

    Full Text Available Since the discovery of superconductivity in diamond, much attention has been given to the issue of superconductivity in semiconductors. Because diamond has a large band gap of 5.5 eV, it is called a wide-gap semiconductor. Upon heavy boron doping over 3×1020 cm−3, diamond becomes metallic and demonstrates superconductivity at temperatures below 11.4 K. This discovery implies that a semiconductor can become a superconductor upon carrier doping. Recently, superconductivity was also discovered in boron-doped silicon and SiC semiconductors. The number of superconducting semiconductors has increased. In 2008 an Fe-based superconductor was discovered in a research project on carrier doping in a LaCuSeO wide-gap semiconductor. This discovery enhanced research activities in the field of superconductivity, where many scientists place particular importance on superconductivity in semiconductors.This focus issue features a variety of topics on superconductivity in semiconductors selected from the 2nd International Workshop on Superconductivity in Diamond and Related Materials (IWSDRM2008, which was held at the National Institute for Materials Science (NIMS, Tsukuba, Japan in July 2008. The 1st workshop was held in 2005 and was published as a special issue in Science and Technology of Advanced Materials (STAM in 2006 (Takano 2006 Sci. Technol. Adv. Mater. 7 S1.The selection of papers describe many important experimental and theoretical studies on superconductivity in semiconductors. Topics on boron-doped diamond include isotope effects (Ekimov et al and the detailed structure of boron sites, and the relation between superconductivity and disorder induced by boron doping. Regarding other semiconductors, the superconducting properties of silicon and SiC (Kriener et al, Muranaka et al and Yanase et al are discussed, and In2O3 (Makise et al is presented as a new superconducting semiconductor. Iron-based superconductors are presented as a new series of high

  4. Efficiency and Throughput Advances in Continuous Roll-to-Roll a-Si Alloy PV Manufacturing Technology: Final Subcontract Report, 22 June 1998 -- 5 October 2001

    Energy Technology Data Exchange (ETDEWEB)

    Ellison, T.

    2002-04-01

    This report describes a roll-to-roll triple-junction amorphous silicon alloy PV manufacturing technology developed and commercialized by Energy Conversion Devices (ECD) and United Solar Systems. This low material cost, roll-to-roll production technology has the economies of scale needed to meet the cost goals necessary for widespread use of PV. ECD has developed and built six generations of a-Si production equipment, including the present 5 MW United Solar manufacturing plant in Troy, Michigan. ECD is now designing and building a new 25-MW facility, also in Michigan. United Solar holds the world's record for amorphous silicon PV conversion efficiency, and manufactures and markets a wide range of PV products, including flexible portable modules, power modules, and innovative building-integrated PV (BIPV) shingle and metal-roofing modules that take advantage of this lightweight, rugged, and flexible PV technology. All of United Solar's power and BIPV products are approved by Underwriters Laboratories and carry a 10-year warranty. In this PVMaT 5A subcontract, ECD and United Solar are addressing issues to reduce the cost and improve the manufacturing technology for the ECD/United Solar PV module manufacturing process. ECD and United Solar identified five technology development areas that would reduce the module manufacturing cost in the present 5-MW production facility, and also be applicable to future larger-scale manufacturing facilities.

  5. Advanced energy conversion & mechatronics systems

    NARCIS (Netherlands)

    Lomonova, E.A.

    2015-01-01

    Ultra-high precision systems are encountered in high-tech industrial applications including semiconductor lithography equipment, pick-and-place machines for the manufacturing of electronic components, microsurgery equipment, MRI equipment and calibration devices in electron microscopes. The

  6. Advances in Opto Electronics

    Indian Academy of Sciences (India)

    First page Back Continue Last page Overview Graphics. Advances in Opto Electronics. Optoelectronics is where electronics was 15 years back. All Optical Amplifiers and Semiconductor Amplifiers. Fastest Semiconductor (InP) switch is at 170GHz- where is terrabit ? MEMS based switches that route traffic at wavelength level ...

  7. Collaborative Research and Development. Delivery Order 0006: Transmission Electron Microscope Image Modeling and Semiconductor Heterointerface Characterization

    National Research Council Canada - National Science Library

    Mahalingam, Krishnamurthy

    2006-01-01

    .... Transmission electron microscope (TEM) characterization studies were performed on a variety of novel III-V semiconductor heterostructures being developed for advanced optoelectronic device applications...

  8. Ballistic superconductivity in semiconductor nanowires

    Science.gov (United States)

    Zhang, Hao; Gül, Önder; Conesa-Boj, Sonia; Nowak, Michał P.; Wimmer, Michael; Zuo, Kun; Mourik, Vincent; de Vries, Folkert K.; van Veen, Jasper; de Moor, Michiel W. A.; Bommer, Jouri D. S.; van Woerkom, David J.; Car, Diana; Plissard, Sébastien R; Bakkers, Erik P.A.M.; Quintero-Pérez, Marina; Cassidy, Maja C.; Koelling, Sebastian; Goswami, Srijit; Watanabe, Kenji; Taniguchi, Takashi; Kouwenhoven, Leo P.

    2017-01-01

    Semiconductor nanowires have opened new research avenues in quantum transport owing to their confined geometry and electrostatic tunability. They have offered an exceptional testbed for superconductivity, leading to the realization of hybrid systems combining the macroscopic quantum properties of superconductors with the possibility to control charges down to a single electron. These advances brought semiconductor nanowires to the forefront of efforts to realize topological superconductivity and Majorana modes. A prime challenge to benefit from the topological properties of Majoranas is to reduce the disorder in hybrid nanowire devices. Here we show ballistic superconductivity in InSb semiconductor nanowires. Our structural and chemical analyses demonstrate a high-quality interface between the nanowire and a NbTiN superconductor that enables ballistic transport. This is manifested by a quantized conductance for normal carriers, a strongly enhanced conductance for Andreev-reflecting carriers, and an induced hard gap with a significantly reduced density of states. These results pave the way for disorder-free Majorana devices. PMID:28681843

  9. Physics of semiconductors in high magnetic fields

    CERN Document Server

    Miura, Noboru

    2008-01-01

    This book summarizes most of the fundamental physical phenomena which semiconductors and their modulated structures exhibit in high magnetic fields. Readers can learn not only the basic theoretical background but also the present state of the art from the most advanced data in this rapidly growing research area.

  10. Luminescence in colloidal Mn2+-doped semiconductor nanocrystals

    International Nuclear Information System (INIS)

    Beaulac, Remi; Archer, Paul I.; Gamelin, Daniel R.

    2008-01-01

    Recent advances in nanocrystal doping chemistries have substantially broadened the variety of photophysical properties that can be observed in colloidal Mn 2+ -doped semiconductor nanocrystals. A brief overview is provided, focusing on Mn 2+ -doped II-VI semiconductor nanocrystals prepared by direct chemical synthesis and capped with coordinating surface ligands. These Mn 2+ -doped semiconductor nanocrystals are organized into three major groups according to the location of various Mn 2+ -related excited states relative to the energy gap of the host semiconductor nanocrystals. The positioning of these excited states gives rise to three distinct relaxation scenarios following photoexcitation. A brief outlook on future research directions is provided. - Graphical abstract: Mn 2+ -doped semiconductor nanocrystals are organized into three major groups according to the location of various Mn 2+ -related excited states relative to the energy gap of the host semiconductor nanocrystals. The positioning of these excited states gives rise to three distinct relaxation scenarios following photoexcitation

  11. Application of statistics to VLSI circuit manufacturing : test, diagnosis, and reliability

    NARCIS (Netherlands)

    Krishnan, Shaji

    2017-01-01

    Semiconductor product manufacturing companies strive to deliver defect free, and reliable products to their customers. However, with the down-scaling of technology, increasing the throughput at every stage of semiconductor product manufacturing becomes a harder challenge. To avoid process-related

  12. Mudanças organizacionais na adoção de tecnologias avançadas de manufatura Organizational changes in the adoption of advanced manufacturing technologies

    Directory of Open Access Journals (Sweden)

    Rafaela da Rosa Cardoso

    2010-12-01

    Full Text Available Para que a adoção de Tecnologia Avançada da Manufatura (AMT possa, de fato, proporcionar vantagens competitivas às empresas, faz-se necessário que essas tecnologias sejam selecionadas segundo critérios que considerem aspectos estratégicos. As características organizacionais de uma empresa influenciam sobremaneira o processo de adoção de AMT, de tal forma que se faz necessário desenvolver recomendações para a revisão do projeto organizacional. O presente trabalho propõe um processo para a geração de tais recomendações, através de uma metodologia denominada de "refinamentos sucessivos". Como resultado deste processo de "refinamentos sucessivos" obtém-se um conjunto de recomendações para a revisão do projeto organizacional, baseados em requisitos estabelecidos pelo processo de adoção de AMT. Essas recomendações constituem um conjunto de decisões a serem tomadas acerca do projeto organizacional para adequá-lo às demandas de uma nova tecnologia a ser introduzida, ou seja, a implementação de AMT.In order for the adoption of Advanced Manufacturing Technology (AMT to provide competitive advantages to the companies, it is necessary to select these technologies according to criteria that consider strategic aspects. The organizational characteristics of a company influence particularly the process of AMT adoption, in such a way that it is necessary to develop recommendations for the review of the organizational project. The present work proposes a process for the generation of these recommendations, which through a methodology called 'successive refinements' produces a set of recommendations for the review of the organizational project, based on requirements established by the AMT adoption process. These recommendations are a set of decisions that may be taken about the organizational project to adapt them to demands of the new technology to be introduced, in other words, the AMT implementation.

  13. Semiconductors data handbook

    CERN Document Server

    Madelung, Otfried

    2004-01-01

    This volume Semiconductors: Data Handbook contains frequently used data from the corresponding larger Landolt-Börnstein handbooks in a low price book for the individual scientist working in the laboratory. The Handbook contain important information about a large number of semiconductors

  14. Semiconductor radiation detection systems

    CERN Document Server

    2010-01-01

    Covers research in semiconductor detector and integrated circuit design in the context of medical imaging using ionizing radiation. This book explores other applications of semiconductor radiation detection systems in security applications such as luggage scanning, dirty bomb detection and border control.

  15. Spin physics in semiconductors

    CERN Document Server

    Dyakonov, Mikhail I

    2008-01-01

    This book describes beautiful optical and transport phenomena related to the electron and nuclear spins in semiconductors with emphasis on a clear presentation of the physics involved. Recent results on quantum wells and quantum dots are reviewed. The book is intended for students and researchers in the fields of semiconductor physics and nanoelectronics.

  16. Compound Semiconductor Radiation Detectors

    CERN Document Server

    Owens, Alan

    2012-01-01

    Although elemental semiconductors such as silicon and germanium are standard for energy dispersive spectroscopy in the laboratory, their use for an increasing range of applications is becoming marginalized by their physical limitations, namely the need for ancillary cooling, their modest stopping powers, and radiation intolerance. Compound semiconductors, on the other hand, encompass such a wide range of physical and electronic properties that they have become viable competitors in a number of applications. Compound Semiconductor Radiation Detectors is a consolidated source of information on all aspects of the use of compound semiconductors for radiation detection and measurement. Serious Competitors to Germanium and Silicon Radiation Detectors Wide-gap compound semiconductors offer the ability to operate in a range of hostile thermal and radiation environments while still maintaining sub-keV spectral resolution at X-ray wavelengths. Narrow-gap materials offer the potential of exceeding the spectral resolutio...

  17. Terahertz semiconductor nonlinear optics

    DEFF Research Database (Denmark)

    Turchinovich, Dmitry; Hvam, Jørn Märcher; Hoffmann, Matthias

    2013-01-01

    In this proceedings we describe our recent results on semiconductor nonlinear optics, investigated using single-cycle THz pulses. We demonstrate the nonlinear absorption and self-phase modulation of strong-field THz pulses in doped semiconductors, using n-GaAs as a model system. The THz...... nonlinearity in doped semiconductors originates from the near-instantaneous heating of free electrons in the ponderomotive potential created by electric field of the THz pulse, leading to ultrafast increase of electron effective mass by intervalley scattering. Modification of effective mass in turn leads...... to a decrease of plasma frequency in semiconductor and produces a substantial modification of THz-range material dielectric function, described by the Drude model. As a result, the nonlinearity of both absorption coefficient and refractive index of the semiconductor is observed. In particular we demonstrate...

  18. Organic semiconductor crystals.

    Science.gov (United States)

    Wang, Chengliang; Dong, Huanli; Jiang, Lang; Hu, Wenping

    2018-01-22

    Organic semiconductors have attracted a lot of attention since the discovery of highly doped conductive polymers, due to the potential application in field-effect transistors (OFETs), light-emitting diodes (OLEDs) and photovoltaic cells (OPVs). Single crystals of organic semiconductors are particularly intriguing because they are free of grain boundaries and have long-range periodic order as well as minimal traps and defects. Hence, organic semiconductor crystals provide a powerful tool for revealing the intrinsic properties, examining the structure-property relationships, demonstrating the important factors for high performance devices and uncovering fundamental physics in organic semiconductors. This review provides a comprehensive overview of the molecular packing, morphology and charge transport features of organic semiconductor crystals, the control of crystallization for achieving high quality crystals and the device physics in the three main applications. We hope that this comprehensive summary can give a clear picture of the state-of-art status and guide future work in this area.

  19. Green manufacturing processes and systems

    Energy Technology Data Exchange (ETDEWEB)

    Davim, J. Paulo (ed.) [Aveiro Univ. (Portugal). Dept. of Mechanical Engineering, Campus Universitario de Santiago

    2013-02-01

    This book provides the recent advances on green manufacturing processes and systems for modern industry. Chapter 1 provides information on sustainable manufacturing through environmentally-friendly machining. Chapter 2 is dedicated to environmentally-friendly machining: vegetable based cutting fluids. Chapter 3 describes environmental-friendly joining of tubes. Chapter 4 contains information on concepts, methods and strategies for zero-waste in manufacturing. Finally, chapter 5 is dedicated to the application of hybrid MCDM approach for selecting the best tyre recycling process.

  20. Additive manufacturing.

    Science.gov (United States)

    Mumith, A; Thomas, M; Shah, Z; Coathup, M; Blunn, G

    2018-04-01

    Increasing innovation in rapid prototyping (RP) and additive manufacturing (AM), also known as 3D printing, is bringing about major changes in translational surgical research. This review describes the current position in the use of additive manufacturing in orthopaedic surgery. Cite this article: Bone Joint J 2018;100-B:455-60.

  1. National Manufacturing Strategy: Is a National Manufacturing Strategy Essential to National Security?

    Science.gov (United States)

    2011-05-01

    cycle found nearly a quarter of all homeowners owning more than their home was worth. 11 Both Paul Volcker and Warren Buffet arrived at similar...November 15, 2010; Warren Buffet , Testimony, Financial Crisis Inquiry Commission, June 2, 2010; “Subprime Mortgage Crisis,” http://en.wikipedia.org...overseas manufacturing. Case Study: Semiconductor Wafer Industry. The history of the semiconductor industry is an instructive account . It begins with

  2. Offshoring in the Semiconductor Industry: A Historical Perspective

    OpenAIRE

    Brown, Clair; Linden, Greg

    2005-01-01

    Semiconductor design is a frequently-cited example of the new wave of offshoring and foreign-outsourcing of service sector jobs. It is certainly a concern to U.S. design engineers themselves. In addition to the current wave of white-collar outsourcing, the industry also has a rich experience with offshoring of manufacturing activity. Semiconductor companies were among the first to invest in offshore facilities to manufacture goods for imports back to the U.S. A brief review of these...

  3. Training for New Manufacturing Technologies.

    Science.gov (United States)

    Jacobs, James

    1988-01-01

    Examines the effects of computer-based manufacturing technologies on employment opportunities and job skills. Describes the establishment of the Industrial Technology Institute in Michigan to develop and utilize advanced manufacturing technologies, and the institute's relationship to the state's community colleges. Reviews lessons learned from…

  4. TSOM method for semiconductor metrology

    Science.gov (United States)

    Attota, Ravikiran; Dixson, Ronald G.; Kramar, John A.; Potzick, James E.; Vladár, András E.; Bunday, Benjamin; Novak, Erik; Rudack, Andrew

    2011-03-01

    Through-focus scanning optical microscopy (TSOM) is a new metrology method that achieves 3D nanoscale measurement sensitivity using conventional optical microscopes; measurement sensitivities are comparable to what is typical when using scatterometry, scanning electron microscopy (SEM), and atomic force microscopy (AFM). TSOM can be used in both reflection and transmission modes and is applicable to a variety of target materials and shapes. Nanometrology applications that have been demonstrated by experiments or simulations include defect analysis, inspection and process control; critical dimension, photomask, overlay, nanoparticle, thin film, and 3D interconnect metrologies; line-edge roughness measurements; and nanoscale movements of parts in MEMS/NEMS. Industries that could benefit include semiconductor, data storage, photonics, biotechnology, and nanomanufacturing. TSOM is relatively simple and inexpensive, has a high throughput, and provides nanoscale sensitivity for 3D measurements with potentially significant savings and yield improvements in manufacturing.

  5. Fundamentals of semiconductor processing technology

    CERN Document Server

    El-Kareh, Badih

    1995-01-01

    The drive toward new semiconductor technologies is intricately related to market demands for cheaper, smaller, faster, and more reliable circuits with lower power consumption. The development of new processing tools and technologies is aimed at optimizing one or more of these requirements. This goal can, however, only be achieved by a concerted effort between scientists, engineers, technicians, and operators in research, development, and manufac­ turing. It is therefore important that experts in specific disciplines, such as device and circuit design, understand the principle, capabil­ ities, and limitations of tools and processing technologies. It is also important that those working on specific unit processes, such as lithography or hot processes, be familiar with other unit processes used to manufacture the product. Several excellent books have been published on the subject of process technologies. These texts, however, cover subjects in too much detail, or do not cover topics important to modem tech­ n...

  6. Semiconductor nanostructures for artificial photosynthesis

    Science.gov (United States)

    Yang, Peidong

    2012-02-01

    Nanowires, with their unique capability to bridge the nanoscopic and macroscopic worlds, have already been demonstrated as important materials for different energy conversion. One emerging and exciting direction is their application for solar to fuel conversion. The generation of fuels by the direct conversion of solar energy in a fully integrated system is an attractive goal, but no such system has been demonstrated that shows the required efficiency, is sufficiently durable, or can be manufactured at reasonable cost. One of the most critical issues in solar water splitting is the development of a suitable photoanode with high efficiency and long-term durability in an aqueous environment. Semiconductor nanowires represent an important class of nanostructure building block for direct solar-to-fuel application because of their high surface area, tunable bandgap and efficient charge transport and collection. Nanowires can be readily designed and synthesized to deterministically incorporate heterojunctions with improved light absorption, charge separation and vectorial transport. Meanwhile, it is also possible to selectively decorate different oxidation or reduction catalysts onto specific segments of the nanowires to mimic the compartmentalized reactions in natural photosynthesis. In this talk, I will highlight several recent examples in this lab using semiconductor nanowires and their heterostructures for the purpose of direct solar water splitting.

  7. Report on 'manufacturing technology supported by advanced and integrated information system through international cooperation'. Domestic surveys; 'Kan'i sosagata denshi sekkei seisan shien system no kaihatsu ni kansuru kenkyu kyoryoku' ni kansuru hokokusho. Kokunai chosa kenkyu

    Energy Technology Data Exchange (ETDEWEB)

    NONE

    1995-03-01

    The committee of manufacturing technology supported by advanced and integrated information system through international cooperation (MATIC) has been established as the organization to promote necessary surveys, deliberate the research and development guidelines and themes, and thereby support the joint R and D projects with Asian countries to improve information systems for their manufacturing industries by MATIC. The R and D skeletons are set in FY 1994 for the works in and after FY 1995. The relationships between affiliates of Japanese enterprises and local enterprises, actual conditions of the manufacturing industries and so on are surveyed, in order to extract problems related to the information systems for the promising manufacturing industries in the Asian countries. Each industry has its own characteristics with respect to, e.g., numbers f parts and process steps, product life cycle, extent of automation, skill of workers, and spread of the related industries. Therefore, 3 industrial areas are picked up as those considered to be adequate for the case studies, and surveyed for the system functions, performance, elementary techniques and so on which are required to establish the information systems for their production systems. (NEDO)

  8. Advanced Microelectronics Technologies for Future Small Satellite Systems

    Science.gov (United States)

    Alkalai, Leon

    1999-01-01

    Future small satellite systems for both Earth observation as well as deep-space exploration are greatly enabled by the technological advances in deep sub-micron microelectronics technologies. Whereas these technological advances are being fueled by the commercial (non-space) industries, more recently there has been an exciting new synergism evolving between the two otherwise disjointed markets. In other words, both the commercial and space industries are enabled by advances in low-power, highly integrated, miniaturized (low-volume), lightweight, and reliable real-time embedded systems. Recent announcements by commercial semiconductor manufacturers to introduce Silicon On Insulator (SOI) technology into their commercial product lines is driven by the need for high-performance low-power integrated devices. Moreover, SOI has been the technology of choice for many space semiconductor manufacturers where radiation requirements are critical. This technology has inherent radiation latch-up immunity built into the process, which makes it very attractive to space applications. In this paper, we describe the advanced microelectronics and avionics technologies under development by NASA's Deep Space Systems Technology Program (also known as X2000). These technologies are of significant benefit to both the commercial satellite as well as the deep-space and Earth orbiting science missions. Such a synergistic technology roadmap may truly enable quick turn-around, low-cost, and highly capable small satellite systems for both Earth observation as well as deep-space missions.

  9. Defects in semiconductors

    International Nuclear Information System (INIS)

    Pimentel, C.A.F.

    1983-01-01

    Some problems openned in the study of defects in semiconductors are presented. In particular, a review is made of the more important problems in Si monocrystals of basic and technological interest: microdefects and the presence of oxigen and carbon. The techniques usually utilized in the semiconductor material characterization are emphatized according its potentialities. Some applications of x-ray techniques in the epitaxial shell characterization in heterostructures, importants in electronic optics, are shown. The increase in the efficiency of these defect analysis methods in semiconductor materials with the use of synchrotron x-ray sources is shown. (L.C.) [pt

  10. Introduction to Semiconductor Devices

    Science.gov (United States)

    Brennan, Kevin F.

    2005-03-01

    This volume offers a solid foundation for understanding the most important devices used in the hottest areas of electronic engineering today, from semiconductor fundamentals to state-of-the-art semiconductor devices in the telecommunications and computing industries. Kevin Brennan describes future approaches to computing hardware and RF power amplifiers, and explains how emerging trends and system demands of computing and telecommunications systems influence the choice, design and operation of semiconductor devices. In addition, he covers MODFETs and MOSFETs, short channel effects, and the challenges faced by continuing miniaturization. His book is both an excellent senior/graduate text and a valuable reference for practicing engineers and researchers.

  11. Spin physics in semiconductors

    CERN Document Server

    2017-01-01

    This book offers an extensive introduction to the extremely rich and intriguing field of spin-related phenomena in semiconductors. In this second edition, all chapters have been updated to include the latest experimental and theoretical research. Furthermore, it covers the entire field: bulk semiconductors, two-dimensional semiconductor structures, quantum dots, optical and electric effects, spin-related effects, electron-nuclei spin interactions, Spin Hall effect, spin torques, etc. Thanks to its self-contained style, the book is ideally suited for graduate students and researchers new to the field.

  12. Physics of semiconductor lasers

    CERN Document Server

    Mroziewicz, B; Nakwaski, W

    2013-01-01

    Written for readers who have some background in solid state physics but do not necessarily possess any knowledge of semiconductor lasers, this book provides a comprehensive and concise account of fundamental semiconductor laser physics, technology and properties. The principles of operation of these lasers are therefore discussed in detail with the interrelations between their design and optical, electrical and thermal properties. The relative merits of a large number of laser structures and their parameters are described to acquaint the reader with the various aspects of the semiconductor l

  13. Defects in semiconductors

    CERN Document Server

    Romano, Lucia; Jagadish, Chennupati

    2015-01-01

    This volume, number 91 in the Semiconductor and Semimetals series, focuses on defects in semiconductors. Defects in semiconductors help to explain several phenomena, from diffusion to getter, and to draw theories on materials' behavior in response to electrical or mechanical fields. The volume includes chapters focusing specifically on electron and proton irradiation of silicon, point defects in zinc oxide and gallium nitride, ion implantation defects and shallow junctions in silicon and germanium, and much more. It will help support students and scientists in their experimental and theoret

  14. Manufacturing strategy issues in selected Indian manufacturing industry

    Directory of Open Access Journals (Sweden)

    Mahender Singh

    2013-03-01

    Full Text Available This paper presents some findings of Indian manufacturing sectors viz. automobile (especially two-wheeler, tractor and general manufacturing industry. Various manufacturing strategy issues such as competitive priorities, improvement activities, and performance measures, have been identified and assessed in Indian context. Sector wise comparison of competitive priorities, improvement activities i.e. advanced manufacturing technology (AMT, integrated information systems (IIS, and advanced management systems (AMS, and performance measure, is provided. Our results showed that most of the Indian companies are still emphasizing on quality. However, automobile sector has set to compete globally with high innovation rate, faster new product development, and continuous improvement. It is also observed that Indian companies are investing more in AMS as compared to IIS and AMT. Manufacturing competence index is also computed for each sector.

  15. Solution coating of large-area organic semiconductor thin films with aligned single-crystalline domains

    KAUST Repository

    Diao, Ying; Tee, Benjamin C-K.; Giri, Gaurav; Xu, Jie; Kim, Do Hwan; Becerril, Hector A.; Stoltenberg, Randall M.; Lee, Tae Hoon; Xue, Gi; Mannsfeld, Stefan C. B.; Bao, Zhenan

    2013-01-01

    Solution coating of organic semiconductors offers great potential for achieving low-cost manufacturing of large-area and flexible electronics. However, the rapid coating speed needed for industrial-scale production poses challenges to the control

  16. Charged Semiconductor Defects Structure, Thermodynamics and Diffusion

    CERN Document Server

    Seebauer, Edmund G

    2009-01-01

    The technologically useful properties of a solid often depend upon the types and concentrations of the defects it contains. Not surprisingly, defects in semiconductors have been studied for many years, in many cases with a view towards controlling their behavior through various forms of "defect engineering." For example, in the bulk, charging significantly affects the total concentration of defects that are available to mediate phenomena such as solid-state diffusion. Surface defects play an important role in mediating surface mass transport during high temperature processing steps such as epitaxial film deposition, diffusional smoothing in reflow, and nanostructure formation in memory device fabrication. Charged Semiconductor Defects details the current state of knowledge regarding the properties of the ionized defects that can affect the behavior of advanced transistors, photo-active devices, catalysts, and sensors. Features: Group IV, III-V, and oxide semiconductors; Intrinsic and extrinsic defects; and, P...

  17. Educating Tomorrow's Workforce: A Report on the Semiconductor Industry's Commitment to Youth in K-12.

    Science.gov (United States)

    Semiconductor Industry Association, San Jose, CA.

    The U.S. semiconductor industry, now the nation's largest manufacturing industry, displays its commitment to training its current workers and educating future workers by supporting educational efforts on the K-12 level. This catalog describes innovative actions by 16 Semiconductor Industry Association companies to improve education at the K-12…

  18. Micro Manufacturing

    DEFF Research Database (Denmark)

    Hansen, Hans Nørgaard

    2003-01-01

    Manufacturing deals with systems that include products, processes, materials and production systems. These systems have functional requirements, constraints, design parameters and process variables. They must be decomposed in a systematic manner to achieve the best possible system performance....... If a micro manufacturing system isn’t designed rationally and correctly, it will be high-cost, unreliable, and not robust. For micro products and systems it is a continuously increasing challenge to create the operational basis for an industrial production. As the products through product development...... processes are made applicable to a large number of customers, the pressure in regard to developing production technologies that make it possible to produce the products at a reasonable price and in large numbers is growing. The micro/nano manufacturing programme at the Department of Manufacturing...

  19. Smart Manufacturing.

    Science.gov (United States)

    Davis, Jim; Edgar, Thomas; Graybill, Robert; Korambath, Prakashan; Schott, Brian; Swink, Denise; Wang, Jianwu; Wetzel, Jim

    2015-01-01

    Historic manufacturing enterprises based on vertically optimized companies, practices, market share, and competitiveness are giving way to enterprises that are responsive across an entire value chain to demand dynamic markets and customized product value adds; increased expectations for environmental sustainability, reduced energy usage, and zero incidents; and faster technology and product adoption. Agile innovation and manufacturing combined with radically increased productivity become engines for competitiveness and reinvestment, not simply for decreased cost. A focus on agility, productivity, energy, and environmental sustainability produces opportunities that are far beyond reducing market volatility. Agility directly impacts innovation, time-to-market, and faster, broader exploration of the trade space. These changes, the forces driving them, and new network-based information technologies offering unprecedented insights and analysis are motivating the advent of smart manufacturing and new information technology infrastructure for manufacturing.

  20. EDITORIAL The 23rd Nordic Semiconductor Meeting The 23rd Nordic Semiconductor Meeting

    Science.gov (United States)

    Ólafsson, Sveinn; Sveinbjörnsson, Einar

    2010-12-01

    A Nordic Semiconductor Meeting is held every other year with the venue rotating amongst the Nordic countries of Denmark, Finland, Iceland, Norway and Sweden. The focus of these meetings remains 'original research and science being carried out on semiconductor materials, devices and systems'. Reports on industrial activity have usually featured. The topics have ranged from fundamental research on point defects in a semiconductor to system architecture of semiconductor electronic devices. Proceedings from these events are regularly published as a topical issue of Physica Scripta. All of the papers in this topical issue have undergone critical peer review and we wish to thank the reviewers and the authors for their cooperation, which has been instrumental in meeting the high scientific standards and quality of the series. This meeting of the 23rd Nordic Semiconductor community, NSM 2009, was held at Háskólatorg at the campus of the University of Iceland, Reykjavik, Iceland, 14-17 June 2009. Support was provided by the University of Iceland. Almost 50 participants presented a broad range of topics covering semiconductor materials and devices as well as related material science interests. The conference provided a forum for Nordic and international scientists to present and discuss new results and ideas concerning the fundamentals and applications of semiconductor materials. The meeting aim was to advance the progress of Nordic science and thus aid in future worldwide technological advances concerning technology, education, energy and the environment. Topics Theory and fundamental physics of semiconductors Emerging semiconductor technologies (for example III-V integration on Si, novel Si devices, graphene) Energy and semiconductors Optical phenomena and optical devices MEMS and sensors Program 14 June Registration 13:00-17:00 15 June Meeting program 09:30-17:00 and Poster Session I 16 June Meeting program 09:30-17:00 and Poster Session II 17 June Excursion and dinner

  1. Biggest semiconductor installed

    CERN Multimedia

    2008-01-01

    Scientists and technicians at the European Laboratory for Particle Physics, commonly known by its French acronym CERN (Centre Europen pour la Recherche Nuclaire), have completed the installation of the largest semiconductor silicon detector.

  2. Compact semiconductor lasers

    CERN Document Server

    Yu, Siyuan; Lourtioz, Jean-Michel

    2014-01-01

    This book brings together in a single volume a unique contribution by the top experts around the world in the field of compact semiconductor lasers to provide a comprehensive description and analysis of the current status as well as future directions in the field of micro- and nano-scale semiconductor lasers. It is organized according to the various forms of micro- or nano-laser cavity configurations with each chapter discussing key technical issues, including semiconductor carrier recombination processes and optical gain dynamics, photonic confinement behavior and output coupling mechanisms, carrier transport considerations relevant to the injection process, and emission mode control. Required reading for those working in and researching the area of semiconductors lasers and micro-electronics.

  3. Materials, Processes, and Facile Manufacturing for Bioresorbable Electronics: A Review.

    Science.gov (United States)

    Yu, Xiaowei; Shou, Wan; Mahajan, Bikram K; Huang, Xian; Pan, Heng

    2018-05-07

    Bioresorbable electronics refer to a new class of advanced electronics that can completely dissolve or disintegrate with environmentally and biologically benign byproducts in water and biofluids. They have provided a solution to the growing electronic waste problem with applications in temporary usage of electronics such as implantable devices and environmental sensors. Bioresorbable materials such as biodegradable polymers, dissolvable conductors, semiconductors, and dielectrics are extensively studied, enabling massive progress of bioresorbable electronic devices. Processing and patterning of these materials are predominantly relying on vacuum-based fabrication methods so far. However, for the purpose of commercialization, nonvacuum, low-cost, and facile manufacturing/printing approaches are the need of the hour. Bioresorbable electronic materials are generally more chemically reactive than conventional electronic materials, which require particular attention in developing the low-cost manufacturing processes in ambient environment. This review focuses on material reactivity, ink availability, printability, and process compatibility for facile manufacturing of bioresorbable electronics. © 2018 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

  4. Metrology needs and challenges for the semiconductor industry

    International Nuclear Information System (INIS)

    Schroeder, Kenneth; Ashkenaz, Scott; Hankinson, Matt

    2001-01-01

    The aggressively shrinking process window drives the semiconductor manufacturer to examine, refine, and control all aspects of the manufacturing process. Process budgets leave little room for error contribution. Budget management, and ultimately achieving the goal, requires an understanding of the constituent components, and development of mitigation strategies. We present some of the challenges facing our industry and strategies that we are taking to address them

  5. Controlling Molecular Doping in Organic Semiconductors.

    Science.gov (United States)

    Jacobs, Ian E; Moulé, Adam J

    2017-11-01

    The field of organic electronics thrives on the hope of enabling low-cost, solution-processed electronic devices with mechanical, optoelectronic, and chemical properties not available from inorganic semiconductors. A key to the success of these aspirations is the ability to controllably dope organic semiconductors with high spatial resolution. Here, recent progress in molecular doping of organic semiconductors is summarized, with an emphasis on solution-processed p-type doped polymeric semiconductors. Highlighted topics include how solution-processing techniques can control the distribution, diffusion, and density of dopants within the organic semiconductor, and, in turn, affect the electronic properties of the material. Research in these areas has recently intensified, thanks to advances in chemical synthesis, improved understanding of charged states in organic materials, and a focus on relating fabrication techniques to morphology. Significant disorder in these systems, along with complex interactions between doping and film morphology, is often responsible for charge trapping and low doping efficiency. However, the strong coupling between doping, solubility, and morphology can be harnessed to control crystallinity, create doping gradients, and pattern polymers. These breakthroughs suggest a role for molecular doping not only in device function but also in fabrication-applications beyond those directly analogous to inorganic doping. © 2017 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

  6. Radiation effects in semiconductors

    CERN Document Server

    2011-01-01

    There is a need to understand and combat potential radiation damage problems in semiconductor devices and circuits. Written by international experts, this book explains the effects of radiation on semiconductor devices, radiation detectors, and electronic devices and components. These contributors explore emerging applications, detector technologies, circuit design techniques, new materials, and innovative system approaches. The text focuses on how the technology is being used rather than the mathematical foundations behind it. It covers CMOS radiation-tolerant circuit implementations, CMOS pr

  7. Market survey of semiconductors

    International Nuclear Information System (INIS)

    Mackintosh, I.M.; Diegel, D.; Brown, A.; Brinker, C.S. den

    1977-06-01

    Examination of technology and product trends over the range of current and future products in integrated circuits and optoelectronic displays. Analysis and forecast of major economic influences that affect the production costs of integrated circuits and optoelectronic displays. Forecast of the applications and markets for integrated circuits up to 1985 in West Europe, the USA and Japan. Historic development of the semiconductor industry and the prevailing tendencies - factors which influence success in the semiconductor industry. (orig.) [de

  8. Electronic properties of semiconductor heterostructures

    International Nuclear Information System (INIS)

    Einevoll, G.T.

    1991-02-01

    Ten papers on the electronic properties of semiconductors and semiconductor heterostructures constitute the backbone of this thesis. Four papers address the form and validity of the single-band effective mass approximation for semiconductor heterostructures. In four other papers properties of acceptor states in bulk semiconductors and semiconductor heterostructures are studied using the novel effective bond-orbital model. The last two papers deal with localized excitions. 122 refs

  9. The physics of semiconductors an introduction including nanophysics and applications

    CERN Document Server

    Grundmann, Marius

    2016-01-01

    The 3rd edition of this successful textbook contains ample material for a comprehensive upper-level undergraduate or beginning graduate course, guiding readers to the point where they can choose a special topic and begin supervised research. The textbook provides a balance between essential aspects of solid-state and semiconductor physics, on the one hand, and the principles of various semiconductor devices and their applications in electronic and photonic devices, on the other. It highlights many practical aspects of semiconductors such as alloys, strain, heterostructures, nanostructures, that are necessary in modern semiconductor research but typically omitted in textbooks. Coverage also includes additional advanced topics, such as Bragg mirrors, resonators, polarized and magnetic semiconductors, nanowires, quantum dots, multi-junction solar cells, thin film transistors, carbon-based nanostructures and transparent conductive oxides. The text derives explicit formulas for many results to support better under...

  10. Semiconductor technology for reducing emissions and increasing efficiency

    Energy Technology Data Exchange (ETDEWEB)

    Duffin, B.; Frank, R. [Motorola Semiconductor Products Sector, Phoenix, AZ (United States)

    1997-12-31

    The cooperation and support of all industries are required to significantly impact a worldwide reduction in gaseous emissions that may contribute to climate change. Each industry also is striving to more efficiently utilize the resources that it consumes since this is both conservation for good citizenship and an intelligent approach to business. The semiconductor industry is also extremely concerned with these issues. However, semiconductor manufacturer`s products provide solutions for reduced emissions and increased efficiency in their industry, other industries and areas that can realize significant improvements through control technology. This paper will focus on semiconductor technologies of digital control, power switching and sensing to improve efficiency and reduce emissions in automotive, industrial, and office/home applications. 10 refs., 13 figs.

  11. Janus droplets: liquid marbles coated with dielectric/semiconductor particles.

    Science.gov (United States)

    Bormashenko, Edward; Bormashenko, Yelena; Pogreb, Roman; Gendelman, Oleg

    2011-01-04

    The manufacturing of water droplets wrapped with two different powders, carbon black (semiconductor) and polytetrafluoroethylene (dielectric), is presented. Droplets composed of two hemispheres (Janus droplets) characterized by various physical and chemical properties are reported first. Watermelon-like striped liquid marbles are reported. Janus droplets remained stable on solid and liquid supports and could be activated with an electric field.

  12. Technician Training for the Semiconductor Microdevices Industry. Final Report.

    Science.gov (United States)

    Center for Occupational Research and Development, Inc., Waco, TX.

    The Center for Occupational Research and Development (CORD) carried out four activities to foster semiconductor manufacturing technician (SMT) training: (1) collaboration with industry experts and educators while developing a curriculum to train SMTs; (2) implementation and testing of the curriculum at a technical college; (3) dissemination of…

  13. High-performance green semiconductor devices: materials, designs, and fabrication

    Science.gov (United States)

    Jung, Yei Hwan; Zhang, Huilong; Gong, Shaoqin; Ma, Zhenqiang

    2017-06-01

    From large industrial computers to non-portable home appliances and finally to light-weight portable gadgets, the rapid evolution of electronics has facilitated our daily pursuits and increased our life comforts. However, these rapid advances have led to a significant decrease in the lifetime of consumer electronics. The serious environmental threat that comes from electronic waste not only involves materials like plastics and heavy metals, but also includes toxic materials like mercury, cadmium, arsenic, and lead, which can leak into the ground and contaminate the water we drink, the food we eat, and the animals that live around us. Furthermore, most electronics are comprised of non-renewable, non-biodegradable, and potentially toxic materials. Difficulties in recycling the increasing amount of electronic waste could eventually lead to permanent environmental pollution. As such, discarded electronics that can naturally degrade over time would reduce recycling challenges and minimize their threat to the environment. This review provides a snapshot of the current developments and challenges of green electronics at the semiconductor device level. It looks at the developments that have been made in an effort to help reduce the accumulation of electronic waste by utilizing unconventional, biodegradable materials as components. While many semiconductors are classified as non-biodegradable, a few biodegradable semiconducting materials exist and are used as electrical components. This review begins with a discussion of biodegradable materials for electronics, followed by designs and processes for the manufacturing of green electronics using different techniques and designs. In the later sections of the review, various examples of biodegradable electrical components, such as sensors, circuits, and batteries, that together can form a functional electronic device, are discussed and new applications using green electronics are reviewed.

  14. The ATLAS semiconductor tracker (SCT)

    International Nuclear Information System (INIS)

    Jackson, J.N.

    2005-01-01

    The ATLAS detector (CERN,LHCC,94-43 (1994)) is designed to study a wide range of physics at the CERN Large Hadron Collider (LHC) at luminosities up to 10 34 cm -2 s -1 with a bunch-crossing rate of 40 MHz. The Semiconductor Tracker (SCT) forms a key component of the Inner Detector (vol. 1, ATLAS TDR 4, CERN,LHCC 97-16 (1997); vol. 2, ATLAS TDR 5, CERN,LHCC 97-17 (1997)) which is situated inside a 2 T solenoid field. The ATLAS Semiconductor Tracker (SCT) utilises 4088 silicon modules with binary readout mounted on carbon fibre composite structures arranged in the forms of barrels in the central region and discs in the forward region. The construction of the SCT is now well advanced. The design of the SCT modules, services and support structures will be briefly outlined. A description of the various stages in the construction process will be presented with examples of the performance achieved and the main difficulties encountered. Finally, the current status of the construction is reviewed

  15. Fuel manufacturing and utilization

    International Nuclear Information System (INIS)

    2005-01-01

    The efficient utilisation of nuclear fuel requires manufacturing facilities capable of making advanced fuel types, with appropriate quality control. Once made, the use of such fuels requires a proper understanding of their behaviour in the reactor environment, so that safe operation for the design life can be achieved. The International Atomic Energy Agency supports Member States to improve in-pile fuel performance and management of materials; and to develop advanced fuel technologies for ensuring reliability and economic efficiency of the nuclear fuel cycle. It provides assistance to Member States to support fuel-manufacturing capability, including quality assurance techniques, optimization of manufacturing parameters and radiation protection. The IAEA supports the development fuel modelling expertise in Member States, covering both normal operation and postulated and severe accident conditions. It provides information and support for the operation of Nuclear Power Plant to ensure that the environment and water chemistry is appropriate for fuel operation. The IAEA supports fuel failure investigations, including equipment for failed fuel detection and for post-irradiation examination and inspection, as well as fuel repair, it provides information and support research into the basic properties of fuel materials, including UO 2 , MOX and zirconium alloys. It further offers guidance on the relationship with back-end requirement (interim storage, transport, reprocessing, disposal), fuel utilization and management, MOX fuels, alternative fuels and advanced fuel technology

  16. Production planning and control for semiconductor wafer fabrication facilities modeling, analysis, and systems

    CERN Document Server

    Mönch, Lars; Mason, Scott J

    2012-01-01

    Over the last fifty-plus years, the increased complexity and speed of integrated circuits have radically changed our world. Today, semiconductor manufacturing is perhaps the most important segment of the global manufacturing sector. As the semiconductor industry has become more competitive, improving planning and control has become a key factor for business success. This book is devoted to production planning and control problems in semiconductor wafer fabrication facilities. It is the first book that takes a comprehensive look at the role of modeling, analysis, and related information systems

  17. Method of doping a semiconductor

    International Nuclear Information System (INIS)

    Yang, C.Y.; Rapp, R.A.

    1983-01-01

    A method is disclosed for doping semiconductor material. An interface is established between a solid electrolyte and a semiconductor to be doped. The electrolyte is chosen to be an ionic conductor of the selected impurity and the semiconductor material and electrolyte are jointly chosen so that any compound formed from the impurity and the semiconductor will have a free energy no lower than the electrolyte. A potential is then established across the interface so as to allow the impurity ions to diffuse into the semiconductor. In one embodiment the semiconductor and electrolyte may be heated so as to increase the diffusion coefficient

  18. Research cooperation project on manufacturing technology supported by advanced and integrated information system through international cooperation (MATIC); Kan`i sosagata denshi sekkei seisan shien system no kaihatsu ni kansuru kenkyu kyoryoku

    Energy Technology Data Exchange (ETDEWEB)

    NONE

    1997-03-01

    To support the advancement of basic industries including machine industry in Asian countries, research cooperation has been conducted for developing the manufacturing technology supported by advanced and integrated information system suitable for actual circumstances of individual countries. For the automotive and the parts industries, it is significant for the preparation works of manufacturing in overseas factories to possess common information between Japan and overseas factories. In this project, a system is constructed, which can be used in industries surrounding automotive industry, such as parts and facility industries, as well as in the automotive industry. In FY 1996, a primary system has been developed, and the demonstration tests were carried out. For the home electric machine and the parts industries, the technology applicable to the design of printed board circuit was developed, and the catalog of electronic parts was constructed. In FY 1996, a preliminary prototype system of the electronic parts catalog system was designed and developed. For the textile and apparel industries, the EDI, exchange system of CAD/CAM data, and construction of data bank were investigated. 87 figs., 19 tabs.

  19. Handbook of compound semiconductors growth, processing, characterization, and devices

    CERN Document Server

    Holloway, Paul H

    1996-01-01

    This book reviews the recent advances and current technologies used to produce microelectronic and optoelectronic devices from compound semiconductors. It provides a complete overview of the technologies necessary to grow bulk single-crystal substrates, grow hetero-or homoepitaxial films, and process advanced devices such as HBT's, QW diode lasers, etc.

  20. LEAN Manufacturing

    DEFF Research Database (Denmark)

    Bilberg, Arne

    . The mission with the strategy is to obtain competitive production in Denmark and in Western Europe based on the right combination of manufacturing principles, motivated and trained employees, level of automation, and cooperation with suppliers and customers worldwide. The strategy has resulted in technical...

  1. New organic semiconductors with imide/amide-containing molecular systems.

    Science.gov (United States)

    Liu, Zitong; Zhang, Guanxin; Cai, Zhengxu; Chen, Xin; Luo, Hewei; Li, Yonghai; Wang, Jianguo; Zhang, Deqing

    2014-10-29

    Due to their high electron affinities, chemical and thermal stabilities, π-conjugated molecules with imide/amide frameworks have received considerable attentions as promising candidates for high-performance optoelectronic materials, particularly for organic semiconductors with high carrier mobilities. The purpose of this Research News is to give an overview of recent advances in development of high performance imide/amide based organic semiconductors for field-effect transistors. It covers naphthalene diimide-, perylene diimide- and amide-based conjugated molecules and polymers for organic semiconductors. © 2014 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

  2. Semiconductor terahertz technology devices and systems at room temperature operation

    CERN Document Server

    Carpintero, G; Hartnagel, H; Preu, S; Raisanen, A

    2015-01-01

    Key advances in Semiconductor Terahertz (THz) Technology now promises important new applications enabling scientists and engineers to overcome the challenges of accessing the so-called "terahertz gap".  This pioneering reference explains the fundamental methods and surveys innovative techniques in the generation, detection and processing of THz waves with solid-state devices, as well as illustrating their potential applications in security and telecommunications, among other fields. With contributions from leading experts, Semiconductor Terahertz Technology: Devices and Systems at Room Tempe

  3. Semiconductor Laser Tracking Frequency Distance Gauge

    Science.gov (United States)

    Phillips, James D.; Reasenberg, Robert D.

    2009-01-01

    Advanced astronomical missions with greatly enhanced resolution and physics missions of unprecedented accuracy will require a spaceworthy laser distance gauge of substantially improved performance. The Tracking Frequency Gauge (TFG) uses a single beam, locking a laser to the measurement interferometer. We have demonstrated this technique with pm (10(exp -12) m) performance. We report on the version we are now developing based on space-qualifiable, fiber-coupled distributed-feedback semiconductor lasers.

  4. Reconfigurable engineered motile semiconductor microparticles.

    Science.gov (United States)

    Ohiri, Ugonna; Shields, C Wyatt; Han, Koohee; Tyler, Talmage; Velev, Orlin D; Jokerst, Nan

    2018-05-03

    Locally energized particles form the basis for emerging classes of active matter. The design of active particles has led to their controlled locomotion and assembly. The next generation of particles should demonstrate robust control over their active assembly, disassembly, and reconfiguration. Here we introduce a class of semiconductor microparticles that can be comprehensively designed (in size, shape, electric polarizability, and patterned coatings) using standard microfabrication tools. These custom silicon particles draw energy from external electric fields to actively propel, while interacting hydrodynamically, and sequentially assemble and disassemble on demand. We show that a number of electrokinetic effects, such as dielectrophoresis, induced charge electrophoresis, and diode propulsion, can selectively power the microparticle motions and interactions. The ability to achieve on-demand locomotion, tractable fluid flows, synchronized motility, and reversible assembly using engineered silicon microparticles may enable advanced applications that include remotely powered microsensors, artificial muscles, reconfigurable neural networks and computational systems.

  5. Semiconductor processing with excimer lasers

    International Nuclear Information System (INIS)

    Young, R.T.; Narayan, J.; Christie, W.H.; van der Leeden, G.A.; Rothe, D.E.; Cheng, L.J.

    1983-01-01

    The advantages of pulsed excimer lasers for semiconductor processing are reviewed. Extensive comparisons of the quality of annealing of ion-implanted Si obtained with XeCl and ruby lasers have been made. The results indicate that irrespective of the large differences in the optical properties of Si at uv and visible wavelengths, the efficiency of usage of the incident energy for annealing is comparable for the two lasers. However, because of the excellent optical beam quality, the XeCl laser can provide superior control of the surface melting and the resulting junction depth. Furthermore, the concentrations of electrically active point defects in the XeCl laser annealed region are 2 to 3 orders of magnitude lower than that obtained from ruby or Nd:YAG lasers. All these results seem to suggest that XeCl lasers should be suitable for fabricating not only solar cells but also the more advanced device structures required for VLSI or VHSIC applications

  6. Optics education for machine operators in the semiconductor industry: moving beyond button pushing

    Science.gov (United States)

    Karakekes, Meg; Currier, Deborah

    1995-10-01

    In the competitive semiconductor manufacturing industry, employees who operate equipment are able to make greater contributions if they understand how the equipment works. By understanding the 'why' behind the 'what', the equipment operators can better partner with other technical staff to produce quality integrated circuits efficiently and effectively. This additional knowledge also opens equipment operators to job enrichment and enlargement opportunities. Advanced Micro Devices (AMD) is in the process of upgrading the skills of its equipment operators. This paper is an overview of a pilot program that employs optics education to upgrade stepper operators' skills. The paper starts with stepper tasks that require optics knowledge, examines teaching methods, reports both end-of-course and three months post-training knowledge retention, and summarizes how the training has impacted the production floor.

  7. Coherent dynamics in semiconductors

    DEFF Research Database (Denmark)

    Hvam, Jørn Märcher

    1998-01-01

    enhanced in quantum confined lower-dimensional systems, where exciton and biexciton effects dominate the spectra even at room temperature. The coherent dynamics of excitons are at modest densities well described by the optical Bloch equations and a number of the dynamical effects known from atomic......Ultrafast nonlinear optical spectroscopy is used to study the coherent dynamics of optically excited electron-hole pairs in semiconductors. Coulomb interaction implies that the optical inter-band transitions are dominated, at least at low temperatures, by excitonic effects. They are further...... and molecular systems are found and studied in the exciton-biexciton system of semiconductors. At densities where strong exciton interactions, or many-body effects, become dominant, the semiconductor Bloch equations present a more rigorous treatment of the phenomena Ultrafast degenerate four-wave mixing is used...

  8. Hydrogen in semiconductors II

    CERN Document Server

    Nickel, Norbert H; Weber, Eicke R; Nickel, Norbert H

    1999-01-01

    Since its inception in 1966, the series of numbered volumes known as Semiconductors and Semimetals has distinguished itself through the careful selection of well-known authors, editors, and contributors. The "Willardson and Beer" Series, as it is widely known, has succeeded in publishing numerous landmark volumes and chapters. Not only did many of these volumes make an impact at the time of their publication, but they continue to be well-cited years after their original release. Recently, Professor Eicke R. Weber of the University of California at Berkeley joined as a co-editor of the series. Professor Weber, a well-known expert in the field of semiconductor materials, will further contribute to continuing the series' tradition of publishing timely, highly relevant, and long-impacting volumes. Some of the recent volumes, such as Hydrogen in Semiconductors, Imperfections in III/V Materials, Epitaxial Microstructures, High-Speed Heterostructure Devices, Oxygen in Silicon, and others promise that this tradition ...

  9. Photoelectronic properties of semiconductors

    CERN Document Server

    Bube, Richard H

    1992-01-01

    The interaction between light and electrons in semiconductors forms the basis for many interesting and practically significant properties. This book examines the fundamental physics underlying this rich complexity of photoelectronic properties of semiconductors, and will familiarise the reader with the relatively simple models that are useful in describing these fundamentals. The basic physics is also illustrated with typical recent examples of experimental data and observations. Following introductory material on the basic concepts, the book moves on to consider a wide range of phenomena, including photoconductivity, recombination effects, photoelectronic methods of defect analysis, photoeffects at grain boundaries, amorphous semiconductors, photovoltaic effects and photoeffects in quantum wells and superlattices. The author is Professor of Materials Science and Electrical Engineering at Stanford University, and has taught this material for many years. He is an experienced author, his earlier books having fo...

  10. Superconductivity in doped semiconductors

    Energy Technology Data Exchange (ETDEWEB)

    Bustarret, E., E-mail: Etienne.bustarret@neel.cnrs.fr

    2015-07-15

    A historical survey of the main normal and superconducting state properties of several semiconductors doped into superconductivity is proposed. This class of materials includes selenides, tellurides, oxides and column-IV semiconductors. Most of the experimental data point to a weak coupling pairing mechanism, probably phonon-mediated in the case of diamond, but probably not in the case of strontium titanate, these being the most intensively studied materials over the last decade. Despite promising theoretical predictions based on a conventional mechanism, the occurrence of critical temperatures significantly higher than 10 K has not been yet verified. However, the class provides an enticing playground for testing theories and devices alike.

  11. Semiconductor opto-electronics

    CERN Document Server

    Moss, TS; Ellis, B

    1972-01-01

    Semiconductor Opto-Electronics focuses on opto-electronics, covering the basic physical phenomena and device behavior that arise from the interaction between electromagnetic radiation and electrons in a solid. The first nine chapters of this book are devoted to theoretical topics, discussing the interaction of electromagnetic waves with solids, dispersion theory and absorption processes, magneto-optical effects, and non-linear phenomena. Theories of photo-effects and photo-detectors are treated in detail, including the theories of radiation generation and the behavior of semiconductor lasers a

  12. Ternary chalcopyrite semiconductors

    CERN Document Server

    Shay, J L; Pamplin, B R

    2013-01-01

    Ternary Chalcopyrite Semiconductors: Growth, Electronic Properties, and Applications covers the developments of work in the I-III-VI2 and II-IV-V2 ternary chalcopyrite compounds. This book is composed of eight chapters that focus on the crystal growth, characterization, and applications of these compounds to optical communications systems. After briefly dealing with the status of ternary chalcopyrite compounds, this book goes on describing the crystal growth of II-IV-V2 and I-III-VI2 single crystals. Chapters 3 and 4 examine the energy band structure of these semiconductor compounds, illustrat

  13. Compound semiconductor device physics

    CERN Document Server

    Tiwari, Sandip

    2013-01-01

    This book provides one of the most rigorous treatments of compound semiconductor device physics yet published. A complete understanding of modern devices requires a working knowledge of low-dimensional physics, the use of statistical methods, and the use of one-, two-, and three-dimensional analytical and numerical analysis techniques. With its systematic and detailed**discussion of these topics, this book is ideal for both the researcher and the student. Although the emphasis of this text is on compound semiconductor devices, many of the principles discussed will also be useful to those inter

  14. Introductory semiconductor device physics

    CERN Document Server

    Parker, Greg

    2004-01-01

    ATOMS AND BONDINGThe Periodic TableIonic BondingCovalent BondingMetallic bondingvan der Waals BondingStart a DatabaseENERGY BANDS AND EFFECTIVE MASSSemiconductors, Insulators and MetalsSemiconductorsInsulatorsMetalsThe Concept of Effective MassCARRIER CONCENTRATIONS IN SEMICONDUCTORSDonors and AcceptorsFermi-LevelCarrier Concentration EquationsDonors and Acceptors Both PresentCONDUCTION IN SEMICONDUCTORSCarrier DriftCarrier MobilitySaturated Drift VelocityMobility Variation with TemperatureA Derivation of Ohm's LawDrift Current EquationsSemiconductor Band Diagrams with an Electric Field Presen

  15. X-ray fluorescence (conventional and 3D) and scanning electron microscopy for the investigation of Portuguese polychrome glazed ceramics: Advances in the knowledge of the manufacturing techniques

    Energy Technology Data Exchange (ETDEWEB)

    Guilherme, A. [Departamento de Fisica da Faculdade de Ciencias, Centro de Fisica Atomica da Universidade de Lisboa, Av. Prof. Gama Pinto, 2, 1649-003 Lisboa (Portugal); Coroado, J. [Instituto Politecnico Tomar, Dep. Arte Conservacao and Restauro, P-2300313 Tomar (Portugal); Santos, J.M.F. dos [GIAN, Departamento de Fisica, Universidade de Coimbra, 3004-516 Coimbra (Portugal); Luehl, L.; Wolff, T.; Kanngiesser, B. [Institut fuer Optik und Atomare Physik, Technische Universitaet Berlin, Hardenbergstr. 36 D-10623 Berlin (Germany); Carvalho, M.L., E-mail: luisa@cii.fc.ul.pt [Departamento de Fisica da Faculdade de Ciencias, Centro de Fisica Atomica da Universidade de Lisboa, Av. Prof. Gama Pinto, 2, 1649-003 Lisboa (Portugal)

    2011-05-15

    This work shows the first analytical results obtained by X-Ray Fluorescence (XRF) (conventional and 3D) and Scanning Electron Microscopy with Energy Dispersive System (SEM-EDS) on original Portuguese ceramic pieces produced between the 16th and 18th centuries in Coimbra and Lisbon. Experts distinguished these productions based only on the color, texture and brightness, which originates mislabeling in some cases. Thanks to lateral and spatial resolution in the micrometer regime, the results obtained with {mu}-XRF were essential in determining the glaze and pigment thicknesses by monitoring the profile of the most abundant element in each 'layer'. Furthermore, the dissemination of these elements throughout the glaze is different depending on the glaze composition, firing temperature and on the pigment itself. Hence, the crucial point of this investigation was to analyze and understand the interfaces color/glaze and glaze/ceramic support. Together with the XRF results, images captured by SEM and the corresponding semi-quantitative EDS data revealed different manufacturing processes used by the two production centers. Different capture modes were suitable to distinguish different crystals from the minerals that confer the color of the pigments used and to enhance the fact that some of them are very well spread through the glassy matrix, sustaining the theory of an evolved and careful procedure in the manufacturing process of the glaze.

  16. Tunable radiation emitting semiconductor device

    NARCIS (Netherlands)

    2009-01-01

    A tunable radiation emitting semiconductor device includes at least one elongated structure at least partially fabricated from one or more semiconductor materials exhibiting a bandgap characteristic including one or more energy transitions whose energies correspond to photon energies of light

  17. Physical principles of semiconductor detectors

    International Nuclear Information System (INIS)

    Micek, S.L.

    1979-01-01

    The general properties of semiconductors with respect to the possibilities of their use as the ionization radiation detectors are discussed. Some chosen types of semiconductor junctions and their characteristics are briefly presented. There are also discussed the physical phenomena connected with the formation of barriers in various types of semiconductor counters. Finally, the basic properties of three main types of semiconductor detectors are given. (author)

  18. Metal semiconductor contacts and devices

    CERN Document Server

    Cohen, Simon S; Einspruch, Norman G

    1986-01-01

    VLSI Electronics Microstructure Science, Volume 13: Metal-Semiconductor Contacts and Devices presents the physics, technology, and applications of metal-semiconductor barriers in digital integrated circuits. The emphasis is placed on the interplay among the theory, processing, and characterization techniques in the development of practical metal-semiconductor contacts and devices.This volume contains chapters that are devoted to the discussion of the physics of metal-semiconductor interfaces and its basic phenomena; fabrication procedures; and interface characterization techniques, particularl

  19. Handbook of luminescent semiconductor materials

    CERN Document Server

    Bergman, Leah

    2011-01-01

    Photoluminescence spectroscopy is an important approach for examining the optical interactions in semiconductors and optical devices with the goal of gaining insight into material properties. With contributions from researchers at the forefront of this field, Handbook of Luminescent Semiconductor Materials explores the use of this technique to study semiconductor materials in a variety of applications, including solid-state lighting, solar energy conversion, optical devices, and biological imaging. After introducing basic semiconductor theory and photoluminescence principles, the book focuses

  20. Green Manufacturing

    Energy Technology Data Exchange (ETDEWEB)

    Patten, John

    2013-12-31

    Green Manufacturing Initiative (GMI): The initiative provides a conduit between the university and industry to facilitate cooperative research programs of mutual interest to support green (sustainable) goals and efforts. In addition to the operational savings that greener practices can bring, emerging market demands and governmental regulations are making the move to sustainable manufacturing a necessity for success. The funding supports collaborative activities among universities such as the University of Michigan, Michigan State University and Purdue University and among 40 companies to enhance economic and workforce development and provide the potential of technology transfer. WMU participants in the GMI activities included 20 faculty, over 25 students and many staff from across the College of Engineering and Applied Sciences; the College of Arts and Sciences' departments of Chemistry, Physics, Biology and Geology; the College of Business; the Environmental Research Institute; and the Environmental Studies Program. Many outside organizations also contribute to the GMI's success, including Southwest Michigan First; The Right Place of Grand Rapids, MI; Michigan Department of Environmental Quality; the Michigan Department of Energy, Labor and Economic Growth; and the Michigan Manufacturers Technical Center.

  1. Nanoscale chirality in metal and semiconductor nanoparticles.

    Science.gov (United States)

    Kumar, Jatish; Thomas, K George; Liz-Marzán, Luis M

    2016-10-18

    The field of chirality has recently seen a rejuvenation due to the observation of chirality in inorganic nanomaterials. The advancements in understanding the origin of nanoscale chirality and the potential applications of chiroptical nanomaterials in the areas of optics, catalysis and biosensing, among others, have opened up new avenues toward new concepts and design of novel materials. In this article, we review the concept of nanoscale chirality in metal nanoclusters and semiconductor quantum dots, then focus on recent experimental and theoretical advances in chiral metal nanoparticles and plasmonic chirality. Selected examples of potential applications and an outlook on the research on chiral nanomaterials are additionally provided.

  2. Depletion field focusing in semiconductors

    NARCIS (Netherlands)

    Prins, M.W.J.; Gelder, Van A.P.

    1996-01-01

    We calculate the three-dimensional depletion field profile in a semiconductor, for a planar semiconductor material with a spatially varying potential upon the surface, and for a tip-shaped semiconductor with a constant surface potential. The nonuniform electric field gives rise to focusing or

  3. Nonlinear Elasticity of Doped Semiconductors

    Science.gov (United States)

    2017-02-01

    AFRL-RY-WP-TR-2016-0206 NONLINEAR ELASTICITY OF DOPED SEMICONDUCTORS Mark Dykman and Kirill Moskovtsev Michigan State University...2016 4. TITLE AND SUBTITLE NONLINEAR ELASTICITY OF DOPED SEMICONDUCTORS 5a. CONTRACT NUMBER FA8650-16-1-7600 5b. GRANT NUMBER 5c. PROGRAM...vibration amplitude. 15. SUBJECT TERMS semiconductors , microresonators, microelectromechanical 16. SECURITY CLASSIFICATION OF: 17. LIMITATION OF

  4. Toward New-Generation Intelligent Manufacturing

    Directory of Open Access Journals (Sweden)

    Ji Zhou

    2018-02-01

    Full Text Available Intelligent manufacturing is a general concept that is under continuous development. It can be categorized into three basic paradigms: digital manufacturing, digital-networked manufacturing, and new-generation intelligent manufacturing. New-generation intelligent manufacturing represents an in-depth integration of new-generation artificial intelligence (AI technology and advanced manufacturing technology. It runs through every link in the full life-cycle of design, production, product, and service. The concept also relates to the optimization and integration of corresponding systems; the continuous improvement of enterprises’ product quality, performance, and service levels; and reduction in resources consumption. New-generation intelligent manufacturing acts as the core driving force of the new industrial revolution and will continue to be the main pathway for the transformation and upgrading of the manufacturing industry in the decades to come. Human-cyber-physical systems (HCPSs reveal the technological mechanisms of new-generation intelligent manufacturing and can effectively guide related theoretical research and engineering practice. Given the sequential development, cross interaction, and iterative upgrading characteristics of the three basic paradigms of intelligent manufacturing, a technology roadmap for “parallel promotion and integrated development” should be developed in order to drive forward the intelligent transformation of the manufacturing industry in China. Keywords: Advanced manufacturing, New-generation intelligent manufacturing, Human-cyber-physical system, New-generation AI, Basic paradigms, Parallel promotion, Integrated development

  5. Semi-conductor rectifiers

    International Nuclear Information System (INIS)

    1981-01-01

    A method is described for treating a semiconductor rectifier, comprising: heating the rectifier to a temperature in the range of 100 0 C to 500 0 C, irradiating the rectifier while maintaining its temperature within the said range, and then annealing the rectifier at a temperature of between 280 0 C and 350 0 C for between two and ten hours. (author)

  6. Semiconductor detector physics

    International Nuclear Information System (INIS)

    Equer, B.

    1987-01-01

    Comprehension of semiconductor detectors follows comprehension of some elements of solid state physics. They are recalled here, limited to the necessary physical principles, that is to say the conductivity. P-n and MIS junctions are discussed in view of their use in detection. Material and structure (MOS, p-n, multilayer, ..) are also reviewed [fr

  7. 33rd International Conference on the Physics of Semiconductors

    International Nuclear Information System (INIS)

    2017-01-01

    Preface to the Proceedings of the 33rd International Conference on the Physics of Semiconductors, Beijing, 2016 Shaoyun Huang 1 , Yingjie Xing 1 , Yang Ji 2 , Dapeng Yu 3 , and Hongqi Xu 1 1 Beijing Key Laboratory of Quantum Devices, Key Laboratory for the Physics and Chemistry of Nanodevices and Department of Electronics, Peking University, Beijing 100871, China 2 SKLSM, Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083, China 3 State Key Laboratory for Mesoscopic Physics, Department of Physics, Peking University, Beijing 100871, China From July 31 st to August 5 th , 2016, the 33rd International Conference on the Physics of Semiconductors (ICPS 2016) was held in Beijing, China, with a great success. The International Conference on the Physics of Semiconductors began in the 1950’s and is a premier biennial meeting for reporting all aspects of semiconductor physics including electronic, structural, optical, magnetic and transport properties. Reflecting the state of the art developments in semiconductor physics, ICPS 2016 served as an international forum for scholars, researchers, and specialists across the globe to discuss future research directions and technological advancements. The main topics of ICPS 2016 included: • Material growth, structural properties and characterization, phonons • Wide-bandgap semiconductors • Narrow-bandgap semiconductors • Carbon: nanotubes and graphene • 2D Materials beyond graphene • Organic semiconductors • Topological states of matter, topological Insulators and Weyl semimetals • Transport in heterostructures • Quantum Hall effects • Spintronics and spin phenomena • Electron devices and applications • Optical properties, optoelectronics, solar cells • Quantum optics, nanophotonics • Quantum information • Other topics in semiconductor physics and devices • Special topic: Majorana fermions in solid state (paper)

  8. Automated defect spatial signature analysis for semiconductor manufacturing process

    Science.gov (United States)

    Tobin, Jr., Kenneth W.; Gleason, Shaun S.; Karnowski, Thomas P.; Sari-Sarraf, Hamed

    1999-01-01

    An apparatus and method for performing automated defect spatial signature alysis on a data set representing defect coordinates and wafer processing information includes categorizing data from the data set into a plurality of high level categories, classifying the categorized data contained in each high level category into user-labeled signature events, and correlating the categorized, classified signature events to a present or incipient anomalous process condition.

  9. 32nd International Conference on the Physics of Semiconductors

    Energy Technology Data Exchange (ETDEWEB)

    Chelikowsky, James [Univ. of Texas, Austin, TX (United States)

    2016-10-17

    The International Conference on the Physics of Semiconductors (ICPS) continues a series of biennial conferences that began in the 1950's. ICPS is the premier meeting for reporting all aspects of semiconductor physics including electronic, structural, optical, magnetic and transport properties with an emphasis on new materials and their applications. The meeting will reflect the state of art in the semiconductor physics field and will serve as a forum where scholars, researchers, and specialists can interact to discuss future research directions and technological advancements. The conference typically draws 1,000 international physicists, scientists, and students. This is one of the largest science meetings on semiconductors and related materials to be held in the United States.

  10. Spectroscopy of organic semiconductors from first principles

    Science.gov (United States)

    Sharifzadeh, Sahar; Biller, Ariel; Kronik, Leeor; Neaton, Jeffery

    2011-03-01

    Advances in organic optoelectronic materials rely on an accurate understanding their spectroscopy, motivating the development of predictive theoretical methods that accurately describe the excited states of organic semiconductors. In this work, we use density functional theory and many-body perturbation theory (GW/BSE) to compute the electronic and optical properties of two well-studied organic semiconductors, pentacene and PTCDA. We carefully compare our calculations of the bulk density of states with available photoemission spectra, accounting for the role of finite temperature and surface effects in experiment, and examining the influence of our main approximations -- e.g. the GW starting point and the application of the generalized plasmon-pole model -- on the predicted electronic structure. Moreover, our predictions for the nature of the exciton and its binding energy are discussed and compared against optical absorption data. We acknowledge DOE, NSF, and BASF for financial support and NERSC for computational resources.

  11. Semiconductor physics an introduction

    CERN Document Server

    Seeger, Karlheinz

    1999-01-01

    Semiconductor Physics - An Introduction - is suitable for the senior undergraduate or new graduate student majoring in electrical engineering or physics. It will also be useful to solid-state scientists and device engineers involved in semiconductor design and technology. The text provides a lucid account of charge transport, energy transport and optical processes, and a detailed description of many devices. It includes sections on superlattices and quantum well structures, the effects of deep-level impurities on transport, the quantum Hall effect and the calculation of the influence of a magnetic field on the carrier distribution function. This 6th edition has been revised and corrected, and new sections have been added to different chapters.

  12. Three dimensional strained semiconductors

    Science.gov (United States)

    Voss, Lars; Conway, Adam; Nikolic, Rebecca J.; Leao, Cedric Rocha; Shao, Qinghui

    2016-11-08

    In one embodiment, an apparatus includes a three dimensional structure comprising a semiconductor material, and at least one thin film in contact with at least one exterior surface of the three dimensional structure for inducing a strain in the structure, the thin film being characterized as providing at least one of: an induced strain of at least 0.05%, and an induced strain in at least 5% of a volume of the three dimensional structure. In another embodiment, a method includes forming a three dimensional structure comprising a semiconductor material, and depositing at least one thin film on at least one surface of the three dimensional structure for inducing a strain in the structure, the thin film being characterized as providing at least one of: an induced strain of at least 0.05%, and an induced strain in at least 5% of a volume of the structure.

  13. Compound semiconductor device modelling

    CERN Document Server

    Miles, Robert

    1993-01-01

    Compound semiconductor devices form the foundation of solid-state microwave and optoelectronic technologies used in many modern communication systems. In common with their low frequency counterparts, these devices are often represented using equivalent circuit models, but it is often necessary to resort to physical models in order to gain insight into the detailed operation of compound semiconductor devices. Many of the earliest physical models were indeed developed to understand the 'unusual' phenomena which occur at high frequencies. Such was the case with the Gunn and IMPATI diodes, which led to an increased interest in using numerical simulation methods. Contemporary devices often have feature sizes so small that they no longer operate within the familiar traditional framework, and hot electron or even quantum­ mechanical models are required. The need for accurate and efficient models suitable for computer aided design has increased with the demand for a wider range of integrated devices for operation at...

  14. Optically coupled semiconductor device

    Energy Technology Data Exchange (ETDEWEB)

    Kumagaya, Naoki

    1988-11-18

    This invention concerns an optically coupled semiconductor device using the light as input signal and a MOS transistor for the output side in order to control on-off of the output side by the input signal which is insulated from the output. Concerning this sort of element, when a MOS transistor and a load resistance are planned to be accumulated on the same chip, a resistor and control of impurity concentration of the channel, etc. become necessary despite that the only formation of a simple P-N junction is enough, for a solar cell, hence cost reduction thereof cannot be done. In order to remove this defect, this invention offers an optically coupled semiconductor device featuring that two solar cells are connected in reverse parallel between the gate sources of the output MOS transistors and an operational light emitting element is individually set facing a respective solar cell. 4 figs.

  15. Doping of organic semiconductors

    Energy Technology Data Exchange (ETDEWEB)

    Luessem, B.; Riede, M.; Leo, K. [Institut fuer Angewandte Photophysik, TU Dresden (Germany)

    2013-01-15

    The understanding and applications of organic semiconductors have shown remarkable progress in recent years. This material class has been developed from being a lab curiosity to the basis of first successful products as small organic LED (OLED) displays; other areas of application such as OLED lighting and organic photovoltaics are on the verge of broad commercialization. Organic semiconductors are superior to inorganic ones for low-cost and large-area optoelectronics due to their flexibility, easy deposition, and broad variety, making tailor-made materials possible. However, electrical doping of organic semiconductors, i.e. the controlled adjustment of Fermi level that has been extremely important to the success of inorganic semiconductors, is still in its infancy. This review will discuss recent work on both fundamental principles and applications of doping, focused primarily to doping of evaporated organic layers with molecular dopants. Recently, both p- and n-type molecular dopants have been developed that lead to efficient and stable doping of organic thin films. Due to doping, the conductivity of the doped layers increases several orders of magnitude and allows for quasi-Ohmic contacts between organic layers and metal electrodes. Besides reducing voltage losses, doping thus also gives design freedom in terms of transport layer thickness and electrode choice. The use of doping in applications like OLEDs and organic solar cells is highlighted in this review. Overall, controlled molecular doping can be considered as key enabling technology for many different organic device types that can lead to significant improvements in efficiencies and lifetimes. (Copyright copyright 2013 WILEY-VCH Verlag GmbH and Co. KGaA, Weinheim)

  16. Images through semiconductors

    International Nuclear Information System (INIS)

    Anon.

    1986-01-01

    Improved image processing techniques are constantly being developed for television and for scanners using X-rays or other radiation for industrial or medical applications, etc. As Erik Heijne of CERN explains here, particle physics too has its own special requirements for image processing. The increasing use of semiconductor techniques for handling measurements down to the level of a few microns provides another example of the close interplay between scientific research and technological development. (orig.).

  17. Muonium states in semiconductors

    International Nuclear Information System (INIS)

    Patterson, B.D.

    1987-01-01

    There is a brief summary of what is known about the muonium states isotropic, anisotropic and diamagnetic in diamond and zincblende semiconductors. The report deals with muonium spectroscopy, including the formation probabilities, hyperfine parameters and electronic g-factors of the states. The dynamics of the states is treated including a discussion of the transition from isotropic Mu to anisotropic Mu in diamond, temperature-dependent linewidthes in silicon and germanium and effects of daping and radiation damage

  18. Nonradiative recombination in semiconductors

    CERN Document Server

    Abakumov, VN; Yassievich, IN

    1991-01-01

    In recent years, great progress has been made in the understandingof recombination processes controlling the number of excessfree carriers in semiconductors under nonequilibrium conditions. As a result, it is now possible to give a comprehensivetheoretical description of these processes. The authors haveselected a number of experimental results which elucidate theunderlying physical problems and enable a test of theoreticalmodels. The following topics are dealt with: phenomenological theory ofrecombination, theoretical models of shallow and deep localizedstates, cascade model of carrier captu

  19. Doping of organic semiconductors

    International Nuclear Information System (INIS)

    Luessem, B.; Riede, M.; Leo, K.

    2013-01-01

    The understanding and applications of organic semiconductors have shown remarkable progress in recent years. This material class has been developed from being a lab curiosity to the basis of first successful products as small organic LED (OLED) displays; other areas of application such as OLED lighting and organic photovoltaics are on the verge of broad commercialization. Organic semiconductors are superior to inorganic ones for low-cost and large-area optoelectronics due to their flexibility, easy deposition, and broad variety, making tailor-made materials possible. However, electrical doping of organic semiconductors, i.e. the controlled adjustment of Fermi level that has been extremely important to the success of inorganic semiconductors, is still in its infancy. This review will discuss recent work on both fundamental principles and applications of doping, focused primarily to doping of evaporated organic layers with molecular dopants. Recently, both p- and n-type molecular dopants have been developed that lead to efficient and stable doping of organic thin films. Due to doping, the conductivity of the doped layers increases several orders of magnitude and allows for quasi-Ohmic contacts between organic layers and metal electrodes. Besides reducing voltage losses, doping thus also gives design freedom in terms of transport layer thickness and electrode choice. The use of doping in applications like OLEDs and organic solar cells is highlighted in this review. Overall, controlled molecular doping can be considered as key enabling technology for many different organic device types that can lead to significant improvements in efficiencies and lifetimes. (Copyright copyright 2013 WILEY-VCH Verlag GmbH and Co. KGaA, Weinheim)

  20. Isotopically controlled semiconductors

    Energy Technology Data Exchange (ETDEWEB)

    Haller, Eugene E.

    2006-06-19

    The following article is an edited transcript based on the Turnbull Lecture given by Eugene E. Haller at the 2005 Materials Research Society Fall Meeting in Boston on November 29, 2005. The David Turnbull Lectureship is awarded to recognize the career of a scientist who has made outstanding contributions to understanding materials phenomena and properties through research, writing, and lecturing, as exemplified by the life work of David Turnbull. Haller was named the 2005 David Turnbull Lecturer for his 'pioneering achievements and leadership in establishing the field of isotopically engineered semiconductors; for outstanding contributions to materials growth, doping and diffusion; and for excellence in lecturing, writing, and fostering international collaborations'. The scientific interest, increased availability, and technological promise of highly enriched isotopes have led to a sharp rise in the number of experimental and theoretical studies with isotopically controlled semiconductor crystals. This article reviews results obtained with isotopically controlled semiconductor bulk and thin-film heterostructures. Isotopic composition affects several properties such as phonon energies, band structure, and lattice constant in subtle, but, for their physical understanding, significant ways. Large isotope-related effects are observed for thermal conductivity in local vibrational modes of impurities and after neutron transmutation doping. Spectacularly sharp photoluminescence lines have been observed in ultrapure, isotopically enriched silicon crystals. Isotope multilayer structures are especially well suited for simultaneous self- and dopant-diffusion studies. The absence of any chemical, mechanical, or electrical driving forces makes possible the study of an ideal random-walk problem. Isotopically controlled semiconductors may find applications in quantum computing, nanoscience, and spintronics.